Readout chip for the CMS pixel detector upgrade

Energy Technology Data Exchange (ETDEWEB)

Rossini, Marco, E-mail: marco.rossini@phys.ethz.ch

2014-11-21

For the CMS experiment a new pixel detector is planned for installation during the extended shutdown in winter 2016/2017. Among the changes of the detector modified front end electronics will be used for higher efficiency at peak luminosity of the LHC and faster readout. The first prototype versions of the new readout chip have been designed and produced. The results of qualification and calibration for the new chip are presented in this paper.

Geometry simulation and physics with the CMS forward pixel detector

Energy Technology Data Exchange (ETDEWEB)

Parashar, N [Purdue University Calumet, Hammond, Indiana (United States)], E-mail: Neeti@fnal.gov

2008-06-15

The Forward Pixel Detector of CMS is an integral part of the Tracking system, which will play a key role in addressing the full physics potential of the collected data. It has a very complex geometry that encompasses multilayer structure of its detector modules. This presentation describes the development of geometry simulation for the Forward Pixel Detector. A new geometry package has been developed, which uses the detector description database (DDD) interface for the XML (eXtensive Markup Language) to GEANT simulation. This is necessary for digitization and GEANT4 reconstruction software for tracking. The expected physics performance is also discussed.

Geometry simulation and physics with the CMS forward pixel detector

International Nuclear Information System (INIS)

Parashar, N

2008-01-01

The Forward Pixel Detector of CMS is an integral part of the Tracking system, which will play a key role in addressing the full physics potential of the collected data. It has a very complex geometry that encompasses multilayer structure of its detector modules. This presentation describes the development of geometry simulation for the Forward Pixel Detector. A new geometry package has been developed, which uses the detector description database (DDD) interface for the XML (eXtensive Markup Language) to GEANT simulation. This is necessary for digitization and GEANT4 reconstruction software for tracking. The expected physics performance is also discussed

Operating characteristics of radiation-hardened silicon pixel detectors for the CMS experiment

CERN Document Server

Hyosung, Cho

2002-01-01

The Compact Muon Solenoid (CMS) experiment at the CERN Large Hadron Collider (LHC) will have forward silicon pixel detectors as its innermost tracking device. The pixel devices will be exposed to the harsh radiation environment of the LHC. Prototype silicon pixel detectors have been designed to meet the specification of the CMS experiment. No guard ring is required on the n/sup +/ side, and guard rings on the p/sup +/ side are always kept active before and after type inversion. The whole n/sup +/ side is grounded and connected to readout chips, which greatly simplifies detector assembling and improves the stability of bump-bonded readout chips on the n/sup +/ side. Operating characteristics such as the leakage current, the full depletion voltage, and the potential distributions over guard rings were tested using standard techniques. The tests are discussed in this paper. (9 refs).

Testbeam and laboratory test results of irradiated 3D CMS pixel detectors

Energy Technology Data Exchange (ETDEWEB)

Bubna, Mayur [Purdue University, Department of Physics, West Lafayette, IN 47907-1396 (United States); Purdue University, School of Electrical and Computer Engineering, West Lafayette, IN 47907-1396 (United States); Alagoz, Enver, E-mail: enver.alagoz@cern.ch [Purdue University, Department of Physics, West Lafayette, IN 47907-1396 (United States); Cervantes, Mayra; Krzywda, Alex; Arndt, Kirk [Purdue University, Department of Physics, West Lafayette, IN 47907-1396 (United States); Obertino, Margherita; Solano, Ada [Istituto Nazionale di Fisica Nucleare, Sezione di Torino, 10125 Torino (Italy); Dalla Betta, Gian-Franco [INFN Padova (Gruppo Collegato di Trento) (Italy); Dipartimento di Ingegneria e Scienzadella Informazione, Universitá di Trento, I-38123 Povo di Trento (Italy); Menace, Dario; Moroni, Luigi [Istituto Nazionale di Fisica Nucleare, Sezione di Milano Bicocca (Italy); Universitá degli Studi di Milano Bicocca, 20126 Milano (Italy); Uplegger, Lorenzo; Rivera, Ryan [Fermi National Accelerator Laboratory, Batavia, IL 60510-0500 (United States); Osipenkov, Ilya [Texas A and M University, Department of Physics, College Station, TX 77843-4242 (United States); Andresen, Jeff [Fermi National Accelerator Laboratory, Batavia, IL 60510-0500 (United States); Bolla, Gino; Bortoletto, Daniela [Purdue University, Department of Physics, West Lafayette, IN 47907-1396 (United States); Boscardin, Maurizio [Centro per i Materiali e i Microsistemi Fondazione Bruno Kessler (FBK), Trento, I-38123 Povo di Trento (Italy); Marie Brom, Jean [Strasbourg IPHC, Institut Pluriedisciplinaire Hubert Curien, F-67037 Strasbourg Cedex (France); Brosius, Richard [State University of New York at Buffalo (SUNY), Department of Physics, Buffalo, NY 14260-1500 (United States); Chramowicz, John [Fermi National Accelerator Laboratory, Batavia, IL 60510-0500 (United States); and others

2013-12-21

The CMS silicon pixel detector is the tracking device closest to the LHC p–p collisions, which precisely reconstructs the charged particle trajectories. The planar technology used in the current innermost layer of the pixel detector will reach the design limit for radiation hardness at the end of Phase I upgrade and will need to be replaced before the Phase II upgrade in 2020. Due to its unprecedented performance in harsh radiation environments, 3D silicon technology is under consideration as a possible replacement of planar technology for the High Luminosity-LHC or HL-LHC. 3D silicon detectors are fabricated by the Deep Reactive-Ion-Etching (DRIE) technique which allows p- and n-type electrodes to be processed through the silicon substrate as opposed to being implanted through the silicon surface. The 3D CMS pixel devices presented in this paper were processed at FBK. They were bump bonded to the current CMS pixel readout chip, tested in the laboratory, and testbeams carried out at FNAL with the proton beam of 120 GeV/c. In this paper we present the laboratory and beam test results for the irradiated 3D CMS pixel devices. -- Highlights: •Pre-irradiation and post-irradiation electrical properties of 3D sensors and 3D diodes from various FBK production batches were measured and analyzed. •I–T measurements of gamma irradiated diodes were analyzed to understand leakage current generation mechanism in 3D diodes. •Laboratory measurements: signal to noise ratio and charge collection efficiency of 3D sensors before and after irradiation. •Testbeam measurements: pre- and post-irradiation pixel cell efficiency and position resolution of 3D sensors.

Silicon sensors for the upgrades of the CMS pixel detector

International Nuclear Information System (INIS)

Centis Vignali, Matteo

2015-12-01

The Compact Muon Solenoid (CMS) is a general purpose detector at the Large Hadron Collider (LHC). The LHC luminosity is constantly increased through upgrades of the accelerator and its injection chain. Two major upgrades will take place in the next years. The first upgrade involves the LHC injector chain and allows the collider to achieve a luminosity of about 2.10 34 cm -2 s -1 . A further upgrade of the LHC foreseen for 2025 will boost its luminosity to 5.10 34 cm -2 s -1 . As a consequence of the increased luminosity, the detectors need to be upgraded. In particular, the CMS pixel detector will undergo two upgrades in the next years. The first upgrade (phase I) consists in the substitution of the current pixel detector in winter 2016/2017. The upgraded pixel detector will implement new readout electronics that allow efficient data taking up to a luminosity of 2.10 34 cm -2 s -1 , twice as much as the LHC design luminosity. The modules that will constitute the upgraded detector are being produced at different institutes. Hamburg (University and DESY) is responsible for the production of 350 pixel modules. The second upgrade (phase II) of the pixel detector is foreseen for 2025. The innermost pixel layer of the upgraded detector will accumulate a radiation damage corresponding to an equivalent fluence of Φ eq =2.10 16 cm -2 and a dose of ∼10 MGy after an integrated luminosity of 3000 fb -1 . Several groups are investigating sensor designs and configurations able to withstand such high doses and fluences. This work is divided into two parts related to important aspects of the upgrades of the CMS pixel detector. For the phase I upgrade, a setup has been developed to provide an absolute energy calibration of the pixel modules that will constitute the detector. The calibration is obtained using monochromatic X-rays. The same setup is used to test the buffering capabilities of the modules' readout chip. The maximum rate experienced by the modules produced in

Testing and Integration of the Service Cylinders for the CMS Phase 1 pixel detector

CERN Document Server

Ngadiuba, Jennifer

2016-01-01

The present 3-layer CMS pixel detector will be replaced with a new 4-layer pixel system, referred to as Phase~1 upgrade, during the LHC extended technical stop in winter 2016/2017. The upgraded detector will allow to maintain the excellent tracking performance of CMS at the upcoming higher luminosity conditions at the LHC. The addition of an extra layer, closer to the beam pipe, demands a complete redesign of its services. The barrel pixel detector is attached to four half cylinders which carry the services along the beam pipe, accommodate the cooling lines and house the electronics for detector readout and control. The service cylinders are a complex system in design as well as in production due to the large number of channels and tight space requirements. In this document we present the design of the system and discuss the construction and testing of the service cylinders for the barrel pixel detector. Furthermore, we present results of the testing and calibrations carried out with a set of new digital dete...

Module Production and Qualification for the Phase I Upgrade of the CMS Pixel Detector

CERN Document Server

AUTHOR|(CDS)2086689

2015-01-01

After consolidation of the LHC in 2013/14 its centre-of-mass energy will increase to 13TeV and the luminosity will reach $2 \\cdot 10^{34}\\, \\textnormal{cm}^{-2} \\textnormal{s}^{-1}$, which is twice the design luminosity. The latter will result in more simultaneous particle collisions, which would significantly increase the dead time of the current readout chip of the CMS pixel detector. Therefore the entire CMS pixel detector is replaced in 2016/17 and a new digital readout with larger buffers will be used to handle increasing pixel hit rates. An additional fourth barrel-layer provides more space points to improve track reconstruction. Half of the required modules for layer four is being produced at Karlsruhe Institute of Technology (KIT). This poster deals with the smallest discrete subunit of the pixel detector, the module and its assembly process. Moreover first production experience will be shown.

Construction and commissioning of the Phase 1 upgrade of the CMS pixel detector

CERN Document Server

Bartek, Rachel

2017-01-01

The Phase 1 upgrade of the CMS pixel detector, installed by the CMS collaboration during the recent extended end-of-year technical stop, is built out of four barrel layers (BPIX) and three forward disks in each endcap (FPIX). It comprises a total of 124M pixel channels, in 1,856 modules and it is designed to withstand instantaneous luminosities of up to $2 \\rm{x} 10^{34} \\rm{cm}^{-2} \\rm{s}^{-1}$ with increased detector acceptance and additional redundancy for the tracking, while at the same time reducing the material budget. These goals are achieved using a new readout chip and modified powering and readout schemes, one additional tracking layer both in the barrel and in the disks, and new detector supports including a $\\rm{CO}_2$ based evaporative cooling system. Different parts of the detector have been assembled over the last year and later brought to CERN for installation inside the CMS tracker. At various stages during the assembly tests have been performed to ensure that the readout and power electro...

Test Beam Performance Measurements for the Phase I Upgrade of the CMS Pixel Detector

CERN Document Server

Dragicevic, M.; Hrubec, J.; Steininger, H.; Gädda, A.; Härkönen, J.; Lampén, T.; Luukka, P.; Peltola, T.; Tuominen, E.; Tuovinen, E.; Winkler, A.; Eerola, P.; Tuuva, T.; Baulieu, G.; Boudoul, G.; Caponetto, L.; Combaret, C.; Contardo, D.; Dupasquier, T.; Gallbit, G.; Lumb, N.; Mirabito, L.; Perries, S.; Donckt, M.Vander; Viret, S.; Bonnin, C.; Charles, L.; Gross, L.; Hosselet, J.; Tromson, D.; Feld, L.; Karpinski, W.; Klein, K.; Lipinski, M.; Pierschel, G.; Preuten, M.; Rauch, M.; Wlochal, M.; Aldaya, M.; Asawatangtrakuldee, C.; Beernaert, K.; Bertsche, D.; Contreras-Campana, C.; Eckerlin, G.; Eckstein, D.; Eichhorn, T.; Gallo, E.; Garcia, J.Garay; Hansen, K.; Haranko, M.; Harb, A.; Hauk, J.; Keaveney, J.; Kalogeropoulos, A.; Kleinwort, C.; Lohmann, W.; Mankel, R.; Maser, H.; Mittag, G.; Muhl, C.; Mussgiller, A.; Pitzl, D.; Reichelt, O.; Savitskyi, M.; Schütze, P.; Sola, V.; Spannagel, S.; Walsh, R.; Zuber, A.; Biskop, H.; Buhmann, P.; Centis-Vignali, M.; Garutti, E.; Haller, J.; Hoffmann, M.; Klanner, R.; Lapsien, T.; Matysek, M.; Perieanu, A.; Scharf, Ch.; Schleper, P.; Schmidt, A.; Schwandt, J.; Sonneveld, J.; Steinbrück, G.; Vormwald, B.; Wellhausen, J.; Abbas, M.; Amstutz, C.; Barvich, T.; Barth, Ch.; Boegelspacher, F.; Boer, W.De; Butz, E.; Casele, M.; Colombo, F.; Dierlamm, A.; Freund, B.; Hartmann, F.; Heindl, S.; Husemann, U.; Kornmeyer, A.; Kudella, S.; Muller, Th.; Simonis, H.J.; Steck, P.; Weber, M.; Weiler, Th.; Kiss, T.; Siklér, F.; Tölyhi, T.; Veszprémi, V.; Cariola, P.; Creanza, D.; Palma, M.De; Robertis, G.De; Fiore, L.; Franco, M.; Loddo, F.; Sala, G.; Silvestris, L.; Maggi, G.; My, S.; Selvaggi, G.; Albergo, S.; Cappello, G.; Costa, S.; Mattia, A.Di; Giordano, F.; Potenza, R.; Saizu, M.A.; Tricomi, A.; Tuve, C.; Focardi, E.; Dinardo, M.E.; Fiorendi, S.; Gennai, S.; Malvezzi, S.; Manzoni, R.A.; Menasce, D.; Moroni, L.; Pedrini, D.; Azzi, P.; Bacchetta, N.; Bisello, D.; Dall'Osso, M.; Pozzobon, N.; Tosi, M.; Solestizi, L.Alunni; Biasini, M.; Bilei, G.M.; Cecchi, C.; Checcucci, B.; Ciangottini, D.; Fanò, L.; Gentsos, C.; Ionica, M.; Leonardi, R.; Manoni, E.; Mantovani, G.; Marconi, S.; Mariani, V.; Menichelli, M.; Modak, A.; Morozzi, A.; Moscatelli, F.; Passeri, D.; Placidi, P.; Postolache, V.; Rossi, A.; Saha, A.; Santocchia, A.; Storchi, L.; Spiga, D.; Androsov, K.; Azzurri, P.; Bagliesi, G.; Basti, A.; Boccali, T.; Borrello, L.; Bosi, F.; Castaldi, R.; Ceccanti, M.; Ciocci, M.A.; Dell'Orso, R.; Donato, S.; Fedi, G.; Giassi, A.; Grippo, M.T.; Ligabue, F.; Magazzu, G.; Mammini, P.; Mariani, F.; Mazzoni, E.; Messineo, A.; Moggi, A.; Morsani, F.; Palla, F.; Palmonari, F.; Profeti, A.; Raffaelli, F.; Ragonesi, A.; Rizzi, A.; Soldani, A.; Spagnolo, P.; Tenchini, R.; Tonelli, G.; Venturi, A.; Verdini, P.G.; Abbaneo, D.; Ahmed, I.; Albert, E.; Auzinger, G.; Berruti, G.; Bonnaud, J.; Daguin, J.; D'Auria, A.; Detraz, S.; Dondelewski, O.; Engegaard, B.; Faccio, F.; Frank, N.; Gill, K.; Honma, A.; Kornmayer, A.; Labaza, A.; Manolescu, F.; McGill, I.; Mersi, S.; Michelis, S.; Onnela, A.; Ostrega, M.; Pavis, S.; Peisert, A.; Pernot, J.F.; Petagna, P.; Postema, H.; Rapacz, K.; Sigaud, C.; Tropea, P.; Troska, J.; Tsirou, A.; Vasey, F.; Verlaat, B.; Vichoudis, P.; Zwalinski, L.; Bachmair, F.; Becker, R.; di Calafiori, D.; Casal, B.; Berger, P.; Djambazov, L.; Donega, M.; Grab, C.; Hits, D.; Hoss, J.; Kasieczka, G.; Lustermann, W.; Mangano, B.; Marionneau, M.; Arbol, P.Martinez Ruiz del; Masciovecchio, M.; Meinhard, M.; Perozzi, L.; Roeser, U.; Starodumov, A.; Tavolaro, V.; Wallny, R.; Zhu, D.; Amsler, C.; Bösiger, K.; Caminada, L.; Canelli, F.; Chiochia, V.; de Cosa, A.; Galloni, C.; Hreus, T.; Kilminster, B.; Lange, C.; Maier, R.; Ngadiuba, J.; Pinna, D.; Robmann, P.; Taroni, S.; Yang, Y.; Bertl, W.; Deiters, K.; Erdmann, W.; Horisberger, R.; Kaestli, H.C.; Kotlinski, D.; Langenegger, U.; Meier, B.; Rohe, T.; Streuli, S.; Chen, P.H.; Dietz, C.; Fiori, F.; Grundler, U.; Hou, W.S.; Lu, R.S.; Moya, M.; Tsai, J.F.; Tzeng, Y.M.; Cussans, D.; Goldstein, J.; Grimes, M.; Newbold, D.; Hobson, P.; Reid, I.D.; Auzinger, G.; Bainbridge, R.; Dauncey, P.; Hall, G.; James, T.; Magnan, A.M.; Pesaresi, M.; Raymond, D.M.; Uchida, K.; Durkin, T.; Harder, K.; Shepherd-Themistocleous, C.; Chertok, M.; Conway, J.; Conway, R.; Flores, C.; Lander, R.; Pellett, D.; Ricci-Tam, F.; Squires, M.; Thomson, J.; Yohay, R.; Burt, K.; Ellison, J.; Hanson, G.; Olmedo, M.; Si, W.; Yates, B.R.; Dominguez, A.; Bartek, R.; Bentele, B.; Cumalat, J.P.; Ford, W.T.; Jensen, F.; Johnson, A.; Krohn, M.; Leontsinis, S.; Mulholland, T.; Stenson, K.; Wagner, S.R.; Apresyan, A.; Bolla, G.; Burkett, K.; Butler, J.N.; Canepa, A.; Cheung, H.W.K.; Christian, D.; Cooper, W.E.; Deptuch, G.; Derylo, G.; Gingu, C.; Grünendahl, S.; Hasegawa, S.; Hoff, J.; Howell, J.; Hrycyk, M.; Jindariani, S.; Johnson, M.; Kahlid, F.; Kwan, S.; Lei, C.M.; Lipton, R.; Sá, R.Lopes De; Liu, T.; Los, S.; Matulik, M.; Merkel, P.; Nahn, S.; Prosser, A.; Rivera, R.; Schneider, B.; Sellberg, G.; Shenai, A.; Siehl, K.; Spiegel, L.; Tran, N.; Uplegger, L.; Voirin, E.; Berry, D.R.; Chen, X.; Ennesser, L.; Evdokimov, A.; Gerber, C.E.; Makauda, S.; Mills, C.; Gonzalez, I.D.Sandoval; Alimena, J.; Antonelli, L.J.; Francis, B.; Hart, A.; Hill, C.S.; Parashar, N.; Stupak, J.; Bortoletto, D.; Bubna, M.; Hinton, N.; Jones, M.; Miller, D.H.; Shi, X.; Baringer, P.; Bean, A.; Khalil, S.; Kropivnitskaya, A.; Majumder, D.; Schmitz, E.; Wilson, G.; Ivanov, A.; Mendis, R.; Mitchell, T.; Skhirtladze, N.; Taylor, R.; Anderson, I.; Fehling, D.; Gritsan, A.; Maksimovic, P.; Martin, C.; Nash, K.; Osherson, M.; Swartz, M.; Xiao, M.; Acosta, J.G.; Cremaldi, L.M.; Oliveros, S.; Perera, L.; Summers, D.; Bloom, K.; Claes, D.R.; Fangmeier, C.; Suarez, R.Gonzalez; Monroy, J.; Siado, J.; Bartz, E.; Gershtein, Y.; Halkiadakis, E.; Kyriacou, S.; Lath, A.; Nash, K.; Osherson, M.; Schnetzer, S.; Stone, R.; Walker, M.; Malik, S.; Norberg, S.; Vargas, J.E.Ramirez; Alyari, M.; Dolen, J.; Godshalk, A.; Harrington, C.; Iashvili, I.; Kharchilava, A.; Nguyen, D.; Parker, A.; Rappoccio, S.; Roozbahani, B.; Alexander, J.; Chaves, J.; Chu, J.; Dittmer, S.; McDermott, K.; Mirman, N.; Rinkevicius, A.; Ryd, A.; Salvati, E.; Skinnari, L.; Soffi, L.; Tao, Z.; Thom, J.; Tucker, J.; Zientek, M.; Akgün, B.; Ecklund, K.M.; Kilpatrick, M.; Nussbaum, T.; Zabel, J.; D'Angelo, P.; Johns, W.; Rose, K.

2017-05-30

A new pixel detector for the CMS experiment is being built, owing to the instantaneous luminosities anticipated for the Phase I Upgrade of the LHC. The new CMS pixel detector provides four-hit tracking while featuring a reduced material budget as well as new cooling and powering schemes. A new front-end readout chip mitigates buffering and bandwidth limitations, and comprises a low-threshold comparator. These upgrades allow the new pixel detector to sustain and improve the efficiency of the current pixel tracker at the increased requirements imposed by high luminosities and pile-up. In this paper, comprehensive test beam studies are presented which have been conducted to verify the design and to quantify the performance of the new detector assemblies in terms of tracking efficiency and spatial resolution. Under optimal conditions, the tracking efficiency has been determined to be ($99.95 \\pm 0.05$) \\%, while the intrinsic spatial resolution has been measured to be ($4.80 \\pm 0.25$) $\\mu$m and ($7.99 \\pm 0.21$...

Qualification of barrel pixel detector modules for the Phase 1 Upgrade of the CMS vertex detector

CERN Document Server

Kudella, Simon

2016-01-01

To withstand the higher particle rates of LHC Runs 2 and 3, with expected luminosities of up to $2\\times 10^{34}\\,\\mathrm{cm^{-2}s^{-1}}$, the current CMS pixel detector at the LHC will be replaced as part of the CMS Phase I Upgrade during the extended winter shutdown in 2016/17. The new pixel detector features a new geometry with one additional detector layer in the barrel region~(BPIX) and one pair of additional disks in the forward region~(FPIX), new digital readout chips as well as a new CO$_{2}$-based cooling system for both the barrel and forward region. The BPIX detector module production is summarized, with special focus on the different stages of quality assurance. The quality tests as well as the calibrations which all produced modules undergo in a temperature and humidity controlled environment are described. Exemplarily, the KIT/Aachen production line and its subprocesses are presented together with its quality and yields.

Deployment of the CMS Tracker AMC as Backend for the CMS Pixel Detector

CERN Document Server

AUTHOR|(CDS)2079000

2016-01-01

The silicon pixel detector of the CMS experiment at CERN will be replaced with an upgraded version at the beginning of 2017 with the new detector featuring an additional barrel- and end-cap layer resulting in an increased number of fully digital read-out links running at 400Mb/s. New versions of the PSI46 Read-Out Chip and Token Bit Manager have been developed to operate at higher rates and reduce data loss. Front-End Controller and Front-End Driver boards, based on the {\\textmu}TCA compatible CMS Tracker AMC, a variant of the FC7 card, are being developed using different mezzanines to host the optical links for the digital read-out and control system. An overview of the system architecture is presented, with details on the implementation, and first results obtained from test systems.

arXiv Performance verification of the CMS Phase-1 Upgrade Pixel detector

CERN Document Server

Veszpremi, Viktor

2017-12-04

The CMS tracker consists of two tracking systems utilizing semiconductor technology: the inner pixel and the outer strip detectors. The tracker detectors occupy the volume around the beam interaction region between 3 cm and 110 cm in radius and up to 280 cm along the beam axis. The pixel detector consists of 124 million pixels, corresponding to about 2 m 2 total area. It plays a vital role in the seeding of the track reconstruction algorithms and in the reconstruction of primary interactions and secondary decay vertices. It is surrounded by the strip tracker with 10 million read-out channels, corresponding to 200 m 2 total area. The tracker is operated in a high-occupancy and high-radiation environment established by particle collisions in the LHC . The current strip detector continues to perform very well. The pixel detector that has been used in Run 1 and in the first half of Run 2 was, however, replaced with the so-called Phase-1 Upgrade detector. The new system is better suited to match the increased inst...

Performance and track-based alignment of the Phase-1 upgraded CMS pixel detector

CERN Document Server

Botta, Valeria

2017-01-01

The Compact Muon Solenoid (CMS) detector is a multi-purpose detector constructed in order to study high-energy particle collisions at the Large Hadron Collider (LHC) at CERN. The all-silicon design of the tracking system of the CMS experiment provided excellent resolution for charged tracks and an efficient tagging of jets during Run 1 and Run 2 of the LHC. After the pixel detector of the CMS experiment was upgraded and installed during the shutdown in the beginning of 2017, the positions and orientations of the tracker modules needed to be determined with a precision of several micrometers. The alignment also needs to be quickly recalculated each time the state of the CMS magnet is changed between 0 T and 3.8 T. The latest results of the CMS tracker performance in the 2017 run are presented, with a special focus on alignment and resolution performance using several million reconstructed tracks from cosmic rays and collision data.

CMS Pixel Detector Upgrade

CERN Document Server

INSPIRE-00038772

2011-01-01

The present Compact Muon Solenoid silicon pixel tracking system has been designed for a peak luminosity of 1034cm-2s-1 and total dose corresponding to two years of the Large Hadron Collider (LHC) operation. With the steady increase of the luminosity expected at the LHC, a new pixel detector with four barrel layers and three endcap disks is being designed. We will present the key points of the design: the new geometry, which minimizes the material budget and increases the tracking points, and the development of a fast digital readout architecture, which ensures readout efficiency even at high rate. The expected performances for tracking and vertexing of the new pixel detector are also addressed.

Planar sensors for the upgrade of the CMS pixel detector

International Nuclear Information System (INIS)

Rohe, T.; Bean, A.; Radicci, V.; Sibille, J.

2011-01-01

A replacement of the present CMS pixel detector with a better performing light weight four-layer system is foreseen in 2016. In the lifetime of this new system the LHC will reach and exceed its nominal luminosity of 10 34 cm -2 s -1 . Therefore the radiation hardness of all parts of the pixel system has to be reviewed. For the construction of the much larger four-layer pixel system, the replacement of the present double sided sensors by much cheaper single sided ones is considered. However, the construction of pixel modules with such sensors is challenging due to the small geometrical distance of the sensor high voltage and the ground of the readout electronics. This small distance limits the sensor bias to about 500 V in the tested samples.

Design, simulation, fabrication, and preliminary tests of 3D CMS pixel detectors for the super-LHC

Energy Technology Data Exchange (ETDEWEB)

Koybasi, Ozhan; /Purdue U.; Bortoletto, Daniela; /Purdue U.; Hansen, Thor-Erik; /SINTEF, Oslo; Kok, Angela; /SINTEF, Oslo; Hansen, Trond Andreas; /SINTEF, Oslo; Lietaer, Nicolas; /SINTEF, Oslo; Jensen, Geir Uri; /SINTEF, Oslo; Summanwar, Anand; /SINTEF, Oslo; Bolla, Gino; /Purdue U.; Kwan, Simon Wing Lok; /Fermilab

2010-01-01

The Super-LHC upgrade puts strong demands on the radiation hardness of the innermost tracking detectors of the CMS, which cannot be fulfilled with any conventional planar detector design. The so-called 3D detector architectures, which feature columnar electrodes passing through the substrate thickness, are under investigation as a potential solution for the closest operation points to the beams, where the radiation fluence is estimated to reach 10{sup 16} n{sub eq}/cm{sup 2}. Two different 3D detector designs with CMS pixel readout electronics are being developed and evaluated for their advantages and drawbacks. The fabrication of full-3D active edge CMS pixel devices with p-type substrate has been successfully completed at SINTEF. In this paper, we study the expected post-irradiation behaviors of these devices with simulations and, after a brief description of their fabrication, we report the first leakage current measurement results as performed on wafer.

Testing, installation and development of hardware and software components for the forward pixel detector of CMS

CERN Document Server

Florez Bustos, Carlos Andres

2007-01-01

The LHC (Large Hadron Collider) will be the particle accelerator with the highest collision energy ever. CMS (Compact Muon Solenoid) is one of the two largest experiments at the LHC. A main goal of CMS is to elucidate the electroweak symmetry breaking and determine if the Higgs mechanism is responsible for it. The pixel detector in CMS is the closest detector to the interaction point and is part of the tracker system. This thesis presents four different projects related to the forward pixel detector, performed as part of the testing and development of its hardware and software components. It presents the methods, implementation and results for the data acquisition and installation of the detector control system at the Meson Test Beam Facility of Fermilab for the beam test of the detector; the study of the C.A.E.N power supply and the multi service cable; the layout of the test stands for the assembly of the half-disk and half-service cylinder and the development of a software interface to the data acquisition...

Performance verification of the CMS Phase-1 Upgrade Pixel detector

Science.gov (United States)

Veszpremi, V.

2017-12-01

The CMS tracker consists of two tracking systems utilizing semiconductor technology: the inner pixel and the outer strip detectors. The tracker detectors occupy the volume around the beam interaction region between 3 cm and 110 cm in radius and up to 280 cm along the beam axis. The pixel detector consists of 124 million pixels, corresponding to about 2 m 2 total area. It plays a vital role in the seeding of the track reconstruction algorithms and in the reconstruction of primary interactions and secondary decay vertices. It is surrounded by the strip tracker with 10 million read-out channels, corresponding to 200 m 2 total area. The tracker is operated in a high-occupancy and high-radiation environment established by particle collisions in the LHC . The current strip detector continues to perform very well. The pixel detector that has been used in Run 1 and in the first half of Run 2 was, however, replaced with the so-called Phase-1 Upgrade detector. The new system is better suited to match the increased instantaneous luminosity the LHC would reach before 2023. It was built to operate at an instantaneous luminosity of around 2×1034 cm-2s-1. The detector's new layout has an additional inner layer with respect to the previous one; it allows for more efficient tracking with smaller fake rate at higher event pile-up. The paper focuses on the first results obtained during the commissioning of the new detector. It also includes challenges faced during the first data taking to reach the optimal measurement efficiency. Details will be given on the performance at high occupancy with respect to observables such as data-rate, hit reconstruction efficiency, and resolution.

Diamond Pixel Detectors

International Nuclear Information System (INIS)

Adam, W.; Berdermann, E.; Bergonzo, P.; Bertuccio, G.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; D'Angelo, P.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Doroshenko, J.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foster, J.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Gobbi, B.; Grim, G.P.; Hallewell, G.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Kass, R.; Koeth, T.; Krammer, M.; Lander, R.; Logiudice, A.; Lu, R.; Lynne, L.M.; Manfredotti, C.; Meier, D.; Mishina, M.; Moroni, L.; Oh, A.; Pan, L.S.; Pernicka, M.; Perera, L.; Pirollo, S.; Plano, R.; Procario, M.; Riester, J.L.; Roe, S.; Rott, C.; Rousseau, L.; Rudge, A.; Russ, J.; Sala, S.; Sampietro, M.; Schnetzer, S.; Sciortino, S.; Stelzer, H.; Stone, R.; Suter, B.; Tapper, R.J.; Tesarek, R.; Trischuk, W.; Tromson, D.; Vittone, E.; Wedenig, R.; Weilhammer, P.; White, C.; Zeuner, W.; Zoeller, M.

2001-01-01

Diamond based pixel detectors are a promising radiation-hard technology for use at the LHC. We present first results on a CMS diamond pixel sensor. With a threshold setting of 2000 electrons, an average pixel efficiency of 78% was obtained for normally incident minimum ionizing particles

Diamond Pixel Detectors

Energy Technology Data Exchange (ETDEWEB)

Adam, W.; Berdermann, E.; Bergonzo, P.; Bertuccio, G.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; D' Angelo, P.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Doroshenko, J.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foster, J.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Gobbi, B.; Grim, G.P.; Hallewell, G.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Kass, R.; Koeth, T.; Krammer, M.; Lander, R.; Logiudice, A.; Lu, R.; Lynne, L.M.; Manfredotti, C.; Meier, D.; Mishina, M.; Moroni, L.; Oh, A.; Pan, L.S.; Pernicka, M.; Perera, L. E-mail: perera@physics.rutgers.edu; Pirollo, S.; Plano, R.; Procario, M.; Riester, J.L.; Roe, S.; Rott, C.; Rousseau, L.; Rudge, A.; Russ, J.; Sala, S.; Sampietro, M.; Schnetzer, S.; Sciortino, S.; Stelzer, H.; Stone, R.; Suter, B.; Tapper, R.J.; Tesarek, R.; Trischuk, W.; Tromson, D.; Vittone, E.; Wedenig, R.; Weilhammer, P.; White, C.; Zeuner, W.; Zoeller, M

2001-06-01

Diamond based pixel detectors are a promising radiation-hard technology for use at the LHC. We present first results on a CMS diamond pixel sensor. With a threshold setting of 2000 electrons, an average pixel efficiency of 78% was obtained for normally incident minimum ionizing particles.

Using the pixel detector for fast triggering in CMS

CERN Document Server

De Mattai, M

2006-01-01

The Standard Model of fundamental interactions (SM) has been extensively tested in many particle experiments during the last 25 years and it has proven to be extremely successful up to the energy scale typical of the weak force. Nevertheless, there is still no experimental evidence of the Higgs boson, one of the key components of the SM, responsible for the breaking of the electroweak symmetry and for the masses of the fermions and of the weak bosons. The Large Hadron Collider (LHC) is scheduled to provide the first proton on proton collision in 2008 at the center of mass energy of 14 Tev, an energy one order of magnitude higher than the regime explored so far. The CMS experiment is an omni-purpose experiment that will operate at the LHC, it will give insight into Standard Model physics and search for physics beyond the Standard Model. In this work we consider the usage of pixel detector information in the reconstruction of hadronic jets in events collected by the CMS detector under high luminosity running co...

Pre- and post-irradiation performance of FBK 3D silicon pixel detectors for CMS

International Nuclear Information System (INIS)

Krzywda, A.; Alagoz, E.; Bubna, M.; Obertino, M.; Solano, A.; Arndt, K.; Uplegger, L.; Betta, G.F. Dalla; Boscardin, M.; Ngadiuba, J.; Rivera, R.; Menasce, D.; Moroni, L.; Terzo, S.; Bortoletto, D.; Prosser, A.; Adreson, J.; Kwan, S.; Osipenkov, I.; Bolla, G.

2014-01-01

In preparation for the tenfold luminosity upgrade of the Large Hadron Collider (the HL-LHC) around 2020, three-dimensional (3D) silicon pixel sensors are being developed as a radiation-hard candidate to replace the planar ones currently being used in the CMS pixel detector. This study examines an early batch of FBK sensors (named ATLAS08) of three 3D pixel geometries: 1E, 2E, and 4E, which respectively contain one, two, and four readout electrodes for each pixel, passing completely through the bulk. We present electrical characteristics and beam test performance results for each detector before and after irradiation. The maximum fluence applied is 3.5×10 15 n eq /cm 2

Sensor Development for the CMS Pixel Detector

CERN Document Server

Rohe, T; Chiochia, V; Cremaldi, L M; Cucciarelli, S; Dorkhov, A; Konecki, M; Prokofiev, K; Regenfus, C; Sanders, D A; Son, S; Speer, T; Swartz, M

2003-01-01

This paper reports on a current R&D activity for the sensor part of the CMS pixel detector. Devices featuring several design and technology options have been irradiated up to a proton fluence of 1E15 (1MeV Neutron)/cm**2 at the CERN PS. Afterwards they have been bump bonded to unirradiated readout chips. The chip allows a non zero suppressed full analogue readout and therefore a good characterization of the sensors in terms of noise and charge collection properties. The samples have been tested using high energy pions in the H2 beam line of the CERN SPS in June and September 2003. The results of this test beam are presented and the differences between the sensor options are discussed.

Building CMS Pixel Barrel Detectur Modules

CERN Document Server

König, S; Horisberger, R.; Meier, B.; Rohe, T.; Streuli, S.; Weber, R.; Kastli, H.Chr.; Erdmann, W.

2007-01-01

For the barrel part of the CMS pixel tracker about 800 silicon pixel detector modules are required. The modules are bump bonded, assembled and tested at the Paul Scherrer Institute. This article describes the experience acquired during the assembly of the first ~200 modules.

Status of the CMS Phase 1 Pixel Upgrade

CERN Document Server

Mattig, Stefan

2014-01-01

The silicon pixel detector is the innermost component of the CMS tracking system, providing high precision space point measurements of charged particle trajectories. Before 2018 the instantaneous luminosity of the LHC is expected to reach 2\\,$\\times 10^{34}\\,{\\rm cm^{-2}s^{-1}}$, which will significantly increase the number of interactions per bunch crossing. The current pixel detector of CMS was not designed to work efficiently in such a high occupancy environment and will be degraded by substantial data-loss introduced by buffer filling in the analog Read-Out Chip (ROC) and effects of radiation damage in the sensors, built up over the operational period. To maintain a high tracking efficiency, CMS has planned to replace the current pixel system during ``Phase 1'' (2016/17) by a new lightweight detector, equipped with an additional 4th layer in the barrel, and one additional forward/backward disk. A new digital ROC has been designed, with increased buffers to minimize data-loss, and a digital read-out protoc...

CMS pixel upgrade project

CERN Document Server

Kaestli, Hans-Christian

2010-01-01

The LHC machine at CERN finished its first year of pp collisions at a center of mass energy of 7~TeV. While the commissioning to exploit its full potential is still ongoing, there are plans to upgrade its components to reach instantaneous luminosities beyond the initial design value after 2016. A corresponding upgrade of the innermost part of the CMS detector, the pixel detector, is needed. A full replacement of the pixel detector is planned in 2016. It will not only address limitations of the present system at higher data rates, but will aggressively lower the amount of material inside the fiducial tracking volume which will lead to better tracking and b-tagging performance. This article gives an overview of the project and illuminates the motivations and expected improvements in the detector performance.

CMS pixel upgrade project

CERN Document Server

INSPIRE-00575876

2011-01-01

The LHC machine at CERN finished its first year of pp collisions at a center of mass energy of 7 TeV. While the commissioning to exploit its full potential is still ongoing, there are plans to upgrade its components to reach instantaneous luminosities beyond the initial design value after 2016. A corresponding upgrade of the innermost part of the CMS detector, the pixel detector, is needed. A full replacement of the pixel detector is planned in 2016. It will not only address limitations of the present system at higher data rates, but will aggressively lower the amount of material inside the fiducial tracking volume which will lead to better tracking and b-tagging performance. This article gives an overview of the project and illuminates the motivations and expected improvements in the detector performance.

CMS has a heart of pixels

CERN Multimedia

2003-01-01

In the immediate vicinity of the collision point, CMS will be equipped with pixel detectors consisting of no fewer than 50 million pixels measuring 150 microns along each side. Each of the pixels, which receive the signal, is connected to its own electronic circuit by a tiny sphere (seen here in the electron microscope image) measuring 15 to 20 microns in diameter.

replacement of the heart of the CMS experiment - the pixel #detector.

CERN Multimedia

AUTHOR|(CDS)2070299

2017-01-01

This week, one of the Large Hadron Collider’s experiments gets a “heart transplant”. --- Physicists and engineers are replacing the heart of the CMS experiment - the pixel #detector. This will improve CMS’s ability to make precise measurements on aspects of the Standard Model, including the properties of the #HiggsBoson. The #LHC and its experiments are currently preparing to wake up this spring, when the accelerator will begin to collide particles once more at close to the speed of light. --- Today at 12:15 CET, join us live on #Facebook and ask us anything: https://www.facebook.com/cern/

CMS has a heart of pixels

CERN Multimedia

2003-01-01

At the core of CMS, particles will come into contact with tiny detector components, known as pixels, which are almost invisible to the naked eye. With these elementary cells measuring a mere 150 microns (or about 1/10 of a millimetre) along each side, a real technological leap has been made.

LHC-rate beam test of CMS pixel barrel modules

International Nuclear Information System (INIS)

Erdmann, W.; Hoermann, Ch.; Kotlinski, D.; Horisberger, R.; Kaestli, H. Chr.; Gabathuler, K.; Bertl, W.; Meier, B.; Langenegger, U.; Trueeb, P.; Rohe, T.

2007-01-01

Modules for the CMS pixel barrel detector have been operated in a high rate pion beam at PSI in order to verify under LHC-like conditions the final module design for the production. The test beam provided charged particle rates up to 10 8 cm -2 s -1 over the full module area. Bunch structure and randomized high trigger rates simulated realistic operation. A four layer telescope made of single pixel readout chip assemblies provided tracking needed for the determination of the modules hit reconstruction efficiency. The performance of the modules has been shown to be adequate for the CMS pixel barrel

Simulation of the Dynamic Inefficiency of the CMS Pixel Detector

CERN Document Server

INSPIRE-00380273

2015-05-07

The Pixel Detector is the innermost part of the CMS Tracker. It therefore has to prevail in the harshest environment in terms of particle fluence and radiation. There are several mechanisms that may decrease the efficiency of the detector. These are mainly caused by data acquisition (DAQ) problems and/or Single Event Upsets (SEU). Any remaining efficiency loss is referred to as the dynamic inefficiency. It is caused by various mechanisms inside the Readout Chip (ROC) and depends strongly on the data occupancy. In the 2012 data, at high values of instantaneous luminosity the inefficiency reached 2\\% (in the region closest to the interaction point) which is not negligible. In the 2015 run higher instantaneous luminosity is expected, which will result in lower efficiencies; therefore this effect needs to be understood and simulated. A data-driven method has been developed to simulate dynamic inefficiency, which has been shown to successfully simulate the effects.

Study of the CMS Phase-1 Pixel Pilot Blade Reconstruction

CERN Document Server

Vami, Tamas Almos

2017-01-01

The Compact Muon Solenoid (CMS) detector is one of two general-purpose detectors that measure the products of high energy particle interactions in the Large Hadron Collider (LHC) at CERN. The silicon pixel detector is the innermost component of the CMS tracking system. The detector which was in operation between 2009 and 2016 has now been replaced with an upgraded one in the beginning of 2017. During the previous shutdown period of the LHC, a prototype readout system and a third disk was inserted into the old forward pixel detector with eight prototype blades constructed using the new digital read-out chips. Testing the performance of these pilot modules enabled us to gain operational experience with the upgraded detector. In this paper, the reconstruction and analysis of the data taken with the new modules are presented including information on the calibration of the reconstruction software. The hit finding efficiency and track-hit residual distributions are also shown.

Current Status of the Pixel Phase I Upgrade in CMS: Barrel Module Production

CERN Document Server

Bartek, Rachel

2016-01-01

The silicon pixel detector is the innermost component of the CMS tracking system, providing high precision space point measurements of charged particle trajectories. Before 2018 the instantaneous luminosity of the LHC is expected to reach about 2~x~$10^{34}~\\rm{cm}^{-2}\\rm{s}^{-1}$, which will significantly increase the number of interactions per bunch crossing. To maintain a high tracking efficiency, CMS has planned to replace the current pixel system during phase I by a new lightweight detector, equipped with an additional 4th layer in the barrel, and one additional forward/backward disk. The present status of barrel modules production will be presented, including preliminary results from tests on the first production pixel modules of the new pixel tracker.

replacement of the heart of the CMS experiment - the pixel #detector. Part2

CERN Multimedia

Brice, Maximilien

2017-01-01

This week, one of the Large Hadron Collider’s experiments gets a “heart transplant”. --- Physicists and engineers are replacing the heart of the CMS experiment - the pixel #detector. This will improve CMS’s ability to make precise measurements on aspects of the Standard Model, including the properties of the #HiggsBoson. The #LHC and its experiments are currently preparing to wake up this spring, when the accelerator will begin to collide particles once more at close to the speed of light. --- Today at 12:15 CET, join us live on #Facebook and ask us anything: https://www.facebook.com/cern/

Production chain of CMS pixel modules

CERN Multimedia

2006-01-01

The pictures show the production chain of pixel modules for the CMS detector. Fig.1: overview of the assembly procedure. Fig.2: bump bonding with ReadOut Chip (ROC) connected to the sensor. Fig.3: glueing a raw module onto the baseplate strips. Fig.4: glueing of the High Density Interconnect (HDI) onto a raw module. Fig.5: pull test after heat reflow. Fig.6: wafer sensor processing, Indium evaporation.

CMS Forward Pixel Upgrade Electronics and System Testing

CERN Document Server

Weber, Hannsjorg Artur

2016-01-01

This note discusses results of electronics and system testing of the CMS forward pixel (FPIX) detector upgrade for Phase 1. The FPIX detector is comprised of four stand-alone half cylinders, each of which contains frontend readout electronic boards, power regulators, cables and fibers in addition to the pixel modules. All of the components undergo rigorous testing and quality assurance before assembly into the half cylinders. Afterwards, we perform full system tests on the completely assembled half cylinders, including calibrations at final operating temperatures, characterization of the realistic readout chain, and system grounding and noise studies. The results from all these tests are discussed.

Radiation hardness of CMS pixel barrel modules

CERN Document Server

Rohe, T; Erdmann, W; Kästli, H C; Khalatyan, S; Meier, B; Radicci, V; Sibille, J

2010-01-01

Pixel detectors are used in the innermost part of the multi purpose experiments at LHC and are therefore exposed to the highest fluences of ionising radiation, which in this part of the detectors consists mainly of charged pions. The radiation hardness of all detector components has thoroughly been tested up to the fluences expected at the LHC. In case of an LHC upgrade, the fluence will be much higher and it is not yet clear how long the present pixel modules will stay operative in such a harsh environment. The aim of this study was to establish such a limit as a benchmark for other possible detector concepts considered for the upgrade. As the sensors and the readout chip are the parts most sensitive to radiation damage, samples consisting of a small pixel sensor bump-bonded to a CMS-readout chip (PSI46V2.1) have been irradiated with positive 200 MeV pions at PSI up to 6E14 Neq and with 21 GeV protons at CERN up to 5E15 Neq. After irradiation the response of the system to beta particles from a Sr-90 source w...

Low-cost bump-bonding processes for high energy physics pixel detectors

CERN Document Server

AUTHOR|(CDS)2069357; Blank, Thomas; Colombo, Fabio; Dierlamm, Alexander Hermann; Husemann, Ulrich; Kudella, Simon; Weber, M

2016-01-01

In the next generation of collider experiments detectors will be challenged by unprecedented particle fluxes. Thus large detector arrays of highly pixelated detectors with minimal dead area will be required at reasonable costs. Bump-bonding of pixel detectors has been shown to be a major cost-driver. KIT is one of five production centers of the CMS barrel pixel detector for the Phase I Upgrade. In this contribution the SnPb bump-bonding process and the production yield is reported. In parallel to the production of the new CMS pixel detector, several alternatives to the expensive photolithography electroplating/electroless metal deposition technologies are developing. Recent progress and challenges faced in the development of bump-bonding technology based on gold-stud bonding by thin (15 μm) gold wire is presented. This technique allows producing metal bumps with diameters down to 30 μm without using photolithography processes, which are typically required to provide suitable under bump metallization. The sh...

Development of a DC-DC conversion powering scheme for the CMS Phase-1 pixel upgrade

CERN Document Server

Feld, Lutz Werner; Karpinski, Waclaw; Klein, Katja; Lipinski, Martin; Preuten, Marius; Max Rauch; Rittich, David Michael; Sammet, Jan Domenik; Wlochal, Michael

2014-01-01

A novel powering scheme based on the DC-DC conversion technique will be exploited to power the CMS Phase-1 pixel detector. DC-DC buck converters for the CMS pixel project have been developed, based on the AMIS5 ASIC designed by CERN. The powering system of the Phase-1 pixel detector is described and the performance of the converter prototypes is detailed, including power efficiency, stability of the output voltage, shielding, and thermal management. Results from a test of the magnetic field tolerance of the DC-DC converters are reported. System tests with pixel modules using many components of the future pixel barrel system are summarized. Finally first impressions from a pre-series of 200 DC-DC converters are presented.

Position dependence of charge collection in prototype sensors for the CMS pixel detector

CERN Document Server

Rohe, Tilman; Chiochia, Vincenzo; Cremaldi, Lucien M; Cucciarelli, Susanna; Dorokhov, Andrei; Konecki, Marcin; Prokofiev, Kirill; Regenfus, Christian; Sanders, David A; Son Seung Hee; Speer, Thomas; Swartz, Morris

2004-01-01

This paper reports on the sensor R&D activity for the CMS pixel detector. Devices featuring several design and technology options have been irradiated up to a proton fluence1 of 1 multiplied by 10**1**5 n //e//q/cm**2 at the CERN PS. Afterward, they were bump bonded to unirradiated readout chips and tested using high energy pions in the H2 beam line of the CERN SPS. The readout chip allows a nonzero suppressed full analogue readout and therefore a good characterization of the sensors in terms of noise and charge collection properties. The position dependence of signal is presented and the differences between the two sensor options are discussed. 20 Refs.

Studies of mono-crystalline CVD diamond pixel detectors

CERN Document Server

Bartz, E; Atramentov, O; Yang, Z; Hall-Wilton, R; Schnetzer, S; Patel, R; Bugg, W; Hebda, P; Halyo, V; Hunt, A; Marlow, D; Steininger, H; Ryjov, V; Hits, D; Spanier, S; Pernicka, M; Johns, W; Doroshenko, J; Hollingsworth, M; Harrop, B; Farrow, C; Stone, R

2011-01-01

The Pixel Luminosity Telescope (PLT) is a dedicated luminosity monitor, presently under construction, for the Compact Muon Solenoid (CMS) experiment at the Large Hadron Collider (LHC). It measures the particle flux in several three layered pixel diamond detectors that are aligned precisely with respect to each other and the beam direction. At a lower rate it also performs particle track position measurements. The PLTs mono-crystalline CVD diamonds are bump-bonded to the same readout chip used in the silicon pixel system in CMS. Mono-crystalline diamond detectors have many attributes that make them desirable for use in charged particle tracking in radiation hostile environments such as the LHC. In order to further characterize the applicability of diamond technology to charged particle tracking we performed several tests with particle beams that included a measurement of the intrinsic spatial resolution with a high resolution beam telescope. Published by Elsevier B.V.

Studies of mono-crystalline CVD diamond pixel detectors

Energy Technology Data Exchange (ETDEWEB)

Bugg, W. [University of Tennessee, Knoxville (United States); Hollingsworth, M., E-mail: mhollin3@utk.edu [University of Tennessee, Knoxville (United States); Spanier, S.; Yang, Z. [University of Tennessee, Knoxville (United States); Bartz, E.; Doroshenko, J.; Hits, D.; Schnetzer, S.; Stone, R.; Atramentov, O.; Patel, R.; Barker, A. [Rutgers University, Piscataway (United States); Hall-Wilton, R.; Ryjov, V.; Farrow, C. [CERN, Geneva (Switzerland); Pernicka, M.; Steininger, H. [HEPHY, Vienna (Austria); Johns, W. [Vanderbilt University, Nashville (United States); Halyo, V.; Harrop, B. [Princeton University, Princeton (United States); and others

2011-09-11

The Pixel Luminosity Telescope (PLT) is a dedicated luminosity monitor, presently under construction, for the Compact Muon Solenoid (CMS) experiment at the Large Hadron Collider (LHC). It measures the particle flux in several three layered pixel diamond detectors that are aligned precisely with respect to each other and the beam direction. At a lower rate it also performs particle track position measurements. The PLT's mono-crystalline CVD diamonds are bump-bonded to the same readout chip used in the silicon pixel system in CMS. Mono-crystalline diamond detectors have many attributes that make them desirable for use in charged particle tracking in radiation hostile environments such as the LHC. In order to further characterize the applicability of diamond technology to charged particle tracking we performed several tests with particle beams that included a measurement of the intrinsic spatial resolution with a high resolution beam telescope.

Study of the CMS Phase 1 Pixel Pilot Blade Reconstruction

CERN Document Server

CMS Collaboration

2017-01-01

The silicon pixel detector is the innermost component of the CMS tracking system. It was replaced in March 2017 with an upgraded one, called the Phase 1 upgrade detector. During Long Shutdown 1, a third disk was inserted into the present forward pixel detector with eight prototype blades constructed using a new digital read-out chip architecture and a prototype readout chain. Testing the performance of these pilot modules enabled us to gain experience with the Phase 1 upgrade modules. In this document, the data reconstruction with the pilot system is presented. The hit finding efficiency and residual of these new modules is also shown, and how these observables were used to adjust the timing of the pilot blades.

Performance of the modules for layer 1 of the CMS phase 1 pixel detector upgrade

CERN Document Server

Meinhard, Maren Tabea; Berger, Pirmin; Starodumov, Andrey

2017-01-01

The instantaneous luminosity of the Large Hadron Collider will increase to up to 2x10$^{34}$\\;cm$^{-2}$s$^{-1}$ by 2023. In order to cope with such luminosities, the pixel detector of the CMS experiment has been replaced in January 2017. The upgraded detector features four sensitive layers in the barrel part. A designated readout chip (PROC600V2) is used for layer 1, which is closest to the interaction point and therefore has to handle larger particle fluxes. An irradiation campaign has been performed with PROC600V2 to verify its radiation tolerance up to the maximum expected dose for 2017 of 0.2\\;MGy. Modules for layer 1 have been built with PROC600V2 for the detector production. The quality of every inserted module was assessed in a number of tests, some of which were performed using X-radiation. The characteristics of the modules used in the detector as well as the main failure modes will be presented.

A DC-DC Conversion Powering Scheme for the CMS Phase-1 Pixel Upgrade

CERN Document Server

Feld, Lutz Werner; Marcel Friedrichs; Richard Hensch; Karpinski, Waclaw; Klein, Katja; Sammet, Jan Domenik; Wlochal, Michael

2012-01-01

The powering scheme of the CMS pixel detector will be described, and the performance of prototype DC-DC buck converters will be presented, including power efficiency, system tests with DC-DC converters and pixel modules, thermal management, reliability at low temperature, and studies of potential frequency locking betwe...

Mechanical design and material budget of the CMS barrel pixel detector

Energy Technology Data Exchange (ETDEWEB)

Amsler, C; Boesiger, K; Chiochia, V; Maier, R; Meyer, Hp; Robmann, P; Scherr, S; Schmidt, A; Steiner, S [Universitaet Zuerich, Physik-Institut, Winterthurerstr. 190, CH-8057 Zuerich (Switzerland); Erdmann, W; Gabathuler, K; Horisberger, R; Koenig, S; Kotlinski, D; Meier, B; Streuli, S [Paul Scherrer Institut, CH-5232 Villigen (Switzerland); Rizzi, A [ETH Zuerich, Institute for Particle Physics, CH-8093 Zuerich (Switzerland)], E-mail: Alexander.Schmidt@cern.ch

2009-05-15

The Compact Muon Solenoid experiment at the Large Hadron Collider at CERN includes a silicon pixel detector as its innermost component. Its main task is the precise reconstruction of charged particles close to the primary interaction vertex. This paper gives an overview of the mechanical requirements and design choices for the barrel pixel detector. The distribution of material in the detector as well as its description in the Monte Carlo simulation are discussed in detail.

Mechanical Design and Material Budget of the CMS Barrel Pixel Detector

CERN Document Server

Amsler, C; Chiochia, V; Erdmann, W; Gabathuler, K; Horisberger, R; König, S; Kotlinski, D; Maier, R; Meyer, H; Meier, B; Meyer, Hp; Rizzi, A; Robmann, P; Scherr, S; Schmidt, A; Steiner, S; Erdmann, W; Gabathuler, K; Horisberger, R; König, S; Kotlinski, D; Meier, B; Streuli, S; Rizzi, A

2009-01-01

The Compact Muon Solenoid experiment at the Large Hadron Collider at CERN includes a silicon pixel detector as its innermost component. Its main task is the precise reconstruction of charged particles close to the primary interaction vertex. This paper gives an overview of the mechanical requirements and design choices for the barrel pixel detector. The distribution of material in the detector as well as its description in the Monte Carlo simulation are discussed in detail.

Performance of Radiation Hard Pixel Sensors for the CMS Experiment

CERN Document Server

Dorokhov, Andrei

2005-01-01

Position sensitive detectors in particle physics experiments are used for the detection of the particles trajectory produced in high energy collisions. To study physics phenomena at high energies the high particle interaction rate is unavoidable, as the number of interesting events falls with the energy and the total number of events is dominated by the soft processes. The position resolution of vertex detectors has to be of few microns in order to distinguish between particle tracks produced in b-quark or tau-decays, because of the short flight path before the decay. The high spatial position resolution and the ability to detect a large number of superimposed track are the key features for tracking detectors. Modern silicon microstrip and pixel detectors with high resolution are currently most suitable devices for the tracking systems of high energy physics experiments. In this work the performance of the sensors designed for the CMS pixel detector are studied and the position resolution is estimated. In the...

Serial powering optimization for CMS and ATLAS pixel detectors within RD53 collaboration for HL-LHC: system level simulations and testing

CERN Document Server

Orfanelli, Stella; Hamer, Matthias; Hinterkeuser, F; Karagounis, M; Pradas Luengo, Alvaro; Marconi, Sara; Ruini, Daniele

2017-01-01

Serial powering is the baseline choice for low mass power distribution for the CMS and ATLAS HL-LHC pixel detectors. Two 2.0 A Shunt-LDO regulators are integrated in a prototype pixel chip implemented in 65-nm CMOS technology and used to provide constant supply voltages to its power domains from a constant input current. Performance results from testing prototype Shunt-LDO regulators are shown, including their behaviour after x-ray irradiation. The system level simulation studies, which had been performed with a detailed regulator design in a serially powered topology, have been validated.

Test Beam Measurements for the Upgrade of the CMS Pixel Detector and Measurement of the Top Quark Mass from Differential Cross Sections

CERN Document Server

Spannagel, Simon

2016-01-01

In this dissertation, two different topics are addressed which are vital for the realization ofmodern high-energy physics experiments: detector development and data analysis. The first partfocuses on the development and characterization of silicon pixel detectors. To account for theexpected increase in luminosity of the Large Hadron Collider, the pixel detector of the CompactMuon Solenoid (CMS) experiment will be replaced by an upgraded detector with new front-endelectronics. Comprehensive test beam studies are presented which have been conducted to verifythe design and to quantify the performance of the new front-end in terms of tracking efficiency+0.3and spatial resolution. The tracking efficiency has been determined to be 99.7 −0.5 %, whilethe spatial resolution has been measured to be (4.80 ± 0.29) µm and (7.99 ± 0.23) µm along the100 µm and 150 µm pixel pitch, respectively. Furthermore, a new cluster interpolation method isproposed which utilizes the third central moment of the cluster charge d...

Radiation hardness of CMS pixel barrel modules

International Nuclear Information System (INIS)

Rohe, T.; Bean, A.; Erdmann, W.; Kaestli, H.-C.; Khalatyan, S.; Meier, B.; Radicci, V.; Sibille, J.

2010-01-01

Pixel detectors are used in the innermost part of the multi purpose experiments at the LHC and are therefore exposed to the highest fluences of ionising radiation, which in this part of the detectors consists mainly of charged pions. The radiation hardness of all detector components has been thoroughly tested up to the fluences expected at the LHC. In case of an LHC upgrade, the fluence will be much higher and it is not yet clear how long the present pixel modules will stay operative in such a harsh environment. The aim of this study was to establish such a limit as a benchmark for other possible detector concepts considered for the upgrade. As the sensors and the readout chip are the parts most sensitive to radiation damage, samples consisting of a small pixel sensor bump-bonded to a CMS-readout chip (PSI46V2.1) have been irradiated with positive 200 MeV pions at PSI up to 6x10 14 n eq /cm 2 and with 21 GeV protons at CERN up to 5x10 15 n eq /cm 2 . After irradiation the response of the system to beta particles from a 90 Sr source was measured to characterise the charge collection efficiency of the sensor. Radiation induced changes in the readout chip were also measured. The results show that the present pixel modules can be expected to be still operational after a fluence of 2.8x10 15 n eq /cm 2 . Samples irradiated up to 5x10 15 n eq /cm 2 still see the beta particles. However, further tests are needed to confirm whether a stable operation with high particle detection efficiency is possible after such a high fluence.

CMS Detector Posters

CERN Multimedia

2016-01-01

CMS Detector posters (produced in 2000): CMS installation CMS collaboration From the Big Bang to Stars LHC Magnetic Field Magnet System Trackering System Tracker Electronics Calorimetry Eletromagnetic Calorimeter Hadronic Calorimeter Muon System Muon Detectors Trigger and data aquisition (DAQ) ECAL posters (produced in 2010, FR & EN): CMS ECAL CMS ECAL-Supermodule cooling and mechatronics CMS ECAL-Supermodule assembly

Signal height in silicon pixel detectors irradiated with pions and protons

International Nuclear Information System (INIS)

Rohe, T.; Acosta, J.; Bean, A.; Dambach, S.; Erdmann, W.; Langenegger, U.; Martin, C.; Meier, B.; Radicci, V.; Sibille, J.; Trueb, P.

2010-01-01

Pixel detectors are used in the innermost part of multi-purpose experiments at the Large Hadron Collider (LHC) and are therefore exposed to the highest fluences of ionising radiation, which in this part of the detectors consists mainly of charged pions. The radiation hardness of the detectors has been tested thoroughly up to the fluences expected at the LHC. In case of an LHC upgrade the fluence will be much higher and it is not yet clear up to which radii the present pixel technology can be used. To establish such a limit, pixel sensors of the size of one CMS pixel readout chip (PSI46V2.1) have been bump bonded and irradiated with positive pions up to 6x10 14 n eq /cm 2 at PSI and with protons up to 5x10 15 n eq /cm 2 . The sensors were taken from production wafers of the CMS barrel pixel detector. They use n-type DOFZ material with a resistance of about 3.7kΩcm and an n-side read out. As the performance of silicon sensors is limited by trapping, the response to a Sr-90 source was investigated. The highly energetic beta-particles represent a good approximation to minimum ionising particles. The bias dependence of the signal for a wide range of fluences will be presented.

Simulation study of pixel detector charge digitization

Science.gov (United States)

Wang, Fuyue; Nachman, Benjamin; Sciveres, Maurice; Lawrence Berkeley National Laboratory Team

2017-01-01

Reconstruction of tracks from nearly overlapping particles, called Tracking in Dense Environments (TIDE), is an increasingly important component of many physics analyses at the Large Hadron Collider as signatures involving highly boosted jets are investigated. TIDE makes use of the charge distribution inside a pixel cluster to resolve tracks that share one of more of their pixel detector hits. In practice, the pixel charge is discretized using the Time-over-Threshold (ToT) technique. More charge information is better for discrimination, but more challenging for designing and operating the detector. A model of the silicon pixels has been developed in order to study the impact of the precision of the digitized charge distribution on distinguishing multi-particle clusters. The output of the GEANT4-based simulation is used to train neutral networks that predict the multiplicity and location of particles depositing energy inside one cluster of pixels. By studying the multi-particle cluster identification efficiency and position resolution, we quantify the trade-off between the number of ToT bits and low-level tracking inputs. As both ATLAS and CMS are designing upgraded detectors, this work provides guidance for the pixel module designs to meet TIDE needs. Work funded by the China Scholarship Council and the Office of High Energy Physics of the U.S. Department of Energy under contract DE-AC02-05CH11231.

Tracking performance of a single-crystal and a polycrystalline diamond pixel-detector

Energy Technology Data Exchange (ETDEWEB)

Menasce, D.; et al.

2013-06-01

We present a comparative characterization of the performance of a single-crystal and a polycrystalline diamond pixel-detector employing the standard CMS pixel readout chips. Measurements were carried out at the Fermilab Test Beam Facility, FTBF, using protons of momentum 120 GeV/c tracked by a high-resolution pixel telescope. Particular attention was directed to the study of the charge-collection, the charge-sharing among adjacent pixels and the achievable position resolution. The performance of the single-crystal detector was excellent and comparable to the best available silicon pixel-detectors. The measured average detection-efficiency was near unity, ε = 0.99860±0.00006, and the position-resolution for shared hits was about 6 μm. On the other hand, the performance of the polycrystalline detector was hampered by its lower charge collection distance and the readout chip threshold. A new readout chip, capable of operating at much lower threshold (around 1 ke^$-$), would be required to fully exploit the potential performance of the polycrystalline diamond pixel-detector.

Performance of the Pixel Luminosity Telescope for Luminosity Measurement at CMS during Run2

CERN Document Server

Lujan, Paul Joseph

2017-01-01

The Pixel Luminosity Telescope (PLT) is a dedicated system for luminosity measurement at the CMS experiment using silicon pixel sensors arranged into telescopes, each consisting of three sensor planes. It was installed in CMS at the beginning of 2015 and has been providing online and offline luminosity measurements throughout Run 2 of the LHC. The online bunch-by-bunch luminosity measurement employs the fast-or capability of the pixel readout chip to identify events where a hit is registered in all three sensors in a telescope, corresponding primarily to tracks originating from the interaction point. In addition, the full pixel information is read out at a lower rate, allowing for the calculation of corrections to the online luminosity from effects such as the miscounting of tracks not originating from the interaction point and detector efficiency. This paper presents results from the 2016 running of the PLT, including commissioning and operational history, luminosity calibration using Van der Meer scans, and...

Test beam measurements for the upgrade of the CMS pixel detector and measurement of the top quark mass from differential cross sections

International Nuclear Information System (INIS)

Spannagel, Simon

2016-05-01

In this dissertation, two different topics are addressed which are vital for the realization of modern high-energy physics experiments: detector development and data analysis. The first part focuses on the development and characterization of silicon pixel detectors. To account for the expected increase in luminosity of the Large Hadron Collider, the pixel detector of the Compact Muon Solenoid (CMS) experiment will be replaced by an upgraded detector with new front-end electronics. Comprehensive test beam studies are presented which have been conducted to verify the design and to quantify the performance of the new front-end in terms of tracking efficiency and spatial resolution. The tracking efficiency has been determined to be 99.7 +0.3 -0.5 %, while the spatial resolution has been measured to be (4.80±0.29) μm and (7.99±0.23) μm along the 100 μm and 150 μm pixel pitch, respectively. Furthermore, a new cluster interpolation method is proposed which utilizes the third central moment of the cluster charge distribution and achieves improvements of the position resolution of up to 40% over the conventional center of gravity algorithm. In the second part of the thesis, an alternative measurement of the top quark mass is presented. The mass is measured from the normalized differential production cross sections of dileptonic top quark pair events with an additional jet. The measurement is performed on data recorded by the CMS experiment at √(s)=8 TeV, corresponding to an integrated luminosity of 19.7 fb -1 . Using theoretical predictions at next-to-leading order in perturbative QCD, the top quark pole mass is measured to be m pole t = 168.2 +4.7 -2.1 GeV with a precision of about 2.0%. The measurement is in agreement with other measurements of the top quark pole mass within the assigned uncertainties.

Test beam measurements for the upgrade of the CMS pixel detector and measurement of the top quark mass from differential cross sections

Energy Technology Data Exchange (ETDEWEB)

Spannagel, Simon

2016-05-15

In this dissertation, two different topics are addressed which are vital for the realization of modern high-energy physics experiments: detector development and data analysis. The first part focuses on the development and characterization of silicon pixel detectors. To account for the expected increase in luminosity of the Large Hadron Collider, the pixel detector of the Compact Muon Solenoid (CMS) experiment will be replaced by an upgraded detector with new front-end electronics. Comprehensive test beam studies are presented which have been conducted to verify the design and to quantify the performance of the new front-end in terms of tracking efficiency and spatial resolution. The tracking efficiency has been determined to be 99.7{sup +0.3}{sub -0.5} %, while the spatial resolution has been measured to be (4.80±0.29) μm and (7.99±0.23) μm along the 100 μm and 150 μm pixel pitch, respectively. Furthermore, a new cluster interpolation method is proposed which utilizes the third central moment of the cluster charge distribution and achieves improvements of the position resolution of up to 40% over the conventional center of gravity algorithm. In the second part of the thesis, an alternative measurement of the top quark mass is presented. The mass is measured from the normalized differential production cross sections of dileptonic top quark pair events with an additional jet. The measurement is performed on data recorded by the CMS experiment at √(s)=8 TeV, corresponding to an integrated luminosity of 19.7 fb{sup -1}. Using theoretical predictions at next-to-leading order in perturbative QCD, the top quark pole mass is measured to be m{sup pole}{sub t}= 168.2{sup +4.7}{sub -2.1} GeV with a precision of about 2.0%. The measurement is in agreement with other measurements of the top quark pole mass within the assigned uncertainties.

Tracking performance with cosmic rays in CMS

International Nuclear Information System (INIS)

Cerati, G.B.

2009-01-01

The CMS Tracker is the biggest all-silicon detector in the world and is designed to be extremely efficient and accurate even in a very hostile environment such as the one close to the CMS collision point. It consists of an inner pixel detector, made of three barrel layers (48M pixels) and four forward disks (16M pixels), and an outer micro-strip detector, divided in two barrel sub-detectors, TIB and TOB, and two endcap sub-detectors, TID and TEC, for a total of 9.6M strips. The commissioning of the CMS Tracker detector has been initially carried out at the Tracker Integration Facility at CERN (TIF), where cosmic ray data were collected for the strip detector only, and is still ongoing at the CMS site (LHC Point 5). Here the Strip and Pixel detectors have been installed in the experiment and are taking part to the cosmic global-runs. After an overview of the tracking algorithms for cosmic-ray data reconstruction, the resulting tracking performance on cosmic data both at TIF and at P5 are presented. The excellent performance proves that the CMS Tracker is ready for the first collisions foreseen for 2009.

Detector Alignment Studies for the CMS Experiment

CERN Document Server

Lampén, Tapio

2007-01-01

This thesis presen ts studies related to trac k-based alignmen t for the future CMS exp erimen t at CERN. Excellen t geometric alignmen t is crucial to fully bene t from the outstanding resolution of individual sensors. The large num ber of sensors mak es it dicult in CMS to utilize computationally demanding alignmen t algorithms. A computationally ligh t alignmen t algorithm, called the Hits and Impact Points algorithm (HIP), is dev elop ed and studied. It is based on minimization of the hit residuals. It can be applied to individual sensors or to comp osite objects. All six alignmen t parameters (three translations and three rotations), or their subgroup can be considered. The algorithm is exp ected to be particularly suitable for the alignmen t of the innermost part of CMS, the pixel detector, during its early operation, but can be easily utilized to align other parts of CMS also. The HIP algorithm is applied to sim ulated CMS data and real data measured with a test-b eam setup. The sim ulation studies dem...

Experience from design, prototyping and production of a DC–DC conversion powering scheme for the CMS Phase-1 Pixel Upgrade

Energy Technology Data Exchange (ETDEWEB)

Feld, Lutz, E-mail: Lutz.Feld@cern.ch; Karpinski, Waclaw; Klein, Katja; Lipinski, Martin; Preuten, Marius; Rauch, Max; Schmitz, Stefan; Wlochal, Michael

2017-02-11

The CMS pixel detector will be replaced during the technical stop 2016/2017. To allow the new pixel detector to be powered with the legacy cable plant and power supplies, a novel powering scheme based on DC–DC conversion will be employed. After the successful conclusion of an extensive development and prototyping phase, mass production of 1800 DC–DC converters as well as motherboards and other power PCBs has now been completed. This contribution reviews the lessons learned from the development of the power system for the Phase-1 pixel detector, and summarizes the experience gained from the production phase.

Track parameter resolution study of a pixel only detector for LHC geometry and future high rate experiments

Energy Technology Data Exchange (ETDEWEB)

Blago, Michele Piero; Kar, Tamasi Rameshchandra; Schoening, Andre [Physikalisches Institut, Universitaet Heidelberg (Germany)

2016-07-01

Recent progress in pixel detector technology, for example using High Voltage-Monolithic Pixel Sensors (HV-MAPS), makes it feasible to construct an all-silicon pixel detector for large scale particle experiments like ATLAS and CMS or other future collider experiments. Preliminary studies have shown that nine layers of pixel sensors are sufficient to reliably reconstruct particle trajectories. The performance of such an all-pixel detector is studied based on a full GEANT simulation for high luminosity conditions at the upgraded LHC. Furthermore, the ability of an all-pixel detector to form trigger decisions using a special triplet pixel layer design is studied. Such a design could be used to reconstruct all tracks originating from the proton-proton interaction at the first hardware level at 40 MHz collision frequency.

Production of the new pixel detector for the upgrade of the CMS experiment and study of anomalous couplings in the non-resonant Higgs bosons pair production in p-p collisions at $\\sqrt{s}$ = 13 TeV

CERN Document Server

AUTHOR|(INSPIRE)INSPIRE-00367286; Dorigo, Tommaso

2016-01-01

The present Ph.D thesis describes the work done within the CMS collaboration on the pixel detector upgrade and on the search for non-resonant di-Higgs production in p-p collision at LHC. The CMS upgrade project foresees, inter alia, the production of a new pixel detector (CMS Phase 1 Pixel Upgrade) to be commissioned at the beginning of 2017. Crucial part of the upgrade is the new readout chip (ROC) for the silicon sensor, psi46digV2respin, designed at the Paul Scherrer Institute (PSI) with a 250 nm CMOS technology. The thesis concerns the study and the development of test procedures for this new readout chip. Thanks to a long stay at PSI, I could provide an important contribution to the debug phases of the first version of the ROC and TBM, the chip that handles the various ROCs in the pixel module, and to the development of the software used by the whole collaboration for the ROC and module testing. Furthermore, I managed the ROC wafers test from the early project phases. The ROCs are produced on silicon wa...

CMS Pixel Upgrade for the Phase I: Module Production and Qualification

CERN Document Server

AUTHOR|(CDS)2078028

2016-01-01

The present CMS pixel detector has been designed to be fully efficient up to a LHC luminosity of $10^{34}~\\mathrm{cm}^{-2}~\\mathrm{s}^{-1}$. However, the luminosity will increase by a factor of two in the coming years. Therefore it is planned to build and install a new detector in the extended year-end technical stop (YETS) in 2016-17. Barrel pixel modules are in production since Spring/Summer 2015 in five different centers. Module production requires bump bonding, wire bonding and gluing processes to finally assemble a full module. To have a uniform performance of all modules standard qualification procedures have been developed. All modules will be subjected to 10 termal cycles between +$17^{\\circ}$C and -$25^{\\circ }$C and then electrically tested. In addition, module performance will be verified under high rate X-rays, and internal calibrate signals used for electrical tests will be calibrated in units of electrons using well defined X-ray fluorescence lines from different target materials. The qualifica...

Estudio de un microcable de par trenzado para la comunicacion y lectura del modulo de pixeles del experimento CMS

Science.gov (United States)

Oliveros Tautiva, Sandra Jimena

The Compact Muon Solenoid (CMS) is one of the two most important experiments at the Large Hadron Collider (LHC). The pixel detector is the component closest to the collision in CMS and it receives large doses of radiation which will affect its performance. The pixel detector will be replaced by a new one after four years. The aim is to reduce material in the sensitive zone of the new pixel detector, which leads to the implementation of a type of micro twisted pair cable that will replace the existing kapton cables and some connections will be eliminated. The purpose of this work was to study the viability of using these micro twisted pair cables in the existing 40 MHz analog readout. The electrical parameters of micro cables were determined, and operational tests were performed in a module using these cables for communicating and reading. Three different lengths of micro cables were used, 1.0, 1.5 and 2.0 m, in order to compare test results with those obtained using the kapton cable. It was found that the use of these cables does not affect the programming and reading of the pixels in one module, so the micro cables are viable to be used in place of the kapton cables.

A review of advances in pixel detectors for experiments with high rate and radiation

Science.gov (United States)

Garcia-Sciveres, Maurice; Wermes, Norbert

2018-06-01

The large Hadron collider (LHC) experiments ATLAS and CMS have established hybrid pixel detectors as the instrument of choice for particle tracking and vertexing in high rate and radiation environments, as they operate close to the LHC interaction points. With the high luminosity-LHC upgrade now in sight, for which the tracking detectors will be completely replaced, new generations of pixel detectors are being devised. They have to address enormous challenges in terms of data throughput and radiation levels, ionizing and non-ionizing, that harm the sensing and readout parts of pixel detectors alike. Advances in microelectronics and microprocessing technologies now enable large scale detector designs with unprecedented performance in measurement precision (space and time), radiation hard sensors and readout chips, hybridization techniques, lightweight supports, and fully monolithic approaches to meet these challenges. This paper reviews the world-wide effort on these developments.

Optical readout and control interface for the BTeV pixel vertex detector

CERN Document Server

Vergara-Limon, S; Sheaff, M; Vargas, M A

2002-01-01

Optical links will be used for sending data back and forth from the counting room to the detector in the data acquisition systems for future high energy physics experiments, including ATLAS and CMS in the LHC at CERN (Switzerland) and BTeV at Fermilab (USA). This is because they can be ultra-high speed and are relatively immune to electro-magnetic interference (EMI). The baseline design for the BTeV Pixel Vertex Detector includes two types of optical link, one to control and monitor and the other to read out the hit data from the multi-chip modules on each half-plane of the detector. The design and performance of the first prototype of the Optical Readout and Control Interface for the BTeV Pixel Vertex Detector is described.

Design optimization of pixel sensors using device simulations for the phase-II CMS tracker upgrade

Science.gov (United States)

Jain, G.; Bhardwaj, A.; Dalal, R.; Eber, R.; Eichorn, T.; Fernandez, M.; Lalwani, K.; Messineo, A.; Palomo, F. R.; Peltola, T.; Printz, M.; Ranjan, K.; Villa, I.; Hidalgo, S.; CMS Collaboration

2016-07-01

In order to address the problems caused by the harsh radiation environment during the high luminosity phase of the LHC (HL-LHC), all silicon tracking detectors (pixels and strips) in the CMS experiment will undergo an upgrade. And so to develop radiation hard pixel sensors, simulations have been performed using the 2D TCAD device simulator, SILVACO, to obtain design parameters. The effect of various design parameters like pixel size, pixel depth, implant width, metal overhang, p-stop concentration, p-stop depth and bulk doping density on the leakage current and critical electric field are studied for both non-irradiated as well as irradiated pixel sensors. These 2D simulation results of planar pixels are useful for providing insight into the behaviour of non-irradiated and irradiated silicon pixel sensors and further work on 3D simulation is underway.

Design optimization of pixel sensors using device simulations for the phase-II CMS tracker upgrade

International Nuclear Information System (INIS)

Jain, G.; Bhardwaj, A.; Dalal, R.; Eber, R.; Eichorn, T.; Fernandez, M.; Lalwani, K.; Messineo, A.; Palomo, F.R.; Peltola, T.; Printz, M.; Ranjan, K.; Villa, I.; Hidalgo, S.

2016-01-01

In order to address the problems caused by the harsh radiation environment during the high luminosity phase of the LHC (HL-LHC), all silicon tracking detectors (pixels and strips) in the CMS experiment will undergo an upgrade. And so to develop radiation hard pixel sensors, simulations have been performed using the 2D TCAD device simulator, SILVACO, to obtain design parameters. The effect of various design parameters like pixel size, pixel depth, implant width, metal overhang, p-stop concentration, p-stop depth and bulk doping density on the leakage current and critical electric field are studied for both non-irradiated as well as irradiated pixel sensors. These 2D simulation results of planar pixels are useful for providing insight into the behaviour of non-irradiated and irradiated silicon pixel sensors and further work on 3D simulation is underway.

Design optimization of pixel sensors using device simulations for the phase-II CMS tracker upgrade

Energy Technology Data Exchange (ETDEWEB)

Jain, G., E-mail: geetikajain.hep@gmail.com [CDRST, Department of Physics & Astrophysics, University of Delhi, Delhi (India); Bhardwaj, A.; Dalal, R. [CDRST, Department of Physics & Astrophysics, University of Delhi, Delhi (India); Eber, R. [Institute fur Experimentelle Kernphysik (Germany); Eichorn, T. [Deutsches Elektronen Synchrotron (Germany); Fernandez, M. [Instituto de Fisica de Cantabria (Spain); Lalwani, K. [CDRST, Department of Physics & Astrophysics, University of Delhi, Delhi (India); Messineo, A. [Universita di Pisa & INFN sez. di Pisa (Italy); Palomo, F.R. [Escuela Superior de Ingenieros, Universidad de Sevilla (Spain); Peltola, T. [Helsinki Institute of Physics (Finland); Printz, M. [Institute fur Experimentelle Kernphysik (Germany); Ranjan, K. [CDRST, Department of Physics & Astrophysics, University of Delhi, Delhi (India); Villa, I. [Instituto de Fisica de Cantabria (Spain); Hidalgo, S. [Instituto de Microelectronica de Barcelona, Centro Nacional de Microelectronica (Spain)

2016-07-11

In order to address the problems caused by the harsh radiation environment during the high luminosity phase of the LHC (HL-LHC), all silicon tracking detectors (pixels and strips) in the CMS experiment will undergo an upgrade. And so to develop radiation hard pixel sensors, simulations have been performed using the 2D TCAD device simulator, SILVACO, to obtain design parameters. The effect of various design parameters like pixel size, pixel depth, implant width, metal overhang, p-stop concentration, p-stop depth and bulk doping density on the leakage current and critical electric field are studied for both non-irradiated as well as irradiated pixel sensors. These 2D simulation results of planar pixels are useful for providing insight into the behaviour of non-irradiated and irradiated silicon pixel sensors and further work on 3D simulation is underway.

\\title{MARS15 Simulation Studies in the CMS Detector of Some LHC Beam Accident Scenarios}

CERN Document Server

Bhat, Pushpalatha C; Striganov, S.I; Singh, Amandeep

2009-01-01

\\begin{abstract} The CMS tracker, made of silicon strips and pixels and silicon-based electronics, is vulnerable to effects of radiation exposure during the LHC operation. Of much concern is the potential for damage from a high instantaneous dose to the pixel detectors and electronics located only a few centimeters from the beam in the event of a fast accidental beam loss. One of the worst case scenarios for such a beam loss is an unintended firing of an abort kicker module, referred to as the kicker pre-fire. MARS15 simulation studies of radiation loads in CMS for the kicker pre-fire scenario are described in this paper. It is found that, in a kicker pre-fire accident, in a time span of about 100 ns, the innermost pixel layer may see a radiation dose of about 0.02 Gy \\-- equivalent to a fluence of $\\sim 6\\times 10^{7}$ MIPs/$cm^2$. No discernible damage to the pixel detectors or the electronics were seen at these levels of fluence in recent beam tests. We note that the dose is about 1000 times smaller t...

ATLAS Pixel Detector Operational Experience

CERN Document Server

Di Girolamo, B; The ATLAS collaboration

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 96.9% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

Detector Performance and Upgrade Plans of the Pixel Luminosity Telescope for Online per-Bunch Luminosity Measurement at CMS

CERN Document Server

CMS Collaboration

2017-01-01

The Pixel Luminosity Telescope (PLT) is a dedicated system for luminosity measurement at the CMS experiment using silicon pixel sensors. It was installed during LS1 and has been providing luminosity measurements throughout Run 2. The online bunch-by-bunch luminosity measurement employs the "fast-or" capability of the pixel readout chip (PSI46) to quickly identify likely tracks at the full 40MHz interaction rate. In addition, the full pixel information is read out at a lower rate, allowing for more detailed offline analysis. In this talk, we will present details of the commissioning, performance and operational history of the currently installed hardware and upgrade plans for LS2.

Qualification Procedures of the CMS Pixel Barrel Modules

CERN Document Server

Starodumov, A; Horisberger, R.; Kastli, H.Chr.; Kotlinski, D.; Langenegger, U.; Meier, B.; Rohe, T.; Trueb, P.

2006-01-01

The CMS pixel barrel system will consist of three layers built of about 800 modules. One module contains 66560 readout channels and the full pixel barrel system about 48 million channels. It is mandatory to test each channel for functionality, noise level, trimming mechanism, and bump bonding quality. Different methods to determine the bump bonding yield with electrical measurements have been developed. Measurements of several operational parameters are also included in the qualification procedure. Among them are pixel noise, gains and pedestals. Test and qualification procedures of the pixel barrel modules are described and some results are presented.

Tests of a high rate pixel detector for CMS upgrade

Energy Technology Data Exchange (ETDEWEB)

Mersi, Stefano [Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States). et al.

2013-07-13

This is a Technical Scope of Work (TSW) between the Fermi National Accelerator Laboratory (Fermilab) and the experimenters of the CMS Pixel group, which consists of individuals from the Bristol University, CERN, Fermilab, Rutherford Laboratory (UK), and National Taiwan University who have committed to participate in beam tests to be carried out during the 2013 - 2014 Fermilab Test Beam Facility program. The TSW is intended solely for the purpose of recording expectations for budget estimates and work allocations for Fermilab, the funding agencies and the participating institutions. It reflects an arrangement that currently is satisfactory to the parties; however, it is recognized and anticipated that changing circumstances of the evolving research program will necessitate revisions. The parties agree to modify this TSW to reflect such required adjustments. Actual contractual obligations will be set forth in separate documents. This TSW fulfills Article 1 (facilities and scope of work) of the User Agreements signed (or still

CMS General Poster 2009 : to raise awareness of CMS, the CMS detector, its parts and people

CERN Multimedia

CMS outreach

2012-01-01

A poster which is identical to the two inside pages of the CMS brochure. The poster contains an image of a cross section of the CMS detector, explanation of detector parts, the aims of the CMS experiment and numbers of scientists and institutions associated with the experiment.

The CMS detector before closure

CERN Multimedia

Patrice Loiez

2006-01-01

The CMS detector before testing using muon cosmic rays that are produced as high-energy particles from space crash into the Earth's atmosphere generating a cascade of energetic particles. After closing CMS, the magnets, calorimeters, trackers and muon chambers were tested on a small section of the detector as part of the magnet test and cosmic challenge. This test checked the alignment and functionality of the detector systems, as well as the magnets.

Performance of the Pixel Luminosity Telescope for Luminosity Measurement at CMS during Run 2

CERN Document Server

CMS Collaboration

2017-01-01

The Pixel Luminosity Telescope (PLT) is a dedicated system for luminosity measurement at the CMS experiment using silicon pixel sensors arranged into "telescopes", each consisting of three planes. It was installed during LS1 at the beginning of 2015 and has been providing online and offline luminosity measurements throughout Run 2. The online bunch-by-bunch luminosity measurement employs the "fast-or" capability of the pixel readout chip (PSI46) to identify events where a hit is registered in all three sensors in a telescope corresponding primarily to tracks originating from the interaction point. In addition, the full pixel information is read out at a lower rate, allowing for the calculation of corrections to the online luminosity from effects such as the miscounting of tracks not originating from the interaction point and detector efficiency. In this talk, we will present results from 2016 running and preliminary 2017 results, including commissioning and operational history, luminosity calibration using Va...

Commissioning studies on the Phase I pixel detector of CMS in early 2017 proton-proton collisions at 13 TeV

CERN Document Server

CMS Collaboration

2017-01-01

Algorithms that identify jets originating from heavy (bottom or charmed) hadrons rely heavily on the reconstruction of charged particle tracks inside those jets. Recently the innermost part of the CMS tracking detector, also referred to as the Pixel detector, was extended with a fourth layer which is located closer to the beampipe. On top of that, thanks to a new readout chip, this upgrade allows to record at a higher rate to be able to cope with the increasing luminosity at the LHC. These changes have an impact on the track reconstruction and may therefore affect for example the measured values of the impact parameter (IP) of reconstructed tracks (and the uncertainty on this value), which is an important variable in the identification of heavy flavour jets. We present here the distributions of the IP value and significance (defined as the value divided by its uncertainty) as well as the CSVv2 b tagging discriminator in early 2017 proton-proton collisions at a center-of-mass energy of 13 TeV recorded by the C...

The CMS all silicon Tracker simulation

CERN Document Server

Biasini, Maurizio

2009-01-01

The Compact Muon Solenoid (CMS) tracker detector is the world's largest silicon detector with about 201 m$^2$ of silicon strips detectors and 1 m$^2$ of silicon pixel detectors. It contains 66 millions pixels and 10 million individual sensing strips. The quality of the physics analysis is highly correlated with the precision of the Tracker detector simulation which is written on top of the GEANT4 and the CMS object-oriented framework. The hit position resolution in the Tracker detector depends on the ability to correctly model the CMS tracker geometry, the signal digitization and Lorentz drift, the calibration and inefficiency. In order to ensure high performance in track and vertex reconstruction, an accurate knowledge of the material budget is therefore necessary since the passive materials, involved in the readout, cooling or power systems, will create unwanted effects during the particle detection, such as multiple scattering, electron bremsstrahlung and photon conversion. In this paper, we present the CM...

CMS Tracker Alignment Performance Results Start-Up 2017

CERN Document Server

CMS Collaboration

2017-01-01

During the LHC shutdown in Winter 2016/17, the CMS pixel detector, the inner component of the CMS Tracker, was replaced by the Phase-1 upgrade detector. Among others improvements, the new pixel detector consists of four instead of three layers in the central barrel region (BPIX) and three instead of two disks in the endcap regions (FPIX). In this report, performance plots of the first pixel-detector alignment results are presented, which were obtained with cosmic-ray data taken prior to the start of the 2017 LHC pp operation. Alignment constants have been derived using the data collected initially at 0T and later at 3.8T magnetic field to the level of single module positions in the pixel detector, while keeping the alignment parameters of the strip detector fixed at the values determined in the end of 2016. The complete understanding of the alignment and biases was derived by using two algorithms, Millepede-II and HipPy. The results confirm each other.

The ATLAS Pixel Detector

CERN Document Server

Huegging, Fabian

2006-06-26

The contruction of the ATLAS Pixel Detector which is the innermost layer of the ATLAS tracking system is prgressing well. Because the pixel detector will contribute significantly to the ATLAS track and vertex reconstruction. The detector consists of identical sensor-chip-hybrid modules, arranged in three barrels in the centre and three disks on either side for the forward region. The position of the detector near the interaction point requires excellent radiation hardness, mechanical and thermal robustness, good long-term stability for all parts, combined with a low material budget. The final detector layout, new results from production modules and the status of assembly are presented.

ATLAS ITk Pixel detector

CERN Document Server

Gemme, Claudia; The ATLAS collaboration

2016-01-01

The high luminosity upgrade of the LHC (HL-LHC) in 2026 will provide new challenge to the ATLAS tracker. The current inner detector will be replaced with a whole silicon tracker which will consist of a five barrel layer Pixel detector surrounded by a four barrel layer Strip detector. The expected high radiation level are requiring the development of upgraded silicon sensors as well as new a front-end chip. The dense tracking environment will require finer granularity detectors. The data rates will require new technologies for high bandwidth data transmission and handling. The current status of the HL-LHC ATLA Pixel detector developments as well as the various layout options will be reviewed.

Pixelated CdZnTe drift detectors

DEFF Research Database (Denmark)

Kuvvetli, Irfan; Budtz-Jørgensen, Carl

2005-01-01

A technique, the so-called Drift Strip Method (DSM), for improving the CdZnTe detector energy response to hard X-rays and gamma-rays was applied as a pixel geometry. First tests have confirmed that this detector type provides excellent energy resolution and imaging performance. We specifically...... report on the performance of 3 mm thick prototype CZT drift pixel detectors fabricated using material from eV-products. We discuss issues associated with detector module performance. Characterization results obtained from several prototype drift pixel detectors are presented. Results of position...

LHCC COMPREHENSIVE REVIEW OF CMS (JULY 07)

CERN Multimedia

Extract from the Draft Report 1. EXECUTIVE SUMMARY The CMS Collaboration has made significant progress towards producing a detector ready for LHC operation in 2008. The past year saw all sub-detector groups success fully produce high-quality components and modules, and integrate them into the final objects to be installed into the CMS magnet. Installation and commissioning of final components in the CMS UXC55 cavern are well-under-way. In particular, the heavy lowering of detector elements into the CMS experiment cavern is a major success. The new CMS master schedule V36 incorporates the revised LHC machine schedule and includes an optimized detector sequencing. In spite of various delays, it remains possible that CMS will have an initial detector ready to exploit the initial LHC run in spring 2008. Installation of the Electromagnetic Calorimeter End-Cap (EE) and Pre-shower (ES) detectors is scheduled to be completed no sooner than July 2008 and CMS now plans to install the complete Pixel Detector for ...

A 65 nm CMOS analog processor with zero dead time for future pixel detectors

Energy Technology Data Exchange (ETDEWEB)

Gaioni, L., E-mail: luigi.gaioni@unibg.it [Università di Bergamo, I-24044 Dalmine (Italy); INFN, Sezione di Pavia, I-27100 Pavia (Italy); Braga, D.; Christian, D.C.; Deptuch, G.; Fahim, F. [Fermi National Accelerator Laboratory, Batavia IL (United States); Nodari, B. [Università di Bergamo, I-24044 Dalmine (Italy); INFN, Sezione di Pavia, I-27100 Pavia (Italy); Centre National de Recherche Scientifique, APC/IN2P3, Paris (France); Ratti, L. [Università di Pavia, I-27100 Pavia (Italy); INFN, Sezione di Pavia, I-27100 Pavia (Italy); Re, V. [Università di Bergamo, I-24044 Dalmine (Italy); INFN, Sezione di Pavia, I-27100 Pavia (Italy); Zimmerman, T. [Fermi National Accelerator Laboratory, Batavia IL (United States)

2017-02-11

Next generation pixel chips at the High-Luminosity (HL) LHC will be exposed to extremely high levels of radiation and particle rates. In the so-called Phase II upgrade, ATLAS and CMS will need a completely new tracker detector, complying with the very demanding operating conditions and the delivered luminosity (up to 5×10{sup 34} cm{sup −2} s{sup −1} in the next decade). This work is concerned with the design of a synchronous analog processor with zero dead time developed in a 65 nm CMOS technology, conceived for pixel detectors at the HL-LHC experiment upgrades. It includes a low noise, fast charge sensitive amplifier featuring a detector leakage compensation circuit, and a compact, single ended comparator that guarantees very good performance in terms of channel-to-channel dispersion of threshold without needing any pixel-level trimming. A flash ADC is exploited for digital conversion immediately after the charge amplifier. A thorough discussion on the design of the charge amplifier and the comparator is provided along with an exhaustive set of simulation results.

Study of a Level-3 Tau Trigger with the Pixel Detector

CERN Document Server

Kotlinski, Danek; Nikitenko, Alexander

2001-01-01

We present a Monte Carlo study of the performance of a Level-3 Tau trigger based on the Pixel Detector data. The trigger is designed to select of the Higgs bosons decaying into two tau leptons with tau jet(s) in the final state. The proposed trigger is particularly useful as it operates at an early stage of the CMS High Level Trigger system. The performance of the trigger is studied for the most difficult case of high luminosity LHC scenario.

Performance of New and Upgraded Detectors for Luminosity and Beam Condition Measurement at CMS

CERN Document Server

Leonard, Jessica Lynn

2015-01-01

The beam monitoring and luminosity systems of the CMS experiment are enhanced by several new and upgraded sub-detectors to match the challenges of the LHC operation and physics program at increased energy and higher luminosity. A dedicated pixelated luminosity telescope is installed for a fast and precise luminosity measurement. This detector measures coincidences between several three-layer telescopes of silicon pixel detectors to arrive at luminosity for each colliding LHC bunch pair. An upgraded fast beam conditions monitor measures the particle flux using single crystalline diamond sensors. It is equipped with a dedicated front-end ASIC produced in 130 nm CMOS technology. The excellent time resolution is used to separate collision products from machine induced background, thus serving as online luminosity measurement. A new beam-halo monitor at larger radius exploits Cerenkov light from fused silica to provide direction sensitivity and excellent time resolution to separate incoming and outgoing particles....

Operational experience of the ATLAS Pixel detector

CERN Document Server

Hirschbuehl, D; The ATLAS collaboration

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

Operational experience of the ATLAS Pixel Detector

CERN Document Server

Marcisovsky, M; The ATLAS collaboration

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

Gas pixel detectors

International Nuclear Information System (INIS)

Bellazzini, R.; Baldini, L.; Brez, A.; Cavalca, F.; Latronico, L.; Massai, M.M.; Minuti, M.; Omodei, N.; Pesce-Rollins, M.; Sgro, C.; Spandre, G.; Costa, E.; Soffitta, P.

2007-01-01

With the Gas Pixel Detector (GPD), the class of micro-pattern gas detectors has reached a complete integration between the gas amplification structure and the read-out electronics. To obtain this goal, three generations of application-specific integrated circuit of increased complexity and improved functionality has been designed and fabricated in deep sub-micron CMOS technology. This implementation has allowed manufacturing a monolithic device, which realizes, at the same time, the pixelized charge-collecting electrode and the amplifying, shaping and charge measuring front-end electronics of a GPD. A big step forward in terms of size and performances has been obtained in the last version of the 0.18 μm CMOS analog chip, where over a large active area of 15x15 mm 2 a very high channel density (470 pixels/mm 2 ) has been reached. On the top metal layer of the chip, 105,600 hexagonal pixels at 50 μm pitch have been patterned. The chip has customable self-trigger capability and includes a signal pre-processing function for the automatic localization of the event coordinates. In this way, by limiting the output signal to only those pixels belonging to the region of interest, it is possible to reduce significantly the read-out time and data volume. In-depth tests performed on a GPD built up by coupling this device to a fine pitch (50 μm) gas electron multiplier are reported. Matching of the gas amplification and read-out pitch has let to obtain optimal results. A possible application of this detector for X-ray polarimetry of astronomical sources is discussed

Operational Experience with the ATLAS Pixel Detector

CERN Document Server

Djama, Fares; The ATLAS collaboration

2017-01-01

Run 2 of the LHC collider sets new challenges to track and vertex reconstruction because of its higher energy, pileup and luminosity. The ATLAS tracking performance relies critically on the Pixel Detector. Therefore, in view of Run 2, the ATLAS collaboration has constructed the first 4-layer pixel detector in Particle Physics by installing a new pixel layer, called Insertable B-Layer (IBL). Operational experience and performance of the 4-layer Pixel Detector during Run 2 are presented.

The ALICE Silicon Pixel Detector System (SPD)

CERN Document Server

Kluge, A; Antinori, Federico; Burns, M; Cali, I A; Campbell, M; Caselle, M; Ceresa, S; Dima, R; Elias, D; Fabris, D; Krivda, Marian; Librizzi, F; Manzari, Vito; Morel, M; Moretto, Sandra; Osmic, F; Pappalardo, G S; Pepato, Adriano; Pulvirenti, A; Riedler, P; Riggi, F; Santoro, R; Stefanini, G; Torcato De Matos, C; Turrisi, R; Tydesjo, H; Viesti, G; PH-EP

2007-01-01

The ALICE silicon pixel detector (SPD) comprises the two innermost layers of the ALICE inner tracker system. The SPD includes 120 detector modules (half-staves) each consisting of 10 ALICE pixel chips bump bonded to two silicon sensors and one multi-chip read-out module. Each pixel chip contains 8192 active cells, so that the total number of pixel cells in the SPD is ≈ 107. The on-detector read-out is based on a multi-chip-module containing 4 ASICs and an optical transceiver module. The constraints on material budget and detector module dimensions are very demanding.

Small pitch pixel sensors for the CMS Phase II upgrade

CERN Document Server

AUTHOR|(CDS)2069790

2016-01-01

The CMS collaboration has undertaken two sensor R\\&D programs on thin n-in-p planar and 3D silicon sensor technologies. To cope with the increase in instantaneous luminosity, the pixel area has to be reduced to approximately 2500 $\\mu$m$^{2}$ to keep the occupancy at the percent level. Suggested pixel cell geometries to match this requirement are {50$\\times$50 }$\\mu$...

Interactive Slice of the CMS detector

CERN Multimedia

Davis, Siona Ruth

2016-01-01

This slice shows a colorful cross-section of the CMS detector with all parts of the detector labelled. Viewers are invited to click on buttons associated with five types of particles to see what happens when each type interacts with the sections of the detector. The five types of particles users can select to send through the slice are muons, electrons, neutral hadrons, charged hadrons and photons. Supplementary information on each type of particles is given. Useful for inclusion into general talks on CMS etc. *Animated CMS "slice" for Powerpoint (Mac & PC) Original version - 2004 Updated version - July 2010 *Six slides required - first is a set of buttons; others are for each particle type (muon, electron, charged/neutral hadron, photon) Recommend putting slide 1 anywhere in your presentation and the rest at the end

Applying Statistical Mechanics to pixel detectors

International Nuclear Information System (INIS)

Pindo, Massimiliano

2002-01-01

Pixel detectors, being made of a large number of active cells of the same kind, can be considered as significant sets to which Statistical Mechanics variables and methods can be applied. By properly redefining well known statistical parameters in order to let them match the ones that actually characterize pixel detectors, an analysis of the way they work can be performed in a totally new perspective. A deeper understanding of pixel detectors is attained, helping in the evaluation and comparison of their intrinsic characteristics and performance

Operational experience with the ATLAS Pixel Detector

CERN Document Server

Ince, T; The ATLAS collaboration

2012-01-01

The ATLAS Pixel Detector is the innermost element of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 96.2% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

The Development of silicon detectors for the CMS experiment and future experiments

CERN Document Server

Son, Seunghee

A hybrid pixel detector will be installed as the inner most layer of the tracking system of the CMS experiment, currently under construction at the Large Hardron Collider (LHC) at CERN (Geneva, Switzerland) to provide high resolution tracking and vertex identification. Due to the severe radiation environment of the LHC, the performance of the sensors must be carefully evaluated up to a fluence of 6 × 1014 1-MeV equivalent neutrons per square centimeter. The sensors were fabricated "n on n", which means highly segmented n+ implants with 150 × 100 μm2 pitch are in n-type bulk material and p+ implants are used to isolate pixels. The electrical properties of these sensors has been studied. Studies of charge collection efficiency were carried out with a 1064 nm wavelength laser. Comparisons of charge collection efficiency among different sensor designs is presented. In addition, present and future possibilities for the production of thin silicon detectors are discussed. The electrical characteristics and the pe...

Small Pixel Hybrid CMOS X-ray Detectors

Science.gov (United States)

Hull, Samuel; Bray, Evan; Burrows, David N.; Chattopadhyay, Tanmoy; Falcone, Abraham; Kern, Matthew; McQuaide, Maria; Wages, Mitchell

2018-01-01

Concepts for future space-based X-ray observatories call for a large effective area and high angular resolution instrument to enable precision X-ray astronomy at high redshift and low luminosity. Hybrid CMOS detectors are well suited for such high throughput instruments, and the Penn State X-ray detector lab, in collaboration with Teledyne Imaging Sensors, has recently developed new small pixel hybrid CMOS X-ray detectors. These prototype 128x128 pixel devices have 12.5 micron pixel pitch, 200 micron fully depleted depth, and include crosstalk eliminating CTIA amplifiers and in-pixel correlated double sampling (CDS) capability. We report on characteristics of these new detectors, including the best read noise ever measured for an X-ray hybrid CMOS detector, 5.67 e- (RMS).

The pin pixel detector--neutron imaging

CERN Document Server

Bateman, J E; Derbyshire, G E; Duxbury, D M; Marsh, A S; Rhodes, N J; Schooneveld, E M; Simmons, J E; Stephenson, R

2002-01-01

The development and testing of a neutron gas pixel detector intended for application in neutron diffraction studies is reported. Using standard electrical connector pins as point anodes, the detector is based on a commercial 100 pin connector block. A prototype detector of aperture 25.4 mmx25.4 mm has been fabricated, giving a pixel size of 2.54 mm which matches well to the spatial resolution typically required in a neutron diffractometer. A 2-Dimensional resistive divide readout system has been adapted to permit the imaging properties of the detector to be explored in advance of true pixel readout electronics. The timing properties of the device match well to the requirements of the ISIS-pulsed neutron source.

Detector and event visualization with sketchup at the CMS experiment

International Nuclear Information System (INIS)

Sakuma, Tai; McCauley, Thomas

2014-01-01

We have created 3D models of the CMS detector and particle collision events in SketchUp, a 3D modelling program. SketchUp provides a Ruby API which we use to interface with the CMS Detector Description to create 3D models of the CMS detector. With the Ruby API, we also have created an interface to the JSON-based event format used for the iSpy event display to create 3D models of CMS events. These models have many applications related to 3D representation of the CMS detector and events. Figures produced based on these models were used in conference presentations, journal publications, technical design reports for the detector upgrades, art projects, outreach programs, and other presentations

New CMS detectors under construction at CERN

CERN Multimedia

Katarina Anthony

2012-01-01

While the LHC will play the starring role in the 2013/2014 Long Shutdown (LS1), the break will also be a chance for its experiments to upgrade their detectors. CMS will be expanding its current muon detection systems, fitting 72 new cathode strip chambers (CSC) and 144 new resistive plate chambers (RPC) to the endcaps of the detector. These new chambers are currently under construction in Building 904.   CMS engineers install side panels on a CSC detector in Building 904. "The original RPC and CSC detectors were constructed in bits and pieces around the world," says Armando Lanaro, CSC construction co-ordinator. "But for the construction of these additional chambers, we decided to unify the assembly and testing into a single facility at CERN. There, CMS technicians, engineers and physicists are taking raw materials and transforming them into installation-ready detectors.” This new facility can be found in Building 904. Once the assembly site for the strai...

The CT-PPS project detector hardware and operational experience

CERN Document Server

Ravera, Fabio

2017-01-01

The CMS-TOTEM Precision Proton Spectrometer allows extending the LHC physics program by measuring protons in the very forward regions of CMS. Tracking and timing detectors have been installed along the beam pipe at $\\sim 210$~m from the CMS interaction point on both sides of the LHC tunnel. The tracking system consists of a station of silicon strip detectors and one of silicon pixel detectors on each side. The latter is composed of six planes of 3D silicon pixel sensors bump-bonded to the PSI46dig ROC developed for the CMS Phase I Pixel Tracker upgrade. A track resolution of $\\sim 10$~$\\mu$m is obtained. The future goal is to replace the present strip stations with pixel ones in order to ensure better multi-track reconstruction. Each timing station is made of three planes of diamond detectors and one plane equipped with an Ultra-Fast Silicon Detector (UFSD). A timing resolution of a few tens of picoseconds can be achieved with the present detector; a large R\\&D effort is ongoing to reach the $10$~ps targ...

Operational Experience with the ATLAS Pixel Detector

CERN Document Server

Djama, Fares; The ATLAS collaboration

2017-01-01

Run-2 of the LHC is providing new challenges to track and vertex reconstruction imposed by the higher collision energy, pileup and luminosity that are being delivered. The ATLAS tracking performance relies critically on the Pixel Detector, therefore, in view of Run-2 of LHC, the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during run-1 and an additional optical link per module was added to overcome in some layers the readout bandwidth limitation when LHC will exceed the nominal peak luminosity by almost a factor of 3. The key features and challenges met during the IBL project will be presented, as well as its operational experience and Pixel Detector performance in LHC.

CMS Tracker Alignment Performance Results Summer 2016

CERN Document Server

CMS Collaboration

2016-01-01

The tracking system of the CMS detector provides excellent resolution for charged particle tracks and an efficient way of tagging jets. In order to reconstruct good quality tracks, the position and orientation of each silicon pixel and strip modules need to be determined with a precision of several micrometers. The performance of the CMS tracker alignment in 2016 using cosmic-ray data recorded at 0 T magnetic field and proton-proton collision data recorded at 3.8 T magnetic field has been studied. The data-driven validation of the results are presented. The time-dependent movement of the pixel detector's large-scale structure is demonstrated.

CMS inner detector assembled in a clean room

CERN Multimedia

Serge Bellegarde

2006-01-01

The inner detector for the CMS experiment is assembled in a specially designed clean room. These rooms are sealed so that impurities in the air do not get trapped in the detector while it is being assembled. This inner detector will eventually be installed at the heart of the CMS experiment, taking measurements of particles produced in the collision of either proton or lead beams.

Operational Experience with the ATLAS Pixel Detector

CERN Document Server

Lantzsch, Kerstin; The ATLAS collaboration

2016-01-01

Run 2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). In addition the Pixel detector was refurbished with new service quarter panels to recover about 3% of defective modules lost during run 1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning, operation and performance of the 4-layer Pixel Detector will be presented.

The CMS Beam Halo Monitor Detector System

CERN Document Server

CMS Collaboration

2015-01-01

A new Beam Halo Monitor (BHM) detector system has been installed in the CMS cavern to measure the machine-induced background (MIB) from the LHC. This background originates from interactions of the LHC beam halo with the final set of collimators before the CMS experiment and from beam gas interactions. The BHM detector uses the directional nature of Cherenkov radiation and event timing to select particles coming from the direction of the beam and to suppress those originating from the interaction point. It consists of 40 quartz rods, placed on each side of the CMS detector, coupled to UV sensitive PMTs. For each bunch crossing the PMT signal is digitized by a charge integrating ASIC and the arrival time of the signal is recorded. The data are processed in real time to yield a precise measurement of per-bunch-crossing background rate. This measurement is made available to CMS and the LHC, to provide real-time feedback on the beam quality and to improve the efficiency of data taking. In this talk we will describ...

Highlights from CMS

CERN Document Server

Autermann, Christian

2018-01-01

This article summarizes the latest highlights from the CMS experiment as presented at the Lepton Photon conference 2017 in Guangzhou, China. A selection of the latest physics results, the latest detector upgrades, and the current detector status are discussed. CMS has analyzed the full dataset of proton-proton collision data delivered by the LHC in 2016 at a center-of-mass energy of $13$\\,TeV corresponding to an integrated luminosity of $40$\\,fb$^{-1}$. The leap in center-of-mass energy and in luminosity with respect to the $7$ and $8$\\,TeV runs enabled interesting and relevant new physics results. A new silicon pixel tracking detector was installed during the LHC shutdown 2016/17 and has successfully started operation.

A silicon pixel detector prototype for the CLIC vertex detector

CERN Multimedia

AUTHOR|(INSPIRE)INSPIRE-00714258

2017-01-01

A silicon pixel detector prototype for CLIC, currently under study for the innermost detector surrounding the collision point. The detector is made of a High-Voltage CMOS sensor (top) and a CLICpix2 readout chip (bottom) that are glued to each other. Both parts have a size of 3.3 x 4.0 $mm^2$ and consist of an array of 128 x 128 pixels of 25 x 25 $\\micro m^2$ size.

Pixel Detectors for Particle Physics and Imaging Applications

CERN Document Server

Wermes, N

2003-01-01

Semiconductor pixel detectors offer features for the detection of radiation which are interesting for particle physics detectors as well as for imaging e.g. in biomedical applications (radiography, autoradiography, protein crystallography) or in Xray astronomy. At the present time hybrid pixel detectors are technologically mastered to a large extent and large scale particle detectors are being built. Although the physical requirements are often quite different, imaging applications are emerging and interesting prototype results are available. Monolithic detectors, however, offer interesting features for both fields in future applications. The state of development of hybrid and monolithic pixel detectors, excluding CCDs, and their different suitability for particle detection and imaging, is reviewed.

CMS Tracker Alignment Performance Results 2016

CERN Document Server

CMS Collaboration

2017-01-01

The tracking system of the CMS detector provides excellent resolution for charged particle tracks and an efficient way of tagging jets. In order to reconstruct good quality tracks, the position and orientation of each silicon pixel and strip module needs to be determined with a precision of several micrometers. The presented alignment results are derived following a global (Millepede-II) and a local (HipPy) fit approach. The performance of the CMS tracker alignment in 2016 using cosmic-ray data and the complete set of proton-proton collision data recorded at 3.8 T magnetic field has been studied. The data-driven validation of the results are shown. The time-dependent movement of the pixel detector's large-scale structure is demonstrated.

Progress on CMS detector lowering

CERN Multimedia

2006-01-01

It was an amazing engineering challenge - the lowering of the first hugeendcap disc (YE+3) of the CMS detector slowly and carefully 100 metres underground. The spectacular descent took place on 30 November and was documented by a film crew from Reuters news group. The uniquely shaped slice is 16 m high, about 50 cm thick, and weighs 400 tonnes. It is one of 15 sections that make up the complete CMS detector. The solid steel structure of the disc forms part of the magnet return yoke and is equipped on both sides with muon chambers. A special gantry crane lowered the element, with just 20 cm of leeway between the edges of the detector and the walls of the shaft! On 12 December, a further section of the detector (YE+2) containing the cathode strip chamber made the 10-hour journey underground. This piece is 16 m high and weighs 880 tonnes. There are now four sections of the detector in the experimental cavern, with a further 11 to follow. The endcap disc YE+3 (seen in the foreground) begins its journey down the ...

Challenges of small-pixel infrared detectors: a review.

Science.gov (United States)

Rogalski, A; Martyniuk, P; Kopytko, M

2016-04-01

In the last two decades, several new concepts for improving the performance of infrared detectors have been proposed. These new concepts particularly address the drive towards the so-called high operating temperature focal plane arrays (FPAs), aiming to increase detector operating temperatures, and as a consequence reduce the cost of infrared systems. In imaging systems with the above megapixel formats, pixel dimension plays a crucial role in determining critical system attributes such as system size, weight and power consumption (SWaP). The advent of smaller pixels has also resulted in the superior spatial and temperature resolution of these systems. Optimum pixel dimensions are limited by diffraction effects from the aperture, and are in turn wavelength-dependent. In this paper, the key challenges in realizing optimum pixel dimensions in FPA design including dark current, pixel hybridization, pixel delineation, and unit cell readout capacity are outlined to achieve a sufficiently adequate modulation transfer function for the ultra-small pitches involved. Both photon and thermal detectors have been considered. Concerning infrared photon detectors, the trade-offs between two types of competing technology-HgCdTe material systems and III-V materials (mainly barrier detectors)-have been investigated.

Operational Experience with the ATLAS Pixel Detector at LHC

CERN Document Server

Keil, M

2013-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus crucial for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via front-end chips bump-bonded to 1744 n-on-n silicon substrates. In this paper results from the successful operation of the Pixel Detector at the LHC will be presented, including calibration procedures, detector performance and measurements of radiation damage. The detector performance is excellent: more than 95% of the pixels are operational, noise occupancy and hit efficiency exceed the des...

Pixel detector readout chip

CERN Multimedia

1991-01-01

Close-up of a pixel detector readout chip. The photograph shows an aera of 1 mm x 2 mm containing 12 separate readout channels. The entire chip contains 1000 readout channels (around 80 000 transistors) covering a sensitive area of 8 mm x 5 mm. The chip has been mounted on a silicon detector to detect high energy particles.

Detector performance of the ALICE silicon pixel detector

CERN Document Server

Cavicchioli, C

2011-01-01

The ALICE Silicon Pixel Detector (SPD) forms the two innermost layers of the ALICE Inner Tracking System (ITS). It consists of two barrel layers of hybrid silicon pixel detectors at radii of 39 and 76 mm. The physics targets of the ALICE experiment require that the material budget of the SPD is kept within approximate to 1\\%X(0) per layer. This has set some stringent constraints on the design and construction of the SPD. A unique feature of the ALICE SPD is that it is capable of providing a prompt trigger signal, called Fast-OR, which contributes to the L0 trigger decision. The pixel trigger system allows to apply a set of algorithms for the trigger selection, and its output is sent to the Central Trigger Processor (CTP). The detector has been installed in the experiment in summer 2007. During the first injection tests in June 2008 the SPD was able to record the very first sign of life of the LHC by registering secondary particles from the beam dumped upstream the ALICE experiment. In the following months the...

Development of pixel readout integrated circuits for extreme rate and radiation

CERN Document Server

Garcia-Sciveres, M; CERN. Geneva. The LHC experiments Committee; LHCC

2013-01-01

Letter of Intent for RD Collaboration Proposal focused on development of a next generation pixel readout integrated circuits needed for high luminosity LHC detector upgrades. Brings together ATLAS and CMS pixel chip design communities.

Upgrade of ATLAS ITk Pixel Detector

CERN Document Server

Huegging, Fabian; The ATLAS collaboration

2017-01-01

The high luminosity upgrade of the LHC (HL-LHC) in 2026 will provide new challenges to the ATLAS tracker. The current inner detector will be replaced with an entirely-silicon inner tracker (ITk) which will consist of a five barrel layer Pixel detector surrounded by a four barrel layer Strip detector. The expected high radiation levels are requiring the development of upgraded silicon sensors as well as new a front-end chip. The dense tracking environment will require finer granularity detectors and low mass global and local support structures. The data rates will require new technologies for high bandwidth data transmission and handling. The current status of the ITk ATLAS Pixel detector developments as well as different layout options will be reviewed.

Development of an Indium Bump Bond Process for Silicon Pixel Detectors at PSI

CERN Document Server

Brönnimann, C; Gobrecht, J; Heising, S; Horisberger, M; Horisberger, R P; Kästli, H C; Lehmann, J; Rohe, T; Streuli, S; Broennimann, Ch.

2006-01-01

The hybrid pixel detectors used in the high energy physics experiments currently under construction use a three dimensional connection technique, the so-called bump bonding. As the pitch below 100um, required in these applications, cannot be fullfilled with standard industrial processes (e.g. the IBM C4 process), an in-house bump bond process using reflown indium bumps was developed at PSI as part of the R&D for the CMS-pixel detector. The bump deposition on the sensor is performed in two subsequent lift-off steps. As the first photolithographic step a thin under bump metalization (UBM) is sputtered onto bump pads. It is wettable by indium and defines the diameter of the bump. The indium is evaporated via a second photolithographic step with larger openings and is reflown afterwards. The height of the balls is defined by the volume of the indium. On the readout chip only one photolithographic step is carried out to deposit the UBM and a thin indium layer for better adhesion. After mating both parts a seco...

Rework of flip chip bonded radiation pixel detectors

International Nuclear Information System (INIS)

Vaehaenen, S.; Heikkinen, H.; Pohjonen, H.; Salonen, J.; Savolainen-Pulli, S.

2008-01-01

In this paper, some practical aspects of reworking flip chip hybridized pixel detectors are discussed. As flip chip technology has been advancing in terms of placement accuracy and reliability, large-area hybrid pixel detectors have been developed. The area requirements are usually fulfilled by placing several readout chips (ROCs) on single sensor chip. However, as the number of ROCs increases, the probability of failure in the hybridization process and the ROC operation also increases. Because high accuracy flip chip bonding takes time, a significant part of the price of a pixel detector comes from the flip chip assembly process itself. As large-area detector substrates are expensive, and many flip chip placements are required, the price of an assembled detector can become very high. In a typical case, there is just one bad ROC (out of several) on a faulty detector to be replaced. Considering the high price of pixel detectors and the fact that reworking faulty ROCs does not take much longer than the original placement, it is worthwhile to investigate the feasibility of a rework process

Rework of flip chip bonded radiation pixel detectors

Energy Technology Data Exchange (ETDEWEB)

Vaehaenen, S. [VTT MEMS and Micropackaging, Espoo 02150 (Finland)], E-mail: sami.vahanen@vtt.fi; Heikkinen, H.; Pohjonen, H.; Salonen, J.; Savolainen-Pulli, S. [VTT MEMS and Micropackaging, Espoo 02150 (Finland)

2008-06-11

In this paper, some practical aspects of reworking flip chip hybridized pixel detectors are discussed. As flip chip technology has been advancing in terms of placement accuracy and reliability, large-area hybrid pixel detectors have been developed. The area requirements are usually fulfilled by placing several readout chips (ROCs) on single sensor chip. However, as the number of ROCs increases, the probability of failure in the hybridization process and the ROC operation also increases. Because high accuracy flip chip bonding takes time, a significant part of the price of a pixel detector comes from the flip chip assembly process itself. As large-area detector substrates are expensive, and many flip chip placements are required, the price of an assembled detector can become very high. In a typical case, there is just one bad ROC (out of several) on a faulty detector to be replaced. Considering the high price of pixel detectors and the fact that reworking faulty ROCs does not take much longer than the original placement, it is worthwhile to investigate the feasibility of a rework process.

Semiconductor Pixel detectors and their applications in life sciences

International Nuclear Information System (INIS)

Jakubek, J

2009-01-01

Recent advances in semiconductor technology allow construction of highly efficient and low noise pixel detectors of ionizing radiation. Steadily improving quality of front end electronics enables fast digital signal processing in each pixel which offers recording of more complete information about each detected quantum (energy, time, number of particles). All these features improve an extend applicability of pixel technology in different fields. Some applications of this technology especially for imaging in life sciences will be shown (energy and phase sensitive X-ray radiography and tomography, radiography with heavy charged particles, neutron radiography, etc). On the other hand a number of obstacles can limit the detector performance if not handled. The pixel detector is in fact an array of individual detectors (pixels), each of them has its own efficiency, energy calibration and also noise. The common effort is to make all these parameters uniform for all pixels. However an ideal uniformity can be never reached. Moreover, it is often seen that the signal in one pixel can affect the neighbouring pixels due to various reasons (e.g. charge sharing). All such effects have to be taken into account during data processing to avoid false data interpretation. A brief view into the future of pixel detectors and their applications including also spectroscopy, tracking and dosimetry is given too. Special attention is paid to the problem of detector segmentation in context of the charge sharing effect.

LISe pixel detector for neutron imaging

Energy Technology Data Exchange (ETDEWEB)

Herrera, Elan; Hamm, Daniel [Department of Nuclear Engineering, University of Tennessee, Knoxville, TN (United States); Wiggins, Brenden [Technology Development, Y-12 National Security Complex, Oak Ridge, TN (United States); Department of Physics and Astronomy, Vanderbilt University, Nashville, TN (United States); Milburn, Rob [Department of Nuclear Engineering, University of Tennessee, Knoxville, TN (United States); Burger, Arnold [Department of Physics and Astronomy, Vanderbilt University, Nashville, TN (United States); Department of Life and Physical Sciences, Fisk University, Nashville, TN (United States); Bilheux, Hassina [Chemical and Engineering Materials Division, Oak Ridge National Laboratory, Oak Ridge, TN (United States); Santodonato, Louis [Instrument and Source Division, Oak Ridge National Laboratory, Oak Ridge National Laboratory, Oak Ridge, TN (United States); Chvala, Ondrej [Department of Nuclear Engineering, University of Tennessee, Knoxville, TN (United States); Stowe, Ashley [Department of Nuclear Engineering, University of Tennessee, Knoxville, TN (United States); Technology Development, Y-12 National Security Complex, Oak Ridge, TN (United States); Department of Physics and Astronomy, Vanderbilt University, Nashville, TN (United States); Lukosi, Eric, E-mail: elukosi@utk.edu [Department of Nuclear Engineering, University of Tennessee, Knoxville, TN (United States)

2016-10-11

Semiconducting lithium indium diselenide, {sup 6}LiInSe{sub 2} or LISe, has promising characteristics for neutron detection applications. The 95% isotopic enrichment of {sup 6}Li results in a highly efficient thermal neutron-sensitive material. In this study, we report on a proof-of-principle investigation of a semiconducting LISe pixel detector to demonstrate its potential as an efficient neutron imager. The LISe pixel detector had a 4×4 of pixels with a 550 µm pitch on a 5×5×0.56 mm{sup 3} LISe substrate. An experimentally verified spatial resolution of 300 µm was observed utilizing a super-sampling technique.

Diamond and silicon pixel detectors in high radiation environments

Energy Technology Data Exchange (ETDEWEB)

Tsung, Jieh-Wen

2012-10-15

Diamond pixel detector is a promising candidate for tracking of collider experiments because of the good radiation tolerance of diamond. The diamond pixel detector must withstand the radiation damage from 10{sup 16} particles per cm{sup 2}, which is the expected total fluence in High Luminosity Large Hadron Collider. The performance of diamond and silicon pixel detectors are evaluated in this research in terms of the signal-to-noise ratio (SNR). Single-crystal diamond pixel detectors with the most recent readout chip ATLAS FE-I4 are produced and characterized. Based on the results of the measurement, the SNR of diamond pixel detector is evaluated as a function of radiation fluence, and compared to that of planar-silicon ones. The deterioration of signal due to radiation damage is formulated using the mean free path of charge carriers in the sensor. The noise from the pixel readout circuit is simulated and calculated with leakage current and input capacitance to the amplifier as important parameters. The measured SNR shows good agreement with the calculated and simulated results, proving that the performance of diamond pixel detectors can exceed the silicon ones if the particle fluence is more than 10{sup 15} particles per cm{sup 2}.

Diamond and silicon pixel detectors in high radiation environments

International Nuclear Information System (INIS)

Tsung, Jieh-Wen

2012-10-01

Diamond pixel detector is a promising candidate for tracking of collider experiments because of the good radiation tolerance of diamond. The diamond pixel detector must withstand the radiation damage from 10 16 particles per cm 2 , which is the expected total fluence in High Luminosity Large Hadron Collider. The performance of diamond and silicon pixel detectors are evaluated in this research in terms of the signal-to-noise ratio (SNR). Single-crystal diamond pixel detectors with the most recent readout chip ATLAS FE-I4 are produced and characterized. Based on the results of the measurement, the SNR of diamond pixel detector is evaluated as a function of radiation fluence, and compared to that of planar-silicon ones. The deterioration of signal due to radiation damage is formulated using the mean free path of charge carriers in the sensor. The noise from the pixel readout circuit is simulated and calculated with leakage current and input capacitance to the amplifier as important parameters. The measured SNR shows good agreement with the calculated and simulated results, proving that the performance of diamond pixel detectors can exceed the silicon ones if the particle fluence is more than 10 15 particles per cm 2 .

The CMS Tracker upgrade for HL-LHC

CERN Document Server

Ahuja, Sudha

2017-01-01

The LHC machine is planning an upgrade program which will smoothly bring the luminosity to about 5 $\\times$ $10^{34} $cm$^{-2}$s$^{-1}$ in 2028, to possibly reach an integrated luminosity of 3000 fb$^{-1}$ by the end of 2037. This High Luminosity LHC scenario, HL-LHC, will require a preparation program of the LHC detectors known as Phase-2 upgrade. The current CMS Outer Tracker, already running beyond design specifications, and CMS Phase1 Pixel Detector will not be able to survive HL-LHC radiation conditions and CMS will need completely new devices, in order to fully exploit the high-demanding operating conditions and the delivered luminosity. The new Outer Tracker should have also trigger capabilities. To achieve such goals, R$\\&$D activities are ongoing to explore options both for the Outer Tracker, and for the pixel Inner Tracker. Solutions are being developed that would allow including tracking information at Level-1. The design choices for the Tracker upgrades are discussed along with some highlights...

First large DEPFET pixel modules for the Belle II Pixel Detector

Energy Technology Data Exchange (ETDEWEB)

Mueller, Felix; Avella, Paola; Kiesling, Christian; Koffmane, Christian; Moser, Hans-Guenther; Valentan, Manfred [Max-Planck-Institut fuer Physik, Muenchen (Germany); Andricek, Ladislav; Richter, Rainer [Halbleiterlabor der Max-Planck-Gesellschaft, Muenchen (Germany); Collaboration: Belle II-Collaboration

2016-07-01

DEPFET pixel detectors offer excellent signal to noise ratio, resolution and low power consumption with a low material budget. They will be used at Belle II and are a candidate for an ILC vertex detector. The pixels are integrated in a monolithic piece of silicon which also acts as PCB providing the signal and control routings for the ASICs on top. The first prototype DEPFET sensor modules for Belle II have been produced. The modules have 192000 pixels and are equipped with SMD components and three different kinds of ASICs to control and readout the pixels. The entire readout chain has to be studied; the metal layer interconnectivity and routings need to be verified. The modules are fully characterized, and the operation voltages and control sequences of the ASICs are investigated. An overview of the DEPFET concept and first characterization results is presented.

ATLAS Pixel Detector Design For HL-LHC

CERN Document Server

Smart, Ben; The ATLAS collaboration

2016-01-01

The ATLAS Inner Detector will be replaced for the High-Luminosity LHC (HL-LHC) running in 2026. The new Inner Detector will be called the Inner Tracker (ITk). The ITk will cover an extended eta-range: at least to |eta|<3.2, and likely up to |eta|<4.0. The ITk will be an all-Silicon based detector, consisting of a Silicon strip detector outside of a radius of 362mm, and a Silicon pixel detector inside of this radius. Several novel designs are being considered for the ITk pixel detector, to cope with high-eta charged particle tracks. These designs are grouped into 'extended' and 'inclined' design-types. Extended designs have long pixel staves with sensors parallel to the beamline. High-eta particles will therefore hit these sensors at shallow angles, leaving elongated charge clusters. The length of such a charge cluster can be used to estimate the angle of the passing particle. This information can then be used in track reconstruction to improve tracking efficiency and reduce fake rates. Inclined designs ...

CVD diamond pixel detectors for LHC experiments

Energy Technology Data Exchange (ETDEWEB)

Wedenig, R.; Adam, W.; Bauer, C.; Berdermann, E.; Bergonzo, P.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Grigoriev, E.; Hallewell, G.; Hall-Wilton, R.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Karl, C.; Kass, R.; Knoepfle, K.T.; Krammer, M.; Logiudice, A.; Lu, R.; Manfredi, P.F.; Manfredotti, C.; Marshall, R.D.; Meier, D.; Mishina, M.; Oh, A.; Pan, L.S.; Palmieri, V.G.; Pernicka, M.; Peitz, A.; Pirollo, S.; Polesello, P.; Pretzl, K.; Procario, M.; Re, V.; Riester, J.L.; Roe, S.; Roff, D.; Rudge, A.; Runolfsson, O.; Russ, J.; Schnetzer, S.; Sciortino, S.; Speziali, V.; Stelzer, H.; Stone, R.; Suter, B.; Tapper, R.J.; Tesarek, R.; Trawick, M.; Trischuk, W.; Vittone, E.; Wagner, A.; Walsh, A.M.; Weilhammer, P.; White, C.; Zeuner, W.; Ziock, H.; Zoeller, M.; Blanquart, L.; Breugnion, P.; Charles, E.; Ciocio, A.; Clemens, J.C.; Dao, K.; Einsweiler, K.; Fasching, D.; Fischer, P.; Joshi, A.; Keil, M.; Klasen, V.; Kleinfelder, S.; Laugier, D.; Meuser, S.; Milgrome, O.; Mouthuy, T.; Richardson, J.; Sinervo, P.; Treis, J.; Wermes, N

1999-08-01

This paper reviews the development of CVD diamond pixel detectors. The preparation of the diamond pixel sensors for bump-bonding to the pixel readout electronics for the LHC and the results from beam tests carried out at CERN are described.

CVD diamond pixel detectors for LHC experiments

International Nuclear Information System (INIS)

Wedenig, R.; Adam, W.; Bauer, C.; Berdermann, E.; Bergonzo, P.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Grigoriev, E.; Hallewell, G.; Hall-Wilton, R.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Karl, C.; Kass, R.; Knoepfle, K.T.; Krammer, M.; Logiudice, A.; Lu, R.; Manfredi, P.F.; Manfredotti, C.; Marshall, R.D.; Meier, D.; Mishina, M.; Oh, A.; Pan, L.S.; Palmieri, V.G.; Pernicka, M.; Peitz, A.; Pirollo, S.; Polesello, P.; Pretzl, K.; Procario, M.; Re, V.; Riester, J.L.; Roe, S.; Roff, D.; Rudge, A.; Runolfsson, O.; Russ, J.; Schnetzer, S.; Sciortino, S.; Speziali, V.; Stelzer, H.; Stone, R.; Suter, B.; Tapper, R.J.; Tesarek, R.; Trawick, M.; Trischuk, W.; Vittone, E.; Wagner, A.; Walsh, A.M.; Weilhammer, P.; White, C.; Zeuner, W.; Ziock, H.; Zoeller, M.; Blanquart, L.; Breugnion, P.; Charles, E.; Ciocio, A.; Clemens, J.C.; Dao, K.; Einsweiler, K.; Fasching, D.; Fischer, P.; Joshi, A.; Keil, M.; Klasen, V.; Kleinfelder, S.; Laugier, D.; Meuser, S.; Milgrome, O.; Mouthuy, T.; Richardson, J.; Sinervo, P.; Treis, J.; Wermes, N.

1999-01-01

This paper reviews the development of CVD diamond pixel detectors. The preparation of the diamond pixel sensors for bump-bonding to the pixel readout electronics for the LHC and the results from beam tests carried out at CERN are described

The pin pixel detector--X-ray imaging

CERN Document Server

Bateman, J E; Derbyshire, G E; Duxbury, D M; Marsh, A S; Simmons, J E; Stephenson, R

2002-01-01

The development and testing of a soft X-ray gas pixel detector, which uses connector pins for the anodes is reported. Based on a commercial 100 pin connector block, a prototype detector of aperture 25.4 mm centre dot 25.4 mm can be economically fabricated. The individual pin anodes all show the expected characteristics of small gas detectors capable of counting rates reaching 1 MHz per pin. A 2-dimensional resistive divide readout system has been developed to permit the imaging properties of the detector to be explored in advance of true pixel readout electronics.

CVD diamond pixel detectors for LHC experiments

CERN Document Server

Wedenig, R; Bauer, C; Berdermann, E; Bergonzo, P; Bogani, F; Borchi, E; Brambilla, A; Bruzzi, Mara; Colledani, C; Conway, J; Dabrowski, W; Delpierre, P A; Deneuville, A; Dulinski, W; van Eijk, B; Fallou, A; Fizzotti, F; Foulon, F; Friedl, M; Gan, K K; Gheeraert, E; Grigoriev, E; Hallewell, G D; Hall-Wilton, R; Han, S; Hartjes, F G; Hrubec, Josef; Husson, D; Kagan, H; Kania, D R; Kaplon, J; Karl, C; Kass, R; Knöpfle, K T; Krammer, Manfred; Lo Giudice, A; Lü, R; Manfredi, P F; Manfredotti, C; Marshall, R D; Meier, D; Mishina, M; Oh, A; Pan, L S; Palmieri, V G; Pernicka, Manfred; Peitz, A; Pirollo, S; Polesello, P; Pretzl, Klaus P; Procario, M; Re, V; Riester, J L; Roe, S; Roff, D G; Rudge, A; Runólfsson, O; Russ, J; Schnetzer, S R; Sciortino, S; Speziali, V; Stelzer, H; Stone, R; Suter, B; Tapper, R J; Tesarek, R J; Trawick, M L; Trischuk, W; Vittone, E; Wagner, A; Walsh, A M; Weilhammer, Peter; White, C; Zeuner, W; Ziock, H J; Zöller, M

1999-01-01

This paper reviews the development of CVD diamond pixel detectors. The preparation of the diamond pixel sensors for bump-bonding to the pixel readout electronics for the LHC and the results from beam tests carried out at CERN are described. (9 refs).

Small-Scale Readout System Prototype for the STAR PIXEL Detector

International Nuclear Information System (INIS)

Szelezniak, Michal; Anderssen, Eric; Greiner, Leo; Matis, Howard; Ritter, Hans Georg; Stezelberger, Thorsten; Sun, Xiangming; Thomas, James; Vu, Chinh; Wieman, Howard

2008-01-01

Development and prototyping efforts directed towards construction of a new vertex detector for the STAR experiment at the RHIC accelerator at BNL are presented. This new detector will extend the physics range of STAR by allowing for precision measurements of yields and spectra of particles containing heavy quarks. The innermost central part of the new detector is a high resolution pixel-type detector (PIXEL). PIXEL requirements are discussed as well as a conceptual mechanical design, a sensor development path, and a detector readout architecture. Selected progress with sensor prototypes dedicated to the PIXEL detector is summarized and the approach chosen for the readout system architecture validated in tests of hardware prototypes is discussed

CMS fact sheet : to give an overview of the basic facts on the CMS Detector, its aims and collaboration

CERN Multimedia

CMS, Outreach

2010-01-01

2-sided color print A4 size sheet containing the facts on the CMS Detector, its name, what it is designed to do, questions scientists hope to answer, collaboration members, detector parts and their functions, and other miscellaneous facts on the CMS detector

Operational Experience with the ATLAS Pixel Detector at the LHC

CERN Document Server

Keil, M; The ATLAS collaboration

2012-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC and its status after three years of operation will be presented, including calibration procedures, timing optimization and detector performance. The detector performance is excellent: ~96 % of the pixels are operational, noise occupancy and hit efficiency e...

Operational Experience with the ATLAS Pixel Detector at the LHC

CERN Document Server

Keil, M; The ATLAS collaboration

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

Operational experience with the ATLAS Pixel Detector at the LHC

CERN Document Server

Hirschbuehl, D; The ATLAS collaboration

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 96.7% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

Operational experience with the ATLAS Pixel Detector at the LHC

CERN Document Server

Lapoire, C; The ATLAS collaboration

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

Operational Experience with the ATLAS Pixel Detector at the LHC

CERN Document Server

Lapoire, C; The ATLAS collaboration

2012-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as B-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures and detector performance. The detector performance is excellent: 96.2% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification.

Operational Experience with the ATLAS Pixel Detector at the LHC

CERN Document Server

Keil, M

2012-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper results from the successful operation of the Pixel Detector at the LHC will be presented, including calibration procedures, timing optimization and detector performance. The detector performance is excellent: approximately 97% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

Operational experience with the ATLAS Pixel Detector at the LHC

CERN Document Server

Ince, T; The ATLAS collaboration

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 96.8% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

Operational experience with the ATLAS Pixel detector at the LHC

CERN Document Server

Deluca, C; The ATLAS collaboration

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this paper, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5\\% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, ...

Operational Experience with the ATLAS Pixel Detector at the LHC

CERN Document Server

Lange, C; The ATLAS collaboration

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump- bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, a...

Operational experience with the ATLAS Pixel detector at the LHC

CERN Document Server

Deluca, C; The ATLAS collaboration

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is vital for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In this talk, results from the successful operation of the Pixel Detector at the LHC will be presented, including monitoring, calibration procedures, timing optimization and detector performance. The detector performance is excellent: 97,5% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, an...

Charge sharing in silicon pixel detectors

CERN Document Server

Mathieson, K; Seller, P; Prydderch, M L; O'Shea, V; Bates, R L; Smith, K M; Rahman, M

2002-01-01

We used a pixellated hybrid silicon X-ray detector to study the effect of the sharing of generated charge between neighbouring pixels over a range of incident X-ray energies, 13-36 keV. The system is a room temperature, energy resolving detector with a Gaussian FWHM of 265 eV at 5.9 keV. Each pixel is 300 mu m square, 300 mu m deep and is bump bonded to matching read out electronics. The modelling packages MEDICI and MCNP were used to model the complete X-ray interaction and the subsequent charge transport. Using this software a model is developed which reproduces well the experimental results. The simulations are then altered to explore smaller pixel sizes and different X-ray energies. Charge sharing was observed experimentally to be 2% at 13 keV rising to 4.5% at 36 keV, for an energy threshold of 4 keV. The models predict that up to 50% of charge may be lost to the neighbouring pixels, for an X-ray energy of 36 keV, when the pixel size is reduced to 55 mu m.

Status of the CMS detector and upgrade plans

CERN Document Server

Guiducci, Luigi

2013-01-01

The CMS experiment at the LHC collected 5.55 /fb of proton proton collisions data at a center of mass energy of 7 TeV in 2011 and almost 20 /fb at 8 TeV energy in 2012, while the LHC run is still ongoing. The CMS detector has shown excellent performance and very good data taking efficiency. The operational experience will be discussed focusing on relevant technical aspects. The performance of CMS subdetectors will be illustrated. Emphasis will be put on the solutions adopted during 2012 run to adapt to the increase in luminosity of the LHC while mantaining the high quality of the physics objects delivered to offline analysis. New challenges, dictated by future LHC luminosity scenarios, are ahead of CMS an overview of the detector upgrade plans, both on medium and long term range, will be given.

Precision tracking with a single gaseous pixel detector

NARCIS (Netherlands)

Tsigaridas, S.; van Bakel, N.; Bilevych, Y.; Gromov, V.; Hartjes, F.; Hessey, N.P.; de Jong, P.; Kluit, R.

2015-01-01

The importance of micro-pattern gaseous detectors has grown over the past few years after successful usage in a large number of applications in physics experiments and medicine. We develop gaseous pixel detectors using micromegas-based amplification structures on top of CMOS pixel readout chips.

New pixelized Micromegas detector for the COMPASS experiment

International Nuclear Information System (INIS)

Neyret, D; Anfreville, M; Bedfer, Y; Burtin, E; D'Hose, N; Giganon, A; Kunne, F; Magnon, A; Marchand, C; Paul, B; Platchkov, S; Vandenbroucke, M; Ketzer, B; Konorov, I

2009-01-01

New Micromegas (Micro-mesh gaseous detectors) are being developed in view of the future physics projects planned by the COMPASS collaboration at CERN. Several major upgrades compared to present detectors are being studied: detectors standing five times higher luminosity with hadron beams, detection of beam particles (flux up to a few hundred of kHz/mm 2 , 10 times larger than for the present detectors) with pixelized read-out in the central part, light and integrated electronics, and improved robustness. Studies were done with the present detectors moved in the beam, and two first pixelized prototypes are being tested with muon and hadron beams in real conditions at COMPASS. We present here this new project and report on two series of tests, with old detectors moved into the beam and with pixelized prototypes operated in real data taking condition with both muon and hadron beams.

CMS Tracker Upgrades: R\\&D Plans, Present Status and Perspectives

CERN Document Server

AUTHOR|(CDS)2091649

2015-01-01

The present CMS pixel detector designed for a luminosity of $10^{34}\\,\\mathrm{cm}^{-2}\\mathrm{s}^{-1}$ will have to be replaced at the end of 2016. The new upgraded detector will have higher tracking efficiency and lower mass with four barrel layers and three forward/backward disks to provide a hit coverage up to absolute pseudorapidities of $\\mid\\eta\\mid<2.5$. In a second stage, in order to maintain its physics reach during the high luminosity phase of the LHC (HL-LHC), when the machine is expected to deliver an instantaneous luminosity of $5\\times 10^{34}\\,\\mathrm{cm}^{-2} \\mathrm{s}^{-1}$ for a total of $3000\\,\\mathrm{fb}^{-1}$, CMS will build a new tracker, comprising a completely new pixel detector and outer tracker. The ongoing R\\&D activities on both pixel and strip sensors are presented. The present status of the Inner and Outer Tracker projects are illustrated, and the possible perspectives are discussed.

Integration of Detectors Into a Large Experiment: Examples From ATLAS and CMS

CERN Document Server

Froidevaux, D

2011-01-01

Integration of Detectors Into a Large Experiment: Examples From ATLAS andCMS, part of 'Landolt-Börnstein - Group I Elementary Particles, Nuclei and Atoms: Numerical Data and Functional Relationships in Science and Technology, Volume 21B2: Detectors for Particles and Radiation. Part 2: Systems and Applications'. This document is part of Part 2 'Principles and Methods' of Subvolume B 'Detectors for Particles and Radiation' of Volume 21 'Elementary Particles' of Landolt-Börnstein - Group I 'Elementary Particles, Nuclei and Atoms'. It contains the Chapter '5 Integration of Detectors Into a Large Experiment: Examples From ATLAS and CMS' with the content: 5 Integration of Detectors Into a Large Experiment: Examples From ATLAS and CMS 5.1 Introduction 5.1.1 The context 5.1.2 The main initial physics goals of ATLAS and CMS at the LHC 5.1.3 A snapshot of the current status of the ATLAS and CMS experiments 5.2 Overall detector concept and magnet systems 5.2.1 Overall detector concept 5.2.2 Magnet systems 5.2.2.1 Rad...

Development and characterization of diamond and 3D-silicon pixel detectors with ATLAS-pixel readout electronics

International Nuclear Information System (INIS)

Mathes, Markus

2008-12-01

Hybrid pixel detectors are used for particle tracking in the innermost layers of current high energy experiments like ATLAS. After the proposed luminosity upgrade of the LHC, they will have to survive very high radiation fluences of up to 10 16 particles per cm 2 per life time. New sensor concepts and materials are required, which promise to be more radiation tolerant than the currently used planar silicon sensors. Most prominent candidates are so-called 3D-silicon and single crystal or poly-crystalline diamond sensors. Using the ATLAS pixel electronics different detector prototypes with a pixel geometry of 400 x 50 μm 2 have been built. In particular three devices have been studied in detail: a 3D-silicon and a single crystal diamond detector with an active area of about 1 cm 2 and a poly-crystalline diamond detector of the same size as a current ATLAS pixel detector module (2 x 6 cm 2 ). To characterize the devices regarding their particle detection efficiency and spatial resolution, the charge collection inside a pixel cell as well as the charge sharing between adjacent pixels was studied using a high energy particle beam. (orig.)

Amorphous Silicon Position Detectors for the Link Alignment System of the CMS Detector: Users Handbook

International Nuclear Information System (INIS)

Calderon, A.; Gomez, G.; Gonzalez-Sanchez, F. J.; Martinez-Rivero, C.; Matorras, F.; Rodrigo, T.; Ruiz-Arbol, P.; Scodellaro, L.; Vila, I.; Virto, A. L.; Alberdi, J.; Arce, P.; Barcala, J.M.; Calvo, E.; Ferrando, A.; Josa, M. I.; Molinero, A.; Navarrete, J.; Oller, J. C.; Yuste, C.

2007-01-01

We present the general characteristics, calibration procedures and measured performance of the Amorphous Silicon Position Detectors installed in the Link Alignment System of the CMS Detector for laser beam detection and reconstruction and give the Data Base to be used as a Handbook during CMS operation. (Author) 10 refs

Amorphous Silicon Position Detectors for the Link Alignment System of the CMS Detector: Users Handbook

Energy Technology Data Exchange (ETDEWEB)

Calderon, A.; Gomez, G.; Gonzalez-Sanchez, F. J.; Martinez-Rivero, C.; Matorras, F.; Rodrigo, T.; Ruiz-Arbol, P.; Scodellaro, L.; Vila, I.; Virto, A. L.; Alberdi, J.; Arce, P.; Barcala, J.M.; Calvo, E.; Ferrando, A.; Josa, M. I.; Molinero, A.; Navarrete, J.; Oller, J. C.; Yuste, C.

2007-07-01

We present the general characteristics, calibration procedures and measured performance of the Amorphous Silicon Position Detectors installed in the Link Alignment System of the CMS Detector for laser beam detection and reconstruction and give the Data Base to be used as a Handbook during CMS operation. (Author) 10 refs.

Monitoring radiation damage in the ATLAS pixel detector

CERN Document Server

Schorlemmer, André Lukas; Quadt, Arnulf; Große-Knetter, Jörn; Rembser, Christoph; Di Girolamo, Beniamino

2014-11-05

Radiation hardness is one of the most important features of the ATLAS pixel detector in order to ensure a good performance and a long lifetime. Monitoring of radiation damage is crucial in order to assess and predict the expected performance of the detector. Key values for the assessment of radiation damage in silicon, such as the depletion voltage and depletion depth in the sensors, are measured on a regular basis during operations. This thesis summarises the monitoring program that is conducted in order to assess the impact of radiation damage and compares it to model predictions. In addition, the physics performance of the ATLAS detector highly depends on the amount of disabled modules in the ATLAS pixel detector. A worrying amount of module failures was observed during run I. Thus it was decided to recover repairable modules during the long shutdown (LS1) by extracting the pixel detector. The impact of the module repairs and module failures on the detector performance is analysed in this thesis.

The FPGA Pixel Array Detector

International Nuclear Information System (INIS)

Hromalik, Marianne S.; Green, Katherine S.; Philipp, Hugh T.; Tate, Mark W.; Gruner, Sol M.

2013-01-01

A proposed design for a reconfigurable x-ray Pixel Array Detector (PAD) is described. It operates by integrating a high-end commercial field programmable gate array (FPGA) into a 3-layer device along with a high-resistivity diode detection layer and a custom, application-specific integrated circuit (ASIC) layer. The ASIC layer contains an energy-discriminating photon-counting front end with photon hits streamed directly to the FPGA via a massively parallel, high-speed data connection. FPGA resources can be allocated to perform user defined tasks on the pixel data streams, including the implementation of a direct time autocorrelation function (ACF) with time resolution down to 100 ns. Using the FPGA at the front end to calculate the ACF reduces the required data transfer rate by several orders of magnitude when compared to a fast framing detector. The FPGA-ASIC high-speed interface, as well as the in-FPGA implementation of a real-time ACF for x-ray photon correlation spectroscopy experiments has been designed and simulated. A 16×16 pixel prototype of the ASIC has been fabricated and is being tested. -- Highlights: ► We describe the novelty and need for the FPGA Pixel Array Detector. ► We describe the specifications and design of the Diode, ASIC and FPGA layers. ► We highlight the Autocorrelation Function (ACF) for speckle as an example application. ► Simulated FPGA output calculates the ACF for different input bitstreams to 100 ns. ► Reduced data transfer rate by 640× and sped up real-time ACF by 100× other methods.

Characterisation of irradiated thin silicon sensors for the CMS phase II pixel upgrade

Energy Technology Data Exchange (ETDEWEB)

Adam, W.; Bergauer, T.; Brondolin, E. [Institut fuer Hochenergiephysik, Vienna (Austria); and others

2017-08-15

The high luminosity upgrade of the Large Hadron Collider, foreseen for 2026, necessitates the replacement of the CMS experiment's silicon tracker. The innermost layer of the new pixel detector will be exposed to severe radiation, corresponding to a 1 MeV neutron equivalent fluence of up to Φ{sub eq} = 2 x 10{sup 16} cm{sup -2}, and an ionising dose of ∼5 MGy after an integrated luminosity of 3000 fb{sup -1}. Thin, planar silicon sensors are good candidates for this application, since the degradation of the signal produced by traversing particles is less severe than for thicker devices. In this paper, the results obtained from the characterisation of 100 and 200 μm thick p-bulk pad diodes and strip sensors irradiated up to fluences of Φ{sub eq} = 1.3 x 10{sup 16} cm{sup -2} are shown. (orig.)

SLHC upgrade plans for the ATLAS pixel detector

International Nuclear Information System (INIS)

Sicho, Petr

2009-01-01

The ATLAS pixel detector is an 80 million channels silicon tracking system designed to detect charged tracks and secondary vertices with very high precision. An upgrade of the ATLAS pixel detector is presently being considered, enabling to cope with higher luminosity at Super Large Hadron Collider (SLHC). The increased luminosity leads to extremely high radiation doses in the innermost region of the ATLAS tracker. Options considered for a new detector are discussed, as well as some important R and D activities, such as investigations towards novel detector geometries and novel processes.

Silicon Sensor and Detector Developments for the CMS Tracker Upgrade

CERN Document Server

D'Alessandro, Raffaello

2011-01-01

CMS started a campaign to identify the future silicon sensor technology baseline for a new Tracker for the high-luminosity phase of LHC, coupled to a new effective way of providing tracking information to the experiment trigger. To this end a large variety of 6'' wafers was acquired in different thicknesses and technologies at HPK and new detector module designs were investigated. Detector thicknesses ranging from 50$\\mu$m to 300$\\mu$m are under investigation on float zone, magnetic Czochralski and epitaxial material both in n-in-p and p-in-n versions. P-stop and p-spray are explored as isolation technology for the n-in-p type sensors as well as the feasibility of double metal routing on 6'' wafers. Each wafer contains different structures to answer different questions, e.g. influence of geometry, Lorentz angle, radiation tolerance, annealing behaviour, validation of read-out schemes. Dedicated process test-structures, as well as diodes, mini-sensors, long and very short strip sensors and real pixel sensors ...

Development and characterization of diamond and 3D-silicon pixel detectors with ATLAS-pixel readout electronics

Energy Technology Data Exchange (ETDEWEB)

Mathes, Markus

2008-12-15

Hybrid pixel detectors are used for particle tracking in the innermost layers of current high energy experiments like ATLAS. After the proposed luminosity upgrade of the LHC, they will have to survive very high radiation fluences of up to 10{sup 16} particles per cm{sup 2} per life time. New sensor concepts and materials are required, which promise to be more radiation tolerant than the currently used planar silicon sensors. Most prominent candidates are so-called 3D-silicon and single crystal or poly-crystalline diamond sensors. Using the ATLAS pixel electronics different detector prototypes with a pixel geometry of 400 x 50 {mu}m{sup 2} have been built. In particular three devices have been studied in detail: a 3D-silicon and a single crystal diamond detector with an active area of about 1 cm{sup 2} and a poly-crystalline diamond detector of the same size as a current ATLAS pixel detector module (2 x 6 cm{sup 2}). To characterize the devices regarding their particle detection efficiency and spatial resolution, the charge collection inside a pixel cell as well as the charge sharing between adjacent pixels was studied using a high energy particle beam. (orig.)

Power distribution studies for CMS forward tracker

International Nuclear Information System (INIS)

Todri, A.; Turqueti, M.; Rivera, R.; Kwan, S.

2009-01-01

The Electronic Systems Engineering Department of the Computing Division at the Fermi National Accelerator Laboratory is carrying out R and D investigations for the upgrade of the power distribution system of the Compact Muon Solenoid (CMS) Pixel Tracker at the Large Hadron Collider (LHC). Among the goals of this effort is that of analyzing the feasibility of alternative powering schemes for the forward tracker, including DC to DC voltage conversion techniques using commercially available and custom switching regulator circuits. Tests of these approaches are performed using the PSI46 pixel readout chip currently in use at the CMS Tracker. Performance measures of the detector electronics will include pixel noise and threshold dispersion results. Issues related to susceptibility to switching noise will be studied and presented. In this paper, we describe the current power distribution network of the CMS Tracker, study the implications of the proposed upgrade with DC-DC converters powering scheme and perform noise susceptibility analysis.

Electron imaging with Medipix2 hybrid pixel detector

CERN Document Server

McMullan, G; Chen, S; Henderson, R; Llopart, X; Summerfield, C; Tlustos, L; Faruqi, A R

2007-01-01

The electron imaging performance of Medipix2 is described. Medipix2 is a hybrid pixel detector composed of two layers. It has a sensor layer and a layer of readout electronics, in which each 55 μm×55 μm pixel has upper and lower energy discrimination and MHz rate counting. The sensor layer consists of a 300 μm slab of pixellated monolithic silicon and this is bonded to the readout chip. Experimental measurement of the detective quantum efficiency, DQE(0) at 120 keV shows that it can reach 85% independent of electron exposure, since the detector has zero noise, and the DQE(Nyquist) can reach 35% of that expected for a perfect detector (4/π2). Experimental measurement of the modulation transfer function (MTF) at Nyquist resolution for 120 keV electrons using a 60 keV lower energy threshold, yields a value that is 50% of that expected for a perfect detector (2/π). Finally, Monte Carlo simulations of electron tracks and energy deposited in adjacent pixels have been performed and used to calculate expected v...

The Upgraded Pixel Detector of the ATLAS Experiment for Run-2

CERN Document Server

Ferrere, Didier; The ATLAS collaboration

2016-01-01

Run-2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130nm technology. In addition the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning and performance of the 4-layer Pixel Detector, in particular the IBL, will be presented, using collision data.

ALICE Silicon Pixel Detector

CERN Multimedia

Manzari, V

2013-01-01

The Silicon Pixel Detector (SPD) forms the innermost two layers of the 6-layer barrel Inner Tracking System (ITS). The SPD plays a key role in the determination of the position of the primary collision and in the reconstruction of the secondary vertices from particle decays.

Silicon strip detector qualification for the CMS experiment

Energy Technology Data Exchange (ETDEWEB)

Kaussen, Gordon

2008-10-06

To provide the best spatial resolution for the particle trajectory reconstruction and a very fast readout, the inner tracking system of CMS is build up of silicon detectors with a pixel tracker in the center surrounded by a strip tracker. The silicon strip tracker consists of so-called modules representing the smallest detection unit of the tracking device. These modules are mounted on higher-level structures called shells in the tracker inner barrel (TIB), rods in the tracker outer barrel (TOB), disks in the tracker inner disks (TID) and petals in the tracker end caps (TEC). The performance of the participating two shells of the TIB, four rods of the TOB and two petals of the TEC (representing about 1% of the final strip tracker) could be studied in different magnetic fields over a period of approximately two month using cosmic muon signals. The last test before inserting the tracker in the CMS experiment was the Tracker Slice Test performed in spring/summer 2007 at the Tracker Integration Facility (TIF) at CERN after installing all subdetectors in the tracker support tube. Approximately 25% of the strip tracker +z side was powered and read out using a cosmic ray trigger built up of scintillation counters. In total, about 5 million muon events were recorded under various operating conditions. These events together with results from commissioning runs were used to study the detector response like cluster charges, signal-to-noise ratios and single strip noise behaviour as well as to identify faulty channels which turned out to be in the order of a few per mille. The performance of the silicon strip tracker during these different construction stages is discussed in this thesis with a special emphasis on the tracker end caps. (orig.)

Silicon strip detector qualification for the CMS experiment

International Nuclear Information System (INIS)

Kaussen, Gordon

2008-01-01

To provide the best spatial resolution for the particle trajectory reconstruction and a very fast readout, the inner tracking system of CMS is build up of silicon detectors with a pixel tracker in the center surrounded by a strip tracker. The silicon strip tracker consists of so-called modules representing the smallest detection unit of the tracking device. These modules are mounted on higher-level structures called shells in the tracker inner barrel (TIB), rods in the tracker outer barrel (TOB), disks in the tracker inner disks (TID) and petals in the tracker end caps (TEC). The performance of the participating two shells of the TIB, four rods of the TOB and two petals of the TEC (representing about 1% of the final strip tracker) could be studied in different magnetic fields over a period of approximately two month using cosmic muon signals. The last test before inserting the tracker in the CMS experiment was the Tracker Slice Test performed in spring/summer 2007 at the Tracker Integration Facility (TIF) at CERN after installing all subdetectors in the tracker support tube. Approximately 25% of the strip tracker +z side was powered and read out using a cosmic ray trigger built up of scintillation counters. In total, about 5 million muon events were recorded under various operating conditions. These events together with results from commissioning runs were used to study the detector response like cluster charges, signal-to-noise ratios and single strip noise behaviour as well as to identify faulty channels which turned out to be in the order of a few per mille. The performance of the silicon strip tracker during these different construction stages is discussed in this thesis with a special emphasis on the tracker end caps. (orig.)

The ATLAS Pixel Detector operation and performance

CERN Document Server

Andreazza, A; The ATLAS collaboration

2010-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. It consists of 1744 silicon sensors equipped with approximately $80 imes 10^6$~electronic channels, providing typically three measurement points with high resolution for particles emerging from the beam-interaction region. The complete Pixel Detector has been taking part in cosmic-ray data-taking since 2008. Since November 2009 it has been operated with LHC colliding beams at $sqrt{s}=900$~GeV, 2.36~TeV and 7 TeV. The detector operated with an active fraction of 97.2% at a threshold of 3500~$e$, showing a noise occupancy rate better than $10^{-9}$~hit/pixel/BC and a track association efficiency of 99%. The Lorentz angle for electrons in silicon is measured to be $ heta_mathrm{L}=12.11^circ pm 0.09^circ$ and its temperature dependence has been verified. The pulse height information from the time-over-threshold technique allows to improve the point resolution using charge sharing and to perform parti...

Chip development in 65 nm CMOS technology for the high luminosity upgrade of the ATLAS pixel detector

Energy Technology Data Exchange (ETDEWEB)

Germic, Leonard; Hemperek, Tomasz; Kishishita, Tetsuichi; Krueger, Hans; Rymaszewski, Piotr; Wermes, Norbert [University of Bonn, Bonn (Germany)

2016-07-01

The LHC High Luminosity upgrade will result in a significant change of environment in which particle detectors are going to operate, especially for devices very close to the interaction point like pixel detector electronics. Challenges arising from the increased hit rate will have to be solved by designing faster and more complex readout electronics that will also have to withstand unprecedented radiation doses. Developing such integrated circuit requires a significant R and D effort and resources, therefore a joint development project between several institutes (including ours) was started. This collaboration, named RD53, aims to develop a pixel readout chip suitable for ATLAS' and CMS' upgrades using a 65nm CMOS technology. During this presentation motivations and benefits of using this very deep-submicron technology are discussed. Most of the talk is allocated to presenting some of the circuits designed by our group (focusing on developments connected to RD53 collaboration), along with their performance measurement results.

Status and future of the ATLAS Pixel Detector at the LHC

International Nuclear Information System (INIS)

Rozanov, Alexandre

2013-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. The detector provides hermetic coverage with three cylindrical layers and three layers of disks in each forward end-cap. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-on-n silicon substrates. Intensive calibration, tuning, timing optimization and monitoring resulted in the successful five years of operation with good detector performance. The record breaking instantaneous luminosities of 7.7×10 33 cm −2 s −1 recently surpassed at the LHC generated a rapidly increasing particle fluence in the ATLAS Pixel Detector. As the radiation dose accumulated, the first effects of radiation damage became observable in the silicon sensors as an increase in the silicon leakage current and the change of the voltage required to fully deplete the sensor. A fourth pixel layer at a radius of 3.3 cm will be added during the long shutdown (2013–2014) together with the replacement of pixel services. A letter of intent was submitted for a completely new Pixel Detector after 2023, capable to take data with extremely high leveled luminosities of 5×10 34 cm −2 s −1 at the high luminosity LHC. -- Highlights: •The ATLAS Pixel Detector provides hermetic coverage with three layers with 80 million pixels. •Calibration, tuning, timing optimization and monitoring resulted in the successful five years of operation with good detector performance. •First effects of radiation damage became observable in the silicon sensors. •A fourth pixel layer at a radius of 3.3 cm will be added during the long shutdown (2013–2014). •Replacement of pixel services in 2013–2014. •A letter of intent was submitted for new Pixel Detector after 2023 for high luminosity LHC

X-CSIT: a toolkit for simulating 2D pixel detectors

Science.gov (United States)

Joy, A.; Wing, M.; Hauf, S.; Kuster, M.; Rüter, T.

2015-04-01

A new, modular toolkit for creating simulations of 2D X-ray pixel detectors, X-CSIT (X-ray Camera SImulation Toolkit), is being developed. The toolkit uses three sequential simulations of detector processes which model photon interactions, electron charge cloud spreading with a high charge density plasma model and common electronic components used in detector readout. In addition, because of the wide variety in pixel detector design, X-CSIT has been designed as a modular platform so that existing functions can be modified or additional functionality added if the specific design of a detector demands it. X-CSIT will be used to create simulations of the detectors at the European XFEL, including three bespoke 2D detectors: the Adaptive Gain Integrating Pixel Detector (AGIPD), Large Pixel Detector (LPD) and DePFET Sensor with Signal Compression (DSSC). These simulations will be used by the detector group at the European XFEL for detector characterisation and calibration. For this purpose, X-CSIT has been integrated into the European XFEL's software framework, Karabo. This will further make it available to users to aid with the planning of experiments and analysis of data. In addition, X-CSIT will be released as a standalone, open source version for other users, collaborations and groups intending to create simulations of their own detectors.

Pixel array detector for X-ray free electron laser experiments

Energy Technology Data Exchange (ETDEWEB)

Philipp, Hugh T., E-mail: htp2@cornell.edu [Department of Physics, Laboratory of Solid State Physics, Cornell University, Ithaca, NY 14853 (United States); Hromalik, Marianne [Electrical and Computer Engineering, SUNY Oswego, Oswego, NY 13126 (United States); Tate, Mark; Koerner, Lucas [Department of Physics, Laboratory of Solid State Physics, Cornell University, Ithaca, NY 14853 (United States); Gruner, Sol M. [Department of Physics, Laboratory of Solid State Physics, Cornell University, Ithaca, NY 14853 (United States); Wilson Laboratory, Cornell University, CHESS, Ithaca, NY 14853 (United States)

2011-09-01

X-ray free electron lasers (XFELs) promise to revolutionize X-ray science with extremely high peak brilliances and femtosecond X-ray pulses. This will require novel detectors to fully realize the potential of these new sources. There are many current detector development projects aimed at the many challenges of meeting the XFEL requirements . This paper describes a pixel array detector (PAD) that has been developed for the Coherent X-ray Imaging experiment at the Linac Coherent Light Source (LCLS) at the SLAC National Laboratory . The detector features 14-bit in-pixel digitization; a 2-level in-pixel gain setting that can be used to make an arbitrary 2-D gain pattern that is adaptable to a particular experiment; the ability to handle instantaneous X-ray flux rates of 10{sup 17} photons per second; and continuous frames rates in excess of 120 Hz. The detector uses direct detection of X-rays in a silicon diode. The charge produced by the diode is integrated in a pixilated application specific integrated circuit (ASIC) which digitizes collected holes with single X-ray photon capability. Each ASIC is 194x185 pixels, each pixel is 110{mu}mx110{mu}m on a side. Each pixel can detect up to 2500 X-rays per frame in low-gain mode, yet easily detects single photons at high-gain. Cooled, single-chip detectors have been built and meet all the required specifications. SLAC National Laboratory is engaged in constructing a tiled, multi-chip 1516x1516 pixel detector.

The Belle II DEPFET pixel detector

Energy Technology Data Exchange (ETDEWEB)

Moser, Hans-Günther, E-mail: moser@mpp.mpg.de

2016-09-21

The Belle II experiment at KEK (Tsukuba, Japan) will explore heavy flavour physics (B, charm and tau) at the starting of 2018 with unprecedented precision. Charged particles are tracked by a two-layer DEPFET pixel device (PXD), a four-layer silicon strip detector (SVD) and the central drift chamber (CDC). The PXD will consist of two layers at radii of 14 mm and 22 mm with 8 and 12 ladders, respectively. The pixel sizes will vary, between 50 μm×(55–60) μm in the first layer and between 50 μm×(70–85) μm in the second layer, to optimize the charge sharing efficiency. These innermost layers have to cope with high background occupancy, high radiation and must have minimal material to reduce multiple scattering. These challenges are met using the DEPFET technology. Each pixel is a FET integrated on a fully depleted silicon bulk. The signal charge collected in the ‘internal gate’ modulates the FET current resulting in a first stage amplification and therefore very low noise. This allows very thin sensors (75 μm) reducing the overall material budget of the detector (0.21% X{sub 0}). Four fold multiplexing of the column parallel readout allows read out a full frame of the pixel matrix in only 20 μs while keeping the power consumption low enough for air cooling. Only the active electronics outside the detector acceptance has to be cooled actively with a two phase CO{sub 2} system. Furthermore the DEPFET technology offers the unique feature of an electronic shutter which allows the detector to operate efficiently in the continuous injection mode of superKEKB.

Status of the digital pixel array detector for protein crystallography

CERN Document Server

Datte, P; Beuville, E; Endres, N; Druillole, F; Luo, L; Millaud, J E; Xuong, N H

1999-01-01

A two-dimensional photon counting digital pixel array detector is being designed for static and time resolved protein crystallography. The room temperature detector will significantly enhance monochromatic and polychromatic protein crystallographic through-put data rates by more than three orders of magnitude. The detector has an almost infinite photon counting dynamic range and exhibits superior spatial resolution when compared to present crystallographic phosphor imaging plates or phosphor coupled CCD detectors. The detector is a high resistivity N-type Si with a pixel pitch of 150x150 mu m, and a thickness of 300 mu m, and is bump bonded to an application specific integrated circuit. The event driven readout of the detector is based on the column architecture and allows an independent pixel hit rate above 1 million photons/s/pixel. The device provides energy discrimination and sparse data readout which yields minimal dead-time. This type of architecture allows a continuous (frameless) data acquisition, a f...

Commissioning of the ATLAS pixel detector

International Nuclear Information System (INIS)

Golling, Tobias

2008-01-01

The ATLAS pixel detector is a high precision silicon tracking device located closest to the LHC interaction point. It belongs to the first generation of its kind in a hadron collider experiment. It will provide crucial pattern recognition information and will largely determine the ability of ATLAS to precisely track particle trajectories and find secondary vertices. It was the last detector to be installed in ATLAS in June 2007, has been fully connected and tested in-situ during spring and summer 2008, and is ready for the imminent LHC turn-on. The highlights of the past and future commissioning activities of the ATLAS pixel system are presented

ATLAS Pixel Detector Upgrade

CERN Document Server

Flick, T; The ATLAS collaboration

2009-01-01

The first upgrade for higher luminosity at LHC for the ATLAS pixel detector is the insertion of a forth layer, the IBL. The talk gives an overview about what the IBL is and how it will be set up, as well as to give a status of the research and develoment work.

Commissioning and Performance of the CMS Pixel Tracker with Cosmic Ray Muons

CERN Document Server

Chatrchyan, S; Abbaneo, D; Abbiendi, G; Abbrescia, M; Abdullin, S; Abelev, B; Acosta, D; Acosta, J G; Actis, O; Adam, N; Adams, M R; Adams, T; Adam, W; Adiguzel, A; Adler, V; Adolphi, R; Adzic, P; Afaq, M A; Agostino, L; Agram, J L; Aguilar-Benitez, M; Ahmad, M; Ahmed, I; Ahmed, W; Ahuja, S; Aisa, D; Aisa, S; Akchurin, N; Akgun, B; Akgun, U; Akimenko, S; Akin, I V; Alagoz, E; Alampi, G; Albajar, C; Albayrak, E A; Alberdi, J; Albergo, S; Albert, E; Albrow, M; Alcaraz Maestre, J; Aldaya Martin, M; Alexander, J; Alidra, M; Aliev, T; Allfrey, P; Almeida, N; Altenhöfer, G; Altsybeev, I; Alver, B; Alverson, G; Alves, G A; Amaglobeli, N; Amapane, N; Ambroglini, F; Amsler, C; Anagnostou, G; Ananthan, B; Anastassov, A; Andelin, D; Anderson, M; Andrea, J; Andreev, V; Andreev, Yu; Anghel, I M; Anguelov, T; Anisimov, A; Antillon, E; Antipov, P; Antonelli, L; Anttila, E; Antunes Pedro, L; Antunovic, Z; Apanasevich, L; Apollinari, G; Apresyan, A; Arce, P; Arcidiacono, R; Arenton, M W; Arfaei, H; Argiro, S; 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2010-01-01

The pixel detector of the Compact Muon Solenoid experiment consists of three barrel layers and two disks for each endcap. The detector was installed in summer 2008, commissioned with charge injections, and operated in the 3.8 T magnetic field during cosmic ray data taking. This paper reports on the first running experience and presents results on the pixel tracker performance, which are found to be in line with the design specifications of this detector. The transverse impact parameter resolution measured in a sample of high momentum muons is 18 microns.

Development and Characterization of Diamond and 3D-Silicon Pixel Detectors with ATLAS-Pixel Readout Electronics

CERN Document Server

Mathes, Markus

2008-01-01

Hybrid pixel detectors are used for particle tracking in the innermost layers of current high energy experiments like ATLAS. After the proposed luminosity upgrade of the LHC, they will have to survive very high radiation fluences of up to 10^16 particles per cm^2 per life time. New sensor concepts and materials are required, which promise to be more radiation tolerant than the currently used planar silicon sensors. Most prominent candidates are so-called 3D-silicon and single crystal or poly-crystalline diamond sensors. Using the ATLAS pixel electronics different detector prototypes with a pixel geometry of 400 × 50 um^2 have been built. In particular three devices have been studied in detail: a 3D-silicon and a single crystal diamond detector with an active area of about 1 cm^2 and a poly-crystalline diamond detector of the same size as a current ATLAS pixel detector module (2 × 6 cm^2). To characterize the devices regarding their particle detection efficiency and spatial resolution, the charge collection ...

Online calibrations and performance of the ATLAS Pixel Detector

CERN Document Server

Keil, M; The ATLAS collaboration

2010-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. It consists of 1744 silicon sensors equipped with approximately 80 M electronic channels, providing typically three measurement points with high resolution for particles emerging from the beam-interaction region, thus allowing measuring particle tracks and secondary vertices with very high precision. The readout system of the Pixel Detector is based on a bi-directional optical data transmission system between the detector and the data acquisition system with an individual link for each of the 1744 modules. Signal conversion components are located on both ends, approximately 80 m apart. The talk will give an overview of the calibration and performance of both the detector and its optical readout. The most basic parameter to be tuned and calibrated for the detector electronics is the readout threshold of the individual pixel channels. These need to be carefully tuned to optimise position resolution a...

Wafer-scale pixelated detector system

Science.gov (United States)

Fahim, Farah; Deptuch, Grzegorz; Zimmerman, Tom

2017-10-17

A large area, gapless, detection system comprises at least one sensor; an interposer operably connected to the at least one sensor; and at least one application specific integrated circuit operably connected to the sensor via the interposer wherein the detection system provides high dynamic range while maintaining small pixel area and low power dissipation. Thereby the invention provides methods and systems for a wafer-scale gapless and seamless detector systems with small pixels, which have both high dynamic range and low power dissipation.

Electron imaging with Medipix2 hybrid pixel detector

International Nuclear Information System (INIS)

McMullan, G.; Cattermole, D.M.; Chen, S.; Henderson, R.; Llopart, X.; Summerfield, C.; Tlustos, L.; Faruqi, A.R.

2007-01-01

The electron imaging performance of Medipix2 is described. Medipix2 is a hybrid pixel detector composed of two layers. It has a sensor layer and a layer of readout electronics, in which each 55 μmx55 μm pixel has upper and lower energy discrimination and MHz rate counting. The sensor layer consists of a 300 μm slab of pixellated monolithic silicon and this is bonded to the readout chip. Experimental measurement of the detective quantum efficiency, DQE(0) at 120 keV shows that it can reach ∼85% independent of electron exposure, since the detector has zero noise, and the DQE(Nyquist) can reach ∼35% of that expected for a perfect detector (4/π 2 ). Experimental measurement of the modulation transfer function (MTF) at Nyquist resolution for 120 keV electrons using a 60 keV lower energy threshold, yields a value that is 50% of that expected for a perfect detector (2/π). Finally, Monte Carlo simulations of electron tracks and energy deposited in adjacent pixels have been performed and used to calculate expected values for the MTF and DQE as a function of the threshold energy. The good agreement between theory and experiment allows suggestions for further improvements to be made with confidence. The present detector is already very useful for experiments that require a high DQE at very low doses

Electron imaging with Medipix2 hybrid pixel detector.

Science.gov (United States)

McMullan, G; Cattermole, D M; Chen, S; Henderson, R; Llopart, X; Summerfield, C; Tlustos, L; Faruqi, A R

2007-01-01

The electron imaging performance of Medipix2 is described. Medipix2 is a hybrid pixel detector composed of two layers. It has a sensor layer and a layer of readout electronics, in which each 55 microm x 55 microm pixel has upper and lower energy discrimination and MHz rate counting. The sensor layer consists of a 300 microm slab of pixellated monolithic silicon and this is bonded to the readout chip. Experimental measurement of the detective quantum efficiency, DQE(0) at 120 keV shows that it can reach approximately 85% independent of electron exposure, since the detector has zero noise, and the DQE(Nyquist) can reach approximately 35% of that expected for a perfect detector (4/pi(2)). Experimental measurement of the modulation transfer function (MTF) at Nyquist resolution for 120 keV electrons using a 60 keV lower energy threshold, yields a value that is 50% of that expected for a perfect detector (2/pi). Finally, Monte Carlo simulations of electron tracks and energy deposited in adjacent pixels have been performed and used to calculate expected values for the MTF and DQE as a function of the threshold energy. The good agreement between theory and experiment allows suggestions for further improvements to be made with confidence. The present detector is already very useful for experiments that require a high DQE at very low doses.

Algorithms for spectral calibration of energy-resolving small-pixel detectors

International Nuclear Information System (INIS)

Scuffham, J; Veale, M C; Wilson, M D; Seller, P

2013-01-01

Small pixel Cd(Zn)Te detectors often suffer from inter-pixel variations in gain, resulting in shifts in the individual energy spectra. These gain variations are mainly caused by inclusions and defects within the crystal structure, which affect the charge transport within the material causing a decrease in the signal pulse height. In imaging applications, spectra are commonly integrated over a particular peak of interest. This means that the individual pixels must be accurately calibrated to ensure that the same portion of the spectrum is integrated in every pixel. The development of large-area detectors with fine pixel pitch necessitates automated algorithms for this spectral calibration, due to the very large number of pixels. Algorithms for automatic spectral calibration require accurate determination of characteristic x-ray or photopeak positions on a pixelwise basis. In this study, we compare two peak searching spectral calibration algorithms for a small-pixel CdTe detector in gamma spectroscopic imaging. The first algorithm uses rigid search ranges to identify peaks in each pixel spectrum, based on the average peak positions across all pixels. The second algorithm scales the search ranges on the basis of the position of the highest-energy peak relative to the average across all pixels. In test spectra acquired with Tc-99m, we found that the rigid search algorithm failed to correctly identify the target calibraton peaks in up to 4% of pixels. In contrast, the scaled search algorithm failed in only 0.16% of pixels. Failures in the scaled search algorithm were attributed to the presence of noise events above the main photopeak, and possible non-linearities in the spectral response in a small number of pixels. We conclude that a peak searching algorithm based on scaling known peak spacings is simple to implement and performs well for the spectral calibration of pixellated radiation detectors

Fully integrated CMOS pixel detector for high energy particles

International Nuclear Information System (INIS)

Vanstraelen, G.; Debusschere, I.; Claeys, C.; Declerck, G.

1989-01-01

A novel type of position and energy sensitive, monolithic pixel array with integrated readout electronics is proposed. Special features of the design are a reduction of the number of output channels and of the amount of output data, and the use of transistors on the high resistivity silicon. The number of output channels for the detector array is reduced by handling in parallel a number of pixels, chosen as a function of the time resolution required for the system, and by the use of an address decoder. A further reduction of data is achieved by reading out only those pixels which have been activated. The pixel detector circuit will be realized in a 3 μm p-well CMOS process, which is optimized for the full integration of readout electronics and detector diodes on high resistivity Si. A retrograde well is formed by means of a high energy implantation, followed by the appropriate temperature steps. The optimization of the well shape takes into account the high substrate bias applied during the detector operation. The design is largely based on the use of MOS transistors on the high resistivity silicon itself. These have proven to perform as well as transistors on standard doped substrate. The basic building elements as well as the design strategy of the integrated pixel detector are presented in detail. (orig.)

Status of the CMS Detector Control System

CERN Document Server

Bauer, Gerry; Bouffet, Olivier; Bowen, Matthew; Branson, James G; Bukowiec, Sebastian; Ciganek, Marek; Cittolin, Sergio; Jose Antonio Coarasa; Deldicque, Christian; Dobson, Marc; Dupont, Aymeric; Erhan, Samim; Flossdorf, Alexander; Gigi, Dominique; Glege, Frank; Gomez-Reino, Robert; Hartl, Christian; Hegeman, Jeroen; Holzner, André; Yi Ling Hwong; Masetti, Lorenzo; Meijers, Frans; Meschi, Emilio; Mommsen, Remigius K; O'Dell, Vivian; Orsini, Luciano; Paus, Christoph; Petrucci, Andrea; Pieri, Marco; Polese, Giovanni; Racz, Attila; Raginel, Olivier; Sakulin, Hannes; Sani, Matteo; Schwick, Christoph; Shpakov, Dennis; Simon, Michal; Andrei Cristian Spataru; Sumorok, Konstanty

2012-01-01

The Compact Muon Solenoid (CMS) is a CERN multi-purpose experiment that exploits the physics of the Large Hadron Collider (LHC). The Detector Control System (DCS) ensures a safe, correct and efficient experiment operation, contributing to the recording of high quality physics data. The DCS is programmed to automatically react to the LHC operational mode. CMS sub-detectors' bias voltages are set depending on the machine mode and particle beam conditions. An operator provided with a small set of screens supervises the system status summarized from the approximately 6M monitored parameters. Using the experience of nearly two years of operation with beam the DCS automation software has been enhanced to increase the system efficiency by minimizing the time required by sub detectors to prepare for physics data taking. From the infrastructure point of view the DCS will be subject to extensive modifications in 2012. The current rack mounted control PCs will be exchanged by a redundant pair of DELL Blade systems. Thes...

X-ray imaging with photon counting hybrid semiconductor pixel detectors

CERN Document Server

Manolopoulos, S; Campbell, M; Snoeys, W; Heijne, Erik H M; Pernigotti, E; Raine, C; Smith, K; Watt, J; O'Shea, V; Ludwig, J; Schwarz, C

1999-01-01

Semiconductor pixel detectors, originally developed for particle physics experiments, have been studied as X-ray imaging devices. The performance of devices using the OMEGA 3 read-out chip bump-bonded to pixellated silicon semiconductor detectors is characterised in terms of their signal-to-noise ratio when exposed to 60 kVp X-rays. Although parts of the devices achieve values of this ratio compatible with the noise being photon statistics limited, this is not found to hold for the whole pixel matrix, resulting in the global signal-to-noise ratio being compromised. First results are presented of X-ray images taken with a gallium arsenide pixel detector bump-bonded to a new read-out chip, (MEDIPIX), which is a single photon counting read-out chip incorporating a 15-bit counter in every pixel. (author)

14C autoradiography with an energy-sensitive silicon pixel detector.

Science.gov (United States)

Esposito, M; Mettivier, G; Russo, P

2011-04-07

The first performance tests are presented of a carbon-14 ((14)C) beta-particle digital autoradiography system with an energy-sensitive hybrid silicon pixel detector based on the Timepix readout circuit. Timepix was developed by the Medipix2 Collaboration and it is similar to the photon-counting Medipix2 circuit, except for an added time-based synchronization logic which allows derivation of energy information from the time-over-threshold signal. This feature permits direct energy measurements in each pixel of the detector array. Timepix is bump-bonded to a 300 µm thick silicon detector with 256 × 256 pixels of 55 µm pitch. Since an energetic beta-particle could release its kinetic energy in more than one detector pixel as it slows down in the semiconductor detector, an off-line image analysis procedure was adopted in which the single-particle cluster of hit pixels is recognized; its total energy is calculated and the position of interaction on the detector surface is attributed to the centre of the charge cluster. Measurements reported are detector sensitivity, (4.11 ± 0.03) × 10(-3) cps mm(-2) kBq(-1) g, background level, (3.59 ± 0.01) × 10(-5) cps mm(-2), and minimum detectable activity, 0.0077 Bq. The spatial resolution is 76.9 µm full-width at half-maximum. These figures are compared with several digital imaging detectors for (14)C beta-particle digital autoradiography.

Modeling of Pixelated Detector in SPECT Pinhole Reconstruction.

Science.gov (United States)

Feng, Bing; Zeng, Gengsheng L

2014-04-10

A challenge for the pixelated detector is that the detector response of a gamma-ray photon varies with the incident angle and the incident location within a crystal. The normalization map obtained by measuring the flood of a point-source at a large distance can lead to artifacts in reconstructed images. In this work, we investigated a method of generating normalization maps by ray-tracing through the pixelated detector based on the imaging geometry and the photo-peak energy for the specific isotope. The normalization is defined for each pinhole as the normalized detector response for a point-source placed at the focal point of the pinhole. Ray-tracing is used to generate the ideal flood image for a point-source. Each crystal pitch area on the back of the detector is divided into 60 × 60 sub-pixels. Lines are obtained by connecting between a point-source and the centers of sub-pixels inside each crystal pitch area. For each line ray-tracing starts from the entrance point at the detector face and ends at the center of a sub-pixel on the back of the detector. Only the attenuation by NaI(Tl) crystals along each ray is assumed to contribute directly to the flood image. The attenuation by the silica (SiO 2 ) reflector is also included in the ray-tracing. To calculate the normalization for a pinhole, we need to calculate the ideal flood for a point-source at 360 mm distance (where the point-source was placed for the regular flood measurement) and the ideal flood image for the point-source at the pinhole focal point, together with the flood measurement at 360 mm distance. The normalizations are incorporated in the iterative OSEM reconstruction as a component of the projection matrix. Applications to single-pinhole and multi-pinhole imaging showed that this method greatly reduced the reconstruction artifacts.

Vertex measurement at a hadron collider. The ATLAS pixel detector

International Nuclear Information System (INIS)

Grosse-Knetter, J.

2008-03-01

The ATLAS Pixel Detector is the innermost layer of the ATLAS tracking system and will contribute significantly to the ATLAS track and vertex reconstruction. The detector consists of identical sensor-chip-hybrid modules, arranged in three barrels in the centre and three disks on either side for the forward region. The position of the Pixel Detector near the interaction point requires excellent radiation hardness, fast read-out, mechanical and thermal robustness, good long-term stability, all combined with a low material budget. The new design concepts used to meet the challenging requirements are discussed with their realisation in the Pixel Detector, followed by a description of a refined and extensive set of measurements to assess the detector performance during and after its construction. (orig.)

The CMS Tracker Data Quality Monitoring Expert GUI

CERN Document Server

Palmonari, Francesco

2009-01-01

The CMS Tracker data quality monitoring (DQM) is a demanding task due the detector's high granularity. It consists of about 15148 strip and 1440 pixel detector modules. About 350,000 histograms are defined and filled accessing information from different stages of data reconstruction to check the data quality. It is impossible to manage such a large number of histograms by shift personnel and experts. A tracker specific Graphical User Interface (GUI) is developed to simplify the navigation and to spot detector problems efficiently. The GUI is web-based and implemented with Ajax technology. We will describe the framework and the specific features of the expert GUI developed for the CMS Tracker DQM system.

Uniformity and Stability of the CMS RPC Detector at the LHC

CERN Document Server

Costantini, S; Cimmino, A.; Garcia, G.; Lellouch, J.; Marinov, A.; Ocampo, A.; Strobbe, N.; Thyssen, F.; Tytgat, M.; Verwilligen, P.; Yazgan, E.; Zaganidis, N.; Dimitrov, A.; Hadjiiska, R.; Litov, L.; Pavlov, B.; Petkov, P.; Aleksandrov, A.; Genchev, V.; Iaydjiev, P.; Rodozov, M.; Shopova, M.; Sultanov, G.; Ban, Y.; Cai, J.; Ge, Y.; Li, Q.; Qian, S.; Xue, Z.; Avila, C.; Chaparro, L.F.; Gomez, J.P.; Gomez Moreno, B.; Osorio Oliveros, A.F.; Sanabria, J.C.; Assran, Y.; Sharma, A.; Abbrescia, M.; Calabria, C.; Colaleo, A.; Loddo, F.; Maggi, M.; Pugliese, G.; Benussi, L.; Bianco, S.; Colafranceschi, S.; Piccolo, D.; Buontempo, S.; Carrillo, C.; Iorio, O.; Paolucci, P.; Berzano, U.; Gabusi, M.; Vitulo, P.; Kang, M.; Lee, K.S.; Park, S.K.; Shin, S.; Choi, Y.; Goh, J.; Kim, M.S.; Seo, H.

2013-01-01

The Resistive Plate Chambers (RPCs) are employed in the CMS experiment at the LHC as dedicated trigger system both in the barrel and in the endcap. This note presents results of the RPC detector uniformity and stability during the 2011 data taking period, and preliminary results obtained with 2012 data. The detector uniformity has been ensured with a dedicated High Voltage scan with LHC collisions, in order to determine the optimal operating working voltage of each individual RPC chamber installed in CMS. Emphasis is given on the procedures and results of the High Voltage calibration. Moreover, an increased detector stability has been obtained by automatically taking into account temperature and atmospheric pressure variations in the CMS cavern.

Calibration Analysis Software for the ATLAS Pixel Detector

CERN Document Server

AUTHOR|(INSPIRE)INSPIRE-00372086; The ATLAS collaboration

2016-01-01

The calibration of the ATLAS Pixel detector at LHC fulfils two main purposes: to tune the front-end configuration parameters for establishing the best operational settings and to measure the tuning performance through a subset of scans. An analysis framework has been set up in order to take actions on the detector given the outcome of a calibration scan (e.g. to create a mask for disabling noisy pixels). The software framework to control all aspects of the Pixel detector scans and analyses is called Calibration Console. The introduction of a new layer, equipped with new Front End-I4 Chips, required an update the Console architecture. It now handles scans and scans analyses applied together to chips with different characteristics. An overview of the newly developed Calibration Analysis Software will be presented, together with some preliminary result.

Development of pixel readout integrated circuits for extreme rate and radiation

CERN Multimedia

Liberali, V; Rizzi, A; Re, V; Minuti, M; Pangaud, P; Barbero, M B; Pacher, L; Kluit, R; Hinchliffe, I; Manghisoni, M; Giubilato, P; Faccio, F; Pernegger, H; Krueger, H; Gensolen, F D; Bilei, G M; Da rocha rolo, M D; Prydderch, M L; Fanucci, L; Grillo, A A; Bellazzini, R; Palomo pinto, F R; Michelis, S; Huegging, F G; Kishishita, T; Marchiori, G; Christian, D C; Kaestli, H C; Meier, B; Andreazza, A; Key-charriere, M; Linssen, L; Dannheim, D; Conti, E; Hemperek, T; Menouni, M; Fougeron, D; Genat, J; Bomben, M; Marzocca, C; Demaria, N; Mazza, G; Van bakel, N A; Palla, F; Grippo, M T; Magazzu, G; Ratti, L; Abbaneo, D; Crescioli, F; Deptuch, G W; Neue, G; De robertis, G; Passeri, D; Placidi, P; Gromov, V; Morsani, F; Paccagnella, A; Christiansen, J; Dho, E; Wermes, N; Rymaszewski, P; Rozanov, A; Wang, A; Lipton, R J; Havranek, M; Neviani, A; Marconi, S; Karagounis, M; Godiot, S; Calderini, G; Seidel, S C; Horisberger, R P; Garcia-sciveres, M A; Stabile, A; Beccherle, R; Bacchetta, N

The present hybrid pixel detectors in operation at the LHC represent a major achievement. They deployed a new technology on an unprecedented scale and their success firmly established pixel tracking as indispensable for future HEP experiments. However, extrapolation of hybrid pixel technology to the HL-LHC presents major challenges on several fronts. We propose a new RD collaboration specifically focused on the development of pixel readout Integrated Circuits (IC). The IC challenges include: smaller pixels to resolve tracks in boosted jets, much higher hit rates (1-2 GHz/cm$^{2}$), unprecedented radiation tolerance (10 MGy), much higher output bandwidth, and large IC format with low power consumption in order to instrument large areas while keeping the material budget low. We propose a collaboration to design the next generation of hybrid pixel readout chips to enable the ATLAS and CMS Phase 2 pixel upgrades. This does not imply that ATLAS and CMS must use the same exact pixel readout chip, as most of the dev...

Technological aspects of gaseous pixel detectors fabrication

NARCIS (Netherlands)

Blanco Carballo, V.M.; Salm, Cora; Smits, Sander M.; Schmitz, Jurriaan; Melai, J.; Chefdeville, M.A.; van der Graaf, H.

2007-01-01

Integrated gaseous pixel detectors consisting of a metal punctured foil suspended in the order of 50μm over a pixel readout chip by means by SU-8 insulating pillars have been fabricated. SU-8 is used as sacrificial layer but metallization over uncrosslinked SU-8 presents adhesion and stress

Modeling Radiation Damage to Pixel Sensors in the ATLAS Detector

CERN Document Server

Nachman, Benjamin Philip; The ATLAS collaboration

2017-01-01

Silicon Pixel detectors are at the core of the current and planned upgrade of the ATLAS detector. As the detector in closest proximity to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the HL-LHC, the innermost layers will receive a fluence in excess of $10^{15}$ 1 MeV $n_\\mathrm{eq}/\\mathrm{cm}^2$ and the HL-LHC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. This talk presents a digitization model that includes radiation damage effects to the ATLAS Pixel sensors for the first time. After a thorough description of the setup, predictions for basic Pixel cluster properties are presented alongside first validation studies with Run 2 collision data.

Developments of the ATLAS pixel detector

International Nuclear Information System (INIS)

Andreazza, Attilio

2004-01-01

The ATLAS silicon pixel detector is the innermost tracking device of the ATLAS experiment at the Large Hardon Collider, consisting of more than 1700 modules for a total sensitive area of about 1.7m2 and over 80 million pixel cells. The concept is a hybrid of front-end chips bump bonded to the pixel sensor. The elementary pixel cell has 50μmx400μm size, providing pulse height information via the time over threshold technique. Prototype devices with oxygenated silicon sensor and rad-hard electronics built in the IBM 0.25μm process have been tested and maintain good resolution, efficiency and timing performances even after receiving the design radiation damage of 1015neq/cm2

Upgrade of the CMS Tracker for the High Luminosity LHC

CERN Document Server

Auzinger, Georg

2016-01-01

The LHC machine is planning an upgrade program which will smoothly bring the luminosity to about $ 5 \\times 10^{34}$cm$^{-2}$s$^{-1}$ in 2028, possibly reaching an integrated luminosity of 3000 fb$^{-1}$ by the end of 2037. This High Luminosity LHC scenario, HL-LHC, will require a preparation program of the LHC detectors known as Phase-2 Upgrade. The current CMS Tracker, including both inner pixel and outer strip systems, is already running beyond design specifications and will not be able to survive HL-LHC radiation conditions. CMS will need a completely new device in order to fully exploit the demanding operating conditions and the delivered luminosity. The upgrade plan includes extending the Pixel Detector in the forward region from the current coverage of $ \\lvert \\eta \\rvert < 2.4 $ to $ \\lvert \\eta \\rvert < 4$, where up to seven forward- and four extension disks will compose the new detector. Additionally, the new outer system should also have trigger capabilities. To achieve such goals, R\\&...

Construction and Tests of Modules for the ATLAS Pixel Detector

CERN Document Server

AUTHOR|(CDS)2068490

2003-01-01

The ATLAS Pixel Detector is the innermost layer of the ATLAS tracking system and will contribute significantly to the ATLAS track and vertex reconstruction. The detector consists of identical sensor-chip-hybrid modules, arranged in three barrels in the centre and three disks on either side for the forward region. The position of the pixel detector near the interaction point requires excellent radiation hardness, mechanical and thermal robustness, good long-term stability, all combined with a low material budget. The pre-production phase of such pixel modules has nearly finished, yielding fully functional modules. Results are presented of tests with these modules.

Synchrotron applications of pixel and strip detectors at Diamond Light Source

International Nuclear Information System (INIS)

Marchal, J.; Tartoni, N.; Nave, C.

2009-01-01

A wide range of position-sensitive X-ray detectors have been commissioned on the synchrotron X-ray beamlines operating at the Diamond Light Source in UK. In addition to mature technologies such as image-plates, CCD-based detectors, multi-wire and micro-strip gas detectors, more recent detectors based on semiconductor pixel or strip sensors coupled to CMOS read-out chips are also in use for routine synchrotron X-ray diffraction and scattering experiments. The performance of several commercial and developmental pixel/strip detectors for synchrotron studies are discussed with emphasis on the image quality achieved with these devices. Examples of pixel or strip detector applications at Diamond Light Source as well as the status of the commissioning of these detectors on the beamlines are presented. Finally, priorities and ideas for future developments are discussed.

The ALICE silicon pixel detector front-end and read-out electronics

CERN Document Server

Kluge, A

2006-01-01

The ALICE silicon pixel detector (SPD) comprises the two innermost barrel layers of the ALICE inner tracker system. The SPD includes 120 half staves each of which consists of a linear array of 10 ALICE pixel chips bump bonded to two silicon sensors. Each pixel chip contains 8192 active cells, so the total number of pixel cells in the SPD is ≈107. The tight material budget and the limitation in physical dimensions required by the detector design introduce new challenges for the integration of the on-detector electronics. An essential part of the half stave is a low-mass multi-layer flex that carries power, ground, and signals to the pixel chips. Each half stave is read out using a multi-chip module (MCM). The MCM contains three radiation hard ASICs and an 800 Mbit/s custom developed optical link for the data transfer between the detector and the control room. The detector components are less than 3 mm thick. The production of the half-staves and MCMs is currently under way. Test results as well as on overvie...

ATLAS SemiConductor Tracker and Pixel Detector: Status and Performance

CERN Document Server

Reeves, K; The ATLAS collaboration

2012-01-01

The Semi-Conductor Tracker (SCT) and the Pixel Detector are the key precision tracking devices in the Inner Detector of the ATLAS experiment at CERN LHC. The SCT is a silicon strip detector and is constructed of 4088 silicon detector modules for a total of 6.3 million strips. Each module is designed, constructed and tested to operate as a stand-alone unit, mechanically, electrically, optically and thermally. The SCT silicon micro-strip sensors are processed in the planar p-in-n technology. The signals from the strips are processed in the front-end ASICS ABCD3TA, working in the binary readout mode. The Pixel Detector consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. In the talk the current status of the SCT and Pixel Detector will be reviewed. We will report on the operation of the detectors including an overview of the issues we encountered and the observation of significant increases in leakage currents (as expected) from bulk ...

Results from the commissioning of the ATLAS Pixel Detector

CERN Document Server

Masetti, L

2008-01-01

The Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. It is an 80 million channel silicon tracking system designed to detect charged tracks and secondary vertices with very high precision. After connection of cooling and services and verification of their operation, the ATLAS Pixel Detector is now in the final stage of its commissioning phase. Calibration of optical connections, verification of the analog performance and special DAQ runs for noise studies have been performed and the first tracks in combined operation with the other subdetectors of the ATLAS Inner Detector were observed. The results from calibration tests on the whole detector and from cosmic muon data are presented.

Charge collection and absorption-limited x-ray sensitivity of pixellated x-ray detectors

International Nuclear Information System (INIS)

Kabir, M. Zahangir; Kasap, S.O.

2004-01-01

The charge collection and absorption-limited x-ray sensitivity of a direct conversion pixellated x-ray detector operating in the presence of deep trapping of charge carriers is calculated using the Shockley-Ramo theorem and the weighting potential of the individual pixel. The sensitivity of a pixellated x-ray detector is analyzed in terms of normalized parameters; (a) the normalized x-ray absorption depth (absorption depth/photoconductor thickness), (b) normalized pixel width (pixel size/thickness), and (c) normalized carrier schubwegs (schubweg/thickness). The charge collection and absorption-limited sensitivity of pixellated x-ray detectors mainly depends on the transport properties (mobility and lifetime) of the charges that move towards the pixel electrodes and the extent of dependence increases with decreasing normalized pixel width. The x-ray sensitivity of smaller pixels may be higher or lower than that of larger pixels depending on the rate of electron and hole trapping and the bias polarity. The sensitivity of pixellated detectors can be improved by ensuring that the carrier with the higher mobility-lifetime product is drifted towards the pixel electrodes

High-speed readout of high-Z pixel detectors with the LAMBDA detector

International Nuclear Information System (INIS)

Pennicard, D.; Smoljanin, S.; Sheviakov, I.; Xia, Q.; Rothkirch, A.; Yu, Y.; Struth, B.; Hirsemann, H.; Graafsma, H.

2014-01-01

High-frame-rate X-ray pixel detectors make it possible to perform time-resolved experiments at synchrotron beamlines, and to make better use of these sources by shortening experiment times. LAMBDA is a photon-counting hybrid pixel detector based on the Medipix3 chip, designed to combine a small pixel size of 55 μm, a large tileable module design, high speed, and compatibility with ''high-Z'' sensors for hard X-ray detection. This technical paper focuses on LAMBDA's high-speed-readout functionality, which allows a frame rate of 2000 frames per second with no deadtime between successive images. This takes advantage of the Medipix3 chip's ''continuous read-write'' function and highly parallelised readout. The readout electronics serialise this data and send it back to a server PC over two 10 Gigabit Ethernet links. The server PC controls the detector and receives, processes and stores the data using software designed for the Tango control system. As a demonstration of high-speed readout of a high-Z sensor, a GaAs LAMBDA detector was used to make a high-speed X-ray video of a computer fan

Studies on a 300 k pixel detector telescope

Science.gov (United States)

Middelkamp, Peter; Antinori, F.; Barberis, D.; Becks, K. H.; Beker, H.; Beusch, W.; Burger, P.; Campbell, M.; Cantatore, E.; Catanesi, M. G.; Chesi, E.; Darbo, G.; D'Auria, S.; Davia, C.; di Bari, D.; di Liberto, S.; Elia, D.; Gys, T.; Heijne, E. H. M.; Helstrup, H.; Jacholkowski, A.; Jæger, J. J.; Jakubek, J.; Jarron, P.; Klempt, W.; Krummenacher, F.; Knudson, K.; Kralik, I.; Kubasta, J.; Lasalle, J. C.; Leitner, R.; Lemeilleur, F.; Lenti, V.; Letheren, M.; Lopez, L.; Loukas, D.; Luptak, M.; Martinengo, P.; Meddeler, G.; Meddi, F.; Morando, M.; Munns, A.; Pellegrini, F.; Pengg, F.; Pospisil, S.; Quercigh, E.; Ridky, J.; Rossi, L.; Safarik, K.; Scharfetter, L.; Segato, G.; Simone, S.; Smith, K.; Snoeys, W.; Vrba, V.

1996-02-01

Four silicon pixel detector planes are combined to form a tracking telescope in the lead ion experiment WA97 at CERN with 290 304 sensitive elements each of 75 μm by 500 μm area. An electronic pulse processing circuit is associated with each individual sensing element and the response for ionizing particles is binary with an adjustable threshold. The noise rate for a threshold of 6000 e- has been measured to be less than 10-10. The inefficient area due to malfunctioning pixels is 2.8% of the 120 cm2. Detector overlaps within one plane have been used to determine the alignment of the components of the plane itself, without need for track reconstruction using external detectors. It is the first time that such a big surface covered with active pixels has been used in a physics experiment. Some aspects concerning inclined particle tracks and time walk have been measured separately in a beam test at the CERN SPS H6 beam.

Studies on a 300 k pixel detector telescope

International Nuclear Information System (INIS)

Middelkamp, P.; Antinori, F.; Barberis, D.

1996-01-01

Four silicon pixel detector planes are combined to form a tracking telescope in the lead ion experiment WA97 at CERN with 290 304 sensitive elements each of 75 μm by 500 μm area. An electronic pulse processing circuit is associated with each individual sensing element and the response for ionizing particles is binary with an adjustable threshold. The noise rate for a threshold of 6000 e - has been measured to be less than 10 -10 . The inefficient area due to malfunctioning pixels is 2.8% of the 120 cm 2 . Detector overlaps within one plane have been used to determine the alignment of the components of the plane itself, without need for track reconstruction using external detectors. It is the first time that such a big surface covered with active pixels has been used in a physics experiment. Some aspects concerning inclined particle tracks and time walk have been measured separately in a beam test at the CERN SPS H6 beam. (orig.)

Gamma Spectroscopy with Pixellated CdZnTe Gamma Detectors

International Nuclear Information System (INIS)

Shor, A.; Mardor, I.; Eisen, Y.

2002-01-01

Pixellated CdZnTe detectors are good candidates for room temperature gamma detection requiring spectroscopic performance with imaging capabilities. The CdZnTe materials possess high resistivity and good electron charge transport properties. The poor charge transport for the holes inherent in the CdZnTe material can be circumvented by fabricating the electrodes in any one of a number of structures designed for unipolar charge detection[1]. Recent interest in efficient gamma detection at relatively higher gamma energies has imposed more stringent demands on the CdZnTe material and on detector design and optimization. We developed at Soreq a technique where signals from all pixels and from the common electrode are processed, and then a correction is applied for improving the energy resolution and the photopeak efficiency. For illumination with an un-collimated 133 Ba source , we obtain a combined detector energy resolution of 5.0 % FWHM for the 81 keV peak, and 1.5 % FWHM for the 356 keV peak. We discuss the importance of detector material with high electron (μτ) e for thick Pixellated detectors

Modeling Radiation Damage to Pixel Sensors in the ATLAS Detector

CERN Document Server

Ducourthial, Audrey; The ATLAS collaboration

2017-01-01

Silicon pixel detectors are at the core of the current and planned upgrade of the ATLAS detector at the Large Hadron Collider (LHC). As the closest detector component to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the High-Luminosity LHC (HL-LHC), the innermost layers will receive a fluence in excess of $10^{15} n_{eq}/cm^2$ and the HL-HLC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. Simulating radiation damage is critical in order to make accurate predictions for current future detector performance that will enable searches for new particles and forces as well as precision measurements of Standard Model particles such as the Higgs boson. We present a digitization model that includes radiation damage effects to the ATLAS pixel sensors for the first time. In addition to thoroughly describing the setup, we present first predictions for basic pixel cluster properties alongside...

Modeling radiation damage to pixel sensors in the ATLAS detector

CERN Document Server

Ducourthial, Audrey; The ATLAS collaboration

2017-01-01

Silicon pixel detectors are at the core of the current and planned upgrade of the ATLAS detector at the Large Hadron Collider (LHC). As the closest detector component to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the High-Luminosity LHC (HL-LHC), the innermost layers will receive a fluence in excess of $10^{15}n_{eq}/cm^2$ and the HL-HLC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. Simulating radiation damage is critical in order to make accurate predictions for current future detector performance that will enable searches for new particles and forces as well as precision measurements of Standard Model particles such as the Higgs boson. We present a digitization model that includes radiation damage effects to the ATLAS pixel sensors for the first time. In addition to thoroughly describing the setup, we present first predictions for basic pixel cluster properties alongside ...

Geneva University: Pixel Detectors – trends and options for the future

CERN Multimedia

Geneva University

2012-01-01

GENEVA UNIVERSITY École de physique Département de physique nucléaire et corspusculaire 24, quai Ernest-Ansermet 1211 Genève 4 Tél.: (022) 379 62 73 Fax: (022) 379 69 92   Wednesday 25 April 2012 SEMINAIRE DE PHYSIQUE CORPUSCULAIRE Science III, Auditoire 1S081 30Science III, Auditoire 1S081 30 Pixel Detectors – trends and options for the future Prof. Norbert Wermes - University of Bonn  Pixel detectors have been invented in the early 90s with the advancement of micro technologies. With the advent of the LHC, big vertex detectors have demonstrated that the pixel detector type is holding many of the promises it had made before. Meanwhile new, different or just improved variants of the pixel technology are being studied for their suitability for future experiments or experiment upgrades. The talk will address the various pro's and con's comparing hybrid and monolithic pixel technologies and their su...

X-ray micro-beam characterization of a small pixel spectroscopic CdTe detector

Science.gov (United States)

Veale, M. C.; Bell, S. J.; Seller, P.; Wilson, M. D.; Kachkanov, V.

2012-07-01

A small pixel, spectroscopic, CdTe detector has been developed at the Rutherford Appleton Laboratory (RAL) for X-ray imaging applications. The detector consists of 80 × 80 pixels on a 250 μm pitch with 50 μm inter-pixel spacing. Measurements with an 241Am γ-source demonstrated that 96% of all pixels have a FWHM of better than 1 keV while the majority of the remaining pixels have FWHM of less than 4 keV. Using the Diamond Light Source synchrotron, a 10 μm collimated beam of monochromatic 20 keV X-rays has been used to map the spatial variation in the detector response and the effects of charge sharing corrections on detector efficiency and resolution. The mapping measurements revealed the presence of inclusions in the detector and quantified their effect on the spectroscopic resolution of pixels.

The hardware of the ATLAS Pixel Detector Control System

International Nuclear Information System (INIS)

Henss, T; Andreani, A; Boek, J; Boyd, G; Citterio, M; Einsweiler, K; Kersten, S; Kind, P; Lantzsch, K; Latorre, S; Maettig, P; Meroni, C; Sabatini, F; Schultes, J

2007-01-01

The innermost part of the ATLAS (A Toroidal LHC ApparatuS) experiment, which is currently under construction at the LHC (Large Hadron Collider), will be a silicon pixel detector comprised of 1744 individual detector modules. To operate these modules, the readout electronics, and other detector components, a complex power supply and control system is necessary. The specific powering and control requirements, as well as the custom made components of our power supply and control systems, are described. These include remotely programmable regulator stations, the power supply system for the optical transceivers, several monitoring units, and the Interlock System. In total, this comprises the Pixel Detector Control System (DCS)

Angular resolution of the gaseous micro-pixel detector Gossip

Science.gov (United States)

Bilevych, Y.; Blanco Carballo, V.; van Dijk, M.; Fransen, M.; van der Graaf, H.; Hartjes, F.; Hessey, N.; Koppert, W.; Nauta, S.; Rogers, M.; Romaniouk, A.; Veenhof, R.

2011-06-01

Gossip is a gaseous micro-pixel detector with a very thin drift gap intended for a high rate environment like at the pixel layers of ATLAS at the sLHC. The detector outputs not only the crossing point of a traversing MIP, but also the angle of the track, thus greatly simplifying track reconstruction. In this paper we describe a testbeam experiment to examine the angular resolution of the reconstructed track segments in Gossip. We used here the low diffusion gas mixture DME/CO 2 50/50. An angular resolution of 20 mrad for perpendicular tracks could be obtained from a 1.5 mm thin drift volume. However, for the prototype detector used at the testbeam experiment, the resolution of slanting tracks was worsened by poor time resolution of the pixel chip used.

Angular resolution of the gaseous micro-pixel detector Gossip

Energy Technology Data Exchange (ETDEWEB)

Bilevych, Y.; Blanco Carballo, V.; Dijk, M. van; Fransen, M.; Graaf, H. van der; Hartjes, F.; Hessey, N.; Koppert, W.; Nauta, S. [Nikhef, P.O. Box 41882, 1009 DB Amsterdam (Netherlands); Rogers, M. [Radboud University, P.O. Box 9102, 6500HC Nijmegen (Netherlands); Romaniouk, A.; Veenhof, R. [CERN, CH-1211, Geneve 23 (Switzerland)

2011-06-15

Gossip is a gaseous micro-pixel detector with a very thin drift gap intended for a high rate environment like at the pixel layers of ATLAS at the sLHC. The detector outputs not only the crossing point of a traversing MIP, but also the angle of the track, thus greatly simplifying track reconstruction. In this paper we describe a testbeam experiment to examine the angular resolution of the reconstructed track segments in Gossip. We used here the low diffusion gas mixture DME/CO{sub 2} 50/50. An angular resolution of 20 mrad for perpendicular tracks could be obtained from a 1.5 mm thin drift volume. However, for the prototype detector used at the testbeam experiment, the resolution of slanting tracks was worsened by poor time resolution of the pixel chip used.

Angular resolution of the gaseous micro-pixel detector Gossip

International Nuclear Information System (INIS)

Bilevych, Y.; Blanco Carballo, V.; Dijk, M. van; Fransen, M.; Graaf, H. van der; Hartjes, F.; Hessey, N.; Koppert, W.; Nauta, S.; Rogers, M.; Romaniouk, A.; Veenhof, R.

2011-01-01

Gossip is a gaseous micro-pixel detector with a very thin drift gap intended for a high rate environment like at the pixel layers of ATLAS at the sLHC. The detector outputs not only the crossing point of a traversing MIP, but also the angle of the track, thus greatly simplifying track reconstruction. In this paper we describe a testbeam experiment to examine the angular resolution of the reconstructed track segments in Gossip. We used here the low diffusion gas mixture DME/CO 2 50/50. An angular resolution of 20 mrad for perpendicular tracks could be obtained from a 1.5 mm thin drift volume. However, for the prototype detector used at the testbeam experiment, the resolution of slanting tracks was worsened by poor time resolution of the pixel chip used.

Wire Bonding on 2S Modules of the Phase-2 CMS Detector

CERN Document Server

AUTHOR|(CDS)2226525; Pooth, Oliver

The LHC will be upgraded to the HL-LHC in the Long Shutdown 3 starting 2024. This upgrade will increase the collision rate and the overall number of colliding particles requiring high precision particle detectors which are able to cope with much higher radiation doses and numbers of particle interactions per bunch crossing. To fulfill these technical requirements the CMS detector will be upgraded in the so-called Phase-2 Upgrade. Among others the silicon tracking system will be completely replaced by a new system providing a higher acceptance, an improved granularity and the feature to include its tracking information into the level-1 trigger. The new outer-tracker will consist of so called 2S modules consisting of two strip sensors and PS modules with a macro-pixel sensor and a strip sensor. The electrical connection between the strip sensors and the front-end electronics is realized by thin aluminum wire bonds. In this thesis the process of wire bonding is introduced and its implementation in the 2S module ...

Detector Control System for CMS RPC at GIF++

CERN Document Server

Gul, Muhammad

2016-01-01

In the framework of the High Luminosity LHC upgrade program, the CMS muon groupbuilt several different RPC prototypes that are now under test at the new CERN Gamma Irradiation Facility (GIF++). A dedicated Detector Control System has been developed using the WinCC-OA tool to control and monitor these prototype detectors and to store the measured parameters data.

Experience from design, prototyping and production of a DC-DC conversion powering scheme for the CMS Phase-1 Pixel Upgrade

International Nuclear Information System (INIS)

Feld, L.; Karpinski, W.; Klein, K.; Lipinski, M.; Preuten, M.; Rauch, M.; Schmitz, S.; Wlochal, M.

2016-01-01

The CMS collaboration has adopted a DC-DC conversion powering scheme for the Phase-1 Upgrade of its pixel detector. DC-DC buck converters with a conversion ratio of around 3 are installed on the support structures, outside of the sensitive tracking region, requiring a re-design of the low and high voltage distribution to the pixel modules. After several years of R and D, the project has entered the production phase. A total of 1800 DC-DC converters are being produced, and rigorous quality assurance and control is being employed during the production process. The testing program is outlined, results from mass production are presented and issues that have been encountered are described. In addition, two system level challenges, namely the choice of output voltage in the presence of large, load-dependent voltage drops, and the thermal management required to remove the heat load caused by the DC-DC converters, are discussed

3D silicon pixel detectors for the High-Luminosity LHC

CERN Document Server

Lange, J.

2016-01-01

3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC upgrade of the ATLAS pixel detector. 3D detectors are already in use today in the ATLAS IBL and AFP experiments. These are based on 50x250 um2 large pixels connected to the FE-I4 readout chip. Detectors of this generation were irradiated to HL-LHC fluences and demonstrated excellent radiation hardness with operational voltages as low as 180 V and power dissipation of 12--15 mW/cm2 at a fluence of about 1e16 neq/cm2, measured at -25 degree C. Moreover, to cope with the higher occupancies expected at the HL-LHC, a first run of a new generation of 3D detectors designed for the HL-LHC was produced at CNM with small pixel sizes of 50x50 and 25x100 um2, matched to the FE-I4 chip. They demonstrated a good performance in the laboratory and in beam tests with hit efficiencies of about 97% at already 1--2V before irradiation.

3D track reconstruction capability of a silicon hybrid active pixel detector

Energy Technology Data Exchange (ETDEWEB)

Bergmann, Benedikt; Pichotka, Martin; Pospisil, Stanislav; Vycpalek, Jiri [Czech Technical University in Prague, Institute of Experimental and Applied Physics, Praha (Czech Republic); Burian, Petr; Broulim, Pavel [Czech Technical University in Prague, Institute of Experimental and Applied Physics, Praha (Czech Republic); University of West Bohemia, Faculty of Electrical Engineering, Pilsen (Czech Republic); Jakubek, Jan [Advacam s.r.o., Praha (Czech Republic)

2017-06-15

Timepix3 detectors are the latest generation of hybrid active pixel detectors of the Medipix/Timepix family. Such detectors consist of an active sensor layer which is connected to the readout ASIC (application specific integrated circuit), segmenting the detector into a square matrix of 256 x 256 pixels (pixel pitch 55 μm). Particles interacting in the active sensor material create charge carriers, which drift towards the pixelated electrode, where they are collected. In each pixel, the time of the interaction (time resolution 1.56 ns) and the amount of created charge carriers are measured. Such a device was employed in an experiment in a 120 GeV/c pion beam. It is demonstrated, how the drift time information can be used for ''4D'' particle tracking, with the three spatial dimensions and the energy losses along the particle trajectory (dE/dx). Since the coordinates in the detector plane are given by the pixelation (x,y), the x- and y-resolution is determined by the pixel pitch (55 μm). A z-resolution of 50.4 μm could be achieved (for a 500 μm thick silicon sensor at 130 V bias), whereby the drift time model independent z-resolution was found to be 28.5 μm. (orig.)

3D track reconstruction capability of a silicon hybrid active pixel detector

Science.gov (United States)

Bergmann, Benedikt; Pichotka, Martin; Pospisil, Stanislav; Vycpalek, Jiri; Burian, Petr; Broulim, Pavel; Jakubek, Jan

2017-06-01

Timepix3 detectors are the latest generation of hybrid active pixel detectors of the Medipix/Timepix family. Such detectors consist of an active sensor layer which is connected to the readout ASIC (application specific integrated circuit), segmenting the detector into a square matrix of 256 × 256 pixels (pixel pitch 55 μm). Particles interacting in the active sensor material create charge carriers, which drift towards the pixelated electrode, where they are collected. In each pixel, the time of the interaction (time resolution 1.56 ns) and the amount of created charge carriers are measured. Such a device was employed in an experiment in a 120 GeV/c pion beam. It is demonstrated, how the drift time information can be used for "4D" particle tracking, with the three spatial dimensions and the energy losses along the particle trajectory (dE/dx). Since the coordinates in the detector plane are given by the pixelation ( x, y), the x- and y-resolution is determined by the pixel pitch (55 μm). A z-resolution of 50.4 μm could be achieved (for a 500 μm thick silicon sensor at 130 V bias), whereby the drift time model independent z-resolution was found to be 28.5 μm.

The INFN-FBK pixel R&D program for HL-LHC

Science.gov (United States)

Meschini, M.; Dalla Betta, G. F.; Boscardin, M.; Calderini, G.; Darbo, G.; Giacomini, G.; Messineo, A.; Ronchin, S.

2016-09-01

We report on the ATLAS and CMS joint research activity, which is aiming at the development of new, thin silicon pixel detectors for the Large Hadron Collider Phase-2 detector upgrades. This R&D is performed under special agreement between Istituto Nazionale di Fisica Nucleare and FBK foundation (Trento, Italy). New generations of 3D and planar pixel sensors with active edges are being developed in the R&D project, and will be fabricated at FBK. A first planar pixel batch, which was produced by the end of year 2014, will be described in this paper. First clean room measurement results on planar sensors obtained before and after neutron irradiation will be presented.

The INFN-FBK pixel R&D program for HL-LHC

International Nuclear Information System (INIS)

Meschini, M.; Dalla Betta, G.F.; Boscardin, M.; Calderini, G.; Darbo, G.; Giacomini, G.; Messineo, A.; Ronchin, S.

2016-01-01

We report on the ATLAS and CMS joint research activity, which is aiming at the development of new, thin silicon pixel detectors for the Large Hadron Collider Phase-2 detector upgrades. This R&D is performed under special agreement between Istituto Nazionale di Fisica Nucleare and FBK foundation (Trento, Italy). New generations of 3D and planar pixel sensors with active edges are being developed in the R&D project, and will be fabricated at FBK. A first planar pixel batch, which was produced by the end of year 2014, will be described in this paper. First clean room measurement results on planar sensors obtained before and after neutron irradiation will be presented.

Si and gaas pixel detectors for medical imaging applications

International Nuclear Information System (INIS)

Bisogni, M. G.

2001-01-01

As the use of digital radiographic equipment in the morphological imaging field is becoming the more and more diffuse, the research of new and more performing devices from public institutions and industrial companies is in constant progress. Most of these devices are based on solid-state detectors as X-ray sensors. Semiconductor pixel detectors, originally developed in the high energy physics environment, have been then proposed as digital detector for medical imaging applications. In this paper a digital single photon counting device, based on silicon and GaAs pixel detector, is presented. The detector is a thin slab of semiconductor crystal where an array of 64 by 64 square pixels, 170- m side, has been built on one side. The data read-out is performed by a VLSI integrated circuit named Photon Counting Chip (PCC), developed within the MEDIPIX collaboration. Each chip cell geometrically matches the sensor pixel. It contains a charge preamplifier, a threshold comparator and a 15 bits pseudo-random counter and it is coupled to the detector by means of bump bonding. Most important advantages of such system, with respect to a traditional X-rays film/screen device, are the wider linear dynamic range (3x104) and the higher performance in terms of MTF and DQE. Besides the single photon counting architecture allows to detect image contrasts lower than 3%. Electronics read-out performance as well as imaging capabilities of the digital device will be presented. Images of mammographic phantoms acquired with a standard Mammographic tube will be compared with radiographs obtained with traditional film/screen systems

Results from the Commissioning of the ATLAS Pixel Detector

CERN Document Server

Strandberg, S

2009-01-01

The ATLAS pixel detector is a high resolution, silicon based, tracking detector with its innermost layer located only 5 cm away from the ATLAS interaction point. It is designed to provide good hit resolution and low noise, both important qualities for pattern recognition and for finding secondary vertices originating from decays of long-lived particles. The pixel detector has 80 million readout channels and is built up of three barrel layers and six disks, three on each side of the barrel. The detector was installed in the center of ATLAS in June 2007 and is currently being calibrated and commissioned. Details from the installation, commissioning and calibration are presented together with the current status.

A silicon pixel detector with routing for external VLSI read-out

International Nuclear Information System (INIS)

Thomas, S.L.; Seller, P.

1988-07-01

A silicon pixel detector with an array of 32 by 16 hexagonal pixels has been designed and is being built on high resistivity silicon. The detector elements are reverse biased diodes consisting of p-implants in an n-type substrate and are fully depleted from the front to the back of the wafer. They are intended to measure high energy ionising particles traversing the detector. The detailed design of the pixels, their layout and method of read-out are discussed. A number of test structures have been incorporated onto the wafer to enable measurements to be made on individual pixels together with a variety of active devices. The results will give a better understanding of the operation of the pixel array, and will allow testing of computer simulations of more elaborate structures for the future. (author)

Modelling of the small pixel effect in gallium arsenide X-ray imaging detectors

CERN Document Server

Sellin, P J

1999-01-01

A Monte Carlo simulation has been carried out to investigate the small pixel effect in highly pixellated X-ray imaging detectors fabricated from semi-insulating gallium arsenide. The presence of highly non-uniform weighting fields in detectors with a small pixel geometry causes the majority of the induced signal to be generated when the moving charges are close to the pixellated contacts. The response of GaAs X-ray imaging detectors is further complicated by the presence of charge trapping, particularly of electrons. In this work detectors are modelled with a pixel pitch of 40 and 150 mu m, and with thicknesses of 300 and 500 mu m. Pulses induced in devices with 40 mu m pixels are due almost totally to the movement of the lightly-trapped holes and can exhibit significantly higher charge collection efficiencies than detectors with large electrodes, in which electron trapping is significant. Details of the charge collection efficiencies as a function of interaction depth in the detector and of the incident phot...

Success in the pipeline for CMS

CERN Multimedia

2008-01-01

The very heart of any LHC experiment is not a pixel detector, nor a vertex locator but a beam pipe. It is the site of each collision and the boundary where the accelerator and experiment meet. As an element of complex design and manufacture the CMS beam pipe was fifteen years in the making and finally fully installed on Tuesday 10 June. Watch the video! End cap beam pipe installation in the CMS detector. Central beam pipe installation.The compensation modules were the final pieces to take their places in the cavern at Point 5: "These are like bellows," says Wolfram Zeuner, Deputy Technical Co-ordinator for CMS. "They allow us to compensate for the change in length when we heat or cool the beam pipe. And they are the very last elements; beam pipe installation, which began last year, is now complete." The beam pipe is neither too fragile nor too bulky, but just right to satisfy the conflicting n...

Operational Experience and Performance with the ATLAS Pixel detector

CERN Document Server

Martin, Christopher Blake; The ATLAS collaboration

2018-01-01

The tracking performance of the ATLAS detector relies critically on its 4-layer Pixel Detector, that has undergone significant hardware and software upgrades to meet the challenges imposed by the higher collision energy, pileup and luminosity that are being delivered by the Large Hadron Collider, with record breaking instantaneous luminosities of $1.3\\times10^{34}\\text{cm}^{{-2}}\\text{s}^{{-1}}$ recently surpassed. The key status and performance metrics of the ATLAS Pixel Detector are summarized, and the operational experience and requirements to ensure optimum data quality and data taking efficiency are described, with special emphasis to radiation damage experience.

Operational Experience and Performance with the ATLAS Pixel detector

CERN Document Server

Martin, Christopher Blake; The ATLAS collaboration

2018-01-01

The tracking performance of the ATLAS detector relies critically on its 4-layer Pixel Detector, that has undergone significant hardware and software upgrades to meet the challenges imposed by the higher collision energy, pileup and luminosity that are being delivered by the Large Hadron Collider, with record breaking instantaneous luminosities of 1.3 x 10^34 cm-2 s-1 recently surpassed. The key status and performance metrics of the ATLAS Pixel Detector are summarised, and the operational experience and requirements to ensure optimum data quality and data taking efficiency are described, with special emphasis to radiation damage experience.

PROTON RADIOGRAPHY WITH THE PIXEL DETECTOR TIMEPIX

Directory of Open Access Journals (Sweden)

Václav Olšanský

2016-12-01

Full Text Available This article presents the processing of radiographic data acquired using the position-sensitive hybrid semiconductor pixel detector Timepix. Measurements were made on thin samples at the medical ion-synchrotron HIT [1] in Heidelberg (Germany with a 221 MeV proton beam. The charge is energy by the particles crossing the sample is registered for generation of image contrast. Experimental data from the detector were processed for derivation of the energy loss of each proton using calibration matrices. The interaction point of the protons on the detector were determined with subpixel resolution by model fitting of the individual signals in the pixelated matrix. Three methods were used for calculation of these coordinates: Hough transformation, 2D Gaussian fitting and estimate the 2D mean. Parameters of calculation accuracy and calculation time are compared for each method. The final image was created by method with best parameters.

Modeling radiation damage to pixel sensors in the ATLAS detector

Science.gov (United States)

Ducourthial, A.

2018-03-01

Silicon pixel detectors are at the core of the current and planned upgrade of the ATLAS detector at the Large Hadron Collider (LHC) . As the closest detector component to the interaction point, these detectors will be subject to a significant amount of radiation over their lifetime: prior to the High-Luminosity LHC (HL-LHC) [1], the innermost layers will receive a fluence in excess of 1015 neq/cm2 and the HL-LHC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. Simulating radiation damage is essential in order to make accurate predictions for current and future detector performance that will enable searches for new particles and forces as well as precision measurements of Standard Model particles such as the Higgs boson. We present a digitization model that includes radiation damage effects on the ATLAS pixel sensors for the first time. In addition to thoroughly describing the setup, we present first predictions for basic pixel cluster properties alongside early studies with LHC Run 2 proton-proton collision data.

Leakage current measurements on pixelated CdZnTe detectors

International Nuclear Information System (INIS)

Dirks, B.P.F.; Blondel, C.; Daly, F.; Gevin, O.; Limousin, O.; Lugiez, F.

2006-01-01

In the field of the R and D of a new generation hard X-ray cameras for space applications we focus on the use of pixelated CdTe or CdZnTe semiconductor detectors. They are covered with 64 (0.9x0.9 mm 2 ) or 256 (0.5x0.5 mm 2 ) pixels, surrounded by a guard ring and operate in the energy ranging from several keV to 1 MeV, at temperatures between -20 and +20 o C. A critical parameter in the characterisation of these detectors is the leakage current per pixel under polarisation (∼50-500 V/mm). In operation mode each pixel will be read-out by an integrated spectroscopy channel of the multi-channel IDeF-X ASIC currently developed in our lab. The design and functionality of the ASIC depends directly on the direction and value of the current. A dedicated and highly insulating electronics circuit is designed to automatically measure the current in each individual pixel, which is in the order of tens of pico-amperes. Leakage current maps of different CdZnTe detectors of 2 and 6 mm thick and at various temperatures are presented and discussed. Defect density diagnostics have been performed by calculation of the activation energy of the material

Investigation of photon counting pixel detectors for X-ray spectroscopy and imaging

Energy Technology Data Exchange (ETDEWEB)

Talla, Patrick Takoukam

2011-04-07

The Medipix2 and Medipix3 detectors are hybrid pixelated photon counting detectors with a pixel pitch of 55 {mu}m. The sensor material used in this thesis was silicon. Because of their small pixel size they suffer from charge sharing i.e. an incoming photon can be registered by more than one pixel. In order to correct for charge sharing due to lateral diffusion of charge carriers, the Medipix3 detector was developed: with its Charge Summing Mode, the charge collected in a cluster of 2 x 2 pixel is added up and attributed to only one pixel whose counter is incremented. The adjustable threshold of the detectors allows to count the photons and to gain information on their energy. The main purposes of the thesis are to investigate spectral and imaging properties of pixelated photon counting detectors from the Medipix family such as Medipix2 and Medipix3. The investigations are based on simulations and measurements. In order to investigate the spectral properties of the detectors measurements were performed using fluorescence lines of materials such as molybdenum, silver but also some radioactive sources such as Am-241 or Cd-109. From the measured data, parameters like the threshold dispersion and the gain variation from pixel-to-pixel were extracted and used as input in the Monte Carlo code ROSI to model the responses of the detector to monoenergetic photons. The measured data are well described by the simulations for Medipix2 and for Medipix3 operating in Charge Summing Mode. Due to charge sharing and due to the energy dependence of attenuation processes in silicon and to Compton scattering the incoming and the measured spectrum differ substantially from each other. Since the responses to monoenergetic photons are known, a deconvolution was performed to determine the true incoming spectrum. Several direct and iterative methods were successfully applied on measured and simulated data of an X-ray tube and radioactive sources. The knowledge of the X-ray spectrum is

Investigation of photon counting pixel detectors for X-ray spectroscopy and imaging

International Nuclear Information System (INIS)

Talla, Patrick Takoukam

2011-01-01

The Medipix2 and Medipix3 detectors are hybrid pixelated photon counting detectors with a pixel pitch of 55 μm. The sensor material used in this thesis was silicon. Because of their small pixel size they suffer from charge sharing i.e. an incoming photon can be registered by more than one pixel. In order to correct for charge sharing due to lateral diffusion of charge carriers, the Medipix3 detector was developed: with its Charge Summing Mode, the charge collected in a cluster of 2 x 2 pixel is added up and attributed to only one pixel whose counter is incremented. The adjustable threshold of the detectors allows to count the photons and to gain information on their energy. The main purposes of the thesis are to investigate spectral and imaging properties of pixelated photon counting detectors from the Medipix family such as Medipix2 and Medipix3. The investigations are based on simulations and measurements. In order to investigate the spectral properties of the detectors measurements were performed using fluorescence lines of materials such as molybdenum, silver but also some radioactive sources such as Am-241 or Cd-109. From the measured data, parameters like the threshold dispersion and the gain variation from pixel-to-pixel were extracted and used as input in the Monte Carlo code ROSI to model the responses of the detector to monoenergetic photons. The measured data are well described by the simulations for Medipix2 and for Medipix3 operating in Charge Summing Mode. Due to charge sharing and due to the energy dependence of attenuation processes in silicon and to Compton scattering the incoming and the measured spectrum differ substantially from each other. Since the responses to monoenergetic photons are known, a deconvolution was performed to determine the true incoming spectrum. Several direct and iterative methods were successfully applied on measured and simulated data of an X-ray tube and radioactive sources. The knowledge of the X-ray spectrum is

Low $p_T$ Hadronic Physics with CMS

CERN Document Server

AUTHOR|(CDS)2072044

2007-01-01

The pixel detector of CMS can be used to reconstruct very low pT charged particles down to about 0.1 GeV/c. This can be achieved with good efficiency, resolution and negligible fake rate for elementary collisions. In case of central PbPb the fake rate can be kept low for pT>0.4 GeV/c. In addition, the detector can be employed for identification of neutral hadrons (V0s) and converted photons.

Low pT Hadronic Physics with CMS

CERN Document Server

Sikler, Ferenc

2007-01-01

The pixel detector of CMS can be used to reconstruct very low pT charged particles down to about 0.1 GeV/c. This can be achieved with good efficiency, resolution and negligible fake rate for elementary collisions. In case of central PbPb the fake rate can be kept low for pT>0.4 GeV/c. In addition, the detector can be employed for identification of neutral hadrons (V0s) and converted photons.

Data quality monitoring of the CMS Silicon Strip Tracker detector

International Nuclear Information System (INIS)

Benucci, L.

2010-01-01

The Physics and Data Quality Monitoring (DQM) framework aims at providing a homogeneous monitoring environment across various applications related to data taking at the CMS experiment. In this contribution, the DQM system for the Silicon Strip Tracker will be introduced. The set of elements to assess the status of detector will be mentioned, along with the way to identify problems and trace them to specific tracker elements. Monitoring tools, user interfaces and automated software will be briefly described. The system was used during extensive cosmic data taking of CMS in Autumn 2008, where it demonstrated to have a flexible and robust implementation and has been essential to improve the understanding of the detector. CMS Collaboration believes that this tool is now mature to face the forthcoming data-taking era.

The CMS detector magnet

CERN Document Server

Hervé, A

2000-01-01

CMS (Compact Muon Solenoid) is a general-purpose detector designed to run in mid-2005 at the highest luminosity at the LHC at CERN. Its distinctive features include a 6 m free bore diameter, 12.5 m long, 4 T superconducting solenoid enclosed inside a 10,000 tonne return yoke. The magnet will be assembled and tested on the surface by the end of 2003 before being transferred by heavy lifting means to a 90 m deep underground experimental area. The design and construction of the magnet is a `common project' of the CMS Collaboration. It is organized by a CERN based group with strong technical and contractual participation by CEA Saclay, ETH Zurich, Fermilab Batavia IL, INFN Geneva, ITEP Moscow, University of Wisconsin and CERN. The return yoke, 21 m long and 14 m in diameter, is equivalent to 1.5 m of saturated iron interleaved with four muon stations. The yoke and the vacuum tank are being manufactured. The indirectly-cooled, pure- aluminium-stabilized coil is made up from five modules internally wound with four ...

STAR PIXEL detector mechanical design

Energy Technology Data Exchange (ETDEWEB)

Wieman, H H; Anderssen, E; Greiner, L; Matis, H S; Ritter, H G; Sun, X; Szelezniak, M [Lawrence Berkeley National Laboratory, Berkeley, CA 94720 (United States)], E-mail: hhwieman@lbl.gov

2009-05-15

A high resolution pixel detector is being designed for the STAR [1] experiment at RHIC. This device will use MAPS as the detector element and will have a pointing accuracy of {approx}25 microns. We will be reporting on the mechanical design required to support this resolution. The radiation length of the first layer ({approx}0.3% X{sub 0}) and its distance from the interaction point (2.5 cm) determines the resolution. The design makes use of air cooling and thin carbon composite structures to limit the radiation length. The mechanics are being developed to achieve spatial calibrations and stability to 20 microns and to permit rapid detector replacement in event of radiation damage or other potential failures from operation near the beam.

Optimization of detector pixel size for stent visualization in x-ray fluoroscopy

International Nuclear Information System (INIS)

Jiang Yuhao; Wilson, David L.

2006-01-01

Pixel size is of great interest in the flat-panel detector design because of its potential impact on image quality. In the particular case of angiographic x-ray fluoroscopy, small pixels are required in order to adequately visualize interventional devices such as guidewires and stents which have wire diameters as small as 200 and 50 μm, respectively. We used quantitative experimental and modeling techniques to investigate the optimal pixel size for imaging stents. Image quality was evaluated by the ability of subjects to perform two tasks: detect the presence of a stent and discriminate a partially deployed stent from a fully deployed one in synthetic images. With measurements at 50, 100, 200, and 300 μm, the 100 μm pixel size gave the maximum contrast sensitivity for the detection experiment with the idealized direct detector. For an idealized indirect detector with a scintillating layer, an optimal pixel size was obtained at 200 μm pixel size. A channelized human observer model predicted a peak at 150 and 170 μm, for the idealized direct and indirect detectors, respectively. With regard to the stent deployment task for both detector types, smaller pixel sizes are favored and there is a steep drop in performance with larger pixels. In general, with the increasing exposures, the model and measurements give the enhanced contrast sensitivities and a smaller optimal pixel size. The effects of electronic noise and fill factor were investigated using the model. We believe that the experimental results and human observer model predications can help guide the flat-panel detector design. In addition, the human observer model should work on the similar images and be applicable to the future model and actual flat-panel implementations

Simulation framework and XML detector description for the CMS experiment

CERN Document Server

Arce, P; Boccali, T; Case, M; de Roeck, A; Lara, V; Liendl, M; Nikitenko, A N; Schröder, M; Strässner, A; Wellisch, H P; Wenzel, H

2003-01-01

Currently CMS event simulation is based on GEANT3 while the detector description is built from different sources for simulation and reconstruction. A new simulation framework based on GEANT4 is under development. A full description of the detector is available, and the tuning of the GEANT4 performance and the checking of the ability of the physics processes to describe the detector response is ongoing. Its integration on the CMS mass production system and GRID is also currently under development. The Detector Description Database project aims at providing a common source of information for Simulation, Reconstruction, Analysis, and Visualisation, while allowing for different representations as well as specific information for each application. A functional prototype, based on XML, is already released. Also examples of the integration of DDD in the GEANT4 simulation and in the reconstruction applications are provided.

Test-beam results of a SOI pixel detector prototype

CERN Document Server

Bugiel, Roma; Dannheim, Dominik; Fiergolski, Adrian; Hynds, Daniel; Idzik, Marek; Kapusta, P; Kucewicz, Wojciech; Munker, Ruth Magdalena; Nurnberg, Andreas Matthias

2018-01-01

This paper presents the test-beam results of a monolithic pixel-detector prototype fabricated in 200 nm Silicon-On-Insulator (SOI) CMOS technology. The SOI detector was tested at the CERN SPS H6 beam line. The detector is fabricated on a 500 μm thick high-resistivity float- zone n-type (FZ-n) wafer. The pixel size is 30 μm × 30 μm and its readout uses a source- follower configuration. The test-beam data are analysed in order to compute the spatial resolution and detector efficiency. The analysis chain includes pedestal and noise calculation, cluster reconstruction, as well as alignment and η-correction for non-linear charge sharing. The results show a spatial resolution of about 4.3 μm.

A MCM-D-type module for the ATLAS pixel detector

CERN Document Server

Becks, K H; Ehrmann, O; Gerlach, P; Gregor, I M; Pieters, P; Topper, M; Truzzi, C; Wolf, J

1999-01-01

For the ATLAS experiment at the planned Large Hadron Collider LHC at CERN hybrid pixel detectors are being built as innermost layers of the inner tracking detector system. Modules are the basic building blocks of the ATLAS pixel $9 detector. A module consists of a sensor tile with an active area of 16.4 mm*60.4 mm, 16 read out IC's, each serving 24*160 pixel unit cells, a module controller chip, an optical transceiver and the local signal interconnection and $9 power distribution busses. The dies are attached by flip-chip assembly to the sensor diodes and the local busses. In the following a module based on MCM-D technology will be discussed and prototype results will be presented.

Level-1 pixel based tracking trigger algorithm for LHC upgrade

CERN Document Server

Moon, Chang-Seong

2015-01-01

The Pixel Detector is the innermost detector of the tracking system of the Compact Muon Solenoid (CMS) experiment at CERN Large Hadron Collider (LHC). It precisely determines the interaction point (primary vertex) of the events and the possible secondary vertexes due to heavy flavours ($b$ and $c$ quarks); it is part of the overall tracking system that allows reconstructing the tracks of the charged particles in the events and combined with the magnetic field to measure their impulsion. The pixel detector allows measuring the tracks in the region closest to the interaction point. The Level-1 (real-time) pixel based tracking trigger is a novel trigger system that is currently being studied for the LHC upgrade. An important goal is developing real-time track reconstruction algorithms able to cope with very high rates and high flux of data in a very harsh environment. The pixel detector has an especially crucial role in precisely identifying the primary vertex of the rare physics events from the large pile-up (P...

Macro Pixel ASIC (MPA): The readout ASIC for the pixel-strip (PS) module of the CMS outer tracker at HL-LHC

CERN Document Server

Ceresa, Davide; Kloukinas, Konstantinos; Jan Kaplon; Bialas, Wojciech; Re, Valerio; Traversi, Gianluca; Gaioni, Luigi; Ratti, Lodovico

2014-01-01

The CMS tracker at HL-LHC is required to provide prompt information on particles with high transverse momentum to the central Level\\,1 trigger. For this purpose, the innermost part of the outer tracker is based on a combination of a pixelated sensor with a short strip sensor, the so-called Pixel-Strip module (PS). The readout of these sensors is carried out by distinct ASICs, the Strip Sensor ASIC (SSA), for the strip layer, and the Macro Pixel ASIC (MPA) for the pixel layer. The processing of the data directly on the front-end module represents a design challenge due to the large data volume (30720\\,pixels and 1920\\,strips per module) and the limited power budget. This is the reason why several studies have been carried out to find the best compromise between ASICs performance and power consumption. This paper describes the current status of the MPA ASIC development where the logic for generating prompt information on particles with high transverse momentum is implemented. An overview of the readout method i...

Development of the MCM-D technique for pixel detector modules

CERN Document Server

Grah, Christian

2005-01-01

This thesis treats a copper--polymer based thin film technology, the MCM-D technique and its application when building hybrid pixel detector modules. The ATLAS experiment at the LHC will be equipped with a pixel detector system. The basic mechanical units of the pixel detector are multi chip modules. The main components of these modules are: 16 electronic chips, a controller chip and a large sensor tile, featuring more than 46000 sensor cells. MCM-D is a superior technique to build the necessary signal bus system and the power distribution system directly on the active sensor tile. In collaboration with the Fraunhofer Institute for Reliability and Microintegration, IZM, the thin film process is reviewed and enhanced. The multi layer system was designed and optimized for the interconnection system as well as for the 46000 pixel contacts. Laboratory measurements on prototypes prove that complex routing schemes for geometrically optimized single chips are suitable and have negligible influence on the front--end ...

The Upgraded Pixel Detector of the ATLAS Experiment for Run-2 at the LHC

CERN Document Server

AUTHOR|(INSPIRE)INSPIRE-00084948; The ATLAS collaboration

2016-01-01

Run-2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130 nm technology. In addition the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning and performance of the 4-layer Pixel Detector, in particular the IBL, will be presented using collision data.

Online Calibration and Performance of the ATLAS Pixel Detector

CERN Document Server

Keil, M

2011-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN. It consists of 1744 silicon sensors equipped with approximately 80 million electronic channels, providing typically three measurement points with high resolution for particles emerging from the beam-interaction region, thus allowing measuring particle tracks and secondary vertices with very high precision. The readout system of the Pixel Detector is based on a bi-directional optical data transmission system between the detector and the data acquisition system with an individual link for each of the 1744 modules. Signal conversion components are located on both ends, approximately 80 m apart. This paper describes the tuning and calibration of the optical links and the detector modules, including measurements of threshold, noise, charge measurement, timing performance and the sensor leakage current.

The Dosepix detector—an energy-resolving photon-counting pixel detector for spectrometric measurements

CERN Document Server

Zang, A; Ballabriga, R; Bisello, F; Campbell, M; Celi, J C; Fauler, A; Fiederle, M; Jensch, M; Kochanski, N; Llopart, X; Michel, N; Mollenhauer, U; Ritter, I; Tennert, F; Wölfel, S; Wong, W; Michel, T

2015-01-01

The Dosepix detector is a hybrid photon-counting pixel detector based on ideas of the Medipix and Timepix detector family. 1 mm thick cadmium telluride and 300 μm thick silicon were used as sensor material. The pixel matrix of the Dosepix consists of 16 x 16 square pixels with 12 rows of (200 μm)2 and 4 rows of (55 μm)2 sensitive area for the silicon sensor layer and 16 rows of pixels with 220 μm pixel pitch for CdTe. Besides digital energy integration and photon-counting mode, a novel concept of energy binning is included in the pixel electronics, allowing energy-resolved measurements in 16 energy bins within one acquisition. The possibilities of this detector concept range from applications in personal dosimetry and energy-resolved imaging to quality assurance of medical X-ray sources by analysis of the emitted photon spectrum. In this contribution the Dosepix detector, its response to X-rays as well as spectrum measurements with Si and CdTe sensor layer are presented. Furthermore, a first evaluation wa...

Pixellated thallium bromide detectors for gamma-ray spectroscopy and imaging

Energy Technology Data Exchange (ETDEWEB)

Onodera, T. E-mail: tosiyuki@smail.tohtech.ac.jp; Hitomi, K.; Shoji, T.; Hiratate, Y

2004-06-01

Recently, pixellated semiconductor detectors exhibit high-energy resolution, which have been studied actively and fabricated from CdTe, CZT and HgI{sub 2}. Thallium bromide (TlBr) is a compound semiconductor characterized with its high atomic numbers (Tl=81, Br=35) and high density (7.56 g/cm{sup 3}). Thus, TlBr exhibits higher photon stopping power than other semiconductor materials used for radiation detector fabrication such as CdTe, CZT and HgI{sub 2}. The wide band gap of TlBr (2.68 eV) permits the detectors low-noise operation at around room temperature. Our studies made an effort to fabricate pixellated TlBr detectors had sufficient detection efficiency and good charge collection efficiency. In this study, pixellated TlBr detectors were fabricated from the crystals purified by the multipass zone-refining method and grown by the horizontal traveling molten zone (TMZ) method. The TlBr detector has a continuous cathode over one crystal surface and 3x3 pixellated anodes (0.57x0.57 mm{sup 2} each) surrounded by a guard ring on the opposite surface. The electrodes were realized by vacuum evaporation of palladium through a shadow mask. Typical thickness of the detector was 2 mm. Spectrometric performance of the TlBr detectors was tested by irradiating them with {sup 241}Am (59.5 keV), {sup 57}Co (122 keV) and {sup 137}Cs (662 keV) gamma-ray sources at temperature of -20 deg. C. Energy resolutions (FWHM) were measured to be 4.0, 6.0 and 9.7 keV for 59.5, 122 and 662 keV gamma-rays, respectively.

Gas filled prototype of a CdZnTe pixel detector

International Nuclear Information System (INIS)

Ramsey, B.; Sharma, D.; Sipila, H.; Gostilo, V.; Loupilov, A.

2001-01-01

CdZnTe pixel structures are currently the most promising detectors for the focal planes of hard X-ray telescopes, for astronomical observation in the range 5-100 keV. In Sharma et al. (Proc. SPIE 3765 (1999) 822) and Ramsey et al. (Nucl. Instrum. Methods A 458 (2001) 55) we presented preliminary results on the development of prototype 4x4 CdZnTe imaging detectors operated under vacuum. These pixel detectors were installed inside vacuum chambers on three-stage Peltier coolers providing detector temperatures down to -40 deg. C. A miniature sputter ion pump inside each chamber maintained the necessary vacuum of 10 -5 Torr. At a temperature of -20 deg. C we achieved an FWHM energy resolution of between 2% and 3% at 60 keV and ∼15% at 5.9 keV; however, the dependency on temperature was weak and at +20 deg. C the respective resolutions were 3% and 20%. As the detectors could be operated at room temperature without loss of their good characteristics it was possible to exclude the sputter ion pump and fill the chamber with dry nitrogen instead. We have tested a nitrogen-filled CdZnTe (5x5x1 mm 3 ) prototype having 0.65x0.65 mm 2 readout pads on a 0.75 mm pitch. The interpixel resistance at an applied voltage of 10 V was higher than 50 GΩ and the pixel leakage currents at room temperature with a bias of 200 V between each pad and the common electrode did not exceed 0.8 nA. The pixel detector inside the microassembly, which also contained the input stages of the preamplifiers, was installed on a Peltier cooler to maintain the detector temperature at +20 deg. C. To define real leakage currents of the pixels in their switched-on state we have checked the voltage on the preamplifiers feedback resistors. The resulting currents were 10-50 pA at a detector bias of 500 V. Under test, the typical energy resolution per pixel at +20 deg. C was ∼3% at energy 59.6 keV and ∼20% at energy 5.9 keV, which are similar to the values obtained in the vacuum prototype at room temperature

Studies for the Commissioning of the CERN CMS Silicon Strip Tracker

CERN Document Server

Bloch, Christoph; Abbaneo, Duccio; Fabjan, Christian Wolfgang

2008-01-01

In 2008 the Large Hadron Collider (LHC) at CERN will start producing proton-proton collisions of unprecedented energy. One of its main experiments is the Compact Muon Solenoid (CMS), a general purpose detector, optimized for the search of the Higgs boson and super symmetric particles. The discovery potential of the CMS detector relies on a high precision tracking system, made of a pixel detector and the largest silicon strip Tracker ever built. In order to operate successfully a device as complex as the CMS silicon strip Tracker, and to fully exploit its potential, the properties of the hardware need to be characterized as precisely as possible, and the reconstruction software needs to be commissioned with physics signals. A number of issues were identified and studied to commission the detector, some of which concern the entire Tracker, while some are specific to the Tracker Outer Barrel (TOB): - the time evolution of the signals in the readout electronics need to be precisely measured and correctly simulate...

Novel powering schemes for pixel and tracking detectors

CERN Document Server

Feld, Lutz Werner

2013-01-01

Future pixel and tracking systems like the ones foreseen in the upgrade programs of the LHC experiments are very demanding on the power supply systems. An increased amount of power has to be supplied to the front-end electronics at a reduced voltage, through existing cable plants. Novel powering schemes are needed to avoid excessive cable losses. The two schemes under consideration, serial powering and DC-DC conversion, are reviewed. Particular emphasis is put on system integration aspects. As an example, the new CMS pixel system, which will be powered via DC-DC conversion, is presented in more detail. This allows to discuss challenges and solutions for a concrete application while the conclusions should be relevant for other applications as well.

Fabrication of ATLAS pixel detector prototypes at IRST

International Nuclear Information System (INIS)

Boscardin, M.; Betta, G.-F. Dalla; Gregori, P.; Zen, M.; Zorzi, N.

2001-01-01

We report on the development of a fabrication technology for n-on-n silicon pixel detectors oriented to the ATLAS experiment at LHC. The main processing issues and some selected results from the electrical characterization of detector prototypes and related test structures are presented and discussed

CMS celebrates the lowering of its final detector element

CERN Document Server

2008-01-01

In the early hours of the morning the final element of the Compact Muon Solenoid (CMS) detector began the descent into its underground experimental cavern in preparation for the start-up of CERN's Large Hadron Collider (LHC) this summer. This is a pivotal moment for the CMS collaboration, as the experiment is the first of its kind to be constructed above ground and then lowered, element by element, 100 metres below.

Initial Measurements on Pixel Detector Modules for the ATLAS Upgrades

CERN Document Server

Gallrapp, C; The ATLAS collaboration

2011-01-01

Delicate conditions in terms of peak and integrated luminosity in the Large Hadron Collider (LHC) will raise the ATLAS Pixel Detector to its performance limits. Silicon planar, silicon 3D and diamond pixel sensors are three possible sensor technologies which could be implemented in the upcoming Pixel Detector upgrades of the ATLAS experiment. Measurements of the IV-behavior and measurements with radioactive Americium-241 and Strontium-90 are used to characterize the sensor properties and to understand the interaction between the ATLAS FE-I4 front-end chip and the sensor. Comparisons of results from before and after irradiation for silicon planar and 3D pixel sensors, which give a first impression on the charge collection properties of the different sensor technologies, are presented.

Track reconstruction in CMS high luminosity environment

CERN Document Server

AUTHOR|(CDS)2067159

2016-01-01

The CMS tracker is the largest silicon detector ever built, covering 200 square meters and providing an average of 14 high-precision measurements per track. Tracking is essential for the reconstruction of objects like jets, muons, electrons and tau leptons starting from the raw data from the silicon pixel and strip detectors. Track reconstruction is widely used also at trigger level as it improves objects tagging and resolution.The CMS tracking code is organized in several levels, known as iterative steps, each optimized to reconstruct a class of particle trajectories, as the ones of particles originating from the primary vertex or displaced tracks from particles resulting from secondary vertices. Each iterative step consists of seeding, pattern recognition and fitting by a kalman filter, and a final filtering and cleaning. Each subsequent step works on hits not yet associated to a reconstructed particle trajectory.The CMS tracking code is continuously evolving to make the reconstruction computing load compat...

Track reconstruction in CMS high luminosity environment

CERN Document Server

Goetzmann, Christophe

2014-01-01

The CMS tracker is the largest silicon detector ever built, covering 200 square meters and providing an average of 14 high-precision measurements per track. Tracking is essential for the reconstruction of objects like jets, muons, electrons and tau leptons starting from the raw data from the silicon pixel and strip detectors. Track reconstruction is widely used also at trigger level as it improves objects tagging and resolution.The CMS tracking code is organized in several levels, known as iterative steps, each optimized to reconstruct a class of particle trajectories, as the ones of particles originating from the primary vertex or displaced tracks from particles resulting from secondary vertices. Each iterative step consists of seeding, pattern recognition and fitting by a kalman filter, and a final filtering and cleaning. Each subsequent step works on hits not yet associated to a reconstructed particle trajectory.The CMS tracking code is continuously evolving to make the reconstruction computing load compat...

ATLAS rewards two pixel detector suppliers

CERN Multimedia

2007-01-01

Peter Jenni, ATLAS spokesperson, presented the ATLAS supplier award to Herbert Reichl, IZM director, and to Simonetta Di Gioia, from the SELEX company.Two of ATLAS’ suppliers were awarded prizes at a ceremony on Wednesday 13 June attended by representatives of the experiment’s management and of CERN. The prizes went to the Fraunhofer Institut für Zuverlässigkeit und Mikrointegration (IZM) in Berlin and the company SELEX Sistemi Integrati in Rome for the manufacture of modules for the ATLAS pixel detector. SELEX supplied 1500 of the modules for the tracker, while IZM produced a further 1300. The modules, each made up of 46080 channels, form the active part of the ATLAS pixel detector. IZM and SELEX received the awards for the excellent quality of their work: the average number of faulty channels per module was less than 2.10-3. They also stayed within budget and on schedule. The difficulty they faced was designing modules based on electronic components and sensor...

Optical data links for the ATLAS SCT and Pixel Detector

International Nuclear Information System (INIS)

Gregor, I.M.; Weidberg, A.R.; Lee, S.C.; Chu, M.L.; Teng, P.K.

2001-01-01

ATLAS (The ATLAS Technical Proposal, CERN/LHCC 94-33) is one of the large electronic particle detectors at LHC (The LHC Conceptual Design, Report- The Yellow Book, CERN/AC/95-05(LHC)) which will become operational in 2005. It is planned to use radiation tolerant optical links for the data transfer from the SemiConductor Tracker (SCT) (ATLAS Inner Detector Technical Proposal, CERN/LHCC 97-16 and CERN/LHCC 97-17). and Pixel Detector (ATLAS Pixel Detector Technical Proposal, CERN/LHCC 98-13) systems to the acquisition electronics over a distance up to 140m. The overall architecture and the performance of these optical data links are described. One of the three candidate designs for an on-detector Opto-Package is presented

High-speed X-ray imaging pixel array detector for synchrotron bunch isolation.

Science.gov (United States)

Philipp, Hugh T; Tate, Mark W; Purohit, Prafull; Shanks, Katherine S; Weiss, Joel T; Gruner, Sol M

2016-03-01

A wide-dynamic-range imaging X-ray detector designed for recording successive frames at rates up to 10 MHz is described. X-ray imaging with frame rates of up to 6.5 MHz have been experimentally verified. The pixel design allows for up to 8-12 frames to be stored internally at high speed before readout, which occurs at a 1 kHz frame rate. An additional mode of operation allows the integration capacitors to be re-addressed repeatedly before readout which can enhance the signal-to-noise ratio of cyclical processes. This detector, along with modern storage ring sources which provide short (10-100 ps) and intense X-ray pulses at megahertz rates, opens new avenues for the study of rapid structural changes in materials. The detector consists of hybridized modules, each of which is comprised of a 500 µm-thick silicon X-ray sensor solder bump-bonded, pixel by pixel, to an application-specific integrated circuit. The format of each module is 128 × 128 pixels with a pixel pitch of 150 µm. In the prototype detector described here, the three-side buttable modules are tiled in a 3 × 2 array with a full format of 256 × 384 pixels. The characteristics, operation, testing and application of the detector are detailed.

Radiation and Temperature Effects on the APV25 Readout Chip for the CMS Tracker

CERN Document Server

Messomo, Etam Albert Noah

2002-01-01

The Compact Muon Solenoid (CMS) is one of four particle detectors designed for use at the Large Hadron Collider (LHC) currently under construction at CERN, the European Laboratory for Particle Physics in Geneva. The LHC will accelerate two counterrotating beams of protons to energies of 7 TeV and produce 109 proton-proton collisions per second at a bunch-crossing frequency of 40 MHz. These collisions occuring at the centre of CMS will generate a very hostile radiation environment. The CMS sub-detector system closest to the collision point is the highly segmented Tracker, consisting of a silicon pixel detector with 45 million channels and a silicon microstrip detector with 10 million channels. The microstrip detector will be read out by the APV25, a custom-made chip manufactured in a commercial 0.25 µm CMOS microelectronics process. Radiation and temperature studies are required to ensure that the APV25 can operate reliably in the CMS environment. The radiation effects to which the APV25 could be susceptible ...

Development of the MCM-D technique for pixel detector modules

International Nuclear Information System (INIS)

Grah, C.

2005-03-01

This thesis treats a copper--polymer based thin film technology, the MCM-D technique and its application when building hybrid pixel detector modules. The ATLAS experiment at the LHC will be equipped with a pixel detector system. The basic mechanical units of the pixel detector are multi chip modules. The main components of these modules are: 16 electronic chips, a controller chip and a large sensor tile, featuring more than 46000 sensor cells. MCM-D is a superior technique to build the necessary signal bus system and the power distribution system directly on the active sensor tile. In collaboration with the Fraunhofer Institute for Reliability and Microintegration, IZM, the thin film process is reviewed and enhanced. The multi layer system was designed and optimized for the interconnection system as well as for the 46000 pixel contacts. Laboratory measurements on prototypes prove that complex routing schemes for geometrically optimized single chips are suitable and have negligible influence on the front--end chips performance. A full scale MCM-D module has been built and it is shown that the technology is suitable to build pixel detector modules. Further tests include the investigation of the impact of hadronic irradiation on the thin film layers. Single chip assemblies have been operated in a test beam environment and the feasibility of the optimization of the sensors could be shown. A review on the potential as well as the perspective for the MCM-D technique in future experiments is given

Development of a High Dynamic Range Pixel Array Detector for Synchrotrons and XFELs

Science.gov (United States)

Weiss, Joel Todd

Advances in synchrotron radiation light source technology have opened new lines of inquiry in material science, biology, and everything in between. However, x-ray detector capabilities must advance in concert with light source technology to fully realize experimental possibilities. X-ray free electron lasers (XFELs) place particularly large demands on the capabilities of detectors, and developments towards diffraction-limited storage ring sources also necessitate detectors capable of measuring very high flux [1-3]. The detector described herein builds on the Mixed Mode Pixel Array Detector (MM-PAD) framework, developed previously by our group to perform high dynamic range imaging, and the Adaptive Gain Integrating Pixel Detector (AGIPD) developed for the European XFEL by a collaboration between Deustsches Elektronen-Synchrotron (DESY), the Paul-Scherrer-Institute (PSI), the University of Hamburg, and the University of Bonn, led by Heinz Graafsma [4, 5]. The feasibility of combining adaptive gain with charge removal techniques to increase dynamic range in XFEL experiments is assessed by simulating XFEL scatter with a pulsed infrared laser. The strategy is incorporated into pixel prototypes which are evaluated with direct current injection to simulate very high incident x-ray flux. A fully functional 16x16 pixel hybrid integrating x-ray detector featuring several different pixel architectures based on the prototypes was developed. This dissertation describes its operation and characterization. To extend dynamic range, charge is removed from the integration node of the front-end amplifier without interrupting integration. The number of times this process occurs is recorded by a digital counter in the pixel. The parameter limiting full well is thereby shifted from the size of an integration capacitor to the depth of a digital counter. The result is similar to that achieved by counting pixel array detectors, but the integrators presented here are designed to tolerate a

Fast beam conditions monitor BCM1F for the CMS experiment

Energy Technology Data Exchange (ETDEWEB)

Bell, A. [CERN, Geneva (Switzerland); Geneva Univ. (Switzerland); Castro, E. [DESY Zeuthen (Germany); Hall-Wilton, R. [CERN, Geneva (Switzerland); Wisconsin Univ., Madison, WI (US)] (and others)

2009-10-15

The CMS Beam Conditions and Radiation Monitoring System, BRM, will support beam tuning, protect the CMS detector from adverse beam conditions, and measure the accumulated dose close to or inside all sub-detectors. It is composed of different sub-systems measuring either the particle flux near the beam pipe with time resolution between nano- and microseconds or the integrated dose over longer time intervals. This paper presents the Fast Beam Conditions Monitor, BCM1F, which is designed for fast flux monitoring measuring both beam halo and collision products. BCM1F is located inside the CMS pixel detector volume close to the beam-pipe. It uses sCVD diamond sensors and radiation hard front-end electronics, along with an analog optical readout of the signals. The commissioning of the system and its successful operation during the first beams of the LHC are described. (orig.)

Fast beam conditions monitor BCM1F for the CMS experiment

International Nuclear Information System (INIS)

Bell, A.; Castro, E.; Hall-Wilton, R.

2009-10-01

The CMS Beam Conditions and Radiation Monitoring System, BRM, will support beam tuning, protect the CMS detector from adverse beam conditions, and measure the accumulated dose close to or inside all sub-detectors. It is composed of different sub-systems measuring either the particle flux near the beam pipe with time resolution between nano- and microseconds or the integrated dose over longer time intervals. This paper presents the Fast Beam Conditions Monitor, BCM1F, which is designed for fast flux monitoring measuring both beam halo and collision products. BCM1F is located inside the CMS pixel detector volume close to the beam-pipe. It uses sCVD diamond sensors and radiation hard front-end electronics, along with an analog optical readout of the signals. The commissioning of the system and its successful operation during the first beams of the LHC are described. (orig.)

Improvement in breakdown characteristics with multiguard structures in microstrip silicon detectors for CMS

International Nuclear Information System (INIS)

Bacchetta, N.; Bisello, D.; Candelori, A.; Rold, M. Da; Descovich, M.; Kaminski, A.; Messineo, A.; Rizzo, F.; Verzellesi, G.

2001-01-01

To obtain full charge collection the CMS silicon detectors should be able to operate at high bias voltage. We observed that multiguard structures enhance the breakdown performance of the devices on several tens of baby detectors designed for CMS. The beneficial effects of the multiguard structures still remains after the strong neutron irradiation performed to simulate the operation at the LHC

Improvement in breakdown characteristics with multiguard structures in microstrip silicon detectors for CMS

CERN Document Server

Bacchetta, N; Candelori, A; Da Rold, M; Descovich, M; Kaminski, A; Messineo, A; Rizzo, F; Verzellesi, G

2001-01-01

To obtain full charge collection the CMS silicon detectors should be able to operate at high bias voltage. We observed that multiguard structures enhance the breakdown performance of the devices on several tens of baby detectors designed for CMS. The beneficial effects of the multiguard structures still remains after the strong neutron irradiation performed to simulate the operation at the LHC. (3 refs).

The simulation of charge sharing in semiconductor X-ray pixel detectors

CERN Document Server

Mathieson, K; O'Shea, V; Passmore, M S; Rahman, M; Smith, K M; Watt, J; Whitehill, C

2002-01-01

Two simulation packages were used to model the sharing of charge, due to the scattering and diffusion of carriers, between adjacent pixel elements in semiconductors X-ray detectors. The X-ray interaction and the consequent multiple scattering was modelled with the aid of the Monte Carlo package, MCNP. The resultant deposited charge distribution was then used to create the charge cloud profile in the finite element semiconductor simulation code MEDICI. The analysis of the current pulses induced on pixel electrodes for varying photon energies was performed for a GaAs pixel detector. For a pixel pitch of 25 mu m, the charge lost to a neighbouring pixel was observed to be constant, at 0.6%, through the energies simulated. Ultimately, a fundamental limit on the pixel element size for imaging and spectroscopic devices may be set due to these key physical principles.

Development of a super B-factory monolithic active pixel detector-the Continuous Acquisition Pixel (CAP) prototypes

International Nuclear Information System (INIS)

Varner, G.; Barbero, M.; Bozek, A.; Browder, T.; Fang, F.; Hazumi, M.; Igarashi, A.; Iwaida, S.; Kennedy, J.; Kent, N.; Olsen, S.; Palka, H.; Rosen, M.; Ruckman, L.; Stanic, S.; Trabelsi, K.; Tsuboyama, T.; Uchida, K.

2005-01-01

Over the last few years great progress has been made in the technological development of Monolithic Active Pixel Sensors (MAPS) such that upgrades to existing vertex detectors using this technology are now actively being considered. Future vertex detection at an upgraded KEK-B factory, already the highest luminosity collider in the world, will require a detector technology capable of withstanding the increased track densities and larger radiation exposures. Near the beam pipe the current silicon strip detectors have projected occupancies in excess of 100%. Deep sub-micron MAPS look very promising to address this problem. In the context of an upgrade to the Belle vertex detector, the major obstacles to realizing such a device have been concerns about radiation hardness and readout speed. Two prototypes implemented in the TSMC 0.35 μm process have been developed to address these issues. Denoted the Continuous Acquisition Pixel, or CAP, the two variants of this architecture are distinguished in that CAP2 includes an 8-deep sampling pipeline within each 22.5 μm 2 pixel. Preliminary test results and remaining R and D issues are presented

Semiconductor pixel detectors for digital mammography

International Nuclear Information System (INIS)

Novelli, M.; Amendolia, S.R.; Bisogni, M.G.; Boscardin, M.; Dalla Betta, G.F.; Delogu, P.; Fantacci, M.E.; Quattrocchi, M.; Rosso, V.; Stefanini, A.; Venturelli, L.; Zucca, S.

2003-01-01

We present some results obtained with silicon and gallium arsenide pixel detectors to be applied in the field of digital mammography. Even though GaAs is suitable for medical imaging applications thanks to its atomic number, which allows a very good detection efficiency, it often contains an high concentrations of traps which decrease the charge collection efficiency (CCE). So we have analysed both electrical and spectroscopic performance of different SI GaAs diodes as a function of concentrations of dopants in the substrate, in order to find a material by which we can obtain a CCE allowing the detection of all the photons that interact in the detector. Nevertheless to be able to detect low contrast details, efficiency and CCE are not the only parameters to be optimized; also the stability of the detection system is fundamental. In the past we have worked with Si pixel detectors; even if its atomic number does not allow a good detection efficiency at standard thickness, it has a very high stability. So keeping in mind the need to increase the Silicon detection efficiency we performed simulations to study the behaviour of the electrical potential in order to find a geometry to avoid the risk of electrical breakdown

Semiconductor pixel detectors for digital mammography

Energy Technology Data Exchange (ETDEWEB)

Novelli, M. E-mail: marzia.novelli@pi.infn.it; Amendolia, S.R.; Bisogni, M.G.; Boscardin, M.; Dalla Betta, G.F.; Delogu, P.; Fantacci, M.E.; Quattrocchi, M.; Rosso, V.; Stefanini, A.; Venturelli, L.; Zucca, S

2003-08-21

We present some results obtained with silicon and gallium arsenide pixel detectors to be applied in the field of digital mammography. Even though GaAs is suitable for medical imaging applications thanks to its atomic number, which allows a very good detection efficiency, it often contains an high concentrations of traps which decrease the charge collection efficiency (CCE). So we have analysed both electrical and spectroscopic performance of different SI GaAs diodes as a function of concentrations of dopants in the substrate, in order to find a material by which we can obtain a CCE allowing the detection of all the photons that interact in the detector. Nevertheless to be able to detect low contrast details, efficiency and CCE are not the only parameters to be optimized; also the stability of the detection system is fundamental. In the past we have worked with Si pixel detectors; even if its atomic number does not allow a good detection efficiency at standard thickness, it has a very high stability. So keeping in mind the need to increase the Silicon detection efficiency we performed simulations to study the behaviour of the electrical potential in order to find a geometry to avoid the risk of electrical breakdown.

Defective pixel map creation based on wavelet analysis in digital radiography detectors

International Nuclear Information System (INIS)

Park, Chun Joo; Lee, Hyoung Koo; Song, William Y.; Achterkirchen, Thorsten Graeve; Kim, Ho Kyung

2011-01-01

The application of digital radiography detectors has attracted increasing attention in both medicine and industry. Since the imaging detectors are fabricated by semiconductor manufacturing process over large areas, defective pixels in the detectors are unavoidable. Moreover, the radiation damage due to the routine use of the detectors progressively increases the density of defective pixels. In this study, we present a method of identifying defective pixels in digital radiography detectors based on wavelet analysis. Artifacts generated due to wavelet transformations have been prevented by an additional local threshold method. The proposed method was applied to a sample digital radiography and the result was promising. The proposed method uses a single pair of dark and white images and does not require them to be corrected in gain-and-offset properties. This method will be helpful for the reliable use of digital radiography detectors through the working lifetime.

Performance Studies of Pixel Hybrid Photon Detectors for the LHCb RICH Counters

CERN Document Server

Aglieri Rinella, G; Piedigrossi, D; Van Lysebetten, A

2004-01-01

The Pixel Hybrid Photon Detector is a vacuum tube with a multi-alkali photo cathode, high voltage cross-focused electron optics and an anode consisting of a silicon pixel detector bump-bonded to a readout CMOS electronic chip fully encapsulated in the device. The Pixel HPD fulfils the requirements of the Ring Imaging Cherenkov counters of the LHCb experiment at LHC. The performances of the Pixel HPD will be discussed with reference to laboratory measurements, Cherenkov light imaging in recent beam tests, image distortions due to a magnetic field.

Pixel readout ASIC for an APD based 2D X-ray hybrid pixel detector with sub-nanosecond resolution

Energy Technology Data Exchange (ETDEWEB)

Thil, Ch., E-mail: christophe.thil@ziti.uni-heidelberg.d [Heidelberg University, Institute of Computer Engineering, B6, 26, 68161 Mannheim (Germany); Baron, A.Q.R. [RIKEN SPring-8 Center, 1-1-1 Kouto, Sayo-cho, Sayo-gun, Hyogo 679-5148 (Japan); Fajardo, P. [ESRF, Polygone Scientifique Louis Neel, 6, rue Jules Horowitz, 38000 Grenoble (France); Fischer, P. [Heidelberg University, Institute of Computer Engineering, B6, 26, 68161 Mannheim (Germany); Graafsma, H. [DESY, Notkestrasse 85, 22607 Hamburg (Germany); Rueffer, R. [ESRF, Polygone Scientifique Louis Neel, 6, rue Jules Horowitz, 38000 Grenoble (France)

2011-02-01

The fast response and the short recovery time of avalanche photodiodes (APDs) in linear mode make those devices ideal for direct X-ray detection in applications requiring high time resolution or counting rate. In order to provide position sensitivity, the XNAP project aims at creating a hybrid pixel detector with nanosecond time resolution based on a monolithic APD sensor array with 32 x32 pixels covering about 1 cm{sup 2} active area. The readout is implemented in a pixelated front-end ASIC suited for the readout of such arrays, matched to pixels of 280{mu}mx280{mu}m size. Every single channel features a fast transimpedance amplifier, a discriminator with locally adjustable threshold and two counters with high dynamic range and counting speed able to accumulate X-ray hits with no readout dead time. Additionally, the detector can be operated in list mode by time-stamping every single event with sub-nanosecond resolution. In a first phase of the project, a 4x4 pixel test module is built to validate the conceptual design of the detector. The XNAP project is briefly presented and the performance of the readout ASIC is discussed.

Pixel readout ASIC for an APD based 2D X-ray hybrid pixel detector with sub-nanosecond resolution

International Nuclear Information System (INIS)

Thil, Ch.; Baron, A.Q.R.; Fajardo, P.; Fischer, P.; Graafsma, H.; Rueffer, R.

2011-01-01

The fast response and the short recovery time of avalanche photodiodes (APDs) in linear mode make those devices ideal for direct X-ray detection in applications requiring high time resolution or counting rate. In order to provide position sensitivity, the XNAP project aims at creating a hybrid pixel detector with nanosecond time resolution based on a monolithic APD sensor array with 32 x32 pixels covering about 1 cm 2 active area. The readout is implemented in a pixelated front-end ASIC suited for the readout of such arrays, matched to pixels of 280μmx280μm size. Every single channel features a fast transimpedance amplifier, a discriminator with locally adjustable threshold and two counters with high dynamic range and counting speed able to accumulate X-ray hits with no readout dead time. Additionally, the detector can be operated in list mode by time-stamping every single event with sub-nanosecond resolution. In a first phase of the project, a 4x4 pixel test module is built to validate the conceptual design of the detector. The XNAP project is briefly presented and the performance of the readout ASIC is discussed.

Hexagonal pixel detector with time encoded binary readout

International Nuclear Information System (INIS)

Hoedlmoser, H.; Varner, G.; Cooney, M.

2009-01-01

The University of Hawaii is developing continuous acquisition pixel (CAP) detectors for vertexing applications in lepton colliding experiments such as SuperBelle or ILC. In parallel to the investigation of different technology options such as MAPS or SOI, both analog and binary readout concepts have been tested. First results with a binary readout scheme in which the hit information is time encoded by means of a signal shifting mechanism have recently been published. This paper explains the hit reconstruction for such a binary detector with an emphasis on fake hit reconstruction probabilities in order to evaluate the rate capability in a high background environment such as the planned SuperB factory at KEK. The results show that the binary concept is at least comparable to any analog readout strategy if not better in terms of occupancy. Furthermore, we present a completely new binary readout strategy in which the pixel cells are arranged in a hexagonal grid allowing the use of three independent output directions to reduce reconstruction ambiguities. The new concept uses the same signal shifting mechanism for time encoding, however, in dedicated transfer lines on the periphery of the detector, which enables higher shifting frequencies. Detailed Monte Carlo simulations of full size pixel matrices including hit and BG generation, signal generation, and data reconstruction show that by means of multiple signal transfer lines on the periphery the pixel can be made smaller (higher resolution), the number of output channels and the data volume per triggered event can be reduced dramatically, fake hit reconstruction is lowered to a minimum and the resulting effective occupancies are less than 10 -4 . A prototype detector has been designed in the AMS 0.35μm Opto process and is currently under fabrication.

Development of a Detector Control System for the ATLAS Pixel detector in the HL-LHC

International Nuclear Information System (INIS)

Lehmann, N.; Kersten, S.; Zeitnitz, C.; Karagounis, M.

2016-01-01

The upgrade of the LHC to the HL-LHC requires a new ITk detector. The innermost part of this new tracker is a pixel detector. The University of Wuppertal is developing a new DCS to monitor and control this new pixel detector. The current concept envisions three parallel paths of the DCS. The first path, called security path, is hardwired and provides an interlock system to guarantee the safety of the detector and human beings. The second path is a control path. This path is used to supervise the entire detector. The control path has its own communication lines independent from the regular data readout for reliable operation. The third path is for diagnostics and provides information on demand. It is merged with the regular data readout and provides the highest granularity and most detailed information. To reduce the material budget, a serial power scheme is the baseline for the pixel modules. A new ASIC used in the control path is in development at Wuppertal for this serial power chain. A prototype exists already and a proof of principle was demonstrated. Development and research is ongoing to guarantee the correct operation of the new ASIC in the harsh environment of the HL-LHC. The concept for the new DCS will be presented in this paper. A focus will be made on the development of the DCS chip, used for monitoring and control of pixel modules in a serial power chain.

Performance of the INTPIX6 SOI pixel detector

International Nuclear Information System (INIS)

Arai, Y.; Miyoshi, T.; Bugiel, Sz.; Dasgupta, R.; Idzik, M.; Kapusta, P.; Turala, M.; Kucewicz, W.

2017-01-01

Characterization of the monolithic pixel detector INPTIX6, designed at KEK and fabricated in Lapis 0.2 μ  m Fully-Depleted, Low-Leakage Silicon-On-Insulator (SOI) CMOS technology, was performed. The INTPIX6 comprises a large area of 1408 × 896 integrating type squared pixels of 12 micron pitch. In this work the performance and measurement results of the prototypes produced on lower resistivity Czochralski type (CZ-n) and high resistivity floating zone (FZ-n) sensor wafers are presented. Using 241 Am radioactive source the noise of INTPIX6 was measured, showing the ENC (Equivalent Noise Charge) of about 70 e − . The resolution calculated from the FWHM of the Iron-55 X-ray peak was about 100 e − . The radiation hardness of the SOI pixel detector was also investigated. The CZ-n type INTPIX6 received a dose of 60 krad and its performance has been continuously monitored during the irradiation.

Performance of the INTPIX6 SOI pixel detector

Science.gov (United States)

Arai, Y.; Bugiel, Sz.; Dasgupta, R.; Idzik, M.; Kapusta, P.; Kucewicz, W.; Miyoshi, T.; Turala, M.

2017-01-01

Characterization of the monolithic pixel detector INPTIX6, designed at KEK and fabricated in Lapis 0.2 μ m Fully-Depleted, Low-Leakage Silicon-On-Insulator (SOI) CMOS technology, was performed. The INTPIX6 comprises a large area of 1408 × 896 integrating type squared pixels of 12 micron pitch. In this work the performance and measurement results of the prototypes produced on lower resistivity Czochralski type (CZ-n) and high resistivity floating zone (FZ-n) sensor wafers are presented. Using 241Am radioactive source the noise of INTPIX6 was measured, showing the ENC (Equivalent Noise Charge) of about 70 e-. The resolution calculated from the FWHM of the Iron-55 X-ray peak was about 100 e-. The radiation hardness of the SOI pixel detector was also investigated. The CZ-n type INTPIX6 received a dose of 60 krad and its performance has been continuously monitored during the irradiation.

Design and implementation of an expert system for the detector control systems of the ATLAS pixel detector

International Nuclear Information System (INIS)

Henss, Tobias

2008-12-01

In the framework of this thesis an expert system ''Pixel-Advisor'' for the control system of the pixel detector was designed and implemented. This supports the operational personnel in the diagnosis and removal of possible problems, which are in connection with the detector control system and unburdens the few available DCS experts

Characterization of active CMOS sensors for capacitively coupled pixel detectors

Energy Technology Data Exchange (ETDEWEB)

Hirono, Toko; Gonella, Laura; Janssen, Jens; Hemperek, Tomasz; Huegging, Fabian; Krueger, Hans; Wermes, Norbert [Institute of Physics, University of Bonn (Germany); Peric, Ivan [Institut fuer Prozessdatenverarbeitung und Elektronik, Karlsruher Institut fuer Technologie, Karlsruhe (Germany)

2015-07-01

Active CMOS pixel sensor is one of the most attractive candidates for detectors of upcoming particle physics experiments. In contrast to conventional sensors of hybrid detectors, signal processing circuit can be integrated in the active CMOS sensor. The characterization and optimization of the pixel circuit are indispensable to obtain a good performance from the sensors. The prototype chips of the active CMOS sensor were fabricated in the AMS 180nm and L-Foundry 150 nm CMOS processes, respectively a high voltage and high resistivity technology. Both chips have a charge sensitive amplifier and a comparator in each pixel. The chips are designed to be glued to the FEI4 pixel readout chip. The signals from 3 pixels of the prototype chips are capacitively coupled to the FEI4 input pads. We have performed lab tests and test beams to characterize the prototypes. In this presentation, the measurement results of the active CMOS prototype sensors are shown.

Development of a cylindrical tracking detector with multichannel scintillation fibers and pixelated photon detector readout

Energy Technology Data Exchange (ETDEWEB)

Akazawa, Y.; Miwa, K.; Honda, R.; Shiozaki, T.; Chiga, N.

2015-07-01

We are developing a cylindrical tracking detector for a Σp scattering experiment in J-PARC with scintillation fibers and the Pixelated Photon Detector (PPD) readout, which is called as cylindrical fiber tracker (CFT), in order to reconstruct trajectories of charged particles emitted inside CFT. CFT works not only as a tracking detector but also a particle identification detector from energy deposits. A prototype CFT consisting of two straight layers and one spiral layer was constructed. About 1100 scintillation fibers with a diameter of 0.75 mm (Kuraray SCSF-78 M) were used. Each fiber signal was read by Multi-Pixel Photon Counter (MPPC, HPK S10362-11-050P, 1×1 mm{sup 2}, 400 pixels) fiber by fiber. MPPCs were handled with Extended Analogue Silicon Photomultipliers Integrated ReadOut Chip (EASIROC) boards, which were developed for the readout of a large number of MPPCs. The energy resolution of one layer was 28% for a 70 MeV proton where the energy deposit in fibers was 0.7 MeV.

A VME-based readout system for the CMS Preshower sub-detector

CERN Document Server

Antchev, G; Bialas, W; Da Silva, J C; Kokkas, P; Manthos, N; Reynaud, S; Sidiropoulos, G; Snoeys, W; Vichoudis, P

2007-01-01

The CMS preshower is a fine grain detector that comprises 4288 silicon sensors, each containing 32 strips. The raw data are transferred from the detector to the counting room via 1208 optical fibres. Each fibre carries a 600-byte data packet per event. The maximum average level-1 trigger rate of 100 kHz results in a total data flow of ~72 GB/s from the preshower. For the readout of the preshower, 56 links to the CMS DAQ have been reserved, each having a bandwidth of 200 MB/s (2 kB/event). The total available downstream bandwidth of GB/s necessitates a reduction in the data volume by a factor of at least 7. A modular VME-based system is currently under development. The main objective of each VME board in this system is to acquire on-detector data from at least 22 optical links, perform on-line data reduction and pass the concentrated data to the CMS DAQ. The principle modules that the system is based on are being developed in collaboration with the TOTEM experiment.

Charge loss between contacts of CdZnTe pixel detectors

International Nuclear Information System (INIS)

Bolotnikov, A.E.; Cook, W.R.; Harrison, F.A.; Wong, A.-S.; Schindler, S.M.; Eichelberger, A.C.

1999-01-01

The surface of Cd 1-x Zn x Te (CZT) material has high resistivity but is not a perfect dielectric. Even a small surface conductivity can affect the electric field distribution, and therefore, the charge collection efficiency of a CZT pixel detector. The paper describes studies of this phenomenon for several contact configurations made on a single CZT detector. We have determined the maximum inter-contact separation at which the surface inter-pixel charge loss can be neglected. (author)

The New Silicon Strip Detectors for the CMS Tracker Upgrade

CERN Document Server

Dragicevic, Marko

2010-01-01

The first introductory part of the thesis describes the concept of the CMS experiment. The tasks of the various detector systems and their technical implementations in CMS are explained. To facilitate the understanding of the basic principles of silicon strip sensors, the subsequent chapter discusses the fundamentals in semiconductor technology, with particular emphasis on silicon. The necessary process steps to manufacture strip sensors in a so-called planar process are described in detail. Furthermore, the effects of irradiation on silicon strip sensors are discussed. To conclude the introductory part of the thesis, the design of the silicon strip sensors of the CMS Tracker are described in detail. The choice of the substrate material and the complex geometry of the sensors are reviewed and the quality assurance procedures for the production of the sensors are presented. Furthermore the design of the detector modules are described. The main part of this thesis starts with a discussion on the demands on the ...

Development of pixel detectors for SSC vertex tracking

International Nuclear Information System (INIS)

Kramer, G.; Shapiro, S.L.; Arens, J.F.; Jernigan, J.G.; Skubic, P.

1991-04-01

A description of hybrid PIN diode arrays and a readout architecture for their use as a vertex detector in the SSC environment is presented. Test results obtained with arrays having 256 x 256 pixels, each 30 μm square, are also presented. The development of a custom readout for the SSC will be discussed, which supports a mechanism for time stamping hit pixels, storing their xy coordinates, and storing the analog information within the pixel. The peripheral logic located on the array, permits the selection of those pixels containing interesting data and their coordinates to be selectively read out. This same logic also resolves ambiguous pixel ghost locations and controls the pixel neighbor read out necessary to achieve high spatial resolution. The thermal design of the vertex tracker and the proposed signal processing architecture will also be discussed. 5 refs., 13 figs., 3 tabs

A gas pixel detector for X-ray imaging

International Nuclear Information System (INIS)

Bateman, J.E.; Connolly, J.F.

1991-11-01

A simple, robust form of gas pixel detector is discussed which is based on the use of electronic connector pins as the gain elements. With a rate capability of >10 5 counts/s per pin, an X-ray imaging detector system capable of counting at global rates of the order of 10 10 counts/s is foreseen. (author)

Operational experience of ATLAS SCT and Pixel Detector

CERN Document Server

Kocian, Martin; The ATLAS collaboration

2017-01-01

The ATLAS Inner Detector based on silicon sensors is consisting of a strip detector (SCT) and a pixel detector. It is the crucial component for vertexing and tracking in the ATLAS experiment. With the excellent performance of the LHC well beyond the original specification the silicon tracking detectors are facing substantial challenges in terms of data acquisition, radiation damage to the sensors, and SEUs in the readout ASICs. The approaches on how the detector systems cope with the demands of high luminosity operation while maintaining excellent performance through hardware upgrades, software and firmware algorithms, and operational settings, are presented.

Limits in point to point resolution of MOS based pixels detector arrays

Science.gov (United States)

Fourches, N.; Desforge, D.; Kebbiri, M.; Kumar, V.; Serruys, Y.; Gutierrez, G.; Leprêtre, F.; Jomard, F.

2018-01-01

In high energy physics point-to-point resolution is a key prerequisite for particle detector pixel arrays. Current and future experiments require the development of inner-detectors able to resolve the tracks of particles down to the micron range. Present-day technologies, although not fully implemented in actual detectors, can reach a 5-μm limit, this limit being based on statistical measurements, with a pixel-pitch in the 10 μm range. This paper is devoted to the evaluation of the building blocks for use in pixel arrays enabling accurate tracking of charged particles. Basing us on simulations we will make here a quantitative evaluation of the physical and technological limits in pixel size. Attempts to design small pixels based on SOI technology will be briefly recalled here. A design based on CMOS compatible technologies that allow a reduction of the pixel size below the micrometer is introduced here. Its physical principle relies on a buried carrier-localizing collecting gate. The fabrication process needed by this pixel design can be based on existing process steps used in silicon microelectronics. The pixel characteristics will be discussed as well as the design of pixel arrays. The existing bottlenecks and how to overcome them will be discussed in the light of recent ion implantation and material characterization experiments.

Gas Pixel Detectors for low energy X-ray polarimetry

International Nuclear Information System (INIS)

Spandre, Gloria

2007-01-01

Gas Pixel Detectors are position-sensitive proportional counters in which a complete integration between the gas amplification structure and the read-out electronics has been reached. Various generation of Application-Specific Integrated Circuit (ASIC) have been designed in deep submicron CMOS technology to realize a monolithic device which is at the same time the charge collecting electrode and the analog amplifying and charge measuring front-end electronics. The experimental response of a detector with 22060 pixels at 80 μm pitch to polarized and un-polarized X-ray radiation is shown and the application of this device for Astronomical X-ray Polarimetry discussed

Initial Measurements On Pixel Detector Modules For The ATLAS Upgrades

CERN Document Server

Gallrapp, C; The ATLAS collaboration

2011-01-01

Sophisticated conditions in terms of peak and integrated luminosity in the Large Hadron Collider (LHC) will raise the ATLAS Pixel detector to its performance limits. Silicon planar, silicon 3D and diamond pixel sensors are three possible sensor technologies which could be implemented in the upcoming pixel detector upgrades of the ATLAS experiment. Measurements of the IV-behavior and measurements with radioactive Americium-241 and Strontium-90 are used to characterize the sensor properties and to understand the interaction between the ATLAS FE-I4 front-end chip and the sensor. Comparisons of results from before and after irradiation, which give a first impression on the charge collection properties of the different sensor technologies are presented.

Components of the CMS magnet system at the detector's assembly site.

CERN Multimedia

Maximilien Brice

2002-01-01

Photos 01, 05: Outer cylinder of the CMS vacuum tank. The vacuum tank consists of inner and outer stainless-steel cylinders and houses the superconducting coil. As can be seen, the cylinder is attached to the innermost ring of the barrel yoke. Photos 02, 04: CMS end-cap yoke. The magnetic flux generated by the superconducting coil in the CMS detector is returned via an iron yoke comprising three end-cap discs at each end (end-cap yoke) and five concentric cylinders (barrel yoke).Photo 03: Inner cylinder of the CMS vacuum tank. The vacuum tank consists of inner and outer stainless-steel cylinders and houses the superconducting coil. The inner cylinder contains all the barrel sub-detectors, which it supports via a system of horizontal rails. The cylinder is pictured here in the vertical position on a yellow platform mounted on the ferris-wheel support structure. This will allow it to be pivoted and inserted into the outer cylinder already attached to the innermost ring of the barrel yoke.

Radiation Damage Modeling for 3D Pixel Sensors in the ATLAS Detector

CERN Document Server

Wallangen, Veronica; The ATLAS collaboration

2017-01-01

Silicon Pixel detectors are at the core of the current and planned upgrade of the ATLAS detector. As the detector in closest proximity to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the HL-LHC, the innermost layers will receive a fluence in excess of 10^15 neq/cm2 and the HL-LHC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. This poster presents the details of a new digitization model that includes radiation damage effects to the 3D Pixel sensors for the ATLAS Detector.

Operational experience with the GEM detector assembly lines for the CMS forward muon upgrade

CERN Document Server

Vai, Ilaria

2017-01-01

The CMS Collaboration has been developing large-area Triple-GEM detectors to be installed in the muon endcap regions of the CMS experiment in 2019 to maintain forward muon trigger and tracking performance at the HL-LHC. Ten pre-production detectors were built at CERN to commission the first assembly line and the quality controls. These were installed in the CMS detector in early 2017 and are currently participating in the 2017 LHC run. The collaboration has prepared several additional assembly and quality control lines for distributed mass production of 160 GEM detectors at various sites worldwide. During 2017, these additional production sites have been optimizing construction techniques and quality control procedures and validating them against common specifications by constructing additional pre-production detectors. Using the specific experience from one production site as an example, we discuss how the quality controls make use of independent hardware and trained personnel to ensure fast and reliable pro...

Charge loss between contacts of CdZnTe pixel detectors

CERN Document Server

Bolotnikov, A E; Harrison, F A; Wong, A S; Schindler, S M; Eichelberger, A C

1999-01-01

The surface of Cd sub 1 sub - sub x Zn sub x Te (CZT) material has high resistivity but is not a perfect dielectric. Even a small surface conductivity can affect the electric field distribution, and therefore, the charge collection efficiency of a CZT pixel detector. The paper describes studies of this phenomenon for several contact configurations made on a single CZT detector. We have determined the maximum inter-contact separation at which the surface inter-pixel charge loss can be neglected. (author)

Optical readout in a multi-module system test for the ATLAS pixel detector

International Nuclear Information System (INIS)

Flick, Tobias; Becks, Karl-Heinz; Gerlach, Peter; Kersten, Susanne; Maettig, Peter; Nderitu Kirichu, Simon; Reeves, Kendall; Richter, Jennifer; Schultes, Joachim

2006-01-01

The innermost part of the ATLAS experiment at the LHC, CERN, will be a pixel detector, which is presently under construction. The command messages and the readout data of the detector are transmitted over an optical data path. The readout chain consists of many components which are produced at several locations around the world, and must work together in the pixel detector. To verify that these parts are working together as expected a system test has been built up. It consists of detector modules, optoboards, optical fibres, Back of Crate cards, Readout Drivers, and control computers. In this paper, the system test setup and the operation of the readout chain are described. Also, some results of tests using the final pixel detector readout chain are given

A new generation of small pixel pitch/SWaP cooled infrared detectors

Science.gov (United States)

Espuno, L.; Pacaud, O.; Reibel, Y.; Rubaldo, L.; Kerlain, A.; Péré-Laperne, N.; Dariel, A.; Roumegoux, J.; Brunner, A.; Kessler, A.; Gravrand, O.; Castelein, P.

2015-10-01

Following clear technological trends, the cooled IR detectors market is now in demand for smaller, more efficient and higher performance products. This demand pushes products developments towards constant innovations on detectors, read-out circuits, proximity electronics boards, and coolers. Sofradir was first to show a 10μm focal plane array (FPA) at DSS 2012, and announced the DAPHNIS 10μm product line back in 2014. This pixel pitch is a key enabler for infrared detectors with increased resolution. Sofradir recently achieved outstanding products demonstrations at this pixel pitch, which clearly demonstrate the benefits of adopting 10μm pixel pitch focal plane array-based detectors. Both HD and XGA Daphnis 10μm products also benefit from a global video datapath efficiency improvement by transitioning to digital video interfaces. Moreover, innovative smart pixels functionalities drastically increase product versatility. In addition to this strong push towards a higher pixels density, Sofradir acknowledges the need for smaller and lower power cooled infrared detector. Together with straightforward system interfaces and better overall performances, latest technological advances on SWAP-C (Size, Weight, Power and Cost) Sofradir products enable the advent of a new generation of high performance portable and agile systems (handheld thermal imagers, unmanned aerial vehicles, light gimbals etc...). This paper focuses on those features and performances that can make an actual difference in the field.

A pixel detector for the protein crystallography beamline at the SLS

CERN Document Server

Brönnimann, C; Eikenberry, E F; Fischer, P; Florin, S; Horisberger, R P; Lindner, Manfred; Schmitt, B; Schulze, C

2002-01-01

At the Paul Scherrer Institute a new synchrotron light source is currently under construction, the Swiss Light Source (SLS), which will be operational in summer 2001. Among the first beamlines is a high brightness, micro-focusing protein crystallography beamline. It will be equipped with a pixel detector, which has several features of interest for the next generation of protein crystallography detectors. The point spread function and the effect of charge sharing was measured with a prototype detector in a test experiment at the European Synchrotron Radiation Facility in Grenoble. The concepts of the SLS pixel detector is presented as well as test results from radiation hard prototype chips.

Modeling Radiation Damage to Pixel Sensors in the ATLAS Detector

CERN Document Server

Rossini, Lorenzo; The ATLAS collaboration

2018-01-01

Silicon pixel detectors are at the core of the current and planned upgrade of the ATLAS detector at the Large Hadron Collider (LHC). As the closest detector component to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the High- Luminosity LHC (HL-LHC), the innermost layers will receive a fluence in excess of 10^15 neq/cm2 and the HL-HLC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. Simulating radiation damage is critical in order to make accurate predictions for current future detector performance that will enable searches for new particles and forces as well as precision measurements of Standard Model particles such as the Higgs boson. We present a digitization model that includes radiation damage effects to the ATLAS pixel sensors for the first time and considers both planar and 3D sensor designs. In addition to thoroughly describing the setup, we compare predictions for basic...

An Analysis of the Control Hierarchy Modeling of the CMS Detector Control System

CERN Document Server

Ling Hwong, Yi

2010-01-01

The supervisory level of the Detector Control System (DCS) of the CMS experiment is implemented using Finite State Machines (FSM), which model the behaviors and control the operations of all the sub-detectors and support services. The FSM tree of the whole CMS experiment consists of more than 30.000 nodes. An analysis of a system of such size is a complex task but is a crucial step towards the improvement of the overall performance of the FSM system. This paper presents the analysis of the CMS FSM system using the micro Common Representation Language 2 (mcrl2) methodology. Individual mCRL2 models are obtained for the FSM systems of the CMS sub-detectors using the ASF+SDF automated translation tool. Different mCRL2 operations are applied to the mCRL2 models. A mCRL2 simulation tool is used to closer examine the system. Visualization of a system based on the exploration of its state space is enabled with a mCRL2 tool. Requirements such as command and state propagation are expressed using modal mu-calculus and c...

Development of a counting pixel detector for 'Digitales Roentgen'

International Nuclear Information System (INIS)

Lindner, M.

2001-08-01

The development of a single photon counting X-ray imaging detector for medical applications using hybrid pixel detectors is reported. The electronics development from the first prototype derived from detector development for particle physics experiments (ATLAS) to the imaging chip MPEC (multi picture element counters) for medical applications is described. This chip consists of 32 x 32 pixels of 200 μm x 200 μm size, each containing the complete read out electronics, i.e. an amplifier, two discriminators with adjustable thresholds and two 18-bit linear feedback shift-counters allowing energy windowing for contrast increase. Results on electronics performance are shown as well as measurements with several semiconductor materials (Si, GaAs, CdTe). Important aspects like detection efficiency, sensor homogeneity, linearity and spatial resolution are discussed. (orig.)

Data acquisition at the front-end of the Mu3e pixel detector

Energy Technology Data Exchange (ETDEWEB)

Perrevoort, Ann-Kathrin [Physikalisches Institut, Universitaet Heidelberg (Germany); Collaboration: Mu3e-Collaboration

2016-07-01

The Mu3e experiment - searching for the lepton-flavour violating decay of the muon into three electrons at an unprecedented sensitivity of one in 10{sup 16} decays - is based on a pixel tracking detector. The sensors are High-Voltage Monolithic Active Pixel Sensors, a technology which allows for very fast and thin detectors, and thus is an ideal fit for Mu3e where the trajectories of low-momentum electrons at high rates are to be measured. The detector will consist of about 275 million pixels and will be operated at up to 10{sup 9} muon stops per second. Therefore, a fast and trigger-less data readout is required. The pixel sensors feature zero-suppressed data output via high-speed serial links. The data is then buffered and sorted by time on a FPGA on the front-end before being processed to the following readout stage. In this talk, the readout of the Mu3e pixel detector at the front-end is introduced. Furthermore, a first firmware implementation of this concept in a beam telescope consisting of the current pixel sensor prototype MuPix7 is presented.

DEPFET active pixel detectors for a future linear $e^+e^-$ collider

CERN Document Server

Alonso, O; Dieguez, A; Dingfelder, J; Hemperek, T; Kishishita, T; Kleinohl, T; Koch, M; Krueger, H; Lemarenko, M; Luetticke, F; Marinas, C; Schnell, M; Wermes, N; Campbell, A; Ferber, T; Kleinwort, C; Niebuhr, C; Soloviev, Y; Steder, M; Volkenborn, R; Yaschenko, S; Fischer, P; Kreidl, C; Peric, I; Knopf, J; Ritzert, M; Curras, E; Lopez-Virto, A; Moya, D; Vila, I; Boronat, M; Esperante, D; Fuster, J; Garcia Garcia, I; Lacasta, C; Oyanguren, A; Ruiz, P; Timon, G; Vos, M; Gessler, T; Kuehn, W; Lange, S; Muenchow, D; Spruck, B; Frey, A; Geisler, C; Schwenker, B; Wilk, F; Barvich, T; Heck, M; Heindl, S; Lutz, O; Mueller, Th; Pulvermacher, C; Simonis, H.J; Weiler, T; Krausser, T; Lipsky, O; Rummel, S; Schieck, J; Schlueter, T; Ackermann, K; Andricek, L; Chekelian, V; Chobanova, V; Dalseno, J; Kiesling, C; Koffmane, C; Gioi, L.Li; Moll, A; Moser, H.G; Mueller, F; Nedelkovska, E; Ninkovic, J; Petrovics, S; Prothmann, K; Richter, R; Ritter, A; Ritter, M; Simon, F; Vanhoefer, P; Wassatsch, A; Dolezal, Z; Drasal, Z; Kodys, P; Kvasnicka, P; Scheirich, J

2013-01-01

The DEPFET collaboration develops highly granular, ultra-transparent active pixel detectors for high-performance vertex reconstruction at future collider experiments. The characterization of detector prototypes has proven that the key principle, the integration of a first amplification stage in a detector-grade sensor material, can provide a comfortable signal to noise ratio of over 40 for a sensor thickness of 50-75 $\\mathrm{\\mathbf{\\mu m}}$. ASICs have been designed and produced to operate a DEPFET pixel detector with the required read-out speed. A complete detector concept is being developed, including solutions for mechanical support, cooling and services. In this paper the status of DEPFET R & D project is reviewed in the light of the requirements of the vertex detector at a future linear $\\mathbf{e^+ e^-}$ collider.

Low mass hybrid pixel detectors for the high luminosity LHC upgrade

Energy Technology Data Exchange (ETDEWEB)

Gonella, Laura

2013-10-15

Reducing material in silicon trackers is of major importance for a good overall detector performance, and poses severe challenges to the design of the tracking system. To match the low mass constraints for trackers in High Energy Physics experiments at high luminosity, dedicated technological developments are required. This dissertation presents three technologies to design low mass hybrid pixel detectors for the high luminosity upgrades of the LHC. The work targets specifically the reduction of the material from the detector services and modules, with novel powering schemes, flip chip and interconnection technologies. A serial powering scheme is prototyped, featuring a new regulator concept, a control and protection element, and AC-coupled data transmission. A modified flip chip technology is developed for thin, large area Front-End chips, and a via last Through Silicon Via process is demonstrated on existing pixel modules. These technologies, their developments, and the achievable material reduction are discussed using the upgrades of the ATLAS pixel detector as a case study.

Low mass hybrid pixel detectors for the high luminosity LHC upgrade

International Nuclear Information System (INIS)

Gonella, Laura

2013-10-01

Reducing material in silicon trackers is of major importance for a good overall detector performance, and poses severe challenges to the design of the tracking system. To match the low mass constraints for trackers in High Energy Physics experiments at high luminosity, dedicated technological developments are required. This dissertation presents three technologies to design low mass hybrid pixel detectors for the high luminosity upgrades of the LHC. The work targets specifically the reduction of the material from the detector services and modules, with novel powering schemes, flip chip and interconnection technologies. A serial powering scheme is prototyped, featuring a new regulator concept, a control and protection element, and AC-coupled data transmission. A modified flip chip technology is developed for thin, large area Front-End chips, and a via last Through Silicon Via process is demonstrated on existing pixel modules. These technologies, their developments, and the achievable material reduction are discussed using the upgrades of the ATLAS pixel detector as a case study.

Technology development for SOI monolithic pixel detectors

International Nuclear Information System (INIS)

Marczewski, J.; Domanski, K.; Grabiec, P.; Grodner, M.; Jaroszewicz, B.; Kociubinski, A.; Kucharski, K.; Tomaszewski, D.; Caccia, M.; Kucewicz, W.; Niemiec, H.

2006-01-01

A monolithic detector of ionizing radiation has been manufactured using silicon on insulator (SOI) wafers with a high-resistivity substrate. In our paper the integration of a standard 3 μm CMOS technology, originally designed for bulk devices, with fabrication of pixels in the bottom wafer of a SOI substrate is described. Both technological sequences have been merged minimizing thermal budget and providing suitable properties of all the technological layers. The achieved performance proves that fully depleted monolithic active pixel matrix might be a viable option for a wide spectrum of future applications

Survey of the ATLAS Pixel Detector Components

International Nuclear Information System (INIS)

Andreazza, A.; Kostyukhim, V.; Madaras, R.

2008-01-01

This document provides a description of the survey performed on different components of the ATLAS Pixel Detector at different stages of its assembly. During the production of the ATLAS pixel detector great care was put in the geometrical survey of the location of the sensitive area of modules. This had a double purpose: (1) to provide a check of the quality of the assembly procedure and assure tolerances in the geometrical assembly were met; and (2) to provide an initial point for the alignment (the so called 'as-built detector'), better than the ideal geometry. Since direct access to the sensitive area becomes more and more difficult with the progress of the assembly, the survey needed to be performed at different stages: after module loading on the local supports (sectors and staves) and after assembly of the local supports in disks or halfshells. Different techniques were used, including both optical 2D and 3D surveys and mechanical survey. This document summarizes the survey procedures, the analysis done on the collected data and how survey data are stored in case they will need to be accessed in the future

Advanced processing of CdTe pixel radiation detectors

Science.gov (United States)

Gädda, A.; Winkler, A.; Ott, J.; Härkönen, J.; Karadzhinova-Ferrer, A.; Koponen, P.; Luukka, P.; Tikkanen, J.; Vähänen, S.

2017-12-01

We report a fabrication process of pixel detectors made of bulk cadmium telluride (CdTe) crystals. Prior to processing, the quality and defect density in CdTe material was characterized by infrared (IR) spectroscopy. The semiconductor detector and Flip-Chip (FC) interconnection processing was carried out in the clean room premises of Micronova Nanofabrication Centre in Espoo, Finland. The chip scale processes consist of the aluminum oxide (Al2O3) low temperature thermal Atomic Layer Deposition (ALD), titanium tungsten (TiW) metal sputtering depositions and an electroless Nickel growth. CdTe crystals with the size of 10×10×0.5 mm3 were patterned with several photo-lithography techniques. In this study, gold (Au) was chosen as the material for the wettable Under Bump Metalization (UBM) pads. Indium (In) based solder bumps were grown on PSI46dig read out chips (ROC) having 4160 pixels within an area of 1 cm2. CdTe sensor and ROC were hybridized using a low temperature flip-chip (FC) interconnection technique. The In-Au cold weld bonding connections were successfully connecting both elements. After the processing the detector packages were wire bonded into associated read out electronics. The pixel detectors were tested at the premises of Finnish Radiation Safety Authority (STUK). During the measurement campaign, the modules were tested by exposure to a 137Cs source of 1.5 TBq for 8 minutes. We detected at the room temperature a photopeak at 662 keV with about 2 % energy resolution.

Status of the ATLAS Pixel Detector and its performance after three years of operation

CERN Document Server

Favareto, A; The ATLAS collaboration

2012-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is very important for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. The detector performance is excellent: ~96 % of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, and a good alignment allows high quality track resolution

Status of the ATLAS Pixel Detector and its performance after three years of operation

CERN Document Server

Favareto, A; The ATLAS collaboration

2012-01-01

The ATLAS Pixel Detector is the innermost detector of the ATLAS experiment at the Large Hadron Collider at CERN, providing high-resolution measurements of charged particle tracks in the high radiation environment close to the collision region. This capability is very important for the identification and measurement of proper decay times of long-lived particles such as b-hadrons, and thus vital for the ATLAS physics program. The detector provides hermetic coverage with three cylindrical layers and three layers of forward and backward pixel detectors. It consists of approximately 80 million pixels that are individually read out via chips bump-bonded to 1744 n-in-n silicon substrates. The detector performance is excellent: ~96% of the pixels are operational, noise occupancy and hit efficiency exceed the design specification, and a good alignment allows high quality track resolution.

50 μm pixel pitch wafer-scale CMOS active pixel sensor x-ray detector for digital breast tomosynthesis.

Science.gov (United States)

Zhao, C; Konstantinidis, A C; Zheng, Y; Anaxagoras, T; Speller, R D; Kanicki, J

2015-12-07

Wafer-scale CMOS active pixel sensors (APSs) have been developed recently for x-ray imaging applications. The small pixel pitch and low noise are very promising properties for medical imaging applications such as digital breast tomosynthesis (DBT). In this work, we evaluated experimentally and through modeling the imaging properties of a 50 μm pixel pitch CMOS APS x-ray detector named DynAMITe (Dynamic Range Adjustable for Medical Imaging Technology). A modified cascaded system model was developed for CMOS APS x-ray detectors by taking into account the device nonlinear signal and noise properties. The imaging properties such as modulation transfer function (MTF), noise power spectrum (NPS), and detective quantum efficiency (DQE) were extracted from both measurements and the nonlinear cascaded system analysis. The results show that the DynAMITe x-ray detector achieves a high spatial resolution of 10 mm(-1) and a DQE of around 0.5 at spatial frequencies  CMOS APS x-ray detector, image aquisition geometry and image reconstruction techniques should be considered.

CMS detector tracking performance in Run-II

CERN Document Server

Brondolin, Erica

2017-01-01

Since the start of Run-II in June 2015, LHC has delivered pp collisions at a center of mass energy of 13TeV and with a bunch time separation of 25 ns. On avarage, more than 25 inelastic collisions are superimposed on the event of interest. Under these new conditions, the CMS collaboration has re-calibrated and verified the performance of the whole detector. In particular, the CMS tracking performance has been measured both directly and indirectly. Direct measurements are, among others, the beam spot determination, the vertex resolution and the muon reconstruction efficiency with the tag and probe technique. An indirect assessment can be given by the pion reconstruction efficiency and the low-mass resonance parameters as a function of different single track kinematics.

18F-FDG positron autoradiography with a particle counting silicon pixel detector.

Science.gov (United States)

Russo, P; Lauria, A; Mettivier, G; Montesi, M C; Marotta, M; Aloj, L; Lastoria, S

2008-11-07

We report on tests of a room-temperature particle counting silicon pixel detector of the Medipix2 series as the detector unit of a positron autoradiography (AR) system, for samples labelled with (18)F-FDG radiopharmaceutical used in PET studies. The silicon detector (1.98 cm(2) sensitive area, 300 microm thick) has high intrinsic resolution (55 microm pitch) and works by counting all hits in a pixel above a certain energy threshold. The present work extends the detector characterization with (18)F-FDG of a previous paper. We analysed the system's linearity, dynamic range, sensitivity, background count rate, noise, and its imaging performance on biological samples. Tests have been performed in the laboratory with (18)F-FDG drops (37-37 000 Bq initial activity) and ex vivo in a rat injected with 88.8 MBq of (18)F-FDG. Particles interacting in the detector volume produced a hit in a cluster of pixels whose mean size was 4.3 pixels/event at 11 keV threshold and 2.2 pixels/event at 37 keV threshold. Results show a sensitivity for beta(+) of 0.377 cps Bq(-1), a dynamic range of at least five orders of magnitude and a lower detection limit of 0.0015 Bq mm(-2). Real-time (18)F-FDG positron AR images have been obtained in 500-1000 s exposure time of thin (10-20 microm) slices of a rat brain and compared with 20 h film autoradiography of adjacent slices. The analysis of the image contrast and signal-to-noise ratio in a rat brain slice indicated that Poisson noise-limited imaging can be approached in short (e.g. 100 s) exposures, with approximately 100 Bq slice activity, and that the silicon pixel detector produced a higher image quality than film-based AR.

Preliminary test of an imaging probe for nuclear medicine using hybrid pixel detectors

International Nuclear Information System (INIS)

Bertolucci, E.; Maiorino, M.; Mettivier, G.; Montesi, M.C.; Russo, P.

2002-01-01

We are investigating the feasibility of an intraoperative imaging probe for lymphoscintigraphy with Tc-99m tracer, for sentinel node radioguided surgery, using the Medipix series of hybrid detectors coupled to a collimator. These detectors are pixelated semiconductor detectors bump-bonded to the Medipix1 photon counting read-out chip (64x64 pixel, 170 μm pitch) or to the Medipix2 chip (256x256 pixel, 55 μm pitch), developed by the European Medipix collaboration. The pixel detector we plan to use in the final version of the probe is a semi-insulating GaAs detector or a 1-2 mm thick CdZnTe detector. For the preliminary tests presented here, we used 300-μm thick silicon detectors, hybridized via bump-bonding to the Medipix1 chip. We used a tungsten parallel-hole collimator (7 mm thick, matrix array of 64x64 100 μm circular holes with 170 μm pitch), and a 22, 60 and 122 keV point-like (1 mm diameter) radioactive sources, placed at various distances from the detector. These tests were conducted in order to investigate the general feasibility of this imaging probe and its resolving power. Measurements show the high resolution but low efficiency performance of the detector-collimator set, which is able to image the 122 keV source with <1 mm FWHM resolution

The upgraded Pixel Detector of the ATLAS experiment for Run-2 at the Large Hadron Collider

CERN Document Server

Giordani, MarioPaolo; The ATLAS collaboration

2016-01-01

Run-2 of the LHC is providing new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130nm technology. In addition the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. The commissioning and performance of the 4-layer Pixel Detector, in particular the IBL, will be presented, using collision data.

Radiationhard components for the control system of a future ATLAS pixel detector

International Nuclear Information System (INIS)

Becker, K; Boek, J; Kersten, S; Kind, P; Maettig, P; Puellen, L; Zeitnitz, C

2011-01-01

The upgrade of the ATLAS experiment for the High Luminosity LHC (HL-LHC) will include a new pixel detector. A completely new detector control system (DCS) for this pixel detector will be required in order to cope with the substantial increase in radiation at the HL-LHC. The DCS has to have a very high reliability and all components installed within the detector volume have to be radiationhard. This will ensure a safe operation of the pixel detector and the experiment. A further design constraint is the minimization of the used material and cables in order to limit the impact on the tracking performance to a minimum. To meet these requirements we propose a DCS network which consists of a DCS chip and a DCS controller. In the following we present the development of the first prototypes for the DCS chip and the DCS controller with a special focus on the communication interface, radiation hardness and robustness against single event upsets.

Characterization of irradiated thin silicon sensors for the CMS phase II pixel upgrade

Energy Technology Data Exchange (ETDEWEB)

Centis Vignali, Matteo; Garutti, Erika; Junkes, Alexandra; Steinbrueck, Georg [Institut fuer Experimentalphysik, Universitaet Hamburg (Germany); Eckstein, Doris; Eichhorn, Thomas [Deutsches Elektronen Synchrotron (DESY) (Germany)

2016-07-01

The high-luminosity upgrade of the Large Hadron Collider, foreseen for 2025, necessitates the replacement of the tracker of the CMS experiment. The innermost layer of the new pixel detector will be exposed to severe radiation corresponding to a 1 MeV neutron equivalent fluence up to Φ{sub eq} = 2 . 10{sup 16} cm{sup -2} and an ionizing dose of ∼ 10 MGy after an integrated luminosity of 3000 fb{sup -1}. Silicon crystals grown with different methods and sensor designs are under investigation in order to optimize the sensors for such high fluences. Thin planar silicon sensors are good candidates to achieve this goal, since the degradation of the signal produced by traversing particles is less severe than for thicker devices. Epitaxial pad diodes and strip sensors irradiated up to fluences of Φ{sub eq} = 1.3 . 10{sup 16} cm{sup -2} have been characterized in laboratory measurements and beam tests at the DESY II facility. The active thickness of the strip sensors and pad diodes is 100 μm. In addition, strip sensors produced using other growth techniques with a thickness of 200 μm have been studied. In this talk, the results obtained for p-bulk sensors are shown.

Versatile, reprogrammable area pixel array detector for time-resolved synchrotron x-ray applications

Energy Technology Data Exchange (ETDEWEB)

Gruner, Sol [Cornell Univ., Ithaca, NY (United States)

2010-05-01

The final technical report for DOE grant DE-SC0004079 is presented. The goal of the grant was to perform research, development and application of novel imaging x-ray detectors so as to effectively utilize the high intensity and brightness of the national synchrotron radiation facilities to enable previously unfeasible time-resolved x-ray research. The report summarizes the development of the resultant imaging x-ray detectors. Two types of detector platforms were developed: The first is a detector platform (called a Mixed-Mode Pixel Array Detector, or MM-PAD) that can image continuously at over a thousand images per second while maintaining high efficiency for wide dynamic range signals ranging from 1 to hundreds of millions of x-rays per pixel per image. Research on an even higher dynamic range variant is also described. The second detector platform (called the Keck Pixel Array Detector) is capable of acquiring a burst of x-ray images at a rate of millions of images per second.

The first bump-bonded pixel detectors on CVD diamond

International Nuclear Information System (INIS)

Adam, W.; Bauer, C.; Berdermann, E.; Bergonzo, P.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Grigoriev, E.; Hallewell, G.; Hall-Wilton, R.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Karl, C.; Kass, R.; Krammer, M.; Logiudice, A.; Lu, R.; Manfredi, P.F.; Manfredotti, C.; Marshall, R.D.; Meier, D.; Mishina, M.; Oh, A.; Palmieri, V.G.; Pan, L.S.; Peitz, A.; Pernicka, M.; Pirollo, S.; Polesello, P.; Pretzl, K.; Re, V.; Riester, J.L.; Roe, S.; Roff, D.; Rudge, A.; Schnetzer, S.; Sciortino, S.; Speziali, V.; Stelzer, H.; Steuerer, J.; Stone, R.; Tapper, R.J.; Tesarek, R.; Trawick, M.; Trischuk, W.; Turchetta, R.; Vittone, E.; Wagner, A.; Walsh, A.M.; Wedenig, R.; Weilhammer, P.; Zeuner, W.; Ziock, H.; Zoeller, M.; Charles, E.; Ciocio, A.; Dao, K.; Einsweiler, K.; Fasching, D.; Gilchriese, M.; Joshi, A.; Kleinfelder, S.; Milgrome, O.; Palaio, N.; Richardson, J.; Sinervo, P.; Zizka, G.

1999-01-01

Diamond is a nearly ideal material for detecting ionising radiation. Its outstanding radiation hardness, fast charge collection and low leakage current allow it to be used in high radiation environments. These characteristics make diamond sensors particularly appealing for use in the next generation of pixel detectors. Over the last year, the RD42 collaboration has worked with several groups that have developed pixel readout electronics in order to optimise diamond sensors for bump-bonding. This effort resulted in an operational diamond pixel sensor that was tested in a pion beam. We demonstrate that greater than 98% of the channels were successfully bump-bonded and functioning. The device shows good overall hit efficiency as well as clear spatial hit correlation to tracks measured in a silicon reference telescope. A position resolution of 14.8 μm was observed, consistent with expectations given the detector pitch

The first bump-bonded pixel detectors on CVD diamond

CERN Document Server

Adam, W; Berdermann, E; Bergonzo, P; Bogani, F; Borchi, E; Brambilla, A; Bruzzi, Mara; Colledani, C; Conway, J; Dabrowski, W; Delpierre, P A; Deneuville, A; Dulinski, W; van Eijk, B; Fallou, A; Fizzotti, F; Foulon, F; Fried, M; Gan, K K; Gheeraert, E; Grigoriev, E; Hallewell, G D; Hall-Wilton, R; Han, S; Hartjes, F G; Hrubec, Josef; Husson, D; Kagan, H; Kania, D R; Kaplon, J; Karl, C; Kass, R; Krammer, Manfred; Lo Giudice, A; Lü, R; Manfredi, P F; Manfredotti, C; Marshall, R D; Meier, D; Mishina, M; Oh, A; Palmieri, V G; Pan, L S; Peitz, A; Pernicka, Manfred; Pirollo, S; Polesello, P; Pretzl, Klaus P; Re, V; Riester, J L; Roe, S; Roff, D G; Rudge, A; Schnetzer, S R; Sciortino, S; Speziali, V; Stelzer, H; Steuerer, J; Stone, R; Tapper, R J; Tesarek, R J; Trawick, M L; Trischuk, W; Turchetta, R; Vittone, E; Wagner, A; Walsh, A M; Wedenig, R; Weilhammer, Peter; Zeuner, W; Ziock, H J; Zöller, M; Charles, E; Ciocio, A; Dao, K; Einsweiler, Kevin F; Fasching, D; Gilchriese, M G D; Joshi, A; Kleinfelder, S A; Milgrome, O; Palaio, N; Richardson, J; Sinervo, P K; Zizka, G

1999-01-01

Diamond is a nearly ideal material for detecting ionising radiation. Its outstanding radiation hardness, fast charge collection and low leakage current allow it to be used in high radiation environments. These characteristics make diamond sensors particularly appealing for use in the next generation of pixel detectors. Over the last year, the RD42 collaboration has worked with several groups that have developed pixel readout electronics in order to optimise diamond sensors for bump-bonding. This effort resulted in an operational diamond pixel sensor that was tested in a pion beam. We demonstrate that greater than 98565544f the channels were successfully bump-bonded and functioning. The device shows good overall hit efficiency as well as clear spatial hit correlation to tracks measured in a silicon reference telescope. A position resolution of 14.8 mu m was observed, consistent with expectations given the detector pitch. (13 refs).

The first bump-bonded pixel detectors on CVD diamond

Energy Technology Data Exchange (ETDEWEB)

Adam, W.; Bauer, C.; Berdermann, E.; Bergonzo, P.; Bogani, F.; Borchi, E.; Brambilla, A.; Bruzzi, M.; Colledani, C.; Conway, J.; Dabrowski, W.; Delpierre, P.; Deneuville, A.; Dulinski, W.; Eijk, B. van; Fallou, A.; Fizzotti, F.; Foulon, F.; Friedl, M.; Gan, K.K.; Gheeraert, E.; Grigoriev, E.; Hallewell, G.; Hall-Wilton, R.; Han, S.; Hartjes, F.; Hrubec, J.; Husson, D.; Kagan, H.; Kania, D.; Kaplon, J.; Karl, C.; Kass, R.; Krammer, M.; Logiudice, A.; Lu, R.; Manfredi, P.F.; Manfredotti, C.; Marshall, R.D.; Meier, D.; Mishina, M.; Oh, A.; Palmieri, V.G.; Pan, L.S.; Peitz, A.; Pernicka, M.; Pirollo, S.; Polesello, P.; Pretzl, K.; Re, V.; Riester, J.L.; Roe, S.; Roff, D.; Rudge, A.; Schnetzer, S.; Sciortino, S.; Speziali, V.; Stelzer, H.; Steuerer, J.; Stone, R.; Tapper, R.J.; Tesarek, R.; Trawick, M.; Trischuk, W. E-mail: william@physics.utoronto.ca; Turchetta, R.; Vittone, E.; Wagner, A.; Walsh, A.M.; Wedenig, R.; Weilhammer, P.; Zeuner, W.; Ziock, H.; Zoeller, M.; Charles, E.; Ciocio, A.; Dao, K.; Einsweiler, K.; Fasching, D.; Gilchriese, M.; Joshi, A.; Kleinfelder, S.; Milgrome, O.; Palaio, N.; Richardson, J.; Sinervo, P.; Zizka, G

1999-11-01

Diamond is a nearly ideal material for detecting ionising radiation. Its outstanding radiation hardness, fast charge collection and low leakage current allow it to be used in high radiation environments. These characteristics make diamond sensors particularly appealing for use in the next generation of pixel detectors. Over the last year, the RD42 collaboration has worked with several groups that have developed pixel readout electronics in order to optimise diamond sensors for bump-bonding. This effort resulted in an operational diamond pixel sensor that was tested in a pion beam. We demonstrate that greater than 98% of the channels were successfully bump-bonded and functioning. The device shows good overall hit efficiency as well as clear spatial hit correlation to tracks measured in a silicon reference telescope. A position resolution of 14.8 {mu}m was observed, consistent with expectations given the detector pitch.

Readout architecture for the Pixel-Strip module of the CMS Outer Tracker Phase-2 upgrade

CERN Document Server

Caratelli, Alessandro; Jan Kaplon; Kloukinas, Konstantinos; Simone Scarfi

2017-01-01

The Outer Tracker upgrade of the Compact Muon Solenoid (CMS) experiment at CERN introduces new challenges for the front-end readout electronics. In particular, the capability of identifying particles with high transverse momentum using modules with double sensor layers requires high speed real time interconnects between readout ASICs. The Pixel-Strip module combines a pixelated silicon layer with a silicon-strip layer. Consequently, it needs two different readout ASICs, namely the Short Strip ASIC (SSA) for the strip sensor and the Macro Pixel ASIC (MPA) for the pixelated sensor. The architecture proposed in this paper allows for a total data flow between readout ASICs of $\\sim$100\\,Gbps and reduces the output data flow from 1.3\\,Tbps to 30\\,Gbps per module while limiting the total power density to below 100\\,mW/cm$^2$. In addition a system-level simulation framework of all the front-end readout ASICs is developed in order to verify the data processing algorithm and the hardware implementation allowing mult...

The role of XML in the CMS detector description

International Nuclear Information System (INIS)

Liendl, M.; Lingen, F.van; Todorov, T.; Arce, P.; Furtjes, A.; Innocente, V.; Roeck, A. de; Case, M.

2001-01-01

Offline Software such as Simulation, Reconstruction, Analysis, and Visualisation are all in need of a detector description. These applications have several common but also many specific requirements for the detector description in order to build up their internal representations. To achieve this in a consistent and coherent manner a common source of information, the detector description database, will be consulted by each of the applications. The role and suitability of XML in the design of the detector description database in the scope of the CMS detector at the LHC is discussed. Different aspects such as data modelling capabilities of XML, tool support, integration to C++ representations of data models are treated and recent results of prototype implementations are presented

The Layer 1 / Layer 2 readout upgrade for the ATLAS Pixel Detector

CERN Document Server

Mullier, Geoffrey; The ATLAS collaboration

2016-01-01

The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of the Large Hadron Collider (LHC). The increase of instantaneous luminosity foreseen during the LHC Run 2, will lead to an increased detector occupancy that is expected to saturate the readout links of the outermost layers of the pixel detector: Layers 1 and 2. To ensure a smooth data taking under such conditions, the read out system of the recently installed fourth innermost pixel layer, the Insertable B-Layer, was modified to accomodate the needs of the older detector. The Layer 2 upgrade installation took place during the 2015 winter shutdown, with the Layer 1 installation scheduled for 2016. A report of the successful installation, together with the design of novel dedicated optical to electrical converters and the software and firmware updates will be presented.

Exploration of Pixelated detectors for double beta decay searches within the COBRA experiment

Energy Technology Data Exchange (ETDEWEB)

Schwenke, M., E-mail: schwenke@asp.tu-dresden.de [Institut fuer Kern- und Teilchenphysik, Technische Universitaet Dresden, Zellescher Weg 19, 01069 Dresden (Germany); Zuber, K.; Janutta, B. [Institut fuer Kern- und Teilchenphysik, Technische Universitaet Dresden, Zellescher Weg 19, 01069 Dresden (Germany); He, Z.; Zeng, F. [Department of Nuclear Engineering and Radiological Sciences, University of Michigan, Ann Arbor, Michigan 48109-2104 (United States); Anton, G.; Michel, T.; Durst, J.; Lueck, F.; Gleixner, T. [Erlangen Centre for Astroparticle Physics, Friedrich-Alexander-Universitaet Erlangen-Nuernberg, Erwin-Rommel-Str. 1, 91058 Erlangen (Germany); Goessling, C.; Schulz, O.; Koettig, T. [Technische Universitaet Dortmund, Physik E IV, 44221 Dortmund (Germany); Krawczynski, H.; Martin, J. [Department of Physics, Washington University in St. Louis, Campus Box 1105, One Brookings Drive, St. Louis, MO 63130-4899 (United States); Stekl, I.; Cermak, P. [Institute of Experimental and Applied Physics, Czech Technical University in Prague, Horska 3a/22, 128 00 Prague (Czech Republic)

2011-09-11

The aim of the COBRA experiment is the search for neutrinoless double beta decay events in Cadmium Zinc Telluride (CdZnTe) room temperature semiconductor detectors. The development of pixelated detectors provides the potential for clear event identification and thus major background reduction. The tracking option of a semiconductor is a unique approach in this field. For initial studies, several possible detector systems are considered with a special regard for low background applications: the large volume system Polaris with a pixelated CdZnTe sensor, Timepix detectors with Si and enriched CdTe sensor material and a CdZnTe pixel system developed at the Washington University in St. Louis, USA. For all detector systems first experimental background measurements taken at underground laboratories (Gran Sasso Underground Laboratory in Italy, LNGS and the Niederniveau Messlabor Felsenkeller in Dresden, Germany) and additionally for the Timepix detectors simulation results are presented.

MCC: the Module Controller Chip for the ATLAS Pixel Detector

International Nuclear Information System (INIS)

Beccherle, R.; Darbo, G.; Gagliardi, G.; Gemme, C.; Morettini, P.; Musico, P.; Osculati, B.; Oppizzi, P.; Pratolongo, F.; Ruscino, E.; Schiavi, C.; Vernocchi, F.; Blanquart, L.; Einsweiler, K.; Meddeler, G.; Richardson, J.; Comes, G.; Fischer, P.; Calvet, D.; Boyd, R.; Sicho, P.

2002-01-01

In this article we describe the architecture of the Module Controller Chip for the ATLAS Pixel Detector. The project started in 1997 with the definition of the system specifications. A first fully-working rad-soft prototype was designed in 1998, while a radiation hard version was submitted in 2000. The 1998 version was used to build pixel detector modules. Results from those modules and from the simulated performance in ATLAS are reported. In the article we also describe the hardware/software tools developed to test the MCC performance at the LHC event rate

Simulated and experimental spectroscopic performance of GaAs X-ray pixel detectors

International Nuclear Information System (INIS)

Bisogni, M.G.; Cola, A.; Fantacci, M.E.

2001-01-01

In pixel detectors, the electrode geometry affects the signal shape and therefore the spectroscopic performance of the device. This effect is enhanced in semiconductors where carrier trapping is relevant. In particular, semi insulating (SI) GaAs crystals present an incomplete charge collection due to a high concentration of deep traps in the bulk. In the last few years, SI GaAs pixel detectors have been developed as soft X-ray detectors for medical imaging applications. In this paper, we present a numerical method to evaluate the local charge collection properties of pixel detectors. A bi-dimensional description has been used to represent the detector geometry. According to recent models, the active region of a reverse biased SI GaAs detector is almost neutral. Therefore, the electrostatic potential inside a full active detector has been evaluated using the Laplace equation. A finite difference method with a fixed step orthogonal mesh has been adopted. The photon interaction point has been generated with a Monte Carlo method according to the attenuation length of a monochromatic X-ray beam in GaAs. The number of photogenerated carriers for each interaction has been extracted using a gaussian distribution. The induced signal on the collecting electrode has been calculated according to the Ramo's theorem and the trapping effect has been modeled introducing electron and hole lifetimes. The noise of the charge preamplifier have been also taken into account. A comparison between simulated and experimental X-ray spectra from a 241 Am source acquired with different GaAs pixel detectors has been carried out

Iterative local Chi2 alignment algorithm for the ATLAS Pixel detector

CERN Document Server

Göttfert, Tobias

The existing local chi2 alignment approach for the ATLAS SCT detector was extended to the alignment of the ATLAS Pixel detector. This approach is linear, aligns modules separately, and uses distance of closest approach residuals and iterations. The derivation and underlying concepts of the approach are presented. To show the feasibility of the approach for Pixel modules, a simplified, stand-alone track simulation, together with the alignment algorithm, was developed with the ROOT analysis software package. The Pixel alignment software was integrated into Athena, the ATLAS software framework. First results and the achievable accuracy for this approach with a simulated dataset are presented.

Neural network based cluster creation in the ATLAS silicon pixel detector

CERN Document Server

Selbach, K E; The ATLAS collaboration

2012-01-01

The read-out from individual pixels on planar semi-conductor sensors are grouped into clusters to reconstruct the location where a charged particle passed through the sensor. The resolution given by individual pixel sizes is significantly improved by using the information from the charge sharing between pixels. Such analog cluster creation techniques have been used by the ATLAS experiment for many years to obtain an excellent performance. However, in dense environments, such as those inside high-energy jets, clusters have an increased probability of merging the charge deposited by multiple particles. Recently, a neural network based algorithm which estimates both the cluster position and whether a cluster should be split has been developed for the ATLAS pixel detector. The algorithm significantly reduces ambiguities in the assignment of pixel detector measurement to tracks within jets and improves the position accuracy with respect to standard interpolation techniques by taking into account the 2-dimensional ...

Neural network based cluster creation in the ATLAS silicon Pixel Detector

CERN Document Server

Andreazza, A; The ATLAS collaboration

2013-01-01

The read-out from individual pixels on planar semi-conductor sensors are grouped into clusters to reconstruct the location where a charged particle passed through the sensor. The resolution given by individual pixel sizes is significantly improved by using the information from the charge sharing between pixels. Such analog cluster creation techniques have been used by the ATLAS experiment for many years to obtain an excellent performance. However, in dense environments, such as those inside high-energy jets, clusters have an increased probability of merging the charge deposited by multiple particles. Recently, a neural network based algorithm which estimates both the cluster position and whether a cluster should be split has been developed for the ATLAS Pixel Detector. The algorithm significantly reduces ambiguities in the assignment of pixel detector measurement to tracks within jets and improves the position accuracy with respect to standard interpolation techniques by taking into account the 2-dimensional ...

Wedge silicon detectors for the inner trackering system of CMS

International Nuclear Information System (INIS)

Catacchini, E.; Civinini, C.; D'Alessandro, R.; Focardi, E.; Meschini, M.; Parrini, G.; Pieri, M.; Wheadon, R.

1997-01-01

One ''wedge'' double sided silicon detector prototype for the CMS forward inner tracker has been tested both in laboratory and on a high energy particle beam. The results obtained indicate the most reliable solutions for the strip geometry of the junction side. Three different designs of ''wedge'' double sided detectors with different solutions for the ohmic side strip geometry are presented. (orig.)

Modeling Radiation Damage to Pixel Sensors in the ATLAS Detector

CERN Document Server

Rossini, Lorenzo; The ATLAS collaboration

2018-01-01

Silicon pixel detectors are at the core of the current and planned upgrade of the ATLAS detector at the Large Hadron Collider (LHC). As the closest detector component to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the High-Luminosity LHC (HL-LHC), the innermost layers will receive a fluence in excess of 10^15 neq/cm^2 and the HL-HLC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. Simulating radiation damage is critical in order to make accurate predictions for current and future detector performance that will enable searches for new particles and forces as well as precision measurements of Standard Model particles such as the Higgs boson. We present a digitization model that includes radiation damage effects to the ATLAS pixel sensors for the first time and considers both planar and 3D sensor designs. In addition to thoroughly describing the setup, we compare predictions for b...

Recent progress in the development of a B-factory monolithic active pixel detector

International Nuclear Information System (INIS)

Stanic, S.; Aihara, H.; Barbero, M.; Bozek, A.; Browder, T.; Hazumi, M.; Kennedy, J.; Kent, N.; Olsen, S.; Palka, H.; Rosen, M.; Ruckman, L.; Trabelsi, K.; Tsuboyama, T.; Uchida, K.; Varner, G.; Yang, Q.

2006-01-01

Due to the need for precise vertexing at future higher luminosity B-factories with the expectedly increasing track densities and radiation exposures, upgrade of present silicon strip detectors with thin, radiation resistant pixel detectors is highly desired. Considerable progress in the technological development of thin CMOS based Monolithic Active Pixel Sensors (MAPS) in the last years makes them a realistic upgrade option and the feasibility studies of their application in Belle are actively pursued. The most serious concerns are their radiation hardness and their read-out speed. To address them, several prototypes denoted as Continuous Acquisition Pixel (CAP) sensors have been developed and tested. The latest of the CAP sensor prototypes is CAP3, designed in the TSMC 0.25μm process with a 5-deep sample pair pipeline in each pixel. A setup with several CAP3 sensors will be used to assess the performance of a full scale pixel read-out system running at realistic read-out speed. The results and plans for the next stages of R and D towards a full Pixel Vertex Detector (PVD) are presented

An analysis of the control hierarchy modelling of the CMS detector control system

Energy Technology Data Exchange (ETDEWEB)

Hwong, Yi-Ling; et al.

2011-01-01

The supervisory level of the Detector Control System (DCS) of the CMS experiment is implemented using Finite State Machines (FSM), which model the behaviours and control the operations of all the sub-detectors and support services. The FSM tree of the whole CMS experiment consists of more than 30.000 nodes. An analysis of a system of such size is a complex task but is a crucial step towards the improvement of the overall performance of the FSM system. This paper presents the analysis of the CMS FSM system using the micro Common Representation Language 2 (mcrl2) methodology. Individual mCRL2 models are obtained for the FSM systems of the CMS sub-detectors using the ASF+SDF automated translation tool. Different mCRL2 operations are applied to the mCRL2 models. A mCRL2 simulation tool is used to closer examine the system. Visualization of a system based on the exploration of its state space is enabled with a mCRL2 tool. Requirements such as command and state propagation are expressed using modal mu-calculus and checked using a model checking algorithm. For checking local requirements such as endless loop freedom, the Bounded Model Checking technique is applied. This paper discusses these analysis techniques and presents the results of their application on the CMS FSM system.

Design of readout drivers for ATLAS pixel detectors using field programmable gate arrays

CERN Document Server

Sivasubramaniyan, Sriram

Microstrip detectors are an integral patt of high energy physics research . Special protocols are used to transmit the data from these detectors . To readout the data from such detectors specialized instrumentation have to be designed . To achieve this task, creative and innovative high speed algorithms were designed simulated and implemented in Field Programmable gate arrays, using CAD/CAE tools. The simulation results indicated that these algorithms would be able to perform all the required tasks quickly and efficiently. This thesis describes the design of data acquisition system called the Readout Drivers (ROD) . It focuses on the ROD data path for ATLAS Pixel detectors. The data path will be an integrated part of Readout Drivers setup to decode the data from the silicon micro strip detectors and pixel detectors. This research also includes the design of Readout Driver controller. This Module is used to control the operation of the ROD. This module is responsible for the operation of the Pixel decoders bas...

Characteristics of the ATLAS and CMS detectors

CERN Document Server

Seiden, Abraham

2012-01-01

The goal for the detection of new physics processes in particle collisions at Large Hadron Collider energies, combined with the broad spectrum of possibilities for how the physics might be manifest, leads to detectors of unprecedented scope and size for particle physics experiments at colliders. The resulting two detectors, ATLAS (A Toroidal LHC ApparatuS) and CMS (compact muon spectrometer), must search for the new physics processes within very complex events arising from the very high-energy collisions. The two experiments share many basic design features—in particular, the need for very selective triggering to weed out the bulk of the uninteresting events; the order in which detector types are arrayed in order to provide maximum information about each event; and the very large angular coverage required to constrain the energy carried by any non-interacting particles. However, within these basic constraints, the detectors are quite different given the different emphases placed on issues such as resolution...

Status of the Silicon Strip Detector at CMS

CERN Document Server

Simonis, H J

2008-01-01

The CMS Tracker is the world's largest silicon detector. It has only recently been moved underground and installed in the 4T solenoid. Prior to this there has been an intensive testing on the surface, which confirms that the detector system fully meets the design specifications. Irradiation studies with the sensor material shows that the system will survive for at least 10 years in the harsh radiation environment prevailing within the Tracker volume. The planning phase for SLHC as the successor of LHC, with a ten times higher luminosity at the same energy has already begun. First R\\&D studies for more robust detector materials and a new Tracker layout have started.

Performance of new radiation tolerant thin n-in-p Silicon pixel sensors for the CMS experiment at High Luminosity LHC

CERN Document Server

Dalla Betta, G.F; Darbo, G; Dinardo, Mauro; Giacomini, G; Menasce, Dario; Meschini, Marco; Messineo, Alberto; Moroni, Luigi; Rivera, Ryan Allen; Ronchin, S; Uplegger, Lorenzo; Viliani, Lorenzo; Zoi, Irene; Zuolo, Davide

2017-01-01

The High Luminosity upgrade of the CERN-LHC (HL-LHC) demands for a new high-radiation tolerant solid-state pixel sensor capable of surviving fluencies up to a few 10$^{16}$ particles/cm$^2$ at $\\sim$3 cm from the interaction point. To this extent the INFN ATLAS-CMS joint research activity in collaboration with Fondazione Bruno Kessler-FBK, is aiming at the development of thin n-in-p type pixel sensors for the HL-LHC. The R and D covers both planar and single-sided 3D columnar pixel devices made with the Si-Si Direct Wafer Bonding technique, which allows for the production of sensors with 100~$\\mu {\\rm m}$ and 130~$\\mu {\\rm m}$ active thickness for planars, and 130~$\\mu {\\rm m}$ for 3D sensors, the thinnest ones ever produced so far. First prototypes of hybrid modules bump-bonded to the present CMS readout chip have been tested in beam tests. Preliminary results on their performance before and after irradiation are presented.

Performance of the Insertable B-Layer for the ATLAS Pixel Detector during Quality Assurance and a Novel Pixel Detector Readout Concept based on PCIe

CERN Document Server

AUTHOR|(INSPIRE)INSPIRE-00356268; Pernegger, Heinz

2016-07-27

During the first long shutdown of the LHC the Pixel detector has been upgraded with a new 4th innermost layer, the Insertable B-Layer (IBL). The IBL will increase the tracking performance and help with higher than nominal luminosity the LHC will produce. The IBL is made up of 14 staves and in total 20 staves have been produced for the IBL. This thesis presents the results of the final quality tests performed on these staves in an detector-like environment, in order to select the 14 best of the 20 staves for integration onto the detector. The test setup as well as the testing procedure is introduced and typical results of each testing stage are shown and discussed. The overall performance of all staves is presented in regards to: tuning performance, radioactive source measurements, and number of failing pixels. Other measurement, which did not directly impact the selection of staves, but will be important for the operation of the detector or production of a future detector, are included. Based on the experienc...

An EUDET/AIDA Pixel Beam Telescope for Detector Development

CERN Document Server

Rubinskiy, I

2015-01-01

Ahigh resolution(σ< 2 μm) beam telescope based on monolithic active pixel sensors (MAPS) was developed within the EUDET collaboration. EUDET was a coordinated detector R&D programme for the future International Linear Collider providing test beam infrastructure to detector R&D groups. The telescope consists of six sensor planes with a pixel pitch of either 18.4 μm or 10 μmand canbe operated insidea solenoidal magnetic fieldofupto1.2T.Ageneral purpose cooling, positioning, data acquisition (DAQ) and offine data analysis tools are available for the users. The excellent resolution, readout rate andDAQintegration capabilities made the telescopea primary beam tests tool also for several CERN based experiments. In this report the performance of the final telescope is presented. The plans for an even more flexible telescope with three differentpixel technologies(ATLASPixel, Mimosa,Timepix) withinthenew European detector infrastructure project AIDA are presented.

X-Ray Beam Studies of Charge Sharing in Small Pixel, Spectroscopic, CdZnTe Detectors

Science.gov (United States)

Allwork, Christopher; Kitou, Dimitris; Chaudhuri, Sandeep; Sellin, Paul J.; Seller, Paul; Veale, Matthew C.; Tartoni, Nicola; Veeramani, Perumal

2012-08-01

Recent advances in the growth of CdZnTe material have allowed the development of small pixel, spectroscopic, X-ray imaging detectors. These detectors have applications in a diverse range of fields such as medical, security and industrial sectors. As the size of the pixels decreases relative to the detector thickness, the probability that charge is shared between multiple pixels increases due to the non zero width of the charge clouds drifting through the detector. These charge sharing events will result in a degradation of the spectroscopic performance of detectors and must be considered when analyzing the detector response. In this paper charge sharing and charge loss in a 250 μm pitch CdZnTe pixel detector has been investigated using a mono-chromatic X-ray beam at the Diamond Light Source, U.K. Using a 20 μm beam diameter the detector response has been mapped for X-ray energies both above (40 keV) and below (26 keV) the material K-shell absorption energies to study charge sharing and the role of fluorescence X-rays in these events.

FED firmware interface testing with pixel phase 1 emulator

CERN Document Server

Kilpatrick, Matthew

2017-01-01

A hardware emulation of the CMS pixel detector phase 1 upgrade front-end electronics has been developed to test and validate the architecture of the back-end electronics (FED) firmware. The emulation is implemented on a Virtex 6 FPGA on the CERN GLIB uTCA platform, utilizing an 8-way SFP FPGA Mezzanine Card to drive compatible optical transmitters to the back-end electronics at 400 bps. The firmware emulates the complex functions of the phase 1 pixel readout chips (PSI46digv2 and PROC600) and token bit manager ASICs and allows for possible abnormalities that can occur in the output data stream. The emulation implements both fixed data patterns that are used as test vectors and realistic simulated data to drive the readout of the FED at the expected data and trigger rates. Testing software was developed to control the emulator and verify correct transmission of data and exception handling in the FED. An installation has been integrated into the pixel DAQ test system at CMS to be used for fast validation of F...

FED firmware interface testing with pixel phase 1 emulator

CERN Document Server

Kilpatrick, Matthew

2018-01-01

A hardware emulation of the CMS pixel detector phase 1 upgrade front-end electronics has been developed to test and validate the architecture of the back-end electronics (FED) firmware. The emulation is implemented on a Virtex 6 FPGA on the CERN GLIB uTCA platform, utilizing an 8-way SFP FPGA Mezzanine Card to drive compatible optical transmitters to the back-end electronics at 400 bps. The firmware emulates the complex functions of the phase 1 pixel readout chips (PSI46digv2 and PROC600) and token bit manager ASICs and allows for possible abnormalities that can occur in the output data stream. The emulation implements both fixed data patterns that are used as test vectors and realistic simulated data to drive the readout of the FED at the expected data and trigger rates. Testing software was developed to control the emulator and verify correct transmission of data and exception handling in the FED. An installation has been integrated into the pixel DAQ test system at CMS to be used for fast validation of F...

Modeling Radiation Damage Effects in 3D Pixel Digitization for the ATLAS Detector

CERN Document Server

Giugliarelli, Gilberto; The ATLAS collaboration

2017-01-01

Silicon Pixel detectors are at the core of the current and planned upgrade of the ATLAS detector. As the detector in closest proximity to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the HL-LHC, the innermost layers will receive a fluence in excess of 10^15 neq/cm2 and the HL-LHC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. This poster presents the details of a new digitization model that includes radiation damage effects to the 3D Pixel sensors for the ATLAS Detector.

Modeling Radiation Damage Effects in 3D Pixel Digitization for the ATLAS Detector

CERN Document Server

Wallangen, Veronica; The ATLAS collaboration

2017-01-01

Silicon Pixel detectors are at the core of the current and planned upgrade of the ATLAS detector. As the detector in closest proximity to the interaction point, these detectors will be subjected to a significant amount of radiation over their lifetime: prior to the HL-LHC, the innermost layers will receive a fluence in excess of 10$^{15}$ n$_\\mathrm{eq}$/cm$^2$ and the HL-LHC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. This work presents the details of a new digitization model that includes radiation damage effects to the 3D Pixel sensors for the ATLAS detector.

Status and perspective of detector databases in the CMS experiment at the LHC

NARCIS (Netherlands)

Aerts, A.T.M.; Glege, F.; Liendl, M.; Vorobiev, I.; Willers, I.M.; Wynhoff, S.

2004-01-01

This note gives an overview at a high conceptual level of the various databases that capture the information concerning the CMS detector. The detector domain has been split up into four, partly overlapping parts that cover phases in the detector life cycle: construction, integration, configuration

Silicon micro-fluidic cooling for NA62 GTK pixel detectors

CERN Document Server

Romagnoli, G; Brunel, B; Catinaccio, A; Degrange, J; Mapelli, A; Morel, M; Noel, J; Petagna, P

2015-01-01

Silicon micro-channel cooling is being studied for efficient thermal management in application fields such as high power computing and 3D electronic integration. This concept has been introduced in 2010 for the thermal management of silicon pixel detectors in high energy physics experiments. Combining the versatility of standard micro-fabrication processes with the high thermal efficiency typical of micro-fluidics, it is possible to produce effective thermal management devices that are well adapted to different detector configurations. The production of very thin cooling devices in silicon enables a minimization of material of the tracking sensors and eliminates mechanical stresses due to the mismatch of the coefficient of thermal expansion between detectors and cooling systems. The NA62 experiment at CERN will be the first high particle physics experiment that will install a micro-cooling system to perform the thermal management of the three detection planes of its Gigatracker pixel detector.

X-ray Imaging Using a Hybrid Photon Counting GaAs Pixel Detector

CERN Document Server

Schwarz, C; Göppert, R; Heijne, Erik H M; Ludwig, J; Meddeler, G; Mikulec, B; Pernigotti, E; Rogalla, M; Runge, K; Smith, K M; Snoeys, W; Söldner-Rembold, S; Watt, J

1999-01-01

The performance of hybrid GaAs pixel detectors as X-ray imaging sensors were investigated at room temperature. These hybrids consist of 300 mu-m thick GaAs pixel detectors, flip-chip bonded to a CMOS Single Photon Counting Chip (PCC). This chip consists of a matrix of 64 x 64 identical square pixels (170 mu-m x 170 mu-m) and covers a total area of 1.2 cm**2. The electronics in each cell comprises a preamplifier, a discriminator with a 3-bit threshold adjust and a 15-bit counter. The detector is realized by an array of Schottky diodes processed on semi-insulating LEC-GaAs bulk material. An IV-charcteristic and a detector bias voltage scan showed that the detector can be operated with voltages around 200 V. Images of various objects were taken by using a standard X-ray tube for dental diagnostics. The signal to noise ratio (SNR) was also determined. The applications of these imaging systems range from medical applications like digital mammography or dental X-ray diagnostics to non destructive material testing (...

Evaluation of a hybrid photon counting pixel detector for X-ray polarimetry

International Nuclear Information System (INIS)

Michel, T.; Durst, J.

2008-01-01

It has already been shown in literature that X-ray sensitive CCDs can be used to measure the degree of linear polarization of X-rays using the effect that photoelectrons are emitted with a non-isotropic angular distribution in respect to the orientation of the electric field vector of impinging photons. Up to now hybrid semiconductor pixel detectors like the Timepix-detector have never been used for X-ray polarimetry. The main reason for this is that the pixel pitch is large compared to CCDs which results in a much smaller analyzing power. On the other hand, the active thickness of the sensor layer can be larger than in CCDs leading to an increased efficiency. Therefore hybrid photon counting pixel detectors may be used for imaging and polarimetry at higher photon energies. For irradiation with polarized X-ray photons we were able to measure an asymmetry between vertical and horizontal double hit events in neighboring pixels of the hybrid photon counting Timepix-detector at room temperature. For the specific spectrum used in our experiment an average polarization asymmetry of (0.96±0.02)% was measured. Additionally, the Timepix-detector with its spectroscopic time-over-threshold-mode was used to measure the dependence of the polarization asymmetry on energy deposition in the detector. Polarization asymmetries between 0.2% at 29 keV and 3.4% at 78 keV energy deposition were determined. The results can be reproduced with our EGS4-based Monte-Carlo simulation

Development of 3D-DDTC pixel detectors for the ATLAS upgrade

International Nuclear Information System (INIS)

Dalla Betta, Gian-Franco; Boscardin, Maurizio; Darbo, Giovanni; Gemme, Claudia; La Rosa, Alessandro; Pernegger, Heinz; Piemonte, Claudio; Povoli, Marco; Ronchin, Sabina; Zoboli, Andrea; Zorzi, Nicola

2011-01-01

We report on the development of n-on-p, 3D Double-Side Double Type Column (3D-DDTC) pixel detectors fabricated at FBK-irst (Trento, Italy) and oriented to the ATLAS upgrade. The considered fabrication technology is simpler than that required for full 3D detectors with active edge, but the detector efficiency and radiation hardness critically depend on the columnar electrode overlap and should be carefully evaluated. The first assemblies of these sensors (featuring 2, 3, or 4 columns per pixel) with the ATLAS FEI3 read-out chip have been tested in laboratory. Selected results from the electrical and functional characterization with radioactive sources are discussed here.

Development of 3D-DDTC pixel detectors for the ATLAS upgrade

Energy Technology Data Exchange (ETDEWEB)

Dalla Betta, Gian-Franco, E-mail: dallabe@disi.unitn.it [INFN, Sezione di Padova (Gruppo Collegato di Trento), and DISI, Universita di Trento, Via Sommarive 14, 38123 Povo di Trento (Italy); Boscardin, Maurizio [Fondazione Bruno Kessler (FBK-irst), Via Sommarive 18, 38123 Povo di Trento (Italy); Darbo, Giovanni; Gemme, Claudia [INFN, Sezione di Genova, Via Dodecaneso 33, 16146 Genova (Italy); La Rosa, Alessandro; Pernegger, Heinz [CERN-PH, CH-1211 Geneve 23 (Switzerland); Piemonte, Claudio [Fondazione Bruno Kessler (FBK-irst), Via Sommarive 18, 38123 Povo di Trento (Italy); Povoli, Marco [INFN, Sezione di Padova (Gruppo Collegato di Trento), and DISI, Universita di Trento, Via Sommarive 14, 38123 Povo di Trento (Italy); Ronchin, Sabina [Fondazione Bruno Kessler (FBK-irst), Via Sommarive 18, 38123 Povo di Trento (Italy); Zoboli, Andrea [INFN, Sezione di Padova (Gruppo Collegato di Trento), and DISI, Universita di Trento, Via Sommarive 14, 38123 Povo di Trento (Italy); Zorzi, Nicola [Fondazione Bruno Kessler (FBK-irst), Via Sommarive 18, 38123 Povo di Trento (Italy)

2011-04-21

We report on the development of n-on-p, 3D Double-Side Double Type Column (3D-DDTC) pixel detectors fabricated at FBK-irst (Trento, Italy) and oriented to the ATLAS upgrade. The considered fabrication technology is simpler than that required for full 3D detectors with active edge, but the detector efficiency and radiation hardness critically depend on the columnar electrode overlap and should be carefully evaluated. The first assemblies of these sensors (featuring 2, 3, or 4 columns per pixel) with the ATLAS FEI3 read-out chip have been tested in laboratory. Selected results from the electrical and functional characterization with radioactive sources are discussed here.

Development of 3D-DDTC pixel detectors for the ATLAS upgrade

CERN Document Server

Betta, G -F Dalla; Darbo, G; Gemme, C; La Rosa, A; Pernegger, H; Piemonte, C; Povoli, M; Ronchin, S; Zoboli, A; Zorzi, N

2011-01-01

We report on the development of n-on-p, 3D Double-Side Double Type Column (3D-DDTC) pixel detectors fabricated at FBK-irst (Trento, Italy) and oriented to the ATLAS upgrade. The considered fabrication technology is simpler than that required for full 3D detectors with active edge, but the detector efficiency and radiation hardness critically depend on the columnar electrode overlap and should be carefully evaluated. The first assemblies of these sensors (featuring 2, 3, or 4 columns per pixel) with the ATLAS FEI3 read-out chip have been tested in laboratory. Selected results from the electrical and functional characterization with radioactive sources are here discussed.

Development of a Test System for the Quality Assurance of Silicon Microstrip Detectors for the Inner Tracking System of the CMS Experiment

CERN Document Server

Axer, Markus

2003-01-01

The inner tracking system of the Compact Muon Solenoid (CMS) experiment at the Large Hadron Collider (LHC) which is being built at the European Laboratory for Particle Physics CERN (Geneva, Switzerland) will be equipped with two different technologies of silicon detectors. While the innermost tracker will be composed of silicon pixel detectors, silicon microstrip detectors are envisaged for the outer tracker architecture. The silicon microstrip tracker will house about 15,000 single detector modules each composed of a set of silicon sensors, the readout electronics (front end hybrid), and a support frame. It will provide a total active area of 198 m2 and ten million analogue channels read out at the collider frequency of 40 MHz. This large number of modules to be produced and integrated into the tracking system is an unprecedented challenge involving industrial companies and various research institutes from many different countries. This thesis deals with the physics of silicon sensors and the preparation of ...

The upgraded Pixel Detector of the ATLAS Experiment for Run 2 at the Large Hadron Collider

Energy Technology Data Exchange (ETDEWEB)

Backhaus, M., E-mail: malte.backhaus@cern.ch

2016-09-21

During Run 1 of the Large Hadron Collider (LHC), the ATLAS Pixel Detector has shown excellent performance. The ATLAS collaboration took advantage of the first long shutdown of the LHC during 2013 and 2014 and extracted the ATLAS Pixel Detector from the experiment, brought it to surface and maintained the services. This included the installation of new service quarter panels, the repair of cables, and the installation of the new Diamond Beam Monitor (DBM). Additionally, a completely new innermost pixel detector layer, the Insertable B-Layer (IBL), was constructed and installed in May 2014 between a new smaller beam pipe and the existing Pixel Detector. With a radius of 3.3 cm the IBL is located extremely close to the interaction point. Therefore, a new readout chip and two new sensor technologies (planar and 3D) are used in the IBL. In order to achieve best possible physics performance the material budget was improved with respect to the existing Pixel Detector. This is realized using lightweight staves for mechanical support and a CO{sub 2} based cooling system. This paper describes the improvements achieved during the maintenance of the existing Pixel Detector as well as the performance of the IBL during the construction and commissioning phase. Additionally, first results obtained during the LHC Run 2 demonstrating the distinguished tracking performance of the new Four Layer ATLAS Pixel Detector are presented.

Measurement of the wire tension and position of the muon detector in the CMS project

International Nuclear Information System (INIS)

Niu Weiping

2004-01-01

The Large Hadron Collider (LHC) is currently being constructed at CERN including the ATLAS (A Toroidal LHC Apparatus) and CMS. It this report, it is have a sample introduction of CMS Muon detector, the drift tube introduction and chamber construction. The scope of this report covers the drift tube design and technical description; measurement of the wire tension of the Muon detector and the quality control; measurement of the wire position of the Muon detector and the quality control and so on. (authors)

Detection of secondary electrons with pixelated hybrid semiconductor detectors

International Nuclear Information System (INIS)

Gebert, Ulrike Sonja

2011-01-01

Within the scope of this thesis, secondary electrons were detected with a pixelated semiconductor detector named Timepix. The Timepix detector consists of electronics and a sensor made from a semiconductor material. The connection of sensor and electronics is done for each pixel individually using bump bonds. Electrons with energies above 3 keV can be detected with the sensor. One electron produces a certain amount of electron-hole pairs according to its energy. The charge then drifts along an electric field to the pixel electronics, where it induces an electric signal. Even without a sensor it is possible to detect an electric signal from approximately 1000 electrons directly in the pixel electronics. Two different detector systems to detect secondary electrons using the Timepix detector were investigated during this thesis. First of all, a hybrid photon detector (HPD) was used to detect single photoelectrons. The HPD consists of a vacuum vessel with an entrance window and a cesium iodine photocathode at the inner surface of the window. Photoelectrons are released from the photocathode by incident light and are accelerated in an electric field towards the Timepix detector, where the point of interaction and the arrival time of the electron is determined. With a proximity focusing setup, a time resolution of 12 ns (with an acceleration voltage of 20 kV between photocathode and Timepix detector) was obtained. The HPD examined in this thesis showed a strong dependence of the dark rate form the acceleration voltage and the pressure in the vacuum vessel. At a pressure of few 10 -5 mbar and an acceleration voltage of 20 kV, the dark rate was about 800 Hz per mm 2 area of the read out photocathode. One possibility to reduce the dark rate is to identify ion feedback events. With a slightly modified setup it was possible to reduce the dark rate to 0.5 Hz/mm 2 . To achieve this, a new photocathode was mounted in a shorter distance to the detector. The measurements where

The CMS silicon strip tracker

International Nuclear Information System (INIS)

Focardi, E.; Albergo, S.; Angarano, M.; Azzi, P.; Babucci, E.; Bacchetta, N.; Bader, A.; Bagliesi, G.; Bartalini, P.; Basti, A.; Biggeri, U.; Bilei, G.M.; Bisello, D.; Boemi, D.; Bosi, F.; Borrello, L.; Bozzi, C.; Braibant, S.; Breuker, H.; Bruzzi, M.; Candelori, A.; Caner, A.; Castaldi, R.; Castro, A.; Catacchini, E.; Checcucci, B.; Ciampolini, P.; Civinini, C.; Creanza, D.; D'Alessandro, R.; Da Rold, M.; Demaria, N.; De Palma, M.; Dell'Orso, R.; Marina, R. Della; Dutta, S.; Eklund, C.; Elliott-Peisert, A.; Feld, L.; Fiore, L.; French, M.; Freudenreich, K.; Fuertjes, A.; Giassi, A.; Giraldo, A.; Glessing, B.; Gu, W.H.; Hall, G.; Hammerstrom, R.; Hebbeker, T.; Hrubec, J.; Huhtinen, M.; Kaminsky, A.; Karimaki, V.; Koenig, St.; Krammer, M.; Lariccia, P.; Lenzi, M.; Loreti, M.; Luebelsmeyer, K.; Lustermann, W.; Maettig, P.; Maggi, G.; Mannelli, M.; Mantovani, G.; Marchioro, A.; Mariotti, C.; Martignon, G.; Evoy, B. Mc; Meschini, M.; Messineo, A.; My, S.; Paccagnella, A.; Palla, F.; Pandoulas, D.; Parrini, G.; Passeri, D.; Pieri, M.; Piperov, S.; Potenza, R.; Raffaelli, F.; Raso, G.; Raymond, M.; Santocchia, A.; Schmitt, B.; Selvaggi, G.; Servoli, L.; Sguazzoni, G.; Siedling, R.; Silvestris, L.; Skog, K.; Starodumov, A.; Stavitski, I.; Stefanini, G.; Tempesta, P.; Tonelli, G.; Tricomi, A.; Tuuva, T.; Vannini, C.; Verdini, P.G.; Viertel, G.; Xie, Z.; Wang, Y.; Watts, S.; Wittmer, B.

1999-01-01

The Silicon Strip Tracker (SST) is the intermediate part of the CMS Central Tracker System. SST is based on microstrip silicon devices and in combination with pixel detectors and the Microstrip Gas Chambers aims at performing pattern recognition, track reconstruction and momentum measurements for all tracks with p T ≥2 GeV/c originating from high luminosity interactions at √s=14 TeV at LHC. We aim at exploiting the advantages and the physics potential of the precise tracking performance provided by the microstrip silicon detectors on a large scale apparatus and in a much more difficult environment than ever. In this paper we describe the actual SST layout and the readout system. (author)

The upgraded Pixel detector and the commissioning of the Inner Detector tracking of the ATLAS experiment for Run-2 at the Large Hadron Collider

CERN Document Server

AUTHOR|(INSPIRE)INSPIRE-00019188; The ATLAS collaboration

2016-01-01

Run-2 of the Large Hadron Collider (LHC) will provide new challenges to track and vertex reconstruction with higher energies, denser jets and higher rates. Therefore the ATLAS experiment has constructed the first 4-layer Pixel detector in HEP, installing a new Pixel layer, also called Insertable B-Layer (IBL). The IBL is a fourth layer of pixel detectors, and has been installed in May 2014 at a radius of 3.3 cm between the existing Pixel Detector and a new smaller radius beam-pipe. The new detector, built to cope with the high radiation and expected occupancy, is the first large scale application of 3D detectors and CMOS 130~nm technology. In addition, the Pixel detector was refurbished with a new service quarter panel to recover about 3% of defective modules lost during Run-1 and a new optical readout system to readout the data at higher speed while reducing the occupancy when running with increased luminosity. Complementing detector improvements, many improvements to Inner Detector track and vertex reconstr...

Results from the Commissioning of the ATLAS Pixel Detector

CERN Document Server

Ibragimov, I

2008-01-01

The ATLAS pixel detector is the innermost tracking detector of the ATLAS experiment at the Large Hadron Collider (LHC) at CERN. It has a total active area of 1.7 m2 of silicon read out by approximately 80 million electronic channels, which will detect particle tracks and decay vertices with a very high precision. After more than 10 years of development and construction it is the first time ever the whole detector has been operated together. The paper will illustrate the detector performance and give first results from the combined ATLAS cosmics runs.

Convolutional Neural Network for Track Seed Filtering at the CMS HLT

CERN Multimedia

CERN. Geneva

2018-01-01

Collider will constantly bring nominal luminosity increase, with the ultimate goal of reaching a peak luminosity of $5 · 10^{34} cm^{−2} s^{−1}$ for ATLAS and CMS experiments planned for the High Luminosity LHC (HL-LHC) upgrade. This rise in luminosity will directly result in an increased number of simultaneous proton collisions (pileup), up to 200, that will pose new challenges for the CMS detector and, specifically, for track reconstruction in the Silicon Pixel Tracker. One of the first steps of the track finding workflow is the creation of track seeds, i.e. compatible pairs of hits from different detector layers, that are subsequently fed to to higher level pattern recognition steps. However the set of compatible hit pairs is highly affected by combinatorial background resulting in the next steps of the tracking algorithm to process a significant fraction of fake doublets. A possible way of reducing this effect is taking into account the shape of the hit pixel cluster to check the compatibility bet...

3D simulations and modeling of new low capacitance silicon pixel detectors

Energy Technology Data Exchange (ETDEWEB)

Xiong, Bo; Li, Yu Yun [School of Materials Science and Engineering, Xiangtan University, Xiangtan 411105 (China); Center for Semiconductor Particle and photon Imaging Detector Development and Fabrication, Xiangtan University, Xiangtan 411105 (China); Li, Zheng, E-mail: zhengli58@gmail.com [School of Materials Science and Engineering, Xiangtan University, Xiangtan 411105 (China); Center for Semiconductor Particle and photon Imaging Detector Development and Fabrication, Xiangtan University, Xiangtan 411105 (China)

2016-09-21

With signal to noise ratio (S/N) being a key parameter of a high performance detector, reducing the detector noise has been one of the main tasks in detector development. A new low capacitance silicon pixel detector is proposed, which is based on a new electrode geometry with reduced effective electrode area while keeping the sensitive volume unchanged. Detector electrical characteristics including electrostatic potential, electric field, full depletion voltage, and capacitance have been simulated in detail using a 3D TCAD tool. From these simulations and calculations, we confirm that the new detector structure has a much reduced capacitance (by a factor of 3) as compared to the traditional pixel detectors with the same sensitive volume. This reduction in detector capacitance can certainly improve the detector signal to noise ratio. However, the full depletion voltage for the new structure is larger than that of the traditional one due to the small electrode effect.