Sample records for warpage

  1. Warpage analysis in injection moulding process (United States)

    Hidayah, M. H. N.; Shayfull, Z.; Nasir, S. M.; Fathullah, M.; Hazwan, M. H. M.


    This study was concentrated on the effects of process parameters in plastic injection moulding process towards warpage problem by using Autodesk Moldflow Insight (AMI) software for the simulation. In this study, plastic dispenser of dental floss has been analysed with thermoplastic material of Polypropylene (PP) used as the moulded material and details properties of 80 Tonne Nessei NEX 1000 injection moulding machine also has been used in this study. The variable parameters of the process are packing pressure, packing time, melt temperature and cooling time. Minimization of warpage obtained from the optimization and analysis data from the Design Expert software. Integration of Response Surface Methodology (RSM), Center Composite Design (CCD) with polynomial models that has been obtained from Design of Experiment (DOE) is the method used in this study. The results show that packing pressure is the main factor that will contribute to the formation of warpage in x-axis and y-axis. While in z-axis, the main factor is melt temperature and packing time is the less significant among the four parameters in x, y and z-axes. From optimal processing parameter, the value of warpage in x, y and z-axis have been optimised by 21.60%, 26.45% and 24.53%, respectively.

  2. Analyzing parameters optimisation in minimising warpage on side arm using response surface methodology (RSM) (United States)

    Rayhana, N.; Fathullah, M.; Shayfull, Z.; Nasir, S. M.; Hazwan, M. H. M.


    This paper presents a systematic methodology to analyse the warpage of the side arm part using Autodesk Moldflow Insight software. Response Surface Methodology (RSM) was proposed to optimise the processing parameters that will result in optimal solutions by efficiently minimising the warpage of the side arm part. The variable parameters considered in this study was based on most significant parameters affecting warpage stated by previous researchers, that is melt temperature, mould temperature and packing pressure while adding packing time and cooling time as these is the commonly used parameters by researchers. The results show that warpage was improved by 10.15% and the most significant parameters affecting warpage are packing pressure.

  3. Warpage behavior analysis in package processes of embedded copper substrates

    Directory of Open Access Journals (Sweden)

    Hwang Yeong-Maw


    Full Text Available With the advance of the semiconductor industry and in response to the demands of ultra-thin products, packaging technology has been continuously developed. Thermal bonding process of copper pillar flip chip packages is a new bonding process in packaging technology, especially for substrates with embedded copper trace. During the packaging process, the substrate usually warps because of the heating process. In this paper, a finite element software ANSYS is used to model the embedded copper trace substrate and simulate the thermal and deformation behaviors of the substrate during the heating package process. A fixed geometric configuration equivalent to the real structure is duplicated to make the simulation of the warpage behavior of the substrate feasible. An empirical formula for predicting the warpage displacements is also established.

  4. Optimisation on processing parameters for minimising warpage on side arm using response surface methodology (RSM) and particle swarm optimisation (PSO) (United States)

    Rayhana, N.; Fathullah, M.; Shayfull, Z.; Nasir, S. M.; Hazwan, M. H. M.; Sazli, M.; Yahya, Z. R.


    This study presents the application of optimisation method to reduce the warpage of side arm part. Autodesk Moldflow Insight software was integrated into this study to analyse the warpage. The design of Experiment (DOE) for Response Surface Methodology (RSM) was constructed and by using the equation from RSM, Particle Swarm Optimisation (PSO) was applied. The optimisation method will result in optimised processing parameters with minimum warpage. Mould temperature, melt temperature, packing pressure, packing time and cooling time was selected as the variable parameters. Parameters selection was based on most significant factor affecting warpage stated by previous researchers. The results show that warpage was improved by 28.16% for RSM and 28.17% for PSO. The warpage improvement in PSO from RSM is only by 0.01 %. Thus, the optimisation using RSM is already efficient to give the best combination parameters and optimum warpage value for side arm part. The most significant parameters affecting warpage are packing pressure.

  5. Finite Element Analysis of Warpage in Laminated Aluminium Alloy Plates for Machining of Primary Aeronautic Parts

    International Nuclear Information System (INIS)

    Reis, A. C.; Moreira Filho, L. A.; Menezes, M. A.


    The aim of this paper consists in presenting a method of simulating the warpage in 7xxx series aluminium alloy plates. To perform this simulation finite element software MSC.Patran and MSC.Marc were used. Another result of this analysis will be the influence on material residual stresses induced on the raw material during the rolling process upon the warpage of primary aeronautic parts, fabricated through machining (milling) at Embraer. The method used to determinate the aluminium plate residual stress was Layer Removal Test. The numerical algorithm Modified Flavenot Method was used to convert layer removal and beam deflection in stress level. With such information about the level and profile of residual stresses become possible, during the step that anticipate the manufacturing to incorporate these values in the finite-element approach for modelling warpage parts. Based on that warpage parameter surely the products are manufactured with low relative vulnerability propitiating competitiveness and price

  6. Warpage optimization on a mobile phone case using response surface methodology (RSM) (United States)

    Lee, X. N.; Fathullah, M.; Shayfull, Z.; Nasir, S. M.; Hazwan, M. H. M.; Shazzuan, S.


    Plastic injection moulding is a popular manufacturing method not only it is reliable, but also efficient and cost saving. It able to produce plastic part with detailed features and complex geometry. However, defects in injection moulding process degrades the quality and aesthetic of the injection moulded product. The most common defect occur in the process is warpage. Inappropriate process parameter setting of injection moulding machine is one of the reason that leads to the occurrence of warpage. The aims of this study were to improve the quality of injection moulded part by investigating the optimal parameters in minimizing warpage using Response Surface Methodology (RSM). Subsequent to this, the most significant parameter was identified and recommended parameters setting was compared with the optimized parameter setting using RSM. In this research, the mobile phone case was selected as case study. The mould temperature, melt temperature, packing pressure, packing time and cooling time were selected as variables whereas warpage in y-direction was selected as responses in this research. The simulation was carried out by using Autodesk Moldflow Insight 2012. In addition, the RSM was performed by using Design Expert 7.0. The warpage in y direction recommended by RSM were reduced by 70 %. RSM performed well in solving warpage issue.

  7. Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates

    Directory of Open Access Journals (Sweden)

    Cheolgyu Kim


    Full Text Available This paper presents a warpage analysis method that predicts the warpage behavior of electroplated Cu films on glass fiber-reinforced polymer (GFRP packaging substrates. The analysis method is performed using the following sequence: fabricate specimens for scanning 3D contours, transform 3D data into curvatures, compute the built-in stress of the film using a stress-curvature analytic model, and verify it through comparisons of the finite element method (FEM simulations with the measured data. The curvature is used to describe the deflection and warpage modes and orientations of the specimen. Two primary factors that affect the warpage behavior of the electroplated Cu film on FRP substrate specimens are investigated. The first factor is the built-in stress in a Cu film that explains the room temperature warpage of the specimen under no thermal process. The second factor is the misfit of the coefficient of thermal expansion (CTE between the Cu and FRP layer, which is a dominant factor during the temperature change. The calculated residual stress, and predicted curvatures using FEM simulation throughout the reflow process temperature range between 25 and 180 °C are proven to be accurate by the comparison of the FEM simulations and experiment measurements.

  8. Warpage investigation on side arms using response surface methodology (RSM) and glow-worm swarm optimizations (GSO) (United States)

    Sow, C. K.; Fathullah, M.; Nasir, S. M.; Shayfull, Z.; Shazzuan, S.


    This paper discusses on an analysis run via injection moulding process in determination of the optimum processing parameters used for manufacturing side arms of catheters in minimizing the warpage issues. The optimization method used was RSM. Moreover, in this research tries to find the most significant factor affecting the warpage. From the previous literature review,4 most significant parameters on warpage defect was selected. Those parameters were melt temperature, packing time, packing pressure, mould temperature and cooling time. At the beginning, side arm was drawn using software of CATIA V5. Then, software Mouldflow and Design Expert were employed to analyses on the popular warpage issues. After that, GSO artificial intelligence was apply using the mathematical model from Design Expert for more optimization on RSM result. Recommended parameter settings from the simulation work were then compared with the optimization work of RSM and GSO. The result show that the warpage on the side arm was improved by 3.27 %

  9. Experimental evaluation and simulation of volumetric shrinkage and warpage on polymeric composite reinforced with short natural fibers (United States)

    Santos, Jonnathan D.; Fajardo, Jorge I.; Cuji, Alvaro R.; García, Jaime A.; Garzón, Luis E.; López, Luis M.


    A polymeric natural fiber-reinforced composite is developed by extrusion and injection molding process. The shrinkage and warpage of high-density polyethylene reinforced with short natural fibers of Guadua angustifolia Kunth are analyzed by experimental measurements and computer simulations. Autodesk Moldflow® and Solid Works® are employed to simulate both volumetric shrinkage and warpage of injected parts at different configurations: 0 wt.%, 20 wt.%, 30 wt.% and 40 wt.% reinforcing on shrinkage and warpage behavior of polymer composite. Become evident the restrictive effect of reinforcing on the volumetric shrinkage and warpage of injected parts. The results indicate that volumetric shrinkage of natural composite is reduced up to 58% with fiber increasing, whereas the warpage shows a reduction form 79% to 86% with major fiber content. These results suggest that it is a highly beneficial use of natural fibers to improve the assembly properties of polymeric natural fiber-reinforced composites.

  10. Optimisation of warpage on thin shell plastic part using response surface methodology (RSM) and glowworm swarm optimisation (GSO) (United States)

    Asyirah, B. N.; Shayfull, Z.; Nasir, S. M.; Fathullah, M.; Hazwan, M. H. M.


    In manufacturing a variety of parts, plastic injection moulding is widely use. The injection moulding process parameters have played important role that affects the product's quality and productivity. There are many approaches in minimising the warpage ans shrinkage such as artificial neural network, genetic algorithm, glowworm swarm optimisation and hybrid approaches are addressed. In this paper, a systematic methodology for determining a warpage and shrinkage in injection moulding process especially in thin shell plastic parts are presented. To identify the effects of the machining parameters on the warpage and shrinkage value, response surface methodology is applied. In thos study, a part of electronic night lamp are chosen as the model. Firstly, experimental design were used to determine the injection parameters on warpage for different thickness value. The software used to analyse the warpage is Autodesk Moldflow Insight (AMI) 2012.

  11. The effect of mandrel configuration on the warpage in pultrusion of rectangular hollow profiles

    DEFF Research Database (Denmark)

    Baran, Ismet; Hattel, Jesper Henri; Akkerman, Remko


    pultrusion company. In addition, the predicted warpage behaviour is further analysed by adjusting the mandrel length as well as including the mandrel heating. Using the proposed process model, the effect of the mandrel configurations on the quality of the pultrusion is investigated in terms of temperature......, degree of cure and distortions.These unwanted residual distortions may lead to not meeting the desired geometrical tolerances e.g. warpage of pultruded window frames and hollow profiles as well as spring-in of L-shaped profiles, etc....

  12. Warpage improvement on wheel caster by optimizing the process parameters using genetic algorithm (GA) (United States)

    Safuan, N. S.; Fathullah, M.; Shayfull, Z.; Nasir, S. M.; Hazwan, M. H. M.


    In injection moulding process, the defects will always encountered and affected the final product shape and functionality. This study is concerning on minimizing warpage and optimizing the process parameter of injection moulding part. Apart from eliminating product wastes, this project also giving out best recommended parameters setting. This research studied on five parameters. The optimization showed that warpage have been improved 42.64% from 0.6524 mm to 0.30879 mm in Autodesk Moldflow Insight (AMI) simulation result and Genetic Algorithm (GA) respectively.

  13. Warpage analysis on thin shell part using response surface methodology (RSM) (United States)

    Zulhasif, Z.; Shayfull, Z.; Nasir, S. M.; Fathullah, M.; Hazwan, M. H. M.


    The optimisation of moulding parameters appropriate to reduce warpage defects produce using Autodesk Moldflow Insight (AMI) 2012 software The product is injected by using Acrylonitrile-Butadiene-Styrene (ABS) materials. This analysis has processing parameter that varies in melting temperature, mould temperature, packing pressure and packing time. Design of Experiments (DOE) has been integrated to obtain a polynomial model using Response Surface Methodology (RSM). The Glowworm Swarm Optimisation (GSO) method is used to predict a best combination parameters to minimise warpage defect in order to produce high quality parts.

  14. Warpage of QFN Package in Post Mold Cure Process of integrated circuit packaging (United States)

    Sriwithoon, Nattha; Ugsornrat, Kessararat; Srisuwitthanon, Warayoot; Thonglor, Panakamon


    This research studied about warpage of QFN package in post mold cure process of integrated circuit (IC) packages using pre-plated (PPF) leadframe. For IC package, epoxy molding compound (EMC) are molded by cross linking of compound stiffness but incomplete crosslinked network and leading the fully cured thermoset by post mold cure (PMC) process. The cure temperature of PMC can change microstructure of EMC in term of stress inside the package and effect to warpage of the package due to coefficient of thermal expansion (CTE) between EMC and leadframe. In experiment, cure temperatures were varied to check the effect of internal stress due to different cure temperature after completed post mold cure for TDFN 2×3 8L. The cure temperature were varied with 180 °C, 170 °C, 160 °C, and 150°C with cure time 4 and 6 hours, respectively. For analysis, the TDFN 2×3 8L packages were analyzed the warpage by thickness gauge and scanning acoustic microscope (SAM) after take the test samples out from the oven cure. The results confirmed that effect of different CTE between EMC and leadframe due to different cure temperature resulting to warpage of the TDFN 2×3 8L packages.

  15. Deploying response surface methodology (RSM) and glowworm swarm optimization (GSO) in optimizing warpage on a mobile phone cover (United States)

    Lee, X. N.; Fathullah, M.; Shayfull, Z.; Nasir, S. M.; Hazwan, M. H. M.; Shazzuan, S.


    Plastic injection moulding is a popular manufacturing method not only it is reliable, but also efficient and cost saving. It able to produce plastic part with detailed features and complex geometry. However, defects in injection moulding process degrades the quality and aesthetic of the injection moulded product. The most common defect occur in the process is warpage. Inappropriate process parameter setting of injection moulding machine is one of the reason that leads to the occurrence of warpage. The aims of this study were to improve the quality of injection moulded part by investigating the optimal parameters in minimizing warpage using Response Surface Methodology (RSM) and Glowworm Swarm Optimization (GSO). Subsequent to this, the most significant parameter was identified and recommended parameters setting was compared with the optimized parameter setting using RSM and GSO. In this research, the mobile phone case was selected as case study. The mould temperature, melt temperature, packing pressure, packing time and cooling time were selected as variables whereas warpage in y-direction was selected as responses in this research. The simulation was carried out by using Autodesk Moldflow Insight 2012. In addition, the RSM was performed by using Design Expert 7.0 whereas the GSO was utilized by using MATLAB. The warpage in y direction recommended by RSM were reduced by 70 %. The warpages recommended by GSO were decreased by 61 % in y direction. The resulting warpages under optimal parameter setting by RSM and GSO were validated by simulation in AMI 2012. RSM performed better than GSO in solving warpage issue.

  16. Analysis of Cavity Pressure and Warpage of Polyoxymethylene Thin Walled Injection Molded Parts: Experiments and Simulations

    DEFF Research Database (Denmark)

    Guerrier, Patrick; Tosello, Guido; Hattel, Jesper Henri


    Process analysis and simulations on molding experiments of 3D thin shell parts have been conducted. Moldings were carried out with polyoxymethylene (POM). The moldings were performed with cavity pressure sensors in order to compare experimental process results with simulations. The warpage...... was characterized by measuring distances using a tactile coordinate measuring machine (CMM). Molding simulations have been executed taking into account actual processing conditions. Various aspects have been considered in the simulation: machine barrel geometry, injection speed profiles, cavity injection pressure......, melt and mold temperatures, material rheological and pvT characterization. Factors investigated for comparisons were: injection pressure profile, short shots length, flow pattern, and warpage. A reliable molding experimental database was obtained, accurate simulations were conducted and a number...

  17. Application of response surface methodology (RSM) and genetic algorithm in minimizing warpage on side arm (United States)

    Raimee, N. A.; Fathullah, M.; Shayfull, Z.; Nasir, S. M.; Hazwan, M. H. M.


    The plastic injection moulding process produces large numbers of parts of high quality with great accuracy and quickly. It has widely used for production of plastic part with various shapes and geometries. Side arm is one of the product using injection moulding to manufacture it. However, there are some difficulties in adjusting the parameter variables which are mould temperature, melt temperature, packing pressure, packing time and cooling time as there are warpage happen at the tip part of side arm. Therefore, the work reported herein is about minimizing warpage on side arm product by optimizing the process parameter using Response Surface Methodology (RSM) and with additional artificial intelligence (AI) method which is Genetic Algorithm (GA).

  18. Predicting shrinkage and warpage in injection molding: Towards automatized mold design (United States)

    Zwicke, Florian; Behr, Marek; Elgeti, Stefanie


    It is an inevitable part of any plastics molding process that the material undergoes some shrinkage during solidification. Mainly due to unavoidable inhomogeneities in the cooling process, the overall shrinkage cannot be assumed as homogeneous in all volumetric directions. The direct consequence is warpage. The accurate prediction of such shrinkage and warpage effects has been the subject of a considerable amount of research, but it is important to note that this behavior depends greatly on the type of material that is used as well as the process details. Without limiting ourselves to any specific properties of certain materials or process designs, we aim to develop a method for the automatized design of a mold cavity that will produce correctly shaped moldings after solidification. Essentially, this can be stated as a shape optimization problem, where the cavity shape is optimized to fulfill some objective function that measures defects in the molding shape. In order to be able to develop and evaluate such a method, we first require simulation methods for the diffierent steps involved in the injection molding process that can represent the phenomena responsible for shrinkage and warpage ina sufficiently accurate manner. As a starting point, we consider the solidification of purely amorphous materials. In this case, the material slowly transitions from fluid-like to solid-like behavior as it cools down. This behavior is modeled using adjusted viscoelastic material models. Once the material has passed a certain temperature threshold during cooling, any viscous effects are neglected and the behavior is assumed to be fully elastic. Non-linear elastic laws are used to predict shrinkage and warpage that occur after this point. We will present the current state of these simulation methods and show some first approaches towards optimizing the mold cavity shape based on these methods.

  19. Application of Soft Computing for the Prediction of Warpage of Plastic Injection

    Directory of Open Access Journals (Sweden)

    Vijaya Kumar Reddy


    Full Text Available This paper deals with the development of accurate warpage prediction model for plastic injection molded parts using softcomputing tools namely, artificial neural networks and support vector machines. For training, validating and testing of thewarpage model, a number of MoldFlow (FE analyses have been carried out using Taguchi’s orthogonal array in the designof experimental technique by considering the process parameters such as mold temperature, melt temperature, packing pressure,packing time and cooling time. The warpage values were found by analyses which were done by MoldFlow PlasticInsight (MPI 5.0 software. The artificial neural network model and support vector machine regression model have beendeveloped using conjugate gradient learning algorithm and ANOVA kernel function respectively. The adequacy of the developedmodels is verified by using coefficient of determination. To judge the ability and efficiency of the models to predictthe warpage values absolute relative error has been used. The finite element results show, artificial neural network modelpredicts with high accuracy compared with support vector machine model.

  20. Numerical Analysis of Warpage Induced by Thermo-Compression Bonding Process of Cu Pillar Bump Flip Chip Package

    Energy Technology Data Exchange (ETDEWEB)

    Kwon, Oh Young; Jung, Hoon Sun; Lee, Jung Hoon; Choa, Sung-Hoon [Seoul Nat’l Univ. of Science and Technology, Seoul (Korea, Republic of)


    In flip chip technology, the conventional solder bump has been replaced with a copper (Cu) pillar bump owing to its higher input/output (I/O) density, finer pitch, and higher reliability. However, Cu pillar bump technology faces several issues, such as interconnect shorting and higher low-k stress due to stiffer Cu pillar structure when the conventional reflow process is used. Therefore, the thermal compression bonding (TCB) process has been adopted in the flip chip attachment process in order to reduce the package warpage and stress. In this study, we investigated the package warpage induced during the TCB process using a numerical analysis. The warpage of the TCB process was compared with that of the reflow process.

  1. Optimisation of warpage on plastic injection moulding part using response surface methodology (RSM) and genetic algorithm method (GA) (United States)

    Miza, A. T. N. A.; Shayfull, Z.; Nasir, S. M.; Fathullah, M.; Hazwan, M. H. M.


    In this study, Computer Aided Engineering was used for injection moulding simulation. The method of Design of experiment (DOE) was utilize according to the Latin Square orthogonal array. The relationship between the injection moulding parameters and warpage were identify based on the experimental data that used. Response Surface Methodology (RSM) was used as to validate the model accuracy. Then, the RSM and GA method were combine as to examine the optimum injection moulding process parameter. Therefore the optimisation of injection moulding is largely improve and the result shown an increasing accuracy and also reliability. The propose method by combining RSM and GA method also contribute in minimising the warpage from occur.

  2. Warpage Characteristics and Process Development of Through Silicon Via-Less Interconnection Technology. (United States)

    Shen, Wen-Wei; Lin, Yu-Min; Wu, Sheng-Tsai; Lee, Chia-Hsin; Huang, Shin-Yi; Chang, Hsiang-Hung; Chang, Tao-Chih; Chen, Kuan-Neng


    In this study, through silicon via (TSV)-less interconnection using the fan-out wafer-level-packaging (FO-WLP) technology and a novel redistribution layer (RDL)-first wafer level packaging are investigated. Since warpage of molded wafer is a critical issue and needs to be optimized for process integration, the evaluation of the warpage issue on a 12-inch wafer using finite element analysis (FEA) at various parameters is presented. Related parameters include geometric dimension (such as chip size, chip number, chip thickness, and mold thickness), materials' selection and structure optimization. The effect of glass carriers with various coefficients of thermal expansion (CTE) is also discussed. Chips are bonded onto a 12-inch reconstituted wafer, which includes 2 RDL layers, 3 passivation layers, and micro bumps, followed by using epoxy molding compound process. Furthermore, an optical surface inspector is adopted to measure the surface profile and the results are compared with the results from simulation. In order to examine the quality of the TSV-less interconnection structure, electrical measurement is conducted and the respective results are presented.

  3. Warpage optimisation on the moulded part with straight-drilled and conformal cooling channels using response surface methodology (RSM) and glowworm swarm optimisation (GSO) (United States)

    Hazwan, M. H. M.; Shayfull, Z.; Sharif, S.; Nasir, S. M.; Zainal, N.


    In injection moulding process, quality and productivity are notably important and must be controlled for each product type produced. Quality is measured as the extent of warpage of moulded parts while productivity is measured as a duration of moulding cycle time. To control the quality, many researchers have introduced various of optimisation approaches which have been proven enhanced the quality of the moulded part produced. In order to improve the productivity of injection moulding process, some of researches have proposed the application of conformal cooling channels which have been proven reduced the duration of moulding cycle time. Therefore, this paper presents an application of alternative optimisation approach which is Response Surface Methodology (RSM) with Glowworm Swarm Optimisation (GSO) on the moulded part with straight-drilled and conformal cooling channels mould. This study examined the warpage condition of the moulded parts before and after optimisation work applied for both cooling channels. A front panel housing have been selected as a specimen and the performance of proposed optimisation approach have been analysed on the conventional straight-drilled cooling channels compared to the Milled Groove Square Shape (MGSS) conformal cooling channels by simulation analysis using Autodesk Moldflow Insight (AMI) 2013. Based on the results, melt temperature is the most significant factor contribute to the warpage condition and warpage have optimised by 39.1% after optimisation for straight-drilled cooling channels and cooling time is the most significant factor contribute to the warpage condition and warpage have optimised by 38.7% after optimisation for MGSS conformal cooling channels. In addition, the finding shows that the application of optimisation work on the conformal cooling channels offers the better quality and productivity of the moulded part produced.

  4. Simulation of warpage induced by non-isothermal crystallization of co-polypropylene during the SLS process (United States)

    Amado, Antonio; Schmid, Manfred; Wegener, Konrad


    Polymer processing using Additive Manufacturing Technologies (AM) has experienced a remarkable growth during the last years. The application range has been expanding rapidly, particularly driven by the so-called consumer 3D printing sector. However, for applications demanding higher requirements in terms of thermo-mechanical properties and dimensional accuracy the long established AM technologies such as Selective Laser Sintering (SLS) do not depict a comparable development. The higher process complexity hinders the number of materials that can be currently processed and the interactions between the different physics involved have not been fully investigated. In case of thermoplastic materials the crystallization kinetics coupled to the shrinkage strain development strongly influences the stability of the process. Thus, the current investigation presents a transient Finite Element simulation of the warpage effect during the SLS process of a new developed polyolefin (co-polypropylene) coupling the thermal, mechanical and phase change equations that control the process. A thermal characterization of the material was performed by means of DSC, integrating the Nakamura model with the classical Hoffmann-Lauritzen theory. The viscoelastic behavior was measured using a plate-plate rheometer at different degrees of undercooling and a phase change-temperature superposition principle was implemented. Additionally, for validation porpoises the warpage development of the first sintered layers was captured employing an optical device. The simulation results depict a good agreement with experimental measurements of deformation, describing the high sensitivity of the geometrical accuracy of the sintered parts related to the processing conditions.

  5. Differentiation of mild keratoconus from corneal warpage according to topographic inferior steepening based on corneal tomography data

    Directory of Open Access Journals (Sweden)

    Lia Florim Patrão

    Full Text Available ABSTRACT We report two cases of suspicious asymmetric bow tie and inferior steepening on topographic evaluations with reflection (Placido and projection (Scheimpflug. Rotating Scheimpflug corneal and anterior segment tomography (Oculus Pentacam HR, Wetzlar, Germany® was performed in the first case, with a maximal keratometric value (Kmax of 43.2 D and an overall deviation value from the Belin/Ambrósio Enhanced Ectasia Display (BAD-D of 1.76, which was observed in the study eye (OD. BAD-D was 6.59 in the fellow eye, which had clinical findings that were consistent with keratoconus stage 2. The second case presented with a Kmax of 45.3 D and BAD-D of 0.76 in OD and 1.01 in OS. This patient had discontinued wearing soft contact lens less than 1 day prior to examination. Corneal tomographic data enabled us to distinguish mild or forme fruste keratoconus from contact lens-induced corneal warpage, and similar findings were observed on curvature maps.

  6. Investigation of process induced warpage for pultrusion of a rectangular hollow profile

    DEFF Research Database (Denmark)

    Baran, Ismet; Hattel, Jesper Henri; Akkerman, Remko


    A novel thermo-chemical–mechanical analysis of the pultrusion process is presented. A process simulation is performed for an industrially pultruded rectangular hollow profile containing both unidirectional (UD) roving and continuous filament mat (CFM) layers. The reinforcements are impregnated...

  7. Homogenization on Multi-Materials’ Elements: Application to Printed Circuit Boards and Warpage Analysis

    Directory of Open Access Journals (Sweden)

    Araújo Manuel


    Full Text Available Multi-material domains are often found in industrial applications. Modelling them can be computationally very expensive due to meshing requirements. The finite element properties comprising different materials are hardly accurate. In this work, a new homogenization method that simplifies the computation of the homogenized Young modulus, Poisson ratio and thermal expansion coefficient is proposed, and applied to composite-like material on a printed circuit board. The results show a good properties correspondence between the homogenized domain and the real geometry simulation.

  8. The Effect of Mandrel Configuration on the Warpage in Pultrusion of Rectangular Hollow Profiles

    NARCIS (Netherlands)

    Baran, Ismet; Hattel, Jesper H.; Akkerman, Remko


    Thermo-mechanical process simulation of an industrially pultruded rectangular hollow profile is presented. Glass/polyester is used for the continuous filament mat (CFM) and the uni-directional (UD) layers. The process induced residual distortions together with the temperature and degree of cure are

  9. Warpage analysis on thin shell part using glowworm swarm optimisation (GSO) (United States)

    Zulhasif, Z.; Shayfull, Z.; Nasir, S. M.; Fathullah, M.; Hazwan, M. H. M.


    The Autodesk Moldflow Insight (AMI) software was used in this study to focuses on the analysis in plastic injection moulding process associate the input parameter and output parameter. The material used in this study is Acrylonitrile Butadiene Styrene (ABS) as the moulded material to produced the plastic part. The MATLAB sortware is a method was used to find the best setting parameter. The variables was selected in this study were melt temperature, packing pressure, coolant temperature and cooling time.

  10. 49 CFR 180.352 - Requirements for retest and inspection of IBCs. (United States)


    ... qualification tests. The IBC must be externally inspected for cracks, warpage, corrosion or any other damage... IBC must be internally inspected for cracks, warpage, and corrosion or any other defect that might.... Inner protrusions which could puncture or abrade the liner must be covered. (d) Requirements applicable...

  11. Optimisation of process parameters on thin shell part using response surface methodology (RSM) (United States)

    Faiz, J. M.; Shayfull, Z.; Nasir, S. M.; Fathullah, M.; Rashidi, M. M.


    This study is carried out to focus on optimisation of process parameters by simulation using Autodesk Moldflow Insight (AMI) software. The process parameters are taken as the input in order to analyse the warpage value which is the output in this study. There are some significant parameters that have been used which are melt temperature, mould temperature, packing pressure, and cooling time. A plastic part made of Polypropylene (PP) has been selected as the study part. Optimisation of process parameters is applied in Design Expert software with the aim to minimise the obtained warpage value. Response Surface Methodology (RSM) has been applied in this study together with Analysis of Variance (ANOVA) in order to investigate the interactions between parameters that are significant to the warpage value. Thus, the optimised warpage value can be obtained using the model designed using RSM due to its minimum error value. This study comes out with the warpage value improved by using RSM.

  12. Effect of Stacking Layup on Spring-back Deformation of Symmetrical Flat Laminate Composites Manufactured through Autoclave Processing (United States)

    Nasir, M. N. M.; Seman, M. A.; Mezeix, L.; Aminanda, Y.; Rivai, A.; Ali, K. M.


    The residual stresses that develop within fibre-reinforced laminate composites during autoclave processing lead to dimensional warpage known as spring-back deformation. A number of experiments have been conducted on flat laminate composites with unidirectional fibre orientation to examine the effects of both the intrinsic and extrinsic parameters on the warpage. This paper extends the study on to the symmetrical layup effect on spring-back for flat laminate composites. Plies stacked at various symmetrical sequences were fabricated to observe the severity of the resulting warpage. Essentially, the experimental results demonstrated that the symmetrical layups reduce the laminate stiffness in its principal direction compared to the unidirectional laminate thus, raising the spring-back warpage with the exception of the [45/-45]S layup due to its quasi-isotropic property.

  13. Optimisation of process parameters on thin shell part using response surface methodology (RSM) and genetic algorithm (GA) (United States)

    Faiz, J. M.; Shayfull, Z.; Nasir, S. M.; Fathullah, M.; Hazwan, M. H. M.


    This study conducts the simulation on optimisation of injection moulding process parameters using Autodesk Moldflow Insight (AMI) software. This study has applied some process parameters which are melt temperature, mould temperature, packing pressure, and cooling time in order to analyse the warpage value of the part. Besides, a part has been selected to be studied which made of Polypropylene (PP). The combination of the process parameters is analysed using Analysis of Variance (ANOVA) and the optimised value is obtained using Response Surface Methodology (RSM). The RSM as well as Genetic Algorithm are applied in Design Expert software in order to minimise the warpage value. The outcome of this study shows that the warpage value improved by using RSM and GA.

  14. Injection Moulding Simulation and Experimental Validation of Hearing Aid Shells

    DEFF Research Database (Denmark)

    Islam, Aminul; Li, Xiaoliu

    and warpage were taken as the main comparison criteria. Different parameter settings in Moldex3D were investigated to find their influence on the accuracy of the simulation. Results showed that the injection molding process prediction from the simulation was relatively precise when the nozzle geometry...

  15. Thermo-mechanical analysis of the pressure plate of clutch

    Directory of Open Access Journals (Sweden)

    P.V.N. Venkata Mallikarjuna


    Full Text Available High Temperature appears in the contact surfaces of a clutch system (friction surface and pressure plate due to the relative motion between these parts during the sliding period. These high temperatures are responsible for several failures such as pressure plate crack, pressure plate warpage etc. With the help of Finite element analysis, the sliding friction process of the pressure plate and friction during clutch engagement is simulated to get temperature field characteristics and contact pressure of pressure plate.

  16. Metamodel-based design optimization of injection molding process variables and gates of an automotive glove box for enhancing its quality

    International Nuclear Information System (INIS)

    Kang, Gyung Ju; Park, Chang Hyun; Choi, Dong Hoon


    Injection molding process variables and gates of an automotive glove box were optimally determined to enhance its injection molding quality. We minimized warpage with satisfying constraints on clamp force, weldline, and profiles of filling and packing. Design variables concerning the injection molding process are temperatures of the mold and the resin, ram speeds, and packing pressures and durations; design variables concerning the gates are the shape of the center gate and locations of two side gates. To optimally determine the design variables in an efficient way, we adopted metamodel-based design optimization, sequentially using an optimal Latin hypercube design as a design of experiment, Kriging models as metamodels that replace time-consuming injection molding simulations, and a micro genetic algorithm as an optimization algorithm. In the optimization process, a commercial injection molding analysis software, MoldflowTM, was employed to evaluate the injection molding quality at design points specified. Using the proposed design approach, the warpage was found reduced by 20.5% compared to the initial warpage, while all the design constraints were satisfied, which clearly shows the validity of the proposed design approach

  17. Metamodel-based design optimization of injection molding process variables and gates of an automotive glove box for enhancing its quality

    Energy Technology Data Exchange (ETDEWEB)

    Kang, Gyung Ju [Pusan National University, Busan (Korea, Republic of); Park, Chang Hyun; Choi, Dong Hoon [Hanyang University, Seoul (Korea, Republic of)


    Injection molding process variables and gates of an automotive glove box were optimally determined to enhance its injection molding quality. We minimized warpage with satisfying constraints on clamp force, weldline, and profiles of filling and packing. Design variables concerning the injection molding process are temperatures of the mold and the resin, ram speeds, and packing pressures and durations; design variables concerning the gates are the shape of the center gate and locations of two side gates. To optimally determine the design variables in an efficient way, we adopted metamodel-based design optimization, sequentially using an optimal Latin hypercube design as a design of experiment, Kriging models as metamodels that replace time-consuming injection molding simulations, and a micro genetic algorithm as an optimization algorithm. In the optimization process, a commercial injection molding analysis software, MoldflowTM, was employed to evaluate the injection molding quality at design points specified. Using the proposed design approach, the warpage was found reduced by 20.5% compared to the initial warpage, while all the design constraints were satisfied, which clearly shows the validity of the proposed design approach.

  18. Selection and application of C18200 chrome copper for the OHTE confinement test helical coil

    International Nuclear Information System (INIS)

    Puhn, F.A.; Graumann, D.W.


    The selection and qualification of copper for the OHTE confinement test helical coil (H-coil) was a crucial step in the success of this new experiment. Previous problems encountered at General Atomic Company with close tolerance machined parts made from high strength copper were identified. The design criteria included selecting a material with minimal warpage during machining, an electrical conductivity >80% IACS, and a yield strength of at least 241 Mpa (35 ksi). The investigation of candidate materials and testing samples led to selection of a material that fully met all requirements. The C18200 chrome copper forged plates were supplied by the Ampco Metal Division of Ampco-Pittsburgh Corporation

  19. Food packing optimization (United States)

    The development of a universal closure lid for the space shuttle food package is reported. The revised lid needs a folded configuration which, when unfolded, fully conforms to the interior surfaces of the food cup. Experimental thermoform molds were fabricated and test lids formed. The lid material not in contact with the food conformed to the cup interior without wrinkles, permitting full nesting of the cups. The final lid design was established and thermoform tooling designed and fabricated. Lids formed on these molds were tested for strength. The heating elements were replaced and repositioned to eliminate any hot spots which may cause warpage.

  20. Material quality development during the automated tow placement process (United States)

    Tierney, John Joseph

    Automated tow placement (ATP) of thermoplastic composites builds on the existing industrial base for equipment, robotics and kinematic placement of material with the aim of further cost reduction by eliminating the autoclave entirely. During ATP processing, thermoplastic composite tows are deposited on a preconsolidated substrate at rates ranging from 10--100mm/s and consolidated using the localized application of heat and pressure by a tow placement head mounted on a robot. The process is highly non-isothermal subjecting the material to multiple heating and cooling rates approaching 1000°C/sec. The requirement for the ATP process is to achieve the same quality in seconds (low void content, full translation of mechanical properties and degree of bonding and minimal warpage) as the autoclave process achieves in hours. The scientific challenge was to first understand and then model the relationships between processing, material response, microstructure and quality. The important phenomena affecting quality investigated in this study include a steady state heat transfer simulation, consolidation and deconsolidation (void dynamics), intimate contact and polymer interdiffusion (degree of bonding/mechanical properties) and residual stress and warpage (crystallization and viscoelastic response). A fundamental understanding of the role of materials related to these mechanisms and their relationship to final quality is developed and applied towards a method of process control and optimization.

  1. Fiscal 1998 New Sunshine Program achievement report. Development for practical application of photovoltaic system - Development of thin-film solar cell manufacturing technology (Development of low-cost large-area module manufacturing technology - Development of next-generation thin-film solar cell manufacturing technology - Development of thin-film polycrystalline solar cell module manufacturing technology); 1998 nendo taiyoko hatsuden system jitsuyoka gijutsu kaihatsu seika hokokusho. Usumaku taiyo denchi no seizo gijutsu kaihatsu / tei cost daimenseki module seizo gijutsu kaihatsu / jisedai usumaku taiyo denchi no seizo gijutsu kaihatsu (usumaku takessho taiyo denchi module no seizo gijutsu kaihatsu)

    Energy Technology Data Exchange (ETDEWEB)



    The aim is to realize the practical application of the above-named solar module expected to exhibit higher efficiency and reliability and achieve cost reduction through consumption of less materials. In fiscal 1998, 1) technologies were developed to reduce substrate warpage during recrystallization for the higher-throughput fabrication of high-quality thin films and 2) technologies were also developed for the realization of higher-throughput fabrication of thin films and for efficiency improvement for thin-film modules. Under item 1), experiments were conducted by simulation for reducing warpage to occur in thin-film polycrystalline Si substrates during fabrication by melting and recrystallization. Under item 2), for the development of thin-film cell high-throughput technologies, studies were started on a more practical hydrogen plasma process to challenge the conventional process of crystal defect inactivation by hydrogen ion injection with which achievement of high throughputs is difficult. For the development of technologies for the enhancement of thin-film module efficiency, efforts were exerted to realize a 10cm times 10cm square shape for the enhancement of efficiency in the process of filling modules with cells. These efforts achieved a great step toward future practical application. (NEDO)

  2. Modelling and analysis of the stress distribution in a multi-thin film system Pt/USG/Si (United States)

    Yao, W. Z.; Roqueta, F.; Craveur, J. C.; Belhenini, S.; Gardes, P.; Tougui, A.


    Residual stress analysis is commonly achieved through curvature measurement with the help of Stoney’s formula. However, this conventional approach is inadequate for multi-layer thin film systems, which are widely used in today’s microelectronics. Also, for the thin film case, the residual stress is composed of thermal stress and intrinsic stress. Measuring the wafer curvature at room temperature provides a value for the average stresses in the layer, the two components cannot be distinguished by the existing methodologies of curvature measurement. To alleviate these problems, a modified curvature method combining finite element (FE) modelling is proposed to study the stress distribution in a Pt/USG/Si structure. A 2D FE model is firstly built in order to calculate the thermal stress in the multilayer structure, the obtained thermal stresses in respective films are verified by an analytical model. Then, we calculate the warpage of the multilayer structure by considering the intrinsic stress in the respective films. The residual stresses in the films are determined by minimizing the difference between the simulated warpage and that of experimental measurement. The proposed approach can be used to calculate not only the average residual stress but also thermal and intrinsic stress components in the USG and Platinum films. The obtained residual and intrinsic stresses from a numerical model are compared with the values of other studies. There is no limitation for the application of our methodologies regarding the number of the layers in the stack.

  3. A review on solder reflow and flux application for flip chip (United States)

    Suppiah, Sarveshvaran; Ong, Nestor Rubio; Sauli, Zaliman; Sarukunaselan, Karunavani; Alcain, Jesselyn Barro; Visvanathan, Susthitha Menon; Retnasamy, Vithyacharan


    This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

  4. A chemical heat pump based on the reaction of calcium chloride and methanol for solar heating, cooling and storage (United States)

    Offenhartz, P. O.


    An engineering development test prototype of the CaCl2-CheOH chemical heat pump was tested. The unit, which has storage capacity in excess of 100,000 BTU, completed over 100 full charge-discharge cycles. Cycling data show that the rate of heat pumping depends strongly on the absorber-evaporator temperature difference. These rates are more than adequate for solar heating or for solar cooling using dry ambient air heat rejection. Performance degradation after 100 cycles, expressed as a contact resistance, was less than 2 C. The heat exchangers showed some warpage due to plastic flow of the salt, producing the contact resistance. The experimental COP for cooling was 0.52, close to the theoretically predicted value.

  5. The effect of internal mould water spray cooling on rotationally moulded polyethylene parts (United States)

    McCourt, Mark P.; Kearns, Mark P.; Martin, Peter J.


    The conventional method of cooling during the rotational moulding process is through the use of forced air. During the cooling phase of a typical rotomoulding cycle, large volumes of high velocity room temperature air are forced across the outside of the rotating rotomoulding tool to encourage cooling of the metal mould and molten polymer. Since no cooling is applied to the inside of the mould, the inner surface of the polymer (polyethylene) cools more slowly and will have a tendency to be more crystalline and the polyethylene will have a higher density in this region. The side that cools more quickly (in contact with the inside mould wall) will be less crystalline, and will therefore have a lower density. The major consequence of this difference in crystallinity will be a buildup of internal stresses producing warpage and excessive shrinkage of the part with subsequent increased levels of scrap. Therefore excessive cooling on the outside of the mould should be avoided. One consequence of this effect is that the cooling time for a standard rotationally moulded part can be quite long and this has an effect on the overall economics of the process in terms of part manufacture. A number of devices are currently on the market to enhance the cooling of rotational moulding by introducing a water spray to the inside of the rotomoulding during cooling. This paper reports on one such device 'Rotocooler' which during a series of initial industrial trials has been shown to reduce the cycletime by approximately 12 to 16%, with minimal effect on the mechanical properties, leading to a part which has less warpage and shrinkage than a conventionally cooled part.

  6. Resultados topográficos en pacientes portadores de lentes de contacto Topographic results achieved patients wearing contact lens

    Directory of Open Access Journals (Sweden)

    Tania Aymeé Díaz Martínez


    results achieved in patients wearing contact lens, who were candidates to refractive surgery with Excimer laser at "Carlos J. Finlay" hospital; to determine the behaviour according to age and sex; to find out the type of contact lens used and the length of wear; and to identify the relationship of the induced corneal topographic pattern in contact lens wearers with corneal warpage and ketatoconus. METHODS: A retrospective study of the corneal topography of candidates to refractive surgery in the last 2 years was performed in 80 patients (contact lens wearers. OPTIKON AMF510P and HUMPHREY topographers were the instruments to screen the patients. All of them were performed a complete ophthalmological exam (manifest refraction, biomicroscopy, keratometry, pachymetry and corneal topography. Results and their stability were compared. Also age, sex, type of lenses and length of wear were analyzed. RESULTS: One hundred and fifty eight eyes were treated, 83 of them presented with normal topographic pattern whereas 58 had contact lens-induced corneal warpage and 17 suffered keratoconus. The average age of patients was 27 years. Mean corneal astigmatism in patients with keratoconus was -3.25 D and in patients with corneal warpage -1.12 D. The reading of the most even meridian in patients with keratocomus was 46,75 dioptries and with corneal warpage was 43,25 D. As to keratoconus, the most curved meridian reading was 54,75 dioptres and in corneal warpage was 46 dioptres. CONCLUSIONS: The type of contact lens and the length of wear has an effect on the occurrence of induced corneal warpage and subclinical keratoconus, and both recorded a similar topographic pattern.

  7. Flip chip assembly of thinned chips for hybrid pixel detector applications

    CERN Document Server

    Fritzsch, T; Woehrmann, M; Rothermund, M; Huegging, F; Ehrmann, O; Oppermann, H; Lang, K.D


    There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafer level in a two-step thinning process. To minimize the risk of wafer breakage the thinned wafer needs to be handled by a carrier during the whole process chain of wafer bumping. Another key process is the flip chip assembly of thinned readout chips onto thin sensor tiles. Besides the prevention of silicon breakage the minimization of chip warpage is one additional task for a high yield and reliable flip chip process. A new technology using glass carrier wafer will be described in detail. The main advantage of this technology is the combination of a carrier support during wafer processing and the chip support during flip chip assembly. For that a glass wafer is glue-bonded onto the backside of the thinned readout chip wafer. After the bump depo...

  8. Fiscal 1998 achievement report on regional consortium research and development project. Venture business fostering regional consortium in its 2nd year--Creation of key industries (Development of processing of new structure-designed high-performance polymer alloy); 1998 nendo shinkina kozo seigyo koseino kobunshi alloy no seikei kako ni kansuru kenkyu kaihatsu seika hokokusho. 2

    Energy Technology Data Exchange (ETDEWEB)



    Efforts are exerted to make novel recyclable polymer alloys excellent in material characteristic and to develop a technology for processing them, for which liquid crystalline polymers equipped with a self-alignment capability are combined with thermoplastic resins. In the research on the alloying of polyethylene terephthalate (PET) and liquid crystal polymers (LCP), studies are conducted about inorganic nucleating additives, thermostabilizers, and mold releasing lubricants, and a success is attained in the manufacture of excellent alloyed pellets. In the injection molding of alloys of PET and LCP, a product is obtained, among those produced with the rate of LCP varied, which behaves excellently even at a high resin temperature of 285 degrees C. It is found about PET/LCP alloys that improvement is achieved with additional LCP in terms of the warpage temperature under load, bending property, strength, and dimensional stability upon exposure to heat. In the study of the response of LCP-diffused PET to a process demanding distortion, an injection-molded product containing 10-20% of LCP is found to exhibit excellent ductility. It is also found that PET/LCP alloys may be cut and machined easily and that therefore their crushing for the recycling purpose will be easy. (NEDO)

  9. Two- and three-dimensional accuracy of dental impression materials: effects of storage time and moisture contamination. (United States)

    Chandran, Deepa T; Jagger, Daryll C; Jagger, Robert G; Barbour, Michele E


    Dental impression materials are used to create an inverse replica of the dental hard and soft tissues, and are used in processes such as the fabrication of crowns and bridges. The accuracy and dimensional stability of impression materials are of paramount importance to the accuracy of fit of the resultant prosthesis. Conventional methods for assessing the dimensional stability of impression materials are two-dimensional (2D), and assess shrinkage or expansion between selected fixed points on the impression. In this study, dimensional changes in four impression materials were assessed using an established 2D and an experimental three-dimensional (3D) technique. The former involved measurement of the distance between reference points on the impression; the latter a contact scanning method for producing a computer map of the impression surface showing localised expansion, contraction and warpage. Dimensional changes were assessed as a function of storage times and moisture contamination comparable to that found in clinical situations. It was evident that dimensional changes observed using the 3D technique were not always apparent using the 2D technique, and that the former offers certain advantages in terms of assessing dimensional accuracy and predictability of impression methods. There are, however, drawbacks associated with 3D techniques such as the more time-consuming nature of the data acquisition and difficulty in statistically analysing the data.

  10. Failure analysis and evaluation of a six cylinders crankshaft for marine diesel generator (United States)

    Khaeroman, Haryadi, Gunawan Dwi; Ismail, R.; Kim, Seon Jin


    This paper discusses the failure of a diesel engine crankshaft of a four stroke 6 cylinders, used in a marine diesel generator. A correct analysis and evaluation of the dimension of the crankshaft are very essential to prevent failure of the crankshaft fracture and cracks. The crankshaft is liable to deformation due to misalignment of the main journals bearings. This article presents the result of crankshaft failure analysis by measuring the mean diameter of the rod journal and the main journal, on the wear, out of roundness, taper, etc. The measurement results must be compared with the acceptable value in the engine specification and manual service and also should follow the American Bureau of Shipping (ABS) guidance notes on propulsion shafting alignment. The measurement results of this study show that the main journal diameter of the third cylinder exhibits an excessive wear, 1.35 % above the permissible lowest rate. It also has a taper for 0.23 mm and out of roundness of 0.13 mm. The diameter of the rod journal indicates excessive wear, 1.06 % higher than the permissible lowest rate, the taper of 0.41 mm and out of roundness of 0.65 mm. The crankshaft warpage or run-out journal, the analysis of the crank web deflection are also evaluated and presented in this paper.

  11. Gelcasting of strontium doped lanthanum manganite for solid oxide fuel cell applications

    International Nuclear Information System (INIS)

    Abdul Haleem, B.; Bhuvana, R.; Udayakumar, A.


    Solid oxide fuel cells (SOFCs) are devices that offer high efficiency power output with negligible emissions. Cathode supported tubular SOFCs consist of porous cathode tubes made up of strontium doped lanthanum manganite, La 1-x Sr x MnO 3 (LSM) that work as functional component as well as structural support for the rest of the cell components. Gelcasting is one of the most suitable methods for the fabrication of porous ceramics. This paper describes the fabrication of porous LSM cathode by gelcasting process. Gelcasting parameters such as monomer concentration, powder volume fraction, pH of the slurry, etc were optimized. Slow drying of green specimens minimized warpage and cracking. Sintered specimens with controlled porosity were obtained by the use of suitable pore-forming agents. The coefficient of thermal expansion (CTE) of sintered specimens was measured, which was found matching with the CTE values of cell components reported in the literature. These results have shown the suitability of the gelcast generated LSM cathodes for SOFC applications. (author)

  12. Synergistic effects of composition and heat treatment on microstructure and properties of vacuum die cast Al-Si-Mg-Mn alloys

    Directory of Open Access Journals (Sweden)

    Jun-jie Xu


    Full Text Available The purpose of this study was to prepare high-quality Al-Si-Mg-Mn alloy with a good combination of strength and ductility employing the vacuum-assisted high-pressure die cast process. An orthogonal study of heat treatments was conducted to design an optimized T6 heat treatment process for both Al-10%Si-0.3%Mg-Mn and Al-11%Si-0.6%Mg-Mn alloys. The results demonstrate that no obvious blisters and warpage were observed in these two alloys with solid solution treatment. After the optimal T6 heat treatment of 530°C×3h + 165°C×6h, Al-11%Si-0.6%Mg-Mn alloy has better mechanical properties, of which tensile strength, yield strength and elongation reached 377.3 MPa, 307.8 MPa and 9%, respectively. The improvement of mechanical properties can be attributed to the high density of needle-like β″(Mg5Si6 precipitation after aging treatment and the fine and spherical eutectic Si particles uniformly distributed in the α-Al matrix.

  13. New process for weld metal reliability

    International Nuclear Information System (INIS)

    Hebel, A.G.


    The industry-wide nature of weld cracking alerts one to the possibility that there is a fundamental law being overlooked. And in overlooking this law, industry is unable to counteract it. That law mandates that restraint during welding causes internal stress; internal stress causes weld metal to crack. Component restraint during welding, according to the welding standard, is the major cause of weld metal failures. When the metal working industry accepts this fact and begins to counter the effects of restraint, the number of weld failures experienced fall dramatically. Bonal Technologies, inc., of Detroit, has developed the first consistently effective non-thermal process to relieve stress caused by restraint during welding. Bonal's patented Mets-Lax sub-resonant stress relief acts as a restraint neutralizer when used during welding. Meta-Lax weld conditioning produces a finer more uniform weld grain structure. A finer, more uniform grain structure is a clear metallurgical indication of improved mechanical weld properties. Other benefits like less internal stress, and less warpage are also achieved

  14. Induced videokeratography alterations in patients with excessive meibomian secretions. (United States)

    Markomanolakis, Marinos M; Kymionis, George D; Aslanides, Ioannis M; Astyrakakis, Nikolaos; Pallikaris, Ioannis G


    To describe lipid-induced specific videokeratographic (VKG) corneal changes and subsequent resolution after eyelid washing. VKG was performed with C-Scan corneal topography. In all patients an excessive meibomian gland lipid secretion was found with or without coexistent chronic posterior blepharitis. After the initial VKG, a meticulous cleaning of the lids with a mild alkali shampoo (10% Johnson's baby shampoo in sterile water) was done, first by gently scrubbing the closed eyelid fissure with the solution to mobilize and emulsify any Meibomian gland secretions followed by cleaning of the upper and lower margins individually, using Q-tip applicators soaked in the detergent. Three patients with tear film lipid layer excess (TFLE), which correlated with the presence of a superior or central corneal steepening in VKG, were studied. In two of the subjects, careful lid washing reversed either completely or partially this VKG effect, whereas in the last patient the VKG changes after artificially increasing the tear film lipid content is described. Meibomian gland lipid secretions may induce mainly superior and occasionally central VKG corneal steepening that is not correlated with any slit-lamp pathologic findings. Computerized corneal topography can help detect such corneal abnormalities, and their reversibility may distinguish them from other pathologic conditions (such as contact lens-induced warpage, eccentric ablations, irregular astigmatism, superior keratoconus).

  15. Fiscal 1999 achievement report. Research and technology of important regional technologies (Development of combustion control system technology for rationalizing energy use); 1999 nendo energy shiyo gorika nensho nado seigyo system gijutsu kaihatsu seika hokokusho

    Energy Technology Data Exchange (ETDEWEB)



    For upgrading and optimizing combustion control systems, research and development is conducted for materializing SiC devices capable of high-temperature operation. In the development of basic technologies common to various types of SiC semiconductor devices, XeCl excimer laser annealing is applied to SiC implanted with Al ions, and low-damage ion implantation is studied. In the development of techniques for forming SiC single crystals into substrates, warpage of 20{mu} or less, surface coarseness of 5{mu}m or less, etc., are achieved in 1-inch and 2-inch wafers. In the development of SiC sensor technology, techniques of heteroepitaxial growth of 3C-SiC on Si substrates and of 6H-SiC on 6H-SiC wafers are established and an optical sensor is built experimentally. A high-temperature UV sensor, switching device for control, rectification device for control, etc., are built of nitrogen ion implanted 6H-SiC. In the effort to develop combustion control system technology, the principle of system operation of the combustion control method proposed under this project is verified. (NEDO)

  16. Single crystalline silicon solar cells with rib structure

    Directory of Open Access Journals (Sweden)

    Shuhei Yoshiba


    Full Text Available To improve the conversion efficiency of Si solar cells, we have developed a thin Si wafer-based solar cell that uses a rib structure. The open-circuit voltage of a solar cell is known to increase with deceasing wafer thickness if the cell is adequately passivated. However, it is not easy to handle very thin wafers because they are brittle and are subject to warpage. We fabricated a lattice-shaped rib structure on the rear side of a thin Si wafer to improve the wafer’s strength. A silicon nitride film was deposited on the Si wafer surface and patterned to form a mask to fabricate the lattice-shaped rib, and the wafer was then etched using KOH to reduce the thickness of the active area, except for the rib region. Using this structure in a Si heterojunction cell, we demonstrated that a high open-circuit voltage (VOC could be obtained by thinning the wafer without sacrificing its strength. A wafer with thickness of 30 μm was prepared easily using this structure. We then fabricated Si heterojunction solar cells using these rib wafers, and measured their implied VOC as a function of wafer thickness. The measured values were compared with device simulation results, and we found that the measured VOC agrees well with the simulated results. To optimize the rib and cell design, we also performed device simulations using various wafer thicknesses and rib dimensions.

  17. Thickness-Independent Ultrasonic Imaging Applied to Abrasive Cut-Off Wheels: An Advanced Aerospace Materials Characterization Method for the Abrasives Industry. A NASA Lewis Research Center Technology Transfer Case History (United States)

    Roth, Don J.; Farmer, Donald A.


    Abrasive cut-off wheels are at times unintentionally manufactured with nonuniformity that is difficult to identify and sufficiently characterize without time-consuming, destructive examination. One particular nonuniformity is a density variation condition occurring around the wheel circumference or along the radius, or both. This density variation, depending on its severity, can cause wheel warpage and wheel vibration resulting in unacceptable performance and perhaps premature failure of the wheel. Conventional nondestructive evaluation methods such as ultrasonic c-scan imaging and film radiography are inaccurate in their attempts at characterizing the density variation because a superimposing thickness variation exists as well in the wheel. In this article, the single transducer thickness-independent ultrasonic imaging method, developed specifically to allow more accurate characterization of aerospace components, is shown to precisely characterize the extent of the density variation in a cut-off wheel having a superimposing thickness variation. The method thereby has potential as an effective quality control tool in the abrasives industry for the wheel manufacturer.

  18. A Novel CAE Method for Compression Molding Simulation of Carbon Fiber-Reinforced Thermoplastic Composite Sheet Materials

    Directory of Open Access Journals (Sweden)

    Yuyang Song


    Full Text Available Its high-specific strength and stiffness with lower cost make discontinuous fiber-reinforced thermoplastic (FRT materials an ideal choice for lightweight applications in the automotive industry. Compression molding is one of the preferred manufacturing processes for such materials as it offers the opportunity to maintain a longer fiber length and higher volume production. In the past, we have demonstrated that compression molding of FRT in bulk form can be simulated by treating melt flow as a continuum using the conservation of mass and momentum equations. However, the compression molding of such materials in sheet form using a similar approach does not work well. The assumption of melt flow as a continuum does not hold for such deformation processes. To address this challenge, we have developed a novel simulation approach. First, the draping of the sheet was simulated as a structural deformation using the explicit finite element approach. Next, the draped shape was compressed using fluid mechanics equations. The proposed method was verified by building a physical part and comparing the predicted fiber orientation and warpage measurements performed on the physical parts. The developed method and tools are expected to help in expediting the development of FRT parts, which will help achieve lightweight targets in the automotive industry.

  19. Technique for measuring cooling patterns in ion source grids by infrared scanning

    International Nuclear Information System (INIS)

    Grisham, L.R.; Eubank, H.P.; Kugel, H.W.


    Many plasma sources designed for neutral beam injection heating of plasmas now employ copper beam acceleration grids which are water-cooled by small capillary tubes fed from one or more headers. To prevent thermally-induced warpage of these grids it is essential that one be able to detect inhomogeneities in the cooling. Due to the very strong thermal coupling between adjacent cooling lines and the concomitant rapid equilibration times, it is not practical to make such measurements in a direct manner with a contact thermometer. We have developed a technique whereby we send a burst of hot water through an initially cool grid, followed by a burst of cool water, and record the transient thermal behavior usng an infrared television camera. This technique, which would be useful for any system with cooling paths that are strongly coupled thermally, has been applied to a number of sources built for the PLT and PDX tokamaks, and has proven highly effective in locating cooling deficiencies and blocked capillary tubes

  20. Durability of Poly(Methyl Methacrylate) Lenses Used in Concentrating Photovoltaic Modules: Preprint

    Energy Technology Data Exchange (ETDEWEB)

    Miller, D. C.; Gedvilas, L. M.; To, B.; Kennedy, C. E.; Kurtz, S. R.


    Concentrating photovoltaic (CPV) technology has recently gained interest based on their expected low levelized cost of electricity, high efficiency, and scalability. Many CPV systems use Fresnel lenses made of poly(methyl methacrylate)(PMMA) to obtain a high optical flux density. The optical and mechanical durability of such components, however, are not well established relative to the desired service life of 30 years. Specific reliability issues may include: reduced optical transmittance, discoloration, hazing, surface erosion, embrittlement, crack growth, physical aging, shape setting (warpage), and soiling. The initial results for contemporary lens- and material-specimens aged cumulatively to 6 months are presented. The study here uses an environmental chamber equipped with a xenon-arc lamp to age specimens at least 8x the nominal field rate. A broad range in the affected characteristics (including optical transmittance, yellowness index, mass loss, and contact angle) has been observed to date, depending on the formulation of PMMA used. The most affected specimens are further examined in terms of their visual appearance, surface roughness (examined via atomic force microscopy), and molecular structure (via Fourier transform infrared spectroscopy).

  1. One-chip Integrated Module of MEMS Shock Sensor and Sensing Amplifier LSI using Pseudo-SOC Technology (United States)

    Iida, Atsuko; Onozuka, Yutaka; Nishigaki, Michihiko; Yamada, Hiroshi; Funaki, Hideyuki; Itaya, Kazuhiko

    We have been developing the pseudo-SOC technology for one-chip module integration of heterogeneous devices that realizes high electrical performance and high density of devices embodying the advantages of both SOC technology and SIP technology. Especially, this technology is available for MEMS-LSI integration. We developed a 0.2mm-thickness one-chip module integrating a MEMS shock sensor and a sensing amplifier LSI by applying this technology. The MEMS shock sensor and the sensing amplifier LSI were connected by high-rigidity epoxy resin optimized the material constants to reduce the stress and the warpage resulting from resin shrinkage due to curing. Then the planar insulating layer and the redistributed conducting layer were formed on it for the global layer. The MEMS shock sensor was preformed to be modularized with a glass cap. Electrical contacts were achieved by bonding of Au bumps on the MEMS fixed electrodes and via holes filled with Ag paste of the glass cap. Functional performance was confirmed by obtaining signal corresponding to the reference signal of the pick-up sensor. Furthermore, stress analysis was performed using the FEM model simulation considering the resin shrinkage.

  2. MEMS-LSI Integrated Microchip using Pseudo-SoC Technology (United States)

    Funaki, Hideyuki; Itaya, Kazuhiko; Yamada, Hiroshi; Onozuka, Yutaka; Iida, Atsuko

    The authors have developed pseudo-SoC technology to realize MEMS-LSI integrated micro-chip. The pseudo-SoC technology consists of three technologies which are wafer reconfiguration technology, inter-chip redistribution layer technology, and pseudo-SoC thinning technology. In the wafer reconfiguration technology, the filling of resin and surface step between heterogeneous chips were improved through the optimization of vacuum printing process and resin material. These improvements reduced the warpage of reconfiguration wafer, leading to achievement of the reconfiguration wafer with 5 inch in diameter. In the inter-chip redistribution layer technology, the interface adherence between planar layer and inter-chip redistribution layer was improved, leading to the inter-chip redistribution layer with 1μm/1μm in line/space on reconfiguration wafer. In the pseudo-SoC thinning technology, thin pseudo-SoC device with 100μm in thickness was achieved through developing mechanical backside grinding process technology. Furthermore, ultra-thin pseudo-SoC which integrated electrostatic MEMS light valve and PWM driver IC was prototyped through developing the ultra-thin MEMS encapsulation technology.

  3. Processing of Syndiotactic Polystyrene to Microspheres for Part Manufacturing through Selective Laser Sintering

    Directory of Open Access Journals (Sweden)

    Nicolas Mys


    Full Text Available Syndiotactic polystyrene pellets were processed into powder form using mechanical (ball milling, rotor milling and physicochemical (spray drying techniques with the intention of using it as feed material for selective laser sintering. New materials are an important component in broadening the application window for selective laser sintering but must meet strict requirements to be used. Particles obtained were characterized in size and shape using SEM imaging, analyzed by software, and compared to the product obtained by conventional ball milling. Rotor milling and spray drying proved capable of making spherical powders, yet only rotor milling achieved particles with a mean diameter within the desired range of 45–97 µm. Subsequently, the obtained powders were examined for the effect each processing technique imparts on the intrinsic properties of the material. Differential scanning calorimetry analysis revealed amorphization for all methods and a reduction in crystallinity after processing, however, the reduction in crystallinity was acceptably low for the spray-dried and rotor-milled powders. Ball milling displayed an exceptional reduction in crystallinity, suggesting severe degradation. As a final test, the rotor-milled powder was subjected to single-layer test and displayed good coalescence and smooth morphology, albeit with a large amount of warpage.

  4. Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking Packaging

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    Chang-Chun Lee


    Full Text Available three-dimensional integrated circuit (3D-IC structure with a significant scale mismatch causes difficulty in analytic model construction. This paper proposes a simulation technique to introduce an equivalent material composed of microbumps and their surrounding wafer level underfill (WLUF. The mechanical properties of this equivalent material, including Young’s modulus (E, Poisson’s ratio, shear modulus, and coefficient of thermal expansion (CTE, are directly obtained by applying either a tensile load or a constant displacement, and by increasing the temperature during simulations, respectively. Analytic results indicate that at least eight microbumps at the outermost region of the chip stacking structure need to be considered as an accurate stress/strain contour in the concerned region. In addition, a factorial experimental design with analysis of variance is proposed to optimize chip stacking structure reliability with four factors: chip thickness, substrate thickness, CTE, and E-value. Analytic results show that the most significant factor is CTE of WLUF. This factor affects microbump reliability and structural warpage under a temperature cycling load and high-temperature bonding process. WLUF with low CTE and high E-value are recommended to enhance the assembly reliability of the 3D-IC architecture.

  5. Effect of organic additives on mechanical properties of SiC ceramics prepared by a modified gelcasting method

    Directory of Open Access Journals (Sweden)

    Feng Wang


    Full Text Available A novel and simple gel system of isobutylene and maleic anhydride (PIBM was used to prepare SiC ceramics. The rheological behaviour of the SiC slurries was investigated as function of organic additives. The SiC slurries with 0.2 wt.% PIBM and 0.2 wt.% tetramethylammonium hydroxide (TMAH showed low viscosity, which was favourable for casting SiC green bodies. In order to obtain homogeneous green bodies, polyvinyl alcohol (PVA was used to assist the dispersion of carbon black in the slurries, and polyethylene glycol (PEG was added to inhibit the surface exfoliation of green bodies. The content of PVA was controlled carefully to avoid the warpage of green bodies during the drying process. Finally, homogeneous defect-free SiC green bodies were successfully fabricated via aqueous gelcasting. The SiC ceramics sintered at 2100 °C (prepared from slurries with solid content of 60 wt.% showed an average flexural strength of 305.7 MPa with porosity of 19.92%.

  6. Reduction of image-based ADI-to-AEI overlay inconsistency with improved algorithm (United States)

    Chen, Yen-Liang; Lin, Shu-Hong; Chen, Kai-Hsiung; Ke, Chih-Ming; Gau, Tsai-Sheng


    In image-based overlay (IBO) measurement, the measurement quality of various measurement spectra can be judged by quality indicators and also the ADI-to-AEI similarity to determine the optimum light spectrum. However we found some IBO measured results showing erroneous indication of wafer expansion from the difference between the ADI and the AEI maps, even after their measurement spectra were optimized. To reduce this inconsistency, an improved image calculation algorithm is proposed in this paper. Different gray levels composed of inner- and outer-box contours are extracted to calculate their ADI overlay errors. The symmetry of intensity distribution at the thresholds dictated by a range of gray levels is used to determine the particular gray level that can minimize the ADI-to-AEI overlay inconsistency. After this improvement, the ADI is more similar to AEI with less expansion difference. The same wafer was also checked by the diffraction-based overlay (DBO) tool to verify that there is no physical wafer expansion. When there is actual wafer expansion induced by large internal stress, both the IBO and the DBO measurements indicate similar expansion results. The scanning white-light interference microscope was used to check the variation of wafer warpage during the ADI and AEI stages. It predicts a similar trend with the overlay difference map, confirming the internal stress.

  7. Flip chip assembly of thinned chips for hybrid pixel detector applications

    International Nuclear Information System (INIS)

    Fritzsch, T; Zoschke, K; Rothermund, M; Oppermann, H; Woehrmann, M; Ehrmann, O; Lang, K D; Huegging, F


    There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafer level in a two-step thinning process. To minimize the risk of wafer breakage the thinned wafer needs to be handled by a carrier during the whole process chain of wafer bumping. Another key process is the flip chip assembly of thinned readout chips onto thin sensor tiles. Besides the prevention of silicon breakage the minimization of chip warpage is one additional task for a high yield and reliable flip chip process. A new technology using glass carrier wafer will be described in detail. The main advantage of this technology is the combination of a carrier support during wafer processing and the chip support during flip chip assembly. For that a glass wafer is glue-bonded onto the backside of the thinned readout chip wafer. After the bump deposition process the glass-readout chip stack is diced in one step. Finally the glass carrier chip is released by laser illumination after flip chip assembly of the readout chip onto sensor tile. The results of the flip chip assembly process development for the ATLAS IBL upgrade are described more in detail. The new ATLAS FEI4B chip with a size of 20 × 19 mm 2 is flip chip bonded with a thickness of only 150 μm, but the capability of this technology has been demonstrated on hybrid modules with a reduced readout chip thickness of down to 50 μm which is a major step for ultra-thin electronic systems

  8. Achievement report for fiscal 1996 on the research and development of technologies for important region. Development of control system technology for combustion with energy use rationalized, etc.; 1996 nendo juyo chiiki gijutsu kenkyu kaihatsu seika hokokusho. Energy shiyo gorika nensho nado seigyo system gijutsu kaihatsu

    Energy Technology Data Exchange (ETDEWEB)



    The goal is to develop basic technologies to build an SiC device capable of service amid high-temperature surroundings for the advancement and optimization of combustion control systems. In an SiC semiconductor, the Si-C bond is broken when irradiated with ions, and this makes the occurrence of thermal oxidation easy to occur. In the study to form SiC into single-crystal substrates, a substrate with warpage of 10 micrometers or less and surface coarseness of 10 nanometers or less is realized. In the development of sensor technologies, the high-speed CVD (chemical vapor deposition) method is applied for the growth of crystals further on a 3C-SiC layer epitaxially grown by MBE (molecular beam epitaxy) surface control, which improves on layer characteristics. Element technologies are developed for the construction of a 3-terminal element (FET: field effect transistor), which is for the construction of a high-temperature, high-speed SiC device. An effort is made at achieving 3C-SiC hetero-epitaxial growth, etc., on a 3-inch Si substrate using an SiC crystal film formation experimenting apparatus, which aims at constructing a control device. Concerning the combustion control system, the relations between the air/fuel ratio and the emission spectra of radicals OH, CH, and C2 in a flame are made clear. Also referred to are the basic studies being conducted at research institutes such as universities and a survey of technological trends abroad.

  9. Novel in situ mechanical testers to enable integrated metal surface micro-machines.

    Energy Technology Data Exchange (ETDEWEB)

    Follstaedt, David Martin; de Boer, Maarten Pieter; Kotula, Paul Gabriel; Hearne, Sean Joseph; Foiles, Stephen Martin; Buchheit, Thomas Edward; Dyck, Christopher William


    The ability to integrate metal and semiconductor micro-systems to perform highly complex functions, such as RF-MEMS, will depend on developing freestanding metal structures that offer improved conductivity, reflectivity, and mechanical properties. Three issues have prevented the proliferation of these systems: (1) warpage of active components due to through-thickness stress gradients, (2) limited component lifetimes due to fatigue, and (3) low yield strength. To address these issues, we focus on developing and implementing techniques to enable the direct study of the stress and microstructural evolution during electrodeposition and mechanical loading. The study of stress during electrodeposition of metal thin films is being accomplished by integrating a multi-beam optical stress sensor into an electrodeposition chamber. By coupling the in-situ stress information with ex-situ microstructural analysis, a scientific understanding of the sources of stress during electrodeposition will be obtained. These results are providing a foundation upon which to develop a stress-gradient-free thin film directly applicable to the production of freestanding metal structures. The issues of fatigue and yield strength are being addressed by developing novel surface micromachined tensile and bend testers, by interferometry, and by TEM analysis. The MEMS tensile tester has a ''Bosch'' etched hole to allow for direct viewing of the microstructure in a TEM before, during, and after loading. This approach allows for the quantitative measurements of stress-strain relations while imaging dislocation motion, and determination of fracture nucleation in samples with well-known fatigue/strain histories. This technique facilitates the determination of the limits for classical deformation mechanisms and helps to formulate a new understanding of the mechanical response as the grain sizes are refined to a nanometer scale. Together, these studies will result in a science

  10. Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments

    International Nuclear Information System (INIS)

    Zhang, Liang; Han, Ji-guang; Guo, Yong-huan; He, Cheng-wen


    With the addition of 0.03 wt% rare earth Ce, in our previous works, the properties of SnAgCu solder were enhanced obviously. Based on the Garofalo–Arrhenius creep constitutive model, finite element method was used to simulate the stress–strain response during thermal cycle loading, and combined with the fatigue life prediction models, the fatigue life of SnAgCu/SnAgCuCe solder joints was calculated respectively, which can demonstrate the effect of the rare earth Ce on the fatigue life of SnAgCu solder joints. The results indicated that the maximum stress–strain can be found on the top surface of the corner solder joint, and the warpage of the PCB substrate occurred during thermal cycle loading. The trends obtained from modeling results have a good agreement with the experimental data reported in the literature for WLCSP devices. In addition, the stress–strain of SnAgCuCe solder joints is lower than that of SnAgCu solder joints. The thermal fatigue lives of solder joints calculated based on the creep model and creep strain energy density model show that the fatigue life of SnAgCuCe solder joints is higher than the SnAgCu solder joints. The fatigue life of SnAgCuCe solder joints can be enhanced significantly with the addition of Ce, is 30.2% higher than that of SnAgCu solder joints, which can be attributed to the CeSn 3 particles formed resisting the motion of dislocation; moreover, the refinement of microstructure and the IMC sizes also contribute to the enhancement of fatigue life, which elucidates that SnAgCuCe solder can be utilized in electronic industry with high reliability replacing the SnAgCu solder

  11. Experiments for practical education in process parameter optimization for selective laser sintering to increase workpiece quality (United States)

    Reutterer, Bernd; Traxler, Lukas; Bayer, Natascha; Drauschke, Andreas


    Selective Laser Sintering (SLS) is considered as one of the most important additive manufacturing processes due to component stability and its broad range of usable materials. However the influence of the different process parameters on mechanical workpiece properties is still poorly studied, leading to the fact that further optimization is necessary to increase workpiece quality. In order to investigate the impact of various process parameters, laboratory experiments are implemented to improve the understanding of the SLS limitations and advantages on an educational level. Experiments are based on two different workstations, used to teach students the fundamentals of SLS. First of all a 50 W CO2 laser workstation is used to investigate the interaction of the laser beam with the used material in accordance with varied process parameters to analyze a single-layered test piece. Second of all the FORMIGA P110 laser sintering system from EOS is used to print different 3D test pieces in dependence on various process parameters. Finally quality attributes are tested including warpage, dimension accuracy or tensile strength. For dimension measurements and evaluation of the surface structure a telecentric lens in combination with a camera is used. A tensile test machine allows testing of the tensile strength and the interpreting of stress-strain curves. The developed laboratory experiments are suitable to teach students the influence of processing parameters. In this context they will be able to optimize the input parameters depending on the component which has to be manufactured and to increase the overall quality of the final workpiece.

  12. Optimisation of multi-layer rotationally moulded foamed structures (United States)

    Pritchard, A. J.; McCourt, M. P.; Kearns, M. P.; Martin, P. J.; Cunningham, E.


    Multi-layer skin-foam and skin-foam-skin sandwich constructions are of increasing interest in the rotational moulding process for two reasons. Firstly, multi-layer constructions can improve the thermal insulation properties of a part. Secondly, foamed polyethylene sandwiched between solid polyethylene skins can increase the mechanical properties of rotationally moulded structural components, in particular increasing flexural properties and impact strength (IS). The processing of multiple layers of polyethylene and polyethylene foam presents unique challenges such as the control of chemical blowing agent decomposition temperature, and the optimisation of cooling rates to prevent destruction of the foam core; therefore, precise temperature control is paramount to success. Long cooling cycle times are associated with the creation of multi-layer foam parts due to their insulative nature; consequently, often making the costs of production prohibitive. Devices such as Rotocooler®, a rapid internal mould water spray cooling system, have been shown to have the potential to significantly decrease cooling times in rotational moulding. It is essential to monitor and control such devices to minimise the warpage associated with the rapid cooling of a moulding from only one side. The work presented here demonstrates the use of threaded thermocouples to monitor the polymer melt in multi-layer sandwich constructions, in order to analyse the cooling cycle of multi-layer foamed structures. A series of polyethylene skin-foam test mouldings were produced, and the effect of cooling medium on foam characteristics, mechanical properties, and process cycle time were investigated. Cooling cycle time reductions of 45%, 26%, and 29% were found for increasing (1%, 2%, and 3%) chemical blowing agent (CBA) amount when using internal water cooling technology from ˜123°C compared with forced air cooling (FAC). Subsequently, a reduction of IS for the same skin-foam parts was found to be 1%, 4

  13. Performance characterization of a pressure-tuned wide-angle Michelson interferometric spectral filter for high spectral resolution lidar (United States)

    Seaman, Shane T.; Cook, Anthony L.; Scola, Salvatore J.; Hostetler, Chris A.; Miller, Ian; Welch, Wayne


    High Spectral Resolution Lidar (HSRL) is typically realized using an absorption filter to separate molecular returns from particulate returns. NASA Langley Research Center (LaRC) has designed and built a Pressure-Tuned Wide-Angle Michelson Interferometer (PTWAMI) as an alternate means to separate the two types of atmospheric returns. While absorption filters only work at certain wavelengths and suffer from low photon efficiency due to light absorption, an interferometric spectral filter can be designed for any wavelength and transmits nearly all incident photons. The interferometers developed at LaRC employ an air spacer in one arm, and a solid glass spacer in the other. Field widening is achieved by specific design and selection of the lengths and refractive indices of these two arms. The principal challenge in using such an interferometer as a spectral filter for HSRL aboard aircraft is that variations in glass temperature and air pressure cause changes in the interferometer's optical path difference. Therefore, a tuning mechanism is needed to actively accommodate for these changes. The pressure-tuning mechanism employed here relies on changing the pressure in an enclosed, air-filled arm of the interferometer to change the arm's optical path length. However, tuning using pressure will not adjust for tilt, mirror warpage, or thermally induced wavefront error, so the structural, thermal, and optical behavior of the device must be well understood and optimized in the design and manufacturing process. The PTWAMI has been characterized for particulate transmission ratio, wavefront error, and tilt, and shows acceptable performance for use in an HSRL instrument.

  14. Characterization of Prototype LSST CCDs

    Energy Technology Data Exchange (ETDEWEB)



    The ambitious science goals of the Large Synoptic Survey Telescope (LSST) will be achieved in part by a wide-field imager that will achieve a new level of performance in terms of area, speed, and sensitivity. The instrument performance is dominated by the focal plane sensors, which are now in development. These new-generation sensors will make use of advanced semiconductor technology and will be complemented by a highly integrated electronics package located inside the cryostat. A test laboratory has been set up at Brookhaven National Laboratory (BNL) to characterize prototype sensors and to develop test and assembly techniques for eventual integration of production sensors and electronics into modules that will form the final focal plane. As described in [1], the key requirements for LSST sensors are wideband quantum efficiency (QE) extending beyond lpm in the red, control of point spread function (PSF), and fast readout using multiple amplifiers per chip operated in parallel. In addition, LSST's fast optical system (f71.25) places severe constraints on focal plane flatness. At the chip level this involves packaging techniques to minimize warpage of the silicon die, and at the mosaic level careful assembly and metrology to achieve a high coplanarity of the sensor tiles. In view of the long lead time to develop the needed sensor technology, LSST undertook a study program with several vendors to fabricate and test devices which address the most critical performance features [2]. The remainder of this paper presents key results of this study program. Section 2 summarizes the sensor requirements and the results of design optimization studies, and Section 3 presents the sensor development plan. In Section 4 we describe the test bench at BNL. Section 5 reports measurement results obtained to date oh devices fabricated by several vendors. Section 6 presents a summary of the paper and an outlook for the future work. We present characterization methods and results on

  15. Reduced Moment-Based Models for Oxygen Precipitates and Dislocation Loops in Silicon (United States)

    Trzynadlowski, Bart

    The demand for ever smaller, higher-performance integrated circuits and more efficient, cost-effective solar cells continues to push the frontiers of process technology. Fabrication of silicon devices requires extremely precise control of impurities and crystallographic defects. Failure to do so not only reduces performance, efficiency, and yield, it threatens the very survival of commercial enterprises in today's fiercely competitive and price-sensitive global market. The presence of oxygen in silicon is an unavoidable consequence of the Czochralski process, which remains the most popular method for large-scale production of single-crystal silicon. Oxygen precipitates that form during thermal processing cause distortion of the surrounding silicon lattice and can lead to the formation of dislocation loops. Localized deformation caused by both of these defects introduces potential wells that trap diffusing impurities such as metal atoms, which is highly desirable if done far away from sensitive device regions. Unfortunately, dislocations also reduce the mechanical strength of silicon, which can cause wafer warpage and breakage. Engineers must negotiate this and other complex tradeoffs when designing fabrication processes. Accomplishing this in a complex, modern process involving a large number of thermal steps is impossible without the aid of computational models. In this dissertation, new models for oxygen precipitation and dislocation loop evolution are described. An oxygen model using kinetic rate equations to evolve the complete precipitate size distribution was developed first. This was then used to create a reduced model tracking only the moments of the size distribution. The moment-based model was found to run significantly faster than its full counterpart while accurately capturing the evolution of oxygen precipitates. The reduced model was fitted to experimental data and a sensitivity analysis was performed to assess the robustness of the results. Source