Implementing Cleaner Printed Wiring Board Technologies: Surface Finishes

Science.gov (United States)

This document describes the problems, solutions, and time and effort involved in implementing alternative surface finish technologies, and this guide is produced as part of the DfE Printed Wiring Board Project

High-speed autoverifying technology for printed wiring boards

Science.gov (United States)

Ando, Moritoshi; Oka, Hiroshi; Okada, Hideo; Sakashita, Yorihiro; Shibutani, Nobumi

1996-10-01

We have developed an automated pattern verification technique. The output of an automated optical inspection system contains many false alarms. Verification is needed to distinguish between minor irregularities and serious defects. In the past, this verification was usually done manually, which led to unsatisfactory product quality. The goal of our new automated verification system is to detect pattern features on surface mount technology boards. In our system, we employ a new illumination method, which uses multiple colors and multiple direction illumination. Images are captured with a CCD camera. We have developed a new algorithm that uses CAD data for both pattern matching and pattern structure determination. This helps to search for patterns around a defect and to examine defect definition rules. These are processed with a high speed workstation and a hard-wired circuits. The system can verify a defect within 1.5 seconds. The verification system was tested in a factory. It verified 1,500 defective samples and detected all significant defects with only a 0.1 percent of error rate (false alarm).

DEVICES FOR COOLING ELECTRONIC CIRCUIT BOARDS

Directory of Open Access Journals (Sweden)

T. A. Ismailov

2014-01-01

Full Text Available In the work described structural variants of devices for cooling electronic circuit boards, made on the basis of thermoelectric batteries and consumable working substances, implementing uneven process of removing heat from heat-generating components. A comparison of temperature fields of electronic circuit simulator with his uniform and non-uniform cooling. 

Double-sided coaxial circuit QED with out-of-plane wiring

Science.gov (United States)

Rahamim, J.; Behrle, T.; Peterer, M. J.; Patterson, A.; Spring, P. A.; Tsunoda, T.; Manenti, R.; Tancredi, G.; Leek, P. J.

2017-05-01

Superconducting circuits are well established as a strong candidate platform for the development of quantum computing. In order to advance to a practically useful level, architectures are needed which combine arrays of many qubits with selective qubit control and readout, without compromising on coherence. Here, we present a coaxial circuit quantum electrodynamics architecture in which qubit and resonator are fabricated on opposing sides of a single chip, and control and readout wiring are provided by coaxial wiring running perpendicular to the chip plane. We present characterization measurements of a fabricated device in good agreement with simulated parameters and demonstrating energy relaxation and dephasing times of T1 = 4.1 μs and T2 = 5.7 μs, respectively. The architecture allows for scaling to large arrays of selectively controlled and measured qubits with the advantage of all wiring being out of the plane.

Inter-progenitor pool wiring: An evolutionarily conserved strategy that expands neural circuit diversity.

Science.gov (United States)

Suzuki, Takumi; Sato, Makoto

2017-11-15

Diversification of neuronal types is key to establishing functional variations in neural circuits. The first critical step to generate neuronal diversity is to organize the compartmental domains of developing brains into spatially distinct neural progenitor pools. Neural progenitors in each pool then generate a unique set of diverse neurons through specific spatiotemporal specification processes. In this review article, we focus on an additional mechanism, 'inter-progenitor pool wiring', that further expands the diversity of neural circuits. After diverse types of neurons are generated in one progenitor pool, a fraction of these neurons start migrating toward a remote brain region containing neurons that originate from another progenitor pool. Finally, neurons of different origins are intermingled and eventually form complex but precise neural circuits. The developing cerebral cortex of mammalian brains is one of the best examples of inter-progenitor pool wiring. However, Drosophila visual system development has revealed similar mechanisms in invertebrate brains, suggesting that inter-progenitor pool wiring is an evolutionarily conserved strategy that expands neural circuit diversity. Here, we will discuss how inter-progenitor pool wiring is accomplished in mammalian and fly brain systems. Copyright © 2017 Elsevier Inc. All rights reserved.

Recycling of WEEE: Characterization of spent printed circuit boards from mobile phones and computers

International Nuclear Information System (INIS)

Yamane, Luciana Harue; Tavares de Moraes, Viviane; Crocce Romano Espinosa, Denise; Soares Tenorio, Jorge Alberto

2011-01-01

Highlights: → This paper presents new and important data on characterization of wastes of electric and electronic equipments. → Copper concentration is increasing in mobile phones and remaining constant in personal computers. → Printed circuit boards from mobile phones and computers would not be mixed prior treatment. - Abstract: This paper presents a comparison between printed circuit boards from computers and mobile phones. Since printed circuits boards are becoming more complex and smaller, the amount of materials is constantly changing. The main objective of this work was to characterize spent printed circuit boards from computers and mobile phones applying mineral processing technique to separate the metal, ceramic, and polymer fractions. The processing was performed by comminution in a hammer mill, followed by particle size analysis, and by magnetic and electrostatic separation. Aqua regia leaching, loss-on-ignition and chemical analysis (inductively coupled plasma atomic emission spectroscopy - ICP-OES) were carried out to determine the composition of printed circuit boards and the metal rich fraction. The composition of the studied mobile phones printed circuit boards (PCB-MP) was 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers; and of the printed circuit boards from studied personal computers (PCB-PC) was 45 wt.% metals; 27 wt.% polymers and ceramics 28 wt.% ceramics. The chemical analysis showed that copper concentration in printed circuit boards from personal computers was 20 wt.% and in printed circuit boards from mobile phones was 34.5 wt.%. According to the characteristics of each type of printed circuit board, the recovery of precious metals may be the main goal of the recycling process of printed circuit boards from personal computers and the recovery of copper should be the main goal of the recycling process of printed circuit boards from mobile phones. Hence, these printed circuit boards would not be mixed prior treatment. The results

Printed Wiring Board Cleaner Technologies Substitutes Assessment: Making Holes Conductive

Science.gov (United States)

This document presents comparative risk, competitiveness, and resource requirements on technologies for performing the “making holes conductive” function during printed wiring board manufacturing.

46 CFR 169.680 - Installation of wiring for power and lighting circuits.

Science.gov (United States)

2010-10-01

... 46 Shipping 7 2010-10-01 2010-10-01 false Installation of wiring for power and lighting circuits... SCHOOLS SAILING SCHOOL VESSELS Machinery and Electrical Electrical Installations Operating at Potentials of 50 Volts Or More on Vessels of Less Than 100 Gross Tons § 169.680 Installation of wiring for power...

46 CFR 169.673 - Installation of wiring for power and lighting circuits.

Science.gov (United States)

2010-10-01

... 46 Shipping 7 2010-10-01 2010-10-01 false Installation of wiring for power and lighting circuits... SCHOOLS SAILING SCHOOL VESSELS Machinery and Electrical Electrical Installations Operating at Potentials of Less Than 50 Volts on Vessels of Less Than 100 Gross Tons § 169.673 Installation of wiring for...

Merging polygons on two-layer printed circuit board

Directory of Open Access Journals (Sweden)

Murov S. Yu.

2011-12-01

Full Text Available A method is proposed for solving the problem of connection of maximum number of isolated islands of metallized areas of the same chain, located on different layers of the printed circuit board. The method can be used in the automatic tracing of the boards.

Virtual Instrument Systems in Reality (VISIR) for Remote Wiring and Measurement of Electronic Circuits on Breadboard

Science.gov (United States)

Tawfik, M.; Sancristobal, E.; Martin, S.; Gil, R.; Diaz, G.; Colmenar, A.; Peire, J.; Castro, M.; Nilsson, K.; Zackrisson, J.; Hakansson, L.; Gustavsson, I.

2013-01-01

This paper reports on a state-of-the-art remote laboratory project called Virtual Instrument Systems in Reality (VISIR). VISIR allows wiring and measuring of electronic circuits remotely on a virtual workbench that replicates physical circuit breadboards. The wiring mechanism is developed by means of a relay switching matrix connected to a PCI…

Wiring Together Synthetic Bacterial Consortia to Create a Biological Integrated Circuit.

Science.gov (United States)

Perry, Nicolas; Nelson, Edward M; Timp, Gregory

2016-12-16

The promise of adapting biology to information processing will not be realized until engineered gene circuits, operating in different cell populations, can be wired together to express a predictable function. Here, elementary biological integrated circuits (BICs), consisting of two sets of transmitter and receiver gene circuit modules with embedded memory placed in separate cell populations, were meticulously assembled using live cell lithography and wired together by the mass transport of quorum-sensing (QS) signal molecules to form two isolated communication links (comlinks). The comlink dynamics were tested by broadcasting "clock" pulses of inducers into the networks and measuring the responses of functionally linked fluorescent reporters, and then modeled through simulations that realistically captured the protein production and molecular transport. These results show that the comlinks were isolated and each mimicked aspects of the synchronous, sequential networks used in digital computing. The observations about the flow conditions, derived from numerical simulations, and the biofilm architectures that foster or silence cell-to-cell communications have implications for everything from decontamination of drinking water to bacterial virulence.

AIR EMISSIONS FROM LASER DRILLING OF PRINTED WIRING BOARD MATERIALS

Science.gov (United States)

The paper gives results of a study to characterize gases generated during laser drilling of printed wiring board (PWB) material and identifies the pollutants and generation rates found during the drilling process. Typically found in the missions stream were trace amounts of carbo...

New technique for wiring SSC superconducting sextupole corrector coils

International Nuclear Information System (INIS)

Leon, B.

1985-01-01

There exists in the electronics industry, a technology for the manufacture of printed circuit (PC) boards which is directly transferable into the creation of highly controlled coils, such as the SSC sextupole superconducting corrector coils. This technology, which uses a process of laying down insulated wire in highly controlled patterns has heretofore been confined exclusively to the manufacture of high density printed circuit (PC) boards, possibly due to an ignorance of its utility in the field of precision winding of coils. This ability to fix wires in a well defined location can be used to produce precision wound coils in a very cost-effective manner. These coils may be superior in quality to conventionally made coils. Before describing what can be created with this technology, it is necessary to take a look at this coil winding process, the MULTIWIRE process, and the industry which has utilized this technology

Preparing printed circuit boards for rapid turn-around time on a protomat plotter

International Nuclear Information System (INIS)

Hawtree, J.

1998-01-01

This document describes the use of the LPKF ProtoMat mill/drill unit circuit board Plotter, with the associated CAD/CAM software BoardMaster and CircuitCAM. At present its primarily use here at Fermilab's Particle Physics Department is for rapid-turnover of prototype PCBs double-sided and single-sided copper clad printed circuit boards (PCBs). (The plotter is also capable of producing gravure films and engraving aluminum or plastic although we have not used it for this.) It has the capability of making traces 0.004 inch wide with 0.004 inch spacings which is appropriate for high density surface mount circuits as well as other through-mounted discrete and integrated components. One of the primary benefits of the plotter is the capability to produce double-sided drilled boards from CAD files in a few hours. However to achieve this rapid turn-around time, some care must be taken in preparing the files. This document describes how to optimize the process of PCB fabrication. With proper preparation, researchers can often have a completed circuit board in a day's time instead of a week or two wait with usual procedures. It is assumed that the software and hardware are properly installed and that the machinist is acquainted with the Win95 operating system and the basics of the associated software. This paper does not describe its use with pen plotters, lasers or rubouts. The process of creating a PCB (printed circuit board) begins with the CAD (computer-aided design) software, usually PCAD or VeriBest. These files are then moved to CAM (computer-aided machining) where they are edited and converted to put them into the proper format for running on the ProtoMat plotter. The plotter then performs the actual machining of the board. This document concentrates on the LPKF programs CircuitCam BASIS and BoardMaster for the CAM software. These programs run on a Windows 95 platform to run an LPKF ProtoMat 93s plotter

CAD-CAM printed circuit board design

Science.gov (United States)

Agy, W. E.

A step-by-step procedure for a printed circuit design achieved by CAD is presented. The operator at the interactive CRT station moves a stylus across a graphics tablet and intersperses commands which result in computer-generated pictorial forms on the screen that were drawn on the pad. Standard symbols are used for commands allowing, for instance, connections to be made of specific types in certain locations, which can be automatically edited from a materials list. An entire network of drawn lines can be referenced by a signal name for recall, and a finished circuit schematic can be checked for designs rules compliance, including fault reporting in terms of designator/pin number. A map may be present delineating the boundaries of the circuitry area, and previously completed circuitry segments can be recalled for piece-by-piece assembly of the circuit board.

Development and verification of printed circuit board toroidal transformer model

DEFF Research Database (Denmark)

Pejtersen, Jens; Mønster, Jakob Døllner; Knott, Arnold

2013-01-01

An analytical model of an air core printed circuit board embedded toroidal transformer configuration is presented. The transformer has been developed for galvanic isolation of very high frequency switch-mode dc-dc power converter applications. The theoretical model is developed and verified...... by comparing calculated parameters with 3D finite element simulations and experimental measurement results. The developed transformer model shows good agreement with the simulated and measured results. The model can be used to predict the parameters of printed circuit board toroidal transformer configurations...

A new technique for wiring SSC superconducting sextupole corrector coils

International Nuclear Information System (INIS)

Leon, B.

1985-01-01

There exists in the electronics industry, a technology for the manufacture of printed circuit (PC) boards which is directly transferable into the creation of highly controlled coils, such as the SSC sextupole superconducting corrector coils. This technology, which uses a process of laying down insulated wire in highly controlled patterns, has heretofore been confined excusively to the manufacture of high density printed circuit (PC) boards, possibly due to an ignorance of its utility in the field of precision winding of coils. This ability to fix wires in a well defined location can be used to produce precision wound coils in a very cost-effective manner. These coils may be superior in quality to conventionally made coils. Before describing what can be created with this technology, it is necessary to take a look at this coil winding process, the MULTIWIRE process, and the industry which has utilized this technology

Shivering and rewarming after cardiac surgery: comparison of ventilator circuits with humidifier and heated wires to heat and moisture exchangers.

Science.gov (United States)

McEvoy, M T; Carey, T J

1995-07-01

Detrimental physiologic effects of shivering in the cardiac surgery patient have been well documented. Rewarming techniques have been compared, with noted differences in the incidence of shivering. Ventilator circuits have not been examined independently from other rewarming variables. To compare heated wire humidification circuits with heat and moisture exchanger circuits on the incidence of shivering and speed and pattern of rewarming in mechanically ventilated patients. A prospective, descriptive, correlational study was done on 140 adult cardiac surgery patients in a university teaching medical center. All subjects underwent cardiac surgical procedures with hypothermic cardiopulmonary bypass. Subjects were randomized to humidified, heated wire circuits (n = 70) or heat and moisture exchanger circuits (n = 70). Heated water blankets were used on all patients. Mean intensive care unit admission temperature was 35.28 degrees C. No statistical differences were found in preoperative, demographic, or operative course data between treatment and control groups. Shivering was more common in the heat and moisture exchanger group than in the heated wire group. In our analysis, the only variable associated with shivering was the type of ventilator circuit. Patients using heated wire systems rewarmed more rapidly and had significantly higher temperatures than did patients using heat and moisture exchangers. These data suggest that use of heated wire humidified ventilator circuits with heated water blankets in adult cardiac surgery patients significantly reduces the incidence of shivering and results in a more rapid return to normothermia.

A study of liberation and separation process of metals from printed circuit boards (PCBs) scrap

International Nuclear Information System (INIS)

Noorliyana, H.A.; Zaheruddin, K.; Mohd Fazlul Bari; M. Sri Asliza; Nurhidayah, A.Z.; Kamarudin, H.

2009-01-01

Since the metallic elements are covered with or encapsulated by various plastic or ceramic materials on printed circuit boards, a mechanical pre-treatment process allowing their liberation and separation is first needed in order to facilitate their efficient extraction with hydrometallurgy route. Even though many studies have been performed on the mechanical pre-treatment processing for the liberation and separation of the metallic components of printed circuit boards scrap, further studies are required to pave the way for efficient recycling of waste printed circuit boards through a combination of mechanical pre-treatment and hydrometallurgical technology. In this work, a fundamental study has been carried out on the mechanical pre-treatment that is necessary to recover metallic concentrates from printed circuit boards scraps. The most important problem is to separate or release particles from the associated gangue minerals at the possible liberation particle size. The distribution of metallic elements has been also investigated in relation to the particle size of the milled printed circuit boards. The samples of printed circuit boards were separated into the magnetic and non-magnetic fractions by Rare-earth Roll Magnetic separator. Thereafter, the magnetic and non-magnetic fractions were separated to heavy fraction (metallic elements) and light fraction (plastic) by Mozley Laboratory Table Separator. The recovery ratios and the evaluation of the metallic concentrates recovered by each separation process were also investigated. This study is expected to provide useful data for the efficient mechanical separation of metallic components from printed circuit boards scraps. (author)

Detection of circuit-board components with an adaptive multiclass correlation filter

Science.gov (United States)

Diaz-Ramirez, Victor H.; Kober, Vitaly

2008-08-01

A new method for reliable detection of circuit-board components is proposed. The method is based on an adaptive multiclass composite correlation filter. The filter is designed with the help of an iterative algorithm using complex synthetic discriminant functions. The impulse response of the filter contains information needed to localize and classify geometrically distorted circuit-board components belonging to different classes. Computer simulation results obtained with the proposed method are provided and compared with those of known multiclass correlation based techniques in terms of performance criteria for recognition and classification of objects.

Modelling, analysis, and acceleration of a printed circuit board ...

Indian Academy of Sciences (India)

Springer Verlag Heidelberg #4 2048 1996 Dec 15 10:16:45

discuss lead time reduction in a qualitative way with illustrative case studies. Krishnan ... industry practices, and research questions that should drive new methods and computer ... There are three types of printed circuit boards available today.

RECYCLING OF PRINTED CIRCUIT BOARDS AIMING SILVER RECOVERY: A HYDROMETALLURGICAL ROUTE STUDY

Directory of Open Access Journals (Sweden)

Marcos Paulo Kohler Caldas

2015-06-01

Full Text Available The aim of this paper is characterize printed circuit board of computers and propose a hydrometallurgical route for silver recovery present in its composition. Initially, the printed circuit board was comminuted in both knife and hammer mills. The comminuted material was characterized by sieve analysis, chemical analysis by inductively coupled plasma optical emission spectrometry (ICP-OES and loss on ignition. Leaching tests were conducted in sulfuric acid, sulfuric acid in an oxidizing medium and nitric acid. The results indicated that the printed circuit board is mainly composed of copper (19.42%. Silver content of 0.045% was found. The route for silver recovery was leaching in sulfuric acid at 75°C for 18 hours. Then, leaching in sulfuric acid at 75°C in an oxidizing medium for 6 hours and nitric acid leaching at room temperature for 2 hours. Through of this route, 96.6% of silver was recovered.

A Circuit Board Using a Sheet of Thick Paper and Aluminium Tape

Science.gov (United States)

Kamata, Masahiro; Honda, Motoshi

2003-01-01

We have developed a circuit board using materials that are inexpensive and familiar to elementary school students. Most of the responses from students who made this board were relatively positive and we observed them enjoy making the boards at a Science Festival in Japan and in elementary school. As an application, we also developed a tiny torch…

A filter circuit board for the Earthworm Seismic Data Acquisition System

Science.gov (United States)

Jensen, Edward Gray

2000-01-01

The Earthworm system is a seismic network data acquisition and processing system used by the Northern California Seismic Network as well as many other seismic networks. The input to the system is comprised of many realtime electronic waveforms fed to a multi-channel digitizer on a PC platform. The digitizer consists of one or more National Instruments Corp. AMUX–64T multiplexer boards attached to an A/D converter board located in the computer. Originally, passive filters were installed on the multiplexers to eliminate electronic noise picked up in cabling. It was later discovered that a small amount of crosstalk occurred between successive channels in the digitizing sequence. Though small, this crosstalk will cause what appear to be small earthquake arrivals at the wrong time on some channels. This can result in erroneous calculation of earthquake arrival times, particularly by automated algorithms. To deal with this problem, an Earthworm filter board was developed to provide the needed filtering while eliminating crosstalk. This report describes the tests performed to find a suitable solution, and the design of the circuit board. Also included are all the details needed to build and install this board in an Earthworm system or any other system using the AMUX–64T board. Available below is the report in PDF format as well as an archive file containing the circuit board manufacturing information.

Integrated electric circuit CAD system in Minolta Camera Co. Ltd

Energy Technology Data Exchange (ETDEWEB)

Nakagami, Tsuyoshi; Hirata, Sumiaki; Matsumura, Fumihiko

1988-08-26

Development background, fundamental concept, details and future plan of the integrated electric circuit CAD system for OA equipment are presented. The central integrated database is basically intended to store experiences or know-hows, to cover the wide range of data required for designs, and to provide a friendly interface. This easy-to-use integrated database covers the drawing data, parts information, design standards, know-hows and system data. The system contains the circuit design function to support drawing circuit diagrams, the wiring design function to support the wiring and arrangement of printed circuit boards and various parts integratedly, and the function to verify designs, to make full use of parts or technical information, to maintain the system security. In the future, as the system will be wholly in operation, the design period reduction, quality improvement and cost saving will be attained by this integrated design system. (19 figs, 2 tabs)

Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor

Energy Technology Data Exchange (ETDEWEB)

Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Lin, Carol S.K. [School of Energy and Environment, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong Special Administrative Region (Hong Kong); McKay, Gordon, E-mail: kemckayg@ust.hk [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Division of Sustainable Development, College of Science, Engineering and Technology, Hamad bin Khalifa University, Doha (Qatar)

2015-01-15

Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced.

Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor

International Nuclear Information System (INIS)

Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S.K.; McKay, Gordon

2015-01-01

Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced

All-semiconductor metamaterial-based optical circuit board at the microscale

International Nuclear Information System (INIS)

Min, Li; Huang, Lirong

2015-01-01

The newly introduced metamaterial-based optical circuit, an analogue of electronic circuit, is becoming a forefront topic in the fields of electronics, optics, plasmonics, and metamaterials. However, metals, as the commonly used plasmonic elements in an optical circuit, suffer from large losses at the visible and infrared wavelengths. We propose here a low-loss, all-semiconductor metamaterial-based optical circuit board at the microscale by using interleaved intrinsic GaAs and doped GaAs, and present the detailed design process for various lumped optical circuit elements, including lumped optical inductors, optical capacitors, optical conductors, and optical insulators. By properly combining these optical circuit elements and arranging anisotropic optical connectors, we obtain a subwavelength optical filter, which can always hold band-stop filtering function for various polarization states of the incident electromagnetic wave. All-semiconductor optical circuits may provide a new opportunity in developing low-power and ultrafast components and devices for optical information processing

Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill

International Nuclear Information System (INIS)

Yoo, Jae-Min; Jeong, Jinki; Yoo, Kyoungkeun; Lee, Jae-chun; Kim, Wonbaek

2009-01-01

Printed circuit boards incorporated in most electrical and electronic equipment contain valuable metals such as Cu, Ni, Au, Ag, Pd, Fe, Sn, and Pb. In order to employ a hydrometallurgical route for the recycling of valuable metals from printed circuit boards, a mechanical pre-treatment step is needed. In this study, the metallic components from waste printed circuit boards have been enriched using a mechanical separation process. Waste printed circuit boards shredded to 5.0 mm. The fractions of milled printed circuit boards of size 5.0 mm fraction and the heavy fraction were subjected to two-step magnetic separation. Through the first magnetic separation at 700 Gauss, 83% of the nickel and iron, based on the whole printed circuit boards, was recovered in the magnetic fraction, and 92% of the copper was recovered in the non-magnetic fraction. The cumulative recovery of nickel-iron concentrate was increased by a second magnetic separation at 3000 Gauss, but the grade of the concentrate decreased remarkably from 76% to 56%. The cumulative recovery of copper concentrate decreased, but the grade increased slightly from 71.6% to 75.4%. This study has demonstrated the feasibility of the mechanical separation process consisting of milling/size classification/gravity separation/two-step magnetic separation for enriching metallic components such as Cu, Ni, Al, and Fe from waste printed circuit boards

Experimentally verified inductance extraction and parameter study for superconductive integrated circuit wires crossing ground plane holes

International Nuclear Information System (INIS)

Fourie, Coenrad J; Wetzstein, Olaf; Kunert, Juergen; Meyer, Hans-Georg; Toepfer, Hannes

2013-01-01

As the complexity of rapid single flux quantum (RSFQ) circuits increases, both current and power consumption of the circuits become important design criteria. Various new concepts such as inductive biasing for energy efficient RSFQ circuits and inductively coupled RSFQ cells for current recycling have been proposed to overcome increasingly severe design problems. Both of these techniques use ground plane holes to increase the inductance or coupling factor of superconducting integrated circuit wires. New design tools are consequently required to handle the new topographies. One important issue in such circuit design is the accurate calculation of networks of inductances even in the presence of finite holes in the ground plane. We show how a fast network extraction method using InductEx, which is a pre- and post-processor for the magnetoquasistatic field solver FastHenry, is used to calculate the inductances of a set of SQUIDs (superconducting quantum interference devices) with ground plane holes of different sizes. The results are compared to measurements of physical structures fabricated with the IPHT Jena 1 kA cm −2 RSFQ niobium process to verify accuracy. We then do a parameter study and derive empirical equations for fast and useful estimation of the inductance of wires surrounded by ground plane holes. We also investigate practical circuits and show excellent accuracy. (paper)

Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections

Science.gov (United States)

de la Broïse, Xavier; Le Coguie, Alain; Sauvageot, Jean-Luc; Pigot, Claude; Coppolani, Xavier; Moreau, Vincent; d'Hollosy, Samuel; Knarosovski, Timur; Engel, Andreas

2018-05-01

We have successively developed two superconducting flexible PCBs for cryogenic applications. The first one is monolayer, includes 552 tracks (10 µm wide, 20 µm spacing), and receives 24 wire-bonded integrated circuits. The second one is multilayer, with one track layer between two shielding layers interconnected by microvias, includes 37 tracks, and can be interconnected at both ends by wire bonding or by connectors. The first cold measurements have been performed and show good performances. The novelty of these products is, for the first one, the association of superconducting materials with very narrow pitch and bonded integrated circuits and, for the second one, the introduction of a superconducting multilayer structure interconnected by vias which is, to our knowledge, a world-first.

ELECTRONIC CIRCUIT BOARDS NON-UNIFORM COOLING SYSTEM MODEL

Directory of Open Access Journals (Sweden)

D. V. Yevdulov

2016-01-01

Full Text Available Abstract. The paper considers a mathematical model of non-uniform cooling of electronic circuit boards. The block diagram of the system implementing this approach, the method of calculation of the electronic board temperature field, as well as the principle of its thermal performance optimizing are presented. In the considered scheme the main heat elimination from electronic board is produced by the radiator system, and additional cooling of the most temperature-sensitive components is produced by thermoelectric batteries. Are given the two-dimensional temperature fields of the electronic board during its uniform and non-uniform cooling, is carried out their comparison. As follows from the calculations results, when using a uniform overall cooling of electronic unit there is a waste of energy for the cooling 0f electronic board parts which temperature is within acceptable temperature range without the cooling system. This approach leads to the increase in the cooling capacity of used thermoelectric batteries in comparison with the desired values. This largely reduces the efficiency of heat elimination system. The use for electronic boards cooling of non-uniform local heat elimination removes this disadvantage. The obtained dependences show that in this case, the energy required to create a given temperature is smaller than when using a common uniform cooling. In this approach the temperature field of the electronic board is more uniform and the cooling is more efficient. 

78 FR 23591 - Certain Prepregs, Laminates, and Finished Circuit Boards

Science.gov (United States)

2013-04-19

... INTERNATIONAL TRADE COMMISSION [Investigation No. 337-TA-659 (Enforcement)] Certain Prepregs... United States after importation of certain prepregs, laminates, and finished circuit boards that infringe... prepregs and laminates that are the subject of the investigation or that otherwise infringe, induce, and/or...

Printed circuit board permittivity measurement using waveguide and resonator rings

NARCIS (Netherlands)

Op 't Land, Sjoerd; Tereshchenko, O.V.; Ramdani, Mohamed; Leferink, Frank Bernardus Johannes; Perdriau, Richard

2014-01-01

Knowing the frequency dependent complex permittivity of Printed Circuit Board (PCB) substrates is important in modern electronics. In this paper, two methods for measuring the permittivity are applied to the same Flame Resistant (FR4) substrate and the results are compared. The reference measurement

An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards

Directory of Open Access Journals (Sweden)

Bruno de Castro Braz

Full Text Available Abstract Aerospace vehicles are mostly exposed to random vibration loads during its operational lifetime. These harsh conditions excites vibration responses in the vehicles printed circuit boards, what can cause failure on mission functionality due to fatigue damage of electronic components. A novel analytical model to evaluate the useful life of embedded electronic components (capacitors, chips, oscillators etc. mounted on Printed Circuit Boards (PCB is presented. The fatigue damage predictions are calculated by the relative displacement between the PCB and the component, the lead stiffness, as well the natural vibration modes of the PCB and the component itself. Statistical methods are used for fatigue cycle counting. The model is applied to experimental fatigue tests of PCBs available on literature. The analytical results are of the same magnitude order of the experimental findings.

Studies of IBL wire bonds operation in a ATLAS-like magnetic field.

CERN Document Server

Alvarez Feito, D; Mandelli, B

2015-01-01

At the Large Hadron Collider (LHC) experiments, most of silicon detectors use wire bonds to connect front-end chips and sensors to circuit boards for the data and service trans- missions. These wire bonds are operated in strong magnetic field environments and if time varying currents pass through them with frequencies close to their mechanical resonance frequency, strong resonant oscillations may occur. Under certain conditions, this effect can lead to fatigue stress and eventually breakage of wire bonds. During the first LHC Long Shutdown, the ATLAS Pixel Detector has been upgraded with the addition of a fourth innermost layer, the Insertable B-Layer (IBL), which has more than 50000 wire bonds operated in the ATLAS 2 T magnetic field. The results of systematic studies of operating wire bonds under IBL-like conditions are presented. Two different solutions have been investigated to minimize the oscillation amplitude of wire bonds.

Environmental and risk screening for prioritizing pollution prevention opportunities in the U.S. printed wiring board manufacturing industry.

Science.gov (United States)

Lam, Carl W; Lim, Seong-Rin; Schoenung, Julie M

2011-05-15

Modern manufacturing of printed wiring boards (PWBs) involves extensive use of various hazardous chemicals in different manufacturing steps such as board preparation, circuit design transfer, etching and plating processes. Two complementary environmental screening methods developed by the U.S. EPA, namely: (i) the Tool for the Reduction and Assessment of Chemical and Other Environmental Impacts (TRACI) and (ii) Risk-Screening Environmental Indicators (RSEI), are used to quantify geographic and chemical environmental impacts in the U.S. PWB manufacturing industry based on Toxics Release Inventory (TRI) data. Although the release weight percentages of industrial chemicals such as methanol, glycol ethers and dimethylformamide comprise the larger fraction of reported air and water emissions, results indicate that lead, copper and their compounds' releases correspond to the highest environmental impact from toxicity potentials and risk-screening scores. Combining these results with further knowledge of PWB manufacturing, select alternative chemical processes and materials for pollution prevention are discussed. Examples of effective pollution prevention options in the PWB industry include spent etchant recovery technologies, and process and material substitutions. In addition, geographic assessment of environmental burden highlights states where promotion of pollution prevention strategies and emissions regulations can have the greatest effect to curb the PWB industry's toxic release impacts. Copyright © 2011 Elsevier B.V. All rights reserved.

DC arc plasma disposal of printed circuit board

International Nuclear Information System (INIS)

Huang Jianjun; Shenzhen Univ., Shenzhen; Shi Jiabiao; Meng Yuedong; Liu Zhengzhi

2004-01-01

A new solid waste disposal technology setup with DC arc plasma is presented. Being different from conventional combustion or burning such as incineration, it is based on a process called controlled high-temperature pyrolysis, the thermal destruction and recovery process. The results of vitrification of the circuit board are presented. The properties of vitrified product including hardness and leaching test results are presented. The final product (vitrified material) and air emission from the plasma treatment is environmentally acceptable. (authors)

Polyimide Nanocomposite Circuit Board Materials to Mitigate Internal Electrostatic Discharge, Phase I

Data.gov (United States)

National Aeronautics and Space Administration — In Sub-topic T8.02, NASA has identified a need for improved circuit boards to mitigate the hazards of internal electrostatic discharge (IESD) on missions where high...

An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

Energy Technology Data Exchange (ETDEWEB)

Vianco, P.T.

1998-10-15

A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

Design principles and realization of electro-optical circuit boards

Science.gov (United States)

Betschon, Felix; Lamprecht, Tobias; Halter, Markus; Beyer, Stefan; Peterson, Harry

2013-02-01

The manufacturing of electro-optical circuit boards (EOCB) is based to a large extent on established technologies. First products with embedded polymer waveguides are currently produced in series. The range of applications within the sensor and data communication markets is growing with the increasing maturity level. EOCBs require design flows, processes and techniques similar to existing printed circuit board (PCB) manufacturing and appropriate for optical signal transmission. A key aspect is the precise and automated assembly of active and passive optical components to the optical waveguides which has to be supported by the technology. The design flow is described after a short introduction into the build-up of EOCBs and the motivation for the usage of this technology within the different application fields. Basis for the design of EOCBs are the required optical signal transmission properties. Thereafter, the devices for the electro-optical conversion are chosen and the optical coupling approach is defined. Then, the planar optical elements (waveguides, splitters, couplers) are designed and simulated. This phase already requires co-design of the optical and electrical domain using novel design flows. The actual integration of an optical system into a PCB is shown in the last part. The optical layer is thereby laminated to the purely electrical PCB using a conventional PCB-lamination process to form the EOCB. The precise alignment of the various electrical and optical layers is thereby essential. Electrical vias are then generated, penetrating also the optical layer, to connect the individual electrical layers. Finally, the board has to be tested electrically and optically.

Depollution benchmarks for capacitors, batteries and printed wiring boards from waste electrical and electronic equipment (WEEE)

International Nuclear Information System (INIS)

Savi, Daniel; Kasser, Ueli; Ott, Thomas

2013-01-01

Highlights: • We’ve analysed data on the dismantling of electronic and electrical appliances. • Ten years of mass balance data of more than recycling companies have been considered. • Percentages of dismantled batteries, capacitors and PWB have been studied. • Threshold values and benchmarks for batteries and capacitors have been identified. • No benchmark for the dismantling of printed wiring boards should be set. - Abstract: The article compiles and analyses sample data for toxic components removed from waste electronic and electrical equipment (WEEE) from more than 30 recycling companies in Switzerland over the past ten years. According to European and Swiss legislation, toxic components like batteries, capacitors and printed wiring boards have to be removed from WEEE. The control bodies of the Swiss take back schemes have been monitoring the activities of WEEE recyclers in Switzerland for about 15 years. All recyclers have to provide annual mass balance data for every year of operation. From this data, percentage shares of removed batteries and capacitors are calculated in relation to the amount of each respective WEEE category treated. A rationale is developed, why such an indicator should not be calculated for printed wiring boards. The distributions of these de-pollution indicators are analysed and their suitability for defining lower threshold values and benchmarks for the depollution of WEEE is discussed. Recommendations for benchmarks and threshold values for the removal of capacitors and batteries are given

Depollution benchmarks for capacitors, batteries and printed wiring boards from waste electrical and electronic equipment (WEEE)

Energy Technology Data Exchange (ETDEWEB)

Savi, Daniel, E-mail: d.savi@umweltchemie.ch [Dipl. Environmental Sci. ETH, büro für umweltchemie, Zurich (Switzerland); Kasser, Ueli [Lic. Phil. Nat. (Chemist), büro für umweltchemie, Zurich (Switzerland); Ott, Thomas [Dipl. Phys. ETH, Institute of Applied Simulation, Zurich University of Applied Sciences, Wädenswil (Switzerland)

2013-12-15

Highlights: • We’ve analysed data on the dismantling of electronic and electrical appliances. • Ten years of mass balance data of more than recycling companies have been considered. • Percentages of dismantled batteries, capacitors and PWB have been studied. • Threshold values and benchmarks for batteries and capacitors have been identified. • No benchmark for the dismantling of printed wiring boards should be set. - Abstract: The article compiles and analyses sample data for toxic components removed from waste electronic and electrical equipment (WEEE) from more than 30 recycling companies in Switzerland over the past ten years. According to European and Swiss legislation, toxic components like batteries, capacitors and printed wiring boards have to be removed from WEEE. The control bodies of the Swiss take back schemes have been monitoring the activities of WEEE recyclers in Switzerland for about 15 years. All recyclers have to provide annual mass balance data for every year of operation. From this data, percentage shares of removed batteries and capacitors are calculated in relation to the amount of each respective WEEE category treated. A rationale is developed, why such an indicator should not be calculated for printed wiring boards. The distributions of these de-pollution indicators are analysed and their suitability for defining lower threshold values and benchmarks for the depollution of WEEE is discussed. Recommendations for benchmarks and threshold values for the removal of capacitors and batteries are given.

WindoWorks: A flexible program for computerized testing of accelerator control system electronic circuit boards

International Nuclear Information System (INIS)

Utterback, J.

1993-09-01

Since most accelerator control system circuit boards reside in a commercial bus architecture, such as CAMAC or VMEbus, a computerized test station is needed for exercising the boards. This test station is needed for the development of newly designed prototypes, for commissioning newly manufactured boards, for diagnosing boards which have failed in service, and for long term testing of boards with intermittent failure problems. WindoWorks was created to address these needs. It is a flexible program which runs on a PC compatible computer and uses a PC to bus crate interface. WindoWorks was designed to give the user a flexible way to test circuit boards. Each test is incapsulated into a window. By bringing up several different windows the user can run several different tests simultaneously. The windows are sizable, and moveable. They have data entry boxes so that the test can be customized to the users preference. The windows can be used in conjunction with each other in order to create supertests. There are several windows which are generic. They can be used to test basic functions on any VME (or CAMAC) board. There are other windows which have been created to test specific boards. New windows for testing specific boards can be easily created by a Pascal programmer using the WindoWorks framework

A SQUID gradiometer module with wire-wound pickup antenna and integrated voltage feedback circuit

Energy Technology Data Exchange (ETDEWEB)

Zhang Guofeng [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology (SIMIT), Chinese Academy of Sciences (CAS), Shanghai 200050 (China); Peter Gruenberg Institute (PGI-8), Forschungszentrum Juelich (FZJ), D-52425 Juelich (Germany); Joint Research Laboratory on Superconductivity and Bioelectronics, Collaboration between CAS-Shanghai and FZJ, Shanghai 200050 (China); Graduate University of the Chinese Academy of Sciences, Beijing 100049 (China); Zhang, Yi, E-mail: y.zhang@fz-juelich.de [Peter Gruenberg Institute (PGI-8), Forschungszentrum Juelich (FZJ), D-52425 Juelich (Germany); Joint Research Laboratory on Superconductivity and Bioelectronics, Collaboration between CAS-Shanghai and FZJ, Shanghai 200050 (China); Zhang Shulin [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology (SIMIT), Chinese Academy of Sciences (CAS), Shanghai 200050 (China); Joint Research Laboratory on Superconductivity and Bioelectronics, Collaboration between CAS-Shanghai and FZJ, Shanghai 200050 (China); Krause, Hans-Joachim [Peter Gruenberg Institute (PGI-8), Forschungszentrum Juelich (FZJ), D-52425 Juelich (Germany); Joint Research Laboratory on Superconductivity and Bioelectronics, Collaboration between CAS-Shanghai and FZJ, Shanghai 200050 (China); and others

2012-10-15

The performance of the direct readout schemes for dc SQUID, Additional Positive Feedback (APF), noise cancellation (NC) and SQUID bootstrap circuit (SBC), have been studied in conjunction with planar SQUID magnetometers. In this paper, we examine the NC technique applied to a niobium SQUID gradiometer module with an Nb wire-wound antenna connecting to a dual-loop SQUID chip with an integrated voltage feedback circuit for suppression of the preamplifier noise contribution. The sensitivity of the SQUID gradiometer module is measured to be about 1 fT/(cm {radical}Hz) in the white noise range in a magnetically shielded room. Using such gradiometer, both MCG and MEG signals are recorded.

Research on Toxicity Evaluation of Waste Incineration Residues of Printed Circuit Boards

Directory of Open Access Journals (Sweden)

Rasa Volungevičienė

2014-10-01

Full Text Available Recycling waste printed circuit boards (PCB is an extremely complicated process, because PCBs consist of a number of complex components – hazardous and non-hazardous materials sets. Pyrolysis and combustion are currently the most effective treatment technologies for waste printed circuit boards. Pyrolysis can be used for thermally decomposing PCBs allowing for the simultaneous recovery of valuable materials. Following the extraction of valuable materials, the problem of residual ash utilization is encountered. Determining the qualitative and quantitative characteristics of incineration residue helps with choosing effective ash management technologies. This paper analyzes PCB ash generated at three different temperatures of 400 °C, 500 °C and 600 °C. Ash residues have been analysed to determine the quantity and type of metals present. Furthermore, the experiment of leaching heavy metals from ash has been described.

Ruggedizing Printed Circuit Boards Using a Wideband Dynamic Absorber

Directory of Open Access Journals (Sweden)

V.C. Ho

2003-01-01

Full Text Available The existing approaches to ruggedizing inherently fragile and sensitive critical components of electronic equipment such as printed circuit boards (PCB for use in hostile industrial and military environment are either insufficient or expensive. This paper addresses a novel approach towards ruggedizing commercial-off-the-shelf PCBs using a miniature wideband dynamic absorber. The optimisation technique used relies on the experimentally measured vibration spectra and complex receptance of the original PCB.

THERMO-MECHANICALLY PROCESSED ROLLED WIRE FOR HIGH-STRENGTH ON-BOARD WIRE

Directory of Open Access Journals (Sweden)

V. A. Lutsenko

2011-01-01

Full Text Available It is shown that at twisting of wire of diameter 1,83 mm, produced by direct wire drawing of thermomechanically processed rolled wire of diameter 5,5 mm of steel 90, metal stratification is completely eliminated at decrease of carbon, manganese and an additional alloying of chrome.

Bioleaching of metals from printed circuit boards supported with surfactant-producing bacteria

International Nuclear Information System (INIS)

Karwowska, Ewa; Andrzejewska-Morzuch, Dorota; Łebkowska, Maria; Tabernacka, Agnieszka; Wojtkowska, Małgorzata; Telepko, Alicja; Konarzewska, Agnieszka

2014-01-01

Highlights: • Bioleaching of metals from printed circuit boards by BSAC-producing bacteria was estimated. • Aeration increased the release of all metals in medium with sulphur and biosurfactant. • Increase in Cu, Pb, Ni and Cr removal rate was observed at 37 °C in acidic medium. -- Abstract: This study has evaluated the possibility of bioleaching zinc, copper, lead, nickel, cadmium and chromium from printed circuit boards by applying a culture of sulphur-oxidising bacteria and a mixed culture of biosurfactant-producing bacteria and sulphur-oxidising bacteria. It was revealed that zinc was removed effectively both in a traditional solution acidified by a way of microbial oxidation of sulphur and when using a microbial culture containing sulphur-oxidising and biosurfactant-producing bacteria. The average process efficiency was 48% for Zn dissolution. Cadmium removal was similar in both media, with a highest metal release of 93%. For nickel and copper, a better effect was obtained in the acidic medium, with a process effectiveness of 48.5% and 53%, respectively. Chromium was the only metal that was removed more effectively in the bioleaching medium containing both sulphur-oxidising and biosurfactant-producing bacteria. Lead was removed from the printed circuit boards with very low effectiveness (below 0.5%). Aerating the culture medium with compressed air increased the release of all metals in the medium with sulphur and biosurfactant, and of Ni, Cu, Zn and Cr in the acidic medium. Increasing the temperature of the medium (to 37 °C) had a more significant impact in the acidic environment than in the neutral environment

Bioleaching of metals from printed circuit boards supported with surfactant-producing bacteria

Energy Technology Data Exchange (ETDEWEB)

Karwowska, Ewa, E-mail: ewa.karwowska@is.pw.edu.pl [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Andrzejewska-Morzuch, Dorota; Łebkowska, Maria [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Tabernacka, Agnieszka, E-mail: agnieszka.tabernacka@is.pw.edu.pl [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Wojtkowska, Małgorzata; Telepko, Alicja; Konarzewska, Agnieszka [Warsaw University of Technology, Faculty of Environmental Engineering, Nowowiejska 20, 00-653 Warsaw (Poland)

2014-01-15

Highlights: • Bioleaching of metals from printed circuit boards by BSAC-producing bacteria was estimated. • Aeration increased the release of all metals in medium with sulphur and biosurfactant. • Increase in Cu, Pb, Ni and Cr removal rate was observed at 37 °C in acidic medium. -- Abstract: This study has evaluated the possibility of bioleaching zinc, copper, lead, nickel, cadmium and chromium from printed circuit boards by applying a culture of sulphur-oxidising bacteria and a mixed culture of biosurfactant-producing bacteria and sulphur-oxidising bacteria. It was revealed that zinc was removed effectively both in a traditional solution acidified by a way of microbial oxidation of sulphur and when using a microbial culture containing sulphur-oxidising and biosurfactant-producing bacteria. The average process efficiency was 48% for Zn dissolution. Cadmium removal was similar in both media, with a highest metal release of 93%. For nickel and copper, a better effect was obtained in the acidic medium, with a process effectiveness of 48.5% and 53%, respectively. Chromium was the only metal that was removed more effectively in the bioleaching medium containing both sulphur-oxidising and biosurfactant-producing bacteria. Lead was removed from the printed circuit boards with very low effectiveness (below 0.5%). Aerating the culture medium with compressed air increased the release of all metals in the medium with sulphur and biosurfactant, and of Ni, Cu, Zn and Cr in the acidic medium. Increasing the temperature of the medium (to 37 °C) had a more significant impact in the acidic environment than in the neutral environment.

Improving intrinsic corrosion reliability of printed circuit board assembly

DEFF Research Database (Denmark)

Ambat, Rajan; Conseil, Helene

2016-01-01

conditions, therefore the protection of electronic devices is becoming a critical factor in system design. Humidity and local condensation inside electronic enclosures can significantly alter the performance of electronic devices. The presence of moisture in a PCB alters its quality, functionality, thermal...... performance, and thermo-mechanical properties, while condensation on the surface of printed circuit board assemblies (PCBAs) can lead to electrical failures, like electrochemical migration. The result is reduced life span for electronic products and heavy economic loss due to failures....

Effect of ionic contamination on climatic reliability of printed circuit board assemblies

DEFF Research Database (Denmark)

Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

2012-01-01

The effect of NaCl and weak organic acids (WOAs) in “no-clean” wave solder flux residues was studied on electrochemical migration (ECM), leakage current, and corrosion on surface mount chip capacitors using a test printed circuit board assembly (PCBA) substrate having known chip components...

Pyrolysis characteristics of integrated circuit boards at various particle sizes and temperatures

Energy Technology Data Exchange (ETDEWEB)

Chiang, H.-L. [Department Risk Management, China Medical University, Taichung 40402, Taiwan (China)], E-mail: hlchiang@mail.cmu.edu.tw; Lin, K.-H. [Department of Environmental Engineering, Fooyin University, Kaohsiung 831, Taiwan (China); Lai, M.-H. [Department of Environmental Engineering, Dayeh University, Changhua 51591, Taiwan (China); Chen, T.-C. [Department of Environmental Science and Engineering, Pingtung University of Science and Technology, Pingtung 91201, Taiwan (China); Ma, S.-Y. [Department of Environmental Engineering, Fooyin University, Kaohsiung 831, Taiwan (China)

2007-10-01

A pyrolysis method was employed to recycle the metals and brominated compounds blended into printed circuit boards. This research investigated the effect of particle size and process temperature on the element composition of IC boards and pyrolytic residues, liquid products, and water-soluble ionic species in the exhaust, with the overall goal being to identify the pyrolysis conditions that will have the least impact on the environment. Integrated circuit (IC) boards were crushed into 5-40 mesh (0.71-4.4 mm), and the crushed particles were pyrolyzed at temperatures ranging from 200 to 500 deg. C. The thermal decomposition kinetics were measured by a thermogravimetric (TG) analyzer. The composition of pyrolytic residues was analyzed by Energy Dispersive X-ray Spectrometer (EDS), Inductively Coupled Plasma Atomic Emission Spectrometer (ICP-AES) and Inductively Coupled Plasma-Mass Spectrometry (ICP-MS). In addition, the element compositions of liquid products were analyzed by ICP-AES and ICP-MS. Pyrolytic exhaust was collected by a water-absorption system in an ice-bath cooler, and IC analysis showed that the absorbed solution comprised 11 ionic species. Based on the pyrolytic kinetic parameters of TG analysis and pyrolytic residues at various temperatures for 30 min, the effect of particle size was insignificant in this study, and temperature was the key factor for the IC board pyrolysis. Two stages of decomposition were found for IC board pyrolysis under nitrogen atmosphere. The activation energy was 38-47 kcal/mol for the first-stage reaction and 5.2-9.4 kcal/mol for the second-stage reaction. Metal content was low in the liquid by-product of the IC board pyrolysis process, which is an advantage in that the liquid product could be used as a fuel. Brominate and ammonium were the main water-soluble ionic species of the pyrolytic exhaust. A plan for their safe and effective disposal must be developed if the pyrolytic recycling process is to be applied to IC boards.

Pyrolysis characteristics of integrated circuit boards at various particle sizes and temperatures

International Nuclear Information System (INIS)

Chiang, H.-L.; Lin, K.-H.; Lai, M.-H.; Chen, T.-C.; Ma, S.-Y.

2007-01-01

A pyrolysis method was employed to recycle the metals and brominated compounds blended into printed circuit boards. This research investigated the effect of particle size and process temperature on the element composition of IC boards and pyrolytic residues, liquid products, and water-soluble ionic species in the exhaust, with the overall goal being to identify the pyrolysis conditions that will have the least impact on the environment. Integrated circuit (IC) boards were crushed into 5-40 mesh (0.71-4.4 mm), and the crushed particles were pyrolyzed at temperatures ranging from 200 to 500 deg. C. The thermal decomposition kinetics were measured by a thermogravimetric (TG) analyzer. The composition of pyrolytic residues was analyzed by Energy Dispersive X-ray Spectrometer (EDS), Inductively Coupled Plasma Atomic Emission Spectrometer (ICP-AES) and Inductively Coupled Plasma-Mass Spectrometry (ICP-MS). In addition, the element compositions of liquid products were analyzed by ICP-AES and ICP-MS. Pyrolytic exhaust was collected by a water-absorption system in an ice-bath cooler, and IC analysis showed that the absorbed solution comprised 11 ionic species. Based on the pyrolytic kinetic parameters of TG analysis and pyrolytic residues at various temperatures for 30 min, the effect of particle size was insignificant in this study, and temperature was the key factor for the IC board pyrolysis. Two stages of decomposition were found for IC board pyrolysis under nitrogen atmosphere. The activation energy was 38-47 kcal/mol for the first-stage reaction and 5.2-9.4 kcal/mol for the second-stage reaction. Metal content was low in the liquid by-product of the IC board pyrolysis process, which is an advantage in that the liquid product could be used as a fuel. Brominate and ammonium were the main water-soluble ionic species of the pyrolytic exhaust. A plan for their safe and effective disposal must be developed if the pyrolytic recycling process is to be applied to IC boards

Study of Photosensitive Dry Films Absorption for Printed Circuit Boards by Photoacoustic Technique

Science.gov (United States)

Hernández, R.; Zaragoza, J. A. Barrientos; Jiménez-Pérez, J. L.; Orea, A. Cruz; Correa-Pacheco, Z. N.

2017-08-01

In this work, the study of photosensitive dry-type films by photoacoustic technique is proposed. The dry film photoresist is resistant to chemical etching for printed circuit boards such as ferric chloride, sodium persulfate or ammonium, hydrochloric acid. It is capable of faithfully reproducing circuit pattern exposed to ultraviolet light (UV) through a negative. Once recorded, the uncured portion is removed with alkaline solution. It is possible to obtain good results in surface mount circuits with tracks of 5 mm. Furthermore, the solid resin films are formed by three layers, two protective layers and a UV-sensitive optical absorption layer in the range of 325 nm to 405 nm. By means of optical absorption of UV-visible rays emitted by a low-power Xe lamp, the films transform this energy into thermal waves generated by the absorption of optical radiation and subsequently no-radiative de-excitation occurs. The photoacoustic spectroscopy is a useful technique to measure the transmittance and absorption directly. In this study, the optical absorption spectra of the three layers of photosensitive dry-type films were obtained as a function of the wavelength, in order to have a knowledge of the absorber layer and the protective layers. These analyses will give us the physical properties of the photosensitive film, which are very important in curing the dry film for applications in printed circuit boards.

Impact of NaCl Contamination and Climatic Conditions on the Reliability of Printed Circuit Board Assemblies

DEFF Research Database (Denmark)

Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

2014-01-01

The effect of climatic conditions and ionic contamination on the reliability of printed circuit board assembly has been investigated in terms of leakage current (LC) and electrochemical migration susceptibility. The change in LC as a function of relative humidity (RH) and temperature was measured...... and 15 $^{\\circ}\\hbox{C}$ –65 $^{\\circ}\\hbox{C}$. The variation of RH at the surface of the test specimens was imposed by 1) increasing the RH of the surrounding air and 2) reducing the temperature of the printed circuit boards using a cooling stage, while maintaining a constant climatic condition...

Effects of smoke on functional circuits

International Nuclear Information System (INIS)

Tanaka, T.J.

1997-10-01

Nuclear power plants are converting to digital instrumentation and control systems; however, the effects of abnormal environments such as fire and smoke on such systems are not known. There are no standard tests for smoke, but previous smoke exposure tests at Sandia National Laboratories have shown that digital communications can be temporarily interrupted during a smoke exposure. Another concern is the long-term corrosion of metals exposed to the acidic gases produced by a cable fire. This report documents measurements of basic functional circuits during and up to 1 day after exposure to smoke created by burning cable insulation. Printed wiring boards were exposed to the smoke in an enclosed chamber for 1 hour. For high-resistance circuits, the smoke lowered the resistance of the surface of the board and caused the circuits to short during the exposure. These circuits recovered after the smoke was vented. For low-resistance circuits, the smoke caused their resistance to increase slightly. A polyurethane conformal coating substantially reduced the effects of smoke. A high-speed digital circuit was unaffected. A second experiment on different logic chip technologies showed that the critical shunt resistance that would cause failure was dependent on the chip technology and that the components used in the smoke exposures were some of the most smoke tolerant. The smoke densities in these tests were high enough to cause changes in high impedance (resistance) circuits during exposure, but did not affect most of the other circuits. Conformal coatings and the characteristics of chip technologies should be considered when designing circuitry for nuclear power plant safety systems, which must be highly reliable under a variety of operating and accident conditions. 10 refs., 34 figs., 18 tabs

Printed Circuit Board Embedded Inductors for Very High Frequency Switch-Mode Power Supplies

DEFF Research Database (Denmark)

Madsen, Mickey Pierre; Knott, Arnold; Andersen, Michael A. E.

2013-01-01

The paper describes the design of three different structures for printed circuit board embedded inductors. Direct comparison of spirals, solenoids and toroids are made with regard to inductance, dc and ac resistance, electromagnetic field and design flexibility. First the equations for the impeda...

A Method for Automatic Inspection of Printed Circuit Boards by Using the Thermal Signature

International Nuclear Information System (INIS)

Amer, H.H.; Zekry, A.A.; Elaraby, S.; Ghareeb, K.E.

2012-01-01

This paper aims to design a system for automating inspection of the printed circuit boards (PCBs) by using the thermal signature of the different integrated circuits (I.C). The proposed inspection system consists of the inspection circuit, data acquisition system (DAS) and personal computer. Inspection is done by comparing the thermal signature of normally operated circuit with the thermal signature of circuit under test. One thermistor is assigned to each component in the circuit. The thermistor must touch tightly the surface of the I.C. to sense its temperature during the inspection process. Matlab software is used to represent the thermal signature through different colors. The Turbo C software is used to develop a program for acquiring and comparing the thermal signature of the circuit under the test with the reference circuit. If the colors of the two thermal signatures for the same I.C. are same then the circuit under test is fault free and does not contain any defect. On the other side, if the colors of the two thermal signatures for the same I.C. are different then the circuit under test is defective

Investigation, development and verification of printed circuit board embedded air-core solenoid transformers

DEFF Research Database (Denmark)

Mønster, Jakob Døllner; Madsen, Mickey Pierre; Pedersen, Jeppe Arnsdorf

2015-01-01

A new printed circuit board embedded air-core transformer/coupled inductor is proposed and presented. The transformer is intended for use in power converter applications operating at very high frequency between 30 MHz to 300 MHz. The transformer is based on two or more solenoid structures...

Formation of plasma around wire fragments created by electrically exploded copper wire

International Nuclear Information System (INIS)

Taylor, Michael J.

2002-01-01

The physical processes occurring during the electrical explosion of metallic conductors has attracted interest for many years. Applications include circuit breakers, segmented lightning divertor strips for aircraft radomes, disruption of metallic shaped charge jets, plasma armatures for electromagnetic railguns and plasma generators for electrothermal-chemical guns. Recent work has cited the phenomenology of the fragmentation processes, particularly the development of a plasma around the lower resistance condensed fragments. An understanding of both the fragmentation process and the development of the accompanying formation of plasma is essential for the optimization of devices that utilize either of these phenomena. With the use of x-radiography and fast photography, this paper explores the wire explosion process, in particular the relationship between the fragmentation, plasma development and resistance rise that occurs during this period. A hypothesis is put forward to account for the development of plasma around the condensed wire fragments. Experimental parameters used in this study are defined. Wires studied were typically copper, with a diameter of 1 mm and length in excess of 150 mm. Circuit inductance used were from 26 to 800 μH. This relatively high circuit inductance gave circuit rise times less than 180 MA s -1 , slow with respect to many other exploding wire studies. Discharge duration ranged from 0.8 to 10 ms. (author)

An interactive system for the automatic layout of printed circuit boards (ARAIGNEE)

International Nuclear Information System (INIS)

Combet, M.; Eder, J.; Pagny, C.

1974-12-01

A software package for the automatic layout of printed circuit boards is presented. The program permits an interaction of the user during the layout process. The automatic searching of paths can be interrupted at any step and convenient corrections can be inserted. This procedure improves strongly the performance of the program as far as the number of unresolved connections is concerned

Assembling surface mounted components on ink-jet printed double sided paper circuit board

International Nuclear Information System (INIS)

Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Sidén, Johan; Nilsson, Hans-Erik; Hummelgård, Magnus; Olin, Håkan; Hummelgård, Christine

2014-01-01

Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed. (paper)

Assembling surface mounted components on ink-jet printed double sided paper circuit board.

Science.gov (United States)

Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Hummelgård, Magnus; Sidén, Johan; Hummelgård, Christine; Olin, Håkan; Nilsson, Hans-Erik

2014-03-07

Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.

Assembling surface mounted components on ink-jet printed double sided paper circuit board

Energy Technology Data Exchange (ETDEWEB)

Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Sidén, Johan; Nilsson, Hans-Erik [Department of Electronics Design, Mid Sweden University, SE-851 70 Sundsvall (Sweden); Hummelgård, Magnus; Olin, Håkan [Department of Natural Science, Mid Sweden University, SE-851 70 Sundsvall (Sweden); Hummelgård, Christine [Acreo Swedish ICT AB, Håstaholmen 4, SE-824 42 Hudiksvall (Sweden)

2014-03-07

Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed. (paper)

Wiring of interpolation unit of mass spectrometer oscilloscope

International Nuclear Information System (INIS)

Paryzek, J.

1981-01-01

The combinatory logic circuit block is wired across the input terminal of oscilloscope intensity modulation and the output terminal of the sweep delay control block, the output terminal of the block for mains frequency division, and the output terminal of the pulse shaper block. It consists of a dual-input AND circuit and a dual-input OR circuit whose one input is wired to the output of one of the dual-input AND circuit. (J.P.)

Radiation evaluation method of commercial off-the-shelf (COTS) electronic printed circuit boards (PCBs)

International Nuclear Information System (INIS)

LaBel, K.A.; Gruner, T.D.; Reed, R.A.; Settles, B.; Wilmot, J.; Dougherty, L.F.; Russo, A.; Yuknis, W.; Foster, M.G.; Garrisson-Darrin, A.; Marshall, P.W.

1999-01-01

We present a radiation evaluation methodology and proton ground test results for candidate COTS PCBs (commercial off-the-shelf electronic printed circuit boards) and their associated electronics for low-altitude, low-inclination orbits. We will also discuss the implications associated with mission orbit and duration. (authors)

Heated wire humidification circuit attenuates the decrease of core temperature during general anesthesia in patients undergoing arthroscopic hip surgery.

Science.gov (United States)

Park, Sooyong; Yoon, Seok-Hwa; Youn, Ann Misun; Song, Seung Hyun; Hwang, Ja Gyung

2017-12-01

Intraoperative hypothermia is common in patients undergoing general anesthesia during arthroscopic hip surgery. In the present study, we assessed the effect of heating and humidifying the airway with a heated wire humidification circuit (HHC) to attenuate the decrease of core temperature and prevent hypothermia in patients undergoing arthroscopic hip surgery under general anesthesia. Fifty-six patients scheduled for arthroscopic hip surgery were randomly assigned to either a control group using a breathing circuit connected with a heat and moisture exchanger (HME) (n = 28) or an HHC group using a heated wire humidification circuit (n = 28). The decrease in core temperature was measured from anesthetic induction and every 15 minutes thereafter using an esophageal stethoscope. Decrease in core temperature from anesthetic induction to 120 minutes after induction was lower in the HHC group (-0.60 ± 0.27℃) compared to the control group (-0.86 ± 0.29℃) (P = 0.001). However, there was no statistically significant difference in the incidence of intraoperative hypothermia or the incidence of shivering in the postanesthetic care unit. The use of HHC may be considered as a method to attenuate intraoperative decrease in core temperature during arthroscopic hip surgery performed under general anesthesia and exceeding 2 hours in duration.

Packaging printed circuit boards: A production application of interactive graphics

Science.gov (United States)

Perrill, W. A.

1975-01-01

The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

Aeroflex Single Board Computers and Instrument Circuit Cards for Nuclear Environments Measuring and Monitoring

International Nuclear Information System (INIS)

Stratton, Sam; Stevenson, Dave; Magnifico, Mateo

2013-06-01

A Single Board Computer (SBC) is an entire computer including all of the required components and I/O interfaces built on a single circuit board. SBC's are used across numerous industrial, military and space flight applications. In the case of military and space implementations, SBC's employ advanced high reliability processors designed for rugged thermal, mechanical and even radiation environments. These processors, in turn, rely on equally advanced support components such as memory, interface, and digital logic. When all of these components are put together on a printed circuit card, the result is a highly reliable Single Board Computer that can perform a wide variety of tasks in very harsh environments. In the area of instrumentation, peripheral circuit cards can be developed that directly interface to the SBC and various radiation measuring devices and systems. Designers use signal conditioning and high reliability Analog to Digital Converters (ADC's) to convert the measuring device signals to digital data suitable for a microprocessor. The data can then be sent to the SBC via high speed communication protocols such as Ethernet or similar type of serial bus. Data received by the SBC can then be manipulated and processed into a form readily available to users. Recent events are causing some in the NPP industry to consider devices and systems with better radiation and temperature performance capability. Systems designed for space application are designed for the harsh environment of space which under certain conditions would be similar to what the electronics will see during a severe nuclear reactor event. The NPP industry should be considering higher reliability electronics for certain critical applications. (authors)

Recovery Act: High-Temperature Circuit Boards for use in Geothermal Well Monitoring Applications

Energy Technology Data Exchange (ETDEWEB)

Hooker, Matthew [Composite Tehcnology Development, Inc., Lafayette, CO (United States); Fabian, Paul [Composite Tehcnology Development, Inc., Lafayette, CO (United States)

2013-05-01

The U.S. Department of Energy is leading the development of alternative energy sources that will ensure the long-term energy independence of our nation. One of the key renewable resources currently being advanced is geothermal energy. To tap into the large potential offered by generating power from the heat of the earth, and for geothermal energy to be more widely used, it will be necessary to drill deeper wells to reach the hot, dry rock located up to 10 km beneath the earth’s surface. In this instance, water will be introduced into the well to create a geothermal reservoir. A geothermal well produced in this manner is referred to as an enhanced geothermal system (EGS). EGS reservoirs are typically at depths of 3 to 10 km, and the temperatures at these depths have become a limiting factor in the application of existing downhole technologies. These high temperatures are especially problematic for electronic systems such as downhole data-logging tools, which are used to map and characterize the fractures and high-permeability regions in underground formations. Information provided by these tools is assessed so that underground formations capable of providing geothermal energy can be identified, and the subsequent drilling operations can be accurately directed to those locations. The mapping of geothermal resources involves the design and fabrication of sensor packages, including the electronic control modules, to quantify downhole conditions (300°C temperature, high pressure, seismic activity, etc.). Because of the extreme depths at which these measurements are performed, it is most desirable to perform the sensor signal processing downhole and then transmit the information to the surface. This approach necessitates the use of high-temperature electronics that can operate in the downhole environment. Downhole signal processing in EGS wells will require the development and demonstration of circuit boards that can withstand the elevated temperatures found at these

MOSFET Switching Circuit Protects Shape Memory Alloy Actuators

Science.gov (United States)

Gummin, Mark A.

2011-01-01

A small-footprint, full surface-mount-component printed circuit board employs MOSFET (metal-oxide-semiconductor field-effect transistor) power switches to switch high currents from any input power supply from 3 to 30 V. High-force shape memory alloy (SMA) actuators generally require high current (up to 9 A at 28 V) to actuate. SMA wires (the driving element of the actuators) can be quickly overheated if power is not removed at the end of stroke, which can damage the wires. The new analog driver prevents overheating of the SMA wires in an actuator by momentarily removing power when the end limit switch is closed, thereby allowing complex control schemes to be adopted without concern for overheating. Either an integral pushbutton or microprocessor-controlled gate or control line inputs switch current to the actuator until the end switch line goes from logic high to logic low state. Power is then momentarily removed (switched off by the MOSFET). The analog driver is suited to use with nearly any SMA actuator.

An Icepak-PSpice Co-Simulation Method to Study the Impact of Bond Wires Fatigue on the Current and Temperature Distribution of IGBT Modules under Short-Circuit

DEFF Research Database (Denmark)

Wu, Rui; Iannuzzo, Francesco; Wang, Huai

2014-01-01

Bond wires fatigue is one of the dominant failure mechanisms of IGBT modules. Prior-art research mainly focuses on its impact on the end-of-life failure, while its effect on the short-circuit capability of IGBT modules is still an open issue. This paper proposes a new electro-thermal simulation...... approach enabling analyze the impact of the bond wires fatigue on the current and temperature distribution on IGBT chip surface under short-circuit. It is based on an Icepack-PSpice co-simulation by taking the advantage of both a finite element thermal model and an advanced PSpice-based multi-cell IGBT...

Two-wire Interface for Digital Microphones

NARCIS (Netherlands)

Groothedde, Wouter; Klumperink, Eric A.M.; Nauta, Bram; Eschauzier, Rudolphe Gustave Hubertus; van Rijn, Nico

2003-01-01

A two-wire interface for a digital microphone circuit includes a power line and a ground line. The interface utilizes the ground line as a "voltage active line" to transmit both clock and data signals between the digital microphone circuit and a receiving circuit. The digital microphone circuit

Two-Wire interface for digital microphones

NARCIS (Netherlands)

Groothedde, Wouter; Klumperink, Eric A.M.; Nauta, Bram; Eschauzier, Rudolphe Gustave Hubertus; van Rijn, Nico

2005-01-01

A two-wire interface for a digital microphone circuit includes a power line and a ground line. The interface utilizes the ground line as a "voltage active line" to transmit both clock and data signals between the digital microphone circuit and a receiving circuit. The digital microphone circuit

Circuit Board Analysis for Lead by Atomic Absorption Spectroscopy in a Course for Nonscience Majors

Science.gov (United States)

Weidenhammer, Jeffrey D.

2007-01-01

A circuit board analysis of the atomic absorption spectroscopy, which is used to measure lead content in a course for nonscience majors, is being presented. The experiment can also be used to explain the potential environmental hazards of unsafe disposal of various used electronic equipments.

Contamination profile on typical printed circuit board assemblies vs soldering process

DEFF Research Database (Denmark)

Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

2014-01-01

Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

Leaching of gold and silver from printed circuit board of mobile phones

OpenAIRE

Petter,Patrícia Melo Halmenschlager; Veit,Hugo Marcelo; Bernardes,Andréa Moura

2015-01-01

Nowadays there is a wide variety of models, sizes and configurations of mobile phones available for consumption. After the life cycle of this equipment, the recycling and reuse of the precious metals found in the printed circuit boards (PCB) of the mobile phones are principal objectives. Thus, the objective of this work was to characterize the gold and silver present in a PCB and develop a recycling route using alternative reagents for cyanide, such as sodium and ammonium thiosulfate. These r...

EMC and the printed circuit board design theory and layout made simple

CERN Document Server

Montrose, Mark I

1999-01-01

"This reference text shows how and why RF energy is created within a printed circuit board, and the manner in which propagation occurs. With thorough explanations, this book enables engineers to grasp both the fundamentals of EMC theory and signal integrity, along with the mitigation process needed to prevent an EMC event while maintaining optimal functionality for low- and high-technology products. Mr. Montrose also shows the relationship between time and frequency domains, helping one meet mandatory compliance requirements."--Jacket.

Simulation of the chemical environment of a nuclear explosion with exploding wires

Energy Technology Data Exchange (ETDEWEB)

Meyer, Walter; Block, Oliver U.J. [Nuclear Engineering, Kansas State University, Manhattan, KS (United States)

1970-05-15

The chemical processes in an expanding underground cavity resulting from a nuclear explosion cannot be predicted or controlled as well as such physical characteristics as crater size, magnitude of the outgoing shock wave, or the extent of rock fracturing. However in most underground nuclear explosions it would be desirable to control the chemical and/or physical form and amount of radioactive fallout venting from the explosion. The high temperatures and corresponding high energy densities produced by exploding wires are sufficient to produce in the wire and material immediately surrounding it the temperature (a few thousand degrees) required to simulate the chemical environment of a nuclear explosion in the time interval just preceding the venting of the cavity. The economics and the size of exploding wire apparatus make this type of experiment readily applicable to laboratory study. Design of exploding wire circuits to obtain particular temperatures or energy densities can be completed using several different combinations of circuit and wire conditions. Since the circuit parameters, including charging voltage, capacitor bank capacitance and circuit inductance primarily determine the cost of the necessary laboratory equipment, these parameters should be selected by theoretical expressions while also considering economic factors. Wire parameters are then experimentally determined to produce the most energetic explosions with the selected circuit parameters. A theoretical method applicable to designing exploding wire circuits to produce the desired high temperatures and energy densities in the wire and surrounding sample material has been obtained. The method assumes that a thermal spike of energy is deposited in a low conductivity material (typical of the earth's crust) surrounding the wire. From the assumed temperature distribution in the surrounding sample material the energy which must be deposited in the thermal spike to produce the desired temperature and

29 CFR 1926.404 - Wiring design and protection.

Science.gov (United States)

2010-07-01

.... Receptacles on a two-wire, single-phase portable or vehicle-mounted generator rated not more than 5kW, where the circuit conductors of the generator are insulated from the generator frame and all other grounded... wiring shall be grounded: (i) Three-wire DC systems. All 3-wire DC systems shall have their neutral...

Experimental study on underwater electrical explosion of a copper wire

International Nuclear Information System (INIS)

Zhou Qing; Zhang Jun; Tan Xiangyu; Ren Baozhong; Zhang Qiaogen

2010-01-01

Through analyzing the physical process of underwater electrical wire explosion, electrical wire explosions with copper wires were investigated underwater using pulsed voltage in the time scale of a few microseconds. A self-integrating Rogowsky coil and a voltage divider were used for current and voltage at the wire load, respectively. The shock wave pressure is measured with a piezoelectric pressure probe at the same distance. The current rise rate was adjusted by changing the applied voltage, circuit inductance, length and diameter of copper wire. The change of the current rise rate had a great effect on the process of underwater electrical wire explosion with copper wires. At last, the effect of discharge voltage, circuit inductance, length and diameter of copper wire were obtained on the explosion voltage and current as well as shock wave pressure. (authors)

Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards

DEFF Research Database (Denmark)

Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

2017-01-01

A majority of printed circuit board surfaces are covered with tin, therefore tin corrosion under humid conditions and movement of tin ions under the influence of an electric field plays an important role in the corrosion failure development. Tracking tin corrosion products spread on the printed c...

Temperature Dependent Wire Delay Estimation in Floorplanning

DEFF Research Database (Denmark)

Winther, Andreas Thor; Liu, Wei; Nannarelli, Alberto

2011-01-01

Due to large variations in temperature in VLSI circuits and the linear relationship between metal resistance and temperature, the delay through wires of the same length can be different. Traditional thermal aware floorplanning algorithms use wirelength to estimate delay and routability. In this w......Due to large variations in temperature in VLSI circuits and the linear relationship between metal resistance and temperature, the delay through wires of the same length can be different. Traditional thermal aware floorplanning algorithms use wirelength to estimate delay and routability....... In this work, we show that using wirelength as the evaluation metric does not always produce a floorplan with the shortest delay. We propose a temperature dependent wire delay estimation method for thermal aware floorplanning algorithms, which takes into account the thermal effect on wire delay. The experiment...

Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

Science.gov (United States)

Ivǎnuş, R. C.; ǎnuş, D., IV; Cǎlmuc, F.

2010-06-01

Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE) contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste - PCBs) leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L). The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

Potentials for Improvement of Resource Efficiency in Printed Circuit Board Manufacturing: A Case Study Based on Material Flow Cost Accounting

Directory of Open Access Journals (Sweden)

Yi-Xuan Wang

2017-05-01

Full Text Available The pursuit of sustainable resource use by manufacturing companies is driven by resource scarcity, environmental awareness, and cost savings potentials. To address these issues, Material Flow Cost Accounting (MFCA has been developed and applied as an effective environmental management tool. Within MFCA’s general allocation, the accounts of products and losses are overrated by weight or volume. However, such a method is incompatible with Printed Circuit Board (PCB manufacturing because of industry characteristics in which primary inputs and products are measured by area. Based on MFCA, this case study systematically established several linear cost calculation models along the production process for capturing the actual waste flows as well as performing cost-benefit analysis. The recognition of previously ignored losses offered the incentive to find appropriate indicators to conduct cost-benefit analysis on hotspots for losses. Loss identification and analysis indicated that machining and wiring are the necessities and priorities of process optimization for resource efficiency improvement measures. Therefore, this research could not only advance the achievement of a profitable and sustainable production while improving resource efficiency at the source but could also provide support for decision making in PCB manufacturing.

Hydrothermal modification and recycling of nonmetallic particles from waste print circuit boards.

Science.gov (United States)

Gao, Xuehua; Li, Qisheng; Qiu, Jun

2018-04-01

Nonmetallic particles recycled from waste print circuit boards (NPRPs) were modified by a hydrothermal treatment method and the catalysts, solvents, temperature and time were investigated, which affected the modification effect of NPRPs. The mild hydrothermal treatment method does not need high temperature, and would not cause secondary pollution. Further, the modified NPRPs were used as the raw materials for the epoxy resin and glass fibers/epoxy resin composites, which were prepared by pouring and hot-pressing method. The mechanical properties and morphology of the composites were discussed. The results showed that relative intensity of the hydroxyl bonds on the surface of NPRPs increased 58.9% after modification. The mechanical tests revealed that both flexural and impact properties of the composites can be significantly improved by adding the modified NPRPs. Particularly, the maximum increment of flexural strength, flexural modulus and impact strength of the epoxy matrix composites with 30% modified NPRPs is 40.1%, 80.0% and 79.0%, respectively. Hydrothermal treatment can modify surface of NPRPs successfully and modified NPRPs can not only improve the properties of the composites, but also reduce the production cost of the composites and environmental pollution. Thus, we develop a new way to recycle nonmetallic materials of waste print circuit boards and the highest level of waste material recycling with the raw materials-products-raw materials closed cycle can be realized through the hydrothermal modification and reuse of NPRPs. Copyright © 2018 Elsevier Ltd. All rights reserved.

Effect of solder flux residue on the performance of silicone conformal coatings on printed circuit board assemblies

DEFF Research Database (Denmark)

Rathinavelu, Umadevi; Jellesen, Morten Stendahl; Ambat, Rajan

2013-01-01

Conformal coatings are applied on printed circuit board assemblies (PCBAs) in order to protect the assembly from environmental influence and silicone-based coating is commonly used. A systematic study on the performance of silicone conformal coating in connection with process-related contaminants...

Spring Break: A Lesson in Circuits. "This Old House" College Style.

Science.gov (United States)

Duch, Barbara

2001-01-01

Introduces students to the topics of electricity and circuits within the context of house wiring. Explores the properties of series and parallel circuits, researches local wiring codes, calculates the current used by appliances based on their power ratings, and designs circuits in a typical kitchen. (Author/ASK)

Nano-powder production by electrical explosion of wires

International Nuclear Information System (INIS)

Mao Zhiguo; Zou Xiaobing; Wang Xinxin; Jiang Weihua

2010-01-01

A device for nano-powder production by electrical explosion of wires was designed and built. Eight wires housed in the discharge chamber are exploded one by one before opening the chamber for the collection of the produced nano-powder. To increase the rate of energy deposition into a wire, the electrical behavior of the discharge circuit including the exploding wire was simulated. The results showed that both reducing the circuit inductance and reducing the capacitance of the energy-storage capacitor (keeping the storage energy constant) can increase the energy deposition rate. To better understand the physical processes of the nano-powder formation by the wire vapor, a Mach-Zehnder interferometer was used to record the time evolution of the wire vapor as well as the plasma. A thermal expansion lag of the dense vapor core as well as more than one times of the vapor burst was observed for the first time. Finally, nano-powders of titanium nitride, titanium dioxide, copper oxides and zinc oxide were produced by electrical explosion of wires. (authors)

Towards plant wires.

Science.gov (United States)

Adamatzky, Andrew

2014-08-01

In experimental laboratory studies we evaluate a possibility of making electrical wires from living plants. In scoping experiments we use lettuce seedlings as a prototype model of a plant wire. We approximate an electrical potential transfer function by applying direct current voltage to the lettuce seedlings and recording output voltage. We analyse oscillation frequencies of the output potential and assess noise immunity of the plant wires. Our findings will be used in future designs of self-growing wetware circuits and devices, and integration of plant-based electronic components into future and emergent bio-hybrid systems. Copyright © 2014 Elsevier Ireland Ltd. All rights reserved.

Detecting short circuits during assembly

Science.gov (United States)

Deboo, G. J.

1980-01-01

Detector circuit identifies shorts between bus bars of electronic equipment being wired. Detector sounds alarm and indicates which planes are shorted. Power and ground bus bars are scanned continuously until short circuit occurs.

Estimation of Operating Condition of Appliances Using Circuit Current Data on Electric Distribution Boards

Science.gov (United States)

Iwafune, Yumiko; Ogimoto, Kazuhiko; Yagita, Yoshie

The Energy management systems (EMS) on demand sides are expected as a method to enhance the capability of supply and demand balancing of a power system under the anticipated penetration of renewable energy generation such as Photovoltaics (PV). Elucidation of energy consumption structure in a building is one of important elements for realization of EMS and contributes to the extraction of potential energy saving. In this paper, we propose the estimation method of operating condition of household appliances using circuit current data on an electric distribution board. Circuit current data are broken down by their shape using a self-organization map method and aggregated by appliance based on customers' information of appliance possessed. Proposed method is verified using residential energy consumption measurement survey data.

Effects of mould on electrochemical migration behaviour of immersion silver finished printed circuit board.

Science.gov (United States)

Yi, Pan; Xiao, Kui; Dong, Chaofang; Zou, Shiwen; Li, Xiaogang

2018-02-01

The role played by mould in the electrochemical migration (ECM) behaviour of an immersion silver finished printed circuit board (PCB-ImAg) under a direct current (DC) bias was investigated. An interesting phenomenon is found whereby mould, especially Aspergillus niger, can preferentially grow well on PCB-ImAg under electrical bias and then bridge integrated circuits and form a migration path. The cooperation of the mould and DC bias aggravates the ECM process occurring on PCB-ImAg. When the bias voltage is below 15V, ECM almost does not occur for Ag coating. Mechanisms that explain the ECM processes of PCB-ImAg in the presence of mould and DC bias are proposed. Copyright © 2017. Published by Elsevier B.V.

Ductile electroless Ni-P coating onto flexible printed circuit board

Science.gov (United States)

Wang, Wenchang; Zhang, Weiwei; Wang, Yurong; Mitsuzak, Naotoshi; Chen, Zhidong

2016-03-01

In this study, a ductile electroless Ni-P coating on the flexible printed circuit board (FPCB) was prepared in an acidic nickel plating bath. The addition of dipropylamine (DPA) in electroless plating not only improves the ductility of the Ni-P coating, but also enhances the corrosion resistance. The further analysis reveals that the ductility improvement and enhancement of corrosion resistance for the Ni-P coating may be due to the fact that the addition of DPA significantly refines the volume of columnar nodule and reduce the porosity, thus leading to the released internal stress. In addition, it was found that the nodule within the Ni-P coating grew into a columnar structure, which may be also contribute to the improvement of ductility.

The circuit designer's companion

CERN Document Server

Williams, Tim

1991-01-01

The Circuit Designer's Companion covers the theoretical aspects and practices in analogue and digital circuit design. Electronic circuit design involves designing a circuit that will fulfill its specified function and designing the same circuit so that every production model of it will fulfill its specified function, and no other undesired and unspecified function.This book is composed of nine chapters and starts with a review of the concept of grounding, wiring, and printed circuits. The subsequent chapters deal with the passive and active components of circuitry design. These topics are foll

Fabrication of a capacitive relative humidity sensor using aluminum thin films deposited on etched printed circuit board

Directory of Open Access Journals (Sweden)

Lee Jacqueline Ann L.

2016-01-01

Full Text Available A capacitive humidity-sensing device was created by thermal evaporation of 99.999% aluminum. The substrate used for the coating was etched double-sided printed circuit board. The etched printed circuit board serves as the dielectric of the capacitor while the aluminum thin films deposited on either side serve as the plates of the capacitor. The capacitance was measured before and after exposure to humidity. The device was then calibrated by comparing the readings of capacitance with that of the relative humidity sensor of the Vernier LabQuest2. It was found that there is a linear relationship between the capacitance and relative humidity given by the equation C=1.418RH+29.139 where C is the capacitance and RH is the relative humidity. The surface of the aluminum films is porous and it is through these pores that water is adsorbed and capillary condensation occurs, thereby causing the capacitance to change upon exposure to humidity.

Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

Directory of Open Access Journals (Sweden)

Ivănuş R.C.

2010-06-01

Full Text Available Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste – PCBs leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L. The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

Search for the optimal size of printed circuit boards for mechanical structures for electronic equipment

Directory of Open Access Journals (Sweden)

Yefimenko A. A.

2014-12-01

Full Text Available The authors present a method, an algorithm and a program, designed to determine the optimal size of printed circuit boards (PCB of mechanical structures and different kinds of electronic equipment. The PCB filling factor is taken as an optimization criterion. The method allows one to quickly determine the dependence of the filling factor on the size of the PCB for various components.

Homogenization on Multi-Materials’ Elements: Application to Printed Circuit Boards and Warpage Analysis

Directory of Open Access Journals (Sweden)

Araújo Manuel

2016-01-01

Full Text Available Multi-material domains are often found in industrial applications. Modelling them can be computationally very expensive due to meshing requirements. The finite element properties comprising different materials are hardly accurate. In this work, a new homogenization method that simplifies the computation of the homogenized Young modulus, Poisson ratio and thermal expansion coefficient is proposed, and applied to composite-like material on a printed circuit board. The results show a good properties correspondence between the homogenized domain and the real geometry simulation.

Comparative study of electromagnetic compatibility methods in printed circuit board design tools

International Nuclear Information System (INIS)

Marinova, Galia

2002-01-01

The paper considers the state-of-the art in electromagnetic compatibility (EMC) oriented printed circuit board (PCB) design. A general methodology of EMC oriented PCB design is synthesized. The main CAD tools available today are estimated and compared for their abilities to treat EMC oriented design. To help non experts a knowledge-base containing more than 50 basic rules for EMC-oriented PCB design is proposed. It can be applied in the PCB design CAD tools that possess rule-builders or it can help interactive design. Trends in this area of EMC-oriented PCB design are deduced. (Author)

Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

International Nuclear Information System (INIS)

Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia

2014-01-01

Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery

Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

Energy Technology Data Exchange (ETDEWEB)

Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia, E-mail: silvia.serranti@uniroma1.it

2014-11-15

Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery.

Research on burnout fault of moulded case circuit breaker based on finite element simulation

Science.gov (United States)

Xue, Yang; Chang, Shuai; Zhang, Penghe; Xu, Yinghui; Peng, Chuning; Shi, Erwei

2017-09-01

In the failure event of molded case circuit breaker, overheating of the molded case near the wiring terminal has a very important proportion. The burnout fault has become an important factor restricting the development of molded case circuit breaker. This paper uses the finite element simulation software to establish the model of molded case circuit breaker by coupling multi-physics field. This model can simulate the operation and study the law of the temperature distribution. The simulation results show that the temperature near the wiring terminal, especially the incoming side of the live wire, of the molded case circuit breaker is much higher than that of the other areas. The steady-state and transient simulation results show that the temperature at the wiring terminals is abnormally increased by increasing the contact resistance of the wiring terminals. This is consistent with the frequent occurrence of burnout of the molded case in this area. Therefore, this paper holds that the burnout failure of the molded case circuit breaker is mainly caused by the abnormal increase of the contact resistance of the wiring terminal.

Memory formation orchestrates the wiring of adult-born hippocampal neurons into brain circuits.

Science.gov (United States)

Petsophonsakul, Petnoi; Richetin, Kevin; Andraini, Trinovita; Roybon, Laurent; Rampon, Claire

2017-08-01

During memory formation, structural rearrangements of dendritic spines provide a mean to durably modulate synaptic connectivity within neuronal networks. New neurons generated throughout the adult life in the dentate gyrus of the hippocampus contribute to learning and memory. As these neurons become incorporated into the network, they generate huge numbers of new connections that modify hippocampal circuitry and functioning. However, it is yet unclear as to how the dynamic process of memory formation influences their synaptic integration into neuronal circuits. New memories are established according to a multistep process during which new information is first acquired and then consolidated to form a stable memory trace. Upon recall, memory is transiently destabilized and vulnerable to modification. Using contextual fear conditioning, we found that learning was associated with an acceleration of dendritic spines formation of adult-born neurons, and that spine connectivity becomes strengthened after memory consolidation. Moreover, we observed that afferent connectivity onto adult-born neurons is enhanced after memory retrieval, while extinction training induces a change of spine shapes. Together, these findings reveal that the neuronal activity supporting memory processes strongly influences the structural dendritic integration of adult-born neurons into pre-existing neuronal circuits. Such change of afferent connectivity is likely to impact the overall wiring of hippocampal network, and consequently, to regulate hippocampal function.

Inspection of anode and field wires for the COMPASS drift chamber, DC5, with Environmental Scanning Electron Microscope

Science.gov (United States)

Cyuzuzo, Sonia

2014-09-01

The COMPASS experiment at CERN uses a secondary pion beam from the Super Proton Synchrotron (SPS) at CERN to explore the spin structure of nucleons. A new drift chamber, DC5, will be integrated into the COMPASS spectrometer to replace an aging straw tube detector. DC5 will detect muon pairs from Drell-Yan scattering of a pion-beam off a transversely polarized proton target. This data will be used to determine the correlation between transverse proton spin and the intrinsic transverse momentum of up-quarks inside the proton, the Sivers effect. DC5 is a large area planar drift chamber with 8 layers of anode-frames made of G10 fiberglass-epoxy. The G10 frames support printed circuit boards for soldering 20 μm diameter anode and 100 μm diameter field wires. The anode planes are sandwiched by 13 graphite coated Mylar cathode planes. To ensure a well-functioning of DC5, the wires were carefully tested. An optical inspection and a spectral analysis was performed with an Environmental Scanning Electron Microscope (ESEM) to verify the composition and dimensions and the integrity of the gold plating on the surface of these wires. The spectra of the wires were studied at 10 and 30 keV. The COMPASS experiment at CERN uses a secondary pion beam from the Super Proton Synchrotron (SPS) at CERN to explore the spin structure of nucleons. A new drift chamber, DC5, will be integrated into the COMPASS spectrometer to replace an aging straw tube detector. DC5 will detect muon pairs from Drell-Yan scattering of a pion-beam off a transversely polarized proton target. This data will be used to determine the correlation between transverse proton spin and the intrinsic transverse momentum of up-quarks inside the proton, the Sivers effect. DC5 is a large area planar drift chamber with 8 layers of anode-frames made of G10 fiberglass-epoxy. The G10 frames support printed circuit boards for soldering 20 μm diameter anode and 100 μm diameter field wires. The anode planes are sandwiched by 13

Modular integration of electronics and microfluidic systems using flexible printed circuit boards.

Science.gov (United States)

Wu, Amy; Wang, Lisen; Jensen, Erik; Mathies, Richard; Boser, Bernhard

2010-02-21

Microfluidic systems offer an attractive alternative to conventional wet chemical methods with benefits including reduced sample and reagent volumes, shorter reaction times, high-throughput, automation, and low cost. However, most present microfluidic systems rely on external means to analyze reaction products. This substantially adds to the size, complexity, and cost of the overall system. Electronic detection based on sub-millimetre size integrated circuits (ICs) has been demonstrated for a wide range of targets including nucleic and amino acids, but deployment of this technology to date has been limited due to the lack of a flexible process to integrate these chips within microfluidic devices. This paper presents a modular and inexpensive process to integrate ICs with microfluidic systems based on standard printed circuit board (PCB) technology to assemble the independently designed microfluidic and electronic components. The integrated system can accommodate multiple chips of different sizes bonded to glass or PDMS microfluidic systems. Since IC chips and flex PCB manufacturing and assembly are industry standards with low cost, the integrated system is economical for both laboratory and point-of-care settings.

IEE wiring regulations explained and illustrated

CERN Document Server

Scaddan, Brian

2013-01-01

The IEE Wiring Regulations Explained and Illustrated, Second Edition discusses the recommendations of the IEE Regulations for the Electrical Equipment of Buildings for the safe selection or erection of wiring installations. The book emphasizes earthing, bonding, protection, and circuit design of electrical wirings. The text reviews the fundamental requirements for safety, earthing systems, the earth fault loop impedance, and supplementary bonding. The book also describes the different types of protection, such as protection against mechanical damage, overcurrent, under voltage (which prevents

Environmental and economic implications of a shift to halogen-free printed wiring boards

Energy Technology Data Exchange (ETDEWEB)

Bergendahl, C.G.; Johansson, G.; Zackrisson, M. [IVF Industrial Research and Development Corp., Moelndal (Sweden); Lichtenvort, K. [Technical Univ. of Berlin (Germany); Nyyssoenen, J. [Aspocomp Oy, Salo (Finland)

2004-07-01

The 'Restriction of Hazardous Substances Directive' (RoHS) and the 'Waste from Electrical and Electronic Equipment Directive' (WEEE) enforced by the European Commission require new materials and processes to be implemented in the production of electrical and electronic equipment (EEE). In response to this, the project grEEEn (Cost Management System for greening Electrical and Electronic Equipment) was defined and carried out within the 5th framework programme of the EU. This paper presents the grEEEn method and the outcome of applying the method on a case study. The study addressed the material shift in printed wiring boards (PWBs), from the traditional FR4 material containing halogenated flame retardants to halogen-free FR4 materials. The paper presents the product, process and scenario modelling and the results from analysing costs, environmental profile and legal compliance. (orig.)

Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor.

Science.gov (United States)

Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S K; McKay, Gordon

2015-01-01

Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced. Copyright © 2014 Elsevier Ltd. All rights reserved.

Modelling the transient analysis of flat miniature heat pipes in printed circuit boards using a control volume approacht

NARCIS (Netherlands)

Wits, W.W.; Kok, J.B.W.; van Steenhoven, A.A.; van der Meer, T.H.; Stoffels, G.G.M.

2008-01-01

The heat pipe is a two-phase cooling solution, offering very high thermal coefficients, for heat transport. Therefore, it is increasingly used in the design of electronic products. Flat miniature heat pipes are able to effectively remove heat from several hot spots on a Printed Circuit Board (PCB).

A One Chip Hardened Solution for High Speed SpaceWire System Implementations. Session: Components

Science.gov (United States)

Marshall, Joseph R.; Berger, Richard W.; Rakow, Glenn P.

2007-01-01

An Application Specific Integrated Circuit (ASIC) that implements the SpaceWire protocol has been developed in a radiation hardened 0.25 micron CMOS technology. This effort began in March 2003 as a joint development between the NASA Goddard Space Flight Center (GSFC) and BAE Systems. The BAE Systems SpaceWire ASIC is comprised entirely of reusable core elements, many of which are already flight-proven. It incorporates a router with 4 SpaceWire ports and two local ports, dual PC1 bus interfaces, a microcontroller, 32KB of internal memory, and a memory controller for additional external memory use. The SpaceWire cores are also reused in other ASICs under development. The SpaceWire ASIC is planned for use on the Geostationary Operational Environmental Satellites (GOES)-R, the Lunar Reconnaissance Orbiter (LRO) and other missions. Engineering and flight parts have been delivered to programs and users. This paper reviews the SpaceWire protocol and those elements of it that have been built into the current and next SpaceWire reusable cores and features within the core that go beyond the current standard and can be enabled or disabled by the user. The adaptation of SpaceWire to BAE Systems' On Chip Bus (OCB) for compatibility with the other reusable cores will be reviewed and highlighted. Optional configurations within user systems and test boards will be shown. The physical implementation of the design will be described and test results from the hardware will be discussed. Application of this ASIC and other ASICs containing the SpaceWire cores and embedded microcontroller to Plug and Play and reconfigurable implementations will be described. Finally, the BAE Systems roadmap for SpaceWire developments will be updated, including some products already in design as well as longer term plans.

30 CFR 56.12065 - Short circuit and lightning protection.

Science.gov (United States)

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Short circuit and lightning protection. 56... Electricity § 56.12065 Short circuit and lightning protection. Powerlines, including trolley wires, and telephone circuits shall be protected against short circuits and lightning. ...

Analysis of the treatment of plastic from electrical and electronic waste in the Republic of Serbia and the testing of the recycling potential of non-metallic fractions of printed circuit boards

Directory of Open Access Journals (Sweden)

Vučinić Aleksandra S.

2017-01-01

Full Text Available This paper presents the analysis of the quantity of plastic and waste printed circuit boards obtained after the mechanical treatment of electrical and electronic waste (E-waste in the Republic of Serbia, as well as the recycling of non-metallic fractions of waste printed circuit boards. The aim is to analyze the obtained recycled material and recommendation for possible application of recyclables. The data on the quantities and treatment of plastics and printed circuit boards obtained after the mechanical treatment of WEEE, were gained through questionnaires sent to the operators who treat this type of waste. The results of the questionnaire analysis showed that in 2014 the dismantling of E-waste isolated 1,870.95 t of plastic and 499.85 t of printed circuit boards. In the Republic of Serbia, E-waste recycling is performed exclusively by using mechanical methods. Mechanical methods consist of primary crushing and separation of the materials which have a utility value as secondary raw materials, from the components and materials that have hazardous properties. Respect to that, the recycling of printed circuit boards using some of the metallurgical processes with the aim of extracting copper, precious metals and non-metallic fraction is completely absent, and the circuit boards are exported as a whole. Given the number of printed circuit boards obtained by E-waste dismantling, and the fact that from an economic point of view, hydrometallurgical methods are very suitable technological solutions in the case of a smaller capacity, there is a possibility for establishing the facilities in the Republic of Serbia for the hydrometallurgical treatment that could be used for metals extraction, and non-metallic fractions, which also have their own value. Printed circuit boards granulate obtained after the mechanical pretreatment and the selective removal of metals by hydrometallurgical processes was used for the testing of the recycling potential

30 CFR 57.12065 - Short circuit and lightning protection.

Science.gov (United States)

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Short circuit and lightning protection. 57... MINES Electricity Surface Only § 57.12065 Short circuit and lightning protection. Powerlines, including trolley wires, and telephone circuits shall be protected against short circuits and lightning. ...

A Software Suite for Testing SpaceWire Devices and Networks

Science.gov (United States)

Mills, Stuart; Parkes, Steve

2015-09-01

SpaceWire is a data-handling network for use on-board spacecraft, which connects together instruments, mass-memory, processors, downlink telemetry, and other on-board sub-systems. SpaceWire is simple to implement and has some specific characteristics that help it support data-handling applications in space: high-speed, low-power, simplicity, relatively low implementation cost, and architectural flexibility making it ideal for many space missions. SpaceWire provides high-speed (2 Mbits/s to 200 Mbits/s), bi-directional, full-duplex data-links, which connect together SpaceWire enabled equipment. Data-handling networks can be built to suit particular applications using point-to-point data-links and routing switches. STAR-Dundee’s STAR-System software stack has been designed to meet the needs of engineers designing and developing SpaceWire networks and devices. This paper describes the aims of the software and how those needs were met.

Thermal Aware Floorplanning Incorporating Temperature Dependent Wire Delay Estimation

DEFF Research Database (Denmark)

Winther, AndreasThor; Liu, Wei; Nannarelli, Alberto

2015-01-01

Temperature has a negative impact on metal resistance and thus wire delay. In state-of-the-art VLSI circuits, large thermal gradients usually exist due to the uneven distribution of heat sources. The difference in wire temperature can lead to performance mismatch because wires of the same length...... can have different delay. Traditional floorplanning algorithms use wirelength to estimate wire performance. In this work, we show that this does not always produce a design with the shortest delay and we propose a floorplanning algorithm taking into account temperature dependent wire delay as one...

Simultaneous detection of lactate and glucose by integrated printed circuit board based array sensing chip

Energy Technology Data Exchange (ETDEWEB)

Li, Xuelian [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China); School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715 (China); Zang, Jianfeng [Department of Mechanical Engineering and Materials Science, Duke University, Durham, NC 27708 (United States); Liu, Yingshuai; Lu, Zhisong [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China); Li, Qing, E-mail: Qli@swu.edu.cn [School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715 (China); Li, Chang Ming, E-mail: ecmli@swu.edu.cn [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China)

2013-04-10

Highlights: ► An integrated printed circuit board (PCB) based array sensing chip was developed. ► Simultaneous detection of lactate and glucose in serum has been demonstrated. ► The array electronic biochip has high signal to noise ratio and high sensitivity. ► Additional electrodes were designed on the chip to correct interferences. -- Abstract: An integrated printed circuit board (PCB) based array sensing chip was developed to simultaneously detect lactate and glucose in mouse serum. The novelty of the chip relies on a concept demonstration of inexpensive high-throughput electronic biochip, a chip design for high signal to noise ratio and high sensitivity by construction of positively charged chitosan/redox polymer Polyvinylimidazole-Os (PVI-Os)/carbon nanotube (CNT) composite sensing platform, in which the positively charged chitosan/PVI-Os is mediator and electrostatically immobilizes the negatively charged enzyme, while CNTs function as an essential cross-linker to network PVI-Os and chitosan due to its negative charged nature. Additional electrodes on the chip with the same sensing layer but without enzymes were prepared to correct the interferences for high specificity. Low detection limits of 0.6 μM and 5 μM were achieved for lactate and glucose, respectively. This work could be extended to inexpensive array sensing chips with high sensitivity, good specificity and high reproducibility for various sensor applications.

A FPGA implementation of solder paste deposit on printed circuit boards errors detector based in a bright and contrast algorithm

OpenAIRE

De Luca-Pennacchia, A.; Sánchez-Martínez, M. Á.

2007-01-01

Solder paste deposit on printed circuit boards (PCB) is a critical stage. It is known that about 60% of functionality defects in this type of boards are due to poor solder paste printing. These defects can be diminished by means of automatic optical inspection of this printing. Actually, this process is implemented by image processing software with its inherent high computational time cost. In this paper we propose to implement a high parallel degree image comparison algorithm suitable to be ...

Treatment of Wastewater from Electroplating, Metal Finishing and Printed Circuit Board Manufacturing. Operation of Wastewater Treatment Plants Volume 4.

Science.gov (United States)

California State Univ., Sacramento. Dept. of Civil Engineering.

One of four manuals dealing with the operation of wastewater plants, this document was designed to address the treatment of wastewater from electroplating, metal finishing, and printed circuit board manufacturing. It emphasizes how to operate and maintain facilities which neutralize acidic and basic waters; treat waters containing metals; destroy…

Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader

Directory of Open Access Journals (Sweden)

Monier-Vinard Eric

2016-01-01

Full Text Available In order to help the electronic designer to early determine the limits of the power dissipation of electronic component, an analytical model was established to allow a fast insight of relevant design parameters of a multi-layered electronic board constitution. The proposed steady-state approach based on Fourier series method promotes a practical solution to quickly investigate the potential gain of multi-layered thermal via clusters. Generally, it has been shown a good agreement between the results obtained by the proposed analytical model and those given by electronics cooling software widely used in industry. Some results highlight the fact that the conventional practices for Printed Circuit Board modeling can be dramatically underestimate source temperatures, in particular with smaller sources. Moreover, the analytic solution could be applied to optimize the heat spreading in the board structure with a local modification of the effective thermal conductivity layers.

SOURCES OF COPPER IONS AND SELECTED METHODS OF THEIR REMOVAL FROM WASTEWATER FROM THE PRINTED CIRCUITS BOARD PRODUCTION

Directory of Open Access Journals (Sweden)

Maciej Thomas

2014-10-01

Full Text Available This paper presents the issues related to the presence and removal of copper compounds from industrial effluents with including wastewater from plants involved in the production of printed circuit boards. Characterized the toxicological properties of selected copper compounds, described the applicable technological processes, sources of copper ions in the effluents and selected methods for their removal.

Electromagnetic Behaviour of Metallic Wire Structures

CERN Document Server

Chui, S T

2013-01-01

Despite the recent development and interest in the photonics of metallic wire structures, the relatively simple concepts and physics often remain obscured or poorly explained to those who do not specialize in the field. Electromagnetic Behaviour of Metallic Wire Structures provides a clear and coherent guide to understanding these phenomena without excessive numerical calculations.   Including both background material and detailed derivations of the various different formulae applied, Electromagnetic Behaviour of Metallic Wire Structures describes how to extend basic circuit theory relating to voltages, currents, and resistances of metallic wire networks to include situations where the currents are no longer spatially uniform along the wire. This lays a foundation for a deeper understanding of the many new phenomena observed in meta-electromagnetic materials.   Examples of applications are included to support this new approach making Electromagnetic Behaviour of Metallic Wire Structures a comprehensive and ...

Comparative Study of Crosstalk Reduction Techniques in RF Printed Circuit Board Using FDTD Method

Directory of Open Access Journals (Sweden)

Rajeswari Packianathan

2015-01-01

Full Text Available Miniaturization of the feature size in modern electronic circuits results from placing interconnections in close proximity with a high packing density. As a result, coupling between the adjacent lines has increased significantly, causing crosstalk to become an important concern in high-performance circuit design. In certain applications, microstriplines may be used in printed circuit boards for propagating high-speed signals, rather than striplines. Here, the electromagnetic coupling effects are analyzed for various microstrip transmission line structures, namely, microstriplines with a guard trace, double stub microstriplines, and parallel serpentine microstriplines using the finite-difference time-domain method. The numerical results are compared with simulation results, where the variants are simulated using an Ansoft high-frequency structure simulator. The analysis and simulation results are experimentally validated by fabricating a prototype and establishing a good correspondence between them. Numerical results are compared with simulation and experimental results, showing that double stub microstriplines reduce the far end crosstalk by 7 dB and increase the near end crosstalk by about 2 dB compared with the parallel microstriplines. Parallel serpentine microstriplines reduce the far end crosstalk by more than 10 dB and also reduce more than 15 mV of peak far end crosstalk voltage, compared with parallel microstriplines.

Design and Experimental Research of New Type Brake by Wire System Based on Giant-magnetostrictive Material

Directory of Open Access Journals (Sweden)

Changbao CHU

2014-04-01

Full Text Available In this paper, H type brake by wire system based on giant-magnetostrictive material is designed from two aspects of hardware and software. System principle prototype is manufactured. Hardware circuit mainly includes the Sepic circuit, current detection circuit, over current protection circuit, PWM driver protection circuit. Circuit parameters can be obtained through by theoretical calculation. Pedal sensor signal is taken as main control variable, look-up table method is used for brake by wire system. The experimental results show that the system can meet the braking requirements. It proves the feasibility of the scheme.

Recovery of high purity precious metals from printed circuit boards

International Nuclear Information System (INIS)

Park, Young Jun; Fray, Derek J.

2009-01-01

Waste printed circuit boards (WPCB) have an inherent value because of the precious metal content. For an effective recycling of WPCB, it is essential to recover the precious metals. This paper reports a promising method to recover the precious metals. Aqua regia was used as a leachant and the ratio between metals and leachant was fixed at 1/20 (g/ml). Silver is relatively stable so the amount of about 98 wt.% of the input was recovered without an additional treatment. Palladium formed a red precipitate during dissolution, which were consisted of Pd(NH 4 ) 2 Cl 6 . The amount precipitated was 93 wt.% of the input palladium. A liquid-liquid extraction with toluene was used to extract gold selectively. Also, dodecanethiol and sodium borohydride solution were added to make gold nanoparticles. Gold of about 97 wt.% of the input was recovered as nanoparticles which was identified with a high-resolution transmission electron microscopy through selected area electron diffraction and nearest-neighbor lattice spacing.

A multiwire ionization chamber readout circuit using current mirrors

International Nuclear Information System (INIS)

Rawnsley, W.R.; Smith, D.; Moskven, T.

1997-01-01

A circuit which utilizes current mirrors has been used to apply high voltage bias to the wires of a multiwire ionization chamber (MWIC) profile monitor while still allowing measurement of the beam-induced ion-electron currents collected on the wires. Bias voltages of up to 250 V have been used while wire currents over a range of 0.5 nA to 50 nA have been measured. The circuit is unipolar but can be designed for positive or negative bias. The mirrors also provide a current gain of 10, reducing the effects of transistor leakage and extending the useful range of the circuit to lower signal levels. A module containing 32 Wilson current mirrors has been constructed and is used with a MWIC monitor in TRIUMF close-quote s Parity experiment beamline. copyright 1997 American Institute of Physics

A new wire chamber front-end system, based on the ASD-8 B chip

International Nuclear Information System (INIS)

Kruesemann, B.A.M.; Bassini, R.; Ellinghaus, F.; Frekers, D.; Hagemann, M.; Hannen, V.M.; Heynitz, H. von; Heyse, J.; Rakers, S.; Sohlbach, H.; Woertche, H.J.

1999-01-01

The Focal-Plane Polarimeter (FPP) for the Big-Bite Spectrometer van den Berg (Nucl. Instr. and Meth. B 99 (1995) 637ff) at the KVI requires the read-out of four large-area MWPCs and two VDCs with 3872 wires in total. The EUROSUPERNOVA collaboration (SNOVA) developed a digital 16 channel preamplifier front-end board, housing two amplifier-shaper-discriminatorchips ASD-8 B. The main features of this board are a fast single-wire readout, a high integration density, a low power consumption and compatibility to common instrumentation standards. The board represents the first successfully running application of the ASD-8 for wire chamber readout. (author)

Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

DEFF Research Database (Denmark)

Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

2014-01-01

Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

30 CFR 75.1323 - Blasting circuits.

Science.gov (United States)

2010-07-01

...) Blasting circuits shall be protected from sources of stray electric current. (b) Detonators made by different manufacturers shall not be combined in the same blasting circuit. (c) Detonator leg wires shall be... used between the blasting cable and detonator circuitry shall— (1) Be undamaged; (2) Be well insulated...

46 CFR 183.340 - Cable and wiring requirements.

Science.gov (United States)

2010-10-01

... a manner as to avoid chafing and other damage. The use of plastic tie wraps must be limited to... requirements. (a) If individual wires, rather than cable, are used in systems greater than 50 volts, the wire... current carrying capacity for the circuit in which they are used; (2) Be installed in a manner to avoid or...

46 CFR 120.340 - Cable and wiring requirements.

Science.gov (United States)

2010-10-01

... chafing and other damage. The use of plastic tie wraps must be limited to bundling or retention of... wires, rather than cables, are used in systems greater than 50 volts, the wire must be in conduit. (b... for the circuit in which they are used; (2) Be installed in a manner to avoid or reduce interference...

Checking a printed board

CERN Multimedia

1977-01-01

An 'Interactive Printed Circuit Board Design System' has been developed by a company in a Member-State. Printed circuits are now produced at the SB's surface treatment workshop using a digitized photo-plotter.

Communication and Wiring in the Cortical Connectome

Directory of Open Access Journals (Sweden)

Julian eBudd

2012-10-01

Full Text Available In cerebral cortex, the huge mass of axonal wiring that carries information between near and distant neurons is thought to provide the neural substrate for cognitive and perceptual function. The goal of mapping the connectivity of cortical axons at different spatial scales, the cortical connectome, is to trace the paths of information flow in cerebral cortex. To appreciate the relationship between the connectome and cortical function, we need to discover the nature and purpose of the wiring principles underlying cortical connectivity. A popular explanation has been that axonal length is strictly minimized both within and between cortical regions. In contrast, we have hypothesized the existence of a multi-scale principle of cortical wiring where to optimise communication there is a trade-off between spatial (construction and temporal (routing costs. Here, using recent evidence concerning cortical spatial networks we critically evaluate this hypothesis at neuron, local circuit, and pathway scales. We report three main conclusions. First, the axonal and dendritic arbor morphology of single neocortical neurons may be governed by a similar wiring principle, one that balances the conservation of cellular material and conduction delay. Second, the same principle may be observed for fibre tracts connecting cortical regions. Third, the absence of sufficient local circuit data currently prohibits any meaningful assessment of the hypothesis at this scale of cortical organization. To avoid neglecting neuron and microcircuit levels of cortical organization, the connectome framework should incorporate more morphological description. In addition, structural analyses of temporal cost for cortical circuits should take account of both axonal conduction and neuronal integration delays, which appear mostly of the same order of magnitude. We conclude the hypothesized trade-off between spatial and temporal costs may potentially offer a powerful explanation for

Developing and Testing SpaceWire Devices and Networks

Science.gov (United States)

Parkes, Steve; Mills, Stuart

2014-08-01

SpaceWire is a data-handling network for use on-board spacecraft, which connects together instruments, mass- memory, processors, downlink telemetry, and other on- board sub-systems [1]. SpaceWire is simple to implement and has some specific characteristics that help it support data-handling applications in space: high-speed, low-power, simplicity, relatively low implementation cost, and architectural flexibility making it ideal for many space missions. SpaceWire provides high-speed (2 Mbits/s to 200 Mbits/s), bi- directional, full-duplex data-links, which connect together SpaceWire enabled equipment. Data-handling networks can be built to suit particular applications using point-to-point data-links and routing switches.Since the SpaceWire standard was published in January 2003, it has been adopted by ESA, NASA, JAXA and RosCosmos for many missions and is being widely used on scientific, Earth observation, commercial and other spacecraft. High-profile missions using SpaceWire include: Gaia, ExoMars rover, Bepi- Colombo, James Webb Space Telescope, GOES-R, Lunar Reconnaissance Orbiter and Astro-H.The development and testing of the SpaceWire links and networks used on these and many other spacecraft currently under development, requires a comprehensive array of test equipment. In this paper the requirements for test equipment fulfilling key test functions are outlined and then equipment that meets these requirements is described. Finally the all-important software that operates with the test equipment is introduced.

Evaluation of gold and silver leaching from printed circuit board of cellphones

Energy Technology Data Exchange (ETDEWEB)

Petter, P.M.H., E-mail: patymhp@yahoo.com.br; Veit, H.M.; Bernardes, A.M.

2014-02-15

Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na{sub 2}S{sub 2}O{sub 3} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO{sub 3}were made. The leaching of Au and Ag with alternative reagents: Na{sub 2}S{sub 2}O{sub 3,} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} in 0.1 M concentration with the addition of CuSO{sub 4}, NH{sub 4}OH, and H{sub 2}O{sub 2}, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO{sub 4} was added.

Evaluation of gold and silver leaching from printed circuit board of cellphones

International Nuclear Information System (INIS)

Petter, P.M.H.; Veit, H.M.; Bernardes, A.M.

2014-01-01

Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na 2 S 2 O 3 and (NH 4 ) 2 S 2 O 3 to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO 3 were made. The leaching of Au and Ag with alternative reagents: Na 2 S 2 O 3, and (NH 4 ) 2 S 2 O 3 in 0.1 M concentration with the addition of CuSO 4 , NH 4 OH, and H 2 O 2 , was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO 4 was added

High-speed micro electrode tool fabrication by a twin-wire EDM system

International Nuclear Information System (INIS)

Sheu, Dong-Yea

2008-01-01

This paper describes a new machining process which combines twin-electro-wire together with two electro discharge circuits to rapidly fabricate micro electrode tools. The results show that transistor electro discharge and RC electro discharge circuits coexist to fabricate micro tools with rough and finish machining both on the same machine. Compared to conventional wire electro discharge grinding (WEDG) technology, a twin-wire EDM system that combines rough and finish machining into one process allows the efficient fabrication of micro tools. This high-speed micro tool fabrication process can be applied not only to micro electrode machining but also to micro punching tool and micro probing tips machining

Modeling of Short-Circuit-Related Thermal Stress in Aged IGBT Modules

DEFF Research Database (Denmark)

Bahman, Amir Sajjad; Iannuzzo, Francesco; Uhrenfeldt, Christian

2017-01-01

In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely...... in the surface temperature distribution, which confirms the hypothesis that short-circuit events produce significantly uneven stresses on bond wires....

Prediction of Short-Circuit-Related Thermal Stress in Aged IGBT Modules

DEFF Research Database (Denmark)

Bahman, Amir Sajjad; Iannuzzo, Francesco; Uhrenfeldt, Christian

2016-01-01

In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely...... in the surface temperature distribution which confirms the hypothesis that short-circuit events produce significantly uneven stresses on bond wires....

New technology for recovering residual metals from nonmetallic fractions of waste printed circuit boards.

Science.gov (United States)

Zhang, Guangwen; He, Yaqun; Wang, Haifeng; Zhang, Tao; Wang, Shuai; Yang, Xing; Xia, Wencheng

2017-06-01

Recycling of waste printed circuit boards is important for environmental protection and sustainable resource utilization. Corona electrostatic separation has been widely used to recycle metals from waste printed circuit boards, but it has poor separation efficiency for finer sized fractions. In this study, a new process of vibrated gas-solid fluidized bed was used to recycle residual metals from nonmetallic fractions, which were treated using the corona electrostatic separation technology. The effects of three main parameters, i.e., vibration frequency, superficial air flow velocity, and fluidizing time on gravity segregation, were investigated using a vibrating gas-solid fluidized bed. Each size fraction had its own optimum parameters. Corresponding to their optimal segregation performance, the products from each experiment were analyzed using an X-ray fluorescence (XRF) and a scanning electron microscope (SEM) equipped with an energy dispersive spectrometer (EDS). From the results, it can be seen that the metal recoveries of -1+0.5mm, -0.5+0.25mm, and -0.25mm size fractions were 86.39%, 82.22% and 76.63%, respectively. After separation, each metal content in the -1+0.5 or -0.5+0.25mm size fraction reduced to 1% or less, while the Fe and Cu contents are up to 2.57% and 1.50%, respectively, in the -0.25mm size fraction. Images of the nonmetallic fractions with a size of -0.25mm indicated that a considerable amount of clavate glass fibers existed in these nonmetallic fractions, which may explain why fine particles had the poorest segregation performance. Copyright © 2017 Elsevier Ltd. All rights reserved.

Basic study of HTS magnet using 2G wires for maglev train

International Nuclear Information System (INIS)

Ogata, M.; Miyazaki, Y.; Hasegawa, H.; Sasakawa, T.; Nagashima, K.

2010-01-01

There are several advantages by applying a high-temperature superconducting wire to an on-board superconducting magnet for the maglev train. At first, an increase of thermal capacity of superconducting coils contributes a stability of the superconducting state of the coils. In addition, a reliability of superconducting magnet improves by simplification of the magnet structure. And the weight of the superconducting magnet and the energy consumption of the on-board cryocooler will decrease. Therefore, we examined the possibility on application of the 2G wire with a high critical current density in a high magnetic field. We performed numerical analysis regarding the weight of a superconducting magnet and the energy consumption of an on-board cryocooler in consideration of the characteristics of the 2G wire. Furthermore, we have carried out the I c measurement for the commercial 2G wires under various experimental conditions such as temperature, magnetic field strength and angle. We also performed the trial manufacture and evaluation of I c characteristics for the small race track-shaped superconducting coil.

Preliminary study of HTS magnet using 2G wires for maglev train

International Nuclear Information System (INIS)

Ogata, Masafumi; Miyazaki, Yoshiki; Hasegawa, Hitoshi; Sasakawa, Takashi; Nagashima, Ken

2010-01-01

There are several advantages by applying a high temperature superconducting wire to an on-board superconducting magnet for the maglev train. At first, an increase of thermal capacity of superconducting coils contributes a stability of the superconducting state of the coils. In addition, a reliability of superconducting magnet improves by simplification of the magnet structure. And the weight of the superconducting magnet and the energy consumption of the on-board cryocooler will decrease. Therefore, we examined the possibility on application of the 2G wire with a high critical current density in a high magnetic field. We performed numerical analysis regarding the weight of a superconducting magnet and the energy consumption of an on-board cryocooler in consideration of the characteristics of the 2G wire. Furthermore, we have carried out the I c measurement for the commercial 2G wires under various experimental conditions such as temperature, magnetic field strength and angle. We also performed the trial manufacture and evaluation of I c characteristics for the small race track-shaped superconducting coil.

Basic study of HTS magnet using 2G wires for maglev train

Energy Technology Data Exchange (ETDEWEB)

Ogata, M., E-mail: ogata@rtri.or.j [Railway Technical Research Institute, 2-8-38, Hikari-cho, Kokubunji-shi, Tokyo 185-8540 (Japan); Miyazaki, Y.; Hasegawa, H.; Sasakawa, T.; Nagashima, K. [Railway Technical Research Institute, 2-8-38, Hikari-cho, Kokubunji-shi, Tokyo 185-8540 (Japan)

2010-11-01

There are several advantages by applying a high-temperature superconducting wire to an on-board superconducting magnet for the maglev train. At first, an increase of thermal capacity of superconducting coils contributes a stability of the superconducting state of the coils. In addition, a reliability of superconducting magnet improves by simplification of the magnet structure. And the weight of the superconducting magnet and the energy consumption of the on-board cryocooler will decrease. Therefore, we examined the possibility on application of the 2G wire with a high critical current density in a high magnetic field. We performed numerical analysis regarding the weight of a superconducting magnet and the energy consumption of an on-board cryocooler in consideration of the characteristics of the 2G wire. Furthermore, we have carried out the I{sub c} measurement for the commercial 2G wires under various experimental conditions such as temperature, magnetic field strength and angle. We also performed the trial manufacture and evaluation of I{sub c} characteristics for the small race track-shaped superconducting coil.

Preliminary study of HTS magnet using 2G wires for maglev train

Energy Technology Data Exchange (ETDEWEB)

Ogata, Masafumi; Miyazaki, Yoshiki; Hasegawa, Hitoshi; Sasakawa, Takashi; Nagashima, Ken, E-mail: ogata@rtri.or.j [Railway Technical Research Institute, Hikari-cho 2-8-38, Kokubunji-shi, Tokyo (Japan)

2010-06-01

There are several advantages by applying a high temperature superconducting wire to an on-board superconducting magnet for the maglev train. At first, an increase of thermal capacity of superconducting coils contributes a stability of the superconducting state of the coils. In addition, a reliability of superconducting magnet improves by simplification of the magnet structure. And the weight of the superconducting magnet and the energy consumption of the on-board cryocooler will decrease. Therefore, we examined the possibility on application of the 2G wire with a high critical current density in a high magnetic field. We performed numerical analysis regarding the weight of a superconducting magnet and the energy consumption of an on-board cryocooler in consideration of the characteristics of the 2G wire. Furthermore, we have carried out the I{sub c} measurement for the commercial 2G wires under various experimental conditions such as temperature, magnetic field strength and angle. We also performed the trial manufacture and evaluation of I{sub c} characteristics for the small race track-shaped superconducting coil.

Regulation of Drosophila Brain Wiring by Neuropil Interactions via a Slit-Robo-RPTP Signaling Complex.

Science.gov (United States)

Oliva, Carlos; Soldano, Alessia; Mora, Natalia; De Geest, Natalie; Claeys, Annelies; Erfurth, Maria-Luise; Sierralta, Jimena; Ramaekers, Ariane; Dascenco, Dan; Ejsmont, Radoslaw K; Schmucker, Dietmar; Sanchez-Soriano, Natalia; Hassan, Bassem A

2016-10-24

The axonal wiring molecule Slit and its Round-About (Robo) receptors are conserved regulators of nerve cord patterning. Robo receptors also contribute to wiring brain circuits. Whether molecular mechanisms regulating these signals are modified to fit more complex brain wiring processes is unclear. We investigated the role of Slit and Robo receptors in wiring Drosophila higher-order brain circuits and identified differences in the cellular and molecular mechanisms of Robo/Slit function. First, we find that signaling by Robo receptors in the brain is regulated by the Receptor Protein Tyrosine Phosphatase RPTP69d. RPTP69d increases membrane availability of Robo3 without affecting its phosphorylation state. Second, we detect no midline localization of Slit during brain development. Instead, Slit is enriched in the mushroom body, a neuronal structure covering large areas of the brain. Thus, a divergent molecular mechanism regulates neuronal circuit wiring in the Drosophila brain, partly in response to signals from the mushroom body. Copyright © 2016 The Authors. Published by Elsevier Inc. All rights reserved.

Josephson junction arrays and superconducting wire networks

International Nuclear Information System (INIS)

Lobb, C.J.

1992-01-01

Techniques used to fabricate integrated circuits make it possible to construct superconducting networks containing as many as 10 6 wires or Josephson junctions. Such networks undergo phase transitions from resistive high-temperature states to ordered low-resistance low-temperature states. The nature of the phase transition depends strongly on controllable parameters such as the strength of the superconductivity in each wire or junction and the external magnetic field. This paper will review the physics of these phase transitions, starting with the simplest zero-magnetic field case. This leads to a Kosterlitz-Thouless transition when the junctions or wires are weak, and a simple mean-field fransition when the junctions or wires are strong. Rich behavior, resulting from frustration, occurs in the presence of a magnetic field. (orig.)

Wire Array Photovoltaics

Science.gov (United States)

Turner-Evans, Dan

Over the past five years, the cost of solar panels has dropped drastically and, in concert, the number of installed modules has risen exponentially. However, solar electricity is still more than twice as expensive as electricity from a natural gas plant. Fortunately, wire array solar cells have emerged as a promising technology for further lowering the cost of solar. Si wire array solar cells are formed with a unique, low cost growth method and use 100 times less material than conventional Si cells. The wires can be embedded in a transparent, flexible polymer to create a free-standing array that can be rolled up for easy installation in a variety of form factors. Furthermore, by incorporating multijunctions into the wire morphology, higher efficiencies can be achieved while taking advantage of the unique defect relaxation pathways afforded by the 3D wire geometry. The work in this thesis shepherded Si wires from undoped arrays to flexible, functional large area devices and laid the groundwork for multijunction wire array cells. Fabrication techniques were developed to turn intrinsic Si wires into full p-n junctions and the wires were passivated with a-Si:H and a-SiNx:H. Single wire devices yielded open circuit voltages of 600 mV and efficiencies of 9%. The arrays were then embedded in a polymer and contacted with a transparent, flexible, Ni nanoparticle and Ag nanowire top contact. The contact connected >99% of the wires in parallel and yielded flexible, substrate free solar cells featuring hundreds of thousands of wires. Building on the success of the Si wire arrays, GaP was epitaxially grown on the material to create heterostructures for photoelectrochemistry. These cells were limited by low absorption in the GaP due to its indirect bandgap, and poor current collection due to a diffusion length of only 80 nm. However, GaAsP on SiGe offers a superior combination of materials, and wire architectures based on these semiconductors were investigated for multijunction

t matrix of metallic wire structures

International Nuclear Information System (INIS)

Zhan, T. R.; Chui, S. T.

2014-01-01

To study the electromagnetic resonance and scattering properties of complex structures of which metallic wire structures are constituents within multiple scattering theory, the t matrix of individual structures is needed. We have recently developed a rigorous and numerically efficient equivalent circuit theory in which retardation effects are taken into account for metallic wire structures. Here, we show how the t matrix can be calculated analytically within this theory. We illustrate our method with the example of split ring resonators. The density of states and cross sections for scattering and absorption are calculated, which are shown to be remarkably enhanced at resonant frequencies. The t matrix serves as the basic building block to evaluate the interaction of wire structures within the framework of multiple scattering theory. This will open the door to efficient design and optimization of assembly of wire structures

Removing lead from metallic mixture of waste printed circuit boards by vacuum distillation: factorial design and removal mechanism.

Science.gov (United States)

Li, Xingang; Gao, Yujie; Ding, Hui

2013-10-01

The lead removal from the metallic mixture of waste printed circuit boards by vacuum distillation was optimized using experimental design, and a mathematical model was established to elucidate the removal mechanism. The variables studied in lead evaporation consisted of the chamber pressure, heating temperature, heating time, particle size and initial mass. The low-level chamber pressure was fixed at 0.1 Pa as the operation pressure. The application of two-level factorial design generated a first-order polynomial that agreed well with the data for evaporation efficiency of lead. The heating temperature and heating time exhibited significant effects on the efficiency, which was validated by means of the copper-lead mixture experiments. The optimized operating conditions within the region studied were the chamber pressure of 0.1 Pa, heating temperature of 1023 K and heating time of 120 min. After the conditions were employed to remove lead from the metallic mixture of waste printed circuit boards, the efficiency was 99.97%. The mechanism of the effects was elucidated by mathematical modeling that deals with evaporation, mass transfer and condensation, and can be applied to a wider range of metal removal by vacuum distillation. Copyright © 2013 Elsevier Ltd. All rights reserved.

High-speed test of SFQ-shift register files using PTL wiring

International Nuclear Information System (INIS)

Fujiwara, K.; Yamashiro, Y.; Yoshikawa, N.; Hashimoto, Y.; Yorozu, S.; Terai, H.; Fujimaki, A.

2004-01-01

We have been developing an SFQ shift register memory, which is one candidate to realize high-throughput and high-density superconductive memories. We have modified our memory architecture in order to adapt it to our SFQ microprocessor, CORE1. The new version of the shift register memory is composed of shift registers with non-destructive readout operation, which have an internal feedback. We have also studied the availability of passive transmission line (PTL) wiring in the memory system at high speed. The tested circuit is a 4-byte shift register file, where four kinds of wiring circuits are used between a decoder and shift registers. We have measured the dependences of the DC bias margin on the operating frequency for all wiring methods, and obtained almost the same dependences, which shows the availability of the PTL wiring in the memory system. We have used the NEC 2.5 kA/cm 2 Nb standard process and the CONNECT cell library

Exhaust constituent emission factors of printed circuit board pyrolysis processes and its exhaust control

Energy Technology Data Exchange (ETDEWEB)

Chiang, Hung-Lung, E-mail: hlchiang@mail.cmu.edu.tw [Department of Health Risk Management, China Medical University, Taichung, Taiwan (China); Lin, Kuo-Hsiung [Department of Environmental Engineering and Science, Fooyin University, Kaohsiung, Taiwan (China)

2014-01-15

Highlights: • Recycling of waste printed circuit boards is an important issue. • Pyrolysis is an emerging technology for PCB treatment. • Emission factors of VOCs are determined for PCB pyrolysis exhaust. • Iron-Al{sub 2}O{sub 3} catalyst was employed for the exhaust control. -- Abstract: The printed circuit board (PCB) is an important part of electrical and electronic equipment, and its disposal and the recovery of useful materials from waste PCBs (WPCBs) are key issues for waste electrical and electronic equipment. Waste PCB compositions and their pyrolysis characteristics were analyzed in this study. In addition, the volatile organic compound (VOC) exhaust was controlled by an iron-impregnated alumina oxide catalyst. Results indicated that carbon and oxygen were the dominant components (hundreds mg/g) of the raw materials, and other elements such as nitrogen, bromine, and copper were several decades mg/g. Exhaust constituents of CO, H{sub 2}, CH{sub 4}, CO{sub 2}, and NOx, were 60–115, 0.4–4.0, 1.1–10, 30–95, and 0–0.7 mg/g, corresponding to temperatures ranging from 200 to 500 °C. When the pyrolysis temperature was lower than 300 °C, aromatics and paraffins were the major species, contributing 90% of ozone precursor VOCs, and an increase in the pyrolysis temperature corresponded to a decrease in the fraction of aromatic emission factors. Methanol, ethylacetate, acetone, dichloromethane, tetrachloromethane and acrylonitrile were the main species of oxygenated and chlorinated VOCs. The emission factors of some brominated compounds, i.e., bromoform, bromophenol, and dibromophenol, were higher at temperatures over 400 °C. When VOC exhaust was flowed through the bed of Fe-impregnated Al{sub 2}O{sub 3}, the emission of ozone precursor VOCs could be reduced by 70–80%.

Feasibility studies on the direct wire readout on wire scanners in electron accelerators

International Nuclear Information System (INIS)

Markert, Michael

2010-10-01

This bachelor thesis deals essentially with the signal processing of a so-called wire scanner, a special monitor, which comes to application in the beam diagnostics of particle accelerators. In this direct wire readout the voltage signal, which is induced by the particle beam in the measurement wire of the wire scanner, shall be directly read out. The aim of this thesis is to show fundamental considerations and perform studies, which study, whether and how in the future by means of a suited data transmission as well as readout electronics conclusion on the most important parameters of the beam, like position and profile, are possible. The measurement system presented here is divided in three main components: Signal measurement, signal preparation, and signal stretching. A suited test facility was developed and is presented in detail, in which then all components, like for instance the transmission cables, the wire-scanner fork, and the developed measurement circuit, are studied, which are of importance for a faultless signal transmission and presentation. Extensive measurements on the single components, as well as calculations for the signal transmission on and in the wire scanner were performed, whereby a good agreement could be found. Thereafter a comparison and a selection of the component used in this project were made. Furthermore improvement proposals, new constructions, and outlooks are presented, which could be of importance in further works.

An interconnecting bus power optimization method combining interconnect wire spacing with wire ordering

International Nuclear Information System (INIS)

Zhu Zhang-Ming; Hao Bao-Tian; En Yun-Fei; Yang Yin-Tang; Li Yue-Jin

2011-01-01

On-chip interconnect buses consume tens of percents of dynamic power in a nanometer scale integrated circuit and they will consume more power with the rapid scaling down of technology size and continuously rising clock frequency, therefore it is meaningful to lower the interconnecting bus power in design. In this paper, a simple yet accurate interconnect parasitic capacitance model is presented first and then, based on this model, a novel interconnecting bus optimization method is proposed. Wire spacing is a process for spacing wires for minimum dynamic power, while wire ordering is a process that searches for wire orders that maximally enhance it. The method, i.e., combining wire spacing with wire ordering, focuses on bus dynamic power optimization with a consideration of bus performance requirements. The optimization method is verified based on various nanometer technology parameters, showing that with 50% slack of routing space, 25.71% and 32.65% of power can be saved on average by the proposed optimization method for a global bus and an intermediate bus, respectively, under a 65-nm technology node, compared with 21.78% and 27.68% of power saved on average by uniform spacing technology. The proposed method is especially suitable for computer-aided design of nanometer scale on-chip buses. (interdisciplinary physics and related areas of science and technology)

MIP Plasma Decapsulation of Copper-wired Semiconductor Devices for Failure Analysis

NARCIS (Netherlands)

Tang, J.

2014-01-01

The majority of Integrated Circuit (IC) devices are encapsulated in wire-bonded plastic IC packages. Epoxy molding compound is used as the encapsulation material and gold was used as the bonding wire material. However, the increase of gold material price from 400 USD/ounce in year 2005 to 1400

A quick solution, made to measure; Big scientific experiments need big circuit boards and that's where East Kilbride's D-TACQ comes in

CERN Multimedia

Gardner, D

2003-01-01

D-TACQ is a small electronics company operating in a highly-specialised market with technological expertise that few can match worldwide. It specialises in designing and manufacturing bespoke printed circuit boards (PCBs) which handle data acquisition tasks linked to scientific instrumentation and control systems (1 page).

Humidification during high-frequency oscillation ventilation is affected by ventilator circuit and ventilatory setting.

Science.gov (United States)

Chikata, Yusuke; Imanaka, Hideaki; Onishi, Yoshiaki; Ueta, Masahiko; Nishimura, Masaji

2009-08-01

High-frequency oscillation ventilation (HFOV) is an accepted ventilatory mode for acute respiratory failure in neonates. As conventional mechanical ventilation, inspiratory gas humidification is essential. However, humidification during HFOV has not been clarified. In this bench study, we evaluated humidification during HFOV in the open circumstance of ICU. Our hypothesis is that humidification during HFOV is affected by circuit design and ventilatory settings. We connected a ventilator with HFOV mode to a neonatal lung model that was placed in an infant incubator set at 37 degrees C. We set a heated humidifier (Fisher & Paykel) to obtain 37 degrees C at the chamber outlet and 40 degrees C at the distal temperature probe. We measured absolute humidity and temperature at the Y-piece using a rapid-response hygrometer. We evaluated two types of ventilator circuit: a circuit with inner heating wire and another with embedded heating element. In addition, we evaluated three lengths of the inspiratory limb, three stroke volumes, three frequencies, and three mean airway pressures. The circuit with embedded heating element provided significantly higher absolute humidity and temperature than one with inner heating wire. As an extended tube lacking a heating wire was shorter, absolute humidity and temperature became higher. In the circuit with inner heating wire, absolute humidity and temperature increased as stroke volume increased. Humidification during HFOV is affected by circuit design and ventilatory settings.

A New Flying Wire System for the Tevatron

Science.gov (United States)

Blokland, Willem; Dey, Joseph; Vogel, Greg

1997-05-01

A new Flying Wires system replaces the old system to enhance the analysis of the beam emittance, improve the reliability, and handle the upcoming upgrades of the Tevatron. New VME data acquisition modules and timing modules allow for more bunches to be sampled more precisely. The programming language LabVIEW, running on a Macintosh computer, controls the VME modules and the nuLogic motion board that flies the wires. LabVIEW also analyzes and stores the data, and handles local and remote commands. The new system flies three wires and fits profiles of 72 bunches to a gaussian function within two seconds. A new console application operates the flying wires from any control console. This paper discusses the hardware and software setup, the capabilities and measurement results of the new Flying Wires system.

Photovoltaic Bias Generator

Science.gov (United States)

2018-02-01

Department of the Army position unless so designated by other authorized documents. Citation of manufacturer’s or trade names does not constitute an... Interior view of the photovoltaic bias generator showing wrapped-wire side of circuit board...3 Fig. 4 Interior view of the photovoltaic bias generator showing component side of circuit board

Circuit Formation by Spatio-Temporal Control of Messenger RNA ...

International Development Research Centre (IDRC) Digital Library (Canada)

The connections inside the brain need to be wired in a precise manner during development to ensure its proper function. This project will provide insight into circuit formation to help us understand how axon regeneration can improve clinical outcomes. Brain wiring, damage, and developmental defects Researchers have ...

PHYSICAL CHEMISTRY CHARACTERIZATION OF PRINTED CIRCUIT BOARD OF MOBILE PHONES

Directory of Open Access Journals (Sweden)

Hellington Bastos da Silva de Sant’ana

2015-07-01

Full Text Available Nowadays, electronics industry is the leading sector in developing new technologies. These new technologies lead to cheaper products increasing the consumption. The lifetime of such products is relatively short and soon it becomes waste, known as electronic waste. Cell phone is a common electronic waste. This waste represents an interesting raw material, because it contains large amount of base metals, considerable amount of valuable metals and also those dangerous. In this work, the electronic waste was submitted to mechanical processing: initially the devices were separated into two categories, as year of release (2002 and disassembled manually. The printed circuit boards were milled below 1 mm and then submitted to density and magnetic separation processes. The fractions obtained during the mechanical processing were characterized by chemical analysis. Using mechanical processing it was possible to obtain metal fractions of 80 wt%. A leaching test was carried out to determine if a waste needs to be managed as a hazardous; so that, cell phone waste must be considered in the category of hazardous residue because the lead concentration was above the limit established by Brazilian Standards

Application of Copper Cladding Aluminum Composites in UHV Portable Earthing and Short-circuiting Wires

Directory of Open Access Journals (Sweden)

Zhu Jianjun

2018-01-01

Full Text Available Aiming at the heavy weight and inconvenience when carrying and installing copper earthing wires on the UHV transmission lines, in this paper, we present the use of copper clad aluminum(CCA composite materials as a lightweight method for UHV earthing wire conductor. Theoretical calculations and tests of the fusing current in a short time for copper and CCA material are conducted. The results show that the theoretical value of the earthing wire conductor's fusing current corresponds with the test value on condition of the conductor cross section greater than 4mm2 as well as fusing time less than 1.5s. The CCA-10 earthing wires get 36.2% weight reduction compared with copper wires.

Vibrating wire for beam profile scanning

Directory of Open Access Journals (Sweden)

S. G. Arutunian

1999-12-01

Full Text Available A method that measures the transverse profile (emittance of the bunch by detecting radiation arising at the scattering of the bunch on scanning wire is widely used. In this work information about bunch scattering is obtained by measuring the oscillation frequency of the tightened scanning wire. In such a way, the system of radiation (or secondary particles extraction and measurement can be removed. The entire unit consists of a compact fork with tightened wire and a scanning system. Normal oscillation frequency of a wire depends on wire tension, its geometric parameters, and, in a second approximation, its elastic characteristics. Normal oscillations are generated by interaction of an alternating current through the wire with magnetic field of a permanent magnet. In this case, it is suggested that the magnetic field of the accelerator (field of dipole magnets or quadrupole magnets be used for excitation of oscillations. The dependence of oscillation frequency on beam scattering is determined by several factors, including changes of wire tension caused by transverse force of the beam and influence of beam self-field. Preliminary calculations show that the influence of wire heating will dominate. We have studied strain gauges on the basis of vibrating wire from various materials (tungsten, beryl bronze, and niobium zirconium alloys. A scheme of normal oscillation generation by alternating current in autogeneration circuit with automatic frequency adjustment was selected. A special method of wire fixation and elimination of transverse degrees of freedom allows us to achieve relative stability better than 10^{-5} during several days at a relative resolution of 10^{-6}. Experimental results and estimates of wire heating of existing scanners show that the wire heats up to a few hundred grades, which is enough for measurements. The usage of wire of micrometer thickness diminishes the problem of wire thermalization speed during the scanning of the bunch.

Modified coaxial wire method for measurement of transfer impedance of beam position monitors

Science.gov (United States)

Kumar, Mukesh; Babbar, L. K.; Deo, R. K.; Puntambekar, T. A.; Senecha, V. K.

2018-05-01

The transfer impedance is a very important parameter of a beam position monitor (BPM) which relates its output signal with the beam current. The coaxial wire method is a standard technique to measure transfer impedance of the BPM. The conventional coaxial wire method requires impedance matching between coaxial wire and external circuits (vector network analyzer and associated cables). This paper presents a modified coaxial wire method for bench measurement of the transfer impedance of capacitive pickups like button electrodes and shoe box BPMs. Unlike the conventional coaxial wire method, in the modified coaxial wire method no impedance matching elements have been used between the device under test and the external circuit. The effect of impedance mismatch has been solved mathematically and a new expression of transfer impedance has been derived. The proposed method is verified through simulation of a button electrode BPM using cst studio suite. The new method is also applied to measure transfer impedance of a button electrode BPM developed for insertion devices of Indus-2 and the results are also compared with its simulations. Close agreement between measured and simulation results suggests that the modified coaxial wire setup can be exploited for the measurement of transfer impedance of capacitive BPMs like button electrodes and shoe box BPM.

Modified coaxial wire method for measurement of transfer impedance of beam position monitors

Directory of Open Access Journals (Sweden)

Mukesh Kumar

2018-05-01

Full Text Available The transfer impedance is a very important parameter of a beam position monitor (BPM which relates its output signal with the beam current. The coaxial wire method is a standard technique to measure transfer impedance of the BPM. The conventional coaxial wire method requires impedance matching between coaxial wire and external circuits (vector network analyzer and associated cables. This paper presents a modified coaxial wire method for bench measurement of the transfer impedance of capacitive pickups like button electrodes and shoe box BPMs. Unlike the conventional coaxial wire method, in the modified coaxial wire method no impedance matching elements have been used between the device under test and the external circuit. The effect of impedance mismatch has been solved mathematically and a new expression of transfer impedance has been derived. The proposed method is verified through simulation of a button electrode BPM using cst studio suite. The new method is also applied to measure transfer impedance of a button electrode BPM developed for insertion devices of Indus-2 and the results are also compared with its simulations. Close agreement between measured and simulation results suggests that the modified coaxial wire setup can be exploited for the measurement of transfer impedance of capacitive BPMs like button electrodes and shoe box BPM.

Assembly of Nanoscale Organic Single-Crystal Cross-Wire Circuits

DEFF Research Database (Denmark)

Bjørnholm, Thomas

2009-01-01

Organic single-crystal transistors and circuits can be assembled by nanomechanical manipulation of nanowires of CuPc, F(16)CuPc, and SnO(2):Sb. The crossed bar devices have low operational voltage, high mobility and are stable in air. They can be combined into circuits, providing varied functions...... including inverters and NOR and NAND logic gates, opening new opportunities for organic nanoelectronics and highly sophisticated integrated logic devices....

Wire measurement of impedance of an X-band accelerating structure

CERN Document Server

Baboi, N; Dolgashev, V A; Jones, R M; Lewandowski, J R; Tantawi, S G; Wang, J W

2004-01-01

Several tens of thousands of accelerator structures will be needed for the next generation of linear collders known as the GLC/NLC (Global Linear Collider/Next Linear Collider). To prevent the beam being driven into a disruptive BBU (Beam Break Up) mode or at the very least, the emittance being signifcantly diluted, it is important to damp down the wakefield left by driving bunches to a manageable level. Manufacturing errors and errors in design need to be measurable and compared with predictions. We develop a circuit model of wire-loaded X-band accelerator structures. This enables the wakefield (the inverse transform of the beam impedance) to be readily computed and compared with the wire measurement. We apply this circuit model to the latest series of accelerating for the GLC/NLC. This circuit model is based upon the single-cell model developed in [1] extended here to complete, multi-cell structures.

Computational algorithms for analysis of data from thin-film thermoresistors on a radio-electronic printed circuit board

International Nuclear Information System (INIS)

Korneeva, Anna; Shaydurov, Vladimir

2016-01-01

In the paper, the data analysis is considered for thin-film thermoresistors coated on to a radio-electronic printed circuit board to determine possible zones of its overheating. A mathematical model consists in an underdetermined system of linear algebraic equations with an infinite set of solutions. For computing a more real solution, two additional conditions are used: the smoothness of a solution and the positiveness of an increase of temperature during overheating. Computational experiments demonstrate that an overheating zone is determined exactly with a tolerable accuracy of temperature in it.

Adhesion and failure analysis of metal-polymer interface in flexible printed circuits boards

Science.gov (United States)

Park, Sanghee; Kim, Ye Chan; Choi, Kisuk; Chae, Heeyop; Suhr, Jonghwan; Nam, Jae-Do

2017-12-01

As device miniaturization in microelectronics is currently requested in the development of high performance device, which usually include highly-integrated metal-polyimide multilayer structures. A redistribution layer (RDL) process is currently emerging as one of the most advance fabrication techniques for on-chip interconnect and packaging. One of the major issues in this process is the poor adhesion of the metal-polyimide interfaces particularly in flexible circuit boards due to the flexibility and bendability of devices. In this study, low pressure O2 plasma treatment was investigated to improve the adhesion of metal-polyimide interfaces, using inductively coupled plasma (ICP) treatment. We identified that the adhesion of metal-polyimide interfaces was greatly improved by the surface roughness control providing 46.1 MPa of shear force in the ball shear test after O2 plasma treatment, compared 14.2 MPa without O2 plasma treatment. It was seemingly due to the fact that the adhesion in metal-polyimide interfaces was improved by a chemical conversion of C=O to C-O bonds and by a ring opening reaction of imide groups, which was confirmed with FT-IR analysis. In the finite element numerical analysis of metal-polyimide interfaces, the O2 plasma treated interface showed that the in-plane stress distribution and the vertical directional deformation agreed well with real failure modes in flexible circuits manufacturing.

Waste printed circuit board recycling techniques and product utilization

International Nuclear Information System (INIS)

Hadi, Pejman; Xu, Meng; Lin, Carol S.K.; Hui, Chi-Wai; McKay, Gordon

2015-01-01

Highlights: • There is a major environmental issue about the printed circuit boards throughout the world. • Different physical and chemical recycling techniques have been reviewed. • Nonmetallic fraction of PCBs is the unwanted face of this waste stream. • Several applications of the nonmetallic fraction of waste PCBs have been introduced. - Abstract: E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly “recycling” has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined

Waste printed circuit board recycling techniques and product utilization

Energy Technology Data Exchange (ETDEWEB)

Hadi, Pejman; Xu, Meng [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Lin, Carol S.K. [School of Energy and Environment, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong Special Administrative Region (Hong Kong); Hui, Chi-Wai [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); McKay, Gordon, E-mail: kemckayg@ust.hk [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Division of Sustainable Development, College of Science, Engineering and Technology, Hamad Bin Khalifa University, Qatar Foundation, Doha (Qatar)

2015-02-11

Highlights: • There is a major environmental issue about the printed circuit boards throughout the world. • Different physical and chemical recycling techniques have been reviewed. • Nonmetallic fraction of PCBs is the unwanted face of this waste stream. • Several applications of the nonmetallic fraction of waste PCBs have been introduced. - Abstract: E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly “recycling” has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined.

Physical packaging and organization of the drift chamber electronics system for the Stanford Large Detector

International Nuclear Information System (INIS)

Haller, G.M.; Freytag, M.L.; Mazaheri, G.; Olsen, J.; Paffrath, L.

1990-10-01

In this paper the logical organization, physical packaging, and operation of the drift chamber electronics for the SLD at SLAC is described. The system processes signals from approximately 7000 drift wires and is unusual in that most electronic functions are packaged on printed circuit boards within the detector. The circuits reside on signal-processing motherboards, controller boards, signal-transition boards, power-distribution boards, and fiber-optics-to-electrical conversion boards. The interaction and interconnection of these boards with respect to signal and control flow are presented. 11 refs., 7 figs

Advanced circuit simulation using Multisim workbench

CERN Document Server

Báez-López, David; Cervantes-Villagómez, Ofelia Delfina

2012-01-01

Multisim is now the de facto standard for circuit simulation. It is a SPICE-based circuit simulator which combines analog, discrete-time, and mixed-mode circuits. In addition, it is the only simulator which incorporates microcontroller simulation in the same environment. It also includes a tool for printed circuit board design.Advanced Circuit Simulation Using Multisim Workbench is a companion book to Circuit Analysis Using Multisim, published by Morgan & Claypool in 2011. This new book covers advanced analyses and the creation of models and subcircuits. It also includes coverage of transmissi

Design and implementation of a hybrid circuit system for micro sensor signal processing

International Nuclear Information System (INIS)

Wang Zhuping; Chen Jing; Liu Ruqing

2011-01-01

This paper covers a micro sensor analog signal processing circuit system (MASPS) chip with low power and a digital signal processing circuit board implementation including hardware connection and software design. Attention has been paid to incorporate the MASPS chip into the digital circuit board. The ultimate aim is to form a hybrid circuit used for mixed-signal processing, which can be applied to a micro sensor flow monitoring system. (semiconductor integrated circuits)

Unit: Electric Circuits, Inspection Pack, National Trial Print.

Science.gov (United States)

Australian Science Education Project, Toorak, Victoria.

As a part of the unit materials in the series produced by the Australian Science Education Project, this teacher edition is primarily composed of a core relating to simple circuits, a test form, and options. Options are given under the headings: Your Invention; "How Long Does a Call Last?"; One, Two, Three Wires; Parallel Circuits; More…

Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

International Nuclear Information System (INIS)

Ortuño, Nuria; Conesa, Juan A.; Moltó, Julia; Font, Rafael

2014-01-01

The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO 2005 -TEQ/kg sample, corresponding to the sample with and without metals, respectively. - Highlights: • Thermal decomposition of printed circuit boards (with and without metals) is studied. • Important differences were found at the different experimental conditions. • Emission of brominated pollutants is much higher than that of chlorinated. • Metal enhances emission of halogenated compounds. • An increase in the temperature produces the destruction of pollutants

Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: a case study of electronic component factory

Directory of Open Access Journals (Sweden)

Sakulkaew Srisang

2014-09-01

Full Text Available The objective of this research is a reduction of an adhesive stain defect in flexible printed circuit board in hot pressing process, the electronic factory. The manufacturing have been processing by sheet type of products with ninety-six pieces of flexible printed circuit boards. Causes of the problem include the before and internal hot pressing process. In process beginning times, the most right row of products between the cooling plate and the hot pressing machine has temperature 71.2◦C that is higher than glass transition temperature (Tg 60◦C. Those products’ temperature lead to evaporate a polyimide adhesive before hot pressing process beginning. The internal hot pressing process include the preheat times and the pressure time. In the preheat time the problem is a gap between lower and upper plate, was under specification(Under 1 mm and leaded to adhesive polyimide stain. In the actuality this time requires temperature and low pressure that mean a gap within 1 – 2 mm (between lower and upper plate. In pressure times the hot pressing plate surface is not flat and products are pressed by insufficient force that it lead to generate an adhesive stain on flexible printed circuit boards. That force is measured by the pre-scale paper and a result, RGB color, is provided. And then color density (From standard color sample and RGB color (From pre-scale paper is found out the relation by Photoshop program and multiple regression theory using. The formula is applied to compare with defect so as to find out the suitable color density (Defects reducing. The solving solutions is provided including the gap reduced adjustment between cooling plate and hot pressing machine before hot pressing process, the plate adjustment within specification in the preheat time and the pressing plate polishing in the pressure time. Results of study and solving are provide defect reduction from 24.4 percentage to 7.2 percentage of total study product.

Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: A case study of electronic component factory

Directory of Open Access Journals (Sweden)

Sakulkaew Srisang

2015-03-01

Full Text Available The objective of this research is a reduction of an adhesive stain defect in flexible printed circuit board in hot pressing process, the electronic factory. The manufacturing have been processing by sheet type of products with ninety-six pieces of flexible printed circuit boards. Causes of the problem include the before and internal hot pressing process. In process beginning times, the most right row of products between the cooling plate and the hot pressing machine has temperature 71.2◦C that is higher than glass transition temperature (Tg 60◦C. Those products’ temperature lead to evaporate a polyimide adhesive before hot pressing process beginning. The internal hot pressing process include the preheat times and the pressure time. In the preheat time the problem is a gap between lower and upper plate, was under specification (Under 1 mm and leaded to adhesive polyimide stain. In the actuality this time requires temperature and low pressure that mean a gap within 1 – 2 mm (between lower and upper plate. In pressure times the hot pressing plate surface is not flat and products are pressed by insufficient force that it lead to generate an adhesive stain on flexible printed circuit boards. That force is measured by the pre-scale paper and a result, RGB color, is provided. And then color density (From standard color sample and RGB color (From pre-scale paper is found out the relation by Photoshop program and multiple regression theory using. The formula is applied to compare with defect so as to find out the suitable color density (Defects reducing. The solving solutions is provided including the gap reduced adjustment between cooling plate and hot pressing machine before hot pressing process, the plate adjustment within specification in the preheat time and the pressing plate polishing in the pressure time. Results of study and solving are provide defect reduction from 24.4 percentage to 7.2 percentage of total study product.

Single-track handshake signaling with application to micropipelines and handshake circuits

NARCIS (Netherlands)

Berkel, van C.H.; Bink, A.J.

1996-01-01

Single-track handshake signaling is using the same wire for request and acknowledge signaling. After each 2-phase handshake the wire is back in its initial state. A sequence of three protocol definitions suggests both a design method for single-track circuits and a trade-off between their robustness

Lunar Module Wiring Design Considerations and Failure Modes

Science.gov (United States)

Interbartolo, Michael

2009-01-01

This slide presentation reviews the considerations for the design of wiring for the Lunar Module. Included are a review of the choice of conductors and insulations, the wire splicing (i.e., crimping, and soldering), the wire connectors, and the fabrication of the wire harnesses. The problems in fabrication include the wires being the wrong length, the damage due to the sharp edges, the requried use of temproary protective covers and inadequate training. The problems in the wire harness installation include damge from sharp eges, work on adjacent harnesses, connector damage, and breaking wires. Engineering suggestions from the Apollo-era in reference to the conductors that are reviewed include: the use of plated conductors, and the use of alloys for stronger wiring. In refernce to insulation, the suggestions from Apollo era include the use of polymer tape-wrap wire insulation due to the light weight, however, other types of modern insulation might be more cost-effective. In reference to wire splices and terminal boards the suggestions from the Apollo Era include the use of crimp splices as superior to solder splices, joining multiple wire to a common point using modular plug-ins might be more reliable, but are heavier than crimp splicing. For connectors, the lessons from the Apollo era indicate that a rear environmental seal that does not require additional potting is preferred, and pins should be crimped or welded to the incoming wires and be removable from the rear of the connector.

Integration of microelectronic chips in microfluidic systems on printed circuit board

International Nuclear Information System (INIS)

Burdallo, I; Jimenez-Jorquera, C; Fernández-Sánchez, C; Baldi, A

2012-01-01

A new scheme for the integration of small semiconductor transducer chips with microfluidic structures on printed circuit board (PCB) is presented. The proposed approach is based on a packaging technique that yields a large and flat area with small and shallow (∼44 µm deep) openings over the chips. The photocurable encapsulant material used, based on a diacrylate bisphenol A polymer, enables irreversible bonding of polydimethylsiloxane microfluidic structures at moderate temperatures (80 °C). This integration scheme enables the insertion of transducer chips in microfluidic systems with a lower added volume than previous schemes. Leakage tests have shown that the bonded structures withstand more than 360 kPa of pressure. A prototype microfluidic system with two detection chips, including one inter-digitated electrode (IDE) chip for conductivity and one ion selective field effect transistor (ISFET) chip for pH, has been implemented and characterized. Good electrical insulation of the chip contacts and silicon edge surfaces from the solution in the microchannels has been achieved. This integration procedure opens the door to the low-cost fabrication of complex analytical microsystems that combine the extraordinary potential of both the microfluidics and silicon microtechnology fields. (paper)

A fence with several safety wires with alarm equipment

International Nuclear Information System (INIS)

Osterburg, G.

1977-01-01

The patent claim concerns a safety arrangement for objects in the open against unauthorised interference. A fence provided with several safety wires is used for this purpose. Each wire has a piezo-electric transmitter at one end, and has a piezo-electric receiver at the other end, which converts the mechanical vibrations into electrical signals. The piezo-electric receiver is connected via an amplifier to the piezo-electric transmitter of the next wire, which initiates the latter to produce mechanical vibrations and so on, until the transmitter of the first wire is reached again, so that a closed feed-back loop is formed. An electronic evaluation circuit is connected between one of the amplfiers and the subsequent transmitter, which on loss of vibration due to touching, hold. (ORU) [de

Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

Energy Technology Data Exchange (ETDEWEB)

Ortuño, Nuria; Conesa, Juan A., E-mail: ja.conesa@ua.es; Moltó, Julia; Font, Rafael

2014-11-15

The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO{sub 2005}-TEQ/kg sample, corresponding to the sample with and without metals, respectively. - Highlights: • Thermal decomposition of printed circuit boards (with and without metals) is studied. • Important differences were found at the different experimental conditions. • Emission of brominated pollutants is much higher than that of chlorinated. • Metal enhances emission of halogenated compounds. • An increase in the temperature produces the destruction of pollutants.

Influence Of Used Bacterial Culture On Zinc And Aluminium Bioleaching From Printed Circuit Boards

Directory of Open Access Journals (Sweden)

Mrazikova Anna

2015-06-01

Full Text Available Bioleaching processes were used to solubilize metals (Cu, Ni, Zn and Al from printed circuit boards (PCBs. In this study, a PCBs-adapted pure culture of Acidithiobacillus ferrooxidans, pure culture of Acidithiobacillus thiooxidans and PCBs-adapted mixed culture of A. ferrooxidans and A. thiooxidans were used for recovery of the metals. The study showed that the mixed bacterial culture has the greatest potential to dissolve metals. The maximum metal bioleaching efficiencies were found to be 100, 92, 89 and 20% of Cu, Ni, Zn and Al, respectively. The mixed culture revealed higher bacterial stability. The main factor responsible for high metal recovery was the ability of the mixed culture to maintain the low pH during the whole process. The pure culture of A. thiooxidans had no significant effect on metal bioleaching from PCBs.

Wiring regulations in brief

CERN Document Server

Tricker, Ray

2012-01-01

Tired of trawling through the Wiring Regs?Perplexed by Part P?Confused by cables, conductors and circuits?Then look no further! This handy guide provides an on-the-job reference source for Electricians, Designers, Service Engineers, Inspectors, Builders, Students, DIY enthusiastsTopic-based chapters link areas of working practice - such as cables, installations, testing and inspection, special locations - with the specifics of the Regulations themselves. This allows quick and easy identification of the official requirements relating to the situati

Quantitative Leaching of a Spent Cell Phone Printed Circuit Board by Hydrochloric acid

Directory of Open Access Journals (Sweden)

Alafara A. Baba

2014-07-01

Full Text Available This paper presents a kinetic data on the hydrometallurgical recovery of some metal ions from a printed circuit board (PCB of a spent cell phone by hydrochloric acid leaching. The effects of acid concentration, temperature and particle diameter on the dissolution efficiency at various leaching time intervals were examined. The results of the leaching investigations showed that the powdered cell phone dissolution increases with increasing acid concentration, system temperature with decreasing particle diameter at 360 rpm. With 2M HCl solution, about 88.49% of the sample was dissolved within 120 minutes using 0.075-0.112 mm particle diameter at 800 C. The results of the study indicated that the dissolution reaction could be represented by a shrinking core model with surface chemical reaction. A value of 0.61, 60.67 kJ/mol and 12.9s-1 were calculated as reaction order, activation energy and frequency factor, respectively for the dissolution process.

Wireless and photonic high-speed communication technologies, circuits and design tools

DEFF Research Database (Denmark)

Krozer, Viktor; Johansen, Tom Keinicke; Jiang, Chenhui

2009-01-01

were reported. These communication systems present new challenges for circuit designers. The presentation will be devoted to technologies and various aspects of circuit design for 100 G applications. We will present overview on wired and wireless systems demonstrating the challenges of this research...... including design challenges, relevant trade-offs and the present bottlenecks. Different system architectures will be presented with their impact on component requirements. Similarities and differences of wired and wireless applications will be pointed out. Design methodologies, necessary tools and circuit...... are fundamental to emerging consumer and professional applications. These systems start to emerge as near future applications and are subject of ongoing research activities in Europe, for example within the EU FP6 GIBON project. Wireless systems with over 100 GHz carriers as well as first over 100-G fibre systems...

Circuit reliability boosted by soldering pins of disconnect plugs to sockets

Science.gov (United States)

Pierce, W. B.

1964-01-01

Where disconnect pins must be used for wiring and testing a circuit, improved system reliability is obtained by making a permanent joint between pins and sockets of the disconnect plug. After the circuit has been tested, contact points may be fused through soldering, brazing, or welding.

Board-to-Board Free-Space Optical Interconnections Passing through Boards for a Bookshelf-Assembled Terabit-Per-Second-Class ATM Switch.

Science.gov (United States)

Hirabayashi, K; Yamamoto, T; Matsuo, S; Hino, S

1998-05-10

We propose free-space optical interconnections for a bookshelf-assembled terabit-per-second-class ATM switch. Thousands of arrayed optical beams, each having a rate of a few gigabits per second, propagate vertically to printed circuit boards, passing through some boards, and are connected to arbitrary transmitters and receivers on boards by polarization controllers and prism arrays. We describe a preliminary experiment using a 1-mm-pitch 2 x 2 beam-collimator array that uses vertical-cavity surface-emitting laser diodes. These optical interconnections can be made quite stable in terms of mechanical shock and temperature fluctuation by the attachment of reinforcing frames to the boards and use of an autoalignment system.

Thermosonic wire bonding of gold wire onto copper pad using the saturated interfacial phenomena

Science.gov (United States)

Jeng, Yeau-Ren; Aoh, Jong-Hing; Wang, Chang-Ming

2001-12-01

Copper has been used to replace conventional aluminium interconnection to improve the performance of deep submicron integrated circuits. This study used the saturated interfacial phenomena found in thermosonic ball bonding of gold wire onto aluminium pad to investigate thermosonic ball bonding of gold wire onto copper pad. The effects of preheat temperatures and ultrasonic powers on the bonding force were investigated by using a thermosonic bonding machine and a shear tester. This work shows that under proper preheat temperatures, the bonding force of thermosonic wire bonding can be explained based on interfacial microcontact phenomena such as energy intensity, interfacial temperature and real contact area. It is clearly shown that as the energy intensity is increased, the shear force increases, reaches a maximum, and then decreases. After saturation, i.e. the establishment of maximum atomic bonding, any type of additional energy input will damage the bonding, decreasing the shear force. If the preheat temperature is not within the proper range, the interfacial saturation phenomenon does not exist. For a preload of 0.5 N and a welding time of 15 ms in thermosonic wire bonding of gold wire onto copper pads, a maximum shear force of about 0.33 N is found where the interfacial energy intensity equals 1.8×106 J m-2 for preheat temperatures of 150°C and 170°C. Moreover, the corresponding optimal ultrasonic power is about 110 units.

Estimation of Relative Permittivity of Printed Circuit Board with Fiber Glass Epoxy as Dielectric for UHF Applications

Directory of Open Access Journals (Sweden)

Ronal D. Montoya-Montoya

2013-11-01

Full Text Available This paper presents the results of measuring relative permittivity of fiber glass printed circuit board (PCB’s, using a rectangular resonant cavity. The relative permittivity is presented as function of frequency. To obtain resonant frequencies, the return loss was measured using a network analyzer. Relative permittivity was calculated by finding frequencies of resonant cavity modes. The results are presented in a frequency span of 1 to 3.5GHz. It was clearly shown the nonlinear behavior of the relative permittivity for the dielectric laminate evaluated, even what happens respect to the frequency of the resonant modes below and above to frequency of 2 GHz.

Extremely high frequency RF effects on electronics.

Energy Technology Data Exchange (ETDEWEB)

Loubriel, Guillermo Manuel; Vigliano, David; Coleman, Phillip Dale; Williams, Jeffery Thomas; Wouters, Gregg A.; Bacon, Larry Donald; Mar, Alan

2012-01-01

The objective of this work was to understand the fundamental physics of extremely high frequency RF effects on electronics. To accomplish this objective, we produced models, conducted simulations, and performed measurements to identify the mechanisms of effects as frequency increases into the millimeter-wave regime. Our purpose was to answer the questions, 'What are the tradeoffs between coupling, transmission losses, and device responses as frequency increases?', and, 'How high in frequency do effects on electronic systems continue to occur?' Using full wave electromagnetics codes and a transmission-line/circuit code, we investigated how extremely high-frequency RF propagates on wires and printed circuit board traces. We investigated both field-to-wire coupling and direct illumination of printed circuit boards to determine the significant mechanisms for inducing currents at device terminals. We measured coupling to wires and attenuation along wires for comparison to the simulations, looking at plane-wave coupling as it launches modes onto single and multiconductor structures. We simulated the response of discrete and integrated circuit semiconductor devices to those high-frequency currents and voltages, using SGFramework, the open-source General-purpose Semiconductor Simulator (gss), and Sandia's Charon semiconductor device physics codes. This report documents our findings.

Thermal Stability of Nanocrystalline Copper for Potential Use in Printed Wiring Board Applications

Science.gov (United States)

Woo, Patrick Kai Fai

Copper is a widely used conductor in the manufacture of printed wiring boards (PWB). The trends in miniaturization of electronic devices create increasing challenges to all electronic industries. In particular PWB manufacturers face great challenges because the increasing demands in greater performance and device miniaturization pose enormous difficulties in manufacturing and product reliability. Nanocrystalline and ultra-fine grain copper can potentially offer increased reliability and functionality of the PWB due to the increases in strength and achievable wiring density by reduction in grain size. The first part of this thesis is concerned with the synthesis and characterization of nanocrystalline and ultra-fine grain-sized copper for potential applications in the PWB industry. Nanocrystalline copper with different amounts of sulfur impurities (25-230ppm) and grain sizes (31-49nm) were produced and their hardness, electrical resistivity and etchability were determined. To study the thermal stability of nanocrystalline copper, differential scanning calorimetry and isothermal heat treatments combined with electron microscopy techniques for microstructural analysis were used. Differential scanning calorimetry was chosen to continuously monitor the grain growth process in the temperature range from 40?C to 400?C. During isothermal annealing experiments samples were annealed at 23?C, 100?C and 300?C to study various potential thermal issues for these materials in PWB applications such as the long-term room temperature thermal stability as well as for temperature excursions above the operation temperature and peak temperature exposure during the PWB manufacturing process. From all annealing experiments the various grain growth events and the overall stability of these materials were analyzed in terms of driving and dragging forces. Experimental evidence is presented which shows that the overall thermal stability, grain boundary character and texture evolution of

PUZZLE - A program for computer-aided design of printed circuit artwork

Science.gov (United States)

Harrell, D. A. W.; Zane, R.

1971-01-01

Program assists in solving spacing problems encountered in printed circuit /PC/ design. It is intended to have maximum use for two-sided PC boards carrying integrated circuits, and also aids design of discrete component circuits.

Printed circuit for ATLAS

CERN Multimedia

Laurent Guiraud

1999-01-01

A printed circuit board made by scientists in the ATLAS collaboration for the transition radiaton tracker (TRT). This will read data produced when a high energy particle crosses the boundary between two materials with different electrical properties.

The Limitations to Delay-Insensitivity in Asynchronous Circuits

National Research Council Canada - National Science Library

Martin, Alain J

1990-01-01

... produced are delay-insensitive (DI). A digital circuit is DI when its correct operation is independent of the delays in operators and in the wires connecting the operators, except that the delays are finite and positive...

Induced Voltage in an Open Wire

Science.gov (United States)

Morawetz, K.; Gilbert, M.; Trupp, A.

2017-07-01

A puzzle arising from Faraday's law has been considered and solved concerning the question which voltage will be induced in an open wire with a time-varying homogeneous magnetic field. In contrast to closed wires where the voltage is determined by the time variance of the magnetic field and the enclosed area, in an open wire we have to integrate the electric field along the wire. It is found that the longitudinal electric field with respect to the wave vector contributes with 1/3 and the transverse field with 2/3 to the induced voltage. In order to find the electric fields the sources of the magnetic fields are necessary to know. The representation of a spatially homogeneous and time-varying magnetic field implies unavoidably a certain symmetry point or symmetry line which depend on the geometry of the source. As a consequence the induced voltage of an open wire is found to be the area covered with respect to this symmetry line or point perpendicular to the magnetic field. This in turn allows to find the symmetry points of a magnetic field source by measuring the voltage of an open wire placed with different angles in the magnetic field. We present exactly solvable models of the Maxwell equations for a symmetry point and for a symmetry line, respectively. The results are applicable to open circuit problems like corrosion and for astrophysical applications.

Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits

Science.gov (United States)

Strickland, S. M.; Hester, J. D.; Gowan, A. K.; Montgomery, R. K.; Geist, D. L.; Blanche, J. F.; McGuire, G. D.; Nash, T. S.

2011-01-01

As integrated circuit miniaturization trends continue, they drive the need for smaller higher input/output (I/O) packages. Hermetically sealed ceramic area array parts are the package of choice by the space community for high reliability space flight electronic hardware. Unfortunately, the coefficient of thermal expansion mismatch between the ceramic area array package and the epoxy glass printed wiring board limits the life of the interconnecting solder joint. This work presents the results of an investigation by Marshall Space Flight Center into a method to increase the life of this second level interconnection by the use of compliant microcoil springs. The design of the spring and its attachment process are presented along with thermal cycling results of microcoil springs (MCS) compared with state-of-the-art ball and column interconnections. Vibration testing has been conducted on MCS and high lead column parts. Radio frequency simulation and measurements have been made and the MCS has been modeled and a stress analysis performed. Thermal cycling and vibration testing have shown MCS interconnects to be significantly more reliable than solder columns. Also, MCS interconnects are less prone to handling damage than solder columns. Future work that includes shock testing, incorporation into a digital signal processor board, and process evaluation of expansion from a 400 I/O device to a device with over 1,100 I/O is identified.

Construction and assembly of the wire planes for the MicroBooNE Time Projection Chamber

Energy Technology Data Exchange (ETDEWEB)

Acciarri, R.; Adams, C.; Asaadi, J.; Danaher, J.; Fleming, B. T.; Gardner, R.; Gollapinni, S.; Grosso, R.; Guenette, R.; Littlejohn, B. R.; Lockwitz, S.; Raaf, J. L.; Soderberg, M.; John, J. St.; Strauss, T.; Szelc, A. M.; Yu, B.

2017-03-01

In this paper we describe how the readout planes for the MicroBooNE Time Projection Chamber were constructed, assembled and installed. We present the individual wire preparation using semi-automatic winding machines and the assembly of wire carrier boards. The details of the wire installation on the detector frame and the tensioning of the wires are given. A strict quality assurance plan ensured the integrity of the readout planes. The different tests performed at all stages of construction and installation provided crucial information to achieve the successful realization of the MicroBooNE wire planes.

The impact of silicon nano-wire technology on the design of single-work-function CMOS transistors and circuits

International Nuclear Information System (INIS)

Bindal, Ahmet; Hamedi-Hagh, Sotoudeh

2006-01-01

This three-dimensional exploratory study on vertical silicon wire MOS transistors with metal gates and undoped bodies demonstrates that these transistors dissipate less power and occupy less layout area while producing comparable transient response with respect to the state-of-the-art bulk and SOI technologies. The study selects a single metal gate work function for both NMOS and PMOS transistors to alleviate fabrication difficulties and then determines a common device geometry to produce an OFF current smaller than 1 pA for each transistor. Once an optimum wire radius and effective channel length is determined, DC characteristics including threshold voltage roll-off, drain-induced barrier lowering and sub-threshold slope of each transistor are measured. Simple CMOS gates such as an inverter, two- and three-input NAND, NOR and XOR gates and a full adder, composed of the optimum NMOS and PMOS transistors, are built to measure transient performance, power dissipation and layout area. Simulation results indicate that worst-case transient time and worst-case delay are 1.63 and 1.46 ps, respectively, for a two-input NAND gate and 7.51 and 7.43 ps, respectively, for a full adder for a fan-out of six transistor gates (24 aF). Worst-case power dissipation is 62.1 nW for a two-input NAND gate and 118.1 nW for a full adder at 1 GHz for the same output capacitance. The layout areas are 0.0066 μm 2 for the two-input NAND gate and 0.049 μm 2 for the full adder circuits

Stitching Codeable Circuits: High School Students' Learning About Circuitry and Coding with Electronic Textiles

Science.gov (United States)

Litts, Breanne K.; Kafai, Yasmin B.; Lui, Debora A.; Walker, Justice T.; Widman, Sari A.

2017-10-01

Learning about circuitry by connecting a battery, light bulb, and wires is a common activity in many science classrooms. In this paper, we expand students' learning about circuitry with electronic textiles, which use conductive thread instead of wires and sewable LEDs instead of lightbulbs, by integrating programming sensor inputs and light outputs and examining how the two domains interact. We implemented an electronic textiles unit with 23 high school students ages 16-17 years who learned how to craft and code circuits with the LilyPad Arduino, an electronic textile construction kit. Our analyses not only confirm significant increases in students' understanding of functional circuits but also showcase students' ability in designing and remixing program code for controlling circuits. In our discussion, we address opportunities and challenges of introducing codeable circuit design for integrating maker activities that include engineering and computing into classrooms.

Cortical Composition Hierarchy Driven by Spine Proportion Economical Maximization or Wire Volume Minimization.

Directory of Open Access Journals (Sweden)

Jan Karbowski

2015-10-01

Full Text Available The structure and quantitative composition of the cerebral cortex are interrelated with its computational capacity. Empirical data analyzed here indicate a certain hierarchy in local cortical composition. Specifically, neural wire, i.e., axons and dendrites take each about 1/3 of cortical space, spines and glia/astrocytes occupy each about (1/3(2, and capillaries around (1/3(4. Moreover, data analysis across species reveals that these fractions are roughly brain size independent, which suggests that they could be in some sense optimal and thus important for brain function. Is there any principle that sets them in this invariant way? This study first builds a model of local circuit in which neural wire, spines, astrocytes, and capillaries are mutually coupled elements and are treated within a single mathematical framework. Next, various forms of wire minimization rule (wire length, surface area, volume, or conduction delays are analyzed, of which, only minimization of wire volume provides realistic results that are very close to the empirical cortical fractions. As an alternative, a new principle called "spine economy maximization" is proposed and investigated, which is associated with maximization of spine proportion in the cortex per spine size that yields equally good but more robust results. Additionally, a combination of wire cost and spine economy notions is considered as a meta-principle, and it is found that this proposition gives only marginally better results than either pure wire volume minimization or pure spine economy maximization, but only if spine economy component dominates. However, such a combined meta-principle yields much better results than the constraints related solely to minimization of wire length, wire surface area, and conduction delays. Interestingly, the type of spine size distribution also plays a role, and better agreement with the data is achieved for distributions with long tails. In sum, these results suggest

Leaching of gold, silver and accompanying metals from circuit boards (PCBs waste

Directory of Open Access Journals (Sweden)

Jana Ficeriová

2011-12-01

Full Text Available Au-Ag noble metal wastes represent a wide range of waste types and forms, with various accompanying metallic elements.The presented leaching strategy for Au-Ag contained in circuit boards (PCBs aims at gaining gold and silver in the metallic form.Application of the proposed ammonium thiosulphate leaching process for the treatment of the above mentioned Au-Ag containing wastesrepresents a practical, economic and at the same time an ecological solution. The ammonium thiosulphate based leaching of gold and silverfrom PCBs waste, using crushing as a pretreatment, was investigated. It was possible to achieve 98 % gold and 93 % silver recovery within48 hours of ammonium thiosulphate leaching. This type of leaching is a better leaching procedure for recovery of gold and silver from PCBwaste than the classical toxic cyanide leaching. 84 % Cu, 82 % Fe, 77 % Al, 76 % Zn, 70 % Ni, 90 % Pd, 88 % Pb and 83 % Sn recovery ofthe accompanying metals was achieved, using sulphuric acid with hydrogen peroxide, sodium chloride and aqua regia. A four steps leachingprocess gave a very satisfactory yield and a more rapid kinetics for all observed metals solubilization than other technologies.

Surface charges and J H Poynting’s disquisitions on energy transfer in electrical circuits

Science.gov (United States)

Matar, M.; Welti, R.

2017-11-01

In this paper we review applications given by J H Poynting (1884) on the transfer of electromagnetic energy in DC circuits. These examples were strongly criticized by O Heaviside (1887). Heaviside stated that Poynting had a misconception about the nature of the electric field in the vicinity of a wire through which a current flows. The historical review of this conflict and its resolution based on the consideration of electrical charges on the surface of the wires can be useful for student courses on electromagnetism or circuit theory.

Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits

Directory of Open Access Journals (Sweden)

Domenico Capriglione

2018-03-01

Full Text Available This paper deals with the electromagnetic compatibility (EMC issues related to the direct and radiated emissions from a high-speed integrated circuits (ICs. These emissions are evaluated here by means of circuital and electromagnetic models. As for the conducted emission, an equivalent circuit model is derived to describe the IC and the effect of its loads (package, printed circuit board, decaps, etc., based on the Integrated Circuit Emission Model template (ICEM. As for the radiated emission, an electromagnetic model is proposed, based on the superposition of the fields generated in the far field region by the loop currents flowing into the IC and the package pins. A custom experimental setup is designed for validating the models. Specifically, for the radiated emission measurement, a custom test board is designed and realized, able to highlight the contribution of the direct emission from the IC, usually hidden by the indirect emission coming from the printed circuit board. Measurements of the package currents and of the far-field emitted fields are carried out, providing a satisfactory agreement with the model predictions.

Thiourea leaching gold and silver from the printed circuit boards of waste mobile phones.

Science.gov (United States)

Jing-ying, Li; Xiu-li, Xu; Wen-quan, Liu

2012-06-01

The present communication deals with the leaching of gold and silver from the printed circuit boards (PCBs) of waste mobile phones using an effective and less hazardous system, i.e., a thiourea leaching process as an alternative to the conventional and toxic cyanide leaching of gold. The influence of particle size, thiourea and Fe(3+) concentrations and temperature on the leaching of gold and silver from waste mobile phones was investigated. Gold extraction was found to be enhanced in a PCBs particle size of 100 mesh with the solutions containing 24 g/L thiourea and Fe(3+) concentration of 0.6% under the room temperature. In this case, about 90% of gold and 50% of silver were leached by the reaction of 2h. The obtained data will be useful for the development of processes for the recycling of gold and silver from the PCBs of waste mobile phones. Copyright © 2012 Elsevier Ltd. All rights reserved.

Clearance of short circuited ion optics electrodes by capacitive discharge. [in ion thrusters

Science.gov (United States)

Poeschel, R. L.

1976-01-01

The ion optics electrodes of low specific impulse (3000 sec) mercury electron bombardment ion thrusters are vulnerable to short circuits by virtue of their relatively small interelectrode spacing (0.5 mm). Metallic flakes from backsputtered deposits are the most probable cause of such 'shorts' and 'typical' flakes have been simulated here using refractory wire that has a representative, but controllable, cross section. Shorting wires can be removed by capacitive discharge without significant damage to the electrodes. This paper describes an evaluation of 'short' removal versus electrode damage for several combinations of capacitor voltage, stored energy, and short circuit conditions.

Orbiter CCTV video signal noise analysis

Science.gov (United States)

Lawton, R. M.; Blanke, L. R.; Pannett, R. F.

1977-01-01

The amount of steady state and transient noise which will couple to orbiter CCTV video signal wiring is predicted. The primary emphasis is on the interim system, however, some predictions are made concerning the operational system wiring in the cabin area. Noise sources considered are RF fields from on board transmitters, precipitation static, induced lightning currents, and induced noise from adjacent wiring. The most significant source is noise coupled to video circuits from associated circuits in common connectors. Video signal crosstalk is the primary cause of steady state interference, and mechanically switched control functions cause the largest induced transients.

Alternative Design Concepts for Multi-Circuit HTS Link Systems

CERN Document Server

Ballarino, A

2011-01-01

Superconducting cables for power transmission usually contain two conductors for DC application, or three conductors for AC, with high voltage insulation. In contrast, for some applications related to accelerators it is convenient to transfer high currents via superconducting links feeding a number of circuits at relatively low voltage, of the order of a kilovolt, over distances of up to a few hundred meters. For power transmission applications based on cooling via sub-cooled liquid nitrogen, suitable HTS conductors are only available in the form of tape, and a multi-layer variant can be envisaged for the multi-circuit links. However, where cooling to temperatures of the order of 20 K is feasible, MgB2 conductor, available in the form of both tape and wire, can also be envisaged and in the latter case used to assemble round cables. There are, therefore, two distinct topologies - based on the use of wires or tapes - that can be envisaged for use in applications to multi-circuit link systems. In this paper the ...

Single-Wire Electric-Field Coupling Power Transmission Using Nonlinear Parity-Time-Symmetric Model with Coupled-Mode Theory

Directory of Open Access Journals (Sweden)

Xujian Shu

2018-03-01

Full Text Available The output power and transmission efficiency of the traditional single-wire electric-field coupling power transmission (ECPT system will drop sharply with the increase of the distance between transmitter and receiver, thus, in order to solve the above problem, in this paper, a new nonlinear parity-time (PT-symmetric model for single-wire ECPT system based on coupled-mode theory (CMT is proposed. The proposed model for single-wire ECPT system not only achieves constant output power but also obtains a high constant transmission efficiency against variable distance, and the steady-state characteristics of the single-wire ECPT system are analyzed. Based on the theoretical analysis and circuit simulation, it shows that the transmission efficiency with constant output power remains 60% over a transmission distance of approximately 34 m without the need for any tuning. Furthermore, the application of a nonlinear PT-symmetric circuit based on CMT enables robust electric power transfer to moving devices or vehicles.

Cold atoms in microscopic traps: from wires to chips

International Nuclear Information System (INIS)

Cassettari, D.

2000-05-01

collisions between trapped atoms. Finally, by combining two wire guides we have experimentally realized an innovative kind of beam splitter for guided atoms. We have investigated the splitting potential generated by a Y-shaped wire which has one input, i.e. the central arm of the Y, and two outputs corresponding to the left and right arms of the Y. By tuning the current ratio in the two outputs we have observed atoms switching from left to right as well as symmetric splitting. This and other similar designs are suitable for integration in more complex atomic circuits, i.e. atom interferometers, designed on the atom chip surface. Atom chips will open the way to a new generation of 'surface-mounted' experiments where many atom optical elements are assembled in a single circuit. Such a robust and easy to use device can find widespread applications from clocks and acceleration sensors to implementations of quantum information processing and communication. (author)

Cockpit canopy shattering using exploding wire techniques

International Nuclear Information System (INIS)

Novac, B M; Smith, I R; Downs, P R; Marston, P; Fahey, D

2007-01-01

This paper presents the principal experimental results provided by a preliminary investigation into the possibility of using exploding wire (EW) techniques to shatter the plastic cockpit canopy of a modern jet aircraft. The data provided forms the basis for a qualitative understanding of the physics of interaction between the plasma produced by an EW and the surrounding elasto-plastic material in which the wire is embedded. To optimize the shock-wave 'clean cutting' effect, the significance of the material, the dimensions of the exploding wire and the amplitude of the current and voltage pulses are all considered. This leads to important conclusions concerning both the characteristics of the EW and the optimum arrangement of the electrical circuit, with the single most important optimization factor being the peak electrical power input to the EW, rather than the dissipated Joule energy. A full-scale system relevant to an actual cockpit canopy shattering is outlined and relevant results are presented and discussed

A front-circuit system of obtaining simultaneously the associated parameters from the MWPC

International Nuclear Information System (INIS)

Mei Wen; Yu Xiaoqi; Ye Bangjiao; Fan Yangmei

1991-01-01

A wire signal getting circuit is introduce. It describes how to get the associated parameters from the produced signal on the proportional wires (i.e, DE signal, time signal and address signal). The noise of preamplifiers is 1.66 fC. The pulse sustained time is 2.5μs. The energy resolution is 25%

INSULATION RESISTANCE OF PRINTED CIRCUIT BOARDS. BEHAVIOR OF CERTAIN TYPES AND MAKES UNDER DIFFERENT CLIMATIC CONDITIONS. En undersoegelse af en raekke typer og fabrikater under forskellige klimatiske forhold

Energy Technology Data Exchange (ETDEWEB)

Olesen, S. T.

1971-11-15

The present study embraces measurements of insulation resistance on a number of types and makes of printed-circuit boards. The insulation measurements were performed on boards just received from the manufacturer, as well as on boards exposed to humidity or to elevated temperatures. A total of 33 types from five different material categories were obtained. The test material used thus originated from a variety of independent sources. The purpose of the project was to investigate the frequency with which batches with insufficiently baked material - and consequently having a poor insulation resistance - were encountered in practice. No such batches were in fact found, and it is likely that they do not occur as often as had previously been assumed.

Biomedical implementation of liquid metal ink as drawable ECG electrode and skin circuit.

Directory of Open Access Journals (Sweden)

Yang Yu

Full Text Available BACKGROUND: Conventional ways of making bio-electrodes are generally complicated, expensive and unconformable. Here we describe for the first time the method of applying Ga-based liquid metal ink as drawable electrocardiogram (ECG electrodes. Such material owns unique merits in both liquid phase conformability and high electrical conductivity, which provides flexible ways for making electrical circuits on skin surface and a prospective substitution of conventional rigid printed circuit boards (PCBs. METHODS: Fundamental measurements of impedance and polarization voltage of the liquid metal ink were carried out to evaluate its basic electrical properties. Conceptual experiments were performed to draw the alloy as bio-electrodes to acquire ECG signals from both rabbit and human via a wireless module developed on the mobile phone. Further, a typical electrical circuit was drawn in the palm with the ink to demonstrate its potential of implementing more sophisticated skin circuits. RESULTS: With an oxide concentration of 0.34%, the resistivity of the liquid metal ink was measured as 44.1 µΩ·cm with quite low reactance in the form of straight line. Its peak polarization voltage with the physiological saline was detected as -0.73 V. The quality of ECG wave detected from the liquid metal electrodes was found as good as that of conventional electrodes, from both rabbit and human experiments. In addition, the circuit drawn with the liquid metal ink in the palm also runs efficiently. When the loop was switched on, all the light emitting diodes (LEDs were lit and emitted colorful lights. CONCLUSIONS: The liquid metal ink promises unique printable electrical properties as both bio-electrodes and electrical wires. The implemented ECG measurement on biological surface and the successfully run skin circuit demonstrated the conformability and attachment of the liquid metal. The present method is expected to innovate future physiological measurement and

Grounding and shielding circuits and interference

CERN Document Server

Morrison, Ralph

2016-01-01

Applies basic field behavior in circuit design and demonstrates how it relates to grounding and shielding requirements and techniques in circuit design This book connects the fundamentals of electromagnetic theory to the problems of interference in all types of electronic design. The text covers power distribution in facilities, mixing of analog and digital circuitry, circuit board layout at high clock rates, and meeting radiation and susceptibility standards. The author examines the grounding and shielding requirements and techniques in circuit design and applies basic physics to circuit behavior. The sixth edition of this book has been updated with new material added throughout the chapters where appropriate. The presentation of the book has also been rearranged in order to reflect the current trends in the field.

30 CFR 57.6605 - Isolation of blasting circuits.

Science.gov (United States)

2010-07-01

... NONMETAL MINE SAFETY AND HEALTH SAFETY AND HEALTH STANDARDS-UNDERGROUND METAL AND NONMETAL MINES Explosives Extraneous Electricity-Surface and Underground § 57.6605 Isolation of blasting circuits. Lead wires and blasting lines shall be isolated and insulated from power conductors, pipelines, and railroad tracks, and...

Prioritizing material recovery for end-of-life printed circuit boards

International Nuclear Information System (INIS)

Wang Xue; Gaustad, Gabrielle

2012-01-01

Highlights: ► Material recovery driven by composition, choice of ranking, and weighting. ► Economic potential for new recycling technologies quantified for several metrics. ► Indicators developed for materials incurring high eco-toxicity costs. ► Methodology useful for a variety of stakeholders, particularly policy-makers. - Abstract: The increasing growth in generation of electronic waste (e-waste) motivates a variety of waste reduction research. Printed circuit boards (PCBs) are an important sub-set of the overall e-waste stream due to the high value of the materials contained within them and potential toxicity. This work explores several environmental and economic metrics for prioritizing the recovery of materials from end-of-life PCBs. A weighted sum model is used to investigate the trade-offs among economic value, energy saving potentials, and eco-toxicity. Results show that given equal weights for these three sustainability criteria gold has the highest recovery priority, followed by copper, palladium, aluminum, tin, lead, platinum, nickel, zinc, and silver. However, recovery priority will change significantly due to variation in the composition of PCBs, choice of ranking metrics, and weighting factors when scoring multiple metrics. These results can be used by waste management decision-makers to quantify the value and environmental savings potential for recycling technology development and infrastructure. They can also be extended by policy-makers to inform possible penalties for land-filling PCBs or exporting to the informal recycling sector. The importance of weighting factors when examining recovery trade-offs, particularly for policies regarding PCB collection and recycling are explored further.

Surface state of the wire electrode and its influence on the application characteristics in MAG welding

International Nuclear Information System (INIS)

Piffer, W.; Marques, P.V.; Modenesi, P.J.

1997-01-01

This work presents an evaluation of the effect of the surface condition of the wire on GMA welding performance. Three wires samples were produced from the same steel heat with different surface conditions. Short circuit transfer welding trials were performed for two wire feed rates and different voltage levels. These tests indicated that stability tended to be worse and spatter level higher for the lowest and the highest welding voltage operation and the wire with no copper coating. No major difference was observed for intermediate voltage operation. Scanning electron microscopy of contact tips suggested that cooper coated wires produced less erosion on the tips. Electrical resistance of wires and friction forces between wires and contact tip were also evaluated and used to analyze differences in influence of wire surface condition on welding results. (Author) 14 refs

Wire communication engineering

International Nuclear Information System (INIS)

Son, Byeong Tae

1997-02-01

This book describes wire telecommunication engineering/ It is divided into eleven chapter, which deal with Introduction with development of telecommunication, voice and sound wave and communication network, Telegraphy with summary of telegraphy, code of telegraphy, communication speed, morse and telex, Telephone on structure, circuit and image telephone, Traffic on telecommunication traffic, transmission of line about theory, cable line and loaded cable, carrier communication with carrier telegraphy and carrier telephone, optical communication with types, structure, specialty, laser and equipment, DATA, Mobile telecommunication on summary, mobile telephone, radio paging and digital mobile telecommunication, ISDN with channel of ISDN, and service of ISDN, and design of telecommunication.

Performance evaluation of PFBR wire type sodium leak detectors

International Nuclear Information System (INIS)

Vijayakumar, G.; Rajan, K.K.; Nashine, B.K.; Chandramouli, S.; Madhusoodanan, K.; Kalyanasundaram, P.

2011-01-01

Highlights: → Performance evaluation of wire type leak detectors was conducted in LEENA facility by creating sodium leaks. → The lowest leak rate of 214 g/h was detected in 50 min and the highest detection time was 6 h for a leak rate of 222 g/h. → Factors affecting the leak detection time are packing density of thermal insulation, layout of heater, temperature, etc. → Relationship between leak rate and detection time was established and a leak rate of 100 g/h is likely to be detected in 11.1 h. → Contact resistance of leaked sodium increased to 3.5 kilo ohms in 20 h. - Abstract: Wire type leak detectors working on conductivity principle are used for detecting sodium leak in the secondary sodium circuits of fast breeder reactors. It is required to assess the performance of these detectors and confirm that they are meeting the requirements. A test facility by name LEENA was constructed at Indira Gandhi Centre for Atomic Research (IGCAR), Kalpakkam to test the wire type leak detector lay out by simulating different sodium leak rates. This test facility consists of a sodium dump tank, a test vessel, interconnecting pipelines with valves, micro filter and test section with leak simulators. There are three different test sections in the test set up of length 1000 mm each. These test sections simulate piping of Prototype Fast Breeder Reactor (PFBR) secondary circuit and the wire type leak detector layout in full scale. All test sections are provided with leak simulators. A leak simulator consists of a hole of size one mm drilled in the test section and closed with a tapered pin. The tapered pin position in the hole is adjusted by a screw mechanism and there by the annular gap of flow area is varied for getting different leak rates. Various experiments were conducted to evaluate the performance of the leak detectors by creating different sodium leak rates. This paper deals with the details of wire type leak detector layout for the secondary sodium circuit of

Investigation of magnetoimpedance effect on electrodeposited NiFe/Cu wire using inductance spectroscopy

International Nuclear Information System (INIS)

Mishra, Amaresh Chandra; Sahoo, Trilochan; Srinivas, V.; Thakur, Awalendra K.

2011-01-01

In this report, inductance spectroscopy (IS) has been used as a tool to investigate the thickness dependence of magnetoimpedance (MI) on electrodeposited NiFe thin films. An MI value as high as 140% has been observed under an applied magnetic field of 76 Oe at 300 kHz frequency for a film thickness of 6.8 μm. This result is in sharp contrast to earlier reports in literature showing monotonous increase in MI as a function of thickness. Maximum of MI was found at an optimum film thickness whose position varies with frequency. These reports exhibiting strong frequency dependence of MI prompted us to investigate the underlying physics using IS. The origin of MI lies in the combined effect of domain wall motion and spin rotation, which contributes to permeability. A parallel inductance and resistance (LR) circuit in series with series LR circuit model has been proposed as an equivalent electrical model to describe the property of these coated wires. The circuit elements have been linked with the phenomenon of domain wall motion and spin rotation. The experimental results obtained appear to be consistent with the proposed equivalent circuit model. -- Research Highlights: →GMI study on electrodeposited NiFe/Cu wire has been done to resolve the existing controversies. →Inductance spectroscopy has been used to evaluate the magnetic character. →The sample has been modeled as an equivalent electrical circuit. →A correlation between circuit parameters and GMI has been achieved.

FPGA based fast synchronous serial multi-wire links synchronization

Science.gov (United States)

Pozniak, Krzysztof T.

2013-10-01

The paper debates synchronization method of multi-wire, serial link of constant latency, by means of pseudo-random numbers generators. The solution was designed for various families of FPGA circuits. There were debated synchronization algorithm and functional structure of parameterized transmitter and receiver modules. The modules were realized in VHDL language in a behavioral form.

A Novel Designed Bioreactor for Recovering Precious Metals from Waste Printed Circuit Boards

Science.gov (United States)

Jujun, Ruan; Jie, Zheng; Jian, Hu; Zhang, Jianwen

2015-01-01

For recovering precious metals from waste printed circuit boards (PCBs), a novel hybrid technology including physical and biological methods was developed. It consisted of crushing, corona-electrostatic separation, and bioleaching. Bioleaching process is the focus of this paper. A novel bioreactor for bioleaching was designed. Bioleaching was carried out using Pseudomonas chlororaphis. Bioleaching experiments using mixed particles of Au and Cu were performed and leachate contained 0.006 mg/L, 2823 mg/L Au+ and Cu2+ respectively. It showed when Cu existed, the concentrations of Au were extremely small. This provided the feasibility to separate Cu from Au. The method of orthogonal experimental design was employed in the simulation bioleaching experiments. Experimental results showed the optimized parameters for separating Cu from Au particles were pH 7.0, temperature 22.5 °C, and rotation speed 80 r/min. Based on the optimized parameters obtained, the bioreactor was operated for recovering mixed Au and Cu particles. 88.1 wt.% of Cu and 76.6 wt.% of Au were recovered. The paper contributed important information to recover precious metals from waste PCBs. PMID:26316021

Disposing and recycling waste printed circuit boards: disconnecting, resource recovery, and pollution control.

Science.gov (United States)

Wang, Jianbo; Xu, Zhenming

2015-01-20

Over the past decades, China has been suffering from negative environmental impacts from distempered e-waste recycling activities. After a decade of effort, disassembly and raw materials recycling of environmentally friendly e-waste have been realized in specialized companies, in China, and law enforcement for illegal activities of e-waste recycling has also been made more and more strict. So up to now, the e-waste recycling in China should be developed toward more depth and refinement to promote industrial production of e-waste resource recovery. Waste printed circuit boards (WPCBs), which are the most complex, hazardous, and valuable components of e-waste, are selected as one typical example in this article that reviews the status of related regulations and technologies of WPCBs recycling, then optimizes, and integrates the proper approaches in existence, while the bottlenecks in the WPCBs recycling system are analyzed, and some preliminary experiments of pinch technologies are also conducted. Finally, in order to provide directional guidance for future development of WPCBs recycling, some key points in the WPCBs recycling system are proposed to point towards a future trend in the e-waste recycling industry.

Circuit bridging of components by smoke

International Nuclear Information System (INIS)

Tanaka, T.J.; Nowlen, S.P.; Anderson, D.J.

1996-10-01

Smoke can adversely affect digital electronics; in the short term, it can lead to circuit bridging and in the long term to corrosion of metal parts. This report is a summary of the work to date and component-level tests by Sandia National Laboratories for the Nuclear Regulatory Commission to determine the impact of smoke on digital instrumentation and control equipment. The component tests focused on short-term effects such as circuit bridging in typical components and the factors that can influence how much the smoke will affect them. These factors include the component technology and packaging, physical board protection, and environmental conditions such as the amount of smoke, temperature of burn, and humidity level. The likelihood of circuit bridging was tested by measuring leakage currents and converting those currents to resistance in ohms. Hermetically sealed ceramic packages were more resistant to smoke than plastic packages. Coating the boards with an acrylic spray provided some protection against circuit bridging. The smoke generation factors that affect the resistance the most are humidity, fuel level, and burn temperature. The use of CO 2 as a fire suppressant, the presence of galvanic metal, and the presence of PVC did not significantly affect the outcome of these results

Separation of the metallic and non-metallic fraction from printed circuit boards employing green technology

Energy Technology Data Exchange (ETDEWEB)

Estrada-Ruiz, R.H., E-mail: rhestrada@itsaltillo.edu.mx; Flores-Campos, R., E-mail: rcampos@itsaltillo.edu.mx; Gámez-Altamirano, H.A., E-mail: hgamez@itsaltillo.edu.mx; Velarde-Sánchez, E.J., E-mail: ejvelarde@itsaltillo.edu.mx

2016-07-05

Highlights: • Small sizes of particles are required in order to separate the different fractions. • Inverse flotation process is an efficient green technology to separate fractions. • Superficial air velocity is the main variable in the inverse flotation process. • Inverse flotation is a green process because the pulṕs pH is 7.0 during the test. - Abstract: The generation of electrical and electronic waste is increasing day by day; recycling is attractive because of the metallic fraction containing these. Nevertheless, conventional techniques are highly polluting. The comminution of the printed circuit boards followed by an inverse flotation process is a clean technique that allows one to separate the metallic fraction from the non-metallic fraction. It was found that particle size and superficial air velocity are the main variables in the separation of the different fractions. In this way an efficient separation is achieved by avoiding the environmental contamination coupled with the possible utilization of the different fractions obtained.

Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation.

Science.gov (United States)

Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Arpád; Ilea, Petru

2014-05-30

The present study aims to develop an eco-friendly chemical-electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75kWh/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples. Copyright © 2014 Elsevier B.V. All rights reserved.

Synthesis of carbon nanotubes and porous carbons from printed circuit board waste pyrolysis oil

International Nuclear Information System (INIS)

Quan Cui; Li Aimin; Gao Ningbo

2010-01-01

The possibility and feasibility of using pyrolysis oil from printed circuit board (PCB) waste as a precursor for advanced carbonaceous materials is presented. The PCB waste was first pyrolyzed in a laboratory scale fixed bed reactor at 600 deg. C to prepare pyrolysis oil. The analysis of pyrolysis oil by gas chromatography-mass spectroscopy indicated that it contained a very high proportion of phenol and phenol derivatives. It was then polymerized in formaldehyde solution to synthesize pyrolysis oil-based resin which was used as a precursor to prepare carbon nanotubes (CNTs) and porous carbons. Scanning electron microscopy and transmission microscopy investigation showed that the resulting CNTs had hollow cores with outer diameter of ∼338 nm and wall thickness of ∼86 nm and most of them were filled with metal nanoparticles or nanorods. X-ray diffraction reveals that CNTs have an amorphous structure. Nitrogen adsorption isotherm analysis indicated the prepared porous carbons had a Brunauer-Emmett-Teller surface area of 1214 m 2 /g. The mechanism of the formation of the CNTs and porous carbons was discussed.

Compressed Air System Enhancement Increases Efficiency and Provides Energy Savings at a Circuit Board Manufacturer (Sanmina Plant, Oswego, New York): Office of Industrial Technologies (OIT) BestPractices Technical Case Study

International Nuclear Information System (INIS)

Wogsland, J.

2001-01-01

This case study is one in a series on industrial firms who are implementing energy efficient technologies and system improvements into their manufacturing processes. This case study documents the activities, savings, and lessons learned on the circuit board manufacturer (Sanmina Plant) project

Electronic technology for practical field

International Nuclear Information System (INIS)

Kim, Jeong Cheol

2001-04-01

This book is comprised of fourteen chapters, which deals with basic conception of electrical installation, positive-phase impedance and short circuit calculation, image impedance and earth fault current, neutral grounding, voltage drop and voltage regulation, fault calculation of model system, phase compensation, insulation, grounding design, standard of main equipment, a distributing board like motor control center, cable such as c v cable, extra-high voltage and IEC standard cable, breakdown and protection of electrical installation about motor, transformer, condenser and over current relay and connection of wire of protective relay on CT and PT wiring, PT wiring and operating principle and an example of AC circuit wring in relay.

Feasibility studies on the direct wire readout on wire scanners in electron accelerators; Durchfuehrbarkeitsstudien zur direkten Drahtauslese an Wirescannern in Elektronen-Beschleunigern

Energy Technology Data Exchange (ETDEWEB)

Markert, Michael

2010-10-15

This bachelor thesis deals essentially with the signal processing of a so-called wire scanner, a special monitor, which comes to application in the beam diagnostics of particle accelerators. In this direct wire readout the voltage signal, which is induced by the particle beam in the measurement wire of the wire scanner, shall be directly read out. The aim of this thesis is to show fundamental considerations and perform studies, which study, whether and how in the future by means of a suited data transmission as well as readout electronics conclusion on the most important parameters of the beam, like position and profile, are possible. The measurement system presented here is divided in three main components: Signal measurement, signal preparation, and signal stretching. A suited test facility was developed and is presented in detail, in which then all components, like for instance the transmission cables, the wire-scanner fork, and the developed measurement circuit, are studied, which are of importance for a faultless signal transmission and presentation. Extensive measurements on the single components, as well as calculations for the signal transmission on and in the wire scanner were performed, whereby a good agreement could be found. Thereafter a comparison and a selection of the component used in this project were made. Furthermore improvement proposals, new constructions, and outlooks are presented, which could be of importance in further works.

Fast copper extraction from printed circuit boards using supercritical carbon dioxide.

Science.gov (United States)

Calgaro, C O; Schlemmer, D F; da Silva, M D C R; Maziero, E V; Tanabe, E H; Bertuol, D A

2015-11-01

Technological development and intensive marketing support the growth in demand for electrical and electronic equipment (EEE), for which printed circuit boards (PCBs) are vital components. As these devices become obsolete after short periods, waste PCBs present a problem and require recycling. PCBs are composed of ceramics, polymers, and metals, particularly Cu, which is present in highest percentages. The aim of this study was to develop an innovative method to recover Cu from the PCBs of old mobile phones, obtaining faster reaction kinetics by means of leaching with supercritical CO2 and co-solvents. The PCBs from waste mobile phones were characterized, and evaluation was made of the reaction kinetics during leaching at atmospheric pressure and using supercritical CO2 with H2O2 and H2SO4 as co-solvents. The results showed that the PCBs contained 34.83 wt% of Cu. It was found that the supercritical extraction was 9 times faster, compared to atmospheric pressure extraction. After 20 min of supercritical leaching, approximately 90% of the Cu contained in the PCB was extracted using a 1:20 solid:liquid ratio and 20% of H2O2 and H2SO4 (2.5 M). These results demonstrate the efficiency of the process. Therefore the supercritical CO2 employment in the PCBs recycling is a promising alternative and the CO2 is environmentally acceptable and reusable. Copyright © 2015 Elsevier Ltd. All rights reserved.

Circuits and electronics hands-on learning with analog discovery

CERN Document Server

Okyere Attia, John

2018-01-01

The book provides instructions on building circuits on breadboards, connecting the Analog Discovery wires to the circuit under test, and making electrical measurements. Various measurement techniques are described and used in this book, including: impedance measurements, complex power measurements, frequency response measurements, power spectrum measurements, current versus voltage characteristic measurements of diodes, bipolar junction transistors, and Mosfets. The book includes end-of-chapter problems for additional exercises geared towards hands-on learning, experimentation, comparisons between measured results and those obtained from theoretical calculations.

Demonstrating the Effect of Particle Impact Dampers on the Random Vibration Response and Fatigue Life of Printed Wiring Assemblies

Science.gov (United States)

Knight, Brent; Montgomery, Randall; Geist, David; Hunt, Ron; LaVerde, Bruce; Towner, Robert

2013-01-01

In a recent experimental study, small Particle Impact Dampers (PID) were bonded directly to the surface of printed circuit board (PCB) or printed wiring assemblies (PWA), reducing the random vibration response and increasing the fatigue life. This study provides data verifying practicality of this approach. The measured peak strain and acceleration response of the fundamental out of plane bending mode was significantly attenuated by adding a PID device. Attenuation of this mode is most relevant to the fatigue life of a PWA because the local relative displacements between the board and the supported components, which ultimately cause fatigue failures of the electrical leads of the board-mounted components are dominated by this mode. Applying PID damping at the board-level of assembly provides mitigation with a very small mass impact, especially as compared to isolation at an avionics box or shelf level of assembly. When compared with other mitigation techniques at the PWA level (board thickness, stiffeners, constrained layer damping), a compact PID device has the additional advantage of not needing to be an integral part of the design. A PID can simply be bonded to heritage or commercial off the shelf (COTS) hardware to facilitate its use in environments beyond which it was originally qualified. Finite element analysis and test results show that the beneficial effect is not localized and that the attenuation is not due to the simple addition of mass. No significant, detrimental reduction in frequency was observed. Side-by-side life testing of damped and un-damped boards at two different thicknesses (0.070" and 0.090") has shown that the addition of a PID was much more significant to the fatigue life than increasing the thickness. High speed video, accelerometer, and strain measurements have been collected to correlate with analytical results.

Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

International Nuclear Information System (INIS)

Troeger, K.; Darka, R. Khanpour; Neumeyer, T.; Altstaedt, V.

2014-01-01

This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K

Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

Energy Technology Data Exchange (ETDEWEB)

Troeger, K., E-mail: altstaedt@uni-bayreuth.de; Darka, R. Khanpour, E-mail: altstaedt@uni-bayreuth.de; Neumeyer, T., E-mail: altstaedt@uni-bayreuth.de; Altstaedt, V., E-mail: altstaedt@uni-bayreuth.de [Polymer Engineering, University of Bayreuth, Germany and Polymer Engineering, Universitaetsstrasse 30, 95447 Bayreuth (Germany)

2014-05-15

This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K.

Lightning effects on the NASA F-8 digital-fly-by-wire airplane

Science.gov (United States)

Plumer, J. A.; Fisher, F. A.; Walko, L. C.

1975-01-01

The effects of lightning on a Digital Fly-By-Wire (DFBW)aircraft control system were investigated. The aircraft was a NASA operated F-8 fitted with a modified Apollo guidance computer. Current pulses similar in waveshape to natural lightning, but lower in amplitude, were injected into the aircraft. Measurements were made of the voltages induced on the DFBW circuits, the total current induced on the bundles of wires, the magnetic field intensity inside the aircraft, and the current density on the skin of the aircraft. Voltage measurements were made in both the line-to-ground and line-to-line modes. Voltages measured at the non-destructive test level were then scaled upward to determine how much would be produced by actual lightning. A 200,000 ampere severe lightning flash would produce between 40 and 2000 volts in DFBW circuits. Some system components are expected to be vulnerable to these voltages.

Experimental Study on Short Circuit Phenomena in Air Switch of Distribution Line due to Sparkover between Different Poles on Which One Surge Arrester of the Three Ones is Omitted

Science.gov (United States)

Sato, Tomoyuki; Uemura, Satoshi; Asakawa, Akira; Yokoyama, Shigeru; Honda, Hideki; Horikoshi, Kazuhiro

In this study, we experimentally examined the possibility of the internal short circuit of an air switch due to the sparkover between different poles under the condition that no surge arrester exists in neighboring poles and one of three surge arresters is omitted at the pole with an air switch. Experiments at Shiobara Testing Yard and Akagi Testing Center of CRIEPI clarified the following. Fault current may flow via the grounding point of a pole with an air switch and that of the next pole on a different phase from grounded phase of the pole with an air switch. If the low-voltage wire, overhead ground wire or communication wire forms a short circuit between them, ultimately the air switch may burn out. Moreover Fault current continues even if the length of the short-circuit between different poles is increased. Although the increase of the short-circuit length results in the increase of wire impedance, the amount of increase is still small compared with source impedance.

Study on characteristics of printed circuit board liberation and its crushed products.

Science.gov (United States)

Quan, Cui; Li, Aimin; Gao, Ningbo

2012-11-01

Recycling printed circuit board waste (PCBW) waste is a hot issue of environmental protection and resource recycling. Mechanical and thermo-chemical methods are two traditional recycling processes for PCBW. In the present research, a two-step crushing process combined with a coarse-crushing step and a fine-pulverizing step was adopted, and then the crushed products were classified into seven different fractions with a standard sieve. The liberation situation and particle shape in different size fractions were observed. Properties of different size fractions, such as heating value, thermogravimetric, proximate, ultimate and chemical analysis were determined. The Rosin-Rammler model was applied to analyze the particle size distribution of crushed material. The results indicated that complete liberation of metals from the PCBW was achieved at a size less than 0.59 mm, but the nonmetal particle in the smaller-than-0.15 mm fraction is liable to aggregate. Copper was the most prominent metal in PCBW and mainly enriched in the 0.42-0.25 mm particle size. The Rosin-Rammler equation adequately fit particle size distribution data of crushed PCBW with a correlation coefficient of 0.9810. The results of heating value and proximate analysis revealed that the PCBW had a low heating value and high ash content. The combustion and pyrolysis process of PCBW was different and there was an obvious oxidation peak of Cu in combustion runs.

Cleanliness of disposable vs nondisposable electrocardiography lead wires in children.

Science.gov (United States)

Addison, Nancy; Quatrara, Beth; Letzkus, Lisa; Strider, David; Rovnyak, Virginia; Syptak, Virginia; Fuzy, Lisa

2014-09-01

Mediastinitis costs hospitals thousands of dollars a year and increases the incidence of patient morbidity and mortality. No studies have been done to evaluate adenosine triphosphate (ATP) counts on disposable and nondisposable electrocardiography (ECG) lead wires in pediatric patients. To compare the cleanliness of disposable and nondisposable ECG lead wires in postoperative pediatric cardiac surgery patients by measuring the quantity of ATP (in relative luminescence units [RLUs]). ATP levels correlate with microbial cell counts and are used by institutions to assess hospital equipment and cleanliness. A prospective, randomized trial was initiated with approval from the institutional review board. Verbal consent was obtained from the parents/guardians for each patient. Trained nurses performed ATP swabs on the right and left upper ECG cables on postoperative days 1, 2, and 3. This study enrolled 51 patients. The disposable ECG lead wire ATP count on postoperative day 1 (median, 157 RLUs) was significantly lower (P disposable ECG lead wires (median, 200 RLUs) was also lower (P = .06) than the count for the nondisposable ECG lead wires (median, 453 RLUs). Results of this study support the use of disposable ECG lead wires in postoperative pediatric cardiac surgery patients for at least the first 48 hours as a direct strategy to reduce the ATP counts on ECG lead wires. ©2014 American Association of Critical-Care Nurses.

Integrated bioleaching of copper metal from waste printed circuit board-a comprehensive review of approaches and challenges.

Science.gov (United States)

Awasthi, Abhishek Kumar; Zeng, Xianlai; Li, Jinhui

2016-11-01

Waste electrical and electronic equipment (e-waste) is the most rapidly growing waste stream in the world, and the majority of the residues are openly disposed of in developing countries. Waste printed circuit boards (WPCBs) make up the major portion of e-waste, and their informal recycling can cause environmental pollution and health risks. Furthermore, the conventional disposal and recycling techniques-mechanical treatments used to recover valuable metals, including copper-are not sustainable in the long term. Chemical leaching is rapid and efficient but causes secondary pollution. Bioleaching is a promising approach, eco-friendly and economically feasible, but it is slower process. This review considers the recycling potential of microbes and suggests an integrated bioleaching approach for Cu extraction and recovery from WPCBs. The proposed recycling system should be more effective, efficient and both technically and economically feasible.

Two-step bioleaching of copper and gold from discarded printed circuit boards (PCB).

Science.gov (United States)

Işıldar, Arda; van de Vossenberg, Jack; Rene, Eldon R; van Hullebusch, Eric D; Lens, Piet N L

2016-11-01

An effective strategy for environmentally sound biological recovery of copper and gold from discarded printed circuit boards (PCB) in a two-step bioleaching process was experimented. In the first step, chemolithotrophic acidophilic Acidithiobacillus ferrivorans and Acidithiobacillus thiooxidans were used. In the second step, cyanide-producing heterotrophic Pseudomonas fluorescens and Pseudomonas putida were used. Results showed that at a 1% pulp density (10g/L PCB concentration), 98.4% of the copper was bioleached by a mixture of A. ferrivorans and A. thiooxidans at pH 1.0-1.6 and ambient temperature (23±2°C) in 7days. A pure culture of P. putida (strain WCS361) produced 21.5 (±1.5)mg/L cyanide with 10g/L glycine as the substrate. This gold complexing agent was used in the subsequent bioleaching step using the Cu-leached (by A. ferrivorans and A. thiooxidans) PCB material, 44.0% of the gold was mobilized in alkaline conditions at pH 7.3-8.6, and 30°C in 2days. This study provided a proof-of-concept of a two-step approach in metal bioleaching from PCB, by bacterially produced lixiviants. Copyright © 2015 Elsevier Ltd. All rights reserved.

Plasma Etching for Failure Analysis of Integrated Circuit Packages

NARCIS (Netherlands)

Tang, J.; Schelen, J.B.J.; Beenakker, C.I.M.

2011-01-01

Plastic integrated circuit packages with copper wire bonds are decapsulated by a Microwave Induced Plasma system. Improvements on microwave coupling of the system are achieved by frequency tuning and antenna modification. Plasmas with a mixture of O2 and CF4 showed a high etching rate around 2

Quality control process improvement of flexible printed circuit board by FMEA

Science.gov (United States)

Krasaephol, Siwaporn; Chutima, Parames

2018-02-01

This research focuses on the quality control process improvement of Flexible Printed Circuit Board (FPCB), centred around model 7-Flex, by using Failure Mode and Effect Analysis (FMEA) method to decrease proportion of defective finished goods that are found at the final inspection process. Due to a number of defective units that were found at the final inspection process, high scraps may be escaped to customers. The problem comes from poor quality control process which is not efficient enough to filter defective products from in-process because there is no In-Process Quality Control (IPQC) or sampling inspection in the process. Therefore, the quality control process has to be improved by setting inspection gates and IPCQs at critical processes in order to filter the defective products. The critical processes are analysed by the FMEA method. IPQC is used for detecting defective products and reducing chances of defective finished goods escaped to the customers. Reducing proportion of defective finished goods also decreases scrap cost because finished goods incur higher scrap cost than work in-process. Moreover, defective products that are found during process can reflect the abnormal processes; therefore, engineers and operators should timely solve the problems. Improved quality control was implemented for 7-Flex production lines from July 2017 to September 2017. The result shows decreasing of the average proportion of defective finished goods and the average of Customer Manufacturers Lot Reject Rate (%LRR of CMs) equal to 4.5% and 4.1% respectively. Furthermore, cost saving of this quality control process equals to 100K Baht.

Leaching of metals from large pieces of printed circuit boards using citric acid and hydrogen peroxide.

Science.gov (United States)

Jadhav, Umesh; Su, C; Hocheng, Hong

2016-12-01

In the present study, the leaching of metals from large pieces of computer printed circuit boards (CPCBs) was studied. A combination of citric acid (0.5 M) and 1.76 M hydrogen peroxide (H 2 O 2 ) was used to leach the metals from CPCB piece. The influence of system variables such as H 2 O 2 concentration, concentration of citric acid, shaking speed, and temperature on the metal leaching process was investigated. The complete metal leaching was achieved in 4 h from a 4 × 4 cm CPCB piece. The presence of citric acid and H 2 O 2 together in the leaching solution is essential for complete metal leaching. The optimum addition amount of H 2 O 2 was 5.83 %. The citric acid concentration and shaking speed had an insignificant effect on the leaching of metals. The increase in the temperature above 30 °C showed a drastic effect on metal leaching process.

The Quantum Socket: Wiring for Superconducting Qubits - Part 1

Science.gov (United States)

McConkey, T. G.; Bejanin, J. H.; Rinehart, J. R.; Bateman, J. D.; Earnest, C. T.; McRae, C. H.; Rohanizadegan, Y.; Shiri, D.; Mariantoni, M.; Penava, B.; Breul, P.; Royak, S.; Zapatka, M.; Fowler, A. G.

Quantum systems with ten superconducting quantum bits (qubits) have been realized, making it possible to show basic quantum error correction (QEC) algorithms. However, a truly scalable architecture has not been developed yet. QEC requires a two-dimensional array of qubits, restricting any interconnection to external classical systems to the third axis. In this talk, we introduce an interconnect solution for solid-state qubits: The quantum socket. The quantum socket employs three-dimensional wires and makes it possible to connect classical electronics with quantum circuits more densely and accurately than methods based on wire bonding. The three-dimensional wires are based on spring-loaded pins engineered to insure compatibility with quantum computing applications. Extensive design work and machining was required, with focus on material quality to prevent magnetic impurities. Microwave simulations were undertaken to optimize the design, focusing on the interface between the micro-connector and an on-chip coplanar waveguide pad. Simulations revealed good performance from DC to 10 GHz and were later confirmed against experimental measurements.

Influence of nonmetals recycled from waste printed circuit boards on flexural properties and fracture behavior of polypropylene composites

International Nuclear Information System (INIS)

Zheng Yanhong; Shen Zhigang; Cai Chujiang; Ma Shulin; Xing Yushan

2009-01-01

Flexural strength and flexural modulus of the composites can be successfully improved by filling nonmetals recycled from waste printed circuit boards (PCBs) into polypropylene (PP). By using scanning electron microscopy (SEM), the influence of nonmetals on fracture behavior of PP composites is investigated by in situ flexural test. Observation results show that the particles can effectively lead to mass micro cracks instead of the breaking crack. The process of the crack initiation, propagation and fiber breakage dissipate a great amount of energy. As a result, the flexural properties of the composites can be reinforced significantly. Results of the in situ SEM observation and analysis to the dynamic flexural process supply effective test evidence for the reinforcing mechanism of the nonmetals/PP composites on the basis of the energy dissipation theory

78 FR 69927 - SJI Board of Directors Meeting, Notice

Science.gov (United States)

2013-11-21

... STATE JUSTICE INSTITUTE SJI Board of Directors Meeting, Notice AGENCY: State Justice Institute. ACTION: Notice of meeting. SUMMARY: The SJI Board of Directors will be meeting on Monday, December 9, 2013 at 1:00 p.m. The meeting will be held at the 9th Judicial Circuit of Florida in Orlando, Florida...

Recovery of leaded-frame metals from integrated circuit package; Shuseki kairo package kara no lead frame kinzoku no kaishu

Energy Technology Data Exchange (ETDEWEB)

Rokukawa, N.; Sakamoto, H. [National Institute for Resources and Environment, Tsukuba (Japan)

1997-12-25

Discussions were given on separation and recovery of leaded-frame metals from an integrated circuit (IC) package. A printed wiring board in an electronic device is mounted with an IC package molded with an IC as a major component, and composed of IC chips, leaded-frame metals (the pin section retains the IC chips safely in a mold, and plays a role of terminal with an external circuit), and mold material (thermally hardened and reinforced resin). Quantity of IC packages discarded as a result of the deterioration due to aging is increasing year after year. IC package test pieces were crushed in a mortar, selected of metals manually, and classified by using a magnet and a sieve. The leaded-frame metals were easily separated from the mold material by crushing, and capable of being recovered by using a magnet. However, since the recovered leaded-frame metals are alloys having different compositions, how each metal component could be separated and refined is an important problem to be solved. For the time being, the metals may be utilized as structural materials for building materials by melting and alloying the leaded-frame metals. 10 refs., 7 tabs.

Application of glass-nonmetals of waste printed circuit boards to produce phenolic moulding compound

International Nuclear Information System (INIS)

Guo Jie; Rao Qunli; Xu Zhenming

2008-01-01

The aim of this study was to investigate the feasibility of using glass-nonmetals, a byproduct of recycling waste printed circuit boards (PCBs), to replace wood flour in production of phenolic moulding compound (PMC). Glass-nonmetals were attained by two-step crushing and corona electrostatic separating processes. Glass-nonmetals with particle size shorter than 0.07 mm were in the form of single fibers and resin powder, with the biggest portion (up to 34.6 wt%). Properties of PMC with glass-nonmetals (PMCGN) were compared with reference PMC and the national standard of PMC (PF2C3). When the adding content of glass-nonmetals was 40 wt%, PMCGN exhibited flexural strength of 82 MPa, notched impact strength of 2.4 kJ/m 2 , heat deflection temperature of 175 deg. C, and dielectric strength of 4.8 MV/m, all of which met the national standard. Scanning electron microscopy (SEM) showed strong interfacial bonding between glass fibers and the phenolic resin. All the results showed that the use of glass-nonmetals as filler in PMC represented a promising method for resolving the environmental pollutions and reducing the cost of PMC, thus attaining both environmental and economic benefits

Fabrication and installment of the hard-wired I and C works for the neutral beam injection test stand of the K-STAR project

International Nuclear Information System (INIS)

Jung, Ki Sok; Oh, Byung Hun

2004-12-01

Instrumentation and Control(I and C) of the neutral beam injection test stand (NBI-TS) for the K-STAR national fusion research project has been underway since the start of the project to answer the diverse requests arising from the various facets of the development and construction phases of the project. In a parallel effort with the software oriented I and C development, there has been existing an enormous amount of hard-wiring I and C works for the NBI facility to be developed and fabricated in schedule. Circuits and hardwired functions have been designed, tested, fabricated, and finally installed to the relevant parts of the system. Examples of those hard-wired I and C works are related to the vacuum system, gas feeding system, arc detector circuit, ion source monitoring, bending magnet and calorimeter. Another one to be mentioned is the interlock circuitry. One of the interlock circuits are related to the coolant flow failure. The other is the interlock circuit related to the vacuum failure. All of the above mentioned circuitry now constitutes integral parts for the proper operation of the NBI system; details of those hard-wired I and C work are described in this report

The ultrasonically assisted metals recovery treatment of printed circuit board waste sludge by leaching separation.

Science.gov (United States)

Xie, Fengchun; Li, Haiying; Ma, Yang; Li, Chuncheng; Cai, Tingting; Huang, Zhiyuan; Yuan, Gaoqing

2009-10-15

This paper provides a practical technique that realized industrial scale copper and iron separation from printed circuit board (PCB) waste sludge by ultrasonically assisted acid leaching in a low cost, low energy consumption and zero discharge of wastes manner. The separation efficiencies of copper and iron from acid leaching with assistance of ultrasound were compared with the one without assistance of ultrasound and the effects of the leaching procedure, pH value, and ultrasonic strength have been investigated in the paper. With the appropriate leaching procedure, a final pH of 3.0, an ultrasonic generator power of 160 W (in 1l tank), leaching time of 60 min, leaching efficiencies of copper and iron had reached 97.83% and 1.23%, respectively. Therefore the separation of copper and iron in PCB waste sludge was virtually achieved. The lab results had been successfully applied to the industrial scaled applications in a heavy metal recovery plant in city of Huizhou, China for more than two years. It has great potentials to be used in even the broad metal recovery practices.

Effect of wire shape on wire array discharge

International Nuclear Information System (INIS)

Shimomura, N.; Tanaka, Y.; Yushita, Y.; Nagata, M.; Teramoto, Y.; Katsuki, S.; Akiyama, H.

2001-01-01

Although considerable investigations have been reported on z-pinches to achieve nuclear fusion, little attention has been given from the point of view of how a wire array consisting of many parallel wires explodes. Instability existing in the wire array discharge has been shown. In this paper, the effect of wire shape in the wire array on unstable behavior of the wire array discharge is represented by numerical analysis. The claws on the wire formed in installation of wire may cause uniform current distribution on wire array. The effect of error of wire diameter in production is computed by Monte Carlo Method. (author)

Effect of wire shape on wire array discharge

Energy Technology Data Exchange (ETDEWEB)

Shimomura, N.; Tanaka, Y.; Yushita, Y.; Nagata, M. [University of Tokushima, Department of Electrical and Electronic Engineering, Tokushima (Japan); Teramoto, Y.; Katsuki, S.; Akiyama, H. [Kumamoto University, Department of Electrical and Computer Engineering, Kumamoto (Japan)

2001-09-01

Although considerable investigations have been reported on z-pinches to achieve nuclear fusion, little attention has been given from the point of view of how a wire array consisting of many parallel wires explodes. Instability existing in the wire array discharge has been shown. In this paper, the effect of wire shape in the wire array on unstable behavior of the wire array discharge is represented by numerical analysis. The claws on the wire formed in installation of wire may cause uniform current distribution on wire array. The effect of error of wire diameter in production is computed by Monte Carlo Method. (author)

Space Time – Track Circuits with Trellis Code Modulation

Directory of Open Access Journals (Sweden)

Marius Enulescu

2017-07-01

Full Text Available The track circuits are very important equipments used in the railway transportation system. Today these are used to send vital information, to the running train, in the same time with the integrity checking of the rail. The actual track circuits have a small problem due to the use of the same transmission medium by the signals containing vital information and the return traction current, the running track rails. But this small problem can produce big disturbances in the train circulation, especially in the rush hours. To improve the data transmission to the train on-board equipment, the implementation of new track circuits using new communication technology were studied. This technology is used by the mobile and satellite communications and applies the principle of diversity encoding both time and space through the use of multiple transmission points of the track circuit signal for telegram which is sent to the train. Since this implementation does not satisfy the intended purpose, other modern communication principles such as 8PSK signals modulation and encoding using Trellis Coded Modulation were developed. This new track circuit aims to solve the problems which appeared in the current operation of track circuits and theoretically manages to transmit vital information to the train on board equipment without being affected by disturbances in electric traction transport systems.

Influence of incorporation of powder of printed circuit boards on technological properties and microstructure of triaxial ceramics

International Nuclear Information System (INIS)

Stafford, F.N.; Hotza, D.

2012-01-01

Using the methodology of experiments with mixtures, seven formulations of clay, phyllite, and printed circuit boards (PCB) were obtained to study the influence of this waste on triaxial ceramic tiles. Each formulation was processed under conditions similar to those used in the ceramic tiles industry, and characterized for fired modulus of rupture (FMoR) and water absorption (WA). The samples sintered at 1180°C were also subjected to analysis by XRD and SEM. The lowest resistance was observed in samples with 40% residue, while the highest strength occurred for samples with 14% residue, which reached average values of mechanical strength and water absorption of 35.0 MPa and 2.0%, respectively. The microstructure showed that it is possible to use waste of PCB in triaxial ceramic, which exhibits a fluxing behavior and it has an important effect on the sinterability and the development of appropriate microstructures. (author)

Printed circuit board recycling: Physical processing and copper extraction by selective leaching.

Science.gov (United States)

Silvas, Flávia P C; Correa, Mónica M Jiménez; Caldas, Marcos P K; de Moraes, Viviane T; Espinosa, Denise C R; Tenório, Jorge A S

2015-12-01

Global generation of waste electrical and electronic equipment (WEEE) is about 40 million tons per year. Constant increase in WEEE generation added to international legislations has improved the development of processes for materials recovery and sustainability of electrical and electronic industry. This paper describes a new hydrometallurgical route (leaching process) to recycle printed circuit boards (PCBs) from printers to recover copper. Methodology included PCBs characterization and a combined route of physical and hydrometallurgical processing. Magnetic separation, acid digestion and chemical analysis by ICP-OES were performed. On leaching process were used two stages: the first one in a sulfuric media and the second in an oxidant media. The results showed that the PCBs composition was 74.6 wt.% of non-magnetic material and 25.4 wt.% of magnetic one. The metallic fraction corresponded to 44.0 wt.%, the polymeric to 28.5 wt.% and the ceramic to 27.5 wt.%. The main metal was copper and its initial content was 32.5 wt.%. On sulfuric leaching 90 wt.% of Al, 40 wt.% of Zn and 8.6 wt.% of Sn were extracted, whereas on oxidant leaching tests the extraction percentage of Cu was 100 wt.%, of Zn 60 wt.% and of Al 10 wt.%. At the end of the hydrometallurgical processing was obtained 100% of copper extraction and the recovery factor was 98.46%, which corresponds to a 32 kg of Cu in 100 kg of PCB. Copyright © 2015 Elsevier Ltd. All rights reserved.

Evolvable designs of experiments applications for circuits

CERN Document Server

Iordache, Octavian

2009-01-01

Adopting a groundbreaking approach, the highly regarded author shows how to design methods for planning increasingly complex experiments. He begins with a brief introduction to standard quality methods and the technology in standard electric circuits. The book then gives numerous examples of how to apply the proposed methodology in a series of real-life case studies. Although these case studies are taken from the printed circuit board industry, the methods are equally applicable to other fields of engineering.

Detection of transient disturbing signals on PC boards

Directory of Open Access Journals (Sweden)

S. Korte

2008-05-01

Full Text Available This paper shows a possibility to visualize signal propagation in electronic circuits. Instead of using various galvanic measurement points all over the circuit, a test method is shown which measures the radiated field of the printed circuit board. By use of a 2-dimensional positionable field probe it is possible to get an overview over the signals running on the different parts of the PCB. In order to measure transient disturbing signals and distinguish them from normal device operation, problems of probe design and triggering need to be discussed.

Tamper-Proof Circuits : : How to Trade Leakage for Tamper-Resilience

DEFF Research Database (Denmark)

Faust, Sebastian; Pietrzak, Krzysztof; Venturi, Daniele

2011-01-01

Tampering attacks are cryptanalytic attacks on the implementation of cryptographic algorithms (e.g., smart cards), where an adversary introduces faults with the hope that the tampered device will reveal secret information. Inspired by the work of Ishai et al. [Eurocrypt’06], we propose a compiler...... complex computation to protecting simple components....... that transforms any circuit into a new circuit with the same functionality, but which is resilient against a well-defined and powerful tampering adversary. More concretely, our transformed circuits remain secure even if the adversary can adaptively tamper with every wire in the circuit as long as the tampering......-box access to the original circuit and log(q) bits of additional auxiliary information. Thus, if the implemented cryptographic scheme is secure against log(q) bits of leakage, then our implementation is tamper-proof in the above sense. Surprisingly, allowing for this small amount of information leakage...

A reliability analysis tool for SpaceWire network

Science.gov (United States)

Zhou, Qiang; Zhu, Longjiang; Fei, Haidong; Wang, Xingyou

2017-04-01

A SpaceWire is a standard for on-board satellite networks as the basis for future data-handling architectures. It is becoming more and more popular in space applications due to its technical advantages, including reliability, low power and fault protection, etc. High reliability is the vital issue for spacecraft. Therefore, it is very important to analyze and improve the reliability performance of the SpaceWire network. This paper deals with the problem of reliability modeling and analysis with SpaceWire network. According to the function division of distributed network, a reliability analysis method based on a task is proposed, the reliability analysis of every task can lead to the system reliability matrix, the reliability result of the network system can be deduced by integrating these entire reliability indexes in the matrix. With the method, we develop a reliability analysis tool for SpaceWire Network based on VC, where the computation schemes for reliability matrix and the multi-path-task reliability are also implemented. By using this tool, we analyze several cases on typical architectures. And the analytic results indicate that redundancy architecture has better reliability performance than basic one. In practical, the dual redundancy scheme has been adopted for some key unit, to improve the reliability index of the system or task. Finally, this reliability analysis tool will has a directive influence on both task division and topology selection in the phase of SpaceWire network system design.

Analysis of thermal characteristics of electrical wiring for load groups in cattle barns.

Science.gov (United States)

Kim, Doo Hyun; Yoo, Sang-Ok; Kim, Sung Chul; Hwang, Dong Kyu

2015-01-01

The purpose of the current study is to analyze the thermal characteristics of electrical wirings depending on the number of operating load by connecting four types of electrical wirings that are selected by surveying the conditions for the electric fans, automatic waterers and halogen warm lamps that were installed in cattle barns in different years. The conditions of 64 cattle barns were surveyed and an experimental test was conducted at a cattle barn. The condition-survey covered inappropriate design, construction and misuse of electrical facility, including electrical wiring mostly used, and the mode of load current was evaluated. The survey showed that the mode of load current increased as the installation year of the fans, waterers and halogen lamps became older. Accordingly, the cattle barn manager needed to increase the capacity of the circuit breaker, which promoted the degradation of insulation of the electrical wires' sheath and increased possibility for electrical fires in the long-run. The test showed that the saturation temperature of the wire insulated sheath increased depending on the installation year of the load groups, in case of VCTFK and VFF electric wires, therefore, requiring their careful usage in the cattle barns.

Fabrication-process-induced variations of Nb/Al/AlOx/Nb Josephson junctions in superconductor integrated circuits

International Nuclear Information System (INIS)

Tolpygo, Sergey K; Amparo, Denis

2010-01-01

Currently, superconductor digital integrated circuits fabricated at HYPRES, Inc. can operate at clock frequencies approaching 40 GHz. The circuits present multilayered structures containing tens of thousands of Nb/Al/AlO x /Nb Josephson junctions (JJs) of various sizes interconnected by four Nb wiring layers, resistors, and other circuit elements. In order to be fully operational, the integrated circuits should be fabricated such that the critical currents of the JJs are within the tight design margins and the proper relationships between the critical currents of JJs of different sizes are preserved. We present experimental data and discuss mechanisms of process-induced variations of the critical current and energy gap of Nb/Al/AlO x /Nb JJs in integrated circuits. We demonstrate that the Josephson critical current may depend on the type and area of circuit elements connected to the junction, on the circuit pattern, and on the step in the fabrication process at which the connection is made. In particular, we discuss the influence of (a) the junction base electrode connection to the ground plane, (b) the junction counter electrode connection to the ground plane, and (c) the counter electrode connection to the Ti/Au or Ti/Pd/Au contact pads by Nb wiring. We show that the process-induced changes of the properties of Nb/Al/AlO x /Nb junctions are caused by migration of impurity atoms (hydrogen) between the different layers comprising the integrated circuits.

Short circuit detection in the winding and operation of superconducting magnets

International Nuclear Information System (INIS)

Walstrom, P.L.

1982-01-01

Three categories of shorts will be discussed: (1) shorts to the metallic bobbin or other structural elements, (2) shorts between turns caused by instrumentation wires that are deliberately connected to a turn at the end (e.g., voltage taps) and that short out to another turn but are not completely severed in the process, and (3) short circuits between turns caused by direct contact due to insulation failure by chips of metal bridging turns and by instrumentation wires that bridge turns but are severed in the process of shorting

Measurements of the Effects of Smoke on Active Circuits

International Nuclear Information System (INIS)

Tanaka, T.J.

1999-01-01

Smoke has long been recognized as the most common source of fire damage to electrical equipment; however, most failures have been analyzed after the fire was out and the smoke vented. The effects caused while the smoke is still in the air have not been explored. Such effects have implications for new digital equipment being installed in nuclear reactors. The U.S. Nuclear Regulatory Commission is sponsoring work to determine the impact of smoke on digital instrumentation and control. As part of this program, Sandia National Laboratories has tested simple active circuits to determine how smoke affects them. These tests included the study of three possible failure modes on a functional board: (1) circuit bridging, (2) corrosion (metal loss), and (3) induction of stray capacitance. The performance of nine different circuits was measured continuously on bare and conformably coated boards during smoke exposures lasting 1 hour each and continued for 24 hours after the exposure started. The circuit that was most affected by smoke (100% change in measured values) was the one most sensitive to circuit bridging. Its high impedance (50 MOmega) was shorted during the exposure, but in some cases recovered after the smoke was vented. The other two failure modes, corrosion and induced stray capacitance, caused little change in the function of the circuits. The smoke permanently increased resistance of the circuit tested for corrosion, implying that the cent acts were corroded. However, the change was very small (< 2%). The stray-capacitance test circuit showed very little change after a smoke exposure in either the short or long term. The results of the tests suggest that conformal coatings and type of circuit are major considerations when designing digital circuitry to be used in critical control systems

Measurements of the effects of smoke on active circuits

International Nuclear Information System (INIS)

Tanaka, T.J.

1998-01-01

Smoke has long been recognized as the most common source of fire damage to electrical equipment; however, most failures have been analyzed after the fire was out and the smoke vented. The effects caused while the smoke is still in the air have not been explored. Such effects have implications for new digital equipment being installed in nuclear reactors. The US Nuclear Regulatory Commission is sponsoring work to determine the impact of smoke on digital instrumentation and control. As part of this program, Sandia National Laboratories has tested simple active circuits to determine how smoke affects them. These tests included the study of three possible failure modes on a functional board: (1) circuit bridging, (2) corrosion (metal loss), and (3) induction of stray capacitance. The performance of nine different circuits was measured continuously on bare and conformally coated boards during smoke exposures lasting 1 hour each and continued for 24 hours after the exposure started. The circuit that was most affected by smoke (100% change in measured values) was the one most sensitive to circuit bridging. Its high impedance (50 Mohm) was shorted during the exposure, but in some cases recovered after the smoke was vented. The other two failure modes, corrosion and induced stray capacitance, caused little change in the function of the circuits. The smoke permanently increased resistance of the circuit tested for corrosion, implying that the contacts were corroded. However, the change was very small (< 2%). The stray capacitance test circuit showed very little change after a smoke exposure in either the short or long term. The results of the tests suggest that conformal coatings and type of circuit are major considerations when designing digital circuitry to be used in critical control systems

Simulation of electronic circuit sensitivity towards humidity using electrochemical data on water layer

DEFF Research Database (Denmark)

Joshy, Salil; Verdingovas, Vadimas; Jellesen, Morten Stendahl

2015-01-01

Climatic conditions like temperature and humidity have direct influence on the operation of electronic circuits. The effects of temperature on the operation of electronic circuits have been widely investigated, while the effect of humidity and solder flux residues are not well understood including...... the effect on circuit and PCBA (printed circuit board assembly) layout design. This paper elucidates a methodology for analyzing the sensitivity of an electronic circuit based on parasitic circuit analysis using data on electrical property of the water layer formed under humid as well as contaminated...

Easy route to superhydrophobic copper-based wire-guided droplet microfluidic systems.

Science.gov (United States)

Mumm, Florian; van Helvoort, Antonius T J; Sikorski, Pawel

2009-09-22

Droplet-based microfluidic systems are an expansion of the lab on a chip concept toward flexible, reconfigurable setups based on the modification and analysis of individual droplets. Superhydrophobic surfaces are one suitable candidate for the realization of droplet-based microfluidic systems as the high mobility of aqueous liquids on such surfaces offers possibilities to use novel or more efficient approaches to droplet movement. Here, copper-based superhydrophobic surfaces were produced either by the etching of polycrystalline copper samples along the grain boundaries using etchants common in the microelectronics industry, by electrodeposition of copper films with subsequent nanowire decoration based on thermal oxidization, or by a combination of both. The surfaces could be easily hydrophobized with thiol-modified fluorocarbons, after which the produced surfaces showed a water contact angle as high as 171 degrees +/- 2 degrees . As copper was chosen as the base material, established patterning techniques adopted from printed circuit board fabrication could be used to fabricate macrostructures on the surfaces with the intention to confine the droplets and, thus, to reduce the system's sensitivity to tilting and vibrations. A simple droplet-based microfluidic chip with inlets, outlets, sample storage, and mixing areas was produced. Wire guidance, a relatively new actuation method applicable to aqueous liquids on superhydrophobic surfaces, was applied to move the droplets.

Pattern Generator for Bench Test of Digital Boards

Science.gov (United States)

Berkun, Andrew C.; Chu, Anhua J.

2012-01-01

All efforts to develop electronic equipment reach a stage where they need a board test station for each board. The SMAP digital system consists of three board types that interact with each other using interfaces with critical timing. Each board needs to be tested individually before combining into the integrated digital electronics system. Each board needs critical timing signals from the others to be able to operate. A bench test system was developed to support test of each board. The test system produces all the outputs of the control and timing unit, and is delivered much earlier than the timing unit. Timing signals are treated as data. A large file is generated containing the state of every timing signal at any instant. This file is streamed out to an IO card, which is wired directly to the device-under-test (DUT) input pins. This provides a flexible test environment that can be adapted to any of the boards required to test in a standalone configuration. The problem of generating the critical timing signals is then transferred from a hardware problem to a software problem where it is more easily dealt with.

IE Information Notice No. 85-18, Supplement 1: Failures of undervoltage output circuit boards in the Westinghouse-designed solid state protection system

International Nuclear Information System (INIS)

Rossi, C.E.

1992-01-01

The US Nuclear Regulatory Commission (NRC) is issuing this information notice supplement to alert addressees to continuing problems associated with the undervoltage (UV) output circuit boards (driver cards) in the solid state protection system (SSPS) designed by the Westinghouse Electric Corporation (Westinghouse). On June 3, 1991, the Shearon Harris Nuclear Power Plant, Unit 1, (Harris) experienced an automatic reactor trip from 100 percent power on a spurious low reactor coolant system loop flow signal. The signal was generated as a result of a surveillance test being performed on one of three loop flow transmitters. The licensee attributed the spurious signal to both procedural inadequacies and personnel error. A control room operator verified that all control rods had fully inserted following the trip signal and that reactor power was properly decreasing. However, about 22 seconds after the automatic trip signal was generated, operators discovered that the ''A'' reactor trip breaker (RTB) had not opened. The RTB was manually opened using the reactor trip switch on the main control board. Subsequent analyses are discussed

A Compact Cosmic Ray Telescope using Silicon Photomultipliers for use in High Schools

Science.gov (United States)

Castro, Luis; Elizondo, Leonardo; Shelor, Mark; Cervantes, Omar; Fan, Sewan; Ritt, Stefan

2016-03-01

Over the years, the QuarkNet and the LBL Cosmic Ray Project have helped trained thousands of high school students and teachers to explore cosmic ray physics. To get high school students in the Salinas, CA area also excited about cosmic rays, we constructed a cosmic ray telescope as a physics outreach apparatus. Our apparatus includes a pair of plastic scintillators coupled to silicon photomultipliers (SiPM) and a coincidence circuit board. We designed and constructed custom circuit boards for mounting the SiPM detectors, the high voltage power supplies and coincidence AND circuit. The AND logic signals can be used for triggering data acquisition devices including an oscilloscope, a waveform digitizer or an Arduino microcontroller. To properly route the circuit wire traces, the circuit boards were layout in Eagle and fabricated in-house using a circuit board maker from LPKF LASER, model Protomat E33. We used a Raspberry Pi computer to control a fast waveform sampler, the DRS4 to digitize the SiPM signal waveforms. The CERN PAW software package was used to analyze the amplitude and time distributions of SiPM detector signals. At this conference, we present our SiPM experimental setup, circuit board fabrication procedures and the data analysis work flow. AIP Megger's Award, Dept. of Ed. Title V Grant PO31S090007.

Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

Science.gov (United States)

Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

2018-03-01

Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

Science.gov (United States)

Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

2018-06-01

Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

Characterization of Printed Circuit Boards for Metal and Energy Recovery after Milling and Mechanical Separation

Directory of Open Access Journals (Sweden)

Waldir A. Bizzo

2014-06-01

Full Text Available The proper disposal of electrical and electronic waste is currently a concern of researchers and environmental managers not only because of the large volume of such waste generated, but also because of the heavy metals and toxic substances it contains. This study analyzed printed circuit boards (PCBs from discarded computers to determine their metal content and characterized them as solid waste and fuel. The analysis showed that PCBs consist of approximately 26% metal, made up mainly of copper, lead, aluminum, iron and tin, as well as other heavy metals such as cadmium and nickel. Comparison with the results of other studies indicated that the concentration of precious metals (gold and silver has declined over time. Analysis of the leachate revealed high concentrations of cadmium and lead, giving the residue the characteristics of hazardous waste. After milling the PCBs, we found that larger amounts of metal were concentrated in smaller fractions, while the lightest fraction, obtained by density separation, had a gross calorific value of approximately 11 MJ/kg, although with a high ash content. Milling followed by density separation proved potentially useful for recovery of metals and energy-rich fractions.

A full feature FASTBUS slave interface using semicustom integrated circuits

International Nuclear Information System (INIS)

Skegg, R.; Daviel, A.; Downing, R.

1986-01-01

Two semi-custom integrated circuits have been designed and manufactured which enable the construction of a full featured FASTBUS slave interface without the need for a detailed knowledge of the FASTBUS protocol. A relatively small amount of board space is required compared to implementations using conventional circuits. The semi-custom devices are described in detail, and an application example is given. (orig.)

Elements configuration of the open lead test circuit

International Nuclear Information System (INIS)

Fukuzaki, Yumi; Ono, Akira

2016-01-01

In the field of electronics, small electronic devices are widely utilized because they are easy to carry. The devices have various functions by user’s request. Therefore, the lead’s pitch or the ball’s pitch have been narrowed and high-density printed circuit board has been used in the devices. Use of the ICs which have narrow lead pitch makes normal connection difficult. When logic circuits in the devices are fabricated with the state-of-the-art technology, some faults have occurred more frequently. It can be divided into types of open faults and short faults. We have proposed a new test method using a test circuit in the past. This paper propose elements configuration of the test circuit.

Elements configuration of the open lead test circuit

Energy Technology Data Exchange (ETDEWEB)

Fukuzaki, Yumi, E-mail: 14514@sr.kagawa-nct.ac.jp [Advanced course of Electronics, Information and Communication Engineering, National Institute of Technology, Kagawa College, 551 Koda, Mitoyo, Kagawa (Japan); Ono, Akira [Department of Communication Network Engineering, National Institute of Technology, Kagawa College, 551 Koda, Mitoyo, Kagawa (Japan)

2016-07-06

In the field of electronics, small electronic devices are widely utilized because they are easy to carry. The devices have various functions by user’s request. Therefore, the lead’s pitch or the ball’s pitch have been narrowed and high-density printed circuit board has been used in the devices. Use of the ICs which have narrow lead pitch makes normal connection difficult. When logic circuits in the devices are fabricated with the state-of-the-art technology, some faults have occurred more frequently. It can be divided into types of open faults and short faults. We have proposed a new test method using a test circuit in the past. This paper propose elements configuration of the test circuit.

Evaluation of gold and silver leaching from printed circuit board of cellphones.

Science.gov (United States)

Petter, P M H; Veit, H M; Bernardes, A M

2014-02-01

Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining "reference" values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2h at 60°C and 80°C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO3were made. The leaching of Au and Ag with alternative reagents: Na2S2O3, and (NH4)2S2O3 in 0.1M concentration with the addition of CuSO4, NH4OH, and H2O2, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO4 was added. Copyright © 2013 Elsevier Ltd. All rights reserved.

Using vacuum pyrolysis and mechanical processing for recycling waste printed circuit boards

International Nuclear Information System (INIS)

Long Laishou; Sun Shuiyu; Zhong Sheng; Dai Wencan; Liu Jingyong; Song Weifeng

2010-01-01

The constant growth in generation of waste printed circuit boards (WPCB) poses a huge disposal problem because they consist of a heterogeneous mixture of organic and metallic chemicals as well as glass fiber. Also the presence of heavy metals, such as Pb and Cd turns this scrap into hazardous waste. Therefore, recycling of WPCB is an important subject not only from the recovery of valuable materials but also from the treatment of waste. The aim of this study was to present a recycling process without negative impact to the environment as an alternative for recycling WPCB. In this work, a process technology containing vacuum pyrolysis and mechanical processing was employed to recycle WPCB. At the first stage of this work, the WPCB was pyrolyzed under vacuum in a self-made batch pilot-scale fixed bed reactor to recycle organic resins contained in the WPCB. By vacuum pyrolysis the organic matter was decomposed to gases and liquids which could be used as fuels or chemical material resources, however, the inorganic WPCB matter was left unaltered as solid residues. At the second stage, the residues obtained at the first stage were investigated to separate and recover the copper through mechanical processing such as crushing, screening, and gravity separation. The copper grade of 99.50% with recovery of 99.86% based on the whole WPCB was obtained. And the glass fiber could be obtained by calcinations in a muffle furnace at 600 deg. C for 10 min. This study had demonstrated the feasibility of vacuum pyrolysis and mechanical processing for recycling WPCB.

SpaceWire Driver Software for Special DSPs

Science.gov (United States)

Clark, Douglas; Lux, James; Nishimoto, Kouji; Lang, Minh

2003-01-01

A computer program provides a high-level C-language interface to electronics circuitry that controls a SpaceWire interface in a system based on a space qualified version of the ADSP-21020 digital signal processor (DSP). SpaceWire is a spacecraft-oriented standard for packet-switching data-communication networks that comprise nodes connected through bidirectional digital serial links that utilize low-voltage differential signaling (LVDS). The software is tailored to the SMCS-332 application-specific integrated circuit (ASIC) (also available as the TSS901E), which provides three highspeed (150 Mbps) serial point-to-point links compliant with the proposed Institute of Electrical and Electronics Engineers (IEEE) Standard 1355.2 and equivalent European Space Agency (ESA) Standard ECSS-E-50-12. In the specific application of this software, the SpaceWire ASIC was combined with the DSP processor, memory, and control logic in a Multi-Chip Module DSP (MCM-DSP). The software is a collection of low-level driver routines that provide a simple message-passing application programming interface (API) for software running on the DSP. Routines are provided for interrupt-driven access to the two styles of interface provided by the SMCS: (1) the "word at a time" conventional host interface (HOCI); and (2) a higher performance "dual port memory" style interface (COMI).

Fabrication and installment of hard-wired I and C works for the neutral beam injection system of the KSTAR project

International Nuclear Information System (INIS)

Jung, Ki Sok; Oh, Byung Hun; In, Sang Ryul; Yoon, Jae Sung

2004-01-01

Instrumentation and Control(I and C) of the neutral beam injection(NBI) system for the K-STAR national fusion research project has been working from the start of the project to answer diverse requests arising from various facets of the development and construction phases of the project. In a parallel effort with the software oriented I and C development, there has been existing an enormous amount of hard-wiring I and C works for the NBI facility to be developed and fabricated in schedule. Circuits and hardwired functions have been designed, tested, fabricated, and finally installed to the relevant parts of the system. Some examples of those hard-wired I and C works are related to the vacuum system, gas feeding system, arc detector circuit, ion source monitoring, bending magnet and calorimeter. They are one of those integral parts for the proper operation of the NBI system. Examples of those hard-wired I and C works are introduced in this presentation

Circuit for Communication Over Power Lines

Science.gov (United States)

Krasowski, Michael J.; Prokop, Normal F.; Greer, Lawrence C., III; Nappier, Jennifer

2011-01-01

Many distributed systems share common sensors and instruments along with a common power line supplying current to the system. A communication technique and circuit has been developed that allows for the simple inclusion of an instrument, sensor, or actuator node within any system containing a common power bus. Wherever power is available, a node can be added, which can then draw power for itself, its associated sensors, and actuators from the power bus all while communicating with other nodes on the power bus. The technique modulates a DC power bus through capacitive coupling using on-off keying (OOK), and receives and demodulates the signal from the DC power bus through the same capacitive coupling. The circuit acts as serial modem for the physical power line communication. The circuit and technique can be made of commercially available components or included in an application specific integrated circuit (ASIC) design, which allows for the circuit to be included in current designs with additional circuitry or embedded into new designs. This device and technique moves computational, sensing, and actuation abilities closer to the source, and allows for the networking of multiple similar nodes to each other and to a central processor. This technique also allows for reconfigurable systems by adding or removing nodes at any time. It can do so using nothing more than the in situ power wiring of the system.

Development of circuit model for arcing on solar panels

International Nuclear Information System (INIS)

Mehta, Bhoomi K; Deshpande, S P; Mukherjee, S; Gupta, S B; Ranjan, M; Rane, R; Vaghela, N; Acharya, V; Sudhakar, M; Sankaran, M; Suresh, E P

2010-01-01

The increased requirements of payload capacity of the satellites have resulted in much higher power requirements of the satellites. In order to minimize the energy loss during power transmission due to cable loss, use of high voltage solar panels becomes necessary. When a satellite encounters space plasma it floats negatively with respect to the surrounding space plasma environment. At high voltage, charging and discharging on solar panels causes the power system breakdown. Once a solar panel surface is charged and potential difference between surface insulator and conductor exceeds certain value, electrostatic discharge (ESD) may occur. This ESD may trigger a secondary arc that can destroy the solar panel circuit. ESD is also called as primary or minor arc and secondary is called major arc. The energy of minor arc is supplied by the charge stored in the coverglass of solar array and is a pulse of typically several 100 ns to several 100 μs duration. The damage caused by minor arc is less compared to major arcs, but it is observed that the minor arc is cause of major arc. Therefore it is important to develop an understanding of minor arc and mitigation techniques. In this paper we present a linear circuit analysis for minor arcs on solar panels. To study arcing event, a ground experimental facility to simulate space plasma environment has been developed at Facilitation Centre for Industrial Plasma Technologies (Institute for Plasma Research) in collaboration with Indian Space Research Organization's ISRO Satellite Technology Centre (ISAC). A linear circuit model has been developed to explain the experimental results by representing the coverglass, solar cell interconnect and wiring by an LCR circuit and the primary arc by an equivalent LR circuit. The aim of the circuit analysis is to predict the arc current which flows through the arc plasma. It is established from the model that the current depends on various parameters like potential difference between insulator

Experimental Study of WBFC method for testing electromagnetic immunity of integrated circuits

OpenAIRE

香川, 直己; カガワ, ナオキ; Naoki, KAGAWA

2004-01-01

The author made a workbench faraday cage, WBFC, in order to estimate performance of the WBFC method for the measurement of common mode noise immunity of integrated circuits. In this report, characteristics of the constructed workbench faraday cage and results of experimental study of effects of the common mode noise on a circuit board including an electronic device are shown. Selected DUT, LM324 is popular operational amplifier for electrical circuits in vehicles.

At grade optical crossover for monolithic optial circuits

Science.gov (United States)

Jamieson, Robert S. (Inventor)

1983-01-01

Planar optical circuits may be made to cross through each other, (thus eliminating extra steps required to fabricate elevated, nonintersecting crossovers) by control of the dimensions of the crossing light conductors (10, 12) to be significantly greater than d=0.89.lambda. and the angle of crossing as nearly 90.degree. as conveniently possible. A light trap may be provided just ahead of the intersection to trap any light being reflected in the source conductor at angles greater than about 45.degree.. The light trap may take the form of triangular shaped portions (16a, 16b) on each side of the source conductor with the far side of the triangular portion receiving incident light at an angle so that incident light will be reflected to the other side, or it may take the form of windows (18a, 18b) in place of the triangular portions. Planar optical circuit boards (21-23) may be fabricated and stacked to form a keyboard (20) with intersecting conductors (26-29) and keyholes (0-9) where conductors merge at the broad side of the circuit boards. These keyholes may be prearranged to form an array or matrix of keyholes.

Wiring economy and volume exclusion determine neuronal placement in the Drosophila brain.

Science.gov (United States)

Rivera-Alba, Marta; Vitaladevuni, Shiv N; Mishchenko, Yuriy; Mischenko, Yuriy; Lu, Zhiyuan; Takemura, Shin-Ya; Scheffer, Lou; Meinertzhagen, Ian A; Chklovskii, Dmitri B; de Polavieja, Gonzalo G

2011-12-06

Wiring economy has successfully explained the individual placement of neurons in simple nervous systems like that of Caenorhabditis elegans [1-3] and the locations of coarser structures like cortical areas in complex vertebrate brains [4]. However, it remains unclear whether wiring economy can explain the placement of individual neurons in brains larger than that of C. elegans. Indeed, given the greater number of neuronal interconnections in larger brains, simply minimizing the length of connections results in unrealistic configurations, with multiple neurons occupying the same position in space. Avoiding such configurations, or volume exclusion, repels neurons from each other, thus counteracting wiring economy. Here we test whether wiring economy together with volume exclusion can explain the placement of neurons in a module of the Drosophila melanogaster brain known as lamina cartridge [5-13]. We used newly developed techniques for semiautomated reconstruction from serial electron microscopy (EM) [14] to obtain the shapes of neurons, the location of synapses, and the resultant synaptic connectivity. We show that wiring length minimization and volume exclusion together can explain the structure of the lamina microcircuit. Therefore, even in brains larger than that of C. elegans, at least for some circuits, optimization can play an important role in individual neuron placement. Copyright © 2011 Elsevier Ltd. All rights reserved.

Lithographic technology for microwave integrated circuits

OpenAIRE

Shepherd, PR; Evans, PSA; Ramsey, BJ; Harrison, DJ

1997-01-01

Conductive lithographic films (CLFs) have been developed primarily as substitutes for resin/laminate boards, which share properties with the metallisation patterns used in planar microwave integrated circuits (MICs). The authors examine the microwave properties of the films and show that, although the losses are greater, they have potential as an alternative to the traditional manufacturing process of MICs.

Experimental Investigation of Pool Boiling for Single and Double Heaters Using Printed Circuit Board

International Nuclear Information System (INIS)

Han, Won Seok; Lee, Jae Young

2012-01-01

Over the past several decades, a considerable number of studies have been conducted on boiling heat transfer in pool boiling. Boiling heat transfer is used in a variety of cooling applications, such as heat exchangers, high powered electronics, and nuclear reactors. Nucleate boiling is one of the most efficient heat transfer mechanisms in boiling regime, but it is imperative that the critical heat flux(CHF) should not be exceeded. CHF phenomenon leads to a dramatic rise in wall temperature, decreased heat transfer, and material failure. Although numerous attempts have been made by researchers to demonstrate the CHF, there is little agreement with the CHF mechanism. In recent years, many researchers have been focusing on surface condition using nanoparticles and surface enhancements, such as a micro structure and artificial cavities, due to enhancement of the CHF point. Cooke and Kandlikar used chips etched with microchannels to prove that these structure has the most enhancement effect. They found that the most efficient boiling surface is with a larger channel size and deep etch. The purpose of this paper is to evaluate the heat transfer and CHF of double heaters on printed circuit board(PCB) in pool boiling. In addition, bubble dynamics of nucleate boiling were observed with high speed observation on single and double heaters using PCB heater

Supergravity separation of Pb and Sn from waste printed circuit boards at different temperatures

Science.gov (United States)

Meng, Long; Wang, Zhe; Zhong, Yi-wei; Chen, Kui-yuan; Guo, Zhan-cheng

2018-02-01

Printed circuit boards (PCBs) contain many toxic substances as well as valuable metals, e.g., lead (Pb) and tin (Sn). In this study, a novel technology, named supergravity, was used to separate different mass ratios of Pb and Sn from Pb-Sn alloys in PCBs. In a supergravity field, the liquid metal phase can permeate from solid particles. Hence, temperatures of 200, 280, and 400°C were chosen to separate Pb and Sn from PCBs. The results depicted that gravity coefficient only affected the recovery rates of Pb and Sn, whereas it had little effect on the mass ratios of Pb and Sn in the obtained alloys. With an increase in gravity coefficient, the recovery values of Pb and Sn in each step of the separation process increased. In the single-step separation process, the mass ratios of Pb and Sn in Pb-Sn alloys were 0.55, 0.40, and 0.64 at 200, 280, and 400°C, respectively. In the two-step separation process, the mass ratios were 0.12 and 0.55 at 280 and 400°C, respectively. Further, the mass ratio was observed to be 0.76 at 400°C in the three-step separation process. This process provides an innovative approach to the recycling mechanism of Pb and Sn from PCBs.

wire chamber

CERN Multimedia

Proportional multi-wire chamber. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle. Proportional wire chambers allow a much quicker reading than the optical or magnetoscriptive readout wire chambers.

Advanced engineering materials and thick film hybrid circuit technology

International Nuclear Information System (INIS)

Faisal, S.; Aslam, M.; Mehmood, K.

2006-01-01

The use of Thick Film hybrid Technology to manufacture electronic circuits and passive components continues to grow at rapid rate. Thick Film Technology can be viewed as a means of packaging active devices, spanning the gap between monolithic integrated circuit chips and printed circuit boards with attached active and passive components. An advancement in engineering materials has moved from a formulating art to a base of greater understanding of relationship of material chemistry to the details of electrical and mechanical performance. This amazing advancement in the field of engineering materials has brought us up to a magnificent standard that we are able to manufacture small size, low cost and sophisticated electronic circuits of Military, Satellite systems, Robotics, Medical and Telecommunications. (author)

Wire breakage in SLC wire profile monitors

International Nuclear Information System (INIS)

Field, C.; McCormick, D.; Raimondi, P.; Ross, M.

1998-05-01

Wire scanning beam profile monitors are used at the Stanford Linear Collider (SLC) for emittance preservation control and beam optics optimization. Twenty such scanners have proven most useful for this purpose and have performed a total of 1.5 million scans in the 4 to 6 years since their installation. Most of the essential scanners are equipped with 20 to 40 microm tungsten wires. SLC bunch intensities and sizes often exceed 2 x 10 7 particles/microm 2 (3C/m 2 ). The authors believe that this has caused a number of tungsten wire failures that appear at the ends of the wire, near the wire support points, after a few hundred scans are accumulated. Carbon fibers, also widely used at SLAC, have been substituted in several scanners and have performed well. In this paper, the authors present theories for the wire failure mechanism and techniques learned in reducing the failures

Experimental industrial signal acquisition board in a large scientific device

Science.gov (United States)

Zeng, Xiangzhen; Ren, Bin

2018-02-01

In order to measure the industrial signal of neutrino experiment, a set of general-purpose industrial data acquisition board has been designed. It includes the function of switch signal input and output, and the function of analog signal input. The main components are signal isolation amplifier and filter circuit, ADC circuit, microcomputer systems and isolated communication interface circuit. Through the practical experiments, it shows that the system is flexible, reliable, convenient and economical, and the system has characters of high definition and strong anti-interference ability. Thus, the system fully meets the design requirements.

Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment

International Nuclear Information System (INIS)

Zou, Shiwen; Li, Xiaogang; Dong, Chaofang; Ding, Kangkang; Xiao, Kui

2013-01-01

Highlights: •The electrochemical migration, whisker formation, and corrosion behavior of PCB under wet H 2 S environment were observed and studied systematically. •The process of electrochemical migration of solder joints is explained. •The corrosion mechanism of PCB interconnectors induced by micro pores under wet H 2 S environment is discussed, and the corrosion reaction model is proposed. -- Abstract: Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board (PCB) under wet H 2 S environment were analyzed by environment scanning electron microscope (ESEM), Energy dispersive X-ray spectroscopy (EDS) with mapping and element phase cluster (EPC) techniques, Raman Spectrum analysis and electrochemical impedance spectroscopy (EIS) technology. The results showed that nonuniform corrosion behavior occurred on PCB surfaces under 1 ppm wet H 2 S at 40 °C; whiskers formed on the inner sidewall of via-holes with a growth rate of 1.2 Å/s; numerous corrosion products migrated through the pore of plated gold layer, which broke off the protective layer. The corrosion rate was accelerated according to the big-cathode-small-anode model

Microglia Modulate Wiring of the Embryonic Forebrain

Directory of Open Access Journals (Sweden)

Paola Squarzoni

2014-09-01

Full Text Available Dysfunction of microglia, the tissue macrophages of the brain, has been associated with the etiology of several neuropsychiatric disorders. Consistently, microglia have been shown to regulate neurogenesis and synaptic maturation at perinatal and postnatal stages. However, microglia invade the brain during mid-embryogenesis and thus could play an earlier prenatal role. Here, we show that embryonic microglia, which display a transiently uneven distribution, regulate the wiring of forebrain circuits. Using multiple mouse models, including cell-depletion approaches and cx3cr1−/−, CR3−/−, and DAP12−/− mutants, we find that perturbing microglial activity affects the outgrowth of dopaminergic axons in the forebrain and the laminar positioning of subsets of neocortical interneurons. Since defects in both dopamine innervation and cortical networks have been linked to neuropsychiatric diseases, our study provides insights into how microglial dysfunction can impact forebrain connectivity and reveals roles for immune cells during normal assembly of brain circuits.

Rodent Zic Genes in Neural Network Wiring.

Science.gov (United States)

Herrera, Eloísa

2018-01-01

The formation of the nervous system is a multistep process that yields a mature brain. Failure in any of the steps of this process may cause brain malfunction. In the early stages of embryonic development, neural progenitors quickly proliferate and then, at a specific moment, differentiate into neurons or glia. Once they become postmitotic neurons, they migrate to their final destinations and begin to extend their axons to connect with other neurons, sometimes located in quite distant regions, to establish different neural circuits. During the last decade, it has become evident that Zic genes, in addition to playing important roles in early development (e.g., gastrulation and neural tube closure), are involved in different processes of late brain development, such as neuronal migration, axon guidance, and refinement of axon terminals. ZIC proteins are therefore essential for the proper wiring and connectivity of the brain. In this chapter, we review our current knowledge of the role of Zic genes in the late stages of neural circuit formation.

Feature-Learning-Based Printed Circuit Board Inspection via Speeded-Up Robust Features and Random Forest

Directory of Open Access Journals (Sweden)

Eun Hye Yuk

2018-06-01

Full Text Available With the coming of the 4th industrial revolution era, manufacturers produce high-tech products. As the production process is refined, inspection technologies become more important. Specifically, the inspection of a printed circuit board (PCB, which is an indispensable part of electronic products, is an essential step to improve the quality of the process and yield. Image processing techniques are utilized for inspection, but there are limitations because the backgrounds of images are different and the kinds of defects increase. In order to overcome these limitations, methods based on machine learning have been used recently. These methods can inspect without a normal image by learning fault patterns. Therefore, this paper proposes a method can detect various types of defects using machine learning. The proposed method first extracts features through speeded-up robust features (SURF, then learns the fault pattern and calculates probabilities. After that, we generate a weighted kernel density estimation (WKDE map weighted by the probabilities to consider the density of the features. Because the probability of the WKDE map can detect an area where the defects are concentrated, it improves the performance of the inspection. To verify the proposed method, we apply the method to PCB images and confirm the performance of the method.

Explosion symmetry improvement of polyimide-coated tungsten wire in vacuum on negative discharge facility

Science.gov (United States)

Li, Mo; Wu, Jian; Lu, Yihan; Li, Xingwen; Li, Yang; Qiu, Mengtong

2018-01-01

Tungsten wire explosion is very asymmetric when fast current rate and insulated coatings are both applied on negative discharge facility using a 24-mm-diameter cathode geometry, which is commonly used on mega-ampere facilities. It is inferred, based on an analytical treatment of the guiding center drift and COMSOL simulations, that the large negative radial electric field causes early voltage breakdown and terminates energy deposition into the wire core on the anode side of the wire. After the anode side is short circuited, the radial electric field along the wire surface on the cathode side will change its polarity and thus leading to additional energy deposition into the wire core. This change causes ˜10 times larger energy deposition and ˜14 times faster explosion velocity in the cathode side than the anode side. In order to reduce this asymmetry, a hollow cylindrical cathode geometry was used to reverse the polarity of radial electric field and was optimized to use on multi-MA facilities. In this case, fully vaporized polyimide-coated tungsten wire with great symmetry improvement was achieved with energy deposition of ˜8.8 eV/atom. The atomic and electronic density distributions for the two different load geometries were obtained by the double-wavelength measurement.

Performance of the electrical generator cell by the ferrous alloys of printed circuit board scrap and Iron Metal 1020

Science.gov (United States)

Sahan, Y.; Sudarsono, S.; Silviana, E.; Chairul; Wisrayetti

2018-04-01

Galvani cell is one of thealternative energy. This cell can be used as an electric resources. In this research, the generator cell was designed and builds to generate the electric. The generator cell consisted of the iron metal 1020 were used as anode, the ferrous alloys of printed circuit board scrapwas then used as chatode, and NaCl solution as an electrolyte. The aim of this research is to estimate the performance of this generator cell by using variation of NaCl concentration (i.e. 1%, 3%, 5%, 7%, and 9%) with the electrodes pair ( 1 and 8 pairs). The performance of the cell was measured with a multi tester equipment and a LED bulb (5-watt 3Volt). The Results shown that the generator cell can produce the electric power of 3.679 Volt maximally by using NaCl 9% and 8 electrode pairs applied for this condition.

Circuit card failures and industry mitigation strategy

Energy Technology Data Exchange (ETDEWEB)

Mondal, U. [Candu Owners Group, Toronto, Ontario (Canada)

2012-07-01

In recent years the nuclear industry has experienced an increase in circuit card failures due to ageing of components, inadequate Preventive Maintenance (PM), lack of effective circuit card health monitoring, etc. Circuit card failures have caused loss of critical equipment, e.g., electro hydraulic governors, Safety Systems, resulting in loss of function and in some cases loss of generation. INPO completed a root cause analysis of 40 Reactor Trips/Scrams in US reactors and has recommended several actions to mitigate Circuit Card failures. Obsolescence of discrete components has posed many challenges in conducting effective preventative maintenance on circuit cards. In many cases, repairs have resulted in installation of components that compromise performance of the circuit cards. Improper termination and worn edge connectors have caused intermittent contacts contributing to circuit card failures. Traditionally, little attention is paid to relay functions and preventative maintenance of relay. Relays contribute significantly to circuit card failures and have dominated loss of generation across the power industry. The INPO study recommended a number of actions to mitigate circuit card failures, such as; identification of critical components and single point vulnerabilities; strategic preventative maintenance; protection of circuit boards against electrostatic discharge; limiting power cycles; performing an effective burn-in prior to commissioning of the circuit cards; monitoring performance of DC power supplies; limiting cabinet temperatures; managing of component aging/degradation mechanism, etc. A subcommittee has been set up under INPO sponsorship to understand the causes of circuit card failure and to develop an effective mitigation strategy. (author)

Ontogeny and reversal of brain circuit abnormalities in a preclinical model of PCOS.

Science.gov (United States)

Silva, Mauro Sb; Prescott, Melanie; Campbell, Rebecca E

2018-04-05

Androgen excess is a hallmark of polycystic ovary syndrome (PCOS), a prevalent yet poorly understood endocrine disorder. Evidence from women and preclinical animal models suggests that elevated perinatal androgens can elicit PCOS onset in adulthood, implying androgen actions in both PCOS ontogeny and adult pathophysiology. Prenatally androgenized (PNA) mice exhibit a robust increase of progesterone-sensitive GABAergic inputs to gonadotropin-releasing hormone (GnRH) neurons implicated in the pathogenesis of PCOS. It is unclear when altered GABAergic wiring develops in the brain, and whether these central abnormalities are dependent upon adult androgen excess. Using GnRH-GFP-transgenic mice, we determined that increased GABA input to GnRH neurons occurs prior to androgen excess and the manifestation of reproductive impairments in PNA mice. These data suggest that brain circuit abnormalities precede the postpubertal development of PCOS traits. Despite the apparent developmental programming of circuit abnormalities, long-term blockade of androgen receptor signaling from early adulthood rescued normal GABAergic wiring onto GnRH neurons, improved ovarian morphology, and restored reproductive cycles in PNA mice. Therefore, androgen excess maintains changes in female brain wiring linked to PCOS features and the blockade of androgen receptor signaling reverses both the central and peripheral PNA-induced PCOS phenotype.

Optical interconnect technologies for high-bandwidth ICT systems

Science.gov (United States)

Chujo, Norio; Takai, Toshiaki; Mizushima, Akiko; Arimoto, Hideo; Matsuoka, Yasunobu; Yamashita, Hiroki; Matsushima, Naoki

2016-03-01

The bandwidth of information and communication technology (ICT) systems is increasing and is predicted to reach more than 10 Tb/s. However, an electrical interconnect cannot achieve such bandwidth because of its density limits. To solve this problem, we propose two types of high-density optical fiber wiring for backplanes and circuit boards such as interface boards and switch boards. One type uses routed ribbon fiber in a circuit board because it has the ability to be formed into complex shapes to avoid interfering with the LSI and electrical components on the board. The backplane is required to exhibit high density and flexibility, so the second type uses loose fiber. We developed a 9.6-Tb/s optical interconnect demonstration system using embedded optical modules, optical backplane, and optical connector in a network apparatus chassis. We achieved 25-Gb/s transmission between FPGAs via the optical backplane.

Tests of the wire ageing induced by radiation in the barrel muon chambers of the CMS experiment at LHC

International Nuclear Information System (INIS)

Conti, E.; Ballarini, R.; Gasparine, F.

1999-01-01

In CMS the barrel muon detectors are drift tubes (DT) filled with Ar/CO 2 gas. Materials of the DT in contact with the gas can outgas pollutant substances during irradiation which may cause a loss of gain or a worsening of the time resolution (wire ageing) during the multiplication process. This article presents the laboratory tests performed to verify that the materials used in DT do not induce wire ageing. The tests concern all the materials inside the DT which are in contact with the gas: 1) mylar tape with glue based on reticulated silicon polymers, 2) Al tape with mono-acrylic glue, 3) bare FR4 boards for HV, and 4) complete FR4 boards for HV (with cables, resistors, capacitors and glue). Both Al and mylar are known to be safe from the point of view of ageing, so the tests concern essentially the glues. For all the above materials, the result is negative, it means that no change of the wire gain has been measured within a few percents which is the sensitivity of the apparatus. (A.C.)

Low power consumption mini rotary actuator with SMA wires

Science.gov (United States)

Manfredi, Luigi; Huan, Yu; Cuschieri, Alfred

2017-11-01

Shape memory alloys (SMAs) are smart materials widely used as actuators for their high power to weight ratio despite their well-known low energy efficiency and limited mechanical bandwidth. For robotic applications, SMAs exhibit limitations due to high power consumption and limited stroke, varying from 4% to 7% of the total length. Hysteresis, during the contraction and extension cycle, requires a complex control algorithm. On the positive side, the small size and low weight are eminently suited for the design of mini actuators for robotic platforms. This paper describes the design and construction of a light weight and low power consuming mini rotary actuator with on-board contact-less position and force sensors. The design is specifically intended to reduce (i) energy consumption, (ii) dimensions of the sensory system, and (iii) provide a simple control without any need for SMA characterisation. The torque produced is controlled by on-board force sensors. Experiments were performed to investigate the energy consumption and performance (step and sinusoidal angle profiles with a frequency varying from 0.5 to 10 Hz and maximal amplitude of {15}\\circ ). We describe a transient capacitor effect related to the SMA wires during the sinusoidal profile when the active SMA wire is powered and the antagonist one switched-off, resulting in a transient current time varying from 300 to 400 ms.

Capacitive Coupling in Double-Circuit Transmission Lines

Directory of Open Access Journals (Sweden)

Zdenka Benesova

2004-01-01

Full Text Available The paper describes an algorithm for calculation of capacitances and charges on conductors in systems with earth wires and in double-circuit overhead lines with respect to phase arrangement. A balanced voltage system is considered. A suitable transposition of individual conductors enables to reduce the electric and magnetic fields in vicinity of overhead lines and to limit the inductive and capacitive linkage. The procedure is illustrated on examples the results of which lead to particular recommendations for designers.

Circuit bridging of digital equipment caused by smoke from a cable fire

International Nuclear Information System (INIS)

Tanaka, T.J.; Anderson, D.J.

1997-01-01

Advanced reactor systems are likely to use protection systems with digital electronics that ideally should be resistant to environmental hazards, including smoke from possible cable fires. Previous smoke tests have shown that digital safety systems can fail even at relatively low levels of smoke density and that short-term failures are likely to be caused by circuit bridging. Experiments were performed to examine these failures, with a focus on component packaging and protection schemes. Circuit bridging, which causes increased leakage currents and arcs, was gauged by measuring leakage currents among the leads of component packages. The resistance among circuit leads typically varies over a wide range, depending on the nature of the circuitry between the pins, bias conditions, circuit board material, etc. Resistance between leads can be as low as 20 kΩ and still be good, depending on the component. For these tests, the authors chose a printed circuit board and components that normally have an interlead resistance above 10 12 Ω, but if the circuit is exposed to smoke, circuit bridging causes the resistance to fall below 10 3 Ω. Plated-through-hole (PTH) and surface-mounted (SMT) packages were exposed to a series of different smoke environments using a mixture of environmentally qualified cables for fuel. Conformal coatings and enclosures were tested as circuit protection methods. High fuel levels, high humidity, and high flaming burns were the conditions most likely to cause circuit bridging. The inexpensive conformal coating that was tested - an acrylic spray - reduced leakage currents, but enclosure in a chassis with a fan did not. PTH packages were more resistant to smoke-induced circuit bridging than SMT packages. Active components failed most often in tests where the leakage currents were high, but failure did not always accompany high leakage currents

Problems on the Theory of Heat Resistance of Alloys

Science.gov (United States)

1960-07-26

panels and wiring diagrams of both the board panel and the relay unit. 1. Furnace heating circuit The furnace may be connected into a 120- or a 220-v a-c...on the same board, there are, in addition, all the signal lamps and emergency relays. A ’.iw of one of the panels of the control board is shown in...the d1fo-Pratton rate, the stress, and the temperature for the ease of deformation. by slip. 2cperlmentaly, for monocrystalline specimens, i.e., Tih

Thermosonic wire bonding of IC devices using palladium wire

International Nuclear Information System (INIS)

Shze, J.H.; Poh, M.T.; Tan, R.M.

1996-01-01

The feasibility of replacing gold wire by palladium wire in thermosonic wire bonding of CMOS and bipolar devices are studied in terms of the manufacturability, physical, electrical and assembly performance. The results that palladium wire is a viable option for bonding the bipolar devices but not the CMOS devices

Pulsed wire discharge apparatus for mass production of copper nanopowders.

Science.gov (United States)

Suematsu, H; Nishimura, S; Murai, K; Hayashi, Y; Suzuki, T; Nakayama, T; Jiang, W; Yamazaki, A; Seki, K; Niihara, K

2007-05-01

A pulsed wire discharge (PWD) apparatus for the mass production of nanopowders has been developed. The apparatus has a continuous wire feeder, which is operated in synchronization with a discharging circuit. The apparatus is designed for operation at a maximum repetition rate of 1.4 Hz at a stored energy of 160 J. In the present study, Cu nanopowder was synthesized using the PWD apparatus and the performance of the apparatus was examined. Cu nanopowder of 2.0 g quantity was prepared in N(2) gas at 100 kPa for 90 s. The particle size distribution of the Cu nanopowder was analyzed by transmission electron microscopy and the mean surface diameter was determined to be 65 nm. The ratio of the production mass of the powder to input energy was 362 g/kW h.

Correction of dynamic multipoles for APPLE-II undulator with flat wires

International Nuclear Information System (INIS)

Kikuchi, Y.; Hosaka, M.; Takashima, Y.; Yamamoto, N.; Adachi, M.; Zen, H.; Katoh, M.

2010-01-01

APPLE-II undulator can produce quasi-monochromatic light of different polarization though it is a relatively simple magnetic circuit. Therefore, it has been installed in many synchrotron radiation facilities and will be installed in Central Japan Synchrotron Radiation Research Facility under construction in Aichi prefecture. APPLE-II undulator also has been installed in UVSOR facility. When the undulator is operated in vertical polarization mode with narrower gap of 40 mm, the lifetime of electron beam through the storage ring significantly decreases.The reason is considered as dynamic multipole kicks in the undulator, which strongly depends on the undulator gap. Multi-wires, which are installed in the upper surface and the under surface of undulator beam duct, are candidate to compensate the multipole effects, because the multi-wires can generate arbitrary magnetic fields. This paper reports the result of numerical investigation on multipoles in the undulator by a three-dimensional magnetostatics computer code RADIA, the orbital calculation based on the numerical analysis and the preliminary experiment with flat wires. (author)

Broadband spectroscopy of magnetic response in a nano-scale magnetic wire

International Nuclear Information System (INIS)

Yamaguchi, A.; Motoi, K.; Miyajima, H.; Utsumi, Y.

2014-01-01

We measure the broadband spectra of magnetic response in a single layered ferromagnetic nano-scale wire in order to investigate the size effect on the ferromagnetic resonance. We found that the resonance frequency difference between 300-nm- and 5-μm-wide wires was varied by about 5 GHz due to the shape anisotropy. Furthermore, we experimentally detected the magnetization precession induced by the thermal fluctuation via the rectification of a radio-frequency (rf) current by incorporating an additional direct current (dc) by using Wheatstone bridge circuit. Our investigation renders that the shape anisotropy is of great importance to control the resonance frequency and to provide thermal stability of the microwave devices. - Highlights: • We describe an experimental investigation of the magnetic response of a single layered ferromagnetic nano-scale wire. • We present the conventional broadband microwave spectroscopy with a vector network analyzer and rectifying spectroscopy obtained with a Wheatstone bridge technique. • The investigation enables us to characterize the size effect on the ferromagnetic response and also to detect the magnetization precession induced by the thermal fluctuations

Liquid oil and residual characteristics of printed circuit board recycle by pyrolysis

Energy Technology Data Exchange (ETDEWEB)

Lin, Kuo-Hsiung [Department of Environmental Engineering and Science, Fooyin University, Kaohsiung, Taiwan (China); Chiang, Hung-Lung, E-mail: hlchiang@mail.cmu.edu.tw [Department of Health Risk Management, China Medical University, Taichung, Taiwan (China)

2014-04-01

Highlights: • Pyrolysis is a technology for recycling of the non-metal fraction of PCBs. • Liquid product constituents were analyzed for PCB pyrolysis. • Water-soluble ionic species were determined for PCB pyrolysis exhaust. - Abstract: Non-metal fractions of waste printed circuit boards (PCBs) were thermally treated (200–500 °C) under nitrogen atmosphere. Carbon, hydrogen, and nitrogen were determined by elemental analyzer, bromine by instrumental neutron activation analysis (INAA), phosphorus by energy dispersive X-ray spectrometer (EDX), and 29 trace elements by inductively coupled plasma atomic emission spectrometer (ICP-AES) and mass spectrometry (ICP-MS) for raw material and pyrolysis residues. Organic compositions of liquid oil were identified by GC (gas chromatography)–MS, trace element composition by ICP system, and 12 water-soluble ions by IC (ionic chromatography). Elemental content of carbon was >450 mg/g, oxygen 300 mg/g, bromine and hydrogen 60 mg/g, nitrogen 30 mg/g, and phosphorus 28 mg/g. Sulfur was trace in PCBs. Copper content was 25–28 mg/g, iron 1.3–1.7 mg/g, tin 0.8–1.0 mg/g and magnesium 0.4–1.0 mg/g; those were the main metals in the raw materials and pyrolytic residues. In the liquid products, carbon content was 68–73%, hydrogen was 10–14%, nitrogen was 4–5%, and sulfur was less than 0.05% at pyrolysis temperatures from 300 to 500 °C. Phenol, 3-bromophenol, 2-methylphenol and 4-propan-2-ylphenol were major species in liquid products, accounting for >50% of analyzed organic species. Bromides, ammonium and phosphate were the main species in water sorption samples for PCB pyrolysis exhaust.

Students conception and perception of simple electrical circuit

Science.gov (United States)

Setyani, ND; Suparmi; Sarwanto; Handhika, J.

2017-11-01

This research aims to describe the profile of the students’ conception and perception on the simple electrical circuit. The results of this research suppose to be used as a reference by teachers to use learning models or strategies to improve understanding the physics concept. The research method used is descriptive qualitative. Research subjects are the students of physics education program, Universitas Sebelas Maret, Surakarta, Indonesia (49 students). The results showed that students have alternative conceptions. Their conceptions are (1) a high-voltage wire has an electric current and can cause electric shock, (2) the potential difference and the value of resistance used in a circuit is influenced by electric current, (3) the value of resistance of a lamp is proportional to the filament thickness, (4) the amount of electric current that coming out from the positive pole battery is the same for all type of circuit, in series or parallel (battery is constant current sources), (5) the current at any resistor in the series circuit is influenced by the resistor used, (6) the resistor consume the current through it. This incorrect conception can cause misconceptions.

Vibration of signal wires in wire detectors under irradiation

International Nuclear Information System (INIS)

Bojko, I.R.; Shelkov, G.A.; Dodonov, V.I.; Ignatenko, M.A.; Nikolenko, M.Yu.

1995-01-01

Radiation-induced vibration of signal wires in wire detectors is found and explained. The phenomenon is based on repulsion of a signal wire with a positive potential and a cloud of positive ions that remains after neutralization of the electron part of the avalanche formed in the course of gas amplification. Vibration with a noticeable amplitude may arise from fluctuations of repulsive forces, which act on the wire and whose sources are numerous ion clusters. A formula is obtained which allows wire oscillations to be estimated for all types of wire detectors. Calculation shows that oscillations of signal wires can be substantial for the coordinate accuracy of a detector working in the limited streamer mode at fluxes over 10 5 particles per second per wire. In the proportional mode an average oscillation amplitude can be as large as 20-30 μm at some detector parameters and external radiation fluxes over 10 5 . The experimental investigations show that the proposed model well describes the main features of the phenomenon. 6 refs., 8 figs

Modernization of the memory board of an x-ray spectrometer

International Nuclear Information System (INIS)

Dutra Neto, A.; Dias, A.G.; Marra, J.G.

1992-01-01

This paper presents the design of a constant memory board for the Rigaku X-ray fluorescence spectroscopy, model 3064. This spectroscopy has been used to mineral analysis and materials characterization. It has been applied for elements instrumental analysis in mineral, metallic, ceramic, environmental samples and alloys. The memory board stores the elements sequence to be analyzed in the samples. It allows the automatic continuous operation of the spectroscopy and can be used as temporary register by the system. The spectroscopy data memory was composed by two permanent memory board with magnetic cores. The new memory board has a solid state static RAM, a data bus buffer, control and a special circuit to supply continuous power to the memory. (author)

Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

Energy Technology Data Exchange (ETDEWEB)

Fogarasi, Szabolcs [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Imre-Lucaci, Florica [“Babeş-Bolyai” University, Interdisciplinary Research Institute on Bio-Nano-Sciences, 42 Treboniu Laurian Street, Cluj-Napoca RO-400271 (Romania); Imre-Lucaci, Árpád, E-mail: aimre@chem.ubbcluj.ro [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Ilea, Petru [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania)

2014-05-01

Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples.

Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

International Nuclear Information System (INIS)

Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Árpád; Ilea, Petru

2014-01-01

Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples

Primary experimental results of wire-array Z-pinches on PTS

Energy Technology Data Exchange (ETDEWEB)

Huang, X. B., E-mail: caephxb2003@aliyun.com; Zhou, S. T., E-mail: caephxb2003@aliyun.com; Ren, X. D., E-mail: caephxb2003@aliyun.com; Dan, J. K., E-mail: caephxb2003@aliyun.com; Wang, K. L., E-mail: caephxb2003@aliyun.com; Zhang, S. Q., E-mail: caephxb2003@aliyun.com; Li, J., E-mail: caephxb2003@aliyun.com; Xu, Q., E-mail: caephxb2003@aliyun.com; Cai, H. C., E-mail: caephxb2003@aliyun.com; Duan, S. C., E-mail: caephxb2003@aliyun.com; Ouyang, K., E-mail: caephxb2003@aliyun.com; Chen, G. H., E-mail: caephxb2003@aliyun.com; Ji, C., E-mail: caephxb2003@aliyun.com; Wang, M., E-mail: caephxb2003@aliyun.com; Feng, S. P., E-mail: caephxb2003@aliyun.com; Yang, L. B., E-mail: caephxb2003@aliyun.com; Xie, W. P., E-mail: caephxb2003@aliyun.com; Deng, J. J., E-mail: caephxb2003@aliyun.com [Key Lab of Pulsed Power, Institute of Fluid Physics, CAEP, P.O. Box 919-108, Mianyang, Sichuan 621999 (China)

2014-12-15

The Primary Test Stand (PTS) developed at the China Academy of Engineering Physics is a multiterawatt pulsed power driver, which can deliver a ∼10 MA, 70 ns rise-time (10%-90%) current to a short circuit load and has important applications in Z-pinch driven inertial confinement fusion and high energy density physics. In this paper, primary results of tungsten wire-array Z-pinch experiments on PTS are presented. The load geometries investigated include 15-mm-tall cylindrical single and nested arrays with diameter ranging from 14.4-26.4 mm, and consisting of 132∼276 tungsten wires with 5∼10 μm in diameter. Multiple diagnostics were fielded to determine the characteristics of x-ray radiations and to obtain self-emitting images of imploding plasmas. X-ray power up to 80 TW with ∼3 ns FWMH is achieved by using nested wire arrays. The total x-ray energy exceeds 500 kJ and the peak radiation temperature is about 150 eV. Typical velocity of imploding plasmas goes around 3∼5×10{sup 7} cm/s and the radial convergence ratio is between 10 and 20.

Switchable DNA wire: deposition-stripping of copper nanoclusters as an "ON-OFF" nanoswitch.

Science.gov (United States)

Zhu, Xiaoli; Liu, Siyu; Cao, Jiepei; Mao, Xiaoxia; Li, Genxi

2016-01-19

Today, a consensus that DNA working as a molecular wire shows promise in nanoscale electronics is reached. Considering that the "ON-OFF" switch is the basis of a logic circuit, the switch of DNA-mediated charge transport (DNA CT) should be conquered. Here, on the basis of chemical or electrochemical deposition and stripping of DNA-templated copper nanoclusters (CuNCs), we develop an "ON-OFF" nanoswitch for DNA CT. While CuNCs are deposited, the DNA CT is blocked, which can be also recovered after stripping the CuNCs. A switch cycle can be completed in a few seconds and can be repeated for many times. Moreover, by regulating the amount of reagents, deposition/stripping time, applied potential, etc., the switch is adjustable to make the wire at either an "ON-OFF" state or an intermediate state. We believe that this concept and the successful implementation will promote the practical application of DNA wire one step further.

Wire Chamber

CERN Multimedia

Magnetoscriptive readout wire chamber. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

Wire chamber

CERN Multimedia

1967-01-01

Magnetoscriptive readout wire chamber.Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

A method for building low loss multi-layer wiring for superconducting microwave devices

Science.gov (United States)

Dunsworth, A.; Barends, R.; Chen, Yu; Chen, Zijun; Chiaro, B.; Fowler, A.; Foxen, B.; Jeffrey, E.; Kelly, J.; Klimov, P. V.; Lucero, E.; Mutus, J. Y.; Neeley, M.; Neill, C.; Quintana, C.; Roushan, P.; Sank, D.; Vainsencher, A.; Wenner, J.; White, T. C.; Neven, H.; Martinis, John M.; Megrant, A.

2018-02-01

Complex integrated circuits require multiple wiring layers. In complementary metal-oxide-semiconductor processing, these layers are robustly separated by amorphous dielectrics. These dielectrics would dominate energy loss in superconducting integrated circuits. Here, we describe a procedure that capitalizes on the structural benefits of inter-layer dielectrics during fabrication and mitigates the added loss. We use a deposited inter-layer dielectric throughout fabrication and then etch it away post-fabrication. This technique is compatible with foundry level processing and can be generalized to make many different forms of low-loss wiring. We use this technique to create freestanding aluminum vacuum gap crossovers (airbridges). We characterize the added capacitive loss of these airbridges by connecting ground planes over microwave frequency λ/4 coplanar waveguide resonators and measuring resonator loss. We measure a low power resonator loss of ˜3.9 × 10-8 per bridge, which is 100 times lower than that of dielectric supported bridges. We further characterize these airbridges as crossovers, control line jumpers, and as part of a coupling network in gmon and fluxmon qubits. We measure qubit characteristic lifetimes (T1s) in excess of 30 μs in gmon devices.

Demonstration of glass-based photonic interposer for mid-board-optical engines and electrical-optical circuit board (EOCB) integration strategy

Science.gov (United States)

Schröder, H.; Neitz, M.; Schneider-Ramelow, M.

2018-02-01

Due to its optical transparency and superior dielectric properties glass is regarded as a promising candidate for advanced applications as active photonic interposer for mid-board-optics and optical PCB waveguide integration. The concepts for multi-mode and single-mode photonic system integration are discussed and related demonstration project results will be presented. A hybrid integrated photonic glass body interposer with integrated optical lenses for multi-mode data communication wavelength of 850 nm have been realized. The paper summarizes process developments which allow cost efficient metallization of TGV. Electro-optical elements like photodiodes and VCSELs can be directly flip-chip mounted on the glass substrate according to the desired lens positions. Furthermore results for a silicon photonic based single-mode active interposer integration onto a single mode glass made EOCB will be compared in terms of packaging challenges. The board level integration strategy for both of these technological approaches and general next generation board level integration concepts for photonic interposer will be introductorily discussed.

Comparative study on copper leaching from waste printed circuit boards by typical ionic liquid acids.

Science.gov (United States)

Chen, Mengjun; Huang, Jinxiu; Ogunseitan, Oladele A; Zhu, Nengming; Wang, Yan-min

2015-07-01

Waste printed circuit boards (WPCBs) are attracting increasing concerns because the recovery of its content of valuable metallic resources is hampered by the presence of hazardous substances. In this study, we used ionic liquids (IL) to leach copper from WPCBs. [BSO3HPy]OTf, [BSO3HMIm]OTf, [BSO4HPy]HSO4, [BSO4HMim]HSO4 and [MIm]HSO4 were selected. Factors that affect copper leaching rate were investigated in detail and their leaching kinetics were also examined with the comparison of [Bmim]HSO4. The results showed that all six IL acids could successfully leach copper out, with near 100% recovery. WPCB particle size and leaching time had similar influences on copper leaching performance, while IL acid concentration, hydrogen peroxide addition, solid to liquid ratio, temperature, showed different influences. Moreover, IL acid with HSO4(-) was more efficient than IL acid with CF3SO3(-). These six IL acids indicate a similar behavior with common inorganic acids, except temperature since copper leaching rate of some IL acids decreases with its increase. The results of leaching kinetics studies showed that diffusion plays a more important role than surface reaction, whereas copper leaching by inorganic acids is usually controlled by surface reaction. This innovation provides a new option for recovering valuable materials such as copper from WPCBs. Copyright © 2015 Elsevier Ltd. All rights reserved.

Study of gluing and wire bonding for the Belle II Silicon Vertex Detector

International Nuclear Information System (INIS)

Kang, K.H.; Hara, K.; Higuchi, T.; Hyun, H.J.; Jeon, H.B.; Joo, C.W.; Kah, D.H.; Kim, H.J.; Mibe, T.; Onuki, Y.; Park, H.; Rao, K.K.; Sato, N.; Shimizu, N.; Tanida, K.; Tsuboyama, T.; Uozumi, S.

2014-01-01

This paper describes an investigation into gluing and wire bonding for assembling the Silicon Vertex Detector (SVD) for the Belle II experiment at KEK in Japan. Optimizing the gluing of the silicon microstrip sensors, the support frame, and the readout flex cables is important for achieving the required mechanical precision. The wire bonding between the sensors and the readout electronic chips also needs special care to maximize the physics capability of the SVD. The silicon sensors and signal fan out flex circuits (pitch adapters) are glued and connected using wire bonding. We determine that gluing quality is important for achieving good bonding efficiency. The standard deviation in the glue thickness for the best result is measured to be 3.11 μm. Optimal machine parameters for wire bonding are determined to be 70 mW power, 20 gf force, and 20 ms for the pitch adapter and 60 mW power, 20 gf force, and 20 ms for the silicon strip sensors; these parameters provide a pull force of (10.92±0.72) gf. With these settings, 75% of the pitch adapters and 25% of the strip sensors experience the neck-broken type of break

Adder design using a 5-input majority gate in a novel “multilayer gate design paradigm” for quantum dot cellular automata circuits

International Nuclear Information System (INIS)

Kumar, Rohit; Ghosh, Bahniman; Gupta, Shoubhik

2015-01-01

This paper proposes a novel design paradigm for circuits designed in quantum dot cellular automata (QCA) technology. Previously reported QCA circuits in the literature have generally been designed in a single layer which is the main logical block in which the inverter and majority gate are on the base layer, except for the parts where multilayer wire crossing was used. In this paper the concept of multilayer wire crossing has been extended to design logic gates in multilayers. Using a 5-input majority gate in a multilayer, a 1-bit and 2-bit adder have been designed in the proposed multilayer gate design paradigm. A comparison has been made with some adders reported previously in the literature and it has been shown that circuits designed in the proposed design paradigm are much more efficient in terms of area, the requirement of QCA cells in the design and the input–output delay of the circuit. Over all, the availability of one additional spatial dimension makes the design process much more flexible and there is scope for the customizability of logic gate designs to make the circuit compact. (paper)

An Investigation on the Extraction and Quantitation of a Hexavalent Chromium in Acrylonitrile Butadiene Styrene Copolymer (ABS) and Printed Circuit Board (PCB) by Ion Chromatography Coupled with Inductively Coupled Plasma Atomic Emission Spectrometry

Energy Technology Data Exchange (ETDEWEB)

Nam, Sang Ho; Kim, Yu Na [Mokpo National University, Muan (Korea, Republic of)

2012-06-15

A hexavalent chromium (Cr (VI)) is one of the hazardous substances regulated by the RoHS. The determination of Cr (VI) in various polymers and printed circuit board (PCB) has been very important. In this study, the three different analytical methods were investigated for the determination of a hexavalent chromium in Acrylonitrile Butadiene Styrene copolymer (ABS) and PCB. The results by three analytical methods were obtained and compared. An analytical method by UV-Visible spectrometer has been generally used for the determination of Cr (VI) in a sample, but a hexavalent chromium should complex with diphenylcarbazide for the detection in the method. The complexation did make an adverse effect on the quantitative analysis of Cr (VI) in ABS. The analytical method using diphenylcarbazide was also not applicable to printed circuit board (PCB) because PCB contained lots of irons. The irons interfered with the analysis of hexavalent chromium because those also could complex with diphenylcarbazide. In this study, hexavalent chromiums in PCB have been separated by ion chromatography (IC), then directly and selectively detected by inductively coupled plasma atomic emission spectrometry (ICP-AES). The quantity of Cr (VI) in PCB was 0.1 mg/kg

Wafer-scale high-throughput ordered arrays of Si and coaxial Si/Si(1-x)Ge(x) wires: fabrication, characterization, and photovoltaic application.

Science.gov (United States)

Pan, Caofeng; Luo, Zhixiang; Xu, Chen; Luo, Jun; Liang, Renrong; Zhu, Guang; Wu, Wenzhuo; Guo, Wenxi; Yan, Xingxu; Xu, Jun; Wang, Zhong Lin; Zhu, Jing

2011-08-23

We have developed a method combining lithography and catalytic etching to fabricate large-area (uniform coverage over an entire 5-in. wafer) arrays of vertically aligned single-crystal Si nanowires with high throughput. Coaxial n-Si/p-SiGe wire arrays are also fabricated by further coating single-crystal epitaxial SiGe layers on the Si wires using ultrahigh vacuum chemical vapor deposition (UHVCVD). This method allows precise control over the diameter, length, density, spacing, orientation, shape, pattern and location of the Si and Si/SiGe nanowire arrays, making it possible to fabricate an array of devices based on rationally designed nanowire arrays. A proposed fabrication mechanism of the etching process is presented. Inspired by the excellent antireflection properties of the Si/SiGe wire arrays, we built solar cells based on the arrays of these wires containing radial junctions, an example of which exhibits an open circuit voltage (V(oc)) of 650 mV, a short-circuit current density (J(sc)) of 8.38 mA/cm(2), a fill factor of 0.60, and an energy conversion efficiency (η) of 3.26%. Such a p-n radial structure will have a great potential application for cost-efficient photovoltaic (PV) solar energy conversion. © 2011 American Chemical Society

Efficient physical embedding of topologically complex information processing networks in brains and computer circuits.

Directory of Open Access Journals (Sweden)

Danielle S Bassett

2010-04-01

Full Text Available Nervous systems are information processing networks that evolved by natural selection, whereas very large scale integrated (VLSI computer circuits have evolved by commercially driven technology development. Here we follow historic intuition that all physical information processing systems will share key organizational properties, such as modularity, that generally confer adaptivity of function. It has long been observed that modular VLSI circuits demonstrate an isometric scaling relationship between the number of processing elements and the number of connections, known as Rent's rule, which is related to the dimensionality of the circuit's interconnect topology and its logical capacity. We show that human brain structural networks, and the nervous system of the nematode C. elegans, also obey Rent's rule, and exhibit some degree of hierarchical modularity. We further show that the estimated Rent exponent of human brain networks, derived from MRI data, can explain the allometric scaling relations between gray and white matter volumes across a wide range of mammalian species, again suggesting that these principles of nervous system design are highly conserved. For each of these fractal modular networks, the dimensionality of the interconnect topology was greater than the 2 or 3 Euclidean dimensions of the space in which it was embedded. This relatively high complexity entailed extra cost in physical wiring: although all networks were economically or cost-efficiently wired they did not strictly minimize wiring costs. Artificial and biological information processing systems both may evolve to optimize a trade-off between physical cost and topological complexity, resulting in the emergence of homologous principles of economical, fractal and modular design across many different kinds of nervous and computational networks.

A deadtime reduction circuit for thermal neutron coincidence counters with Amptek preamplifiers

International Nuclear Information System (INIS)

Bourret, S.C.; Krick, M.S.

1994-01-01

We have developed a deadtime reduction circuit for thermal neutron coincidence counters using Amptek preamplifier/amplifier/discriminator circuits. The principle is to remove the overlap between the output pulses from the Amptek circuits by adding a derandomizer between the Amptek circuits and the shift-register coincidence electronics. We implemented the derandomizer as an Actel programmable logic array; the derandomizer board is small and can be mounted in the high-voltage junction box with the Amptek circuits, if desired. Up to 32 Amptek circuits can be used with one derandomizer. The derandomizer has seven outputs: four groups of eight inputs, two groups of 16 inputs, and one group of 32 inputs. We selected these groupings to facilitate detector ring-ratio measurements. The circuit was tested with the five-ring research multiplicity counter, which has five output signals-one for each ring. The counter's deadtime was reduced from 70 to 30 ns

The Versatile Link Demo Board (VLDB)

International Nuclear Information System (INIS)

Lesma, R. Martín; Alessio, F.; Barbosa, J.; Baron, S.; Caplan, C.; Leitao, P.; Porret, D.; Wyllie, K.; Pecoraro, C.

2017-01-01

The Versatile Link Demonstrator Board (VLDB) is the evaluation kit for the radiation-hard Optical Link ecosystem, which provides a 4.8 Gbps data transfer link for communication between front-end (FE) and back-end (BE) of the High Energy Physics experiments. It gathers the Versatile link main radiation-hard custom Application-Specific Integrated Circuits (ASICs) and modules: GBTx, GBT-SCA and VTRx/VTTx plus the FeastMP, a radiation-hard in-house designed DC-DC converter. This board is the first design allowing system-level tests of the Link with a complete interconnection of the constitutive components, allowing data acquisition, control and monitoring of FE devices with the GBT-SCA pair.

Energy-efficient strain gauges for the wireless condition monitoring systems in mechanical engineering

Energy Technology Data Exchange (ETDEWEB)

Berndt, Michael; Fellner, Thomas; Zeiser, Roderich; Wilde, Juergen [Freiburg Univ. (Germany). Dept. for Microsystems Engineering (IMTEK)

2012-07-01

This work focuses on the development of novel strain gauges, which are suited for the operation in autonomous wireless condition monitoring systems. For this purpose, capacitive as well as highly resistive strain gauges were designed and fabricated. The C- and R-sensors were utilised in combination with demonstration circuits, which integrate the circuits for instrumentation, A/D-conversion and furthermore comprise a microcontroller with a wireless transceiver system, all on a small separate printed wiring board. (orig.)

Evaluation of a recycling process for printed circuit board by physical separation and heat treatment

International Nuclear Information System (INIS)

Fujita, Toyohisa; Ono, Hiroyuki; Dodbiba, Gjergj; Yamaguchi, Kunihiko

2014-01-01

Highlights: • The parts mounted on printed circuit board (PCB) were liberated by underwater explosion and mechanical crushing. • The crushed PCB without surface-mounted parts was carbonized under inert atmosphere at 873 K to recover copper. • The multi-layered ceramic capacitors including nickel was carbonized at 873 K to recover nickel by the magnetic separation. • The tantalum powders were recovered from the molded resins by heat treatment at 723 and 823 K in air atmosphere and screening. • Energy and treatment cost of new process increased, however, the environmental burden decreased comparing conventional one. - Abstract: Printed circuit boards (PCBs) from discarded personal computer (PC) and hard disk drive were crushed by explosion in water or mechanical comminution in order to disintegrate the attached parts. More parts were stripped from PCB of PC, composed of epoxy resin; than from PCB of household appliance, composed of phenol resin. In an attempt to raise the copper grade of PCB by removing other components, a carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under a nitrogen atmosphere at 873–1073 K. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The copper foil was liberated easily from glass fiber by stamping treatment. As one of the mounted parts, the multi-layered ceramic capacitors (MLCCs), which contain nickel, were carbonized at 873 K. The magnetic separation is carried out at a lower magnetic field strength of 0.1 T and then at 0.8 T. In the +0.5 mm size fraction the nickel grade in magnetic product was increased from 0.16% to 6.7% and the nickel recovery is 74%. The other useful mounted parts are tantalum capacitors. The tantalum capacitors were collected from mounted parts. The tantalum-sintered bodies were separated from molded resins

Activity-regulated genes as mediators of neural circuit plasticity.

Science.gov (United States)

Leslie, Jennifer H; Nedivi, Elly

2011-08-01

Modifications of neuronal circuits allow the brain to adapt and change with experience. This plasticity manifests during development and throughout life, and can be remarkably long lasting. Evidence has linked activity-regulated gene expression to the long-term structural and electrophysiological adaptations that take place during developmental critical periods, learning and memory, and alterations to sensory map representations in the adult. In all these cases, the cellular response to neuronal activity integrates multiple tightly coordinated mechanisms to precisely orchestrate long-lasting, functional and structural changes in brain circuits. Experience-dependent plasticity is triggered when neuronal excitation activates cellular signaling pathways from the synapse to the nucleus that initiate new programs of gene expression. The protein products of activity-regulated genes then work via a diverse array of cellular mechanisms to modify neuronal functional properties. Synaptic strengthening or weakening can reweight existing circuit connections, while structural changes including synapse addition and elimination create new connections. Posttranscriptional regulatory mechanisms, often also dependent on activity, further modulate activity-regulated gene transcript and protein function. Thus, activity-regulated genes implement varied forms of structural and functional plasticity to fine-tune brain circuit wiring. Copyright © 2011 Elsevier Ltd. All rights reserved.

Switchable DNA wire: deposition-stripping of copper nanoclusters as an “ON-OFF” nanoswitch

Science.gov (United States)

Zhu, Xiaoli; Liu, Siyu; Cao, Jiepei; Mao, Xiaoxia; Li, Genxi

2016-01-01

Today, a consensus that DNA working as a molecular wire shows promise in nanoscale electronics is reached. Considering that the “ON-OFF” switch is the basis of a logic circuit, the switch of DNA-mediated charge transport (DNA CT) should be conquered. Here, on the basis of chemical or electrochemical deposition and stripping of DNA-templated copper nanoclusters (CuNCs), we develop an “ON-OFF” nanoswitch for DNA CT. While CuNCs are deposited, the DNA CT is blocked, which can be also recovered after stripping the CuNCs. A switch cycle can be completed in a few seconds and can be repeated for many times. Moreover, by regulating the amount of reagents, deposition/stripping time, applied potential, etc., the switch is adjustable to make the wire at either an “ON-OFF” state or an intermediate state. We believe that this concept and the successful implementation will promote the practical application of DNA wire one step further. PMID:26781761

A physical method to incorporate parasitic elements in a circuit simulator based on the partial inductance concept

NARCIS (Netherlands)

Evenblij, B.H.; Ferreira, J.A.

2001-01-01

In switching Power Electronics circuits inductive parasitics of wiring and components contribute substantially to the current and voltage waveforms. This article addresses the theoretical basis as well as the implementation and validation of the incorporation of these inductances in a computerised

Measuring the layer-average volumetric water content in the uppermost 5 cm of soil using printed circuit board TDR probes

International Nuclear Information System (INIS)

Wang, W.; Kobayashi, T.; Chikushi, J.

2000-01-01

Newly designed printed circuit board TDR probes (PCBPs) were made, and they were calibrated by indoor experiment. A regression equation for estimating the volumetric water content from the dielectric constant measured with the PCBP was determined, which is almost the same as the well-known Topp's equation when the soil is rather wet while the difference becomes larger as the soil dries. The PCBP was designed to measure the average water content over a soil layer 5 cm thick because the thickness of soil layer involved in measuring water content by microwave remote sensing is several centimeters. A comparison experiment of measurements with PCBPs and those by microwave remote sensing was conducted in an arid area in the northwest of China. The results of this experiment show that the newly designed TDR probe is promising as the sensor to get ground truth of the surface wetness. This paper describes only the calibration of probes and the observations taken using them

Laser-heating wire bonding on MEMS packaging

Directory of Open Access Journals (Sweden)

Yuetao Liu

2014-02-01

Full Text Available Making connections is critical in fabrication of MEMS (Micro-Electro-Mechanical Systems. It is also complicated, because the temperature during joining affects both the bond produced and the structure and mechanical properties of the moving parts of the device. Specifications for MEMS packaging require that the temperature not exceed 240 °C. However, usually, temperatures can reach up to 300 °C during conventional thermosonic wire bonding. Such a temperature will change the distribution of dopants in CMOS (Complementary Metal Oxide Semiconductor circuits. In this paper we propose a new heating process. A semiconductor laser (wavelength 808 nm is suggested as the thermal source for wire bonding. The thermal field of this setup was analyzed, and specific mathematical models of the field were built. Experimental results show that the heating can be focused on the bonding pad, and that much lower heat conduction occurs, compared with that during the normal heating method. The bond strength increases with increasing laser power. The bond strengths obtained with laser heating are slightly lower than those obtained with the normal heating method, but can still meet the strength requirements for MEMS.

Use of a multilayer printed circuit board as the position sensing electrode in an MWPC

International Nuclear Information System (INIS)

Barbosa, A.F.

1995-01-01

An X-ray gas position sensitive detector (PSD) is described. The detector makes use of a single electrode, the X and Y cathode, to sense the electric charge induced by the avalanches generated after the absorption of X-ray photons in a multiwire proportional counter (MWPC). Two-dimensional (2D) localization of photons is achieved by associating one delay line to each coordinate. The delay lines are directly coupled to the X and Y cathode, so that the propagation time of electric pulses can be related to the corresponding avalanche position. Since the position encoding does not involve wires, the anode is the only wire electrode present in the detector, used for collecting the avalanche electrons. (orig.)

A study on the development of an automatic fault diagnosis system for testing NPP digital electronic circuits

International Nuclear Information System (INIS)

Kim, Dae Sik

1993-02-01

This paper describes a study on the development of an automatic fault diagnosis system for testing digital electronic circuits of nuclear power plants. Compared with the other conventional fault diagnosis systems, the system described in this paper uses Artificial Intelligence technique of model based reasoning and corroboration, which makes fault diagnosis much more efficient. In order to reduce the testing time, an optimal testing set which means a minimal testing set to determine whether or not the circuit is fault-free and to locate the faulty gate was derived. Compared with the testing using an exhaustive testing set, the testing using the optimal testing set makes fault diagnosis much more fast. Since the system diagnoses the circuit boards bases only on input and output signals, it can be further developed for on-line testing. The system was implemented on a microprocessor and was applied for Universal Circuit board testing of the Solid State protection System in nuclear power plants

A dishwasher for circuits

CERN Multimedia

Rosaria Marraffino

2014-01-01

You have always been told that electronic devices fear water. However, at the Surface Mount Devices (SMD) Workshop here at CERN all the electronic assemblies are cleaned with a machine that looks like a… dishwasher.   The circuit dishwasher. Credit: Clara Nellist.  If you think the image above shows a dishwasher, you wouldn’t be completely wrong. Apart from the fact that the whole pumping system and the case itself are made entirely from stainless steel and chemical resistant materials, and the fact that it washes electrical boards instead of dishes… it works exactly like a dishwasher. It’s a professional machine (mainly used in the pharmaceutical industry) designed to clean everything that can be washed with a water-based chemical soap. This type of treatment increases the lifetime of the electronic boards and therefore the LHC's reliability by preventing corrosion problems in the severe radiation and ozone environment of the LHC tunn...

Position-sensitive proportional counter with low-resistance metal-wire anode

International Nuclear Information System (INIS)

Kopp, M.K.

1980-01-01

A position-sensitive proportional counter circuit is provided which uses a conventional (low-resistance, metal-wire anode) proportional counter for spatial resolution of an ionizing event along the anode of the counther. A pair of specially designed activecapacitance preamplifiers terminate the anode ends wherein the anode is treated as an RC line. The preamplifiers act as stabilized active capacitance loads and each is composed of a series-feedback, lownoise amplifier, a unity-gain, shunt-feedback amplifier whose output is connected through a feedback capacitor to the series-feedback amplifier input. The stabilized capacitance loading of the anode allows distributed RC-line position encoding and subsequent time difference decoding by sensing the difference in rise times of pulses at te anode ends where the difference is primarily in response to the distributed capacitance along the anode. This allows the use of lower resistance wire anodes for spatial radiation detection which simplifies the counter construction and handling of the anodes, and stabilizes the anode resistivity at high count rates

Implementation of Complex Biological Logic Circuits Using Spatially Distributed Multicellular Consortia

Science.gov (United States)

Urrios, Arturo; de Nadal, Eulàlia; Solé, Ricard; Posas, Francesc

2016-01-01

Engineered synthetic biological devices have been designed to perform a variety of functions from sensing molecules and bioremediation to energy production and biomedicine. Notwithstanding, a major limitation of in vivo circuit implementation is the constraint associated to the use of standard methodologies for circuit design. Thus, future success of these devices depends on obtaining circuits with scalable complexity and reusable parts. Here we show how to build complex computational devices using multicellular consortia and space as key computational elements. This spatial modular design grants scalability since its general architecture is independent of the circuit’s complexity, minimizes wiring requirements and allows component reusability with minimal genetic engineering. The potential use of this approach is demonstrated by implementation of complex logical functions with up to six inputs, thus demonstrating the scalability and flexibility of this method. The potential implications of our results are outlined. PMID:26829588

Modular design of synthetic gene circuits with biological parts and pools.

Science.gov (United States)

Marchisio, Mario Andrea

2015-01-01

Synthetic gene circuits can be designed in an electronic fashion by displaying their basic components-Standard Biological Parts and Pools of molecules-on the computer screen and connecting them with hypothetical wires. This procedure, achieved by our add-on for the software ProMoT, was successfully applied to bacterial circuits. Recently, we have extended this design-methodology to eukaryotic cells. Here, highly complex components such as promoters and Pools of mRNA contain hundreds of species and reactions whose calculation demands a rule-based modeling approach. We showed how to build such complex modules via the joint employment of the software BioNetGen (rule-based modeling) and ProMoT (modularization). In this chapter, we illustrate how to utilize our computational tool for synthetic biology with the in silico implementation of a simple eukaryotic gene circuit that performs the logic AND operation.

Detection of a buried wire with two resistively loaded wire antennas

NARCIS (Netherlands)

Vossen, S.H.J.A.; Tijhuis, A.G.; Lepelaars, E.S.A.M.; Zwamborn, A.P.M.

2002-01-01

The use of two identical straight thin-wire antennas for the detection of a buried wire is analyzed with the aid of numerical calculations. The buried wire is located below an interface between two homogeneous half-spaces. The detection setup, which is formed by a transmitting and a receiving wire,

wire chamber

CERN Multimedia

1985-01-01

Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

Wire chamber

CERN Multimedia

Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

wire chamber

CERN Multimedia

Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

SVX Sequencer Board

International Nuclear Information System (INIS)

Utes, M.

1997-01-01

The SVX Sequencer boards are 9U by 280mm circuit boards that reside in slots 2 through 21 of each of eight Eurocard crates in the D0 Detector Platform. The basic purpose is to control the SVX chips for data acquisition and when a trigger occurs, to gather the SVX data and relay the data to the VRB boards in the Movable Counting House. Functions and features are as follows: (1) Initialization of eight SVX chip strings using the MIL-STD-1553 data bus; (2) Real time manipulation of the SVX control lines to effect data acquisition, digitization, and readout based on the NRZ/Clock signals from the Controller; (3) Conversion of 8-bit electrical SVX readout data to an optical signal operating at 1.062 Gbit/sec, sent to the VRB. Eight HDIs will be serviced per board; (4) Built-in logic analyzer which can record the most important control and data lines during a data acquisition cycle and put this recorded information onto the 1553 bus; (5) Identification header and end of data trailer tacked onto data stream; (6) 1553 register which can read the current values of the control and data lines; (7) 1553 register which can test the optical link; (8) 1553 registers for crossing pulse width, calibration pulse voltage, and calibration pipeline select; (9) 1553 register for reading the optical drivers status link; (10) 1553 register for power control of SVX chips and ignoring bad SVX strings; (11) Front panel displays and LEDs show the board status at a glance; (12) In-system programmable EPLDs are programmed via 1553 or Altera's 'Bitblaster'; (13) Automatic readout abort after 45us; (14) Supplies BUSY signal back to Trigger Framework; (15) Supports a heartbeat system to prevent excessive SVX current draw; and (16) Supports a SVX power trip feature if heartbeat failure occurs.

Influence of water conductivity on shock waves generated by underwater electrical wire explosion

Science.gov (United States)

Liu, Ben; Wang, Deguo; Guo, Yanbao

2018-01-01

The new application of electrical explosion of wire (EEW) used in petroleum industry is to enhance oil recovery (EOR). Because of the complex environment underground, the effect of underground water conductivity on EEW should be considered. This work describes the effect of water conductivities on discharge current, voltage and shock waves. It was found that the effect of water conductivity contains two parts. One is the shunt effect of saline water, which can be considered as a parallel load with the copper wire between the electrodes connected to the discharge circuit. The peak pressure of shock waves are gradually decrease with the increase of water conductivity. The other is the current loss through saline water directly to the ground ends without flowing through the electrodes. The shunt effect is the main factor affecting the wire discharge process. As the charging voltage increased, the energy loss caused by these two parts are all reduced. These indicate that increasing the charging voltage to a certain value will increase the energy efficiency to generate a more powerful shock waves in conductive water.

Activity-dependent modulation of neural circuit synaptic connectivity

Directory of Open Access Journals (Sweden)

Charles R Tessier

2009-07-01

Full Text Available In many nervous systems, the establishment of neural circuits is known to proceed via a two-stage process; 1 early, activity-independent wiring to produce a rough map characterized by excessive synaptic connections, and 2 subsequent, use-dependent pruning to eliminate inappropriate connections and reinforce maintained synapses. In invertebrates, however, evidence of the activity-dependent phase of synaptic refinement has been elusive, and the dogma has long been that invertebrate circuits are “hard-wired” in a purely activity-independent manner. This conclusion has been challenged recently through the use of new transgenic tools employed in the powerful Drosophila system, which have allowed unprecedented temporal control and single neuron imaging resolution. These recent studies reveal that activity-dependent mechanisms are indeed required to refine circuit maps in Drosophila during precise, restricted windows of late-phase development. Such mechanisms of circuit refinement may be key to understanding a number of human neurological diseases, including developmental disorders such as Fragile X syndrome (FXS and autism, which are hypothesized to result from defects in synaptic connectivity and activity-dependent circuit function. This review focuses on our current understanding of activity-dependent synaptic connectivity in Drosophila, primarily through analyzing the role of the fragile X mental retardation protein (FMRP in the Drosophila FXS disease model. The particular emphasis of this review is on the expanding array of new genetically-encoded tools that are allowing cellular events and molecular players to be dissected with ever greater precision and detail.

Removal of organic compounds from wastewater originating from the production of printed circuit boards by UV-Fenton method

Directory of Open Access Journals (Sweden)

Thomas Maciej

2017-12-01

Full Text Available The possibility of removing organic compounds from wastewater originating from the photochemical production of printed circuit boards by use of waste acidification and disposal of precipitated photopolymer in the first stage and the UV-Fenton method in a second stage has been presented. To optimize the process of advanced oxidation, the RSM (Response Surface Methodology for three independent factors was applied, i.e. pH, the concentration of Fe(II and H2O2 concentration. The use of optimized values of individual parameters in the process of wastewater treatment caused a decrease in the concentration of the organic compounds denoted as COD by approx. 87% in the first stage and approx. 98% after application of both processes. Precipitation and the decomposition of organic compounds was associated with a decrease of wastewater COD to below 100 mg O2/L whereas the initial value was 5550 mg O2/L. Decomposition of organic compounds and verification of the developed model of photopolymers removal was also carried out with use of alternative H2O2 sources i.e. CaO2, MgO2, and Na2CO3·1,5H2O2.

Recovery of copper and lead from waste printed circuit boards by supercritical water oxidation combined with electrokinetic process

International Nuclear Information System (INIS)

Xiu Furong; Zhang Fushen

2009-01-01

An effective and benign process for copper and lead recovery from waste printed circuit boards (PCBs) was developed. In the process, the PCBs was pre-treated in supercritical water, then subjected to electrokinetic (EK) process. Experimental results showed that supercritical water oxidation (SCWO) process was strong enough to decompose the organic compounds of PCBs, and XRD spectra indicated that copper and lead were oxidized into CuO, Cu 2 O and β-PbO 2 in the process. The optimum SCWO treatment conditions were 60 min, 713 K, 30 MPa, and EK treatment time, constant current density were 11 h, 20 mA cm -2 , respectively. The recovery percentages of copper and lead under optimum SCWO + EK treatment conditions were around 84.2% and 89.4%, respectively. In the optimized EK treatment, 74% of Cu was recovered as a deposit on the cathode with a purity of 97.6%, while Pb was recovered as concentrated solutions in either anode (23.1%) or cathode (66.3%) compartments but little was deposited on the electrodes. It is believed that the process is effective and practical for Cu and Pb recovery from waste electric and electronic equipments.

ONBORD (On-Board Navigation of Ballistic ORDnance): Gun-Launched Munitions Flight Controller

National Research Council Canada - National Science Library

Wilson, Michael

2004-01-01

.... The electronics consist of a single 1.4-inch printed circuit board that includes the Texas Instruments TMS320F2812 digital signal processor whose microcontroller-like capabilities reduce the amount of peripheral circuitry necessary...

Occurrences and inventories of heavy metals and brominated flame retardants in wastes from printed circuit board production.

Science.gov (United States)

Zhou, Xiaoyu; Guo, Jie; Zhang, Wei; Zhou, Peng; Deng, Jingjing; Lin, Kuangfei

2014-09-01

Pollutants including heavy metals and brominated flame retardant were detected in 10 types of production wastes from a typical printed circuit board manufacturing plant, and their inventories were estimated. Rinsing water from etching process had the highest concentrations of copper (665.51 mg/L), lead (1.02 mg/L), nickel (3.60 mg/L), chromium (0.97 mg/L), and tin (1.79 mg/L). Powdered solid waste (SW) from the cut lamination process contained the highest tetrabromobisphenol-A (TBBPA) levels (49.86 mg/kg). Polybrominated diphenyl ethers (PBDEs) were absent in this plant, in agreement with the international regulations of PBDE phase out. The pollutant inventories in the wastes exhibited in the order of copper > > zinc > tin ≈ nickel > lead > chromium > > TBBPA. The potential environmental impact of pollutants in SW during production and disposal were further investigated. A high partitioning of pollutant concentration between the total suspended particle and SW (-0.10 < log K TS < 2.12) was observed for most pollutants, indicating the emission pathway from SW to the airborne atmosphere in the workshop. Although SW met the toxicity characteristic leaching procedure, drilling powder with the smallest particle diameter still showed high leachabilities of lead and tin which may lead to a negative environmental impact during disposal.

Preparation of hierarchical porous carbon from waste printed circuit boards for high performance electric double-layer capacitors

Science.gov (United States)

Du, Xuan; Wang, Li; Zhao, Wei; Wang, Yi; Qi, Tao; Li, Chang Ming

2016-08-01

Renewable clean energy and resources recycling have become inevitable choices to solve worldwide energy shortages and environmental pollution problems. It is a great challenge to recycle tons of waste printed circuit boards (PCB) produced every year for clean environment while creating values. In this work, low cost, high quality activated carbons (ACs) were synthesized from non-metallic fractions (NMF) of waste PCB to offer a great potential for applications of electrochemical double-layer capacitors (EDLCs). After recovering metal from waste PCB, hierarchical porous carbons were produced from NMF by carbonization and activation processes. The experimental results exhibit that some pores were formed after carbonization due to the escape of impurity atoms introduced by additives in NMF. Then the pore structure was further tailored by adjusting the activation parameters. Roles of micropores and non-micropores in charge storage were investigated when the hierarchical porous carbons were applied as electrode of EDLCs. The highest specific capacitance of 210 F g-1 (at 50 mA g-1) and excellent rate capability were achieved when the ACs possessing a proper micropores/non-micropores ratio. This work not only provides a promising method to recycle PCB, but also investigates the structure tailoring arts for a rational hierarchical porous structure in energy storage/conversion.

Novel Application of Glass Fibers Recovered From Waste Printed Circuit Boards as Sound and Thermal Insulation Material

Science.gov (United States)

Sun, Zhixing; Shen, Zhigang; Ma, Shulin; Zhang, Xiaojing

2013-10-01

The aim of this study is to investigate the feasibility of using glass fibers, a recycled material from waste printed circuit boards (WPCB), as sound absorption and thermal insulation material. Glass fibers were obtained through a fluidized-bed recycling process. Acoustic properties of the recovered glass fibers (RGF) were measured and compared with some commercial sound absorbing materials, such as expanded perlite (EP), expanded vermiculite (EV), and commercial glass fiber. Results show that RGF have good sound absorption ability over the whole tested frequency range (100-6400 Hz). The average sound absorption coefficient of RGF is 0.86, which is prior to those of EP (0.81) and EV (0.73). Noise reduction coefficient analysis indicates that the absorption ability of RGF can meet the requirement of II rating for sound absorbing material according to national standard. The thermal insulation results show that RGF has a fair low thermal conductivity (0.046 W/m K), which is comparable to those of some insulation materials (i.e., EV, EP, and rock wool). Besides, an empirical dependence of thermal conductivity on material temperature was determined for RGF. All the results showed that the reuse of RGF for sound and thermal insulation material provided a promising way for recycling WPCB and obtaining high beneficial products.

Transferrable monolithic III-nitride photonic circuit for multifunctional optoelectronics

Science.gov (United States)

Shi, Zheng; Gao, Xumin; Yuan, Jialei; Zhang, Shuai; Jiang, Yan; Zhang, Fenghua; Jiang, Yuan; Zhu, Hongbo; Wang, Yongjin

2017-12-01

A monolithic III-nitride photonic circuit with integrated functionalities was implemented by integrating multiple components with different functions into a single chip. In particular, the III-nitride-on-silicon platform is used as it integrates a transmitter, a waveguide, and a receiver into a suspended III-nitride membrane via a wafer-level procedure. Here, a 0.8-mm-diameter suspended device architecture is directly transferred from silicon to a foreign substrate by mechanically breaking the support beams. The transferred InGaN/GaN multiple-quantum-well diode (MQW-diode) exhibits a turn-on voltage of 2.8 V with a dominant electroluminescence peak at 453 nm. The transmitter and receiver share an identical InGaN/GaN MQW structure, and the integrated photonic circuit inherently works for on-chip power monitoring and in-plane visible light communication. The wire-bonded monolithic photonic circuit on glass experimentally demonstrates in-plane data transmission at 120 Mb/s, paving the way for diverse applications in intelligent displays, in-plane light communication, flexible optical sensors, and wearable III-nitride optoelectronics.

49 CFR 236.74 - Protection of insulated wire; splice in underground wire.

Science.gov (United States)

2010-10-01

... underground wire. 236.74 Section 236.74 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL RAILROAD ADMINISTRATION, DEPARTMENT OF TRANSPORTATION RULES, STANDARDS, AND INSTRUCTIONS GOVERNING... wire; splice in underground wire. Insulated wire shall be protected from mechanical injury. The...

49 CFR 234.241 - Protection of insulated wire; splice in underground wire.

Science.gov (United States)

2010-10-01

... underground wire. 234.241 Section 234.241 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL RAILROAD ADMINISTRATION, DEPARTMENT OF TRANSPORTATION GRADE CROSSING SIGNAL SYSTEM SAFETY... of insulated wire; splice in underground wire. Insulated wire shall be protected from mechanical...

Nonlinear dynamic response of a 'flexible-and-heavy' printed circuit board (PCB) to an impact load applied to its support contour

International Nuclear Information System (INIS)

Suhir, E; Vujosevic, M; Reinikainen, T

2009-01-01

Based on the developed simple and physically meaningful analytical ('mathematical') stress model, we evaluate some major parameters (amplitude, frequency, maximum acceleration, stresses and strains) of the response of a 'flexible-and-heavy' square simply supported printed circuit board (PCB) to an impact drop load applied to its support contour. The analysis is restricted to the first mode of vibrations and is carried out in application to the PCB design employed in an advanced accelerated test setup (test vehicle). This setup is aimed at the assessment of the performance, in accelerated test conditions on the board level, of packaging materials (and, first of all, BGA solder joint interconnections) subjected to dynamic (drop or shock) loading. It is anticipated that heavy masses could be mounted on the PCB to accelerate its dynamic response to an impact load. These masses are expected to be small in size, so that while changing the total mass of the board and generating significant inertia forces, they do not affect the board's flexural rigidity or its stiffness with respect to the in-plane loading. The PCB's contour is considered non-deformable, which is indeed the case in many practical situations. This circumstance, if the drop height and/or the induced inertia forces are significant, leads to elevated in-plane ('membrane') stresses in the PCB and, as a result of that, to the nonlinear response of the board to the impact load: the relationship between the magnitude of the load (determined by the initial impact velocity) and the induced PCB deflections becomes geometrically nonlinear, with a rigid cubic characteristic of the restoring force. The carried out numerical example, although reflects the characteristics of the PCB and loading conditions in an actual experimental setup, is merely an illustration of the general concept and is intended to demonstrate the abilities of the suggested method. Predictions based on this method agree well with the finite element

wire chamber

CERN Multimedia

Was used in ISR (Intersecting Storage Ring) split field magnet experiment. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

Secondary Voltage Unbalance Compensation for Three-Phase Four-Wire Islanded Microgrids

DEFF Research Database (Denmark)

Tang, Fen; Zhou, Xiao; Meng, Lexuan

2014-01-01

This paper proposes a secondary voltage unbalance control approach that compensate voltage unbalances in three-phase four-wire islanded microgrid systems. It is implemented in the secondary control level of the microgrid hierarchical control structure. By sending information through low......-bandwidth communication links to the primary control level, the required unbalanced factors at sensitive buses are achieved. Also, negative and zero sequence equivalent circuits and unbalance compensation principle are derived. Finally, real-time hardware-in-the-loop results show the feasibility of the proposed approach...

Creating a Simple Electric Circuit with Children between the Ages of Five and Six

Science.gov (United States)

Kada, Vasiliki; Ravanis, Kostantinos

2016-01-01

This paper presents a study of how preschool-aged children go about creating and operating a simple electric circuit (wires, light bulb, and battery), and how they view the elements that comprise it, particularly how they view the role of the battery. The research involved 108 children aged between five and six, who were individually interviewed.…

Laser direct fabrication of silver conductors on glass boards

International Nuclear Information System (INIS)

Li Xiangyou; Zeng Xiaoyan; Li Huiling; Qi Xiaojing

2005-01-01

Laser micro-cladding has been used to fabricate metal conductors, according to a designed electronic circuit, directly onto glass boards which had been coated with a silver-containing electronic paste. The electronic pastes, composed of silver powders, inorganic binders and organic medium, thus formed the conductive metal pattern (i.e. electric circuit) along the path of the laser allowing the rest of the layer to be removed subsequently by an organic solvent. Firing in a furnace at 600 deg. C resulted in conductive lines with resistivity of about 10 -5 Ω cm and with adhesive strength of the order of magnitude of megapascals

Improved switch-resistor packaging

Science.gov (United States)

Redmerski, R. E.

1980-01-01

Packaging approach makes resistors more accessible and easily identified with specific switches. Failures are repaired more quickly because of improved accessibility. Typical board includes one resistor that acts as circuit breaker, and others are positioned so that their values can be easily measured when switch is operated. Approach saves weight by using less wire and saves valuable panel space.

Eco-friendly copper recovery process from waste printed circuit boards using Fe³⁺/Fe²⁺ redox system.

Science.gov (United States)

Fogarasi, Szabolcs; Imre-Lucaci, Florica; Egedy, Attila; Imre-Lucaci, Árpád; Ilea, Petru

2015-06-01

The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe(3+) combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%. Copyright © 2015 Elsevier Ltd. All rights reserved.

Experimental investigation on the energy deposition and morphology of the electrical explosion of copper wire in vacuum

International Nuclear Information System (INIS)

Shi, Zongqian; Shi, Yuanjie; Wang, Kun; Jia, Shenli

2016-01-01

This paper presents the experimental results of the electrical explosion of copper wires in vacuum using negative nanosecond-pulsed current with magnitude of 1–2 kA. The 20 μm-diameter copper wires with different lengths are exploded with three different current rates. A laser probe is applied to construct the shadowgraphy and interferometry diagnostics to investigate the distribution and morphology of the exploding product. The interference phase shift is reconstructed from the interferogram, by which the atomic density distribution is calculated. Experimental results show that there exist two voltage breakdown modes depending on the amount of the specific energy deposition. For the strong-shunting mode, shunting breakdown occurs, leading to the short-circuit-like current waveform. For the weak-shunting mode with less specific energy deposition, the plasma generated during the voltage breakdown is not enough to form a conductive plasma channel, resulting in overdamped declining current waveform. The influence of the wire length and current rate on the characteristics of the exploding wires is also analyzed.

Experimental investigation on the energy deposition and morphology of the electrical explosion of copper wire in vacuum

Energy Technology Data Exchange (ETDEWEB)

Shi, Zongqian; Shi, Yuanjie; Wang, Kun; Jia, Shenli [State Key Laboratory of Electrical Insulation and Power Equipment, Xi' an Jiaotong University, Shanxi 710049 (China)

2016-03-15

This paper presents the experimental results of the electrical explosion of copper wires in vacuum using negative nanosecond-pulsed current with magnitude of 1–2 kA. The 20 μm-diameter copper wires with different lengths are exploded with three different current rates. A laser probe is applied to construct the shadowgraphy and interferometry diagnostics to investigate the distribution and morphology of the exploding product. The interference phase shift is reconstructed from the interferogram, by which the atomic density distribution is calculated. Experimental results show that there exist two voltage breakdown modes depending on the amount of the specific energy deposition. For the strong-shunting mode, shunting breakdown occurs, leading to the short-circuit-like current waveform. For the weak-shunting mode with less specific energy deposition, the plasma generated during the voltage breakdown is not enough to form a conductive plasma channel, resulting in overdamped declining current waveform. The influence of the wire length and current rate on the characteristics of the exploding wires is also analyzed.

Reliability analysis of magnetic logic interconnect wire subjected to magnet edge imperfections

Science.gov (United States)

Zhang, Bin; Yang, Xiaokuo; Liu, Jiahao; Li, Weiwei; Xu, Jie

2018-02-01

Nanomagnet logic (NML) devices have been proposed as one of the best candidates for the next generation of integrated circuits thanks to its substantial advantages of nonvolatility, radiation hardening and potentially low power. In this article, errors of nanomagnetic interconnect wire subjected to magnet edge imperfections have been evaluated for the purpose of reliable logic propagation. The missing corner defects of nanomagnet in the wire are modeled with a triangle, and the interconnect fabricated with various magnetic materials is thoroughly investigated by micromagnetic simulations under different corner defect amplitudes and device spacings. The results show that as the defect amplitude increases, the success rate of logic propagation in the interconnect decreases. More results show that from the interconnect wire fabricated with materials, iron demonstrates the best defect tolerance ability among three representative and frequently used NML materials, also logic transmission errors can be mitigated by adjusting spacing between nanomagnets. These findings can provide key technical guides for designing reliable interconnects. Project supported by the National Natural Science Foundation of China (No. 61302022) and the Scientific Research Foundation for Postdoctor of Air Force Engineering University (Nos. 2015BSKYQD03, 2016KYMZ06).

Scintillation counter and wire chamber front end modules for high energy physics experiments

International Nuclear Information System (INIS)

Baldin, Boris; DalMonte, Lou

2011-01-01

This document describes two front-end modules developed for the proposed MIPP upgrade (P-960) experiment at Fermilab. The scintillation counter module was developed for the Plastic Ball detector time and charge measurements. The module has eight LEMO 00 input connectors terminated with 50 ohms and accepts negative photomultiplier signals in the range 0.25...1000 pC with the maximum input voltage of 4.0 V. Each input has a passive splitter with integration and differentiation times of ∼20 ns. The integrated portion of the signal is digitized at 26.55 MHz by Analog Devices AD9229 12-bit pipelined 4-channel ADC. The differentiated signal is discriminated for time measurement and sent to one of the four TMC304 inputs. The 4-channel TMC304 chip allows high precision time measurement of rising and falling edges with ∼100 ps resolution and has internal digital pipeline. The ADC data is also pipelined which allows deadtime-less operation with trigger decision times of ∼4 (micro)s. The wire chamber module was developed for MIPP EMCal detector charge measurements. The 32-channel digitizer accepts differential analog signals from four 8-channel integrating wire amplifiers. The connection between wire amplifier and digitizer is provided via 26-wire twist-n-flat cable. The wire amplifier integrates input wire current and has sensitivity of 275 mV/pC and the noise level of ∼0.013 pC. The digitizer uses the same 12-bit AD9229 ADC chip as the scintillator counter module. The wire amplifier has a built-in test pulser with a mask register to provide testing of the individual channels. Both modules are implemented as a 6Ux220 mm VME size board with 48-pin power connector. A custom europack (VME) 21-slot crate is developed for housing these front-end modules.

Analysis and synthesis of digital circuits for a computer of specific purposes

International Nuclear Information System (INIS)

Marchand Rosales, E.E.

1975-01-01

The circuits described in this paper are part of a computer system designed for the automation of plasma diagnostics using electrostatic probes. The automated system is designed to give: (a) The density of the plasma (state variable) every ten microseconds in binary digits; (b) Probe data, stored for subsequent diagnostics; (c) A graphic and digital display of results; (d) Presentation of numerical diagnostics results in floating point format and in the decimal system for convenience of interpretation. The project is aimed, furthermore, at the development of techniques for the design, construction and adjustment of digital circuits, and at the training of personnel who will apply these techniques in digital instrumentation. A block diagram of the system is discussed in general terms. Methods for analysis and synthesis of the sequential circuits applied to the circuit for aligning and normalizing the floating point format, the format circuit and the operational sequence circuit are also described. Recommendations are made and precautions suggested which it is thought advisable to follow at the stages of design, construction and adjustment of the digital circuits, and these apply also to the equipment and techniques (wire wrapping) used for building the circuits. The adjustment of the digital circuits proved to be satisfactory and a definition panel was thus obtained for the decimal point alignment circuit. It is concluded that the method of synthesis need not always be applied; the cases in which the method is recommended are mentioned, as are those in which the non-formal method of synthesis can be used. (author)

Monolithically Integrated Flexible Black Phosphorus Complementary Inverter Circuits.

Science.gov (United States)

Liu, Yuanda; Ang, Kah-Wee

2017-07-25

Two-dimensional (2D) inverters are a fundamental building block for flexible logic circuits which have previously been realized by heterogeneously wiring transistors with two discrete channel materials. Here, we demonstrate a monolithically integrated complementary inverter made using a homogeneous black phosphorus (BP) nanosheet on flexible substrates. The digital logic inverter circuit is demonstrated via effective threshold voltage tuning within a single BP material, which offers both electron and hole dominated conducting channels with nearly symmetric pinch-off and current saturation. Controllable electron concentration is achieved by accurately modulating the aluminum (Al) donor doping, which realizes BP n-FET with a room-temperature on/off ratio >10 3 . Simultaneously, work function engineering is employed to obtain a low Schottky barrier contact electrode that facilities hole injection, thus enhancing the current density of the BP p-FET by 9.4 times. The flexible inverter circuit shows a clear digital logic voltage inversion operation along with a larger-than-unity direct current voltage gain, while exhibits alternating current dynamic signal switching at a record high frequency up to 100 kHz and remarkable electrical stability upon mechanical bending with a radii as small as 4 mm. Our study demonstrates a practical monolithic integration strategy for achieving functional logic circuits on one material platform, paving the way for future high-density flexible electronic applications.

PS wire chamber

CERN Multimedia

1970-01-01

A wire chamber used at CERN's Proton Synchrotron accelerator in the 1970s. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

Wire bonding in microelectronics

CERN Document Server

Harman, George G

2010-01-01

Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. Coverage includes: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bo...

Co-recycling of acrylonitrile-butadiene-styrene waste plastic and nonmetal particles from waste printed circuit boards to manufacture reproduction composites.

Science.gov (United States)

Sun, Zhixing; Shen, Zhigang; Zhang, Xiaojing; Ma, Shulin

2015-01-01

This study investigated the feasibility of using acrylonitrile-butadiene-styrene (ABS) waste plastic and nonmetal particles from waste printed circuit boards (WPCB) to manufacture reproduction composites (RC), with the aim of co-recycling these two waste resources. The composites were prepared in a twin-crew extruder and investigated by means of mechanical testing, in situ flexural observation, thermogravimatric analysis, and dimensional stability evaluation. The results showed that the presence of nonmetal particles significantly improved the mechanical properties and the physical performance of the RC. A loading of 30 wt% nonmetal particles could achieve a flexural strength of 72.6 MPa, a flexural modulus of 3.57 GPa, and an impact strength of 15.5 kJ/m2. Moreover, it was found that the application of maleic anhydride-grafted ABS as compatilizer could effectively promote the interfacial adhesion between the ABS plastic and the nonmetal particles. This research provides a novel method to reuse waste ABS and WPCB nonmetals for manufacturing high value-added product, which represents a promising way for waste recycling and resolving the environmental problem.

Flexible circuits with integrated switches for robotic shape sensing

Science.gov (United States)

Harnett, C. K.

2016-05-01

Digital switches are commonly used for detecting surface contact and limb-position limits in robotics. The typical momentary-contact digital switch is a mechanical device made from metal springs, designed to connect with a rigid printed circuit board (PCB). However, flexible printed circuits are taking over from the rigid PCB in robotics because the circuits can bend while carrying signals and power through moving joints. This project is motivated by a previous work where an array of surface-mount momentary contact switches on a flexible circuit acted as an all-digital shape sensor compatible with the power resources of energy harvesting systems. Without a rigid segment, the smallest commercially-available surface-mount switches would detach from the flexible circuit after several bending cycles, sometimes violently. This report describes a low-cost, conductive fiber based method to integrate electromechanical switches into flexible circuits and other soft, bendable materials. Because the switches are digital (on/off), they differ from commercially-available continuous-valued bend/flex sensors. No amplification or analog-to-digital conversion is needed to read the signal, but the tradeoff is that the digital switches only give a threshold curvature value. Boundary conditions on the edges of the flexible circuit are key to setting the threshold curvature value for switching. This presentation will discuss threshold-setting, size scaling of the design, automation for inserting a digital switch into the flexible circuit fabrication process, and methods for reconstructing a shape from an array of digital switch states.

Base Information Transport Infrastructure Wired (BITI Wired)

Science.gov (United States)

2016-03-01

2016 Major Automated Information System Annual Report Base Information Transport Infrastructure Wired (BITI Wired) Defense Acquisition Management...Combat Information Transport System program was restructured into two pre-Major Automated Information System (pre-MAIS) components: Information...Major Automated Information System MAIS OE - MAIS Original Estimate MAR – MAIS Annual Report MDA - Milestone Decision Authority MDD - Materiel

Load-Deflection and Friction Properties of PEEK Wires as Alternative Orthodontic Wires.

Science.gov (United States)

Tada, Yoshifumi; Hayakawa, Tohru; Nakamura, Yoshiki

2017-08-09

Polyetheretherketone (PEEK) is now attracting attention as an alternative to metal alloys in the dental field. In the present study, we evaluated the load-deflection characteristics of PEEK wires in addition to their frictional properties. Three types of PEEK wires are used: two sizes of rectangular shape, 0.016 × 0.022 in² and 0.019 × 0.025 in² (19-25PEEK), and rounded shape, diameter 0.016 in (16PEEK). As a control, Ni-Ti orthodontic wire, diameter 0.016 in, was used. The three-point bending properties were evaluated in a modified three-point bending system for orthodontics. The static friction between the orthodontic wire and the bracket was also measured. The load-deflection curves were similar among Ni-Ti and PEEK wires, except for 16PEEK with slot-lid ligation. The bending force of 19-25PEEK wire was comparable with that of Ni-Ti wire. 19-25PEEK showed the highest load at the deflection of 1500 μm ( p 0.05). No significant difference was seen in static friction between all three PEEK wires and Ni-Ti wire ( p > 0.05). It is suggested that 19-25PEEK will be applicable for orthodontic treatment with the use of slot-lid ligation.

The front-end analog and digital signal processing electronics for the drift chambers of the Stanford Large Detector

International Nuclear Information System (INIS)

Haller, G.M.; Freytag, D.R.; Fox, J.; Olsen, J.; Paffrath, L.; Yim, A.; Honma, A.

1990-10-01

The front-end signal processing electronics for the drift-chambers of the Stanford Large Detector (SLD) at the Stanford Linear Collider is described. The system is implemented with printed-circuit boards which are shaped for direct mounting on the detector. Typically, a motherboard comprises 64 channels of transimpedance amplification and analog waveform sampling, A/D conversion, and associated control and readout circuitry. The loaded motherboard thus forms a processor which records low-level wave forms from 64 detector channels and transforms the information into a 64 k-byte serial data stream. In addition, the package performs calibration functions, measures leakage currents on the wires, and generates wire hit patterns for triggering purposes. The construction and operation of the electronic circuits utilizing monolithic, hybridized, and programmable components are discussed

Progress of the Hard-wired Instrumentation and Control Works for the Neutral Beam Test Stand at KAERI

Energy Technology Data Exchange (ETDEWEB)

Jung, Ki Sok

2005-12-15

Progress of the hard-wired instrumentation and control works for the neutral beam test stand(NB-TS) has been existed for the past one year period. Details of the installed arc detector circuit are explained. LN{sub 2} level and temperature control during the cryosorption pumping operation are explained with an emphasis on its control circuit. With an expectation of more accurate and sensitive measurement of temperatures than the thermocouple utilization during the calorimeter operation, PT-100 resistance temperature detector(RTD) utilization is initiated and the results are described. During the ion beam experiment, physical measurements are made with some delayed time than the beam extraction, and thus a delayed trigger pulse generator was fabricated and installed to the system. Underlying principles of the electronic circuits for the interlock implementation and optical signal transmission are introduced. These are basically the application of operational amplifier circuits. A cautious aspect of the SMPS(switch mode power supply) utilization is also give.

Progress of the Hard-wired Instrumentation and Control Works for the Neutral Beam Test Stand at KAERI

International Nuclear Information System (INIS)

Jung, Ki Sok

2005-12-01

Progress of the hard-wired instrumentation and control works for the neutral beam test stand(NB-TS) has been existed for the past one year period. Details of the installed arc detector circuit are explained. LN 2 level and temperature control during the cryosorption pumping operation are explained with an emphasis on its control circuit. With an expectation of more accurate and sensitive measurement of temperatures than the thermocouple utilization during the calorimeter operation, PT-100 resistance temperature detector(RTD) utilization is initiated and the results are described. During the ion beam experiment, physical measurements are made with some delayed time than the beam extraction, and thus a delayed trigger pulse generator was fabricated and installed to the system. Underlying principles of the electronic circuits for the interlock implementation and optical signal transmission are introduced. These are basically the application of operational amplifier circuits. A cautious aspect of the SMPS(switch mode power supply) utilization is also give

Experimental Verification of Guided-Wave Lumped Circuits Using Waveguide Metamaterials

Science.gov (United States)

Li, Yue; Zhang, Zhijun

2018-04-01

Through the construction and characterization in microwave frequencies, we experimentally demonstrate our recently developed theory of waveguide lumped circuits, i.e., waveguide metatronics [Sci. Adv. 2, e1501790 (2016), 10.1126/sciadv.1501790], as a method to design subwavelength-scaled analog circuits. In the paradigm of waveguide metatronics, numbers of lumped inductors and capacitors are easily integrated functionally inside the waveguide, which is an irreplaceable transmission line in millimeter-wave and terahertz systems with the advantages of low radiation loss and low crosstalk. An example of multiple-ordered metatronic filters with layered structures is fabricated utilizing the technique of substrate integrated waveguides, which can be easily constructed by the printed-circuit-board process. The materials used in the construction are also typical microwave materials with positive permittivity, low loss, and negligible dispersion, imitating the plasmonic materials with negative permittivity in the optical domain. The results verify the theory of waveguide metatronics, which provides an efficient platform of functional lumped circuit design for guided-wave processing.

The investigation of a compact auto-connected wire-wrapped pulsed transformer.

Science.gov (United States)

Wang, Yuwei; Zhang, Jiande; Chen, Dongqun; Cao, Shengguang; Li, Da; Zhang, Tianyang

2012-05-01

For the power conditioning circuit used to deliver power efficiently from flux compression generator (FCG) to the load with high impedance, an air-cored and wire-wrapped transformer convenient in coaxial connection to the other parts is investigated. To reduce the size and enhance the performance, an auto-connection is adopted. A fast and simple model is used to calculate the electrical parameters of the transformer. To evaluate the high voltage capability, the voltages across turns and the electric field distribution in the transformer are investigated. The calculated and the measured electrical parameters of the transformer show good agreements. And the safe operating voltage is predicted to exceed 500 kV. In the preliminary experiments, the transformer is tested in a power conditioning circuit with a capacitive power supply. It is demonstrated that the output voltage of the transformer reaches -342 kV under the input voltage of -81 kV.

Tight bounds on computing error-correcting codes by bounded-depth circuits with arbitrary gates

DEFF Research Database (Denmark)

Gal, A.; Hansen, Kristoffer Arnsfelt; Koucky, Michal

2013-01-01

We bound the minimum number w of wires needed to compute any (asymptotically good) error-correcting code C:{0,1}Ω(n)→{0,1}n with minimum distance Ω(n), using unbounded fan-in circuits of depth d with arbitrary gates. Our main results are: 1) if d=2, then w=Θ(n (lgn/lglgn)2); 2) if d=3, then w...

Tight bounds on computing error-correcting codes by bounded-depth circuits with arbitrary gates

DEFF Research Database (Denmark)

Gál, Anna; Hansen, Kristoffer Arnsfelt; Koucký, Michal

2012-01-01

We bound the minimum number w of wires needed to compute any (asymptotically good) error-correcting code C:{0,1}Ω(n) -> {0,1}n with minimum distance Ω(n), using unbounded fan-in circuits of depth d with arbitrary gates. Our main results are: (1) If d=2 then w = Θ(n ({log n/ log log n})2). (2) If d...

Copper wire bonding

CERN Document Server

Chauhan, Preeti S; Zhong, ZhaoWei; Pecht, Michael G

2014-01-01

This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material.  However, copper wire bonding has several process and reliability concerns due to its material properties.  Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation.  In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed.  The book also discusses best practices and re...

Minimisation of the wire position uncertainties of the new CERN vacuum wire scanner

CERN Document Server

AUTHOR|(CDS)2069346; Barjau Condomines, A

In the next years the luminosity of the LHC will be significantly increased. This will require a much higher accuracy of beam profile measurement than actually achievable by the current wire scanner. The new fast wire scanner is foreseen to measure small emittance beams throughout the LHC injector chain, which demands a wire travelling speed up to 20 ms-1 and position measurement accuracy of the order of a few microns. The vibrations of the mechanical parts of the system, and particularly the vibrations of the thin carbon wire, were identified as the major error sources of wire position uncertainty. Therefore the understanding of the wire vibrations is a high priority for the design and operation of the new device. This document presents the work performed to understand the main causes of the wire vibrations observed in one of the existing wire scanner and the new proposed design.

Morphology, mechanical and thermal oxidative aging properties of HDPE composites reinforced by nonmetals recycled from waste printed circuit boards.

Science.gov (United States)

Yang, Shuangqiao; Bai, Shibing; Wang, Qi

2016-11-01

In this study nonmetals recycled from waste printed circuit boards (NPCB) is used as reinforce fillers in high-density polyethylene (HDPE) composites. The morphology, mechanical and thermal oxidative aging properties of NPCB reinforced HDPE composites are assessed and it compared with two other commercial functional filler for the first time. Mechanical test results showed that NPCB could be used as reinforcing fillers in the HDPE composites and mechanical properties especially for stiffness is better than other two commercial fillers. The improved mechanical property was confirmed by the higher aspect ratio and strong interfacial adhesion in scanning electron microscopy (SEM) studies. The heat deflection temperature (HDT) test showed the presence of fiberglass in NPCB can improve the heat resistance of composite for their potential applications. Meanwhile, the oxidation induction time (OIT) and the Fourier transform infrared (FTIR) spectroscopy results showed that NPCB has a near resistance to oxidation as two other commercial fillers used in this paper. The above results show the reuse of NPCB in the HDPE composites represents a promising way for resolving both the environmental pollution and the high-value reuse of resources. Copyright © 2015. Published by Elsevier Ltd.

Application of Cu-polyimide flex circuit and Al-on-glass pitch adapter for the ATLAS SCT barrel hybrid

CERN Document Server

Unno, Y; Ikegami, Y; Iwata, Y; Kohriki, T; Kondo, T; Nakano, I; Ohsugi, T; Takashima, R; Tanaka, R; Terada, S; Ujiie, N

2005-01-01

We applied the surface build-up Cu-polyimide flex-circuit technology with laser vias to the ATLAS SCT barrel hybrid to be made in one piece from the connector to the electronics sections including cables. The hybrids, reinforced with carbon-carbon substrates, provide mechanical strength, thermal conductivity, low-radiation length, and stability in application-specific integrated circuit (ASIC) operation. By following the design rules, we experienced little trouble in breaking the traces. The pitch adapter between the sensor and the ASICs was made of aluminum traces on glass substrate. We identified that the generation of whiskers around the wire-bonding feet was correlated with the hardness of metallized aluminum. The appropriate hardness has been achieved by keeping the temperature of the glasses as low as room temperature during the metallization. The argon plasma cleaning procedure cleaned the contamination on the gold pads of the hybrids for successful wire bonding, although it was unsuccessful in the alu...

Real-time monitoring system for improving corona electrostatic separation in the process of recovering waste printed circuit boards.

Science.gov (United States)

Li, Jia; Zhou, Quan; Xu, Zhenming

2014-12-01

Although corona electrostatic separation is successfully used in recycling waste printed circuit boards in industrial applications, there are problems that cannot be resolved completely, such as nonmetal particle aggregation and spark discharge. Both of these problems damage the process of separation and are not easy to identify during the process of separation in industrial applications. This paper provides a systematic study on a real-time monitoring system. Weight monitoring systems were established to continuously monitor the separation process. A Virtual Instrumentation program written by LabVIEW was utilized to sample and analyse the mass increment of the middling product. It includes four modules: historical data storage, steady-state analysis, data computing and alarm. Three kinds of operating conditions were used to verify the applicability of the monitoring system. It was found that the system achieved the goal of monitoring during the separation process and realized the function of real-time analysis of the received data. The system also gave comprehensible feedback on the accidents of material blockages in the feed inlet and high-voltage spark discharge. With the warning function of the alarm system, the whole monitoring system could save the human cost and help the new technology to be more easily applied in industry. © The Author(s) 2014.

Comprehensive characterization of printed circuit boards of various end-of-life electrical and electronic equipment for beneficiation investigation.

Science.gov (United States)

Anshu Priya; Hait, Subrata

2018-05-01

Comprehensive characterization of printed circuit board (PCB) of end-of-life electrical and electronic equipment (EEE) is obligatory for prospective profitable beneficiation. In this study, beneficiation oriented comprehensive characterization of two brands of PCBs each of 16 end-of-life EEE was conducted in terms of their physicochemical characteristics with special emphasis on the content of 16 general elements, 2 precious metals and 15 rare earth elements (REEs). General elements and their highest weight percent composition found in different PCBs of the EEEs were Cu (23% in laptop), Al (6% in computer), Pb (15% in DVD player) and Ba (7% in TV). The high abundant of precious metals such as Au (316 g/ton) and Ag (636 g/ton) in mobile phone and laptop, respectively coupled with rapid obsolescence age makes waste PCBs of information technology and telecommunication equipment the most potent resource reservoir. Additionally, most of the waste PCBs were observed to contain REEs in considerable quantity with Sc up to 31 g/ton and Ce up to 13 g/ton being the major constituents. Comprehensive characterization of waste PCBs therefore will systematically help towards better understanding of e-waste recycling processes for beneficiation purpose and sustainable resource circulation and conservation. Copyright © 2018 Elsevier Ltd. All rights reserved.

Disassembly and physical separation of electric/electronic components layered in printed circuit boards (PCB).

Science.gov (United States)

Lee, Jaeryeong; Kim, Youngjin; Lee, Jae-chun

2012-11-30

Although printed circuit boards (PCBs) contain various elements, only the major elements (i.e., those with content levels in wt% or over grade) of and precious metals (e.g., Ag, Au, and platinum groups) contained within PCBs can be recycled. To recover other elements from PCBs, the PCBs should be properly disassembled as the first step of the recycling process. The recovery of these other elements would be beneficial for efforts to conserve scarce resources, reuse electric/electronic components (EECs), and eliminate environmental problems. This paper examines the disassembly of EECs from wasted PCBs (WPCBs) and the physical separation of these EECs using a self-designed disassembling apparatus and a 3-step separation process of sieving, magnetic separation, and dense medium separation. The disassembling efficiencies were evaluated by using the ratio of grinding area (E(area)) and the weight ratio of the detached EECs (E(weight)). In the disassembly treatment, these efficiencies were improved with an increase of grinder speed and grinder height. 97.7% (E(area)) and 98% (E(weight)) could be accomplished ultimately by 3 repetitive treatments at a grinder speed of 5500 rpm and a grinder height of 1.5mm. Through a series of physical separations, most groups of the EECs (except for the diode, transistor, and IC chip groups) could be sorted at a relatively high separation efficiency of about 75% or more. To evaluate the separation efficiency with regard to the elemental composition, the distribution ratio (R(dis)) and the concentration ratio (R(conc)) were used. 15 elements could be separated with the highest R(dis) and R(conc) in the same separated division. This result implies that the recyclability of the elements is highly feasible, even though the initial content in EECs is lower than several tens of mg/kg. Copyright © 2012 Elsevier B.V. All rights reserved.

Theory of wire number scaling in wire-array Z pinches

International Nuclear Information System (INIS)

Desjarlais, M.P.; Marder, B.M.

1999-01-01

Pulsed-power-driven Z pinches, produced by imploding cylindrical arrays of many wires, have generated very high x-ray radiation powers (>200 TW) and energies (2 MJ). Experiments have revealed a steady improvement in Z-pinch performance with increasing wire number at fixed total mass and array radius. The dominant mechanism acting to limit the performance of these devices is believed to be the Rayleigh-Taylor instability which broadens the radially imploding plasma sheath and consequently reduces the peak radiation power. A model is presented which describes an amplification over the two-dimensional Rayleigh-Taylor growth rate brought about by kink-like forces on the individual wires. This amplification factor goes to zero as the number of wires approaches infinity. This model gives results which are in good agreement with the experimental data and provides a scaling for wire-array Z pinches. copyright 1999 American Institute of Physics

Recycling of non-metallic fractions from waste printed circuit boards: A review

International Nuclear Information System (INIS)

Guo Jiuyong; Guo Jie; Xu Zhenming

2009-01-01

The major economic driving force for recycling of waste printed circuit boards (PCBs) is the value of the metallic fractions (MFs) of PCBs. The non-metallic fractions (NMFs), which take up almost 70 wt% of waste PCBs, were treated by combustion or land filling in the past. However, combustion of the NMFs will cause the formation of highly toxic polybrominated dibenzodioxins and dibenzofurans (PBDD/Fs) while land filling of the NMFs will lead to secondary pollution caused by heavy metals and brominated flame retardants (BFRs) leaching to the groundwater. Therefore, recycling of the NMFs from waste PCBs is drawing more and more attention from the public and the governments. Currently, how to recycle the NMFs environmental soundly has become a significant topic in recycling of waste PCBs. In order to fulfill the better resource utilization of the NMFs, the compositions and characteristics of the NMFs, methods and outcomes of recycling the NMFs from waste PCBs and analysis and treatment for the hazardous substances contained in the NMFs were reviewed in this paper. Thermosetting resin matrix composites, thermoplastic matrix composites, concrete and viscoelastic materials are main applications for physical recycling of the NMFs. Chemical recycling methods consisting of pyrolysis, gasification, supercritical fluids depolymerization and hydrogenolytic degradation can be used to convert the NMFs to chemical feedstocks and fuels. The toxicity characteristic leaching procedure (TCLP) and synthetic precipitation leaching procedure (SPLP) can be used to determine the toxicity characteristic (TC) of the NMFs and to evaluate the environmental safety of products made from the recycled NMFs. It is believed that physical recycling of the NMFs has been a promising recycling method. Much more work should be done to develop comprehensive and industrialized usage of the NMFs recycled by physical methods. Chemical recycling methods have the advantages in eliminating hazardous substances

Recycling of non-metallic fractions from waste printed circuit boards: A review

Energy Technology Data Exchange (ETDEWEB)

Guo Jiuyong; Guo Jie [School of Environmental Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240 (China); Xu Zhenming, E-mail: zmxu@sjtu.edu.cn [School of Environmental Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240 (China)

2009-09-15

The major economic driving force for recycling of waste printed circuit boards (PCBs) is the value of the metallic fractions (MFs) of PCBs. The non-metallic fractions (NMFs), which take up almost 70 wt% of waste PCBs, were treated by combustion or land filling in the past. However, combustion of the NMFs will cause the formation of highly toxic polybrominated dibenzodioxins and dibenzofurans (PBDD/Fs) while land filling of the NMFs will lead to secondary pollution caused by heavy metals and brominated flame retardants (BFRs) leaching to the groundwater. Therefore, recycling of the NMFs from waste PCBs is drawing more and more attention from the public and the governments. Currently, how to recycle the NMFs environmental soundly has become a significant topic in recycling of waste PCBs. In order to fulfill the better resource utilization of the NMFs, the compositions and characteristics of the NMFs, methods and outcomes of recycling the NMFs from waste PCBs and analysis and treatment for the hazardous substances contained in the NMFs were reviewed in this paper. Thermosetting resin matrix composites, thermoplastic matrix composites, concrete and viscoelastic materials are main applications for physical recycling of the NMFs. Chemical recycling methods consisting of pyrolysis, gasification, supercritical fluids depolymerization and hydrogenolytic degradation can be used to convert the NMFs to chemical feedstocks and fuels. The toxicity characteristic leaching procedure (TCLP) and synthetic precipitation leaching procedure (SPLP) can be used to determine the toxicity characteristic (TC) of the NMFs and to evaluate the environmental safety of products made from the recycled NMFs. It is believed that physical recycling of the NMFs has been a promising recycling method. Much more work should be done to develop comprehensive and industrialized usage of the NMFs recycled by physical methods. Chemical recycling methods have the advantages in eliminating hazardous substances

A Novel Portable Absolute Transient Hot-Wire Instrument for the Measurement of the Thermal Conductivity of Solids

Science.gov (United States)

Assael, Marc J.; Antoniadis, Konstantinos D.; Metaxa, Ifigeneia N.; Mylona, Sofia K.; Assael, John-Alexander M.; Wu, Jiangtao; Hu, Miaomiao

2015-11-01

A new portable absolute Transient Hot-Wire instrument for measuring the thermal conductivity of solids over a range of 0.2 { W}{\\cdot }m^{-1}{\\cdot }{K}^{-1} to 4 { W}{\\cdot }m^{-1}{\\cdot }{K}^{-1} is presented. The new instrument is characterized by three novelties: (a) an innovative two-wires sensor which provides robustness and portability, while at the same time employs a soft silicone layer to eliminate the effect of the contact resistance between the wires and the sample, (b) a newly designed compact portable printed electronic board employing an FPGA architecture CPU to the control output voltage and data processing—the new board replaces the traditional, large in size Wheatstone-type bridge system required to perform the experimental measurements, and (c) a cutting-edge software suite, developed for the mesh describing the structure of the sensor, and utilizing the Finite Elements Method to model the heat flow. The estimation of thermal conductivity is modeled as a minimization problem and is solved using Bayesian Optimization. Our revolutionizing proposed methodology exhibits radical speedups of up to × 120, compared to previous approaches, and considerably reduces the number of simulations performed, achieving convergence only in a few minutes. The new instrument was successfully employed to measure, at room temperature, the thermal conductivity of two thermal conductivity reference materials, Pyroceram 9606 and Pyrex 7740, and two possible candidate glassy solids, PMMA and BK7, with an absolute low uncertainty of 2 %.

Dual wire welding torch and method

Science.gov (United States)

Diez, Fernando Martinez; Stump, Kevin S.; Ludewig, Howard W.; Kilty, Alan L.; Robinson, Matthew M.; Egland, Keith M.

2009-04-28

A welding torch includes a nozzle with a first welding wire guide configured to orient a first welding wire in a first welding wire orientation, and a second welding wire guide configured to orient a second welding wire in a second welding wire orientation that is non-coplanar and divergent with respect to the first welding wire orientation. A method of welding includes moving a welding torch with respect to a workpiece joint to be welded. During moving the welding torch, a first welding wire is fed through a first welding wire guide defining a first welding wire orientation and a second welding wire is fed through a second welding wire guide defining a second welding wire orientation that is divergent and non-coplanar with respect to the first welding wire orientation.

One century of Kirschner wires and Kirschner wire insertion techniques : A historical review

NARCIS (Netherlands)

Franssen, Bas B. G. M.; Schuurman, Arnold H.; Van der Molen, Aebele Mink; Kon, Moshe

A century ago, in 1909, Martin Kirschner (1879-942) introduced a smooth pin, presently known as the Kirschner wire (K-wire). The K-wire was initiallly used for skeletal traction and is now currently used for many different goals. The development of the K-wire and its insertion devices were mainly

Characterization of a piezoelectric MEMS actuator surface toward motion-enabled reconfigurable RF circuits

Science.gov (United States)

Tellers, M. C.; Pulskamp, J. S.; Bedair, S. S.; Rudy, R. Q.; Kierzewski, I. M.; Polcawich, R. G.; Bergbreiter, S. E.

2018-03-01

As an alternative to highly constrained hard-wired reconfigurable RF circuits, a motion-enabled reconfigurable circuit (MERC) offers freedom from transmission line losses and homogeneous materials selection. The creation of a successful MERC requires a precise mechanical mechanism for relocating components. In this work, a piezoelectric MEMS actuator array is modeled and experimentally characterized to assess its viability as a solution to the MERC concept. Actuation and design parameters are evaluated, and the repeatability of high quality on-axis motion at greater than 1 mm s-1 is demonstrated with little positional error. Finally, an initial proof-of-concept circuit reconfiguration has been demonstrated using off-the-shelf RF filter components. Although initial feasibility tests show filter performance degradation with an additional insertion loss of 0.3 dB per contact, out-of-band rejection degradation as high as 10 dB, and ripple performance reduction from 0.25 dB to 1.5 dB, MERC is proven here as an alternative to traditional approaches used in reconfigurable RF circuit applications.

Conversion of electromagnetic energy in Z-pinch process of single planar wire arrays at 1.5 MA

International Nuclear Information System (INIS)

Liangping, Wang; Mo, Li; Juanjuan, Han; Ning, Guo; Jian, Wu; Aici, Qiu

2014-01-01

The electromagnetic energy conversion in the Z-pinch process of single planar wire arrays was studied on Qiangguang generator (1.5 MA, 100 ns). Electrical diagnostics were established to monitor the voltage of the cathode-anode gap and the load current for calculating the electromagnetic energy. Lumped-element circuit model of wire arrays was employed to analyze the electromagnetic energy conversion. Inductance as well as resistance of a wire array during the Z-pinch process was also investigated. Experimental data indicate that the electromagnetic energy is mainly converted to magnetic energy and kinetic energy and ohmic heating energy can be neglected before the final stagnation. The kinetic energy can be responsible for the x-ray radiation before the peak power. After the stagnation, the electromagnetic energy coupled by the load continues increasing and the resistance of the load achieves its maximum of 0.6–1.0 Ω in about 10–20 ns

Integrated Circuit Electromagnetic Immunity Handbook

Science.gov (United States)

Sketoe, J. G.

2000-08-01

This handbook presents the results of the Boeing Company effort for NASA under contract NAS8-98217. Immunity level data for certain integrated circuit parts are discussed herein, along with analytical techniques for applying the data to electronics systems. This handbook is built heavily on the one produced in the seventies by McDonnell Douglas Astronautics Company (MDAC, MDC Report E1929 of 1 August 1978, entitled Integrated Circuit Electromagnetic Susceptibility Handbook, known commonly as the ICES Handbook, which has served countless systems designers for over 20 years). Sections 2 and 3 supplement the device susceptibility data presented in section 4 by presenting information on related material required to use the IC susceptibility information. Section 2 concerns itself with electromagnetic susceptibility analysis and serves as a guide in using the information contained in the rest of the handbook. A suggested system hardening requirements is presented in this chapter. Section 3 briefly discusses coupling and shielding considerations. For conservatism and simplicity, a worst case approach is advocated to determine the maximum amount of RF power picked up from a given field. This handbook expands the scope of the immunity data in this Handbook is to of 10 MHz to 10 GHz. However, the analytical techniques provided are applicable to much higher frequencies as well. It is expected however, that the upper frequency limit of concern is near 10 GHz. This is due to two factors; the pickup of microwave energy on system cables and wiring falls off as the square of the wavelength, and component response falls off at a rapid rate due to the effects of parasitic shunt paths for the RF energy. It should be noted also that the pickup on wires and cables does not approach infinity as the frequency decreases (as would be expected by extrapolating the square law dependence of the high frequency roll-off to lower frequencies) but levels off due to mismatch effects.

Integrated optoelectronic materials and circuits for optical interconnects

International Nuclear Information System (INIS)

Hutcheson, L.D.

1988-01-01

Conventional interconnect and switching technology is rapidly becoming a critical issue in the realization of systems using high speed silicon and GaAs based technologies. In recent years clock speeds and on-chip density for VLSI/VHSIC technology has made packaging these high speed chips extremely difficult. A strong case can be made for using optical interconnects for on-chip/on-wafer, chip-to-chip and board-to-board high speed communications. GaAs integrated optoelectronic circuits (IOC's) are being developed in a number of laboratories for performing Input/Output functions at all levels. In this paper integrated optoelectronic materials, electronics and optoelectronic devices are presented. IOC's are examined from the standpoint of what it takes to fabricate the devices and what performance can be expected

Method of forming electronically conducting polymers on conducting and nonconducting substrates

Science.gov (United States)

Murphy, Oliver J. (Inventor); Hitchens, G. Duncan (Inventor); Hodko, Dalibor (Inventor); Clarke, Eric T. (Inventor); Miller, David L. (Inventor); Parker, Donald L. (Inventor)

2001-01-01

The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include photoinitiators, flexibilizers, solvents and the like. These solutions can be used in applications including printed circuit boards and through-hole plating and enable direct metallization processes on non-conducting substrates. After forming the conductive polymer patterns, a printed wiring board can be formed by sensitizing the polymer with palladium and electrolytically depositing copper.

Minimum depth of investigation for grounded-wire TEM due to self-transients

Science.gov (United States)

Zhou, Nannan; Xue, Guoqiang

2018-05-01

The grounded-wire transient electromagnetic method (TEM) has been widely used for near-surface metalliferous prospecting, oil and gas exploration, and hydrogeological surveying in the subsurface. However, it is commonly observed that such TEM signal is contaminated by the self-transient process occurred at the early stage of data acquisition. Correspondingly, there exists a minimum depth of investigation, above which the observed signal is not applicable for reliable data processing and interpretation. Therefore, for achieving a more comprehensive understanding of the TEM method, it is necessary to perform research on the self-transient process and moreover develop an approach for quantifying the minimum detection depth. In this paper, we first analyze the temporal procedure of the equivalent circuit of the TEM method and present a theoretical equation for estimating the self-induction voltage based on the inductor of the transmitting wire. Then, numerical modeling is applied for building the relationship between the minimum depth of investigation and various properties, including resistivity of the earth, offset, and source length. It is guide for the design of survey parameters when the grounded-wire TEM is applied to the shallow detection. Finally, it is verified through applications to a coal field in China.

Optoelectronic circuits in nanometer CMOS technology

CERN Document Server

Atef, Mohamed

2016-01-01

This book describes the newest implementations of integrated photodiodes fabricated in nanometer standard CMOS technologies. It also includes the required fundamentals, the state-of-the-art, and the design of high-performance laser drivers, transimpedance amplifiers, equalizers, and limiting amplifiers fabricated in nanometer CMOS technologies. This book shows the newest results for the performance of integrated optical receivers, laser drivers, modulator drivers and optical sensors in nanometer standard CMOS technologies. Nanometer CMOS technologies rapidly advanced, enabling the implementation of integrated optical receivers for high data rates of several Giga-bits per second and of high-pixel count optical imagers and sensors. In particular, low cost silicon CMOS optoelectronic integrated circuits became very attractive because they can be extensively applied to short-distance optical communications, such as local area network, chip-to-chip and board-to-board interconnects as well as to imaging and medical...

Quantum interference and manipulation of entanglement in silicon wire waveguide quantum circuits

International Nuclear Information System (INIS)

Bonneau, D; Engin, E; O'Brien, J L; Thompson, M G; Ohira, K; Suzuki, N; Yoshida, H; Iizuka, N; Ezaki, M; Natarajan, C M; Tanner, M G; Hadfield, R H; Dorenbos, S N; Zwiller, V

2012-01-01

Integrated quantum photonic waveguide circuits are a promising approach to realizing future photonic quantum technologies. Here, we present an integrated photonic quantum technology platform utilizing the silicon-on-insulator material system, where quantum interference and the manipulation of quantum states of light are demonstrated in components orders of magnitude smaller than previous implementations. Two-photon quantum interference is presented in a multi-mode interference coupler, and the manipulation of entanglement is demonstrated in a Mach-Zehnder interferometer, opening the way to an all-silicon photonic quantum technology platform. (paper)

Reliability Criteria for Thick Bonding Wire.

Science.gov (United States)

Dagdelen, Turker; Abdel-Rahman, Eihab; Yavuz, Mustafa

2018-04-17

Bonding wire is one of the main interconnection techniques. Thick bonding wire is widely used in power modules and other high power applications. This study examined the case for extending the use of traditional thin wire reliability criteria, namely wire flexure and aspect ratio, to thick wires. Eleven aluminum (Al) and aluminum coated copper (CucorAl) wire samples with diameter 300 μm were tested experimentally. The wire response was measured using a novel non-contact method. High fidelity FEM models of the wire were developed and validated. We found that wire flexure is not correlated to its stress state or fatigue life. On the other hand, aspect ratio is a consistent criterion of thick wire fatigue life. Increasing the wire aspect ratio lowers its critical stress and increases its fatigue life. Moreover, we found that CucorAl wire has superior performance and longer fatigue life than Al wire.

Reliability Criteria for Thick Bonding Wire

Science.gov (United States)

Yavuz, Mustafa

2018-01-01

Bonding wire is one of the main interconnection techniques. Thick bonding wire is widely used in power modules and other high power applications. This study examined the case for extending the use of traditional thin wire reliability criteria, namely wire flexure and aspect ratio, to thick wires. Eleven aluminum (Al) and aluminum coated copper (CucorAl) wire samples with diameter 300 μm were tested experimentally. The wire response was measured using a novel non-contact method. High fidelity FEM models of the wire were developed and validated. We found that wire flexure is not correlated to its stress state or fatigue life. On the other hand, aspect ratio is a consistent criterion of thick wire fatigue life. Increasing the wire aspect ratio lowers its critical stress and increases its fatigue life. Moreover, we found that CucorAl wire has superior performance and longer fatigue life than Al wire. PMID:29673194

Integrated mechanisms of anticipation and rate-of-change computations in cortical circuits.

Directory of Open Access Journals (Sweden)

Gabriel D Puccini

2007-05-01

Full Text Available Local neocortical circuits are characterized by stereotypical physiological and structural features that subserve generic computational operations. These basic computations of the cortical microcircuit emerge through the interplay of neuronal connectivity, cellular intrinsic properties, and synaptic plasticity dynamics. How these interacting mechanisms generate specific computational operations in the cortical circuit remains largely unknown. Here, we identify the neurophysiological basis of both the rate of change and anticipation computations on synaptic inputs in a cortical circuit. Through biophysically realistic computer simulations and neuronal recordings, we show that the rate-of-change computation is operated robustly in cortical networks through the combination of two ubiquitous brain mechanisms: short-term synaptic depression and spike-frequency adaptation. We then show how this rate-of-change circuit can be embedded in a convergently connected network to anticipate temporally incoming synaptic inputs, in quantitative agreement with experimental findings on anticipatory responses to moving stimuli in the primary visual cortex. Given the robustness of the mechanism and the widespread nature of the physiological machinery involved, we suggest that rate-of-change computation and temporal anticipation are principal, hard-wired functions of neural information processing in the cortical microcircuit.

Heat management in integrated circuits on-chip and system-level monitoring and cooling

CERN Document Server

Ogrenci-Memik, Seda

2016-01-01

This essential overview covers the subject of thermal monitoring and management in integrated circuits. Specifically, it focuses on devices and materials that are intimately integrated on-chip (as opposed to in-package or on-board) for the purposes of thermal monitoring and thermal management.

Reliability Criteria for Thick Bonding Wire

Directory of Open Access Journals (Sweden)

Turker Dagdelen

2018-04-01

Full Text Available Bonding wire is one of the main interconnection techniques. Thick bonding wire is widely used in power modules and other high power applications. This study examined the case for extending the use of traditional thin wire reliability criteria, namely wire flexure and aspect ratio, to thick wires. Eleven aluminum (Al and aluminum coated copper (CucorAl wire samples with diameter 300 μm were tested experimentally. The wire response was measured using a novel non-contact method. High fidelity FEM models of the wire were developed and validated. We found that wire flexure is not correlated to its stress state or fatigue life. On the other hand, aspect ratio is a consistent criterion of thick wire fatigue life. Increasing the wire aspect ratio lowers its critical stress and increases its fatigue life. Moreover, we found that CucorAl wire has superior performance and longer fatigue life than Al wire.

Single OR molecule and OR atomic circuit logic gates interconnected on a Si(100)H surface

International Nuclear Information System (INIS)

Ample, F; Joachim, C; Duchemin, I; Hliwa, M

2011-01-01

Electron transport calculations were carried out for three terminal OR logic gates constructed either with a single molecule or with a surface dangling bond circuit interconnected on a Si(100)H surface. The corresponding multi-electrode multi-channel scattering matrix (where the central three terminal junction OR gate is the scattering center) was calculated, taking into account the electronic structure of the supporting Si(100)H surface, the metallic interconnection nano-pads, the surface atomic wires and the molecule. Well interconnected, an optimized OR molecule can only run at a maximum of 10 nA output current intensity for a 0.5 V bias voltage. For the same voltage and with no molecule in the circuit, the output current of an OR surface atomic scale circuit can reach 4 μA.

Random On-Board Pixel Sampling (ROPS) X-Ray Camera

Energy Technology Data Exchange (ETDEWEB)

Wang, Zhehui [Los Alamos; Iaroshenko, O. [Los Alamos; Li, S. [Los Alamos; Liu, T. [Fermilab; Parab, N. [Argonne (main); Chen, W. W. [Purdue U.; Chu, P. [Los Alamos; Kenyon, G. [Los Alamos; Lipton, R. [Fermilab; Sun, K.-X. [Nevada U., Las Vegas

2017-09-25

Recent advances in compressed sensing theory and algorithms offer new possibilities for high-speed X-ray camera design. In many CMOS cameras, each pixel has an independent on-board circuit that includes an amplifier, noise rejection, signal shaper, an analog-to-digital converter (ADC), and optional in-pixel storage. When X-ray images are sparse, i.e., when one of the following cases is true: (a.) The number of pixels with true X-ray hits is much smaller than the total number of pixels; (b.) The X-ray information is redundant; or (c.) Some prior knowledge about the X-ray images exists, sparse sampling may be allowed. Here we first illustrate the feasibility of random on-board pixel sampling (ROPS) using an existing set of X-ray images, followed by a discussion about signal to noise as a function of pixel size. Next, we describe a possible circuit architecture to achieve random pixel access and in-pixel storage. The combination of a multilayer architecture, sparse on-chip sampling, and computational image techniques, is expected to facilitate the development and applications of high-speed X-ray camera technology.

Wirelessly powered microfluidic dielectrophoresis devices using printable RF circuits.

Science.gov (United States)

Qiao, Wen; Cho, Gyoujin; Lo, Yu-Hwa

2011-03-21

We report the first microfluidic device integrated with a printed RF circuit so the device can be wirelessly powered by a commercially available RFID reader. For conventional dielectrophoresis devices, electrical wires are needed to connect the electric components on the microchip to external equipment such as power supplies, amplifiers, function generators, etc. Such a procedure is unfamiliar to most clinicians and pathologists who are used to working with a microscope for examination of samples on microscope slides. The wirelessly powered device reported here eliminates the entire need for wire attachments and external instruments so the operators can use the device in essentially the same manner as they do with microscope slides. The integrated circuit can be fabricated on a flexible plastic substrate at very low cost using a roll-to-roll printing method. Electrical power at 13.56 MHz transmitted by a radio-frequency identification (RFID) reader is inductively coupled to the printed RFIC and converted into 10 V DC (direct current) output, which provides sufficient power to drive a microfluidic device to manipulate biological particles such as beads and proteins via the DC dielectrophoresis (DC-DEP) effect. To our best knowledge, this is the first wirelessly powered microfluidic dielectrophoresis device. Although the work is preliminary, the device concept, the architecture, and the core technology are expected to stimulate many efforts in the future and transform the technology to a wide range of clinical and point-of-care applications. This journal is © The Royal Society of Chemistry 2011

1998 wire development workshop proceedings

Energy Technology Data Exchange (ETDEWEB)

NONE

1998-04-01

This report consists of vugraphs of the presentations at the conference. The conference was divided into the following sessions: (1) First Generation Wire Development: Status and Issues; (2) First Generation Wire in Pre-Commercial Prototypes; (3) Second Generation Wire Development: Private Sector Progress and Issues; (4) Second Generation Wire Development: Federal Laboratories; and (5) Fundamental Research Issues for HTS Wire Development.

1998 wire development workshop proceedings

International Nuclear Information System (INIS)

1998-04-01

This report consists of vugraphs of the presentations at the conference. The conference was divided into the following sessions: (1) First Generation Wire Development: Status and Issues; (2) First Generation Wire in Pre-Commercial Prototypes; (3) Second Generation Wire Development: Private Sector Progress and Issues; (4) Second Generation Wire Development: Federal Laboratories; and (5) Fundamental Research Issues for HTS Wire Development

Influence of stress and phase on corrosion of a superelastic nickel-titanium orthodontic wire.

Science.gov (United States)

Segal, Nadav; Hell, Jess; Berzins, David W

2009-06-01

The purpose of this investigation was to study the effect of stress and phase transformation on the corrosion properties of a superelastic nickel-titanium orthodontic wire. The phase transformation profiles of superelastic nickel-titanium (Sentalloy, GAC International, Bohemia, NY) and beta-titanium (TMA, Ormco, Orange, Calif) archwires were analyzed by using differential scanning calorimetry. The force/deflection behavior of the wires at 37 degrees C was measured in a 3-point bending test per modified American Dental Association specification no. 32. Electrochemical testing consisted of monitoring the open circuit potential (OCP) for 2 hours followed by polarization resistance and cyclic polarization tests on archwire segments engaged in a 5-bracket simulation apparatus with bend deflections of 0.75, 1.5, or 3 mm in artificial saliva at 37 degrees C. Nondeflected segments were also tested. Sentalloy was additionally examined for bending and corrosion at 5 degrees C, where it exists as martensite and is devoid of stress-induced phase transformation. OCP at 2 hours and corrosion current density (i(corr)) were analyzed by using ANOVA and Tukey tests (alpha = .05) (n = 10 per deflection). Significant differences (P Sentalloy wires at 5 degrees C, but not for Sentalloy at 37 degrees C. Significant differences (P Sentalloy (37 degrees C) peaked at 0.75 mm deflection before the wire's stress-induced phase transformation point and then decreased with further deflection and transformation. The i(corr) values for TMA and Sentalloy at 5 degrees C, both of which do not undergo phase transformation with deformation, continuously increased from 0 to 1.5 mm deflection before decreasing at the 3.0-mm deflection. Stress increased the corrosion rate in nickel-titanium and beta-titanium orthodontic wires. Alterations in stress/strain associated with phase transformation in superelastic nickel-titanium might alter the corrosion rate in ways different from wires not undergoing phase

Parameter Identification for Nonlinear Circuit Models of Power BAW Resonator

Directory of Open Access Journals (Sweden)

CONSTANTINESCU, F.

2011-02-01

Full Text Available The large signal operation of the bulk acoustic wave (BAW resonators is characterized by the amplitude-frequency effect and the intermodulation effect. The measurement of these effects, together with that of the small signal frequency characteristic, are used in this paper for the parameter identification of the nonlinear circuit models developed previously by authors. As the resonator has been connected to the measurement bench by wire bonding, the parasitic elements of this connection have been taken into account, being estimated solving some electrical and magnetic field problems.

Right wire in orthodontics: a review

OpenAIRE

Ali, Hashim

2015-01-01

Quality of orthodontic wire such as stiffness, hardness, resiliency, elasticity and working range are important determinants of the effectivenes of tooth movement. Commonly used types of orthodontic arch wire:1) stainless steel(ss) wire, 2) conventional nickel- titanium (NiTi)alloy wire,3) improved super elastic NiTi- alloy wire( also called low hysteresis(LH)wire), and titanium molybdenum alloy(TMA) wire.

Application of irradiated wire

International Nuclear Information System (INIS)

Uda, I.; Kozima, K.; Suzuki, S.; Tada, S.; Torisu, S.; Veno, K.

1984-01-01

Rubber insulated wires are still useful for internal wiring in motor vehicles and electrical equipment because of flexibility and toughness. Irradiated cross-linked rubber materials have been successfully introduced for use with fusible link wire and helically coiled cord

Modelling on c-Si/a-Si:H wire solar cells: some key parameters to optimize the photovoltaic performance

Directory of Open Access Journals (Sweden)

Alvarez J.

2012-07-01

Full Text Available Solar cells based on silicon nano- or micro-wires have attracted much attention as a promising path for low cost photovoltaic technology. The key point of this structure is the decoupling of the light absorption from the carriers collection. In order to predict and optimize the performance potential of p- (or n- doped c-Si/ n-(or p- doped a-Si:H nanowire-based solar cells, we have used the Silvaco-Atlas software to model a single-wire device. In particular, we have noticed a drastic decrease of the open-circuit voltage (Voc when increasing the doping density of the silicon core beyond an optimum value. We present here a detailed study of the parameters that can alter the Voc of c-Si(p/a-Si:H (n wires according to the doping density in c-Si. A comparison with simulation results obtained on planar c-Si/a-Si:H heterojunctions shows that the drop in Voc, linked to an increase of the dark current in both structures, is more pronounced for radial junctions due to geometric criteria. These numerical modelling results have lead to a better understanding of transport phenomena within the wire.

Advanced field-solver techniques for RC extraction of integrated circuits

CERN Document Server

Yu, Wenjian

2014-01-01

Resistance and capacitance (RC) extraction is an essential step in modeling the interconnection wires and substrate coupling effect in nanometer-technology integrated circuits (IC). The field-solver techniques for RC extraction guarantee the accuracy of modeling, and are becoming increasingly important in meeting the demand for accurate modeling and simulation of VLSI designs. Advanced Field-Solver Techniques for RC Extraction of Integrated Circuits presents a systematic introduction to, and treatment of, the key field-solver methods for RC extraction of VLSI interconnects and substrate coupling in mixed-signal ICs. Various field-solver techniques are explained in detail, with real-world examples to illustrate the advantages and disadvantages of each algorithm. This book will benefit graduate students and researchers in the field of electrical and computer engineering, as well as engineers working in the IC design and design automation industries. Dr. Wenjian Yu is an Associate Professor at the Department of ...

Effect of discrete wires on the implosion dynamics of wire array Z pinches

International Nuclear Information System (INIS)

Lebedev, S. V.; Beg, F. N.; Bland, S. N.; Chittenden, J. P.; Dangor, A. E.; Haines, M. G.; Kwek, K. H.; Pikuz, S. A.; Shelkovenko, T. A.

2001-01-01

A phenomenological model of wire array Z-pinch implosions, based on the analysis of experimental data obtained on the mega-ampere generator for plasma implosion experiments (MAGPIE) generator [I. H. Mitchell , Rev. Sci. Instrum. 67, 1533 (1996)], is described. The data show that during the first ∼80% of the implosion the wire cores remain stationary in their initial positions, while the coronal plasma is continuously jetting from the wire cores to the array axis. This phase ends by the formation of gaps in the wire cores, which occurs due to the nonuniformity of the ablation rate along the wires. The final phase of the implosion starting at this time occurs as a rapid snowplow-like implosion of the radially distributed precursor plasma, previously injected in the interior of the array. The density distribution of the precursor plasma, being peaked on the array axis, could be a key factor providing stability of the wire array implosions operating in the regime of discrete wires. The modified ''initial'' conditions for simulations of wire array Z-pinch implosions with one-dimension (1D) and two-dimensions (2D) in the r--z plane, radiation-magnetohydrodynamic (MHD) codes, and a possible scaling to a larger drive current are discussed

Eco-friendly copper recovery process from waste printed circuit boards using Fe{sup 3+}/Fe{sup 2+} redox system

Energy Technology Data Exchange (ETDEWEB)

Fogarasi, Szabolcs [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Imre-Lucaci, Florica [Babeş-Bolyai University, Interdisciplinary Research Institute on Bio-Nano-Sciences, 42 Treboniu Laurian Street, Cluj-Napoca RO-400271 (Romania); Egedy, Attila [University of Pannonia, Department of Process Engineering, Egyetem Str. 10, H-8200 Veszprém (Hungary); Imre-Lucaci, Árpád, E-mail: aimre@chem.ubbcluj.ro [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Ilea, Petru [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania)

2015-06-15

Highlights: • We developed an ecofriendly mediated electrochemical process for copper recovery. • The recovery of copper was achieved without mechanical pretreatment of the samples. • We identified the optimal flow rate for the leaching and electrowinning of copper. • The copper content of the obtained cathodic deposits was over 99.9%. - Abstract: The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe{sup 3+} combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%.

Application of vacuum metallurgy to separate pure metal from mixed metallic particles of crushed waste printed circuit board scraps.

Science.gov (United States)

Zhan, Lu; Xu, Zhenming

2008-10-15

The principle of separating pure metal from mixed metallic particles (MMPs) byvacuum metallurgy is that the vapor pressures of various metals at the same temperature are different As a result, the metal with high vapor pressure and low boiling point can be separated from the mixed metals through distillation or sublimation, and then it can be recycled through condensation under a certain condition. The vacuum metallurgy separation (VMS) of MMPs of crushed waste printed circuit boards (WPCBs) has been studied in this paper. Theoretical analyses show that the MMPs (copper, zinc, bismuth, lead, and indium, for example) can be separated by vacuum metallurgy. The copper particles (0.15-0.20 mm) and zinc particles (<0.30 mm) were chosen to simulate the MMPs of crushed WPCBs. Experimental results show that the separated efficiency of zinc in the copper-rich particles achieves 96.19 wt % when the vacuum pressure is 0.01-0.10 Pa, the heating temperature is 1123 K, and the heating time is 105 min. Under this operation condition, the separated efficiency of zinc in the copper-rich particles from crushed WPCBs achieves 97.00 wt % and the copper purity increases from 90.68 to 99.84 wt %.

SpaceWire- Based Control System Architecture for the Lightweight Advanced Robotic Arm Demonstrator [LARAD

Science.gov (United States)

Rucinski, Marek; Coates, Adam; Montano, Giuseppe; Allouis, Elie; Jameux, David

2015-09-01

The Lightweight Advanced Robotic Arm Demonstrator (LARAD) is a state-of-the-art, two-meter long robotic arm for planetary surface exploration currently being developed by a UK consortium led by Airbus Defence and Space Ltd under contract to the UK Space Agency (CREST-2 programme). LARAD has a modular design, which allows for experimentation with different electronics and control software. The control system architecture includes the on-board computer, control software and firmware, and the communication infrastructure (e.g. data links, switches) connecting on-board computer(s), sensors, actuators and the end-effector. The purpose of the control system is to operate the arm according to pre-defined performance requirements, monitoring its behaviour in real-time and performing safing/recovery actions in case of faults. This paper reports on the results of a recent study about the feasibility of the development and integration of a novel control system architecture for LARAD fully based on the SpaceWire protocol. The current control system architecture is based on the combination of two communication protocols, Ethernet and CAN. The new SpaceWire-based control system will allow for improved monitoring and telecommanding performance thanks to higher communication data rate, allowing for the adoption of advanced control schemes, potentially based on multiple vision sensors, and for the handling of sophisticated end-effectors that require fine control, such as science payloads or robotic hands.

Wire core reactor for NTP

International Nuclear Information System (INIS)

Harty, R.B.

1991-01-01

The development of the wire core system for Nuclear Thermal Propulsion (NTP) that took place from 1963 to 1965 is discussed. A wire core consists of a fuel wire with spacer wires. It's an annular flow core having a central control rod. There are actually four of these, with beryllium solid reflectors on both ends and all the way around. Much of the information on the concept is given in viewgraph form. Viewgraphs are presented on design details of the wire core, the engine design, engine weight vs. thrust, a technique used to fabricate the wire fuel element, and axial temperature distribution

Analytical thermal modelling of multilayered active embedded chips into high density electronic board

Directory of Open Access Journals (Sweden)

Monier-Vinard Eric

2013-01-01

Full Text Available The recent Printed Wiring Board embedding technology is an attractive packaging alternative that allows a very high degree of miniaturization by stacking multiple layers of embedded chips. This disruptive technology will further increase the thermal management challenges by concentrating heat dissipation at the heart of the organic substrate structure. In order to allow the electronic designer to early analyze the limits of the power dissipation, depending on the embedded chip location inside the board, as well as the thermal interactions with other buried chips or surface mounted electronic components, an analytical thermal modelling approach was established. The presented work describes the comparison of the analytical model results with the numerical models of various embedded chips configurations. The thermal behaviour predictions of the analytical model, found to be within ±10% of relative error, demonstrate its relevance for modelling high density electronic board. Besides the approach promotes a practical solution to study the potential gain to conduct a part of heat flow from the components towards a set of localized cooled board pads.

Water Desalination with Wires

NARCIS (Netherlands)

Porada, S.; Sales, B.B.; Hamelers, H.V.M.; Biesheuvel, P.M.

2012-01-01

We show the significant potential of water desalination using a novel capacitive wire-based technology in which anode/cathode wire pairs are constructed from coating a thin porous carbon electrode layer on top of electrically conducting rods (or wires). By alternately dipping an array of electrode

Towards plant wires

OpenAIRE

Adamatzky, Andrew

2014-01-01

In experimental laboratory studies we evaluate a possibility of making electrical wires from living plants. In scoping experiments we use lettuce seedlings as a prototype model of a plant wire. We approximate an electrical potential transfer function by applying direct current voltage to the lettuce seedlings and recording output voltage. We analyse oscillation frequencies of the output potential and assess noise immunity of the plant wires. Our findings will be used in future designs of self...

Hybrid circuit prototypes for the CMS Tracker upgrade front-end electronics

International Nuclear Information System (INIS)

Blanchot, G; Honma, A; Kovacs, M; Braga, D; Raymond, M

2013-01-01

New high-density interconnect hybrid circuits are under development for the CMS tracker modules at the HL-LHC. These hybrids will provide module connectivity between flip-chip front-end ASICs, strip sensors and a service board for the data transmission and powering. Rigid organic-based substrate prototypes and also a flexible hybrid design have been built, containing up to eight front-end flip chip ASICs. A description of the function of the hybrid circuit in the tracker, the first prototype designs, results of some electrical and mechanical properties from the prototypes, and examples of the integration of the hybrids into detector modules are presented

Embedding electromagnetic band gap structures in printed circuit boards for electromagnetic interference reduction

NARCIS (Netherlands)

Tereshchenko, O.V.

2015-01-01

Due to the tendency of faster data rates and lower power supply voltage in the integrated circuit (IC) design, Simultaneously Switching Noise (SSN) and ground bounce become serious concerns for designers and testers. This noise can be a source of electromagnetic interference (EMI). It propagates

Evolution of cementite morphology in pearlitic steel wire during wet wire drawing

DEFF Research Database (Denmark)

Zhang, Xiaodan; Godfrey, Andrew; Hansen, Niels

2010-01-01

The evolution of the cementite phase during wet wire drawing of a pearlitic steel wire has been followed as a function of strain. Particular attention has been given to a quantitative characterization of changes in the alignment and in the dimensions of the cementite phase. Scanning electron...... microscope observations show that cementite plates become increasingly aligned with the wire axis as the drawing strain is increased. Measurements in the transmission electron microscope show that the cementite deforms plastically during wire drawing , with the average thickness of the cementite plates...... decreasing from 19 nm (ε = 0) to 2 nm (ε = 3.7) in correspondence with the reduction in wire diameter. The deformation of the cementite is strongly related to plastic deformation in the ferrite, with coarse slip steps, shear bands and cracks in the cementite plates/particles observed parallel to either {110...

Design and test of component circuits of an integrated quantum voltage noise source for Johnson noise thermometry

International Nuclear Information System (INIS)

Yamada, Takahiro; Maezawa, Masaaki; Urano, Chiharu

2015-01-01

Highlights: • We demonstrated RSFQ digital components of a new quantum voltage noise source. • A pseudo-random number generator and variable pulse number multiplier are designed. • Fabrication process is based on four Nb wiring layers and Nb/AlOx/Nb junctions. • The circuits successfully operated with wide dc bias current margins, 80–120%. - Abstract: We present design and testing of a pseudo-random number generator (PRNG) and a variable pulse number multiplier (VPNM) which are digital circuit subsystems in an integrated quantum voltage noise source for Jonson noise thermometry. Well-defined, calculable pseudo-random patterns of single flux quantum pulses are synthesized with the PRNG and multiplied digitally with the VPNM. The circuit implementation on rapid single flux quantum technology required practical circuit scales and bias currents, 279 junctions and 33 mA for the PRNG, and 1677 junctions and 218 mA for the VPNM. We confirmed the circuit operation with sufficiently wide margins, 80–120%, with respect to the designed bias currents.

Design and test of component circuits of an integrated quantum voltage noise source for Johnson noise thermometry

Energy Technology Data Exchange (ETDEWEB)

Yamada, Takahiro, E-mail: yamada-takahiro@aist.go.jp [Nanoelectronics Research Institute, National Institute of Advanced Industrial Science and Technology, Central 2, Umezono 1-1-1, Tsukuba, Ibaraki 305-8568 (Japan); Maezawa, Masaaki [Nanoelectronics Research Institute, National Institute of Advanced Industrial Science and Technology, Central 2, Umezono 1-1-1, Tsukuba, Ibaraki 305-8568 (Japan); Urano, Chiharu [National Metrology Institute of Japan, National Institute of Advanced Industrial Science and Technology, Central 3, Umezono 1-1-1, Tsukuba, Ibaraki 305-8563 (Japan)

2015-11-15

Highlights: • We demonstrated RSFQ digital components of a new quantum voltage noise source. • A pseudo-random number generator and variable pulse number multiplier are designed. • Fabrication process is based on four Nb wiring layers and Nb/AlOx/Nb junctions. • The circuits successfully operated with wide dc bias current margins, 80–120%. - Abstract: We present design and testing of a pseudo-random number generator (PRNG) and a variable pulse number multiplier (VPNM) which are digital circuit subsystems in an integrated quantum voltage noise source for Jonson noise thermometry. Well-defined, calculable pseudo-random patterns of single flux quantum pulses are synthesized with the PRNG and multiplied digitally with the VPNM. The circuit implementation on rapid single flux quantum technology required practical circuit scales and bias currents, 279 junctions and 33 mA for the PRNG, and 1677 junctions and 218 mA for the VPNM. We confirmed the circuit operation with sufficiently wide margins, 80–120%, with respect to the designed bias currents.

Glovebox with purification and pressure control of the neutral gas atmosphere in closed circuit

International Nuclear Information System (INIS)

Cadrot, J.

1990-01-01

In the gas main are placed 2 series of specific gas purifiers in parallel. Pressure is controlled with a buffer tank two three way solenoid value upstream and down stream a compressor and a supercharger. A checking board allows continuous monitoring of circuit tightness [fr

Bioleaching of Gold and Silver from Waste Printed Circuit Boards by Pseudomonas balearica SAE1 Isolated from an e-Waste Recycling Facility.

Science.gov (United States)

Kumar, Anil; Saini, Harvinder Singh; Kumar, Sudhir

2018-02-01

Indigenous bacterial strain Pseudomonas balearica SAE1, tolerant to e-waste toxicity was isolated from an e-waste recycling facility Exigo Recycling Pvt. Ltd., India. Toxicity tolerance of bacterial strain was analyzed using crushed (particle size ≤150 µm) waste computer printed circuit boards (PCBs)/liter (L) of culture medium. The EC 50 value for SAE1 was 325.7 g/L of the e-waste pulp density. Two-step bioleaching was then applied to achieve the dissolution of gold (Au) and silver (Ag) from the e-waste. To maximize precious metal dissolution, factors including pulp density, glycine concentration, pH level, and temperature were optimized. The optimization resulted in 68.5 and 33.8% of Au and Ag dissolution, respectively, at a pH of 9.0, a pulp density of 10 g/L, a temperature of 30 °C, and a glycine concentration of 5 g/L. This is the first study of Au and Ag bioleaching using indigenous e-waste bacteria and its analysis to determine e-waste toxicity tolerance.

Experimental testing and modelling of a resistive type superconducting fault current limiter using MgB2 wire

International Nuclear Information System (INIS)

Smith, A C; Pei, X; Oliver, A; Husband, M; Rindfleisch, M

2012-01-01

A prototype resistive superconducting fault current limiter (SFCL) was developed using single-strand round magnesium diboride (MgB 2 ) wire. The MgB 2 wire was wound with an interleaved arrangement to minimize coil inductance and provide adequate inter-turn voltage withstand capability. The temperature profile from 30 to 40 K and frequency profile from 10 to 100 Hz at 25 K were tested and reported. The quench properties of the prototype coil were tested using a high current test circuit. The fault current was limited by the prototype coil within the first quarter-cycle. The prototype coil demonstrated reliable and repeatable current limiting properties and was able to withstand a potential peak current of 372 A for one second without any degradation of performance. A three-strand SFCL coil was investigated and demonstrated scaled-up current capacity. An analytical model to predict the behaviour of the prototype single-strand SFCL coil was developed using an adiabatic boundary condition on the outer surface of the wire. The predicted fault current using the analytical model showed very good correlation with the experimental test results. The analytical model and a finite element thermal model were used to predict the temperature rise of the wire during a fault. (paper)

Numerical simulation of CTE mismatch and thermal-structural stresses in the design of interconnects

Science.gov (United States)