Effect of iodine on the corrosion of Au-Al wire bonds

DEFF Research Database (Denmark)

Verdingovas, Vadimas; Müller, Lutz; Jellesen, Morten Stendahl

2015-01-01

Corrosion study was performed on Au-Al wire bonds, thin layers of sputter deposited Au and Al, and Au-Al intermetallic nuggets. The test environment was iodine-vapour in air (1. mg/L) at 85 °C with varying relative humidity, and 500 mg/L of KI in water. GDOES, XRD, SEM EDS, wire bond shear......, and electrochemical testing were used to characterize the samples. Failures of Au-Al wire bonds were found to be primarily attributed to the corrosion of Al via formation of Al iodides and consequent formation of Al oxides and/or hydroxides. Most susceptible to corrosion are Al metallization and Al rich intermetallic...

The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation

International Nuclear Information System (INIS)

Lin, Yu-Wei; Wang, Ren-You; Ke, Wun-Bin; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao

2012-01-01

Highlights: ► Pd distribution in Pd-plated Cu wires reveals the whirlpool flow pattern of Cu. ► The mechanisms of the Cu flow behavior and Pd distribution are proposed. ► At Pd-rich phases, small voids formed and followed the direction of Cu flow. ► Nanoindentation studies show the Cu ball bond is harder in regions with Pd. - Abstract: The Pd plating on the 20 μm Cu wire dissolves in the free air ball (FAB) and the Cu ball bond during the wire bonding process without forming intermetallic compounds. The limiting supply of Pd and the short bonding process, 15 ms of thermosonic bonding, result in uneven distribution of Pd in the as produced Cu ball bond. Also, the Pd-rich phase may accompany small voids formed within the FAB and the wire bond, and following the direction of semi-solid Cu flow. The Pd distribution, as evidenced by the focused ion beam (FIB) and wavelength dispersive X-ray spectroscopy (WDS) mapping, reveals the whirlpool flow pattern of Cu within the FAB and the ball bond. Pd distributes within the copper ball through convective transport by the copper flow. Additionally, hardness measurements by nanoindentation testing show that the Cu ball bond is harder in the regions where Pd exists.

Monotonic and cyclic bond behavior of confined concrete using NiTiNb SMA wires

International Nuclear Information System (INIS)

Choi, Eunsoo; Chung, Young-Soo; Kim, Yeon-Wook; Kim, Joo-Woo

2011-01-01

This study conducts bond tests of reinforced concrete confined by shape memory alloy (SMA) wires which provide active and passive confinement of concrete. This study uses NiTiNb SMA which usually shows wide temperature hysteresis; this is a good advantage for the application of shape memory effects. The aims of this study are to investigate the behavior of SMA wire under residual stress and the performance of SMA wire jackets in improving bond behavior through monotonic-loading tests. This study also conducts cyclic bond tests and analyzes cyclic bond behavior. The use of SMA wire jackets transfers the bond failure from splitting to pull-out mode and satisfactorily increases bond strength and ductile behavior. The active confinement provided by the SMA plays a major role in providing external pressure on the concrete because the developed passive confinement is much smaller than the active confinement. For cyclic behavior, slip and circumferential strain are recovered more with larger bond stress. This recovery of slip and circumferential strain are mainly due to the external pressure of the SMA wires since cracked concrete cannot provide any elastic recovery

Simultaneous On-State Voltage and Bond-Wire Resistance Monitoring of Silicon Carbide MOSFETs

DEFF Research Database (Denmark)

Baker, Nick; Luo, Haoze; Iannuzzo, Francesco

2017-01-01

the voltage between the kelvin-source and power-source can be used to specifically monitor bond-wire degradation. Meanwhile, the drain to kelvin-source voltage can be monitored to track defects in the semiconductor die or gate driver. Through an accelerated aging test on 20 A Silicon Carbide Metal......-Oxide-Semiconductor-Field-Effect Transistors (MOSFETs), it is shown that there are opposing trends in the evolution of the on-state resistances of both the bond-wires and the MOSFET die. In summary, after 50,000 temperature cycles, the resistance of the bond-wires increased by up to 2 mΩ, while the on-state resistance of the MOSFET dies...... decreased by approximately 1 mΩ. The conventional failure precursor (monitoring a single forward voltage) cannot distinguish between semiconductor die or bond-wire degradation. Therefore, the ability to monitor both these parameters due to the presence of an auxiliary-source terminal can provide more...

Investigation on cold-drawn gold bonding wire with serial and reverse-direction drawing

International Nuclear Information System (INIS)

Cho, Jae-Hyung; Rollett, A.D.; Cho, J.-S.; Park, Y.-J.; Park, S.-H.; Oh, K.H.

2006-01-01

Gold bonding wires have been manufactured through multiple drawing steps with serial and reverse-direction drawing. The texture and microstructure of the gold bonding wires were characterized with X-ray diffraction and EBSD and compared with the predictions of finite element (FE) simulation. Initial fiber decreases during drawing and is replaced by fiber. The oriented grains are concentrated in the center and surface regions, whereas the oriented grains are located throughout the cross-section of the wire. Regions near the surface often exhibit the complex textures. A simplified forward and backward drawing process was modeled by FE analysis with ABAQUS/Standard TM . The simple two-step drawing process results in severe variation in shear strain under the surface and displays the opposite behavior in the shear components of the deformation gradient. The texture evolution was predicted using the deformation gradient calculated in the FE simulations together with a model of polycrystal plasticity. The and fibers are predicted to develop in the center part of the wire where homogeneous deformation occurs. The regions near the surface that experience repeated shear strain exhibit complex textures that deviate from the standard and fibers. The {1 1 2} and {1 1 1} components are prevalent in the higher shear strain regions. The variations of the anisotropic elastic directional moduli with position were also calculated

Study of gluing and wire bonding for the Belle II Silicon Vertex Detector

International Nuclear Information System (INIS)

Kang, K.H.; Hara, K.; Higuchi, T.; Hyun, H.J.; Jeon, H.B.; Joo, C.W.; Kah, D.H.; Kim, H.J.; Mibe, T.; Onuki, Y.; Park, H.; Rao, K.K.; Sato, N.; Shimizu, N.; Tanida, K.; Tsuboyama, T.; Uozumi, S.

2014-01-01

This paper describes an investigation into gluing and wire bonding for assembling the Silicon Vertex Detector (SVD) for the Belle II experiment at KEK in Japan. Optimizing the gluing of the silicon microstrip sensors, the support frame, and the readout flex cables is important for achieving the required mechanical precision. The wire bonding between the sensors and the readout electronic chips also needs special care to maximize the physics capability of the SVD. The silicon sensors and signal fan out flex circuits (pitch adapters) are glued and connected using wire bonding. We determine that gluing quality is important for achieving good bonding efficiency. The standard deviation in the glue thickness for the best result is measured to be 3.11 μm. Optimal machine parameters for wire bonding are determined to be 70 mW power, 20 gf force, and 20 ms for the pitch adapter and 60 mW power, 20 gf force, and 20 ms for the silicon strip sensors; these parameters provide a pull force of (10.92±0.72) gf. With these settings, 75% of the pitch adapters and 25% of the strip sensors experience the neck-broken type of break

Corrosion Study and Intermetallics Formation in Gold and Copper Wire Bonding in Microelectronics Packaging

Directory of Open Access Journals (Sweden)

Christopher Breach

2013-07-01

Full Text Available A comparison study on the reliability of gold (Au and copper (Cu wire bonding is conducted to determine their corrosion and oxidation behavior in different environmental conditions. The corrosion and oxidation behaviors of Au and Cu wire bonding are determined through soaking in sodium chloride (NaCl solution and high temperature storage (HTS at 175 °C, 200 °C and 225 °C. Galvanic corrosion is more intense in Cu wire bonding as compared to Au wire bonding in NaCl solution due to the minimal formation of intermetallics in the former. At all three HTS annealing temperatures, the rate of Cu-Al intermetallic formation is found to be three to five times slower than Au-Al intermetallics. The faster intermetallic growth rate and lower activation energy found in this work for both Au/Al and Cu/Al as compared to literature could be due to the thicker Al pad metallization which removed the rate-determining step in previous studies due to deficit in Al material.

Microstructural evaluation of interfacial intermetallic compounds in Cu wire bonding with Al and Au pads

International Nuclear Information System (INIS)

Kim, Hyung Giun; Kim, Sang Min; Lee, Jae Young; Choi, Mi Ri; Choe, Si Hyun; Kim, Ki Hong; Ryu, Jae Sung; Kim, Sangshik; Han, Seung Zeon; Kim, Won Yong; Lim, Sung Hwan

2014-01-01

A comparative study on the difference in interfacial behavior of thermally aged Cu wire bonding with Al and Au pads was conducted using transmission electron microscopy. During high-temperature lifetime testing of Cu wire bonding with Al and Au pads at 175 °C for up to 2000 h, different growth rates and growth characteristics were investigated in the Cu–Al intermetallic compounds (IMCs), including CuAl 2 , CuAl and Cu 9 Al 4 , and in the Cu–Au IMCs, including (Au,Cu), Cu 3 Au and (Cu,Au). Because of the lower growth rates and greater ductility of Cu–Au IMCs compared to those of Cu–Al IMCs, the Cu wire bonding with the Au pad showed relatively better thermal aging properties of bond pull strength and ball shear strength than those with the Al pad counterpart. In this study, the coherent interfaces were found to retard the growth of IMCs, and a variety of orientation relationships between wire, pad and interfacial IMCs were identified

Rectangular waveguide-to-coplanar waveguide transitions at U-band using e-plane probe and wire bonding

DEFF Research Database (Denmark)

Dong, Yunfeng; Johansen, Tom Keinicke; Zhurbenko, Vitaliy

2016-01-01

This paper presents rectangular waveguide-to-coplanar waveguide (CPW) transitions at U-band (40–60 GHz) using E-plane probe and wire bonding. The designs of CPWs based on quartz substrate with and without aluminum cover are explained. The single and double layer rectangular waveguide-to-CPW trans......This paper presents rectangular waveguide-to-coplanar waveguide (CPW) transitions at U-band (40–60 GHz) using E-plane probe and wire bonding. The designs of CPWs based on quartz substrate with and without aluminum cover are explained. The single and double layer rectangular waveguide......-to-CPW transitions using E-plane probe and wire bonding are designed. The proposed rectangular waveguide-to-CPW transition using wire bonding can provide 10 GHz bandwidth at U-band and does not require extra CPWs or connections between CPWs and chips. A single layer rectangular waveguide-to-CPW transition using E......-plane probe with aluminum package has been fabricated and measured to validate the proposed transitions. To the authors' best knowledge, this is the first time that a wire bonding is used as a probe for rectangular waveguide-to-CPW transition at U-band....

Wire Bonding on 2S Modules of the Phase-2 CMS Detector

CERN Document Server

AUTHOR|(CDS)2226525; Pooth, Oliver

The LHC will be upgraded to the HL-LHC in the Long Shutdown 3 starting 2024. This upgrade will increase the collision rate and the overall number of colliding particles requiring high precision particle detectors which are able to cope with much higher radiation doses and numbers of particle interactions per bunch crossing. To fulfill these technical requirements the CMS detector will be upgraded in the so-called Phase-2 Upgrade. Among others the silicon tracking system will be completely replaced by a new system providing a higher acceptance, an improved granularity and the feature to include its tracking information into the level-1 trigger. The new outer-tracker will consist of so called 2S modules consisting of two strip sensors and PS modules with a macro-pixel sensor and a strip sensor. The electrical connection between the strip sensors and the front-end electronics is realized by thin aluminum wire bonds. In this thesis the process of wire bonding is introduced and its implementation in the 2S module ...

Evaluation of bond strength and load deflection rate of multi-stranded fixed retainer wires: An In-Vitro Study

Directory of Open Access Journals (Sweden)

Renu Sarah Samson

2018-01-01

Full Text Available Background: Fixed orthodontic retainers must be well retained on the tooth surfaces, allow physiologic movement of teeth and exert minimal forces on the teeth to be retained. Previous studies analyzed the bond strength and amount of deflection caused due to the debonding force but not the magnitude of force needed for unit deformation. Aims: This study aims to evaluate and compare the bond strength and load deflection rate (LDR of three different fixed retainer wires. Materials and Methods: The wires were divided into three Groups: A – three-stranded twisted ligature wire, B – Bond-A-Braid (Reliance Orthodontics, and C – three-stranded twisted lingual retainer wire (3M Unitek. Twenty models were prepared for each group with a passive 15 mm long lingual retainer wire bonded to two lower incisors. An occlusogingival force was applied to the wire until it debonded. For LDR, three-point bending test was done at 0.5 mm deflection. These forces were measured using a Universal Instron Testing Machine. Statistical Analysis: Mean bond strength/LDR and pairwise comparisons were analyzed with one-way ANOVA and Tukey's honest significant difference post hoc test, respectively. Results: Group C exhibited the highest mean bond strength and LDR of 101.17N and 1.84N, respectively. The intergroup comparisons were all statistically significant. Conclusion: Compared to the other two wire types, Group C might be better retained on the teeth due to its higher bond strength. With its relatively higher LDR value, it may resist deformation from occlusal forces, thereby reducing inadvertent tooth movement and yet remain flexible enough to allow physiologic tooth movements.

Behavior of palladium and its impact on intermetallic growth in palladium-coated Cu wire bonding

International Nuclear Information System (INIS)

Xu Hui; Qin, Ivy; Clauberg, Horst; Chylak, Bob; Acoff, Viola L.

2013-01-01

This paper describes the behavior of palladium in palladium-coated Cu (PdCu) wire bonding and its impact on bond reliability by utilizing transmission electron microscopy (TEM). A Pd layer approximately 80 nm thick, which is coated on the surface of Cu wire, dissolves into the Cu matrix during ball formation (under N 2 gas protection) when the wire tip is melted to form a ball. As a result of dissolving the very thin Pd layer into the ball, Pd is almost undetectable along the entire bond interface between the ball and the Al pad. The behavior of Pd during thermal aging in air, however, is different for central and peripheral interfaces. At the central interface, less than 5 at.% Pd is present after 168 h aging at 175 °C. At the periphery, however, Pd diffuses back and congregates, reaching a level of ∼12 at.% after 24 h, and a Pd-rich (Cu,Pd) 9 Al 4 layer (>40 at.% Pd) forms after 168 h. Pd acts substitutionally in Cu 9 Al 4 but cannot penetrate into the CuAl 2 or CuAl. By comparison of intermetallic thickness and interfacial morphology between PdCu and bare Cu wire bonds, it is concluded that the presence of Pd reduces intermetallic growth rate, and is associated with numerous nanovoids in PdCu bonds.

Comprehensive physical analysis of bond wire interfaces in power modules

DEFF Research Database (Denmark)

Popok, Vladimir; Pedersen, Kristian Bonderup; Kristensen, Peter Kjær

2016-01-01

causing failures. In this paper we present a review on the set of our experimental and theoretical studies allowing comprehensive physical analysis of changes in materials under active power cycling with focus on bond wire interfaces and thin metallisation layers. The developed electro-thermal and thermo...

Spin transport in dangling-bond wires on doped H-passivated Si(100)

International Nuclear Information System (INIS)

Kepenekian, Mikaël; Robles, Roberto; Lorente, Nicolás; Rurali, Riccardo

2014-01-01

New advances in single-atom manipulation are leading to the creation of atomic structures on H-passivated Si surfaces with functionalities important for the development of atomic and molecular based technologies. We perform total-energy and electron-transport calculations to reveal the properties and understand the features of atomic wires crafted by H removal from the surface. The presence of dopants radically change the wire properties. Our calculations show that dopants have a tendency to approach the dangling-bond wires, and in these conditions, transport is enhanced and spin selective. These results have important implications in the development of atomic-scale spintronics showing that boron, and to a lesser extent phosphorous, convert the wires in high-quality spin filters. (paper)

Prediction of Bond Wire Fatigue of IGBTs in a PV Inverter Under a Long-Term Operation

DEFF Research Database (Denmark)

Reigosa, Paula Diaz; Wang, Huai; Yang, Yongheng

2016-01-01

consumption of bond wires of IGBT modules in a Photovoltaic (PV) inverter. The variations in IGBT parameters (e.g., on-state collector-emitter voltage), lifetime models, and environmental and operational stresses are taken into account in the lifetime prediction. The distribution of the annual lifetime...... consumption is estimated based on a long-term annual stress profile of solar irradiance and ambient temperature. The proposed method enables a more realistic lifetime prediction with a specified confidence level compared to the state-of-the-art approaches. A study case of IGBT modules in a 10 kW three......Bond wire fatigue is one of the dominant failure mechanisms in IGBT modules under cyclic stresses. However, there are still major challenges ahead to achieve a realistic bond wire lifetime prediction in field operation. This paper proposes a Monte Carlo based analysis method to predict the lifetime...

Mission-profile-based stress analysis of bond-wires in SiC power modules

DEFF Research Database (Denmark)

Bahman, Amir Sajjad; Iannuzzo, Francesco; Blaabjerg, Frede

2016-01-01

This paper proposes a novel mission-profile-based reliability analysis approach for stress on bond wires in Silicon Carbide (SiC) MOSFET power modules using statistics and thermo-mechanical FEM analysis. In the proposed approach, both the operational and environmental thermal stresses are taken...... into account. The approach uses a two-dimension statistical analysis of the operating conditions in a real one-year mission profile sampled at time frames 5 minutes long. For every statistical bin corresponding to a given operating condition, the junction temperature evolution is estimated by a thermal network...... and the mechanical stress on bond wires is consequently extracted by finite-element simulations. In the final step, the considered mission profile is translated in a stress sequence to be used for Rainflow counting calculation and lifetime estimation....

Biofilm formation on stainless steel and gold wires for bonded retainers in vitro and in vivo and their susceptibility to oral antimicrobials.

Science.gov (United States)

Jongsma, Marije A; Pelser, Floris D H; van der Mei, Henny C; Atema-Smit, Jelly; van de Belt-Gritter, Betsy; Busscher, Henk J; Ren, Yijin

2013-05-01

Bonded retainers are used in orthodontics to maintain treatment result. Retention wires are prone to biofilm formation and cause gingival recession, bleeding on probing and increased pocket depths near bonded retainers. In this study, we compare in vitro and in vivo biofilm formation on different wires used for bonded retainers and the susceptibility of in vitro biofilms to oral antimicrobials. Orthodontic wires were exposed to saliva, and in vitro biofilm formation was evaluated using plate counting and live/dead staining, together with effects of exposure to toothpaste slurry alone or followed by antimicrobial mouthrinse application. Wires were also placed intra-orally for 72 h in human volunteers and undisturbed biofilm formation was compared by plate counting and live/dead staining, as well as by denaturing gradient gel electrophoresis for compositional differences in biofilms. Single-strand wires attracted only slightly less biofilm in vitro than multi-strand wires. Biofilms on stainless steel single-strand wires however, were much more susceptible to antimicrobials from toothpaste slurries and mouthrinses than on single-strand gold wires and biofilms on multi-strand wires. Also, in vivo significantly less biofilm was found on single-strand than on multi-strand wires. Microbial composition of biofilms was more dependent on the volunteer involved than on wire type. Biofilms on single-strand stainless steel wires attract less biofilm in vitro and are more susceptible to antimicrobials than on multi-strand wires. Also in vivo, single-strand wires attract less biofilm than multi-strand ones. Use of single-strand wires is preferred over multi-strand wires, not because they attract less biofilm, but because biofilms on single-strand wires are not protected against antimicrobials as in crevices and niches as on multi-strand wires.

Oxidation study on as-bonded intermetallic of copper wire-aluminum bond pad metallization for electronic microchip

Energy Technology Data Exchange (ETDEWEB)

Joseph Sahaya Anand, T., E-mail: anand@utem.edu.my [Faculty of Manufacturing Engineering, University Technical Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka (Malaysia); Yau, Chua Kok [Faculty of Manufacturing Engineering, University Technical Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka (Malaysia); University of Technical Malaysia Supported by Infineon Technology - Malaysia - Sdn. Bhd., Melaka (Malaysia); Huat, Lim Boon [Department of Innovation, Infineon Technology - Malaysia - Sdn. Bhd., FTZ Batu Berendam, 75350 Melaka (Malaysia)

2012-10-15

In this work, influence of Copper free air ball (FAB) oxidation towards Intermetallic Compound (IMC) at Copper wire-Aluminum bond pad metallization (Cu/Al) is studied. Samples are synthesized with different Copper FAB oxidation condition by turning Forming Gas supply ON and OFF. Studies are performed using Optical Microscope (OM), Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM) and line-scan Energy Dispersive X-ray (EDX). SEM result shows there is a cross-sectional position offset from center in sample synthesized with Forming Gas OFF. This is due to difficulty of determining the position of cross-section in manual grinding/polishing process and high occurrence rate of golf-clubbed shape of oxidized Copper ball bond. TEM inspection reveals that the Copper ball bond on sample synthesized with Forming Gas OFF is having intermediate oxidation. Besides, the presence of IMC at the bonding interface of Cu/Al for both samples is seen. TEM study shows voids form at the bonding interface of Forming Gas ON sample belongs to unbonded area; while that in Forming Gas OFF sample is due to volume shrinkage of IMC growth. Line-scan EDX shows the phases present in the interfaces of as-bonded samples are Al{sub 4}Cu{sub 9} ({approx}3 nm) for sample with Forming Gas ON and mixed CuAl and CuAl{sub 2} ({approx}15 nm) for sample with Forming Gas OFF. Thicker IMC in sample with Forming Gas OFF is due to cross-section is positioned at high stress area that is close to edge of ball bond. Mechanical ball shear test shows that shear strength of sample with Forming Gas OFF is about 19% lower than that of sample with Forming Gas ON. Interface temperature is estimated at 437 Degree-Sign C for as-bonded sample with Forming Gas ON by using empirical parabolic law of volume diffusion. -- Highlights: Black-Right-Pointing-Pointer 3 nm Al{sub 4}Cu{sub 9} are found in sample prepared with Forming Gas ON. Black-Right-Pointing-Pointer 15 nm mixed CuAl + CuAl{sub 2} are found

Long-term effectiveness of canine-to-canine bonded flexible spiral wire lingual retainers

NARCIS (Netherlands)

Renkema, Anne-Marie; Renkema, Alianne; Bronkhorst, Ewald; Katsaros, Christos

Introduction: The flexible spiral wire (FSW) canine-to-canine lingual retainer bonded to all 6 anterior teeth is a frequently used type of mandibular fixed retainer. This study aimed to assess the long-term effectiveness of FSW canine-to-canine lingual retainers in maintaining the alignment of the

Long-term effectiveness of canine-to-canine bonded flexible spiral wire lingual retainers

NARCIS (Netherlands)

Renkema, A.M.; Bronkhorst, E.M.; Katsaros, C.

2011-01-01

INTRODUCTION: The flexible spiral wire (FSW) canine-to-canine lingual retainer bonded to all 6 anterior teeth is a frequently used type of mandibular fixed retainer. This study aimed to assess the long-term effectiveness of FSW canine-to-canine lingual retainers in maintaining the alignment of the

Thermoelectric Mechanism and Interface Characteristics of Cyanide-Free Nanogold-Coated Silver Wire

Science.gov (United States)

Tseng, Yi-Wei; Hung, Fei-Yi; Lui, Truan-Sheng

2016-01-01

Traditional bath-plated gold contains a cyanide complex, which is an environmental hazard. In response, our study used a green plating process to produce cyanide-free gold-coated silver (cyanide-free ACA) bonding wire that has been proven to be a feasible alternative to gold bonding wire in semiconductor packaging. In this work, ACA wire annealed at 550°C was found to have stable microstructure and superior mechanical properties. Intermetallic compounds Ag2Al and AuAl2 grew from Ag-Au balls and Al pads after aging at 175°C for 500 h. After current testing, ACA wire was found to have improved electrical properties due to equiaxed grain growth. The gold nanolayer on the Ag surface increased the oxidation resistance. These results provide insights regarding the reliability of ACA wire in advanced bonding processes.

THERMO-MECHANICALLY PROCESSED ROLLED WIRE FOR HIGH-STRENGTH ON-BOARD WIRE

Directory of Open Access Journals (Sweden)

V. A. Lutsenko

2011-01-01

Full Text Available It is shown that at twisting of wire of diameter 1,83 mm, produced by direct wire drawing of thermomechanically processed rolled wire of diameter 5,5 mm of steel 90, metal stratification is completely eliminated at decrease of carbon, manganese and an additional alloying of chrome.

Low-cost bump-bonding processes for high energy physics pixel detectors

CERN Document Server

AUTHOR|(CDS)2069357; Blank, Thomas; Colombo, Fabio; Dierlamm, Alexander Hermann; Husemann, Ulrich; Kudella, Simon; Weber, M

2016-01-01

In the next generation of collider experiments detectors will be challenged by unprecedented particle fluxes. Thus large detector arrays of highly pixelated detectors with minimal dead area will be required at reasonable costs. Bump-bonding of pixel detectors has been shown to be a major cost-driver. KIT is one of five production centers of the CMS barrel pixel detector for the Phase I Upgrade. In this contribution the SnPb bump-bonding process and the production yield is reported. In parallel to the production of the new CMS pixel detector, several alternatives to the expensive photolithography electroplating/electroless metal deposition technologies are developing. Recent progress and challenges faced in the development of bump-bonding technology based on gold-stud bonding by thin (15 μm) gold wire is presented. This technique allows producing metal bumps with diameters down to 30 μm without using photolithography processes, which are typically required to provide suitable under bump metallization. The sh...

Novel electrochemical approach to study corrosion mechanism of Al-Au wire-bond pad interconnections

DEFF Research Database (Denmark)

Elisseeva, O. V.; Bruhn, A.; Cerezo, J.

2013-01-01

A gold-aluminium material combination is typically employed as an interconnection for microelectronic devices. One of the reliability risks of such devices is that of corrosion of aluminium bond pads resulting from the galvanic coupling between an aluminium bond pad and a gold wire. The research...... presented in this manuscript focuses on studying bond pad corrosion by selecting an appropriate model system and a dedicated set of electrochemical and analytical experimental tools. Taking into account the complex three-dimensional structure and the small dimensions of Au-Al interconnections (around 50......-100 μm), a dedicated and novel experimental approach was developed. Au-Al covered silicon chips were developed under clean room conditions. Three-dimensional electrodes were mimicked as flat, two-dimensional bond pad model systems, allowing the use of microelectrochemical local probe techniques. Thin...

Adhesive Properties of Bonded Orthodontic Retainers to Enamel : Stainless Steel Wire vs Fiber-reinforced Composites

NARCIS (Netherlands)

Foek, Dave Lie Sam; Krebs, Eliza; Sandham, John; Ozcan, Mutlu

2009-01-01

Purpose: The objectives of this study were to compare the bond strength of a stainless steel orthodontic wire vs various fiber-reinforced composites (FRC) used as orthodontic retainers on enamel, analyze the failure types after debonding, and investigate the influence of different application

Processing of flexible high-Tc superconducting wires

International Nuclear Information System (INIS)

Lee, B.I.; Modi, V.

1989-01-01

Wires superconducting at temperatures above 77 K are produced by using YBa 2 Cu 3 O 7 materials. Flexibility was obtained by support from prefabricated fibers or a metallic coating on the extruded YBa 2 Cu 3 O 7 wires. The microstructure, the T c and the critical current densities of the wires were determined. Processing variables and steps are described

Algorithm of automatic generation of technology process and process relations of automotive wiring harnesses

Institute of Scientific and Technical Information of China (English)

XU Benzhu; ZHU Jiman; LIU Xiaoping

2012-01-01

Identifying each process and their constraint relations from the complex wiring harness drawings quickly and accurately is the basis for formulating process routes. According to the knowledge of automotive wiring harness and the characteristics of wiring harness components, we established the model of wiring harness graph. Then we research the algorithm of identifying technology processes automatically, finally we describe the relationships between processes by introducing the constraint matrix, which is in or- der to lay a good foundation for harness process planning and production scheduling.

The Analysis of the High Speed Wire Drawing Process of High Carbon Steel Wires Under Hydrodynamic Lubrication Conditions

Directory of Open Access Journals (Sweden)

Suliga M.

2015-04-01

Full Text Available In this work the analysis of the wire drawing process in hydrodynamic dies has been done. The drawing process of φ5.5 mm wire rod to the final wire of φ1.7 mm was conducted in 12 passes, in drawing speed range of 5-25 m/s. For final wires of φ1.7 mm the investigation of topography of wire surface, the amount of lubricant on the wire surface and the pressure of lubricant in hydrodynamic dies were determined. Additionally, in the work selected mechanical properties of the wires have been estimated.

Biofilm formation on stainless steel and gold wires for bonded retainers in vitro and in vivo and their susceptibility to oral antimicrobials

NARCIS (Netherlands)

Jongsma, Marije A.; Pelser, Floris D. H.; van der Mei, Henny C.; Atema-Smit, Jelly; van de Belt-Gritter, Betsy; Busscher, Henk J.; Ren, Yijin

OBJECTIVE: Bonded retainers are used in orthodontics to maintain treatment result. Retention wires are prone to biofilm formation and cause gingival recession, bleeding on probing and increased pocket depths near bonded retainers. In this study, we compare in vitro and in vivo biofilm formation on

The effect of prior sandblasting of the wire on the shear bond strength of two different types of lingual retainers.

Science.gov (United States)

Kilinç, Delal Dara; Sayar, Gülşilay

2018-04-07

The aim of this study was to evaluate the effect of total surface sandblasting on the shear bond strength of two different retainer wires. The null hypothesis was that there is no difference in the bond strength of the two types of lingual retainer wires when they are sandblasted. One hundred and sixty human premolar teeth were equally divided into four groups (n=40). A pair of teeth was embedded in self-curing acrylic resin and polished. Retainer wires were applied on the etched and rinsed surfaces of the teeth. Four retainers were used: group 1: braided retainer (0.010×0.028″, Ortho Technology); group 2: sandblasted braided retainer (0.010×0.028″, Ortho Technology); group 3: coaxial retainer (0.0215″ Coaxial, 3M) and group 4: sandblasted coaxial retainer (0.0215″ Coaxial, 3M). The specimens were tested using a universal test machine in shear mode with a crosshead speed of one mm/min. One-way analysis of variance (Anova) was used to determine the significant differences among the groups. There was no significant difference (P=0.117) among the groups according to this test. The null hypothesis was accepted. There was no statistically significant difference among the shear bond strength values of the four groups. Copyright © 2018 CEO. Published by Elsevier Masson SAS. All rights reserved.

IEE wiring regulations explained and illustrated

CERN Document Server

Scaddan, Brian

2013-01-01

The IEE Wiring Regulations Explained and Illustrated, Second Edition discusses the recommendations of the IEE Regulations for the Electrical Equipment of Buildings for the safe selection or erection of wiring installations. The book emphasizes earthing, bonding, protection, and circuit design of electrical wirings. The text reviews the fundamental requirements for safety, earthing systems, the earth fault loop impedance, and supplementary bonding. The book also describes the different types of protection, such as protection against mechanical damage, overcurrent, under voltage (which prevents

Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds

International Nuclear Information System (INIS)

Xu, H.; Liu, C.; Silberschmidt, V.V.; Pramana, S.S.; White, T.J.; Chen, Z.; Acoff, V.L.

2011-01-01

Nanoscale interfacial evolution in Cu-Al wire bonds during isothermal annealing from 175 deg. C to 250 deg. C was investigated by high resolution transmission electron microscopy (HRTEM). The native aluminum oxide film (∼5 nm thick) of the Al pad migrates towards the Cu ball during annealing. The formation of intermetallic compounds (IMC) is controlled by Cu diffusion, where the kinetics obey a parabolic growth law until complete consumption of the Al pad. The activation energies to initiate crystallization of CuAl 2 and Cu 9 Al 4 are 60.66 kJ mol -1 and 75.61 kJ mol -1 , respectively. During IMC development, Cu 9 Al 4 emerges as a second layer and grows together with the initial CuAl 2 . When Al is completely consumed, CuAl 2 transforms to Cu 9 Al 4 , which is the terminal product. Unlike the excessive void growth in Au-Al bonds, only a few voids nucleate in Cu-Al bonds after long-term annealing at high temperatures (e.g., 250 o C for 25 h), and their diameters are usually in the range of tens of nanometers. This is due to the lower oxidation rate and volumetric shrinkage of Cu-Al IMC compared with Au-Al IMC.

An Alternative Cu-Based Bond Layer for Electric Arc Coating Process

Science.gov (United States)

Fadragas, Carlos R.; Morales, E. V.; Muñoz, J. A.; Bott, I. S.; Lariot Sánchez, C. A.

2011-12-01

A Cu-Al alloy has been used as bond coat between a carbon steel substrate and a final coating deposit obtained by applying the twin wire electric arc spraying coating technique. The presence of a copper-based material in the composite system can change the overall temperature profile during deposition because copper exhibits a thermal conductivity several times higher than that of the normally recommended bond coat materials (such as nickel-aluminum alloys or nickel-chromium alloys). The microstructures of 420 and 304 stainless steels deposited by the electric arc spray process have been investigated, focusing attention on the deposit homogeneity, porosity, lamellar structure, and microhardness. The nature of the local temperature gradient during deposition can strongly influence the formation of the final coating deposit. This study presents a preliminary study, undertaken to investigate the changes in the temperature profile which occur when a Cu-Al alloy is used as bond coat, and the possible consequences of these changes on the microstructure and adhesion of the final coating deposit. The influence of the thickness of the bond layer on the top coating temperature has also been also evaluated.

Multifilamentary MgB2 wires fracture behavior during the drawing process

International Nuclear Information System (INIS)

Shan, D.; Yan, G.; Zhou, L.; Li, J.S.; Li, C.S.; Wang, Q.Y.; Xiong, X.M.; Jiao, G.F.

2012-01-01

The fracture behavior of 6 + 1 filamentary MgB 2 superconductive wires is presented here. The composite wires were fabricated by in situ Powder-in-Tube method using Nb as a barrier and copper as a stabilizer. The microstructure of the material has a great influence on its fracture behavior. The microstructural aspects of crack nucleation and propagation are discussed. It shows that there are complicated correlations between fracture behavior and the main influencing parameters, which contain specific drawing conditions (drawing velocity, reduction in area per pass), materials properties (strength, yield stress, microstructure) as well as the extent of bonding between the metal sheaths at their interface.

A new route to process diamond wires

Directory of Open Access Journals (Sweden)

Marcello Filgueira

2003-06-01

Full Text Available We propose an original route to process diamond wires, denominated In Situ Technology, whose fabrication involves mechanical conformation processes, such as rotary forging, copper tubes restacking, and thermal treatments, such as sintering and recrystallisation of a bronze 4 wt.% diamond composite. Tensile tests were performed, reaching an ultimate tensile strength (UTS of 230 MPa for the diameter of Æ = 1.84 mm. Scanning electron microscopy showed the diamond crystals distribution along the composite rope during its manufacture, as well as the diamond adhesion to the bronze matrix. Cutting tests were carried out with the processed wire, showing a probable performance 4 times higher than the diamond sawing discs, however its probable performance was about 5 to 8 times less than the conventional diamond wires (pearl system due to the low abrasion resistance of the bronze matrix, and low adhesion between the pair bronze-diamond due to the use of not metallised diamond single crystals.

Improvement of cold wire drawing process by electropulsing

OpenAIRE

Sánchez Egea, Antonio José; González Rojas, Hernan Alberto; Jorba Peiró, Jordi

2015-01-01

The electroplastic effects on wire drawing process assisted with different short time current pulses configurations are investigated experimentally. The current pulses were induced to a specimen during the drawing process. The studied material is the 308L stainless steel. Current densities of 185 A/mm2, frequencies range from 140 to 350 Hz and pulse duration range from 100 to 250 μs were used in the electrically‐assisted wire drawing process. Frequency and pulse duration are...

Laser Indirect Shock Welding of Fine Wire to Metal Sheet.

Science.gov (United States)

Wang, Xiao; Huang, Tao; Luo, Yapeng; Liu, Huixia

2017-09-12

The purpose of this paper is to present an advanced method for welding fine wire to metal sheet, namely laser indirect shock welding (LISW). This process uses silica gel as driver sheet to accelerate the metal sheet toward the wire to obtain metallurgical bonding. A series of experiments were implemented to validate the welding ability of Al sheet/Cu wire and Al sheet/Ag wire. It was found that the use of a driver sheet can maintain high surface quality of the metal sheet. With the increase of laser pulse energy, the bonding area of the sheet/wire increased and the welding interfaces were nearly flat. Energy dispersive spectroscopy (EDS) results show that the intermetallic phases were absent and a short element diffusion layer which would limit the formation of the intermetallic phases emerging at the welding interface. A tensile shear test was used to measure the mechanical strength of the welding joints. The influence of laser pulse energy on the tensile failure modes was investigated, and two failure modes, including interfacial failure and failure through the wire, were observed. The nanoindentation test results indicate that as the distance to the welding interface decreased, the microhardness increased due to the plastic deformation becoming more violent.

Application of irradiation process for the production of thin wall wires

International Nuclear Information System (INIS)

Saito, E.

1977-01-01

The demand for thin wall crosslinked PVC or polyethylene insulated wires in Japan was about 15,000,000 dollars in value in 1975. Their annual sales in 1980 are estimated at about 40 million dollars which will account for approximately 20% of the sales of all thin wall thermoplastic insulated wires expected for the same year. A comparative study was made of the irradiation process and the chemical process for manufacture of wires with crosslinked PVC or polyethylene insulation. Having found the excellence of the irradiation process an accelerator (500 KeV, 65mA) was installed in 1973 and production was begun of several types of thin wall irradiation crosslinked PVC and polyethylene insulated wires ranging from 0.06 mm 2 to 2.0 mm 2 in the cross-sectional area of conductor, successfully putting them in extensive commercial application. This report compares the irradiation process and the chemical process, properties of several types of irradiation crosslinked PVC, and polyethylene insulated wires and their applications. (author)

Modelling aluminium wire bond reliability in high power OMP devices

NARCIS (Netherlands)

Kregting, R.; Yuan, C.A.; Xiao, A.; Bruijn, F. de

2011-01-01

In a RF power application such as the OMP, the wires are subjected to high current (because of the high power) and high temperature (because of the heat from IC and joule-heating from the wire itself). Moreover, the wire shape is essential to the RF performance. Hence, the aluminium wire is

An Icepak-PSpice Co-Simulation Method to Study the Impact of Bond Wires Fatigue on the Current and Temperature Distribution of IGBT Modules under Short-Circuit

DEFF Research Database (Denmark)

Wu, Rui; Iannuzzo, Francesco; Wang, Huai

2014-01-01

Bond wires fatigue is one of the dominant failure mechanisms of IGBT modules. Prior-art research mainly focuses on its impact on the end-of-life failure, while its effect on the short-circuit capability of IGBT modules is still an open issue. This paper proposes a new electro-thermal simulation...... approach enabling analyze the impact of the bond wires fatigue on the current and temperature distribution on IGBT chip surface under short-circuit. It is based on an Icepack-PSpice co-simulation by taking the advantage of both a finite element thermal model and an advanced PSpice-based multi-cell IGBT...

Thermomechanical analysis of an electrically assisted wire drawing process

OpenAIRE

Sánchez Egea, Antonio José; González Rojas, Hernan Alberto; Celentano, Diego Javier; Jorba Peiró, Jordi; Cao, Jia

2017-01-01

Electrically-assisted wire drawing process is a hybrid manufacturing process characterized by enhancement of the formability, ductility and elongation of the wire drawn specimen. A thermomechanical model to describe the change of the mechanical response due to the thermal contribution is proposed in this work. Additionally, a numerical simulation was conducted to study the potential and limitations of this hybrid process by using two different hardening laws: a phenomenological and a dislocat...

Analysis of factors influencing the bond strength in roll bonding processes

Science.gov (United States)

Khaledi, Kavan; Wulfinghoff, Stephan; Reese, Stefanie

2018-05-01

Cold Roll Bonding (CRB) is recognized as an industrial technique in which the metal sheets are joined together in order to produce laminate metal composites. In this technique, a metallurgical bond resulting from severe plastic deformation is formed between the rolled metallic layers. The main objective of this paper is to analyse different factors which may affect the bond formation in rolling processes. To achieve this goal, first, an interface model is employed which describes both the bonding and debonding. In this model, the bond strength evolution between the metallic layers is calculated based on the film theory of bonding. On the other hand, the debonding process is modelled by means of a bilinear cohesive zone model. In the numerical section, different scenarios are taken into account to model the roll bonding process of metal sheets. The numerical simulation includes the modelling of joining during the roll bonding process followed by debonding in a Double Cantilever Beam (DCB) peeling test. In all simulations, the metallic layers are regarded as elastoplastic materials subjected to large plastic deformations. Finally, the effects of some important factors on the bond formation are numerically investigated.

Studies of implosion processes of nested tungsten wire-array Z-pinch

International Nuclear Information System (INIS)

Ning Cheng; Ding Ning; Liu Quan; Yang Zhenhua

2006-01-01

Nested wire-array is a kind of promising structured-load because it can improve the quality of Z-pinch plasma and enhance the radiation power of X-ray source. Based on the zero-dimensional model, the assumption of wire-array collision, and the criterion of optimized load (maximal load kinetic energy), optimization of the typical nested wire-array as a load of Z machine at Sandia Laboratory was carried out. It was shown that the load has been basically optimized. The Z-pinch process of the typical load was numerically studied by means of one-dimensional three-temperature radiation magneto-hydrodynamics (RMHD) code. The obtained results reproduce the dynamic process of the Z-pinch and show the implosion trajectory of nested wire-array and the transfer process of drive current between the inner and outer array. The experimental and computational X-ray pulse was compared, and it was suggested that the assumption of wire-array collision was reasonable in nested wire-array Z-pinch at least for the current level of Z machine. (authors)

Gold recovery from printed wiring board using bioleaching

Energy Technology Data Exchange (ETDEWEB)

Kita, Y. [Faculty of Engineering, Osaka Univ. (Japan); Nishikawa, H. [Center for Advanced Science and Innovation, Osaka Univ. (Japan); Takemoto, T. [Joining and Welding Research Inst., Osaka Univ. (Japan)

2004-07-01

In the electronic assembly, gold is frequently used as surface plating and a bonding wire. To recover gold from waste electronics, the dissolution process using cyan is a popular method, however, the solution is highly toxic. Accordingly, the environmentally conscious substitute process is preferable. In this study the possibility of Au dissolution from printed wiring boards using bioleaching has been investigated. Chromobacterium violaceum having ability of cyanide formation was used to dissolve Au. The printed wiring boards with gold plating of 0.07nm in thickness were immersed in synthetic medium with C. violaceum. After immersion test for 480h, the gold plating was completely dissolved. The increase in cyanide concentration gave little effect on the enhancement of dissolution of gold, however, the dissolution rate of Au was increased with increasing of dissolved oxygen in the medium. Chromobacterium violaceum produced 0.8mmol/l cyanide but it also decomposed about 60% of cyanide generated, therefore, this dissolution process could be used as an environmentally conscious method. (orig.)

A fully MEMS-compatible process for 3D high aspect ratio micro coils obtained with an automatic wire bonder

International Nuclear Information System (INIS)

Kratt, K; Badilita, V; Burger, T; Wallrabe, U; Korvink, J G

2010-01-01

We report the fabrication of 3D micro coils made with an automatic wire bonder. Using standard MEMS processes such as spin coating and UV lithography on silicon and Pyrex® wafers results in high aspect ratio SU-8 posts with diameters down to 100 µm that serve as mechanical stabilization yokes for the coils. The wire bonder is employed to wind 25 µm insulated gold wire around the posts in an arbitrary (e.g. solenoidal) path, yielding arrays of micro coils. Each micro coil is bonded directly on-chip, so that loose wire ends are avoided and, compared to other winding methods, coil re-soldering is unnecessary. The manufacturing time for a single coil is about 200 ms, and although the process is serial, it is batch fabrication compatible due to the high throughput of the machine. Despite the speed of manufacture we obtain high manufacturing precision and reliability. The micro air-core solenoids show an RF quality factor of over 50 when tested at 400 MHz. We present a flexible coil making method where the number of windings is only limited by the post height. The coil diameter is restricted by limits defined by lithography and the mechanical strength of the posts. Based on this technique we present coils ranging from 100 µm diameter and 1 winding up to 1000 µm diameter and 20 windings

Resistance microwelding of 316L stainless steel wire to block

DEFF Research Database (Denmark)

Friis, Kasper Storgaard; Khan, M.I.; Bay, Niels

2011-01-01

The excellent corrosion resistance of low carbon vacuum melted 316 stainless steel coupled with its non-magnetic properties makes it ideal for biomedical applications. The typical joint geometry for microcomponents, such as medical implants, includes joining of fine wire to a larger block. However......, this type of joint has received little attention in the current literature. The present study was conducted to examine the microstructure and mechanical properties of low carbon vacuum melted 316 stainless steel wire welded to a larger block. Results revealed solid state bonding occurring at low currents......, while fusion bonding occurred at higher currents. This was due to the highly asymmetrical heat generation resulting in almost complete melting of the wire before the initiation of interfacial melting. This is a distinctly different bonding mechanism compared to previous studies on crossed wire joints....

MIP Plasma Decapsulation of Copper-wired Semiconductor Devices for Failure Analysis

NARCIS (Netherlands)

Tang, J.

2014-01-01

The majority of Integrated Circuit (IC) devices are encapsulated in wire-bonded plastic IC packages. Epoxy molding compound is used as the encapsulation material and gold was used as the bonding wire material. However, the increase of gold material price from 400 USD/ounce in year 2005 to 1400

Prediction of multi performance characteristics of wire EDM process using grey ANFIS

Science.gov (United States)

Kumanan, Somasundaram; Nair, Anish

2017-09-01

Super alloys are used to fabricate components in ultra-supercritical power plants. These hard to machine materials are processed using non-traditional machining methods like Wire cut electrical discharge machining and needs attention. This paper details about multi performance optimization of wire EDM process using Grey ANFIS. Experiments are designed to establish the performance characteristics of wire EDM such as surface roughness, material removal rate, wire wear rate and geometric tolerances. The control parameters are pulse on time, pulse off time, current, voltage, flushing pressure, wire tension, table feed and wire speed. Grey relational analysis is employed to optimise the multi objectives. Analysis of variance of the grey grades is used to identify the critical parameters. A regression model is developed and used to generate datasets for the training of proposed adaptive neuro fuzzy inference system. The developed prediction model is tested for its prediction ability.

Tensile test and interface retention forces between wires and composites in lingual fixed retainers.

Science.gov (United States)

Paolone, Maria Giacinta; Kaitsas, Roberto; Obach, Patricia; Kaitsas, Vasilios; Benedicenti, Stefano; Sorrenti, Eugenio; Barberi, Fabrizio

2015-06-01

In daily orthodontic clinical practice retention is very important, and lingual retainers are part of this challenge. The failure of lingual retainers may be due to many factors. The aim of this study was to assess the retention forces and mechanical behavior of different types of wires matched with different kinds of composites in lingual retainers. A tensile test was performed on cylindrical composite test specimens bonded to orthodontic wires. The specimens were constructed using four different wires: a straight wire (Remanium .016×.022″ Dentaurum), two round twisted wires (Penta One .0215″ Masel, Gold Penta Twisted .0215″ Gold N'braces) and a rectangular braided wire (D-Rect .016×.022″ Ormco); and three composites: two micro-hybrids (Micro-Hybrid Enamel Plus HFO Micerium, and Micro-Hybrid SDR U Dentsply) and a micro-nano-filled composite (Micro-Nano-Filled Transbond LR 3M). The test was performed at a speed of 10mm/min on an Inström device. The wire was fixed with a clamp. The results showed that the bonding between wires and composites in lingual fixed retainers seemed to be lowest for rectangular smooth wires and increased in round twisted and rectangular twisted wires where the bonding was so strong that the maximum tension/bond strength was greater than the ultimate tensile strength of the wire. The highest values were in rectangular twisted wires. Concerning the composites, hybrid composites had the lowest interface bonding values and broke very quickly, while the nano- and micro-composites tolerated stronger forces and displayed higher bonding values. The best results were observed with the golden twisted wire and reached 21.46 MPa with the Transbond composite. With the rectangular braided wire the retention forces were so high that the Enamel Plus composite fractured when the load exceeded 154.6 N/MPa. When the same wire was combined with the Transbond LR either the wire or the composite broke when the force exceeded 240 N. The results of this

ECAE-processed Cu-Nb and Cu-Ag nanocomposite wires for pulse magnet applications

International Nuclear Information System (INIS)

Edgecumbe Summers, T.S.; Walsh, R.P.; Pernambuco-Wise, P.

1997-01-01

Cu-Nb and Cu-Ag nanocomposites have recently become of interest to pulse magnet designers because of their unusual combination of high strength with reasonable conductivity. In the as-cast condition, these conductors consist of two phases, one of almost pure Nb (or Ag) and the other almost pure Cu. When these castings are cold worked as in a wire-drawing operation for example, the two phases are drawn into very fine filaments which produce considerable strengthening without an unacceptable decrease in conductivity. Unfortunately, any increase in strength with operations such as wire drawing is accompanied by a reduction in the cross section of the billet, and thus far, no wires with strengths on the order of 1.5 GPa or more have been produced with cross sections large enough to be useful in magnet applications. Equal Channel Angular Extrusion (ECAE) is an innovative technique which allows for the refinement of the as-cast ingot structure without a reduction in the cross sectional dimensions. Samples processed by the ECAE technique prior to wire drawing should be stronger at a given wire diameter than those processed by wire drawing alone. The tensile properties of wire-drawn Cu-18%Nb and Cu-25%Ag both with and without prior ECAE processing were tested and compared at both room temperature and 77K. All samples were found to have resistivities consistent with their strengths, and the strengths of the ECAE-processed wires were significantly higher than their as-cast and drawn counterparts. Therefore, with ECAE processing prior to wire drawing, it appears to be possible to make high-strength conductors with adequately large cross sections for pulse magnets

Electron beam additive manufacturing with wire - Analysis of the process

Science.gov (United States)

Weglowski, Marek St.; Błacha, Sylwester; Pilarczyk, Jan; Dutkiewicz, Jan; Rogal, Łukasz

2018-05-01

The electron beam additive manufacturing process with wire is a part of global trend to find fast and efficient methods for producing complex shapes elements from costly metal alloys such as stainless steels, nickel alloys, titanium alloys etc. whose production by other conventional technologies is unprofitable or technically impossible. Demand for additive manufacturing is linked to the development of new technologies in the automotive, aerospace and machinery industries. The aim of the presented work was to carried out research on electron beam additive manufacturing with a wire as a deposited (filler) material. The scope of the work was to investigate the influence of selected technological parameters such as: wire feed rate, beam current, travelling speed, acceleration voltage on stability of the deposition process and geometric dimensions of the padding welds. The research revealed that, at low beam currents, the deposition process is unstable. The padding weld reinforcement is non-uniform. Irregularity of the width, height and straightness of the padding welds can be observed. At too high acceleration voltage and beam current, burn-through of plate and excess penetration weld can be revealed. The achieved results and gained knowledge allowed to produce, based on EBAM with wire process, whole structure from stainless steel.

Real-time monitoring of the laser hot-wire welding process

Science.gov (United States)

Liu, Wei; Liu, Shuang; Ma, Junjie; Kovacevic, Radovan

2014-04-01

The laser hot-wire welding process was investigated in this work. The dynamics of the molten pool during welding was visualized by using a high-speed charge-coupled device (CCD) camera assisted by a green laser as an illumination source. It was found that the molten pool is formed by the irradiation of the laser beam on the filler wire. The effect of the hot-wire voltage on the stability of the welding process was monitored by using a spectrometer that captured the emission spectrum of the laser-induced plasma plume. The spectroscopic study showed that when the hot-wire voltage is above 9 V a great deal of spatters occur, resulting in the instability of the plasma plume and the welding process. The effect of spatters on the plasma plume was shown by the identified spectral lines of the element Mn I. The correlation between the Fe I electron temperature and the weld-bead shape was studied. It was noted that the electron temperature of the plasma plume can be used to real-time monitor the variation of the weld-bead features and the formation of the weld defects.

Experimental study on manufacturing of grits-spiral- distribution electroplated wire saw

Directory of Open Access Journals (Sweden)

Yufei GAO

2016-12-01

Full Text Available In order to obtain high performance electroplating diamond wire saw, experimental studies are conducted for development of grits-spiral-distribution electroplated diamond wire saw using sand-suspend electroplating method. The influences of pre-plating cathode current density, grits electro-embedding cathode current density and time on composite deposite coating appearance and grits distribution of wire saw are analyzed, and the sawing experiment is carried out by using the trial wire saw. The results show that good bonding strength between the coating and the steel wire can be obtained when the adopted cathode current density is 5.0 A/dm2 at pre-plating stage; good coating and girts distribution can be obtained when the adopted cathode current density is 5.0 A/dm2 and the electroplating time is 7~8 min at grits electro-embedding stage. By winding insulation wire on the surface of steel wire and reasonably selecting technological parameters before pre-plating can make the diamond wire saw with grits-spiral-distribution on surface, and the new type of wire saw has a better crumbs-clearing effect in wire sawing process.

Advanced Process Possibilities in Friction Crush Welding of Aluminum, Steel, and Copper by Using an Additional Wire

Science.gov (United States)

Besler, Florian A.; Grant, Richard J.; Schindele, Paul; Stegmüller, Michael J. R.

2017-12-01

Joining sheet metal can be problematic using traditional friction welding techniques. Friction crush welding (FCW) offers a high speed process which requires a simple edge preparation and can be applied to out-of-plane geometries. In this work, an implementation of FCW was employed using an additional wire to weld sheets of EN AW5754 H22, DC01, and Cu-DHP. The joint is formed by bringing together two sheet metal parts, introducing a wire into the weld zone and employing a rotating disk which is subject to an external force. The requirements of the welding preparation and the fundamental process variables are shown. Thermal measurements were taken which give evidence about the maximum temperature in the welding center and the temperature in the periphery of the sheet metals being joined. The high welding speed along with a relatively low heat input results in a minimal distortion of the sheet metal and marginal metallurgical changes in the parent material. In the steel specimens, this FCW implementation produces a fine grain microstructure, enhancing mechanical properties in the region of the weld. Aluminum and copper produced mean bond strengths of 77 and 69 pct to that of the parent material, respectively, whilst the steel demonstrated a strength of 98 pct. Using a wire offers the opportunity to use a higher-alloyed additional material and to precisely adjust the additional material volume appropriate for a given material alignment and thickness.

Nuclear reactor fuel structure containing uranium alloy wires embedded in a metallic matrix plate

International Nuclear Information System (INIS)

Travelli, A.

1988-01-01

A nuclear fuel-containing plate structure for a nuclear reactor is described; such structure comprising a pair of malleable metallic non-fissionable matrix plates having confronting surfaces which are pressure bonded together and fully united to form a bonded surface, and elongated malleable wire-like fissionable fuel members separately confined and fully enclosed between the matrix plates along the interface to afford a high fuel density as well as structural integrity and effective retention of fission products. The plates have separate recesses formed in the confronting surfaces for closely receiving the wire-like fissionable fuel members. The wire-like fissionable fuel members are made of a maleable uranium alloy capable of being formed into elongated wire-like members and capable of withstanding pressure bonding. The wire-like fissionable fuel members are completely separated and isolated by fully united portions of the interface

Composite conductor containing superconductive wires

Energy Technology Data Exchange (ETDEWEB)

Larson, W.L.; Wong, J.

1974-03-26

A superconductor cable substitute made by coworking multiple rods of superconductive niobium--titanium or niobium--zirconium alloy with a common copper matrix to extend the copper and rods to form a final elongated product which has superconductive wires distributed in a reduced cross-section copper conductor with a complete metallurgical bond between the normal-conductive copper and the superconductor wires contained therein is described. The superconductor cable can be in the form of a tube.

Large critical current density improvement in Bi-2212 wires through the groove-rolling process

International Nuclear Information System (INIS)

Malagoli, A; Bernini, C; Braccini, V; Romano, G; Putti, M; Chaud, X; Debray, F

2013-01-01

Recently there has been a growing interest in Bi-2212 superconductor round wire for high magnetic field use despite the fact that an increase of the critical current is still needed to boost its successful use in such applications. Recent studies have demonstrated that the main obstacle to current flow, especially in long wires, is the residual porosity inside these powder-in-tube processed conductors that develops from bubble agglomeration when the Bi-2212 melts. In this work we tried to overcome this issue affecting the wire densification by changing the deformation process. Here we show the effects of groove rolling versus the drawing process on the critical current density J C and on the microstructure. In particular, groove-rolled multifilamentary wires show a J C increased by a factor of about 3 with respect to drawn wires prepared with the same Bi-2212 powder and architecture. We think that this approach in the deformation process is able to produce the required improvements both because the superconducting properties are enhanced and because it makes the fabrication process faster and cheaper. (paper)

Development and manufacturing of bronze-processed Ta-added Nb3Sn wires for the ITER

International Nuclear Information System (INIS)

Kikuchi, Kenichi; Seidou, Masahiro; Iwaki, Genzou; Sakai, Syuuji; Moriai, Hidezumi; Nishi, Masataka; Yoshida, Kiyoshi; Isono, Takaaki; Tsuji, Hiroshi.

1997-01-01

Development work to produce a high-performance Nb 3 Sn superconducting wire for the center solenoid coil of the ITER was carried out. The effects of concurrently adding Ti and Ta to bronze-processed Nb 3 Sn wires were examined. In addition, a high-Sn-concentration bronze matrix was applied. Then, the relation between hysteresis loss and filament diameter was examined. Moreover, the cause of wire breakage during processing was elucidated. As a result, a reliable manufacturing process for high-performance Nb 3 Sn superconducting wire was established. (author)

Investigations on the wire saw process on steels of selected geometries in the encircling process

International Nuclear Information System (INIS)

Knecht, Daniel

2015-01-01

This thesis illustrates a new and innovative model for the usual looping method to describe cutting time and wear. Several test series have been carried out to determine and analyze the various influencing factors. This new model now allows for exact predictions for cutting times and the resulting wear. A special test stand was planned and built. With the help of this test stand various influencing parameters were determined in preliminary tests. Due to the high correlation between these parameters, a matrix was created to rate them. From these results and the findings of the preliminary tests, the boundary conditions such as work piece size were defined and an experimental design was created. Eleven test series were conducted and each one consists of up to ten work pieces. In each test series, only one parameter was changed, the other influencing parameters remained unchanged. The parameter of the following characteristics were varied: the speed of the diamond wire, the feed pressure, the cutting angle, the geometry with respective cutting area, the work piece material, as well as the twisting of the diamond wire. By varying these parameters, the influence could be shown on the performance of the cutting process and also on the wear behavior of the diamond wire. A model was created from the obtained data which enables a cutting time prediction for rectangular work pieces. In addition to the model, a new criterion has been developed, with which it is possible to quantify the progress of wear and to be able to determine a necessary wire replacement. The classification of particle sizes of the accumulated chips has shown that a lower average cutting performance results in a decrease of the average particle size. From this circumstance a termination criterion of <150 μm has been established. When the particle size drops below this value, the cutting process becomes ineffective and should not be continued, or the diamond wire should be replaced, respectively

Mechanical properties of intermetallics formed during thermal aging of Cu-Al ball bonds

NARCIS (Netherlands)

Kouters, M.H.M.; Gubbels, G.H.M.; O'Halloran, O.; Rongen, R.; Weltevreden, E.R.

2011-01-01

In high power automotive electronics copper wire bonding is regarded as most promising alternative for gold wire bonding in 1st level interconnects and therefore subjected to severe functional requirements. In the Cu-Al ball bond interface the growth of intermetallic compounds may deteriorate the

Study Of The Wet Multipass Drawing Process Applied On High Strength Thin Steel Wires

Science.gov (United States)

Thimont, J.; Felder, E.; Bobadilla, C.; Buessler, P.; Persem, N.; Vaubourg, JP.

2011-05-01

Many kinds of high strength thin steel wires are involved in so many applications. Most of the time, these wires are made of a pearlitic steel grade. The current developments mainly concern the wire last drawing operation: after a patenting treatment several reduction passes are performed on a slip-type multipass drawing machine. This paper focuses on modeling this multipass drawing process: a constitutive law based on the wire microstructure evolutions is created, a mechanical study is performed, a set of experiments which enables determining the process friction coefficients is suggested and finally the related analytical model is introduced. This model provides several general results about the process and can be used in order to set the drawing machines.

Scaleup of powder metallurgy processed Nb-Al multifilamentary wire

International Nuclear Information System (INIS)

Thieme, C.; Foner, S.; Otubo, J.; Pourrahimi, S.; Schwartz, B.; Zhang, H.

1983-01-01

Power metallurgy processed Nb-Al superconducting wires were fabricated from billets up to 45 mm o.d. with nominal areal reduction ratios, R, up to 2 X 10 5 , Nb powder sizes from 40 to 300 μm from various sources, Al powder sizes from 9 to 75 μm, Al concentrations from 3 to 25 wt % Al and with a wide range of heat treatments. All the compacts used tap density powder in a Cu tube and swaging and/or rod rolling and subsequent wire drawing. Both single strand and bundled wires were made. Overall critical current densities, J /SUB c/, of 2 X 10 4 A/cm 2 at 14 T and 10 4 A/cm 2 at 16 T were achieved for 6 to 8 wt % Al in Nb

Influence of Wire Electrical Discharge Machining (WEDM) process parameters on surface roughness

Science.gov (United States)

Yeakub Ali, Mohammad; Banu, Asfana; Abu Bakar, Mazilah

2018-01-01

In obtaining the best quality of engineering components, the quality of machined parts surface plays an important role. It improves the fatigue strength, wear resistance, and corrosion of workpiece. This paper investigates the effects of wire electrical discharge machining (WEDM) process parameters on surface roughness of stainless steel using distilled water as dielectric fluid and brass wire as tool electrode. The parameters selected are voltage open, wire speed, wire tension, voltage gap, and off time. Empirical model was developed for the estimation of surface roughness. The analysis revealed that off time has a major influence on surface roughness. The optimum machining parameters for minimum surface roughness were found to be at a 10 V open voltage, 2.84 μs off time, 12 m/min wire speed, 6.3 N wire tension, and 54.91 V voltage gap.

Development of Powder-in-Tube Processed Iron Pnictide Wires and Tapes

KAUST Repository

Ma, Yanwei

2011-06-01

The development of PIT fabrication process of iron pnictide superconducting wires and tapes has been reviewed. Silver was found to be the best sheath material, since no reaction layer was observed between the silver sheath and the superconducting core. The grain connectivity of iron pnictide wires and tapes has been markedly improved by employing Ag or Pb as dopants. At present, critical current densities in excess of 3750 A /cm 2 (I c = 37.5 A) at 4.2 K have been achieved in Ag-sheathed SrKFeAs wires prepared with the above techniques, which is the highest value obtained in iron-based wires and tapes so far. Moreover, Ag-sheathed Sm-1111 superconducting tapes were successfully prepared by PIT method at temperatures as low as ̃ 900 °C, instead of commonly used temperatures of ̃ 1200 °C. These results demonstrate the feasibility of producing superconducting pnictide composite wires, even grain boundary properties require much more attention. © 2010 IEEE.

Investigation of method for Stainless Steel Welding Wire as a Replacement for Arc Wire Comsumables

Directory of Open Access Journals (Sweden)

Koiprasert, H.

2005-01-01

Full Text Available Arc spraying as a coating method is being employed in various industrial applications as a part of maintenance service, and also as a surface engineering technique for many machine parts and components. The major cost in producing the arc spray coating is, however, based on the cost of the arc wire comsumables. This project was carried out to investigate the use of the commercially-available gas metal arc welding wire (GMAW wire as a cheaper alternative to the special-purpose arc wire comsumables. The wire material chosen for this early study is the 316L stainless steel, due to its popularity in many applications as a built-up coating for worn parts. The physical properties of the coatings produced from the two sets of 316L stainless steel wire were determined to be different in the percentage of porosity and the oxide content. The mechanical properties, including the tensile bond strength and the wear rate of the coatings produced from the two types of sprayed wire, were also different. This will, in turn, result in a slight difference in the performance of thecoatings.

Reduction of tensile residual stresses during the drawing process of tungsten wires

International Nuclear Information System (INIS)

Rodriguez Ripoll, Manel; Weygand, Sabine M.; Riedel, Hermann

2010-01-01

Tungsten wires are commonly used in the lighting industry as filaments for lamps. During the drawing process, the inhomogeneous deformation imparted by the drawing die causes tensile residual stresses at the wire surface in circumferential direction. These stresses have a detrimental effect for the wire because they are responsible for driving longitudinal cracks, known as splits. This work proposes two methods for reducing the residual stresses during wire drawing, namely applying an advanced die geometry and performing an inexpensive post-drawing treatment based on targeted bending operations. These two methods are analyzed with finite element simulations using material parameters obtained by mechanical tests on tungsten wires at different temperatures as input data. The computed results predict a substantial reduction of the circumferential residual stresses, thus reducing the risk of splitting.

Improvement of the auto wire feeder machine in a de-soldering process

Directory of Open Access Journals (Sweden)

Niramon Nonkhukhetkhong

2016-10-01

Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

Evaluation of mechanical properties in metal wire mesh supported selective catalytic reduction (SCR) catalyst structures

Science.gov (United States)

Rajath, S.; Siddaraju, C.; Nandakishora, Y.; Roy, Sukumar

2018-04-01

The objective of this research is to evaluate certain specific mechanical properties of certain stainless steel wire mesh supported Selective catalytic reduction catalysts structures wherein the physical properties of the metal wire mesh and also its surface treatments played vital role thereby influencing the mechanical properties. As the adhesion between the stainless steel wire mesh and the catalyst material determines the bond strength and the erosion resistance of catalyst structures, surface modifications of the metal- wire mesh structure in order to facilitate the interface bonding is therefore very important to realize enhanced level of mechanical properties. One way to enhance such adhesion properties, the stainless steel wire mesh is treated with the various acids, i.e., chromic acid, phosphoric acid including certain mineral acids and combination of all those in various molar ratios that could generate surface active groups on metal surface that promotes good interface structure between the metal- wire mesh and metal oxide-based catalyst material and then the stainless steel wire mesh is dipped in the glass powder slurry containing some amount of organic binder. As a result of which the said catalyst material adheres to the metal-wire mesh surface more effectively that improves the erosion profile of supported catalysts structure including bond strength.

Production of diamond wire by Cu15 v-% Nb 'in situ' process

International Nuclear Information System (INIS)

Filgueira, M.; Pinatti, D.G.

2001-01-01

Diamond wires are cutting tools used in the slabbing of dimension stones, such as marbles and granites, as well as in cutting of concrete structures. This tool consists of a steel cable on which diamond annular segments (pearls) are mounted with spacing between them. This work has developed a new technological route to obtain the diamond wires, whose fabrication involves metal forming processes such as rotary forging and wire drawing, copper tubes restacking, and thermal treatments of sintering and recrystallization. It was idealized the use of Cu 15v% Nb composite wires as the high tensile strength cable, covered with an external cutting rope made of bronze 4wt% diamond composite, along the overall wire surface. Investigations were carried out on the mechanical behavior and on the microstructural evolution of the Cu 15 vol % Nb wires, which showed ultimate tensile strength (UTS) of 960 MPa and deformation of approximately 3,0 %. The cutting external rope of 1.84 mm in diameter showed UTS = 230 MPa. On the microstructural side aspect it was observed that the diamond crystals were uniformly distributed throughout the tool bulk in the several processing steps. Cutting tests were carried out starting with an external diamond rope of 1.93 mm in diameter, which cut a marble sectional area of 1188 cm 2 , and the tool degraded to a final diameter of 1.23 mm. For marble the 'in situ' wire showed a probable performance 4 times higher than the diamond saws, however their probable performance was about 5 to 8 times less than the conventional diamond wires due to the low abrasion resistance of the bronze matrix and the low adhesion between the pair bronze-diamond. (author)

Characterization of intermetallic compounds in Cu-Al ball bonds: layer growth, mechanical properties and oxidation

NARCIS (Netherlands)

Kouters, M.H.M.; Gubbels, G.H.M.; O'Halloran, O.; Rongen, R.

2011-01-01

In high power automotive electronics copper wire bonding is regarded as most promising alternative for gold wire bonding in 1 st level interconnects and therefore subjected to severe functional requirements. In the Cu-Al ball bond interface the growth of intermetallic compounds may deteriorate the

High-strength high-conductivity Cu-Nb microcomposite sheet fabricated via multiple roll bonding

International Nuclear Information System (INIS)

Jha, S.C.; Delagi, R.G.; Forster, J.A.; Krotz, P.D.

1993-01-01

Copper-niobium microcomposites are a new class of high-strength high-conductivity materials that have attractive properties for room- and elevated-temperature applications. Since Nb has little solid solubility in Cu, addition of Nb to Cu does not affect its conductivity. Copper-niobium microcomposites are melted and cast so that the microstructure of cast Cu-Nb ingots consists of 1- to 10 μm Nb dendrites uniformly distributed within the copper matrix. Extensive wire drawing with a true processing strain (η> 12) of Cu-Nb alloy leads to refinement and elongation of Nb dendrites into 1- to 10 nm-thick filaments. The presence of such fine Nb filaments causes a significant increase in the strength of Cu-Nb wires. The tensile strength of heavily drawn Cu-Nb wires was determined to be significantly higher than the values predicted by the rule of mixtures. This article reports the fabrication of high-strength Cu-Nb microcomposite sheet by multiple roll bonding. It is difficult and impractical to attain high processing strains (η>3) by simple cold rolling. In most practical cold-rolling operation, the thickness reduction does not exceed 90 pct (η ≅2). Therefore, innovative processing is required to generate high strength in Cu-Nb microcomposite sheet. Multiple roll bonding of Cu-Nb has been utilized to store high processing strain ( η>10) in the material and refine the Nb particle size within the copper matrix. This article describes the microstructure, mechanical properties, and thermal stability of roll-bonded Cu-Nb microcomposite sheet

Geometry characteristics modeling and process optimization in coaxial laser inside wire cladding

Science.gov (United States)

Shi, Jianjun; Zhu, Ping; Fu, Geyan; Shi, Shihong

2018-05-01

Coaxial laser inside wire cladding method is very promising as it has a very high efficiency and a consistent interaction between the laser and wire. In this paper, the energy and mass conservation law, and the regression algorithm are used together for establishing the mathematical models to study the relationship between the layer geometry characteristics (width, height and cross section area) and process parameters (laser power, scanning velocity and wire feeding speed). At the selected parameter ranges, the predicted values from the models are compared with the experimental measured results, and there is minor error existing, but they reflect the same regularity. From the models, it is seen the width of the cladding layer is proportional to both the laser power and wire feeding speed, while it firstly increases and then decreases with the increasing of the scanning velocity. The height of the cladding layer is proportional to the scanning velocity and feeding speed and inversely proportional to the laser power. The cross section area increases with the increasing of feeding speed and decreasing of scanning velocity. By using the mathematical models, the geometry characteristics of the cladding layer can be predicted by the known process parameters. Conversely, the process parameters can be calculated by the targeted geometry characteristics. The models are also suitable for multi-layer forming process. By using the optimized process parameters calculated from the models, a 45 mm-high thin-wall part is formed with smooth side surfaces.

Characterization of intermetallic compounds in Cu-Al ball bonds: thermo-mechanical properties, interface delamination and corrosion

NARCIS (Netherlands)

Gubbels, G.H.M.; Kouters, M.H.M.; Dos Santos Ferreira, O.

2012-01-01

In high power automotive electronics copper wire bonding is regarded as the most promising alternative for gold wire bonding in 1st level interconnects. In the Cu-Al ball bond interface the growth of intermetallic compounds can deteriorate the electrical and mechanical properties of the

Preparation of the Wire of ZChSnSb11-6 Used for Remanufacturing Thermal Spraying

Science.gov (United States)

Zhang, B.; Yang, Z. Y.; Fu, D. X.; Li, X. F.; Chen, W.

Tin base Babbitt alloy widely used in bearing bush production and repair, the performance of ZChSnSb11-6 is better than ZChSnSb8-4.But as a result of as-cast structure of ZChSnSb11-6 is rich in big hard phase, its processing performance is bad, in this paper, through the optimization of smelting, casting, extrusion, drawing and other processes we have been successfully prepared ZChSnSb11-6 wire suitable for thermal spraying. Through metallographic examination, micro hardness, bond strength and porosity testing, it was proved that the wire meet the requirements of bearing manufacturing thermal spraying.

Effect of Pd Surface Roughness on the Bonding Process and High Temperature Reliability of Au Ball Bonds

Science.gov (United States)

Huang, Y.; Kim, H. J.; McCracken, M.; Viswanathan, G.; Pon, F.; Mayer, M.; Zhou, Y. N.

2011-06-01

A 0.3- μm-thick electrolytic Pd layer was plated on 1 μm of electroless Ni on 1 mm-thick polished and roughened Cu substrates with roughness values ( R a) of 0.08 μm and 0.5 μm, respectively. The rough substrates were produced with sand-blasting. Au wire bonding on the Ni/Pd surface was optimized, and the electrical reliability was investigated under a high temperature storage test (HTST) during 800 h at 250°C by measuring the ball bond contact resistance, R c. The average value of R c of optimized ball bonds on the rough substrate was 1.96 mΩ which was about 40.0% higher than that on the smooth substrate. The initial bondability increased for the rougher surface, so that only half of the original ultrasonic level was required, but the reliability was not affected by surface roughness. For both substrate types, HTST caused bond healing, reducing the average R c by about 21% and 27%, respectively. Au diffusion into the Pd layer was observed in scanning transmission electron microscopy/ energy dispersive spectroscopy (STEM-EDS) line-scan analysis after HTST. It is considered that diffusion of Au or interdiffusion between Au and Pd can provide chemically strong bonding during HTST. This is supported by the R c decrease measured as the aging time increased. Cu migration was indicated in the STEM-EDS analysis, but its effect on reliability can be ignored. Au and Pd tend to form a complete solid solution at the interface and can provide reliable interconnection for high temperature (250°C) applications.

Processing and Characterization of Liquid-Phase Sintered NiTi Woven Structures

Science.gov (United States)

Erdeniz, Dinc; Weidinger, Ryan P.; Sharp, Keith W.; Dunand, David C.

2018-03-01

Porous NiTi is of interest for bone implants because of its unique combination of biocompatibility (encouraging osseointegration), high strength (to prevent fracture), low stiffness (to reduce stress shielding), and shape memory or superelasticity (to deploy an implant). A promising method for creating NiTi structures with regular open channels is via 3D weaving of NiTi wires. This paper presents a processing method to bond woven NiTi wire structures at contact points between wires to achieve structural integrity: (i) a slurry consisting of a blend of NiTi and Nb powders is deposited on the surface of the NiTi wires after the weaving operation; (ii) the powders are melted to create a eutectic liquid phase which collects at contact points; and (iii) the liquid is solidified and binds the NiTi woven structures. The bonded NiTi wire structures exhibited lower transformation temperatures compared to the as-woven NiTi wires because of Nb diffusion into the NiTi wires. A bonded woven sample was deformed in bending and showed near-complete recovery up to 6% strain and recovered nearly half of the deformation up to 19% strain.

Flux pinning in bronze-processed Nb3Sn wires

International Nuclear Information System (INIS)

Suenaga, M.; Welch, D.O.

1980-01-01

The scaling law derived by Kramer for magnetic flux pinning in high magnetic fields was examined for its applicability to the magnetic field dependence of critical-current densities in the bronze processed monofilamentary Nb 3 Sn wires. From this it was concluded that: (1) its prediction for the form of the dependence of critical current on magnetic field and grain size [/J vector /sub c/ x H vector/ approx. h/sup 1/2/(1-h) 2 (1-a 0 √rho) -2 ] was found to be very good in most cases including wires with very small Nb 3 Sn grains (approx. 400 A). It was found very useful in comparison of J/sub c/ for different wires and in extrapolating to obtain H/sub c2/ for these wires. (2) However, it could not account consistently for the anisotropy in critical current of a tape which was measured with H applied perpendicular and parallel to the tape face. (3) The values of kappa 1 which were determined with the scaling law were too small by a factor of 2 to 3, and the trend in the variation with heat-treating time was opposite to that which is reasonably to be expected. That the behavior of kappa 1 is thus seriously in contradiction with the expected behavior for Nb 3 Sn suggests basic faults in the derivation of the scaling equation for critical currents at high magnetic fields

In vivo biofilm formation on stainless steel bonded retainers during different oral health-care regimens

NARCIS (Netherlands)

Jongsma, Marije A.; van der Mei, Henny C.; Atema-Smit, Jelly; Busscher, Henk I.; Ren, Yijin

2015-01-01

Retention wires permanently bonded to the anterior teeth are used after orthodontic treatment to prevent the teeth from relapsing to pre-treatment positions. A disadvantage of bonded retainers is biofilm accumulation on the wires, which produces a higher incidence of gingival recession, increased

In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).

CERN Multimedia

Saba, A

2006-01-01

2 ladders are connected via a multi layer aluminium polyimide flexible cable with a multi chip module containing several custom designed ASICs. The production of the flexible cable was developed and carrier out at CERN. It provides signal and data lines as well as power to the individual readout chipswith a total thickness of only 220 microns. In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).

Novel magnetic wire fabrication process by way of nanoimprint lithography for current induced magnetization switching

Science.gov (United States)

Asari, Tsukasa; Shibata, Ryosuke; Awano, Hiroyuki

2017-05-01

Nanoimprint lithography (NIL) is an effective method to fabricate nanowire because it does not need expensive systems and this process is easier than conventional processes. In this letter, we report the Current Induced Magnetization Switching (CIMS) in perpendicularly magnetized Tb-Co alloy nanowire fabricated by NIL. The CIMS in Tb-Co alloy wire was observed by using current pulse under in-plane external magnetic field (HL). We successfully observed the CIMS in Tb-Co wire fabricated by NIL. Additionally, we found that the critical current density (Jc) for the CIMS in the Tb-Co wire fabricated by NIL is 4 times smaller than that fabricated by conventional lift-off process under HL = 200Oe. These results indicate that the NIL is effective method for the CIMS.

Analytical methods to characterize heterogeneous raw material for thermal spray process: cored wire Inconel 625

Science.gov (United States)

Lindner, T.; Bonebeau, S.; Drehmann, R.; Grund, T.; Pawlowski, L.; Lampke, T.

2016-03-01

In wire arc spraying, the raw material needs to exhibit sufficient formability and ductility in order to be processed. By using an electrically conductive, metallic sheath, it is also possible to handle non-conductive and/or brittle materials such as ceramics. In comparison to massive wire, a cored wire has a heterogeneous material distribution. Due to this fact and the complex thermodynamic processes during wire arc spraying, it is very difficult to predict the resulting chemical composition in the coating with sufficient accuracy. An Inconel 625 cored wire was used to investigate this issue. In a comparative study, the analytical results of the raw material were compared to arc sprayed coatings and droplets, which were remelted in an arc furnace under argon atmosphere. Energy-dispersive X-ray spectroscopy (EDX) and X-ray fluorescence (XRF) analysis were used to determine the chemical composition. The phase determination was performed by X-ray diffraction (XRD). The results were related to the manufacturer specifications and evaluated in respect to differences in the chemical composition. The comparison between the feedstock powder, the remelted droplets and the thermally sprayed coatings allows to evaluate the influence of the processing methods on the resulting chemical and phase composition.

The Effects of Operational Parameters on a Mono-wire Cutting System: Efficiency in Marble Processing

Science.gov (United States)

Yilmazkaya, Emre; Ozcelik, Yilmaz

2016-02-01

Mono-wire block cutting machines that cut with a diamond wire can be used for squaring natural stone blocks and the slab-cutting process. The efficient use of these machines reduces operating costs by ensuring less diamond wire wear and longer wire life at high speeds. The high investment costs of these machines will lead to their efficient use and reduce production costs by increasing plant efficiency. Therefore, there is a need to investigate the cutting performance parameters of mono-wire cutting machines in terms of rock properties and operating parameters. This study aims to investigate the effects of the wire rotational speed (peripheral speed) and wire descending speed (cutting speed), which are the operating parameters of a mono-wire cutting machine, on unit wear and unit energy, which are the performance parameters in mono-wire cutting. By using the obtained results, cuttability charts for each natural stone were created on the basis of unit wear and unit energy values, cutting optimizations were performed, and the relationships between some physical and mechanical properties of rocks and the optimum cutting parameters obtained as a result of the optimization were investigated.

Effect on deformation process of adding a copper core to multifilament MgB2 superconducting wire

DEFF Research Database (Denmark)

Hancock, Michael Halloway; Bay, Niels

2007-01-01

Using the PIT method, multifilament wire with different packing strategies has been manufactured. In all, three types of wire have been investigated, a 19-filament configuration using ex-situ powder in an Fe-matrix and two 8-filament configurations in an Fe-matrix applying a copper core, one using....... This finding is supported by numerical simulations of the deformation process which indicate that tensile stresses are. concentrated around the middle of the wire during the drawing process. As such, strategic packing of the multifilament configuration can reduce the need for annealing during the mechanical...

Attaching Copper Wires to Magnetic-Reed-Switch Leads

Science.gov (United States)

Kamila, Rudolf

1987-01-01

Bonding method reliably joins copper wires to short iron-alloy leads from glass-encased dry magnetic-reed switch without disturbing integrity of glass-to-metal seal. Joint resistant to high temperatures and has low electrical resistance.

Modeling and simulation of the fluid flow in wire electrochemical machining with rotating tool (wire ECM)

Science.gov (United States)

Klocke, F.; Herrig, T.; Zeis, M.; Klink, A.

2017-10-01

Combining the working principle of electrochemical machining (ECM) with a universal rotating tool, like a wire, could manage lots of challenges of the classical ECM sinking process. Such a wire-ECM process could be able to machine flexible and efficient 2.5-dimensional geometries like fir tree slots in turbine discs. Nowadays, established manufacturing technologies for slotting turbine discs are broaching and wire electrical discharge machining (wire EDM). Nevertheless, high requirements on surface integrity of turbine parts need cost intensive process development and - in case of wire-EDM - trim cuts to reduce the heat affected rim zone. Due to the process specific advantages, ECM is an attractive alternative manufacturing technology and is getting more and more relevant for sinking applications within the last few years. But ECM is also opposed with high costs for process development and complex electrolyte flow devices. In the past, few studies dealt with the development of a wire ECM process to meet these challenges. However, previous concepts of wire ECM were only suitable for micro machining applications. Due to insufficient flushing concepts the application of the process for machining macro geometries failed. Therefore, this paper presents the modeling and simulation of a new flushing approach for process assessment. The suitability of a rotating structured wire electrode in combination with an axial flushing for electrodes with high aspect ratios is investigated and discussed.

Arc Interference Behavior during Twin Wire Gas Metal Arc Welding Process

Directory of Open Access Journals (Sweden)

Dingjian Ye

2013-01-01

Full Text Available In order to study arc interference behavior during twin wire gas metal arc welding process, the synchronous acquisition system has been established to acquire instantaneous information of arc profile including dynamic arc length variation as well as relative voltage and current signals. The results show that after trailing arc (T-arc is added to the middle arc (M-arc in a stable welding process, the current of M arc remains unchanged while the agitation increases; the voltage of M arc has an obvious increase; the shape of M arc changes, with increasing width, length, and area; the transfer frequency of M arc droplet increases and the droplet itself becomes smaller. The wire extension length of twin arc turns out to be shorter than that of single arc welding.

Novel magnetic wire fabrication process by way of nanoimprint lithography for current induced magnetization switching

Directory of Open Access Journals (Sweden)

Tsukasa Asari

2017-05-01

Full Text Available Nanoimprint lithography (NIL is an effective method to fabricate nanowire because it does not need expensive systems and this process is easier than conventional processes. In this letter, we report the Current Induced Magnetization Switching (CIMS in perpendicularly magnetized Tb-Co alloy nanowire fabricated by NIL. The CIMS in Tb-Co alloy wire was observed by using current pulse under in-plane external magnetic field (HL. We successfully observed the CIMS in Tb-Co wire fabricated by NIL. Additionally, we found that the critical current density (Jc for the CIMS in the Tb-Co wire fabricated by NIL is 4 times smaller than that fabricated by conventional lift-off process under HL = 200Oe. These results indicate that the NIL is effective method for the CIMS.

Tunable smart digital structure (SDS) to modularly assemble soft actuators with layered adhesive bonding

Science.gov (United States)

Jin, Hu; Dong, Erbao; Xu, Min; Xia, Qirong; Liu, Shuai; Li, Weihua; Yang, Jie

2018-01-01

Many shape memory alloy (SMA)-based soft actuators have specific composite structures and manufacture processes, and are therefore unique. However, these exclusive characteristics limit their capabilities and applications, so in this article a soft and smart digital structure (SDS) is proposed that acts like a modular unit to assemble soft actuators by a layered adhesive bonding process. The SDS is a fully soft structure that encapsulates a digital skeleton consisting of four groups of parallel and independently actuated SMA wires capable of outputting a four-channel tunable force. The layered adhesive bonding process modularly bonds several SDSs with an elastic backbone to fabricate a layered soft actuator where the elastic backbone is used to recover the SDSs in a cooling process using the SMA wires. Two kinds of SDS-based soft actuators were modularly assembled, an actuator, SDS-I, with a two-dimensional reciprocal motion, and an actuator, SDS-II, capable of bi-directional reciprocal motion. The thermodynamics and phase transformation modeling of the SDS-based actuator were analyzed. Several extensional soft actuators were also assembled by bonding the SDS with an anomalous elastic backbone or modularly assembling the SDS-Is and SDS-IIs. These modularly assembled soft actuators delivered more output channels and a complicated motion, e.g., an actinomorphic soft actuator with four SDS-Is jumps in a series of hierarchical heights and directional movement by tuning the input channels of the SDSs. This result showed that the SDS can modularly assemble multifarious soft actuators with diverse capabilities, steerability and tunable outputs.

Forming Refractory Insulation On Copper Wire

Science.gov (United States)

Setlock, J.; Roberts, G.

1995-01-01

Alternative insulating process forms flexible coat of uncured refractory insulating material on copper wire. Coated wire formed into coil or other complex shape. Wire-coating apparatus forms "green" coat on copper wire. After wire coiled, heating converts "green" coat to refractory electrical insulator. When cured to final brittle form, insulating material withstands temperatures above melting temperature of wire. Process used to make coils for motors, solenoids, and other electrical devices to be operated at high temperatures.

Concerning the problem of polygraphic wire calculation: theoretical aspects, software, practical implementation

Directory of Open Access Journals (Sweden)

Selkina A. V.

2016-05-01

Full Text Available the article analyzes the problems arising while organizing the workflow in printing companies. We suggest to address these problems by means of implementing computer-based accounting systems. Online and offline calculators used by printing enterprises for accounting are discussed. The author outlined the functional and specified requirements to such software. They were considered in the calculation module of accounting polygraphic wire used for block bonding. The software allows to increase the calculation process speed, to reduce the amount of errors in calculation and to decrease the labour intensity of the accounting process.

The Analysis of Force Parameters in Drawing Process of High Carbon Steel Wires in Conventional and Hydrodynamic Dies

Directory of Open Access Journals (Sweden)

Suliga M.

2017-12-01

Full Text Available The paper analyzes force parameters in the process of multistage drawing of steel wires in conventional and hydrodynamic dies. The drawing process of the wire rod with a diameter of 5.5 mm for wires with a diameter of 1.70 mm was performed in 12 drafts with the usage of the multistage drawbench Koch KGT with the speed range of 5-25 m/s.

Investigation of the degradation mechanism of catalytic wires during oxidation of ammonia process

International Nuclear Information System (INIS)

Pura, Jarosław; Wieciński, Piotr; Kwaśniak, Piotr; Zwolińska, Marta; Garbacz, Halina; Zdunek, Joanna; Laskowski, Zbigniew; Gierej, Maciej

2016-01-01

Highlights: • Degradation mechanisms of precious metal catalytic gauzes is proposed. • Significant change of gauzes morphology and chemical composition was observed. • Samples were analyzed using SEM, EDS and micro-XCT techniques. - Abstract: The most common catalysts for the ammonia oxidation process are 80 μm diameter platinum-rhodium wires knitted or woven into the form of a gauze. In an aggressive environment and under extreme conditions (temperature 800–900 °C, intensive gas flow, high pressure) precious elements are drained from the surface of the wires. Part of this separated material quickly decomposes on the surface in the form of characteristic “cauliflower-shape protrusions”. The rest of the platinum is captured by palladium-nickel catalytic-capture gauzes located beneath. In our investigation we focused on the effects of the degradation of gauzes from one industrial catalytic system. The aim of the study was to compare the degree and the mechanism of degradation of gauzes from a different part of the reactor. The study covered PtRh7 catalytic and PdNi5 catalytic-capture gauzes. X-ray computer microtomography investigation revealed that despite strong differences in morphology, each Pt-Rh wire has a similar specific surface area. This indicates that the oxidation process and morphological changes of the wires occur in a self-regulating balance, resulting in the value of the specific surface area of the catalyst. Microtomography analysis of Pd-Ni wires revealed strong redevelopment of the wires’ surface, which is related to the platinum capture phenomenon. Scanning electron microscope observations also revealed the nanostructure in the cauliflower-shape protrusions and large grains in the wires’ preserved cores. The high temperature in the reactor and the long-term nature of the process do not favor the occurrence of the nanostructure in this type of material. Further and detailed analysis of this phenomena will provide a better

Investigation of the degradation mechanism of catalytic wires during oxidation of ammonia process

Energy Technology Data Exchange (ETDEWEB)

Pura, Jarosław, E-mail: jaroslawpura@gmail.com [Faculty of Material Science and Engineering, Warsaw University of Technology, Wołoska 141, 02-507 Warsaw (Poland); Wieciński, Piotr; Kwaśniak, Piotr; Zwolińska, Marta; Garbacz, Halina; Zdunek, Joanna [Faculty of Material Science and Engineering, Warsaw University of Technology, Wołoska 141, 02-507 Warsaw (Poland); Laskowski, Zbigniew; Gierej, Maciej [Precious Metal Mint, Weteranów 95, 05-250 Radzymin (Poland)

2016-12-01

Highlights: • Degradation mechanisms of precious metal catalytic gauzes is proposed. • Significant change of gauzes morphology and chemical composition was observed. • Samples were analyzed using SEM, EDS and micro-XCT techniques. - Abstract: The most common catalysts for the ammonia oxidation process are 80 μm diameter platinum-rhodium wires knitted or woven into the form of a gauze. In an aggressive environment and under extreme conditions (temperature 800–900 °C, intensive gas flow, high pressure) precious elements are drained from the surface of the wires. Part of this separated material quickly decomposes on the surface in the form of characteristic “cauliflower-shape protrusions”. The rest of the platinum is captured by palladium-nickel catalytic-capture gauzes located beneath. In our investigation we focused on the effects of the degradation of gauzes from one industrial catalytic system. The aim of the study was to compare the degree and the mechanism of degradation of gauzes from a different part of the reactor. The study covered PtRh7 catalytic and PdNi5 catalytic-capture gauzes. X-ray computer microtomography investigation revealed that despite strong differences in morphology, each Pt-Rh wire has a similar specific surface area. This indicates that the oxidation process and morphological changes of the wires occur in a self-regulating balance, resulting in the value of the specific surface area of the catalyst. Microtomography analysis of Pd-Ni wires revealed strong redevelopment of the wires’ surface, which is related to the platinum capture phenomenon. Scanning electron microscope observations also revealed the nanostructure in the cauliflower-shape protrusions and large grains in the wires’ preserved cores. The high temperature in the reactor and the long-term nature of the process do not favor the occurrence of the nanostructure in this type of material. Further and detailed analysis of this phenomena will provide a better

Filament to filament bridging and its influence on developing high critical current density in multifilamentary Bi2Sr2CaCu2Ox round wires

International Nuclear Information System (INIS)

Shen, T; Jiang, J; Kametani, F; Trociewitz, U P; Larbalestier, D C; Schwartz, J; Hellstrom, E E

2010-01-01

Increasing the critical current density (J c ) of the multifilamentary round wire Ag/Bi 2 Sr 2 CaCu 2 O x (2212) requires understanding its complicated microstructure, in which extensive bridges between filaments are prominent. In this first through-process quench study of 2212 round wire, we determined how its microstructure develops during a standard partial-melt process and how filament bridging occurs. We found that filaments can bond together in the melt state. As 2212 starts to grow on subsequent cooling, we observed that two types of 2212 bridges form. One type, which we call Type-A bridges, forms within filaments that bonded in the melt; Type-A bridges are single grains that span multiple bonded filaments. The other type, called Type-B bridges, form between discrete filaments through 2212 outgrowths that penetrate into the Ag matrix and intersect with other 2212 outgrowths from adjacent filaments. We believe the ability of these two types of bridges to carry inter-filament current is intrinsically different: Type-A bridges are high- J c inter-filament paths whereas Type-B bridges contain high-angle grain boundaries and are typically weak linked. Slow cooling leads to more filament bonding, more Type-A bridges and a doubling of J c without changing the flux pinning. We suggest that Type-A bridges create a 3D current flow that is vital to developing high J c in multifilamentary 2212 round wire.

Using wire shaping techniques and holographic optics to optimize deposition characteristics in wire-based laser cladding.

Science.gov (United States)

Goffin, N J; Higginson, R L; Tyrer, J R

2016-12-01

In laser cladding, the potential benefits of wire feeding are considerable. Typical problems with the use of powder, such as gas entrapment, sub-100% material density and low deposition rate are all avoided with the use of wire. However, the use of a powder-based source material is the industry standard, with wire-based deposition generally regarded as an academic curiosity. This is because, although wire-based methods have been shown to be capable of superior quality results, the wire-based process is more difficult to control. In this work, the potential for wire shaping techniques, combined with existing holographic optical element knowledge, is investigated in order to further improve the processing characteristics. Experiments with pre-placed wire showed the ability of shaped wire to provide uniformity of wire melting compared with standard round wire, giving reduced power density requirements and superior control of clad track dilution. When feeding with flat wire, the resulting clad tracks showed a greater level of quality consistency and became less sensitive to alterations in processing conditions. In addition, a 22% increase in deposition rate was achieved. Stacking of multiple layers demonstrated the ability to create fully dense, three-dimensional structures, with directional metallurgical grain growth and uniform chemical structure.

Composite superconducting MgB2 wires made by continuous process

NARCIS (Netherlands)

Kutukcu, Mehmet; Atamert, Serdar; Scandella, Jean Louis; Hopstock, Ron; Blackwood, Alexander C.; Dhulst, Chris; Mestdagh, Jan; Nijhuis, Arend; Glowacki, Bartek A.

Previously developed manufacturing technology of a low-cost composite single core MgB2 superconductive wires has been investigated in details using monel sheath and titanium diffusion barrier. In this process Mg and nano-sized B as well as SiC dopant powders were fed continuously to a "U" shaped

Composite superconducting MgB2 wires made by continuous process

NARCIS (Netherlands)

Kutukcu, Mehmet; Atamert, Serdar; Scandella, Jean Louis; Hopstock, Ron; Blackwood, Alexander C.; Dhulst, Chris; Mestdagh, Jan; Nijhuis, Arend; Glowacki, Bartek A.

2018-01-01

Previously developed manufacturing technology of a low-cost composite single core MgB2 superconductive wires has been investigated in details using monel sheath and titanium diffusion barrier. In this process Mg and nano-sized B as well as SiC dopant powders were fed continuously to a "U" shaped

Modeling the wire-EDM process parameters for EN-8 carbon steel ...

African Journals Online (AJOL)

Modeling the wire-EDM process parameters for EN-8 carbon steel using .... The neural networks has been developed with the help of MATLAB 8.1 (R13) package .... Now, Simulation and Prediction will be performed using the trained network.

Nonperfect synchronization of bond-forming and bond-rupturing processes in the reaction H + H2 → H2 + H

International Nuclear Information System (INIS)

Chandra, A.K.; Rao, V.S.

1996-01-01

The simplest prototypical hydrogen transfer reaction, i.e., H + H 2 → H 2 + H, is studied by the quantum-mechanical ab initio methods. Results reveal that during this reaction free valence which almost equals the square of the spin density develops on the migrating hydrogen atom. Bond orders are calculated using Mayer's formalism. Both the variations of bond orders and bond lengths along the reaction path are examined. This analysis reveals that the bond formation and bond cleavage processes in this reaction are not perfectly synchronous. The bond clevage process is slightly more advanced on the reaction path. 38 refs., 6 figs., 2 tabs

Wet-process Fabrication of Low-cost All-solid Wire-shaped Solar Cells on Manganese-plated Electrodes

International Nuclear Information System (INIS)

Fan, Xing; Zhang, Xiaoying; Zhang, Nannan; Cheng, Li; Du, Jun; Tao, Changyuan

2015-01-01

Highlights: • All-solid wire-shaped flexible solar cells are firstly assembled on low-cost Mn-plated fibers. • Energy efficiency improved by >27% after coating a layer of Mn on various substrates. • The cell is fabricated via wet process under low temperature and mild pH conditions. • Stable flexible solar cells are realized on lightweight and low-cost polymer fiber. - Abstract: All-solid wire-shaped flexible solar cells are assembled for the first time on low-cost Mn-plated wires through wet-process fabrication under low temperature and mild pH conditions. With a price cheap as the steel, metal Mn can be easily plated on almost any substrates, and evidently promote the photovoltaic efficiency of wire-shaped solar cells on various traditional metal wire substrates, such as Fe and Ti, by 27% and 65%, respectively. Flexible solar cell with much lower cost and weight is assembled on Mn-plated polymer substrate, and is still capable of giving better performance than that on Fe or Ti substrate. Both its mechanical and chemical stability are good for future weaving applications. Owing to the wire-type structure, such low-cost metals as Mn, which are traditionally regarded as unsuitable for solar cells, may provide new opportunities for highly efficient solar cells

Dynamic breaking of a single gold bond

DEFF Research Database (Denmark)

Pobelov, Ilya V.; Lauritzen, Kasper Primdal; Yoshida, Koji

2017-01-01

While one might assume that the force to break a chemical bond gives a measure of the bond strength, this intuition is misleading. If the force is loaded slowly, thermal fluctuations may break the bond before it is maximally stretched, and the breaking force will be less than the bond can sustain...... of a single Au-Au bond and show that the breaking force is dependent on the loading rate. We probe the temperature and structural dependencies of breaking and suggest that the paradox can be explained by fast breaking of atomic wires and slow breaking of point contacts giving very similar breaking forces....

Bonding Be to Cu alloys using a proprietary Brush Wellman process and new results for bonding Be to AlBeMet

Energy Technology Data Exchange (ETDEWEB)

Dombrowski, D.E. [Brush Wellman Inc., Cleveland, OH (United States)

1998-01-01

A novel process has been investigated for bonding of beryllium to copper alloys. The process is compatible with current manufacturing capabilities and can be readily scaled up from laboratory to production scale. The effect of process variations on the bond are shown. Also shown are several new approaches for direct bonding of beryllium to an AlBeMet interlayer. Bond strengths of Be/AlBeMet 162/Cu alloy couples are presented. (author)

A jelly-roll process for high temperature superconducting tapes and wires

International Nuclear Information System (INIS)

Tsuei, C.C.; Chi, C.C.; Frey, T.; Mitzi, D.B.; Kazyaka, T.; Haugan, T.; Ye, J.; Patel, S.; Shaw, D.T.; Wu, M.K.

1992-01-01

As an alternative to the powder-in-tube method, a new technique called the jelly-roll process is proposed for making high-T c superconducting tapes and wires. A normal-metal sheet coated with high-T c cuprate is configured in a jelly-roll fashion and cold worked into tapes or wires made of alternating cuprate superconductor and normal metal layers. The feasibility of this new process is demonstrated for both the YBa 2 Cu 3 O 7 /Ag and Bi 2 Sr 2 CaCu 2 O 8 /Ag composite systems. The role of reduction in the cross-sectional area by cold-rolling, heat treatment and oxygenation in optimizing T c and J c has been studied. Preliminary results indicate that partialmelt texturing, in the Bi 2 Sr 2 CaCu 2 O 8 /Ag system, results in a relatively field independent J c (H c (H = 0) ∝5 X 10 4 A cm -2 at 4.2 K

Nickel contaminated titanium weld wire study

International Nuclear Information System (INIS)

Coffin, G.R.; Sumstine, R.L.

1979-01-01

Attachment of thermocouples to fuel rod welding problems at Exxon Nuclear Company and INEL prompted an investigation study of the titanium filler wire material. It was found that the titanium filler wire was contaminated with nickel which was jacketed on the wire prior to the drawing process at the manufacturers. A method was developed to 100% inspect all filler wire for future welding application. This method not only indicates the presence of nickel contamination but indicates quantity of contamination. The process is capable of high speed inspection necessary for various high speed manufacturing processes

Ductile alloy and process for preparing composite superconducting wire

Science.gov (United States)

Verhoeven, J.D.; Finnemore, D.K.; Gibson, E.D.; Ostenson, J.E.

An alloy for the commercial production of ductile superconducting wire is prepared by melting together copper and at least 15 weight percent niobium under non-oxygen-contaminating conditions, and rapidly cooling the melt to form a ductile composite consisting of discrete, randomly distributed and oriented dendritic-shaped particles of niobium in a copper matrix. As the wire is worked, the dendritic particles are realigned parallel to the longitudinal axis and when drawn form a plurality of very fine ductile superconductors in a ductile copper matrix. The drawn wire may be tin coated and wound into magnets or the like before diffusing the tin into the wire to react with the niobium. Impurities such as aluminum or gallium may be added to improve upper critical field characteristics.

Magnetization processes in thin magnetic wires

International Nuclear Information System (INIS)

Varga, R.; Garcia, K.L.; Zhukov, A.; Vazquez, M.; Ipatov, M.; Gonzalez, J.; Zhukova, V.; Vojtanik, P.

2006-01-01

Amorphous magnetic microwires are novel materials, which are characterized by the unique magnetic properties. Their magnetization process runs through the depining and subsequent propagation of the single-domain wall. This allows us to study the magnetization processes of the single-domain wall either in static (when the domain wall lies in its potential) or dynamic (when the domain wall propagates along the wire) mode. In the given work, we present surprising results that were found during the single-domain wall switching and propagation in microwires. The negative critical propagation field during the propagation of the single-domain wall in microwires has been found. Moreover, new contribution (based on the structural relaxation) to the domain wall damping during its propagation in microwire was found. The complex shape of the single-domain wall potential, which consists of two contributions, has been found in microwires. The magnetoelastic one coming from the magnetoelastic interaction of the domain wall with the stresses applied on microwires and the stresses introduced during the microwire's production and stabilization one coming from the structural relaxation on atomic level

The wire rod superficial processing and the quality and environmental criterion

OpenAIRE

T. Karkoszka; D. Szewieczek

2008-01-01

Purpose: Purpose of the presented paper is meant to enlight the common points between the application ofpractically well-matched methods of investigation and opinion of quality and usage of the modern technical,technological or organizational solutions, in this issue in the technological processes of preparation the wire rodsurface to the plastic processing.Design/methodology/approach: Applied for the survey has comprised the adequate integrated expert methodsof technological processes’ analy...

Fabrication of Copper-Rich Cu-Al Alloy Using the Wire-Arc Additive Manufacturing Process

Science.gov (United States)

Dong, Bosheng; Pan, Zengxi; Shen, Chen; Ma, Yan; Li, Huijun

2017-12-01

An innovative wire-arc additive manufacturing (WAAM) process is used to fabricate Cu-9 at. pct Al on pure copper plates in situ, through separate feeding of pure Cu and Al wires into a molten pool, which is generated by the gas tungsten arc welding (GTAW) process. After overcoming several processing problems, such as opening the deposition molten pool on the extremely high-thermal conductive copper plate and conducting the Al wire into the molten pool with low feed speed, the copper-rich Cu-Al alloy was successfully produced with constant predesigned Al content above the dilution-affected area. Also, in order to homogenize the as-fabricated material and improve the mechanical properties, two further homogenization heat treatments at 1073 K (800 °C) and 1173 K (900 °C) were applied. The material and mechanical properties of as-fabricated and heat-treated samples were compared and analyzed in detail. With increased annealing temperatures, the content of precipitate phases decreased and the samples showed gradual improvements in both strength and ductility with little variation in microstructures. The present research opened a gate for in-situ fabrication of Cu-Al alloy with target chemical composition and full density using the additive manufacturing process.

Durability Evaluation of a Thin Film Sensor System With Enhanced Lead Wire Attachments on SiC/SiC Ceramic Matrix Composites

Science.gov (United States)

Lei, Jih-Fen; Kiser, J. Douglas; Singh, Mrityunjay; Cuy, Mike; Blaha, Charles A.; Androjna, Drago

2000-01-01

An advanced thin film sensor system instrumented on silicon carbide (SiC) fiber reinforced SiC matrix ceramic matrix composites (SiC/SiC CMCs), was evaluated in a Mach 0.3 burner rig in order to determine its durability to monitor material/component surface temperature in harsh environments. The sensor system included thermocouples in a thin film form (5 microns thick), fine lead wires (75 microns diameter), and the bonds between these wires and the thin films. Other critical components of the overall system were the heavy, swaged lead wire cable (500 microns diameter) that contained the fine lead wires and was connected to the temperature readout, and ceramic attachments which were bonded onto the CMCs for the purpose of securing the lead wire cables, The newly developed ceramic attachment features a combination of hoops made of monolithic SiC or SiC/SiC CMC (which are joined to the test article) and high temperature ceramic cement. Two instrumented CMC panels were tested in a burner rig for a total of 40 cycles to 1150 C (2100 F). A cycle consisted of rapid heating to 1150 C (2100 F), a 5 minute hold at 1150 C (2100 F), and then cooling down to room temperature in 2 minutes. The thin film sensor systems provided repeatable temperature measurements for a maximum of 25 thermal cycles. Two of the monolithic SiC hoops debonded during the sensor fabrication process and two of the SiC/SiC CMC hoops failed during testing. The hoops filled with ceramic cement, however, showed no sign of detachment after 40 thermal cycle test. The primary failure mechanism of this sensor system was the loss of the fine lead wire-to-thin film connection, which either due to detachment of the fine lead wires from the thin film thermocouples or breakage of the fine wire.

The role of oxide structure on copper wire to the rubber adhesion

Science.gov (United States)

Su, Yea-Yang; Shemenski, Robert M.

2000-07-01

Most metals have an oxide layer on the surface. However, the structure of the oxide varies with the matrix composition, and depends upon the environmental conditions. A bronze coating, nominal composition of 98.5% Cu and balance of Sn, is applied to steel wire for reinforcing pneumatic tire beads and to provide adhesion to rubber. This work studied the influence of copper oxides on the bronze coating on adhesion during vulcanization. To emphasize the oxide structures, electrolytic tough pitch (ETP) copper wire was used instead of the traditional bronze-coated tire bead wire. Experimental results confirmed the hypothesis that cuprous oxide (Cu 2O) could significantly improve bonding between copper wire and rubber, and demonstrated that the interaction between rubber and oxide layer on wire is an electrochemical reaction.

Investigation about the Chrome Steel Wire Arc Spray Process and the Resulting Coating Properties

Science.gov (United States)

Wilden, J.; Bergmann, J. P.; Jahn, S.; Knapp, S.; van Rodijnen, F.; Fischer, G.

2007-12-01

Nowadays, wire-arc spraying of chromium steel has gained an important market share for corrosion and wear protection applications. However, detailed studies are the basis for further process optimization. In order to optimize the process parameters and to evaluate the effects of the spray parameters DoE-based experiments had been carried out with high-speed camera shoots. In this article, the effects of spray current, voltage, and atomizing gas pressure on the particle jet properties, mean particle velocity and mean particle temperature and plume width on X46Cr13 wire are presented using an online process monitoring device. Moreover, the properties of the coatings concerning the morphology, composition and phase formation were subject of the investigations using SEM, EDX, and XRD-analysis. These deep investigations allow a defined verification of the influence of process parameters on spray plume and coating properties and are the basis for further process optimization.

Note: Recombination of H+ and OH− ions along water wires

International Nuclear Information System (INIS)

Lee, Song Hi; Rasaiah, Jayendran C.

2013-01-01

Transport and recombination of hydrogen and hydroxide ions along a hydrogen-bonded water wire are studied by molecular dynamics simulation using a dissociating model for water. The results are compared with a recent CP-MD study of neutralization in bulk water [A. Hassanali, M. K. Prakrash, H. Eshet, and M. Parrinello, Proc. Natl. Acad. Sci. U.S.A. 108, 20410 (2011)]. The translocation of H + and OH − along the wire is faster than in the bulk water, followed by compression of the water wire when two water molecules separate the transported ions. Neutralization occurs with the concerted transfer of three protons as in the bulk water, followed by energy dissipation along the water chain

Development of Statistical Process Control Methodology for an Environmentally Compliant Surface Cleaning Process in a Bonding Laboratory

Science.gov (United States)

Hutchens, Dale E.; Doan, Patrick A.; Boothe, Richard E.

1997-01-01

Bonding labs at both MSFC and the northern Utah production plant prepare bond test specimens which simulate or witness the production of NASA's Reusable Solid Rocket Motor (RSRM). The current process for preparing the bonding surfaces employs 1,1,1-trichloroethane vapor degreasing, which simulates the current RSRM process. Government regulations (e.g., the 1990 Amendments to the Clean Air Act) have mandated a production phase-out of a number of ozone depleting compounds (ODC) including 1,1,1-trichloroethane. In order to comply with these regulations, the RSRM Program is qualifying a spray-in-air (SIA) precision cleaning process using Brulin 1990, an aqueous blend of surfactants. Accordingly, surface preparation prior to bonding process simulation test specimens must reflect the new production cleaning process. The Bonding Lab Statistical Process Control (SPC) program monitors the progress of the lab and its capabilities, as well as certifies the bonding technicians, by periodically preparing D6AC steel tensile adhesion panels with EA-91 3NA epoxy adhesive using a standardized process. SPC methods are then used to ensure the process is statistically in control, thus producing reliable data for bonding studies, and identify any problems which might develop. Since the specimen cleaning process is being changed, new SPC limits must be established. This report summarizes side-by-side testing of D6AC steel tensile adhesion witness panels and tapered double cantilevered beams (TDCBs) using both the current baseline vapor degreasing process and a lab-scale spray-in-air process. A Proceco 26 inches Typhoon dishwasher cleaned both tensile adhesion witness panels and TDCBs in a process which simulates the new production process. The tests were performed six times during 1995, subsequent statistical analysis of the data established new upper control limits (UCL) and lower control limits (LCL). The data also demonstrated that the new process was equivalent to the vapor

Formation of InN atomic-size wires by simple N adsorption on the In/Si(111)–(4 × 1) surface

International Nuclear Information System (INIS)

Guerrero-Sánchez, J.; Takeuchi, Noboru

2016-01-01

Highlights: • N atoms on the surface form bonds with two In atoms and one Si atom. • Surface formation energy calculations show two stable structures with formation of InN atomic-size wires. • Projected density of states shows a tendency to form In−N and Si−N bonds on the surface. • Charge density corroborates the covalent character of the In−N bonds. - Abstract: We have carried out first principles total energy calculations to study the formation of InN atomic-size wires on the In/Si(111)–(4 × 1) surface. In its most favorable adsorption site, a single N atom forms InN arrangements. The deposit of 0.25 monolayers (MLs) of N atoms, result in the breaking of one of the original In chains and the formation of an InN atomic size wire. Increasing the coverage up to 0.5 ML of N atoms results in the formation of two of those wires. Calculated surface formation energies show that for N-poor conditions the most stable configuration is the original In/Si(111)–(4 × 1) surface with no N atoms. Increasing the N content, and in a reduced range of chemical potential, the formation of an InN wire is energetically favorable. Instead, from intermediate to N-rich conditions, two InN atomic wires are more stable. Projected density of states calculations have shown a trend to form covalent bonds between the In−p and N−p orbitals in these stable models.

Stress/strain characteristics of Cu alloy sheath in situ processed MgB2 superconducting wires

International Nuclear Information System (INIS)

Katagiri, Kazumune; Kasaba, Koichi; Shoji, Yoshitaka

2005-01-01

The mechanical properties of copper and copper alloy (Cu-Zr, Cu-Be and Cu-Cr) sheath in situ PIT-processed MgB 2 superconducting wires were studied at room temperature (RT) and 4.2 K. The effects of stress-strain on the critical current (I c ) of the wires have also been studied at 4.2 K and in magnetic fields up to 5 T. It has been clarified that alloying the Cu sheath significantly increases the yield and flow stresses of the wires at both RT and 4.2 K. The 0.5% flow stresses of the Cu alloy sheath wire were 147-237 MPa, whereas that of Cu was 55 MPa. At RT, serration corresponding to multiple cracking was observed around a strain of 0.4% and the stress-strain curves saturated beyond that point. The strain dependence of I c prior to the critical strain (ε irr ) was different depending on the magnetic field; being almost constant at 2 T and increasing with strain at 5 T. The I c decreased beyond ε irr , which is much larger for Cu alloy sheath wires as compared to Cu sheath wire. This is due to the difference in the residual compressive strain in the MgB 2 core during cooling from the heat-treatment temperature to 4.2 K, which is determined through relaxation by yielding in the sheath materials. The transverse compression tests revealed that the I c of the Cu alloy sheath wire did not degrade up to 314 MPa, which is also higher than that of Cu sheath wire. (author)

Wire rod coating process of gas diffusion layers fabrication for proton exchange membrane fuel cells

Energy Technology Data Exchange (ETDEWEB)

Kannan, A.M.; Sadananda, S.; Parker, D.; Munukutla, L. [Electronic Systems Department, Arizona State University, 7001 E Williams Field Road, Mesa, AZ 85212 (United States); Wertz, J. [Hollingsworth and Vose Co., A.K. Nicholson Research Lab, 219 Townsend Road West Groton, MA 01472 (United States); Thommes, M. [Quantachrome Instruments, 1900 Corporate Drive, Boynton Beach, FL 33426 (United States)

2008-03-15

Gas diffusion layers (GDLs) were fabricated using non-woven carbon paper as a macro-porous layer substrate developed by Hollingsworth and Vose Company. A commercially viable coating process was developed using wire rod for coating micro-porous layer by a single pass. The thickness as well as carbon loading in the micro-porous layer was controlled by selecting appropriate wire thickness of the wire rod. Slurry compositions with solid loading as high as 10 wt.% using nano-chain and nano-fiber type carbons were developed using dispersion agents to provide cohesive and homogenous micro-porous layer without any mud-cracking. The surface morphology, wetting characteristics and pore size distribution of the wire rod coated GDLs were examined using FESEM, Goniometer and Hg porosimetry, respectively. The GDLs were evaluated in single cell PEMFC under various operating conditions (temperature and RH) using hydrogen and air as reactants. It was observed that the wire rod coated micro-porous layer with 10 wt.% nano-fibrous carbon based GDLs showed the highest fuel cell performance at 85 C using H{sub 2} and air at 50% RH, compared to all other compositions. (author)

Ultrasonic friction power during thermosonic Au and Cu ball bonding

International Nuclear Information System (INIS)

Shah, A; Mayer, M; Zhou, Y; Qin, I; Huynh, C; Meyer, M

2010-01-01

The ultrasonic friction power during thermosonic ball bonding with Au and Cu wires, both 25 μm in diameter, is derived with an improved method from experimental measurements during the bonding process. Experimental data include the current delivered to the ultrasonic transducer and the tangential force measured using piezoresistive microsensors integrated close to the Al bonding pad. The improvement results from a new, more accurate method to derive the mechanical compliance of the ultrasonic system. The method employs a bond process modification in which the ultrasonic current is ramped up sequentially in three steps. In the first two steps, the ultrasonic current is set to levels that are too low to cause sliding. The bonding takes place during the third step, when the current is ramped up to the optimum value required for making good quality bonds. The ultrasonic compliance values are derived from the first two steps and are 8.2 ± 0.5 μm N -1 and 7.7 ± 0.5 μm N -1 for the Au and Cu processes, respectively. These values are determined within an average error estimate of ±6%, substantially lower than the ±10% estimated with a previously reported method. The ultrasonic compliance in the case of Au is 6% higher due to the lower elastic modulus of Au compared with that of Cu. Typical maximum values of relative sliding amplitude of ultrasonic friction at the interface are 655 nm and 766 nm for the Au and Cu processes. These values are 81% of the free-air vibration amplitude of the bonding capillary tip for the respective ultrasonic current settings. Due to bond growth, which damps relative motion between the ball and the pad, the final relative amplitude at the bond interface is reduced to 4% of the equivalent free-air amplitude. Even though the maximum value of relative amplitude is 17% higher in the Cu process compared with the Au process, the average total interfacial sliding is 519 μm in the Cu process, which is 31% lower than that in the Au process (759 �

Shape memory alloy wire-based smart natural rubber bearing

International Nuclear Information System (INIS)

Hedayati Dezfuli, F; Shahria Alam, M

2013-01-01

In this study, two types of smart elastomeric bearings are presented using shape memory alloy (SMA) wires. Due to the unique characteristics of SMAs, such as the superelastic effect and the recentering capability, the residual deformation in SMA-based natural rubber bearings (SMA-NRBs) is significantly reduced whereas the energy dissipation capacity is increased. Two different configurations of SMA wires incorporated in elastomeric bearings are considered. The effect of several parameters, including the shear strain amplitude, the type of SMA, the aspect ratio of the base isolator, the thickness of SMA wire, and the amount of pre-strain in the wires on the performance of SMA-NRBs is investigated. Rubber bearings are composed of natural rubber layers bonded to steel shims as reinforcement. Results show that ferrous SMA wire, FeNiCuAlTaB, with 13.5% superelastic strain and a very low austenite finish temperature (−62 °C), is the best candidate to be used in SMA-NRBs subjected to high shear strain amplitudes. In terms of the lateral flexibility and wire strain level, the smart rubber bearing with a cross configuration of SMA wires is more efficient. Moreover, the cross configuration can be implemented in high-aspect-ratio elastomeric bearings since the strain induced in the wire does not exceed the superelastic range. When cross SMA wires with 2% pre-strain are used in a smart NRB, the dissipated energy is increased by 74% and the residual deformation is decreased by 15%. (paper)

Three-dimensional quantification of pretorqued nickel-titanium wires in edgewise and prescription brackets.

Science.gov (United States)

Mittal, Nitika; Xia, Zeyang; Chen, Jie; Stewart, Kelton T; Liu, Sean Shih-Yao

2013-05-01

To quantify the three-dimensional moments and forces produced by pretorqued nickel-titanium (NiTi) rectangular archwires fully engaged in 0.018- and 0.022-inch slots of central incisor and molar edgewise and prescription brackets. Ten identical acrylic dental models with retroclined maxillary incisors were fabricated for bonding with various bracket-wire combinations. Edgewise, Roth, and MBT brackets with 0.018- and 0.022-inch slots were bonded in a simulated 2 × 4 clinical scenario. The left central incisor and molar were sectioned and attached to load cells. Correspondingly sized straight and pretorqued NiTi archwires were ligated to the brackets using 0.010-inch ligatures. Each load cell simultaneously measured three force (Fx, Fy, Fz) and three moment (Mx, My, Mz) components. The faciolingual, mesiodistal, and inciso-occluso/apical axes of the teeth corresponded to the x, y, and z axes of the load cells, respectively. Each wire was removed and retested seven times. Three-way analysis of variance (ANOVA) examined the effects of wire type, wire size, and bracket type on the measured orthodontic load systems. Interactions among the three effects were examined and pair-wise comparisons between significant combinations were performed. The force and moment components on each tooth were quantified according to their local coordinate axes. The three-way ANOVA interaction terms were significant for all force and moment measurements (P .05). The pretorqued wire generates a significantly larger incisor facial crown torquing moment in the MBT prescription compared to Roth, edgewise, and the straight NiTi wire.

Influence of particle size of Mg powder on the microstructure and critical currents of in situ powder-in-tube processed MgB_2 wires

International Nuclear Information System (INIS)

Kumakura, Hiroaki; Ye, Shujun; Matsumoto, Akiyoshi; Nitta, Ryuji

2016-01-01

We fabricated in situ powder-in-tube(PIT) MgB_2 wires using three kinds of Mg powders with particle size of ∼45 μm, ∼150 μm and 212∼600 μm. Mg particles were elongated to filamentary structure in the wires during cold drawing process. Especially, long Mg filamentary structure was obtained for large Mg particle size of 212∼600 μm. Critical current density, J_c, increased with increasing Mg particle size for 1 mm diameter wires. This is due to the development of filamentary structure of high density MgB_2 superconducting layer along the wires. This MgB_2 structure is similar to that of the internal Mg diffusion (IMD) processed MgB_2 wires. However, J_c of the wires fabricated with 212∼600 μm Mg particle size decreased and the scattering of J_c increased with decreasing wire diameter, while the J_c of the wires with ∼45 μm Mg particle was almost independent of the wire diameter. The cross sectional area reduction of the Mg particles during the wire drawing is smaller than that of the wire. When using large size Mg particle, the number of Mg filaments in the wire cross section is small. These two facts statistically lead to the larger scattering of Mg areal fraction in the wire cross section with proceeding of wire drawing process, resulting in smaller volume fraction of MgB_2 in the wire and lower J_c with larger scattering along the wire. SiC nano powder addition is effective in increasing J_c for all Mg particle sizes. (author)

A preliminary study of laser cladding of AISI 316 stainless steel using preplaced NiTi wire

International Nuclear Information System (INIS)

Cheng, F.T.; Lo, K.H.; Man, H.C.

2004-01-01

NiTi wire of diameter 1 mm was preplaced on AISI 316 stainless steel samples by using a binder. Melting of the NiTi wire to form a clad track on the steel substrate was achieved by means of a high-power CW Nd:YAG laser using different processing parameters. The geometry and microstructure of the clad deposit were studied by optical microscopy and scanning electron microscopy (SEM), respectively. The hardness and compositional profiles along the depth of the deposit were acquired by microhardness testing and energy-dispersive spectroscopy (EDS), respectively. The elastic behavior of the deposit was analyzed using nanoindentation, and compared with that of the NiTi wire. The dilution of the NiTi clad by the substrate material beneath was substantial in single clad tracks, but could be successively reduced in multiple clad layers. A strong fusion bonding with tough interface could be obtained as evidenced by the integrity of Vickers indentations in the interfacial region. In comparison with the NiTi cladding on AISI 316 using the tungsten inert gas (TIG) process, the laser process was capable of producing a much less defective cladding with a more homogeneous microstructure, which is an essential cladding quality with respect to cavitation erosion and corrosion resistance. Thus, the present preliminary study shows that laser cladding using preplaced wire is a feasible method to obtain a thick and homogeneous NiTi-based alloy layer on AISI 316 stainless steel substrate

Micro Wire-Drawing: Experiments And Modelling

International Nuclear Information System (INIS)

Berti, G. A.; Monti, M.; Bietresato, M.; D'Angelo, L.

2007-01-01

In the paper, the authors propose to adopt the micro wire-drawing as a key for investigating models of micro forming processes. The reasons of this choice arose in the fact that this process can be considered a quasi-stationary process where tribological conditions at the interface between the material and the die can be assumed to be constant during the whole deformation. Two different materials have been investigated: i) a low-carbon steel and, ii) a nonferrous metal (copper). The micro hardness and tensile tests performed on each drawn wire show a thin hardened layer (more evident then in macro wires) on the external surface of the wire and hardening decreases rapidly from the surface layer to the center. For the copper wire this effect is reduced and traditional material constitutive model seems to be adequate to predict experimentation. For the low-carbon steel a modified constitutive material model has been proposed and implemented in a FE code giving a better agreement with the experiments

A jelly-roll process for high temperature superconducting tapes and wires

Energy Technology Data Exchange (ETDEWEB)

Tsuei, C C; Chi, C C; Frey, T; Mitzi, D B; Kazyaka, T [IBM Thomas J. Watson Research Center, Yorktown Heights, NY (United States); Haugan, T; Ye, J; Patel, S; Shaw, D T [New York State Inst. on Superconductivity, SUNY, Buffalo, Amherst, NY (United States); Wu, M K [Dept. of Physics, National Tsing Hua Univ., Hsinchu (Taiwan)

1992-07-01

As an alternative to the powder-in-tube method, a new technique called the jelly-roll process is proposed for making high-T[sub c] superconducting tapes and wires. A normal-metal sheet coated with high-T[sub c] cuprate is configured in a jelly-roll fashion and cold worked into tapes or wires made of alternating cuprate superconductor and normal metal layers. The feasibility of this new process is demonstrated for both the YBa[sub 2]Cu[sub 3]O[sub 7]/Ag and Bi[sub 2]Sr[sub 2]CaCu[sub 2]O[sub 8]/Ag composite systems. The role of reduction in the cross-sectional area by cold-rolling, heat treatment and oxygenation in optimizing T[sub c] and J[sub c] has been studied. Preliminary results indicate that partialmelt texturing, in the Bi[sub 2]Sr[sub 2]CaCu[sub 2]O[sub 8]/Ag system, results in a relatively field independent J[sub c] (H< or approx.7T) with J[sub c](H = 0) [proportional to]5 X 10[sup 4] A cm[sup -2] at 4.2 K.

Stress-strain effects in alumina-Cu reinforced Nb3Sn wires fabricated by the tube process

International Nuclear Information System (INIS)

Murase, Satoru; Nakayama, Shigeo; Masegi, Tamaki; Koyanagi, Kei; Nomura, Shunji; Shiga, Noriyuki; Kobayashi, Norio; Watanabe, Kazuo.

1997-01-01

In order to fabricate a large-bore, high-field magnet which achieves a low coil weight and volume, a high strength compound superconducting wire is required. For those demands we have developed the reinforced Nb 3 Sn wire using alumina dispersion strengthened copper (alumina-Cu) as a reinforcement material and the tube process of the Nb 3 Sn wire fabrication. The ductility study of the composites which consisted of the reinforcement, Nb tube, Cu, and Cu clad Sn brought a 1 km long alumina-Cu reinforced Nb 3 Sn wire successfully. Using fabricated wires measurements and evaluations of critical current density as parameters of magnetic field, tensile stress, tensile strain, and transverse compressive stress, and those of stress-strain curves at 4.2 K were performed. They showed superior performance such as high 0.3% proof stress (240 MPa at 0.3% strain) and high maximum tolerance stress (320 MPa) which were two times as large as those of conventional Cu matrix Nb 3 Sn wire. The strain sensitivity parameters were obtained for the reinforced Nb 3 Sn wire and the Cu matrix one using the scaling law. Residual stress of the component materials caused by cooling down to 4.2 K from heat-treatment temperature was calculated using equivalent Young's modulus, equivalent yield strength, thermal expansion coefficient and other mechanical parameters. Calculated stress-strain curves at 4.2 K for the reinforced Nb 3 Sn wire and the Cu matrix one based on calculation of residual stress, had good agreement with the experimental values. (author)

In vivo biofilm formation on stainless steel bonded retainers during different oral health-care regimens.

Science.gov (United States)

Jongsma, Marije A; van der Mei, Henny C; Atema-Smit, Jelly; Busscher, Henk J; Ren, Yijin

2015-03-23

Retention wires permanently bonded to the anterior teeth are used after orthodontic treatment to prevent the teeth from relapsing to pre-treatment positions. A disadvantage of bonded retainers is biofilm accumulation on the wires, which produces a higher incidence of gingival recession, increased pocket depth and bleeding on probing. This study compares in vivo biofilm formation on single-strand and multi-strand retention wires with different oral health-care regimens. Two-centimetre wires were placed in brackets that were bonded to the buccal side of the first molars and second premolars in the upper arches of 22 volunteers. Volunteers used a selected toothpaste with or without the additional use of a mouthrinse containing essential oils. Brushing was performed manually. Regimens were maintained for 1 week, after which the wires were removed and the oral biofilm was collected to quantify the number of organisms and their viability, determine the microbial composition and visualize the bacteria by electron microscopy. A 6-week washout period was employed between regimens. Biofilm formation was reduced on single-strand wires compared with multi-strand wires; bacteria were observed to adhere between the strands. The use of antibacterial toothpastes marginally reduced the amount of biofilm on both wire types, but significantly reduced the viability of the biofilm organisms. Additional use of the mouthrinse did not result in significant changes in biofilm amount or viability. However, major shifts in biofilm composition were induced by combining a stannous fluoride- or triclosan-containing toothpaste with the mouthrinse. These shifts can be tentatively attributed to small changes in bacterial cell surface hydrophobicity after the adsorption of the toothpaste components, which stimulate bacterial adhesion to the hydrophobic oil, as illustrated for a Streptococcus mutans strain.

Recrystallization texture in nickel heavily deformed by accumulative roll bonding

Science.gov (United States)

Mishin, O. V.; Zhang, Y. B.; Godfrey, A.

2017-07-01

The recrystallization behavior of Ni processed by accumulative roll bonding to a total accumulated von Mises strain of 4.8 has been examined, and analyzed with respect to heterogeneity in the deformation microstructure. The regions near the bonding interface are found to be more refined and contain particle deformation zones around fragments of the steel wire brush used to prepare the surface for bonding. Sample-scale gradients are also observed, manifested as differences between the subsurface, intermediate and central layers, where the distributions of texture components are different. These heterogeneities affect the progress of recrystallization. While the subsurface and near-interface regions typically contain lower frequencies of cube-oriented grains than anywhere else in the sample, a strong cube texture forms in the sample during recrystallization, attributed to both a high nucleation rate and fast growth rate of cube-oriented grains. The observations highlight the sensitivity of recrystallization to heterogeneity in the deformation microstructure and demonstrate the importance of characterizing this heterogeneity over several length scales.

SPECIFIC FEATURES OF TECHNOLOGY OF MANUFACTURING A ZINC-COATED TUB WIRE FOR MUZZLE (BOTTLE’ HOOD WIRE

Directory of Open Access Journals (Sweden)

D. B. Zuev

2016-01-01

Full Text Available The paper presents the main technical specifications of galvanized low carbon wire for muzzles (bottle’hood wire, consistent with the exploitation requirements to the wire in the manufacture and use of muzzles. The main criteria when selecting the steel grade and upon selection of the technological processes are given. 

Formation of plasma around wire fragments created by electrically exploded copper wire

International Nuclear Information System (INIS)

Taylor, Michael J.

2002-01-01

The physical processes occurring during the electrical explosion of metallic conductors has attracted interest for many years. Applications include circuit breakers, segmented lightning divertor strips for aircraft radomes, disruption of metallic shaped charge jets, plasma armatures for electromagnetic railguns and plasma generators for electrothermal-chemical guns. Recent work has cited the phenomenology of the fragmentation processes, particularly the development of a plasma around the lower resistance condensed fragments. An understanding of both the fragmentation process and the development of the accompanying formation of plasma is essential for the optimization of devices that utilize either of these phenomena. With the use of x-radiography and fast photography, this paper explores the wire explosion process, in particular the relationship between the fragmentation, plasma development and resistance rise that occurs during this period. A hypothesis is put forward to account for the development of plasma around the condensed wire fragments. Experimental parameters used in this study are defined. Wires studied were typically copper, with a diameter of 1 mm and length in excess of 150 mm. Circuit inductance used were from 26 to 800 μH. This relatively high circuit inductance gave circuit rise times less than 180 MA s -1 , slow with respect to many other exploding wire studies. Discharge duration ranged from 0.8 to 10 ms. (author)

An interconnecting bus power optimization method combining interconnect wire spacing with wire ordering

International Nuclear Information System (INIS)

Zhu Zhang-Ming; Hao Bao-Tian; En Yun-Fei; Yang Yin-Tang; Li Yue-Jin

2011-01-01

On-chip interconnect buses consume tens of percents of dynamic power in a nanometer scale integrated circuit and they will consume more power with the rapid scaling down of technology size and continuously rising clock frequency, therefore it is meaningful to lower the interconnecting bus power in design. In this paper, a simple yet accurate interconnect parasitic capacitance model is presented first and then, based on this model, a novel interconnecting bus optimization method is proposed. Wire spacing is a process for spacing wires for minimum dynamic power, while wire ordering is a process that searches for wire orders that maximally enhance it. The method, i.e., combining wire spacing with wire ordering, focuses on bus dynamic power optimization with a consideration of bus performance requirements. The optimization method is verified based on various nanometer technology parameters, showing that with 50% slack of routing space, 25.71% and 32.65% of power can be saved on average by the proposed optimization method for a global bus and an intermediate bus, respectively, under a 65-nm technology node, compared with 21.78% and 27.68% of power saved on average by uniform spacing technology. The proposed method is especially suitable for computer-aided design of nanometer scale on-chip buses. (interdisciplinary physics and related areas of science and technology)

The Quantum Socket: Wiring for Superconducting Qubits - Part 2

Science.gov (United States)

Bejanin, J. H.; McConkey, T. G.; Rinehart, J. R.; Bateman, J. D.; Earnest, C. T.; McRae, C. H.; Rohanizadegan, Y.; Shiri, D.; Mariantoni, M.; Penava, B.; Breul, P.; Royak, S.; Zapatka, M.; Fowler, A. G.

Quantum computing research has reached a level of maturity where quantum error correction (QEC) codes can be executed on linear arrays of superconducting quantum bits (qubits). A truly scalable quantum computing architecture, however, based on practical QEC algorithms, requires nearest neighbor interaction between qubits on a two-dimensional array. Such an arrangement is not possible with techniques that rely on wire bonding. To address this issue, we have developed the quantum socket, a device based on three-dimensional wires that enables the control of superconducting qubits on a two-dimensional grid. In this talk, we present experimental results characterizing this type of wiring. We will show that the quantum socket performs exceptionally well for the transmission and reflection of microwave signals up to 10 GHz, while minimizing crosstalk between adjacent wires. Under realistic conditions, we measured an S21 of -5 dB at 6 GHz and an average crosstalk of -60 dB. We also describe time domain reflectometry results and arbitrary pulse transmission tests, showing that the quantum socket can be used to control superconducting qubits.

Effect of wire shape on wire array discharge

International Nuclear Information System (INIS)

Shimomura, N.; Tanaka, Y.; Yushita, Y.; Nagata, M.; Teramoto, Y.; Katsuki, S.; Akiyama, H.

2001-01-01

Although considerable investigations have been reported on z-pinches to achieve nuclear fusion, little attention has been given from the point of view of how a wire array consisting of many parallel wires explodes. Instability existing in the wire array discharge has been shown. In this paper, the effect of wire shape in the wire array on unstable behavior of the wire array discharge is represented by numerical analysis. The claws on the wire formed in installation of wire may cause uniform current distribution on wire array. The effect of error of wire diameter in production is computed by Monte Carlo Method. (author)

Effect of wire shape on wire array discharge

Energy Technology Data Exchange (ETDEWEB)

Shimomura, N.; Tanaka, Y.; Yushita, Y.; Nagata, M. [University of Tokushima, Department of Electrical and Electronic Engineering, Tokushima (Japan); Teramoto, Y.; Katsuki, S.; Akiyama, H. [Kumamoto University, Department of Electrical and Computer Engineering, Kumamoto (Japan)

2001-09-01

Although considerable investigations have been reported on z-pinches to achieve nuclear fusion, little attention has been given from the point of view of how a wire array consisting of many parallel wires explodes. Instability existing in the wire array discharge has been shown. In this paper, the effect of wire shape in the wire array on unstable behavior of the wire array discharge is represented by numerical analysis. The claws on the wire formed in installation of wire may cause uniform current distribution on wire array. The effect of error of wire diameter in production is computed by Monte Carlo Method. (author)

Optimisation of wire-cut EDM process parameter by Grey-based response surface methodology

Science.gov (United States)

Kumar, Amit; Soota, Tarun; Kumar, Jitendra

2018-03-01

Wire electric discharge machining (WEDM) is one of the advanced machining processes. Response surface methodology coupled with Grey relation analysis method has been proposed and used to optimise the machining parameters of WEDM. A face centred cubic design is used for conducting experiments on high speed steel (HSS) M2 grade workpiece material. The regression model of significant factors such as pulse-on time, pulse-off time, peak current, and wire feed is considered for optimising the responses variables material removal rate (MRR), surface roughness and Kerf width. The optimal condition of the machining parameter was obtained using the Grey relation grade. ANOVA is applied to determine significance of the input parameters for optimising the Grey relation grade.

Unexpected complications of bonded mandibular lingual retainers.

NARCIS (Netherlands)

Katsaros, C.; Livas, C.; Renkema, A.M.

2007-01-01

INTRODUCTION: The flexible spiral wire (FSW) retainer is the most frequently used type of fixed retainer bonded on all 6 anterior teeth. Our aim in this article was to demonstrate unexpected posttreatment changes in the labiolingual position of the mandibular anterior teeth associated with the use

Nano features of Al/Au ultrasonic bond interface observed by high resolution transmission electron microscopy

International Nuclear Information System (INIS)

Ji Hongjun; Li Mingyu; Kim, Jong-Myung; Kim, Dae-Won; Wang Chunqing

2008-01-01

Nano-scale interfacial details of ultrasonic AlSi1 wire wedge bonding to a Au/Ni/Cu pad were investigated using high resolution transmission electron microscopy (HRTEM). The intermetallic phase Au 8 Al 3 formed locally due to diffusion and reaction activated by ultrasound at the Al/Au bond interface. Multilayer sub-interfaces roughly parallel to the wire/pad interface were observed among this phase, and interdiffusional features near the Au pad resembled interference patterns, alternately dark and bright bars. Solid-state diffusion theory cannot be used to explain why such a thick compound formed within milliseconds at room temperature. The major formation of metallurgical bonds was attributed to ultrasonic cyclic vibration

Raman spectroscopy as a tool to investigate the structure and electronic properties of carbon-atom wires

Directory of Open Access Journals (Sweden)

Alberto Milani

2015-02-01

Full Text Available Graphene, nanotubes and other carbon nanostructures have shown potential as candidates for advanced technological applications due to the different coordination of carbon atoms and to the possibility of π-conjugation. In this context, atomic-scale wires comprised of sp-hybridized carbon atoms represent ideal 1D systems to potentially downscale devices to the atomic level. Carbon-atom wires (CAWs can be arranged in two possible structures: a sequence of double bonds (cumulenes, resulting in a 1D metal, or an alternating sequence of single–triple bonds (polyynes, expected to show semiconducting properties. The electronic and optical properties of CAWs can be finely tuned by controlling the wire length (i.e., the number of carbon atoms and the type of termination (e.g., atom, molecular group or nanostructure. Although linear, sp-hybridized carbon systems are still considered elusive and unstable materials, a number of nanostructures consisting of sp-carbon wires have been produced and characterized to date. In this short review, we present the main CAW synthesis techniques and stabilization strategies and we discuss the current status of the understanding of their structural, electronic and vibrational properties with particular attention to how these properties are related to one another. We focus on the use of vibrational spectroscopy to provide information on the structural and electronic properties of the system (e.g., determination of wire length. Moreover, by employing Raman spectroscopy and surface enhanced Raman scattering in combination with the support of first principles calculations, we show that a detailed understanding of the charge transfer between CAWs and metal nanoparticles may open the possibility to tune the electronic structure from alternating to equalized bonds.

The effects of silver coating on friction coefficient and shear bond strength of steel orthodontic brackets.

Science.gov (United States)

Arash, Valiollah; Anoush, Keivan; Rabiee, Sayed Mahmood; Rahmatei, Manuchehr; Tavanafar, Saeid

2015-01-01

Aims of the present study was to measure frictional resistance between silver coated brackets and different types of arch wires, and shear bond strength of these brackets to the tooth. In an experimental clinical research 28 orthodontic brackets (standard, 22 slots) were coated with silver ions using electroplate method. Six brackets (coated: 3, uncoated: 3) were evaluated with Scanning Electron Microscopy and Atomic Force Microscopy. The amount of friction in 15 coated brackets was measured with three different kinds of arch wires (0.019 × 0.025-in stainless steel [SS], 0.018-in stainless steel [SS], 0.018-in Nickel-Titanium [Ni-Ti]) and compared with 15 uncoated steel brackets. In addition, shear bond strength values were compared between 10 brackets with silver coating and 10 regular brackets. Universal testing machine was used to measure shear bond strength and the amount of friction between the wires and brackets. SPSS 18 was used for data analysis with t-test. SEM and AFM results showed deposition of a uniform layer of silver, measuring 8-10 μm in thickness on bracket surfaces. Silver coating led to higher frictional forces in all the three types of arch wires, which was statistically significant in 0.019 × 0.025-in SS and 0.018-in Ni-Ti, but it did not change the shear bond strength significantly. Silver coating with electroplating method did not affect the bond strength of the bracket to enamel; in addition, it was not an effective method for decreasing friction in sliding mechanics. © Wiley Periodicals, Inc.

Studies of the remagnetization process in cold drawn Fe-rich thin amorphous wires

International Nuclear Information System (INIS)

Gawronski, P.; Zhukov, A.P.; Blanco, J.M.; Gonzalez, J.; Zhukova, V.; Kulakowski, K.

2007-01-01

Results on local hysteresis loops for Fe-rich amorphous cold-drawn wires with the sample lengths of 30 mm and 70 mm under applied stress, σ, up to 1300 MPa are reported. For both lengths, the magnetization, M, increases with σ and the coercive field, H C , decreases. Near the wire end, M results to be larger than at the wire center, and H C sharply decreases. This reduction is eliminated if the applied stress is large enough. It is assumed, that the magnetic configuration at the wire end for the cold-drawn wires is different from the other wires families

Improvements of fabrication processes and enhancement of critical current densities in (Ba,K)Fe2As2 HIP wires and tapes

Science.gov (United States)

Pyon, Sunseng; Suwa, Takahiro; Tamegai, Tsuyoshi; Takano, Katsutoshi; Kajitani, Hideki; Koizumi, Norikiyo; Awaji, Satoshi; Zhou, Nan; Shi, Zhixiang

2018-05-01

We fabricated (Ba,K)Fe2As2 superconducting wires and tapes using the powder-in-tube method and hot isostatic pressing (HIP). HIP wires and tapes showed a high value of transport critical current density (J c) exceeding 100 kAcm‑2 at T = 4.2 K and the self-field. Transport J c in the HIP wire reached 38 kAcm‑2 in a high magnetic field of 100 kOe. This value is almost twice larger than the previous highest value of J c among round wires using iron-based superconductors. Enhancement of J c in the wires and tapes was caused by improvement of the drawing process, which caused degradation of the core, formation of microcracks, weak links between grains, and random orientation of grains. Details of the effect of the improved fabrication processes on the J c are discussed.

Enhanced J c property in nano-SiC doped thin MgB2/Fe wires by a modified in situ PIT process

International Nuclear Information System (INIS)

Jiang, C.H.; Nakane, T.; Hatakeyama, H.; Kumakura, H.

2005-01-01

A modified in situ PIT process, which included a short time pre-annealing and intermediate drawing step in the conventional in situ PIT process, was employed to fabricate thin round MgB 2 /Fe wires from MgH 2 and B powders. The pores and cracks resulted from the MgH 2 decomposition during the pre-annealing were effectively eliminated by the intermediate drawing step, which subsequently increased the core density and J c property of final heat treated wires. A higher reduction rate after the pre-annealing led to a larger enhancement in J c within this study. The reproducibility of our new process on the J c improvement in MgB 2 wires was confirmed in two series of wires doped with 5 mol% or 10 mol% nano-SiC particles separately

The use of a neodymium-iron-boron magnet device for positioning a multi-stranded wire retainer in lingual retention--a pilot study in humans.

Science.gov (United States)

Hahn, Wolfram; Fricke, Julia; Fricke-Zech, Susanne; Zapf, Antonia; Gruber, Rudolf; Sadat-Khonsari, Reza

2008-10-01

The aim of this study was to evaluate the time requirement of a newly developed device made of neodymium-iron-boron (NdFeB) magnets for positioning a multi-stranded, canine-to-canine retainer during bonding compared with dental floss and a transfer tray. Forty-five patients aged between 12 and 33 years (26 male, 19 female) previously treated with fixed appliances were enrolled in the study. The patients were randomly allocated to three groups (15 per group). For each group a mandibular canine-to-canine retainer of 0.018 inch Dentaflex multi-stranded wire (Dentaurum) was prefabricated for each patient on a cast. The bonding procedure was identical, except for the method of positioning the wire during adhesive fixation: group A dental floss, group B a small prefabricated transfer tray of dental resin and group C the NdFeB magnet device. For each group, the time required for the complete bonding process was measured. Kruskal-Wallis and Wilcoxon-Mann-Whitney tests were used for group and pairwise comparisons, respectively. The three methods required statistically significant different times (P NdFeB magnet device is a timesaving appliance for positioning a multi-stranded, canine-to-canine retainer during bonding when compared with dental floss and an individually prefabricated transfer tray.

Welding wire pressure sensor assembly

Science.gov (United States)

Morris, Timothy B. (Inventor); Milly, Peter F., Sr. (Inventor); White, J. Kevin (Inventor)

1994-01-01

The present invention relates to a device which is used to monitor the position of a filler wire relative to a base material being welded as the filler wire is added to a welding pool. The device is applicable to automated welding systems wherein nonconsumable electrode arc welding processes are utilized in conjunction with a filler wire which is added to a weld pool created by the electrode arc. The invention senses pressure deviations from a predetermined pressure between the filler wire and the base material, and provides electrical signals responsive to the deviations for actuating control mechanisms in an automatic welding apparatus so as to minimize the pressure deviation and to prevent disengagement of the contact between the filler wire and the base material.

Ferromagnetic artificial pinning centers in multifilamentary superconducting wires

International Nuclear Information System (INIS)

Wang, J.Q.; Rizzo, N.D.; Prober, D.E.

1997-01-01

The authors fabricated multifilamentary NbTi wires with ferromagnetic (FM) artificial pinning centers (APCs) to enhance the critical current density (J c ) in magnetic fields. They used a bundle and draw technique to process the APC wires with either Ni or Fe as the pinning centers. Both wires produced higher J c in the high field range (5-9 T) than previous non-magnetic APC wires similarly processed, even though the authors have not yet optimized pin percentage. Using a magnetometer they found that the pins remained ferromagnetic for the wires with maximum J c . However, they did observe a substantial loss of FM material for the wires where the pin diameter approached 3 nm. Thus, they expect further enhancement of J c with better pin quality

Two-Step Plasma Process for Cleaning Indium Bonding Bumps

Science.gov (United States)

Greer, Harold F.; Vasquez, Richard P.; Jones, Todd J.; Hoenk, Michael E.; Dickie, Matthew R.; Nikzad, Shouleh

2009-01-01

A two-step plasma process has been developed as a means of removing surface oxide layers from indium bumps used in flip-chip hybridization (bump bonding) of integrated circuits. The two-step plasma process makes it possible to remove surface indium oxide, without incurring the adverse effects of the acid etching process.

Conversion of electromagnetic energy in Z-pinch process of single planar wire arrays at 1.5 MA

International Nuclear Information System (INIS)

Liangping, Wang; Mo, Li; Juanjuan, Han; Ning, Guo; Jian, Wu; Aici, Qiu

2014-01-01

The electromagnetic energy conversion in the Z-pinch process of single planar wire arrays was studied on Qiangguang generator (1.5 MA, 100 ns). Electrical diagnostics were established to monitor the voltage of the cathode-anode gap and the load current for calculating the electromagnetic energy. Lumped-element circuit model of wire arrays was employed to analyze the electromagnetic energy conversion. Inductance as well as resistance of a wire array during the Z-pinch process was also investigated. Experimental data indicate that the electromagnetic energy is mainly converted to magnetic energy and kinetic energy and ohmic heating energy can be neglected before the final stagnation. The kinetic energy can be responsible for the x-ray radiation before the peak power. After the stagnation, the electromagnetic energy coupled by the load continues increasing and the resistance of the load achieves its maximum of 0.6–1.0 Ω in about 10–20 ns

The Quantum Socket: Wiring for Superconducting Qubits - Part 1

Science.gov (United States)

McConkey, T. G.; Bejanin, J. H.; Rinehart, J. R.; Bateman, J. D.; Earnest, C. T.; McRae, C. H.; Rohanizadegan, Y.; Shiri, D.; Mariantoni, M.; Penava, B.; Breul, P.; Royak, S.; Zapatka, M.; Fowler, A. G.

Quantum systems with ten superconducting quantum bits (qubits) have been realized, making it possible to show basic quantum error correction (QEC) algorithms. However, a truly scalable architecture has not been developed yet. QEC requires a two-dimensional array of qubits, restricting any interconnection to external classical systems to the third axis. In this talk, we introduce an interconnect solution for solid-state qubits: The quantum socket. The quantum socket employs three-dimensional wires and makes it possible to connect classical electronics with quantum circuits more densely and accurately than methods based on wire bonding. The three-dimensional wires are based on spring-loaded pins engineered to insure compatibility with quantum computing applications. Extensive design work and machining was required, with focus on material quality to prevent magnetic impurities. Microwave simulations were undertaken to optimize the design, focusing on the interface between the micro-connector and an on-chip coplanar waveguide pad. Simulations revealed good performance from DC to 10 GHz and were later confirmed against experimental measurements.

A statistical rationale for establishing process quality control limits using fixed sample size, for critical current verification of SSC superconducting wire

International Nuclear Information System (INIS)

Pollock, D.A.; Brown, G.; Capone, D.W. II; Christopherson, D.; Seuntjens, J.M.; Woltz, J.

1992-03-01

The purpose of this paper is to demonstrate a statistical method for verifying superconducting wire process stability as represented by I c . The paper does not propose changing the I c testing frequency for wire during Phase 1 of the present Vendor Qualification Program. The actual statistical limits demonstrated for one supplier's data are not expected to be suitable for all suppliers. However, the method used to develop the limits and the potential for improved process through their use, may be applied equally. Implementing the demonstrated method implies that the current practice of testing all pieces of wire from each billet, for the purpose of detecting manufacturing process errors (i.e. missing a heat-treatment cycle for a part of the billet, etc.) can be replaced by other less costly process control measures. As used in this paper process control limits for critical current are quantitative indicators of the source manufacturing process uniformity. The limits serve as alarms indicating the need for manufacturing process investigation

Fabrication of seven-core multi-filamentary MgB2 wires with high critical current density by an internal Mg diffusion process

International Nuclear Information System (INIS)

Togano, K; Hur, J M; Matsumoto, A; Kumakura, H

2009-01-01

We found that the reaction between a Mg core and a B powder layer in an internal Mg diffusion (IMD)-processed multi-filamentary wire can proceed rapidly even at a furnace temperature lower than the melting point of Mg (650 deg. C), resulting in the formation of a reacted layer with a fine composite structure and, hence, excellent in-field critical current properties. The multi-filamentary wire is composed of an outermost Cu-Ni sheath and seven filaments with a Ta sheath, a Mg core, and B+SiC powder filled in the space between the Ta sheath and the Mg core. Heat treatment at 645 deg. C for 1 h produced a reacted layer with dense composite structure along the inner wall of the Ta sheath and a hole at the center of each core. This reaction probably initiated from the heat generation at the B/Mg interface, resulting in a temperature rise of the Mg core and the occurrence of liquid Mg infiltration. The J c value at 4.2 K for the reacted layer exceeds 10 5 cm -2 at 9 T, which is the highest reported so far for MgB 2 wire, including powder-in-tube (PIT)-processed wires. These results indicate that the IMD process can compete in terms of practical wire fabrication with the conventional PIT process.

Fabrication of tungsten wire needles

International Nuclear Information System (INIS)

Roder, A.

1983-02-01

Fine point needles for field emissoin are conventionally produced by electrolytically or chemically etching tungsten wire. Points formed in this manner have a typical tip radius of about 0.5 microns and a cone angle of some 30 degrees. The construction of needle matrix detector chambers has created a need for tungsten needles whose specifications are: 20 mil tungsten wire, 1.5 inch total length, 3 mm-long taper (resulting in a cone angle of about 5 degrees), and 25 micron-radius point (similar to that found on sewing needles). In the process described here for producing such needles, tungsten wire, immersed in a NaOH solution and in the presence of an electrode, is connected first to an ac voltage and then to a dc supply, to form a taper and a point on the end of the wire immersed in the solution. The process parameters described here are for needles that will meet the above specifications. Possible variations will be discussed under each approprite heading

NiTi bonded space regainer/maintainer

Directory of Open Access Journals (Sweden)

Negi K

2010-06-01

Full Text Available Early orthodontic interventions are often initiated in the developing dentition to promote favorable developmental changes. Interceptive orthodontic can eliminate or reduce the severity of a developing malocclusion, the complexity of orthodontic treatment, overall treatment time and cost. Premature loss of deciduous tooth or teeth can often destroy the integrity of normal occlusion. There are many space regaining and maintaining devices mentioned in literature. In this article, I present a simple space regaining method by a piece of nickel titanium (NiTi wire bonded between the teeth in active loop form, and the unique shape memory property of NiTi wire will upright or move the teeth and the lost space can be regained easily.

Investigations on the wire saw process on steels of selected geometries in the encircling process; Untersuchungen zum Seilsaegeprozess an Staehlen ausgewaehlter Geometrien im umschlingenden Verfahren

Energy Technology Data Exchange (ETDEWEB)

Knecht, Daniel

2015-01-26

This thesis illustrates a new and innovative model for the usual looping method to describe cutting time and wear. Several test series have been carried out to determine and analyze the various influencing factors. This new model now allows for exact predictions for cutting times and the resulting wear. A special test stand was planned and built. With the help of this test stand various influencing parameters were determined in preliminary tests. Due to the high correlation between these parameters, a matrix was created to rate them. From these results and the findings of the preliminary tests, the boundary conditions such as work piece size were defined and an experimental design was created. Eleven test series were conducted and each one consists of up to ten work pieces. In each test series, only one parameter was changed, the other influencing parameters remained unchanged. The parameter of the following characteristics were varied: the speed of the diamond wire, the feed pressure, the cutting angle, the geometry with respective cutting area, the work piece material, as well as the twisting of the diamond wire. By varying these parameters, the influence could be shown on the performance of the cutting process and also on the wear behavior of the diamond wire. A model was created from the obtained data which enables a cutting time prediction for rectangular work pieces. In addition to the model, a new criterion has been developed, with which it is possible to quantify the progress of wear and to be able to determine a necessary wire replacement. The classification of particle sizes of the accumulated chips has shown that a lower average cutting performance results in a decrease of the average particle size. From this circumstance a termination criterion of <150 μm has been established. When the particle size drops below this value, the cutting process becomes ineffective and should not be continued, or the diamond wire should be replaced, respectively

Wiring Damage Analyses for STS OV-103

Science.gov (United States)

Thomas, Walter, III

2006-01-01

This study investigated the Shuttle Program s belief that Space Transportation System (STS) wiring damage occurrences are random, that is, a constant occurrence rate. Using Problem Reporting and Corrective Action (PRACA)-derived data for STS Space Shuttle OV-103, wiring damage was observed to increase over the vehicle s life. Causal factors could include wiring physical deterioration, maintenance and inspection induced damage, and inspection process changes resulting in more damage events being reported. Induced damage effects cannot be resolved with existent data. Growth analysis (using Crow-AMSAA, or CA) resolved maintenance/inspection effects (e.g., heightened awareness) on all wire damages and indicated an overall increase since Challenger Return-to-Flight (RTF). An increasing failure or occurrence rate per flight cycle was seen for each wire damage mode; these (individual) rates were not affected by inspection process effects, within statistical error.

Comparison of optimization techniques for MRR and surface roughness in wire EDM process for gear cutting

Directory of Open Access Journals (Sweden)

K.D. Mohapatra

2016-11-01

Full Text Available The objective of the present work is to use a suitable method that can optimize the process parameters like pulse on time (TON, pulse off time (TOFF, wire feed rate (WF, wire tension (WT and servo voltage (SV to attain the maximum value of MRR and minimum value of surface roughness during the production of a fine pitch spur gear made of copper. The spur gear has a pressure angle of 20⁰ and pitch circle diameter of 70 mm. The wire has a diameter of 0.25 mm and is made of brass. Experiments were conducted according to Taguchi’s orthogonal array concept with five factors and two levels. Thus, Taguchi quality loss design technique is used to optimize the output responses carried out from the experiments. Another optimization technique i.e. desirability with grey Taguchi technique has been used to optimize the process parameters. Both the optimized results are compared to find out the best combination of MRR and surface roughness. A confirmation test was carried out to identify the significant improvement in the machining performance in case of Taguchi quality loss. Finally, it was concluded that desirability with grey Taguchi technique produced a better result than the Taguchi quality loss technique in case of MRR and Taguchi quality loss gives a better result in case of surface roughness. The quality of the wire after the cutting operation has been presented in the scanning electron microscopy (SEM figure.

Hot fuel examination facility element spacer wire-wrap machine

International Nuclear Information System (INIS)

Tobias, D.A.; Sherman, E.K.

1989-01-01

Nondestructive examinations of irradiated experimental fuel elements conducted in the Argonne National Laboratory Hot Fuel Examination Facility/North (HFEF/N) at the Idaho National Engineering Laboratory include laser and contact profilometry (element diameter measurements), electrical eddy-current testing for cladding and thermal bond defects, bow and length measurements, neutron radiography, gamma scanning, remote visual exam, and photography. Profilometry was previously restricted to spiral profilometry of the element to prevent interference with the element spacer wire wrapped in a helix about the Experimental Breeder Reactor II (EBR-II)-type fuel element from end to end. By removing the spacer wire prior to conducting profilometry examination, axial profilometry techniques may be used, which are considerably faster than spiral techniques and often result in data acquisition more important to experiment sponsors. Because the element must often be reinserted into the nuclear reactor (EBR-II) for additional irradiation, however, the spacer wire must be reinstalled on the highly irradiated fuel element by remote means after profilometry of the wireless elements. The element spacer wire-wrap machine developed at HFEF is capable of helically wrapping fuel elements with diameters up to 1.68 cm (0.660 in.) and 2.44-m (96-in.) lengths. The machine can accommodate almost any desired wire pitch length by simply inserting a new wrapper gear module

Inhomogeneous wire explosion in water

International Nuclear Information System (INIS)

Hwangbo, C.K.; Kong, H.J.; Lee, S.S.

1980-01-01

Inhomogeneous processes are observed in underwater copper wire explosion induced by a condensed capacitor discharge. The wire used is 0.1 mm in diameter and 10 mm long, and the capacitor of 2 μF is charged to 5 KV. A N 2 laser is used for the diagnostic of spatial extension of exploding copper vapour. The photographs obtained in this experiment show unambiguously the inhomogeneous explosion along the exploding wire. The quenching of plasma by the surrounding water inhibits the expansion of the vapour. It is believed the observed inhomogeneous explosion along the wire is located and localized around Goronkin's striae, which was first reported by Goronkin and discussed by Froengel as a pre-breakdown phenomenon. (author)

Ways of improvement of technological process of copper wire rod production

OpenAIRE

Dvoryanyn, Hrystyna; Shvachco, Sergiy

2015-01-01

Copper is a unique chemical element which is used since ancient times due to its universal chemical properties. By means of the method of continuous founding, hundreds of items of rod-like billets of different cross-section shapes are manufactured from copper. The problem of production of defectfree copper wire rods is important nowadays, because the market of cable products still increases. As the deposits of cooper ore in the nature are being exhausted, the processing of copper scrap become...

Low-temperature wafer-level gold thermocompression bonding: modeling of flatness deviations and associated process optimization for high yield and tough bonds

Science.gov (United States)

Stamoulis, Konstantinos; Tsau, Christine H.; Spearing, S. Mark

2005-01-01

Wafer-level, thermocompression bonding is a promising technique for MEMS packaging. The quality of the bond is critically dependent on the interaction between flatness deviations, the gold film properties and the process parameters and tooling used to achieve the bonds. The effect of flatness deviations on the resulting bond is investigated in the current work. The strain energy release rate associated with the elastic deformation required to overcome wafer bow is calculated. A contact yield criterion is used to examine the pressure and temperature conditions required to flatten surface roughness asperities in order to achieve bonding over the full apparent area. The results are compared to experimental data of bond yield and toughness obtained from four-point bend delamination testing and microscopic observations of the fractured surfaces. Conclusions from the modeling and experiments indicate that wafer bow has negligible effect on determining the variability of bond quality and that the well-bonded area is increased with increasing bonding pressure. The enhanced understanding of the underlying deformation mechanisms allows for a better controlled trade-off between the bonding pressure and temperature.

Aluminum-Scandium: A Material for Semiconductor Packaging

Science.gov (United States)

Geissler, Ute; Thomas, Sven; Schneider-Ramelow, Martin; Mukhopadhyay, Biswajit; Lang, Klaus-Dieter

2016-10-01

A well-known aluminum-scandium (Al-Sc) alloy, already used in lightweight sports equipment, is about to be established for use in electronic packaging. One application for Al-Sc alloy is manufacture of bonding wires. The special feature of the alloy is its ability to harden by precipitation. The new bonding wires with electrical conductivity similar to pure Al wires can be processed on common wire bonders for aluminum wedge/wedge (w/w) bonding. The wires exhibit very fine-grained microstructure. Small Al3Sc particles are the main reason for its high strength and prevent recrystallization and grain growth at higher temperatures (>150°C). After the wire-bonding process, the interface is well closed. Reliability investigations by active power cycling demonstrated considerably improved lifetime compared with pure Al heavy wires. Furthermore, the Al-Sc alloy was sputter-deposited onto silicon wafer to test it as chip metallization in copper (Cu) ball/wedge bonding technology. After deposition, the layers exhibited fine-grained columnar structure and small coherent Al3Sc particles with dimensions of a few nanometers. These particles inhibit softening processes such as Al splashing in fine wire bonding processes and increase the thickness of remnant Al under the copper balls to 85% of the initial thickness.

On the use of OSL of wire-bond chip card modules for retrospective and accident dosimetry

Energy Technology Data Exchange (ETDEWEB)

Woda, Clemens [Helmholtz Zentrum Muenchen - German Research Centre for Environmental Health, Institute of Radiation Protection, Ingolstaedter Landstrasse 1, D-85764 Neuherberg (Germany)], E-mail: clemens.woda@helmholtz-muenchen.de; Spoettl, Thomas [Infineon Technologies AG, Wernerwerkstrasse 1, D-93049 Regensburg (Germany)

2009-05-15

The potential of optically stimulated luminescence of wire-bond chip card modules, used in health insurance, ID, cash and credit cards for retrospective and accident dosimetry is investigated. Chip card modules obtained directly from the producer, using a widely spread UV-cured epoxy product for encapsulation, are used as basis for the study. The radiation sensitivity is due to silica grains added to the epoxy for controlling the thixotropic properties. Luminescence properties are complex due to the presumed thermo-optical release of electrons from the epoxy and transfer into the silica. Best results and highest sensitivity are obtained by using no or only low preheat treatments. A high degree of fading of the OSL signal during storage at room temperature is observed, which is tentatively explained by the superposition of thermal decay of shallow OSL traps and athermal (anomalous) decay of deeper OSL traps. The dose response of the OSL signal shows exponentially saturating behaviour, with saturation doses of 77 Gy or 9.6 Gy, depending on pretreatment. Dose recovery tests show that given doses can be recovered within a deviation of {+-}14%, if measured signals are corrected for fading. The minimum detectable dose is estimated at {approx}3 mGy, {approx}10 mGy and {approx}20 mGy for readouts immediately, 1 day and 10 days after exposure, respectively.

On the use of OSL of wire-bond chip card modules for retrospective and accident dosimetry

International Nuclear Information System (INIS)

Woda, Clemens; Spoettl, Thomas

2009-01-01

The potential of optically stimulated luminescence of wire-bond chip card modules, used in health insurance, ID, cash and credit cards for retrospective and accident dosimetry is investigated. Chip card modules obtained directly from the producer, using a widely spread UV-cured epoxy product for encapsulation, are used as basis for the study. The radiation sensitivity is due to silica grains added to the epoxy for controlling the thixotropic properties. Luminescence properties are complex due to the presumed thermo-optical release of electrons from the epoxy and transfer into the silica. Best results and highest sensitivity are obtained by using no or only low preheat treatments. A high degree of fading of the OSL signal during storage at room temperature is observed, which is tentatively explained by the superposition of thermal decay of shallow OSL traps and athermal (anomalous) decay of deeper OSL traps. The dose response of the OSL signal shows exponentially saturating behaviour, with saturation doses of 77 Gy or 9.6 Gy, depending on pretreatment. Dose recovery tests show that given doses can be recovered within a deviation of ±14%, if measured signals are corrected for fading. The minimum detectable dose is estimated at ∼3 mGy, ∼10 mGy and ∼20 mGy for readouts immediately, 1 day and 10 days after exposure, respectively.

Metallurgical processing and properties of multifilamentary V3Ga composite wires

International Nuclear Information System (INIS)

Howe, D.G.; Weinman, L.S.

1976-01-01

Multifilamentary composite wires of V - 6.1 at. percent Ga filaments in a Cu-17.5 at. percent Ga matrix were fabricated. High purity V and Ga were arc melted and cast to form an alloy rod. High purity Cu and Ga were induction melted and also cast as an alloy rod. The alloy rods were reduced in diameter by swaging. The larger diameter Cu - Ga matrix rod was drilled with 19 holes which terminated within the matrix-rod. The holes served as receptacles for 19 V-Ga rods which were inserted into the matrix. The composite assembly was evacuated under high vacuum and sealed by an electron beam weld. The composite was then reduced in diameter through swaging and wire drawing to 0.032-in. dia wire. V 3 Ga layers at the filament/matrix interface were formed through an isothermal solid-state reaction. Growth rates for V 3 Ga are strongly influenced by alloy composition and formation temperature, with more rapid growth occurring in composite wires with higher Ga contents. Improved critical current densities (J/sub c/) resulted from lower formation temperatures, J/sub c/ values of over 1 x 10 6 A/cm 2 in a transverse magnetic field of 100 kG were obtained in the multifilamentary composite wire. 9 figs

Modern wiring practice

CERN Document Server

Steward, W E

2012-01-01

Continuously in print since 1952, Modern Wiring Practice has now been fully revised to provide an up-to-date source of reference to building services design and installation in the 21st century. This compact and practical guide addresses wiring systems design and electrical installation together in one volume, creating a comprehensive overview of the whole process for contractors and architects, as well as electricians and other installation engineers. Best practice is incorporated throughout, combining theory and practice with clear and accessible explanation, all

Metallurgical characterization of a new nickel-titanium wire for rotary endodontic instruments.

Science.gov (United States)

Alapati, Satish B; Brantley, William A; Iijima, Masahiro; Clark, William A T; Kovarik, Libor; Buie, Caesar; Liu, Jie; Ben Johnson, William

2009-11-01

A novel thermomechanical processing procedure has been developed that yields a superelastic (SE) nickel-titanium (NiTi) wire (M-Wire) that laboratory testing shows has improved mechanical properties compared with conventional SE austenitic NiTi wires used for manufacture of rotary instruments. The objective of this study was to determine the origin of the improved mechanical properties. Specimens from 2 batches of M-Wire prepared under different processing conditions and from 1 batch of standard-processed SE wire for rotary instruments were examined by scanning transmission electron microscopy, temperature-modulated differential scanning calorimetry, micro-x-ray diffraction, and scanning electron microscopy with x-ray energy-dispersive spectrometric analyses. The processing for M-Wire yields a microstructure containing martensite, that the proportions of NiTi phases depend on processing conditions, and that the microstructure exhibits pronounced evidence of alloy strengthening. The presence of Ti(2)Ni precipitates in both microstructures indicates that M-Wire and the conventional SE wire for rotary instruments are titanium-rich.

On grouping individual wire segments into equivalent wires or chains, and introduction of multiple domain basis functions

CSIR Research Space (South Africa)

Lysko, AA

2009-06-01

Full Text Available The paper introduces a method to cover several wire segments with a single basis function, describes related practical algorithms, and gives some results. The process involves three steps: identifying chains of wire segments, splitting the chains...

Recrystallization texture in nickel heavily deformed by accumulative roll bonding

DEFF Research Database (Denmark)

Mishin, O. V.; Zhang, Y. B.; Godfrey, A.

2017-01-01

particle deformation zones around fragments of the steel wire brush used to prepare the surface for bonding. Sample-scale gradients are also observed, manifested as differences between the subsurface, intermediate and central layers, where the distributions of texture components are different...

A Predictive Velocity Observer in Wire Bonder’s Control System

Directory of Open Access Journals (Sweden)

Lei Zhou

2014-01-01

Full Text Available Wire bonder is a typical high speed machine. The motion speed of XY-stage is the key factor of bonding efficiency. However, phase lag elements in the servo system limit the bandwidth and slow down the system’s response. A predictive velocity observer is proposed to compensate for those phase lags. Then, the velocity loop controller can be designed as for a servo system which does not have those phase lags. Loop gains are enlarged and bandwidth is enlarged correspondingly. Then, the motion speed is improved and settling time is decreased. Experiment results verify that the predictive velocity observer provided a significant phase lead and the performance of wire bonder is improved.

Bane of Hydrogen-Bond Formation on the Photoinduced Charge-Transfer Process in Donor–Acceptor Systems

KAUST Repository

Alsam, Amani Abdu

2017-03-14

Controlling the ultrafast dynamical process of photoinduced charge transfer at donor acceptor interfaces remains a major challenge for physical chemistry and solar cell communities. The process is complicated by the involvement of other complex dynamical processes, including hydrogen bond formation, energy transfer, and solvation dynamics occurring on similar time scales. In this study, we explore the remarkable impact of hydrogen-bond formation on the interfacial charge transfer between a negatively charged electron donating anionic porphyrin and a positively charged electron accepting pi-conjugated polymer, as a model system in solvents with different polarities and capabilities for hydiogen bonding using femtosecond transient absorption spectroscopy. Unlike the conventional understanding of the key role of hydrogen bonding in promoting the charge-transfer process, our steadystate and time-resolved results reveal that the intervening hydrogen-bonding environment and, consequently, the probable longer spacing between the donor and acceptor molecules significantly hinders the charge-transfer process between them. These results show that site-specific hydrogen bonding and geometric considerations between donor and acceptor can be exploited to control both the charge-transfer dynamics and its efficiency not only at donor acceptor interfaces but also in complex biological systems.

Simulation of Bimetallic Bush Hot Rolling Bonding Process

Directory of Open Access Journals (Sweden)

Yaqin Tian

2015-01-01

Full Text Available Three-dimensional model of bimetallic bush was established including the drive roller and the core roller. The model adopted the appropriate interface assumptions. Based on the bonding properties of bimetallic bush the hot rolling process was analyzed. The optimum reduction ratio of 28% is obtained by using the finite element simulation software MARC on the assumption of the bonding conditions. The stress-strain distribution of three dimensions was research assumptions to interface deformation of rolling. At the same time, based on the numerical simulation, the minimum reduction ratio 20% is obtained by using a double metal composite bush rolling new technology from the experiment research. The simulation error is not more than 8%.

Experimental study on underwater electrical explosion of a copper wire

International Nuclear Information System (INIS)

Zhou Qing; Zhang Jun; Tan Xiangyu; Ren Baozhong; Zhang Qiaogen

2010-01-01

Through analyzing the physical process of underwater electrical wire explosion, electrical wire explosions with copper wires were investigated underwater using pulsed voltage in the time scale of a few microseconds. A self-integrating Rogowsky coil and a voltage divider were used for current and voltage at the wire load, respectively. The shock wave pressure is measured with a piezoelectric pressure probe at the same distance. The current rise rate was adjusted by changing the applied voltage, circuit inductance, length and diameter of copper wire. The change of the current rise rate had a great effect on the process of underwater electrical wire explosion with copper wires. At last, the effect of discharge voltage, circuit inductance, length and diameter of copper wire were obtained on the explosion voltage and current as well as shock wave pressure. (authors)

Chemistry of radiation damage to wire chambers

International Nuclear Information System (INIS)

Wise, J.

1992-08-01

Proportional counters are used to study aspects of radiation damage to wire chambers (wire aging). Principles of low-pressure, rf plasma chemistry are used to predict the plasma chemistry in electron avalanches (1 atm, dc). (1) Aging is studied in CF 4 /iC 4 H 10 gas mixtures. Wire deposits are analyzed by Auger electron spectroscopy. An apparent cathode aging process resulting in loss of gain rather than in a self-sustained current is observed in CF 4 -rich gases. A four-part model considering plasma polymerization of the hydrocarbon, etching of wire deposits by CF 4 , acceleration of deposition processes in strongly etching environments, and reactivity of the wire surface is developed to understand anode wire aging in CF 4 /iC 4 H 10 gases. Practical guidelines suggested by the model are discussed. (2) Data are presented to suggest that trace amounts of Freons do not affect aging rates in either dimethyl ether or Ar/C 2 H 6 . Apparent loss of gain is explained by attachment of primary electrons to a continuously increasing concentration of Freon 11 (CCl 3 F) in the counter gas. An increase in the concentration of Freon 11 in dimethyl ether is caused by a distillation process in the gas supply bottle and is a natural consequence of the unequal volatilities of the two compounds

Steer-by-wire innovations and demonstrator

NARCIS (Netherlands)

Lupker, H.A.; Zuurbier, J.; Verschuren, R.M.A.F.; Jansen, S.T.H.; Willemsen, D.M.C.

2002-01-01

Arguments for 'by-wire' systems include production costs, packaging and traffic safety. Innovations concern both product and development process e.g. combined virtual engineering and Hardware-in-the-loop testing. Three Steer-by-wire systems are discussed: a steering system simulator used as a

A statistical rationale for establishing process quality control limits using fixed sample size, for critical current verification of SSC superconducting wire

International Nuclear Information System (INIS)

Pollock, D.A.; Brown, G.; Capone, D.W. II; Christopherson, D.; Seuntjens, J.M.; Woltz, J.

1992-01-01

This work has demonstrated the statistical concepts behind the XBAR R method for determining sample limits to verify billet I c performance and process uniformity. Using a preliminary population estimate for μ and σ from a stable production lot of only 5 billets, we have shown that reasonable sensitivity to systematic process drift and random within billet variation may be achieved, by using per billet subgroup sizes of moderate proportions. The effects of subgroup size (n) and sampling risk (α and β) on the calculated control limits have been shown to be important factors that need to be carefully considered when selecting an actual number of measurements to be used per billet, for each supplier process. Given the present method of testing in which individual wire samples are ramped to I c only once, with measurement uncertainty due to repeatability and reproducibility (typically > 1.4%), large subgroups (i.e. >30 per billet) appear to be unnecessary, except as an inspection tool to confirm wire process history for each spool. The introduction of the XBAR R method or a similar Statistical Quality Control procedure is recommend for use in the superconducing wire production program, particularly when the program transitions from requiring tests for all pieces of wire to sampling each production unit

Process Simulation of Resistance Weld Bonding and Automotive Light-weight Materials

DEFF Research Database (Denmark)

Zhang, Wenqi; Chergui, Azeddine; Nielsen, Chris Valentin

of mechanical, electrical, thermal and metallurgical processes, which are essential for simulation of resistance welding process to predict the welding results and evaluate the weldability of materials. These functions have been further extended with new functions for optimization of welding process parameters...... and predicting welding process window, for weld planning with optimal welding parameter settings, and for modeling microstructures and hardness distribution after welding. Latest developments have been made on simulation of resistance welding with nonconductive materials for applications in weld bonding......This paper presents the latest developments in numerical simulation of resistance welding especially with the new functions for simulation of microstructures, weld bonding and spot welding of new light-weight materials. The fundamental functions in SORPAS® are built on coupled modeling...

Synthesis of one-dimensional metal-containing insulated molecular wire with versatile properties directed toward molecular electronics materials.

Science.gov (United States)

Masai, Hiroshi; Terao, Jun; Seki, Shu; Nakashima, Shigeto; Kiguchi, Manabu; Okoshi, Kento; Fujihara, Tetsuaki; Tsuji, Yasushi

2014-02-05

We report, herein, the design, synthesis, and properties of new materials directed toward molecular electronics. A transition metal-containing insulated molecular wire was synthesized through the coordination polymerization of a Ru(II) porphyrin with an insulated bridging ligand of well-defined structure. The wire displayed not only high linearity and rigidity, but also high intramolecular charge mobility. Owing to the unique properties of the coordination bond, the interconversion between the monomer and polymer states was realized under a carbon monoxide atmosphere or UV irradiation. The results demonstrated a high potential of the metal-containing insulated molecular wire for applications in molecular electronics.

wire chamber

CERN Multimedia

Proportional multi-wire chamber. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle. Proportional wire chambers allow a much quicker reading than the optical or magnetoscriptive readout wire chambers.

Wire breakage in SLC wire profile monitors

International Nuclear Information System (INIS)

Field, C.; McCormick, D.; Raimondi, P.; Ross, M.

1998-05-01

Wire scanning beam profile monitors are used at the Stanford Linear Collider (SLC) for emittance preservation control and beam optics optimization. Twenty such scanners have proven most useful for this purpose and have performed a total of 1.5 million scans in the 4 to 6 years since their installation. Most of the essential scanners are equipped with 20 to 40 microm tungsten wires. SLC bunch intensities and sizes often exceed 2 x 10 7 particles/microm 2 (3C/m 2 ). The authors believe that this has caused a number of tungsten wire failures that appear at the ends of the wire, near the wire support points, after a few hundred scans are accumulated. Carbon fibers, also widely used at SLAC, have been substituted in several scanners and have performed well. In this paper, the authors present theories for the wire failure mechanism and techniques learned in reducing the failures

THE USE OF EXCHANGEABLE BONDS DURING THE PRIVATIZATION PROCESS

Directory of Open Access Journals (Sweden)

Damian Kaźmierczak

2014-04-01

Full Text Available In our article we present the use of hybrid securities in the privatization process. We show that exchangeable bonds may be successfully applied during privatization of state companies throughout the world. It may be profitable for many reasons. Firstly, the exchangeables offer a much lower coupon in comparison with the ordinary government bonds which may be crucial for highly indebted countries. Secondly, throughout the entire maturity period the state remains the owner of the privatized firm which means that the government can be a beneficiary of high dividends paid by the public enterprises and can actively manage them. Thirdly, in the case of unfavorable market conditions the authorities get an opportunity to wait for the end of economic turmoil in order to avoid selling the equity participations under their true value. Finally, the issue of certain types of exchangeables (e.g. callable exchangeables or mandatory exchangeables and adding several provisions (e.g. greenshoe option or clean-up call makes the instrument more flexible for the issuer. We also present a few examples of the privatization processes by means of exchangeable bonds i.a. in Germany and in Austria. Most of such operations, e.g. German Deutsche Post, Austrian Telekom Austria or Portuguese Galp Energia SGPS S.A. were completed with success.

Feasibility studies on the direct wire readout on wire scanners in electron accelerators

International Nuclear Information System (INIS)

Markert, Michael

2010-10-01

This bachelor thesis deals essentially with the signal processing of a so-called wire scanner, a special monitor, which comes to application in the beam diagnostics of particle accelerators. In this direct wire readout the voltage signal, which is induced by the particle beam in the measurement wire of the wire scanner, shall be directly read out. The aim of this thesis is to show fundamental considerations and perform studies, which study, whether and how in the future by means of a suited data transmission as well as readout electronics conclusion on the most important parameters of the beam, like position and profile, are possible. The measurement system presented here is divided in three main components: Signal measurement, signal preparation, and signal stretching. A suited test facility was developed and is presented in detail, in which then all components, like for instance the transmission cables, the wire-scanner fork, and the developed measurement circuit, are studied, which are of importance for a faultless signal transmission and presentation. Extensive measurements on the single components, as well as calculations for the signal transmission on and in the wire scanner were performed, whereby a good agreement could be found. Thereafter a comparison and a selection of the component used in this project were made. Furthermore improvement proposals, new constructions, and outlooks are presented, which could be of importance in further works.

Mechanical behavior of M-Wire and conventional NiTi wire used to manufacture rotary endodontic instruments.

Science.gov (United States)

Pereira, Erika S J; Gomes, Renata O; Leroy, Agnès M F; Singh, Rupinderpal; Peters, Ove A; Bahia, Maria G A; Buono, Vicente T L

2013-12-01

Comparison of physical and mechanical properties of one conventional and a new NiTi wire, which had received an additional thermomechanical treatment. Specimens of both conventional (NiTi) and the new type of wire, called M-Wire (MW), were subjected to tensile and three-point bending tests, Vickers microhardness measurements, and to rotating-bending fatigue tests at a strain-controlled level of 6%. Fracture surfaces were observed by scanning electron microscopy and the non-deformed microstructures by transmission electron microscopy. The thermomechanical treatment applied to produce the M-Wire apparently increased the tensile strength and Vickers microhardness of the material, but its apparent Young modulus was smaller than that of conventionally treated NiTi. The three-point bending tests showed a higher flexibility for MW which also exhibited a significantly higher number of cycles to failure. M-Wire presented mechanical properties that can render endodontic instruments more flexible and fatigue resistant than those made with conventionally processed NiTi wires. Copyright © 2013 Academy of Dental Materials. Published by Elsevier Ltd. All rights reserved.

Anodic Aluminum Oxide Templates for Nano wires Array Fabrication

International Nuclear Information System (INIS)

Nur Ubaidah Saidin; Kok, K.Y.; Ng, I.K.

2011-01-01

This paper reports on the process developed to fabricate anodic aluminium oxide (AAO) templates suitable for the fabrication of nano wire arrays. Anodization process has been used to fabricate the AAO templates with pore diameters ranging from 15 nm to 30 nm. Electrodeposition of parallel arrays of high aspect ratio nickel nano wires were demonstrated using these fabricated AAO templates. The nano wires produced were characterized using X-ray diffraction (XRD) and scanning electron microscopy (SEM). It was found that the orientations of the electrodeposited nickel nano wires were governed by the deposition current and electrolyte conditions. (author)

On the improved adhesion of NiTi wires embedded in polyester and vinylester resins

Directory of Open Access Journals (Sweden)

Mattia Merlin

2015-01-01

Full Text Available This paper discusses the effect of different surface treatments on shape memory alloy wires embedded in PolyEster (PE and VinylEster (VE polymeric matrices. In particular, two types of chemical etching and a chemical bonding with a silane coupling agent have been performed on the surfaces of the wires. Pull-out tests have been carried out on samples made from a specifically designed Teflon mould. Considering the best results of the pull-out tests obtained with PE resin, the debonding induced by strain recovery of 4%, 5% and 6% pre-strained NiTi wires has been evaluated with the wires being subjected to different surface treatment conditions and then being embedded in the PE matrix. The results prove that the wires functionalised and embedded in the PE resin show the maximum pull-out forces and the highest interfacial adhesion. Finally, it has been found that debonding induced by strain recovery is strongly related to the propagation towards the radial direction of sharp cracks at the debonding region.

Mechanical Properties of Additive Manufactured Ti-6Al-4V Using Wire and Powder Based Processes

International Nuclear Information System (INIS)

Brandl, Erhard; Palm, Frank; Leyens, Christoph

2011-01-01

Since 1986 several techniques of building up geometries layer by layer have been developed and successfully commercialized under numerous trade names. Today, not only prototypes are realized by these techniques, but serial production parts are envisaged. To achieve this progress, the development activities have to focus on the reliability and output material quality. Particularly for aerospace applications, the material quality is an all-dominant factor. In this paper, an electron beam based powder-bed process and a laser based wire-feed process are investigated. Microstructure, chemical composition, static tensile and high cycle fatigue properties of Ti-6Al-4V samples are presented and evaluated from an aerospace application point of view. The static tensile properties resulting from both processes are mostly comparable to properties of cast or wrought material depending on post heat treatment and test direction. Fatigue limits of all samples are similar to those of wrought material. The impurity levels of oxygen, nitrogen, carbon and hydrogen are below the maximum level of plate material (AMS 4911L). The wire-feed process leads to a material with fewer impurities than the powder-bed process.

NUMERICAL SIMULATION OF RESIDUAL STRESSES GENERATED IN THE WIRE DRAWING PROCESS FOR DIFFERENT PROCESS PARAMETERS

Directory of Open Access Journals (Sweden)

Juliana Zottis

2014-03-01

Full Text Available The drawing process of steel bars is usually used to check better dimensional accuracy and mechanical properties to the material. In the other hand, the major concern found in manufacturing axes through this process is the appearance of distortion of shape. Such distortions are directly linked to the accumulation of residual stresses generated during the processes. As a result, this paper aims to study the influence of process parameters such as shape of puller, speed and lubrication used in wire drawing analyzing the accumulation of residual stress after the process. The stress analysis was performed by FEM being used two simulation software: Simufact.formingGP and DeformTM. Through these analyzes, it was found that the shape of how the bar is pulled causes a reduction of up to 100 MPa in residual stresses in the center of the bar, which represents an important factor in the study of the possible causes of the distortion. As well as factors speed and homogeneity of lubrication significantly altered the profile of residual stresses in the bar.

Plasma chemistry in wire chambers

International Nuclear Information System (INIS)

Wise, J.

1990-05-01

The phenomenology of wire chamber aging is discussed and fundamentals of proportional counters are presented. Free-radical polymerization and plasma polymerization are discussed. The chemistry of wire aging is reviewed. Similarities between wire chamber plasma (>1 atm dc-discharge) and low-pressure rf-discharge plasmas, which have been more widely studied, are suggested. Construction and use of a system to allow study of the plasma reactions occurring in wire chambers is reported. A proportional tube irradiated by an 55 Fe source is used as a model wire chamber. Condensable species in the proportional tube effluent are concentrated in a cryotrap and analyzed by gas chromatography/mass spectrometry. Several different wire chamber gases (methane, argon/methane, ethane, argon/ethane, propane, argon/isobutane) are tested and their reaction products qualitatively identified. For all gases tested except those containing methane, use of hygroscopic filters to remove trace water and oxygen contaminants from the gas resulted in an increase in the average molecular weight of the products, consistent with results from low-pressure rf-discharge plasmas. It is suggested that because water and oxygen inhibit polymer growth in the gas phase that they may also reduce polymer deposition in proportional tubes and therefore retard wire aging processes. Mechanistic implications of the plasma reactions of hydrocarbons with oxygen are suggested. Unresolved issues in this work and proposals for further study are discussed

Acoustic Emission from Elevator Wire Ropes During Tensile Testing

Science.gov (United States)

Bai, Wenjie; Chai, Mengyu; Li, Lichan; Li, Yongquan; Duan, Quan

The acoustic emission (AE) technique was used to monitor the tensile testing process for two kinds of elevator wire ropes in our work. The AE signals from wire breaks were obtained and analyzed by AE parameters and waveforms. The results showed that AE technique can be a useful tool to monitor wire break phenomenon of wire ropes and effectively capture information of wire break signal. The relationship between AE signal characteristics and wire breaks is investigated and it is found that the most effective acoustic signal discriminators are amplitude and absolute energy. Moreover, the wire break signal of two kinds of ropes is a type of burst signal and it is believed that the waveform and spectrum can be applied to analyze the AE wire break signals.

Heat resistant wire and cable and heat shrinkable tubes

Energy Technology Data Exchange (ETDEWEB)

Ueno, Keiji [Sumitomo Electric Industries Ltd. (Japan)

1994-12-31

Radiation processes have been used in industrial fields (e.g. wire and cable, heat shrinkable tubes) for about 30 years. In Japan, 60 electron beam accelerators were used in R and D, 54 in wire and cable, 24 in tire rubber, 16 in paint curing, 14 in PE foam and 9 accelerators were used in heat shrinkable tubes in 1993. Many properties (e.g. solder resistance, thermal deformation, and solven resistance) of wire and cable are improved by using radiation processes, and many kinds of radiation crosslinked wire and cable are used in the consumer market (TV sets, VTR`s, audio disc players, etc.), automobiles (automobile wire harnesses, fusible link wires, sensor cables etc.), and the industrial market (computer cables, cables for keyboards, coaxial cables, etc.). Another important industrial application of E{beta} radiation process is heat shrinkable tubes. Heat shinkable tubes, heated by a hot gun, shrink 1/2 {approx} 1/3 of their inner diameters. Heat shrinkable tubes are used for covers of distributing line terminals, joint covers of telecommunication lines, protection of fuel pipe lines and so on. In this seminar, actual applications and characteristic properties of radiation crosslinked materials are presented.

Heat resistant wire and cable and heat shrinkable tubes

International Nuclear Information System (INIS)

Keiji Ueno

1994-01-01

Radiation processes have been used in industrial fields (e.g. wire and cable, heat shrinkable tubes) for about 30 years. In Japan, 60 electron beam accelerators were used in R and D, 54 in wire and cable, 24 in tire rubber, 16 in paint curing, 14 in PE foam and 9 accelerators were used in heat shrinkable tubes in 1993. Many properties (e.g. solder resistance, thermal deformation, and solven resistance) of wire and cable are improved by using radiation processes, and many kinds of radiation crosslinked wire and cable are used in the consumer market (TV sets, VTR's, audio disc players, etc.), automobiles (automobile wire harnesses, fusible link wires, sensor cables etc.), and the industrial market (computer cables, cables for keyboards, coaxial cables, etc.). Another important industrial application of Eβ radiation process is heat shrinkable tubes. Heat shinkable tubes, heated by a hot gun, shrink 1/2 ∼ 1/3 of their inner diameters. Heat shrinkable tubes are used for covers of distributing line terminals, joint covers of telecommunication lines, protection of fuel pipe lines and so on. In this seminar, actual applications and characteristic properties of radiation crosslinked materials are presented

Sensitive and simple method for measuring wire tensions

International Nuclear Information System (INIS)

Atac, M.; Mishina, M.

1982-08-01

Measuring tension of wires in drift chambers and multiwire proportional chambers after construction is an important process because sometimes wires get loose after soldering, crimping or glueing. One needs to sort out wires which have tensions below a required minimum value to prevent electrostatic instabilities. There have been several methods reported on this subject in which the wires were excited either with sinusoidal current under magnetic field or with sinusoidal voltage electrostatically coupled to the wire, searching for a resonating frequency with which the wires vibrate mechanically. Then the vibration is detected either visually, optically or with magnetic pick-up directly touching the wires. Any of these is only applicable to the usual multiwire chamber which has open access to the wire plane. They also need fairly large excitation currents to induce a detectable vibration to the wires. Here we report a very simple method that can be used for any type of wire chamber or proportional tube system for measuring wire tension. Only a very small current is required for the wire excitation to obtain a large enough signal because it detects the induced emf voltage across a wire. A sine-wave oscillator and a digital voltmeter are sufficient devices aside from a permanent magnet to provide the magnetic field around the wire. A useful application of this method to a large system is suggested

Maxillary molar derotation and distalization by using a nickel-titanium wire fabricated on a setup model.

Science.gov (United States)

Jung, Jong Moon; Wi, Young Joo; Koo, Hyun Mo; Kim, Min Ji; Chun, Youn Sic

2017-07-01

The purpose of this article is to introduce a simple appliance that uses a setup model and a nickel-titanium (Ni-Ti) wire for correcting the mesial rotation and drift of the permanent maxillary first molar. The technique involves bonding a Ni-Ti wire to the proper position of the target tooth on a setup model, followed by the fabrication of the transfer cap for indirect bonding and its transfer to the patient's teeth. This appliance causes less discomfort and provides better oral hygiene for the patients than do conventional appliances such as the bracket, pendulum, and distal jet. The treatment time is also shorter with the new appliance than with full-fixed appliances. Moreover, the applicability of the new appliance can be expanded to many cases by using screws or splinting with adjacent teeth to improve anchorage.

Si Wire-Array Solar Cells

Science.gov (United States)

Boettcher, Shannon

2010-03-01

Micron-scale Si wire arrays are three-dimensional photovoltaic absorbers that enable orthogonalization of light absorption and carrier collection and hence allow for the utilization of relatively impure Si in efficient solar cell designs. The wire arrays are grown by a vapor-liquid-solid-catalyzed process on a crystalline (111) Si wafer lithographically patterned with an array of metal catalyst particles. Following growth, such arrays can be embedded in polymethyldisiloxane (PDMS) and then peeled from the template growth substrate. The result is an unusual photovoltaic material: a flexible, bendable, wafer-thickness crystalline Si absorber. In this paper I will describe: 1. the growth of high-quality Si wires with controllable doping and the evaluation of their photovoltaic energy-conversion performance using a test electrolyte that forms a rectifying conformal semiconductor-liquid contact 2. the observation of enhanced absorption in wire arrays exceeding the conventional light trapping limits for planar Si cells of equivalent material thickness and 3. single-wire and large-area solid-state Si wire-array solar cell results obtained to date with directions for future cell designs based on optical and device physics. In collaboration with Michael Kelzenberg, Morgan Putnam, Joshua Spurgeon, Daniel Turner-Evans, Emily Warren, Nathan Lewis, and Harry Atwater, California Institute of Technology.

NaAuS chicken-wire-like semiconductor: Electronic structure and optical properties

International Nuclear Information System (INIS)

Reshak, A.H.; Khan, Saleem Ayaz; Kamarudin, H.; Bila, Jiri

2014-01-01

Highlights: • Chicken wire like semiconductor NaAuS was investigated. • Good agreement with experimental data was found. • Electronic charge density of chicken wire like semiconductor NaAuS was obtained. • The calculated uniaxial anisotropy is −0.0005, indicating the strong anisotropy. -- Abstract: The electronic structure, charge density and optical properties of NaAuS a chicken-wire-like semiconductor was calculated using full potential linear augmented plane wave based on density functional theory. The Ceperley-Alder local density approximation, Perdew Becke Ernzerhof Generalized gradient approximation and Engel Voskov Generalized Gradient Approximation were applied to solve the exchange correlation potential. The investigation of band structures and density of states elucidates that Engle Vasko Generalized Gradient Approximation shows close agreement to the experimental data. The calculated valence charge density shows pure ionic nature of Au–Au bond. It becomes partially covalent when Au is connected with two Na atoms. The linear optical susceptibilities of chicken-wire-like NaAuS semiconductor are calculated so as to obtain further insight into the electronic properties. The uniaxial anisotropy is −0.0005, indicating the strong anisotropy of the dielectric function in the NaAuS a chicken-wire-like semiconductor

NaAuS chicken-wire-like semiconductor: Electronic structure and optical properties

Energy Technology Data Exchange (ETDEWEB)

Reshak, A.H. [Institute of Complex Systems, FFPW, CENAKVA, University of South Bohemia in CB, Nove Hrady 37333 (Czech Republic); Center of Excellence Geopolymer and Green Technology, School of Material Engineering, University Malaysia Perlis, 01007 Kangar, Perlis (Malaysia); Khan, Saleem Ayaz, E-mail: sayaz_usb@yahoo.com [Institute of Complex Systems, FFPW, CENAKVA, University of South Bohemia in CB, Nove Hrady 37333 (Czech Republic); Kamarudin, H. [Center of Excellence Geopolymer and Green Technology, School of Material Engineering, University Malaysia Perlis, 01007 Kangar, Perlis (Malaysia); Bila, Jiri [Department of Instrumentation and Control Engineering, Faculty of Mechanical Engineering, CTU in Prague, Technicka 4, 166 07 Prague 6 (Czech Republic)

2014-01-05

Highlights: • Chicken wire like semiconductor NaAuS was investigated. • Good agreement with experimental data was found. • Electronic charge density of chicken wire like semiconductor NaAuS was obtained. • The calculated uniaxial anisotropy is −0.0005, indicating the strong anisotropy. -- Abstract: The electronic structure, charge density and optical properties of NaAuS a chicken-wire-like semiconductor was calculated using full potential linear augmented plane wave based on density functional theory. The Ceperley-Alder local density approximation, Perdew Becke Ernzerhof Generalized gradient approximation and Engel Voskov Generalized Gradient Approximation were applied to solve the exchange correlation potential. The investigation of band structures and density of states elucidates that Engle Vasko Generalized Gradient Approximation shows close agreement to the experimental data. The calculated valence charge density shows pure ionic nature of Au–Au bond. It becomes partially covalent when Au is connected with two Na atoms. The linear optical susceptibilities of chicken-wire-like NaAuS semiconductor are calculated so as to obtain further insight into the electronic properties. The uniaxial anisotropy is −0.0005, indicating the strong anisotropy of the dielectric function in the NaAuS a chicken-wire-like semiconductor.

Vibration of signal wires in wire detectors under irradiation

International Nuclear Information System (INIS)

Bojko, I.R.; Shelkov, G.A.; Dodonov, V.I.; Ignatenko, M.A.; Nikolenko, M.Yu.

1995-01-01

Radiation-induced vibration of signal wires in wire detectors is found and explained. The phenomenon is based on repulsion of a signal wire with a positive potential and a cloud of positive ions that remains after neutralization of the electron part of the avalanche formed in the course of gas amplification. Vibration with a noticeable amplitude may arise from fluctuations of repulsive forces, which act on the wire and whose sources are numerous ion clusters. A formula is obtained which allows wire oscillations to be estimated for all types of wire detectors. Calculation shows that oscillations of signal wires can be substantial for the coordinate accuracy of a detector working in the limited streamer mode at fluxes over 10 5 particles per second per wire. In the proportional mode an average oscillation amplitude can be as large as 20-30 μm at some detector parameters and external radiation fluxes over 10 5 . The experimental investigations show that the proposed model well describes the main features of the phenomenon. 6 refs., 8 figs

Breakdown processes in wire chambers, prevention and rate capability

International Nuclear Information System (INIS)

Atac, M.

1983-01-01

Breakdowns were optically and electronically observed in drift tubes and drift chambers. They occur at a critical gain for given intensity in a gas mixture when ultraviolet photons are not completely quenched. It was observed that the breakdowns depended critically on average current for a given gas mixture independent of the size of the drift tubes used. Using 4.6% ethyl alcohol vapor mixed into 50/50 argon ethane gas, breakdown are eliminated up to 7 /sub μ/A average current drawn by pulses on a 1 cm section of an anode wire under an intense source. Pulses with an avalanche size of 10 6 electron rates above 10 6 pulses per centimeter per wire may be obtained with the elimination of breakdowns

Breakdown processes in wire chambers, prevention and rate capability

International Nuclear Information System (INIS)

Atac, M.

1982-01-01

Breakdowns were optically and electronically observed in drift tubes and drift chambers. They occur at a critical gain for given intensity in a gas mixture when ultraviolet photons are not completely quenched. It was observed that the breakdowns depended critically on average current for a given gas mixture independent of the size of the drift tubes used. Using 4.6% ethyl alcohol vapor mixed into 50/50 argon ethane gas, breakdowns are eliminated up to 7 μA average current drawn by pulses on a 1 cm section of an anode wire under an intense source. Pulses with an avalanche size of 10 6 electron rates above 10 6 pulses per centimeter per wire may be obtained with the elimination of breakdowns

Passivation process for superfine aluminum powders obtained by electrical explosion of wires

International Nuclear Information System (INIS)

Kwon, Young-Soon; Gromov, Alexander A.; Ilyin, Alexander P.; Rim, Geun-Hie

2003-01-01

The process of passivation of superfine aluminum powders (SFAPs) (a s ≤100 nm), obtained with the electrical explosion of wires (EEW) method, has been studied. The passivation coatings of different nature (oxides, stearic acid and aluminum diboride) were covered on the particle surface. The process of passivation and analysis of passivated powders was studied by X-ray photoelectron spectroscopy (XPS), XRD, TEM, infrared spectroscopy (IR), mass spectrometry (MS), thermocouple method and bomb calorimetry. After the comprehensive testing of coatings, a model of stabilization of the superfine aluminum particles was suggested, explaining the anomalous high content of aluminum metal in the electroexplosive powders. The main characteristic of the model is a formation of charged structures, which prevent metal oxidation

Dynamical analysis of surface-insulated planar wire array Z-pinches

Science.gov (United States)

Li, Yang; Sheng, Liang; Hei, Dongwei; Li, Xingwen; Zhang, Jinhai; Li, Mo; Qiu, Aici

2018-05-01

The ablation and implosion dynamics of planar wire array Z-pinches with and without surface insulation are compared and discussed in this paper. This paper first presents a phenomenological model named the ablation and cascade snowplow implosion (ACSI) model, which accounts for the ablation and implosion phases of a planar wire array Z-pinch in a single simulation. The comparison between experimental data and simulation results shows that the ACSI model could give a fairly good description about the dynamical characteristics of planar wire array Z-pinches. Surface insulation introduces notable differences in the ablation phase of planar wire array Z-pinches. The ablation phase is divided into two stages: insulation layer ablation and tungsten wire ablation. The two-stage ablation process of insulated wires is simulated in the ACSI model by updating the formulas describing the ablation process.

Effects of Wire EDM on the Microstructure of P/M Titanium Samples.

Science.gov (United States)

Viskić, Joško; Schauperl, Zdravko; Ćatić, Amir; Balog, Martin; Krizik, Peter; Gržeta, Biserka; Popović, Jasminka; Ortolan, Slađana Milardović; Mehulić, Ketij

2014-12-01

Commercially pure titanium (CP Ti) has been recognized in dentistry for its biocompatibility, good mechanical properties and corrosion resistance. Conventional manufacturing processes can affect surface quality and result in poor bonding of dental ceramics to CP Ti. This is why powder metallurgy (P/M) and wire electro-discharge machining (WEDM) are being introduced in the manufacturing process. The aim of this study was to evaluate the effect of WEDM on the surface composition and microstructure of P/M CP Ti samples produced for bond strength testing according to ISO 9693. Eight samples of P/M CP Ti, dimensions according to ISO 9693, were made using WEDM and divided in two groups (untreated and grinded). Microanalyses of chemical composition and microstructure of both groups were made using SEM, EDS and XDR. SEM and EDS analysis of untreated samples showed a thin layer on surfaces with fractures in it. Grinded samples showed homogenous structure with no layer and no fractures. XDR analysis showed high level of oxides on the surface of untreated samples, while after grinding only pure α-phase was found. WEDM is a suitable method of sample production for ISO 9693 if accompanied by grinding with silicon carbide papers P320-P4000.

Wire Chamber

CERN Multimedia

Magnetoscriptive readout wire chamber. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

Wire chamber

CERN Multimedia

1967-01-01

Magnetoscriptive readout wire chamber.Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

Multi responses optimization of wire EDM process parameters using ...

African Journals Online (AJOL)

Taguchi approach coupled with principal component analysis methodology .... Wire EDM to perform trails; (2) Selection of material according to importance and .... manufacturing of oil and gases pipeline, springs, construction, automobiles and ...

Signals analysis of fluxgate array for wire rope defaults

International Nuclear Information System (INIS)

Gu Wei; Chu Jianxin

2005-01-01

In order to detecting the magnetic leakage fields of the wire rope defaults, a transducer made up of the fluxgate array is designed, and a series of the characteristic values of wire rope defaults signals are defined. By processing the characteristic signals, the LF or LMA of wire rope are distinguished, and the default extent is estimated. The experiment results of the new method for detecting the wire rope faults are introduced

Ultrasonic cleaning of electrodes of wire chambers

International Nuclear Information System (INIS)

Krasnov, V.A.; Kurepin, A.B.; Razin, V.I.

1980-01-01

A technological process of cleaning electrodes and working volume surfaces of wire chambers from contaminations by the simultaneous mechanical action of the energy of ultrasonic oscillations and the chemical action of detergents is discussed. A device for cleaning wire electrodes of proportional chambers of 0.3x0.4 m is described. The device uses two ultrasonic generators with a total power of 0.5 kW. As a detergent use is made of a mixture of ethyl alcohol, gasoline and freon. In the process of cleaning production defects can be detected in the wire chambers which makes it possible to timely remove the defects. Measurements of the surface resistance of fiberglass laminate of printed drift chamber electrodes at a voltage of 2 kV showed that after completing the cleaning process the resistance increases 15-20%

Fuel pellets from biomass - Processing, bonding, raw materials

Energy Technology Data Exchange (ETDEWEB)

Stelte, W.

2011-12-15

The present study investigates several important aspects of biomass pelletization. Seven individual studies have been conducted and linked together, in order to push forward the research frontier of biomass pelletization processes. The first study was to investigate influence of the different processing parameters on the pressure built up in the press channel of a pellet mill. It showed that the major factor was the press channel length as well as temperature, moisture content, particle size and extractive content. Furthermore, extractive migration to the pellet surface at an elevated temperature played an important role. The second study presented a method of how key processing parameters can be estimated, based on a pellet model and a small number of fast and simple laboratory trials using a single pellet press. The third study investigated the bonding mechanisms within a biomass pellet, which indicate that different mechanisms are involved depending on biomass type and pelletizing conditions. Interpenetration of polymer chains and close intermolecular distance resulting in better secondary bonding were assumed to be the key factors for high mechanical properties of the formed pellets. The outcome of this study resulted in study four and five investigating the role of lignin glass transition for biomass pelletization. It was demonstrated that the softening temperature of lignin was dependent on species and moisture content. In typical processing conditions and at 8% (wt) moisture content, transitions were identified to be at approximately 53-63 deg. C for wheat straw and about 91 deg. C for spruce lignin. Furthermore, the effects of wheat straw extractives on the pelletizing properties and pellet stability were investigated. The sixth and seventh study applied the developed methodology to test the pelletizing properties of thermally pre-treated (torrefied) biomass from spruce and wheat straw. The results indicated that high torrefaction temperatures above 275 deg

Processing and critical currents of high-Tc superconductor wires

International Nuclear Information System (INIS)

Krauth, H.; Heine, K.; Tenbrink, J.

1991-01-01

High-Tc superconductors are expected to have a major impact on magnet and energy technology. For technical applications they have to fulfill the requirement of carrying sufficient current at a critical current density of the order of 10 5 A/cm 2 at operating temperature and magnetic field. At 77 K these values have not been achieved yet in bulk material or wires due to weak link problems and flux creep effects. Progress made so far and remaining problems will be discussed in detail concentrating on problems concerning development of technical wires. In Bi-based materials technically interesting critical current densities could be achieved at 4.2 K in fields above 20 T (1,2), rendering possible the use of such material for very high field application. (orig.)

Modelling of drawing and rolling of high carbon flat wires

International Nuclear Information System (INIS)

Bobadilla, C.; Persem, N.; Foissey, S.

2007-01-01

In order to meet customer requirements, it is necessary to develop new flat wires with a high tensile strength and a high width/thickness ratio. These products are manufactured from wire rod. The first step is to draw the wire until we have the required mechanical properties and required surface area of the section. After this, the wire is rolled from a round to a rectangular section. During the flat rolling process it can be reduced by more than 50%. Then the wire is exposed to a high level of stress during this process. Modelling allows us to predetermine this stress level, taking into account the final dimensions and the mechanical properties, thus optimising both rolling and drawing process. Forge2005 was used in order to simulate these processes. The aim of this study is to determine the value of residual stresses after drawing and so to optimise rolling. Indeed, the highest stress values are reached at this step of the process by changing the section of the wire from a round to a rectangular one. In order to evaluate the stress value accuracy for high strain levels, a behaviour law has been identified. This is a result of tensile tests carried out at each step of the drawing process. Finally, a multi-axial damage criterion was implemented using Forge2005. The optimisation of the rolling is directly linked to the minimisation of this criterion

Development of Nb3Sn AC superconducting wire. Pt. 2

International Nuclear Information System (INIS)

Kasahara, Hobun; Torii, Shinji; Akita, Shirabe; Ueda, Kiyotaka; Kubota, Yoji; Yasohama, Kazuhiko; Kobayashi, Hisayasu; Ogasawara, Takeshi.

1993-01-01

For the realization of superconducting power apparatus, it is important that the development of highly stable superconducting cables. Nb 3 Sn wire has higher critical temperature than NbTi wire. Therefore, it is possible to make highly stable superconducting wires. In this report, we examine a manufacturing process of Ac Nb 3 Sn wire. This manufacturing process has four times higher critical current density than conventional processes. We have made a 400 kVA class AC coil with React and Wind method. The loss density of this coil was 20MW/m 3 at just before the quench. In this case, the temperature of cable increased about 3.8 K. This means that the Nb 3 Sn coil has a very high stability. (author)

Processing and characterization of superconducting solenoids made of Bi-2212/Ag-alloy multifilament round wire for high field magnet applications

Science.gov (United States)

Chen, Peng

between turns due to densification of wires (~4% wire diameter reduction) during 50-100 bar OP processing, and the diameter shrinking of conductors will potentially lead to coil sagging. So far, we have developed some methods to solve the issue of coil sagging, such as using flexible coil flange to allow smooth sagging of winding pack during OP processing. We have also investigated electrical joints between Bi-2212 RW conductors, which include resistive joints and superconducting joints. For resistive Bi-2212 joints, we evaluated conventional diffusion bonding method and soldering method. In general, the joints (with 42 mm joint length) resistances are below 200 nO at 4.2 K and magnetic fields up to 13.5 T, and the effect of magnetoresistance is clearly present. In addition to resistive joints, we successfully developed a superconducting joint between Bi-2212 RW conductors for persistent current mode (PCM) operations. (Abstract shortened by UMI.).

Deformable wire array: fiber drawn tunable metamaterials

DEFF Research Database (Denmark)

Fleming, Simon; Stefani, Alessio; Tang, Xiaoli

2017-01-01

By fiber drawing we fabricate a wire array metamaterial, the structure of which can be actively modified. The plasma frequency can be tuned by 50% by compressing the metamaterial; recovers when released and the process can be repeated.......By fiber drawing we fabricate a wire array metamaterial, the structure of which can be actively modified. The plasma frequency can be tuned by 50% by compressing the metamaterial; recovers when released and the process can be repeated....

Progress in Effect of Nano-modified Coatings and Welding Process Parameters on Wear of Contact Tube for Non-copper Coated Solid Wires

Directory of Open Access Journals (Sweden)

LI Zhuo-xin

2017-12-01

Full Text Available Environment-friendly non-copper coated solid wire is the main developing trend for gas shielded solid wires, whereas wear of contact tube limits their wide application. The effect of nano-modified coatings and welding process parameters on wear of contact tube for non-copper coated solid wires was reviewed. It was found that the wear of contact tube can be reduced due to the formation of tribo-films on the rubbing surfaces of welding wires against contact tube; it is feasible to decrease contact tube wear when non-copper coated solid wires are coated with nano-modified lubricants, thereby displaying excellent lubricating and thermal or electrical conduction characteristics. The wear of contact tube increases with the increase of welding current. The wear of contact tube is worse in direct-current electrode positive (DCEP than in direct-current electrode negative (DCEN. Arc ablation and electrical erosion are the dominant wear mechanisms of contact tube.

En-masse retraction with a preformed nickel-titanium and stainless steel archwire assembly and temporary skeletal anchorage devices without posterior bonding.

Science.gov (United States)

Jee, Jeong-Hyun; Ahn, Hyo-Won; Seo, Kyung-Won; Kim, Seong-Hun; Kook, Yoon-Ah; Chung, Kyu-Rhim; Nelson, Gerald

2014-09-01

To evaluate the therapeutic effects of a preformed assembly of nickel-titanium (NiTi) and stainless steel (SS) archwires (preformed C-wire) combined with temporary skeletal anchorage devices (TSADs) as the sole source of anchorage and to compare these effects with those of a SS version of C-wire (conventional C-wire) for en-masse retraction. Thirty-one adult female patients with skeletal Class I or II dentoalveolar protrusion, mild-to-moderate anterior crowding (3.0-6.0 mm), and stable Class I posterior occlusion were divided into conventional (n = 15) and preformed (n = 16) C-wire groups. All subjects underwent first premolar extractions and en-masse retraction with pre-adjusted edgewise anterior brackets, the assigned C-wire, and maxillary C-tubes or C-implants; bonded mesh-tube appliances were used in the mandibular dentition. Differences in pretreatment and post-retraction measurements of skeletal, dental, and soft-tissue cephalometric variables were statistically analyzed. Both groups showed full retraction of the maxillary anterior teeth by controlled tipping and space closure without altered posterior occlusion. However, the preformed C-wire group had a shorter retraction period (by 3.2 months). Furthermore, the maxillary molars in this group showed no significant mesialization, mesial tipping, or extrusion; some mesialization and mesial tipping occurred in the conventional C-wire group. Preformed C-wires combined with maxillary TSADs enable simultaneous leveling and space closure from the beginning of the treatment without maxillary posterior bonding. This allows for faster treatment of dentoalveolar protrusion without unwanted side effects, when compared with conventional C-wire, evidencing its clinical expediency.

A new wire fabrication processing using high Ga content Cu-Ga compound in V3Ga compound superconducting wire

International Nuclear Information System (INIS)

Hishinuma, Yoshimitsu; Nishimura, Arata; Kikuchi, Akihiro; Iijima, Yasuo; Takeuchi, Takao

2007-01-01

A superconducting magnet system is also one of the important components in an advanced magnetic confinement fusion reactor. Then it is required to have a higher magnetic field property to confine and maintain steady-sate burning deuterium (D)-tritium (T) fusion plasma in the large interspace during the long term operation. Burning plasma is sure to generate 14 MeV fusion neutrons during deuterium-tritium reaction, and fusion neutrons will be streamed and penetrated to superconducting magnet through large ports with damping neutron energy. Therefore, it is necessary to consider carefully not only superconducting property but also neutron irradiation property in superconducting materials for use in a future fusion reactor, and a 'low activation and high field superconducting magnet' will be required to realize the fusion power plant beyond International Thermonuclear Experimental Reactor (ITER). V-based superconducting material has a much shorter decay time of induced radioactivity compared with the Nb-based materials. We thought that the V 3 Ga compound was one of the most promising materials for the 'low activation and higher field superconductors' for an advanced fusion reactor. However, the present critical current density (J c ) property of V 3 Ga compound wire is insufficient for apply to fusion magnet applications. We investigated a new route PIT process using a high Ga content Cu-Ga compound in order to improve the superconducting property of the V 3 Ga compound wire. (author)

Effect of surface treatment on mechanical properties of glass fiber/stainless steel wire mesh reinforced epoxy hybrid composites

Energy Technology Data Exchange (ETDEWEB)

N, Karunagaran [S.K.P Engineering College, Tiruvannamalai (India); A, Rajadurai [Anna University, Chennai (India)

2016-06-15

This paper investigates the effect of surface treatment for glass fiber, stainless steel wire mesh on tensile, flexural, inter-laminar shear and impact properties of glass fiber/stainless steel wire mesh reinforced epoxy hybrid composites. The glass fiber fabric is surface treated either by 1 N solution of sulfuric acid or 1 N solution of sodium hydroxide. The stainless steel wire mesh is also surface treated by either electro dissolution or sand blasting. The hybrid composites are fabricated using epoxy resin reinforced with glass fiber and fine stainless steel wire mesh by hand lay-up technique at room temperature. The hybrid composite consisting of acid treated glass fiber and sand blasted stainless steel wire mesh exhibits a good combination of tensile, flexural, inter-laminar shear and impact behavior in comparison with the composites made without any surface treatment. The fine morphological modifications made on the surface of the glass fiber and stainless steel wire mesh enhances the bonding between the resin and reinforcement which inturn improved the tensile, flexural, inter-laminar shear and impact properties.

Prediction of grain deformation in drawn copper wire

OpenAIRE

Chang Chao-Cheng; Wang Zi-Wei; Huang Chien-Kuo; Wu Hsu-Fu

2015-01-01

Most copper wire is produced using a drawing process. The crystallographic texture of copper wire, which is strongly associated with grain deformation, can have a profound effect on the formability and mechanical and electrical properties. Thus, the ability to predict grain deformation in drawn copper wire could help to elucidate the evolution of microstructure, which could be highly valuable in product design. This study developed a novel method for predicting grain deformation in drawn copp...

Development of environmental-friendly wire and cable

International Nuclear Information System (INIS)

Ueno, Keiji

1996-01-01

The electron beam technology has been used in many industrial fields as a method of conventional polymer modification or optimum processability. The main industrial fields of radiation crosslinking are wire and cable, heat shrinkable tubings, plastic foams, precuring of tires, floppy disk curing, foods packaging films, and so on. The radiation crosslinking of wire and cable was started in 1961 in Japan and 15 wire and cable companies are now using electron beam accelerators for production or R and D. The dominant characteristics of crosslinking of insulation materials are application at high temperature, good oil and chemical resistibility and high mechanical properties. These radiation crosslinking wire and cable are applied widely in electronics equipments and automobiles. Recently, electronics manufacturers have indicated deep concern over the effects on the environment. Wire and cable also are required to be applicable for environmental preservation. (J.P.N.)

Influence of the Manufacturing Process on Defects in the Galvanized Coating of High Carbon Steel Wires

Directory of Open Access Journals (Sweden)

Marcello Gelfi

2017-03-01

Full Text Available This study is a detailed failure analysis of galvanized high carbon steel wires, which developed coating cracks during the torsion test performed as a quality control at the end of the manufacturing process. Careful visual inspections showed that the cracks are already present in the coating before the torsion test. In order to explain the origin of these cracks, systematic metallographic investigations were performed by means of optical and scanning electron microscope on both the wires and the rods that have been cold drawn to produce the wire. The chemical composition of the galvanized coatings was evaluated by means of energy dispersive spectroscopy. Micro bidimensional X-ray diffraction experiments were also performed to measure the residual stresses in the galvanized coating. The results showed that the failure is related to two main factors: the relatively high content of silicon in the steel and the unsuitable cooling rate of the rods at the exit from the galvanizing bath. The mechanism proposed to explain the origin of the defects was supported by Finite Elements Methods simulations and verified with in-plant tests. The proper countermeasures were then applied and the problem successfully solved.

Influence of the Manufacturing Process on Defects in the Galvanized Coating of High Carbon Steel Wires.

Science.gov (United States)

Gelfi, Marcello; Solazzi, Luigi; Poli, Sandro

2017-03-06

This study is a detailed failure analysis of galvanized high carbon steel wires, which developed coating cracks during the torsion test performed as a quality control at the end of the manufacturing process. Careful visual inspections showed that the cracks are already present in the coating before the torsion test. In order to explain the origin of these cracks, systematic metallographic investigations were performed by means of optical and scanning electron microscope on both the wires and the rods that have been cold drawn to produce the wire. The chemical composition of the galvanized coatings was evaluated by means of energy dispersive spectroscopy. Micro bidimensional X-ray diffraction experiments were also performed to measure the residual stresses in the galvanized coating. The results showed that the failure is related to two main factors: the relatively high content of silicon in the steel and the unsuitable cooling rate of the rods at the exit from the galvanizing bath. The mechanism proposed to explain the origin of the defects was supported by Finite Elements Methods simulations and verified with in-plant tests. The proper countermeasures were then applied and the problem successfully solved.

Progress in AMSC scale-up of second generation HTS wire

International Nuclear Information System (INIS)

Zhang, W.; Rupich, M.W.; Schoop, U.; Verebelyi, D.T.; Thieme, C.L.H.; Li, X.; Kodenkandath, T.; Huang, Y.; Siegal, E.; Buczek, D.; Carter, W.; Nguyen, N.; Schreiber, J.; Prasova, M.; Lynch, J.; Tucker, D.; Fleshler, S.

2007-01-01

American Superconductor has successfully scaled up its low-cost, high volume second generation (2G) HTS wire process into pre-pilot scale production, with performance approaching first generation (1G) HTS wire. AMSC's manufacturing approach is based on RABiTS TM /MOD wide strip technology, with metal organic deposition (MOD) process for the YBCO layer and the Rolling Assisted Biaxially Textured Substrate (RABiTS) process for the template. In this paper, we review the status of the 2G manufacturing scale up at AMSC and describe the properties and architecture of the 2G wire being manufactured and developed for various applications

Wired vs. Wireless.

Science.gov (United States)

Fielding, Randall

2000-01-01

Presents a debate on which technology will be in tomorrow's classrooms and the pros and cons of wiring classrooms and using a wireless network. Concluding comments address the likelihood, and desirability, of placing computers throughout the entire educational process and what types of computers and capabilities are needed. (GR)

Locating the displacement of the steel wire implantation with the stereotactic mammography

International Nuclear Information System (INIS)

Ma Jie; Xu Jianmin; Sun Guomin; Sun Guoping; Zang Da; Zhou Dongxian; Mai Peicheng

2007-01-01

Objective: To analyze the manifestation, reason, the processing method of the steel wire implantation with the stereotactic mammography to improve the accuracy of the preoperative positioning. Methods: Seventy-nine cases which got the stereotactic steel wire implantation. In 96 lesions, 13 had steel wire displacement. Among them, 5 cases got steel wire displacement during the stereotactic process, 5 cases got steel wire displacement after the stereotactic process, 2 cases got steel wire displacement during the operation, one case did not show the calcification on the postoperative radiography. Results: The steel wire displacement occurred in 5 cases during the stereotactic process came from the patients and doctors respectively and the repositioning was needed. The steel wire displacement after the stereoscopic positioning was attributed to the overdose injection of local anesthesia, which led to the mismatch between the depth of Z axis of the mammary gland and the actual depth the computer given, the incorrect method for needle placement, and, neglecting whether the steel wire have got the lesion anchored when pulling out the needle set of steel wire hood, besides, these three kinds of instances above were all exaggerated by the accordion effect. For the displacement within 2 cm, the lesion can be excised toward the pathological change direction according to the position that steel wire prompted and re-place the second steel wire, putting the J-shaped steel wire into the needle hood and taking it out of the body. After repositioning, 2 cases had the steel wire prolapse during operation, which resulted from the over-lifting of the steel wire. After placing the steel wire, the radiologist should give an accurate description on the depth and direction to the surgeon and the notch should be taken for incision from the steel wire head end which is proximate to skin. The postoperative specimen from one case had no calcification, which might be related to the condition

Binder Jetting: A Novel NdFeB Bonded Magnet Fabrication Process

Science.gov (United States)

Paranthaman, M. Parans; Shafer, Christopher S.; Elliott, Amy M.; Siddel, Derek H.; McGuire, Michael A.; Springfield, Robert M.; Martin, Josh; Fredette, Robert; Ormerod, John

2016-07-01

The goal of this research is to fabricate near-net-shape isotropic (Nd)2Fe14B-based (NdFeB) bonded magnets using a three dimensional printing process to compete with conventional injection molding techniques used for bonded magnets. Additive manufacturing minimizes the waste of critical materials and allows for the creation of complex shapes and sizes. The binder jetting process works similarly to an inkjet printer. A print-head passes over a bed of NdFeB powder and deposits a polymer binding agent to bind the layer of particles together. The bound powder is then coated with another layer of powder, building the desired shape in successive layers of bonded powder. Upon completion, the green part and surrounding powders are placed in an oven at temperatures between 100°C and 150°C for 4-6 h to cure the binder. After curing, the excess powder can be brushed away to reveal the completed "green" part. Green magnet parts were then infiltrated with a clear urethane resin to achieve the measured density of the magnet of 3.47 g/cm3 close to 46% relative to the NdFeB single crystal density of 7.6 g/cm3. Magnetic measurements indicate that there is no degradation in the magnetic properties. This study provides a new pathway for preparing near-net-shape bonded magnets for various magnetic applications.

Room temperature Cu-Cu direct bonding using surface activated bonding method

International Nuclear Information System (INIS)

Kim, T.H.; Howlader, M.M.R.; Itoh, T.; Suga, T.

2003-01-01

Thin copper (Cu) films of 80 nm thickness deposited on a diffusion barrier layered 8 in. silicon wafers were directly bonded at room temperature using the surface activated bonding method. A low energy Ar ion beam of 40-100 eV was used to activate the Cu surface prior to bonding. Contacting two surface-activated wafers enables successful Cu-Cu direct bonding. The bonding process was carried out under an ultrahigh vacuum condition. No thermal annealing was required to increase the bonding strength since the bonded interface was strong enough at room temperature. The chemical constitution of the Cu surface was examined by Auger electron spectroscope. It was observed that carbon-based contaminations and native oxides on copper surface were effectively removed by Ar ion beam irradiation for 60 s without any wet cleaning processes. An atomic force microscope study shows that the Ar ion beam process causes no surface roughness degradation. Tensile test results show that high bonding strength equivalent to bulk material is achieved at room temperature. The cross-sectional transmission electron microscope observations reveal the presence of void-free bonding interface without intermediate layer at the bonded Cu surfaces

Recent development of drastically innovative BSCCO wire (DI-BISCCO)

International Nuclear Information System (INIS)

Kikuchi, M.; Kato, T.; Ohkura, K.; Ayai, N.; Fujikami, J.; Fujino, K.; Kobayashi, S.; Ueno, E.; Yamazaki, K.; Yamade, S.; Hayashi, K.; Sato, K.; Nagai, T.; Matsui, Y.

2006-01-01

Up to this day, Ag-sheathed Bi2223 superconducting wires have been widely investigated and the long wires about 1000 m have been produced by using powder-in-tube (PIT) method on a commercial basis in the various facilities or companies. Although the wires are used for some applications such as HTS cables, magnets, motor and so on, the Bi2223 wires not only require much more improvements of the superconducting properties such as critical current, mechanical properties, but also longer and more uniform wires. Recently, the performances of Bi2223 wires have been drastically improved by using Controlled Over Pressure (CT-OP) sintering process. CT-OP process increased critical current (I c ) by more than 60% at 77 K and self field and improved the mechanical strength by more than 70%. The maximum I c was increased up to 166 A. These drastic improvements were caused by the higher density of Bi2223 filament up to almost 100% and better connectivity of the Bi2223 grains. The dense structure of the Bi2223 filaments prevents the ballooning phenomenon which is caused by the gasification of the trapped liquid nitrogen during temperature rise. Additionally, higher uniformity and higher production yield of long length wire were also achieved by exterminating defects during sintering. These high performance levels in CT-OP wires have contributed commercial level applications. We call as Drastically Innovative BSCCO (DI-BSCCO)

Influence of a cold deformation process by drawing on the electrical properties of copper wires

Directory of Open Access Journals (Sweden)

Rafael da Silva Bernardo

Full Text Available Abstract This article presents a study of the drawing, deformation, hardening and heat treatment of copper wire, in order to investigate the influence of combinations of operating variables (annealing factor, oil emulsion temperature and machine speed during the drawing process on the electrical conductivity of copper wires. The results showed that when the metal is deformed, the value of electrical conductivity suffers a decrease due to the hardening phenomenon. Because of this, it is necessary to heat treat the material. So, it was observed that the annealing factor, which is associated with the thermal treatment temperature, showed a high degree of correlation with the electrical conductivity. This fact is explained by the annealing factor which is responsible for the intensity of the heat treatment. The speed at which the drawing occurs also showed a direct correlation with electric conductivity because the higher the value, the greater the heat treatment temperature and consequently, the greater the electrical conductivity of the material. On the other hand, it had not been possible to establish a conclusion about the correlation between the electrical conductivity and oil emulsion temperature during the drawing process.

Bubble Formation within Filaments of Melt-Processed Bi2212 wires and its strongly negative effect on the Critical Current Density

CERN Document Server

Kametani, F; Jiang, J; Scheuerlein, C; Malagoli, A; Di Michiel, M; Huang, Y; Miao, H; Parrell, J A; Hellstrom, E E; Larbalestier, D C

2011-01-01

Most studies of Bi2Sr2CaCu2Ox (Bi2212) show that the critical current density Jc is limited by the connectivity of the filaments, but what determines the connectivity is still elusive. Here we report on the role played by filament porosity in limiting Jc. By a microstructural investigation of wires quenched from the melt state, we find that porosity in the unreacted wire agglomerates into bubbles that segment the Bi2212 melt within the filaments into discrete sections. These bubbles do not disappear during subsequent processing because they are only partially filled by Bi2212 grains as the Bi2212 forms on cooling. Correlating the microstructure of quenched wires to their final, fully processed Jc values shows an inverse relation between Jc and bubble density. Bubbles are variable between conductors and perhaps from sample to sample, but they occur frequently and almost completely fill the filament diameter, so they exert a strongly variable but always negative effect on Jc. Bubbles reduce the continuous Bi221...

Tungsten - rhenium alloys wire: overview of thermomechanical processing and properties data

International Nuclear Information System (INIS)

Bryskin, B.

2001-01-01

The scope of this study encompasses the compositional modifications of the tungsten-rhenium dual system (W-3/5 Re up to W-27 Re) as well as some of the tungsten-molybdenum-rhenium ternary system. The alloys of interest are considered with a specific representation of powder metallurgy route based on doped or undoped tungsten vs. vacuum melted materials. This paper constitutes an in-depth review of structural and mechanical properties and systematic compilation of challenges necessary to provide the quality consistency of severely drawn filaments. The issue of thermomechanical processing trends is addressed as an important part of W-Re fabrication technology to achieve further improvement in design properties of rod and wire. (author)

Nano-powder production by electrical explosion of wires

International Nuclear Information System (INIS)

Mao Zhiguo; Zou Xiaobing; Wang Xinxin; Jiang Weihua

2010-01-01

A device for nano-powder production by electrical explosion of wires was designed and built. Eight wires housed in the discharge chamber are exploded one by one before opening the chamber for the collection of the produced nano-powder. To increase the rate of energy deposition into a wire, the electrical behavior of the discharge circuit including the exploding wire was simulated. The results showed that both reducing the circuit inductance and reducing the capacitance of the energy-storage capacitor (keeping the storage energy constant) can increase the energy deposition rate. To better understand the physical processes of the nano-powder formation by the wire vapor, a Mach-Zehnder interferometer was used to record the time evolution of the wire vapor as well as the plasma. A thermal expansion lag of the dense vapor core as well as more than one times of the vapor burst was observed for the first time. Finally, nano-powders of titanium nitride, titanium dioxide, copper oxides and zinc oxide were produced by electrical explosion of wires. (authors)

A study on the development of high-Tc superconducting wire

International Nuclear Information System (INIS)

Won, Dong Yeon; Chang, In Soon; Lee, Jong Min; Um, Tae Yoon; Hong, Kyae Won; Lee, Ho Jin; Lee, Hee Kwun; Kim, Chan Joong; Park, Soon Dong; Kim, Woo Gon; Kim, Ki Baek; Kwon, Sun Chil

1992-10-01

On this study Y-Ba-Cu-O was prepared by partial melt process and superconducting wire was fabricated by powder-in-tube method. First, mechancial properties, electrical properties, microstructure and oxygen diffusion behavior were observed. Second, through fabricated superconducting wire, conceptual design, composition and plasticity of filament superconducting wire were investigated. (Author)

Detection of a buried wire with two resistively loaded wire antennas

NARCIS (Netherlands)

Vossen, S.H.J.A.; Tijhuis, A.G.; Lepelaars, E.S.A.M.; Zwamborn, A.P.M.

2002-01-01

The use of two identical straight thin-wire antennas for the detection of a buried wire is analyzed with the aid of numerical calculations. The buried wire is located below an interface between two homogeneous half-spaces. The detection setup, which is formed by a transmitting and a receiving wire,

wire chamber

CERN Multimedia

1985-01-01

Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

Wire chamber

CERN Multimedia

Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

wire chamber

CERN Multimedia

Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

The magnetoresistance of sub-micron Fe wires

Science.gov (United States)

Blundell, S. J.; Shearwood, C.; Gester, M.; Baird, M. J.; Bland, J. A. C.; Ahmed, H.

1994-07-01

A novel combination of electron- and ion-beam lithography has been used to prepare Fe gratings with wire widths of 0.5 μm and wire separations in the range 0.5-4 μm from an Fe/GaAs (001) film of thickness 25 nm. With an in-plane magnetic field applied perpendicular to the length of the wires, a harder magnetisation loop is observed using the magneto-optic Kerr effect (MOKE), compared with that observed in the unprocessed film. We observe a strong effect in the magnetoresistance (MR) when the magnetic field is applied transverse to the wires. It is believed that this effect originates from the highly non-uniform demagnetising field in each wire of the grating. These results demonstrate that the combination of MOKE and MR measurements can provide important information about the magnetisation reversal processes in magnetic gratings and can be used to understand the effect of shape anisotropy on magnetic properties.

X-ray backlighting of two-wire Z-pinch plasma using X-pinch

International Nuclear Information System (INIS)

Tong, Zhao; Xiao-Bing, Zou; Ran, Zhang; Xin-Xin, Wang

2010-01-01

Two 50-μm Mo wires in parallel used as a Z-pinch load are electrically exploded with a pulsed current rising to 275 kA in 125 ns and their explosion processes are backlighted using an X-pinch as an x-ray source. The backlighting images show clearly the processes similar to those occurring in the initial stages of a cylindrical wire-array Z-pinch, including the electric explosion of single wires characterised by the dense wire cores surrounded by a low-density coronal plasma, the expansion of the exploding wire, the sausage instability (m = 0) in the coronal plasma around each wire, the motion of the coronal plasma as well as the wire core toward the current centroid, the formation of the precursor plasma column with a twist structure something like that of higher mode instability, especially the kink instability (m = 1). (fluids, plasmas and electric discharges)

Model-Based Testability Assessment and Directed Troubleshooting of Shuttle Wiring Systems

Science.gov (United States)

Deb, Somnath; Domagala, Chuck; Shrestha, Roshan; Malepati, Venkatesh; Cavanaugh, Kevin; Patterson-Hine, Ann; Sanderfer, Dwight; Cockrell, Jim; Norvig, Peter (Technical Monitor)

2000-01-01

We have recently completed a pilot study on the Space shuttle wiring system commissioned by the Wiring Integrity Research (WIRe) team at NASA Ames Research Center, As the space shuttle ages, it is experiencing wiring degradation problems including arcing, chaffing insulation breakdown and broken conductors. A systematic and comprehensive test process is required to thoroughly test and quality assure (QA) the wiring systems. The NASA WIRe team recognized the value of a formal model based analysis for risk-assessment and fault coverage analysis. However. wiring systems are complex and involve over 50,000 wire segments. Therefore, NASA commissioned this pilot study with Qualtech Systems. Inc. (QSI) to explore means of automatically extracting high fidelity multi-signal models from wiring information database for use with QSI's Testability Engineering and Maintenance System (TEAMS) tool.

Wire Array Photovoltaics

Science.gov (United States)

Turner-Evans, Dan

Over the past five years, the cost of solar panels has dropped drastically and, in concert, the number of installed modules has risen exponentially. However, solar electricity is still more than twice as expensive as electricity from a natural gas plant. Fortunately, wire array solar cells have emerged as a promising technology for further lowering the cost of solar. Si wire array solar cells are formed with a unique, low cost growth method and use 100 times less material than conventional Si cells. The wires can be embedded in a transparent, flexible polymer to create a free-standing array that can be rolled up for easy installation in a variety of form factors. Furthermore, by incorporating multijunctions into the wire morphology, higher efficiencies can be achieved while taking advantage of the unique defect relaxation pathways afforded by the 3D wire geometry. The work in this thesis shepherded Si wires from undoped arrays to flexible, functional large area devices and laid the groundwork for multijunction wire array cells. Fabrication techniques were developed to turn intrinsic Si wires into full p-n junctions and the wires were passivated with a-Si:H and a-SiNx:H. Single wire devices yielded open circuit voltages of 600 mV and efficiencies of 9%. The arrays were then embedded in a polymer and contacted with a transparent, flexible, Ni nanoparticle and Ag nanowire top contact. The contact connected >99% of the wires in parallel and yielded flexible, substrate free solar cells featuring hundreds of thousands of wires. Building on the success of the Si wire arrays, GaP was epitaxially grown on the material to create heterostructures for photoelectrochemistry. These cells were limited by low absorption in the GaP due to its indirect bandgap, and poor current collection due to a diffusion length of only 80 nm. However, GaAsP on SiGe offers a superior combination of materials, and wire architectures based on these semiconductors were investigated for multijunction

Theoretical and Experimental Study on Vibration Propagation in PMMA Components in Ultrasonic Bonding Process

Directory of Open Access Journals (Sweden)

Yibo Sun

2017-03-01

Full Text Available Ultrasonic bonding has an increasing application in the micro assembly of polymeric micro-electro mechanical systems (MEMS with high requirements for fusion precision. In the ultrasonic bonding process, the propagation of ultrasonic vibration in polymer components is related to the interfacial fusion, which can be used as a monitoring parameter to control ultrasonic energy. To study the vibration propagation in viscoelastic polymer components, finite element analysis on the bonding of poly methyl methacrylate (PMMA micro connector to substrate for microfluidic system is carried out. Curves of propagated vibration amplitude corresponding to interfacial temperatures are obtained. The ultrasonic vibration propagated in PMMA components are measured through experiments. The theoretical and experimental results are contrasted to analyze the change mechanism of vibration propagation related to temperature. Based on the ultrasonic bonding process controlled by the feedback of vibration propagation, interfacial fusions at different vibration propagation states are obtained through experiments. Interfacial fusion behavior is contrasted to the propagated vibration amplitude in theoretical and experimental studies. The relation between vibration propagation and fusion degree is established with the proper parameter range for the obtained high quality bonding.

Failure analysis of the fractured wires in sternal perichronal loops.

Science.gov (United States)

Chao, Jesús; Voces, Roberto; Peña, Carmen

2011-10-01

We report failure analysis of sternal wires in two cases in which a perichronal fixation technique was used to close the sternotomy. Various characteristics of the retrieved wires were compared to those of unused wires of the same grade and same manufacturer and with surgical wire specifications. In both cases, wire fracture was un-branched and transgranular and proceeded by a high cycle fatigue process, apparently in the absence of corrosion. However, stress anlysis indicates that the effective stress produced during strong coughing is lower than the yield strength. Our findings suggest that in order to reduce the risk for sternal dehiscence, the diameter of the wire used should be increased. Copyright © 2011 Elsevier Ltd. All rights reserved.

En-masse retraction with a preformed nickel-titanium and stainless steel archwire assembly and temporary skeletal anchorage devices without posterior bonding

Science.gov (United States)

Jee, Jeong-Hyun; Ahn, Hyo-Won; Seo, Kyung-Won; Kook, Yoon-Ah; Chung, Kyu-Rhim; Nelson, Gerald

2014-01-01

Objective To evaluate the therapeutic effects of a preformed assembly of nickel-titanium (NiTi) and stainless steel (SS) archwires (preformed C-wire) combined with temporary skeletal anchorage devices (TSADs) as the sole source of anchorage and to compare these effects with those of a SS version of C-wire (conventional C-wire) for en-masse retraction. Methods Thirty-one adult female patients with skeletal Class I or II dentoalveolar protrusion, mild-to-moderate anterior crowding (3.0-6.0 mm), and stable Class I posterior occlusion were divided into conventional (n = 15) and preformed (n = 16) C-wire groups. All subjects underwent first premolar extractions and en-masse retraction with pre-adjusted edgewise anterior brackets, the assigned C-wire, and maxillary C-tubes or C-implants; bonded mesh-tube appliances were used in the mandibular dentition. Differences in pretreatment and post-retraction measurements of skeletal, dental, and soft-tissue cephalometric variables were statistically analyzed. Results Both groups showed full retraction of the maxillary anterior teeth by controlled tipping and space closure without altered posterior occlusion. However, the preformed C-wire group had a shorter retraction period (by 3.2 months). Furthermore, the maxillary molars in this group showed no significant mesialization, mesial tipping, or extrusion; some mesialization and mesial tipping occurred in the conventional C-wire group. Conclusions Preformed C-wires combined with maxillary TSADs enable simultaneous leveling and space closure from the beginning of the treatment without maxillary posterior bonding. This allows for faster treatment of dentoalveolar protrusion without unwanted side effects, when compared with conventional C-wire, evidencing its clinical expediency. PMID:25309863

Progress in AMSC scale-up of second generation HTS wire

Energy Technology Data Exchange (ETDEWEB)

Zhang, W. [American Superconductor Corporation, 2 Technology Drive, Westborough, MA 01545 (United States)], E-mail: wzhang@amsuper.com; Rupich, M.W.; Schoop, U.; Verebelyi, D.T.; Thieme, C.L.H.; Li, X.; Kodenkandath, T.; Huang, Y.; Siegal, E.; Buczek, D.; Carter, W.; Nguyen, N.; Schreiber, J.; Prasova, M.; Lynch, J.; Tucker, D.; Fleshler, S. [American Superconductor Corporation, 2 Technology Drive, Westborough, MA 01545 (United States)

2007-10-01

American Superconductor has successfully scaled up its low-cost, high volume second generation (2G) HTS wire process into pre-pilot scale production, with performance approaching first generation (1G) HTS wire. AMSC's manufacturing approach is based on RABiTS{sup TM}/MOD wide strip technology, with metal organic deposition (MOD) process for the YBCO layer and the Rolling Assisted Biaxially Textured Substrate (RABiTS) process for the template. In this paper, we review the status of the 2G manufacturing scale up at AMSC and describe the properties and architecture of the 2G wire being manufactured and developed for various applications.

Multifilamentary Cu-Nb3Sn superconductor wires

International Nuclear Information System (INIS)

Rodrigues, D.; Pinatti, D.G.

1990-01-01

This paper reports on one of the main technological problems concerning Nb 3 Sn superconducting wires production which is the optimization of heat treatments for the formation of the A-15 intermetallic compound. At the present work, Nb 3 Sn superconducting wire is produced by solid-liquid diffusion method which increases considerably the critical current values of the superconductor. Through this method, niobium, copper and Sn 7% wt Cu alloy are kept in the pure state. Thus, the method dispenses intermediate heat treatments of recrystallization during the manufacturing process of the wire. After the wire was ready, optimization work of heat treatments was accomplished aiming to obtain its best superconducting characteristics, Measurement of critical temperature, critical current versus magnetic field, normal and at room temperature resistivity were performed, as well as scanning electron microscopy for determination of Nb 3 Sn layers and transmission electron microscopy measurements of redetermining the grain sizes in Nb 3 Sn formed in each treatment. It was obtained critical current densities of 1.8 x 10 6 A/cm 2 in the Nb 3 Sn layer, at 10 Teslas and 4.2 K. The samples were analyzed by employing the superconducting collective flux pinning theories and a satisfactory agreement between the experimental and theoretical data was attained. The production process and the small size of the filaments used made a successful optimization of the wire possible

49 CFR 236.74 - Protection of insulated wire; splice in underground wire.

Science.gov (United States)

2010-10-01

... underground wire. 236.74 Section 236.74 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL RAILROAD ADMINISTRATION, DEPARTMENT OF TRANSPORTATION RULES, STANDARDS, AND INSTRUCTIONS GOVERNING... wire; splice in underground wire. Insulated wire shall be protected from mechanical injury. The...

49 CFR 234.241 - Protection of insulated wire; splice in underground wire.

Science.gov (United States)

2010-10-01

... underground wire. 234.241 Section 234.241 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL RAILROAD ADMINISTRATION, DEPARTMENT OF TRANSPORTATION GRADE CROSSING SIGNAL SYSTEM SAFETY... of insulated wire; splice in underground wire. Insulated wire shall be protected from mechanical...

wire chamber

CERN Multimedia

Was used in ISR (Intersecting Storage Ring) split field magnet experiment. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

Voltage-assisted polymer wafer bonding

International Nuclear Information System (INIS)

Varsanik, J S; Bernstein, J J

2012-01-01

Polymer wafer bonding is a widely used process for fabrication of microfluidic devices. However, best practices for polymer bonds do not achieve sufficient bond strength for many applications. By applying a voltage to a polymer bond in a process called voltage-assisted bonding, bond strength is shown to improve dramatically for two polymers (Cytop™ and poly(methyl methacrylate)). Several experiments were performed to provide a starting point for further exploration of this technique. An optimal voltage range is experimentally observed with a reduction in bonding strength at higher voltages. Additionally, voltage-assisted bonding is shown to reduce void diameter due to bond defects. An electrostatic force model is proposed to explain the improved bond characteristics. This process can be used to improve bond strength for most polymers. (paper)

A novel metal-to-metal bonding process through in-situ formation of Ag nanoparticles using Ag2O microparticles

International Nuclear Information System (INIS)

Hirose, Akio; Tatsumi, Hiroaki; Takeda, Naoya; Akada, Yusuke; Ogura, Tomo; Ide, Eiichi; Morita, Toshiaki

2009-01-01

The metal-to-metal bonding has been successfully achieved via the bonding process using Ag metallo-organic nanoparticles at a bonding temperature of around 300-, which can be alternative to the current microsoldering in electronics assembly using high-temperature solders. However, further reduction of bonding temperature and/or bonding pressure is needed. In the present research, a novel bonding process through in-situ formation of Ag nanoparticles instead of the filler material of the Ag metallo-organic nanoparticles has been developed. The Ag nanoparticles can form by the reduction of Ag 2 O particles. In this study, the Ag 2 O particles were mixed with triethylene glycol as a reducing agent to form a paste for bonding. The Au coated cylindrical specimens were bonded using the paste. The Ag nanoparticles formed at around 130 to 160 through the reduction process of Ag2O particles with triethylene glycol. The Ag nanoparticles were immediately sintered each other due to a great surface energy per volume. A transmission electron microscope observation revealed that the sintered Ag metallurgically bonded to the Au substrate at around 160 and a dense Ag layer formed after further heating. The tensile strength of the joint bonded at 250 under a bonding pressure of 5MPa was around 60MPa

Mechanical and metallurgical changes on 308L wires drawn by electropulses

OpenAIRE

Sánchez Egea, Antonio José; González Rojas, Hernan Alberto; Celentano, Diego Javier; Jorba Peiró, Jordi

2015-01-01

The electroplastic effects resulting from different electropulses configurations on a wire drawing process are investigated experimentally and numerically. Electropulses are induced into 308L stainless steel while it is simultaneously wire drawn. A current density of 185 A/mm2, a frequency range from 140 to 355 Hz and a pulse duration range from 100 to 250 µs are combined to electrically assist the wire drawing process. The electropulsing influence is studied in several mechanical parameters,...

Microstructural studies and wear assessments of Ti/TiC surface composite coatings on commercial pure Ti produced by titanium cored wires and TIG process

Energy Technology Data Exchange (ETDEWEB)

Monfared, A., E-mail: amirmonfared25@yahoo.com [Department of Materials Science and Engineering, Sharif University of Technology, Tehran (Iran, Islamic Republic of); Kokabi, A.H.; Asgari, S. [Department of Materials Science and Engineering, Sharif University of Technology, Tehran (Iran, Islamic Republic of)

2013-01-15

Tungsten Inert Gas (TIG) process and titanium cored wires filled with micro size TiC particles were employed to produce surface composite coatings on commercial pure Ti substrate for wear resistance improvement. Wire drawing process was utilized to produce several cored wires from titanium strips and titanium carbide powders. Subsequently, these cored wires were melted and coated on commercial pure Ti using TIG process. This procedure was repeated at different current intensities and welding travel speeds. Composite coating tracks were found to be affected by TIG heat input. The microstructural studies using optical and scanning electron microscopy supported by X-ray diffraction showed that the surface composite coatings consisted of {alpha} Prime -Ti, spherical and dendritic TiC particles. Also, greater volume fractions of TiC particles in the coatings were found at lower heat input. A maximum microhardness value of about 1100 HV was measured which is more than 7 times higher than the substrate material. Pin-on-disk wear tests exhibited a better performance of the surface composite coatings than the untreated material which was attributed to the presence of TiC particles in the microstructure. -- Highlights: Black-Right-Pointing-Pointer Ti/TiC composite coatings were produced on the CP-Ti. Black-Right-Pointing-Pointer Titanium cored wire and TIG process were employed for production of the coatings. Black-Right-Pointing-Pointer Decreasing heat input, increased the volume fraction of TiC in the coatings. Black-Right-Pointing-Pointer The maximum microhardness obtained in the lowest heat input. Black-Right-Pointing-Pointer The wear resistance of the coatings improved due to the formation of TiC particles.

Recent developments in wire chamber tracking at SSC

International Nuclear Information System (INIS)

Ogren, H.

1990-01-01

All of the major SSC proposed detectors use wire chambers in their tracking systems. The feasibility of wire chambers in an SSC detector has now been established by a number of groups planning detectors at SSC. The major advances during the past year in understanding straw tube drift chambers are presented and several innovations in gaseous wire chambers are discussed. The R and D section will concentrate on progress in drift cell design, electronics and signal processing, and engineering aspects of the tracking designs

Spectroscopic XPEEM of highly conductive SI-doped GaN wires

Energy Technology Data Exchange (ETDEWEB)

Renault, O., E-mail: olivier.renault@cea.fr [Univ. Grenoble Alpes, F-38000 Grenoble (France); CEA, LETI, MINATEC Campus, F-38054 Grenoble (France); Morin, J. [Univ. Grenoble Alpes, F-38000 Grenoble (France); CEA, LETI, MINATEC Campus, F-38054 Grenoble (France); Tchoulfian, P. [Univ. Grenoble Alpes, F-38000 Grenoble (France); CEA, LETI, MINATEC Campus, F-38054 Grenoble (France); CNRS, Inst. NEEL, F-38042 Grenoble (France); Chevalier, N. [Univ. Grenoble Alpes, F-38000 Grenoble (France); CEA, LETI, MINATEC Campus, F-38054 Grenoble (France); Feyer, V. [Peter Grünberg Institute (PGI-6) and JARA-FIT, Research Center Jülich, D-52425 Jülich (Germany); Pernot, J. [Univ. Grenoble Alpes, F-38000 Grenoble (France); CNRS, Inst. NEEL, F-38042 Grenoble (France); Institut Universitaire de France, F-75005 Paris (France); Schneider, C.M. [Peter Grünberg Institute (PGI-6) and JARA-FIT, Research Center Jülich, D-52425 Jülich (Germany)

2015-12-15

Using soft X-ray photoelectron emission microscopy (XPEEM), complemented by scanning Auger microscopy (SAM) and scanning capacitance microscopy, we have quantitatively studied the incorporation of silicon and band bending at the surface (m-facet) of an individual, highly conductive Si-doped GaN micro-wires (Tchoulfian et al., Applied Physics Letters 102 (12), 2013). Electrically active n-dopants Si atoms in Ga interstitial sites are detected as nitride bonding states in the high-resolution Si2p core level spectra, and represent only a small fraction (<10%) of the overall Si surface concentration measured by SAM. The derived carrier concentration of 2×10{sup 21} at cm{sup −3} is in reasonable agreement with electrical measurements. A consistent surface band bending of ~1 eV is directly evidenced by surface photo-voltage measurements. Such an approach combining different surface-sensitive microscopies is of interest for studying other heavily doped semiconducting wires. - Highlights: • XPEEM analysis of state-of-the-art, heavily doped GaN wires with insights on the issue of the origin of the increased conductivity. • Combined microscopic approach with Scanning Auger microscopy and X-ray Photoeletron Emission Microscopy, to quantity the electrically active Si-dopants in GaN. • The determined concentration is found in reasonable agreement with the one derived from bulk electrical measurements. • The proposed method is of interest for studying the electronics and chemistry of doping in other heavily doped semiconducting wires.

Electron transport in quantum wires: possible current instability mechanism

International Nuclear Information System (INIS)

Sablikov, V.A.

2001-01-01

The electrons nonlinear and dynamic transition in quantum wires connecting the electron reservoirs, are studies with an account of the Coulomb interaction distribution of electron density between the reservoirs and the wire. It is established that there exist two processes, leading to electrical instability in such structure. One of them is expressed in form of multistability of the charge accumulated in the wire, and negative differential conductivity. The other one is connected with origination of negative dynamic conductivity in the narrow frequency range near the resonance frequency of the charge waves on the wire length [ru

Strengthening of Aluminum Wires Treated with A206/Alumina Nanocomposites.

Science.gov (United States)

Florián-Algarín, David; Marrero, Raúl; Li, Xiaochun; Choi, Hongseok; Suárez, Oscar Marcelo

2018-03-10

This study sought to characterize aluminum nanocomposite wires that were fabricated through a cold-rolling process, having potential applications in TIG (tungsten inert gas) welding of aluminum. A206 (Al-4.5Cu-0.25Mg) master nanocomposites with 5 wt % γAl₂O₃ nanoparticles were first manufactured through a hybrid process combining semi-solid mixing and ultrasonic processing. A206/1 wt % γAl₂O₃ nanocomposites were fabricated by diluting the prepared master nanocomposites with a monolithic A206 alloy, which was then added to a pure aluminum melt. The fabricated Al-γAl₂O₃ nanocomposite billet was cold-rolled to produce an Al nanocomposite wire with a 1 mm diameter and a transverse area reduction of 96%. Containing different levels of nanocomposites, the fabricated samples were mechanically and electrically characterized. The results demonstrate a significantly higher strength of the aluminum wires with the nanocomposite addition. Further, the addition of alumina nanoparticles affected the wires' electrical conductivity compared with that of pure aluminum and aluminum-copper alloys. The overall properties of the new material demonstrate that these wires could be an appealing alternative for fillers intended for aluminum welding.

The influence of drawing speed on surface topography of high carbon steel wires

Directory of Open Access Journals (Sweden)

M. Suliga

2017-01-01

Full Text Available In this work the influence of the drawing speed on surface topography of high carbon steel wires has been assessed. The drawing process of f 5,5 mm wire rod to the final wire of f 1,7 mm was conducted in 12 passes by means of a modern Koch multi-die drawing machine. The drawing speeds in the last passes were: 5, 10, 15, 20 and 25 m/s. For final wires f 1,7 mm the three-dimensional analysis of the wire surface topography investigation was determined. It has been proved that the wire topography in the drawing process is characterized by a random anisotropy and the amount of directing the geometrical structure of the surface depends on the drawing speed.

Steady-state numerical modeling of size effects in micron scale wire drawing

DEFF Research Database (Denmark)

Juul, Kristian Jørgensen; Nielsen, Kim Lau; Niordson, Christian Frithiof

2017-01-01

Wire drawing processes at the micron scale have received increased interest as micro wires are increasingly required in electrical components. It is well-established that size effects due to large strain gradient effects play an important role at this scale and the present study aims to quantify...... these effects for the wire drawing process. Focus will be on investigating the impact of size effects on the most favourable tool geometry (in terms of minimizing the drawing force) for various conditions between the wire/tool interface. The numerical analysis is based on a steady-state framework that enables...... convergence without dealing with the transient regime, but still fully accounts for the history dependence as-well as the elastic unloading. Thus, it forms the basis for a comprehensive parameter study. During the deformation process in wire drawing, large plastic strain gradients evolve in the contact region...

PS wire chamber

CERN Multimedia

1970-01-01

A wire chamber used at CERN's Proton Synchrotron accelerator in the 1970s. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

Formation of a Molecular Wire Using the Chemically Adsorbed Monomolecular Layer Having Pyrrolyl Groups

Directory of Open Access Journals (Sweden)

Kazufumi Ogawa

2011-01-01

Full Text Available A molecular wire containing polypyrrolyl conjugate bonds has been prepared by a chemical adsorption technique using 1,1,1-trichloro-12-pyrrolyl-1-siladodecane (PNN and an electrooxidative polymerization technique, and the conductivity of the molecular wire without any dopant has been measured by using AFM/STM at room temperature. When sample dimension measured was about 0.3 nm (thickness of the conductive portion in the PNN monomolecular layer ×100 μm (the average width of an electric path ×2 mm (the distance between Pt positive electrode and the AFM tip covered with Au, the conductivity of the polymerized PNN molecular wire at room temperature was larger than 1.6 × 105 S/cm both in an atmosphere and in a vacuum chamber of 10−5 Torr. The activation energy obtained by Arrhenius' plots was almost zero in the temperature range between 320 and 450 K.

Pin Wire Coating Trip Report

International Nuclear Information System (INIS)

Spellman, G P

2004-01-01

A meeting to discuss the current pin wire coating problems was held at the Reynolds plant in Los Angeles on 2MAR04. The attendance list for Reynolds personnel is attached. there was an initial presentation which gave a brief history and the current status of pin wire coating at Reynolds. There was a presentation by Lori Primus on the requirements and issues for the coating. There was a presentation by Jim Smith of LANL on the chemistry and to some extent process development done to date. There was a long session covering what steps should be taken in the short term and, to a lesser extent, the long term. The coating currently being used is a blend of two polymers, polyethersulfone and polyparabanic acid (PPA) and some TiO2 filler. This system was accepted and put into production when the pin wire coating was outsourced to another company in 1974. When that company no longer was interested, the wire coating was brought in-house to Reynolds. At that time polyparabanic acid was actually a commercial product available from Exxon under the trade name Tradlon. However, it appears that the material used at Reynolds was synthesized locally. Also, it appears that a single large batch was synthesized in that time period and used up to 1997 when the supply ran out. The reason for the inclusion of TiO2 is not known although it does act as a rheological thickener. However, a more controlled thickening can be obtained with materials such as fumed silica. This material would have less likelihood of causing point imperfections in the coatings. Also, the mixing technique being used for all stages of the process is a relatively low shear ball mill process and the author recommends a high shear process such as a three roll paint mill, at least for the final mixing. Since solvent is added to the powder at Reynolds, it may be that they need to have the paint mill there

submitter Comparison of microstructure, second phases and texture formation during melt processing of Bi-2212 mono- and multifilament wires

CERN Document Server

Kadar, J; Rikel, MO; Di Michiel, M; Huang, Y

2016-01-01

Based on simultaneous in situ high energy synchrotron micro-tomography and x-ray diffraction (XRD) measurements we compare the microstructural changes and the formation of second phases and texture during the processing of Bi-2212 round wires with 15 μm filament diameter (multifilament) and 650 μm filament diameter (monofilament) fabricated using identical Bi-2212 precursor. The monofilament tomograms show in unprecedented detail how the distributed porosity agglomerates well before Bi-2212 melting decomposition to form lenticular voids that completely interrupt the filament connectivity along the wire axis. When the Bi-2212 phase completely melts connectivity in the axial wire direction is established via the changes in the void morphology from the lenticular voids to bubbles that remain when Bi-2212 crystallises out of the melt. By measuring the attenuation of the monochromatic x-ray beam, the associated Bi-2212 mass density changes have been monitored during the entire heat cycle. The XRD results reveal ...

Effect of machining fluid on the process performance of wire electrical discharge machining of nanocomposite ceramic

Directory of Open Access Journals (Sweden)

Zhang Chengmao

2015-01-01

Full Text Available Wire electric discharge machining (WEDM promise to be effective and economical techniques for the production of tools and parts from conducting ceramic blanks. However, the manufacturing of nanocomposite ceramics blanks with these processes is a long and costly process. This paper presents a new process of machining nanocomposite ceramics using WEDM. WEDM uses water based emulsion, polyvinyl alcohol and distilled water as the machining fluid. Machining fluid is a primary factor that affects the material removal rate and surface quality of WEDM. The effects of emulsion concentration, polyvinyl alcohol concentration and distilled water of the machining fluid on the process performance have been investigated.

Plastic deformation of 2D crumpled wires

International Nuclear Information System (INIS)

Gomes, M A F; Donato, C C; Brito, V P; Coelho, A S O

2008-01-01

When a single long piece of elastic wire is injected through channels into a confining two-dimensional cavity, a complex structure of hierarchical loops is formed. In the limit of maximum packing density, these structures are described by several scaling laws. In this paper this packing process is investigated but using plastic wires which give rise to completely irreversible structures of different morphology. In particular, the plastic deformation from circular to oblate configurations of crumpled wires is experimentally studied, obtained by the application of an axial strain. Among other things, it is shown that in spite of plasticity, irreversibility and very large deformations, scaling is still observed.

Fabrication of FFTF fuel pin wire wrap

International Nuclear Information System (INIS)

Epperson, E.M.

1980-06-01

Lateral spacing between FFTF fuel pins is required to provide a passageway for the sodium coolant to flow over each pin to remove heat generated by the fission process. This spacing is provided by wrapping each fuel pin with type 316 stainless steel wire. This wire has a 1.435mm (0.0565 in.) to 1.448mm (0.0570 in.) diameter, contains 17 +- 2% cold work and was fabricated and tested to exacting RDT Standards. About 500 kg (1100 lbs) or 39 Km (24 miles) of fuel pin wrap wire is used in each core loading. Fabrication procedures and quality assurance tests are described

On the use of accumulative roll bonding process to develop nanostructured aluminum alloy 5083

Energy Technology Data Exchange (ETDEWEB)

Reza Toroghinejad, Mohammad; Ashrafizadeh, Fakhreddin [Department of Materials Engineering, Isfahan University of Technology, Isfahan 84156-83111 (Iran, Islamic Republic of); Jamaati, Roohollah, E-mail: r.jamaatikenari@ma.iut.ac.ir [Department of Materials Engineering, Isfahan University of Technology, Isfahan 84156-83111 (Iran, Islamic Republic of); Young Researchers Club, Ayatollah Amoli Branch, Islamic Azad University, Amol (Iran, Islamic Republic of)

2013-01-20

In the present study, the effect of accumulative roll bonding (ARB) process at room temperature on the microstructure and mechanical properties of AA5083 strip was investigated. Microstructural observations were done by transmission electron microscopy (TEM) and scanning electron microscopy (SEM). Also, mechanical properties were performed by tensile, hardness, and microhardness tests. It was observed that accumulative roll bonding is a promising process for production of nanostructured (80 nm) AA5083 strips. Nano shear bands were formed in the microstructure after the fourth cycles. When the number of cycles increased, the tensile strength and hardness of the accumulatively roll bonded strips increased. However, by increasing the number of cycles, the elongation value decreased except for the last (sixth) cycle. It was found that when the number of cycles increased, the distribution of microhardness values became more uniform. After the tensile test, debonding can be observed especially in the interface formed in the last cycle. Observations revealed that the failure mode in the accumulatively roll bonded AA5083 strip was a shear ductile rupture with elongated shallow shear dimples.

Carbon nanotube wires and cables: Near-term applications and future perspectives

Science.gov (United States)

Jarosz, Paul; Schauerman, Christopher; Alvarenga, Jack; Moses, Brian; Mastrangelo, Thomas; Raffaelle, Ryne; Ridgley, Richard; Landi, Brian

2011-11-01

Wires and cables are essential to modern society, and opportunities exist to develop new materials with reduced resistance, mass, and/or susceptibility to fatigue. This article describes how carbon nanotubes (CNTs) offer opportunities for integration into wires and cables for both power and data transmission due to their unique physical and electronic properties. Macroscopic CNT wires and ribbons are presently shown as viable replacements for metallic conductors in lab-scale demonstrations of coaxial, USB, and Ethernet cables. In certain applications, such as the outer conductor of a coaxial cable, CNT materials may be positioned to displace metals to achieve substantial benefits (e.g. reduction in cable mass per unit length (mass/length) up to 50% in some cases). Bulk CNT materials possess several unique properties which may offer advantages over metallic conductors, such as flexure tolerance and environmental stability. Specifically, CNT wires were observed to withstand greater than 200,000 bending cycles without increasing resistivity. Additionally, CNT wires exhibit no increase in resistivity after 80 days in a corrosive environment (1 M HCl), and little change in resistivity with temperature (electrical conductivity of CNT materials must be improved. Recently, the conductivity of a CNT wire prepared through simultaneous densification and doping has exceeded 1.3 × 106 S/m. This level of conductivity brings CNTs closer to copper (5.8 × 107 S/m) and competitive with some metals (e.g. gold) on a mass-normalized basis. Developments in manipulation of CNT materials (e.g. type enrichment, doping, alignment, and densification) have shown progress towards this goal. In parallel with efforts to improve bulk conductivity, integration of CNT materials into cabling architectures will require development in electrical contacting. Several methods for contacting bulk CNT materials to metals are demonstrated, including mechanical crimping and ultrasonic bonding, along with a

SpaceWire: IP, Components, Development Support and Test Equipment

Science.gov (United States)

Parkes, S.; McClements, C.; Mills, S.; Martin, I.

SpaceWire is a communications network for use onboard spacecraft. It is designed to connect high data-rate sensors, large solid-state memories, processing units and the downlink telemetry subsystem providing an integrated data-handling network. SpaceWire links are serial, high-speed (2 Mbits/sec to 400 Mbits/sec), bi-directional, full-duplex, pointto- point data links which connect together SpaceWire equipment. Application information is sent along a SpaceWire link in discrete packets. Control and time information can also be sent along SpaceWire links. SpaceWire is defined in the ECSS-E50-12A standard [1]. With the adoption of SpaceWire on many space missions the ready availability of intellectual property (IP) cores, components, software drivers, development support, and test equipment becomes a major issue for those developing satellites and their electronic subsystems. This paper describes the work being done at the University of Dundee and STAR-Dundee Ltd with ESA, BNSC and internal funding to make these essential items available. STAR-Dundee is a spin-out company of the University of Dundee set up specifically to support users of SpaceWire.

Submerged-arc wire electrodes with nickel-plated surfaces

International Nuclear Information System (INIS)

Hagen, H. vom.

1976-01-01

The article reports on the development of SANWELD welding rods at GARHYTTAN's which is a wire free of impurities, copper, and hydrogen with a nickel surface. It is producted according to the SANBOND process. The wire has an optimum of mechanical quality grades depending on the powder used for welding, especially an improvement of notch impact strength. The elongation, especially the long-time values, are improved, hydrogen cracks are excluded depending on the correct powder or protective gas, and the low-temparature values are improved. An attendant phenomenon, which is not unimportant, is that the wires are practically corrosion-resistant in the non-welded state. The wire is suitable for submerged-arc welding in steam boilers and pressure vessels. (IHoe) [de

Researching on Control Device of Prestressing Wire Reinforcement

Science.gov (United States)

Si, Jianhui; Guo, Yangbo; Liu, Maoshe

2017-06-01

This paper mainly introduces a device for controlling prestress and its related research methods, the advantage of this method is that the reinforcement process is easy to operate and control the prestress of wire rope accurately. The relationship between the stress and strain of the steel wire rope is monitored during the experiment, and the one - to - one relationship between the controllable position and the pretightening force of the steel wire rope is confirmed by the 5mm steel wire rope, and the results are analyzed theoretically by the measured elastic modulus. The results show that the method can effectively control the prestressing force, and the result provides a reference method for strengthening the concrete column with prestressed steel strand.

Mechanical characterization of Cu-Zn wire electrode base used in EDM and study of influence of the process of machining on its properties

Energy Technology Data Exchange (ETDEWEB)

Sedjal, H., E-mail: hasedjal@yahoo.fr; Amirat, B. [Département of Mechanical engineering, University of M.MAMMERI, Tizi Ouzou (Algeria); Aichour, M.; Marouf, T.; Chitroub, M. [Engineering and Material Sciences Laboratory, Department of Metallurgy, Polytechnic national school, Algiers (Algeria)

2015-03-30

This work is part of a Research National project (PNR) carried out by the group of research of the engineering and material sciences laboratory of the polytechnic national school at Algiers in collaboration with company BCR, which relates to “the characterization of the wire intended for the EDM of matrices metal. The goal of this work is to bring metallographic explanations on the wire electrode used by the machine ROBOFIL 290P, mechanically characterized this wire as of knowing of advantage about the process of its manufacturing (wiredrawing, .) The methods of studies used are it micro Vickers pyramid hardness, the tensile test, optical microscopy and scan electronic microscopy SEM.

Base Information Transport Infrastructure Wired (BITI Wired)

Science.gov (United States)

2016-03-01

2016 Major Automated Information System Annual Report Base Information Transport Infrastructure Wired (BITI Wired) Defense Acquisition Management...Combat Information Transport System program was restructured into two pre-Major Automated Information System (pre-MAIS) components: Information...Major Automated Information System MAIS OE - MAIS Original Estimate MAR – MAIS Annual Report MDA - Milestone Decision Authority MDD - Materiel

Load-Deflection and Friction Properties of PEEK Wires as Alternative Orthodontic Wires.

Science.gov (United States)

Tada, Yoshifumi; Hayakawa, Tohru; Nakamura, Yoshiki

2017-08-09

Polyetheretherketone (PEEK) is now attracting attention as an alternative to metal alloys in the dental field. In the present study, we evaluated the load-deflection characteristics of PEEK wires in addition to their frictional properties. Three types of PEEK wires are used: two sizes of rectangular shape, 0.016 × 0.022 in² and 0.019 × 0.025 in² (19-25PEEK), and rounded shape, diameter 0.016 in (16PEEK). As a control, Ni-Ti orthodontic wire, diameter 0.016 in, was used. The three-point bending properties were evaluated in a modified three-point bending system for orthodontics. The static friction between the orthodontic wire and the bracket was also measured. The load-deflection curves were similar among Ni-Ti and PEEK wires, except for 16PEEK with slot-lid ligation. The bending force of 19-25PEEK wire was comparable with that of Ni-Ti wire. 19-25PEEK showed the highest load at the deflection of 1500 μm ( p 0.05). No significant difference was seen in static friction between all three PEEK wires and Ni-Ti wire ( p > 0.05). It is suggested that 19-25PEEK will be applicable for orthodontic treatment with the use of slot-lid ligation.

Optimization of arc-start performance by wire-feeding control for GMA welding

Energy Technology Data Exchange (ETDEWEB)

Kang, Jong Gu; Ryu, Gyeong Su; Rhee, Se Hun [Hanyang University, Seoul (Korea, Republic of); Kim, Dong Cheol; Kang, Mun Jin [Korea Institute of Industrial Technology, Incheon (Korea, Republic of); Park, Young Whan [Pukyong National University, Busan (Korea, Republic of)

2013-02-15

The wire feeding system for gas metal arc welding usually consists of a wire feeder and a torch. In many industries, the distance between the wire feeder and the torch is generally 3 m to 5 m. In a conventional wire feeder, a direct current (DC) motor is used for wire feeding. However, a significant problem with this system is the impossibility of feedback control because of inner or outer impedance. In this paper, a digital wire feeder was developed by using a DC encoder motor and a push-pull torch. An optimized wire-feeding system was also developed by experiment. The welding process was observed using a high-speed camera. The resulting wire-feeding system exhibits low spatter generation and arc stability.

Optimization of electron beam crosslinking of wire and cable insulation

International Nuclear Information System (INIS)

Zimek, Zbigniew; Przybytniak, Grażyna; Nowicki, Andrzej

2012-01-01

The computer simulations based on Monte Carlo (MC) method and the ModeCEB software were carried out in connection with electron beam (EB) radiation set-up for crosslinking of electric wire and cable insulation. The theoretical predictions for absorbed dose distribution in irradiated electric insulation induced by scanned EB were compared to the experimental results of irradiation that was carried out in the experimental set-up based on ILU 6 electron accelerator with electron energy 0.5–2.0 MeV. The computer simulation of the dose distributions in two-sided irradiation system by a scanned electron beam in multilayer circular objects was performed for various process parameters, namely electric wire and cable geometry (thickness of insulation layers and copper wire diameter), type of polymer insulation, electron energy, energy spread and geometry of electron beam, electric wire and cable layout in irradiation zone. The geometry of electron beam distribution in the irradiation zone was measured using CTA and PVC foil dosimeters for available electron energy range. The temperature rise of the irradiated electric wire and irradiation homogeneity were evaluated for different experimental conditions to optimize technological process parameters. The results of computer simulation are consistent with the experimental data of dose distribution evaluated by gel-fraction measurements. Such conformity indicates that ModeCEB computer simulation is reliable and sufficient for optimization absorbed dose distribution in the multi-layer circular objects irradiated with scanned electron beams. - Highlights: ► We model wire and cables irradiation process by Monte Carlo simulations. ► We optimize irradiation configuration for various process parameters. ► Temperature rise and irradiation homogeneity were evaluated. ► Calculation (dose) and experimental (gel-fraction) results were compared. ► Computer simulation was found reliable and sufficient for process optimization.

FY 1999 report on the results of the R and D of the substituting gas system and the substituting process of the etching gas used in the electronic device production process; 1999 nendo denshi device seizo process de shiyosuru etching gas no daitai gas system oyobi daitai process no kenkyu kaihatsu seika hokokusho

Energy Technology Data Exchange (ETDEWEB)

NONE

2000-03-01

As to the dry etching process and the wiring process where PFC gas and electric power are required most in the electronic device production process, an investigational study was conducted with the aim of PFC saving and energy saving, and the FY 1999 results were summed up. In the study, high efficiency etching process analysis equipment was developed, and three kinds of PFC gas quantitative analysis method were comparatively studied. Relating to the substitution of global environmental warming gas, it was found that C{sub x}F{sub y} type gas was effective which includes no oxygen, has a lot of carbon element numbers, and has double unsaturated bond. Further, in the study of the technology of PFC decomposition by plasma, it was indicated that PFC of 98.7% at maximum in exhaust gas could be removed on ideal conditions. In the dry etching technology by non-PFC gas of the organic insulating film, it was found out that NH{sub 3} base gas is more excellent in both shape and speed of etching than the existing O{sub 2} base one. As to the future wiring technology, new concepts of the optical wiring inside chip, etc. were proposed. (NEDO)

Brazing and diffusion bonding processes as available repair techniques for gas turbine blades and nozzles

International Nuclear Information System (INIS)

Mazur, Z.

1997-01-01

The conventionally welding methods are not useful for repair of heavily damaged gas turbine blades and nozzles. It includes thermal fatigue and craze cracks, corrosion, erosion and foreign object damage, which extend to the large areas. Because of required extensive heat input and couponing, it can cause severe distortion of the parts and cracks in the heat affected zone, and can made the repair costs high. For these cases, the available repair methods of gas turbine blades and nozzles, include brazing and diffusion bonding techniques are presented. Detailed analysis of the brazing and diffusion bonding processes applied for gas turbine blades repair with all elements which presented. Detailed analysis of the brazing and diffusion bonding processes applied for gas turbine blades repair with all elements which have influence to get sound joint is carried out. Depend of kind of blades and nozzle damage or deterioration registered a different methods of brazing and diffusion bonding applicability is presented. (Author) 65 refs

Minimisation of the wire position uncertainties of the new CERN vacuum wire scanner

CERN Document Server

AUTHOR|(CDS)2069346; Barjau Condomines, A

In the next years the luminosity of the LHC will be significantly increased. This will require a much higher accuracy of beam profile measurement than actually achievable by the current wire scanner. The new fast wire scanner is foreseen to measure small emittance beams throughout the LHC injector chain, which demands a wire travelling speed up to 20 ms-1 and position measurement accuracy of the order of a few microns. The vibrations of the mechanical parts of the system, and particularly the vibrations of the thin carbon wire, were identified as the major error sources of wire position uncertainty. Therefore the understanding of the wire vibrations is a high priority for the design and operation of the new device. This document presents the work performed to understand the main causes of the wire vibrations observed in one of the existing wire scanner and the new proposed design.

Direct reciprocity in animals: The roles of bonding and affective processes.

Science.gov (United States)

Freidin, Esteban; Carballo, Fabricio; Bentosela, Mariana

2017-04-01

The presence of direct reciprocity in animals is a debated topic, because, despite its evolutionary plausibility, it is believed to be uncommon. Some authors claim that stable reciprocal exchanges require sophisticated cognition which has acted as a constraint on its evolution across species. In contrast, a more recent trend of research has focused on the possibility that direct reciprocity occurs within long-term bonds and relies on simple as well as more complex affective mechanisms such as emotional book-keeping, rudimentary and higher forms of empathy, and inequity aversion, among others. First, we present evidence supporting the occurrence of long-term reciprocity in the context of existing bonds in social birds and mammals. Second, we discuss the evidence for affective responses which, modulated by bonding, may underlie altruistic behaviours in different species. We conclude that the mechanisms that may underlie reciprocal exchanges are diverse, and that some act in interaction with bonding processes. From simple associative learning in social contexts, through emotional contagion and behavioural mimicry, to empathy and a sense of fairness, widespread and diverse social affective mechanisms may explain why direct reciprocity may not be a rare phenomenon among social vertebrates. © 2015 International Union of Psychological Science.

Theory of wire number scaling in wire-array Z pinches

International Nuclear Information System (INIS)

Desjarlais, M.P.; Marder, B.M.

1999-01-01

Pulsed-power-driven Z pinches, produced by imploding cylindrical arrays of many wires, have generated very high x-ray radiation powers (>200 TW) and energies (2 MJ). Experiments have revealed a steady improvement in Z-pinch performance with increasing wire number at fixed total mass and array radius. The dominant mechanism acting to limit the performance of these devices is believed to be the Rayleigh-Taylor instability which broadens the radially imploding plasma sheath and consequently reduces the peak radiation power. A model is presented which describes an amplification over the two-dimensional Rayleigh-Taylor growth rate brought about by kink-like forces on the individual wires. This amplification factor goes to zero as the number of wires approaches infinity. This model gives results which are in good agreement with the experimental data and provides a scaling for wire-array Z pinches. copyright 1999 American Institute of Physics

Single Wire Detector Performance Over One Year of Operation

CERN Document Server

Hervas Aguilar, David Alberto

2014-01-01

Abstract When ionizing radiation passes through gas chambers in single wire detectors gas molecules separate into ions and electrons. By applying a strong localized electric field near the single wire an avalanche of electrons is created and it can be collected. The current produced in the wire is then proportional to the energy of the particle detected. Nevertheless, many factors can contribute to detector aging effects which are visible in a loss of gain caused by deposition of contaminants on the collecting wire. This study consists on novel data analysis techniques used to process large amounts of data produced by two simultaneously running single wire detectors. Aging effects are analyzed while environmental fluctuations are corrected for. A series of scripts carry out data filtering, data matching, corrections, and finally trend plotting by using ROOT’s extensive libraries developed at CERN.

49 CFR 594.9 - Fee for reimbursement of bond processing costs and costs for processing offers of cash deposits...

Science.gov (United States)

2010-10-01

... 49 Transportation 7 2010-10-01 2010-10-01 false Fee for reimbursement of bond processing costs and costs for processing offers of cash deposits or obligations of the United States in lieu of sureties on... indirect costs the agency incurs for receipt, processing, handling, and disbursement of cash deposits or...

Crosslinking of wire and cable insulation using electron accelerators

International Nuclear Information System (INIS)

Feng Yongxiang; Ma Zueteh

1992-01-01

Radiation crosslinking of wire and cable insulation is a well-established technology that is widely used in industry. The advantages of radiation crosslinking over chemical crosslinking have helped maintain its steady growth. Since successful utilization of electron beam processing relies on the formulation of compounds used in insulation, the radiation crosslinking of various polymers is reviewed. The handling technology for crosslinking wire and cable insulation and the throughput capacity of electron beam processors are also discussed. More than 30% of the industrial electron accelerators in the world are used for the radiation crosslinking of wire and cable insulation. Prospects of increased use of electron accelerators for crosslinking of wire and cable insulation are very good. (orig.)

Dual wire welding torch and method

Science.gov (United States)

Diez, Fernando Martinez; Stump, Kevin S.; Ludewig, Howard W.; Kilty, Alan L.; Robinson, Matthew M.; Egland, Keith M.

2009-04-28

A welding torch includes a nozzle with a first welding wire guide configured to orient a first welding wire in a first welding wire orientation, and a second welding wire guide configured to orient a second welding wire in a second welding wire orientation that is non-coplanar and divergent with respect to the first welding wire orientation. A method of welding includes moving a welding torch with respect to a workpiece joint to be welded. During moving the welding torch, a first welding wire is fed through a first welding wire guide defining a first welding wire orientation and a second welding wire is fed through a second welding wire guide defining a second welding wire orientation that is divergent and non-coplanar with respect to the first welding wire orientation.

Effect of starting materials and processing variables for the production of discontinuous filament Nb3Sn wire

International Nuclear Information System (INIS)

Upadhyay, P.L.; Dew-Hughes, D.

1986-01-01

Discontinuous multifilamentary wires of Nb 3 Sn have been prepared from compacted mixtures of 30 wt. %Nb in Cu, extruded, drawn, annealed, tin plated and reacted. Processing variables include starting materials, extrusion ratio and extrusion temperature. Continuous lengths of wire could be satisfactorily produced from compacts of either ultra-pure Nb (VPN about 95 kg mm -2 ) and Cu powder or from centrifugal arc-cast Nb spheroids (VPN about 120 kg mm -2 ) and tough pitch Cu powder. After a total area reduction of 10 4 : 1, the latter materials resulted in long, unbroken, highly regular filaments of Nb about 6μm in diameter. The high degree of perfection of these filaments is due in part to the uniformity of the initial spheroids, compared to the highly irregular hydride-dehydride Nb powder. However their greater hardness requires that the spheroids be coprocessed in a less-pure Cu matrix. Critical currents were measured on helical specimens involving more than 1m length of wire, in fields up to 15T at 4.2 K, after reaction for various times at different temperatures. Overall current densities of 3 X 10 8 Am -2 were obtained at 12T in the best samples. Further reductions are expected to produce material with improved current densities

One century of Kirschner wires and Kirschner wire insertion techniques : A historical review

NARCIS (Netherlands)

Franssen, Bas B. G. M.; Schuurman, Arnold H.; Van der Molen, Aebele Mink; Kon, Moshe

A century ago, in 1909, Martin Kirschner (1879-942) introduced a smooth pin, presently known as the Kirschner wire (K-wire). The K-wire was initiallly used for skeletal traction and is now currently used for many different goals. The development of the K-wire and its insertion devices were mainly

Effects of a diamond-like carbon coating on the frictional properties of orthodontic wires.

Science.gov (United States)

Muguruma, Takeshi; Iijima, Masahiro; Brantley, William A; Mizoguchi, Itaru

2011-01-01

To test the hypothesis that a diamond-like carbon coating does not affect the frictional properties of orthodontic wires. Two types of wires (nickel-titanium and stainless steel) were used, and diamond-like carbon (DLC) films were deposited on the wires. Three types of brackets, a conventional stainless steel bracket and two self-ligating brackets, were used for measuring static friction. DLC layers were observed by three-dimensional scanning electron microscopy (3D-SEM), and the surface roughness was measured. Hardness and elastic modulus were obtained by nanoindentation testing. Frictional forces and surface roughness were compared by the Kruskal-Wallis and Mann-Whitney U-tests. The hardness and elastic modulus of the wires were compared using Student's t-test. When angulation was increased, the DLC-coated wires showed significantly less frictional force than the as-received wires, except for some wire/bracket combinations. Thin DLC layers were observed on the wire surfaces by SEM. As-received and DLC-coated wires had similar surface morphologies, and the DLC-coating process did not affect the surface roughness. The hardness of the surface layer of the DLC-coated wires was much higher than for the as-received wires. The elastic modulus of the surface layer of the DLC-coated stainless steel wire was less than that of the as-received stainless steel wire, whereas similar values were found for the nickel-titanium wires. The hypothesis is rejected. A DLC-coating process does reduce the frictional force.

Continuous wet-process growth of ZnO nanoarrays for wire-shaped photoanode of dye-sensitized solar cell.

Science.gov (United States)

Tao, Pan; Guo, Wanwan; Du, Jun; Tao, Changyuan; Qing, Shenglan; Fan, Xing

2016-09-15

Well-aligned ZnO nanorod arrays have been grown on metal-plated polymer fiber via a mild wet process in a newly-designed continuous reactor, aiming to provide wire-shaped photoanodes for wearable dye-sensitized solar cells. The growth conditions were systematically optimized with the help of computational flow-field simulation. The flow field in the reactor will not only affect the morphology of the ZnO nanorod⧹nanowire but also affect the pattern distribution of nanoarray on the electrode surface. Unlike the sectional structure from the traditional batch-type reactor, ZnO nanorods with finely-controlled length and uniform morphology could be grown from the continuous reactor. After optimization, the wire-shaped ZnO-type photoanode grown from the continuous reactor exhibited better photovoltaic performance than that from the traditional batch-type reactor. Copyright © 2016 Elsevier Inc. All rights reserved.

Quantum conductance in silicon quantum wires

CERN Document Server

Bagraev, N T; Klyachkin, L E; Malyarenko, A M; Gehlhoff, W; Ivanov, V K; Shelykh, I A

2002-01-01

The results of investigations of electron and hole quantum conductance staircase in silicon quantum wires are presented. The characteristics of self-ordering quantum wells of n- and p-types, which from on the silicon (100) surface in the nonequilibrium boron diffusion process, are analyzed. The results of investigations of the quantum conductance as the function of temperature, carrier concentration and modulation degree of silicon quantum wires are given. It is found out, that the quantum conductance of the one-dimensional channels is observed, for the first time, at an elevated temperature (T >= 77 K)

Mechanism of bonding and debonding using surface activated bonding method with Si intermediate layer

Science.gov (United States)

Takeuchi, Kai; Fujino, Masahisa; Matsumoto, Yoshiie; Suga, Tadatomo

2018-04-01

Techniques of handling thin and fragile substrates in a high-temperature process are highly required for the fabrication of semiconductor devices including thin film transistors (TFTs). In our previous study, we proposed applying the surface activated bonding (SAB) method using Si intermediate layers to the bonding and debonding of glass substrates. The SAB method has successfully bonded glass substrates at room temperature, and the substrates have been debonded after heating at 450 °C, in which TFTs are fabricated on thin glass substrates for LC display devices. In this study, we conducted the bonding and debonding of Si and glass in order to understand the mechanism in the proposed process. Si substrates are also successfully bonded to glass substrates at room temperature and debonded after heating at 450 °C using the proposed bonding process. By the composition analysis of bonding interfaces, it is clarified that the absorbed water on the glass forms interfacial voids and cause the decrease in bond strength.

Fabrication and properties of multifilamentary MgB 2 wires by in-situ powder-in-tube process

Science.gov (United States)

Wang, Q. Y.; Jiao, G. F.; Liu, G. Q.; Xiong, X. M.; Yan, S. C.; Zhang, P. X.; Sulpice, A.; Mossang, E.; Feng, Y.; Yan, G.

2010-11-01

We have fabricated the long TiC-doped MgB2 wires with 6 filaments by in-situ powder-in-tube method using Nb as the barrier and copper as the stabilizer. To improve the strength of wires, the Nb-core was used as the central filament. The transport engineering critical current density (Jce) of the samples sintered at different temperature were measured, which reaches 2.5 × 104 A/cm2 at 4.2 K, 5 T. 100 m MgB2 wires with different diameter were wound into coils and the transport critical current (Ic) of the coil were measured at 30 K in self-field. The Jce value 100 m coil achieves 1.1 × 104 A/cm2 in 1.2 mm wire. The reasons leading to the enhancement of high field Jce were discussed. The results show a good potential to fabricate high performance MgB2 wires and tapes at ambient pressure on an industrial scale.

Technology development of fabrication NbTi and Nb3 Sn superconducting wires

International Nuclear Information System (INIS)

Rodrigues Junior, D.; Bormio, C.; Baldan, C.A.; Ramos, M.J.; Pinatti, D.G.

1988-01-01

The technology development of NbTi and Nb 3 Sn superconducting wires are studied, mentioning the use of fluxes capture theory in the sizing of wires fabrication. The fabrication process, the thermal treatment and the experimental datas of critical temperature and current of Nb 3 Sn wires are described. (C.G.C.) [pt

Composite ceramic superconducting wires for electric motor applications

Science.gov (United States)

Halloran, John W.

1990-07-01

Several types of HTSC wire have been produced and two types of HTSC motors are being built. Hundreds of meters of Ag- clad wire were fabricated from YBa2Cu3O(7-x) (Y-123) and Bi2Ca2Sr2Cu3O10 (BiSCCO). The dc homopolar motor coils are not yet completed, but multiple turns of wire have been wound on the coil bobbins to characterize the superconducting properties of coiled wire. Multifilamentary conductors were fabricated as cables and coils. The sintered polycrystalline wire has self-field critical current densities (Jc) as high as 2800 A/sq cm, but the Jc falls rapidly with magnetic field. To improve Jc, sintered YBCO wire is melt textured with a continuous process which has produced textures wire up to 0.5 meters long with 77K transport Jc above 11, 770 A/sq cm2 in self field and 2100 A/sq cm2 at 1 telsa. The Emerson Electric dc homopolar HTSC motor has been fabricated and run with conventional copper coils. A novel class of potential very powerful superconducting motors have been designed to use trapped flux in melt textures Y-123 as magnet replicas in an new type of permanent magnet motor. The stator element and part of the rotor of the first prototype machine exist, and the HTSC magnet replica segments are being fabricated.

'There were more wires than him': the potential for wireless patient monitoring in neonatal intensive care.

Science.gov (United States)

Bonner, Oliver; Beardsall, Kathryn; Crilly, Nathan; Lasenby, Joan

2017-02-01

The neonatal intensive care unit (NICU) can be one of the most stressful hospital environments. Alongside providing intensive clinical care, it is important that parents have the opportunity for regular physical contact with their babies because the neonatal period is critical for parent-child bonding. At present, monitoring technology in the NICU requires multiple wired sensors to track each baby's vital signs. This study describes the experiences that parents and nurses have with the current monitoring methods, and reports on their responses to the concept of a wireless monitoring system. Semistructured interviews were conducted with six parents, each of whom had babies on the unit, and seven nurses who cared for those babies. The interviews initially focused on the participants' experiences of the current wired system and then on their responses to the concept of a wireless system. The transcripts were analysed using a general inductive approach to identify relevant themes. Participants reported on physical and psychological barriers to parental care, the ways in which the current system obstructed the efficient delivery of clinical care and the perceived benefits and risks of a wireless system. The parents and nurses identified that the wires impeded baby-parent bonding; physically and psychologically. While a wireless system was viewed as potentially enabling greater interaction, staff and parents highlighted potential concerns, including the size, weight and battery life of any new device. The many wires required to safely monitor babies within the NICU creates a negative environment for parents at a critical developmental period, in terms of physical and psychological interactions. Nurses also experience challenges with the existing system, which could negatively impact the clinical care delivery. Developing a wireless system could overcome these barriers, but there remain challenges in designing a device suitable for this unique environment.

High-speed micro electrode tool fabrication by a twin-wire EDM system

International Nuclear Information System (INIS)

Sheu, Dong-Yea

2008-01-01

This paper describes a new machining process which combines twin-electro-wire together with two electro discharge circuits to rapidly fabricate micro electrode tools. The results show that transistor electro discharge and RC electro discharge circuits coexist to fabricate micro tools with rough and finish machining both on the same machine. Compared to conventional wire electro discharge grinding (WEDG) technology, a twin-wire EDM system that combines rough and finish machining into one process allows the efficient fabrication of micro tools. This high-speed micro tool fabrication process can be applied not only to micro electrode machining but also to micro punching tool and micro probing tips machining

The effect of ligation on the load deflection characteristics of nickel titanium orthodontic wire.

Science.gov (United States)

Kasuya, Shugo; Nagasaka, Satoshi; Hanyuda, Ai; Ishimura, Sadao; Hirashita, Ayao

2007-12-01

This study examined the effect of ligation on the load-deflection characteristics of nickel-titanium (NiTi) orthodontic wire. A modified three-point bending system was used for bending the NiTi round wire, which was inserted and ligated in the slots of three brackets, one of which was bonded to each of the three bender rods. Three different ligation methods, stainless steel ligature (SSL), slot lid (SL), and elastomeric ligature (EL), were employed, as well as a control with neither bracket nor ligation (NBL). The tests were repeated five times under each condition. Comparisons were made of load-deflection curve, load at maximum deflection of 2,000 microm, and load at a deflection of 1,500 microm during unloading. Analysis of Variance (ANOVA) and Dunnett's test were conducted to determine method difference (alpha = 0.05). The interaction between deflection and ligation was tested, using repeated-measures ANOVA (alpha = 0.05). The load values of the ligation groups were two to three times greater than the NBL group at a deflection of 1,500 microm during unloading: 4.37 N for EL, 3.90 N for SSL, 3.02 N for SL, and 1.49 N for NBL (P wire may make NiTi wire exhibit a significantly heavier load than that traditionally expected. NiTi wire exhibited the majority of its true superelasticity with SL, whereas EL may act as a restraint on its superelasticity.

77 FR 10621 - Changes to the In-Bond Process

Science.gov (United States)

2012-02-22

... submit in-bond applications electronically using a CBP-approved electronic data interchange (EDI) system... electronically submit the in-bond application to CBP via a CBP-approved EDI system. \\6\\ Due to the unique... as the CBP-approved EDI system for submitting the in-bond application and other information that is...

Impact of different rectangular wires on torsional expression of different sizes of buccal tube.

Science.gov (United States)

Ajami, Shabnam; Boroujeni, Afshar-Rasti

2018-01-01

Torsions in rectangular wires are the essential part of corrections in the finishing stage of treatment. Moreover the greatest amounts of torques are applied in the molar areas. a clinically effective moment is between 5 and 20 Nmm. In this study we have decided to evaluate the impact of different tube sizes and different dimensions of wires with different modulus of elasticities on the amount torsional bond strength of molar tubes. 60 human impacted molar teeth were collected. A buccal tube was bonded on the buccal surface of all the samples by using light cured adhesive resin. After that, the teeth were mounted in a hard acrylic block. According to the size of buccal tube and the rectangular wires to be tested 4 groups will be designed. Torsional force was applied by instron machine. The torque angle at 5Nmm and at 20Nmm point will be calculated: which means, how many degrees of torque is required to reach the maximum 20Nmm moment from the minimum 5Nmm.One-way ANOVA was used to compare torque angle in all of the groups. The least amount of clinically significant angle was 2.2 ᵒ in the 0.017×0.025 SS and the largest amount of it was 23.7 ᵒ in the 0.017×0.025 TMA in 0.018×0.025 slot molar tube. But, this angle was 19.9 ᵒand 13.6 ᵒ in 0.019×0.025 SS and 0.019×0.025 TMA archwire in 0.022×0.028 molar tube. The 0.017×0.025 SS archwire in 0.018×0.025 molar tube had the lowest clinically significant angle. The largest amount was seen in group 0.017×0.025 TMA in 0.018×0.025 slot molar tube. Key words: Torsional efficacy, rectangular wires, buccal tubes, torque angle.

Signal Acquisition and Processing in the Magnetic Defectoscopy of Steel Wire Ropes

Directory of Open Access Journals (Sweden)

N. S. Jovičić

2012-11-01

Full Text Available The system that resolves the problem of wire rope defects using a magnetic method of inspection is presented in this paper. Implementation of the system should provide for full monitoring of wire rope condition, according to the prescribed international standards. The purpose of this system, in addition to identifying defects in the rope, is to determine to what extent damage has been done. The measurement procedure provides for a better understanding of the defects that occur, as well as the rejection criteria of used ropes, that way increasing their security. Hardware and software design of appliance for recording defects and test results are presented in this paper.

Pull-pull position control of dual motor wire rope transmission.

Science.gov (United States)

Guo, Quan; Jiao, Zongxia; Yan, Liang; Yu, Qian; Shang, Yaoxing

2016-08-01

Wire rope transmission is very efficient because of the small total moving object mass. The wire rope could only transmit pulling force. Therefore it has to be kept in a tightened state during transmission; in high speed applications the dynamic performance depends on the rope's stiffness, which can be adjusted by the wire rope tension. To improve the system dynamic performance output, this paper proposes a novel pull-pull method based on dual motors connected by wire ropes, for precise, high speed position control applications. The method can regulate target position and wire rope tension simultaneously. Wire ropes remain in a pre-tightening state at all times, which prevents the influence of elasticity and reduces the position tracking error in the changing direction process. Simulations and experiments were conducted; the results indicate that both position precision and superior dynamic performance can be synchronously achieved. The research is relevant to space craft precision pointing instruments.

1998 wire development workshop proceedings

Energy Technology Data Exchange (ETDEWEB)

NONE

1998-04-01

This report consists of vugraphs of the presentations at the conference. The conference was divided into the following sessions: (1) First Generation Wire Development: Status and Issues; (2) First Generation Wire in Pre-Commercial Prototypes; (3) Second Generation Wire Development: Private Sector Progress and Issues; (4) Second Generation Wire Development: Federal Laboratories; and (5) Fundamental Research Issues for HTS Wire Development.

1998 wire development workshop proceedings

International Nuclear Information System (INIS)

1998-04-01

This report consists of vugraphs of the presentations at the conference. The conference was divided into the following sessions: (1) First Generation Wire Development: Status and Issues; (2) First Generation Wire in Pre-Commercial Prototypes; (3) Second Generation Wire Development: Private Sector Progress and Issues; (4) Second Generation Wire Development: Federal Laboratories; and (5) Fundamental Research Issues for HTS Wire Development

A review of various nozzle range of wire arc spray on FeCrBMnSi metal coating

Science.gov (United States)

Purwaningsih, Hariyati; Rochiem, Rochman; Suchaimi, Muhammad; Jatimurti, Wikan; Wibisono, Alvian Toto; Kurniawan, Budi Agung

2018-04-01

Low Temperature Hot Corrosion (LTHC) is type of hot corrosion which occurred on 700-800°C and usually on turbine blades. So, as a result the material of turbine blades is crack and degredation of rotation efficiency. Hot corrosion protection with the use of barrier that separate substrate and environment is one of using metal surface coating, wire arc spray method. This study has a purpose to analyze the effect of nozzle distance and gas pressure on FeCrBMnSi coating process using wire arc spray method on thermal resistance. The parameter of nozzle distance and gas pressure are used, resulted the best parameter on distance 400 mm and gas pressure 3 bar which has the bond strength of 12,58 MPa with porosity percentage of 5,93% and roughness values of 16,36 µm. While the examination of thermal cycle which by heating and cooling continuously, on the coating surface is formed oxide compound (Fe3O4) which cause formed crack propagation and delamination. Beside that hardness of coating surface is increase which caused by precipitate boride (Fe9B)0,2

Fuel Pellets from Biomass. Processing, Bonding, Raw Materials

DEFF Research Database (Denmark)

Stelte, Wolfgang

in an increasing interest in biomass densification technologies, such as pelletization and briquetting. The global pellet market has developed quickly, and strong growth is to be expected for the coming years. Due to an increasing demand for biomass, the traditionally used wood residues from sawmills and pulp...... influence of the different processing parameters on the pressure built up in the press channel of a pellet mill. It showed that the major factor was the press channel length as well as temperature, moisture content, particle size and extractive content. Furthermore, extractive migration to the pellet...... surface at an elevated temperature played an important role. The second study presented a method of how key processing parameters can be estimated, based on a pellet model and a small number of fast and simple laboratory trials using a single pellet press. The third study investigated the bonding...

Right wire in orthodontics: a review

OpenAIRE

Ali, Hashim

2015-01-01

Quality of orthodontic wire such as stiffness, hardness, resiliency, elasticity and working range are important determinants of the effectivenes of tooth movement. Commonly used types of orthodontic arch wire:1) stainless steel(ss) wire, 2) conventional nickel- titanium (NiTi)alloy wire,3) improved super elastic NiTi- alloy wire( also called low hysteresis(LH)wire), and titanium molybdenum alloy(TMA) wire.

Gold Wire-networks: Particle Array Guided Evaporation Lithograpy

KAUST Repository

Lone, Saifullah

2015-06-29

We exploited the combination of dry deposition of monolayer of 2D (two dimensional) templates, lift-up transfer of 2D template onto flat surfaces and evaporation lithography [1] to fabricate gold micro- and submicron size wire networks. The approach relies upon the defect free dry deposition of 2D monolayer of latex particles [2] on patterned silicon template and flat PDMS-substrate to create square centered and honey-comb wire networks respectively. The process is followed by lift-up transfer of 2D latex crystal on glass substrate. Subsequently, a small amount of AuNP-suspension is doped on top of the transferred crystal; the suspension is allowed to spread instantaneously and dried at low temperature. The liquid evaporates uniformly to the direction perpendicular to glass substrate. During evaporation, AuNPs are de-wetted along with the movement of liquid to self-assemble in-between the inter-particle spaces and therefore, giving rise to liquid-bridge networks which upon delayed evaporation, transforms into wire networks. The approach is used to fabricate both micro- and submicron wire-networks by simply changing the template dimensions. One of the prime motives behind this study is to down-scale the existing particle array template-based evaporation lithography process to fabricate connected gold wire networks at both micro- and submicron scale. Secondly, the idea of combining the patterned silicon wafer with lifted latex particle template creates an opportunity to clean and res-use the patterned wafer more often and thereby, saving fabrication time and resources. Finally, we illustrated the validity of this approach by creating an easy and high-speed approach to develop gold wire networks on a flexible substrate with a thin deposited adhesive. These advances will not only serve as a platform to scale up the production, but also demonstrated that the fabrication method can produce metallic wire networks of different scale and onto a variety of substrates.

Void and Phase Evolution during the Processing of Bi-2212 Superconducting Wires monitored by combined fast Synchrotron Micro-tomography and X-Ray Diffraction

CERN Document Server

Scheuerlein, C; Scheel, M; Jiang, J; Kametani, F; Malagoli, A; Hellstrom, E E; Larbalestier, D C

2011-01-01

Recent study of the current-limiting mechanisms in Bi-2212 round wires has suggested that agglomeration of the residual Bi-2212 powder porosity into bubbles of filament-diameter size occurs on melting the Bi-2212 filaments. These pores introduce a major obstacle to current flow, which greatly reduces the critical current density (Jc). Here we present an in situ non-destructive tomographic and diffraction study of the changes occurring during the heat treatment of wires and starting powder, as well as a room temperature study of ex situ processed wires. The in situ through-process study shows that the agglomeration of residual porosity is more complex than previously seen. Filament changes start with coalescence of the quasi-uniform and finely divided powder porosity into lens-shaped defects at about 850 0C when the Bi-2201 impurity phase decomposes before the Bi-2212 starts to melt. These lens-shaped voids grow to bubbles of a filament diameter on melting of the Bi-2212 and continue to lengthen and then to ag...

Application of irradiated wire

International Nuclear Information System (INIS)

Uda, I.; Kozima, K.; Suzuki, S.; Tada, S.; Torisu, S.; Veno, K.

1984-01-01

Rubber insulated wires are still useful for internal wiring in motor vehicles and electrical equipment because of flexibility and toughness. Irradiated cross-linked rubber materials have been successfully introduced for use with fusible link wire and helically coiled cord

Steady-State Numerical Modeling of Size Effects in Wire Drawing

DEFF Research Database (Denmark)

Juul, Kristian Jørgensen; Nielsen, Kim Lau; Niordson, Christian Frithiof

2016-01-01

Wire drawing processes at micron scale receive increased interest as micro wires are increasingly required in micro electrical components. At the micron scale, size effects become important and have to be taken into consideration. The goal is to optimize the semi-cone angle of the tool in terms...

Wire Array Solar Cells: Fabrication and Photoelectrochemical Studies

Science.gov (United States)

Spurgeon, Joshua Michael

Despite demand for clean energy to reduce our addiction to fossil fuels, the price of these technologies relative to oil and coal has prevented their widespread implementation. Solar energy has enormous potential as a carbon-free resource but is several times the cost of coal-produced electricity, largely because photovoltaics of practical efficiency require high-quality, pure semiconductor materials. To produce current in a planar junction solar cell, an electron or hole generated deep within the material must travel all the way to the junction without recombining. Radial junction, wire array solar cells, however, have the potential to decouple the directions of light absorption and charge-carrier collection so that a semiconductor with a minority-carrier diffusion length shorter than its absorption depth (i.e., a lower quality, potentially cheaper material) can effectively produce current. The axial dimension of the wires is long enough for sufficient optical absorption while the charge-carriers are collected along the shorter radial dimension in a massively parallel array. This thesis explores the wire array solar cell design by developing potentially low-cost fabrication methods and investigating the energy-conversion properties of the arrays in photoelectrochemical cells. The concept was initially investigated with Cd(Se, Te) rod arrays; however, Si was the primary focus of wire array research because its semiconductor properties make low-quality Si an ideal candidate for improvement in a radial geometry. Fabrication routes for Si wire arrays were explored, including the vapor-liquid-solid growth of wires using SiCl4. Uniform, vertically aligned Si wires were demonstrated in a process that permits control of the wire radius, length, and spacing. A technique was developed to transfer these wire arrays into a low-cost, flexible polymer film, and grow multiple subsequent arrays using a single Si(111) substrate. Photoelectrochemical measurements on Si wire array

Strengthening of Aluminum Wires Treated with A206/Alumina Nanocomposites

Directory of Open Access Journals (Sweden)

David Florián-Algarín

2018-03-01

Full Text Available This study sought to characterize aluminum nanocomposite wires that were fabricated through a cold-rolling process, having potential applications in TIG (tungsten inert gas welding of aluminum. A206 (Al-4.5Cu-0.25Mg master nanocomposites with 5 wt % γAl2O3 nanoparticles were first manufactured through a hybrid process combining semi-solid mixing and ultrasonic processing. A206/1 wt % γAl2O3 nanocomposites were fabricated by diluting the prepared master nanocomposites with a monolithic A206 alloy, which was then added to a pure aluminum melt. The fabricated Al–γAl2O3 nanocomposite billet was cold-rolled to produce an Al nanocomposite wire with a 1 mm diameter and a transverse area reduction of 96%. Containing different levels of nanocomposites, the fabricated samples were mechanically and electrically characterized. The results demonstrate a significantly higher strength of the aluminum wires with the nanocomposite addition. Further, the addition of alumina nanoparticles affected the wires’ electrical conductivity compared with that of pure aluminum and aluminum–copper alloys. The overall properties of the new material demonstrate that these wires could be an appealing alternative for fillers intended for aluminum welding.

Process and magnetic properties of cold pressed Ne Fe B bonded magnets

International Nuclear Information System (INIS)

Rodrigues, DAniel; Concilio, Gilberto Vicente; Landgraf, Fernando Jose Gomes; Zanchetta, Antonio Carlos

1996-01-01

Bonded magnets are polymer composites based on a mixture of a hard magnetic powder and a polymer. This mixture is processed as a traditional powder metallurgy material, cold pressed, or like a thermoplastic material, by injection molding. The polymeric phase to a large extent determines the mechanical properties of the composite, while magnetic powder determines its magnetic properties. They are less expensive and easier to produce, specially in the case of high complexity parts. This paper presents the relationship between process variables and magnetic properties of cold pressed Nd Fe B bonded magnets produced from melt spun flakes mixed with thermosetting resins. The experiments were done using Statistical Design of Experiments. The variables investigates were: uniaxial compaction pressure, binder type; binder content; size of Nd Fe B particles; addition of lubricant; and addition of small quantities of magnetic additives, particles of ferrites, iron, or alnico. (author)

Effect of discrete wires on the implosion dynamics of wire array Z pinches

International Nuclear Information System (INIS)

Lebedev, S. V.; Beg, F. N.; Bland, S. N.; Chittenden, J. P.; Dangor, A. E.; Haines, M. G.; Kwek, K. H.; Pikuz, S. A.; Shelkovenko, T. A.

2001-01-01

A phenomenological model of wire array Z-pinch implosions, based on the analysis of experimental data obtained on the mega-ampere generator for plasma implosion experiments (MAGPIE) generator [I. H. Mitchell , Rev. Sci. Instrum. 67, 1533 (1996)], is described. The data show that during the first ∼80% of the implosion the wire cores remain stationary in their initial positions, while the coronal plasma is continuously jetting from the wire cores to the array axis. This phase ends by the formation of gaps in the wire cores, which occurs due to the nonuniformity of the ablation rate along the wires. The final phase of the implosion starting at this time occurs as a rapid snowplow-like implosion of the radially distributed precursor plasma, previously injected in the interior of the array. The density distribution of the precursor plasma, being peaked on the array axis, could be a key factor providing stability of the wire array implosions operating in the regime of discrete wires. The modified ''initial'' conditions for simulations of wire array Z-pinch implosions with one-dimension (1D) and two-dimensions (2D) in the r--z plane, radiation-magnetohydrodynamic (MHD) codes, and a possible scaling to a larger drive current are discussed

Strain-tempering of low carbon martensite steel wire by rapid heating

International Nuclear Information System (INIS)

Torisaka, Yasunori; Kihara, Junji

1978-01-01

In the production of prestressed concrete steel wires, a series of the cold drawing-patenting process are performed to improve the strength. In order to reduce cyclic process, the low carbon martensite steel wire which can be produced only by the process of hot rolling and direct quench has been investigated as strain-tempering material. When strain-tempering is performed on the low carbon martensite steel wire, stress relaxation (Re%) increases and mechanical properties such as total elongation, reduction of area, ultimate tensile strength and proof stress decrease remarkably by annealing. In order to shorten the heating time, the authors performed on the steel wire the strain-tempering with a heating time of 1.0 s using direct electrical resistance heating and examined the effects of rapid heating on the stress relaxation and the mechanical properties. Stress relaxation decreases without impairment of the mechanical properties up to a strain-tempering temperature of 573 K. Re(%) after 10.8 ks is 0% at the testing temperature 301 K, 0.49% at 363 K and 1.39% at 433 K. (auth.)

PECULIARITIES OF FORMATION OF STRUCTURE AND PROPERTIES AT THERMO-MECHANICAL PROCESSING OF ROLLED WIRE OF NICKEL

OpenAIRE

V. A. Lutsenko

2012-01-01

There are results of researches of the mechanical properties and structure of the wire rod made of low-carbon nickel molybdenum steel after reduction to toughness thermomechanical treatment in the stream of high-speed wire mill.

Wire core reactor for NTP

International Nuclear Information System (INIS)

Harty, R.B.

1991-01-01

The development of the wire core system for Nuclear Thermal Propulsion (NTP) that took place from 1963 to 1965 is discussed. A wire core consists of a fuel wire with spacer wires. It's an annular flow core having a central control rod. There are actually four of these, with beryllium solid reflectors on both ends and all the way around. Much of the information on the concept is given in viewgraph form. Viewgraphs are presented on design details of the wire core, the engine design, engine weight vs. thrust, a technique used to fabricate the wire fuel element, and axial temperature distribution

Water Desalination with Wires

NARCIS (Netherlands)

Porada, S.; Sales, B.B.; Hamelers, H.V.M.; Biesheuvel, P.M.

2012-01-01

We show the significant potential of water desalination using a novel capacitive wire-based technology in which anode/cathode wire pairs are constructed from coating a thin porous carbon electrode layer on top of electrically conducting rods (or wires). By alternately dipping an array of electrode

Towards plant wires

OpenAIRE

Adamatzky, Andrew

2014-01-01

In experimental laboratory studies we evaluate a possibility of making electrical wires from living plants. In scoping experiments we use lettuce seedlings as a prototype model of a plant wire. We approximate an electrical potential transfer function by applying direct current voltage to the lettuce seedlings and recording output voltage. We analyse oscillation frequencies of the output potential and assess noise immunity of the plant wires. Our findings will be used in future designs of self...

Reliability of the wire drawing dies

International Nuclear Information System (INIS)

Sheikh, A.K.; Khany, S.E.

1993-01-01

A wear based model is proposed for the dies used in wire drawing process. Using this wear model, it is possible to predict life of the die corresponding to a wear limit criterion. Since various quantities in the model are random in nature the resulting die life will also be random quantity characterized by an appropriate distribution. Using a probabilistic characterization of the parameters of the predictive model, Monte Carlo simulations were conducted to establish the die life distribution. To asses the sensitivity of life distribution with respect to various contributing variables (parameters), the simulation runs were conducted at different levels of these variables (parameters). It is shown that wire drawing die life is Weibull distributed. To compare the simulated results with actual time to failure, data of dies was obtained from a large wire drawing company and was compared with corresponding scenario generated by Monte Carlo simulation. Results obtained by Monte Carlo simulations were very close to the actual time to failure data. (author)

PECULIARITIES OF FORMATION OF STRUCTURE AND PROPERTIES AT THERMO-MECHANICAL PROCESSING OF ROLLED WIRE OF NICKEL

Directory of Open Access Journals (Sweden)

V. A. Lutsenko

2012-01-01

Full Text Available There are results of researches of the mechanical properties and structure of the wire rod made of low-carbon nickel molybdenum steel after reduction to toughness thermomechanical treatment in the stream of high-speed wire mill.

Hybrid microcircuit technology handbook materials, processes, design, testing and production

CERN Document Server

Licari, James J

1998-01-01

The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will

Evolution of cementite morphology in pearlitic steel wire during wet wire drawing

DEFF Research Database (Denmark)

Zhang, Xiaodan; Godfrey, Andrew; Hansen, Niels

2010-01-01

The evolution of the cementite phase during wet wire drawing of a pearlitic steel wire has been followed as a function of strain. Particular attention has been given to a quantitative characterization of changes in the alignment and in the dimensions of the cementite phase. Scanning electron...... microscope observations show that cementite plates become increasingly aligned with the wire axis as the drawing strain is increased. Measurements in the transmission electron microscope show that the cementite deforms plastically during wire drawing , with the average thickness of the cementite plates...... decreasing from 19 nm (ε = 0) to 2 nm (ε = 3.7) in correspondence with the reduction in wire diameter. The deformation of the cementite is strongly related to plastic deformation in the ferrite, with coarse slip steps, shear bands and cracks in the cementite plates/particles observed parallel to either {110...

A comparison study of exploding a Cu wire in air, water, and solid powders

Science.gov (United States)

Han, Ruoyu; Wu, Jiawei; Ding, Weidong; Zhou, Haibin; Qiu, Aici; Wang, Yanan

2017-11-01

In this paper, an experimental study on exploding a copper wire in air, water, incombustible powders, and energetic materials is performed. We examined the effects of the surrounding media on the explosion process and its related phenomena. Experiments were first carried out with copper wire explosions driven by microsecond timescale pulsed currents in air, water, and the half-half case. Then, the copper wires were exploded in air, water, SiO2 powders, quartz sand, NaCl powders, and energetic-material cylinders, respectively. Our experimental results indicated that the explosion process was significantly influenced by the surrounding media, resulting in noticeable differences in energy deposition, optical emission, and shock waves. In particular, incombustible powders could throttle the current flow completely when a fine wire was adopted. We also found that an air or incombustible-powder layer could drastically attenuate the shock wave generated by a wire explosion. As for energetic-material loads, obvious discrepancies were found in voltage/current waveforms from vaporization when compared with a wire explosion in air/water, which meant the metal vapor/liquid drops play a significant role in the ignition process.

A thermo-electro-mechanical simulation model for hot wire cutting of EPS foam

DEFF Research Database (Denmark)

Petkov, Kiril; Hattel, Jesper Henri

2016-01-01

A one-dimensional thermo-electro-mechanical mathematical model describing the effects taking place within a Ni-Cr20% wire used in a hot-wire cutting process for free forming and rapid prototyping of expanded polystyrene (EPS) is investigated and simulated. The model implements and solves three semi...... cutting of EPS in contact with a cutting tool made of an electrically heated metal wire attached to a robot device. The finite difference method is used to solve the coupled equations in the two environments (domains) in which the hot-wire operates, namely air and EPS. The model is calibrated against...... experimentally obtained data. Novel findings are a transient temperature-dependent kerfwidth prediction and a relation between kerfwidth and the cutting angle as measured from the horizontal direction. These are important relations in the aim for higher geometrical accuracy of the hot-wire cutting process. (C...

Improvisation of mechanical and electrical properties of Cu by reinforcing MWCNT using modified electro-co-deposition process

Science.gov (United States)

Belgamwar, Sachin U.; Sharma, N. N.

2018-04-01

Multi-walled Carbon nanotubes–copper (MWCNT/Cu) composite powders with variable MWCNT content were synthesized by modified electro-co-deposition method. The electro-co-deposited MWCNT/Cu powders were consolidated by conventional compaction and sintering process. The consolidated products were then hot rolled and cold drawn to fine wires. The MWCNT/Cu composite wire samples were characterized for electrical and mechanical properties. We have been able to achieve an increase of around 8% in electrical conductivity of the form wires repeatedly. It has been observed that there was gradual improvement in the properties with reinforcement of MWCNT in the copper matrix. The betterment of electrical property has been achieved with simultaneous improvement in mechanical properties of the wire. The yield strength of MWCNT/Cu composite wire was found to be four times and the tensile strength two times greater than that of pure copper. The improved properties are attributed to the proper distribution of MWCNTs in the copper matrix and excellent interfacial bonding between MWCNT and composite copper fabricated by the modified method.

Hot drawn Fe–6.5 wt.%Si wires with good ductility

International Nuclear Information System (INIS)

Yang, W.; Li, H.; Yang, K.; Liang, Y.F.; Yang, J.; Ye, F.

2014-01-01

Highlights: • Fe–6.5wt%Si steel wire with diameter of 1.6 mm can be successfully obtained by hot drawing process. • The ductility of Fe–6.5wt%Si alloy can be improved significantly when it is fabricated in the form of wire. • The Dc magnetic property of Fe–6.5wt%Si steel wire 1.6 mm in diameter is excellent, which is close to that of 0.3 mm thick cold-rolling sheet. - Abstract: Fe–6.5 wt.%Si high silicon steel wires with a diameter of 1.6 mm are fabricated successfully by hot drawing. The high silicon steel wires show much better ductility than sheets. The tensile strength and elongation of the wires at the room temperature can reach 1.31 GPa and 1.4%, respectively. The tensile strength and elongation of the rolling sheet at the room temperature are 0.8 GPa and 0, respectively. The microstructure analyses show that the elongated grains after drawing and reduced ordering phases by deformation in the wires might contribute to its good ductility. Bs value of 1.437 T and Hc value of 16.96 A/m are obtained for the wire after proper heat treatment for the wires

Bending of conjugated molecular wires and its effect on electron conduction properties

International Nuclear Information System (INIS)

Das, Bidisa

2010-01-01

The electronic structure and electron transport properties of simple conjugated molecular wires like oligophenylene ethynylene (OPE) and oligophenylene vinylene (OPV) are studied under compression. If artificially confined to a given shorter length, the oligomers tend to bend and bending causes a loss in the overlap of the conjugated molecular orbitals. Theoretical modeling of electronic transport has been carried out for all undistorted and compressed OPE/OPV oligomers. OPV exists in step-like or V-like conformations and they have the same stability with very similar frontier molecular orbitals. The conductances of these molecular wires are calculated when inserted between two gold probes and the conductances for OPV are found to be comparable to OPE when the interfaces are same. The conductance decreases with bending due to the gradual loss in overlap of the molecular orbitals. It is also found that the conductances of the molecular wires decrease very strongly if the terminal sulfur atom is simultaneously bonded to hydrogen and a gold surface, thus reflecting the importance of the interface in determining the conductance in two-probe systems. From the conductance studies it may be concluded that if one or more benzene rings of OPE are rotated from coplanar conditions, the orthogonal molecular orbitals may completely block the electronic transport, rendering the molecule insulating.

Corrosion resistance of premodeled wires made of stainless steel used for heart electrotherapy leaders

International Nuclear Information System (INIS)

Przondziono, J; Szatka, W; Walke, W; Młynarski, R

2012-01-01

The purpose of the study is to evaluate resistance to electrochemical corrosion of wire made of X10CrNi18-8 stainless steel designed for use in cardiology treatment. The influence of strain formed in the premodeling process and methods of wire surface preparation to corrosive resistance in artificial plasma solution were analysed. Wire corrosion tests were carried out in the solution of artificial plasma. Resistance to electrochemical corrosion was evaluated on the ground of recorded curves of anodic polarization by means of potentiodynamic method. Potentiodynamic tests carried out enabled to determine how the resistance to pitting corrosion of wire changes, depending on strain formed in the premodeling process as well as on the method of wire surface preparation. For evaluation of phenomena occurring on the surface of tested steel, electrochemical impedance spectroscopy (EIS) was applied. Deterioration of corrosive properties of wire along with the increase in the formed strain hardening was observed.

Nanograined Ti–Nb microalloy steel achieved by Accumulative Roll Bonding (ARB) process

International Nuclear Information System (INIS)

Tohidi, A.A.; Ketabchi, M.; Hasannia, A.

2013-01-01

Over the last decade, nanocrystalline and ultra-fine grained (UFG) materials with grain size less than 1 μm have aroused considerable interest due to their superior mechanical properties compared to conventionally grained materials. In this work Ti–Nb microalloy steel was processed by the severe plastic deformation (SPD) technique called Accumulative Roll Bonding (ARB) in order to produce an ultra-fine grained microstructure and improve the mechanical properties. After initial preparation to achieve good sheet bonding, 8 cycles of ARB at 550 °C were successfully performed. Observation of optical microstructure, scanning electron microscopy (SEM) micrographs, and X-Ray Diffraction (XRD) peak broadening analysis were used for the characterization of grain structure of the ARB processed sample. The mechanical attributes after rolling and cooling were examined. It was calculated that metal's yield and tensile strength increased by 334% and 215% respectively, while the ductility dropped from as-received value of 34% to 2.9%. Microhardness of the material was studied at room temperature. There was a continuous enhancement of hardness by increasing the pass number of the ARB process. At the 8th pass, the hardness values increased by 230%. The rolling process was stopped at 8th cycle when cracking of the edge became pronounced

Critical state instability in Nb-clad MgB2 superconducting wires

International Nuclear Information System (INIS)

Beilin, V.; Felner, I.; Tsindlekht, M.I.; Dul'kin, E.; Mojaev, E.; Roth, M.

2008-01-01

Magnetization hysteresis loops of Cu/MgB 2 , Nb/MgB 2 , Cu/Nb/MgB 2 and Fe/Cu/MgB 2 wires in parallel magnetic fields of up to 5 T were studied in the temperature range from 5 to 35 K. All Nb-clad samples exhibited a thermomagnetic instability (TMI) in the form of magnetization jumps. In a thick wire (about 2 mm in core diameter), the TMI persisted up to the unexpectedly high temperature of 32 K. Thin wires showed low TMI which vanished at T > 10 K. Cu/MgB 2 wires which did not contain a Nb barrier, showed no signs of TMI. The TMI in thin wires exhibited good reproducibility and stability in the jump pattern (JP) (jump amplitudes and positions), while thick wires showed the worst time stability. We found that moderate flat rolling of the round unstable Cu/Nb/MgB 2 wire resulted in negligible TMI at 5 K in the processed flat tape. The TMI amplitudes of studied samples correlated with the adiabatic stability parameter, β -1

Feasibility study of an active soft catheter actuated by SMA wires

Science.gov (United States)

Konh, Bardia; Karimi, Saeed; Miller, Scott

2018-03-01

This study aims to assess the feasibility of using a combination of thin elastomer tubes and SMA wires to develop an active catheter. Cardiac catheters have been widely used in investigational and interventional procedures such as angiography, angioplasty, electro- physiology, and endocardial ablation. The commercial models manually steer inside the patient's body via internally installed pull wires. Active catheters, on the other hand, have the potential to revolutionize surgical procedures because of their computer-controlled and enhanced motion. Shape memory alloys have been used for almost a decade as a trustworthy actuator for biomedical applications. In this work, SMA wires were attached to a small pressurized elastomer tube to realize deflection. The tube was pressurized to maintain a constant stress on the SMA wires. The tip motion via actuation of SMA wires was then measured and reported. The results of this study showed that by adopting an appropriate training process for the SMA wires prior to performing the experiments and adopting an appropriate internal pressure for the elastomer tube, less external loads on SMA wires would be needed for a consistent actuation.

STRENGTHENING OF A REINFORCED CONCRETE BRIDGE WITH PRESTRESSED STEEL WIRE ROPES

Directory of Open Access Journals (Sweden)

Kexin Zhang

2017-10-01

Full Text Available This paper describes prestressed steel wire ropes as a way to strengthen a 20-year-old RC T-beam bridge. High strength, low relaxation steel wire ropes with minor radius, high tensile strain and good corrosion resistance were used in this reinforcement. The construction process for strengthening with prestressed steel wire ropes—including wire rope measuring, extruding anchor heads making, anchorage installing, tensioning steel wire ropes and pouring mortar was described. Ultimate bearing capacity of the bridge after strengthening was discussed based on the concrete structure theory. The flexural strength of RC T-beam bridges strengthened with prestressed steel wire ropes was governed by the failure of concrete crushing. To investigate effectiveness of the strengthening method, fielding-load tests were carried out before and after strengthening. The results of concrete strain and deflection show that the flexural strength and stiffness of the strengthened beam are improved. The crack width measurement also indicates that this technique could increase the durability of the bridge. Thus, this strengthened way with prestressed steel wire rope is feasible and effective.

High conductivity carbon nanotube wires from radial densification and ionic doping

Science.gov (United States)

Alvarenga, Jack; Jarosz, Paul R.; Schauerman, Chris M.; Moses, Brian T.; Landi, Brian J.; Cress, Cory D.; Raffaelle, Ryne P.

2010-11-01

Application of drawing dies to radially densify sheets of carbon nanotubes (CNTs) into bulk wires has shown the ability to control electrical conductivity and wire density. Simultaneous use of KAuBr4 doping solution, during wire drawing, has led to an electrical conductivity in the CNT wire of 1.3×106 S/m. Temperature-dependent electrical measurements show that conduction is dominated by fluctuation-assisted tunneling, and introduction of KAuBr4 significantly reduces the tunneling barrier between individual nanotubes. Ultimately, the concomitant doping and densification process leads to closer packed CNTs and a reduced charge transfer barrier, resulting in enhanced bulk electrical conductivity.

The diffusion bonding of advanced material

International Nuclear Information System (INIS)

Khan, T.I.

2001-01-01

As a joining process diffusion bonding has been used since early periods, and artifacts have been found which date back to 3000 years. However, over the last 20 years this joining process has been rediscovered and research has been carried out to understand the mechanisms of the process, and the application of the technique to advanced materials. This paper will review some of the reasons to why diffusion bonding may be preferred over other more conventional welding processes to join advanced alloy systems. It also describes in brief the different types of bonding processes, namely, solid-state and liquid phase bonding techniques. The paper demonstrates the application of diffusion bonding processes to join a range of dissimilar materials for instance: oxide dispersion strengthened superalloys, titanium to duplex stainless steels and engineering ceramics such as Si/sub 3/N/sub 4/ to metal alloys. The research work highlights the success and limitations of the diffusion bonding process and is based on the experience of the author and his colleagues. (author)

Investigation of residual stresses in thick-walled vessels with combination of autofrettage and wire-winding

International Nuclear Information System (INIS)

Sedighi, M.; Jabbari, A.H.

2013-01-01

Wire-winding and autofrettage processes can be used to introduce beneficial residual stress in the cylinder of thick-walled pressure vessels. In both techniques, internal residual compressive stress will increase internal pressure capacity, improve fatigue life and reduce fatigue crack initiation. The purpose of this paper is to analyze the effects of wire-winding on an autofrettaged thick-walled vessel. Direct method which is a modified Variable Material Properties (VMP) method has been used in order to calculate residual stresses in an autofrettaged vessel. Since wire-winding is done after autofrettage process, the tangent and/or Young's modulus could be changed. For this reason, a new wire-winding method based on Direct Method is introduced. The obtained results for wire-wound autofrettaged vessels are validated by finite element method. The results show that by using this approach, the residual hoop stresses in a wire-wound autofrettaged vessel have a more desirable distribution in the cylinder. -- Highlights: • Combination of autofrettage and wire-winding in pressure vessels has been presented. • A new method based on Direct method is presented for wire-winding process. • Residual hoop stresses are compared in vessels cylinders for different cases. • The residual hoop stress has a more desirable stress distribution. • The benefits of the combined vessel are highlighted in comparison with single cases

Numerical Simulation of Wire-Coating

DEFF Research Database (Denmark)

Wapperom, Peter; Hassager, Ole

1999-01-01

A finite element program has been used to analyze the wire-coating process of an MDPE melt. The melt is modeled by a nonisothermal Carreau model. The emphasis is on predicting an accurate temperature field. Therefore, it is necessary to include the heat conduction in the metal parts. A comparison...

Evolution of cementite morphology in pearlitic steel wire during wet wire drawing

International Nuclear Information System (INIS)

Zhang Xiaodan; Godfrey, Andrew; Hansen, Niels; Huang Xiaoxu; Liu Wei; Liu Qing

2010-01-01

The evolution of the cementite phase during wet wire drawing of a pearlitic steel wire has been followed as a function of strain. Particular attention has been given to a quantitative characterization of changes in the alignment and in the dimensions of the cementite phase. Scanning electron microscope observations show that cementite plates become increasingly aligned with the wire axis as the drawing strain is increased. Measurements in the transmission electron microscope show that the cementite deforms plastically during wire drawing , with the average thickness of the cementite plates decreasing from 19 nm (ε = 0) to 2 nm (ε = 3.7) in correspondence with the reduction in wire diameter. The deformation of the cementite is strongly related to plastic deformation in the ferrite, with coarse slip steps, shear bands and cracks in the cementite plates/particles observed parallel to either {110} α or {112} α slip plane traces in the ferrite.

Corrosion of Wires on Wooden Wire-Bound Packaging Crates

Science.gov (United States)

Samuel L. Zelinka; Stan Lebow

2015-01-01

Wire-bound packaging crates are used by the US Army to transport materials. Because these crates may be exposed to harsh environments, they are dip-treated with a wood preservative (biocide treatment). For many years, zinc-naphthenate was the most commonly used preservative for these packaging crates and few corrosion problems with the wires were observed. Recently,...

Nanopowder production by gas-embedded electrical explosion of wire

International Nuclear Information System (INIS)

Zou Xiao-Bing; Wang Xin-Xin; Jiang Wei-Hua; Mao Zhi-Guo

2013-01-01

A small electrical explosion of wire (EEW) setup for nanopowder production is constructed. It consists of a low inductance capacitor bank of 2 μF–4 μF typically charged to 8 kV−30 kV, a triggered gas switch, and a production chamber housing the exploding wire load and ambient gas. With the EEW device, nanosize powders of titanium oxides, titanium nitrides, copper oxides, and zinc oxides are successfully synthesized. The average particle size of synthesized powders under different experimental conditions is in a range of 20 nm−80 nm. The pressure of ambient gas or wire vapor can strongly affect the average particle size. The lower the pressure, the smaller the particle size is. For wire material with relatively high resistivity, such as titanium, whose deposited energy W d is often less than sublimation energy W s due to the flashover breakdown along the wire prematurely ending the Joule heating process, the synthesized particle size of titanium oxides or titanium nitrides increases with overheat coefficient k (k = W d /W s ) increasing. (physics of gases, plasmas, and electric discharges)

Nanopowder production by gas-embedded electrical explosion of wire

Institute of Scientific and Technical Information of China (English)

Zou Xiao-Bing; Mao Zhi-Guo; Wang Xin-Xin; Jiang Wei-Hua

2013-01-01

A small electrical explosion of wire (EEW) setup for nanopowder production is constructed.It consists of a low inductance capacitor bank of 2 μF--4 μF typically charged to 8 kV-30 kV,a triggered gas switch,and a production chamber housing the exploding wire load and ambient gas.With the EEW device,nanosize powders of titanium oxides,titanium nitrides,copper oxides,and zinc oxides are successfully synthesized.The average particle size of synthesized powders under different experimental conditions is in a range of 20 nm-80 nm.The pressure of ambient gas or wire vapor can strongly affect the average particle size.The lower the pressure,the smaller the particle size is.For wire material with relatively high resistivity,such as titanium,whose deposited energy Wd is often less than sublimation energy Ws due to the flashover breakdown along the wire prematurely ending the Joule heating process,the synthesized particle size of titanium oxides or titanium nitrides increases with overheat coefficient k (k =Wd/Ws) increasing.

Advances in second generation high temperature superconducting wire manufacturing and R and D at American Superconductor Corporation

Energy Technology Data Exchange (ETDEWEB)

Rupich, Martin W; Li Xiaoping; Thieme, Cees; Sathyamurthy, Srivatsan; Fleshler, Steven; Tucker, David; Thompson, Elliot; Schreiber, Jeff; Lynch, Joseph; Buczek, David; DeMoranville, Ken; Inch, James; Cedrone, Paul; Slack, James, E-mail: mrupich@amsc.co [American Superconductor Corporation, 64 Jackson Road, Devens, MA 01434-4020 (United States)

2010-01-15

The RABiTS(TM)/MOD-YBCO (rolling assisted biaxially textured substrate/metal-organic deposition of YBa{sub 2}Cu{sub 3}O{sub 7-{delta}}) route has been established as a low-cost manufacturing process for producing high performance second generation (2G) wire. American Superconductor Corporation (AMSC) has used this approach to establish a production scale manufacturing line based on a wide-web manufacturing process. This initial production line is currently capable of producing 2G wire in lengths to 500 m with critical currents exceeding 250 A cm{sub width}{sup -1} at 77 K, in the self-field. The wide-web process, combined with slitting and lamination processes, allows customization of the 2G wire width and stabilizer composition to meet application specific wire requirements. The production line is currently supplying 2G wire for multiple cable, fault current limiter and coil applications. Ongoing R and D is focused on the development of thicker YBCO layers and improved flux pinning centers. This paper reviews the history of 2G wire development at AMSC, summarizes the current capability of the 2G wire manufacturing at AMSC, and describes future R and D improvements.

Evidence for length-dependent wire expansion, filament dedensification and consequent degradation of critical current density in Ag-alloy sheathed Bi-2212 wires

International Nuclear Information System (INIS)

Malagoli, A; Lee, P J; Jiang, J; Trociewitz, U P; Hellstrom, E E; Larbalestier, D C; Ghosh, A K; Scheuerlein, C; Di Michiel, M

2013-01-01

It is well known that longer Bi-2212 conductors have significantly lower critical current density (J c ) than shorter ones, and recently it has become clear that a major cause of this reduction is internal gas pressure generated during heat treatment, which expands the wire diameter and dedensifies the Bi-2212 filaments. Here we report on the length-dependent expansion of 5–240 cm lengths of state-of-the-art, commercial Ag alloy sheathed Bi-2212 wire after full and some partial heat treatments. Detailed image analysis along the wire length shows that the wire diameter increases with distance from the ends, longer samples often showing evident damage and leaks provoked by the internal gas pressure. Comparison of heat treatments carried out just below the melting point and with the usual melt process makes it clear that melting is crucial to developing high internal pressure. The decay of J c away from the ends is directly correlated to the local wire diameter increase, which decreases the local Bi-2212 filament mass density and lowers J c , often by well over 50%. It is clear that control of the internal gas pressure is crucial to attaining the full J c of these very promising round wires and that the very variable properties of Bi-2212 wires are due to the fact that this internal gas pressure has so far not been well controlled. (paper)

Compressive and bending behavior of sandwich panels with Octet truss core fabricated from wires

International Nuclear Information System (INIS)

Lim, Ji Hyun; Nah, Seong Jun; Kang, Ki Ju; Koo, Man Hoe

2005-01-01

Ultra light metal structures have been studied for several years because of their superior specific stiffness, strength and potential of multi functions. Many studies have been focused on how to manufacture ultra light metal structures and optimize them. In this study, we introduced a new idea to make sandwich panels having Octet truss cores. Wires bent in a shape of triangular wave were assembled to construct an Octet truss core and it was bonded with two face sheets to be a sandwich panel. The bending and compressive strength and stiffness were estimated through elementary mechanics for the sandwich specimens with two kinds of face sheets and the results were compared with the ones measured by experiments. Some aspects of assembling and mechanical behavior were discussed compared with Kagome core fabricated from wire, which had been introduced in the authors' previous work

Wear behavior of Cu-Ag-Cr alloy wire under electrical sliding

International Nuclear Information System (INIS)

Jia, S.G.; Liu, P.; Ren, F.Z.; Tian, B.H.; Zheng, M.S.; Zhou, G.S.

2005-01-01

The wear behavior of a Cu-Ag-Cr alloy contact wire against a copper-base sintered alloy strip was investigated. Wear tests were conducted under laboratory conditions with a special sliding wear apparatus that simulated train motion under electrical current conditions. The initial microstructure of the Cu-Ag-Cr alloy contact wire was analyzed by transmission electron microscopy. Worn surfaces of the Cu-Ag-Cr alloy wire were analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray spectrometry (EDS). The results indicate that the wear rate of the Cu-Ag-Cr wire increased with increasing electrical current and sliding. Within the studied range of electrical current, the wear rate increases with increasing electrical current and sliding speed. Compared with the Cu-Ag contact wire under the same testing conditions, the Cu-Ag-Cr alloy wire has much better wear resistance. Adhesive, abrasive, and electrical erosion wear are the dominant mechanisms during the electrical sliding processes

Effect of Cold Drawing and Heat Treatment on the Microstructure of Invar36 Alloy Wire

International Nuclear Information System (INIS)

Han, Seung Youb; Jang, Seon Ah; Eun, Hee-Chul; Choi, Jung-Hoon; Lee, Ki Rak; Park, Hwan Seo; Ahn, Do-Hee; Kim, Soo Young; Kim, Jea Youl; Shin, Sang Yong

2016-01-01

In this study, the effect of cold drawing and heat treatment on the microstructure of Invar36 alloy wire was investigated. Invar36 alloy wire is used as a transmission line core material, and is required to have high strength. The diameter of the Invar36 alloy wire specimens were reduced from 16 mm to 4.3 mm after three cold drawing and two heat treatment processes, thereby increasing tensile strength. Specimens were taken after each of the cold drawing and heat treatment processes, and their microstructure and tensile properties were analyzed. The Invar36 alloy wire had a γ-(Fe, Ni) phase matrix before the cold drawing and heat treatment processes. After the cold drawing processes, {220} and {200} textures were mainly achieved. After the heat treatment processes, a {200} recrystallization γ-(Fe, Ni) phase was formed with fine carbides. The recrystallization γ-(Fe, Ni) phase grains had low dislocation density, so they probably accommodated a large amount of deformation during the cold drawing processes.

Effect of Cold Drawing and Heat Treatment on the Microstructure of Invar36 Alloy Wire

Energy Technology Data Exchange (ETDEWEB)

Han, Seung Youb; Jang, Seon Ah; Eun, Hee-Chul; Choi, Jung-Hoon; Lee, Ki Rak; Park, Hwan Seo; Ahn, Do-Hee [Korea Atomic Energy Research Institute, Daejeon (Korea, Republic of); Kim, Soo Young; Kim, Jea Youl [RandD Center, KOS Ltd., Yangsan (Korea, Republic of); Shin, Sang Yong [University of Ulsan, Ulsan (Korea, Republic of)

2016-10-15

In this study, the effect of cold drawing and heat treatment on the microstructure of Invar36 alloy wire was investigated. Invar36 alloy wire is used as a transmission line core material, and is required to have high strength. The diameter of the Invar36 alloy wire specimens were reduced from 16 mm to 4.3 mm after three cold drawing and two heat treatment processes, thereby increasing tensile strength. Specimens were taken after each of the cold drawing and heat treatment processes, and their microstructure and tensile properties were analyzed. The Invar36 alloy wire had a γ-(Fe, Ni) phase matrix before the cold drawing and heat treatment processes. After the cold drawing processes, {220} and {200} textures were mainly achieved. After the heat treatment processes, a {200} recrystallization γ-(Fe, Ni) phase was formed with fine carbides. The recrystallization γ-(Fe, Ni) phase grains had low dislocation density, so they probably accommodated a large amount of deformation during the cold drawing processes.

Investigation of surface treatment of conductive wire in cylindrical atmospheric pressure plasmas

International Nuclear Information System (INIS)

Ye Rubin; Kagohashi, Tsutomu; Zheng Wei

2009-01-01

Polyethylene insulated electric wire was treated in He and Ar dielectric barrier discharge atmospheric pressure plasmas generated in a quartz tube wound with tubular electrodes. The wire was put penetrating through the high voltage and the grounded electrodes, improving the discharge and facilitating uniform surface treatment. In this work, the influences of conductivity of the wire on the effects of surface treatment and discharge behavior were investigated. Surface properties of the wire samples were analyzed by means of surface energy measurement and X-ray photoelectron spectroscopy. In order to reveal the mechanism for treating the conductive wire, I-V discharge waveforms were measured and time-resolved plasma images were taken. It was demonstrated that the conductive wire was involved in the discharge process, reducing the breakdown voltage significantly and enhancing the discharge. It shows that the discharge mode was strongly dependent on the conductivity of a wire. Intensive surface discharges developed along the conductive wire were found to be mainly responsible for noticeable improvement in the treatment effect.

Shape of a clamped stiff harpsichord wire driven at a resonant frequency

Science.gov (United States)

Hanson, Roger J.; Macomber, Hilliard Kent; Boucher, Mathew A.

2002-05-01

A wire transversely driven by a sinusoidal force at the resonant frequency of a vibrational mode vibrates at the driving frequency and at harmonics generated by nonlinear processes in the wire. If the amplitude of a harmonic is measured as a function of position along the wire, its shape is revealed. It differs significantly from a sinusoid in the vicinity of either end of the wire because the ends are clamped and the wire has significant stiffness. The shapes of various harmonics have been determined for a brass harpsichord wire, 70 cm long, from optical detector measurements made at different distances from a clamped end. Knowledge of shape facilitates the determination of antinode amplitudes of harmonics when the gross motion of the wire is so large that the detectors must be positioned near an end of the wire because of their very limited dynamic range. Some observations of harmonics and related phenomena were reported previously [Hanson et al., J. Acoust Soc. Am. 108, 2592 (2000); 106, 2141 (1999)]. The shape information is also needed to help separate nonlinear effects possibly occurring in the detectors from those of interest, occurring in the wire itself.

Orthodontic bracket bonding to glazed full-contour zirconia

Directory of Open Access Journals (Sweden)

Ji-Young Kwak

2016-05-01

Full Text Available Objectives This study evaluated the effects of different surface conditioning methods on the bond strength of orthodontic brackets to glazed full-zirconia surfaces. Materials and Methods Glazed zirconia (except for the control, Zirkonzahn Prettau disc surfaces were pre-treated: PO (control, polishing; BR, bur roughening; PP, cleaning with a prophy cup and pumice; HF, hydrofluoric acid etching; AA, air abrasion with aluminum oxide; CJ, CoJet-Sand. The surfaces were examined using profilometry, scanning electron microscopy, and electron dispersive spectroscopy. A zirconia primer (Z-Prime Plus, Z or a silane primer (Monobond-S, S was then applied to the surfaces, yielding 7 groups (PO-Z, BR-Z, PP-S, HF-S, AA-S, AA-Z, and CJ-S. Metal bracket-bonded specimens were stored in water for 24 hr at 37℃, and thermocycled for 1,000 cycles. Their bond strengths were measured using the wire loop method (n = 10. Results Except for BR, the surface pre-treatments failed to expose the zirconia substructure. A significant difference in bond strengths was found between AA-Z (4.60 ± 1.08 MPa and all other groups (13.38 ± 2.57 - 15.78 ± 2.39 MPa, p < 0.05. For AA-Z, most of the adhesive remained on the bracket. Conclusions For bracket bonding to glazed zirconia, a simple application of silane to the cleaned surface is recommended. A zirconia primer should be used only when the zirconia substructure is definitely exposed.

New concepts and materials for the manufacturing of MR-compatible guide wires.

Science.gov (United States)

Brecher, Christian; Emonts, Michael; Brack, Alexander; Wasiak, Christian; Schütte, Adrian; Krämer, Nils; Bruhn, Robin

2014-04-01

This paper shows the development of a new magnetic resonance imaging (MRI)-compatible guide wire made from fiber-reinforced plastics. The basic material of the developed guide wire is manufactured using a specially developed micro-pullwinding technology, which allows the adjustment of tensile, bending, and torsional stiffness independent from each other. Additionally, the micro-pullwinding technology provides the possibility to vary the stiffness along the length of the guide wire in a continuous process. With the possibilities of this technology, the mechanical properties of the guide wire were precisely adjusted for the intended usage in MRI-guided interventions. The performance of the guide wire regarding the mechanical properties was investigated. It could be shown, that the mechanical properties could be changed independently from each other by varying the process parameters. Especially, the torsional stiffness could be significantly improved with only a minor influence on bending and tensile properties. The precise influence of the variation of the winding angle on the mechanical and geometrical properties has to be further investigated. The usability of the guide wire as well as its visibility in MRI was investigated by radiologists. With the micro-pullwinding technology, a continuous manufacturing technique for highly stressable, MRI-safe profiles is available and can be the trigger for a new class of medical devices.

Processing and Protection of Rare Earth Permanent Magnet Particulate for Bonded Magnet Applications

Energy Technology Data Exchange (ETDEWEB)

Sokolowski, Peter Kelly [Iowa State Univ., Ames, IA (United States)

2007-01-01

Rapid solidification of novel mixed rare earth-iron-boron, MRE₂Fe₁₄B (MRE = Nd, Y, Dy; currently), magnet alloys via high pressure gas atomization (HPGA) have produced similar properties and structures as closely related alloys produced by melt spinning (MS) at low wheel speeds. Recent additions of titanium carbide and zirconium to the permanent magnet (PM) alloy design in HPGA powder (using He atomization gas) have made it possible to achieve highly refined microstructures with magnetic properties approaching melt spun particulate at cooling rates of 10⁵-10⁶K/s. By producing HPGA powders with the desirable qualities of melt spun ribbon, the need for crushing ribbon was eliminated in bonded magnet fabrication. The spherical geometry of HPGA powders is more ideal for processing of bonded permanent magnets since higher loading fractions can be obtained during compression and injection molding. This increased volume loading of spherical PM powder can be predicted to yield a higher maximum energy product (BH)_max for bonded magnets in high performance applications. Passivation of RE-containing powder is warranted for the large-scale manufacturing of bonded magnets in applications with increased temperature and exposure to humidity. Irreversible magnetic losses due to oxidation and corrosion of particulates is a known drawback of RE-Fe-B based alloys during further processing, e.g. injection molding, as well as during use as a bonded magnet. To counteract these effects, a modified gas atomization chamber allowed for a novel approach to in situ passivation of solidified particle surfaces through injection of a reactive gas, nitrogen trifluoride (NF₃). The ability to control surface chemistry during atomization processing of fine spherical RE-Fe-B powders produced advantages over current processing methodologies. In particular, the capability to coat particles while 'in flight' may eliminate the

The influnece of the partial single reduction on mechanical properties wires made from trip steel with 0,43 % C

Directory of Open Access Journals (Sweden)

S. Wiewiórowska

2015-01-01

Full Text Available Large strain inhomogeneity is caused by the shape of deformation zone of die and by the friction between tool and deformed wire for multistage wire drawing processes. The influence on the value of the redundant strain by the use of different partial single reductions during all wire drawing process was observed. This problem is particularly important for TRIP steel wires drawing processes because the strain intensity influences on the speed of retained austenite transformation into martensite.

Fluxless Bonding Processes Using Silver-Indium System for High Temperature Electronics and Silver Flip-Chip Interconnect Technology

Science.gov (United States)

Wu, Yuan-Yun

In this dissertation, fluxless silver (Ag)-indium (In) binary system bonding and Ag solid-state bonding are used between different bonded pairs which have large thermal expansion coefficient (CTE) mismatch and flip-chip interconnect bonding application. In contrast to the conventional soldering process, fluxless bonding technique eliminates contamination and reliability problems caused by flux to fabricate high quality joints. There are two section are reported. In the first section, the reactions of Ag-In binary system are presented. In the second section, the high melting temperature, thermal and electrical conductivity joint materials bonding by either Ag-In binary system bonding or solid-state bonding processes for different bonded pairs and flip-chip application are designed, developed, and reported. Our group have studied Ag-In system for several years and developed the bonding processes successfully. However, the detailed reactions of Ag and In were seldom studied. To design a proper bonding structure, it is necessary to understand the reaction between Ag and In. The systematic experiments were performed to investigate these reactions. A 40 um Ag layer was electroplated on copper (Cu) substrates, followed by indium layers of 1, 3, 5, 10, and 15 um, respectively. The samples were annealed at 180 °C in 0.1 torr vacuum. For samples with In thickness less than 5 mum, the joint compositions are Ag2In only (1 um) or AgIn2, Ag2In, and Ag solid solution (Ag) after annealing. No indium is identified. For 10 and 15 um thick In samples, In covers almost over the entire sample surface after annealing. Later, an Ag layer was annealed at 450 °C for 3 hours to grow Ag grains, followed by plating 10 um In and annealing at 180 °C. By annealing Ag before plating In, more In is kept in the structure during annealing at 180 °C. Based on above results, for those designs with In thinner than 5 um, the Ag layer needs to be annealed, prior to In plating in order to make a

ONLINE TECHNOLOGICAL MONITORING OF INSULATION DEFECTS IN ENAMELED WIRES

Directory of Open Access Journals (Sweden)

V. M. Zolotaryov

2017-08-01

Full Text Available In this paper the authors used non-destructive technological monitoring of defects insulation enameled wire with poliimid polymer. The paper is devoted to the statistical method for processing, comparison and analysis of results of measurements of parameters of insulation of enameled wire because of mathematical model of trend for application in active technological monitoring is developed; the recommendations for parameters of such monitoring are used. It is theoretically justified and the possibility of determination of dependence of the error on the velocity of movement of a wire for want of quantifying of defects in enameled insulation by non-destructive tests by high voltage. The dependence of average value of amount of defects for enameled wire with two-sheeted poliimid insulation in a range of nominal diameter 0.56 mm is experimentally determined. The technological monitoring purpose is to reduce the quantifying defects of enameled insulation.

Effect of Bonding Pressure and Bonding Time on the Tensile Properties of Cu-Foam / Cu-Plate Diffusion Bonded Joint

International Nuclear Information System (INIS)

Kim, Sang-Ho; Heo, Hoe-Jun; Kang, Chung-Yun; Yoon, Tae-Jin

2016-01-01

Open cell Cu foam, which has been widely utilized in various industries because of its high thermal conductivity, lightweight and large surface area, was successfully joined with Cu plate by diffusion bonding. To prevent excessive deformation of the Cu foam during bonding process, the bonding pressure should be lower than 500 kPa at 800 ℃ for 60 min and bonding pressure should be lowered with increasing holding time. The bonding strength was evaluated by tensile tests. The tensile load of joints increased with the bonding pressure and holding time. In the case of higher bonding pressure or time, the bonded length at the interface was usually longer than the cross-sectional length of the foam, so fracture occurred at the foam. For the same reason, base metal (foam) fracture mainly occurred at the node-plate junction rather than in the strut-plate junction because the bonded surface area of the node was relatively larger than that of the strut.

Wire chambers: Trends and alternatives

Energy Technology Data Exchange (ETDEWEB)

Regler, Meinhard

1992-05-15

The subtitle of this year's Vienna Wire Chamber Conference - 'Recent Trends and Alternative Techniques' - signalled that it covered a wide range of science and technology. While an opening Vienna talk by wire chamber pioneer Georges Charpak many years ago began 'Les funerailles des chambres a fils (the burial of wire chambers)', the contrary feeling this year was that wire chambers are very much alive!.

Analysis of Different Positions of Fiber-Reinforced Composite Retainers versus Multistrand Wire Retainers Using the Finite Element Method

Directory of Open Access Journals (Sweden)

Arezoo Jahanbin

2014-01-01

Full Text Available Background. The aim of this study was to evaluate root displacement of the lower incisors fixed with FRC in different positions versus FSW retainers using the finite element method. Materials and Methods. 3D finite element models were designed for a mandibular anterior segment: Model 1: flexible spiral wire bonded to the lingual teeth surfaces, Model 2: FRC bonded to the upper third of lingual teeth surfaces, and Model 3: FRC bonded to the middle third. FE analysis was performed for three models and then tooth displacements were evaluated. Results. In contrast to lateral incisors and canines, the FSW retainer caused the central teeth to move more than the teeth bonded with FRC in both loadings. Comparison between Models 2 and 3 (in vertical loading showed that FRC retainers that bonded at the upper third of lingual teeth surfaces made central and canine teeth move less than FRC retainers bonded at the middle third; however, for lateral teeth it was the opposite. Conclusion. FRC retainers bonded at the upper third of lingual teeth surfaces make central and canine teeth move less than FRC retainers bonded at the middle third in vertical loading; however, for lateral teeth it was the opposite.

An evaluation of the electric arc spray and (HPPS) processes for the manufacturing of high power plasma spraying MCrAIY coatings

Science.gov (United States)

Sacriste, D.; Goubot, N.; Dhers, J.; Ducos, M.; Vardelle, A.

2001-06-01

The high power plasma torch (PlazJet) can be used to spray refractory ceramics with high spray rates and deposition efficiency. It can provide dense and hard coating with high bond strengths. When manufacturing thermal barrier coatings, the PlazJet gun is well adapted to spraying the ceramic top coat but not the MCrAIY materials that are used as bond coat. Arc spraying can compete with plasma spraying for metallic coatings since cored wires can be used to spray alloys and composites. In addition, the high production rate of arc spraying enables a significant decrease in coating cost. This paper discusses the performances of the PlazJet gun, and a twin-wire are spray system, and compares the properties and cost of MCrAIY coatings made with these two processes. For arc spraying, the use of air or nitrogen as atomizing gas is also investigated.

Development of high voltage lead wires using electron beam irradiation

International Nuclear Information System (INIS)

Bae Hunjai; Sohn Hosoung; Choi Dongjung

1995-01-01

It is known to those skilled to the art that the electric wires used in high voltage operating electric equipments such as TV sets, microwave ovens, duplicators and etc., have such a structure that a conductor is coated with an insulating layer which is encapsulated with a protecting jacket layer. The electric wire specification such as UL and CSA requires superior cut-through property and flame-retardant property of the wire for utilization safety. The cut-through property of insulation material, for example, high density polyethylene, can be increased by crosslinking of the polymer. Also the flame-retardant property of jacket material which protects the flammable inner insulation can be raised by flame-retardant formulating of the material. In the wire and cable industry, crosslinking by electron beam processing is more effective than that by chemical processing in the viewpoint of through-put rate of the products. The jacket layer of the wire plays the role of protecting the insulation material from burning. The protecting ability of the jacket is related to its inherent flammability and formability of swollen carbonated layer when burned. Crosslinking of the material gives a good formability of swollen carbonated layer, and it protects the insulation material from direct flame. In formulating the flame-retardant jacket material, a crosslinking system must be considered with base polymers and other flame-retardant additives. (Author)

Development of high voltage lead wires using electron beam irradiation

International Nuclear Information System (INIS)

Bae Hunjai; Sohn Hosoung; Choi Dongjung

1995-01-01

It is known to those skilled to the art that the electric wires used in high voltage operating electric equipment such as TV sets, microwave ovens, duplicators etc., have such a structure that a conductor is coated with an insulating layer which is encapsulated with a protecting jacket layer. The electric wire specification such as UL and CSA requires superior cut-through and flame-retardant property of the wire for utilization safety. The cut-through property of insulation material, for example, high density polyethylene, can be increased by crosslinking of the polymer. Also the flame-retardant property of jacket material which protects the flammable inner insulation can be raised by flame-retardant formulating of the material. In the wire and cable industry, crosslinking by electron beam processing is more effective than that by chemical processing in the viewpoint of through-put rate of the products. The jacket layer of the wire plays the role of protecting the insulation material from burning. The protecting ability of the jacket is related to its inherent flammability and formability of swollen carbonated layer when burned. Crosslinking of the material gives a good formability of swollen carbonated layer, and it protects the insulation material from direct flame. In formulating the flame-retardant jacket material, a crosslinking system must be considered with base polymers and other flame-retardant additives. (Author)

Development of an Indium Bump Bond Process for Silicon Pixel Detectors at PSI

CERN Document Server

Brönnimann, C; Gobrecht, J; Heising, S; Horisberger, M; Horisberger, R P; Kästli, H C; Lehmann, J; Rohe, T; Streuli, S; Broennimann, Ch.

2006-01-01

The hybrid pixel detectors used in the high energy physics experiments currently under construction use a three dimensional connection technique, the so-called bump bonding. As the pitch below 100um, required in these applications, cannot be fullfilled with standard industrial processes (e.g. the IBM C4 process), an in-house bump bond process using reflown indium bumps was developed at PSI as part of the R&D for the CMS-pixel detector. The bump deposition on the sensor is performed in two subsequent lift-off steps. As the first photolithographic step a thin under bump metalization (UBM) is sputtered onto bump pads. It is wettable by indium and defines the diameter of the bump. The indium is evaporated via a second photolithographic step with larger openings and is reflown afterwards. The height of the balls is defined by the volume of the indium. On the readout chip only one photolithographic step is carried out to deposit the UBM and a thin indium layer for better adhesion. After mating both parts a seco...

Experimental study on titanium wire drawing with ultrasonic vibration.

Science.gov (United States)

Liu, Shen; Shan, Xiaobiao; Guo, Kai; Yang, Yuancai; Xie, Tao

2018-02-01

Titanium and its alloys have been widely used in aerospace and biomedical industries, however, they are classified as difficult-to-machine materials. In this paper, ultrasonic vibration is imposed on the die to overcome the difficulties during conventional titanium wire drawing processes at the room temperature. Numerical simulations were performed to investigate the variation of axial stress within the contacting region and study the change of the drawing stress with several factors in terms of the longitudinal amplitude and frequency of the applied ultrasonic vibration, the diameter reduction ratio, and the drawing force. An experimental testing equipment was established to measure the drawing torque and rotational velocity of the coiler drum during the wire drawing process. The result indicates the drawing force increases with the growth of the drawing velocity and the reduction ratio, whether with or without vibrations. Application of either form of ultrasonic vibrations contributes to the further decrease of the drawing force, especially the longitudinal vibration with larger amplitude. SEM was employed to detect the surface morphology of the processed wires drawn under the three circumstances. The surface quality of the drawn wires with ultrasonic vibrations was apparently improved compared with those using conventional method. In addition, the longitudinal and torsional composite vibration was more effective for surface quality improvement than pure longitudinal vibration, however, at the cost of weakened drawing force reduction effect. Copyright © 2017 Elsevier B.V. All rights reserved.

Low-temperature bonding process for the fabrication of hybrid glass-membrane organ-on-a-chip devices

Science.gov (United States)

Pocock, Kyall J.; Gao, Xiaofang; Wang, Chenxi; Priest, Craig; Prestidge, Clive A.; Mawatari, Kazuma; Kitamori, Takehiko; Thierry, Benjamin

2016-10-01

The integration of microfluidics with living biological systems has paved the way to the exciting concept of "organs-on-a-chip," which aims at the development of advanced in vitro models that replicate the key features of human organs. Glass-based devices have long been utilized in the field of microfluidics but the integration of alternative functional elements within multilayered glass microdevices, such as polymeric membranes, remains a challenge. To this end, we have extended a previously reported approach for the low-temperature bonding of glass devices that enables the integration of a functional polycarbonate porous membrane. The process was initially developed and optimized on specialty low-temperature bonding equipment (μTAS2001, Bondtech, Japan) and subsequently adapted to more widely accessible hot embosser units (EVG520HE Hot Embosser, EVG, Austria). The key aspect of this method is the use of low temperatures compatible with polymeric membranes. Compared to borosilicate glass bonding (650°C) and quartz/fused silica bonding (1050°C) processes, this method maintains the integrity and functionality of the membrane (Tg 150°C for polycarbonate). Leak tests performed showed no damage or loss of integrity of the membrane for up to 150 h, indicating sufficient bond strength for long-term cell culture. A feasibility study confirmed the growth of dense and functional monolayers of Caco-2 cells within 5 days.

Review of wire chamber aging

International Nuclear Information System (INIS)

Va'Vra, J.

1986-02-01

This paper makes an overview of the wire chamber aging problems as a function of various chamber design parameters. It emphasizes the chemistry point of view and many examples are drawn from the plasma chemistry field as a guidance for a possible effort in the wire chamber field. The paper emphasizes the necessity of variable tuning, the importance of purity of the wire chamber environment, as well as it provides a practical list of presently known recommendations. In addition, several models of the wire chamber aging are qualitatively discussed. The paper is based on a summary talk given at the Wire Chamber Aging Workshop held at LBL, Berkeley on January 16-17, 1986. Presented also at Wire Chamber Conference, Vienna, February 25-28, 1986. 74 refs., 18 figs., 11 tabs

Feasibility studies on the direct wire readout on wire scanners in electron accelerators; Durchfuehrbarkeitsstudien zur direkten Drahtauslese an Wirescannern in Elektronen-Beschleunigern

Energy Technology Data Exchange (ETDEWEB)

Markert, Michael

2010-10-15

This bachelor thesis deals essentially with the signal processing of a so-called wire scanner, a special monitor, which comes to application in the beam diagnostics of particle accelerators. In this direct wire readout the voltage signal, which is induced by the particle beam in the measurement wire of the wire scanner, shall be directly read out. The aim of this thesis is to show fundamental considerations and perform studies, which study, whether and how in the future by means of a suited data transmission as well as readout electronics conclusion on the most important parameters of the beam, like position and profile, are possible. The measurement system presented here is divided in three main components: Signal measurement, signal preparation, and signal stretching. A suited test facility was developed and is presented in detail, in which then all components, like for instance the transmission cables, the wire-scanner fork, and the developed measurement circuit, are studied, which are of importance for a faultless signal transmission and presentation. Extensive measurements on the single components, as well as calculations for the signal transmission on and in the wire scanner were performed, whereby a good agreement could be found. Thereafter a comparison and a selection of the component used in this project were made. Furthermore improvement proposals, new constructions, and outlooks are presented, which could be of importance in further works.

Wire chambers: Trends and alternatives

International Nuclear Information System (INIS)

Regler, Meinhard

1992-01-01

The subtitle of this year's Vienna Wire Chamber Conference - 'Recent Trends and Alternative Techniques' - signalled that it covered a wide range of science and technology. While an opening Vienna talk by wire chamber pioneer Georges Charpak many years ago began 'Les funerailles des chambres a fils (the burial of wire chambers)', the contrary feeling this year was that wire chambers are very much alive!

Vibrating wire for beam profile scanning

Directory of Open Access Journals (Sweden)

S. G. Arutunian

1999-12-01

Full Text Available A method that measures the transverse profile (emittance of the bunch by detecting radiation arising at the scattering of the bunch on scanning wire is widely used. In this work information about bunch scattering is obtained by measuring the oscillation frequency of the tightened scanning wire. In such a way, the system of radiation (or secondary particles extraction and measurement can be removed. The entire unit consists of a compact fork with tightened wire and a scanning system. Normal oscillation frequency of a wire depends on wire tension, its geometric parameters, and, in a second approximation, its elastic characteristics. Normal oscillations are generated by interaction of an alternating current through the wire with magnetic field of a permanent magnet. In this case, it is suggested that the magnetic field of the accelerator (field of dipole magnets or quadrupole magnets be used for excitation of oscillations. The dependence of oscillation frequency on beam scattering is determined by several factors, including changes of wire tension caused by transverse force of the beam and influence of beam self-field. Preliminary calculations show that the influence of wire heating will dominate. We have studied strain gauges on the basis of vibrating wire from various materials (tungsten, beryl bronze, and niobium zirconium alloys. A scheme of normal oscillation generation by alternating current in autogeneration circuit with automatic frequency adjustment was selected. A special method of wire fixation and elimination of transverse degrees of freedom allows us to achieve relative stability better than 10^{-5} during several days at a relative resolution of 10^{-6}. Experimental results and estimates of wire heating of existing scanners show that the wire heats up to a few hundred grades, which is enough for measurements. The usage of wire of micrometer thickness diminishes the problem of wire thermalization speed during the scanning of the bunch.

Charpak hemispherical wire chamber

CERN Multimedia

1970-01-01

pieces. Mesures are of the largest one. Multi-wire detectors contain layers of positively and negatively charged wires enclosed in a chamber full of gas. A charged particle passing through the chamber knocks negatively charged electrons out of atoms in the gas, leaving behind positive ions. The electrons are pulled towards the positively charged wires. They collide with other atoms on the way, producing an avalanche of electrons and ions. The movement of these electrons and ions induces an electric pulse in the wires which is collected by fast electronics. The size of the pulse is proportional to the energy loss of the original particle.

The impact of processing parameters on the properties of Zn-bonded Nd-Fe-B magnets

Science.gov (United States)

Kelhar, Luka; Zavašnik, Janez; McGuiness, Paul; Kobe, Spomenka

2016-12-01

We report on the effect of loading factor and pressure on the density and the magnetic properties of Zn-bonded Nd-Fe-B magnets produced by pulsed-electric-current sintering (PECS). The idea behind this study is to fabricate bonded magnets with a metallic binder in order for the bonded magnet to operate at temperatures higher than 180 °C: the current upper-limit for polymer-bonded magnets. These composites are made of hard-magnetic powder in the form of melt-spun ribbons bonded with the low-melting-point metal Zn. The binder additions were varied from 10 to 30 wt%, and pressures of 50 and 500 MPa were applied. The high-pressure mode with 20 wt% Zn resulted in a 24% increase of Jr, compared to the low-pressure mode. The magnetic measurements revealed a maximum remanence of 0.64 T for 10 wt% Zn, while the coercivity is largely unaffected by the processing conditions. The density of the composites was up to 7.0 g/cm3, corresponding to 94% of the theoretical density. Compared to commercial polymer-bonded magnets, the Zn-bonded counterparts exhibit a slightly lower Jr, but the coercivity is retained. We show that there is a minor diffusion of Zn into the Nd-Fe-B, forming a 1 μm thin transition layer, but it does not harm the magnetic properties. These metal-bonded Nd-Fe-B magnets are ideal for use in high-temperature automotive applications like under-the-hood sensors and other magnet-based devices that are close to the engine.

Electrodeposition of nickel nano wire arrays

International Nuclear Information System (INIS)

Nur Ubaidah Saidin; Kok Kuan Ying; Ng Inn Khuan; Nurazila Mat Zali; Siti Salwa Zainal Abidin

2010-01-01

Synthesis, characterization and assembly of one-dimensional nickel nano wires prepared by template directed electrodeposition are discussed in this paper. Parallel arrays of high aspect ratio nickel nano wires were electrodeposited using electrolytes with different cations and pH. The nano wires were characterized using X-ray diffractometry and scanning electron microscopy. It was found that the orientations of the electro deposited Ni nano wires were governed by the deposition current and the electrolyte conditions. Free standing nickel nano wires can be obtained by dissolving the template. Due to the magnetic nature of the nano wires, magnetic alignment was employed to assemble and position the free standing nano wires in the device structure. (author)

Wire-number effects on high-power annular z-pinches and some characteristics at high wire number

Energy Technology Data Exchange (ETDEWEB)

SANFORD,THOMAS W. L.

2000-05-23

Characteristics of annular wire-array z-pinches as a function of wire number and at high wire number are reviewed. The data, taken primarily using aluminum wires on Saturn are comprehensive. The experiments have provided important insights into the features of wire-array dynamics critical for high x-ray power generation, and have initiated a renaissance in z-pinches when high numbers of wires are used. In this regime, for example, radiation environments characteristic of those encountered during the early pulses required for indirect-drive ICF ignition on the NIF have been produced in hohlraums driven by x-rays from a z-pinch, and are commented on here.

Wire-number effects on high-power annular z-pinches and some characteristics at high wire number

International Nuclear Information System (INIS)

SANFORD, THOMAS W. L.

2000-01-01

Characteristics of annular wire-array z-pinches as a function of wire number and at high wire number are reviewed. The data, taken primarily using aluminum wires on Saturn are comprehensive. The experiments have provided important insights into the features of wire-array dynamics critical for high x-ray power generation, and have initiated a renaissance in z-pinches when high numbers of wires are used. In this regime, for example, radiation environments characteristic of those encountered during the early pulses required for indirect-drive ICF ignition on the NIF have been produced in hohlraums driven by x-rays from a z-pinch, and are commented on here

Control of core structure in MgB{sub 2} wire through tailoring boron powder

Energy Technology Data Exchange (ETDEWEB)

Maeda, Minoru, E-mail: maeda.minoru70@nihon-u.ac.jp [Department of Physics, College of Science and Technology, Nihon University, 1-8-14 Kanda-Surugadai, Chiyoda-ku, Tokyo 101-8308 (Japan); Uchiyama, Daisuke [Department of Physics, College of Science and Technology, Nihon University, 1-8-14 Kanda-Surugadai, Chiyoda-ku, Tokyo 101-8308 (Japan); Hossain, Md Shahriar Al; Ma, Zongqing [Institute for Superconducting and Electronic Materials, University of Wollongong, North Wollongong, New South Wales 2500 (Australia); Shahabuddin, Mohammed [Department of Physics and Astronomy, College of Science, King Saud University, P.O. Box 2455, Riyadh 11451 (Saudi Arabia); Kim, Jung Ho, E-mail: jhk@uow.edu.au [Institute for Superconducting and Electronic Materials, University of Wollongong, North Wollongong, New South Wales 2500 (Australia)

2015-07-05

Highlights: • The typical void structure in the wire is obtained by using large-sized B powder. • In contrast, void alignment can be achieved by using fine B powder. • The sintering at lower temperatures improves the critical current density in fields. - Abstract: A common fabrication process for MgB{sub 2} wire, namely, the in situ powder-in-tube process, forms numerous voids within the wire core, and void formation cannot be completely avoided. The orientation is, however, known to be aligned more or less along the current-flow direction when ductile coarse magnesium powder is used as a precursor, and further tailoring approaches could open up the way to improving the transport critical current density. Herein, we have used boron powders with different particle sizes, in combination with the coarse magnesium powder, and evaluated their size effects on the phase composition, microstructure, and transport properties. A mixture of the coarse magnesium powder with large-sized boron powder in the wire core, after cold working and sintering, forms a granular morphology. In contrast, an aligned core appears during the reduction process for wire which is prepared by using fine boron powder. The sintering process, especially at a low temperature, where magnesium evaporation hardly occurs, yields an aligned structure, mainly consisting of MgB{sub 2} phase, along the wire direction. These findings demonstrate that the initial size of the starting materials is critical for the tailored structure.

Diagnostics for exploding wires (abstract)

International Nuclear Information System (INIS)

Moosman, B.; Bystritskii, V.; Wessel, F.J.; Van Drie, A.

1999-01-01

Two diagnostics, capable of imaging fast, high temperature, plasmas were used on exploding wire experiments at UC Irvine. An atmospheric pressure nitrogen laser (λ=337.1 nm) was used to generate simultaneous shadow and shearing interferogram images with a temporal resolution of ∼1 ns and a spatial resolution of 10 μm. An x-ray backlighter imaged the exploding wire 90 degree with respect to the laser and at approximately the same instant in time. The backlighter spatial resolution as determined by geometry and film resolution was 25 μm. Copper wires of diameters (25, 50, and 100 μm) and steel wire d=25 μm were exploded in vacuum (10 -5 Torr) at a maximum current level of 12 kA, by a rectified marx bank at a voltage of 50 kV and a current rise time (quarter period) of 900 ns. Copper wires which were cleaned and then resistively heated under vacuum to incandescence for several hours prior to high current initiation, exhibited greater expansion velocities at peak current than wires which had not been heated prior to discharge. Axial variations on the surface of the wire observed with the laser were found to correlate with bulk axial mass differences from x-ray backlighting. High electron density, measured near the opaque surface of the exploding wire, suggests that much of the current is shunted outward away from the bulk of the wire. copyright 1999 American Institute of Physics

Development of 'low activation superconducting wire' for an advanced fusion reactor

International Nuclear Information System (INIS)

Hishinuma, Y.; Yamada, S.; Sagara, A.; Kikuchi, A.; Takeuchi, T.; Matsuda, K.; Taniguchi, H.

2011-01-01

In the D-T burning plasma reactor beyond ITER such as DEMO and fusion power plants assuming the steady-state and long time operation, it will be necessary to consider carefully induced radioactivity and neutron irradiation properties on the all components for fusion reactors. The decay time of the induced radioactivity can control the schedule and scenarios of the maintenance and shutdown on the fusion reactor. V 3 Ga and MgB 2 compound have shorter decay time within 1 years and they will be desirable as a candidate material to realize 'low activation and high magnetic field superconducting magnet' for advanced fusion reactor. However, it is well known that J c -B properties of V 3 Ga and MgB 2 wires are lower than that of the Nb-based A15 compound wires, so the J c -B enhancements on the V 3 Ga and MgB 2 wires are required in order to apply for an advanced fusion reactor. We approached and succeeded to developing the new process in order to improve J c properties of V 3 Ga and MgB 2 wires. In this paper, the recent activities for the J c improvements and detailed new process in V 3 Ga and MgB 2 wires are investigated. (author)

Self-Catalyzed CdTe Wires

Directory of Open Access Journals (Sweden)

Tom Baines

2018-04-01

Full Text Available CdTe wires have been fabricated via a catalyst free method using the industrially scalable physical vapor deposition technique close space sublimation. Wire growth was shown to be highly dependent on surface roughness and deposition pressure, with only low roughness surfaces being capable of producing wires. Growth of wires is highly (111 oriented and is inferred to occur via a vapor-solid-solid growth mechanism, wherein a CdTe seed particle acts to template the growth. Such seed particles are visible as wire caps and have been characterized via energy dispersive X-ray analysis to establish they are single phase CdTe, hence validating the self-catalysation route. Cathodoluminescence analysis demonstrates that CdTe wires exhibited a much lower level of recombination when compared to a planar CdTe film, which is highly beneficial for semiconductor applications.

Stress-strain effects on powder-in-tube MgB2 tapes and wires

International Nuclear Information System (INIS)

Katagiri, Kazumune; Takaya, Ryuya; Kasaba, Koichi; Tachikawa, Kyoji; Yamada, Yutaka; Shimura, Satoshi; Koshizuka, Naoki; Watanabe, Kazuo

2005-01-01

The effects of stress-strain on the critical current, I c , of ex situ powder-in-tube (PIT)-processed Ni-sheathed MgB 2 tapes and round wires as well as in situ PIT-processed Cu-sheathed wires at 4.2 K in a magnetic field up to 5 T have been studied. The effect of In powder addition on the Ni-sheathed MgB 2 wire was not so clear compared with that in the tape, in which the irreversible strain, ε irr , for the I c degradation onset increases significantly by the addition. This is attributed to the difference in the microstructure of the core associated with cold workings. A peak and gradual degradation behaviour of I c with strain beyond ε irr was found in the wire, whereas no evident peak and a steep degradation behaviour was found in the tape. As a possible reason, the difference in the triaxial residual stress state at 4.2 K due to the difference in geometry of the cross-section is suspected. The transverse compression tests revealed that I c of the wire did not degrade up to 270 MPa. Again, the effect of In addition was minimal. The Young's modulus of MgB 2 , 31-41 GPa, at room temperature was estimated by a tensile test of Cu sheath wire using a high-accuracy extensometer and the law of mixtures. The tensile strain dependence of I c in the Cu sheath wire was similar to that in the Ni-sheathed wire, ε irr being 0.4%. However, the stress corresponding to ε irr , 50 MPa, was about 1/10 of that for the Ni-sheath wire and the irreversible transverse compressive stress, 150 MPa, was also lower. The effect of bending strain on the I c in Cu-sheathed wire was compared with that of the tensile strain

Practical wiring in SI units

CERN Document Server

Miller, Henry A

2013-01-01

Practical Wiring, Volume 1 is a 13-chapter book that first describes some of the common hand tools used in connection with sheathed wiring. Subsequent chapters discuss the safety in wiring, cables, conductor terminations, insulating sheathed wiring, conductor sizes, and consumer's control equipments. Other chapters center on socket outlets, plugs, lighting subcircuits, lighting accessories, bells, and primary and secondary cells. This book will be very valuable to students involved in this field of interest.

Wire EDM for Refractory Materials

Science.gov (United States)

Zellars, G. R.; Harris, F. E.; Lowell, C. E.; Pollman, W. M.; Rys, V. J.; Wills, R. J.

1982-01-01

In an attempt to reduce fabrication time and costs, Wire Electrical Discharge Machine (Wire EDM) method was investigated as tool for fabricating matched blade roots and disk slots. Eight high-strength nickel-base superalloys were used. Computer-controlled Wire EDM technique provided high quality surfaces with excellent dimensional tolerances. Wire EDM method offers potential for substantial reductions in fabrication costs for "hard to machine" alloys and electrically conductive materials in specific high-precision applications.

Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu-Cu Thermocompression Bonding Using Stress Engineering

Science.gov (United States)

Panigrahi, Asisa Kumar; Ghosh, Tamal; Kumar, C. Hemanth; Singh, Shiv Govind; Vanjari, Siva Rama Krishna

2018-03-01

Diffusion of atoms across the boundary between two bonding layers is the key for achieving excellent thermocompression Wafer on Wafer bonding. In this paper, we demonstrate a novel mechanism to increase the diffusion across the bonding interface and also shows the CMOS in-line process flow compatible Sub 100 °C Cu-Cu bonding which is devoid of Cu surface treatment prior to bonding. The stress in sputtered Cu thin films was engineered by adjusting the Argon in-let pressure in such a way that one film had a compressive stress while the other film had tensile stress. Due to this stress gradient, a nominal pressure (2 kN) and temperature (75 °C) was enough to achieve a good quality thermocompression bonding having a bond strength of 149 MPa and very low specific contact resistance of 1.5 × 10-8 Ω-cm2. These excellent mechanical and electrical properties are resultant of a high quality Cu-Cu bonding having grain growth between the Cu films across the boundary and extended throughout the bonded region as revealed by Cross-sectional Transmission Electron Microscopy. In addition, reliability assessment of Cu-Cu bonding with stress engineering was demonstrated using multiple current stressing and temperature cycling test, suggests excellent reliable bonding without electrical performance degradation.

Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu-Cu Thermocompression Bonding Using Stress Engineering

Science.gov (United States)

Panigrahi, Asisa Kumar; Ghosh, Tamal; Kumar, C. Hemanth; Singh, Shiv Govind; Vanjari, Siva Rama Krishna

2018-05-01

Diffusion of atoms across the boundary between two bonding layers is the key for achieving excellent thermocompression Wafer on Wafer bonding. In this paper, we demonstrate a novel mechanism to increase the diffusion across the bonding interface and also shows the CMOS in-line process flow compatible Sub 100 °C Cu-Cu bonding which is devoid of Cu surface treatment prior to bonding. The stress in sputtered Cu thin films was engineered by adjusting the Argon in-let pressure in such a way that one film had a compressive stress while the other film had tensile stress. Due to this stress gradient, a nominal pressure (2 kN) and temperature (75 °C) was enough to achieve a good quality thermocompression bonding having a bond strength of 149 MPa and very low specific contact resistance of 1.5 × 10-8 Ω-cm2. These excellent mechanical and electrical properties are resultant of a high quality Cu-Cu bonding having grain growth between the Cu films across the boundary and extended throughout the bonded region as revealed by Cross-sectional Transmission Electron Microscopy. In addition, reliability assessment of Cu-Cu bonding with stress engineering was demonstrated using multiple current stressing and temperature cycling test, suggests excellent reliable bonding without electrical performance degradation.

Audio wiring guide how to wire the most popular audio and video connectors

CERN Document Server

Hechtman, John

2012-01-01

Whether you're a pro or an amateur, a musician or into multimedia, you can't afford to guess about audio wiring. The Audio Wiring Guide is a comprehensive, easy-to-use guide that explains exactly what you need to know. No matter the size of your wiring project or installation, this handy tool provides you with the essential information you need and the techniques to use it. Using The Audio Wiring Guide is like having an expert at your side. By following the clear, step-by-step directions, you can do professional-level work at a fraction of the cost.

Observation of fast expansion velocity with insulating tungsten wires on ∼80 kA facility

Energy Technology Data Exchange (ETDEWEB)

Li, M.; Li, Y. [State Key Laboratory of Electrical Insulation and Power Equipment, Xi' an Jiaotong University, Xi' an 710049 (China); State Key Laboratory of Intense Pulsed Radiation Simulation and Effect, Northwest Institute of Nuclear Technology, Xi' an 710024 (China); Zhang, J. H.; Sun, T. P.; Wang, L. P.; Sheng, L.; Qiu, M. T.; Mao, W. T. [State Key Laboratory of Intense Pulsed Radiation Simulation and Effect, Northwest Institute of Nuclear Technology, Xi' an 710024 (China); Wu, J., E-mail: jxjawj@mail.xjtu.edu.cn; Li, X. W. [State Key Laboratory of Electrical Insulation and Power Equipment, Xi' an Jiaotong University, Xi' an 710049 (China)

2016-07-15

This paper presents experimental results on the effects of insulating coatings on tungsten planar wire array Z-pinches on an 80 kA, 100 ns current facility. Expansion velocity is obviously increased from ∼0.25 km/s to ∼3.5 km/s by using the insulating coatings. It can be inferred that the wire cores are in gaseous state with this fast expansion velocity. An optical framing camera and laser probing images show that the standard wire arrays have typical ablation process which is similar to their behaviors on mega-ampere facilities. The ablation process and precursor plasma are suppressed for dielectric tungsten wires. The wire array implosion might be improved if these phenomena can be reproduced on Mega-ampere facilities.

Low temperature annealing of cold-drawn pearlitic steel wire

DEFF Research Database (Denmark)

Zhang, Xiaodan; Bech, Jakob Ilsted; Hansen, Niels

2015-01-01

Cold-drawn pearlitic steel wires are nanostructured and the flow stress at room temperature can reach values above 6 GPa. A typical characteristic of the nanostructured metals, is the low ductility and thermal stability. In order to optimize both the processing and application of the wires......, the thermal behaviour is of interest. This has been studied by annealing the wires for 1h at temperatures from ambient temperature to 300 ℃ (573 K). It is expected that a raising temperature may lead to structural changes and a reduction in strength. The change in strength is however not expected to be large....... For this reason we have applied a very precise technique to measure the tensile properties of the wires from a strain of 10-4 to the maximum strain of about 1-2%. The structural changes have also been followed to estimate and relate strength changes to changes in structural parameters and morphology....

K-wire and tension band wire fixation in treating sternoclavicular joint dislocation

Directory of Open Access Journals (Sweden)

CHEN Qing-yu

2011-02-01

Full Text Available 【Abstract】Objective: To evaluate the feasibility and therapeutic effect of treating sternoclavicular joint dislocation by K-wire and tension band wire fixation, and to improve the safety and stability of this technique. Methods: This study consisted of 9 cases, 6 males and 3 females with the mean age of 25 years (range, 9-62 years. The causes were traffic accident in 7 cases, falling in 1 case and fight in 1 case. The duration from injury to operation was 2 hours to 7 days. There were 5 left dislocations and 4 right dislocations; 8 anterior dislocations and 1 posterior dislocation, including one combined with left scapular fracture and one with left olecranon fracture. Open reduction and internal fixation using K-wires and tension band wires were performed to treat dislocations. Results: All patients were followed up for 6 to 24 months, 10 months on average. According to Rockwood’s rating scale on postoperative sternoclavicular joint, 8 cases achieved excellent outcomes with an average score of 13.88, and the rest case achieved a good outcome with the score of 12. Anatomical reduction was obtained in all cases. There were no such postoperative complications as severe infection, injury to blood vessel and nerve, failure of fixation, etc. Patients were all satisfied with the anatomical reduction and functional recovery. Conclusions: The technique of K-wire and tension band wire fixation is safe, simple, effective, less invasive and has been successfully used in orthopedic surgery. It is effective in treating sternoclavicular joint dislocation though it has some disadvantages. Key words: Sternoclavicular joint; Dislocations; Bone wires; Fracture fixation, internal

Synthesis of Commercial Products from Copper Wire-Drawing Waste

Science.gov (United States)

Ayala, J.; Fernández, B.

2014-06-01

Copper powder and copper sulfate pentahydrate were obtained from copper wire-drawing scale. The hydrometallurgical recycling process proposed in this article yields a high-purity copper powder and analytical grade copper sulfate pentahydrate. In the first stage of this process, the copper is dissolved in sulfuric acid media via dismutation of the scale. In the second stage, copper sulfate pentahydrate is precipitated using ethanol. Effects such as pH, reaction times, stirring speed, initial copper concentration, and ethanol/solution volume ratio were studied during the precipitation from solution reaction. The proposed method is technically straightforward and provides efficient recovery of Cu from wire-drawing scale.

A comparison of a 'J' wire and a straight wire in successful antegrade cannulation of the superficial femoral artery

International Nuclear Information System (INIS)

Gay, D.A.T.; Edwards, A.J.; Puckett, M.A.; Roobottom, C.A.

2005-01-01

AIMS: To evaluate the success of two different types of wire in common use in their ability to successfully cannulate the superficial femoral artery (SFA) using antegrade puncture. METHODS: 50 consecutive patients in whom antegrade infra-inguinal intervention was planned, underwent common femoral arterial puncture and then cannulation with either a standard 3 mm 'J' wire or a floppy tipped straight wire (William Cook--Europe). The frequency with which each type of wire entered the SFA or profunda femoris artery without image guidance was recorded. Further analysis was also made of the success of manipulation of the wire into the SFA following profunda cannulation and the use of alternative guide wires. RESULTS: In 19 out of 25 (76%) patients the 'J' wire correctly entered the SFA without image guidance. Only 5 out of 25 (25%) of straight wires entered the SFA with the initial pass (p<0.0001). Following further manipulation with the same wire all except 1 'J' wire was successfully negotiated into the SFA. The same was true for only 9 of the remaining straight wires with 11 patients requiring an alternative guide wire. CONCLUSIONS: When performing antegrade cannulation of the SFA a 'J' wire is more likely to be successful than a straight guide wire

Metallic superconductors. 3. Na3Sn and V3Ga wires (Part one)

International Nuclear Information System (INIS)

Tachikawa, Kyoji

2010-01-01

Nowadays Nb 3 Sn wires are being widely used as one of the key materials in advanced science and technology, with various applications such as NMR, fusion and cryogen-free superconducting magnets. In this article, at first microstructures and fundamental aspects as well as the effect of additional elements in Nb 3 Sn are outlined. Intrinsic superconducting performances, e.g. T c and B c2 , are quite sensitive to the stoichiometry of the Sn concentration. A small amount of Ti and Ta doping is much effective for the increase of B c2 in Nb 3 Sn. The effect of Cu on the enhancement of Nb 3 Sn synthesis has yielded a significant breakthrough for the industrial production of the wires. At present the bronze process and internal Sn process are the twin major fabrication techniques of Nb 3 Sn wires. The recent status of both processes is reviewed in this article. Pronounced progress has been achieved in the performance of Nb 3 Sn wires fabricated through both techniques. Although just half a century has passed since the first fabrication of Nb 3 Sn wire, further progress in Nb 3 Sn technology may be expected like the proverb saying 'Fresh water still comes out from an old spring'. (author)

Influence of chemical bonding of chlorides with aluminates in cement hidratation process on corrosion steel bars in concrete

Directory of Open Access Journals (Sweden)

Bikić Farzet H.

2010-01-01

Full Text Available The presence of chlorides in concrete is a permanent subject of research because they cause corrosion of steel bars. Chlorides added to the concrete during preparation, as accelerators of the bonding of cement minerals process, enter into reaction with aluminates, creating a phase known as chloroaluminate hydrates. In everyday conditions the product of chemical bonding between chlorides and aluminates is usually monochloridealuminate C3A·CaCl2·Hx, better known as Friedel's salt. In this paper, the influence of chemical bonding of chlorides with aluminates during the process of cement hydration on corrosion of steel bars in concrete was investigated. The process of chlorides bonding with aluminates yielding monochloride aluminate is monitored by XRD analyses. It was found that the amount of chlorides bonding with aluminates increases with an increase of temperature, and as a result, reduces the amount of 'free' chlorides in concrete. Potentiodynamic measurements have shown that increase in temperature of the heat treatment of working electrodes by chlorides leads to a reduction of steel bars corrosion as a result of either the increase of the monochloride-aluminate content or the decrease of free chlorides amount. Chlorides bound in chloroaluminate hydrates do not cause activation of steel bars corrosion in concrete. It was also proven that the increase of free chlorides concentration in the concrete leads to intensification of steel bars corrosion. This additionally approves that free chlorides are only the activators of process of steel bars corrosion in the concrete.

Fabrication of sub-15 nm aluminum wires by controlled etching

International Nuclear Information System (INIS)

Morgan-Wall, T.; Hughes, H. J.; Hartman, N.; Marković, N.; McQueen, T. M.

2014-01-01

We describe a method for the fabrication of uniform aluminum nanowires with diameters below 15 nm. Electron beam lithography is used to define narrow wires, which are then etched using a sodium bicarbonate solution, while their resistance is simultaneously measured in-situ. The etching process can be stopped when the desired resistance is reached, and can be restarted at a later time. The resulting nanowires show a superconducting transition as a function of temperature and magnetic field that is consistent with their smaller diameter. The width of the transition is similar to that of the lithographically defined wires, indicating that the etching process is uniform and that the wires are undamaged. This technique allows for precise control over the normal state resistance and can be used to create a variety of aluminum nanodevices

Towards plant wires.

Science.gov (United States)

Adamatzky, Andrew

2014-08-01