WorldWideScience

Sample records for wired circuit board

  1. Primer printed circuit boards

    CERN Document Server

    Argyle, Andrew

    2009-01-01

    Step-by-step instructions for making your own PCBs at home. Making your own printed circuit board (PCB) might seem a daunting task, but once you master the steps, it's easy to attain professional-looking results. Printed circuit boards, which connect chips and other components, are what make almost all modern electronic devices possible. PCBs are made from sheets of fiberglass clad with copper, usually in multiplelayers. Cut a computer motherboard in two, for instance, and you'll often see five or more differently patterned layers. Making boards at home is relatively easy

  2. Sustainability issues in circuit board recycling

    DEFF Research Database (Denmark)

    Legarth, Jens Brøbech; Alting, Leo; Baldo, Gian Luca

    1995-01-01

    The resource recovery and environmental impact issues of printed circuit board recycling by secondary copper smelters are discussed. Guidelines concerning material selection for circuit board manufacture and concerning the recycling processes are given to enhance recovery efficiency and to lower...

  3. Digital circuit boards mach 1 GHz

    CERN Document Server

    Morrison, Ralph

    2012-01-01

    A unique, practical approach to the design of high-speed digital circuit boards The demand for ever-faster digital circuit designs is beginning to render the circuit theory used by engineers ineffective. Digital Circuit Boards presents an alternative to the circuit theory approach, emphasizing energy flow rather than just signal interconnection to explain logic circuit behavior. The book shows how treating design in terms of transmission lines will ensure that the logic will function, addressing both storage and movement of electrical energy on these lines. It cove

  4. Flexible printed circuit board actuators

    Science.gov (United States)

    Lee, Junseok; Cha, Youngsu

    2017-12-01

    Out-of-plane actuators are made possible by the breaking of planar symmetry. In this paper, we present a thin-film out-of-plane electrostatic actuator for a flexible printed circuit board (FPCB) that can be fabricated with a single step of the conventional manufacturing process. No other components are required for actuation except a single sheet of the FPCB, and it works based on the planar asymmetry resulting from asymmetrically patterned top and bottom electrodes on each side of the polyimide film. With the structural asymmetry, the application of a high voltage in the order of kilovolts results in the asymmetry of the electric fields and the body force density, which generates the bending moment that leads to macroscopic deformations. We applied the finite element method to examine the asymmetry induced by the difference in the electrodes. In the experiment, the displacement responses to step input and square wave input of various frequencies were analyzed. It was found that our actuator constitutes an underdamped system, exhibiting resonance characteristics. The maximum oscillatory amplitude was determined at resonance, and the relationship between the displacement and the applied voltage was investigated.

  5. A guide to printed circuit board design

    CERN Document Server

    Hamilton, Charles

    1984-01-01

    A Guide to Printed Circuit Board Design discusses the basic design principles of printed circuit board (PCB). The book consists of nine chapters; each chapter provides both text discussion and illustration relevant to the topic being discussed. Chapter 1 talks about understanding the circuit diagram, and Chapter 2 covers how to compile component information file. Chapter 3 deals with the design layout, while Chapter 4 talks about preparing the master artworks. The book also covers generating computer aided design (CAD) master patterns, and then discusses how to prepare the production drawing a

  6. Printed Wiring Board Cleaner Technologies Substitutes Assessment: Making Holes Conductive

    Science.gov (United States)

    This document presents comparative risk, competitiveness, and resource requirements on technologies for performing the “making holes conductive” function during printed wiring board manufacturing.

  7. Improving Heat Transfer Performance of Printed Circuit Boards

    Science.gov (United States)

    Schatzel, Donald V.

    2009-01-01

    This paper will explore the ability of printed circuit boards laminated with a Carbon Core Laminate to transfer heat vs. standard printed circuit boards that use only thick layers of copper. The paper will compare the differences in heat transfer performance of printed circuit boards with and without CCL.

  8. Implementing Cleaner Printed Wiring Board Technologies: Surface Finishes

    Science.gov (United States)

    This document describes the problems, solutions, and time and effort involved in implementing alternative surface finish technologies, and this guide is produced as part of the DfE Printed Wiring Board Project

  9. CAD-CAM printed circuit board design

    Science.gov (United States)

    Agy, W. E.

    A step-by-step procedure for a printed circuit design achieved by CAD is presented. The operator at the interactive CRT station moves a stylus across a graphics tablet and intersperses commands which result in computer-generated pictorial forms on the screen that were drawn on the pad. Standard symbols are used for commands allowing, for instance, connections to be made of specific types in certain locations, which can be automatically edited from a materials list. An entire network of drawn lines can be referenced by a signal name for recall, and a finished circuit schematic can be checked for designs rules compliance, including fault reporting in terms of designator/pin number. A map may be present delineating the boundaries of the circuitry area, and previously completed circuitry segments can be recalled for piece-by-piece assembly of the circuit board.

  10. Recycling of electronic waste: Printed wiring boards

    Science.gov (United States)

    Luyima, Alex

    Pyrolysis and leaching are the dominant techniques applied in the recycling of waste printed wiring boards (PWBs). Waste PWB pyrolysis is a highly polluting technology and produces brominated pyrolysis oils in addition to hydrogen bromide (HBr) gas. Moreover, leaching as a treatment process of waste PWBs is not well investigated. In this work, the pyrolysis of waste PWBs has been studied with the aim of reducing the amount of brominated oils and HBr gas evolved. The effects of powder inorganic chemicals (CaO, CaCO3, Fe 2O3, Al2O3, Y-Zeolite, and ZSM-5) additions on the pyrolysis of waste PWBs has been studied through experiments using a thermogravimetric-differential thermal analyzer connected to a mass spectrometer (TG-DTA-MS) and in a tube furnace at 900 °C. It has been shown that the kinetic models by Friedman, Flynn-Wall-Ozawa, and Kissinger are applicable to waste PWB pyrolysis at temperatures below 400 °C. Moreover, CaO, CaCO3, Fe2O3, Y-Zeolite, and ZSM-5 show a potential to reduce the amount of HBr gas evolved during pyrolysis in TG-DTA-MS. However, in the tube furnace pyrolysis experiments, CaO and CaCO3 were found to be the most effective chemical additions, with more than 90% reduction in total bromine (HBr and other brominated gases) evolved. It has also been demonstrated that the sequential leaching of waste PWBs with hydrochloric acid, nitric acid and aqua regia is capable of selective recovery of base and precious metals contained in waste PWBs.

  11. 49 CFR 236.723 - Circuit, double wire; line.

    Science.gov (United States)

    2010-10-01

    ... 49 Transportation 4 2010-10-01 2010-10-01 false Circuit, double wire; line. 236.723 Section 236.723 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL RAILROAD ADMINISTRATION, DEPARTMENT OF TRANSPORTATION RULES, STANDARDS, AND INSTRUCTIONS GOVERNING THE INSTALLATION...

  12. Developing 300°C Ceramic Circuit Boards

    Energy Technology Data Exchange (ETDEWEB)

    Normann, Randy A

    2015-02-15

    This paper covers the development of a geothermal ceramic circuit board technology using 3D traces in a machinable ceramic. Test results showing the circuit board to be operational to at least 550°C. Discussion on producing this type of board is outlined along with areas needing improvement.

  13. 46 CFR 169.673 - Installation of wiring for power and lighting circuits.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 7 2010-10-01 2010-10-01 false Installation of wiring for power and lighting circuits... of Less Than 50 Volts on Vessels of Less Than 100 Gross Tons § 169.673 Installation of wiring for power and lighting circuits. (a) Wiring must be run as high as practicable above the bilges. (b) Wiring...

  14. 46 CFR 169.672 - Wiring for power and lighting circuits.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 7 2010-10-01 2010-10-01 false Wiring for power and lighting circuits. 169.672 Section... Volts on Vessels of Less Than 100 Gross Tons § 169.672 Wiring for power and lighting circuits. (a) Wiring for power and lighting circuits must have copper conductors, of 14 AWG or larger, and— (1) Meet...

  15. Sampling and Control Circuit Board for an Inertial Measurement Unit

    Science.gov (United States)

    Chelmins, David T (Inventor); Powis, Richard T., Jr. (Inventor); Sands, Obed (Inventor)

    2016-01-01

    A circuit board that serves as a control and sampling interface to an inertial measurement unit ("IMU") is provided. The circuit board is also configured to interface with a local oscillator and an external trigger pulse. The circuit board is further configured to receive the external trigger pulse from an external source that time aligns the local oscillator and initiates sampling of the inertial measurement device for data at precise time intervals based on pulses from the local oscillator. The sampled data may be synchronized by the circuit board with other sensors of a navigation system via the trigger pulse.

  16. Two-light circuit continuously monitors ac ground, phase, and neutral wires

    Science.gov (United States)

    Mee, R. W.

    1966-01-01

    Two-transformer, two-lamp circuit monitors the continuity of ac ground, neutral, and phase wires. The circuit gives different visual indications if any one of the three lines should become open circuited.

  17. AIR EMISSIONS FROM LASER DRILLING OF PRINTED WIRING BOARD MATERIALS

    Science.gov (United States)

    The paper gives results of a study to characterize gases generated during laser drilling of printed wiring board (PWB) material and identifies the pollutants and generation rates found during the drilling process. Typically found in the missions stream were trace amounts of carbo...

  18. 46 CFR 169.679 - Wiring for power and lighting circuits.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 7 2010-10-01 2010-10-01 false Wiring for power and lighting circuits. 169.679 Section 169.679 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) NAUTICAL SCHOOLS SAILING... More on Vessels of Less Than 100 Gross Tons § 169.679 Wiring for power and lighting circuits. Wiring...

  19. 46 CFR 169.680 - Installation of wiring for power and lighting circuits.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 7 2010-10-01 2010-10-01 false Installation of wiring for power and lighting circuits... of 50 Volts Or More on Vessels of Less Than 100 Gross Tons § 169.680 Installation of wiring for power and lighting circuits. (a) Wiring must be run as high as practicable above the bilges. (b) Each cable...

  20. Gold recovery from printed wiring board using bioleaching

    Energy Technology Data Exchange (ETDEWEB)

    Kita, Y. [Faculty of Engineering, Osaka Univ. (Japan); Nishikawa, H. [Center for Advanced Science and Innovation, Osaka Univ. (Japan); Takemoto, T. [Joining and Welding Research Inst., Osaka Univ. (Japan)

    2004-07-01

    In the electronic assembly, gold is frequently used as surface plating and a bonding wire. To recover gold from waste electronics, the dissolution process using cyan is a popular method, however, the solution is highly toxic. Accordingly, the environmentally conscious substitute process is preferable. In this study the possibility of Au dissolution from printed wiring boards using bioleaching has been investigated. Chromobacterium violaceum having ability of cyanide formation was used to dissolve Au. The printed wiring boards with gold plating of 0.07nm in thickness were immersed in synthetic medium with C. violaceum. After immersion test for 480h, the gold plating was completely dissolved. The increase in cyanide concentration gave little effect on the enhancement of dissolution of gold, however, the dissolution rate of Au was increased with increasing of dissolved oxygen in the medium. Chromobacterium violaceum produced 0.8mmol/l cyanide but it also decomposed about 60% of cyanide generated, therefore, this dissolution process could be used as an environmentally conscious method. (orig.)

  1. Virtual Instrument Systems in Reality (VISIR) for Remote Wiring and Measurement of Electronic Circuits on Breadboard

    Science.gov (United States)

    Tawfik, M.; Sancristobal, E.; Martin, S.; Gil, R.; Diaz, G.; Colmenar, A.; Peire, J.; Castro, M.; Nilsson, K.; Zackrisson, J.; Hakansson, L.; Gustavsson, I.

    2013-01-01

    This paper reports on a state-of-the-art remote laboratory project called Virtual Instrument Systems in Reality (VISIR). VISIR allows wiring and measuring of electronic circuits remotely on a virtual workbench that replicates physical circuit breadboards. The wiring mechanism is developed by means of a relay switching matrix connected to a PCI…

  2. Development and verification of printed circuit board toroidal transformer model

    DEFF Research Database (Denmark)

    Pejtersen, Jens; Mønster, Jakob Døllner; Knott, Arnold

    2013-01-01

    by comparing calculated parameters with 3D finite element simulations and experimental measurement results. The developed transformer model shows good agreement with the simulated and measured results. The model can be used to predict the parameters of printed circuit board toroidal transformer configurations......An analytical model of an air core printed circuit board embedded toroidal transformer configuration is presented. The transformer has been developed for galvanic isolation of very high frequency switch-mode dc-dc power converter applications. The theoretical model is developed and verified...

  3. Generation of printed circuit board layout and artwork | Debretsion ...

    African Journals Online (AJOL)

    Printed circuit board (PCB) design plays an important role on equipment performance and reliability. Constraint imposed on PCB size under severe environmental condition is focused. Guidelines for layout planning, its speedy execution, component· placements, and future growth/modifications have been addressed.

  4. Printed Circuit Board Integrated Toroidal Radio Frequency Inductors

    DEFF Research Database (Denmark)

    Kamby, Peter; Knott, Arnold; Andersen, Michael A. E.

    2012-01-01

    implemented as solenoids, either in spiral or cylindrical form. Those have the disadvantage of excessive stray fields, which can cause losses and disturbances in adjacent circuitry. Therefore this paper presents the analysis, design and realization of a printed circuit board (PCB) integrated inductor under...

  5. Printed circuit board permittivity measurement using waveguide and resonator rings

    NARCIS (Netherlands)

    Op 't Land, Sjoerd; Tereshchenko, O.V.; Ramdani, Mohamed; Leferink, Frank Bernardus Johannes; Perdriau, Richard

    2014-01-01

    Knowing the frequency dependent complex permittivity of Printed Circuit Board (PCB) substrates is important in modern electronics. In this paper, two methods for measuring the permittivity are applied to the same Flame Resistant (FR4) substrate and the results are compared. The reference measurement

  6. Transient Analysis of Lumped Circuit Networks Loaded Thin Wires By DGTD Method

    KAUST Repository

    Li, Ping

    2016-03-31

    With the purpose of avoiding very fine mesh cells in the proximity of a thin wire, the modified telegrapher’s equations (MTEs) are employed to describe the thin wire voltage and current distributions, which consequently results in reduced number of unknowns and augmented Courant-Friedrichs-Lewy (CFL) number. As hyperbolic systems, both the MTEs and the Maxwell’s equations are solved by the discontinuous Galerkin time-domain (DGTD) method. In realistic situations, the thin wires could be either driven or loaded by circuit networks. The thin wire-circuit interface performs as a boundary condition for the thin wire solver, where the thin wire voltage and current used for the incoming flux evaluation involved in the DGTD analyzed MTEs are not available. To obtain this voltage and current, an auxiliary current flowing through the thin wire-circuit interface is introduced at each interface. Corresponding auxiliary equations derived from the invariable property of characteristic variable for hyperbolic systems are developed and solved together with the circuit equations established by the modified nodal analysis (MNA) modality. Furthermore, in order to characterize the field and thin wire interactions, a weighted electric field and a volume current density are added into the MTEs and Maxwell-Ampere’s law equation, respectively. To validate the proposed algorithm, three representative examples are presented.

  7. Field analysis and enhancement of multi-pole magnetic components fabricated on printed circuit board

    International Nuclear Information System (INIS)

    Chiu, K.-C.; Chen, C.-S.

    2007-01-01

    A multi-pole magnetic component magnetized with a fine magnetic pole pitch of less than 1 mm is very difficult to achieve by using traditional methods. Moreover, it requires a precise mechanical process and a complicated magnetization system. Different fine magnetic pole pitches of 300, 350 and 400 μm have been accomplished on 9-pole magnetic components through the printed circuit board (PCB) manufacturing technology. Additionally, another fine magnetic pole pitch of 500 μm was also fabricated on a dual-layered (DL) wire circuit structure to investigate the field enhancement. After measurements, a gain factor of 1.37 was obtained in the field strength. The field variations among different magnetic pole pitches were analyzed in this paper

  8. WASTE PRINTED CIRCUIT BOARDS SEPARATION IN ELECTROSTATIC SEPARATOR

    Directory of Open Access Journals (Sweden)

    Branimir Fuk

    2012-12-01

    Full Text Available Printed circuit boards from electronic waste are very important source of precious metals by recycling. The biggest challenge is liberation and separation of useful components; thin film which contains copper, zinc, tin, lead and precious metals like silver, gold and palladium from non useful components; polymers, ceramics and glass fibbers. The paper presents results for separation of shredded printed circuit boards from TV sets in electrostatic separator. Testing where conducted with material class 2/1 and 1/0.5 mm in laboratory on equipment for mineral processing. Results showed influence from independent variable; separation knife gradient, drum rotation speed and voltage on concentrate quality and recovery (the paper is published in Croatian.

  9. Improving intrinsic corrosion reliability of printed circuit board assembly

    DEFF Research Database (Denmark)

    Ambat, Rajan; Conseil, Helene

    2016-01-01

    conditions, therefore the protection of electronic devices is becoming a critical factor in system design. Humidity and local condensation inside electronic enclosures can significantly alter the performance of electronic devices. The presence of moisture in a PCB alters its quality, functionality, thermal...... performance, and thermo-mechanical properties, while condensation on the surface of printed circuit board assemblies (PCBAs) can lead to electrical failures, like electrochemical migration. The result is reduced life span for electronic products and heavy economic loss due to failures....

  10. Ruggedizing Printed Circuit Boards Using a Wideband Dynamic Absorber

    Directory of Open Access Journals (Sweden)

    V.C. Ho

    2003-01-01

    Full Text Available The existing approaches to ruggedizing inherently fragile and sensitive critical components of electronic equipment such as printed circuit boards (PCB for use in hostile industrial and military environment are either insufficient or expensive. This paper addresses a novel approach towards ruggedizing commercial-off-the-shelf PCBs using a miniature wideband dynamic absorber. The optimisation technique used relies on the experimentally measured vibration spectra and complex receptance of the original PCB.

  11. DC Arc Plasma Disposal of Printed Circuit Board

    Science.gov (United States)

    Huang, Jianjun; Shi, Jiabiao; Meng, Yuedong; Liu, Zhengzhi

    2004-08-01

    A new solid waste disposal technology setup with DC arc plasma is presented. Being different from conventional combustion or burning such as incineration, it is based on a process called controlled high-temperature pyrolysis, the thermal destruction and recovery process. The results of vitrification of the circuit board is presented. The properties of vitrified product including hardness and leaching test results are presented. The final product (vitrified material) and air emission from the plasma treatment is environmentally acceptable.

  12. THERMO-MECHANICALLY PROCESSED ROLLED WIRE FOR HIGH-STRENGTH ON-BOARD WIRE

    Directory of Open Access Journals (Sweden)

    V. A. Lutsenko

    2011-01-01

    Full Text Available It is shown that at twisting of wire of diameter 1,83 mm, produced by direct wire drawing of thermomechanically processed rolled wire of diameter 5,5 mm of steel 90, metal stratification is completely eliminated at decrease of carbon, manganese and an additional alloying of chrome.

  13. Mass analysis of the components separated from printed circuit boards

    Directory of Open Access Journals (Sweden)

    Hana Charvátová

    2010-06-01

    Full Text Available Methods of effective and ecological recycling of printed circuit boards (PCBs are searched all over the world at this time.The material composition and temperature properties of PCB are necessary to be known for an optimal recycling technology. For thispurpose we analyzed weight ratio of the electronic components moulded on the selected kinds of PCBs and next we formulatedmathematic model of temperature field in PCB during a grinding process in that the metal layers are separated from the plasticelements. We present the obtained results in this paper.

  14. Leaching studies for metals recovery from printed circuit boards scrap

    OpenAIRE

    Oliveira, Paula C.; Cabral, Marta; Taborda, F. Charters; Margarido, F.; Nogueira, C. A.

    2009-01-01

    In this paper, the leaching behavior of the major metals present in printed circuit boards waste is evaluated, aiming at its recycling by hydrometallurgy. Several leachants were compared (sulfuric, hydrochloric and nitric acids, at 2 M H+ concentration), at temperatures of 25ºC and 90ºC and 4 hours of reaction time. Sulfuric acid leaching was not very promising concerning metals dissolution being only effective for iron. Hydrochloric acid allowed the leaching up to 60% of tin and about 50% of...

  15. Recycling of WEEE: Characterization of spent printed circuit boards from mobile phones and computers

    International Nuclear Information System (INIS)

    Yamane, Luciana Harue; Tavares de Moraes, Viviane; Crocce Romano Espinosa, Denise; Soares Tenorio, Jorge Alberto

    2011-01-01

    Highlights: → This paper presents new and important data on characterization of wastes of electric and electronic equipments. → Copper concentration is increasing in mobile phones and remaining constant in personal computers. → Printed circuit boards from mobile phones and computers would not be mixed prior treatment. - Abstract: This paper presents a comparison between printed circuit boards from computers and mobile phones. Since printed circuits boards are becoming more complex and smaller, the amount of materials is constantly changing. The main objective of this work was to characterize spent printed circuit boards from computers and mobile phones applying mineral processing technique to separate the metal, ceramic, and polymer fractions. The processing was performed by comminution in a hammer mill, followed by particle size analysis, and by magnetic and electrostatic separation. Aqua regia leaching, loss-on-ignition and chemical analysis (inductively coupled plasma atomic emission spectroscopy - ICP-OES) were carried out to determine the composition of printed circuit boards and the metal rich fraction. The composition of the studied mobile phones printed circuit boards (PCB-MP) was 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers; and of the printed circuit boards from studied personal computers (PCB-PC) was 45 wt.% metals; 27 wt.% polymers and ceramics 28 wt.% ceramics. The chemical analysis showed that copper concentration in printed circuit boards from personal computers was 20 wt.% and in printed circuit boards from mobile phones was 34.5 wt.%. According to the characteristics of each type of printed circuit board, the recovery of precious metals may be the main goal of the recycling process of printed circuit boards from personal computers and the recovery of copper should be the main goal of the recycling process of printed circuit boards from mobile phones. Hence, these printed circuit boards would not be mixed prior treatment. The results

  16. Design principles and realization of electro-optical circuit boards

    Science.gov (United States)

    Betschon, Felix; Lamprecht, Tobias; Halter, Markus; Beyer, Stefan; Peterson, Harry

    2013-02-01

    The manufacturing of electro-optical circuit boards (EOCB) is based to a large extent on established technologies. First products with embedded polymer waveguides are currently produced in series. The range of applications within the sensor and data communication markets is growing with the increasing maturity level. EOCBs require design flows, processes and techniques similar to existing printed circuit board (PCB) manufacturing and appropriate for optical signal transmission. A key aspect is the precise and automated assembly of active and passive optical components to the optical waveguides which has to be supported by the technology. The design flow is described after a short introduction into the build-up of EOCBs and the motivation for the usage of this technology within the different application fields. Basis for the design of EOCBs are the required optical signal transmission properties. Thereafter, the devices for the electro-optical conversion are chosen and the optical coupling approach is defined. Then, the planar optical elements (waveguides, splitters, couplers) are designed and simulated. This phase already requires co-design of the optical and electrical domain using novel design flows. The actual integration of an optical system into a PCB is shown in the last part. The optical layer is thereby laminated to the purely electrical PCB using a conventional PCB-lamination process to form the EOCB. The precise alignment of the various electrical and optical layers is thereby essential. Electrical vias are then generated, penetrating also the optical layer, to connect the individual electrical layers. Finally, the board has to be tested electrically and optically.

  17. Recycling of WEEE: characterization of spent printed circuit boards from mobile phones and computers.

    Science.gov (United States)

    Yamane, Luciana Harue; de Moraes, Viviane Tavares; Espinosa, Denise Crocce Romano; Tenório, Jorge Alberto Soares

    2011-12-01

    This paper presents a comparison between printed circuit boards from computers and mobile phones. Since printed circuits boards are becoming more complex and smaller, the amount of materials is constantly changing. The main objective of this work was to characterize spent printed circuit boards from computers and mobile phones applying mineral processing technique to separate the metal, ceramic, and polymer fractions. The processing was performed by comminution in a hammer mill, followed by particle size analysis, and by magnetic and electrostatic separation. Aqua regia leaching, loss-on-ignition and chemical analysis (inductively coupled plasma atomic emission spectroscopy - ICP-OES) were carried out to determine the composition of printed circuit boards and the metal rich fraction. The composition of the studied mobile phones printed circuit boards (PCB-MP) was 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers; and of the printed circuit boards from studied personal computers (PCB-PC) was 45 wt.% metals; 27 wt.% polymers and ceramics 28 wt.% ceramics. The chemical analysis showed that copper concentration in printed circuit boards from personal computers was 20 wt.% and in printed circuit boards from mobile phones was 34.5 wt.%. According to the characteristics of each type of printed circuit board, the recovery of precious metals may be the main goal of the recycling process of printed circuit boards from personal computers and the recovery of copper should be the main goal of the recycling process of printed circuit boards from mobile phones. Hence, these printed circuit boards would not be mixed prior treatment. The results of this paper show that copper concentration is increasing in mobile phones and remaining constant in personal computers. Copyright © 2011 Elsevier Ltd. All rights reserved.

  18. Inter-progenitor pool wiring: An evolutionarily conserved strategy that expands neural circuit diversity.

    Science.gov (United States)

    Suzuki, Takumi; Sato, Makoto

    2017-11-15

    Diversification of neuronal types is key to establishing functional variations in neural circuits. The first critical step to generate neuronal diversity is to organize the compartmental domains of developing brains into spatially distinct neural progenitor pools. Neural progenitors in each pool then generate a unique set of diverse neurons through specific spatiotemporal specification processes. In this review article, we focus on an additional mechanism, 'inter-progenitor pool wiring', that further expands the diversity of neural circuits. After diverse types of neurons are generated in one progenitor pool, a fraction of these neurons start migrating toward a remote brain region containing neurons that originate from another progenitor pool. Finally, neurons of different origins are intermingled and eventually form complex but precise neural circuits. The developing cerebral cortex of mammalian brains is one of the best examples of inter-progenitor pool wiring. However, Drosophila visual system development has revealed similar mechanisms in invertebrate brains, suggesting that inter-progenitor pool wiring is an evolutionarily conserved strategy that expands neural circuit diversity. Here, we will discuss how inter-progenitor pool wiring is accomplished in mammalian and fly brain systems. Copyright © 2017 Elsevier Inc. All rights reserved.

  19. Durability evaluation method for contact component interconnections in printed circuit boards under thermal loads

    Science.gov (United States)

    Azin, Anton; Zhukov, Andrey A.; Ponomarev, Sergey A.; Ponomarev, Sergey V.

    2017-11-01

    In designing sophisticated printed circuit boards, required evaluation of the product life cycle is relevant in terms of presumably applied load conditions during operation. The paper describes the durability evaluation method of printed circuit board components with contact output such as ball grid array (BGA) and pitch grid array (PGA) under thermal loads. Experiment data and numerical simulation results of soldered connections have been obtained. This method is demonstrated by a practical application example-evaluating of printed circuit board durability under cyclic thermal loads. The application of proposed method for printed circuit boards would make it possible to predict the service life of these designed products.

  20. Evaluating waste printed circuit boards recycling: Opportunities and challenges, a mini review.

    Science.gov (United States)

    Awasthi, Abhishek Kumar; Zlamparet, Gabriel Ionut; Zeng, Xianlai; Li, Jinhui

    2017-04-01

    Rapid generation of waste printed circuit boards has become a very serious issue worldwide. Numerous techniques have been developed in the last decade to resolve the pollution from waste printed circuit boards, and also recover valuable metals from the waste printed circuit boards stream on a large-scale. However, these techniques have their own certain specific drawbacks that need to be rectified properly. In this review article, these recycling technologies are evaluated based on a strength, weaknesses, opportunities and threats analysis. Furthermore, it is warranted that, the substantial research is required to improve the current technologies for waste printed circuit boards recycling in the outlook of large-scale applications.

  1. USB-driven microfluidic chips on printed circuit boards.

    Science.gov (United States)

    Li, Jiang; Wang, Yixuan; Dong, Enkai; Chen, Haosheng

    2014-03-07

    A technology is presented to fabricate a microfluidic chip in which the microchannels and the microelectrodes of sensors are integrated directly into the copper sheet on a printed circuit board. Then, we demonstrate an application of the generation of oil-in-water and water-in-oil emulsion droplets on this microfluidic chip driven by a USB interface, and the droplet size is detected by the microelectrodes on the downstream microchannel. The integration of the microfluidic chip is improved by the direct connection of the channels to the microelectrodes of the driving unit and of the sensors on the same substrate, and it is a promising way to integrate microfluidics into a more complex micro electrical-mechanical system (MEMS).

  2. Experimentally verified inductance extraction and parameter study for superconductive integrated circuit wires crossing ground plane holes

    International Nuclear Information System (INIS)

    Fourie, Coenrad J; Wetzstein, Olaf; Kunert, Juergen; Meyer, Hans-Georg; Toepfer, Hannes

    2013-01-01

    As the complexity of rapid single flux quantum (RSFQ) circuits increases, both current and power consumption of the circuits become important design criteria. Various new concepts such as inductive biasing for energy efficient RSFQ circuits and inductively coupled RSFQ cells for current recycling have been proposed to overcome increasingly severe design problems. Both of these techniques use ground plane holes to increase the inductance or coupling factor of superconducting integrated circuit wires. New design tools are consequently required to handle the new topographies. One important issue in such circuit design is the accurate calculation of networks of inductances even in the presence of finite holes in the ground plane. We show how a fast network extraction method using InductEx, which is a pre- and post-processor for the magnetoquasistatic field solver FastHenry, is used to calculate the inductances of a set of SQUIDs (superconducting quantum interference devices) with ground plane holes of different sizes. The results are compared to measurements of physical structures fabricated with the IPHT Jena 1 kA cm −2 RSFQ niobium process to verify accuracy. We then do a parameter study and derive empirical equations for fast and useful estimation of the inductance of wires surrounded by ground plane holes. We also investigate practical circuits and show excellent accuracy. (paper)

  3. Dividing of metal and plastic components of printed circuit boards

    Directory of Open Access Journals (Sweden)

    Krenek Jiri

    2017-01-01

    Full Text Available This paper contents one possibility of PCB separation due to the temperature due to the different thermal expansion of the metal path and the plastic from which the boards are made. Using the knowledge from the literary study and the simulation environments used, we have reached the maximum analysis of the problem. The separation of metal and plastic may occur due to temperature changes if the temperature difference is sufficient. We have carried out a study of printed circuit board production so we can choose the appropriate path of separation. Furthermore, we calculated the shear stress size required to tear the conductive copper paths from the epoxy resin. The temperature field in a two-layer board was modeled in the FEMLAB and Pro/ENGINEER programming environments. From the simulated temperature field simulations, conclusions can be drawn that accurately describe the condition and characteristics of materials subjected to heat shock. They derived the resulting relationship for calculating the resulting shear stress needed to separate the conductive paths and plastic materials of the PCB. In our own experiments, we used several ways to heat PCBs. The temperature is also sufficient for the separation of tin. After using the mechanical separation of the components, they were dropped from the PCB. Mechanical separation was also used when removing conductive paths. This separation is effective, but in the newer types of PCBs, the cyclical effects of thermal shock have to be applied to the separation of copper paths. Laboratory tests have demonstrated the viability of the proposed solution. The proposed method of recycling could lead to industrial use, which requires consistent sorting of waste electrical and electronic equipment.

  4. A supplementary circuit rule-set for the neuronal wiring

    Directory of Open Access Journals (Sweden)

    Kunjumon I Vadakkan

    2013-05-01

    Full Text Available Limitations of known anatomical circuit rules necessitate the identification of supplementary rules. This is essential for explaining how associative sensory stimuli induce nervous system changes that generate internal sensations of memory, concurrent with triggering specific motor activities in response to specific cue stimuli. A candidate mechanism is rapidly reversible, yet stabilizable membrane hemi-fusion formed between the closely apposed postsynaptic membranes of different neurons at locations of convergence of sensory inputs during associative learning. The lateral entry of activity from the cue stimulus-activated postsynapse re-activates the opposite postsynapse through the hemi-fused area and induces the basic units of internal sensation (namely, semblions as a systems property. Working, short-term and long-term memories can be viewed as functions of the number of re-activatible hemi-fusions present at the time of memory retrieval. Blocking membrane hemi-fusion either by the insertion of the herpes simplex virus glycoproteins or by the deposition of insoluble intermediates of amyloid and tau proteins in the inter-postsynaptic extracellular matrix space leads to cognitive impairments, supporting this mechanism. The introduction of membrane fusion blockers into the postsynaptic cell cytoplasm that attenuates long-term potentiation, a correlate of behavioral motor activities in response to memory retrieval, provides further support. The lateral spread of activity through the inter-postsynaptic membrane is capable of contributing to oscillating neuronal activity at certain neuronal orders. At the resting state these oscillations provide sub-threshold activation to many neurons at higher orders, including motor neurons maintaining them at a low initiation threshold for motor activity.

  5. A Circuit Board Using a Sheet of Thick Paper and Aluminium Tape

    Science.gov (United States)

    Kamata, Masahiro; Honda, Motoshi

    2003-01-01

    We have developed a circuit board using materials that are inexpensive and familiar to elementary school students. Most of the responses from students who made this board were relatively positive and we observed them enjoy making the boards at a Science Festival in Japan and in elementary school. As an application, we also developed a tiny torch…

  6. PHYSICAL CHEMISTRY CHARACTERIZATION OF PRINTED CIRCUIT BOARD OF MOBILE PHONES

    Directory of Open Access Journals (Sweden)

    Hellington Bastos da Silva de Sant’ana

    2015-07-01

    Full Text Available Nowadays, electronics industry is the leading sector in developing new technologies. These new technologies lead to cheaper products increasing the consumption. The lifetime of such products is relatively short and soon it becomes waste, known as electronic waste. Cell phone is a common electronic waste. This waste represents an interesting raw material, because it contains large amount of base metals, considerable amount of valuable metals and also those dangerous. In this work, the electronic waste was submitted to mechanical processing: initially the devices were separated into two categories, as year of release (2002 and disassembled manually. The printed circuit boards were milled below 1 mm and then submitted to density and magnetic separation processes. The fractions obtained during the mechanical processing were characterized by chemical analysis. Using mechanical processing it was possible to obtain metal fractions of 80 wt%. A leaching test was carried out to determine if a waste needs to be managed as a hazardous; so that, cell phone waste must be considered in the category of hazardous residue because the lead concentration was above the limit established by Brazilian Standards

  7. Recovery of high purity precious metals from printed circuit boards

    International Nuclear Information System (INIS)

    Park, Young Jun; Fray, Derek J.

    2009-01-01

    Waste printed circuit boards (WPCB) have an inherent value because of the precious metal content. For an effective recycling of WPCB, it is essential to recover the precious metals. This paper reports a promising method to recover the precious metals. Aqua regia was used as a leachant and the ratio between metals and leachant was fixed at 1/20 (g/ml). Silver is relatively stable so the amount of about 98 wt.% of the input was recovered without an additional treatment. Palladium formed a red precipitate during dissolution, which were consisted of Pd(NH 4 ) 2 Cl 6 . The amount precipitated was 93 wt.% of the input palladium. A liquid-liquid extraction with toluene was used to extract gold selectively. Also, dodecanethiol and sodium borohydride solution were added to make gold nanoparticles. Gold of about 97 wt.% of the input was recovered as nanoparticles which was identified with a high-resolution transmission electron microscopy through selected area electron diffraction and nearest-neighbor lattice spacing.

  8. Waste printed circuit board recycling techniques and product utilization

    Energy Technology Data Exchange (ETDEWEB)

    Hadi, Pejman; Xu, Meng [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Lin, Carol S.K. [School of Energy and Environment, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong Special Administrative Region (Hong Kong); Hui, Chi-Wai [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); McKay, Gordon, E-mail: kemckayg@ust.hk [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Division of Sustainable Development, College of Science, Engineering and Technology, Hamad Bin Khalifa University, Qatar Foundation, Doha (Qatar)

    2015-02-11

    Highlights: • There is a major environmental issue about the printed circuit boards throughout the world. • Different physical and chemical recycling techniques have been reviewed. • Nonmetallic fraction of PCBs is the unwanted face of this waste stream. • Several applications of the nonmetallic fraction of waste PCBs have been introduced. - Abstract: E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly “recycling” has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined.

  9. Hydrometallurgical Recovery of Metals from Large Printed Circuit Board Pieces

    Science.gov (United States)

    Jadhav, U.; Hocheng, H.

    2015-09-01

    The recovery of precious metals from waste printed circuit boards (PCBs) is an effective recycling process. This paper presents a promising hydrometallurgical process to recover precious metals from waste PCBs. To simplify the metal leaching process, large pieces of PCBs were used instead of a pulverized sample. The chemical coating present on the PCBs was removed by sodium hydroxide (NaOH) treatment prior to the hydrometallurgical treatment. Among the leaching reagents examined, hydrochloric acid (HCl) showed great potential for the recovery of metals. The HCl-mediated leaching of waste PCBs was investigated over a range of conditions. Increasing the acid concentration decreased the time required for complete metal recovery. The shaking speed showed a pronounced positive effect on metal recovery, but the temperature showed an insignificant effect. The results showed that 1 M HCl recovered all of the metals from 4 cm × 4 cm PCBs at room temperature and 150 rpm shaking speed in 22 h.

  10. Optimization Of Assembly Line Of Printed Circuit Board Using Simulation

    Directory of Open Access Journals (Sweden)

    Kamal Alzameli

    2015-08-01

    Full Text Available The development of an assembly line would not stop at a specific research even if that research contains very detailed sectors of one assembly line or starting from customer order to product delivery. Therefore continuous improvement needs to be vigorous for continuous productivity improvement and innovation. The optimization process of printed circuit board assembly line includes hard and soft optimization. The hard optimization includes hardware changes via design and the soft optimization is figured via simulation of the current assembly line and analysis. The aim of the research is to determine the bottlenecks find a solution and develop improvement method via changing the configuration of the setup on the assembly line until the feasible optimal configuration is definite. The software that will be used for this simulation is Arena software. The data of the research is collected from real assembly line. The best engineering assumption for the area is used for no permanent data that could be available such as the data that might be collected from the manual stations. In addition to the aim of the research is to get a better yield via improving the time of the PCB assembly process. Hence the outcome to all of these attempts of optimizing the assembly line of PCB for continuous improvement is to deliver good quality products reduce cost and minimize the time to delivery and meet the customer expectations.

  11. Shivering and rewarming after cardiac surgery: comparison of ventilator circuits with humidifier and heated wires to heat and moisture exchangers.

    Science.gov (United States)

    McEvoy, M T; Carey, T J

    1995-07-01

    Detrimental physiologic effects of shivering in the cardiac surgery patient have been well documented. Rewarming techniques have been compared, with noted differences in the incidence of shivering. Ventilator circuits have not been examined independently from other rewarming variables. To compare heated wire humidification circuits with heat and moisture exchanger circuits on the incidence of shivering and speed and pattern of rewarming in mechanically ventilated patients. A prospective, descriptive, correlational study was done on 140 adult cardiac surgery patients in a university teaching medical center. All subjects underwent cardiac surgical procedures with hypothermic cardiopulmonary bypass. Subjects were randomized to humidified, heated wire circuits (n = 70) or heat and moisture exchanger circuits (n = 70). Heated water blankets were used on all patients. Mean intensive care unit admission temperature was 35.28 degrees C. No statistical differences were found in preoperative, demographic, or operative course data between treatment and control groups. Shivering was more common in the heat and moisture exchanger group than in the heated wire group. In our analysis, the only variable associated with shivering was the type of ventilator circuit. Patients using heated wire systems rewarmed more rapidly and had significantly higher temperatures than did patients using heat and moisture exchangers. These data suggest that use of heated wire humidified ventilator circuits with heated water blankets in adult cardiac surgery patients significantly reduces the incidence of shivering and results in a more rapid return to normothermia.

  12. Direct write fabrication of waveguides and interconnects for optical printed wiring boards

    Science.gov (United States)

    Dingeldein, Joseph C.

    Current copper based circuit technology is becoming a limiting factor in high speed data transfer applications as processors are improving at a faster rate than are developments to increase on board data transfer. One solution is to utilize optical waveguide technology to overcome these bandwidth and loss restrictions. The use of this technology virtually eliminates the heat and cross-talk loss seen in copper circuitry, while also operating at a higher bandwidth. Transitioning current fabrication techniques from small scale laboratory environments to large scale manufacturing presents significant challenges. Optical-to-electrical connections and out-of-plane coupling are significant hurdles in the advancement of optical interconnects. The main goals of this research are the development of direct write material deposition and patterning tools for the fabrication of waveguide systems on large substrates, and the development of out-of-plane coupler components compatible with standard fiber optic cabling. Combining these elements with standard printed circuit boards allows for the fabrication of fully functional optical-electrical-printed-wiring-boards (OEPWBs). A direct dispense tool was designed, assembled, and characterized for the repeatable dispensing of blanket waveguide layers over a range of thicknesses (25-225 μm), eliminating waste material and affording the ability to utilize large substrates. This tool was used to directly dispense multimode waveguide cores which required no UV definition or development. These cores had circular cross sections and were comparable in optical performance to lithographically fabricated square waveguides. Laser direct writing is a non-contact process that allows for the dynamic UV patterning of waveguide material on large substrates, eliminating the need for high resolution masks. A laser direct write tool was designed, assembled, and characterized for direct write patterning waveguides that were comparable in quality to those

  13. Recent developments and perspective of the spent waste printed circuit boards.

    Science.gov (United States)

    Xu, Yuquan; Liu, Junsheng

    2015-05-01

    The amount of spent electronic and electrical solid wastes (i.e. e-wastes) has increased to a new level with the rapid development of electronic and electrical industries. Management of e-wastes challenges the administrators and researchers. As a major component of the e-waste stream, pollution caused by the spent printed circuit boards has captured increasing attention. Various innovative methods have recently been developed to dispose and reuse these municipal spent printed circuit boards. In this mini-review article, the disposal approaches for spent printed circuit boards are highlighted. The present state and future perspective are also discussed. We hope that this mini-review can promote the extensive understanding and effective disposal of the spent printed circuit boards in the field of solid waste treatment and resources. © The Author(s) 2015.

  14. Polyimide Nanocomposite Circuit Board Materials to Mitigate Internal Electrostatic Discharge, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — In Sub-topic T8.02, NASA has identified a need for improved circuit boards to mitigate the hazards of internal electrostatic discharge (IESD) on missions where high...

  15. Polyimide Nanocomposite Circuit Board Materials to Mitigate Internal Electrostatic Discharge Project

    Data.gov (United States)

    National Aeronautics and Space Administration — In Sub-topic T8.02, NASA has identified a need for improved circuit boards to mitigate the hazards of internal electrostatic discharge (IESD) on missions where high...

  16. TSCA Chemical Data Reporting Fact Sheet: Byproducts Reporting for the Printed Circuit Board Industry

    Science.gov (United States)

    This fact sheet provides information on existing Chemical Data Reporting (CDR) rule requirements related to byproducts reporting by persons who manufacture printed circuit boards and may be subject to CDR.

  17. Wiring Together Synthetic Bacterial Consortia to Create a Biological Integrated Circuit.

    Science.gov (United States)

    Perry, Nicolas; Nelson, Edward M; Timp, Gregory

    2016-12-16

    The promise of adapting biology to information processing will not be realized until engineered gene circuits, operating in different cell populations, can be wired together to express a predictable function. Here, elementary biological integrated circuits (BICs), consisting of two sets of transmitter and receiver gene circuit modules with embedded memory placed in separate cell populations, were meticulously assembled using live cell lithography and wired together by the mass transport of quorum-sensing (QS) signal molecules to form two isolated communication links (comlinks). The comlink dynamics were tested by broadcasting "clock" pulses of inducers into the networks and measuring the responses of functionally linked fluorescent reporters, and then modeled through simulations that realistically captured the protein production and molecular transport. These results show that the comlinks were isolated and each mimicked aspects of the synchronous, sequential networks used in digital computing. The observations about the flow conditions, derived from numerical simulations, and the biofilm architectures that foster or silence cell-to-cell communications have implications for everything from decontamination of drinking water to bacterial virulence.

  18. RECYCLING OF PRINTED CIRCUIT BOARDS AIMING SILVER RECOVERY: A HYDROMETALLURGICAL ROUTE STUDY

    OpenAIRE

    Marcos Paulo Kohler Caldas; Viviane Tavares de Morae; Eduardo Junca; Jorge Alberto Soares Tenório; Denise Crocce Romano Espinosa

    2015-01-01

    The aim of this paper is characterize printed circuit board of computers and propose a hydrometallurgical route for silver recovery present in its composition. Initially, the printed circuit board was comminuted in both knife and hammer mills. The comminuted material was characterized by sieve analysis, chemical analysis by inductively coupled plasma optical emission spectrometry (ICP-OES) and loss on ignition. Leaching tests were conducted in sulfuric acid, sulfuric acid in an ox...

  19. Simplified Calculation of Maximum Wire Tension in case of Short Circuit

    Directory of Open Access Journals (Sweden)

    I. I. Sergey

    2007-01-01

    Full Text Available Modified method for a simplified calculation of a maximum wire tension in case of a short circuit. This method makes it possible to take into account a real trajectory of their movement and elements of a switch-gear. An accuracy evaluation of the simplified calculation has been done with the help of a calculative experiment using a BusEf computer software. A correction factor has been obtained to take into account an influence of insulator strings on a tension value.

  20. Reducing Printed Circuit Board Emissions with Low-Noise Design Practices

    Science.gov (United States)

    Bradley, Arthur T.; Fowler, Jennifer; Yavoich, Brian J.; Jennings, Stephen A.

    2012-01-01

    This paper presents the results of an experiment designed to determine the effectiveness of adopting several low-noise printed circuit board (PCB) design practices. Two boards were designed and fabricated, each consisting of identical mixed signal circuitry. Several important differences were introduced between the board layouts: one board was constructed using recommended low-noise practices and the other constructed without such attention. The emissions from the two boards were then measured and compared, demonstrating an improvement in radiated emissions of up to 22 dB.

  1. Printed Circuit Board Signal Integrity Analysis at CERN: POSTER 1/2 Workshop

    CERN Document Server

    Evans, John

    2001-01-01

    Printed circuit board (PCB) design layout for digital circuits has become a critical issue due to increasing clock frequencies and faster signal switching times. The Cadence SPECCTRAQuest package allows the detailed signal integrity (SI) analysis of designs from the schematic-entry phase to the board level. It is fully integrated into the Cadence PCB design flow and can be used to reduce prototype iterations and improve production robustness. Examples are given on how the tool can help engineers to make design choices and how to optimise board layout for electrical performance. Case studies of work done for LHC detectors are presented.

  2. Printed Circuit Board Signal Integrity Analysis at CERN: POSTER 2/2 Workshop

    CERN Document Server

    Evans, John

    2001-01-01

    Printed circuit board (PCB) design layout for digital circuits has become a critical issue due to increasing clock frequencies and faster signal switching times. The Cadence SPECCTRAQuest package allows the detailed signal integrity (SI) analysis of designs from the schematic-entry phase to the board level. It is fully integrated into the Cadence PCB design flow and can be used to reduce prototype iterations and improve production robustness. Examples are given on how the tool can help engineers to make design choices and how to optimise board layout for electrical performance. Case studies of work done for LHC detectors are presented.

  3. Environmental and risk screening for prioritizing pollution prevention opportunities in the U.S. printed wiring board manufacturing industry.

    Science.gov (United States)

    Lam, Carl W; Lim, Seong-Rin; Schoenung, Julie M

    2011-05-15

    Modern manufacturing of printed wiring boards (PWBs) involves extensive use of various hazardous chemicals in different manufacturing steps such as board preparation, circuit design transfer, etching and plating processes. Two complementary environmental screening methods developed by the U.S. EPA, namely: (i) the Tool for the Reduction and Assessment of Chemical and Other Environmental Impacts (TRACI) and (ii) Risk-Screening Environmental Indicators (RSEI), are used to quantify geographic and chemical environmental impacts in the U.S. PWB manufacturing industry based on Toxics Release Inventory (TRI) data. Although the release weight percentages of industrial chemicals such as methanol, glycol ethers and dimethylformamide comprise the larger fraction of reported air and water emissions, results indicate that lead, copper and their compounds' releases correspond to the highest environmental impact from toxicity potentials and risk-screening scores. Combining these results with further knowledge of PWB manufacturing, select alternative chemical processes and materials for pollution prevention are discussed. Examples of effective pollution prevention options in the PWB industry include spent etchant recovery technologies, and process and material substitutions. In addition, geographic assessment of environmental burden highlights states where promotion of pollution prevention strategies and emissions regulations can have the greatest effect to curb the PWB industry's toxic release impacts. Copyright © 2011 Elsevier B.V. All rights reserved.

  4. WindoWorks: A flexible program for computerized testing of accelerator control system electronic circuit boards

    International Nuclear Information System (INIS)

    Utterback, J.

    1993-09-01

    Since most accelerator control system circuit boards reside in a commercial bus architecture, such as CAMAC or VMEbus, a computerized test station is needed for exercising the boards. This test station is needed for the development of newly designed prototypes, for commissioning newly manufactured boards, for diagnosing boards which have failed in service, and for long term testing of boards with intermittent failure problems. WindoWorks was created to address these needs. It is a flexible program which runs on a PC compatible computer and uses a PC to bus crate interface. WindoWorks was designed to give the user a flexible way to test circuit boards. Each test is incapsulated into a window. By bringing up several different windows the user can run several different tests simultaneously. The windows are sizable, and moveable. They have data entry boxes so that the test can be customized to the users preference. The windows can be used in conjunction with each other in order to create supertests. There are several windows which are generic. They can be used to test basic functions on any VME (or CAMAC) board. There are other windows which have been created to test specific boards. New windows for testing specific boards can be easily created by a Pascal programmer using the WindoWorks framework

  5. RECYCLING OF PRINTED CIRCUIT BOARDS AIMING SILVER RECOVERY: A HYDROMETALLURGICAL ROUTE STUDY

    Directory of Open Access Journals (Sweden)

    Marcos Paulo Kohler Caldas

    2015-06-01

    Full Text Available The aim of this paper is characterize printed circuit board of computers and propose a hydrometallurgical route for silver recovery present in its composition. Initially, the printed circuit board was comminuted in both knife and hammer mills. The comminuted material was characterized by sieve analysis, chemical analysis by inductively coupled plasma optical emission spectrometry (ICP-OES and loss on ignition. Leaching tests were conducted in sulfuric acid, sulfuric acid in an oxidizing medium and nitric acid. The results indicated that the printed circuit board is mainly composed of copper (19.42%. Silver content of 0.045% was found. The route for silver recovery was leaching in sulfuric acid at 75°C for 18 hours. Then, leaching in sulfuric acid at 75°C in an oxidizing medium for 6 hours and nitric acid leaching at room temperature for 2 hours. Through of this route, 96.6% of silver was recovered.

  6. A polarization-diversity wavelength duplexer circuit in silicon-on-insulator photonic wires.

    Science.gov (United States)

    Bogaerts, Wim; Taillaert, Dirk; Dumon, Pieter; Van Thourhout, Dries; Baets, Roel; Pluk, Elroy

    2007-02-19

    We present a wavelength duplexer based on a compact arrayed waveguide grating (AWG) in silicon-on-insulator photonic wire waveguides. Polarization insensitive operation is achieved through a special polarization diversity approach in which we use 2-D grating fiber couplers as integrated polarization splitters. To mitigate the effects of process variations, we propagated both polarizations in opposite directions through the same AWG with a mere 600x350microm(2) footprint. This resulted in an on-chip insertion loss between -2.1dB and -6.9dB, crosstalk of -15dB, and only 0.66dB polarization dependent loss. This is the first demonstration of a functional polarization-diversity circuit implemented in SOI nanophotonic waveguides, including interfaces to single-mode fiber.

  7. Memory formation orchestrates the wiring of adult-born hippocampal neurons into brain circuits.

    Science.gov (United States)

    Petsophonsakul, Petnoi; Richetin, Kevin; Andraini, Trinovita; Roybon, Laurent; Rampon, Claire

    2017-08-01

    During memory formation, structural rearrangements of dendritic spines provide a mean to durably modulate synaptic connectivity within neuronal networks. New neurons generated throughout the adult life in the dentate gyrus of the hippocampus contribute to learning and memory. As these neurons become incorporated into the network, they generate huge numbers of new connections that modify hippocampal circuitry and functioning. However, it is yet unclear as to how the dynamic process of memory formation influences their synaptic integration into neuronal circuits. New memories are established according to a multistep process during which new information is first acquired and then consolidated to form a stable memory trace. Upon recall, memory is transiently destabilized and vulnerable to modification. Using contextual fear conditioning, we found that learning was associated with an acceleration of dendritic spines formation of adult-born neurons, and that spine connectivity becomes strengthened after memory consolidation. Moreover, we observed that afferent connectivity onto adult-born neurons is enhanced after memory retrieval, while extinction training induces a change of spine shapes. Together, these findings reveal that the neuronal activity supporting memory processes strongly influences the structural dendritic integration of adult-born neurons into pre-existing neuronal circuits. Such change of afferent connectivity is likely to impact the overall wiring of hippocampal network, and consequently, to regulate hippocampal function.

  8. Preparing printed circuit boards for rapid turn-around time on a protomat plotter

    International Nuclear Information System (INIS)

    Hawtree, J.

    1998-01-01

    This document describes the use of the LPKF ProtoMat mill/drill unit circuit board Plotter, with the associated CAD/CAM software BoardMaster and CircuitCAM. At present its primarily use here at Fermilab's Particle Physics Department is for rapid-turnover of prototype PCBs double-sided and single-sided copper clad printed circuit boards (PCBs). (The plotter is also capable of producing gravure films and engraving aluminum or plastic although we have not used it for this.) It has the capability of making traces 0.004 inch wide with 0.004 inch spacings which is appropriate for high density surface mount circuits as well as other through-mounted discrete and integrated components. One of the primary benefits of the plotter is the capability to produce double-sided drilled boards from CAD files in a few hours. However to achieve this rapid turn-around time, some care must be taken in preparing the files. This document describes how to optimize the process of PCB fabrication. With proper preparation, researchers can often have a completed circuit board in a day's time instead of a week or two wait with usual procedures. It is assumed that the software and hardware are properly installed and that the machinist is acquainted with the Win95 operating system and the basics of the associated software. This paper does not describe its use with pen plotters, lasers or rubouts. The process of creating a PCB (printed circuit board) begins with the CAD (computer-aided design) software, usually PCAD or VeriBest. These files are then moved to CAM (computer-aided machining) where they are edited and converted to put them into the proper format for running on the ProtoMat plotter. The plotter then performs the actual machining of the board. This document concentrates on the LPKF programs CircuitCam BASIS and BoardMaster for the CAM software. These programs run on a Windows 95 platform to run an LPKF ProtoMat 93s plotter

  9. Circuit Board Analysis for Lead by Atomic Absorption Spectroscopy in a Course for Nonscience Majors

    Science.gov (United States)

    Weidenhammer, Jeffrey D.

    2007-01-01

    A circuit board analysis of the atomic absorption spectroscopy, which is used to measure lead content in a course for nonscience majors, is being presented. The experiment can also be used to explain the potential environmental hazards of unsafe disposal of various used electronic equipments.

  10. Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards

    DEFF Research Database (Denmark)

    Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    A majority of printed circuit board surfaces are covered with tin, therefore tin corrosion under humid conditions and movement of tin ions under the influence of an electric field plays an important role in the corrosion failure development. Tracking tin corrosion products spread on the printed...

  11. Radiation evaluation method of commercial off-the-shelf (COTS) electronic printed circuit boards (PCBs)

    International Nuclear Information System (INIS)

    LaBel, K.A.; Gruner, T.D.; Reed, R.A.; Settles, B.; Wilmot, J.; Dougherty, L.F.; Russo, A.; Yuknis, W.; Foster, M.G.; Garrisson-Darrin, A.; Marshall, P.W.

    1999-01-01

    We present a radiation evaluation methodology and proton ground test results for candidate COTS PCBs (commercial off-the-shelf electronic printed circuit boards) and their associated electronics for low-altitude, low-inclination orbits. We will also discuss the implications associated with mission orbit and duration. (authors)

  12. Bioextraction of Copper from Printed Circuit Boards: Influence of Initial Concentration of Ferrous Iron

    Science.gov (United States)

    Yamane, Luciana Harue; Espinosa, Denise Crocce Romano; Tenório, Jorge Alberto Soares

    Printed circuit boards are found in all electric and electronic equipment and are particularly problematic to recycle because of the heterogeneous mix of organic material, metals, and fiberglass. Additionally, printed circuit boards can be considered a secondary source of copper and bacterial leaching can be applied to copper recovery. This study investigated the influence of initial concentration of ferrous iron on bacterial leaching to recover copper from printed circuit boards using Acidithiobacillus ferrooxidans-LR. Printed circuit boards from computers were comminuted using a hammer mill. The powder obtained was magnetically separated and the non magnetic material used in this study. A shake flask study was carried out on the non magnetic material using a rotary shaker at 30°C, 170 rpm and different initial concentrations of ferrous iron (gL-1): 6.75; 13.57 and 16.97. Abiotic controls were also run in parallel. The monitored parameters were pH, Eh, ferrous iron concentration and copper extraction (spectroscopy of atomic absorption). The results showed that using initial concentration of ferrous iron of 6.75gL-1 were extracted 99% of copper by bacterial leaching.

  13. Modeling printed circuit board curvature in relation to manufacturing process steps

    NARCIS (Netherlands)

    Schuerink, G.A.; Slomp, M.; Wits, Wessel Willems; Legtenberg, R.; Legtenberg, R.; Kappel, E.A.

    2013-01-01

    This paper presents an analytical method to predict deformations of Printed Circuit Boards (PCBs) in relation to their manufacturing process steps. Classical Lamination Theory (CLT) is used as a basis. The model tracks internal stresses and includes the results of subsequent production steps, such

  14. An Integer Programming-Based Generalized Vehicle Routing Approach for Printed Circuit Board Assembly Optimization

    Science.gov (United States)

    Seth, Anupam

    2009-01-01

    Production planning and scheduling for printed circuit, board assembly has so far defied standard operations research approaches due to the size and complexity of the underlying problems, resulting in unexploited automation flexibility. In this thesis, the increasingly popular collect-and-place machine configuration is studied and the assembly…

  15. Method to determine thermoelastic material properties of constituent and copper-patterned layers of multilayer printed circuit boards

    NARCIS (Netherlands)

    Veldhuijzen van Zanten, J.F.J.; Schuerink, G.A.; Tullemans, A. H.J.; Legtenberg, R.; Wits, Wessel W.

    Due to the ongoing component miniaturization and integration in the electronics industry, there is a need for asymmetric lay-ups for printed circuit boards (PCBs), especially in the case of complex boards that house both analog and digital circuits. This paper focuses on the contribution of the

  16. Implementation of Basic and Universal Gates In a single Circuit Based On Quantum-dot Cellular Automata Using Multi-Layer Crossbar Wire

    Science.gov (United States)

    Bhowmik, Dhrubajyoti; Saha, Apu Kr; Dutta, Paramartha; Nandi, Supratim

    2017-08-01

    Quantum-dot Cellular Automata (QCA) is one of the most substitutes developing nanotechnologies for electronic circuits, as a result of lower force utilization, higher speed and smaller size in correlation with CMOS innovation. The essential devices, a Quantum-dot cell can be utilized to logic gates and wires. As it is the key building block on nanotechnology circuits. By applying simple gates, the hardware requirements for a QCA circuit can be decreased and circuits can be less complex as far as level, delay and cell check. This article exhibits an unobtrusive methodology for actualizing novel upgraded simple and universal gates, which can be connected to outline numerous variations of complex QCA circuits. Proposed gates are straightforward in structure and capable as far as implementing any digital circuits. The main aim is to build all basic and universal gates in a simple circuit with and without crossbar-wire. Simulation results and physical relations affirm its handiness in actualizing each advanced circuit.

  17. Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill

    International Nuclear Information System (INIS)

    Yoo, Jae-Min; Jeong, Jinki; Yoo, Kyoungkeun; Lee, Jae-chun; Kim, Wonbaek

    2009-01-01

    Printed circuit boards incorporated in most electrical and electronic equipment contain valuable metals such as Cu, Ni, Au, Ag, Pd, Fe, Sn, and Pb. In order to employ a hydrometallurgical route for the recycling of valuable metals from printed circuit boards, a mechanical pre-treatment step is needed. In this study, the metallic components from waste printed circuit boards have been enriched using a mechanical separation process. Waste printed circuit boards shredded to 5.0 mm. The fractions of milled printed circuit boards of size 5.0 mm fraction and the heavy fraction were subjected to two-step magnetic separation. Through the first magnetic separation at 700 Gauss, 83% of the nickel and iron, based on the whole printed circuit boards, was recovered in the magnetic fraction, and 92% of the copper was recovered in the non-magnetic fraction. The cumulative recovery of nickel-iron concentrate was increased by a second magnetic separation at 3000 Gauss, but the grade of the concentrate decreased remarkably from 76% to 56%. The cumulative recovery of copper concentrate decreased, but the grade increased slightly from 71.6% to 75.4%. This study has demonstrated the feasibility of the mechanical separation process consisting of milling/size classification/gravity separation/two-step magnetic separation for enriching metallic components such as Cu, Ni, Al, and Fe from waste printed circuit boards

  18. Printed Circuit Board Embedded Inductors for Very High Frequency Switch-Mode Power Supplies

    DEFF Research Database (Denmark)

    Madsen, Mickey Pierre; Knott, Arnold; Andersen, Michael A. E.

    2013-01-01

    The paper describes the design of three different structures for printed circuit board embedded inductors. Direct comparison of spirals, solenoids and toroids are made with regard to inductance, dc and ac resistance, electromagnetic field and design flexibility. First the equations for the impeda......The paper describes the design of three different structures for printed circuit board embedded inductors. Direct comparison of spirals, solenoids and toroids are made with regard to inductance, dc and ac resistance, electromagnetic field and design flexibility. First the equations...... to take possible electromagnetic interference problems into account, when the structures are compared. The simulated fields are verified through near field measurements performed on the prototypes. Finally design flexibility are considered, both regarding scalability and design of the individual inductors...

  19. Research on Toxicity Evaluation of Waste Incineration Residues of Printed Circuit Boards

    Directory of Open Access Journals (Sweden)

    Rasa Volungevičienė

    2014-10-01

    Full Text Available Recycling waste printed circuit boards (PCB is an extremely complicated process, because PCBs consist of a number of complex components – hazardous and non-hazardous materials sets. Pyrolysis and combustion are currently the most effective treatment technologies for waste printed circuit boards. Pyrolysis can be used for thermally decomposing PCBs allowing for the simultaneous recovery of valuable materials. Following the extraction of valuable materials, the problem of residual ash utilization is encountered. Determining the qualitative and quantitative characteristics of incineration residue helps with choosing effective ash management technologies. This paper analyzes PCB ash generated at three different temperatures of 400 °C, 500 °C and 600 °C. Ash residues have been analysed to determine the quantity and type of metals present. Furthermore, the experiment of leaching heavy metals from ash has been described.

  20. EMC and the printed circuit board design theory and layout made simple

    CERN Document Server

    Montrose, Mark I

    1999-01-01

    "This reference text shows how and why RF energy is created within a printed circuit board, and the manner in which propagation occurs. With thorough explanations, this book enables engineers to grasp both the fundamentals of EMC theory and signal integrity, along with the mitigation process needed to prevent an EMC event while maintaining optimal functionality for low- and high-technology products. Mr. Montrose also shows the relationship between time and frequency domains, helping one meet mandatory compliance requirements."--Jacket.

  1. Leaching of gold, silver and accompanying metals from circuit boards (PCBs) waste

    OpenAIRE

    Jana Ficeriová; Peter Baláž; Eberhard Gock

    2011-01-01

    Au-Ag noble metal wastes represent a wide range of waste types and forms, with various accompanying metallic elements.The presented leaching strategy for Au-Ag contained in circuit boards (PCBs) aims at gaining gold and silver in the metallic form.Application of the proposed ammonium thiosulphate leaching process for the treatment of the above mentioned Au-Ag containing wastesrepresents a practical, economic and at the same time an ecological solution. The ammonium thiosulphate based leaching...

  2. Search for the optimal size of printed circuit boards for mechanical structures for electronic equipment

    Directory of Open Access Journals (Sweden)

    Yefimenko A. A.

    2014-12-01

    Full Text Available The authors present a method, an algorithm and a program, designed to determine the optimal size of printed circuit boards (PCB of mechanical structures and different kinds of electronic equipment. The PCB filling factor is taken as an optimization criterion. The method allows one to quickly determine the dependence of the filling factor on the size of the PCB for various components.

  3. Design and implementation of a multi-sensor robot system for printed circuit board insertion

    Science.gov (United States)

    Sood, Deepak; Repko, Michael C.; Kelley, Robert B.

    1989-01-01

    The design and implementation of a robot system equipped with multiple sensors are described. The robotic assembly system couples the task sequence of the robot with information from different sensors, enabling the system to handle uncertainties encountered during task execution. The target task involves the insertion of a printed circuit board into a card cage. The sensors used are an overhead three-dimensional vision system, a fingertip cross-fire sensor, and a 6-DOF force/torque sensor. The vision system is used to locate the printed circuit boards and the insertion slots. Information provided by the cross-fire sensor is used to complement the information from the vision system in order to obtain a proper grasping location on the printed circuit board. A fuzzy-logic-based system is used to interpret the forces and torques generated by the force/torque sensor during the insertion process. The repeated success of this assembly task over many experimental trials verifies the modeling and controller assumptions.

  4. Study of Photosensitive Dry Films Absorption for Printed Circuit Boards by Photoacoustic Technique

    Science.gov (United States)

    Hernández, R.; Zaragoza, J. A. Barrientos; Jiménez-Pérez, J. L.; Orea, A. Cruz; Correa-Pacheco, Z. N.

    2017-08-01

    In this work, the study of photosensitive dry-type films by photoacoustic technique is proposed. The dry film photoresist is resistant to chemical etching for printed circuit boards such as ferric chloride, sodium persulfate or ammonium, hydrochloric acid. It is capable of faithfully reproducing circuit pattern exposed to ultraviolet light (UV) through a negative. Once recorded, the uncured portion is removed with alkaline solution. It is possible to obtain good results in surface mount circuits with tracks of 5 mm. Furthermore, the solid resin films are formed by three layers, two protective layers and a UV-sensitive optical absorption layer in the range of 325 nm to 405 nm. By means of optical absorption of UV-visible rays emitted by a low-power Xe lamp, the films transform this energy into thermal waves generated by the absorption of optical radiation and subsequently no-radiative de-excitation occurs. The photoacoustic spectroscopy is a useful technique to measure the transmittance and absorption directly. In this study, the optical absorption spectra of the three layers of photosensitive dry-type films were obtained as a function of the wavelength, in order to have a knowledge of the absorber layer and the protective layers. These analyses will give us the physical properties of the photosensitive film, which are very important in curing the dry film for applications in printed circuit boards.

  5. Potentials for Improvement of Resource Efficiency in Printed Circuit Board Manufacturing: A Case Study Based on Material Flow Cost Accounting

    Directory of Open Access Journals (Sweden)

    Yi-Xuan Wang

    2017-05-01

    Full Text Available The pursuit of sustainable resource use by manufacturing companies is driven by resource scarcity, environmental awareness, and cost savings potentials. To address these issues, Material Flow Cost Accounting (MFCA has been developed and applied as an effective environmental management tool. Within MFCA’s general allocation, the accounts of products and losses are overrated by weight or volume. However, such a method is incompatible with Printed Circuit Board (PCB manufacturing because of industry characteristics in which primary inputs and products are measured by area. Based on MFCA, this case study systematically established several linear cost calculation models along the production process for capturing the actual waste flows as well as performing cost-benefit analysis. The recognition of previously ignored losses offered the incentive to find appropriate indicators to conduct cost-benefit analysis on hotspots for losses. Loss identification and analysis indicated that machining and wiring are the necessities and priorities of process optimization for resource efficiency improvement measures. Therefore, this research could not only advance the achievement of a profitable and sustainable production while improving resource efficiency at the source but could also provide support for decision making in PCB manufacturing.

  6. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  7. The application of pneumatic jigging in the recovery of metallic fraction from shredded printed wiring boards.

    Science.gov (United States)

    Wang, Zheng; Hall, Philip; Miles, Nicholas J; Wu, Tao; Lambert, Peter; Gu, Fu

    2015-09-01

    Waste electrical and electronic equipment (WEEE) is one of the fastest growing waste streams worldwide with volumes increasing by 40% each year. WEEE has attracted increasing concern worldwide due to its high metal content and the potential environmental threat which results from uncontrolled recycling practices. Innovative physical separation techniques for WEEE recycling are preferential compared with chemical methods because of the reduction of energy and chemical consumption as well as potential environmental threats. Pneumatic jigging is a dry separation process capable of achieving good separation of coarse material within a very narrow density range, which makes it suitable as a pretreatment process for WEEE recycling. The work presented in this paper investigates the potential application of pneumatic jigging in metal recovery from WEEE. A pilot scale pneumatic jig has been developed by University of Nottingham Ningbo to separate shredded printed wiring boards into two streams: a light fraction (mainly non-metallic fraction consisting of glass fiber, fluffs, and plastic pieces) and dense fraction (metallic fraction). The novelty of work presented in this paper is the application of a dry separation technique in WEEE recycling for metal recovery. Compared with conventional wet separation processes involved in WEEE recycling industry, dry separation has the advantage of zero secondary pollution. The results of this experimental program show pneumatic jigging to be an effective and environmental friendly technique as a pretreatment process for the recovery of the metallic fraction from shredded WEEE. © The Author(s) 2015.

  8. Assembling surface mounted components on ink-jet printed double sided paper circuit board

    International Nuclear Information System (INIS)

    Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Sidén, Johan; Nilsson, Hans-Erik; Hummelgård, Magnus; Olin, Håkan; Hummelgård, Christine

    2014-01-01

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed. (paper)

  9. Heated wire humidification circuit attenuates the decrease of core temperature during general anesthesia in patients undergoing arthroscopic hip surgery.

    Science.gov (United States)

    Park, Sooyong; Yoon, Seok-Hwa; Youn, Ann Misun; Song, Seung Hyun; Hwang, Ja Gyung

    2017-12-01

    Intraoperative hypothermia is common in patients undergoing general anesthesia during arthroscopic hip surgery. In the present study, we assessed the effect of heating and humidifying the airway with a heated wire humidification circuit (HHC) to attenuate the decrease of core temperature and prevent hypothermia in patients undergoing arthroscopic hip surgery under general anesthesia. Fifty-six patients scheduled for arthroscopic hip surgery were randomly assigned to either a control group using a breathing circuit connected with a heat and moisture exchanger (HME) (n = 28) or an HHC group using a heated wire humidification circuit (n = 28). The decrease in core temperature was measured from anesthetic induction and every 15 minutes thereafter using an esophageal stethoscope. Decrease in core temperature from anesthetic induction to 120 minutes after induction was lower in the HHC group (-0.60 ± 0.27℃) compared to the control group (-0.86 ± 0.29℃) (P = 0.001). However, there was no statistically significant difference in the incidence of intraoperative hypothermia or the incidence of shivering in the postanesthetic care unit. The use of HHC may be considered as a method to attenuate intraoperative decrease in core temperature during arthroscopic hip surgery performed under general anesthesia and exceeding 2 hours in duration.

  10. Estimation of Operating Condition of Appliances Using Circuit Current Data on Electric Distribution Boards

    Science.gov (United States)

    Iwafune, Yumiko; Ogimoto, Kazuhiko; Yagita, Yoshie

    The Energy management systems (EMS) on demand sides are expected as a method to enhance the capability of supply and demand balancing of a power system under the anticipated penetration of renewable energy generation such as Photovoltaics (PV). Elucidation of energy consumption structure in a building is one of important elements for realization of EMS and contributes to the extraction of potential energy saving. In this paper, we propose the estimation method of operating condition of household appliances using circuit current data on an electric distribution board. Circuit current data are broken down by their shape using a self-organization map method and aggregated by appliance based on customers' information of appliance possessed. Proposed method is verified using residential energy consumption measurement survey data.

  11. Bioleaching of metals from printed circuit boards supported with surfactant-producing bacteria

    International Nuclear Information System (INIS)

    Karwowska, Ewa; Andrzejewska-Morzuch, Dorota; Łebkowska, Maria; Tabernacka, Agnieszka; Wojtkowska, Małgorzata; Telepko, Alicja; Konarzewska, Agnieszka

    2014-01-01

    Highlights: • Bioleaching of metals from printed circuit boards by BSAC-producing bacteria was estimated. • Aeration increased the release of all metals in medium with sulphur and biosurfactant. • Increase in Cu, Pb, Ni and Cr removal rate was observed at 37 °C in acidic medium. -- Abstract: This study has evaluated the possibility of bioleaching zinc, copper, lead, nickel, cadmium and chromium from printed circuit boards by applying a culture of sulphur-oxidising bacteria and a mixed culture of biosurfactant-producing bacteria and sulphur-oxidising bacteria. It was revealed that zinc was removed effectively both in a traditional solution acidified by a way of microbial oxidation of sulphur and when using a microbial culture containing sulphur-oxidising and biosurfactant-producing bacteria. The average process efficiency was 48% for Zn dissolution. Cadmium removal was similar in both media, with a highest metal release of 93%. For nickel and copper, a better effect was obtained in the acidic medium, with a process effectiveness of 48.5% and 53%, respectively. Chromium was the only metal that was removed more effectively in the bioleaching medium containing both sulphur-oxidising and biosurfactant-producing bacteria. Lead was removed from the printed circuit boards with very low effectiveness (below 0.5%). Aerating the culture medium with compressed air increased the release of all metals in the medium with sulphur and biosurfactant, and of Ni, Cu, Zn and Cr in the acidic medium. Increasing the temperature of the medium (to 37 °C) had a more significant impact in the acidic environment than in the neutral environment

  12. Aeroflex Single Board Computers and Instrument Circuit Cards for Nuclear Environments Measuring and Monitoring

    International Nuclear Information System (INIS)

    Stratton, Sam; Stevenson, Dave; Magnifico, Mateo

    2013-06-01

    A Single Board Computer (SBC) is an entire computer including all of the required components and I/O interfaces built on a single circuit board. SBC's are used across numerous industrial, military and space flight applications. In the case of military and space implementations, SBC's employ advanced high reliability processors designed for rugged thermal, mechanical and even radiation environments. These processors, in turn, rely on equally advanced support components such as memory, interface, and digital logic. When all of these components are put together on a printed circuit card, the result is a highly reliable Single Board Computer that can perform a wide variety of tasks in very harsh environments. In the area of instrumentation, peripheral circuit cards can be developed that directly interface to the SBC and various radiation measuring devices and systems. Designers use signal conditioning and high reliability Analog to Digital Converters (ADC's) to convert the measuring device signals to digital data suitable for a microprocessor. The data can then be sent to the SBC via high speed communication protocols such as Ethernet or similar type of serial bus. Data received by the SBC can then be manipulated and processed into a form readily available to users. Recent events are causing some in the NPP industry to consider devices and systems with better radiation and temperature performance capability. Systems designed for space application are designed for the harsh environment of space which under certain conditions would be similar to what the electronics will see during a severe nuclear reactor event. The NPP industry should be considering higher reliability electronics for certain critical applications. (authors)

  13. Pyrolysis characteristics of integrated circuit boards at various particle sizes and temperatures

    International Nuclear Information System (INIS)

    Chiang, H.-L.; Lin, K.-H.; Lai, M.-H.; Chen, T.-C.; Ma, S.-Y.

    2007-01-01

    A pyrolysis method was employed to recycle the metals and brominated compounds blended into printed circuit boards. This research investigated the effect of particle size and process temperature on the element composition of IC boards and pyrolytic residues, liquid products, and water-soluble ionic species in the exhaust, with the overall goal being to identify the pyrolysis conditions that will have the least impact on the environment. Integrated circuit (IC) boards were crushed into 5-40 mesh (0.71-4.4 mm), and the crushed particles were pyrolyzed at temperatures ranging from 200 to 500 deg. C. The thermal decomposition kinetics were measured by a thermogravimetric (TG) analyzer. The composition of pyrolytic residues was analyzed by Energy Dispersive X-ray Spectrometer (EDS), Inductively Coupled Plasma Atomic Emission Spectrometer (ICP-AES) and Inductively Coupled Plasma-Mass Spectrometry (ICP-MS). In addition, the element compositions of liquid products were analyzed by ICP-AES and ICP-MS. Pyrolytic exhaust was collected by a water-absorption system in an ice-bath cooler, and IC analysis showed that the absorbed solution comprised 11 ionic species. Based on the pyrolytic kinetic parameters of TG analysis and pyrolytic residues at various temperatures for 30 min, the effect of particle size was insignificant in this study, and temperature was the key factor for the IC board pyrolysis. Two stages of decomposition were found for IC board pyrolysis under nitrogen atmosphere. The activation energy was 38-47 kcal/mol for the first-stage reaction and 5.2-9.4 kcal/mol for the second-stage reaction. Metal content was low in the liquid by-product of the IC board pyrolysis process, which is an advantage in that the liquid product could be used as a fuel. Brominate and ammonium were the main water-soluble ionic species of the pyrolytic exhaust. A plan for their safe and effective disposal must be developed if the pyrolytic recycling process is to be applied to IC boards

  14. Homogenization on Multi-Materials’ Elements: Application to Printed Circuit Boards and Warpage Analysis

    Directory of Open Access Journals (Sweden)

    Araújo Manuel

    2016-01-01

    Full Text Available Multi-material domains are often found in industrial applications. Modelling them can be computationally very expensive due to meshing requirements. The finite element properties comprising different materials are hardly accurate. In this work, a new homogenization method that simplifies the computation of the homogenized Young modulus, Poisson ratio and thermal expansion coefficient is proposed, and applied to composite-like material on a printed circuit board. The results show a good properties correspondence between the homogenized domain and the real geometry simulation.

  15. Comparative study of electromagnetic compatibility methods in printed circuit board design tools

    International Nuclear Information System (INIS)

    Marinova, Galia

    2002-01-01

    The paper considers the state-of-the art in electromagnetic compatibility (EMC) oriented printed circuit board (PCB) design. A general methodology of EMC oriented PCB design is synthesized. The main CAD tools available today are estimated and compared for their abilities to treat EMC oriented design. To help non experts a knowledge-base containing more than 50 basic rules for EMC-oriented PCB design is proposed. It can be applied in the PCB design CAD tools that possess rule-builders or it can help interactive design. Trends in this area of EMC-oriented PCB design are deduced. (Author)

  16. The separation of waste printed circuit board by dissolving bromine epoxy resin using organic solvent.

    Science.gov (United States)

    Zhu, P; Chen, Y; Wang, L Y; Zhou, M; Zhou, J

    2013-02-01

    Separation of waste printed circuit boards (WPCBs) has been a bottleneck in WPCBs resource processing. In this study, the separation of WPCBs was performed using dimethyl sulfoxide (DMSO) as a solvent. Various parameters, which included solid to liquid ratio, temperature, WPCB sizes, and time, were studied to understand the separation of WPCBs by dissolving bromine epoxy resin using DMSO. Experimental results showed that the concentration of dissolving the bromine epoxy resin increased with increasing various parameters. The optimum condition of complete separation of WPCBs was solid to liquid ratio of 1:7 and WPCB sizes of 16 mm(2) at 145°C for 60 min. The used DMSO was vapored under the decompression, which obtained the regenerated DMSO and dissolved bromine epoxy resin. This clean and non-polluting technology offers a new way to separate valuable materials from WPCBs and prevent the environmental pollution of waste printed circuit boards effectively. Crown Copyright © 2012. Published by Elsevier Ltd. All rights reserved.

  17. Selective separation of copper over solder alloy from waste printed circuit boards leach solution.

    Science.gov (United States)

    Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Firozi, Sadegh

    2017-02-01

    The printed circuit boards (PCBs) from electronic waste are important resource, since the PCBs contain precious metals such as gold, copper, tin, silver, platinum and so forth. In addition to the economic point of view, the presence of lead turns this scrap into dangerous to environment. This study was conducted as part of the development of a novel process for selective recovery of copper over tin and lead from printed circuit boards by HBF 4 leaching. In previous study, Copper with solder alloy was associated, simultaneously were leached in HBF 4 solution using hydrogen peroxide as an oxidant at room temperature. The objective of this study is the separation of copper from tin and lead from Fluoroborate media using CP-150 as an extractant. The influence of organic solvent's concentration, pH, temperature and A/O phase ratio was investigated. The possible extraction mechanism and the composition of the extracted species have been determined. The separation factors for these metals using this agent are reported, while efficient methods for separation of Cu (II) from other metal ions are proposed. The treatment of leach liquor for solvent extraction of copper with CP-150 revealed that 20% CP-150 in kerosene, a 30min period of contact time, and a pH of 3 were sufficient for the extraction of Cu(II) and 99.99% copper was recovered from the leached solution. Copyright © 2016. Published by Elsevier Ltd.

  18. Mineralogical analysis of dust collected from typical recycling line of waste printed circuit boards.

    Science.gov (United States)

    Wang, Fangfang; Zhao, Yuemin; Zhang, Tao; Duan, Chenlong; Wang, Lizhang

    2015-09-01

    As dust is one of the byproducts originating in the mechanical recycling process of waste printed circuit boards such as crushing and separating, from the viewpoints of resource reuse and environmental protection, an effective recycling method to recover valuable materials from this kind of dust is in urgent need. In this paper, detailed mineralogical analysis on the dust collected from a typical recycling line of waste printed circuit boards is investigated by coupling several analytical techniques. The results demonstrate that there are 73.1wt.% organic matters, 4.65wt.% Al, 4.55wt.% Fe, 2.67wt.% Cu and 1.06wt.% Pb in the dust, which reveals the dust is worthy of reuse and harmful to environment. The concentration ratios of Fe, Mn and Zn can reach 12.35, 12.33 and 6.67 respectively by magnetic separation. The yield of dust in each size fraction is nonuniform, while the yield of -0.75mm size fraction is up to 51.15wt.%; as the particle size decreases, the content of liberated metals and magnetic materials increase, and metals are mainly in elemental forms. The F, Cl and Br elements combing to C in the dust would make thermal treatment dangerous to the environment. Based on these results, a flowsheet to recycle the dust is proposed. Copyright © 2015 Elsevier Ltd. All rights reserved.

  19. Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

    Science.gov (United States)

    Ivǎnuş, R. C.; ǎnuş, D., IV; Cǎlmuc, F.

    2010-06-01

    Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE) contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste - PCBs) leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L). The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

  20. Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

    Directory of Open Access Journals (Sweden)

    Ivănuş R.C.

    2010-06-01

    Full Text Available Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste – PCBs leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L. The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

  1. Three-dimensionally deformable, highly stretchable, permeable, durable and washable fabric circuit boards

    Science.gov (United States)

    Li, Qiao; Tao, Xiao Ming

    2014-01-01

    This paper reports fabric circuit boards (FCBs), a new type of circuit boards, that are three-dimensionally deformable, highly stretchable, durable and washable ideally for wearable electronic applications. Fabricated by using computerized knitting technologies at ambient dry conditions, the resultant knitted FCBs exhibit outstanding electrical stability with less than 1% relative resistance change up to 300% strain in unidirectional tensile test or 150% membrane strain in three-dimensional ball punch test, extraordinary fatigue life of more than 1 000 000 loading cycles at 20% maximum strain, and satisfactory washing capability up to 30 times. To the best of our knowledge, the performance of new FCBs has far exceeded those of previously reported metal-coated elastomeric films or other organic materials in terms of changes in electrical resistance, stretchability, fatigue life and washing capability as well as permeability. Theoretical analysis and numerical simulation illustrate that the structural conversion of knitted fabrics is attributed to the effective mitigation of strain in the conductive metal fibres, hence the outstanding mechanical and electrical properties. Those distinctive features make the FCBs particularly suitable for next-to-skin electronic devices. This paper has further demonstrated the application potential of the knitted FCBs in smart protective apparel for in situ measurement during ballistic impact. PMID:25383032

  2. Investigating the heat transfer on the top side of inclined printed circuit boards during vapour phase soldering

    International Nuclear Information System (INIS)

    Illés, Balázs; Géczy, Attila

    2016-01-01

    Highlights: • Investigating the effect of inclination on heat transfer uniformity and intensity during VPS. • Even moderate inclination has high impact on the condensate layer and on the heat transfer. • Inclination under 1° has negative effect on temperature distribution of the soldered board. • Inclination from 1° to 10° improves heat transfer uniformity of vapour phase soldering. • Inclination can help to reduce soldering failures during vapour phase soldering. - Abstract: In this paper, heat transfer and condensate layer formation was investigated by numerical simulations on the top side of inclined printed circuit boards during vapour phase soldering. The phase change on the inclined surface and the transfer mechanisms in the condensate layer were embedded in a three-dimensional model. Steady-state and saturated vapour conditions were applied as boundary conditions in order to study the pure effect of the inclination. Due to the electronic component and circuit board structures during soldering only moderate inclination angles were studied between 0° and 10°. It was found that a moderate inclination of the printed circuit board has considerable effects on the formation of condensate layer and consequently on heat transfer. Compared to the default horizontal orientation of the board, the thickness differences of the condensate layer can be decreased with an optimised inclination of the printed circuit board. This effect homogenizes heat transfer during the process, enabling improved solder joint quality, with reduced overall soldering failure count.

  3. Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor

    Energy Technology Data Exchange (ETDEWEB)

    Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Lin, Carol S.K. [School of Energy and Environment, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong Special Administrative Region (Hong Kong); McKay, Gordon, E-mail: kemckayg@ust.hk [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Division of Sustainable Development, College of Science, Engineering and Technology, Hamad bin Khalifa University, Doha (Qatar)

    2015-01-15

    Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced.

  4. Four-Channel PC/104 MIL-STD-1553 Circuit Board

    Science.gov (United States)

    Cox, Gary L.

    2004-01-01

    The mini bus interface card (miniBIC) is the first four-channel electronic circuit board that conforms to MIL-STD-1553 and to the electrical-footprint portion of PC/104. [MIL-STD-1553 is a military standard that encompasses a method of communication and electrical- interface requirements for digital electronic subsystems connected to a data bus. PC/104 is an industry standard for compact, stackable modules that are fully compatible (in architecture, hardware, and software) with personal-computer data- and power-bus circuitry.] Prior to the development of the miniBIC, only one- and two-channel PC/104 MIL-STD-1553 boards were available. To obtain four channels, it was necessary to include at least two boards in a PC/104 stack. In comparison with such a two-board stack, the miniBIC takes up less space, consumes less power, and is more reliable. In addition, the miniBIC includes 32 digital input/output channels. The miniBIC (see figure) contains four MIL-STD-1553B hybrid integrated circuits (ICs), four transformers, a field-programmable gate array (FPGA), and an Industry Standard Architecture (ISA) interface. Each hybrid IC includes a MILSTD-1553 dual transceiver, memory-management circuitry, processor interface logic circuitry, and 64Kx16 bits of shared static random access memory. The memory is used to configure message and data blocks. In addition, 23 16-bit registers are available for (1) configuring the hybrid IC for, and starting it in, various modes of operation; (2) reading the status of the functionality of the hybrid IC; and (3) resetting the hybrid IC to a known state. The miniBIC can operate as a remote terminal, bus controller, or bus monitor. The FPGA provides the chip-select and data-strobe signals needed for operation of the hybrid ICs. The FPGA also receives interruption signals and forwards them to the ISA bus. The ISA interface connects the address, data, and control interfaces of the hybrid ICs to the ISA backplane. Each channel is, in effect, a MIL

  5. Influence of RC Element Wiring in Electrical Circuit on Electromechanical Thermostat Contact Wear

    Directory of Open Access Journals (Sweden)

    Haas Peter

    2016-09-01

    Full Text Available Contact wear caused by electric arc during electric contact make (cut-in and break (cut-out has the direct impact on the contact lifetime. The RC element wired parallelly to the contact will eliminate or reduce the arcing and subsequently extend the lifetime. Comparative tests of the two sets of identical Danfoss 077B electromechanical thermostats have been carried out. In the first batch, standard thermostats were tested. In the second batch, the same thermostat types, but with RC elements wired parallel to thermostats main contacts were tested. Measurement has not proven any improvement of the contact wear. Temperature drift and change of the critical dimension caused by contact wear were very similar in the both cases. Thus, the application of RC element is considered not reasonable measure for reduction of contact wear of electromechanical thermostats.

  6. Design of a smart ECG garment based on conductive textile electrode and flexible printed circuit board.

    Science.gov (United States)

    Cai, Zhipeng; Luo, Kan; Liu, Chengyu; Li, Jianqing

    2017-08-09

    A smart electrocardiogram (ECG) garment system was designed for continuous, non-invasive and comfortable ECG monitoring, which mainly consists of four components: Conductive textile electrode, garment, flexible printed circuit board (FPCB)-based ECG processing module and android application program. Conductive textile electrode and FPCB-based ECG processing module (6.8 g, 55 mm × 53 mm × 5 mm) are identified as two key techniques to improve the system's comfort and flexibility. Preliminary experimental results verified that the textile electrodes with circle shape, 40 mm size in diameter, and 5 mm thickness sponge are best suited for the long-term ECG monitoring application. The tests on the whole system confirmed that the designed smart garment can obtain long-term ECG recordings with high signal quality.

  7. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition...... by measuring the leak current using a twin platinum electrode setup. Localized extraction of residue was carried out using a commercial C3 extraction system. Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced...... by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under...

  8. Contamination profile on typical printed circuit board assemblies vs soldering process

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... out using a commercial critical contamination control extraction system. Findings – Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an appropriate cleaning. Selective soldering process generates...... significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under exposure to high humidity levels. Originality/value – Although...

  9. Investigation, development and verification of printed circuit board embedded air-core solenoid transformers

    DEFF Research Database (Denmark)

    Mønster, Jakob Døllner; Madsen, Mickey Pierre; Pedersen, Jeppe Arnsdorf

    2015-01-01

    A new printed circuit board embedded air-core transformer/coupled inductor is proposed and presented. The transformer is intended for use in power converter applications operating at very high frequency between 30 MHz to 300 MHz. The transformer is based on two or more solenoid structures...... in different configurations. The different configurations are compared for usefulness as a transformer solution, and an analytical model of the inductive parameters for the most suitable configuration is derived for design purpose. The analytical model is verified by comparing calculations and measurements...... of prototypes. The analytical model shows good agreement with the measured results. The model can predict the inductive parameters of the transformer with a deviation range of approximately 3 % to 22 %. Lastly a prototype is used in a VHF converter to achieve a rise of 2.2% points in efficiency....

  10. Characteristics and crosstalk of optical waveguides fabricated in polymethyl methacrylate polymer circuit board.

    Science.gov (United States)

    Hamid, Hanan H; Rüter, Christian E; Thiel, David V; Fickenscher, Thomas

    2016-11-10

    Electro-optical circuit boards should provide simple and cost-effective coupling techniques and crosstalk levels of less than -30  dB. A dicing saw was used to create waveguide grooves with a surface roughness of less than 183 nm in a 1.6-mm-thick polymethyl methacrylate polymer (PMMA) substrate. The buried optical waveguides were made from SU-8 in a PMMA substrate covered with a 1-mm PMMA sheet. The propagation loss for a 500  μm×570  μm straight waveguide was 0.9 dB/cm at 1310 nm. The coupling between parallel waveguides was measured at separation distances from 45 to 595 μm. The crosstalk was less than -40  dB for 65-mm-long waveguides. This fabrication method shows potential for dense optical interconnects with very low crosstalk.

  11. Thiourea leaching gold and silver from the printed circuit boards of waste mobile phones.

    Science.gov (United States)

    Jing-ying, Li; Xiu-li, Xu; Wen-quan, Liu

    2012-06-01

    The present communication deals with the leaching of gold and silver from the printed circuit boards (PCBs) of waste mobile phones using an effective and less hazardous system, i.e., a thiourea leaching process as an alternative to the conventional and toxic cyanide leaching of gold. The influence of particle size, thiourea and Fe(3+) concentrations and temperature on the leaching of gold and silver from waste mobile phones was investigated. Gold extraction was found to be enhanced in a PCBs particle size of 100 mesh with the solutions containing 24 g/L thiourea and Fe(3+) concentration of 0.6% under the room temperature. In this case, about 90% of gold and 50% of silver were leached by the reaction of 2h. The obtained data will be useful for the development of processes for the recycling of gold and silver from the PCBs of waste mobile phones. Copyright © 2012 Elsevier Ltd. All rights reserved.

  12. Recovery of Precious and Base Metals from Waste Printed Circuit Boards Using a Sequential Leaching Procedure

    Science.gov (United States)

    Batnasan, Altansukh; Haga, Kazutoshi; Shibayama, Atsushi

    2018-02-01

    This paper considers the issue of recycling of waste printed circuit boards (WPCBs) containing precious and base metals in appreciable amounts. High-pressure oxidative leaching (HPOL) with dilute sulfuric acid resulted in removal of a significant amount of base metals from a WPCB ash sample obtained by incineration at 800°C. The parameters investigated in the precious metal leaching from WPCB residue after HPOL included the sulfuric acid concentration, thiourea concentration, oxidant concentration, leaching temperature, and leaching time. Recovery of gold, silver, and palladium of 100%, 81%, and 13% from the WPCB residue sample was achieved by thiourea leaching under optimized conditions. The results show that the efficiency of precious metal dissolution from the WPCB sample using thiourea solution depended strongly on the concentration of both thiourea and oxidant.

  13. Ductile electroless Ni-P coating onto flexible printed circuit board

    Science.gov (United States)

    Wang, Wenchang; Zhang, Weiwei; Wang, Yurong; Mitsuzak, Naotoshi; Chen, Zhidong

    2016-03-01

    In this study, a ductile electroless Ni-P coating on the flexible printed circuit board (FPCB) was prepared in an acidic nickel plating bath. The addition of dipropylamine (DPA) in electroless plating not only improves the ductility of the Ni-P coating, but also enhances the corrosion resistance. The further analysis reveals that the ductility improvement and enhancement of corrosion resistance for the Ni-P coating may be due to the fact that the addition of DPA significantly refines the volume of columnar nodule and reduce the porosity, thus leading to the released internal stress. In addition, it was found that the nodule within the Ni-P coating grew into a columnar structure, which may be also contribute to the improvement of ductility.

  14. Application of Printed Circuit Board Technology to FT-ICR MS Analyzer Cell Construction and Prototyping

    Energy Technology Data Exchange (ETDEWEB)

    Leach, Franklin E.; Norheim, Randolph V.; Anderson, Gordon A.; Pasa-Tolic, Ljiljana

    2014-12-01

    Although Fourier transform ion cyclotron resonance mass spectrometry (FT-ICRMS) remains themass spectrometry platform that provides the highest levels of performance for mass accuracy and resolving power, there is room for improvement in analyzer cell design as the ideal quadrupolar trapping potential has yet to be generated for a broadband MS experiment. To this end, analyzer cell designs have improved since the field’s inception, yet few research groups participate in this area because of the high cost of instrumentation efforts. As a step towards reducing this barrier to participation and allowing for more designs to be physically tested, we introduce a method of FT-ICR analyzer cell prototyping utilizing printed circuit boards at modest vacuum conditions. This method allows for inexpensive devices to be readily fabricated and tested over short intervals and should open the field to laboratories lacking or unable to access high performance machine shop facilities because of the required financial investment.

  15. Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

    Energy Technology Data Exchange (ETDEWEB)

    Ortuño, Nuria; Conesa, Juan A., E-mail: ja.conesa@ua.es; Moltó, Julia; Font, Rafael

    2014-11-15

    The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO{sub 2005}-TEQ/kg sample, corresponding to the sample with and without metals, respectively. - Highlights: • Thermal decomposition of printed circuit boards (with and without metals) is studied. • Important differences were found at the different experimental conditions. • Emission of brominated pollutants is much higher than that of chlorinated. • Metal enhances emission of halogenated compounds. • An increase in the temperature produces the destruction of pollutants.

  16. Catalytic Pyrolysis and a Pyrolysis Kinetic Study of Shredded Printed Circuit Board for Fuel Recovery

    Directory of Open Access Journals (Sweden)

    Salmiaton Ali

    2014-10-01

    Full Text Available Scrap printed circuit boards (PCBs are the most abundant wastes that can be found in the landfills in Malaysia and this disposal certainly poses serious detrimental to the environment. This research aims to investigate optimum temperature for pyrolyzing waste PCBs, find out the best catalyst to be used in accelerating PCBs’ pyrolysis, select suitable ratio of catalyst to PCBs for higher oil yield and examine kinetics pyrolysis of the waste PCBs’ decomposition. Operating temperatures ranged from 200 to 350 ˚C of PCB’s pyrolysis were conducted with the optimum temperature obtained was 275 ˚C. Fluid cata-lytic cracking (FCC catalyst, zeolite socony mobil-5 (ZSM-5, H-Y-type zeolite and dolomite were used to accelerate PCB’s pyrolysis at 275 ˚C and FCC was identified as the best catalyst to be used. Differ-ent ratios of FCC to waste PCBs such as 10:90, 20:80, 30:70, 40:60 and 50:50 were applied in the pyro-lysis at 275 ˚C and ratio of 10:90 was selected as the suitable ratio to be utilized for maximum yield. The kinetic study was done through thermogravimetric analysis on waste PCBs under various heating rates and different particle sizes. The GC-MS analysis revealed that compounds detected in the pyro-oil have the potential to be used as fuel. © 2014 BCREC UNDIP. All rights reservedReceived: 23rd July 2014; Revised: 14th August 2014; Accepted: 14th August 2014 How to Cite: Ng, C.H., Salmiaton, A., Hizam, H. (2014. Catalytic Pyrolysis and a Pyrolysis Kinetic Study of Shredded Printed Circuit Board for Fuel Recovery. Bulletin of Chemical Reaction Engineering & Catalysis, 9 (3: 224-240. (doi:10.9767/bcrec.9.3.7148.224-240 Permalink/DOI: http://dx.doi.org/10.9767/bcrec.9.3.7148.224-240

  17. Exhaust constituent emission factors of printed circuit board pyrolysis processes and its exhaust control

    Energy Technology Data Exchange (ETDEWEB)

    Chiang, Hung-Lung, E-mail: hlchiang@mail.cmu.edu.tw [Department of Health Risk Management, China Medical University, Taichung, Taiwan (China); Lin, Kuo-Hsiung [Department of Environmental Engineering and Science, Fooyin University, Kaohsiung, Taiwan (China)

    2014-01-15

    Highlights: • Recycling of waste printed circuit boards is an important issue. • Pyrolysis is an emerging technology for PCB treatment. • Emission factors of VOCs are determined for PCB pyrolysis exhaust. • Iron-Al{sub 2}O{sub 3} catalyst was employed for the exhaust control. -- Abstract: The printed circuit board (PCB) is an important part of electrical and electronic equipment, and its disposal and the recovery of useful materials from waste PCBs (WPCBs) are key issues for waste electrical and electronic equipment. Waste PCB compositions and their pyrolysis characteristics were analyzed in this study. In addition, the volatile organic compound (VOC) exhaust was controlled by an iron-impregnated alumina oxide catalyst. Results indicated that carbon and oxygen were the dominant components (hundreds mg/g) of the raw materials, and other elements such as nitrogen, bromine, and copper were several decades mg/g. Exhaust constituents of CO, H{sub 2}, CH{sub 4}, CO{sub 2}, and NOx, were 60–115, 0.4–4.0, 1.1–10, 30–95, and 0–0.7 mg/g, corresponding to temperatures ranging from 200 to 500 °C. When the pyrolysis temperature was lower than 300 °C, aromatics and paraffins were the major species, contributing 90% of ozone precursor VOCs, and an increase in the pyrolysis temperature corresponded to a decrease in the fraction of aromatic emission factors. Methanol, ethylacetate, acetone, dichloromethane, tetrachloromethane and acrylonitrile were the main species of oxygenated and chlorinated VOCs. The emission factors of some brominated compounds, i.e., bromoform, bromophenol, and dibromophenol, were higher at temperatures over 400 °C. When VOC exhaust was flowed through the bed of Fe-impregnated Al{sub 2}O{sub 3}, the emission of ozone precursor VOCs could be reduced by 70–80%.

  18. Preparation and characterization of superconductor thin films for application in printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Souza, G.A.; Carvalho, C.L.; Torsoni, G.B.; Rodrigues, V.D.; Souza, E.J.; Zadorosny, R. [UNESP, Ilha Solteira, SP (Brazil). Fac. de Engenharia. Grupo de Desenvolvimento e Aplicacoes de Materiais (GDAM)

    2011-07-01

    Full text: Since the discovery of high temperature superconductors (HTS) many studies have been performed, in terms to discover new materials with higher critical temperature and its potential applications. Technological advances have induced to use superconductor materials in the development of new devices that have higher processing speed, storage capacity and are miniaturized, what may imply in great evolution in the electronic area. Thinking about that advances and looking to supply some requirements, this work proposed to prepare a printed circuit board (PCB) with a superconductor thin film using an inexpensive and conventional photographic method. This work was divided in two steps: synthesis of the precursor solution and film preparation for superconductor printed circuit. In the preparation of superconductor thin film was considered to use the 2223 phase of the BSCCO system, which has been doped with Pb (BPSCCO) for stabilizing the same, and it presents a critical temperature around 110 K. This film was prepared from a precursor solution based on similar method developed by M. P. Pechini. The printed circuit was created by the photographic method of heat transfer which consisted of creation a circuit layout, with different dimensions and printed on photo paper (Epson S041140). The layout was transferred to the FR4 printed copper clad laminate was made with the household clothes iron. The precursor solution was deposited on Si substrate by spin-coating. The control of film thickness was performed by the deposition number that in this case was done five subsequent depositions to obtain an ideal thickness. Between each deposition the film was submitted to calcinations in order to eliminate organic matter. After that the film was submitted a heat treatment around 820 deg C / 5 minutes to obtain the expected superconducting phase and coupling and the grain growth. Film characterizations were made using optical microscopy, XRD and EDX, to check the dimensions and

  19. Adhesion and failure analysis of metal-polymer interface in flexible printed circuits boards

    Science.gov (United States)

    Park, Sanghee; Kim, Ye Chan; Choi, Kisuk; Chae, Heeyop; Suhr, Jonghwan; Nam, Jae-Do

    2017-12-01

    As device miniaturization in microelectronics is currently requested in the development of high performance device, which usually include highly-integrated metal-polyimide multilayer structures. A redistribution layer (RDL) process is currently emerging as one of the most advance fabrication techniques for on-chip interconnect and packaging. One of the major issues in this process is the poor adhesion of the metal-polyimide interfaces particularly in flexible circuit boards due to the flexibility and bendability of devices. In this study, low pressure O2 plasma treatment was investigated to improve the adhesion of metal-polyimide interfaces, using inductively coupled plasma (ICP) treatment. We identified that the adhesion of metal-polyimide interfaces was greatly improved by the surface roughness control providing 46.1 MPa of shear force in the ball shear test after O2 plasma treatment, compared 14.2 MPa without O2 plasma treatment. It was seemingly due to the fact that the adhesion in metal-polyimide interfaces was improved by a chemical conversion of C=O to C-O bonds and by a ring opening reaction of imide groups, which was confirmed with FT-IR analysis. In the finite element numerical analysis of metal-polyimide interfaces, the O2 plasma treated interface showed that the in-plane stress distribution and the vertical directional deformation agreed well with real failure modes in flexible circuits manufacturing.

  20. Life cycle assessment of a printed circuit board manufacturing plant in Turkey.

    Science.gov (United States)

    Ozkan, Elif; Elginoz, Nilay; Germirli Babuna, Fatos

    2017-09-29

    The objective of this study is to investigate the environmental impacts of a printed circuit board (PCB) manufacturing plant through streamlined life cycle assessment approach. As a result, the most effective recommendations on minimizing the environmental impacts for the mentioned sector are revealed and first steps towards establishing a country specific database are taken. The whole PCB production consists of two consecutive stages: namely board fabrication followed by the manufacturing of PCB. Manufacturing of PCB contributes the highest shares to freshwater aquatic ecotoxicity potential (FAETP) and ozone layer depletion potential (ODP). Eighty-nine percent of FAETP is found to be generated from the manufacturing of PCB. Almost all of this contribution can be attributed to the disposal of copper containing wastewater treatment sludge from etching operations to incineration. On the other hand, PCB manufacturing has 73% share in total ODP. Within the manufacturing of PCB, as etching operations are found to be of importance for all the impact categories except eutrophication potential (EP), it is recommended to focus further studies on in-plant control of etching.

  1. SOURCES OF COPPER IONS AND SELECTED METHODS OF THEIR REMOVAL FROM WASTEWATER FROM THE PRINTED CIRCUITS BOARD PRODUCTION

    Directory of Open Access Journals (Sweden)

    Maciej Thomas

    2014-10-01

    Full Text Available This paper presents the issues related to the presence and removal of copper compounds from industrial effluents with including wastewater from plants involved in the production of printed circuit boards. Characterized the toxicological properties of selected copper compounds, described the applicable technological processes, sources of copper ions in the effluents and selected methods for their removal.

  2. Printed Circuit Boards with Integrated Heat Carrier Channels for Deep Geothermal Resources

    Science.gov (United States)

    Krühn, T.; Overmeyer, L.

    2012-04-01

    The exploration of deep geothermal resources is still very expensive. A large amount of these costs is caused by the drilling process. The high price results from a high failure risk, slow drilling progress and a large amount of manual work. To develop deep heat mining to a sizeable contribution to the European energy portfolio, the exploration process has to become a lot cheaper. One step to achieve lower costs is to monitor and automate the drilling process. Therefore, electronic components such as sensors and data processing units must be integrated into the Bottom Hole Assembly (BHA). The integration of electronics into the BHA faces the challenge of high ambient temperatures. The project "Packaging of Electronic Components for High Temperature Applications" within the "Geothermal Energy and High Performance-Drilling Collaborative Research Program (gebo)" develops a system of heat carrier channels integrated in printed circuit boards (PCB). These channels can be perfused with fluids such as water, oil or gas and provide high heat convection rates. Such PCBs will be able to withstand high ambient temperatures up to 250 °C. We have simulated, manufactured and are currently testing prototype boards with integrated heat carrier channels featuring a thickness of only 1.6 mm. As a simulation scenario, we chose a board measuring 25 mm x 100 mm, dimensions suitable for integration into a BHA. An ambient temperature of 250 °C was used. The simulation results presented in this contribution illustrate that cooling of the whole board as well as cooling of hotspots is possible. The cooling channel layout being the key for high convection rates was meticulously studied and optimized. Parameters such as necessary flow rate and fluid pressure were adjusted accordingly. Preliminary experiments validate the demonstrated and discussed simulation results. With the proposed cooling system, it is possible to integrate microelectronic components into the BHA for drilling

  3. Evaluation of gold and silver leaching from printed circuit board of cellphones

    Energy Technology Data Exchange (ETDEWEB)

    Petter, P.M.H., E-mail: patymhp@yahoo.com.br; Veit, H.M.; Bernardes, A.M.

    2014-02-15

    Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na{sub 2}S{sub 2}O{sub 3} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO{sub 3}were made. The leaching of Au and Ag with alternative reagents: Na{sub 2}S{sub 2}O{sub 3,} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} in 0.1 M concentration with the addition of CuSO{sub 4}, NH{sub 4}OH, and H{sub 2}O{sub 2}, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO{sub 4} was added.

  4. Generation of copper rich metallic phases from waste printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Cayumil, R. [Centre for Sustainable Materials Research and Technology (SMaRT), School of Materials Science and Engineering, The University of New South Wales, Sydney, NSW 2052 (Australia); Khanna, R., E-mail: ritakhanna@unsw.edu.au [Centre for Sustainable Materials Research and Technology (SMaRT), School of Materials Science and Engineering, The University of New South Wales, Sydney, NSW 2052 (Australia); Ikram-Ul-Haq, M.; Rajarao, R. [Centre for Sustainable Materials Research and Technology (SMaRT), School of Materials Science and Engineering, The University of New South Wales, Sydney, NSW 2052 (Australia); Hill, A. [CSIRO Process Science and Engineering, Clayton, Melbourne, VIC 3168 (Australia); Sahajwalla, V. [Centre for Sustainable Materials Research and Technology (SMaRT), School of Materials Science and Engineering, The University of New South Wales, Sydney, NSW 2052 (Australia)

    2014-10-15

    Highlights: • Recycling and material recovery from waste printed circuit boards is very complex. • Thermoset polymers, ceramics and metals are present simultaneously in waste PCBs. • Heat treatment of PCBs was carried out at 1150 °C under inert conditions. • Various metallic phases could be segregated out as copper based metallic droplets. • Carbon and ceramics residues can be further recycled in a range of applications. - Abstract: The rapid consumption and obsolescence of electronics have resulted in e-waste being one of the fastest growing waste streams worldwide. Printed circuit boards (PCBs) are among the most complex e-waste, containing significant quantities of hazardous and toxic materials leading to high levels of pollution if landfilled or processed inappropriately. However, PCBs are also an important resource of metals including copper, tin, lead and precious metals; their recycling is appealing especially as the concentration of these metals in PCBs is considerably higher than in their ores. This article is focused on a novel approach to recover copper rich phases from waste PCBs. Crushed PCBs were heat treated at 1150 °C under argon gas flowing at 1 L/min into a horizontal tube furnace. Samples were placed into an alumina crucible and positioned in the cold zone of the furnace for 5 min to avoid thermal shock, and then pushed into the hot zone, with specimens exposed to high temperatures for 10 and 20 min. After treatment, residues were pulled back to the cold zone and kept there for 5 min to avoid thermal cracking and re-oxidation. This process resulted in the generation of a metallic phase in the form of droplets and a carbonaceous residue. The metallic phase was formed of copper-rich red droplets and tin-rich white droplets along with the presence of several precious metals. The carbonaceous residue was found to consist of slag and ∼30% carbon. The process conditions led to the segregation of hazardous lead and tin clusters in the

  5. Generation of copper rich metallic phases from waste printed circuit boards

    International Nuclear Information System (INIS)

    Cayumil, R.; Khanna, R.; Ikram-Ul-Haq, M.; Rajarao, R.; Hill, A.; Sahajwalla, V.

    2014-01-01

    Highlights: • Recycling and material recovery from waste printed circuit boards is very complex. • Thermoset polymers, ceramics and metals are present simultaneously in waste PCBs. • Heat treatment of PCBs was carried out at 1150 °C under inert conditions. • Various metallic phases could be segregated out as copper based metallic droplets. • Carbon and ceramics residues can be further recycled in a range of applications. - Abstract: The rapid consumption and obsolescence of electronics have resulted in e-waste being one of the fastest growing waste streams worldwide. Printed circuit boards (PCBs) are among the most complex e-waste, containing significant quantities of hazardous and toxic materials leading to high levels of pollution if landfilled or processed inappropriately. However, PCBs are also an important resource of metals including copper, tin, lead and precious metals; their recycling is appealing especially as the concentration of these metals in PCBs is considerably higher than in their ores. This article is focused on a novel approach to recover copper rich phases from waste PCBs. Crushed PCBs were heat treated at 1150 °C under argon gas flowing at 1 L/min into a horizontal tube furnace. Samples were placed into an alumina crucible and positioned in the cold zone of the furnace for 5 min to avoid thermal shock, and then pushed into the hot zone, with specimens exposed to high temperatures for 10 and 20 min. After treatment, residues were pulled back to the cold zone and kept there for 5 min to avoid thermal cracking and re-oxidation. This process resulted in the generation of a metallic phase in the form of droplets and a carbonaceous residue. The metallic phase was formed of copper-rich red droplets and tin-rich white droplets along with the presence of several precious metals. The carbonaceous residue was found to consist of slag and ∼30% carbon. The process conditions led to the segregation of hazardous lead and tin clusters in the

  6. Quantum interference and manipulation of entanglement in silicon wire waveguide quantum circuits

    International Nuclear Information System (INIS)

    Bonneau, D; Engin, E; O'Brien, J L; Thompson, M G; Ohira, K; Suzuki, N; Yoshida, H; Iizuka, N; Ezaki, M; Natarajan, C M; Tanner, M G; Hadfield, R H; Dorenbos, S N; Zwiller, V

    2012-01-01

    Integrated quantum photonic waveguide circuits are a promising approach to realizing future photonic quantum technologies. Here, we present an integrated photonic quantum technology platform utilizing the silicon-on-insulator material system, where quantum interference and the manipulation of quantum states of light are demonstrated in components orders of magnitude smaller than previous implementations. Two-photon quantum interference is presented in a multi-mode interference coupler, and the manipulation of entanglement is demonstrated in a Mach-Zehnder interferometer, opening the way to an all-silicon photonic quantum technology platform. (paper)

  7. En masse pyrolysis of flexible printed circuit board wastes quantitatively yielding environmental resources.

    Science.gov (United States)

    Kim, Jang Won; Lee, Albert S; Yu, Seunggun; Han, Jeong Whan

    2018-01-15

    This paper reports the recycling of flexible printed circuit board (FPCB) waste through carbonization of polyimide by dual pyrolysis processes. The organic matter was recovered as pyrolyzed oil at low temperatures, while valuable metals and polyimide-derived carbon were effectively recovered through secondary high temperature pyrolysis. The major component of organics extracted from FPCB waste comprised of epoxy resins were identified as pyrolysis oils containing bisphenol-A. The valuable metals (Cu, Ni, Ag, Sn, Au, Pd) in waste FPCB were recovered as granular shape and quantitatively analyzed via ICP-OES. In attempt to produce carbonaceous material with increased degree of graphitization at low heat-treatment conditions, the catalytic effect of transition metals within FPCB waste was investigated for the efficient carbonization of polyimide films. The morphology of the carbon powder was observed by scanning electron microscopy and graphitic carbonization was investigated with X-ray analysis. The protocols outlined in this study may allow for propitious opportunities to salvage both organic and inorganic materials from FPCB waste products for a sustainable future. Copyright © 2017 Elsevier B.V. All rights reserved.

  8. PVC-based composite material containing recycled non-metallic printed circuit board (PCB) powders.

    Science.gov (United States)

    Wang, Xinjie; Guo, Yuwen; Liu, Jingyang; Qiao, Qi; Liang, Jijun

    2010-12-01

    The study is directed to the use of non-metallic powders obtained from comminuted recycled paper-based printed circuit boards (PCBs) as an additive to polyvinyl chloride (PVC) substrate. The physical properties of the non-metallic PCB (NMPCB) powders were measured, and the morphological, mechanical and thermal properties of the NMPCB/PVC composite material were investigated. The results show that recycled NMPCB powders, when added below a threshold, tended to increase the tensile strength and bending strength of PVC. When 20 wt% NMPCB powders (relative to the substrate PVC) of an average diameter of 0.08 mm were added, the composite tensile strength and bending strength reached 22.6 MPa and 39.83 MPa, respectively, representing 107.2% and 123.1% improvement over pure PVC. The elongation at break of the composite material reached 151.94% of that of pure PVC, while the Vicat softening temperature of the composite material did not increase significantly compared to the pure PVC. The above results suggest that paper-based NMPCB powders, when used at appropriate amounts, can be effective for toughening PVC. Thus, this study suggests a new route for reusing paper-based NMPCB, which may have a significant beneficial environmental impact. Copyright © 2010 Elsevier Ltd. All rights reserved.

  9. Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation.

    Science.gov (United States)

    Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Arpád; Ilea, Petru

    2014-05-30

    The present study aims to develop an eco-friendly chemical-electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75kWh/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples. Copyright © 2014 Elsevier B.V. All rights reserved.

  10. Comparative study on copper leaching from waste printed circuit boards by typical ionic liquid acids.

    Science.gov (United States)

    Chen, Mengjun; Huang, Jinxiu; Ogunseitan, Oladele A; Zhu, Nengming; Wang, Yan-min

    2015-07-01

    Waste printed circuit boards (WPCBs) are attracting increasing concerns because the recovery of its content of valuable metallic resources is hampered by the presence of hazardous substances. In this study, we used ionic liquids (IL) to leach copper from WPCBs. [BSO3HPy]OTf, [BSO3HMIm]OTf, [BSO4HPy]HSO4, [BSO4HMim]HSO4 and [MIm]HSO4 were selected. Factors that affect copper leaching rate were investigated in detail and their leaching kinetics were also examined with the comparison of [Bmim]HSO4. The results showed that all six IL acids could successfully leach copper out, with near 100% recovery. WPCB particle size and leaching time had similar influences on copper leaching performance, while IL acid concentration, hydrogen peroxide addition, solid to liquid ratio, temperature, showed different influences. Moreover, IL acid with HSO4(-) was more efficient than IL acid with CF3SO3(-). These six IL acids indicate a similar behavior with common inorganic acids, except temperature since copper leaching rate of some IL acids decreases with its increase. The results of leaching kinetics studies showed that diffusion plays a more important role than surface reaction, whereas copper leaching by inorganic acids is usually controlled by surface reaction. This innovation provides a new option for recovering valuable materials such as copper from WPCBs. Copyright © 2015 Elsevier Ltd. All rights reserved.

  11. Leaching of metals from large pieces of printed circuit boards using citric acid and hydrogen peroxide.

    Science.gov (United States)

    Jadhav, Umesh; Su, C; Hocheng, Hong

    2016-12-01

    In the present study, the leaching of metals from large pieces of computer printed circuit boards (CPCBs) was studied. A combination of citric acid (0.5 M) and 1.76 M hydrogen peroxide (H 2 O 2 ) was used to leach the metals from CPCB piece. The influence of system variables such as H 2 O 2 concentration, concentration of citric acid, shaking speed, and temperature on the metal leaching process was investigated. The complete metal leaching was achieved in 4 h from a 4 × 4 cm CPCB piece. The presence of citric acid and H 2 O 2 together in the leaching solution is essential for complete metal leaching. The optimum addition amount of H 2 O 2 was 5.83 %. The citric acid concentration and shaking speed had an insignificant effect on the leaching of metals. The increase in the temperature above 30 °C showed a drastic effect on metal leaching process.

  12. Tetrabromobisphenol A contamination and emission in printed circuit board production and implications for human exposure.

    Science.gov (United States)

    Zhou, Xiaoyu; Guo, Jie; Zhang, Wei; Zhou, Peng; Deng, Jingjing; Lin, Kuangfei

    2014-05-30

    The emission of and exposure to tetrabromobisphenol A (TBBPA) during the production of printed circuit boards (PCBs) were evaluated in this study. TBBPA was determined in production wastes (fine solid waste, rinsing water, effluent and sludge) and environmental samples (dust and PM10) from a typical PCB plant. The TBBPA concentrations of the solid and liquid wastes were on the order of 10(2)-10(4)ng/g and 10(1)-10(2)ng/L, respectively. The highest emission to the environment was exhibited by the fine solid waste (187-1220μg/kg-PCB), suggesting the need for strict control of its production and disposal. Regarding the environmental samples, the TBBPA contents of dust (125-9090ng/g) and PM10 (12.3-1640pg/m(3)) were higher than other values reported worldwide, indicating that PCB production was a non-negligible source of TBBPA for the occupational environment. TBBPA contamination mainly occurred in the form of sedimentary dust rather than suspended particulate matter. According to our estimation, worker exposures to TBBPA via dust ingestion, dust dermal absorption and PM10 inhalation varied widely by process, with the greatest exposures being 1930, 431 and 96.5pg/kg-bw/day, respectively. The exposure via dust represented most of the overall exposure via the above three pathways in PCB workshops. Copyright © 2014 Elsevier B.V. All rights reserved.

  13. Two-step bioleaching of copper and gold from discarded printed circuit boards (PCB).

    Science.gov (United States)

    Işıldar, Arda; van de Vossenberg, Jack; Rene, Eldon R; van Hullebusch, Eric D; Lens, Piet N L

    2016-11-01

    An effective strategy for environmentally sound biological recovery of copper and gold from discarded printed circuit boards (PCB) in a two-step bioleaching process was experimented. In the first step, chemolithotrophic acidophilic Acidithiobacillus ferrivorans and Acidithiobacillus thiooxidans were used. In the second step, cyanide-producing heterotrophic Pseudomonas fluorescens and Pseudomonas putida were used. Results showed that at a 1% pulp density (10g/L PCB concentration), 98.4% of the copper was bioleached by a mixture of A. ferrivorans and A. thiooxidans at pH 1.0-1.6 and ambient temperature (23±2°C) in 7days. A pure culture of P. putida (strain WCS361) produced 21.5 (±1.5)mg/L cyanide with 10g/L glycine as the substrate. This gold complexing agent was used in the subsequent bioleaching step using the Cu-leached (by A. ferrivorans and A. thiooxidans) PCB material, 44.0% of the gold was mobilized in alkaline conditions at pH 7.3-8.6, and 30°C in 2days. This study provided a proof-of-concept of a two-step approach in metal bioleaching from PCB, by bacterially produced lixiviants. Copyright © 2015 Elsevier Ltd. All rights reserved.

  14. Disposing and recycling waste printed circuit boards: disconnecting, resource recovery, and pollution control.

    Science.gov (United States)

    Wang, Jianbo; Xu, Zhenming

    2015-01-20

    Over the past decades, China has been suffering from negative environmental impacts from distempered e-waste recycling activities. After a decade of effort, disassembly and raw materials recycling of environmentally friendly e-waste have been realized in specialized companies, in China, and law enforcement for illegal activities of e-waste recycling has also been made more and more strict. So up to now, the e-waste recycling in China should be developed toward more depth and refinement to promote industrial production of e-waste resource recovery. Waste printed circuit boards (WPCBs), which are the most complex, hazardous, and valuable components of e-waste, are selected as one typical example in this article that reviews the status of related regulations and technologies of WPCBs recycling, then optimizes, and integrates the proper approaches in existence, while the bottlenecks in the WPCBs recycling system are analyzed, and some preliminary experiments of pinch technologies are also conducted. Finally, in order to provide directional guidance for future development of WPCBs recycling, some key points in the WPCBs recycling system are proposed to point towards a future trend in the e-waste recycling industry.

  15. Supergravity separation of Pb and Sn from waste printed circuit boards at different temperatures

    Science.gov (United States)

    Meng, Long; Wang, Zhe; Zhong, Yi-wei; Chen, Kui-yuan; Guo, Zhan-cheng

    2018-02-01

    Printed circuit boards (PCBs) contain many toxic substances as well as valuable metals, e.g., lead (Pb) and tin (Sn). In this study, a novel technology, named supergravity, was used to separate different mass ratios of Pb and Sn from Pb-Sn alloys in PCBs. In a supergravity field, the liquid metal phase can permeate from solid particles. Hence, temperatures of 200, 280, and 400°C were chosen to separate Pb and Sn from PCBs. The results depicted that gravity coefficient only affected the recovery rates of Pb and Sn, whereas it had little effect on the mass ratios of Pb and Sn in the obtained alloys. With an increase in gravity coefficient, the recovery values of Pb and Sn in each step of the separation process increased. In the single-step separation process, the mass ratios of Pb and Sn in Pb-Sn alloys were 0.55, 0.40, and 0.64 at 200, 280, and 400°C, respectively. In the two-step separation process, the mass ratios were 0.12 and 0.55 at 280 and 400°C, respectively. Further, the mass ratio was observed to be 0.76 at 400°C in the three-step separation process. This process provides an innovative approach to the recycling mechanism of Pb and Sn from PCBs.

  16. Pyrolysis characteristics of the mixture of printed circuit board scraps and coal powder.

    Science.gov (United States)

    Hao, Juan; Wang, Haifeng; Chen, Shuhe; Cai, Bin; Ge, Linhan; Xia, Wencheng

    2014-10-01

    Thermogravimetric (TG) analysis and infrared spectroscopy were used to analyze the pyrolysis characteristics of printed circuit board scraps (PCBs), coal powder and their mixtures under nitrogen atmosphere. The experimental results show that there is a large difference between waste PCBs and coal powder in pyrolysis processing. The pyrolysis properties of the mixing samples are the result of interaction of the PCBs and coal powder, which is influenced by the content of mixture. The degree of pyrolysis and pyrolysis properties of the mixture are much better than that of the single component. The TG and the differential thermogravimetric (DTG) curves of the PCBs mixed with coal powder move towards the high-temperature zone with increasing amount of coal powder and subsequently the DTG peak also becomes wider. The Coats-Redfern integral method was used to determine the kinetic parameters of pyrolysis reaction mechanism with the different proportion of mixture. The gas of pyrolysis mainly composes of CO2, CO, H2O and some hydrocarbon. The bromide characteristic absorption peak has been detected obviously in the pyrolysis gas of PCBs. On the contrary, the absorption peak of the bromide is not obvious in pyrolysis gas of the PCBs samples adding 40% coal powder. Copyright © 2013 Elsevier Ltd. All rights reserved.

  17. Corrosion Behavior of Silver-Plated Circuit Boards in a Simulated Marine Environment with Industrial Pollution.

    Science.gov (United States)

    Xiao, Kui; Yi, Pan; Yan, Lidan; Bai, Ziheng; Dong, Chaofang; Dong, Pengfei; Gao, Xiong

    2017-07-06

    The electrochemical corrosion behavior of a silver-plated circuit board (PCB-ImAg) in a polluted marine atmosphere environment (Qingdao in China) is studied through a simulated experiment. The morphologies of PCB-ImAg show some micropores on the surface that act as the corrosion-active points in the tests. Cl - mainly induces microporous corrosion, whereas SO₂ causes general corrosion. Notably, the silver color changes significantly under SO₂ influence. EIS results show that the initial charge transfer resistance in the test containing SO₂ and Cl - is 9.847 × 10³, while it is 3.701 × 10⁴ in the test containing Cl - only, which demonstrates that corrosion accelerates in a mixed atmosphere. Polarization curves further show that corrosion potential is lower in mixed solutions (between -0.397 V SCE and -0.214 V SCE) than it in the solution containing Cl - only (-0.168 V SCE), indicating that corrosion tendency increases with increased HSO₃ - concentration.

  18. Quantitative Leaching of a Spent Cell Phone Printed Circuit Board by Hydrochloric acid

    Directory of Open Access Journals (Sweden)

    Alafara A. Baba

    2014-07-01

    Full Text Available This paper presents a kinetic data on the hydrometallurgical recovery of some metal ions from a printed circuit board (PCB of a spent cell phone by hydrochloric acid leaching. The effects of acid concentration, temperature and particle diameter on the dissolution efficiency at various leaching time intervals were examined. The results of the leaching investigations showed that the powdered cell phone dissolution increases with increasing acid concentration, system temperature with decreasing particle diameter at 360 rpm. With 2M HCl solution, about 88.49% of the sample was dissolved within 120 minutes using 0.075-0.112 mm particle diameter at 800 C. The results of the study indicated that the dissolution reaction could be represented by a shrinking core model with surface chemical reaction. A value of 0.61, 60.67 kJ/mol and 12.9s-1 were calculated as reaction order, activation energy and frequency factor, respectively for the dissolution process.

  19. Leaching of gold, silver and accompanying metals from circuit boards (PCBs waste

    Directory of Open Access Journals (Sweden)

    Jana Ficeriová

    2011-12-01

    Full Text Available Au-Ag noble metal wastes represent a wide range of waste types and forms, with various accompanying metallic elements.The presented leaching strategy for Au-Ag contained in circuit boards (PCBs aims at gaining gold and silver in the metallic form.Application of the proposed ammonium thiosulphate leaching process for the treatment of the above mentioned Au-Ag containing wastesrepresents a practical, economic and at the same time an ecological solution. The ammonium thiosulphate based leaching of gold and silverfrom PCBs waste, using crushing as a pretreatment, was investigated. It was possible to achieve 98 % gold and 93 % silver recovery within48 hours of ammonium thiosulphate leaching. This type of leaching is a better leaching procedure for recovery of gold and silver from PCBwaste than the classical toxic cyanide leaching. 84 % Cu, 82 % Fe, 77 % Al, 76 % Zn, 70 % Ni, 90 % Pd, 88 % Pb and 83 % Sn recovery ofthe accompanying metals was achieved, using sulphuric acid with hydrogen peroxide, sodium chloride and aqua regia. A four steps leachingprocess gave a very satisfactory yield and a more rapid kinetics for all observed metals solubilization than other technologies.

  20. Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

    Energy Technology Data Exchange (ETDEWEB)

    Fogarasi, Szabolcs [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Imre-Lucaci, Florica [“Babeş-Bolyai” University, Interdisciplinary Research Institute on Bio-Nano-Sciences, 42 Treboniu Laurian Street, Cluj-Napoca RO-400271 (Romania); Imre-Lucaci, Árpád, E-mail: aimre@chem.ubbcluj.ro [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Ilea, Petru [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania)

    2014-05-01

    Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples.

  1. Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

    International Nuclear Information System (INIS)

    Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Árpád; Ilea, Petru

    2014-01-01

    Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples

  2. Corrosion Behavior of Silver-Plated Circuit Boards in a Simulated Marine Environment with Industrial Pollution

    Directory of Open Access Journals (Sweden)

    Kui Xiao

    2017-07-01

    Full Text Available The electrochemical corrosion behavior of a silver-plated circuit board (PCB-ImAg in a polluted marine atmosphere environment (Qingdao in China is studied through a simulated experiment. The morphologies of PCB-ImAg show some micropores on the surface that act as the corrosion-active points in the tests. Cl− mainly induces microporous corrosion, whereas SO2 causes general corrosion. Notably, the silver color changes significantly under SO2 influence. EIS results show that the initial charge transfer resistance in the test containing SO2 and Cl− is 9.847 × 103, while it is 3.701 × 104 in the test containing Cl− only, which demonstrates that corrosion accelerates in a mixed atmosphere. Polarization curves further show that corrosion potential is lower in mixed solutions (between −0.397 V SCE and −0.214 V SCE than it in the solution containing Cl− only (−0.168 V SCE, indicating that corrosion tendency increases with increased HSO3− concentration.

  3. Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

    Science.gov (United States)

    Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

    2018-03-01

    Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

  4. Separation of the metallic and non-metallic fraction from printed circuit boards employing green technology

    Energy Technology Data Exchange (ETDEWEB)

    Estrada-Ruiz, R.H., E-mail: rhestrada@itsaltillo.edu.mx; Flores-Campos, R., E-mail: rcampos@itsaltillo.edu.mx; Gámez-Altamirano, H.A., E-mail: hgamez@itsaltillo.edu.mx; Velarde-Sánchez, E.J., E-mail: ejvelarde@itsaltillo.edu.mx

    2016-07-05

    Highlights: • Small sizes of particles are required in order to separate the different fractions. • Inverse flotation process is an efficient green technology to separate fractions. • Superficial air velocity is the main variable in the inverse flotation process. • Inverse flotation is a green process because the pulṕs pH is 7.0 during the test. - Abstract: The generation of electrical and electronic waste is increasing day by day; recycling is attractive because of the metallic fraction containing these. Nevertheless, conventional techniques are highly polluting. The comminution of the printed circuit boards followed by an inverse flotation process is a clean technique that allows one to separate the metallic fraction from the non-metallic fraction. It was found that particle size and superficial air velocity are the main variables in the separation of the different fractions. In this way an efficient separation is achieved by avoiding the environmental contamination coupled with the possible utilization of the different fractions obtained.

  5. Fast copper extraction from printed circuit boards using supercritical carbon dioxide.

    Science.gov (United States)

    Calgaro, C O; Schlemmer, D F; da Silva, M D C R; Maziero, E V; Tanabe, E H; Bertuol, D A

    2015-11-01

    Technological development and intensive marketing support the growth in demand for electrical and electronic equipment (EEE), for which printed circuit boards (PCBs) are vital components. As these devices become obsolete after short periods, waste PCBs present a problem and require recycling. PCBs are composed of ceramics, polymers, and metals, particularly Cu, which is present in highest percentages. The aim of this study was to develop an innovative method to recover Cu from the PCBs of old mobile phones, obtaining faster reaction kinetics by means of leaching with supercritical CO2 and co-solvents. The PCBs from waste mobile phones were characterized, and evaluation was made of the reaction kinetics during leaching at atmospheric pressure and using supercritical CO2 with H2O2 and H2SO4 as co-solvents. The results showed that the PCBs contained 34.83 wt% of Cu. It was found that the supercritical extraction was 9 times faster, compared to atmospheric pressure extraction. After 20 min of supercritical leaching, approximately 90% of the Cu contained in the PCB was extracted using a 1:20 solid:liquid ratio and 20% of H2O2 and H2SO4 (2.5 M). These results demonstrate the efficiency of the process. Therefore the supercritical CO2 employment in the PCBs recycling is a promising alternative and the CO2 is environmentally acceptable and reusable. Copyright © 2015 Elsevier Ltd. All rights reserved.

  6. Characterization of Printed Circuit Boards for Metal and Energy Recovery after Milling and Mechanical Separation

    Directory of Open Access Journals (Sweden)

    Waldir A. Bizzo

    2014-06-01

    Full Text Available The proper disposal of electrical and electronic waste is currently a concern of researchers and environmental managers not only because of the large volume of such waste generated, but also because of the heavy metals and toxic substances it contains. This study analyzed printed circuit boards (PCBs from discarded computers to determine their metal content and characterized them as solid waste and fuel. The analysis showed that PCBs consist of approximately 26% metal, made up mainly of copper, lead, aluminum, iron and tin, as well as other heavy metals such as cadmium and nickel. Comparison with the results of other studies indicated that the concentration of precious metals (gold and silver has declined over time. Analysis of the leachate revealed high concentrations of cadmium and lead, giving the residue the characteristics of hazardous waste. After milling the PCBs, we found that larger amounts of metal were concentrated in smaller fractions, while the lightest fraction, obtained by density separation, had a gross calorific value of approximately 11 MJ/kg, although with a high ash content. Milling followed by density separation proved potentially useful for recovery of metals and energy-rich fractions.

  7. Pressure leaching of metals from waste printed circuit boards using sulfuric acid

    Science.gov (United States)

    Jha, Manis K.; Lee, Jae-Chun; Kumari, Archana; Choubey, Pankaj K.; Kumar, Vinay; Jeong, Jinki

    2011-08-01

    Printed circuit boards (PCBs) are essential components of electronic equipments which contain various metallic values. This paper reports a hydrometallurgical recycling process for waste PCBs, which consists of the novel pretreatment consisting of organic swelling of PCBs followed by sulfuric acid leaching of metals from waste PCBs. To recycle the waste PCBs, experiments were carried out for the recovery of copper from the crushed and organic swelled materials of waste PCBs using sulfuric acid leaching in presence of hydrogen peroxide under atmospheric and pressure condition. The leaching of PCBs at 90°C, pulp density 100 g/L under atmospheric condition, using 6M sulfuric acid resulted in the dissolution of a minor amount of copper due to the presence of plastic coating on the surface of metallic layers. On the other hand, when the liberated metal sheets from organic swelled PCBs were treated with dilute sulfuric acid of concentration 2M along with hydrogen peroxide in an autoclave under oxygen atmosphere, the percentage recovery of copper was found to increase from 59.63% to 97.01% with an increase in hydrogen peroxide concentration from 5 to 15% (v/v) keeping constant pulp density 30 g/L.

  8. Recycling of waste printed circuit boards: a review of current technologies and treatment status in China.

    Science.gov (United States)

    Huang, Kui; Guo, Jie; Xu, Zhenming

    2009-05-30

    From the use of renewable resources and environmental protection viewpoints, recycling of waste printed circuit boards (PCBs) receives wide concerns as the amounts of scrap PCBs increases dramatically. However, treatment for waste PCBs is a challenge due to the fact that PCBs are diverse and complex in terms of materials and components makeup as well as the original equipment's manufacturing processes. Recycle technology for waste PCBs in China is still immature. Previous studies focused on metals recovery, but resource utilization for nonmetals and further separation of the mixed metals are relatively fewer. Therefore, it is urgent to develop a proper recycle technology for waste PCBs. In this paper, current status of waste PCBs treatment in China was introduced, and several recycle technologies were analyzed. Some advices against the existing problems during recycling process were presented. Based on circular economy concept in China and complete recycling and resource utilization for all materials, a new environmental-friendly integrated recycling process with no pollution and high efficiency for waste PCBs was provided and discussed in detail.

  9. High temperature investigations on optimising the recovery of copper from waste printed circuit boards.

    Science.gov (United States)

    Cayumil, R; Ikram-Ul-Haq, M; Khanna, R; Saini, R; Mukherjee, P S; Mishra, B K; Sahajwalla, V

    2018-03-01

    High temperature pyrolysis investigations were carried out on waste printed circuit boards (PCBs) in the temperature range 800-1000°C under inert conditions, with an aim to determine optimal operating conditions for the recovery of copper. Pyrolysis residues were characterized using ICP-OES analysis, SEM/EDS and XRD investigations. Copper foils were successfully recovered after pyrolysis at 800°C for 10-20 min; the levels of Pb and Sn present were found to be quite low and these were generally present near the foil edges. The relative proportions of Pb and Sn became progressively higher at longer heating times due to enhanced diffusion of these molten metals in solid copper. While a similar behaviour was observed at 900°C, the pyrolysis at 1000°C resulted in copper forming Cu-Sn-Pb alloys; copper foils could no longer be recovered. Optimal conditions were identified for the direct recovery of copper from waste PCBs with minimal processing. This approach is expected to make significant contributions towards enhancing material recovery, process efficiency and the environmental sustainability of recycling e-waste. Pyrolysis at lower temperatures, short heating times, coupled with reductions in process steps are expected to significantly reduce energy consumption and pollution associated with the handling and processing of waste PCBs. Copyright © 2017 Elsevier Ltd. All rights reserved.

  10. Synthesis of carbon nanotubes and porous carbons from printed circuit board waste pyrolysis oil

    International Nuclear Information System (INIS)

    Quan Cui; Li Aimin; Gao Ningbo

    2010-01-01

    The possibility and feasibility of using pyrolysis oil from printed circuit board (PCB) waste as a precursor for advanced carbonaceous materials is presented. The PCB waste was first pyrolyzed in a laboratory scale fixed bed reactor at 600 deg. C to prepare pyrolysis oil. The analysis of pyrolysis oil by gas chromatography-mass spectroscopy indicated that it contained a very high proportion of phenol and phenol derivatives. It was then polymerized in formaldehyde solution to synthesize pyrolysis oil-based resin which was used as a precursor to prepare carbon nanotubes (CNTs) and porous carbons. Scanning electron microscopy and transmission microscopy investigation showed that the resulting CNTs had hollow cores with outer diameter of ∼338 nm and wall thickness of ∼86 nm and most of them were filled with metal nanoparticles or nanorods. X-ray diffraction reveals that CNTs have an amorphous structure. Nitrogen adsorption isotherm analysis indicated the prepared porous carbons had a Brunauer-Emmett-Teller surface area of 1214 m 2 /g. The mechanism of the formation of the CNTs and porous carbons was discussed.

  11. Environmental friendly technology for aluminum electrolytic capacitors recycling from waste printed circuit boards.

    Science.gov (United States)

    Wang, Jianbo; Xu, Zhenming

    2017-03-15

    up to now, the recycling of e-waste should be developed towards more depth and refinement to promote industrial production of e-waste resource recovery. in the present study, the recycling of aluminum electrolytic capacitors (AECs) from waste printed circuit boards (WPCBs) is focused on. First of all, AECs are disassembled from WPCBs by a self-designed machine; meanwhile, the disassembled AECs are subjected to an integrated process, involving heating treatment, crushing, sieving, and magnetic separating, to recover aluminum and iron; finally, the off-gas and residue generated during the aforementioned processes are analyzed to evaluate environmental risks. The results indicate that 96.52% and 98.68% of aluminum and iron, respectively, can be recovered from AECs under the optimal condition. The off-gas generated during the process is mainly composed of elements of C, H, and O, indicating that the off-gas is non-toxic and could be re-utilized as clean energy source. The residue according with toxicity characteristics leaching standard can be landfilled safely in sanitary landfill site. The present study provides an environmentally friendly and industrial application potential strategy to recycle AECs to promote e-waste recycling industry. Copyright © 2016 Elsevier B.V. All rights reserved.

  12. Prioritizing material recovery for end-of-life printed circuit boards.

    Science.gov (United States)

    Wang, Xue; Gaustad, Gabrielle

    2012-10-01

    The increasing growth in generation of electronic waste (e-waste) motivates a variety of waste reduction research. Printed circuit boards (PCBs) are an important sub-set of the overall e-waste stream due to the high value of the materials contained within them and potential toxicity. This work explores several environmental and economic metrics for prioritizing the recovery of materials from end-of-life PCBs. A weighted sum model is used to investigate the trade-offs among economic value, energy saving potentials, and eco-toxicity. Results show that given equal weights for these three sustainability criteria gold has the highest recovery priority, followed by copper, palladium, aluminum, tin, lead, platinum, nickel, zinc, and silver. However, recovery priority will change significantly due to variation in the composition of PCBs, choice of ranking metrics, and weighting factors when scoring multiple metrics. These results can be used by waste management decision-makers to quantify the value and environmental savings potential for recycling technology development and infrastructure. They can also be extended by policy-makers to inform possible penalties for land-filling PCBs or exporting to the informal recycling sector. The importance of weighting factors when examining recovery trade-offs, particularly for policies regarding PCB collection and recycling are explored further. Copyright © 2012 Elsevier Ltd. All rights reserved.

  13. Catalytic pyrolysis characteristics of scrap printed circuit boards by TG-FTIR.

    Science.gov (United States)

    Zhao, Chunhu; Zhang, Xiaoping; Shi, Lin

    2017-03-01

    In the present work, pyrolysis and catalytic pyrolysis of waste printed circuit boards (WPCBs) was carried out in the coupling of Thermo Gravimetric Analysis and Fourier Transform Infrared Spectroscopy (TG-FTIR) under nitrogen atmosphere. The reaction temperature was increased from 30 to 700°C, while the heating rates were varied from 10 to 40°C/min. Experimental results show that the effect of catalyst on the WPCBs particles pyrolysis was significance. Compared with another two combustion-supporting agents (MgO, CaO), the whole pyrolysis process was optimized when the catalyst ZSM-5 was added into the WPCBs particles. The distributed activation energy model (DAEM) was used to analyze the kinetic parameters of the WPCBs pyrolysis. It was found that values of frequency factor (k 0 ) changed with different activation energy (E) values during pyrolysis process. The activation energy values range from 129.15 to 280.53kJ/mol, and the frequency factor values range from 9.02×10 10 to 4.21×10 22 s -1 . The generated major products for the catalytic pyrolysis of WPCBs were H 2 , CO 2 , CO, H 2 O, phenols and aromatics. Copyright © 2016 Elsevier Ltd. All rights reserved.

  14. Wood plastic composite produced by nonmetals from pulverized waste printed circuit boards.

    Science.gov (United States)

    Guo, Jie; Tang, Yinen; Xu, Zhenming

    2010-01-01

    Nonmetals reclaimed from waste printed circuit boards (PCBs) are used to replace wood flour in the production of wood plastic composite (WPC). To evaluate property durability against weather exposure, the effects of accelerated aging process on the properties of WPC are investigated. The results show that filling of nonmetals in WPC improves the flexural strength and tensile strength, and reduces screw withdrawal strength. Before hollow WPC with 15% nonmetals (H-15-WPC) underwent aging process, H-15-WPC had a flexural strength of 25.8 MPa, a tensile strength of 9.8 MPa, a charpy impact strength of 3.4 kJ/m(2), and face/edge screw withdrawal strength of 121/115 N/mm. It is found that flexural strength of H-15-WPC decreases linearly with the increase of accelerated aging cycles, and the effects of aging test on tensile and impact strength of H-15-WPC are minor. For solid WPC, the accelerated aging test decreases screw withdrawal strength slightly. All the results indicate that nonmetals of waste PCBs can be reused as an alternative for wood flour in WPC products rather than resorting to their landfill or combustion.

  15. Dissolution of brominated epoxy resins by dimethyl sulfoxide to separate waste printed circuit boards.

    Science.gov (United States)

    Zhu, Ping; Chen, Yan; Wang, Liangyou; Qian, Guangren; Zhang, Wei Jie; Zhou, Ming; Zhou, Jin

    2013-03-19

    Improved methods are required for the recycling of waste printed circuit boards (WPCBs). In this study, WPCBs (1-1.5 cm(2)) were separated into their components using dimethyl sulfoxide (DMSO) at 60 °C for 45 min and a metallographic microscope was used to verify their delamination. An increased incubation time of 210 min yielded a complete separation of WPCBs into their components, and copper foils and glass fibers were obtained. The separation time decreased with increasing temperature. When the WPCB size was increased to 2-3 cm(2), the temperature required for complete separation increased to 90 °C. When the temperature was increased to 135 °C, liquid photo solder resists could be removed from the copper foil surfaces. The DMSO was regenerated by rotary decompression evaporation, and residues were obtained. Fourier transform infrared spectroscopy (FT-IR), thermal analysis, nuclear magnetic resonance, scanning electron microscopy, and energy-dispersive X-ray spectroscopy were used to verify that these residues were brominated epoxy resins. From FT-IR analysis after the dissolution of brominated epoxy resins in DMSO it was deduced that hydrogen bonding may play an important role in the dissolution mechanism. This novel technology offers a method for separating valuable materials and preventing environmental pollution from WPCBs.

  16. CARBON BLACK DISPERSION PRE-PLATING TECHNOLOGY FOR PRINTED WIRE BOARD MANUFACTURING

    Science.gov (United States)

    This evaluation addresses the product quality, waste reduction, and economic issues involved in replacing electroless copper with a carbon black dispersion technology. McCurdy Circuits of Orange County, California, currently has both processes in operation. McCurdy has found that...

  17. [Newly leaching method of copper from waste print circuit board using hydrochloric acid/n-butylamine/copper sulfate].

    Science.gov (United States)

    Wang, Hong-Yan; Cui, Zhao-Jie; Yao, Ya-Wei

    2010-12-01

    A newly leaching method of copper from waste print circuit board was established by using hydrochloric acid-n-butylamine-copper sulfate mixed solution. The conditions of leaching were optimized by changing the hydrochloric acid, n-butylamine, copper sulfate,temperature and other conditions using copper as target mimics. The results indicated that copper could be leached completely after 8 h at 50 degrees C, hydrochloric acid concentration of 1.75 mol/L, n-butylamine concentration of 0.25 mol/L, and copper sulfate mass of 0.96 g. Under the conditions, copper leaching rates in waste print circuit board samples was up to 95.31% after 9 h. It has many advantages such as better effects, low cost, mild reaction conditions, leaching solution recycling.

  18. Impact of NaCl Contamination and Climatic Conditions on the Reliability of Printed Circuit Board Assemblies

    DEFF Research Database (Denmark)

    Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    The effect of climatic conditions and ionic contamination on the reliability of printed circuit board assembly has been investigated in terms of leakage current (LC) and electrochemical migration susceptibility. The change in LC as a function of relative humidity (RH) and temperature was measured...... using single components (size 0805) and surface insulation resistance comb patterns precontaminated with sodium chloride at levels adjacent to levels used in the IPC J-STD-001 standard. The potential bias of 5–10 V was applied during experiments, and the climatic conditions were in the range 60%–98% RH...... and 15 $^{\\circ}\\hbox{C}$ –65 $^{\\circ}\\hbox{C}$. The variation of RH at the surface of the test specimens was imposed by 1) increasing the RH of the surrounding air and 2) reducing the temperature of the printed circuit boards using a cooling stage, while maintaining a constant climatic condition...

  19. Integrated Circuit Conception: A Wire Optimization Technic Reducing Interconnection Delay in Advanced Technology Nodes

    Directory of Open Access Journals (Sweden)

    Mohammed Darmi

    2017-10-01

    Full Text Available As we increasingly use advanced technology nodes to design integrated circuits (ICs, physical designers and electronic design automation (EDA providers are facing multiple challenges, firstly, to honor all physical constraints coming with cutting-edge technologies and, secondly, to achieve expected quality of results (QoR. An advanced technology should be able to bring better performances with minimum cost whatever the complexity. A high effort to develop out-of-the-box optimization techniques is more than needed. In this paper, we will introduce a new routing technique, with the objective to optimize timing, by only acting on routing topology, and without impacting the IC Area. In fact, the self-aligned double patterning (SADP technology offers an important difference on layer resistance between SADP and No-SADP layers; this property will be taken as an advantage to drive the global router to use No-SADP less resistive layers for critical nets. To prove the benefit on real test cases, we will use Mentor Graphics’ physical design EDA tool Nitro-SoC™ and several 7 nm technology node designs. The experiments show that worst negative slack (WNS and total negative slack (TNS improved up to 13% and 56%, respectively, compared to the baseline flow.

  20. Printed Circuit Board Surface Finish and Effects of Chloride Contamination, Electric Field, and Humidity on Corrosion Reliability

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    Corrosion reliability is a serious issue today for electronic devices, components, and printed circuit boards (PCBs) due to factors such as miniaturization, globalized manufacturing practices which can lead to process-related residues, and global usage effects such as bias voltage and unpredictable...... probability under condensing conditions. Leakage currents were measured on interdigitated comb test patterns with three different types of surface finish typically used in the electronics industry, namely gold, copper, and tin. Susceptibility to electrochemical migration was studied under droplet conditions...

  1. Novel recycling of nonmetal particles from waste printed wiring boards to produce porous composite for sound absorbing application.

    Science.gov (United States)

    Sun, Zhixing; Shen, Zhigang; Zhang, Xiaojing; Ma, Shulin

    2014-01-01

    Nonmetal materials take up about 70 wt% of waste printed wiring boards (WPWB), which are usually recycled as low-value fillers or even directly disposed by landfill dumping and incineration. In this research, a novel reuse ofthe nonmetals to produce porous composites for sound absorbing application was demonstrated. The manufacturing process, absorbing performance and mechanical properties of the composites were studied. The results show that the high porous structure of the composites leads to an excellent sound absorption ability in broad-band frequency range. Average absorption coefficient of above 0.4 can be achievedby the composite in the frequency range from 100 to 6400 Hz. When the particle size is larger than 0.2 mm, the absorption ability of the composite is comparable to that of commercial wood-fibre board and urea-formaldehyde foam. Mechanical analysis indicates that the porous composites possess sufficient structural strength for self-sustaining applications. All the results indicate that producing sound absorbing composite with nonmetal particles from WPWB provides an efficient and profitable way for recycling this waste resource and can resolve both the environment pollution and noise pollution problems.

  2. Using vacuum pyrolysis and mechanical processing for recycling waste printed circuit boards

    International Nuclear Information System (INIS)

    Long Laishou; Sun Shuiyu; Zhong Sheng; Dai Wencan; Liu Jingyong; Song Weifeng

    2010-01-01

    The constant growth in generation of waste printed circuit boards (WPCB) poses a huge disposal problem because they consist of a heterogeneous mixture of organic and metallic chemicals as well as glass fiber. Also the presence of heavy metals, such as Pb and Cd turns this scrap into hazardous waste. Therefore, recycling of WPCB is an important subject not only from the recovery of valuable materials but also from the treatment of waste. The aim of this study was to present a recycling process without negative impact to the environment as an alternative for recycling WPCB. In this work, a process technology containing vacuum pyrolysis and mechanical processing was employed to recycle WPCB. At the first stage of this work, the WPCB was pyrolyzed under vacuum in a self-made batch pilot-scale fixed bed reactor to recycle organic resins contained in the WPCB. By vacuum pyrolysis the organic matter was decomposed to gases and liquids which could be used as fuels or chemical material resources, however, the inorganic WPCB matter was left unaltered as solid residues. At the second stage, the residues obtained at the first stage were investigated to separate and recover the copper through mechanical processing such as crushing, screening, and gravity separation. The copper grade of 99.50% with recovery of 99.86% based on the whole WPCB was obtained. And the glass fiber could be obtained by calcinations in a muffle furnace at 600 deg. C for 10 min. This study had demonstrated the feasibility of vacuum pyrolysis and mechanical processing for recycling WPCB.

  3. Evaluation of gold and silver leaching from printed circuit board of cellphones.

    Science.gov (United States)

    Petter, P M H; Veit, H M; Bernardes, A M

    2014-02-01

    Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining "reference" values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2h at 60°C and 80°C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO3were made. The leaching of Au and Ag with alternative reagents: Na2S2O3, and (NH4)2S2O3 in 0.1M concentration with the addition of CuSO4, NH4OH, and H2O2, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO4 was added. Copyright © 2013 Elsevier Ltd. All rights reserved.

  4. Prioritizing material recovery for end-of-life printed circuit boards

    International Nuclear Information System (INIS)

    Wang Xue; Gaustad, Gabrielle

    2012-01-01

    Highlights: ► Material recovery driven by composition, choice of ranking, and weighting. ► Economic potential for new recycling technologies quantified for several metrics. ► Indicators developed for materials incurring high eco-toxicity costs. ► Methodology useful for a variety of stakeholders, particularly policy-makers. - Abstract: The increasing growth in generation of electronic waste (e-waste) motivates a variety of waste reduction research. Printed circuit boards (PCBs) are an important sub-set of the overall e-waste stream due to the high value of the materials contained within them and potential toxicity. This work explores several environmental and economic metrics for prioritizing the recovery of materials from end-of-life PCBs. A weighted sum model is used to investigate the trade-offs among economic value, energy saving potentials, and eco-toxicity. Results show that given equal weights for these three sustainability criteria gold has the highest recovery priority, followed by copper, palladium, aluminum, tin, lead, platinum, nickel, zinc, and silver. However, recovery priority will change significantly due to variation in the composition of PCBs, choice of ranking metrics, and weighting factors when scoring multiple metrics. These results can be used by waste management decision-makers to quantify the value and environmental savings potential for recycling technology development and infrastructure. They can also be extended by policy-makers to inform possible penalties for land-filling PCBs or exporting to the informal recycling sector. The importance of weighting factors when examining recovery trade-offs, particularly for policies regarding PCB collection and recycling are explored further.

  5. Leaching characteristics of heavy metals and brominated flame retardants from waste printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Zhou, Xiaoyu [State Environmental Protection Key Laboratory of Environmental Risk Assessment and Control on Chemical Process, East China University of Science and Technology, Shanghai 200237 (China); Guo, Jie, E-mail: guojie@ecust.edu.cn [State Environmental Protection Key Laboratory of Environmental Risk Assessment and Control on Chemical Process, East China University of Science and Technology, Shanghai 200237 (China); Lin, Kuangfei [State Environmental Protection Key Laboratory of Environmental Risk Assessment and Control on Chemical Process, East China University of Science and Technology, Shanghai 200237 (China); Shanghai Key Laboratory of Functional Materials Chemistry, East China University of Science and Technology, Shanghai 200237 (China); Huang, Kai; Deng, Jingjing [State Environmental Protection Key Laboratory of Environmental Risk Assessment and Control on Chemical Process, East China University of Science and Technology, Shanghai 200237 (China)

    2013-02-15

    Highlights: ► Cu and Pb were the most leachable heavy metals in WPCBs according to TCLP and SPLP. ► Penta-BDE congeners were dominated in all extracts. ► High dissolved organic matter condition promoted the BFRs leaching rate. ► Leaching from WPCBs was a significant emission source of BFRs in landfill. -- Abstract: Leaching assessment on five heavy metals (copper, zinc, lead, nickel and cadmium) and two brominated flame retardants (BFRs), polybrominated diphenyl ethers (PBDEs) and tetrabromobisphenol A (TBBPA), from waste printed circuit boards (WPCBs) were conducted using various leaching methods. The mean leaching concentrations of copper were the highest in both toxicity characteristic leaching procedures (TCLP) and synthetic precipitation leaching procedures (SPLP) tests at 8.6 mg/L and 1.1 mg/L, while only lead (6.2 mg/L) exceeded the TCLP criteria and Chinese EPA regulatory limit (both 5.0 mg/L). However, PBDEs and TBBPA were not detected in TCLP and SPLP tests. Then the BFRs leaching trends and potential leachabilities were further investigated in actual landfill leachates using a modified method. Leaching characteristics that fast-leaching initially followed by slow-desorption over time were generally observed. In landfill leachate tests, the highest leaching concentrations of PBDEs and TBBPA were determined at 30.39 and 12.27 μg/L. Meanwhile, the highest leaching rates were estimated to reach 0.08% and 1.00%, respectively, which were significantly influenced by the dissolved organic carbon contents of extracts, the hydrophobicities of target BFRs and the specific surface areas of WPCBs materials. These results proved that leaching from WPCBs was a significant emission source of BFRs in landfill and electronic waste recycling dumpsite.

  6. Experimental study on the heat transfer characteristics of waste printed circuit boards pyrolysis.

    Science.gov (United States)

    Ma, Hongting; Du, Na; Lin, Xueyin; Li, Chen; Lai, Junwen; Li, Zihao

    2018-03-22

    In order to study the appropriate and advanced technology for recycling waste printed circuit boards (PCBs), a fixed bed pyrolysis device with stirring function has been designed and developed. The effect of rotating speed on the temperature distribution and mass change in the pyrolysis process of FR-4 PCB has been analyzed. The heat transfer and pyrolysis characteristics of different granular layers with and without stirring have been investigated. The results indicate that the stirring can change the main way of heat transfer from conduction to convection in the PCB layers. As the increase of rotating speed, the temperature rising rate of material at the bottom of the pyrolysis furnace gradually decreases, while the heating rate is increasing at the upper layer, and the temperature difference between the upper and bottom layers is gradually reduced. When the rotating speed varies from 0r/min to 18r/min, the weight loss of the material increases from 3.97% to 6.76%, and the overall pyrolysis degree is improved. During the pyrolysis process, the material layer can be divided into three zones along the vertical direction, namely complete pyrolysis zone, partial pyrolysis zone and non-pyrolysis zone. As the rotating speed is 0r/min, the thickness of each zones is 6cm, 6cm and 3cm, respectively. However, when the rotating speed is increased to 18r/min, the non-pyrolysis zone disappears, and the thickness of complete pyrolysis zone and partial pyrolysis zone increase to 9cm and 6cm, respectively. Copyright © 2018 Elsevier B.V. All rights reserved.

  7. Quality control process improvement of flexible printed circuit board by FMEA

    Science.gov (United States)

    Krasaephol, Siwaporn; Chutima, Parames

    2018-02-01

    This research focuses on the quality control process improvement of Flexible Printed Circuit Board (FPCB), centred around model 7-Flex, by using Failure Mode and Effect Analysis (FMEA) method to decrease proportion of defective finished goods that are found at the final inspection process. Due to a number of defective units that were found at the final inspection process, high scraps may be escaped to customers. The problem comes from poor quality control process which is not efficient enough to filter defective products from in-process because there is no In-Process Quality Control (IPQC) or sampling inspection in the process. Therefore, the quality control process has to be improved by setting inspection gates and IPCQs at critical processes in order to filter the defective products. The critical processes are analysed by the FMEA method. IPQC is used for detecting defective products and reducing chances of defective finished goods escaped to the customers. Reducing proportion of defective finished goods also decreases scrap cost because finished goods incur higher scrap cost than work in-process. Moreover, defective products that are found during process can reflect the abnormal processes; therefore, engineers and operators should timely solve the problems. Improved quality control was implemented for 7-Flex production lines from July 2017 to September 2017. The result shows decreasing of the average proportion of defective finished goods and the average of Customer Manufacturers Lot Reject Rate (%LRR of CMs) equal to 4.5% and 4.1% respectively. Furthermore, cost saving of this quality control process equals to 100K Baht.

  8. Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader

    Directory of Open Access Journals (Sweden)

    Monier-Vinard Eric

    2016-01-01

    Full Text Available In order to help the electronic designer to early determine the limits of the power dissipation of electronic component, an analytical model was established to allow a fast insight of relevant design parameters of a multi-layered electronic board constitution. The proposed steady-state approach based on Fourier series method promotes a practical solution to quickly investigate the potential gain of multi-layered thermal via clusters. Generally, it has been shown a good agreement between the results obtained by the proposed analytical model and those given by electronics cooling software widely used in industry. Some results highlight the fact that the conventional practices for Printed Circuit Board modeling can be dramatically underestimate source temperatures, in particular with smaller sources. Moreover, the analytic solution could be applied to optimize the heat spreading in the board structure with a local modification of the effective thermal conductivity layers.

  9. Recycling of non-metallic fractions from waste printed circuit boards: A review

    International Nuclear Information System (INIS)

    Guo Jiuyong; Guo Jie; Xu Zhenming

    2009-01-01

    The major economic driving force for recycling of waste printed circuit boards (PCBs) is the value of the metallic fractions (MFs) of PCBs. The non-metallic fractions (NMFs), which take up almost 70 wt% of waste PCBs, were treated by combustion or land filling in the past. However, combustion of the NMFs will cause the formation of highly toxic polybrominated dibenzodioxins and dibenzofurans (PBDD/Fs) while land filling of the NMFs will lead to secondary pollution caused by heavy metals and brominated flame retardants (BFRs) leaching to the groundwater. Therefore, recycling of the NMFs from waste PCBs is drawing more and more attention from the public and the governments. Currently, how to recycle the NMFs environmental soundly has become a significant topic in recycling of waste PCBs. In order to fulfill the better resource utilization of the NMFs, the compositions and characteristics of the NMFs, methods and outcomes of recycling the NMFs from waste PCBs and analysis and treatment for the hazardous substances contained in the NMFs were reviewed in this paper. Thermosetting resin matrix composites, thermoplastic matrix composites, concrete and viscoelastic materials are main applications for physical recycling of the NMFs. Chemical recycling methods consisting of pyrolysis, gasification, supercritical fluids depolymerization and hydrogenolytic degradation can be used to convert the NMFs to chemical feedstocks and fuels. The toxicity characteristic leaching procedure (TCLP) and synthetic precipitation leaching procedure (SPLP) can be used to determine the toxicity characteristic (TC) of the NMFs and to evaluate the environmental safety of products made from the recycled NMFs. It is believed that physical recycling of the NMFs has been a promising recycling method. Much more work should be done to develop comprehensive and industrialized usage of the NMFs recycled by physical methods. Chemical recycling methods have the advantages in eliminating hazardous substances

  10. Estimation of Relative Permittivity of Printed Circuit Board with Fiber Glass Epoxy as Dielectric for UHF Applications

    Directory of Open Access Journals (Sweden)

    Ronal D. Montoya-Montoya

    2013-11-01

    Full Text Available This paper presents the results of measuring relative permittivity of fiber glass printed circuit board (PCB’s, using a rectangular resonant cavity. The relative permittivity is presented as function of frequency. To obtain resonant frequencies, the return loss was measured using a network analyzer. Relative permittivity was calculated by finding frequencies of resonant cavity modes. The results are presented in a frequency span of 1 to 3.5GHz. It was clearly shown the nonlinear behavior of the relative permittivity for the dielectric laminate evaluated, even what happens respect to the frequency of the resonant modes below and above to frequency of 2 GHz.

  11. Chemical and biological processes for multi-metal extraction from waste printed circuit boards of computers and mobile phones.

    Science.gov (United States)

    Shah, Monal B; Tipre, Devayani R; Dave, Shailesh R

    2014-11-01

    E-waste printed circuit boards (PCB) of computers, mobile-phones, televisions, LX (LongXiang) PCB in LED lights and bulbs, and tube-lights were crushed to ≥250 µm particle size and 16 different metals were analysed. A comparative study has been carried out to evaluate the extraction of Cu-Zn-Ni from computer printed circuit boards (c-PCB) and mobile-phone printed circuit boards (m-PCB) by chemical and biological methods. Chemical process showed the extraction of Cu-Zn-Ni by ferric sulphate was best among the studied chemical lixiviants. Bioleaching experiments were carried out with the iron oxidising consortium, which showed that when E-waste and inoculum were added simultaneously in the medium (one-step process); 60.33% and 87.50% Cu, 75.67% and 85.67% Zn and 71.09% and 81.87% Ni were extracted from 10 g L(-1) of c-PCB and m-PCB, respectively, within 10-15 days of reaction time. Whereas, E-waste added after the complete oxidation of Fe(2+) to Fe(3+) iron containing medium (two-step process) showed 85.26% and 99.99% Cu, 96.75% and 99.49% Zn and 93.23% and 84.21% Ni extraction from c-PCB and m-PCB, respectively, only in 6-8 days. Influence of varying biogenerated Fe(3+) and c-PCB concentrations showed that 16.5 g L(-1) of Fe(3+) iron was optimum up to 100 g L(-1) of c-PCB. Changes in pH, acid consumed and redox potential during the process were also studied. The present study shows the ability of an eco-friendly process for the recovery of multi-metals from E-waste even at 100 g L(-1) printed circuit boards concentration. © The Author(s) 2014.

  12. On-Board Memory Extension on Reconfigurable Integrated Circuits using External DDR3 Memory

    OpenAIRE

    Lodaya, Bhaveen

    2018-01-01

    User-programmable, integrated circuits (ICs) e.g. Field Programmable Gate Arrays (FPGAs) are increasingly popular for embedded, high-performance data exploitation. They combine the parallelization capability and processing power of application specific integrated circuits (ASICs) with the exibility, scalability and adaptability of software-based processing solutions. FPGAs provide powerful processing resources due to an optimal adaptation to the target application and a well-balanced ratio o...

  13. Use of a multilayer printed circuit board as the position sensing electrode in an MWPC

    International Nuclear Information System (INIS)

    Barbosa, A.F.

    1995-01-01

    An X-ray gas position sensitive detector (PSD) is described. The detector makes use of a single electrode, the X and Y cathode, to sense the electric charge induced by the avalanches generated after the absorption of X-ray photons in a multiwire proportional counter (MWPC). Two-dimensional (2D) localization of photons is achieved by associating one delay line to each coordinate. The delay lines are directly coupled to the X and Y cathode, so that the propagation time of electric pulses can be related to the corresponding avalanche position. Since the position encoding does not involve wires, the anode is the only wire electrode present in the detector, used for collecting the avalanche electrons. (orig.)

  14. Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging.

    Science.gov (United States)

    Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia

    2014-11-01

    This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further "sustainable" recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both "traditional" (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery. Copyright © 2014 Elsevier Ltd. All rights reserved.

  15. Waste management of printed wiring boards: a life cycle assessment of the metals recycling chain from liberation through refining.

    Science.gov (United States)

    Xue, Mianqiang; Kendall, Alissa; Xu, Zhenming; Schoenung, Julie M

    2015-01-20

    Due to economic and societal reasons, informal activities including open burning, backyard recycling, and landfill are still the prevailing methods used for electronic waste treatment in developing countries. Great efforts have been made, especially in China, to promote formal approaches for electronic waste management by enacting laws, developing green recycling technologies, initiating pilot programs, etc. The formal recycling process can, however, engender environmental impact and resource consumption, although information on the environmental loads and resource consumption is currently limited. To quantitatively assess the environmental impact of the processes in a formal printed wiring board (PWB) recycling chain, life cycle assessment (LCA) was applied to a formal recycling chain that includes the steps from waste liberation through materials refining. The metal leaching in the refining stage was identified as a critical process, posing most of the environmental impact in the recycling chain. Global warming potential was the most significant environmental impact category after normalization and weighting, followed by fossil abiotic depletion potential, and marine aquatic eco-toxicity potential. Scenario modeling results showed that variations in the power source and chemical reagents consumption had the greatest influence on the environmental performance. The environmental impact from transportation used for PWB collection was also evaluated. The results were further compared to conventional primary metals production processes, highlighting the environmental benefit of metal recycling from waste PWBs. Optimizing the collection mode, increasing the precious metals recovery efficiency in the beneficiation stage and decreasing the chemical reagents consumption in the refining stage by effective materials liberation and separation are proposed as potential improvement strategies to make the recycling chain more environmentally friendly. The LCA results provide

  16. Embedding electromagnetic band gap structures in printed circuit boards for electromagnetic interference reduction

    NARCIS (Netherlands)

    Tereshchenko, O.V.

    2015-01-01

    Due to the tendency of faster data rates and lower power supply voltage in the integrated circuit (IC) design, Simultaneously Switching Noise (SSN) and ground bounce become serious concerns for designers and testers. This noise can be a source of electromagnetic interference (EMI). It propagates

  17. High speed bending of 2nd level interconnects on printed circuit boards for automotive electronics

    NARCIS (Netherlands)

    Kouters, M.H.M.; Ubachs, R.; Wiel, H.J. van de; Waal, A. van der; Veer, J. van der

    2011-01-01

    Standard drop tests for portable electronics are not representative for the qualification of automotive electronics. High-frequency vibrations are more dominant than abrupt shocks during normal operation. In this work a high speed board bending (HSB) method is developed to mimic the constant cyclic

  18. Evaluation of multilayer printed wiring boards by metallographic techniques: An illustrated guide to the preparation and inspection of plated-through hole test coupons based on the requirements of Mil-P-55110D

    Science.gov (United States)

    Jellison, J.

    1986-01-01

    This work is an illustrated handbook containing the rationale and procedure for the evaluation of multilayer printed wiring board construction integrity with respect to plated-through holes in accordance with the requirements of MIL-P-55110D, Printed Wiring Boards. It is intended as a practical aid for those concerned with determining the construction integrity of multilayer boards for high reliability applications. Photomicrographs of cross sectioned holes illustrate defect types, acceptable and unacceptable conditions, and methods of measurement. A procedure for specimen preparation is given, and appropriate paragraphs of the military specification are included and explained.

  19. Influence of incorporation of powder of printed circuit boards on technological properties and microstructure of triaxial ceramics

    International Nuclear Information System (INIS)

    Stafford, F.N.; Hotza, D.

    2012-01-01

    Using the methodology of experiments with mixtures, seven formulations of clay, phyllite, and printed circuit boards (PCB) were obtained to study the influence of this waste on triaxial ceramic tiles. Each formulation was processed under conditions similar to those used in the ceramic tiles industry, and characterized for fired modulus of rupture (FMoR) and water absorption (WA). The samples sintered at 1180°C were also subjected to analysis by XRD and SEM. The lowest resistance was observed in samples with 40% residue, while the highest strength occurred for samples with 14% residue, which reached average values of mechanical strength and water absorption of 35.0 MPa and 2.0%, respectively. The microstructure showed that it is possible to use waste of PCB in triaxial ceramic, which exhibits a fluxing behavior and it has an important effect on the sinterability and the development of appropriate microstructures. (author)

  20. Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

    Energy Technology Data Exchange (ETDEWEB)

    Troeger, K., E-mail: altstaedt@uni-bayreuth.de; Darka, R. Khanpour, E-mail: altstaedt@uni-bayreuth.de; Neumeyer, T., E-mail: altstaedt@uni-bayreuth.de; Altstaedt, V., E-mail: altstaedt@uni-bayreuth.de [Polymer Engineering, University of Bayreuth, Germany and Polymer Engineering, Universitaetsstrasse 30, 95447 Bayreuth (Germany)

    2014-05-15

    This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K.

  1. Effect of solder flux residue on the performance of silicone conformal coatings on printed circuit board assemblies

    DEFF Research Database (Denmark)

    Rathinavelu, Umadevi; Jellesen, Morten Stendahl; Ambat, Rajan

    2013-01-01

    across the components, morphology of the coating, and analysis of dendrite formation due to electrochemical migration under the coating. The morphology of the coating before and after exposure was investigated using scanning electron microscopy, and energy dispersive X-ray spectroscopy. Results show......Conformal coatings are applied on printed circuit board assemblies (PCBAs) in order to protect the assembly from environmental influence and silicone-based coating is commonly used. A systematic study on the performance of silicone conformal coating in connection with process-related contaminants...... is the focus of this paper. Different test substrates such as plain laminate surface and a test PCBA with and without conformal coatings were exposed to high humid environment at ambient temperature and the performance of the coating was evaluated using various parameters such as increase in leakage current...

  2. The cooling of printed circuit board mounted components using copper ladder heat conduction to a cold wall

    Science.gov (United States)

    Dale, I. C.

    1982-09-01

    A series of experimental tests, designed to investigate the cooling of printed circuit board (PCB) mounted dual-in-line (DIL) components within an avionic box using the copper ladder/cold wall technique is described. Areas of investigation include avionic box orientation, side wall conduction, top plate finning, mixed air-wash, avionic power reduction, cooling air temperature reduction, cooling air mass flow rate reduction, cold wall heat pick-up and avionic box insulation. Results were obtained from thermocouple temperature measurements. The use of an aluminum alloy interplate to cool two adjacent PCBs is discussed. Results in graphic form are included together with a list of conclusions on the effects of all the major parameters considered.

  3. An Icepak-PSpice Co-Simulation Method to Study the Impact of Bond Wires Fatigue on the Current and Temperature Distribution of IGBT Modules under Short-Circuit

    DEFF Research Database (Denmark)

    Wu, Rui; Iannuzzo, Francesco; Wang, Huai

    2014-01-01

    Bond wires fatigue is one of the dominant failure mechanisms of IGBT modules. Prior-art research mainly focuses on its impact on the end-of-life failure, while its effect on the short-circuit capability of IGBT modules is still an open issue. This paper proposes a new electro-thermal simulation...... approach enabling analyze the impact of the bond wires fatigue on the current and temperature distribution on IGBT chip surface under short-circuit. It is based on an Icepack-PSpice co-simulation by taking the advantage of both a finite element thermal model and an advanced PSpice-based multi-cell IGBT...

  4. Using Mathematical Morphology to Detect the Imperfections of the Printed Circuit Boards

    Directory of Open Access Journals (Sweden)

    Ionut Balan

    2008-01-01

    Full Text Available Image processing is a form of signal processing(analysis, interpretation, and manipulation of signals forwhich the input is an image, such as photographs; the outputof image processing can be either an image or a set ofcharacteristics or parameters related to the image. Typicaloperations of image processing are geometrictransformations such as enlargement, reduction androtation, color corrections such as brightness and contrastadjustments, quantization, or conversion to a different colorspace, interpolation and recovery of a full image from a rawimage format, image editing, image differencing, imagestabilization, image segmentation and other. Applications ofthese operations are encountered in computer vision, facedetection, feature detection, medical image processing,microscope image processing, morphological imageprocessing, remote sensing and many other disciplines.Morphological image processing is a collection of techniquesfor digital image processing based on mathematicalmorphology. By combining these morphological operatorswe can obtain algorithms for many image processing tasks,such as feature detection, image segmentation, imagesharpening, image filtering, and granulometry. Likewise,using this technology we can detect some imperfections of theprinted circuits, imperfections that allow us to repair it,opportunely. So in this way, we can eliminate some costs inthe technological process.The paper presents an introduction in mathematicalmorphology, describes “hit and miss transform”, dilationand erosion and, after all, we present the usage of two ofthese operations in printed circuit error detection.

  5. A quick solution, made to measure; Big scientific experiments need big circuit boards and that's where East Kilbride's D-TACQ comes in

    CERN Multimedia

    Gardner, D

    2003-01-01

    D-TACQ is a small electronics company operating in a highly-specialised market with technological expertise that few can match worldwide. It specialises in designing and manufacturing bespoke printed circuit boards (PCBs) which handle data acquisition tasks linked to scientific instrumentation and control systems (1 page).

  6. Separation processes of metal materials and non metal recycling on waste of printed circuit boards microcomputers

    OpenAIRE

    Oscar Luiz Ferreira Junior

    2013-01-01

    Com a aprovação da Política Nacional de Resíduos Sólidos, a política de sustentabilidade tende ao reaproveitamento de resíduos, em seu ciclo ou destinação final ambientalmente adequada. Neste contexto, são apresentados neste trabalho, estudos do processo de separação de materiais metálicos e não metálicos encontrados em placas de circuito impresso de microcomputadores e a caracterização dos elementos químicos presentes. Para isto efetuou-se a trituração primária (moagem) das placas de circuit...

  7. MOST: Modeling of SpaceWire & SpaceFibre Traffic- Applications and Operations: On-Board Segment

    Science.gov (United States)

    Dellandrea, Brice; Gouin, Baptiste; Parkes, Steve; Jameux, David

    2014-08-01

    MOST(Modeling of SpaceWire Traffic) is a representative and powerful SpaceWire traffic simulator designed to support conception, development and validation of SpaceWire networks. MOST is developed by Thales Alenia Space France (TAS-F) for the European Space Agency (ESA) and for the benefits of the SpaceWire communityThis tool was already presented in DASIA 2011 [6] and DASIA 2012 [7] as Thales Alenia Space was finishing its first step of development. Since then, the software has reached a TRL mature enough to start distributing MOST v2.2r2 to the SpaceWire community under ESA license. This released version will be presented in this paperMoreover, TAS-F is currently developing a major extension of the MOST library targeting the inclusion of S paceFibre [5] components under an University of Du ndee sub-contract. These new features will be also presented in this document.

  8. An Investigation into the Package and Printed Circuit Board Assembly Solutions of an Ultrathin Coreless Flip-Chip Substrate

    Science.gov (United States)

    Chang, Jing-Yao; Chaung, Tung-Han; Chang, Tao-Chih

    2015-10-01

    Flip-chip technology has been widely accepted as a solution for electronic packaging of high-pin-count devices. Due to the demand for smaller and thinner package dimensions, coreless build-up substrates will be used in industry to carry the die by solder bumps due to the advantages of shorter transmission route and lower inductance and thermal resistance. However, coefficient of thermal expansion (CTE) mismatch between the Cu trace and the laminate often causes the coreless substrate to warp, which leads to failures such as nonwetted solder bumps and interfacial cracking during assembly and reliability tests. In a previous study, assembly of a six-layer polyimide-based coreless flip-chip package was achieved by a 17 mm × 17 mm die with 4355 Sn-37Pb solder bumps, an amide-based underfill, and 1521 Sn-3.0Ag-0.5Cu solder balls. For determination of its board-level reliability characteristics, the component was mounted on a printed circuit board (PCB) using a conventional surface mount technology, and 10 test vehicles were assembled for assessment of their reliability under a temperature cycling environment. The experimental results show that the characteristic life of the PCB assembly exceeded 1500 cycles and that failure resulted from fracture of the outermost solder balls on the substrate side. This was different from the failure mode of die cracking when the package experienced hundreds of temperature cycles at the component level because the rigid PCB, through solder balls, moderated the deformation of the coreless flip-chip package. Hence, the concentrated bending stress at the die edge region was lowered. Finally, the local CTE mismatch between the stiffener and the PCB dominated the fatigue fracture of the outermost solder balls to become the main failure mode.

  9. Comprehensive characterization of printed circuit boards of various end-of-life electrical and electronic equipment for beneficiation investigation.

    Science.gov (United States)

    Anshu Priya; Hait, Subrata

    2018-02-14

    Comprehensive characterization of printed circuit board (PCB) of end-of-life electrical and electronic equipment (EEE) is obligatory for prospective profitable beneficiation. In this study, beneficiation oriented comprehensive characterization of two brands of PCBs each of 16 end-of-life EEE was conducted in terms of their physicochemical characteristics with special emphasis on the content of 16 general elements, 2 precious metals and 15 rare earth elements (REEs). General elements and their highest weight percent composition found in different PCBs of the EEEs were Cu (23% in laptop), Al (6% in computer), Pb (15% in DVD player) and Ba (7% in TV). The high abundant of precious metals such as Au (316 g/ton) and Ag (636 g/ton) in mobile phone and laptop, respectively coupled with rapid obsolescence age makes waste PCBs of information technology and telecommunication equipment the most potent resource reservoir. Additionally, most of the waste PCBs were observed to contain REEs in considerable quantity with Sc up to 31 g/ton and Ce up to 13 g/ton being the major constituents. Comprehensive characterization of waste PCBs therefore will systematically help towards better understanding of e-waste recycling processes for beneficiation purpose and sustainable resource circulation and conservation. Copyright © 2018 Elsevier Ltd. All rights reserved.

  10. Identification and chemical characterization of particulate matter from wave soldering processes at a printed circuit board manufacturing company

    International Nuclear Information System (INIS)

    Szoboszlai, Z.; Kertész, Zs.; Szikszai, Z.; Angyal, A.; Furu, E.; Török, Zs.; Daróczi, L.; Kiss, Á.Z.

    2012-01-01

    Highlights: ► We characterized aerosol particles in an environment where wave soldering is used. ► The constituents of the melt were recognized in the aerosols. ► Sources and creation process of PM were identified, e.g. soldering, fluxing, etching. ► Pb and other metals showed a maximum in the fine mode in the size distributions. ► Deposition probabilities of different particles along the respiratory tract were calculated. - Abstract: In this case study, the elemental composition and mass size distribution of indoor aerosol particles were determined in a working environment where soldering of printed circuit boards (PCB) took place. Single particle analysis using ion and electron microscopy was carried out to obtain more detailed and reliable data about the origin of these particles. As a result, outdoor and indoor aerosol sources such as wave soldering, fluxing processes, workers’ activity, mineral dust, biomass burning, fertilizing and other anthropogenic sources could be separated. With the help of scanning electron microscopy, characteristic particle types were identified. On the basis of the mass size distribution data, a stochastic lung deposition model was used to calculate the total and regional deposition efficiencies of the different types of particles within the human respiratory system. The information presented in this study aims to give insights into the detailed characteristics and the health impact of aerosol particles in a working environment where different kinds of soldering activity take place.

  11. Liberation of metal clads of waste printed circuit boards by removal of halogenated epoxy resin substrate using dimethylacetamide.

    Science.gov (United States)

    Verma, Himanshu Ranjan; Singh, Kamalesh K; Mankhand, Tilak Raj

    2017-02-01

    Present work reports the evaluation of dimethylacetamide (DMAc) as a solvent to dissolve the halogenated epoxy resin substrate (HERS) of waste printed circuit boards (WPCBs). Studies revealed that HERS dissolution attributes to the cracking and delamination of WPCB's layers. Variation of the parameters governing the dissolution elucidated that dissolution is directly dependent on temperature and WPCBs concentration in DMAc. The results also showed that increase in the WPCBs size drastically retards the rate of HERS dissolution. After delamination, the spent DMAc was regenerated, and the dissolved HERS was recovered as residue. The chemical structure of regenerated solution and recovered residue were found to be similar to pure DMAc and untreated HERS, respectively. Cyclic usage of regenerated DMAc revealed that 3-5% of DMAc is lost after each usage cycle while its effectiveness to dissolve the HERS remains equivalent to the pure DMAc. The dissolution of HERS ensures the liberation of copper cladded on the surface of WPCBs, and thus the proposed process avoids the requirement of highly energy intensive metal liberation processes. Copyright © 2016 Elsevier Ltd. All rights reserved.

  12. A new two-roll electrostatic separator for recycling of metals and nonmetals from waste printed circuit board

    International Nuclear Information System (INIS)

    Wu Jiang; Li Jia; Xu Zhenming

    2009-01-01

    The electrostatic separation is an effective method for recycling waste electrical and electronic equipment (WEEE). The efficiency of electrostatic separation processes depends on the ability of the separator. As a classical one, the roll-type corona-electrostatic separator has some advantages in recycling metals and plastics from waste printed circuit board (PCB). However, its industry application still faces some problems, such as: the further disposal of the middling products of the separation process; the balance of the production capacity and the good separation efficiency; the separation of the fine granular mixture and the stability of the separation process. A new 'two-roll-type corona-electrostatic separator' was built to overcome the limitation of the classical one. The experimental data were discussed and the results showed that the outcome of the separation process was improved by using the new separator. Compared with the classical machine, the mass of conductive products increases 8.9% (groups 2 and 3) and10.2% (group 4) while the mass of the middling products decreases 45% (groups 2 and 3) and 31.7% (group 4), respectively. The production capacity of the new machine increases, and the stability of the separation process is enhanced

  13. Electrostatic separation for multi-size granule of crushed printed circuit board waste using two-roll separator

    International Nuclear Information System (INIS)

    Wu Jiang; Li Jia; Xu Zhenming

    2008-01-01

    The electrostatic separation is an effective method for recycle of crushed waste electrical and electronic equipment (WEEE). However, the robustness of the classical roll-type separator is vulnerable because of its sensitivity to variation of granule size. A new 'two-roll type corona-electrostatic separator' was built to overcome the limitation of the classical one considering the actual situation of the industrial application which always contains granule with different size. Multi-size granule of crushed printed circuit board (PCB) wastes was used for investigation and the results showed that the efficiency of the separation process was improved by using the new separator. Compared with the process (lower voltage) performed on the old separator, the metal products increased 34% while the middling products reduced 73%, respectively. Compared with the process (higher voltage) performed on the old separator, the metal products increased 22% while the middling products reduced 59%, respectively. In addition, the metal component of the middling products using new machine notably decreased, 33% (new machine) compared with 58% (lower voltage) and 66% (higher voltage). The efficiency of the separation process is enhanced compared with the classical one

  14. Isolation and identification of Penicillium chrysogenum strain Y5 and its copper extraction characterization from waste printed circuit boards.

    Science.gov (United States)

    Xia, Ming-Chen; Bao, Peng; Liu, A-Juan; Zhang, Shi-Shi; Peng, Tang-Jian; Shen, Li; Yu, Run-Lan; Wu, Xue-Ling; Li, Jiao-Kun; Liu, Yuan-Dong; Chen, Miao; Qiu, Guan-Zhou; Zeng, Wei-Min

    2018-03-21

    Biohydrometallurgy is generally considered as a green technology for the recycling of industrial solid waste. In this study, an indigenous fungal strain named Y5 with the ability of high-yielding organic acids was isolated and applied in bioleaching of waste printed circuit boards (PCBs). The strain Y5 was identified as Penicillium chrysogenum by morphological and molecular identification. Meanwhile, we investigated that an optimal set of culturing conditions for the fungal growth and acids secretion was 15 g/L glucose with initial pH 5.0, temperature 25°C and shaking speed 120 rpm in shaken flasks culture. Moreover, three bioleaching processes such as one-step, two-step and spent medium processes were conducted to extract copper from waste PCBs. Spent medium bioleaching showed higher copper extraction percentage and it was 47% under 5%(w/v) pulp density. Transmission electron microscope (TEM) observation combining with energy dispersive analysis of X-rays (EDAX) showed that the leached metal ions did not obviously damage the hypha cells. All above results indicated that P.chrysogenum strain Y5 has the tolerance to metal ions, suggesting its potential in recycling of metals from waste PCBs in industry. Copyright © 2018 The Society for Biotechnology, Japan. Published by Elsevier B.V. All rights reserved.

  15. Recovery of metals from waste printed circuit boards by supercritical water pre-treatment combined with acid leaching process.

    Science.gov (United States)

    Xiu, Fu-Rong; Qi, Yingying; Zhang, Fu-Shen

    2013-05-01

    Waste printed circuit boards (PCBs) contain a large number of metals such as Cu, Sn, Pb, Cd, Cr, Zn, and Mn. In this work, an efficient and environmentally friendly process for metals recovery from waste PCBs by supercritical water (SCW) pre-treatment combined with acid leaching was developed. In the proposed process, waste PCBs were pre-treated by SCW, then the separated solid phase product with concentrated metals was subjected to an acid leaching process for metals recovery. The effect of SCW pre-treatment on the recovery of different metals from waste PCBs was investigated. Two methods of SCW pre-treatment were studied: supercritical water oxidation (SCWO) and supercritical water depolymerization (SCWD). Experimental results indicated that SCWO and SCWD pre-treatment had significant effect on the recovery of different metals. SCWO pre-treatment was highly efficient for enhancing the recovery of Cu and Pb, and the recovery efficiency increased significantly with increasing pre-treatment temperature. The recovery efficiency of Cu and Pb for SCWO pre-treatment at 420°C was 99.8% and 80%, respectively, whereas most of the Sn and Cr were immobilized in the residue. The recovery of all studied metals was enhanced by SCWD pre-treatment and increased along with pre-treatment temperature. Up to 90% of Sn, Zn, Cr, Cd, and Mn could be recovered for SCWD pre-treatment at 440°C. Copyright © 2013 Elsevier Ltd. All rights reserved.

  16. Removal of organic compounds from wastewater originating from the production of printed circuit boards by UV-Fenton method

    Directory of Open Access Journals (Sweden)

    Thomas Maciej

    2017-12-01

    Full Text Available The possibility of removing organic compounds from wastewater originating from the photochemical production of printed circuit boards by use of waste acidification and disposal of precipitated photopolymer in the first stage and the UV-Fenton method in a second stage has been presented. To optimize the process of advanced oxidation, the RSM (Response Surface Methodology for three independent factors was applied, i.e. pH, the concentration of Fe(II and H2O2 concentration. The use of optimized values of individual parameters in the process of wastewater treatment caused a decrease in the concentration of the organic compounds denoted as COD by approx. 87% in the first stage and approx. 98% after application of both processes. Precipitation and the decomposition of organic compounds was associated with a decrease of wastewater COD to below 100 mg O2/L whereas the initial value was 5550 mg O2/L. Decomposition of organic compounds and verification of the developed model of photopolymers removal was also carried out with use of alternative H2O2 sources i.e. CaO2, MgO2, and Na2CO3·1,5H2O2.

  17. The reuse of nonmetals recycled from waste printed circuit boards as reinforcing fillers in the polypropylene composites.

    Science.gov (United States)

    Zheng, Yanhong; Shen, Zhigang; Cai, Chujiang; Ma, Shulin; Xing, Yushan

    2009-04-30

    The feasibility of reusing nonmetals recycled from waste printed circuit boards (PCBs) as reinforcing fillers in the polypropylene (PP) composites is studied by using both mechanical and vicat softening temperature (VST) tests. The concentration of Cu leaded from the composites is also tested. The mechanical test shows that both tensile and flexural properties of the nonmetals/PP composites can be significantly improved by adding the nonmetals into PP. The maximum increment of tensile strength, tensile modulus, flexural strength and flexural modulus of the PP composites is 28.4%, 62.9%, 87.8% and 133.0%, respectively. As much as 30 wt% nonmetals recycled from waste PCBs can be added in the PP composites without violating the environmental regulation. The VST test shows that the presence of nonmetals can improve the heat resistance of the nonmetals/PP composites for their potential applications. The optimum particle is the fine or medium nonmetals recycled from waste PCBs, and the optimum content of the nonmetals is 30 wt% basing on the comprehensive consideration. All the above results indicate that the reuse of nonmetals as reinforcing fillers in the PP composites represents a promising way for recycling resources and resolving the environmental pollutions.

  18. Production and characterization of polypropylene composites filled with glass fibre recycled from pyrolysed waste printed circuit boards.

    Science.gov (United States)

    Li, Shenyong; Sun, Shuiyu; Liang, Haifeng; Zhong, Sheng; Yang, Fan

    2014-01-01

    Waste printed circuit boards (WPCBs) are composed of nearly 70% non-metals, which are generally recycled as low-value filling materials or even directly dumped in landfills. In this study, polypropylene (PP) composites reinforced by recycled pure glass fibres (RGF) from pyrolysed WPCBs were successfully produced. The manufacturing process, mechanical properties and thermal behaviour of the composites were investigated. The results showed that the appropriate addition of RGF in the composites can significantly improve the mechanical properties and thermal behaviour. When the added content of RGF was 30%, the maximum increment of tensile strength, impact strength, flexural strength and flexural modulus of the glass fibre (GF)/PP composites are 25.93%, 41.38%, 31.16% and 68.42%, respectively, and the vicat softening temperature could rise by 4.6°C. Furthermore, leaching of the GF/PP composites was also investigated. The GF/PP composites exhibited high performance and non-toxicity, offering a promising method to recycle RGF from pyrolysed WPCBs with high-value applications.

  19. An advanced study on the hydrometallurgical processing of waste computer printed circuit boards to extract their valuable content of metals.

    Science.gov (United States)

    Birloaga, Ionela; Coman, Vasile; Kopacek, Bernd; Vegliò, Francesco

    2014-12-01

    This study refers to two chemical leaching systems for the base and precious metals extraction from waste printed circuit boards (WPCBs); sulfuric acid with hydrogen peroxide have been used for the first group of metals, meantime thiourea with the ferric ion in sulfuric acid medium were employed for the second one. The cementation process with zinc, copper and iron metal powders was attempted for solutions purification. The effects of hydrogen peroxide volume in rapport with sulfuric acid concentration and temperature were evaluated for oxidative leaching process. 2M H2SO4 (98% w/v), 5% H2O2, 25 °C, 1/10 S/L ratio and 200 rpm were founded as optimal conditions for Cu extraction. Thiourea acid leaching process, performed on the solid filtrate obtained after three oxidative leaching steps, was carried out with 20 g/L of CS(NH2)2, 6g/L of Fe(3+), 0.5M H2SO4, The cross-leaching method was applied by reusing of thiourea liquid suspension and immersing 5 g/L of this reagent for each other experiment material of leaching. This procedure has lead to the doubling and, respectively, tripling, of gold and silver concentrations into solution. These results reveal a very efficient, promising and environmental friendly method for WPCBs processing. Copyright © 2014 Elsevier Ltd. All rights reserved.

  20. Recycling of metals from pretreated waste printed circuit boards effectively in stirred tank reactor by a moderately thermophilic culture.

    Science.gov (United States)

    Xia, Ming-Chen; Wang, Ya-Ping; Peng, Tang-Jian; Shen, Li; Yu, Run-Lan; Liu, Yuan-Dong; Chen, Miao; Li, Jiao-Kun; Wu, Xue-Ling; Zeng, Wei-Min

    2017-06-01

    To seek a feasible technique for processing waste printed circuit boards (PCBs), pretreatment of PCBs by table separation and further bioleached by moderate thermophiles in a stirred tank reactor were investigated. The shaking table separation, conducted after grinding and sieving of PCBs, produced two fractions: metal-rich parts (RPCBs), which is more suitable for pyrometallurgy process than untreated PCBs, and metal-poor parts (PPCBs) with only 8.83% metals was then bioleached by a mixed culture of moderate thermophiles effectively. After adaptation, the mixed culture could tolerate 80 g/L PPCBs. The bioleaching results showed that metals recovery was 85.23% Zn, 76.59% Cu and 70.16% Al in only 7 days. Trace Pb and Sn were detected in the leachate because of precipitating. The microorganism community structure was analyzed by amplified ribosomal DNA restriction analysis. Two moderately thermophilic bacteria species were identified as Leptospirillum ferriphilum and Acidithiobacillus caldus. Furthermore, uncultured Thermoplasmatales archaeon was also detected in the leaching system. It was also shown that moderate thermophiles revealed best bioleaching ability when compared with mesophiles and the mixture of mesophiles and moderate thermophiles. Finally, we designed a two-stage process model according to the present study to achieve semi-industrial waste PCBs recycling and economic feasibility analysis indicated that the process was profitable. Crown Copyright © 2017. Published by Elsevier B.V. All rights reserved.

  1. Application of vacuum metallurgy to separate pure metal from mixed metallic particles of crushed waste printed circuit board scraps.

    Science.gov (United States)

    Zhan, Lu; Xu, Zhenming

    2008-10-15

    The principle of separating pure metal from mixed metallic particles (MMPs) byvacuum metallurgy is that the vapor pressures of various metals at the same temperature are different As a result, the metal with high vapor pressure and low boiling point can be separated from the mixed metals through distillation or sublimation, and then it can be recycled through condensation under a certain condition. The vacuum metallurgy separation (VMS) of MMPs of crushed waste printed circuit boards (WPCBs) has been studied in this paper. Theoretical analyses show that the MMPs (copper, zinc, bismuth, lead, and indium, for example) can be separated by vacuum metallurgy. The copper particles (0.15-0.20 mm) and zinc particles (<0.30 mm) were chosen to simulate the MMPs of crushed WPCBs. Experimental results show that the separated efficiency of zinc in the copper-rich particles achieves 96.19 wt % when the vacuum pressure is 0.01-0.10 Pa, the heating temperature is 1123 K, and the heating time is 105 min. Under this operation condition, the separated efficiency of zinc in the copper-rich particles from crushed WPCBs achieves 97.00 wt % and the copper purity increases from 90.68 to 99.84 wt %.

  2. Performance and thermal behavior of wood plastic composite produced by nonmetals of pulverized waste printed circuit boards.

    Science.gov (United States)

    Guo, Jie; Tang, Yinen; Xu, Zhenming

    2010-07-15

    A new kind of wood plastic composite (WPC) was produced by compounding nonmetals from waste printed circuit boards (PCBs), recycled high-density polyethylene (HDPE), wood flour and other additives. The blended granules were then extruded to profile WPC products by a conical counter-rotating twin-screw extruder. The results showed that the addition of nonmetals in WPC improved the flexural strength and tensile strength and reduced screw withdrawal strength. When the added content of nonmetals was 40%, the flexural strength of WPC was 23.4 MPa, tensile strength was 9.6 MPa, impact strength was 3.03 J/m(2) and screw withdrawal strength was 1755 N. Dimensional stability and fourier transform infrared spectroscopy (FTIR) of WPC panels were also investigated. Furthermore, thermogravimetric analysis showed that thermal degradation of WPC mainly included two steps. The first step was the decomposition of wood flour and nonmetals from 260 to 380 degrees C, and the second step was the decomposition of HDPE from 440 to 500 degrees C. The performance and thermal behavior of WPC produced by nonmetals from PCBs achieves the standard of WPC. It offers a novel method to treat nonmetals from PCBs. 2010 Elsevier B.V. All rights reserved.

  3. Studies of IBL wire bonds operation in a ATLAS-like magnetic field.

    CERN Document Server

    Alvarez Feito, D; Mandelli, B

    2015-01-01

    At the Large Hadron Collider (LHC) experiments, most of silicon detectors use wire bonds to connect front-end chips and sensors to circuit boards for the data and service trans- missions. These wire bonds are operated in strong magnetic field environments and if time varying currents pass through them with frequencies close to their mechanical resonance frequency, strong resonant oscillations may occur. Under certain conditions, this effect can lead to fatigue stress and eventually breakage of wire bonds. During the first LHC Long Shutdown, the ATLAS Pixel Detector has been upgraded with the addition of a fourth innermost layer, the Insertable B-Layer (IBL), which has more than 50000 wire bonds operated in the ATLAS 2 T magnetic field. The results of systematic studies of operating wire bonds under IBL-like conditions are presented. Two different solutions have been investigated to minimize the oscillation amplitude of wire bonds.

  4. New technique for wiring SSC superconducting sextupole corrector coils

    International Nuclear Information System (INIS)

    Leon, B.

    1985-01-01

    There exists in the electronics industry, a technology for the manufacture of printed circuit (PC) boards which is directly transferable into the creation of highly controlled coils, such as the SSC sextupole superconducting corrector coils. This technology, which uses a process of laying down insulated wire in highly controlled patterns has heretofore been confined exclusively to the manufacture of high density printed circuit (PC) boards, possibly due to an ignorance of its utility in the field of precision winding of coils. This ability to fix wires in a well defined location can be used to produce precision wound coils in a very cost-effective manner. These coils may be superior in quality to conventionally made coils. Before describing what can be created with this technology, it is necessary to take a look at this coil winding process, the MULTIWIRE process, and the industry which has utilized this technology

  5. A new technique for wiring SSC superconducting sextupole corrector coils

    International Nuclear Information System (INIS)

    Leon, B.

    1985-01-01

    There exists in the electronics industry, a technology for the manufacture of printed circuit (PC) boards which is directly transferable into the creation of highly controlled coils, such as the SSC sextupole superconducting corrector coils. This technology, which uses a process of laying down insulated wire in highly controlled patterns, has heretofore been confined excusively to the manufacture of high density printed circuit (PC) boards, possibly due to an ignorance of its utility in the field of precision winding of coils. This ability to fix wires in a well defined location can be used to produce precision wound coils in a very cost-effective manner. These coils may be superior in quality to conventionally made coils. Before describing what can be created with this technology, it is necessary to take a look at this coil winding process, the MULTIWIRE process, and the industry which has utilized this technology

  6. Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages

    OpenAIRE

    Cauchois, Romain; Saadaoui, Mohamed; Legeleux, Jacques; Malia, Thierry; Dubois-Bonvalot, Béatrice; Inal, Karim; Fidalgo, Jean-Christophe

    2010-01-01

    International audience; The nanoporous nature of the inkjet printed silver nanoparticles entail low hardness and surface effective contact area for being compatible with pads that are suitable for wire-bonding in electronic packaging. Electroless nickel plating is a selective metal deposition technique which can brings the required thickness and hardness for further pads processing. Here, a 1.7 μm thick nickel layer is deposited on top of 600 nm thick printed and sintered silver nanoparticles...

  7. Processamento de placas de circuito impresso de equipamentos eletroeletrônicos de pequeno porte Processing of printed circuit boards of small electrical and electronic devices

    Directory of Open Access Journals (Sweden)

    Sérgio de Souza Henrique Júnior

    2013-01-01

    Full Text Available A hydrometallurgical process applicable to printed circuit boards of small electrical and electronic devices was developed. This involved three leaching steps (60 ºC, 2 h: 6 mol L-1 NaOH, 6 mol L-1 HCl and aqua regia. NaOH removed the resin and flame retardant that covered the circuit boards. HCl dissolved the most electropositive metals and a small amount of copper (~0.3 wt%. Aqua regia dissolved the noble metals. Silver precipitated as AgCl. Gold and platinum were quantitatively extracted with pure methyl-isobutylketone and Alamine 336 (10 % vol. in kerosene, respectively. Slow evaporation of the raffinate crystallized CuCl2.4H2O (89% yield.

  8. Multiple conserved cell adhesion protein interactions mediate neural wiring of a sensory circuit inC. elegans.

    Science.gov (United States)

    Kim, Byunghyuk; Emmons, Scott W

    2017-09-13

    Nervous system function relies on precise synaptic connections. A number of widely-conserved cell adhesion proteins are implicated in cell recognition between synaptic partners, but how these proteins act as a group to specify a complex neural network is poorly understood. Taking advantage of known connectivity in C. elegans , we identified and studied cell adhesion genes expressed in three interacting neurons in the mating circuits of the adult male. Two interacting pairs of cell surface proteins independently promote fasciculation between sensory neuron HOA and its postsynaptic target interneuron AVG: BAM-2/neurexin-related in HOA binds to CASY-1/calsyntenin in AVG; SAX-7/L1CAM in sensory neuron PHC binds to RIG-6/contactin in AVG. A third, basal pathway results in considerable HOA-AVG fasciculation and synapse formation in the absence of the other two. The features of this multiplexed mechanism help to explain how complex connectivity is encoded and robustly established during nervous system development.

  9. Copper sludge from printed circuit board production/recycling for ceramic materials: a quantitative analysis of copper transformation and immobilization.

    Science.gov (United States)

    Tang, Yuanyuan; Lee, Po-Heng; Shih, Kaimin

    2013-08-06

    The fast development of electronic industries and stringent requirement of recycling waste electronics have produced a large amount of metal-containing waste sludge. This study developed a waste-to-resource strategy to beneficially use such metal-containing sludge from the production and recycling processes of printed circuit board (PCBs). To observe the metal incorporation mechanisms and phase transformation processes, mixtures of copper industrial waste sludge and kaolinite-based materials (kaolinite and mullite) were fired between 650 and 1250 °C for 3 h. The different copper-hosting phases were identified by powder X-ray diffraction (XRD) in the sintered products, and CuAl2O4 was found to be the predominant hosting phase throughout the reactions, regardless of the strong reduction potential of copper expected at high temperatures. The experimental results indicated that CuAl2O4 was generated more easily and in larger quantities at low-temperature processing when using the kaolinite precursor. Maximum copper transformations reached 86% and 97% for kaolinite and mullite systems, respectively, when sintering at 1000 °C. To monitor the stabilization effect after thermal process, prolonged leaching tests were carried out using acetic acid with an initial pH value of 2.9 to leach the sintered products for 20 days. The results demonstrated the decrease of copper leachability with the formation of CuAl2O4, despite different sintering behavior in kaolinite and mullite systems. This study clearly indicates spinel formation as the most crucial metal stabilization mechanism when sintering copper sludge with aluminosilicate materials, and suggests a promising and reliable technique for reusing metal-containing sludge as ceramic materials.

  10. An assessment of alternatives for replacing Freon 113 in bench type electrical circuit board cleaning at Fermi National Accelerator Laboratory

    International Nuclear Information System (INIS)

    Isakson, K.; Vessell, A.L.

    1994-07-01

    Fermilab is presently phasing out all solvents containing Freon-113 (CFC-113) as part of the continuing Waste Minimization Program. These solvents are used primarily in cleaning the flux off of electronic circuit boards after soldering, specifically in bench type work. Title VI of the Clean Air Act mandates a production phase-out for ozone depleting substances, like CFC-113, by the year 2000. Our study addresses this issue by evaluating and choosing alternative non-CFC solvents to replace the CFC-1 13 solvents at Fermilab. Several potential non-CFC cleaning solvents were tested. The evaluation took place in three parts: controlled experimental evaluation, chemical composition evaluation, and employee performed evaluation. First, we performed a controlled nine-step procedure with the potential solvents where each was evaluated in categories such as cleaning effectiveness, odor, residue, type of output and drying time. Next, we listed the chemical composition of each solvent. We noted which solvents contained hydrochlorofluorocarbons because they are targeted for phase-out in the future and will be recognized as interim solutions only. Finally, after preliminary testing, five solvents were chosen as the best options. These solvents were sent to be tested by Fermilab employees who use such materials. Their opinions are valuable not only because they are knowledgeable in this field, but also because they will be using the solvents chosen to replace the CFC-113 solvents. The results favored two ''best alternatives'': Safezone Solvent Flux Remover by Miller-Stephenson and E-Series CFC Free Flux-Off 2000 by Chemtech. Another possible solution also pursued is the no-clean solder option. In our study, we were not able to thoroughly investigate the many types of no-clean solders because of time and financial constraints. The testing that was done, however, showed that no-clean solder was a viable alternative in many cases

  11. A novel reutilization method for waste printed circuit boards as flame retardant and smoke suppressant for poly (vinyl chloride)

    Energy Technology Data Exchange (ETDEWEB)

    Xiu, Fu-Rong, E-mail: xiu_chem@hotmail.com [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350108 (China); Weng, Huiwei; Qi, Yingying; Yu, Gending; Zhang, Zhigang [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350108 (China); Zhang, Fu-Shen [Research Center for Eco-Environmental Sciences, Chinese Academy of Sciences, Beijing 100085 (China)

    2016-09-05

    Highlights: • We report a novel electronic waste-based flame retardant for PVC. • The SCWO-treated PCBs significantly improves the flame retardancy of PVC. • The flame retardant mechanism of SCWO-treated PCBs was studied. • Appropriate amount flame retardant does not degrade the mechanical property of PVC. - Abstract: In this study, a novel reutilization method for waste printed circuit boards (PCBs) as flame retardant and smoke suppressant for poly (vinyl chloride) (PVC) was successfully testified. A supercritical water oxidation (SCWO) process was applied to treat waste PCBs before they could be used as flame retardants of PVC. The results indicated that SCWO conditions had a significant effect on the flame retarding and smoke suppressing properties of waste PCBs for PVC. Cu{sub 2}O, CuO, and SnO{sub 2} were the main active ingredients in waste PCBs-derived flame retardants. A conversion of Cu elements (Cu{sup 0} → Cu{sup +} → Cu{sup 2+}) during SCWO process with the increase of reaction temperature was found to be the key influence factor for the flame retarding properties of SCWO-treated PCBs. The experiment results also showed that there was a synergistic effect of flame retardancy between Cu{sup +} and Cu{sup 2+}. After the optimized SCWO treatment, SCWO-treated PCBs significantly improved the flame retardancy and smoke suppression of PVC. Limiting oxygen index (LOI) and char yield (CY) increased with increasing SCWO-treated PCBs content in PVC, while smoke density rating (SDR) and maximum smoke density (MSD) decreased markedly. The mechanical properties of PVC samples were influenced in different degree by adding different content SCWO-treated PCBs.

  12. Copper extraction from coarsely ground printed circuit boards using moderate thermophilic bacteria in a rotating-drum reactor

    Energy Technology Data Exchange (ETDEWEB)

    Rodrigues, Michael L.M., E-mail: mitchel.marques@yahoo.com.br [Bio& Hydrometallurgy Laboratory, Department of Metallurgical and Materials Engineering, Universidade Federal de Ouro Preto, Campus Morro do Cruzeiro, Ouro Preto, MG 35400-000 (Brazil); Leão, Versiane A., E-mail: versiane@demet.em.ufop.br [Bio& Hydrometallurgy Laboratory, Department of Metallurgical and Materials Engineering, Universidade Federal de Ouro Preto, Campus Morro do Cruzeiro, Ouro Preto, MG 35400-000 (Brazil); Gomes, Otavio [Centre for Mineral Technology – CETEM, Av Pedro Calmon, 900, 21941-908 Rio de Janeiro (Brazil); Lambert, Fanny; Bastin, David; Gaydardzhiev, Stoyan [Mineral Processing and Recycling, University of Liege, SartTilman, 4000 Liege (Belgium)

    2015-07-15

    Highlights: • Copper bioleaching from PCB (20 mm) by moderate thermophiles was demonstrated. • Larger PCB sheets enable a cost reduction due to the elimination of fine grinding. • Crushing generated cracks in PCB increasing the copper extraction. • A pre-treatment step was necessary to remove the lacquer coating. • High copper extractions (85%) were possible with pulp density of up to 25.0 g/L. - Abstract: The current work reports on a new approach for copper bioleaching from Printed Circuit Board (PCB) by moderate thermophiles in a rotating-drum reactor. Initially leaching of PCB was carried out in shake flasks to assess the effects of particle size (−208 μm + 147 μm), ferrous iron concentration (1.25–10.0 g/L) and pH (1.5–2.5) on copper leaching using mesophile and moderate thermophile microorganisms. Only at a relatively low solid content (10.0 g/L) complete copper extraction was achieved from the particle size investigated. Conversely, high copper extractions were possible from coarse-ground PCB (20 mm-long) working with increased solids concentration (up to 25.0 g/L). Because there was as the faster leaching kinetics at 50 °C Sulfobacillus thermosulfidooxidans was selected for experiments in a rotating-drum reactor with the coarser-sized PCB sheets. Under optimal conditions, copper extraction reached 85%, in 8 days and microscopic observations by SEM–EDS of the on non-leached and leached material suggested that metal dissolution from the internal layers was restricted by the fact that metal surface was not entirely available and accessible for the solution in the case of the 20 mm-size sheets.

  13. Leaching behavior of copper from waste printed circuit boards with Brønsted acidic ionic liquid

    Energy Technology Data Exchange (ETDEWEB)

    Huang, Jinxiu; Chen, Mengjun, E-mail: kyling@swust.edu.cn; Chen, Haiyan; Chen, Shu; Sun, Quan

    2014-02-15

    Highlights: • A Brønsted acidic ILs was used to leach Cu from WPCBs for the first time. • The particle size of WPCBs has significant influence on Cu leaching rate. • Cu leaching rate was higher than 99% under the optimum leaching conditions. • The leaching process can be modeled with shrinking core model, and the E{sub a} was 25.36 kJ/mol. - Abstract: In this work, a Brønsted acidic ionic liquid, 1-butyl-3-methyl-imidazolium hydrogen sulfate ([bmim]HSO{sub 4}), was used to leach copper from waste printed circuit boards (WPCBs, mounted with electronic components) for the first time, and the leaching behavior of copper was discussed in detail. The results showed that after the pre-treatment, the metal distributions were different with the particle size: Cu, Zn and Al increased with the increasing particle size; while Ni, Sn and Pb were in the contrary. And the particle size has significant influence on copper leaching rate. Copper leaching rate was higher than 99%, almost 100%, when 1 g WPCBs powder was leached under the optimum conditions: particle size of 0.1–0.25 mm, 25 mL 80% (v/v) ionic liquid, 10 mL 30% hydrogen peroxide, solid/liquid ratio of 1/25, 70 °C and 2 h. Copper leaching by [bmim]HSO{sub 4} can be modeled with the shrinking core model, controlled by diffusion through a solid product layer, and the kinetic apparent activation energy has been calculated to be 25.36 kJ/mol.

  14. An assessment of alternatives for replacing Freon 113 in bench type electrical circuit board cleaning at Fermi National Accelerator Laboratory

    Energy Technology Data Exchange (ETDEWEB)

    Isakson, K.; Vessell, A.L.

    1994-07-01

    Fermilab is presently phasing out all solvents containing Freon-113 (CFC-113) as part of the continuing Waste Minimization Program. These solvents are used primarily in cleaning the flux off of electronic circuit boards after soldering, specifically in bench type work. Title VI of the Clean Air Act mandates a production phase-out for ozone depleting substances, like CFC-113, by the year 2000. Our study addresses this issue by evaluating and choosing alternative non-CFC solvents to replace the CFC-1 13 solvents at Fermilab. Several potential non-CFC cleaning solvents were tested. The evaluation took place in three parts: controlled experimental evaluation, chemical composition evaluation, and employee performed evaluation. First, we performed a controlled nine-step procedure with the potential solvents where each was evaluated in categories such as cleaning effectiveness, odor, residue, type of output and drying time. Next, we listed the chemical composition of each solvent. We noted which solvents contained hydrochlorofluorocarbons because they are targeted for phase-out in the future and will be recognized as interim solutions only. Finally, after preliminary testing, five solvents were chosen as the best options. These solvents were sent to be tested by Fermilab employees who use such materials. Their opinions are valuable not only because they are knowledgeable in this field, but also because they will be using the solvents chosen to replace the CFC-113 solvents. The results favored two ``best alternatives``: Safezone Solvent Flux Remover by Miller-Stephenson and E-Series CFC Free Flux-Off 2000 by Chemtech. Another possible solution also pursued is the no-clean solder option. In our study, we were not able to thoroughly investigate the many types of no-clean solders because of time and financial constraints. The testing that was done, however, showed that no-clean solder was a viable alternative in many cases.

  15. Parallel optical interconnect between surface-mounted devices on FR4 printed wiring board using embedded waveguides and passive optical alignments

    Science.gov (United States)

    Karppinen, Mikko; Alajoki, Teemu; Tanskanen, Antti; Kataja, Kari; Mäkinen, Jukka-Tapani; Karioja, Pentti; Immonen, Marika; Kivilahti, Jorma

    2006-04-01

    Technologies to design and fabricate high-bit-rate chip-to-chip optical interconnects on printed wiring boards (PWB) are studied. The aim is to interconnect surface-mounted component packages or modules using board-embedded optical waveguides. In order to demonstrate the developed technologies, a parallel optical interconnect was integrated on a standard FR4-based PWB. It consists of 4-channel BGA-mounted transmitter and receiver modules as well as of four polymer multimode waveguides fabricated on top of the PWB using lithographic patterning. The transmitters and receivers built on low-temperature co-fired ceramic (LTCC) substrates include flip-chip mounted VCSEL or photodiode array and 4x10 Gb/s driver or receiver IC. Two microlens arrays and a surface-mounted micro-mirror enable optical coupling between the optoelectronic device and the waveguide array. The optical alignment is based on the marks and structures fabricated in both the LTCC and optical waveguide processes. The structures were optimized and studied by the use of optical tolerance analyses based on ray tracing. The characterized optical alignment tolerances are in the limits of the accuracy of the surface-mount technology.

  16. Highly flexible self-powered sensors based on printed circuit board technology for human motion detection and gesture recognition.

    Science.gov (United States)

    Fuh, Yiin-Kuen; Ho, Hsi-Chun

    2016-03-04

    In this paper, we demonstrate a new integration of printed circuit board (PCB) technology-based self-powered sensors (PSSs) and direct-write, near-field electrospinning (NFES) with polyvinylidene fluoride (PVDF) micro/nano fibers (MNFs) as source materials. Integration with PCB technology is highly desirable for affordable mass production. In addition, we systematically investigate the effects of electrodes with intervals in the range of 0.15 mm to 0.40 mm on the resultant PSS output voltage and current. The results show that at a strain of 0.5% and 5 Hz, a PSS with a gap interval 0.15 mm produces a maximum output voltage of 3 V and a maximum output current of 220 nA. Under the same dimensional constraints, the MNFs are massively connected in series (via accumulation of continuous MNFs across the gaps ) and in parallel (via accumulation of parallel MNFs on the same gap) simultaneously. Finally, encapsulation in a flexible polymer with different interval electrodes demonstrated that electrical superposition can be realized by connecting MNFs collectively and effectively in serial/parallel patterns to achieve a high current and high voltage output, respectively. Further improvement in PSSs based on the effect of cooperativity was experimentally realized by rolling-up the device into a cylindrical shape, resulting in a 130% increase in power output due to the cooperative effect. We assembled the piezoelectric MNF sensors on gloves, bandages and stockings to fabricate devices that can detect different types of human motion, including finger motion and various flexing and extensions of an ankle. The firmly glued PSSs were tested on the glove and ankle respectively to detect and harvest the various movements and the output voltage was recorded as ∼1.5 V under jumping movement (one PSS) and ∼4.5 V for the clenched fist with five fingers bent concurrently (five PSSs). This research shows that piezoelectric MNFs not only have a huge impact on harvesting various external

  17. Highly flexible self-powered sensors based on printed circuit board technology for human motion detection and gesture recognition

    Science.gov (United States)

    Fuh, Yiin-Kuen; Ho, Hsi-Chun

    2016-03-01

    In this paper, we demonstrate a new integration of printed circuit board (PCB) technology-based self-powered sensors (PSSs) and direct-write, near-field electrospinning (NFES) with polyvinylidene fluoride (PVDF) micro/nano fibers (MNFs) as source materials. Integration with PCB technology is highly desirable for affordable mass production. In addition, we systematically investigate the effects of electrodes with intervals in the range of 0.15 mm to 0.40 mm on the resultant PSS output voltage and current. The results show that at a strain of 0.5% and 5 Hz, a PSS with a gap interval 0.15 mm produces a maximum output voltage of 3 V and a maximum output current of 220 nA. Under the same dimensional constraints, the MNFs are massively connected in series (via accumulation of continuous MNFs across the gaps ) and in parallel (via accumulation of parallel MNFs on the same gap) simultaneously. Finally, encapsulation in a flexible polymer with different interval electrodes demonstrated that electrical superposition can be realized by connecting MNFs collectively and effectively in serial/parallel patterns to achieve a high current and high voltage output, respectively. Further improvement in PSSs based on the effect of cooperativity was experimentally realized by rolling-up the device into a cylindrical shape, resulting in a 130% increase in power output due to the cooperative effect. We assembled the piezoelectric MNF sensors on gloves, bandages and stockings to fabricate devices that can detect different types of human motion, including finger motion and various flexing and extensions of an ankle. The firmly glued PSSs were tested on the glove and ankle respectively to detect and harvest the various movements and the output voltage was recorded as ∼1.5 V under jumping movement (one PSS) and ∼4.5 V for the clenched fist with five fingers bent concurrently (five PSSs). This research shows that piezoelectric MNFs not only have a huge impact on harvesting various external

  18. Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: A case study of electronic component factory

    Directory of Open Access Journals (Sweden)

    Sakulkaew Srisang

    2015-03-01

    Full Text Available The objective of this research is a reduction of an adhesive stain defect in flexible printed circuit board in hot pressing process, the electronic factory. The manufacturing have been processing by sheet type of products with ninety-six pieces of flexible printed circuit boards. Causes of the problem include the before and internal hot pressing process. In process beginning times, the most right row of products between the cooling plate and the hot pressing machine has temperature 71.2◦C that is higher than glass transition temperature (Tg 60◦C. Those products’ temperature lead to evaporate a polyimide adhesive before hot pressing process beginning. The internal hot pressing process include the preheat times and the pressure time. In the preheat time the problem is a gap between lower and upper plate, was under specification (Under 1 mm and leaded to adhesive polyimide stain. In the actuality this time requires temperature and low pressure that mean a gap within 1 – 2 mm (between lower and upper plate. In pressure times the hot pressing plate surface is not flat and products are pressed by insufficient force that it lead to generate an adhesive stain on flexible printed circuit boards. That force is measured by the pre-scale paper and a result, RGB color, is provided. And then color density (From standard color sample and RGB color (From pre-scale paper is found out the relation by Photoshop program and multiple regression theory using. The formula is applied to compare with defect so as to find out the suitable color density (Defects reducing. The solving solutions is provided including the gap reduced adjustment between cooling plate and hot pressing machine before hot pressing process, the plate adjustment within specification in the preheat time and the pressing plate polishing in the pressure time. Results of study and solving are provide defect reduction from 24.4 percentage to 7.2 percentage of total study product.

  19. Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers

    Directory of Open Access Journals (Sweden)

    Pan Yi

    2017-02-01

    Full Text Available The electrochemical migration (ECM behavior of copper-clad laminate (PCB-Cu and electroless nickel/immersion gold printed circuit boards (PCB-ENIG under thin electrolyte layers of different thicknesses containing 0.1 M Na2SO4 was studied. Results showed that, under the bias voltage of 12 V, the reverse migration of ions occurred. For PCB-Cu, both copper dendrites and sulfate precipitates were found on the surface of FR-4 (board material between two plates. Moreover, the Cu dendrite was produced between the two plates and migrated toward cathode. Compared to PCB-Cu, PCB-ENIG exhibited a higher tendency of ECM failure and suffered from seriously short circuit failure under high relative humidity (RH environment. SKP results demonstrated that surface potentials of the anode plates were greater than those of the cathode plates, and those potentials of the two plates exhibited a descending trend as the RH increased. At the end of the paper, an electrochemical migration corrosion failure model of PCB was proposed.

  20. Printed circuit boards: its characteristics and its potential for recycling | Placas de circuito impresso: suas características e seu potencial de reciclagem.

    Directory of Open Access Journals (Sweden)

    Tássia Camila Gonçalves dos Santos

    2016-10-01

    Full Text Available The changes happened in recent decades have allowed technological advances invade our daily lives and significantly increase the consumption of Electrical and Electronic Equipment (EEE. With the life cycle reduced increasingly the related products have been calling attention to an environmental problem, characterized by increasing the volume of such waste, intensified by improper discard. This paper has for aim to study the components of the printed circuit board (PCB considering the heavy metals that compose it, its damages to the environment and man. The PCIs have an average of seventeen metals, highlighting the precious metals that can be used recycling methods. Among the forms of recycling the mechanical process is form less aggressive to the environment and to humans by producing less pollutant wastes. Environmental perspective recycling of printed circuit boards is an important option to reduce the extraction of natural resources, but the informal recycling carried out by associations of collectors, often do not have any kind of assistance or supervision.

  1. Towards plant wires.

    Science.gov (United States)

    Adamatzky, Andrew

    2014-08-01

    In experimental laboratory studies we evaluate a possibility of making electrical wires from living plants. In scoping experiments we use lettuce seedlings as a prototype model of a plant wire. We approximate an electrical potential transfer function by applying direct current voltage to the lettuce seedlings and recording output voltage. We analyse oscillation frequencies of the output potential and assess noise immunity of the plant wires. Our findings will be used in future designs of self-growing wetware circuits and devices, and integration of plant-based electronic components into future and emergent bio-hybrid systems. Copyright © 2014 Elsevier Ireland Ltd. All rights reserved.

  2. Evaluating the Effects of Aging on Electronic Instrument and Control Circuit Boards and Components in Nuclear Power Plants

    International Nuclear Information System (INIS)

    Hannaman, G. Willia; Wilkinson, C. Dan

    2005-01-01

    The report describes potentially useful techniques for monitoring the aging of I and C boards. The techniques have been grouped into: periodic testing, reliability modeling, resistance measures, signal comparison, eternal measures, and internal measures, each representing distinct theoretical approaches to detection and evaluation

  3. Evaluating the Effects of Aging on Electronic Instrument and Control Circuit Boards and Components in Nuclear Power Plants

    Energy Technology Data Exchange (ETDEWEB)

    G. William Hannaman; C. Dan Wilkinson

    2005-05-15

    The report describes potentially useful techniques for monitoring the aging of I&C boards. The techniques have been grouped into: periodic testing, reliability modeling, resistance measures, signal comparison, eternal measures, and internal measures, each representing distinct theoretical approaches to detection and evaluation.

  4. The circuit designer's companion

    CERN Document Server

    Williams, Tim

    1991-01-01

    The Circuit Designer's Companion covers the theoretical aspects and practices in analogue and digital circuit design. Electronic circuit design involves designing a circuit that will fulfill its specified function and designing the same circuit so that every production model of it will fulfill its specified function, and no other undesired and unspecified function.This book is composed of nine chapters and starts with a review of the concept of grounding, wiring, and printed circuits. The subsequent chapters deal with the passive and active components of circuitry design. These topics are foll

  5. Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: a case study of electronic component factory

    Directory of Open Access Journals (Sweden)

    Sakulkaew Srisang

    2014-09-01

    Full Text Available The objective of this research is a reduction of an adhesive stain defect in flexible printed circuit board in hot pressing process, the electronic factory. The manufacturing have been processing by sheet type of products with ninety-six pieces of flexible printed circuit boards. Causes of the problem include the before and internal hot pressing process. In process beginning times, the most right row of products between the cooling plate and the hot pressing machine has temperature 71.2◦C that is higher than glass transition temperature (Tg 60◦C. Those products’ temperature lead to evaporate a polyimide adhesive before hot pressing process beginning. The internal hot pressing process include the preheat times and the pressure time. In the preheat time the problem is a gap between lower and upper plate, was under specification(Under 1 mm and leaded to adhesive polyimide stain. In the actuality this time requires temperature and low pressure that mean a gap within 1 – 2 mm (between lower and upper plate. In pressure times the hot pressing plate surface is not flat and products are pressed by insufficient force that it lead to generate an adhesive stain on flexible printed circuit boards. That force is measured by the pre-scale paper and a result, RGB color, is provided. And then color density (From standard color sample and RGB color (From pre-scale paper is found out the relation by Photoshop program and multiple regression theory using. The formula is applied to compare with defect so as to find out the suitable color density (Defects reducing. The solving solutions is provided including the gap reduced adjustment between cooling plate and hot pressing machine before hot pressing process, the plate adjustment within specification in the preheat time and the pressing plate polishing in the pressure time. Results of study and solving are provide defect reduction from 24.4 percentage to 7.2 percentage of total study product.

  6. Two-wire Interface for Digital Microphones

    NARCIS (Netherlands)

    Groothedde, Wouter; Klumperink, Eric A.M.; Nauta, Bram; Eschauzier, Rudolphe Gustave Hubertus; van Rijn, Nico

    2003-01-01

    A two-wire interface for a digital microphone circuit includes a power line and a ground line. The interface utilizes the ground line as a "voltage active line" to transmit both clock and data signals between the digital microphone circuit and a receiving circuit. The digital microphone circuit

  7. Two-Wire interface for digital microphones

    NARCIS (Netherlands)

    Groothedde, Wouter; Klumperink, Eric A.M.; Nauta, Bram; Eschauzier, Rudolphe Gustave Hubertus; van Rijn, Nico

    2005-01-01

    A two-wire interface for a digital microphone circuit includes a power line and a ground line. The interface utilizes the ground line as a "voltage active line" to transmit both clock and data signals between the digital microphone circuit and a receiving circuit. The digital microphone circuit

  8. Checking a printed board

    CERN Multimedia

    1977-01-01

    An 'Interactive Printed Circuit Board Design System' has been developed by a company in a Member-State. Printed circuits are now produced at the SB's surface treatment workshop using a digitized photo-plotter.

  9. Anisotropic viscoelastic shell modeling technique of copper patterns/photoimageable solder resist composite for warpage simulation of multi-layer printed circuit boards

    International Nuclear Information System (INIS)

    Kim, Do-Hyoung; Joo, Sung-Jun; Kim, Hak-Sung; Kwak, Dong-Ok

    2015-01-01

    In this study, the warpage simulation of a multi-layer printed circuit board (PCB) was performed as a function of various copper (Cu) patterns/photoimageable solder resist (PSR) composite patterns and their anisotropic viscoelastic properties. The thermo-mechanical properties of Cu/PSR patterns were obtained from finite element analysis (virtual test) and homogenized with anisotropic composite shell models that considered the viscoelastic properties. The multi-layer PCB model was simplified based on the unit Cu/PSR patterns and the warpage simulation during the reflow process was performed by using ABAQUS combined with a user-defined subroutine. From these results, it was demonstrated that the proposed anisotropic viscoelastic composite shell simulation technique can be successfully used to predict warpage of multi-layer PCBs during the reflow process. (paper)

  10. Effects of smoke on functional circuits

    International Nuclear Information System (INIS)

    Tanaka, T.J.

    1997-10-01

    Nuclear power plants are converting to digital instrumentation and control systems; however, the effects of abnormal environments such as fire and smoke on such systems are not known. There are no standard tests for smoke, but previous smoke exposure tests at Sandia National Laboratories have shown that digital communications can be temporarily interrupted during a smoke exposure. Another concern is the long-term corrosion of metals exposed to the acidic gases produced by a cable fire. This report documents measurements of basic functional circuits during and up to 1 day after exposure to smoke created by burning cable insulation. Printed wiring boards were exposed to the smoke in an enclosed chamber for 1 hour. For high-resistance circuits, the smoke lowered the resistance of the surface of the board and caused the circuits to short during the exposure. These circuits recovered after the smoke was vented. For low-resistance circuits, the smoke caused their resistance to increase slightly. A polyurethane conformal coating substantially reduced the effects of smoke. A high-speed digital circuit was unaffected. A second experiment on different logic chip technologies showed that the critical shunt resistance that would cause failure was dependent on the chip technology and that the components used in the smoke exposures were some of the most smoke tolerant. The smoke densities in these tests were high enough to cause changes in high impedance (resistance) circuits during exposure, but did not affect most of the other circuits. Conformal coatings and the characteristics of chip technologies should be considered when designing circuitry for nuclear power plant safety systems, which must be highly reliable under a variety of operating and accident conditions. 10 refs., 34 figs., 18 tabs

  11. Effects of smoke on functional circuits

    Energy Technology Data Exchange (ETDEWEB)

    Tanaka, T.J.

    1997-10-01

    Nuclear power plants are converting to digital instrumentation and control systems; however, the effects of abnormal environments such as fire and smoke on such systems are not known. There are no standard tests for smoke, but previous smoke exposure tests at Sandia National Laboratories have shown that digital communications can be temporarily interrupted during a smoke exposure. Another concern is the long-term corrosion of metals exposed to the acidic gases produced by a cable fire. This report documents measurements of basic functional circuits during and up to 1 day after exposure to smoke created by burning cable insulation. Printed wiring boards were exposed to the smoke in an enclosed chamber for 1 hour. For high-resistance circuits, the smoke lowered the resistance of the surface of the board and caused the circuits to short during the exposure. These circuits recovered after the smoke was vented. For low-resistance circuits, the smoke caused their resistance to increase slightly. A polyurethane conformal coating substantially reduced the effects of smoke. A high-speed digital circuit was unaffected. A second experiment on different logic chip technologies showed that the critical shunt resistance that would cause failure was dependent on the chip technology and that the components used in the smoke exposures were some of the most smoke tolerant. The smoke densities in these tests were high enough to cause changes in high impedance (resistance) circuits during exposure, but did not affect most of the other circuits. Conformal coatings and the characteristics of chip technologies should be considered when designing circuitry for nuclear power plant safety systems, which must be highly reliable under a variety of operating and accident conditions. 10 refs., 34 figs., 18 tabs.

  12. Computer simulation of the pneumatic separator in the pneumatic-electrostatic separation system for recycling waste printed circuit boards with electronic components.

    Science.gov (United States)

    Xue, Mianqiang; Xu, Zhenming

    2013-05-07

    Technologies could be integrated in different ways into automatic recycling lines for a certain kind of electronic waste according to practical requirements. In this study, a new kind of pneumatic separator with openings at the dust hooper was applied combing with electrostatic separation for recycling waste printed circuit boards. However, the flow pattern and the particles' movement behavior could not be obtained by experimental methods. To better control the separation quantity and the material size distribution, computational fluid dynamics was used to model the new pneumatic separator giving a detailed understanding of the mechanisms. Simulated results showed that the tangential velocity direction reversed with a relatively small value. Axial velocity exhibited two sharp decreases at the x axis. It is indicated that the bottom openings at the dust hopper resulted in an enormous change in the velocity profile. A new phenomenon that was named dusting was observed, which would mitigate the effect of particles with small diameter on the following electrostatic separation and avoid materials plugging caused by the waste printed circuit boards special properties effectively. The trapped materials were divided into seven grades. Experimental results showed that the mass fraction of grade 5, grade 6, and grade 7 materials were 27.54%, 15.23%, and 17.38%, respectively. Grade 1 particles' mass fraction was reduced by 80.30% compared with a traditional separator. Furthermore, the monocrystalline silicon content in silicon element in particles with a diameter of -0.091 mm was 18.9%, higher than that in the mixed materials. This study could serve as guidance for the future material flow control, automation control, waste recycling, and semiconductor storage medium destruction.

  13. The major components of particles emitted during recycling of waste printed circuit boards in a typical e-waste workshop of South China

    Science.gov (United States)

    Bi, Xinhui; Simoneit, Bernd R. T.; Wang, ZhenZhen; Wang, Xinming; Sheng, Guoying; Fu, Jiamo

    2010-11-01

    Electronic waste from across the world is dismantled and disposed of in China. The low-tech recycling methods have caused severe air pollution. Air particle samples from a typical workshop of South China engaged in recycling waste printed circuit boards have been analyzed with respect to chemical constituents. This is the first report on the chemical composition of particulate matter (PM) emitted in an e-waste recycling workshop of South China. The results show that the composition of PM from this recycling process was totally different from other emission sources. Organic matter comprised 46.7-51.6% of the PM. The major organic constituents were organophosphates consisting mainly of triphenyl phosphate (TPP) and its methyl substituted compounds, methyl esters of hexadecanoic and octadecanoic acids, levoglucosan and bisphenol A. TPP and bisphenol A were present at 1-5 orders of magnitude higher than in other indoor and outdoor environments throughout the world, which implies that they might be used as potential markers for e-waste recycling. The elemental carbon, inorganic elements and ions had a minor contribution to the PM (<5% each). The inorganic elements were dominated by phosphorus and followed by crustal elements and metal elements Pb, Zn, Sn, and lesser Cu, Sb, Mn, Ni, Ba and Cd. The recycling of printed circuit boards was demonstrated as an important contributor of heavy metal contamination, particularly Cd, Pb and Ni, to the local environment. These findings suggest that this recycling method represents a strong source of PM associated with pollutants to the ambient atmosphere of an e-waste recycling locale.

  14. Wire Array Photovoltaics

    Science.gov (United States)

    Turner-Evans, Dan

    Over the past five years, the cost of solar panels has dropped drastically and, in concert, the number of installed modules has risen exponentially. However, solar electricity is still more than twice as expensive as electricity from a natural gas plant. Fortunately, wire array solar cells have emerged as a promising technology for further lowering the cost of solar. Si wire array solar cells are formed with a unique, low cost growth method and use 100 times less material than conventional Si cells. The wires can be embedded in a transparent, flexible polymer to create a free-standing array that can be rolled up for easy installation in a variety of form factors. Furthermore, by incorporating multijunctions into the wire morphology, higher efficiencies can be achieved while taking advantage of the unique defect relaxation pathways afforded by the 3D wire geometry. The work in this thesis shepherded Si wires from undoped arrays to flexible, functional large area devices and laid the groundwork for multijunction wire array cells. Fabrication techniques were developed to turn intrinsic Si wires into full p-n junctions and the wires were passivated with a-Si:H and a-SiNx:H. Single wire devices yielded open circuit voltages of 600 mV and efficiencies of 9%. The arrays were then embedded in a polymer and contacted with a transparent, flexible, Ni nanoparticle and Ag nanowire top contact. The contact connected >99% of the wires in parallel and yielded flexible, substrate free solar cells featuring hundreds of thousands of wires. Building on the success of the Si wire arrays, GaP was epitaxially grown on the material to create heterostructures for photoelectrochemistry. These cells were limited by low absorption in the GaP due to its indirect bandgap, and poor current collection due to a diffusion length of only 80 nm. However, GaAsP on SiGe offers a superior combination of materials, and wire architectures based on these semiconductors were investigated for multijunction

  15. Basic Wiring.

    Science.gov (United States)

    Kaltwasser, Stan; And Others

    This module is the first in a series of three wiring publications; it serves as the foundation for students enrolled in a wiring program. It is a prerequisite to either "Residential Wiring" or "Commercial and Industrial Wiring." The module contains 16 instructional units that cover the following topics: occupational…

  16. Wiring and lighting

    CERN Document Server

    Kitcher, Chris

    2013-01-01

    Wiring and Lighting provides a comprehensive guide to DIY wiring around the home. It sets out the regulations and legal requirements surrounding electrical installation work, giving clear guidelines that will enable the reader to understand what electrical work they are able to carry out, and what the testing and certification requirements are once the work is completed. Topics covered include: Different types of circuits; Types of cables and cable installation under floors and through joists; Isolating, earthing and bonding; Accessory boxes and fixings; Voltage bands; Detailed advice on safe

  17. Analysis of the treatment of plastic from electrical and electronic waste in the Republic of Serbia and the testing of the recycling potential of non-metallic fractions of printed circuit boards

    Directory of Open Access Journals (Sweden)

    Vučinić Aleksandra S.

    2017-01-01

    Full Text Available This paper presents the analysis of the quantity of plastic and waste printed circuit boards obtained after the mechanical treatment of electrical and electronic waste (E-waste in the Republic of Serbia, as well as the recycling of non-metallic fractions of waste printed circuit boards. The aim is to analyze the obtained recycled material and recommendation for possible application of recyclables. The data on the quantities and treatment of plastics and printed circuit boards obtained after the mechanical treatment of WEEE, were gained through questionnaires sent to the operators who treat this type of waste. The results of the questionnaire analysis showed that in 2014 the dismantling of E-waste isolated 1,870.95 t of plastic and 499.85 t of printed circuit boards. In the Republic of Serbia, E-waste recycling is performed exclusively by using mechanical methods. Mechanical methods consist of primary crushing and separation of the materials which have a utility value as secondary raw materials, from the components and materials that have hazardous properties. Respect to that, the recycling of printed circuit boards using some of the metallurgical processes with the aim of extracting copper, precious metals and non-metallic fraction is completely absent, and the circuit boards are exported as a whole. Given the number of printed circuit boards obtained by E-waste dismantling, and the fact that from an economic point of view, hydrometallurgical methods are very suitable technological solutions in the case of a smaller capacity, there is a possibility for establishing the facilities in the Republic of Serbia for the hydrometallurgical treatment that could be used for metals extraction, and non-metallic fractions, which also have their own value. Printed circuit boards granulate obtained after the mechanical pretreatment and the selective removal of metals by hydrometallurgical processes was used for the testing of the recycling potential

  18. Bioleaching of Gold and Silver from Waste Printed Circuit Boards by Pseudomonas balearica SAE1 Isolated from an e-Waste Recycling Facility.

    Science.gov (United States)

    Kumar, Anil; Saini, Harvinder Singh; Kumar, Sudhir

    2018-02-01

    Indigenous bacterial strain Pseudomonas balearica SAE1, tolerant to e-waste toxicity was isolated from an e-waste recycling facility Exigo Recycling Pvt. Ltd., India. Toxicity tolerance of bacterial strain was analyzed using crushed (particle size ≤150 µm) waste computer printed circuit boards (PCBs)/liter (L) of culture medium. The EC 50 value for SAE1 was 325.7 g/L of the e-waste pulp density. Two-step bioleaching was then applied to achieve the dissolution of gold (Au) and silver (Ag) from the e-waste. To maximize precious metal dissolution, factors including pulp density, glycine concentration, pH level, and temperature were optimized. The optimization resulted in 68.5 and 33.8% of Au and Ag dissolution, respectively, at a pH of 9.0, a pulp density of 10 g/L, a temperature of 30 °C, and a glycine concentration of 5 g/L. This is the first study of Au and Ag bioleaching using indigenous e-waste bacteria and its analysis to determine e-waste toxicity tolerance.

  19. Eco-friendly copper recovery process from waste printed circuit boards using Fe{sup 3+}/Fe{sup 2+} redox system

    Energy Technology Data Exchange (ETDEWEB)

    Fogarasi, Szabolcs [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Imre-Lucaci, Florica [Babeş-Bolyai University, Interdisciplinary Research Institute on Bio-Nano-Sciences, 42 Treboniu Laurian Street, Cluj-Napoca RO-400271 (Romania); Egedy, Attila [University of Pannonia, Department of Process Engineering, Egyetem Str. 10, H-8200 Veszprém (Hungary); Imre-Lucaci, Árpád, E-mail: aimre@chem.ubbcluj.ro [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Ilea, Petru [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania)

    2015-06-15

    Highlights: • We developed an ecofriendly mediated electrochemical process for copper recovery. • The recovery of copper was achieved without mechanical pretreatment of the samples. • We identified the optimal flow rate for the leaching and electrowinning of copper. • The copper content of the obtained cathodic deposits was over 99.9%. - Abstract: The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe{sup 3+} combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%.

  20. Co-recycling of acrylonitrile-butadiene-styrene waste plastic and nonmetal particles from waste printed circuit boards to manufacture reproduction composites.

    Science.gov (United States)

    Sun, Zhixing; Shen, Zhigang; Zhang, Xiaojing; Ma, Shulin

    2015-01-01

    This study investigated the feasibility of using acrylonitrile-butadiene-styrene (ABS) waste plastic and nonmetal particles from waste printed circuit boards (WPCB) to manufacture reproduction composites (RC), with the aim of co-recycling these two waste resources. The composites were prepared in a twin-crew extruder and investigated by means of mechanical testing, in situ flexural observation, thermogravimatric analysis, and dimensional stability evaluation. The results showed that the presence of nonmetal particles significantly improved the mechanical properties and the physical performance of the RC. A loading of 30 wt% nonmetal particles could achieve a flexural strength of 72.6 MPa, a flexural modulus of 3.57 GPa, and an impact strength of 15.5 kJ/m2. Moreover, it was found that the application of maleic anhydride-grafted ABS as compatilizer could effectively promote the interfacial adhesion between the ABS plastic and the nonmetal particles. This research provides a novel method to reuse waste ABS and WPCB nonmetals for manufacturing high value-added product, which represents a promising way for waste recycling and resolving the environmental problem.

  1. Measuring the layer-average volumetric water content in the uppermost 5 cm of soil using printed circuit board TDR probes

    International Nuclear Information System (INIS)

    Wang, W.; Kobayashi, T.; Chikushi, J.

    2000-01-01

    Newly designed printed circuit board TDR probes (PCBPs) were made, and they were calibrated by indoor experiment. A regression equation for estimating the volumetric water content from the dielectric constant measured with the PCBP was determined, which is almost the same as the well-known Topp's equation when the soil is rather wet while the difference becomes larger as the soil dries. The PCBP was designed to measure the average water content over a soil layer 5 cm thick because the thickness of soil layer involved in measuring water content by microwave remote sensing is several centimeters. A comparison experiment of measurements with PCBPs and those by microwave remote sensing was conducted in an arid area in the northwest of China. The results of this experiment show that the newly designed TDR probe is promising as the sensor to get ground truth of the surface wetness. This paper describes only the calibration of probes and the observations taken using them

  2. A new technology for separation and recovery of materials from waste printed circuit boards by dissolving bromine epoxy resins using ionic liquid.

    Science.gov (United States)

    Zhu, P; Chen, Y; Wang, L Y; Qian, G Y; Zhou, M; Zhou, J

    2012-11-15

    Recovery of valuable materials from waste printed circuit boards (WPCBs) is quite difficult because WPCBs is a heterogeneous mixture of polymer materials, glass fibers, and metals. In this study, WPCBs was treated using ionic liquid (1-ethyl-3-methylimizadolium tetrafluoroborate [EMIM+][BF4-]). Experimental results showed that the separation of the solders went to completion, and electronic components (ECs) were removed in WPCBs when [EMIM+][BF4-] solution containing WPCBs was heated to 240 °C. Meanwhile, metallographic observations verified that the WPCBs had an initial delamination. When the temperature increased to 260 °C, the separation of the WPCBs went to completion, and coppers and glass fibers were obtained. The used [EMIM+][BF4-] was treated by water to generate a solid-liquid suspension, which was separated completely to obtain solid residues by filtration. Thermal analyses combined with infrared ray spectra (IR) observed that the solid residues were bromine epoxy resins. NMR (nuclear magnetic resonance) showed that hydrogen bond played an important role for [EMIM+][BF4-] dissolving bromine epoxy resins. This clean and non-polluting technology offers a new way to recycle valuable materials from WPCBs and prevent environmental pollution from WPCBs effectively. Crown Copyright © 2012. Published by Elsevier B.V. All rights reserved.

  3. MDT WIRE TENSION MEASUREMENT USING AN ELECTROSTATIC METHOD

    CERN Document Server

    Balla, A; Esposito, B; Felici, G; Nedosekin, A; Ponzio, B; Russo, V; Spitalieri, M C

    1998-01-01

    An automated system to measure wire tension in MDT tubes is presented.The method uses electrostatic forces between wire and tube to excite mechanical oscillation around the wire harmonic resonance. A LC oscillating circuit is used to measure capacitance variation due towire oscillation. Wire tension is determined by the frequency at which the wirereaches the maximum oscillation amplitude. Both the excitation and measuring circuits are controlled by a computer.

  4. Wire Chamber

    CERN Multimedia

    Magnetoscriptive readout wire chamber. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  5. Wire chamber

    CERN Multimedia

    1967-01-01

    Magnetoscriptive readout wire chamber.Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  6. A One Chip Hardened Solution for High Speed SpaceWire System Implementations. Session: Components

    Science.gov (United States)

    Marshall, Joseph R.; Berger, Richard W.; Rakow, Glenn P.

    2007-01-01

    An Application Specific Integrated Circuit (ASIC) that implements the SpaceWire protocol has been developed in a radiation hardened 0.25 micron CMOS technology. This effort began in March 2003 as a joint development between the NASA Goddard Space Flight Center (GSFC) and BAE Systems. The BAE Systems SpaceWire ASIC is comprised entirely of reusable core elements, many of which are already flight-proven. It incorporates a router with 4 SpaceWire ports and two local ports, dual PC1 bus interfaces, a microcontroller, 32KB of internal memory, and a memory controller for additional external memory use. The SpaceWire cores are also reused in other ASICs under development. The SpaceWire ASIC is planned for use on the Geostationary Operational Environmental Satellites (GOES)-R, the Lunar Reconnaissance Orbiter (LRO) and other missions. Engineering and flight parts have been delivered to programs and users. This paper reviews the SpaceWire protocol and those elements of it that have been built into the current and next SpaceWire reusable cores and features within the core that go beyond the current standard and can be enabled or disabled by the user. The adaptation of SpaceWire to BAE Systems' On Chip Bus (OCB) for compatibility with the other reusable cores will be reviewed and highlighted. Optional configurations within user systems and test boards will be shown. The physical implementation of the design will be described and test results from the hardware will be discussed. Application of this ASIC and other ASICs containing the SpaceWire cores and embedded microcontroller to Plug and Play and reconfigurable implementations will be described. Finally, the BAE Systems roadmap for SpaceWire developments will be updated, including some products already in design as well as longer term plans.

  7. wire chamber

    CERN Multimedia

    Proportional multi-wire chamber. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle. Proportional wire chambers allow a much quicker reading than the optical or magnetoscriptive readout wire chambers.

  8. Printed circuit for ATLAS

    CERN Multimedia

    Laurent Guiraud

    1999-01-01

    A printed circuit board made by scientists in the ATLAS collaboration for the transition radiaton tracker (TRT). This will read data produced when a high energy particle crosses the boundary between two materials with different electrical properties.

  9. Wiring design for the control of electromagnetic interference (EMI)

    Science.gov (United States)

    Kopasakis, George

    1995-01-01

    Wiring design is only one important aspect of EMI control. Other important areas for EMI are: circuit design, filtering, grounding, bonding, shielding, lighting, electrostatic discharge (ESD), transient suppression, and electromagnetic pulse (EMP). Topics covered include: wire magnetic field emissions at low frequencies; wire radiated magnetic field emissions at frequencies; wire design guidelines for EMI control; wire design guidelines for EMI control; high frequency emissions from cables; and pulse frequency spectra.

  10. Advanced degradation of brominated epoxy resin and simultaneous transformation of glass fiber from waste printed circuit boards by improved supercritical water oxidation processes.

    Science.gov (United States)

    Liu, Kang; Zhang, Zhiyuan; Zhang, Fu-Shen

    2016-10-01

    This work investigated various supercritical water oxidation (SCWO) systems, i.e. SCWO1 (only water), SCWO2 (water+H2O2) and SCWO3 (water+H2O2/NaOH), for waste printed circuit boards (PCBs) detoxification and recycling. Response surface methodology (RSM) was applied to optimize the operating conditions of the optimal SCWO3 systems. The optimal reaction conditions for debromination were found to be the NaOH of 0.21g, the H2O2 volume of 9.04mL, the time of 39.7min, maximum debromination efficiency of 95.14%. Variance analysis indicated that the factors influencing debromination efficiency was in the sequence of NaOH>H2O2>time. Mechanism studies indicated that the dissociated ions from NaOH in supercritical water promoted the debromination of brominated epoxy resins (BERs) through an elimination reaction and nucleophilic substitution. HO2, produced by H2O2 could induce the oxidation of phenol ring to open (intermediates of BERs), which were thoroughly degraded to form hydrocarbons, CO2, H2O and NaBr. In addition, the alkali-silica reaction between OH(-) and SiO2 induced the phase transformation of glass fibers, which were simultaneously converted into anorthite and albite. Waste PCBs in H2O2/NaOH improved SCWO system were fully degraded into useful products and simultaneously transformed into functional materials. These findings are helpful for efficient recycling of waste PCBs. Copyright © 2016 Elsevier Ltd. All rights reserved.

  11. Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment.

    Science.gov (United States)

    Xiu, Fu-Rong; Qi, Yingying; Zhang, Fu-Shen

    2015-07-01

    Precious metals are the most attractive resources in waste printed circuit boards (PCBs) of mobile phones. In this work, an alternative process for recovering Au, Ag, and Pd from waste PCBs of mobile phones by supercritical water oxidation (SCWO) pre-treatment combined with iodine-iodide leaching process was developed. In the process, the waste PCBs of mobile phones were pre-treated in supercritical water, then a diluted hydrochloric acid leaching (HL) process was used to recovery the Cu, whose leaching efficiency was approximately 100%, finally the resulting residue was subjected to the iodine-iodide leaching process for recovering the Au, Ag, and Pd. Experimental results indicated that SCWO pre-treatment temperature, time, and pressure had significant influence on the Au, Ag, and Pd leaching from (SCWO+HL)-treated waste PCBs. The optimal SCWO pre-treatment conditions were 420°C and 60min for Au and Pd, and 410°C and 30min for Ag. The optimum dissolution parameters for Au, Pd, and Ag in (SCWO+HL)-treated PCBs with iodine-iodide system were leaching time of 120min (90min for Ag), iodine/iodide mole ratio of 1:5 (1:6 for Ag), solid-to-liquid ratio (S/L) of 1:10g/mL (1:8g/mL for Ag), and pH of 9, respectively. It is believed that the process developed in this study is environment friendly for the recovery of Au, Ag, and Pd from waste PCBs of mobile phones by SCWO pre-treatment combined with iodine-iodide leaching process. Copyright © 2015 Elsevier Ltd. All rights reserved.

  12. A new technology for separation and recovery of materials from waste printed circuit boards by dissolving bromine epoxy resins using ionic liquid

    International Nuclear Information System (INIS)

    Zhu, P.; Chen, Y.; Wang, L.Y.; Qian, G.Y.; Zhou, M.; Zhou, J.

    2012-01-01

    Highlights: ► WPCBs were heated in [EMIM + ][BF 4 − ] for recovering solider at 240 °C. ► The bromine epoxy resins in WPCBs were all dissolved in [EMIM + ][BF 4 − ] at 260 °C. ► Used [EMIM + ][BF 4 − ] is treated by water to obtain regeneration. - Abstract: Recovery of valuable materials from waste printed circuit boards (WPCBs) is quite difficult because WPCBs is a heterogeneous mixture of polymer materials, glass fibers, and metals. In this study, WPCBs was treated using ionic liquid (1-ethyl-3-methylimizadolium tetrafluoroborate [EMIM + ][BF 4 − ]). Experimental results showed that the separation of the solders went to completion, and electronic components (ECs) were removed in WPCBs when [EMIM + ][BF 4 − ] solution containing WPCBs was heated to 240 °C. Meanwhile, metallographic observations verified that the WPCBs had an initial delamination. When the temperature increased to 260 °C, the separation of the WPCBs went to completion, and coppers and glass fibers were obtained. The used [EMIM + ][BF 4 − ] was treated by water to generate a solid–liquid suspension, which was separated completely to obtain solid residues by filtration. Thermal analyses combined with infrared ray spectra (IR) observed that the solid residues were bromine epoxy resins. NMR (nuclear magnetic resonance) showed that hydrogen bond played an important role for [EMIM + ][BF 4 − ] dissolving bromine epoxy resins. This clean and non-polluting technology offers a new way to recycle valuable materials from WPCBs and prevent environmental pollution from WPCBs effectively.

  13. Assessment of noise and heavy metals (Cr, Cu, Cd, Pb) in the ambience of the production line for recycling waste printed circuit boards.

    Science.gov (United States)

    Xue, Mianqiang; Yang, Yichen; Ruan, Jujun; Xu, Zhenming

    2012-01-03

    The crush-pneumatic separation-corona electrostatic separation production line provides a feasible method for industrialization of waste printed circuit boards (PCBs) recycling. To determine the potential environmental contamination in the automatic line workshop, noise and heavy metals (Cr, Cu, Cd, Pb) in the ambience of the production line have been evaluated in this paper. The mean noise level in the workshop has been reduced from 96.4 to 79.3 dB since the engineering noise control measures were employed. Noise whose frequency ranged from 500 to 1000 Hz is controlled effectively. The mass concentrations of TSP and PM(10) in the workshop are 282.6 and 202.0 μg/m(3), respectively. Pb (1.40 μg/m(3)) and Cu (1.22 μg/m(3)) are the most enriched metals in TSP samples followed by Cr (0.17 μg/m(3)) and Cd (0.028 μg/m(3)). The concentrations of Cu, Pb, Cr, and Cd in PM(10) are 0.88, 0.56, 0.12, and 0.88 μg/m(3), respectively. Among the four metals, Cr and Pb are released into the ambience of the automatic line more easily in the crush and separation process. Health risk assessment shows that noncancerous effects might be possible for Pb (HI = 1.45), and noncancerous effects are unlikely for Cr, Cu, and Cd. The carcinogenic risks for Cr and Cd are 3.29 × 10(-8) and 1.61 × 10(-9), respectively. It indicates that carcinogenic risks on workers are relatively light in the workshop. These findings suggest that this technology is advanced from the perspective of environmental protection in the waste PCBs recycling industry.

  14. Wiring of interpolation unit of mass spectrometer oscilloscope

    International Nuclear Information System (INIS)

    Paryzek, J.

    1981-01-01

    The combinatory logic circuit block is wired across the input terminal of oscilloscope intensity modulation and the output terminal of the sweep delay control block, the output terminal of the block for mains frequency division, and the output terminal of the pulse shaper block. It consists of a dual-input AND circuit and a dual-input OR circuit whose one input is wired to the output of one of the dual-input AND circuit. (J.P.)

  15. wire chamber

    CERN Multimedia

    Was used in ISR (Intersecting Storage Ring) split field magnet experiment. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  16. Wire chamber

    CERN Multimedia

    Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  17. wire chamber

    CERN Multimedia

    Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  18. wire chamber

    CERN Multimedia

    1985-01-01

    Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  19. Tensosensitivity of the Hot-Wire Probe

    National Research Council Canada - National Science Library

    Pak, A

    2002-01-01

    ...., on the anemometer type. In a constant current anemometer, it is possible to measure and separate out the noise moving to the electric circuit of the anemometer, it is not the case with hot-wire anemometers of other types...

  20. Printed Circuit Board Quality Assurance

    Science.gov (United States)

    Sood, Bhanu

    2016-01-01

    PCB Assurance Summary: PCB assurance actives are informed by risk in context of the Project. Lessons are being applied across Projects for continuous improvements. Newer component technologies, smaller/high pitch devices: tighter and more demanding PCB designs: Identifying new research areas. New materials, designs, structures and test methods.

  1. IEE wiring regulations explained and illustrated

    CERN Document Server

    Scaddan, Brian

    2013-01-01

    The IEE Wiring Regulations Explained and Illustrated, Second Edition discusses the recommendations of the IEE Regulations for the Electrical Equipment of Buildings for the safe selection or erection of wiring installations. The book emphasizes earthing, bonding, protection, and circuit design of electrical wirings. The text reviews the fundamental requirements for safety, earthing systems, the earth fault loop impedance, and supplementary bonding. The book also describes the different types of protection, such as protection against mechanical damage, overcurrent, under voltage (which prevents

  2. Organization Of The Drosophila Larval Visual Circuit

    OpenAIRE

    Fritsch, Pauline; Gendre, Nanae; Maier, Larisa; Fetter, Rick; Schneider-Mizell, Casey; Truman, James; Zlatic, Marta; Cardona, Albert; Larderet, Ivan; Sprecher, Simon

    2017-01-01

    Visual systems transduce, process and transmit light-dependent environmental cues. Computation of visual features depends on the types of photoreceptor neurons (PR) present, the organization of the eye and the wiring of the underlying neural circuit. Here, we describe the circuit architecture of the visual system of Drosophila larvae by mapping the synaptic wiring diagram and neurotransmitters. By contacting different targets, the two larval PR-subtypes create parallel circuits potentially un...

  3. Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment

    International Nuclear Information System (INIS)

    Xiu, Fu-Rong; Qi, Yingying; Zhang, Fu-Shen

    2015-01-01

    Highlights: • We report a novel process for recovering Au, Ag, and Pd from waste PCBs. • The effect of SCWO on the leaching of Au, Ag, and Pd in waste PCBs was studied. • SCWO was highly efficient for enhancing the leaching of Au, Ag, and Pd. • The optimum leaching parameters for Au, Ag, and Pd in iodine–iodide were studied. - Abstract: Precious metals are the most attractive resources in waste printed circuit boards (PCBs) of mobile phones. In this work, an alternative process for recovering Au, Ag, and Pd from waste PCBs of mobile phones by supercritical water oxidation (SCWO) pre-treatment combined with iodine–iodide leaching process was developed. In the process, the waste PCBs of mobile phones were pre-treated in supercritical water, then a diluted hydrochloric acid leaching (HL) process was used to recovery the Cu, whose leaching efficiency was approximately 100%, finally the resulting residue was subjected to the iodine–iodide leaching process for recovering the Au, Ag, and Pd. Experimental results indicated that SCWO pre-treatment temperature, time, and pressure had significant influence on the Au, Ag, and Pd leaching from (SCWO + HL)-treated waste PCBs. The optimal SCWO pre-treatment conditions were 420 °C and 60 min for Au and Pd, and 410 °C and 30 min for Ag. The optimum dissolution parameters for Au, Pd, and Ag in (SCWO + HL)-treated PCBs with iodine–iodide system were leaching time of 120 min (90 min for Ag), iodine/iodide mole ratio of 1:5 (1:6 for Ag), solid-to-liquid ratio (S/L) of 1:10 g/mL (1:8 g/mL for Ag), and pH of 9, respectively. It is believed that the process developed in this study is environment friendly for the recovery of Au, Ag, and Pd from waste PCBs of mobile phones by SCWO pre-treatment combined with iodine–iodide leaching process

  4. Process development for recovery of copper and precious metals from waste printed circuit boards with emphasize on palladium and gold leaching and precipitation.

    Science.gov (United States)

    Behnamfard, Ali; Salarirad, Mohammad Mehdi; Veglio, Francesco

    2013-11-01

    A novel hydrometallurgical process was proposed for selective recovery of Cu, Ag, Au and Pd from waste printed circuit boards (PCBs). More than 99% of copper content was dissolved by using two consecutive sulfuric acid leaching steps in the presence of H2O2 as oxidizing agents. The solid residue of 2nd leaching step was treated by acidic thiourea in the presence of ferric iron as oxidizing agent and 85.76% Au and 71.36% Ag dissolution was achieved. The precipitation of Au and Ag from acidic thiourea leachate was investigated by using different amounts of sodium borohydride (SBH) as a reducing agent. The leaching of Pd and remained gold from the solid reside of 3rd leaching step was performed in NaClO-HCl-H2O2 leaching system and the effect of different parameters was investigated. The leaching of Pd and specially Au increased by increasing the NaClO concentration up to 10V% and any further increasing the NaClO concentration has a negligible effect. The leaching of Pd and Au increased by increasing the HCl concentration from 2.5 to 5M. The leaching of Pd and Au were endothermic and raising the temperature had a positive effect on leaching efficiency. The kinetics of Pd leaching was quite fast and after 30min complete leaching of Pd was achieved, while the leaching of Au need a longer contact time. The best conditions for leaching of Pd and Au in NaClO-HCl-H2O2 leaching system were determined to be 5M HCl, 1V% H2O2, 10V% NaClO at 336K for 3h with a solid/liquid ratio of 1/10. 100% of Pd and Au of what was in the chloride leachate were precipitated by using 2g/L SBH. Finally, a process flow sheet for the recovery of Cu, Ag, Au and Pd from PCB was proposed. Copyright © 2013 Elsevier Ltd. All rights reserved.

  5. Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment

    Energy Technology Data Exchange (ETDEWEB)

    Xiu, Fu-Rong, E-mail: xiu_chem@hotmail.com [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350108 (China); Qi, Yingying [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350108 (China); Zhang, Fu-Shen [Research Center for Eco-Environmental Sciences, Chinese Academy of Sciences, Beijing 100085 (China)

    2015-07-15

    Highlights: • We report a novel process for recovering Au, Ag, and Pd from waste PCBs. • The effect of SCWO on the leaching of Au, Ag, and Pd in waste PCBs was studied. • SCWO was highly efficient for enhancing the leaching of Au, Ag, and Pd. • The optimum leaching parameters for Au, Ag, and Pd in iodine–iodide were studied. - Abstract: Precious metals are the most attractive resources in waste printed circuit boards (PCBs) of mobile phones. In this work, an alternative process for recovering Au, Ag, and Pd from waste PCBs of mobile phones by supercritical water oxidation (SCWO) pre-treatment combined with iodine–iodide leaching process was developed. In the process, the waste PCBs of mobile phones were pre-treated in supercritical water, then a diluted hydrochloric acid leaching (HL) process was used to recovery the Cu, whose leaching efficiency was approximately 100%, finally the resulting residue was subjected to the iodine–iodide leaching process for recovering the Au, Ag, and Pd. Experimental results indicated that SCWO pre-treatment temperature, time, and pressure had significant influence on the Au, Ag, and Pd leaching from (SCWO + HL)-treated waste PCBs. The optimal SCWO pre-treatment conditions were 420 °C and 60 min for Au and Pd, and 410 °C and 30 min for Ag. The optimum dissolution parameters for Au, Pd, and Ag in (SCWO + HL)-treated PCBs with iodine–iodide system were leaching time of 120 min (90 min for Ag), iodine/iodide mole ratio of 1:5 (1:6 for Ag), solid-to-liquid ratio (S/L) of 1:10 g/mL (1:8 g/mL for Ag), and pH of 9, respectively. It is believed that the process developed in this study is environment friendly for the recovery of Au, Ag, and Pd from waste PCBs of mobile phones by SCWO pre-treatment combined with iodine–iodide leaching process.

  6. 46 CFR 28.370 - Wiring methods and materials.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 1 2010-10-01 2010-10-01 false Wiring methods and materials. 28.370 Section 28.370... Operate With More Than 16 Individuals on Board § 28.370 Wiring methods and materials. (a) All cable and... not more than 10 percent. (c) Cable and wiring not serving equipment in a high risk fire area such as...

  7. Wire communication engineering

    International Nuclear Information System (INIS)

    Son, Byeong Tae

    1997-02-01

    This book describes wire telecommunication engineering/ It is divided into eleven chapter, which deal with Introduction with development of telecommunication, voice and sound wave and communication network, Telegraphy with summary of telegraphy, code of telegraphy, communication speed, morse and telex, Telephone on structure, circuit and image telephone, Traffic on telecommunication traffic, transmission of line about theory, cable line and loaded cable, carrier communication with carrier telegraphy and carrier telephone, optical communication with types, structure, specialty, laser and equipment, DATA, Mobile telecommunication on summary, mobile telephone, radio paging and digital mobile telecommunication, ISDN with channel of ISDN, and service of ISDN, and design of telecommunication.

  8. Wiring regulations in brief

    CERN Document Server

    Tricker, Ray

    2012-01-01

    Tired of trawling through the Wiring Regs?Perplexed by Part P?Confused by cables, conductors and circuits?Then look no further! This handy guide provides an on-the-job reference source for Electricians, Designers, Service Engineers, Inspectors, Builders, Students, DIY enthusiastsTopic-based chapters link areas of working practice - such as cables, installations, testing and inspection, special locations - with the specifics of the Regulations themselves. This allows quick and easy identification of the official requirements relating to the situati

  9. Electromagnetic Behaviour of Metallic Wire Structures

    CERN Document Server

    Chui, S T

    2013-01-01

    Despite the recent development and interest in the photonics of metallic wire structures, the relatively simple concepts and physics often remain obscured or poorly explained to those who do not specialize in the field. Electromagnetic Behaviour of Metallic Wire Structures provides a clear and coherent guide to understanding these phenomena without excessive numerical calculations.   Including both background material and detailed derivations of the various different formulae applied, Electromagnetic Behaviour of Metallic Wire Structures describes how to extend basic circuit theory relating to voltages, currents, and resistances of metallic wire networks to include situations where the currents are no longer spatially uniform along the wire. This lays a foundation for a deeper understanding of the many new phenomena observed in meta-electromagnetic materials.   Examples of applications are included to support this new approach making Electromagnetic Behaviour of Metallic Wire Structures a comprehensive and ...

  10. 30 CFR 57.12065 - Short circuit and lightning protection.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Short circuit and lightning protection. 57... MINES Electricity Surface Only § 57.12065 Short circuit and lightning protection. Powerlines, including trolley wires, and telephone circuits shall be protected against short circuits and lightning. ...

  11. 30 CFR 56.12065 - Short circuit and lightning protection.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Short circuit and lightning protection. 56... Electricity § 56.12065 Short circuit and lightning protection. Powerlines, including trolley wires, and telephone circuits shall be protected against short circuits and lightning. ...

  12. Vibrating wire for beam profile scanning

    Directory of Open Access Journals (Sweden)

    S. G. Arutunian

    1999-12-01

    Full Text Available A method that measures the transverse profile (emittance of the bunch by detecting radiation arising at the scattering of the bunch on scanning wire is widely used. In this work information about bunch scattering is obtained by measuring the oscillation frequency of the tightened scanning wire. In such a way, the system of radiation (or secondary particles extraction and measurement can be removed. The entire unit consists of a compact fork with tightened wire and a scanning system. Normal oscillation frequency of a wire depends on wire tension, its geometric parameters, and, in a second approximation, its elastic characteristics. Normal oscillations are generated by interaction of an alternating current through the wire with magnetic field of a permanent magnet. In this case, it is suggested that the magnetic field of the accelerator (field of dipole magnets or quadrupole magnets be used for excitation of oscillations. The dependence of oscillation frequency on beam scattering is determined by several factors, including changes of wire tension caused by transverse force of the beam and influence of beam self-field. Preliminary calculations show that the influence of wire heating will dominate. We have studied strain gauges on the basis of vibrating wire from various materials (tungsten, beryl bronze, and niobium zirconium alloys. A scheme of normal oscillation generation by alternating current in autogeneration circuit with automatic frequency adjustment was selected. A special method of wire fixation and elimination of transverse degrees of freedom allows us to achieve relative stability better than 10^{-5} during several days at a relative resolution of 10^{-6}. Experimental results and estimates of wire heating of existing scanners show that the wire heats up to a few hundred grades, which is enough for measurements. The usage of wire of micrometer thickness diminishes the problem of wire thermalization speed during the scanning of the bunch.

  13. Synergic chemical analysis - the coupling of TG with FTIR, MS and GC-MS; 1. The determination of the gases released during the thermal oxidation of a printed circuit board

    International Nuclear Information System (INIS)

    Webb, M.; Last, P.M.; Breen, C.

    1999-01-01

    This contribution reports the coupling of TG with FTIR, MS and GC-MS (Synergic chemical analysis). During thermogravimetric analysis the gases evolved are analysed using 'real-time' FTIR and MS. Simultaneously the gases are collected on an absorbent trap (organic trap module, OTM) for subsequent analysis using GC-MS. As an example the technique has been used to identify the products evolved from a printed circuit board during thermal oxidation. The use of TG-FTIR-MS-OTM-GC-MS provided information that could not be available through single techniques alone. For example, it was possible to ascertain the temperature range over which bromophenol was released. (Copyright (c) 1999 Elsevier Science B.V., Amsterdam. All rights reserved.)

  14. Spring Break: A Lesson in Circuits. "This Old House" College Style.

    Science.gov (United States)

    Duch, Barbara

    2001-01-01

    Introduces students to the topics of electricity and circuits within the context of house wiring. Explores the properties of series and parallel circuits, researches local wiring codes, calculates the current used by appliances based on their power ratings, and designs circuits in a typical kitchen. (Author/ASK)

  15. 30 CFR 75.1323 - Blasting circuits.

    Science.gov (United States)

    2010-07-01

    ...) Blasting circuits shall be protected from sources of stray electric current. (b) Detonators made by different manufacturers shall not be combined in the same blasting circuit. (c) Detonator leg wires shall be... used between the blasting cable and detonator circuitry shall— (1) Be undamaged; (2) Be well insulated...

  16. Improved Circuit For Hot-Film Anemometer

    Science.gov (United States)

    Gray, David L.

    1993-01-01

    Circuit suitable for automation or computer control of setup and operation. Hot-film or hot-wire anemometer circuit features individual current drives for two arms of wheatstone bridge, plus other features that provide improved calibration and automated or computer-controlled operation.

  17. Noncontextual Wirings

    Science.gov (United States)

    Amaral, Barbara; Cabello, Adán; Cunha, Marcelo Terra; Aolita, Leandro

    2018-03-01

    Contextuality is a fundamental feature of quantum theory necessary for certain models of quantum computation and communication. Serious steps have therefore been taken towards a formal framework for contextuality as an operational resource. However, the main ingredient of a resource theory—a concrete, explicit form of free operations of contextuality—was still missing. Here we provide such a component by introducing noncontextual wirings: a class of contextuality-free operations with a clear operational interpretation and a friendly parametrization. We characterize them completely for general black-box measurement devices with arbitrarily many inputs and outputs. As applications, we show that the relative entropy of contextuality is a contextuality monotone and that maximally contextual boxes that serve as contextuality bits exist for a broad class of scenarios. Our results complete a unified resource-theoretic framework for contextuality and Bell nonlocality.

  18. Design of a high-speed vertical transition in LTCC for interposers suitable for packaging photonic integrated circuits

    Science.gov (United States)

    Jezzini, M. A.; Marraccini, P. J.; Peters, F. H.

    2016-05-01

    The packaging of high speed Photonic Integrated Circuits (PICs) should maintain the electrical signal integrity. The standard packaging of high speed PICs relies on wire bonds. This is not desirable because wire bonds degrade the quality of the electrical signal. The research presented in this paper proposes to replace wire bonds with an interposer with multilevel transmission lines. By attaching the PIC by flip chip onto the interposer, the use of wire bonds is avoided. The main concern for designing an interposer with multilevel transmission lines is the vertical transition, which must be designed to avoid return and radiation losses. In this paper, a novel design of a high speed vertical transition for Low Temperature Co-fired Ceramic (LTCC) is presented. The proposed vertical transition is simpler than others recently published in the literature, due to eliminating the need for additional ceramic layers or air cavities. A LTCC board was fabricated with several variations of the presented transition to find the optimal dimensions of the structure. The structures were fabricated then characterized and have a 3 dB bandwidth of 37 GHz and an open eye diagram at 44 Gbps. A full wave electromagnetic simulation is described and compared with good agreement to the measurements. The results suggest that an LTCC board with this design can be used for 40 Gbps per channel applications. Keywords: Photonics packaging, Low Temperature Co-Fired Ceramics.

  19. High Surface-Enhanced Raman Scattering (SERS) Amplification Factor Obtained with Silver Printed Circuit Boards and the Influence of Phenolic Resins for the Characterization of the Pesticide Thiram.

    Science.gov (United States)

    Silva de Almeida, Francylaine; Bussler, Larissa; Marcio Lima, Sandro; Fiorucci, Antonio Rogério; da Cunha Andrade, Luis Humberto

    2016-07-01

    In this work, low-cost substrates with rough silver surfaces were prepared from commercial copper foil-covered phenolic board (CPB) and an aqueous solution of AgNO3, and were used for surface-enhanced Raman scattering (SERS) and surface-enhanced resonance Raman scattering (SERRS) measurements. A maximum SERS amplification factor of 1.2 × 10(7) was obtained for Rhodamine 6G (R6G), and use of the CPB resulted in a detection limit for Thiram pesticide of 0.5 µmol L(-1) The minimum detection level was limited by residual traces of phenolic groups that originated from the substrate resin, which became solubilized in the aqueous Ag(+) solution. It was found that the bands corresponding to the impurities had less influence in the Thiram analysis, which could be explained by the high affinity of sulfur for Ag surfaces. The influence of impurities in the SERS analyses therefore depended on the linkage between the rough silver surface and the analyte. The findings demonstrated the ease and effectiveness of using CPB to prepare a nanostructured surface for SERS. © The Author(s) 2016.

  20. Josephson junction arrays and superconducting wire networks

    International Nuclear Information System (INIS)

    Lobb, C.J.

    1992-01-01

    Techniques used to fabricate integrated circuits make it possible to construct superconducting networks containing as many as 10 6 wires or Josephson junctions. Such networks undergo phase transitions from resistive high-temperature states to ordered low-resistance low-temperature states. The nature of the phase transition depends strongly on controllable parameters such as the strength of the superconductivity in each wire or junction and the external magnetic field. This paper will review the physics of these phase transitions, starting with the simplest zero-magnetic field case. This leads to a Kosterlitz-Thouless transition when the junctions or wires are weak, and a simple mean-field fransition when the junctions or wires are strong. Rich behavior, resulting from frustration, occurs in the presence of a magnetic field. (orig.)

  1. Advanced circuit simulation using Multisim workbench

    CERN Document Server

    Báez-López, David; Cervantes-Villagómez, Ofelia Delfina

    2012-01-01

    Multisim is now the de facto standard for circuit simulation. It is a SPICE-based circuit simulator which combines analog, discrete-time, and mixed-mode circuits. In addition, it is the only simulator which incorporates microcontroller simulation in the same environment. It also includes a tool for printed circuit board design.Advanced Circuit Simulation Using Multisim Workbench is a companion book to Circuit Analysis Using Multisim, published by Morgan & Claypool in 2011. This new book covers advanced analyses and the creation of models and subcircuits. It also includes coverage of transmissi

  2. Lunar Module Wiring Design Considerations and Failure Modes

    Science.gov (United States)

    Interbartolo, Michael

    2009-01-01

    This slide presentation reviews the considerations for the design of wiring for the Lunar Module. Included are a review of the choice of conductors and insulations, the wire splicing (i.e., crimping, and soldering), the wire connectors, and the fabrication of the wire harnesses. The problems in fabrication include the wires being the wrong length, the damage due to the sharp edges, the requried use of temproary protective covers and inadequate training. The problems in the wire harness installation include damge from sharp eges, work on adjacent harnesses, connector damage, and breaking wires. Engineering suggestions from the Apollo-era in reference to the conductors that are reviewed include: the use of plated conductors, and the use of alloys for stronger wiring. In refernce to insulation, the suggestions from Apollo era include the use of polymer tape-wrap wire insulation due to the light weight, however, other types of modern insulation might be more cost-effective. In reference to wire splices and terminal boards the suggestions from the Apollo Era include the use of crimp splices as superior to solder splices, joining multiple wire to a common point using modular plug-ins might be more reliable, but are heavier than crimp splicing. For connectors, the lessons from the Apollo era indicate that a rear environmental seal that does not require additional potting is preferred, and pins should be crimped or welded to the incoming wires and be removable from the rear of the connector.

  3. Stretched Wire Mechanics

    Energy Technology Data Exchange (ETDEWEB)

    Bowden, Gordon; /SLAC

    2005-09-06

    Stretched wires are beginning to play an important role in the alignment of accelerators and synchrotron light sources. Stretched wires are proposed for the alignment of the 130 meter long LCLS undulator. Wire position technology has reached sub-micron resolution yet analyses of perturbations to wire straightness are hard to find. This paper considers possible deviations of stretched wire from the simple 2-dimensional catenary form.

  4. An innovative "ChemicalVia" process for the production of high density interconnect printed circuit boards The ATLAS muon chamber quality control with the X-ray tomograph at CERN

    CERN Document Server

    Da Silva, Vitor; Watts, David; Van der Bij, Erik; Banhidi, Z; Berbiers, Julien; Lampl, W; Marchesotti, M; Rangod, Stephane; Sbrissa, E; Schuh, S; Voss, Rüdiger; Zhuravlov, V

    2004-01-01

    The ChemicalVia process, patented by CERN, provides a new method of making microvias in high-density multilayer printed circuit boards of different types, such as sequential build-up (SBU), high density interconnected (HDI), or laminated multi-chip modules (MCM-L). The process uses chemical etching instead of laser, plasma or other etching techniques and can be implemented in a chain production line. This results in an overall reduced operation and maintenance cost and a much shorter hole production time as compared with other microvia processes. copy Emerald Group Publishing Limited. 4 Refs.4 An essential part of the Muon Spectrometer of the ATLAS experiment is based on the Monitored Drift Tube (MDT) technology. About 1200 muon drift chambers are being built at 13 institutes all over the world. The MDT chambers require an exceptional mechanical construction accuracy of better than 20 mu m. A dedicated X-ray tomograph has been developed at CERN since 1996 to control the mechanical quality of the chambers. The...

  5. Board Saver for Use with Developmental FPGAs

    Science.gov (United States)

    Berkun, Andrew

    2009-01-01

    A device denoted a board saver has been developed as a means of reducing wear and tear of a printed-circuit board onto which an antifuse field programmable gate array (FPGA) is to be eventually soldered permanently after a number of design iterations. The need for the board saver or a similar device arises because (1) antifuse-FPGA design iterations are common and (2) repeated soldering and unsoldering of FPGAs on the printed-circuit board to accommodate design iterations can wear out the printed-circuit board. The board saver is basically a solderable/unsolderable FPGA receptacle that is installed temporarily on the printed-circuit board. The board saver is, more specifically, a smaller, square-ring-shaped, printed-circuit board (see figure) that contains half via holes one for each contact pad along its periphery. As initially fabricated, the board saver is a wider ring containing full via holes, but then it is milled along its outer edges, cutting the via holes in half and laterally exposing their interiors. The board saver is positioned in registration with the designated FPGA footprint and each via hole is soldered to the outer portion of the corresponding FPGA contact pad on the first-mentioned printed-circuit board. The via-hole/contact joints can be inspected visually and can be easily unsoldered later. The square hole in the middle of the board saver is sized to accommodate the FPGA, and the thickness of the board saver is the same as that of the FPGA. Hence, when a non-final FPGA is placed in the square hole, the combination of the non-final FPGA and the board saver occupy no more area and thickness than would a final FPGA soldered directly into its designated position on the first-mentioned circuit board. The contact leads of a non-final FPGA are not bent and are soldered, at the top of the board saver, to the corresponding via holes. A non-final FPGA can readily be unsoldered from the board saver and replaced by another one. Once the final FPGA design

  6. Organization of the Drosophila larval visual circuit

    Science.gov (United States)

    Gendre, Nanae; Neagu-Maier, G Larisa; Fetter, Richard D; Schneider-Mizell, Casey M; Truman, James W; Zlatic, Marta; Cardona, Albert

    2017-01-01

    Visual systems transduce, process and transmit light-dependent environmental cues. Computation of visual features depends on photoreceptor neuron types (PR) present, organization of the eye and wiring of the underlying neural circuit. Here, we describe the circuit architecture of the visual system of Drosophila larvae by mapping the synaptic wiring diagram and neurotransmitters. By contacting different targets, the two larval PR-subtypes create two converging pathways potentially underlying the computation of ambient light intensity and temporal light changes already within this first visual processing center. Locally processed visual information then signals via dedicated projection interneurons to higher brain areas including the lateral horn and mushroom body. The stratified structure of the larval optic neuropil (LON) suggests common organizational principles with the adult fly and vertebrate visual systems. The complete synaptic wiring diagram of the LON paves the way to understanding how circuits with reduced numerical complexity control wide ranges of behaviors.

  7. Models of printed boards for solderless mounting of electronic components by foil perforation method

    Directory of Open Access Journals (Sweden)

    Yefimenko A. A.

    2017-10-01

    Full Text Available The paper presents models of printed circuit boards for an improved foil perforation method. The density of electrical connections of such printed circuit boards is estimated in comparison with circuit boards obtained using the methods of mounting in holes and surface mounting. The technological differences in the manufacture of printed circuit boards for the foil perforation method and the traditional method are considered.

  8. Investigation of Constant Temperature Hot-wire System Response using Laser Pulse

    Science.gov (United States)

    Jaffa, Nicholas; Morris, Scott; Cameron, Joshua

    2016-11-01

    Constant temperature hot-wire systems use a Wheatstone bridge and feedback amplifier circuit to maintain a constant average temperature across the wire yielding frequency responses of order 100 kHz. This high frequency response allows hot-wires to be used extensively for aerodynamic measurements in high speed flows and uncertainty at these high frequencies can be difficult to diagnose. The standard frequency response check for constant temperature hot-wires uses an electronic pulse across the circuit to check the electronic feedback circuit response time, but does not account for the impact of the heat transfer along the wire. In order to investigate the frequency response of the entire constant temperature hot-wire system, including the heat transfer along the wire, a novel method was developed using a pulsed PIV laser focused to illuminate only the hot-wire. The laser pulse duration was effectively an instantaneous change in wire surface temperature through radiation. A hot-wire was placed in a uniform open calibration jet for a range of flow conditions. The response of the entire hot-wire system was observed across a range of conditions including changes in flow, wire temperature, and thermal boundary conditions and compared with the electronic pulse test.

  9. Dual-circuit segmented rail phased induction motor

    Science.gov (United States)

    Marder, Barry M.; Cowan, Jr., Maynard

    2002-01-01

    An improved linear motor utilizes two circuits, rather that one circuit and an opposed plate, to gain efficiency. The powered circuit is a flat conductive coil. The opposed segmented rail circuit is either a plurality of similar conductive coils that are shorted, or a plurality of ladders formed of opposed conductive bars connected by a plurality of spaced conductors. In each embodiment, the conductors are preferably cables formed from a plurality of intertwined insulated wires to carry current evenly.

  10. Wire bonding in microelectronics

    CERN Document Server

    Harman, George G

    2010-01-01

    Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. Coverage includes: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bo...

  11. Resonance circuits for adiabatic circuits

    Directory of Open Access Journals (Sweden)

    C. Schlachta

    2003-01-01

    Full Text Available One of the possible techniques to reduces the power consumption in digital CMOS circuits is to slow down the charge transport. This slowdown can be achieved by introducing an inductor in the charging path. Additionally, the inductor can act as an energy storage element, conserving the energy that is normally dissipated during discharging. Together with the parasitic capacitances from the circuit a LCresonant circuit is formed.

  12. Water Desalination with Wires

    NARCIS (Netherlands)

    Porada, S.; Sales, B.B.; Hamelers, H.V.M.; Biesheuvel, P.M.

    2012-01-01

    We show the significant potential of water desalination using a novel capacitive wire-based technology in which anode/cathode wire pairs are constructed from coating a thin porous carbon electrode layer on top of electrically conducting rods (or wires). By alternately dipping an array of electrode

  13. Circuit Formation by Spatio-Temporal Control of Messenger RNA ...

    International Development Research Centre (IDRC) Digital Library (Canada)

    The connections inside the brain need to be wired in a precise manner during development to ensure its proper function. This project will provide insight into circuit formation to help us understand how axon regeneration can improve clinical outcomes. Brain wiring, damage, and developmental defects Researchers have ...

  14. Chemical Characterisation of Printed Circuit Board Wastewater

    Energy Technology Data Exchange (ETDEWEB)

    Sobri, S; Ali, A H M, E-mail: eeza@eng.upm.edu.my [Department of Chemical and Environmental Engineering, Faculty of Engineering, Universiti Putra Malaysia, 43400 Serdang, Selangor (Malaysia)

    2011-02-15

    Manufacturing of PCBs is highly complicated and involves many processes. Recycling of PCB wastewater receives wide concerns as the recent international growth in the electronics industry has generated a drastic increase in the amount of waste PCBs with profound environmental impacts such as soil and groundwater contamination. This paper reports on the chemical characterization of PCB wastewater as the initial investigation for selective metal recovery.

  15. Circuit board hole coordinate locator concept

    Science.gov (United States)

    Samuel, L. W.

    1969-01-01

    Fixed light source registers the x and y coordinates of holes in a fixed opaque template. A first surface parabolic mirror and a set of photocells are used to detect the passage of light through the individual holes.

  16. Printed circuit board designer's reference basics

    CERN Document Server

    Robertson, Chris

    2003-01-01

    PCB design instruction and reference manual, all in one book, with in- depth explanation of the processes and tools used in modern PCB design Standards, formulas, definitions, and procedures, plus software to tie it all together.

  17. Biomedical implementation of liquid metal ink as drawable ECG electrode and skin circuit.

    Science.gov (United States)

    Yu, Yang; Zhang, Jie; Liu, Jing

    2013-01-01

    Conventional ways of making bio-electrodes are generally complicated, expensive and unconformable. Here we describe for the first time the method of applying Ga-based liquid metal ink as drawable electrocardiogram (ECG) electrodes. Such material owns unique merits in both liquid phase conformability and high electrical conductivity, which provides flexible ways for making electrical circuits on skin surface and a prospective substitution of conventional rigid printed circuit boards (PCBs). Fundamental measurements of impedance and polarization voltage of the liquid metal ink were carried out to evaluate its basic electrical properties. Conceptual experiments were performed to draw the alloy as bio-electrodes to acquire ECG signals from both rabbit and human via a wireless module developed on the mobile phone. Further, a typical electrical circuit was drawn in the palm with the ink to demonstrate its potential of implementing more sophisticated skin circuits. With an oxide concentration of 0.34%, the resistivity of the liquid metal ink was measured as 44.1 µΩ·cm with quite low reactance in the form of straight line. Its peak polarization voltage with the physiological saline was detected as -0.73 V. The quality of ECG wave detected from the liquid metal electrodes was found as good as that of conventional electrodes, from both rabbit and human experiments. In addition, the circuit drawn with the liquid metal ink in the palm also runs efficiently. When the loop was switched on, all the light emitting diodes (LEDs) were lit and emitted colorful lights. The liquid metal ink promises unique printable electrical properties as both bio-electrodes and electrical wires. The implemented ECG measurement on biological surface and the successfully run skin circuit demonstrated the conformability and attachment of the liquid metal. The present method is expected to innovate future physiological measurement and biological circuit manufacturing technique in a large extent.

  18. Biomedical implementation of liquid metal ink as drawable ECG electrode and skin circuit.

    Directory of Open Access Journals (Sweden)

    Yang Yu

    Full Text Available BACKGROUND: Conventional ways of making bio-electrodes are generally complicated, expensive and unconformable. Here we describe for the first time the method of applying Ga-based liquid metal ink as drawable electrocardiogram (ECG electrodes. Such material owns unique merits in both liquid phase conformability and high electrical conductivity, which provides flexible ways for making electrical circuits on skin surface and a prospective substitution of conventional rigid printed circuit boards (PCBs. METHODS: Fundamental measurements of impedance and polarization voltage of the liquid metal ink were carried out to evaluate its basic electrical properties. Conceptual experiments were performed to draw the alloy as bio-electrodes to acquire ECG signals from both rabbit and human via a wireless module developed on the mobile phone. Further, a typical electrical circuit was drawn in the palm with the ink to demonstrate its potential of implementing more sophisticated skin circuits. RESULTS: With an oxide concentration of 0.34%, the resistivity of the liquid metal ink was measured as 44.1 µΩ·cm with quite low reactance in the form of straight line. Its peak polarization voltage with the physiological saline was detected as -0.73 V. The quality of ECG wave detected from the liquid metal electrodes was found as good as that of conventional electrodes, from both rabbit and human experiments. In addition, the circuit drawn with the liquid metal ink in the palm also runs efficiently. When the loop was switched on, all the light emitting diodes (LEDs were lit and emitted colorful lights. CONCLUSIONS: The liquid metal ink promises unique printable electrical properties as both bio-electrodes and electrical wires. The implemented ECG measurement on biological surface and the successfully run skin circuit demonstrated the conformability and attachment of the liquid metal. The present method is expected to innovate future physiological measurement and

  19. PS wire chamber

    CERN Document Server

    1970-01-01

    A wire chamber used at CERN's Proton Synchrotron accelerator in the 1970s. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  20. Design and Experimental Research of New Type Brake by Wire System Based on Giant-magnetostrictive Material

    Directory of Open Access Journals (Sweden)

    Changbao CHU

    2014-04-01

    Full Text Available In this paper, H type brake by wire system based on giant-magnetostrictive material is designed from two aspects of hardware and software. System principle prototype is manufactured. Hardware circuit mainly includes the Sepic circuit, current detection circuit, over current protection circuit, PWM driver protection circuit. Circuit parameters can be obtained through by theoretical calculation. Pedal sensor signal is taken as main control variable, look-up table method is used for brake by wire system. The experimental results show that the system can meet the braking requirements. It proves the feasibility of the scheme.

  1. Communication and wiring in the cortical connectome.

    Science.gov (United States)

    Budd, Julian M L; Kisvárday, Zoltán F

    2012-01-01

    In cerebral cortex, the huge mass of axonal wiring that carries information between near and distant neurons is thought to provide the neural substrate for cognitive and perceptual function. The goal of mapping the connectivity of cortical axons at different spatial scales, the cortical connectome, is to trace the paths of information flow in cerebral cortex. To appreciate the relationship between the connectome and cortical function, we need to discover the nature and purpose of the wiring principles underlying cortical connectivity. A popular explanation has been that axonal length is strictly minimized both within and between cortical regions. In contrast, we have hypothesized the existence of a multi-scale principle of cortical wiring where to optimize communication there is a trade-off between spatial (construction) and temporal (routing) costs. Here, using recent evidence concerning cortical spatial networks we critically evaluate this hypothesis at neuron, local circuit, and pathway scales. We report three main conclusions. First, the axonal and dendritic arbor morphology of single neocortical neurons may be governed by a similar wiring principle, one that balances the conservation of cellular material and conduction delay. Second, the same principle may be observed for fiber tracts connecting cortical regions. Third, the absence of sufficient local circuit data currently prohibits any meaningful assessment of the hypothesis at this scale of cortical organization. To avoid neglecting neuron and microcircuit levels of cortical organization, the connectome framework should incorporate more morphological description. In addition, structural analyses of temporal cost for cortical circuits should take account of both axonal conduction and neuronal integration delays, which appear mostly of the same order of magnitude. We conclude the hypothesized trade-off between spatial and temporal costs may potentially offer a powerful explanation for cortical wiring patterns.

  2. Cockpit canopy shattering using exploding wire techniques

    International Nuclear Information System (INIS)

    Novac, B M; Smith, I R; Downs, P R; Marston, P; Fahey, D

    2007-01-01

    This paper presents the principal experimental results provided by a preliminary investigation into the possibility of using exploding wire (EW) techniques to shatter the plastic cockpit canopy of a modern jet aircraft. The data provided forms the basis for a qualitative understanding of the physics of interaction between the plasma produced by an EW and the surrounding elasto-plastic material in which the wire is embedded. To optimize the shock-wave 'clean cutting' effect, the significance of the material, the dimensions of the exploding wire and the amplitude of the current and voltage pulses are all considered. This leads to important conclusions concerning both the characteristics of the EW and the optimum arrangement of the electrical circuit, with the single most important optimization factor being the peak electrical power input to the EW, rather than the dissipated Joule energy. A full-scale system relevant to an actual cockpit canopy shattering is outlined and relevant results are presented and discussed

  3. A dishwasher for circuits

    CERN Document Server

    Rosaria Marraffino

    2014-01-01

    You have always been told that electronic devices fear water. However, at the Surface Mount Devices (SMD) Workshop here at CERN all the electronic assemblies are cleaned with a machine that looks like a… dishwasher.   The circuit dishwasher. Credit: Clara Nellist.  If you think the image above shows a dishwasher, you wouldn’t be completely wrong. Apart from the fact that the whole pumping system and the case itself are made entirely from stainless steel and chemical resistant materials, and the fact that it washes electrical boards instead of dishes… it works exactly like a dishwasher. It’s a professional machine (mainly used in the pharmaceutical industry) designed to clean everything that can be washed with a water-based chemical soap. This type of treatment increases the lifetime of the electronic boards and therefore the LHC's reliability by preventing corrosion problems in the severe radiation and ozone environment of the LHC tunn...

  4. Design and implementation of a hybrid circuit system for micro sensor signal processing

    International Nuclear Information System (INIS)

    Wang Zhuping; Chen Jing; Liu Ruqing

    2011-01-01

    This paper covers a micro sensor analog signal processing circuit system (MASPS) chip with low power and a digital signal processing circuit board implementation including hardware connection and software design. Attention has been paid to incorporate the MASPS chip into the digital circuit board. The ultimate aim is to form a hybrid circuit used for mixed-signal processing, which can be applied to a micro sensor flow monitoring system. (semiconductor integrated circuits)

  5. Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits

    Science.gov (United States)

    Strickland, S. M.; Hester, J. D.; Gowan, A. K.; Montgomery, R. K.; Geist, D. L.; Blanche, J. F.; McGuire, G. D.; Nash, T. S.

    2011-01-01

    As integrated circuit miniaturization trends continue, they drive the need for smaller higher input/output (I/O) packages. Hermetically sealed ceramic area array parts are the package of choice by the space community for high reliability space flight electronic hardware. Unfortunately, the coefficient of thermal expansion mismatch between the ceramic area array package and the epoxy glass printed wiring board limits the life of the interconnecting solder joint. This work presents the results of an investigation by Marshall Space Flight Center into a method to increase the life of this second level interconnection by the use of compliant microcoil springs. The design of the spring and its attachment process are presented along with thermal cycling results of microcoil springs (MCS) compared with state-of-the-art ball and column interconnections. Vibration testing has been conducted on MCS and high lead column parts. Radio frequency simulation and measurements have been made and the MCS has been modeled and a stress analysis performed. Thermal cycling and vibration testing have shown MCS interconnects to be significantly more reliable than solder columns. Also, MCS interconnects are less prone to handling damage than solder columns. Future work that includes shock testing, incorporation into a digital signal processor board, and process evaluation of expansion from a 400 I/O device to a device with over 1,100 I/O is identified.

  6. Hot-wiring azurin onto gold surfaces

    NARCIS (Netherlands)

    Stan, Razvan

    2010-01-01

    The growing field of bio-electronics holds many promises with regard to the integration of various organic molecules onto printed circuit-boards. These include a decrease in the cost of production, an increased sensitivity and specificity to molecular detection from various solutions (i.e. blood)

  7. Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

    International Nuclear Information System (INIS)

    Lin, C.-T.; Hsi, C.-S.; Wang, M.-C.; Chang, T.-C.; Liang, M.-K.

    2008-01-01

    Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 ± 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 ± 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 ± 0.3 and 1.7 ± 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu 5 Zn 8 intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu 6 Sn 5 IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu 6 Sn 5 IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength

  8. Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Lin, C.-T. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China); Hsi, C.-S. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Wang, M.-C. [Faculty of Fragrance and Cosmetics, Kaohsiung Medical University, 100 Shih-Chuan 1st Road, Kaohsiung 807, Taiwan (China)], E-mail: mcwang@kmu.edu.tw; Chang, T.-C.; Liang, M.-K. [Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China)

    2008-07-14

    Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 {+-} 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 {+-} 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 {+-} 0.3 and 1.7 {+-} 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu{sub 5}Zn{sub 8} intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu{sub 6}Sn{sub 5} IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu{sub 6}Sn{sub 5} IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength.

  9. Unit: Electric Circuits, Inspection Pack, National Trial Print.

    Science.gov (United States)

    Australian Science Education Project, Toorak, Victoria.

    As a part of the unit materials in the series produced by the Australian Science Education Project, this teacher edition is primarily composed of a core relating to simple circuits, a test form, and options. Options are given under the headings: Your Invention; "How Long Does a Call Last?"; One, Two, Three Wires; Parallel Circuits; More…

  10. 46 CFR 111.60-9 - Segregation of vital circuits.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 4 2010-10-01 2010-10-01 false Segregation of vital circuits. 111.60-9 Section 111.60-9 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Wiring Materials and Methods § 111.60-9 Segregation of vital circuits. (a) General. A...

  11. Development of a microcontroller - based protective Circuit for a ...

    African Journals Online (AJOL)

    In this work, a protective circuit for a direct current (DC) to alternating current (AC) converter system commonly referred to as an inverter have been designed and implemented. The method employed a simple operational amplifier (Op-Amp) circuit wired as a comparator to serve as input into the microcontroller, a NOT AND ...

  12. Circuit Formation by Spatio-Temporal Control of Messenger RNA ...

    International Development Research Centre (IDRC) Digital Library (Canada)

    Circuit Formation by Spatio-Temporal Control of Messenger RNA Translation. The connections inside the brain need to be wired in a precise manner during development to ensure its proper function. This project will provide insight into circuit formation to help us understand how axon regeneration can improve clinical ...

  13. A new wire chamber front-end system, based on the ASD-8 B chip

    Energy Technology Data Exchange (ETDEWEB)

    Kruesemann, B.A.M. E-mail: kruesemann@kvi.nl; Bassini, R.; Ellinghaus, F.; Frekers, D.; Hagemann, M.; Hannen, V.M.; Heynitz, H. von; Heyse, J.; Rakers, S.; Sohlbach, H.; Woertche, H.J

    1999-07-11

    The Focal-Plane Polarimeter (FPP) for the Big-Bite Spectrometer van den Berg (Nucl. Instr. and Meth. B 99 (1995) 637ff) at the KVI requires the read-out of four large-area MWPCs and two VDCs with 3872 wires in total. The EUROSUPERNOVA collaboration (SNOVA) developed a digital 16 channel preamplifier front-end board, housing two amplifier-shaper-discriminatorchips ASD-8 B. The main features of this board are a fast single-wire readout, a high integration density, a low power consumption and compatibility to common instrumentation standards. The board represents the first successfully running application of the ASD-8 for wire chamber readout. (author)

  14. A new wire chamber front-end system, based on the ASD-8 B chip

    CERN Document Server

    Kruesemann, B A M; Ellinghaus, F; Frekers, D; Hagemann, M; Hannen, V M; Heynitz, H V; Heyse, J; Rakers, S; Sohlbach, H; Wörtche, H J

    1999-01-01

    The Focal-Plane Polarimeter (FPP) for the Big-Bite Spectrometer van den Berg (Nucl. Instr. and Meth. B 99 (1995) 637ff) at the KVI requires the read-out of four large-area MWPCs and two VDCs with 3872 wires in total. The EUROSUPERNOVA collaboration (SNOVA) developed a digital 16 channel preamplifier front-end board, housing two amplifier-shaper-discriminatorchips ASD-8 B. The main features of this board are a fast single-wire readout, a high integration density, a low power consumption and compatibility to common instrumentation standards. The board represents the first successfully running application of the ASD-8 for wire chamber readout. (author)

  15. Reusable Hot-Wire Cable Cutter

    Science.gov (United States)

    Pauken, Michael T.; Steinkraus, Joel M.

    2010-01-01

    During the early development stage of balloon deployment systems for missions, nichrome wire cable cutters were often used in place of pyro-actuated cutters. Typically, a nichrome wire is wrapped around a bundle of polymer cables with a low melting point and connected to a relay-actuated electric circuit. The heat from the nichrome reduces the strength of the cable bundle, which quickly breaks under a mechanical load and can thus be used as a release mechanism for a deployment system. However, the use of hand-made heated nichrome wire for cutters is not very reliable. Often, the wrapped nichrome wire does not cut through the cable because it either pulls away from its power source or does not stay in contact with the cable being cut. Because nichrome is not readily soldered to copper wire, unreliable mechanical crimps are often made to connect the nichrome to an electric circuit. A self-contained device that is reusable and reliable was developed to sever cables for device release or deployment. The nichrome wire in this new device is housed within an enclosure to prevent it from being damaged by handling. The electric power leads are internally connected within the unit to the nichrome wire using a screw terminal connection. A bayonet plug, a quick and secure method of connecting the cutter to the power source, is used to connect the cutter to the power leads similar to those used in pyro-cutter devices. A small ceramic tube [0.25-in. wide 0.5-in. long (.6.4-mm wide 13-mm long)] houses a spiraled nichrome wire that is heated when a cable release action is required. The wire is formed into a spiral coil by wrapping it around a mandrel. It is then laid inside the ceramic tube so that it fits closely to the inner surface of the tube. The ceramic tube provides some thermal and electrical insulation so that most of the heat generated by the wire is directed toward the cable bundle in the center of the spiral. The ceramic tube is cemented into an aluminum block, which

  16. Flexural magneto-elastic vibrations of thin metal wires

    International Nuclear Information System (INIS)

    Lukyanov, A; Molokov, S

    2004-01-01

    Flexural vibrations of thin metal wires owing to a high, pulsed electric current have been investigated. The current is sufficiently low to inhibit melting but sufficiently high to induce stresses, leading to the wire fragmentation. The problem is treated numerically on the basis of the theory of three-dimensional linear elasticity. The model has been verified on the well-known exact, eigenmode solution for the flexural vibrations of an infinite wire. The agreement is excellent. Further, the model has been used to study vibrations owing to two sources. The first one is perturbations of wires owing to the Lorentz force leading to a kink-type instability similar to that in plasmas. As the main cause of the wire fragmentation has been previously found to be the thermal expansion of material owing to Joule heating, this problem mainly serves to compare results between the three-dimensional and the one-dimensional, thin-rod models. Comparison of the growth rate of the instability obtained by the two models has shown an excellent agreement. The second source of vibrations is the magnetic fields induced in the external electric circuit. The results show that depending on the shape of the circuit, the induced stresses may exceed 20 MPa for the aluminium wires used in the low-current experiments. Although the external fields are not the main source of the wire fragmentation, these values alone may cause the fracture process at elevated temperatures

  17. Towards plant wires

    OpenAIRE

    Adamatzky, Andrew

    2014-01-01

    In experimental laboratory studies we evaluate a possibility of making electrical wires from living plants. In scoping experiments we use lettuce seedlings as a prototype model of a plant wire. We approximate an electrical potential transfer function by applying direct current voltage to the lettuce seedlings and recording output voltage. We analyse oscillation frequencies of the output potential and assess noise immunity of the plant wires. Our findings will be used in future designs of self...

  18. Photovoltaic Wire, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — This Small Business Innovation Research Phase I project will investigate a new architecture for photovoltaic devices based on nanotechnology: photovoltaic wire. The...

  19. Photovoltaic Wire Project

    Data.gov (United States)

    National Aeronautics and Space Administration — This Small Business Innovation Research Phase I project will investigate a new architecture for photovoltaic devices based on nanotechnology: photovoltaic wire. The...

  20. Charpak hemispherical wire chamber

    CERN Document Server

    1970-01-01

    pieces. Mesures are of the largest one. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

  1. Board Charter

    International Development Research Centre (IDRC) Digital Library (Canada)

    TEST

    Senior Centre Staff participate in meetings and make presentations to allow. Governors to gain ... assist individual governors, part of the Board evaluation includes self-assessment. The Board. Evaluation ... oversee the Board's evaluation and self-assessment exercises and implementing change and improvements, as ...

  2. 1998 wire development workshop proceedings

    International Nuclear Information System (INIS)

    1998-04-01

    This report consists of vugraphs of the presentations at the conference. The conference was divided into the following sessions: (1) First Generation Wire Development: Status and Issues; (2) First Generation Wire in Pre-Commercial Prototypes; (3) Second Generation Wire Development: Private Sector Progress and Issues; (4) Second Generation Wire Development: Federal Laboratories; and (5) Fundamental Research Issues for HTS Wire Development

  3. Construction and assembly of the wire planes for the MicroBooNE Time Projection Chamber

    Energy Technology Data Exchange (ETDEWEB)

    Acciarri, R.; Adams, C.; Asaadi, J.; Danaher, J.; Fleming, B. T.; Gardner, R.; Gollapinni, S.; Grosso, R.; Guenette, R.; Littlejohn, B. R.; Lockwitz, S.; Raaf, J. L.; Soderberg, M.; John, J. St.; Strauss, T.; Szelc, A. M.; Yu, B.

    2017-03-01

    In this paper we describe how the readout planes for the MicroBooNE Time Projection Chamber were constructed, assembled and installed. We present the individual wire preparation using semi-automatic winding machines and the assembly of wire carrier boards. The details of the wire installation on the detector frame and the tensioning of the wires are given. A strict quality assurance plan ensured the integrity of the readout planes. The different tests performed at all stages of construction and installation provided crucial information to achieve the successful realization of the MicroBooNE wire planes.

  4. MIP Plasma Decapsulation of Copper-wired Semiconductor Devices for Failure Analysis

    NARCIS (Netherlands)

    Tang, J.

    2014-01-01

    The majority of Integrated Circuit (IC) devices are encapsulated in wire-bonded plastic IC packages. Epoxy molding compound is used as the encapsulation material and gold was used as the bonding wire material. However, the increase of gold material price from 400 USD/ounce in year 2005 to 1400

  5. Automating wiring formboard design

    NARCIS (Netherlands)

    Van den Berg, T.

    2013-01-01

    Increase in aircraft wiring complexity call for manufacturing design improvements to reduce cost and lead-time. To achieve such improvements, a joint research project was performed by the Flight Performance and Propulsion (FPP) group and Fokker Elmo BV, the second largest aircraft wiring harness

  6. Circuit Training.

    Science.gov (United States)

    Nelson, Jane B.

    1998-01-01

    Describes a research-based activity for high school physics students in which they build an LC circuit and find its resonant frequency of oscillation using an oscilloscope. Includes a diagram of the apparatus and an explanation of the procedures. (DDR)

  7. Affective Circuits

    DEFF Research Database (Denmark)

    to the intersecting streams of goods, people, ideas, and money as they circulate between African migrants and their kin who remain back home. They also show the complex ways that emotions become entangled in these exchanges. Examining how these circuits operate in domains of social life ranging from child fosterage...

  8. Numerical model for electrical explosion of copper wires in water

    Science.gov (United States)

    Chung, Kyoung-Jae; Lee, Kern; Hwang, Y. S.; Kim, Deok-Kyu

    2016-11-01

    This paper presents a simple but quite accurate numerical model for analyzing electrical explosion of copper wires in water. The numerical model solves a circuit equation coupled with one-dimensional magneto-hydrodynamic (MHD) equations with the help of appropriate wide-range equation of state (EOS) and electrical conductivity for copper. The MHD equations are formulated in a Lagrangian form to identify the interface between the wire and surrounding water clearly. A quotidian EOS (QEOS) that is known as the simplest form of EOS is utilized to build wide-range EOS for copper. In the QEOS, we consider the liquid-vapor phase transition, which is critical in analyzing the wire explosion system. For the electrical conductivity of copper, a semi-empirical set of equations covering from solid state to partially ionized plasma state are employed. Experimental validation has been performed with copper wires of various diameters, which are exploded by a microsecond timescale pulsed capacitive discharge. The simulation results show excellent agreements with the experimental results in terms of temporal motions of a plasma channel boundary and a shock front as well as current and voltage waveforms. It is found that the wire explodes (vaporizes) along the liquid branch of a binodal curve irrespective of wire dimension and operating voltage. After the explosion, the wire becomes a plasma state right away or after the current pause (dwell), depending on the operating conditions. It is worth noting that such a peculiar characteristic of wire explosion, i.e., current pause and restrike, is well simulated with the present numerical model. In particular, it is shown that the wire cools down along the vapor branch of the binodal curve during the current dwell, due to a significant difference of thermodynamic characteristics across the binodal curve. The influence of radiation for studying nonideal plasmas with a wire explosion technique and a physical process for shock wave formation

  9. FPGA based fast synchronous serial multi-wire links synchronization

    Science.gov (United States)

    Pozniak, Krzysztof T.

    2013-10-01

    The paper debates synchronization method of multi-wire, serial link of constant latency, by means of pseudo-random numbers generators. The solution was designed for various families of FPGA circuits. There were debated synchronization algorithm and functional structure of parameterized transmitter and receiver modules. The modules were realized in VHDL language in a behavioral form.

  10. Board game

    International Nuclear Information System (INIS)

    Brennan, N.S.

    1982-01-01

    A board game comprises a board, a number of counters and two dice. The board is marked to provide a central area, representing the nucleus of an atom, and six or more annular rings extending concentrically around the central area, the rings being divided into 2,8,18,32,48 and 72 squares. Each ring represents an electron shell, and some of the squares are numbered, the number representing the atomic number of different elements. (author)

  11. Thermosonic wire bonding of IC devices using palladium wire

    International Nuclear Information System (INIS)

    Shze, J.H.; Poh, M.T.; Tan, R.M.

    1996-01-01

    The feasibility of replacing gold wire by palladium wire in thermosonic wire bonding of CMOS and bipolar devices are studied in terms of the manufacturability, physical, electrical and assembly performance. The results that palladium wire is a viable option for bonding the bipolar devices but not the CMOS devices

  12. TIMING CIRCUIT

    Science.gov (United States)

    Heyd, J.W.

    1959-07-14

    An electronic circuit is described for precisely controlling the power delivered to a load from an a-c source, and is particularly useful as a welder timer. The power is delivered in uniform pulses, produced by a thyratron, the number of pulses being controlled by a one-shot multivibrator. The starting pulse is synchronized with the a-c line frequency so that each multivlbrator cycle begins at about the same point in the a-c cycle.

  13. A resonance measuring wire tension monitor for high-energy physics

    International Nuclear Information System (INIS)

    Durkin, L.S.; Fisher, D.; Lennous, P.; Ling, T.Y.; Rush, C.

    1995-01-01

    The Ohio State group has built a device to automatically measure the wire tension on the sense wire in SDC (Solenoidal Detector Collaboration) barrel muon drift tubes using resonance techniques. The SDC experiment was part of the now canceled SSC (Superconducting Super Collider) project. The design, construction, and operation of a wire tension monitor is presented. The technique used is unique in that the electric force is used to excite the wire into harmonic resonance. The amplitude of the wire is in turn monitored using the variation of the oscillating wire's capacitance measured by a resonance circuit. Finally, the resonance is found electronically using phase lock loop techniques. Wire tension is measured to an accuracy of 0.3% with this device

  14. High-speed micro electrode tool fabrication by a twin-wire EDM system

    International Nuclear Information System (INIS)

    Sheu, Dong-Yea

    2008-01-01

    This paper describes a new machining process which combines twin-electro-wire together with two electro discharge circuits to rapidly fabricate micro electrode tools. The results show that transistor electro discharge and RC electro discharge circuits coexist to fabricate micro tools with rough and finish machining both on the same machine. Compared to conventional wire electro discharge grinding (WEDG) technology, a twin-wire EDM system that combines rough and finish machining into one process allows the efficient fabrication of micro tools. This high-speed micro tool fabrication process can be applied not only to micro electrode machining but also to micro punching tool and micro probing tips machining

  15. Thermosonic wire bonding of gold wire onto copper pad using the saturated interfacial phenomena

    Science.gov (United States)

    Jeng, Yeau-Ren; Aoh, Jong-Hing; Wang, Chang-Ming

    2001-12-01

    Copper has been used to replace conventional aluminium interconnection to improve the performance of deep submicron integrated circuits. This study used the saturated interfacial phenomena found in thermosonic ball bonding of gold wire onto aluminium pad to investigate thermosonic ball bonding of gold wire onto copper pad. The effects of preheat temperatures and ultrasonic powers on the bonding force were investigated by using a thermosonic bonding machine and a shear tester. This work shows that under proper preheat temperatures, the bonding force of thermosonic wire bonding can be explained based on interfacial microcontact phenomena such as energy intensity, interfacial temperature and real contact area. It is clearly shown that as the energy intensity is increased, the shear force increases, reaches a maximum, and then decreases. After saturation, i.e. the establishment of maximum atomic bonding, any type of additional energy input will damage the bonding, decreasing the shear force. If the preheat temperature is not within the proper range, the interfacial saturation phenomenon does not exist. For a preload of 0.5 N and a welding time of 15 ms in thermosonic wire bonding of gold wire onto copper pads, a maximum shear force of about 0.33 N is found where the interfacial energy intensity equals 1.8×106 J m-2 for preheat temperatures of 150°C and 170°C. Moreover, the corresponding optimal ultrasonic power is about 110 units.

  16. Cryogenic Pressure Seal for Wires

    Science.gov (United States)

    Ciana, J. J.

    1984-01-01

    High-pressure-seal formed by forcing polyurethane into space surrounding wire or cable in special fitting. Wire or cable routed through fitting then through a tightly fitting cap. Wire insulation left intact. Cap filled with sealant and forced onto the fitting: this pushes sealant into fitting so it seals wire or cable in fitting as well as in cap.

  17. Copper wire bonding

    CERN Document Server

    Chauhan, Preeti S; Zhong, ZhaoWei; Pecht, Michael G

    2014-01-01

    This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material.  However, copper wire bonding has several process and reliability concerns due to its material properties.  Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation.  In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed.  The book also discusses best practices and re...

  18. Evolvable designs of experiments applications for circuits

    CERN Document Server

    Iordache, Octavian

    2009-01-01

    Adopting a groundbreaking approach, the highly regarded author shows how to design methods for planning increasingly complex experiments. He begins with a brief introduction to standard quality methods and the technology in standard electric circuits. The book then gives numerous examples of how to apply the proposed methodology in a series of real-life case studies. Although these case studies are taken from the printed circuit board industry, the methods are equally applicable to other fields of engineering.

  19. A multiwire ionization chamber readout circuit using current mirrors

    International Nuclear Information System (INIS)

    Rawnsley, W.R.; Smith, D.; Moskven, T.

    1997-01-01

    A circuit which utilizes current mirrors has been used to apply high voltage bias to the wires of a multiwire ionization chamber (MWIC) profile monitor while still allowing measurement of the beam-induced ion-electron currents collected on the wires. Bias voltages of up to 250 V have been used while wire currents over a range of 0.5 nA to 50 nA have been measured. The circuit is unipolar but can be designed for positive or negative bias. The mirrors also provide a current gain of 10, reducing the effects of transistor leakage and extending the useful range of the circuit to lower signal levels. A module containing 32 Wilson current mirrors has been constructed and is used with a MWIC monitor in TRIUMF close-quote s Parity experiment beamline. copyright 1997 American Institute of Physics

  20. Collective of mechatronics circuit

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1987-02-15

    This book is composed of three parts, which deals with mechatronics system about sensor, circuit and motor. The contents of the first part are photo sensor of collector for output, locating detection circuit with photo interrupts, photo sensor circuit with CdS cell and lamp, interface circuit with logic and LED and temperature sensor circuit. The second part deals with oscillation circuit with crystal, C-R oscillation circuit, F-V converter, timer circuit, stability power circuit, DC amp and DC-DC converter. The last part is comprised of bridge server circuit, deformation bridge server, controlling circuit of DC motor, controlling circuit with IC for PLL and driver circuit of stepping motor and driver circuit of Brushless.

  1. Collective of mechatronics circuit

    International Nuclear Information System (INIS)

    1987-02-01

    This book is composed of three parts, which deals with mechatronics system about sensor, circuit and motor. The contents of the first part are photo sensor of collector for output, locating detection circuit with photo interrupts, photo sensor circuit with CdS cell and lamp, interface circuit with logic and LED and temperature sensor circuit. The second part deals with oscillation circuit with crystal, C-R oscillation circuit, F-V converter, timer circuit, stability power circuit, DC amp and DC-DC converter. The last part is comprised of bridge server circuit, deformation bridge server, controlling circuit of DC motor, controlling circuit with IC for PLL and driver circuit of stepping motor and driver circuit of Brushless.

  2. Flexible Microstrip Circuits for Superconducting Electronics

    Science.gov (United States)

    Chervenak, James; Mateo, Jennette

    2013-01-01

    Flexible circuits with superconducting wiring atop polyimide thin films are being studied to connect large numbers of wires between stages in cryogenic apparatus with low heat load. The feasibility of a full microstrip process, consisting of two layers of superconducting material separated by a thin dielectric layer on 5 mil (approximately 0.13 mm) Kapton sheets, where manageable residual stress remains in the polyimide film after processing, has been demonstrated. The goal is a 2-mil (approximately 0.051-mm) process using spin-on polyimide to take advantage of the smoother polyimide surface for achieving highquality metal films. Integration of microstrip wiring with this polyimide film may require high-temperature bakes to relax the stress in the polyimide film between metallization steps.

  3. Grounding and shielding circuits and interference

    CERN Document Server

    Morrison, Ralph

    2016-01-01

    Applies basic field behavior in circuit design and demonstrates how it relates to grounding and shielding requirements and techniques in circuit design This book connects the fundamentals of electromagnetic theory to the problems of interference in all types of electronic design. The text covers power distribution in facilities, mixing of analog and digital circuitry, circuit board layout at high clock rates, and meeting radiation and susceptibility standards. The author examines the grounding and shielding requirements and techniques in circuit design and applies basic physics to circuit behavior. The sixth edition of this book has been updated with new material added throughout the chapters where appropriate. The presentation of the book has also been rearranged in order to reflect the current trends in the field.

  4. Life Cycle Assessment of Paper Based Printed Circuits

    OpenAIRE

    Wan, Qiansu

    2017-01-01

    Printed circuit boards have been massively manufactured and wildly used in all kinds of electronic devices during people’s daily life for more than thirty years since the last century. As a highly integrated device mainly consists of silicon base, an etched copper layer and other soldered components, massive production of printed circuit boards are considered to be environmentally unfriendly due to the wet chemical manufacturing mode and lack of recycling ability. On the other hand, the newly...

  5. Wired to freedom

    DEFF Research Database (Denmark)

    Jepsen, Kim Sune Karrasch; Bertilsson, Margareta

    2017-01-01

    dimension of life science through a notion of public politics adopted from the political theory of John Dewey. We show how cochlear implantation engages different social imaginaries on the collective and individual levels and we suggest that users share an imaginary of being “wired to freedom” that involves...... new access to social life, continuous communicative challenges, common practices, and experiences. In looking at their lives as “wired to freedom,” we hope to promote a wider spectrum of civic participation in the benefit of future life science developments within and beyond the field of Cochlear...

  6. Electric wiring domestic

    CERN Document Server

    Coker, A J

    1992-01-01

    Electric Wiring: Domestic, Tenth Edition, is a clear and reliable guide to the practical aspects of domestic electric wiring. Intended for electrical contractors, installation engineers, wiremen and students, its aim is to provide essential up to date information on modern methods and materials in a simple, clear, and concise manner. The main changes in this edition are those necessary to bring the work into line with the 16th Edition of the Regulations for Electrical Installations issued by the Institution of Electrical Engineers. The book begins by introducing the basic features of domestic

  7. Modern wiring practice

    CERN Document Server

    Steward, W E

    2012-01-01

    Continuously in print since 1952, Modern Wiring Practice has now been fully revised to provide an up-to-date source of reference to building services design and installation in the 21st century. This compact and practical guide addresses wiring systems design and electrical installation together in one volume, creating a comprehensive overview of the whole process for contractors and architects, as well as electricians and other installation engineers. Best practice is incorporated throughout, combining theory and practice with clear and accessible explanation, all

  8. Analog circuit design designing dynamic circuit response

    CERN Document Server

    Feucht, Dennis

    2010-01-01

    This second volume, Designing Dynamic Circuit Response builds upon the first volume Designing Amplifier Circuits by extending coverage to include reactances and their time- and frequency-related behavioral consequences.

  9. Practical wiring in SI units

    CERN Document Server

    Miller, Henry A

    2013-01-01

    Practical Wiring, Volume 1 is a 13-chapter book that first describes some of the common hand tools used in connection with sheathed wiring. Subsequent chapters discuss the safety in wiring, cables, conductor terminations, insulating sheathed wiring, conductor sizes, and consumer's control equipments. Other chapters center on socket outlets, plugs, lighting subcircuits, lighting accessories, bells, and primary and secondary cells. This book will be very valuable to students involved in this field of interest.

  10. Wire EDM for Refractory Materials

    Science.gov (United States)

    Zellars, G. R.; Harris, F. E.; Lowell, C. E.; Pollman, W. M.; Rys, V. J.; Wills, R. J.

    1982-01-01

    In an attempt to reduce fabrication time and costs, Wire Electrical Discharge Machine (Wire EDM) method was investigated as tool for fabricating matched blade roots and disk slots. Eight high-strength nickel-base superalloys were used. Computer-controlled Wire EDM technique provided high quality surfaces with excellent dimensional tolerances. Wire EDM method offers potential for substantial reductions in fabrication costs for "hard to machine" alloys and electrically conductive materials in specific high-precision applications.

  11. Wire chambers: Trends and alternatives

    International Nuclear Information System (INIS)

    Regler, Meinhard

    1992-01-01

    The subtitle of this year's Vienna Wire Chamber Conference - 'Recent Trends and Alternative Techniques' - signalled that it covered a wide range of science and technology. While an opening Vienna talk by wire chamber pioneer Georges Charpak many years ago began 'Les funerailles des chambres a fils (the burial of wire chambers)', the contrary feeling this year was that wire chambers are very much alive!

  12. Command Wire Sensor Measurements

    Science.gov (United States)

    2012-09-01

    CFAR Constant False Alarm Rate CWIE Command Wire-Improvised Explosive Device EMI Electromagnetic Induction GPR Ground Penetrating Radar...this, some type of constant false alarm rate ( CFAR ) receiver is required. CFAR automatically raises the threshold level to keep clutter echoes and

  13. Transport in quantum wires

    Indian Academy of Sciences (India)

    Transport in quantum wires. SIDDHARTHA LAL, SUMATHI RAO£ and DIPTIMAN SEN. Centre for Theoretical Studies, Indian Institute of Science, Bangalore 560 012, India. £ Harish-chandra Research Institute, Chhatnag Road, Jhusi, Allahabad 211 019, India. Abstract. With a brief introduction to one-dimensional channels ...

  14. Wire chamber conference

    International Nuclear Information System (INIS)

    Bartl, W.; Neuhofer, G.; Regler, M.

    1986-02-01

    This booklet contains program and the abstracts of the papers presented at the conference, most of them dealing with performance testing of various types of wire chambers. The publication of proceedings is planned as a special issue of 'Nuclear instruments and methods' later on. All abstracts are in English. An author index for the book of abstracts is given. (A.N.)

  15. Analog circuit design designing waveform processing circuits

    CERN Document Server

    Feucht, Dennis

    2010-01-01

    The fourth volume in the set Designing Waveform-Processing Circuits builds on the previous 3 volumes and presents a variety of analog non-amplifier circuits, including voltage references, current sources, filters, hysteresis switches and oscilloscope trigger and sweep circuitry, function generation, absolute-value circuits, and peak detectors.

  16. Active shunt capacitance cancelling oscillator circuit

    Science.gov (United States)

    Wessendorf, Kurt O.

    2003-09-23

    An oscillator circuit is disclosed which can be used to produce oscillation using a piezoelectric crystal, with a frequency of oscillation being largely independent of any shunt capacitance associated with the crystal (i.e. due to electrodes on the surfaces of the crystal and due to packaging and wiring for the crystal). The oscillator circuit is based on a tuned gain stage which operates the crystal at a frequency, f, near a series resonance frequency, f.sub.S. The oscillator circuit further includes a compensation circuit that supplies all the ac current flow through the shunt resistance associated with the crystal so that this ac current need not be supplied by the tuned gain stage. The compensation circuit uses a current mirror to provide the ac current flow based on the current flow through a reference capacitor that is equivalent to the shunt capacitance associated with the crystal. The oscillator circuit has applications for driving piezoelectric crystals for sensing of viscous, fluid or solid media by detecting a change in the frequency of oscillation of the crystal and a resonator loss which occur from contact of an exposed surface of the crystal by the viscous, fluid or solid media.

  17. 250 kA compact linear transformer driver for wire array z-pinch loads

    Directory of Open Access Journals (Sweden)

    S. C. Bott

    2011-05-01

    Full Text Available We present the application of a short rise (∼150  ns 250 kA linear transformer driver (LTD to wire array z-pinch loads for the first time. The generator is a modification of a previous driver in which a new conical power feed provides a low inductance coupling to wire loads. Performance of the new design using both short circuit and plasma loads is presented and discussed. The final design delivers ∼200  kA to a wire array load which is in good agreement with SCREAMER calculations using a simplified representative circuit. Example results demonstrate successful experiments using cylindrical, conical, and inverse wire arrays as well as previously published work on x-pinch loads.

  18. Dental Arch Wire

    Science.gov (United States)

    1979-01-01

    Straightening teeth is an arduous process requiring months, often years, of applying corrective pressure by means of arch wires-better known as brace-which may have to be changed several times in the course of treatment. A new method has been developed by Dr. George Andreasen, orthodontist and dental scientist at the University of Iowa. The key is a new type of arch wire material, called Nitinol, with exceptional elasticity which helps reduce the required number of brace changes. An alloy of nickel and titanium, Nitinol was originally developed for aerospace applications by the Naval Ordnance Laboratory, now the Naval Surface Weapons Laboratory, White Oaks, Maryland. NASA subsequently conducted additional research on the properties of Nitinol and on procedures for processing the metal.

  19. Wire chamber gases

    International Nuclear Information System (INIS)

    Va'vra, J.

    1992-04-01

    In this paper, we describe new developments in gas mixtures which have occurred during the last 3--4 years. In particular, we discuss new results on the measurement and modeling of electron drift parameters, the modeling of drift chamber resolution, measurements of primary ionization and the choice of gas for applications such as tracking, single electron detection, X-ray detection and visual imaging. In addition, new results are presented on photon feedback, breakdown and wire aging

  20. Vienna Wire Chamber Conference

    International Nuclear Information System (INIS)

    Anon.

    1983-01-01

    After those of 1978 and 1980, a third Wire Chamber Conference was held from 15-18 February in the Technical University of Vienna. Eight invited speakers covered the field from sophisticated applications in biology and medicine, via software, to the state of the art of gaseous detectors. In some forty other talks the speakers tackled in more detail the topics of gaseous detectors, calorimetry and associated electronics and software

  1. PEDOT:PSS "Wires" Printed on Textile for Wearable Electronics.

    Science.gov (United States)

    Guo, Yang; Otley, Michael T; Li, Mengfang; Zhang, Xiaozheng; Sinha, Sneh K; Treich, Gregory M; Sotzing, Gregory A

    2016-10-03

    Herein, the fabrication of all-organic conductive wires is demonstrated by utilizing patterning techniques such as inkjet printing and sponge stencil to apply poly(3,4-ethylenedioxythiophene) polystyrenesulfonate (PEDOT:PSS) onto nonwoven polyethylene terephthalate (PET) fabric. The coating of the conducting polymer is only present on the surface of the substrate (penetration depth ∼ 200 μm) to retain the functionality and wearability of the textile. The wires fabricated by different patterning techniques provide a wide range of resistance, i.e., tens of kΩ/□ to less than 2 Ω/□ that allows the resistance to be tailored to a specific application. The sheet resistance is measured to be as low as 1.6 Ω/□, and the breakdown current is as high as 0.37 A for a 1 mm wide line. The specific breakdown current exceeds the previously reported values of macroscopic carbon nanotube based materials. Simple circuits composed of the printed wires are demonstrated, and resistance of the circuit from the measurement agrees with the calculated value based on Kirchhoff's rules. Additionally, the printed PEDOT:PSS wires show less than 6.2% change in sheet resistance after three washing and drying cycles using detergent.

  2. Research on burnout fault of moulded case circuit breaker based on finite element simulation

    Science.gov (United States)

    Xue, Yang; Chang, Shuai; Zhang, Penghe; Xu, Yinghui; Peng, Chuning; Shi, Erwei

    2017-09-01

    In the failure event of molded case circuit breaker, overheating of the molded case near the wiring terminal has a very important proportion. The burnout fault has become an important factor restricting the development of molded case circuit breaker. This paper uses the finite element simulation software to establish the model of molded case circuit breaker by coupling multi-physics field. This model can simulate the operation and study the law of the temperature distribution. The simulation results show that the temperature near the wiring terminal, especially the incoming side of the live wire, of the molded case circuit breaker is much higher than that of the other areas. The steady-state and transient simulation results show that the temperature at the wiring terminals is abnormally increased by increasing the contact resistance of the wiring terminals. This is consistent with the frequent occurrence of burnout of the molded case in this area. Therefore, this paper holds that the burnout failure of the molded case circuit breaker is mainly caused by the abnormal increase of the contact resistance of the wiring terminal.

  3. Solid-state circuits

    CERN Document Server

    Pridham, G J

    2013-01-01

    Solid-State Circuits provides an introduction to the theory and practice underlying solid-state circuits, laying particular emphasis on field effect transistors and integrated circuits. Topics range from construction and characteristics of semiconductor devices to rectification and power supplies, low-frequency amplifiers, sine- and square-wave oscillators, and high-frequency effects and circuits. Black-box equivalent circuits of bipolar transistors, physical equivalent circuits of bipolar transistors, and equivalent circuits of field effect transistors are also covered. This volume is divided

  4. Circuit analysis for dummies

    CERN Document Server

    Santiago, John

    2013-01-01

    Circuits overloaded from electric circuit analysis? Many universities require that students pursuing a degree in electrical or computer engineering take an Electric Circuit Analysis course to determine who will ""make the cut"" and continue in the degree program. Circuit Analysis For Dummies will help these students to better understand electric circuit analysis by presenting the information in an effective and straightforward manner. Circuit Analysis For Dummies gives you clear-cut information about the topics covered in an electric circuit analysis courses to help

  5. Current limiter circuit system

    Energy Technology Data Exchange (ETDEWEB)

    Witcher, Joseph Brandon; Bredemann, Michael V.

    2017-09-05

    An apparatus comprising a steady state sensing circuit, a switching circuit, and a detection circuit. The steady state sensing circuit is connected to a first, a second and a third node. The first node is connected to a first device, the second node is connected to a second device, and the steady state sensing circuit causes a scaled current to flow at the third node. The scaled current is proportional to a voltage difference between the first and second node. The switching circuit limits an amount of current that flows between the first and second device. The detection circuit is connected to the third node and the switching circuit. The detection circuit monitors the scaled current at the third node and controls the switching circuit to limit the amount of the current that flows between the first and second device when the scaled current is greater than a desired level.

  6. Integrated Circuit Electromagnetic Immunity Handbook

    Science.gov (United States)

    Sketoe, J. G.

    2000-08-01

    This handbook presents the results of the Boeing Company effort for NASA under contract NAS8-98217. Immunity level data for certain integrated circuit parts are discussed herein, along with analytical techniques for applying the data to electronics systems. This handbook is built heavily on the one produced in the seventies by McDonnell Douglas Astronautics Company (MDAC, MDC Report E1929 of 1 August 1978, entitled Integrated Circuit Electromagnetic Susceptibility Handbook, known commonly as the ICES Handbook, which has served countless systems designers for over 20 years). Sections 2 and 3 supplement the device susceptibility data presented in section 4 by presenting information on related material required to use the IC susceptibility information. Section 2 concerns itself with electromagnetic susceptibility analysis and serves as a guide in using the information contained in the rest of the handbook. A suggested system hardening requirements is presented in this chapter. Section 3 briefly discusses coupling and shielding considerations. For conservatism and simplicity, a worst case approach is advocated to determine the maximum amount of RF power picked up from a given field. This handbook expands the scope of the immunity data in this Handbook is to of 10 MHz to 10 GHz. However, the analytical techniques provided are applicable to much higher frequencies as well. It is expected however, that the upper frequency limit of concern is near 10 GHz. This is due to two factors; the pickup of microwave energy on system cables and wiring falls off as the square of the wavelength, and component response falls off at a rapid rate due to the effects of parasitic shunt paths for the RF energy. It should be noted also that the pickup on wires and cables does not approach infinity as the frequency decreases (as would be expected by extrapolating the square law dependence of the high frequency roll-off to lower frequencies) but levels off due to mismatch effects.

  7. Buddy Board

    DEFF Research Database (Denmark)

    Enggaard, Helle; Moselund, Lene

    2015-01-01

    Projekt ’BuddyBoard’ er kommet i stand via et samarbejde mellem Frederikshavn kommune, Bunker43 og Lab. X. Afdeling en ’Havly’ på Sæby Ældrecenter fungerer som living lab, hvilket betyder, at det udgør et levende laboratorium for udvikling og afprøvning af teknologi (Schultz, 2013). Projektet er....... Bunker43 har udviklet en teknologi (BuddyBoard) til hurtig formidling af billeder fra pårørende og personale til beboere på institutioner. Pårørende og personale uploader billeder via en APP eller en hjemmeside og har mulighed for at tilføje en kort forklarende tekst til hvert billede. Beboeren ser...... billederne via en tablet. Systemet bygger på et simpelt og brugervenligt design, så ældre med kognitive og/eller fysiske funktionsnedsættelser kan anvende teknologien. BuddyBoard fungerer via internettet, og billederne gemmes på en sikret server hos udbyderen, som er Bunker43. Intentionerne med BuddyBoard er...

  8. Dual wire welding torch and method

    Science.gov (United States)

    Diez, Fernando Martinez; Stump, Kevin S.; Ludewig, Howard W.; Kilty, Alan L.; Robinson, Matthew M.; Egland, Keith M.

    2009-04-28

    A welding torch includes a nozzle with a first welding wire guide configured to orient a first welding wire in a first welding wire orientation, and a second welding wire guide configured to orient a second welding wire in a second welding wire orientation that is non-coplanar and divergent with respect to the first welding wire orientation. A method of welding includes moving a welding torch with respect to a workpiece joint to be welded. During moving the welding torch, a first welding wire is fed through a first welding wire guide defining a first welding wire orientation and a second welding wire is fed through a second welding wire guide defining a second welding wire orientation that is divergent and non-coplanar with respect to the first welding wire orientation.

  9. Metering Wheel-Wire Track Wire Boom Deployment Mechanism

    Science.gov (United States)

    Granoff, Mark S.

    2014-01-01

    The NASA MMS Spin Plane Double Probe (SDP) Deployer utilizes a helical path, rotating Metering Wheel and a spring loaded Wire "Holding" Track to pay out a "fixed end" 57 meter x 1.5 mm diameter Wire Boom stored between concentric storage cylinders. Unlike rotating spool type storage devices, the storage cylinders remain stationary, and the boom wire is uncoiled along the length of the cylinder via the rotation of the Metering Wheel. This uncoiling action avoids the need for slip-ring contacts since the ends of the wire can remain stationary. Conventional fixed electrical connectors (Micro-D type) are used to terminate to operational electronics.

  10. Two-layer synchronized ternary quantum-dot cellular automata wire crossings

    Science.gov (United States)

    2012-01-01

    Quantum-dot cellular automata are an interesting nanoscale computing paradigm. The introduction of the ternary quantum-dot cell enabled ternary computing, and with the recent development of a ternary functionally complete set of elementary logic primitives and the ternary memorizing cell design of complex processing structures is becoming feasible. The specific nature of the ternary quantum-dot cell makes wire crossings one of the most problematic areas of ternary quantum-dot cellular automata circuit design. We hereby present a two-layer wire crossing that uses a specific clocking scheme, which ensures the crossed wires have the same effective delay. PMID:22507371

  11. The Influence of Wiring Economy on Nervous System Evolution.

    Science.gov (United States)

    Wang, Irving E; Clandinin, Thomas R

    2016-10-24

    The activity and maintenance of neurons requires substantial metabolic energy, resulting in selective pressure to decrease resource consumption by the nervous system. The wiring economy principle proposes that animals have evolved mechanisms that wire circuits efficiently by minimizing neurite length. Computational modeling of neuronal morphology, microcircuit organization, and neural networks reveals that wiring economy is a significant determinant of nervous system layout. The strategies for reducing wiring costs are shared across phyla and point to the possibility of generalizable rules that specify the development of efficient nervous systems. As the developmental mechanisms underpinning wiring economy are only now being elucidated, whether the molecular basis of this phenomenon is the result of conserved genetic programs or convergent evolution remains to be determined. Copyright © 2016 Elsevier Ltd. All rights reserved.

  12. 78 FR 69927 - SJI Board of Directors Meeting, Notice

    Science.gov (United States)

    2013-11-21

    ... STATE JUSTICE INSTITUTE SJI Board of Directors Meeting, Notice AGENCY: State Justice Institute. ACTION: Notice of meeting. SUMMARY: The SJI Board of Directors will be meeting on Monday, December 9, 2013 at 1:00 p.m. The meeting will be held at the 9th Judicial Circuit of Florida in Orlando, Florida...

  13. The Micro Wire Detector

    Energy Technology Data Exchange (ETDEWEB)

    Adeva, B.; Gomez, F.; Pazos, A.; Pfau, R.; Plo, M. E-mail: maximo.plo@cern.ch; Rodriguez, J.M.; Vazquez, P.; Labbe, J.C

    1999-10-11

    We present the performance of a new proportional gas detector. Its geometry consists of a cathode plane with 70x70 {mu}m{sup 2} apertures, crossed by 25 {mu}m anode strips to which it is attached by 50 {mu}m kapton spacers. In the region where the avalanche takes place, the anode strips are suspended in the gas mixture as in a standard wire chamber. This detector exhibits high rate capability and large gains, introducing very little material. (author)

  14. Epitaxial semiconductor quantum wires.

    Science.gov (United States)

    Wu, J; Chen, Y H; Wang, Z G

    2008-07-01

    The investigation on the direct epitaxial quantum wires (QWR) using MBE or MOCVD has been persuited for more than two decades, more lengthy in history as compared with its quantum dot counterpart. Up to now, QWRs with various structural configurations have been produced with different growth methods. This is a reviewing article consisting mainly of two parts. The first part discusses QWRs of various configurations, together with laser devices based on them, in terms of the two growth mechanisms, self-ordering and self-assembling. The second part gives a brief review of the electrical and optical properties of QWRs.

  15. Electronic Control Circuit

    International Nuclear Information System (INIS)

    Kim, Sang Jin; Kim, Je Hwong; Cha, In Su

    2001-08-01

    This book consists of nine chapters, which are basis of thyristor about its use and classify, structure of thyristor like outside, inside, manufacturing and structure of thyristor sorts of thyristor family and sub thyristor, how to use thyristor such as standard chart, choice of thyristor and way of on and off, electric heat control circuit like control temperature of heating apparatus and cooker, lighting control circuit for light bulb, neon lamp, traffic signal, lamp regulator and strobe, motor control circuit including an inverter circuit transistor and speed control of direct motor by transistor, electric power source circuit and a spark-plug, applied circuit for protection of fire.

  16. Electronic devices and circuits

    CERN Document Server

    Pridham, Gordon John

    1972-01-01

    Electronic Devices and Circuits, Volume 3 provides a comprehensive account on electronic devices and circuits and includes introductory network theory and physics. The physics of semiconductor devices is described, along with field effect transistors, small-signal equivalent circuits of bipolar transistors, and integrated circuits. Linear and non-linear circuits as well as logic circuits are also considered. This volume is comprised of 12 chapters and begins with an analysis of the use of Laplace transforms for analysis of filter networks, followed by a discussion on the physical properties of

  17. Intuitive analog circuit design

    CERN Document Server

    Thompson, Marc

    2013-01-01

    Intuitive Analog Circuit Design outlines ways of thinking about analog circuits and systems that let you develop a feel for what a good, working analog circuit design should be. This book reflects author Marc Thompson's 30 years of experience designing analog and power electronics circuits and teaching graduate-level analog circuit design, and is the ideal reference for anyone who needs a straightforward introduction to the subject. In this book, Dr. Thompson describes intuitive and ""back-of-the-envelope"" techniques for designing and analyzing analog circuits, including transistor amplifi

  18. Circuit for Communication Over Power Lines

    Science.gov (United States)

    Krasowski, Michael J.; Prokop, Normal F.; Greer, Lawrence C., III; Nappier, Jennifer

    2011-01-01

    Many distributed systems share common sensors and instruments along with a common power line supplying current to the system. A communication technique and circuit has been developed that allows for the simple inclusion of an instrument, sensor, or actuator node within any system containing a common power bus. Wherever power is available, a node can be added, which can then draw power for itself, its associated sensors, and actuators from the power bus all while communicating with other nodes on the power bus. The technique modulates a DC power bus through capacitive coupling using on-off keying (OOK), and receives and demodulates the signal from the DC power bus through the same capacitive coupling. The circuit acts as serial modem for the physical power line communication. The circuit and technique can be made of commercially available components or included in an application specific integrated circuit (ASIC) design, which allows for the circuit to be included in current designs with additional circuitry or embedded into new designs. This device and technique moves computational, sensing, and actuation abilities closer to the source, and allows for the networking of multiple similar nodes to each other and to a central processor. This technique also allows for reconfigurable systems by adding or removing nodes at any time. It can do so using nothing more than the in situ power wiring of the system.

  19. 46 CFR 111.60-11 - Wire.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 4 2010-10-01 2010-10-01 false Wire. 111.60-11 Section 111.60-11 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Wiring Materials and Methods § 111.60-11 Wire. (a) Wire must be in an enclosure. (b) Wire must be...

  20. Corrosion of Wires on Wooden Wire-Bound Packaging Crates

    Science.gov (United States)

    Samuel L. Zelinka; Stan Lebow

    2015-01-01

    Wire-bound packaging crates are used by the US Army to transport materials. Because these crates may be exposed to harsh environments, they are dip-treated with a wood preservative (biocide treatment). For many years, zinc-naphthenate was the most commonly used preservative for these packaging crates and few corrosion problems with the wires were observed. Recently,...

  1. Improved superconducting magnet wire

    Science.gov (United States)

    Schuller, I.K.; Ketterson, J.B.

    1983-08-16

    This invention is directed to a superconducting tape or wire composed of alternating layers of copper and a niobium-containing superconductor such as niobium of NbTi, Nb/sub 3/Sn or Nb/sub 3/Ge. In general, each layer of the niobium-containing superconductor has a thickness in the range of about 0.05 to 1.5 times its coherence length (which for Nb/sub 3/Si is 41 A) with each copper layer having a thickness in the range of about 170 to 600 A. With the use of very thin layers of the niobium composition having a thickness within the desired range, the critical field (H/sub c/) may be increased by factors of 2 to 4. Also, the thin layers of the superconductor permit the resulting tape or wire to exhibit suitable ductility for winding on a magnet core. These compositions are also characterized by relatively high values of critical temperature and therefore will exhibit a combination of useful properties as superconductors.

  2. Generating single microwave photons in a circuit.

    Science.gov (United States)

    Houck, A A; Schuster, D I; Gambetta, J M; Schreier, J A; Johnson, B R; Chow, J M; Frunzio, L; Majer, J; Devoret, M H; Girvin, S M; Schoelkopf, R J

    2007-09-20

    Microwaves have widespread use in classical communication technologies, from long-distance broadcasts to short-distance signals within a computer chip. Like all forms of light, microwaves, even those guided by the wires of an integrated circuit, consist of discrete photons. To enable quantum communication between distant parts of a quantum computer, the signals must also be quantum, consisting of single photons, for example. However, conventional sources can generate only classical light, not single photons. One way to realize a single-photon source is to collect the fluorescence of a single atom. Early experiments measured the quantum nature of continuous radiation, and further advances allowed triggered sources of photons on demand. To allow efficient photon collection, emitters are typically placed inside optical or microwave cavities, but these sources are difficult to employ for quantum communication on wires within an integrated circuit. Here we demonstrate an on-chip, on-demand single-photon source, where the microwave photons are injected into a wire with high efficiency and spectral purity. This is accomplished in a circuit quantum electrodynamics architecture, with a microwave transmission line cavity that enhances the spontaneous emission of a single superconducting qubit. When the qubit spontaneously emits, the generated photon acts as a flying qubit, transmitting the quantum information across a chip. We perform tomography of both the qubit and the emitted photons, clearly showing that both the quantum phase and amplitude are transferred during the emission. Both the average power and voltage of the photon source are characterized to verify performance of the system. This single-photon source is an important addition to a rapidly growing toolbox for quantum optics on a chip.

  3. Electrical Circuits and Water Analogies

    Science.gov (United States)

    Smith, Frederick A.; Wilson, Jerry D.

    1974-01-01

    Briefly describes water analogies for electrical circuits and presents plans for the construction of apparatus to demonstrate these analogies. Demonstrations include series circuits, parallel circuits, and capacitors. (GS)

  4. Electric circuits essentials

    CERN Document Server

    REA, Editors of

    2012-01-01

    REA's Essentials provide quick and easy access to critical information in a variety of different fields, ranging from the most basic to the most advanced. As its name implies, these concise, comprehensive study guides summarize the essentials of the field covered. Essentials are helpful when preparing for exams, doing homework and will remain a lasting reference source for students, teachers, and professionals. Electric Circuits I includes units, notation, resistive circuits, experimental laws, transient circuits, network theorems, techniques of circuit analysis, sinusoidal analysis, polyph

  5. Wire and Packing Tape Sandwiches

    Science.gov (United States)

    Rabinowitz, Sandy

    2009-01-01

    In this article, the author describes how students can combine craft wire with clear packing tape to create a two-dimensional design that can be bent and twisted to create a three-dimensional form. Students sandwich wire designs between two layers of tape. (Contains 1 online resource.)

  6. Classical circuit theory

    CERN Document Server

    Wing, Omar

    2008-01-01

    Starting with the basic principles of circuits, this book derives their analytic properties in both the time and frequency domains. It develops an algorithmic method to design common and uncommon types of circuits, such as prototype filters, lumped delay lines, constant phase difference circuits, and delay equalizers.

  7. Piezoelectric drive circuit

    Science.gov (United States)

    Treu, C.A. Jr.

    1999-08-31

    A piezoelectric motor drive circuit is provided which utilizes the piezoelectric elements as oscillators and a Meacham half-bridge approach to develop feedback from the motor ground circuit to produce a signal to drive amplifiers to power the motor. The circuit automatically compensates for shifts in harmonic frequency of the piezoelectric elements due to pressure and temperature changes. 7 figs.

  8. Signal sampling circuit

    NARCIS (Netherlands)

    Louwsma, S.M.; Vertregt, Maarten

    2011-01-01

    A sampling circuit for sampling a signal is disclosed. The sampling circuit comprises a plurality of sampling channels adapted to sample the signal in time-multiplexed fashion, each sampling channel comprising a respective track-and-hold circuit connected to a respective analogue to digital

  9. Signal sampling circuit

    NARCIS (Netherlands)

    Louwsma, S.M.; Vertregt, Maarten

    2010-01-01

    A sampling circuit for sampling a signal is disclosed. The sampling circuit comprises a plurality of sampling channels adapted to sample the signal in time-multiplexed fashion, each sampling channel comprising a respective track-and-hold circuit connected to a respective analogue to digital

  10. Wire metamaterials: physics and applications.

    Science.gov (United States)

    Simovski, Constantin R; Belov, Pavel A; Atrashchenko, Alexander V; Kivshar, Yuri S

    2012-08-16

    The physics and applications of a broad class of artificial electromagnetic materials composed of lattices of aligned metal rods embedded in a dielectric matrix are reviewed. Such structures are here termed wire metamaterials. They appear in various settings and can operate from microwaves to THz and optical frequencies. An important group of these metamaterials is a wire medium possessing extreme optical anisotropy. The study of wire metamaterials has a long history, however, most of their important and useful properties have been revealed and understood only recently, especially in the THz and optical frequency ranges where the wire media correspond to the lattices of microwires and nanowires, respectively. Another group of wire metamaterials are arrays and lattices of nanorods of noble metals whose unusual properties are driven by plasmonic resonances. Copyright © 2012 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  11. 3D Wire 2015

    DEFF Research Database (Denmark)

    Jordi, Moréton; F, Escribano; J. L., Farias

    , therefore, we’ve drawn conclusions and recommendations for future editions of the event, also generalizable to other experiences of gamification especially in events. This report details the methodology and working elements from the design phase, human resources and organization of production......This document is a general report on the implementation of gamification in 3D Wire 2015 event. As the second gamification experience in this event, we have delved deeply in the previous objectives (attracting public areas less frequented exhibition in previous years and enhance networking) and have...... proposed new ones (viralization of the event on social networks and improvement of the integration of international attendees). On the other hand we defined a set of research objectives related to the study of gamification in an eminently social place like an event. Most of the goals have been met and...

  12. Rodent Zic Genes in Neural Network Wiring.

    Science.gov (United States)

    Herrera, Eloísa

    2018-01-01

    The formation of the nervous system is a multistep process that yields a mature brain. Failure in any of the steps of this process may cause brain malfunction. In the early stages of embryonic development, neural progenitors quickly proliferate and then, at a specific moment, differentiate into neurons or glia. Once they become postmitotic neurons, they migrate to their final destinations and begin to extend their axons to connect with other neurons, sometimes located in quite distant regions, to establish different neural circuits. During the last decade, it has become evident that Zic genes, in addition to playing important roles in early development (e.g., gastrulation and neural tube closure), are involved in different processes of late brain development, such as neuronal migration, axon guidance, and refinement of axon terminals. ZIC proteins are therefore essential for the proper wiring and connectivity of the brain. In this chapter, we review our current knowledge of the role of Zic genes in the late stages of neural circuit formation.

  13. Microglia Modulate Wiring of the Embryonic Forebrain

    Directory of Open Access Journals (Sweden)

    Paola Squarzoni

    2014-09-01

    Full Text Available Dysfunction of microglia, the tissue macrophages of the brain, has been associated with the etiology of several neuropsychiatric disorders. Consistently, microglia have been shown to regulate neurogenesis and synaptic maturation at perinatal and postnatal stages. However, microglia invade the brain during mid-embryogenesis and thus could play an earlier prenatal role. Here, we show that embryonic microglia, which display a transiently uneven distribution, regulate the wiring of forebrain circuits. Using multiple mouse models, including cell-depletion approaches and cx3cr1−/−, CR3−/−, and DAP12−/− mutants, we find that perturbing microglial activity affects the outgrowth of dopaminergic axons in the forebrain and the laminar positioning of subsets of neocortical interneurons. Since defects in both dopamine innervation and cortical networks have been linked to neuropsychiatric diseases, our study provides insights into how microglial dysfunction can impact forebrain connectivity and reveals roles for immune cells during normal assembly of brain circuits.

  14. Regulation of Drosophila Brain Wiring by Neuropil Interactions via a Slit-Robo-RPTP Signaling Complex.

    Science.gov (United States)

    Oliva, Carlos; Soldano, Alessia; Mora, Natalia; De Geest, Natalie; Claeys, Annelies; Erfurth, Maria-Luise; Sierralta, Jimena; Ramaekers, Ariane; Dascenco, Dan; Ejsmont, Radoslaw K; Schmucker, Dietmar; Sanchez-Soriano, Natalia; Hassan, Bassem A

    2016-10-24

    The axonal wiring molecule Slit and its Round-About (Robo) receptors are conserved regulators of nerve cord patterning. Robo receptors also contribute to wiring brain circuits. Whether molecular mechanisms regulating these signals are modified to fit more complex brain wiring processes is unclear. We investigated the role of Slit and Robo receptors in wiring Drosophila higher-order brain circuits and identified differences in the cellular and molecular mechanisms of Robo/Slit function. First, we find that signaling by Robo receptors in the brain is regulated by the Receptor Protein Tyrosine Phosphatase RPTP69d. RPTP69d increases membrane availability of Robo3 without affecting its phosphorylation state. Second, we detect no midline localization of Slit during brain development. Instead, Slit is enriched in the mushroom body, a neuronal structure covering large areas of the brain. Thus, a divergent molecular mechanism regulates neuronal circuit wiring in the Drosophila brain, partly in response to signals from the mushroom body. Copyright © 2016 The Authors. Published by Elsevier Inc. All rights reserved.

  15. Feedback in analog circuits

    CERN Document Server

    Ochoa, Agustin

    2016-01-01

    This book describes a consistent and direct methodology to the analysis and design of analog circuits with particular application to circuits containing feedback. The analysis and design of circuits containing feedback is generally presented by either following a series of examples where each circuit is simplified through the use of insight or experience (someone else’s), or a complete nodal-matrix analysis generating lots of algebra. Neither of these approaches leads to gaining insight into the design process easily. The author develops a systematic approach to circuit analysis, the Driving Point Impedance and Signal Flow Graphs (DPI/SFG) method that does not require a-priori insight to the circuit being considered and results in factored analysis supporting the design function. This approach enables designers to account fully for loading and the bi-directional nature of elements both in the feedback path and in the amplifier itself, properties many times assumed negligible and ignored. Feedback circuits a...

  16. Circuit bridging of components by smoke

    Energy Technology Data Exchange (ETDEWEB)

    Tanaka, T.J.; Nowlen, S.P.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States)

    1996-10-01

    Smoke can adversely affect digital electronics; in the short term, it can lead to circuit bridging and in the long term to corrosion of metal parts. This report is a summary of the work to date and component-level tests by Sandia National Laboratories for the Nuclear Regulatory Commission to determine the impact of smoke on digital instrumentation and control equipment. The component tests focused on short-term effects such as circuit bridging in typical components and the factors that can influence how much the smoke will affect them. These factors include the component technology and packaging, physical board protection, and environmental conditions such as the amount of smoke, temperature of burn, and humidity level. The likelihood of circuit bridging was tested by measuring leakage currents and converting those currents to resistance in ohms. Hermetically sealed ceramic packages were more resistant to smoke than plastic packages. Coating the boards with an acrylic spray provided some protection against circuit bridging. The smoke generation factors that affect the resistance the most are humidity, fuel level, and burn temperature. The use of CO{sub 2} as a fire suppressant, the presence of galvanic metal, and the presence of PVC did not significantly affect the outcome of these results.

  17. Circuit bridging of components by smoke

    International Nuclear Information System (INIS)

    Tanaka, T.J.; Nowlen, S.P.; Anderson, D.J.

    1996-10-01

    Smoke can adversely affect digital electronics; in the short term, it can lead to circuit bridging and in the long term to corrosion of metal parts. This report is a summary of the work to date and component-level tests by Sandia National Laboratories for the Nuclear Regulatory Commission to determine the impact of smoke on digital instrumentation and control equipment. The component tests focused on short-term effects such as circuit bridging in typical components and the factors that can influence how much the smoke will affect them. These factors include the component technology and packaging, physical board protection, and environmental conditions such as the amount of smoke, temperature of burn, and humidity level. The likelihood of circuit bridging was tested by measuring leakage currents and converting those currents to resistance in ohms. Hermetically sealed ceramic packages were more resistant to smoke than plastic packages. Coating the boards with an acrylic spray provided some protection against circuit bridging. The smoke generation factors that affect the resistance the most are humidity, fuel level, and burn temperature. The use of CO 2 as a fire suppressant, the presence of galvanic metal, and the presence of PVC did not significantly affect the outcome of these results

  18. Humidification during high-frequency oscillation ventilation is affected by ventilator circuit and ventilatory setting.

    Science.gov (United States)

    Chikata, Yusuke; Imanaka, Hideaki; Onishi, Yoshiaki; Ueta, Masahiko; Nishimura, Masaji

    2009-08-01

    High-frequency oscillation ventilation (HFOV) is an accepted ventilatory mode for acute respiratory failure in neonates. As conventional mechanical ventilation, inspiratory gas humidification is essential. However, humidification during HFOV has not been clarified. In this bench study, we evaluated humidification during HFOV in the open circumstance of ICU. Our hypothesis is that humidification during HFOV is affected by circuit design and ventilatory settings. We connected a ventilator with HFOV mode to a neonatal lung model that was placed in an infant incubator set at 37 degrees C. We set a heated humidifier (Fisher & Paykel) to obtain 37 degrees C at the chamber outlet and 40 degrees C at the distal temperature probe. We measured absolute humidity and temperature at the Y-piece using a rapid-response hygrometer. We evaluated two types of ventilator circuit: a circuit with inner heating wire and another with embedded heating element. In addition, we evaluated three lengths of the inspiratory limb, three stroke volumes, three frequencies, and three mean airway pressures. The circuit with embedded heating element provided significantly higher absolute humidity and temperature than one with inner heating wire. As an extended tube lacking a heating wire was shorter, absolute humidity and temperature became higher. In the circuit with inner heating wire, absolute humidity and temperature increased as stroke volume increased. Humidification during HFOV is affected by circuit design and ventilatory settings.

  19. Plasma chemistry in wire chambers

    International Nuclear Information System (INIS)

    Wise, J.

    1990-05-01

    The phenomenology of wire chamber aging is discussed and fundamentals of proportional counters are presented. Free-radical polymerization and plasma polymerization are discussed. The chemistry of wire aging is reviewed. Similarities between wire chamber plasma (>1 atm dc-discharge) and low-pressure rf-discharge plasmas, which have been more widely studied, are suggested. Construction and use of a system to allow study of the plasma reactions occurring in wire chambers is reported. A proportional tube irradiated by an 55 Fe source is used as a model wire chamber. Condensable species in the proportional tube effluent are concentrated in a cryotrap and analyzed by gas chromatography/mass spectrometry. Several different wire chamber gases (methane, argon/methane, ethane, argon/ethane, propane, argon/isobutane) are tested and their reaction products qualitatively identified. For all gases tested except those containing methane, use of hygroscopic filters to remove trace water and oxygen contaminants from the gas resulted in an increase in the average molecular weight of the products, consistent with results from low-pressure rf-discharge plasmas. It is suggested that because water and oxygen inhibit polymer growth in the gas phase that they may also reduce polymer deposition in proportional tubes and therefore retard wire aging processes. Mechanistic implications of the plasma reactions of hydrocarbons with oxygen are suggested. Unresolved issues in this work and proposals for further study are discussed

  20. The wiring diagram of a glomerular olfactory system

    Science.gov (United States)

    Berck, Matthew E; Khandelwal, Avinash; Claus, Lindsey; Hernandez-Nunez, Luis; Si, Guangwei; Tabone, Christopher J; Li, Feng; Truman, James W; Fetter, Rick D; Louis, Matthieu; Samuel, Aravinthan DT; Cardona, Albert

    2016-01-01

    The sense of smell enables animals to react to long-distance cues according to learned and innate valences. Here, we have mapped with electron microscopy the complete wiring diagram of the Drosophila larval antennal lobe, an olfactory neuropil similar to the vertebrate olfactory bulb. We found a canonical circuit with uniglomerular projection neurons (uPNs) relaying gain-controlled ORN activity to the mushroom body and the lateral horn. A second, parallel circuit with multiglomerular projection neurons (mPNs) and hierarchically connected local neurons (LNs) selectively integrates multiple ORN signals already at the first synapse. LN-LN synaptic connections putatively implement a bistable gain control mechanism that either computes odor saliency through panglomerular inhibition, or allows some glomeruli to respond to faint aversive odors in the presence of strong appetitive odors. This complete wiring diagram will support experimental and theoretical studies towards bridging the gap between circuits and behavior. DOI: http://dx.doi.org/10.7554/eLife.14859.001 PMID:27177418

  1. 49 CFR 393.28 - Wiring systems.

    Science.gov (United States)

    2010-10-01

    ... 49 Transportation 5 2010-10-01 2010-10-01 false Wiring systems. 393.28 Section 393.28... NECESSARY FOR SAFE OPERATION Lamps, Reflective Devices, and Electrical Wiring § 393.28 Wiring systems. Electrical wiring shall be installed and maintained to conform to SAE J1292—Automobile, Truck, Truck-Tractor...

  2. Electric circuits and signals

    CERN Document Server

    Sabah, Nassir H

    2007-01-01

    Circuit Variables and Elements Overview Learning Objectives Electric Current Voltage Electric Power and Energy Assigned Positive Directions Active and Passive Circuit Elements Voltage and Current Sources The Resistor The Capacitor The Inductor Concluding Remarks Summary of Main Concepts and Results Learning Outcomes Supplementary Topics on CD Problems and Exercises Basic Circuit Connections and Laws Overview Learning Objectives Circuit Terminology Kirchhoff's Laws Voltage Division and Series Connection of Resistors Current Division and Parallel Connection of Resistors D-Y Transformation Source Equivalence and Transformation Reduced-Voltage Supply Summary of Main Concepts and Results Learning Outcomes Supplementary Topics and Examples on CD Problems and Exercises Basic Analysis of Resistive Circuits Overview Learning Objectives Number of Independent Circuit Equations Node-Voltage Analysis Special Considerations in Node-Voltage Analysis Mesh-Current Analysis Special Conside...

  3. Modeling birds on wires.

    Science.gov (United States)

    Aydoğdu, A; Frasca, P; D'Apice, C; Manzo, R; Thornton, J M; Gachomo, B; Wilson, T; Cheung, B; Tariq, U; Saidel, W; Piccoli, B

    2017-02-21

    In this paper we introduce a mathematical model to study the group dynamics of birds resting on wires. The model is agent-based and postulates attraction-repulsion forces between the interacting birds: the interactions are "topological", in the sense that they involve a given number of neighbors irrespective of their distance. The model is first mathematically analyzed and then simulated to study its main properties: we observe that the model predicts birds to be more widely spaced near the borders of each group. We compare the results from the model with experimental data, derived from the analysis of pictures of pigeons and starlings taken in New Jersey: two different image elaboration protocols allow us to establish a good agreement with the model and to quantify its main parameters. We also discuss the potential handedness of the birds, by analyzing the group organization features and the group dynamics at the arrival of new birds. Finally, we propose a more refined mathematical model that describes landing and departing birds by suitable stochastic processes. Copyright © 2016 Elsevier Ltd. All rights reserved.

  4. Vertical Silicon Nano wire Platform for Low Power Electronics and Clean Energy Applications

    International Nuclear Information System (INIS)

    Kwong, D.L.; Li, X.; Sun, Y.; Ramanathan, G.; Chen, Z.X.; Wong, S.M.; Li, Y.; Shen, N.S.; Buddharaju, K.; Yu, Y.H.; Lee, S.J.; Singh, N.; Lo, G.Q.; Li, X.; Sun, Y.; Ramanathan, G.; Wong, S.M.; Yu, Y.H.; Li, Y.; Lee, S.J.

    2012-01-01

    This paper reviews the progress of the vertical top-down nano wire technology platform developed to explore novel device architectures and integration schemes for green electronics and clean energy applications. Under electronics domain, besides having ultimate scaling potential, the vertical wire offers (1) CMOS circuits with much smaller foot print as compared to planar transistor at the same technology node, (2) a natural platform for tunneling FETs, and (3) a route to fabricate stacked nonvolatile memory cells. Under clean energy harvesting area, vertical wires could provide (1) cost reduction in photovoltaic energy conversion through enhanced light trapping and (2) a fully CMOS compatible thermoelectric engine converting waste-heat into electricity. In addition to progress review, we discuss the challenges and future prospects with vertical nano wires platform.

  5. Analog circuit design

    CERN Document Server

    Dobkin, Bob

    2012-01-01

    Analog circuit and system design today is more essential than ever before. With the growth of digital systems, wireless communications, complex industrial and automotive systems, designers are being challenged to develop sophisticated analog solutions. This comprehensive source book of circuit design solutions aids engineers with elegant and practical design techniques that focus on common analog challenges. The book's in-depth application examples provide insight into circuit design and application solutions that you can apply in today's demanding designs. <

  6. Analog circuits cookbook

    CERN Document Server

    Hickman, Ian

    2013-01-01

    Analog Circuits Cookbook presents articles about advanced circuit techniques, components and concepts, useful IC for analog signal processing in the audio range, direct digital synthesis, and ingenious video op-amp. The book also includes articles about amplitude measurements on RF signals, linear optical imager, power supplies and devices, and RF circuits and techniques. Professionals and students of electrical engineering will find the book informative and useful.

  7. Regenerative feedback resonant circuit

    Science.gov (United States)

    Jones, A. Mark; Kelly, James F.; McCloy, John S.; McMakin, Douglas L.

    2014-09-02

    A regenerative feedback resonant circuit for measuring a transient response in a loop is disclosed. The circuit includes an amplifier for generating a signal in the loop. The circuit further includes a resonator having a resonant cavity and a material located within the cavity. The signal sent into the resonator produces a resonant frequency. A variation of the resonant frequency due to perturbations in electromagnetic properties of the material is measured.

  8. Circuits and electronics hands-on learning with analog discovery

    CERN Document Server

    Okyere Attia, John

    2018-01-01

    The book provides instructions on building circuits on breadboards, connecting the Analog Discovery wires to the circuit under test, and making electrical measurements. Various measurement techniques are described and used in this book, including: impedance measurements, complex power measurements, frequency response measurements, power spectrum measurements, current versus voltage characteristic measurements of diodes, bipolar junction transistors, and Mosfets. The book includes end-of-chapter problems for additional exercises geared towards hands-on learning, experimentation, comparisons between measured results and those obtained from theoretical calculations.

  9. Topology Optimized Photonic Wire Splitters

    DEFF Research Database (Denmark)

    Frandsen, Lars Hagedorn; Borel, Peter Ingo; Jensen, Jakob Søndergaard

    2006-01-01

    Photonic wire splitters have been designed using topology optimization. The splitters have been fabricated in silicon-on-insulator material and display broadband low-loss 3dB splitting in a bandwidth larger than 100 nm.......Photonic wire splitters have been designed using topology optimization. The splitters have been fabricated in silicon-on-insulator material and display broadband low-loss 3dB splitting in a bandwidth larger than 100 nm....

  10. Composite conductor containing superconductive wires

    Energy Technology Data Exchange (ETDEWEB)

    Larson, W.L.; Wong, J.

    1974-03-26

    A superconductor cable substitute made by coworking multiple rods of superconductive niobium--titanium or niobium--zirconium alloy with a common copper matrix to extend the copper and rods to form a final elongated product which has superconductive wires distributed in a reduced cross-section copper conductor with a complete metallurgical bond between the normal-conductive copper and the superconductor wires contained therein is described. The superconductor cable can be in the form of a tube.

  11. 30 CFR 75.701-4 - Grounding wires; capacity of wires.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Grounding wires; capacity of wires. 75.701-4... SAFETY AND HEALTH MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Grounding § 75.701-4 Grounding wires; capacity of wires. Where grounding wires are used to ground metallic sheaths, armors, conduits, frames...

  12. 1 mil gold bond wire study.

    Energy Technology Data Exchange (ETDEWEB)

    Huff, Johnathon; McLean, Michael B.; Jenkins, Mark W.; Rutherford, Brian Milne

    2013-05-01

    In microcircuit fabrication, the diameter and length of a bond wire have been shown to both affect the current versus fusing time ratio of a bond wire as well as the gap length of the fused wire. This study investigated the impact of current level on the time-to-open and gap length of 1 mil by 60 mil gold bond wires. During the experiments, constant current was provided for a control set of bond wires for 250ms, 410ms and until the wire fused; non-destructively pull-tested wires for 250ms; and notched wires. The key findings were that as the current increases, the gap length increases and 73% of the bond wires will fuse at 1.8A, and 100% of the wires fuse at 1.9A within 60ms. Due to the limited scope of experiments and limited data analyzed, further investigation is encouraged to confirm these observations.

  13. Timergenerator circuits manual

    CERN Document Server

    Marston, R M

    2013-01-01

    Timer/Generator Circuits Manual is an 11-chapter text that deals mainly with waveform generator techniques and circuits. Each chapter starts with an explanation of the basic principles of its subject followed by a wide range of practical circuit designs. This work presents a total of over 300 practical circuits, diagrams, and tables.Chapter 1 outlines the basic principles and the different types of generator. Chapters 2 to 9 deal with a specific type of waveform generator, including sine, square, triangular, sawtooth, and special waveform generators pulse. These chapters also include pulse gen

  14. Electronic devices and circuits

    CERN Document Server

    Pridham, Gordon John

    1968-01-01

    Electronic Devices and Circuits, Volume 1 deals with the design and applications of electronic devices and circuits such as passive components, diodes, triodes and transistors, rectification and power supplies, amplifying circuits, electronic instruments, and oscillators. These topics are supported with introductory network theory and physics. This volume is comprised of nine chapters and begins by explaining the operation of resistive, inductive, and capacitive elements in direct and alternating current circuits. The theory for some of the expressions quoted in later chapters is presented. Th

  15. Circuits and filters handbook

    CERN Document Server

    Chen, Wai-Kai

    2003-01-01

    A bestseller in its first edition, The Circuits and Filters Handbook has been thoroughly updated to provide the most current, most comprehensive information available in both the classical and emerging fields of circuits and filters, both analog and digital. This edition contains 29 new chapters, with significant additions in the areas of computer-aided design, circuit simulation, VLSI circuits, design automation, and active and digital filters. It will undoubtedly take its place as the engineer's first choice in looking for solutions to problems encountered in the design, analysis, and behavi

  16. CMOS circuits manual

    CERN Document Server

    Marston, R M

    1995-01-01

    CMOS Circuits Manual is a user's guide for CMOS. The book emphasizes the practical aspects of CMOS and provides circuits, tables, and graphs to further relate the fundamentals with the applications. The text first discusses the basic principles and characteristics of the CMOS devices. The succeeding chapters detail the types of CMOS IC, including simple inverter, gate and logic ICs and circuits, and complex counters and decoders. The last chapter presents a miscellaneous collection of two dozen useful CMOS circuits. The book will be useful to researchers and professionals who employ CMOS circu

  17. MOS integrated circuit design

    CERN Document Server

    Wolfendale, E

    2013-01-01

    MOS Integral Circuit Design aims to help in the design of integrated circuits, especially large-scale ones, using MOS Technology through teaching of techniques, practical applications, and examples. The book covers topics such as design equation and process parameters; MOS static and dynamic circuits; logic design techniques, system partitioning, and layout techniques. Also featured are computer aids such as logic simulation and mask layout, as well as examples on simple MOS design. The text is recommended for electrical engineers who would like to know how to use MOS for integral circuit desi

  18. Security electronics circuits manual

    CERN Document Server

    MARSTON, R M

    1998-01-01

    Security Electronics Circuits Manual is an invaluable guide for engineers and technicians in the security industry. It will also prove to be a useful guide for students and experimenters, as well as providing experienced amateurs and DIY enthusiasts with numerous ideas to protect their homes, businesses and properties.As with all Ray Marston's Circuits Manuals, the style is easy-to-read and non-mathematical, with the emphasis firmly on practical applications, circuits and design ideas. The ICs and other devices used in the practical circuits are modestly priced and readily available ty

  19. HTS Wire Development Workshop: Proceedings

    Energy Technology Data Exchange (ETDEWEB)

    1994-07-01

    The 1994 High-Temperature Superconducting Wire Development Workshop was held on February 16--17 at the St. Petersburg Hilton and Towers in St. Petersburg, Florida. The meeting was hosted by Florida Power Corporation and sponsored by the US Department of Energy`s Superconductivity Program for Electric Power Systems. The meeting focused on recent high-temperature superconducting wire development activities in the Department of Energy`s Superconductivity Systems program. The meeting opened with a general discussion on the needs and benefits of superconductivity from a utility perspective, the US global competitiveness position, and an outlook on the overall prospects of wire development. The meeting then focused on four important technology areas: Wire characterization: issues and needs; technology for overcoming barriers: weak links and flux pinning; manufacturing issues for long wire lengths; and physical properties of HTS coils. Following in-depth presentations, working groups were formed in each technology area to discuss the most important current research and development issues. The working groups identified research areas that have the potential for greatly enhancing the wire development effort. These areas are discussed in the summary reports from each of the working groups. This document is a compilation of the workshop proceedings including all general session presentations and summary reports from the working groups.

  20. Clearance of short circuited ion optics electrodes by capacitive discharge. [in ion thrusters

    Science.gov (United States)

    Poeschel, R. L.

    1976-01-01

    The ion optics electrodes of low specific impulse (3000 sec) mercury electron bombardment ion thrusters are vulnerable to short circuits by virtue of their relatively small interelectrode spacing (0.5 mm). Metallic flakes from backsputtered deposits are the most probable cause of such 'shorts' and 'typical' flakes have been simulated here using refractory wire that has a representative, but controllable, cross section. Shorting wires can be removed by capacitive discharge without significant damage to the electrodes. This paper describes an evaluation of 'short' removal versus electrode damage for several combinations of capacitor voltage, stored energy, and short circuit conditions.

  1. Prediction of Short-Circuit-Related Thermal Stress in Aged IGBT Modules

    DEFF Research Database (Denmark)

    Bahman, Amir Sajjad; Iannuzzo, Francesco; Uhrenfeldt, Christian

    2016-01-01

    In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely...... fabricated. The temperature distribution produced by such abnormal conditions has been modelled first by means of FEM simulations and then experimentally validated by means of a non-destructive testing technique including an ultra-fast infrared camera. Results demonstrate a significant imbalance...... in the surface temperature distribution which confirms the hypothesis that short-circuit events produce significantly uneven stresses on bond wires....

  2. Modeling of Short-Circuit-Related Thermal Stress in Aged IGBT Modules

    DEFF Research Database (Denmark)

    Bahman, Amir Sajjad; Iannuzzo, Francesco; Uhrenfeldt, Christian

    2017-01-01

    In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely...... fabricated. The temperature distribution produced by such abnormal conditions has been modelled first by means of FEM simulations and then experimentally validated by means of a non-destructive testing technique including an ultra-fast infrared camera. Results demonstrate a significant imbalance...... in the surface temperature distribution, which confirms the hypothesis that short-circuit events produce significantly uneven stresses on bond wires....

  3. Capacitive Coupling in Double-Circuit Transmission Lines

    Directory of Open Access Journals (Sweden)

    Zdenka Benesova

    2004-01-01

    Full Text Available The paper describes an algorithm for calculation of capacitances and charges on conductors in systems with earth wires and in double-circuit overhead lines with respect to phase arrangement. A balanced voltage system is considered. A suitable transposition of individual conductors enables to reduce the electric and magnetic fields in vicinity of overhead lines and to limit the inductive and capacitive linkage. The procedure is illustrated on examples the results of which lead to particular recommendations for designers.

  4. Influence of surface layer on mechanical and corrosion properties of nickel-titanium orthodontic wires.

    Science.gov (United States)

    Katić, Višnja; Curković, Helena Otmačić; Semenski, Damir; Baršić, Gorana; Marušić, Katarina; Spalj, Stjepan

    2014-11-01

    To analyze the effect of various coating formulations on the mechanical and corrosion properties of nickel-titanium (NiTi) orthodontic wires. Uncoated, rhodium-coated, and nitrified NiTi wires were observed with a three-point-bend test, surface roughness (Ra) measurement, scanning electron microscopy, energy dispersive spectroscopy, and electrochemical testing (open circuit potential, electrochemical impedance spectroscopy, and cyclic polarization scan). Differences in the properties of tested wire types were analyzed with analysis of variance and Tukey post hoc test. Uncoated and nitrified NiTi wires showed similar mechanical and anticorrosive properties, while rhodium-coated NiTi wires showed the highest Ra and significantly higher modulus of elasticity, yield strength, and delivery of forces during loading but not in unloading. Rhodium-coated NiTi wires also had the highest corrosion current density and corrosion potential, lowest impedance modulus, and two time constants on Bode plot, one related to the Rh/Au coating and the other to underlying NiTi. Working properties of NiTi wires were unaffected by various coatings in unloading. Nitrification improved corrosion resistance. Rhodium coating reduced corrosion resistance and pronounced susceptibility to pitting corrosion in artificial saliva because of galvanic coupling between the noble coating and the base alloy.

  5. Feasibility studies on the direct wire readout on wire scanners in electron accelerators; Durchfuehrbarkeitsstudien zur direkten Drahtauslese an Wirescannern in Elektronen-Beschleunigern

    Energy Technology Data Exchange (ETDEWEB)

    Markert, Michael

    2010-10-15

    This bachelor thesis deals essentially with the signal processing of a so-called wire scanner, a special monitor, which comes to application in the beam diagnostics of particle accelerators. In this direct wire readout the voltage signal, which is induced by the particle beam in the measurement wire of the wire scanner, shall be directly read out. The aim of this thesis is to show fundamental considerations and perform studies, which study, whether and how in the future by means of a suited data transmission as well as readout electronics conclusion on the most important parameters of the beam, like position and profile, are possible. The measurement system presented here is divided in three main components: Signal measurement, signal preparation, and signal stretching. A suited test facility was developed and is presented in detail, in which then all components, like for instance the transmission cables, the wire-scanner fork, and the developed measurement circuit, are studied, which are of importance for a faultless signal transmission and presentation. Extensive measurements on the single components, as well as calculations for the signal transmission on and in the wire scanner were performed, whereby a good agreement could be found. Thereafter a comparison and a selection of the component used in this project were made. Furthermore improvement proposals, new constructions, and outlooks are presented, which could be of importance in further works.

  6. Highly Reliable NPP Instrumentation Using Constant Voltage Feedback Circuits

    Energy Technology Data Exchange (ETDEWEB)

    Yoo, Seung J.; Choi, Bo H.; Kim, Ji H.; Rim, Chun T. [KAIST, Daejeon (Korea, Republic of)

    2014-08-15

    A highly reliable nuclear power plant (NPP) instrumentation using constant voltage feedback circuits is proposed. Contrary to conventional NPP instrumentation, two operational amplifiers are used at auxiliary building to supply constant DC voltage across the potentiometer or wheatstone bridge type sensors, such as resistance temperature detectors (RTD) and strain gauges. The proposed constant voltage feedback circuits maintain its output voltage as constant regardless of the length of lead wire from the auxiliary building to the sensors. A detail analysis of the proposed feedback circuits and design procedures including the internal resistance and parasitic LC components of lead wire are presented. A prototype with lumped RLC values for modeling lead wires is fabricated and experimentally verified to supply constant 10V up to 200m distance under 0.8% error. Due to its versatile characteristics with cost effective structure, the proposed scheme can be generally extended to pressure meters and water-level recorders to guarantee robust measurements without conventional current transducers under severe accidents.

  7. 'Closed Circuit' Anaesthesia

    African Journals Online (AJOL)

    The advantages of using rebreathing circuits in anaes- thesia are discussed and the principles for their correct employment are outlined. Practical methods are described. By using closed circuit equipment in the manner described, the initial cost of the apparatus could be recouped within one year, because of the saving in ...

  8. Offset cancelling circuit

    NARCIS (Netherlands)

    Wiegerink, Remco J.; Seevinck, Evert; de Jager, Wim

    1989-01-01

    A monolithic offset cancelling circuit to reduce the offset voltage at an integrated audio-amplifier output is described. This offset voltage is detected using a low-pass filter with a very large time constant for which only one small on-chip capacitor is needed. The circuit was realized with a

  9. 78 FR 23591 - Certain Prepregs, Laminates, and Finished Circuit Boards

    Science.gov (United States)

    2013-04-19

    ... connection with this investigation are or will be available for inspection during official business hours (8... VENTEC-Global Laminates USA LLC based on a consent order. On April 10, 2009, the Commission issued notice... consent order issued against TUC on April 10, 2009, based on a settlement agreement and license. Also on...

  10. Printed Circuit Board Integrated Toroidal Radio Frequency Inductors

    DEFF Research Database (Denmark)

    Kamby, Peter; Knott, Arnold; Andersen, Michael A. E.

    2012-01-01

    Modern power semiconductors allow for switching frequencies of power converters in the very high frequency (VHF) band (30 MHz to 300 MHz). The major advantage of this frequency increase is a remarkable reduction of the size of power converters due to smaller passive components. However crucial at...

  11. Prototype and Short-Run Printed Circuit Board Creation

    Science.gov (United States)

    1993-03-01

    Sciences Directorate Research, Development, and Engineering Center March 1993 IV detori&Arra* Ala ba ma 35898- 50001 Approved for public release...distribution isunlimited. 4. PERFORMIN4G OM oN , isO ). ,EPNRTo,. PING ,.ArNoaj REPORT 4UM1SE1) Technical Report RD-WS-92-13 4.. NAME OF PEO,,NIZATIO

  12. Waste printed circuit board recycling techniques and product utilization.

    Science.gov (United States)

    Hadi, Pejman; Xu, Meng; Lin, Carol S K; Hui, Chi-Wai; McKay, Gordon

    2015-01-01

    E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly "recycling" has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined. Copyright © 2014 Elsevier B.V. All rights reserved.

  13. Novel waste printed circuit board recycling process with molten salt

    Science.gov (United States)

    Riedewald, Frank; Sousa-Gallagher, Maria

    2015-01-01

    The objective of the method was to prove the concept of a novel waste PCBs recycling process which uses inert, stable molten salts as the direct heat transfer fluid and, simultaneously, uses this molten salt to separate the metal products in either liquid (solder, zinc, tin, lead, etc.) or solid (copper, gold, steel, palladium, etc.) form at the operating temperatures of 450–470 °C. The PCB recovery reactor is essentially a U-shaped reactor with the molten salt providing a continuous fluid, allowing molten salt access from different depths for metal recovery. A laboratory scale batch reactor was constructed using 316L as suitable construction material. For safety reasons, the inert, stable LiCl–KCl molten salts were used as direct heat transfer fluid. Recovered materials were washed with hot water to remove residual salt before metal recovery assessment. The impact of this work was to show metal separation using molten salts in one single unit, by using this novel reactor methodology. • The reactor is a U-shaped reactor filled with a continuous liquid with a sloped bottom representing a novel reactor concept. • This method uses large PCB pieces instead of shredded PCBs as the reactor volume is 2.2 L. • The treated PCBs can be removed via leg B while the process is on-going. PMID:26150977

  14. Modelling, analysis, and acceleration of a printed circuit board ...

    Indian Academy of Sciences (India)

    Springer Verlag Heidelberg #4 2048 1996 Dec 15 10:16:45

    many of the techniques explored by us in the current paper, such as input control, process ... 1.3 Analysis tools. Two software packages are used to analyses the performance measures of PCB fabrication process considered. These software packages have been ..... This calls for effective use of best practice techniques.

  15. Modelling, analysis, and acceleration of a printed circuit board ...

    Indian Academy of Sciences (India)

    This is a representative PCB fabrication company involving multiple, concurrent fabrication works with contention for human/technical resources. Our model seeks to capture faithfully the flow of the fabrication process in this company and such other organisations, using queueing networks. Using the model developed, we ...

  16. Trend Inspection Station for Printed Circuit Board Solder Joints.

    Science.gov (United States)

    1979-04-07

    the aid of CIRCON Corp. of Santa Barbara, CA, a leading supplier of micro-video systems. The total system would feature display options as well as a...PCB thus making the TIS a full inspection station for all solder joints. Battelle has used the CIRCON Corporation, a leader in CCTV inspection, as a... CIRCON . Further, their color TV camera is the smallest currently on the market and would be the easiest physically to incorporate into the TIS. Therefore

  17. Modelling, analysis, and acceleration of a printed circuit board ...

    Indian Academy of Sciences (India)

    Springer Verlag Heidelberg #4 2048 1996 Dec 15 10:16:45

    Product design and fabrication constitute an important business activity in any manufacturing ... While manufacturing firms have been developing new products since the industrial revolution, the importance of ..... items required to start fabrication in a careful way, so as to arrive as "deterministically" as possible. This in turn ...

  18. Understanding electromagnetic effects using printed circuit board demos

    NARCIS (Netherlands)

    Buesink, Frederik Johannes Karel; Leferink, Frank Bernardus Johannes

    2009-01-01

    Electromagnetic fields are considered by many students as a difficult subject. Unwanted electromagnetic fields are even tougher for students. We have developed many experiments as demonstrations (demos) to show the effect of electromagnetic fields in real life products. This paper gives a brief

  19. Educating electromagnetic effects using printed circuit board demos

    NARCIS (Netherlands)

    Leferink, Frank Bernardus Johannes

    2009-01-01

    Electromagnetic fields are considered by many students as a difficult subject. Unwanted electromagnetic fields are even tougher for students. We have developed many experiments as demonstrations (demos) to show the effect of electromagnetic fields in real life products. This paper gives an overview

  20. Stitching Codeable Circuits: High School Students' Learning About Circuitry and Coding with Electronic Textiles

    Science.gov (United States)

    Litts, Breanne K.; Kafai, Yasmin B.; Lui, Debora A.; Walker, Justice T.; Widman, Sari A.

    2017-10-01

    Learning about circuitry by connecting a battery, light bulb, and wires is a common activity in many science classrooms. In this paper, we expand students' learning about circuitry with electronic textiles, which use conductive thread instead of wires and sewable LEDs instead of lightbulbs, by integrating programming sensor inputs and light outputs and examining how the two domains interact. We implemented an electronic textiles unit with 23 high school students ages 16-17 years who learned how to craft and code circuits with the LilyPad Arduino, an electronic textile construction kit. Our analyses not only confirm significant increases in students' understanding of functional circuits but also showcase students' ability in designing and remixing program code for controlling circuits. In our discussion, we address opportunities and challenges of introducing codeable circuit design for integrating maker activities that include engineering and computing into classrooms.

  1. CMOS analog circuit design

    CERN Document Server

    Allen, Phillip E

    1987-01-01

    This text presents the principles and techniques for designing analog circuits to be implemented in a CMOS technology. The level is appropriate for seniors and graduate students familiar with basic electronics, including biasing, modeling, circuit analysis, and some familiarity with frequency response. Students learn the methodology of analog integrated circuit design through a hierarchically-oriented approach to the subject that provides thorough background and practical guidance for designing CMOS analog circuits, including modeling, simulation, and testing. The authors' vast industrial experience and knowledge is reflected in the circuits, techniques, and principles presented. They even identify the many common pitfalls that lie in the path of the beginning designer--expert advice from veteran designers. The text mixes the academic and practical viewpoints in a treatment that is neither superficial nor overly detailed, providing the perfect balance.

  2. Research on an Automatic Measurement of Impulse Electromagnetic Noise (IV) : Relation of Electromagnetic Induction Noise and Malfunction of Print Circuits

    OpenAIRE

    佐野, 博也; 松本, 史生; サノ, ヒロヤ; マツモト, フミオ; Hiroya, SANO; Fumio, MATUMOTO

    1993-01-01

    Experimental studies were made on electromagnetic susceptibility and malfunction of high speed CMOS digital printed circuit boards (PCB). We measured the induced noise voltage on a printed loop circuit caused by electromagnetic emission from an adjacent digital PCB. Electromagnetic susceptibility of a bus circuit was measured with a TEM cell in frequency range of 10 to 250 MHz. The induced noise increased near the resonance frequency of the circuit. We also measured the amplitude of noise vol...

  3. Renovating the excitation circuit of a conventional welding converter

    Indian Academy of Sciences (India)

    based on power electronics for an existing conventional welding converter. The proposed circuits are .... The control board consists of a star-delta switch for starting the motor, safety fuses. (F1, F2), a four-position ..... Eng. Handbook 1985 Electrical engineering handbook (New York: John Wiley & Sons). Klingman D 1998 ...

  4. Simulation of electronic circuit sensitivity towards humidity using electrochemical data on water layer

    DEFF Research Database (Denmark)

    Joshy, Salil; Verdingovas, Vadimas; Jellesen, Morten Stendahl

    2015-01-01

    Climatic conditions like temperature and humidity have direct influence on the operation of electronic circuits. The effects of temperature on the operation of electronic circuits have been widely investigated, while the effect of humidity and solder flux residues are not well understood including...... the effect on circuit and PCBA (printed circuit board assembly) layout design. This paper elucidates a methodology for analyzing the sensitivity of an electronic circuit based on parasitic circuit analysis using data on electrical property of the water layer formed under humid as well as contaminated...... conditions. Some commonly used circuits are analyzed as case studies and flux related contaminations of PCBA from process is used as an example to show how different flux chemistry and humidity together compromise the circuit functionality....

  5. EDITORIAL More than a wire More than a wire

    Science.gov (United States)

    Demming, Anna

    2010-10-01

    Nanowires are the natural evolution of the connections in circuits when scaled down to nanometre sizes. On closer inspection, of course, the role of nanowires in developing new technologies is much more than just a current-bearing medium. By sizing the diameters of these objects down to the nanoscale, their properties become increasingly sensitive to factors such as the gas composition, temperature and incident light of their surrounding environment, as well as defects and variations in diameter. What becomes important in modern electronics innovations is not just what is connected, but how. Nanowires had already begun to attract the attention of researchers in the early 1990s as advances in imaging and measurement devices invited researchers to investigate the properties of these one-dimensional structures [1, 2]. This interest has sparked ingenious ways of fabricating nanowires such as the use of a DNA template. A collaboration of researchers at Louisiana Tech University in the US hs provided an overview of various methods to assemble conductive nanowires on a DNA template, including a summary of different approaches to stretching and positioning the templates [3]. Work in this area demonstrates a neat parallel for the role of DNA molecules as the building blocks of life and the foundations of nanoscale device architectures. Scientists at HP Labs in California are using nanowires to shrink the size of logic arrays [4]. One aspect of electronic interconnects that requires particular attention at nanoscale sizes is the effect of defects. The researchers at HP Labs demonstrate that their approach, which they name FPNI (field-programmable nanowire interconnect), is extremely tolerant of the high defect rates likely to be found in these nanoscale structures, and allows reduction in size and power without significantly sacrificing the clock rate. Another issue in scaling down electronics is the trend for an increasing resistivity with decreasing wire width. Researchers

  6. Investigation of magnetoimpedance effect on electrodeposited NiFe/Cu wire using inductance spectroscopy

    International Nuclear Information System (INIS)

    Mishra, Amaresh Chandra; Sahoo, Trilochan; Srinivas, V.; Thakur, Awalendra K.

    2011-01-01

    In this report, inductance spectroscopy (IS) has been used as a tool to investigate the thickness dependence of magnetoimpedance (MI) on electrodeposited NiFe thin films. An MI value as high as 140% has been observed under an applied magnetic field of 76 Oe at 300 kHz frequency for a film thickness of 6.8 μm. This result is in sharp contrast to earlier reports in literature showing monotonous increase in MI as a function of thickness. Maximum of MI was found at an optimum film thickness whose position varies with frequency. These reports exhibiting strong frequency dependence of MI prompted us to investigate the underlying physics using IS. The origin of MI lies in the combined effect of domain wall motion and spin rotation, which contributes to permeability. A parallel inductance and resistance (LR) circuit in series with series LR circuit model has been proposed as an equivalent electrical model to describe the property of these coated wires. The circuit elements have been linked with the phenomenon of domain wall motion and spin rotation. The experimental results obtained appear to be consistent with the proposed equivalent circuit model. -- Research Highlights: →GMI study on electrodeposited NiFe/Cu wire has been done to resolve the existing controversies. →Inductance spectroscopy has been used to evaluate the magnetic character. →The sample has been modeled as an equivalent electrical circuit. →A correlation between circuit parameters and GMI has been achieved.

  7. Approximate circuits for increased reliability

    Science.gov (United States)

    Hamlet, Jason R.; Mayo, Jackson R.

    2015-08-18

    Embodiments of the invention describe a Boolean circuit having a voter circuit and a plurality of approximate circuits each based, at least in part, on a reference circuit. The approximate circuits are each to generate one or more output signals based on values of received input signals. The voter circuit is to receive the one or more output signals generated by each of the approximate circuits, and is to output one or more signals corresponding to a majority value of the received signals. At least some of the approximate circuits are to generate an output value different than the reference circuit for one or more input signal values; however, for each possible input signal value, the majority values of the one or more output signals generated by the approximate circuits and received by the voter circuit correspond to output signal result values of the reference circuit.

  8. Sensor readout detector circuit

    Science.gov (United States)

    Chu, D.D.; Thelen, D.C. Jr.

    1998-08-11

    A sensor readout detector circuit is disclosed that is capable of detecting sensor signals down to a few nanoamperes or less in a high (microampere) background noise level. The circuit operates at a very low standby power level and is triggerable by a sensor event signal that is above a predetermined threshold level. A plurality of sensor readout detector circuits can be formed on a substrate as an integrated circuit (IC). These circuits can operate to process data from an array of sensors in parallel, with only data from active sensors being processed for digitization and analysis. This allows the IC to operate at a low power level with a high data throughput for the active sensors. The circuit may be used with many different types of sensors, including photodetectors, capacitance sensors, chemically-sensitive sensors or combinations thereof to provide a capability for recording transient events or for recording data for a predetermined period of time following an event trigger. The sensor readout detector circuit has applications for portable or satellite-based sensor systems. 6 figs.

  9. Wire Rupture Optimization in Wire Electrical Discharge Machining using Taguchi Approach

    Directory of Open Access Journals (Sweden)

    Maher Ibrahem

    2017-01-01

    Full Text Available Wire electrical discharge machining (WEDM is one of the most important nontraditional machining process that is well-known for cutting difficult to machine materials. The wire electrode along with machining parameters control the WEDM process. This research work focuses on optimizing WEDM parameters using Taguchi technique to minimize wire rupture. Experiments have been done using the L18 orthogonal array. Each experiment is repeated three times to ensure accurate readings of the wire rupture. The statistical methods of signal to noise ratio (S/N ratio is applied to study effects of peak current, pulse width, charging time, wire speed, and wire tension on wire rupture. As a results, the peak current, pulse width, and wire tension have the most significant effect on wire rupture followed by charging time and wire speed. The developed analysis can be used in the metal cutting field to identify the optimum machining parameters for less wire rupture.

  10. Optoelectronics circuits manual

    CERN Document Server

    Marston, R M

    2013-01-01

    Optoelectronics Circuits Manual covers the basic principles and characteristics of the best known types of optoelectronic devices, as well as the practical applications of many of these optoelectronic devices. The book describes LED display circuits and LED dot- and bar-graph circuits and discusses the applications of seven-segment displays, light-sensitive devices, optocouplers, and a variety of brightness control techniques. The text also tackles infrared light-beam alarms and multichannel remote control systems. The book provides practical user information and circuitry and illustrations.

  11. Modern TTL circuits manual

    CERN Document Server

    Marston, R M

    2013-01-01

    Modern TTL Circuits Manual provides an introduction to the basic principles of Transistor-Transistor Logic (TTL). This book outlines the major features of the 74 series of integrated circuits (ICs) and introduces the various sub-groups of the TTL family.Organized into seven chapters, this book begins with an overview of the basics of digital ICs. This text then examines the symbology and mathematics of digital logic. Other chapters consider a variety of topics, including waveform generator circuitry, clocked flip-flop and counter circuits, special counter/dividers, registers, data latches, com

  12. Troubleshooting analog circuits

    CERN Document Server

    Pease, Robert A

    1991-01-01

    Troubleshooting Analog Circuits is a guidebook for solving product or process related problems in analog circuits. The book also provides advice in selecting equipment, preventing problems, and general tips. The coverage of the book includes the philosophy of troubleshooting; the modes of failure of various components; and preventive measures. The text also deals with the active components of analog circuits, including diodes and rectifiers, optically coupled devices, solar cells, and batteries. The book will be of great use to both students and practitioners of electronics engineering. Other

  13. Circuit analysis with Multisim

    CERN Document Server

    Baez-Lopez, David

    2011-01-01

    This book is concerned with circuit simulation using National Instruments Multisim. It focuses on the use and comprehension of the working techniques for electrical and electronic circuit simulation. The first chapters are devoted to basic circuit analysis.It starts by describing in detail how to perform a DC analysis using only resistors and independent and controlled sources. Then, it introduces capacitors and inductors to make a transient analysis. In the case of transient analysis, it is possible to have an initial condition either in the capacitor voltage or in the inductor current, or bo

  14. Gallium Arsenide Domino Circuit

    Science.gov (United States)

    Yang, Long; Long, Stephen I.

    1990-01-01

    Advantages include reduced power and high speed. Experimental gallium arsenide field-effect-transistor (FET) domino circuit replicated in large numbers for use in dynamic-logic systems. Name of circuit denotes mode of operation, which logic signals propagate from each stage to next when successive stages operated at slightly staggered clock cycles, in manner reminiscent of dominoes falling in a row. Building block of domino circuit includes input, inverter, and level-shifting substages. Combinational logic executed in input substage. During low half of clock cycle, result of logic operation transmitted to following stage.

  15. 'Speedy' superconducting circuits

    International Nuclear Information System (INIS)

    Holst, T.

    1994-01-01

    The most promising concept for realizing ultra-fast superconducting digital circuits is the Rapid Single Flux Quantum (RSFQ) logic. The basic physical principle behind RSFQ logic, which include the storage and transfer of individual magnetic flux quanta in Superconducting Quantum Interference Devices (SQUIDs), is explained. A Set-Reset flip-flop is used as an example of the implementation of an RSFQ based circuit. Finally, the outlook for high-temperature superconducting materials in connection with RSFQ circuits is discussed in some details. (au)

  16. Optical Multiplexer Board 6U Prototype

    CERN Document Server

    Valero, A; Castillo, V; Cuenca, C; Ferrer, A; Fullana, E; González, V; Higón, E; Poveda, J; Ruiz-Martinez, A; Saez, M; Salvachúa, B; Sanchis, E; Solans, C; Torres, J; Valls, J A

    2007-01-01

    This paper describes the technical specifications of the Optical Multiplexer Board (OMB) 6U prototype. First, the hardware characteristics of this board are detailed as well as a description of the circuits and the components used. Firmware developed to achieve the desired functionality is also described. The tests conducted with the OMB in the TileCal ROD production tasks are also explained. Finally, a preliminary description of the final Optical Multiplexer Board 9U design is included. This design which is currently going on has to work in the ATLAS final experiment at CERN. General specifications at hardware and firmware levels are detailed pointing out especially the differences between the first prototype already tested and the final version.

  17. Radiation-Hard SpaceWire/Gigabit Ethernet-Compatible Transponder

    Science.gov (United States)

    Katzman, Vladimir

    2012-01-01

    A radiation-hard transponder was developed utilizing submicron/nanotechnology from IBM. The device consumes low power and has a low fabrication cost. This device utilizes a Plug-and-Play concept, and can be integrated into intra-satellite networks, supporting SpaceWire and Gigabit Ethernet I/O. A space-qualified, 100-pin package also was developed, allowing space-qualified (class K) transponders to be delivered within a six-month time frame. The novel, optical, radiation-tolerant transponder was implemented as a standalone board, containing the transponder ASIC (application specific integrated circuit) and optical module, with an FPGA (field-programmable gate array) friendly parallel interface. It features improved radiation tolerance; high-data-rate, low-power consumption; and advanced functionality. The transponder utilizes a patented current mode logic library of radiation-hardened-by-architecture cells. The transponder was developed, fabricated, and radhard tested up to 1 MRad. It was fabricated using 90-nm CMOS (complementary metal oxide semiconductor) 9 SF process from IBM, and incorporates full BIT circuitry, allowing a loop back test. The low-speed parallel LVCMOS (lowvoltage complementary metal oxide semiconductor) bus is compatible with Actel FPGA. The output LVDS (low-voltage differential signaling) interface operates up to 1.5 Gb/s. Built-in CDR (clock-data recovery) circuitry provides robust synchronization and incorporates two alarm signals such as synch loss and signal loss. The ultra-linear peak detector scheme allows on-line control of the amplitude of the input signal. Power consumption is less than 300 mW. The developed transponder with a 1.25 Gb/s serial data rate incorporates a 10-to-1 serializer with an internal clock multiplication unit and a 10-1 deserializer with internal clock and data recovery block, which can operate with 8B10B encoded signals. Three loop-back test modes are provided to facilitate the built-in-test functionality. The

  18. Inductive method to measure very small joint resistances of superconducting wires

    CERN Document Server

    Herzog, R

    1998-01-01

    In the Large Hadron Collider (LHC), which is currently being developed at CERN, about 50,000 connections of superconducting wire will be necessary to implement all circuits for powering 6000 corrector magnets with a maximum current of 600 A. To minimise the generation of ohmic heat in the cryogenic system, it is necessary to reduce the contact resistance of these connections as much as possible. This paper describes a method to measure contact resistances of splices of superconducting wires, which has been used to optimise such connections. Additionally we present results of a number of measurements on different types of connections. (2 refs).

  19. Enhancing wire-composite bond strength of bonded retainers with wire surface treatment.

    Science.gov (United States)

    Oesterle, L J; Shellhart, W C; Henderson, S

    2001-06-01

    Bonded orthodontic retainers with wires embedded in composite resin are commonly used for orthodontic retention. The purpose of this study was to test, in vitro, various wire surface treatments to determine the optimal method of enhancing the wire-composite bond strength. Coaxial wires and stainless steel wires with different surface treatments were bonded to bovine enamel and then pulled along their long axes with an Instron universal testing machine. Wire surface treatments included placing a right-angle bend in the wire, microetching the wire, and treating the wire with adhesion promoters; combinations of treatments were also examined. The results demonstrated a 24-fold increase in the wire-composite bond strength of wire that was microetched (sandblasted), compared with that of untreated straight wire. The difference between the amount of force required to break the bond produced by microetching alone (246.1 +/- 46.0 MPa) and that required for the bonds produced by the retentive bend (87.8 +/- 16.3 MPa), the adhesion promoters (silane, 11.0 +/- 3.1 MPa; Metal Primer, 28.5 +/- 15.8 MPa), or for any combination of surface treatments, was statistically significant. Microetching a stainless steel wire produced a higher wire-composite bond strength than that obtained from a coaxial wire (113.5 +/- 27.5 MPa). The results of this study indicate that microetching or sandblasting a stainless steel wire significantly increases the strength of the wire-composite bond.

  20. Measurements of the effects of smoke on active circuits

    International Nuclear Information System (INIS)

    Tanaka, T.J.

    1998-01-01

    Smoke has long been recognized as the most common source of fire damage to electrical equipment; however, most failures have been analyzed after the fire was out and the smoke vented. The effects caused while the smoke is still in the air have not been explored. Such effects have implications for new digital equipment being installed in nuclear reactors. The US Nuclear Regulatory Commission is sponsoring work to determine the impact of smoke on digital instrumentation and control. As part of this program, Sandia National Laboratories has tested simple active circuits to determine how smoke affects them. These tests included the study of three possible failure modes on a functional board: (1) circuit bridging, (2) corrosion (metal loss), and (3) induction of stray capacitance. The performance of nine different circuits was measured continuously on bare and conformally coated boards during smoke exposures lasting 1 hour each and continued for 24 hours after the exposure started. The circuit that was most affected by smoke (100% change in measured values) was the one most sensitive to circuit bridging. Its high impedance (50 Mohm) was shorted during the exposure, but in some cases recovered after the smoke was vented. The other two failure modes, corrosion and induced stray capacitance, caused little change in the function of the circuits. The smoke permanently increased resistance of the circuit tested for corrosion, implying that the contacts were corroded. However, the change was very small (< 2%). The stray capacitance test circuit showed very little change after a smoke exposure in either the short or long term. The results of the tests suggest that conformal coatings and type of circuit are major considerations when designing digital circuitry to be used in critical control systems

  1. Measurements of the Effects of Smoke on Active Circuits

    International Nuclear Information System (INIS)

    Tanaka, T.J.

    1999-01-01

    Smoke has long been recognized as the most common source of fire damage to electrical equipment; however, most failures have been analyzed after the fire was out and the smoke vented. The effects caused while the smoke is still in the air have not been explored. Such effects have implications for new digital equipment being installed in nuclear reactors. The U.S. Nuclear Regulatory Commission is sponsoring work to determine the impact of smoke on digital instrumentation and control. As part of this program, Sandia National Laboratories has tested simple active circuits to determine how smoke affects them. These tests included the study of three possible failure modes on a functional board: (1) circuit bridging, (2) corrosion (metal loss), and (3) induction of stray capacitance. The performance of nine different circuits was measured continuously on bare and conformably coated boards during smoke exposures lasting 1 hour each and continued for 24 hours after the exposure started. The circuit that was most affected by smoke (100% change in measured values) was the one most sensitive to circuit bridging. Its high impedance (50 MOmega) was shorted during the exposure, but in some cases recovered after the smoke was vented. The other two failure modes, corrosion and induced stray capacitance, caused little change in the function of the circuits. The smoke permanently increased resistance of the circuit tested for corrosion, implying that the cent acts were corroded. However, the change was very small (< 2%). The stray-capacitance test circuit showed very little change after a smoke exposure in either the short or long term. The results of the tests suggest that conformal coatings and type of circuit are major considerations when designing digital circuitry to be used in critical control systems

  2. Space Time – Track Circuits with Trellis Code Modulation

    Directory of Open Access Journals (Sweden)

    Marius Enulescu

    2017-07-01

    Full Text Available The track circuits are very important equipments used in the railway transportation system. Today these are used to send vital information, to the running train, in the same time with the integrity checking of the rail. The actual track circuits have a small problem due to the use of the same transmission medium by the signals containing vital information and the return traction current, the running track rails. But this small problem can produce big disturbances in the train circulation, especially in the rush hours. To improve the data transmission to the train on-board equipment, the implementation of new track circuits using new communication technology were studied. This technology is used by the mobile and satellite communications and applies the principle of diversity encoding both time and space through the use of multiple transmission points of the track circuit signal for telegram which is sent to the train. Since this implementation does not satisfy the intended purpose, other modern communication principles such as 8PSK signals modulation and encoding using Trellis Coded Modulation were developed. This new track circuit aims to solve the problems which appeared in the current operation of track circuits and theoretically manages to transmit vital information to the train on board equipment without being affected by disturbances in electric traction transport systems.

  3. Basic study of HTS magnet using 2G wires for maglev train

    Energy Technology Data Exchange (ETDEWEB)

    Ogata, M., E-mail: ogata@rtri.or.j [Railway Technical Research Institute, 2-8-38, Hikari-cho, Kokubunji-shi, Tokyo 185-8540 (Japan); Miyazaki, Y.; Hasegawa, H.; Sasakawa, T.; Nagashima, K. [Railway Technical Research Institute, 2-8-38, Hikari-cho, Kokubunji-shi, Tokyo 185-8540 (Japan)

    2010-11-01

    There are several advantages by applying a high-temperature superconducting wire to an on-board superconducting magnet for the maglev train. At first, an increase of thermal capacity of superconducting coils contributes a stability of the superconducting state of the coils. In addition, a reliability of superconducting magnet improves by simplification of the magnet structure. And the weight of the superconducting magnet and the energy consumption of the on-board cryocooler will decrease. Therefore, we examined the possibility on application of the 2G wire with a high critical current density in a high magnetic field. We performed numerical analysis regarding the weight of a superconducting magnet and the energy consumption of an on-board cryocooler in consideration of the characteristics of the 2G wire. Furthermore, we have carried out the I{sub c} measurement for the commercial 2G wires under various experimental conditions such as temperature, magnetic field strength and angle. We also performed the trial manufacture and evaluation of I{sub c} characteristics for the small race track-shaped superconducting coil.

  4. Preliminary study of HTS magnet using 2G wires for maglev train

    Energy Technology Data Exchange (ETDEWEB)

    Ogata, Masafumi; Miyazaki, Yoshiki; Hasegawa, Hitoshi; Sasakawa, Takashi; Nagashima, Ken, E-mail: ogata@rtri.or.j [Railway Technical Research Institute, Hikari-cho 2-8-38, Kokubunji-shi, Tokyo (Japan)

    2010-06-01

    There are several advantages by applying a high temperature superconducting wire to an on-board superconducting magnet for the maglev train. At first, an increase of thermal capacity of superconducting coils contributes a stability of the superconducting state of the coils. In addition, a reliability of superconducting magnet improves by simplification of the magnet structure. And the weight of the superconducting magnet and the energy consumption of the on-board cryocooler will decrease. Therefore, we examined the possibility on application of the 2G wire with a high critical current density in a high magnetic field. We performed numerical analysis regarding the weight of a superconducting magnet and the energy consumption of an on-board cryocooler in consideration of the characteristics of the 2G wire. Furthermore, we have carried out the I{sub c} measurement for the commercial 2G wires under various experimental conditions such as temperature, magnetic field strength and angle. We also performed the trial manufacture and evaluation of I{sub c} characteristics for the small race track-shaped superconducting coil.

  5. Basic study of HTS magnet using 2G wires for maglev train

    Science.gov (United States)

    Ogata, M.; Miyazaki, Y.; Hasegawa, H.; Sasakawa, T.; Nagashima, K.

    2010-11-01

    There are several advantages by applying a high-temperature superconducting wire to an on-board superconducting magnet for the maglev train. At first, an increase of thermal capacity of superconducting coils contributes a stability of the superconducting state of the coils. In addition, a reliability of superconducting magnet improves by simplification of the magnet structure. And the weight of the superconducting magnet and the energy consumption of the on-board cryocooler will decrease. Therefore, we examined the possibility on application of the 2G wire with a high critical current density in a high magnetic field. We performed numerical analysis regarding the weight of a superconducting magnet and the energy consumption of an on-board cryocooler in consideration of the characteristics of the 2G wire. Furthermore, we have carried out the Ic measurement for the commercial 2G wires under various experimental conditions such as temperature, magnetic field strength and angle. We also performed the trial manufacture and evaluation of Ic characteristics for the small race track-shaped superconducting coil.

  6. Preliminary study of HTS magnet using 2G wires for maglev train

    Science.gov (United States)

    Ogata, Masafumi; Miyazaki, Yoshiki; Hasegawa, Hitoshi; Sasakawa, Takashi; Nagashima, Ken

    2010-06-01

    There are several advantages by applying a high temperature superconducting wire to an on-board superconducting magnet for the maglev train. At first, an increase of thermal capacity of superconducting coils contributes a stability of the superconducting state of the coils. In addition, a reliability of superconducting magnet improves by simplification of the magnet structure. And the weight of the superconducting magnet and the energy consumption of the on-board cryocooler will decrease. Therefore, we examined the possibility on application of the 2G wire with a high critical current density in a high magnetic field. We performed numerical analysis regarding the weight of a superconducting magnet and the energy consumption of an on-board cryocooler in consideration of the characteristics of the 2G wire. Furthermore, we have carried out the Ic measurement for the commercial 2G wires under various experimental conditions such as temperature, magnetic field strength and angle. We also performed the trial manufacture and evaluation of Ic characteristics for the small race track-shaped superconducting coil.

  7. Preliminary study of HTS magnet using 2G wires for maglev train

    International Nuclear Information System (INIS)

    Ogata, Masafumi; Miyazaki, Yoshiki; Hasegawa, Hitoshi; Sasakawa, Takashi; Nagashima, Ken

    2010-01-01

    There are several advantages by applying a high temperature superconducting wire to an on-board superconducting magnet for the maglev train. At first, an increase of thermal capacity of superconducting coils contributes a stability of the superconducting state of the coils. In addition, a reliability of superconducting magnet improves by simplification of the magnet structure. And the weight of the superconducting magnet and the energy consumption of the on-board cryocooler will decrease. Therefore, we examined the possibility on application of the 2G wire with a high critical current density in a high magnetic field. We performed numerical analysis regarding the weight of a superconducting magnet and the energy consumption of an on-board cryocooler in consideration of the characteristics of the 2G wire. Furthermore, we have carried out the I c measurement for the commercial 2G wires under various experimental conditions such as temperature, magnetic field strength and angle. We also performed the trial manufacture and evaluation of I c characteristics for the small race track-shaped superconducting coil.

  8. The molecular mechanisms controlling morphogenesis and wiring of the habenula.

    Science.gov (United States)

    Schmidt, Ewoud R E; Pasterkamp, R Jeroen

    2017-11-01

    The habenula is an evolutionarily conserved brain region comprising bilaterally paired nuclei that plays a key role in processing reward information and mediating aversive responses to negative stimuli. An important aspect underlying habenula function is relaying information between forebrain and mid- and hindbrain areas. This is mediated by its complex organization into multiple subdomains and corresponding complexity in circuit organization. Additionally, in many species habenular nuclei display left-right differences at the anatomical and functional level. In order to ensure proper functional organization of habenular circuitry, sophisticated molecular programs control the morphogenesis and wiring of the habenula during development. Knowledge of how these mechanisms shape the habenula is crucial for obtaining a complete understanding of this brain region and can provide invaluable tools to study habenula evolution and function. In this review we will discuss how these molecular mechanisms pattern the early embryonic nervous system and control the formation of the habenula, how they shape its asymmetric organization, and how these mechanisms ensure proper wiring of the habenular circuit. Finally, we will address unexplored aspects of habenula development and how these may direct future research. Copyright © 2017 Elsevier Inc. All rights reserved.

  9. Departmental Appeals Board Decisions

    Data.gov (United States)

    U.S. Department of Health & Human Services — Decisions issued by the Chair and Board Members of the Departmental Appeals Board concerning determinations in discretionary, project grant programs, including...

  10. Pilot Boarding Areas

    Data.gov (United States)

    National Oceanic and Atmospheric Administration, Department of Commerce — Pilot boarding areas are locations at sea where pilots familiar with local waters board incoming vessels to navigate their passage to a destination port. Pilotage is...

  11. Experimental industrial signal acquisition board in a large scientific device

    Science.gov (United States)

    Zeng, Xiangzhen; Ren, Bin

    2018-02-01

    In order to measure the industrial signal of neutrino experiment, a set of general-purpose industrial data acquisition board has been designed. It includes the function of switch signal input and output, and the function of analog signal input. The main components are signal isolation amplifier and filter circuit, ADC circuit, microcomputer systems and isolated communication interface circuit. Through the practical experiments, it shows that the system is flexible, reliable, convenient and economical, and the system has characters of high definition and strong anti-interference ability. Thus, the system fully meets the design requirements.

  12. Detection of transient disturbing signals on PC boards

    Directory of Open Access Journals (Sweden)

    S. Korte

    2008-05-01

    Full Text Available This paper shows a possibility to visualize signal propagation in electronic circuits. Instead of using various galvanic measurement points all over the circuit, a test method is shown which measures the radiated field of the printed circuit board. By use of a 2-dimensional positionable field probe it is possible to get an overview over the signals running on the different parts of the PCB. In order to measure transient disturbing signals and distinguish them from normal device operation, problems of probe design and triggering need to be discussed.

  13. Put Your Cable Wiring to the Test.

    Science.gov (United States)

    Day, C. William

    2001-01-01

    Discusses why schools and universities should use testing procedures in any wire bid specification for cable wiring and also know how experienced the installers are in testing and installing structured cabling systems. Key cabling terms are included. (GR)

  14. Power supply conditioning circuit

    Science.gov (United States)

    Primas, Lori E. (Inventor); Loveland, Rohan C. (Inventor)

    1988-01-01

    A conditioning circuit is provided with a constant current diode in series with a zener diode, the former having a high dynamic impedance and the latter a low dynamic impedance. The constant current diode can receive an input voltage with PARD. In conjunction with the zener diode fixed to a ground, a voltage divider is provided which can give an output voltage whose PARD was significantly reduced. The conditioning circuit is effective down to dc.

  15. Optoelectronic circuits in nanometer CMOS technology

    CERN Document Server

    Atef, Mohamed

    2016-01-01

    This book describes the newest implementations of integrated photodiodes fabricated in nanometer standard CMOS technologies. It also includes the required fundamentals, the state-of-the-art, and the design of high-performance laser drivers, transimpedance amplifiers, equalizers, and limiting amplifiers fabricated in nanometer CMOS technologies. This book shows the newest results for the performance of integrated optical receivers, laser drivers, modulator drivers and optical sensors in nanometer standard CMOS technologies. Nanometer CMOS technologies rapidly advanced, enabling the implementation of integrated optical receivers for high data rates of several Giga-bits per second and of high-pixel count optical imagers and sensors. In particular, low cost silicon CMOS optoelectronic integrated circuits became very attractive because they can be extensively applied to short-distance optical communications, such as local area network, chip-to-chip and board-to-board interconnects as well as to imaging and medical...

  16. Project Circuits in a Basic Electric Circuits Course

    Science.gov (United States)

    Becker, James P.; Plumb, Carolyn; Revia, Richard A.

    2014-01-01

    The use of project circuits (a photoplethysmograph circuit and a simple audio amplifier), introduced in a sophomore-level electric circuits course utilizing active learning and inquiry-based methods, is described. The development of the project circuits was initiated to promote enhanced engagement and deeper understanding of course content among…

  17. Novel Wiring Technologies for Aerospace Applications

    Science.gov (United States)

    Gibson, Tracy L.; Parrish, Lewis M.

    2014-01-01

    Because wire failure in aerospace vehicles could be catastrophic, smart wiring capabilities have been critical for NASA. Through the years, researchers at Kennedy Space Center (KSC) have developed technologies, expertise, and research facilities to meet this need. In addition to aerospace applications, NASA has applied its knowledge of smart wiring, including self-healing materials, to serve the aviation industry. This webinar will discuss the development efforts of several wiring technologies at KSC and provide insight into both current and future research objectives.

  18. Clinical bending of nickel titanium wires

    OpenAIRE

    Stephen Chain; Priyank Seth; Namrata Rastogi; Kenneth Tan; Mayank Gupta; Richa Singh

    2015-01-01

    Since the evolution and the involvement of Nickel Titanium wires in the field of Orthodontics. The treatment plan has evolved with the use of low force Nickel Titanium wires. Because of their high springback, low stiffness, they are the key initial wires in leveling and alignment but have poor formability. Since poor formability limits its ability to create variable arch forms thus; limits the form of treatment. We have devised a method to bend the Nickel Titanium wires to help in our invento...

  19. Towards Unconventional Applications of Wire Bonding

    OpenAIRE

    Schröder, Stephan

    2018-01-01

    This thesis presents novel heterogeneous integration approaches of wire materials to fabricated and package MEMS devices by exploring unconventional applications of wire bonding technology. Wire bonding, traditionally endemic in the realm of device packaging to establish electrical die-to-package interconnections, is an attractive back-end technology, offering promising features, such as high throughput, flexibility and placement accuracy. Exploiting the advantages of state-of-the-art wire bo...

  20. Different mechanical properties in Seldinger guide wires

    Directory of Open Access Journals (Sweden)

    Wolfram Schummer

    2015-01-01

    Full Text Available Background and Aims: Most central venous catheters are placed using Seldinger guide wires. EN ISO 11070 is the guideline for testing guide wire flexing performance and tensile strength, and we can safely assume that guide wires in use meet these requirements. Unfortunately, EN ISO 11070 guidelines do not reflect the clinical requirements and we continue to see mechanical failures and their associated complications. Material and Methods: This in vitro study was performed in an accredited laboratory. With regard to flexing, we: (1 Established the minimum flexing performance needed to meet clinical requirements, (2 developed flexing performance tests which mimic clinical requirement, and (3 evaluated the mechanical properties of various guide wires relative to these requirements. With regard to tensile strength, we used the testing method prescribed in ISO 11070, but did not end the test at 5 Newton (N. We continued until the guide wire was damaged, or we reached maximum tractive force. We then did a wire-to-wire comparison. We examined two basic wire constructions, monofil and core and coil. Results: Tensile strength: All wires tested, except one, met EN ISO 11070 requirements for 5 N tensile strength. The mean of the wire types tested ranged from 15.06 N to 257.76 N. Flexing performance: None of the wires kinked. The monofil had no evidence of bending. Two core/coil wires displayed minor bending (angle 1.5°. All other wires displayed bending angles between 22.5° and 43.0°. Conclusion: We recommend that: (1 Clinicians use guide wires with high-end mechanical properties, (2 EN ISO 11070 incorporate our flexing test into their testing method, raise the flexing requirement to kink-proof, (3 and raise the tensile strength requirement to a minimum of 30 N, and (3 all manufacturers and suppliers be required to display mechanical properties of all guide wire, and guide wire kits sold.

  1. Vocational Preparation Curriculum: Electrical Wiring.

    Science.gov (United States)

    Usoro, Hogan

    This document is a curriculum guide for instructors teaching vocational preparation for electrical wiring to special needs students. The purpose of the curriculum guide is to provide minimum skills for disadvantaged and handicapped students entering the mainstream; to supplement vocational skills of those students already in a regular training…

  2. Transparency in nanophotonic quantum wires

    International Nuclear Information System (INIS)

    Singh, Mahi R

    2009-01-01

    We have studied the quantum optics of a photonic quantum nanowire doped with an ensemble of three-level nanoparticles. The wire is made from two photonic crystals A and B. Crystal A is embedded within crystal B and acts as a photonic nanowire. It is considered that the conduction band of crystal A lies below that of crystal B. As a result, photons are confined in crystal A and are reflected from crystal B. The bound states of the confined photons are calculated using the transfer matrix method. It is found that the number of bound states in the wire depends on the size of the wire and the energy difference between the conduction band extrema of crystals A and B. The absorption coefficient of the system has also been calculated using the Schroedinger equation method. It is considered that the nanoparticles interact with the photonic bound states. Numerical simulations show that when one of the resonance energies lies near the bound state, the system becomes transparent. However, when the resonance energy lies away from the bound state the crystal reverts to an absorbing state. Similarly, when the radius of the dielectric spheres is changed the location of the transparency peak is shifted. This means that the present system can be switched between two states by changing the size of the wire and the transition energy. These findings can be used to make new types of optical devices.

  3. Health care's 100 most wired.

    Science.gov (United States)

    Solovy, A; Serb, C

    1999-02-01

    They're wired all right, and America's 100 most techno-savvy hospitals and health systems share one more thing: a commitment to using technology to link with employees, patients, suppliers, and insurers. "We want to be a health care travel agency for our community," says one chief information officer. "And we see Internet technology as a key."

  4. Scrum Board Game

    Science.gov (United States)

    van den Oord, Stefan; van de Goor, Wim

    The Scrum Board Game is a workshop for beginners. It is for people with any role (customer, developer, tester, etc.), who don’t exactly know what a Scrum Board is, or how to create one themselves. The workshop teaches the benefits of a Scrum Board, how to use it, and how to introduce it in projects.

  5. DNA G-Wire Formation Using an Artificial Peptide is Controlled by Protease Activity.

    Science.gov (United States)

    Usui, Kenji; Okada, Arisa; Sakashita, Shungo; Shimooka, Masayuki; Tsuruoka, Takaaki; Nakano, Shu-Ichi; Miyoshi, Daisuke; Mashima, Tsukasa; Katahira, Masato; Hamada, Yoshio

    2017-11-16

    The development of a switching system for guanine nanowire (G-wire) formation by external signals is important for nanobiotechnological applications. Here, we demonstrate a DNA nanostructural switch (G-wire particles) using a designed peptide and a protease. The peptide consists of a PNA sequence for inducing DNA to form DNA-PNA hybrid G-quadruplex structures, and a protease substrate sequence acting as a switching module that is dependent on the activity of a particular protease. Micro-scale analyses via TEM and AFM showed that G-rich DNA alone forms G-wires in the presence of Ca 2+ , and that the peptide disrupted this formation, resulting in the formation of particles. The addition of the protease and digestion of the peptide regenerated the G-wires. Macro-scale analyses by DLS, zeta potential, CD, and gel filtration were in agreement with the microscopic observations. These results imply that the secondary structure change (DNA G-quadruplex DNA/PNA hybrid structure) induces a change in the well-formed nanostructure (G-wire particles). Our findings demonstrate a control system for forming DNA G-wire structures dependent on protease activity using designed peptides. Such systems hold promise for regulating the formation of nanowire for various applications, including electronic circuits for use in nanobiotechnologies.

  6. Explosion symmetry improvement of polyimide-coated tungsten wire in vacuum on negative discharge facility

    Science.gov (United States)

    Li, Mo; Wu, Jian; Lu, Yihan; Li, Xingwen; Li, Yang; Qiu, Mengtong

    2018-01-01

    Tungsten wire explosion is very asymmetric when fast current rate and insulated coatings are both applied on negative discharge facility using a 24-mm-diameter cathode geometry, which is commonly used on mega-ampere facilities. It is inferred, based on an analytical treatment of the guiding center drift and COMSOL simulations, that the large negative radial electric field causes early voltage breakdown and terminates energy deposition into the wire core on the anode side of the wire. After the anode side is short circuited, the radial electric field along the wire surface on the cathode side will change its polarity and thus leading to additional energy deposition into the wire core. This change causes ˜10 times larger energy deposition and ˜14 times faster explosion velocity in the cathode side than the anode side. In order to reduce this asymmetry, a hollow cylindrical cathode geometry was used to reverse the polarity of radial electric field and was optimized to use on multi-MA facilities. In this case, fully vaporized polyimide-coated tungsten wire with great symmetry improvement was achieved with energy deposition of ˜8.8 eV/atom. The atomic and electronic density distributions for the two different load geometries were obtained by the double-wavelength measurement.

  7. Multi-anode wire straw tube tracker

    International Nuclear Information System (INIS)

    Oh, S.H.; Ebenstein, W.L.; Wang, C.W.

    2011-01-01

    We report on a test of a straw tube detector design having several anode (sense) wires inside a straw tube. The anode wires form a circle inside the tube and are read out independently. This design could solve several shortcomings of the traditional single wire straw tube design such as double hit capability and stereo configuration.

  8. Home and School Technology: Wired versus Wireless.

    Science.gov (United States)

    Van Horn, Royal

    2001-01-01

    Presents results of informal research on smart homes and appliances, structured home wiring, whole-house audio/video distribution, hybrid cable, and wireless networks. Computer network wiring is tricky to install unless all-in-one jacketed cable is used. Wireless phones help installers avoid pre-wiring problems in homes and schools. (MLH)

  9. On the preparation of superconducting wires

    International Nuclear Information System (INIS)

    Topare, R.J.; Chinchure, A.D.; Shah, S.S.; Hadole, G.B.

    1993-01-01

    The different methods of preparation of superconducting wires have been discussed. The powder-in-tube technique is followed for the preparation of YBCO and BISCCO superconducting wires. The results are discussed. The present status of the industries in preparing the superconducting wires having the maximum J c values is discussed. (author). 30 refs., 6 figs., 2 tabs

  10. Pre-wired systems prove their worth.

    Science.gov (United States)

    2012-03-01

    The 'new generation' of modular wiring systems from Apex Wiring Solutions have been specified for two of the world's foremost teaching hospitals - the Royal London and St Bartholomew's Hospital, as part of a pounds sterling 1 billion redevelopment project, to cut electrical installation times, reduce on-site waste, and provide a pre-wired, factory-tested, power and lighting system. HEJ reports.

  11. 75 FR 4584 - Wire Decking From China

    Science.gov (United States)

    2010-01-28

    ... COMMISSION Wire Decking From China AGENCY: United States International Trade Commission. ACTION: Scheduling... retarded, by reason of subsidized and less-than-fair-value imports from China of wire decking, provided for..., producers, or exporters in China of wire decking, and that such ] products are being sold in the United...

  12. AUTOMATING THREE DIMENSIONAL (3D) MODEL CREATION OF CIRCUIT CARD ASSEMBLIES

    Science.gov (United States)

    2017-07-01

    If done correctly, both decals will now appear with the proper orientation, verifiable by the proper alignment of the through holes to decal...Figure 3 shows a properly aligned graphical decal of the solid board model. Figure 3 Printed wiring board with decal Now that a model of the... interference between CCA components and features of other CCAs or parts, insufficient clearances with CCA enclosure, misaligned mounting holes

  13. Creating a Simple Electric Circuit with Children between the Ages of Five and Six

    Science.gov (United States)

    Kada, Vasiliki; Ravanis, Kostantinos

    2016-01-01

    This paper presents a study of how preschool-aged children go about creating and operating a simple electric circuit (wires, light bulb, and battery), and how they view the elements that comprise it, particularly how they view the role of the battery. The research involved 108 children aged between five and six, who were individually interviewed.…

  14. Board of Directors or Supervisory Board

    DEFF Research Database (Denmark)

    Werlauff, Erik

    2009-01-01

    The article analyses the legal consequences of the choice now available to Danish public limited companies, which can now opt for a two-tier management structure, in which the management board undertakes both the day-to-day and the overall management, while a supervisory board exercises control...... over the management board, including its appointment and dismissal. The article considers which companies a two-tier structure may be relevant for, and reviews the consequences for the composition, election and functioning of the company organs....

  15. Low power consumption mini rotary actuator with SMA wires

    Science.gov (United States)

    Manfredi, Luigi; Huan, Yu; Cuschieri, Alfred

    2017-11-01

    Shape memory alloys (SMAs) are smart materials widely used as actuators for their high power to weight ratio despite their well-known low energy efficiency and limited mechanical bandwidth. For robotic applications, SMAs exhibit limitations due to high power consumption and limited stroke, varying from 4% to 7% of the total length. Hysteresis, during the contraction and extension cycle, requires a complex control algorithm. On the positive side, the small size and low weight are eminently suited for the design of mini actuators for robotic platforms. This paper describes the design and construction of a light weight and low power consuming mini rotary actuator with on-board contact-less position and force sensors. The design is specifically intended to reduce (i) energy consumption, (ii) dimensions of the sensory system, and (iii) provide a simple control without any need for SMA characterisation. The torque produced is controlled by on-board force sensors. Experiments were performed to investigate the energy consumption and performance (step and sinusoidal angle profiles with a frequency varying from 0.5 to 10 Hz and maximal amplitude of {15}\\circ ). We describe a transient capacitor effect related to the SMA wires during the sinusoidal profile when the active SMA wire is powered and the antagonist one switched-off, resulting in a transient current time varying from 300 to 400 ms.

  16. Vibration Damping Circuit Card Assembly

    Science.gov (United States)

    Hunt, Ronald Allen (Inventor)

    2016-01-01

    A vibration damping circuit card assembly includes a populated circuit card having a mass M. A closed metal container is coupled to a surface of the populated circuit card at approximately a geometric center of the populated circuit card. Tungsten balls fill approximately 90% of the metal container with a collective mass of the tungsten balls being approximately (0.07) M.

  17. Elements configuration of the open lead test circuit

    Energy Technology Data Exchange (ETDEWEB)

    Fukuzaki, Yumi, E-mail: 14514@sr.kagawa-nct.ac.jp [Advanced course of Electronics, Information and Communication Engineering, National Institute of Technology, Kagawa College, 551 Koda, Mitoyo, Kagawa (Japan); Ono, Akira [Department of Communication Network Engineering, National Institute of Technology, Kagawa College, 551 Koda, Mitoyo, Kagawa (Japan)

    2016-07-06

    In the field of electronics, small electronic devices are widely utilized because they are easy to carry. The devices have various functions by user’s request. Therefore, the lead’s pitch or the ball’s pitch have been narrowed and high-density printed circuit board has been used in the devices. Use of the ICs which have narrow lead pitch makes normal connection difficult. When logic circuits in the devices are fabricated with the state-of-the-art technology, some faults have occurred more frequently. It can be divided into types of open faults and short faults. We have proposed a new test method using a test circuit in the past. This paper propose elements configuration of the test circuit.

  18. Safety circuit for detecting conducting liquid in a cell under surveillance

    International Nuclear Information System (INIS)

    Kazandjoglou, J.

    1984-01-01

    The present invention can be applied for the surveillance of gloveboxes for which it is imperious to detect any water leak as soon as it occurs accidently. The safety and detection circuit comprises a liquid detector which consists of two electrodes. Each electrode has two connector wires connected in an electronic circuit. This circuit includes a first MOSFET which is non-conducting when no liquid or no failure in its connections is present. This first transistor is connected to a second MOSFET, conducting when no liquid or no failure in its connections is present, delivers current to an alarm, signaling and monitoring relay of a cell under surveillance [fr

  19. Low latency asynchronous interface circuits

    Science.gov (United States)

    Sadowski, Greg

    2017-06-20

    In one form, a logic circuit includes an asynchronous logic circuit, a synchronous logic circuit, and an interface circuit coupled between the asynchronous logic circuit and the synchronous logic circuit. The asynchronous logic circuit has a plurality of asynchronous outputs for providing a corresponding plurality of asynchronous signals. The synchronous logic circuit has a plurality of synchronous inputs corresponding to the plurality of asynchronous outputs, a stretch input for receiving a stretch signal, and a clock output for providing a clock signal. The synchronous logic circuit provides the clock signal as a periodic signal but prolongs a predetermined state of the clock signal while the stretch signal is active. The asynchronous interface detects whether metastability could occur when latching any of the plurality of the asynchronous outputs of the asynchronous logic circuit using said clock signal, and activates the stretch signal while the metastability could occur.

  20. A deadtime reduction circuit for thermal neutron coincidence counters with Amptek preamplifiers

    International Nuclear Information System (INIS)

    Bourret, S.C.; Krick, M.S.

    1994-01-01

    We have developed a deadtime reduction circuit for thermal neutron coincidence counters using Amptek preamplifier/amplifier/discriminator circuits. The principle is to remove the overlap between the output pulses from the Amptek circuits by adding a derandomizer between the Amptek circuits and the shift-register coincidence electronics. We implemented the derandomizer as an Actel programmable logic array; the derandomizer board is small and can be mounted in the high-voltage junction box with the Amptek circuits, if desired. Up to 32 Amptek circuits can be used with one derandomizer. The derandomizer has seven outputs: four groups of eight inputs, two groups of 16 inputs, and one group of 32 inputs. We selected these groupings to facilitate detector ring-ratio measurements. The circuit was tested with the five-ring research multiplicity counter, which has five output signals-one for each ring. The counter's deadtime was reduced from 70 to 30 ns