Assembling surface mounted components on ink-jet printed double sided paper circuit board

Energy Technology Data Exchange (ETDEWEB)

Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Sidén, Johan; Nilsson, Hans-Erik [Department of Electronics Design, Mid Sweden University, SE-851 70 Sundsvall (Sweden); Hummelgård, Magnus; Olin, Håkan [Department of Natural Science, Mid Sweden University, SE-851 70 Sundsvall (Sweden); Hummelgård, Christine [Acreo Swedish ICT AB, Håstaholmen 4, SE-824 42 Hudiksvall (Sweden)

2014-03-07

Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed. (paper)

AIR EMISSIONS FROM LASER DRILLING OF PRINTED WIRING BOARD MATERIALS

Science.gov (United States)

The paper gives results of a study to characterize gases generated during laser drilling of printed wiring board (PWB) material and identifies the pollutants and generation rates found during the drilling process. Typically found in the missions stream were trace amounts of carbo...

An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards

Directory of Open Access Journals (Sweden)

Bruno de Castro Braz

Full Text Available Abstract Aerospace vehicles are mostly exposed to random vibration loads during its operational lifetime. These harsh conditions excites vibration responses in the vehicles printed circuit boards, what can cause failure on mission functionality due to fatigue damage of electronic components. A novel analytical model to evaluate the useful life of embedded electronic components (capacitors, chips, oscillators etc. mounted on Printed Circuit Boards (PCB is presented. The fatigue damage predictions are calculated by the relative displacement between the PCB and the component, the lead stiffness, as well the natural vibration modes of the PCB and the component itself. Statistical methods are used for fatigue cycle counting. The model is applied to experimental fatigue tests of PCBs available on literature. The analytical results are of the same magnitude order of the experimental findings.

Printed circuit board permittivity measurement using waveguide and resonator rings

NARCIS (Netherlands)

Op 't Land, Sjoerd; Tereshchenko, O.V.; Ramdani, Mohamed; Leferink, Frank Bernardus Johannes; Perdriau, Richard

2014-01-01

Knowing the frequency dependent complex permittivity of Printed Circuit Board (PCB) substrates is important in modern electronics. In this paper, two methods for measuring the permittivity are applied to the same Flame Resistant (FR4) substrate and the results are compared. The reference measurement

Research on Toxicity Evaluation of Waste Incineration Residues of Printed Circuit Boards

Directory of Open Access Journals (Sweden)

Rasa Volungevičienė

2014-10-01

Full Text Available Recycling waste printed circuit boards (PCB is an extremely complicated process, because PCBs consist of a number of complex components – hazardous and non-hazardous materials sets. Pyrolysis and combustion are currently the most effective treatment technologies for waste printed circuit boards. Pyrolysis can be used for thermally decomposing PCBs allowing for the simultaneous recovery of valuable materials. Following the extraction of valuable materials, the problem of residual ash utilization is encountered. Determining the qualitative and quantitative characteristics of incineration residue helps with choosing effective ash management technologies. This paper analyzes PCB ash generated at three different temperatures of 400 °C, 500 °C and 600 °C. Ash residues have been analysed to determine the quantity and type of metals present. Furthermore, the experiment of leaching heavy metals from ash has been described.

Ruggedizing Printed Circuit Boards Using a Wideband Dynamic Absorber

Directory of Open Access Journals (Sweden)

V.C. Ho

2003-01-01

Full Text Available The existing approaches to ruggedizing inherently fragile and sensitive critical components of electronic equipment such as printed circuit boards (PCB for use in hostile industrial and military environment are either insufficient or expensive. This paper addresses a novel approach towards ruggedizing commercial-off-the-shelf PCBs using a miniature wideband dynamic absorber. The optimisation technique used relies on the experimentally measured vibration spectra and complex receptance of the original PCB.

Bioleaching of metals from printed circuit boards supported with surfactant-producing bacteria

International Nuclear Information System (INIS)

Karwowska, Ewa; Andrzejewska-Morzuch, Dorota; Łebkowska, Maria; Tabernacka, Agnieszka; Wojtkowska, Małgorzata; Telepko, Alicja; Konarzewska, Agnieszka

2014-01-01

Highlights: • Bioleaching of metals from printed circuit boards by BSAC-producing bacteria was estimated. • Aeration increased the release of all metals in medium with sulphur and biosurfactant. • Increase in Cu, Pb, Ni and Cr removal rate was observed at 37 °C in acidic medium. -- Abstract: This study has evaluated the possibility of bioleaching zinc, copper, lead, nickel, cadmium and chromium from printed circuit boards by applying a culture of sulphur-oxidising bacteria and a mixed culture of biosurfactant-producing bacteria and sulphur-oxidising bacteria. It was revealed that zinc was removed effectively both in a traditional solution acidified by a way of microbial oxidation of sulphur and when using a microbial culture containing sulphur-oxidising and biosurfactant-producing bacteria. The average process efficiency was 48% for Zn dissolution. Cadmium removal was similar in both media, with a highest metal release of 93%. For nickel and copper, a better effect was obtained in the acidic medium, with a process effectiveness of 48.5% and 53%, respectively. Chromium was the only metal that was removed more effectively in the bioleaching medium containing both sulphur-oxidising and biosurfactant-producing bacteria. Lead was removed from the printed circuit boards with very low effectiveness (below 0.5%). Aerating the culture medium with compressed air increased the release of all metals in the medium with sulphur and biosurfactant, and of Ni, Cu, Zn and Cr in the acidic medium. Increasing the temperature of the medium (to 37 °C) had a more significant impact in the acidic environment than in the neutral environment

Bioleaching of metals from printed circuit boards supported with surfactant-producing bacteria

Energy Technology Data Exchange (ETDEWEB)

Karwowska, Ewa, E-mail: ewa.karwowska@is.pw.edu.pl [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Andrzejewska-Morzuch, Dorota; Łebkowska, Maria [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Tabernacka, Agnieszka, E-mail: agnieszka.tabernacka@is.pw.edu.pl [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Wojtkowska, Małgorzata; Telepko, Alicja; Konarzewska, Agnieszka [Warsaw University of Technology, Faculty of Environmental Engineering, Nowowiejska 20, 00-653 Warsaw (Poland)

2014-01-15

Highlights: • Bioleaching of metals from printed circuit boards by BSAC-producing bacteria was estimated. • Aeration increased the release of all metals in medium with sulphur and biosurfactant. • Increase in Cu, Pb, Ni and Cr removal rate was observed at 37 °C in acidic medium. -- Abstract: This study has evaluated the possibility of bioleaching zinc, copper, lead, nickel, cadmium and chromium from printed circuit boards by applying a culture of sulphur-oxidising bacteria and a mixed culture of biosurfactant-producing bacteria and sulphur-oxidising bacteria. It was revealed that zinc was removed effectively both in a traditional solution acidified by a way of microbial oxidation of sulphur and when using a microbial culture containing sulphur-oxidising and biosurfactant-producing bacteria. The average process efficiency was 48% for Zn dissolution. Cadmium removal was similar in both media, with a highest metal release of 93%. For nickel and copper, a better effect was obtained in the acidic medium, with a process effectiveness of 48.5% and 53%, respectively. Chromium was the only metal that was removed more effectively in the bioleaching medium containing both sulphur-oxidising and biosurfactant-producing bacteria. Lead was removed from the printed circuit boards with very low effectiveness (below 0.5%). Aerating the culture medium with compressed air increased the release of all metals in the medium with sulphur and biosurfactant, and of Ni, Cu, Zn and Cr in the acidic medium. Increasing the temperature of the medium (to 37 °C) had a more significant impact in the acidic environment than in the neutral environment.

Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards

DEFF Research Database (Denmark)

Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

2017-01-01

A majority of printed circuit board surfaces are covered with tin, therefore tin corrosion under humid conditions and movement of tin ions under the influence of an electric field plays an important role in the corrosion failure development. Tracking tin corrosion products spread on the printed c...

A FPGA implementation of solder paste deposit on printed circuit boards errors detector based in a bright and contrast algorithm

OpenAIRE

De Luca-Pennacchia, A.; Sánchez-Martínez, M. Á.

2007-01-01

Solder paste deposit on printed circuit boards (PCB) is a critical stage. It is known that about 60% of functionality defects in this type of boards are due to poor solder paste printing. These defects can be diminished by means of automatic optical inspection of this printing. Actually, this process is implemented by image processing software with its inherent high computational time cost. In this paper we propose to implement a high parallel degree image comparison algorithm suitable to be ...

Effect of ionic contamination on climatic reliability of printed circuit board assemblies

DEFF Research Database (Denmark)

Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

2012-01-01

The effect of NaCl and weak organic acids (WOAs) in “no-clean” wave solder flux residues was studied on electrochemical migration (ECM), leakage current, and corrosion on surface mount chip capacitors using a test printed circuit board assembly (PCBA) substrate having known chip components...

Improving intrinsic corrosion reliability of printed circuit board assembly

DEFF Research Database (Denmark)

Ambat, Rajan; Conseil, Helene

2016-01-01

conditions, therefore the protection of electronic devices is becoming a critical factor in system design. Humidity and local condensation inside electronic enclosures can significantly alter the performance of electronic devices. The presence of moisture in a PCB alters its quality, functionality, thermal...... performance, and thermo-mechanical properties, while condensation on the surface of printed circuit board assemblies (PCBAs) can lead to electrical failures, like electrochemical migration. The result is reduced life span for electronic products and heavy economic loss due to failures....

Impact of NaCl Contamination and Climatic Conditions on the Reliability of Printed Circuit Board Assemblies

DEFF Research Database (Denmark)

Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

2014-01-01

The effect of climatic conditions and ionic contamination on the reliability of printed circuit board assembly has been investigated in terms of leakage current (LC) and electrochemical migration susceptibility. The change in LC as a function of relative humidity (RH) and temperature was measured...... and 15 $^{\\circ}\\hbox{C}$ –65 $^{\\circ}\\hbox{C}$. The variation of RH at the surface of the test specimens was imposed by 1) increasing the RH of the surrounding air and 2) reducing the temperature of the printed circuit boards using a cooling stage, while maintaining a constant climatic condition...

CAD-CAM printed circuit board design

Science.gov (United States)

Agy, W. E.

A step-by-step procedure for a printed circuit design achieved by CAD is presented. The operator at the interactive CRT station moves a stylus across a graphics tablet and intersperses commands which result in computer-generated pictorial forms on the screen that were drawn on the pad. Standard symbols are used for commands allowing, for instance, connections to be made of specific types in certain locations, which can be automatically edited from a materials list. An entire network of drawn lines can be referenced by a signal name for recall, and a finished circuit schematic can be checked for designs rules compliance, including fault reporting in terms of designator/pin number. A map may be present delineating the boundaries of the circuitry area, and previously completed circuitry segments can be recalled for piece-by-piece assembly of the circuit board.

Printed Circuit Board Embedded Inductors for Very High Frequency Switch-Mode Power Supplies

DEFF Research Database (Denmark)

Madsen, Mickey Pierre; Knott, Arnold; Andersen, Michael A. E.

2013-01-01

The paper describes the design of three different structures for printed circuit board embedded inductors. Direct comparison of spirals, solenoids and toroids are made with regard to inductance, dc and ac resistance, electromagnetic field and design flexibility. First the equations for the impeda...

Preparing printed circuit boards for rapid turn-around time on a protomat plotter

International Nuclear Information System (INIS)

Hawtree, J.

1998-01-01

This document describes the use of the LPKF ProtoMat mill/drill unit circuit board Plotter, with the associated CAD/CAM software BoardMaster and CircuitCAM. At present its primarily use here at Fermilab's Particle Physics Department is for rapid-turnover of prototype PCBs double-sided and single-sided copper clad printed circuit boards (PCBs). (The plotter is also capable of producing gravure films and engraving aluminum or plastic although we have not used it for this.) It has the capability of making traces 0.004 inch wide with 0.004 inch spacings which is appropriate for high density surface mount circuits as well as other through-mounted discrete and integrated components. One of the primary benefits of the plotter is the capability to produce double-sided drilled boards from CAD files in a few hours. However to achieve this rapid turn-around time, some care must be taken in preparing the files. This document describes how to optimize the process of PCB fabrication. With proper preparation, researchers can often have a completed circuit board in a day's time instead of a week or two wait with usual procedures. It is assumed that the software and hardware are properly installed and that the machinist is acquainted with the Win95 operating system and the basics of the associated software. This paper does not describe its use with pen plotters, lasers or rubouts. The process of creating a PCB (printed circuit board) begins with the CAD (computer-aided design) software, usually PCAD or VeriBest. These files are then moved to CAM (computer-aided machining) where they are edited and converted to put them into the proper format for running on the ProtoMat plotter. The plotter then performs the actual machining of the board. This document concentrates on the LPKF programs CircuitCam BASIS and BoardMaster for the CAM software. These programs run on a Windows 95 platform to run an LPKF ProtoMat 93s plotter

Investigation, development and verification of printed circuit board embedded air-core solenoid transformers

DEFF Research Database (Denmark)

Mønster, Jakob Døllner; Madsen, Mickey Pierre; Pedersen, Jeppe Arnsdorf

2015-01-01

A new printed circuit board embedded air-core transformer/coupled inductor is proposed and presented. The transformer is intended for use in power converter applications operating at very high frequency between 30 MHz to 300 MHz. The transformer is based on two or more solenoid structures...

Environmental and economic implications of a shift to halogen-free printed wiring boards

Energy Technology Data Exchange (ETDEWEB)

Bergendahl, C.G.; Johansson, G.; Zackrisson, M. [IVF Industrial Research and Development Corp., Moelndal (Sweden); Lichtenvort, K. [Technical Univ. of Berlin (Germany); Nyyssoenen, J. [Aspocomp Oy, Salo (Finland)

2004-07-01

The 'Restriction of Hazardous Substances Directive' (RoHS) and the 'Waste from Electrical and Electronic Equipment Directive' (WEEE) enforced by the European Commission require new materials and processes to be implemented in the production of electrical and electronic equipment (EEE). In response to this, the project grEEEn (Cost Management System for greening Electrical and Electronic Equipment) was defined and carried out within the 5th framework programme of the EU. This paper presents the grEEEn method and the outcome of applying the method on a case study. The study addressed the material shift in printed wiring boards (PWBs), from the traditional FR4 material containing halogenated flame retardants to halogen-free FR4 materials. The paper presents the product, process and scenario modelling and the results from analysing costs, environmental profile and legal compliance. (orig.)

An interactive system for the automatic layout of printed circuit boards (ARAIGNEE)

International Nuclear Information System (INIS)

Combet, M.; Eder, J.; Pagny, C.

1974-12-01

A software package for the automatic layout of printed circuit boards is presented. The program permits an interaction of the user during the layout process. The automatic searching of paths can be interrupted at any step and convenient corrections can be inserted. This procedure improves strongly the performance of the program as far as the number of unresolved connections is concerned

Radiation evaluation method of commercial off-the-shelf (COTS) electronic printed circuit boards (PCBs)

International Nuclear Information System (INIS)

LaBel, K.A.; Gruner, T.D.; Reed, R.A.; Settles, B.; Wilmot, J.; Dougherty, L.F.; Russo, A.; Yuknis, W.; Foster, M.G.; Garrisson-Darrin, A.; Marshall, P.W.

1999-01-01

We present a radiation evaluation methodology and proton ground test results for candidate COTS PCBs (commercial off-the-shelf electronic printed circuit boards) and their associated electronics for low-altitude, low-inclination orbits. We will also discuss the implications associated with mission orbit and duration. (authors)

Packaging Printing Today

OpenAIRE

Stanislav Bolanča; Igor Majnarić; Kristijan Golubović

2015-01-01

Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. T...

Meeting of the ITER CTA Project Board

International Nuclear Information System (INIS)

Vlasenkov, V.

2002-01-01

The meeting of the ITER co-ordinated technical activities project board took place in Tokyo, Japan, on 21 January 2002, coinciding with the second Negotiators meeting (N2). Twelve participants, project board members and experts from Canada, European Union, the Russian Federation and the international team attended the meeting. The project board agreed to provide an R and D plan by June 2002, to be linked with the procurement allocation, for the period following the CTA. The ITER International Team Leader developed a proposal on establishing the working groups for drafting technical specifications for the most urgent procurement items

Depollution benchmarks for capacitors, batteries and printed wiring boards from waste electrical and electronic equipment (WEEE)

International Nuclear Information System (INIS)

Savi, Daniel; Kasser, Ueli; Ott, Thomas

2013-01-01

Highlights: • We’ve analysed data on the dismantling of electronic and electrical appliances. • Ten years of mass balance data of more than recycling companies have been considered. • Percentages of dismantled batteries, capacitors and PWB have been studied. • Threshold values and benchmarks for batteries and capacitors have been identified. • No benchmark for the dismantling of printed wiring boards should be set. - Abstract: The article compiles and analyses sample data for toxic components removed from waste electronic and electrical equipment (WEEE) from more than 30 recycling companies in Switzerland over the past ten years. According to European and Swiss legislation, toxic components like batteries, capacitors and printed wiring boards have to be removed from WEEE. The control bodies of the Swiss take back schemes have been monitoring the activities of WEEE recyclers in Switzerland for about 15 years. All recyclers have to provide annual mass balance data for every year of operation. From this data, percentage shares of removed batteries and capacitors are calculated in relation to the amount of each respective WEEE category treated. A rationale is developed, why such an indicator should not be calculated for printed wiring boards. The distributions of these de-pollution indicators are analysed and their suitability for defining lower threshold values and benchmarks for the depollution of WEEE is discussed. Recommendations for benchmarks and threshold values for the removal of capacitors and batteries are given

Depollution benchmarks for capacitors, batteries and printed wiring boards from waste electrical and electronic equipment (WEEE)

Energy Technology Data Exchange (ETDEWEB)

Savi, Daniel, E-mail: d.savi@umweltchemie.ch [Dipl. Environmental Sci. ETH, büro für umweltchemie, Zurich (Switzerland); Kasser, Ueli [Lic. Phil. Nat. (Chemist), büro für umweltchemie, Zurich (Switzerland); Ott, Thomas [Dipl. Phys. ETH, Institute of Applied Simulation, Zurich University of Applied Sciences, Wädenswil (Switzerland)

2013-12-15

Highlights: • We’ve analysed data on the dismantling of electronic and electrical appliances. • Ten years of mass balance data of more than recycling companies have been considered. • Percentages of dismantled batteries, capacitors and PWB have been studied. • Threshold values and benchmarks for batteries and capacitors have been identified. • No benchmark for the dismantling of printed wiring boards should be set. - Abstract: The article compiles and analyses sample data for toxic components removed from waste electronic and electrical equipment (WEEE) from more than 30 recycling companies in Switzerland over the past ten years. According to European and Swiss legislation, toxic components like batteries, capacitors and printed wiring boards have to be removed from WEEE. The control bodies of the Swiss take back schemes have been monitoring the activities of WEEE recyclers in Switzerland for about 15 years. All recyclers have to provide annual mass balance data for every year of operation. From this data, percentage shares of removed batteries and capacitors are calculated in relation to the amount of each respective WEEE category treated. A rationale is developed, why such an indicator should not be calculated for printed wiring boards. The distributions of these de-pollution indicators are analysed and their suitability for defining lower threshold values and benchmarks for the depollution of WEEE is discussed. Recommendations for benchmarks and threshold values for the removal of capacitors and batteries are given.

Contamination profile on typical printed circuit board assemblies vs soldering process

DEFF Research Database (Denmark)

Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

2014-01-01

Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

INSULATION RESISTANCE OF PRINTED CIRCUIT BOARDS. BEHAVIOR OF CERTAIN TYPES AND MAKES UNDER DIFFERENT CLIMATIC CONDITIONS. En undersoegelse af en raekke typer og fabrikater under forskellige klimatiske forhold

Energy Technology Data Exchange (ETDEWEB)

Olesen, S. T.

1971-11-15

The present study embraces measurements of insulation resistance on a number of types and makes of printed-circuit boards. The insulation measurements were performed on boards just received from the manufacturer, as well as on boards exposed to humidity or to elevated temperatures. A total of 33 types from five different material categories were obtained. The test material used thus originated from a variety of independent sources. The purpose of the project was to investigate the frequency with which batches with insufficiently baked material - and consequently having a poor insulation resistance - were encountered in practice. No such batches were in fact found, and it is likely that they do not occur as often as had previously been assumed.

Leaching of gold and silver from printed circuit board of mobile phones

OpenAIRE

Petter,Patrícia Melo Halmenschlager; Veit,Hugo Marcelo; Bernardes,Andréa Moura

2015-01-01

Nowadays there is a wide variety of models, sizes and configurations of mobile phones available for consumption. After the life cycle of this equipment, the recycling and reuse of the precious metals found in the printed circuit boards (PCB) of the mobile phones are principal objectives. Thus, the objective of this work was to characterize the gold and silver present in a PCB and develop a recycling route using alternative reagents for cyanide, such as sodium and ammonium thiosulfate. These r...

EMC and the printed circuit board design theory and layout made simple

CERN Document Server

Montrose, Mark I

1999-01-01

"This reference text shows how and why RF energy is created within a printed circuit board, and the manner in which propagation occurs. With thorough explanations, this book enables engineers to grasp both the fundamentals of EMC theory and signal integrity, along with the mitigation process needed to prevent an EMC event while maintaining optimal functionality for low- and high-technology products. Mr. Montrose also shows the relationship between time and frequency domains, helping one meet mandatory compliance requirements."--Jacket.

Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

Science.gov (United States)

Ivǎnuş, R. C.; ǎnuş, D., IV; Cǎlmuc, F.

2010-06-01

Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE) contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste - PCBs) leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L). The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

Printed board dipole trim magnet design for 20 MeV LIA

Energy Technology Data Exchange (ETDEWEB)

Liu, Chengjun; Zhu, Wenjun; Zhang, Kaizhi; Zhang, Wenwei; Yu, Haijun [China Academy of Engineering Physics., Chengdu (China). Inst. of Fluid Physics

1997-12-31

The printed board dipole trim magnet design for a 20 MeV LIA is presented. The prototype dipole magnet with the sin/cos distributed windings has demonstrated more than 650 Gs-cm integrated dipole field and 1% integrated dipole field homogeneity within 5 cm in radius, which is about 40% of the magnet radius. Numerical modeling of two prototype magnet designs using the 3D magnetic field code SCMAG is presented as well as data from magnetic field measurements of the two magnets. The agreement between the calculations and measurements is accurate to 2-3%. (author). 3 figs., 4 refs.

Effect of solder flux residue on the performance of silicone conformal coatings on printed circuit board assemblies

DEFF Research Database (Denmark)

Rathinavelu, Umadevi; Jellesen, Morten Stendahl; Ambat, Rajan

2013-01-01

Conformal coatings are applied on printed circuit board assemblies (PCBAs) in order to protect the assembly from environmental influence and silicone-based coating is commonly used. A systematic study on the performance of silicone conformal coating in connection with process-related contaminants...

Hydrothermal modification and recycling of nonmetallic particles from waste print circuit boards.

Science.gov (United States)

Gao, Xuehua; Li, Qisheng; Qiu, Jun

2018-04-01

Nonmetallic particles recycled from waste print circuit boards (NPRPs) were modified by a hydrothermal treatment method and the catalysts, solvents, temperature and time were investigated, which affected the modification effect of NPRPs. The mild hydrothermal treatment method does not need high temperature, and would not cause secondary pollution. Further, the modified NPRPs were used as the raw materials for the epoxy resin and glass fibers/epoxy resin composites, which were prepared by pouring and hot-pressing method. The mechanical properties and morphology of the composites were discussed. The results showed that relative intensity of the hydroxyl bonds on the surface of NPRPs increased 58.9% after modification. The mechanical tests revealed that both flexural and impact properties of the composites can be significantly improved by adding the modified NPRPs. Particularly, the maximum increment of flexural strength, flexural modulus and impact strength of the epoxy matrix composites with 30% modified NPRPs is 40.1%, 80.0% and 79.0%, respectively. Hydrothermal treatment can modify surface of NPRPs successfully and modified NPRPs can not only improve the properties of the composites, but also reduce the production cost of the composites and environmental pollution. Thus, we develop a new way to recycle nonmetallic materials of waste print circuit boards and the highest level of waste material recycling with the raw materials-products-raw materials closed cycle can be realized through the hydrothermal modification and reuse of NPRPs. Copyright © 2018 Elsevier Ltd. All rights reserved.

Assessing the operational life of flexible printed boards intended for continuous flexing applications : a case study.

Energy Technology Data Exchange (ETDEWEB)

Beck, David Franklin

2011-01-01

Through the vehicle of a case study, this paper describes in detail how the guidance found in the suite of IPC (Association Connecting Electronics Industries) publications can be applied to develop a high level of design assurance that flexible printed boards intended for continuous flexing applications will satisfy specified lifetime requirements.

Study of Photosensitive Dry Films Absorption for Printed Circuit Boards by Photoacoustic Technique

Science.gov (United States)

Hernández, R.; Zaragoza, J. A. Barrientos; Jiménez-Pérez, J. L.; Orea, A. Cruz; Correa-Pacheco, Z. N.

2017-08-01

In this work, the study of photosensitive dry-type films by photoacoustic technique is proposed. The dry film photoresist is resistant to chemical etching for printed circuit boards such as ferric chloride, sodium persulfate or ammonium, hydrochloric acid. It is capable of faithfully reproducing circuit pattern exposed to ultraviolet light (UV) through a negative. Once recorded, the uncured portion is removed with alkaline solution. It is possible to obtain good results in surface mount circuits with tracks of 5 mm. Furthermore, the solid resin films are formed by three layers, two protective layers and a UV-sensitive optical absorption layer in the range of 325 nm to 405 nm. By means of optical absorption of UV-visible rays emitted by a low-power Xe lamp, the films transform this energy into thermal waves generated by the absorption of optical radiation and subsequently no-radiative de-excitation occurs. The photoacoustic spectroscopy is a useful technique to measure the transmittance and absorption directly. In this study, the optical absorption spectra of the three layers of photosensitive dry-type films were obtained as a function of the wavelength, in order to have a knowledge of the absorber layer and the protective layers. These analyses will give us the physical properties of the photosensitive film, which are very important in curing the dry film for applications in printed circuit boards.

Fabrication of a capacitive relative humidity sensor using aluminum thin films deposited on etched printed circuit board

Directory of Open Access Journals (Sweden)

Lee Jacqueline Ann L.

2016-01-01

Full Text Available A capacitive humidity-sensing device was created by thermal evaporation of 99.999% aluminum. The substrate used for the coating was etched double-sided printed circuit board. The etched printed circuit board serves as the dielectric of the capacitor while the aluminum thin films deposited on either side serve as the plates of the capacitor. The capacitance was measured before and after exposure to humidity. The device was then calibrated by comparing the readings of capacitance with that of the relative humidity sensor of the Vernier LabQuest2. It was found that there is a linear relationship between the capacitance and relative humidity given by the equation C=1.418RH+29.139 where C is the capacitance and RH is the relative humidity. The surface of the aluminum films is porous and it is through these pores that water is adsorbed and capillary condensation occurs, thereby causing the capacitance to change upon exposure to humidity.

Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

Directory of Open Access Journals (Sweden)

Ivănuş R.C.

2010-06-01

Full Text Available Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste – PCBs leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L. The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

Ductile electroless Ni-P coating onto flexible printed circuit board

Science.gov (United States)

Wang, Wenchang; Zhang, Weiwei; Wang, Yurong; Mitsuzak, Naotoshi; Chen, Zhidong

2016-03-01

In this study, a ductile electroless Ni-P coating on the flexible printed circuit board (FPCB) was prepared in an acidic nickel plating bath. The addition of dipropylamine (DPA) in electroless plating not only improves the ductility of the Ni-P coating, but also enhances the corrosion resistance. The further analysis reveals that the ductility improvement and enhancement of corrosion resistance for the Ni-P coating may be due to the fact that the addition of DPA significantly refines the volume of columnar nodule and reduce the porosity, thus leading to the released internal stress. In addition, it was found that the nodule within the Ni-P coating grew into a columnar structure, which may be also contribute to the improvement of ductility.

Meeting of the ITER CTA project board

International Nuclear Information System (INIS)

Vlasenkov, V.

2002-01-01

This is information about meeting of the ITER CTA project board, which took place in Moscow, Russian Federation on 22 April 2002 on the occasion of the Third Negotiators Meeting (N3). Thirteen participants, representing PB members and experts from Canada (CA), the European Union (EU), Japan(JA), the Russian federation (RF) and the International Team (IT) attended the meeting chaired by Acad. E. Velikhov. The Project Board took note of the comments made concerning the status of the Participants Teams(PTs)

Search for the optimal size of printed circuit boards for mechanical structures for electronic equipment

Directory of Open Access Journals (Sweden)

Yefimenko A. A.

2014-12-01

Full Text Available The authors present a method, an algorithm and a program, designed to determine the optimal size of printed circuit boards (PCB of mechanical structures and different kinds of electronic equipment. The PCB filling factor is taken as an optimization criterion. The method allows one to quickly determine the dependence of the filling factor on the size of the PCB for various components.

Homogenization on Multi-Materials’ Elements: Application to Printed Circuit Boards and Warpage Analysis

Directory of Open Access Journals (Sweden)

Araújo Manuel

2016-01-01

Full Text Available Multi-material domains are often found in industrial applications. Modelling them can be computationally very expensive due to meshing requirements. The finite element properties comprising different materials are hardly accurate. In this work, a new homogenization method that simplifies the computation of the homogenized Young modulus, Poisson ratio and thermal expansion coefficient is proposed, and applied to composite-like material on a printed circuit board. The results show a good properties correspondence between the homogenized domain and the real geometry simulation.

Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

International Nuclear Information System (INIS)

Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia

2014-01-01

Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery

Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

Energy Technology Data Exchange (ETDEWEB)

Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia, E-mail: silvia.serranti@uniroma1.it

2014-11-15

Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery.

Comparative study of electromagnetic compatibility methods in printed circuit board design tools

International Nuclear Information System (INIS)

Marinova, Galia

2002-01-01

The paper considers the state-of-the art in electromagnetic compatibility (EMC) oriented printed circuit board (PCB) design. A general methodology of EMC oriented PCB design is synthesized. The main CAD tools available today are estimated and compared for their abilities to treat EMC oriented design. To help non experts a knowledge-base containing more than 50 basic rules for EMC-oriented PCB design is proposed. It can be applied in the PCB design CAD tools that possess rule-builders or it can help interactive design. Trends in this area of EMC-oriented PCB design are deduced. (Author)

Meeting of the ITER CTA Project Board

International Nuclear Information System (INIS)

Vlasenkov, V.

2001-01-01

The meeting of the ITER CTA Project Board took place in Toronto, Canada on 7 November 2001, on the occasion of the first Negotiations Meeting. Twelve participants, representing PB members and experts from Canada, the EU, Japan, the RF and the international Team (IT), attended the meeting chaired by Acad. E. Velikhov. Discussions on the preliminary work programme for the CTA and organizational arrangements for the IT and PT took most of the time of the meeting. The Project Board approved the preliminary work programme as presented by the IT leader

Large Area Projection Microstereolithography: Characterization and Optimization of 3D Printing Parameters

Energy Technology Data Exchange (ETDEWEB)

Ng, Melissa R. [Ohlone College, Fremont, CA (United States); Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Moran, Bryan [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Bekker, Logan [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Dudukovic, Nikola [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

2016-08-12

Large Area Projection Microstereolithography (LAPμSL) is a new technology that allows the additive manufacture of parts that have feature sizes spanning from centimeters to tens of microns. Knowing the accuracy of builds from a system like this is a crucial step in development. This project explored the capabilities of the second and newest LAPμSL system that was built by comparing the features of actual builds to the desired structures. The system was then characterized in order to achieve the best results. The photo polymeric resins that were used were Autodesk PR48 and HDDA. Build parameters for Autodesk PR48 were found that allowed the prints to progress while using the full capacity of the system to print quality parts in a relatively short amount of time. One of the larger prints in particular had a print time that was nearly eighteen times faster than it would have been had printed in the first LAPμSL system. The characterization of HDDA resin helped the understanding that the flux of the light projected into the resin also affected the quality of the builds, rather than just the dose of light given. Future work for this project includes exploring the use of other resins in the LAPμSL systems, exploring the use of Raman Spectroscopy to analyze builds, and completing the characterization of the LAPμSL system.

Final ITER CTA project board meeting

International Nuclear Information System (INIS)

Vlasenkov, V.

2003-01-01

The final ITER CTA Project Board Meeting (PB) took place in Barcelona, Spain on 8 December 2002. The PB took notes of the comments concerning the status of the International Team and the Participants Teams, including Dr. Aymar's report 'From ITER to a FUSION Power Reactor' and the assessment of the ITER project cost estimate

Modelling the transient analysis of flat miniature heat pipes in printed circuit boards using a control volume approacht

NARCIS (Netherlands)

Wits, W.W.; Kok, J.B.W.; van Steenhoven, A.A.; van der Meer, T.H.; Stoffels, G.G.M.

2008-01-01

The heat pipe is a two-phase cooling solution, offering very high thermal coefficients, for heat transport. Therefore, it is increasingly used in the design of electronic products. Flat miniature heat pipes are able to effectively remove heat from several hot spots on a Printed Circuit Board (PCB).

Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor.

Science.gov (United States)

Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S K; McKay, Gordon

2015-01-01

Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced. Copyright © 2014 Elsevier Ltd. All rights reserved.

Analysis of the treatment of plastic from electrical and electronic waste in the Republic of Serbia and the testing of the recycling potential of non-metallic fractions of printed circuit boards

Directory of Open Access Journals (Sweden)

Vučinić Aleksandra S.

2017-01-01

Full Text Available This paper presents the analysis of the quantity of plastic and waste printed circuit boards obtained after the mechanical treatment of electrical and electronic waste (E-waste in the Republic of Serbia, as well as the recycling of non-metallic fractions of waste printed circuit boards. The aim is to analyze the obtained recycled material and recommendation for possible application of recyclables. The data on the quantities and treatment of plastics and printed circuit boards obtained after the mechanical treatment of WEEE, were gained through questionnaires sent to the operators who treat this type of waste. The results of the questionnaire analysis showed that in 2014 the dismantling of E-waste isolated 1,870.95 t of plastic and 499.85 t of printed circuit boards. In the Republic of Serbia, E-waste recycling is performed exclusively by using mechanical methods. Mechanical methods consist of primary crushing and separation of the materials which have a utility value as secondary raw materials, from the components and materials that have hazardous properties. Respect to that, the recycling of printed circuit boards using some of the metallurgical processes with the aim of extracting copper, precious metals and non-metallic fraction is completely absent, and the circuit boards are exported as a whole. Given the number of printed circuit boards obtained by E-waste dismantling, and the fact that from an economic point of view, hydrometallurgical methods are very suitable technological solutions in the case of a smaller capacity, there is a possibility for establishing the facilities in the Republic of Serbia for the hydrometallurgical treatment that could be used for metals extraction, and non-metallic fractions, which also have their own value. Printed circuit boards granulate obtained after the mechanical pretreatment and the selective removal of metals by hydrometallurgical processes was used for the testing of the recycling potential

Treatment of Wastewater from Electroplating, Metal Finishing and Printed Circuit Board Manufacturing. Operation of Wastewater Treatment Plants Volume 4.

Science.gov (United States)

California State Univ., Sacramento. Dept. of Civil Engineering.

One of four manuals dealing with the operation of wastewater plants, this document was designed to address the treatment of wastewater from electroplating, metal finishing, and printed circuit board manufacturing. It emphasizes how to operate and maintain facilities which neutralize acidic and basic waters; treat waters containing metals; destroy…

Packaging Printing Today

Directory of Open Access Journals (Sweden)

Stanislav Bolanča

2015-12-01

Full Text Available Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. The possibilities of particular printing techniques for optimal production of the determined packaging were studied in the paper. The problem was viewed from the technological and economical aspect. The possible printing quality and the time necessary for the printing realization were taken as key parameters. An important segment of the production and the way of life is alocation value and it had also found its place in this paper. The events in the field of packaging printing in the whole world were analyzed. The trends of technique developments and the printing technology for packaging printing in near future were also discussed.

Simultaneous detection of lactate and glucose by integrated printed circuit board based array sensing chip

Energy Technology Data Exchange (ETDEWEB)

Li, Xuelian [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China); School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715 (China); Zang, Jianfeng [Department of Mechanical Engineering and Materials Science, Duke University, Durham, NC 27708 (United States); Liu, Yingshuai; Lu, Zhisong [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China); Li, Qing, E-mail: Qli@swu.edu.cn [School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715 (China); Li, Chang Ming, E-mail: ecmli@swu.edu.cn [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China)

2013-04-10

Highlights: ► An integrated printed circuit board (PCB) based array sensing chip was developed. ► Simultaneous detection of lactate and glucose in serum has been demonstrated. ► The array electronic biochip has high signal to noise ratio and high sensitivity. ► Additional electrodes were designed on the chip to correct interferences. -- Abstract: An integrated printed circuit board (PCB) based array sensing chip was developed to simultaneously detect lactate and glucose in mouse serum. The novelty of the chip relies on a concept demonstration of inexpensive high-throughput electronic biochip, a chip design for high signal to noise ratio and high sensitivity by construction of positively charged chitosan/redox polymer Polyvinylimidazole-Os (PVI-Os)/carbon nanotube (CNT) composite sensing platform, in which the positively charged chitosan/PVI-Os is mediator and electrostatically immobilizes the negatively charged enzyme, while CNTs function as an essential cross-linker to network PVI-Os and chitosan due to its negative charged nature. Additional electrodes on the chip with the same sensing layer but without enzymes were prepared to correct the interferences for high specificity. Low detection limits of 0.6 μM and 5 μM were achieved for lactate and glucose, respectively. This work could be extended to inexpensive array sensing chips with high sensitivity, good specificity and high reproducibility for various sensor applications.

SOURCES OF COPPER IONS AND SELECTED METHODS OF THEIR REMOVAL FROM WASTEWATER FROM THE PRINTED CIRCUITS BOARD PRODUCTION

Directory of Open Access Journals (Sweden)

Maciej Thomas

2014-10-01

Full Text Available This paper presents the issues related to the presence and removal of copper compounds from industrial effluents with including wastewater from plants involved in the production of printed circuit boards. Characterized the toxicological properties of selected copper compounds, described the applicable technological processes, sources of copper ions in the effluents and selected methods for their removal.

Soft-Matter Printed Circuit Board with UV Laser Micropatterning.

Science.gov (United States)

Lu, Tong; Markvicka, Eric J; Jin, Yichu; Majidi, Carmel

2017-07-05

When encapsulated in elastomer, micropatterned traces of Ga-based liquid metal (LM) can function as elastically deformable circuit wiring that provides mechanically robust electrical connectivity between solid-state elements (e.g., transistors, processors, and sensor nodes). However, LM-microelectronics integration is currently limited by challenges in rapid fabrication of LM circuits and the creation of vias between circuit terminals and the I/O pins of packaged electronics. In this study, we address both with a unique layup for soft-matter electronics in which traces of liquid-phase Ga-In eutectic (EGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically aligned columns of EGaIn-coated Ag-Fe 2 O 3 microparticles that are embedded within an interfacial elastomer layer. The processing technique is compatible with conventional UVLM printed circuit board (PCB) prototyping and exploits the photophysical ablation of EGaIn on an elastomer substrate. Potential applications to wearable computing and biosensing are demonstrated with functional implementations in which soft-matter PCBs are populated with surface-mounted microelectronics.

Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader

Directory of Open Access Journals (Sweden)

Monier-Vinard Eric

2016-01-01

Full Text Available In order to help the electronic designer to early determine the limits of the power dissipation of electronic component, an analytical model was established to allow a fast insight of relevant design parameters of a multi-layered electronic board constitution. The proposed steady-state approach based on Fourier series method promotes a practical solution to quickly investigate the potential gain of multi-layered thermal via clusters. Generally, it has been shown a good agreement between the results obtained by the proposed analytical model and those given by electronics cooling software widely used in industry. Some results highlight the fact that the conventional practices for Printed Circuit Board modeling can be dramatically underestimate source temperatures, in particular with smaller sources. Moreover, the analytic solution could be applied to optimize the heat spreading in the board structure with a local modification of the effective thermal conductivity layers.

Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

DEFF Research Database (Denmark)

Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

2014-01-01

Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

Recovery of high purity precious metals from printed circuit boards

International Nuclear Information System (INIS)

Park, Young Jun; Fray, Derek J.

2009-01-01

Waste printed circuit boards (WPCB) have an inherent value because of the precious metal content. For an effective recycling of WPCB, it is essential to recover the precious metals. This paper reports a promising method to recover the precious metals. Aqua regia was used as a leachant and the ratio between metals and leachant was fixed at 1/20 (g/ml). Silver is relatively stable so the amount of about 98 wt.% of the input was recovered without an additional treatment. Palladium formed a red precipitate during dissolution, which were consisted of Pd(NH 4 ) 2 Cl 6 . The amount precipitated was 93 wt.% of the input palladium. A liquid-liquid extraction with toluene was used to extract gold selectively. Also, dodecanethiol and sodium borohydride solution were added to make gold nanoparticles. Gold of about 97 wt.% of the input was recovered as nanoparticles which was identified with a high-resolution transmission electron microscopy through selected area electron diffraction and nearest-neighbor lattice spacing.

Packaging printed circuit boards: A production application of interactive graphics

Science.gov (United States)

Perrill, W. A.

1975-01-01

The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

Color management: printing processes - opportunities and limitations

Science.gov (United States)

Ingram, Samuel T.

2002-06-01

Digital tools have impacted traditional methods employed to reproduce color images during the past decade. The shift from a purely photomechanical process in color reproduction to colorimetric reproduction offers tremendous opportunity in the graphic arts industry. But good things do not necessarily come to all in the same package. Printing processes possess different reproduction attributes: tone reproduction, gray balance and color correction requirements are as different as the ingredient sets selected for color reproduction. This paper will provide insight toward understanding advantages and limitations offered by the new digital technologies in printing, publishing and packaging. For the past five years the Clemson University Graphic Communications Department has conducted numerous color projects using the new digital colorimetric tools during the previous decade. Several approaches have been used including experimental research and typical production workflows. The use of colorimetric data in color reproduction has given an opportunity to realize real gains in color use, predictability and consistency. Meeting an image's separation and reproduction requirements for a specified printing process can involve disruption of the anticipated workflow. Understanding the printing process requirements and the fit within the specifications of a colorimetric workflow are critical to the successful adoption of a color managed workflow. The paper will also provide an insight into the issues and challenges experienced with a color managed workflow. The printing processes used include offset litho, narrow and wide-web flexography (paper, liner board, corrugated and film), screen printing (paper board and polycarbonates), and digital imaging with toner, ink and inkjet systems. A proposal for technology integration will be the focus of the presentation drawn from documented experiences in over 300 applications of color management tools. Discussion will include the structure of

Evaluation of gold and silver leaching from printed circuit board of cellphones

Energy Technology Data Exchange (ETDEWEB)

Petter, P.M.H., E-mail: patymhp@yahoo.com.br; Veit, H.M.; Bernardes, A.M.

2014-02-15

Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na{sub 2}S{sub 2}O{sub 3} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO{sub 3}were made. The leaching of Au and Ag with alternative reagents: Na{sub 2}S{sub 2}O{sub 3,} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} in 0.1 M concentration with the addition of CuSO{sub 4}, NH{sub 4}OH, and H{sub 2}O{sub 2}, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO{sub 4} was added.

Evaluation of gold and silver leaching from printed circuit board of cellphones

International Nuclear Information System (INIS)

Petter, P.M.H.; Veit, H.M.; Bernardes, A.M.

2014-01-01

Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na 2 S 2 O 3 and (NH 4 ) 2 S 2 O 3 to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO 3 were made. The leaching of Au and Ag with alternative reagents: Na 2 S 2 O 3, and (NH 4 ) 2 S 2 O 3 in 0.1 M concentration with the addition of CuSO 4 , NH 4 OH, and H 2 O 2 , was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO 4 was added

New technology for recovering residual metals from nonmetallic fractions of waste printed circuit boards.

Science.gov (United States)

Zhang, Guangwen; He, Yaqun; Wang, Haifeng; Zhang, Tao; Wang, Shuai; Yang, Xing; Xia, Wencheng

2017-06-01

Recycling of waste printed circuit boards is important for environmental protection and sustainable resource utilization. Corona electrostatic separation has been widely used to recycle metals from waste printed circuit boards, but it has poor separation efficiency for finer sized fractions. In this study, a new process of vibrated gas-solid fluidized bed was used to recycle residual metals from nonmetallic fractions, which were treated using the corona electrostatic separation technology. The effects of three main parameters, i.e., vibration frequency, superficial air flow velocity, and fluidizing time on gravity segregation, were investigated using a vibrating gas-solid fluidized bed. Each size fraction had its own optimum parameters. Corresponding to their optimal segregation performance, the products from each experiment were analyzed using an X-ray fluorescence (XRF) and a scanning electron microscope (SEM) equipped with an energy dispersive spectrometer (EDS). From the results, it can be seen that the metal recoveries of -1+0.5mm, -0.5+0.25mm, and -0.25mm size fractions were 86.39%, 82.22% and 76.63%, respectively. After separation, each metal content in the -1+0.5 or -0.5+0.25mm size fraction reduced to 1% or less, while the Fe and Cu contents are up to 2.57% and 1.50%, respectively, in the -0.25mm size fraction. Images of the nonmetallic fractions with a size of -0.25mm indicated that a considerable amount of clavate glass fibers existed in these nonmetallic fractions, which may explain why fine particles had the poorest segregation performance. Copyright © 2017 Elsevier Ltd. All rights reserved.

Application to printed resistors

International Nuclear Information System (INIS)

Hachiyanagi, Yoshimi; Uraki, Hisatsugu; Sawamura, Masashi

1989-01-01

Most of printed circuit boards are made at present by etching copper foils which are laminated on insulating composite boards of paper/phenol resin or glass nonwoven fabric/epoxy rein. This is called subtractive process, and since this is a wet process, the problem of coping with the pollution due to etching solution, plating solution and others is involved. As the method of solving this problem, attention has been paid to the dry process which forms conductor patterns by screen printing using electro-conductive paste. For such resin substrates, generally polymer thick films (PTF) using thermosetting resin as the binder are used. Also the research on the formation of resistors, condensers and other parts by printing using the technology of cermet thick films (CTF) and PTF is active, and it is partially put in practical use. The problems are the deformation and deterioration of substrates, therefore, as the countermeasures, electron beam hardening type PTF has been studied, and various pastes have been developed. In this paper, electron beam hardening type printed resistors are reported. The features, resistance paste, and a number of the experiments on printed resistors are described. (K.I.)

Fermilab Friends for Science Education | Board of Directors

Science.gov (United States)

Fermilab Friends for Science Education FFSE Home About Us Join Us Support Us Contact Us Board of Directors Board Tools Calendar Join Us Donate Now Get FermiGear! Education Office Search Programs Calendar , Chicago, IL Join Us/Renew Membership Forms: Online - Print Support Us Donation Forms: Online - Print Tree

Removing lead from metallic mixture of waste printed circuit boards by vacuum distillation: factorial design and removal mechanism.

Science.gov (United States)

Li, Xingang; Gao, Yujie; Ding, Hui

2013-10-01

The lead removal from the metallic mixture of waste printed circuit boards by vacuum distillation was optimized using experimental design, and a mathematical model was established to elucidate the removal mechanism. The variables studied in lead evaporation consisted of the chamber pressure, heating temperature, heating time, particle size and initial mass. The low-level chamber pressure was fixed at 0.1 Pa as the operation pressure. The application of two-level factorial design generated a first-order polynomial that agreed well with the data for evaporation efficiency of lead. The heating temperature and heating time exhibited significant effects on the efficiency, which was validated by means of the copper-lead mixture experiments. The optimized operating conditions within the region studied were the chamber pressure of 0.1 Pa, heating temperature of 1023 K and heating time of 120 min. After the conditions were employed to remove lead from the metallic mixture of waste printed circuit boards, the efficiency was 99.97%. The mechanism of the effects was elucidated by mathematical modeling that deals with evaporation, mass transfer and condensation, and can be applied to a wider range of metal removal by vacuum distillation. Copyright © 2013 Elsevier Ltd. All rights reserved.

(Q)SAR tools for priority setting: A case study with printed paper and board food contact material substances.

Science.gov (United States)

Van Bossuyt, Melissa; Van Hoeck, Els; Raitano, Giuseppa; Manganelli, Serena; Braeken, Els; Ates, Gamze; Vanhaecke, Tamara; Van Miert, Sabine; Benfenati, Emilio; Mertens, Birgit; Rogiers, Vera

2017-04-01

Over the last years, more stringent safety requirements for an increasing number of chemicals across many regulatory fields (e.g. industrial chemicals, pharmaceuticals, food, cosmetics, …) have triggered the need for an efficient screening strategy to prioritize the substances of highest concern. In this context, alternative methods such as in silico (i.e. computational) techniques gain more and more importance. In the current study, a new prioritization strategy for identifying potentially mutagenic substances was developed based on the combination of multiple (quantitative) structure-activity relationship ((Q)SAR) tools. Non-evaluated substances used in printed paper and board food contact materials (FCM) were selected for a case study. By applying our strategy, 106 out of the 1723 substances were assigned 'high priority' as they were predicted mutagenic by 4 different (Q)SAR models. Information provided within the models allowed to identify 53 substances for which Ames mutagenicity prediction already has in vitro Ames test results. For further prioritization, additional support could be obtained by applying local i.e. specific models, as demonstrated here for aromatic azo compounds, typically found in printed paper and board FCM. The strategy developed here can easily be applied to other groups of chemicals facing the same need for priority ranking. Copyright © 2017 Elsevier Ltd. All rights reserved.

Printing and Publishing Industry Training Board

Science.gov (United States)

Industrial Training International, 1974

1974-01-01

Accounted is the supervisory training program currently in operation in the printing and publishing industry. The purpose of the training program is to increase managerial efficiency and to better prepare new supervisors. (DS)

Exhaust constituent emission factors of printed circuit board pyrolysis processes and its exhaust control

Energy Technology Data Exchange (ETDEWEB)

Chiang, Hung-Lung, E-mail: hlchiang@mail.cmu.edu.tw [Department of Health Risk Management, China Medical University, Taichung, Taiwan (China); Lin, Kuo-Hsiung [Department of Environmental Engineering and Science, Fooyin University, Kaohsiung, Taiwan (China)

2014-01-15

Highlights: • Recycling of waste printed circuit boards is an important issue. • Pyrolysis is an emerging technology for PCB treatment. • Emission factors of VOCs are determined for PCB pyrolysis exhaust. • Iron-Al{sub 2}O{sub 3} catalyst was employed for the exhaust control. -- Abstract: The printed circuit board (PCB) is an important part of electrical and electronic equipment, and its disposal and the recovery of useful materials from waste PCBs (WPCBs) are key issues for waste electrical and electronic equipment. Waste PCB compositions and their pyrolysis characteristics were analyzed in this study. In addition, the volatile organic compound (VOC) exhaust was controlled by an iron-impregnated alumina oxide catalyst. Results indicated that carbon and oxygen were the dominant components (hundreds mg/g) of the raw materials, and other elements such as nitrogen, bromine, and copper were several decades mg/g. Exhaust constituents of CO, H{sub 2}, CH{sub 4}, CO{sub 2}, and NOx, were 60–115, 0.4–4.0, 1.1–10, 30–95, and 0–0.7 mg/g, corresponding to temperatures ranging from 200 to 500 °C. When the pyrolysis temperature was lower than 300 °C, aromatics and paraffins were the major species, contributing 90% of ozone precursor VOCs, and an increase in the pyrolysis temperature corresponded to a decrease in the fraction of aromatic emission factors. Methanol, ethylacetate, acetone, dichloromethane, tetrachloromethane and acrylonitrile were the main species of oxygenated and chlorinated VOCs. The emission factors of some brominated compounds, i.e., bromoform, bromophenol, and dibromophenol, were higher at temperatures over 400 °C. When VOC exhaust was flowed through the bed of Fe-impregnated Al{sub 2}O{sub 3}, the emission of ozone precursor VOCs could be reduced by 70–80%.

Field analysis and enhancement of multi-pole magnetic components fabricated on printed circuit board

International Nuclear Information System (INIS)

Chiu, K.-C.; Chen, C.-S.

2007-01-01

A multi-pole magnetic component magnetized with a fine magnetic pole pitch of less than 1 mm is very difficult to achieve by using traditional methods. Moreover, it requires a precise mechanical process and a complicated magnetization system. Different fine magnetic pole pitches of 300, 350 and 400 μm have been accomplished on 9-pole magnetic components through the printed circuit board (PCB) manufacturing technology. Additionally, another fine magnetic pole pitch of 500 μm was also fabricated on a dual-layered (DL) wire circuit structure to investigate the field enhancement. After measurements, a gain factor of 1.37 was obtained in the field strength. The field variations among different magnetic pole pitches were analyzed in this paper

PHYSICAL CHEMISTRY CHARACTERIZATION OF PRINTED CIRCUIT BOARD OF MOBILE PHONES

Directory of Open Access Journals (Sweden)

Hellington Bastos da Silva de Sant’ana

2015-07-01

Full Text Available Nowadays, electronics industry is the leading sector in developing new technologies. These new technologies lead to cheaper products increasing the consumption. The lifetime of such products is relatively short and soon it becomes waste, known as electronic waste. Cell phone is a common electronic waste. This waste represents an interesting raw material, because it contains large amount of base metals, considerable amount of valuable metals and also those dangerous. In this work, the electronic waste was submitted to mechanical processing: initially the devices were separated into two categories, as year of release (2002 and disassembled manually. The printed circuit boards were milled below 1 mm and then submitted to density and magnetic separation processes. The fractions obtained during the mechanical processing were characterized by chemical analysis. Using mechanical processing it was possible to obtain metal fractions of 80 wt%. A leaching test was carried out to determine if a waste needs to be managed as a hazardous; so that, cell phone waste must be considered in the category of hazardous residue because the lead concentration was above the limit established by Brazilian Standards

Computational algorithms for analysis of data from thin-film thermoresistors on a radio-electronic printed circuit board

International Nuclear Information System (INIS)

Korneeva, Anna; Shaydurov, Vladimir

2016-01-01

In the paper, the data analysis is considered for thin-film thermoresistors coated on to a radio-electronic printed circuit board to determine possible zones of its overheating. A mathematical model consists in an underdetermined system of linear algebraic equations with an infinite set of solutions. For computing a more real solution, two additional conditions are used: the smoothness of a solution and the positiveness of an increase of temperature during overheating. Computational experiments demonstrate that an overheating zone is determined exactly with a tolerable accuracy of temperature in it.

Effects of mould on electrochemical migration behaviour of immersion silver finished printed circuit board.

Science.gov (United States)

Yi, Pan; Xiao, Kui; Dong, Chaofang; Zou, Shiwen; Li, Xiaogang

2018-02-01

The role played by mould in the electrochemical migration (ECM) behaviour of an immersion silver finished printed circuit board (PCB-ImAg) under a direct current (DC) bias was investigated. An interesting phenomenon is found whereby mould, especially Aspergillus niger, can preferentially grow well on PCB-ImAg under electrical bias and then bridge integrated circuits and form a migration path. The cooperation of the mould and DC bias aggravates the ECM process occurring on PCB-ImAg. When the bias voltage is below 15V, ECM almost does not occur for Ag coating. Mechanisms that explain the ECM processes of PCB-ImAg in the presence of mould and DC bias are proposed. Copyright © 2017. Published by Elsevier B.V.

Meeting of the ITER CTA Project Board

International Nuclear Information System (INIS)

2001-01-01

Full text: A preparatory meeting of the Co-ordinated Technical Activities (CTA) Project Board took place in Vienna on 16 July 2001. The Board Members of Canada, EU, Japan, RF and of the CTA International Team participated in the Meeting, which was chaired by Acad. E. Velikhov. The major item on the Meeting Agenda was the discussion of the scope of the CTA. In this discussion the following comments were expressed: One of the prime objectives during the CTA is to develop technical specifications for procurement of critical items (magnets, vacuum vessel, and buildings). It was noted that the discussions with potential suppliers should confirm manufacturing processes in details in order to explore possible schedule reduction strategies. Safety analysis and licensing preparation should proceed on all proposed sites up to the preferred site designation, to ensure the overall implementation schedule is minimized and to resolve major technical issues needed for licensing. Several R and D issues remain to be further developed during the CTA. Special attention should be given by the Participants to two areas: Diagnostics; Heating and Current Drive Systems. Arrangements for continuation of the ITER Physics Expert Groups activities should be provided. To this end a new framework, called International Tokamak Physics Activity, is being planned. The Board encouraged the Participants' Representatives in the Co-ordinating committee of this activity to support the preparation for urgent Topical Group Meetings. The Board agreed that the Design Authority will be invested in the International Team and that proposals for site specific design changes should be agreed upon by the International Team Leader before being studied in detail. The Meeting agreed on some arrangements which will remain from the EDA, namely the ITER EDA Council Office in Moscow as Office of the PB Chair, and the ITER Office located at the IAEA in Vienna as agreed by the IAEA. The Board recommended that effective

Waste printed circuit board recycling techniques and product utilization

International Nuclear Information System (INIS)

Hadi, Pejman; Xu, Meng; Lin, Carol S.K.; Hui, Chi-Wai; McKay, Gordon

2015-01-01

Highlights: • There is a major environmental issue about the printed circuit boards throughout the world. • Different physical and chemical recycling techniques have been reviewed. • Nonmetallic fraction of PCBs is the unwanted face of this waste stream. • Several applications of the nonmetallic fraction of waste PCBs have been introduced. - Abstract: E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly “recycling” has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined

Waste printed circuit board recycling techniques and product utilization

Energy Technology Data Exchange (ETDEWEB)

Hadi, Pejman; Xu, Meng [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Lin, Carol S.K. [School of Energy and Environment, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong Special Administrative Region (Hong Kong); Hui, Chi-Wai [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); McKay, Gordon, E-mail: kemckayg@ust.hk [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Division of Sustainable Development, College of Science, Engineering and Technology, Hamad Bin Khalifa University, Qatar Foundation, Doha (Qatar)

2015-02-11

Highlights: • There is a major environmental issue about the printed circuit boards throughout the world. • Different physical and chemical recycling techniques have been reviewed. • Nonmetallic fraction of PCBs is the unwanted face of this waste stream. • Several applications of the nonmetallic fraction of waste PCBs have been introduced. - Abstract: E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly “recycling” has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined.

Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

International Nuclear Information System (INIS)

Ortuño, Nuria; Conesa, Juan A.; Moltó, Julia; Font, Rafael

2014-01-01

The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO 2005 -TEQ/kg sample, corresponding to the sample with and without metals, respectively. - Highlights: • Thermal decomposition of printed circuit boards (with and without metals) is studied. • Important differences were found at the different experimental conditions. • Emission of brominated pollutants is much higher than that of chlorinated. • Metal enhances emission of halogenated compounds. • An increase in the temperature produces the destruction of pollutants

Final report to the Atomic Energy Control Board on project management capabilities using NAOP as a case study

International Nuclear Information System (INIS)

Masters, P.

1998-01-01

The purpose of this report is to identify practices of the Atomic Energy Control Board that support or detract from the implementation of collaborative cross-functional project management and to recommend ways and means of increasing the Board's ability to respond to projects. Ontario Hydro's Nuclear Asset Optimization Program (NAOP) and the Board's response to that program form the basis of a case study for the purposes of this report. Issues examined include: Whether the Board follows a logical project management framework when it addresses projects such as the NAOP; where the Board exhibits good practices in addressing project such as the NAOP; and where the Board needs to develop better practices

Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: a case study of electronic component factory

Directory of Open Access Journals (Sweden)

Sakulkaew Srisang

2014-09-01

Full Text Available The objective of this research is a reduction of an adhesive stain defect in flexible printed circuit board in hot pressing process, the electronic factory. The manufacturing have been processing by sheet type of products with ninety-six pieces of flexible printed circuit boards. Causes of the problem include the before and internal hot pressing process. In process beginning times, the most right row of products between the cooling plate and the hot pressing machine has temperature 71.2◦C that is higher than glass transition temperature (Tg 60◦C. Those products’ temperature lead to evaporate a polyimide adhesive before hot pressing process beginning. The internal hot pressing process include the preheat times and the pressure time. In the preheat time the problem is a gap between lower and upper plate, was under specification(Under 1 mm and leaded to adhesive polyimide stain. In the actuality this time requires temperature and low pressure that mean a gap within 1 – 2 mm (between lower and upper plate. In pressure times the hot pressing plate surface is not flat and products are pressed by insufficient force that it lead to generate an adhesive stain on flexible printed circuit boards. That force is measured by the pre-scale paper and a result, RGB color, is provided. And then color density (From standard color sample and RGB color (From pre-scale paper is found out the relation by Photoshop program and multiple regression theory using. The formula is applied to compare with defect so as to find out the suitable color density (Defects reducing. The solving solutions is provided including the gap reduced adjustment between cooling plate and hot pressing machine before hot pressing process, the plate adjustment within specification in the preheat time and the pressing plate polishing in the pressure time. Results of study and solving are provide defect reduction from 24.4 percentage to 7.2 percentage of total study product.

Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: A case study of electronic component factory

Directory of Open Access Journals (Sweden)

Sakulkaew Srisang

2015-03-01

Full Text Available The objective of this research is a reduction of an adhesive stain defect in flexible printed circuit board in hot pressing process, the electronic factory. The manufacturing have been processing by sheet type of products with ninety-six pieces of flexible printed circuit boards. Causes of the problem include the before and internal hot pressing process. In process beginning times, the most right row of products between the cooling plate and the hot pressing machine has temperature 71.2◦C that is higher than glass transition temperature (Tg 60◦C. Those products’ temperature lead to evaporate a polyimide adhesive before hot pressing process beginning. The internal hot pressing process include the preheat times and the pressure time. In the preheat time the problem is a gap between lower and upper plate, was under specification (Under 1 mm and leaded to adhesive polyimide stain. In the actuality this time requires temperature and low pressure that mean a gap within 1 – 2 mm (between lower and upper plate. In pressure times the hot pressing plate surface is not flat and products are pressed by insufficient force that it lead to generate an adhesive stain on flexible printed circuit boards. That force is measured by the pre-scale paper and a result, RGB color, is provided. And then color density (From standard color sample and RGB color (From pre-scale paper is found out the relation by Photoshop program and multiple regression theory using. The formula is applied to compare with defect so as to find out the suitable color density (Defects reducing. The solving solutions is provided including the gap reduced adjustment between cooling plate and hot pressing machine before hot pressing process, the plate adjustment within specification in the preheat time and the pressing plate polishing in the pressure time. Results of study and solving are provide defect reduction from 24.4 percentage to 7.2 percentage of total study product.

Digital Textile Printing

OpenAIRE

Moltchanova, Julia

2011-01-01

Rapidly evolving technology of digital printing opens new opportunities on many markets. One of them is the printed fabric market where printing companies as well as clients benefit from new printing methods. This thesis focuses on the digital textile printing technology and its implementation for fabric-on-demand printing service in Finland. The purpose of this project was to study the technology behind digital textile printing, areas of application of this technology, the requirements ...

Sustainability issues in circuit board recycling

DEFF Research Database (Denmark)

Legarth, Jens Brøbech; Alting, Leo; Baldo, Gian Luca

1995-01-01

The resource recovery and environmental impact issues of printed circuit board recycling by secondary copper smelters are discussed. Guidelines concerning material selection for circuit board manufacture and concerning the recycling processes are given to enhance recovery efficiency and to lower...

Fermilab Friends for Science Education | Board Tools

Science.gov (United States)

Fermilab Friends for Science Education FFSE Home About Us Join Us Support Us Contact Us Board Tools Testimonials Our Donors Board of Directors Board Tools Calendar Join Us Donate Now Get FermiGear! Education FFSE Scholarship Tools Google Drive Join Us/Renew Membership Forms: Online - Print Support Us Donation

Projecting the impact of a broadband communication infrastructure on printing, publishing and advertising

Science.gov (United States)

Smith, Ted

1994-11-01

A broadband communication infrastructure (over 150 megabits per second), deployed almost everywhere outside the third world within 20 years, is a common planning assumption of governments, communication carriers, and information providers. The "structure" of this infrastructure has been variously projected as being that of the telephone network, the cable system, or the Internet. An argument is made that the telephone model, with features borrowed from the other two, will prevail. This model is used to project broad features of printing, publishing, and advertising. In support of this projection, printing is modeled purposefully, a document is printed to either archive it, give it to someone else, or use it (read, mark up, take along, etc.). In the broadband future, only the last is sustainable. Publishing is modeled as a four-stage chain of commerce from creator to buyer. The progress of both the document and its chain of payments is considered today and in the broadband scenario. Finally, advertising today and tomorrow is modeled as a 2x2x2 cube. One dimension contrasts the "notify/inform" and "persuade" aspects of advertising; another contrasts the consumer's role as passive recipient vs. active controller of what s/he hears and sees; the third views the institution of advertising as reflecting or setting societal values.

Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

Energy Technology Data Exchange (ETDEWEB)

Ortuño, Nuria; Conesa, Juan A., E-mail: ja.conesa@ua.es; Moltó, Julia; Font, Rafael

2014-11-15

The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO{sub 2005}-TEQ/kg sample, corresponding to the sample with and without metals, respectively. - Highlights: • Thermal decomposition of printed circuit boards (with and without metals) is studied. • Important differences were found at the different experimental conditions. • Emission of brominated pollutants is much higher than that of chlorinated. • Metal enhances emission of halogenated compounds. • An increase in the temperature produces the destruction of pollutants.

Inkjet printing and adhesion characterisation of conductive tracks on a commercial printed circuit board material

International Nuclear Information System (INIS)

Sridhar, A.; Dijk, D.J. van; Akkerman, R.

2009-01-01

Silver nanoparticle-based conductive tracks were inkjet printed using a piezoelectric drop-on-demand inkjet printer on a commercially available electronics grade fibre glass (E-glass) reinforced substrate material, and the experimental results have been summarised. Ink jetting was done on two variants of this substrate material, viz. etched and unetched, to determine the influence of substrate surface topography on adhesion and accuracy of the printed tracks. The pull-off adhesion test method was used to quantify adhesive strength. The dependence of the pull-off test results on local geometry of the test area are illustrated with the aid of scanning electron microscope images and interferometer studies. Based on the outcomes of the experiments, conclusions concerning the suitable surface topography for inkjet printing have been arrived at.

Printed circuit for ATLAS

CERN Multimedia

Laurent Guiraud

1999-01-01

A printed circuit board made by scientists in the ATLAS collaboration for the transition radiaton tracker (TRT). This will read data produced when a high energy particle crosses the boundary between two materials with different electrical properties.

Integration of microelectronic chips in microfluidic systems on printed circuit board

International Nuclear Information System (INIS)

Burdallo, I; Jimenez-Jorquera, C; Fernández-Sánchez, C; Baldi, A

2012-01-01

A new scheme for the integration of small semiconductor transducer chips with microfluidic structures on printed circuit board (PCB) is presented. The proposed approach is based on a packaging technique that yields a large and flat area with small and shallow (∼44 µm deep) openings over the chips. The photocurable encapsulant material used, based on a diacrylate bisphenol A polymer, enables irreversible bonding of polydimethylsiloxane microfluidic structures at moderate temperatures (80 °C). This integration scheme enables the insertion of transducer chips in microfluidic systems with a lower added volume than previous schemes. Leakage tests have shown that the bonded structures withstand more than 360 kPa of pressure. A prototype microfluidic system with two detection chips, including one inter-digitated electrode (IDE) chip for conductivity and one ion selective field effect transistor (ISFET) chip for pH, has been implemented and characterized. Good electrical insulation of the chip contacts and silicon edge surfaces from the solution in the microchannels has been achieved. This integration procedure opens the door to the low-cost fabrication of complex analytical microsystems that combine the extraordinary potential of both the microfluidics and silicon microtechnology fields. (paper)

Influence Of Used Bacterial Culture On Zinc And Aluminium Bioleaching From Printed Circuit Boards

Directory of Open Access Journals (Sweden)

Mrazikova Anna

2015-06-01

Full Text Available Bioleaching processes were used to solubilize metals (Cu, Ni, Zn and Al from printed circuit boards (PCBs. In this study, a PCBs-adapted pure culture of Acidithiobacillus ferrooxidans, pure culture of Acidithiobacillus thiooxidans and PCBs-adapted mixed culture of A. ferrooxidans and A. thiooxidans were used for recovery of the metals. The study showed that the mixed bacterial culture has the greatest potential to dissolve metals. The maximum metal bioleaching efficiencies were found to be 100, 92, 89 and 20% of Cu, Ni, Zn and Al, respectively. The mixed culture revealed higher bacterial stability. The main factor responsible for high metal recovery was the ability of the mixed culture to maintain the low pH during the whole process. The pure culture of A. thiooxidans had no significant effect on metal bioleaching from PCBs.

Modular integration of electronics and microfluidic systems using flexible printed circuit boards.

Science.gov (United States)

Wu, Amy; Wang, Lisen; Jensen, Erik; Mathies, Richard; Boser, Bernhard

2010-02-21

Microfluidic systems offer an attractive alternative to conventional wet chemical methods with benefits including reduced sample and reagent volumes, shorter reaction times, high-throughput, automation, and low cost. However, most present microfluidic systems rely on external means to analyze reaction products. This substantially adds to the size, complexity, and cost of the overall system. Electronic detection based on sub-millimetre size integrated circuits (ICs) has been demonstrated for a wide range of targets including nucleic and amino acids, but deployment of this technology to date has been limited due to the lack of a flexible process to integrate these chips within microfluidic devices. This paper presents a modular and inexpensive process to integrate ICs with microfluidic systems based on standard printed circuit board (PCB) technology to assemble the independently designed microfluidic and electronic components. The integrated system can accommodate multiple chips of different sizes bonded to glass or PDMS microfluidic systems. Since IC chips and flex PCB manufacturing and assembly are industry standards with low cost, the integrated system is economical for both laboratory and point-of-care settings.

Quantitative Leaching of a Spent Cell Phone Printed Circuit Board by Hydrochloric acid

Directory of Open Access Journals (Sweden)

Alafara A. Baba

2014-07-01

Full Text Available This paper presents a kinetic data on the hydrometallurgical recovery of some metal ions from a printed circuit board (PCB of a spent cell phone by hydrochloric acid leaching. The effects of acid concentration, temperature and particle diameter on the dissolution efficiency at various leaching time intervals were examined. The results of the leaching investigations showed that the powdered cell phone dissolution increases with increasing acid concentration, system temperature with decreasing particle diameter at 360 rpm. With 2M HCl solution, about 88.49% of the sample was dissolved within 120 minutes using 0.075-0.112 mm particle diameter at 800 C. The results of the study indicated that the dissolution reaction could be represented by a shrinking core model with surface chemical reaction. A value of 0.61, 60.67 kJ/mol and 12.9s-1 were calculated as reaction order, activation energy and frequency factor, respectively for the dissolution process.

Estimation of Relative Permittivity of Printed Circuit Board with Fiber Glass Epoxy as Dielectric for UHF Applications

Directory of Open Access Journals (Sweden)

Ronal D. Montoya-Montoya

2013-11-01

Full Text Available This paper presents the results of measuring relative permittivity of fiber glass printed circuit board (PCB’s, using a rectangular resonant cavity. The relative permittivity is presented as function of frequency. To obtain resonant frequencies, the return loss was measured using a network analyzer. Relative permittivity was calculated by finding frequencies of resonant cavity modes. The results are presented in a frequency span of 1 to 3.5GHz. It was clearly shown the nonlinear behavior of the relative permittivity for the dielectric laminate evaluated, even what happens respect to the frequency of the resonant modes below and above to frequency of 2 GHz.

Why 3D Print? The 21st-Century Skills Students Develop While Engaging in 3D Printing Projects

Science.gov (United States)

Trust, Torrey; Maloy, Robert W.

2017-01-01

The emergence of 3D printing has raised hopes and concerns about how it can be used effectively as an educational technology in school classrooms. This paper presents the results of a survey asking teachers from multiple grade levels and subject fields about the impact of 3D projects on student learning. Teachers were asked about the kinds of 3D…

Meeting of the ITER CTA Project Board

International Nuclear Information System (INIS)

Vlasenkov, V.

2002-01-01

The meeting of the ITER CTA Project Board (PB) took place in Toronto, Canada on 16 September 2002 on the occasion of the fifth Negotiations Meeting (N-5). Thirteen participants, PB members and experts from Canada, EU, Japan, RF and the International Team (IT) attended the meeting chaired by Acad. E. Velikhov. PB heard progress reports of the participating parties and the comments concerning the status of participants team (PT) and the IT were presented

Board-to-Board Free-Space Optical Interconnections Passing through Boards for a Bookshelf-Assembled Terabit-Per-Second-Class ATM Switch.

Science.gov (United States)

Hirabayashi, K; Yamamoto, T; Matsuo, S; Hino, S

1998-05-10

We propose free-space optical interconnections for a bookshelf-assembled terabit-per-second-class ATM switch. Thousands of arrayed optical beams, each having a rate of a few gigabits per second, propagate vertically to printed circuit boards, passing through some boards, and are connected to arbitrary transmitters and receivers on boards by polarization controllers and prism arrays. We describe a preliminary experiment using a 1-mm-pitch 2 x 2 beam-collimator array that uses vertical-cavity surface-emitting laser diodes. These optical interconnections can be made quite stable in terms of mechanical shock and temperature fluctuation by the attachment of reinforcing frames to the boards and use of an autoalignment system.

Remote Collaborative 3D Printing - Process Investigation

Science.gov (United States)

2016-04-01

COLLABORATIVE 3D PRINTING - PROCESS INVESTIGATION Cody M. Reese, PE CAD MODEL PRINT MODEL PRINT PREVIEW PRINTED PART AERIAL VIRTUAL This...REMOTE COLLABORATIVE 3D PRINTING - PROCESS INVESTIGATION 5b. GRANT NUMBER 5c. PROGRAM ELEMENT NUMBER 6. AUTHOR(S) 5d. PROJECT NUMBER Cody M. Reese...release; distribution is unlimited. 13. SUPPLEMENTARY NOTES 14. ABSTRACT The Remote Collaborative 3D Printing project is a collaboration between

Thiourea leaching gold and silver from the printed circuit boards of waste mobile phones.

Science.gov (United States)

Jing-ying, Li; Xiu-li, Xu; Wen-quan, Liu

2012-06-01

The present communication deals with the leaching of gold and silver from the printed circuit boards (PCBs) of waste mobile phones using an effective and less hazardous system, i.e., a thiourea leaching process as an alternative to the conventional and toxic cyanide leaching of gold. The influence of particle size, thiourea and Fe(3+) concentrations and temperature on the leaching of gold and silver from waste mobile phones was investigated. Gold extraction was found to be enhanced in a PCBs particle size of 100 mesh with the solutions containing 24 g/L thiourea and Fe(3+) concentration of 0.6% under the room temperature. In this case, about 90% of gold and 50% of silver were leached by the reaction of 2h. The obtained data will be useful for the development of processes for the recycling of gold and silver from the PCBs of waste mobile phones. Copyright © 2012 Elsevier Ltd. All rights reserved.

Environmental Print Activities for Teaching Mathematics and Content Areas.

Science.gov (United States)

Rule, Audrey C., Ed.; McIntyre, Sandra, Ed.; Ranous, Meg, Ed.

Twenty-three mathematics activities that use environmental print materials are presented, along with two activities that focus on music education, one that highlights history concepts, and five science activities. The environmental print materials are words and images cut from food or other product packaging and mounted on mat board cards.…

Effects of 3D Printing Project-based Learning on Preservice Elementary Teachers' Science Attitudes, Science Content Knowledge, and Anxiety About Teaching Science

Science.gov (United States)

Novak, Elena; Wisdom, Sonya

2018-05-01

3D printing technology is a powerful educational tool that can promote integrative STEM education by connecting engineering, technology, and applications of science concepts. Yet, research on the integration of 3D printing technology in formal educational contexts is extremely limited. This study engaged preservice elementary teachers (N = 42) in a 3D Printing Science Project that modeled a science experiment in the elementary classroom on why things float or sink using 3D printed boats. The goal was to explore how collaborative 3D printing inquiry-based learning experiences affected preservice teachers' science teaching self-efficacy beliefs, anxiety toward teaching science, interest in science, perceived competence in K-3 technology and engineering science standards, and science content knowledge. The 3D printing project intervention significantly decreased participants' science teaching anxiety and improved their science teaching efficacy, science interest, and perceived competence in K-3 technological and engineering design science standards. Moreover, an analysis of students' project reflections and boat designs provided an insight into their collaborative 3D modeling design experiences. The study makes a contribution to the scarce body of knowledge on how teacher preparation programs can utilize 3D printing technology as a means of preparing prospective teachers to implement the recently adopted engineering and technology standards in K-12 science education.

PROBABILISTIC INTEREST RATE SETTING WITH A SHADOW BOARD: A DESCRIPTION OF THE PILOT PROJECT

OpenAIRE

TIMO HENCKEL; SHAUN VAHEY; LIZ WAKERLY

2011-01-01

This study aims to assess the scope for monetary policymakers to aggregate probabilistic interest rate advice. The members of a Shadow Board give probabilistic assessments of the appropriate (target) interest rate for Australia in real time. The pilot project will be running each month from August to December (inclusive) 2011, with the Shadow Board giving advice shortly before each decision by the Reserve Bank of Australia (RBA) Board.

Prioritizing material recovery for end-of-life printed circuit boards

International Nuclear Information System (INIS)

Wang Xue; Gaustad, Gabrielle

2012-01-01

Highlights: ► Material recovery driven by composition, choice of ranking, and weighting. ► Economic potential for new recycling technologies quantified for several metrics. ► Indicators developed for materials incurring high eco-toxicity costs. ► Methodology useful for a variety of stakeholders, particularly policy-makers. - Abstract: The increasing growth in generation of electronic waste (e-waste) motivates a variety of waste reduction research. Printed circuit boards (PCBs) are an important sub-set of the overall e-waste stream due to the high value of the materials contained within them and potential toxicity. This work explores several environmental and economic metrics for prioritizing the recovery of materials from end-of-life PCBs. A weighted sum model is used to investigate the trade-offs among economic value, energy saving potentials, and eco-toxicity. Results show that given equal weights for these three sustainability criteria gold has the highest recovery priority, followed by copper, palladium, aluminum, tin, lead, platinum, nickel, zinc, and silver. However, recovery priority will change significantly due to variation in the composition of PCBs, choice of ranking metrics, and weighting factors when scoring multiple metrics. These results can be used by waste management decision-makers to quantify the value and environmental savings potential for recycling technology development and infrastructure. They can also be extended by policy-makers to inform possible penalties for land-filling PCBs or exporting to the informal recycling sector. The importance of weighting factors when examining recovery trade-offs, particularly for policies regarding PCB collection and recycling are explored further.

Printing Values In Interactive ROOT

CERN Document Server

Perovic, Boris

2015-01-01

This project report summarizes the work I have been performing during the past twelve weeks as a Summer Student intern working on ROOT project in the SFT group, PH department, under the supervision of Axel Naumann and Danilo Piparo. One of the widely requested features for ROOT was improved interactive shell experience as well as improved printing of object values. Solving this issue was the goal of this project. Primarily, we have enabled printing of the collections. Secondly, we have unified the printing interface, making it much more robust and extendible. Thirdly, we have implemented printing of nested collections in a flexible and user-friendly manner. Finally, we have added an interactive mode, allowing for paginated output. At the beginning of the report, ROOT is presented with examples of where it is used and how important it is. Then, the motivation behind the project is elaborated, by presenting the previous state of the software package and its potential for improvement. Further, the process in wh...

Separation of the metallic and non-metallic fraction from printed circuit boards employing green technology

Energy Technology Data Exchange (ETDEWEB)

Estrada-Ruiz, R.H., E-mail: rhestrada@itsaltillo.edu.mx; Flores-Campos, R., E-mail: rcampos@itsaltillo.edu.mx; Gámez-Altamirano, H.A., E-mail: hgamez@itsaltillo.edu.mx; Velarde-Sánchez, E.J., E-mail: ejvelarde@itsaltillo.edu.mx

2016-07-05

Highlights: • Small sizes of particles are required in order to separate the different fractions. • Inverse flotation process is an efficient green technology to separate fractions. • Superficial air velocity is the main variable in the inverse flotation process. • Inverse flotation is a green process because the pulṕs pH is 7.0 during the test. - Abstract: The generation of electrical and electronic waste is increasing day by day; recycling is attractive because of the metallic fraction containing these. Nevertheless, conventional techniques are highly polluting. The comminution of the printed circuit boards followed by an inverse flotation process is a clean technique that allows one to separate the metallic fraction from the non-metallic fraction. It was found that particle size and superficial air velocity are the main variables in the separation of the different fractions. In this way an efficient separation is achieved by avoiding the environmental contamination coupled with the possible utilization of the different fractions obtained.

A Novel Designed Bioreactor for Recovering Precious Metals from Waste Printed Circuit Boards

Science.gov (United States)

Jujun, Ruan; Jie, Zheng; Jian, Hu; Zhang, Jianwen

2015-01-01

For recovering precious metals from waste printed circuit boards (PCBs), a novel hybrid technology including physical and biological methods was developed. It consisted of crushing, corona-electrostatic separation, and bioleaching. Bioleaching process is the focus of this paper. A novel bioreactor for bioleaching was designed. Bioleaching was carried out using Pseudomonas chlororaphis. Bioleaching experiments using mixed particles of Au and Cu were performed and leachate contained 0.006 mg/L, 2823 mg/L Au+ and Cu2+ respectively. It showed when Cu existed, the concentrations of Au were extremely small. This provided the feasibility to separate Cu from Au. The method of orthogonal experimental design was employed in the simulation bioleaching experiments. Experimental results showed the optimized parameters for separating Cu from Au particles were pH 7.0, temperature 22.5 °C, and rotation speed 80 r/min. Based on the optimized parameters obtained, the bioreactor was operated for recovering mixed Au and Cu particles. 88.1 wt.% of Cu and 76.6 wt.% of Au were recovered. The paper contributed important information to recover precious metals from waste PCBs. PMID:26316021

Disposing and recycling waste printed circuit boards: disconnecting, resource recovery, and pollution control.

Science.gov (United States)

Wang, Jianbo; Xu, Zhenming

2015-01-20

Over the past decades, China has been suffering from negative environmental impacts from distempered e-waste recycling activities. After a decade of effort, disassembly and raw materials recycling of environmentally friendly e-waste have been realized in specialized companies, in China, and law enforcement for illegal activities of e-waste recycling has also been made more and more strict. So up to now, the e-waste recycling in China should be developed toward more depth and refinement to promote industrial production of e-waste resource recovery. Waste printed circuit boards (WPCBs), which are the most complex, hazardous, and valuable components of e-waste, are selected as one typical example in this article that reviews the status of related regulations and technologies of WPCBs recycling, then optimizes, and integrates the proper approaches in existence, while the bottlenecks in the WPCBs recycling system are analyzed, and some preliminary experiments of pinch technologies are also conducted. Finally, in order to provide directional guidance for future development of WPCBs recycling, some key points in the WPCBs recycling system are proposed to point towards a future trend in the e-waste recycling industry.

Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation.

Science.gov (United States)

Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Arpád; Ilea, Petru

2014-05-30

The present study aims to develop an eco-friendly chemical-electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75kWh/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples. Copyright © 2014 Elsevier B.V. All rights reserved.

Synthesis of carbon nanotubes and porous carbons from printed circuit board waste pyrolysis oil

International Nuclear Information System (INIS)

Quan Cui; Li Aimin; Gao Ningbo

2010-01-01

The possibility and feasibility of using pyrolysis oil from printed circuit board (PCB) waste as a precursor for advanced carbonaceous materials is presented. The PCB waste was first pyrolyzed in a laboratory scale fixed bed reactor at 600 deg. C to prepare pyrolysis oil. The analysis of pyrolysis oil by gas chromatography-mass spectroscopy indicated that it contained a very high proportion of phenol and phenol derivatives. It was then polymerized in formaldehyde solution to synthesize pyrolysis oil-based resin which was used as a precursor to prepare carbon nanotubes (CNTs) and porous carbons. Scanning electron microscopy and transmission microscopy investigation showed that the resulting CNTs had hollow cores with outer diameter of ∼338 nm and wall thickness of ∼86 nm and most of them were filled with metal nanoparticles or nanorods. X-ray diffraction reveals that CNTs have an amorphous structure. Nitrogen adsorption isotherm analysis indicated the prepared porous carbons had a Brunauer-Emmett-Teller surface area of 1214 m 2 /g. The mechanism of the formation of the CNTs and porous carbons was discussed.

Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

International Nuclear Information System (INIS)

Troeger, K.; Darka, R. Khanpour; Neumeyer, T.; Altstaedt, V.

2014-01-01

This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K

Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

Energy Technology Data Exchange (ETDEWEB)

Troeger, K., E-mail: altstaedt@uni-bayreuth.de; Darka, R. Khanpour, E-mail: altstaedt@uni-bayreuth.de; Neumeyer, T., E-mail: altstaedt@uni-bayreuth.de; Altstaedt, V., E-mail: altstaedt@uni-bayreuth.de [Polymer Engineering, University of Bayreuth, Germany and Polymer Engineering, Universitaetsstrasse 30, 95447 Bayreuth (Germany)

2014-05-15

This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K.

Fast copper extraction from printed circuit boards using supercritical carbon dioxide.

Science.gov (United States)

Calgaro, C O; Schlemmer, D F; da Silva, M D C R; Maziero, E V; Tanabe, E H; Bertuol, D A

2015-11-01

Technological development and intensive marketing support the growth in demand for electrical and electronic equipment (EEE), for which printed circuit boards (PCBs) are vital components. As these devices become obsolete after short periods, waste PCBs present a problem and require recycling. PCBs are composed of ceramics, polymers, and metals, particularly Cu, which is present in highest percentages. The aim of this study was to develop an innovative method to recover Cu from the PCBs of old mobile phones, obtaining faster reaction kinetics by means of leaching with supercritical CO2 and co-solvents. The PCBs from waste mobile phones were characterized, and evaluation was made of the reaction kinetics during leaching at atmospheric pressure and using supercritical CO2 with H2O2 and H2SO4 as co-solvents. The results showed that the PCBs contained 34.83 wt% of Cu. It was found that the supercritical extraction was 9 times faster, compared to atmospheric pressure extraction. After 20 min of supercritical leaching, approximately 90% of the Cu contained in the PCB was extracted using a 1:20 solid:liquid ratio and 20% of H2O2 and H2SO4 (2.5 M). These results demonstrate the efficiency of the process. Therefore the supercritical CO2 employment in the PCBs recycling is a promising alternative and the CO2 is environmentally acceptable and reusable. Copyright © 2015 Elsevier Ltd. All rights reserved.

Integrated bioleaching of copper metal from waste printed circuit board-a comprehensive review of approaches and challenges.

Science.gov (United States)

Awasthi, Abhishek Kumar; Zeng, Xianlai; Li, Jinhui

2016-11-01

Waste electrical and electronic equipment (e-waste) is the most rapidly growing waste stream in the world, and the majority of the residues are openly disposed of in developing countries. Waste printed circuit boards (WPCBs) make up the major portion of e-waste, and their informal recycling can cause environmental pollution and health risks. Furthermore, the conventional disposal and recycling techniques-mechanical treatments used to recover valuable metals, including copper-are not sustainable in the long term. Chemical leaching is rapid and efficient but causes secondary pollution. Bioleaching is a promising approach, eco-friendly and economically feasible, but it is slower process. This review considers the recycling potential of microbes and suggests an integrated bioleaching approach for Cu extraction and recovery from WPCBs. The proposed recycling system should be more effective, efficient and both technically and economically feasible.

Study on characteristics of printed circuit board liberation and its crushed products.

Science.gov (United States)

Quan, Cui; Li, Aimin; Gao, Ningbo

2012-11-01

Recycling printed circuit board waste (PCBW) waste is a hot issue of environmental protection and resource recycling. Mechanical and thermo-chemical methods are two traditional recycling processes for PCBW. In the present research, a two-step crushing process combined with a coarse-crushing step and a fine-pulverizing step was adopted, and then the crushed products were classified into seven different fractions with a standard sieve. The liberation situation and particle shape in different size fractions were observed. Properties of different size fractions, such as heating value, thermogravimetric, proximate, ultimate and chemical analysis were determined. The Rosin-Rammler model was applied to analyze the particle size distribution of crushed material. The results indicated that complete liberation of metals from the PCBW was achieved at a size less than 0.59 mm, but the nonmetal particle in the smaller-than-0.15 mm fraction is liable to aggregate. Copper was the most prominent metal in PCBW and mainly enriched in the 0.42-0.25 mm particle size. The Rosin-Rammler equation adequately fit particle size distribution data of crushed PCBW with a correlation coefficient of 0.9810. The results of heating value and proximate analysis revealed that the PCBW had a low heating value and high ash content. The combustion and pyrolysis process of PCBW was different and there was an obvious oxidation peak of Cu in combustion runs.

Influence of nonmetals recycled from waste printed circuit boards on flexural properties and fracture behavior of polypropylene composites

International Nuclear Information System (INIS)

Zheng Yanhong; Shen Zhigang; Cai Chujiang; Ma Shulin; Xing Yushan

2009-01-01

Flexural strength and flexural modulus of the composites can be successfully improved by filling nonmetals recycled from waste printed circuit boards (PCBs) into polypropylene (PP). By using scanning electron microscopy (SEM), the influence of nonmetals on fracture behavior of PP composites is investigated by in situ flexural test. Observation results show that the particles can effectively lead to mass micro cracks instead of the breaking crack. The process of the crack initiation, propagation and fiber breakage dissipate a great amount of energy. As a result, the flexural properties of the composites can be reinforced significantly. Results of the in situ SEM observation and analysis to the dynamic flexural process supply effective test evidence for the reinforcing mechanism of the nonmetals/PP composites on the basis of the energy dissipation theory

Environmental and risk screening for prioritizing pollution prevention opportunities in the U.S. printed wiring board manufacturing industry.

Science.gov (United States)

Lam, Carl W; Lim, Seong-Rin; Schoenung, Julie M

2011-05-15

Modern manufacturing of printed wiring boards (PWBs) involves extensive use of various hazardous chemicals in different manufacturing steps such as board preparation, circuit design transfer, etching and plating processes. Two complementary environmental screening methods developed by the U.S. EPA, namely: (i) the Tool for the Reduction and Assessment of Chemical and Other Environmental Impacts (TRACI) and (ii) Risk-Screening Environmental Indicators (RSEI), are used to quantify geographic and chemical environmental impacts in the U.S. PWB manufacturing industry based on Toxics Release Inventory (TRI) data. Although the release weight percentages of industrial chemicals such as methanol, glycol ethers and dimethylformamide comprise the larger fraction of reported air and water emissions, results indicate that lead, copper and their compounds' releases correspond to the highest environmental impact from toxicity potentials and risk-screening scores. Combining these results with further knowledge of PWB manufacturing, select alternative chemical processes and materials for pollution prevention are discussed. Examples of effective pollution prevention options in the PWB industry include spent etchant recovery technologies, and process and material substitutions. In addition, geographic assessment of environmental burden highlights states where promotion of pollution prevention strategies and emissions regulations can have the greatest effect to curb the PWB industry's toxic release impacts. Copyright © 2011 Elsevier B.V. All rights reserved.

Leaching of metals from large pieces of printed circuit boards using citric acid and hydrogen peroxide.

Science.gov (United States)

Jadhav, Umesh; Su, C; Hocheng, Hong

2016-12-01

In the present study, the leaching of metals from large pieces of computer printed circuit boards (CPCBs) was studied. A combination of citric acid (0.5 M) and 1.76 M hydrogen peroxide (H 2 O 2 ) was used to leach the metals from CPCB piece. The influence of system variables such as H 2 O 2 concentration, concentration of citric acid, shaking speed, and temperature on the metal leaching process was investigated. The complete metal leaching was achieved in 4 h from a 4 × 4 cm CPCB piece. The presence of citric acid and H 2 O 2 together in the leaching solution is essential for complete metal leaching. The optimum addition amount of H 2 O 2 was 5.83 %. The citric acid concentration and shaking speed had an insignificant effect on the leaching of metals. The increase in the temperature above 30 °C showed a drastic effect on metal leaching process.

A wearable tracking device inkjet-printed on textile

KAUST Repository

Krykpayev, Bauyrzhan; Farooqui, Muhammad Fahad; Bilal, Rana Muhammad; Vaseem, Mohammad; Shamim, Atif

2017-01-01

Despite the abundance of localization applications, the tracking devices have never been truly realized in E-textiles. Standard printed circuit board (PCB)-based devices are obtrusive and rigid and hence not suitable for textile based

Two-step bioleaching of copper and gold from discarded printed circuit boards (PCB).

Science.gov (United States)

Işıldar, Arda; van de Vossenberg, Jack; Rene, Eldon R; van Hullebusch, Eric D; Lens, Piet N L

2016-11-01

An effective strategy for environmentally sound biological recovery of copper and gold from discarded printed circuit boards (PCB) in a two-step bioleaching process was experimented. In the first step, chemolithotrophic acidophilic Acidithiobacillus ferrivorans and Acidithiobacillus thiooxidans were used. In the second step, cyanide-producing heterotrophic Pseudomonas fluorescens and Pseudomonas putida were used. Results showed that at a 1% pulp density (10g/L PCB concentration), 98.4% of the copper was bioleached by a mixture of A. ferrivorans and A. thiooxidans at pH 1.0-1.6 and ambient temperature (23±2°C) in 7days. A pure culture of P. putida (strain WCS361) produced 21.5 (±1.5)mg/L cyanide with 10g/L glycine as the substrate. This gold complexing agent was used in the subsequent bioleaching step using the Cu-leached (by A. ferrivorans and A. thiooxidans) PCB material, 44.0% of the gold was mobilized in alkaline conditions at pH 7.3-8.6, and 30°C in 2days. This study provided a proof-of-concept of a two-step approach in metal bioleaching from PCB, by bacterially produced lixiviants. Copyright © 2015 Elsevier Ltd. All rights reserved.

The ultrasonically assisted metals recovery treatment of printed circuit board waste sludge by leaching separation.

Science.gov (United States)

Xie, Fengchun; Li, Haiying; Ma, Yang; Li, Chuncheng; Cai, Tingting; Huang, Zhiyuan; Yuan, Gaoqing

2009-10-15

This paper provides a practical technique that realized industrial scale copper and iron separation from printed circuit board (PCB) waste sludge by ultrasonically assisted acid leaching in a low cost, low energy consumption and zero discharge of wastes manner. The separation efficiencies of copper and iron from acid leaching with assistance of ultrasound were compared with the one without assistance of ultrasound and the effects of the leaching procedure, pH value, and ultrasonic strength have been investigated in the paper. With the appropriate leaching procedure, a final pH of 3.0, an ultrasonic generator power of 160 W (in 1l tank), leaching time of 60 min, leaching efficiencies of copper and iron had reached 97.83% and 1.23%, respectively. Therefore the separation of copper and iron in PCB waste sludge was virtually achieved. The lab results had been successfully applied to the industrial scaled applications in a heavy metal recovery plant in city of Huizhou, China for more than two years. It has great potentials to be used in even the broad metal recovery practices.

A Method for Automatic Inspection of Printed Circuit Boards by Using the Thermal Signature

International Nuclear Information System (INIS)

Amer, H.H.; Zekry, A.A.; Elaraby, S.; Ghareeb, K.E.

2012-01-01

This paper aims to design a system for automating inspection of the printed circuit boards (PCBs) by using the thermal signature of the different integrated circuits (I.C). The proposed inspection system consists of the inspection circuit, data acquisition system (DAS) and personal computer. Inspection is done by comparing the thermal signature of normally operated circuit with the thermal signature of circuit under test. One thermistor is assigned to each component in the circuit. The thermistor must touch tightly the surface of the I.C. to sense its temperature during the inspection process. Matlab software is used to represent the thermal signature through different colors. The Turbo C software is used to develop a program for acquiring and comparing the thermal signature of the circuit under the test with the reference circuit. If the colors of the two thermal signatures for the same I.C. are same then the circuit under test is fault free and does not contain any defect. On the other side, if the colors of the two thermal signatures for the same I.C. are different then the circuit under test is defective

Application of glass-nonmetals of waste printed circuit boards to produce phenolic moulding compound

International Nuclear Information System (INIS)

Guo Jie; Rao Qunli; Xu Zhenming

2008-01-01

The aim of this study was to investigate the feasibility of using glass-nonmetals, a byproduct of recycling waste printed circuit boards (PCBs), to replace wood flour in production of phenolic moulding compound (PMC). Glass-nonmetals were attained by two-step crushing and corona electrostatic separating processes. Glass-nonmetals with particle size shorter than 0.07 mm were in the form of single fibers and resin powder, with the biggest portion (up to 34.6 wt%). Properties of PMC with glass-nonmetals (PMCGN) were compared with reference PMC and the national standard of PMC (PF2C3). When the adding content of glass-nonmetals was 40 wt%, PMCGN exhibited flexural strength of 82 MPa, notched impact strength of 2.4 kJ/m 2 , heat deflection temperature of 175 deg. C, and dielectric strength of 4.8 MV/m, all of which met the national standard. Scanning electron microscopy (SEM) showed strong interfacial bonding between glass fibers and the phenolic resin. All the results showed that the use of glass-nonmetals as filler in PMC represented a promising method for resolving the environmental pollutions and reducing the cost of PMC, thus attaining both environmental and economic benefits

Quality control process improvement of flexible printed circuit board by FMEA

Science.gov (United States)

Krasaephol, Siwaporn; Chutima, Parames

2018-02-01

This research focuses on the quality control process improvement of Flexible Printed Circuit Board (FPCB), centred around model 7-Flex, by using Failure Mode and Effect Analysis (FMEA) method to decrease proportion of defective finished goods that are found at the final inspection process. Due to a number of defective units that were found at the final inspection process, high scraps may be escaped to customers. The problem comes from poor quality control process which is not efficient enough to filter defective products from in-process because there is no In-Process Quality Control (IPQC) or sampling inspection in the process. Therefore, the quality control process has to be improved by setting inspection gates and IPCQs at critical processes in order to filter the defective products. The critical processes are analysed by the FMEA method. IPQC is used for detecting defective products and reducing chances of defective finished goods escaped to the customers. Reducing proportion of defective finished goods also decreases scrap cost because finished goods incur higher scrap cost than work in-process. Moreover, defective products that are found during process can reflect the abnormal processes; therefore, engineers and operators should timely solve the problems. Improved quality control was implemented for 7-Flex production lines from July 2017 to September 2017. The result shows decreasing of the average proportion of defective finished goods and the average of Customer Manufacturers Lot Reject Rate (%LRR of CMs) equal to 4.5% and 4.1% respectively. Furthermore, cost saving of this quality control process equals to 100K Baht.

Influence of incorporation of powder of printed circuit boards on technological properties and microstructure of triaxial ceramics

International Nuclear Information System (INIS)

Stafford, F.N.; Hotza, D.

2012-01-01

Using the methodology of experiments with mixtures, seven formulations of clay, phyllite, and printed circuit boards (PCB) were obtained to study the influence of this waste on triaxial ceramic tiles. Each formulation was processed under conditions similar to those used in the ceramic tiles industry, and characterized for fired modulus of rupture (FMoR) and water absorption (WA). The samples sintered at 1180°C were also subjected to analysis by XRD and SEM. The lowest resistance was observed in samples with 40% residue, while the highest strength occurred for samples with 14% residue, which reached average values of mechanical strength and water absorption of 35.0 MPa and 2.0%, respectively. The microstructure showed that it is possible to use waste of PCB in triaxial ceramic, which exhibits a fluxing behavior and it has an important effect on the sinterability and the development of appropriate microstructures. (author)

Printing quality control automation

Science.gov (United States)

Trapeznikova, O. V.

2018-04-01

One of the most important problems in the concept of standardizing the process of offset printing is the control the quality rating of printing and its automation. To solve the problem, a software has been developed taking into account the specifics of printing system components and the behavior in printing process. In order to characterize the distribution of ink layer on the printed substrate the so-called deviation of the ink layer thickness on the sheet from nominal surface is suggested. The geometric data construction the surface projections of the color gamut bodies allows to visualize the color reproduction gamut of printing systems in brightness ranges and specific color sectors, that provides a qualitative comparison of the system by the reproduction of individual colors in a varying ranges of brightness.

3D Printing the Complete CubeSat

Science.gov (United States)

Kief, Craig

2015-01-01

The 3D Printing the Complete CubeSat project is designed to advance the state-of-the-art in 3D printing for CubeSat applications. Printing in 3D has the potential to increase reliability, reduce design iteration time and provide greater design flexibility in the areas of radiation mitigation, communications, propulsion, and wiring, among others. This project is investigating the possibility of including propulsion systems into the design of printed CubeSat components. One such concept, an embedded micro pulsed plasma thruster (mPPT), could provide auxiliary reaction control propulsion for a spacecraft as a means to desaturate momentum wheels.

Development and implementation of a residency project advisory board.

Science.gov (United States)

Dagam, Julie K; Iglar, Arlene; Kindsfater, Julie; Loeb, Al; Smith, Chad; Spexarth, Frank; Brierton, Dennis; Woller, Thomas

2017-06-15

The development and implementation of a residency project advisory board (RPAB) to manage multiple pharmacy residents' yearlong projects across several residency programs are described. Preceptor and resident feedback during our annual residency program review and strategic planning sessions suggested the implementation of a more-coordinated approach to the identification, selection, and oversight of all components of the residency project process. A panel of 7 department leaders actively engaged in residency training and performance improvement was formed to evaluate the residency project process and provide recommendations for change. These 7 individuals would eventually constitute the RPAB. The primary objective of the RPAB at Aurora Health Care is to provide oversight and a structured framework for the selection and execution of multiple residents' yearlong projects across all residency programs within our organization. Key roles of the RPAB include developing expectations, coordinating residency project ideas, and providing oversight and feedback. The development and implementation of the RPAB resulted in a significant overhaul of our entire yearlong resident project process. Trends toward success were realized after the first year of implementation, including consistent expectations, increased clarity and engagement in resident project ideas, and more projects meeting anticipated endpoints. The development and implementation of an RPAB have provided a framework to optimize the organization, progression, and outcomes of multiple pharmacy resident yearlong projects in all residency programs across our pharmacy enterprise. Copyright © 2017 by the American Society of Health-System Pharmacists, Inc. All rights reserved.

Printed circuit board recycling: Physical processing and copper extraction by selective leaching.

Science.gov (United States)

Silvas, Flávia P C; Correa, Mónica M Jiménez; Caldas, Marcos P K; de Moraes, Viviane T; Espinosa, Denise C R; Tenório, Jorge A S

2015-12-01

Global generation of waste electrical and electronic equipment (WEEE) is about 40 million tons per year. Constant increase in WEEE generation added to international legislations has improved the development of processes for materials recovery and sustainability of electrical and electronic industry. This paper describes a new hydrometallurgical route (leaching process) to recycle printed circuit boards (PCBs) from printers to recover copper. Methodology included PCBs characterization and a combined route of physical and hydrometallurgical processing. Magnetic separation, acid digestion and chemical analysis by ICP-OES were performed. On leaching process were used two stages: the first one in a sulfuric media and the second in an oxidant media. The results showed that the PCBs composition was 74.6 wt.% of non-magnetic material and 25.4 wt.% of magnetic one. The metallic fraction corresponded to 44.0 wt.%, the polymeric to 28.5 wt.% and the ceramic to 27.5 wt.%. The main metal was copper and its initial content was 32.5 wt.%. On sulfuric leaching 90 wt.% of Al, 40 wt.% of Zn and 8.6 wt.% of Sn were extracted, whereas on oxidant leaching tests the extraction percentage of Cu was 100 wt.%, of Zn 60 wt.% and of Al 10 wt.%. At the end of the hydrometallurgical processing was obtained 100% of copper extraction and the recovery factor was 98.46%, which corresponds to a 32 kg of Cu in 100 kg of PCB. Copyright © 2015 Elsevier Ltd. All rights reserved.

Printed Circuit Board Quality Assurance

Science.gov (United States)

Sood, Bhanu

2016-01-01

PCB Assurance Summary: PCB assurance actives are informed by risk in context of the Project. Lessons are being applied across Projects for continuous improvements. Newer component technologies, smaller/high pitch devices: tighter and more demanding PCB designs: Identifying new research areas. New materials, designs, structures and test methods.

FEM-based Printhead Intelligent Adjusting Method for Printing Conduct Material

Directory of Open Access Journals (Sweden)

Liang Xiaodan

2017-01-01

Full Text Available Ink-jet printing circuit board has some advantage, such as non-contact manufacture, high manufacture accuracy, and low pollution and so on. In order to improve the and printing precision, the finite element technology is adopted to model the piezoelectric print heads, and a new bacteria foraging algorithm with a lifecycle strategy is proposed to optimize the parameters of driving waveforms for getting the desired droplet characteristics. Results of numerical simulation show such algorithm has a good performance. Additionally, the droplet jetting simulation results and measured results confirmed such method precisely gets the desired droplet characteristics.

Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

Science.gov (United States)

Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

2018-03-01

Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

Science.gov (United States)

Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

2018-06-01

Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

Comparative Study of Crosstalk Reduction Techniques in RF Printed Circuit Board Using FDTD Method

Directory of Open Access Journals (Sweden)

Rajeswari Packianathan

2015-01-01

Full Text Available Miniaturization of the feature size in modern electronic circuits results from placing interconnections in close proximity with a high packing density. As a result, coupling between the adjacent lines has increased significantly, causing crosstalk to become an important concern in high-performance circuit design. In certain applications, microstriplines may be used in printed circuit boards for propagating high-speed signals, rather than striplines. Here, the electromagnetic coupling effects are analyzed for various microstrip transmission line structures, namely, microstriplines with a guard trace, double stub microstriplines, and parallel serpentine microstriplines using the finite-difference time-domain method. The numerical results are compared with simulation results, where the variants are simulated using an Ansoft high-frequency structure simulator. The analysis and simulation results are experimentally validated by fabricating a prototype and establishing a good correspondence between them. Numerical results are compared with simulation and experimental results, showing that double stub microstriplines reduce the far end crosstalk by 7 dB and increase the near end crosstalk by about 2 dB compared with the parallel microstriplines. Parallel serpentine microstriplines reduce the far end crosstalk by more than 10 dB and also reduce more than 15 mV of peak far end crosstalk voltage, compared with parallel microstriplines.

Characterization of Printed Circuit Boards for Metal and Energy Recovery after Milling and Mechanical Separation

Directory of Open Access Journals (Sweden)

Waldir A. Bizzo

2014-06-01

Full Text Available The proper disposal of electrical and electronic waste is currently a concern of researchers and environmental managers not only because of the large volume of such waste generated, but also because of the heavy metals and toxic substances it contains. This study analyzed printed circuit boards (PCBs from discarded computers to determine their metal content and characterized them as solid waste and fuel. The analysis showed that PCBs consist of approximately 26% metal, made up mainly of copper, lead, aluminum, iron and tin, as well as other heavy metals such as cadmium and nickel. Comparison with the results of other studies indicated that the concentration of precious metals (gold and silver has declined over time. Analysis of the leachate revealed high concentrations of cadmium and lead, giving the residue the characteristics of hazardous waste. After milling the PCBs, we found that larger amounts of metal were concentrated in smaller fractions, while the lightest fraction, obtained by density separation, had a gross calorific value of approximately 11 MJ/kg, although with a high ash content. Milling followed by density separation proved potentially useful for recovery of metals and energy-rich fractions.

Balkan Print Forum – Dynamic Balkan Print Media Community

Directory of Open Access Journals (Sweden)

Rossitza Velkova

2011-11-01

Full Text Available Founded in October 2006, the Balkan Print Forum is gradually becoming an important regional institution. Its main targets are to share experiences and know-how,to initiate and intensify contacts and to support joint projects in the Balkan region.Since drupa 2008 there are 11 member countries of the Balkan Print Forum:Albania, Bosnia and Herzegovina, Bulgaria, Croatia, Former Yugoslav Republic of Macedonia, Greece, Hungary, Romania, Serbia, Slovenia and Turkey. Partners of BPF are some companies and universities from Russia and Ukraine.

Evaluation of gold and silver leaching from printed circuit board of cellphones.

Science.gov (United States)

Petter, P M H; Veit, H M; Bernardes, A M

2014-02-01

Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining "reference" values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2h at 60°C and 80°C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO3were made. The leaching of Au and Ag with alternative reagents: Na2S2O3, and (NH4)2S2O3 in 0.1M concentration with the addition of CuSO4, NH4OH, and H2O2, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO4 was added. Copyright © 2013 Elsevier Ltd. All rights reserved.

Using vacuum pyrolysis and mechanical processing for recycling waste printed circuit boards

International Nuclear Information System (INIS)

Long Laishou; Sun Shuiyu; Zhong Sheng; Dai Wencan; Liu Jingyong; Song Weifeng

2010-01-01

The constant growth in generation of waste printed circuit boards (WPCB) poses a huge disposal problem because they consist of a heterogeneous mixture of organic and metallic chemicals as well as glass fiber. Also the presence of heavy metals, such as Pb and Cd turns this scrap into hazardous waste. Therefore, recycling of WPCB is an important subject not only from the recovery of valuable materials but also from the treatment of waste. The aim of this study was to present a recycling process without negative impact to the environment as an alternative for recycling WPCB. In this work, a process technology containing vacuum pyrolysis and mechanical processing was employed to recycle WPCB. At the first stage of this work, the WPCB was pyrolyzed under vacuum in a self-made batch pilot-scale fixed bed reactor to recycle organic resins contained in the WPCB. By vacuum pyrolysis the organic matter was decomposed to gases and liquids which could be used as fuels or chemical material resources, however, the inorganic WPCB matter was left unaltered as solid residues. At the second stage, the residues obtained at the first stage were investigated to separate and recover the copper through mechanical processing such as crushing, screening, and gravity separation. The copper grade of 99.50% with recovery of 99.86% based on the whole WPCB was obtained. And the glass fiber could be obtained by calcinations in a muffle furnace at 600 deg. C for 10 min. This study had demonstrated the feasibility of vacuum pyrolysis and mechanical processing for recycling WPCB.

Tacita Dean - Print Projects

DEFF Research Database (Denmark)

Vibolt Knudsen, Vibeke

Teksten beskæftiger sig primært med Tacita Deans grafiske værk. Den indkredser forholdet mellem billedets autonomi på den ene side og på den anden side Deans konstante kredsen om fortælling og erindring, fiktion og realitet - forhold, som udfoldes serielt nærmest som et filmisk story board. Hun f...

WE-AB-303-09: Rapid Projection Computations for On-Board Digital Tomosynthesis in Radiation Therapy

Energy Technology Data Exchange (ETDEWEB)

Iliopoulos, AS; Sun, X [Duke University, Durham, NC (United States); Pitsianis, N [Aristotle University of Thessaloniki (Greece); Duke University, Durham, NC (United States); Yin, FF; Ren, L [Duke University Medical Center, Durham, NC (United States)

2015-06-15

Purpose: To facilitate fast and accurate iterative volumetric image reconstruction from limited-angle on-board projections. Methods: Intrafraction motion hinders the clinical applicability of modern radiotherapy techniques, such as lung stereotactic body radiation therapy (SBRT). The LIVE system may impact clinical practice by recovering volumetric information via Digital Tomosynthesis (DTS), thus entailing low time and radiation dose for image acquisition during treatment. The DTS is estimated as a deformation of prior CT via iterative registration with on-board images; this shifts the challenge to the computational domain, owing largely to repeated projection computations across iterations. We address this issue by composing efficient digital projection operators from their constituent parts. This allows us to separate the static (projection geometry) and dynamic (volume/image data) parts of projection operations by means of pre-computations, enabling fast on-board processing, while also relaxing constraints on underlying numerical models (e.g. regridding interpolation kernels). Further decoupling the projectors into simpler ones ensures the incurred memory overhead remains low, within the capacity of a single GPU. These operators depend only on the treatment plan and may be reused across iterations and patients. The dynamic processing load is kept to a minimum and maps well to the GPU computational model. Results: We have integrated efficient, pre-computable modules for volumetric ray-casting and FDK-based back-projection with the LIVE processing pipeline. Our results show a 60x acceleration of the DTS computations, compared to the previous version, using a single GPU; presently, reconstruction is attained within a couple of minutes. The present implementation allows for significant flexibility in terms of the numerical and operational projection model; we are investigating the benefit of further optimizations and accurate digital projection sub

WE-AB-303-09: Rapid Projection Computations for On-Board Digital Tomosynthesis in Radiation Therapy

International Nuclear Information System (INIS)

Iliopoulos, AS; Sun, X; Pitsianis, N; Yin, FF; Ren, L

2015-01-01

Purpose: To facilitate fast and accurate iterative volumetric image reconstruction from limited-angle on-board projections. Methods: Intrafraction motion hinders the clinical applicability of modern radiotherapy techniques, such as lung stereotactic body radiation therapy (SBRT). The LIVE system may impact clinical practice by recovering volumetric information via Digital Tomosynthesis (DTS), thus entailing low time and radiation dose for image acquisition during treatment. The DTS is estimated as a deformation of prior CT via iterative registration with on-board images; this shifts the challenge to the computational domain, owing largely to repeated projection computations across iterations. We address this issue by composing efficient digital projection operators from their constituent parts. This allows us to separate the static (projection geometry) and dynamic (volume/image data) parts of projection operations by means of pre-computations, enabling fast on-board processing, while also relaxing constraints on underlying numerical models (e.g. regridding interpolation kernels). Further decoupling the projectors into simpler ones ensures the incurred memory overhead remains low, within the capacity of a single GPU. These operators depend only on the treatment plan and may be reused across iterations and patients. The dynamic processing load is kept to a minimum and maps well to the GPU computational model. Results: We have integrated efficient, pre-computable modules for volumetric ray-casting and FDK-based back-projection with the LIVE processing pipeline. Our results show a 60x acceleration of the DTS computations, compared to the previous version, using a single GPU; presently, reconstruction is attained within a couple of minutes. The present implementation allows for significant flexibility in terms of the numerical and operational projection model; we are investigating the benefit of further optimizations and accurate digital projection sub

A wearable tracking device inkjet-printed on textile

KAUST Repository

Krykpayev, Bauyrzhan

2017-05-20

Despite the abundance of localization applications, the tracking devices have never been truly realized in E-textiles. Standard printed circuit board (PCB)-based devices are obtrusive and rigid and hence not suitable for textile based implementations. An attractive option would be direct printing of circuit layout on the textile itself, negating the use of rigid PCB materials. However, high surface roughness and porosity of textiles prevents efficient and reliable printing of electronics on textile. In this work, by printing an interface layer on the textile first, a complete localization circuit integrated with an antenna has been inkjet-printed on the textile for the first time. Printed conductive traces were optimized in terms of conductivity and resolution by controlling the number of over-printed layers. The tracking device determines the wearer\\'s position using WiFi and this information can be displayed on any internet-enabled device, such as smart phone. The device is compact (55mm×45mm) and lightweight (22g with 500mAh battery) for people to comfortably wear it and can be easily concealed in case discretion is required. The device operates at 2.4GHz communicated up to a distance of 55m, with localization accuracy of up to 8m.

Low cost 3D-printing used in an undergraduate project: an integrating sphere for measurement of photoluminescence quantum yield

International Nuclear Information System (INIS)

Tomes, John J; Finlayson, Chris E

2016-01-01

We report upon the exploitation of the latest 3D printing technologies to provide low-cost instrumentation solutions, for use in an undergraduate level final-year project. The project addresses prescient research issues in optoelectronics, which would otherwise be inaccessible to such undergraduate student projects. The experimental use of an integrating sphere in conjunction with a desktop spectrometer presents opportunities to use easily handled, low cost materials as a means to illustrate many areas of physics such as spectroscopy, lasers, optics, simple circuits, black body radiation and data gathering. Presented here is a 3rd year undergraduate physics project which developed a low cost (£25) method to manufacture an experimentally accurate integrating sphere by 3D printing. Details are given of both a homemade internal reflectance coating formulated from readily available materials, and a robust instrument calibration method using a tungsten bulb. The instrument is demonstrated to give accurate and reproducible experimental measurements of luminescence quantum yield of various semiconducting fluorophores, in excellent agreement with literature values. (paper)

Low cost 3D-printing used in an undergraduate project: an integrating sphere for measurement of photoluminescence quantum yield

Science.gov (United States)

Tomes, John J.; Finlayson, Chris E.

2016-09-01

We report upon the exploitation of the latest 3D printing technologies to provide low-cost instrumentation solutions, for use in an undergraduate level final-year project. The project addresses prescient research issues in optoelectronics, which would otherwise be inaccessible to such undergraduate student projects. The experimental use of an integrating sphere in conjunction with a desktop spectrometer presents opportunities to use easily handled, low cost materials as a means to illustrate many areas of physics such as spectroscopy, lasers, optics, simple circuits, black body radiation and data gathering. Presented here is a 3rd year undergraduate physics project which developed a low cost (£25) method to manufacture an experimentally accurate integrating sphere by 3D printing. Details are given of both a homemade internal reflectance coating formulated from readily available materials, and a robust instrument calibration method using a tungsten bulb. The instrument is demonstrated to give accurate and reproducible experimental measurements of luminescence quantum yield of various semiconducting fluorophores, in excellent agreement with literature values.

Performance of the electrical generator cell by the ferrous alloys of printed circuit board scrap and Iron Metal 1020

Science.gov (United States)

Sahan, Y.; Sudarsono, S.; Silviana, E.; Chairul; Wisrayetti

2018-04-01

Galvani cell is one of thealternative energy. This cell can be used as an electric resources. In this research, the generator cell was designed and builds to generate the electric. The generator cell consisted of the iron metal 1020 were used as anode, the ferrous alloys of printed circuit board scrapwas then used as chatode, and NaCl solution as an electrolyte. The aim of this research is to estimate the performance of this generator cell by using variation of NaCl concentration (i.e. 1%, 3%, 5%, 7%, and 9%) with the electrodes pair ( 1 and 8 pairs). The performance of the cell was measured with a multi tester equipment and a LED bulb (5-watt 3Volt). The Results shown that the generator cell can produce the electric power of 3.679 Volt maximally by using NaCl 9% and 8 electrode pairs applied for this condition.

Experimental Investigation of Pool Boiling for Single and Double Heaters Using Printed Circuit Board

International Nuclear Information System (INIS)

Han, Won Seok; Lee, Jae Young

2012-01-01

Over the past several decades, a considerable number of studies have been conducted on boiling heat transfer in pool boiling. Boiling heat transfer is used in a variety of cooling applications, such as heat exchangers, high powered electronics, and nuclear reactors. Nucleate boiling is one of the most efficient heat transfer mechanisms in boiling regime, but it is imperative that the critical heat flux(CHF) should not be exceeded. CHF phenomenon leads to a dramatic rise in wall temperature, decreased heat transfer, and material failure. Although numerous attempts have been made by researchers to demonstrate the CHF, there is little agreement with the CHF mechanism. In recent years, many researchers have been focusing on surface condition using nanoparticles and surface enhancements, such as a micro structure and artificial cavities, due to enhancement of the CHF point. Cooke and Kandlikar used chips etched with microchannels to prove that these structure has the most enhancement effect. They found that the most efficient boiling surface is with a larger channel size and deep etch. The purpose of this paper is to evaluate the heat transfer and CHF of double heaters on printed circuit board(PCB) in pool boiling. In addition, bubble dynamics of nucleate boiling were observed with high speed observation on single and double heaters using PCB heater

Supergravity separation of Pb and Sn from waste printed circuit boards at different temperatures

Science.gov (United States)

Meng, Long; Wang, Zhe; Zhong, Yi-wei; Chen, Kui-yuan; Guo, Zhan-cheng

2018-02-01

Printed circuit boards (PCBs) contain many toxic substances as well as valuable metals, e.g., lead (Pb) and tin (Sn). In this study, a novel technology, named supergravity, was used to separate different mass ratios of Pb and Sn from Pb-Sn alloys in PCBs. In a supergravity field, the liquid metal phase can permeate from solid particles. Hence, temperatures of 200, 280, and 400°C were chosen to separate Pb and Sn from PCBs. The results depicted that gravity coefficient only affected the recovery rates of Pb and Sn, whereas it had little effect on the mass ratios of Pb and Sn in the obtained alloys. With an increase in gravity coefficient, the recovery values of Pb and Sn in each step of the separation process increased. In the single-step separation process, the mass ratios of Pb and Sn in Pb-Sn alloys were 0.55, 0.40, and 0.64 at 200, 280, and 400°C, respectively. In the two-step separation process, the mass ratios were 0.12 and 0.55 at 280 and 400°C, respectively. Further, the mass ratio was observed to be 0.76 at 400°C in the three-step separation process. This process provides an innovative approach to the recycling mechanism of Pb and Sn from PCBs.

Murky Projects and Uneven Information Policies: A Case Study of the Psychological Strategy Board and CIA

Directory of Open Access Journals (Sweden)

Susan Maret

2018-02-01

Full Text Available This case study discusses the Truman and Eisenhower administration's (1951-1953 short-lived Psychological Strategy Board (PSB. Through the lens of declassified documents, the article recounts the history and activities of the Board, including its relationship with the Central Intelligence Agency (CIA and clandestine projects that involve human experimentation. Primary documents of the period suggest that institutional secrecy, coupled with inconsistent information policies, largely shielded CIA's BLUEBIRD, ARTICHOKE, and MKULTRA from the Board. This subject has not been previously reported in the research literature, and supplements existing historical understanding of the PSB's mission under the broad umbrella of psychological warfare.

Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment

International Nuclear Information System (INIS)

Zou, Shiwen; Li, Xiaogang; Dong, Chaofang; Ding, Kangkang; Xiao, Kui

2013-01-01

Highlights: •The electrochemical migration, whisker formation, and corrosion behavior of PCB under wet H 2 S environment were observed and studied systematically. •The process of electrochemical migration of solder joints is explained. •The corrosion mechanism of PCB interconnectors induced by micro pores under wet H 2 S environment is discussed, and the corrosion reaction model is proposed. -- Abstract: Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board (PCB) under wet H 2 S environment were analyzed by environment scanning electron microscope (ESEM), Energy dispersive X-ray spectroscopy (EDS) with mapping and element phase cluster (EPC) techniques, Raman Spectrum analysis and electrochemical impedance spectroscopy (EIS) technology. The results showed that nonuniform corrosion behavior occurred on PCB surfaces under 1 ppm wet H 2 S at 40 °C; whiskers formed on the inner sidewall of via-holes with a growth rate of 1.2 Å/s; numerous corrosion products migrated through the pore of plated gold layer, which broke off the protective layer. The corrosion rate was accelerated according to the big-cathode-small-anode model

Feature-Learning-Based Printed Circuit Board Inspection via Speeded-Up Robust Features and Random Forest

Directory of Open Access Journals (Sweden)

Eun Hye Yuk

2018-06-01

Full Text Available With the coming of the 4th industrial revolution era, manufacturers produce high-tech products. As the production process is refined, inspection technologies become more important. Specifically, the inspection of a printed circuit board (PCB, which is an indispensable part of electronic products, is an essential step to improve the quality of the process and yield. Image processing techniques are utilized for inspection, but there are limitations because the backgrounds of images are different and the kinds of defects increase. In order to overcome these limitations, methods based on machine learning have been used recently. These methods can inspect without a normal image by learning fault patterns. Therefore, this paper proposes a method can detect various types of defects using machine learning. The proposed method first extracts features through speeded-up robust features (SURF, then learns the fault pattern and calculates probabilities. After that, we generate a weighted kernel density estimation (WKDE map weighted by the probabilities to consider the density of the features. Because the probability of the WKDE map can detect an area where the defects are concentrated, it improves the performance of the inspection. To verify the proposed method, we apply the method to PCB images and confirm the performance of the method.

PUZZLE - A program for computer-aided design of printed circuit artwork

Science.gov (United States)

Harrell, D. A. W.; Zane, R.

1971-01-01

Program assists in solving spacing problems encountered in printed circuit /PC/ design. It is intended to have maximum use for two-sided PC boards carrying integrated circuits, and also aids design of discrete component circuits.

3D inkjet printed disposable environmental monitoring wireless sensor node

KAUST Repository

Farooqui, Muhammad Fahad

2017-10-24

We propose a disposable, miniaturized, moveable, fully integrated 3D inkjet-printed wireless sensor node for large area environmental monitoring applications. As a proof of concept, we show the wireless sensing of temperature, humidity and H2S levels which are important for early warnings of two critical environmental conditions namely forest fires and industrial gas leaks. The temperature sensor has TCR of -0.018/°, the highest of any inkjet-printed sensor and the H2S sensor can detect as low as 3 ppm of gas. These sensors and an antenna have been realized on the walls of a 3D-printed cubic package which encloses the microelectronics developed on a 3D-printed circuit board. Hence, 3D printing and inkjet printing have been combined in order to realize a unique low-cost, fully integrated wireless sensor node. Field tests show that these sensor nodes can wirelessly communicate up to a distance of over 100m. Our proposed sensor node can be a part of internet of things with the aim of providing a better and safe living.

3D Printing the ATLAS' barrel toroid

CERN Document Server

Goncalves, Tiago Barreiro

2016-01-01

The present report summarizes my work as part of the Summer Student Programme 2016 in the CERN IR-ECO-TSP department (International Relations – Education, Communication & Outreach – Teacher and Student Programmes). Particularly, I worked closely with the S’Cool LAB team on a science education project. This project included the 3D designing, 3D printing, and assembling of a model of the ATLAS’ barrel toroid. A detailed description of the project' development is presented and a short manual on how to use 3D printing software and hardware is attached.

An Investigation on the Extraction and Quantitation of a Hexavalent Chromium in Acrylonitrile Butadiene Styrene Copolymer (ABS) and Printed Circuit Board (PCB) by Ion Chromatography Coupled with Inductively Coupled Plasma Atomic Emission Spectrometry

Energy Technology Data Exchange (ETDEWEB)

Nam, Sang Ho; Kim, Yu Na [Mokpo National University, Muan (Korea, Republic of)

2012-06-15

A hexavalent chromium (Cr (VI)) is one of the hazardous substances regulated by the RoHS. The determination of Cr (VI) in various polymers and printed circuit board (PCB) has been very important. In this study, the three different analytical methods were investigated for the determination of a hexavalent chromium in Acrylonitrile Butadiene Styrene copolymer (ABS) and PCB. The results by three analytical methods were obtained and compared. An analytical method by UV-Visible spectrometer has been generally used for the determination of Cr (VI) in a sample, but a hexavalent chromium should complex with diphenylcarbazide for the detection in the method. The complexation did make an adverse effect on the quantitative analysis of Cr (VI) in ABS. The analytical method using diphenylcarbazide was also not applicable to printed circuit board (PCB) because PCB contained lots of irons. The irons interfered with the analysis of hexavalent chromium because those also could complex with diphenylcarbazide. In this study, hexavalent chromiums in PCB have been separated by ion chromatography (IC), then directly and selectively detected by inductively coupled plasma atomic emission spectrometry (ICP-AES). The quantity of Cr (VI) in PCB was 0.1 mg/kg

Printing method for organic light emitting device lighting

Science.gov (United States)

Ki, Hyun Chul; Kim, Seon Hoon; Kim, Doo-Gun; Kim, Tae-Un; Kim, Snag-Gi; Hong, Kyung-Jin; So, Soon-Yeol

2013-03-01

Organic Light Emitting Device (OLED) has a characteristic to change the electric energy into the light when the electric field is applied to the organic material. OLED is currently employed as a light source for the lighting tools because research has extensively progressed in the improvement of luminance, efficiency, and life time. OLED is widely used in the plate display device because of a simple manufacture process and high emitting efficiency. But most of OLED lighting projects were used the vacuum evaporator (thermal evaporator) with low molecular. Although printing method has lower efficiency and life time of OLED than vacuum evaporator method, projects of printing OLED actively are progressed because was possible to combine with flexible substrate and printing technology. Printing technology is ink-jet, screen printing and slot coating. This printing method allows for low cost and mass production techniques and large substrates. In this research, we have proposed inkjet printing for organic light-emitting devices has the dominant method of thick film deposition because of its low cost and simple processing. In this research, the fabrication of the passive matrix OLED is achieved by inkjet printing, using a polymer phosphorescent ink. We are measured optical and electrical characteristics of OLED.

3D Printing of Ball Grid Arrays

Science.gov (United States)

Sinha, Shayandev; Hines, Daniel; Dasgupta, Abhijit; Das, Siddhartha

Ball grid arrays (BGA) are interconnects between an integrated circuit (IC) and a printed circuit board (PCB), that are used for surface mounting electronic components. Typically, lead free alloys are used to make solder balls which, after a reflow process, establish a mechanical and electrical connection between the IC and the PCB. High temperature processing is required for most of these alloys leading to thermal shock causing damage to ICs. For producing flexible circuits on a polymer substrate, there is a requirement for low temperature processing capabilities (around 150 C) and for reducing strain from mechanical stresses. Additive manufacturing techniques can provide an alternative methodology for fabricating BGAs as a direct replacement for standard solder bumped BGAs. We have developed aerosol jet (AJ) printing methods to fabricate a polymer bumped BGA. As a demonstration of the process developed, a daisy chain test chip was polymer bumped using an AJ printed ultra violet (UV) curable polymer ink that was then coated with an AJ printed silver nanoparticle laden ink as a conducting layer printed over the polymer bump. The structure for the balls were achieved by printing the polymer ink using a specific toolpath coupled with in-situ UV curing of the polymer which provided good control over the shape, resulting in well-formed spherical bumps on the order of 200 um wide by 200 um tall for this initial demonstration. A detailed discussion of the AJ printing method and results from accelerated life-time testing will be presented

Liquid oil and residual characteristics of printed circuit board recycle by pyrolysis

Energy Technology Data Exchange (ETDEWEB)

Lin, Kuo-Hsiung [Department of Environmental Engineering and Science, Fooyin University, Kaohsiung, Taiwan (China); Chiang, Hung-Lung, E-mail: hlchiang@mail.cmu.edu.tw [Department of Health Risk Management, China Medical University, Taichung, Taiwan (China)

2014-04-01

Highlights: • Pyrolysis is a technology for recycling of the non-metal fraction of PCBs. • Liquid product constituents were analyzed for PCB pyrolysis. • Water-soluble ionic species were determined for PCB pyrolysis exhaust. - Abstract: Non-metal fractions of waste printed circuit boards (PCBs) were thermally treated (200–500 °C) under nitrogen atmosphere. Carbon, hydrogen, and nitrogen were determined by elemental analyzer, bromine by instrumental neutron activation analysis (INAA), phosphorus by energy dispersive X-ray spectrometer (EDX), and 29 trace elements by inductively coupled plasma atomic emission spectrometer (ICP-AES) and mass spectrometry (ICP-MS) for raw material and pyrolysis residues. Organic compositions of liquid oil were identified by GC (gas chromatography)–MS, trace element composition by ICP system, and 12 water-soluble ions by IC (ionic chromatography). Elemental content of carbon was >450 mg/g, oxygen 300 mg/g, bromine and hydrogen 60 mg/g, nitrogen 30 mg/g, and phosphorus 28 mg/g. Sulfur was trace in PCBs. Copper content was 25–28 mg/g, iron 1.3–1.7 mg/g, tin 0.8–1.0 mg/g and magnesium 0.4–1.0 mg/g; those were the main metals in the raw materials and pyrolytic residues. In the liquid products, carbon content was 68–73%, hydrogen was 10–14%, nitrogen was 4–5%, and sulfur was less than 0.05% at pyrolysis temperatures from 300 to 500 °C. Phenol, 3-bromophenol, 2-methylphenol and 4-propan-2-ylphenol were major species in liquid products, accounting for >50% of analyzed organic species. Bromides, ammonium and phosphate were the main species in water sorption samples for PCB pyrolysis exhaust.

Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

Energy Technology Data Exchange (ETDEWEB)

Fogarasi, Szabolcs [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Imre-Lucaci, Florica [“Babeş-Bolyai” University, Interdisciplinary Research Institute on Bio-Nano-Sciences, 42 Treboniu Laurian Street, Cluj-Napoca RO-400271 (Romania); Imre-Lucaci, Árpád, E-mail: aimre@chem.ubbcluj.ro [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Ilea, Petru [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania)

2014-05-01

Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples.

Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

International Nuclear Information System (INIS)

Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Árpád; Ilea, Petru

2014-01-01

Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples

48 CFR 30.102 - Cost Accounting Standards Board publication.

Science.gov (United States)

2010-10-01

... 48 Federal Acquisition Regulations System 1 2010-10-01 2010-10-01 false Cost Accounting Standards... REGULATION GENERAL CONTRACTING REQUIREMENTS COST ACCOUNTING STANDARDS ADMINISTRATION General 30.102 Cost Accounting Standards Board publication. Copies of the CASB Standards and Regulations are printed in title 48...

DC arc plasma disposal of printed circuit board

International Nuclear Information System (INIS)

Huang Jianjun; Shenzhen Univ., Shenzhen; Shi Jiabiao; Meng Yuedong; Liu Zhengzhi

2004-01-01

A new solid waste disposal technology setup with DC arc plasma is presented. Being different from conventional combustion or burning such as incineration, it is based on a process called controlled high-temperature pyrolysis, the thermal destruction and recovery process. The results of vitrification of the circuit board are presented. The properties of vitrified product including hardness and leaching test results are presented. The final product (vitrified material) and air emission from the plasma treatment is environmentally acceptable. (authors)

Departmental Appeals Board Decisions

Data.gov (United States)

U.S. Department of Health & Human Services — Decisions issued by the Chair and Board Members of the Departmental Appeals Board concerning determinations in discretionary, project grant programs, including...

Comparative study on copper leaching from waste printed circuit boards by typical ionic liquid acids.

Science.gov (United States)

Chen, Mengjun; Huang, Jinxiu; Ogunseitan, Oladele A; Zhu, Nengming; Wang, Yan-min

2015-07-01

Waste printed circuit boards (WPCBs) are attracting increasing concerns because the recovery of its content of valuable metallic resources is hampered by the presence of hazardous substances. In this study, we used ionic liquids (IL) to leach copper from WPCBs. [BSO3HPy]OTf, [BSO3HMIm]OTf, [BSO4HPy]HSO4, [BSO4HMim]HSO4 and [MIm]HSO4 were selected. Factors that affect copper leaching rate were investigated in detail and their leaching kinetics were also examined with the comparison of [Bmim]HSO4. The results showed that all six IL acids could successfully leach copper out, with near 100% recovery. WPCB particle size and leaching time had similar influences on copper leaching performance, while IL acid concentration, hydrogen peroxide addition, solid to liquid ratio, temperature, showed different influences. Moreover, IL acid with HSO4(-) was more efficient than IL acid with CF3SO3(-). These six IL acids indicate a similar behavior with common inorganic acids, except temperature since copper leaching rate of some IL acids decreases with its increase. The results of leaching kinetics studies showed that diffusion plays a more important role than surface reaction, whereas copper leaching by inorganic acids is usually controlled by surface reaction. This innovation provides a new option for recovering valuable materials such as copper from WPCBs. Copyright © 2015 Elsevier Ltd. All rights reserved.

A study on the effectiveness of task manager board game as a training tool in managing project

Science.gov (United States)

Yusof, Shahrul Azmi Mohd; Radzi, Shanizan Herman Md; Din, Sharifah Nadera Syed; Khalid, Nurhafizah

2016-08-01

Nowadays, games have become one of the useful tools in training. Many instructors choose to use games to enhance the way of delivering the subject. Failure to apply the suitable tool in training will lead to discouragement in learning and causing waste to the resources. An effective game will help the student understand the concept quickly. It can also help students to get involve in experiential learning where the student can manage and solve the problem as in the actual situation. This study will focus on the effectiveness of board game as a training tool for managing projects. This game has 4 tasks to be completed by students. They will be divided into a group of 4 or 5. Two methods are used in this study, pilot test, and post-test. These methods are chosen to analyze the effectiveness of using Task Manager Board Game as a teaching tool and the improvement of student's knowledge in project management. Three sub-components assessed were motivation, user experience and learning using case studies on Kirkpatrick's level one base on the perception of the students. The result indicated that the use of Task Manager board game as a training tool for managing project has a positive impact on students. It helps students to experience the situation of managing projects. It is one of the easiest ways for improving time management, human resources and communication skill.

Industrial Technology Modernization Program. Category 2 Project. Printed Wiring Board (PWB) Process Fixture

Science.gov (United States)

1987-08-31

78725 Fort Worth, TX 76101 Ba. NAME OF FUNDING/ SPONSORING 8b. OFFICE SYMBOL 9. PROCUREMENT INSTRUMENT IDENTIFICATION NUMBER I_ ZAgO (If applicable...14 1 -J j _j i 4 31 00 00.. m ~C> -LJ -C LAC 090 CV Id 19o ]60a %KA.])0 V’s I W 3d Tracor Aerospace 2.0 PROJECT DESCRIPTION Preliminary design...PMRTS J PRODUCTLINE BREAKOUT - NO. DIR, I iS BOW~4 PPUTIM rlAA OM" M L DM NC6 L x W THK .0, x 2.; 1CULNG HCLZ DVV= M3=JG ~ MZ TO UM= MD 2/B Or BMW i i

Selecting suitable enclosures for digitally printed materials

International Nuclear Information System (INIS)

Burge, D; Rima, L

2010-01-01

It cannot be assumed that storage enclosures considered safe for traditionally printed images and documents are suitable for modern, digitally printed materials. In this project, a large variety of digital print types were tested using a modified version of the ISO 18916 Imaging materials-Processed imaging materials-Photographic activity test for enclosure materials standard to assess the risk to digital prints by paper enclosures known to be inert or reactive with traditional photographic prints. The types of enclosures tested included buffered and non-buffered cotton papers, and groundwood paper. In addition, qualitative filter paper that had been wetted and dried with either an acidic or basic solution was also tested to determine the effects of enclosure pH on digitally printed materials. It was determined that, in general, digital prints tended to be less reactive with various enclosure types than traditional prints. Digital prints were most sensitive to paper that contained groundwood. The enclosure reactivity test results were then integrated with previous published work on the tendencies of various enclosure types to abrade, ferrotype, or block to digital prints in order to create a comprehensive set of recommendations for digital print storage enclosures.

Measuring the layer-average volumetric water content in the uppermost 5 cm of soil using printed circuit board TDR probes

International Nuclear Information System (INIS)

Wang, W.; Kobayashi, T.; Chikushi, J.

2000-01-01

Newly designed printed circuit board TDR probes (PCBPs) were made, and they were calibrated by indoor experiment. A regression equation for estimating the volumetric water content from the dielectric constant measured with the PCBP was determined, which is almost the same as the well-known Topp's equation when the soil is rather wet while the difference becomes larger as the soil dries. The PCBP was designed to measure the average water content over a soil layer 5 cm thick because the thickness of soil layer involved in measuring water content by microwave remote sensing is several centimeters. A comparison experiment of measurements with PCBPs and those by microwave remote sensing was conducted in an arid area in the northwest of China. The results of this experiment show that the newly designed TDR probe is promising as the sensor to get ground truth of the surface wetness. This paper describes only the calibration of probes and the observations taken using them

Evaluation of a recycling process for printed circuit board by physical separation and heat treatment

International Nuclear Information System (INIS)

Fujita, Toyohisa; Ono, Hiroyuki; Dodbiba, Gjergj; Yamaguchi, Kunihiko

2014-01-01

Highlights: • The parts mounted on printed circuit board (PCB) were liberated by underwater explosion and mechanical crushing. • The crushed PCB without surface-mounted parts was carbonized under inert atmosphere at 873 K to recover copper. • The multi-layered ceramic capacitors including nickel was carbonized at 873 K to recover nickel by the magnetic separation. • The tantalum powders were recovered from the molded resins by heat treatment at 723 and 823 K in air atmosphere and screening. • Energy and treatment cost of new process increased, however, the environmental burden decreased comparing conventional one. - Abstract: Printed circuit boards (PCBs) from discarded personal computer (PC) and hard disk drive were crushed by explosion in water or mechanical comminution in order to disintegrate the attached parts. More parts were stripped from PCB of PC, composed of epoxy resin; than from PCB of household appliance, composed of phenol resin. In an attempt to raise the copper grade of PCB by removing other components, a carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under a nitrogen atmosphere at 873–1073 K. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The copper foil was liberated easily from glass fiber by stamping treatment. As one of the mounted parts, the multi-layered ceramic capacitors (MLCCs), which contain nickel, were carbonized at 873 K. The magnetic separation is carried out at a lower magnetic field strength of 0.1 T and then at 0.8 T. In the +0.5 mm size fraction the nickel grade in magnetic product was increased from 0.16% to 6.7% and the nickel recovery is 74%. The other useful mounted parts are tantalum capacitors. The tantalum capacitors were collected from mounted parts. The tantalum-sintered bodies were separated from molded resins

Three-Dimensional Printing in Zero Gravity

Science.gov (United States)

Werkheiser, Niki

2015-01-01

The 3D printing in zero-g (3D Print) technology demonstration project is a proof-of-concept test designed to assess the properties of melt deposition modeling additive manufacturing in the microgravity environment experienced on the International Space Station (ISS). This demonstration is the first step towards realizing a 'machine shop' in space, a critical enabling component of any deep space mission.

ONBORD (On-Board Navigation of Ballistic ORDnance): Gun-Launched Munitions Flight Controller

National Research Council Canada - National Science Library

Wilson, Michael

2004-01-01

.... The electronics consist of a single 1.4-inch printed circuit board that includes the Texas Instruments TMS320F2812 digital signal processor whose microcontroller-like capabilities reduce the amount of peripheral circuitry necessary...

Case Study on Printed Matter in Denmark

DEFF Research Database (Denmark)

Larsen, Henrik Fred

2012-01-01

The implementation of the EU REACH regulation will most probably promote substitution within sectors handling a lot of different chemicals such as the printing industry. With the aim of being at the cutting edge of this development, the Danish printing industry started up a substitution project....../impurities in globally recycled paper....

Mobile clusters of single board computers: an option for providing resources to student projects and researchers.

Science.gov (United States)

Baun, Christian

2016-01-01

Clusters usually consist of servers, workstations or personal computers as nodes. But especially for academic purposes like student projects or scientific projects, the cost for purchase and operation can be a challenge. Single board computers cannot compete with the performance or energy-efficiency of higher-value systems, but they are an option to build inexpensive cluster systems. Because of the compact design and modest energy consumption, it is possible to build clusters of single board computers in a way that they are mobile and can be easily transported by the users. This paper describes the construction of such a cluster, useful applications and the performance of the single nodes. Furthermore, the clusters' performance and energy-efficiency is analyzed by executing the High Performance Linpack benchmark with a different number of nodes and different proportion of the systems total main memory utilized.

3D Modeling Techniques for Print and Digital Media

Science.gov (United States)

Stephens, Megan Ashley

In developing my thesis, I looked to gain skills using ZBrush to create 3D models, 3D scanning, and 3D printing. The models created compared the hearts of several vertebrates and were intended for students attending Comparative Vertebrate Anatomy. I used several resources to create a model of the human heart and was able to work from life while creating heart models from other vertebrates. I successfully learned ZBrush and 3D scanning, and successfully printed 3D heart models. ZBrush allowed me to create several intricate models for use in both animation and print media. The 3D scanning technique did not fit my needs for the project, but may be of use for later projects. I was able to 3D print using two different techniques as well.

Inkjet printed large-area flexible circuits: a simple methodology for optimizing the printing quality

Science.gov (United States)

Cheng, Tao; Wu, Youwei; Shen, Xiaoqin; Lai, Wenyong; Huang, Wei

2018-01-01

In this work, a simple methodology was developed to enhance the patterning resolution of inkjet printing, involving process optimization as well as substrate modification and treatment. The line width of the inkjet-printed silver lines was successfully reduced to 1/3 of the original value using this methodology. Large-area flexible circuits with delicate patterns and good morphology were thus fabricated. The resultant flexible circuits showed excellent electrical conductivity as low as 4.5 Ω/□ and strong tolerance to mechanical bending. The simple methodology is also applicable to substrates with various wettability, which suggests a general strategy to enhance the printing quality of inkjet printing for manufacturing high-performance large-area flexible electronics. Project supported by the National Key Basic Research Program of China (Nos. 2014CB648300, 2017YFB0404501), the National Natural Science Foundation of China (Nos. 21422402, 21674050), the Natural Science Foundation of Jiangsu Province (Nos. BK20140060, BK20130037, BK20140865, BM2012010), the Program for Jiangsu Specially-Appointed Professors (No. RK030STP15001), the Program for New Century Excellent Talents in University (No. NCET-13-0872), the NUPT "1311 Project" and Scientific Foundation (Nos. NY213119, NY213169), the Synergetic Innovation Center for Organic Electronics and Information Displays, the Priority Academic Program Development of Jiangsu Higher Education Institutions (PAPD), the Leading Talent of Technological Innovation of National Ten-Thousands Talents Program of China, the Excellent Scientific and Technological Innovative Teams of Jiangsu Higher Education Institutions (No. TJ217038), the Program for Graduate Students Research and Innovation of Jiangsu Province (No. KYZZ16-0253), and the 333 Project of Jiangsu Province (Nos. BRA2017402, BRA2015374).

The future of 3D printing technology in biomedicine

OpenAIRE

Iraj Nabipour

2015-01-01

3D printing, one of the hottest cutting-edge interdisciplinary technologies, is projected to have revenue of $8.4 billion in 2020. #D printing technology will implement the concept of personalized medicine in medical healthcare industry and pharmaceutical fabrication. Organ printing, which it is defined as computer-aided, jet based 3D tissue-engineering of living human organs, is an interesting and challengeable field for 3D printing. Customized implants and prostheses can be produced in any ...

CAD and 3d-printing integration experience in the curriculum of engineers education

Directory of Open Access Journals (Sweden)

V. V. Zelentsov

2016-01-01

Full Text Available The paper examines the results of using the 3d-printing educational methodology for training the students in the spacecraft-configuration developing area.The first purpose of the considered methodology practice is to implement the rapid-prototyping skills into the educational process, to provide perfection of the student knowledge in configuring the internal on-board equipment of the spacecraft. The second purpose – is to habituate the students to the main principles of the available CAM technologies, to fill the available educational gap in the area of information support of the spacecraft life-cycle.The proposed curriculum includes six training exercises based on a special “Engineering drawing” course unit. The training exercises require using the SolidWorks geometric-simulation software. The preliminary obtained virtual prototypes of the spacecraft configuration elements are subjected to 3d-printing and assembled into a physical configuration model. The physical configuration models are obtained using one of the most accessible rapid-prototyping technologies – 3d-printing of extrusion type. Practicing in 3d-printing provides developing the student skills in managing all other digital-program control devices.The specified first experience of integrating the computer geometricsimulation methodology and the 3d-printing practices in a single course unit has proved: developing the physical-configuration models heightens the student interest to the configuration training.A ready-made physical model does not excuse the available configuration mistakes unlike a virtual model where the component interferences may remain undetected. So, developing a physical model requires additional endeavor and responsibility. Developing a project in a team has proved to be an effective means for solving a common creative problem.The first test of the proposed methodology has shown the importance of perfect adjustment of the available 3d-printing process and

Survey on paediatric tumour boards in Europe: current situation and results from the ExPo-r-Net project.

Science.gov (United States)

Juan Ribelles, A; Berlanga, P; Schreier, G; Nitzlnader, M; Brunmair, B; Castel, V; Essiaf, S; Cañete, A; Ladenstein, R

2018-01-08

Under the ExPO-r-NeT project (European Expert Paediatric Oncology Reference Network for Diagnostics and Treatment), we aimed to identify paediatric oncology tumour boards in Europe to investigate the kind of technologies and logistics that are in place in different countries and to explore current differences between regions. A 20-question survey regarding several features of tumor boards was designed. Data collected included infrastructure, organization, and clinical decision-making information from the centres. The survey was distributed to the National Paediatric Haematology and Oncology Societies that forwarded the survey to the sites. For comparative analysis, respondents were grouped into four geographical regions. The questionnaire was distributed amongst 30 countries. Response was obtained from 23 (77%) that altogether have 212 paediatric oncology treating centres. A total of 121 institutions answered (57%). Ninety-one percent of the centres hold multidisciplinary boards; however, international second consultations are performed in 36% and only 15% participate on virtual tumor boards. Videoconferencing facilities and standard operational procedures (SOPs) are available in 49 and 43% of the centres, respectively. There were statistically significant differences between European regions concerning meeting infrastructure and organization/logistics: specific room, projecting equipment, access to medical records, videoconferencing facilities, and existence of SOPs. Paediatric tumor boards are a common feature in Europe. To reduce inequalities and have equal access to healthcare, a virtual network is needed. Important differences on the functioning and access to technology between regions in Europe have been observed and need to be addressed.

3D-Printed Disposable Wireless Sensors with Integrated Microelectronics for Large Area Environmental Monitoring

KAUST Repository

Farooqui, Muhammad Fahad

2017-05-19

Large area environmental monitoring can play a crucial role in dealing with crisis situations. However, it is challenging as implementing a fixed sensor network infrastructure over large remote area is economically unfeasible. This work proposes disposable, compact, dispersible 3D-printed wireless sensor nodes with integrated microelectronics which can be dispersed in the environment and work in conjunction with few fixed nodes for large area monitoring applications. As a proof of concept, the wireless sensing of temperature, humidity, and H2S levels are shown which are important for two critical environmental conditions namely forest fires and industrial leaks. These inkjet-printed sensors and an antenna are realized on the walls of a 3D-printed cubic package which encloses the microelectronics developed on a 3D-printed circuit board. Hence, 3D printing and inkjet printing are uniquely combined in order to realize a low-cost, fully integrated wireless sensor node.

Removal of organic compounds from wastewater originating from the production of printed circuit boards by UV-Fenton method

Directory of Open Access Journals (Sweden)

Thomas Maciej

2017-12-01

Full Text Available The possibility of removing organic compounds from wastewater originating from the photochemical production of printed circuit boards by use of waste acidification and disposal of precipitated photopolymer in the first stage and the UV-Fenton method in a second stage has been presented. To optimize the process of advanced oxidation, the RSM (Response Surface Methodology for three independent factors was applied, i.e. pH, the concentration of Fe(II and H2O2 concentration. The use of optimized values of individual parameters in the process of wastewater treatment caused a decrease in the concentration of the organic compounds denoted as COD by approx. 87% in the first stage and approx. 98% after application of both processes. Precipitation and the decomposition of organic compounds was associated with a decrease of wastewater COD to below 100 mg O2/L whereas the initial value was 5550 mg O2/L. Decomposition of organic compounds and verification of the developed model of photopolymers removal was also carried out with use of alternative H2O2 sources i.e. CaO2, MgO2, and Na2CO3·1,5H2O2.

Recovery of copper and lead from waste printed circuit boards by supercritical water oxidation combined with electrokinetic process

International Nuclear Information System (INIS)

Xiu Furong; Zhang Fushen

2009-01-01

An effective and benign process for copper and lead recovery from waste printed circuit boards (PCBs) was developed. In the process, the PCBs was pre-treated in supercritical water, then subjected to electrokinetic (EK) process. Experimental results showed that supercritical water oxidation (SCWO) process was strong enough to decompose the organic compounds of PCBs, and XRD spectra indicated that copper and lead were oxidized into CuO, Cu 2 O and β-PbO 2 in the process. The optimum SCWO treatment conditions were 60 min, 713 K, 30 MPa, and EK treatment time, constant current density were 11 h, 20 mA cm -2 , respectively. The recovery percentages of copper and lead under optimum SCWO + EK treatment conditions were around 84.2% and 89.4%, respectively. In the optimized EK treatment, 74% of Cu was recovered as a deposit on the cathode with a purity of 97.6%, while Pb was recovered as concentrated solutions in either anode (23.1%) or cathode (66.3%) compartments but little was deposited on the electrodes. It is believed that the process is effective and practical for Cu and Pb recovery from waste electric and electronic equipments.

AQUEOUS CLEANING OF PRINTED CIRCUIT BOARD STENCILS

Science.gov (United States)

The USEPA through NRMRL has partnered with the California Dept. of Toxic Substance Control under an ETV Pilot Project to verigy polllution prevention, recycling and waste treatment technologies. One of the projects selected for verification was the ultrasonic aqueous cleaning tec...

Occurrences and inventories of heavy metals and brominated flame retardants in wastes from printed circuit board production.

Science.gov (United States)

Zhou, Xiaoyu; Guo, Jie; Zhang, Wei; Zhou, Peng; Deng, Jingjing; Lin, Kuangfei

2014-09-01

Pollutants including heavy metals and brominated flame retardant were detected in 10 types of production wastes from a typical printed circuit board manufacturing plant, and their inventories were estimated. Rinsing water from etching process had the highest concentrations of copper (665.51 mg/L), lead (1.02 mg/L), nickel (3.60 mg/L), chromium (0.97 mg/L), and tin (1.79 mg/L). Powdered solid waste (SW) from the cut lamination process contained the highest tetrabromobisphenol-A (TBBPA) levels (49.86 mg/kg). Polybrominated diphenyl ethers (PBDEs) were absent in this plant, in agreement with the international regulations of PBDE phase out. The pollutant inventories in the wastes exhibited in the order of copper > > zinc > tin ≈ nickel > lead > chromium > > TBBPA. The potential environmental impact of pollutants in SW during production and disposal were further investigated. A high partitioning of pollutant concentration between the total suspended particle and SW (-0.10 < log K TS < 2.12) was observed for most pollutants, indicating the emission pathway from SW to the airborne atmosphere in the workshop. Although SW met the toxicity characteristic leaching procedure, drilling powder with the smallest particle diameter still showed high leachabilities of lead and tin which may lead to a negative environmental impact during disposal.

Preparation of hierarchical porous carbon from waste printed circuit boards for high performance electric double-layer capacitors

Science.gov (United States)

Du, Xuan; Wang, Li; Zhao, Wei; Wang, Yi; Qi, Tao; Li, Chang Ming

2016-08-01

Renewable clean energy and resources recycling have become inevitable choices to solve worldwide energy shortages and environmental pollution problems. It is a great challenge to recycle tons of waste printed circuit boards (PCB) produced every year for clean environment while creating values. In this work, low cost, high quality activated carbons (ACs) were synthesized from non-metallic fractions (NMF) of waste PCB to offer a great potential for applications of electrochemical double-layer capacitors (EDLCs). After recovering metal from waste PCB, hierarchical porous carbons were produced from NMF by carbonization and activation processes. The experimental results exhibit that some pores were formed after carbonization due to the escape of impurity atoms introduced by additives in NMF. Then the pore structure was further tailored by adjusting the activation parameters. Roles of micropores and non-micropores in charge storage were investigated when the hierarchical porous carbons were applied as electrode of EDLCs. The highest specific capacitance of 210 F g-1 (at 50 mA g-1) and excellent rate capability were achieved when the ACs possessing a proper micropores/non-micropores ratio. This work not only provides a promising method to recycle PCB, but also investigates the structure tailoring arts for a rational hierarchical porous structure in energy storage/conversion.

Novel Application of Glass Fibers Recovered From Waste Printed Circuit Boards as Sound and Thermal Insulation Material

Science.gov (United States)

Sun, Zhixing; Shen, Zhigang; Ma, Shulin; Zhang, Xiaojing

2013-10-01

The aim of this study is to investigate the feasibility of using glass fibers, a recycled material from waste printed circuit boards (WPCB), as sound absorption and thermal insulation material. Glass fibers were obtained through a fluidized-bed recycling process. Acoustic properties of the recovered glass fibers (RGF) were measured and compared with some commercial sound absorbing materials, such as expanded perlite (EP), expanded vermiculite (EV), and commercial glass fiber. Results show that RGF have good sound absorption ability over the whole tested frequency range (100-6400 Hz). The average sound absorption coefficient of RGF is 0.86, which is prior to those of EP (0.81) and EV (0.73). Noise reduction coefficient analysis indicates that the absorption ability of RGF can meet the requirement of II rating for sound absorbing material according to national standard. The thermal insulation results show that RGF has a fair low thermal conductivity (0.046 W/m K), which is comparable to those of some insulation materials (i.e., EV, EP, and rock wool). Besides, an empirical dependence of thermal conductivity on material temperature was determined for RGF. All the results showed that the reuse of RGF for sound and thermal insulation material provided a promising way for recycling WPCB and obtaining high beneficial products.

Eco-friendly copper recovery process from waste printed circuit boards using Fe³⁺/Fe²⁺ redox system.

Science.gov (United States)

Fogarasi, Szabolcs; Imre-Lucaci, Florica; Egedy, Attila; Imre-Lucaci, Árpád; Ilea, Petru

2015-06-01

The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe(3+) combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%. Copyright © 2015 Elsevier Ltd. All rights reserved.

Impact of DIY Home Manufacturing with 3D Printing on the Toy and Game Market

Directory of Open Access Journals (Sweden)

Emily E. Petersen

2017-07-01

Full Text Available The 2020 toy and game market is projected to be US$135 billion. To determine if 3D printing could affect these markets if consumers offset purchases by 3D printing free designs, this study investigates the 100 most popular downloaded designs at MyMiniFactory in a month. Savings are quantified for using a Lulzbot Mini 3D printer and three filament types: commercial filament, pellet-extruded filament, and post-consumer waste converted to filament with a recyclebot. Case studies probed the quality of: (1 six common complex toys; (2 Lego blocks; and (3 the customizability of open source board games. All filaments analyzed saved the user over 75% of the cost of commercially available true alternative toys and over 90% for recyclebot filament. Overall, these results indicate a single 3D printing repository among dozens is saving consumers well over $60 million/year in offset purchases. The most common savings fell by 40%–90% in total savings, which came with the ability to make novel toys and games. The results of this study show consumers can generate higher value items for less money using the open source distributed manufacturing paradigm. It appears clear that consumer do-it-yourself (DIY manufacturing is set to have a significant impact on the toy and game markets in the future.

Optical fabrication of lightweighted 3D printed mirrors

Science.gov (United States)

Herzog, Harrison; Segal, Jacob; Smith, Jeremy; Bates, Richard; Calis, Jacob; De La Torre, Alyssa; Kim, Dae Wook; Mici, Joni; Mireles, Jorge; Stubbs, David M.; Wicker, Ryan

2015-09-01

Direct Metal Laser Sintering (DMLS) and Electron Beam Melting (EBM) 3D printing technologies were utilized to create lightweight, optical grade mirrors out of AlSi10Mg aluminum and Ti6Al4V titanium alloys at the University of Arizona in Tucson. The mirror prototypes were polished to meet the λ/20 RMS and λ/4 P-V surface figure requirements. The intent of this project was to design topologically optimized mirrors that had a high specific stiffness and low surface displacement. Two models were designed using Altair Inspire software, and the mirrors had to endure the polishing process with the necessary stiffness to eliminate print-through. Mitigating porosity of the 3D printed mirror blanks was a challenge in the face of reconciling new printing technologies with traditional optical polishing methods. The prototypes underwent Hot Isostatic Press (HIP) and heat treatment to improve density, eliminate porosity, and relieve internal stresses. Metal 3D printing allows for nearly unlimited topological constraints on design and virtually eliminates the need for a machine shop when creating an optical quality mirror. This research can lead to an increase in mirror mounting support complexity in the manufacturing of lightweight mirrors and improve overall process efficiency. The project aspired to have many future applications of light weighted 3D printed mirrors, such as spaceflight. This paper covers the design/fab/polish/test of 3D printed mirrors, thermal/structural finite element analysis, and results.

Substitution within the Danish printing industry

DEFF Research Database (Denmark)

Larsen, Henrik Fred; Bøg, Carsten

2009-01-01

are running a substitution project. A major part of the work has been mapping the presence of chemicals which are potential candidates for substitution (e.g. PBT, CMR, vPvB, EDS) within the Danish printing industry and this work was recently finished. The mapping comprises a combination of a literature study......The implementation of the EU REACH regulation will most probably promote substitution within sectors handling a lot of different chemicals like the printing industry. With the aim of being at the cutting edge of this development the Danish EPA together with the Danish printing industry and IPU...... total 15 substances) were found in the Danish printing industry. This paper presents the results of the mapping of chemical candidates and the first results on preparing for actual substitutions....

Structuring of conductive silver line by electrohydrodynamic jet printing and its electrical characterization

International Nuclear Information System (INIS)

Lee, Dae-Young; Lee, Jae-Chang; Shin, Yun-Soo; Park, Sung-Eun; Kim, Yong-Jun; Hwang, Jungho; Yu, Tae-U

2008-01-01

A set of silver lines with a few hundred nanometers in thickness and with a few hundred micrometers in width were obtained using the electrohydrodynamic jet printing. The lines exhibited about three times higher resistivity (4.8 μΩcm) than that of bulk silver after thermal sintering process. The characteristic impedance of the silver line was about 18 Ω while the value calculated was 20 Ω. This paper demonstrated the possibility of using electrohydrodynamic jet printing of silver nanoparticles to obtain conductive line onto circuit boards.

Inkjet printing-based volumetric display projecting multiple full-colour 2D patterns

Science.gov (United States)

Hirayama, Ryuji; Suzuki, Tomotaka; Shimobaba, Tomoyoshi; Shiraki, Atsushi; Naruse, Makoto; Nakayama, Hirotaka; Kakue, Takashi; Ito, Tomoyoshi

2017-04-01

In this study, a method to construct a full-colour volumetric display is presented using a commercially available inkjet printer. Photoreactive luminescence materials are minutely and automatically printed as the volume elements, and volumetric displays are constructed with high resolution using easy-to-fabricate means that exploit inkjet printing technologies. The results experimentally demonstrate the first prototype of an inkjet printing-based volumetric display composed of multiple layers of transparent films that yield a full-colour three-dimensional (3D) image. Moreover, we propose a design algorithm with 3D structures that provide multiple different 2D full-colour patterns when viewed from different directions and experimentally demonstrate prototypes. It is considered that these types of 3D volumetric structures and their fabrication methods based on widely deployed existing printing technologies can be utilised as novel information display devices and systems, including digital signage, media art, entertainment and security.

Applying systems engineering in the civil engineering industry : an analysis of systems engineering projects of a Dutch water board

NARCIS (Netherlands)

de Graaf, R. S. (Robin); Vromen, R. M.(Rick); Boes, J. (Hans)

2017-01-01

The past decade, practice and literature have shown an increasing interest in Systems Engineering (SE) in the civil engineering industry. The aim of this study is to analyse to what extent SE is applied in six civil engineering SE projects of a Dutch water board. The projects were analysed using a

Integrated digital printing of flexible circuits for wireless sensing (Conference Presentation)

Science.gov (United States)

Mei, Ping; Whiting, Gregory L.; Schwartz, David E.; Ng, Tse Nga; Krusor, Brent S.; Ready, Steve E.; Daniel, George; Veres, Janos; Street, Bob

2016-09-01

Wireless sensing has broad applications in a wide variety of fields such as infrastructure monitoring, chemistry, environmental engineering and cold supply chain management. Further development of sensing systems will focus on achieving light weight, flexibility, low power consumption and low cost. Fully printed electronics provide excellent flexibility and customizability, as well as the potential for low cost and large area applications, but lack solutions for high-density, high-performance circuitry. Conventional electronics mounted on flexible printed circuit boards provide high performance but are not digitally fabricated or readily customizable. Incorporation of small silicon dies or packaged chips into a printed platform enables high performance without compromising flexibility or cost. At PARC, we combine high functionality c-Si CMOS and digitally printed components and interconnects to create an integrated platform that can read and process multiple discrete sensors. Our approach facilitates customization to a wide variety of sensors and user interfaces suitable for a broad range of applications including remote monitoring of health, structures and environment. This talk will describe several examples of printed wireless sensing systems. The technologies required for these sensor systems are a mix of novel sensors, printing processes, conventional microchips, flexible substrates and energy harvesting power solutions.

Internet of "printed" Things: low-cost fabrication of autonomous sensing nodes by inkjet printing

Science.gov (United States)

Kawahara, Yoshihiro

2014-11-01

"What if electronics devices are printed using an inkjet printer even at home?" "What if those devices no longer need a battery?" I will introduce two enabling technologies for the Internet of Things concept. 1. Instant Inkjet Circuits: A low cost, fast and accessible technology to support the rapid prototyping of electronic devices. We demonstrated that "sintering-free" silver nano particle ink with a commodity inkjet printer can be used to fabricate printed circuit board and high-frequency applications such as antennas and sensors. The technology is now commercialized by AgIC, Inc. 2. Wireless Power: Although large amounts of data can be exchanged over a wireless communication link, mobile devices are still tethered by power cables. We are trying to solve this problem by two different approaches: energy harvesting. A simple circuitry comprised of diodes and capacitor can convert ambient radio signals into DC current. Our research revealed the signals from TV tower located 6.5km apart could be used to feed 100 microwatts to power microcontrollers.

Co-recycling of acrylonitrile-butadiene-styrene waste plastic and nonmetal particles from waste printed circuit boards to manufacture reproduction composites.

Science.gov (United States)

Sun, Zhixing; Shen, Zhigang; Zhang, Xiaojing; Ma, Shulin

2015-01-01

This study investigated the feasibility of using acrylonitrile-butadiene-styrene (ABS) waste plastic and nonmetal particles from waste printed circuit boards (WPCB) to manufacture reproduction composites (RC), with the aim of co-recycling these two waste resources. The composites were prepared in a twin-crew extruder and investigated by means of mechanical testing, in situ flexural observation, thermogravimatric analysis, and dimensional stability evaluation. The results showed that the presence of nonmetal particles significantly improved the mechanical properties and the physical performance of the RC. A loading of 30 wt% nonmetal particles could achieve a flexural strength of 72.6 MPa, a flexural modulus of 3.57 GPa, and an impact strength of 15.5 kJ/m2. Moreover, it was found that the application of maleic anhydride-grafted ABS as compatilizer could effectively promote the interfacial adhesion between the ABS plastic and the nonmetal particles. This research provides a novel method to reuse waste ABS and WPCB nonmetals for manufacturing high value-added product, which represents a promising way for waste recycling and resolving the environmental problem.

Nonlinear dynamic response of a 'flexible-and-heavy' printed circuit board (PCB) to an impact load applied to its support contour

International Nuclear Information System (INIS)

Suhir, E; Vujosevic, M; Reinikainen, T

2009-01-01

Based on the developed simple and physically meaningful analytical ('mathematical') stress model, we evaluate some major parameters (amplitude, frequency, maximum acceleration, stresses and strains) of the response of a 'flexible-and-heavy' square simply supported printed circuit board (PCB) to an impact drop load applied to its support contour. The analysis is restricted to the first mode of vibrations and is carried out in application to the PCB design employed in an advanced accelerated test setup (test vehicle). This setup is aimed at the assessment of the performance, in accelerated test conditions on the board level, of packaging materials (and, first of all, BGA solder joint interconnections) subjected to dynamic (drop or shock) loading. It is anticipated that heavy masses could be mounted on the PCB to accelerate its dynamic response to an impact load. These masses are expected to be small in size, so that while changing the total mass of the board and generating significant inertia forces, they do not affect the board's flexural rigidity or its stiffness with respect to the in-plane loading. The PCB's contour is considered non-deformable, which is indeed the case in many practical situations. This circumstance, if the drop height and/or the induced inertia forces are significant, leads to elevated in-plane ('membrane') stresses in the PCB and, as a result of that, to the nonlinear response of the board to the impact load: the relationship between the magnitude of the load (determined by the initial impact velocity) and the induced PCB deflections becomes geometrically nonlinear, with a rigid cubic characteristic of the restoring force. The carried out numerical example, although reflects the characteristics of the PCB and loading conditions in an actual experimental setup, is merely an illustration of the general concept and is intended to demonstrate the abilities of the suggested method. Predictions based on this method agree well with the finite element

A combined system for 3D printing cybersecurity

Science.gov (United States)

Straub, Jeremy

2017-06-01

Previous work has discussed the impact of cybersecurity breaches on 3D printed objects. Multiple attack types that could weaken objects, make them unsuitable for certain applications and even create safety hazards have been presented. This paper considers a visible light sensing-based verification system's efficacy as a means of thwarting cybersecurity threats to 3D printing. This system detects discrepancies between expected and actual printed objects (based on an independent pristine CAD model). Whether reliance on an independent CAD model is appropriate is also considered. The future of 3D printing is projected and the importance of cybersecurity in this future is discussed.

Initial investment to 3D printing technologies in a construction company

Directory of Open Access Journals (Sweden)

Cernohorsky, Zdenek

2017-06-01

Full Text Available This article deals with an initial investment to 3D printing technologies in a construction company. The investment refers to the use of building information models and their integration with 3D printing technology within a construction company. In the first part, there will be discussed an introduction of 3D printing scheme in a construction company from a lifecycle perspective in general. As a part of this scheme, the ideal variant of an initial investment will be considered a.k.a a pilot project. In the second part, there will be a more detailed discussion of the pilot project, more about each activities which should be its parts and which should analyze cost categories. These categories will be about particular lifecycle stages of the pilot project. In the third part, a summary is done. This article could be a handout for a construction company in a term of an initial investment to 3D printing.

3D printed System-on-Package (SoP) for environmental sensing and localization applications

KAUST Repository

Zhen, Su

2017-12-22

This paper presents for the first time an innovative 3D printed SoP sensor node with temperature, pressure and humidity sensing capabilities. It has an integrated wireless readout through a near isotropic (900MHz) GSM antenna-on-package. This sensor node is connected to the internet for remote monitoring and has the capability of localization. The paper presents the design of antenna-on-package as well as details of the communication and localization system. Fabrication challenges unique to 3D printing and integration of electronics on 3D printed circuit board are also discussed. Finally, the paper presents measurement results of antenna radiation pattern, return loss, localization accuracy and accuracy of sensing parameters.

Morphology, mechanical and thermal oxidative aging properties of HDPE composites reinforced by nonmetals recycled from waste printed circuit boards.

Science.gov (United States)

Yang, Shuangqiao; Bai, Shibing; Wang, Qi

2016-11-01

In this study nonmetals recycled from waste printed circuit boards (NPCB) is used as reinforce fillers in high-density polyethylene (HDPE) composites. The morphology, mechanical and thermal oxidative aging properties of NPCB reinforced HDPE composites are assessed and it compared with two other commercial functional filler for the first time. Mechanical test results showed that NPCB could be used as reinforcing fillers in the HDPE composites and mechanical properties especially for stiffness is better than other two commercial fillers. The improved mechanical property was confirmed by the higher aspect ratio and strong interfacial adhesion in scanning electron microscopy (SEM) studies. The heat deflection temperature (HDT) test showed the presence of fiberglass in NPCB can improve the heat resistance of composite for their potential applications. Meanwhile, the oxidation induction time (OIT) and the Fourier transform infrared (FTIR) spectroscopy results showed that NPCB has a near resistance to oxidation as two other commercial fillers used in this paper. The above results show the reuse of NPCB in the HDPE composites represents a promising way for resolving both the environmental pollution and the high-value reuse of resources. Copyright © 2015. Published by Elsevier Ltd.

3D printing with RepRap cookbook

CERN Document Server

Salinas, Richard

2014-01-01

A systematic guide consisting of over 100 recipes which focus on helping you understand the process of 3D printing using RepRap machines. The book aims at providing professionals with a series of working recipes to help make their fuzzy notions into real, saleable projects/objects using 3D printing technology. This book is for novice designers and artists who own a RepRap-based 3D printer, have fundamental knowledge of its working, and who desire to gain better mastery of the printing process. For the more experienced user, it will provide a handy visual resource, with side-by-side comparisons

Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process

Science.gov (United States)

Mallik, S.; Bauer, R.; Hübner, F.; Ekere, N. N.

2011-01-01

Solder paste is the most widely used interconnection material in the electronic assembly process for attaching electronic components/devices directly onto the surface of printed circuit boards, using stencil printing process. This paper evaluates the performance of three different commercially available Sn-Ag-Cu solder pastes formulated with different particle size distributions (PSD), metal content and alloy composition. A series of stencil printing tests were carried out using a specially designed stencil of 75 μm thickness and apertures of 300×300 μm2 dimension and 500 μm pitch sizes. Solder paste printing behaviors were found related to attributes such as slumping and surface tension and printing performance was correlated with metal content and PSD. The results of the study should benefit paste manufacturers and SMT assemblers to improve their products and practices.

Digital Dentistry — 3D Printing Applications

Directory of Open Access Journals (Sweden)

Zaharia Cristian

2017-03-01

Full Text Available Three-dimensional (3D printing is an additive manufacturing method in which a 3D item is formed by laying down successive layers of material. 3D printers are machines that produce representations of objects either planned with a CAD program or scanned with a 3D scanner. Printing is a method for replicating text and pictures, typically with ink on paper. We can print different dental pieces using different methods such as selective laser sintering (SLS, stereolithography, fused deposition modeling, and laminated object manufacturing. The materials are certified for printing individual impression trays, orthodontic models, gingiva mask, and different prosthetic objects. The material can reach a flexural strength of more than 80 MPa. 3D printing takes the effectiveness of digital projects to the production phase. Dental laboratories are able to produce crowns, bridges, stone models, and various orthodontic appliances by methods that combine oral scanning, 3D printing, and CAD/CAM design. Modern 3D printing has been used for the development of prototypes for several years, and it has begun to find its use in the world of manufacturing. Digital technology and 3D printing have significantly elevated the rate of success in dental implantology using custom surgical guides and improving the quality and accuracy of dental work.

Real-time monitoring system for improving corona electrostatic separation in the process of recovering waste printed circuit boards.

Science.gov (United States)

Li, Jia; Zhou, Quan; Xu, Zhenming

2014-12-01

Although corona electrostatic separation is successfully used in recycling waste printed circuit boards in industrial applications, there are problems that cannot be resolved completely, such as nonmetal particle aggregation and spark discharge. Both of these problems damage the process of separation and are not easy to identify during the process of separation in industrial applications. This paper provides a systematic study on a real-time monitoring system. Weight monitoring systems were established to continuously monitor the separation process. A Virtual Instrumentation program written by LabVIEW was utilized to sample and analyse the mass increment of the middling product. It includes four modules: historical data storage, steady-state analysis, data computing and alarm. Three kinds of operating conditions were used to verify the applicability of the monitoring system. It was found that the system achieved the goal of monitoring during the separation process and realized the function of real-time analysis of the received data. The system also gave comprehensible feedback on the accidents of material blockages in the feed inlet and high-voltage spark discharge. With the warning function of the alarm system, the whole monitoring system could save the human cost and help the new technology to be more easily applied in industry. © The Author(s) 2014.

Comprehensive characterization of printed circuit boards of various end-of-life electrical and electronic equipment for beneficiation investigation.

Science.gov (United States)

Anshu Priya; Hait, Subrata

2018-05-01

Comprehensive characterization of printed circuit board (PCB) of end-of-life electrical and electronic equipment (EEE) is obligatory for prospective profitable beneficiation. In this study, beneficiation oriented comprehensive characterization of two brands of PCBs each of 16 end-of-life EEE was conducted in terms of their physicochemical characteristics with special emphasis on the content of 16 general elements, 2 precious metals and 15 rare earth elements (REEs). General elements and their highest weight percent composition found in different PCBs of the EEEs were Cu (23% in laptop), Al (6% in computer), Pb (15% in DVD player) and Ba (7% in TV). The high abundant of precious metals such as Au (316 g/ton) and Ag (636 g/ton) in mobile phone and laptop, respectively coupled with rapid obsolescence age makes waste PCBs of information technology and telecommunication equipment the most potent resource reservoir. Additionally, most of the waste PCBs were observed to contain REEs in considerable quantity with Sc up to 31 g/ton and Ce up to 13 g/ton being the major constituents. Comprehensive characterization of waste PCBs therefore will systematically help towards better understanding of e-waste recycling processes for beneficiation purpose and sustainable resource circulation and conservation. Copyright © 2018 Elsevier Ltd. All rights reserved.

Direct laser printing using viscous printer's ink

International Nuclear Information System (INIS)

Nasibov, A S; Bagramov, V G; Berezhnoi, K V

2006-01-01

The results of experiments on direct laser printing using viscous printer's ink with the help of a copper vapour laser (CVL)-based device are presented. The highly reflecting CVL cavity mirror was replaced by a spatial mirror modulator (SMM). Viscous printer's ink was used for printing. A pressure pulse produced at the boundary (on which an intensified and diminished image of the SMM was projected) between the ink and a transparency was used for transferring the ink to the plastic card. It was shown that the use of a CVL allowed a maximum printing speed of ∼80 cm 2 s -1 , a resolution of 625 dpi and up to 15 gradations. The dependence of the emission intensity of the element being projected (pixel) on its diameter is studied. It is shown that an increase in the brightness of this element with decreasing its size is caused by the summation of the laser and amplified radiation. (laser applications and other topics in quantum electronics)

The future of 3D printing technology in biomedicine

Directory of Open Access Journals (Sweden)

Iraj Nabipour

2015-07-01

Full Text Available 3D printing, one of the hottest cutting-edge interdisciplinary technologies, is projected to have revenue of $8.4 billion in 2020. #D printing technology will implement the concept of personalized medicine in medical healthcare industry and pharmaceutical fabrication. Organ printing, which it is defined as computer-aided, jet based 3D tissue-engineering of living human organs, is an interesting and challengeable field for 3D printing. Customized implants and prostheses can be produced in any imaginable geometry through the translation of radiological images of patients into digital.stl 3D print files. The creation of anatomical models based on the patient’s pathological conditions using 3D printing technologies would provide good models for training and to design surgical approaches. Hence, 3D printing not only will transform medical healthcare industry but also promises new converging technologies in the field of regenerative medicine.

Disassembly and physical separation of electric/electronic components layered in printed circuit boards (PCB).

Science.gov (United States)

Lee, Jaeryeong; Kim, Youngjin; Lee, Jae-chun

2012-11-30

Although printed circuit boards (PCBs) contain various elements, only the major elements (i.e., those with content levels in wt% or over grade) of and precious metals (e.g., Ag, Au, and platinum groups) contained within PCBs can be recycled. To recover other elements from PCBs, the PCBs should be properly disassembled as the first step of the recycling process. The recovery of these other elements would be beneficial for efforts to conserve scarce resources, reuse electric/electronic components (EECs), and eliminate environmental problems. This paper examines the disassembly of EECs from wasted PCBs (WPCBs) and the physical separation of these EECs using a self-designed disassembling apparatus and a 3-step separation process of sieving, magnetic separation, and dense medium separation. The disassembling efficiencies were evaluated by using the ratio of grinding area (E(area)) and the weight ratio of the detached EECs (E(weight)). In the disassembly treatment, these efficiencies were improved with an increase of grinder speed and grinder height. 97.7% (E(area)) and 98% (E(weight)) could be accomplished ultimately by 3 repetitive treatments at a grinder speed of 5500 rpm and a grinder height of 1.5mm. Through a series of physical separations, most groups of the EECs (except for the diode, transistor, and IC chip groups) could be sorted at a relatively high separation efficiency of about 75% or more. To evaluate the separation efficiency with regard to the elemental composition, the distribution ratio (R(dis)) and the concentration ratio (R(conc)) were used. 15 elements could be separated with the highest R(dis) and R(conc) in the same separated division. This result implies that the recyclability of the elements is highly feasible, even though the initial content in EECs is lower than several tens of mg/kg. Copyright © 2012 Elsevier B.V. All rights reserved.

Recycling of non-metallic fractions from waste printed circuit boards: A review

International Nuclear Information System (INIS)

Guo Jiuyong; Guo Jie; Xu Zhenming

2009-01-01

The major economic driving force for recycling of waste printed circuit boards (PCBs) is the value of the metallic fractions (MFs) of PCBs. The non-metallic fractions (NMFs), which take up almost 70 wt% of waste PCBs, were treated by combustion or land filling in the past. However, combustion of the NMFs will cause the formation of highly toxic polybrominated dibenzodioxins and dibenzofurans (PBDD/Fs) while land filling of the NMFs will lead to secondary pollution caused by heavy metals and brominated flame retardants (BFRs) leaching to the groundwater. Therefore, recycling of the NMFs from waste PCBs is drawing more and more attention from the public and the governments. Currently, how to recycle the NMFs environmental soundly has become a significant topic in recycling of waste PCBs. In order to fulfill the better resource utilization of the NMFs, the compositions and characteristics of the NMFs, methods and outcomes of recycling the NMFs from waste PCBs and analysis and treatment for the hazardous substances contained in the NMFs were reviewed in this paper. Thermosetting resin matrix composites, thermoplastic matrix composites, concrete and viscoelastic materials are main applications for physical recycling of the NMFs. Chemical recycling methods consisting of pyrolysis, gasification, supercritical fluids depolymerization and hydrogenolytic degradation can be used to convert the NMFs to chemical feedstocks and fuels. The toxicity characteristic leaching procedure (TCLP) and synthetic precipitation leaching procedure (SPLP) can be used to determine the toxicity characteristic (TC) of the NMFs and to evaluate the environmental safety of products made from the recycled NMFs. It is believed that physical recycling of the NMFs has been a promising recycling method. Much more work should be done to develop comprehensive and industrialized usage of the NMFs recycled by physical methods. Chemical recycling methods have the advantages in eliminating hazardous substances

Recycling of non-metallic fractions from waste printed circuit boards: A review

Energy Technology Data Exchange (ETDEWEB)

Guo Jiuyong; Guo Jie [School of Environmental Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240 (China); Xu Zhenming, E-mail: zmxu@sjtu.edu.cn [School of Environmental Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240 (China)

2009-09-15

The major economic driving force for recycling of waste printed circuit boards (PCBs) is the value of the metallic fractions (MFs) of PCBs. The non-metallic fractions (NMFs), which take up almost 70 wt% of waste PCBs, were treated by combustion or land filling in the past. However, combustion of the NMFs will cause the formation of highly toxic polybrominated dibenzodioxins and dibenzofurans (PBDD/Fs) while land filling of the NMFs will lead to secondary pollution caused by heavy metals and brominated flame retardants (BFRs) leaching to the groundwater. Therefore, recycling of the NMFs from waste PCBs is drawing more and more attention from the public and the governments. Currently, how to recycle the NMFs environmental soundly has become a significant topic in recycling of waste PCBs. In order to fulfill the better resource utilization of the NMFs, the compositions and characteristics of the NMFs, methods and outcomes of recycling the NMFs from waste PCBs and analysis and treatment for the hazardous substances contained in the NMFs were reviewed in this paper. Thermosetting resin matrix composites, thermoplastic matrix composites, concrete and viscoelastic materials are main applications for physical recycling of the NMFs. Chemical recycling methods consisting of pyrolysis, gasification, supercritical fluids depolymerization and hydrogenolytic degradation can be used to convert the NMFs to chemical feedstocks and fuels. The toxicity characteristic leaching procedure (TCLP) and synthetic precipitation leaching procedure (SPLP) can be used to determine the toxicity characteristic (TC) of the NMFs and to evaluate the environmental safety of products made from the recycled NMFs. It is believed that physical recycling of the NMFs has been a promising recycling method. Much more work should be done to develop comprehensive and industrialized usage of the NMFs recycled by physical methods. Chemical recycling methods have the advantages in eliminating hazardous substances

A technique for on-board CT reconstruction using both kilovoltage and megavoltage beam projections for 3D treatment verification

International Nuclear Information System (INIS)

Yin Fangfang; Guan Huaiqun; Lu Wenkai

2005-01-01

The technologies with kilovoltage (kV) and megavoltage (MV) imaging in the treatment room are now available for image-guided radiation therapy to improve patient setup and target localization accuracy. However, development of strategies to efficiently and effectively implement these technologies for patient treatment remains challenging. This study proposed an aggregated technique for on-board CT reconstruction using combination of kV and MV beam projections to improve the data acquisition efficiency and image quality. These projections were acquired in the treatment room at the patient treatment position with a new kV imaging device installed on the accelerator gantry, orthogonal to the existing MV portal imaging device. The projection images for a head phantom and a contrast phantom were acquired using both the On-Board Imager TM kV imaging device and the MV portal imager mounted orthogonally on the gantry of a Varian Clinac TM 21EX linear accelerator. MV projections were converted into kV information prior to the aggregated CT reconstruction. The multilevel scheme algebraic-reconstruction technique was used to reconstruct CT images involving either full, truncated, or a combination of both full and truncated projections. An adaptive reconstruction method was also applied, based on the limited numbers of kV projections and truncated MV projections, to enhance the anatomical information around the treatment volume and to minimize the radiation dose. The effects of the total number of projections, the combination of kV and MV projections, and the beam truncation of MV projections on the details of reconstructed kV/MV CT images were also investigated

Computer aided production of manufacturing CAMAC-wired boards by the multiwire-technique

Energy Technology Data Exchange (ETDEWEB)

Martini, M; Brehmer, W

1975-10-01

The multiwire-technique is a computer controlled wiring method for the manufacturing of circuit boards with insulated conductors. The technical data for production are dimensional drawings of the board and a list of all points which are to be connected. The listing must be in absolute co-ordinates including a list of all soldering points for component parts and a reproducible print pattern for inscription. For this wiring method a CAMAC standard board, a layout plan with alpha-numeric symbols, and a computer program which produces the essential technical data were developed. A description of the alpha-numeric symbols, the quality of the program, recognition and checking of these symbols, and the produced technical data is presented. (auth)

Structural Integration of Silicon Solar Cells and Lithium-ion Batteries Using Printed Electronics

Science.gov (United States)

Kang, Jin Sung

Inkjet printing of electrode using copper nanoparticle ink is presented. Electrode was printed on a flexible glass epoxy composite substrate using drop on demand piezoelectric dispenser and was sintered at 200°C in N 2 gas condition. The printed electrodes were made with various widths and thicknesses. Surface morphology of electrode was analyzed using scanning electron microscope (SEM) and atomic force microscope (AFM). Reliable dimensions for printed electronics were found from this study. Single-crystalline silicon solar cells were tested under four-point bending to find the feasibility of directly integrating them onto a carbon fiber/epoxy composite laminate. These solar cells were not able to withstand 0.2% strain. On the other hand, thin-film amorphous silicon solar cells were subjected to flexural fatigue loadings. The current density-voltage curves were analyzed at different cycles, and there was no noticeable degradation on its performance up to 100 cycles. A multifunctional composite laminate which can harvest and store solar energy was fabricated using printed electrodes. The integrated printed circuit board (PCB) was co-cured with a carbon/epoxy composite laminate by the vacuum bag molding process in an autoclave; an amorphous silicon solar cell and a thin-film solid state lithium-ion (Li-ion) battery were adhesively joined and electrically connected to a thin flexible PCB; and then the passive components such as resistors and diodes were electrically connected to the printed circuit board by silver pasting. Since a thin-film solid state Li-ion battery was not able to withstand tensile strain above 0.4%, thin Li-ion polymer batteries were tested under various mechanical loadings and environmental conditions to find the feasibility of using the polymer batteries for our multifunctional purpose. It was found that the Li-ion polymer batteries were stable under pressure and tensile loading without any noticeable degradation on its charge and discharge

EARLY ENGLISH PRINTING AND THE HANDS OF COMPOSITORS

Directory of Open Access Journals (Sweden)

Satoko Tokunaga

2005-12-01

Full Text Available This paper examines soine distinctive uses of typefaces by Caxton's compositors in his early products at Westminster and illustrates how useful such examples are in revealing the chronology of actual book production, as well as in identifying the compositors at work on individual volumes. An exhaustive analysis of early printed books can provide us with information about compositors at work in England's earliest printing house. This paper therefore argues that it is inost definitely worth considering such 'inechaiiical' aspects of book design as typography when editing any printed text, and introduces most recent research results contributed by a project at Keio University, which airns to establish a semiautomatic system that can transcribe every feature of the printed text including even minute differences in types.

Design of electrohydrodynamic lens for stabilizing of eletrohydrodynamic jet printing

International Nuclear Information System (INIS)

Park, Sung-Eun; Lee, Dae-Young; Kim, Sang-Yoon; Shin, Yoon-Soo; Hwang, Jungho; Yu, Tae-U

2008-01-01

The generation of micro patterns from conductive material suspensions is gaining significant interests for its usages in the fabrication of flexible display elements and flexible printed circuit boards. In this paper, we presented the results of line patterns of silver nanoparticles obtained by using various types of focusing lenses for electrohydrodynamic jet printing. The pattern widths were measured as 80∼100 μm when the electrohydrodynamic lens having a cone-type inner hole and a cone-type outer wall was used. Electric field strengths were calculated by a commercial solver packages for the four types of electrohydrodynamic lenses. A lens having a cone-type inner hole and a cone-type outer wall of thinner thickness was found to be the best design.

Potentials for Improvement of Resource Efficiency in Printed Circuit Board Manufacturing: A Case Study Based on Material Flow Cost Accounting

Directory of Open Access Journals (Sweden)

Yi-Xuan Wang

2017-05-01

Full Text Available The pursuit of sustainable resource use by manufacturing companies is driven by resource scarcity, environmental awareness, and cost savings potentials. To address these issues, Material Flow Cost Accounting (MFCA has been developed and applied as an effective environmental management tool. Within MFCA’s general allocation, the accounts of products and losses are overrated by weight or volume. However, such a method is incompatible with Printed Circuit Board (PCB manufacturing because of industry characteristics in which primary inputs and products are measured by area. Based on MFCA, this case study systematically established several linear cost calculation models along the production process for capturing the actual waste flows as well as performing cost-benefit analysis. The recognition of previously ignored losses offered the incentive to find appropriate indicators to conduct cost-benefit analysis on hotspots for losses. Loss identification and analysis indicated that machining and wiring are the necessities and priorities of process optimization for resource efficiency improvement measures. Therefore, this research could not only advance the achievement of a profitable and sustainable production while improving resource efficiency at the source but could also provide support for decision making in PCB manufacturing.

Latin American Folk Art Prints

Science.gov (United States)

Navah, Jan

2011-01-01

Latin American customs and colors play an important role as second graders are introduced to multicultural experiences through food, music, dance, art, and craft. In this article, the author describes a printing project inspired by Guatemalan weavings and amate bark paintings. (Contains 2 online resources.)

Print Quality of Ink Jet Printed PVC Foils

Directory of Open Access Journals (Sweden)

Nemanja Kašiković

2015-09-01

Full Text Available Digital printing technique is used for a wide variety of substrates, one of which are PVC foils. Samples used in this research were printed by digital ink jet printing technique using Mimaki JV22 printing machine and J-Eco Subly Nano inks. As printing substrates, two different types of materials were used (ORACAL 640 - Print Vinyl and LG Hausys LP2712. A test card consisting of fields of CMYK colours was created and printed, varying the number of ink layers applied. Samples were exposed to light after the printing process. Spectrophotometric measurements were conducted before and after the light treatment. Based on spectrophotometricaly obtained data, colour differences ΔE2000 were calculated. Results showed that increasing number of layers, as well as the right choice of substrates, can improve the behaviour of printed product during exploitation.

3D Printing All-Aromatic Polyimides using Mask-Projection Stereolithography: Processing the Nonprocessable.

Science.gov (United States)

Hegde, Maruti; Meenakshisundaram, Viswanath; Chartrain, Nicholas; Sekhar, Susheel; Tafti, Danesh; Williams, Christopher B; Long, Timothy E

2017-08-01

High-performance, all-aromatic, insoluble, engineering thermoplastic polyimides, such as pyromellitic dianhydride and 4,4'-oxydianiline (PMDA-ODA) (Kapton), exhibit exceptional thermal stability (up to ≈600 °C) and mechanical properties (Young's modulus exceeding 2 GPa). However, their thermal resistance, which is a consequence of the all-aromatic molecular structure, prohibits processing using conventional techniques. Previous reports describe an energy-intensive sintering technique as an alternative technique for processing polyimides with limited resolution and part fidelity. This study demonstrates the unprecedented 3D printing of PMDA-ODA using mask-projection stereolithography, and the preparation of high-resolution 3D structures without sacrificing bulk material properties. Synthesis of a soluble precursor polymer containing photo-crosslinkable acrylate groups enables light-induced, chemical crosslinking for spatial control in the gel state. Postprinting thermal treatment transforms the crosslinked precursor polymer to PMDA-ODA. The dimensional shrinkage is isotropic, and postprocessing preserves geometric integrity. Furthermore, large-area mask-projection scanning stereolithography demonstrates the scalability of 3D structures. These unique high-performance 3D structures offer potential in fields ranging from water filtration and gas separation to automotive and aerospace technologies. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Prototype board development for the validation of the VMM ASICs for the New Small Wheel ATLAS upgrade project

CERN Document Server

Gkountoumis, Panagiotis; The ATLAS collaboration

2018-01-01

The VMM is a custom Application Specific Integrated Circuit (ASIC) which was designed to be used in the front-end readout electronics of both micromegas (MM) and small Thin Gap Chambers (sTGC) detectors of the New Small Wheel (NSW) Phase-I upgrade project of the ATLAS experiment. A new version of the VMM was recently fabricated and for that reason various prototype boards, the micromegas Front-End (MMFE1) and the General Purpose VMM (GPVMM), have been fabricated and extensively tested in order to validate the functionality of the ASIC. These boards use commercial Field Programmable Gate Arrays (FPGAs) for direct communication with computers which is achieved through 10/100/1000 Mbps Ethernet and UDP/IP protocols. The low noise performance of these boards gave the opportunity to be used in various test beams with micromegas detectors for validating the VMM and for performance studies of the sTGC detectors. A detailed description of the boards along with the results of the test beam and the detector studies wi...

Prototype board development for the validation of the VMM ASICs for the New Small Wheel ATLAS upgrade project

CERN Document Server

Gkountoumis, Panagiotis; The ATLAS collaboration

2018-01-01

The VMM is a custom Application Specific Integrated Circuit (ASIC) which was designed to be used in the frontend readout electronics of both micromegas (MM) and small Thin Gap Chambers (sTGC) detectors of the New Small Wheel (NSW) Phase-I upgrade project of the ATLAS experiment. A new version of the VMM was recently fabricated and for that reason various prototype boards, the micromegas Front-End (MMFE1) and the General Purpose VMM (GPVMM), have been fabricated and extensively tested in order to validate the functionality of the ASIC. These boards use commercial Field Programmable Gate Arrays (FPGAs) for direct communication with computers which is achieved through 10=100=1000 Mbps Ethernet and UDP/IP protocols. The low noise performance of these boards gave the opportunity to be used in various test beams with micormegas detectors for validating the VMM and for performance studies of the sTGC detectors. A detailed description of the boards along with the results of the test beam and the detector studies will...

Eco-friendly copper recovery process from waste printed circuit boards using Fe{sup 3+}/Fe{sup 2+} redox system

Energy Technology Data Exchange (ETDEWEB)

Fogarasi, Szabolcs [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Imre-Lucaci, Florica [Babeş-Bolyai University, Interdisciplinary Research Institute on Bio-Nano-Sciences, 42 Treboniu Laurian Street, Cluj-Napoca RO-400271 (Romania); Egedy, Attila [University of Pannonia, Department of Process Engineering, Egyetem Str. 10, H-8200 Veszprém (Hungary); Imre-Lucaci, Árpád, E-mail: aimre@chem.ubbcluj.ro [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Ilea, Petru [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania)

2015-06-15

Highlights: • We developed an ecofriendly mediated electrochemical process for copper recovery. • The recovery of copper was achieved without mechanical pretreatment of the samples. • We identified the optimal flow rate for the leaching and electrowinning of copper. • The copper content of the obtained cathodic deposits was over 99.9%. - Abstract: The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe{sup 3+} combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%.

Application of vacuum metallurgy to separate pure metal from mixed metallic particles of crushed waste printed circuit board scraps.

Science.gov (United States)

Zhan, Lu; Xu, Zhenming

2008-10-15

The principle of separating pure metal from mixed metallic particles (MMPs) byvacuum metallurgy is that the vapor pressures of various metals at the same temperature are different As a result, the metal with high vapor pressure and low boiling point can be separated from the mixed metals through distillation or sublimation, and then it can be recycled through condensation under a certain condition. The vacuum metallurgy separation (VMS) of MMPs of crushed waste printed circuit boards (WPCBs) has been studied in this paper. Theoretical analyses show that the MMPs (copper, zinc, bismuth, lead, and indium, for example) can be separated by vacuum metallurgy. The copper particles (0.15-0.20 mm) and zinc particles (<0.30 mm) were chosen to simulate the MMPs of crushed WPCBs. Experimental results show that the separated efficiency of zinc in the copper-rich particles achieves 96.19 wt % when the vacuum pressure is 0.01-0.10 Pa, the heating temperature is 1123 K, and the heating time is 105 min. Under this operation condition, the separated efficiency of zinc in the copper-rich particles from crushed WPCBs achieves 97.00 wt % and the copper purity increases from 90.68 to 99.84 wt %.

Novel materials for electronic device fabrication using ink-jet printing technology

International Nuclear Information System (INIS)

Kumashiro, Yasushi; Nakako, Hideo; Inada, Maki; Yamamoto, Kazunori; Izumi, Akira; Ishihara, Masamichi

2009-01-01

Novel materials and a metallization technique for the printed electronics were studied. Insulator inks and conductive inks were investigated. For the conductive ink, the nano-sized copper particles were used as metallic sources. These particles were prepared from a copper complex by a laser irradiation process in the liquid phase. Nano-sized copper particles were consisted of a thin copper oxide layer and a metal copper core wrapped by the layer. The conductive ink showed good ink-jettability. In order to metallize the printed trace of the conductive ink on a substrate, the atomic hydrogen treatment was carried out. Atomic hydrogen was generated on a heated tungsten wire and carried on the substrate. The temperature of the substrate was up to 60 deg. C during the treatment. After the treatment, the conductivity of a copper trace was 3 μΩ cm. It was considered that printed wiring boards can be easily fabricated by employing the above materials.

Printed Spacecraft Separation System

Energy Technology Data Exchange (ETDEWEB)

Dehoff, Ryan R [ORNL; Holmans, Walter [Planetary Systems Corporation

2016-10-01

In this project Planetary Systems Corporation proposed utilizing additive manufacturing (3D printing) to manufacture a titanium spacecraft separation system for commercial and US government customers to realize a 90% reduction in the cost and energy. These savings were demonstrated via “printing-in” many of the parts and sub-assemblies into one part, thus greatly reducing the labor associated with design, procurement, assembly and calibration of mechanisms. Planetary Systems Corporation redesigned several of the components of the separation system based on additive manufacturing principles including geometric flexibility and the ability to fabricate complex designs, ability to combine multiple parts of an assembly into a single component, and the ability to optimize design for specific mechanical property targets. Shock absorption was specifically targeted and requirements were established to attenuate damage to the Lightband system from shock of initiation. Planetary Systems Corporation redesigned components based on these requirements and sent the designs to Oak Ridge National Laboratory to be printed. ORNL printed the parts using the Arcam electron beam melting technology based on the desire for the parts to be fabricated from Ti-6Al-4V based on the weight and mechanical performance of the material. A second set of components was fabricated from stainless steel material on the Renishaw laser powder bed technology due to the improved geometric accuracy, surface finish, and wear resistance of the material. Planetary Systems Corporation evaluated these components and determined that 3D printing is potentially a viable method for achieving significant cost and savings metrics.

Bioleaching of Gold and Silver from Waste Printed Circuit Boards by Pseudomonas balearica SAE1 Isolated from an e-Waste Recycling Facility.

Science.gov (United States)

Kumar, Anil; Saini, Harvinder Singh; Kumar, Sudhir

2018-02-01

Indigenous bacterial strain Pseudomonas balearica SAE1, tolerant to e-waste toxicity was isolated from an e-waste recycling facility Exigo Recycling Pvt. Ltd., India. Toxicity tolerance of bacterial strain was analyzed using crushed (particle size ≤150 µm) waste computer printed circuit boards (PCBs)/liter (L) of culture medium. The EC 50 value for SAE1 was 325.7 g/L of the e-waste pulp density. Two-step bioleaching was then applied to achieve the dissolution of gold (Au) and silver (Ag) from the e-waste. To maximize precious metal dissolution, factors including pulp density, glycine concentration, pH level, and temperature were optimized. The optimization resulted in 68.5 and 33.8% of Au and Ag dissolution, respectively, at a pH of 9.0, a pulp density of 10 g/L, a temperature of 30 °C, and a glycine concentration of 5 g/L. This is the first study of Au and Ag bioleaching using indigenous e-waste bacteria and its analysis to determine e-waste toxicity tolerance.

Ultra-Wideband Printed Slot Radiators with Controllable Frequency Characteristics

Directory of Open Access Journals (Sweden)

S. L. Chernyshev

2015-01-01

Full Text Available We have studied the possibility of creating ultra-wideband (UWB antennas with controlled frequency response of matching based on the printed slot antenna Vivaldi by introducing controlled resonators directly into the structure of the radiator. In the area of irregular slotline there are printed switched resonators with variable capacitance (varactor model, which allow tuning the frequency characteristics for each state of switching cavities, providing bandpass and band-barrage properties of the antenna. The investigation of reconfigurable printed resonators in the system of reconfigurable resonators of a bandpass filter is conducted. The paper considers filter to provide restructuring in the band (3-9 GHz. Electrodynamic simulation of the device was carried out in the time domain using a finite integration method. A bandstop reconfigurable filter is also investigated. The filter located on the substrate opposite the slit is based on tunable L-shaped resonator that has one end connected to the short-circuitor through the board metallization; the other end remains open and is brought into the region of interaction with the slotline. Such filter provides an effective narrow-band suppression and can be easily tuned to the desired frequency channel. The combination of these two types of filters allows you to create a controlled print Vivaldi slot antenna with combined properties. The paper investigates parameters of the scattering and radiation pattern of the antenna in different modes.

CityInfo Boards : a new marketing communications tool

OpenAIRE

Tähkäpää, Matti

2012-01-01

New CityInfo boards were introduced in December 2009. This project was executed in cooperation with City of Turku and Veikkaus. The objective of this pilot project was to clean up the cityscape as well as support the local sports and culture organizations that are organizing events in Turku. CityInfo boards are divided into three sections; top of the is reserved for welcome greeting of Turku, right side of the board has the logo of Veikkaus, and the left side has electronic screen with changi...

REACH-related substitution within the Danish printing industry

DEFF Research Database (Denmark)

Larsen, Henrik Fred; Bøg, Carsten; Markussen, Helene

are running a substitution project. A major part of the work has been mapping the presence of chemicals which are potential candidates for substitution (e.g. PBT, CMR, vPvB, EDS) within the Danish printing industry. The mapping comprises a combination of a literature study and an investigation of the actual......The accomplishment of the EU REACH regulation will most probably promote substitution within sectors handling a lot of different chemicals like the printing industry. With the aim of being at the cutting edge of this development the Danish EPA together with the Danish printing industry and IPU...... fulfil one or more of the criteria (e.g. CMR, EDS) for the REACH Annex XIV candidate list (authorisation). The paper presents the results of the mapping of chemical candidates and the first results of the actual substitutions. Keywords: REACH, chemicals, substitution, printing industry....

High-Speed On-Board Data Processing Platform for LIDAR Projects at NASA Langley Research Center

Science.gov (United States)

Beyon, J.; Ng, T. K.; Davis, M. J.; Adams, J. K.; Lin, B.

2015-12-01

The project called High-Speed On-Board Data Processing for Science Instruments (HOPS) has been funded by NASA Earth Science Technology Office (ESTO) Advanced Information Systems Technology (AIST) program during April, 2012 - April, 2015. HOPS is an enabler for science missions with extremely high data processing rates. In this three-year effort of HOPS, Active Sensing of CO2 Emissions over Nights, Days, and Seasons (ASCENDS) and 3-D Winds were of interest in particular. As for ASCENDS, HOPS replaces time domain data processing with frequency domain processing while making the real-time on-board data processing possible. As for 3-D Winds, HOPS offers real-time high-resolution wind profiling with 4,096-point fast Fourier transform (FFT). HOPS is adaptable with quick turn-around time. Since HOPS offers reusable user-friendly computational elements, its FPGA IP Core can be modified for a shorter development period if the algorithm changes. The FPGA and memory bandwidth of HOPS is 20 GB/sec while the typical maximum processor-to-SDRAM bandwidth of the commercial radiation tolerant high-end processors is about 130-150 MB/sec. The inter-board communication bandwidth of HOPS is 4 GB/sec while the effective processor-to-cPCI bandwidth of commercial radiation tolerant high-end boards is about 50-75 MB/sec. Also, HOPS offers VHDL cores for the easy and efficient implementation of ASCENDS and 3-D Winds, and other similar algorithms. A general overview of the 3-year development of HOPS is the goal of this presentation.

A miniature rigid/flex salinity measurement device fabricated using printed circuit processing techniques

International Nuclear Information System (INIS)

Broadbent, H A; Ketterl, T P; Reid, C S

2010-01-01

The design, fabrication and initial performance of a single substrate, miniature, low-cost conductivity, temperature, depth (CTD) sensor board with interconnects are presented. In combination these sensors measure ocean salinity. The miniature CTD device board was designed and fabricated as the main component of a 50 mm × 25 mm × 25 mm animal-attached biologger. The board was fabricated using printed circuit processes and consists of two distinct regions on a continuous single liquid crystal polymer substrate: an 18 mm × 28 mm rigid multi-metal sensor section and a 72 mm long flexible interconnect section. The 95% confidence intervals for the conductivity, temperature and pressure sensors were demonstrated to be ±0.083 mS cm −1 , 0.01 °C, and ±0.135 dbar, respectively.

Internet of ''printed'' Things: low-cost fabrication of autonomous sensing nodes by inkjet printing

International Nuclear Information System (INIS)

Kawahara, Yoshihiro

2014-01-01

''What if electronics devices are printed using an inkjet printer even at home?'' ''What if those devices no longer need a battery?'' I will introduce two enabling technologies for the Internet of Things concept. 1. Instant Inkjet Circuits: A low cost, fast and accessible technology to support the rapid prototyping of electronic devices. We demonstrated that ''sintering-free'' silver nano particle ink with a commodity inkjet printer can be used to fabricate printed circuit board and high-frequency applications such as antennas and sensors. The technology is now commercialized by AgIC, Inc. 2. Wireless Power: Although large amounts of data can be exchanged over a wireless communication link, mobile devices are still tethered by power cables. We are trying to solve this problem by two different approaches: energy harvesting. A simple circuitry comprised of diodes and capacitor can convert ambient radio signals into DC current. Our research revealed the signals from TV tower located 6.5km apart could be used to feed 100 microwatts to power microcontrollers

Thermal Stability of Nanocrystalline Copper for Potential Use in Printed Wiring Board Applications

Science.gov (United States)

Woo, Patrick Kai Fai

Copper is a widely used conductor in the manufacture of printed wiring boards (PWB). The trends in miniaturization of electronic devices create increasing challenges to all electronic industries. In particular PWB manufacturers face great challenges because the increasing demands in greater performance and device miniaturization pose enormous difficulties in manufacturing and product reliability. Nanocrystalline and ultra-fine grain copper can potentially offer increased reliability and functionality of the PWB due to the increases in strength and achievable wiring density by reduction in grain size. The first part of this thesis is concerned with the synthesis and characterization of nanocrystalline and ultra-fine grain-sized copper for potential applications in the PWB industry. Nanocrystalline copper with different amounts of sulfur impurities (25-230ppm) and grain sizes (31-49nm) were produced and their hardness, electrical resistivity and etchability were determined. To study the thermal stability of nanocrystalline copper, differential scanning calorimetry and isothermal heat treatments combined with electron microscopy techniques for microstructural analysis were used. Differential scanning calorimetry was chosen to continuously monitor the grain growth process in the temperature range from 40?C to 400?C. During isothermal annealing experiments samples were annealed at 23?C, 100?C and 300?C to study various potential thermal issues for these materials in PWB applications such as the long-term room temperature thermal stability as well as for temperature excursions above the operation temperature and peak temperature exposure during the PWB manufacturing process. From all annealing experiments the various grain growth events and the overall stability of these materials were analyzed in terms of driving and dragging forces. Experimental evidence is presented which shows that the overall thermal stability, grain boundary character and texture evolution of

Augmentation of board games using smartphones

DEFF Research Database (Denmark)

Kulsinskas, Arturas; Balan, Catalin; Egede Bukdahl, Nicholas

2015-01-01

This paper contains details about research into the effect of digital augmentation on social presence in board games. A case study of the board game Tobago was performed during the project and a prototype application for smartphones was developed in order to compare the players’ social presence...

High-speed autoverifying technology for printed wiring boards

Science.gov (United States)

Ando, Moritoshi; Oka, Hiroshi; Okada, Hideo; Sakashita, Yorihiro; Shibutani, Nobumi

1996-10-01

We have developed an automated pattern verification technique. The output of an automated optical inspection system contains many false alarms. Verification is needed to distinguish between minor irregularities and serious defects. In the past, this verification was usually done manually, which led to unsatisfactory product quality. The goal of our new automated verification system is to detect pattern features on surface mount technology boards. In our system, we employ a new illumination method, which uses multiple colors and multiple direction illumination. Images are captured with a CCD camera. We have developed a new algorithm that uses CAD data for both pattern matching and pattern structure determination. This helps to search for patterns around a defect and to examine defect definition rules. These are processed with a high speed workstation and a hard-wired circuits. The system can verify a defect within 1.5 seconds. The verification system was tested in a factory. It verified 1,500 defective samples and detected all significant defects with only a 0.1 percent of error rate (false alarm).

Adaptive Signal Processing Testbed: VME-based DSP board market survey

Science.gov (United States)

Ingram, Rick E.

1992-04-01

The Adaptive Signal Processing Testbed (ASPT) is a real-time multiprocessor system utilizing digital signal processor technology on VMEbus based printed circuit boards installed on a Sun workstation. The ASPT has specific requirements, particularly as regards to the signal excision application, with respect to interfacing with current and planned data generation equipment, processing of the data, storage to disk of final and intermediate results, and the development tools for applications development and integration into the overall EW/COM computing environment. A prototype ASPT was implemented using three VME-C-30 boards from Applied Silicon. Experience gained during the prototype development led to the conclusions that interprocessor communications capability is the most significant contributor to overall ASPT performance. In addition, the host involvement should be minimized. Boards using different processors were evaluated with respect to the ASPT system requirements, pricing, and availability. Specific recommendations based on various priorities are made as well as recommendations concerning the integration and interaction of various tools developed during the prototype implementation.

Francis Bacon's New Science: Rhetoric and the Transformative Power of Print.

Science.gov (United States)

Heckel, David

The process of projecting textual models onto the phenomenal world began with the invention of writing and accelerated through the manuscript culture of classical antiquity and the Middle Ages into the age of print. In Francis Bacon's work, the book (a metaphor for the phenomenal world) adapted to the demands of the printed text and reflects the…

A laser printing based approach for printed electronics

Energy Technology Data Exchange (ETDEWEB)

Zhang, T.; Hu, M.; Guo, Q.; Zhang, W.; Yang, J., E-mail: jyang@eng.uwo.ca [Department of Mechanical and Materials Engineering, Western University, London N6A 3K7 (Canada); Liu, Y.; Lau, W. [Chengdu Green Energy and Green Manufacturing Technology R& D Center, 355 Tengfei Road, 620107 Chengdu (China); Wang, X. [Department of Mechanical and Materials Engineering, Western University, London N6A 3K7 (Canada); Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000 (China)

2016-03-07

Here we report a study of printing of electronics using an office use laser printer. The proposed method eliminates those critical disadvantages of solvent-based printing techniques by taking the advantages of electroless deposition and laser printing. The synthesized toner acts as a catalyst for the electroless copper deposition as well as an adhesion-promoting buffer layer between the substrate and deposited copper. The easy metallization of printed patterns and strong metal-substrate adhesion make it an especially effective method for massive production of flexible printed circuits. The proposed process is a high throughput, low cost, efficient, and environmentally benign method for flexible electronics manufacturing.

A laser printing based approach for printed electronics

International Nuclear Information System (INIS)

Zhang, T.; Hu, M.; Guo, Q.; Zhang, W.; Yang, J.; Liu, Y.; Lau, W.; Wang, X.

2016-01-01

Here we report a study of printing of electronics using an office use laser printer. The proposed method eliminates those critical disadvantages of solvent-based printing techniques by taking the advantages of electroless deposition and laser printing. The synthesized toner acts as a catalyst for the electroless copper deposition as well as an adhesion-promoting buffer layer between the substrate and deposited copper. The easy metallization of printed patterns and strong metal-substrate adhesion make it an especially effective method for massive production of flexible printed circuits. The proposed process is a high throughput, low cost, efficient, and environmentally benign method for flexible electronics manufacturing.

An inkjet-printed buoyant 3-D lagrangian sensor for real-time flood monitoring

KAUST Repository

Farooqui, Muhammad Fahad

2014-06-01

A 3-D (cube-shaped) Lagrangian sensor, inkjet printed on a paper substrate, is presented for the first time. The sensor comprises a transmitter chip with a microcontroller completely embedded in the cube, along with a $1.5 \\\\lambda 0 dipole that is uniquely implemented on all the faces of the cube to achieve a near isotropic radiation pattern. The sensor has been designed to operate both in the air as well as water (half immersed) for real-time flood monitoring. The sensor weighs 1.8 gm and measures 13 mm$\\\\,\\\\times\\\\,$ 13 mm$\\\\,\\\\times\\\\,$ 13 mm, and each side of the cube corresponds to only $0.1 \\\\lambda 0 (at 2.4 GHz). The printed circuit board is also inkjet-printed on paper substrate to make the sensor light weight and buoyant. Issues related to the bending of inkjet-printed tracks and integration of the transmitter chip in the cube are discussed. The Lagrangian sensor is designed to operate in a wireless sensor network and field tests have confirmed that it can communicate up to a distance of 100 m while in the air and up to 50 m while half immersed in water. © 1963-2012 IEEE.

SPRINT - An Interactive System for Printed Circuit Board Design User’s Guide.

Science.gov (United States)

1977-06-01

effect as decreasing the time limit - your priority and turnaround time are improved. B) You have a very large circuit and an error message says...previous segment. If no path is found, a message is printed to that effect . If HIWIRE thinks the failure may have been due to too small a value of...USAF Academy, Colorado 80840 AUL/LSE-9663 Maxwell AFB, Alabama 36112 AFETR Technical Library P.O. Box 4608, MU 5650 Patrick AFB

Optimizing the operating parameters of corona electrostatic separation for recycling waste scraped printed circuit boards by computer simulation of electric field.

Science.gov (United States)

Li, Jia; Lu, Hongzhou; Liu, Shushu; Xu, Zhenming

2008-05-01

The printed circuit board (PCB) has a metal content of nearly 28% metal, including an abundance of nonferrous metals such as copper, lead, and tin. The purity of precious metals in PCBs is more than 10 times that of rich-content minerals. Therefore, the recycling of PCBs is an important subject, not only from the viewpoint of waste treatment, but also with respect to the recovery of valuable materials. Compared with traditional process the corona electrostatic separation (CES) had no waste water or gas during the process and it had high productivity with a low-energy cost. In this paper, the roll-type corona electrostatic separator was used to separate metals and nonmetals from scraped waste PCBs. The software MATLAB was used to simulate the distribution of electric field in separating space. It was found that, the variations of parameters of electrodes and applied voltages directly influenced the distribution of electric field. Through the correlation of simulated and experimental results, the good separation results were got under the optimized operating parameter: U=20-30 kV, L=L(1)=L(2)=0.21 m, R(1)=0.114, R(2)=0.019 m, theta(1)=20 degrees and theta(2)=60 degrees .

Use of large pieces of printed circuit boards for bioleaching to avoid 'precipitate contamination problem' and to simplify overall metal recovery.

Science.gov (United States)

Adhapure, N N; Dhakephalkar, P K; Dhakephalkar, A P; Tembhurkar, V R; Rajgure, A V; Deshmukh, A M

2014-01-01

Very recently bioleaching has been used for removing metals from electronic waste. Most of the research has been targeted to using pulverized PCBs for bioleaching where precipitate formed during bioleaching contaminates the pulverized PCB sample and making the overall metal recovery process more complicated. In addition to that, such mixing of pulverized sample with precipitate also creates problems for the final separation of non metallic fraction of PCB sample. In the present investigation we attempted the use of large pieces of printed circuit boards instead of pulverized sample for removal of metals. Use of large pieces of PCBs for bioleaching was restricted due to the chemical coating present on PCBs, the problem has been solved by chemical treatment of PCBs prior to bioleaching. In short,•Large pieces of PCB can be used for bioleaching instead of pulverized PCB sample.•Metallic portion on PCBs can be made accessible to bacteria with prior chemical treatment of PCBs.•Complete metal removal obtained on PCB pieces of size 4 cm × 2.5 cm with the exception of solder traces. The final metal free PCBs (non metallic) can be easily recycled and in this way the overall recycling process (metallic and non metallic part) of PCBs becomes simple.

Gender balance on company boards: a summary from a research project about the impact of the Norwegian gender quota legislation

OpenAIRE

2015-01-01

This report summarizes main findings from the research project: Effects of gender balance in corporate boards. The project is financed by the Ministry of Children, Equality and Social Inclusion. The report consists of nine chapters. The introductory chapter will provide key information about the gender quota legislation, as well as describe the policy process that led to the gender balance legislation; the second chapter will present some of the existing research on the gender balance regulat...

Detection of transient disturbing signals on PC boards

Directory of Open Access Journals (Sweden)

S. Korte

2008-05-01

Full Text Available This paper shows a possibility to visualize signal propagation in electronic circuits. Instead of using various galvanic measurement points all over the circuit, a test method is shown which measures the radiated field of the printed circuit board. By use of a 2-dimensional positionable field probe it is possible to get an overview over the signals running on the different parts of the PCB. In order to measure transient disturbing signals and distinguish them from normal device operation, problems of probe design and triggering need to be discussed.

Flex-prints for the Mu3e experiment

Energy Technology Data Exchange (ETDEWEB)

Dittmeier, Sebastian [Physikalisches Institut, Universitaet Heidelberg (Germany); Collaboration: Mu3e-Collaboration

2016-07-01

Mu3e is a novel experiment dedicated to the search for the charged lepton flavor violating decay μ{sup +} → e{sup +}e{sup -}e{sup +} with a targeted sensitivity of a branching ratio (BR) down to 10{sup -16}. Within the standard model of particle physics this process is extremely suppressed to BR<10{sup -54}. Thus, any observation would be a clear sign for new physics beyond the standard model. The Mu3e detector consists of a silicon pixel tracking detector using the novel HV-MAPS (High Voltage Monolithic Active Pixel Sensor) technology to measure the momentum of the decay products, and scintillating fibres and tiles for precise timing. The pixel sensors are thinned to 50 μ m to achieve a material budget of about 0.1% radiation length per tracking layer. The pixel sensors are powered and connected to readout frontend boards using custom designed flex-prints, which are low material interconnects with a high signal density. We present studies of high speed data transmission up to 3.2 Gb/s over flex-print prototypes produced in-house. The design of the flex-prints for the Mu3e detector will be discussed. A 3-layer design including power, ground and slow control distribution, as well as 9 1.25 Gb/s data transmission lines for the readout of the pixel sensors is foreseen.

Copper extraction from coarsely ground printed circuit boards using moderate thermophilic bacteria in a rotating-drum reactor

Energy Technology Data Exchange (ETDEWEB)

Rodrigues, Michael L.M., E-mail: mitchel.marques@yahoo.com.br [Bio& Hydrometallurgy Laboratory, Department of Metallurgical and Materials Engineering, Universidade Federal de Ouro Preto, Campus Morro do Cruzeiro, Ouro Preto, MG 35400-000 (Brazil); Leão, Versiane A., E-mail: versiane@demet.em.ufop.br [Bio& Hydrometallurgy Laboratory, Department of Metallurgical and Materials Engineering, Universidade Federal de Ouro Preto, Campus Morro do Cruzeiro, Ouro Preto, MG 35400-000 (Brazil); Gomes, Otavio [Centre for Mineral Technology – CETEM, Av Pedro Calmon, 900, 21941-908 Rio de Janeiro (Brazil); Lambert, Fanny; Bastin, David; Gaydardzhiev, Stoyan [Mineral Processing and Recycling, University of Liege, SartTilman, 4000 Liege (Belgium)

2015-07-15

Highlights: • Copper bioleaching from PCB (20 mm) by moderate thermophiles was demonstrated. • Larger PCB sheets enable a cost reduction due to the elimination of fine grinding. • Crushing generated cracks in PCB increasing the copper extraction. • A pre-treatment step was necessary to remove the lacquer coating. • High copper extractions (85%) were possible with pulp density of up to 25.0 g/L. - Abstract: The current work reports on a new approach for copper bioleaching from Printed Circuit Board (PCB) by moderate thermophiles in a rotating-drum reactor. Initially leaching of PCB was carried out in shake flasks to assess the effects of particle size (−208 μm + 147 μm), ferrous iron concentration (1.25–10.0 g/L) and pH (1.5–2.5) on copper leaching using mesophile and moderate thermophile microorganisms. Only at a relatively low solid content (10.0 g/L) complete copper extraction was achieved from the particle size investigated. Conversely, high copper extractions were possible from coarse-ground PCB (20 mm-long) working with increased solids concentration (up to 25.0 g/L). Because there was as the faster leaching kinetics at 50 °C Sulfobacillus thermosulfidooxidans was selected for experiments in a rotating-drum reactor with the coarser-sized PCB sheets. Under optimal conditions, copper extraction reached 85%, in 8 days and microscopic observations by SEM–EDS of the on non-leached and leached material suggested that metal dissolution from the internal layers was restricted by the fact that metal surface was not entirely available and accessible for the solution in the case of the 20 mm-size sheets.

Copper extraction from coarsely ground printed circuit boards using moderate thermophilic bacteria in a rotating-drum reactor

International Nuclear Information System (INIS)

Rodrigues, Michael L.M.; Leão, Versiane A.; Gomes, Otavio; Lambert, Fanny; Bastin, David; Gaydardzhiev, Stoyan

2015-01-01

Highlights: • Copper bioleaching from PCB (20 mm) by moderate thermophiles was demonstrated. • Larger PCB sheets enable a cost reduction due to the elimination of fine grinding. • Crushing generated cracks in PCB increasing the copper extraction. • A pre-treatment step was necessary to remove the lacquer coating. • High copper extractions (85%) were possible with pulp density of up to 25.0 g/L. - Abstract: The current work reports on a new approach for copper bioleaching from Printed Circuit Board (PCB) by moderate thermophiles in a rotating-drum reactor. Initially leaching of PCB was carried out in shake flasks to assess the effects of particle size (−208 μm + 147 μm), ferrous iron concentration (1.25–10.0 g/L) and pH (1.5–2.5) on copper leaching using mesophile and moderate thermophile microorganisms. Only at a relatively low solid content (10.0 g/L) complete copper extraction was achieved from the particle size investigated. Conversely, high copper extractions were possible from coarse-ground PCB (20 mm-long) working with increased solids concentration (up to 25.0 g/L). Because there was as the faster leaching kinetics at 50 °C Sulfobacillus thermosulfidooxidans was selected for experiments in a rotating-drum reactor with the coarser-sized PCB sheets. Under optimal conditions, copper extraction reached 85%, in 8 days and microscopic observations by SEM–EDS of the on non-leached and leached material suggested that metal dissolution from the internal layers was restricted by the fact that metal surface was not entirely available and accessible for the solution in the case of the 20 mm-size sheets

Networked Print Production: Does JDF Provide a Perfect Workflow?

Directory of Open Access Journals (Sweden)

Bernd Zipper

2004-12-01

Full Text Available The "networked printing works" is a well-worn slogan used by many providers in the graphics industry and for the past number of years printing-works manufacturers have been working on the goal of achieving the "networked printing works". A turning point from the concept to real implementation can now be expected at drupa 2004: JDF (Job Definition Format and thus "networked production" will form the center of interest here. The first approaches towards a complete, networked workflow between prepress, print and postpress in production are already available - the products and solutions will now be presented publicly at drupa 2004. So, drupa 2004 will undoubtedly be the "JDF-drupa" - the drupa where machines learn to communicate with each other digitally - the drupa, where the dream of general system and job communication in the printing industry can be first realized. CIP3, which has since been renamed CIP4, is an international consortium of leading manufacturers from the printing and media industry who have taken on the task of integrating processes for prepress, print and postpress. The association, to which nearly all manufacturers in the graphics industry belong, has succeeded with CIP3 in developing a first international standard for the transmission of control data in the print workflow.Further development of the CIP4 standard now includes a more extensive "system language" called JDF, which will guarantee workflow communication beyond manufacturer boundaries. However, not only data for actual print production will be communicated with JDF (Job Definition Format: planning and calculation data for MIS (Management Information systems and calculation systems will also be prepared. The German printing specialist Hans-Georg Wenke defines JDF as follows: "JDF takes over data from MIS for machines, aggregates and their control desks, data exchange within office applications, and finally ensures that data can be incorporated in the technical workflow

Women on Corporate Boards in Bosnia and Herzegovina, FYR Macedonia, and Serbia

OpenAIRE

Djulic, Katarina; Kuzman, Tanja

2013-01-01

In January 2013, International Finance Corporation (IFC) launched a research project entitled women on corporate boards in Bosnia and Herzegovina, FYR Macedonia, and Serbia. The purpose of the project was to gather information on the representation of women on corporate boards and to learn about the determinants of female board membership in these countries. Which skills and knowledge do w...

Software pi/4 DQPSK Modem: A Student Project Using the TMS320-C6201 EVM Board

OpenAIRE

Weiss, S; Braithwaite, SJ; Stewart, RD

2000-01-01

This paper reports on a student project performed at the University of Southampton jointly by 4th year MEng students within the course "Advanced Radio Communications". The aim was to design a software modem capable of transmitting 16kb/s of data, whereby random number generation, advanced modulation, pulse shaping, synchronisation, and error counting techniques had to be applied. The ultimate aim was the implementation on a Texas Instruments TMS320-C6201 EVM board, which dictated some of the ...

The best printing methods to print satellite images

Directory of Open Access Journals (Sweden)

G.A. Yousif

2011-12-01

In this paper different printing systems were used to print an image of SPOT-4 satellite, caver part of Sharm Elshekh area, Sinai, Egypt, on the same type of paper as much as possible, especially in the photography. This step is followed by measuring the experimental data, and analyzed colors to determine the best printing systems for satellite image printing data. The laser system is the more printing system where produce a wider range of color and highest densities of ink and access much color detail. Followed by the offset system which it recorded the best dot gain. Moreover, the study shows that it can use the advantages of each method according to the satellite image color and quantity to be produced.

3D Printing in Zero-G ISS Technology Demonstration

Science.gov (United States)

Johnston, Mallory M.; Werkheiser, Mary J.; Cooper, Kenneth G.; Snyder, Michael P.; Edmunson, Jennifer E.

2014-01-01

The National Aeronautics and Space Administration (NASA) has a long term strategy to fabricate components and equipment on-demand for manned missions to the Moon, Mars, and beyond. To support this strategy, NASA and Made in Space, Inc. are developing the 3D Printing In Zero-G payload as a Technology Demonstration for the International Space Station. The 3D Printing In Zero-G experiment will be the first machine to perform 3D printing in space. The greater the distance from Earth and the longer the mission duration, the more difficult resupply becomes; this requires a change from the current spares, maintenance, repair, and hardware design model that has been used on the International Space Station up until now. Given the extension of the ISS Program, which will inevitably result in replacement parts being required, the ISS is an ideal platform to begin changing the current model for resupply and repair to one that is more suitable for all exploration missions. 3D Printing, more formally known as Additive Manufacturing, is the method of building parts/ objects/tools layer-by-layer. The 3D Print experiment will use extrusion-based additive manufacturing, which involves building an object out of plastic deposited by a wire-feed via an extruder head. Parts can be printed from data files loaded on the device at launch, as well as additional files uplinked to the device while on-orbit. The plastic extrusion additive manufacturing process is a low-energy, low-mass solution to many common needs on board the ISS. The 3D Print payload will serve as the ideal first step to proving that process in space. It is unreasonable to expect NASA to launch large blocks of material from which parts or tools can be traditionally machined, and even more unreasonable to fly up specialized manufacturing hardware to perform the entire range of function traditionally machining requires. The technology to produce parts on demand, in space, offers unique design options that are not possible

‘‘Lend a Hand’’ Project Helps Students: Improved Spatial Visualization Skills Through Engaging in Hands-On 3-D Printed Prosthetics Project During a 9th Grade Engineering Course

OpenAIRE

Smith, Shaunna; Talley, Kimberly

2018-01-01

Research shows that high spatial ability is linked to success and persistence in STEM. Empirical investigations often report a gender gap in favor of male students. The purpose of this research study was to assess changes to 9th grade engineering students’ spatial visualization skills through engagement in a nine-week collaborative 3-D printed prosthetics project embedded within their existing ‘‘Beginning Concepts of Engineering’’ course curriculum. Using concurrent mixed methods, this study ...

Academic and Institutional Review Board Collaboration to Ensure Ethical Conduct of Doctor of Nursing Practice Projects.

Science.gov (United States)

Foote, Jan M; Conley, Virginia; Williams, Janet K; McCarthy, Ann Marie; Countryman, Michele

2015-07-01

Navigating the regulations to protect human subjects and private health information for Doctor of Nursing Practice (DNP) projects can be a formidable task for students, faculty, and the institutional review board (IRB). Key stakeholders from the University of Iowa College of Nursing and the Human Subjects Office developed a standardized process for DNP students to follow, using a decision algorithm, a student orientation to the human subjects review process conducted by faculty and IRB chairs and staff, and a brief Human Subjects Research Determination form. Over 2 years, 109 students completed the process, and 96.3% of their projects were deemed not to be human subjects research. Every student submitted documentation of adherence to the standardized process. Less time was spent by students, faculty, and the IRB in preparing and processing review requests. The interprofessional collaboration resulted in a streamlined process for the timely review of DNP projects. Copyright 2015, SLACK Incorporated.

Digital printing

Science.gov (United States)

Sobotka, Werner K.

1997-02-01

Digital printing is described as a tool to replace conventional printing machines completely. Still this goal was not reached until now with any of the digital printing technologies to be described in the paper. Productivity and costs are still the main parameters and are not really solved until now. Quality in digital printing is no problem anymore. Definition of digital printing is to transfer digital datas directly on the paper surface. This step can be carried out directly or with the use of an intermediate image carrier. Keywords in digital printing are: computer- to-press; erasable image carrier; image carrier with memory. Digital printing is also the logical development of the new digital area as it is pointed out in Nicholas Negropotes book 'Being Digital' and also the answer to networking and Internet technologies. Creating images text and color in one country and publishing the datas in another country or continent is the main advantage. Printing on demand another big advantage and last but not least personalization the last big advantage. Costs and being able to coop with this new world of prepress technology is the biggest disadvantage. Therefore the very optimistic growth rates for the next few years are really nonexistent. The development of complete new markets is too slow and the replacing of old markets is too small.

Recent trends in print portals and Web2Print applications

Science.gov (United States)

Tuijn, Chris

2009-01-01

For quite some time now, the printing business has been under heavy pressure because of overcapacity, dropping prices and the delocalization of the production to low income countries. To survive in this competitive world, printers have to invest in tools that, on one hand, reduce the production costs and, on the other hand, create additional value for their customers (print buyers). The creation of customer portals on top of prepress production systems allowing print buyers to upload their content, approve the uploaded pages based on soft proofs (rendered by the underlying production system) and further follow-up the generation of the printed material, has been illustrative in this respect. These developments resulted in both automation for the printer and added value for the print buyer. Many traditional customer portals assume that the printed products have been identified before they are presented to the print buyer in the portal environment. The products are, in this case, typically entered by the printing organization in a so-called MISi system after the official purchase order has been received from the print buyer. Afterwards, the MIS system then submits the product to the customer portal. Some portals, however, also support the initiation of printed products by the print buyer directly. This workflow creates additional flexibility but also makes things much more complex. We here have to distinguish between special products that are defined ad-hoc by the print buyer and standardized products that are typically selected out of catalogs. Special products are most of the time defined once and the level of detail required in terms of production parameters is quite high. Systems that support such products typically have a built-in estimation module, or, at least, a direct connection to an MIS system that calculates the prices and adds a specific mark-up to calculate a quote. Often, the markup is added by an account manager on a customer by customer basis; in this

The EM SSAB Annual Work Plan Process: Focusing Board Efforts and Resources - 13667

Energy Technology Data Exchange (ETDEWEB)

Young, Ralph [Paducah Citizens Advisory Board (United States)

2013-07-01

One of the most daunting tasks for any new member of a local board of the Environmental Management Site Specific Advisory Board (EM SSAB) is to try to understand the scope of the clean-up activities going on at the site. In most cases, there are at least two or three major cleanup activities in progress as well as monitoring of past projects. When planning for future projects is added to the mix, the list of projects can be long. With the clean-up activities involving all major environmental media - air, water, soils, and groundwater, new EM SSAB members can find themselves totally overwhelmed and ineffective. Helping new members get over this initial hurdle is a major objective of EM and all local boards of the EM SSAB. Even as members start to understand the size and scope of the projects at a site, they can still be frustrated at the length of time it takes to see results and get projects completed. Many project and clean-up timelines for most of the sites go beyond 10 years, so it's not unusual for an EM SSAB member to see the completion of only 1 or 2 projects over the course of their 6-year term on the board. This paper explores the annual work planning process of the EM SSAB local boards, one tool that can be used to educate EM SSAB members into seeing the broader picture for the site. EM SSAB local work plans divide the site into projects focused on a specific environmental issue or media such as groundwater and/or waste disposal options. Projects are further broken down into smaller segments by highlighting major milestones. Using these metrics, local boards of the EM SSAB can start to quantify the effectiveness of the project in achieving the ultimate goal of site clean-up. These metrics can also trigger board advice and recommendations for EM. At the beginning of each fiscal year, the EM SSAB work plan provides a road map with quantifiable checkpoints for activities throughout the year. When the work plans are integrated with site

Demonstrating the Effect of Particle Impact Dampers on the Random Vibration Response and Fatigue Life of Printed Wiring Assemblies

Science.gov (United States)

Knight, Brent; Montgomery, Randall; Geist, David; Hunt, Ron; LaVerde, Bruce; Towner, Robert

2013-01-01

In a recent experimental study, small Particle Impact Dampers (PID) were bonded directly to the surface of printed circuit board (PCB) or printed wiring assemblies (PWA), reducing the random vibration response and increasing the fatigue life. This study provides data verifying practicality of this approach. The measured peak strain and acceleration response of the fundamental out of plane bending mode was significantly attenuated by adding a PID device. Attenuation of this mode is most relevant to the fatigue life of a PWA because the local relative displacements between the board and the supported components, which ultimately cause fatigue failures of the electrical leads of the board-mounted components are dominated by this mode. Applying PID damping at the board-level of assembly provides mitigation with a very small mass impact, especially as compared to isolation at an avionics box or shelf level of assembly. When compared with other mitigation techniques at the PWA level (board thickness, stiffeners, constrained layer damping), a compact PID device has the additional advantage of not needing to be an integral part of the design. A PID can simply be bonded to heritage or commercial off the shelf (COTS) hardware to facilitate its use in environments beyond which it was originally qualified. Finite element analysis and test results show that the beneficial effect is not localized and that the attenuation is not due to the simple addition of mass. No significant, detrimental reduction in frequency was observed. Side-by-side life testing of damped and un-damped boards at two different thicknesses (0.070" and 0.090") has shown that the addition of a PID was much more significant to the fatigue life than increasing the thickness. High speed video, accelerometer, and strain measurements have been collected to correlate with analytical results.

A new model for simulating microbial cyanide production and optimizing the medium parameters for recovering precious metals from waste printed circuit boards.

Science.gov (United States)

Yuan, Zhihui; Ruan, Jujun; Li, Yaying; Qiu, Rongliang

2018-04-10

Bioleaching is a green recycling technology for recovering precious metals from waste printed circuit boards (WPCBs). However, this technology requires increasing cyanide production to obtain desirable recovery efficiency. Luria-Bertani medium (LB medium, containing tryptone 10 g/L, yeast extract 5 g/L, NaCl 10 g/L) was commonly used in bioleaching of precious metal. In this study, results showed that LB medium did not produce highest yield of cyanide. Under optimal culture conditions (25 °C, pH 7.5), the maximum cyanide yield of the optimized medium (containing tryptone 6 g/L and yeast extract 5 g/L) was 1.5 times as high as that of LB medium. In addition, kinetics and relationship of cell growth and cyanide production was studied. Data of cell growth fitted logistics model well. Allometric model was demonstrated effective in describing relationship between cell growth and cyanide production. By inserting logistics equation into allometric equation, we got a novel hybrid equation containing five parameters. Kinetic data for cyanide production were well fitted to the new model. Model parameters reflected both cell growth and cyanide production process. Copyright © 2018 Elsevier B.V. All rights reserved.

Use of large pieces of printed circuit boards for bioleaching to avoid ‘precipitate contamination problem’ and to simplify overall metal recovery

Science.gov (United States)

Adhapure, N.N.; Dhakephalkar, P.K.; Dhakephalkar, A.P.; Tembhurkar, V.R.; Rajgure, A.V.; Deshmukh, A.M.

2014-01-01

Very recently bioleaching has been used for removing metals from electronic waste. Most of the research has been targeted to using pulverized PCBs for bioleaching where precipitate formed during bioleaching contaminates the pulverized PCB sample and making the overall metal recovery process more complicated. In addition to that, such mixing of pulverized sample with precipitate also creates problems for the final separation of non metallic fraction of PCB sample. In the present investigation we attempted the use of large pieces of printed circuit boards instead of pulverized sample for removal of metals. Use of large pieces of PCBs for bioleaching was restricted due to the chemical coating present on PCBs, the problem has been solved by chemical treatment of PCBs prior to bioleaching. In short,•Large pieces of PCB can be used for bioleaching instead of pulverized PCB sample.•Metallic portion on PCBs can be made accessible to bacteria with prior chemical treatment of PCBs.•Complete metal removal obtained on PCB pieces of size 4 cm × 2.5 cm with the exception of solder traces. The final metal free PCBs (non metallic) can be easily recycled and in this way the overall recycling process (metallic and non metallic part) of PCBs becomes simple. PMID:26150951

Characterization and mechanical separation of metals from computer Printed Circuit Boards (PCBs) based on mineral processing methods.

Science.gov (United States)

Sarvar, Mojtaba; Salarirad, Mohammad Mehdi; Shabani, Mohammad Amin

2015-11-01

In this paper, a novel mechanical process is proposed for enriching metal content of computer Printed Circuit Boards (PCBs). The PCBs are crushed and divided into three different size fractions namely: -0.59, +0.59 to 1.68 and +1.68 mm. Wet jigging and froth flotation methods are selected for metal enrichment. The coarse size fraction (+1.68 mm) is processed by jigging. The plastic free product is grinded and screened. The oversized product is separated as the first concentrate. It was rich of metal because the grinding process was selective. The undersized product is processed by froth flotation. Based on the obtained results, the middle size fraction (+0.59 to 1.68 mm) and the small size fraction (-0.59 mm) are processed by wet jigging and froth flotation respectively. The wet jigging process is optimized by investigating the effect of pulsation frequency and water flow rate. The results of examining the effect of particle size, solid to liquid ratio, conditioning time and using apolar collector showed that collectorless flotation is a promising method for separating nonmetals of PCBs. 95.6%, 97.5% and 85% of metal content of coarse size, middle size and small size fraction are recovered. The grades of obtained concentrates were 63.3%, 92.5% and 75% respectively. The total recovery is calculated as 95.64% and the grade of the final concentrate was 71.26%. Determining the grade of copper and gold in the final product reveals that 4.95% of copper and 24.46% of gold are lost during the concentration. The major part of the lost gold is accumulated in froth flotation tail. Copyright © 2015 Elsevier Ltd. All rights reserved.

Internet printing

Science.gov (United States)

Rahgozar, M. Armon; Hastings, Tom; McCue, Daniel L.

1997-04-01

The Internet is rapidly changing the traditional means of creation, distribution and retrieval of information. Today, information publishers leverage the capabilities provided by Internet technologies to rapidly communicate information to a much wider audience in unique customized ways. As a result, the volume of published content has been astronomically increasing. This, in addition to the ease of distribution afforded by the Internet has resulted in more and more documents being printed. This paper introduces several axes along which Internet printing may be examined and addresses some of the technological challenges that lay ahead. Some of these axes include: (1) submission--the use of the Internet protocols for selecting printers and submitting documents for print, (2) administration--the management and monitoring of printing engines and other print resources via Web pages, and (3) formats--printing document formats whose spectrum now includes HTML documents with simple text, layout-enhanced documents with Style Sheets, documents that contain audio, graphics and other active objects as well as the existing desktop and PDL formats. The format axis of the Internet Printing becomes even more exciting when one considers that the Web documents are inherently compound and the traversal into the various pieces may uncover various formats. The paper also examines some imaging specific issues that are paramount to Internet Printing. These include formats and structures for representing raster documents and images, compression, fonts rendering and color spaces.

75 FR 1049 - Wausau Paper Printing & Writing, LLC,

Science.gov (United States)

2010-01-08

... DEPARTMENT OF ENERGY Federal Energy Regulatory Commission [Project No. 2533-046] Wausau Paper Printing & Writing, LLC, Wausau Paper Mills, LLC; Notice of Application for Transfer of License and... & Writing, LLC (transferor) and Wausau Paper Mills, LLC (transferee) filed an application for transfer of...

Digital Inkjet Textile Printing

OpenAIRE

Wang, Meichun

2017-01-01

Digital inkjet textile printing is an emerging technology developed with the rise of the digital world. It offers a possibility to print high-resolution images with unlimited color selection on fabrics. Digital inkjet printing brings a revolutionary chance for the textile printing industry. The history of textile printing shows the law how new technology replaces the traditional way of printing. This indicates the future of digital inkjet textile printing is relatively positive. Differen...

On-board processing of video image sequences

DEFF Research Database (Denmark)

Andersen, Jakob Dahl; Chanrion, Olivier Arnaud; Forchhammer, Søren

2008-01-01

and evaluated. On-board there are six video cameras each capturing images of 1024times1024 pixels of 12 bpp at a frame rate of 15 fps, thus totalling 1080 Mbits/s. In comparison the average downlink data rate for these images is projected to be 50 kbit/s. This calls for efficient on-board processing to select...

Printed photodetectors

International Nuclear Information System (INIS)

Pace, Giuseppina; Grimoldi, Andrea; Sampietro, Marco; Natali, Dario; Caironi, Mario

2015-01-01

Photodetectors convert light pulses into electrical signals and are fundamental building blocks for any opto-electronic system adopting light as a probe or information carrier. They have widespread technological applications, from telecommunications to sensors in industrial, medical and civil environments. Further opportunities are plastic short-range communications systems, interactive large-area surfaces and light-weight, flexible, digital imagers. These applications would greatly benefit from the cost-effective fabrication processes enabled by printing technology. While organic semiconductors are the most investigated materials for printed photodetectors, and are the main focus of the present review, there are notable examples of other inorganic or hybrid printable semiconductors for opto-electronic systems, such as quantum-dots and nanowires. Here we propose an overview on printed photodetectors, including three-terminal phototransistors. We first give a brief account of the working mechanism of these light sensitive devices, and then we review the recent progress achieved with scalable printing techniques such as screen-printing, inkjet and other non-contact technologies in the development of all-printed or hybrid systems. (paper)

Printed photodetectors

Science.gov (United States)

Pace, Giuseppina; Grimoldi, Andrea; Sampietro, Marco; Natali, Dario; Caironi, Mario

2015-10-01

Photodetectors convert light pulses into electrical signals and are fundamental building blocks for any opto-electronic system adopting light as a probe or information carrier. They have widespread technological applications, from telecommunications to sensors in industrial, medical and civil environments. Further opportunities are plastic short-range communications systems, interactive large-area surfaces and light-weight, flexible, digital imagers. These applications would greatly benefit from the cost-effective fabrication processes enabled by printing technology. While organic semiconductors are the most investigated materials for printed photodetectors, and are the main focus of the present review, there are notable examples of other inorganic or hybrid printable semiconductors for opto-electronic systems, such as quantum-dots and nanowires. Here we propose an overview on printed photodetectors, including three-terminal phototransistors. We first give a brief account of the working mechanism of these light sensitive devices, and then we review the recent progress achieved with scalable printing techniques such as screen-printing, inkjet and other non-contact technologies in the development of all-printed or hybrid systems.

3D printing PLGA: a quantitative examination of the effects of polymer composition and printing parameters on print resolution.

Science.gov (United States)

Guo, Ting; Holzberg, Timothy R; Lim, Casey G; Gao, Feng; Gargava, Ankit; Trachtenberg, Jordan E; Mikos, Antonios G; Fisher, John P

2017-04-12

In the past few decades, 3D printing has played a significant role in fabricating scaffolds with consistent, complex structure that meet patient-specific needs in future clinical applications. Although many studies have contributed to this emerging field of additive manufacturing, which includes material development and computer-aided scaffold design, current quantitative analyses do not correlate material properties, printing parameters, and printing outcomes to a great extent. A model that correlates these properties has tremendous potential to standardize 3D printing for tissue engineering and biomaterial science. In this study, we printed poly(lactic-co-glycolic acid) (PLGA) utilizing a direct melt extrusion technique without additional ingredients. We investigated PLGA with various lactic acid:glycolic acid (LA:GA) molecular weight ratios and end caps to demonstrate the dependence of the extrusion process on the polymer composition. Micro-computed tomography was then used to evaluate printed scaffolds containing different LA:GA ratios, composed of different fiber patterns, and processed under different printing conditions. We built a statistical model to reveal the correlation and predominant factors that determine printing precision. Our model showed a strong linear relationship between the actual and predicted precision under different combinations of printing conditions and material compositions. This quantitative examination establishes a significant foreground to 3D print biomaterials following a systematic fabrication procedure. Additionally, our proposed statistical models can be applied to couple specific biomaterials and 3D printing applications for patient implants with particular requirements.

3D printing PLGA: a quantitative examination of the effects of polymer composition and printing parameters on print resolution

Science.gov (United States)

Guo, Ting; Holzberg, Timothy R; Lim, Casey G; Gao, Feng; Gargava, Ankit; Trachtenberg, Jordan E; Mikos, Antonios G; Fisher, John P

2018-01-01

In the past few decades, 3D printing has played a significant role in fabricating scaffolds with consistent, complex structure that meet patient-specific needs in future clinical applications. Although many studies have contributed to this emerging field of additive manufacturing, which includes material development and computer-aided scaffold design, current quantitative analyses do not correlate material properties, printing parameters, and printing outcomes to a great extent. A model that correlates these properties has tremendous potential to standardize 3D printing for tissue engineering and biomaterial science. In this study, we printed poly(lactic-co-glycolic acid) (PLGA) utilizing a direct melt extrusion technique without additional ingredients. We investigated PLGA with various lactic acid: glycolic acid (LA:GA) molecular weight ratios and end caps to demonstrate the dependence of the extrusion process on the polymer composition. Micro-computed tomography was then used to evaluate printed scaffolds containing different LA:GA ratios, composed of different fiber patterns, and processed under different printing conditions. We built a statistical model to reveal the correlation and predominant factors that determine printing precision. Our model showed a strong linear relationship between the actual and predicted precision under different combinations of printing conditions and material compositions. This quantitative examination establishes a significant foreground to 3D print biomaterials following a systematic fabrication procedure. Additionally, our proposed statistical models can be applied to couple specific biomaterials and 3D printing applications for patient implants with particular requirements. PMID:28244880

Analytical thermal modelling of multilayered active embedded chips into high density electronic board

Directory of Open Access Journals (Sweden)

Monier-Vinard Eric

2013-01-01

Full Text Available The recent Printed Wiring Board embedding technology is an attractive packaging alternative that allows a very high degree of miniaturization by stacking multiple layers of embedded chips. This disruptive technology will further increase the thermal management challenges by concentrating heat dissipation at the heart of the organic substrate structure. In order to allow the electronic designer to early analyze the limits of the power dissipation, depending on the embedded chip location inside the board, as well as the thermal interactions with other buried chips or surface mounted electronic components, an analytical thermal modelling approach was established. The presented work describes the comparison of the analytical model results with the numerical models of various embedded chips configurations. The thermal behaviour predictions of the analytical model, found to be within ±10% of relative error, demonstrate its relevance for modelling high density electronic board. Besides the approach promotes a practical solution to study the potential gain to conduct a part of heat flow from the components towards a set of localized cooled board pads.

Application of polyaniline dispersions by means of screen printing

Czech Academy of Sciences Publication Activity Database

Držková, M.; Peřinka, N.; Hajná, Milena; Kaplanová, M.; Stejskal, Jaroslav

2013-01-01

Roč. 19, č. 2013 (2013), s. 257-268 ISSN 1211-5541 R&D Projects: GA TA ČR TE01020022 Institutional support: RVO:61389013 Keywords : polyaniline * colloids * screen printing Subject RIV: JA - Electronics ; Optoelectronics, Electrical Engineering

Applications of laser printing for organic electronics

Science.gov (United States)

Delaporte, Ph.; Ainsebaa, A.; Alloncle, A.-P.; Benetti, M.; Boutopoulos, C.; Cannata, D.; Di Pietrantonio, F.; Dinca, V.; Dinescu, M.; Dutroncy, J.; Eason, R.; Feinaugle, M.; Fernández-Pradas, J.-M.; Grisel, A.; Kaur, K.; Lehmann, U.; Lippert, T.; Loussert, C.; Makrygianni, M.; Manfredonia, I.; Mattle, T.; Morenza, J.-L.; Nagel, M.; Nüesch, F.; Palla-Papavlu, A.; Rapp, L.; Rizvi, N.; Rodio, G.; Sanaur, S.; Serra, P.; Shaw-Stewart, J.; Sones, C. L.; Verona, E.; Zergioti, I.

2013-03-01

The development of organic electronic requires a non contact digital printing process. The European funded e-LIFT project investigated the possibility of using the Laser Induced Forward Transfer (LIFT) technique to address this field of applications. This process has been optimized for the deposition of functional organic and inorganic materials in liquid and solid phase, and a set of polymer dynamic release layer (DRL) has been developed to allow a safe transfer of a large range of thin films. Then, some specific applications related to the development of heterogeneous integration in organic electronics have been addressed. We demonstrated the ability of LIFT process to print thin film of organic semiconductor and to realize Organic Thin Film Transistors (OTFT) with mobilities as high as 4 10-2 cm2.V-1.s-1 and Ion/Ioff ratio of 2.8 105. Polymer Light Emitting Diodes (PLED) have been laser printed by transferring in a single step process a stack of thin films, leading to the fabrication of red, blue green PLEDs with luminance ranging from 145 cd.m-2 to 540 cd.m-2. Then, chemical sensors and biosensors have been fabricated by printing polymers and proteins on Surface Acoustic Wave (SAW) devices. The ability of LIFT to transfer several sensing elements on a same device with high resolution allows improving the selectivity of these sensors and biosensors. Gas sensors based on the deposition of semiconducting oxide (SnO2) and biosensors for the detection of herbicides relying on the printing of proteins have also been realized and their performances overcome those of commercial devices. At last, we successfully laser-printed thermoelectric materials and realized microgenerators for energy harvesting applications.

A beginner's guide to 3D printing 14 simple toy designs to get you started

CERN Document Server

Rigsby, Mike

2014-01-01

A Beginner''s Guide to 3D Printing is the perfect resource for those who would like to experiment with 3D design and manufacturing, but have little or no technical experience with the standard software. Author Mike Rigsby leads readers step-by-step through 15 simple toy projects, each illustrated with screen caps of Autodesk 123D Design, the most common free 3D software available. The projects are later described using Sketchup, another free popular software package. Beginning with basics projects that will take longer to print than design, readers are then given instruction on more advanced t

Unit: Petroleum, Inspection Pack, National Trial Print.

Science.gov (United States)

Australian Science Education Project, Toorak, Victoria.

This is a National Trial Print of a unit on petroleum developed for the Australian Science Education Project. The package contains the teacher's edition of the written material and a script for a film entitled "The Extraordinary Experience of Nicholas Nodwell" emphasizing the uses of petroleum and petroleum products in daily life and…

Effects of ozone on the various digital print technologies: Photographs and documents

Energy Technology Data Exchange (ETDEWEB)

Burge, D; Gordeladze, N; Bigourdan, J-L; Nishimura, D, E-mail: dmbpph@rit.ed [Image Permanence Institute at Rochester Institute of Technology, 70 Lomb Memorial Drive, Rochester, NY 14623 (United States)

2010-06-01

The harmful effects of ozone on inkjet photographs have been well documented. This project expands on that research by performing ozone tests on a greater variety of digital prints including colour electrophotographic and dye sublimation. The sensitivities of these materials are compared to traditionally printed materials (black-and-white electrophotographic, colour photographic and offset lithographic) to determine if the digital prints require special care practices. In general, the digital prints were more sensitive to ozone than traditional prints. Dye inkjet prints were more sensitive to fade than pigment inkjet, though pigment was not immune. The dye sublimation, colour electrophotographic (dry and liquid toner), and traditional print systems were relatively resistant to ozone. Text-based documents were evaluated in addition to photographic images, since little work has been done to determine if the type of object (image or text) has an impact on its sensitivity to ozone. The results showed that documents can be more resistant to ozone than photographs even when created using the same printer and inks. It is recommended that cultural heritage institutions not expose their porous-coated, dye-based inkjet photos to open air for extended periods of time. Other inkjet prints should be monitored for early signs of change.

Effects of ozone on the various digital print technologies: Photographs and documents

International Nuclear Information System (INIS)

Burge, D; Gordeladze, N; Bigourdan, J-L; Nishimura, D

2010-01-01

The harmful effects of ozone on inkjet photographs have been well documented. This project expands on that research by performing ozone tests on a greater variety of digital prints including colour electrophotographic and dye sublimation. The sensitivities of these materials are compared to traditionally printed materials (black-and-white electrophotographic, colour photographic and offset lithographic) to determine if the digital prints require special care practices. In general, the digital prints were more sensitive to ozone than traditional prints. Dye inkjet prints were more sensitive to fade than pigment inkjet, though pigment was not immune. The dye sublimation, colour electrophotographic (dry and liquid toner), and traditional print systems were relatively resistant to ozone. Text-based documents were evaluated in addition to photographic images, since little work has been done to determine if the type of object (image or text) has an impact on its sensitivity to ozone. The results showed that documents can be more resistant to ozone than photographs even when created using the same printer and inks. It is recommended that cultural heritage institutions not expose their porous-coated, dye-based inkjet photos to open air for extended periods of time. Other inkjet prints should be monitored for early signs of change.

An innovative "ChemicalVia" process for the production of high density interconnect printed circuit boards The ATLAS muon chamber quality control with the X-ray tomograph at CERN

CERN Document Server

Da Silva, Vitor; Watts, David; Van der Bij, Erik; Banhidi, Z; Berbiers, Julien; Lampl, W; Marchesotti, M; Rangod, Stephane; Sbrissa, E; Schuh, S; Voss, Rüdiger; Zhuravlov, V

2004-01-01

The ChemicalVia process, patented by CERN, provides a new method of making microvias in high-density multilayer printed circuit boards of different types, such as sequential build-up (SBU), high density interconnected (HDI), or laminated multi-chip modules (MCM-L). The process uses chemical etching instead of laser, plasma or other etching techniques and can be implemented in a chain production line. This results in an overall reduced operation and maintenance cost and a much shorter hole production time as compared with other microvia processes. copy Emerald Group Publishing Limited. 4 Refs.4 An essential part of the Muon Spectrometer of the ATLAS experiment is based on the Monitored Drift Tube (MDT) technology. About 1200 muon drift chambers are being built at 13 institutes all over the world. The MDT chambers require an exceptional mechanical construction accuracy of better than 20 mu m. A dedicated X-ray tomograph has been developed at CERN since 1996 to control the mechanical quality of the chambers. The...

3D Modeling and Printing in History/Social Studies Classrooms: Initial Lessons and Insights

Science.gov (United States)

Maloy, Robert; Trust, Torrey; Kommers, Suzan; Malinowski, Allison; LaRoche, Irene

2017-01-01

This exploratory study examines the use of 3D technology by teachers and students in four middle school history/social studies classrooms. As part of a university-developed 3D Printing 4 Teaching & Learning project, teachers integrated 3D modeling and printing into curriculum topics in world geography, U.S. history, and government/civics.…

Water Science and Technology Board annual report, 1990

Energy Technology Data Exchange (ETDEWEB)

1990-01-01

This report summarizes the activities of the Water Science and Technology Board (WSTB) during 1990, its eighth year of existence. It describes current and recently completed projects, new activities scheduled to begin in 1991, and plans for the future. The WSTB is intended to be a dynamic forum, a mechanism by which the board community of water science, technology, and policy professionals can help assure high-quality national water programs. As such, the Board considers out-reach and communications of much importance.

Water Science and Technology Board annual report, 1990

Energy Technology Data Exchange (ETDEWEB)

1990-12-31

This report summarizes the activities of the Water Science and Technology Board (WSTB) during 1990, its eighth year of existence. It describes current and recently completed projects, new activities scheduled to begin in 1991, and plans for the future. The WSTB is intended to be a dynamic forum, a mechanism by which the board community of water science, technology, and policy professionals can help assure high-quality national water programs. As such, the Board considers out-reach and communications of much importance.

Instrumentation and control aging management: A focus on electronic parts and boards

International Nuclear Information System (INIS)

Crocombette, C.; Simon, G.; Favaro, P.; Naser, J.; Guffroy, G.

2002-01-01

Full text: The nuclear power industry is currently facing increasing aging and obsolescence issues with original equipment installed for instrumentation, control, and safety system applications. One area that needs attention is the aging of electronic boards and components used in instrumentation and control (I and C) systems in nuclear power plants (NPPs). In this context, EPRI has launched a project dedicated to NPP electronic component and board aging management. The goals of this project are: 1) to better understand the degradation mechanisms of I and C electronic systems; 2) to develop new methods to monitor prevalent mechanisms and forecast generic aging cases; and 3) to give guidelines for the aging management of I and C electronic systems. The ultimate objectives are: 1) to reduce the likelihood of losing plant availability due to a board or component failure; and 2) to reduce the global cost of maintenance by optimizing preventive maintenance tasks and the schedule for refurbishment or renewal. Degradation mechanisms of electronic boards in NPP - Aging mechanisms of electronic parts depend on technologies, manufacturing quality, and conditions of environment and operation. Aging of electronic parts is well documented in harsh environments (e.g., aerospace, military, or automotive industries data). However, only a small amount of data on electronic part failures in NPPs is available because the conditions are benign and the failure rates are supposed to be low. It is thus difficult to identify what will predominantly cause the aging of electronic systems after 20 or 30 years of operation. Usual causes are temperature, corrosion, temperature cycles, or extrinsic aggressions (Electrical Over Stress (EOS), Electro Static Discharges (ESD)). From field data and bibliographic analyses, we found that electrolytic capacitors, relays, potentiometers, power devices (thyristors, power transistors, etc.), optocouplers, on-board connectors, printed boards, integrated

Printing Insecurity? The Security Implications of 3D-Printing of Weapons.

Science.gov (United States)

Walther, Gerald

2015-12-01

In 2013, the first gun printed out of plastic by a 3D-printer was successfully fired in the U.S. This event caused a major media hype about the dangers of being able to print a gun. Law enforcement agencies worldwide were concerned about this development and the potentially huge security implications of these functional plastic guns. As a result, politicians called for a ban of these weapons and a control of 3D-printing technology. This paper reviews the security implications of 3D-printing technology and 3D guns. It argues that current arms control and transfer policies are adequate to cover 3D-printed guns as well. However, while this analysis may hold up currently, progress in printing technology needs to be monitored to deal with future dangers pre-emptively.

Unit: Plants, Inspection Pack, National Trial Print.

Science.gov (United States)

Australian Science Education Project, Toorak, Victoria.

This is a National Trial Print of a unit on plants produced as a part of the Australian Science Education Project. The unit consists of an information booklet for students, a booklet for recording student data, and a teacher's guide. The material, designed for use with students in the upper elementary grades, takes from 15 to 20 forty-minute…

Recycling of waste printed circuit boards with simultaneous enrichment of special metals by using alkaline melts: A green and strategically advantageous solution

Energy Technology Data Exchange (ETDEWEB)

Stuhlpfarrer, Philipp, E-mail: philipp-johannes.stuhlpfarrer@stud.unileoben.ac.at; Luidold, Stefan; Antrekowitsch, Helmut

2016-04-15

Highlights: • Removal of plastics. • Enrichment of In, Ga and Ge. • Low temperature. • No dioxines. - Abstract: The increasing consumption of electric and electronic equipment has led to a rise in toxic waste. To recover the metal fraction, a separation of the organic components is necessary because harmful substances such as chlorine, fluorine and bromine cause ecological damage, for example in the form of dioxins and furans at temperature above 400 °C. Hence, an alternative, environmentally friendly approach was investigated exploiting that a mixture of caustic soda and potassium hydroxide in eutectic composition melts below 200 °C, enabling a fast cracking of the long hydrocarbon chains. The trials demonstrate the removal of organic compounds without a loss of copper and precious metals, as well as a suppressed formation of hazardous off-gases. In order to avoid an input of alkaline elements into the furnace and ensuing problems with refractory materials, a washing step generates a sodium and potassium hydroxide solution, in which special metals like indium, gallium and germanium are enriched. Their concentrations facilitate the recovery of these elements, because otherwise they become lost in the typical recycling processes. The aim of this work was to find an environmental solution for the separation of plastics and metals as well as a strategically important answer for the recycling of printed circuit boards and mobile phones.

Recycling of waste printed circuit boards with simultaneous enrichment of special metals by using alkaline melts: A green and strategically advantageous solution.

Science.gov (United States)

Stuhlpfarrer, Philipp; Luidold, Stefan; Antrekowitsch, Helmut

2016-04-15

The increasing consumption of electric and electronic equipment has led to a rise in toxic waste. To recover the metal fraction, a separation of the organic components is necessary because harmful substances such as chlorine, fluorine and bromine cause ecological damage, for example in the form of dioxins and furans at temperature above 400°C. Hence, an alternative, environmentally friendly approach was investigated exploiting that a mixture of caustic soda and potassium hydroxide in eutectic composition melts below 200°C, enabling a fast cracking of the long hydrocarbon chains. The trials demonstrate the removal of organic compounds without a loss of copper and precious metals, as well as a suppressed formation of hazardous off-gases. In order to avoid an input of alkaline elements into the furnace and ensuing problems with refractory materials, a washing step generates a sodium and potassium hydroxide solution, in which special metals like indium, gallium and germanium are enriched. Their concentrations facilitate the recovery of these elements, because otherwise they become lost in the typical recycling processes. The aim of this work was to find an environmental solution for the separation of plastics and metals as well as a strategically important answer for the recycling of printed circuit boards and mobile phones. Copyright © 2015 Elsevier B.V. All rights reserved.

Recycling of waste printed circuit boards with simultaneous enrichment of special metals by using alkaline melts: A green and strategically advantageous solution

International Nuclear Information System (INIS)

Stuhlpfarrer, Philipp; Luidold, Stefan; Antrekowitsch, Helmut

2016-01-01

Highlights: • Removal of plastics. • Enrichment of In, Ga and Ge. • Low temperature. • No dioxines. - Abstract: The increasing consumption of electric and electronic equipment has led to a rise in toxic waste. To recover the metal fraction, a separation of the organic components is necessary because harmful substances such as chlorine, fluorine and bromine cause ecological damage, for example in the form of dioxins and furans at temperature above 400 °C. Hence, an alternative, environmentally friendly approach was investigated exploiting that a mixture of caustic soda and potassium hydroxide in eutectic composition melts below 200 °C, enabling a fast cracking of the long hydrocarbon chains. The trials demonstrate the removal of organic compounds without a loss of copper and precious metals, as well as a suppressed formation of hazardous off-gases. In order to avoid an input of alkaline elements into the furnace and ensuing problems with refractory materials, a washing step generates a sodium and potassium hydroxide solution, in which special metals like indium, gallium and germanium are enriched. Their concentrations facilitate the recovery of these elements, because otherwise they become lost in the typical recycling processes. The aim of this work was to find an environmental solution for the separation of plastics and metals as well as a strategically important answer for the recycling of printed circuit boards and mobile phones.

A 3-D Printed Microfluidic Microgravity Microbial Fuel Cell for Satellite Missions

Data.gov (United States)

National Aeronautics and Space Administration — This project focused on developing bioelectrochemical test units that could be manufactured principally using additive manufacturing (3D printing) methodologies....

Safety measures for the main control board replacement project at Ikata units 1 and 2

International Nuclear Information System (INIS)

Hashimoto, Nozomu; Tada, Kenji

2013-01-01

When Units 1 and 2 of the Ikata Power Station underwent replacement of their main control boards, control cabinets, and associated equipment, it was necessary to remove all the control boards, cabinets, and cables from the control building including from the main control room. This meant the loss of operation and monitoring functions in the main control room and functions of control cabinets. To maintain the operation and monitoring functions required under plant shutdown conditions, temporary operation and monitoring equipment (i.e., temporary main control board) was installed in the temporary main control room. The advance preparations included a trial switching from the permanent to the temporary main control board to identify and address potential problems in advance. When the replacement work was underway, a work schedule sheet posted in the temporary and the permanent control rooms was used to prevent human errors caused by operators’ recognition errors. Monitoring and control signals were switched from the old boards to the temporary boards and from the temporary boards to the new boards at appropriate timings to ensure plant safety during the replacement operation. (author)

A novel reutilization method for waste printed circuit boards as flame retardant and smoke suppressant for poly (vinyl chloride)

Energy Technology Data Exchange (ETDEWEB)

Xiu, Fu-Rong, E-mail: xiu_chem@hotmail.com [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350108 (China); Weng, Huiwei; Qi, Yingying; Yu, Gending; Zhang, Zhigang [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350108 (China); Zhang, Fu-Shen [Research Center for Eco-Environmental Sciences, Chinese Academy of Sciences, Beijing 100085 (China)

2016-09-05

Highlights: • We report a novel electronic waste-based flame retardant for PVC. • The SCWO-treated PCBs significantly improves the flame retardancy of PVC. • The flame retardant mechanism of SCWO-treated PCBs was studied. • Appropriate amount flame retardant does not degrade the mechanical property of PVC. - Abstract: In this study, a novel reutilization method for waste printed circuit boards (PCBs) as flame retardant and smoke suppressant for poly (vinyl chloride) (PVC) was successfully testified. A supercritical water oxidation (SCWO) process was applied to treat waste PCBs before they could be used as flame retardants of PVC. The results indicated that SCWO conditions had a significant effect on the flame retarding and smoke suppressing properties of waste PCBs for PVC. Cu{sub 2}O, CuO, and SnO{sub 2} were the main active ingredients in waste PCBs-derived flame retardants. A conversion of Cu elements (Cu{sup 0} → Cu{sup +} → Cu{sup 2+}) during SCWO process with the increase of reaction temperature was found to be the key influence factor for the flame retarding properties of SCWO-treated PCBs. The experiment results also showed that there was a synergistic effect of flame retardancy between Cu{sup +} and Cu{sup 2+}. After the optimized SCWO treatment, SCWO-treated PCBs significantly improved the flame retardancy and smoke suppression of PVC. Limiting oxygen index (LOI) and char yield (CY) increased with increasing SCWO-treated PCBs content in PVC, while smoke density rating (SDR) and maximum smoke density (MSD) decreased markedly. The mechanical properties of PVC samples were influenced in different degree by adding different content SCWO-treated PCBs.

A novel reutilization method for waste printed circuit boards as flame retardant and smoke suppressant for poly (vinyl chloride)

International Nuclear Information System (INIS)

Xiu, Fu-Rong; Weng, Huiwei; Qi, Yingying; Yu, Gending; Zhang, Zhigang; Zhang, Fu-Shen

2016-01-01

Highlights: • We report a novel electronic waste-based flame retardant for PVC. • The SCWO-treated PCBs significantly improves the flame retardancy of PVC. • The flame retardant mechanism of SCWO-treated PCBs was studied. • Appropriate amount flame retardant does not degrade the mechanical property of PVC. - Abstract: In this study, a novel reutilization method for waste printed circuit boards (PCBs) as flame retardant and smoke suppressant for poly (vinyl chloride) (PVC) was successfully testified. A supercritical water oxidation (SCWO) process was applied to treat waste PCBs before they could be used as flame retardants of PVC. The results indicated that SCWO conditions had a significant effect on the flame retarding and smoke suppressing properties of waste PCBs for PVC. Cu_2O, CuO, and SnO_2 were the main active ingredients in waste PCBs-derived flame retardants. A conversion of Cu elements (Cu"0 → Cu"+ → Cu"2"+) during SCWO process with the increase of reaction temperature was found to be the key influence factor for the flame retarding properties of SCWO-treated PCBs. The experiment results also showed that there was a synergistic effect of flame retardancy between Cu"+ and Cu"2"+. After the optimized SCWO treatment, SCWO-treated PCBs significantly improved the flame retardancy and smoke suppression of PVC. Limiting oxygen index (LOI) and char yield (CY) increased with increasing SCWO-treated PCBs content in PVC, while smoke density rating (SDR) and maximum smoke density (MSD) decreased markedly. The mechanical properties of PVC samples were influenced in different degree by adding different content SCWO-treated PCBs.

Retrospective Conversion of Solar Data Printed in "Synoptic Maps of the Solar Chromosphere": A Scientific and Librarianship Project

Science.gov (United States)

Laurenceau, A.; Aboudarham, J.; Renié, C.

2015-04-01

Between 1928 and 2003, the Observatoire de Paris published solar activity maps and their corresponding data tables, first in the Annals of the Meudon Observatory, then in the Synoptic Maps of the Solar Chromosphere. These maps represent the main solar structures in a single view and spread out on a complete Carrington rotation as well as tables of associated data, containing various information on these structures such as positions, length, morphological characteristics, and behavior. Since 2003, these maps and data tables have not been released in print, as they are only published on the online BASS2000 database, the solar database maintained by LESIA (Laboratory for space studies and astrophysical instruments). In order to make the first 80 years of observations which were available only in paper accessible and usable, the LESIA and the Library of the Observatory have started a project to digitize the publications, enter the data with the assistance of a specialized company, and then migrate the files obtained in BASS2000 and in the Heliophysics Features Catalog created in the framework of the European project HELIO.

Pension Fund Governing Board

CERN Multimedia

HR Department

2008-01-01

Note The CERN pension scheme is based on the principle of defined benefits, so beneficiaries continue to receive the benefits to which they are entitled in accordance with the Rules of the Pension Fund. This means that pension entitlements under the Rules are not directly affected by the financial crisis and the current economic situation. However, the adjustment of pensions to the cost of living is not automatic and, under the method applied since 2006, must take into account the Fund’s financial position. Meeting of the Pension Fund Governing Board The Pension Fund Governing Board held its eighth meeting at ESO in Garching, Germany (near Munich) on 24 October 2008. Before starting its work, the Governing Board had the privilege of hearing an opening address by Professor Tim de Zeeuw, the Director General of ESO. Professor de Zeeuw described the mission of ESO and the ambitious projects of his organisation, which performs astronomy observations using telescopes located in...

Pension Fund Governing Board

CERN Multimedia

HR Department

2008-01-01

Note The CERN pension scheme is based on the principle of defined benefits, so beneficiaries continue to receive the benefits to which they are entitled in accordance with the Rules of the Pension Fund. This means that pension entitlements under the Rules are not directly affected by the financial crisis and the current economic situation. However, the adjustment of pensions to the cost of living is not automatic and, under the method applied since 2006, must take into account the Fund’s financial position. Meeting of the Pension Fund Governing Board The Pension Fund Governing Board held its eighth meeting at ESO in Garching (near Munich), Germany on 24 October 2008. Before starting its work, the Governing Board had the privilege of hearing an opening address by Professor Tim de Zeeuw, the Director General of ESO. Professor de Zeeuw described the mission of ESO and the ambitious projects of his organisation, which performs astronomy observations using telescopes located in Chile. The Director-General receiv...

Flight Hardware Virtualization for On-Board Science Data Processing Project

Data.gov (United States)

National Aeronautics and Space Administration — Utilize Hardware Virtualization technology to benefit on-board science data processing by investigating new real time embedded Hardware Virtualization solutions and...

Water Science and Technology Board annual report 1988

Energy Technology Data Exchange (ETDEWEB)

1989-01-01

This annual report of the Water Science and Technology Board (WSTB) summarizes the activities of the Board and its subgroups during 1988, its sixth year of existence. Included are descriptions of current and recently completed projects, new activities scheduled to begin in 1989, and plans for the future. The report also includes information on Board and committee memberships, program operational features, and reports produced during the past several years. This annual report is intended to provide an introduction to the WSTB and summary of its program for the year.

Print Finishing: From Manual to Automated Print Finishing

Directory of Open Access Journals (Sweden)

Gareth Ward

2004-12-01

Full Text Available Meeting the demand for faster turnrounds and shorter print runs goes beyond making the printing press easier to set up and change. There is little point in producing plates and then sheets from a press if the post press area does not change to keep abreast of developments in prepress and the print room. The greatest impact is going to come from JDF, the end to end production data format which is finding wide spread acceptance in print areas. To date finishing equipment manufacturers are not as well represented within the CIP4 organisation as prepress and press vendors, but the major manufacturers are members. All are working to the goal of complete connectivity.The idea of JDF is that if the format of a print product like a magazine is known during the creation phases, the information can be used to preset machinery that is going to be used to produce it, so avoiding input errors and saving manufacturing time.A second aspect to JDF is that information about performance and progress is gathered and can be retrieved from a central point or made available to a customer. Production scheduling and costing becomes more accurate and customer relationships are deepened. However JDF to its fullest extent is not yet in use in connecting the finishing area to the rest of the printing plant. Around the world different companies are testing the idea of JDF to connect saddle stitchers, guillotines and binders with frantic work underway to be able to show results soon.

A high speed electrohydrodynamic (EHD) jet printing method for line printing

International Nuclear Information System (INIS)

Phung, Thanh Huy; Kim, Seora; Kwon, Kye-Si

2017-01-01

Electrohydrodynamic (EHD) jet printing has drawn attention due to its capability to produce smaller dots and patterns with finer lines when compared to those obtained from using conventional inkjet printing. Previous studies have suggested that drop-on-demand EHD-patterning applications should be limited to very slow printing cases with speeds far less than 10 mm s −1 due to the small dot size and limited jetting frequency. In this study, a new EHD printing method is proposed to significantly increase the line-patterning printing speed by modifying the ink and thereby changing the relic shape. The proposed method has the additional advantage of reducing the line-pattern width. The results of the experiment show that the pattern width could be reduced from 20 µ m to 4 µ m by increasing the printing speed from 10 mm s −1 to 50 mm s −1 , respectively. (paper)

Engraving Print Classification

International Nuclear Information System (INIS)

Hoelck, Daniel; Barbe, Joaquim

2008-01-01

A print is a mark, or drawing, made in or upon a plate, stone, woodblock or other material which is cover with ink and then is press usually into a paper reproducing the image on the paper. Engraving prints usually are image composed of a group of binary lines, specially those are made with relief and intaglio techniques. Varying the number and the orientation of lines, the drawing of the engraving print is conformed. For this reason we propose an application based on image processing methods to classify engraving prints

Hybrid 3D-2D printing for bone scaffolds fabrication

Science.gov (United States)

Seleznev, V. A.; Prinz, V. Ya

2017-02-01

It is a well-known fact that bone scaffold topography on micro- and nanometer scale influences the cellular behavior. Nano-scale surface modification of scaffolds allows the modulation of biological activity for enhanced cell differentiation. To date, there has been only a limited success in printing scaffolds with micro- and nano-scale features exposed on the surface. To improve on the currently available imperfect technologies, in our paper we introduce new hybrid technologies based on a combination of 2D (nano imprint) and 3D printing methods. The first method is based on using light projection 3D printing and simultaneous 2D nanostructuring of each of the layers during the formation of the 3D structure. The second method is based on the sequential integration of preliminarily created 2D nanostructured films into a 3D printed structure. The capabilities of the developed hybrid technologies are demonstrated with the example of forming 3D bone scaffolds. The proposed technologies can be used to fabricate complex 3D micro- and nanostructured products for various fields.

Printing Insecurity? The Security Implications of 3D-Printing of Weapons

OpenAIRE

Walther, Gerald

2014-01-01

In 2013, the first gun printed out of plastic by a 3D-printer was successfully fired in the US. This event caused a major media hype about the dangers of being able to print a gun. Law enforcement agencies worldwide were concerned about this development and the potentially huge security implications of these functional plastic guns. As a result, politicians called for a ban of these weapons and a control of 3D-printing technology. This paper reviews the security implications of 3D-printing te...

A font and size-independent OCR system for printed Kannada ...

Indian Academy of Sciences (India)

R. Narasimhan (Krishtel eMaging) 1461 1996 Oct 15 13:05:22

put is an editable computer file containing the information in the printed page. ...... The work reported in this paper is partially supported by a project under the ... guage Technology Solutions – Kannada programme of the TDIL Group of the ...

Development of an electronic board for a neutrino telescope project

International Nuclear Information System (INIS)

Gabrielli, Alessandro; Gandolfi, Enzo; Ricci, Pier Paolo

2006-01-01

The NEMO (NEutrino Mediterranean Observatory) collaboration is involved in research and development for the construction of an underwater km 3 scale Cherenkov neutrino detector. The detector will consist of about four thousands of optical modules that interface with coaxial cables to electronics cards. The detector is connected to the shore by an electro-optical cable for data transmission and power supply. The board also provides signal synchronization, filtering, data compression and packing. We describe the details of this electronic control part, which has been developed using commercial components and the very high-speed, Hardware Description Language (VHDL). The design was implemented on a programmable device. A test-bench system was also designed using a PC-based acquisition board running on the National Instrument LabVIEW environment

On-Board Mining in the Sensor Web

Science.gov (United States)

Tanner, S.; Conover, H.; Graves, S.; Ramachandran, R.; Rushing, J.

2004-12-01

On-board data mining can contribute to many research and engineering applications, including natural hazard detection and prediction, intelligent sensor control, and the generation of customized data products for direct distribution to users. The ability to mine sensor data in real time can also be a critical component of autonomous operations, supporting deep space missions, unmanned aerial and ground-based vehicles (UAVs, UGVs), and a wide range of sensor meshes, webs and grids. On-board processing is expected to play a significant role in the next generation of NASA, Homeland Security, Department of Defense and civilian programs, providing for greater flexibility and versatility in measurements of physical systems. In addition, the use of UAV and UGV systems is increasing in military, emergency response and industrial applications. As research into the autonomy of these vehicles progresses, especially in fleet or web configurations, the applicability of on-board data mining is expected to increase significantly. Data mining in real time on board sensor platforms presents unique challenges. Most notably, the data to be mined is a continuous stream, rather than a fixed store such as a database. This means that the data mining algorithms must be modified to make only a single pass through the data. In addition, the on-board environment requires real time processing with limited computing resources, thus the algorithms must use fixed and relatively small amounts of processing time and memory. The University of Alabama in Huntsville is developing an innovative processing framework for the on-board data and information environment. The Environment for On-Board Processing (EVE) and the Adaptive On-board Data Processing (AODP) projects serve as proofs-of-concept of advanced information systems for remote sensing platforms. The EVE real-time processing infrastructure will upload, schedule and control the execution of processing plans on board remote sensors. These plans

Adult rat retinal ganglion cells and glia can be printed by piezoelectric inkjet printing

International Nuclear Information System (INIS)

Lorber, Barbara; Martin, Keith R; Hsiao, Wen-Kai; Hutchings, Ian M

2014-01-01

We have investigated whether inkjet printing technology can be extended to print cells of the adult rat central nervous system (CNS), retinal ganglion cells (RGC) and glia, and the effects on survival and growth of these cells in culture, which is an important step in the development of tissue grafts for regenerative medicine, and may aid in the cure of blindness. We observed that RGC and glia can be successfully printed using a piezoelectric printer. Whilst inkjet printing reduced the cell population due to sedimentation within the printing system, imaging of the printhead nozzle, which is the area where the cells experience the greatest shear stress and rate, confirmed that there was no evidence of destruction or even significant distortion of the cells during jet ejection and drop formation. Importantly, the viability of the cells was not affected by the printing process. When we cultured the same number of printed and non-printed RGC/glial cells, there was no significant difference in cell survival and RGC neurite outgrowth. In addition, use of a glial substrate significantly increased RGC neurite outgrowth, and this effect was retained when the cells had been printed. In conclusion, printing of RGC and glia using a piezoelectric printhead does not adversely affect viability and survival/growth of the cells in culture. Importantly, printed glial cells retain their growth-promoting properties when used as a substrate, opening new avenues for printed CNS grafts in regenerative medicine. (paper)

Visualizations as Projection Devices

DEFF Research Database (Denmark)

Harty, Chris; Holm Jacobsen, Peter; Tryggestad, Kjell

The aim of this paper is to inquire into the role of project visualizations in shaping healthcare spaces and practices. The study draws upon an ethnographic field study from a large on-going hospital construction project in Denmark, and focuses on the early phases of on-boarding the design team...... into the project organization. During the on-boarding visualizations multiplies in form, content and purpose, ranging from paper and digitally based projections of clinical work spaces and practices for the future hospital building in use, to paper and digitally based projections of the cost budget and time...

A quick solution, made to measure; Big scientific experiments need big circuit boards and that's where East Kilbride's D-TACQ comes in

CERN Multimedia

Gardner, D

2003-01-01

D-TACQ is a small electronics company operating in a highly-specialised market with technological expertise that few can match worldwide. It specialises in designing and manufacturing bespoke printed circuit boards (PCBs) which handle data acquisition tasks linked to scientific instrumentation and control systems (1 page).

Recent trends in bioinks for 3D printing.

Science.gov (United States)

Gopinathan, Janarthanan; Noh, Insup

2018-01-01

The worldwide demand for the organ replacement or tissue regeneration is increasing steadily. The advancements in tissue engineering and regenerative medicine have made it possible to regenerate such damaged organs or tissues into functional organ or tissue with the help of 3D bioprinting. The main component of the 3D bioprinting is the bioink, which is crucial for the development of functional organs or tissue structures. The bioinks used in 3D printing technology require so many properties which are vital and need to be considered during the selection. Combination of different methods and enhancements in properties are required to develop more successful bioinks for the 3D printing of organs or tissue structures. This review consists of the recent state-of-art of polymer-based bioinks used in 3D printing for applications in tissue engineering and regenerative medicine. The subsection projects the basic requirements for the selection of successful bioinks for 3D printing and developing 3D tissues or organ structures using combinations of bioinks such as cells, biomedical polymers and biosignals. Different bioink materials and their properties related to the biocompatibility, printability, mechanical properties, which are recently reported for 3D printing are discussed in detail. Many bioinks formulations have been reported from cell-biomaterials based bioinks to cell-based bioinks such as cell aggregates and tissue spheroids for tissue engineering and regenerative medicine applications. Interestingly, more tunable bioinks, which are biocompatible for live cells, printable and mechanically stable after printing are emerging with the help of functional polymeric biomaterials, their modifications and blending of cells and hydrogels. These approaches show the immense potential of these bioinks to produce more complex tissue/organ structures using 3D bioprinting in the future.

Advances in Home Photo Printing

Institute of Scientific and Technical Information of China (English)

Qian Lin; Brian Atkins; Huitao Luo

2004-01-01

With digital camera adoptions going main stream, consumers capture a record number of photos.Currently, the majority of the digital photos are printed at home. One of the key enablers of this transformation is the advancement of home photo printing technologies. In the past few years, inkjet printing technologies have continued to deliver smaller drop size, larger number of inks, and longer-lasting prints. In the mean time, advanced image processing automatically enhances captured digital photos while being printed. The combination of the above two forces has closed the gap between the home photo prints and AgX prints. It will give an overview of the home photo printing market and technology trends, and discuss major advancements in automatic image processing.

Printed Electronics

Science.gov (United States)

Korkut, Sibel (Inventor); Chiang, Katherine S. (Inventor); Crain, John M. (Inventor); Aksay, Ilhan A. (Inventor); Lettow, John S. (Inventor); Chen, Chuan-Hua (Inventor); Prud'Homme, Robert K. (Inventor)

2018-01-01

Printed electronic device comprising a substrate onto at least one surface of which has been applied a layer of an electrically conductive ink comprising functionalized graphene sheets and at least one binder. A method of preparing printed electronic devices is further disclosed.

The Use of 3D Printing in the Development of Gaseous Radiation Detectors

Science.gov (United States)

Fargher, Sam; Steer, Chris; Thompson, Lee

2018-01-01

Fused Deposition Modelling has been used to produce a small, single wire, Iarocci-style drift tube to demonstrate the feasibility of using the Additive Manufacturing technique to produce cheap detectors, quickly. Recent technological developments have extended the scope of Additive Manufacturing, or 3D printing, to the possibility of fabricating Gaseous Radiation Detectors, such as Single Wire Proportional Counters and Time Projection Chambers. 3D printing could allow for the production of customisable, modular detectors; that can be easily created and replaced and the possibility of printing detectors on-site in remote locations and even for outreach within schools. The 3D printed drift tube was printed using Polylactic acid to produce a gas volume in the shape of an inverted triangular prism; base length of 28 mm, height 24.25 mm and tube length 145 mm. A stainless steel anode wire was placed in the centre of the tube, mid-print. P5 gas (95% Argon, 5% Methane) was used as the drift gas and a circuit was built to capacitively decouple signals from the high voltage. The signal rate and average pulse height of cosmic ray muons were measured over a range of bias voltages to characterise and prove correct operation of the printed detector.

Characterizing performances of solder paste printing process at flexible manufacturing lines

International Nuclear Information System (INIS)

Siew, Jit Ping; Low, Heng Chin; Teoh, Ping Chow

2015-01-01

Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter

Characterizing performances of solder paste printing process at flexible manufacturing lines

Energy Technology Data Exchange (ETDEWEB)

Siew, Jit Ping; Low, Heng Chin [University of Science Malaysia, 11800 Minden, Penang (Malaysia); Teoh, Ping Chow [Wawasan Open University, 54 Jalan Sultan Ahmad Shah, 10050 Penang (Malaysia)

2015-02-03

Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter.

Printing Has a Future

Directory of Open Access Journals (Sweden)

Hans Georg Wenke

2004-12-01

Full Text Available Printing will also be done in the future. Printed items meet basic needs and are deeply anchored in people’s habits. Being able to handle and collect printed matter is highly attractive. And paper is now more alive than ever. It is therefore too shortsighted to disclaim the importance of one of the still large economic sectors just because of a few looming-recession instigated market shifts.The exciting aspect of drupa 2004 is: printing will be reinvented, so to speak. Much more printing will be done in the future than at present. On the one hand, people are concentrating on process optimization and automation to ensure this. Measuring and testing, process control and optimization, and linking up "office software" with printing technology will be very central topics at drupa 2004. Electronics and print are not rivals; a symbiosis exists. And printing is high-tech: hardly any other multifaceted sector which has been so successful for centuries is as computerized as the printing industry.A series of "new chapters" in the variety of printing possibilities will be opened at drupa. Talk will be generated by further technical developments, often the connection between paper/cardboard and electronics, the link between the office world and graphics industry, text databases and their link-up to graphic page production tools, and "on the fly" dynamic printing over networks.All of this and more belongs to future potentialities, which are so substantial overall, the outlook is by no means black for the "black art". Like its predecessors, drupa 2004 is also a product trade fair. However, more than ever before in its history, it is also an "information village". The exhibits are useful, because they occasionally make what this means visible.

Solvents interactions with thermochromic print

Directory of Open Access Journals (Sweden)

Mirela Rožić

2017-12-01

Full Text Available In this study, the interactions between different solvents (benzene, acetone, cyclohexanone, various alcohols and water and thermochromic printing ink were investigated. Thermochromic printing ink was printed on metal surface. Components of thermochromic printing inks are polymeric microcapsules and classic yellow offset printing ink. Below its activation temperature, dye and developer within the microcapsules form a blue coloured complex. Therefore, thermochromic print is green. By heating above the activation temperature, blue colour of the complex turns into the leuco dye colourless state and the green colour of the prints turns into the yellow colour of the classic offset pigment. The results of the interaction with various solvents show that the thermochromic print is stable in all tested solvents except in ethanol, acetone and cyclohexanone. In ethanol, the green colour of the print becomes yellow. SEM analysis shows that microcapsules are dissolved. In acetone and cyclohexanone, the green colour of the print turns into blue, and the microcapsules become significantly more visible. Thus, the yellow pigment interacts with examined ketones. Based on the obtained interactions it can be concluded that the microcapsules have more polar nature than the classical pigment particles. Solvent-thermocromic print interactions were analysed using Hansen solubility parameters that rank the solvents based on their estimated interaction capabilities.

Skills Today for Tomorrow. A Workplace Literacy Consortium for the Printing Industry, March 1991-November 1992. Final Report.

Science.gov (United States)

Catonsville Community Coll., MD.

A cooperative project received a federal education grant to provide workplace literacy education in communications, mathematics, and problem-solving skills for the printing/graphic arts industry. Partners in the 18-month program were Catonsville Community College in Baltimore (Maryland), the printing industries of Maryland and Southern…

Technical Note: Characterization of custom 3D printed multimodality imaging phantoms

International Nuclear Information System (INIS)

Bieniosek, Matthew F.; Lee, Brian J.; Levin, Craig S.

2015-01-01

Purpose: Imaging phantoms are important tools for researchers and technicians, but they can be costly and difficult to customize. Three dimensional (3D) printing is a widely available rapid prototyping technique that enables the fabrication of objects with 3D computer generated geometries. It is ideal for quickly producing customized, low cost, multimodal, reusable imaging phantoms. This work validates the use of 3D printed phantoms by comparing CT and PET scans of a 3D printed phantom and a commercial “Micro Deluxe” phantom. This report also presents results from a customized 3D printed PET/MRI phantom, and a customized high resolution imaging phantom with sub-mm features. Methods: CT and PET scans of a 3D printed phantom and a commercial Micro Deluxe (Data Spectrum Corporation, USA) phantom with 1.2, 1.6, 2.4, 3.2, 4.0, and 4.8 mm diameter hot rods were acquired. The measured PET and CT rod sizes, activities, and attenuation coefficients were compared. A PET/MRI scan of a custom 3D printed phantom with hot and cold rods was performed, with photon attenuation and normalization measurements performed with a separate 3D printed normalization phantom. X-ray transmission scans of a customized two level high resolution 3D printed phantom with sub-mm features were also performed. Results: Results show very good agreement between commercial and 3D printed micro deluxe phantoms with less than 3% difference in CT measured rod diameter, less than 5% difference in PET measured rod diameter, and a maximum of 6.2% difference in average rod activity from a 10 min, 333 kBq/ml (9 μCi/ml) Siemens Inveon (Siemens Healthcare, Germany) PET scan. In all cases, these differences were within the measurement uncertainties of our setups. PET/MRI scans successfully identified 3D printed hot and cold rods on PET and MRI modalities. X-ray projection images of a 3D printed high resolution phantom identified features as small as 350 μm wide. Conclusions: This work shows that 3D printed

Technical Note: Characterization of custom 3D printed multimodality imaging phantoms

Energy Technology Data Exchange (ETDEWEB)

Bieniosek, Matthew F. [Department of Electrical Engineering, Stanford University, 350 Serra Mall, Stanford, California 94305 (United States); Lee, Brian J. [Department of Mechanical Engineering, Stanford University, 440 Escondido Mall, Stanford, California 94305 (United States); Levin, Craig S., E-mail: cslevin@stanford.edu [Departments of Radiology, Physics, Bioengineering and Electrical Engineering, Stanford University, 300 Pasteur Dr., Stanford, California 94305-5128 (United States)

2015-10-15

Purpose: Imaging phantoms are important tools for researchers and technicians, but they can be costly and difficult to customize. Three dimensional (3D) printing is a widely available rapid prototyping technique that enables the fabrication of objects with 3D computer generated geometries. It is ideal for quickly producing customized, low cost, multimodal, reusable imaging phantoms. This work validates the use of 3D printed phantoms by comparing CT and PET scans of a 3D printed phantom and a commercial “Micro Deluxe” phantom. This report also presents results from a customized 3D printed PET/MRI phantom, and a customized high resolution imaging phantom with sub-mm features. Methods: CT and PET scans of a 3D printed phantom and a commercial Micro Deluxe (Data Spectrum Corporation, USA) phantom with 1.2, 1.6, 2.4, 3.2, 4.0, and 4.8 mm diameter hot rods were acquired. The measured PET and CT rod sizes, activities, and attenuation coefficients were compared. A PET/MRI scan of a custom 3D printed phantom with hot and cold rods was performed, with photon attenuation and normalization measurements performed with a separate 3D printed normalization phantom. X-ray transmission scans of a customized two level high resolution 3D printed phantom with sub-mm features were also performed. Results: Results show very good agreement between commercial and 3D printed micro deluxe phantoms with less than 3% difference in CT measured rod diameter, less than 5% difference in PET measured rod diameter, and a maximum of 6.2% difference in average rod activity from a 10 min, 333 kBq/ml (9 μCi/ml) Siemens Inveon (Siemens Healthcare, Germany) PET scan. In all cases, these differences were within the measurement uncertainties of our setups. PET/MRI scans successfully identified 3D printed hot and cold rods on PET and MRI modalities. X-ray projection images of a 3D printed high resolution phantom identified features as small as 350 μm wide. Conclusions: This work shows that 3D printed

Technical Note: Characterization of custom 3D printed multimodality imaging phantoms.

Science.gov (United States)

Bieniosek, Matthew F; Lee, Brian J; Levin, Craig S

2015-10-01

Imaging phantoms are important tools for researchers and technicians, but they can be costly and difficult to customize. Three dimensional (3D) printing is a widely available rapid prototyping technique that enables the fabrication of objects with 3D computer generated geometries. It is ideal for quickly producing customized, low cost, multimodal, reusable imaging phantoms. This work validates the use of 3D printed phantoms by comparing CT and PET scans of a 3D printed phantom and a commercial "Micro Deluxe" phantom. This report also presents results from a customized 3D printed PET/MRI phantom, and a customized high resolution imaging phantom with sub-mm features. CT and PET scans of a 3D printed phantom and a commercial Micro Deluxe (Data Spectrum Corporation, USA) phantom with 1.2, 1.6, 2.4, 3.2, 4.0, and 4.8 mm diameter hot rods were acquired. The measured PET and CT rod sizes, activities, and attenuation coefficients were compared. A PET/MRI scan of a custom 3D printed phantom with hot and cold rods was performed, with photon attenuation and normalization measurements performed with a separate 3D printed normalization phantom. X-ray transmission scans of a customized two level high resolution 3D printed phantom with sub-mm features were also performed. Results show very good agreement between commercial and 3D printed micro deluxe phantoms with less than 3% difference in CT measured rod diameter, less than 5% difference in PET measured rod diameter, and a maximum of 6.2% difference in average rod activity from a 10 min, 333 kBq/ml (9 μCi/ml) Siemens Inveon (Siemens Healthcare, Germany) PET scan. In all cases, these differences were within the measurement uncertainties of our setups. PET/MRI scans successfully identified 3D printed hot and cold rods on PET and MRI modalities. X-ray projection images of a 3D printed high resolution phantom identified features as small as 350 μm wide. This work shows that 3D printed phantoms can be functionally equivalent to

Three-dimensional bio-printing.

Science.gov (United States)

Gu, Qi; Hao, Jie; Lu, YangJie; Wang, Liu; Wallace, Gordon G; Zhou, Qi

2015-05-01

Three-dimensional (3D) printing technology has been widely used in various manufacturing operations including automotive, defence and space industries. 3D printing has the advantages of personalization, flexibility and high resolution, and is therefore becoming increasingly visible in the high-tech fields. Three-dimensional bio-printing technology also holds promise for future use in medical applications. At present 3D bio-printing is mainly used for simulating and reconstructing some hard tissues or for preparing drug-delivery systems in the medical area. The fabrication of 3D structures with living cells and bioactive moieties spatially distributed throughout will be realisable. Fabrication of complex tissues and organs is still at the exploratory stage. This review summarize the development of 3D bio-printing and its potential in medical applications, as well as discussing the current challenges faced by 3D bio-printing.

Acrylated Palm Oil Resins for Radiation (UV) Curing of Over Print Varnish (OPV)

International Nuclear Information System (INIS)

Norshamsul Arif; Mohd Hilmi Mahmood; Khairul Zaman Mohd Dahlan; Rosley Che Ismail; Flora Sim; Sharilla Muhammad Faizal

2010-01-01

The purpose of this project was to determine the effects of Acrylated Epoxidized Palm Oil (EPOLA) on a radiation (UV) curing Over Print Varnish (OPV) application. The initial target was to produce an environmentally friendly resin (non-VOC) and reduce the dependence on petroleum (hydrocarbon) based products which are more toxic. Toxicity was determined via Acute Oral Toxicity (LD50), OECD 401 and Acute Toxicity (Dermal), OECD 402 technique whilst the reactivity, chemical resistance and other physical properties were obtained from actual printing application test. The developed EPOLA resin was combined with acrylated monomers, photo initiator(s) and additives in typical OPV formulation before being chemically converted into protective glossy printed film under Ultra Violet (UV-C) light. The gloss, flexibility and adhesion effects are significantly greater than conventional OPV epoxy based coupled with further extremely low irritancy to skin. The contributions of this project are twofold. First, the toxicity of developed acrylated Palm Oil resin is certainly lower than conventional epoxy acrylates resin. Secondly, the benefits towards radiation curing OPV applications were significantly demonstrated. (author)

High speed bending of 2nd level interconnects on printed circuit boards for automotive electronics

NARCIS (Netherlands)

Kouters, M.H.M.; Ubachs, R.; Wiel, H.J. van de; Waal, A. van der; Veer, J. van der

2011-01-01

Standard drop tests for portable electronics are not representative for the qualification of automotive electronics. High-frequency vibrations are more dominant than abrupt shocks during normal operation. In this work a high speed board bending (HSB) method is developed to mimic the constant cyclic

Printing at CERN

CERN Multimedia

Otto, R

2007-01-01

For many years CERN had a very sophisticated print server infrastructure which supported several different protocols (AppleTalk, IPX and TCP/IP) and many different printing standards. Today’s situation differs a lot: we have a much more homogenous network infrastructure, where TCP/IP is used everywhere and we have less printer models, which almost all work using current standards (i.e. they all provide PostScript drivers). This change gave us the possibility to review the printing architecture aiming at simplifying the infrastructure in order to achieve full automation of the service. The new infrastructure offers both: LPD service exposing print queues to Linux and Mac OS X computers and native printing for Windows based clients. The printer driver distribution is automatic and native on Windows and automated by custom mechanisms on Linux, where the appropriate Foomatic drivers are configured. Also the process of printer registration and queue creation is completely automated following the printer regis...

The Problem: Low-Achieving Districts and Low-Performing Boards

Directory of Open Access Journals (Sweden)

David E. Lee

2014-10-01

Full Text Available Effective school districts maintain superintendent and school board collegiality which can foster success and connectedness among members. Delagardelle and Alsbury (2008 found that superintendents and board members are not consistent in their perceptions about the work the board does, and Glass (2007 found that states do not require boards to undergo evaluation for effectiveness. In the current study, 115 board meetings were observed using the School Board Video Project (SBVP survey, which was created in 2012 by researchers to uncover school board meetings’ effectiveness. MANOVA, Univariate ANOVA, and Pearson Chi-Square test results revealed significant differences between low-, medium-, and high-performing districts’ school board meetings. Evidence indicated that low-performing districts’ board meetings were: less orderly; had less time spent on student achievement; lacked respectful and attentive engagement across speakers; had board meeting members who seemed to advance their own agenda; had less effective working relationships among the governance team; had fewer board members who relied on the superintendent for advice and input; had one member, other than the board president, stand out for taking excessive time during meetings; and did not focus on policy items as much as high- and medium-performing school districts. The research concluded that more school board members from low-performing districts needed training to improve their effectiveness. Furthermore, highly refined and target-enhanced school board training programs might lead to lasting governance success and more effective teaming that could improve district, and ultimately, student achievement.

Canada-Nova Scotia Offshore Petroleum Board Annual report 1998-1999

International Nuclear Information System (INIS)

1999-01-01

The Canada-Nova Scotia Offshore Petroleum Board is responsible for ensuring safe working conditions for offshore petroleum activities, protecting the environment during offshore petroleum operations, and managing offshore petroleum resources. This annual report includes financial statements of the Board for the fiscal year ending March 31, 1999. The projects undertaken by the Board in 1998-1999 included a technical audit of the Sable Offshore Energy Project, a resource assessment of the area known as the 'Gully', and resolving a complication regarding publicly available resource data for calls for bids for NS98-1 and NS98-2. A list of exploration licences in place in the Nova Scotia Offshore area was presented. Their total work bid was just over $188 million. In 1998, the Board's exploration activity included the review and approval for nine seismic programs. The Board also continues to monitor the extended Cohasset Benefits Plan to cover the scope of PanCanadian's Exploratory Drilling Program. This report included statements of financial position, revenue and expenditure, changes in financial position, and notes to the financial statements including accounting policies, accounts receivable, deferred revenue and commitments. The report also admitted uncertainty due to the year 2000 issue. It stated that it is not possible to be certain that all aspects of the year 2000 issue affecting the Board will be fully resolved. tabs., figs

Angle resolved x-ray photoelectron spectroscopy (ARXPS) analysis of lanthanum oxide for micro-flexography printing

Energy Technology Data Exchange (ETDEWEB)

Hassan, S., E-mail: suhaimihas@uthm.edu.my; Yusof, M. S., E-mail: mdsalleh@uthm.edu.my; Maksud, M. I., E-mail: midris1973@gmail.com [Faculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia, 86400 Batu Pahat, Johor (Malaysia); Embong, Z., E-mail: zaidi@uthm.edu.my [Faculty of Science, Technology and Human Development, Universiti Tun Hussein Onn Malaysia, 86400 Batu Pahat, Johor (Malaysia)

2016-01-22

Micro-flexography printing was developed in patterning technique from micron to nano scale range to be used for graphic, electronic and bio-medical device on variable substrates. In this work, lanthanum oxide (La{sub 2}O{sub 3}) has been used as a rare earth metal candidate as depositing agent. This metal deposit was embedded on Carbon (C) and Silica (Si) wafer substrate using Magnetron Sputtering technique. The choose of Lanthanum as a target is due to its wide application in producing electronic devices such as thin film battery and printed circuit board. The La{sub 2}O{sub 3} deposited on the surface of Si wafer substrate was then analyzed using Angle Resolve X-Ray Photoelectron Spectroscopy (ARXPS). The position for each synthetic component in the narrow scan of Lanthanum (La) 3d and O 1s are referred to the electron binding energy (eV). The La 3d narrow scan revealed that the oxide species of this particular metal is mainly contributed by La{sub 2}O{sub 3} and La(OH){sub 3}. The information of oxygen species, O{sup 2-} component from O 1s narrow scan indicated that there are four types of species which are contributed from the bulk (O{sup 2−}), two chemisorb component (La{sub 2}O{sub 3}) and La(OH){sub 3} and physisorp component (OH). Here, it is proposed that from the adhesive and surface chemical properties of La, it is suitable as an alternative medium for micro-flexography printing technique in printing multiple fine solid lines at nano scale. Hence, this paper will describe the capability of this particular metal as rare earth metal for use in of micro-flexography printing practice. The review of other parameters contributing to print fine lines will also be described later.

Angle resolved x-ray photoelectron spectroscopy (ARXPS) analysis of lanthanum oxide for micro-flexography printing

Science.gov (United States)

Hassan, S.; Yusof, M. S.; Embong, Z.; Maksud, M. I.

2016-01-01

Micro-flexography printing was developed in patterning technique from micron to nano scale range to be used for graphic, electronic and bio-medical device on variable substrates. In this work, lanthanum oxide (La2O3) has been used as a rare earth metal candidate as depositing agent. This metal deposit was embedded on Carbon (C) and Silica (Si) wafer substrate using Magnetron Sputtering technique. The choose of Lanthanum as a target is due to its wide application in producing electronic devices such as thin film battery and printed circuit board. The La2O3 deposited on the surface of Si wafer substrate was then analyzed using Angle Resolve X-Ray Photoelectron Spectroscopy (ARXPS). The position for each synthetic component in the narrow scan of Lanthanum (La) 3d and O 1s are referred to the electron binding energy (eV). The La 3d narrow scan revealed that the oxide species of this particular metal is mainly contributed by La2O3 and La(OH)3. The information of oxygen species, O2- component from O 1s narrow scan indicated that there are four types of species which are contributed from the bulk (O2-), two chemisorb component (La2O3) and La(OH)3 and physisorp component (OH). Here, it is proposed that from the adhesive and surface chemical properties of La, it is suitable as an alternative medium for micro-flexography printing technique in printing multiple fine solid lines at nano scale. Hence, this paper will describe the capability of this particular metal as rare earth metal for use in of micro-flexography printing practice. The review of other parameters contributing to print fine lines will also be described later.

SU-F-BRE-08: Feasibility of 3D Printed Patient Specific Phantoms for IMRT/IGRT QA

International Nuclear Information System (INIS)

Ehler, E; Higgins, P; Dusenbery, K

2014-01-01

Purpose: Test the feasibility of 3D printed, per-patient phantoms for IMRT QA to analyze the treatment delivery quality within the patient geometry. Methods: Using the head and neck region of an anthropomorphic phantom as a substitute for an actual patient, a soft-tissue equivalent model was constructed with the use of a 3D printer. A nine-field IMRT plan was constructed and dose verification measurements were performed for the 3D printed phantom. During the delivery of the IMRT QA on to the 3D printed phantom, the same patient positioning indexing system was used on the phantom and image guidance (cone beam CT) was used to localize the phantom, serving as a test of the IGRT system as well. The 3D printed phantom was designed to accommodate four radiochromic film planes (two axial, one coronal and one sagittal) and an ionization chamber measurement. As a frame of comparison, the IMRT QA was also performed on traditional phantoms. Dosimetric tolerance levels such as 3mm / 3% Gamma Index as well as 3% and 5% dose difference were considered. All detector systems were calibrated against a NIST traceable ionization chamber. Results: Comparison of results 3D printed patient phantom with the standard IMRT QA systems showed similar passing rates for the 3D printed phantom and the standard phantoms. However, the locations of the failing regions did not necessarily correlate. The 3D printed phantom was localized within 1 mm and 1° using on-board cone beam CT. Conclusion: A custom phantom was created using a 3D printer. It was determined that the use of patient specific phantoms to perform dosimetric verification and estimate the dose in the patient is feasible. In addition, end-to-end testing on a per-patient basis was possible with the 3D printed phantom. Further refinement of the phantom construction process is needed for routine clinical use

SU-F-BRE-08: Feasibility of 3D Printed Patient Specific Phantoms for IMRT/IGRT QA

Energy Technology Data Exchange (ETDEWEB)

Ehler, E; Higgins, P; Dusenbery, K [University of Minnesota, Minneapolis, MN (United States)

2014-06-15

Purpose: Test the feasibility of 3D printed, per-patient phantoms for IMRT QA to analyze the treatment delivery quality within the patient geometry. Methods: Using the head and neck region of an anthropomorphic phantom as a substitute for an actual patient, a soft-tissue equivalent model was constructed with the use of a 3D printer. A nine-field IMRT plan was constructed and dose verification measurements were performed for the 3D printed phantom. During the delivery of the IMRT QA on to the 3D printed phantom, the same patient positioning indexing system was used on the phantom and image guidance (cone beam CT) was used to localize the phantom, serving as a test of the IGRT system as well. The 3D printed phantom was designed to accommodate four radiochromic film planes (two axial, one coronal and one sagittal) and an ionization chamber measurement. As a frame of comparison, the IMRT QA was also performed on traditional phantoms. Dosimetric tolerance levels such as 3mm / 3% Gamma Index as well as 3% and 5% dose difference were considered. All detector systems were calibrated against a NIST traceable ionization chamber. Results: Comparison of results 3D printed patient phantom with the standard IMRT QA systems showed similar passing rates for the 3D printed phantom and the standard phantoms. However, the locations of the failing regions did not necessarily correlate. The 3D printed phantom was localized within 1 mm and 1° using on-board cone beam CT. Conclusion: A custom phantom was created using a 3D printer. It was determined that the use of patient specific phantoms to perform dosimetric verification and estimate the dose in the patient is feasible. In addition, end-to-end testing on a per-patient basis was possible with the 3D printed phantom. Further refinement of the phantom construction process is needed for routine clinical use.

Printing nanotube/nanowire for flexible microsystems

Science.gov (United States)

Tortorich, Ryan P.; Choi, Jin-Woo

2014-04-01

Printing has become an emerging manufacturing technology for mechanics, electronics, and consumer products. Additionally, both nanotubes and nanowires have recently been used as materials for sensors and electrodes due to their unique electrical and mechanical properties. Printed electrodes and conductive traces particularly offer versatility of fabricating low-cost, disposable, and flexible electrical devices and microsystems. While various printing methods such as screen printing have been conventional methods for printing conductive traces and electrodes, inkjet printing has recently attracted great attention due to its unique advantages including no template requirement, rapid printing at low cost, on-demand printing capability, and precise control of the printed material. Computer generated conductive traces or electrode patterns can simply be printed on a thin film substrate with proper conductive ink consisting of nanotubes or nanowires. However, in order to develop nanotube or nanowire ink, there are a few challenges that need to be addressed. The most difficult obstacle to overcome is that of nanotube/nanowire dispersion within a solution. Other challenges include adjusting surface tension and controlling viscosity of the ink as well as treating the surface of the printing substrate. In an attempt to pave the way for nanomaterial inkjet printing, we present a method for preparing carbon nanotube ink as well as its printing technique. A fully printed electrochemical sensor using inkjet-printed carbon nanotube electrodes is also demonstrated as an example of the possibilities for this technology.

Highly flexible self-powered sensors based on printed circuit board technology for human motion detection and gesture recognition.

Science.gov (United States)

Fuh, Yiin-Kuen; Ho, Hsi-Chun

2016-03-04

In this paper, we demonstrate a new integration of printed circuit board (PCB) technology-based self-powered sensors (PSSs) and direct-write, near-field electrospinning (NFES) with polyvinylidene fluoride (PVDF) micro/nano fibers (MNFs) as source materials. Integration with PCB technology is highly desirable for affordable mass production. In addition, we systematically investigate the effects of electrodes with intervals in the range of 0.15 mm to 0.40 mm on the resultant PSS output voltage and current. The results show that at a strain of 0.5% and 5 Hz, a PSS with a gap interval 0.15 mm produces a maximum output voltage of 3 V and a maximum output current of 220 nA. Under the same dimensional constraints, the MNFs are massively connected in series (via accumulation of continuous MNFs across the gaps ) and in parallel (via accumulation of parallel MNFs on the same gap) simultaneously. Finally, encapsulation in a flexible polymer with different interval electrodes demonstrated that electrical superposition can be realized by connecting MNFs collectively and effectively in serial/parallel patterns to achieve a high current and high voltage output, respectively. Further improvement in PSSs based on the effect of cooperativity was experimentally realized by rolling-up the device into a cylindrical shape, resulting in a 130% increase in power output due to the cooperative effect. We assembled the piezoelectric MNF sensors on gloves, bandages and stockings to fabricate devices that can detect different types of human motion, including finger motion and various flexing and extensions of an ankle. The firmly glued PSSs were tested on the glove and ankle respectively to detect and harvest the various movements and the output voltage was recorded as ∼1.5 V under jumping movement (one PSS) and ∼4.5 V for the clenched fist with five fingers bent concurrently (five PSSs). This research shows that piezoelectric MNFs not only have a huge impact on harvesting various external

Highly flexible self-powered sensors based on printed circuit board technology for human motion detection and gesture recognition

Science.gov (United States)

Fuh, Yiin-Kuen; Ho, Hsi-Chun

2016-03-01

In this paper, we demonstrate a new integration of printed circuit board (PCB) technology-based self-powered sensors (PSSs) and direct-write, near-field electrospinning (NFES) with polyvinylidene fluoride (PVDF) micro/nano fibers (MNFs) as source materials. Integration with PCB technology is highly desirable for affordable mass production. In addition, we systematically investigate the effects of electrodes with intervals in the range of 0.15 mm to 0.40 mm on the resultant PSS output voltage and current. The results show that at a strain of 0.5% and 5 Hz, a PSS with a gap interval 0.15 mm produces a maximum output voltage of 3 V and a maximum output current of 220 nA. Under the same dimensional constraints, the MNFs are massively connected in series (via accumulation of continuous MNFs across the gaps ) and in parallel (via accumulation of parallel MNFs on the same gap) simultaneously. Finally, encapsulation in a flexible polymer with different interval electrodes demonstrated that electrical superposition can be realized by connecting MNFs collectively and effectively in serial/parallel patterns to achieve a high current and high voltage output, respectively. Further improvement in PSSs based on the effect of cooperativity was experimentally realized by rolling-up the device into a cylindrical shape, resulting in a 130% increase in power output due to the cooperative effect. We assembled the piezoelectric MNF sensors on gloves, bandages and stockings to fabricate devices that can detect different types of human motion, including finger motion and various flexing and extensions of an ankle. The firmly glued PSSs were tested on the glove and ankle respectively to detect and harvest the various movements and the output voltage was recorded as ∼1.5 V under jumping movement (one PSS) and ∼4.5 V for the clenched fist with five fingers bent concurrently (five PSSs). This research shows that piezoelectric MNFs not only have a huge impact on harvesting various external

Colour changes in prints during long-term dark storage of prints

International Nuclear Information System (INIS)

Parraman, Carinna

2010-01-01

The most significant impact on colour fading in prints is exposure to light and air. However what happens to coloured prints during long-term storage in boxes, drawers and on shelves? Measurements of samples, printed in July 2005, stored in a range of light and darkened storage conditions have shown some interesting initial results. As more emphasis is placed on the effects of light, the dark stability of inkjet prints is relatively overlooked when considering how to preserve or store coloured prints. This study and presentation builds on previous research [1] and has concentrated on the changes to colour during storage. With reference to ASTM F2035 - 00(2006) Standard Practice for Measuring the Dark Stability of Ink Jet Prints, the Standards outline points out that whilst natural aging is the most reliable method of assessing image stability, materials and inks any data that is produced quickly becomes redundant; therefore accelerated aging is more preferred. However, the fine art materials in this study are still very much in circulation. The leading fine art papers, and pigmented ink-sets used in these trials are still being used by artists. We can therefore demonstrate the characteristics of colour changes and the impact of ink on paper that utilises natural aging methods.

Canada-Nova Scotia Offshore Petroleum Board annual report, 1992-1993

International Nuclear Information System (INIS)

1993-06-01

The Canada-Nova Scotia Offshore Petroleum Board was established as the agency responsible for the regulation of the hydrocarbon resources in the Nova Scotia offshore. The Board evaluates resource potential, administers petroleum exploration and production rights, approves offshore activities, and approves benefits and development plans. The main activities of the Board in 1992-1993 are summarized and financial statements are presented. Highlights include production of 572,300 m 3 of oil during the first production season of LASMO Nova Scotia Ltd.'s Cohasset development, the first commercial offshore oil production for Canada; four major resource evaluation projects in the Glenelg Field, the Laurentian sub-basin, the Fundy Rift Basin, and the Panuke Field; holding of discussions between Nova Scotia, Newfoundland, and Canada on the maritime boundary lines between respective offshore petroleum board jurisdictions, in the wake of a June 1992 determination of the disputed maritime boundary around St. Pierre et Miquelon; and amendments of certain safety-related legislation applicable to offshore operations. Employment benefits of the Cohasset project during 1992 totalled ca 470 Nova Scotians and 120 other Canadians. 3 tabs

Integrated 3d printed wireless sensing system for environmental monitoring

KAUST Repository

Farooqui, Muhammad Fahad

2017-12-21

Disclosed are various embodiments of a wireless sensor device for monitoring environment conditions. A wireless sensor device may comprise, for example, a computing device, printable circuitry, sensors, and antennas combined with one or more transmitters on a panel. The wireless sensor device may be configured to take environment measurements, such as temperature, gas, humidity, and wirelessly communicate the environment measurements to a remote computing device, in addition, the present disclosure relates to a method of assembling the wireless sensor device. The method may comprise printing sensors, circuitry, and antennas to a panel; folding the panel to form an enclosure comprising a plurality of side panels; and attaching the plurality of side panels to a circuit board panel.

A Vector Printing Method for High-Speed Electrohydrodynamic (EHD Jet Printing Based on Encoder Position Sensors

Directory of Open Access Journals (Sweden)

Thanh Huy Phung

2018-02-01

Full Text Available Electrohyrodynamic (EHD jet printing has been widely used in the field of direct micro-nano patterning applications, due to its high resolution printing capability. So far, vector line printing using a single nozzle has been widely used for most EHD printing applications. However, the application has been limited to low-speed printing, to avoid non-uniform line width near the end points where line printing starts and ends. At end points of line vector printing, the deposited drop amount is likely to be significantly large compared to the rest of the printed lines, due to unavoidable acceleration and deceleration. In this study, we proposed a method to solve the printing quality problems by producing droplets at an equally spaced distance, irrespective of the printing speed. For this purpose, an encoder processing unit (EPU was developed, so that the jetting trigger could be generated according to user-defined spacing by using encoder position signals, which are used for the positioning control of the two linear stages.

Some Thoughts on Contemporary Graphic Print

Directory of Open Access Journals (Sweden)

Stefan Skiba

2016-09-01

Full Text Available The production requirements of original graphic works of art have changed since 1980. The development of digital printing using lightfast colors now rivals traditional techniques such as wood cut, screen print, lithography, etching etc. Today, with respect to artistic legitimacy, original graphics using traditional printing techniques compete with original graphics produced by digital printing techniques on the art market. What criteria distinguish traditional printing techniques from those of digital printing in the production and acquisition of original graphics? What consequences is the serious artist faced with when deciding to implement digital print production? How does digital print change original graphic acquisition decisions?

US DOE Perspectives on Advisory Board Effectiveness - 13539

International Nuclear Information System (INIS)

Adler, David

2013-01-01

Federal missions on the Oak Ridge Reservation began with the Manhattan Project, and continues today with major facilities supporting the Nation's Science and National Security missions. While most of the land area on the Oak Ridge Reservation is free of environmental impacts from these activities, significant legacy contamination is associated with specific facilities and past waste management areas. In 1989, the Oak Ridge Reservation (ORR) was placed on National Priorities List, and DOE established its Office of Environmental Management that same year. Three years later, in 1992, the Federal Facility Agreement for the reservation was signed. Three years afterward, the Oak Ridge Site Specific Advisory Board was established to augment ongoing public involvement activities related to Oak Ridge Reservation cleanup activities. One of the early and most impactful decisions the board made was to organize the End Use Working Group. This broad-based group of board members, DOE representatives, and members of the public was formed in 1997 to study future uses for contaminated areas of the reservation. The group was instrumental in building consensus in the Oak Ridge community regarding the long-term end state of reservation lands. The group's recommendations were a fundamental input into Record's of Decision subsequently developed to establish cleanup requirements across the ORR, and they continue to influence decisions being made today. In developing its recommendations on end states, the End Use Working Group came to the realization that long-term stewardship of contaminated areas of the reservation would be necessary, in some cases in perpetuity. It was from this concept that the Oak Ridge SSAB's 15-year involvement in stewardship would begin. A stewardship committee formed by the End Use Working Group wrote Volume 1 of the Stakeholder Report on Stewardship. This document-and its companion Volume 2, which was written a year later-form a crucial foundation for stewardship

US DOE Perspectives on Advisory Board Effectiveness - 13539

Energy Technology Data Exchange (ETDEWEB)

Adler, David [US DOE (United States)

2013-07-01

Federal missions on the Oak Ridge Reservation began with the Manhattan Project, and continues today with major facilities supporting the Nation's Science and National Security missions. While most of the land area on the Oak Ridge Reservation is free of environmental impacts from these activities, significant legacy contamination is associated with specific facilities and past waste management areas. In 1989, the Oak Ridge Reservation (ORR) was placed on National Priorities List, and DOE established its Office of Environmental Management that same year. Three years later, in 1992, the Federal Facility Agreement for the reservation was signed. Three years afterward, the Oak Ridge Site Specific Advisory Board was established to augment ongoing public involvement activities related to Oak Ridge Reservation cleanup activities. One of the early and most impactful decisions the board made was to organize the End Use Working Group. This broad-based group of board members, DOE representatives, and members of the public was formed in 1997 to study future uses for contaminated areas of the reservation. The group was instrumental in building consensus in the Oak Ridge community regarding the long-term end state of reservation lands. The group's recommendations were a fundamental input into Record's of Decision subsequently developed to establish cleanup requirements across the ORR, and they continue to influence decisions being made today. In developing its recommendations on end states, the End Use Working Group came to the realization that long-term stewardship of contaminated areas of the reservation would be necessary, in some cases in perpetuity. It was from this concept that the Oak Ridge SSAB's 15-year involvement in stewardship would begin. A stewardship committee formed by the End Use Working Group wrote Volume 1 of the Stakeholder Report on Stewardship. This document-and its companion Volume 2, which was written a year later-form a crucial

Colour printing techniques

OpenAIRE

Parraman, C.

2017-01-01

Invited chapter in the book Colour Design: Theories and Applications. In PART 3 COLOUR, DESIGN AND COLORATION this chapter covers:\\ud - Hardcopy colour: analogue versus digital\\ud - Colour theory in relation to printing\\ud - Overview of halftoning and digital print technologies\\ud - Overview and development of inks\\ud - Inkjet papers and inks\\ud - Recent and future trends in colour, printing inks and hardware.\\ud \\ud This book differs from other existing books in the field, with the aim of an...

Print and Manuscript

OpenAIRE

Erne, Lukas Christian

2007-01-01

Positioning Shakespeare at the "crossroads of manuscript and print" and exploring what the choice of print or manuscript reveals about the poet's intended audience and the social persona the poet wanted to assume and fashion, argues that "Shakespeare's authorial self-presentation begins as a poet and, more specifically, as a print-published poet" with the publication of Venus and Adonis in 1593 and the allusion to the publication of Rape of Lucrece in the next year. Yet also considers the imp...

Printed Electronics

Science.gov (United States)

Wade, Jessica; Hollis, Joseph Razzell; Wood, Sebastian

2018-04-01

The combination of printing technology with manufacturing electronic devices enables a new paradigm of printable electronics, where 'smart' functionality can be readily incorporated into almost any product at low cost. Over recent decades, rapid progress has been made in this field, which is now emerging into the industrial andcommercial realm. However, successful development and commercialisation on a large scale presents some significant technical challenges. For fully-printable electronic systems, all the component parts must be deposited from solutions (inks), requiring the development of new inorganic, organic and hybrid materials.A variety of traditional printing techniques are being explored and adapted forprinting these new materials in ways that result in the best performing electronicdevices. Whilst printed electronics research has initially focused on traditional typesof electronic device such as light-emitting diodes, transistors, and photovoltaics, it is increasingly apparent that a much wider range of applications can be realised. The soft and stretchable nature of printable materials makes them perfect candidates forbioelectronics, resulting in a wealth of research looking at biocompatible printable inks and biosensors. Regardless of application, the properties of printed electronicmaterials depend on the chemical structures, processing conditions, device architecture,and operational conditions, the complex inter-relationships of which aredriving ongoing research. We focus on three particular 'hot topics', where attention is currently focused: novel materials, characterisation techniques, and device stability. With progress advancing very rapidly, printed electronics is expected to grow over the next decade into a key technology with an enormous economic and social impact.

Towards Practical Application of Paper based Printed Circuits: Capillarity Effectively Enhances Conductivity of the Thermoplastic Electrically Conductive Adhesives

Science.gov (United States)

Wu, Haoyi; Chiang, Sum Wai; Lin, Wei; Yang, Cheng; Li, Zhuo; Liu, Jingping; Cui, Xiaoya; Kang, Feiyu; Wong, Ching Ping

2014-09-01

Direct printing nanoparticle-based conductive inks onto paper substrates has encountered difficulties e.g. the nanoparticles are prone to penetrate into the pores of the paper and become partially segmented, and the necessary low-temperature-sintering process is harmful to the dimension-stability of paper. Here we prototyped the paper-based circuit substrate in combination with printed thermoplastic electrically conductive adhesives (ECA), which takes the advantage of the capillarity of paper and thus both the conductivity and mechanical robustness of the printed circuitsweredrastically improved without sintering process. For instance, the electrical resistivity of the ECA specimen on a pulp paper (6 × 10-5Ω.cm, with 50 wt% loading of Ag) was only 14% of that on PET film than that on PET film. This improvement has been found directly related to the sizing degree of paper, in agreement with the effective medium approximation simulation results in this work. The thermoplastic nature also enables excellent mechanical strength of the printed ECA to resist repeated folding. Considering the generality of the process and the wide acceptance of ECA technique in the modern electronic packages, this method may find vast applications in e.g. circuit boards, capacitive touch pads, and radio frequency identification antennas, which have been prototyped in the manuscript.

Integrating citizen advisory boards in public participation: Lessons from the field

International Nuclear Information System (INIS)

Snyder, S.

1995-01-01

Citizen advisory boards have been used successfully, particularly by the chemical industry, as programs for public participation. Now the U.S. Department of Energy (DOE) has responded to a growing demand for more direct citizen involvement in environmental restoration decision making. The experience of the site-specific advisory board at the department's Fernald Environmental Management Project near Cincinnati provides lessons that contribute to the development of a model for the most efficient use of citizen advisory boards

Cost-estimating for commercial digital printing

Science.gov (United States)

Keif, Malcolm G.

2007-01-01

The purpose of this study is to document current cost-estimating practices used in commercial digital printing. A research study was conducted to determine the use of cost-estimating in commercial digital printing companies. This study answers the questions: 1) What methods are currently being used to estimate digital printing? 2) What is the relationship between estimating and pricing digital printing? 3) To what extent, if at all, do digital printers use full-absorption, all-inclusive hourly rates for estimating? Three different digital printing models were identified: 1) Traditional print providers, who supplement their offset presswork with digital printing for short-run color and versioned commercial print; 2) "Low-touch" print providers, who leverage the power of the Internet to streamline business transactions with digital storefronts; 3) Marketing solutions providers, who see printing less as a discrete manufacturing process and more as a component of a complete marketing campaign. Each model approaches estimating differently. Understanding and predicting costs can be extremely beneficial. Establishing a reliable system to estimate those costs can be somewhat challenging though. Unquestionably, cost-estimating digital printing will increase in relevance in the years ahead, as margins tighten and cost knowledge becomes increasingly more critical.

A new technology for separation and recovery of materials from waste printed circuit boards by dissolving bromine epoxy resins using ionic liquid

International Nuclear Information System (INIS)

Zhu, P.; Chen, Y.; Wang, L.Y.; Qian, G.Y.; Zhou, M.; Zhou, J.

2012-01-01

Highlights: ► WPCBs were heated in [EMIM + ][BF 4 − ] for recovering solider at 240 °C. ► The bromine epoxy resins in WPCBs were all dissolved in [EMIM + ][BF 4 − ] at 260 °C. ► Used [EMIM + ][BF 4 − ] is treated by water to obtain regeneration. - Abstract: Recovery of valuable materials from waste printed circuit boards (WPCBs) is quite difficult because WPCBs is a heterogeneous mixture of polymer materials, glass fibers, and metals. In this study, WPCBs was treated using ionic liquid (1-ethyl-3-methylimizadolium tetrafluoroborate [EMIM + ][BF 4 − ]). Experimental results showed that the separation of the solders went to completion, and electronic components (ECs) were removed in WPCBs when [EMIM + ][BF 4 − ] solution containing WPCBs was heated to 240 °C. Meanwhile, metallographic observations verified that the WPCBs had an initial delamination. When the temperature increased to 260 °C, the separation of the WPCBs went to completion, and coppers and glass fibers were obtained. The used [EMIM + ][BF 4 − ] was treated by water to generate a solid–liquid suspension, which was separated completely to obtain solid residues by filtration. Thermal analyses combined with infrared ray spectra (IR) observed that the solid residues were bromine epoxy resins. NMR (nuclear magnetic resonance) showed that hydrogen bond played an important role for [EMIM + ][BF 4 − ] dissolving bromine epoxy resins. This clean and non-polluting technology offers a new way to recycle valuable materials from WPCBs and prevent environmental pollution from WPCBs effectively.

Printing system perceptual-based gloss and gloss uniformity standard (INCITS W1.1)

Science.gov (United States)

Ng, Yee S.; Cui, Luke C.; Kuo, Chung-Hui; Maggard, Eric; Mashtare, Dale; Morris, Peter; Viola, Michael

2003-12-01

To address the standarization issues of perceptually based image quality for printing systems, ISO/IEC JTC1/SC28, the standarization committee for office equipment charactered the W1.1 project with the responsibiltiy of drafting a proposal for an international standard for the evaluation of printed image quality. One of the W1.1 task teams is charactered to address the issue of 'Gloss and Gloss Uniformity". This paper summarizes the current status and technical progress of this ad hoc team in 2003.

Fabrication method to create high-aspect ratio pillars for photonic coupling of board level interconnects

Science.gov (United States)

Debaes, C.; Van Erps, J.; Karppinen, M.; Hiltunen, J.; Suyal, H.; Last, A.; Lee, M. G.; Karioja, P.; Taghizadeh, M.; Mohr, J.; Thienpont, H.; Glebov, A. L.

2008-04-01

An important challenge that remains to date in board level optical interconnects is the coupling between the optical waveguides on printed wiring boards and the packaged optoelectronics chips, which are preferably surface mountable on the boards. One possible solution is the use of Ball Grid Array (BGA) packages. This approach offers a reliable attachment despite the large CTE mismatch between the organic FR4 board and the semiconductor materials. Collimation via micro-lenses is here typically deployed to couple the light vertically from the waveguide substrate to the optoelectronics while allowing for a small misalignment between board and package. In this work, we explore the fabrication issues of an alternative approach in which the vertical photonic connection between board and package is governed by a micro-optical pillar which is attached both to the board substrate and to the optoelectronic chips. Such an approach allows for high density connections and small, high-speed detector footprints while maintaining an acceptable tolerance between board and package. The pillar should exhibit some flexibility and thus a high-aspect ratio is preferred. This work presents and compares different fabrication methods and applies different materials for such high-aspect ratio pillars. The different fabrication methods are: photolithography, direct laser writing and deep proton writing. The selection of optical materials that was investigated is: SU8, Ormocers, PU and a multifunctional acrylate polymer. The resulting optical pillars have diameters ranging from 20um up to 80um, with total heights ranging between 30um and 100um (symbol for micron). The aspect-ratio of the fabricated structures ranges from 1.5 to 5.

76 FR 55138 - Sunshine Notice; Board of Directors Meeting; September 22, 2011

Science.gov (United States)

2011-09-06

... 2013 Budget. 3. Recommendations of the Ad-Hoc Board Committee on Governance. 4. Finance Project--India. 5. Finance Project--Nigeria. 6. Finance Project--Thailand. 7. Finance Project--Kenya. 8. Approval of... obtained from Connie M. Downs at (202) 336-8438. Connie M. Downs, Corporate Secretary, Overseas Private...

3D printing for orthopedic applications: from high resolution cone beam CT images to life size physical models

Science.gov (United States)

Jackson, Amiee; Ray, Lawrence A.; Dangi, Shusil; Ben-Zikri, Yehuda K.; Linte, Cristian A.

2017-03-01

With increasing resolution in image acquisition, the project explores capabilities of printing toward faithfully reflecting detail and features depicted in medical images. To improve safety and efficiency of orthopedic surgery and spatial conceptualization in training and education, this project focused on generating virtual models of orthopedic anatomy from clinical quality computed tomography (CT) image datasets and manufacturing life-size physical models of the anatomy using 3D printing tools. Beginning with raw micro CT data, several image segmentation techniques including thresholding, edge recognition, and region-growing algorithms available in packages such as ITK-SNAP, MITK, or Mimics, were utilized to separate bone from surrounding soft tissue. After converting the resulting data to a standard 3D printing format, stereolithography (STL), the STL file was edited using Meshlab, Netfabb, and Meshmixer. The editing process was necessary to ensure a fully connected surface (no loose elements), positive volume with manifold geometry (geometry possible in the 3D physical world), and a single, closed shell. The resulting surface was then imported into a "slicing" software to scale and orient for printing on a Flashforge Creator Pro. In printing, relationships between orientation, print bed volume, model quality, material use and cost, and print time were considered. We generated anatomical models of the hand, elbow, knee, ankle, and foot from both low-dose high-resolution cone-beam CT images acquired using the soon to be released scanner developed by Carestream, as well as scaled models of the skeletal anatomy of the arm and leg, together with life-size models of the hand and foot.

A STUDY OF RELATIVE CORRELATION BETWEEN THE PATTERN OF FINGER PRINTS AND LIP PRINTS

OpenAIRE

Murugan; Karikalan

2014-01-01

BACKGROUND AND OBJECTIVE: The use of conventional methods such as dactylography (study of finger prints) & cheiloscopy (study of lip prints) is of paramount importance, since personal identification by other means such as DNA analysis is sophisticated and not available in rural and developing countries. Fingerprint in its narrow sense is an impression left by the friction ridges of human fingers. The second prints of interest are lip prints. Studies of association between ...

"Handling" seismic hazard: 3D printing of California Faults

Science.gov (United States)

Kyriakopoulos, C.; Potter, M.; Richards-Dinger, K. B.

2017-12-01

As earth scientists, we face the challenge of how to explain and represent our work and achievements to the general public. Nowadays, this problem is partially alleviated by the use of modern visualization tools such as advanced scientific software (Paraview.org), high resolution monitors, elaborate video simulations, and even 3D Virtual Reality goggles. However, the ability to manipulate and examine a physical object in 3D is still an important tool to connect better with the public. For that reason, we are presenting a scaled 3D printed version of the complex network of earthquake faults active in California based on that used by the Uniform California Earthquake Rupture Forecast 3 (UCERF3) (Field et al., 2013). We start from the fault geometry in the UCERF3.1 deformation model files. These files contain information such as the coordinates of the surface traces of the faults, dip angle, and depth extent. The fault specified in the above files are triangulated at 1km resolution and exported as a facet (.fac) file. The facet file is later imported into the Trelis 15.1 mesh generator (csimsoft.com). We use Trelis to perform the following three operations: First, we scale down the model so that 100 mm corresponds to 100km. Second, we "thicken" the walls of the faults; wall thickness of at least 1mm is necessary in 3D printing. We thicken fault geometry by 1mm on each side of the faults for a total of 2mm thickness. Third, we break down the model into parts that will fit the printing bed size ( 25 x 20mm). Finally, each part is exported in stereolithography format (.stl). For our project, we are using the 3D printing facility within the Creat'R Lab in the UC Riverside Orbach Science Library. The 3D printer is a MakerBot Replicator Desktop, 5th Generation. The resolution of print is 0.2mm (Standard quality). The printing material is the MakerBot PLA Filament, 1.75 mm diameter, large Spool, green. The most complex part of the display model requires approximately 17

Mail2Print online tutorial

CERN Multimedia

CERN. Geneva

2016-01-01

Mail2print is a feature which allows you to send documents to a printer by mail. This tutorial (text attached to the event page) explains how to use this service. Content owner: Vincent Nicolas Bippus Presenter: Pedro Augusto de Freitas Batista Tell us what you think via e-learning.support at cern.ch More tutorials in the e-learning collection of the CERN Document Server (CDS) https://cds.cern.ch/collection/E-learning%20modules?ln=en All info about the CERN rapid e-learning project is linked from http://twiki.cern.ch/ELearning  

CERN printing infrastructure

International Nuclear Information System (INIS)

Otto, R; Sucik, J

2008-01-01

For many years CERN had a very sophisticated print server infrastructure [13] which supported several different protocols (AppleTalk, IPX and TCP/IP) and many different printing standards. Today's situation differs a lot: we have a much more homogenous network infrastructure, where TCP/IP is used everywhere and we have less printer models, which almost all work using current standards (i.e. they all provide PostScript drivers). This change gave us the possibility to review the printing architecture aiming at simplifying the infrastructure in order to achieve full automation of the service. The new infrastructure offers both: LPD service exposing print queues to Linux and Mac OS X computers and native printing for Windows based clients. The printer driver distribution is automatic and native on Windows and automated by custom mechanisms on Linux, where the appropriate Foomatic drivers are configured. Also the process of printer registration and queue creation is completely automated following the printer registration in the network database. At the end of 2006 we have moved all (∼1200) CERN printers and all users' connections at CERN to the new service. This paper will describe the new architecture and summarize the process of migration

A High Precision $3.50 Open Source 3D Printed Rain Gauge Calibrator

Science.gov (United States)

Lopez Alcala, J. M.; Udell, C.; Selker, J. S.

2017-12-01

Currently available rain gauge calibrators tend to be designed for specific rain gauges, are expensive, employ low-precision water reservoirs, and do not offer the flexibility needed to test the ever more popular small-aperture rain gauges. The objective of this project was to develop and validate a freely downloadable, open-source, 3D printed rain gauge calibrator that can be adjusted for a wide range of gauges. The proposed calibrator provides for applying low, medium, and high intensity flow, and allows the user to modify the design to conform to unique system specifications based on parametric design, which may be modified and printed using CAD software. To overcome the fact that different 3D printers yield different print qualities, we devised a simple post-printing step that controlled critical dimensions to assure robust performance. Specifically, the three orifices of the calibrator are drilled to reach the three target flow rates. Laboratory tests showed that flow rates were consistent between prints, and between trials of each part, while the total applied water was precisely controlled by the use of a volumetric flask as the reservoir.

Water Science and Technology Board annual report 1989

Energy Technology Data Exchange (ETDEWEB)

1990-01-01

This report summarizes the activities of the Water Science and Technology Board (WSTB) and its subgroups during 1989, it seventh year of existence. It describes current and recently completed projects, new activities scheduled to begin in 1990, and plans for the future. The report also includes information on Board and committee memberships, program operational features, and reports produced during the past several years. This annual report is an introduction to the WSTB and its program for the year. 4 figs.

Making PMT halftone prints

Energy Technology Data Exchange (ETDEWEB)

Corey, J.D.

1977-05-01

In the printing process for technical reports presently used at Bendix Kansas City Division, photographs are reproduced by pasting up PMT halftone prints on the artwork originals. These originals are used to make positive-working plastic plates for offset lithography. Instructions for making good-quality halftone prints using Eastman Kodak's PMT materials and processes are given in this report. 14 figures.

The NIH 3D Print Exchange: A Public Resource for Bioscientific and Biomedical 3D Prints.

Science.gov (United States)

Coakley, Meghan F; Hurt, Darrell E; Weber, Nick; Mtingwa, Makazi; Fincher, Erin C; Alekseyev, Vsevelod; Chen, David T; Yun, Alvin; Gizaw, Metasebia; Swan, Jeremy; Yoo, Terry S; Huyen, Yentram

2014-09-01

The National Institutes of Health (NIH) has launched the NIH 3D Print Exchange, an online portal for discovering and creating bioscientifically relevant 3D models suitable for 3D printing, to provide both researchers and educators with a trusted source to discover accurate and informative models. There are a number of online resources for 3D prints, but there is a paucity of scientific models, and the expertise required to generate and validate such models remains a barrier. The NIH 3D Print Exchange fills this gap by providing novel, web-based tools that empower users with the ability to create ready-to-print 3D files from molecular structure data, microscopy image stacks, and computed tomography scan data. The NIH 3D Print Exchange facilitates open data sharing in a community-driven environment, and also includes various interactive features, as well as information and tutorials on 3D modeling software. As the first government-sponsored website dedicated to 3D printing, the NIH 3D Print Exchange is an important step forward to bringing 3D printing to the mainstream for scientific research and education.

Instrumental Genesis in GeoGebra Based Board Game Design

DEFF Research Database (Denmark)

Misfeldt, Morten

2013-01-01

In this paper I address the use of digital tools (GeoGebra) in open ended design activities, with primary school children. I present results from the research and development project “Creative Digital Mathematics”, which aims to use the pupil’s development of mathematical board games as a vehicle...... in their work with GeoGebra and how they relate their work with GeoGebra and mathematics to fellow pupils and real life situations. The results show that pupils’ consider development of board games as meaningful mathematical activity, and that they develop skills with GeoGebra, furthermore the pupils considers...... potential use of their board game by classmates in their design activities....

Emergent literacy in print and electronic contexts: The influence of book type, narration source, and attention.

Science.gov (United States)

O'Toole, Kathryn J; Kannass, Kathleen N

2018-09-01

Young children learn from traditional print books, but there has been no direct comparison of their learning from print books and tablet e-books while controlling for narration source. The current project used a between-subjects design and examined how 4-year-olds (N = 100) learned words and story content from a print book read aloud by a live adult, a print book narrated by an audio device, an e-book read aloud by a live adult, and an e-book narrated by an audio device. Attention to the book and prior experience with tablet e-books were also measured and included in analyses. When controlling for vocabulary, the overall pattern of results revealed that children learned more words from the e-book and from the audio narrator, but story comprehension did not differ as a function of condition. Attention predicted learning, but only in some print book contexts, and significant effects of prior experience did not emerge. Copyright © 2018 Elsevier Inc. All rights reserved.

Cascade Model for Online Discussion Boards in an E-Learning Environment

Directory of Open Access Journals (Sweden)

Vibha Kumar

2010-03-01

Full Text Available This report is an outcome of five years of teaching and managing groups of students in an online learning environment. Some course management software allow the user to create groups and add different links within each group. Distinct platforms, with various sections, can be formed within those links for any given project. Students, as well as instructors, can manage the project for 6 to 8 weeks, cascading one discussion board into one or multiple platforms. This provides better understanding of the project material due to the step by step layout of the given exercise, leading to increased group management and greater communication among the student group members. This report provides the step-by-step procedure for cascading one discussion board into platforms, to manage online projects and provide a more controlled online environment for students in higher education.

3D Printing A Survey

Directory of Open Access Journals (Sweden)

Muhammad Zulkifl Hasan

2017-08-01

Full Text Available Solid free fabrication SFF are produced to enhance the printing instrument utilizing distinctive strategies like Piezo spout control multi-spout injet printers or STL arrange utilizing cutting information. The procedure is utilized to diminish the cost and enhance the speed of printing. A few techniques take long at last because of extra process like dry the printing. This study will concentrate on SFFS utilizing UV gum for 3D printing.

CERN printing infrastructure

Energy Technology Data Exchange (ETDEWEB)

Otto, R; Sucik, J [CERN, Geneva (Switzerland)], E-mail: Rafal.Otto@cern.ch, E-mail: Juraj.Sucik@cern.ch

2008-07-15

For many years CERN had a very sophisticated print server infrastructure [13] which supported several different protocols (AppleTalk, IPX and TCP/IP) and many different printing standards. Today's situation differs a lot: we have a much more homogenous network infrastructure, where TCP/IP is used everywhere and we have less printer models, which almost all work using current standards (i.e. they all provide PostScript drivers). This change gave us the possibility to review the printing architecture aiming at simplifying the infrastructure in order to achieve full automation of the service. The new infrastructure offers both: LPD service exposing print queues to Linux and Mac OS X computers and native printing for Windows based clients. The printer driver distribution is automatic and native on Windows and automated by custom mechanisms on Linux, where the appropriate Foomatic drivers are configured. Also the process of printer registration and queue creation is completely automated following the printer registration in the network database. At the end of 2006 we have moved all ({approx}1200) CERN printers and all users' connections at CERN to the new service. This paper will describe the new architecture and summarize the process of migration.

Drug-printing by flexographic printing technology--a new manufacturing process for orodispersible films.

Science.gov (United States)

Janssen, Eva Maria; Schliephacke, Ralf; Breitenbach, Armin; Breitkreutz, Jörg

2013-01-30

Orodispersible films (ODFs) are intended to disintegrate within seconds when placed onto the tongue. The common way of manufacturing is the solvent casting method. Flexographic printing on drug-free ODFs is introduced as a highly flexible and cost-effective alternative manufacturing method in this study. Rasagiline mesylate and tadalafil were used as model drugs. Printing of rasagiline solutions and tadalafil suspensions was feasible. Up to four printing cycles were performed. The possibility to employ several printing cycles enables a continuous, highly flexible manufacturing process, for example for individualised medicine. The obtained ODFs were characterised regarding their mechanical properties, their disintegration time, API crystallinity and homogeneity. Rasagiline mesylate did not recrystallise after the printing process. Relevant film properties were not affected by printing. Results were comparable to the results of ODFs manufactured with the common solvent casting technique, but the APIs are less stressed through mixing, solvent evaporation and heat. Further, loss of material due to cutting jumbo and daughter rolls can be reduced. Therefore, a versatile new manufacturing technology particularly for processing high-potent low-dose or heat sensitive drugs is introduced in this study. Copyright © 2012 Elsevier B.V. All rights reserved.

Information technology and the board of directors.

Science.gov (United States)

Nolan, Richard; McFarlan, F Warren

2005-10-01

Ever since the Y2K scare, boards have grown increasingly nervous about corporate dependence on information technology. Since then, computer crashes, denial of service attacks, competitive pressures, and the need to automate compliance with government regulations have heightened board sensitivity to IT risk. Unfortunately, most boards remain largely in the dark when it comes to IT spending and strategy, despite the fact that corporate information assets can account for more than 50% of capital spending. A lack of board oversight for IT activities is dangerous, the authors say. It puts firms at risk in the same way that failing to audit their books would. Companies that have established board-level IT governance committees are better able to control IT project costs and carve out competitive advantage. But there is no one-size-fits-all model for board supervision of a company's IT operations. The correct approach depends on what strategic "mode" a company is in whether its operations are extremely dependent on IT or not, and whether or not it relies heavily on keeping up with the latest technologies. This article spells out the conditions under which boards need to change their level of involvement in IT decisions, explaining how members can recognize their firms' IT risks and decide whether they should pursue more aggressive IT governance. The authors delineate what an IT governance committee should look like in terms of charter, membership, duties, and overall agenda. They also offer recommendations for developing IT policies that take into account an organization's operational and strategic needs and suggest what to do when those needs change. Given the dizzying pace of change in the world of IT, boards can't afford to ignore the state of their IT systems and capabilities. Appropriate board governance can go a long way toward helping a company avoid unnecessary risk and improve its competitive position.

The best printing methods to print satellite images

OpenAIRE

G.A. Yousif; R.Sh. Mohamed

2011-01-01

Printing systems operate in general as a system of color its color scale is limited as compared with the system color satellite images. Satellite image is building from very small cell named pixel, which represents the picture element and the unity of color when the image is displayed on the screen, this unit becomes lesser in size and called screen point. This unit posseses different size and shape from the method of printing to another, depending on the output resolution, tools and material...

MolPrint3D: Enhanced 3D Printing of Ball-and-Stick Molecular Models

Science.gov (United States)

Paukstelis, Paul J.

2018-01-01

The increased availability of noncommercial 3D printers has provided instructors and students improved access to printing technology. However, printing complex ball-and-stick molecular structures faces distinct challenges, including the need for support structures that increase with molecular complexity. MolPrint3D is a software add-on for the…

Influence of printing speed on production of embossing tools using FDM 3D printing technology

Directory of Open Access Journals (Sweden)

Jelena Žarko

2017-06-01

Full Text Available Manufacturing of the embossing tools customary implies use of metals such as zinc, magnesium, copper, and brass. In the case of short run lengths, a conventional manufacturing process and the material itself represent a significant cost, not only in the terms of material costs and the need for using complex technological systems which are necessary for their production, but also in the terms of the production time. Alternatively, 3D printing can be used for manufacturing similar embossing tools with major savings in production time and costs. However, due to properties of materials used in the 3D printing technology, expected results of embossing by 3D printed tools cannot be identical to metal ones. This problem is emphasized in the case of long run lengths and high accuracy requirement for embossed elements. The objective of this paper is primarily focused on investigating the influence of the printing speed on reproduction quality of the embossing tools printed with FDM (Fused Deposition Modelling technology. The obtained results confirmed that printing speed as a process parameter affects the reproduction quality of the embossing tools printed with FDM technology: in the case of deposition rate of 90 mm/s was noted the poorest dimensional accuracy in relation to the 3D model, which is more emphasised in case of circular and square elements. Elements printed with the highest printing speed have a greater dimensional accuracy, but with evident cracks on the surface.

Surface adhesion study of La2O3 thin film on Si and glass substrate for micro-flexography printing

Science.gov (United States)

Hassan, S.; Yusof, M. S.; Embong, Z.; Maksud, M. I.

2017-01-01

Adhesive property can be described as an interchangeably with some ink and substance which was applied to one surface of two separate items that bonded together. Lanthanum oxide (La2O3) has been used as a rare earth metal candidate as depositing agent or printing ink. This metal deposit was embedded on Silica (Si) wafer and glass substrate using Magnetron Sputtering technique. The choose of Lanthanum oxide as a target is due to its wide application in producing electronic devices such as thin film battery and printed circuit board. The La2O3 deposited on the surface of Si wafer and glass substrate was then analyzed using Angle Resolve X-Ray Photoelectron Spectroscopy (ARXPS). The position for each synthetic component in the narrow scan of Lanthanum (La) 3d and O 1s are referred to the electron binding energy (eV). This research will focus on 3 narrow scan regions which are C 1s, O 1s and La 3d. Further discussion of the spectrum evaluation will be discussed in detail. Here, it is proposed that from the adhesive and surface chemical properties of La is the best on glass substrate which suitable as an alternative medium for micro-flexography printing technique in printing multiple fine solid lines at nano scale. Hence, this paper will describe the capability of this particular metal as rare earth metal in a practice of micro-flexography printing.

Introduction to printed electronics

CERN Document Server

Suganuma, Katsuaki

2014-01-01

This book describes in detail modern technologies for printed electronics, explaining how nanotechnology and modern printing technology are merging to revolutionize electronics fabrication of thin, lightweight, large, and inexpensive products. Readers will benefit from the explanations of materials, devices and circuits used to design and implement the latest applications of printed electronics, such as thin flexible OLED displays, organic solar cells, OLED lighting, smart wallpaper, sensors, logic, memory and more.

Recent Progress in the Development of Printed Thin-Film Transistors and Circuits with High-Resolution Printing Technology.

Science.gov (United States)

Fukuda, Kenjiro; Someya, Takao

2017-07-01

Printed electronics enable the fabrication of large-scale, low-cost electronic devices and systems, and thus offer significant possibilities in terms of developing new electronics/optics applications in various fields. Almost all electronic applications require information processing using logic circuits. Hence, realizing the high-speed operation of logic circuits is also important for printed devices. This report summarizes recent progress in the development of printed thin-film transistors (TFTs) and integrated circuits in terms of materials, printing technologies, and applications. The first part of this report gives an overview of the development of functional inks such as semiconductors, electrodes, and dielectrics. The second part discusses high-resolution printing technologies and strategies to enable high-resolution patterning. The main focus of this report is on obtaining printed electrodes with high-resolution patterning and the electrical performance of printed TFTs using such printed electrodes. In the final part, some applications of printed electronics are introduced to exemplify their potential. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Prints Charles ja prints Michael külastasid Tallinna kirikuid / Allan Tammiku

Index Scriptorium Estoniae

Tammiku, Allan

2001-01-01

Prints Charles külastas 6. novembril Eesti-visiidi ajal Tallinna toomkirikut ja Pühavaimu kirikut, prints Michael viibis Tallinnas 11. novembril eravisiidil, ta külastas toomkirikut, Niguliste ja Pühavaimu kirikut

Semiotic Analysis Of Mcdonald's Printed Advertisement

OpenAIRE

URAIDA, SITI

2014-01-01

Keywords: Semiotic, printed advertisement, sign, icon, symbol, index, connotation, myth Printed advertisement has a promotional function as medium to advertise aproduct. It implicitly persuades people to create demand of product which is being advertised. In this study, the writer uses printed advertisement of McDonald's fast food company as the object. The printed advertisement was analyzed by usingSemiotics study. There are seven printed advertisements that were analyzes in this study. All ...

AirPrint Forensics: Recovering the Contents and Metadata of Printed Documents from iOS Devices

Directory of Open Access Journals (Sweden)

Luis Gómez-Miralles

2015-01-01

data they may store, opens new opportunities in the field of computer forensics. In 2010, version 4 of the iOS operating system introduced AirPrint, a simple and driverless wireless printing functionality supported by hundreds of printer models from all major vendors. This paper describes the traces left in the iOS device when AirPrint is used and presents a method for recovering content and metadata of documents that have been printed.

Durability of ink jet prints

International Nuclear Information System (INIS)

Dobric, E; Mirkovic, I Bolanca; Bolanca, Z

2010-01-01

The aim of this paper is the result presentation of some optical properties research for ink jet prints after: exposing the prints to the mixed daylight and artificial light, exposing of prints to the sun-light through the glass window, and exposing of prints to outdoor conditions during the summer months. The prints obtained by piezoelectric and thermal ink jet technologies were used in the researches. The dye-based inks and the pigmented inks based on water and the low solvent inks were used. The results of these researches, except the scientific contribution in the domain of understanding and explaining the environmental conditions on the gamut size, i.e. the range of color tonality, colorimetric stability and print quality, can be used by the ink and paper manufacturers in new formulations, offer data for the printer producers for further production and evaluation of the position of their products.

Luminous lip-prints as criminal evidence.

Science.gov (United States)

Castelló, Ana; Alvarez-Seguí, Mercedes; Verdú, Fernando

2005-12-20

Luminescence is specially a useful property for the search of invisible evidences at the scene of a crime. In the latent fingerprints particular case, there are at one's disposal fluorescent reagents for their localization. The study of latent lip prints (that is lip prints from protective lipstick, or permanent or long-lasting lipstick that do not leave any visible marks) is more recent than fingerprints study. Because of the different composition of both types of prints, different reagents have been tried out on their developing. Although, lysochromes are particularly useful reagents to obtain latent lip prints, it may occur on coloured or multicoloured surfaces, the developing is not perceived due to contrast problems between the reagent and the surface where the print is searched. Again, luminescence offers the possibility to solve this problem. Nile Red is being studied as a potential developer for latent lip prints. The results on very old prints (over 1year) indicate that this reagent is highly efficient to get latent lip prints.

Two-Way 4D Printing: A Review on the Reversibility of 3D-Printed Shape Memory Materials

Directory of Open Access Journals (Sweden)

Amelia Yilin Lee

2017-10-01

Full Text Available The rapid development of additive manufacturing and advances in shape memory materials have fueled the progress of four-dimensional (4D printing. With the right external stimulus, the need for human interaction, sensors, and batteries will be eliminated, and by using additive manufacturing, more complex devices and parts can be produced. With the current understanding of shape memory mechanisms and with improved design for additive manufacturing, reversibility in 4D printing has recently been proven to be feasible. Conventional one-way 4D printing requires human interaction in the programming (or shape-setting phase, but reversible 4D printing, or two-way 4D printing, will fully eliminate the need for human interference, as the programming stage is replaced with another stimulus. This allows reversible 4D printed parts to be fully dependent on external stimuli; parts can also be potentially reused after every recovery, or even used in continuous cycles—an aspect that carries industrial appeal. This paper presents a review on the mechanisms of shape memory materials that have led to 4D printing, current findings regarding 4D printing in alloys and polymers, and their respective limitations. The reversibility of shape memory materials and their feasibility to be fabricated using three-dimensional (3D printing are summarized and critically analyzed. For reversible 4D printing, the methods of 3D printing, mechanisms used for actuation, and strategies to achieve reversibility are also highlighted. Finally, prospective future research directions in reversible 4D printing are suggested.

Print-to-print: printer-enabled out-of-cleanroom multiobject microprinting method.

Science.gov (United States)

Xing, Siyuan; Zhao, Siwei; Pan, Tingrui

2014-01-01

Micropatterning techniques have gained growing interests from a broad range of engineering and biology researches as it realizes the high-throughput and highly quantitative investigations on miniature biological objects (e.g., cells and bacteria) by spatially defined micropatterns. However, most of the existing techniques rely on expensive instruments or intensive cleanroom access which may not be easy to be utilized in a regular biological laboratory. Here, we present the detailed procedures of a simple versatile microprinting process, referred to as Print-to-Print (P2P), to form multiobject micropatterns for potential biological applications. Only a solid-phase printer and custom-made superhydrophobic (SH) films are utilized for the printing and no thermal or chemical treatment is involved during the entire printing process. Moreover, the noncontact nature of droplet transferring and printing steps can be highly advantageous for sensitive biological uses. By the P2P process, a minimal feature resolution of 229 ± 17 μm has been successfully achieved. What's more, this approach has been applied to form micropatterning on various commonly used substrates in biology as well as multiobject co-patterns. In addition, the SH substrates have also been demonstrated to be reusable. Copyright © 2014 Elsevier Inc. All rights reserved.

3D-Printed Millimeter Wave Structures

Science.gov (United States)

2016-03-14

demonstrates the resolution of the printer with a 10 micron nozzle. Figure 2: Measured loss tangent of SEBS and SBS samples. 3D - Printed Millimeter... 3D printing of styrene-butadiene-styrene (SBS) and styrene ethylene/butylene-styrene (SEBS) is used to demonstrate the feasibility of 3D - printed ...Additionally, a dielectric lens is printed which improves the antenna gain of an open-ended WR-28 waveguide from 7 to 8.5 dBi. Keywords: 3D printing

Inkjet-Printed Lithium-Sulfur Microcathodes for All-Printed, Integrated Nanomanufacturing.

Science.gov (United States)

Milroy, Craig A; Jang, Seonpil; Fujimori, Toshihiko; Dodabalapur, Ananth; Manthiram, Arumugam

2017-03-01

Improved thin-film microbatteries are needed to provide appropriate energy-storage options to power the multitude of devices that will bring the proposed "Internet of Things" network to fruition (e.g., active radio-frequency identification tags and microcontrollers for wearable and implantable devices). Although impressive efforts have been made to improve the energy density of 3D microbatteries, they have all used low energy-density lithium-ion chemistries, which present a fundamental barrier to miniaturization. In addition, they require complicated microfabrication processes that hinder cost-competitiveness. Here, inkjet-printed lithium-sulfur (Li-S) cathodes for integrated nanomanufacturing are reported. Single-wall carbon nanotubes infused with electronically conductive straight-chain sulfur (S@SWNT) are adopted as an integrated current-collector/active-material composite, and inkjet printing as a top-down approach to achieve thin-film shape control over printed electrode dimensions is used. The novel Li-S cathodes may be directly printed on traditional microelectronic semicoductor substrates (e.g., SiO 2 ) or on flexible aluminum foil. Profilometry indicates that these microelectrodes are less than 10 µm thick, while cyclic voltammetry analyses show that the S@SWNT possesses pseudocapacitive characteristics and corroborates a previous study suggesting the S@SWNT discharge via a purely solid-state mechanism. The printed electrodes produce ≈800 mAh g -1 S initially and ≈700 mAh g -1 after 100 charge/discharge cycles at C/2 rate. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Pyrolysis characteristics of integrated circuit boards at various particle sizes and temperatures

Energy Technology Data Exchange (ETDEWEB)

Chiang, H.-L. [Department Risk Management, China Medical University, Taichung 40402, Taiwan (China)], E-mail: hlchiang@mail.cmu.edu.tw; Lin, K.-H. [Department of Environmental Engineering, Fooyin University, Kaohsiung 831, Taiwan (China); Lai, M.-H. [Department of Environmental Engineering, Dayeh University, Changhua 51591, Taiwan (China); Chen, T.-C. [Department of Environmental Science and Engineering, Pingtung University of Science and Technology, Pingtung 91201, Taiwan (China); Ma, S.-Y. [Department of Environmental Engineering, Fooyin University, Kaohsiung 831, Taiwan (China)

2007-10-01

A pyrolysis method was employed to recycle the metals and brominated compounds blended into printed circuit boards. This research investigated the effect of particle size and process temperature on the element composition of IC boards and pyrolytic residues, liquid products, and water-soluble ionic species in the exhaust, with the overall goal being to identify the pyrolysis conditions that will have the least impact on the environment. Integrated circuit (IC) boards were crushed into 5-40 mesh (0.71-4.4 mm), and the crushed particles were pyrolyzed at temperatures ranging from 200 to 500 deg. C. The thermal decomposition kinetics were measured by a thermogravimetric (TG) analyzer. The composition of pyrolytic residues was analyzed by Energy Dispersive X-ray Spectrometer (EDS), Inductively Coupled Plasma Atomic Emission Spectrometer (ICP-AES) and Inductively Coupled Plasma-Mass Spectrometry (ICP-MS). In addition, the element compositions of liquid products were analyzed by ICP-AES and ICP-MS. Pyrolytic exhaust was collected by a water-absorption system in an ice-bath cooler, and IC analysis showed that the absorbed solution comprised 11 ionic species. Based on the pyrolytic kinetic parameters of TG analysis and pyrolytic residues at various temperatures for 30 min, the effect of particle size was insignificant in this study, and temperature was the key factor for the IC board pyrolysis. Two stages of decomposition were found for IC board pyrolysis under nitrogen atmosphere. The activation energy was 38-47 kcal/mol for the first-stage reaction and 5.2-9.4 kcal/mol for the second-stage reaction. Metal content was low in the liquid by-product of the IC board pyrolysis process, which is an advantage in that the liquid product could be used as a fuel. Brominate and ammonium were the main water-soluble ionic species of the pyrolytic exhaust. A plan for their safe and effective disposal must be developed if the pyrolytic recycling process is to be applied to IC boards.

Pyrolysis characteristics of integrated circuit boards at various particle sizes and temperatures

International Nuclear Information System (INIS)

Chiang, H.-L.; Lin, K.-H.; Lai, M.-H.; Chen, T.-C.; Ma, S.-Y.

2007-01-01

A pyrolysis method was employed to recycle the metals and brominated compounds blended into printed circuit boards. This research investigated the effect of particle size and process temperature on the element composition of IC boards and pyrolytic residues, liquid products, and water-soluble ionic species in the exhaust, with the overall goal being to identify the pyrolysis conditions that will have the least impact on the environment. Integrated circuit (IC) boards were crushed into 5-40 mesh (0.71-4.4 mm), and the crushed particles were pyrolyzed at temperatures ranging from 200 to 500 deg. C. The thermal decomposition kinetics were measured by a thermogravimetric (TG) analyzer. The composition of pyrolytic residues was analyzed by Energy Dispersive X-ray Spectrometer (EDS), Inductively Coupled Plasma Atomic Emission Spectrometer (ICP-AES) and Inductively Coupled Plasma-Mass Spectrometry (ICP-MS). In addition, the element compositions of liquid products were analyzed by ICP-AES and ICP-MS. Pyrolytic exhaust was collected by a water-absorption system in an ice-bath cooler, and IC analysis showed that the absorbed solution comprised 11 ionic species. Based on the pyrolytic kinetic parameters of TG analysis and pyrolytic residues at various temperatures for 30 min, the effect of particle size was insignificant in this study, and temperature was the key factor for the IC board pyrolysis. Two stages of decomposition were found for IC board pyrolysis under nitrogen atmosphere. The activation energy was 38-47 kcal/mol for the first-stage reaction and 5.2-9.4 kcal/mol for the second-stage reaction. Metal content was low in the liquid by-product of the IC board pyrolysis process, which is an advantage in that the liquid product could be used as a fuel. Brominate and ammonium were the main water-soluble ionic species of the pyrolytic exhaust. A plan for their safe and effective disposal must be developed if the pyrolytic recycling process is to be applied to IC boards

Time within time: 3D printed sculptures within holographic art practice

Science.gov (United States)

Chang, Yin-Ren; Richardson, Martin

2015-03-01

Holography is a time-based medium, which uses its own aesthetics and techniques to interpret colour and light. This exclusive descriptive language does not simply represent a particular scenario in the moment of recording, but also documents the performance light during the shooting process. Nowadays 3D graphic software and Internet offer practitioners greater mobility in both the development and the delivery of their artwork. Furthermore, the diverse web-based social media presents unlimited and various spaces to facilitate artists in the exchange of creative knowledge, it enables them to collaborate on their projects with external connections - audience, specialists, etc. Within the analogue holography art practice, there is a primary lack of interface, or, in other words, it cannot utilise any digital creative tools. 3D printing makes it possible to bridge the gap between cyber space and the holographic world; even more so, as this emerging technique also becomes a platform, which can connect computational data and light information. The application of 3D printing in contemporary art will reshape the process of creation, as well as the form of visual narrative itself. New technologies continually and increasingly involve the projection of another artistic dimension, and the term "visual" embarks on challenging the generally accepted notion of understanding art and interacting with it. As new pathways of practice are established, it will take years to build a complete understanding of this medium in order to be able to take a full advantage of the benefits its use offers. This paper is aimed at looking for the potential new ways of artistic expression, deriving from the interrelation between analogue holography and 3D printing. It will also attempt an articulate assessment of 3D printing within the dynamic holographic aesthetics.

The Human Genome Project: Information access, management, and regulation. Final report

Energy Technology Data Exchange (ETDEWEB)

McInerney, J.D.; Micikas, L.B.

1996-08-31

The Human Genome Project is a large, internationally coordinated effort in biological research directed at creating a detailed map of human DNA. This report describes the access of information, management, and regulation of the project. The project led to the development of an instructional module titled The Human Genome Project: Biology, Computers, and Privacy, designed for use in high school biology classes. The module consists of print materials and both Macintosh and Windows versions of related computer software-Appendix A contains a copy of the print materials and discs containing the two versions of the software.

Printing Electronic Components from Copper-Infused Ink and Thermoplastic Mediums

Science.gov (United States)

Flowers, Patrick F.

The demand for printable electronics has sharply increased in recent years and is projected to continue to rise. Unfortunately, electronic materials which are suitable for desired applications while being compatible with available printing techniques are still often lacking. This thesis addresses two such challenging areas. In the realm of two-dimensional ink-based printing of electronics, a major barrier to the realization of printable computers that can run programs is the lack of a solution-coatable non-volatile memory with performance metrics comparable to silicon-based devices. To address this deficiency, I developed a nonvolatile memory based on Cu-SiO2 core-shell nanowires that can be printed from solution and exhibits on-off ratios of 106, switching speeds of 50 ns, a low operating voltage of 2 V, and operates for at least 104 cycles without failure. Each of these metrics is similar to or better than Flash memory (the write speed is 20 times faster than Flash). Memory architectures based on the individual memory cells demonstrated here could enable the printing of the more complex, embedded computing devices that are expected to make up an internet of things. Recently, the exploration of three-dimensional printing techniques to fabricate electronic materials began. A suitable general-purpose conductive thermoplastic filament was not available, however. In this work I examine the current state of conductive thermoplastic filaments, including a newly-released highly conductive filament that my lab has produced which we call Electrifi. I focus on the use of dual-material fused filament fabrication (FFF) to 3D print electronic components (conductive traces, resistors, capacitors, inductors) and circuits (a fully-printed high-pass filter). The resistivity of traces printed from conductive thermoplastic filaments made with carbon-black, graphene, and copper as conductive fillers was found to be 12, 0.78, and 0.014 ohm cm, respectively, enabling the creation of

Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment.

Science.gov (United States)

Xiu, Fu-Rong; Qi, Yingying; Zhang, Fu-Shen

2015-07-01

Precious metals are the most attractive resources in waste printed circuit boards (PCBs) of mobile phones. In this work, an alternative process for recovering Au, Ag, and Pd from waste PCBs of mobile phones by supercritical water oxidation (SCWO) pre-treatment combined with iodine-iodide leaching process was developed. In the process, the waste PCBs of mobile phones were pre-treated in supercritical water, then a diluted hydrochloric acid leaching (HL) process was used to recovery the Cu, whose leaching efficiency was approximately 100%, finally the resulting residue was subjected to the iodine-iodide leaching process for recovering the Au, Ag, and Pd. Experimental results indicated that SCWO pre-treatment temperature, time, and pressure had significant influence on the Au, Ag, and Pd leaching from (SCWO+HL)-treated waste PCBs. The optimal SCWO pre-treatment conditions were 420°C and 60min for Au and Pd, and 410°C and 30min for Ag. The optimum dissolution parameters for Au, Pd, and Ag in (SCWO+HL)-treated PCBs with iodine-iodide system were leaching time of 120min (90min for Ag), iodine/iodide mole ratio of 1:5 (1:6 for Ag), solid-to-liquid ratio (S/L) of 1:10g/mL (1:8g/mL for Ag), and pH of 9, respectively. It is believed that the process developed in this study is environment friendly for the recovery of Au, Ag, and Pd from waste PCBs of mobile phones by SCWO pre-treatment combined with iodine-iodide leaching process. Copyright © 2015 Elsevier Ltd. All rights reserved.

Tape transfer printing of a liquid metal alloy for stretchable RF electronics.

Science.gov (United States)

Jeong, Seung Hee; Hjort, Klas; Wu, Zhigang

2014-09-03

In order to make conductors with large cross sections for low impedance radio frequency (RF) electronics, while still retaining high stretchability, liquid-alloy-based microfluidic stretchable electronics offers stretchable electronic systems the unique opportunity to combine various sensors on our bodies or organs with high-quality wireless communication with the external world (devices/systems), without sacrificing enhanced user comfort. This microfluidic approach, based on printed circuit board technology, allows large area processing of large cross section conductors and robust contacts, which can handle a lot of stretching between the embedded rigid active components and the surrounding system. Although it provides such benefits, further development is needed to realize its potential as a high throughput, cost-effective process technology. In this paper, tape transfer printing is proposed to supply a rapid prototyping batch process at low cost, albeit at a low resolution of 150 μm. In particular, isolated patterns can be obtained in a simple one-step process. Finally, a stretchable radio frequency identification (RFID) tag is demonstrated. The measured results show the robustness of the hybrid integrated system when the tag is stretched at 50% for 3000 cycles.

Tape Transfer Printing of a Liquid Metal Alloy for Stretchable RF Electronics

Directory of Open Access Journals (Sweden)

Seung Hee Jeong

2014-09-01

Full Text Available In order to make conductors with large cross sections for low impedance radio frequency (RF electronics, while still retaining high stretchability, liquid-alloy-based microfluidic stretchable electronics offers stretchable electronic systems the unique opportunity to combine various sensors on our bodies or organs with high-quality wireless communication with the external world (devices/systems, without sacrificing enhanced user comfort. This microfluidic approach, based on printed circuit board technology, allows large area processing of large cross section conductors and robust contacts, which can handle a lot of stretching between the embedded rigid active components and the surrounding system. Although it provides such benefits, further development is needed to realize its potential as a high throughput, cost-effective process technology. In this paper, tape transfer printing is proposed to supply a rapid prototyping batch process at low cost, albeit at a low resolution of 150 μm. In particular, isolated patterns can be obtained in a simple one-step process. Finally, a stretchable radio frequency identification (RFID tag is demonstrated. The measured results show the robustness of the hybrid integrated system when the tag is stretched at 50% for 3000 cycles.

Software for Quantitative Estimation of Coefficients of Ink Transfer on the Printed Substrate in Offset Printing

Science.gov (United States)

Varepo, L. G.; Trapeznikova, O. V.; Panichkin, A. V.; Roev, B. A.; Kulikov, G. B.

2018-04-01

In the framework of standardizing the process of offset printing, one of the most important tasks is the correct selection of the printing system components, taking into account the features of their interaction and behavior in the printing process. The program allows to calculate the transfer of ink on the printed material between the contacting cylindrical surfaces of the sheet-fed offset printing apparatus with the boundaries deformation. A distinctive feature of this software product is the modeling of the liquid flow having free boundaries and causing deformation of solid boundaries when flowing between the walls of two cylinders.

OptoZIF Drive: a 3D printed implant and assembly tool package for neural recording and optical stimulation in freely moving mice

Science.gov (United States)

Freedman, David S.; Schroeder, Joseph B.; Telian, Gregory I.; Zhang, Zhengyang; Sunil, Smrithi; Ritt, Jason T.

2016-12-01

Objective. Behavioral neuroscience studies in freely moving rodents require small, light-weight implants to facilitate neural recording and stimulation. Our goal was to develop an integrated package of 3D printed parts and assembly aids for labs to rapidly fabricate, with minimal training, an implant that combines individually positionable microelectrodes, an optical fiber, zero insertion force (ZIF-clip) headstage connection, and secondary recording electrodes, e.g. for electromyography (EMG). Approach. Starting from previous implant designs that position recording electrodes using a control screw, we developed an implant where the main drive body, protective shell, and non-metal components of the microdrives are 3D printed in parallel. We compared alternative shapes and orientations of circuit boards for electrode connection to the headstage, in terms of their size, weight, and ease of wire insertion. We iteratively refined assembly methods, and integrated additional assembly aids into the 3D printed casing. Main results. We demonstrate the effectiveness of the OptoZIF Drive by performing real time optogenetic feedback in behaving mice. A novel feature of the OptoZIF Drive is its vertical circuit board, which facilities direct ZIF-clip connection. This feature requires angled insertion of an optical fiber that still can exit the drive from the center of a ring of recording electrodes. We designed an innovative 2-part protective shell that can be installed during the implant surgery to facilitate making additional connections to the circuit board. We use this feature to show that facial EMG in mice can be used as a control signal to lock stimulation to the animal’s motion, with stable EMG signal over several months. To decrease assembly time, reduce assembly errors, and improve repeatability, we fabricate assembly aids including a drive holder, a drill guide, an implant fixture for microelectode ‘pinning’, and a gold plating fixture. Significance. The

76 FR 72009 - Sunshine Act Notice-December 8, 2011 Board of Directors Meeting

Science.gov (United States)

2011-11-21

.... 2. Insurance Project--Middle East and Africa. 3. Finance Project--Maghreb and North Africa. 4... Closed Session of the October 27, 2011 Board of Directors Meeting. 6. Pending Major Projects. Written summaries of the projects to be presented will be posted on OPIC's Web site on or about November 17, 2011...

Board Task Performance

DEFF Research Database (Denmark)

Minichilli, Alessandro; Zattoni, Alessandro; Nielsen, Sabina

2012-01-01

identify three board processes as micro-level determinants of board effectiveness. Specifically, we focus on effort norms, cognitive conflicts and the use of knowledge and skills as determinants of board control and advisory task performance. Further, we consider how two different institutional settings....... The findings show that: (i) Board processes have a larger potential than demographic variables to explain board task performance; (ii) board task performance differs significantly between boards operating in different contexts; and (iii) national context moderates the relationships between board processes...... and board task performance....

Inkjet printed electronics using copper nanoparticle ink

OpenAIRE

Kang, Jin Sung; Kim, Hak Sung; Ryu, Jongeun; Thomas Hahn, H.; Jang, Seonhee; Joung, Jae Woo

2010-01-01

Inkjet printing of electrode using copper nanoparticle ink is presented. Electrode was printed on a flexible glass epoxy composite substrate using drop on demand piezoelectric dispenser and was sintered at 200 °C of low temperature in N2 gas condition. The printed electrodes were made with various widths and thickness. In order to control the thickness of the printed electrode, number of printing was varied. Resistivity of printed electrode was calculated from the cross-sectional area measure...

3D Printing of Highly Stretchable, Shape-Memory, and Self-Healing Elastomer toward Novel 4D Printing.

Science.gov (United States)

Kuang, Xiao; Chen, Kaijuan; Dunn, Conner K; Wu, Jiangtao; Li, Vincent C F; Qi, H Jerry

2018-02-28

The three-dimensional (3D) printing of flexible and stretchable materials with smart functions such as shape memory (SM) and self-healing (SH) is highly desirable for the development of future 4D printing technology for myriad applications, such as soft actuators, deployable smart medical devices, and flexible electronics. Here, we report a novel ink that can be used for the 3D printing of highly stretchable, SM, and SH elastomer via UV-light-assisted direct-ink-write printing. An ink containing urethane diacrylate and a linear semicrystalline polymer is developed for the 3D printing of a semi-interpenetrating polymer network elastomer that can be stretched by up to 600%. The 3D-printed complex structures show interesting functional properties, such as high strain SM and SM -assisted SH capability. We demonstrate that such a 3D-printed SM elastomer has the potential application for biomedical devices, such as vascular repair devices. This research paves a new way for the further development of novel 4D printing, soft robotics, and biomedical devices.

Turning Schools Around: The National Board Certification Process as a School Improvement Strategy

Science.gov (United States)

Jaquith, Ann; Snyder, Jon

2016-01-01

Can the National Board certification process support school improvement where large proportions of students score below grade level on standardized tests? This SCOPE study examines a project that sought to seize and capitalize upon the learning opportunities embedded in the National Board certification process, particularly opportunities to learn…

Design principles and realization of electro-optical circuit boards

Science.gov (United States)

Betschon, Felix; Lamprecht, Tobias; Halter, Markus; Beyer, Stefan; Peterson, Harry

2013-02-01

The manufacturing of electro-optical circuit boards (EOCB) is based to a large extent on established technologies. First products with embedded polymer waveguides are currently produced in series. The range of applications within the sensor and data communication markets is growing with the increasing maturity level. EOCBs require design flows, processes and techniques similar to existing printed circuit board (PCB) manufacturing and appropriate for optical signal transmission. A key aspect is the precise and automated assembly of active and passive optical components to the optical waveguides which has to be supported by the technology. The design flow is described after a short introduction into the build-up of EOCBs and the motivation for the usage of this technology within the different application fields. Basis for the design of EOCBs are the required optical signal transmission properties. Thereafter, the devices for the electro-optical conversion are chosen and the optical coupling approach is defined. Then, the planar optical elements (waveguides, splitters, couplers) are designed and simulated. This phase already requires co-design of the optical and electrical domain using novel design flows. The actual integration of an optical system into a PCB is shown in the last part. The optical layer is thereby laminated to the purely electrical PCB using a conventional PCB-lamination process to form the EOCB. The precise alignment of the various electrical and optical layers is thereby essential. Electrical vias are then generated, penetrating also the optical layer, to connect the individual electrical layers. Finally, the board has to be tested electrically and optically.

High-resolution direct 3D printed PLGA scaffolds: print and shrink

International Nuclear Information System (INIS)

Chia, Helena N; Wu, Benjamin M

2015-01-01

Direct three-dimensional printing (3DP) produces the final part composed of the powder and binder used in fabrication. An advantage of direct 3DP is control over both the microarchitecture and macroarchitecture. Prints which use porogen incorporated in the powder result in high pore interconnectivity, uniform porosity, and defined pore size after leaching. The main limitations of direct 3DP for synthetic polymers are the use of organic solvents which can dissolve polymers used in most printheads and limited resolution due to unavoidable spreading of the binder droplet after contact with the powder. This study describes a materials processing strategy to eliminate the use of organic solvent during the printing process and to improve 3DP resolution by shrinking with a non-solvent plasticizer. Briefly, poly(lactic-co-glycolic acid) (PLGA) powder was prepared by emulsion solvent evaporation to form polymer microparticles. The printing powder was composed of polymer microparticles dry mixed with sucrose particles. After printing with a water-based liquid binder, the polymer microparticles were fused together to form a network by solvent vapor in an enclosed vessel. The sucrose is removed by leaching and the resulting scaffold is placed in a solution of methanol. The methanol acts as a non-solvent plasticizer and allows for polymer chain rearrangement and efficient packing of polymer chains. The resulting volumetric shrinkage is ∼80% at 90% methanol. A complex shape (honey-comb) was designed, printed, and shrunken to demonstrate isotropic shrinking with the ability to reach a final resolution of ∼400 μm. The effect of type of alcohol (i.e. methanol or ethanol), concentration of alcohol, and temperature on volumetric shrinking was studied. This study presents a novel materials processing strategy to overcome the main limitations of direct 3DP to produce high resolution PLGA scaffolds. (paper)

High-resolution direct 3D printed PLGA scaffolds: print and shrink.

Science.gov (United States)

Chia, Helena N; Wu, Benjamin M

2014-12-17

Direct three-dimensional printing (3DP) produces the final part composed of the powder and binder used in fabrication. An advantage of direct 3DP is control over both the microarchitecture and macroarchitecture. Prints which use porogen incorporated in the powder result in high pore interconnectivity, uniform porosity, and defined pore size after leaching. The main limitations of direct 3DP for synthetic polymers are the use of organic solvents which can dissolve polymers used in most printheads and limited resolution due to unavoidable spreading of the binder droplet after contact with the powder. This study describes a materials processing strategy to eliminate the use of organic solvent during the printing process and to improve 3DP resolution by shrinking with a non-solvent plasticizer. Briefly, poly(lactic-co-glycolic acid) (PLGA) powder was prepared by emulsion solvent evaporation to form polymer microparticles. The printing powder was composed of polymer microparticles dry mixed with sucrose particles. After printing with a water-based liquid binder, the polymer microparticles were fused together to form a network by solvent vapor in an enclosed vessel. The sucrose is removed by leaching and the resulting scaffold is placed in a solution of methanol. The methanol acts as a non-solvent plasticizer and allows for polymer chain rearrangement and efficient packing of polymer chains. The resulting volumetric shrinkage is ∼80% at 90% methanol. A complex shape (honey-comb) was designed, printed, and shrunken to demonstrate isotropic shrinking with the ability to reach a final resolution of ∼400 μm. The effect of type of alcohol (i.e. methanol or ethanol), concentration of alcohol, and temperature on volumetric shrinking was studied. This study presents a novel materials processing strategy to overcome the main limitations of direct 3DP to produce high resolution PLGA scaffolds.

Center of gravity estimation using a reaction board instrumented with fiber Bragg gratings

Science.gov (United States)

Oliveira, Rui; Roriz, Paulo; Marques, Manuel B.; Frazão, Orlando

2018-03-01

The purpose of the present work is to construct a reaction board based on fiber Bragg gratings (FBGs) that could be used for estimation of the 2D coordinates of the projection of center of gravity (CG) of an object. The apparatus is consisted of a rigid equilateral triangular board mounted on three supports at the vertices, two of which have cantilevers instrumented with FBGs. When an object of known weight is placed on the board, the bending strain of the cantilevers is measured by a proportional wavelength shift of the FBGs. Applying the equilibrium conditions of a rigid body and proper calibration procedures, the wavelength shift is used to estimate the vertical reaction forces and moments of force at the supports and the coordinates of the object's CG projection on the board. This method can be used on a regular basis to estimate the CG of the human body or objects with complex geometry and density distribution. An example is provided for the estimation of the CG projection coordinates of two orthopaedic femur bone models, one intact, and the other with a hip stem implant encased. The clinical implications of changing the normal CG location by means of a prosthesis have been discussed.

U-PHOS Project: Development of a Large Diameter Pulsating Heat Pipe Experiment on board REXUS 22

International Nuclear Information System (INIS)

Nannipieri, P; Anichini, M; Barsocchi, L; Becatti, G; Buoni, L; Celi, F; Catarsi, A; Di Giorgio, P; Fattibene, P; Ferrato, E; Guardati, P; Mancini, E; Meoni, G; Nesti, F; Piacquadio, S; Pratelli, E; Quadrelli, L; Viglione, A S; Zanaboni, F; Mameli, M

2017-01-01

U-PHOS Project aims at analysing and characterising the behaviour of a large diameter Pulsating Heat Pipe (PHP) on board REXUS 22 sounding rocket. A PHP is a passive thermal control device where the heat is efficiently transported by means of the self-sustained oscillatory fluid motion driven by the phase change phenomena. Since, in milli-gravity conditions, buoyancy forces become less intense, the PHP diameter may be increased still maintaining the slug/plug typical flow pattern. Consequently, the PHP heat power capability may be increased too. U-PHOS aims at proving that a large diameter PHP effectively works in milli-g conditions by characterizing its thermal response during a sounding rocket flight. The actual PHP tube is made of aluminum (3 mm inner diameter, filled with FC-72), heated at the evaporator by a compact electrical resistance, cooled at the condenser by a Phase Change Material (PCM) embedded in a metallic foam. The tube wall temperatures are recorded by means of Fibre Bragg Grating (FBG) sensors; the local fluid pressure is acquired by means of a pressure transducer. The present work intends to report the actual status of the project, focusing in particular on the experiment improvements with respect to the previous campaign. (paper)

New technologies for fire suppression on board naval craft, FiST

NARCIS (Netherlands)

Rahm, M.; Hiltz, J.; Wal, R. van der; Hertzberg, T.; Lindström, J.

2014-01-01

For three years Canada, Sweden and the Netherlands have been investigating new technologies for fire suppression on board naval crafts within the FiST project. The project has focused on a number of technologies. These included the evaluation of water based fire suppression systems and in particular

Three-Dimensional Printing of Bisphenol A-Free Polycarbonates.

Science.gov (United States)

Zhu, Wei; Pyo, Sang-Hyun; Wang, Pengrui; You, Shangting; Yu, Claire; Alido, Jeffrey; Liu, Justin; Leong, Yew; Chen, Shaochen

2018-02-14

Polycarbonates are widely used in food packages, drink bottles, and various healthcare products such as dental sealants and tooth coatings. However, bisphenol A (BPA) and phosgene used in the production of commercial polycarbonates pose major concerns to public health safety. Here, we report a green pathway to prepare BPA-free polycarbonates (BFPs) by thermal ring-opening polymerization and photopolymerization. Polycarbonates prepared from two cyclic carbonates in different mole ratios demonstrated tunable mechanical stiffness, excellent thermal stability, and high optical transparency. Three-dimensional (3D) printing of the new BFPs was demonstrated using a two-photon laser direct writing system and a rapid 3D optical projection printer to produce structures possessing complex high-resolution geometries. Seeded C3H10T1/2 cells also showed over 95% viability with potential applications in biological studies. By combining biocompatible BFPs with 3D printing, novel safe and high-performance biomedical devices and healthcare products could be developed with broad long-term benefits to society.

Fabrication of corner cube array retro-reflective structure with DLP-based 3D printing technology

Science.gov (United States)

Riahi, Mohammadreza

2016-06-01

In this article, the fabrication of a corner cube array retro-reflective structure is presented by using DLP-based 3D printing technology. In this additive manufacturing technology a pattern of a cube corner array is designed in a computer and sliced with specific software. The image of each slice is then projected from the bottom side of a reservoir, containing UV cure resin, utilizing a DLP video projector. The projected area is cured and attached to a base plate. This process is repeated until the entire part is made. The best orientation of the printing process and the effect of layer thicknesses on the surface finish of the cube has been investigated. The thermal reflow surface finishing and replication with soft molding has also been presented in this article.

3D Printing of Biosamples: A Concise Review

Science.gov (United States)

Zhao, Victoria Xin Ting; Wong, Ten It; Zhou, Xiaodong

This paper reviews the recent development of 3D printing of biosamples, in terms of the 3D structure design, suitable printing technology, and available materials. Successfully printed 3D biosamples should possess the properties of high cell viability, vascularization and good biocompatibility. These goals are attained by printing the materials of hydrogels, polymers and cells, with a carefully selected 3D printer from the categories of inkjet printing, extrusion printing and laser printing, based on the uniqueness, advantages and disadvantages of these technologies. For recent developments, we introduce the 3D applications of creating scaffolds, printing cells for self-assembly and testing platforms. We foresee more bio-applications of 3D printing will be developed, with the advancements on materials and 3D printing machines.

3D Bio-Printing Review

Science.gov (United States)

Du, Xianbin

2018-01-01

Ultimate goal of tissue engineering is to replace pathological or necrotic body tissue or organ by artificial tissue or organ and tissue engineering is a very promising research field. 3D bio-printing is a kind of emerging technologies and a branch of tissue engineering. It has made significant progress in the past decade. 3D bio-printing can realize tissue and organ construction in vitro and has wide application in basic research and pharmacy. This paper is to make an analysis and review on 3D bio-printing from the perspectives of bioink, printing technology and technology application.

3D printing for dummies

CERN Document Server

Hausman, Kalani Kirk

2014-01-01

Get started printing out 3D objects quickly and inexpensively! 3D printing is no longer just a figment of your imagination. This remarkable technology is coming to the masses with the growing availability of 3D printers. 3D printers create 3-dimensional layered models and they allow users to create prototypes that use multiple materials and colors.  This friendly-but-straightforward guide examines each type of 3D printing technology available today and gives artists, entrepreneurs, engineers, and hobbyists insight into the amazing things 3D printing has to offer. You'll discover methods for

FDM 3D printed coffee glove embedded with flexible electronic

KAUST Repository

Bahri, Meznan

2017-10-31

With the advances in 3D printing technology, Flexible Electronics can now be exploited to form the so-called “Embedded Electronics”. This paper describes experiences learned from a research project which ran during summer 2016 at KAUST, in collaboration with the Electrical and Computer Engineering Department at Effat University, and aimed at creating a heating coffee glove product operating on double alkaline batteries using Kapton© as a flexible substrate for the circuit. The circuit and its batteries are encapsulated in a 3D printed glove, designed using SolidWorks©. The proposed methodology and techniques applied during this work could be further used in implementing other technologies, such as thermoelectric coolers head patches, smart garments, and flexible smartphones. Limitation and recommendation of the present methodology are also discussed.

4onse D1.3 - Project Identity Manual

OpenAIRE

Cannata Massimiliano; Strigaro Daniele

2016-01-01

This document describes the corporate identity which has been developed for the 4onse project. The corporate identity consists of logo for the overall project and templates for written and presentation materials and printed communication materials.

Fabrication of Capacitive Acoustic Resonators Combining 3D Printing and 2D Inkjet Printing Techniques

Directory of Open Access Journals (Sweden)

Rubaiyet Iftekharul Haque

2015-10-01

Full Text Available A capacitive acoustic resonator developed by combining three-dimensional (3D printing and two-dimensional (2D printed electronics technique is described. During this work, a patterned bottom structure with rigid backplate and cavity is fabricated directly by a 3D printing method, and then a direct write inkjet printing technique has been employed to print a silver conductive layer. A novel approach has been used to fabricate a diaphragm for the acoustic sensor as well, where the conductive layer is inkjet-printed on a pre-stressed thin organic film. After assembly, the resulting structure contains an electrically conductive diaphragm positioned at a distance from a fixed bottom electrode separated by a spacer. Measurements confirm that the transducer acts as capacitor. The deflection of the diaphragm in response to the incident acoustic single was observed by a laser Doppler vibrometer and the corresponding change of capacitance has been calculated, which is then compared with the numerical result. Observation confirms that the device performs as a resonator and provides adequate sensitivity and selectivity at its resonance frequency.

Board effectiveness: Investigating payment asymmetry between board members and shareholders

Directory of Open Access Journals (Sweden)

Wuchun Chi

2008-01-01

Full Text Available Board members may well be responsible for dissension between themselves and shareholders since they are simultaneously the setters and receivers of both board remuneration and dividends. They may act out of their own personal interests at the expense of external shareholders. We investigate the impact of ownership structure, board structure and control deviation on payment asymmetry, where excessively high remuneration is paid to board members but considerably lower dividends are distributed to shareholders. We find strong evidence confirming that the smaller the shareholdings of board members and outside blockholders are, the more asymmetric the payments are. With controlling family members on the board and a higher percentage of seats held by independent board members, there is a slight reduction in the likelihood and severity of payment asymmetry. In addition, it is abundantly clear that the larger the board seat-control deviation is, the greater is the likelihood and severity of payment asymmetry. While prior research has primarily focused on board-manager agency issues, the board-shareholder perspective could be even more important in that it is the board that is the most directly delegated agent of shareholders, not the managers

3D Printing: Print the future of ophthalmology.

Science.gov (United States)

Huang, Wenbin; Zhang, Xiulan

2014-08-26

The three-dimensional (3D) printer is a new technology that creates physical objects from digital files. Recent technological advances in 3D printing have resulted in increased use of this technology in the medical field, where it is beginning to revolutionize medical and surgical possibilities. It is already providing medicine with powerful tools that facilitate education, surgical planning, and organ transplantation research. A good understanding of this technology will be beneficial to ophthalmologists. The potential applications of 3D printing in ophthalmology, both current and future, are explored in this article. Copyright 2014 The Association for Research in Vision and Ophthalmology, Inc.

Development of novel 3D-printed robotic prosthetic for transradial amputees.

Science.gov (United States)

Gretsch, Kendall F; Lather, Henry D; Peddada, Kranti V; Deeken, Corey R; Wall, Lindley B; Goldfarb, Charles A

2016-06-01

Upper extremity myoelectric prostheses are expensive. The Robohand demonstrated that three-dimensional printing reduces the cost of a prosthetic extremity. The goal of this project was to develop a novel, inexpensive three-dimensional printed prosthesis to address limitations of the Robohand. The prosthesis was designed for patients with transradial limb amputation. It is shoulder-controlled and externally powered with an anthropomorphic terminal device. The user can open and close all five fingers, and move the thumb independently. The estimated cost is US$300. After testing on a patient with a traumatic transradial amputation, several advantages were noted. The independent thumb movement facilitated object grasp, the device weighed less than most externally powered prostheses, and the size was easily scalable. Limitations of the new prosthetic include low grip strength and decreased durability compared to passive prosthetics. Most children with a transradial congenital or traumatic amputation do not use a prosthetic. A three-dimensional printed shoulder-controlled robotic prosthesis provides a cost effective, easily sized and highly functional option which has been previously unavailable. © The International Society for Prosthetics and Orthotics 2015.

Additive manufacture (3d printing) of plasma diagnostic components and assemblies for fusion experiments

Science.gov (United States)

Sieck, Paul; Woodruff, Simon; Stuber, James; Romero-Talamas, Carlos; Rivera, William; You, Setthivoine; Card, Alexander

2015-11-01

Additive manufacturing (or 3D printing) is now becoming sufficiently accurate with a large range of materials for use in printing sensors needed universally in fusion energy research. Decreasing production cost and significantly lowering design time of energy subsystems would realize significant cost reduction for standard diagnostics commonly obtained through research grants. There is now a well-established set of plasma diagnostics, but these expensive since they are often highly complex and require customization, sometimes pace the project. Additive manufacturing (3D printing) is developing rapidly, including open source designs. Basic components can be printed for (in some cases) less than 1/100th costs of conventional manufacturing. We have examined the impact that AM can have on plasma diagnostic cost by taking 15 separate diagnostics through an engineering design using Conventional Manufacturing (CM) techniques to determine costs of components and labor costs associated with getting the diagnostic to work as intended. With that information in hand, we set about optimizing the design to exploit the benefits of AM. Work performed under DOE Contract DE-SC0011858.

Advanced EVA Suit Camera System Development Project

Science.gov (United States)

Mock, Kyla

2016-01-01

also spent creating a case for the original interface board that is already being used. This design is being done by use of Creo 2. Due to time constraints, I may not be able to complete the 3-D printing portion of this design, but I was able to use my knowledge of the interface board and Altium Design to help in the task. As a side project, I assisted another intern in selecting and programming a microprocessor to control linear actuators. These linear actuators will be used to move various increments of polyethylene for controlled radiation testing. For this, we began the software portion of the project using the Arduino's coding environment to control an Arduino Due and H-Bridge components. Along with the obvious learning of computer programs such as Altium Design and Creo 2, I also acquired more skills with networking and collaborating with others, being able to multi-task because of responsibilities to work on various projects, and how to set realistic goals in the work place. Like many internship projects, this project will be continued and improved, so I also had the chance to improve my organization and communication skills as I documented all of my meetings and research. As a result of my internship at JSC, I desire to continue a career with NASA, whether that be through another internship or possibly a co-op. I am excited to return to my university and continue my education in electrical engineering because of all of my experiences at JSC.

MakerBot projects blueprints

CERN Document Server

Larson, Joseph

2013-01-01

MakerBot Projects Blueprints is a project-based book, with each chapter taking you through the creation of an awesome stand-alone project. MakerBot Project Blueprints is for anyone with an interest in the 3D printing revolution and the slightest bit of computer skills. Whether you own a 3D printer or not you can design for them. All it takes is Blender, a free 3D modeling tool, this book and a little creativity and someday you'll be able to hold something you designed in the computer in your hands.

Board of Directors or Supervisory Board

DEFF Research Database (Denmark)

Werlauff, Erik

2009-01-01

The article analyses the legal consequences of the choice now available to Danish public limited companies, which can now opt for a two-tier management structure, in which the management board undertakes both the day-to-day and the overall management, while a supervisory board exercises control...... over the management board, including its appointment and dismissal. The article considers which companies a two-tier structure may be relevant for, and reviews the consequences for the composition, election and functioning of the company organs....

A Dual Digital Signal Processor VME Board for Instrumentation and Control Applications

International Nuclear Information System (INIS)

H. Dong; R. Flood; C. Hovater; J. Musson

2001-01-01

A Dual Digital Signal Processing VME Board is being developed for the CEBAF Beam Current Monitor system at Jefferson Lab. It is a versatile general-purpose digital signal processing board using an open architecture, which allows for adaptation to various applications. The base design uses two independent Texas Instrument (TI) TMS320C6711, which are 900 MFLOPS floating-point digital signal processors (DSP). Applications that require a fixed point DSP can be implemented by replacing the baseline DSP with the pin-for-pin compatible TMS320C6211. Both parallel and serial protocols have been implemented for communicating with off board devices. The initial implementation makes use of TI Multi-channel Serial protocol and VME bus protocol. Other communication protocols can be implemented by reprogramming the FPGA. Each DSP is equipped with FLASH PROM and SDRAM for program and data storage. Additionally, each DSP has 16 bits of digital I/O, two digital analog converters, and two analog to digital converters. Dual 160 pins mezzanine connectors provide expansion capability without design modifications. The mezzanine interface conforms to the TI Expansion Daughter Card Interface standard. The design can be manufactured with a reduced chip set without redesigning the printed circuit board. For example, it can be implemented as a single-channel DSP with no analog I/O. The board supports JTAG 1149 boundary scan to facilitate testing, debugging, and programming. It is fully programmable using software development tools such as TI Code Composer Studio and a JTAG emulator such as Spectrum Digital DS510PP-PLUS. Using these tools allows one program the flash memory and FPGA through the JTAG ports, thus eliminating the need for a separate ROM/FPGA programmer. This work supported by U.S. DOE Contract No. DE-AC05-84ER40150

Inkjet-Printed Small-Molecule Organic Light-Emitting Diodes: Halogen-Free Inks, Printing Optimization, and Large-Area Patterning.

Science.gov (United States)

Zhou, Lu; Yang, Lei; Yu, Mengjie; Jiang, Yi; Liu, Cheng-Fang; Lai, Wen-Yong; Huang, Wei

2017-11-22

Manufacturing small-molecule organic light-emitting diodes (OLEDs) via inkjet printing is rather attractive for realizing high-efficiency and long-life-span devices, yet it is challenging. In this paper, we present our efforts on systematical investigation and optimization of the ink properties and the printing process to enable facile inkjet printing of conjugated light-emitting small molecules. Various factors on influencing the inkjet-printed film quality during the droplet generation, the ink spreading on the substrates, and its solidification processes have been systematically investigated and optimized. Consequently, halogen-free inks have been developed and large-area patterning inkjet printing on flexible substrates with efficient blue emission has been successfully demonstrated. Moreover, OLEDs manufactured by inkjet printing the light-emitting small molecules manifested superior performance as compared with their corresponding spin-cast counterparts.

Banner Pages on the New Printing Infrastructure

CERN Multimedia

2006-01-01

Changes to the printing service were announced in CERN Bulletin No. 37-38/2006. In the new infrastructure, the printing of the banner page has been disabled in order to reduce paper consumption. Statistics show that the average print job size is small and the paper savings by not printing the banner page could be up to 20 %. When each printer is moved onto the new infrastructure banner page printing will be disabled. In the case of corridor printers which are shared by several users, the Helpdesk can re-enable banner page printing upon request. We hope ultimately to arrive at a situation where banner page printing is enabled on fewer than 10% of printers registered on the network. You can still print banner pages on printers where it has been centrally disabled by using Linux. Simply add it to your print job on the client side by adding the -o job-sheets option to your lpr command. Detailed documentation is available on each SLC3/4 under the following link: http://localhost:631/sum.html#4_2 Please bea...

Active origami by 4D printing

International Nuclear Information System (INIS)

Ge, Qi; Qi, H Jerry; Dunn, Martin L; Dunn, Conner K

2014-01-01

Recent advances in three dimensional (3D) printing technology that allow multiple materials to be printed within each layer enable the creation of materials and components with precisely controlled heterogeneous microstructures. In addition, active materials, such as shape memory polymers, can be printed to create an active microstructure within a solid. These active materials can subsequently be activated in a controlled manner to change the shape or configuration of the solid in response to an environmental stimulus. This has been termed 4D printing, with the 4th dimension being the time-dependent shape change after the printing. In this paper, we advance the 4D printing concept to the design and fabrication of active origami, where a flat sheet automatically folds into a complicated 3D component. Here we print active composites with shape memory polymer fibers precisely printed in an elastomeric matrix and use them as intelligent active hinges to enable origami folding patterns. We develop a theoretical model to provide guidance in selecting design parameters such as fiber dimensions, hinge length, and programming strains and temperature. Using the model, we design and fabricate several active origami components that assemble from flat polymer sheets, including a box, a pyramid, and two origami airplanes. In addition, we directly print a 3D box with active composite hinges and program it to assume a temporary flat shape that subsequently recovers to the 3D box shape on demand. (paper)

Active origami by 4D printing

Science.gov (United States)

Ge, Qi; Dunn, Conner K.; Qi, H. Jerry; Dunn, Martin L.

2014-09-01

Recent advances in three dimensional (3D) printing technology that allow multiple materials to be printed within each layer enable the creation of materials and components with precisely controlled heterogeneous microstructures. In addition, active materials, such as shape memory polymers, can be printed to create an active microstructure within a solid. These active materials can subsequently be activated in a controlled manner to change the shape or configuration of the solid in response to an environmental stimulus. This has been termed 4D printing, with the 4th dimension being the time-dependent shape change after the printing. In this paper, we advance the 4D printing concept to the design and fabrication of active origami, where a flat sheet automatically folds into a complicated 3D component. Here we print active composites with shape memory polymer fibers precisely printed in an elastomeric matrix and use them as intelligent active hinges to enable origami folding patterns. We develop a theoretical model to provide guidance in selecting design parameters such as fiber dimensions, hinge length, and programming strains and temperature. Using the model, we design and fabricate several active origami components that assemble from flat polymer sheets, including a box, a pyramid, and two origami airplanes. In addition, we directly print a 3D box with active composite hinges and program it to assume a temporary flat shape that subsequently recovers to the 3D box shape on demand.

Inkjet and screen printing for electronic applications

OpenAIRE

Medina Rodríguez, Beatriz

2016-01-01

Printed electronics (PE) is a set of printing methods used to create electrical devices on various substrates. Printing typically uses common printing equipment suitable for defining patterns on material, such as screen printing, flexography, gravure, offset lithography, and inkjet. Electrically functional, electronic or optical inks are deposited on the substrate, creating active or passive devices. PE offers a great advantage when compared to traditional processes or microelectronics du...

Can lip prints provide biologic evidence?

Science.gov (United States)

Sharma, Preeti; Sharma, Neeraj; Wadhwan, Vijay; Aggarwal, Pooja

2016-01-01

Lip prints are unique and can be used in personal identification. Very few studies are available which establish them as biological evidence in the court of law. Thus, the objective of this study was to attempt to isolate DNA and obtain full short tandem repeat (STR) loci of the individual from the lip prints on different surfaces. Twelve lip prints were procured on different surfaces such as tissue paper, cotton cloth, ceramic tile, and glass surface. Latent lip prints were developed using fingerprint black powder. Lipstick-coated lip prints were also collected on the same supporting items. DNA was isolated, quantified, and amplified using Identifiler™ kit to type 15 STR loci. Ample quantity of DNA was extracted from all the lip print impressions and 15 loci were successfully located in seven samples. Fourteen loci were successfully typed in 3 lip impressions while 13 loci were typed in 2 samples. This study emphasizes the relevance of lip prints at the scene of crime. Extraction of DNA followed by typing of STR loci establishes the lip prints as biological evidence too. Tissue papers, napkins, cups, and glasses may have imprints of the suspect's lips. Thus, the full genetic profile is extremely useful for the forensic team.

3D printed e-tongue

Science.gov (United States)

Gaál, Gabriel; da Silva, Tatiana A.; Gaál, Vladimir; Hensel, Rafael C.; Amaral, Lucas R.; Rodrigues, Varlei; Riul, Antonio

2018-05-01

Nowadays, one of the biggest issues addressed to electronic sensor fabrication is the build-up of efficient electrodes as an alternative way to the expensive, complex and multistage processes required by traditional techniques. Printed electronics arises as an interesting alternative to fulfill this task due to the simplicity and speed to stamp electrodes on various surfaces. Within this context, the Fused Deposition Modeling 3D printing is an emerging, cost-effective and alternative technology to fabricate complex structures that potentiates several fields with more creative ideas and new materials for a rapid prototyping of devices. We show here the fabrication of interdigitated electrodes using a standard home-made CoreXY 3D printer using transparent and graphene-based PLA filaments. Macro 3D printed electrodes were easily assembled within 6 minutes with outstanding reproducibility. The electrodes were also functionalized with different nanostructured thin films via dip-coating Layer-by-Layer technique to develop a 3D printed e-tongue setup. As a proof of concept, the printed e-tongue was applied to soil analysis. A control soil sample was enriched with several macro-nutrients to the plants (N, P, K, S, Mg and Ca) and the discrimination was done by electrical impedance spectroscopy of water solution of the soil samples. The data was analyzed by Principal Component Analysis and the 3D printed sensor distinguished clearly all enriched samples despite the complexity of the soil chemical composition. The 3D printed e-tongue successfully used in soil analysis encourages further investments in developing new sensory tools for precision agriculture and other fields exploiting the simplicity and flexibility offered by the 3D printing techniques.

Plasma jet printing for flexible substrates

Energy Technology Data Exchange (ETDEWEB)

Gandhiraman, Ram P.; Singh, Eric; Diaz-Cartagena, Diana C.; Koehne, Jessica; Meyyappan, M. [Center for Nanotechnology, NASA Ames Research Center, Moffett Field, California 94035 (United States); Nordlund, Dennis [Stanford Synchrotron Radiation Lightsource, SLAC National Accelerator Laboratory, Menlo Park, California 94025 (United States)

2016-03-21

Recent interest in flexible electronics and wearable devices has created a demand for fast and highly repeatable printing processes suitable for device manufacturing. Robust printing technology is critical for the integration of sensors and other devices on flexible substrates such as paper and textile. An atmospheric pressure plasma-based printing process has been developed to deposit different types of nanomaterials on flexible substrates. Multiwalled carbon nanotubes were deposited on paper to demonstrate site-selective deposition as well as direct printing without any type of patterning. Plasma-printed nanotubes were compared with non-plasma-printed samples under similar gas flow and other experimental conditions and found to be denser with higher conductivity. The utility of the nanotubes on the paper substrate as a biosensor and chemical sensor was demonstrated by the detection of dopamine, a neurotransmitter, and ammonia, respectively.

COLLABORATION BOARD (CB56) 22/06/07

CERN Multimedia

T. Virdee

Thesis and Industrial Awards (L. Foa) C. Vander Velde has resigned from the Thesis Awards Committee and was thanked for her contributions. A replacement was being sought. A mail announcing the 2007 Award would be circulated to the whole collaboration. The schedule was as usual, with the deadline for nominations September 18th, and would be included in the mail and posted on the web. There was no action planned for Industrial Awards, but Project Managers could make suggestions to D. Campi before the September CMS Week. Contribution Update (L. Foa) The Collaboration Board Advisory Group was progressing well with updating the Constitution, but parts were still incomplete. However, certain parts were needed for the immediate business of the Board, and these had been posted on the Agenda for approval. Section 2.1 had been substantially revised, defining more clearly the roles of the Conference, Publications and Thesis Awards Committee, as well as that of the Authorship Board, how their members were appoint...

Fluorescence detector for capillary separations fabricated by 3D printing

Czech Academy of Sciences Publication Activity Database

Přikryl, Jan; Foret, František

2014-01-01

Roč. 86, č. 24 (2014), s. 11951-11956 ISSN 0003-2700 R&D Projects: GA ČR(CZ) GBP206/12/G014; GA MŠk(CZ) EE2.3.20.0182 Grant - others:GA AV ČR(CZ) M200311201 Institutional support: RVO:68081715 Keywords : 3D print * additive manufacturing * fluorescence * LIF * LED Subject RIV: CB - Analytical Chemistry, Separation Impact factor: 5.636, year: 2014

The endo-rectal probe prototype for the TOPEM project

Energy Technology Data Exchange (ETDEWEB)

Musico, Paolo, E-mail: Paolo.Musico@ge.infn.it

2016-07-11

The TOPEM project was funded by INFN with the aim of studying the design of a TOF-PET system dedicated to prostate imaging. During last year a big effort was put into building the prototype of the endo-rectal probe from all point of view: mechanical, thermal, electrical. A dedicated integrated circuit was adopted to have the minimum dimensions: the TOFPET ASIC. The system is composed by a LYSO pixellated crystal which is seen by a 128 SiPM matrix on both surfaces: this permits Depth Of Interaction (DOI) measurement. The 4 needed ASICs are handled by a FPGA board which transmits the acquired data over an UDP connection. The external container was made using 3-D printing technology: internal channels on the external surface permit the flowing of controlled temperature (≈35 °C) water. Electronic components power is dissipated using an internal air flow kept at lower temperature (≈20 °C). The probe is MR compatible: a dedicated small antenna can be accommodated in the container. This will permit simultaneous imaging in MRI and PET systems.

The NIH 3D Print Exchange: A Public Resource for Bioscientific and Biomedical 3D Prints

OpenAIRE

Coakley, Meghan F.; Hurt, Darrell E.; Weber, Nick; Mtingwa, Makazi; Fincher, Erin C.; Alekseyev, Vsevelod; Chen, David T.; Yun, Alvin; Gizaw, Metasebia; Swan, Jeremy; Yoo, Terry S.; Huyen, Yentram

2014-01-01

The National Institutes of Health (NIH) has launched the NIH 3D Print Exchange, an online portal for discovering and creating bioscientifically relevant 3D models suitable for 3D printing, to provide both researchers and educators with a trusted source to discover accurate and informative models. There are a number of online resources for 3D prints, but there is a paucity of scientific models, and the expertise required to generate and validate such models remains a barrier. The NIH 3D Print ...

Electron beam hardening type copper plate printing ink

International Nuclear Information System (INIS)

Kawamura, Eiji; Inoue, Mitsuo; Kusaki, Satoichiro

1989-01-01

Copper plate printing is the printing method of filling ink in the parts of concave printing elements on a type area, and transferring the ink to a base, and it is the feature that the ink in the printing element parts of a print rises. Copper plate prints show profound feeling, in addition, its effect of preventing forgery is high. This method is generally called engraving printing, and is used frequently for printing various bills and artistic prints. The electron beam irradiation apparatus installed in the laboratory of the Printing Bureau, Ministry of Finance, is an experimental machine of area beam type, and is so constructed as to do batch conveyance and web conveyance. As the ink in printing element parts rises, the offset at the delivery part of a printing machine becomes a problem. Electron beam is superior in its transparency, and can dry instantaneously to the inside of opaque ink. At 200 kV of acceleration voltage, the ink of copper plate prints can be hardened by electron beam irradiation. The dilution monomers as the vehicle for ink were tested for their dilution capability and the effect of electron beam hardening. The problem in the utilization of electron beam is the deterioration of papers, and the counter-measures were tested. (K.I.)

Defense Business Board

Science.gov (United States)

Skip to main content (Press Enter). Toggle navigation Defense Business Board Search Search Defense Business Board: Search Search Defense Business Board: Search Defense Business Board Business Excellence in Defense of the Nation Defense Business Board Home Charter Members Meetings Studies Contact Us The Defense

Miniaturized Printed Inverted-F Antenna for Internet of Things: A Design on PCB with a Meandering Line and Shorting Strip

Directory of Open Access Journals (Sweden)

Cheuk Yin Cheung

2018-01-01

Full Text Available This paper focuses on a printed inverted-F antenna (PIFA with meandering line and meandering shorting strip under 2.4 GHz industrial, scientific, and medical (ISM band for Internet of things (IoT applications. Bluetooth Low Energy (BLE technology is one of potential platforms and technologies for IoT applications under ISM band. Printed circuit board (PCB antenna commonly used in commercial and medical applications because of its small size, low profile, and low cost compared to low temperature cofired ceramic (LTCC technology. The proposed structure of PIFA is implemented on PCB to gain all these advantages. Replacing conventional PCB line in PIFA by the meandering line and meandering shorting strip improves the efficiency of the PIFA as well as the bandwidth. As a case study, design and measurement results of the proposed PIFA are presented.

Demonstration of glass-based photonic interposer for mid-board-optical engines and electrical-optical circuit board (EOCB) integration strategy

Science.gov (United States)

Schröder, H.; Neitz, M.; Schneider-Ramelow, M.

2018-02-01

Due to its optical transparency and superior dielectric properties glass is regarded as a promising candidate for advanced applications as active photonic interposer for mid-board-optics and optical PCB waveguide integration. The concepts for multi-mode and single-mode photonic system integration are discussed and related demonstration project results will be presented. A hybrid integrated photonic glass body interposer with integrated optical lenses for multi-mode data communication wavelength of 850 nm have been realized. The paper summarizes process developments which allow cost efficient metallization of TGV. Electro-optical elements like photodiodes and VCSELs can be directly flip-chip mounted on the glass substrate according to the desired lens positions. Furthermore results for a silicon photonic based single-mode active interposer integration onto a single mode glass made EOCB will be compared in terms of packaging challenges. The board level integration strategy for both of these technological approaches and general next generation board level integration concepts for photonic interposer will be introductorily discussed.

A project for recovering mercury from fluorescent tubes from schools in the Grand Erie District School Board

Energy Technology Data Exchange (ETDEWEB)

NONE

2005-10-15

Mercury is a persistent, toxic substance that poses a serious threat to the environment and human health. Mercury compounds can be carried hundreds of kilometers once airborne and inhaling mercury vapours or ingesting mercury can cause serious injury or death. In Canada, mercury is regularly found in thousands of products such as fluorescent lamps, thermostats, fever thermometers and button batteries, as well as a variety of industrial applications. This report discussed a project that was undertaken by the Recycling Council of Ontario (RCO) that targeted schools, within the Grand Erie District School Board (GEDSB), to pilot a program over a period of 3 months to track, collect and recycle sufficient number of fluorescent tubes. The purpose was to successfully divert 2200 mgs of mercury that may otherwise be destined for landfill. The primary objective of the pilot project was to establish an operating system to collect and recycle fluorescent tube lighting and develop recycling guidelines for the GEDSB that would be transferable to other school districts. The report discussed why fluorescent lamp recycling was needed and outlined the project partners. One recycling partner's recycling process, Fluorescent Lamp Recyclers (FLR) was described. The report also discussed regulations affecting the handling and disposal of fluorescent lamps in Ontario. GEDSB's, RCO's and FLR's responsibilities in the project were outlined. The methodology and florescent lamp collection process were described. The report also presented the collection schedule and results. It was concluded that with very little effort, significant amounts of fluorescent lamps could be diverted, preventing mercury from entering landfills. refs., tabs., figs., appendices.

Customizing digital printing for fine art practice

Science.gov (United States)

Parraman, Carinna E.; Thirkell, Paul; Hoskins, Steve; Wang, Hong Qiang; Laidler, Paul

2005-01-01

The presentation will demonstrate how through alternative methods of digital print production the Centre for Fine Print Research (CFPR) is developing methodologies for digital printing that attempt to move beyond standard reproductive print methods. Profiling is used for input and output hardware, along with bespoke profiling for fine art printmaking papers. Examples of artist's work, and examples from the Perpetual Portfolio are included - an artist in residence scheme for selected artists wanting to work at the Centre and to make a large-format digital print. Colour is an important issue: colour fidelity, colour density on paper, colour that can be achieved through multiple-pass printing. Research is also underway to test colour shortfalls in the current inkjet ink range, and to extend colour through the use of traditional printing inks.

PRINTING TECHNIQUES: RECENT DEVELOPMENTS IN PHARMACEUTICAL TECHNOLOGY.

Science.gov (United States)

Jamroz, Witold; Kurek, Mateusz; Lyszczarz, Ewelina; Brniak, Witold; Jachowicz, Renata

2017-05-01

In the last few years there has been a huge progress in a development of printing techniques and their application in pharmaceutical sciences and particularly in the pharmaceutical technology. The variety of printing methods makes it necessary to systemize them, explain the principles of operation, and specify the possibilities of their use in pharmaceutical technology. This paper aims to review the printing techniques used in a drug development process. The growing interest in 2D and 3D printing methods results in continuously increasing number of scientific papers. Introduction of the first printed drug Spritam@ to the market seems to be a milestone of the 3D printing development. Thus, a particular aim of this review is to show the latest achievements of the researchers in the field of the printing medicines.

Influence of Parameters of a Printing Plate on Photoluminescence of Nanophotonic Printed Elements of Novel Packaging

Directory of Open Access Journals (Sweden)

Olha Sarapulova

2015-01-01

Full Text Available In order to produce nanophotonic elements for smart packaging, we investigated the influence of the parameters of screen and offset gravure printing plates on features of printed application of coatings with nanophotonic components and on parameters of their photoluminescence. To determine the dependence of luminescence intensity on the thickness of solid coating, we carried out the formation of nanophotonic solid surfaces by means of screen printing with different layer thickness on polypropylene film. The obtained analytical dependencies were used to confirm the explanation of the processes that occur during the fabrication of nanophotonic coverings with offset gravure printing plates. As a result of experimental studies, it was determined that the different character of the dependency of total luminescence intensity of nanophotonic elements from the percentage of a pad is explained by the use of different types of offset gravure printing plates, where the size of raster points remains constant in one case and changes in the other case, while the depth of the printing elements accordingly changes or remains constant. To obtain nanophotonic areas with predetermined photoluminescent properties, the influence of investigated factors on changes of photoluminescent properties of nanophotonic printed surfaces should be taken into consideration.

Patients overwhelmingly prefer inpatient boarding to emergency department boarding.

Science.gov (United States)

Viccellio, Peter; Zito, Joseph A; Sayage, Valerie; Chohan, Jasmine; Garra, Gregory; Santora, Carolyn; Singer, Adam J

2013-12-01

Boarding of admitted patients in the emergency department (ED) is a major cause of crowding. One alternative to boarding in the ED, a full-capacity protocol where boarded patients are redeployed to inpatient units, can reduce crowding and improve overall flow. Our aim was to compare patient satisfaction with boarding in the ED vs. inpatient hallways. We performed a structured telephone survey regarding patient experiences and preferences for boarding among admitted ED patients who experienced boarding in the ED hallway and then were subsequently transferred to inpatient hallways. Demographic and clinical characteristics, as well as patient preferences, including items related to patient comfort and safety using a 5-point scale, were recorded and descriptive statistics were used to summarize the data. Of 110 patients contacted, 105 consented to participate. Mean age was 57 ± 16 years and 52% were female. All patients were initially boarded in the ED in a hallway before their transfer to an inpatient hallway bed. The overall preferred location after admission was the inpatient hallway in 85% (95% confidence interval 75-90) of respondents. In comparing ED vs. inpatient hallway boarding, the following percentages of respondents preferred inpatient boarding with regard to the following 8 items: rest, 85%; safety, 83%; confidentiality, 82%; treatment, 78%; comfort, 79%; quiet, 84%; staff availability, 84%; and privacy, 84%. For no item was there a preference for boarding in the ED. Patients overwhelmingly preferred the inpatient hallway rather than the ED hallway when admitted to the hospital. Copyright © 2013 Elsevier Inc. All rights reserved.

Printed Nano Cu and NiSi Contacts and Metallization for Solar Cell Modules

Energy Technology Data Exchange (ETDEWEB)

Carmody, Michael John [Intrinsiq Materials Inc., Rochester, NY (United States)

2017-10-11

resistivity, and that proved to five to ten times less conductive than the commercial silver grids. Even so, the NiSi layer was a very good barrier to copper migration, even under harsh environmental conditions. Additionally, both plated copper and printed copper could be soldered to. While it may be possible to produce an all printed copper/nickel silicide top electrode for silicon cells, it was not easily demonstrated within the time and monetary constraints of the present project. Additionally, potential customers have told us that having to laser ablate the anti-reflection coating of cells to create a connection for NiSi, and the addition of two printing and annealing (sintering for copper) steps, adds too much expense to compensate for any potential cost savings from using copper. The cost benefits of copper have been further eroded by the facts that over the lifetime of this project, the cost of silver electrodes decreased due to manufacturers finding ways to use less and less silver, and inventing pastes which use less costly silver materials to begin with. All of these factors were considered and led to the decision to stop the program before actual manufacturing scale was attempted.

3D-printed Bioanalytical Devices

Science.gov (United States)

Bishop, Gregory W; Satterwhite-Warden, Jennifer E; Kadimisetty, Karteek; Rusling, James F

2016-01-01

While 3D printing technologies first appeared in the 1980s, prohibitive costs, limited materials, and the relatively small number of commercially available printers confined applications mainly to prototyping for manufacturing purposes. As technologies, printer cost, materials, and accessibility continue to improve, 3D printing has found widespread implementation in research and development in many disciplines due to ease-of-use and relatively fast design-to-object workflow. Several 3D printing techniques have been used to prepare devices such as milli- and microfluidic flow cells for analyses of cells and biomolecules as well as interfaces that enable bioanalytical measurements using cellphones. This review focuses on preparation and applications of 3D-printed bioanalytical devices. PMID:27250897

Printing and civilization; Insatsu to bunmei

Energy Technology Data Exchange (ETDEWEB)

Takahashi, T. [Dainippon Ink and Chemicals Inc., Tokyo (Japan)

1995-01-01

It can be said that the printing has not been only a barometer of culture, but also has formed a foundation of culture as the facilities of civilization, and has shouldered a role to drag the culture. In modern nation, that the freedom of speech and press has been clearly pointed out as the fundamental human right, shows straightforwardly an important significance of such a printing. Though it is also statistically clear that there is an exact relation between GNP and printed materials per capita, in this paper centering around the examples in Japan, a relation between the printing and civilization/culture is introduced like the episodes. It does not yet become definite that what kind of influence a proposition so called `printing is a barometer of culture` is affected by the information/communication revolution which is regarded to be advanced very rapidly. However, speaking conclusively it can not be thought that a demand for the printing which can produce the information in a great deal of quantity with a low cost, and for the printing which does not need special output terminal and is excellent in portability and glance ability, may largely be reduced. 1 fig.

Natural fibre composites for 3D Printing

OpenAIRE

Pandey, Kapil

2015-01-01

3D printing has been common option for prototyping. Not all the materials are suitable for 3D printing. Various studies have been done and still many are ongoing regarding the suitability of the materials for 3D printing. This thesis work discloses the possibility of 3D printing of certain polymer composite materials. The main objective of this thesis work was to study the possibility for 3D printing the polymer composite material composed of natural fibre composite and various different ...

Customizable pre-printed consent forms: a solution in light of the Montgomery ruling.

Science.gov (United States)

Owen, Deborah; Aresti, Nick; Mulligan, Alex; Kosuge, Dennis

2018-02-02

This article presents an audit cycle supported quality improvement project addressing best practice in the consent process for lower limb arthroplasty which takes into account the new standard in surgical consent and the importance of material risks. 50 consecutive total hip and total knee replacement consent forms over a 3-month period were reviewed for legibility and completeness. Following the introduction of a new, pre-printed but customizable consent form the review process was repeated. The introduction of a customizable, pre-printed consent form that can be adjusted to reflect the individualized material risks of each patient increased legibility, reduced inappropriate human error variation and abolished the use of abbreviations and medical jargon. When used as part of an extended consent process, the authors feel that the use of pre-printed but customizable consent forms improves legibility, completeness and consistency and also provides the ability to highlight those complications that are of particular importance for that patient to satisfy the new accepted standard in surgical consent.

Active materials by four-dimension printing

Science.gov (United States)

Ge, Qi; Qi, H. Jerry; Dunn, Martin L.

2013-09-01

We advance a paradigm of printed active composite materials realized by directly printing glassy shape memory polymer fibers in an elastomeric matrix. We imbue the active composites with intelligence via a programmed lamina and laminate architecture and a subsequent thermomechanical training process. The initial configuration is created by three-dimension (3D) printing, and then the programmed action of the shape memory fibers creates time dependence of the configuration—the four-dimension (4D) aspect. We design and print laminates in thin plate form that can be thermomechanically programmed to assume complex three-dimensional configurations including bent, coiled, and twisted strips, folded shapes, and complex contoured shapes with nonuniform, spatially varying curvature. The original flat plate shape can be recovered by heating the material again. We also show how the printed active composites can be directly integrated with other printed functionalities to create devices; here we demonstrate this by creating a structure that can assemble itself.

Printing versus coating - What will be the future production technology for printed electronics?

Energy Technology Data Exchange (ETDEWEB)

Glawe, Andrea; Eggerath, Daniel; Schäfer, Frank [KROENERT GmbH and Co KG, Schuetzenstrasse 105, 22761 Hamburg (Germany)

2015-02-17

The market of Large Area Organic Printed Electronics is developing rapidly to increase efficiency and quality as well as to lower costs further. Applications for OPV, OLED, RFID and compact Printed Electronic systems are increasing. In order to make the final products more affordable, but at the same time highly accurate, Roll to Roll (R2R) production on flexible transparent polymer substrates is the way forward. There are numerous printing and coating technologies suitable depending on the design, the product application and the chemical process technology. Mainly the product design (size, pattern, repeatability) defines the application technology.