WorldWideScience

Sample records for waste printed circuit

  1. Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor

    Energy Technology Data Exchange (ETDEWEB)

    Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Lin, Carol S.K. [School of Energy and Environment, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong Special Administrative Region (Hong Kong); McKay, Gordon, E-mail: kemckayg@ust.hk [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Division of Sustainable Development, College of Science, Engineering and Technology, Hamad bin Khalifa University, Doha (Qatar)

    2015-01-15

    Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced.

  2. Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor

    International Nuclear Information System (INIS)

    Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S.K.; McKay, Gordon

    2015-01-01

    Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced

  3. Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill

    International Nuclear Information System (INIS)

    Yoo, Jae-Min; Jeong, Jinki; Yoo, Kyoungkeun; Lee, Jae-chun; Kim, Wonbaek

    2009-01-01

    Printed circuit boards incorporated in most electrical and electronic equipment contain valuable metals such as Cu, Ni, Au, Ag, Pd, Fe, Sn, and Pb. In order to employ a hydrometallurgical route for the recycling of valuable metals from printed circuit boards, a mechanical pre-treatment step is needed. In this study, the metallic components from waste printed circuit boards have been enriched using a mechanical separation process. Waste printed circuit boards shredded to 5.0 mm. The fractions of milled printed circuit boards of size 5.0 mm fraction and the heavy fraction were subjected to two-step magnetic separation. Through the first magnetic separation at 700 Gauss, 83% of the nickel and iron, based on the whole printed circuit boards, was recovered in the magnetic fraction, and 92% of the copper was recovered in the non-magnetic fraction. The cumulative recovery of nickel-iron concentrate was increased by a second magnetic separation at 3000 Gauss, but the grade of the concentrate decreased remarkably from 76% to 56%. The cumulative recovery of copper concentrate decreased, but the grade increased slightly from 71.6% to 75.4%. This study has demonstrated the feasibility of the mechanical separation process consisting of milling/size classification/gravity separation/two-step magnetic separation for enriching metallic components such as Cu, Ni, Al, and Fe from waste printed circuit boards

  4. Research on Toxicity Evaluation of Waste Incineration Residues of Printed Circuit Boards

    Directory of Open Access Journals (Sweden)

    Rasa Volungevičienė

    2014-10-01

    Full Text Available Recycling waste printed circuit boards (PCB is an extremely complicated process, because PCBs consist of a number of complex components – hazardous and non-hazardous materials sets. Pyrolysis and combustion are currently the most effective treatment technologies for waste printed circuit boards. Pyrolysis can be used for thermally decomposing PCBs allowing for the simultaneous recovery of valuable materials. Following the extraction of valuable materials, the problem of residual ash utilization is encountered. Determining the qualitative and quantitative characteristics of incineration residue helps with choosing effective ash management technologies. This paper analyzes PCB ash generated at three different temperatures of 400 °C, 500 °C and 600 °C. Ash residues have been analysed to determine the quantity and type of metals present. Furthermore, the experiment of leaching heavy metals from ash has been described.

  5. Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

    Science.gov (United States)

    Ivǎnuş, R. C.; ǎnuş, D., IV; Cǎlmuc, F.

    2010-06-01

    Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE) contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste - PCBs) leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L). The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

  6. Waste printed circuit board recycling techniques and product utilization

    International Nuclear Information System (INIS)

    Hadi, Pejman; Xu, Meng; Lin, Carol S.K.; Hui, Chi-Wai; McKay, Gordon

    2015-01-01

    Highlights: • There is a major environmental issue about the printed circuit boards throughout the world. • Different physical and chemical recycling techniques have been reviewed. • Nonmetallic fraction of PCBs is the unwanted face of this waste stream. • Several applications of the nonmetallic fraction of waste PCBs have been introduced. - Abstract: E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly “recycling” has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined

  7. Waste printed circuit board recycling techniques and product utilization

    Energy Technology Data Exchange (ETDEWEB)

    Hadi, Pejman; Xu, Meng [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Lin, Carol S.K. [School of Energy and Environment, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong Special Administrative Region (Hong Kong); Hui, Chi-Wai [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); McKay, Gordon, E-mail: kemckayg@ust.hk [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Division of Sustainable Development, College of Science, Engineering and Technology, Hamad Bin Khalifa University, Qatar Foundation, Doha (Qatar)

    2015-02-11

    Highlights: • There is a major environmental issue about the printed circuit boards throughout the world. • Different physical and chemical recycling techniques have been reviewed. • Nonmetallic fraction of PCBs is the unwanted face of this waste stream. • Several applications of the nonmetallic fraction of waste PCBs have been introduced. - Abstract: E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly “recycling” has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined.

  8. Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

    Directory of Open Access Journals (Sweden)

    Ivănuş R.C.

    2010-06-01

    Full Text Available Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste – PCBs leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L. The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

  9. Hydrothermal modification and recycling of nonmetallic particles from waste print circuit boards.

    Science.gov (United States)

    Gao, Xuehua; Li, Qisheng; Qiu, Jun

    2018-04-01

    Nonmetallic particles recycled from waste print circuit boards (NPRPs) were modified by a hydrothermal treatment method and the catalysts, solvents, temperature and time were investigated, which affected the modification effect of NPRPs. The mild hydrothermal treatment method does not need high temperature, and would not cause secondary pollution. Further, the modified NPRPs were used as the raw materials for the epoxy resin and glass fibers/epoxy resin composites, which were prepared by pouring and hot-pressing method. The mechanical properties and morphology of the composites were discussed. The results showed that relative intensity of the hydroxyl bonds on the surface of NPRPs increased 58.9% after modification. The mechanical tests revealed that both flexural and impact properties of the composites can be significantly improved by adding the modified NPRPs. Particularly, the maximum increment of flexural strength, flexural modulus and impact strength of the epoxy matrix composites with 30% modified NPRPs is 40.1%, 80.0% and 79.0%, respectively. Hydrothermal treatment can modify surface of NPRPs successfully and modified NPRPs can not only improve the properties of the composites, but also reduce the production cost of the composites and environmental pollution. Thus, we develop a new way to recycle nonmetallic materials of waste print circuit boards and the highest level of waste material recycling with the raw materials-products-raw materials closed cycle can be realized through the hydrothermal modification and reuse of NPRPs. Copyright © 2018 Elsevier Ltd. All rights reserved.

  10. Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor.

    Science.gov (United States)

    Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S K; McKay, Gordon

    2015-01-01

    Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced. Copyright © 2014 Elsevier Ltd. All rights reserved.

  11. Disposing and recycling waste printed circuit boards: disconnecting, resource recovery, and pollution control.

    Science.gov (United States)

    Wang, Jianbo; Xu, Zhenming

    2015-01-20

    Over the past decades, China has been suffering from negative environmental impacts from distempered e-waste recycling activities. After a decade of effort, disassembly and raw materials recycling of environmentally friendly e-waste have been realized in specialized companies, in China, and law enforcement for illegal activities of e-waste recycling has also been made more and more strict. So up to now, the e-waste recycling in China should be developed toward more depth and refinement to promote industrial production of e-waste resource recovery. Waste printed circuit boards (WPCBs), which are the most complex, hazardous, and valuable components of e-waste, are selected as one typical example in this article that reviews the status of related regulations and technologies of WPCBs recycling, then optimizes, and integrates the proper approaches in existence, while the bottlenecks in the WPCBs recycling system are analyzed, and some preliminary experiments of pinch technologies are also conducted. Finally, in order to provide directional guidance for future development of WPCBs recycling, some key points in the WPCBs recycling system are proposed to point towards a future trend in the e-waste recycling industry.

  12. Analysis of the treatment of plastic from electrical and electronic waste in the Republic of Serbia and the testing of the recycling potential of non-metallic fractions of printed circuit boards

    Directory of Open Access Journals (Sweden)

    Vučinić Aleksandra S.

    2017-01-01

    Full Text Available This paper presents the analysis of the quantity of plastic and waste printed circuit boards obtained after the mechanical treatment of electrical and electronic waste (E-waste in the Republic of Serbia, as well as the recycling of non-metallic fractions of waste printed circuit boards. The aim is to analyze the obtained recycled material and recommendation for possible application of recyclables. The data on the quantities and treatment of plastics and printed circuit boards obtained after the mechanical treatment of WEEE, were gained through questionnaires sent to the operators who treat this type of waste. The results of the questionnaire analysis showed that in 2014 the dismantling of E-waste isolated 1,870.95 t of plastic and 499.85 t of printed circuit boards. In the Republic of Serbia, E-waste recycling is performed exclusively by using mechanical methods. Mechanical methods consist of primary crushing and separation of the materials which have a utility value as secondary raw materials, from the components and materials that have hazardous properties. Respect to that, the recycling of printed circuit boards using some of the metallurgical processes with the aim of extracting copper, precious metals and non-metallic fraction is completely absent, and the circuit boards are exported as a whole. Given the number of printed circuit boards obtained by E-waste dismantling, and the fact that from an economic point of view, hydrometallurgical methods are very suitable technological solutions in the case of a smaller capacity, there is a possibility for establishing the facilities in the Republic of Serbia for the hydrometallurgical treatment that could be used for metals extraction, and non-metallic fractions, which also have their own value. Printed circuit boards granulate obtained after the mechanical pretreatment and the selective removal of metals by hydrometallurgical processes was used for the testing of the recycling potential

  13. Recycling of WEEE: Characterization of spent printed circuit boards from mobile phones and computers

    International Nuclear Information System (INIS)

    Yamane, Luciana Harue; Tavares de Moraes, Viviane; Crocce Romano Espinosa, Denise; Soares Tenorio, Jorge Alberto

    2011-01-01

    Highlights: → This paper presents new and important data on characterization of wastes of electric and electronic equipments. → Copper concentration is increasing in mobile phones and remaining constant in personal computers. → Printed circuit boards from mobile phones and computers would not be mixed prior treatment. - Abstract: This paper presents a comparison between printed circuit boards from computers and mobile phones. Since printed circuits boards are becoming more complex and smaller, the amount of materials is constantly changing. The main objective of this work was to characterize spent printed circuit boards from computers and mobile phones applying mineral processing technique to separate the metal, ceramic, and polymer fractions. The processing was performed by comminution in a hammer mill, followed by particle size analysis, and by magnetic and electrostatic separation. Aqua regia leaching, loss-on-ignition and chemical analysis (inductively coupled plasma atomic emission spectroscopy - ICP-OES) were carried out to determine the composition of printed circuit boards and the metal rich fraction. The composition of the studied mobile phones printed circuit boards (PCB-MP) was 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers; and of the printed circuit boards from studied personal computers (PCB-PC) was 45 wt.% metals; 27 wt.% polymers and ceramics 28 wt.% ceramics. The chemical analysis showed that copper concentration in printed circuit boards from personal computers was 20 wt.% and in printed circuit boards from mobile phones was 34.5 wt.%. According to the characteristics of each type of printed circuit board, the recovery of precious metals may be the main goal of the recycling process of printed circuit boards from personal computers and the recovery of copper should be the main goal of the recycling process of printed circuit boards from mobile phones. Hence, these printed circuit boards would not be mixed prior treatment. The results

  14. Thiourea leaching gold and silver from the printed circuit boards of waste mobile phones.

    Science.gov (United States)

    Jing-ying, Li; Xiu-li, Xu; Wen-quan, Liu

    2012-06-01

    The present communication deals with the leaching of gold and silver from the printed circuit boards (PCBs) of waste mobile phones using an effective and less hazardous system, i.e., a thiourea leaching process as an alternative to the conventional and toxic cyanide leaching of gold. The influence of particle size, thiourea and Fe(3+) concentrations and temperature on the leaching of gold and silver from waste mobile phones was investigated. Gold extraction was found to be enhanced in a PCBs particle size of 100 mesh with the solutions containing 24 g/L thiourea and Fe(3+) concentration of 0.6% under the room temperature. In this case, about 90% of gold and 50% of silver were leached by the reaction of 2h. The obtained data will be useful for the development of processes for the recycling of gold and silver from the PCBs of waste mobile phones. Copyright © 2012 Elsevier Ltd. All rights reserved.

  15. Integrated bioleaching of copper metal from waste printed circuit board-a comprehensive review of approaches and challenges.

    Science.gov (United States)

    Awasthi, Abhishek Kumar; Zeng, Xianlai; Li, Jinhui

    2016-11-01

    Waste electrical and electronic equipment (e-waste) is the most rapidly growing waste stream in the world, and the majority of the residues are openly disposed of in developing countries. Waste printed circuit boards (WPCBs) make up the major portion of e-waste, and their informal recycling can cause environmental pollution and health risks. Furthermore, the conventional disposal and recycling techniques-mechanical treatments used to recover valuable metals, including copper-are not sustainable in the long term. Chemical leaching is rapid and efficient but causes secondary pollution. Bioleaching is a promising approach, eco-friendly and economically feasible, but it is slower process. This review considers the recycling potential of microbes and suggests an integrated bioleaching approach for Cu extraction and recovery from WPCBs. The proposed recycling system should be more effective, efficient and both technically and economically feasible.

  16. New technology for recovering residual metals from nonmetallic fractions of waste printed circuit boards.

    Science.gov (United States)

    Zhang, Guangwen; He, Yaqun; Wang, Haifeng; Zhang, Tao; Wang, Shuai; Yang, Xing; Xia, Wencheng

    2017-06-01

    Recycling of waste printed circuit boards is important for environmental protection and sustainable resource utilization. Corona electrostatic separation has been widely used to recycle metals from waste printed circuit boards, but it has poor separation efficiency for finer sized fractions. In this study, a new process of vibrated gas-solid fluidized bed was used to recycle residual metals from nonmetallic fractions, which were treated using the corona electrostatic separation technology. The effects of three main parameters, i.e., vibration frequency, superficial air flow velocity, and fluidizing time on gravity segregation, were investigated using a vibrating gas-solid fluidized bed. Each size fraction had its own optimum parameters. Corresponding to their optimal segregation performance, the products from each experiment were analyzed using an X-ray fluorescence (XRF) and a scanning electron microscope (SEM) equipped with an energy dispersive spectrometer (EDS). From the results, it can be seen that the metal recoveries of -1+0.5mm, -0.5+0.25mm, and -0.25mm size fractions were 86.39%, 82.22% and 76.63%, respectively. After separation, each metal content in the -1+0.5 or -0.5+0.25mm size fraction reduced to 1% or less, while the Fe and Cu contents are up to 2.57% and 1.50%, respectively, in the -0.25mm size fraction. Images of the nonmetallic fractions with a size of -0.25mm indicated that a considerable amount of clavate glass fibers existed in these nonmetallic fractions, which may explain why fine particles had the poorest segregation performance. Copyright © 2017 Elsevier Ltd. All rights reserved.

  17. Removing lead from metallic mixture of waste printed circuit boards by vacuum distillation: factorial design and removal mechanism.

    Science.gov (United States)

    Li, Xingang; Gao, Yujie; Ding, Hui

    2013-10-01

    The lead removal from the metallic mixture of waste printed circuit boards by vacuum distillation was optimized using experimental design, and a mathematical model was established to elucidate the removal mechanism. The variables studied in lead evaporation consisted of the chamber pressure, heating temperature, heating time, particle size and initial mass. The low-level chamber pressure was fixed at 0.1 Pa as the operation pressure. The application of two-level factorial design generated a first-order polynomial that agreed well with the data for evaporation efficiency of lead. The heating temperature and heating time exhibited significant effects on the efficiency, which was validated by means of the copper-lead mixture experiments. The optimized operating conditions within the region studied were the chamber pressure of 0.1 Pa, heating temperature of 1023 K and heating time of 120 min. After the conditions were employed to remove lead from the metallic mixture of waste printed circuit boards, the efficiency was 99.97%. The mechanism of the effects was elucidated by mathematical modeling that deals with evaporation, mass transfer and condensation, and can be applied to a wider range of metal removal by vacuum distillation. Copyright © 2013 Elsevier Ltd. All rights reserved.

  18. Co-recycling of acrylonitrile-butadiene-styrene waste plastic and nonmetal particles from waste printed circuit boards to manufacture reproduction composites.

    Science.gov (United States)

    Sun, Zhixing; Shen, Zhigang; Zhang, Xiaojing; Ma, Shulin

    2015-01-01

    This study investigated the feasibility of using acrylonitrile-butadiene-styrene (ABS) waste plastic and nonmetal particles from waste printed circuit boards (WPCB) to manufacture reproduction composites (RC), with the aim of co-recycling these two waste resources. The composites were prepared in a twin-crew extruder and investigated by means of mechanical testing, in situ flexural observation, thermogravimatric analysis, and dimensional stability evaluation. The results showed that the presence of nonmetal particles significantly improved the mechanical properties and the physical performance of the RC. A loading of 30 wt% nonmetal particles could achieve a flexural strength of 72.6 MPa, a flexural modulus of 3.57 GPa, and an impact strength of 15.5 kJ/m2. Moreover, it was found that the application of maleic anhydride-grafted ABS as compatilizer could effectively promote the interfacial adhesion between the ABS plastic and the nonmetal particles. This research provides a novel method to reuse waste ABS and WPCB nonmetals for manufacturing high value-added product, which represents a promising way for waste recycling and resolving the environmental problem.

  19. Improving Heat Transfer Performance of Printed Circuit Boards

    Science.gov (United States)

    Schatzel, Donald V.

    2009-01-01

    This paper will explore the ability of printed circuit boards laminated with a Carbon Core Laminate to transfer heat vs. standard printed circuit boards that use only thick layers of copper. The paper will compare the differences in heat transfer performance of printed circuit boards with and without CCL.

  20. Primer printed circuit boards

    CERN Document Server

    Argyle, Andrew

    2009-01-01

    Step-by-step instructions for making your own PCBs at home. Making your own printed circuit board (PCB) might seem a daunting task, but once you master the steps, it's easy to attain professional-looking results. Printed circuit boards, which connect chips and other components, are what make almost all modern electronic devices possible. PCBs are made from sheets of fiberglass clad with copper, usually in multiplelayers. Cut a computer motherboard in two, for instance, and you'll often see five or more differently patterned layers. Making boards at home is relatively easy

  1. Bioleaching of Gold and Silver from Waste Printed Circuit Boards by Pseudomonas balearica SAE1 Isolated from an e-Waste Recycling Facility.

    Science.gov (United States)

    Kumar, Anil; Saini, Harvinder Singh; Kumar, Sudhir

    2018-02-01

    Indigenous bacterial strain Pseudomonas balearica SAE1, tolerant to e-waste toxicity was isolated from an e-waste recycling facility Exigo Recycling Pvt. Ltd., India. Toxicity tolerance of bacterial strain was analyzed using crushed (particle size ≤150 µm) waste computer printed circuit boards (PCBs)/liter (L) of culture medium. The EC 50 value for SAE1 was 325.7 g/L of the e-waste pulp density. Two-step bioleaching was then applied to achieve the dissolution of gold (Au) and silver (Ag) from the e-waste. To maximize precious metal dissolution, factors including pulp density, glycine concentration, pH level, and temperature were optimized. The optimization resulted in 68.5 and 33.8% of Au and Ag dissolution, respectively, at a pH of 9.0, a pulp density of 10 g/L, a temperature of 30 °C, and a glycine concentration of 5 g/L. This is the first study of Au and Ag bioleaching using indigenous e-waste bacteria and its analysis to determine e-waste toxicity tolerance.

  2. Printed organic thin-film transistor-based integrated circuits

    International Nuclear Information System (INIS)

    Mandal, Saumen; Noh, Yong-Young

    2015-01-01

    Organic electronics is moving ahead on its journey towards reality. However, this technology will only be possible when it is able to meet specific criteria including flexibility, transparency, disposability and low cost. Printing is one of the conventional techniques to deposit thin films from solution-based ink. It is used worldwide for visual modes of information, and it is now poised to enter into the manufacturing processes of various consumer electronics. The continuous progress made in the field of functional organic semiconductors has achieved high solubility in common solvents as well as high charge carrier mobility, which offers ample opportunity for organic-based printed integrated circuits. In this paper, we present a comprehensive review of all-printed organic thin-film transistor-based integrated circuits, mainly ring oscillators. First, the necessity of all-printed organic integrated circuits is discussed; we consider how the gap between printed electronics and real applications can be bridged. Next, various materials for printed organic integrated circuits are discussed. The features of these circuits and their suitability for electronics using different printing and coating techniques follow. Interconnection technology is equally important to make this product industrially viable; much attention in this review is placed here. For high-frequency operation, channel length should be sufficiently small; this could be achievable with a combination of surface treatment-assisted printing or laser writing. Registration is also an important issue related to printing; the printed gate should be perfectly aligned with the source and drain to minimize parasitic capacitances. All-printed organic inverters and ring oscillators are discussed here, along with their importance. Finally, future applications of all-printed organic integrated circuits are highlighted. (paper)

  3. A study of liberation and separation process of metals from printed circuit boards (PCBs) scrap

    International Nuclear Information System (INIS)

    Noorliyana, H.A.; Zaheruddin, K.; Mohd Fazlul Bari; M. Sri Asliza; Nurhidayah, A.Z.; Kamarudin, H.

    2009-01-01

    Since the metallic elements are covered with or encapsulated by various plastic or ceramic materials on printed circuit boards, a mechanical pre-treatment process allowing their liberation and separation is first needed in order to facilitate their efficient extraction with hydrometallurgy route. Even though many studies have been performed on the mechanical pre-treatment processing for the liberation and separation of the metallic components of printed circuit boards scrap, further studies are required to pave the way for efficient recycling of waste printed circuit boards through a combination of mechanical pre-treatment and hydrometallurgical technology. In this work, a fundamental study has been carried out on the mechanical pre-treatment that is necessary to recover metallic concentrates from printed circuit boards scraps. The most important problem is to separate or release particles from the associated gangue minerals at the possible liberation particle size. The distribution of metallic elements has been also investigated in relation to the particle size of the milled printed circuit boards. The samples of printed circuit boards were separated into the magnetic and non-magnetic fractions by Rare-earth Roll Magnetic separator. Thereafter, the magnetic and non-magnetic fractions were separated to heavy fraction (metallic elements) and light fraction (plastic) by Mozley Laboratory Table Separator. The recovery ratios and the evaluation of the metallic concentrates recovered by each separation process were also investigated. This study is expected to provide useful data for the efficient mechanical separation of metallic components from printed circuit boards scraps. (author)

  4. The ultrasonically assisted metals recovery treatment of printed circuit board waste sludge by leaching separation.

    Science.gov (United States)

    Xie, Fengchun; Li, Haiying; Ma, Yang; Li, Chuncheng; Cai, Tingting; Huang, Zhiyuan; Yuan, Gaoqing

    2009-10-15

    This paper provides a practical technique that realized industrial scale copper and iron separation from printed circuit board (PCB) waste sludge by ultrasonically assisted acid leaching in a low cost, low energy consumption and zero discharge of wastes manner. The separation efficiencies of copper and iron from acid leaching with assistance of ultrasound were compared with the one without assistance of ultrasound and the effects of the leaching procedure, pH value, and ultrasonic strength have been investigated in the paper. With the appropriate leaching procedure, a final pH of 3.0, an ultrasonic generator power of 160 W (in 1l tank), leaching time of 60 min, leaching efficiencies of copper and iron had reached 97.83% and 1.23%, respectively. Therefore the separation of copper and iron in PCB waste sludge was virtually achieved. The lab results had been successfully applied to the industrial scaled applications in a heavy metal recovery plant in city of Huizhou, China for more than two years. It has great potentials to be used in even the broad metal recovery practices.

  5. Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

    International Nuclear Information System (INIS)

    Ortuño, Nuria; Conesa, Juan A.; Moltó, Julia; Font, Rafael

    2014-01-01

    The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO 2005 -TEQ/kg sample, corresponding to the sample with and without metals, respectively. - Highlights: • Thermal decomposition of printed circuit boards (with and without metals) is studied. • Important differences were found at the different experimental conditions. • Emission of brominated pollutants is much higher than that of chlorinated. • Metal enhances emission of halogenated compounds. • An increase in the temperature produces the destruction of pollutants

  6. A Novel Designed Bioreactor for Recovering Precious Metals from Waste Printed Circuit Boards

    Science.gov (United States)

    Jujun, Ruan; Jie, Zheng; Jian, Hu; Zhang, Jianwen

    2015-01-01

    For recovering precious metals from waste printed circuit boards (PCBs), a novel hybrid technology including physical and biological methods was developed. It consisted of crushing, corona-electrostatic separation, and bioleaching. Bioleaching process is the focus of this paper. A novel bioreactor for bioleaching was designed. Bioleaching was carried out using Pseudomonas chlororaphis. Bioleaching experiments using mixed particles of Au and Cu were performed and leachate contained 0.006 mg/L, 2823 mg/L Au+ and Cu2+ respectively. It showed when Cu existed, the concentrations of Au were extremely small. This provided the feasibility to separate Cu from Au. The method of orthogonal experimental design was employed in the simulation bioleaching experiments. Experimental results showed the optimized parameters for separating Cu from Au particles were pH 7.0, temperature 22.5 °C, and rotation speed 80 r/min. Based on the optimized parameters obtained, the bioreactor was operated for recovering mixed Au and Cu particles. 88.1 wt.% of Cu and 76.6 wt.% of Au were recovered. The paper contributed important information to recover precious metals from waste PCBs. PMID:26316021

  7. Synthesis of carbon nanotubes and porous carbons from printed circuit board waste pyrolysis oil

    International Nuclear Information System (INIS)

    Quan Cui; Li Aimin; Gao Ningbo

    2010-01-01

    The possibility and feasibility of using pyrolysis oil from printed circuit board (PCB) waste as a precursor for advanced carbonaceous materials is presented. The PCB waste was first pyrolyzed in a laboratory scale fixed bed reactor at 600 deg. C to prepare pyrolysis oil. The analysis of pyrolysis oil by gas chromatography-mass spectroscopy indicated that it contained a very high proportion of phenol and phenol derivatives. It was then polymerized in formaldehyde solution to synthesize pyrolysis oil-based resin which was used as a precursor to prepare carbon nanotubes (CNTs) and porous carbons. Scanning electron microscopy and transmission microscopy investigation showed that the resulting CNTs had hollow cores with outer diameter of ∼338 nm and wall thickness of ∼86 nm and most of them were filled with metal nanoparticles or nanorods. X-ray diffraction reveals that CNTs have an amorphous structure. Nitrogen adsorption isotherm analysis indicated the prepared porous carbons had a Brunauer-Emmett-Teller surface area of 1214 m 2 /g. The mechanism of the formation of the CNTs and porous carbons was discussed.

  8. Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

    Energy Technology Data Exchange (ETDEWEB)

    Ortuño, Nuria; Conesa, Juan A., E-mail: ja.conesa@ua.es; Moltó, Julia; Font, Rafael

    2014-11-15

    The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO{sub 2005}-TEQ/kg sample, corresponding to the sample with and without metals, respectively. - Highlights: • Thermal decomposition of printed circuit boards (with and without metals) is studied. • Important differences were found at the different experimental conditions. • Emission of brominated pollutants is much higher than that of chlorinated. • Metal enhances emission of halogenated compounds. • An increase in the temperature produces the destruction of pollutants.

  9. Direct Desktop Printed-Circuits-on-Paper Flexible Electronics

    Science.gov (United States)

    Zheng, Yi; He, Zhizhu; Gao, Yunxia; Liu, Jing

    2013-01-01

    There currently lacks of a way to directly write out electronics, just like printing pictures on paper by an office printer. Here we show a desktop printing of flexible circuits on paper via developing liquid metal ink and related working mechanisms. Through modifying adhesion of the ink, overcoming its high surface tension by dispensing machine and designing a brush like porous pinhead for printing alloy and identifying matched substrate materials among different papers, the slightly oxidized alloy ink was demonstrated to be flexibly printed on coated paper, which could compose various functional electronics and the concept of Printed-Circuits-on-Paper was thus presented. Further, RTV silicone rubber was adopted as isolating inks and packaging material to guarantee the functional stability of the circuit, which suggests an approach for printing 3D hybrid electro-mechanical device. The present work paved the way for a low cost and easygoing method in directly printing paper electronics.

  10. Using vacuum pyrolysis and mechanical processing for recycling waste printed circuit boards

    International Nuclear Information System (INIS)

    Long Laishou; Sun Shuiyu; Zhong Sheng; Dai Wencan; Liu Jingyong; Song Weifeng

    2010-01-01

    The constant growth in generation of waste printed circuit boards (WPCB) poses a huge disposal problem because they consist of a heterogeneous mixture of organic and metallic chemicals as well as glass fiber. Also the presence of heavy metals, such as Pb and Cd turns this scrap into hazardous waste. Therefore, recycling of WPCB is an important subject not only from the recovery of valuable materials but also from the treatment of waste. The aim of this study was to present a recycling process without negative impact to the environment as an alternative for recycling WPCB. In this work, a process technology containing vacuum pyrolysis and mechanical processing was employed to recycle WPCB. At the first stage of this work, the WPCB was pyrolyzed under vacuum in a self-made batch pilot-scale fixed bed reactor to recycle organic resins contained in the WPCB. By vacuum pyrolysis the organic matter was decomposed to gases and liquids which could be used as fuels or chemical material resources, however, the inorganic WPCB matter was left unaltered as solid residues. At the second stage, the residues obtained at the first stage were investigated to separate and recover the copper through mechanical processing such as crushing, screening, and gravity separation. The copper grade of 99.50% with recovery of 99.86% based on the whole WPCB was obtained. And the glass fiber could be obtained by calcinations in a muffle furnace at 600 deg. C for 10 min. This study had demonstrated the feasibility of vacuum pyrolysis and mechanical processing for recycling WPCB.

  11. "Printed-circuit" rectenna

    Science.gov (United States)

    Dickinson, R. M.

    1977-01-01

    Rectifying antenna is less bulky structure for absorbing transmitted microwave power and converting it into electrical current. Printed-circuit approach, using microstrip technology and circularly polarized antenna, makes polarization orientation unimportant and allows much smaller arrays for given performance. Innovation is particularly useful with proposed electric vehicles powered by beam microwaves.

  12. Printed Graphene Derivative Circuits as Passive Electrical Filters

    Directory of Open Access Journals (Sweden)

    Dogan Sinar

    2018-02-01

    Full Text Available The objective of this study is to inkjet print resistor-capacitor (RC low pass electrical filters, using a novel water-based cellulose graphene ink, and compare the voltage-frequency and transient behavior to equivalent circuits constructed from discrete passive components. The synthesized non-toxic graphene-carboxymethyl cellulose (G-CMC ink is deposited on mechanically flexible polyimide substrates using a customized printer that dispenses functionalized aqueous solutions. The design of the printed first-order and second-order low-pass RC filters incorporate resistive traces and interdigitated capacitors. Low pass filter characteristics, such as time constant, cut-off frequency and roll-off rate, are determined for comparative analysis. Experiments demonstrate that for low frequency applications (<100 kHz the printed graphene derivative circuits performed as well as the circuits constructed from discrete resistors and capacitors for both low pass filter and RC integrator applications. The impact of mechanical stress due to bending on the electrical performance of the flexible printed circuits is also investigated.

  13. Printed circuit for ATLAS

    CERN Multimedia

    Laurent Guiraud

    1999-01-01

    A printed circuit board made by scientists in the ATLAS collaboration for the transition radiaton tracker (TRT). This will read data produced when a high energy particle crosses the boundary between two materials with different electrical properties.

  14. A guide to printed circuit board design

    CERN Document Server

    Hamilton, Charles

    1984-01-01

    A Guide to Printed Circuit Board Design discusses the basic design principles of printed circuit board (PCB). The book consists of nine chapters; each chapter provides both text discussion and illustration relevant to the topic being discussed. Chapter 1 talks about understanding the circuit diagram, and Chapter 2 covers how to compile component information file. Chapter 3 deals with the design layout, while Chapter 4 talks about preparing the master artworks. The book also covers generating computer aided design (CAD) master patterns, and then discusses how to prepare the production drawing a

  15. Printed circuits and their applications: Which way forward?

    Science.gov (United States)

    Cantatore, E.

    2015-09-01

    The continuous advancements in printed electronics make nowadays feasible the design of printed circuits which enable meaningful applications. Examples include ultra-low cost sensors embedded in food packaging, large-area sensing surfaces and biomedical assays. This paper offers an overview of state-of-the-art digital and analog circuit blocks, manufactured with a printed complementary organic TFT technology. An analog to digital converter and an RFID tag implemented exploiting these building blocks are also described. The main remaining drawbacks of the printed technology described are identified, and new approaches to further improve the state of the art, enabling more innovative applications are discussed.

  16. Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

    Energy Technology Data Exchange (ETDEWEB)

    Fogarasi, Szabolcs [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Imre-Lucaci, Florica [“Babeş-Bolyai” University, Interdisciplinary Research Institute on Bio-Nano-Sciences, 42 Treboniu Laurian Street, Cluj-Napoca RO-400271 (Romania); Imre-Lucaci, Árpád, E-mail: aimre@chem.ubbcluj.ro [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Ilea, Petru [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania)

    2014-05-01

    Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples.

  17. Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

    International Nuclear Information System (INIS)

    Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Árpád; Ilea, Petru

    2014-01-01

    Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples

  18. Recycling of non-metallic fractions from waste printed circuit boards: A review

    International Nuclear Information System (INIS)

    Guo Jiuyong; Guo Jie; Xu Zhenming

    2009-01-01

    The major economic driving force for recycling of waste printed circuit boards (PCBs) is the value of the metallic fractions (MFs) of PCBs. The non-metallic fractions (NMFs), which take up almost 70 wt% of waste PCBs, were treated by combustion or land filling in the past. However, combustion of the NMFs will cause the formation of highly toxic polybrominated dibenzodioxins and dibenzofurans (PBDD/Fs) while land filling of the NMFs will lead to secondary pollution caused by heavy metals and brominated flame retardants (BFRs) leaching to the groundwater. Therefore, recycling of the NMFs from waste PCBs is drawing more and more attention from the public and the governments. Currently, how to recycle the NMFs environmental soundly has become a significant topic in recycling of waste PCBs. In order to fulfill the better resource utilization of the NMFs, the compositions and characteristics of the NMFs, methods and outcomes of recycling the NMFs from waste PCBs and analysis and treatment for the hazardous substances contained in the NMFs were reviewed in this paper. Thermosetting resin matrix composites, thermoplastic matrix composites, concrete and viscoelastic materials are main applications for physical recycling of the NMFs. Chemical recycling methods consisting of pyrolysis, gasification, supercritical fluids depolymerization and hydrogenolytic degradation can be used to convert the NMFs to chemical feedstocks and fuels. The toxicity characteristic leaching procedure (TCLP) and synthetic precipitation leaching procedure (SPLP) can be used to determine the toxicity characteristic (TC) of the NMFs and to evaluate the environmental safety of products made from the recycled NMFs. It is believed that physical recycling of the NMFs has been a promising recycling method. Much more work should be done to develop comprehensive and industrialized usage of the NMFs recycled by physical methods. Chemical recycling methods have the advantages in eliminating hazardous substances

  19. Recycling of non-metallic fractions from waste printed circuit boards: A review

    Energy Technology Data Exchange (ETDEWEB)

    Guo Jiuyong; Guo Jie [School of Environmental Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240 (China); Xu Zhenming, E-mail: zmxu@sjtu.edu.cn [School of Environmental Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240 (China)

    2009-09-15

    The major economic driving force for recycling of waste printed circuit boards (PCBs) is the value of the metallic fractions (MFs) of PCBs. The non-metallic fractions (NMFs), which take up almost 70 wt% of waste PCBs, were treated by combustion or land filling in the past. However, combustion of the NMFs will cause the formation of highly toxic polybrominated dibenzodioxins and dibenzofurans (PBDD/Fs) while land filling of the NMFs will lead to secondary pollution caused by heavy metals and brominated flame retardants (BFRs) leaching to the groundwater. Therefore, recycling of the NMFs from waste PCBs is drawing more and more attention from the public and the governments. Currently, how to recycle the NMFs environmental soundly has become a significant topic in recycling of waste PCBs. In order to fulfill the better resource utilization of the NMFs, the compositions and characteristics of the NMFs, methods and outcomes of recycling the NMFs from waste PCBs and analysis and treatment for the hazardous substances contained in the NMFs were reviewed in this paper. Thermosetting resin matrix composites, thermoplastic matrix composites, concrete and viscoelastic materials are main applications for physical recycling of the NMFs. Chemical recycling methods consisting of pyrolysis, gasification, supercritical fluids depolymerization and hydrogenolytic degradation can be used to convert the NMFs to chemical feedstocks and fuels. The toxicity characteristic leaching procedure (TCLP) and synthetic precipitation leaching procedure (SPLP) can be used to determine the toxicity characteristic (TC) of the NMFs and to evaluate the environmental safety of products made from the recycled NMFs. It is believed that physical recycling of the NMFs has been a promising recycling method. Much more work should be done to develop comprehensive and industrialized usage of the NMFs recycled by physical methods. Chemical recycling methods have the advantages in eliminating hazardous substances

  20. Printed Graphene Derivative Circuits as Passive Electrical Filters.

    Science.gov (United States)

    Sinar, Dogan; Knopf, George K

    2018-02-23

    The objective of this study is to inkjet print resistor-capacitor ( RC ) low pass electrical filters, using a novel water-based cellulose graphene ink, and compare the voltage-frequency and transient behavior to equivalent circuits constructed from discrete passive components. The synthesized non-toxic graphene-carboxymethyl cellulose (G-CMC) ink is deposited on mechanically flexible polyimide substrates using a customized printer that dispenses functionalized aqueous solutions. The design of the printed first-order and second-order low-pass RC filters incorporate resistive traces and interdigitated capacitors. Low pass filter characteristics, such as time constant, cut-off frequency and roll-off rate, are determined for comparative analysis. Experiments demonstrate that for low frequency applications (graphene derivative circuits performed as well as the circuits constructed from discrete resistors and capacitors for both low pass filter and RC integrator applications. The impact of mechanical stress due to bending on the electrical performance of the flexible printed circuits is also investigated.

  1. Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation.

    Science.gov (United States)

    Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Arpád; Ilea, Petru

    2014-05-30

    The present study aims to develop an eco-friendly chemical-electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75kWh/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples. Copyright © 2014 Elsevier B.V. All rights reserved.

  2. Recent Progress in the Development of Printed Thin-Film Transistors and Circuits with High-Resolution Printing Technology.

    Science.gov (United States)

    Fukuda, Kenjiro; Someya, Takao

    2017-07-01

    Printed electronics enable the fabrication of large-scale, low-cost electronic devices and systems, and thus offer significant possibilities in terms of developing new electronics/optics applications in various fields. Almost all electronic applications require information processing using logic circuits. Hence, realizing the high-speed operation of logic circuits is also important for printed devices. This report summarizes recent progress in the development of printed thin-film transistors (TFTs) and integrated circuits in terms of materials, printing technologies, and applications. The first part of this report gives an overview of the development of functional inks such as semiconductors, electrodes, and dielectrics. The second part discusses high-resolution printing technologies and strategies to enable high-resolution patterning. The main focus of this report is on obtaining printed electrodes with high-resolution patterning and the electrical performance of printed TFTs using such printed electrodes. In the final part, some applications of printed electronics are introduced to exemplify their potential. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  3. Occurrences and inventories of heavy metals and brominated flame retardants in wastes from printed circuit board production.

    Science.gov (United States)

    Zhou, Xiaoyu; Guo, Jie; Zhang, Wei; Zhou, Peng; Deng, Jingjing; Lin, Kuangfei

    2014-09-01

    Pollutants including heavy metals and brominated flame retardant were detected in 10 types of production wastes from a typical printed circuit board manufacturing plant, and their inventories were estimated. Rinsing water from etching process had the highest concentrations of copper (665.51 mg/L), lead (1.02 mg/L), nickel (3.60 mg/L), chromium (0.97 mg/L), and tin (1.79 mg/L). Powdered solid waste (SW) from the cut lamination process contained the highest tetrabromobisphenol-A (TBBPA) levels (49.86 mg/kg). Polybrominated diphenyl ethers (PBDEs) were absent in this plant, in agreement with the international regulations of PBDE phase out. The pollutant inventories in the wastes exhibited in the order of copper > > zinc > tin ≈ nickel > lead > chromium > > TBBPA. The potential environmental impact of pollutants in SW during production and disposal were further investigated. A high partitioning of pollutant concentration between the total suspended particle and SW (-0.10 < log K TS < 2.12) was observed for most pollutants, indicating the emission pathway from SW to the airborne atmosphere in the workshop. Although SW met the toxicity characteristic leaching procedure, drilling powder with the smallest particle diameter still showed high leachabilities of lead and tin which may lead to a negative environmental impact during disposal.

  4. Preparation of hierarchical porous carbon from waste printed circuit boards for high performance electric double-layer capacitors

    Science.gov (United States)

    Du, Xuan; Wang, Li; Zhao, Wei; Wang, Yi; Qi, Tao; Li, Chang Ming

    2016-08-01

    Renewable clean energy and resources recycling have become inevitable choices to solve worldwide energy shortages and environmental pollution problems. It is a great challenge to recycle tons of waste printed circuit boards (PCB) produced every year for clean environment while creating values. In this work, low cost, high quality activated carbons (ACs) were synthesized from non-metallic fractions (NMF) of waste PCB to offer a great potential for applications of electrochemical double-layer capacitors (EDLCs). After recovering metal from waste PCB, hierarchical porous carbons were produced from NMF by carbonization and activation processes. The experimental results exhibit that some pores were formed after carbonization due to the escape of impurity atoms introduced by additives in NMF. Then the pore structure was further tailored by adjusting the activation parameters. Roles of micropores and non-micropores in charge storage were investigated when the hierarchical porous carbons were applied as electrode of EDLCs. The highest specific capacitance of 210 F g-1 (at 50 mA g-1) and excellent rate capability were achieved when the ACs possessing a proper micropores/non-micropores ratio. This work not only provides a promising method to recycle PCB, but also investigates the structure tailoring arts for a rational hierarchical porous structure in energy storage/conversion.

  5. PHYSICAL CHEMISTRY CHARACTERIZATION OF PRINTED CIRCUIT BOARD OF MOBILE PHONES

    Directory of Open Access Journals (Sweden)

    Hellington Bastos da Silva de Sant’ana

    2015-07-01

    Full Text Available Nowadays, electronics industry is the leading sector in developing new technologies. These new technologies lead to cheaper products increasing the consumption. The lifetime of such products is relatively short and soon it becomes waste, known as electronic waste. Cell phone is a common electronic waste. This waste represents an interesting raw material, because it contains large amount of base metals, considerable amount of valuable metals and also those dangerous. In this work, the electronic waste was submitted to mechanical processing: initially the devices were separated into two categories, as year of release (2002 and disassembled manually. The printed circuit boards were milled below 1 mm and then submitted to density and magnetic separation processes. The fractions obtained during the mechanical processing were characterized by chemical analysis. Using mechanical processing it was possible to obtain metal fractions of 80 wt%. A leaching test was carried out to determine if a waste needs to be managed as a hazardous; so that, cell phone waste must be considered in the category of hazardous residue because the lead concentration was above the limit established by Brazilian Standards

  6. Printed circuits and their applications : Which way forward?

    NARCIS (Netherlands)

    Cantatore, Eugenio; Kratochvil, E.J.W.L.

    2015-01-01

    The continuous advancements in printed electronics make nowadays feasible the design of printed circuits which enable meaningful applications. Examples include ultra-low cost sensors embedded in food packaging, large-area sensing surfaces and biomedical assays. This paper offers an overview of

  7. Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

    International Nuclear Information System (INIS)

    Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia

    2014-01-01

    Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery

  8. Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

    Energy Technology Data Exchange (ETDEWEB)

    Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia, E-mail: silvia.serranti@uniroma1.it

    2014-11-15

    Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery.

  9. Influence of nonmetals recycled from waste printed circuit boards on flexural properties and fracture behavior of polypropylene composites

    International Nuclear Information System (INIS)

    Zheng Yanhong; Shen Zhigang; Cai Chujiang; Ma Shulin; Xing Yushan

    2009-01-01

    Flexural strength and flexural modulus of the composites can be successfully improved by filling nonmetals recycled from waste printed circuit boards (PCBs) into polypropylene (PP). By using scanning electron microscopy (SEM), the influence of nonmetals on fracture behavior of PP composites is investigated by in situ flexural test. Observation results show that the particles can effectively lead to mass micro cracks instead of the breaking crack. The process of the crack initiation, propagation and fiber breakage dissipate a great amount of energy. As a result, the flexural properties of the composites can be reinforced significantly. Results of the in situ SEM observation and analysis to the dynamic flexural process supply effective test evidence for the reinforcing mechanism of the nonmetals/PP composites on the basis of the energy dissipation theory

  10. Application of glass-nonmetals of waste printed circuit boards to produce phenolic moulding compound

    International Nuclear Information System (INIS)

    Guo Jie; Rao Qunli; Xu Zhenming

    2008-01-01

    The aim of this study was to investigate the feasibility of using glass-nonmetals, a byproduct of recycling waste printed circuit boards (PCBs), to replace wood flour in production of phenolic moulding compound (PMC). Glass-nonmetals were attained by two-step crushing and corona electrostatic separating processes. Glass-nonmetals with particle size shorter than 0.07 mm were in the form of single fibers and resin powder, with the biggest portion (up to 34.6 wt%). Properties of PMC with glass-nonmetals (PMCGN) were compared with reference PMC and the national standard of PMC (PF2C3). When the adding content of glass-nonmetals was 40 wt%, PMCGN exhibited flexural strength of 82 MPa, notched impact strength of 2.4 kJ/m 2 , heat deflection temperature of 175 deg. C, and dielectric strength of 4.8 MV/m, all of which met the national standard. Scanning electron microscopy (SEM) showed strong interfacial bonding between glass fibers and the phenolic resin. All the results showed that the use of glass-nonmetals as filler in PMC represented a promising method for resolving the environmental pollutions and reducing the cost of PMC, thus attaining both environmental and economic benefits

  11. Potential up-scaling of inkjet-printed devices for logical circuits in flexible electronics

    Energy Technology Data Exchange (ETDEWEB)

    Mitra, Kalyan Yoti, E-mail: kalyan-yoti.mitra@mb.tu-chemnitz.de, E-mail: enrico.sowade@mb.tu-chemnitz.de; Sowade, Enrico, E-mail: kalyan-yoti.mitra@mb.tu-chemnitz.de, E-mail: enrico.sowade@mb.tu-chemnitz.de [Technische Universität Chemnitz, Department of Digital Printing and Imaging Technology, Chemnitz (Germany); Martínez-Domingo, Carme [Printed Microelectronics Group, CAIAC, Universitat Autònoma de Barcelona, Bellaterra, Spain and Nanobioelectronics and Biosensors Group, Catalan Institute of Nanotechnology (ICN), Universitat Autònoma de Barcelona, Bellaterra, Catalonia (Spain); Ramon, Eloi, E-mail: eloi.ramon@uab.cat [Printed Microelectronics Group, CAIAC, Universitat Autònoma de Barcelona, Bellaterra (Spain); Nanobioelectronics and Biosensors Group, Catalan Institute of Nanotechnology (ICN), Universitat Autònoma de Barcelona, Bellaterra, Catalonia (Spain); Carrabina, Jordi, E-mail: jordi.carrabina@uab.cat [Printed Microelectronics Group, CAIAC, Universitat Autònoma de Barcelona, Bellaterra (Spain); Gomes, Henrique Leonel, E-mail: hgomes@ualg.pt [Universidade do Algarve, Institute of Telecommunications, Faro (Portugal); Baumann, Reinhard R., E-mail: reinhard.baumann@mb.tu-chemnitz.de [Technische Universität Chemnitz, Department of Digital Printing and Imaging Technology, Chemnitz (Germany); Fraunhofer Institute for Electronic Nano Systems (ENAS), Department of Printed Functionalities, Chemnitz (Germany)

    2015-02-17

    Inkjet Technology is often mis-believed to be a deposition/patterning technology which is not meant for high fabrication throughput in the field of printed and flexible electronics. In this work, we report on the 1) printing, 2) fabrication yield and 3) characterization of exemplary simple devices e.g. capacitors, organic transistors etc. which are the basic building blocks for logical circuits. For this purpose, printing is performed first with a Proof of concept Inkjet printing system Dimatix Material Printer 2831 (DMP 2831) using 10 pL small print-heads and then with Dimatix Material Printer 3000 (DMP 3000) using 35 pL industrial print-heads (from Fujifilm Dimatix). Printing at DMP 3000 using industrial print-heads (in Sheet-to-sheet) paves the path towards industrialization which can be defined by printing in Roll-to-Roll format using industrial print-heads. This pavement can be termed as 'Bridging Platform'. This transfer to 'Bridging Platform' from 10 pL small print-heads to 35 pL industrial print-heads help the inkjet-printed devices to evolve on the basis of functionality and also in form of up-scaled quantities. The high printed quantities and yield of inkjet-printed devices justify the deposition reliability and potential to print circuits. This reliability is very much desired when it comes to printing of circuits e.g. inverters, ring oscillator and any other planned complex logical circuits which require devices e.g. organic transistors which needs to get connected in different staged levels. Also, the up-scaled inkjet-printed devices are characterized and they reflect a domain under which they can work to their optimal status. This status is much wanted for predicting the real device functionality and integration of them into a planned circuit.

  12. Potential up-scaling of inkjet-printed devices for logical circuits in flexible electronics

    International Nuclear Information System (INIS)

    Mitra, Kalyan Yoti; Sowade, Enrico; Martínez-Domingo, Carme; Ramon, Eloi; Carrabina, Jordi; Gomes, Henrique Leonel; Baumann, Reinhard R.

    2015-01-01

    Inkjet Technology is often mis-believed to be a deposition/patterning technology which is not meant for high fabrication throughput in the field of printed and flexible electronics. In this work, we report on the 1) printing, 2) fabrication yield and 3) characterization of exemplary simple devices e.g. capacitors, organic transistors etc. which are the basic building blocks for logical circuits. For this purpose, printing is performed first with a Proof of concept Inkjet printing system Dimatix Material Printer 2831 (DMP 2831) using 10 pL small print-heads and then with Dimatix Material Printer 3000 (DMP 3000) using 35 pL industrial print-heads (from Fujifilm Dimatix). Printing at DMP 3000 using industrial print-heads (in Sheet-to-sheet) paves the path towards industrialization which can be defined by printing in Roll-to-Roll format using industrial print-heads. This pavement can be termed as 'Bridging Platform'. This transfer to 'Bridging Platform' from 10 pL small print-heads to 35 pL industrial print-heads help the inkjet-printed devices to evolve on the basis of functionality and also in form of up-scaled quantities. The high printed quantities and yield of inkjet-printed devices justify the deposition reliability and potential to print circuits. This reliability is very much desired when it comes to printing of circuits e.g. inverters, ring oscillator and any other planned complex logical circuits which require devices e.g. organic transistors which needs to get connected in different staged levels. Also, the up-scaled inkjet-printed devices are characterized and they reflect a domain under which they can work to their optimal status. This status is much wanted for predicting the real device functionality and integration of them into a planned circuit

  13. Recovery of copper and lead from waste printed circuit boards by supercritical water oxidation combined with electrokinetic process

    International Nuclear Information System (INIS)

    Xiu Furong; Zhang Fushen

    2009-01-01

    An effective and benign process for copper and lead recovery from waste printed circuit boards (PCBs) was developed. In the process, the PCBs was pre-treated in supercritical water, then subjected to electrokinetic (EK) process. Experimental results showed that supercritical water oxidation (SCWO) process was strong enough to decompose the organic compounds of PCBs, and XRD spectra indicated that copper and lead were oxidized into CuO, Cu 2 O and β-PbO 2 in the process. The optimum SCWO treatment conditions were 60 min, 713 K, 30 MPa, and EK treatment time, constant current density were 11 h, 20 mA cm -2 , respectively. The recovery percentages of copper and lead under optimum SCWO + EK treatment conditions were around 84.2% and 89.4%, respectively. In the optimized EK treatment, 74% of Cu was recovered as a deposit on the cathode with a purity of 97.6%, while Pb was recovered as concentrated solutions in either anode (23.1%) or cathode (66.3%) compartments but little was deposited on the electrodes. It is believed that the process is effective and practical for Cu and Pb recovery from waste electric and electronic equipments.

  14. Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

    Science.gov (United States)

    Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

    2018-03-01

    Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

  15. Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

    Science.gov (United States)

    Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

    2018-06-01

    Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

  16. PUZZLE - A program for computer-aided design of printed circuit artwork

    Science.gov (United States)

    Harrell, D. A. W.; Zane, R.

    1971-01-01

    Program assists in solving spacing problems encountered in printed circuit /PC/ design. It is intended to have maximum use for two-sided PC boards carrying integrated circuits, and also aids design of discrete component circuits.

  17. Organic printed photonics: From microring lasers to integrated circuits.

    Science.gov (United States)

    Zhang, Chuang; Zou, Chang-Ling; Zhao, Yan; Dong, Chun-Hua; Wei, Cong; Wang, Hanlin; Liu, Yunqi; Guo, Guang-Can; Yao, Jiannian; Zhao, Yong Sheng

    2015-09-01

    A photonic integrated circuit (PIC) is the optical analogy of an electronic loop in which photons are signal carriers with high transport speed and parallel processing capability. Besides the most frequently demonstrated silicon-based circuits, PICs require a variety of materials for light generation, processing, modulation, and detection. With their diversity and flexibility, organic molecular materials provide an alternative platform for photonics; however, the versatile fabrication of organic integrated circuits with the desired photonic performance remains a big challenge. The rapid development of flexible electronics has shown that a solution printing technique has considerable potential for the large-scale fabrication and integration of microsized/nanosized devices. We propose the idea of soft photonics and demonstrate the function-directed fabrication of high-quality organic photonic devices and circuits. We prepared size-tunable and reproducible polymer microring resonators on a wafer-scale transparent and flexible chip using a solution printing technique. The printed optical resonator showed a quality (Q) factor higher than 4 × 10(5), which is comparable to that of silicon-based resonators. The high material compatibility of this printed photonic chip enabled us to realize low-threshold microlasers by doping organic functional molecules into a typical photonic device. On an identical chip, this construction strategy allowed us to design a complex assembly of one-dimensional waveguide and resonator components for light signal filtering and optical storage toward the large-scale on-chip integration of microscopic photonic units. Thus, we have developed a scheme for soft photonic integration that may motivate further studies on organic photonic materials and devices.

  18. Exhaust constituent emission factors of printed circuit board pyrolysis processes and its exhaust control

    Energy Technology Data Exchange (ETDEWEB)

    Chiang, Hung-Lung, E-mail: hlchiang@mail.cmu.edu.tw [Department of Health Risk Management, China Medical University, Taichung, Taiwan (China); Lin, Kuo-Hsiung [Department of Environmental Engineering and Science, Fooyin University, Kaohsiung, Taiwan (China)

    2014-01-15

    Highlights: • Recycling of waste printed circuit boards is an important issue. • Pyrolysis is an emerging technology for PCB treatment. • Emission factors of VOCs are determined for PCB pyrolysis exhaust. • Iron-Al{sub 2}O{sub 3} catalyst was employed for the exhaust control. -- Abstract: The printed circuit board (PCB) is an important part of electrical and electronic equipment, and its disposal and the recovery of useful materials from waste PCBs (WPCBs) are key issues for waste electrical and electronic equipment. Waste PCB compositions and their pyrolysis characteristics were analyzed in this study. In addition, the volatile organic compound (VOC) exhaust was controlled by an iron-impregnated alumina oxide catalyst. Results indicated that carbon and oxygen were the dominant components (hundreds mg/g) of the raw materials, and other elements such as nitrogen, bromine, and copper were several decades mg/g. Exhaust constituents of CO, H{sub 2}, CH{sub 4}, CO{sub 2}, and NOx, were 60–115, 0.4–4.0, 1.1–10, 30–95, and 0–0.7 mg/g, corresponding to temperatures ranging from 200 to 500 °C. When the pyrolysis temperature was lower than 300 °C, aromatics and paraffins were the major species, contributing 90% of ozone precursor VOCs, and an increase in the pyrolysis temperature corresponded to a decrease in the fraction of aromatic emission factors. Methanol, ethylacetate, acetone, dichloromethane, tetrachloromethane and acrylonitrile were the main species of oxygenated and chlorinated VOCs. The emission factors of some brominated compounds, i.e., bromoform, bromophenol, and dibromophenol, were higher at temperatures over 400 °C. When VOC exhaust was flowed through the bed of Fe-impregnated Al{sub 2}O{sub 3}, the emission of ozone precursor VOCs could be reduced by 70–80%.

  19. Development and verification of printed circuit board toroidal transformer model

    DEFF Research Database (Denmark)

    Pejtersen, Jens; Mønster, Jakob Døllner; Knott, Arnold

    2013-01-01

    An analytical model of an air core printed circuit board embedded toroidal transformer configuration is presented. The transformer has been developed for galvanic isolation of very high frequency switch-mode dc-dc power converter applications. The theoretical model is developed and verified...... by comparing calculated parameters with 3D finite element simulations and experimental measurement results. The developed transformer model shows good agreement with the simulated and measured results. The model can be used to predict the parameters of printed circuit board toroidal transformer configurations...

  20. Highly Conductive Nano-Silver Circuits by Inkjet Printing

    Science.gov (United States)

    Zhu, Dongbin; Wu, Minqiang

    2018-06-01

    Inkjet technology has become popular in the field of printed electronics due to its superior properties such as simple processes and printable complex patterns. Electrical conductivity of the circuits is one of the key factors in measuring the performance of printed electronics, which requires great material properties and a manufactured process. With excellent conductivity and ductility, silver is an ideal material as the wire connecting components. This review summarizes the progress of conductivity studies on inkjet printed nano-silver lines, including ink composition and nanoparticle morphology, deposition of nano-silver lines with uniform and high aspect ratios, sintering mechanisms and alternative methods of thermal sintering. Finally, the research direction on inkjet printed electronics is proposed.

  1. Development of a miniaturized watch-type dosimeter using a silicon printed-circuit board

    International Nuclear Information System (INIS)

    Ishikura, Takeshi; Sakamaki, Tsuyoshi; Matsumoto, Iwao; Aoyama, Kei; Nakamura, Takashi

    2008-01-01

    The electrical personal dosimeter using a silicon semiconductor sensor has the advantage of real time response and alarm function, which can prevent unexpected over-exposure. We tried to develop a miniaturized watch-type dosimeter by incorporating the silicon semiconductor sensor on a silicon printed-circuit board. Thin film resistors, capacitors and wiring patterns are formed on a downsized printed-circuit board. Electronic parts including transistors are mounted by soldering on the silicon printed-circuit board. The dosimeter is further miniaturized by downsizing the amplifier circuit, the semiconductor radiation sensor, the power supply circuit, setting parts and alarm part. The performance of the developed dosimeter was evaluated with respect to the gamma-ray spectra, angular dependence and linearity to dose equivalent rate, and it was confirmed that this dosimeter has the performance equivalent to a commercially available electrical personal dosimeter. (author)

  2. A novel reutilization method for waste printed circuit boards as flame retardant and smoke suppressant for poly (vinyl chloride)

    Energy Technology Data Exchange (ETDEWEB)

    Xiu, Fu-Rong, E-mail: xiu_chem@hotmail.com [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350108 (China); Weng, Huiwei; Qi, Yingying; Yu, Gending; Zhang, Zhigang [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350108 (China); Zhang, Fu-Shen [Research Center for Eco-Environmental Sciences, Chinese Academy of Sciences, Beijing 100085 (China)

    2016-09-05

    Highlights: • We report a novel electronic waste-based flame retardant for PVC. • The SCWO-treated PCBs significantly improves the flame retardancy of PVC. • The flame retardant mechanism of SCWO-treated PCBs was studied. • Appropriate amount flame retardant does not degrade the mechanical property of PVC. - Abstract: In this study, a novel reutilization method for waste printed circuit boards (PCBs) as flame retardant and smoke suppressant for poly (vinyl chloride) (PVC) was successfully testified. A supercritical water oxidation (SCWO) process was applied to treat waste PCBs before they could be used as flame retardants of PVC. The results indicated that SCWO conditions had a significant effect on the flame retarding and smoke suppressing properties of waste PCBs for PVC. Cu{sub 2}O, CuO, and SnO{sub 2} were the main active ingredients in waste PCBs-derived flame retardants. A conversion of Cu elements (Cu{sup 0} → Cu{sup +} → Cu{sup 2+}) during SCWO process with the increase of reaction temperature was found to be the key influence factor for the flame retarding properties of SCWO-treated PCBs. The experiment results also showed that there was a synergistic effect of flame retardancy between Cu{sup +} and Cu{sup 2+}. After the optimized SCWO treatment, SCWO-treated PCBs significantly improved the flame retardancy and smoke suppression of PVC. Limiting oxygen index (LOI) and char yield (CY) increased with increasing SCWO-treated PCBs content in PVC, while smoke density rating (SDR) and maximum smoke density (MSD) decreased markedly. The mechanical properties of PVC samples were influenced in different degree by adding different content SCWO-treated PCBs.

  3. A novel reutilization method for waste printed circuit boards as flame retardant and smoke suppressant for poly (vinyl chloride)

    International Nuclear Information System (INIS)

    Xiu, Fu-Rong; Weng, Huiwei; Qi, Yingying; Yu, Gending; Zhang, Zhigang; Zhang, Fu-Shen

    2016-01-01

    Highlights: • We report a novel electronic waste-based flame retardant for PVC. • The SCWO-treated PCBs significantly improves the flame retardancy of PVC. • The flame retardant mechanism of SCWO-treated PCBs was studied. • Appropriate amount flame retardant does not degrade the mechanical property of PVC. - Abstract: In this study, a novel reutilization method for waste printed circuit boards (PCBs) as flame retardant and smoke suppressant for poly (vinyl chloride) (PVC) was successfully testified. A supercritical water oxidation (SCWO) process was applied to treat waste PCBs before they could be used as flame retardants of PVC. The results indicated that SCWO conditions had a significant effect on the flame retarding and smoke suppressing properties of waste PCBs for PVC. Cu_2O, CuO, and SnO_2 were the main active ingredients in waste PCBs-derived flame retardants. A conversion of Cu elements (Cu"0 → Cu"+ → Cu"2"+) during SCWO process with the increase of reaction temperature was found to be the key influence factor for the flame retarding properties of SCWO-treated PCBs. The experiment results also showed that there was a synergistic effect of flame retardancy between Cu"+ and Cu"2"+. After the optimized SCWO treatment, SCWO-treated PCBs significantly improved the flame retardancy and smoke suppression of PVC. Limiting oxygen index (LOI) and char yield (CY) increased with increasing SCWO-treated PCBs content in PVC, while smoke density rating (SDR) and maximum smoke density (MSD) decreased markedly. The mechanical properties of PVC samples were influenced in different degree by adding different content SCWO-treated PCBs.

  4. CAD-CAM printed circuit board design

    Science.gov (United States)

    Agy, W. E.

    A step-by-step procedure for a printed circuit design achieved by CAD is presented. The operator at the interactive CRT station moves a stylus across a graphics tablet and intersperses commands which result in computer-generated pictorial forms on the screen that were drawn on the pad. Standard symbols are used for commands allowing, for instance, connections to be made of specific types in certain locations, which can be automatically edited from a materials list. An entire network of drawn lines can be referenced by a signal name for recall, and a finished circuit schematic can be checked for designs rules compliance, including fault reporting in terms of designator/pin number. A map may be present delineating the boundaries of the circuitry area, and previously completed circuitry segments can be recalled for piece-by-piece assembly of the circuit board.

  5. Optimizing the operating parameters of corona electrostatic separation for recycling waste scraped printed circuit boards by computer simulation of electric field.

    Science.gov (United States)

    Li, Jia; Lu, Hongzhou; Liu, Shushu; Xu, Zhenming

    2008-05-01

    The printed circuit board (PCB) has a metal content of nearly 28% metal, including an abundance of nonferrous metals such as copper, lead, and tin. The purity of precious metals in PCBs is more than 10 times that of rich-content minerals. Therefore, the recycling of PCBs is an important subject, not only from the viewpoint of waste treatment, but also with respect to the recovery of valuable materials. Compared with traditional process the corona electrostatic separation (CES) had no waste water or gas during the process and it had high productivity with a low-energy cost. In this paper, the roll-type corona electrostatic separator was used to separate metals and nonmetals from scraped waste PCBs. The software MATLAB was used to simulate the distribution of electric field in separating space. It was found that, the variations of parameters of electrodes and applied voltages directly influenced the distribution of electric field. Through the correlation of simulated and experimental results, the good separation results were got under the optimized operating parameter: U=20-30 kV, L=L(1)=L(2)=0.21 m, R(1)=0.114, R(2)=0.019 m, theta(1)=20 degrees and theta(2)=60 degrees .

  6. Assembling surface mounted components on ink-jet printed double sided paper circuit board

    International Nuclear Information System (INIS)

    Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Sidén, Johan; Nilsson, Hans-Erik; Hummelgård, Magnus; Olin, Håkan; Hummelgård, Christine

    2014-01-01

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed. (paper)

  7. Assembling surface mounted components on ink-jet printed double sided paper circuit board.

    Science.gov (United States)

    Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Hummelgård, Magnus; Sidén, Johan; Hummelgård, Christine; Olin, Håkan; Nilsson, Hans-Erik

    2014-03-07

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.

  8. Assembling surface mounted components on ink-jet printed double sided paper circuit board

    Energy Technology Data Exchange (ETDEWEB)

    Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Sidén, Johan; Nilsson, Hans-Erik [Department of Electronics Design, Mid Sweden University, SE-851 70 Sundsvall (Sweden); Hummelgård, Magnus; Olin, Håkan [Department of Natural Science, Mid Sweden University, SE-851 70 Sundsvall (Sweden); Hummelgård, Christine [Acreo Swedish ICT AB, Håstaholmen 4, SE-824 42 Hudiksvall (Sweden)

    2014-03-07

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed. (paper)

  9. Comparative study on copper leaching from waste printed circuit boards by typical ionic liquid acids.

    Science.gov (United States)

    Chen, Mengjun; Huang, Jinxiu; Ogunseitan, Oladele A; Zhu, Nengming; Wang, Yan-min

    2015-07-01

    Waste printed circuit boards (WPCBs) are attracting increasing concerns because the recovery of its content of valuable metallic resources is hampered by the presence of hazardous substances. In this study, we used ionic liquids (IL) to leach copper from WPCBs. [BSO3HPy]OTf, [BSO3HMIm]OTf, [BSO4HPy]HSO4, [BSO4HMim]HSO4 and [MIm]HSO4 were selected. Factors that affect copper leaching rate were investigated in detail and their leaching kinetics were also examined with the comparison of [Bmim]HSO4. The results showed that all six IL acids could successfully leach copper out, with near 100% recovery. WPCB particle size and leaching time had similar influences on copper leaching performance, while IL acid concentration, hydrogen peroxide addition, solid to liquid ratio, temperature, showed different influences. Moreover, IL acid with HSO4(-) was more efficient than IL acid with CF3SO3(-). These six IL acids indicate a similar behavior with common inorganic acids, except temperature since copper leaching rate of some IL acids decreases with its increase. The results of leaching kinetics studies showed that diffusion plays a more important role than surface reaction, whereas copper leaching by inorganic acids is usually controlled by surface reaction. This innovation provides a new option for recovering valuable materials such as copper from WPCBs. Copyright © 2015 Elsevier Ltd. All rights reserved.

  10. A Printed Organic Circuit System for Wearable Amperometric Electrochemical Sensors.

    Science.gov (United States)

    Shiwaku, Rei; Matsui, Hiroyuki; Nagamine, Kuniaki; Uematsu, Mayu; Mano, Taisei; Maruyama, Yuki; Nomura, Ayako; Tsuchiya, Kazuhiko; Hayasaka, Kazuma; Takeda, Yasunori; Fukuda, Takashi; Kumaki, Daisuke; Tokito, Shizuo

    2018-04-23

    Wearable sensor device technologies, which enable continuous monitoring of biological information from the human body, are promising in the fields of sports, healthcare, and medical applications. Further thinness, light weight, flexibility and low-cost are significant requirements for making the devices attachable onto human tissues or clothes like a patch. Here we demonstrate a flexible and printed circuit system consisting of an enzyme-based amperometric sensor, feedback control and amplification circuits based on organic thin-film transistors. The feedback control and amplification circuits based on pseudo-CMOS inverters were successfuly integrated by printing methods on a plastic film. This simple system worked very well like a potentiostat for electrochemical measurements, and enabled the quantitative and real-time measurement of lactate concentration with high sensitivity of 1 V/mM and a short response time of a hundred seconds.

  11. Modelling, analysis, and acceleration of a printed circuit board ...

    Indian Academy of Sciences (India)

    Springer Verlag Heidelberg #4 2048 1996 Dec 15 10:16:45

    discuss lead time reduction in a qualitative way with illustrative case studies. Krishnan ... industry practices, and research questions that should drive new methods and computer ... There are three types of printed circuit boards available today.

  12. Merging polygons on two-layer printed circuit board

    Directory of Open Access Journals (Sweden)

    Murov S. Yu.

    2011-12-01

    Full Text Available A method is proposed for solving the problem of connection of maximum number of isolated islands of metallized areas of the same chain, located on different layers of the printed circuit board. The method can be used in the automatic tracing of the boards.

  13. Analytical Study on Thermal and Mechanical Design of Printed Circuit Heat Exchanger

    Energy Technology Data Exchange (ETDEWEB)

    Yoon, Su-Jong [Idaho National Lab. (INL), Idaho Falls, ID (United States); Sabharwall, Piyush [Idaho National Lab. (INL), Idaho Falls, ID (United States); Kim, Eung-Soo [Idaho National Lab. (INL), Idaho Falls, ID (United States)

    2013-09-01

    The analytical methodologies for the thermal design, mechanical design and cost estimation of printed circuit heat exchanger are presented in this study. In this study, three flow arrangements of parallel flow, countercurrent flow and crossflow are taken into account. For each flow arrangement, the analytical solution of temperature profile of heat exchanger is introduced. The size and cost of printed circuit heat exchangers for advanced small modular reactors, which employ various coolants such as sodium, molten salts, helium, and water, are also presented.

  14. RECYCLING OF PRINTED CIRCUIT BOARDS AIMING SILVER RECOVERY: A HYDROMETALLURGICAL ROUTE STUDY

    Directory of Open Access Journals (Sweden)

    Marcos Paulo Kohler Caldas

    2015-06-01

    Full Text Available The aim of this paper is characterize printed circuit board of computers and propose a hydrometallurgical route for silver recovery present in its composition. Initially, the printed circuit board was comminuted in both knife and hammer mills. The comminuted material was characterized by sieve analysis, chemical analysis by inductively coupled plasma optical emission spectrometry (ICP-OES and loss on ignition. Leaching tests were conducted in sulfuric acid, sulfuric acid in an oxidizing medium and nitric acid. The results indicated that the printed circuit board is mainly composed of copper (19.42%. Silver content of 0.045% was found. The route for silver recovery was leaching in sulfuric acid at 75°C for 18 hours. Then, leaching in sulfuric acid at 75°C in an oxidizing medium for 6 hours and nitric acid leaching at room temperature for 2 hours. Through of this route, 96.6% of silver was recovered.

  15. Prioritizing material recovery for end-of-life printed circuit boards

    International Nuclear Information System (INIS)

    Wang Xue; Gaustad, Gabrielle

    2012-01-01

    Highlights: ► Material recovery driven by composition, choice of ranking, and weighting. ► Economic potential for new recycling technologies quantified for several metrics. ► Indicators developed for materials incurring high eco-toxicity costs. ► Methodology useful for a variety of stakeholders, particularly policy-makers. - Abstract: The increasing growth in generation of electronic waste (e-waste) motivates a variety of waste reduction research. Printed circuit boards (PCBs) are an important sub-set of the overall e-waste stream due to the high value of the materials contained within them and potential toxicity. This work explores several environmental and economic metrics for prioritizing the recovery of materials from end-of-life PCBs. A weighted sum model is used to investigate the trade-offs among economic value, energy saving potentials, and eco-toxicity. Results show that given equal weights for these three sustainability criteria gold has the highest recovery priority, followed by copper, palladium, aluminum, tin, lead, platinum, nickel, zinc, and silver. However, recovery priority will change significantly due to variation in the composition of PCBs, choice of ranking metrics, and weighting factors when scoring multiple metrics. These results can be used by waste management decision-makers to quantify the value and environmental savings potential for recycling technology development and infrastructure. They can also be extended by policy-makers to inform possible penalties for land-filling PCBs or exporting to the informal recycling sector. The importance of weighting factors when examining recovery trade-offs, particularly for policies regarding PCB collection and recycling are explored further.

  16. Novel Application of Glass Fibers Recovered From Waste Printed Circuit Boards as Sound and Thermal Insulation Material

    Science.gov (United States)

    Sun, Zhixing; Shen, Zhigang; Ma, Shulin; Zhang, Xiaojing

    2013-10-01

    The aim of this study is to investigate the feasibility of using glass fibers, a recycled material from waste printed circuit boards (WPCB), as sound absorption and thermal insulation material. Glass fibers were obtained through a fluidized-bed recycling process. Acoustic properties of the recovered glass fibers (RGF) were measured and compared with some commercial sound absorbing materials, such as expanded perlite (EP), expanded vermiculite (EV), and commercial glass fiber. Results show that RGF have good sound absorption ability over the whole tested frequency range (100-6400 Hz). The average sound absorption coefficient of RGF is 0.86, which is prior to those of EP (0.81) and EV (0.73). Noise reduction coefficient analysis indicates that the absorption ability of RGF can meet the requirement of II rating for sound absorbing material according to national standard. The thermal insulation results show that RGF has a fair low thermal conductivity (0.046 W/m K), which is comparable to those of some insulation materials (i.e., EV, EP, and rock wool). Besides, an empirical dependence of thermal conductivity on material temperature was determined for RGF. All the results showed that the reuse of RGF for sound and thermal insulation material provided a promising way for recycling WPCB and obtaining high beneficial products.

  17. Eco-friendly copper recovery process from waste printed circuit boards using Fe³⁺/Fe²⁺ redox system.

    Science.gov (United States)

    Fogarasi, Szabolcs; Imre-Lucaci, Florica; Egedy, Attila; Imre-Lucaci, Árpád; Ilea, Petru

    2015-06-01

    The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe(3+) combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%. Copyright © 2015 Elsevier Ltd. All rights reserved.

  18. Fabrication of Ultra-Thin Printed Organic TFT CMOS Logic Circuits Optimized for Low-Voltage Wearable Sensor Applications.

    Science.gov (United States)

    Takeda, Yasunori; Hayasaka, Kazuma; Shiwaku, Rei; Yokosawa, Koji; Shiba, Takeo; Mamada, Masashi; Kumaki, Daisuke; Fukuda, Kenjiro; Tokito, Shizuo

    2016-05-09

    Ultrathin electronic circuits that can be manufactured by using conventional printing technologies are key elements necessary to realize wearable health sensors and next-generation flexible electronic devices. Due to their low level of power consumption, complementary (CMOS) circuits using both types of semiconductors can be easily employed in wireless devices. Here, we describe ultrathin CMOS logic circuits, for which not only the source/drain electrodes but also the semiconductor layers were printed. Both p-type and n-type organic thin film transistor devices were employed in a D-flip flop circuit in the newly developed stacked structure and exhibited excellent electrical characteristics, including good carrier mobilities of 0.34 and 0.21 cm(2) V(-1) sec(-1), and threshold voltages of nearly 0 V with low operating voltages. These printed organic CMOS D-flip flop circuits exhibit operating frequencies of 75 Hz and demonstrate great potential for flexible and printed electronics technology, particularly for wearable sensor applications with wireless connectivity.

  19. Development of an Economical Interfacing Circuit for Upgrading of SEM Data Printing System

    International Nuclear Information System (INIS)

    Punnachaiya, S.; Thong-Aram, D.

    2002-01-01

    The operating conditions of a Scanning Electron Microscope (SEM) i.e., magnification, accelerating voltage, micron mark and film identification labeling, are very important for the accurate interpretation of a micrograph picture. In the old model SEM, the built-in data printing system for film identification can be inputted only the numerical number. This will be made a confusing problems when various operating conditions were applied in routine work. An economical interfacing circuit, therefore, was developed to upgrade the data printing system for capable of alphanumerical labeling. The developed circuit was tested on both data printing systems of JSM-T220 and JSM-T330 (JEOL SEM). It was found that the interfacing function worked properly and easily installed

  20. Gas microstrip detectors based on flexible printed circuit

    International Nuclear Information System (INIS)

    Salomon, M.; Crowe, K.; Faszer, W.; Lindsay, P.; Curran Maier, J.M.

    1995-09-01

    We have studied the properties of a new type of Gas Microstrip Counter built using flexible printed circuit technology. We describe the manufacturing procedures, the assembly of the device, as well as its operation under a variety of conditions, gases and types of radiation. We also describe two new passivation materials, Tantalum and Niobium, which produce effective surfaces. (author)

  1. Recovery of high purity precious metals from printed circuit boards

    International Nuclear Information System (INIS)

    Park, Young Jun; Fray, Derek J.

    2009-01-01

    Waste printed circuit boards (WPCB) have an inherent value because of the precious metal content. For an effective recycling of WPCB, it is essential to recover the precious metals. This paper reports a promising method to recover the precious metals. Aqua regia was used as a leachant and the ratio between metals and leachant was fixed at 1/20 (g/ml). Silver is relatively stable so the amount of about 98 wt.% of the input was recovered without an additional treatment. Palladium formed a red precipitate during dissolution, which were consisted of Pd(NH 4 ) 2 Cl 6 . The amount precipitated was 93 wt.% of the input palladium. A liquid-liquid extraction with toluene was used to extract gold selectively. Also, dodecanethiol and sodium borohydride solution were added to make gold nanoparticles. Gold of about 97 wt.% of the input was recovered as nanoparticles which was identified with a high-resolution transmission electron microscopy through selected area electron diffraction and nearest-neighbor lattice spacing.

  2. Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment.

    Science.gov (United States)

    Xiu, Fu-Rong; Qi, Yingying; Zhang, Fu-Shen

    2015-07-01

    Precious metals are the most attractive resources in waste printed circuit boards (PCBs) of mobile phones. In this work, an alternative process for recovering Au, Ag, and Pd from waste PCBs of mobile phones by supercritical water oxidation (SCWO) pre-treatment combined with iodine-iodide leaching process was developed. In the process, the waste PCBs of mobile phones were pre-treated in supercritical water, then a diluted hydrochloric acid leaching (HL) process was used to recovery the Cu, whose leaching efficiency was approximately 100%, finally the resulting residue was subjected to the iodine-iodide leaching process for recovering the Au, Ag, and Pd. Experimental results indicated that SCWO pre-treatment temperature, time, and pressure had significant influence on the Au, Ag, and Pd leaching from (SCWO+HL)-treated waste PCBs. The optimal SCWO pre-treatment conditions were 420°C and 60min for Au and Pd, and 410°C and 30min for Ag. The optimum dissolution parameters for Au, Pd, and Ag in (SCWO+HL)-treated PCBs with iodine-iodide system were leaching time of 120min (90min for Ag), iodine/iodide mole ratio of 1:5 (1:6 for Ag), solid-to-liquid ratio (S/L) of 1:10g/mL (1:8g/mL for Ag), and pH of 9, respectively. It is believed that the process developed in this study is environment friendly for the recovery of Au, Ag, and Pd from waste PCBs of mobile phones by SCWO pre-treatment combined with iodine-iodide leaching process. Copyright © 2015 Elsevier Ltd. All rights reserved.

  3. Morphology, mechanical and thermal oxidative aging properties of HDPE composites reinforced by nonmetals recycled from waste printed circuit boards.

    Science.gov (United States)

    Yang, Shuangqiao; Bai, Shibing; Wang, Qi

    2016-11-01

    In this study nonmetals recycled from waste printed circuit boards (NPCB) is used as reinforce fillers in high-density polyethylene (HDPE) composites. The morphology, mechanical and thermal oxidative aging properties of NPCB reinforced HDPE composites are assessed and it compared with two other commercial functional filler for the first time. Mechanical test results showed that NPCB could be used as reinforcing fillers in the HDPE composites and mechanical properties especially for stiffness is better than other two commercial fillers. The improved mechanical property was confirmed by the higher aspect ratio and strong interfacial adhesion in scanning electron microscopy (SEM) studies. The heat deflection temperature (HDT) test showed the presence of fiberglass in NPCB can improve the heat resistance of composite for their potential applications. Meanwhile, the oxidation induction time (OIT) and the Fourier transform infrared (FTIR) spectroscopy results showed that NPCB has a near resistance to oxidation as two other commercial fillers used in this paper. The above results show the reuse of NPCB in the HDPE composites represents a promising way for resolving both the environmental pollution and the high-value reuse of resources. Copyright © 2015. Published by Elsevier Ltd.

  4. Inkjet printed large-area flexible circuits: a simple methodology for optimizing the printing quality

    Science.gov (United States)

    Cheng, Tao; Wu, Youwei; Shen, Xiaoqin; Lai, Wenyong; Huang, Wei

    2018-01-01

    In this work, a simple methodology was developed to enhance the patterning resolution of inkjet printing, involving process optimization as well as substrate modification and treatment. The line width of the inkjet-printed silver lines was successfully reduced to 1/3 of the original value using this methodology. Large-area flexible circuits with delicate patterns and good morphology were thus fabricated. The resultant flexible circuits showed excellent electrical conductivity as low as 4.5 Ω/□ and strong tolerance to mechanical bending. The simple methodology is also applicable to substrates with various wettability, which suggests a general strategy to enhance the printing quality of inkjet printing for manufacturing high-performance large-area flexible electronics. Project supported by the National Key Basic Research Program of China (Nos. 2014CB648300, 2017YFB0404501), the National Natural Science Foundation of China (Nos. 21422402, 21674050), the Natural Science Foundation of Jiangsu Province (Nos. BK20140060, BK20130037, BK20140865, BM2012010), the Program for Jiangsu Specially-Appointed Professors (No. RK030STP15001), the Program for New Century Excellent Talents in University (No. NCET-13-0872), the NUPT "1311 Project" and Scientific Foundation (Nos. NY213119, NY213169), the Synergetic Innovation Center for Organic Electronics and Information Displays, the Priority Academic Program Development of Jiangsu Higher Education Institutions (PAPD), the Leading Talent of Technological Innovation of National Ten-Thousands Talents Program of China, the Excellent Scientific and Technological Innovative Teams of Jiangsu Higher Education Institutions (No. TJ217038), the Program for Graduate Students Research and Innovation of Jiangsu Province (No. KYZZ16-0253), and the 333 Project of Jiangsu Province (Nos. BRA2017402, BRA2015374).

  5. Real-time monitoring system for improving corona electrostatic separation in the process of recovering waste printed circuit boards.

    Science.gov (United States)

    Li, Jia; Zhou, Quan; Xu, Zhenming

    2014-12-01

    Although corona electrostatic separation is successfully used in recycling waste printed circuit boards in industrial applications, there are problems that cannot be resolved completely, such as nonmetal particle aggregation and spark discharge. Both of these problems damage the process of separation and are not easy to identify during the process of separation in industrial applications. This paper provides a systematic study on a real-time monitoring system. Weight monitoring systems were established to continuously monitor the separation process. A Virtual Instrumentation program written by LabVIEW was utilized to sample and analyse the mass increment of the middling product. It includes four modules: historical data storage, steady-state analysis, data computing and alarm. Three kinds of operating conditions were used to verify the applicability of the monitoring system. It was found that the system achieved the goal of monitoring during the separation process and realized the function of real-time analysis of the received data. The system also gave comprehensible feedback on the accidents of material blockages in the feed inlet and high-voltage spark discharge. With the warning function of the alarm system, the whole monitoring system could save the human cost and help the new technology to be more easily applied in industry. © The Author(s) 2014.

  6. Characterization of Printed Circuit Boards for Metal and Energy Recovery after Milling and Mechanical Separation

    Directory of Open Access Journals (Sweden)

    Waldir A. Bizzo

    2014-06-01

    Full Text Available The proper disposal of electrical and electronic waste is currently a concern of researchers and environmental managers not only because of the large volume of such waste generated, but also because of the heavy metals and toxic substances it contains. This study analyzed printed circuit boards (PCBs from discarded computers to determine their metal content and characterized them as solid waste and fuel. The analysis showed that PCBs consist of approximately 26% metal, made up mainly of copper, lead, aluminum, iron and tin, as well as other heavy metals such as cadmium and nickel. Comparison with the results of other studies indicated that the concentration of precious metals (gold and silver has declined over time. Analysis of the leachate revealed high concentrations of cadmium and lead, giving the residue the characteristics of hazardous waste. After milling the PCBs, we found that larger amounts of metal were concentrated in smaller fractions, while the lightest fraction, obtained by density separation, had a gross calorific value of approximately 11 MJ/kg, although with a high ash content. Milling followed by density separation proved potentially useful for recovery of metals and energy-rich fractions.

  7. An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards

    Directory of Open Access Journals (Sweden)

    Bruno de Castro Braz

    Full Text Available Abstract Aerospace vehicles are mostly exposed to random vibration loads during its operational lifetime. These harsh conditions excites vibration responses in the vehicles printed circuit boards, what can cause failure on mission functionality due to fatigue damage of electronic components. A novel analytical model to evaluate the useful life of embedded electronic components (capacitors, chips, oscillators etc. mounted on Printed Circuit Boards (PCB is presented. The fatigue damage predictions are calculated by the relative displacement between the PCB and the component, the lead stiffness, as well the natural vibration modes of the PCB and the component itself. Statistical methods are used for fatigue cycle counting. The model is applied to experimental fatigue tests of PCBs available on literature. The analytical results are of the same magnitude order of the experimental findings.

  8. Printed circuit board permittivity measurement using waveguide and resonator rings

    NARCIS (Netherlands)

    Op 't Land, Sjoerd; Tereshchenko, O.V.; Ramdani, Mohamed; Leferink, Frank Bernardus Johannes; Perdriau, Richard

    2014-01-01

    Knowing the frequency dependent complex permittivity of Printed Circuit Board (PCB) substrates is important in modern electronics. In this paper, two methods for measuring the permittivity are applied to the same Flame Resistant (FR4) substrate and the results are compared. The reference measurement

  9. Toward printed integrated circuits based on unipolar or ambipolar polymer semiconductors.

    Science.gov (United States)

    Baeg, Kang-Jun; Caironi, Mario; Noh, Yong-Young

    2013-08-21

    For at least the past ten years printed electronics has promised to revolutionize our daily life by making cost-effective electronic circuits and sensors available through mass production techniques, for their ubiquitous applications in wearable components, rollable and conformable devices, and point-of-care applications. While passive components, such as conductors, resistors and capacitors, had already been fabricated by printing techniques at industrial scale, printing processes have been struggling to meet the requirements for mass-produced electronics and optoelectronics applications despite their great potential. In the case of logic integrated circuits (ICs), which constitute the focus of this Progress Report, the main limitations have been represented by the need of suitable functional inks, mainly high-mobility printable semiconductors and low sintering temperature conducting inks, and evoluted printing tools capable of higher resolution, registration and uniformity than needed in the conventional graphic arts printing sector. Solution-processable polymeric semiconductors are the best candidates to fulfill the requirements for printed logic ICs on flexible substrates, due to their superior processability, ease of tuning of their rheology parameters, and mechanical properties. One of the strongest limitations has been mainly represented by the low charge carrier mobility (μ) achievable with polymeric, organic field-effect transistors (OFETs). However, recently unprecedented values of μ ∼ 10 cm(2) /Vs have been achieved with solution-processed polymer based OFETs, a value competing with mobilities reported in organic single-crystals and exceeding the performances enabled by amorphous silicon (a-Si). Interestingly these values were achieved thanks to the design and synthesis of donor-acceptor copolymers, showing limited degree of order when processed in thin films and therefore fostering further studies on the reason leading to such improved charge

  10. E-waste: development of recycling process and chemical characterization of circuit printed - motherboard

    International Nuclear Information System (INIS)

    Junior, O.L.F.; Vargas, R.A.; Andreoli, M.; Martinelli, J.R.; Seo, E.S.M.

    2011-01-01

    The electro-electronic industry has been regulated by the National Politic of Solid Residues Act (PNRS) and Bill no. 7.404, concerning the actions, procedures, and method to collect, recycle and promotion of environmentally acceptable final destination of residues. The present work contributes to develop recycling process of printed circuit used in microcomputers and in its chemical characterization. The experimental procedure consisted of grinding, classification, magnetic and electrostatic separation, and separation based on density difference, followed by chemical characterization of the metallic and non metallic materials in the motherboard. It was determined that the amounts of Ag, Al, Ba, Cl, Cr, Cu, Fe, Mn, Pb, and Zn in the residue are above the toxicity allowable levels, and they are in the samples of the decanted material. Among the samples of the floating material, Al, Ba, Br, Ca, Cu, Fe, Pb (in less quantity), Si (in more quantity), and Sn, Ti and Zn were detected. Those materials can be useful in the preparation of red ceramics. (author)

  11. A novel and simple method of printing flexible conductive circuits on PET fabrics

    International Nuclear Information System (INIS)

    Wang, Zehong; Wang, Wei; Jiang, Zhikang; Yu, Dan

    2017-01-01

    Highlights: • A simple preparation of nano-silver conductive ink was proposed. • Conductive pattern was printed on PET fabrics without heat sintering. • The surface resistivity of printed pattern is low to 0.197 Ω cm. - Abstract: Flexible conductive circuits on PET fabrics were fabricated by a simple approach. Firstly, well dispersed nano-silver colloids with average size of 87 nm were synthesized with poly (vinyl pyrrolidone). Then, by adding polyurethane and thickening agent into these colloids, Ag NP-based ink was produced and printed on PET fabrics by screen printing. Conductive patterns were achieved through the swelling process of polyurethane and the decrease of contact resistance between nano-silver particles when immersed in dichloromethane (DCM) and diallyldimethylammonium chloride (DMDAAC) mixed solution. After it was dried at 40 °C,the surface resistivity was about 0.197 Ω cm with width 1.9 mm, and thickness 20 μm. Moreover, the effects of different DCM contents on the conductivity and the film forming ability have been investigated. We believe these foundings will provide some important analysis for printing flexible conductive circuits on textiles.

  12. A novel and simple method of printing flexible conductive circuits on PET fabrics

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Zehong; Wang, Wei [College of Chemistry, Chemical Engineering and Biotechnology, Donghua University, Shanghai 201620 (China); Key Laboratory of Textile Science & Technology, Ministry of Education (China); Jiang, Zhikang [Saintyear Holding Group Co., Ltd. (China); Yu, Dan, E-mail: vchtian@163.com [College of Chemistry, Chemical Engineering and Biotechnology, Donghua University, Shanghai 201620 (China); Key Laboratory of Textile Science & Technology, Ministry of Education (China); Saintyear Holding Group Co., Ltd. (China)

    2017-02-28

    Highlights: • A simple preparation of nano-silver conductive ink was proposed. • Conductive pattern was printed on PET fabrics without heat sintering. • The surface resistivity of printed pattern is low to 0.197 Ω cm. - Abstract: Flexible conductive circuits on PET fabrics were fabricated by a simple approach. Firstly, well dispersed nano-silver colloids with average size of 87 nm were synthesized with poly (vinyl pyrrolidone). Then, by adding polyurethane and thickening agent into these colloids, Ag NP-based ink was produced and printed on PET fabrics by screen printing. Conductive patterns were achieved through the swelling process of polyurethane and the decrease of contact resistance between nano-silver particles when immersed in dichloromethane (DCM) and diallyldimethylammonium chloride (DMDAAC) mixed solution. After it was dried at 40 °C,the surface resistivity was about 0.197 Ω cm with width 1.9 mm, and thickness 20 μm. Moreover, the effects of different DCM contents on the conductivity and the film forming ability have been investigated. We believe these foundings will provide some important analysis for printing flexible conductive circuits on textiles.

  13. Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment

    International Nuclear Information System (INIS)

    Xiu, Fu-Rong; Qi, Yingying; Zhang, Fu-Shen

    2015-01-01

    Highlights: • We report a novel process for recovering Au, Ag, and Pd from waste PCBs. • The effect of SCWO on the leaching of Au, Ag, and Pd in waste PCBs was studied. • SCWO was highly efficient for enhancing the leaching of Au, Ag, and Pd. • The optimum leaching parameters for Au, Ag, and Pd in iodine–iodide were studied. - Abstract: Precious metals are the most attractive resources in waste printed circuit boards (PCBs) of mobile phones. In this work, an alternative process for recovering Au, Ag, and Pd from waste PCBs of mobile phones by supercritical water oxidation (SCWO) pre-treatment combined with iodine–iodide leaching process was developed. In the process, the waste PCBs of mobile phones were pre-treated in supercritical water, then a diluted hydrochloric acid leaching (HL) process was used to recovery the Cu, whose leaching efficiency was approximately 100%, finally the resulting residue was subjected to the iodine–iodide leaching process for recovering the Au, Ag, and Pd. Experimental results indicated that SCWO pre-treatment temperature, time, and pressure had significant influence on the Au, Ag, and Pd leaching from (SCWO + HL)-treated waste PCBs. The optimal SCWO pre-treatment conditions were 420 °C and 60 min for Au and Pd, and 410 °C and 30 min for Ag. The optimum dissolution parameters for Au, Pd, and Ag in (SCWO + HL)-treated PCBs with iodine–iodide system were leaching time of 120 min (90 min for Ag), iodine/iodide mole ratio of 1:5 (1:6 for Ag), solid-to-liquid ratio (S/L) of 1:10 g/mL (1:8 g/mL for Ag), and pH of 9, respectively. It is believed that the process developed in this study is environment friendly for the recovery of Au, Ag, and Pd from waste PCBs of mobile phones by SCWO pre-treatment combined with iodine–iodide leaching process

  14. Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment

    Energy Technology Data Exchange (ETDEWEB)

    Xiu, Fu-Rong, E-mail: xiu_chem@hotmail.com [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350108 (China); Qi, Yingying [College of Ecological Environment and Urban Construction, Fujian University of Technology, Fuzhou 350108 (China); Zhang, Fu-Shen [Research Center for Eco-Environmental Sciences, Chinese Academy of Sciences, Beijing 100085 (China)

    2015-07-15

    Highlights: • We report a novel process for recovering Au, Ag, and Pd from waste PCBs. • The effect of SCWO on the leaching of Au, Ag, and Pd in waste PCBs was studied. • SCWO was highly efficient for enhancing the leaching of Au, Ag, and Pd. • The optimum leaching parameters for Au, Ag, and Pd in iodine–iodide were studied. - Abstract: Precious metals are the most attractive resources in waste printed circuit boards (PCBs) of mobile phones. In this work, an alternative process for recovering Au, Ag, and Pd from waste PCBs of mobile phones by supercritical water oxidation (SCWO) pre-treatment combined with iodine–iodide leaching process was developed. In the process, the waste PCBs of mobile phones were pre-treated in supercritical water, then a diluted hydrochloric acid leaching (HL) process was used to recovery the Cu, whose leaching efficiency was approximately 100%, finally the resulting residue was subjected to the iodine–iodide leaching process for recovering the Au, Ag, and Pd. Experimental results indicated that SCWO pre-treatment temperature, time, and pressure had significant influence on the Au, Ag, and Pd leaching from (SCWO + HL)-treated waste PCBs. The optimal SCWO pre-treatment conditions were 420 °C and 60 min for Au and Pd, and 410 °C and 30 min for Ag. The optimum dissolution parameters for Au, Pd, and Ag in (SCWO + HL)-treated PCBs with iodine–iodide system were leaching time of 120 min (90 min for Ag), iodine/iodide mole ratio of 1:5 (1:6 for Ag), solid-to-liquid ratio (S/L) of 1:10 g/mL (1:8 g/mL for Ag), and pH of 9, respectively. It is believed that the process developed in this study is environment friendly for the recovery of Au, Ag, and Pd from waste PCBs of mobile phones by SCWO pre-treatment combined with iodine–iodide leaching process.

  15. Soft-Matter Printed Circuit Board with UV Laser Micropatterning.

    Science.gov (United States)

    Lu, Tong; Markvicka, Eric J; Jin, Yichu; Majidi, Carmel

    2017-07-05

    When encapsulated in elastomer, micropatterned traces of Ga-based liquid metal (LM) can function as elastically deformable circuit wiring that provides mechanically robust electrical connectivity between solid-state elements (e.g., transistors, processors, and sensor nodes). However, LM-microelectronics integration is currently limited by challenges in rapid fabrication of LM circuits and the creation of vias between circuit terminals and the I/O pins of packaged electronics. In this study, we address both with a unique layup for soft-matter electronics in which traces of liquid-phase Ga-In eutectic (EGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically aligned columns of EGaIn-coated Ag-Fe 2 O 3 microparticles that are embedded within an interfacial elastomer layer. The processing technique is compatible with conventional UVLM printed circuit board (PCB) prototyping and exploits the photophysical ablation of EGaIn on an elastomer substrate. Potential applications to wearable computing and biosensing are demonstrated with functional implementations in which soft-matter PCBs are populated with surface-mounted microelectronics.

  16. Eco-friendly copper recovery process from waste printed circuit boards using Fe{sup 3+}/Fe{sup 2+} redox system

    Energy Technology Data Exchange (ETDEWEB)

    Fogarasi, Szabolcs [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Imre-Lucaci, Florica [Babeş-Bolyai University, Interdisciplinary Research Institute on Bio-Nano-Sciences, 42 Treboniu Laurian Street, Cluj-Napoca RO-400271 (Romania); Egedy, Attila [University of Pannonia, Department of Process Engineering, Egyetem Str. 10, H-8200 Veszprém (Hungary); Imre-Lucaci, Árpád, E-mail: aimre@chem.ubbcluj.ro [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Ilea, Petru [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania)

    2015-06-15

    Highlights: • We developed an ecofriendly mediated electrochemical process for copper recovery. • The recovery of copper was achieved without mechanical pretreatment of the samples. • We identified the optimal flow rate for the leaching and electrowinning of copper. • The copper content of the obtained cathodic deposits was over 99.9%. - Abstract: The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe{sup 3+} combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%.

  17. Application of vacuum metallurgy to separate pure metal from mixed metallic particles of crushed waste printed circuit board scraps.

    Science.gov (United States)

    Zhan, Lu; Xu, Zhenming

    2008-10-15

    The principle of separating pure metal from mixed metallic particles (MMPs) byvacuum metallurgy is that the vapor pressures of various metals at the same temperature are different As a result, the metal with high vapor pressure and low boiling point can be separated from the mixed metals through distillation or sublimation, and then it can be recycled through condensation under a certain condition. The vacuum metallurgy separation (VMS) of MMPs of crushed waste printed circuit boards (WPCBs) has been studied in this paper. Theoretical analyses show that the MMPs (copper, zinc, bismuth, lead, and indium, for example) can be separated by vacuum metallurgy. The copper particles (0.15-0.20 mm) and zinc particles (<0.30 mm) were chosen to simulate the MMPs of crushed WPCBs. Experimental results show that the separated efficiency of zinc in the copper-rich particles achieves 96.19 wt % when the vacuum pressure is 0.01-0.10 Pa, the heating temperature is 1123 K, and the heating time is 105 min. Under this operation condition, the separated efficiency of zinc in the copper-rich particles from crushed WPCBs achieves 97.00 wt % and the copper purity increases from 90.68 to 99.84 wt %.

  18. [Flexible print circuit technology application in biomedical engineering].

    Science.gov (United States)

    Jiang, Lihua; Cao, Yi; Zheng, Xiaolin

    2013-06-01

    Flexible print circuit (FPC) technology has been widely applied in variety of electric circuits with high precision due to its advantages, such as low-cost, high specific fabrication ability, and good flexibility, etc. Recently, this technology has also been used in biomedical engineering, especially in the development of microfluidic chip and microelectrode array. The high specific fabrication can help making microelectrode and other micro-structure equipment. And good flexibility allows the micro devices based on FPC technique to be easily packaged with other parts. In addition, it also reduces the damage of microelectrodes to the tissue. In this paper, the application of FPC technology in biomedical engineering is introduced. Moreover, the important parameters of FPC technique and the development trend of prosperous applications is also discussed.

  19. Gas microstrip detectors based on flexible printed circuit

    International Nuclear Information System (INIS)

    Salomon, M.; Crowe, K.; Faszer, W.; Lindsay, P.; Curran Maier, J.M.

    1995-09-01

    Microstrip Gas Detectors (MSGC's) were introduced some years ago as position sensitive detectors capable of operating at very high rates. The authors have studied the properties of a new type of Gas Microstrip Counter built using flexible printed circuit technology. They describe the manufacturing procedures, the assembly of the device, as well as its operation under a variety of conditions, gases and types of radiation. They also describe two new passivation materials, tantalum and niobium, which produce effective surfaces

  20. Study of the computer-aided implantation and layout of printed circuits

    International Nuclear Information System (INIS)

    Baudry, Marc

    1973-01-01

    This research thesis reports the design and implementation of a software aimed at a computer-aided implantation and layout of printed circuits. This work comprises the use of heuristic algorithms and the search for a minimum cost by reduction of computing time and of memory size. The software comprises four independent parts which respectively address data analysis and control, circuit implantation, connection layout, and the exploitation of the obtained results. These four parts and their subroutines are presented. Two examples are reported in appendix

  1. Influence of incorporation of powder of printed circuit boards on technological properties and microstructure of triaxial ceramics

    International Nuclear Information System (INIS)

    Stafford, F.N.; Hotza, D.

    2012-01-01

    Using the methodology of experiments with mixtures, seven formulations of clay, phyllite, and printed circuit boards (PCB) were obtained to study the influence of this waste on triaxial ceramic tiles. Each formulation was processed under conditions similar to those used in the ceramic tiles industry, and characterized for fired modulus of rupture (FMoR) and water absorption (WA). The samples sintered at 1180°C were also subjected to analysis by XRD and SEM. The lowest resistance was observed in samples with 40% residue, while the highest strength occurred for samples with 14% residue, which reached average values of mechanical strength and water absorption of 35.0 MPa and 2.0%, respectively. The microstructure showed that it is possible to use waste of PCB in triaxial ceramic, which exhibits a fluxing behavior and it has an important effect on the sinterability and the development of appropriate microstructures. (author)

  2. Ruggedizing Printed Circuit Boards Using a Wideband Dynamic Absorber

    Directory of Open Access Journals (Sweden)

    V.C. Ho

    2003-01-01

    Full Text Available The existing approaches to ruggedizing inherently fragile and sensitive critical components of electronic equipment such as printed circuit boards (PCB for use in hostile industrial and military environment are either insufficient or expensive. This paper addresses a novel approach towards ruggedizing commercial-off-the-shelf PCBs using a miniature wideband dynamic absorber. The optimisation technique used relies on the experimentally measured vibration spectra and complex receptance of the original PCB.

  3. Inkjet-printed conductive features for rapid integration of electronic circuits in centrifugal microfluidics

    CSIR Research Space (South Africa)

    Kruger, J

    2015-05-01

    Full Text Available This work investigates the properties of conductive circuits inkjet-printed onto the polycarbonate discs used in CD-based centrifugal microfluidics, contributing towards rapidly prototyped electronic systems in smart ubiquitous biosensors, which...

  4. Bioleaching of metals from printed circuit boards supported with surfactant-producing bacteria

    International Nuclear Information System (INIS)

    Karwowska, Ewa; Andrzejewska-Morzuch, Dorota; Łebkowska, Maria; Tabernacka, Agnieszka; Wojtkowska, Małgorzata; Telepko, Alicja; Konarzewska, Agnieszka

    2014-01-01

    Highlights: • Bioleaching of metals from printed circuit boards by BSAC-producing bacteria was estimated. • Aeration increased the release of all metals in medium with sulphur and biosurfactant. • Increase in Cu, Pb, Ni and Cr removal rate was observed at 37 °C in acidic medium. -- Abstract: This study has evaluated the possibility of bioleaching zinc, copper, lead, nickel, cadmium and chromium from printed circuit boards by applying a culture of sulphur-oxidising bacteria and a mixed culture of biosurfactant-producing bacteria and sulphur-oxidising bacteria. It was revealed that zinc was removed effectively both in a traditional solution acidified by a way of microbial oxidation of sulphur and when using a microbial culture containing sulphur-oxidising and biosurfactant-producing bacteria. The average process efficiency was 48% for Zn dissolution. Cadmium removal was similar in both media, with a highest metal release of 93%. For nickel and copper, a better effect was obtained in the acidic medium, with a process effectiveness of 48.5% and 53%, respectively. Chromium was the only metal that was removed more effectively in the bioleaching medium containing both sulphur-oxidising and biosurfactant-producing bacteria. Lead was removed from the printed circuit boards with very low effectiveness (below 0.5%). Aerating the culture medium with compressed air increased the release of all metals in the medium with sulphur and biosurfactant, and of Ni, Cu, Zn and Cr in the acidic medium. Increasing the temperature of the medium (to 37 °C) had a more significant impact in the acidic environment than in the neutral environment

  5. Bioleaching of metals from printed circuit boards supported with surfactant-producing bacteria

    Energy Technology Data Exchange (ETDEWEB)

    Karwowska, Ewa, E-mail: ewa.karwowska@is.pw.edu.pl [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Andrzejewska-Morzuch, Dorota; Łebkowska, Maria [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Tabernacka, Agnieszka, E-mail: agnieszka.tabernacka@is.pw.edu.pl [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Wojtkowska, Małgorzata; Telepko, Alicja; Konarzewska, Agnieszka [Warsaw University of Technology, Faculty of Environmental Engineering, Nowowiejska 20, 00-653 Warsaw (Poland)

    2014-01-15

    Highlights: • Bioleaching of metals from printed circuit boards by BSAC-producing bacteria was estimated. • Aeration increased the release of all metals in medium with sulphur and biosurfactant. • Increase in Cu, Pb, Ni and Cr removal rate was observed at 37 °C in acidic medium. -- Abstract: This study has evaluated the possibility of bioleaching zinc, copper, lead, nickel, cadmium and chromium from printed circuit boards by applying a culture of sulphur-oxidising bacteria and a mixed culture of biosurfactant-producing bacteria and sulphur-oxidising bacteria. It was revealed that zinc was removed effectively both in a traditional solution acidified by a way of microbial oxidation of sulphur and when using a microbial culture containing sulphur-oxidising and biosurfactant-producing bacteria. The average process efficiency was 48% for Zn dissolution. Cadmium removal was similar in both media, with a highest metal release of 93%. For nickel and copper, a better effect was obtained in the acidic medium, with a process effectiveness of 48.5% and 53%, respectively. Chromium was the only metal that was removed more effectively in the bioleaching medium containing both sulphur-oxidising and biosurfactant-producing bacteria. Lead was removed from the printed circuit boards with very low effectiveness (below 0.5%). Aerating the culture medium with compressed air increased the release of all metals in the medium with sulphur and biosurfactant, and of Ni, Cu, Zn and Cr in the acidic medium. Increasing the temperature of the medium (to 37 °C) had a more significant impact in the acidic environment than in the neutral environment.

  6. Integrated digital printing of flexible circuits for wireless sensing (Conference Presentation)

    Science.gov (United States)

    Mei, Ping; Whiting, Gregory L.; Schwartz, David E.; Ng, Tse Nga; Krusor, Brent S.; Ready, Steve E.; Daniel, George; Veres, Janos; Street, Bob

    2016-09-01

    Wireless sensing has broad applications in a wide variety of fields such as infrastructure monitoring, chemistry, environmental engineering and cold supply chain management. Further development of sensing systems will focus on achieving light weight, flexibility, low power consumption and low cost. Fully printed electronics provide excellent flexibility and customizability, as well as the potential for low cost and large area applications, but lack solutions for high-density, high-performance circuitry. Conventional electronics mounted on flexible printed circuit boards provide high performance but are not digitally fabricated or readily customizable. Incorporation of small silicon dies or packaged chips into a printed platform enables high performance without compromising flexibility or cost. At PARC, we combine high functionality c-Si CMOS and digitally printed components and interconnects to create an integrated platform that can read and process multiple discrete sensors. Our approach facilitates customization to a wide variety of sensors and user interfaces suitable for a broad range of applications including remote monitoring of health, structures and environment. This talk will describe several examples of printed wireless sensing systems. The technologies required for these sensor systems are a mix of novel sensors, printing processes, conventional microchips, flexible substrates and energy harvesting power solutions.

  7. Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards

    DEFF Research Database (Denmark)

    Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    A majority of printed circuit board surfaces are covered with tin, therefore tin corrosion under humid conditions and movement of tin ions under the influence of an electric field plays an important role in the corrosion failure development. Tracking tin corrosion products spread on the printed c...

  8. Fast optoelectric printing of plasmonic nanoparticles into tailored circuits

    Science.gov (United States)

    Rodrigo, José A.

    2017-04-01

    Plasmonic nanoparticles are able to control light at nanometre-scale by coupling electromagnetic fields to the oscillations of free electrons in metals. Deposition of such nanoparticles onto substrates with tailored patterns is essential, for example, in fabricating plasmonic structures for enhanced sensing. This work presents an innovative micro-patterning technique, based on optoelectic printing, for fast and straightforward fabrication of curve-shaped circuits of plasmonic nanoparticles deposited onto a transparent electrode often used in optoelectronics, liquid crystal displays, touch screens, etc. We experimentally demonstrate that this kind of plasmonic structure, printed by using silver nanoparticles of 40 nm, works as a plasmonic enhanced optical device allowing for polarized-color-tunable light scattering in the visible. These findings have potential applications in biosensing and fabrication of future optoelectronic devices combining the benefits of plasmonic sensing and the functionality of transparent electrodes.

  9. Evaluation of gold and silver leaching from printed circuit board of cellphones

    Energy Technology Data Exchange (ETDEWEB)

    Petter, P.M.H., E-mail: patymhp@yahoo.com.br; Veit, H.M.; Bernardes, A.M.

    2014-02-15

    Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na{sub 2}S{sub 2}O{sub 3} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO{sub 3}were made. The leaching of Au and Ag with alternative reagents: Na{sub 2}S{sub 2}O{sub 3,} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} in 0.1 M concentration with the addition of CuSO{sub 4}, NH{sub 4}OH, and H{sub 2}O{sub 2}, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO{sub 4} was added.

  10. Evaluation of gold and silver leaching from printed circuit board of cellphones

    International Nuclear Information System (INIS)

    Petter, P.M.H.; Veit, H.M.; Bernardes, A.M.

    2014-01-01

    Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na 2 S 2 O 3 and (NH 4 ) 2 S 2 O 3 to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO 3 were made. The leaching of Au and Ag with alternative reagents: Na 2 S 2 O 3, and (NH 4 ) 2 S 2 O 3 in 0.1 M concentration with the addition of CuSO 4 , NH 4 OH, and H 2 O 2 , was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO 4 was added

  11. Application of parallel processing for automatic inspection of printed circuits

    International Nuclear Information System (INIS)

    Lougheed, R.M.

    1986-01-01

    Automated visual inspection of printed electronic circuits is a challenging application for image processing systems. Detailed inspection requires high speed analysis of gray scale imagery along with high quality optics, lighting, and sensing equipment. A prototype system has been developed and demonstrated at the Environmental Research Institute of Michigan (ERIM) for inspection of multilayer thick-film circuits. The central problem of real-time image processing is solved by a special-purpose parallel processor which includes a new high-speed Cytocomputer. In this chapter the inspection process and the algorithms used are summarized, along with the functional requirements of the machine vision system. Next, the parallel processor is described in detail and then performance on this application is given

  12. Fast copper extraction from printed circuit boards using supercritical carbon dioxide.

    Science.gov (United States)

    Calgaro, C O; Schlemmer, D F; da Silva, M D C R; Maziero, E V; Tanabe, E H; Bertuol, D A

    2015-11-01

    Technological development and intensive marketing support the growth in demand for electrical and electronic equipment (EEE), for which printed circuit boards (PCBs) are vital components. As these devices become obsolete after short periods, waste PCBs present a problem and require recycling. PCBs are composed of ceramics, polymers, and metals, particularly Cu, which is present in highest percentages. The aim of this study was to develop an innovative method to recover Cu from the PCBs of old mobile phones, obtaining faster reaction kinetics by means of leaching with supercritical CO2 and co-solvents. The PCBs from waste mobile phones were characterized, and evaluation was made of the reaction kinetics during leaching at atmospheric pressure and using supercritical CO2 with H2O2 and H2SO4 as co-solvents. The results showed that the PCBs contained 34.83 wt% of Cu. It was found that the supercritical extraction was 9 times faster, compared to atmospheric pressure extraction. After 20 min of supercritical leaching, approximately 90% of the Cu contained in the PCB was extracted using a 1:20 solid:liquid ratio and 20% of H2O2 and H2SO4 (2.5 M). These results demonstrate the efficiency of the process. Therefore the supercritical CO2 employment in the PCBs recycling is a promising alternative and the CO2 is environmentally acceptable and reusable. Copyright © 2015 Elsevier Ltd. All rights reserved.

  13. Effect of ionic contamination on climatic reliability of printed circuit board assemblies

    DEFF Research Database (Denmark)

    Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

    2012-01-01

    The effect of NaCl and weak organic acids (WOAs) in “no-clean” wave solder flux residues was studied on electrochemical migration (ECM), leakage current, and corrosion on surface mount chip capacitors using a test printed circuit board assembly (PCBA) substrate having known chip components...

  14. Study on characteristics of printed circuit board liberation and its crushed products.

    Science.gov (United States)

    Quan, Cui; Li, Aimin; Gao, Ningbo

    2012-11-01

    Recycling printed circuit board waste (PCBW) waste is a hot issue of environmental protection and resource recycling. Mechanical and thermo-chemical methods are two traditional recycling processes for PCBW. In the present research, a two-step crushing process combined with a coarse-crushing step and a fine-pulverizing step was adopted, and then the crushed products were classified into seven different fractions with a standard sieve. The liberation situation and particle shape in different size fractions were observed. Properties of different size fractions, such as heating value, thermogravimetric, proximate, ultimate and chemical analysis were determined. The Rosin-Rammler model was applied to analyze the particle size distribution of crushed material. The results indicated that complete liberation of metals from the PCBW was achieved at a size less than 0.59 mm, but the nonmetal particle in the smaller-than-0.15 mm fraction is liable to aggregate. Copper was the most prominent metal in PCBW and mainly enriched in the 0.42-0.25 mm particle size. The Rosin-Rammler equation adequately fit particle size distribution data of crushed PCBW with a correlation coefficient of 0.9810. The results of heating value and proximate analysis revealed that the PCBW had a low heating value and high ash content. The combustion and pyrolysis process of PCBW was different and there was an obvious oxidation peak of Cu in combustion runs.

  15. Improving intrinsic corrosion reliability of printed circuit board assembly

    DEFF Research Database (Denmark)

    Ambat, Rajan; Conseil, Helene

    2016-01-01

    conditions, therefore the protection of electronic devices is becoming a critical factor in system design. Humidity and local condensation inside electronic enclosures can significantly alter the performance of electronic devices. The presence of moisture in a PCB alters its quality, functionality, thermal...... performance, and thermo-mechanical properties, while condensation on the surface of printed circuit board assemblies (PCBAs) can lead to electrical failures, like electrochemical migration. The result is reduced life span for electronic products and heavy economic loss due to failures....

  16. Impact of NaCl Contamination and Climatic Conditions on the Reliability of Printed Circuit Board Assemblies

    DEFF Research Database (Denmark)

    Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    The effect of climatic conditions and ionic contamination on the reliability of printed circuit board assembly has been investigated in terms of leakage current (LC) and electrochemical migration susceptibility. The change in LC as a function of relative humidity (RH) and temperature was measured...... and 15 $^{\\circ}\\hbox{C}$ –65 $^{\\circ}\\hbox{C}$. The variation of RH at the surface of the test specimens was imposed by 1) increasing the RH of the surrounding air and 2) reducing the temperature of the printed circuit boards using a cooling stage, while maintaining a constant climatic condition...

  17. Chemically programmed ink-jet printed resistive WORM memory array and readout circuit

    International Nuclear Information System (INIS)

    Andersson, H; Manuilskiy, A; Sidén, J; Gao, J; Kunninmel, G V; Nilsson, H-E; Hummelgård, M

    2014-01-01

    In this paper an ink-jet printed write once read many (WORM) resistive memory fabricated on paper substrate is presented. The memory elements are programmed for different resistance states by printing triethylene glycol monoethyl ether on the substrate before the actual memory element is printed using silver nano particle ink. The resistance is thus able to be set to a broad range of values without changing the geometry of the elements. A memory card consisting of 16 elements is manufactured for which the elements are each programmed to one of four defined logic levels, providing a total of 4294 967 296 unique possible combinations. Using a readout circuit, originally developed for resistive sensors to avoid crosstalk between elements, a memory card reader is manufactured that is able to read the values of the memory card and transfer the data to a PC. Such printed memory cards can be used in various applications. (paper)

  18. Preliminary Study of Printed Circuit Heat Exchanger (PCHE) for various power conversion systems for SMART

    Energy Technology Data Exchange (ETDEWEB)

    Kwon, Jinsu; Baik, Seungjoon; Lee, Jeong Ik [KAIST, Daejeon (Korea, Republic of)

    2016-10-15

    The steam-Rankine cycle was the most widely used power conversion system for a nuclear power plant. The size of the heat exchanger is important for the modulation. Such a challenge was conducted by Kang et al. They change the steam generator type for the SMART from helical type heat exchanger to Printed Circuit Heat Exchanger (PCHE). Recently, there has been a growing interest in the supercritical carbon dioxide (S-CO{sub 2}) Brayton cycle as the most promising power conversion system. The reason is high efficiency with simple layout and compact power plant due to small turbomachinery and compact heat exchanger technology. That is why the SCO{sub 2} Brayton cycle can enhance the existing advantages of Small Modular Reactor (SMR) like SMART, such as reduction in size, capital cost, and construction period. Thermal hydraulic and geometric parameters of a PCHE for the S-CO{sub 2} power cycle coupled to SMART. The results show that the water - CO{sub 2} printed circuit heat exchanger size is smaller than printed circuit steam generator for the superheated steam Rankine cycle. This results show the potential benefit of using the S-CO-2 Brayton power cycle to a water-cooled small modular reactor.

  19. Study of Photosensitive Dry Films Absorption for Printed Circuit Boards by Photoacoustic Technique

    Science.gov (United States)

    Hernández, R.; Zaragoza, J. A. Barrientos; Jiménez-Pérez, J. L.; Orea, A. Cruz; Correa-Pacheco, Z. N.

    2017-08-01

    In this work, the study of photosensitive dry-type films by photoacoustic technique is proposed. The dry film photoresist is resistant to chemical etching for printed circuit boards such as ferric chloride, sodium persulfate or ammonium, hydrochloric acid. It is capable of faithfully reproducing circuit pattern exposed to ultraviolet light (UV) through a negative. Once recorded, the uncured portion is removed with alkaline solution. It is possible to obtain good results in surface mount circuits with tracks of 5 mm. Furthermore, the solid resin films are formed by three layers, two protective layers and a UV-sensitive optical absorption layer in the range of 325 nm to 405 nm. By means of optical absorption of UV-visible rays emitted by a low-power Xe lamp, the films transform this energy into thermal waves generated by the absorption of optical radiation and subsequently no-radiative de-excitation occurs. The photoacoustic spectroscopy is a useful technique to measure the transmittance and absorption directly. In this study, the optical absorption spectra of the three layers of photosensitive dry-type films were obtained as a function of the wavelength, in order to have a knowledge of the absorber layer and the protective layers. These analyses will give us the physical properties of the photosensitive film, which are very important in curing the dry film for applications in printed circuit boards.

  20. Printed Circuit Board Embedded Inductors for Very High Frequency Switch-Mode Power Supplies

    DEFF Research Database (Denmark)

    Madsen, Mickey Pierre; Knott, Arnold; Andersen, Michael A. E.

    2013-01-01

    The paper describes the design of three different structures for printed circuit board embedded inductors. Direct comparison of spirals, solenoids and toroids are made with regard to inductance, dc and ac resistance, electromagnetic field and design flexibility. First the equations for the impeda...

  1. A new model for simulating microbial cyanide production and optimizing the medium parameters for recovering precious metals from waste printed circuit boards.

    Science.gov (United States)

    Yuan, Zhihui; Ruan, Jujun; Li, Yaying; Qiu, Rongliang

    2018-04-10

    Bioleaching is a green recycling technology for recovering precious metals from waste printed circuit boards (WPCBs). However, this technology requires increasing cyanide production to obtain desirable recovery efficiency. Luria-Bertani medium (LB medium, containing tryptone 10 g/L, yeast extract 5 g/L, NaCl 10 g/L) was commonly used in bioleaching of precious metal. In this study, results showed that LB medium did not produce highest yield of cyanide. Under optimal culture conditions (25 °C, pH 7.5), the maximum cyanide yield of the optimized medium (containing tryptone 6 g/L and yeast extract 5 g/L) was 1.5 times as high as that of LB medium. In addition, kinetics and relationship of cell growth and cyanide production was studied. Data of cell growth fitted logistics model well. Allometric model was demonstrated effective in describing relationship between cell growth and cyanide production. By inserting logistics equation into allometric equation, we got a novel hybrid equation containing five parameters. Kinetic data for cyanide production were well fitted to the new model. Model parameters reflected both cell growth and cyanide production process. Copyright © 2018 Elsevier B.V. All rights reserved.

  2. Development of high-performance printed organic field-effect transistors and integrated circuits.

    Science.gov (United States)

    Xu, Yong; Liu, Chuan; Khim, Dongyoon; Noh, Yong-Young

    2015-10-28

    Organic electronics is regarded as an important branch of future microelectronics especially suited for large-area, flexible, transparent, and green devices, with their low cost being a key benefit. Organic field-effect transistors (OFETs), the primary building blocks of numerous expected applications, have been intensively studied, and considerable progress has recently been made. However, there are still a number of challenges to the realization of high-performance OFETs and integrated circuits (ICs) using printing technologies. Therefore, in this perspective article, we investigate the main issues concerning developing high-performance printed OFETs and ICs and seek strategies for further improvement. Unlike many other studies in the literature that deal with organic semiconductors (OSCs), printing technology, and device physics, our study commences with a detailed examination of OFET performance parameters (e.g., carrier mobility, threshold voltage, and contact resistance) by which the related challenges and potential solutions to performance development are inspected. While keeping this complete understanding of device performance in mind, we check the printed OFETs' components one by one and explore the possibility of performance improvement regarding device physics, material engineering, processing procedure, and printing technology. Finally, we analyze the performance of various organic ICs and discuss ways to optimize OFET characteristics and thus develop high-performance printed ICs for broad practical applications.

  3. Flexible integrated diode-transistor logic (DTL) driving circuits based on printed carbon nanotube thin film transistors with low operation voltage.

    Science.gov (United States)

    Liu, Tingting; Zhao, Jianwen; Xu, Weiwei; Dou, Junyan; Zhao, Xinluo; Deng, Wei; Wei, Changting; Xu, Wenya; Guo, Wenrui; Su, Wenming; Jie, Jiansheng; Cui, Zheng

    2018-01-03

    Fabrication and application of hybrid functional circuits have become a hot research topic in the field of printed electronics. In this study, a novel flexible diode-transistor logic (DTL) driving circuit is proposed, which was fabricated based on a light emitting diode (LED) integrated with printed high-performance single-walled carbon nanotube (SWCNT) thin-film transistors (TFTs). The LED, which is made of AlGaInP on GaAs, is commercial off-the-shelf, which could generate free electrical charges upon white light illumination. Printed top-gate TFTs were made on a PET substrate by inkjet printing high purity semiconducting SWCNTs (sc-SWCNTs) ink as the semiconductor channel materials, together with printed silver ink as the top-gate electrode and printed poly(pyromellitic dianhydride-co-4,4'-oxydianiline) (PMDA/ODA) as gate dielectric layer. The LED, which is connected to the gate electrode of the TFT, generated electrical charge when illuminated, resulting in biased gate voltage to control the TFT from "ON" status to "OFF" status. The TFTs with a PMDA/ODA gate dielectric exhibited low operating voltages of ±1 V, a small subthreshold swing of 62-105 mV dec -1 and ON/OFF ratio of 10 6 , which enabled DTL driving circuits to have high ON currents, high dark-to-bright current ratios (up to 10 5 ) and good stability under repeated white light illumination. As an application, the flexible DTL driving circuit was connected to external quantum dot LEDs (QLEDs), demonstrating its ability to drive and to control the QLED.

  4. In-situ fabrication of flexible vertically integrated electronic circuits by inkjet printing

    International Nuclear Information System (INIS)

    Wang Zhuo; Wu Wenwen; Yang Qunbao; Li Yongxiang; Noh, Chang-Ho

    2009-01-01

    In this paper, a facile approach for fabricating flexible vertically integrated electronic circuits is demonstrated. A desktop inkjet printer was modified and employed to print silver precursor on a polymer-coated buffer substrates. In-situ reaction was taken place and a conducting line was formed without need of a high temperature treatment. Through this process, several layers of metal integrated circuits were deposited sequentially with polymer buffer layers sandwiched between each layer. Hence, vertically integrated electronic components of diodes, solar cells, flexible flat panel displays, and electrochromic devices can be built with this simple and low-cost technique.

  5. Comprehensive characterization of printed circuit boards of various end-of-life electrical and electronic equipment for beneficiation investigation.

    Science.gov (United States)

    Anshu Priya; Hait, Subrata

    2018-05-01

    Comprehensive characterization of printed circuit board (PCB) of end-of-life electrical and electronic equipment (EEE) is obligatory for prospective profitable beneficiation. In this study, beneficiation oriented comprehensive characterization of two brands of PCBs each of 16 end-of-life EEE was conducted in terms of their physicochemical characteristics with special emphasis on the content of 16 general elements, 2 precious metals and 15 rare earth elements (REEs). General elements and their highest weight percent composition found in different PCBs of the EEEs were Cu (23% in laptop), Al (6% in computer), Pb (15% in DVD player) and Ba (7% in TV). The high abundant of precious metals such as Au (316 g/ton) and Ag (636 g/ton) in mobile phone and laptop, respectively coupled with rapid obsolescence age makes waste PCBs of information technology and telecommunication equipment the most potent resource reservoir. Additionally, most of the waste PCBs were observed to contain REEs in considerable quantity with Sc up to 31 g/ton and Ce up to 13 g/ton being the major constituents. Comprehensive characterization of waste PCBs therefore will systematically help towards better understanding of e-waste recycling processes for beneficiation purpose and sustainable resource circulation and conservation. Copyright © 2018 Elsevier Ltd. All rights reserved.

  6. Design of a CMOS readout circuit on ultra-thin flexible silicon chip for printed strain gauges

    Directory of Open Access Journals (Sweden)

    M. Elsobky

    2017-09-01

    Full Text Available Flexible electronics represents an emerging technology with features enabling several new applications such as wearable electronics and bendable displays. Precise and high-performance sensors readout chips are crucial for high quality flexible electronic products. In this work, the design of a CMOS readout circuit for an array of printed strain gauges is presented. The ultra-thin readout chip and the printed sensors are combined on a thin Benzocyclobutene/Polyimide (BCB/PI substrate to form a Hybrid System-in-Foil (HySiF, which is used as an electronic skin for robotic applications. Each strain gauge utilizes a Wheatstone bridge circuit, where four Aerosol Jet® printed meander-shaped resistors form a full-bridge topology. The readout chip amplifies the output voltage difference (about 5 mV full-scale swing of the strain gauge. One challenge during the sensor interface circuit design is to compensate for the relatively large dc offset (about 30 mV at 1 mA in the bridge output voltage so that the amplified signal span matches the input range of an analog-to-digital converter (ADC. The circuit design uses the 0. 5 µm mixed-signal GATEFORESTTM technology. In order to achieve the mechanical flexibility, the chip fabrication is based on either back thinned wafers or the ChipFilmTM technology, which enables the manufacturing of silicon chips with a thickness of about 20 µm. The implemented readout chip uses a supply of 5 V and includes a 5-bit digital-to-analog converter (DAC, a differential difference amplifier (DDA, and a 10-bit successive approximation register (SAR ADC. The circuit is simulated across process, supply and temperature corners and the simulation results indicate excellent performance in terms of circuit stability and linearity.

  7. Investigation, development and verification of printed circuit board embedded air-core solenoid transformers

    DEFF Research Database (Denmark)

    Mønster, Jakob Døllner; Madsen, Mickey Pierre; Pedersen, Jeppe Arnsdorf

    2015-01-01

    A new printed circuit board embedded air-core transformer/coupled inductor is proposed and presented. The transformer is intended for use in power converter applications operating at very high frequency between 30 MHz to 300 MHz. The transformer is based on two or more solenoid structures...

  8. Preparing printed circuit boards for rapid turn-around time on a protomat plotter

    International Nuclear Information System (INIS)

    Hawtree, J.

    1998-01-01

    This document describes the use of the LPKF ProtoMat mill/drill unit circuit board Plotter, with the associated CAD/CAM software BoardMaster and CircuitCAM. At present its primarily use here at Fermilab's Particle Physics Department is for rapid-turnover of prototype PCBs double-sided and single-sided copper clad printed circuit boards (PCBs). (The plotter is also capable of producing gravure films and engraving aluminum or plastic although we have not used it for this.) It has the capability of making traces 0.004 inch wide with 0.004 inch spacings which is appropriate for high density surface mount circuits as well as other through-mounted discrete and integrated components. One of the primary benefits of the plotter is the capability to produce double-sided drilled boards from CAD files in a few hours. However to achieve this rapid turn-around time, some care must be taken in preparing the files. This document describes how to optimize the process of PCB fabrication. With proper preparation, researchers can often have a completed circuit board in a day's time instead of a week or two wait with usual procedures. It is assumed that the software and hardware are properly installed and that the machinist is acquainted with the Win95 operating system and the basics of the associated software. This paper does not describe its use with pen plotters, lasers or rubouts. The process of creating a PCB (printed circuit board) begins with the CAD (computer-aided design) software, usually PCAD or VeriBest. These files are then moved to CAM (computer-aided machining) where they are edited and converted to put them into the proper format for running on the ProtoMat plotter. The plotter then performs the actual machining of the board. This document concentrates on the LPKF programs CircuitCam BASIS and BoardMaster for the CAM software. These programs run on a Windows 95 platform to run an LPKF ProtoMat 93s plotter

  9. Design analysis of a lead–lithium/supercritical CO2 Printed Circuit Heat Exchanger for primary power recovery

    International Nuclear Information System (INIS)

    Fernández, Iván; Sedano, Luis

    2013-01-01

    Highlights: • A design for a PbLi/CO 2 (SC) Printed Circuit Heat Exchanger which optimizes the pressure drop performance is proposed. • Numerical analyses have been performed to optimize the airfoil fins shape and arrangement. • SiC is proposed as structural material and tritium permeation barrier for the PCHE. • The integrated flux is larger than expected and allows reducing the CO 2 mass flow in this sector of the power cycle. • A transport model has been developed to evaluate the permeation of tritium from the liquid metal to the secondary CO 2 . -- Abstract: One of the key issues for fusion power plant technology is the efficient, reliable and safe recovery of the power extracted by the primary coolants. An interesting design option for power conversion cycles based on Dual Coolant Breeding Blankets (DCBB) is a Printed Circuit Heat Exchanger, which is supported by the advantages of its compactness, thermal effectiveness, high temperature and pressure capability and corrosion resistance. This work presents a design analysis of a silicon carbide Printed Circuit Heat Exchanger for lead–lithium/supercritical CO 2 at DEMO ranges (4× segmentation)

  10. An interactive system for the automatic layout of printed circuit boards (ARAIGNEE)

    International Nuclear Information System (INIS)

    Combet, M.; Eder, J.; Pagny, C.

    1974-12-01

    A software package for the automatic layout of printed circuit boards is presented. The program permits an interaction of the user during the layout process. The automatic searching of paths can be interrupted at any step and convenient corrections can be inserted. This procedure improves strongly the performance of the program as far as the number of unresolved connections is concerned

  11. Separation of the metallic and non-metallic fraction from printed circuit boards employing green technology

    Energy Technology Data Exchange (ETDEWEB)

    Estrada-Ruiz, R.H., E-mail: rhestrada@itsaltillo.edu.mx; Flores-Campos, R., E-mail: rcampos@itsaltillo.edu.mx; Gámez-Altamirano, H.A., E-mail: hgamez@itsaltillo.edu.mx; Velarde-Sánchez, E.J., E-mail: ejvelarde@itsaltillo.edu.mx

    2016-07-05

    Highlights: • Small sizes of particles are required in order to separate the different fractions. • Inverse flotation process is an efficient green technology to separate fractions. • Superficial air velocity is the main variable in the inverse flotation process. • Inverse flotation is a green process because the pulṕs pH is 7.0 during the test. - Abstract: The generation of electrical and electronic waste is increasing day by day; recycling is attractive because of the metallic fraction containing these. Nevertheless, conventional techniques are highly polluting. The comminution of the printed circuit boards followed by an inverse flotation process is a clean technique that allows one to separate the metallic fraction from the non-metallic fraction. It was found that particle size and superficial air velocity are the main variables in the separation of the different fractions. In this way an efficient separation is achieved by avoiding the environmental contamination coupled with the possible utilization of the different fractions obtained.

  12. A Method for Automatic Inspection of Printed Circuit Boards by Using the Thermal Signature

    International Nuclear Information System (INIS)

    Amer, H.H.; Zekry, A.A.; Elaraby, S.; Ghareeb, K.E.

    2012-01-01

    This paper aims to design a system for automating inspection of the printed circuit boards (PCBs) by using the thermal signature of the different integrated circuits (I.C). The proposed inspection system consists of the inspection circuit, data acquisition system (DAS) and personal computer. Inspection is done by comparing the thermal signature of normally operated circuit with the thermal signature of circuit under test. One thermistor is assigned to each component in the circuit. The thermistor must touch tightly the surface of the I.C. to sense its temperature during the inspection process. Matlab software is used to represent the thermal signature through different colors. The Turbo C software is used to develop a program for acquiring and comparing the thermal signature of the circuit under the test with the reference circuit. If the colors of the two thermal signatures for the same I.C. are same then the circuit under test is fault free and does not contain any defect. On the other side, if the colors of the two thermal signatures for the same I.C. are different then the circuit under test is defective

  13. Integration of f-MWCNT Sensor and Printed Circuits on Paper Substrate

    OpenAIRE

    Xie, Li; Feng, Yi; Mantysalo, Matti; Chen, Qiang; Zheng, Li-Rong

    2013-01-01

    The integration of sensors endows the packages with intelligence and interactivity. This paper is considered the most suitable substrate of smart packages because it is cost-effective, light, flexible, and recyclable. However, common concern exists regarding the reliability of paper-based system against bending and folding. In this paper, inkjet-printing of silver nanoparticles is used to form circuit pattern as well as interconnections for system integration on paper substrate. A humidity se...

  14. Recycling of waste printed circuit boards with simultaneous enrichment of special metals by using alkaline melts: A green and strategically advantageous solution

    Energy Technology Data Exchange (ETDEWEB)

    Stuhlpfarrer, Philipp, E-mail: philipp-johannes.stuhlpfarrer@stud.unileoben.ac.at; Luidold, Stefan; Antrekowitsch, Helmut

    2016-04-15

    Highlights: • Removal of plastics. • Enrichment of In, Ga and Ge. • Low temperature. • No dioxines. - Abstract: The increasing consumption of electric and electronic equipment has led to a rise in toxic waste. To recover the metal fraction, a separation of the organic components is necessary because harmful substances such as chlorine, fluorine and bromine cause ecological damage, for example in the form of dioxins and furans at temperature above 400 °C. Hence, an alternative, environmentally friendly approach was investigated exploiting that a mixture of caustic soda and potassium hydroxide in eutectic composition melts below 200 °C, enabling a fast cracking of the long hydrocarbon chains. The trials demonstrate the removal of organic compounds without a loss of copper and precious metals, as well as a suppressed formation of hazardous off-gases. In order to avoid an input of alkaline elements into the furnace and ensuing problems with refractory materials, a washing step generates a sodium and potassium hydroxide solution, in which special metals like indium, gallium and germanium are enriched. Their concentrations facilitate the recovery of these elements, because otherwise they become lost in the typical recycling processes. The aim of this work was to find an environmental solution for the separation of plastics and metals as well as a strategically important answer for the recycling of printed circuit boards and mobile phones.

  15. Recycling of waste printed circuit boards with simultaneous enrichment of special metals by using alkaline melts: A green and strategically advantageous solution.

    Science.gov (United States)

    Stuhlpfarrer, Philipp; Luidold, Stefan; Antrekowitsch, Helmut

    2016-04-15

    The increasing consumption of electric and electronic equipment has led to a rise in toxic waste. To recover the metal fraction, a separation of the organic components is necessary because harmful substances such as chlorine, fluorine and bromine cause ecological damage, for example in the form of dioxins and furans at temperature above 400°C. Hence, an alternative, environmentally friendly approach was investigated exploiting that a mixture of caustic soda and potassium hydroxide in eutectic composition melts below 200°C, enabling a fast cracking of the long hydrocarbon chains. The trials demonstrate the removal of organic compounds without a loss of copper and precious metals, as well as a suppressed formation of hazardous off-gases. In order to avoid an input of alkaline elements into the furnace and ensuing problems with refractory materials, a washing step generates a sodium and potassium hydroxide solution, in which special metals like indium, gallium and germanium are enriched. Their concentrations facilitate the recovery of these elements, because otherwise they become lost in the typical recycling processes. The aim of this work was to find an environmental solution for the separation of plastics and metals as well as a strategically important answer for the recycling of printed circuit boards and mobile phones. Copyright © 2015 Elsevier B.V. All rights reserved.

  16. Recycling of waste printed circuit boards with simultaneous enrichment of special metals by using alkaline melts: A green and strategically advantageous solution

    International Nuclear Information System (INIS)

    Stuhlpfarrer, Philipp; Luidold, Stefan; Antrekowitsch, Helmut

    2016-01-01

    Highlights: • Removal of plastics. • Enrichment of In, Ga and Ge. • Low temperature. • No dioxines. - Abstract: The increasing consumption of electric and electronic equipment has led to a rise in toxic waste. To recover the metal fraction, a separation of the organic components is necessary because harmful substances such as chlorine, fluorine and bromine cause ecological damage, for example in the form of dioxins and furans at temperature above 400 °C. Hence, an alternative, environmentally friendly approach was investigated exploiting that a mixture of caustic soda and potassium hydroxide in eutectic composition melts below 200 °C, enabling a fast cracking of the long hydrocarbon chains. The trials demonstrate the removal of organic compounds without a loss of copper and precious metals, as well as a suppressed formation of hazardous off-gases. In order to avoid an input of alkaline elements into the furnace and ensuing problems with refractory materials, a washing step generates a sodium and potassium hydroxide solution, in which special metals like indium, gallium and germanium are enriched. Their concentrations facilitate the recovery of these elements, because otherwise they become lost in the typical recycling processes. The aim of this work was to find an environmental solution for the separation of plastics and metals as well as a strategically important answer for the recycling of printed circuit boards and mobile phones.

  17. Radiation evaluation method of commercial off-the-shelf (COTS) electronic printed circuit boards (PCBs)

    International Nuclear Information System (INIS)

    LaBel, K.A.; Gruner, T.D.; Reed, R.A.; Settles, B.; Wilmot, J.; Dougherty, L.F.; Russo, A.; Yuknis, W.; Foster, M.G.; Garrisson-Darrin, A.; Marshall, P.W.

    1999-01-01

    We present a radiation evaluation methodology and proton ground test results for candidate COTS PCBs (commercial off-the-shelf electronic printed circuit boards) and their associated electronics for low-altitude, low-inclination orbits. We will also discuss the implications associated with mission orbit and duration. (authors)

  18. Supergravity separation of Pb and Sn from waste printed circuit boards at different temperatures

    Science.gov (United States)

    Meng, Long; Wang, Zhe; Zhong, Yi-wei; Chen, Kui-yuan; Guo, Zhan-cheng

    2018-02-01

    Printed circuit boards (PCBs) contain many toxic substances as well as valuable metals, e.g., lead (Pb) and tin (Sn). In this study, a novel technology, named supergravity, was used to separate different mass ratios of Pb and Sn from Pb-Sn alloys in PCBs. In a supergravity field, the liquid metal phase can permeate from solid particles. Hence, temperatures of 200, 280, and 400°C were chosen to separate Pb and Sn from PCBs. The results depicted that gravity coefficient only affected the recovery rates of Pb and Sn, whereas it had little effect on the mass ratios of Pb and Sn in the obtained alloys. With an increase in gravity coefficient, the recovery values of Pb and Sn in each step of the separation process increased. In the single-step separation process, the mass ratios of Pb and Sn in Pb-Sn alloys were 0.55, 0.40, and 0.64 at 200, 280, and 400°C, respectively. In the two-step separation process, the mass ratios were 0.12 and 0.55 at 280 and 400°C, respectively. Further, the mass ratio was observed to be 0.76 at 400°C in the three-step separation process. This process provides an innovative approach to the recycling mechanism of Pb and Sn from PCBs.

  19. Natural printed silk substrate circuit fabricated via surface modification using one step thermal transfer and reduction graphene oxide

    Science.gov (United States)

    Cao, Jiliang; Huang, Zhan; Wang, Chaoxia

    2018-05-01

    Graphene conductive silk substrate is a preferred material because of its biocompatibility, flexibility and comfort. A flexible natural printed silk substrate circuit was fabricated by one step transfer of graphene oxide (GO) paste from transfer paper to the surface of silk fabric and reduction of the GO to reduced graphene oxide (RGO) using a simple hot press treatment. The GO paste was obtained through ultrasonic stirring exfoliation under low temperature, and presented excellent printing rheological properties at high concentration. The silk fabric was obtained a surface electric resistance as low as 12.15 KΩ cm-1, in the concentration of GO 50 g L-1 and hot press at 220 °C for 120 s. Though the whiteness and strength decreased with the increasing of hot press temperature and time slowly, the electric conductivity of RGO surface modification silk substrate improved obviously. The surface electric resistance of RGO/silk fabrics increased from 12.15 KΩ cm-1 to 18.05 KΩ cm-1, 28.54 KΩ cm-1 and 32.53 KΩ cm-1 after 10, 20 and 30 washing cycles, respectively. The results showed that the printed silk substrate circuit has excellent washability. This process requires no chemical reductant, and the reduction efficiency and reduction degree of GO is high. This time-effective and environmentally-friendly one step thermal transfer and reduction graphene oxide onto natural silk substrate method can be easily used to production of reduced graphene oxide (RGO) based flexible printed circuit.

  20. DC arc plasma disposal of printed circuit board

    International Nuclear Information System (INIS)

    Huang Jianjun; Shenzhen Univ., Shenzhen; Shi Jiabiao; Meng Yuedong; Liu Zhengzhi

    2004-01-01

    A new solid waste disposal technology setup with DC arc plasma is presented. Being different from conventional combustion or burning such as incineration, it is based on a process called controlled high-temperature pyrolysis, the thermal destruction and recovery process. The results of vitrification of the circuit board are presented. The properties of vitrified product including hardness and leaching test results are presented. The final product (vitrified material) and air emission from the plasma treatment is environmentally acceptable. (authors)

  1. Packaging printed circuit boards: A production application of interactive graphics

    Science.gov (United States)

    Perrill, W. A.

    1975-01-01

    The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

  2. Checking a printed board

    CERN Multimedia

    1977-01-01

    An 'Interactive Printed Circuit Board Design System' has been developed by a company in a Member-State. Printed circuits are now produced at the SB's surface treatment workshop using a digitized photo-plotter.

  3. Optimized circuit design for flexible 8-bit RFID transponders with active layer of ink-jet printed small molecule semiconductors

    NARCIS (Netherlands)

    Kjellander, B.K.C.; Smaal, W.T.T.; Myny, K.; Genoe, J.; Dehaene, W.; Heremans, P.; Gelinck, G.H.

    2013-01-01

    We ink-jet print a blend of 6,13-bis(triisopropyl-silylethynyl)pentacene and polystyrene as the active layer for flexible circuits. The discrete ink-jet printed transistors exhibit a saturation mobility of 0.5 cm2 V -1 s-1. The relative spread in transistor characteristics can be very large. This

  4. High-Throughput Printing Process for Flexible Electronics

    Science.gov (United States)

    Hyun, Woo Jin

    Printed electronics is an emerging field for manufacturing electronic devices with low cost and minimal material waste for a variety of applications including displays, distributed sensing, smart packaging, and energy management. Moreover, its compatibility with roll-to-roll production formats and flexible substrates is desirable for continuous, high-throughput production of flexible electronics. Despite the promise, however, the roll-to-roll production of printed electronics is quite challenging due to web movement hindering accurate ink registration and high-fidelity printing. In this talk, I will present a promising strategy for roll-to-roll production using a novel printing process that we term SCALE (Self-aligned Capillarity-Assisted Lithography for Electronics). By utilizing capillarity of liquid inks on nano/micro-structured substrates, the SCALE process facilitates high-resolution and self-aligned patterning of electrically functional inks with greatly improved printing tolerance. I will show the fabrication of key building blocks (e.g. transistor, resistor, capacitor) for electronic circuits using the SCALE process on plastics.

  5. Status of electronic waste recycling techniques: a review.

    Science.gov (United States)

    Abdelbasir, Sabah M; Hassan, Saad S M; Kamel, Ayman H; El-Nasr, Rania Seif

    2018-05-08

    The increasing use of electrical and electronic equipment leads to a huge generation of electronic waste (e-waste). It is the fastest growing waste stream in the world. Almost all electrical and electronic equipment contain printed circuit boards as an essential part. Improper handling of these electronic wastes could bring serious risk to human health and the environment. On the other hand, proper handling of this waste requires a sound management strategy for awareness, collection, recycling, and reuse. Nowadays, the effective recycling of this type of waste has been considered as a main challenge for any society. Printed circuit boards (PCBs), which are the base of many electronic industries, are rich in valuable heavy metals and toxic halogenated organic substances. In this review, the composition of different PCBs and their harmful effects are discussed. Various techniques in common use for recycling the most important metals from the metallic fractions of e-waste are illustrated. The recovery of metals from e-waste material after physical separation through pyrometallurgical, hydrometallurgical, or biohydrometallurgical routes is also discussed, along with alternative uses of non-metallic fraction. The data are explained and compared with the current e-waste management efforts done in Egypt. Future perspectives and challenges facing Egypt for proper e-waste recycling are also discussed.

  6. Contamination profile on typical printed circuit board assemblies vs soldering process

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

  7. Printing low-melting-point alloy ink to directly make a solidified circuit or functional device with a heating pen.

    Science.gov (United States)

    Wang, Lei; Liu, Jing

    2014-12-08

    A new method to directly print out a solidified electronic circuit through low-melting-point metal ink is proposed. A functional pen with heating capability was fabricated. Several typical thermal properties of the alloy ink Bi 35 In 48.6 Sn 16 Zn 0.4 were measured and evaluated. Owing to the specifically selected melting point of the ink, which is slightly higher than room temperature, various electronic devices, graphics or circuits can be manufactured in a short period of time and then rapidly solidified by cooling in the surrounding air. The liquid-solid phase change mechanism of the written lines was experimentally characterized using a scanning electron microscope. In order to determine the matching substrate, wettability between the metal ink Bi 35 In 48.6 Sn 16 Zn 0.4 and several materials, including mica plate and silicone rubber, was investigated. The resistance-temperature curve of a printed resistor indicated its potential as a temperature control switch. Furthermore, the measured reflection coefficient of a printed double-diamond antenna accords well with the simulated result. With unique merits such as no pollution, no requirement for encapsulation and easy recycling, the present printing approach is an important supplement to current printed electronics and has enormous practical value in the future.

  8. Environmental impact assessment of waste electronic and electric ...

    African Journals Online (AJOL)

    Wuhib.Z

    Key words: Printed circuit boards (PCBs), e-waste, leaching tests, heavy metals, ..... Maximum leachability (in mg/kg) of metals versus leaching test methods (all tests were in triplicate). and c) ..... Environmental threats of discarded picture tubes.

  9. Leaching of gold and silver from printed circuit board of mobile phones

    OpenAIRE

    Petter,Patrícia Melo Halmenschlager; Veit,Hugo Marcelo; Bernardes,Andréa Moura

    2015-01-01

    Nowadays there is a wide variety of models, sizes and configurations of mobile phones available for consumption. After the life cycle of this equipment, the recycling and reuse of the precious metals found in the printed circuit boards (PCB) of the mobile phones are principal objectives. Thus, the objective of this work was to characterize the gold and silver present in a PCB and develop a recycling route using alternative reagents for cyanide, such as sodium and ammonium thiosulfate. These r...

  10. EMC and the printed circuit board design theory and layout made simple

    CERN Document Server

    Montrose, Mark I

    1999-01-01

    "This reference text shows how and why RF energy is created within a printed circuit board, and the manner in which propagation occurs. With thorough explanations, this book enables engineers to grasp both the fundamentals of EMC theory and signal integrity, along with the mitigation process needed to prevent an EMC event while maintaining optimal functionality for low- and high-technology products. Mr. Montrose also shows the relationship between time and frequency domains, helping one meet mandatory compliance requirements."--Jacket.

  11. Towards Practical Application of Paper based Printed Circuits: Capillarity Effectively Enhances Conductivity of the Thermoplastic Electrically Conductive Adhesives

    Science.gov (United States)

    Wu, Haoyi; Chiang, Sum Wai; Lin, Wei; Yang, Cheng; Li, Zhuo; Liu, Jingping; Cui, Xiaoya; Kang, Feiyu; Wong, Ching Ping

    2014-09-01

    Direct printing nanoparticle-based conductive inks onto paper substrates has encountered difficulties e.g. the nanoparticles are prone to penetrate into the pores of the paper and become partially segmented, and the necessary low-temperature-sintering process is harmful to the dimension-stability of paper. Here we prototyped the paper-based circuit substrate in combination with printed thermoplastic electrically conductive adhesives (ECA), which takes the advantage of the capillarity of paper and thus both the conductivity and mechanical robustness of the printed circuitsweredrastically improved without sintering process. For instance, the electrical resistivity of the ECA specimen on a pulp paper (6 × 10-5Ω.cm, with 50 wt% loading of Ag) was only 14% of that on PET film than that on PET film. This improvement has been found directly related to the sizing degree of paper, in agreement with the effective medium approximation simulation results in this work. The thermoplastic nature also enables excellent mechanical strength of the printed ECA to resist repeated folding. Considering the generality of the process and the wide acceptance of ECA technique in the modern electronic packages, this method may find vast applications in e.g. circuit boards, capacitive touch pads, and radio frequency identification antennas, which have been prototyped in the manuscript.

  12. Novel Power Reduction Technique for ReRAM with Automatic Avoidance Circuit for Wasteful Overwrite

    Directory of Open Access Journals (Sweden)

    Takaya Handa

    2012-01-01

    Full Text Available Low-power operations can be great advantageous for ReRAM devices. However, wasteful overwriting such as the SET operation to low-resistance state (LRS device and the RESET operation to high-resistance state (HRS device causes not only an increase in power but also the degradation of the write cycles due to repeatedly rewriting. Thus, in this paper, we proposed a novel automatic avoidance circuit for dealing with wasteful overwriting that uses a sense amplifier and estimated the energy consumption reduction rate by conducting a circuit simulation. As a result, this circuit helped to reliably avoid the wasteful overwriting operation to reduce about 99% and 97% of wasteful energy using VSRC and CSRC, respectively.

  13. A new technology for separation and recovery of materials from waste printed circuit boards by dissolving bromine epoxy resins using ionic liquid

    International Nuclear Information System (INIS)

    Zhu, P.; Chen, Y.; Wang, L.Y.; Qian, G.Y.; Zhou, M.; Zhou, J.

    2012-01-01

    Highlights: ► WPCBs were heated in [EMIM + ][BF 4 − ] for recovering solider at 240 °C. ► The bromine epoxy resins in WPCBs were all dissolved in [EMIM + ][BF 4 − ] at 260 °C. ► Used [EMIM + ][BF 4 − ] is treated by water to obtain regeneration. - Abstract: Recovery of valuable materials from waste printed circuit boards (WPCBs) is quite difficult because WPCBs is a heterogeneous mixture of polymer materials, glass fibers, and metals. In this study, WPCBs was treated using ionic liquid (1-ethyl-3-methylimizadolium tetrafluoroborate [EMIM + ][BF 4 − ]). Experimental results showed that the separation of the solders went to completion, and electronic components (ECs) were removed in WPCBs when [EMIM + ][BF 4 − ] solution containing WPCBs was heated to 240 °C. Meanwhile, metallographic observations verified that the WPCBs had an initial delamination. When the temperature increased to 260 °C, the separation of the WPCBs went to completion, and coppers and glass fibers were obtained. The used [EMIM + ][BF 4 − ] was treated by water to generate a solid–liquid suspension, which was separated completely to obtain solid residues by filtration. Thermal analyses combined with infrared ray spectra (IR) observed that the solid residues were bromine epoxy resins. NMR (nuclear magnetic resonance) showed that hydrogen bond played an important role for [EMIM + ][BF 4 − ] dissolving bromine epoxy resins. This clean and non-polluting technology offers a new way to recycle valuable materials from WPCBs and prevent environmental pollution from WPCBs effectively.

  14. A FPGA implementation of solder paste deposit on printed circuit boards errors detector based in a bright and contrast algorithm

    OpenAIRE

    De Luca-Pennacchia, A.; Sánchez-Martínez, M. Á.

    2007-01-01

    Solder paste deposit on printed circuit boards (PCB) is a critical stage. It is known that about 60% of functionality defects in this type of boards are due to poor solder paste printing. These defects can be diminished by means of automatic optical inspection of this printing. Actually, this process is implemented by image processing software with its inherent high computational time cost. In this paper we propose to implement a high parallel degree image comparison algorithm suitable to be ...

  15. Effect of solder flux residue on the performance of silicone conformal coatings on printed circuit board assemblies

    DEFF Research Database (Denmark)

    Rathinavelu, Umadevi; Jellesen, Morten Stendahl; Ambat, Rajan

    2013-01-01

    Conformal coatings are applied on printed circuit board assemblies (PCBAs) in order to protect the assembly from environmental influence and silicone-based coating is commonly used. A systematic study on the performance of silicone conformal coating in connection with process-related contaminants...

  16. Field analysis and enhancement of multi-pole magnetic components fabricated on printed circuit board

    International Nuclear Information System (INIS)

    Chiu, K.-C.; Chen, C.-S.

    2007-01-01

    A multi-pole magnetic component magnetized with a fine magnetic pole pitch of less than 1 mm is very difficult to achieve by using traditional methods. Moreover, it requires a precise mechanical process and a complicated magnetization system. Different fine magnetic pole pitches of 300, 350 and 400 μm have been accomplished on 9-pole magnetic components through the printed circuit board (PCB) manufacturing technology. Additionally, another fine magnetic pole pitch of 500 μm was also fabricated on a dual-layered (DL) wire circuit structure to investigate the field enhancement. After measurements, a gain factor of 1.37 was obtained in the field strength. The field variations among different magnetic pole pitches were analyzed in this paper

  17. SPRINT - An Interactive System for Printed Circuit Board Design User’s Guide.

    Science.gov (United States)

    1977-06-01

    effect as decreasing the time limit - your priority and turnaround time are improved. B) You have a very large circuit and an error message says...previous segment. If no path is found, a message is printed to that effect . If HIWIRE thinks the failure may have been due to too small a value of...USAF Academy, Colorado 80840 AUL/LSE-9663 Maxwell AFB, Alabama 36112 AFETR Technical Library P.O. Box 4608, MU 5650 Patrick AFB

  18. Thermoelectricity from wasted heat of integrated circuits

    KAUST Repository

    Fahad, Hossain M.

    2012-05-22

    We demonstrate that waste heat from integrated circuits especially computer microprocessors can be recycled as valuable electricity to power up a portion of the circuitry or other important accessories such as on-chip cooling modules, etc. This gives a positive spin to a negative effect of ever increasing heat dissipation associated with increased power consumption aligned with shrinking down trend of transistor dimension. This concept can also be used as an important vehicle for self-powered systemson- chip. We provide theoretical analysis supported by simulation data followed by experimental verification of on-chip thermoelectricity generation from dissipated (otherwise wasted) heat of a microprocessor.

  19. Fabrication of a capacitive relative humidity sensor using aluminum thin films deposited on etched printed circuit board

    Directory of Open Access Journals (Sweden)

    Lee Jacqueline Ann L.

    2016-01-01

    Full Text Available A capacitive humidity-sensing device was created by thermal evaporation of 99.999% aluminum. The substrate used for the coating was etched double-sided printed circuit board. The etched printed circuit board serves as the dielectric of the capacitor while the aluminum thin films deposited on either side serve as the plates of the capacitor. The capacitance was measured before and after exposure to humidity. The device was then calibrated by comparing the readings of capacitance with that of the relative humidity sensor of the Vernier LabQuest2. It was found that there is a linear relationship between the capacitance and relative humidity given by the equation C=1.418RH+29.139 where C is the capacitance and RH is the relative humidity. The surface of the aluminum films is porous and it is through these pores that water is adsorbed and capillary condensation occurs, thereby causing the capacitance to change upon exposure to humidity.

  20. Two-Phase Instability Characteristics of Printed Circuit Steam Generator for the Low Pressure Condition

    International Nuclear Information System (INIS)

    Kang, Han-Ok; Han, Hun Sik; Kim, Young-In; Kim, Keung Koo

    2015-01-01

    Reduction of installation space for steam generators can lead to much smaller reactor vessel with resultant decrease of overall manufacturing cost for the components. A PCHE(Printed Circuit Heat Exchanger) is one of the compact types of heat exchangers available as an alternative to conventional shell and tube heat exchangers. Its name is derived from the procedure used to manufacture the flat metal plates that form the core of the heat exchanger, which is done by chemical milling. These plates are then stacked and diffusion bonded, converting the plates into a solid metal block containing precisely engineered fluid flow passages. PCSG(Printed Circuit Steam Generator) is a potential candidate to be applied to the integral reactor with its compactness and mechanical robustness. For the introduction of new steam generator, design requirement for the two-phase flow instability should be considered. This paper describes two-phase flow instability characteristics of PCSG for the low pressure condition. PCSG is a potential candidate to be applied to the integral reactor with its compactness and mechanical robustness. Interconnecting flow path was developed to mitigate the two-phase flow instability in the cold side. The flow characteristics of two-phase flow instability at the PCSG is examined experimentally in this study

  1. Ductile electroless Ni-P coating onto flexible printed circuit board

    Science.gov (United States)

    Wang, Wenchang; Zhang, Weiwei; Wang, Yurong; Mitsuzak, Naotoshi; Chen, Zhidong

    2016-03-01

    In this study, a ductile electroless Ni-P coating on the flexible printed circuit board (FPCB) was prepared in an acidic nickel plating bath. The addition of dipropylamine (DPA) in electroless plating not only improves the ductility of the Ni-P coating, but also enhances the corrosion resistance. The further analysis reveals that the ductility improvement and enhancement of corrosion resistance for the Ni-P coating may be due to the fact that the addition of DPA significantly refines the volume of columnar nodule and reduce the porosity, thus leading to the released internal stress. In addition, it was found that the nodule within the Ni-P coating grew into a columnar structure, which may be also contribute to the improvement of ductility.

  2. Effects of mould on electrochemical migration behaviour of immersion silver finished printed circuit board.

    Science.gov (United States)

    Yi, Pan; Xiao, Kui; Dong, Chaofang; Zou, Shiwen; Li, Xiaogang

    2018-02-01

    The role played by mould in the electrochemical migration (ECM) behaviour of an immersion silver finished printed circuit board (PCB-ImAg) under a direct current (DC) bias was investigated. An interesting phenomenon is found whereby mould, especially Aspergillus niger, can preferentially grow well on PCB-ImAg under electrical bias and then bridge integrated circuits and form a migration path. The cooperation of the mould and DC bias aggravates the ECM process occurring on PCB-ImAg. When the bias voltage is below 15V, ECM almost does not occur for Ag coating. Mechanisms that explain the ECM processes of PCB-ImAg in the presence of mould and DC bias are proposed. Copyright © 2017. Published by Elsevier B.V.

  3. Printed circuit board recycling: Physical processing and copper extraction by selective leaching.

    Science.gov (United States)

    Silvas, Flávia P C; Correa, Mónica M Jiménez; Caldas, Marcos P K; de Moraes, Viviane T; Espinosa, Denise C R; Tenório, Jorge A S

    2015-12-01

    Global generation of waste electrical and electronic equipment (WEEE) is about 40 million tons per year. Constant increase in WEEE generation added to international legislations has improved the development of processes for materials recovery and sustainability of electrical and electronic industry. This paper describes a new hydrometallurgical route (leaching process) to recycle printed circuit boards (PCBs) from printers to recover copper. Methodology included PCBs characterization and a combined route of physical and hydrometallurgical processing. Magnetic separation, acid digestion and chemical analysis by ICP-OES were performed. On leaching process were used two stages: the first one in a sulfuric media and the second in an oxidant media. The results showed that the PCBs composition was 74.6 wt.% of non-magnetic material and 25.4 wt.% of magnetic one. The metallic fraction corresponded to 44.0 wt.%, the polymeric to 28.5 wt.% and the ceramic to 27.5 wt.%. The main metal was copper and its initial content was 32.5 wt.%. On sulfuric leaching 90 wt.% of Al, 40 wt.% of Zn and 8.6 wt.% of Sn were extracted, whereas on oxidant leaching tests the extraction percentage of Cu was 100 wt.%, of Zn 60 wt.% and of Al 10 wt.%. At the end of the hydrometallurgical processing was obtained 100% of copper extraction and the recovery factor was 98.46%, which corresponds to a 32 kg of Cu in 100 kg of PCB. Copyright © 2015 Elsevier Ltd. All rights reserved.

  4. Search for the optimal size of printed circuit boards for mechanical structures for electronic equipment

    Directory of Open Access Journals (Sweden)

    Yefimenko A. A.

    2014-12-01

    Full Text Available The authors present a method, an algorithm and a program, designed to determine the optimal size of printed circuit boards (PCB of mechanical structures and different kinds of electronic equipment. The PCB filling factor is taken as an optimization criterion. The method allows one to quickly determine the dependence of the filling factor on the size of the PCB for various components.

  5. Homogenization on Multi-Materials’ Elements: Application to Printed Circuit Boards and Warpage Analysis

    Directory of Open Access Journals (Sweden)

    Araújo Manuel

    2016-01-01

    Full Text Available Multi-material domains are often found in industrial applications. Modelling them can be computationally very expensive due to meshing requirements. The finite element properties comprising different materials are hardly accurate. In this work, a new homogenization method that simplifies the computation of the homogenized Young modulus, Poisson ratio and thermal expansion coefficient is proposed, and applied to composite-like material on a printed circuit board. The results show a good properties correspondence between the homogenized domain and the real geometry simulation.

  6. Comparative study of electromagnetic compatibility methods in printed circuit board design tools

    International Nuclear Information System (INIS)

    Marinova, Galia

    2002-01-01

    The paper considers the state-of-the art in electromagnetic compatibility (EMC) oriented printed circuit board (PCB) design. A general methodology of EMC oriented PCB design is synthesized. The main CAD tools available today are estimated and compared for their abilities to treat EMC oriented design. To help non experts a knowledge-base containing more than 50 basic rules for EMC-oriented PCB design is proposed. It can be applied in the PCB design CAD tools that possess rule-builders or it can help interactive design. Trends in this area of EMC-oriented PCB design are deduced. (Author)

  7. Nuclear code case development of printed-circuit heat exchangers with thermal and mechanical performance testing

    Energy Technology Data Exchange (ETDEWEB)

    Aakre, Shaun R. [Univ. of Wisconsin, Madison, WI (United States). Dept. of Mechanical Engineering; Jentz, Ian W. [Univ. of Wisconsin, Madison, WI (United States). Dept. of Mechanical Engineering; Anderson, Mark H. [Univ. of Wisconsin, Madison, WI (United States). Dept. of Mechanical Engineering

    2018-03-27

    The U.S. Department of Energy has agreed to fund a three-year integrated research project to close technical gaps involved with compact heat exchangers to be used in nuclear applications. This paper introduces the goals of the project, the research institutions, and industrial partners working in collaboration to develop a draft Boiler and Pressure Vessel Code Case for this technology. Heat exchanger testing, as well as non-destructive and destructive evaluation, will be performed by researchers across the country to understand the performance of compact heat exchangers. Testing will be performed using coolants and conditions proposed for Gen IV Reactor designs. Preliminary observations of the mechanical failure mechanisms of the heat exchangers using destructive and non-destructive methods is presented. Unit-cell finite element models assembled to help predict the mechanical behavior of these high-temperature components are discussed as well. Performance testing methodology is laid out in this paper along with preliminary modeling results, an introduction to x-ray and neutron inspection techniques, and results from a recent pressurization test of a printed-circuit heat exchanger. The operational and quality assurance knowledge gained from these models and validation tests will be useful to developers of supercritical CO2 systems, which commonly employ printed-circuit heat exchangers.

  8. Modelling the transient analysis of flat miniature heat pipes in printed circuit boards using a control volume approacht

    NARCIS (Netherlands)

    Wits, W.W.; Kok, J.B.W.; van Steenhoven, A.A.; van der Meer, T.H.; Stoffels, G.G.M.

    2008-01-01

    The heat pipe is a two-phase cooling solution, offering very high thermal coefficients, for heat transport. Therefore, it is increasingly used in the design of electronic products. Flat miniature heat pipes are able to effectively remove heat from several hot spots on a Printed Circuit Board (PCB).

  9. A laser printing based approach for printed electronics

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, T.; Hu, M.; Guo, Q.; Zhang, W.; Yang, J., E-mail: jyang@eng.uwo.ca [Department of Mechanical and Materials Engineering, Western University, London N6A 3K7 (Canada); Liu, Y.; Lau, W. [Chengdu Green Energy and Green Manufacturing Technology R& D Center, 355 Tengfei Road, 620107 Chengdu (China); Wang, X. [Department of Mechanical and Materials Engineering, Western University, London N6A 3K7 (Canada); Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000 (China)

    2016-03-07

    Here we report a study of printing of electronics using an office use laser printer. The proposed method eliminates those critical disadvantages of solvent-based printing techniques by taking the advantages of electroless deposition and laser printing. The synthesized toner acts as a catalyst for the electroless copper deposition as well as an adhesion-promoting buffer layer between the substrate and deposited copper. The easy metallization of printed patterns and strong metal-substrate adhesion make it an especially effective method for massive production of flexible printed circuits. The proposed process is a high throughput, low cost, efficient, and environmentally benign method for flexible electronics manufacturing.

  10. A laser printing based approach for printed electronics

    International Nuclear Information System (INIS)

    Zhang, T.; Hu, M.; Guo, Q.; Zhang, W.; Yang, J.; Liu, Y.; Lau, W.; Wang, X.

    2016-01-01

    Here we report a study of printing of electronics using an office use laser printer. The proposed method eliminates those critical disadvantages of solvent-based printing techniques by taking the advantages of electroless deposition and laser printing. The synthesized toner acts as a catalyst for the electroless copper deposition as well as an adhesion-promoting buffer layer between the substrate and deposited copper. The easy metallization of printed patterns and strong metal-substrate adhesion make it an especially effective method for massive production of flexible printed circuits. The proposed process is a high throughput, low cost, efficient, and environmentally benign method for flexible electronics manufacturing.

  11. Evaluation of gold and silver leaching from printed circuit board of cellphones.

    Science.gov (United States)

    Petter, P M H; Veit, H M; Bernardes, A M

    2014-02-01

    Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining "reference" values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2h at 60°C and 80°C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO3were made. The leaching of Au and Ag with alternative reagents: Na2S2O3, and (NH4)2S2O3 in 0.1M concentration with the addition of CuSO4, NH4OH, and H2O2, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO4 was added. Copyright © 2013 Elsevier Ltd. All rights reserved.

  12. Modular integration of electronics and microfluidic systems using flexible printed circuit boards.

    Science.gov (United States)

    Wu, Amy; Wang, Lisen; Jensen, Erik; Mathies, Richard; Boser, Bernhard

    2010-02-21

    Microfluidic systems offer an attractive alternative to conventional wet chemical methods with benefits including reduced sample and reagent volumes, shorter reaction times, high-throughput, automation, and low cost. However, most present microfluidic systems rely on external means to analyze reaction products. This substantially adds to the size, complexity, and cost of the overall system. Electronic detection based on sub-millimetre size integrated circuits (ICs) has been demonstrated for a wide range of targets including nucleic and amino acids, but deployment of this technology to date has been limited due to the lack of a flexible process to integrate these chips within microfluidic devices. This paper presents a modular and inexpensive process to integrate ICs with microfluidic systems based on standard printed circuit board (PCB) technology to assemble the independently designed microfluidic and electronic components. The integrated system can accommodate multiple chips of different sizes bonded to glass or PDMS microfluidic systems. Since IC chips and flex PCB manufacturing and assembly are industry standards with low cost, the integrated system is economical for both laboratory and point-of-care settings.

  13. 3-D printed 2.4 GHz rectifying antenna for wireless power transfer applications

    Science.gov (United States)

    Skinner, Matthew

    In this work, a 3D printed rectifying antenna that operates at the 2.4GHz WiFi band was designed and manufactured. The printed material did not have the same properties of bulk material, so the printed materials needed to be characterized. The antenna and rectifying circuit was printed out of Acrylonitrile Butadiene Styrene (ABS) filament and a conductive silver paste, with electrical components integrated into the circuit. Before printing the full rectifying antenna, each component was printed and evaluated. The printed antenna operated at the desired frequency with a return loss of -16 dBm with a bandwidth of 70MHz. The radiation pattern was measured in an anechoic chamber with good matching to the model. The rectifying circuit was designed in Ansys Circuit Simulation using Schottky diodes to enable the circuit to operate at lower input power levels. Two rectifying circuits were manufactured, one by printing the conductive traces with silver ink, and one with traces made from copper. The printed silver ink is less conductive than the bulk copper and therefore the output voltage of the printed rectifier was lower than the copper circuit. The copper circuit had an efficiency of 60% at 0dBm and the printed silver circuit had an efficiency of 28.6% at 0dBm. The antenna and rectifying circuits were then connected to each other and the performance was compared to a fully printed integrated rectifying antenna. The rectifying antennas were placed in front of a horn antenna while changing the power levels at the antenna. The efficiency of the whole system was lower than the individual components but an efficiency of 11% at 10dBm was measured.

  14. Treatment of Wastewater from Electroplating, Metal Finishing and Printed Circuit Board Manufacturing. Operation of Wastewater Treatment Plants Volume 4.

    Science.gov (United States)

    California State Univ., Sacramento. Dept. of Civil Engineering.

    One of four manuals dealing with the operation of wastewater plants, this document was designed to address the treatment of wastewater from electroplating, metal finishing, and printed circuit board manufacturing. It emphasizes how to operate and maintain facilities which neutralize acidic and basic waters; treat waters containing metals; destroy…

  15. Simultaneous detection of lactate and glucose by integrated printed circuit board based array sensing chip

    Energy Technology Data Exchange (ETDEWEB)

    Li, Xuelian [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China); School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715 (China); Zang, Jianfeng [Department of Mechanical Engineering and Materials Science, Duke University, Durham, NC 27708 (United States); Liu, Yingshuai; Lu, Zhisong [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China); Li, Qing, E-mail: Qli@swu.edu.cn [School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715 (China); Li, Chang Ming, E-mail: ecmli@swu.edu.cn [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China)

    2013-04-10

    Highlights: ► An integrated printed circuit board (PCB) based array sensing chip was developed. ► Simultaneous detection of lactate and glucose in serum has been demonstrated. ► The array electronic biochip has high signal to noise ratio and high sensitivity. ► Additional electrodes were designed on the chip to correct interferences. -- Abstract: An integrated printed circuit board (PCB) based array sensing chip was developed to simultaneously detect lactate and glucose in mouse serum. The novelty of the chip relies on a concept demonstration of inexpensive high-throughput electronic biochip, a chip design for high signal to noise ratio and high sensitivity by construction of positively charged chitosan/redox polymer Polyvinylimidazole-Os (PVI-Os)/carbon nanotube (CNT) composite sensing platform, in which the positively charged chitosan/PVI-Os is mediator and electrostatically immobilizes the negatively charged enzyme, while CNTs function as an essential cross-linker to network PVI-Os and chitosan due to its negative charged nature. Additional electrodes on the chip with the same sensing layer but without enzymes were prepared to correct the interferences for high specificity. Low detection limits of 0.6 μM and 5 μM were achieved for lactate and glucose, respectively. This work could be extended to inexpensive array sensing chips with high sensitivity, good specificity and high reproducibility for various sensor applications.

  16. SOURCES OF COPPER IONS AND SELECTED METHODS OF THEIR REMOVAL FROM WASTEWATER FROM THE PRINTED CIRCUITS BOARD PRODUCTION

    Directory of Open Access Journals (Sweden)

    Maciej Thomas

    2014-10-01

    Full Text Available This paper presents the issues related to the presence and removal of copper compounds from industrial effluents with including wastewater from plants involved in the production of printed circuit boards. Characterized the toxicological properties of selected copper compounds, described the applicable technological processes, sources of copper ions in the effluents and selected methods for their removal.

  17. Novel waste printed circuit board recycling process with molten salt

    OpenAIRE

    Riedewald, Frank; Sousa-Gallagher, Maria

    2015-01-01

    The objective of the method was to prove the concept of a novel waste PCBs recycling process which uses inert, stable molten salts as the direct heat transfer fluid and, simultaneously, uses this molten salt to separate the metal products in either liquid (solder, zinc, tin, lead, etc.) or solid (copper, gold, steel, palladium, etc.) form at the operating temperatures of 450?470??C. The PCB recovery reactor is essentially a U-shaped reactor with the molten salt providing a continuous fluid, a...

  18. Removal of organic compounds from wastewater originating from the production of printed circuit boards by UV-Fenton method

    Directory of Open Access Journals (Sweden)

    Thomas Maciej

    2017-12-01

    Full Text Available The possibility of removing organic compounds from wastewater originating from the photochemical production of printed circuit boards by use of waste acidification and disposal of precipitated photopolymer in the first stage and the UV-Fenton method in a second stage has been presented. To optimize the process of advanced oxidation, the RSM (Response Surface Methodology for three independent factors was applied, i.e. pH, the concentration of Fe(II and H2O2 concentration. The use of optimized values of individual parameters in the process of wastewater treatment caused a decrease in the concentration of the organic compounds denoted as COD by approx. 87% in the first stage and approx. 98% after application of both processes. Precipitation and the decomposition of organic compounds was associated with a decrease of wastewater COD to below 100 mg O2/L whereas the initial value was 5550 mg O2/L. Decomposition of organic compounds and verification of the developed model of photopolymers removal was also carried out with use of alternative H2O2 sources i.e. CaO2, MgO2, and Na2CO3·1,5H2O2.

  19. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

  20. Scalable printed electronics: an organic decoder addressing ferroelectric non-volatile memory

    Science.gov (United States)

    Ng, Tse Nga; Schwartz, David E.; Lavery, Leah L.; Whiting, Gregory L.; Russo, Beverly; Krusor, Brent; Veres, Janos; Bröms, Per; Herlogsson, Lars; Alam, Naveed; Hagel, Olle; Nilsson, Jakob; Karlsson, Christer

    2012-01-01

    Scalable circuits of organic logic and memory are realized using all-additive printing processes. A 3-bit organic complementary decoder is fabricated and used to read and write non-volatile, rewritable ferroelectric memory. The decoder-memory array is patterned by inkjet and gravure printing on flexible plastics. Simulation models for the organic transistors are developed, enabling circuit designs tolerant of the variations in printed devices. We explain the key design rules in fabrication of complex printed circuits and elucidate the performance requirements of materials and devices for reliable organic digital logic. PMID:22900143

  1. Comparative Study of Crosstalk Reduction Techniques in RF Printed Circuit Board Using FDTD Method

    Directory of Open Access Journals (Sweden)

    Rajeswari Packianathan

    2015-01-01

    Full Text Available Miniaturization of the feature size in modern electronic circuits results from placing interconnections in close proximity with a high packing density. As a result, coupling between the adjacent lines has increased significantly, causing crosstalk to become an important concern in high-performance circuit design. In certain applications, microstriplines may be used in printed circuit boards for propagating high-speed signals, rather than striplines. Here, the electromagnetic coupling effects are analyzed for various microstrip transmission line structures, namely, microstriplines with a guard trace, double stub microstriplines, and parallel serpentine microstriplines using the finite-difference time-domain method. The numerical results are compared with simulation results, where the variants are simulated using an Ansoft high-frequency structure simulator. The analysis and simulation results are experimentally validated by fabricating a prototype and establishing a good correspondence between them. Numerical results are compared with simulation and experimental results, showing that double stub microstriplines reduce the far end crosstalk by 7 dB and increase the near end crosstalk by about 2 dB compared with the parallel microstriplines. Parallel serpentine microstriplines reduce the far end crosstalk by more than 10 dB and also reduce more than 15 mV of peak far end crosstalk voltage, compared with parallel microstriplines.

  2. Introduction to printed electronics

    CERN Document Server

    Suganuma, Katsuaki

    2014-01-01

    This book describes in detail modern technologies for printed electronics, explaining how nanotechnology and modern printing technology are merging to revolutionize electronics fabrication of thin, lightweight, large, and inexpensive products. Readers will benefit from the explanations of materials, devices and circuits used to design and implement the latest applications of printed electronics, such as thin flexible OLED displays, organic solar cells, OLED lighting, smart wallpaper, sensors, logic, memory and more.

  3. Liquid oil and residual characteristics of printed circuit board recycle by pyrolysis

    Energy Technology Data Exchange (ETDEWEB)

    Lin, Kuo-Hsiung [Department of Environmental Engineering and Science, Fooyin University, Kaohsiung, Taiwan (China); Chiang, Hung-Lung, E-mail: hlchiang@mail.cmu.edu.tw [Department of Health Risk Management, China Medical University, Taichung, Taiwan (China)

    2014-04-01

    Highlights: • Pyrolysis is a technology for recycling of the non-metal fraction of PCBs. • Liquid product constituents were analyzed for PCB pyrolysis. • Water-soluble ionic species were determined for PCB pyrolysis exhaust. - Abstract: Non-metal fractions of waste printed circuit boards (PCBs) were thermally treated (200–500 °C) under nitrogen atmosphere. Carbon, hydrogen, and nitrogen were determined by elemental analyzer, bromine by instrumental neutron activation analysis (INAA), phosphorus by energy dispersive X-ray spectrometer (EDX), and 29 trace elements by inductively coupled plasma atomic emission spectrometer (ICP-AES) and mass spectrometry (ICP-MS) for raw material and pyrolysis residues. Organic compositions of liquid oil were identified by GC (gas chromatography)–MS, trace element composition by ICP system, and 12 water-soluble ions by IC (ionic chromatography). Elemental content of carbon was >450 mg/g, oxygen 300 mg/g, bromine and hydrogen 60 mg/g, nitrogen 30 mg/g, and phosphorus 28 mg/g. Sulfur was trace in PCBs. Copper content was 25–28 mg/g, iron 1.3–1.7 mg/g, tin 0.8–1.0 mg/g and magnesium 0.4–1.0 mg/g; those were the main metals in the raw materials and pyrolytic residues. In the liquid products, carbon content was 68–73%, hydrogen was 10–14%, nitrogen was 4–5%, and sulfur was less than 0.05% at pyrolysis temperatures from 300 to 500 °C. Phenol, 3-bromophenol, 2-methylphenol and 4-propan-2-ylphenol were major species in liquid products, accounting for >50% of analyzed organic species. Bromides, ammonium and phosphate were the main species in water sorption samples for PCB pyrolysis exhaust.

  4. Pressure drop and heat transfer characteristics of a high-temperature printed circuit heat exchanger

    International Nuclear Information System (INIS)

    Chen, Minghui; Sun, Xiaodong; Christensen, Richard N.; Skavdahl, Isaac; Utgikar, Vivek; Sabharwall, Piyush

    2016-01-01

    Highlights: • Pressure drop and heat transfer characteristics of a high-temperature printed circuit heat exchanger have been obtained. • Comparisons of experimental data and available correlations have been performed. • New Fanning friction factor and heat transfer correlations for the test PCHE are developed. - Abstract: Printed circuit heat exchanger (PCHE) is one of the leading intermediate heat exchanger (IHX) candidates to be employed in the very-high-temperature gas-cooled reactors (VHTRs) due to its capability for high-temperature, high-pressure applications. In the current study, a reduced-scale zigzag-channel PCHE was fabricated using Alloy 617 plates for the heat exchanger core and Alloy 800H pipes for the headers. The pressure drop and heat transfer characteristics of the PCHE were investigated experimentally in a high-temperature helium test facility (HTHF) at The Ohio State University. The PCHE helium inlet temperatures and pressures were varied up to 464 °C/2.7 MPa for the cold side and 802 °C/2.7 MPa for the hot side, respectively, while the maximum helium mass flow rates on both sides of the PCHE reached 39 kg/h. The corresponding maximum channel Reynolds number was approximately 3558, covering the laminar flow and laminar-to-turbulent flow transition regimes. New pressure drop and heat transfer correlations for the current zigzag channels with rounded bends were developed based on the experimental data. Comparisons between the experimental data and the results obtained from the available PCHE and straight circular pipe correlations were conducted. Compared to the heat transfer performance in straight circular pipes, the zigzag channels provided little advantage in the laminar flow regime but significant advantage near the transition flow regime.

  5. A wearable tracking device inkjet-printed on textile

    KAUST Repository

    Krykpayev, Bauyrzhan

    2017-05-20

    Despite the abundance of localization applications, the tracking devices have never been truly realized in E-textiles. Standard printed circuit board (PCB)-based devices are obtrusive and rigid and hence not suitable for textile based implementations. An attractive option would be direct printing of circuit layout on the textile itself, negating the use of rigid PCB materials. However, high surface roughness and porosity of textiles prevents efficient and reliable printing of electronics on textile. In this work, by printing an interface layer on the textile first, a complete localization circuit integrated with an antenna has been inkjet-printed on the textile for the first time. Printed conductive traces were optimized in terms of conductivity and resolution by controlling the number of over-printed layers. The tracking device determines the wearer\\'s position using WiFi and this information can be displayed on any internet-enabled device, such as smart phone. The device is compact (55mm×45mm) and lightweight (22g with 500mAh battery) for people to comfortably wear it and can be easily concealed in case discretion is required. The device operates at 2.4GHz communicated up to a distance of 55m, with localization accuracy of up to 8m.

  6. The circuit designer's companion

    CERN Document Server

    Williams, Tim

    1991-01-01

    The Circuit Designer's Companion covers the theoretical aspects and practices in analogue and digital circuit design. Electronic circuit design involves designing a circuit that will fulfill its specified function and designing the same circuit so that every production model of it will fulfill its specified function, and no other undesired and unspecified function.This book is composed of nine chapters and starts with a review of the concept of grounding, wiring, and printed circuits. The subsequent chapters deal with the passive and active components of circuitry design. These topics are foll

  7. Process development for recovery of copper and precious metals from waste printed circuit boards with emphasize on palladium and gold leaching and precipitation.

    Science.gov (United States)

    Behnamfard, Ali; Salarirad, Mohammad Mehdi; Veglio, Francesco

    2013-11-01

    A novel hydrometallurgical process was proposed for selective recovery of Cu, Ag, Au and Pd from waste printed circuit boards (PCBs). More than 99% of copper content was dissolved by using two consecutive sulfuric acid leaching steps in the presence of H2O2 as oxidizing agents. The solid residue of 2nd leaching step was treated by acidic thiourea in the presence of ferric iron as oxidizing agent and 85.76% Au and 71.36% Ag dissolution was achieved. The precipitation of Au and Ag from acidic thiourea leachate was investigated by using different amounts of sodium borohydride (SBH) as a reducing agent. The leaching of Pd and remained gold from the solid reside of 3rd leaching step was performed in NaClO-HCl-H2O2 leaching system and the effect of different parameters was investigated. The leaching of Pd and specially Au increased by increasing the NaClO concentration up to 10V% and any further increasing the NaClO concentration has a negligible effect. The leaching of Pd and Au increased by increasing the HCl concentration from 2.5 to 5M. The leaching of Pd and Au were endothermic and raising the temperature had a positive effect on leaching efficiency. The kinetics of Pd leaching was quite fast and after 30min complete leaching of Pd was achieved, while the leaching of Au need a longer contact time. The best conditions for leaching of Pd and Au in NaClO-HCl-H2O2 leaching system were determined to be 5M HCl, 1V% H2O2, 10V% NaClO at 336K for 3h with a solid/liquid ratio of 1/10. 100% of Pd and Au of what was in the chloride leachate were precipitated by using 2g/L SBH. Finally, a process flow sheet for the recovery of Cu, Ag, Au and Pd from PCB was proposed. Copyright © 2013 Elsevier Ltd. All rights reserved.

  8. Thermo-hydraulic Analysis of a Water-cooled Printed Circuit Heat Exchanger in a Small-scale Nitrogen Loop

    International Nuclear Information System (INIS)

    Kim, Chan Soo; Hong, Sung Deok; Kim, Min Hwan; Shim, Jaesool; Lee, Gyung Dong

    2013-01-01

    The development of high-temperature heat exchangers is very important because of its higher operation temperature and pressure than those of common light water reactors and industrial process plants. In particular, the intermediate heat exchanger is a key-challenged high temperature component in a Very High Temperature gas-cooled Reactor (VHTR). A printed circuit heat exchanger is one of the candidates for an intermediate heat exchanger in a VHTR. The printed circuit heat exchanger (PCHE) was developed and commercialized by HEATRIC. The compactness is better than any other heat exchanger types, because its core matrices are fabricated by diffusion bonding with photo-chemically etched micro-channels. Various tests and analysis have been performed to verify the performance of PCHE. The thermal stress analysis of the high temperature PCHE is necessary to endure the extremely operation condition of IHX. In this study, the thermo-hydraulic analysis for the laboratory-scale PCHE is performed to provide the input data for the boundary conditions of a structural analysis. The results from the first-principal calculation are compared with those from computational fluid dynamics code analysis. COMSOL 4.3a analysis is successfully performed at the uniform pressure drop condition in a set of flow channel stacks. The heat-exchanged region concentrated to the nitrogen inlet cause the uniform mass velocity distribution in the channels, therefore there is little difference between two analytical results

  9. Potentials for Improvement of Resource Efficiency in Printed Circuit Board Manufacturing: A Case Study Based on Material Flow Cost Accounting

    Directory of Open Access Journals (Sweden)

    Yi-Xuan Wang

    2017-05-01

    Full Text Available The pursuit of sustainable resource use by manufacturing companies is driven by resource scarcity, environmental awareness, and cost savings potentials. To address these issues, Material Flow Cost Accounting (MFCA has been developed and applied as an effective environmental management tool. Within MFCA’s general allocation, the accounts of products and losses are overrated by weight or volume. However, such a method is incompatible with Printed Circuit Board (PCB manufacturing because of industry characteristics in which primary inputs and products are measured by area. Based on MFCA, this case study systematically established several linear cost calculation models along the production process for capturing the actual waste flows as well as performing cost-benefit analysis. The recognition of previously ignored losses offered the incentive to find appropriate indicators to conduct cost-benefit analysis on hotspots for losses. Loss identification and analysis indicated that machining and wiring are the necessities and priorities of process optimization for resource efficiency improvement measures. Therefore, this research could not only advance the achievement of a profitable and sustainable production while improving resource efficiency at the source but could also provide support for decision making in PCB manufacturing.

  10. A microelectromechanical accelerometer fabricated using printed circuit processing techniques

    Science.gov (United States)

    Rogers, J. E.; Ramadoss, R.; Ozmun, P. M.; Dean, R. N.

    2008-01-01

    A microelectromechanical systems (MEMS) capacitive-type accelerometer fabricated using printed circuit processing techniques is presented. A Kapton polymide film is used as the structural layer for fabricating the MEMS accelerometer. The accelerometer proof mass along with four suspension beams is defined in the Kapton polyimide film. The proof mass is suspended above a Teflon substrate using a spacer. The deflection of the proof mass is detected using a pair of capacitive sensing electrodes. The top electrode of the accelerometer is defined on the top surface of the Kapton film. The bottom electrode is defined in the metallization on the Teflon substrate. The initial gap height is determined by the distance between the bottom electrode and the Kapton film. For an applied external acceleration (normal to the proof mass), the proof mass deflects toward or away from the fixed bottom electrode due to inertial force. This deflection causes either a decrease or increase in the air-gap height thereby either increasing or decreasing the capacitance between the top and the bottom electrodes. An example PCB MEMS accelerometer with a square proof mass of membrane area 6.4 mm × 6.4 mm is reported. The measured resonant frequency is 375 Hz and the Q-factor in air is 0.52.

  11. A microelectromechanical accelerometer fabricated using printed circuit processing techniques

    International Nuclear Information System (INIS)

    Rogers, J E; Ramadoss, R; Ozmun, P M; Dean, R N

    2008-01-01

    A microelectromechanical systems (MEMS) capacitive-type accelerometer fabricated using printed circuit processing techniques is presented. A Kapton polymide film is used as the structural layer for fabricating the MEMS accelerometer. The accelerometer proof mass along with four suspension beams is defined in the Kapton polyimide film. The proof mass is suspended above a Teflon substrate using a spacer. The deflection of the proof mass is detected using a pair of capacitive sensing electrodes. The top electrode of the accelerometer is defined on the top surface of the Kapton film. The bottom electrode is defined in the metallization on the Teflon substrate. The initial gap height is determined by the distance between the bottom electrode and the Kapton film. For an applied external acceleration (normal to the proof mass), the proof mass deflects toward or away from the fixed bottom electrode due to inertial force. This deflection causes either a decrease or increase in the air-gap height thereby either increasing or decreasing the capacitance between the top and the bottom electrodes. An example PCB MEMS accelerometer with a square proof mass of membrane area 6.4 mm × 6.4 mm is reported. The measured resonant frequency is 375 Hz and the Q-factor in air is 0.52

  12. A miniature rigid/flex salinity measurement device fabricated using printed circuit processing techniques

    International Nuclear Information System (INIS)

    Broadbent, H A; Ketterl, T P; Reid, C S

    2010-01-01

    The design, fabrication and initial performance of a single substrate, miniature, low-cost conductivity, temperature, depth (CTD) sensor board with interconnects are presented. In combination these sensors measure ocean salinity. The miniature CTD device board was designed and fabricated as the main component of a 50 mm × 25 mm × 25 mm animal-attached biologger. The board was fabricated using printed circuit processes and consists of two distinct regions on a continuous single liquid crystal polymer substrate: an 18 mm × 28 mm rigid multi-metal sensor section and a 72 mm long flexible interconnect section. The 95% confidence intervals for the conductivity, temperature and pressure sensors were demonstrated to be ±0.083 mS cm −1 , 0.01 °C, and ±0.135 dbar, respectively.

  13. 3D Printing of Ball Grid Arrays

    Science.gov (United States)

    Sinha, Shayandev; Hines, Daniel; Dasgupta, Abhijit; Das, Siddhartha

    Ball grid arrays (BGA) are interconnects between an integrated circuit (IC) and a printed circuit board (PCB), that are used for surface mounting electronic components. Typically, lead free alloys are used to make solder balls which, after a reflow process, establish a mechanical and electrical connection between the IC and the PCB. High temperature processing is required for most of these alloys leading to thermal shock causing damage to ICs. For producing flexible circuits on a polymer substrate, there is a requirement for low temperature processing capabilities (around 150 C) and for reducing strain from mechanical stresses. Additive manufacturing techniques can provide an alternative methodology for fabricating BGAs as a direct replacement for standard solder bumped BGAs. We have developed aerosol jet (AJ) printing methods to fabricate a polymer bumped BGA. As a demonstration of the process developed, a daisy chain test chip was polymer bumped using an AJ printed ultra violet (UV) curable polymer ink that was then coated with an AJ printed silver nanoparticle laden ink as a conducting layer printed over the polymer bump. The structure for the balls were achieved by printing the polymer ink using a specific toolpath coupled with in-situ UV curing of the polymer which provided good control over the shape, resulting in well-formed spherical bumps on the order of 200 um wide by 200 um tall for this initial demonstration. A detailed discussion of the AJ printing method and results from accelerated life-time testing will be presented

  14. Computational algorithms for analysis of data from thin-film thermoresistors on a radio-electronic printed circuit board

    International Nuclear Information System (INIS)

    Korneeva, Anna; Shaydurov, Vladimir

    2016-01-01

    In the paper, the data analysis is considered for thin-film thermoresistors coated on to a radio-electronic printed circuit board to determine possible zones of its overheating. A mathematical model consists in an underdetermined system of linear algebraic equations with an infinite set of solutions. For computing a more real solution, two additional conditions are used: the smoothness of a solution and the positiveness of an increase of temperature during overheating. Computational experiments demonstrate that an overheating zone is determined exactly with a tolerable accuracy of temperature in it.

  15. Evolution of electronic waste toxicity: Trends in innovation and regulation.

    Science.gov (United States)

    Chen, Mengjun; Ogunseitan, Oladele A; Wang, Jianbo; Chen, Haiyan; Wang, Bin; Chen, Shu

    2016-01-01

    Rapid innovation in printed circuit board, and the uncertainties surrounding quantification of the human and environmental health impacts of e-waste disposal have made it difficult to confirm the influence of evolving e-waste management strategies and regulatory policies on materials. To assess these influences, we analyzed hazardous chemicals in a market-representative set of Waste printed circuit boards (WPCBs, 1996-2010). We used standard leaching tests to characterize hazard potential and USEtox® to project impacts on human health and ecosystem. The results demonstrate that command-and-control regulations have had minimal impacts on WPCBs composition and toxicity risks; whereas technological innovation may have been influenced more by resource conservation, including a declining trend in the use of precious metals such as gold. WPCBs remain classified as hazardous under U.S. and California laws because of excessive toxic metals. Lead poses the most significant risk for cancers; zinc for non-cancer diseases; copper had the largest potential impact on ecosystem quality. Among organics, acenaphthylene, the largest risk for cancers; naphthalene for non-cancer diseases; pyrene has the highest potential for ecotoxicological impacts. These findings support the need for stronger enforcement of international policies and technology innovation to implement the strategy of design-for-the-environment and to encourage recovery, recycling, and reuse of WPCBs. Copyright © 2016 Elsevier Ltd. All rights reserved.

  16. High-Temperature Test of 800HT Printed Circuit Heat Exchanger in HELP

    International Nuclear Information System (INIS)

    Kim, Chan Soo; Hong, Sung-Deok; Kim, Min Hwan; Shim, Jaesool

    2014-01-01

    Korea Atomic Energy Research Institute has developed high-temperature Printed Circuit Heat Exchangers (PCHE) for a Very High Temperature gas-cooled Reactor and operated a very high temperature Helium Experimental LooP (HELP) to verify the performance of the high temperature heat exchanger at the component level environment. PCHE is one of the candidates for the intermediate heat exchanger in a VHTR, because its design temperature and pressure are larger than any other compact heat exchanger types. High temperature PCHEs in HELP consist of an alloy617 PCHE and an 800HT PCHE. This study presents the high temperature test of an 800HT PCHE in HELP. The experimental data include the pressure drops, the overall heat transfer coefficients, and the surface temperature distributions under various operating conditions. The experimental data are compared with the thermo-hydraulic analysis from COMSOL. In addition, the single channel tests are performed to quantify the friction factor under normal nitrogen and helium inlet conditions. (author)

  17. Sustainability issues in circuit board recycling

    DEFF Research Database (Denmark)

    Legarth, Jens Brøbech; Alting, Leo; Baldo, Gian Luca

    1995-01-01

    The resource recovery and environmental impact issues of printed circuit board recycling by secondary copper smelters are discussed. Guidelines concerning material selection for circuit board manufacture and concerning the recycling processes are given to enhance recovery efficiency and to lower...

  18. Oscillator circuits

    CERN Document Server

    Graf, Rudolf F

    1996-01-01

    This series of circuits provides designers with a quick source for oscillator circuits. Why waste time paging through huge encyclopedias when you can choose the topic you need and select any of the specialized circuits sorted by application?This book in the series has 250-300 practical, ready-to-use circuit designs, with schematics and brief explanations of circuit operation. The original source for each circuit is listed in an appendix, making it easy to obtain additional information.Ready-to-use circuits.Grouped by application for easy look-up.Circuit source listing

  19. Measuring circuits

    CERN Document Server

    Graf, Rudolf F

    1996-01-01

    This series of circuits provides designers with a quick source for measuring circuits. Why waste time paging through huge encyclopedias when you can choose the topic you need and select any of the specialized circuits sorted by application?This book in the series has 250-300 practical, ready-to-use circuit designs, with schematics and brief explanations of circuit operation. The original source for each circuit is listed in an appendix, making it easy to obtain additional information.Ready-to-use circuits.Grouped by application for easy look-up.Circuit source listings

  20. ChemicalVia: a CERN-patented technology for use in high-density circuits

    CERN Multimedia

    Patrice Loïez

    2003-01-01

    High-density multilayer printed circuits such as those pictured here are found in miniaturized modern equipment from video cameras to mobile phones. Adjacent layers in these circuits are electrically connected by microvias, consisting of a small-diameter hole (usually 50 µm) with a thin metal-deposited surface covering their cylindrical walls to ensure local conductivity between the two layers. ChemicalVia is a new method, patented by CERN, to make microvias on high-density multilayer printed circuits using chemicals rather than complex laser, plasma or photoimaging technology. The process is compatible with all standard printed-circuit assembly lines, and has the advantages of low initial investment and reduced manufacturing costs. http://www.cern.ch/ttdatabase

  1. Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: a case study of electronic component factory

    Directory of Open Access Journals (Sweden)

    Sakulkaew Srisang

    2014-09-01

    Full Text Available The objective of this research is a reduction of an adhesive stain defect in flexible printed circuit board in hot pressing process, the electronic factory. The manufacturing have been processing by sheet type of products with ninety-six pieces of flexible printed circuit boards. Causes of the problem include the before and internal hot pressing process. In process beginning times, the most right row of products between the cooling plate and the hot pressing machine has temperature 71.2◦C that is higher than glass transition temperature (Tg 60◦C. Those products’ temperature lead to evaporate a polyimide adhesive before hot pressing process beginning. The internal hot pressing process include the preheat times and the pressure time. In the preheat time the problem is a gap between lower and upper plate, was under specification(Under 1 mm and leaded to adhesive polyimide stain. In the actuality this time requires temperature and low pressure that mean a gap within 1 – 2 mm (between lower and upper plate. In pressure times the hot pressing plate surface is not flat and products are pressed by insufficient force that it lead to generate an adhesive stain on flexible printed circuit boards. That force is measured by the pre-scale paper and a result, RGB color, is provided. And then color density (From standard color sample and RGB color (From pre-scale paper is found out the relation by Photoshop program and multiple regression theory using. The formula is applied to compare with defect so as to find out the suitable color density (Defects reducing. The solving solutions is provided including the gap reduced adjustment between cooling plate and hot pressing machine before hot pressing process, the plate adjustment within specification in the preheat time and the pressing plate polishing in the pressure time. Results of study and solving are provide defect reduction from 24.4 percentage to 7.2 percentage of total study product.

  2. Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: A case study of electronic component factory

    Directory of Open Access Journals (Sweden)

    Sakulkaew Srisang

    2015-03-01

    Full Text Available The objective of this research is a reduction of an adhesive stain defect in flexible printed circuit board in hot pressing process, the electronic factory. The manufacturing have been processing by sheet type of products with ninety-six pieces of flexible printed circuit boards. Causes of the problem include the before and internal hot pressing process. In process beginning times, the most right row of products between the cooling plate and the hot pressing machine has temperature 71.2◦C that is higher than glass transition temperature (Tg 60◦C. Those products’ temperature lead to evaporate a polyimide adhesive before hot pressing process beginning. The internal hot pressing process include the preheat times and the pressure time. In the preheat time the problem is a gap between lower and upper plate, was under specification (Under 1 mm and leaded to adhesive polyimide stain. In the actuality this time requires temperature and low pressure that mean a gap within 1 – 2 mm (between lower and upper plate. In pressure times the hot pressing plate surface is not flat and products are pressed by insufficient force that it lead to generate an adhesive stain on flexible printed circuit boards. That force is measured by the pre-scale paper and a result, RGB color, is provided. And then color density (From standard color sample and RGB color (From pre-scale paper is found out the relation by Photoshop program and multiple regression theory using. The formula is applied to compare with defect so as to find out the suitable color density (Defects reducing. The solving solutions is provided including the gap reduced adjustment between cooling plate and hot pressing machine before hot pressing process, the plate adjustment within specification in the preheat time and the pressing plate polishing in the pressure time. Results of study and solving are provide defect reduction from 24.4 percentage to 7.2 percentage of total study product.

  3. Leaching of Electronic Waste Using Biometabolised Acids

    Institute of Scientific and Technical Information of China (English)

    M. Saidan; B. Brown; M. Valix

    2012-01-01

    The revolution in information and communication technology has brought huge technical benefits and wealth, but has created a major global problem: the generation of vast amounts of electronic waste, or e-waste through product obsolesce. The challenge in managing e-waste will be in developing sustainable recycling tech- nologies that are able to address the volume and complexity of this waste using cost effective and ecologically sen-sitive methods. In this study, the capability or microorganism metabolic acids in dissolving the metallic tractions from waste printed circuit boards was examined. Several factors were considered in the examination of the activityof the acids-including secondary reactions, solution pH, temperature and the nature of ligands in solutions (or bioacid constituents). The leaching tests were cgnducted ex-situ, using synthetic organic acids. Leaching was performed for periods of up to 6 hat 70-90 ℃ and 1000 r-min-1.

  4. Disassembly and physical separation of electric/electronic components layered in printed circuit boards (PCB).

    Science.gov (United States)

    Lee, Jaeryeong; Kim, Youngjin; Lee, Jae-chun

    2012-11-30

    Although printed circuit boards (PCBs) contain various elements, only the major elements (i.e., those with content levels in wt% or over grade) of and precious metals (e.g., Ag, Au, and platinum groups) contained within PCBs can be recycled. To recover other elements from PCBs, the PCBs should be properly disassembled as the first step of the recycling process. The recovery of these other elements would be beneficial for efforts to conserve scarce resources, reuse electric/electronic components (EECs), and eliminate environmental problems. This paper examines the disassembly of EECs from wasted PCBs (WPCBs) and the physical separation of these EECs using a self-designed disassembling apparatus and a 3-step separation process of sieving, magnetic separation, and dense medium separation. The disassembling efficiencies were evaluated by using the ratio of grinding area (E(area)) and the weight ratio of the detached EECs (E(weight)). In the disassembly treatment, these efficiencies were improved with an increase of grinder speed and grinder height. 97.7% (E(area)) and 98% (E(weight)) could be accomplished ultimately by 3 repetitive treatments at a grinder speed of 5500 rpm and a grinder height of 1.5mm. Through a series of physical separations, most groups of the EECs (except for the diode, transistor, and IC chip groups) could be sorted at a relatively high separation efficiency of about 75% or more. To evaluate the separation efficiency with regard to the elemental composition, the distribution ratio (R(dis)) and the concentration ratio (R(conc)) were used. 15 elements could be separated with the highest R(dis) and R(conc) in the same separated division. This result implies that the recyclability of the elements is highly feasible, even though the initial content in EECs is lower than several tens of mg/kg. Copyright © 2012 Elsevier B.V. All rights reserved.

  5. Advanced circuit simulation using Multisim workbench

    CERN Document Server

    Báez-López, David; Cervantes-Villagómez, Ofelia Delfina

    2012-01-01

    Multisim is now the de facto standard for circuit simulation. It is a SPICE-based circuit simulator which combines analog, discrete-time, and mixed-mode circuits. In addition, it is the only simulator which incorporates microcontroller simulation in the same environment. It also includes a tool for printed circuit board design.Advanced Circuit Simulation Using Multisim Workbench is a companion book to Circuit Analysis Using Multisim, published by Morgan & Claypool in 2011. This new book covers advanced analyses and the creation of models and subcircuits. It also includes coverage of transmissi

  6. Chip-by-chip configurable interconnection using digital printing techniques

    International Nuclear Information System (INIS)

    Mashayekhi, Mohammad; Carrabina, Jordi; Winchester, Lee; Laurila, Mika-Matti; Mäntysalo, Matti; Ogier, Simon; Terés, Lluís

    2017-01-01

    Printed electronics technologies add new fabrication concepts to the classical set of microelectronic processes. Among these, the use of digital printing techniques such as inkjet permits the deposition of materials on top of preexisting substrates without any mask. This allows individual personalization of electronic circuits. Different proposals have been made to make use of such a property: (1) wiring new metallic layers on top of circuits to build programmable logic array-like circuits, (2) programming OTP ROM like memories, and (3) building inkjet-configurable gate arrays. The capability of building an individual circuit with technological steps simpler than photolithographic ones opens a concept similar to the successful field programmable gate array. Although nowadays the process resolution is still low, it can quickly evolve to higher wiring densities and therefore permit a greater level of transistor integration. In this paper, we propose a new structure to realize the connections only by deposition of conductive dots oriented to optimize the area needed to implement the drop-on-demand (DoD) wiring at circuit level. One important feature of this structure is that it minimizes the amount of printed material required for the connection thereby reducing failures often seen with DoD printing techniques for conductive lines. These structures have been validated by two different DoD technologies: inkjet and superfine jet, and have been compared to mask-based photolithography technology with promising results. (paper)

  7. Use of large pieces of printed circuit boards for bioleaching to avoid 'precipitate contamination problem' and to simplify overall metal recovery.

    Science.gov (United States)

    Adhapure, N N; Dhakephalkar, P K; Dhakephalkar, A P; Tembhurkar, V R; Rajgure, A V; Deshmukh, A M

    2014-01-01

    Very recently bioleaching has been used for removing metals from electronic waste. Most of the research has been targeted to using pulverized PCBs for bioleaching where precipitate formed during bioleaching contaminates the pulverized PCB sample and making the overall metal recovery process more complicated. In addition to that, such mixing of pulverized sample with precipitate also creates problems for the final separation of non metallic fraction of PCB sample. In the present investigation we attempted the use of large pieces of printed circuit boards instead of pulverized sample for removal of metals. Use of large pieces of PCBs for bioleaching was restricted due to the chemical coating present on PCBs, the problem has been solved by chemical treatment of PCBs prior to bioleaching. In short,•Large pieces of PCB can be used for bioleaching instead of pulverized PCB sample.•Metallic portion on PCBs can be made accessible to bacteria with prior chemical treatment of PCBs.•Complete metal removal obtained on PCB pieces of size 4 cm × 2.5 cm with the exception of solder traces. The final metal free PCBs (non metallic) can be easily recycled and in this way the overall recycling process (metallic and non metallic part) of PCBs becomes simple.

  8. Integration of microelectronic chips in microfluidic systems on printed circuit board

    International Nuclear Information System (INIS)

    Burdallo, I; Jimenez-Jorquera, C; Fernández-Sánchez, C; Baldi, A

    2012-01-01

    A new scheme for the integration of small semiconductor transducer chips with microfluidic structures on printed circuit board (PCB) is presented. The proposed approach is based on a packaging technique that yields a large and flat area with small and shallow (∼44 µm deep) openings over the chips. The photocurable encapsulant material used, based on a diacrylate bisphenol A polymer, enables irreversible bonding of polydimethylsiloxane microfluidic structures at moderate temperatures (80 °C). This integration scheme enables the insertion of transducer chips in microfluidic systems with a lower added volume than previous schemes. Leakage tests have shown that the bonded structures withstand more than 360 kPa of pressure. A prototype microfluidic system with two detection chips, including one inter-digitated electrode (IDE) chip for conductivity and one ion selective field effect transistor (ISFET) chip for pH, has been implemented and characterized. Good electrical insulation of the chip contacts and silicon edge surfaces from the solution in the microchannels has been achieved. This integration procedure opens the door to the low-cost fabrication of complex analytical microsystems that combine the extraordinary potential of both the microfluidics and silicon microtechnology fields. (paper)

  9. Influence Of Used Bacterial Culture On Zinc And Aluminium Bioleaching From Printed Circuit Boards

    Directory of Open Access Journals (Sweden)

    Mrazikova Anna

    2015-06-01

    Full Text Available Bioleaching processes were used to solubilize metals (Cu, Ni, Zn and Al from printed circuit boards (PCBs. In this study, a PCBs-adapted pure culture of Acidithiobacillus ferrooxidans, pure culture of Acidithiobacillus thiooxidans and PCBs-adapted mixed culture of A. ferrooxidans and A. thiooxidans were used for recovery of the metals. The study showed that the mixed bacterial culture has the greatest potential to dissolve metals. The maximum metal bioleaching efficiencies were found to be 100, 92, 89 and 20% of Cu, Ni, Zn and Al, respectively. The mixed culture revealed higher bacterial stability. The main factor responsible for high metal recovery was the ability of the mixed culture to maintain the low pH during the whole process. The pure culture of A. thiooxidans had no significant effect on metal bioleaching from PCBs.

  10. Portrayals in Print: Media Depictions of the Informal Sector’s Involvement in Managing E-Waste in India

    Directory of Open Access Journals (Sweden)

    Verena Radulovic

    2018-03-01

    Full Text Available For over a decade, media stories have exposed health and environmental harm caused by informal electronics recycling in less industrialized countries. Greater awareness of these risks helped inform regulations across the globe and the development of recycling standards. Yet, media depictions also shape public perceptions of informal workers and their role in handling electronic waste, or e-waste. This paper examines how mainstream print media describes the informal sector’s involvement in handling e-waste in India, especially as policymakers and other stakeholders currently grapple with how to integrate informal workers into formal, more transparent e-waste management schemes. This study evaluates depictions of the informal sector in print articles from both non-Indian and Indian news media outlets, employing controversy mapping principles and digital research tools. Findings may help inform stakeholder agendas seeking to influence public awareness on how to integrate informal workers into viable e-waste management solutions. Subsequent research based on these results could also help stakeholders understand the actors and networks that shape such media depictions. Results from the dataset show that most news articles describe informal workers negatively or problematically due to activities causing health risks and environmental damage, but usually do not discern which activities in the value chain (e.g., collection, dismantling, metals extraction represent the greatest risks. Comparatively fewer articles portray informal workers positively or as contributing to e-waste solutions. Most articles also do not explain challenges that arise when working with informal workers. As such, media depictions today often lag behind policy debates and obscure multiple facets—good and bad—of the informal sector’s involvement in managing e-waste. Thus, an opportunity exists for policymakers, manufacturers, and advocacy groups to bridge the gap between

  11. Quantitative Leaching of a Spent Cell Phone Printed Circuit Board by Hydrochloric acid

    Directory of Open Access Journals (Sweden)

    Alafara A. Baba

    2014-07-01

    Full Text Available This paper presents a kinetic data on the hydrometallurgical recovery of some metal ions from a printed circuit board (PCB of a spent cell phone by hydrochloric acid leaching. The effects of acid concentration, temperature and particle diameter on the dissolution efficiency at various leaching time intervals were examined. The results of the leaching investigations showed that the powdered cell phone dissolution increases with increasing acid concentration, system temperature with decreasing particle diameter at 360 rpm. With 2M HCl solution, about 88.49% of the sample was dissolved within 120 minutes using 0.075-0.112 mm particle diameter at 800 C. The results of the study indicated that the dissolution reaction could be represented by a shrinking core model with surface chemical reaction. A value of 0.61, 60.67 kJ/mol and 12.9s-1 were calculated as reaction order, activation energy and frequency factor, respectively for the dissolution process.

  12. Estimation of Relative Permittivity of Printed Circuit Board with Fiber Glass Epoxy as Dielectric for UHF Applications

    Directory of Open Access Journals (Sweden)

    Ronal D. Montoya-Montoya

    2013-11-01

    Full Text Available This paper presents the results of measuring relative permittivity of fiber glass printed circuit board (PCB’s, using a rectangular resonant cavity. The relative permittivity is presented as function of frequency. To obtain resonant frequencies, the return loss was measured using a network analyzer. Relative permittivity was calculated by finding frequencies of resonant cavity modes. The results are presented in a frequency span of 1 to 3.5GHz. It was clearly shown the nonlinear behavior of the relative permittivity for the dielectric laminate evaluated, even what happens respect to the frequency of the resonant modes below and above to frequency of 2 GHz.

  13. Inkjet printing and adhesion characterisation of conductive tracks on a commercial printed circuit board material

    International Nuclear Information System (INIS)

    Sridhar, A.; Dijk, D.J. van; Akkerman, R.

    2009-01-01

    Silver nanoparticle-based conductive tracks were inkjet printed using a piezoelectric drop-on-demand inkjet printer on a commercially available electronics grade fibre glass (E-glass) reinforced substrate material, and the experimental results have been summarised. Ink jetting was done on two variants of this substrate material, viz. etched and unetched, to determine the influence of substrate surface topography on adhesion and accuracy of the printed tracks. The pull-off adhesion test method was used to quantify adhesive strength. The dependence of the pull-off test results on local geometry of the test area are illustrated with the aid of scanning electron microscope images and interferometer studies. Based on the outcomes of the experiments, conclusions concerning the suitable surface topography for inkjet printing have been arrived at.

  14. Novel waste printed circuit board recycling process with molten salt.

    Science.gov (United States)

    Riedewald, Frank; Sousa-Gallagher, Maria

    2015-01-01

    The objective of the method was to prove the concept of a novel waste PCBs recycling process which uses inert, stable molten salts as the direct heat transfer fluid and, simultaneously, uses this molten salt to separate the metal products in either liquid (solder, zinc, tin, lead, etc.) or solid (copper, gold, steel, palladium, etc.) form at the operating temperatures of 450-470 °C. The PCB recovery reactor is essentially a U-shaped reactor with the molten salt providing a continuous fluid, allowing molten salt access from different depths for metal recovery. A laboratory scale batch reactor was constructed using 316L as suitable construction material. For safety reasons, the inert, stable LiCl-KCl molten salts were used as direct heat transfer fluid. Recovered materials were washed with hot water to remove residual salt before metal recovery assessment. The impact of this work was to show metal separation using molten salts in one single unit, by using this novel reactor methodology. •The reactor is a U-shaped reactor filled with a continuous liquid with a sloped bottom representing a novel reactor concept.•This method uses large PCB pieces instead of shredded PCBs as the reactor volume is 2.2 L.•The treated PCBs can be removed via leg B while the process is on-going.

  15. Novel waste printed circuit board recycling process with molten salt

    Science.gov (United States)

    Riedewald, Frank; Sousa-Gallagher, Maria

    2015-01-01

    The objective of the method was to prove the concept of a novel waste PCBs recycling process which uses inert, stable molten salts as the direct heat transfer fluid and, simultaneously, uses this molten salt to separate the metal products in either liquid (solder, zinc, tin, lead, etc.) or solid (copper, gold, steel, palladium, etc.) form at the operating temperatures of 450–470 °C. The PCB recovery reactor is essentially a U-shaped reactor with the molten salt providing a continuous fluid, allowing molten salt access from different depths for metal recovery. A laboratory scale batch reactor was constructed using 316L as suitable construction material. For safety reasons, the inert, stable LiCl–KCl molten salts were used as direct heat transfer fluid. Recovered materials were washed with hot water to remove residual salt before metal recovery assessment. The impact of this work was to show metal separation using molten salts in one single unit, by using this novel reactor methodology. • The reactor is a U-shaped reactor filled with a continuous liquid with a sloped bottom representing a novel reactor concept. • This method uses large PCB pieces instead of shredded PCBs as the reactor volume is 2.2 L. • The treated PCBs can be removed via leg B while the process is on-going. PMID:26150977

  16. Uniformity of fully gravure printed organic field-effect transistors

    International Nuclear Information System (INIS)

    Hambsch, M.; Reuter, K.; Stanel, M.; Schmidt, G.; Kempa, H.; Fuegmann, U.; Hahn, U.; Huebler, A.C.

    2010-01-01

    Fully mass-printed organic field-effect transistors were made completely by means of gravure printing. Therefore a special printing layout was developed in order to avoid register problems in print direction. Upon using this layout, contact pads for source-drain electrodes of the transistors are printed together with the gate electrodes in one and the same printing run. More than 50,000 transistors have been produced and by random tests a yield of approximately 75% has been determined. The principle suitability of the gravure printed transistors for integrated circuits has been shown by the realization of ring oscillators.

  17. Use of large pieces of printed circuit boards for bioleaching to avoid ‘precipitate contamination problem’ and to simplify overall metal recovery

    Science.gov (United States)

    Adhapure, N.N.; Dhakephalkar, P.K.; Dhakephalkar, A.P.; Tembhurkar, V.R.; Rajgure, A.V.; Deshmukh, A.M.

    2014-01-01

    Very recently bioleaching has been used for removing metals from electronic waste. Most of the research has been targeted to using pulverized PCBs for bioleaching where precipitate formed during bioleaching contaminates the pulverized PCB sample and making the overall metal recovery process more complicated. In addition to that, such mixing of pulverized sample with precipitate also creates problems for the final separation of non metallic fraction of PCB sample. In the present investigation we attempted the use of large pieces of printed circuit boards instead of pulverized sample for removal of metals. Use of large pieces of PCBs for bioleaching was restricted due to the chemical coating present on PCBs, the problem has been solved by chemical treatment of PCBs prior to bioleaching. In short,•Large pieces of PCB can be used for bioleaching instead of pulverized PCB sample.•Metallic portion on PCBs can be made accessible to bacteria with prior chemical treatment of PCBs.•Complete metal removal obtained on PCB pieces of size 4 cm × 2.5 cm with the exception of solder traces. The final metal free PCBs (non metallic) can be easily recycled and in this way the overall recycling process (metallic and non metallic part) of PCBs becomes simple. PMID:26150951

  18. Mixed low-level waste minimization at Los Alamos

    International Nuclear Information System (INIS)

    Starke, T.P.

    1998-01-01

    During the first six months of University of California 98 Fiscal Year (July--December) Los Alamos National Laboratory has achieved a 57% reduction in mixed low-level waste generation. This has been accomplished through a systems approach that identified and minimized the largest MLLW streams. These included surface-contaminated lead, lead-lined gloveboxes, printed circuit boards, and activated fluorescent lamps. Specific waste minimization projects have been initiated to address these streams. In addition, several chemical processing equipment upgrades are being implemented. Use of contaminated lead is planned for several high energy proton beam stop applications and stainless steel encapsulated lead is being evaluated for other radiological control area applications. INEEL is assisting Los Alamos with a complete systems analysis of analytical chemistry derived mixed wastes at the CMR building and with a minimum life-cycle cost standard glovebox design. Funding for waste minimization upgrades has come from several sources: generator programs, waste management, the generator set-aside program, and Defense Programs funding to INEEL

  19. Mixed low-level waste minimization at Los Alamos

    Energy Technology Data Exchange (ETDEWEB)

    Starke, T.P.

    1998-12-01

    During the first six months of University of California 98 Fiscal Year (July--December) Los Alamos National Laboratory has achieved a 57% reduction in mixed low-level waste generation. This has been accomplished through a systems approach that identified and minimized the largest MLLW streams. These included surface-contaminated lead, lead-lined gloveboxes, printed circuit boards, and activated fluorescent lamps. Specific waste minimization projects have been initiated to address these streams. In addition, several chemical processing equipment upgrades are being implemented. Use of contaminated lead is planned for several high energy proton beam stop applications and stainless steel encapsulated lead is being evaluated for other radiological control area applications. INEEL is assisting Los Alamos with a complete systems analysis of analytical chemistry derived mixed wastes at the CMR building and with a minimum life-cycle cost standard glovebox design. Funding for waste minimization upgrades has come from several sources: generator programs, waste management, the generator set-aside program, and Defense Programs funding to INEEL.

  20. Advances in Current Rating Techniques for Flexible Printed Circuits

    Science.gov (United States)

    Hayes, Ron

    2014-01-01

    Twist Capsule Assemblies are power transfer devices commonly used in spacecraft mechanisms that require electrical signals to be passed across a rotating interface. Flexible printed circuits (flex tapes, see Figure 2) are used to carry the electrical signals in these devices. Determining the current rating for a given trace (conductor) size can be challenging. Because of the thermal conditions present in this environment the most appropriate approach is to assume that the only means by which heat is removed from the trace is thru the conductor itself, so that when the flex tape is long the temperature rise in the trace can be extreme. While this technique represents a worst-case thermal situation that yields conservative current ratings, this conservatism may lead to overly cautious designs when not all traces are used at their full rated capacity. A better understanding of how individual traces behave when they are not all in use is the goal of this research. In the testing done in support of this paper, a representative flex tape used for a flight Solar Array Drive Assembly (SADA) application was tested by energizing individual traces (conductors in the tape) in a vacuum chamber and the temperatures of the tape measured using both fine-gauge thermocouples and infrared thermographic imaging. We find that traditional derating schemes used for bundles of wires do not apply for the configuration tested. We also determine that single active traces located in the center of a flex tape operate at lower temperatures than those on the outside edges.

  1. Unit: Electric Circuits, Inspection Pack, National Trial Print.

    Science.gov (United States)

    Australian Science Education Project, Toorak, Victoria.

    As a part of the unit materials in the series produced by the Australian Science Education Project, this teacher edition is primarily composed of a core relating to simple circuits, a test form, and options. Options are given under the headings: Your Invention; "How Long Does a Call Last?"; One, Two, Three Wires; Parallel Circuits; More…

  2. Numerical Investigation on the Flow and Heat Transfer Characteristics of Supercritical Liquefied Natural Gas in an Airfoil Fin Printed Circuit Heat Exchanger

    OpenAIRE

    Zhongchao Zhao; Kai Zhao; Dandan Jia; Pengpeng Jiang; Rendong Shen

    2017-01-01

    As a new kind of highly compact and efficient micro-channel heat exchanger, the printed circuit heat exchanger (PCHE) is a promising candidate satisfying the heat exchange requirements of liquefied natural gas (LNG) vaporization at low and high pressure. The effects of airfoil fin arrangement on heat transfer and flow resistance were numerically investigated using supercritical liquefied natural gas (LNG) as working fluid. The thermal properties of supercritical LNG were tested by utilizing t...

  3. Nanosilver conductive lines made by spray coating and aerosol jet printing technique

    Science.gov (United States)

    Krzeminski, Jakub; Wroblewski, Grzegorz; Dybowska-Sarapuk, Lucja; Lepak, Sandra; Jakubowska, Malgorzata

    2017-08-01

    Printing electronics even though the printing techniques are known for a long time, are gaining in importance. The possibility of making the electronic circuits on flexible, big-area substrates with efficient and cheap technology make it attractive for the electronic industry. Spray coating, as a one of printing methods, additionally provide the chance to print on the non-flat, complicated shaped substrates. Despite the spray coating is mostly used to print a big pads, it is reachable to spray the separate conductive lines both as a quickly-produced prototype and as a fully manufactured circuit. Our work presents the directly printed lines with spray coating technique. For the printing process self-made ink was used. We tested three different approaches to line formation and compare them in the terms of line edge, resistivity and thickness. Line profiles provide the information about the roughness and the line size. In the end we showed the aerosol jet printed meander to give an overview of this similar to spray coating but more sophisticated technique.

  4. Heat Transfer and Pressure Drop Characteristics in Straight Microchannel of Printed Circuit Heat Exchangers

    Directory of Open Access Journals (Sweden)

    Jang-Won Seo

    2015-05-01

    Full Text Available Performance tests were carried out for a microchannel printed circuit heat exchanger (PCHE, which was fabricated with micro photo-etching and diffusion bonding technologies. The microchannel PCHE was tested for Reynolds numbers in the range of 100‒850 varying the hot-side inlet temperature between 40 °C–50 °C while keeping the cold-side temperature fixed at 20 °C. It was found that the average heat transfer rate and heat transfer performance of the countercurrrent configuration were 6.8% and 10%‒15% higher, respectively, than those of the parallel flow. The average heat transfer rate, heat transfer performance and pressure drop increased with increasing Reynolds number in all experiments. Increasing inlet temperature did not affect the heat transfer performance while it slightly decreased the pressure drop in the experimental range considered. Empirical correlations have been developed for the heat transfer coefficient and pressure drop factor as functions of the Reynolds number.

  5. Recent Advancements in Liquid Metal Flexible Printed Electronics: Properties, Technologies, and Applications

    Directory of Open Access Journals (Sweden)

    Xuelin Wang

    2016-11-01

    Full Text Available This article presents an overview on typical properties, technologies, and applications of liquid metal based flexible printed electronics. The core manufacturing material—room-temperature liquid metal, currently mainly represented by gallium and its alloys with the properties of excellent resistivity, enormous bendability, low adhesion, and large surface tension, was focused on in particular. In addition, a series of recently developed printing technologies spanning from personal electronic circuit printing (direct painting or writing, mechanical system printing, mask layer based printing, high-resolution nanoimprinting, etc. to 3D room temperature liquid metal printing is comprehensively reviewed. Applications of these planar or three-dimensional printing technologies and the related liquid metal alloy inks in making flexible electronics, such as electronical components, health care sensors, and other functional devices were discussed. The significantly different adhesions of liquid metal inks on various substrates under different oxidation degrees, weakness of circuits, difficulty of fabricating high-accuracy devices, and low rate of good product—all of which are challenges faced by current liquid metal flexible printed electronics—are discussed. Prospects for liquid metal flexible printed electronics to develop ending user electronics and more extensive applications in the future are given.

  6. Precious metal recovery from waste printed circuit boards using cyanide and non-cyanide lixiviants--A review.

    Science.gov (United States)

    Akcil, Ata; Erust, Ceren; Gahan, Chandra Sekhar; Ozgun, Mehmet; Sahin, Merve; Tuncuk, Aysenur

    2015-11-01

    Waste generated by the electrical and electronic devices is huge concern worldwide. With decreasing life cycle of most electronic devices and unavailability of the suitable recycling technologies it is expected to have huge electronic and electrical wastes to be generated in the coming years. The environmental threats caused by the disposal and incineration of electronic waste starting from the atmosphere to the aquatic and terrestrial living system have raised high alerts and concerns on the gases produced (dioxins, furans, polybrominated organic pollutants, and polycyclic aromatic hydrocarbons) by thermal treatments and can cause serious health problems if the flue gas cleaning systems are not developed and implemented. Apart from that there can be also dissolution of heavy metals released to the ground water from the landfill sites. As all these electronic and electrical waste do posses richness in the metal values it would be worth recovering the metal content and protect the environmental from the pollution. Cyanide leaching has been a successful technology worldwide for the recovery of precious metals (especially Au and Ag) from ores/concentrates/waste materials. Nevertheless, cyanide is always preferred over others because of its potential to deliver high recovery with a cheaper cost. Cyanidation process also increases the additional work of effluent treatment prior to disposal. Several non-cyanide leaching processes have been developed considering toxic nature and handling problems of cyanide with non-toxic lixiviants such as thiourea, thiosulphate, aqua regia and iodine. Therefore, several recycling technologies have been developed using cyanide or non-cyanide leaching methods to recover precious and valuable metals. Copyright © 2015 Elsevier Ltd. All rights reserved.

  7. Printed 2 V-operating organic inverter arrays employing a small-molecule/polymer blend.

    Science.gov (United States)

    Shiwaku, Rei; Takeda, Yasunori; Fukuda, Takashi; Fukuda, Kenjiro; Matsui, Hiroyuki; Kumaki, Daisuke; Tokito, Shizuo

    2016-10-04

    Printed organic thin-film transistors (OTFTs) are well suited for low-cost electronic applications, such as radio frequency identification (RFID) tags and sensors. Achieving both high carrier mobility and uniform electrical characteristics in printed OTFT devices is essential in these applications. Here, we report on printed high-performance OTFTs and circuits using silver nanoparticle inks for the source/drain electrodes and a blend of dithieno[2,3-d;2',3'-d']benzo[1,2-b;4,5-b']dithiophene (DTBDT-C 6 ) and polystyrene for the organic semiconducting layer. A high saturation region mobility of 1.0 cm 2  V -1  s -1 at low operation voltage of -5 V was obtained for relatively short channel lengths of 9 μm. All fifteen of the printed pseudo-CMOS inverter circuits were formed on a common substrate and operated at low operation voltage of 2 V with the total variation in threshold voltage of 0.35 V. Consequently, the printed OTFT devices can be used in more complex integrated circuit applications requiring low manufacturing cost over large areas.

  8. Printed 2 V-operating organic inverter arrays employing a small-molecule/polymer blend

    Science.gov (United States)

    Shiwaku, Rei; Takeda, Yasunori; Fukuda, Takashi; Fukuda, Kenjiro; Matsui, Hiroyuki; Kumaki, Daisuke; Tokito, Shizuo

    2016-10-01

    Printed organic thin-film transistors (OTFTs) are well suited for low-cost electronic applications, such as radio frequency identification (RFID) tags and sensors. Achieving both high carrier mobility and uniform electrical characteristics in printed OTFT devices is essential in these applications. Here, we report on printed high-performance OTFTs and circuits using silver nanoparticle inks for the source/drain electrodes and a blend of dithieno[2,3-d2‧,3‧-d‧]benzo[1,2-b4,5-b‧]dithiophene (DTBDT-C6) and polystyrene for the organic semiconducting layer. A high saturation region mobility of 1.0 cm2 V-1 s-1 at low operation voltage of -5 V was obtained for relatively short channel lengths of 9 μm. All fifteen of the printed pseudo-CMOS inverter circuits were formed on a common substrate and operated at low operation voltage of 2 V with the total variation in threshold voltage of 0.35 V. Consequently, the printed OTFT devices can be used in more complex integrated circuit applications requiring low manufacturing cost over large areas.

  9. Graphene-based inkjet printing of flexible bioelectronic circuits and sensors

    Science.gov (United States)

    Sinar, Dogan; Knopf, George K.; Nikumb, Suwas

    2013-03-01

    Bioelectronics involves interfacing functional biomolecules or living cells with electronic circuitry. Recent advances in electrically conductive inks and inkjet printing technologies have enabled bioelectronic devices to be fabricated on mechanically flexible polymers, paper and silk. In this research, non-conductive graphene-oxide (GO) inks are synthesized from inexpensive graphite powders. Once printed on the flexible substrate the electrical conductivity of the micro-circuitry can be restored through thermal reduction. Laser irradiation is one method being investigated for transforming the high resistance printed GO film into conductive oxygen reduced graphene-oxide (rGO). Direct laser writing is a precision fabrication process that enables the imprinting of conductive and resistive micro-features on the GO film. The mechanically flexible rGO microcircuits can be further biofunctionalized using molecular self-assembly techniques. Opportunities and challenges in exploiting these emerging technologies for developing biosensors and bioelectronic cicruits are briefly discussed.

  10. CFD Analysis on the Periodic Element of a Printed Circuit Heat Exchanger

    International Nuclear Information System (INIS)

    Tak, Nam-il; Kim, Min-Hwan; Lee, Won-Jae

    2007-01-01

    A typical printed circuit heat exchanger (PCHE) is composed of a large number of flow channels with lateral corrugations. In an effort to investigate fundamental thermo-fluid characteristics of a PCHE with corrugated channels, computational fluid dynamics (CFD) analyses were previously made in. One pair of flow channels (i.e., cold and hot channels) with the entire flow path was considered for the computational domain in the previous studies. Although only one pair of flow channels with coarse meshes was used, computational loads were found to be very high to simulate the entire flow path of the PCHE. Fortunately a recent study has shown that a simplified CFD methodology with a stream wise periodic assumption (called periodic CFD analysis) is feasible for a CFD evaluation of the thermo-fluid performance of compact heat exchangers. Since the periodic CFD analysis focuses on the periodic element of a flow channel, the required computing resources are dramatically reduced. In the present paper, the periodic CFD analysis has been applied to the periodic element of the PCHE. The results are compared with those of the full elements which have an entire flow path. Based on the periodic approach the effects of the corrugation parameters on the thermo-fluid performance of the PCHE are investigated

  11. A Low-Power Integrated Humidity CMOS Sensor by Printing-on-Chip Technology

    Directory of Open Access Journals (Sweden)

    Chang-Hung Lee

    2014-05-01

    Full Text Available A low-power, wide-dynamic-range integrated humidity sensing chip is implemented using a printable polymer sensing material with an on-chip pulse-width-modulation interface circuit. By using the inkjet printing technique, poly(3,4-ethylene-dioxythiophene/polystyrene sulfonate that has humidity sensing features can be printed onto the top metal layer of a 0.35 μm CMOS IC. The developed printing-on-chip humidity sensor achieves a heterogeneous three dimensional sensor system-on-chip architecture. The humidity sensing of the implemented printing-on-chip sensor system is experimentally tested. The sensor shows a sensitivity of 0.98% to humidity in the atmosphere. The maximum dynamic range of the readout circuit is 9.8 MΩ, which can be further tuned by the frequency of input signal to fit the requirement of the resistance of printed sensor. The power consumption keeps only 154 μW. This printing-on-chip sensor provides a practical solution to fulfill an ultra-small integrated sensor for the applications in miniaturized sensing systems.

  12. A low-power integrated humidity CMOS sensor by printing-on-chip technology.

    Science.gov (United States)

    Lee, Chang-Hung; Chuang, Wen-Yu; Cowan, Melissa A; Wu, Wen-Jung; Lin, Chih-Ting

    2014-05-23

    A low-power, wide-dynamic-range integrated humidity sensing chip is implemented using a printable polymer sensing material with an on-chip pulse-width-modulation interface circuit. By using the inkjet printing technique, poly(3,4-ethylene-dioxythiophene)/polystyrene sulfonate that has humidity sensing features can be printed onto the top metal layer of a 0.35 μm CMOS IC. The developed printing-on-chip humidity sensor achieves a heterogeneous three dimensional sensor system-on-chip architecture. The humidity sensing of the implemented printing-on-chip sensor system is experimentally tested. The sensor shows a sensitivity of 0.98% to humidity in the atmosphere. The maximum dynamic range of the readout circuit is 9.8 MΩ, which can be further tuned by the frequency of input signal to fit the requirement of the resistance of printed sensor. The power consumption keeps only 154 μW. This printing-on-chip sensor provides a practical solution to fulfill an ultra-small integrated sensor for the applications in miniaturized sensing systems.

  13. 3D Printed Shock Mitigating Structures

    Science.gov (United States)

    Schrand, Amanda; Elston, Edwin; Dennis, Mitzi; Metroke, Tammy; Chen, Chenggang; Patton, Steven; Ganguli, Sabyasachi; Roy, Ajit

    Here we explore the durability, and shock mitigating potential, of solid and cellular 3D printed polymers and conductive inks under high strain rate, compressive shock wave and high g acceleration conditions. Our initial designs include a simple circuit with 4 resistors embedded into circular discs and a complex cylindrical gyroid shape. A novel ink consisting of silver-coated carbon black nanoparticles in a thermoplastic polyurethane was used as the trace material. One version of the disc structural design has the advantage of allowing disassembly after testing for direct failure analysis. After increasing impacts, printed and traditionally potted circuits were examined for functionality. Additionally, in the open disc design, trace cracking and delamination of resistors were able to be observed. In a parallel study, we examined the shock mitigating behavior of 3D printed cellular gyroid structures on a Split Hopkinson Pressure Bar (SHPB). We explored alterations to the classic SHPB setup for testing the low impedance, cellular samples to most accurately reflect the stress state inside the sample (strain rates from 700 to 1750 s-1). We discovered that the gyroid can effectively absorb the impact of the test resulting in crushing the structure. Future studies aim to tailor the unit cell dimensions for certain frequencies, increase print accuracy and optimize material compositions for conductivity and adhesion to manufacture more durable devices.

  14. 3D printed magnetic polymer composite transformers

    Science.gov (United States)

    Bollig, Lindsey M.; Hilpisch, Peter J.; Mowry, Greg S.; Nelson-Cheeseman, Brittany B.

    2017-11-01

    The possibility of 3D printing a transformer core using fused deposition modeling methods is explored. With the use of additive manufacturing, ideal transformer core geometries can be achieved in order to produce a more efficient transformer. In this work, different 3D printed settings and toroidal geometries are tested using a custom integrated magnetic circuit capable of measuring the hysteresis loop of a transformer. These different properties are then characterized, and it was determined the most effective 3D printed transformer core requires a high fill factor along with a high concentration of magnetic particulate.

  15. Numerical investigation on thermal-hydraulic performance of new printed circuit heat exchanger model

    International Nuclear Information System (INIS)

    Kim, Dong Eok; Kim, Moo Hwan; Cha, Jae Eun; Kim, Seong O.

    2008-01-01

    Three-dimensional numerical analysis was performed to investigate heat transfer and pressure drop characteristics of supercritical CO 2 flow in new Printed Circuit Heat Exchanger (PCHE) model using commercial CFD code, Fluent 6.3. First, numerical analysis for conventional zigzag channel PCHE model was performed and compared with previous experimental data. Maximum deviation of in-outlet temperature difference and pressure drop from experimental data is about 10%. A new PCHE model has been designed to optimize thermal-hydraulic performance of PCHE. The new PCHE model has several airfoil shape fins (NACA 0020 model), which are designed to streamlined shape. Simulation results showed that in the airfoil shape fin PCHE, total heat transfer rate per unit volume was almost same with zigzag channel PCHE and the pressure drop was reduced to one-twentieth of that in zigzag channel PCHE. In airfoil shape fin PCHE model, the enhancement of heat transfer area and the uniform flow configuration contributed to obtain the same heat transfer performance with zigzag channel PCHE model. And the reduction of pressure drop in airfoil shape fin PCHE model was caused by suppressing generation of separated flow owing to streamlined shape of airfoil fins

  16. Plasma methods for metals recovery from metal-containing waste.

    Science.gov (United States)

    Changming, Du; Chao, Shang; Gong, Xiangjie; Ting, Wang; Xiange, Wei

    2018-04-27

    Metal-containing waste, a kind of new wastes, has a great potential for recycling and is also difficult to deal with. Many countries pay more and more attention to develop the metal recovery process and equipment of this kind of waste as raw material, so as to solve the environmental pollution and comprehensively utilize the discarded metal resources. Plasma processing is an efficient and environmentally friendly way for metal-containing waste. This review mainly discuss various metal-containing waste types, such as printed circuit boards (PCBs), red mud, galvanic sludge, Zircon, aluminium dross and incinerated ash, and the corresponding plasma methods, which include DC extended transferred arc plasma reactor, DC non-transferred arc plasma torch, RF thermal plasma reactor and argon and argon-hydrogen plasma jets. In addition, the plasma arc melting technology has a better purification effect on the extraction of useful metals from metal-containing wastes, a great capacity of volume reduction of waste materials, and a low leaching toxicity of solid slag, which can also be used to deal with all kinds of metal waste materials, having a wide range of applications. Copyright © 2018 Elsevier Ltd. All rights reserved.

  17. Application to printed resistors

    International Nuclear Information System (INIS)

    Hachiyanagi, Yoshimi; Uraki, Hisatsugu; Sawamura, Masashi

    1989-01-01

    Most of printed circuit boards are made at present by etching copper foils which are laminated on insulating composite boards of paper/phenol resin or glass nonwoven fabric/epoxy rein. This is called subtractive process, and since this is a wet process, the problem of coping with the pollution due to etching solution, plating solution and others is involved. As the method of solving this problem, attention has been paid to the dry process which forms conductor patterns by screen printing using electro-conductive paste. For such resin substrates, generally polymer thick films (PTF) using thermosetting resin as the binder are used. Also the research on the formation of resistors, condensers and other parts by printing using the technology of cermet thick films (CTF) and PTF is active, and it is partially put in practical use. The problems are the deformation and deterioration of substrates, therefore, as the countermeasures, electron beam hardening type PTF has been studied, and various pastes have been developed. In this paper, electron beam hardening type printed resistors are reported. The features, resistance paste, and a number of the experiments on printed resistors are described. (K.I.)

  18. Development of high-resolution two-dimensional magnetic field measurement system by use of printed-circuit technology

    Science.gov (United States)

    Akimitsu, Moe; Qinghong, Cao; Sawada, Asuka; Hatano, Hironori; Tanabe, Hiroshi; Ono, Yasushi; TS-Group Team

    2017-10-01

    We have developed a new-types of high-resolution magnetic probe array for our new magnetic reconnection experiments: TS-3U (ST, FRC: R =0.2m, 2017-) and TS-4U (ST, FRC: R =0.5m, 2018-), using the advanced printed-circuit technology. They are equipped with all three-components of magnetic pick-up coils whose size is 1-5mm x 3mm. Each coil is composed of two-sided coil pattern with line width of 0.05mm. We can install two or three printed arrays in a single glass (ceramic) tube for two or three component measurements. Based on this new probe technique, we started high-resolution and high-accuracy measurement of the current sheet thickness and studied its plasma parameter dependence. We found that the thickness of current sheet increases inversely with the guide toroidal field. It is probably determined by the ion gyroradius in agreement with the particle simulation by Horiuchi etc. While the reconnection speed is steady under low guide field condition, it is observed to oscillate in the specific range of guide field, suggesting transition from the quasi-steady reconnection to the intermittent reconnection. Cause and mechanism for intermittent reconnection will be discussed using the current sheet dissipation and dynamic balance between plasma inflow and outflow. This work supported by JSPS KAKENHI Grant Numbers 15H05750, 15K14279 and 17H04863.

  19. Feasibility of electrocoagulation/flotation treatment of waste offset printing developer based on the response surface analysis

    Directory of Open Access Journals (Sweden)

    Savka Adamovic

    2016-01-01

    Full Text Available In the printing plate developing process, the offset printing developer undergoes changes, as well as enrichment by the various chemicals, i.e. metals, organic binders and photosensitive compounds. The objective of this study was to investigate the electrocoagulation/flotation (ECF treatment efficiency for the removal of copper, turbidity and organic substances from the waste offset printing developer (WOPD. The effect of operational parameters, such as electrode materials, current density, interelectrode distance and operating time, was studied. Also, the response surface analysis was applied to evaluate the effect of main operational variables and to get a balanced removal efficiency of investigated WOPD parameters by ECF treatment. The removal efficiency increases significantly with the increasing of operating time and mainly increases with the increasing of current density. The obtained results show that the interelectrode distance and combinations of electrodes determine the removal efficiency of copper, turbidity and organic substances. Based on the obtained results, the optimized parameters for the ECF treatment removal of investigated WOPD parameters were identified as: Al(−/Fe(+ electrode combination with interelectrode distance of 1.0 cm, operating time of 5 min and current density of 8 mA cm−2. This study confirms the practical feasibility of ECF method for treating real printing industrial effluent under optimum conditions.

  20. E-waste: development of recycling process and chemical characterization of circuit printed - motherboard; Lixo eletronico: desenvolvimento de processo de reciclagem e caracterizacao quimica de placa de circuito impresso - motherboard

    Energy Technology Data Exchange (ETDEWEB)

    Junior, O.L.F.; Vargas, R.A.; Andreoli, M.; Martinelli, J.R.; Seo, E.S.M., E-mail: olfjunior@usp.br [Instituto de Pesquisas Energeticas e Nucleares (IPEN-CNEN/SP), Sao Paulo, SP (Brazil)

    2011-07-01

    The electro-electronic industry has been regulated by the National Politic of Solid Residues Act (PNRS) and Bill no. 7.404, concerning the actions, procedures, and method to collect, recycle and promotion of environmentally acceptable final destination of residues. The present work contributes to develop recycling process of printed circuit used in microcomputers and in its chemical characterization. The experimental procedure consisted of grinding, classification, magnetic and electrostatic separation, and separation based on density difference, followed by chemical characterization of the metallic and non metallic materials in the motherboard. It was determined that the amounts of Ag, Al, Ba, Cl, Cr, Cu, Fe, Mn, Pb, and Zn in the residue are above the toxicity allowable levels, and they are in the samples of the decanted material. Among the samples of the floating material, Al, Ba, Br, Ca, Cu, Fe, Pb (in less quantity), Si (in more quantity), and Sn, Ti and Zn were detected. Those materials can be useful in the preparation of red ceramics. (author)

  1. Utilization of calcium carbonate particles from eggshell waste as coating pigments for ink-jet printing paper.

    Science.gov (United States)

    Yoo, Sukjoon; Hsieh, Jeffery S; Zou, Peter; Kokoszka, John

    2009-12-01

    The effective treatment and utilization of biowaste have been emphasized in our society for environmental and economic concerns. Recently, the eggshell waste in the poultry industry has been highlighted because of its reclamation potential. This study presents an economical treatment process to recover useful bioproducts from eggshell waste and their utilization in commercial products. We developed the dissolved air floatation (DAF) separation unit, which successfully recovered 96% of eggshell membrane and 99% of eggshell calcium carbonate (ECC) particles from eggshell waste within 2 h of operation. The recovered ECC particles were utilized as coating pigments for ink-jet printing paper and their impact on the ink density and paper gloss were investigated. The addition of the ECC particles as coating pigments enhances the optical density of cyan, magenta and yellow inks while decreasing the black ink density and the gloss of the coated paper.

  2. Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

    International Nuclear Information System (INIS)

    Troeger, K.; Darka, R. Khanpour; Neumeyer, T.; Altstaedt, V.

    2014-01-01

    This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K

  3. Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

    Energy Technology Data Exchange (ETDEWEB)

    Troeger, K., E-mail: altstaedt@uni-bayreuth.de; Darka, R. Khanpour, E-mail: altstaedt@uni-bayreuth.de; Neumeyer, T., E-mail: altstaedt@uni-bayreuth.de; Altstaedt, V., E-mail: altstaedt@uni-bayreuth.de [Polymer Engineering, University of Bayreuth, Germany and Polymer Engineering, Universitaetsstrasse 30, 95447 Bayreuth (Germany)

    2014-05-15

    This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K.

  4. All-printed paper memory

    KAUST Repository

    Lien, Derhsien

    2014-08-26

    We report the memory device on paper by means of an all-printing approach. Using a sequence of inkjet and screen-printing techniques, a simple metal-insulator-metal device structure is fabricated on paper as a resistive random access memory with a potential to reach gigabyte capacities on an A4 paper. The printed-paper-based memory devices (PPMDs) exhibit reproducible switching endurance, reliable retention, tunable memory window, and the capability to operate under extreme bending conditions. In addition, the PBMD can be labeled on electronics or living objects for multifunctional, wearable, on-skin, and biocompatible applications. The disposability and the high-security data storage of the paper-based memory are also demonstrated to show the ease of data handling, which are not achievable for regular silicon-based electronic devices. We envision that the PPMDs manufactured by this cost-effective and time-efficient all-printing approach would be a key electronic component to fully activate a paper-based circuit and can be directly implemented in medical biosensors, multifunctional devices, and self-powered systems. © 2014 American Chemical Society.

  5. Laser printing of 3D metallic interconnects

    Science.gov (United States)

    Beniam, Iyoel; Mathews, Scott A.; Charipar, Nicholas A.; Auyeung, Raymond C. Y.; Piqué, Alberto

    2016-04-01

    The use of laser-induced forward transfer (LIFT) techniques for the printing of functional materials has been demonstrated for numerous applications. The printing gives rise to patterns, which can be used to fabricate planar interconnects. More recently, various groups have demonstrated electrical interconnects from laser-printed 3D structures. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or of pastes containing dispersed metallic particles. However, the generated 3D structures do not posses the same metallic conductivity as a bulk metal interconnect of the same cross-section and length as those formed by wire bonding or tab welding. An alternative is to laser transfer entire 3D structures using a technique known as lase-and-place. Lase-and-place is a LIFT process whereby whole components and parts can be transferred from a donor substrate onto a desired location with one single laser pulse. This paper will describe the use of LIFT to laser print freestanding, solid metal foils or beams precisely over the contact pads of discrete devices to interconnect them into fully functional circuits. Furthermore, this paper will also show how the same laser can be used to bend or fold the bulk metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief for the circuits under flexing or during motion from thermal mismatch. These interconnect "ridges" can span wide gaps (on the order of a millimeter) and accommodate height differences of tens of microns between adjacent devices. Examples of these laser printed 3D metallic bridges and their role in the development of next generation electronics by additive manufacturing will be presented.

  6. Adhesion characterization of inkjet printed tracks

    NARCIS (Netherlands)

    Sridhar, Ashok; Akkerman, Remko; van Dijk, D.J.

    2007-01-01

    The robustness and service life of inkjet printed electronic circuit structures are highly influenced by the state of the interface between these structures and the substrate. In the case of polymeric substrate materials, surface modification is necessary to realise a favourable interface, as these

  7. Internet of "printed" Things: low-cost fabrication of autonomous sensing nodes by inkjet printing

    Science.gov (United States)

    Kawahara, Yoshihiro

    2014-11-01

    "What if electronics devices are printed using an inkjet printer even at home?" "What if those devices no longer need a battery?" I will introduce two enabling technologies for the Internet of Things concept. 1. Instant Inkjet Circuits: A low cost, fast and accessible technology to support the rapid prototyping of electronic devices. We demonstrated that "sintering-free" silver nano particle ink with a commodity inkjet printer can be used to fabricate printed circuit board and high-frequency applications such as antennas and sensors. The technology is now commercialized by AgIC, Inc. 2. Wireless Power: Although large amounts of data can be exchanged over a wireless communication link, mobile devices are still tethered by power cables. We are trying to solve this problem by two different approaches: energy harvesting. A simple circuitry comprised of diodes and capacitor can convert ambient radio signals into DC current. Our research revealed the signals from TV tower located 6.5km apart could be used to feed 100 microwatts to power microcontrollers.

  8. Flexible circuits with integrated switches for robotic shape sensing

    Science.gov (United States)

    Harnett, C. K.

    2016-05-01

    Digital switches are commonly used for detecting surface contact and limb-position limits in robotics. The typical momentary-contact digital switch is a mechanical device made from metal springs, designed to connect with a rigid printed circuit board (PCB). However, flexible printed circuits are taking over from the rigid PCB in robotics because the circuits can bend while carrying signals and power through moving joints. This project is motivated by a previous work where an array of surface-mount momentary contact switches on a flexible circuit acted as an all-digital shape sensor compatible with the power resources of energy harvesting systems. Without a rigid segment, the smallest commercially-available surface-mount switches would detach from the flexible circuit after several bending cycles, sometimes violently. This report describes a low-cost, conductive fiber based method to integrate electromechanical switches into flexible circuits and other soft, bendable materials. Because the switches are digital (on/off), they differ from commercially-available continuous-valued bend/flex sensors. No amplification or analog-to-digital conversion is needed to read the signal, but the tradeoff is that the digital switches only give a threshold curvature value. Boundary conditions on the edges of the flexible circuit are key to setting the threshold curvature value for switching. This presentation will discuss threshold-setting, size scaling of the design, automation for inserting a digital switch into the flexible circuit fabrication process, and methods for reconstructing a shape from an array of digital switch states.

  9. Leaching of gold, silver and accompanying metals from circuit boards (PCBs waste

    Directory of Open Access Journals (Sweden)

    Jana Ficeriová

    2011-12-01

    Full Text Available Au-Ag noble metal wastes represent a wide range of waste types and forms, with various accompanying metallic elements.The presented leaching strategy for Au-Ag contained in circuit boards (PCBs aims at gaining gold and silver in the metallic form.Application of the proposed ammonium thiosulphate leaching process for the treatment of the above mentioned Au-Ag containing wastesrepresents a practical, economic and at the same time an ecological solution. The ammonium thiosulphate based leaching of gold and silverfrom PCBs waste, using crushing as a pretreatment, was investigated. It was possible to achieve 98 % gold and 93 % silver recovery within48 hours of ammonium thiosulphate leaching. This type of leaching is a better leaching procedure for recovery of gold and silver from PCBwaste than the classical toxic cyanide leaching. 84 % Cu, 82 % Fe, 77 % Al, 76 % Zn, 70 % Ni, 90 % Pd, 88 % Pb and 83 % Sn recovery ofthe accompanying metals was achieved, using sulphuric acid with hydrogen peroxide, sodium chloride and aqua regia. A four steps leachingprocess gave a very satisfactory yield and a more rapid kinetics for all observed metals solubilization than other technologies.

  10. Leaching of metals from large pieces of printed circuit boards using citric acid and hydrogen peroxide.

    Science.gov (United States)

    Jadhav, Umesh; Su, C; Hocheng, Hong

    2016-12-01

    In the present study, the leaching of metals from large pieces of computer printed circuit boards (CPCBs) was studied. A combination of citric acid (0.5 M) and 1.76 M hydrogen peroxide (H 2 O 2 ) was used to leach the metals from CPCB piece. The influence of system variables such as H 2 O 2 concentration, concentration of citric acid, shaking speed, and temperature on the metal leaching process was investigated. The complete metal leaching was achieved in 4 h from a 4 × 4 cm CPCB piece. The presence of citric acid and H 2 O 2 together in the leaching solution is essential for complete metal leaching. The optimum addition amount of H 2 O 2 was 5.83 %. The citric acid concentration and shaking speed had an insignificant effect on the leaching of metals. The increase in the temperature above 30 °C showed a drastic effect on metal leaching process.

  11. Two-step bioleaching of copper and gold from discarded printed circuit boards (PCB).

    Science.gov (United States)

    Işıldar, Arda; van de Vossenberg, Jack; Rene, Eldon R; van Hullebusch, Eric D; Lens, Piet N L

    2016-11-01

    An effective strategy for environmentally sound biological recovery of copper and gold from discarded printed circuit boards (PCB) in a two-step bioleaching process was experimented. In the first step, chemolithotrophic acidophilic Acidithiobacillus ferrivorans and Acidithiobacillus thiooxidans were used. In the second step, cyanide-producing heterotrophic Pseudomonas fluorescens and Pseudomonas putida were used. Results showed that at a 1% pulp density (10g/L PCB concentration), 98.4% of the copper was bioleached by a mixture of A. ferrivorans and A. thiooxidans at pH 1.0-1.6 and ambient temperature (23±2°C) in 7days. A pure culture of P. putida (strain WCS361) produced 21.5 (±1.5)mg/L cyanide with 10g/L glycine as the substrate. This gold complexing agent was used in the subsequent bioleaching step using the Cu-leached (by A. ferrivorans and A. thiooxidans) PCB material, 44.0% of the gold was mobilized in alkaline conditions at pH 7.3-8.6, and 30°C in 2days. This study provided a proof-of-concept of a two-step approach in metal bioleaching from PCB, by bacterially produced lixiviants. Copyright © 2015 Elsevier Ltd. All rights reserved.

  12. Investigation of printed circuit heat exchanger for VHTRs - HTR2008-58097

    International Nuclear Information System (INIS)

    Mylavarapu, S. K.; Sun, X.; Figley, J.; Needler, N. J.; Christensen, R. N.

    2008-01-01

    Very High Temperature Reactors (VHTRs) require high temperature (900-950 deg. C), high integrity, and high efficiency heat exchangers during normal and off-normal conditions. A class of compact heat exchangers, namely, the Printed Circuit Heat Exchangers (PCHEs), made of high temperature materials, found to have the above characteristics, are being increasingly pursued for heavy duty applications. A high-temperature helium experimental test facility, primarily aimed at investigating the heat transfer and pressure drop characteristics of the PCHEs, was designed and is being built at the Ohio State Univ.. The test facility was designed for a maximum operating temperature and pressure of 900 deg. C and 3 MPa, respectively. Owing to the high operating conditions, a detailed investigation various high temperature materials was carried out to aid in design of the test facility and the heat exchangers. The study showed that alloy 617 is the leading candidate material for high temperature heat exchangers. Two PCHEs, each having 10 hot 10 cold plates with 12 channels in each plate, are currently being fabricated from alloy 617 plates and will be tested once test facility is constructed. To supplement the experiments, computational fluid dynamics modeling of a simplified PCHE model is being performed and the results for three flow rate cases of 15, 40, and 90 kg/h and a system pressure of 3 MPa are discussed. In summary, this paper focuses on the study of the high-temperature materials, the design of the helium test facility, the design and fabrication of the PCHEs, and the computational modeling of a simplified PCHE model. (authors)

  13. Quality control process improvement of flexible printed circuit board by FMEA

    Science.gov (United States)

    Krasaephol, Siwaporn; Chutima, Parames

    2018-02-01

    This research focuses on the quality control process improvement of Flexible Printed Circuit Board (FPCB), centred around model 7-Flex, by using Failure Mode and Effect Analysis (FMEA) method to decrease proportion of defective finished goods that are found at the final inspection process. Due to a number of defective units that were found at the final inspection process, high scraps may be escaped to customers. The problem comes from poor quality control process which is not efficient enough to filter defective products from in-process because there is no In-Process Quality Control (IPQC) or sampling inspection in the process. Therefore, the quality control process has to be improved by setting inspection gates and IPCQs at critical processes in order to filter the defective products. The critical processes are analysed by the FMEA method. IPQC is used for detecting defective products and reducing chances of defective finished goods escaped to the customers. Reducing proportion of defective finished goods also decreases scrap cost because finished goods incur higher scrap cost than work in-process. Moreover, defective products that are found during process can reflect the abnormal processes; therefore, engineers and operators should timely solve the problems. Improved quality control was implemented for 7-Flex production lines from July 2017 to September 2017. The result shows decreasing of the average proportion of defective finished goods and the average of Customer Manufacturers Lot Reject Rate (%LRR of CMs) equal to 4.5% and 4.1% respectively. Furthermore, cost saving of this quality control process equals to 100K Baht.

  14. A wearable tracking device inkjet-printed on textile

    KAUST Repository

    Krykpayev, Bauyrzhan; Farooqui, Muhammad Fahad; Bilal, Rana Muhammad; Vaseem, Mohammad; Shamim, Atif

    2017-01-01

    Despite the abundance of localization applications, the tracking devices have never been truly realized in E-textiles. Standard printed circuit board (PCB)-based devices are obtrusive and rigid and hence not suitable for textile based

  15. Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader

    Directory of Open Access Journals (Sweden)

    Monier-Vinard Eric

    2016-01-01

    Full Text Available In order to help the electronic designer to early determine the limits of the power dissipation of electronic component, an analytical model was established to allow a fast insight of relevant design parameters of a multi-layered electronic board constitution. The proposed steady-state approach based on Fourier series method promotes a practical solution to quickly investigate the potential gain of multi-layered thermal via clusters. Generally, it has been shown a good agreement between the results obtained by the proposed analytical model and those given by electronics cooling software widely used in industry. Some results highlight the fact that the conventional practices for Printed Circuit Board modeling can be dramatically underestimate source temperatures, in particular with smaller sources. Moreover, the analytic solution could be applied to optimize the heat spreading in the board structure with a local modification of the effective thermal conductivity layers.

  16. 3D Printing: 3D Printing of Shape Memory Polymers for Flexible Electronic Devices (Adv. Mater. 22/2016).

    Science.gov (United States)

    Zarek, Matt; Layani, Michael; Cooperstein, Ido; Sachyani, Ela; Cohn, Daniel; Magdassi, Shlomo

    2016-06-01

    On page 4449, D. Cohn, S. Magdassi, and co-workers describe a general and facile method based on 3D printing of methacrylated macromonomers to fabricate shape-memory objects that can be used in flexible and responsive electrical circuits. Such responsive objects can be used in the fabrication of soft robotics, minimal invasive medical devices, sensors, and wearable electronics. The use of 3D printing overcomes the poor processing characteristics of thermosets and enables complex geometries that are not easily accessible by other techniques. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  17. Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits

    Directory of Open Access Journals (Sweden)

    Domenico Capriglione

    2018-03-01

    Full Text Available This paper deals with the electromagnetic compatibility (EMC issues related to the direct and radiated emissions from a high-speed integrated circuits (ICs. These emissions are evaluated here by means of circuital and electromagnetic models. As for the conducted emission, an equivalent circuit model is derived to describe the IC and the effect of its loads (package, printed circuit board, decaps, etc., based on the Integrated Circuit Emission Model template (ICEM. As for the radiated emission, an electromagnetic model is proposed, based on the superposition of the fields generated in the far field region by the loop currents flowing into the IC and the package pins. A custom experimental setup is designed for validating the models. Specifically, for the radiated emission measurement, a custom test board is designed and realized, able to highlight the contribution of the direct emission from the IC, usually hidden by the indirect emission coming from the printed circuit board. Measurements of the package currents and of the far-field emitted fields are carried out, providing a satisfactory agreement with the model predictions.

  18. [Electric short-circuit incident observed with "Upsher" laryngoscopes].

    Science.gov (United States)

    Tritsch, L; Vailly, B

    2006-01-01

    We observed an electrical short-circuit between a fasten screw of the printed circuit and the handle of an Upsher universal laryngoscope (serial number UQ1). The isolating Silicone layer was broken above the screw. This isolation defect was found all over our Upsher laryngoscopes of the UQ1 series. No doubt that if accumulators were used instead of batteries, emitted heat would be in largest amount and perhaps dangerous.

  19. Evolvable designs of experiments applications for circuits

    CERN Document Server

    Iordache, Octavian

    2009-01-01

    Adopting a groundbreaking approach, the highly regarded author shows how to design methods for planning increasingly complex experiments. He begins with a brief introduction to standard quality methods and the technology in standard electric circuits. The book then gives numerous examples of how to apply the proposed methodology in a series of real-life case studies. Although these case studies are taken from the printed circuit board industry, the methods are equally applicable to other fields of engineering.

  20. PENGURANGAN WASTE MENGGUNAKAN PENDEKATAN LEAN MANUFACTURING

    Directory of Open Access Journals (Sweden)

    Akhmad Jakfar

    2014-06-01

    Full Text Available PT. XYZ is one of some cigarette companies in Indonesia. In producing cigarette, the firm requires a material named “etiket” which is produced by printing division for internal consumers of PT. XYZ. In order to produce “etiket”, there are some wastes occurred. One of wastes occurred in printing division is product defects. This paper attempts to identify wastes in the division of printing using Lean Manufacturing approach by applying Value Stream Mapping (VSM method. The results from cause root analysis found that the problems caused the defects in production process. It shows that the most wastes occurs in the printing division are product defect and waiting time. The product defects are caused because there is no standard applied in processing the product and poor inspections by management, while the causes of waiting time wastes is because of lack of carrier and no standard in each process. The recommendation can be suggested to the company are adding some carrier (product’s transporter, creating process standard in each process.

  1. Vision based error detection for 3D printing processes

    Directory of Open Access Journals (Sweden)

    Baumann Felix

    2016-01-01

    Full Text Available 3D printers became more popular in the last decade, partly because of the expiration of key patents and the supply of affordable machines. The origin is located in rapid prototyping. With Additive Manufacturing (AM it is possible to create physical objects from 3D model data by layer wise addition of material. Besides professional use for prototyping and low volume manufacturing they are becoming widespread amongst end users starting with the so called Maker Movement. The most prevalent type of consumer grade 3D printers is Fused Deposition Modelling (FDM, also Fused Filament Fabrication FFF. This work focuses on FDM machinery because of their widespread occurrence and large number of open problems like precision and failure. These 3D printers can fail to print objects at a statistical rate depending on the manufacturer and model of the printer. Failures can occur due to misalignment of the print-bed, the print-head, slippage of the motors, warping of the printed material, lack of adhesion or other reasons. The goal of this research is to provide an environment in which these failures can be detected automatically. Direct supervision is inhibited by the recommended placement of FDM printers in separate rooms away from the user due to ventilation issues. The inability to oversee the printing process leads to late or omitted detection of failures. Rejects effect material waste and wasted time thus lowering the utilization of printing resources. Our approach consists of a camera based error detection mechanism that provides a web based interface for remote supervision and early failure detection. Early failure detection can lead to reduced time spent on broken prints, less material wasted and in some cases salvaged objects.

  2. Comparative assessment of metallurgical recovery of metals from electronic waste with special emphasis on bioleaching.

    Science.gov (United States)

    Priya, Anshu; Hait, Subrata

    2017-03-01

    Waste electrical and electronic equipment (WEEE) or electronic waste (e-waste) is one of the fastest growing waste streams in the urban environment worldwide. The core component of printed circuit board (PCB) in e-waste contains a complex array of metals in rich quantity, some of which are toxic to the environment and all of which are valuable resources. Therefore, the recycling of e-waste is an important aspect not only from the point of waste treatment but also from the recovery of metals for economic growth. Conventional approaches for recovery of metals from e-waste, viz. pyrometallurgical and hydrometallurgical techniques, are rapid and efficient, but cause secondary pollution and economically unviable. Limitations of the conventional techniques have led to a shift towards biometallurgical technique involving microbiological leaching of metals from e-waste in eco-friendly manner. However, optimization of certain biotic and abiotic factors such as microbial species, pH, temperature, nutrients, and aeration rate affect the bioleaching process and can lead to profitable recovery of metals from e-waste. The present review provides a comprehensive assessment on the metallurgical techniques for recovery of metals from e-waste with special emphasis on bioleaching process and the associated factors.

  3. Inkjet printing technology and conductive inks synthesis for microfabrication techniques

    International Nuclear Information System (INIS)

    Dang, Mau Chien; Dung Dang, Thi My; Fribourg-Blanc, Eric

    2013-01-01

    Inkjet printing is an advanced technique which reliably reproduces text, images and photos on paper and some other substrates by desktop printers and is now used in the field of materials deposition. This interest in maskless materials deposition is coupled with the development of microfabrication techniques for the realization of circuits or patterns on flexible substrates for which printing techniques are of primary interest. This paper is a review of some results obtained in inkjet printing technology to develop microfabrication techniques at Laboratory for Nanotechnology (LNT). Ink development, in particular conductive ink, study of printed patterns, as well as application of these to the realization of radio-frequency identification (RFID) tags on flexible substrates, are presented. (paper)

  4. Characteristics of Polybrominated Diphenyl Ethers Released from Thermal Treatment and Open Burning of E-Waste.

    Science.gov (United States)

    Li, Ting-Yu; Zhou, Jun-Feng; Wu, Chen-Chou; Bao, Lian-Jun; Shi, Lei; Zeng, Eddy Y

    2018-04-17

    Primitive processing of e-waste potentially releases abundant organic contaminants to the environment, but the magnitudes and mechanisms remain to be adequately addressed. We conducted thermal treatment and open burning of typical e-wastes, that is, plastics and printed circuit boards. Emission factors of the sum of 39 polybrominated diphenyl ethers (∑ 39 PBDE) were 817-1.60 × 10 5 ng g -1 in thermal treatment and nondetected-9.14 × 10 4 ng g -1 , in open burning. Airborne particles (87%) were the main carriers of PBDEs, followed by residual ashes (13%) and gaseous constituents (0.3%), in thermal treatment, while they were 30%, 43% and 27% in open burning. The output-input mass ratios of ∑ 39 PBDE were 0.12-3.76 in thermal treatment and 0-0.16 in open burning. All PBDEs were largely affiliated with fine particles, with geometric mean diameters at 0.61-0.83 μm in thermal degradation and 0.57-1.16 μm in open burning from plastic casings, and 0.44-0.56 and nondetected- 0.55 μm, from printed circuit boards. Evaporation and reabsorption may be the main emission mechanisms for lightly brominated BDEs, but heavily brominated BDEs tend to affiliate with particles from heating or combustion. The different size distributions of particulate PBDEs in emission sources and adjacent air implicated a noteworthy redisposition process during atmospheric dispersal.

  5. Simulation of electronic circuit sensitivity towards humidity using electrochemical data on water layer

    DEFF Research Database (Denmark)

    Joshy, Salil; Verdingovas, Vadimas; Jellesen, Morten Stendahl

    2015-01-01

    Climatic conditions like temperature and humidity have direct influence on the operation of electronic circuits. The effects of temperature on the operation of electronic circuits have been widely investigated, while the effect of humidity and solder flux residues are not well understood including...... the effect on circuit and PCBA (printed circuit board assembly) layout design. This paper elucidates a methodology for analyzing the sensitivity of an electronic circuit based on parasitic circuit analysis using data on electrical property of the water layer formed under humid as well as contaminated...

  6. FEM-based Printhead Intelligent Adjusting Method for Printing Conduct Material

    Directory of Open Access Journals (Sweden)

    Liang Xiaodan

    2017-01-01

    Full Text Available Ink-jet printing circuit board has some advantage, such as non-contact manufacture, high manufacture accuracy, and low pollution and so on. In order to improve the and printing precision, the finite element technology is adopted to model the piezoelectric print heads, and a new bacteria foraging algorithm with a lifecycle strategy is proposed to optimize the parameters of driving waveforms for getting the desired droplet characteristics. Results of numerical simulation show such algorithm has a good performance. Additionally, the droplet jetting simulation results and measured results confirmed such method precisely gets the desired droplet characteristics.

  7. On the effectiveness of a license scheme for E-waste recycling: The challenge of China and India

    International Nuclear Information System (INIS)

    Shinkuma, Takayoshi; Managi, Shunsuke

    2010-01-01

    It is well known that China and India have been recycling centers of WEEE, especially printed circuit boards, and that serious environmental pollution in these countries has been generated by improper recycling methods. After the governments of China and India banned improper recycling by the informal sector, improper recycling activities spread to other places. Then, these governments changed their policies to one of promoting proper recycling by introducing a scheme, under which E-waste recycling requires a license issued by the government. In this paper, the effectiveness of that license scheme is examined by means of an economic model. It can be shown that the license scheme can work effectively only if disposers of E-waste have a responsibility to sell E-waste to license holders. Our results run counter to the idea that international E-waste trade should be banned and provide an alternative solution to the problem.

  8. FDM 3D printed coffee glove embedded with flexible electronic

    KAUST Repository

    Bahri, Meznan

    2017-10-31

    With the advances in 3D printing technology, Flexible Electronics can now be exploited to form the so-called “Embedded Electronics”. This paper describes experiences learned from a research project which ran during summer 2016 at KAUST, in collaboration with the Electrical and Computer Engineering Department at Effat University, and aimed at creating a heating coffee glove product operating on double alkaline batteries using Kapton© as a flexible substrate for the circuit. The circuit and its batteries are encapsulated in a 3D printed glove, designed using SolidWorks©. The proposed methodology and techniques applied during this work could be further used in implementing other technologies, such as thermoelectric coolers head patches, smart garments, and flexible smartphones. Limitation and recommendation of the present methodology are also discussed.

  9. Elements configuration of the open lead test circuit

    International Nuclear Information System (INIS)

    Fukuzaki, Yumi; Ono, Akira

    2016-01-01

    In the field of electronics, small electronic devices are widely utilized because they are easy to carry. The devices have various functions by user’s request. Therefore, the lead’s pitch or the ball’s pitch have been narrowed and high-density printed circuit board has been used in the devices. Use of the ICs which have narrow lead pitch makes normal connection difficult. When logic circuits in the devices are fabricated with the state-of-the-art technology, some faults have occurred more frequently. It can be divided into types of open faults and short faults. We have proposed a new test method using a test circuit in the past. This paper propose elements configuration of the test circuit.

  10. Elements configuration of the open lead test circuit

    Energy Technology Data Exchange (ETDEWEB)

    Fukuzaki, Yumi, E-mail: 14514@sr.kagawa-nct.ac.jp [Advanced course of Electronics, Information and Communication Engineering, National Institute of Technology, Kagawa College, 551 Koda, Mitoyo, Kagawa (Japan); Ono, Akira [Department of Communication Network Engineering, National Institute of Technology, Kagawa College, 551 Koda, Mitoyo, Kagawa (Japan)

    2016-07-06

    In the field of electronics, small electronic devices are widely utilized because they are easy to carry. The devices have various functions by user’s request. Therefore, the lead’s pitch or the ball’s pitch have been narrowed and high-density printed circuit board has been used in the devices. Use of the ICs which have narrow lead pitch makes normal connection difficult. When logic circuits in the devices are fabricated with the state-of-the-art technology, some faults have occurred more frequently. It can be divided into types of open faults and short faults. We have proposed a new test method using a test circuit in the past. This paper propose elements configuration of the test circuit.

  11. Fully Printed Flexible and Stretchable Electronics

    Science.gov (United States)

    Zhang, Suoming

    Through this thesis proposal, the author has demonstrated series of flexible or stretchable sensors including strain gauge, pressure sensors, display arrays, thin film transistors and photodetectors fabricated by a direct printing process. By adopting the novel serpentine configuration with conventional non-stretchable materials silver nanoparticles, the fully printed stretchable devices are successfully fabricated on elastomeric substrate with the demonstration of stretchable conductors that can maintain the electrical properties under strain and the strain gauge, which could be used to measure the strain in desired locations and also to monitor individual person's finger motion. And by investigating the intrinsic stretchable materials silver nanowires (AgNWs) with the conventional configuration, the fully printed stretchable conductors are achieved on various substrates including Si, glass, Polyimide, Polydimethylsiloxane (PDMS) and Very High Bond (VHB) tape with the illustration of the capacitive pressure sensor and stretchable electroluminescent displays. In addition, intrinsically stretchable thin-film transistors (TFTs) and integrated logic circuits are directly printed on elastomeric PDMS substrates. The printed devices utilize carbon nanotubes and a type of hybrid gate dielectric comprising PDMS and barium titanate (BaTiO3) nanoparticles. The BaTiO3/PDMS composite simultaneously provides high dielectric constant, superior stretchability, low leakage, as well as good printability and compatibility with the elastomeric substrate. Both TFTs and logic circuits can be stretched beyond 50% strain along either channel length or channel width directions for thousands of cycles while showing no significant degradation in electrical performance. Finally, by applying the SWNTs as the channel layer of the thin film transistor, we successfully fabricate the fully printed flexible photodetector which exhibits good electrical characteristics and the transistors exhibit

  12. Internet of ''printed'' Things: low-cost fabrication of autonomous sensing nodes by inkjet printing

    International Nuclear Information System (INIS)

    Kawahara, Yoshihiro

    2014-01-01

    ''What if electronics devices are printed using an inkjet printer even at home?'' ''What if those devices no longer need a battery?'' I will introduce two enabling technologies for the Internet of Things concept. 1. Instant Inkjet Circuits: A low cost, fast and accessible technology to support the rapid prototyping of electronic devices. We demonstrated that ''sintering-free'' silver nano particle ink with a commodity inkjet printer can be used to fabricate printed circuit board and high-frequency applications such as antennas and sensors. The technology is now commercialized by AgIC, Inc. 2. Wireless Power: Although large amounts of data can be exchanged over a wireless communication link, mobile devices are still tethered by power cables. We are trying to solve this problem by two different approaches: energy harvesting. A simple circuitry comprised of diodes and capacitor can convert ambient radio signals into DC current. Our research revealed the signals from TV tower located 6.5km apart could be used to feed 100 microwatts to power microcontrollers

  13. A WiFi Tracking Device Printed Directly on Textile for Wearable Electronics Applications

    KAUST Repository

    Krykpayev, Bauyrzhan

    2015-12-01

    Wearable technology is quickly becoming commonplace in our everyday life - fit-ness and health monitors, smart watches, and Google Glass, just to name a few. It is very clear that in near future the wearable technology will only grow. One of the biggest wearable fields is the E-textiles. E-textiles empower clothes with new functionality by enhancing fabrics with electronics and interconnects. The main obstacle to the development of E-textile field is the relative difficulty and large tolerance in its manufacturing as compared to the standard circuit production. Current methods such as the application of conductive foils, embroidering of conductive wires and treatment with conductive coatings do not possess efficient, fast and reliable mass production traits inherent to the electronic industry. On the other hand, the method of conductive printing on textile has the potential to unlock the efficiency similar to PCB production, due to its roll-to-roll and reel-to-reel printing capabilities. Further-more, printing on textiles is a common practice to realize graphics, artwork, etc. and thus adaptability to conductive ink printing will be relatively easier. Even though conductive printing is a fully additive process, the end circuit layout is very similar to the one produced via PCB manufacture. However, due to high surface roughness and porosity of textiles, efficient and reliable printing on textile has remained elusive. Direct conductive printing on textile is possible but only on specialized dense and tightly interwoven fabrics. Such fabrics are usually uncommon and expensive. Another option is to employ an interface layer that flattens the textile surface, thus allowing printing on it. The interface layer method can be used with a variety of textiles such as polyester/cotton that can be found in any store, making this method promising for wearable electronics. Very few examples and that too of simple structures such as a line, square patch or electrode have been

  14. Depollution benchmarks for capacitors, batteries and printed wiring boards from waste electrical and electronic equipment (WEEE)

    International Nuclear Information System (INIS)

    Savi, Daniel; Kasser, Ueli; Ott, Thomas

    2013-01-01

    Highlights: • We’ve analysed data on the dismantling of electronic and electrical appliances. • Ten years of mass balance data of more than recycling companies have been considered. • Percentages of dismantled batteries, capacitors and PWB have been studied. • Threshold values and benchmarks for batteries and capacitors have been identified. • No benchmark for the dismantling of printed wiring boards should be set. - Abstract: The article compiles and analyses sample data for toxic components removed from waste electronic and electrical equipment (WEEE) from more than 30 recycling companies in Switzerland over the past ten years. According to European and Swiss legislation, toxic components like batteries, capacitors and printed wiring boards have to be removed from WEEE. The control bodies of the Swiss take back schemes have been monitoring the activities of WEEE recyclers in Switzerland for about 15 years. All recyclers have to provide annual mass balance data for every year of operation. From this data, percentage shares of removed batteries and capacitors are calculated in relation to the amount of each respective WEEE category treated. A rationale is developed, why such an indicator should not be calculated for printed wiring boards. The distributions of these de-pollution indicators are analysed and their suitability for defining lower threshold values and benchmarks for the depollution of WEEE is discussed. Recommendations for benchmarks and threshold values for the removal of capacitors and batteries are given

  15. Depollution benchmarks for capacitors, batteries and printed wiring boards from waste electrical and electronic equipment (WEEE)

    Energy Technology Data Exchange (ETDEWEB)

    Savi, Daniel, E-mail: d.savi@umweltchemie.ch [Dipl. Environmental Sci. ETH, büro für umweltchemie, Zurich (Switzerland); Kasser, Ueli [Lic. Phil. Nat. (Chemist), büro für umweltchemie, Zurich (Switzerland); Ott, Thomas [Dipl. Phys. ETH, Institute of Applied Simulation, Zurich University of Applied Sciences, Wädenswil (Switzerland)

    2013-12-15

    Highlights: • We’ve analysed data on the dismantling of electronic and electrical appliances. • Ten years of mass balance data of more than recycling companies have been considered. • Percentages of dismantled batteries, capacitors and PWB have been studied. • Threshold values and benchmarks for batteries and capacitors have been identified. • No benchmark for the dismantling of printed wiring boards should be set. - Abstract: The article compiles and analyses sample data for toxic components removed from waste electronic and electrical equipment (WEEE) from more than 30 recycling companies in Switzerland over the past ten years. According to European and Swiss legislation, toxic components like batteries, capacitors and printed wiring boards have to be removed from WEEE. The control bodies of the Swiss take back schemes have been monitoring the activities of WEEE recyclers in Switzerland for about 15 years. All recyclers have to provide annual mass balance data for every year of operation. From this data, percentage shares of removed batteries and capacitors are calculated in relation to the amount of each respective WEEE category treated. A rationale is developed, why such an indicator should not be calculated for printed wiring boards. The distributions of these de-pollution indicators are analysed and their suitability for defining lower threshold values and benchmarks for the depollution of WEEE is discussed. Recommendations for benchmarks and threshold values for the removal of capacitors and batteries are given.

  16. Performance of the electrical generator cell by the ferrous alloys of printed circuit board scrap and Iron Metal 1020

    Science.gov (United States)

    Sahan, Y.; Sudarsono, S.; Silviana, E.; Chairul; Wisrayetti

    2018-04-01

    Galvani cell is one of thealternative energy. This cell can be used as an electric resources. In this research, the generator cell was designed and builds to generate the electric. The generator cell consisted of the iron metal 1020 were used as anode, the ferrous alloys of printed circuit board scrapwas then used as chatode, and NaCl solution as an electrolyte. The aim of this research is to estimate the performance of this generator cell by using variation of NaCl concentration (i.e. 1%, 3%, 5%, 7%, and 9%) with the electrodes pair ( 1 and 8 pairs). The performance of the cell was measured with a multi tester equipment and a LED bulb (5-watt 3Volt). The Results shown that the generator cell can produce the electric power of 3.679 Volt maximally by using NaCl 9% and 8 electrode pairs applied for this condition.

  17. Experimental Investigation of Pool Boiling for Single and Double Heaters Using Printed Circuit Board

    International Nuclear Information System (INIS)

    Han, Won Seok; Lee, Jae Young

    2012-01-01

    Over the past several decades, a considerable number of studies have been conducted on boiling heat transfer in pool boiling. Boiling heat transfer is used in a variety of cooling applications, such as heat exchangers, high powered electronics, and nuclear reactors. Nucleate boiling is one of the most efficient heat transfer mechanisms in boiling regime, but it is imperative that the critical heat flux(CHF) should not be exceeded. CHF phenomenon leads to a dramatic rise in wall temperature, decreased heat transfer, and material failure. Although numerous attempts have been made by researchers to demonstrate the CHF, there is little agreement with the CHF mechanism. In recent years, many researchers have been focusing on surface condition using nanoparticles and surface enhancements, such as a micro structure and artificial cavities, due to enhancement of the CHF point. Cooke and Kandlikar used chips etched with microchannels to prove that these structure has the most enhancement effect. They found that the most efficient boiling surface is with a larger channel size and deep etch. The purpose of this paper is to evaluate the heat transfer and CHF of double heaters on printed circuit board(PCB) in pool boiling. In addition, bubble dynamics of nucleate boiling were observed with high speed observation on single and double heaters using PCB heater

  18. Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment

    International Nuclear Information System (INIS)

    Zou, Shiwen; Li, Xiaogang; Dong, Chaofang; Ding, Kangkang; Xiao, Kui

    2013-01-01

    Highlights: •The electrochemical migration, whisker formation, and corrosion behavior of PCB under wet H 2 S environment were observed and studied systematically. •The process of electrochemical migration of solder joints is explained. •The corrosion mechanism of PCB interconnectors induced by micro pores under wet H 2 S environment is discussed, and the corrosion reaction model is proposed. -- Abstract: Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board (PCB) under wet H 2 S environment were analyzed by environment scanning electron microscope (ESEM), Energy dispersive X-ray spectroscopy (EDS) with mapping and element phase cluster (EPC) techniques, Raman Spectrum analysis and electrochemical impedance spectroscopy (EIS) technology. The results showed that nonuniform corrosion behavior occurred on PCB surfaces under 1 ppm wet H 2 S at 40 °C; whiskers formed on the inner sidewall of via-holes with a growth rate of 1.2 Å/s; numerous corrosion products migrated through the pore of plated gold layer, which broke off the protective layer. The corrosion rate was accelerated according to the big-cathode-small-anode model

  19. Feature-Learning-Based Printed Circuit Board Inspection via Speeded-Up Robust Features and Random Forest

    Directory of Open Access Journals (Sweden)

    Eun Hye Yuk

    2018-06-01

    Full Text Available With the coming of the 4th industrial revolution era, manufacturers produce high-tech products. As the production process is refined, inspection technologies become more important. Specifically, the inspection of a printed circuit board (PCB, which is an indispensable part of electronic products, is an essential step to improve the quality of the process and yield. Image processing techniques are utilized for inspection, but there are limitations because the backgrounds of images are different and the kinds of defects increase. In order to overcome these limitations, methods based on machine learning have been used recently. These methods can inspect without a normal image by learning fault patterns. Therefore, this paper proposes a method can detect various types of defects using machine learning. The proposed method first extracts features through speeded-up robust features (SURF, then learns the fault pattern and calculates probabilities. After that, we generate a weighted kernel density estimation (WKDE map weighted by the probabilities to consider the density of the features. Because the probability of the WKDE map can detect an area where the defects are concentrated, it improves the performance of the inspection. To verify the proposed method, we apply the method to PCB images and confirm the performance of the method.

  20. Electrical Differentiation of Mesenchymal Stem Cells into Schwann-Cell-Like Phenotypes Using Inkjet-Printed Graphene Circuits.

    Science.gov (United States)

    Das, Suprem R; Uz, Metin; Ding, Shaowei; Lentner, Matthew T; Hondred, John A; Cargill, Allison A; Sakaguchi, Donald S; Mallapragada, Surya; Claussen, Jonathan C

    2017-04-01

    Graphene-based materials (GBMs) have displayed tremendous promise for use as neurointerfacial substrates as they enable favorable adhesion, growth, proliferation, spreading, and migration of immobilized cells. This study reports the first case of the differentiation of mesenchymal stem cells (MSCs) into Schwann cell (SC)-like phenotypes through the application of electrical stimuli from a graphene-based electrode. Electrical differentiation of MSCs into SC-like phenotypes is carried out on a flexible, inkjet-printed graphene interdigitated electrode (IDE) circuit that is made highly conductive (sheet resistance electrically stimulated/treated (etMSCs) display significant enhanced cellular differentiation and paracrine activity above conventional chemical treatment strategies [≈85% of the etMSCs differentiated into SC-like phenotypes with ≈80 ng mL -1 of nerve growth factor (NGF) secretion vs. 75% and ≈55 ng mL -1 for chemically treated MSCs (ctMSCs)]. These results help pave the way for in vivo peripheral nerve regeneration where the flexible graphene electrodes could conform to the injury site and provide intimate electrical simulation for nerve cell regrowth. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  1. AQUEOUS CLEANING OF PRINTED CIRCUIT BOARD STENCILS

    Science.gov (United States)

    The USEPA through NRMRL has partnered with the California Dept. of Toxic Substance Control under an ETV Pilot Project to verigy polllution prevention, recycling and waste treatment technologies. One of the projects selected for verification was the ultrasonic aqueous cleaning tec...

  2. Electrical and Physical Property Characterization of Single Walled Carbon Nanotube Ink for Flexible Printed Electronics

    Science.gov (United States)

    2015-03-01

    accurately can the 2 ink be printed? How well does the ink adhere to its substrate? How does the substrate affect the adhesion properties? In what...physical characteristics, some of which may be incompatible with inkjet printing, or the Dimatix DMP 2800 specifically. 3.2.1.2 Ink Solvent...The tape test is conducted by applying a flexible adhesive -backed polymer to the fully-dried printed circuit. The tape is then removed and analyzed

  3. REDUCING WASTE DENGAN MENGGUNAKAN PENDEKATAN LEAN MANUFACTURING

    Directory of Open Access Journals (Sweden)

    Akhmad Jakfar

    2015-04-01

    Full Text Available PT. XYZ is one of some cigarette companies in Indonesia. In producing cigarette, the firm requires a material named “etiket” which is produced by printing division for internal consumers of PT. XYZ. merupakan salah satu dari beberapa produsen rokok di Indonesia yang telah dikenal masyarakat. In order to produce “etiket”, there are some wastes occurred. One of wastes occurred in printing division is product defects. This paper attempts to identify wastes in the division of printing using Lean Manufacturing approach by applying Value Stream Mapping (VSM method. The results from Cause Root analysis found that the problems caused the defects in production process. It shows that the most wastes occurs in the printing division are product defect and waiting time. The product defects are caused because there is no standard applied in processing the product and poor inspections by management, while the causes of waiting time wastes is because of lack of carrier and no standard in each process. The recommendation can be suggested to the company are adding some carrier (product’s transporter, creating process standard in each process.

  4. The Use of 3D Printing in the Development of Gaseous Radiation Detectors

    Directory of Open Access Journals (Sweden)

    Fargher Sam

    2018-01-01

    The 3D printed drift tube was printed using Polylactic acid to produce a gas volume in the shape of an inverted triangular prism; base length of 28 mm, height 24.25 mm and tube length 145 mm. A stainless steel anode wire was placed in the centre of the tube, mid-print. P5 gas (95% Argon, 5% Methane was used as the drift gas and a circuit was built to capacitively decouple signals from the high voltage. The signal rate and average pulse height of cosmic ray muons were measured over a range of bias voltages to characterise and prove correct operation of the printed detector.

  5. Advanced engineering materials and thick film hybrid circuit technology

    International Nuclear Information System (INIS)

    Faisal, S.; Aslam, M.; Mehmood, K.

    2006-01-01

    The use of Thick Film hybrid Technology to manufacture electronic circuits and passive components continues to grow at rapid rate. Thick Film Technology can be viewed as a means of packaging active devices, spanning the gap between monolithic integrated circuit chips and printed circuit boards with attached active and passive components. An advancement in engineering materials has moved from a formulating art to a base of greater understanding of relationship of material chemistry to the details of electrical and mechanical performance. This amazing advancement in the field of engineering materials has brought us up to a magnificent standard that we are able to manufacture small size, low cost and sophisticated electronic circuits of Military, Satellite systems, Robotics, Medical and Telecommunications. (author)

  6. Integrating integrated circuit chips on paper substrates using inkjet printed electronics

    CSIR Research Space (South Africa)

    Bezuidenhout, Petrone H

    2016-11-01

    Full Text Available This paper investigates the integration of silicon and paper substrates using rapid prototyping inkjet printed electronics. Various Dimatix DMP-2831 material printer settings and adhesives are investigated. The aim is to robustly and effectively...

  7. Heavy metal contamination of surface soil in electronic waste dismantling area: site investigation and source-apportionment analysis.

    Science.gov (United States)

    Jinhui Li; Huabo Duan; Pixing Shi

    2011-07-01

    The dismantling and disposal of electronic waste (e-waste) in developing countries is causing increasing concern because of its impacts on the environment and risks to human health. Heavy-metal concentrations in the surface soils of Guiyu (Guangdong Province, China) were monitored to determine the status of heavy-metal contamination on e-waste dismantling area with a more than 20 years history. Two metalloids and nine metals were selected for investigation. This paper also attempts to compare the data among a variety of e-waste dismantling areas, after reviewing a number of heavy-metal contamination-related studies in such areas in China over the past decade. In addition, source apportionment of heavy metal in the surface soil of these areas has been analysed. Both the MSW open-burning sites probably contained invaluable e-waste and abandoned sites formerly involved in informal recycling activities are the new sources of soil-based environmental pollution in Guiyu. Although printed circuit board waste is thought to be the main source of heavy-metal emissions during e-waste processing, requirement is necessary to soundly manage the plastic separated from e-waste, which mostly contains heavy metals and other toxic substances.

  8. 3D inkjet printed disposable environmental monitoring wireless sensor node

    KAUST Repository

    Farooqui, Muhammad Fahad

    2017-10-24

    We propose a disposable, miniaturized, moveable, fully integrated 3D inkjet-printed wireless sensor node for large area environmental monitoring applications. As a proof of concept, we show the wireless sensing of temperature, humidity and H2S levels which are important for early warnings of two critical environmental conditions namely forest fires and industrial gas leaks. The temperature sensor has TCR of -0.018/°, the highest of any inkjet-printed sensor and the H2S sensor can detect as low as 3 ppm of gas. These sensors and an antenna have been realized on the walls of a 3D-printed cubic package which encloses the microelectronics developed on a 3D-printed circuit board. Hence, 3D printing and inkjet printing have been combined in order to realize a unique low-cost, fully integrated wireless sensor node. Field tests show that these sensor nodes can wirelessly communicate up to a distance of over 100m. Our proposed sensor node can be a part of internet of things with the aim of providing a better and safe living.

  9. An Investigation on the Extraction and Quantitation of a Hexavalent Chromium in Acrylonitrile Butadiene Styrene Copolymer (ABS) and Printed Circuit Board (PCB) by Ion Chromatography Coupled with Inductively Coupled Plasma Atomic Emission Spectrometry

    Energy Technology Data Exchange (ETDEWEB)

    Nam, Sang Ho; Kim, Yu Na [Mokpo National University, Muan (Korea, Republic of)

    2012-06-15

    A hexavalent chromium (Cr (VI)) is one of the hazardous substances regulated by the RoHS. The determination of Cr (VI) in various polymers and printed circuit board (PCB) has been very important. In this study, the three different analytical methods were investigated for the determination of a hexavalent chromium in Acrylonitrile Butadiene Styrene copolymer (ABS) and PCB. The results by three analytical methods were obtained and compared. An analytical method by UV-Visible spectrometer has been generally used for the determination of Cr (VI) in a sample, but a hexavalent chromium should complex with diphenylcarbazide for the detection in the method. The complexation did make an adverse effect on the quantitative analysis of Cr (VI) in ABS. The analytical method using diphenylcarbazide was also not applicable to printed circuit board (PCB) because PCB contained lots of irons. The irons interfered with the analysis of hexavalent chromium because those also could complex with diphenylcarbazide. In this study, hexavalent chromiums in PCB have been separated by ion chromatography (IC), then directly and selectively detected by inductively coupled plasma atomic emission spectrometry (ICP-AES). The quantity of Cr (VI) in PCB was 0.1 mg/kg

  10. Substrate optimization for integrated circuit antennas

    OpenAIRE

    Alexopoulos, N. G.; Katehi, P. B.; Rutledge, D. B.

    1982-01-01

    Imaging systems in microwaves, millimeter and submillimeter wave applications employ printed circuit antenna elements. The effect of substrate properties is analyzed in this paper by both reciprocity theorem as well as integral equation approach for infinitesimally short as well as finite length dipole and slot elements. Radiation efficiency and substrate surface wave guidance is studied for practical substrate materials as GaAs, Silicon, Quartz and Duroid.

  11. Challenges in Waste Electrical and Electronic Equipment Management: A Profitability Assessment in Three European Countries

    Directory of Open Access Journals (Sweden)

    Idiano D’Adamo

    2016-07-01

    Full Text Available Waste electrical and electronic equipment (WEEE is known as an important source of secondary raw materials. Since decades, its treatment allowed to recover great amounts of basic resources. However, the management of electronic components embedded in WEEE still presents many challenges. The purpose of the paper is to cope with some of these challenges through the definition of an economic model able to identify the presence of profitability within the recovery process of waste printed circuit boards (WPCBs. To this aim, a set of common economic indexes is used within the paper. Furthermore, a sensitivity analysis on a set of critical variables is conducted to evaluate their impact on the results. Finally, the combination of predicted WEEE volumes (collected during the 2015–2030 period in three European countries (Germany, Italy and the United Kingdom and related economic indexes quantify the potential advantage coming from the recovery of this kind of waste in the next future.

  12. Exposure assessment of workers in printed electronics workplace.

    Science.gov (United States)

    Lee, Ji Hyun; Sohn, Eun Kyung; Ahn, Jin Soo; Ahn, Kangho; Kim, Keun Soo; Lee, Jong Hwan; Lee, Taik Min; Yu, Il Je

    2013-07-01

    Printed electronics uses converging technologies, such as printing, fine mechanics, nanotechnology, electronics and other new technologies. Consequently, printed electronics raises additional health and safety concerns to those experienced in the traditional printing industry. This study investigated two printed electronics workplaces based on a walk-through survey and personal and area sampling. All the printed electronics operations were conducted in a cleanroom. No indication of exposure to excess silver nanoparticles or carbon nanotubes (CNTs) was found. While the organic solvents were lower than current occupational exposure limits, there was a lack of engineering controls, such as local exhaust ventilation, correct enclosure and duct connections. There was also an insufficient quantity of personal protective equipment, and some organic solvents not described in the safety data sheets (SDSs) were detected in the air samples. Plus, the cleaning work, a major emissions operation, was not conducted within a hood, and the cleaning waste was not properly disposed of. Therefore, the present exposure assessment results from two printed electronics workplaces suggest that the printed electronics industry needs to take note of the occupational safety and health risks and hazards already established by the traditional printing industry, along with new risks and hazards originating from converging technologies such as nanotechnology.

  13. Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates

    KAUST Repository

    Kim, Sangkil; Shamim, Atif; Georgiadis, Apostolos; Aubert, Herve; Tentzeris, Manos M.

    2016-01-01

    In this paper, a novel fully inkjet-printed via fabrication technology and various inkjet-printed substrate-integrated waveguide (SIW) structures on thick polymer substrates are presented. The electrical properties of polymethyl methacrylate (PMMA) are thoroughly studied up to 8 GHz utilizing the T-resonator method, and inkjet-printable silver nanoparticle ink on PMMA is characterized. A long via fabrication process up to 1 mm utilizing inkjet-printing technology is demonstrated, and its characteristics are presented for the first time. The inkjet-printed vias on 0.8-mm-thick substrate have a resistance of ∼ 0.2~ Ω . An equivalent circuit model of the inkjet-printed stepped vias is also discussed. An inkjet-printed microstrip-to-SIW interconnect and an SIW cavity resonator utilizing the proposed inkjet-printed via fabrication process are also presented. The design of the components and the fabrication steps are discussed, and the measured performances over the microwave frequency range of the prototypes are presented.

  14. Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates

    KAUST Repository

    Kim, Sangkil

    2016-02-11

    In this paper, a novel fully inkjet-printed via fabrication technology and various inkjet-printed substrate-integrated waveguide (SIW) structures on thick polymer substrates are presented. The electrical properties of polymethyl methacrylate (PMMA) are thoroughly studied up to 8 GHz utilizing the T-resonator method, and inkjet-printable silver nanoparticle ink on PMMA is characterized. A long via fabrication process up to 1 mm utilizing inkjet-printing technology is demonstrated, and its characteristics are presented for the first time. The inkjet-printed vias on 0.8-mm-thick substrate have a resistance of ∼ 0.2~ Ω . An equivalent circuit model of the inkjet-printed stepped vias is also discussed. An inkjet-printed microstrip-to-SIW interconnect and an SIW cavity resonator utilizing the proposed inkjet-printed via fabrication process are also presented. The design of the components and the fabrication steps are discussed, and the measured performances over the microwave frequency range of the prototypes are presented.

  15. Decal electronics for printed high performance cmos electronic systems

    KAUST Repository

    Hussain, Muhammad Mustafa

    2017-11-23

    High performance complementary metal oxide semiconductor (CMOS) electronics are critical for any full-fledged electronic system. However, state-of-the-art CMOS electronics are rigid and bulky making them unusable for flexible electronic applications. While there exist bulk material reduction methods to flex them, such thinned CMOS electronics are fragile and vulnerable to handling for high throughput manufacturing. Here, we show a fusion of a CMOS technology compatible fabrication process for flexible CMOS electronics, with inkjet and conductive cellulose based interconnects, followed by additive manufacturing (i.e. 3D printing based packaging) and finally roll-to-roll printing of packaged decal electronics (thin film transistors based circuit components and sensors) focusing on printed high performance flexible electronic systems. This work provides the most pragmatic route for packaged flexible electronic systems for wide ranging applications.

  16. Modeling a Printed Circuit Heat Exchanger with RELAP5-3D for the Next Generation Nuclear Plant

    International Nuclear Information System (INIS)

    2010-01-01

    The main purpose of this report is to design a printed circuit heat exchanger (PCHE) for the Next Generation Nuclear Plant and carry out Loss of Coolant Accident (LOCA) simulation using RELAP5-3D. Helium was chosen as the coolant in the primary and secondary sides of the heat exchanger. The design of PCHE is critical for the LOCA simulations. For purposes of simplicity, a straight channel configuration was assumed. A parallel intermediate heat exchanger configuration was assumed for the RELAP5 model design. The RELAP5 modeling also required the semicircular channels in the heat exchanger to be mapped to rectangular channels. The initial RELAP5 run outputs steady state conditions which were then compared to the heat exchanger performance theory to ensure accurate design is being simulated. An exponential loss of pressure transient was simulated. This LOCA describes a loss of coolant pressure in the primary side over a 20 second time period. The results for the simulation indicate that heat is initially transferred from the primary loop to the secondary loop, but after the loss of pressure occurs, heat transfers from the secondary loop to the primary loop.

  17. Closing the Loop: Key Role of Iron in Metal-Bearing Waste Recycling

    Directory of Open Access Journals (Sweden)

    Sedlakova-Kadukova J.

    2017-09-01

    Full Text Available The role of iron in metal-bearing waste bioleaching was studied. Four various types of waste (printed circuit boards (PCBs, Ni-Cd batteries, alkaline batteries and Li-ion batteries were treated by bioleaching using the acidophilic bacteria A. ferrooxidans and A. thiooxidans (separately or in mixture. Role of main leaching agents (Fe3+ ions or sulphuric acid was simulated in abiotic experiments. Results showed that oxidation abilities of Fe3+ ions were crucial for recovery of Cu and Zn from PCBs, with the efficiencies of 88% and 100%, respectively. To recover 68% of Ni from PCBs, and 55% and 100% of Ni and Cd, respectively, from Ni-Cd batteries both oxidation action and hydrolysis of Fe3+ were required. The importance of Fe2+ ions as a reducing agent was showed in bioleaching of Co from Li-ion batteries and Mn from alkaline batteries. The efficiency of the processes has increased by 70% and 40% in Co and Mn bioleaching, respectively, in the presence of Fe2+ ions. Based on the results we suggest the integrated biometallurgical model of metal-bearing waste recycling in the effort to develop zero-waste and less energy-dependent technologies.

  18. Inkjet printed Cu(In,Ga)S2 nanoparticles for low-cost solar cells

    KAUST Repository

    Barbe, Jeremy; Eid, Jessica; Ahlswede, Erik; Spiering, Stefanie; Powalla, Michael; Agrawal, Rakesh; Del Gobbo, Silvano

    2016-01-01

    Cu(In,Ga)Se2 (CIGSe) thin film solar cells were fabricated by direct inkjet printing of Cu(In,Ga)S2 (CIGS) nanoparticles followed by rapid thermal annealing under selenium vapor. Inkjet printing is a low-cost, low-waste, and flexible patterning

  19. Process and device for decontamination of the waste gas of the fuel circuit of a fusion reactor from tritium and/or deuterium in waste gas containing them in chemically bound form

    International Nuclear Information System (INIS)

    Penzhorn, R.D.; Glugla, M.

    1987-01-01

    The invention concerns a process and a device for the decontamination of the wate gases of the fuel circuit of a fusion reactor from tritum and/or deuterium in waste gas containing them in chemically bound form, in which the waste gas is taken over an oxidation catalyst and then over a hot metal bed, tritium and/or deuterium is released from its compounds, separated from the waste gas and is returned to the fuel circuit. The process is intended to prevent losses of tritum and/or deuterium by permeation and the high loading of the hot metal getter materials, as occurs in the previously known corresponding process, and to avoid the formation of nitrogen oxides. This is achieved by: a) The catalytic oxidation reaction being carried out at a temperature of 200 0 C to 300 0 C. b) The gas mixture then being brought into contact with a hot metal bed at 200 0 C to 300 0 C to remove the remaining O 2 and for the selective conversion of the proportion of water into the hydrogen isotope. c) The gas mixture being brought into contact with a diaphragm made of palladium or a palladium-silver alloy at 400 0 C to 450 0 C to decompose the ammonia, all the released hydrogen isotope being passed through the diaphragm, separated from the remaining waste gas flow and removed. (orig.) [de

  20. EDF operational experience of primary circuit filter usage. Analysis of results and strategy for optimizing filtration and reducing solid wastes

    International Nuclear Information System (INIS)

    Mascarenhas, Darren; Moleiro, Edgar; Bancelin, Estelle; Bretelle, Jean-Luc

    2014-01-01

    Pleated fibreglass media filter cartridges are used throughout the auxiliary systems at nuclear power plants across the 58 reactors of EDF fleet. The main role of these filters is to remove suspended solids from coolant to prevent them accumulating in circuits or in equipments. In the primary circuit, these filters therefore limit the deposition of solids that are active or could become active if allowed to recirculate throughout the primary circuit, avoiding potential consequences such as an increase in dose rates, axial offset anomalies, demineralisers fouling, higher pressure losses in primary loop, and clogging of the primary pumps. Since 2008, a steady increase in the consumption of filters has been noticed, and therefore an increase in the amount of solid waste to treat. Preliminary studies have identified the primary circuit high-flow filters of the 1300/1450 MWe reactors as the main source of this increase. Not only has this stretched of solid waste containers production to the limit, as well as strained site resources and increased risks of operational errors during periods of frequent filter changes; it has also suggested that there is an underlying problem that could pose a serious risk to the primary circuit if untreated. Further studies have been carried out to identify more precisely the impact of possible causes, including increased quality surveillance of the filters, correlation of consumption data with the concentrations of various conditioning products and typical pollutants, and an impact analysis of events such as steam generator replacements or new practices like zinc injection. Work has been done with the filter manufacturer to improve their service lifetime and a simulation tool has been developed in order to understand and optimise filtration. We are also working with sites on creating good practices and avoiding bad ones. These actions should reduce the consumption in the short term while still assuring a high quality of filtration and

  1. REAL TIME QUALITY CONTROL OF THE HEATSET OFFSET PRINTING PROCESS

    Directory of Open Access Journals (Sweden)

    Răzvan-George RĂCHERU

    2016-05-01

    Full Text Available Offset lithography is one of the most common ways of creating printed materials. Compared to other printing methods, offset printing is best suited for economically producing large volumes of high quality prints in a manner that requires little maintenance. Because of the high speed and the high volume of the printing press, we have to rely on automation for press control and not just to the printer’s eye. When printing an image that has more than one color, it is necessary to print each color separately and ensure each color overlaps the others precisely. If this is not done, the finished image will look fuzzy, blurred or "out of register". To help line the colors up correctly, a system of registration is necessary. Therefore, the use of an automated real time quality control system will result in a more consistent color for the customer and less waste for the printer.

  2. Measuring the layer-average volumetric water content in the uppermost 5 cm of soil using printed circuit board TDR probes

    International Nuclear Information System (INIS)

    Wang, W.; Kobayashi, T.; Chikushi, J.

    2000-01-01

    Newly designed printed circuit board TDR probes (PCBPs) were made, and they were calibrated by indoor experiment. A regression equation for estimating the volumetric water content from the dielectric constant measured with the PCBP was determined, which is almost the same as the well-known Topp's equation when the soil is rather wet while the difference becomes larger as the soil dries. The PCBP was designed to measure the average water content over a soil layer 5 cm thick because the thickness of soil layer involved in measuring water content by microwave remote sensing is several centimeters. A comparison experiment of measurements with PCBPs and those by microwave remote sensing was conducted in an arid area in the northwest of China. The results of this experiment show that the newly designed TDR probe is promising as the sensor to get ground truth of the surface wetness. This paper describes only the calibration of probes and the observations taken using them

  3. Evaluation of a recycling process for printed circuit board by physical separation and heat treatment

    International Nuclear Information System (INIS)

    Fujita, Toyohisa; Ono, Hiroyuki; Dodbiba, Gjergj; Yamaguchi, Kunihiko

    2014-01-01

    Highlights: • The parts mounted on printed circuit board (PCB) were liberated by underwater explosion and mechanical crushing. • The crushed PCB without surface-mounted parts was carbonized under inert atmosphere at 873 K to recover copper. • The multi-layered ceramic capacitors including nickel was carbonized at 873 K to recover nickel by the magnetic separation. • The tantalum powders were recovered from the molded resins by heat treatment at 723 and 823 K in air atmosphere and screening. • Energy and treatment cost of new process increased, however, the environmental burden decreased comparing conventional one. - Abstract: Printed circuit boards (PCBs) from discarded personal computer (PC) and hard disk drive were crushed by explosion in water or mechanical comminution in order to disintegrate the attached parts. More parts were stripped from PCB of PC, composed of epoxy resin; than from PCB of household appliance, composed of phenol resin. In an attempt to raise the copper grade of PCB by removing other components, a carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under a nitrogen atmosphere at 873–1073 K. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The copper foil was liberated easily from glass fiber by stamping treatment. As one of the mounted parts, the multi-layered ceramic capacitors (MLCCs), which contain nickel, were carbonized at 873 K. The magnetic separation is carried out at a lower magnetic field strength of 0.1 T and then at 0.8 T. In the +0.5 mm size fraction the nickel grade in magnetic product was increased from 0.16% to 6.7% and the nickel recovery is 74%. The other useful mounted parts are tantalum capacitors. The tantalum capacitors were collected from mounted parts. The tantalum-sintered bodies were separated from molded resins

  4. Chemical Characterisation of Printed Circuit Board Wastewater

    Energy Technology Data Exchange (ETDEWEB)

    Sobri, S; Ali, A H M, E-mail: eeza@eng.upm.edu.my [Department of Chemical and Environmental Engineering, Faculty of Engineering, Universiti Putra Malaysia, 43400 Serdang, Selangor (Malaysia)

    2011-02-15

    Manufacturing of PCBs is highly complicated and involves many processes. Recycling of PCB wastewater receives wide concerns as the recent international growth in the electronics industry has generated a drastic increase in the amount of waste PCBs with profound environmental impacts such as soil and groundwater contamination. This paper reports on the chemical characterization of PCB wastewater as the initial investigation for selective metal recovery.

  5. Thiosulfate leaching of gold from waste mobile phones.

    Science.gov (United States)

    Ha, Vinh Hung; Lee, Jae-chun; Jeong, Jinki; Hai, Huynh Trung; Jha, Manis K

    2010-06-15

    The present communication deals with the leaching of gold from the printed circuit boards (PCBs) of waste mobile phones using an effective and less hazardous system, i.e., a copper-ammonia-thiosulfate solution, as an alternative to the conventional and toxic cyanide leaching of gold. The influence of thiosulfate, ammonia and copper sulfate concentrations on the leaching of gold from PCBs of waste mobile phones was investigated. Gold extraction was found to be enhanced with solutions containing 15-20 mM cupric, 0.1-0.14 M thiosulfate, and 0.2-0.3 M ammonia. Similar trends were obtained for the leaching of gold from two different types of scraps and PCBs of waste mobile phones. From the scrap samples, 98% of the gold was leached out using a solution containing 20 mM copper, 0.12 M thiosulfate and 0.2 M ammonia. Similarly, the leaching of gold from the PCBs samples was also found to be good, but it was lower than that of scrap samples in similar experimental conditions. In this case, only 90% of the gold was leached, even with a contact time of 10h. The obtained data will be useful for the development of processes for the recycling of gold from waste mobile phones. Copyright 2010 Elsevier B.V. All rights reserved.

  6. The performance of silicon solar cells prepared by screen-printing technique

    International Nuclear Information System (INIS)

    Mursyidah; Mohamed Yahaya; Muhammad Mohd Salleh

    2000-01-01

    Screen-printing technique is known to produce low cost solar cells. A study has been done to prepare silicon solar cells of n + -p and n + -p-p + structures. The p-type silicon wafers were used as substrates. The phosphorous layer was deposited on top of the substrate using the screen-printing technique. The wafer was then annealed at temperature 1000 degree C for 10 minutes, so that phosphorous atoms are thermally diffused into the wafer to form an n + -p junction. Meanwhile the boron film was deposited at the back surface of the substrate and annealed at temperature 900 degree C for 10 minutes to form a p + layer in the n + -p-p + device. The back and front metal contacts were made using screen-printing technique. The performance of the devices was evaluated from I-V curves measured in the dark and under illumination. It was found that the n + -p-p + device with short circuit current, I SC = 32 mA, open circuit voltage, V OC = 0.46 volt, fill factor, FF=0.63 and efficiency, η = 2.3%, was better than that of the n + -p device. The performance of the n + -p-p + device was successfully improved by depositing titanium dioxide on top of the device as anti-reflection coating using the screen-printing technique. The improved performance was I SC = 38 mA, V OC = 0.48 volt, FF = 0.67 and η = 3. 1%. (Author)

  7. Engineering Greener Processes--Laser Cutter Transforms Printing Waste

    Science.gov (United States)

    Xu, Renmei; Flowers, Jim

    2011-01-01

    Many of today's students have embraced an environmental ethic and are motivated by efforts to reduce waste or to remanufacture waste into viable products. In-class efforts to reuse and remanufacture waste can be especially motivating. They can also help students develop a better understanding of life-cycle analysis, waste-stream management,…

  8. Morphology, composition, and mixing state of primary particles from combustion sources - crop residue, wood, and solid waste.

    Science.gov (United States)

    Liu, Lei; Kong, Shaofei; Zhang, Yinxiao; Wang, Yuanyuan; Xu, Liang; Yan, Qin; Lingaswamy, A P; Shi, Zongbo; Lv, Senlin; Niu, Hongya; Shao, Longyi; Hu, Min; Zhang, Daizhou; Chen, Jianmin; Zhang, Xiaoye; Li, Weijun

    2017-07-11

    Morphology, composition, and mixing state of individual particles emitted from crop residue, wood, and solid waste combustion in a residential stove were analyzed using transmission electron microscopy (TEM). Our study showed that particles from crop residue and apple wood combustion were mainly organic matter (OM) in smoldering phase, whereas soot-OM internally mixed with K in flaming phase. Wild grass combustion in flaming phase released some Cl-rich-OM/soot particles and cardboard combustion released OM and S-rich particles. Interestingly, particles from hardwood (pear wood and bamboo) and softwood (cypress and pine wood) combustion were mainly soot and OM in the flaming phase, respectively. The combustion of foam boxes, rubber tires, and plastic bottles/bags in the flaming phase released large amounts of soot internally mixed with a small amount of OM, whereas the combustion of printed circuit boards and copper-core cables emitted large amounts of OM with Br-rich inclusions. In addition, the printed circuit board combustion released toxic metals containing Pb, Zn, Sn, and Sb. The results are important to document properties of primary particles from combustion sources, which can be used to trace the sources of ambient particles and to know their potential impacts in human health and radiative forcing in the air.

  9. Ink for Ink-Jet Printing of Electrically Conductive Structures on Flexible Substrates with Low Thermal Resistance

    Science.gov (United States)

    Mościcki, A.; Smolarek-Nowak, A.; Felba, J.; Kinart, A.

    2017-07-01

    The development of new technologies in electronics related to flexible polymeric substrates forces the industry to introduce suitable tools (special type of dispensers) and modern conductive materials for printing electronic circuits. Moreover, due to the wide use of inexpensive polymeric foils (polyethene, PE, or poly(ethylene terephthalate), PET), there is a need to develop materials with the lowest possible processing temperatures. The present paper presents the selection criteria of suitable components and their preparation for obtaining electrically conductive ink with a special nanosilver base. In the case of the discussed solution, all components allow to make circuits in relatively low sintering temperature (even below 130°C). Additionally, the authors show the most significant ink parameters that should be taken into consideration during Research and Development (R&D) works with electrically conductive inks. Moreover, ink stability parameters are discussed and some examples of printed circuits are presented.

  10. Digital power and performance analysis of inkjet printed ring oscillators based on electrolyte-gated oxide electronics

    Science.gov (United States)

    Cadilha Marques, Gabriel; Garlapati, Suresh Kumar; Dehm, Simone; Dasgupta, Subho; Hahn, Horst; Tahoori, Mehdi; Aghassi-Hagmann, Jasmin

    2017-09-01

    Printed electronic components offer certain technological advantages over their silicon based counterparts, like mechanical flexibility, low process temperatures, maskless and additive manufacturing possibilities. However, to be compatible to the fields of smart sensors, Internet of Things, and wearables, it is essential that devices operate at small supply voltages. In printed electronics, mostly silicon dioxide or organic dielectrics with low dielectric constants have been used as gate isolators, which in turn have resulted in high power transistors operable only at tens of volts. Here, we present inkjet printed circuits which are able to operate at supply voltages as low as ≤2 V. Our transistor technology is based on lithographically patterned drive electrodes, the dimensions of which are carefully kept well within the printing resolutions; the oxide semiconductor, the electrolytic insulator and the top-gate electrodes have been inkjet printed. Our inverters show a gain of ˜4 and 2.3 ms propagation delay time at 1 V supply voltage. Subsequently built 3-stage ring oscillators start to oscillate at a supply voltage of only 0.6 V with a frequency of ˜255 Hz and can reach frequencies up to ˜350 Hz at 2 V supply voltage. Furthermore, we have introduced a systematic methodology for characterizing ring oscillators in the printed electronics domain, which has been largely missing. Benefiting from this procedure, we are now able to predict the switching capacitance and driver capability at each stage, as well as the power consumption of our inkjet printed ring oscillators. These achievements will be essential for analyzing the performance and power characteristics of future inkjet printed digital circuits.

  11. Efficient Design of Flexible and Low Cost Paper-Based Inkjet-Printed Antenna

    Directory of Open Access Journals (Sweden)

    A. M. Mansour

    2015-01-01

    Full Text Available A new, efficient, flexible, and cheap antenna designed at 1.57 GHz microstrip patch antenna based on simple inkjet printer with improved performance using silver nanoparticles ink is developed. The antenna is printed on a kind of flexible substrate “glossy paper,” to offer the advantage of light and flexibility for different applications. The performance of silver nanoparticles ink has been studied through inkjet printing versus postsynthesis annealing and multilayer printing. The conductivity has been improved to have promising values up to 2 Ω/cm at temperatures up to 180°C. The surface morphology of the circuits has been analyzed using SEM with mean diameter of the nanoparticles around 100 nm, uniform surface distribution, and mean thickness of the printed layer around 230 microns. Also, a simple design of a coplanar waveguide (CPW monopole Z-shaped antenna has been considered as an application of fabricated printed antenna using the studied silver nanoparticles ink through a cheap printer.

  12. Application of Life Cycle Assessment on Electronic Waste Management: A Review

    Science.gov (United States)

    Xue, Mianqiang; Xu, Zhenming

    2017-04-01

    Electronic waste is a rich source of both valuable materials and toxic substances. Management of electronic waste is one of the biggest challenges of current worldwide concern. As an effective and prevailing environmental management tool, life cycle assessment can evaluate the environmental performance of electronic waste management activities. Quite a few scientific literatures reporting life cycle assessment of electronic waste management with significant outcomes have been recently published. This paper reviewed the trends, characteristics, research gaps, and challenges of these studies providing detailed information for practitioners involved in electronic waste management. The results showed that life cycle assessment studies were most carried out in Europe, followed by Asia and North America. The research subject of the studies mainly includes monitors, waste printed circuit boards, mobile phones, computers, printers, batteries, toys, dishwashers, and light-emitting diodes. CML was the most widely used life cycle impact assessment method in life cycle assessment studies on electronic waste management, followed by EI99. Furthermore, 40% of the reviewed studies combined with other environmental tools, including life cycle cost, material flow analysis, multi-criteria decision analysis, emergy analysis, and hazard assessment which came to more comprehensive conclusions from different aspects. The research gaps and challenges including uneven distribution of life cycle assessment studies, life cycle impact assessment methods selection, comparison of the results, and uncertainty of the life cycle assessment studies were examined. Although life cycle assessment of electronic waste management facing challenges, their results will play more and more important role in electronic waste management practices.

  13. Water Activated Graphene Oxide Transfer Using Wax Printed Membranes for Fast Patterning of a Touch Sensitive Device.

    Science.gov (United States)

    Baptista-Pires, Luis; Mayorga-Martínez, Carmen C; Medina-Sánchez, Mariana; Montón, Helena; Merkoçi, Arben

    2016-01-26

    We demonstrate a graphene oxide printing technology using wax printed membranes for the fast patterning and water activation transfer using pressure based mechanisms. The wax printed membranes have 50 μm resolution, longtime stability and infinite shaping capability. The use of these membranes complemented with the vacuum filtration of graphene oxide provides the control over the thickness. Our demonstration provides a solvent free methodology for printing graphene oxide devices in all shapes and all substrates using the roll-to-roll automatized mechanism present in the wax printing machine. Graphene oxide was transferred over a wide variety of substrates as textile or PET in between others. Finally, we developed a touch switch sensing device integrated in a LED electronic circuit.

  14. Three-Dimensional Printing with Biomass-Derived PEF for Carbon-Neutral Manufacturing.

    Science.gov (United States)

    Kucherov, Fedor A; Gordeev, Evgeny G; Kashin, Alexey S; Ananikov, Valentine P

    2017-12-11

    Biomass-derived poly(ethylene-2,5-furandicarboxylate) (PEF) has been used for fused deposition modeling (FDM) 3D printing. A complete cycle from cellulose to the printed object has been performed. The printed PEF objects created in the present study show higher chemical resistance than objects printed with commonly available materials (acrylonitrile butadiene styrene (ABS), polylactic acid (PLA), glycol-modified poly(ethylene terephthalate) (PETG)). The studied PEF polymer has shown key advantages for 3D printing: optimal adhesion, thermoplasticity, lack of delamination and low heat shrinkage. The high thermal stability of PEF and relatively low temperature that is necessary for extrusion are optimal for recycling printed objects and minimizing waste. Several successive cycles of 3D printing and recycling were successfully shown. The suggested approach for extending additive manufacturing to carbon-neutral materials opens a new direction in the field of sustainable development. © 2017 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim.

  15. Packaging strategy for maximizing the performance of a screen printed piezoelectric energy harvester

    International Nuclear Information System (INIS)

    Zhang, Z; Zhu, D; Tudor, M J; Beeby, S P

    2013-01-01

    This paper reports the extended design and simulation of a screen printed piezoelectric energy harvester. The proposed design was based on a previous credit card sized smart tag sensor node, and packages the power conditioning circuit in the free space above the tungsten proof mass layer. This approach enables electronic components to be mounted onto the cantilever beam, which provides additional weight at the tip of the cantilever structure. The design structure contains a T-shape cantilever beam with size of 47 mm × 30 mm × 0.85 mm which is fabricated using screen printing. ANSYS simulation results predict the revised architecture can generate 421.9 μW approximately twice of the RMS power produced by the original design along with a higher open-circuit RMS Voltage of 8.0 V while the resonant frequency is dropped to 53.4 Hz

  16. Improved Manufacturing Performance of Screen Printed Carbon Electrodes through Material Formulation.

    Science.gov (United States)

    Jewell, Eifion; Philip, Bruce; Greenwood, Peter

    2016-06-27

    Printed carbon graphite materials are the primary common component in the majority of screen printed sensors. Screen printing allows a scalable manufacturing solution, accelerating the means by which novel sensing materials can make the transition from laboratory material to commercial product. A common bottleneck in any thick film printing process is the controlled drying of the carbon paste material. A study has been undertaken which examines the interaction between material solvent, printed film conductivity and process consistency. The study illustrates that it is possible to reduce the solvent boiling point to significantly increase process productivity while maintaining process consistency. The lower boiling point solvent also has a beneficial effect on the conductivity of the film, reducing the sheet resistance. It is proposed that this is a result of greater film stressing increasing charge percolation through greater inter particle contact. Simulations of material performance and drying illustrate that a multi layered printing provides a more time efficient manufacturing method. The findings have implications for the volume manufacturing of the carbon sensor electrodes but also have implications for other applications where conductive carbon is used, such as electrical circuits and photovoltaic devices.

  17. Experimental and CFD Analysis of Printed Circuit Heat Exchanger for Supercritical CO{sub 2} Power Cycle Application

    Energy Technology Data Exchange (ETDEWEB)

    Baik, Seungjoon; Kim, Hyeon Tae; Kim, Seong Gu; Lee, Jekyoung; Lee, Jeong Ik [KAIST, Daejeon (Korea, Republic of)

    2015-10-15

    The supercritical carbon dioxide (S-CO{sub 2}) power cycle has been suggested as an alternative for the SFR power generation system. First of all, relatively mild sodium-CO{sub 2} interaction can reduce the accident probability. Also the S-CO{sub 2} power conversion cycle can achieve high efficiency with SFR core thermal condition. Moreover, the S-CO{sub 2} power cycle can reduce cycle footprint due to high density of the working fluid. Recently, various compact heat exchangers have been studied for developing an optimal heat exchanger. In this paper, the printed circuit heat exchanger was selected for S-CO{sub 2} power cycle applications and was closely investigated experimentally and analytically. Recently, design and performance prediction of PCHE received attention due to its importance in high pressure power systems such as S-CO{sub 2} cycle. To evaluate a PCHE performance with CO{sub 2} to water, KAIST research team designed and tested a lab-scale PCHE. From the experimental data and CFD analysis, pressure drop and heat transfer correlations are obtained. For the CFD analysis, Ansys-CFX commercial code was utilized with RGP table implementation. In near future, the turbulence model sensitivity study will be followed.

  18. The influence of printed electronics on the recyclability of paper: a case study for smart envelopes in courier and postal services.

    Science.gov (United States)

    Aliaga, C; Zhang, H; Dobon, A; Hortal, M; Beneventi, D

    2015-04-01

    The aim of this paper is to analyse the effects of the presence of printed electronics on the paper waste streams and specifically on paper recyclability. The analysis is based on a case study focussed on envelopes for postal and courier services provided with these intelligent systems. The smart printed envelope of the study includes a combination of both conventional (thin flexible batteries and resistors) and printed electronic components (conductive track layout based on nanosilver ink). For this purpose, a comparison between envelopes with and without these components (batteries, resistors and conductive track layouts) was carried out through pilot scale paper recycling tests. The generation of rejects during the recycling process as well as the final quality of the recycled paper (mechanical and optical properties) were tested and quantitatively evaluated. The results show that resistors are retained during the screening process in the sieves and consequently they cannot end up in the final screened pulp. Therefore, mechanical and optical properties of the recycled paper are not affected. Nevertheless, inks from the conductive track layouts and batteries were partially dissolved in the process water. These substances were not totally retained in the sieving systems resulting in slight changes in the optical properties of the final recycled paper (variations are 7.2-7.5% in brightness, 8.5-10.7% in whiteness, 1.2-2.2% in L(∗) values, 3.3-3.5% in opacity and 16.1-27% in yellowness). These variations are not in ranges able to cause problems in current paper recycling processes and restrict the use of recycled paper in current applications. Moreover, real impacts on industrial recycling are expected to be even significantly lower since the proportion of paper product with printed circuits in the current paper waste streams are much lower than the ones tested in this work. However, it should be underlined the fact that this situation may change over the next

  19. 3D-Printed Disposable Wireless Sensors with Integrated Microelectronics for Large Area Environmental Monitoring

    KAUST Repository

    Farooqui, Muhammad Fahad

    2017-05-19

    Large area environmental monitoring can play a crucial role in dealing with crisis situations. However, it is challenging as implementing a fixed sensor network infrastructure over large remote area is economically unfeasible. This work proposes disposable, compact, dispersible 3D-printed wireless sensor nodes with integrated microelectronics which can be dispersed in the environment and work in conjunction with few fixed nodes for large area monitoring applications. As a proof of concept, the wireless sensing of temperature, humidity, and H2S levels are shown which are important for two critical environmental conditions namely forest fires and industrial leaks. These inkjet-printed sensors and an antenna are realized on the walls of a 3D-printed cubic package which encloses the microelectronics developed on a 3D-printed circuit board. Hence, 3D printing and inkjet printing are uniquely combined in order to realize a low-cost, fully integrated wireless sensor node.

  20. Low-Cost Manufacturing of Bioresorbable Conductors by Evaporation-Condensation-Mediated Laser Printing and Sintering of Zn Nanoparticles.

    Science.gov (United States)

    Shou, Wan; Mahajan, Bikram K; Ludwig, Brandon; Yu, Xiaowei; Staggs, Joshua; Huang, Xian; Pan, Heng

    2017-07-01

    Currently, bioresorbable electronic devices are predominantly fabricated by complex and expensive vacuum-based integrated circuit (IC) processes. Here, a low-cost manufacturing approach for bioresorbable conductors on bioresorbable polymer substrates by evaporation-condensation-mediated laser printing and sintering of Zn nanoparticle is reported. Laser sintering of Zn nanoparticles has been technically difficult due to the surface oxide on nanoparticles. To circumvent the surface oxide, a novel approach is discovered to print and sinter Zn nanoparticle facilitated by evaporation-condensation in confined domains. The printing process can be performed on low-temperature substrates in ambient environment allowing easy integration on a roll-to-roll platform for economical manufacturing of bioresorbable electronics. The fabricated Zn conductors show excellent electrical conductivity (≈1.124 × 10 6 S m -1 ), mechanical durability, and water dissolvability. Successful demonstration of strain gauges confirms the potential application in various environmentally friendly sensors and circuits. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  1. Printing Electronic Components from Copper-Infused Ink and Thermoplastic Mediums

    Science.gov (United States)

    Flowers, Patrick F.

    The demand for printable electronics has sharply increased in recent years and is projected to continue to rise. Unfortunately, electronic materials which are suitable for desired applications while being compatible with available printing techniques are still often lacking. This thesis addresses two such challenging areas. In the realm of two-dimensional ink-based printing of electronics, a major barrier to the realization of printable computers that can run programs is the lack of a solution-coatable non-volatile memory with performance metrics comparable to silicon-based devices. To address this deficiency, I developed a nonvolatile memory based on Cu-SiO2 core-shell nanowires that can be printed from solution and exhibits on-off ratios of 106, switching speeds of 50 ns, a low operating voltage of 2 V, and operates for at least 104 cycles without failure. Each of these metrics is similar to or better than Flash memory (the write speed is 20 times faster than Flash). Memory architectures based on the individual memory cells demonstrated here could enable the printing of the more complex, embedded computing devices that are expected to make up an internet of things. Recently, the exploration of three-dimensional printing techniques to fabricate electronic materials began. A suitable general-purpose conductive thermoplastic filament was not available, however. In this work I examine the current state of conductive thermoplastic filaments, including a newly-released highly conductive filament that my lab has produced which we call Electrifi. I focus on the use of dual-material fused filament fabrication (FFF) to 3D print electronic components (conductive traces, resistors, capacitors, inductors) and circuits (a fully-printed high-pass filter). The resistivity of traces printed from conductive thermoplastic filaments made with carbon-black, graphene, and copper as conductive fillers was found to be 12, 0.78, and 0.014 ohm cm, respectively, enabling the creation of

  2. The influence of printed electronics on the recyclability of paper: A case study for smart envelopes in courier and postal services

    Energy Technology Data Exchange (ETDEWEB)

    Aliaga, C., E-mail: caliaga@itene.com [Sustainability Division, Packaging, Transport and Logistics Research Centre, C/Albert Einstein 1, 46980 Paterna, Valencia (Spain); Zhang, H.; Dobon, A.; Hortal, M. [Sustainability Division, Packaging, Transport and Logistics Research Centre, C/Albert Einstein 1, 46980 Paterna, Valencia (Spain); Beneventi, D. [Laboratory of Pulp & Paper Science, Grenoble INP Pagora, 461, Rue de la Papeterie, F-38400 Saint-Martin d’Hères Cedex (France)

    2015-04-15

    able to cause problems in current paper recycling processes and restrict the use of recycled paper in current applications. Moreover, real impacts on industrial recycling are expected to be even significantly lower since the proportion of paper product with printed circuits in the current paper waste streams are much lower than the ones tested in this work. However, it should be underlined the fact that this situation may change over the next years due to the future developments in printed electronics and the gradual penetration of these types of devices in the market.

  3. The influence of printed electronics on the recyclability of paper: A case study for smart envelopes in courier and postal services

    International Nuclear Information System (INIS)

    Aliaga, C.; Zhang, H.; Dobon, A.; Hortal, M.; Beneventi, D.

    2015-01-01

    to cause problems in current paper recycling processes and restrict the use of recycled paper in current applications. Moreover, real impacts on industrial recycling are expected to be even significantly lower since the proportion of paper product with printed circuits in the current paper waste streams are much lower than the ones tested in this work. However, it should be underlined the fact that this situation may change over the next years due to the future developments in printed electronics and the gradual penetration of these types of devices in the market

  4. Performance Evaluation of a Printed Circuit Steam Generator for Integral Reactors: A Feasibility Test

    Energy Technology Data Exchange (ETDEWEB)

    Han, Hun Sik; Kang, Han-Ok; Yoon, Juhyeon; Kim, Young In; Kim, Keung Koo [KAERI, Daejeon (Korea, Republic of); Seo, Jang-won; Choi, Brain [Alfa Laval Korea Ltd., Daejeon (Korea, Republic of)

    2015-05-15

    SMART (System-integrated Modular Advanced ReacTor) is a small-sized integral type pressurized water reactor. It adopts advanced design features such as structural safety improvement, system simplification, and component modularization to achieve highly enhanced safety and improved economics. The design issues related to further safety enhancement and cost reduction have received significant attention to increase its competitiveness in the global small reactor market. For the cost reduction, it is important to design the reactor vessel as small as possible. Thus, it is necessary to reduce the volume of main components such as a steam generator. Its manufacturing processes of the chemical etching and diffusion bonding provide high effectiveness, high compactness, and inherent structural safety under high temperatures and high pressures. Thus, it is expected to be an alternative to the conventional shell and tube type steam generator in SMART. In this paper, simple thermal-hydraulic performance measurement of a small-scale printed circuit steam generator (PCSG) is conducted to investigate the feasibility of applying it to SMART. The simple thermal-hydraulic performance of the PCSG has been experimentally evaluated. A small-scale PCHE is employed to investigate the feasibility of operating it as a steam generator. The performance assessment reveals that the PCSG stably produces superheated steam, and the increased degree of superheat is obtained at lower water flow rate. However, the flow instability is increased with the decrease of the water flow rate. Thus, it is required to apply the orifice design into the cold side plate to suppress the density-wave oscillations. The pressure drops and heat transfer rates increase with the water flow rate.

  5. High-performance all-printed amorphous oxide FETs and logics with electronically compatible electrode/ channel interface.

    Science.gov (United States)

    Sharma, Bhupendra Kumar; Stoesser, Anna; Mondal, Sandeep Kumar; Garlapati, Suresh K; Fawey, Mohammed H; Chakravadhanula, Venkata Sai Kiran; Kruk, Robert; Hahn, Horst; Dasgupta, Subho

    2018-06-12

    Oxide semiconductors typically show superior device performance compared to amorphous silicon or organic counterparts, especially, when they are physical vapor deposited. However, it is not easy to reproduce identical device characteristics when the oxide field-effect transistors (FETs) are solution-processed/ printed; the level of complexity further intensifies with the need to print the passive elements as well. Here, we developed a protocol for designing the most electronically compatible electrode/ channel interface based on the judicious material selection. Exploiting this newly developed fabrication schemes, we are now able to demonstrate high-performance all-printed FETs and logic circuits using amorphous indium-gallium-zinc oxide (a-IGZO) semiconductor, indium tin oxide (ITO) as electrodes and composite solid polymer electrolyte as the gate insulator. Interestingly, all-printed FETs demonstrate an optimal electrical performance in terms of threshold voltages and device mobility and may very well be compared with devices fabricated using sputtered ITO electrodes. This observation originates from the selection of electrode/ channel materials from the same transparent semiconductor oxide family, resulting in the formation of In-Sn-Zn-O (ITZO) based diffused a-IGZO/ ITO interface that controls doping density while ensuring high electrical performance. Compressive spectroscopic studies reveal that Sn doping mediated excellent band alignment of IGZO with ITO electrodes is responsible for the excellent device performance observed. All-printed n-MOS based logic circuits have also been demonstrated towards new-generation portable electronics.

  6. Design of organic complementary circuits and systems on foil

    CERN Document Server

    Abdinia, Sahel; Cantatore, Eugenio

    2015-01-01

    This book describes new approaches to fabricate complementary organic electronics, and focuses on the design of circuits and practical systems created using these manufacturing approaches. The authors describe two state-of-the-art, complementary organic technologies, characteristics and modeling of their transistors and their capability to implement circuits and systems on foil. Readers will benefit from the valuable overview of the challenges and opportunities that these extremely innovative technologies provide. ·         Demonstrates first circuits implemented using specific complementary organic technologies, including first printed analog to digital converter, first dynamic logic on foil and largest complementary organic circuit ·         Includes step-by-step design from single transistor level to complete systems on foil ·         Provides a platform for comparing state-of-the-art complementary organic technologies and for comparing these with other similar technologies, spec...

  7. Structuring of conductive silver line by electrohydrodynamic jet printing and its electrical characterization

    International Nuclear Information System (INIS)

    Lee, Dae-Young; Lee, Jae-Chang; Shin, Yun-Soo; Park, Sung-Eun; Kim, Yong-Jun; Hwang, Jungho; Yu, Tae-U

    2008-01-01

    A set of silver lines with a few hundred nanometers in thickness and with a few hundred micrometers in width were obtained using the electrohydrodynamic jet printing. The lines exhibited about three times higher resistivity (4.8 μΩcm) than that of bulk silver after thermal sintering process. The characteristic impedance of the silver line was about 18 Ω while the value calculated was 20 Ω. This paper demonstrated the possibility of using electrohydrodynamic jet printing of silver nanoparticles to obtain conductive line onto circuit boards.

  8. Printability of papers recycled from toner and inkjet-printed papers after deinking and recycling processes.

    Science.gov (United States)

    Karademir, Arif; Aydemir, Cem; Tutak, Dogan; Aravamuthan, Raja

    2018-04-01

    In our contemporary world, while part of the fibers used in the paper industry is obtained from primary fibers such as wood and agricultural plants, the rest is obtained from secondary fibers from waste papers. To manufacture paper with high optical quality from fibers of recycled waste papers, these papers require deinking and bleaching of fibers at desired levels. High efficiency in removal of ink from paper mass during recycling, and hence deinkability, are especially crucial for the optical and printability quality of the ultimate manufactured paper. In the present study, deinkability and printability performance of digitally printed paper with toner or inkjet ink were compared for the postrecycling product. To that end, opaque 80 g/m 2 office paper was digitally printed under standard printing conditions with laser toner or inkjet ink; then these sheets of paper were deinked by a deinking process based on the INGEDE method 11 p. After the deinking operation, the optical properties of the obtained recycled handsheets were compared with unprinted (reference) paper. Then the recycled paper was printed on once again under the same conditions as before with inkjet and laser printers, to monitor and measure printing color change before and after recycling, and differences in color universe. Recycling and printing performances of water-based inkjet and toner-based laser printed paper were obtained. The outcomes for laser-printed recycled paper were better than those for inkjet-printed recycled paper. Compared for luminosity Y, brightness, CIE a* and CIE b* values, paper recycled from laser-printed paper exhibited higher value than paper recycled from inkjet-printed paper.

  9. Progress in 3D Printing of Carbon Materials for Energy-Related Applications.

    Science.gov (United States)

    Fu, Kun; Yao, Yonggang; Dai, Jiaqi; Hu, Liangbing

    2017-03-01

    The additive-manufacturing (AM) technique, known as three-dimensional (3D) printing, has attracted much attention in industry and academia in recent years. 3D printing has been developed for a variety of applications. Printable inks are the most important component for 3D printing, and are related to the materials, the printing method, and the structures of the final 3D-printed products. Carbon materials, due to their good chemical stability and versatile nanostructure, have been widely used in 3D printing for different applications. Good inks are mainly based on volatile solutions having carbon materials as fillers such as graphene oxide (GO), carbon nanotubes (CNT), carbon blacks, and solvent, as well as polymers and other additives. Studies of carbon materials in 3D printing, especially GO-based materials, have been extensively reported for energy-related applications. In these circumstances, understanding the very recent developments of 3D-printed carbon materials and their extended applications to address energy-related challenges and bring new concepts for material designs are becoming urgent and important. Here, recent developments in 3D printing of emerging devices for energy-related applications are reviewed, including energy-storage applications, electronic circuits, and thermal-energy applications at high temperature. To close, a conclusion and outlook are provided, pointing out future designs and developments of 3D-printing technology based on carbon materials for energy-related applications and beyond. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  10. Integrated electric circuit CAD system in Minolta Camera Co. Ltd

    Energy Technology Data Exchange (ETDEWEB)

    Nakagami, Tsuyoshi; Hirata, Sumiaki; Matsumura, Fumihiko

    1988-08-26

    Development background, fundamental concept, details and future plan of the integrated electric circuit CAD system for OA equipment are presented. The central integrated database is basically intended to store experiences or know-hows, to cover the wide range of data required for designs, and to provide a friendly interface. This easy-to-use integrated database covers the drawing data, parts information, design standards, know-hows and system data. The system contains the circuit design function to support drawing circuit diagrams, the wiring design function to support the wiring and arrangement of printed circuit boards and various parts integratedly, and the function to verify designs, to make full use of parts or technical information, to maintain the system security. In the future, as the system will be wholly in operation, the design period reduction, quality improvement and cost saving will be attained by this integrated design system. (19 figs, 2 tabs)

  11. Experimental and numerical study of a printed circuit heat exchanger

    International Nuclear Information System (INIS)

    Chen, Minghui; Sun, Xiaodong; Christensen, Richard N.; Shi, Shanbin; Skavdahl, Isaac; Utgikar, Vivek; Sabharwall, Piyush

    2016-01-01

    Highlights: • A dynamic model is developed for transient analysis of the straight-channel PCHE. • Transient scenarios of the straight-channel PCHE subject to helium temperature and mass flow rate variations are numerically investigated. • Steady-state temperature distribution inside the straight-channel PCHE is obtained in calculation. • Experiments are conducted to study the dynamic behavior of the straight-channel PCHE. - Abstract: Printed circuit heat exchangers (PCHEs) are promising to be employed in very-high-temperature gas-cooled reactors (VHTRs) due to their high robustness for high-temperature, high-pressure applications and high compactness. PCHEs typically serve as intermediate heat exchangers (IHXs) that isolate the secondary loop from the reactor’s primary system and hence must be sufficiently robust to maintain the system integrity during normal and off-normal conditions. In addition, the performance of the PCHE-type IHX could considerably affect the nuclear power plant overall operation since any transients on the secondary side would be propagated back to the reactor’s primary coolant system via the IHX. It is therefore imperative to understand how the PCHE would dynamically respond to a variety of transients. In the current study, experiments were first conducted to examine the steady-state thermal performance of a reduced-scale straight-channel PCHE. A dynamic model benchmarked in a previous study was then used to predict the steady-state and transient behavior of the PCHE. The steady-state temperature profiles of the working fluids on both the hot and cold sides and in the solid plates of the heat exchanger were obtained, which served as the initial condition for the transient simulations. The detailed dynamic response of the straight-channel PCHE, subject to inlet temperature variations, helium mass flow variations, and combinations of the two, was simulated and analyzed. In addition, two sets of transient tests, one for helium inlet

  12. BACTERIAL LEACHING OF ELECTRONIC SCRAP: INFLUENCE OF PROCESS PARAMETERS

    Directory of Open Access Journals (Sweden)

    Luciana Harue Yamane

    2013-03-01

    Full Text Available The application of bacterial leaching in the ore treatment is already known and also can be applied such as treatment of electronic waste to copper recovery. This paper investigates the influence of process parameters (pulp density, inoculums volume, rotation speed and initial concentration of ferrous iron on bacterial leaching of copper from printed circuit board of computers using the bacterium Acidithiobacillus ferrooxidans–LR. Printed circuit boards from computers were comminuted using a hammer mill. The powder obtained was magnetically separated and the non-magnetic material used in this study. A shake flask study was carried out on the non-magnetic material using a shaker. The results show that Acidithiobacillus ferrooxidans–LR can leach 99% of copper from printed circuit boards (non–magnetic material under the determined conditions through of the studies.

  13. Effects of smoke on functional circuits

    International Nuclear Information System (INIS)

    Tanaka, T.J.

    1997-10-01

    Nuclear power plants are converting to digital instrumentation and control systems; however, the effects of abnormal environments such as fire and smoke on such systems are not known. There are no standard tests for smoke, but previous smoke exposure tests at Sandia National Laboratories have shown that digital communications can be temporarily interrupted during a smoke exposure. Another concern is the long-term corrosion of metals exposed to the acidic gases produced by a cable fire. This report documents measurements of basic functional circuits during and up to 1 day after exposure to smoke created by burning cable insulation. Printed wiring boards were exposed to the smoke in an enclosed chamber for 1 hour. For high-resistance circuits, the smoke lowered the resistance of the surface of the board and caused the circuits to short during the exposure. These circuits recovered after the smoke was vented. For low-resistance circuits, the smoke caused their resistance to increase slightly. A polyurethane conformal coating substantially reduced the effects of smoke. A high-speed digital circuit was unaffected. A second experiment on different logic chip technologies showed that the critical shunt resistance that would cause failure was dependent on the chip technology and that the components used in the smoke exposures were some of the most smoke tolerant. The smoke densities in these tests were high enough to cause changes in high impedance (resistance) circuits during exposure, but did not affect most of the other circuits. Conformal coatings and the characteristics of chip technologies should be considered when designing circuitry for nuclear power plant safety systems, which must be highly reliable under a variety of operating and accident conditions. 10 refs., 34 figs., 18 tabs

  14. A screen-printed circular-type paper-based glucose/O2 biofuel cell

    Science.gov (United States)

    Shitanda, Isao; Nohara, Saki; Hoshi, Yoshinao; Itagaki, Masayuki; Tsujimura, Seiya

    2017-08-01

    The printable paper-based enzymatic biofuel cell (PBFC) to directly power small devices is an important objective for realizing cost-effective and disposable energy harvesting devices. In the present study, a screen-printed circular-type PBFC, composed of a series of 5 individual cells, was constructed. The PBFC exhibited the open circuit potential of 2.65 V and maximum power of 350 μW at 1.55 V, which were sufficient to illuminate an LED without requiring a booster circuit. The output voltage of this PBFC can also be easily adjusted as required.

  15. Structural assessment of intermediate printed circuit heat exchanger for sodium-cooled fast reactor with supercritical CO2 cycle

    International Nuclear Information System (INIS)

    Lee, Youho; Lee, Jeong Ik

    2014-01-01

    Highlights: • We numerically model PCHE stress arising from pressure, and thermal loadings. • Stress levels are the highest around S-CO 2 channels, due to high pressure of S-CO 2 . • The conventional analytic models for PCHE underestimate actual stress levels. • Plasticity sufficiently lowers stress levels at channel tips. • PCHE for SFR-SCO 2 is anticipated to assure compliance with ASME design standards. - Abstract: Structural integrity of intermediate Printed Circuit Heat Exchanger (PCHE) for Sodium-cooled Fast Reactor (SFR) attached to Supercritical CO 2 (S-CO 2 ) is investigated. ANSYS-Mechanical was used to simulate stress fields of representative PCHE channels, with temperature fields imported from FLUENT simulation. Mechanical stress induced by pressure loading is found to be the primary source of stress. As plasticity sufficiently lowers local stress concentration at PCHE channel tips, PCHE type intermediate heat exchangers made of SS316 are anticipated to reliably assure compliance with design standards prescribed in the ASME standards, thanks to the structure temperature that is below the effective creep inducing point. The actual life time of PCHE for SFR-SCO 2 is likely to be affected by mechanical behavior change of SS316 with reactions with S-CO 2 and fatigue

  16. Environmental impacts and benefits of state-of-the-art technologies for E-waste management.

    Science.gov (United States)

    Ikhlayel, Mahdi

    2017-10-01

    This study aims to evaluate the environmental impacts and benefits of state-of-the-art technologies for proper e-waste handling using Jordan as a case study. Life Cycle Assessment (LCA) was employed to evaluate five advanced management systems represent state-of-the-art treatment technologies, including sanitary landfilling; proper recycling of metals, materials, and precious metals (PMs); and incineration of plastic and the hazardous portion of printed circuit boards (PCBs). Six e-waste products that contribute the most to the e-waste in Jordan were included in the assessment of each scenario, which resulted in 30 total cases of e-waste management. The findings indicated that landfills for the entire components of the e-waste stream are the worst option and should be avoided. The most promising e-waste management scenario features integrated e-waste processes based on the concept of Integrated Waste Management (IWM), including recycling materials such as non-PMs and PMs, incinerating plastic and the hazardous content of PCBs using the energy recovered from incineration, and using sanitary landfills of residues. For this scenario, the best environmental performance was obtained for the treatment of mobile phones. Incineration of the portion of hazardous waste using energy recovery is an option that deserves attention. Because scenario implementation depends on more than just the environmental benefits (e.g., economic cost and technical aspects), the study proposes a systematic approach founded on the IWM concept for e-waste management scenario selection. Copyright © 2017 Elsevier Ltd. All rights reserved.

  17. 3D printed System-on-Package (SoP) for environmental sensing and localization applications

    KAUST Repository

    Zhen, Su

    2017-12-22

    This paper presents for the first time an innovative 3D printed SoP sensor node with temperature, pressure and humidity sensing capabilities. It has an integrated wireless readout through a near isotropic (900MHz) GSM antenna-on-package. This sensor node is connected to the internet for remote monitoring and has the capability of localization. The paper presents the design of antenna-on-package as well as details of the communication and localization system. Fabrication challenges unique to 3D printing and integration of electronics on 3D printed circuit board are also discussed. Finally, the paper presents measurement results of antenna radiation pattern, return loss, localization accuracy and accuracy of sensing parameters.

  18. Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process

    Science.gov (United States)

    Mallik, S.; Bauer, R.; Hübner, F.; Ekere, N. N.

    2011-01-01

    Solder paste is the most widely used interconnection material in the electronic assembly process for attaching electronic components/devices directly onto the surface of printed circuit boards, using stencil printing process. This paper evaluates the performance of three different commercially available Sn-Ag-Cu solder pastes formulated with different particle size distributions (PSD), metal content and alloy composition. A series of stencil printing tests were carried out using a specially designed stencil of 75 μm thickness and apertures of 300×300 μm2 dimension and 500 μm pitch sizes. Solder paste printing behaviors were found related to attributes such as slumping and surface tension and printing performance was correlated with metal content and PSD. The results of the study should benefit paste manufacturers and SMT assemblers to improve their products and practices.

  19. WASTE REDUCTION EVALUATION OF SOY-BASED INK AT A SHEET-FED OFFSET PRINTER

    Science.gov (United States)

    This Waste Reduction Innovative Technology Evaluation (WRITE) project quantifies and compares wastes generated from the use of soy-based and petroleum-based inks in sheet-fed offset printing. Data were collected in a full-scale print run on a Miller TP104 Plus 6-color press in Ju...

  20. Laser printed interconnects for flexible electronics

    Science.gov (United States)

    Pique, Alberto; Beniam, Iyoel; Mathews, Scott; Charipar, Nicholas

    Laser-induced forward transfer (LIFT) can be used to generate microscale 3D structures for interconnect applications non-lithographically. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or dispersed metallic nanoparticles. However, the resulting 3D structures do not achieve the bulk conductivity of metal interconnects of the same cross-section and length as those formed by wire bonding or tab welding. It is possible, however, to laser transfer entire structures using a LIFT technique known as lase-and-place. Lase-and-place allows whole components and parts to be transferred from a donor substrate onto a desired location with one single laser pulse. This talk will present the use of LIFT to laser print freestanding solid metal interconnects to connect individual devices into functional circuits. Furthermore, the same laser can bend or fold the thin metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief due to flexing or thermal mismatch. Examples of these laser printed 3D metallic bridges and their role in the development of next generation flexible electronics by additive manufacturing will be presented. This work was funded by the Office of Naval Research (ONR) through the Naval Research Laboratory Basic Research Program.

  1. Enhanced bioleaching efficiency of metals from E-wastes driven by biochar

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Shuhua; Zheng, Yue; Yan, Weifu; Chen, Lixiang [CAS Key Laboratory of Urban Pollutant Conversion, Institute of Urban Environment, Chinese Academy of Sciences, Xiamen, 361021 (China); University of Chinese Academy of Sciences, Beijing, 100049 (China); Dummi Mahadevan, Gurumurthy [CAS Key Laboratory of Urban Pollutant Conversion, Institute of Urban Environment, Chinese Academy of Sciences, Xiamen, 361021 (China); Zhao, Feng, E-mail: fzhao@iue.ac.cn [CAS Key Laboratory of Urban Pollutant Conversion, Institute of Urban Environment, Chinese Academy of Sciences, Xiamen, 361021 (China)

    2016-12-15

    Electronic wastes (E-wastes) contain a huge amount of valuable metals that are worth recovering. Bioleaching has attracted widespread attention as an environment-friendly and low-cost technology for the recycling of E-wastes. To avoid the disadvantages of being time-consuming or having a relatively low efficiency, biochar with redox activity was used to enhance bioleaching efficiency of metals from a basic E-waste (i.e., printed circuit boards in this study). The role of biochar was examined through three basic processes: Carbon-mediated, Sulfur-mediated and Iron-mediated bioleaching pathways. Although no obvious enhancement of bioleaching performance was observed in the C-mediated and S-mediated systems, Fe-mediated bioleaching was significantly promoted by the participation of biochar, and its leaching time was decreased by one-third compared with that of a biochar-free system. By mapping the dynamic concentration of Fe(II) and Cu(II), biochar was proved to facilitate the redox action between Fe(II) to Fe(III), which resulted in effective leaching of Cu. Two dominant functional species consisting of Alicyclobacillus spp. and Sulfobacillus spp. may cooperate in the Fe-mediated bioleaching system, and the ratio of these two species was regulated by biochar for enhancing the efficiency of bioleaching. Hence, this work provides a method to improve bioleaching efficiency with low-cost solid redox media.

  2. Enhanced bioleaching efficiency of metals from E-wastes driven by biochar

    International Nuclear Information System (INIS)

    Wang, Shuhua; Zheng, Yue; Yan, Weifu; Chen, Lixiang; Dummi Mahadevan, Gurumurthy; Zhao, Feng

    2016-01-01

    Electronic wastes (E-wastes) contain a huge amount of valuable metals that are worth recovering. Bioleaching has attracted widespread attention as an environment-friendly and low-cost technology for the recycling of E-wastes. To avoid the disadvantages of being time-consuming or having a relatively low efficiency, biochar with redox activity was used to enhance bioleaching efficiency of metals from a basic E-waste (i.e., printed circuit boards in this study). The role of biochar was examined through three basic processes: Carbon-mediated, Sulfur-mediated and Iron-mediated bioleaching pathways. Although no obvious enhancement of bioleaching performance was observed in the C-mediated and S-mediated systems, Fe-mediated bioleaching was significantly promoted by the participation of biochar, and its leaching time was decreased by one-third compared with that of a biochar-free system. By mapping the dynamic concentration of Fe(II) and Cu(II), biochar was proved to facilitate the redox action between Fe(II) to Fe(III), which resulted in effective leaching of Cu. Two dominant functional species consisting of Alicyclobacillus spp. and Sulfobacillus spp. may cooperate in the Fe-mediated bioleaching system, and the ratio of these two species was regulated by biochar for enhancing the efficiency of bioleaching. Hence, this work provides a method to improve bioleaching efficiency with low-cost solid redox media.

  3. Enhanced bioleaching efficiency of metals from E-wastes driven by biochar.

    Science.gov (United States)

    Wang, Shuhua; Zheng, Yue; Yan, Weifu; Chen, Lixiang; Dummi Mahadevan, Gurumurthy; Zhao, Feng

    2016-12-15

    Electronic wastes (E-wastes) contain a huge amount of valuable metals that are worth recovering. Bioleaching has attracted widespread attention as an environment-friendly and low-cost technology for the recycling of E-wastes. To avoid the disadvantages of being time-consuming or having a relatively low efficiency, biochar with redox activity was used to enhance bioleaching efficiency of metals from a basic E-waste (i.e., printed circuit boards in this study). The role of biochar was examined through three basic processes: Carbon-mediated, Sulfur-mediated and Iron-mediated bioleaching pathways. Although no obvious enhancement of bioleaching performance was observed in the C-mediated and S-mediated systems, Fe-mediated bioleaching was significantly promoted by the participation of biochar, and its leaching time was decreased by one-third compared with that of a biochar-free system. By mapping the dynamic concentration of Fe(II) and Cu(II), biochar was proved to facilitate the redox action between Fe(II) to Fe(III), which resulted in effective leaching of Cu. Two dominant functional species consisting of Alicyclobacillus spp. and Sulfobacillus spp. may cooperate in the Fe-mediated bioleaching system, and the ratio of these two species was regulated by biochar for enhancing the efficiency of bioleaching. Hence, this work provides a method to improve bioleaching efficiency with low-cost solid redox media. Copyright © 2016 Elsevier B.V. All rights reserved.

  4. Screen printing technology applied to silicon solar cell fabrication

    Science.gov (United States)

    Thornhill, J. W.; Sipperly, W. E.

    1980-01-01

    The process for producing space qualified solar cells in both the conventional and wraparound configuration using screen printing techniques was investigated. Process modifications were chosen that could be easily automated or mechanized. Work was accomplished to optimize the tradeoffs associated with gridline spacing, gridline definition and junction depth. An extensive search for possible front contact metallization was completed. The back surface field structures along with the screen printed back contacts were optimized to produce open circuit voltages of at least an average of 600 millivolts. After all intended modifications on the process sequence were accomplished, the cells were exhaustively tested. Electrical tests at AMO and 28 C were made before and after boiling water immersion, thermal shock, and storage under conditions of high temperature and high humidity.

  5. Experimental Verification of Guided-Wave Lumped Circuits Using Waveguide Metamaterials

    Science.gov (United States)

    Li, Yue; Zhang, Zhijun

    2018-04-01

    Through the construction and characterization in microwave frequencies, we experimentally demonstrate our recently developed theory of waveguide lumped circuits, i.e., waveguide metatronics [Sci. Adv. 2, e1501790 (2016), 10.1126/sciadv.1501790], as a method to design subwavelength-scaled analog circuits. In the paradigm of waveguide metatronics, numbers of lumped inductors and capacitors are easily integrated functionally inside the waveguide, which is an irreplaceable transmission line in millimeter-wave and terahertz systems with the advantages of low radiation loss and low crosstalk. An example of multiple-ordered metatronic filters with layered structures is fabricated utilizing the technique of substrate integrated waveguides, which can be easily constructed by the printed-circuit-board process. The materials used in the construction are also typical microwave materials with positive permittivity, low loss, and negligible dispersion, imitating the plasmonic materials with negative permittivity in the optical domain. The results verify the theory of waveguide metatronics, which provides an efficient platform of functional lumped circuit design for guided-wave processing.

  6. CMOS Imaging of Pin-Printed Xerogel-Based Luminescent Sensor Microarrays.

    Science.gov (United States)

    Yao, Lei; Yung, Ka Yi; Khan, Rifat; Chodavarapu, Vamsy P; Bright, Frank V

    2010-12-01

    We present the design and implementation of a luminescence-based miniaturized multisensor system using pin-printed xerogel materials which act as host media for chemical recognition elements. We developed a CMOS imager integrated circuit (IC) to image the luminescence response of the xerogel-based sensor array. The imager IC uses a 26 × 20 (520 elements) array of active pixel sensors and each active pixel includes a high-gain phototransistor to convert the detected optical signals into electrical currents. The imager includes a correlated double sampling circuit and pixel address/digital control circuit; the image data is read-out as coded serial signal. The sensor system uses a light-emitting diode (LED) to excite the target analyte responsive luminophores doped within discrete xerogel-based sensor elements. As a prototype, we developed a 4 × 4 (16 elements) array of oxygen (O 2 ) sensors. Each group of 4 sensor elements in the array (arranged in a row) is designed to provide a different and specific sensitivity to the target gaseous O 2 concentration. This property of multiple sensitivities is achieved by using a strategic mix of two oxygen sensitive luminophores ([Ru(dpp) 3 ] 2+ and ([Ru(bpy) 3 ] 2+ ) in each pin-printed xerogel sensor element. The CMOS imager consumes an average power of 8 mW operating at 1 kHz sampling frequency driven at 5 V. The developed prototype system demonstrates a low cost and miniaturized luminescence multisensor system.

  7. A flexible inkjet printed inverted-F antenna on textile

    KAUST Repository

    Karimi, Muhammad Akram; Shamim, Atif

    2016-01-01

    This is an era of wearable gadgets which demands flexible and wearer friendly wireless components. This paper presents a modified inverted-F antenna (IFA) which has seamlessly been integrated with the fabric through inkjet printing. Surface roughness of the textile has been reduced using a rapid UV curable flexible interface layer. Smooth interface layer helps achieving very fine features which may be required for complicated antenna and circuit traces.

  8. A flexible inkjet printed inverted-F antenna on textile

    KAUST Repository

    Karimi, Muhammad Akram

    2016-12-19

    This is an era of wearable gadgets which demands flexible and wearer friendly wireless components. This paper presents a modified inverted-F antenna (IFA) which has seamlessly been integrated with the fabric through inkjet printing. Surface roughness of the textile has been reduced using a rapid UV curable flexible interface layer. Smooth interface layer helps achieving very fine features which may be required for complicated antenna and circuit traces.

  9. Regeneration of cello-oligomers via selective depolymerization of cellulose fibers derived from printed paper wastes.

    Science.gov (United States)

    Voon, Lee Ken; Pang, Suh Cem; Chin, Suk Fun

    2016-05-20

    Cellulose extracted from printed paper wastes were selectively depolymerized under controlled conditions into cello-oligomers of controllable chain lengths via dissolution in an ionic liquid, 1-allyl-3-methylimidazolium chloride (AMIMCl), and in the presence of an acid catalyst, Amberlyst 15DRY. The depolymerization process was optimized against reaction temperature, concentration of acid catalyst, and reaction time. Despite rapid initial depolymerization process, the rate of cellulose depolymerization slowed down gradually upon prolonged reaction time, with 75.0 wt% yield of regenerated cello-oligomers (mean Viscosimetric Degree of Polymerization value of 81) obtained after 40 min. The depolymerization of cellulose fibers at 80 °C appeared to proceed via a second-order kinetic reaction with respect to the catalyst concentration of 0.23 mmol H3O(+). As such, the cellulose depolymerization process could afford some degree of control on the degree of polymerization or chain lengths of cello-oligomers formed. Copyright © 2016 Elsevier Ltd. All rights reserved.

  10. Investigation of the adhesion properties of direct 3D printing of polymers and nanocomposites on textiles: Effect of FDM printing process parameters

    Science.gov (United States)

    Hashemi Sanatgar, Razieh; Campagne, Christine; Nierstrasz, Vincent

    2017-05-01

    In this paper, 3D printing as a novel printing process was considered for deposition of polymers on synthetic fabrics to introduce more flexible, resource-efficient and cost effective textile functionalization processes than conventional printing process like screen and inkjet printing. The aim is to develop an integrated or tailored production process for smart and functional textiles which avoid unnecessary use of water, energy, chemicals and minimize the waste to improve ecological footprint and productivity. Adhesion of polymer and nanocomposite layers which were 3D printed directly onto the textile fabrics using fused deposition modeling (FDM) technique was investigated. Different variables which may affect the adhesion properties including 3D printing process parameters, fabric type and filler type incorporated in polymer were considered. A rectangular shape according to the peeling standard was designed as 3D computer-aided design (CAD) to find out the effect of the different variables. The polymers were printed in different series of experimental design: nylon on polyamide 66 (PA66) fabrics, polylactic acid (PLA) on PA66 fabric, PLA on PLA fabric, and finally nanosize carbon black/PLA (CB/PLA) and multi-wall carbon nanotubes/PLA (CNT/PLA) nanocomposites on PLA fabrics. The adhesion forces were quantified using the innovative sample preparing method combining with the peeling standard method. Results showed that different variables of 3D printing process like extruder temperature, platform temperature and printing speed can have significant effect on adhesion force of polymers to fabrics while direct 3D printing. A model was proposed specifically for deposition of a commercial 3D printer Nylon filament on PA66 fabrics. In the following, among the printed polymers, PLA and its composites had high adhesion force to PLA fabrics.

  11. INSULATION RESISTANCE OF PRINTED CIRCUIT BOARDS. BEHAVIOR OF CERTAIN TYPES AND MAKES UNDER DIFFERENT CLIMATIC CONDITIONS. En undersoegelse af en raekke typer og fabrikater under forskellige klimatiske forhold

    Energy Technology Data Exchange (ETDEWEB)

    Olesen, S. T.

    1971-11-15

    The present study embraces measurements of insulation resistance on a number of types and makes of printed-circuit boards. The insulation measurements were performed on boards just received from the manufacturer, as well as on boards exposed to humidity or to elevated temperatures. A total of 33 types from five different material categories were obtained. The test material used thus originated from a variety of independent sources. The purpose of the project was to investigate the frequency with which batches with insufficiently baked material - and consequently having a poor insulation resistance - were encountered in practice. No such batches were in fact found, and it is likely that they do not occur as often as had previously been assumed.

  12. A 24 GHz CMOS oscillator transmitter with an inkjet printed on-chip antenna

    KAUST Repository

    Ghaffar, Farhan A.

    2016-08-15

    CMOS based RF circuits have demonstrated efficient performance over the decades. However, one bottle neck with this technology is its lossy nature for passive components such as inductors, antennas etc. Due to this drawback, passives are either implemented off chip or the designers work with the inefficient passives. This problem can be alleviated by using inkjet printing as a post process on CMOS chip. In this work, we demonstrate inkjet printing of a patterned polymer (SU8) layer on a 24 GHz oscillator chip to isolate the lossy Si substrate from the passives which are inkjet printed on top of the SU8 layer. As a proof of concept, a monopole antenna is printed on top of the SU8 layer integrating it with the oscillator through the exposed RF pads to realize an oscillator transmitter. The proposed hybrid fabrication technique can be extended to multiple dielectric and conductive printed layers to demonstrate complete RF systems on CMOS chips which are efficient, cost-effective and above all small in size. © 2016 IEEE.

  13. The Use of 3D Printing in the Development of Gaseous Radiation Detectors

    Science.gov (United States)

    Fargher, Sam; Steer, Chris; Thompson, Lee

    2018-01-01

    Fused Deposition Modelling has been used to produce a small, single wire, Iarocci-style drift tube to demonstrate the feasibility of using the Additive Manufacturing technique to produce cheap detectors, quickly. Recent technological developments have extended the scope of Additive Manufacturing, or 3D printing, to the possibility of fabricating Gaseous Radiation Detectors, such as Single Wire Proportional Counters and Time Projection Chambers. 3D printing could allow for the production of customisable, modular detectors; that can be easily created and replaced and the possibility of printing detectors on-site in remote locations and even for outreach within schools. The 3D printed drift tube was printed using Polylactic acid to produce a gas volume in the shape of an inverted triangular prism; base length of 28 mm, height 24.25 mm and tube length 145 mm. A stainless steel anode wire was placed in the centre of the tube, mid-print. P5 gas (95% Argon, 5% Methane) was used as the drift gas and a circuit was built to capacitively decouple signals from the high voltage. The signal rate and average pulse height of cosmic ray muons were measured over a range of bias voltages to characterise and prove correct operation of the printed detector.

  14. Preparation of solid silver nanoparticles for inkjet printed flexible electronics with high conductivity.

    Science.gov (United States)

    Shen, Wenfeng; Zhang, Xianpeng; Huang, Qijin; Xu, Qingsong; Song, Weijie

    2014-01-01

    Silver nanoparticles (NPs) which could be kept in solid form and were easily stored without degeneration or oxidation at room temperature for a long period of time were synthesized by a simple and environmentally friendly wet chemistry method in an aqueous phase. Highly stable dispersions of aqueous silver NP inks, sintered at room temperature, for printing highly conductive tracks (∼8.0 μΩ cm) were prepared simply by dispersing the synthesized silver NP powder in water. These inks are stable, fairly homogeneous and suitable for a wide range of patterning techniques. The inks were successfully printed on paper and polyethylene terephthalate (PET) substrates using a common color printer. Upon annealing at 180 °C, the resistivity of the printed silver patterns decreased to 3.7 μΩ cm, which is close to twice that of bulk silver. Various factors affecting the resistivity of the printed silver patterns, such as annealing temperature and the number of printing cycles, were investigated. The resulting high conductivity of the printed silver patterns reached over 20% of the bulk silver value under ambient conditions, which enabled the fabrication of flexible electronic devices, as demonstrated by the inkjet printing of conductive circuits of LED devices.

  15. Wirelessly powered microfluidic dielectrophoresis devices using printable RF circuits.

    Science.gov (United States)

    Qiao, Wen; Cho, Gyoujin; Lo, Yu-Hwa

    2011-03-21

    We report the first microfluidic device integrated with a printed RF circuit so the device can be wirelessly powered by a commercially available RFID reader. For conventional dielectrophoresis devices, electrical wires are needed to connect the electric components on the microchip to external equipment such as power supplies, amplifiers, function generators, etc. Such a procedure is unfamiliar to most clinicians and pathologists who are used to working with a microscope for examination of samples on microscope slides. The wirelessly powered device reported here eliminates the entire need for wire attachments and external instruments so the operators can use the device in essentially the same manner as they do with microscope slides. The integrated circuit can be fabricated on a flexible plastic substrate at very low cost using a roll-to-roll printing method. Electrical power at 13.56 MHz transmitted by a radio-frequency identification (RFID) reader is inductively coupled to the printed RFIC and converted into 10 V DC (direct current) output, which provides sufficient power to drive a microfluidic device to manipulate biological particles such as beads and proteins via the DC dielectrophoresis (DC-DEP) effect. To our best knowledge, this is the first wirelessly powered microfluidic dielectrophoresis device. Although the work is preliminary, the device concept, the architecture, and the core technology are expected to stimulate many efforts in the future and transform the technology to a wide range of clinical and point-of-care applications. This journal is © The Royal Society of Chemistry 2011

  16. Vacuum-thermal-evaporation: the route for roll-to-roll production of large-area organic electronic circuits

    International Nuclear Information System (INIS)

    Taylor, D M

    2015-01-01

    Surprisingly little consideration is apparently being given to vacuum-evaporation as the route for the roll-to-roll (R2R) production of large-area organic electronic circuits. While considerable progress has been made by combining silicon lithographic approaches with solution processing, it is not obvious that these will be compatible with a low-cost, high-speed R2R process. Most efforts at achieving this ambition are directed at conventional solution printing approaches such as inkjet and gravure. This is surprising considering that vacuum-evaporation of organic semiconductors (OSCs) is already used commercially in the production of organic light emitting diode displays. Beginning from a discussion of the materials and geometrical parameters determining transistor performance and drawing on results from numerous publications, this review makes a case for vacuum-evaporation as an enabler of R2R organic circuit production. The potential of the vacuum route is benchmarked against solution approaches and found to be highly competitive. For example, evaporated small molecules tend to have higher mobility than printed OSCs. High resolution metal patterning on plastic films is already a low-cost commercial process for high-volume packaging applications. Similarly, solvent-free flash-evaporation and polymerization of thin films on plastic substrates is also a high-volume commercial process and has been shown capable of producing robust gate dielectrics. Reports of basic logic circuit elements produced in a vacuum R2R environment are reviewed and shown to be superior to all-solution printing approaches. Finally, the main issues that need to be resolved in order to fully develop the vacuum route to R2R circuit production are highlighted. (paper)

  17. Inkjet printing and inkjet infiltration of functional coatings for SOFCs fabrication

    Directory of Open Access Journals (Sweden)

    Tomov Rumen I.

    2016-01-01

    Full Text Available Inkjet printing fabrication and modification of electrodes and electrolytes of SOFCs were studied. Electromagnetic print-heads were utilized to reproducibly dispense droplets of inks at rates of several kHz on demand. Printing parameters including pressure, nozzle opening time and drop spreading were studied in order to optimize the inks jetting and delivery. Scanning electron microscopy revealed highly conformal ~ 6-10 μm thick dense electrolyte layers routinely produced on cermet and metal porous supports. Open circuit voltages ranging from 0.95 to 1.01 V, and a maximum power density of ~180 mW.cm−2 were measured at 750 °C on Ni-8YSZ/YSZ/LSM single cell 50×50 mm in size. The effect of anode and cathode microstructures on the electrochemical performance was investigated. Two - step fabrication of the electrodes using inkjet printing infiltration was implemented. In the first step the porous electrode scaffold was created printing suspension composite inks. During the second step inkjet printing infiltration was utilized for controllable loading of active elements and a formation of nano-grid decorations on the scaffolds radically reducing the activation polarization losses of both electrodes. Symmetrical cells of both types were characterized by impedance spectroscopy in order to reveal the relation between the microstructure and the electrochemical performance.

  18. Roll-offset printed transparent conducting electrode for organic solar cells

    International Nuclear Information System (INIS)

    Kim, Inyoung; Kwak, Sun-Woo; Ju, Yeonkyeong; Park, Gun-Young; Lee, Taik-Min; Jang, Yunseok; Choi, Young-Man; Kang, Dongwoo

    2015-01-01

    Transparent conducting electrodes (TCEs) were developed through the roll-offset printing of Ag grid mesh patterns for the application of all-solution processed organic solar cells (OSCs). Due to the remarkable printability of roll-offset printing, the printed TCEs did not show the step coverage problem of subsequent thin layers, which was a chronic problem in other printing techniques. The control of ink cohesion was verified as a critical factor for the high printing quality, which was optimized by adding a polyurethane diol of 2 wt.%. The tensile strength of optimized Ag ink was 322 mN, which led to the clear patterning of Ag nanoparticles. The printed TCEs with different mesh densities of the Ag grid were designed to have a similar property of indium tin oxide (ITO). The measured sheet resistance was 13 Ω/□, and optical transmittance was 86%, including the glass substrate, which was found to be independent of wavelength in the visible spectrum, in contrast with the optical transmittance of ITO. To evaluate the TCE performance as bottom electrodes, all-solution processed OSCs were fabricated on top of the TCEs. The power conversion efficiency (PCE) of the OSCs increased with the increments of the mesh density due to the distinctive increase of the short circuit current density (J sc ), notwithstanding the similar transmittance and sheet resistance of the TCEs. In comparison with ITO, a higher PCE of OSCs was obtained because the printed TCEs with a high mesh density were able to facilitate effective current collection, leading to a significant increase of J sc . - Highlights: • Roll-offset printing provided a remarkable printability of Ag nano-ink. • Control of ink cohesion played a critical role on the patterning of Ag nano-ink. • Printed Ag mesh was used as a transparent conducting electrode. • Transparency and sheet resistance of printed Ag mesh can be designed simply. • Printed Ag mesh was effective for the current collection of organic solar

  19. Roll-offset printed transparent conducting electrode for organic solar cells

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Inyoung, E-mail: ikim@kimm.re.kr; Kwak, Sun-Woo; Ju, Yeonkyeong; Park, Gun-Young; Lee, Taik-Min; Jang, Yunseok; Choi, Young-Man; Kang, Dongwoo

    2015-04-01

    Transparent conducting electrodes (TCEs) were developed through the roll-offset printing of Ag grid mesh patterns for the application of all-solution processed organic solar cells (OSCs). Due to the remarkable printability of roll-offset printing, the printed TCEs did not show the step coverage problem of subsequent thin layers, which was a chronic problem in other printing techniques. The control of ink cohesion was verified as a critical factor for the high printing quality, which was optimized by adding a polyurethane diol of 2 wt.%. The tensile strength of optimized Ag ink was 322 mN, which led to the clear patterning of Ag nanoparticles. The printed TCEs with different mesh densities of the Ag grid were designed to have a similar property of indium tin oxide (ITO). The measured sheet resistance was 13 Ω/□, and optical transmittance was 86%, including the glass substrate, which was found to be independent of wavelength in the visible spectrum, in contrast with the optical transmittance of ITO. To evaluate the TCE performance as bottom electrodes, all-solution processed OSCs were fabricated on top of the TCEs. The power conversion efficiency (PCE) of the OSCs increased with the increments of the mesh density due to the distinctive increase of the short circuit current density (J{sub sc}), notwithstanding the similar transmittance and sheet resistance of the TCEs. In comparison with ITO, a higher PCE of OSCs was obtained because the printed TCEs with a high mesh density were able to facilitate effective current collection, leading to a significant increase of J{sub sc}. - Highlights: • Roll-offset printing provided a remarkable printability of Ag nano-ink. • Control of ink cohesion played a critical role on the patterning of Ag nano-ink. • Printed Ag mesh was used as a transparent conducting electrode. • Transparency and sheet resistance of printed Ag mesh can be designed simply. • Printed Ag mesh was effective for the current collection of organic

  20. Synthesis of pure colloidal silver nanoparticles with high electroconductivity for printed electronic circuits: the effect of amines on their formation in aqueous media.

    Science.gov (United States)

    Natsuki, Jun; Abe, Takao

    2011-07-01

    This paper describes a practical and convenient method to prepare stable colloidal silver nanoparticles for use in printed electronic circuits. The method uses a dispersant and two kinds of reducing agents including 2-(dimethylamino) ethanol (DMAE), which play important roles in the reduction of silver ions in an aqueous medium. The effect of DMAE and dispersant, as well as the factors affecting particle size and morphology are investigated. In the formation of the silver nanoparticles, reduction occurs rapidly at room temperature and the silver particles can be separated easily from the mixture in a short time. In addition, organic solvents are not used. Pure, small and relatively uniform particles with a diameter less than 10 nm can be obtained that exhibit high electroconductivity. The silver nanoparticles are stable, and can be isolated as a dried powder that can be fully redispersed in deionized water. This method of producing colloidal silver nanoparticles will find practical use in electronics applications. Copyright © 2011 Elsevier Inc. All rights reserved.

  1. 3D printed flexible capacitive force sensor with a simple micro-controller based readout

    NARCIS (Netherlands)

    Schouten, Martijn G.; Sanders, Remco; Krijnen, Gijs

    2017-01-01

    This paper describes the development of a proof of principle of a flexible force sensor and the corresponding readout circuit. The flexible force sensor consists of a parallel plate capacitor that is 3D printed using regular and conductive thermoplastic poly-urethane (TPU). The capacitance change

  2. Control of Evaporation Behavior of an Inkjet-Printed Dielectric Layer Using a Mixed-Solvent System

    Science.gov (United States)

    Yang, Hak Soon; Kang, Byung Ju; Oh, Je Hoon

    2016-01-01

    In this study, the evaporation behavior and the resulting morphology of inkjet-printed dielectric layers were controlled using a mixed-solvent system to fabricate uniform poly-4-vinylphenol (PVP) dielectric layers without any pinholes. The mixed-solvent system consisted of two different organic solvents: 1-hexanol and ethanol. The effects of inkjet-printing variables such as overlap condition, substrate temperature, and different printing sequences (continuous and interlacing printing methods) on the inkjet-printed dielectric layer were also investigated. Increasing volume fraction of ethanol (VFE) is likely to reduce the evaporation rate gradient and the drying time of the inkjet-printed dielectric layer; this diminishes the coffee stain effect and thereby improves the uniformity of the inkjet-printed dielectric layer. However, the coffee stain effect becomes more severe with an increase in the substrate temperature due to the enhanced outward convective flow. The overlap condition has little effect on the evaporation behavior of the printed dielectric layer. In addition, the interlacing printing method results in either a stronger coffee stain effect or wavy structures of the dielectric layers depending on the VFE of the PVP solution. All-inkjet-printed capacitors without electrical short circuiting can be successfully fabricated using the optimized PVP solution (VFE = 0.6); this indicates that the mixed-solvent system is expected to play an important role in the fabrication of high-quality inkjet-printed dielectric layers in various printed electronics applications.

  3. Structural Integration of Silicon Solar Cells and Lithium-ion Batteries Using Printed Electronics

    Science.gov (United States)

    Kang, Jin Sung

    Inkjet printing of electrode using copper nanoparticle ink is presented. Electrode was printed on a flexible glass epoxy composite substrate using drop on demand piezoelectric dispenser and was sintered at 200°C in N 2 gas condition. The printed electrodes were made with various widths and thicknesses. Surface morphology of electrode was analyzed using scanning electron microscope (SEM) and atomic force microscope (AFM). Reliable dimensions for printed electronics were found from this study. Single-crystalline silicon solar cells were tested under four-point bending to find the feasibility of directly integrating them onto a carbon fiber/epoxy composite laminate. These solar cells were not able to withstand 0.2% strain. On the other hand, thin-film amorphous silicon solar cells were subjected to flexural fatigue loadings. The current density-voltage curves were analyzed at different cycles, and there was no noticeable degradation on its performance up to 100 cycles. A multifunctional composite laminate which can harvest and store solar energy was fabricated using printed electrodes. The integrated printed circuit board (PCB) was co-cured with a carbon/epoxy composite laminate by the vacuum bag molding process in an autoclave; an amorphous silicon solar cell and a thin-film solid state lithium-ion (Li-ion) battery were adhesively joined and electrically connected to a thin flexible PCB; and then the passive components such as resistors and diodes were electrically connected to the printed circuit board by silver pasting. Since a thin-film solid state Li-ion battery was not able to withstand tensile strain above 0.4%, thin Li-ion polymer batteries were tested under various mechanical loadings and environmental conditions to find the feasibility of using the polymer batteries for our multifunctional purpose. It was found that the Li-ion polymer batteries were stable under pressure and tensile loading without any noticeable degradation on its charge and discharge

  4. Design of electrohydrodynamic lens for stabilizing of eletrohydrodynamic jet printing

    International Nuclear Information System (INIS)

    Park, Sung-Eun; Lee, Dae-Young; Kim, Sang-Yoon; Shin, Yoon-Soo; Hwang, Jungho; Yu, Tae-U

    2008-01-01

    The generation of micro patterns from conductive material suspensions is gaining significant interests for its usages in the fabrication of flexible display elements and flexible printed circuit boards. In this paper, we presented the results of line patterns of silver nanoparticles obtained by using various types of focusing lenses for electrohydrodynamic jet printing. The pattern widths were measured as 80∼100 μm when the electrohydrodynamic lens having a cone-type inner hole and a cone-type outer wall was used. Electric field strengths were calculated by a commercial solver packages for the four types of electrohydrodynamic lenses. A lens having a cone-type inner hole and a cone-type outer wall of thinner thickness was found to be the best design.

  5. Engineering Novel Lab Devices Using 3D Printing and Microcontrollers.

    Science.gov (United States)

    Courtemanche, Jean; King, Samson; Bouck, David

    2018-03-01

    The application of 3D printing and microcontrollers allows users to rapidly engineer novel hardware solutions useful in a laboratory environment. 3D printing is transformative as it enables the rapid fabrication of adapters, housings, jigs, and small structural elements. Microcontrollers allow for the creation of simple, inexpensive machines that receive input from one or more sensors to trigger a mechanical or electrical output. Bringing these technologies together, we have developed custom solutions that improve capabilities and reduce costs, errors, and human intervention. In this article, we describe three devices: JetLid, TipWaster, and Remote Monitoring Device (REMIND). JetLid employs a microcontroller and presence sensor to trigger a high-speed fan that reliably de-lids microtiter plates on a high-throughput screening system. TipWaster uses a presence sensor to activate an active tip waste chute when tips are ejected from a pipetting head. REMIND is a wireless, networked lab monitoring device. In its current implementation, it monitors the liquid level of waste collection vessels or bulk liquid reagent containers. The modularity of this device makes adaptation to other sensors (temperature, humidity, light/darkness, movement, etc.) relatively simple. These three devices illustrate how 3D printing and microcontrollers have enabled the process of rapidly turning ideas into useful devices.

  6. Packaging Printing Today

    OpenAIRE

    Stanislav Bolanča; Igor Majnarić; Kristijan Golubović

    2015-01-01

    Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. T...

  7. Effect of fin-endwall fillet on thermal hydraulic performance of airfoil printed circuit heat exchanger

    International Nuclear Information System (INIS)

    Ma, Ting; Xin, Fei; Li, Lei; Xu, Xiang-yang; Chen, Yi-tung; Wang, Qiu-wang

    2015-01-01

    Printed circuit heat exchanger (PCHE) is recommended to be used for intermediate heat exchanger in Very High Temperature Reactor (VHTR). One of the key features is that it is manufactured by the photochemical etching in order to maintain the internal structure and metal properties. In this paper, a photochemical etching experiment is conducted to manufacture the airfoil PCHE plate. The result indicates that the airfoil fin is not an ideal airfoil profile, but has a fin-endwall fillet. For the purpose of simplifying the numerical model and saving computational time, a validated model with a single fluid is used to further study the effect of fin-endwall fillet on the thermal hydraulic performance of airfoil PCHE. It is found that the fin-endwall fillet can increase the heat transfer and pressure drop in the cases with the non-dimensional longitudinal pitch being 1.63. The effect of fin-endwall fillet on thermal hydraulic performance decreases with the increase of transverse pitch, but the longitudinal pitch has little effect when the non-dimensional longitudinal pitch is greater than 1.88. In the studied cases, the maximum difference of Nusselt number and friction factor between the two models with and without fin-endwall fillet is up to 6.7% and 6.4%. - Highlights: • Fillets are formed in the endwall of airfoil fins during the photochemical etching. • Two-fluid model can be replaced by single-fluid model to perform simulation. • Fin-endwall fillet can increase heat transfer and pressure drop at ζ_l = 1.63. • Effect of fin-endwall fillet decreases as transverse pitch increases at ζ_l = 1.63. • Longitudinal pitch has little effect at ζ_l ≥ 1.88.

  8. Print Quality of Ink Jet Printed PVC Foils

    Directory of Open Access Journals (Sweden)

    Nemanja Kašiković

    2015-09-01

    Full Text Available Digital printing technique is used for a wide variety of substrates, one of which are PVC foils. Samples used in this research were printed by digital ink jet printing technique using Mimaki JV22 printing machine and J-Eco Subly Nano inks. As printing substrates, two different types of materials were used (ORACAL 640 - Print Vinyl and LG Hausys LP2712. A test card consisting of fields of CMYK colours was created and printed, varying the number of ink layers applied. Samples were exposed to light after the printing process. Spectrophotometric measurements were conducted before and after the light treatment. Based on spectrophotometricaly obtained data, colour differences ΔE2000 were calculated. Results showed that increasing number of layers, as well as the right choice of substrates, can improve the behaviour of printed product during exploitation.

  9. Packaging Printing Today

    Directory of Open Access Journals (Sweden)

    Stanislav Bolanča

    2015-12-01

    Full Text Available Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. The possibilities of particular printing techniques for optimal production of the determined packaging were studied in the paper. The problem was viewed from the technological and economical aspect. The possible printing quality and the time necessary for the printing realization were taken as key parameters. An important segment of the production and the way of life is alocation value and it had also found its place in this paper. The events in the field of packaging printing in the whole world were analyzed. The trends of technique developments and the printing technology for packaging printing in near future were also discussed.

  10. Waste management research abstracts no. 16. Information on radioactive waste programmes in progress

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1985-11-01

    The research abstracts contained in this issue have been collected during recent months ending August 1985. The abstracts reflect research currently in progress in the field of radioactive waste management: environmental impacts, site selection, decontamination and decommissioning, environmental restoration and legal aspects of radioactive waste management. The abstracts have been printed in the language and in the form of submittal and without any changes other than minor editorial ones.

  11. Waste management research abstracts no. 16. Information on radioactive waste programmes in progress

    International Nuclear Information System (INIS)

    1985-11-01

    The research abstracts contained in this issue have been collected during recent months ending August 1985. The abstracts reflect research currently in progress in the field of radioactive waste management: environmental impacts, site selection, decontamination and decommissioning, environmental restoration and legal aspects of radioactive waste management. The abstracts have been printed in the language and in the form of submittal and without any changes other than minor editorial ones

  12. 76 FR 36480 - Hazardous Waste Manifest Printing Specifications Correction Rule

    Science.gov (United States)

    2011-06-22

    ...: Proposed rule. SUMMARY: The Environmental Protection Agency (EPA) is proposing a minor change to the... preamble to the Direct Final rule. If we receive no adverse comment on this minor change we are publishing... number of small entities. This action proposes only a minor change to the manifest printing...

  13. A super ink jet printed zinc-silver 3D microbattery

    Science.gov (United States)

    Ho, C. C.; Murata, K.; Steingart, D. A.; Evans, J. W.; Wright, P. K.

    2009-09-01

    A novel super ink jet printing (SIJP) system was used to fabricate 3D zinc-silver microbatteries directly on a substrate. The SIJP provides a simple and flexible method to deposit interesting 2D and 3D structures of varying morphologies without the waste and large energy inputs typical of standard microfabrication technologies. The system was used to print pairs of silver electrodes with arrays of pillars on glass substrates, and in the presence of an electrolyte, the battery self-assembled during the first charge. Using an aqueous electrolyte solution of KOH with dissolved ZnO, the SIJP printed structures showed similar electrochemical behavior to batteries composed of silver foil electrodes. For a sparse array of pillars (~2.5% footprint area of each electrode pad occupied by pillars), a capacity increase of 60% was achieved in comparison with a cell with planar electrodes.

  14. OCRWM [Office of Civilian Radioactive Waste Management] publications catalog on high-level radioactive waste management

    International Nuclear Information System (INIS)

    1987-07-01

    The US Department of Energy's (DOE's) Office of Civilian Radioactive Waste Management (OCRWM) is publishing this catalog to provide citations of selected technical and public information on the subject of high-level radioactive waste management. The catalog is a resource and reference tool. It will be updated and printed annually. The online catalog will be available for review through OCRWM's Product Record System (PRS) and can eventually be made available to the public. The printed catalog version is suitable for libraries and those individuals needing either a broad base of information or a particular source; the computerized catalog version provides the most current information resources available, since updates to citations will be made as they are received. The number of documents suitable for listing in this catalog is expected to grow significantly each year

  15. Intelligent Adjustment of Printhead Driving Waveform Parameters for 3D Electronic Printing

    Directory of Open Access Journals (Sweden)

    Lin Na

    2017-01-01

    Full Text Available In practical applications of 3D electronic printing, a major challenge is to adjust the printhead for a high print resolution and accuracy. However, an exhausting manual selective process inevitably wastes a lot of time. Therefore, in this paper, we proposed a new intelligent adjustment method, which adopts artificial bee colony algorithm to optimize the printhead driving waveform parameters for getting the desired printhead state. Experimental results show that this method can quickly and accuracy find out the suitable combination of driving waveform parameters to meet the needs of applications.

  16. The online sealing performance test of the primary circuit pressure boundary check valve in nuclear power plants

    International Nuclear Information System (INIS)

    Yang Yunfei; Huang Huimin

    2013-01-01

    The primary circuit pressure boundary check valves of 320 MW pressurized water reactor is a nuclear grade I key equipment. The sealing demand is very high, which is directly related to the internal leakage rate of the primary circuit system. After the welding check valve is repaired, the sealing performance is judged by color printing checks. If there is water or humid vapor in the pipe, it will affect the accuracy of the color printing checks. For the particularity of the online check valve tightness test, online detecting device is designed by the hydraulic pressure drop method in other nuclear power plants, but the method has some shortcomings and restrictions. In this paper, we design a reliable and portable test equipment by the low-pressure gas seal test flow measurement, which make accurate and quantitative judgment of sealing property after the pressure boundary check valves are repaired. (authors)

  17. Logic circuits composed of flexible carbon nanotube thin-film transistor and ultra-thin polymer gate dielectric

    Science.gov (United States)

    Lee, Dongil; Yoon, Jinsu; Lee, Juhee; Lee, Byung-Hyun; Seol, Myeong-Lok; Bae, Hagyoul; Jeon, Seung-Bae; Seong, Hyejeong; Im, Sung Gap; Choi, Sung-Jin; Choi, Yang-Kyu

    2016-05-01

    Printing electronics has become increasingly prominent in the field of electronic engineering because this method is highly efficient at producing flexible, low-cost and large-scale thin-film transistors. However, TFTs are typically constructed with rigid insulating layers consisting of oxides and nitrides that are brittle and require high processing temperatures, which can cause a number of problems when used in printed flexible TFTs. In this study, we address these issues and demonstrate a method of producing inkjet-printed TFTs that include an ultra-thin polymeric dielectric layer produced by initiated chemical vapor deposition (iCVD) at room temperature and highly purified 99.9% semiconducting carbon nanotubes. Our integrated approach enables the production of flexible logic circuits consisting of CNT-TFTs on a polyethersulfone (PES) substrate that have a high mobility (up to 9.76 cm2 V-1 sec-1), a low operating voltage (less than 4 V), a high current on/off ratio (3 × 104), and a total device yield of 90%. Thus, it should be emphasized that this study delineates a guideline for the feasibility of producing flexible CNT-TFT logic circuits with high performance based on a low-cost and simple fabrication process.

  18. Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing

    Directory of Open Access Journals (Sweden)

    Seok Young Ji

    2018-02-01

    Full Text Available The development of printing technologies has enabled the realization of electric circuit fabrication on a flexible substrate. However, the current technique remains restricted to single-layer patterning. In this paper, we demonstrate a fully solution-processable patterning approach for multi-layer circuits using a combined method of laser sintering and ablation. Selective laser sintering of silver (Ag nanoparticle-based ink is applied to make conductive patterns on a heat-sensitive substrate and insulating layer. The laser beam path and irradiation fluence are controlled to create circuit patterns for flexible electronics. Microvia drilling using femtosecond laser through the polyvinylphenol-film insulating layer by laser ablation, as well as sequential coating of Ag ink and laser sintering, achieves an interlayer interconnection between multi-layer circuits. The dimension of microvia is determined by a sophisticated adjustment of the laser focal position and intensity. Based on these methods, a flexible electronic circuit with chip-size-package light-emitting diodes was successfully fabricated and demonstrated to have functional operations.

  19. Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing

    Science.gov (United States)

    Ji, Seok Young; Choi, Wonsuk; Jeon, Jin-Woo; Chang, Won Seok

    2018-01-01

    The development of printing technologies has enabled the realization of electric circuit fabrication on a flexible substrate. However, the current technique remains restricted to single-layer patterning. In this paper, we demonstrate a fully solution-processable patterning approach for multi-layer circuits using a combined method of laser sintering and ablation. Selective laser sintering of silver (Ag) nanoparticle-based ink is applied to make conductive patterns on a heat-sensitive substrate and insulating layer. The laser beam path and irradiation fluence are controlled to create circuit patterns for flexible electronics. Microvia drilling using femtosecond laser through the polyvinylphenol-film insulating layer by laser ablation, as well as sequential coating of Ag ink and laser sintering, achieves an interlayer interconnection between multi-layer circuits. The dimension of microvia is determined by a sophisticated adjustment of the laser focal position and intensity. Based on these methods, a flexible electronic circuit with chip-size-package light-emitting diodes was successfully fabricated and demonstrated to have functional operations. PMID:29425144

  20. Bioleaching of gold, copper and nickel from waste cellular phone PCBs and computer goldfinger motherboards by two Aspergillus nigerstrains

    Directory of Open Access Journals (Sweden)

    Jorge Enrique Madrigal-Arias

    2015-09-01

    Full Text Available In an effort to develop alternate techniques to recover metals from waste electrical and electronic equipment (WEEE, this research evaluated the bioleaching efficiency of gold (Au, copper (Cu and nickel (Ni by two strains of Aspergillus niger in the presence of gold-plated finger integrated circuits found in computer motherboards (GFICMs and cellular phone printed circuit boards (PCBs. These three metals were analyzed for their commercial value and their diverse applications in the industry. Au-bioleaching ranged from 42 to 1% for Aspergillus niger strain MXPE6; with the combination of Aspergillus niger MXPE6 + Aspergillus niger MX7, the Au-bioleaching was 87 and 28% for PCBs and GFICMs, respectively. In contrast, the bioleaching of Cu by Aspergillus niger MXPE6 was 24 and 5%; using the combination of both strains, the values were 0.2 and 29% for PCBs and GFICMs, respectively. Fungal Ni-leaching was only found for PCBs, but with no significant differences among treatments. Improvement of the metal recovery efficiency by means of fungal metabolism is also discussed.

  1. Bioleaching of gold, copper and nickel from waste cellular phone PCBs and computer goldfinger motherboards by two Aspergillus nigerstrains.

    Science.gov (United States)

    Madrigal-Arias, Jorge Enrique; Argumedo-Delira, Rosalba; Alarcón, Alejandro; Mendoza-López, Ma Remedios; García-Barradas, Oscar; Cruz-Sánchez, Jesús Samuel; Ferrera-Cerrato, Ronald; Jiménez-Fernández, Maribel

    2015-01-01

    In an effort to develop alternate techniques to recover metals from waste electrical and electronic equipment (WEEE), this research evaluated the bioleaching efficiency of gold (Au), copper (Cu) and nickel (Ni) by two strains of Aspergillus niger in the presence of gold-plated finger integrated circuits found in computer motherboards (GFICMs) and cellular phone printed circuit boards (PCBs). These three metals were analyzed for their commercial value and their diverse applications in the industry. Au-bioleaching ranged from 42 to 1% for Aspergillus niger strain MXPE6; with the combination of Aspergillus niger MXPE6 + Aspergillus niger MX7, the Au-bioleaching was 87 and 28% for PCBs and GFICMs, respectively. In contrast, the bioleaching of Cu by Aspergillus niger MXPE6 was 24 and 5%; using the combination of both strains, the values were 0.2 and 29% for PCBs and GFICMs, respectively. Fungal Ni-leaching was only found for PCBs, but with no significant differences among treatments. Improvement of the metal recovery efficiency by means of fungal metabolism is also discussed.

  2. A super ink jet printed zinc–silver 3D microbattery

    International Nuclear Information System (INIS)

    Ho, C C; Evans, J W; Murata, K; Steingart, D A; Wright, P K

    2009-01-01

    A novel super ink jet printing (SIJP) system was used to fabricate 3D zinc–silver microbatteries directly on a substrate. The SIJP provides a simple and flexible method to deposit interesting 2D and 3D structures of varying morphologies without the waste and large energy inputs typical of standard microfabrication technologies. The system was used to print pairs of silver electrodes with arrays of pillars on glass substrates, and in the presence of an electrolyte, the battery self-assembled during the first charge. Using an aqueous electrolyte solution of KOH with dissolved ZnO, the SIJP printed structures showed similar electrochemical behavior to batteries composed of silver foil electrodes. For a sparse array of pillars (∼2.5% footprint area of each electrode pad occupied by pillars), a capacity increase of 60% was achieved in comparison with a cell with planar electrodes

  3. Thermal cure effects on electromechanical properties of conductive wires by direct ink write for 4D printing and soft machines

    Science.gov (United States)

    Mu, Quanyi; Dunn, Conner K.; Wang, Lei; Dunn, Martin L.; Qi, H. Jerry; Wang, Tiejun

    2017-04-01

    Recent developments in soft materials and 3D printing are promoting the rapid development of novel technologies and concepts, such as 4D printing and soft machines, that in turn require new methods for fabricating conductive materials. Despite the ubiquity of silver nanoparticles (NPs) in the conducting electrodes of printed electronic devices, their potential use in stretchable conductors has not been fully explored in 4D printing and soft machines. This paper studies the effect of thermal cure conditions on conductivity and electro-mechanical behaviors of silver ink by the direct ink write (DIW) printing approach. We found that the electro-mechanical properties of silver wires can be tailored by controlling cure time and cure temperature to achieve conductivity as well as stretchability. For the silver NP ink we used in the experiments, silver wires cured at 80 °C for 10-30 min have conductivity >1% bulk silver, Young’s modulus printed silver ink patterns on the surface of 3D printed polymer parts, with the future goal of constructing fully 3D printed arbitrarily formed soft and stretchable devices and of applying them to 4D printing. We demonstrated a fully printed functional soft-matter sensor and a circuit element that can be stretched by as much as 45%.

  4. Inkjet printed Cu(In,Ga)S2 nanoparticles for low-cost solar cells

    KAUST Repository

    Barbe, Jeremy

    2016-12-13

    Cu(In,Ga)Se2 (CIGSe) thin film solar cells were fabricated by direct inkjet printing of Cu(In,Ga)S2 (CIGS) nanoparticles followed by rapid thermal annealing under selenium vapor. Inkjet printing is a low-cost, low-waste, and flexible patterning method which can be used for deposition of solution-based or nanoparticle-based CIGS films with high throughput. XRD and Raman spectra indicate that no secondary phase is formed in the as-deposited CIGS film since quaternary chalcopyrite nanoparticles are used as the base solution for printing. Besides, CIGSe films with various Cu/(In + Ga) ratios could be obtained by finely tuning the composition of CIGS nanoparticles contained in the ink, which was found to strongly influence the devices performance and film morphology. To date, this is the first successful fabrication of a solar device by inkjet printing of CIGS nanoparticles.

  5. Copper extraction from coarsely ground printed circuit boards using moderate thermophilic bacteria in a rotating-drum reactor

    Energy Technology Data Exchange (ETDEWEB)

    Rodrigues, Michael L.M., E-mail: mitchel.marques@yahoo.com.br [Bio& Hydrometallurgy Laboratory, Department of Metallurgical and Materials Engineering, Universidade Federal de Ouro Preto, Campus Morro do Cruzeiro, Ouro Preto, MG 35400-000 (Brazil); Leão, Versiane A., E-mail: versiane@demet.em.ufop.br [Bio& Hydrometallurgy Laboratory, Department of Metallurgical and Materials Engineering, Universidade Federal de Ouro Preto, Campus Morro do Cruzeiro, Ouro Preto, MG 35400-000 (Brazil); Gomes, Otavio [Centre for Mineral Technology – CETEM, Av Pedro Calmon, 900, 21941-908 Rio de Janeiro (Brazil); Lambert, Fanny; Bastin, David; Gaydardzhiev, Stoyan [Mineral Processing and Recycling, University of Liege, SartTilman, 4000 Liege (Belgium)

    2015-07-15

    Highlights: • Copper bioleaching from PCB (20 mm) by moderate thermophiles was demonstrated. • Larger PCB sheets enable a cost reduction due to the elimination of fine grinding. • Crushing generated cracks in PCB increasing the copper extraction. • A pre-treatment step was necessary to remove the lacquer coating. • High copper extractions (85%) were possible with pulp density of up to 25.0 g/L. - Abstract: The current work reports on a new approach for copper bioleaching from Printed Circuit Board (PCB) by moderate thermophiles in a rotating-drum reactor. Initially leaching of PCB was carried out in shake flasks to assess the effects of particle size (−208 μm + 147 μm), ferrous iron concentration (1.25–10.0 g/L) and pH (1.5–2.5) on copper leaching using mesophile and moderate thermophile microorganisms. Only at a relatively low solid content (10.0 g/L) complete copper extraction was achieved from the particle size investigated. Conversely, high copper extractions were possible from coarse-ground PCB (20 mm-long) working with increased solids concentration (up to 25.0 g/L). Because there was as the faster leaching kinetics at 50 °C Sulfobacillus thermosulfidooxidans was selected for experiments in a rotating-drum reactor with the coarser-sized PCB sheets. Under optimal conditions, copper extraction reached 85%, in 8 days and microscopic observations by SEM–EDS of the on non-leached and leached material suggested that metal dissolution from the internal layers was restricted by the fact that metal surface was not entirely available and accessible for the solution in the case of the 20 mm-size sheets.

  6. Copper extraction from coarsely ground printed circuit boards using moderate thermophilic bacteria in a rotating-drum reactor

    International Nuclear Information System (INIS)

    Rodrigues, Michael L.M.; Leão, Versiane A.; Gomes, Otavio; Lambert, Fanny; Bastin, David; Gaydardzhiev, Stoyan

    2015-01-01

    Highlights: • Copper bioleaching from PCB (20 mm) by moderate thermophiles was demonstrated. • Larger PCB sheets enable a cost reduction due to the elimination of fine grinding. • Crushing generated cracks in PCB increasing the copper extraction. • A pre-treatment step was necessary to remove the lacquer coating. • High copper extractions (85%) were possible with pulp density of up to 25.0 g/L. - Abstract: The current work reports on a new approach for copper bioleaching from Printed Circuit Board (PCB) by moderate thermophiles in a rotating-drum reactor. Initially leaching of PCB was carried out in shake flasks to assess the effects of particle size (−208 μm + 147 μm), ferrous iron concentration (1.25–10.0 g/L) and pH (1.5–2.5) on copper leaching using mesophile and moderate thermophile microorganisms. Only at a relatively low solid content (10.0 g/L) complete copper extraction was achieved from the particle size investigated. Conversely, high copper extractions were possible from coarse-ground PCB (20 mm-long) working with increased solids concentration (up to 25.0 g/L). Because there was as the faster leaching kinetics at 50 °C Sulfobacillus thermosulfidooxidans was selected for experiments in a rotating-drum reactor with the coarser-sized PCB sheets. Under optimal conditions, copper extraction reached 85%, in 8 days and microscopic observations by SEM–EDS of the on non-leached and leached material suggested that metal dissolution from the internal layers was restricted by the fact that metal surface was not entirely available and accessible for the solution in the case of the 20 mm-size sheets

  7. POTENTIALS OF AGRICULTURAL WASTE AND GRASSES IN ...

    African Journals Online (AJOL)

    Shima

    Potentials of some agricultural waste and grasses were investigated. ... to education, printing, publishing and ... technical form, paper is an aqueous deposit ..... Period of. Soaking. Overnight. Overnight. Overnight. Overnight. Overnight.

  8. An inkjet-printed buoyant 3-D lagrangian sensor for real-time flood monitoring

    KAUST Repository

    Farooqui, Muhammad Fahad

    2014-06-01

    A 3-D (cube-shaped) Lagrangian sensor, inkjet printed on a paper substrate, is presented for the first time. The sensor comprises a transmitter chip with a microcontroller completely embedded in the cube, along with a $1.5 \\\\lambda 0 dipole that is uniquely implemented on all the faces of the cube to achieve a near isotropic radiation pattern. The sensor has been designed to operate both in the air as well as water (half immersed) for real-time flood monitoring. The sensor weighs 1.8 gm and measures 13 mm$\\\\,\\\\times\\\\,$ 13 mm$\\\\,\\\\times\\\\,$ 13 mm, and each side of the cube corresponds to only $0.1 \\\\lambda 0 (at 2.4 GHz). The printed circuit board is also inkjet-printed on paper substrate to make the sensor light weight and buoyant. Issues related to the bending of inkjet-printed tracks and integration of the transmitter chip in the cube are discussed. The Lagrangian sensor is designed to operate in a wireless sensor network and field tests have confirmed that it can communicate up to a distance of 100 m while in the air and up to 50 m while half immersed in water. © 1963-2012 IEEE.

  9. Hazardous Waste Cleanup: General Electric - Auburn Plant in Auburn, New York

    Science.gov (United States)

    GE purchased the property at Genesee Street in 1951 and constructed a manufacturing plant that produced a variety of electrical components including radar equipment, printed circuit boards and high voltage semiconductors. In January 1986, Powerex, Inc.,

  10. Remote crane control techniques and closed-circuit television for the U.S. Department of Energy, Defense Waste Processing Facility

    International Nuclear Information System (INIS)

    DaSilva, D.A.

    1988-01-01

    The Defense Waste Processing Facility (DWPF) located at the Savannah River Plant (SRP), South Carolina is a nuclear waste facility being built to vitrify and containerize high level radioactive waste products. DWPF has a unique requirement for an unmanned crane system to install and replace equipment in the high humidity, high radiation and harsh chemical environment of permanently inaccessible processing cells. A radio control system is provided to control a 117 ton capacity bridge crane that is equipped with various power tools for remote handling of crane replaceable and maintained equipment. High resolution black and white closed circuit television (CTV) assemblies mounted on the crane and on the walls of the various processing cells are provided for viewing the equipment during normal operations and maintenance. The main process cell (MPC) crane is designed as the vehicle to be the eyes, ears and hands for remote in-cell operations and maintenance. The crane runs on elevated rails above the process cells. A trailer-like-electrical equipment compartment (EEC) containing control and radio communications equipment for the crane; is dragged along on rails in a heavily shielded corridor by a drag bar mounted to the crane. A two way RF system is the communications link for all control and video signals between the crane and two stationary crane control consoles

  11. EGaIn-Assisted Room-Temperature Sintering of Silver Nanoparticles for Stretchable, Inkjet-Printed, Thin-Film Electronics.

    Science.gov (United States)

    Tavakoli, Mahmoud; Malakooti, Mohammad H; Paisana, Hugo; Ohm, Yunsik; Marques, Daniel Green; Alhais Lopes, Pedro; Piedade, Ana P; de Almeida, Anibal T; Majidi, Carmel

    2018-05-29

    Coating inkjet-printed traces of silver nanoparticle (AgNP) ink with a thin layer of eutectic gallium indium (EGaIn) increases the electrical conductivity by six-orders of magnitude and significantly improves tolerance to tensile strain. This enhancement is achieved through a room-temperature "sintering" process in which the liquid-phase EGaIn alloy binds the AgNP particles (≈100 nm diameter) to form a continuous conductive trace. Ultrathin and hydrographically transferrable electronics are produced by printing traces with a composition of AgNP-Ga-In on a 5 µm-thick temporary tattoo paper. The printed circuit is flexible enough to remain functional when deformed and can support strains above 80% with modest electromechanical coupling (gauge factor ≈1). These mechanically robust thin-film circuits are well suited for transfer to highly curved and nondevelopable 3D surfaces as well as skin and other soft deformable substrates. In contrast to other stretchable tattoo-like electronics, the low-cost processing steps introduced here eliminate the need for cleanroom fabrication and instead requires only a commercial desktop printer. Most significantly, it enables functionalities like "electronic tattoos" and 3D hydrographic transfer that have not been previously reported with EGaIn or EGaIn-based biphasic electronics. © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  12. Determination of Lead(II), Cadmium(II) and Copper(II) in Waste-Water and Soil Extracts on Mercury Film Screen-Printed Carbon Electrodes Sensor

    International Nuclear Information System (INIS)

    Mohd Fairulnizal Md Noh; Tothill, I.E.

    2011-01-01

    A sensor incorporating a three electrodes configuration have been fabricated using low cost screen-printing technology. These electrodes couples with Square Wave Stripping Voltammetry (SWSV) has provided a convenient screening tool for on-site detection of trace levels of Pb(II), Cd(II) and Cu(II). Modification of the graphite carbon surface based on in situ deposition of mercury film has been carried out. By appropriate choice of supporting medium and optimized parameters setting such as amount of mercury used the deposition potential, deposition time, frequency and scan rate, well resolved and reproducible response for Pb(II), Cd(II) and Cu(II) were obtained. The performance characteristics of the developed mercury film screen printed carbon electrode (MFSPCE) for 120 s deposition time showed that the linear range for Cd(II), Pb(II) and Cu(II) were 10 to 200 μg L -1 . The detection limit recorded for Cd(II), Pb(II) and Cu(II) were 2, 1 and 5 μg L -1 with relative standard deviation (RSD) of 6.5 %, 6.9 % and 7.5 %, respectively. Successful applications of the sensing device to waste-water and extracted soil samples were demonstrated. (author)

  13. Digital Textile Printing

    OpenAIRE

    Moltchanova, Julia

    2011-01-01

    Rapidly evolving technology of digital printing opens new opportunities on many markets. One of them is the printed fabric market where printing companies as well as clients benefit from new printing methods. This thesis focuses on the digital textile printing technology and its implementation for fabric-on-demand printing service in Finland. The purpose of this project was to study the technology behind digital textile printing, areas of application of this technology, the requirements ...

  14. MOCVD ZnO/Screen Printed Ag Back Reflector for Flexible Thin Film Silicon Solar Cell Application

    Directory of Open Access Journals (Sweden)

    Amornrat Limmanee

    2014-01-01

    Full Text Available We have prepared Ag back electrode by screen printing technique and developed MOCVD ZnO/screen printed Ag back reflector for flexible thin film silicon solar cell application. A discontinuity and poor contact interface between the MOCVD ZnO and screen printed Ag layers caused poor open circuit voltage (Voc and low fill factor (FF; however, an insertion of a thin sputtered ZnO layer at the interface could solve this problem. The n type hydrogenated amorphous silicon (a-Si:H film is preferable for the deposition on the surface of MOCVD ZnO film rather than the microcrystalline film due to its less sensitivity to textured surface, and this allowed an improvement in the FF. The n-i-p flexible amorphous silicon solar cell using the MOCVD ZnO/screen printed Ag back reflector showed an initial efficiency of 6.2% with Voc=0.86 V, Jsc=12.4 mA/cm2, and FF = 0.58 (1 cm2. The identical quantum efficiency and comparable performance to the cells using conventional sputtered Ag back electrode have verified the potential of the MOCVD ZnO/screen printed Ag back reflector and possible opportunity to use the screen printed Ag thick film for flexible thin film silicon solar cells.

  15. Laser printed glass planar lightwave circuits with integrated fiber alignment structures

    Science.gov (United States)

    Desmet, A.; Radosavljevic, A.; Missinne, J.; Van Thourhout, D.; Van Steenberge, G.

    2018-02-01

    Femtosecond laser inscription allows straightforward manufacturing of glass planar lightwave circuits such as waveguides, interferometers, directional couplers, resonators and more complex structures. Fiber alignment structures are needed to facilitate communication with the glass planar lightwave circuit. In this study, a technique is described to create optical waveguides and alignment structures in the same laser exposure step. Using an industrial ytterbium-doped 1030 nm fiber laser pulses of 400 fs were focused into glass with a 0.4 NA objective causing permanent alteration of the material. Depending on laser parameters this modification allows direct writing of waveguides or the creation of channels after exposing the irradiated volumes to an etchant such as KOH. Writing of channels and waveguides with different laser powers, frequencies, polarisations, stage translation speeds and scan densities were investigated in fused silica and borosilicate glass. Waveguides with controlled dimensions were created, as well as etched U-grooves with a diameter of 126 μm and a sidewall roughness Ra of 255 nm. Cut back measurements were performed giving a waveguide propagation loss of 1.1 dB/cm in borosilicate glass. A coupling loss of 0.7 dB was measured for a transition between the waveguide and standard single mode fiber at 1550 nm, using index matching liquid. The described technique eliminates active alignment requirements and is useful for many applications such as microfluidic sensing, PLCs, fan-out connectors for multicore fibers and quantum optical networks.

  16. Embedding electromagnetic band gap structures in printed circuit boards for electromagnetic interference reduction

    NARCIS (Netherlands)

    Tereshchenko, O.V.

    2015-01-01

    Due to the tendency of faster data rates and lower power supply voltage in the integrated circuit (IC) design, Simultaneously Switching Noise (SSN) and ground bounce become serious concerns for designers and testers. This noise can be a source of electromagnetic interference (EMI). It propagates

  17. Thermal characterization of screen printed conductive pastes for RFID antennas

    Energy Technology Data Exchange (ETDEWEB)

    Janeczek, Kamil, E-mail: kamil.janeczek@itr.org.pl [Tele and Radio Research Institute, 11 Ratuszowa Street, 03-450 Warsaw (Poland); Jakubowska, Malgorzata [Institute of Electronic Materials Technology, 133 Wolczynska Street, 01-919 Warsaw (Poland); Warsaw University of Technology, Institute of Metrology and Biomedical Engineering, 8 Sankt Andrzej Bobola Street, 02-525 Warsaw (Poland); Mlozniak, Anna [Institute of Electronic Materials Technology, 133 Wolczynska Street, 01-919 Warsaw (Poland); Koziol, Grazyna [Tele and Radio Research Institute, 11 Ratuszowa Street, 03-450 Warsaw (Poland)

    2012-09-01

    Thermal resistance is an essential aspect of electronic circuits designing. It leads to unexpected changes in electronic components during their work. In this study, new materials for screen printed RFID tag's antennas were characterized in terms of their resistance to thermal exposure. Polymer materials containing silver flakes, silver nanopowder, carbon nanotubes or conductive polymer PEDOT:PSS were elaborated and used for antenna printing on flexible materials. In order to verify their long term susceptibility to damages caused by the changing environmental conditions, the temperature cycling test was used in three different temperature ranges: +65 Degree-Sign C, -12 Degree-Sign C, -40 Degree-Sign C/+85 Degree-Sign C (3 h in each temp., dwell time 1 h). The highest durability to thermal exposure exhibited the paste with carbon nanotubes dispersed in poly(methyl methacrylate) PMMA and the lowest one - the paste with conductive polymer PEDOT:PSS.

  18. Thermal characterization of screen printed conductive pastes for RFID antennas

    International Nuclear Information System (INIS)

    Janeczek, Kamil; Jakubowska, Małgorzata; Młożniak, Anna; Kozioł, Grażyna

    2012-01-01

    Thermal resistance is an essential aspect of electronic circuits designing. It leads to unexpected changes in electronic components during their work. In this study, new materials for screen printed RFID tag's antennas were characterized in terms of their resistance to thermal exposure. Polymer materials containing silver flakes, silver nanopowder, carbon nanotubes or conductive polymer PEDOT:PSS were elaborated and used for antenna printing on flexible materials. In order to verify their long term susceptibility to damages caused by the changing environmental conditions, the temperature cycling test was used in three different temperature ranges: +65 °C, −12 °C, −40 °C/+85 °C (3 h in each temp., dwell time 1 h). The highest durability to thermal exposure exhibited the paste with carbon nanotubes dispersed in poly(methyl methacrylate) PMMA and the lowest one – the paste with conductive polymer PEDOT:PSS.

  19. Gas turbine with two circuits and intermediate fuel conversion process

    International Nuclear Information System (INIS)

    Bachl, H.

    1978-01-01

    The combination of a fuel conversion process with a thermal process saves coolant and subsequent separation plant, in order to achieve the greatest possible use of the mechanical or electrical energy. The waste heat of a thermal circuit is taken to an endothermal chemical fuel conversion process arranged before a second circuit. The heat remaining after removal of the heat required for the chemical process is taken to a second thermal circuit. The reaction products of the chemical process which condense out during expansion in the second thermal process are selectively separated from the remaining gas mixture in the individual turbine stages. (HGOE) [de

  20. Hazardous Waste Minimization Assessment: Fort Campbell, Kentucky

    Science.gov (United States)

    1991-03-01

    gal/h -- $8,250 (solvents: chlorinated and $8,600 fluorinated ) 114 Table 39 Aqueous Waste Volume Reduction Equipment Suppliers* Supplier Model Capacity...heavy chloride/hydrochloric acid metal solutions (chromium), nitric acid (zinc, magnesium) Printing (Ink) pigments, dyes, varnish , titanium oxide, iron...lacquers, epoxy. aLkyds. acrylics) :inshing Varnish . shellac, lacquer 13001 Waste flammable liquid. NOS Flammable liquid UN1993 Preserving Creosote

  1. Production and 3D printing processing of bio-based thermoplastic filament

    Directory of Open Access Journals (Sweden)

    Gkartzou Eleni

    2017-01-01

    Full Text Available In this work, an extrusion-based 3D printing technique was employed for processing of biobased blends of Poly(Lactic Acid (PLA with low-cost kraft lignin. In Fused Filament Fabrication (FFF 3D printing process, objects are built in a layer-by-layer fashion by melting, extruding and selectively depositing thermoplastic fibers on a platform. These fibers are used as building blocks for more complex structures with defined microarchitecture, in an automated, cost-effective process, with minimum material waste. A sustainable material consisting of lignin biopolymer blended with poly(lactic acid was examined for its physical properties and for its melt processability during the FFF process. Samples with different PLA/lignin weight ratios were prepared and their mechanical (tensile testing, thermal (Differential Scanning Calorimetry analysis and morphological (optical and scanning electron microscopy, SEM properties were studied. The composition with optimum properties was selected for the production of 3D-printing filament. Three process parameters, which contribute to shear rate and stress imposed on the melt, were examined: extrusion temperature, printing speed and fiber’s width varied and their effect on extrudates’ morphology was evaluated. The mechanical properties of 3D printed specimens were assessed with tensile testing and SEM fractography.

  2. Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections

    Science.gov (United States)

    de la Broïse, Xavier; Le Coguie, Alain; Sauvageot, Jean-Luc; Pigot, Claude; Coppolani, Xavier; Moreau, Vincent; d'Hollosy, Samuel; Knarosovski, Timur; Engel, Andreas

    2018-05-01

    We have successively developed two superconducting flexible PCBs for cryogenic applications. The first one is monolayer, includes 552 tracks (10 µm wide, 20 µm spacing), and receives 24 wire-bonded integrated circuits. The second one is multilayer, with one track layer between two shielding layers interconnected by microvias, includes 37 tracks, and can be interconnected at both ends by wire bonding or by connectors. The first cold measurements have been performed and show good performances. The novelty of these products is, for the first one, the association of superconducting materials with very narrow pitch and bonded integrated circuits and, for the second one, the introduction of a superconducting multilayer structure interconnected by vias which is, to our knowledge, a world-first.

  3. Inkjet printed Cu(In,Ga)S{sub 2} nanoparticles for low-cost solar cells

    Energy Technology Data Exchange (ETDEWEB)

    Barbé, Jérémy, E-mail: jeremy.barbe@kaust.edu.sa; Eid, Jessica [King Abdullah University of Science and Technology, Solar and Photovoltaics Engineering Research Center (SPERC), Division of Physical Sciences and Engineering (Saudi Arabia); Ahlswede, Erik; Spiering, Stefanie; Powalla, Michael [Zentrum fur Sonnenenergie- und Wasserstoff-Forschung Baden-Württemberg (ZSW) (Germany); Agrawal, Rakesh [Purdue University, School of Chemical Engineering (United States); Del Gobbo, Silvano, E-mail: silvano.delgobbo@gmail.com [King Abdullah University of Science and Technology, Solar and Photovoltaics Engineering Research Center (SPERC), Division of Physical Sciences and Engineering (Saudi Arabia)

    2016-12-15

    Cu(In,Ga)Se{sub 2} (CIGSe) thin film solar cells were fabricated by direct inkjet printing of Cu(In,Ga)S{sub 2} (CIGS) nanoparticles followed by rapid thermal annealing under selenium vapor. Inkjet printing is a low-cost, low-waste, and flexible patterning method which can be used for deposition of solution-based or nanoparticle-based CIGS films with high throughput. XRD and Raman spectra indicate that no secondary phase is formed in the as-deposited CIGS film since quaternary chalcopyrite nanoparticles are used as the base solution for printing. Besides, CIGSe films with various Cu/(In + Ga) ratios could be obtained by finely tuning the composition of CIGS nanoparticles contained in the ink, which was found to strongly influence the devices performance and film morphology. To date, this is the first successful fabrication of a solar device by inkjet printing of CIGS nanoparticles.

  4. The best printing methods to print satellite images

    Directory of Open Access Journals (Sweden)

    G.A. Yousif

    2011-12-01

    In this paper different printing systems were used to print an image of SPOT-4 satellite, caver part of Sharm Elshekh area, Sinai, Egypt, on the same type of paper as much as possible, especially in the photography. This step is followed by measuring the experimental data, and analyzed colors to determine the best printing systems for satellite image printing data. The laser system is the more printing system where produce a wider range of color and highest densities of ink and access much color detail. Followed by the offset system which it recorded the best dot gain. Moreover, the study shows that it can use the advantages of each method according to the satellite image color and quantity to be produced.

  5. Characterization and mechanical separation of metals from computer Printed Circuit Boards (PCBs) based on mineral processing methods.

    Science.gov (United States)

    Sarvar, Mojtaba; Salarirad, Mohammad Mehdi; Shabani, Mohammad Amin

    2015-11-01

    In this paper, a novel mechanical process is proposed for enriching metal content of computer Printed Circuit Boards (PCBs). The PCBs are crushed and divided into three different size fractions namely: -0.59, +0.59 to 1.68 and +1.68 mm. Wet jigging and froth flotation methods are selected for metal enrichment. The coarse size fraction (+1.68 mm) is processed by jigging. The plastic free product is grinded and screened. The oversized product is separated as the first concentrate. It was rich of metal because the grinding process was selective. The undersized product is processed by froth flotation. Based on the obtained results, the middle size fraction (+0.59 to 1.68 mm) and the small size fraction (-0.59 mm) are processed by wet jigging and froth flotation respectively. The wet jigging process is optimized by investigating the effect of pulsation frequency and water flow rate. The results of examining the effect of particle size, solid to liquid ratio, conditioning time and using apolar collector showed that collectorless flotation is a promising method for separating nonmetals of PCBs. 95.6%, 97.5% and 85% of metal content of coarse size, middle size and small size fraction are recovered. The grades of obtained concentrates were 63.3%, 92.5% and 75% respectively. The total recovery is calculated as 95.64% and the grade of the final concentrate was 71.26%. Determining the grade of copper and gold in the final product reveals that 4.95% of copper and 24.46% of gold are lost during the concentration. The major part of the lost gold is accumulated in froth flotation tail. Copyright © 2015 Elsevier Ltd. All rights reserved.

  6. Heat transfer and pressure drop of supercritical carbon dioxide flowing in several printed circuit heat exchanger channel patterns

    International Nuclear Information System (INIS)

    Carlson, M.; Kruizenga, A.; Anderson, M.; Corradini, M.

    2012-01-01

    Closed-loop Brayton cycles using supercritical carbon dioxide (SCO 2 ) show potential for use in high-temperature power generation applications including High Temperature Gas Reactors (HTGR) and Sodium-Cooled Fast Reactors (SFR). Compared to Rankine cycles SCO 2 Brayton cycles offer similar or improved efficiency and the potential for decreased capital costs due to a reduction in equipment size and complexity. Compact printed-circuit heat exchangers (PCHE) are being considered as part of several SCO 2 Brayton designs to further reduce equipment size with increased energy density. Several designs plan to use a gas cooler operating near the pseudo-critical point of carbon dioxide to benefit from large variations in thermophysical properties, but further work is needed to validate correlations for heat transfer and pressure-drop characteristics of SCO 2 flows in candidate PCHE channel designs for a variety of operating conditions. This paper presents work on experimental measurements of the heat transfer and pressure drop behavior of miniature channels using carbon dioxide at supercritical pressure. Results from several plate geometries tested in horizontal cooling-mode flow are presented, including a straight semi-circular channel, zigzag channel with a bend angle of 80 degrees, and a channel with a staggered array of extruded airfoil pillars modeled after a NACA 0020 airfoil with an 8.1 mm chord length facing into the flow. Heat transfer coefficients and bulk temperatures are calculated from measured local wall temperatures and local heat fluxes. The experimental results are compared to several methods for estimating the friction factor and Nusselt number of cooling-mode flows at supercritical pressures in millimeter-scale channels. (authors)

  7. Conceptual framework for opening sustainability in pratices of printing industry operations

    Directory of Open Access Journals (Sweden)

    Dalton Alexandre Kai (

    2014-12-01

    Full Text Available There is worldwide concern with global development and this has compelled organizations to modify their management and operations in order to remain competitive, even for their own survival. Develop sustainably means to be economically viable, change each operation to reduce or even not generate waste, conserve energy and natural resources, be safe and not harmful to workers, communities and consumers. Companies that make up the Brazilian printing sector still lack this understanding. The overall goal of this research is to propose a conceptual framework based on the Triple Bottom Line (3BL for sustainability practices in printing industry operations. A literature review process checked the particularities of this industry’s operations, with different perspectives on economic, environmental and social operations. The model presented is expected to be applied, becoming a starting point to enable printing industry companies to adapt their modes of operation, adopting best sustainable practices in sustainable development.

  8. Characterization of brominated flame retardants from e-waste components in China.

    Science.gov (United States)

    Yu, Danfeng; Duan, Huabo; Song, Qingbin; Liu, Yicheng; Li, Ying; Li, Jinhui; Shen, Weijun; Luo, Jiahui; Wang, Jinben

    2017-10-01

    Many studies show that high levels of many toxic metals and persistent and bio-accumulative chemicals have been found in electronic waste (e-waste) dismantling sites and their surrounding environmental media. Both flame-retardant plastic housing materials and printed circuit boards (PCBs) could be the major contributors. However, relatively little work has focused on the use or content of toxic substances and their changing in scrap housing materials and PCBs from home appliances. This study evaluated the existence of brominated flame retardants (BFRs, including polybrominated diphenyl ethers (PBDEs) and Tetrabromobisphenol-A (TBBPA)) in housing plastics and PCBs from home appliances collected from various e-waste recyclers in China. These were then analyzed for the potential migration of BFRs from the e-waste components into their recycled products. The results show that both PBDEs and TBBPA were found with high level in most of e-waste samples, indicating that the widespread use of BFRs in home appliances are entering into the end-of-life stage. For the plastics samples, CRT TVs and LCD monitors should be given priority for the control of BFRs. Regarding PBDEs, the dominant congeners of BDE-209 in the plastics samples contributed 90.72-93.54% to the total concentrations of PBDEs, yet there are large variations for PCBs samples: BDE-28, -47, -99, and -153 were also important congeners compositions, except for BDE-209. Compared with previous studies, the BFRs concentrations in current Chinese e-waste are trending to decline. This study also found that BFRs in housing plastics and PCBs will be transferred into the recycled products with other purpose use, and the new products could have highly enriched capacities for BFRs. The obtained results could be helpful to manage e-waste and their components properly in order to minimize associated environmental and health risks of BFRs, particularly for their further reuse. Copyright © 2017 Elsevier Ltd. All rights reserved.

  9. Circuit bridging of digital equipment caused by smoke from a cable fire

    International Nuclear Information System (INIS)

    Tanaka, T.J.; Anderson, D.J.

    1997-01-01

    Advanced reactor systems are likely to use protection systems with digital electronics that ideally should be resistant to environmental hazards, including smoke from possible cable fires. Previous smoke tests have shown that digital safety systems can fail even at relatively low levels of smoke density and that short-term failures are likely to be caused by circuit bridging. Experiments were performed to examine these failures, with a focus on component packaging and protection schemes. Circuit bridging, which causes increased leakage currents and arcs, was gauged by measuring leakage currents among the leads of component packages. The resistance among circuit leads typically varies over a wide range, depending on the nature of the circuitry between the pins, bias conditions, circuit board material, etc. Resistance between leads can be as low as 20 kΩ and still be good, depending on the component. For these tests, the authors chose a printed circuit board and components that normally have an interlead resistance above 10 12 Ω, but if the circuit is exposed to smoke, circuit bridging causes the resistance to fall below 10 3 Ω. Plated-through-hole (PTH) and surface-mounted (SMT) packages were exposed to a series of different smoke environments using a mixture of environmentally qualified cables for fuel. Conformal coatings and enclosures were tested as circuit protection methods. High fuel levels, high humidity, and high flaming burns were the conditions most likely to cause circuit bridging. The inexpensive conformal coating that was tested - an acrylic spray - reduced leakage currents, but enclosure in a chassis with a fan did not. PTH packages were more resistant to smoke-induced circuit bridging than SMT packages. Active components failed most often in tests where the leakage currents were high, but failure did not always accompany high leakage currents

  10. Digital printing

    Science.gov (United States)

    Sobotka, Werner K.

    1997-02-01

    Digital printing is described as a tool to replace conventional printing machines completely. Still this goal was not reached until now with any of the digital printing technologies to be described in the paper. Productivity and costs are still the main parameters and are not really solved until now. Quality in digital printing is no problem anymore. Definition of digital printing is to transfer digital datas directly on the paper surface. This step can be carried out directly or with the use of an intermediate image carrier. Keywords in digital printing are: computer- to-press; erasable image carrier; image carrier with memory. Digital printing is also the logical development of the new digital area as it is pointed out in Nicholas Negropotes book 'Being Digital' and also the answer to networking and Internet technologies. Creating images text and color in one country and publishing the datas in another country or continent is the main advantage. Printing on demand another big advantage and last but not least personalization the last big advantage. Costs and being able to coop with this new world of prepress technology is the biggest disadvantage. Therefore the very optimistic growth rates for the next few years are really nonexistent. The development of complete new markets is too slow and the replacing of old markets is too small.

  11. Leak of draft report on radioactive waste

    International Nuclear Information System (INIS)

    1986-01-01

    The Environment Committee's second report discusses the leak of the draft report on radioactive waste. The circumstances of the leak are discussed and ''The Times'' and ''The Guardian'' articles of December 1985 are printed in full, as are the letter from the Chairman of the environmental committee to the members and their replies. The letters from Mr John Large of Large and Associates to the Chairman of the Environment Committee, and Mr Large's correspondence with Greenpeace are also printed. (UK)

  12. Recent trends in print portals and Web2Print applications

    Science.gov (United States)

    Tuijn, Chris

    2009-01-01

    For quite some time now, the printing business has been under heavy pressure because of overcapacity, dropping prices and the delocalization of the production to low income countries. To survive in this competitive world, printers have to invest in tools that, on one hand, reduce the production costs and, on the other hand, create additional value for their customers (print buyers). The creation of customer portals on top of prepress production systems allowing print buyers to upload their content, approve the uploaded pages based on soft proofs (rendered by the underlying production system) and further follow-up the generation of the printed material, has been illustrative in this respect. These developments resulted in both automation for the printer and added value for the print buyer. Many traditional customer portals assume that the printed products have been identified before they are presented to the print buyer in the portal environment. The products are, in this case, typically entered by the printing organization in a so-called MISi system after the official purchase order has been received from the print buyer. Afterwards, the MIS system then submits the product to the customer portal. Some portals, however, also support the initiation of printed products by the print buyer directly. This workflow creates additional flexibility but also makes things much more complex. We here have to distinguish between special products that are defined ad-hoc by the print buyer and standardized products that are typically selected out of catalogs. Special products are most of the time defined once and the level of detail required in terms of production parameters is quite high. Systems that support such products typically have a built-in estimation module, or, at least, a direct connection to an MIS system that calculates the prices and adds a specific mark-up to calculate a quote. Often, the markup is added by an account manager on a customer by customer basis; in this

  13. Waste heat recovery system

    Energy Technology Data Exchange (ETDEWEB)

    Ernst, Timothy C.; Zigan, James A.

    2017-12-19

    A waste heat recovery system includes a Rankine cycle (RC) circuit having a pump, a boiler, an energy converter, and a condenser fluidly coupled via conduits in that order, to provide additional work. The additional work is fed to an input of a gearbox assembly including a capacity for oil by mechanically coupling to the energy converter to a gear assembly. An interface is positioned between the RC circuit and the gearbox assembly to partially restrict movement of oil present in the gear assembly into the RC circuit and partially restrict movement of working fluid present in the RC circuit into the gear assembly. An oil return line is fluidly connected to at least one of the conduits fluidly coupling the RC components to one another and is operable to return to the gear assembly oil that has moved across the interface from the gear assembly to the RC circuit.

  14. The status and development of treatment techniques of typical waste electrical and electronic equipment in China: a review.

    Science.gov (United States)

    He, Yunxia; Xu, Zhenming

    2014-04-01

    A large quantity of waste electrical and electronic equipment (WEEE) is being generated because technical innovation promotes the unceasing renewal of products. China's household appliances and electronic products have entered the peak of obsolescence. Due to lack of technology and equipment, recycling of WEEE is causing serious environment pollution. In order to achieve the harmless disposal and resource utilization of WEEE, researchers have performed large quantities of work, and some demonstration projects have been built recently. In this paper, the treatment techniques of typical WEEE components, including printed circuit boards, refrigerator cabinets, toner cartridges, cathode ray tubes, liquid crystal display panels, batteries (Ni-Cd and Li-ion), hard disk drives, and wires are reviewed. An integrated recycling system with environmentally friendly and highly efficient techniques for processing WEEE is proposed. The orientation of further development for WEEE recycling is also proposed.

  15. Hazardous Waste Cleanup: General Electric – Main Plant Site in Schenectady, New York

    Science.gov (United States)

    GE purchased the property at Genesee Street in 1951 and constructed a manufacturing plant that produced a variety of electrical components including radar equipment, printed circuit boards and high voltage semiconductors. In January 1986, Powerex, Inc., ac

  16. Integral Battery Power Limiting Circuit for Intrinsically Safe Applications

    Science.gov (United States)

    Burns, Bradley M.; Blalock, Norman N.

    2010-01-01

    A circuit topology has been designed to guarantee the output of intrinsically safe power for the operation of electrical devices in a hazardous environment. This design uses a MOSFET (metal oxide semiconductor field-effect transistor) as a switch to connect and disconnect power to a load. A test current is provided through a separate path to the load for monitoring by a comparator against a preset threshold level. The circuit is configured so that the test current will detect a fault in the load and open the switch before the main current can respond. The main current passes through the switch and then an inductor. When a fault occurs in the load, the current through the inductor cannot change immediately, but the voltage drops immediately to safe levels. The comparator detects this drop and opens the switch before the current in the inductor has a chance to respond. This circuit protects both the current and voltage from exceeding safe levels. Typically, this type of protection is accomplished by a fuse or a circuit breaker, but in order for a fuse or a circuit breaker to blow or trip, the current must exceed the safe levels momentarily, which may be just enough time to ignite anything in a hazardous environment. To prevent this from happening, a fuse is typically current-limited by the addition of the resistor to keep the current within safe levels while the fuse reacts. The use of a resistor is acceptable for non-battery applications where the wasted energy and voltage drop across the resistor can be tolerated. The use of the switch and inductor minimizes the wasted energy. For example, a circuit runs from a 3.6-V battery that must be current-limited to 200 mA. If the circuit normally draws 10 mA, then an 18-ohm resistor would drop 180 mV during normal operation, while a typical switch (0.02 ohm) and inductor (0.97 ohm) would only drop 9.9 mV. From a power standpoint, the current-limiting resistor protection circuit wastes about 18 times more power than the

  17. Integrated electric circuit engineering system in LSI design center, Konami Kogyo Co. Ltd

    Energy Technology Data Exchange (ETDEWEB)

    Kamitsuki, Kagehiko; Tanaka, Tomiaki

    1988-08-26

    Development of the integrated engineering system is presented which designs and manufactures the hardwares, softwares and cases of electronic game products with LSI integratedly as an experiment. The system is intended to reduce the number of each development of the parts, to verify each other by comparing each parts with the product concept during the development, to reduce modifications, and to shorten development periods. The main subsystems are an electric circuit CAD for LSI designs and a mechanical CAD for case or printed circuit board designs. The LSI development period has been shortened up to one month by a larger capacity computer and higher speed simulator, and the electric circuit engineering system capable of keeping step with the software development has been approximately completed. In the future, the system will be intended to introduce an expert system or a visual system capable of predicting the final product during a logical design period. (10 figs, 1 photo)

  18. An innovative "ChemicalVia" process for the production of high density interconnect printed circuit boards The ATLAS muon chamber quality control with the X-ray tomograph at CERN

    CERN Document Server

    Da Silva, Vitor; Watts, David; Van der Bij, Erik; Banhidi, Z; Berbiers, Julien; Lampl, W; Marchesotti, M; Rangod, Stephane; Sbrissa, E; Schuh, S; Voss, Rüdiger; Zhuravlov, V

    2004-01-01

    The ChemicalVia process, patented by CERN, provides a new method of making microvias in high-density multilayer printed circuit boards of different types, such as sequential build-up (SBU), high density interconnected (HDI), or laminated multi-chip modules (MCM-L). The process uses chemical etching instead of laser, plasma or other etching techniques and can be implemented in a chain production line. This results in an overall reduced operation and maintenance cost and a much shorter hole production time as compared with other microvia processes. copy Emerald Group Publishing Limited. 4 Refs.4 An essential part of the Muon Spectrometer of the ATLAS experiment is based on the Monitored Drift Tube (MDT) technology. About 1200 muon drift chambers are being built at 13 institutes all over the world. The MDT chambers require an exceptional mechanical construction accuracy of better than 20 mu m. A dedicated X-ray tomograph has been developed at CERN since 1996 to control the mechanical quality of the chambers. The...

  19. Internet printing

    Science.gov (United States)

    Rahgozar, M. Armon; Hastings, Tom; McCue, Daniel L.

    1997-04-01

    The Internet is rapidly changing the traditional means of creation, distribution and retrieval of information. Today, information publishers leverage the capabilities provided by Internet technologies to rapidly communicate information to a much wider audience in unique customized ways. As a result, the volume of published content has been astronomically increasing. This, in addition to the ease of distribution afforded by the Internet has resulted in more and more documents being printed. This paper introduces several axes along which Internet printing may be examined and addresses some of the technological challenges that lay ahead. Some of these axes include: (1) submission--the use of the Internet protocols for selecting printers and submitting documents for print, (2) administration--the management and monitoring of printing engines and other print resources via Web pages, and (3) formats--printing document formats whose spectrum now includes HTML documents with simple text, layout-enhanced documents with Style Sheets, documents that contain audio, graphics and other active objects as well as the existing desktop and PDL formats. The format axis of the Internet Printing becomes even more exciting when one considers that the Web documents are inherently compound and the traversal into the various pieces may uncover various formats. The paper also examines some imaging specific issues that are paramount to Internet Printing. These include formats and structures for representing raster documents and images, compression, fonts rendering and color spaces.

  20. Microfabrication of passive electronic components with printed graphene-oxide deposition

    Science.gov (United States)

    Sinar, Dogan; Knopf, George K.; Nikumb, Suwas

    2014-03-01

    Flexible electronic circuitry is an emerging technology that will significantly impact the future of healthcare and medicine, food safety inspection, environmental monitoring, and public security. Recent advances in drop-on-demand printing technology and electrically conductive inks have enabled simple electronic circuits to be fabricated on mechanically flexible polymers, paper, and bioresorbable silk. Research has shown that graphene, and its derivative formulations, can be used to create low-cost electrically conductive inks. Graphene is a one atom thick two-dimensional layer composed of carbon atoms arranged in a hexagonal lattice forming a material with very high fracture strength, high Young's Modulus, and low electrical resistance. Non-conductive graphene-oxide (GO) inks can also be synthesized from inexpensive graphite powders. Once deposited on the flexible substrate the electrical conductivity of the printed GO microcircuit traces can be restored through thermal reduction. In this paper, a femtosecond laser with a wavelength of 775nm and pulse width of 120fs is used to transform the non-conductive printed GO film into electrically conductive oxygen reduced graphene-oxide (rGO) passive electronic components by the process of laser assisted thermal reduction. The heat affected zone produced during the process was minimized because of the femtosecond pulsed laser. The degree of conductivity exhibited by the microstructure is directly related to the laser power level and exposure time. Although rGO films have higher resistances than pristine graphene, the ability to inkjet print capacitive elements and modify local resistive properties provides for a new method of fabricating sensor microcircuits on a variety of substrate surfaces.

  1. Gravure-Offset Printed Metallization of Multi-Crystalline Silicon Solar Cells with Low Metal-Line Width for Mass Production.

    Science.gov (United States)

    Lee, Jonghwan; Jeong, Chaehwan

    2016-05-01

    The gravure offset method has been developed toward an industrially viable printing technique for electronic circuitry. In this paper, a roller type gravure offset manufacturing process was developed to fabricate fine line for using front electrode for solar cells. In order to obtain the optimum metallization printing lines, thickness of 20 μm which is narrow line is required. The main targets are the reduction of metallized area to reduce the shading loss, and a high conductivity to transport the current as loss free as possible out of the cell. However, it is well known that there is a poor contact resistance between the front Ag electrode and the n(+) emitter. Nickel plating was conducted to prevent the increase of contact resistance and the increase of fill factor (FF). The performance of n-Si/Ag (seed layer)/Ni solar cells were observed in 609 mV of open circuit voltage, 35.54 mA/cm2 of short circuit current density, 75.75% of fill factor, and 16.04% of conversion efficiency.

  2. Digital Inkjet Textile Printing

    OpenAIRE

    Wang, Meichun

    2017-01-01

    Digital inkjet textile printing is an emerging technology developed with the rise of the digital world. It offers a possibility to print high-resolution images with unlimited color selection on fabrics. Digital inkjet printing brings a revolutionary chance for the textile printing industry. The history of textile printing shows the law how new technology replaces the traditional way of printing. This indicates the future of digital inkjet textile printing is relatively positive. Differen...

  3. Comparison of inkjet-printed silver conductors on different microsystem substrates

    Science.gov (United States)

    Kruger, Jené; Bezuidenhout, Petroné H.; Joubert, Trudi-Heleen

    2016-02-01

    Applications for diagnostic and environmental point-of-need require processes and building blocks to add smart features to disposable biosensors on low-cost substrates. A novel method for producing such biosensors is printing electronics using additive technologies. This work contributes to the toolbox of processes, materials and components for printed electronics manufacturing - as well as rapid prototyping - of circuits. Printing protocols were developed to facilitate successful inkjet printing of nanosilver ink (Harima NPS-JL) onto different microsystem substrates using a functional printer (Dimatix DMP-3281). Photo paper is a standard inkjet substrate, which were compared with glass, polycarbonate (PC), plastic projector transparency foil, and polydimethylsiloxane (PDMS). Comparison attributes include physical and electrical properties. The layout design comprised dogbone elements of 8 mm length, and widths varying between 100 μm and 2 mm. All printed features were thermally cured for 1 hour at 120 °C. The physical characteristics were measured with a laser scanning microscope (Zeiss LSM-5) to determine the width, thickness and surface roughness of the printed features. An LCR meter (GW-Instek 8110) was used to measure the printed structures' electrical characteristics (resistance, capacitance and inductance). A lumped element model and layout design rules were extracted to assist in standardized design procedures. The model incorporates prediction of the bandwidth attainable with these structures. The layer thickness on all substrates is larger than the 1 μm on photo paper, and varies between 1.6 μm (PC) and 7 μm (PDMS). The spreading for PDMS is similar to photo paper, but since for the other substrates it is between 5 (glass) and 10 (PC) times larger than for photo paper, the layout design rules require large spacing, leading to larger area networks. Electrical probing on the PDMS is not consistent and results are inconclusive. For the other substrates

  4. A59 waste repackaging database (AWARD)

    International Nuclear Information System (INIS)

    Keel, A.

    1993-06-01

    This document describes the software modules to be implemented to provide the user interface for the A59 Waste Repackaging Database (AWARD). The modules will consist of a front end menu with options giving access to the various screen forms and printed reports. (Author)

  5. Printed photodetectors

    International Nuclear Information System (INIS)

    Pace, Giuseppina; Grimoldi, Andrea; Sampietro, Marco; Natali, Dario; Caironi, Mario

    2015-01-01

    Photodetectors convert light pulses into electrical signals and are fundamental building blocks for any opto-electronic system adopting light as a probe or information carrier. They have widespread technological applications, from telecommunications to sensors in industrial, medical and civil environments. Further opportunities are plastic short-range communications systems, interactive large-area surfaces and light-weight, flexible, digital imagers. These applications would greatly benefit from the cost-effective fabrication processes enabled by printing technology. While organic semiconductors are the most investigated materials for printed photodetectors, and are the main focus of the present review, there are notable examples of other inorganic or hybrid printable semiconductors for opto-electronic systems, such as quantum-dots and nanowires. Here we propose an overview on printed photodetectors, including three-terminal phototransistors. We first give a brief account of the working mechanism of these light sensitive devices, and then we review the recent progress achieved with scalable printing techniques such as screen-printing, inkjet and other non-contact technologies in the development of all-printed or hybrid systems. (paper)

  6. Printed photodetectors

    Science.gov (United States)

    Pace, Giuseppina; Grimoldi, Andrea; Sampietro, Marco; Natali, Dario; Caironi, Mario

    2015-10-01

    Photodetectors convert light pulses into electrical signals and are fundamental building blocks for any opto-electronic system adopting light as a probe or information carrier. They have widespread technological applications, from telecommunications to sensors in industrial, medical and civil environments. Further opportunities are plastic short-range communications systems, interactive large-area surfaces and light-weight, flexible, digital imagers. These applications would greatly benefit from the cost-effective fabrication processes enabled by printing technology. While organic semiconductors are the most investigated materials for printed photodetectors, and are the main focus of the present review, there are notable examples of other inorganic or hybrid printable semiconductors for opto-electronic systems, such as quantum-dots and nanowires. Here we propose an overview on printed photodetectors, including three-terminal phototransistors. We first give a brief account of the working mechanism of these light sensitive devices, and then we review the recent progress achieved with scalable printing techniques such as screen-printing, inkjet and other non-contact technologies in the development of all-printed or hybrid systems.

  7. 3D printing PLGA: a quantitative examination of the effects of polymer composition and printing parameters on print resolution.

    Science.gov (United States)

    Guo, Ting; Holzberg, Timothy R; Lim, Casey G; Gao, Feng; Gargava, Ankit; Trachtenberg, Jordan E; Mikos, Antonios G; Fisher, John P

    2017-04-12

    In the past few decades, 3D printing has played a significant role in fabricating scaffolds with consistent, complex structure that meet patient-specific needs in future clinical applications. Although many studies have contributed to this emerging field of additive manufacturing, which includes material development and computer-aided scaffold design, current quantitative analyses do not correlate material properties, printing parameters, and printing outcomes to a great extent. A model that correlates these properties has tremendous potential to standardize 3D printing for tissue engineering and biomaterial science. In this study, we printed poly(lactic-co-glycolic acid) (PLGA) utilizing a direct melt extrusion technique without additional ingredients. We investigated PLGA with various lactic acid:glycolic acid (LA:GA) molecular weight ratios and end caps to demonstrate the dependence of the extrusion process on the polymer composition. Micro-computed tomography was then used to evaluate printed scaffolds containing different LA:GA ratios, composed of different fiber patterns, and processed under different printing conditions. We built a statistical model to reveal the correlation and predominant factors that determine printing precision. Our model showed a strong linear relationship between the actual and predicted precision under different combinations of printing conditions and material compositions. This quantitative examination establishes a significant foreground to 3D print biomaterials following a systematic fabrication procedure. Additionally, our proposed statistical models can be applied to couple specific biomaterials and 3D printing applications for patient implants with particular requirements.

  8. 3D printing PLGA: a quantitative examination of the effects of polymer composition and printing parameters on print resolution

    Science.gov (United States)

    Guo, Ting; Holzberg, Timothy R; Lim, Casey G; Gao, Feng; Gargava, Ankit; Trachtenberg, Jordan E; Mikos, Antonios G; Fisher, John P

    2018-01-01

    In the past few decades, 3D printing has played a significant role in fabricating scaffolds with consistent, complex structure that meet patient-specific needs in future clinical applications. Although many studies have contributed to this emerging field of additive manufacturing, which includes material development and computer-aided scaffold design, current quantitative analyses do not correlate material properties, printing parameters, and printing outcomes to a great extent. A model that correlates these properties has tremendous potential to standardize 3D printing for tissue engineering and biomaterial science. In this study, we printed poly(lactic-co-glycolic acid) (PLGA) utilizing a direct melt extrusion technique without additional ingredients. We investigated PLGA with various lactic acid: glycolic acid (LA:GA) molecular weight ratios and end caps to demonstrate the dependence of the extrusion process on the polymer composition. Micro-computed tomography was then used to evaluate printed scaffolds containing different LA:GA ratios, composed of different fiber patterns, and processed under different printing conditions. We built a statistical model to reveal the correlation and predominant factors that determine printing precision. Our model showed a strong linear relationship between the actual and predicted precision under different combinations of printing conditions and material compositions. This quantitative examination establishes a significant foreground to 3D print biomaterials following a systematic fabrication procedure. Additionally, our proposed statistical models can be applied to couple specific biomaterials and 3D printing applications for patient implants with particular requirements. PMID:28244880

  9. Fully Printed 3D Cube Cantor Fractal Rectenna for Ambient RF Energy Harvesting Application

    KAUST Repository

    Bakytbekov, Azamat

    2017-11-01

    Internet of Things (IoT) is a new emerging paradigm which requires billions of wirelessly connected devices that communicate with each other in a complex radio-frequency (RF) environment. Considering the huge number of devices, recharging batteries or replacing them becomes impractical in real life. Therefore, harvesting ambient RF energy for powering IoT devices can be a practical solution to achieve self-charging operation. The antenna for the RF energy harvesting application must work on multiple frequency bands (multiband or wideband) to capture as much power as possible from ambient; it should be compact and small in size so that it can be integrated with IoT devices; and it should be low cost, considering the huge number of devices. This thesis presents a fully printed 3D cube Cantor fractal RF energy harvesting unit, which meets the above-mentioned criteria. The multiband Cantor fractal antenna has been designed and implemented on a package of rectifying circuits using additive manufacturing (combination of 3D inkjet printing of plastic substrate and 2D metallic screen printing of silver paste) for the first time for RF energy harvesting application. The antenna, which is in a Cantor fractal shape, is folded on five faces of a 3D cube where the bottom face accommodates rectifying circuit with matching network. The rectenna (rectifying antenna) harvests RF power from GSM900, GSM1800, and 3G at 2100 MHz frequency. Indoor and outdoor field tests of the RF energy harvester have been conducted in the IMPACT lab and the King Abdullah University of Science and Technology (KAUST) campus territory, and 252.4 mV of maximum output voltage is harvested.

  10. Thermal decomposition of electronic wastes: Mobile phone case and other parts

    International Nuclear Information System (INIS)

    Molto, Julia; Egea, Silvia; Conesa, Juan Antonio; Font, Rafael

    2011-01-01

    Highlights: → Pyrolysis and combustion of different parts of mobile phones produce important quantities of CO and CO 2 . → Naphthalene is the most abundant PAH obtained in the thermal treatment of mobile phones. → Higher combustion temperature increases the chlorinated species evolved. - Abstract: Pyrolysis and combustion runs at 850 o C in a horizontal laboratory furnace were carried out on different parts of a mobile phone (printed circuit board, mobile case and a mixture of both materials). The analyses of the carbon oxides, light hydrocarbons, polycyclic aromatic hydrocarbons (PAHs), polychlorodibenzo-p-dioxin, polychlorodibenzofurans (PCDD/Fs), and dioxin-like PCBs are shown. Regarding semivolatile compounds, phenol, styrene, and its derivatives had the highest yields. In nearly all the runs the same PAHs were identified, naphthalene being the most common component obtained. Combustion of the printed circuit board produced the highest emission factor of PCDD/Fs, possibly due to the high copper content.

  11. Gold recovery from printed wiring board using bioleaching

    Energy Technology Data Exchange (ETDEWEB)

    Kita, Y. [Faculty of Engineering, Osaka Univ. (Japan); Nishikawa, H. [Center for Advanced Science and Innovation, Osaka Univ. (Japan); Takemoto, T. [Joining and Welding Research Inst., Osaka Univ. (Japan)

    2004-07-01

    In the electronic assembly, gold is frequently used as surface plating and a bonding wire. To recover gold from waste electronics, the dissolution process using cyan is a popular method, however, the solution is highly toxic. Accordingly, the environmentally conscious substitute process is preferable. In this study the possibility of Au dissolution from printed wiring boards using bioleaching has been investigated. Chromobacterium violaceum having ability of cyanide formation was used to dissolve Au. The printed wiring boards with gold plating of 0.07nm in thickness were immersed in synthetic medium with C. violaceum. After immersion test for 480h, the gold plating was completely dissolved. The increase in cyanide concentration gave little effect on the enhancement of dissolution of gold, however, the dissolution rate of Au was increased with increasing of dissolved oxygen in the medium. Chromobacterium violaceum produced 0.8mmol/l cyanide but it also decomposed about 60% of cyanide generated, therefore, this dissolution process could be used as an environmentally conscious method. (orig.)

  12. Reciclagem do lixo de informática: uma oportunidade para a química

    Directory of Open Access Journals (Sweden)

    Annelise Engel Gerbase

    2012-01-01

    Full Text Available Recycling and sustainable development are increasing in importance around the world. In Brazil, the new National Policy on Solid Wastes has prompted discussion on the future of electronic waste (e-waste. Brazil generates the greatest amount of e-waste among Latin American countries. Nevertheless complete recycling, including end processing of e-waste, does not occur in Brazil. This paper discusses the physical and chemical technologies currently used worldwide and in Brazil for printed circuit board recycling, with emphasis on metal recovery and plastic processing. The goal is to put in evidence the important role that chemistry can play in developing cheaper processes to recycle e-waste.

  13. Fully Printed, Flexible, Phased Array Antenna for Lunar Surface Communication

    Science.gov (United States)

    Subbaraman, Harish; Hen, Ray T.; Lu, Xuejun; Chen, Maggie Yihong

    2013-01-01

    NASAs future exploration missions focus on the manned exploration of the Moon, Mars, and beyond, which will rely heavily on the development of a reliable communications infrastructure from planetary surface-to-surface, surface-to-orbit, and back to Earth. Flexible antennas are highly desired in many scenarios. Active phased array antennas (active PAAs) with distributed control and processing electronics at the surface of an antenna aperture offer numerous advantages for radar communications. Large-area active PAAs on flexible substrates are of particular interest in NASA s space radars due to their efficient inflatable package that can be rolled up during transportation and deployed in space. Such an inflatable package significantly reduces stowage volume and mass. Because of these performance and packaging advantages, large-area inflatable active PAAs are highly desired in NASA s surface-to-orbit and surface-to-relay communications. To address the issues of flexible electronics, a room-temperature printing process of active phased-array antennas on a flexible Kapton substrate was developed. Field effect transistors (FETs) based on carbon nanotubes (CNTs), with many unique physical properties, were successfully proved feasible for the PAA system. This innovation is a new type of fully inkjet-printable, two-dimensional, high-frequency PAA on a flexible substrate at room temperature. The designed electronic circuit components, such as the FET switches in the phase shifter, metal interconnection lines, microstrip transmission lines, etc., are all printed using a special inkjet printer. Using the developed technology, entire 1x4, 2x2, and 4x4 PAA systems were developed, packaged, and demonstrated at 5.3 GHz. Several key solutions are addressed in this work to solve the fabrication issues. The source/drain contact is developed using droplets of silver ink printed on the source/drain areas prior to applying CNT thin-film. The wet silver ink droplets allow the silver to

  14. Design for low-cost gas metal arc weld-based aluminum 3-D printing

    Science.gov (United States)

    Haselhuhn, Amberlee S.

    Additive manufacturing, commonly known as 3-D printing, has the potential to change the state of manufacturing across the globe. Parts are made, or printed, layer by layer using only the materials required to form the part, resulting in much less waste than traditional manufacturing methods. Additive manufacturing has been implemented in a wide variety of industries including aerospace, medical, consumer products, and fashion, using metals, ceramics, polymers, composites, and even organic tissues. However, traditional 3-D printing technologies, particularly those used to print metals, can be prohibitively expensive for small enterprises and the average consumer. A low-cost open-source metal 3-D printer has been developed based upon gas metal arc weld (GMAW) technology. Using this technology, substrate release mechanisms have been developed, allowing the user to remove a printed metal part from a metal substrate by hand. The mechanical and microstructural properties of commercially available weld alloys were characterized and used to guide alloy development in 4000 series aluminum-silicon alloys. Wedge casting experiments were performed to screen magnesium, strontium, and titanium boride alloying additions in hypoeutectic aluminum-silicon alloys for their properties and the ease with which they could be printed. Finally, the top performing alloys, which were approximately 11.6% Si modified with strontium and titanium boride were cast, extruded, and drawn into wire. These wires were printed and the mechanical and microstructural properties were compared with those of commercially available alloys. This work resulted in an easier-to-print aluminum-silicon-strontium alloy that exhibited lower porosity, equivalent yield and tensile strengths, yet nearly twice the ductility compared to commercial alloys.

  15. Effect of Hyperbranched Polymers on Curing Behavior of UV Curable Inks in Inkjet Printing

    Directory of Open Access Journals (Sweden)

    Samane Jafarifard

    2016-07-01

    Full Text Available A high quality and high resolution printing can be rapidly created by inkjet printing technology. Inkjet printing is one of the most economic printing methods and ink waste in this technique is very low. Inkjet process provides printing on any type of substrates. The UV curable inks are special types of printing inks that have been widely used in the last decades. The use of UV curable inks is more attractive in inkjet printing technology in comparison to other methods of printing. The most important advantage of UV curable inks in this method is that they are VOC-free and compatible and have good adhesion on many types of substrates. In this research, the effect of hyperbranched polymers on the curing behavior of UV curable inks was investigated. Two types of hyperbranched polymers with hydroxyl and fatty acid chain terminal groups were used in ink formulations. The effect of hyperbranched polymers on the curing behavior of UV curable ink was investigated by real-time FTIR analysis. The results showed that the hyperbranched polymers could improve curing process by increasing the conversion rate of the third curing stage. All ink formulations containing hyperbranched polymers showed higher conversion than a neat sample. The highest conversion was 77 % for the blend containing a hyperbranched polymer with hydroxyl end groups while the neat sample showed a final conversion of 55%. UV curable inks in inkjet process containing hyperbranched polymers with hydroxyl end groups showed a higher final conversion than neat sample.

  16. Concrete waste reduction of 50%

    International Nuclear Information System (INIS)

    Vos, R.M. de; Van der Wagt, K.M.; Van der Kruk, E.; Meeussen, H.W.

    2016-01-01

    During decommissioning quite a volume of concrete waste is produced. The degree of activation of the waste can range from clearly activated material to slightly activated or contaminated concrete. The degree of activation influences the applicable waste management processes that can be applied. The subsequent waste management processes can be identified for concrete waste are; disposal, segregation, re-use, conditional release and release. With each of these steps, the footprint of radioactive decommissioning waste is reduced. Future developments for concrete waste reduction can be achieved by applying smart materials in new build facilities (i.e. fast decaying materials). NRG (Nuclear Research and consultancy Group) has investigated distinctive waste management processes to reduce the foot-print of concrete waste streams resulting from decommissioning. We have investigated which processes can be applied in the Netherlands, both under current legislation and with small changes in legislation. We have also investigated the separation process in more detail. Pilot tests with a newly patented process have been started in 2015. We expect that our separation methods will reduce the footprint reduction of concrete waste by approximately 50% due to release or re-use in the nuclear sector or in the conventional industry. (authors)

  17. 3D Printing and Digital Rock Physics for the Geosciences

    Science.gov (United States)

    Martinez, M. J.; Yoon, H.; Dewers, T. A.

    2014-12-01

    Imaging techniques for the analysis of porous structures have revolutionized our ability to quantitatively characterize geomaterials. For example, digital representations of rock from CT images and physics modeling based on these pore structures provide the opportunity to further advance our quantitative understanding of fluid flow, geomechanics, and geochemistry, and the emergence of coupled behaviors. Additive manufacturing, commonly known as 3D printing, has revolutionized production of custom parts, to the point where parts might be cheaper to print than to make by traditional means in a plant and ship. Some key benefits of additive manufacturing include short lead times, complex shapes, parts on demand, zero required inventory and less material waste. Even subtractive processing, such as milling and etching, may be economized by additive manufacturing. For the geosciences, recent advances in 3D printing technology may be co-opted to print reproducible porous structures derived from CT-imaging of actual rocks for experimental testing. The use of 3D printed microstructure allows us to surmount typical problems associated with sample-to-sample heterogeneity that plague rock physics testing and to test material response independent from pore-structure variability. Together, imaging, digital rocks and 3D printing potentially enables a new workflow for understanding coupled geophysical processes in a real, but well-defined setting circumventing typical issues associated with reproducibility, enabling full characterization and thus connection of physical phenomena to structure. In this talk we will discuss the possibilities that the marriage of these technologies can bring to geosciences, including examples from our current research initiatives in developing constitutive laws for transport and geomechanics via digital rock physics. Sandia National Laboratories is a multi-program laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of

  18. Assessment of toxic metals in waste personal computers

    International Nuclear Information System (INIS)

    Kolias, Konstantinos; Hahladakis, John N.; Gidarakos, Evangelos

    2014-01-01

    Highlights: • Waste personal computers were collected and dismantled in their main parts. • Motherboards, monitors and plastic housing were examined in their metal content. • Concentrations measured were compared to the RoHS Directive, 2002/95/EC. • Pb in motherboards and funnel glass of devices released <2006 was above the limit. • Waste personal computers need to be recycled and environmentally sound managed. - Abstract: Considering the enormous production of waste personal computers nowadays, it is obvious that the study of their composition is necessary in order to regulate their management and prevent any environmental contamination caused by their inappropriate disposal. This study aimed at determining the toxic metals content of motherboards (printed circuit boards), monitor glass and monitor plastic housing of two Cathode Ray Tube (CRT) monitors, three Liquid Crystal Display (LCD) monitors, one LCD touch screen monitor and six motherboards, all of which were discarded. In addition, concentrations of chromium (Cr), cadmium (Cd), lead (Pb) and mercury (Hg) were compared with the respective limits set by the RoHS 2002/95/EC Directive, that was recently renewed by the 2012/19/EU recast, in order to verify manufacturers’ compliance with the regulation. The research included disassembly, pulverization, digestion and chemical analyses of all the aforementioned devices. The toxic metals content of all samples was determined using Inductively Coupled Plasma-Mass Spectrometry (ICP-MS). The results demonstrated that concentrations of Pb in motherboards and funnel glass of devices with release dates before 2006, that is when the RoHS Directive came into force, exceeded the permissible limit. In general, except from Pb, higher metal concentrations were detected in motherboards in comparison with plastic housing and glass samples. Finally, the results of this work were encouraging, since concentrations of metals referred in the RoHS Directive were found in

  19. Assessment of toxic metals in waste personal computers

    Energy Technology Data Exchange (ETDEWEB)

    Kolias, Konstantinos; Hahladakis, John N., E-mail: john_chach@yahoo.gr; Gidarakos, Evangelos, E-mail: gidarako@mred.tuc.gr

    2014-08-15

    Highlights: • Waste personal computers were collected and dismantled in their main parts. • Motherboards, monitors and plastic housing were examined in their metal content. • Concentrations measured were compared to the RoHS Directive, 2002/95/EC. • Pb in motherboards and funnel glass of devices released <2006 was above the limit. • Waste personal computers need to be recycled and environmentally sound managed. - Abstract: Considering the enormous production of waste personal computers nowadays, it is obvious that the study of their composition is necessary in order to regulate their management and prevent any environmental contamination caused by their inappropriate disposal. This study aimed at determining the toxic metals content of motherboards (printed circuit boards), monitor glass and monitor plastic housing of two Cathode Ray Tube (CRT) monitors, three Liquid Crystal Display (LCD) monitors, one LCD touch screen monitor and six motherboards, all of which were discarded. In addition, concentrations of chromium (Cr), cadmium (Cd), lead (Pb) and mercury (Hg) were compared with the respective limits set by the RoHS 2002/95/EC Directive, that was recently renewed by the 2012/19/EU recast, in order to verify manufacturers’ compliance with the regulation. The research included disassembly, pulverization, digestion and chemical analyses of all the aforementioned devices. The toxic metals content of all samples was determined using Inductively Coupled Plasma-Mass Spectrometry (ICP-MS). The results demonstrated that concentrations of Pb in motherboards and funnel glass of devices with release dates before 2006, that is when the RoHS Directive came into force, exceeded the permissible limit. In general, except from Pb, higher metal concentrations were detected in motherboards in comparison with plastic housing and glass samples. Finally, the results of this work were encouraging, since concentrations of metals referred in the RoHS Directive were found in

  20. OCRWM [Office of Civilian Radioactive Waste Management] publications catalog

    International Nuclear Information System (INIS)

    1989-08-01

    The US Department of Energy's (DOE) Office of Civilian Radioactive Waste Management (OCRWM) is publishing this catalog to provide citations of selected technical and public information on the subject of high-level radioactive waste management. The catalog is a resource and reference tool that is updated and printed periodically. The online catalog is available for review through OCRWM's Product Record System (PRS) and is available to the public. The printed catalog version is suitable for libraries and those individuals needing either a broad base of information or a particular source; the computerized catalog version provides the most current information resources available, since updates to citations are made as they are received. The number of documents suitable for listing in this catalog is expected to grow significantly each year

  1. Printing Insecurity? The Security Implications of 3D-Printing of Weapons.

    Science.gov (United States)

    Walther, Gerald

    2015-12-01

    In 2013, the first gun printed out of plastic by a 3D-printer was successfully fired in the U.S. This event caused a major media hype about the dangers of being able to print a gun. Law enforcement agencies worldwide were concerned about this development and the potentially huge security implications of these functional plastic guns. As a result, politicians called for a ban of these weapons and a control of 3D-printing technology. This paper reviews the security implications of 3D-printing technology and 3D guns. It argues that current arms control and transfer policies are adequate to cover 3D-printed guns as well. However, while this analysis may hold up currently, progress in printing technology needs to be monitored to deal with future dangers pre-emptively.

  2. Short- circuit tests of circuit breakers

    OpenAIRE

    Chorovský, P.

    2015-01-01

    This paper deals with short-circuit tests of low voltage electrical devices. In the first part of this paper, there are described basic types of short- circuit tests and their principles. Direct and indirect (synthetic) tests with more details are described in the second part. Each test and principles are explained separately. Oscilogram is obtained from short-circuit tests of circuit breakers at laboratory. The aim of this research work is to propose a test circuit for performing indirect test.

  3. Insitu synthesis of self-assembled gold nanoparticles on glass or silicon substrates through reactive inkjet printing

    KAUST Repository

    Abulikemu, Mutalifu; Da'As, Eman Husni; Haverinen, Hanna M.; Cha, Dong Kyu; Malik, Mohammad A.; Jabbour, Ghassan Elie

    2013-01-01

    A facile and low cost method for the synthesis of self-assembled nanoparticles (NPs) with minimal size variation and chemical waste by using reactive inkjet printing was developed. Gold NPs with diameters as small as (8±2)nm can be made at low

  4. A quick solution, made to measure; Big scientific experiments need big circuit boards and that's where East Kilbride's D-TACQ comes in

    CERN Multimedia

    Gardner, D

    2003-01-01

    D-TACQ is a small electronics company operating in a highly-specialised market with technological expertise that few can match worldwide. It specialises in designing and manufacturing bespoke printed circuit boards (PCBs) which handle data acquisition tasks linked to scientific instrumentation and control systems (1 page).

  5. Conductive ink print on PA66 gear for manufacturing condition monitoring sensors

    Science.gov (United States)

    Futagawa, Shintaro; Iba, Daisuke; Kamimoto, Takahiro; Nakamura, Morimasa; Miura, Nanako; Iizuka, Takashi; Masuda, Arata; Sone, Akira; Moriwaki, Ichiro

    2018-03-01

    Failures detection of rotating machine elements, such as gears, is an important issue. The purpose of this study was to try to solve this issue by printing conductive ink on gears to manufacture condition-monitoring sensors. In this work, three types of crack detection sensor were designed and the sprayed conductive ink was directly sintered on polyimide (PI) - coated polyamide (PA) 66 gears by laser. The result showed that it was possible to produce narrow circuit lines of the conductive ink including Ag by laser sintering technique and the complex shape sensors on the lateral side of the PA66 gears, module 1.0 mm and tooth number 48. A preliminary operation test was carried out for investigation of the function of the sensors. As a result of the test, the sensors printed in this work should be effective for detecting cracks at tooth root of the gears and will allow for the development of better equipment and detection techniques for health monitoring of gears.

  6. Simulation of high SNR photodetector with L-C coupling and transimpedance amplifier circuit and its verification

    Science.gov (United States)

    Wang, Shaofeng; Xiang, Xiao; Zhou, Conghua; Zhai, Yiwei; Quan, Runai; Wang, Mengmeng; Hou, Feiyan; Zhang, Shougang; Dong, Ruifang; Liu, Tao

    2017-01-01

    In this paper, a model for simulating the optical response and noise performances of photodetectors with L-C coupling and transimpedance amplification circuit is presented. To verify the simulation, two kinds of photodetectors, which are based on the same printed-circuit-board (PCB) designing and PIN photodiode but different operational amplifiers, are developed and experimentally investigated. Through the comparisons between the numerical simulation results and the experimentally obtained data, excellent agreements are achieved, which show that the model provides a highly efficient guide for the development of a high signal to noise ratio photodetector. Furthermore, the parasite capacitances on the developed PCB, which are always hardly measured but play a non-negligible influence on the photodetectors' performances, are estimated.

  7. All printed antenna based on silver nanoparticles for 1.8 GHz applications

    Science.gov (United States)

    Hassan, Arshad; Ali, Shawkat; Bae, Jinho; Lee, Chong Hyun

    2016-08-01

    In this paper, we propose a novel printed antenna for 1.8 GHz band applications. The proposed antenna is made of silver nanoparticle-based radiating element and 0.04-mm thin, transparent and flexible polyethylene terephthalate (PET) substrate. The proposed antenna is designed and simulated by finite-element-method-based high-frequency structure simulator (HFSS). We obtain reflection coefficient of -23 dB, gain of 2.72 dBi and efficiency of 93.33 %. The resonance frequency of the antenna is also verified through national instrument (NI) Multisim simulation on the proposed equivalent circuit. We realize the antenna in a single process by commercial Dimatix material inkjet printer (DMP-3000) at ambient condition and characterize it by using vector network analyzer and spectrum analyzer. The measured reflection coefficient and -10 dB bandwidth are -32.2 dB and 190.5 MHz, respectively, which shows good agreement with HFSS and NI Multisim results. The proposed compact and optimum antenna printed on thin, transparent and fully bendable PET substrate becomes very attractive since it can overcome the limits of cost and size. These results suggest that the proposed antenna is well suitable for electronic devices operating over 1.8 GHz band such as Telos-B and other wearable printed devices.

  8. Public information on radioactive waste: a study of an emerging issue

    International Nuclear Information System (INIS)

    Bronfman, L.M.; Bronfman, B.H.; Regens, J.L.

    1979-10-01

    Through an analysis of information provided in the printed media on the topic of radioactive waste, the study analyzes the emergence of radioactive waste as a public issue in the press. Over eight hundred articles printed in both specialized and non-specialized sources from 1973 to 1978 have been content-analyzed in order to describe how the problem of radioactive waste is defined and what dimensions of the problems are receiving attention. Between 1973 and 1978, there was a substantial increase in the amount of information on the topic of radioactive waste available to the public through a variety of popular and specialized media sources. This increase coincides with documented public concern with the problem of radioactive waste. Discussions of radioactive waste have focused for all sources more frequently on themes not directly related to the technical problems of radioactive waste storage or isolation. A substantial amount of the information available to a variety of segments of the public is composed of discussions of real or perceived risk related to the existence of waste or to methods of disposing of it. In addition to risk, a substantial proportion of the discussions deal with institutional themes. Over time, the total amount of information on most dimensions of the radioactive waste problem has increased substantially. Institutional themes have gained relative to other issues over the three time periods. National and local press sources infrequently specify the form of waste being discussed thus providing evidence that the quality of technical information available to some members of the public is very low

  9. Adhesion and failure analysis of metal-polymer interface in flexible printed circuits boards

    Science.gov (United States)

    Park, Sanghee; Kim, Ye Chan; Choi, Kisuk; Chae, Heeyop; Suhr, Jonghwan; Nam, Jae-Do

    2017-12-01

    As device miniaturization in microelectronics is currently requested in the development of high performance device, which usually include highly-integrated metal-polyimide multilayer structures. A redistribution layer (RDL) process is currently emerging as one of the most advance fabrication techniques for on-chip interconnect and packaging. One of the major issues in this process is the poor adhesion of the metal-polyimide interfaces particularly in flexible circuit boards due to the flexibility and bendability of devices. In this study, low pressure O2 plasma treatment was investigated to improve the adhesion of metal-polyimide interfaces, using inductively coupled plasma (ICP) treatment. We identified that the adhesion of metal-polyimide interfaces was greatly improved by the surface roughness control providing 46.1 MPa of shear force in the ball shear test after O2 plasma treatment, compared 14.2 MPa without O2 plasma treatment. It was seemingly due to the fact that the adhesion in metal-polyimide interfaces was improved by a chemical conversion of C=O to C-O bonds and by a ring opening reaction of imide groups, which was confirmed with FT-IR analysis. In the finite element numerical analysis of metal-polyimide interfaces, the O2 plasma treated interface showed that the in-plane stress distribution and the vertical directional deformation agreed well with real failure modes in flexible circuits manufacturing.

  10. Print Finishing: From Manual to Automated Print Finishing

    Directory of Open Access Journals (Sweden)

    Gareth Ward

    2004-12-01

    Full Text Available Meeting the demand for faster turnrounds and shorter print runs goes beyond making the printing press easier to set up and change. There is little point in producing plates and then sheets from a press if the post press area does not change to keep abreast of developments in prepress and the print room. The greatest impact is going to come from JDF, the end to end production data format which is finding wide spread acceptance in print areas. To date finishing equipment manufacturers are not as well represented within the CIP4 organisation as prepress and press vendors, but the major manufacturers are members. All are working to the goal of complete connectivity.The idea of JDF is that if the format of a print product like a magazine is known during the creation phases, the information can be used to preset machinery that is going to be used to produce it, so avoiding input errors and saving manufacturing time.A second aspect to JDF is that information about performance and progress is gathered and can be retrieved from a central point or made available to a customer. Production scheduling and costing becomes more accurate and customer relationships are deepened. However JDF to its fullest extent is not yet in use in connecting the finishing area to the rest of the printing plant. Around the world different companies are testing the idea of JDF to connect saddle stitchers, guillotines and binders with frantic work underway to be able to show results soon.

  11. Numerical Investigation on the Flow and Heat Transfer Characteristics of Supercritical Liquefied Natural Gas in an Airfoil Fin Printed Circuit Heat Exchanger

    Directory of Open Access Journals (Sweden)

    Zhongchao Zhao

    2017-11-01

    Full Text Available As a new kind of highly compact and efficient micro-channel heat exchanger, the printed circuit heat exchanger (PCHE is a promising candidate satisfying the heat exchange requirements of liquefied natural gas (LNG vaporization at low and high pressure. The effects of airfoil fin arrangement on heat transfer and flow resistance were numerically investigated using supercritical liquefied natural gas (LNG as working fluid. The thermal properties of supercritical LNG were tested by utilizing the REFPROF software database. Numerical simulations were performed using FLUENT. The inlet temperature of supercritical LNG was 121 K, and its pressure was 10.5 MPa. The reference mass flow rate of LNG was set as 1.22 g/s for the vertical pitch Lv = 1.67 mm and the staggered pitch Ls = 0 mm, with the Reynolds number of about 3750. The SST k-ω model was selected and verified by comparing with the experimental data using supercritical liquid nitrogen as cold fluid. The airfoil fin PCHE had better thermal-hydraulic performance than that of the straight channel PCHE. Moreover, the airfoil fins with staggered arrangement displayed better thermal performance than that of the fins with parallel arrangement. The thermal-hydraulic performance of airfoil fin PCHE was improved with increasing Ls and Lv. Moreover, Lv affected the Nusselt number and pressure drop of airfoil fin PCHE more obviously. In conclusion, a sparser staggered arrangement of fins showed a better thermal-hydraulic performance in airfoil fin PCHE.

  12. Commutation circuit for an HVDC circuit breaker

    Science.gov (United States)

    Premerlani, William J.

    1981-01-01

    A commutation circuit for a high voltage DC circuit breaker incorporates a resistor capacitor combination and a charging circuit connected to the main breaker, such that a commutating capacitor is discharged in opposition to the load current to force the current in an arc after breaker opening to zero to facilitate arc interruption. In a particular embodiment, a normally open commutating circuit is connected across the contacts of a main DC circuit breaker to absorb the inductive system energy trapped by breaker opening and to limit recovery voltages to a level tolerable by the commutating circuit components.

  13. A high speed electrohydrodynamic (EHD) jet printing method for line printing

    International Nuclear Information System (INIS)

    Phung, Thanh Huy; Kim, Seora; Kwon, Kye-Si

    2017-01-01

    Electrohydrodynamic (EHD) jet printing has drawn attention due to its capability to produce smaller dots and patterns with finer lines when compared to those obtained from using conventional inkjet printing. Previous studies have suggested that drop-on-demand EHD-patterning applications should be limited to very slow printing cases with speeds far less than 10 mm s −1 due to the small dot size and limited jetting frequency. In this study, a new EHD printing method is proposed to significantly increase the line-patterning printing speed by modifying the ink and thereby changing the relic shape. The proposed method has the additional advantage of reducing the line-pattern width. The results of the experiment show that the pattern width could be reduced from 20 µ m to 4 µ m by increasing the printing speed from 10 mm s −1 to 50 mm s −1 , respectively. (paper)

  14. 3D printed Lego®-like modular microfluidic devices based on capillary driving.

    Science.gov (United States)

    Nie, Jing; Gao, Qing; Qiu, Jing-Jiang; Sun, Miao; Liu, An; Shao, Lei; Fu, Jian-Zhong; Zhao, Peng; He, Yong

    2018-03-12

    The field of how to rapidly assemble microfluidics with modular components continuously attracts researchers' attention, however, extra efforts must be devoted to solving the problems of leaking and aligning between individual modules. This paper presents a novel type of modular microfluidic device, driven by capillary force. There is no necessity for a strict seal or special alignment, and its open structures make it easy to integrate various stents and reactants. The key rationale for this method is to print different functional modules with a low-cost three-dimensional (3D) printer, then fill the channels with capillary materials and assemble them with plugs like Lego ® bricks. This rapidly reconstructed modular microfluidic device consists of a variety of common functional modules and other personalized modules, each module having a unified standard interface for easy assembly. As it can be printed by a desktop 3D printer, the manufacturing process is simple and efficient, with controllable regulation of the flow channel scale. Through diverse combinations of different modules, a variety of different functions can be achieved, without duplicating the manufacturing process. A single module can also be taken out for testing and analysis. What's more, combined with basic circuit components, it can serve as a low-cost Lego ® -like modular microfluidic circuits. As a proof of concept, the modular microfluidic device has been successfully demonstrated and used for stent degradation and cell cultures, revealing the potential use of this method in both chemical and biological research.

  15. Engraving Print Classification

    International Nuclear Information System (INIS)

    Hoelck, Daniel; Barbe, Joaquim

    2008-01-01

    A print is a mark, or drawing, made in or upon a plate, stone, woodblock or other material which is cover with ink and then is press usually into a paper reproducing the image on the paper. Engraving prints usually are image composed of a group of binary lines, specially those are made with relief and intaglio techniques. Varying the number and the orientation of lines, the drawing of the engraving print is conformed. For this reason we propose an application based on image processing methods to classify engraving prints

  16. Analysis of a PCB In-Circuit Test and Its Optimized Cycle

    International Nuclear Information System (INIS)

    Chi, Moon Goo; Lee, Eun Chan; Bae, Yeon Kyoung

    2011-01-01

    KHNP performs subcomponent performance tests of the PCBs (Printed Circuit Boards) installed in safety-related systems or plant trip-related systems with every outage. The characteristics of each subcomponent are measured by test equipment. The tests are known as an ICT (In-Circuit Test). If a degraded condition is detected by this test, the affected subcomponents are replaced. This test has been conducted for 17 years, since 1994, and its results have been compiled into a test system database. As part of the reliability improvement plan of critical PCBs, KHNP developed a program that analyzes the performance of various key PCBs based on this test data. Thus, it became possible to evaluate the performance trends related to PCBs by tracing the test history of the PCB subcomponents through the ICT over many years. The present study also estimates an optimized ICT cycle that can be implemented to prevent the degradation of PCBs before they fail due to aging

  17. The challenge of screen printed Ag metallization on nano-scale poly-silicon passivated contacts for silicon solar cells

    Science.gov (United States)

    Jiang, Lin; Song, Lixin; Yan, Li; Becht, Gregory; Zhang, Yi; Hoerteis, Matthias

    2017-08-01

    Passivated contacts can be used to reduce metal-induced recombination for higher energy conversion efficiency for silicon solar cells, and are obtained increasing attentions by PV industries in recent years. The reported thicknesses of passivated contact layers are mostly within tens of nanometer range, and the corresponding metallization methods are realized mainly by plating/evaporation technology. This high cost metallization cannot compete with the screen printing technology, and may affect its market potential comparing with the presently dominant solar cell technology. Very few works have been reported on screen printing metallization on passivated contact solar cells. Hence, there is a rising demand to realize screen printing metallization technology on this topic. In this work, we investigate applying screen printing metallization pastes on poly-silicon passivated contacts. The critical challenge for us is to build low contact resistance that can be competitive to standard technology while restricting the paste penetrations within the thin nano-scale passivated contact layers. The contact resistivity of 1.1mohm-cm2 and the open circuit voltages > 660mV are achieved, and the most appropriate thickness range is estimated to be around 80 150nm.

  18. Printing Insecurity? The Security Implications of 3D-Printing of Weapons

    OpenAIRE

    Walther, Gerald

    2014-01-01

    In 2013, the first gun printed out of plastic by a 3D-printer was successfully fired in the US. This event caused a major media hype about the dangers of being able to print a gun. Law enforcement agencies worldwide were concerned about this development and the potentially huge security implications of these functional plastic guns. As a result, politicians called for a ban of these weapons and a control of 3D-printing technology. This paper reviews the security implications of 3D-printing te...

  19. Characterizing performances of solder paste printing process at flexible manufacturing lines

    International Nuclear Information System (INIS)

    Siew, Jit Ping; Low, Heng Chin; Teoh, Ping Chow

    2015-01-01

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter

  20. Characterizing performances of solder paste printing process at flexible manufacturing lines

    Energy Technology Data Exchange (ETDEWEB)

    Siew, Jit Ping; Low, Heng Chin [University of Science Malaysia, 11800 Minden, Penang (Malaysia); Teoh, Ping Chow [Wawasan Open University, 54 Jalan Sultan Ahmad Shah, 10050 Penang (Malaysia)

    2015-02-03

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter.

  1. Adult rat retinal ganglion cells and glia can be printed by piezoelectric inkjet printing

    International Nuclear Information System (INIS)

    Lorber, Barbara; Martin, Keith R; Hsiao, Wen-Kai; Hutchings, Ian M

    2014-01-01

    We have investigated whether inkjet printing technology can be extended to print cells of the adult rat central nervous system (CNS), retinal ganglion cells (RGC) and glia, and the effects on survival and growth of these cells in culture, which is an important step in the development of tissue grafts for regenerative medicine, and may aid in the cure of blindness. We observed that RGC and glia can be successfully printed using a piezoelectric printer. Whilst inkjet printing reduced the cell population due to sedimentation within the printing system, imaging of the printhead nozzle, which is the area where the cells experience the greatest shear stress and rate, confirmed that there was no evidence of destruction or even significant distortion of the cells during jet ejection and drop formation. Importantly, the viability of the cells was not affected by the printing process. When we cultured the same number of printed and non-printed RGC/glial cells, there was no significant difference in cell survival and RGC neurite outgrowth. In addition, use of a glial substrate significantly increased RGC neurite outgrowth, and this effect was retained when the cells had been printed. In conclusion, printing of RGC and glia using a piezoelectric printhead does not adversely affect viability and survival/growth of the cells in culture. Importantly, printed glial cells retain their growth-promoting properties when used as a substrate, opening new avenues for printed CNS grafts in regenerative medicine. (paper)

  2. Solution-printed organic semiconductor blends exhibiting transport properties on par with single crystals

    KAUST Repository

    Niazi, Muhammad Rizwan; Li, Ruipeng; Li, Erqiang; Kirmani, Ahmad R.; Abdelsamie, Maged; Wang, Qingxiao; Pan, Wenyang; Payne, Marcia M.; Anthony, John E.; Smilgies, Detlef-M.; Thoroddsen, Sigurdur T; Giannelis, Emmanuel P.; Amassian, Aram

    2015-01-01

    Solution-printed organic semiconductors have emerged in recent years as promising contenders for roll-to-roll manufacturing of electronic and optoelectronic circuits. The stringent performance requirements for organic thin-film transistors (OTFTs) in terms of carrier mobility, switching speed, turn-on voltage and uniformity over large areas require performance currently achieved by organic single-crystal devices, but these suffer from scale-up challenges. Here we present a new method based on blade coating of a blend of conjugated small molecules and amorphous insulating polymers to produce OTFTs with consistently excellent performance characteristics (carrier mobility as high as 6.7 cm2 V−1 s−1, low threshold voltages of<1 V and low subthreshold swings <0.5 V dec−1). Our findings demonstrate that careful control over phase separation and crystallization can yield solution-printed polycrystalline organic semiconductor films with transport properties and other figures of merit on par with their single-crystal counterparts.

  3. Solution-printed organic semiconductor blends exhibiting transport properties on par with single crystals

    KAUST Repository

    Niazi, Muhammad Rizwan

    2015-11-23

    Solution-printed organic semiconductors have emerged in recent years as promising contenders for roll-to-roll manufacturing of electronic and optoelectronic circuits. The stringent performance requirements for organic thin-film transistors (OTFTs) in terms of carrier mobility, switching speed, turn-on voltage and uniformity over large areas require performance currently achieved by organic single-crystal devices, but these suffer from scale-up challenges. Here we present a new method based on blade coating of a blend of conjugated small molecules and amorphous insulating polymers to produce OTFTs with consistently excellent performance characteristics (carrier mobility as high as 6.7 cm2 V−1 s−1, low threshold voltages of<1 V and low subthreshold swings <0.5 V dec−1). Our findings demonstrate that careful control over phase separation and crystallization can yield solution-printed polycrystalline organic semiconductor films with transport properties and other figures of merit on par with their single-crystal counterparts.

  4. Advances in Home Photo Printing

    Institute of Scientific and Technical Information of China (English)

    Qian Lin; Brian Atkins; Huitao Luo

    2004-01-01

    With digital camera adoptions going main stream, consumers capture a record number of photos.Currently, the majority of the digital photos are printed at home. One of the key enablers of this transformation is the advancement of home photo printing technologies. In the past few years, inkjet printing technologies have continued to deliver smaller drop size, larger number of inks, and longer-lasting prints. In the mean time, advanced image processing automatically enhances captured digital photos while being printed. The combination of the above two forces has closed the gap between the home photo prints and AgX prints. It will give an overview of the home photo printing market and technology trends, and discuss major advancements in automatic image processing.

  5. Printed Electronics

    Science.gov (United States)

    Korkut, Sibel (Inventor); Chiang, Katherine S. (Inventor); Crain, John M. (Inventor); Aksay, Ilhan A. (Inventor); Lettow, John S. (Inventor); Chen, Chuan-Hua (Inventor); Prud'Homme, Robert K. (Inventor)

    2018-01-01

    Printed electronic device comprising a substrate onto at least one surface of which has been applied a layer of an electrically conductive ink comprising functionalized graphene sheets and at least one binder. A method of preparing printed electronic devices is further disclosed.

  6. Resonance circuits for adiabatic circuits

    Directory of Open Access Journals (Sweden)

    C. Schlachta

    2003-01-01

    Full Text Available One of the possible techniques to reduces the power consumption in digital CMOS circuits is to slow down the charge transport. This slowdown can be achieved by introducing an inductor in the charging path. Additionally, the inductor can act as an energy storage element, conserving the energy that is normally dissipated during discharging. Together with the parasitic capacitances from the circuit a LCresonant circuit is formed.

  7. Highly flexible self-powered sensors based on printed circuit board technology for human motion detection and gesture recognition.

    Science.gov (United States)

    Fuh, Yiin-Kuen; Ho, Hsi-Chun

    2016-03-04

    In this paper, we demonstrate a new integration of printed circuit board (PCB) technology-based self-powered sensors (PSSs) and direct-write, near-field electrospinning (NFES) with polyvinylidene fluoride (PVDF) micro/nano fibers (MNFs) as source materials. Integration with PCB technology is highly desirable for affordable mass production. In addition, we systematically investigate the effects of electrodes with intervals in the range of 0.15 mm to 0.40 mm on the resultant PSS output voltage and current. The results show that at a strain of 0.5% and 5 Hz, a PSS with a gap interval 0.15 mm produces a maximum output voltage of 3 V and a maximum output current of 220 nA. Under the same dimensional constraints, the MNFs are massively connected in series (via accumulation of continuous MNFs across the gaps ) and in parallel (via accumulation of parallel MNFs on the same gap) simultaneously. Finally, encapsulation in a flexible polymer with different interval electrodes demonstrated that electrical superposition can be realized by connecting MNFs collectively and effectively in serial/parallel patterns to achieve a high current and high voltage output, respectively. Further improvement in PSSs based on the effect of cooperativity was experimentally realized by rolling-up the device into a cylindrical shape, resulting in a 130% increase in power output due to the cooperative effect. We assembled the piezoelectric MNF sensors on gloves, bandages and stockings to fabricate devices that can detect different types of human motion, including finger motion and various flexing and extensions of an ankle. The firmly glued PSSs were tested on the glove and ankle respectively to detect and harvest the various movements and the output voltage was recorded as ∼1.5 V under jumping movement (one PSS) and ∼4.5 V for the clenched fist with five fingers bent concurrently (five PSSs). This research shows that piezoelectric MNFs not only have a huge impact on harvesting various external

  8. Highly flexible self-powered sensors based on printed circuit board technology for human motion detection and gesture recognition

    Science.gov (United States)

    Fuh, Yiin-Kuen; Ho, Hsi-Chun

    2016-03-01

    In this paper, we demonstrate a new integration of printed circuit board (PCB) technology-based self-powered sensors (PSSs) and direct-write, near-field electrospinning (NFES) with polyvinylidene fluoride (PVDF) micro/nano fibers (MNFs) as source materials. Integration with PCB technology is highly desirable for affordable mass production. In addition, we systematically investigate the effects of electrodes with intervals in the range of 0.15 mm to 0.40 mm on the resultant PSS output voltage and current. The results show that at a strain of 0.5% and 5 Hz, a PSS with a gap interval 0.15 mm produces a maximum output voltage of 3 V and a maximum output current of 220 nA. Under the same dimensional constraints, the MNFs are massively connected in series (via accumulation of continuous MNFs across the gaps ) and in parallel (via accumulation of parallel MNFs on the same gap) simultaneously. Finally, encapsulation in a flexible polymer with different interval electrodes demonstrated that electrical superposition can be realized by connecting MNFs collectively and effectively in serial/parallel patterns to achieve a high current and high voltage output, respectively. Further improvement in PSSs based on the effect of cooperativity was experimentally realized by rolling-up the device into a cylindrical shape, resulting in a 130% increase in power output due to the cooperative effect. We assembled the piezoelectric MNF sensors on gloves, bandages and stockings to fabricate devices that can detect different types of human motion, including finger motion and various flexing and extensions of an ankle. The firmly glued PSSs were tested on the glove and ankle respectively to detect and harvest the various movements and the output voltage was recorded as ∼1.5 V under jumping movement (one PSS) and ∼4.5 V for the clenched fist with five fingers bent concurrently (five PSSs). This research shows that piezoelectric MNFs not only have a huge impact on harvesting various external

  9. Printing Has a Future

    Directory of Open Access Journals (Sweden)

    Hans Georg Wenke

    2004-12-01

    Full Text Available Printing will also be done in the future. Printed items meet basic needs and are deeply anchored in people’s habits. Being able to handle and collect printed matter is highly attractive. And paper is now more alive than ever. It is therefore too shortsighted to disclaim the importance of one of the still large economic sectors just because of a few looming-recession instigated market shifts.The exciting aspect of drupa 2004 is: printing will be reinvented, so to speak. Much more printing will be done in the future than at present. On the one hand, people are concentrating on process optimization and automation to ensure this. Measuring and testing, process control and optimization, and linking up "office software" with printing technology will be very central topics at drupa 2004. Electronics and print are not rivals; a symbiosis exists. And printing is high-tech: hardly any other multifaceted sector which has been so successful for centuries is as computerized as the printing industry.A series of "new chapters" in the variety of printing possibilities will be opened at drupa. Talk will be generated by further technical developments, often the connection between paper/cardboard and electronics, the link between the office world and graphics industry, text databases and their link-up to graphic page production tools, and "on the fly" dynamic printing over networks.All of this and more belongs to future potentialities, which are so substantial overall, the outlook is by no means black for the "black art". Like its predecessors, drupa 2004 is also a product trade fair. However, more than ever before in its history, it is also an "information village". The exhibits are useful, because they occasionally make what this means visible.

  10. Printing quality control automation

    Science.gov (United States)

    Trapeznikova, O. V.

    2018-04-01

    One of the most important problems in the concept of standardizing the process of offset printing is the control the quality rating of printing and its automation. To solve the problem, a software has been developed taking into account the specifics of printing system components and the behavior in printing process. In order to characterize the distribution of ink layer on the printed substrate the so-called deviation of the ink layer thickness on the sheet from nominal surface is suggested. The geometric data construction the surface projections of the color gamut bodies allows to visualize the color reproduction gamut of printing systems in brightness ranges and specific color sectors, that provides a qualitative comparison of the system by the reproduction of individual colors in a varying ranges of brightness.

  11. Solvents interactions with thermochromic print

    Directory of Open Access Journals (Sweden)

    Mirela Rožić

    2017-12-01

    Full Text Available In this study, the interactions between different solvents (benzene, acetone, cyclohexanone, various alcohols and water and thermochromic printing ink were investigated. Thermochromic printing ink was printed on metal surface. Components of thermochromic printing inks are polymeric microcapsules and classic yellow offset printing ink. Below its activation temperature, dye and developer within the microcapsules form a blue coloured complex. Therefore, thermochromic print is green. By heating above the activation temperature, blue colour of the complex turns into the leuco dye colourless state and the green colour of the prints turns into the yellow colour of the classic offset pigment. The results of the interaction with various solvents show that the thermochromic print is stable in all tested solvents except in ethanol, acetone and cyclohexanone. In ethanol, the green colour of the print becomes yellow. SEM analysis shows that microcapsules are dissolved. In acetone and cyclohexanone, the green colour of the print turns into blue, and the microcapsules become significantly more visible. Thus, the yellow pigment interacts with examined ketones. Based on the obtained interactions it can be concluded that the microcapsules have more polar nature than the classical pigment particles. Solvent-thermocromic print interactions were analysed using Hansen solubility parameters that rank the solvents based on their estimated interaction capabilities.

  12. Angle resolved x-ray photoelectron spectroscopy (ARXPS) analysis of lanthanum oxide for micro-flexography printing

    Energy Technology Data Exchange (ETDEWEB)

    Hassan, S., E-mail: suhaimihas@uthm.edu.my; Yusof, M. S., E-mail: mdsalleh@uthm.edu.my; Maksud, M. I., E-mail: midris1973@gmail.com [Faculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia, 86400 Batu Pahat, Johor (Malaysia); Embong, Z., E-mail: zaidi@uthm.edu.my [Faculty of Science, Technology and Human Development, Universiti Tun Hussein Onn Malaysia, 86400 Batu Pahat, Johor (Malaysia)

    2016-01-22

    Micro-flexography printing was developed in patterning technique from micron to nano scale range to be used for graphic, electronic and bio-medical device on variable substrates. In this work, lanthanum oxide (La{sub 2}O{sub 3}) has been used as a rare earth metal candidate as depositing agent. This metal deposit was embedded on Carbon (C) and Silica (Si) wafer substrate using Magnetron Sputtering technique. The choose of Lanthanum as a target is due to its wide application in producing electronic devices such as thin film battery and printed circuit board. The La{sub 2}O{sub 3} deposited on the surface of Si wafer substrate was then analyzed using Angle Resolve X-Ray Photoelectron Spectroscopy (ARXPS). The position for each synthetic component in the narrow scan of Lanthanum (La) 3d and O 1s are referred to the electron binding energy (eV). The La 3d narrow scan revealed that the oxide species of this particular metal is mainly contributed by La{sub 2}O{sub 3} and La(OH){sub 3}. The information of oxygen species, O{sup 2-} component from O 1s narrow scan indicated that there are four types of species which are contributed from the bulk (O{sup 2−}), two chemisorb component (La{sub 2}O{sub 3}) and La(OH){sub 3} and physisorp component (OH). Here, it is proposed that from the adhesive and surface chemical properties of La, it is suitable as an alternative medium for micro-flexography printing technique in printing multiple fine solid lines at nano scale. Hence, this paper will describe the capability of this particular metal as rare earth metal for use in of micro-flexography printing practice. The review of other parameters contributing to print fine lines will also be described later.

  13. Angle resolved x-ray photoelectron spectroscopy (ARXPS) analysis of lanthanum oxide for micro-flexography printing

    Science.gov (United States)

    Hassan, S.; Yusof, M. S.; Embong, Z.; Maksud, M. I.

    2016-01-01

    Micro-flexography printing was developed in patterning technique from micron to nano scale range to be used for graphic, electronic and bio-medical device on variable substrates. In this work, lanthanum oxide (La2O3) has been used as a rare earth metal candidate as depositing agent. This metal deposit was embedded on Carbon (C) and Silica (Si) wafer substrate using Magnetron Sputtering technique. The choose of Lanthanum as a target is due to its wide application in producing electronic devices such as thin film battery and printed circuit board. The La2O3 deposited on the surface of Si wafer substrate was then analyzed using Angle Resolve X-Ray Photoelectron Spectroscopy (ARXPS). The position for each synthetic component in the narrow scan of Lanthanum (La) 3d and O 1s are referred to the electron binding energy (eV). The La 3d narrow scan revealed that the oxide species of this particular metal is mainly contributed by La2O3 and La(OH)3. The information of oxygen species, O2- component from O 1s narrow scan indicated that there are four types of species which are contributed from the bulk (O2-), two chemisorb component (La2O3) and La(OH)3 and physisorp component (OH). Here, it is proposed that from the adhesive and surface chemical properties of La, it is suitable as an alternative medium for micro-flexography printing technique in printing multiple fine solid lines at nano scale. Hence, this paper will describe the capability of this particular metal as rare earth metal for use in of micro-flexography printing practice. The review of other parameters contributing to print fine lines will also be described later.

  14. Radioactive waste management: a bibliography for the integrated data base program

    Energy Technology Data Exchange (ETDEWEB)

    Johnson, C.A.

    1981-10-01

    This is the second in a series of literature references compiled on waste generation and treatment, characteristics, inventories, and costs. Documents were collected, abstracted, and indexed into a searchable information file, which was then sorted, indexed, and printed for this bibliography. This volume contains over 200 references to nuclear waste management, the majority of which are 1979-1980 publications. Each reference is categorized by waste origin (commercial, government, institutional, and foreign) and by subject area: (1) high-level waste, (2) low-level waste, (3) transuranic (TRU) waste, (4) airborne waste, (5) Remedial Action Program (formerly utilized sites, surplus facilities, and mill tailings), (6) isolation, (7) transportation, (8) spent fuel, (9) fuel cycle centers, and (10) general, nonspecific waste. Six indexes are provided to assist the user in locating documents of interest.

  15. Three-dimensional bio-printing.

    Science.gov (United States)

    Gu, Qi; Hao, Jie; Lu, YangJie; Wang, Liu; Wallace, Gordon G; Zhou, Qi

    2015-05-01

    Three-dimensional (3D) printing technology has been widely used in various manufacturing operations including automotive, defence and space industries. 3D printing has the advantages of personalization, flexibility and high resolution, and is therefore becoming increasingly visible in the high-tech fields. Three-dimensional bio-printing technology also holds promise for future use in medical applications. At present 3D bio-printing is mainly used for simulating and reconstructing some hard tissues or for preparing drug-delivery systems in the medical area. The fabrication of 3D structures with living cells and bioactive moieties spatially distributed throughout will be realisable. Fabrication of complex tissues and organs is still at the exploratory stage. This review summarize the development of 3D bio-printing and its potential in medical applications, as well as discussing the current challenges faced by 3D bio-printing.

  16. Integrated 3d printed wireless sensing system for environmental monitoring

    KAUST Repository

    Farooqui, Muhammad Fahad

    2017-12-21

    Disclosed are various embodiments of a wireless sensor device for monitoring environment conditions. A wireless sensor device may comprise, for example, a computing device, printable circuitry, sensors, and antennas combined with one or more transmitters on a panel. The wireless sensor device may be configured to take environment measurements, such as temperature, gas, humidity, and wirelessly communicate the environment measurements to a remote computing device, in addition, the present disclosure relates to a method of assembling the wireless sensor device. The method may comprise printing sensors, circuitry, and antennas to a panel; folding the panel to form an enclosure comprising a plurality of side panels; and attaching the plurality of side panels to a circuit board panel.

  17. The waste disposal facility in the Aube District

    International Nuclear Information System (INIS)

    Torres, Patrice

    2013-06-01

    The waste disposal facility in the Aube district is the second surface waste disposal facility built in France. It is located in the Aube district, and has been operated by Andra since 1992. With a footprint of 95 hectares, it is licensed for the disposal of 1 million cubic meters of low- and intermediate-level, short-lived waste packages. The CSA is located a few kilometers away another Andra facility, currently in operation for very-low-level waste, and collection and storage of non-nuclear power waste (the Cires). Contents: Andra in the Aube district, an exemplary industrial operator - The waste disposal facility in the Aube district (CSA); Low- and intermediate-level, short-lived radioactive waste (LILW-SL); The LILW-SL circuit; Protecting present and future generations

  18. Printing at CERN

    CERN Multimedia

    Otto, R

    2007-01-01

    For many years CERN had a very sophisticated print server infrastructure which supported several different protocols (AppleTalk, IPX and TCP/IP) and many different printing standards. Today’s situation differs a lot: we have a much more homogenous network infrastructure, where TCP/IP is used everywhere and we have less printer models, which almost all work using current standards (i.e. they all provide PostScript drivers). This change gave us the possibility to review the printing architecture aiming at simplifying the infrastructure in order to achieve full automation of the service. The new infrastructure offers both: LPD service exposing print queues to Linux and Mac OS X computers and native printing for Windows based clients. The printer driver distribution is automatic and native on Windows and automated by custom mechanisms on Linux, where the appropriate Foomatic drivers are configured. Also the process of printer registration and queue creation is completely automated following the printer regis...

  19. Project Circuits in a Basic Electric Circuits Course

    Science.gov (United States)

    Becker, James P.; Plumb, Carolyn; Revia, Richard A.

    2014-01-01

    The use of project circuits (a photoplethysmograph circuit and a simple audio amplifier), introduced in a sophomore-level electric circuits course utilizing active learning and inquiry-based methods, is described. The development of the project circuits was initiated to promote enhanced engagement and deeper understanding of course content among…

  20. Separation of Cadmium in Printing Industrial Liquid Waste by Electromagnetic Plating System

    International Nuclear Information System (INIS)

    Prayitno

    2007-01-01

    To prevent incidence of environmental contamination and its effect to society health and other mortal, poisonous and dangerous substance waste have to be managed peculiarly by minimizing or eliminating the nature of its danger. Various processing have been developed to degrade the waste rate for example sorption, flotation, flocculation, etc., but the yield of the degradation of metal rate can not fulfill permanent standard quality of liquid waste. Because of the reason explained before, its important to make a new breakthrough as one of final phase processing alternative named reductant electromagnetic plating. Waste to be degraded in this research is cadmium. In fact cadmium represent the foregain metal for human and is not require at all in human body for metabolism process. Though plenty of cadmium exploited, but during for centuries it caused the food poisoned because this metal insoluble in organic acid. Separation of cadmium rate with electromagnetic plating influenced by time process, concentration, current strength, and type of electrode plate. Result of research indicate that the optimum time processing if using plate of copper electrode is during 30 minute and using plate of aluminium electrode is during 20 minute. Optimum of strong current that used in process of electromagnetic plating is only 0.8 Ampere and concentration effective is 5 mg / L. The most effective type of electrode plate for reducing cadmium from waste by using electromagnetic plating is aluminium. Appliance of electromagnetic plating system is very compatible used for the reduction of cadmium and others metal for feed concentration (1 - 5) mg/L .at the price efficiency of reduction is (95 - 98) %, standard quality of liquid waste is (0.05 - 1) mg/L. (author)

  1. Printing nanotube/nanowire for flexible microsystems

    Science.gov (United States)

    Tortorich, Ryan P.; Choi, Jin-Woo

    2014-04-01

    Printing has become an emerging manufacturing technology for mechanics, electronics, and consumer products. Additionally, both nanotubes and nanowires have recently been used as materials for sensors and electrodes due to their unique electrical and mechanical properties. Printed electrodes and conductive traces particularly offer versatility of fabricating low-cost, disposable, and flexible electrical devices and microsystems. While various printing methods such as screen printing have been conventional methods for printing conductive traces and electrodes, inkjet printing has recently attracted great attention due to its unique advantages including no template requirement, rapid printing at low cost, on-demand printing capability, and precise control of the printed material. Computer generated conductive traces or electrode patterns can simply be printed on a thin film substrate with proper conductive ink consisting of nanotubes or nanowires. However, in order to develop nanotube or nanowire ink, there are a few challenges that need to be addressed. The most difficult obstacle to overcome is that of nanotube/nanowire dispersion within a solution. Other challenges include adjusting surface tension and controlling viscosity of the ink as well as treating the surface of the printing substrate. In an attempt to pave the way for nanomaterial inkjet printing, we present a method for preparing carbon nanotube ink as well as its printing technique. A fully printed electrochemical sensor using inkjet-printed carbon nanotube electrodes is also demonstrated as an example of the possibilities for this technology.

  2. Waste management research abstracts no. 13. Information on research in progress

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1982-05-01

    The 222 research abstracts contained in this issue have been collected during recent months ending 15 January 1982. The abstracts reflect research currently in progress in the field of radioactive waste management: environmental impacts, site selection, decontamination and decommissioning, environmental restoration and legal aspects of radioactive waste management. The abstracts have been printed in the language and in the form of submittal and without any changes other than minor editorial ones.

  3. Waste management research abstracts no. 13. Information on research in progress

    International Nuclear Information System (INIS)

    1982-05-01

    The 222 research abstracts contained in this issue have been collected during recent months ending 15 January 1982. The abstracts reflect research currently in progress in the field of radioactive waste management: environmental impacts, site selection, decontamination and decommissioning, environmental restoration and legal aspects of radioactive waste management. The abstracts have been printed in the language and in the form of submittal and without any changes other than minor editorial ones

  4. Colour changes in prints during long-term dark storage of prints

    International Nuclear Information System (INIS)

    Parraman, Carinna

    2010-01-01

    The most significant impact on colour fading in prints is exposure to light and air. However what happens to coloured prints during long-term storage in boxes, drawers and on shelves? Measurements of samples, printed in July 2005, stored in a range of light and darkened storage conditions have shown some interesting initial results. As more emphasis is placed on the effects of light, the dark stability of inkjet prints is relatively overlooked when considering how to preserve or store coloured prints. This study and presentation builds on previous research [1] and has concentrated on the changes to colour during storage. With reference to ASTM F2035 - 00(2006) Standard Practice for Measuring the Dark Stability of Ink Jet Prints, the Standards outline points out that whilst natural aging is the most reliable method of assessing image stability, materials and inks any data that is produced quickly becomes redundant; therefore accelerated aging is more preferred. However, the fine art materials in this study are still very much in circulation. The leading fine art papers, and pigmented ink-sets used in these trials are still being used by artists. We can therefore demonstrate the characteristics of colour changes and the impact of ink on paper that utilises natural aging methods.

  5. A Vector Printing Method for High-Speed Electrohydrodynamic (EHD Jet Printing Based on Encoder Position Sensors

    Directory of Open Access Journals (Sweden)

    Thanh Huy Phung

    2018-02-01

    Full Text Available Electrohyrodynamic (EHD jet printing has been widely used in the field of direct micro-nano patterning applications, due to its high resolution printing capability. So far, vector line printing using a single nozzle has been widely used for most EHD printing applications. However, the application has been limited to low-speed printing, to avoid non-uniform line width near the end points where line printing starts and ends. At end points of line vector printing, the deposited drop amount is likely to be significantly large compared to the rest of the printed lines, due to unavoidable acceleration and deceleration. In this study, we proposed a method to solve the printing quality problems by producing droplets at an equally spaced distance, irrespective of the printing speed. For this purpose, an encoder processing unit (EPU was developed, so that the jetting trigger could be generated according to user-defined spacing by using encoder position signals, which are used for the positioning control of the two linear stages.

  6. Some Thoughts on Contemporary Graphic Print

    Directory of Open Access Journals (Sweden)

    Stefan Skiba

    2016-09-01

    Full Text Available The production requirements of original graphic works of art have changed since 1980. The development of digital printing using lightfast colors now rivals traditional techniques such as wood cut, screen print, lithography, etching etc. Today, with respect to artistic legitimacy, original graphics using traditional printing techniques compete with original graphics produced by digital printing techniques on the art market. What criteria distinguish traditional printing techniques from those of digital printing in the production and acquisition of original graphics? What consequences is the serious artist faced with when deciding to implement digital print production? How does digital print change original graphic acquisition decisions?

  7. Colour printing techniques

    OpenAIRE

    Parraman, C.

    2017-01-01

    Invited chapter in the book Colour Design: Theories and Applications. In PART 3 COLOUR, DESIGN AND COLORATION this chapter covers:\\ud - Hardcopy colour: analogue versus digital\\ud - Colour theory in relation to printing\\ud - Overview of halftoning and digital print technologies\\ud - Overview and development of inks\\ud - Inkjet papers and inks\\ud - Recent and future trends in colour, printing inks and hardware.\\ud \\ud This book differs from other existing books in the field, with the aim of an...

  8. Print and Manuscript

    OpenAIRE

    Erne, Lukas Christian

    2007-01-01

    Positioning Shakespeare at the "crossroads of manuscript and print" and exploring what the choice of print or manuscript reveals about the poet's intended audience and the social persona the poet wanted to assume and fashion, argues that "Shakespeare's authorial self-presentation begins as a poet and, more specifically, as a print-published poet" with the publication of Venus and Adonis in 1593 and the allusion to the publication of Rape of Lucrece in the next year. Yet also considers the imp...

  9. Printed Electronics

    Science.gov (United States)

    Wade, Jessica; Hollis, Joseph Razzell; Wood, Sebastian

    2018-04-01

    The combination of printing technology with manufacturing electronic devices enables a new paradigm of printable electronics, where 'smart' functionality can be readily incorporated into almost any product at low cost. Over recent decades, rapid progress has been made in this field, which is now emerging into the industrial andcommercial realm. However, successful development and commercialisation on a large scale presents some significant technical challenges. For fully-printable electronic systems, all the component parts must be deposited from solutions (inks), requiring the development of new inorganic, organic and hybrid materials.A variety of traditional printing techniques are being explored and adapted forprinting these new materials in ways that result in the best performing electronicdevices. Whilst printed electronics research has initially focused on traditional typesof electronic device such as light-emitting diodes, transistors, and photovoltaics, it is increasingly apparent that a much wider range of applications can be realised. The soft and stretchable nature of printable materials makes them perfect candidates forbioelectronics, resulting in a wealth of research looking at biocompatible printable inks and biosensors. Regardless of application, the properties of printed electronicmaterials depend on the chemical structures, processing conditions, device architecture,and operational conditions, the complex inter-relationships of which aredriving ongoing research. We focus on three particular 'hot topics', where attention is currently focused: novel materials, characterisation techniques, and device stability. With progress advancing very rapidly, printed electronics is expected to grow over the next decade into a key technology with an enormous economic and social impact.

  10. Waste printing paper as analogous adsorbents for heavy metals in ...

    African Journals Online (AJOL)

    user

    heavy metals uptake from aqueous solutions but the recovery efficacy as economic and environmental ... system. 1 . Wastes containing metals are directly or indirectly discharge into the environment ... According to World health Organization. 5.

  11. Cost-estimating for commercial digital printing

    Science.gov (United States)

    Keif, Malcolm G.

    2007-01-01

    The purpose of this study is to document current cost-estimating practices used in commercial digital printing. A research study was conducted to determine the use of cost-estimating in commercial digital printing companies. This study answers the questions: 1) What methods are currently being used to estimate digital printing? 2) What is the relationship between estimating and pricing digital printing? 3) To what extent, if at all, do digital printers use full-absorption, all-inclusive hourly rates for estimating? Three different digital printing models were identified: 1) Traditional print providers, who supplement their offset presswork with digital printing for short-run color and versioned commercial print; 2) "Low-touch" print providers, who leverage the power of the Internet to streamline business transactions with digital storefronts; 3) Marketing solutions providers, who see printing less as a discrete manufacturing process and more as a component of a complete marketing campaign. Each model approaches estimating differently. Understanding and predicting costs can be extremely beneficial. Establishing a reliable system to estimate those costs can be somewhat challenging though. Unquestionably, cost-estimating digital printing will increase in relevance in the years ahead, as margins tighten and cost knowledge becomes increasingly more critical.

  12. A STUDY OF RELATIVE CORRELATION BETWEEN THE PATTERN OF FINGER PRINTS AND LIP PRINTS

    OpenAIRE

    Murugan; Karikalan

    2014-01-01

    BACKGROUND AND OBJECTIVE: The use of conventional methods such as dactylography (study of finger prints) & cheiloscopy (study of lip prints) is of paramount importance, since personal identification by other means such as DNA analysis is sophisticated and not available in rural and developing countries. Fingerprint in its narrow sense is an impression left by the friction ridges of human fingers. The second prints of interest are lip prints. Studies of association between ...

  13. Single-walled carbon nanotube networks for flexible and printed electronics

    International Nuclear Information System (INIS)

    Zaumseil, Jana

    2015-01-01

    Networks of single-walled carbon nanotubes (SWNTs) can be processed from solution and have excellent mechanical properties. They are highly flexible and stretchable. Depending on the type of nanotubes (semiconducting or metallic) they can be used as replacements for metal or transparent conductive oxide electrodes or as semiconducting layers for field-effect transistors (FETs) with high carrier mobilities. They are thus competitive alternatives to other solution-processable materials for flexible and printed electronics. This review introduces the basic properties of SWNTs, current methods for dispersion and separation of metallic and semiconducting SWNTs and techniques to deposit and pattern dense networks from dispersion. Recent examples of applications of carbon nanotubes as conductors and semiconductors in (opto-)electronic devices and integrated circuits will be discussed. (paper)

  14. CERN printing infrastructure

    International Nuclear Information System (INIS)

    Otto, R; Sucik, J

    2008-01-01

    For many years CERN had a very sophisticated print server infrastructure [13] which supported several different protocols (AppleTalk, IPX and TCP/IP) and many different printing standards. Today's situation differs a lot: we have a much more homogenous network infrastructure, where TCP/IP is used everywhere and we have less printer models, which almost all work using current standards (i.e. they all provide PostScript drivers). This change gave us the possibility to review the printing architecture aiming at simplifying the infrastructure in order to achieve full automation of the service. The new infrastructure offers both: LPD service exposing print queues to Linux and Mac OS X computers and native printing for Windows based clients. The printer driver distribution is automatic and native on Windows and automated by custom mechanisms on Linux, where the appropriate Foomatic drivers are configured. Also the process of printer registration and queue creation is completely automated following the printer registration in the network database. At the end of 2006 we have moved all (∼1200) CERN printers and all users' connections at CERN to the new service. This paper will describe the new architecture and summarize the process of migration

  15. Stable proton-conducting Ca-doped LaNbO4 thin electrolyte-based protonic ceramic membrane fuel cells by in situ screen printing

    International Nuclear Information System (INIS)

    Lin Bin; Wang Songlin; Liu Xingqin; Meng Guangyao

    2009-01-01

    In order to develop a simple and cost-effective route to fabricate protonic ceramic membrane fuel cells (PCMFCs), a stable proton-conducting La 0.99 Ca 0.01 NbO 4 (LCN) thin electrolyte was fabricated on a porous NiO-La 0.5 Ce 0.5 O 1.75 (NiO-LDC) anode by in situ screen printing. The key part of this process is to directly print well-mixed ink of La 2 O 3 , CaCO 3 and Nb 2 O 5 instead of pre-synthesized LCN ceramic powder on the anode substrate. After sintering at 1400 deg. C for 5 h, the full dense electrolyte membrane in the thickness of 20 μm was obtained. A single cell was assembled with (La 0.8 Sr 0.2 ) 0.9 MnO 3-δ -La 0.5 Ce 0.5 O 1.75 (LSM-LDC) as cathode and tested with humidified hydrogen as fuel and static air as oxidant. The open circuit voltage (OCV) and maximum power density respectively reached 0.98 V and 65 mW cm -2 at 800 deg. C. Interface resistance of cell under open circuit condition was also investigated.

  16. Ultra-low power integrated circuit design circuits, systems, and applications

    CERN Document Server

    Li, Dongmei; Wang, Zhihua

    2014-01-01

    This book describes the design of CMOS circuits for ultra-low power consumption including analog, radio frequency (RF), and digital signal processing circuits (DSP). The book addresses issues from circuit and system design to production design, and applies the ultra-low power circuits described to systems for digital hearing aids and capsule endoscope devices. Provides a valuable introduction to ultra-low power circuit design, aimed at practicing design engineers; Describes all key building blocks of ultra-low power circuits, from a systems perspective; Applies circuits and systems described to real product examples such as hearing aids and capsule endoscopes.

  17. Making PMT halftone prints

    Energy Technology Data Exchange (ETDEWEB)

    Corey, J.D.

    1977-05-01

    In the printing process for technical reports presently used at Bendix Kansas City Division, photographs are reproduced by pasting up PMT halftone prints on the artwork originals. These originals are used to make positive-working plastic plates for offset lithography. Instructions for making good-quality halftone prints using Eastman Kodak's PMT materials and processes are given in this report. 14 figures.

  18. Radioactive waste management: a bibliography for the integrated data base program

    International Nuclear Information System (INIS)

    Johnson, C.A.

    1981-10-01

    This is the second in a series of literature references compiled on waste generation and treatment, characteristics, inventories, and costs. Documents were collected, abstracted, and indexed into a searchable information file, which was then sorted, indexed, and printed for this bibliography. This volume contains over 200 references to nuclear waste management, the majority of which are 1979-1980 publications. Each reference is categorized by waste origin (commercial, government, institutional, and foreign) and by subject area: (1) high-level waste, (2) low-level waste, (3) transuranic (TRU) waste, (4) airborne waste, (5) Remedial Action Program (formerly utilized sites, surplus facilities, and mill tailings), (6) isolation, (7) transportation, (8) spent fuel, (9) fuel cycle centers, and (10) general, nonspecific waste. Six indexes are provided to assist the user in locating documents of interest: author, author affiliation (corporate authority), subject category, publication descrdissipated across two- fatigue stren obtained

  19. Lithography for enabling advances in integrated circuits and devices.

    Science.gov (United States)

    Garner, C Michael

    2012-08-28

    Because the transistor was fabricated in volume, lithography has enabled the increase in density of devices and integrated circuits. With the invention of the integrated circuit, lithography enabled the integration of higher densities of field-effect transistors through evolutionary applications of optical lithography. In 1994, the semiconductor industry determined that continuing the increase in density transistors was increasingly difficult and required coordinated development of lithography and process capabilities. It established the US National Technology Roadmap for Semiconductors and this was expanded in 1999 to the International Technology Roadmap for Semiconductors to align multiple industries to provide the complex capabilities to continue increasing the density of integrated circuits to nanometre scales. Since the 1960s, lithography has become increasingly complex with the evolution from contact printers, to steppers, pattern reduction technology at i-line, 248 nm and 193 nm wavelengths, which required dramatic improvements of mask-making technology, photolithography printing and alignment capabilities and photoresist capabilities. At the same time, pattern transfer has evolved from wet etching of features, to plasma etch and more complex etching capabilities to fabricate features that are currently 32 nm in high-volume production. To continue increasing the density of devices and interconnects, new pattern transfer technologies will be needed with options for the future including extreme ultraviolet lithography, imprint technology and directed self-assembly. While complementary metal oxide semiconductors will continue to be extended for many years, these advanced pattern transfer technologies may enable development of novel memory and logic technologies based on different physical phenomena in the future to enhance and extend information processing.

  20. Electronic circuit encyclopedia 2

    Energy Technology Data Exchange (ETDEWEB)

    Park, Sun Ho

    1992-10-15

    This book is composed of 15 chapters, which are amplification of weak signal and measurement circuit audio control and power amplification circuit, data transmission and wireless system, forwarding and isolation, signal converting circuit, counter and comparator, discriminator circuit, oscillation circuit and synthesizer, digital and circuit on computer image processing circuit, sensor drive circuit temperature sensor circuit, magnetic control and application circuit, motor driver circuit, measuring instrument and check tool and power control and stability circuit.