WorldWideScience

Sample records for wafer-level ic testing

  1. Wafer level 3-D ICs process technology

    CERN Document Server

    Tan, Chuan Seng; Reif, L Rafael

    2009-01-01

    This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

  2. Wafer level test solutions for IR sensors

    Science.gov (United States)

    Giessmann, Sebastian; Werner, Frank-Michael

    2014-05-01

    Wafer probers provide an established platform for performing electrical measurements at wafer level for CMOS and similar process technologies. For testing IR sensors, the requirements are beyond the standard prober capabilities. This presentation will give an overview about state of the art IR sensor probing systems reaching from flexible engineering solutions to automated production needs. Cooled sensors typically need to be tested at a target temperature below 80 K. Not only is the device temperature important but also the surrounding environment is required to prevent background radiation from reaching the device under test. To achieve that, a cryogenic shield is protecting the movable chuck. By operating that shield to attract residual gases inside the chamber, a completely contamination-free test environment can be guaranteed. The use of special black coatings are furthermore supporting the removal of stray light. Typically, probe card needles are operating at ambient (room) temperature when connecting to the wafer. To avoid the entrance of heat, which can result in distorted measurements, the probe card is fully embedded into the cryogenic shield. A shutter system, located above the probe field, is designed to switch between the microscope view to align the sensor under the needles and the test relevant setup. This includes a completely closed position to take dark current measurements. Another position holds a possible filter glass with the required aperture opening. The necessary infrared sources to stimulate the device are located above.

  3. Wafer-level testing and test during burn-in for integrated circuits

    CERN Document Server

    Bahukudumbi, Sudarshan

    2010-01-01

    Wafer-level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form. Burn-in is a temperature/bias reliability stress test used in detecting and screening out potential early life device failures. This hands-on resource provides a comprehensive analysis of these methods, showing how wafer-level testing during burn-in (WLTBI) helps lower product cost in semiconductor manufacturing.Engineers learn how to implement the testing of integrated circuits at the wafer-level under various resource constrain

  4. CMOS-MEMS Test-Key for Extracting Wafer-Level Mechanical Properties

    Directory of Open Access Journals (Sweden)

    Pei-Zen Chang

    2012-12-01

    Full Text Available This paper develops the technologies of mechanical characterization of CMOS-MEMS devices, and presents a robust algorithm for extracting mechanical properties, such as Young’s modulus, and mean stress, through the external electrical circuit behavior of the micro test-key. An approximate analytical solution for the pull-in voltage of bridge-type test-key subjected to electrostatic load and initial stress is derived based on Euler’s beam model and the minimum energy method. Then one can use the aforesaid closed form solution of the pull-in voltage to extract the Young’s modulus and mean stress of the test structures. The test cases include the test-key fabricated by a TSMC 0.18 μm standard CMOS process, and the experimental results refer to Osterberg’s work on the pull-in voltage of single crystal silicone microbridges. The extracted material properties calculated by the present algorithm are valid. Besides, this paper also analyzes the robustness of this algorithm regarding the dimension effects of test-keys. This mechanical properties extracting method is expected to be applicable to the wafer-level testing in micro-device manufacture and compatible with the wafer-level testing in IC industry since the test process is non-destructive.

  5. Digital Platform for Wafer-Level MEMS Testing and Characterization Using Electrical Response

    Directory of Open Access Journals (Sweden)

    Nuno Brito

    2016-09-01

    Full Text Available The uniqueness of microelectromechanical system (MEMS devices, with their multiphysics characteristics, presents some limitations to the borrowed test methods from traditional integrated circuits (IC manufacturing. Although some improvements have been performed, this specific area still lags behind when compared to the design and manufacturing competencies developed over the last decades by the IC industry. A complete digital solution for fast testing and characterization of inertial sensors with built-in actuation mechanisms is presented in this paper, with a fast, full-wafer test as a leading ambition. The full electrical approach and flexibility of modern hardware design technologies allow a fast adaptation for other physical domains with minimum effort. The digital system encloses a processor and the tailored signal acquisition, processing, control, and actuation hardware control modules, capable of the structure position and response analysis when subjected to controlled actuation signals in real time. The hardware performance, together with the simplicity of the sequential programming on a processor, results in a flexible and powerful tool to evaluate the newest and fastest control algorithms. The system enables measurement of resonant frequency (Fr, quality factor (Q, and pull-in voltage (Vpi within 1.5 s with repeatability better than 5 ppt (parts per thousand. A full-wafer with 420 devices under test (DUTs has been evaluated detecting the faulty devices and providing important design specification feedback to the designers.

  6. Digital Platform for Wafer-Level MEMS Testing and Characterization Using Electrical Response

    Science.gov (United States)

    Brito, Nuno; Ferreira, Carlos; Alves, Filipe; Cabral, Jorge; Gaspar, João; Monteiro, João; Rocha, Luís

    2016-01-01

    The uniqueness of microelectromechanical system (MEMS) devices, with their multiphysics characteristics, presents some limitations to the borrowed test methods from traditional integrated circuits (IC) manufacturing. Although some improvements have been performed, this specific area still lags behind when compared to the design and manufacturing competencies developed over the last decades by the IC industry. A complete digital solution for fast testing and characterization of inertial sensors with built-in actuation mechanisms is presented in this paper, with a fast, full-wafer test as a leading ambition. The full electrical approach and flexibility of modern hardware design technologies allow a fast adaptation for other physical domains with minimum effort. The digital system encloses a processor and the tailored signal acquisition, processing, control, and actuation hardware control modules, capable of the structure position and response analysis when subjected to controlled actuation signals in real time. The hardware performance, together with the simplicity of the sequential programming on a processor, results in a flexible and powerful tool to evaluate the newest and fastest control algorithms. The system enables measurement of resonant frequency (Fr), quality factor (Q), and pull-in voltage (Vpi) within 1.5 s with repeatability better than 5 ppt (parts per thousand). A full-wafer with 420 devices under test (DUTs) has been evaluated detecting the faulty devices and providing important design specification feedback to the designers. PMID:27657087

  7. Digital Platform for Wafer-Level MEMS Testing and Characterization Using Electrical Response.

    Science.gov (United States)

    Brito, Nuno; Ferreira, Carlos; Alves, Filipe; Cabral, Jorge; Gaspar, João; Monteiro, João; Rocha, Luís

    2016-09-21

    The uniqueness of microelectromechanical system (MEMS) devices, with their multiphysics characteristics, presents some limitations to the borrowed test methods from traditional integrated circuits (IC) manufacturing. Although some improvements have been performed, this specific area still lags behind when compared to the design and manufacturing competencies developed over the last decades by the IC industry. A complete digital solution for fast testing and characterization of inertial sensors with built-in actuation mechanisms is presented in this paper, with a fast, full-wafer test as a leading ambition. The full electrical approach and flexibility of modern hardware design technologies allow a fast adaptation for other physical domains with minimum effort. The digital system encloses a processor and the tailored signal acquisition, processing, control, and actuation hardware control modules, capable of the structure position and response analysis when subjected to controlled actuation signals in real time. The hardware performance, together with the simplicity of the sequential programming on a processor, results in a flexible and powerful tool to evaluate the newest and fastest control algorithms. The system enables measurement of resonant frequency (Fr), quality factor (Q), and pull-in voltage (Vpi) within 1.5 s with repeatability better than 5 ppt (parts per thousand). A full-wafer with 420 devices under test (DUTs) has been evaluated detecting the faulty devices and providing important design specification feedback to the designers.

  8. High Throughput, High Precision Hot Testing Tool for HBLED Wafer Level Testing

    Energy Technology Data Exchange (ETDEWEB)

    Solarz, Richard [KLA-Tencor Corporation, Milpitas, CA (United States); McCord, Mark [KLA-Tencor Corporation, Milpitas, CA (United States)

    2015-12-31

    The Socrates research effort developed an in depth understanding and demonstrated in a prototype tool new precise methods for teh characterization of color characteristics and flux from individual LEDs for the production of uniform quality lighting. This effort was focused on improving the color quality and consistency of solid state lighting and potentially reducing characterization costs for all LED product types. The patented laser hot testing method was demonstrated to be far more accurate than all current state of the art color and flux characterization methods in use by the solid state lighting industry today. A seperately patented LED grouping method (statistical binning) was demonstrated to be a useful approach to improving utilization of entire lots of large color and flux distributions of manufactured LEDs for high quality color solid-state lighting. At the conclusion of the research in late 2015 the solid-state lighting industry was however generally satisfied with its existing production methods for high quality color products for the small segment of customers that demand it, albeit with added costs.

  9. An electrical test method for quality detecting of wafer level eutectic bonding

    Science.gov (United States)

    Zhang, Lemin; Jiao, Binbin; Ku, Will; Tseng, Li-Tien; Kong, Yanmei; Chien, Yu-Hao; Yun, Shichang; Chen, Dapeng

    2017-01-01

    As the costs of packaging and testing account for a substantial portion of microelectromechanical system (MEMS) devices, an effective and convenient characterization method is urgent to be investigated to lower the cost. In this paper, an electrical test method was utilized, and the test key used for a four-probe current-voltage test was designed to monitor the quality of the AuSn eutectic bonding. The electrical test can directly detect whether or not voids existed in the bonding layer. The difference in alloy state, for example, the existence of the (Au, Ni) 3Sn2 phase confirmed by the scanning electron microscope and energy dispersive x-ray spectroscopy test, can also be reflected by resistivity variation. The electrical test can be implemented automatically and conveniently unlike other characterization methods. Therefore, it is suitable to be applied in quality inspection in industrial production.

  10. Wafer-level micro-optics: trends in manufacturing, testing, packaging, and applications

    Science.gov (United States)

    Voelkel, Reinhard; Gong, Li; Rieck, Juergen; Zheng, Alan

    2012-11-01

    Micro-optics is an indispensable key enabling technology (KET) for many products and applications today. Probably the most prestigious examples are the diffractive light shaping elements used in high-end DUV lithography steppers. Highly efficient refractive and diffractive micro-optical elements are used for precise beam and pupil shaping. Micro-optics had a major impact on the reduction of aberrations and diffraction effects in projection lithography, allowing a resolution enhancement from 250 nm to 45 nm within the last decade. Micro-optics also plays a decisive role in medical devices (endoscopes, ophthalmology), in all laser-based devices and fiber communication networks (supercomputer, ROADM), bringing high-speed internet to our homes (FTTH). Even our modern smart phones contain a variety of micro-optical elements. For example, LED flashlight shaping elements, the secondary camera, and ambient light and proximity sensors. Wherever light is involved, micro-optics offers the chance to further miniaturize a device, to improve its performance, or to reduce manufacturing and packaging costs. Wafer-scale micro-optics fabrication is based on technology established by semiconductor industry. Thousands of components are fabricated in parallel on a wafer. We report on the state of the art in wafer-based manufacturing, testing, packaging and present examples and applications for micro-optical components and systems.

  11. Accelerated Wafer-Level Integrated Circuit Reliability Testing for Electromigration in Metal Interconnects with Enhanced Thermal Modeling, Structure Design, Control of Stress, and Experimental Measurements.

    Science.gov (United States)

    Shih, Chih-Ching

    Wafer-level electromigration tests have been developed recently to fulfill the need for rapid testing in integrated circuit production facilities. We have developed an improved thermal model-TEARS (Thermal Energy Accounts for the Resistance of the System) that supports these tests. Our model is enhanced by treatments for determination of the thermal conductivity of metal, K_{m}, heat sinking effects of the voltage probes and current lead terminations, and thermoelectric power. Our TEARS analysis of multi-element SWEAT (Standard Wafer-level Electromigration Acceleration Test) structures yields design criteria for the length of current injection leads and choice of voltage probe locations to isolate test units from the heat sinking effect of current lead terminations. This also provides greater insight into the current for thermal runaway. From our TEARS model and Black's equation for lifetime prediction, we have developed an algorithm for a fast and accurate control of stress in SWEAT tests. We have developed a lookup table approach for precise electromigration characterizations without complicated calculations. It decides the peak temperature in the metal, T_ {max}, and the thermal conductivity of the insulator, K_{i}, from an experimental resistance measurement at a given current. We introduce a characteristic temperature, T _{EO}, which is much simpler to use than conventional temperature coefficient of the electrical resistivity of metal for calibration and transfer of calibration data of metallic films as their own temperature sensors. The use of T_{EO} also allows us to establish system specifications for a desirable accuracy in temperature measurement. Our experimental results are the first to show the effects of series elemental SWEAT units on the system failure distribution, spatial failure distribution in SWEAT structures, and bimodal distributions for straight-line structures. The adaptive approach of our TEARS based SWEAT test decides the value of Black

  12. Test systems of the STS-XYTER2 ASIC: from wafer-level to in-system verification

    Science.gov (United States)

    Kasinski, Krzysztof; Zubrzycka, Weronika

    2016-09-01

    The STS/MUCH-XYTER2 ASIC is a full-size prototype chip for the Silicon Tracking System (STS) and Muon Chamber (MUCH) detectors in the new fixed-target experiment Compressed Baryonic Matter (CBM) at FAIR-center, Darmstadt, Germany. The STS assembly includes more than 14000 ASICs. The complicated, time-consuming, multi-step assembly process of the detector building blocks and tight quality assurance requirements impose several intermediate testing to be performed for verifying crucial assembly steps (e.g. custom microcable tab-bonding before wire-bonding to the PCB) and - if necessary - identifying channels or modules for rework. The chip supports the multi-level testing with different probing / contact methods (wafer probe-card, pogo-probes, in-system tests). A huge number of ASICs to be tested restricts the number and kind of tests possible to be performed within a reasonable time. The proposed architectures of test stand equipment and a brief summary of methodologies are presented in this paper.

  13. Fast wafer-level detection and control of interconnect reliability

    Science.gov (United States)

    Foley, Sean; Molyneaux, James; Mathewson, Alan

    2000-08-01

    Many of the technological advances in the semiconductor industry have led to dramatic increases in device density and performance in conjunction with enhanced circuit reliability. As reliability is improved, the time taken to characterize particular failure modes with traditional test methods is getting substantially longer. Furthermore, semiconductor customers expect low product cost and fast time-to-market. The limits of traditional reliability testing philosophies are being reached and new approaches need to be investigated to enable the next generation of highly reliable products to be tested. This is especially true in the area of IC interconnect, where significant challenges are predicted for the next decade. A number of fast, wafer level test methods exist for interconnect reliability evaluation. The relative abilities of four such methods to detect the quality and reliability of IC interconnect over very short test times are evaluated in this work. Four different test structure designs are also evaluated and the results are bench-marked against conventional package level Median Time to Failure results. The Isothermal test method combine with SWEAT-type test structures is shown to be the most suitable combination for defect detection and interconnect reliability control over very short test times.

  14. MEMS Wafer-level Packaging Technology Using LTCC Wafer

    Science.gov (United States)

    Mohri, Mamoru; Esashi, Masayoshi; Tanaka, Shuji

    This paper describes a versatile and reliable wafer-level hermetic packaging technology using an anodically-bondable low temperature co-fired ceramic (LTCC) wafer, in which multi-layer electrical feedthroughs can be embedded. The LTCC wafer allows many kinds of micro electro mechanical systems (MEMS) to be more flexibly designed and more easily packaged. The hermeticity of vacuum-sealed cavities was confirmed after 3000 cycles of thermal shock (-40°C×30min/+125°C×30min) by diaphragm method. To practically apply the LTCC wafer to a variety of MEMS, the electrical connection between MEMS on a Si wafer and feedthroughs in the LTCC should be established by a simple and reliable method. We have developed a new electrical connection methods; The electrical connection is established by porous Au bumps, which are a part of Au vias exposed in wet-etched cavities on the LTCC wafer. 100% yield of both electrical connection and hermetic sealing was demonstrated. A thermal shock test up to 3000 cycles confirmed the reliability of this packaging technology.

  15. Wafer-level vacuum/hermetic packaging technologies for MEMS

    Science.gov (United States)

    Lee, Sang-Hyun; Mitchell, Jay; Welch, Warren; Lee, Sangwoo; Najafi, Khalil

    2010-02-01

    An overview of wafer-level packaging technologies developed at the University of Michigan is presented. Two sets of packaging technologies are discussed: (i) a low temperature wafer-level packaging processes for vacuum/hermeticity sealing, and (ii) an environmentally resistant packaging (ERP) technology for thermal and mechanical control as well as vacuum packaging. The low temperature wafer-level encapsulation processes are implemented using solder bond rings which are first patterned on a cap wafer and then mated with a device wafer in order to encircle and encapsulate the device at temperatures ranging from 200 to 390 °C. Vacuum levels below 10 mTorr were achieved with yields in an optimized process of better than 90%. Pressures were monitored for more than 4 years yielding important information on reliability and process control. The ERP adopts an environment isolation platform in the packaging substrate. The isolation platform is designed to provide low power oven-control, vibration isolation and shock protection. It involves batch flip-chip assembly of a MEMS device onto the isolation platform wafer. The MEMS device and isolation structure are encapsulated at the wafer-level by another substrate with vertical feedthroughs for vacuum/hermetic sealing and electrical signal connections. This technology was developed for high performance gyroscopes, but can be applied to any type of MEMS device.

  16. Improving wafer level CD uniformity for logic applications utilizing mask level metrology and process

    Science.gov (United States)

    Cohen, Avi; Trautzsch, Thomas; Buttgereit, Ute; Graitzer, Erez; Hanuka, Ori

    2013-09-01

    Critical Dimension Uniformity (CDU) is one of the key parameters necessary to assure good performance and reliable functionality of any integrated circuit (IC). The extension of 193nm based lithography usage combined with design rule shrinkage makes process control, in particular the wafer level CDU control, an extremely important and challenging task in IC manufacturing. In this study the WLCD-CDC closed loop solution offered by Carl Zeiss SMS was examined. This solution aims to improve the wafer level intra-field CDU without the need to run wafer prints and extensive wafer CD metrology. It combines two stand-alone tools: The WLCD tool which measures CD based on aerial imaging technology while applying the exact scanner-used illumination conditions to the photomask and the CDC tool which utilizes an ultra-short femto-second laser to write intra-volume shading elements (Shade-In Elements™) inside the photomask bulk material. The CDC process changes the dose going through the photomask down to the wafer, hence the wafer level intra-field CDU improves. The objective of this study was to evaluate how CDC process is affecting the CD for different type of features and pattern density which are typical for logic and system on chip (SOC) devices. The main findings show that the linearity and proximity behavior is maintained by the CDC process and CDU and CDC Ratio (CDCR) show a linear behavior for the different feature types. Finally, it was demonstrated that the CDU errors of the targeted (critical) feature have been effectively eliminated. In addition, the CDU of all other features have been significantly improved as well.

  17. Analyses of crack growth along interface of patterned wafer-level Cu-Cu bonds

    DEFF Research Database (Denmark)

    Tvergaard, Viggo; Hutchinson, John W.

    2009-01-01

    A preliminary theoretical study is carried out of the role of micron-scale patterning on the interface toughness of bonded Cu-to-Cu nanometer-scale films. The work is motivated by the experimental studies of [Tadepalli, R., Turner. K.T., Thompson, C.V., 2008b. Effects of patterning on the interface...... toughness of wafer-level Cu-Cu bonds. Acta Materialia 56, 438-447; Tadepalli, R., Turner, K.T., Thompson, C.V., 2008c. Mixed-mode interface toughness of wafer-level Cu-Cu bonds using asymmetric chevron test. J. Mech. Phys. Solids 56, 707-718.] wherein 400 nm Cu films were deposited in a variety of patterns...... on Si wafer substrates. Specimens were then produced by bringing the Cu surfaces into contact creating thermo-compression bonds. Interface toughness of these specimens was experimentally measured. The present study focuses on interface patterns comprised of bonded strips, called lines, alternating...

  18. Novel SU-8 based vacuum wafer-level packaging for MEMS devices

    DEFF Research Database (Denmark)

    Murillo, Gonzalo; Davis, Zachary James; Keller, Stephan Urs

    2010-01-01

    This work presents a simple and low-cost SU-8 based wafer-level vacuum packaging method which is CMOS and MEMS compatible. Different approaches have been investigated by taking advantage of the properties of SU-8, such as chemical resistance, optical transparence, mechanical reliability and versa......This work presents a simple and low-cost SU-8 based wafer-level vacuum packaging method which is CMOS and MEMS compatible. Different approaches have been investigated by taking advantage of the properties of SU-8, such as chemical resistance, optical transparence, mechanical reliability......, an indirect vacuum level measurement has been carried out by comparing the different quality factors of a test cantilever resonator when this element is packed or unpacked....

  19. Methods for characterization of wafer-level encapsulation applied on silicon to LTCC anodic bonding

    Science.gov (United States)

    Khan, M. F.; Ghavanini, F. A.; Haasl, S.; Löfgren, L.; Persson, K.; Rusu, C.; Schjølberg-Henriksen, K.; Enoksson, P.

    2010-06-01

    This paper presents initial results on generic characterization methods for wafer-level encapsulation. The methods, developed specifically to evaluate anodic bonding of low-temperature cofired ceramics (LTCC) to Si, are generally applicable to wafer-level encapsulation. Different microelectromechanical system (MEMS) structures positioned over the whole wafer provide local information about the bond quality. The structures include (i) resonating cantilevers as pressure sensors for bond hermeticity, (ii) resonating bridges as stress sensors for measuring the stress induced by the bonding and (iii) frames/mesas for pull tests. These MEMS structures have been designed, fabricated and characterized indicating that local information can easily be obtained. Buried electrodes to enable localized bonding have been implemented and their effectiveness is indicated from first results of the novel Si to LTCC anodic bonding.

  20. Wafer-Level Vacuum Packaging of Smart Sensors.

    Science.gov (United States)

    Hilton, Allan; Temple, Dorota S

    2016-10-31

    The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors-"low cost" for ubiquitous presence, and "smart" for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging technology of smart sensors. We describe the processes needed to create the wafer-scale vacuum microchambers, focusing on approaches that involve metal seals and that are compatible with the thermal budget of complementary metal-oxide semiconductor (CMOS) integrated circuits. We review choices of seal materials and structures that are available to a device designer, and present techniques used for the fabrication of metal seals on device and window wafers. We also analyze the deposition and activation of thin film getters needed to maintain vacuum in the ultra-small chambers, and the wafer-to-wafer bonding processes that form the hermetic seal. We discuss inherent trade-offs and challenges of each seal material set and the corresponding bonding processes. Finally, we identify areas for further research that could help broaden implementations of the wafer-level vacuum packaging technology.

  1. Wafer-Level Vacuum Packaging of Smart Sensors

    Directory of Open Access Journals (Sweden)

    Allan Hilton

    2016-10-01

    Full Text Available The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors—“low cost” for ubiquitous presence, and “smart” for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging technology of smart sensors. We describe the processes needed to create the wafer-scale vacuum microchambers, focusing on approaches that involve metal seals and that are compatible with the thermal budget of complementary metal-oxide semiconductor (CMOS integrated circuits. We review choices of seal materials and structures that are available to a device designer, and present techniques used for the fabrication of metal seals on device and window wafers. We also analyze the deposition and activation of thin film getters needed to maintain vacuum in the ultra-small chambers, and the wafer-to-wafer bonding processes that form the hermetic seal. We discuss inherent trade-offs and challenges of each seal material set and the corresponding bonding processes. Finally, we identify areas for further research that could help broaden implementations of the wafer-level vacuum packaging technology.

  2. Testing Cosmological Models with Type Ic Super Luminous Supernovae

    CERN Document Server

    Wei, Jun-Jie; Melia, Fulvio

    2015-01-01

    The use of type Ic Super Luminous Supernovae (SLSN Ic) to examine the cosmological expansion introduces a new standard ruler with which to test theoretical models. The sample suitable for this kind of work now includes 11 SLSNe Ic, which have thus far been used solely in tests involving $\\Lambda$CDM. In this paper, we broaden the base of support for this new, important cosmic probe by using these observations to carry out a one-on-one comparison between the $R_{\\rm h}=ct$ and $\\Lambda$CDM cosmologies. We individually optimize the parameters in each cosmological model by minimizing the $\\chi^{2}$ statistic. We also carry out Monte Carlo simulations based on these current SLSN Ic measurements to estimate how large the sample would have to be in order to rule out either model at a $\\sim 99.7\\%$ confidence level. The currently available sample indicates a likelihood of $\\sim$$70-80\\%$ that the $R_{\\rm h}=ct$ Universe is the correct cosmology versus $\\sim$$20-30\\%$ for the standard model. These results are suggest...

  3. Round Robin analysis of G Ic interlaminar fracture test

    Science.gov (United States)

    Davies, P.

    1996-05-01

    This note presents the results of an exercise to evaluate the variation in values of G Ic at initiation, determined independently by 36 researchers interpreting the same load-displacement curve from a mode I double cantilever beam (DCB) test on unidirectional carbon fibre reinforced polymer composite. The results indicate a significantly larger coefficient of variation for values corresponding to a definition of initiation at non-linearity on the load-displacement curve than for a 5% compliance offset criterion.

  4. Construction Progress of the S-IC Test Stand

    Science.gov (United States)

    1961-01-01

    At its founding, the Marshall Space Flight Center (MSFC) inherited the Army's Jupiter and Redstone test stands, but much larger facilities were needed for the giant stages of the Saturn V. From 1960 to 1964, the existing stands were remodeled and a sizable new test area was developed. The new comprehensive test complex for propulsion and structural dynamics was unique within the nation and the free world, and they remain so today because they were constructed with foresight to meet the future as well as on going needs. Construction of the S-IC Static test stand complex began in 1961 in the west test area of MSFC, and was completed in 1964. The S-IC static test stand was designed to develop and test the 138-ft long and 33-ft diameter Saturn V S-IC first stage, or booster stage, weighing in at 280,000 pounds. Required to hold down the brute force of a 7,500,000-pound thrust produced by 5 F-1 engines, the S-IC static test stand was designed and constructed with the strength of hundreds of tons of steel and 12,000,000 pounds of cement, planted down to bedrock 40 feet below ground level. The foundation walls, constructed with concrete and steel, are 4 feet thick. The base structure consists of four towers with 40-foot-thick walls extending upward 144 feet above ground level. The structure was topped by a crane with a 135-foot boom. With the boom in the upright position, the stand was given an overall height of 405 feet, placing it among the highest structures in Alabama at the time. This photo shows the construction progress of the test stand as of August 14, 1961. Water gushing in from the disturbance of a natural spring contributed to constant water problems during the construction process. It was necessary to pump water from the site on a daily basis and is still pumped from the site today. The equipment is partially submerged in the water emerging from the spring.

  5. IC Treatment: Surgical Procedures

    Science.gov (United States)

    ... Complicated IC Cases Promising IC Diagnostic Tests Wrong Diagnosis IC Treatment Guideline IC Treatments IC Diet & Self Management Physical Therapy Antidepressants Antihistamines Pentosan Polysulfate Sodium Bladder Instillations Immunosuppresants ...

  6. IC: Frequently Asked Questions

    Science.gov (United States)

    ... Complicated IC Cases Promising IC Diagnostic Tests Wrong Diagnosis IC Treatment Guideline IC Treatments IC Diet & Self Management Physical Therapy Antidepressants Antihistamines Pentosan Polysulfate Sodium Bladder Instillations Immunosuppresants ...

  7. IC Treatment: Antihistamines

    Science.gov (United States)

    ... Complicated IC Cases Promising IC Diagnostic Tests Wrong Diagnosis IC Treatment Guideline IC Treatments IC Diet & Self Management Physical Therapy Antidepressants Antihistamines Pentosan Polysulfate Sodium Bladder Instillations Immunosuppresants ...

  8. Men and IC

    Science.gov (United States)

    ... Complicated IC Cases Promising IC Diagnostic Tests Wrong Diagnosis IC Treatment Guideline IC Treatments IC Diet & Self Management Physical Therapy Antidepressants Antihistamines Pentosan Polysulfate Sodium Bladder Instillations Immunosuppresants ...

  9. General IC Symptoms

    Science.gov (United States)

    ... Complicated IC Cases Promising IC Diagnostic Tests Wrong Diagnosis IC Treatment Guideline IC Treatments IC Diet & Self Management Physical Therapy Antidepressants Antihistamines Pentosan Polysulfate Sodium Bladder Instillations Immunosuppresants ...

  10. Children and IC

    Science.gov (United States)

    ... Complicated IC Cases Promising IC Diagnostic Tests Wrong Diagnosis IC Treatment Guideline IC Treatments IC Diet & Self Management Physical Therapy Antidepressants Antihistamines Pentosan Polysulfate Sodium Bladder Instillations Immunosuppresants ...

  11. Study on localized induction heating for wafer level packaging

    Institute of Scientific and Technical Information of China (English)

    2010-01-01

    Micro-electro-mechanical systems(MEMS)are being developed as a new multi-disciplinary technology,which will undoubtedly have a revolutionary impact on the future of human life.However,with the development of MEMS technology,the packaging has become the main technical obstacle to the commercialization of MEMS.An approach to MEMS packaging by high-frequency electromagnetic induction heating at wafer level is presented in terms of numerical simulation and experimental study.The structure of inductor is firstly designed and optimized.Then the heating situation of PCB board is verified.The results indicate that the heat impact on the chip during the packaging process can be effectively reduced by local induction heating packaging,therefore the thermal stress on the chip is considerably lowered.This method can effectively improve the reliability of the MEMS devices.

  12. Wafer level bonding using localized radio-frequency induction heating

    Institute of Scientific and Technical Information of China (English)

    2010-01-01

    A wafer level bonding technique by localized induction heating has been developed and demonstrated in this paper.A suitable fabrication process scheme has also been established for the localized induction heating and bonding.It takes only about 20 seconds to complete the bonding process.The temperatures of solder loops and the central area of solder loops are above 300°C and below 70°C,respectively.Due to the solder reflow,robust and hermetic glass wafer bonding is accomplished,and the average tensile strength is 6.42 MPa.Under-heated or over-heated bonding has been found to result in cracks at bonding interfaces and sputtering layer,which degrades the bonding qualities.

  13. Characterization of wafer-level bonded hermetic packages using optical leak detection

    Science.gov (United States)

    Duan, Ani; Wang, Kaiying; Aasmundtveit, Knut; Hoivik, Nils

    2009-07-01

    For MEMS devices required to be operated in a hermetic environment, one of the main reliability issues is related to the packaging methods applied. In this paper, an optical method for testing low volume hermetic cavities formed by anodic bonding between glass and SOI (silicon on insulator) wafer is presented. Several different cavity-geometry structures have been designed, fabricated and applied to monitor the hermeticity of wafer level anodic bonding. SOI wafer was used as the cap wafer on which the different-geometry structures were fabricated using standard MEMS technology. The test cavities were bonded using SOI wafers to glass wafers at 400C and 1000mbar pressure inside a vacuum bonding chamber. The bonding voltage varies from 200V to 600V. The bonding strength between glass and SOI wafer was mechanically tested using shear tester. The deformation amplitudes of the cavity cap surface were monitored by using an optical interferometer. The hermeticity of the glass-to-SOI wafer level bonding was characterized through observing the surface deformation in a 6 months period in atmospheric environment. We have observed a relatively stable micro vacuum-cavity.

  14. IC Compatible Wafer Level Fabrication of Silicon Nanowire Field Effect Transistors for Biosensing Applications

    NARCIS (Netherlands)

    Moh, T.S.Y.

    2013-01-01

    In biosensing, nano-devices such as Silicon Nanowire Field Effect Transistors (SiNW FETs) are promising components/sensors for ultra-high sensitive detection, especially when samples are low in concentration or a limited volume is available. Current processing of SiNW FETs often relies on expensive

  15. IC Compatible Wafer Level Fabrication of Silicon Nanowire Field Effect Transistors for Biosensing Applications

    NARCIS (Netherlands)

    Moh, T.S.Y.

    2013-01-01

    In biosensing, nano-devices such as Silicon Nanowire Field Effect Transistors (SiNW FETs) are promising components/sensors for ultra-high sensitive detection, especially when samples are low in concentration or a limited volume is available. Current processing of SiNW FETs often relies on expensive

  16. Wafer-level manufacturing technology of glass microlenses

    Science.gov (United States)

    Gossner, U.; Hoeftmann, T.; Wieland, R.; Hansch, W.

    2014-08-01

    In high-tech products, there is an increasing demand to integrate glass lenses into complex micro systems. Especially in the lighting industry LEDs and laser diodes used for automotive applications require encapsulated micro lenses. To enable low-cost production, manufacturing of micro lenses on wafer level base using a replication technology is a key technology. This requires accurate forming of thousands of lenses with a diameter of 1-2 mm on a 200 mm wafer compliant with mass production. The article will discuss the technical aspects of a lens manufacturing replication process and the challenges, which need to be solved: choice of an appropriate master for replication, thermally robust interlayer coating, choice of replica glass, bonding and separation procedure. A promising approach for the master substrate material is based on a lens structured high-quality glass wafer with high melting point covered by a coating layer of amorphous silicon or germanium. This layer serves as an interlayer for the glass bonding process. Low pressure chemical vapor deposition and plasma enhanced chemical vapor deposition processes allow a deposition of layer coatings with different hydrogen and doping content influencing their chemical and physical behavior. A time reduced molding process using a float glass enables the formation of high quality lenses while preserving the recyclability of the mother substrate. The challenge is the separation of the replica from the master mold. An overview of chemical methods based on optimized etching of coating layer through small channels will be given and the impact of glass etching on surface roughness is discussed.

  17. A wafer-level 3D packaging structure with Benzocyclobutene as a dielectric for multichip module fabrication

    Energy Technology Data Exchange (ETDEWEB)

    Geng Fei; Ding Xiaoyun; Xu Gaowei; Luo Le, E-mail: leluo@mail.sim.ac.c [Graduate University of the Chinese Academy of Sciences, Beijing 100049 (China)

    2009-10-15

    A new wafer-level 3D packaging structure with Benzocyclobutene (BCB) as interlayer dielectrics (ILDs) for multichip module fabrication is proposed for application in the Ku-band wave. The packaging structure consists of two layers of BCB films and three layers of metallized films, in which the monolithic microwave IC (MMIC), thin film resistors, striplines and microstrip lines are integrated. Wet etched cavities fabricated on the silicon substrate are used for mounting active and passive components. BCB layers cover the components and serve as ILDs for interconnections. Gold bumps are used as electric interconnections between different layers, which eliminates the need to prepare vias by costly dry etching and deposition processes. In order to get high-quality BCB films for the subsequent chemical mechanical planarization (CMP) and multilayer metallization processes, the BCB curing profile is optimized and the roughness of the BCB film after the CMP process is kept lower than 10 nm. The thermal, mechanical and electrical properties of the packaging structure are investigated. The thermal resistance can be controlled below 2 {sup 0}C/W. The average shear strength of the gold bumps on the BCB surface is around 70 N/mm{sup 2}. The performances of MMIC and interconnection structure at high frequencies are optimized and tested. The S-parameters curves of the packaged MMIC shift slightly showing perfect transmission character. The insertion loss change after the packaging process is less than 1 dB range at the operating frequency and the return loss is less than -8 dB from 10 to 15 GHz.

  18. [Study on cytotoxicity tests of medical devices based on IC50].

    Science.gov (United States)

    Liu, Chenghu; Wu, Shifu; Hou, Li; Wang, Xin; Wang, Luanluan; Shi, Yanping

    2014-11-01

    To discuss IC50 application in cytotoxicity tests of medical devices, we firstly investigated the vibrating condition and endpoint of MTT method specified in ISO 10993-5: 2009. Furthermore, we demonstrated the application of IC50 in the result evaluation of MTT method. The experimental results show that usage of IC50 in quantitative evaluation of MTT method is feasible.

  19. Wafer-level fabrication of arrays of glass lens doublets

    Science.gov (United States)

    Passilly, Nicolas; Perrin, Stéphane; Albero, Jorge; Krauter, Johann; Gaiffe, Olivier; Gauthier-Manuel, Ludovic; Froehly, Luc; Lullin, Justine; Bargiel, Sylwester; Osten, Wolfgang; Gorecki, Christophe

    2016-04-01

    Systems for imaging require to employ high quality optical components in order to dispose of optical aberrations and thus reach sufficient resolution. However, well-known methods to get rid of optical aberrations, such as aspherical profiles or diffractive corrections are not easy to apply to micro-optics. In particular, some of these methods rely on polymers which cannot be associated when such lenses are to be used in integrated devices requiring high temperature process for their further assembly and separation. Among the different approaches, the most common is the lens splitting that consists in dividing the focusing power between two or more optical components. In here, we propose to take advantage of a wafer-level technique, devoted to the generation of glass lenses, which involves thermal reflow in silicon cavities to generate lens doublets. After the convex lens sides are generated, grinding and polishing of both stack sides allow, on the first hand, to form the planar lens backside and, on the other hand, to open the silicon cavity. Nevertheless, silicon frames are then kept and thinned down to form well-controlled and auto-aligned spacers between the lenses. Subsequent accurate vertical assembly of the glass lens arrays is performed by anodic bonding. The latter ensures a high level of alignment both laterally and axially since no additional material is required. Thanks to polishing, the generated lens doublets are then as thin as several hundreds of microns and compatible with micro-opto-electro-systems (MOEMS) technologies since they are only made of glass and silicon. The generated optical module is then robust and provide improved optical performances. Indeed, theoretically, two stacked lenses with similar features and spherical profiles can be almost diffraction limited whereas a single lens characterized by the same numerical aperture than the doublet presents five times higher wavefront error. To demonstrate such assumption, we fabricated glass

  20. Sputtered Encapsulation as Wafer Level Packaging for Isolatable MEMS Devices: A Technique Demonstrated on a Capacitive Accelerometer

    Directory of Open Access Journals (Sweden)

    Azrul Azlan Hamzah

    2008-11-01

    Full Text Available This paper discusses sputtered silicon encapsulation as a wafer level packaging approach for isolatable MEMS devices. Devices such as accelerometers, RF switches, inductors, and filters that do not require interaction with the surroundings to function, could thus be fully encapsulated at the wafer level after fabrication. A MEMSTech 50g capacitive accelerometer was used to demonstrate a sputtered encapsulation technique. Encapsulation with a very uniform surface profile was achieved using spin-on glass (SOG as a sacrificial layer, SU-8 as base layer, RF sputtered silicon as main structural layer, eutectic gold-silicon as seal layer, and liquid crystal polymer (LCP as outer encapsulant layer. SEM inspection and capacitance test indicated that the movable elements were released after encapsulation. Nanoindentation test confirmed that the encapsulated device is sufficiently robust to withstand a transfer molding process. Thus, an encapsulation technique that is robust, CMOS compatible, and economical has been successfully developed for packaging isolatable MEMS devices at the wafer level.

  1. Ultraclean wafer-level vacuum-encapsulated silicon ring resonators for timing and frequency references

    Science.gov (United States)

    Xereas, George; Chodavarapu, Vamsy P.

    2016-07-01

    We present the design and development of breath-mode silicon ring resonators fabricated using a commercial pure-play microfabrication process that provides ultraclean wafer-level vacuum-encapsulation. The micromechanical resonators are fabricated in MEMS integrated design for inertial sensors process that is developed by Teledyne DALSA Semiconductor Inc. The ring resonators are designed to operate with a relatively low DC polarization voltage, starting at 5 V, while providing a high frequency-quality factor product. We study the quality of the vacuum packaging using an automated testing setup over an extended time period. We study the effect of motional resistance on the performance of MEMS resonators. The fabricated devices had a resonant frequency of 10 MHz with the quality factor exceeding 8.4×104.

  2. Selective low temperature microcap packaging technique through flip chip and wafer level alignment

    Science.gov (United States)

    Pan, C. T.

    2004-04-01

    In this study, a new technique of selective microcap bonding for packaging 3-D MEMS (Micro Electro Mechanical Systems) devices is presented. Microcap bonding on a selected area of the host wafer was successfully demonstrated through flip chip and wafer level alignment. A passivation treatment was developed to separate the microcap from the carrier wafer. A thick metal nickel (Ni) microcap was fabricated by an electroplating process. Its stiffness is superior to that of thin film poly-silicon made by the surface micromachining technique. For the selective microcap packaging process, photo definable materials served as the intermediate adhesive layer between the host wafer and the metal microcap on the carrier wafer. Several types of photo definable material used as the adhesive layer were tested and characterized for bonding strength. The experimental result shows that excellent bonding strength at low bonding temperature can be achieved.

  3. Wafer-Level 3D Integration for ULSI Interconnects

    Science.gov (United States)

    Gutmann, Ronald J.; Lu, Jian-Qiang

    Three-dimensional (3D) integration in a system-in-a-package (SiP) implementation (packaging-based 3D) is becoming increasingly used in consumer, computer, and communication applications where form factor is critical. In particular, the hand-held market for a growing myriad of voice, data, messaging, and imaging products is enabled by packaging-based 3D integration (i.e., stacking and connecting individual chips). The key drivers are for increased memory capacity and for heterogeneous integration of different IC technologies and functions.

  4. Industry-Oriented Laboratory Development for Mixed-Signal IC Test Education

    Science.gov (United States)

    Hu, J.; Haffner, M.; Yoder, S.; Scott, M.; Reehal, G.; Ismail, M.

    2010-01-01

    The semiconductor industry is lacking qualified integrated circuit (IC) test engineers to serve in the field of mixed-signal electronics. The absence of mixed-signal IC test education at the collegiate level is cited as one of the main sources for this problem. In response to this situation, the Department of Electrical and Computer Engineering at…

  5. ICTSSE:An Object—Oriented IC Test Software Supporting Environment

    Institute of Scientific and Technical Information of China (English)

    孙育宁; 王晓明; 等

    1995-01-01

    An IC test software supporting environment-ICTSSE,which supports the migration and simulation of test pattern programs on heterogeneous ATEs,is presented.ICTSSE is a subsystem of Test Development System (TeDS).It has the capabilities of verifying the IC's stimulus/response vectors and associated timing resources against the target ATE.The general data interchange format,which is the center of the TeDS,is built for test pattern migration.

  6. Development of wafer-level-packaging technology for simultaneous sealing of accelerometer and gyroscope under different pressures

    Science.gov (United States)

    Aono, T.; Suzuki, K.; Kanamaru, M.; Okada, R.; Maeda, D.; Hayashi, M.; Isono, Y.

    2016-10-01

    This research demonstrates a newly developed anodic bonding-based wafer-level-packaging technique to simultaneously seal an accelerometer in the atmosphere and a gyroscope in a vacuum with a glass cap for micro-electromechanical systems sensors. It is necessary for the accelerometer, with a damping oscillator, to be sealed in the atmosphere to achieve a high-speed response. As the gyroscope can achieve high sensitivity with a large displacement at the resonant frequency without air-damping, the gyroscope must be sealed in a vacuum. The technique consists of three processing steps: the first bonding step in the atmosphere for the accelerometer, the pressure control step and the second bonding step in a vacuum for the gyroscope. The process conditions were experimentally determined to achieve higher shear strength at the interface of the packaging. The packaging performance of the accelerometer and gyroscope after wafer-level packaging was also investigated using a laser Doppler velocimeter at room temperature. The amplitude at the resonant frequency of the accelerometer was reduced by air damping, and the quality factor of the gyroscope showed a value higher than 1000. The reliability of the gyroscope was also confirmed by a thermal cyclic test and an endurance test at high humidity and high temperature.

  7. Through-glass copper via using the glass reflow and seedless electroplating processes for wafer-level RF MEMS packaging

    Science.gov (United States)

    Lee, Ju-Yong; Lee, Sung-Woo; Lee, Seung-Ki; Park, Jae-Hyoung

    2013-08-01

    We present a novel method for the fabrication of void-free copper-filled through-glass-vias (TGVs), and their application to the wafer-level radio frequency microelectromechanical systems (RF MEMS) packaging scheme. By using the glass reflow process with a patterned silicon mold, a vertical TGV with smooth sidewall and fine pitch could be achieved. Bottom-up void-free filling of the TGV is successfully demonstrated through the seedless copper electroplating process. In addition, the proposed process allows wafer-level packaging with glass cap encapsulation using the anodic bonding process, since the reflowed glass interposer is only formed in the device area surrounded with silicon substrate. A simple coplanar waveguide (CPW) line was employed as the packaged device to evaluate the electrical characteristics and thermo-mechanical reliability of the proposed packaging structure. The fabricated packaging structure showed a low insertion loss of 0.116 dB and a high return loss of 35.537 dB at 20 GHz, which were measured through the whole electrical path, including the CPW line, TGVs and contact pads. An insertion loss lower than 0.1 dB and a return loss higher than 30 dB could be achieved at frequencies of up to 15 GHz, and the resistance of the single copper via was measured to be 36 mΩ. Furthermore, the thermo-mechanical reliability of the proposed packaging structure was also verified through thermal shock and pressure cooker test.

  8. Reliability and Characteristics of Wafer-Level Chip-Scale Packages under Current Stress

    Science.gov (United States)

    Chen, Po-Ying; Kung, Heng-Yu; Lai, Yi-Shao; Hsiung Tsai, Ming; Yeh, Wen-Kuan

    2008-02-01

    In this work, we present a novel approach and method for elucidating the characteristics of wafer-level chip-scale packages (WLCSPs) for electromigration (EM) tests. The die in WLCSP was directly attached to the substrate via a soldered interconnect. The shrinking of the area of the die that is available for power, and the solder bump also shrinks the volume and increases the density of electrons for interconnect efficiency. The bump current density now approaches to 106 A/cm2, at which point the EM becomes a significant reliability issue. As known, the EM failure depends on numerous factors, including the working temperature and the under bump metallization (UBM) thickness. A new interconnection geometry is adopted extensively with moderate success in overcoming larger mismatches between the displacements of components during current and temperature changes. Both environments and testing parameters for WLCSP are increasingly demanded. Although failure mechanisms are considered to have been eliminated or at least made manageable, new package technologies are again challenging its process, integrity and reliability. WLCSP technology was developed to eliminate the need for encapsulation to ensure compatibility with smart-mount technology (SMT). The package has good handing properties but is now facing serious reliability problems. In this work, we investigated the reliability of a WLCSP subjected to different accelerated current stressing conditions at a fixed ambient temperature of 125 °C. A very strong correlation exists between the mean time to failure (MTTF) of the WLCSP test vehicle and the mean current density that is carried by a solder joint. A series of current densities were applied to the WLCSP architecture; Black's power law was employed in a failure mode simulation. Additionally, scanning electron microscopy (SEM) was adopted to determine the differences existing between high- and low-current-density failure modes.

  9. Si-gold-glass hybrid wafer bond for 3D-MEMS and wafer level packaging

    Science.gov (United States)

    Reddy, Jayaprakash; Pratap, Rudra

    2017-01-01

    We report a relatively low temperature (MEMS device integration and wafer level packaging. We demonstrate the process by realizing a simple MEMS cantilever beam and a complex MEMS gyroscope structure. These structures are characterized for ohmic contact and electromechanical response to verify the electrical interconnect and the mechanical strength of the structure at the bond interface.

  10. Wafer-level heterogeneous 3D integration for MEMS and NEMS

    OpenAIRE

    Niklaus, Frank; Lapisa, Martin; Bleiker, Simon J.; Dubois, Valentin; Roxhed, Niclas; Fischer, Andreas C.; Forsberg, Fredrik; Stemme, Goran; Grogg, Daniel; Despont, Michel

    2012-01-01

    In this paper the state-of-the-art in wafer-level heterogeneous 3D integration technologies for micro-electromechanical systems (MEMS) and nano-electromechanical systems (NEMS) is reviewed. Various examples of commercial and experimental heterogeneous 3D integration processes for MEMS and NEMS devices are presented and discussed. QC 20120907

  11. Wafer-level assembly and sealing of a MEMS nanoreactor for in situ microscopy

    NARCIS (Netherlands)

    Mele, L.; Santagata, F.; Panraud, G.; Morana, B.; Tichelaar, F.D.; Creemer, J.F.; Sarro, P.M.

    2010-01-01

    This paper presents a new process for the fabrication of MEMS-based nanoreactors for in situ atomic-scale imaging of nanoparticles under relevant industrial conditions. The fabrication of the device is completed fully at wafer level in an ISO 5 clean room and it is based on silicon fusion bonding

  12. Test impact on the overall die-to-wafer 3D stacked IC cost

    NARCIS (Netherlands)

    Taouil, M.; Hamdioui, S.; Beenakker, K.; Marinissen, E.J.

    2011-01-01

    One of the key challenges in 3D Stacked-ICs (3D-SIC) is to guarantee high product quality at minimal cost. Quality is mostly determined by the applied tests and cost trade-offs. Testing 3D-SICs is very challenging due to several additional test moments for the mid-bond stacks, i.e., partially

  13. Test impact on the overall die-to-wafer 3D stacked IC cost

    NARCIS (Netherlands)

    Taouil, M.; Hamdioui, S.; Beenakker, K.; Marinissen, E.J.

    2011-01-01

    One of the key challenges in 3D Stacked-ICs (3D-SIC) is to guarantee high product quality at minimal cost. Quality is mostly determined by the applied tests and cost trade-offs. Testing 3D-SICs is very challenging due to several additional test moments for the mid-bond stacks, i.e., partially create

  14. A Versatile Mixed-Signal Pin Approach for Cost-Effective Test of Automotive ICs

    Institute of Scientific and Technical Information of China (English)

    Credence Systems Corporation

    2004-01-01

    @@ Integrated circuits (ICs) intended for increasingly sophisticated automotive applications bring unique test demands. Advanced ICs for applications such as highly integrated automatic braking system (ABS) and airbag controllers combine high voltage digital channels, significant VI demands and precise timing capability. Along with continued missioncritical reliability concerns, the trend toward higher voltage operation and increased device integration requires specialized test capabilities able to extend across the wide operating ranges found in automotive applications. Among these capabilities, automotive test requirements increasingly dictate a need for a cost-effective versatile mixed-signal pin electronics with very high data rates reaching up to 50MHz with a voltage swing of-2 V to +28 V.

  15. Construction Progress of the S-IC Test Stand-Excavation

    Science.gov (United States)

    1961-01-01

    At its founding, the Marshall Space Flight Center (MSFC) inherited the Army's Jupiter and Redstone test stands, but much larger facilities were needed for the giant stages of the Saturn V. From 1960 to 1964, the existing stands were remodeled and a sizable new test area was developed. The new comprehensive test complex for propulsion and structural dynamics was unique within the nation and the free world, and they remain so today because they were constructed with foresight to meet the future as well as on going needs. Construction of the S-IC Static test stand complex began in 1961 in the west test area of MSFC, and was completed in 1964. The S-IC static test stand was designed to develop and test the 138-ft long and 33-ft diameter Saturn V S-IC first stage, or booster stage, weighing in at 280,000 pounds. Required to hold down the brute force of a 7,500,000-pound thrust produced by 5 F-1 engines, the S-IC static test stand was designed and constructed with the strength of hundreds of tons of steel and 12,000,000 pounds of cement, planted down to bedrock 40 feet below ground level. The foundation walls, constructed with concrete and steel, are 4 feet thick. The base structure consists of four towers with 40-foot-thick walls extending upward 144 feet above ground level. The structure was topped by a crane with a 135-foot boom. With the boom in the upright position, the stand was given an overall height of 405 feet, placing it among the highest structures in Alabama at the time. In this photo, taken July 13, 1961, progress is made with the excavation and preparation of the S-IC test stand site.

  16. Wafer-level vacuum packaging for an optical readout bi-material cantilever infrared FPA

    Science.gov (United States)

    Li, Shuyu; Zhou, Xiaoxiong; Yu, Xiaomei

    2013-12-01

    In this paper, we report the design and fabrication of an uncooled infrared (IR) focal plane array (FPA) on quartz substrate and the wafer-level vacuum packaging for the IR FPA in view of an optical readout method. This FPA is composed of bi-material cantilever array which fabricated by the Micro-Electro Mechanical System (MEMS) technology, and the wafer-level packaging of the IR FPA is realized based on AuSn solder bonding technique. The interface of soldering is observed by scan electron microscope (SEM), which indicates that bonding interface is smooth and with no bubbles. The air leakage rate of packaged FPA is measured to be 1.3×10-9 atm·cc/s.

  17. Wafer-Level Patterned and Aligned Polymer Nanowire/Micro- and Nanotube Arrays on any Substrate

    KAUST Repository

    Morber, Jenny Ruth

    2009-05-25

    A study was conducted to fabricate wafer-level patterned and aligned polymer nanowire (PNW), micro- and nanotube arrays (PNT), which were created by exposing the polymer material to plasma etching. The approach for producing wafer-level aligned PNWs involved a one-step inductively coupled plasma (ICP) reactive ion etching process. The polymer nanowire array was fabricated in an ICP reactive ion milling chamber with a pressure of 10mTorr. Argon (Ar), O 2, and CF4 gases were released into the chamber as etchants at flow rates of 15 sccm, 10 sccm, and 40 sccm. Inert gasses, such as Ar-form positive ions were incorporated to serve as a physical component to assist in the material degradation process. One power source (400 W) was used to generate dense plasma from the input gases, while another power source applied a voltage of approximately 600V to accelerate the plasma toward the substrate.

  18. A Lateral Differential Resonant Pressure Microsensor Based on SOI-Glass Wafer-Level Vacuum Packaging

    OpenAIRE

    Bo Xie; Yonghao Xing; Yanshuang Wang; Jian Chen; Deyong Chen; Junbo Wang

    2015-01-01

    This paper presents the fabrication and characterization of a resonant pressure microsensor based on SOI-glass wafer-level vacuum packaging. The SOI-based pressure microsensor consists of a pressure-sensitive diaphragm at the handle layer and two lateral resonators (electrostatic excitation and capacitive detection) on the device layer as a differential setup. The resonators were vacuum packaged with a glass cap using anodic bonding and the wire interconnection was realized using a mask-free ...

  19. Construction Progress of the S-IC Test Stand-Foundation

    Science.gov (United States)

    1961-01-01

    At its founding, the Marshall Space Flight Center (MSFC) inherited the Army's Jupiter and Redstone test stands, but much larger facilities were needed for the giant stages of the Saturn V. From 1960 to 1964, the existing stands were remodeled and a sizable new test area was developed. The new comprehensive test complex for propulsion and structural dynamics was unique within the nation and the free world, and they remain so today because they were constructed with foresight to meet the future as well as on going needs. Construction of the S-IC Static test stand complex began in 1961 in the west test area of MSFC, and was completed in 1964. The S-IC static test stand was designed to develop and test the 138-ft long and 33-ft diameter Saturn V S-IC first stage, or booster stage, weighing in at 280,000 pounds. Required to hold down the brute force of a 7,500,000-pound thrust produced by 5 F-1 engines, the S-IC static test stand was designed and constructed with the strength of hundreds of tons of steel and 12,000,000 pounds of cement, planted down to bedrock 40 feet below ground level. The foundation walls, constructed with concrete and steel, are 4 feet thick. The base structure consists of four towers with 40-foot-thick walls extending upward 144 feet above ground level. The structure was topped by a crane with a 135-foot boom. With the boom in the upright position, the stand was given an overall height of 405 feet, placing it among the highest structures in Alabama at the time. This photo, taken September 29, 1961, shows the progress of the concrete walls for the stand's foundation. Some of the walls have been poured and some of the concrete forms have been removed.

  20. IC Treatment: Antidepressants

    Science.gov (United States)

    ... restrictions than MAOIs. Studies Testing Antidepressants to Treat IC With the exception of the TCA called amitriptyline ( ... when you have IC). Antidepressants Used to Treat IC Some of the current antidepressants your physician may ...

  1. Ultra-thin wafer-level camera with 720p resolution using micro-optics

    Science.gov (United States)

    Brückner, Andreas; Oberdörster, Alexander; Dunkel, Jens; Reimann, Andreas; Müller, Martin; Wippermann, Frank

    2014-09-01

    We propose a microoptical approach to ultra-compact optics for real-time vision systems that are inspired by the compound eyes of insects. The demonstrated module achieves 720p resolution with a total track length of 2.0 mm which is about 1.5 times shorter than comparable conventional miniaturized optics. The partial images that are separately recorded in multiple optical channels are stitched together to form a final image of the whole FOV by means of image processing. The microlens arrays are realized by microoptical fabrication techniques on wafer-level which are suitable for a potential application in high volume e.g. for consumer electronic products.

  2. Use of nanoporous columnar thin film in the wafer-level packaging of MEMS devices

    Science.gov (United States)

    Lee, Byung-Kee; Choi, Dong-Hoon; Yoon, Jun-Bo

    2010-04-01

    This paper presents a new packaging technology that uses a nanoporous columnar thin film to seal microelectromechanical system (MEMS) devices at the wafer level. In the proposed packaging process, the processing temperature is 350 °C. The process is relatively inexpensive compared to wafer level packaging processes, because the wafer-bonding step is eliminated and the die size is shrunk. In the suggested approach, a sputtered columnar thin film at room temperature forms vertical nanopores as etch holes, and an air cavity is formed by the removal of a sacrificial layer through the nanopores in the columnar membrane. Subsequent hermetic vacuum packaging of the cavity is achieved by depositing thin films over the membrane under low pressure. The hermeticity of the packaging was verified by using an optical surface morphology microscope to measure the deflection change of the sealing membrane before and after breaking of the vacuum through an interconnected membrane. The long-term hermeticity was monitored by measuring the maximum central deflection of the PECVD sealing layer over a period of 170 days. The precise pressure (0.7 Torr) and short-term (30 days) pressure change inside the cavity were measured by encapsulated Ni Pirani gauges, representing packaged freestanding MEMS devices.

  3. Preparation of wafer-level glass cavities by a low-cost chemical foaming process (CFP).

    Science.gov (United States)

    Shang, Jintang; Chen, Boyin; Lin, Wei; Wong, Ching-Ping; Zhang, Di; Xu, Chao; Liu, Junwen; Huang, Qing-An

    2011-04-21

    A novel foaming process-chemical foaming process (CFP)-using foaming agents to fabricate wafer-level micro glass cavities including channels and bubbles was investigated. The process consists of the following steps sequentially: (1) shallow cavities were fabricated by a wet etching on a silicon wafer; (2) powders of a proper foaming agent were placed in a silicon cavity, named 'mother cavity', on the etched silicon surface; (3) the silicon cavities were sealed with a glass wafer by anodic bonding; (4) the bonded wafers were heated to above the softening point of the glass, and baked for several minutes, when the gas released by the decomposition of the foaming agent in the 'mother cavity' went into the other sealed interconnected silicon cavities to foam the softened glass into cylindrical channels named 'daughter channels', or spherical bubbles named 'son bubbles'. Results showed that wafer-level micro glass cavities with smooth wall surfaces were achieved successfully without contamination by the CFP. A model for the CFP was proposed to predict the final shape of the glass cavity. Experimental results corresponded with model predictions. The CFP provides a low-cost avenue to preparation of micro glass cavities of high quality for applications such as micro-reactors, micro total analysis systems (μTAS), analytical and bio-analytical applications, and MEMS packaging.

  4. Wafer-level chip-scale packaging analog and power semiconductor applications

    CERN Document Server

    Qu, Shichun

    2015-01-01

    This book presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability, and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials, and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical, and stress modeling methodologies is also provided. This book also: ·         Covers the development of wafer-level power discrete packaging with regular wafer-level design concepts and directly bumping technology ·    �...

  5. Fabrication and Analysis of Micro Contact Based Probe Cell for IC Testing

    Directory of Open Access Journals (Sweden)

    M. Idzdihar Idris

    2015-06-01

    Full Text Available This study presents the fabrication process and analysis of micro contact probe cell for IC testing deposited by dc sputtering technique on a glass substrate. It is designed to solve and replace pogo pins in IC testing process. In previous study, the new model of test socket with new materials in different shapes were designed by using ANSYS as Finite Element Analysis (FEA software and the best parameter were obtained. According to the optimized parameters, prototype structures of the micro-contacts are fabricated using DC Sputtering with materials like copper and tungsten on base copper on glass substrates. Micro contact with thickness of 2800-7000 nm were successively deposited on glass substrate at sputtering power of 125 W in argon ambient gas with pressure of 10-15multiply 10-3 Torr at a room temperature. The structural and electrical properties of micro contact were investigated by using profilometer, Scanning Electron Microscopy (SEM, Atomic Force Microscopy (AFM and four point probes. Results show that the film thickness increased as the deposition the time getting longer. The Root Mean Square (RMS roughnesses obtained are all in a good quality. On the other hand, the resistivity of micro contacts was less than 4 u&Omega-cm, which has good conductive properties. Consequently, this design is appropriate for replacing the conventional pogo pin based testing tools.

  6. A Lateral Differential Resonant Pressure Microsensor Based on SOI-Glass Wafer-Level Vacuum Packaging.

    Science.gov (United States)

    Xie, Bo; Xing, Yonghao; Wang, Yanshuang; Chen, Jian; Chen, Deyong; Wang, Junbo

    2015-09-21

    This paper presents the fabrication and characterization of a resonant pressure microsensor based on SOI-glass wafer-level vacuum packaging. The SOI-based pressure microsensor consists of a pressure-sensitive diaphragm at the handle layer and two lateral resonators (electrostatic excitation and capacitive detection) on the device layer as a differential setup. The resonators were vacuum packaged with a glass cap using anodic bonding and the wire interconnection was realized using a mask-free electrochemical etching approach by selectively patterning an Au film on highly topographic surfaces. The fabricated resonant pressure microsensor with dual resonators was characterized in a systematic manner, producing a quality factor higher than 10,000 (~6 months), a sensitivity of about 166 Hz/kPa and a reduced nonlinear error of 0.033% F.S. Based on the differential output, the sensitivity was increased to two times and the temperature-caused frequency drift was decreased to 25%.

  7. Small footprint wafer-level vacuum packaging using compressible gold sealing rings

    Science.gov (United States)

    Antelius, Mikael; Stemme, Göran; Niklaus, Frank

    2011-08-01

    A novel low-temperature wafer-level vacuum packaging process is presented. The process uses plastically deformed gold rings as sealing structures in combination with flux-free soldering to provide the bond force for a sealing wafer. This process enables the separation of the sealing and the bonding functions both spatially on the wafer and temporally in different process steps, which results in reduced areas for the sealing rings and prevents outgassing from the solder process in the cavity. This enables space savings and yields improvements. We show the experimental result of the hermetic sealing. The leak rate into the packages is determined, by measuring the package lid deformation over 10 months, to be lower than 3.5 × 10-13 mbar l s-1, which is suitable for most MEMS packages. The pressure inside the produced packages is measured to be lower than 10 mbar.

  8. Output blue light evaluation for phosphor based smart white LED wafer level packages.

    Science.gov (United States)

    Kolahdouz, Zahra; Rostamian, Ali; Kolahdouz, Mohammadreza; Ma, Teng; van Zeijl, Henk; Zhang, Kouchi

    2016-02-22

    This study presents a blue light detector for evaluating the output light of phosphor based white LED package. It is composed of a silicon stripe-shaped photodiode designed and implemented in a 2 μm BiCMOS process which can be used for wafer level integration of different passive and active devices all in just 5 lithography steps. The final device shows a high selectivity to blue light. The maximum responsivity at 480 nm is matched with the target blue LED illumination. The designed structure have better responsivity compared to simple photodiode structure due to reducing the effect of dead layer formation close to the surface because of implantation. It has also a two-fold increase in the responsivity and quantum efficiency compared to previously similar published sensors.

  9. Effect of permanganate treatment on through mold vias for an embedded wafer level package

    Science.gov (United States)

    Park, Se-Hoon; Park, Ji-Yeon; Kim, Young-Ho

    2013-07-01

    In this study, a through mold via (TMV) interconnect was developed for an embedded wafer level package (EMWLP) to enable 3D packing applications. The effects of the shape and surface roughness of the epoxy molding wafer on the quality of electroless Cu metallization were investigated for the vertical interconnection. The mold compound is a composite material composed of epoxy resin and filler particles. Therefore, the effect of the amount of filler particles was studied to optimize the shape of the epoxy molding by applying two types of laser drilling modes. In addition, the electroless Cu plating process was optimized to deposit a Cu seed layer along the TMV sidewall. To optimize the TMV process, a desmear process was applied to improve the shape of the TMV sidewall and adhesion between the epoxy molding compound and the dielectric polymer for multilayer metallization.

  10. Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

    Directory of Open Access Journals (Sweden)

    Simon J. Bleiker

    2016-10-01

    Full Text Available Device encapsulation and packaging often constitutes a substantial part of the fabrication cost of micro electro-mechanical systems (MEMS transducers and imaging sensor devices. In this paper, we propose a simple and cost-effective wafer-level capping method that utilizes a limited number of highly standardized process steps as well as low-cost materials. The proposed capping process is based on low-temperature adhesive wafer bonding, which ensures full complementary metal-oxide-semiconductor (CMOS compatibility. All necessary fabrication steps for the wafer bonding, such as cavity formation and deposition of the adhesive, are performed on the capping substrate. The polymer adhesive is deposited by spray-coating on the capping wafer containing the cavities. Thus, no lithographic patterning of the polymer adhesive is needed, and material waste is minimized. Furthermore, this process does not require any additional fabrication steps on the device wafer, which lowers the process complexity and fabrication costs. We demonstrate the proposed capping method by packaging two different MEMS devices. The two MEMS devices include a vibration sensor and an acceleration switch, which employ two different electrical interconnection schemes. The experimental results show wafer-level capping with excellent bond quality due to the re-flow behavior of the polymer adhesive. No impediment to the functionality of the MEMS devices was observed, which indicates that the encapsulation does not introduce significant tensile nor compressive stresses. Thus, we present a highly versatile, robust, and cost-efficient capping method for components such as MEMS and imaging sensors.

  11. Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding

    Directory of Open Access Journals (Sweden)

    Koki Tanaka

    2016-12-01

    Full Text Available To increase the yield of the wafer-level Cu-Cu thermo-compression bonding method, certain surface pre-treatment methods for Cu are studied which can be exposed to the atmosphere before bonding. To inhibit re-oxidation under atmospheric conditions, the reduced pure Cu surface is treated by H2/Ar plasma, NH3 plasma and thiol solution, respectively, and is covered by Cu hydride, Cu nitride and a self-assembled monolayer (SAM accordingly. A pair of the treated wafers is then bonded by the thermo-compression bonding method, and evaluated by the tensile test. Results show that the bond strengths of the wafers treated by NH3 plasma and SAM are not sufficient due to the remaining surface protection layers such as Cu nitride and SAMs resulting from the pre-treatment. In contrast, the H2/Ar plasma–treated wafer showed the same strength as the one with formic acid vapor treatment, even when exposed to the atmosphere for 30 min. In the thermal desorption spectroscopy (TDS measurement of the H2/Ar plasma–treated Cu sample, the total number of the detected H2 was 3.1 times more than the citric acid–treated one. Results of the TDS measurement indicate that the modified Cu surface is terminated by chemisorbed hydrogen atoms, which leads to high bonding strength.

  12. Wafer-level hermetic thermo-compression bonding using electroplated gold sealing frame planarized by fly-cutting

    Science.gov (United States)

    Farisi, Muhammad Salman Al; Hirano, Hideki; Frömel, Jörg; Tanaka, Shuji

    2017-01-01

    In this paper, a novel wafer-level hermetic packaging technology for heterogeneous device integration is presented. Hermetic sealing is achieved by low-temperature thermo-compression bonding using electroplated Au micro-sealing frame planarized by single-point diamond fly-cutting. The proposed technology has significant advantages compared to other established processes in terms of integration of micro-structured wafer, vacuum encapsulation and electrical interconnection, which can be achieved at the same time. Furthermore, the technology is also achievable for a bonding frame width as narrow as 30 μm, giving it an advantage from a geometry perspective, and bonding temperatures as low as 300 °C, making it advantageous for temperature-sensitive devices. Outgassing in vacuum sealed cavities is studied and a cavity pressure below 500 Pa is achieved by introducing annealing steps prior to bonding. The pressure of the sealed cavity is measured by zero-balance method utilizing diaphragm-structured bonding test devices. The leak rate into the packages is determined by long-term sealed cavity pressure measurement for 1500 h to be less than 2.0× {{10}-14} Pa m3s-1. In addition, the bonding shear strength is also evaluated to be higher than 100 MPa.

  13. Post-CMOS wafer level growth of carbon nanotubes for low-cost microsensors-a proof of concept

    Energy Technology Data Exchange (ETDEWEB)

    Santra, Sumita; Guha, Prasanta K; Zhong, Guofang; Robertson, John; Milne, William I; Udrea, Florin [Engineering Department, University of Cambridge, 9 JJ Thomson Avenue, Cambridge CB3 0FA (United Kingdom); Ali, Syed Z [Cambridge CMOS Sensors Ltd, Wellington House, East Road, Cambridge CB1 1BH (United Kingdom); Covington, James A; Gardner, Julian W, E-mail: ss778@cam.ac.uk [School of Engineering, University of Warwick, Coventry CV4 7AL (United Kingdom)

    2010-12-03

    Here we demonstrate a novel technique to grow carbon nanotubes (CNTs) on addressable localized areas, at wafer level, on a fully processed CMOS substrate. The CNTs were grown using tungsten micro-heaters (local growth technique) at elevated temperature on wafer scale by connecting adjacent micro-heaters through metal tracks in the scribe lane. The electrical and optical characterization show that the CNTs are identical and reproducible. We believe this wafer level integration of CNTs with CMOS circuitry enables the low-cost mass production of CNT sensors, such as chemical sensors.

  14. Novel Bonding technologies for wafer-level transparent packaging of MOEMS

    CERN Document Server

    Kirchberger, H; Wimpliger, M

    2008-01-01

    Depending on the type of Micro-Electro-Mechanical System (MEMS), packaging costs are contributing up to 80% of the total device cost. Each MEMS device category, its function and operational environment will individually dictate the packaging requirement. Due to the lack of standardized testing procedures, the reliability of those MEMS packages sometimes can only be proven by taking into consideration its functionality over lifetime. Innovation with regards to cost reduction and standardization in the field of packaging is therefore of utmost importance to the speed of commercialisation of MEMS devices. Nowadays heavily driven by consumer applications the MEMS device market is forecasted to enjoy a compound annual growth rate (CAGR) above 13%, which is when compared to the IC device market, an outstanding growth rate. Nevertheless this forecasted value can drift upwards or downwards depending on the rate of innovation in the field of packaging. MEMS devices typically require a specific fabrication process wher...

  15. Robust Wafer-Level Thin-Film Encapsulation (Packaging) of Microstructures (MEMS) using Low Stress PECVD Silicon Carbide

    NARCIS (Netherlands)

    Rajaraman, V.; Pakula, L.S.; Pham, H.T.M.; Sarro, P.M.; French, P.J.

    2009-01-01

    This paper presents a new low-cost, CMOS-compatible and robust wafer-level encapsulation technique developed using a stress-optimised PECVD SiC as the capping and sealing material, imparting harsh environment capability. This technique has been applied for the fabrication and encapsulation of a wide

  16. Robust Wafer-Level Thin-Film Encapsulation (Packaging) of Microstructures (MEMS) using Low Stress PECVD Silicon Carbide

    NARCIS (Netherlands)

    Rajaraman, V.; Pakula, L.S.; Pham, H.T.M.; Sarro, P.M.; French, P.J.

    2009-01-01

    This paper presents a new low-cost, CMOS-compatible and robust wafer-level encapsulation technique developed using a stress-optimised PECVD SiC as the capping and sealing material, imparting harsh environment capability. This technique has been applied for the fabrication and encapsulation of a wide

  17. A Lateral Differential Resonant Pressure Microsensor Based on SOI-Glass Wafer-Level Vacuum Packaging

    Directory of Open Access Journals (Sweden)

    Bo Xie

    2015-09-01

    Full Text Available This paper presents the fabrication and characterization of a resonant pressure microsensor based on SOI-glass wafer-level vacuum packaging. The SOI-based pressure microsensor consists of a pressure-sensitive diaphragm at the handle layer and two lateral resonators (electrostatic excitation and capacitive detection on the device layer as a differential setup. The resonators were vacuum packaged with a glass cap using anodic bonding and the wire interconnection was realized using a mask-free electrochemical etching approach by selectively patterning an Au film on highly topographic surfaces. The fabricated resonant pressure microsensor with dual resonators was characterized in a systematic manner, producing a quality factor higher than 10,000 (~6 months, a sensitivity of about 166 Hz/kPa and a reduced nonlinear error of 0.033% F.S. Based on the differential output, the sensitivity was increased to two times and the temperature-caused frequency drift was decreased to 25%.

  18. A wafer level vacuum encapsulated capacitive accelerometer fabricated in an unmodified commercial MEMS process.

    Science.gov (United States)

    Merdassi, Adel; Yang, Peng; Chodavarapu, Vamsy P

    2015-03-25

    We present the design and fabrication of a single axis low noise accelerometer in an unmodified commercial MicroElectroMechanical Systems (MEMS) process. The new microfabrication process, MEMS Integrated Design for Inertial Sensors (MIDIS), introduced by Teledyne DALSA Inc. allows wafer level vacuum encapsulation at 10 milliTorr which provides a high Quality factor and reduces noise interference on the MEMS sensor devices. The MIDIS process is based on high aspect ratio bulk micromachining of single-crystal silicon layer that is vacuum encapsulated between two other silicon handle wafers. The process includes sealed Through Silicon Vias (TSVs) for compact design and flip-chip integration with signal processing circuits. The proposed accelerometer design is sensitive to single-axis in-plane acceleration and uses a differential capacitance measurement. Over ±1 g measurement range, the measured sensitivity was 1 fF/g. The accelerometer system was designed to provide a detection resolution of 33 milli-g over the operational range of ±100 g.

  19. Fabrication of piezoelectric P(VDF-TrFE) microcantilevers by wafer-level surface micromachining

    Science.gov (United States)

    Oh, Sharon Roslyn; Yao, Kui; Eng Hock Tay, Francis

    2013-09-01

    A wafer-level microfabrication process using standard cleanroom facilities was established and implemented to batch produce free-standing poly(vinylidine fluoride-trifluoroethylene) (P(VDF-TrFE)) piezoelectric microelectromechanical systems cantilevers via surface micromachining. Furthermore, the fabrication of a prototype of double-level cantilevers was demonstrated. The fabrication of working piezoelectric polymer cantilever structures required the deposition and patterning of multiple polymer and metal layers including the pattering and removal of the sacrificial layer, which posed many challenging limitations on the chemicals and processing conditions. Dedicatedly selected chemicals and materials were used in our fabrication, including water soluble PVA with an appropriate molecular weight and degree of hydrolysis as the sacrificial layer for releasing the cantilever structure. The temperature in the whole process was kept low with controlled durations, due to the sensitivity of the polymers to thermal impacts. The P(VDF-TrFE) active layers, after going through the fabrication, exhibited ferroelectric and piezoelectric properties comparable to the intact films. Furthermore, the free-standing P(VDF-TrFE) cantilevers exhibited piezoelectric vibrations under electrical excitation. This low temperature fabrication method, which only involves mild chemicals, also has the potential to be integrated with CMOS processes.

  20. A Wafer Level Vacuum Encapsulated Capacitive Accelerometer Fabricated in an Unmodified Commercial MEMS Process

    Directory of Open Access Journals (Sweden)

    Adel Merdassi

    2015-03-01

    Full Text Available We present the design and fabrication of a single axis low noise accelerometer in an unmodified commercial MicroElectroMechanical Systems (MEMS process. The new microfabrication process, MEMS Integrated Design for Inertial Sensors (MIDIS, introduced by Teledyne DALSA Inc. allows wafer level vacuum encapsulation at 10 milliTorr which provides a high Quality factor and reduces noise interference on the MEMS sensor devices. The MIDIS process is based on high aspect ratio bulk micromachining of single-crystal silicon layer that is vacuum encapsulated between two other silicon handle wafers. The process includes sealed Through Silicon Vias (TSVs for compact design and flip-chip integration with signal processing circuits. The proposed accelerometer design is sensitive to single-axis in-plane acceleration and uses a differential capacitance measurement. Over ±1 g measurement range, the measured sensitivity was 1fF/g. The accelerometer system was designed to provide a detection resolution of 33 milli-g over the operational range of ±100 g.

  1. Compensation Method for Die Shift Caused by Flow Drag Force in Wafer-Level Molding Process

    Directory of Open Access Journals (Sweden)

    Simo Yeon

    2016-05-01

    Full Text Available Wafer-level packaging (WLP is a next-generation semiconductor packaging technology that is important for realizing high-performance and ultra-thin semiconductor devices. However, the molding process, which is a part of the WLP process, has various problems such as a high defect rate and low predictability. Among the various defect factors, the die shift primarily determines the quality of the final product; therefore, predicting the die shift is necessary to achieve high-yield production in WLP. In this study, the die shift caused by the flow drag force of the epoxy molding compound (EMC is evaluated from the die shift of a debonded molding wafer. Experimental and analytical methods were employed to evaluate the die shift occurring during each stage of the molding process and that resulting from the geometrical changes after the debonding process. The die shift caused by the EMC flow drag force is evaluated from the data on die movements due to thermal contraction/expansion and warpage. The relationship between the die shift and variation in the die gap is determined through regression analysis in order to predict the die shift due to the flow drag force. The results can be used for die realignment by predicting and compensating for the die shift.

  2. Molded, wafer level optics for long wave infra-red applications

    Science.gov (United States)

    Franks, John

    2016-05-01

    For many years, the Thermal Imaging market has been driven by the high volume consumer market. The first signs of this came with the launch of night vision systems for cars, first by Cadillac and Honda and then, more successfully by BMW, Daimler and Audi. For the first time, simple thermal imaging systems were being manufactured at the rate of more than 10,000 units a year. This step change in volumes enabled a step change in system costs, with thermal imaging moving into the consumer's price range. Today we see that the consumer awareness and the consumer market continues to increase with the launch of a number of consumer focused smart phone add-ons. This has brought a further step change in system costs, with the possibility to turn your mobile phone into a thermal imager for under $250. As the detector technology has matured, the pixel pitches have dropped from 50μm in 2002 to 12 μm or even 10μm in today's detectors. This dramatic shrinkage in size has had an equally dramatic effect on the optics required to produce the image on the detector. A moderate field of view that would have required a focal length of 40mm in 2002 now requires a focal length of 8mm. For wide field of view applications and small detector formats, focal lengths in the range 1mm to 5mm are becoming common. For lenses, the quantity manufactured, quality and costs will require a new approach to high volume Infra-Red (IR) manufacturing to meet customer expectations. This, taken with the SwaP-C requirements and the emerging requirement for very small lenses driven by the new detectors, suggests that wafer scale optics are part of the solution. Umicore can now present initial results from an intensive research and development program to mold and coat wafer level optics, using its chalcogenide glass, GASIR®.

  3. Recent developments in wafer-level fabrication of micro-optical multi-aperture imaging systems

    Science.gov (United States)

    Leitel, R.; Dannberg, P.; Brückner, A.; Bräuer, A.

    2011-10-01

    Micro-optical systems, that utilize multiple channels for imaging instead of a single one, are frequently discussed for ultra-compact applications such as digital cameras. The strategy of their fabrication differs due to different concepts of image formation. Illustrated by recently implemented systems for multi-aperture imaging, typical steps of wafer-level fabrication are discussed in detail. In turn, the made progress may allow for additional degrees of freedom in optical design. Pressing ahead with very short overall lengths and multiple diaphragm array layers, results in the use of extremely thin glass substrates down to 100 microns in thickness. The desire for a wide field of view for imaging has led to chirped arrays of microlenses and diaphragms. Focusing on imaging quality, aberrations were corrected by introducing toroidal lenslets and elliptical apertures. Such lenslets had been generated by thermal reflow of lithographic patterned photoresist and subsequent molding. Where useful, the system's performance can be further increased by applying aspheric microlenses from reactive ion etching (RIE) transfer or by achromatic doublets from superimposing two moldings with different polymers. Multiple diaphragm arrays prevent channel crosstalk. But using simple metal layers may lead to multiple reflections and an increased appearance of ghost images. A way out are low reflecting black matrix polymers that can be directly patterned by lithography. But in case of environmental stability and high resolution, organic coatings should be replaced by patterned metal coatings that exhibit matched antireflective layers like the prominent black chromium. The mentioned components give an insight into the fabrication process of multi-aperture imaging systems. Finally, the competence in each step decides on the overall image quality.

  4. Vertical integration of array-type miniature interferometers at wafer level by using multistack anodic bonding

    Science.gov (United States)

    Wang, Wei-Shan; Wiemer, Maik; Froemel, Joerg; Enderlein, Tom; Gessner, Thomas; Lullin, Justine; Bargiel, Sylwester; Passilly, Nicolas; Albero, Jorge; Gorecki, Christophe

    2016-04-01

    In this work, vertical integration of miniaturized array-type Mirau interferometers at wafer level by using multi-stack anodic bonding is presented. Mirau interferometer is suitable for MEMS metrology and for medical imaging according to its vertical-, lateral- resolutions and working distances. Miniaturized Mirau interferometer can be a promising candidate as a key component of an optical coherence tomography (OCT) system. The miniaturized array-type interferometer consists of a microlens doublet, a Si-based MEMS Z scanner, a spacer for focus-adjustment and a beam splitter. Therefore, bonding technologies which are suitable for heterogeneous substrates are of high interest and necessary for the integration of MEMS/MOEMS devices. Multi-stack anodic bonding, which meets the optical and mechanical requirements of the MOEMS device, is adopted to integrate the array-type interferometers. First, the spacer and the beam splitter are bonded, followed by bonding of the MEMS Z scanner. In the meanwhile, two microlenses, which are composed of Si and glass wafers, are anodically bonded to form a microlens doublet. Then, the microlens doublet is aligned and bonded with the scanner/spacer/beam splitter stack. The bonded array-type interferometer is a 7- wafer stack and the thickness is approximately 5mm. To separate such a thick wafer stack with various substrates, 2-step laser cutting is used to dice the bonded stack into Mirau chips. To simplify fabrication process of each component, electrical connections are created at the last step by mounting a Mirau chip onto a flip chip PCB instead of through wafer vias. Stability of Au/Ti films on the MEMS Z scanner after anodic bonding, laser cutting and flip chip bonding are discussed as well.

  5. Low temperature activation of Au/Ti getter film for application to wafer-level vacuum packaging

    Science.gov (United States)

    Wu, Ming; Moulin, Johan; Lani, Sébastien; Hallais, Géraldine; Renard, Charles; Bosseboeuf, Alain

    2015-03-01

    Non-evaporable getter (NEG) thin films based on alloys of transition metals have been studied by various authors for vacuum control in wafer-level packages of micro electro mechanical systems (MEMS). These materials have typically a relatively high activation temperature (300-450 °C) which is incompatible with some temperature sensitive MEMS devices. In this work we investigate the potential of Au/Ti system with a thin or ultrathin non oxidizable Au layer as a low activation temperature getter material. In this bilayer system, gettering activation is produced by thermal outdiffusion of titanium atoms through the gold film. The outdiffusion kinetics of titanium was modelled and characterized by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), and Rutherford backscattering spectrometry (RBS) at various temperatures. Results confirm that Au/Ti bilayer is a promising getter material for wafer-level packaging with an activation temperature below 300 °C for 1 h annealing time.

  6. Utilizing an Adaptive Grey Model for Short-Term Time Series Forecasting: A Case Study of Wafer-Level Packaging

    Directory of Open Access Journals (Sweden)

    Che-Jung Chang

    2013-01-01

    Full Text Available The wafer-level packaging process is an important technology used in semiconductor manufacturing, and how to effectively control this manufacturing system is thus an important issue for packaging firms. One way to aid in this process is to use a forecasting tool. However, the number of observations collected in the early stages of this process is usually too few to use with traditional forecasting techniques, and thus inaccurate results are obtained. One potential solution to this problem is the use of grey system theory, with its feature of small dataset modeling. This study thus uses the AGM(1,1 grey model to solve the problem of forecasting in the pilot run stage of the packaging process. The experimental results show that the grey approach is an appropriate and effective forecasting tool for use with small datasets and that it can be applied to improve the wafer-level packaging process.

  7. A wafer-level vacuum package using glass-reflowed silicon through-wafer interconnection for nano/micro devices.

    Science.gov (United States)

    Jin, Joo-Young; Yoo, Seung-Hyun; Yoo, Byung-Wook; Kim, Yong-Kweon

    2012-07-01

    We propose a vacuum wafer-level packaging (WLP) process using glass-reflowed silicon via for nano/micro devices (NMDs). A through-wafer interconnection (TWIn) substrate with silicon vias and reflowed glass is introduced to accomplish a vertical feed-through of device. NMDs are fabricated in the single crystal silicon (SCS) layer which is formed on the TWIn substrate by Au eutectic bonding including Cr adhesion layer. The WLPof the devices is achieved with the capping glass wafer anodically bonded to the SCS layer. In order to demonstrate the successful hermetic packaging, we fabricated the micro-Pirani gauge in the SCS layer, and packaged it in the wafer-level. The vacuum level inside the packaging was measured to be 3.1 Torr with +/- 0.12 Torr uncertainty, and the packaging leakage was not detected during 24 hour after the packaging.

  8. Using the Climbing Drum Peel (CDP) Test to Obtain a G(sub IC) value for Core/Facesheet Bonds

    Science.gov (United States)

    Nettles, A. T.; Gregory, Elizabeth D.; Jackson, Justin R.

    2006-01-01

    A method of measuring the Mode I fracture toughness of core/facesheet bonds in sandwich Structures is desired, particularly with the widespread use of models that need this data as input. This study examined if a critical strain energy release rate, G(sub IC), can be obtained from the climbing drum peel (CDP) test. The CDP test is relatively simple to perform and does not rely on measuring small crack lengths such as required by the double cantilever beam (DCB) test. Simple energy methods were used to calculate G(sub IC) from CDP test data on composite facesheets bonded to a honeycomb core. Facesheet thicknesses from 2 to 5 plies were tested to examine the upper and lower bounds on facesheet thickness requirements. Results from the study suggest that the CDP test, with certain provisions, can be used to find the GIG value of a core/facesheet bond.

  9. Fermi Observations of Resolved Large-Scale Jets: Testing the IC/CMB Model

    Science.gov (United States)

    Breiding, Peter; Meyer, Eileen T.; Georganopoulos, Markos

    2017-01-01

    It has been observed with the Chandra X-ray Observatory since the early 2000s that many powerful quasar jets show X-ray emission on the kpc scale (Harris & Krawczynski, 2006). In many cases these X-rays cannot be explained by the extension of the radio-optical spectrum produced by synchrotron emitting electrons in the jet, since the observed X-ray flux is too high and the X-ray spectral index too hard. A widely accepted model for the X-ray emission first proposed by Celotti et al. 2001 and Tavecchio et al. 2000 posits that the X-rays are produced when relativistic electrons in the jet up-scatter ambient cosmic microwave background (CMB) photons via inverse Compton scattering from microwave to X-ray energies (the IC/CMB model). However, explaining the X-ray emission for these jets with the IC/CMB model requires high levels of IC/CMB γ-ray emission (Georganopoulos et al., 2006), which we are looking for using the FERMI/LAT γ-ray space telescope. Another viable model for the large scale jet X-ray emission favored by the results of Meyer et al. 2015 and Meyer & Georganopoulos 2014 is an alternate population of synchrotron emitting electrons. In contrast with the second synchrotron interpretation; the IC/CMB model requires jets with high kinetic powers which can exceed the Eddington luminsoity (Dermer & Atoyan 2004 and Atoyan & Dermer 2004) and be very fast on the kpc scale with a Γ~10 (Celotti et al. 2001 and Tavecchio et al. 2000). New results from data obtained with the Fermi/LAT will be shown for several quasars not in the Fermi/LAT 3FGL catalog whose large scale X-ray jets are attributed to IC/CMB. Additionally, recent work on the γ-ray bright blazar AP Librae will be shown which helps to constrain some models attempting to explain the high energy component of its SED, which extends from X-ray to TeV energies (e.g., Zacharias & Wagner 2016 & Petropoulou et al. 2016).

  10. Wafer-level integration of NiTi shape memory alloy on silicon using Au-Si eutectic bonding

    OpenAIRE

    Gradin, Henrik; Bushra, Sobia; Braun, Stefan; Stemme, Göran; van der Wijngaart, Wouter

    2012-01-01

    This paper reports on the wafer level integration of NiTi shape memory alloy (SMA) sheets with silicon substrates through Au-Si eutectic bonding. Different bond parameters, such as Au layer thicknesses and substrate surface treatments were evaluated. The amount of gold in the bond interface is the most important parameter to achieve a high bond yield; the amount can be determined by the barrier layers between the Au and Si or by the amount of Au deposition. Deposition of a gold layer of more ...

  11. Wafer-level packaging and laser bonding as an approach for silicon-into-lab-on-chip integration

    Science.gov (United States)

    Brettschneider, T.; Dorrer, C.; Bründel, M.; Zengerle, R.; Daub, M.

    2013-05-01

    A novel approach for the integration of silicon biosensors into microfluidics is presented. Our approach is based on wafer-level packaging of the silicon die and a laser-bonding process of the resulting mold package into a polymer-multilayer stack. The introduction of a flexible and 40 μm thin hot melt foil as an intermediate layer enables laser bonding between materials with different melting temperatures, where standard laser welding processes cannot be employed. All process steps are suitable for mass production, e.g. the approach does not involve any dispensing steps for glue or underfiller. The integration approach was demonstrated and evaluated regarding process technology by wafer-level redistribution of daisy chain silicon dies representing a generic biosensor. Electrical connection was successfully established and laser-bonding tensile strength of 5.7 N mm-2 and burst pressure of 587 kPa at a temperature of 100 °C were achieved for the new material combination. The feasibility of the complete packaging approach was shown by the fabrication of a microfluidic flow cell with embedded mold package.

  12. Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays

    Science.gov (United States)

    Forsberg, Fredrik; Roxhed, Niclas; Fischer, Andreas C.; Samel, Björn; Ericsson, Per; Hoivik, Nils; Lapadatu, Adriana; Bring, Martin; Kittilsland, Gjermund; Stemme, Göran; Niklaus, Frank

    2013-09-01

    Imaging in the long wavelength infrared (LWIR) range from 8 to 14 μm is an extremely useful tool for non-contact measurement and imaging of temperature in many industrial, automotive and security applications. However, the cost of the infrared (IR) imaging components has to be significantly reduced to make IR imaging a viable technology for many cost-sensitive applications. This paper demonstrates new and improved fabrication and packaging technologies for next-generation IR imaging detectors based on uncooled IR bolometer focal plane arrays. The proposed technologies include very large scale heterogeneous integration for combining high-performance, SiGe quantum-well bolometers with electronic integrated read-out circuits and CMOS compatible wafer-level vacuum packing. The fabrication and characterization of bolometers with a pitch of 25 μm × 25 μm that are arranged on read-out-wafers in arrays with 320 × 240 pixels are presented. The bolometers contain a multi-layer quantum well SiGe thermistor with a temperature coefficient of resistance of -3.0%/K. The proposed CMOS compatible wafer-level vacuum packaging technology uses Cu-Sn solid-liquid interdiffusion (SLID) bonding. The presented technologies are suitable for implementation in cost-efficient fabless business models with the potential to bring about the cost reduction needed to enable low-cost IR imaging products for industrial, security and automotive applications.

  13. High Performance Microaccelerometer with Wafer-level Hermetic Packaged Sensing Element and Continuous-time BiCMOS Interface Circuit

    Energy Technology Data Exchange (ETDEWEB)

    Ko, Hyoungho [School of Electrical Engineering and Computer Science, Seoul National University (Korea, Republic of); Park, Sangjun [School of Electrical Engineering and Computer Science, Seoul National University (Korea, Republic of); Paik, Seung-Joon [School of Electrical Engineering and Computer Science, Seoul National University (Korea, Republic of); Choi, Byoung-doo [School of Electrical Engineering and Computer Science, Seoul National University (Korea, Republic of); Park, Yonghwa [School of Electrical Engineering and Computer Science, Seoul National University (Korea, Republic of); Lee, Sangmin [School of Electrical Engineering and Computer Science, Seoul National University (Korea, Republic of); Kim, Sungwook [SML Electronics, Inc. (Korea, Republic of); Lee, Sang Chul [SML Electronics, Inc. (Korea, Republic of); Lee, Ahra [SML Electronics, Inc. (Korea, Republic of); Yoo, Kwangho [SML Electronics, Inc. (Korea, Republic of); Lim, Jaesang [SML Electronics, Inc. (Korea, Republic of); Cho, Dong-il [School of Electrical Engineering and Computer Science, Seoul National University (Korea, Republic of)

    2006-04-01

    A microaccelerometer with highly reliable, wafer-level packaged MEMS sensing element and fully differential, continuous time, low noise, BiCMOS interface circuit is fabricated. The MEMS sensing element is fabricated on a (111)-oriented SOI wafer by using the SBM (Sacrificial/Bulk Micromachining) process. To protect the silicon structure of the sensing element and enhance the reliability, a wafer level hermetic packaging process is performed by using a silicon-glass anodic bonding process. The interface circuit is fabricated using 0.8 {mu}m BiCMOS process. The capacitance change of the MEMS sensing element is amplified by the continuous-time, fully-differential transconductance input amplifier. A chopper-stabilization architecture is adopted to reduce low-frequency noise including 1/f noise. The fabricated microaccelerometer has the total noise equivalent acceleration of 0.89 {mu}g/{radical}Hz, the bias instability of 490 {mu}g, the input range of {+-}10 g, and the output nonlinearity of {+-}0.5 %FSO.

  14. 圆片级真空封装技术在MEMS陀螺中的应用%Application of Wafer-Level Vacuum Packaging Technology for MEMS Gyroscopes

    Institute of Scientific and Technical Information of China (English)

    杨静; 张富强

    2012-01-01

    In order to maintain the vacuum required for MEMS silicon micro gyroscopes, the wafer-level vacuum hermetic packaging of MEMS silicon micro gyroscopes was realized using the silicon-glass anodic bonding for two times and long-term vacuum maintenance technology. The manufactu-ring process consists of bonding the silicon and glass, etching the silicon vibration structure on the silicon-glass base by DRIE, packaging in a vacuum environment of 10-5 mbar (1 mbar= 100 Pa) by MEMS wafer-level anodic bonding and achieving long-term vacuum by using getters. The test results show that the fabricated silicon micro gyroscope has the smooth anodic bonding interface without any bubble, and the leakage rate is lower than 5. 0× 10-8 atm·cm3/s. After the ceramic packaging for chips, the measured quality factor is higher than 12 000 under the static condition. And the performance is stable without change after the continuous monitoring for one year.%为维持MEMS硅微陀螺的真空度,利用两次硅-玻璃阳极键合和真空长期维持技术,实现了MEMS硅微陀螺的圆片级真空气密性封装.制作过程包括:先将硅和玻璃键合,在硅-玻璃衬底上采用DRIE工艺刻蚀出硅振动结构;再利用MEMS圆片级阳极键合工艺在10-5 mbar(1 mbar=100 Pa)真空环境中进行封装;最后利用吸气剂实现圆片的长期真空气密性.经测试,采用这种方式制作出的硅微陀螺键合界面均匀平整无气泡,漏率低于5.0×10-8atm·cm3/s.对芯片进行陶瓷封装,静态下测试得出品质因数超过12 000,并对样品进行连续一年监测,性能稳定无变化.

  15. Wafer level vacuum packaging of scanning micro-mirrors using glass-frit and anodic bonding methods

    Science.gov (United States)

    Langa, S.; Drabe, C.; Kunath, C.; Dreyhaupt, A.; Schenk, H.

    2013-03-01

    In this paper the authors report about the six inch wafer level vacuum packaging of electro-statically driven two dimensional micro-mirrors. The packaging was done by means of two types of wafer bonding methods: anodic and glass frit. The resulting chips after dicing are 4 mm wide, 6 mm long and 1.6 mm high and the residual pressure inside the package after dicing was estimated to be between 2 and 20 mbar. This allowed us to reduce the driving voltage of the micro-mirrors by more than 40% compared to the driving voltage without vacuum packaging. The vacuum stability after 5 months was verified by measurement using the so called "membrane method". Persistence of the vacuum was proven. No getter materials were used for packaging.

  16. Wafer-level vacuum-packaged two-axis MEMS scanning mirror for pico-projector application

    Science.gov (United States)

    Hofmann, Ulrich; Senger, Frank; Janes, Joachim; Mallas, Christian; Stenchly, Vanessa; von Wantoch, Thomas; Quenzer, Hans-Joachim; Weiss, Manfred

    2014-03-01

    Hermetic wafer level packaging of optical MEMS scanning mirrors is essential for mass-market applications. It is the key to enable reliable low-cost mass producible scanning solutions. Vacuum packaging of resonant MEMS scanning mirrors widens the parameter range specifically with respect to scan angle and scan frequency. It also allows extending the utilizable range of mirror aperture size based on the fact that the energy of the high-Q oscillator can be effectively conserved and accumulated. But there are also some drawbacks associated with vacuum packaging. This paper discusses the different advantageous and disadvantageous aspects of vacuum packaging of MEMS scanning mirrors with respect to laser projection displays. Improved MEMS scanning mirror designs are being presented which focus on overcoming previous limitations. Finally an outlook is presented on the suitability of this technology for very large aperture scanning mirrors to be used in high power laser applications.

  17. Assessing the organizational context for EBP implementation: the development and validity testing of the Implementation Climate Scale (ICS).

    Science.gov (United States)

    Ehrhart, Mark G; Aarons, Gregory A; Farahnak, Lauren R

    2014-10-23

    Although the importance of the organizational environment for implementing evidence-based practices (EBP) has been widely recognized, there are limited options for measuring implementation climate in public sector health settings. The goal of this research was to develop and test a measure of EBP implementation climate that would both capture a broad range of issues important for effective EBP implementation and be of practical use to researchers and managers seeking to understand and improve the implementation of EBPs. Participants were 630 clinicians working in 128 work groups in 32 US-based mental health agencies. Items to measure climate for EBP implementation were developed based on past literature on implementation climate and other strategic climates and in consultation with experts on the implementation of EBPs in mental health settings. The sample was randomly split at the work group level of analysis; half of the sample was used for exploratory factor analysis (EFA), and the other half was used for confirmatory factor analysis (CFA). The entire sample was utilized for additional analyses assessing the reliability, support for level of aggregation, and construct-based evidence of validity. The EFA resulted in a final factor structure of six dimensions for the Implementation Climate Scale (ICS): 1) focus on EBP, 2) educational support for EBP, 3) recognition for EBP, 4) rewards for EBP, 5) selection for EBP, and 6) selection for openness. This structure was supported in the other half of the sample using CFA. Additional analyses supported the reliability and construct-based evidence of validity for the ICS, as well as the aggregation of the measure to the work group level. The ICS is a very brief (18 item) and pragmatic measure of a strategic climate for EBP implementation. It captures six dimensions of the organizational context that indicate to employees the extent to which their organization prioritizes and values the successful implementation of EBPs

  18. Non-Destructive Damping Measurement for Wafer-Level Packaged Microelectromechanical System (MEMS) Acceleration Switches

    Science.gov (United States)

    2014-09-01

    Joint Fuze Technology Program (JFTP) provided the funding behind the production of the 60G MEMS impact switches. The JFTP MEMS impact switches are...Conference 2013, VTT Technical Research Centre of Finland, 2013. 8. Zhang W. Energy dissipations in MEMS resonators: fluid damping of flexural resonators...Research Laboratory CAD computer-aided design DUT device under test HEMDP harmonic excitation modal damping predictor JFTP Joint Fuze Technology

  19. A Versatile Mixed-Signal Pin Approach for Cost-Effective Test of Automotive ICs

    Institute of Scientific and Technical Information of China (English)

    Credence Systems Corporation

    2004-01-01

    @@ (上接第9期51页) Figure 3:3 different pins types which cover a wide range of requirements: - DPIN: The digital mixed signal pin for high speed digital requirements - VPIN digital mixed-signal pin with high voltage digital test capability. With the 30 V swing and 50 MHz data rate the pin fits excellent for automotive requirements.

  20. Numerical and Experimental Dynamic Analysis of IC Engine Test Beds Equipped with Highly Flexible Couplings

    Directory of Open Access Journals (Sweden)

    M. Cocconcelli

    2017-01-01

    Full Text Available Driveline components connected to internal combustion engines can be critically loaded by dynamic forces due to motion irregularity. In particular, flexible couplings used in engine test rig are usually subjected to high levels of torsional oscillations and time-varying torque. This could lead to premature failure of the test rig. In this work an effective methodology for the estimation of the dynamic behavior of highly flexible couplings in real operational conditions is presented in order to prevent unwanted halts. The methodology addresses a combination of numerical models and experimental measurements. In particular, two mathematical models of the engine test rig were developed: a torsional lumped-parameter model for the estimation of the torsional dynamic behavior in operative conditions and a finite element model for the estimation of the natural frequencies of the coupling. The experimental campaign addressed torsional vibration measurements in order to characterize the driveline dynamic behavior as well as validate the models. The measurements were achieved by a coder-based technique using optical sensors and zebra tapes. Eventually, the validated models were used to evaluate the effect of design modifications of the coupling elements in terms of natural frequencies (torsional and bending, torsional vibration amplitude, and power loss in the couplings.

  1. IC Associated Conditions

    Science.gov (United States)

    ... likely than the general population to have systemic lupus erythematosus. More recent research has revealed that IC may ... Pain & IC Hunner’s Ulcers IC Flares Women & IC Pregnancy & IC Intimacy & ... Floor Dysfunction Pudendal Neuralgia Sjogren’s Syndrome Vulvodynia ...

  2. Pregnancy and IC

    Science.gov (United States)

    ... Profile Home About IC Women & IC Pregnancy & IC Pregnancy & IC How Pregnancy Affects IC Unfortunately, there is limited scientific data ... 2009 issue of the ICA Update . Planning Your Pregnancy Planning ahead for your pregnancy will let you: ...

  3. General IC Symptoms

    Science.gov (United States)

    ... IC Symptoms of IC General IC Symptoms General IC Symptoms Symptoms of interstitial cystitis (IC) differ from ... news and events. Please leave this field empty Interstitial Cystitis Association 7918 Jones Branch Drive, Suite 300 McLean, ...

  4. High-Q Wafer Level Package Based on Modified Tri-Layer Anodic Bonding and High Performance Getter and Its Evaluation for Micro Resonant Pressure Sensor

    National Research Council Canada - National Science Library

    Liying Wang; Xiaohui Du; Lingyun Wang; Zhanhao Xu; Chenying Zhang; Dandan Gu

    2017-01-01

    In order to achieve and maintain a high quality factor (high-Q) for the micro resonant pressure sensor, this paper presents a new wafer level package by adopting cross-layer anodic bonding technique of the glass/silicon/silica (GSS...

  5. Design and fabrication of high performance wafer-level vacuum packaging based on glass-silicon-glass bonding techniques

    Science.gov (United States)

    Zhang, Jinwen; Jiang, Wei; Wang, Xin; Zhou, Jilong; Yang, Huabing

    2012-12-01

    In this paper, a high performance wafer-level vacuum packaging technology based on GSG triple-layer sealing structure for encapsulating large mass inertial MEMS devices fabricated by silicon-on-glass bulk micromachining technology is presented. Roughness controlling strategy of bonding surfaces was proposed and described in detail. Silicon substrate was thinned and polished by CMP after the first bonding with the glass substrate and was then bonded with the glass micro-cap. Zr thin film was embedded into the concave of the micro-cap by a shadow-mask technique. The glass substrate was thinned to about 100 µm, wet etched through and metalized for realizing vertical feedthrough. During the fabrication, all patterning processes were operated carefully so as to reduce extrusive fragments to as little as possible. In addition, a high-performance micro-Pirani vacuum gauge was integrated into the package for monitoring the pressure and the leak rate further. The result shows that the pressure in the package is about 120 Pa and has no obvious change for more than one year indicating 10-13 stdcc s-1 leak rate.

  6. High-Q Wafer Level Package Based on Modified Tri-Layer Anodic Bonding and High Performance Getter and Its Evaluation for Micro Resonant Pressure Sensor.

    Science.gov (United States)

    Wang, Liying; Du, Xiaohui; Wang, Lingyun; Xu, Zhanhao; Zhang, Chenying; Gu, Dandan

    2017-03-16

    In order to achieve and maintain a high quality factor (high-Q) for the micro resonant pressure sensor, this paper presents a new wafer level package by adopting cross-layer anodic bonding technique of the glass/silicon/silica (GSS) stackable structure and integrated Ti getter. A double-layer structure similar to a silicon-on-insulator (SOI) wafer is formed after the resonant layer and the pressure-sensitive layer are bonded by silicon direct bonding (SDB). In order to form good bonding quality between the pressure-sensitive layer and the glass cap layer, the cross-layer anodic bonding technique is proposed for vacuum package by sputtering Aluminum (Al) on the combination wafer of the pressure-sensitive layer and the resonant layer to achieve electrical interconnection. The model and the bonding effect of this technique are discussed. In addition, in order to enhance the performance of titanium (Ti) getter, the prepared and activation parameters of Ti getter under different sputtering conditions are optimized and discussed. Based on the optimized results, the Ti getter (thickness of 300 nm to 500 nm) is also deposited on the inside of the glass groove by magnetron sputtering to maintain stable quality factor (Q). The Q test of the built testing system shows that the number of resonators with a Q value of more than 10,000 accounts for more than 73% of the total. With an interval of 1.5 years, the Q value of the samples remains almost constant. It proves the proposed cross-layer anodic bonding and getter technique can realize high-Q resonant structure for long-term stable operation.

  7. High-Q Wafer Level Package Based on Modified Tri-Layer Anodic Bonding and High Performance Getter and Its Evaluation for Micro Resonant Pressure Sensor

    Directory of Open Access Journals (Sweden)

    Liying Wang

    2017-03-01

    Full Text Available In order to achieve and maintain a high quality factor (high-Q for the micro resonant pressure sensor, this paper presents a new wafer level package by adopting cross-layer anodic bonding technique of the glass/silicon/silica (GSS stackable structure and integrated Ti getter. A double-layer structure similar to a silicon-on-insulator (SOI wafer is formed after the resonant layer and the pressure-sensitive layer are bonded by silicon direct bonding (SDB. In order to form good bonding quality between the pressure-sensitive layer and the glass cap layer, the cross-layer anodic bonding technique is proposed for vacuum package by sputtering Aluminum (Al on the combination wafer of the pressure-sensitive layer and the resonant layer to achieve electrical interconnection. The model and the bonding effect of this technique are discussed. In addition, in order to enhance the performance of titanium (Ti getter, the prepared and activation parameters of Ti getter under different sputtering conditions are optimized and discussed. Based on the optimized results, the Ti getter (thickness of 300 nm to 500 nm is also deposited on the inside of the glass groove by magnetron sputtering to maintain stable quality factor (Q. The Q test of the built testing system shows that the number of resonators with a Q value of more than 10,000 accounts for more than 73% of the total. With an interval of 1.5 years, the Q value of the samples remains almost constant. It proves the proposed cross-layer anodic bonding and getter technique can realize high-Q resonant structure for long-term stable operation.

  8. Microstructural Evolution of SAC305 Solder Joints in Wafer Level Chip-Scale Packaging (WLCSP) with Continuous and Interrupted Accelerated Thermal Cycling

    Science.gov (United States)

    Zhou, Quan; Zhou, Bite; Lee, Tae-Kyu; Bieler, Thomas

    2016-06-01

    Four high-strain design wafer level chip scale packages were given accelerated thermal cycling with a 10°C/min ramp rate and 10 min hold times between 0°C and 100°C to examine the effects of continuous and interrupted thermal cycling on the number of cycles to failure. The interruptions given two of the samples were the result of periodic examinations using electron backscattered pattern mapping, leading to room temperature aging of 30 days-2.5 years after increments of about 100 cycles at several stages of the cycling history. The continuous thermal cycling resulted in solder joints with a much larger degree of recrystallization, whereas the interrupted thermal cycling tests led to much less recrystallization, which was more localized near the package side, and the crack was more localized near the interface and had less branching. The failure mode for both conditions was still the same, with cracks nucleating along the high angle grain boundaries formed during recrystallization. In conditions where there were few recrystallized grains, recovery led to formation of subgrains that strengthened the solder, and the higher strength led to a larger driving force for crack growth through the solder, leading to failure after less than half of the cycles in the continuous accelerated thermal cycling condition. This work shows that there is a critical point where sufficient strain energy accumulation will trigger recrystallization, but this point depends on the rate of strain accumulation in each cycle and various recovery processes, which further depends on local crystal orientations, stress state evolution, and specific activated slip and twinning systems.

  9. Micro/Nano Gas Sensors: A New Strategy Towards In-Situ Wafer-Level Fabrication of High-Performance Gas Sensing Chips

    Science.gov (United States)

    Xu, Lei; Dai, Zhengfei; Duan, Guotao; Guo, Lianfeng; Wang, Yi; Zhou, Hong; Liu, Yanxiang; Cai, Weiping; Wang, Yuelin; Li, Tie

    2015-01-01

    Nano-structured gas sensing materials, in particular nanoparticles, nanotubes, and nanowires, enable high sensitivity at a ppb level for gas sensors. For practical applications, it is highly desirable to be able to manufacture such gas sensors in batch and at low cost. We present here a strategy of in-situ wafer-level fabrication of the high-performance micro/nano gas sensing chips by naturally integrating microhotplatform (MHP) with nanopore array (NPA). By introducing colloidal crystal template, a wafer-level ordered homogenous SnO2 NPA is synthesized in-situ on a 4-inch MHP wafer, able to produce thousands of gas sensing units in one batch. The integration of micromachining process and nanofabrication process endues micro/nano gas sensing chips at low cost, high throughput, and with high sensitivity (down to ~20 ppb), fast response time (down to ~1 s), and low power consumption (down to ~30 mW). The proposed strategy of integrating MHP with NPA represents a versatile approach for in-situ wafer-level fabrication of high-performance micro/nano gas sensors for real industrial applications. PMID:26001035

  10. A 45° saw-dicing process applied to a glass substrate for wafer-level optical splitter fabrication for optical coherence tomography

    Science.gov (United States)

    Maciel, M. J.; Costa, C. G.; Silva, M. F.; Gonçalves, S. B.; Peixoto, A. C.; Ribeiro, A. Fernando; Wolffenbuttel, R. F.; Correia, J. H.

    2016-08-01

    This paper reports on the development of a technology for the wafer-level fabrication of an optical Michelson interferometer, which is an essential component in a micro opto-electromechanical system (MOEMS) for a miniaturized optical coherence tomography (OCT) system. The MOEMS consists on a titanium dioxide/silicon dioxide dielectric beam splitter and chromium/gold micro-mirrors. These optical components are deposited on 45° tilted surfaces to allow the horizontal/vertical separation of the incident beam in the final micro-integrated system. The fabrication process consists of 45° saw dicing of a glass substrate and the subsequent deposition of dielectric multilayers and metal layers. The 45° saw dicing is fully characterized in this paper, which also includes an analysis of the roughness. The optimum process results in surfaces with a roughness of 19.76 nm (rms). The actual saw dicing process for a high-quality final surface results as a compromise between the dicing blade’s grit size (#1200) and the cutting speed (0.3 mm s-1). The proposed wafer-level fabrication allows rapid and low-cost processing, high compactness and the possibility of wafer-level alignment/assembly with other optical micro components for OCT integrated imaging.

  11. Children and IC

    Science.gov (United States)

    ... well as his or her teachers, principal, school nurse, gym teacher, etc. Your child’s symptoms may be ... Out IC How to Schedule an IC Advocacy District Visit IC Advocates in Action Spur Research Funding ...

  12. SEM probe of IC radiation sensitivity

    Science.gov (United States)

    Gauthier, M. K.; Stanley, A. G.

    1979-01-01

    Scanning Electron Microscope (SEM) used to irradiate single integrated circuit (IC) subcomponent to test for radiation sensitivity can localize area of IC less than .03 by .03 mm for determination of exact location of radiation sensitive section.

  13. Missing Gamma-Rays from kpc-scale AGN Jets: A Test of the IC/CMB Model

    CERN Document Server

    Meyer, Eileen T; Sparks, William B; Godfrey, Leith; Perlman, Eric

    2015-01-01

    The physical origin of the X-ray emission in powerful quasar jets has been a long-standing mystery. Though these jets start out on the sub-pc scale as highly relativistic flows, we do not have any direct measurement of their speeds on the kpc scale, where the vast distances from the core necessitate in situ particle acceleration. If the jets remain highly relativistic on kpc scales, then the X-rays could be due to inverse-Compton upscattering of CMB photons. However, the IC/CMB explanation predicts a high level of gamma-ray emission, which should be detectible by the Fermi/LAT. We have searched for and ruled out this emission at a high level of significance for the well-known sources 3C 273 and PKS 0637-752, suggesting the X-rays are synchrotron, though of unknown origin. These recent results with Fermi also suggest that the kpc-scale jets in powerful quasars are significantly slower than have been presumed under the IC/CMB model. I will discuss the surprising implications of these findings for the energetics...

  14. Length separation of single-walled carbon nanotubes and its impact on structural and electrical properties of wafer-level fabricated carbon nanotube-field-effect transistors

    Science.gov (United States)

    Böttger, Simon; Hermann, Sascha; Schulz, Stefan E.; Gessner, Thomas

    2016-10-01

    For an industrial realization of devices based on single-walled carbon nanotube (SWCNTs) such as field-effect transistors (FETs) it becomes increasingly important to consider technological aspects such as intrinsic device structure, integration process controllability as well as yield. From the perspective of a wafer-level integration technology, the influence of SWCNT length on the performance of short-channel CNT-FETs is demonstrated by means of a statistical and comparative study. Therefore, a methodological development of a length separation process based on size-exclusion chromatography was conducted in order to extract well-separated SWCNT dispersions with narrowed length distribution. It could be shown that short SWCNTs adversely affect integrability and reproducibility, underlined by a 25% decline of the integration yield with respect to long SWCNTs. Furthermore, it turns out that the significant changes in electrical performance are directly linked to a SWCNT chain formation in the transistor channel. In particular, CNT-FETs with long SWCNTs outperform reference and short SWCNTs with respect to hole mobility and subthreshold controllability by up to 300% and up to 140%, respectively. As a whole, this study provides a statistical and comparative analysis towards chain-less CNT-FETs fabricated with a wafer-level technology.

  15. IC Treatment: Surgical Procedures

    Science.gov (United States)

    ... IC Epidemiology (RICE) Study Boston Area Community Health (BACH) Survey ICA Pilot Research Program Funding Opportunities Clinical ... IC Epidemiology (RICE) Study Boston Area Community Health (BACH) Survey ICA Pilot Research Program Funding Opportunities Clinical ...

  16. IC Treatment: Antihistamines

    Science.gov (United States)

    ... IC Epidemiology (RICE) Study Boston Area Community Health (BACH) Survey ICA Pilot Research Program Funding Opportunities Clinical ... IC Epidemiology (RICE) Study Boston Area Community Health (BACH) Survey ICA Pilot Research Program Funding Opportunities Clinical ...

  17. Men and IC

    Science.gov (United States)

    ... IC Epidemiology (RICE) Study Boston Area Community Health (BACH) Survey ICA Pilot Research Program Funding Opportunities Clinical ... IC Epidemiology (RICE) Study Boston Area Community Health (BACH) Survey ICA Pilot Research Program Funding Opportunities Clinical ...

  18. IC: Frequently Asked Questions

    Science.gov (United States)

    ... IC Epidemiology (RICE) Study Boston Area Community Health (BACH) Survey ICA Pilot Research Program Funding Opportunities Clinical ... IC Epidemiology (RICE) Study Boston Area Community Health (BACH) Survey ICA Pilot Research Program Funding Opportunities Clinical ...

  19. Testing multistage gain and offset trimming in a single photon counting IC with a charge sharing elimination algorithm

    Science.gov (United States)

    Krzyżanowska, A.; Gryboś, P.; Szczygieł, R.; Maj, P.

    2015-12-01

    Designing a hybrid pixel detector readout electronics operating in a single photon counting mode is a very challenging process, where many main parameters are optimized in parallel (e.g. gain, noise, and threshold dispersion). Additional requirements for a smaller pixel size with extended functionality push designers to use new deep sub-micron technologies. Minimizing the channel size is possible, however, with a decreased pixel size, the charge sharing effect becomes a more important issue. To overcome this problem, we designed an integrated circuit prototype produced in CMOS 40 nm technology, which has an extended functionality of a single pixel. A C8P1 algorithm for the charge sharing effect compensation was implemented. In the algorithm's first stage the charge is rebuilt in a signal rebuilt hub fed by the CSA (charge sensitive amplifier) outputs from four neighbouring pixels. Then, the pixel with the biggest amount of charge is chosen, after a comparison with all the adjacent ones. In order to process the data in such a complicated way, a certain architecture of a single channel was proposed, which allows for: ṡ processing the signal with the possibility of total charge reconstruction (by connecting with the adjacent pixels), ṡ a comparison of certain pixel amplitude to its 8 neighbours, ṡ the extended testability of each block inside the channel to measure CSA gain dispersion, shaper gain dispersion, threshold dispersion (including the simultaneous generation of different pulse amplitudes from different pixels), ṡ trimming all the necessary blocks for proper operation. We present a solution for multistage gain and offset trimming implemented in the IC prototype. It allows for minimization of the total charge extraction errors, minimization of threshold dispersion in the pixel matrix and minimization of errors of comparison of certain pixel pulse amplitudes with all its neighbours. The detailed architecture of a single channel is presented together

  20. Measurement of volt-ampere characteristics of the SiPM on wafer level with setup based on the PA200 BlueRay probe station

    Science.gov (United States)

    Popova, Elena; Buzhan, Pavel; Kayumov, Fred; Stifutkin, Alexey

    2017-01-01

    Setup for measurement of volt-ampere characteristics of the Silicon photomultipliers (SiPMs) on wafer level consisting of the probe station PA200 BlueRay with embedded computer and SourceMeter Keithley 2400 was built. The setup is controlled by the homegrown software which allows adjustment of the measurements accuracy and speed. Firstly, complete I-V curves for a few samples of the chosen SiPM structure on the wafer are measured. Based on it the range of breakdown voltage and current level are defined which are used to correct the software settings. After that the whole wafer scan is made. The resulting I-V curves are used for SiPM selection (sorting) by current value at some predefined overvoltage (the difference between applied voltage and the breakdown one). Breakdown voltage is defined as: max ((dI/dU)/I).

  1. The effect of EC-IC bypass surgery on resting cerebral blood flow and cerebrovascular reserve capacity studied with stable Xe-CT and acetazolamide test

    Energy Technology Data Exchange (ETDEWEB)

    Yamashita, T.; Kashiwagi, S.; Nakano, S.; Takasago, T.; Abiko, S.; Shiroyama, Y.; Hayashi, M.; Ito, H. (Yamaguchi Univ. School of Medicine (Japan). Dept. of Neurosurgery)

    1991-06-01

    Cerebral blood flow (CBF) and cerebrovascular reserve capacity (CRC) were measured by stable xenon computerized tomography (Xe-CT) and acetazolamide test in 15 patients with cerebrovascular disease before and after extracranial-intracranial (EC-IC) bypass surgery for minor stroke, reversible ischemic neurological deficit or transient ischemic attack. All had angiographically shown occlusive lesions of the major arterial trunk. In the present series, global analysis showed that the bypass did not increase the resting rCBF, but did increase the rCRC. We divided the patients into four groups according to the preoperative resting rCBF and rCRC. All 3 patients with normal resting rCBF and reduced rCRC showed postoperative improvement of rCRC. Of 6 patients with reduced CBF and reduced CRC, three had postoperative increase in resting CBF and four had increased CRC. One of two patients with reduced CBF and normal CRC showed only an increase in CRC. We propose that reduced CRC or reduced CBF with reduced CRC are criteria for selection of candidates for bypass surgery. We conclude that Xe-CT with the Diamox test is a useful and simple method for evaluating cerebral hemodynamics. Preoperative grouping with a combination of preoperative resting rCBF and preoperative rCRC is useful for predicting the effect of EC-IC bypass surgery. (orig.).

  2. Analysis of IC test principle and vector generation method%集成电路测试原理和向量生成方法分析

    Institute of Scientific and Technical Information of China (English)

    宋尚升

    2014-01-01

    Vector generation is an important part of IC testing. According to the basic testing principle of IC,a method of ATE test vector generation is introduced,in which the device model and test bench are established and verified with simulation means first,and then the ATE vector is directly generated according to the ATE vector format. Taking an actual bidirectional bus drive circuit 74ALVC164245 as an example,the feasibility of this method was verified,and the required vector text was got finally. This method has good practicability and certain reference significance for further study on the test vector generation.%测试向量生成是集成电路测试的一个重要环节。在此从集成电路基本测试原理出发,介绍了一种ATE测试向量生成方法。通过建立器件模型和测试平台,在仿真验证后,按照ATE向量格式,直接生成ATE向量。以一种实际的双向总线驱动电路74ALVC164245为例,验证了此方法的可行性,并最终得到所需的向量文本。该方法具有较好的实用性,对进一步研究测试向量生成,也有一定的参考意义。

  3. Impact of 5% NaCl Salt Spray Pretreatment on the Long-Term Reliability of Wafer-Level Packages with Sn-Pb and Sn-Ag-Cu Solder Interconnects

    Science.gov (United States)

    Liu, Bo; Lee, Tae-Kyu; Liu, Kuo-Chuan

    2011-10-01

    Understanding the sensitivity of Pb-free solder joint reliability to various environmental conditions, such as corrosive gases, low temperatures, and high-humidity environments, is a critical topic in the deployment of Pb-free products in various markets and applications. The work reported herein concerns the impact of a marine environment on Sn-Pb and Sn-Ag-Cu interconnects. Both Sn-Pb and Sn-Ag-Cu solder alloy wafer-level packages, with and without pretreatment by 5% NaCl salt spray, were thermally cycled to failure. The salt spray test did not reduce the characteristic lifetime of the Sn-Pb solder joints, but it did reduce the lifetime of the Sn-Ag-Cu solder joints by over 43%. Although both materials showed strong resistance to corrosion, the localized nature of the corroded area at critical locations in the solder joint caused significant degradation in the Sn-Ag-Cu solder joints. The mechanisms leading to these results as well as the extent, microstructural evolution, and dependency of the solder alloy degradation are discussed.

  4. Design of a LOW Cost IC Tester

    Directory of Open Access Journals (Sweden)

    Liakot Ali

    2005-01-01

    Full Text Available Low cost Integrated Circuit (IC testing is now a burning issue in semiconductor technology. Conventional IC tester, Automatic Test Equipment (ATE, cannot cope with the today’s continuously increasing complexities in IC technology. Deterministic algorithm, which is an idea of 1960’s, is adopted in the ATE. Recently pseudo-random testing approach of IC testing has been emerged as an economically viable alternative to the expensive deterministic testing approach. This study introduces the design of a System-on-a-chip (Soc implementing pseudo-random test technique for low cost IC testing with reliable performance. It is capable of testing combinational circuits as well as sequential circuits with scan-port facilities efficiently. It can also be used for testing Printed Circuit Board (PCB interconnection faults.

  5. Determining the size and concentration dependence of gold nanoparticles in vitro cytotoxicity (IC{sub 50}) test using WST-1 assay

    Energy Technology Data Exchange (ETDEWEB)

    Rosli, Nur Shafawati binti; Rahman, Azhar Abdul [School of Physics, Universiti Sains Malaysia, 11800, Pulau Pinang (Malaysia); Aziz, Azlan Abdul [School of Physics, Universiti Sains Malaysia, 11800, Pulau Pinang (Malaysia); Nano-Biotechnology Research and Innovation (NanoBRI), Institute for Research in Molecular Medicine (INFORMM), Universiti Sains Malaysia, 11800, Pulau Pinang (Malaysia); Shamsuddin, Shaharum [Nano-Biotechnology Research and Innovation (NanoBRI), Institute for Research in Molecular Medicine (INFORMM), Universiti Sains Malaysia, 11800, Pulau Pinang (Malaysia); School of Health Sciences, Health Campus, Universiti Sains Malaysia, 16150 Kubang Kerian, Kelantan (Malaysia)

    2015-04-24

    Gold nanoparticles (AuNPs) received a great deal of attention for biomedical applications, especially in diagnostic imaging and therapeutics. Even though AuNPs have potential benefits in biomedical applications, the impact of AuNPs on human and environmental health still remains unclear. The use of AuNPs which is a high-atomic-number materials, provide advantages in terms of radiation dose enhancement. However, before this can become a clinical reality, cytotoxicity of the AuNPs has to be carefully evaluated. Cytotoxicity test is a rapid, standardized test that is very sensitive to determine whether the nanoparticles produced are harmful or benign on cellular components. In this work the size and concentration dependence of AuNPs cytotoxicity in breast cancer cell lines (MCF-7) are tested by using WST-1 assay. The sizes of AuNPs tested were 13 nm, 50 nm, and 70 nm. The cells were seeded in the 96-well plate and were treated with different concentrations of AuNPs by serial dilution for each size of AuNPs. The high concentration of AuNPs exhibit lower cell viability compared to low concentration of AuNPs. We quantified the toxicity of AuNPs in MCF-7 cell lines by determining the IC{sub 50} values in WST-1 assays. The IC{sub 50} values (inhibitory concentrations that effected 50% growth inhibition) of 50 nm AuNPs is lower than 13 nm and 70 nm AuNPs. Mean that, 50nm AuNPs are more toxic to the MCF-7 cells compared to smaller and larger sizes AuNPs. The presented results clearly indicate that the cytotoxicity of AuNPs depend not only on the concentration, but also the size of the nanoparticles.

  6. Utility of Routine Exercise Testing to Detect Rate-Related QRS Widening in Patients Without Structural Heart Disease on Class Ic Antiarrhythmic Agents (Flecainide and Propafenone).

    Science.gov (United States)

    Vallurupalli, Srikanth; Pothineni, Naga Venkata K; Deshmukh, Abhishek; Paydak, Hakan

    2015-09-01

    Class Ic antiarrhythmic agents are effective in the treatment of various atrial tachyarrhythmias. They are known to cause rate-related QRS widening in the presence of structural heart disease, which can lead to life-threatening arrhythmias. The role of routine exercise electrocardiography in patients without structural heart disease is unknown. All patients initiated on class Ic antiarrhythmic agents and who had exercise electrocardiography performed from June 2009 to June 2013 were included. Symptom-limited treadmill electrocardiography was performed to detect significant QRS widening at peak exercise (defined as an increase of >25% of baseline QRS). Fifty-six patients were included in the study. All patients were screened for structural heart disease before initiation of the medication. Significant QRS widening and atrial tachycardia occurred in a single patient, which terminated with cessation of exercise. This patient had a history of tachycardia-mediated cardiomyopathy with normalization of ejection fraction 3 years before being placed on flecainide. In conclusion, routine exercise testing to detect QRS widening is not warranted in patients with no structural heart disease. Copyright © 2015 Elsevier Inc. All rights reserved.

  7. A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process

    Science.gov (United States)

    Mert Torunbalci, Mustafa; Emre Alper, Said; Akin, Tayfun

    2015-12-01

    This paper presents a novel, inherently simple, and low-cost fabrication and hermetic packaging method developed for SOI-MEMS devices, where a single SOI wafer is used for the fabrication of MEMS structures as well as vertical feedthroughs, while a single glass cap wafer is used for hermetic encapsulation and routing metallization. Hermetic encapsulation can be achieved either with the silicon-glass anodic or Au-Si eutectic bonding techniques. The dies sealed with anodic and Au-Si eutectic bonding provide a low vertical feedthrough resistance around 50 Ω. Glass-to-silicon anodically and Au-Si eutectic bonded seals yield a very stable cavity pressure below 10 mTorr with thin-film getters, which are measured to be stable even after 311 d. The package pressure can be adjusted from 5 mTorr to 20 Torr by using different outgassing, cavity depth, and gettering options. The packaging yield is observed to be around 64% and 84% for the anodic and Au-Si eutectic packages, respectively. The average shear strength of the anodic and eutectic packages is measured to be higher than 17 MPa and 42 MPa, respectively. Temperature cycling, high temperature storage, and ultra-high temperature shock tests result in no degradation in the hermeticity of the packaged chips, proving perfect thermal reliability.

  8. Implementation of a monolithic capacitive accelerometer in a wafer-level 0.18 µm CMOS MEMS process

    Science.gov (United States)

    Tseng, Sheng-Hsiang; S-C Lu, Michael; Wu, Po-Chang; Teng, Yu-Chen; Tsai, Hann-Huei; Juang, Ying-Zong

    2012-05-01

    This paper describes the design, fabrication and characterization of a complementary metal-oxide-semiconductor (CMOS) micro-electro-mechanical-system (MEMS) accelerometer implemented in a 0.18 µm multi-project wafer (MPW) CMOS MEMS process. In addition to the standard CMOS process, an additional aluminum layer and a thick photoresist masking layer are employed to achieve etching and microstructural release. The structural thickness of the accelerometer is up to 9 µm and the minimum structural spacing is 2.3 µm. The out-of-plane deflection resulted from the vertical stress gradient over the whole device is controlled to be under 0.2 µm. The chip area containing the micromechanical structure and switched-capacitor sensing circuit is 1.18 × 0.9 mm2, and the total power consumption is only 0.7 mW. Within the sensing range of ±6 G, the measured nonlinearity is 1.07% and the cross-axis sensitivities with respect to the in-plane and out-of-plane are 0.5% and 5.8%, respectively. The average sensitivity of five tested accelerometers is 191.4 mV G-1with a standard deviation of 2.5 mV G-1. The measured output noise floor is 354 µG Hz-1/2, corresponding to a 100 Hz 1 G sinusoidal acceleration. The measured output offset voltage is about 100 mV at 27 °C, and the zero-G temperature coefficient of the accelerometer output is 0.94 mV °C-1 below 85 °C.

  9. A fission yeast-based test system for the determination of IC50 values of anti-prostate tumor drugs acting on CYP21.

    Science.gov (United States)

    Drăgan, Călin-Aurel; Hartmann, Rolf W; Bureik, Matthias

    2006-10-01

    Human steroid 21-hydroxylase (CYP21) and steroid 17alpha-hydroxylase/17,20-lyase (CYP17) are two closely related cytochrome P450 enzymes involved in the steroidogenesis of glucocorticoids, mineralocorticoids, and sex hormones, respectively. Compounds that inhibit CYP17 activity are of pharmacological interest as they could be used for the treatment of prostate cancer. However, in many cases little is known about a possible co-inhibition of CYP21 activity by CYP17 inhibitors, which would greatly reduce their pharmacological value. We have previously shown that fission yeast strains expressing mammalian cytochrome P450 steroid hydroxylases are suitable systems for whole-cell conversion of steroids and may be used for biotechnological applications or for screening of inhibitors. In this study, we developed a very simple and fast method for the determination of enzyme inhibition using Schizosaccharomyces pombe strains that functionally express either human CYP17 or CYP21. Using this system we tested several compounds of different structural classes with known CYP17 inhibitory potency (i.e. Sa 40, YZ5ay, BW33, and ketoconazole) and determined IC50 values that were about one order of magnitude higher in comparison to data previously reported using human testes microsomes. One compound, YZ5ay, was found to be a moderate CYP21 inhibitor with an IC50 value of 15 microM, which is about eight-fold higher than the value determined for CYP17 inhibition (1.8 microM) in fission yeast. We conclude that, in principle, co-inhibition of CYP21 by CYP17 inhibitors cannot be ruled out.

  10. ON-LINE MONITORING OF I&C TRANSMITTERS AND SENSORS FOR CALIBRATION VERIFICATION AND RESPONSE TIME TESTING WAS SUCCESSFULLY IMPLEMENTED AT ATR

    Energy Technology Data Exchange (ETDEWEB)

    Erickson, Phillip A.; O' Hagan, Ryan; Shumaker, Brent; Hashemian, H. M.

    2017-03-01

    The Advanced Test Reactor (ATR) has always had a comprehensive procedure to verify the performance of its critical transmitters and sensors, including RTDs, and pressure, level, and flow transmitters. These transmitters and sensors have been periodically tested for response time and calibration verification to ensure accuracy. With implementation of online monitoring techniques at ATR, the calibration verification and response time testing of these transmitters and sensors are verified remotely, automatically, hands off, include more portions of the system, and can be performed at almost any time during process operations. The work was done under a DOE funded SBIR project carried out by AMS. As a result, ATR is now able to save the manpower that has been spent over the years on manual calibration verification and response time testing of its temperature and pressure sensors and refocus those resources towards more equipment reliability needs. More importantly, implementation of OLM will help enhance the overall availability, safety, and efficiency. Together with equipment reliability programs of ATR, the integration of OLM will also help with I&C aging management goals of the Department of Energy and long-time operation of ATR.

  11. Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems.

    Science.gov (United States)

    Okabe, Kenji; Jeewan, Horagodage Prabhath; Yamagiwa, Shota; Kawano, Takeshi; Ishida, Makoto; Akita, Ippei

    2015-12-16

    In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system architecture, and can help avoid the use of external matching components, resulting in the realization of a small-size system. In addition, the technique employed to assemble a silicon large-scale integration (LSI) chip on the very thin parylene film (5 μm) enables the integration of the rectifier circuits and the flexible antenna (rectenna). In the demonstration of wireless power transmission (WPT), the fabricated flexible rectenna achieved a maximum efficiency of 0.497% with a distance of 3 cm between antennas. In addition, WPT with radio waves allows a misalignment of 185% against antenna size, implying that the misalignment has a less effect on the WPT characteristics compared with electromagnetic induction.

  12. Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems

    Directory of Open Access Journals (Sweden)

    Kenji Okabe

    2015-12-01

    Full Text Available In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system architecture, and can help avoid the use of external matching components, resulting in the realization of a small-size system. In addition, the technique employed to assemble a silicon large-scale integration (LSI chip on the very thin parylene film (5 μm enables the integration of the rectifier circuits and the flexible antenna (rectenna. In the demonstration of wireless power transmission (WPT, the fabricated flexible rectenna achieved a maximum efficiency of 0.497% with a distance of 3 cm between antennas. In addition, WPT with radio waves allows a misalignment of 185% against antenna size, implying that the misalignment has a less effect on the WPT characteristics compared with electromagnetic induction.

  13. Size and deformation limits to maintain constraint in K{sub Ic} and J{sub c} testing of bend specimens

    Energy Technology Data Exchange (ETDEWEB)

    Koppenhoefer, K.C.; Dodds, R.H. Jr. [Illinois Univ., Urbana, IL (United States). Dept. of Civil Engineering

    1995-10-01

    The ASTM Standard Test Method for Plane-Strain Fracture Toughness of metallic Materials (E399-90) restricts test specimen dimensions to insure the measurement of highly constrained fracture toughness values (K{sub Ic}). These requirements insure small-scale yielding (SSY) conditions at fracture, and thereby the validity of linear elastic fracture mechanics. Recently, Dodds and Anderson have proposed a less restrictive size requirement for cleavage fracture toughness measured in terms of the J-integral (J{sub c}), as given by a, b, B {ge} 200 J{sub c}/{sigma}{sub 0}. The size requirement proposed by Dodds and Anderson increases the applicability of fracture toughness experiments by expanding the range of conditions over which fracture toughness data meeting SSY conditions can be reliably measured. This investigation compares the proposed size requirement with that of ASTM Standard Test Method E399 and, by comparison with published experimental data for various alloys, provides validation of the new requirements.

  14. IC Associated Conditions

    Science.gov (United States)

    ... Bowel Syndrome Lupus Pelvic Floor Dysfunction Pudendal Neuralgia Sjogren’s Syndrome Vulvodynia Newly Diagnosed Toolkit IC Awareness Toolkit Know ... Bowel Syndrome Lupus Pelvic Floor Dysfunction Pudendal Neuralgia Sjogren’s Syndrome Vulvodynia Click to learn more about these and ...

  15. LD to IC

    CERN Multimedia

    Association du personnel

    2010-01-01

    LC to IC – Publication of posts: Following the publication of new LD to IC posts, we regret that a large number of post descriptions are not available in both CERN official languages, English and French. Consequently, the Staff Association has decided to provide assistance to those who need it with the translation of one or more posts of interest. To do this, please contact the Staff Association secretariat, tel. 72819 or 72761 or 74224.

  16. A high-Q resonant pressure microsensor with through-glass electrical interconnections based on wafer-level MEMS vacuum packaging.

    Science.gov (United States)

    Luo, Zhenyu; Chen, Deyong; Wang, Junbo; Li, Yinan; Chen, Jian

    2014-12-16

    This paper presents a high-Q resonant pressure microsensor with through-glass electrical interconnections based on wafer-level MEMS vacuum packaging. An approach to maintaining high-vacuum conditions by integrating the MEMS fabrication process with getter material preparation is presented in this paper. In this device, the pressure under measurement causes a deflection of a pressure-sensitive silicon square diaphragm, which is further translated to stress build up in "H" type doubly-clamped micro resonant beams, leading to a resonance frequency shift. The device geometries were optimized using FEM simulation and a 4-inch SOI wafer was used for device fabrication, which required only three photolithographic steps. In the device fabrication, a non-evaporable metal thin film as the getter material was sputtered on a Pyrex 7740 glass wafer, which was then anodically bonded to the patterned SOI wafer for vacuum packaging. Through-glass via holes predefined in the glass wafer functioned as the electrical interconnections between the patterned SOI wafer and the surrounding electrical components. Experimental results recorded that the Q-factor of the resonant beam was beyond 22,000, with a differential sensitivity of 89.86 Hz/kPa, a device resolution of 10 Pa and a nonlinearity of 0.02% F.S with the pressure varying from 50 kPa to 100 kPa. In addition, the temperature drift coefficient was less than -0.01% F.S/°C in the range of -40 °C to 70 °C, the long-term stability error was quantified as 0.01% F.S over a 5-month period and the accuracy of the microsensor was better than 0.01% F.S.

  17. A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging

    Directory of Open Access Journals (Sweden)

    Zhenyu Luo

    2014-12-01

    Full Text Available This paper presents a high-Q resonant pressure microsensor with through-glass electrical interconnections based on wafer-level MEMS vacuum packaging. An approach to maintaining high-vacuum conditions by integrating the MEMS fabrication process with getter material preparation is presented in this paper. In this device, the pressure under measurement causes a deflection of a pressure-sensitive silicon square diaphragm, which is further translated to stress build up in “H” type doubly-clamped micro resonant beams, leading to a resonance frequency shift. The device geometries were optimized using FEM simulation and a 4-inch SOI wafer was used for device fabrication, which required only three photolithographic steps. In the device fabrication, a non-evaporable metal thin film as the getter material was sputtered on a Pyrex 7740 glass wafer, which was then anodically bonded to the patterned SOI wafer for vacuum packaging. Through-glass via holes predefined in the glass wafer functioned as the electrical interconnections between the patterned SOI wafer and the surrounding electrical components. Experimental results recorded that the Q-factor of the resonant beam was beyond 22,000, with a differential sensitivity of 89.86 Hz/kPa, a device resolution of 10 Pa and a nonlinearity of 0.02% F.S with the pressure varying from 50 kPa to 100 kPa. In addition, the temperature drift coefficient was less than −0.01% F.S/°C in the range of −40 °C to 70 °C, the long-term stability error was quantified as 0.01% F.S over a 5-month period and the accuracy of the microsensor was better than 0.01% F.S.

  18. A Novel Wafer Level Package Technology for SAW Devices%一种声表面波器件的新型晶圆级封装技术

    Institute of Scientific and Technical Information of China (English)

    冷俊林; 杨静; 毛海燕; 杨正兵; 汤旭东; 余欢; 杨增涛; 董姝; 伍平

    2011-01-01

    Many drawbacks in the traditional package technology of SAW devices were summarized in this paper. To overcome these drawbacks. A novel wafer level package technology for SAW devices using a kind of dry organic film was presented. Through this technology, laminating process, exposing process and developing process were operated twice respectively before the wafer slice. The experimental results showed that the wet organic film which absorbed acoustic waves could act as sound absorption material without adding mass load on IDTs. Far out rejection, uniformity and reliability of the product were improved. This technology had a broad application prospects in package technology for SAW devices.%总结了声表面波(SAW)器件传统封装技术中存在的问题,提出了一种SAW器件新型晶圆级封装技术.采用一种有机物干膜,分别经两次压膜、曝光和显影完成了对SAW芯片在划片前的封装,并用实验进行了验证.实验结果表明,本技术具有在不改变叉指换能器( IDT)质量负载的情况下同时具备吸声的功能,改善器件的带外抑制能力,增强了产品的一致性和可靠性.本技术在SAW器件的封装方面有广阔的应用前景.

  19. A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging

    Science.gov (United States)

    Luo, Zhenyu; Chen, Deyong; Wang, Junbo; Li, Yinan; Chen, Jian

    2014-01-01

    This paper presents a high-Q resonant pressure microsensor with through-glass electrical interconnections based on wafer-level MEMS vacuum packaging. An approach to maintaining high-vacuum conditions by integrating the MEMS fabrication process with getter material preparation is presented in this paper. In this device, the pressure under measurement causes a deflection of a pressure-sensitive silicon square diaphragm, which is further translated to stress build up in “H” type doubly-clamped micro resonant beams, leading to a resonance frequency shift. The device geometries were optimized using FEM simulation and a 4-inch SOI wafer was used for device fabrication, which required only three photolithographic steps. In the device fabrication, a non-evaporable metal thin film as the getter material was sputtered on a Pyrex 7740 glass wafer, which was then anodically bonded to the patterned SOI wafer for vacuum packaging. Through-glass via holes predefined in the glass wafer functioned as the electrical interconnections between the patterned SOI wafer and the surrounding electrical components. Experimental results recorded that the Q-factor of the resonant beam was beyond 22,000, with a differential sensitivity of 89.86 Hz/kPa, a device resolution of 10 Pa and a nonlinearity of 0.02% F.S with the pressure varying from 50 kPa to 100 kPa. In addition, the temperature drift coefficient was less than −0.01% F.S/°C in the range of −40 °C to 70 °C, the long-term stability error was quantified as 0.01% F.S over a 5-month period and the accuracy of the microsensor was better than 0.01% F.S. PMID:25521385

  20. Towards low-cost infrared imagers: how to leverage Si IC ecosystem

    Science.gov (United States)

    Temple, Dorota S.; Hilton, Allan; Klem, Ethan J. D.

    2016-10-01

    Although performance remains paramount, especially in defense and security applications, cost increasingly drives the implementation strategy for existing and emerging infrared imaging systems. In this paper, we review two technologies that leverage mainstream Si IC technology and infrastructure to increase manufacturability and throughput and decrease the cost of infrared focal plane arrays. In the first example, we review a wafer-level vacuum packaging approach which replaces die-at-a-time serial approaches with a parallel process in which vacuum enclosures for hundreds of microbolometer arrays are formed simultaneously. The second example is a novel nanostructured short-wave infrared sensor developed at RTI International that can be monolithically integrated with Si CMOS at wafer scale.

  1. Simplified design of IC amplifiers

    CERN Document Server

    Lenk, John

    1996-01-01

    Simplified Design of IC Amplifiers has something for everyone involved in electronics. No matter what skill level, this book shows how to design and experiment with IC amplifiers. For experimenters, students, and serious hobbyists, this book provides sufficient information to design and build IC amplifier circuits from 'scratch'. For working engineers who design amplifier circuits or select IC amplifiers, the book provides a variety of circuit configurations to make designing easier.Provides basics for all phases of practical design.Covers the most popular forms for amplif

  2. The ICS International Chronostratigraphic Chart

    NARCIS (Netherlands)

    Cohen, K.M.; Finney, S.C.; Gibbard, P.L.; Fan, J.-X.

    2013-01-01

    The International Commission on Stratigraphy (ICS) has a long tradition of producing international charts that communicate higher-order divisions of geological time and actual knowledge on the absolute numerical ages of their boundaries. The primary objective of ICS is to define precisely a global

  3. Assessment of the time-dependent inhibition (TDI) potential of test compounds with human liver microsomes by IC50 shift method using a nondilution approach.

    Science.gov (United States)

    de Ron, Lian; Rajaraman, Ganesh

    2012-09-01

    Time-dependent inhibition (TDI) of hepatic cytochrome P450 (CYP) enzymes is increasingly implicated in the majority of clinically relevant drug-drug interactions (DDIs). A time-dependent inhibitor or its reactive metabolite irreversibly inactivates CYP enzymes, thereby inhibiting the metabolism of other drugs. As the majority of marketed drugs are metabolized by CYP enzymes, their inhibition has important clinical consequences, such as in decreasing the metabolic clearance of a co-administered drug (victim drug). This could be life threatening, as such an effect narrows the therapeutic index for drugs such as warfarin and other potentially toxic agents. Therefore, it is essential to examine new chemical entities for their potential to cause TDI to minimize adverse drug reactions during human studies and use. This unit presents an in vitro procedure utilizing a nondilution method in human liver microsomes for determining the TDI potential of test compounds.

  4. 伺服液压缸压下系统动态特性测试方法研究%Dynamic characteristics test system for Servo hydraul ic cyl inder

    Institute of Scientific and Technical Information of China (English)

    杨清华

    2014-01-01

    Hydraulic system performance depends on hydraulic cylinder to a great extent,so the inspection and test of the hydraulic cylinder has very important practical significance.In this paper,combined with a large steel mill of hydraulic pressure servo system,use computer aided testing system to analyze closed loop frequency response of servo hydraulic cylinder.It is a test without load for closed loop system dynam-ic characteristics.Practice has proved that this test system is simple with accurate result,and it has a wide application prospect.%拥有良好性能的伺服液压缸在液压行业的应用日趋广泛,探索液压缸性能的检测方法有着实用意义。针对某大型钢厂的液压压下伺服系统进行无负载测试,开发了研究伺服液压缸闭环频域响应特性的计算机辅助测试系统。实践证明此测试方法操作简单,测试结果准确,有广泛应用前景。

  5. Dynamical Competition of IC-Industry Clustering from Taiwan to China

    Science.gov (United States)

    Tsai, Bi-Huei; Tsai, Kuo-Hui

    2009-08-01

    Most studies employ qualitative approach to explore the industrial clusters; however, few research has objectively quantified the evolutions of industry clustering. The purpose of this paper is to quantitatively analyze clustering among IC design, IC manufacturing as well as IC packaging and testing industries by using the foreign direct investment (FDI) data. The Lotka-Volterra system equations are first adopted here to capture the competition or cooperation among such three industries, thus explaining their clustering inclinations. The results indicate that the evolution of FDI into China for IC design industry significantly inspire the subsequent FDI of IC manufacturing as well as IC packaging and testing industries. Since IC design industry lie in the upstream stage of IC production, the middle-stream IC manufacturing and downstream IC packing and testing enterprises tend to cluster together with IC design firms, in order to sustain a steady business. Finally, Taiwan IC industry's FDI amount into China is predicted to cumulatively increase, which supports the industrial clustering tendency for Taiwan IC industry. Particularly, the FDI prediction of Lotka-Volterra model performs superior to that of the conventional Bass model after the forecast accuracy of these two models are compared. The prediction ability is dramatically improved as the industrial mutualism among each IC production stage is taken into account.

  6. Wafer-level microstructuring of glassy carbon

    Science.gov (United States)

    Hans, Loïc. E.; Prater, Karin; Kilchoer, Cédric; Scharf, Toralf; Herzig, Hans Peter; Hermerschmidt, Andreas

    2014-03-01

    Glassy carbon is used nowadays for a variety of applications because of its mechanical strength, thermal stability and non-sticking adhesion properties. One application is glass molding that allows to realize high resolution diffractive optical elements on large areas and at affordable price appropriate for mass production. We study glassy carbon microstructuring for future precision compression molding of low and high glass-transition temperature. For applications in optics the uniformity, surface roughness, edge definition and lateral resolution are very important parameters for a stamp and the final product. We study different methods of microstructuring of glassy carbon by etching and milling. Reactive ion etching with different protection layers such as photoresists, aluminium and titanium hard masks have been performed and will be compare with Ion beam etching. We comment on the quality of the structure definition and give process details as well as drawbacks for the different methods. In our fabrications we were able to realize optically flat diffractive structures with slope angles of 80° at typical feature sizes of 5 micron and 700 nm depth qualified for high precision glass molding.

  7. Oneindigheid van het IC Design

    NARCIS (Netherlands)

    Annema, Anne-Johan

    2005-01-01

    In de IC-elektronica is het begrip oneindig (en zijn alter-ego nul) al vele jaren zowel de rode draad als de grote leidraad: er worden steeds weer nieuwere technologieën en (systeem- en circuit)principes ontwikkeld om dichter bij het gewenste nulpunt en dichter bij de nagestreefde oneindigheid te ge

  8. ICS - i et minoritetsetnisk perspektiv

    DEFF Research Database (Denmark)

    Koldsø, Birgit Raundahl

    ICS anvendes i hovedparten af landets kommuner, som en generel socialfaglig metode i sagsbehandlingen omkring udsatte børn, unge og deres familier. Imidlertid findes der ingen forskning, erfaringsopsamling, evaluering eller systematiseret viden fra dansk kontekst, der sætter fokus på anvendelse a...

  9. Packaging of MEMS/MOEMS and nanodevices: reliability, testing, and characterization aspects

    Science.gov (United States)

    Tekin, Tolga; Ngo, Ha-Duong; Wittler, Olaf; Bouhlal, Bouchaib; Lang, Klaus-Dieter

    2011-02-01

    The last decade witnessed an explosive growth in research and development efforts devoted to MEMS devices and packaging. The successfully developed MEMS devices are, for example inkjet, pressure sensors, silicon microphones, accelerometers, gyroscopes, MOEMS, micro fuel cells and emerging MEMS. For the next decade, MEMS/MOEMS and nanodevice based products will penetrate into IT, telecommunications, automotive, defense, life sciences, medical and implantable applications. Forecasts say the MEMS market to be $14 billion by 2012. The packaging cost of MEMS/MOEMS products in general is about 70 percent. Unlike today's electronics IC packaging, their packaging are custom-built and difficult due to the moving structural elements. In order for the moving elements of a MEMS device to move effectively in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. For some MEMS devices, such as resonators and gyroscopes, vacuum packaging is required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a wafer level packaging. In terms of MEMS/MOEMS and nanodevice packaging, there are still many critical issues need to be addressed due to the increasing integration density supported by 3D heterogeneous integration of multi-physic components/layers consisting of photonics, electronics, rf, plasmonics, and wireless. The infrastructure of MEMS/MOEMS and nanodevices and their packaging is not well established yet. Generic packaging platform technologies are not available. Some of critical issues have been studied intensively in the last years. In this paper we will discuss about processes, reliability, testing and characterization of MEMS/MOEMS and nanodevice packaging.

  10. Three-dimensional IC trends

    Energy Technology Data Exchange (ETDEWEB)

    Akasaka, Y.

    1986-12-01

    VLSI will be reaching to the limit of minimization in the 1990s, and after that, further increase of packing density or functions might depend on the vertical integration technology. Three-dimensional (3-D) integration is expected to provide several advantages, such as 1) parallel processing, 2) high-speed operation, 3) high packing density, and 4) multifunctional operation. Basic technologies of 3-D IC are to fabricate SOI layers and to stack them monolithically. Crystallinity of the recrystallized layer in SOI has increasingly become better, and very recently crystal-axis controlled, defect-free single-crystal areas has been obtained in chip size level by laser recystallization technology. Some basic functional models showing the concept or image of a future 3-D IC were fabricated in two or three stacked active layers. Some other proposals of subsystems in the application of 3-D structure, and the technical issues for realizing practical 3-D IC, i.e., the technology for fabricating high-quality SOI crystal on complicated surface topology, crosstalk of the signals between the stacked layers, total power consumption and cooling of the chip, are also discussed in this paper.

  11. Intratumoral hu14.18-IL-2 (IC) induces local and systemic antitumor effects that involve both activated T and NK cells as well as enhanced IC retention.

    Science.gov (United States)

    Yang, Richard K; Kalogriopoulos, Nicholas A; Rakhmilevich, Alexander L; Ranheim, Erik A; Seo, Songwon; Kim, Kyungmann; Alderson, Kory L; Gan, Jacek; Reisfeld, Ralph A; Gillies, Stephen D; Hank, Jacquelyn A; Sondel, Paul M

    2012-09-01

    hu14.18-IL-2 (IC) is an immunocytokine consisting of human IL-2 linked to hu14.18 mAb, which recognizes the GD2 disialoganglioside. Phase 2 clinical trials of i.v. hu14.18-IL-2 (i.v.-IC) in neuroblastoma and melanoma are underway and have already demonstrated activity in neuroblastoma. We showed previously that intratumoral hu14.18-IL-2 (IT-IC) results in enhanced antitumor activity in mouse models compared with i.v.-IC. The studies presented in this article were designed to determine the mechanisms involved in this enhanced activity and to support the future clinical testing of intratumoral administration of immunocytokines. Improved survival and inhibition of growth of both local and distant tumors were observed in A/J mice bearing s.c. NXS2 neuroblastomas treated with IT-IC compared with those treated with i.v.-IC or control mice. The local and systemic antitumor effects of IT-IC were inhibited by depletion of NK cells or T cells. IT-IC resulted in increased NKG2D receptors on intratumoral NKG2A/C/E⁺ NKp46⁺ NK cells and NKG2A/C/E⁺ CD8⁺ T cells compared with control mice or mice treated with i.v.-IC. NKG2D levels were augmented more in tumor-infiltrating lymphocytes compared with splenocytes, supporting the localized nature of the intratumoral changes induced by IT-IC treatment. Prolonged retention of IC at the tumor site was seen with IT-IC compared with i.v.-IC. Overall, IT-IC resulted in increased numbers of activated T and NK cells within tumors, better IC retention in the tumor, enhanced inhibition of tumor growth, and improved survival compared with i.v.-IC.

  12. IC-index and maximum IC-colorings of double-stars%双星图的 IC-指数及极大 IC-着色

    Institute of Scientific and Technical Information of China (English)

    姜臻颖

    2014-01-01

    The problem of IC-coloring of double-stars is studied .It concludes a lower bound of the IC-in-dex of double-starts by showing a kind of IC-coloring above all ,then a upper bound of IC-index is ob-teined based on the definition of maximum IC-coloring .Since the upper bound and lower bound are e-qual ,the IC-index is determined ,thus two kinds of maximum IC-colorings of double-stars is proved .%研究了双星图的IC-着色问题。首先通过给出双星图一种IC-着色,得到其IC-指数的下界,再从极大IC-着色的定义出发,得到了IC-指数的上界。由上下界相等得到了双星图的IC-指数,从而证明了其2种极大IC-着色方案。

  13. 75 FR 54940 - Agency Information Collection (IC) Activities; Revision of an Approved IC; Accident Recordkeeping...

    Science.gov (United States)

    2010-09-09

    ... Federal Motor Carrier Safety Administration Agency Information Collection (IC) Activities; Revision of an Approved IC; Accident Recordkeeping Requirements AGENCY: Federal Motor Carrier Safety Administration (FMCSA... revision of the Information Collection (IC) entitled, ``Accident Recordkeeping Requirements,''...

  14. Institutional computing (IC) information session

    Energy Technology Data Exchange (ETDEWEB)

    Koch, Kenneth R [Los Alamos National Laboratory; Lally, Bryan R [Los Alamos National Laboratory

    2011-01-19

    The LANL Institutional Computing Program (IC) will host an information session about the current state of unclassified Institutional Computing at Los Alamos, exciting plans for the future, and the current call for proposals for science and engineering projects requiring computing. Program representatives will give short presentations and field questions about the call for proposals and future planned machines, and discuss technical support available to existing and future projects. Los Alamos has started making a serious institutional investment in open computing available to our science projects, and that investment is expected to increase even more.

  15. Computing fundamentals IC3 edition

    CERN Document Server

    Wempen, Faithe

    2014-01-01

    Kick start your journey into computing and prepare for your IC3 certification With this essential course book you'll be sending e-mails, surfing the web and understanding the basics of computing in no time. Written by Faithe Wempen, a Microsoft Office Master Instructor and author of more than 120 books, this complete guide to the basics has been tailored to provide comprehensive instruction on the full range of entry-level computing skills. It is a must for students looking to move into almost any profession, as entry-level computing courses have become a compulsory requirement in the modern w

  16. 基于TSV技术的CIS芯片晶圆级封装工艺研究%The Research of CIS Chip Wafer Level Packaging Process Based on TSV

    Institute of Scientific and Technical Information of China (English)

    董西英; 徐成翔

    2011-01-01

    TSV-based packaging technology is a kind of high-end technology currently used in MEMS, memory and three-dimensional integrated circuits.This article discusses the TSV-based CIS chip wafer level packaging process which is in the mass production phase and in a leading position in our country.The emphasis of this work focuses on the theoretical and experimental investigations of executing aluminum etching and photoresist removal before metallic coating, and the induced Ni-breeding problem.It is found that the new process flow can shorten the time of photoresist removal, decrease the residua of photoresist and reduce the number of layers of metallic coating.Extending UPW rinse time in electroplating process each time, avoiding forming Nickel particles in plating solution in EN Ni.Lowering zinc concentration when zinc plating and increase nitric acid cleaning steps therefore circumvent the problem of Ni-breeding.The results are helpful to improve the efficiency, increase the passing rate of the chips greatly and reduce the costs.%基于TSV技术的封装技术是目前MEMS产品、存储器、3D IC封装中的高端和热点技术.本文论述了在国内处于领先并正在量产化研究阶段的基于TSV技术的CIS芯片晶圆级封装工艺流程.通过理论分析和实验,重点研究了在封装流程中将铝刻蚀、去胶提前到金属镀覆之前的意义和所出现的镍滋生问题.研究表明,将铝刻蚀、去胶提前到金属镀覆之前可以缩短去胶时间,减少光刻胶的残留和金属镀覆层数;通过延长金属镀覆过程中每次UPW冲洗时间,在EN Ni中防止镀液结镍,并在镀锌时降低锌液的粘附性和镀锌后增加硝酸清洗步骤,即可消除镍滋生.以上研究对于提高封装效率和合格芯片率,降低成本是很有意义的.

  17. PDC IC WELD FAILURE EVALUATION AND RESOLUTION

    Energy Technology Data Exchange (ETDEWEB)

    Korinko, P.; Howard, S.; Maxwell, D.; Fiscus, J.

    2012-04-16

    During final preparations for start of the PDCF Inner Can (IC) qualification effort, welding was performed on an automated weld system known as the PICN. During the initial weld, using a pedigree canister and plug, a weld defect was observed. The defect resulted in a hole in the sidewall of the canister, and it was observed that the plug sidewall had not been consumed. This was a new type of failure not seen during development and production of legacy Bagless Transfer Cans (FB-Line/Hanford). Therefore, a team was assembled to determine the root cause and to determine if the process could be improved. After several brain storming sessions (MS and T, R and D Engineering, PDC Project), an evaluation matrix was established to direct this effort. The matrix identified numerous activities that could be taken and then prioritized those activities. This effort was limited by both time and resources (the number of canisters and plugs available for testing was limited). A discovery process was initiated to evaluate the Vendor's IC fabrication process relative to legacy processes. There were no significant findings, however, some information regarding forging/anneal processes could not be obtained. Evaluations were conducted to compare mechanical properties of the PDC canisters relative to the legacy canisters. Some differences were identified, but mechanical properties were determined to be consistent with legacy materials. A number of process changes were also evaluated. A heat treatment procedure was established that could reduce the magnetic characteristics to levels similar to the legacy materials. An in-situ arc annealing process was developed that resulted in improved weld characteristics for test articles. Also several tack welds configurations were addressed, it was found that increasing the number of tack welds (and changing the sequence) resulted in decreased can to plug gaps and a more stable weld for test articles. Incorporating all of the process

  18. Nanometer CMOS ICs from basics to ASICs

    CERN Document Server

    J M Veendrick, Harry

    2017-01-01

    This textbook provides a comprehensive, fully-updated introduction to the essentials of nanometer CMOS integrated circuits. It includes aspects of scaling to even beyond 12nm CMOS technologies and designs. It clearly describes the fundamental CMOS operating principles and presents substantial insight into the various aspects of design implementation and application. Coverage includes all associated disciplines of nanometer CMOS ICs, including physics, lithography, technology, design, memories, VLSI, power consumption, variability, reliability and signal integrity, testing, yield, failure analysis, packaging, scaling trends and road blocks. The text is based upon in-house Philips, NXP Semiconductors, Applied Materials, ASML, IMEC, ST-Ericsson, TSMC, etc., courseware, which, to date, has been completed by more than 4500 engineers working in a large variety of related disciplines: architecture, design, test, fabrication process, packaging, failure analysis and software.

  19. Photometric study of IC 2156

    CERN Document Server

    Tadross, A L

    2015-01-01

    The optical UBVRI photometric analysis has been established using SLOAN DIGITAL SKY SURVEY (SDSS database) in order to estimate the astrophysical parameters of poorly studied open star cluster IC 2156. The results of the present study are compared with a previous one of ours, which relied on the 2MASS JHK infrared photometry. The stellar density distributions and color-magnitude diagrams of the cluster are used to determine the geometrical structure; limited radius, core and tidal radii, the distances from the Sun, from the Galactic plane and from the Galactic center. Also, the main photometric parameters; age, distance modulus, color excesses, membership, total mass, luminosity, mass functions and relaxation time; have been estimated.

  20. Spitzer Observations of IC 2118

    CERN Document Server

    Guieu, S; Stauffer, J R; Vrba, F J; Noriega-Crespo, A; Spuck, T; Moody, T Roelofsen; Sepulveda, B; Weehler, C; Maranto, A; Cole, D M; Flagey, N; Laher, R; Penprase, B; Ramirez, S; Stolovy, S

    2010-01-01

    IC 2118, also known as the Witch Head Nebula, is a wispy, roughly cometary, ~5 degree long reflection nebula, and is thought to be a site of triggered star formation. In order to search for new young stellar objects (YSOs), we have observed this region in 7 mid- and far-infrared bands using the Spitzer Space Telescope and in 4 bands in the optical using the U. S. Naval Observatory 40-inch telescope. We find infrared excesses in 4 of the 6 previously-known T Tauri stars in our combined infrared maps, and we find 6 entirely new candidate YSOs, one of which may be an edge-on disk. Most of the YSOs seen in the infrared are Class II objects, and they are all in the "head" of the nebula, within the most massive molecular cloud of the region.

  1. CO observation of SNR IC 443

    Institute of Scientific and Technical Information of China (English)

    2010-01-01

    We present our 12CO and 13CO mapping observations of SNR IC 443 interacting with molecular clouds.It is the first largescale high-resolution 13CO mapping observation in the surrounding region.The morphologies of IC 443 in 12CO and 13 CO are compared with the optical,infrared,Spitzer far-infrared,X-ray,and neutral atomic gas(HI).We also make comparison and analysis in the kinematics,using the date-cubes of 12CO,13CO and HI,to help distinguish the complicated gas motions in the shocked regions.Based on the work of Wang & Scoville(1992),we present a new model to explain the coexistence of multiple shocks with different speeds in a pc-scale region at the central clump B.We test this new model by analyzing the HI and CO distribution in both velocity and space domain.We also establish the relationship between the dissociation rate of shocked molecular gas and the shock velocity in this region.Finally,we derive the optical depth of 12CO with the 13CO spectra in clump B,and discuss the validity of the assumption of optically thin emission for the shocked 12CO.

  2. Mod 1 ICS TI Report: ICS Conversion of a 140% HPGe Detector

    Energy Technology Data Exchange (ETDEWEB)

    Bounds, John Alan [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2016-07-05

    This report evaluates the Mod 1 ICS, an electrically cooled 140% HPGe detector. It is a custom version of the ORTEC Integrated Cooling System (ICS) modified to make it more practical for us to use in the field. Performance and operating characteristics of the Mod 1 ICS are documented, noting both pros and cons. The Mod 1 ICS is deemed a success. Recommendations for a Mod 2 ICS, a true field prototype, are provided.

  3. Air Tightness Testing and Analysis of Vacuum Chambers of IC Equipment%IC装备真空腔室的气密性检测试验及分析

    Institute of Scientific and Technical Information of China (English)

    周玉林; 杨铁牛

    2015-01-01

    Chamber air tightness is an important factor affecting flow field uniformity of IC equipment. Only when the magnitude of chamber leakage rate is not higher than 6 310− Pa⋅m /s and the ultimate vacuum degree is not higher than 410− Pa can the tightness meet the leakage rate requirements of IC process. In this study, helium mass spectrometer is used to detect vacuum chamber leakage, and leaking points are treated one by one using plugging processing to enable chamber air-tightness to meet the process requirements of IC equipment. The chamber leakage obtained through calculation using the static pressurizing method is 6 38.84 ×10− Pa⋅m /s and the ultimate vacuum degree is 42 ×10− Pa . Considering the small volume (10−30 L) of the actual production process chamber and the relatively large volume of the experimental chamber, the vacuum chambers established can meet the IC equipment leak rate requirements.%腔室气密性是影响集成电路(IC)装备真空腔室内流场均匀性的重要因素,腔室漏率数量级不高于6310− Pa⋅m /s、极限真空度数量级不高于410− Pa ,才能满足 IC 工艺的漏率要求.本文用氦质谱检漏仪检测真空腔室泄漏情况,并将泄漏处逐一进行堵漏处理,使腔室气密性能达到 IC 装备的工艺要求.用静态升压法计算得出腔室漏率为 638.84×10− Pa⋅m /s ,极限真空度为42×10− Pa ,考虑用于实际生产的工艺腔室体积小(10~30 L),而本实验腔室体积(84.5 L)较大,所以搭建的真空室可以满足 IC装备的漏率要求.

  4. Structure Design of MEMS Piezoelectric Vibration Energy Harvester with Wafer-Level Low Vacuum Packaging%圆片级低真空封装的MEMS压电振动能量收集器结构设计

    Institute of Scientific and Technical Information of China (English)

    张颖异; 温志渝; 邓丽城

    2016-01-01

    MEMS低真空封装技术能为MEMS器件的可动部分提供低阻尼环境,降低能量损耗,有效提高器件的能量转换效率,具有重要的研究意义和应用前景,是MEMS技术的研究热点和难点。为了进一步提高MEMS压电振动能量收集器的输出性能,提出了圆片级低真空封装的共质量块MEMS压电悬臂梁阵列振动能量收集器新结构,通过有限元分析方法对器件结构参数进行了优化设计,在优化结构参数下仿真器件输出性能:在610 Hz、2 gn加速度下,器件的输出电压为8.88 V,输出功率为1220μW,能满足实际应用需求;根据器件结构设计了加工工艺流程,对低真空封装结构的实现和封装工艺探索具有重要意义。%MEMS low vacuum packaging technology can provide low damping environment for the movable part of MEMS devices,decrease the energy loss,and improve the energy conversion efficiency of the devices. So it has im⁃portant research significance and application prospects,and becomes the study hotspot and difficulty of MEMS tech⁃nology. In order to further improve the output performance of MEMS piezoelectric vibration energy harvester,this paper proposes a new structure of wafer-level low vacuum packaged and piezoelectric cantilever array fixed on one sharing mass based MEMS piezoelectric vibration energy harvester,and optimization design and analysis for struc⁃ture parameters of the device is done by finite element method. The output performance is simulated at the opti⁃mized parameters:at 610 Hz and 2 g acceleration,the output voltage of the device is 8.88 V,and the output power is 1 220 mW,which can satisfy the need of practical application. The process flow is designed on the basis of the de⁃vice structure,it will be of great importance in the realization of low vacuum packaging structure and the exploration of package technology.

  5. System reduction for nanoscale IC design

    CERN Document Server

    2017-01-01

    This book describes the computational challenges posed by the progression toward nanoscale electronic devices and increasingly short design cycles in the microelectronics industry, and proposes methods of model reduction which facilitate circuit and device simulation for specific tasks in the design cycle. The goal is to develop and compare methods for system reduction in the design of high dimensional nanoelectronic ICs, and to test these methods in the practice of semiconductor development. Six chapters describe the challenges for numerical simulation of nanoelectronic circuits and suggest model reduction methods for constituting equations. These include linear and nonlinear differential equations tailored to circuit equations and drift diffusion equations for semiconductor devices. The performance of these methods is illustrated with numerical experiments using real-world data. Readers will benefit from an up-to-date overview of the latest model reduction methods in computational nanoelectronics.

  6. Reducing Area & Power Overhead In Design of Light Weight Sensor For Detection of Reclcled ICS

    Directory of Open Access Journals (Sweden)

    R.Prabakaran

    2015-05-01

    Full Text Available The counterfeiting and recycling of integrated circuits (ICs have become major issues in recent years, potentially impacting the security and reliability of electronic systems bound for military, financial, or other critical applications. With identical functionality and packaging, it would be extremely difficult to distinguish recycled ICs from unused ICs. In the existing Ring Oscillator (RO based sensor with 90nm technology test chip shows the effective detection of recycled ICs. The impact of RO based sensor is that, it is difficult to identify recycled ICs used shorter than one month and it requires more power and area overhead. To provide a solution to the existing system, Clock Anti fuses (CAF based sensor is implemented to enhance the effective recognition of recycled ICs even if the IC used for a very short period. MAF is implemented in FPGA to verify its effectiveness.

  7. Newnes digital logic IC pocket book

    CERN Document Server

    MARSTON, R M

    1996-01-01

    This handy reference guide to modern '74'- series and '4000'- series digital ICs presents 620 useful and carefully selected circuits, diagrams, graphs and tables, supported by informative text and captions. Detailed descriptions of and practical applications information on more than 185 TTL and CMOS ICs are provided.This wealth of information is clearly and logically arranged so that specific information can be quickly and easily located. Fifteen chapters cover from IC basics and TTL and CMOS principles, to the practical circuitry of logic ICs, waveform generators and multiplexers.

  8. Deposition uniformity inspection in IC wafer surface

    Science.gov (United States)

    Li, W. C.; Lin, Y. T.; Jeng, J. J.; Chang, C. L.

    2014-03-01

    This paper focuses on the task of automatic visual inspection of color uniformity on the surface of integrated circuits (IC) wafers arising from the layering process. The oxide thickness uniformity within a given wafer with a desired target thickness is of great importance for modern semiconductor circuits with small oxide thickness. The non-uniform chemical vapor deposition (CVD) on a wafer surface will proceed to fail testing in Wafer Acceptance Test (WAT). Early detection of non-uniform deposition in a wafer surface can reduce material waste and improve production yields. The fastest and most low-priced inspection method is a machine vision-based inspection system. In this paper, the proposed visual inspection system is based on the color representations which were reflected from wafer surface. The regions of non-uniform deposition present different colors from the uniform background in a wafer surface. The proposed inspection technique first learns the color data via color space transformation from uniform deposition of normal wafer surfaces. The individual small region statistical comparison scheme then proceeds to the testing wafers. Experimental results show that the proposed method can effectively detect the non-uniform deposition regions on the wafer surface. The inspection time of the deposited wafers is quite compatible with the atmospheric pressure CVD time.

  9. 双星图的IC-指数%The IC-index of Double-stars

    Institute of Scientific and Technical Information of China (English)

    陈剑峰; 杨大庆

    2013-01-01

    已经知道双星图至多有两种极大IC-着色,并且其中一种情况下的IC-指数已经确定.在此基础上,研究了双星图的的另一种极大IC-着色,得到了在这种情况下的IC-指数.从而得到了双星图的所有极大IC-着色,且双星图的IC-指数为:M(DS(m,n))=(2m-1+1)(2n-1+1),其中2≤m≤n.%We known about the graph of double-stars contains two maximal IC-coloring at most,and one case of the IC-index have been determined.Based on this,this paper studied the another great IC-coloring of the graph of double-stars,and obtained in the circumstances of IC-index.So get the the graph of double-stars maximal IC-coloring,and the graph of double-stars IC-index as follow:M(DS(m,n)) =(2m-1 + 1)(2n-1 + 1),2 ≤ m ≤ n.

  10. Electromigration of damascene copper of IC interconnect

    Science.gov (United States)

    Meyer, William Kevin

    Copper metallization patterned with multi-level damascene process is prone to electromigration failure, which affects the reliability and performance of IC interconnect. In typical products, interconnect that is not already constrained by I·R drop or Joule self-heating operates at 'near threshold' conditions. Measurement of electromigration damage near threshold is very difficult due to slow degradation requiring greatly extended stress times, or high currents that cause thermal anomalies. Software simulations of the electromigration mechanism combined with characterization of temperature profiles allows extracting material parameters and calculation of design rules to ensure reliable interconnect. Test structures capable of demonstrating Blech threshold effects while allowing thermal characterization were designed and processed. Electromigration stress tests at various conditions were performed to extract both shortline (threshold) and long-line (above threshold) performance values. The resistance increase time constant shows immortality below Je·L (product of current density and segment length) of 3200 amp/cm. Statistical analysis of times-to-failure show that long lines last 105 hours at 3.1 mA/mum2 (120°C). While this is more robust than aluminum interconnect, the semiconductor industry will be challenged to improve that performance as future products require.

  11. IC-coloring and IC-index of Octopus Graphs%章鱼图的IC-着色和IC-指数

    Institute of Scientific and Technical Information of China (English)

    杨杨; 王力工

    2014-01-01

    章鱼图H(Cm,n)是指由圈Cm的一个顶点与星图STn=K1,n的中心重迭得到的图,研究了章鱼图H(Cm,n)的IC-着色问题,通过分类讨论的方法,分别得到了当m=3,4,5,n≥1时章鱼图H(Cm,n)的极大IC-着色和它们相应的IC-指数,并提出章鱼图H(Cm,n)一个上界猜想。%The octopus graph H(Cm, n) is formed by identifying a vertex of the cycle Cm and the center of a star STn=K1,n . In this paper, the problem of IC-colorings on the octopus graph is studied. When m=3,4,5,n≥1 , IC-indices and maximal IC-colorings of the octopus graph H(Cm, n) are obtained respectively. A conjecture for the up-per bound of the IC-index of the octopus graph is proposed.

  12. SPROC: A multiple-processor DSP IC

    Science.gov (United States)

    Davis, R.

    1991-01-01

    A large, single-chip, multiple-processor, digital signal processing (DSP) integrated circuit (IC) fabricated in HP-Cmos34 is presented. The innovative architecture is best suited for analog and real-time systems characterized by both parallel signal data flows and concurrent logic processing. The IC is supported by a powerful development system that transforms graphical signal flow graphs into production-ready systems in minutes. Automatic compiler partitioning of tasks among four on-chip processors gives the IC the signal processing power of several conventional DSP chips.

  13. On the ratio of intercellular to ambient CO2 (c i/c a) derived from ecosystem flux

    Science.gov (United States)

    Tan, Zheng-Hong; Wu, Zhi-Xiang; Hughes, Alice C.; Schaefer, Douglas; Zeng, Jiye; Lan, Guo-Yu; Yang, Chuang; Tao, Zhong-Liang; Chen, Bang-Qian; Tian, Yao-Hua; Song, Liang; Jatoi, Muhammad Tahir; Zhao, Jun-Fu; Yang, Lian-Yan

    2017-07-01

    The ratio of intercellular to ambient CO2 concentrations (c i/c a) plays a key role in ecophysiology, micrometeorology, and global climatic change. However, systematic investigation on c i/c a variation and its determinants are rare. Here, the c i/c a was derived from measuring ecosystem fluxes in an even-aged monoculture of rubber trees (Hevea brasiliensis). We tested whether c i/c a is constant across environmental gradients and if not, which dominant factors control c i/c a variations. Evidence indicates that c i/c a is not a constant. The c i/c a exhibits a clear "V"-shaped diurnal pattern and varies across the environmental gradient. Water vapor pressure deficit (D) is the dominant factor controls over the c i/c a variations. c i/c a consistently decreases with increasing D. c i/c a decreases with square root of D as predicted by the optimal stomatal model. The D-driving single-variable model could simulate c i/c a as well as that of sophisticated model. Many variables function on longer timescales than a daily cycle, such as soil water content, could improve c i/c a model prediction ability. Ecosystem flux can be effectively used to calculate c i/c a and use it to better understand various natural cycles.

  14. RADIATION HARDENED ANALOG IC FOR SENSOR

    Directory of Open Access Journals (Sweden)

    O. V. Dvornikov

    2011-01-01

    Full Text Available Problems of specialized analog integrated circuit design for sensor equipments are considered. It is offered to produce of radiation hardened analog IC on structured chips for economic efficiency at small production volume. The approach to analog IC design is described, including recommendations for choice of: types and quantities of structured chip analogue components; active and passive components; schematic decisions of analogue components with programmed parameters and small sensitivity to radiation. 

  15. Information Commons for Rice (IC4R).

    Science.gov (United States)

    Hao, Lili; Zhang, Huiyong; Zhang, Zhang; Hu, Songnian; Xue, Yu

    2016-01-04

    Rice is the most important staple food for a large part of the world's human population and also a key model organism for plant research. Here, we present Information Commons for Rice (IC4R; http://ic4r.org), a rice knowledgebase featuring adoption of an extensible and sustainable architecture that integrates multiple omics data through community-contributed modules. Each module is developed and maintained by different committed groups, deals with data collection, processing and visualization, and delivers data on-demand via web services. In the current version, IC4R incorporates a variety of rice data through multiple committed modules, including genome-wide expression profiles derived entirely from RNA-Seq data, resequencing-based genomic variations obtained from re-sequencing data of thousands of rice varieties, plant homologous genes covering multiple diverse plant species, post-translational modifications, rice-related literatures and gene annotations contributed by the rice research community. Unlike extant related databases, IC4R is designed for scalability and sustainability and thus also features collaborative integration of rice data and low costs for database update and maintenance. Future directions of IC4R include incorporation of other omics data and association of multiple omics data with agronomically important traits, dedicating to build IC4R into a valuable knowledgebase for both basic and translational researches in rice. © The Author(s) 2015. Published by Oxford University Press on behalf of Nucleic Acids Research.

  16. Systolic array IC for genetic computation

    Science.gov (United States)

    Anderson, D.

    1991-01-01

    Measuring similarities between large sequences of genetic information is a formidable task requiring enormous amounts of computer time. Geneticists claim that nearly two months of CRAY-2 time are required to run a single comparison of the known database against the new bases that will be found this year, and more than a CRAY-2 year for next year's genetic discoveries, and so on. The DNA IC, designed at HP-ICBD in cooperation with the California Institute of Technology and the Jet Propulsion Laboratory, is being implemented in order to move the task of genetic comparison onto workstations and personal computers, while vastly improving performance. The chip is a systolic (pumped) array comprised of 16 processors, control logic, and global RAM, totaling 400,000 FETS. At 12 MHz, each chip performs 2.7 billion 16 bit operations per second. Using 35 of these chips in series on one PC board (performing nearly 100 billion operations per second), a sequence of 560 bases can be compared against the eventual total genome of 3 billion bases, in minutes--on a personal computer. While the designed purpose of the DNA chip is for genetic research, other disciplines requiring similarity measurements between strings of 7 bit encoded data could make use of this chip as well. Cryptography and speech recognition are two examples. A mix of full custom design and standard cells, in CMOS34, were used to achieve these goals. Innovative test methods were developed to enhance controllability and observability in the array. This paper describes these techniques as well as the chip's functionality. This chip was designed in the 1989-90 timeframe.

  17. The Selection of the Phone Charging IC

    Institute of Scientific and Technical Information of China (English)

    Jian ming Lei

    2013-01-01

    An expensive digital IC is used in old battery only charger (BOC) and this IC needs separate software. For simplify the design and reduce the cost, we find the existing analogy charging ICs and select the most popular four from them, including Mitsumi, Freescale, TI and Analogic Tech, we make a detailed comparison and select the best one, based on this IC’s feature and our requirements, A detailed design evaluation is presented, including the design of the input over voltage protection (OVP), output OVP and over temperature protection (OTP), the WCA (Worse Case Analysis) of this OTP. After the improvement, this new BOC has lower cost, simpler topology, more efficient power consumption.

  18. Challenges in IC design for hearing aids

    DEFF Research Database (Denmark)

    Jørgensen, Ivan Harald Holger

    2012-01-01

    Designing modern hearing aids is a formidable challenge. The size of hearing aids is constantly decreasing, making them virtually invisible today. Still, as in all other modern electronics, more and more features are added to these devices driven by the development in modern IC technology....... The demands for performance and features at very low supply voltage and power consumption constantly prove a challenge to the physical design of hearing aids and not at least the design of the ICs for these. As a result of this all large hearing aid manufacturers use fully customized ASICs in their products....... The size of the amplifier is critical for the size of the final hearing aid and a study of the size of these for different manufactures will be presented. Designing the ICs for hearing aids poses many challenges and is a constant compromise between size, power consumption and performance of the individual...

  19. Challenges in IC design for hearing aids

    DEFF Research Database (Denmark)

    Jørgensen, Ivan Harald Holger

    2012-01-01

    Designing modern hearing aids is a formidable challenge. The size of hearing aids is constantly decreasing, making them virtually invisible today. Still, as in all other modern electronics, more and more features are added to these devices driven by the development in modern IC technology....... The demands for performance and features at very low supply voltage and power consumption constantly prove a challenge to the physical design of hearing aids and not at least the design of the ICs for these. As a result of this all large hearing aid manufacturers use fully customized ASICs in their products...

  20. Mismatch and noise in modern IC processes

    CERN Document Server

    Marshall, Andrew

    2009-01-01

    Component variability, mismatch, and various noise effects are major contributors to design limitations in most modern IC processes. Mismatch and Noise in Modern IC Processes examines these related effects and how they affect the building block circuits of modern integrated circuits, from the perspective of a circuit designer.Variability usually refers to a large scale variation that can occur on a wafer to wafer and lot to lot basis, and over long distances on a wafer. This phenomenon is well understood and the effects of variability are included in most integrated circuit design with the use

  1. Differences between IC Analysis and TG Approach

    Institute of Scientific and Technical Information of China (English)

    张美玲

    2014-01-01

    Structuralism and generative approach are two representative syntax theories, which study language from different per-spectives. They employ different methodologies i.e. Immediate constituent (IC) Analysis and transformational-generative (TG) approach to make syntactical analysis. In this paper, these two methods will be applied to analyze some sentences for further dis-cussion and comparison. After analysis by examples, we find that both these two methods have their merits and inadequacies. To some extent, TG method can help IC analysis solve some problems. However, TG grammar is by no means complete and perfect. Improvements are needed to reach its ultimate goal of producing a universal grammar for all human languages.

  2. Abundances of Planetary Nebulae IC 418, IC 2165 and NGC 5882

    NARCIS (Netherlands)

    Pottasch, [No Value; Bernard-Salas, J; Beintema, DA; Feibelman, WA

    2004-01-01

    The ISO and IUE spectra of the elliptical nebulae NGC 5882, IC 418 and IC 2165 are presented. These spectra are combined with the spectra in the visual wavelength region to obtain a complete, extinction corrected, spectrum. The chemical composition of the nebulae is then calculated and compared to p

  3. A learning-enabled neuron array IC based upon transistor channel models of biological phenomena.

    Science.gov (United States)

    Brink, S; Nease, S; Hasler, P; Ramakrishnan, S; Wunderlich, R; Basu, A; Degnan, B

    2013-02-01

    We present a single-chip array of 100 biologically-based electronic neuron models interconnected to each other and the outside environment through 30,000 synapses. The chip was fabricated in a standard 350 nm CMOS IC process. Our approach used dense circuit models of synaptic behavior, including biological computation and learning, as well as transistor channel models. We use Address-Event Representation (AER) spike communication for inputs and outputs to this IC. We present the IC architecture and infrastructure, including IC chip, configuration tools, and testing platform. We present measurement of small network of neurons, measurement of STDP neuron dynamics, and measurement from a compiled spiking neuron WTA topology, all compiled into this IC.

  4. Embedded I&C for Extreme Environments

    Energy Technology Data Exchange (ETDEWEB)

    Kisner, Roger A. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

    2016-04-01

    This project uses embedded instrumentation and control (I&C) technologies to demonstrate potential performance gains of nuclear power plant components in extreme environments. Extreme environments include high temperature, radiation, high pressure, high vibration, and high EMI conditions. For extreme environments, performance gains arise from moment-to-moment sensing of local variables and immediate application of local feedback control. Planning for embedding I&C during early system design phases contrasts with the traditional, serial design approach that incorporates minimal I&C after mechanical and electrical design is complete. The demonstration application involves the development and control of a novel, proof-of-concept motor/pump design. The motor and pump combination operate within the fluid environment, eliminating the need for rotating seals. Actively controlled magnetic bearings also replace failure-prone mechanical contact bearings that typically suspend rotating components. Such as design has the potential to significantly enhance the reliability and life of the pumping system and would not be possible without embedded I&C.

  5. Generating Analog IC Layouts with LAYGEN II

    CERN Document Server

    Martins, Ricardo M F; Horta, Nuno C G

    2013-01-01

    This book presents an innovative methodology for the automatic generation of analog integrated circuits (ICs) layout, based on template descriptions and on evolutionary computational techniques. A design automation tool, LAYGEN II, was implemented to validate the proposed approach giving special emphasis to reusability of expert design knowledge and to efficiency on retargeting operations.

  6. TDR method for determine IC's parameters

    Science.gov (United States)

    Timoshenkov, V.; Rodionov, D.; Khlybov, A.

    2016-12-01

    Frequency domain simulation is a widely used approach for determine integrated circuits parameters. This approach can be found in most of software tools used in IC industry. Time domain simulation approach shows intensive usage last years due to some advantages. In particular it applicable for analysis of nonlinear and nonstationary systems where frequency domain is inapplicable. Resolution of time domain systems allow see heterogeneities on distance 1mm, determine it parameters and properties. Authors used approach based on detecting reflected signals from heterogeneities - time domain reflectometry (TDR). Field effect transistor technology scaling up to 30-60nm gate length and 10nm gate dielectric, heterojunction bi-polar transistors with 10-30nm base width allows fabricate digital IC's with 20GHz clock frequency and RF-IC's with tens GHz bandwidth. Such devices and operation speed suppose transit signal by use microwave lines. There are local heterogeneities can be found inside of the signal path due to connections between different parts of signal lines (stripe line-RF-connector pin, stripe line - IC package pin). These heterogeneities distort signals that cause bandwidth decrease for RF-devices. Time domain research methods of transmission and reflected signals give the opportunities to determine heterogeneities, it properties, parameters and built up equivalent circuits. Experimental results are provided and show possibility for inductance and capacitance measurement up to 25GHz. Measurements contains result of signal path research on IC and printed circuit board (PCB) used for 12GHz RF chips. Also dielectric constant versus frequency was measured up to 35GHz.

  7. Predicting levator avulsion from ICS POP-Q findings.

    Science.gov (United States)

    Pattillo Garnham, Alejandro; Guzmán Rojas, Rodrigo; Shek, Ka Lai; Dietz, Hans Peter

    2017-06-01

    Levator avulsion is a common consequence of vaginal childbirth. It is associated with symptomatic female pelvic organ prolapse and is also a predictor of recurrence after surgical correction. Skills and hardware necessary for diagnosis by imaging are, however, not universally available. Diagnosis of avulsion may benefit from an elevated index of suspicion. The aim of this study was to examine the predictive value of the International Continence Society Pelvic Organ Prolapse Quantification (ICS POP-Q) for the diagnosis of levator avulsion by tomographic 4D translabial ultrasound. This is a retrospective analysis of data obtained in a tertiary urogynaecological unit. Subjects underwent a standardised interview, POP-Q examination and 4D translabial pelvic floor ultrasound. Avulsion of the puborectalis muscle was diagnosed by tomographic ultrasound imaging. We tested components of the ICS POP-Q associated with symptomatic prolapse and other known predictors of avulsion, including previous prolapse repair and forceps delivery with uni- and multivariate logistic regression. A risk score was constructed for clinical use. The ICS POP-Q components Ba, C, gh and pb were all significantly associated with avulsion on multivariate analysis, along with previous prolapse repair and forceps delivery. A score was assigned for each of these variables and patients were classified as low, moderate or high risk according to total score. The odds of finding an avulsion on ultrasound in patients in the "high risk" group were 12.8 times higher than in the "low risk" group. Levator avulsion is associated with ICS POP-Q measures. Together with simple clinical data, it is possible to predict the risk of avulsion using a scoring system. This may be useful in clinical practice by modifying the index of suspicion for the condition.

  8. Hydrogen for IC Engines: A Review

    Directory of Open Access Journals (Sweden)

    Vinayaka S, Syed farees khaleel rahman H.K

    2013-10-01

    Full Text Available Hydrogen provides a pathway for energy diversity. It can store the energy from diverse domestic resources (including clean coal, nuclear, and intermittently available renewables for use in mobile applications and more. Vehicles operating on hydrogen can dramatically reduce our nation’s dependence on oil and significantly reduce tailpipe emissions. Hydrogen offers a potential means to store and deliver energy from abundant, domestically available resources—while reducing our nation’s carbon footprint. This paper describes the use of Hydrogen as a fuel in IC engines and the technical aspects that accompany this idea.

  9. The eight-channel fast comparator IC

    CERN Document Server

    Alexeev, G D; Dvornikov, O V; Mikhailov, V A; Odnokloubov, I A; Tokmenin, V V

    1999-01-01

    The eight-channel fast comparator IC has been designed for high-energy physics experiments. The propagation delay is 15-36 ns and will be decreased to 7-11 ns. The output front/trailing edges are 2.2 ns and 1.8 ns at matched 110 OMEGA load. Dissipated power equals 84 mW/channel. The circuit current output can drive 30 m flat ribbon cable or twisted pair line terminated by differential line driver DS90C031.

  10. 星的细分图的IC-着色%IC-coloring of the Subdivision of Stars

    Institute of Scientific and Technical Information of China (English)

    陈剑峰

    2012-01-01

    研究了星的细分图的IC-着色问题,改进了星的细分图的IC-指数的下界,并且得到了两类图的IC-指数的一个下界。%This thesis researches the IC-coloring of the star subdivision graph,improved the lower IC-index of the star subdivision graph,and concluded two class graphs of the one lower IC-index.

  11. Medical Expenditure Panel Survey MEPSnet Insurance Component (MEPSnet/IC)

    Data.gov (United States)

    U.S. Department of Health & Human Services — The MEPS-IC is an annual survey of establishments that collects information about employer-sponsored health insurance offerings in the United States. With MEPSnet/IC...

  12. Properties of Ag/AgCl electrodes fabricated with IC-compatible technologies

    NARCIS (Netherlands)

    Bousse, L.J.; Bergveld, P.; Geeraedts, H.J.M.

    1986-01-01

    The purpose of this work is to fabricate and characterize Ag/AgCl electrodes made on a silicon chip at the wafer level with integrated circuit-compatible fabrication techniques. Such electrodes are useful as reference electrodes in several kinds of chemical sensors. Two types of electrode were inves

  13. Studying Radiation Tolerant ICs for LHC

    CERN Multimedia

    Faccio, F; Snoeys, W; Campbell, M; Casas-cubillos, J; Gomes, P

    2002-01-01

    %title\\\\ \\\\In the recent years, intensive work has been carried out on the development of custom ICs for the readout electronics for LHC experiments. As far as radiation hardness is concerned, attention has been focussed on high total dose applications, mainly for the tracker systems. The dose foreseen in this inner region is estimated to be higher than 1~Mrad/year. In the framework of R&D projects (RD-9 and RD-20) and in the ATLAS and CMS experiments, the study of different radiation hard processes has been pursued and good contacts with the manufacturers have been established. The results of these studies have been discussed during the Microelectronics User Group (MUG) rad-hard meetings, and now some HEP groups are working to develop radiation hard ICs for the LHC experiments on some of the available rad-hard processes.\\\\ \\\\In addition, a lot of the standard commercial electronic components and ASICs which are planned to be installed near the LHC machine and in the detectors will receive total doses in ...

  14. Electron Storage Ring Development for ICS Sources

    Energy Technology Data Exchange (ETDEWEB)

    Loewen, Roderick [Lyncean Technologies, Inc., Palo Alto, CA (United States)

    2015-09-30

    There is an increasing world-wide interest in compact light sources based on Inverse Compton Scattering. Development of these types of light sources includes leveraging the investment in accelerator technology first developed at DOE National Laboratories. Although these types of light sources cannot replace the larger user-supported synchrotron facilities, they offer attractive alternatives for many x-ray science applications. Fundamental research at the SLAC National Laboratory in the 1990’s led to the idea of using laser-electron storage rings as a mechanism to generate x-rays with many properties of the larger synchrotron light facilities. This research led to a commercial spin-off of this technology. The SBIR project goal is to understand and improve the performance of the electron storage ring system of the commercially available Compact Light Source. The knowledge gained from studying a low-energy electron storage ring may also benefit other Inverse Compton Scattering (ICS) source development. Better electron storage ring performance is one of the key technologies necessary to extend the utility and breadth of applications of the CLS or related ICS sources. This grant includes a subcontract with SLAC for technical personnel and resources for modeling, feedback development, and related accelerator physics studies.

  15. Latency represents sound frequency in mouse IC

    Institute of Scientific and Technical Information of China (English)

    2007-01-01

    Frequency is one of the fundamental parameters of sound.The frequency of an acoustic stimulus can be represented by a neural response such as spike rate,and/or first spike latency(FSL)of a given neuron.The spike rates/frequency function of most neurons changes with different acoustic ampli-tudes,whereas FSL/frequency function is highly stable.This implies that FSL might represent the fre-quency of a sound stimulus more efficiently than spike rate.This study involved representations of acoustic frequency by spike rate and FSL of central inferior colliculus(IC)neurons responding to free-field pure-tone stimuli.We found that the FSLs of neurons responding to characteristic frequency(CF)of sound stimulus were usually the shortest,regardless of sound intensity,and that spike rates of most neurons showed a variety of function according to sound frequency,especially at high intensities.These results strongly suggest that FSL of auditory IC neurons can represent sound frequency more precisely than spike rate.

  16. Latency represents sound frequency in mouse IC

    Institute of Scientific and Technical Information of China (English)

    QIU Qiang; TANG Jie; YU ZuLin; ZHANG Juan; ZHOU YingJie; XIAO ZhongJu; SHEN JunXian

    2007-01-01

    Frequency is one of the fundamental parameters of sound. The frequency of an acoustic stimulus can be represented by a neural response such as spike rate, and/or first spike latency (FSL) of a given neuron. The spike rates/frequency function of most neurons changes with different acoustic amplitudes, whereas FSL/frequency function is highly stable. This implies that FSL might represent the frequency of a sound stimulus more efficiently than spike rate. This study involved representations of acoustic frequency by spike rate and FSL of central inferior colliculus (IC) neurons responding to free-field pure-tone stimuli. We found that the FSLs of neurons responding to characteristic frequency (CF) of sound stimulus were usually the shortest, regardless of sound intensity, and that spike rates of most neurons showed a variety of function according to sound frequency, especially at high intensities.These results strongly suggest that FSL of auditory IC neurons can represent sound frequency more precisely than spike rate.

  17. Full chip modelling of ICs under CDM stress

    NARCIS (Netherlands)

    Sowariraj, Mary Sheela Bobby

    2005-01-01

    In this thesis, CDM ESD stress on the Integrated Circuits (IC) and the various factors which affect the robustness of an IC design against CDM stress is investigated. One of the main reasons for CDM failure are the voltage gradients set across the circuit during CDM stress. The IC being also the sou

  18. Full chip modelling of ICs under CDM stress

    NARCIS (Netherlands)

    Sowariraj, M.S.B.

    2005-01-01

    In this thesis, CDM ESD stress on the Integrated Circuits (IC) and the various factors which affect the robustness of an IC design against CDM stress is investigated. One of the main reasons for CDM failure are the voltage gradients set across the circuit during CDM stress. The IC being also the

  19. Design for Reliability of Wafer Level MEMS packaging

    NARCIS (Netherlands)

    Zaal, J.J.M.

    2012-01-01

    The world has seen an unrivaled spread of semiconductor technology into virtually any part of society. The main enablers of this semiconductor rush are the decreasing feature size and the constantly decreasing costs of semiconductors. The decreasing costs of semiconductors in general are caused by t

  20. Design for Reliability of Wafer Level MEMS packaging

    NARCIS (Netherlands)

    Zaal, J.J.M.

    2012-01-01

    The world has seen an unrivaled spread of semiconductor technology into virtually any part of society. The main enablers of this semiconductor rush are the decreasing feature size and the constantly decreasing costs of semiconductors. The decreasing costs of semiconductors in general are caused by t

  1. Mass modelling of superthin galaxies: IC5249, UGC7321 and IC2233

    Science.gov (United States)

    Banerjee, Arunima; Bapat, Disha

    2017-04-01

    Superthin galaxies are low surface brightness (LSB) disc galaxies, characterized by optical discs with strikingly high values of planar-to-vertical axes ratios (>10), the physical origin and evolution of which continue to be a puzzle. We present mass models for three superthin galaxies: IC5249, UGC7321 and IC2233. We use high-resolution rotation curves and gas surface density distributions obtained from H I 21 cm radiosynthesis observations, in combination with their two-dimensional structural surface brightness decompositions at Spitzer 3.6 μm band, all of which were available in the literature. We find that while models with the pseudo-isothermal (PIS) and the Navarro-Frenk-White (NFW) dark matter density profiles fit the observed rotation curves of IC5249 and UGC7321 equally well, those with the NFW profile do not comply with the slowly rising rotation curve of IC2233. Interestingly, for all of our sample galaxies, the best-fitting mass models with a PIS dark matter density profile indicate a compact dark matter halo, i.e. Rc/RD < 2, where Rc is the core radius of the PIS dark matter halo and RD is the radial scalelength of the exponential stellar disc. The compact dark matter halo may be fundamentally responsible for the superthin nature of the stellar disc, and therefore our results may have important implications for the formation and evolution models of superthin galaxies in the universe.

  2. Aluminum nitride for heatspreading in RF IC's

    Science.gov (United States)

    La Spina, L.; Iborra, E.; Schellevis, H.; Clement, M.; Olivares, J.; Nanver, L. K.

    2008-09-01

    To reduce the electrothermal instabilities in silicon-on-glass high-frequency bipolar devices, the integration of thin-film aluminum nitride as a heatspreader is studied. The AlN is deposited by reactive sputtering and this material is shown to fulfill all the requirements for actively draining heat from RF IC's, i.e., it has good process compatibility, sufficiently high thermal conductivity and good electrical isolation also at high frequencies. The residual stress and the piezoelectric character of the material, both of which can be detrimental for the present application, are minimized by a suitable choice of deposition conditions including variable biasing of the substrate in a multistep deposition cycle. Films of AlN as thick as 4 μm are successfully integrated in RF silicon-on-glass bipolar junction transistors that display a reduction of more than 70% in the value of the thermal resistance.

  3. Magnetic field structure of IC 63 and IC 59 associated with H II region Sh 185

    Science.gov (United States)

    Soam, A.; Maheswar, G.; Lee, Chang Won; Neha, S.; Andersson, B.-G.

    2017-02-01

    Bright-rimmed clouds (BRCs) are formed at the periphery of H II regions as the radiation from the central star interacts with dense gas. The ionization and resulting compression of the clouds may lead to cloud disruption causing secondary star formation depending on the stellar and gas parameters. Here we use R-band polarimetry to probe the plane-of-the sky magnetic field for two nearby BRCs, IC 59 and IC 63. Both nebulae are illuminated by γ Cas with the direction of the ionizing radiation being orientated parallel or perpendicular to the local magnetic field, allowing us to probe the importance of magnetic field pressure in the evolution of BRCs. Because of the proximity of the system (˜200 pc), we have acquired a substantial sample of over 500 polarization measurements for stars that form the background to the nebulae. On large scales, the magnetic field geometries of both clouds are anchored to the ambient magnetic field. For IC 63, the magnetic field is aligned parallel to the head-tail morphology of the main condensation, with a convex morphology relative to the direction of the ionizing radiation. We estimate the plane-of-the-sky magnetic field strength in IC 63 to be ˜ 90 μG. In IC 59, the projected magnetic field follows the M-shape morphology of the cloud. Here, field lines present a concave shape with respect to the direction of the ionizing radiation from γ Cas. Comparing our observations to published theoretical models, we find good general agreement, supporting the importance of magnetic fields in BRC evolution.

  4. Simultaneous detection of three lily viruses using Triplex IC-RT-PCR.

    Science.gov (United States)

    Zhang, Yubao; Wang, Yajun; Xie, Zhongkui; Yang, Guo; Guo, Zhihong; Wang, Le

    2017-08-25

    Viruses commonly infecting lily (Lilium spp.) include: Lily symptomless virus (LSV), Cucumber mosaic virus (CMV) and Lily mottle virus (LMoV). These viruses usually co-infect lilies causing severe economic losses in terms of quantity and quality of flower and bulb production around the world. Reliable and precise detection systems need to be developed for virus identification. We describe the development of a triplex immunocapture (IC) reverse transcription (RT) polymerase chain reaction (PCR) assay for the simultaneous detection of LSV, CMV and LMoV. The triplex IC-RT-PCR was compared with a quadruplex RT-PCR assay. Relative to the quadruplex RT-PCR, the specificity of the triplex IC-RT-PCR system for LSV, CMV and LMoV was 100% for field samples. The sensitivity of the triplex IC-RT-PCR system was 99.4%, 81.4% and 98.7% for LSV, CMV and LMoV, respectively. Agreement (κ) between the results obtained from the two tests was 0.968, 0.844 and 0.984 for LSV, CMV and LMoV, respectively. This is the first report of the simultaneous detection of LSV, CMV and LMoV in a triplex IC-RT-PCR assay. In particular we believe this convenient and reliable triplex IC-RT-PCR method could be used routinely for large-scale field surveys or crop health monitoring of lily. Copyright © 2017. Published by Elsevier B.V.

  5. Local and commissural IC neurons make axosomatic inputs on large GABAergic tectothalamic neurons.

    Science.gov (United States)

    Ito, Tetsufumi; Oliver, Douglas L

    2014-10-15

    Large GABAergic (LG) neurons are a distinct type of neuron in the inferior colliculus (IC) identified by their dense vesicular glutamate transporter 2 (VGLUT2)-containing axosomatic synaptic terminals. Yet the sources of these terminals are unknown. Since IC glutamatergic neurons express VGLUT2, and IC neurons are known to have local collaterals, we tested the hypothesis that these excitatory, glutamatergic axosomatic inputs on LG neurons come from local axonal collaterals and commissural IC neurons. We injected a recombinant viral tracer into the IC which enabled Golgi-like green fluorescent protein (GFP) labeling in both dendrites and axons. In all cases, we found terminals positive for both GFP and VGLUT2 (GFP+/VGLUT2+) that made axosomatic contacts on LG neurons. One to six axosomatic contacts were made on a single LG cell body by a single axonal branch. The GFP-labeled neurons giving rise to the VGLUT2+ terminals on LG neurons were close by. The density of GFP+/VGLUT2+ terminals on the LG neurons was related to the number of nearby GFP-labeled cells. On the contralateral side, a smaller number of LG neurons received axosomatic contacts from GFP+/VGLUT2+ terminals. In cases with a single GFP-labeled glutamatergic neuron, the labeled axonal plexus was flat, oriented in parallel to the fibrodendritic laminae, and contacted 9-30 LG cell bodies within the plexus. Our data demonstrated that within the IC microcircuitry there is a convergence of inputs from local IC excitatory neurons on LG cell bodies. This suggests that LG neurons are heavily influenced by the activity of the nearby laminar glutamatergic neurons in the IC.

  6. Sniff nasal inspiratory pressure versus IC/TLC ratio as predictors of mortality in COPD.

    Science.gov (United States)

    Moore, Alastair J; Soler, Rosa Suades; Cetti, Edward J; Amanda Sathyapala, S; Hopkinson, Nicholas S; Roughton, Michael; Moxham, John; Polkey, Michael I

    2010-09-01

    Hyperinflation is a recognized adverse prognostic factor in COPD. As the sniff inspiratory nasal pressure (SnIP) principally reflects the severity of hyperinflation in COPD, we hypothesized that it might also be a predictor of mortality. We therefore compared the SnIP to the inspiratory capacity-to-total lung capacity (IC/TLC) ratio as predictors of mortality in advanced COPD. A retrospective mortality analysis of 110 patients with COPD (mean FEV(1) 1.01litres, 37% predicted; 66% male) was performed. All patients had SnIP and lung volume measurements performed. The power of each test to predict mortality was determined, and predicted survival curves were created for both the SnIP and IC/TLC ratio. 37 patients (34%) died during the study period (29 male, 8 female). Mortality rates were analysed with a Chi(2) test; there was a significant trend towards male death (mortality rate male vs. female; 39.7% vs. 21.6% respectively; chi(2)p=0.058, Chi 3.6). ROC curves demonstrated that both SnIP and IC/TLC ratio are predictors of mortality, but analysis by Cox proportional hazards suggested the SnIP has a stronger predictive power (SnIP vs. IC/TLC ratio; p=0.017 vs 0.525; HR 0.97 vs 0.99 respectively), and analysis of the area under ROC curves (AUC) suggest that SnIP is a better discriminator than IC/TLC ratio (AUC SnIP vs IC/TLC; 0.679 vs 0.618). The SnIP conveys at least as much predictive power for mortality in COPD as hyperinflation determined by IC/TLC ratio. This test is cheaper, quicker and easier than measuring lung volumes by plethysmography.

  7. Impact of impurities on IC50 values of P450 inhibitors.

    Science.gov (United States)

    Huang, Zeqi

    2011-08-01

    During early drug discovery, the synthetic pathways for test compounds are not well defined and impurities in the test compounds are inevitable. Compounds undergo serial screening tests at this stage to assess their biological activities and drug-like properties. Impurities in the test compounds can produce false positive results and therefore complicate the interpretation of data. P450 inhibition is one of the screens used in the early drug discovery process to assess the potential of drug-drug interactions caused by the inhibition of P450 enzymes. The impact of impurities on P450 inhibition has not been investigated. In this study, the impact of impurities on CYP2D6 IC(50) values was evaluated using model compounds. Cimetidine was chosen as the test compound. Quinidine, fluoxetine, fluvoxamine, and ibuprofen were chosen to represent impurities as they inhibit CYP2D6 to varying degrees. The IC(50) values of these model impurities for CYP2D6 were 0.11 µM, 0.98 µM, 13.4 µM, and >100 µM, respectively. Impurities with potent CYP2D6 inhibition, such as quinidine, can significantly decrease the apparent IC(50) value for the mixture. With the addition of only 2% quinidine to cimetidine (mol/mol), the apparent IC(50) value of cimetidine decreased from 98 µM to 4.4 µM. With the addition of 10% quinidine, the apparent IC(50) decreased to 1.04 µM. Such a significant decrease in apparent IC(50) values can produce a false alert and cause the inappropriate elimination of good compounds at an early stage. Impur6ities with low inhibitory potential, such as fluvoxamine and ibuprofen, did not cause a significant change in apparent IC(50) values. An impurity can have a similar effect on the IC(50) values for inhibition of other biological activities. The effect of an impurity on apparent IC(50) values can be predicted by using a simulation curve if the potency of the impurity is characterized.

  8. Qualification of the First ICS-3000 ION Chromatograph for use at the Defense Waste Processing Facility

    Energy Technology Data Exchange (ETDEWEB)

    Edwards, T; Mahannah, R.

    2011-07-05

    due to the pump configuration only using water versus the current system where the pump uses various hydroxide concentrations. The ICS-3000 instruments also allow the DWPF to maintain current service contracts, which support routine preventive maintenance and emergency support for larger problems such as component failure. One of the three new systems was set up in the DWPF Lab trailers in January of 2007 to be used for the development of methods and procedures. This system will continue to be used for training, new method development and potential improvements to current methods. The qualification of the other two ICS-3000 instruments is to be a phased effort. This effort is to be supported by the Applied Computational Engineering and Statistical (ACES) group of the Savannah River National Laboratory (SRNL) as authorized by the Technical Task Request (TTR) and as directed by the corresponding Task Technical and Quality Assurance (TT&QA) plan. The installation of the first 'rad' system into the M-13 Lab module required modifications to both the Lab module and to the radiohood. The installation was completed in July 2008. The testing of this system was conducted as directed by the TT&QA plan. The purpose of this technical report is to provide a review of the data generated by these tests that will lead to the recommendation for the qualification of the M-13 ICS-3000 instrument. With the successful qualification of this first ICS-3000, plans will be developed for the installation of the second 'rad' system in the M-14 Lab module later in fiscal year 2009. When the second 'rad' ICS-3000 system is installed, the DX-500 systems will be removed and retired from service.

  9. Radon measurements at IC-09 well of Chingshui geothermal field (Taiwan): A case study

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Y. [Department of Mineral and Petroleum Engineering, National Cheng Kung University, 1, University Ave., Tainan 701, Taiwan (China); Kuo, T., E-mail: mctkuobe@mail.ncku.edu.t [Department of Mineral and Petroleum Engineering, National Cheng Kung University, 1, University Ave., Tainan 701, Taiwan (China); Fan, K. [Department of Mineral and Petroleum Engineering, National Cheng Kung University, 1, University Ave., Tainan 701, Taiwan (China); Liang, H. [Exploration and Development Research Institute, CPC Corporation, Taiwan (China); Tsai, C. [Department of Earth Sciences, National Cheng Kung University, Tainan, Taiwan (China); Chiang, C. [Central Geological Survey, Ministry of Economic Affairs, Taipei, Taiwan (China); Su, C. [Department of Mineral and Petroleum Engineering, National Cheng Kung University, 1, University Ave., Tainan 701, Taiwan (China)

    2011-02-15

    Radon concentration was monitored during the flow tests of well IC-09 at the Chingshui geothermal field. The radon concentration was found to increase from 54 {+-} 29 to 983 {+-} 65 Bq/m{sup 3} as a step function of production time, or cumulative production. The observed radon behavior can be explained by a radial composite model with the carbonate scales deposited in the skin zone near the well. The radius of skin zone near well IC-09 can be estimated with radon data at about 20 m using a plug flow model. Monitoring natural radon during the well flow tests is a helpful tracer to diagnose the formation damage near the well.

  10. Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip

    Science.gov (United States)

    Carson, John C. (Inventor); Indin, Ronald J. (Inventor); Shanken, Stuart N. (Inventor)

    1994-01-01

    A computer module is disclosed in which a stack of glued together IC memory chips is structurally integrated with a microprocessor chip. The memory provided by the stack is dedicated to the microprocessor chip. The microprocessor and its memory stack may be connected either by glue and/or by solder bumps. The solder bumps can perform three functions--electrical interconnection, mechanical connection, and heat transfer. The electrical connections in some versions are provided by wire bonding.

  11. Magnetic field structure of IC 63 and IC 59 associated to H II region - Sh 185

    CERN Document Server

    Soam, A; Lee, Chang Won; Neha, S; Andersson, B-G

    2016-01-01

    Bright-rimmed clouds (BRCs) are formed at the periphery of H$~$II regions as the radiation from the central star interacts with dense gas. The ionization and resulting compression of the clouds may lead to cloud disruption causing secondary star formation depending on the stellar and gas parameters. Here we use R-band polarimetry to probe the plane-of-the sky magnetic field in the two near-by BRCs IC\\,59 and IC\\,63. Both nebulae are illuminated by $\\gamma$ Cas with the direction of ionizing radiation being orientated parallel or perpendicular to the local magnetic field, allowing us to probe the importance of magnetic field pressure in the evolution of BRCs. Because of the proximity of the system ($\\sim$200pc) we have acquired a substantial sample of over 500 polarization measurements for stars background to the nebulae. On large scales, the magnetic field geometries of both clouds are anchored to the ambient magnetic field. For IC 63, the magnetic field is aligned parallel to the head-tail morphology of the ...

  12. Analog IC reliability in nanometer CMOS

    CERN Document Server

    Maricau, Elie

    2013-01-01

    This book focuses on modeling, simulation and analysis of analog circuit aging. First, all important nanometer CMOS physical effects resulting in circuit unreliability are reviewed. Then, transistor aging compact models for circuit simulation are discussed and several methods for efficient circuit reliability simulation are explained and compared. Ultimately, the impact of transistor aging on analog circuits is studied. Aging-resilient and aging-immune circuits are identified and the impact of technology scaling is discussed.   The models and simulation techniques described in the book are intended as an aid for device engineers, circuit designers and the EDA community to understand and to mitigate the impact of aging effects on nanometer CMOS ICs.   ·         Enables readers to understand long-term reliability of an integrated circuit; ·         Reviews CMOS unreliability effects, with focus on those that will emerge in future CMOS nodes; ·         Provides overview of models for...

  13. LES of Gas Exchange in IC Engines

    Directory of Open Access Journals (Sweden)

    Mittal V.

    2013-10-01

    Full Text Available As engine technologies become increasingly complex and engines are driven to new operating points, understanding transient phenomena is important to ensure reliable engine operation. Unlike Reynolds Averaged Navier-Stokes (RANS studies that only provide cycle-averaged information, Large Eddy Simulation (LES studies are capable of simulating cycle-to-cycle dynamics. In this work, a finite difference based structured methodology for LES of IC engines is presented. This structured approach allows for an efficient mesh generation process and provides potential for higher order numerical accuracy. An efficient parallel scalable block decomposition is done to overcome the challenges associated with the low ratio of fluid elements to overall mesh elements. The motion of the valves and piston is handled using a dynamic cell blanking approach and the Arbitrary Lagrangian Eulerian (ALE method, respectively. Modified three-dimensional Navier-Stokes Characteristic Boundary Conditions (NSCBC are used in the simulation to prescribe conditions in the manifolds. The accuracy of the simulation framework is validated using various canonical configurations. Flow bench simulations of an axisymmetric configuration and an actual engine geometry are done with the LES methodology. Simulations of the gas exchange in an engine under motored conditions are also performed. Overall, good agreement is obtained with experiments for all the cases. Therefore, this framework can be used for LES of engine simulations. In the future, reactive LES simulations will be performed using this framework.

  14. Computer modeling of complete IC fabrication process

    Science.gov (United States)

    Dutton, Robert W.

    1987-05-01

    The development of fundamental algorithms for process and device modeling as well as novel integration of the tools for advanced Integrated Circuit (IC) technology design is discussed. The development of the first complete 2D process simulator, SUPREM 4, is reported. The algorithms are discussed as well as application to local-oxidation and extrinsic diffusion conditions which occur in CMOS AND BiCMOS technologies. The evolution of 1D (SEDAN) and 2D (PISCES) device analysis is discussed. The application of SEDAN to a variety of non-silicon technologies (GaAs and HgCdTe) are considered. A new multi-window analysis capability for PISCES which exploits Monte Carlo analysis of hot carriers has been demonstrated and used to characterize a variety of silicon MOSFET and GaAs MESFET effects. A parallel computer implementation of PISCES has been achieved using a Hypercube architecture. The PISCES program has been used for a range of important device studies including: latchup, analog switch analysis, MOSFET capacitance studies and bipolar transient device for ECL gates. The program is broadly applicable to RAM and BiCMOS technology analysis and design. In the analog switch technology area this research effort has produced a variety of important modeling and advances.

  15. Variations in IC(50) values with purity of mushroom tyrosinase.

    Science.gov (United States)

    Neeley, Elizabeth; Fritch, George; Fuller, Autumn; Wolfe, Jordan; Wright, Jessica; Flurkey, William

    2009-09-02

    The effects of various inhibitors on crude, commercial and partially purified commercial mushroom tyrosinase were examined by comparing IC(50) values. Kojic acid, salicylhydroxamic acid, tropolone, methimazole, and ammonium tetrathiomolybdate had relatively similar IC(50) values for the crude, commercial and partially purified enzyme. 4-Hexylresorcinol seemed to have a somewhat higher IC(50) value using crude extracts, compared to commercial or purified tyrosinase. Some inhibitors (NaCl, esculetin, biphenol, phloridzin) showed variations in IC(50) values between the enzyme samples. In contrast, hydroquinone, lysozyme, Zn(2+), and anisaldehyde showed little or no inhibition in concentration ranges reported to be effective inhibitors. Organic solvents (DMSO and ethanol) had IC(50) values that were similar for some of the tyrosinase samples. Depending of the source of tyrosinase and choice of inhibitor, variations in IC(50) values were observed.

  16. [Role of ICS/LABA on COPD treatment].

    Science.gov (United States)

    Shibata, Yoko

    2016-05-01

    In the treatment of chronic obstructive pulmonary disease (COPD), bronchodilators such as long acting muscarinic antagonist (LAMA) and long acting β agonist(LABA) play key roles for improving respiratory function and symptoms, and reducing risk of exacerbation. However, inhaled corticosteroid (ICS), a key medicine for bronchial asthma, is limitedly used in COPD treatment. Japanese Respiratory Society recommends to use ICS for severe COPD patients who have been frequently exacerbated, because previous clinical studies indicated that ICS reduces exacerbation in moderate to severe COPD patients. Asthma sometimes overlaps with COPD, and symptoms of those patients are not well controlled by the bronchodilation therapy alone. Therefore, ICS/LABA or ICS/LAMA should be prescribed to those overlapped patients. Concentration of exhaled nitrogen oxide and percentage of peripheral eosinophil may be good biomarkers for discriminating the COPD patients who have good response to ICS treatment.

  17. Guidelines for accurate EC50/IC50 estimation.

    Science.gov (United States)

    Sebaugh, J L

    2011-01-01

    This article provides minimum requirements for having confidence in the accuracy of EC50/IC50 estimates. Two definitions of EC50/IC50s are considered: relative and absolute. The relative EC50/IC50 is the parameter c in the 4-parameter logistic model and is the concentration corresponding to a response midway between the estimates of the lower and upper plateaus. The absolute EC50/IC50 is the response corresponding to the 50% control (the mean of the 0% and 100% assay controls). The guidelines first describe how to decide whether to use the relative EC50/IC50 or the absolute EC50/IC50. Assays for which there is no stable 100% control must use the relative EC50/IC50. Assays having a stable 100% control but for which there may be more than 5% error in the estimate of the 50% control mean should use the relative EC50/IC50. Assays that can be demonstrated to produce an accurate and stable 100% control and less than 5% error in the estimate of the 50% control mean may gain efficiency as well as accuracy by using the absolute EC50/IC50. Next, the guidelines provide rules for deciding when the EC50/IC50 estimates are reportable. The relative EC50/IC50 should only be used if there are at least two assay concentrations beyond the lower and upper bend points. The absolute EC50/IC50 should only be used if there are at least two assay concentrations whose predicted response is less than 50% and two whose predicted response is greater than 50%. A wide range of typical assay conditions are considered in the development of the guidelines.

  18. Variations in IC50 Values with Purity of Mushroom Tyrosinase

    OpenAIRE

    Elizabeth Neeley; George Fritch; Autumn Fuller; Jordan Wolfe; Jessica Wright; William Flurkey

    2009-01-01

    The effects of various inhibitors on crude, commercial and partially purified commercial mushroom tyrosinase were examined by comparing IC50 values. Kojic acid, salicylhydroxamic acid, tropolone, methimazole, and ammonium tetrathiomolybdate had relatively similar IC50 values for the crude, commercial and partially purified enzyme. 4-Hexylresorcinol seemed to have a somewhat higher IC50 value using crude extracts, compared to commercial or purified tyrosinase. Some inhibitors (NaCl, esculetin,...

  19. The gene ICS3 from the yeast Saccharomyces cerevisiae is involved in copper homeostasis dependent on extracellular pH.

    Science.gov (United States)

    Alesso, C A; Discola, K F; Monteiro, G

    2015-09-01

    In the yeast Saccharomyces cerevisiae, many genes are involved in the uptake, transport, storage and detoxification of copper. Large scale studies have noted that deletion of the gene ICS3 increases sensitivity to copper, Sortin 2 and acid exposure. Here, we report a study on the Δics3 strain, in which ICS3 is related to copper homeostasis, affecting the intracellular accumulation of this metal. This strain is sensitive to hydrogen peroxide and copper exposure, but not to other tested transition metals. At pH 6.0, the Δics3 strain accumulates a larger amount of intracellular copper than the wild-type strain, explaining the sensitivity to oxidants in this condition. Unexpectedly, sensitivity to copper exposure only occurs in acidic conditions. This can be explained by the fact that the exposure of Δics3 cells to high copper concentrations at pH 4.0 results in over-accumulation of copper and iron. Moreover, the expression of ICS3 increases in acidic pH, and this is correlated with CCC2 gene expression, since both genes are regulated by Rim101 from the pH regulon. CCC2 is also upregulated in Δics3 in acidic pH. Together, these data indicate that ICS3 is involved in copper homeostasis and is dependent on extracellular pH. Copyright © 2015 Elsevier Inc. All rights reserved.

  20. Dicty_cDB: FC-IC1118 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1118 (Link to dictyBase) - - - - FC-IC1118E (Link to Original site) FC-IC... to library) Clone ID FC-IC1118 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig - Ori...re E Sequences producing significant alignments: (bits) Value FC-IC1118 (FC-IC1118Q) /CSM/FC-IC/FC-IC...%: extracellular, including cell wall 4.0 %: cytoskeletal 4.0 %: vacuolar >> prediction for FC-IC1118 is cyt 5' end seq. ID FC-IC...1118F 398 FC-IC1118Z 400 FC-IC1118P 778 FC-IC1118E 390 Show FC-IC1118 Library FC-IC (Link

  1. Dicty_cDB: FC-IC0790 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0790 (Link to dictyBase) - - - Contig-U14940-1 FC-IC07... (Link to library) Clone ID FC-IC0790 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U14940-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...y vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC0790 (FC-IC0790Q) /CSM/FC-IC/FC-IC...90E (Link to Original site) FC-IC0790F 305 FC-IC0790Z 305 FC-IC0790P 590 FC-IC0790E 295 Show FC-IC0790 Library FC-IC

  2. Dicty_cDB: FC-IC1261 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1261 (Link to dictyBase) - - - - FC-IC1261E (Link to Original site) FC-IC... to library) Clone ID FC-IC1261 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig - Ori...SM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1760 (FC-IC1760Q) /CSM/FC-IC/FC-IC...etal 4.0 %: Golgi 4.0 %: cytoplasmic >> prediction for FC-IC1261 is end 5' end seq. ID FC-IC...1261F 255 FC-IC1261Z 439 FC-IC1261P 674 FC-IC1261E 429 Show FC-IC1261 Library FC-IC (Link

  3. Dicty_cDB: FC-IC0142 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0142 (Link to dictyBase) - G24282 DDB0231822 Contig-U03313-1 FC-IC...tig Contig-U03313-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...E Sequences producing significant alignments: (bits) Value FC-IC0142 (FC-IC0142Q) /CSM/FC-IC/FC-IC0142Q.Seq....les of secretory system >> prediction for FC-IC0142 is cyt 5' end seq. ID FC-IC0142F 5' end seq. >FC-IC...0142F (Link to Original site) FC-IC0142F 280 - - - - - - Show FC-IC0142 Library FC-IC (Link to library) Clone ID FC-IC

  4. Carbon dioxide-based supercritical fluids as IC manufacturing solvents

    Energy Technology Data Exchange (ETDEWEB)

    Rubin, J.B.; Davenhall, L.B.; Taylor, C.M.V.; Sivils, L.D.; Pierce, T.; Tiefert, K.

    1999-05-11

    The production of integrated circuits (IC's) involves a number of discrete steps which utilize hazardous or regulated solvents and generate large waste streams. ES&H considerations associated with these chemicals have prompted a search for alternative, more environmentally benign solvent systems. An emerging technology for conventional solvent replacement is the use of supercritical fluids based on carbon dioxide (CO{sub 2}). Research work, conducted at Los Alamos in conjunction with the Hewlett-Packard Company, has lead to the development of a CO{sub 2}-based supercritical fluid treatment system for the stripping of hard-baked photoresists. This treatment system, known as Supercritical CO{sub 2} Resist Remover, or CORR, uses a two-component solvent composed of a nonhazardous, non-regulated compound, dissolved in supercritical CO{sub 2}. The solvent/treatment system has been successfully tested on metallized Si wafers coated with negative and positive photoresist, the latter both before and after ion-implantation. A description of the experimental data will be presented. Based on the initial laboratory results, the project has progressed to the design and construction of prototype, single-wafer photoresist-stripping equipment. The integrated system involves a closed-loop, recirculating cycle which continuously cleans and regenerates the CO{sub 2}, recycles the dissolved solvent, and separates and concentrates the spent resist. The status of the current design and implementation strategy of a treatment system to existing IC fabrication facilities will be discussed. Additional remarks will be made on the use of a SCORR-type system for the cleaning of wafers prior to processing.

  5. Alpha-particle detection based on the BJT detector and simple, IC-based readout electronics

    Energy Technology Data Exchange (ETDEWEB)

    Rovati, L; Bonaiuti, M [Dipartimento di Ingegneria dell' Informazione, Universita di Modena e Reggio Emilia, Modena (Italy); Bettarini, S [Dipartimento di Fisica, Universita di Pisa and INFN Pisa, Pisa (Italy); Bosisio, L [Dipartimento di Fisica, Universita di Trieste and INFN Trieste, Trieste (Italy); Dalla Betta, G-F; Tyzhnevyi, V [Dipartimento di Ingegneria e Scienza dell' Informazione, Universita di Trento e INFN Trento, Trento (Italy); Verzellesi, G [Dipartimento di Scienze e Metodi dell' Ingegneria, Universita di Modena e Reggio Emilia and INFN Trento, Reggio Emilia (Italy); Zorzi, N, E-mail: giovanni.verzellesi@unimore.i [Fondazione Bruno Kessler (FBK), Trento (Italy)

    2009-11-15

    In this paper we propose a portable instrument for alpha-particle detection based on a previously-developed BJT detector and a simple, IC-based readout electronics. Experimental tests of the BJT detector and readout electronics are reported. Numerical simulations are adopted to predict the performance enhancement achievable with optimized BJT detectors.

  6. Determination of halogens and sulfur in high-purity polyimide by IC after digestion by MIC.

    Science.gov (United States)

    Krzyzaniak, Sindy R; Santos, Rafael F; Dalla Nora, Flavia M; Cruz, Sandra M; Flores, Erico M M; Mello, Paola A

    2016-09-01

    In this work, a method for sample preparation of high-purity polyimide was proposed for halogens and sulfur determination by ion chromatography (IC) with conductivity detection and, alternatively, by inductively coupled plasma mass spectrometry (ICP-MS). A relatively high polyimide mass (600mg) was completely digested by microwave-induced combustion (MIC) using 20bar of O2 and 50mmolL(-1) NH4OH as absorbing solution. These conditions allowed final solutions with low carbon content (IC and ICP-MS. The accuracy was evaluated using a certified reference material of polymer for Cl, Br and S and spike recovery experiments for all analytes. No statistical difference (t-test, 95% of confidence level) was observed between the results obtained for Cl, Br and S by IC after MIC and the certified values. In addition, spike recoveries obtained for F, Cl, Br, I and S ranged from 94% to 101%. The proposed method was suitable for polyimide decomposition for further determination of halogens and sulfur by IC and by ICP-MS (Br and I only). Taking into account the lack of methods and the difficulty of bringing this material into solution, MIC can be considered as a suitable alternative for the decomposition of polyimide for routine quality control of halogens and sulfur using IC or ICP-MS.

  7. Interdisciplinary Collaboration amongst Colleagues and between Initiatives with the Magnetics Information Consortium (MagIC) Database

    Science.gov (United States)

    Minnett, R.; Koppers, A. A. P.; Jarboe, N.; Tauxe, L.; Constable, C.; Jonestrask, L.; Shaar, R.

    2014-12-01

    Earth science grand challenges often require interdisciplinary and geographically distributed scientific collaboration to make significant progress. However, this organic collaboration between researchers, educators, and students only flourishes with the reduction or elimination of technological barriers. The Magnetics Information Consortium (http://earthref.org/MagIC/) is a grass-roots cyberinfrastructure effort envisioned by the geo-, paleo-, and rock magnetic scientific community to archive their wealth of peer-reviewed raw data and interpretations from studies on natural and synthetic samples. MagIC is dedicated to facilitating scientific progress towards several highly multidisciplinary grand challenges and the MagIC Database team is currently beta testing a new MagIC Search Interface and API designed to be flexible enough for the incorporation of large heterogeneous datasets and for horizontal scalability to tens of millions of records and hundreds of requests per second. In an effort to reduce the barriers to effective collaboration, the search interface includes a simplified data model and upload procedure, support for online editing of datasets amongst team members, commenting by reviewers and colleagues, and automated contribution workflows and data retrieval through the API. This web application has been designed to generalize to other databases in MagIC's umbrella website (EarthRef.org) so the Geochemical Earth Reference Model (http://earthref.org/GERM/) portal, Seamount Biogeosciences Network (http://earthref.org/SBN/), EarthRef Digital Archive (http://earthref.org/ERDA/) and EarthRef Reference Database (http://earthref.org/ERR/) will benefit from its development.

  8. Analytical Formulation of Ic Dependence on Torsion of YBCO and BSCCO Conductors

    CERN Document Server

    Fleiter, J; Ballarino, A

    2013-01-01

    The behavior of HTS tapes under torsion is of key importance for the definition of the allowable twist during cabling activity. In this paper, we report on the elaboration of selfconsistent analytical expressions of Ic dependence on twist pitch for YBCO and BSCCO (2223) conductors. The computed expressions are validated with the results of a series of tests performed at 77 K and in self-field with a purpose-built setup. The Ic was observed to be reduced to 95% of the unstrained value for twist pitches of 114 mm for BSCCO tapes, and 80–90 mm for YBCO tapes. The reduction of performance was identified to be caused mainly by irreversible degradation of Ic at the tapes edges. At lower temperatures, a slightly lower sensitivity to twist is expected.

  9. Conceptualising Intellectual Capital (IC) as Language Game and Power

    DEFF Research Database (Denmark)

    Jørgensen, Kenneth Mølbjerg

    2006-01-01

    mainly on insights from Foucault and Wittgenstein, conceptualises IC in very generalist terms as both language game and power in order to initiate such a critical understanding. IC is perceived as a social construction and the genealogical focus is on how actors, positions and interests influence...

  10. Prometheus Reactor I&C Software Development Methodology, for Action

    Energy Technology Data Exchange (ETDEWEB)

    T. Hamilton

    2005-07-30

    The purpose of this letter is to submit the Reactor Instrumentation and Control (I&C) software life cycle, development methodology, and programming language selections and rationale for project Prometheus to NR for approval. This letter also provides the draft Reactor I&C Software Development Process Manual and Reactor Module Software Development Plan to NR for information.

  11. 30 CFR 57.22102 - Smoking (I-C mines).

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Smoking (I-C mines). 57.22102 Section 57.22102... Methane in Metal and Nonmetal Mines Fire Prevention and Control § 57.22102 Smoking (I-C mines). (a) Persons shall not smoke or carry smoking materials, matches, or lighters underground or within 50 feet...

  12. 3D互连中光刻与晶圆级键合技术面临的挑战,趋势及解决方案%Challenges, Trends and Solutions for 3D Interconnects in Lithography and Wafer Level Bonding Techniques

    Institute of Scientific and Technical Information of China (English)

    Margarete Zoberbier; Erwin Hell; Kathy Cook; Marc Hennemayer; Dr.-Ing.Barbara Neubert

    2010-01-01

    Technology advances such as 3D Integration are expanding the potential applications of products into mass markets such as consumer electronics. These new technologies are also pushing the envelope of what's currently possible for many production processes, including lithography processes and wafer bonding.There is still the need to coat, pattern and etch structures. This paper will explore some of the lithographic challenges associated with 3D interconnection technology. Wafer bonding techniques as used in the 3D Packaging will be described with all the challenges and available solutions and trends.Furthermore a new Maskalinger technology will be introduced which allows extreme alignment accuracy assisted by pattern recognition down to 0.25 μm.An overall introduction on the challenges, trends and solutions for 3D interconnects in lithography and Wafer Level bonding techniques and the SUSS's equipment platform will be described accordingly to the needed processes. The processing issues encountered in those techniques will be discussed with a focus on wafer bonding and lithography steps.%目前,3D集成技术的优势正在扩展消费类电子产品的潜在应用进入批量市场.这些新技术也在推进着当前许多生产工艺中的一些封装技术包括光刻和晶圆键合成为可能.其中还需要涂胶,作图和蚀刻结构.探讨一些与三维互连相关的光刻技术的挑战.用于三维封装的晶圆键合技术将结合这些挑战和可用的解决方案及发展趋势一并介绍.此外还介绍了一种新的光刻设备,它可通过图形识别技术的辅助实现低于0.25μm的最终对准精度.对于采用光刻和晶圆级键合技术在三维互连中的挑战,趋势和解决方案及SUSS公司设备平台的整体介绍将根据工艺要求来描述.在这些技术中遇到的工艺问题将集中在晶圆键合和光刻工序方面重点讨论.

  13. Dicty_cDB: FC-IC0282 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0282 (Link to dictyBase) - - - Contig-U16527-1 - (Link to Original site) FC-IC...(Link to library) Clone ID FC-IC0282 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig ...Contig-U16527-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...ogy vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1760 (FC-IC1760Q) /CSM/FC-IC/FC-IC...0282F 255 FC-IC0282Z 429 FC-IC0282P 673 FC-IC0282E 429 Show FC-IC0282 Library FC-IC

  14. Dicty_cDB: FC-IC0374 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0374 (Link to dictyBase) - - - Contig-U12354-1 FC-IC03... (Link to library) Clone ID FC-IC0374 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U12354-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...les of secretory system >> prediction for FC-IC0374 is end 5' end seq. ID FC-IC0374F 5' end seq. >FC-IC...74E (Link to Original site) FC-IC0374F 223 FC-IC0374Z 324 FC-IC0374P 547 FC-IC0374E 324 Show FC-IC0374 Library FC-IC

  15. Dicty_cDB: FC-IC1268 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1268 (Link to dictyBase) - - - Contig-U16527-1 FC-IC12...ink to library) Clone ID FC-IC1268 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Co...ntig-U16527-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...lpy*iw Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1760 (FC-IC1760Q) /CSM/FC-IC/FC-IC...68P (Link to Original site) FC-IC1268F 231 FC-IC1268Z 250 FC-IC1268P 461 - - Show FC-IC1268 Library FC-IC (L

  16. AVP-IC50 Pred: Multiple machine learning techniques-based prediction of peptide antiviral activity in terms of half maximal inhibitory concentration (IC50).

    Science.gov (United States)

    Qureshi, Abid; Tandon, Himani; Kumar, Manoj

    2015-11-01

    Peptide-based antiviral therapeutics has gradually paved their way into mainstream drug discovery research. Experimental determination of peptides' antiviral activity as expressed by their IC50 values involves a lot of effort. Therefore, we have developed "AVP-IC50 Pred," a regression-based algorithm to predict the antiviral activity in terms of IC50 values (μM). A total of 759 non-redundant peptides from AVPdb and HIPdb were divided into a training/test set having 683 peptides (T(683)) and a validation set with 76 independent peptides (V(76)) for evaluation. We utilized important peptide sequence features like amino-acid compositions, binary profile of N8-C8 residues, physicochemical properties and their hybrids. Four different machine learning techniques (MLTs) namely Support vector machine, Random Forest, Instance-based classifier, and K-Star were employed. During 10-fold cross validation, we achieved maximum Pearson correlation coefficients (PCCs) of 0.66, 0.64, 0.56, 0.55, respectively, for the above MLTs using the best combination of feature sets. All the predictive models also performed well on the independent validation dataset and achieved maximum PCCs of 0.74, 0.68, 0.59, 0.57, respectively, on the best combination of feature sets. The AVP-IC50 Pred web server is anticipated to assist the researchers working on antiviral therapeutics by enabling them to computationally screen many compounds and focus experimental validation on the most promising set of peptides, thus reducing cost and time efforts. The server is available at http://crdd.osdd.net/servers/ic50avp.

  17. The Implications Related to Different IC, Different Projects and Different Thinking Addressing the Common Core of IC

    DEFF Research Database (Denmark)

    Lindgren, Peter; Saghaug, Kristin Margrethe

    2009-01-01

    Purpose - In the field of innovation of business models on behalf of networks of different intellectual capabilities (ICA), the development of Intellectual Capital (IC) are highly in focus. An increased work of innovation in groups, projects and by individuals outside the core of the organization...... challenge the development of IC: - The IC at the organizational level seems to diminish when innovation gets highly dispersed and is operated outside the core of the organization - The attractiveness of the organization to different ICA, which is one fundament to sustainable and successful innovation, seems...... to fall when the IC at the organizational core level diminishes The objective of this paper is therefore to understand 1) How the IC at the organizational core level may continue to be developed, when at the same time innovation is taking place in dispersed groups and projects. 2) How to motivate...

  18. A CMOS IC-based multisite measuring system for stimulation and recording in neural preparations in vitro

    OpenAIRE

    Tateno, Takashi; Nishikawa, Jun

    2014-01-01

    In this report, we describe the system integration of a complementary metal oxide semiconductor (CMOS) integrated circuit (IC) chip, capable of both stimulation and recording of neurons or neural tissues, to investigate electrical signal propagation within cellular networks in vitro. The overall system consisted of three major subunits: a 5.0 × 5.0 mm CMOS IC chip, a reconfigurable logic device (field-programmable gate array, FPGA), and a PC. To test the system, microelectrode arrays (MEAs) w...

  19. Dicty_cDB: FC-IC0618 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0618 (Link to dictyBase) - - - Contig-U07877-1 FC-IC06...ink to library) Clone ID FC-IC0618 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Co...ntig-U07877-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...les of secretory system >> prediction for FC-IC0618 is cyt 5' end seq. ID FC-IC0618F 5' end seq. >FC-IC...18P (Link to Original site) FC-IC0618F 583 FC-IC0618Z 169 FC-IC0618P 732 - - Show FC-IC0618 Library FC-IC (L

  20. Dicty_cDB: FC-IC1558 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1558 (Link to dictyBase) - - - Contig-U15578-1 FC-IC15...ink to library) Clone ID FC-IC1558 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Co...ntig-U15578-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...y system 4.0 %: peroxisomal >> prediction for FC-IC1558 is cyt 5' end seq. ID FC-IC1558F 5' end seq. >FC-IC1...58P (Link to Original site) FC-IC1558F 205 FC-IC1558Z 298 FC-IC1558P 483 - - Show FC-IC1558 Library FC-IC (L

  1. Dicty_cDB: FC-IC1004 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1004 (Link to dictyBase) - G24305 DDB0232093 Contig-U13941-1 FC-IC... (Link to library) Clone ID FC-IC1004 (Link to dictyBase) Atlas ID - NBRP ID G24305 dic...mrvimmwlinkl*i*slkvvhylllvw*hslracv Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC... 4.0 %: mitochondrial >> prediction for FC-IC1004 is cyt 5' end seq. ID FC-IC1004F 5' end seq. >FC-IC...1004E (Link to Original site) FC-IC1004F 187 FC-IC1004Z 187 FC-IC1004P 354 FC-IC1004E 177 Show FC-IC1004 Library FC-IC

  2. Dicty_cDB: FC-IC1504 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1504 (Link to dictyBase) - - - Contig-U07877-1 FC-IC15... (Link to library) Clone ID FC-IC1504 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link ...to Contig Contig-U07877-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...0104Q) /CSM/FC-IC/FC-IC0104Q.Seq.d/ 533 e-151 own update 2001.11.19 Homology vs DNA Score E Sequences producing signific...04E (Link to Original site) FC-IC1504F 581 FC-IC1504Z 583 FC-IC1504P 1144 FC-IC1504E 573 Show FC-IC1504 Library FC-IC

  3. Dicty_cDB: FC-IC0422 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0422 (Link to dictyBase) - - - Contig-U16233-1 FC-IC04...22Z (Link to Original site) - - FC-IC0422Z 549 - - - - Show FC-IC0422 Library FC-IC (Link to library) Clone ID FC-IC... vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC0422 (FC-IC0422Q) /CSM/FC-IC/FC-IC...0422 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U16233-1 Original site URL http://dic...tycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC0422Q.Seq.d/ Representative seq. ID FC-IC

  4. Dicty_cDB: FC-IC1498 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1498 (Link to dictyBase) - - - Contig-U16527-1 FC-IC14... (Link to library) Clone ID FC-IC1498 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16527-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...xiyldilxlrnhxk Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1760 (FC-IC...98E (Link to Original site) FC-IC1498F 438 FC-IC1498Z 439 FC-IC1498P 857 FC-IC1498E 429 Show FC-IC1498 Library FC-IC

  5. Dicty_cDB: FC-IC1278 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1278 (Link to dictyBase) - - - Contig-U12354-1 FC-IC12... (Link to library) Clone ID FC-IC1278 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U12354-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC... 16.0 %: nuclear 8.0 %: cytoskeletal 8.0 %: plasma membrane >> prediction for FC-IC1278 is cyt 5' end seq. ID FC-IC...78E (Link to Original site) FC-IC1278F 334 FC-IC1278Z 334 FC-IC1278P 648 FC-IC1278E 324 Show FC-IC1278 Library FC-IC

  6. Dicty_cDB: FC-IC0929 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0929 (Link to dictyBase) - - - Contig-U16527-1 FC-IC09...ink to library) Clone ID FC-IC0929 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Co...ntig-U16527-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...les of secretory system >> prediction for FC-IC0929 is end 5' end seq. ID FC-IC0929F 5' end seq. >FC-IC...29P (Link to Original site) FC-IC0929F 313 FC-IC0929Z 320 FC-IC0929P 613 - - Show FC-IC0929 Library FC-IC (L

  7. Dicty_cDB: FC-IC1321 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1321 (Link to dictyBase) - - - Contig-U15335-1 FC-IC13... (Link to library) Clone ID FC-IC1321 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U15335-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...0 %: mitochondrial 4.0 %: vacuolar 4.0 %: endoplasmic reticulum >> prediction for FC-IC1321 is cyt 5' end seq. ID FC-IC...21E (Link to Original site) FC-IC1321F 194 FC-IC1321Z 194 FC-IC1321P 368 FC-IC1321E 184 Show FC-IC1321 Library FC-IC

  8. Dicty_cDB: FC-IC0181 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0181 (Link to dictyBase) - - - Contig-U03326-1 FC-IC01...81F (Link to Original site) FC-IC0181F 553 - - - - - - Show FC-IC0181 Library FC-IC (Link to library) Clone ID FC-IC... Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC0181 (FC-IC0181Q) /CSM/FC-IC/FC-IC...ulum >> prediction for FC-IC0181 is cyt 5' end seq. ID FC-IC0181F 5' end seq. >FC-IC...0181 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U03326-1 Original site URL http://dic

  9. Dicty_cDB: FC-IC0175 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0175 (Link to dictyBase) - - - Contig-U13957-1 FC-IC01...75F (Link to Original site) FC-IC0175F 212 - - - - - - Show FC-IC0175 Library FC-IC (Link to library) Clone ID FC-IC...e E Sequences producing significant alignments: (bits) Value FC-IC0175 (FC-IC0175Q) /CSM/FC-IC/FC-IC0175Q.Se...letal 4.0 %: vacuolar >> prediction for FC-IC0175 is cyt 5' end seq. ID FC-IC0175F 5' end seq. >FC-IC0175F.S...0175 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U13957-1 Original site URL http://dic

  10. Dicty_cDB: FC-IC0169 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0169 (Link to dictyBase) - - - Contig-U15064-1 FC-IC01...69F (Link to Original site) FC-IC0169F 288 - - - - - - Show FC-IC0169 Library FC-IC (Link to library) Clone ID FC-IC...0169 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U15064-1 Original site URL http://dic...tycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC0169Q.Seq.d/ Representative seq. ID FC-IC...0169F (Link to Original site) Representative DNA sequence >FC-IC0169 (FC-IC0169Q) /CSM/FC-IC/FC-IC

  11. Considerations for IC and Component Selection for Space Systems

    Science.gov (United States)

    LaBel, Kenneth A.; Cohn, Lewis M.

    2008-01-01

    This viewgraph presentation addresses the integrated cycling and component selection technologies for aerospace systems. The topics include: 1) Semiconductors: The Evolution of ICs - Availability and Technology; 2) IC Selection Requirements - three fields of thought, "The Good", "The Bad" and "The Ugly"; 3) Reliability and Radiation; 4) Radiation Perspective-Four methods of selecting ICs for space systems, Guaranteed hardness, historical ground-based radiation data, historical flight usage, and unknown assurance; 5) Understanding Risk, including risk trade space and ASICs and FPGA sample selection criteria.

  12. Membership, lithium and chromospheric activity of the young open clusters IC 2391, IC 2602 and IC 4665 from GES (Gaia-ESO Survey) observations

    Science.gov (United States)

    Gómez Garrido, M.; Montes, D.; Gutiérrez Albarrán, M. L.; Tabernero, H. M.; Gónzalez Hernández, J. I.; GES Survey Builders

    2017-03-01

    We conduct a comparative study of the main properties of the of the young open clusters IC 2391, IC 2602 and IC 4665, focusing on their membership, lithium abundance and level of chromospheric activity and possible accretion. We use the fundamental parameters (effective temperature, surface gravity, and radial velocity) delivered by the Gaia-ESO survey (GES - https://www.gaia-eso.eu/) consortium in the four internal data release (iDR4) to select the members of these clusters among the UVES and GIRAFFE spectroscopic observations. Chromospheric activity criterium, and iterative process between radial velocity distribution and lithium-temperature diagram are applied to determinate what objects are members or non members of the clusters. All this information allowed us to characterize the properties of the members of these clusters and identify some field contaminant lithium-rich giants.

  13. Integration of IC Foundries and MEMS Fabrication

    Science.gov (United States)

    2009-03-01

    Peterson, 1982) Polysilicon surface micromachining LIGA (Karlsruhe, 1986) Silicon accelerometers commercialized Micromotors MOSIS CMOS MEMS (1991) MUMPS...1992) DRIE (1995) ’80s Surface Micromachining ’90s MEMS Foundries Bulk Si Micromachining ASTM MEMS Test Structures (1998) Future MOSIS (1986) ASIMPS

  14. Interband cascade (IC) photovoltaic (PV) architecture for PV devices

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Rui Q.; Tian, Zhaobing; Mishima, Tetsuya D.; Santos, Michael B.; Johnson, Matthew B.; Klem, John F.

    2015-10-20

    A photovoltaic (PV) device, comprising a PV interband cascade (IC) stage, wherein the IC PV stage comprises an absorption region with a band gap, the absorption region configured to absorb photons, an intraband transport region configured to act as a hole barrier, and an interband tunneling region configured to act as an electron barrier. An IC PV architecture for a photovoltaic device, the IC PV architecture comprising an absorption region, an intraband transport region coupled to the absorption region, and an interband tunneling region coupled to the intraband transport region and to the adjacent absorption region, wherein the absorption region, the intraband transport region, and the interband tunneling region are positioned such that electrons will flow from the absorption region to the intraband transport region to the interband tunneling region.

  15. IC-BASED CONTROLS FOR ENERGY-EFFICIENT LIGHTING

    Energy Technology Data Exchange (ETDEWEB)

    Richard Zhang

    2005-03-01

    A new approach for driving high frequency energy saving ballasts is developed and documented in this report. The developed approach utilizes an IC-based platform that provides the benefits of reduced system cost, reduced ballast size, and universal application to a wide range of lamp technologies, such as linear fluorescent lamps (LFL), compact fluorescent lamps (CFL) and high intensity discharge lamps (HID). The control IC chip set developed for the platform includes dual low voltage (LV) IC gate drive that provides gate drive for high and low side power switches in typical ballast circuits, and ballast controller IC that provides control functionalities optimal for different lamps and digital interface for future extension to more sophisticated control and communication.

  16. Acoustic source data for medium speed IC-engines

    OpenAIRE

    Hynninen, A.; Turunen, R.; Åbom, Mats; Bodén, Hans

    2011-01-01

    Knowledge of the acoustic source characteristics of internal combustion engines (IC-engines) is of great importance when designing the exhaust duct system and its components to withstand the resulting dynamic loads and to reduce the exhaust noise emission. Number of studies has been published earlier on the low frequency in-duct exhaust noise of high speed engines. The goal of the present study is to investigate the medium speed IC-engine acoustic source characteristics numerically and experi...

  17. Comparability of Mixed IC50 Data – A Statistical Analysis

    OpenAIRE

    Tuomo Kalliokoski; Christian Kramer; Anna Vulpetti; Peter Gedeck

    2013-01-01

    The biochemical half maximal inhibitory concentration (IC50) is the most commonly used metric for on-target activity in lead optimization. It is used to guide lead optimization, build large-scale chemogenomics analysis, off-target activity and toxicity models based on public data. However, the use of public biochemical IC50 data is problematic, because they are assay specific and comparable only under certain conditions. For large scale analysis it is not feasible to check each data entry man...

  18. Missing the Mark: Is ICS Training Achieving Its Goal

    Science.gov (United States)

    2016-12-01

    need to be mutually exclusive of classroom- teaching methods , there is evidence to suggest exclusively networked learning can be effective, and can be...system to engage the social learning required for successful cultural change. The thesis also critiques the ICS training measurement method and...to engage the social learning required for successful cultural change. The thesis also critiques the ICS training measurement method and recommends

  19. Revealing Hanny's Voorwerp: radio observations of IC 2497

    CERN Document Server

    Jozsa, G I G; Oosterloo, T A; Rampadarath, H; Paragi, Z; van Arkel, H; Lintott, C; Keel, W C; Schawinski, K; Edmondson, E

    2009-01-01

    We present multi-wavelength radio observations in the direction of the spiral galaxy IC 2497 and the neighbouring emission nebula known as "Hanny's Voorwerp". Our WSRT continuum observations at 1.4 GHz and 4.9 GHz, reveal the presence of extended emission at the position of the nebulosity, although the bulk of the emission remains unresolved at the centre of the galaxy. e-VLBI 1.65 GHz observations show that on the milliarcsecond-scale a faint central compact source is present in IC 2497 with a brightness temperature in excess of 4E5 K. With the WSRT, we detect a large reservoir of neutral hydrogen in the proximity of IC 2497. One cloud complex with a total mass of 5.6E9 Msol to the South of IC 2497, encompasses Hanny's Voorwerp. Another cloud complex is located at the position of a small galaxy group ~100 kpc to the West of IC 2497 with a mass of 2.9E9 Msol. Our data hint at a physical connection between both complexes. We also detect HI in absorption against the central continuum source of IC 2497. Our obse...

  20. Dicty_cDB: FC-IC1367 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1367 (Link to dictyBase) - - - - FC-IC1367E (Link to Original site) FC-IC... to library) Clone ID FC-IC1367 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig - Ori...cytoskeletal 8.0 %: mitochondrial 4.0 %: vacuolar 4.0 %: endoplasmic reticulum >> prediction for FC-IC1367 i...1367F 271 FC-IC1367Z 271 FC-IC1367P 522 FC-IC1367E 261 Show FC-IC1367 Library FC-IC (Link...ginal site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC1367Q.Seq.d/ Rep

  1. Dicty_cDB: FC-IC1728 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1728 (Link to dictyBase) - - - - - (Link to Original site) - - FC-IC...1728Z 373 - - - - Show FC-IC1728 Library FC-IC (Link to library) Clone ID FC-IC1728 (Link to dic...tyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig - Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1785 (FC-IC1785Q) /CSM/FC-IC/FC-IC...6.0 %: plasma membrane 12.0 %: mitochondrial 4.0 %: cytoskeletal 4.0 %: Golgi 4.0 %: cytoplasmic >> prediction for FC-IC

  2. Dicty_cDB: FC-IC1667 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1667 (Link to dictyBase) - - - Contig-U16382-1 FC-IC16... (Link to library) Clone ID FC-IC1667 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16382-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...y vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1667 (FC-IC1667Q) /CSM/FC-IC/FC-IC...%: mitochondrial 8.0 %: nuclear >> prediction for FC-IC1667 is mit 5' end seq. ID FC-IC1667F 5' end seq. >FC-IC

  3. Dicty_cDB: FC-IC0107 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0107 (Link to dictyBase) - - - - FC-IC0107F (Link to Original site) FC-IC...0107F 430 - - - - - - Show FC-IC0107 Library FC-IC (Link to library) Clone ID FC-IC0107 (Link to dic...tyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig - Original site URL http://dictycdb.bi...ore E Sequences producing significant alignments: (bits) Value FC-IC0107 (FC-IC0107Q) /CSM/FC-IC/FC-IC0107Q.Seq.d/ 258 6e-68 FC-IC...asma membrane 12.0 %: mitochondrial 4.0 %: cytoskeletal 4.0 %: Golgi 4.0 %: cytoplasmic >> prediction for FC-IC

  4. Dicty_cDB: FC-IC1423 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1423 (Link to dictyBase) - - - Contig-U16122-1 FC-IC14... (Link to library) Clone ID FC-IC1423 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16122-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...mitochondrial 4.0 %: cytoskeletal 4.0 %: Golgi 4.0 %: vesicles of secretory system >> prediction for FC-IC14...23E (Link to Original site) FC-IC1423F 250 FC-IC1423Z 254 FC-IC1423P 484 FC-IC1423E 244 Show FC-IC1423 Library FC-IC

  5. Dicty_cDB: FC-IC1251 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1251 (Link to dictyBase) - - - Contig-U08307-1 FC-IC12...Link to library) Clone ID FC-IC1251 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig C...ontig-U08307-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC... 4.0 %: plasma membrane >> prediction for FC-IC1251 is mit 5' end seq. ID FC-IC...51P (Link to Original site) FC-IC1251F 648 FC-IC1251Z 650 FC-IC1251P 1278 - - Show FC-IC1251 Library FC-IC (

  6. Dicty_cDB: FC-IC1707 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1707 (Link to dictyBase) - - - Contig-U13402-1 FC-IC17... (Link to library) Clone ID FC-IC1707 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link ...to Contig Contig-U13402-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...tracellular, including cell wall 8.0 %: endoplasmic reticulum 4.0 %: cytoskeletal 4.0 %: peroxisomal >> prediction for FC-IC...07E (Link to Original site) FC-IC1707F 532 FC-IC1707Z 533 FC-IC1707P 1045 FC-IC1707E 523 Show FC-IC1707 Library FC-IC

  7. Dicty_cDB: FC-IC0095 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0095 (Link to dictyBase) - G24277 DDB0231825 Contig-U03300-1 FC-IC...tig Contig-U03300-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC... vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC0095 (FC-IC0095Q) /CSM/FC-IC/FC-IC...0095F (Link to Original site) FC-IC0095F 288 - - - - - - Show FC-IC0095 Library FC-IC (Link to library) Clone ID FC-IC...0095 (Link to dictyBase) Atlas ID - NBRP ID G24277 dictyBase ID DDB0231825 Link to Con

  8. Dicty_cDB: FC-IC0932 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0932 (Link to dictyBase) - - - - - (Link to Original site) - - FC-IC...0932Z 239 - - - - Show FC-IC0932 Library FC-IC (Link to library) Clone ID FC-IC0932 (Link to dic...tyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig - Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC... 8.0 %: extracellular, including cell wall 4.0 %: cytoskeletal >> prediction for FC-IC0932 is mit 5' ...te) Representative DNA sequence >FC-IC0932 (FC-IC0932Q) /CSM/FC-IC/FC-IC0932Q.Seq.d/ XXXXXXXXXXTCACCAATGTTGA

  9. Dicty_cDB: FC-IC1144 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1144 (Link to dictyBase) - - - Contig-U15215-1 FC-IC11...Link to library) Clone ID FC-IC1144 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig C...ontig-U15215-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...tochondrial 32.0 %: nuclear 16.0 %: cytoplasmic 4.0 %: cytoskeletal >> prediction for FC-IC1144 is mit 5' end seq. ID FC-IC...44P (Link to Original site) FC-IC1144F 715 FC-IC1144Z 681 FC-IC1144P 1376 - - Show FC-IC1144 Library FC-IC (

  10. Dicty_cDB: FC-IC1678 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1678 (Link to dictyBase) - - - Contig-U16583-1 FC-IC16... (Link to library) Clone ID FC-IC1678 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16583-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...s Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1678 (FC-IC1678Q) /CSM/FC-IC/FC-IC... 8.0 %: cytoskeletal 8.0 %: mitochondrial >> prediction for FC-IC1678 is nuc 5' end seq. ID FC-IC1678F 5' end seq. >FC-IC

  11. Dicty_cDB: FC-IC0522 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0522 (Link to dictyBase) - G24294 DDB0169466 Contig-U03376-1 FC-IC... (Link to library) Clone ID FC-IC0522 (Link to dictyBase) Atlas ID - NBRP ID G24294 dic...tnfski*ki rniyklsislc Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC0522 (FC-IC... 12.0 %: cytoskeletal 8.0 %: mitochondrial 4.0 %: vacuolar >> prediction for FC-IC...0522E (Link to Original site) FC-IC0522F 215 FC-IC0522Z 215 FC-IC0522P 430 FC-IC0522E 215 Show FC-IC0522 Library FC-IC

  12. Dicty_cDB: FC-IC0335 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0335 (Link to dictyBase) - - - Contig-U08330-1 FC-IC03... (Link to library) Clone ID FC-IC0335 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U08330-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...0 m_ : 1.00 44.0 %: cytoplasmic 40.0 %: nuclear 12.0 %: mitochondrial 4.0 %: plasma membrane >> prediction for FC-IC...35E (Link to Original site) FC-IC0335F 270 FC-IC0335Z 270 FC-IC0335P 540 FC-IC0335E 270 Show FC-IC0335 Library FC-IC

  13. Dicty_cDB: FC-IC1095 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1095 (Link to dictyBase) - - - Contig-U10067-1 FC-IC10... (Link to library) Clone ID FC-IC1095 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U10067-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1156 (FC-IC...%: cytoskeletal 12.0 %: mitochondrial 4.0 %: vacuolar 4.0 %: Golgi >> prediction for FC-IC

  14. Revealing the binary origin of Type Ic superluminous supernovae through nebular hydrogen emission

    Science.gov (United States)

    Moriya, Takashi J.; Liu, Zheng-Wei; Mackey, Jonathan; Chen, Ting-Wan; Langer, Norbert

    2015-12-01

    We propose that nebular Hα emission, as detected in the Type Ic superluminous supernova iPTF13ehe, stems from matter that is stripped from a companion star when the supernova ejecta collide with it. The temporal evolution, the line broadening, and the overall blueshift of the emission are consistent with this interpretation. We scale the nebular Hα luminosity predicted for Type Ia supernovae in single-degenerate systems to derive the stripped mass required to explain the Hα luminosity of iPTF13ehe. We find a stripped mass of 0.1-0.9 solar masses, assuming that the supernova luminosity is powered by radioactivity or magnetar spin down. Because a central heating source is required to excite the Hα emission, an interaction-powered model is not favored for iPTF13ehe if the Hα emission is from stripped matter. We derive a companion mass of more than 20 solar masses and a binary separation of less than about 20 companion radii based on the stripping efficiency during the collision, indicating that the supernova progenitor and the companion formed a massive close binary system. If Type Ic superluminous supernovae generally occur in massive close binary systems, the early brightening observed previously in several Type Ic superluminous supernovae may also be due to the collision with a close companion. Observations of nebular hydrogen emission in future Type Ic superluminous supernovae will enable us to test this interpretation.

  15. Pulsating pre-main sequence stars in IC 4996 and NGC 6530

    CERN Document Server

    Zwintz, K; Zwintz, Konstanze; Weiss, Werner W.

    2006-01-01

    Asteroseismology of pulsating pre-main sequence (PMS) stars has the potential of testing the validity of current models of PMS structure and evolution. As a first step, a sufficiently large sample of pulsating PMS stars has to be established, which allows to select candidates optimally suited for a detailed asteroseismological analysis based on photometry from space or ground based network data. A search for pulsating PMS members in the young open clusters IC 4996 and NGC 6530 has been performed to improve the sample of known PMS pulsators. As both clusters are younger than 10 million years, all members with spectral types later than A0 have not reached the zero-age main sequence yet. Hence, IC 4996 and NGC 6530 are most suitable to search for PMS pulsation among their A- and F-type cluster stars. CCD time series photometry in Johnson B and V filters has been obtained for IC 4996 and NGC 6530. The resulting light curves for 113 stars in IC 4996 and 194 stars in NGC 6530 have been subject to detailed frequency...

  16. Moving from irrelevant intellectual capital (IC) reporting to value-relevant IC disclosures: key learning points from the Danish experience

    DEFF Research Database (Denmark)

    Roslender, Robin; Schaper, Stefan; Nielsen, Christian

    2017-01-01

    Purpose – Informed by the findings of a follow-up research study of companies originally involved in the Danish Guideline Project (DGP) for intellectual capital statements (ICS), the purpose of this paper is to provide valuable insights for a potential shift from intellectual capital (IC) reporting......, largely informed by an accounting perspective, towards IC-related disclosures. Design/methodology/approach – The paper draws on data obtained from 21 semi-structured interviews with respondents in 16 companies. The respondents were contacted following a genealogical exercise carried out on the 102...... structure. Overall, a trend towards more integrated forms of reporting was discernible, in some part being motivated by the need to reduce the levels of reporting overload. Examples of integration designed to legitimise IC or corporate social responsibility reports, involving issuing them in tandem...

  17. IC chip stress during plastic package molding

    Energy Technology Data Exchange (ETDEWEB)

    Palmer, D.W.; Benson, D.A.; Peterson, D.W.; Sweet, J.N.

    1998-02-01

    Approximately 95% of the world`s integrated chips are packaged using a hot, high pressure transfer molding process. The stress created by the flow of silica powder loaded epoxy can displace the fine bonding wires and can even distort the metalization patterns under the protective chip passivation layer. In this study the authors developed a technique to measure the mechanical stress over the surface of an integrated circuit during the molding process. A CMOS test chip with 25 diffused resistor stress sensors was applied to a commercial lead frame. Both compression and shear stresses were measured at all 25 locations on the surface of the chip every 50 milliseconds during molding. These measurements have a fine time and stress resolution which should allow comparison with computer simulation of the molding process, thus allowing optimization of both the manufacturing process and mold geometry.

  18. Dicty_cDB: FC-IC0564 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0564 (Link to dictyBase) - - - Contig-U16036-1 FC-IC05...ink to library) Clone ID FC-IC0564 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Co...ntig-U16036-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC... Score E Sequences producing significant alignments: (bits) Value FC-IC0564 (FC-IC0564Q) /CSM/FC-IC/FC-IC056...lar, including cell wall 4.0 %: cytoskeletal 4.0 %: vacuolar >> prediction for FC-IC0564 is cyt 5' end seq. ID FC-IC

  19. Dicty_cDB: FC-IC0216 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0216 (Link to dictyBase) - G24287 DDB0201591 Contig-U0... (Link to library) Clone ID FC-IC0216 (Link to dictyBase) Atlas ID - NBRP ID G24287 dictyBase I...D DDB0201591 Link to Contig Contig-U03331-1 Original site URL http://dictycdb.bio... 4.0 %: mitochondrial 4.0 %: peroxisomal >> prediction for FC-IC0216 is nuc 5' end seq. ID FC-IC0216F 5' end seq. >FC-IC...3331-1 - (Link to Original site) FC-IC0216F 315 FC-IC0216Z 315 FC-IC0216P 630 FC-IC0216E 315 Show FC-IC0216 Library FC-IC

  20. Dicty_cDB: FC-IC0364 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0364 (Link to dictyBase) - - - Contig-U01120-1 - (Link to Original site) FC-IC...(Link to library) Clone ID FC-IC0364 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig ...Contig-U01120-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...re E Sequences producing significant alignments: (bits) Value FC-IC0364 (FC-IC0364Q) /CSM/FC-IC/FC-IC0364Q.S...24.0 %: nuclear 8.0 %: cytoplasmic 4.0 %: cytoskeletal >> prediction for FC-IC0364 is mit 5' end seq. ID FC-IC

  1. Dicty_cDB: FC-IC0491 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0491 (Link to dictyBase) - - - Contig-U12373-1 FC-IC04... (Link to library) Clone ID FC-IC0491 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link ...to Contig Contig-U12373-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...omology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1285 (FC-IC1285Q) /CSM/FC-IC/FC-IC...ear 12.0 %: cytoskeletal 4.0 %: mitochondrial 4.0 %: peroxisomal >> prediction for FC-IC0491 is cyt 5' end seq. ID FC-IC

  2. Dicty_cDB: FC-IC1222 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1222 (Link to dictyBase) - - - Contig-U11840-1 FC-IC12...ink to library) Clone ID FC-IC1222 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Co...ntig-U11840-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...equences producing significant alignments: (bits) Value FC-IC1222 (FC-IC1222Q) /CSM/FC-IC/FC-IC1222Q.Seq.d/ ...%: Golgi 4.0 %: plasma membrane 4.0 %: vesicles of secretory system >> prediction for FC-IC1222 is end 5' end seq. ID FC-IC

  3. Dicty_cDB: FC-IC1569 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1569 (Link to dictyBase) - - - Contig-U16026-1 FC-IC15... (Link to library) Clone ID FC-IC1569 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16026-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1569 (FC-IC1569Q) /CSM/FC-IC/FC-IC...les of secretory system >> prediction for FC-IC1569 is end 5' end seq. ID FC-IC

  4. Dicty_cDB: FC-IC1756 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1756 (Link to dictyBase) - - - Contig-U16026-1 FC-IC17...ink to library) Clone ID FC-IC1756 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Co...ntig-U16026-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...isomal 4.0 %: extracellular, including cell wall 4.0 %: vacuolar 4.0 %: vesicles of secretory system >> prediction for FC-IC...56P (Link to Original site) FC-IC1756F 156 FC-IC1756Z 284 FC-IC1756P 420 - - Show FC-IC1756 Library FC-IC (L

  5. Dicty_cDB: FC-IC1753 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1753 (Link to dictyBase) - - - - - (Link to Original site) - - FC-IC...1753Z 284 - - - - Show FC-IC1753 Library FC-IC (Link to library) Clone ID FC-IC1753 (Link to dic...tyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig - Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...te) Representative DNA sequence >FC-IC1753 (FC-IC1753Q) /CSM/FC-IC/FC-IC1753Q.Seq.d/ XXXXXXXXXXTGTGTTTTGGAGT...vllvlgwlelvllvle*lelvwlvlvwlelv*lelgllfl eykeehp*ihllgnmnmklqiyldilslrnhmk Homology vs CSM-cDNA Score E Sequences producing signific

  6. Dicty_cDB: FC-IC0417 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0417 (Link to dictyBase) - - - Contig-U03353-1 FC-IC04...17F (Link to Original site) FC-IC0417F 285 - - - - - - Show FC-IC0417 Library FC-IC (Link to library) Clone ID FC-IC... %: cytoskeletal 4.0 %: vacuolar >> prediction for FC-IC0417 is nuc 5' end seq. ID FC-IC...0417 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U03353-1 Original site URL http://dic...tycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC0417Q.Seq.d/ Representative seq. ID FC-IC

  7. Ocular Shock Front in the Colliding Galaxy IC 2163

    CERN Document Server

    Kaufman, Michele; Struck, Curtis; Elmegreen, Debra Meloy; Bournard, Frederic; Brinks, Elias; Juneau, Stephanie; Sheth, Kartik

    2016-01-01

    ALMA observations in the CO 1 - 0 line of the interacting galaxies IC 2163 and NGC 2207 at 2'' x 1.5'' resolution reveal how the encounter drives gas to pile up in narrow, ~ 1 kpc wide, "eyelids" in IC 2163. IC 2163 and NGC 2207 are involved in a grazing encounter, which has led to development in IC 2163 of an eye-shaped (ocular) structure at mid-radius and two tidal arms. The CO data show that there are large velocity gradients across the width of each eyelid, with a mixture of radial and azimuthal streaming of gas at the outer edge of the eyelid relative to its inner edge. The sense of the radial streaming in the eyelids is consistent with the idea that gas from the outer part of IC 2163 flows inward until its radial streaming slows down abruptly and the gas piles up in the eyelids. The radial compression at the eyelids causes an increase in the gas column density by direct radial impact and also leads to a high rate of shear. We find a strong correlation between the molecular column densities and the magni...

  8. Distribution of Late-type Stars around IC 4665

    Science.gov (United States)

    Fronto, A.; Balazs, L. G.; Paparo, M.

    1990-01-01

    We have investigated 424 stars of F8 spectral types and later in a 19.5 sq. degree field around IC 4665. The main purpose of our study in this low latitude field (b = +16.5 in our case) was the testing of the plane-parallel hypothesis of the density distribution, i.e. the hypothesis that the spatial density of the Population I stars observed at great angular distance from the galactic caps is well approximated by the z = r sin (b) scaling of the distributions obtained in the polar regions. We used the factor analysis of multivariate mathematical statistics in order to extract the effect of absorption from the photometric data. To identify the factor component describing the interstellar reddening we invoked the corresponding IRAS Sky Flux Data. We computed the spatial densities for the F8 - G5 dwarfs and the K giants separately. We used a maximum likelihood algorithm for oblating the space densities. We arrived at the following main conclusions in our paper: The absorbing material concentrates closer than 150 pc in our area. There is a weak but still significant correlation between the optical measures of absorption and the IRAS 100 micron Sky Flux Maps data. The spatial densities of F8 - G5 dwarfs essentially reflect the densities obtained in the galactic plane. The distribution of distance moduli of K giants in our sample can be well modelled by the z = sin (b) scaling of Upgren's data from the North Polar region. The actual form of the space density curve of the K giants can be satisfactorily fitted both by an isothermal model and an exponential model.

  9. Dicty_cDB: FC-IC1182 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1182 (Link to dictyBase) - - - Contig-U07877-1 FC-IC11...Link to library) Clone ID FC-IC1182 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig C...ontig-U07877-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...kl*s*swfrcctnsycwsffksfncsw **psycmwtlan* Homology vs CSM-cDNA Score E Sequences producing significant align...les of secretory system >> prediction for FC-IC1182 is cyt 5' end seq. ID FC-IC

  10. Dicty_cDB: FC-IC1622 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1622 (Link to dictyBase) - - - Contig-U16527-1 FC-IC16... (Link to library) Clone ID FC-IC1622 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16527-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...k tnntssnhpktnntssnhsktnhtssnysktnntspnntspninsysrldfipnsnkrsr tmrimlgic**cst*isl...ghllvvqhlnlvtllnm Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1760 (FC-IC

  11. A Unified Submodular Framework for Multimodal IC Trojan Detection

    Science.gov (United States)

    Koushanfar, Farinaz; Mirhoseini, Azalia; Alkabani, Yousra

    This paper presents a unified formal framework for integrated circuits (IC) Trojan detection that can simultaneously employ multiple noninvasive measurement types. Hardware Trojans refer to modifications, alterations, or insertions to the original IC for adversarial purposes. The new framework formally defines the IC Trojan detection for each measurement type as an optimization problem and discusses the complexity. A formulation of the problem that is applicable to a large class of Trojan detection problems and is submodular is devised. Based on the objective function properties, an efficient Trojan detection method with strong approximation and optimality guarantees is introduced. Signal processing methods for calibrating the impact of inter-chip and intra-chip correlations are presented. We propose a number of methods for combining the detections of the different measurement types. Experimental evaluations on benchmark designs reveal the low-overhead and effectiveness of the new Trojan detection framework and provides a comparison of different detection combining methods.

  12. Electrical Characterization of 4H-SiC JFET Wafer: DC Parameter Variations for Extreme Temperature IC Design

    Science.gov (United States)

    Neudeck, Philip G.; Chen, Liangyu; Spry, David J.; Beheim, Glenn M.; Chang, Carl W.

    2014-01-01

    This work reports DC electrical characterization of a 76 mm diameter 4H-SiC JFET test wafer fabricated as part of NASA's on-going efforts to realize medium-scale ICs with prolonged and stable circuit operation at temperatures as high as 500 degC. In particular, these measurements provide quantitative parameter ranges for use in JFET IC design and simulation. Larger than expected parameter variations were observed both as a function of position across the wafer as well as a function of ambient testing temperature from 23 degC to 500 degC.

  13. The broad line type Ic supernova SN 2007ru: Adding to the diversity of type Ic supernovae

    CERN Document Server

    Sahu, D K; Anupama, G C; Gurugubelli, Uday K; Nomoto, Ken'ichi

    2008-01-01

    Photometric and spectral evolution of the type Ic supernova SN 2007ru during the first 3 months are presented. The spectra show broad spectral features due to very high expansion velocity, normally seen in hypernovae. The photospheric velocity is higher than other type Ic supernovae. It is lower than SN 1998bw at $\\sim$ 8 days after the explosion, but is comparable at later epochs. The light curve evolution of SN 2007ru indicates a fast rise time of 8$\\pm$3 days to $B$ band maximum and post-maximum decline more rapidly than other broad-line type Ic supernovae.With an absolute $V$ magnitude of -19.10, SN 2007ru is comparable in brightness with SN 1998bw and lies at the brighter end of the observed type Ic supernovae. The mass of \\Nifs is estimated to be $\\sim 0.4\\Msun$. The fast rise and decline of the light curve and the high expansion velocity suggest that SN 2007ru is an explosion with a high kinetic energy/ejecta mass ratio ($E_{\\rm K}/M_{\\rm {ej}}$). This adds to the diversity of type Ic supernovae.

  14. Extreme low-power mixed signal IC design

    CERN Document Server

    Tajalli, Armin

    2010-01-01

    This book describes a completely novel class of techniques for designing ultra-low-power integrated circuits (ICs). In many applications such as battery operated systems and battery-less (energy-scavenging) systems, power dissipation is a critical parameter. As a result, there is a growing demand for reducing the power (energy) consumption in ICs to extremely low levels, not achievable by using classical ""subthreshold CMOS"" techniques. This book introduces a new family of ""subthreshold circuits"" called ""source-coupled circuits"". This family of circuits can be used for implementing digita

  15. JOULE HEATING INDUCED INTERCONNECT FAILURE IN 3D IC TECHNOLOGY

    OpenAIRE

    Li, Menglu

    2016-01-01

    With the slow-down of Moore’s law of scaling transistors, the industry is looking for 3D IC technology to extend the Moore’s law by stacking chips vertically. In the 3D IC technology, Joule heating is the most serious reliability concern because of increased power density. Moreover, there are new interconnects in the package to support vertical stacking, including the Through Silicon Via (TSV) inside silicon die, μ-bumps between different dies, and redistribution layer (RDL) to fan out the cu...

  16. Dicty_cDB: FC-IC0430 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0430 (Link to dictyBase) - - - Contig-U16271-1 FC-IC04... (Link to library) Clone ID FC-IC0430 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16271-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...ology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC0430 (FC-IC...l 4.0 %: mitochondrial 4.0 %: endoplasmic reticulum >> prediction for FC-IC0430 is cyt 5' end seq. ID FC-IC0430F 5' end seq. >FC-IC

  17. Dicty_cDB: FC-IC0649 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0649 (Link to dictyBase) - - - Contig-U16566-1 FC-IC06...ink to library) Clone ID FC-IC0649 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Co...ntig-U16566-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC... Score E Sequences producing significant alignments: (bits) Value FC-IC0649 (FC-IC0649Q) /CSM/FC-IC/FC-IC064...ory system 4.0 %: cytoskeletal 4.0 %: vacuolar 4.0 %: Golgi 4.0 %: mitochondrial >> prediction for FC-IC0649

  18. Dicty_cDB: FC-IC0993 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0993 (Link to dictyBase) - G24303 DDB0220699 Contig-U08379-1 FC-IC... (Link to library) Clone ID FC-IC0993 (Link to dictyBase) Atlas ID - NBRP ID G24303 dic...gi 4.0 %: plasma membrane 4.0 %: vesicles of secretory system 4.0 %: extracellular, including cell wall >> prediction for FC-IC...0993E (Link to Original site) FC-IC0993F 526 FC-IC0993Z 526 FC-IC0993P 1032 FC-IC0993E 516 Show FC-IC0993 Library FC-IC...tyBase ID DDB0220699 Link to Contig Contig-U08379-1 Original site URL http://dic

  19. Dicty_cDB: FC-IC0027 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0027 (Link to dictyBase) - - - Contig-U08312-1 FC-IC00...27F (Link to Original site) FC-IC0027F 578 - - - - - - Show FC-IC0027 Library FC-IC (Link to library) Clone ID FC-IC...0005Q) /CSM/FC-IC/FC-IC0005Q.Seq.d/ 531 e-150 own update 2001.11.18 Homology vs DNA Score E Sequences producing signific...les of secretory system 4.0 %: endoplasmic reticulum >> prediction for FC-IC0027 is nuc 5' end seq. ID FC-IC...0027 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U08312-1 Original site URL http://dic

  20. Dicty_cDB: FC-IC0758 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0758 (Link to dictyBase) - - - Contig-U07877-1 FC-IC07...ink to library) Clone ID FC-IC0758 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Co...ntig-U07877-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...cldr Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC0758 (FC-IC0758Q) /CSM/FC-IC/FC-IC...0 %: mitochondrial 4.0 %: plasma membrane 4.0 %: vesicles of secretory system >> prediction for FC-IC

  1. Dicty_cDB: FC-IC1440 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1440 (Link to dictyBase) - - - Contig-U15453-1 FC-IC14... (Link to library) Clone ID FC-IC1440 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U15453-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...re E Sequences producing significant alignments: (bits) Value FC-IC1440 (FC-IC1440Q) /CSM/FC-IC/FC-IC...clear 36.0 %: cytoplasmic 8.0 %: cytoskeletal 8.0 %: mitochondrial 4.0 %: vacuolar >> prediction for FC-IC14

  2. Dicty_cDB: FC-IC0501 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0501 (Link to dictyBase) - - - Contig-U16382-1 FC-IC05... (Link to library) Clone ID FC-IC0501 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16382-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...y vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC0501 (FC-IC...les of secretory system >> prediction for FC-IC0501 is nuc 5' end seq. ID FC-IC0501F 5' end seq. >FC-IC

  3. Dicty_cDB: FC-IC0954 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0954 (Link to dictyBase) - - - Contig-U16382-1 FC-IC09... (Link to library) Clone ID FC-IC0954 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16382-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...SM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC0954 (FC-IC0954Q) /CSM/FC-IC/FC-IC.../FC-IC1696Q.Seq.d/ 761 0.0 own update 2004.12.25 Homology vs DNA Score E Sequences producing signific

  4. Dicty_cDB: FC-IC1149 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1149 (Link to dictyBase) - - - Contig-U16271-1 - (Link to Original site) FC-IC...1149F 272 - - - - - - Show FC-IC1149 Library FC-IC (Link to library) Clone ID FC-IC1149 (Link to dic...tyostelium discoideum gamete cDNA clone:FC-IC1... 519 e-143 1 ( AU272187 ) Dictyostelium discoideu...m gamete cDNA clone:FC-IC1... 519 e-143 1 ( AU272185 ) Dictyostelium discoideum gamete cDNA clone:FC-IC1... ...elium discoideum gamete cDNA clone:FC-IC1... 517 e-143 1 ( AU275192 ) Dictyostelium discoideum gamete cDNA clone:FC-IC

  5. Dicty_cDB: FC-IC1236 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1236 (Link to dictyBase) - - - Contig-U12406-1 - (Link... to Original site) - - FC-IC1236Z 497 - - - - Show FC-IC1236 Library FC-IC (Link to library) Clone ID FC-IC1236 (Link to dic...xxxlvxslcfxw Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1236 (FC-IC1236Q) /CSM/FC-IC...tyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U12406-1 Original site URL http://dic...tycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC1236Q.Seq.d/ Representative se

  6. Dicty_cDB: FC-IC0067 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0067 (Link to dictyBase) - - - Contig-U16382-1 FC-IC00...67F (Link to Original site) FC-IC0067F 267 - - - - - - Show FC-IC0067 Library FC-IC (Link to library) Clone ID FC-IC...tochondrial 8.0 %: Golgi 4.0 %: vesicles of secretory system 4.0 %: endoplasmic reticulum >> prediction for FC-IC...0067 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U16382-1 Original site URL http://dic...tycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC0067Q.Seq.d/ Representative seq. ID FC-IC

  7. Dicty_cDB: FC-IC0162 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0162 (Link to dictyBase) - - - Contig-U10099-1 FC-IC01...62F (Link to Original site) FC-IC0162F 358 - - - - - - Show FC-IC0162 Library FC-IC (Link to library) Clone ID FC-IC...DGPDDEALPVVDGPDDEALP-- - Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC0162 (FC-IC...%: cytoskeletal 4.0 %: Golgi 4.0 %: cytoplasmic >> prediction for FC-IC0162 is end 5' end seq. ID FC-IC...0162 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U10099-1 Original site URL http://dic

  8. Dicty_cDB: FC-IC1178 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1178 (Link to dictyBase) - - - Contig-U16026-1 - (Link... to Original site) - - FC-IC1178Z 442 - - - - Show FC-IC1178 Library FC-IC (Link to library) Clone ID FC-IC1178 (Link to dic... vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1178 (FC-IC1178Q) /CSM/FC-IC/FC-IC...les of secretory system >> prediction for FC-IC1178 is end 5' end seq. ID - 5' end seq. - Length ...tyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U16026-1 Original site URL http://dic

  9. Catalog of Realizations for DXCCII using Commercially Available ICs and Applications

    Directory of Open Access Journals (Sweden)

    S. Maheshwari

    2012-04-01

    Full Text Available This paper presents fifteen distinct practical realizations for dual-X second generation current conveyor (DXCCII using commercially available integrated circuits. Detailed comparisons and results are presented to verify the utility of proposed realizations. The catalog of proposed realizations is a first attempt and is expected to be useful for testing newly developed circuits based on dual-X second generation current conveyor. Each of the first fourteen proposed realizations uses four ICs. One three IC based implementation is further given making the total count fifteen. Some additional features are also explored which further enhance the versatility of DXCCII. The paper further presents a novel and compact quadrature oscillator to verify the applicability of the proposed realizations. Single resistance control of the frequency of oscillation is also demonstrated by employing the new gain-variable DXCCII. Experimental results are also included along with simulation results to validate the proposed theory and its practical significance.

  10. Evaluations of the Irwin. beta. /sub Ic/ adjustment for small specimen fracture toughness data

    Energy Technology Data Exchange (ETDEWEB)

    Merkle, J.G.

    1983-01-01

    When small specimens are used to measure the cleavage fracture toughness of pressure vessel steels in the transition range of temperature, specimen thickness size effects and large amounts of data scatter are often observed. The size effects are manifested by an increase in the average value of fracture toughness with decreasing specimen thickness, eventually resulting in a change in fracture mode from cleavage to ductile tearing. It has been shown that a semiempirical adjustment for the interacting effects of specimen thickness, yield stress and toughness originally proposed by Irwin is capable of reducing the calculated values of toughness and data scatter to levels consistent with large specimen test data. This is true for dynamic as well as for static initiation toughness values. The nature of the size effect described by the Irwin ..beta../sub Ic/ equation is illustrated and specific cases are shown in which ..beta../sub Ic/ adjustment has eliminated size effects, for both static and dynamic fracture toughness data.

  11. IC Surface Corrosion Inspection by C-Mode Scanning Acoustic Microscopy

    Institute of Scientific and Technical Information of China (English)

    Li-Li Ma; Sheng-Xiang Bao; De-Chun Lu; Zhi-Bo Du

    2007-01-01

    Cmode scanning acoustical microscopy,CSAM, is widely used in plastic package evaluations and for failure analysis. It permits to detect subsurface delaminations, cracks and pores (air bubbles) for different microelectronics packages. In this study, abnormality was observed in CSAM daily test, the images showed no delaminations but inhomogeneities on the IC surface.Corrosion was found by optical microscope and scanning electron microscope after decapsulation. It can be revealed as the acoustic impedance is different between corrosion and normal area. The presence of inhomogeneities and discontinuities along ultrasonic waves' propagation paths inside the matter causes modifications in the amplitude and polarity of ultrasonic waves. However, CSAM's capability in detecting IC surface corrosion has not been presented. The capability will be illustrated and the inspection mechanism will be discussed in this paper.

  12. ICS-UNIDO - Promoting sustainable POPs disposal and remediation technologies

    Energy Technology Data Exchange (ETDEWEB)

    Zinovyev, S.; Lodolo, A.; Miertus, S. [ICS-UNIDO, Trieste (Italy)

    2004-09-15

    It is well known that a significant stock of polychlorinated hazards, including POP and PTS, has been produced and is stored nowadays or dispersed in the environment in many of Developing Countries and Countries with Economies in Transition. The obsolete industrial processes, giving rise to formation of dioxins, as well as former/current POP production/use (e.g. PCBs), coupled with uncontrolled use of polychlorinated pesticides in agriculture and improper storage of POP stockpiles have rendered vast territories in these countries highly contaminated and raised urgent issues of disposal of hazards and remediation of territories. The International Centre for Science and High Technology (ICS), www.ics.trieste.it, is an autonomous institution within the legal framework of the United Nations Industrial Development Organization (UNIDO) promoting a global programme on environmental protection, sustainable chemistry, catalysis, and clean technologies. An important part of its work programme is focused on the promotion of new technologies which can be helpful for the reduction of the formation of POPs (like dioxins and furans) in incineration processes and in obsolete technologies used in some industrial processes. Another hot issue is to promote safe technologies for the destruction of PCBs and polychlorinated pesticides. Particular efforts of ICS-UNIDO are directed towards the transfer of clean technologies to developing/transition countries. ICS-UNIDO, through its initiatives, seeks to establish a dialogue with local administrative, research, NGO, and industrial bodies in order to adopt sustainable technologies for POP disposal and management of contaminated sites.

  13. A deep multi-band investigation of IC2391

    CERN Document Server

    Spezzi, L; Marino, G; Leto, G; Young, E; Siegler, N; Balog, Z; Messina, S; Distefano, E; Merin, B; Navascues, D Barrado y

    2009-01-01

    We report the outcome of a deep multi-wavelength study of the IC2391 young open cluster. We aim at uncovering new low-mass and sub-stellar members of the cluster and identifying new debris disk objects. A 30*30 square arcmin area in IC 2391 was observed using the wide-field imager at the ESO 2.2m telescope. The completeness limits of the photometry at 3 sigma level are V=24.7, Rc=23.7 and Ic=23.0, faint enough to reveal sub-stellar members down to about 0.03 solar masses. Our membership criteria are based on the use of our optical data, in combination with JHKs magnitudes from the 2MASS catalog. We also estimate the physical parameters of the selected candidates. Debris disk candidates are identified on the basis of their infrared excess emission using near- and mid-infrared photometry from the Spitzer Space Telescope. Our optical survey, which has a limiting magnitude at 3 sigma level 1-2 mag fainter than previous optical surveys conducted in IC2391, revealed 29 new low-mass member candidates of the cluster....

  14. IC 5063 : AGN driven outflow of warm and cold gas

    NARCIS (Netherlands)

    Morganti, R.; Holt, J.; Saripalli, L.; Oosterloo, T. A.; Tadhunter, C. N.

    2007-01-01

    We present new ATCA 17- and 24- GHz radio images and ESO- NTT optical spectra of the radio- loud Seyfert galaxy IC 5063, the first galaxy in which a fast (similar to 600 km s(-1)) outflow of neutral hydrogen was discovered. The new radio data confirm the triple radio structure with a central, unreso

  15. Development of an ASD IC for the Micro Pixel Chamber

    CERN Document Server

    Orito, R; Kubo, H; Miuchi, K; Nagayoshi, T; Okada, Y; Takada, A; Takeda, A; Tanimori, T; Ueno, M

    2004-01-01

    A new amplifier-shaper-discriminator (ASD) chip was designed and manufactured for the Micro Pixel Chamber ($\\mu$-PIC). The design of this ASD IC is based on the ASD IC (TGC-ASD) for the Thin Gap Chamber in the LHC Atlas Experiment. The decay time constant of the preamplifier is 5-times longer than that of the TGC-ASD, and some other modifications have been made in order to improve the signal-to-noise ratio of the $\\mu$-PIC. The ASD IC uses SONY Analog Master Slice bipolar technology. The IC contains 4 channels in a QFP48 package. The decay time constant of the preamplifier is 80 ns and its gain is approximately 0.8 V/pC. The output from the preamplifier is received by a shaper (main-amplifier) with a gain of 7. A baseline restoration circuit is incorporated in the main-amplifier, and the current used for the baseline restoration is 5-times smaller than that of the TGC-ASD. The threshold voltage for the discriminator section is common to the 4 channels and their digital output level is LVDS-compatible. The ASD...

  16. How to write an ICS/IUGA conference abstract.

    NARCIS (Netherlands)

    Cartwright, R.; Tikkinen, K.A.; Vierhout, M.E.; Koelbl, H.

    2010-01-01

    INTRODUCTION: This article aims to condense the lectures and discussions from workshops on good reporting at IUGA Como 2009 and ICS San Francisco 2009, providing practical advice for the novice researcher summarising their data for the first time. CONCLUSIONS: Drafting an abstract can be a time cons

  17. Local IC Market:Not Made in China

    Institute of Scientific and Technical Information of China (English)

    HAYET SELLAMI

    2006-01-01

    @@ Ranking first in the world's integrated circuits (IC) market with a value of US$40.8 billion, China is becoming the Silicon Valley of the East as overseas investors compete to establish companies and factories to assemble or design chips for cell phones, computers and any other type of electronic device.

  18. Analog IC Design at the University of Twente

    NARCIS (Netherlands)

    Nauta, Bram

    2007-01-01

    This article describes some recent research results from the IC Design group of the University of Twente, located in Enschede, The Netherlands. Our research focuses on analog CMOS circuit design with emphasis on high frequency and broadband circuits. With the trend of system integration in mind, we

  19. Validating the Implementation Climate Scale (ICS) in child welfare organizations.

    Science.gov (United States)

    Ehrhart, Mark G; Torres, Elisa M; Wright, Lisa A; Martinez, Sandra Y; Aarons, Gregory A

    2016-03-01

    There is increasing emphasis on the use of evidence-based practices (EBPs) in child welfare settings and growing recognition of the importance of the organizational environment, and the organization's climate in particular, for how employees perceive and support EBP implementation. Recently, Ehrhart, Aarons, and Farahnak (2014) reported on the development and validation of a measure of EBP implementation climate, the Implementation Climate Scale (ICS), in a sample of mental health clinicians. The ICS consists of 18 items and measures six critical dimensions of implementation climate: focus on EBP, educational support for EBP, recognition for EBP, rewards for EBP, selection or EBP, and selection for openness. The goal of the current study is to extend this work by providing evidence for the factor structure, reliability, and validity of the ICS in a sample of child welfare service providers. Survey data were collected from 215 child welfare providers across three states, 12 organizations, and 43 teams. Confirmatory factor analysis demonstrated good fit to the six-factor model and the alpha reliabilities for the overall measure and its subscales was acceptable. In addition, there was general support for the invariance of the factor structure across the child welfare and mental health sectors. In conclusion, this study provides evidence for the factor structure, reliability, and validity of the ICS measure for use in child welfare service organizations.

  20. Revealing Hanny's Voorwerp : radio observations of IC 2497

    NARCIS (Netherlands)

    Jozsa, G. I. G.; Garrett, M. A.; Oosterloo, T. A.; Rampadarath, H.; Paragi, Z.; van Arkel, H.; Lintott, C.; Keel, W. C.; Schawinski, K.; Edmondson, E.

    2009-01-01

    We present multi-wavelength radio observations in the direction of the spiral galaxy IC 2497 and the neighbouring emission nebula known as "Hanny's Voorwerp". Our WSRT continuum observations at 1.4 GHz and 4.9 GHz reveal the presence of extended emission at the position of the nebulosity, although t

  1. Saturn V Stage I (S-IC) Overview

    Science.gov (United States)

    Interbartolo, Michael

    2009-01-01

    Objectives include: a) Become familiar with the Saturn V Stage I (S-IC) major structural components: Forward Skirt, Oxidizer Tank, Intertank, Fuel Tank, and Thrust Structure. b) Gain a general understanding of the Stage I subsystems: Fuel, Oxidizer, Instrumentation, Flight Control, Environmental Control, Electrical, Control Pressure, and Ordinance.

  2. Spectral measurement using IC-compatible linear variable optical filter

    NARCIS (Netherlands)

    Emadi, A.; Grabarnik, S.; Wu, H.; De Graaf, G.; Hedsten, K.; Enoksson, P.; Correia, J.H.; Wolffenbuttel, R.F.

    2010-01-01

    This paper reports on the functional and spectral characterization of a microspectrometer based on a CMOS detector array covered by an IC-Compatible Linear Variable Optical Filter (LVOF). The Fabry-Perot LVOF is composed of 15 dielectric layers with a tapered middle cavity layer, which has been

  3. ASKAP HI imaging of the galaxy group IC 1459

    CERN Document Server

    Serra, P; Kilborn, V; Allison, J R; Amy, S W; Ball, L; Bannister, K; Bell, M E; Bock, D C -J; Bolton, R; Bowen, M; Boyle, B; Broadhurst, S; Brodrick, D; Brothers, M; Bunton, J D; Chapman, J; Cheng, W; Chippendale, A P; Chung, Y; Cooray, F; Cornwell, T; DeBoer, D; Diamond, P; Forsyth, R; Gough, R; Gupta, N; Hampson, G A; Harvey-Smith, L; Hay, S; Hayman, D B; Heywood, I; Hotan, A W; Hoyle, S; Humphreys, B; Indermuehle, B; Jacka, C; Jackson, C A; Jackson, S; Jeganathan, K; Johnston, S; Joseph, J; Kamphuis, P; Leach, M; Lenc, E; Lensson, E; Mackay, S; Marquarding, M; Marvil, J; McClure-Griffiths, N; McConnell, D; Meyer, M; Mirtschin, P; Neuhold, S; Ng, A; Norris, R P; O'Sullivan, J; Pathikulangara, J; Pearce, S; Phillips, C; Popping, A; Qiao, R Y; Reynolds, J E; Roberts, P; Sault, R J; Schinckel, A E T; Shaw, R; Shimwell, T W; Staveley-Smith, L; Storey, M; Sweetnam, A W; Troup, E; Tzioumis, A; Voronkov, M A; Westmeier, T; Whiting, M; Wilson, C; Wong, O I; Wu, X

    2015-01-01

    We present HI imaging of the galaxy group IC 1459 carried out with six antennas of the Australian SKA Pathfinder equipped with phased-array feeds. We detect and resolve HI in eleven galaxies down to a column density of $\\sim10^{20}$ cm$^{-2}$ inside a ~6 deg$^2$ field and with a resolution of ~1 arcmin on the sky and ~8 km/s in velocity. We present HI images, velocity fields and integrated spectra of all detections, and highlight the discovery of three HI clouds -- two in the proximity of the galaxy IC 5270 and one close to NGC 7418. Each cloud has an HI mass of $10^9$ M$_\\odot$ and accounts for ~15% of the HI associated with its host galaxy. Available images at ultraviolet, optical and infrared wavelengths do not reveal any clear stellar counterpart of any of the clouds, suggesting that they are not gas-rich dwarf neighbours of IC 5270 and NGC 7418. Using Parkes data we find evidence of additional extended, low-column-density HI emission around IC 5270, indicating that the clouds are the tip of the iceberg o...

  4. The craftsmanship of the "Carolingian" astrolabe, IC 3042.

    Science.gov (United States)

    L'E. Turner, G.

    The medieval astrolabe (IC 3042) once owned by the late Marcel Destombes and published by him in 1962, has been examined to discover as many details of the craftsmanship as possible. The conclusion is that the astrolabe was not made by a craftsman, but more likely by a scholar for his own use.

  5. Analog IC Design at the University of Twente

    NARCIS (Netherlands)

    Nauta, Bram

    2007-01-01

    This article describes some recent research results from the IC Design group of the University of Twente, located in Enschede, The Netherlands. Our research focuses on analog CMOS circuit design with emphasis on high frequency and broadband circuits. With the trend of system integration in mind, we

  6. A combined BEM/FEM method for IC substrate modeling

    NARCIS (Netherlands)

    Schrik, E.

    2006-01-01

    The research presented in this thesis was done in the context of the modeling of parasitic physical effects, like field couplings and crosstalk, that may adversely affect the functional performance of Integrated Circuits (ICs). The modeling of parasitic effects, through simulations with the resultin

  7. Revealing Hanny's Voorwerp : radio observations of IC 2497

    NARCIS (Netherlands)

    Jozsa, G. I. G.; Garrett, M. A.; Oosterloo, T. A.; Rampadarath, H.; Paragi, Z.; van Arkel, H.; Lintott, C.; Keel, W. C.; Schawinski, K.; Edmondson, E.

    We present multi-wavelength radio observations in the direction of the spiral galaxy IC 2497 and the neighbouring emission nebula known as "Hanny's Voorwerp". Our WSRT continuum observations at 1.4 GHz and 4.9 GHz reveal the presence of extended emission at the position of the nebulosity, although

  8. A Spitzer Census of the IC 348 Nebula

    Science.gov (United States)

    Muench, August A.; Lada, Charles J.; Luhman, K. L.; Muzerolle, James; Young, Erick

    2007-07-01

    Spitzer mid-infrared surveys enable an accurate census of young stellar objects by sampling large spatial scales, revealing very embedded protostars, and detecting low-luminosity objects. Taking advantage of these capabilities, we present a Spitzer-based census of the IC 348 nebula and embedded star cluster, covering a 2.5 pc region and comparable in extent to the Orion Nebula. Our Spitzer census supplemented with ground-based spectra has added 42 Class II T Tauri sources to the cluster membership and identified ~20 Class 0/I protostars. The population of IC 348 likely exceeds 400 sources after accounting statistically for unidentified diskless members. Our Spitzer census of IC 348 reveals a population of Class I protostars that is anticorrelated spatially with the Class II/III T Tauri members, which comprise the centrally condensed cluster around a B star. The protostars are instead found mostly at the cluster periphery about ~1 pc from the B star and spread out along a filamentary ridge. We further find that the star formation rate in this protostellar ridge is consistent with that rate which built the older exposed cluster, while the presence of 15 cold, starless, millimeter cores intermingled with this protostellar population indicates that the IC 348 nebula has yet to finish forming stars. Moreover, we show that the IC 348 cluster is of order 3-5 crossing times old, and, as evidenced by its smooth radial profile and confirmed mass segregation, is likely relaxed. While it seems apparent that the current cluster configuration is the result of dynamical evolution and its primordial structure has been erased, our finding of a filamentary ridge of Class I protostars supports a model in which embedded clusters are built up from numerous smaller subclusters. Finally, the results of our Spitzer census indicate that the supposition that star formation must progress rapidly in a dark cloud should not preclude these observations that show it can be relatively long lived.

  9. Inference with Linear Equality and Inequality Constraints Using R: The Package ic.infer

    Directory of Open Access Journals (Sweden)

    Ulrike Grömping

    2010-02-01

    Full Text Available In linear models and multivariate normal situations, prior information in linear inequality form may be encountered, or linear inequality hypotheses may be subjected to statistical tests. R package ic.infer has been developed to support inequality-constrained estimation and testing for such situations. This article gives an overview of the principles underlying inequality-constrained inference that are far less well-known than methods for unconstrained or equality-constrained models, and describes their implementation in the package.

  10. LDV+IC5.0在IC设计中的应用%Application of LDV+IC5.0 in IC Design Verification

    Institute of Scientific and Technical Information of China (English)

    王利; 蒋国平; 马幼军

    2005-01-01

    分析LDV+IC5.0仿真工具在混合信号IC设计中的应用以及同Spice仿真工具联合使用来缩短设计周期并保证精度,同时重点分析了模拟硬件电路行为描述语言Verilog-A模型结构并基于verilog和Verilog-A语言实现了数字信号激励, 数模转换器(DAC)的电路模型建立,在Cadence仿真器中实现仿真验证.

  11. El contenido de los mensajes icónicos: El discurso icónico como totalidad (2

    Directory of Open Access Journals (Sweden)

    Dr. Raymond Colle

    1999-01-01

    Full Text Available En el capítulo anterior, hemos hablado de los códigos icónicos de modo general, por cuanto tienen algunas características comunes, en particular el uso de figuras como factores de los significantes. Sin embargo, como lo hemos señalado al final, no todos se construyen ni articulan de la misma manera. Tal como las lenguas son muchas y los códigos lingüísticos se rigen por diferentes reglas -aunque sobre la base de fonemas unidos secuencialmente-, los códigos icónicos son también variados y regidos por reglas que complementan las ya señaladas. Para poder iniciar el análisis de un mensaje icónico, se debe por lo tanto identificar primero el tipo particular de código utilizado, del mismo modo que se ha de identificar un idioma antes de poder reconocer el sentido de las palabras en un mensaje verbal. Pero si es poco común pasar de un idioma a otro en el uso diario, es mucho más común pasar de un código icónico a otro. Por ello, es importante definir aquí primero los diversos códigos, para luego pasar a considerar los factores generales que juegan un papel en la interpretación.

  12. Dicty_cDB: FC-IC1404 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1404 (Link to dictyBase) - - - Contig-U08328-1 FC-IC14... (Link to library) Clone ID FC-IC1404 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U08328-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...in*h*hqll Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1453 (FC-IC1453Q) /CSM/FC-IC... 32.0 %: nuclear 8.0 %: mitochondrial 4.0 %: cytoskeletal 4.0 %: Golgi >> prediction for FC-IC140

  13. Dicty_cDB: FC-IC0538 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0538 (Link to dictyBase) - - - Contig-U16271-1 - (Link to Original site) FC-IC...(Link to library) Clone ID FC-IC0538 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig ...Contig-U16271-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...itfggcnrttcewfctfcewgatsfs*tt*f Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC....0 %: mitochondrial 4.0 %: peroxisomal >> prediction for FC-IC0538 is cyt 5' end seq. ID FC-IC0538F 5' end seq. >FC-IC

  14. Dicty_cDB: FC-IC1348 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1348 (Link to dictyBase) - - - Contig-U13052-1 FC-IC13... (Link to library) Clone ID FC-IC1348 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U13052-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...qvivhyqriihnqd Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1348 (FC-IC...les of secretory system >> prediction for FC-IC1348 is cyt 5' end seq. ID FC-IC

  15. Dicty_cDB: FC-IC1091 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1091 (Link to dictyBase) - - - Contig-U16382-1 - (Link to Original site) FC-IC...1091F 428 - - - - - - Show FC-IC1091 Library FC-IC (Link to library) Clone ID FC-IC1091 (Link to dic...skeletal 8.0 %: mitochondrial 4.0 %: vacuolar 4.0 %: endoplasmic reticulum >> prediction for FC-IC1091 is cyt 5' end seq. ID FC-IC...tyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U16382-1 Original site URL http://dic...tycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC1091Q.Seq.d/ Representative se

  16. Dicty_cDB: FC-IC0129 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0129 (Link to dictyBase) - - - Contig-U07963-1 FC-IC01...29F (Link to Original site) FC-IC0129F 160 - - - - - - Show FC-IC0129 Library FC-IC (Link to library) Clone ID FC-IC.../FC-IC0401Q.Seq.d/ 281 2e-75 own update 2004.12.25 Homology vs DNA Score E Sequences producing signific... 4.0 %: peroxisomal >> prediction for FC-IC0129 is nuc 5' end seq. ID FC-IC...0129 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U07963-1 Original site URL http://dic

  17. Dicty_cDB: FC-IC0911 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0911 (Link to dictyBase) - - - Contig-U15103-1 FC-IC09... (Link to library) Clone ID FC-IC0911 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link ...to Contig Contig-U15103-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...rwwifv**snfdciw*s*ksipk**n yntliw Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC... of secretory system >> prediction for FC-IC0911 is nuc 5' end seq. ID FC-IC0911F 5' end seq. >FC-IC0911F.Se

  18. Dicty_cDB: FC-IC0102 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0102 (Link to dictyBase) - - - Contig-U16527-1 FC-IC01...02F (Link to Original site) FC-IC0102F 434 - - - - - - Show FC-IC0102 Library FC-IC (Link to library) Clone ID FC-IC...dtxisxpllnm--- Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC0102 (FC-IC...: cytoskeletal 4.0 %: vacuolar 4.0 %: vesicles of secretory system >> prediction for FC-IC...0102 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U16527-1 Original site URL http://dic

  19. Dicty_cDB: FC-IC0854 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0854 (Link to dictyBase) - - - Contig-U16142-1 FC-IC08...ink to library) Clone ID FC-IC0854 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Co...ntig-U16142-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...nllkkkkkksvkyvfck**n Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC0854 (FC-IC... 36.0 %: nuclear 16.0 %: mitochondrial 4.0 %: cytoskeletal >> prediction for FC-IC0854 is cyt 5' end seq. ID FC-IC

  20. Dicty_cDB: FC-IC1202 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1202 (Link to dictyBase) - - - Contig-U16527-1 FC-IC12... (Link to library) Clone ID FC-IC1202 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16527-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...**cst*islpy*iw Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1760 (FC-IC...20.0 %: mitochondrial 4.0 %: cytoskeletal 4.0 %: peroxisomal >> prediction for FC-IC1202 is cyt 5' end seq. ID FC-IC

  1. Dicty_cDB: FC-IC1239 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1239 (Link to dictyBase) - - - Contig-U16527-1 FC-IC12... (Link to library) Clone ID FC-IC1239 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16527-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...qiyldilslrnhmk Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1760 (FC-IC...0 %: Golgi 4.0 %: cytoplasmic >> prediction for FC-IC1239 is end 5' end seq. ID FC-IC

  2. Dicty_cDB: FC-IC1688 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1688 (Link to dictyBase) - - - Contig-U16382-1 - (Link... to Original site) - - FC-IC1688Z 288 - - - - Show FC-IC1688 Library FC-IC (Link to library) Clone ID FC-IC1688 (Link to dic...IV Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1688 (FC-IC...:FC-AG0... 414 e-112 1 ( AU275195 ) Dictyostelium discoideum gamete cDNA clone:FC-IC1... 414 e-112 1 ( AU272515 ) Dic...tyostelium discoideum gamete cDNA clone:FC-IC1... 414 e-112 1 ( AU272386 ) Dic

  3. Dicty_cDB: FC-IC1122 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1122 (Link to dictyBase) - - - Contig-U16527-1 FC-IC11... (Link to library) Clone ID FC-IC1122 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16527-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...**cst*islpy*iw Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1760 (FC-IC...20.0 %: mitochondrial 4.0 %: cytoskeletal 4.0 %: peroxisomal >> prediction for FC-IC1122 is cyt 5' end seq. ID FC-IC

  4. Dicty_cDB: FC-IC1127 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1127 (Link to dictyBase) - - - Contig-U16527-1 FC-IC11... (Link to library) Clone ID FC-IC1127 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16527-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...**cst*islpy*iw Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1760 (FC-IC...20.0 %: mitochondrial 4.0 %: cytoskeletal 4.0 %: peroxisomal >> prediction for FC-IC1127 is cyt 5' end seq. ID FC-IC

  5. Dicty_cDB: FC-IC1173 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1173 (Link to dictyBase) - - - Contig-U16527-1 FC-IC11... (Link to library) Clone ID FC-IC1173 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16527-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...qiyldilslrnhmk Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1760 (FC-IC...0 %: Golgi 4.0 %: cytoplasmic >> prediction for FC-IC1173 is end 5' end seq. ID FC-IC

  6. Dicty_cDB: FC-IC0826 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0826 (Link to dictyBase) - - - Contig-U08366-1 FC-IC08... (Link to library) Clone ID FC-IC0826 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U08366-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...CFALIDLHLISGYWWWFDGAYFTVLEI Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC0826 (FC-IC...ne 12.0 %: mitochondrial 4.0 %: cytoskeletal 4.0 %: Golgi 4.0 %: cytoplasmic >> prediction for FC-IC0826 is end 5' end seq. ID FC-IC

  7. Dicty_cDB: FC-IC1048 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1048 (Link to dictyBase) - - - Contig-U07467-1 - (Link to Original site) FC-IC...1048F 172 - - - - - - Show FC-IC1048 Library FC-IC (Link to library) Clone ID FC-IC1048 (Link to dic...: cytoskeletal 4.0 %: plasma membrane 4.0 %: peroxisomal >> prediction for FC-IC1048 is mit 5' end seq. ID FC-IC...tyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U07467-1 Original site URL http://dic...tycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC1048Q.Seq.d/ Representative se

  8. Dicty_cDB: FC-IC1462 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1462 (Link to dictyBase) - G24314 DDB0202795 Contig-U08394-1 FC-IC... (Link to library) Clone ID FC-IC1462 (Link to dictyBase) Atlas ID - NBRP ID G24314 dic...fhiflvygkeilqq Homology vs CSM-cDNA Score E Sequences producing significant align...1462E (Link to Original site) FC-IC1462F 268 FC-IC1462Z 268 FC-IC1462P 516 FC-IC1462E 258 Show FC-IC1462 Library FC-IC...tyBase ID DDB0202795 Link to Contig Contig-U08394-1 Original site URL http://dic

  9. Dicty_cDB: FC-IC1198 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1198 (Link to dictyBase) - - - Contig-U16527-1 FC-IC11... (Link to library) Clone ID FC-IC1198 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16527-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...qiyldilslrnhmk Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1760 (FC-IC...0 %: Golgi 4.0 %: cytoplasmic >> prediction for FC-IC1198 is end 5' end seq. ID FC-IC

  10. Dicty_cDB: FC-IC1539 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1539 (Link to dictyBase) - - - Contig-U16278-1 - (Link to Original site) FC-IC...1539F 679 - - - - - - Show FC-IC1539 Library FC-IC (Link to library) Clone ID FC-IC1539 (Link to dic...skkk*nkknxxxf*stxkkkkkkvcplgxnxpkpnf--- Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC... >> prediction for FC-IC1539 is mit 5' end seq. ID FC-IC1539F 5' end seq. >FC-IC1539F.S...tyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U16278-1 Original site URL http://dic

  11. Dicty_cDB: FC-IC0874 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0874 (Link to dictyBase) - - - Contig-U16382-1 FC-IC08... (Link to library) Clone ID FC-IC0874 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16382-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...kpstpqpc Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC...cytoskeletal 4.0 %: peroxisomal >> prediction for FC-IC0874 is nuc 5' end seq. ID FC-IC0874F 5' end seq. >FC-IC

  12. Dicty_cDB: FC-IC0897 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0897 (Link to dictyBase) - - - Contig-U10119-1 FC-IC08... (Link to library) Clone ID FC-IC0897 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U10119-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...dklelkrtyiqd*irlpqypglrnyklskhfsw Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC...0 %: vacuolar 4.0 %: vesicles of secretory system >> prediction for FC-IC0897 is nuc 5' end seq. ID FC-IC0897F 5' end seq. >FC-IC

  13. A novel HIV vaccine adjuvanted by IC31 induces robust and persistent humoral and cellular immunity.

    Directory of Open Access Journals (Sweden)

    Laura Pattacini

    Full Text Available The HIV vaccine strategy that, to date, generated immune protection consisted of a prime-boost regimen using a canarypox vector and an HIV envelope protein with alum, as shown in the RV144 trial. Since the efficacy was weak, and previous HIV vaccine trials designed to generate antibody responses failed, we hypothesized that generation of T cell responses would result in improved protection. Thus, we tested the immunogenicity of a similar envelope-based vaccine using a mouse model, with two modifications: a clade C CN54gp140 HIV envelope protein was adjuvanted by the TLR9 agonist IC31®, and the viral vector was the vaccinia strain NYVAC-CN54 expressing HIV envelope gp120. The use of IC31® facilitated immunoglobulin isotype switching, leading to the production of Env-specific IgG2a, as compared to protein with alum alone. Boosting with NYVAC-CN54 resulted in the generation of more robust Th1 T cell responses. Moreover, gp140 prime with IC31® and alum followed by NYVAC-CN54 boost resulted in the formation and persistence of central and effector memory populations in the spleen and an effector memory population in the gut. Our data suggest that this regimen is promising and could improve the protection rate by eliciting strong and long-lasting humoral and cellular immune responses.

  14. X-ray and optical spectroscopy of the massive young open cluster IC1805

    CERN Document Server

    Rauw, Gregor

    2016-01-01

    Very young open clusters are ideal places to study the X-ray properties of a homogeneous population of early-type stars. In this respect, the IC1805 open cluster is very interesting as it hosts the O4If$^+$ star HD15570 thought to be in an evolutionary stage intermediate between a normal O-star and a Wolf-Rayet star. Such a star could provide a test for theoretical models aiming at explaining the empirical scaling relation between the X-ray and bolometric luminosities of O-type stars. We have observed IC1805 with XMM-Newton and further collected optical spectroscopy of some of the O-star members of the cluster. The optical spectra allow us to revisit the orbital solutions of BD+60$^{\\circ}$ 497 and HD15558, and provide the first evidence of binarity for BD+60$^{\\circ}$ 498. X-ray emission from colliding winds does not appear to play an important role among the O-stars of IC1805. Notably, the X-ray fluxes do not vary significantly between archival X-ray observations and our XMM-Newton pointing. The very fast r...

  15. ACUTE AND SUBACUTE TOXICITY STUDY ON SPERMATOGENIC SIDDHA DRUG ‘ISAPPUKOL CHOORANAM’ (IC

    Directory of Open Access Journals (Sweden)

    S. Thillaivanan*, K. Kanagavalli , P. Sathiyarajeswaran and P. Parthiban

    2013-11-01

    Full Text Available Herbal medicines have been broadly used in developed countries hence they are natural and comparatively safe. They contain plant materials as their pharmacologically active components. Infertility is one of the most extremely tragic all over the world. Despite recent advances in the treatment of male infertility, the problem has not been satisfactorily tackled. The male infertility is mainly due to an inadequate number of spermatozoa in the semen, the failure of the spermatozoa to move with sufficient vigor towards their goal. Aim of the study is to evaluate the acute and sub-acute toxicity of the spermatogenic siddha drug Isappukol Chooranam (IC (siddha drug.For acute studies, different doses of IC were administered orally to rats once daily for one week. Forsub-acute studies, different doses of IC were administered orally to rats once daily for 28 days in various doses at 50,100,200 mg/kg of body weight. Detailed hematological, biochemical, necropsy and Histopathological evaluation of organs was performed for all animals. Histopathological analysis revealed that Spleen, Testes, Pancreas, Lung, Liver, Brain, Heart, Stomach, Intestine, Bone, Ovary, and Kidney tissues of treated groups did not show any signs of toxicity. No impairment in hepatic, renal, haemopoietic functions were observed throughout the study. No mortality was observed up to 200 mg/kg of body weight in acute and sub-acute toxicity studies.

  16. Design and Implementation of IC Card System%IC卡考勤系统设计

    Institute of Scientific and Technical Information of China (English)

    朱高中

    2011-01-01

    IC卡考勤管理系统是基于IC卡对员工基本信息进行管理的,设计出了一种对人员考勤监控的系统.其中包括信息初始值设置部分、数码管显示电路、复位电路、接触式IC卡模块电路等.通过接触式IC卡模块对员工的基本信息进行写入与读出,并利用矩阵键盘对员工初始信息进行设置,根据不同的出勤情况在数码管上进行不同的显示.该设计具有操作简单、成本较低即可实现员工出勤的考勤情况,方便企业的管理等优点.经过测试,本系统可以显示员工的基本信息.%IC card attendance management system, based on the basic information of the staff in IC card to manage, is the design of a monitoring system on staff attendance, including setting part of information of the initial value, digital control circuit, reset circuit, contacfless IC card module circuit. Based on the basic information on the staff written and read in the contact IC card roodtile, and the information matrix keyboard to set the initial employees, depending on the attendance there will be a different display in the digital control. The design is simple, low cost, effective to the staff attendance and convenient to facilitate enterprise management. After testing, the system can display basic information about employees.

  17. Variability in P-Glycoprotein Inhibitory Potency (IC50) Using Various in Vitro Experimental Systems: Implications for Universal Digoxin Drug-Drug Interaction Risk Assessment Decision Criteria

    Science.gov (United States)

    Bentz, Joe; O’Connor, Michael P.; Bednarczyk, Dallas; Coleman, JoAnn; Lee, Caroline; Palm, Johan; Pak, Y. Anne; Perloff, Elke S.; Reyner, Eric; Balimane, Praveen; Brännström, Marie; Chu, Xiaoyan; Funk, Christoph; Guo, Ailan; Hanna, Imad; Herédi-Szabó, Krisztina; Hillgren, Kate; Li, Libin; Hollnack-Pusch, Evelyn; Jamei, Masoud; Lin, Xuena; Mason, Andrew K.; Neuhoff, Sibylle; Patel, Aarti; Podila, Lalitha; Plise, Emile; Rajaraman, Ganesh; Salphati, Laurent; Sands, Eric; Taub, Mitchell E.; Taur, Jan-Shiang; Weitz, Dietmar; Wortelboer, Heleen M.; Xia, Cindy Q.; Xiao, Guangqing; Yabut, Jocelyn; Yamagata, Tetsuo; Zhang, Lei

    2013-01-01

    A P-glycoprotein (P-gp) IC50 working group was established with 23 participating pharmaceutical and contract research laboratories and one academic institution to assess interlaboratory variability in P-gp IC50 determinations. Each laboratory followed its in-house protocol to determine in vitro IC50 values for 16 inhibitors using four different test systems: human colon adenocarcinoma cells (Caco-2; eleven laboratories), Madin-Darby canine kidney cells transfected with MDR1 cDNA (MDCKII-MDR1; six laboratories), and Lilly Laboratories Cells—Porcine Kidney Nr. 1 cells transfected with MDR1 cDNA (LLC-PK1-MDR1; four laboratories), and membrane vesicles containing human P-glycoprotein (P-gp; five laboratories). For cell models, various equations to calculate remaining transport activity (e.g., efflux ratio, unidirectional flux, net-secretory-flux) were also evaluated. The difference in IC50 values for each of the inhibitors across all test systems and equations ranged from a minimum of 20- and 24-fold between lowest and highest IC50 values for sertraline and isradipine, to a maximum of 407- and 796-fold for telmisartan and verapamil, respectively. For telmisartan and verapamil, variability was greatly influenced by data from one laboratory in each case. Excluding these two data sets brings the range in IC50 values for telmisartan and verapamil down to 69- and 159-fold. The efflux ratio-based equation generally resulted in severalfold lower IC50 values compared with unidirectional or net-secretory-flux equations. Statistical analysis indicated that variability in IC50 values was mainly due to interlaboratory variability, rather than an implicit systematic difference between test systems. Potential reasons for variability are discussed and the simplest, most robust experimental design for P-gp IC50 determination proposed. The impact of these findings on drug-drug interaction risk assessment is discussed in the companion article (Ellens et al., 2013) and recommendations

  18. Animal experiments with the microelectronics neural bridge IC.

    Science.gov (United States)

    Li, Wenyuan; Pei, Fei; Wang, Zhigong; Lü, Xiaoying

    2012-01-01

    The combination of the neural science and the microelectronics science offers a new way to restore the function of central nervous system. A neural regeneration module is used to be implanted into body to bridge the damaged nerve. A microelectronics neural bridge IC designed in CSMC 0.5□m CMOS process which can detect the neural signal and stimulate the nerve is presented. The neural regeneration module is composed of the microelectronics neural bridge IC and some discrete devices. An animal experiment has been done to check whether the neural signal can be transmitted with the chip normally or not. The animal experiment results suggest that the neural regeneration module can make the neural signal transmit normally.

  19. THE LATEST ERUPTION OF PLANETARY NEBULA IC 2165

    Directory of Open Access Journals (Sweden)

    J. Bohigas

    2013-01-01

    Full Text Available Open slit high dispersion spectroscopic observations of the inner region of planetary nebula (PN IC 2165 indicate that the object has a relatively uniform and high electron temperature, with its density being much larger close to the PN nucleus. Abundances imply that it is a non-type I PN. Calcium and iron have been heavily depleted into grains. The ionized mass is at least ∼0.05 M⊙ . A photoionization model (Cloudy, version 10.00 assuming an inverse square law for the density and abundances typical of a non-type I PN, produced a fair replica of the spectrum and of all electron density and temperature sensitive line ratios, but not of the global properties of this object. All evidence indicates that IC 2165 was produced by a metal poor 2 M⊙ A5 V star that took off some 2 × 109 yr ago.

  20. Physical IC debug ─ backside approach and nanoscale challenge

    Directory of Open Access Journals (Sweden)

    U. Kerst

    2008-05-01

    Full Text Available Physical analysis for IC functionality in submicron technologies requires access through chip backside. Based upon typical global backside preparation with 50–100 µm moderate silicon thickness remaining, a state of the art of the analysis techniques available for this purpose is presented and evaluated for functional analysis and layout pattern resolution potential. A circuit edit technique valid for nano technology ICs, is also presented that is based upon the formation of local trenches using the bottom of Shallow Trench Isolation (STI as endpoint for Focused Ion Beam (FIB milling. As a derivative from this process, a locally ultra thin silicon device can be processed, creating a back surface as work bench for breakthrough applications of nanoscale analysis techniques to a fully functional circuit through chip backside. Several applications demonstrate the power and potential of this new approach.

  1. MagIC: Fluid dynamics in a spherical shell simulator

    Science.gov (United States)

    Wicht, J.; Gastine, T.; Barik, A.; Putigny, B.; Yadav, R.; Duarte, L.; Dintrans, B.

    2017-09-01

    MagIC simulates fluid dynamics in a spherical shell. It solves for the Navier-Stokes equation including Coriolis force, optionally coupled with an induction equation for Magneto-Hydro Dynamics (MHD), a temperature (or entropy) equation and an equation for chemical composition under both the anelastic and the Boussinesq approximations. MagIC uses either Chebyshev polynomials or finite differences in the radial direction and spherical harmonic decomposition in the azimuthal and latitudinal directions. The time-stepping scheme relies on a semi-implicit Crank-Nicolson for the linear terms of the MHD equations and a Adams-Bashforth scheme for the non-linear terms and the Coriolis force.

  2. Model Checking with Multi-Threaded IC3 Portfolios

    Science.gov (United States)

    2015-01-15

    Model Checking with Multi-Threaded IC3 Portfolios Sagar Chaki and Derrick Karimi Software Engineering Institute, Carnegie Mellon University {chaki...different runs varies randomly depending on the thread interleaving. The use of a portfolio of solvers to maximize the likelihood of a quick solution is...investigated. Using the Extreme Value theorem, the runtime of each variant, as well as their portfolios is analysed statistically. A formula for the

  3. Sequential clustering of star formations in IC 1396

    Institute of Scientific and Technical Information of China (English)

    Ya-Fang Huang; Jin-Zeng Li

    2013-01-01

    We present a comprehensive study of the H Ⅱ region IC 1396 and its star forming activity,in which multi-wavelength data ranging from the optical to the nearand far-infrared were employed.The surface density distribution of all the 2MASS sources with a certain detection toward IC 1396 indicates the existence of a compact cluster spatially consistent with the position of the exciting source of the H Ⅱ region,HD 206267.The spatial distribution of the sources with excessive infrared emission,selected based on archived 2MASS data,reveals the existence of four sub-clusters in this region.One is associated with the open cluster Trumpler 37.The other three are found to be spatially coincident with the bright rims of the H Ⅱ region.All the sources with excessive emission in the near infrared are cross-identified with AKARI IRC data.An analysis of the spectral energy distributions (SEDs) of the resultant sample leads to the identification of eight CLASS I,15 CLASS Ⅱ and 15 CLASS Ⅲ sources in IC 1396.Optical identification of the sample sources with R magnitudes brighter than 17 mag corroborates the results from the SED analysis.Based on the spatial distribution of the infrared young stellar objects at different evolutionary stages,the surrounding sub-clusters located in the bright rims are believed to be younger than the central one.This is consistent with a scenario of sequential star formation in this region.Imaging data of a dark patch in IC 1396 by Herschel SPIRE,on the other hand,indicate the presence of two far-infrared cores in LDN 1111,which are likely to be a new generation of protostellar objects in formation.So we infer that the star formation process in this H Ⅱ region was not continuous but rather episodic.

  4. On the progenitor of the Type Ic supernova 2002ap

    NARCIS (Netherlands)

    Smartt, SJ; Ramirez-Ruiz, E; Gilmore, GF; Meikle, WPS; Ferguson, AMN; Knapen, JH

    2002-01-01

    This Letter presents wide-field optical and near-IR (UBVRIHalphaK') images of the galaxy M74 that were taken between 0.6 and 8.3 yr before the discovery of the Type Ic supernova 2002ap. We have located the position of the supernova on these images with an accuracy of 0."3. We find no sign of a proge

  5. Analog IC Design at the University of Twente

    OpenAIRE

    2007-01-01

    This article describes some recent research results from the IC Design group of the University of Twente, located in Enschede, The Netherlands. Our research focuses on analog CMOS circuit design with emphasis on high frequency and broadband circuits. With the trend of system integration in mind, we try to develop new circuit techniques that enable the next steps in system integration in nanometer CMOS technology. Our research funding comes from industry, as well as from governmental organizat...

  6. ICS and COPD: Time to clear the air

    OpenAIRE

    Russell, Richard

    2009-01-01

    Paul A Ford, Richard EK Russell, Peter J BarnesAirway Disease Section, National Heart and Lung Institute, Imperial College, London, UKThe debate about what constitutes the correct treatment for COPD has recently intensified. This discussion has grumbled on ever since the first multicenter trials using inhaled corticosteroids (ICS) in chronic obstructive pulmonary disease (COPD) such as the European Respiratory Society study on chronic obstructive pulmonary disease (EUROSCOP) and Inhaled Stero...

  7. The Spectral SN-GRB Connection: Systematic Spectral Comparisons between Type Ic Supernovae, broad-lined Type Ic Supernovae with and without Gamma-Ray Bursts

    CERN Document Server

    Modjaz, Maryam; Bianco, Federica B; Graur, Or

    2015-01-01

    We present the first systematic investigation of spectral properties of 17 Type Ic Supernovae (SNe Ic), 10 broad-lined SNe Ic (SNe Ic-bl) without observed Gamma-Ray Bursts (GRBs) and 10 SNe Ic-bl with GRBs (SN-GRBs) as a function of time in order to probe their explosion conditions and progenitors. We analyze a total of 396 spectra, which were drawn from published spectra of individual SNe as well as from the densely time-sampled spectra data of Modjaz et al. (2014). In order to quantify the diversity of the SN spectra as a function of SN subtype, we construct average spectra of SNe Ic, SNe Ic-bl without GRBs and SNe Ic-bl with GRBs, along with standard deviation and maximum deviation contours. We find that SN~1994I is not a typical SN Ic, in contrast to common belief, while the spectra of SN 1998bw/GRB 980425 are representative of mean spectra of SNe Ic-bl. We measure the ejecta absorption and width velocities (as traced by FeII 5169) and find that SNe Ic-bl with GRBs, on average, have quantifiably higher ab...

  8. Emergency EC-IC bypass for symptomatic atherosclerotic ischemic stroke.

    Science.gov (United States)

    Horiuchi, Tetsuyoshi; Nitta, Junpei; Ishizaka, Shigetoshi; Kanaya, Kohei; Yanagawa, Takao; Hongo, Kazuhiro

    2013-10-01

    Previous studies have shown that extracranial-intracranial (EC-IC) bypass surgery has no preventive effect on subsequent ipsilateral ischemic stroke in patients with symptomatic atherosclerotic internal carotid occlusion and hemodynamic cerebral ischemia. A few studies have assessed whether an urgent EC-IC bypass surgery is an effective treatment for main trunk stenosis or occlusion in acute stage. The authors retrospectively reviewed 58 consecutive patients who underwent urgent EC-IC bypass for symptomatic internal carotid artery or the middle cerebral artery stenosis or occlusion between January 2003 and December 2011. Clinical characteristics and neuroimagings were evaluated and analyzed. Based on preoperative angiogram, responsible lesions were the internal carotid artery in 19 (32.8%) patients and the middle cerebral artery in 39 (67.2%). No hemorrhagic complication occurred. Sixty-nine percent of patients showed improvement of neurological function after surgery, and 74.1% of patients had favorable outcome. Unfavorable outcome was associated with insufficient collateral flow and new infarction after bypass surgery.

  9. Calcium-regulated import of myosin IC into the nucleus.

    Science.gov (United States)

    Maly, Ivan V; Hofmann, Wilma A

    2016-06-01

    Myosin IC is a molecular motor involved in intracellular transport, cell motility, and transcription. Its mechanical properties are regulated by calcium via calmodulin binding, and its functions in the nucleus depend on import from the cytoplasm. The import has recently been shown to be mediated by the nuclear localization signal located within the calmodulin-binding domain. In the present paper, it is demonstrated that mutations in the calmodulin-binding sequence shift the intracellular distribution of myosin IC to the nucleus. The redistribution is displayed by isoform B, described originally as the "nuclear myosin," but is particularly pronounced with isoform C, the normally cytoplasmic isoform. Furthermore, experimental elevation of the intracellular calcium concentration induces a rapid import of myosin into the nucleus. The import is blocked by the importin β inhibitor importazole. These findings are consistent with a mechanism whereby calmodulin binding prevents recognition of the nuclear localization sequence by importin β, and the steric inhibition of import is released by cell signaling leading to the intracellular calcium elevation. The results establish a mechanistic connection between the calcium regulation of the motor function of myosin IC in the cytoplasm and the induction of its import into the nucleus. © 2016 Wiley Periodicals, Inc.

  10. CMOS IC design for wireless medical and health care

    CERN Document Server

    Wang, Zhihua; Chen, Hong

    2014-01-01

    This book provides readers with detailed explanation of the design principles of CMOS integrated circuits for wireless medical and health care, from the perspective of two successfully-commercialized applications. Design techniques for both the circuit block level and the system level are discussed, based on real design examples. CMOS IC design techniques for the entire signal chain of wireless medical and health care systems are covered, including biomedical signal acquisition, wireless transceivers, power management and SoC integration, with emphasis on ultra-low-power IC design techniques. • Discusses CMOS integrated circuit design for wireless medical and health care, based on two successfully-commercialized medical and health care applications; • Describes design techniques for the entire signal chain of wireless medical and health care systems; • Focuses on techniques for short-range wireless communication systems; • Emphasizes ultra-low-power IC design techniques; • Enables readers to tu...

  11. Far-Ultraviolet Dust Scattering and Extinction in IC 405

    Science.gov (United States)

    France, Kevin; Burgh, Eric B.; McCandliss, Stephan R.; Feldman, Paul D.

    We present results from a NASA/JHU sounding rocket mission (36.198 UG) during which we acquired a longslit (12" times 200") spectrum of the reflection nebula IC 405 in the 900 - 1400Å wavelength region. Several pointings within the nebula were obtained, including a high quality (S/N ≅10-15 at R = 300) spectrum of the central star, HD 34078. Observations of the nebula reveal a surface brightness to stellar flux ratio that rises by two orders of magnitude to the blue in our bandpass. This is in contrast with the relatively flat nebular dust scattering observed during a prior sounding rocket observation of the reflection nebula NGC 2023. Several possibilities have been suggested to explain the blue rise that is exhibited in IC 405. Differential extinction within the nebula, such as a particular clump of dust along the line of sight, is one possibility. Fluorescent molecular hydrogen, unresolved by the resolution of the rocket experiment, is another possible explanation. Models of nebular dust scattering, similar to those of Burgh et al. 2002, have been compared to the data and results will be discussed. We will explore the possibility of differential extinction with an observing program to measure Balmer line ratios within the nebula with the Dual Imaging Spectrograph at Apache Point Observatory. Additionally, IC 405 has been accepted as a Cycle 4 target of the Far Ultraviolet Spectroscopic Explorer to search for emissions from molecular hydrogen at higher sensitivity and spectral resolution.

  12. Dicty_cDB: FC-IC1065 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1065 (Link to dictyBase) - - - Contig-U16527-1 - (Link to Original site) FC-IC...1065F 303 - - - - - - Show FC-IC1065 Library FC-IC (Link to library) Clone ID FC-IC1065 (Link to dic...2.0 %: mitochondrial 4.0 %: cytoskeletal 4.0 %: Golgi 4.0 %: cytoplasmic >> prediction for FC-IC...tyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U16527-1 Original site URL http://dic...tycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC1065Q.Seq.d/ Representative se

  13. Dicty_cDB: FC-IC0747 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0747 (Link to dictyBase) - - - Contig-U16382-1 - (Link... to Original site) - - FC-IC0747Z 420 - - - - Show FC-IC0747 Library FC-IC (Link to library) Clone ID FC-IC0747 (Link to dic... 4.0 %: cytoskeletal 4.0 %: vacuolar 4.0 %: peroxisomal >> prediction for FC-IC0747 is cyt 5' end seq. ID - ...tyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U16382-1 Original site URL http://dic...tycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC0747Q.Seq.d/ Representative se

  14. Dicty_cDB: FC-IC1306 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1306 (Link to dictyBase) - - - Contig-U16527-1 FC-IC13... (Link to library) Clone ID FC-IC1306 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16527-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...qiyldilslrnhmk Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1760 (FC-IC...itochondrial 4.0 %: cytoskeletal 4.0 %: Golgi 4.0 %: cytoplasmic >> prediction for FC-IC

  15. Dicty_cDB: FC-IC1177 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1177 (Link to dictyBase) - - - Contig-U07878-1 FC-IC11...ink to library) Clone ID FC-IC1177 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Co...ntig-U07878-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...ikpleslklqlviqvgtmqi Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1177 (FC-IC....0 %: mitochondrial 16.0 %: nuclear 8.0 %: Golgi 4.0 %: plasma membrane 4.0 %: vesicles of secretory system >> prediction for FC-IC

  16. Dicty_cDB: FC-IC0229 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0229 (Link to dictyBase) - - - Contig-U16527-1 FC-IC02... (Link to library) Clone ID FC-IC0229 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16527-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...qiyldilslrnhmk Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1760 (FC-IC...itochondrial 4.0 %: cytoskeletal 4.0 %: Golgi 4.0 %: cytoplasmic >> prediction for FC-IC

  17. Dicty_cDB: FC-IC0224 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0224 (Link to dictyBase) - - - Contig-U07878-1 FC-IC02... (Link to library) Clone ID FC-IC0224 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U07878-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1408 (FC-IC...ial 8.0 %: Golgi 4.0 %: vesicles of secretory system 4.0 %: endoplasmic reticulum >> prediction for FC-IC

  18. Dicty_cDB: FC-IC0806 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0806 (Link to dictyBase) - - - Contig-U16382-1 FC-IC08... (Link to library) Clone ID FC-IC0806 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16382-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...epssisdsttgv*r Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC0806 (FC-IC...3b: 0.00 m_ : 1.00 44.0 %: cytoplasmic 36.0 %: nuclear 12.0 %: mitochondrial 8.0 %: cytoskeletal >> prediction for FC-IC

  19. Dicty_cDB: FC-IC0255 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0255 (Link to dictyBase) - - - Contig-U11160-1 FC-IC02... (Link to library) Clone ID FC-IC0255 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link ...to Contig Contig-U11160-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...APTTSSFKIRQSSSYLVTRLS AC Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC0255 (FC-IC...3b: 0.00 m_ : 1.00 40.0 %: cytoplasmic 32.0 %: nuclear 24.0 %: mitochondrial 4.0 %: cytoskeletal >> prediction for FC-IC

  20. Dicty_cDB: FC-IC0392 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0392 (Link to dictyBase) - - - Contig-U16527-1 FC-IC03... (Link to library) Clone ID FC-IC0392 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link ...to Contig Contig-U16527-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...lsqrlshaclsinsc Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC... 4.0 %: vacuolar 4.0 %: Golgi >> prediction for FC-IC0392 is mit 5' end seq. ID FC-IC

  1. Dicty_cDB: FC-IC0893 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0893 (Link to dictyBase) - - - Contig-U16527-1 FC-IC08... (Link to library) Clone ID FC-IC0893 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16527-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...rtxxvxlxxxxcxcaails Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC0893 (FC-IC...%: mitochondrial 8.0 %: cytoskeletal 4.0 %: Golgi 4.0 %: vesicles of secretory system >> prediction for FC-IC

  2. Dicty_cDB: FC-IC0959 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0959 (Link to dictyBase) - - - Contig-U16527-1 FC-IC09... (Link to library) Clone ID FC-IC0959 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U16527-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...qiyldilslrnhmk Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC1760 (FC-IC...ochondrial 4.0 %: cytoskeletal 4.0 %: Golgi 4.0 %: cytoplasmic >> prediction for FC-IC

  3. Dicty_cDB: FC-IC0639 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0639 (Link to dictyBase) - - - Contig-U11835-1 - (Link... to Original site) - - FC-IC0639Z 505 - - - - Show FC-IC0639 Library FC-IC (Link to library) Clone ID FC-IC0639 (Link to dic...m discoideum gamete cDNA clone:FC-IC0... 511 0.0 2 ( C90116 ) Dictyostelium disco...tyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U11835-1 Original site URL http://dic...tycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC0639Q.Seq.d/ Representative se

  4. Dicty_cDB: FC-IC0369 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0369 (Link to dictyBase) - - - Contig-U16271-1 - (Link to Original site) FC-IC...0369F 413 - - - - - - Show FC-IC0369 Library FC-IC (Link to library) Clone ID FC-IC0369 (Link to dic...k--- Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC...lular, including cell wall 4.0 %: cytoskeletal 4.0 %: vacuolar >> prediction for FC-IC0369 is cyt 5' end seq. ID FC-IC...tyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U16271-1 Original site URL http://dic

  5. Dicty_cDB: FC-IC0973 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0973 (Link to dictyBase) - - - Contig-U08327-1 - (Link... to Original site) - - FC-IC0973Z 180 - - - - Show FC-IC0973 Library FC-IC (Link to library) Clone ID FC-IC0973 (Link to dic...0 68.0 %: nuclear 24.0 %: cytoplasmic 8.0 %: mitochondrial >> prediction for FC-IC0973 is nuc 5' end seq. ID...tyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U08327-1 Original site URL http://dic...tycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC0973Q.Seq.d/ Representative se

  6. Dicty_cDB: FC-IC1312 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1312 (Link to dictyBase) - - - Contig-U10129-1 - (Link... to Original site) - - FC-IC1312Z 382 - - - - Show FC-IC1312 Library FC-IC (Link to library) Clone ID FC-IC1312 (Link to dic...tem 4.0 %: extracellular, including cell wall >> prediction for FC-IC1312 is end 5' end seq. ID - 5' end seq...tyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U10129-1 Original site URL http://dic...tycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC1312Q.Seq.d/ Representative se

  7. Dicty_cDB: FC-IC0579 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0579 (Link to dictyBase) - - - Contig-U16527-1 - (Link to Original site) FC-IC...0579F 179 - - - - - - Show FC-IC0579 Library FC-IC (Link to library) Clone ID FC-IC0579 (Link to dic...0 %: plasma membrane 4.0 %: vesicles of secretory system >> prediction for FC-IC0...tyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U16527-1 Original site URL http://dic...tycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC0579Q.Seq.d/ Representative se

  8. Improvement of the Molecular diagnosis of Cryptococcus neoformans using Internal Control (IC

    Directory of Open Access Journals (Sweden)

    Mohammad Hassan Shahhosseiny

    2014-08-01

    Full Text Available Background: Lacking of internal control in majority of the PCR realated searchesis one of the most important items yet. Using sensitive and specialized laboratory techniques such as PCR is necessary to cryptococosis diagnosis. Different methods to detect this pathogen exist. Generally, culturing based methods are time consuming and have low sensitivity and need enough experience and equipments to data analyzing. Further painting based methods have no sufficient sensitivity as well. As a result, molecular techniques such as PCR are more appropriate to diagnosis purposes, but different data gathered from non standard tests supposed to be one of the deficiencies of this powerful molecular technique. This aim of this study was to design and produce the plasmid amplification internal control (IAC to identify the restrictors in Cryptococcus neoformans PCR test and its future applications in the routine diagnostic laboratories. Materials and methods: In this study to produce internal control, first the special PCR primers based on Gene target 16SrRNA for optimized molecular detection and then sensitivity and character were identified. Then, the composite primers for IAC C. neoformans was designed, replicated and clonized as well. The replicated IAC C. neoformans was attached to pTZ57R and transformed and colonized in E.coli JM107. The minimum IC number of each PCR reaction was studied using dilution and PCR reaction spectrum with IC. Results: The size of C. neoformans diagnostic product with its special primers was 415 bp and IAC C. neoformans amplicon is 661 bp, which have desired deference in the size (246 bp. The minimum IC number was identified 1000 in each reaction. The min/max sensitivity of PCR test with IC for C. neoformans DNA was identified between 100 particle to 3 million yeasts. There was no unwanted product in the character test with different agents. Conclusion: In spite of high rate and exclusivity of PCR technique, one of the main

  9. Study of the distribution of the absorbed solar radiation on the performance of a CPC-type ICS water heater

    Energy Technology Data Exchange (ETDEWEB)

    Souliotis, M.; Tripanagnostopoulos, Y. [Physics Department, University of Patras, 26504 Patras (Greece)

    2008-05-15

    An Integrated Collector Storage (ICS) solar water heater was designed, constructed and studied with an emphasis on its optical and thermal performance. The ICS system consists of one cylindrical horizontal tank properly mounted in a stationary symmetrical Compound Parabolic Concentrating (CPC) reflector trough. The main objective was the design and the construction of a low cost solar system with improved thermal performance based on the exploitation of the non-uniform distribution of the absorbed solar radiation on the cylindrical storage tank surface. A ray-tracing model was developed to gauge the distribution of the incoming solar radiation on the absorber surface and the results were compared with those from a theoretical optical model based on the average number of reflections. The variation of the optical efficiency as function of the incident angle of the incoming solar radiation along with its dependence on the month during annual operation of ICS system is presented. The ICS device was experimentally tested outdoors during a whole year in order to correlate the observed temperature rise and stratification of the stored water with the non-uniform distribution of the absorbed solar radiation. The results show that the upper part of the tank surface collects the larger fraction of the total absorbed solar radiation for all incident angles throughout the year. This is found to have a significant effect on the overall thermal performance of the ICS unit. In addition, the presented results can be considered important for the design and the operation of ICS systems consisting of cylindrical tank and CPC reflectors. (author)

  10. Desain dan Implementasi Virtual Laboratory Materi Osilator Analog berbasis IC OP-AMP

    Directory of Open Access Journals (Sweden)

    SYIFAUL FUADA

    2016-08-01

    Full Text Available AbstraK Laboratorium virtual merupakan salah satu platform laboratorium modern yang dapat mendukung kegiatan praktikum yang berjalan secara tradisional (Hand-on Laboratory.Penelitian ini bertujuan untuk mendesain dan mengimplementasikan Virtual Laboratory pada materi pembangkit sinyal dengan subtopik: Wien Bridge sebagai osilator RC, Hartley dan Colpitts sebagai osilator LC dan Astable Multivibrator sebagai osilator relaksasi,yang dibangun berbasis IC Operational Amplifier (OP-AMP.Jenis penelitian ini merupakan R&Dyang terdiri dari enam tahapan, yaitu:konsep, desain, pengumpulan bahan, pembuatan, pengujian dan pendistribusian. Aplikasi perangkat lunak berbasis dekstop ini telah diuji secara fungsional dengan 6 (enam aspek parameter yakni:uji polaritas kapastor; uji wiring; uji mode frekuensi dan mode perioda pada alat ukur frequency generator; uji specific decission pada trainer kit osilator hartley dan colpitts; uji kesesuaian antara frekuensi ouput dari masing-masing osilator dengan perhitungan teorema dan hasil percobaan sesungguhnya; dan uji kualitas media. Hasil secara keseluruhan telah sesuai dengan ekspektasi didalam story board. Kata kunci:IC OP-AMP, Osilator analog, Laboratorium virtual     Abstract The Virtual Laboratory is as one of modern laboratory platform which able to supportthe hand-on worklab. The goal of this research are for designing and implementing a Virtual Laboratory of signal generator material with subtopics i.e. the Wien Bridge as an RC oscillator, the Hartley and Colpitts as LC oscillator and the astable multivibrator as relaxation oscillator which assembled based on Operational Amplifier Integrated Circuit (OP-AMP.This research is R&D type which consists of six stages, i.e. concept, design, materials collection, assembling, testing and distribution. This desktop-based software application has been functionally tested with six aspect of parameters such as: capacitor polarity testing; wiring testing; testing of

  11. First Stellar Abundances in the Dwarf Irregular Galaxy IC 1613

    Science.gov (United States)

    Tautvaišienė, Gražina; Geisler, Doug; Wallerstein, George; Borissova, Jura; Bizyaev, Dmitry; Pagel, Bernard E. J.; Charbonnel, Corinne; Smith, Verne

    2007-12-01

    Chemical abundances in three M supergiants in the Local Group dwarf irregular galaxy IC 1613 have been determined using high-resolution spectra obtained with the UVES spectrograph on the ESO 8.2 m Kueyen telescope. A detailed synthetic-spectrum analysis has been used to determine the atmospheric parameters and abundances of O, Na, Mg, Al, Si, Ca, Sc, Ti, Cr, Fe, Co, Ni, La, and Eu. We find the overall metallicity of the stars to be [Fe/H] = -0.67 ± 0.09 and the age 9-13 Myr, which is in excellent agreement with the present-day values in the age-metallicity relationship model of IC 1613 by Skillman et al. We have found that the three supergiants investigated have a mean [α/Fe] equal to about -0.1, which is lower than seen in Galactic stars at the same metallicity and is in agreement with the results obtained in other dwarf irregular galaxies. The oxygen abundances are in agreement with the upper values of the nebular oxygen determinations in IC 1613. The abundance ratios of s- and r-process elements to iron are enhanced relative to solar by about 0.3 dex. The abundance pattern of the elements studied is similar to that of the Small Magellanic Cloud, except for Co and Ni, which are underabundant in the SMC. The observed elemental abundances are generally in very good agreement with the recent chemical evolution model of Yuk and Lee. Based on observations collected with the Very Large Telescope and the 2.2 m Telescope of the European Southern Observatory within the Observing Programs 70.B-0361(A) and 072.D-0113(D).

  12. Integration of IC/EC systems in ITER

    Energy Technology Data Exchange (ETDEWEB)

    Gassmann, T., E-mail: Thibault.Gassmann@iter.org [ITER Organization, CS 90 046, 13067 St Paul Lez Durance Cedex (France); Beaumont, B. [ITER Organization, CS 90 046, 13067 St Paul Lez Durance Cedex (France); Baruah, U.K. [Institute for Plasma Research, Near Indira Bridge, Bhat, Gandhinagar 382428 (India); Bonicelli, T. [Fusion For Energy, C/ Josep Pla 2, Torres Diagonal Litoral-B3, E-08019 Barcelona (Spain); Chiocchio, S.; Cox, D.; Darbos, C.; Decamps, H. [ITER Organization, CS 90 046, 13067 St Paul Lez Durance Cedex (France); Denisov, G. [Institute of Applied Physics, Russian Academy of Sciences, 46 Ulyanov Street, Nizhny Novgorod, 603950 (Russian Federation); Henderson, M.; Kazarian, F.; Lamalle, P.U. [ITER Organization, CS 90 046, 13067 St Paul Lez Durance Cedex (France); Mukherjee, A. [Institute for Plasma Research, Near Indira Bridge, Bhat, Gandhinagar 382428 (India); Rasmussen, D. [Oak Ridge National Laboratory, 055 Commerce Park, PO Box 2008, Oak Ridge, TN 37831-6483 (United States); Saibene, G.; Sartori, R. [Fusion For Energy, C/ Josep Pla 2, Torres Diagonal Litoral-B3, E-08019 Barcelona (Spain); Sakamoto, K. [Japan Atomic Energy Agency, 801-1 Mukoyama, Naka-shi, Ibaraki 311-0193 (Japan); Tanga, A. [ITER Organization, CS 90 046, 13067 St Paul Lez Durance Cedex (France)

    2010-12-15

    The RF heating and current drive (H and CD) systems that are to be installed in ITER during the construction phase, are the electron cyclotron (EC) and ion cyclotron (IC) systems. They are complex assemblies of high voltage power supplies (HVPS), RF generators, transmission lines and antennas. Their design and integration are constrained by many interfaces, both internal, between the subsystems, and external, with the other ITER systems. In addition, some components must be compatible with a nuclear environment and are classified as Safety Important Component. This paper describes the processes implemented in ITER to ensure proper integration.

  13. Iterative categorization (IC): a systematic technique for analysing qualitative data.

    Science.gov (United States)

    Neale, Joanne

    2016-06-01

    The processes of analysing qualitative data, particularly the stage between coding and publication, are often vague and/or poorly explained within addiction science and research more broadly. A simple but rigorous and transparent technique for analysing qualitative textual data, developed within the field of addiction, is described. The technique, iterative categorization (IC), is suitable for use with inductive and deductive codes and can support a range of common analytical approaches, e.g. thematic analysis, Framework, constant comparison, analytical induction, content analysis, conversational analysis, discourse analysis, interpretative phenomenological analysis and narrative analysis. Once the data have been coded, the only software required is a standard word processing package. Worked examples are provided.

  14. ICS and COPD: Time to clear the air

    Directory of Open Access Journals (Sweden)

    Paul A Ford

    2009-07-01

    Full Text Available Paul A Ford, Richard EK Russell, Peter J BarnesAirway Disease Section, National Heart and Lung Institute, Imperial College, London, UKThe debate about what constitutes the correct treatment for COPD has recently intensified. This discussion has grumbled on ever since the first multicenter trials using inhaled corticosteroids (ICS in chronic obstructive pulmonary disease (COPD such as the European Respiratory Society study on chronic obstructive pulmonary disease (EUROSCOP and Inhaled Steroids in Obstructive Lung Disease (ISOLDE were published in the late 1990’s and the results of trials such as TORCH (TOwards a Revolution in COPD Health using combination products has only added to the confusion.

  15. On-demand IC351 (Cialis) enhances erectile function in patients with erectile dysfunction

    National Research Council Canada - National Science Library

    Padma-Nathan, H; McMurray, J G; Pullman, W E; Whitaker, J S; Saoud, J B; Ferguson, K M; Rosen, R C

    2001-01-01

    IC351 (Cialis) is a selective inhibitor of PDE5. The efficacy and safety of on-demand dosing of IC351 in men with erectile dysfunction was assessed in a multicenter, double-blind, placebo-controlled study...

  16. Dicty_cDB: FC-IC1055 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1055 (Link to dictyBase) - - - Contig-U16382-1 - (Link to Original site) FC-IC...1055F 170 - - - - - - Show FC-IC1055 Library FC-IC (Link to library) Clone ID FC-IC1055 (Link to dic... 12.0 %: cytoskeletal 8.0 %: mitochondrial 4.0 %: vesicles of secretory system >> predic...tyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U16382-1 Original site URL http://dic...tycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC1055Q.Seq.d/ Representative se

  17. Dicty_cDB: FC-IC1562 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1562 (Link to dictyBase) - - - Contig-U07878-1 FC-IC15... (Link to library) Clone ID FC-IC1562 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U07878-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...gvsvtv*s Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC... 12.0 %: mitochondrial 8.0 %: Golgi 4.0 %: vesicles of secretory system 4.0 %: endoplasmic reticulum >> prediction for FC-IC

  18. Dicty_cDB: FC-IC0568 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0568 (Link to dictyBase) - - - Contig-U16079-1 - (Link to Original site) FC-IC...0568F 756 - - - - - - Show FC-IC0568 Library FC-IC (Link to library) Clone ID FC-IC0568 (Link to dic...viv*ffftfecdwr*n*initnt cidfisv--- Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC... 32.0 %: nuclear 8.0 %: cytoskeletal 8.0 %: mitochondrial 4.0 %: endoplasmic reticulum >> prediction for FC-IC...tyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U16079-1 Original site URL http://dic

  19. IC3328 a "dwarf elliptical galaxy" with spiral structure

    CERN Document Server

    Jerjen, H; Binggeli, B; Jerjen, Helmut; Kalnajs, Agris; Binggeli, Bruno

    2000-01-01

    We present the 2-D photometric decomposition of the Virgo galaxy IC3328. The analysis of the global light distribution of this morphologically classified nucleated dwarf elliptical galaxy (dE1,N) reveals a tightly wound, bi-symmetric spiral structure with a diameter of 4.5 kpc, precisely centered on the nucleus of the dwarf. The amplitude of the spiral is only three percent of the dwarf's surface brightness making it the faintest and smallest spiral ever found in a galaxy. In terms of pitch angle and arm winding the spiral is similar to the intermediate-type galaxy M51, but it lacks the dust and prominent HII regions which signal the presence of gas. The visual evidence of a spiral pattern in an early-type dwarf galaxy reopens the question on whether these dwarfs are genuine rotationally supported or anisotropic stellar systems. In the case of IC3328, we argue for a nearly face-on disk (dS0) galaxy with an estimated maximum rotation velocity of v_c,max = 55kms-1. The faintness of the spiral and the small moti...

  20. Finite Element Analysis of Connecting Rod of IC Engine

    Directory of Open Access Journals (Sweden)

    Samal Prasanta Kumar

    2015-01-01

    Full Text Available A connecting rod of IC engine is subjected to complex dynamic loading conditions. Therefore it is a critical machine element which attracts researchers’ attention. This paper aims at development of simple 3D model, finite element analyses and the optimization by intuition of the connecting rod for robust design. In this study the detailed load analysis under in-service loading conditions was performed for a typical connecting rod. The CAD model was prepared taking the detailed dimensions from a standard machine drawing text book. Based on the gas pressure variation in the cylinder of an IC engine, the piston forces were calculated for critical positions. MATLAB codes were written for this calculation. Altair Hypermesh and Hyperview were used for pre-processing and post-processing of the model respectively. The finite element analyses were performed using Altair Radioss. The results obtained were compared to a case study for the field failure of the connecting rod. By comparing the induced stress result with the yield strength of the material, the component was redesigned. This was done to save some mass keeping in mind that the induced stress value should be well below the yield strength of the material. The optimized connecting rod is 11.3% lighter than the original design.

  1. Observation of the Supernova Remnant IC 443 with VERITAS

    CERN Document Server

    Humensky, T B

    2007-01-01

    Shell-type supernova remnants (SNRs) accelerate particles at the shock front between the expanding remnant and the swept-up interstellar medium. If these particles include protons and nuclei, very-high-energy gamma-ray emission may result from the decay of pions produced in interactions between cosmic rays and the local insterstellar medium. For SNRs that are interacting with a nearby molecular cloud, such as IC 443, the enhanced matter density provides a target medium that can amplify the gamma-ray emission. IC 443 also contains the pulsar wind nebula (PWN) CXOU J061705.3+222127. PWNe are the most plentiful galactic sources of very-high-energy gamma rays, which are produced in the shock formed at the collision of the pulsar wind with the ambient medium. VERITAS is an array of four 12-m telescopes dedicated to gamma-ray astronomy in the energy band above 100 GeV. Located on Mt. Hopkins in southern Arizona, VERITAS operated during the 2006-2007 season in 2-, 3-, and 4-telescope observation modes. In this talk,...

  2. Application of concept selection methodology in IC process design

    Science.gov (United States)

    Kim, Myung-Kul

    1993-01-01

    Search for an effective methodology practical in IC manufacturing process development led to trial of quantitative 'concept selection' methodology in selecting the 'best' alternative for interlevel dielectric (ILD) processes. A cross-functional team selected multi-criteria with scoring guidelines to be used in the definition of the 'best'. The project was targeted for the 3 level metal backend process for sub-micron gate array product. The outcome of the project showed that the maturity of the alternatives has strong influence on the scores, because scores on the adopted criteria such as yield, reliability and maturity will depend on the maturity of a particular process. At the same time, the project took longer than expected since it required data for the multiple criteria. These observations suggest that adopting a simpler procedure that can analyze total inherent controllability of a process would be more effective. The methodology of the DFS (design for simplicity) tools used in analyzing the manufacturability of such electronics products as computers, phones and other consumer electronics products could be used as an 'analogy' in constructing an evaluation method for IC processes that produce devices used in those electronics products. This could be done by focusing on the basic process operation elements rather than the layers that are being built.

  3. Spectral Line Survey toward a Molecular Cloud in IC10

    CERN Document Server

    Nishimura, Yuri; Watanabe, Yoshimasa; Sakai, Nami; Aikawa, Yuri; Kawamura, Akiko; Yamamoto, Satoshi

    2016-01-01

    We have conducted a spectral line survey observation in the 3 mm band toward the low-metallicity dwarf galaxy IC10 with the 45 m radio telescope of Nobeyama Radio Observatory to explore its chemical composition at a molecular-cloud scale (~80 pc). The CS, SO, CCH, HCN, HCO+, and HNC lines are detected for the first time in this galaxy in addition to the CO and 13CO lines, while c-C3H2, CH3OH, CN, C18O, and N2H+ lines are not detected. The spectral intensity pattern is found to be similar to those observed toward molecular clouds in the Large Magellanic Cloud, whose metallicity is as low as IC10. Nitrogen-bearing species are deficient in comparison with the Galactic molecular clouds due to a lower elemental abundance of nitrogen. CCH is abundant in comparison with Galactic translucent clouds, whereas CH3OH may be deficient. These characteristic trends for CCH and CH3OH are also seen in the LMC, and seem to originate from photodissociation regions more extended in peripheries of molecular clouds due to the lowe...

  4. A blister-test apparatus for studies on the adhesion of materials used for neural electrodes.

    Science.gov (United States)

    Ordonez, Juan; Boehler, Christian; Schuettler, Martin; Stieglitz, Thomas

    2011-01-01

    A blister test apparatus has been developed, which allows a quantitative adhesion analysis of thin-film metallizations on polymers manufactured in cleanroom conditions suitable for micromachining of neural electrode arrays. The device is capable of pressurizing metallic membranes at wafer level, monitoring the pressure and the height of the developing blister while detecting the moment of delamination, allowing the calculation of the adhesion energy between metal film and polymer. The machine is designed for quantitative long-term studies of materials used in neural microelectrode arrays.

  5. Det særlige etniske perspektiv rundt om ICS-trekanten

    DEFF Research Database (Denmark)

    Koldsø, Birgit Raundahl

    Integrated Children´s System (ICS) er en generel socialfaglig systematik eller metode i sagsbehandlingsprocessen omkring udsatte børn, unge og deres familier. Forskningsprojektet ”ICS - i et minoritetsetnisk perspektiv” har undersøgt myndighedsrådgivernes arbejde med den børnefaglige ICS-undersøg...

  6. PREFACE: 2nd International Conference on Competitive Materials and Technological Processes (IC-CMTP2)

    Science.gov (United States)

    László, Gömze A.

    2013-12-01

    Competitiveness is one of the most important factors in our life and it plays a key role in the efficiency both of organizations and societies. The more scientifically supported and prepared organizations develop more competitive materials with better physical, chemical and biological properties and the leading companies apply more competitive equipment and technology processes. The aims of the 2nd International Conference on Competitive Materials and Technology Processes (ic-cmtp2) are the following: Promote new methods and results of scientific research in the fields of material, biological, environmental and technology sciences; Change information between the theoretical and applied sciences as well as technical and technological implantations. Promote the communication between the scientist of different nations, countries and continents. Among the major fields of interest are materials with extreme physical, chemical, biological, medical, thermal, mechanical properties and dynamic strength; including their crystalline and nano-structures, phase transformations as well as methods of their technological processes, tests and measurements. Multidisciplinary applications of materials science and technological problems encountered in sectors like ceramics, glasses, thin films, aerospace, automotive and marine industry, electronics, energy, construction materials, medicine, biosciences and environmental sciences are of particular interest. In accordance to the program of the conference ic-cmtp2, more than 250 inquiries and registrations from different organizations were received. Researchers from 36 countries in Asia, Europe, Africa, North and South America arrived at the venue of conference. Including co-authors, the research work of more than 500 scientists are presented in this volume. Professor Dr Gömze A László Chair, ic-cmtp2 The PDF also contains lists of the boards, session chairs and sponsors.

  7. ic-cmtp3: 3rd International Conference on Competitive Materials and Technology Processes

    Science.gov (United States)

    2016-04-01

    Competitiveness is one of the most important factors in our lives and it plays a key role in the efficiency both of organizations and societies. The more scientifically advanced and prepared organizations develop more competitive materials with better physical, chemical, and biological properties, and the leading companies apply more competitive equipment and technological processes. The aims of the 3rd International Conference on Competitive Materials and Technology Processes (ic-cmtp3), and the 1st International Symposium on Innovative Carbons and Carbon Based Materials (is-icbm1) and the 1st International Symposium on Innovative Construction Materials (is-icm1) organized alongside are the following: —Promote new methods and results of scientific research in the fields of material, biological, environmental and technological sciences; —Exchange information between the theoretical and applied sciences as well as technical and technological implementations; —Promote communication and collaboration between the scientists, researchers and engineers of different nations, countries and continents. Among the major fields of interest are advanced and innovative materials with competitive characteristics, including mechanical, physical, chemical, biological, medical and thermal, properties and extreme dynamic strength. Their crystalline, nano - and micro-structures, phase transformations as well as details of their technological processes, tests and measurements are also in the focus of the ic-cmtp3 conference and the is-scbm1 and is-icm1 symposia. Multidisciplinary applications of material science and the technological problems encountered in sectors like ceramics, glasses, thin films, aerospace, automotive and marine industries, electronics, energy, construction materials, medicine, biosciences and environmental sciences are of particular interest. In accordance with the program of the ic-cmtp3 conference and is-icbm1 and is-icm1 symposia we have received more

  8. Stable Electrical Operation of 6H-SiC JFETs and ICs for Thousands of Hours at 500 C

    Science.gov (United States)

    Neudeck, Philip G.; Spry, David J.; Chen, Liang-Yu; Beheim, Glenn M.; Okojie, Robert S.; Chang, Carl W.; Meredith, Roger D.; Ferrier, Terry L.; Evans, Laura J.; Krasowski, Michael J.; Prokop, Norman F.

    2008-01-01

    The fabrication and testing of the first semiconductor transistors and small-scale integrated circuits (ICs) to achieve up to 3000 h of stable electrical operation at 500 C in air ambient is reported. These devices are based on an epitaxial 6H-SiC junction field-effect transistor process that successfully integrated high temperature ohmic contacts, dielectric passivation, and ceramic packaging. Important device and circuit parameters exhibited less than 10% of change over the course of the 500 C operational testing. These results establish a new technology foundation for realizing durable 500 C ICs for combustion-engine sensing and control, deep-well drilling, and other harsh-environment applications.

  9. Iterative categorization (IC): a systematic technique for analysing qualitative data

    Science.gov (United States)

    2016-01-01

    Abstract The processes of analysing qualitative data, particularly the stage between coding and publication, are often vague and/or poorly explained within addiction science and research more broadly. A simple but rigorous and transparent technique for analysing qualitative textual data, developed within the field of addiction, is described. The technique, iterative categorization (IC), is suitable for use with inductive and deductive codes and can support a range of common analytical approaches, e.g. thematic analysis, Framework, constant comparison, analytical induction, content analysis, conversational analysis, discourse analysis, interpretative phenomenological analysis and narrative analysis. Once the data have been coded, the only software required is a standard word processing package. Worked examples are provided. PMID:26806155

  10. Resenya del blog IC-Investigación Cualitativa

    Directory of Open Access Journals (Sweden)

    Gemma Flores-Pons

    2010-07-01

    Full Text Available El blog IC-Investigación Cualitativa és una eina interessant per a les persones que realitzem recerca social, ja que ofereix un recull parcial dels recursos, sobre metodologia qualitativa, disponibles a la xarxa i els exposa organitzats temàticament. Així, hi podem trobar articles, capítols, llibres, pàgines d'autora, vincles a revistes, grups de recerca, congressos, programes informàtics o altres portals web. No es tracta d'una centralització de materials, sinó de l'enxarxament de diferents recursos ja existents, ja que es mantenen els links a les pàgines on es localitzen. Això permet una doble tasca, difondre els propis materials i visibilitzar les fonts i recursos que els han fet disponibles.

  11. The Implementation of a Vulnerability Topology Analysis Method for ICS

    Directory of Open Access Journals (Sweden)

    Yang Yi Lin

    2016-01-01

    Full Text Available Nowadays Industrial Control System (ICS is becoming more and more important in significant fields. However, the using of the general facilities in these systems makes lots of security issues exposed. Because there are a number of differences between the original IT systems and ICSs. At the same time, the traditional vulnerability scan technology lacks the ability to recognize the interactions between vulnerabilities in the network. ICSs are always in a high risk state. So, this paper focuses on the vertex polymerization of the topological vulnerability analysis. We realized a topological analysis method oriented ICSs on the basis of achievements at home and abroad. The result shows that this method can solve the problem of the complex fragility correlation among industrial control networks.

  12. Energetic Utilisation of Pyrolysis Gases in IC Engine

    Directory of Open Access Journals (Sweden)

    Viktória Barbara Kovács

    2009-12-01

    Full Text Available The use of alternative energy sources like pyrolysis gases as a source ofrenewable energy for combined heat and power generation could provide an effective andalternative way to fulfil remarkable part of the increasing energy demand of the humanpopulation as a possible solution of decentralized power generation. Therefore the role ofutilization of pyrolysis gases rapidly grows in Europe and all around the world. Theenergetic utilization of these low heating value renewable gaseous fuels is not fully workedout yet because their combustion characteristics significantly differ from natural gas, andthis way they are not usable or their utilization is limited in devices with conventionalbuild-up. At the Department of Energy Engineering of BME the IC Engine utilization ofpyrolysis gases was investigated. The power, efficiency, consumption and exhaust emissionwere measured and indication was made to determine the pressure and heat release in thecylinder at different engine parameters.

  13. Diffuse Atomic and Molecular Gas near IC443

    CERN Document Server

    Hirschauer, A; Wallerstein, George; Means, T

    2009-01-01

    We present an analysis of results on absorption from Ca II, Ca I, K I, and the molecules CH+, CH, C2, and CN that probes gas interacting with the supernova remnant IC443. The eleven directions sample material across the visible nebula and beyond its eastern edge. Most of the neutral material, including the diatomic molecules, is associated with the ambient cloud detected via H I and CO emission. Analysis of excitation and chemistry yields gas densities that are typical of diffuse molecular gas. The low density gas probed by Ca II extends over a large range in velocities, from -120 to +80 km/s in the most extreme cases. This gas is distributed among several velocity components, unlike the situation for the shocked molecular clumps, whose emission occurs over much the same range but as very broad features. The extent of the high-velocity absorption suggests a shock velocity of 100 km/s for the expanding nebula.

  14. Fully Integrated Biopotential Acquisition Analog Front-End IC

    Directory of Open Access Journals (Sweden)

    Haryong Song

    2015-09-01

    Full Text Available A biopotential acquisition analog front-end (AFE integrated circuit (IC is presented. The biopotential AFE includes a capacitively coupled chopper instrumentation amplifier (CCIA to achieve low input referred noise (IRN and to block unwanted DC potential signals. A DC servo loop (DSL is designed to minimize the offset voltage in the chopper amplifier and low frequency respiration artifacts. An AC coupled ripple rejection loop (RRL is employed to reduce ripple due to chopper stabilization. A capacitive impedance boosting loop (CIBL is designed to enhance the input impedance and common mode rejection ratio (CMRR without additional power consumption, even under an external electrode mismatch. The AFE IC consists of two-stage CCIA that include three compensation loops (DSL, RRL, and CIBL at each CCIA stage. The biopotential AFE is fabricated using a 0.18 μm one polysilicon and six metal layers (1P6M complementary metal oxide semiconductor (CMOS process. The core chip size of the AFE without input/output (I/O pads is 10.5 mm2. A fourth-order band-pass filter (BPF with a pass-band in the band-width from 1 Hz to 100 Hz was integrated to attenuate unwanted signal and noise. The overall gain and band-width are reconfigurable by using programmable capacitors. The IRN is measured to be 0.94 μVRMS in the pass band. The maximum amplifying gain of the pass-band was measured as 71.9 dB. The CIBL enhances the CMRR from 57.9 dB to 67 dB at 60 Hz under electrode mismatch conditions.

  15. An Infrared Search for Young Stellar Objects in IC 1396

    Science.gov (United States)

    Johnson, Chelen H.; Linahan, Marcella; Gibbs, John; Rebull, Luisa M.; Archibald, Andrew R.; Dickmann, Samantha Rose; Hart, Erica A.; Hedlund, Audrey R.; Hilfer, Shannon L.; Lacher, Thomas; McKernan, John T.; Medeiros, Emma M.; Nelson, Samantha Brooks; O'Leary, Harrison; Peña, Nicholas D.; Peterson, Alexis; Reader, Livia K.; Ropinski, Brandi Lucia; Scarpa, Gabriella; Sundeen, Kiera A.; Takara, Amber L.; Thiel, Theresa

    2017-01-01

    About 700 parsecs away from Earth, IC1396 lies along the galactic plane, in the direction of the constellation Cepheus, and includes many dark nebulae, including the Elephant’s Trunk Nebula. IC 1396A has been examined with a variety of telescopes, including Spitzer, 2MASS, IPHAS, Chandra, and WISE. The YSOVAR project (Rebull et al. 2014) also has Spitzer monitoring data in this region at 3.6 and 4.5 microns. Our team has merged these catalogs and identified candidate YSOs using IR color selection, X-ray detection, and variability metrics. In order to interpret the YSOVAR light curves, it is critical to understand which of the 700+ YSO candidates in this region are likely YSOs, and which are foreground/background stars or are extragalactic objects. As a first attempt to confirm these candidate YSOs, we have created spectral energy distributions (SEDs) for wavelengths from IPHAS r band to 24 microns, which we use, coupled with image inspection, to confirm (or refute) YSO candidates from this list of identified YSO candidates. We will then compare our vetted list of YSO candidates to the lists of YSO candidates already identified in the literature in this region. The goal of this study is to identify candidate YSO sources, as well as support the greater understanding of the variety, evolution and variability of young stars. This project is a collaborative effort of high school students from three states. They analyzed data individually and later collaborated online to compare results. This project is the result of many years of work with the NASA/IPAC Teacher Archive Research Program (NITARP).

  16. A revolutionary concept to improve the efficiency of IC antennas

    Energy Technology Data Exchange (ETDEWEB)

    Milanesio, D.; Maggiora, R. [Politecnico di Torino, Dipartimento di Elettronica e Telecomunicazioni (DET), Torino (Italy)

    2014-02-12

    The successful design of an Ion Cyclotron (IC) antenna mainly relies on the capability of coupling high power to the plasma (MW), feature that is currently reached by allowing rather high voltages (tens of kV) on the unavoidable unmatched part of the feeding lines. This requirement is often responsible of arcs along the transmission lines and other unwanted phenomena that considerably limit the usage of IC launchers. In this work, we suggest and describe a revolutionary approach based on high impedance surfaces, which allows to increase the antenna radiation efficiency and, hence, to highly reduce the imposed voltages to couple the same level of power to the plasma. High-impedance surfaces are periodic metallic structures (patches) displaced usually on top of a dielectric substrate and grounded by means of vertical posts usually embedded inside a dielectric, in a mushroom-like shape. In terms of working properties, high impedance surfaces are electrically thin in-phase reflectors, i.e. they present a high impedance, within a given frequency band, such that the image currents are in-phase with the currents of the antenna itself, thus determining a significant efficiency increase. While the usual design of a high impedance surface requires the presence of a dielectric layer, some alternative solutions can be realized in vacuum, taking advantage of double layers ofmetallic patches. After an introductory part on the properties of high impedance surfaces, this work documents both their design by means of numerical codes and their implementation on a scaled mock-up.

  17. Fully Integrated Biopotential Acquisition Analog Front-End IC.

    Science.gov (United States)

    Song, Haryong; Park, Yunjong; Kim, Hyungseup; Ko, Hyoungho

    2015-09-30

    A biopotential acquisition analog front-end (AFE) integrated circuit (IC) is presented. The biopotential AFE includes a capacitively coupled chopper instrumentation amplifier (CCIA) to achieve low input referred noise (IRN) and to block unwanted DC potential signals. A DC servo loop (DSL) is designed to minimize the offset voltage in the chopper amplifier and low frequency respiration artifacts. An AC coupled ripple rejection loop (RRL) is employed to reduce ripple due to chopper stabilization. A capacitive impedance boosting loop (CIBL) is designed to enhance the input impedance and common mode rejection ratio (CMRR) without additional power consumption, even under an external electrode mismatch. The AFE IC consists of two-stage CCIA that include three compensation loops (DSL, RRL, and CIBL) at each CCIA stage. The biopotential AFE is fabricated using a 0.18 μm one polysilicon and six metal layers (1P6M) complementary metal oxide semiconductor (CMOS) process. The core chip size of the AFE without input/output (I/O) pads is 10.5 mm². A fourth-order band-pass filter (BPF) with a pass-band in the band-width from 1 Hz to 100 Hz was integrated to attenuate unwanted signal and noise. The overall gain and band-width are reconfigurable by using programmable capacitors. The IRN is measured to be 0.94 μVRMS in the pass band. The maximum amplifying gain of the pass-band was measured as 71.9 dB. The CIBL enhances the CMRR from 57.9 dB to 67 dB at 60 Hz under electrode mismatch conditions.

  18. A revolutionary concept to improve the efficiency of IC antennas

    Science.gov (United States)

    Milanesio, D.; Maggiora, R.

    2014-02-01

    The successful design of an Ion Cyclotron (IC) antenna mainly relies on the capability of coupling high power to the plasma (MW), feature that is currently reached by allowing rather high voltages (tens of kV) on the unavoidable unmatched part of the feeding lines. This requirement is often responsible of arcs along the transmission lines and other unwanted phenomena that considerably limit the usage of IC launchers. In this work, we suggest and describe a revolutionary approach based on high impedance surfaces, which allows to increase the antenna radiation efficiency and, hence, to highly reduce the imposed voltages to couple the same level of power to the plasma. High-impedance surfaces are periodic metallic structures (patches) displaced usually on top of a dielectric substrate and grounded by means of vertical posts usually embedded inside a dielectric, in a mushroom-like shape. In terms of working properties, high impedance surfaces are electrically thin in-phase reflectors, i.e. they present a high impedance, within a given frequency band, such that the image currents are in-phase with the currents of the antenna itself, thus determining a significant efficiency increase. While the usual design of a high impedance surface requires the presence of a dielectric layer, some alternative solutions can be realized in vacuum, taking advantage of double layers ofmetallic patches. After an introductory part on the properties of high impedance surfaces, this work documents both their design by means of numerical codes and their implementation on a scaled mock-up.

  19. Antipurinergic therapy corrects the autism-like features in the poly(IC mouse model.

    Directory of Open Access Journals (Sweden)

    Robert K Naviaux

    Full Text Available BACKGROUND: Autism spectrum disorders (ASDs are caused by both genetic and environmental factors. Mitochondria act to connect genes and environment by regulating gene-encoded metabolic networks according to changes in the chemistry of the cell and its environment. Mitochondrial ATP and other metabolites are mitokines-signaling molecules made in mitochondria-that undergo regulated release from cells to communicate cellular health and danger to neighboring cells via purinergic signaling. The role of purinergic signaling has not yet been explored in autism spectrum disorders. OBJECTIVES AND METHODS: We used the maternal immune activation (MIA mouse model of gestational poly(IC exposure and treatment with the non-selective purinergic antagonist suramin to test the role of purinergic signaling in C57BL/6J mice. RESULTS: We found that antipurinergic therapy (APT corrected 16 multisystem abnormalities that defined the ASD-like phenotype in this model. These included correction of the core social deficits and sensorimotor coordination abnormalities, prevention of cerebellar Purkinje cell loss, correction of the ultrastructural synaptic dysmorphology, and correction of the hypothermia, metabolic, mitochondrial, P2Y2 and P2X7 purinergic receptor expression, and ERK1/2 and CAMKII signal transduction abnormalities. CONCLUSIONS: Hyperpurinergia is a fundamental and treatable feature of the multisystem abnormalities in the poly(IC mouse model of autism spectrum disorders. Antipurinergic therapy provides a new tool for refining current concepts of pathogenesis in autism and related spectrum disorders, and represents a fresh path forward for new drug development.

  20. Modelling of an ICS solar water heater using artificial neural networks and TRNSYS

    Energy Technology Data Exchange (ETDEWEB)

    Souliotis, M.; Tripanagnostopoulos, Y. [Physics Department, University of Patras, Patras 26504, ACHAIA (Greece); Kalogirou, S. [Department of Mechanical Engineering and Materials Science and Engineering, Cyprus University of Technology, P.O. Box 50329, Limassol 3603 (Cyprus)

    2009-05-15

    A study, in which a suitable artificial neural network (ANN) and TRNSYS are combined in order to predict the performance of an Integrated Collector Storage (ICS) prototype, is presented. Experimental data that have been collected from outdoor tests of an ICS solar water heater with cylindrical water storage tank inside a CPC reflector trough were used to train the ANN. The ANN is then used through the Excel interface (Type 62) in TRNSYS to model the annual performance of the system by running the model with the values of a typical meteorological year for Athens, Greece. In this way the specific capabilities of both approaches are combined, i.e., use of the radiation processing and modelling power of TRNSYS together with the 'black box' modelling approach of ANNs. The details of the calculation steps of both methods that aim to perform an accurate prediction of the system performance are presented and it is shown that this new method can be used effectively for such predictions. (author)

  1. SVX4: A New Deep-Submicron Readout IC for the Tevatron Collider at Fermilab

    Energy Technology Data Exchange (ETDEWEB)

    Krieger, B.; Alfonsi, S.; Bacchetta, N.; Centro, S.; Christofek, L.; Garcia-Sciveres, M.; Haber, C.; Hanagaki, K.; Hoff, J.; Johnson, M.; vonderLippe, H.; Lujan, P.; Mandelli, E.; Meng, G.; Nomerotski, A.; Pellet, D.; Rapidis, P.; Utes, M.; Walder, J.-P.; Weber, M.; Wester, W.; /LBL, Berkeley /Padua U. /INFN, Padua /Kansas U. /Fermilab /UC,

    2003-10-01

    SVX4 is the new silicon strip readout IC designed to meet the increased radiation tolerance requirements for Run IIb at the Tevatron collider. Devices have been fabricated, tested, and approved for production. The SVX4 design is a technology migration of the SVX3D design currently in use by CDF. Whereas SVX3D was fabricated in a 0.8 {micro}m radiation-hard process, SVX4 was fabricated in a standard 0.25 {micro}m mixed-signal CMOS technology using the ''radiation tolerant by design'' transistor topologies devised by the RD-49 collaboration. The specific cell layouts include digital cells developed by the ATLAS Pixel group, and full-custom analog blocks. Unlike its predecessors, the new design also includes the necessary features required for generic use by both the CDF and D0 experiments at Fermilab. Performance of the IC includes >20 MRad total dose tolerance, and {approx}2000 e-rms equivalent input noise charge with 40 pF input capacitance, when sampled at 132 ns period with an 80 ns preamp risetime. At the nominal digitize/readout rate of 106/53 MHz, the 9 mm x 6.3 mm die dissipates {approx}2 mW/channel average at 2.5 V. A review of typical operation, details of the design conversion process, and performance measurements are covered.

  2. Comparison of automatically generated reaction mechanism for oxidation of simple hydrocarbons in IC engine

    Directory of Open Access Journals (Sweden)

    Muhammad Mansha

    2011-10-01

    Full Text Available In this work, a detailed kinetic reaction mechanism, consisting of 208 reactions and 79 species, has been developed todescribe the oxidation of simple hydrocarbon fuel (natural gas in IC engine. The performance of the proposed mechanismis tested using simulation, tool CHEMKIN 4.1.1, and experimental measurements. The simulation results of the proposedreaction scheme were compared with those of reference mechanisms (GRI v3.0 and Konnov 0.5 version as well as experimentaldata. Based upon simulation results, it can be concluded that the proposed mechanism shows good concordanceswith GR I3.0 mechanism especially in the prediction of temperature, pressure, and major product species (H2O, CO2 profilesat stoichiometric conditions (= 1.0. Although, there are some discrepancies among each predicted profile, the proposeddetailed mechanism is good to describe the oxidation of natural gas in IC engine. The experimental data also showed favorableresults for prediction of major product species (CO2, H2O & CO at various engine operating speeds in idle mode.

  3. SVX4 a new deep submicron readout IC for the Tevatron Collider at Fermilab

    CERN Document Server

    Krieger, B; Bacchetta, N; Centro, Sandro; Christofek, L; García-Sciveres, M; Haber, C; Hanagaki, K; Hoff, J; Johnson, M; Von der Lippe, H; Mandelli, E; Meng, G; Nomerotski, A; Pellet, D; Rapidis, P; Utes, M; Walder, J P; Weber, M; Wester, W; Wilkes, T; Yarema, R J; Yao, W; Zimmerman, T

    2004-01-01

    SVX4 is the new silicon strip readout IC designed to meet the increased radiation tolerance requirements for Run IIb at the Tevatron collider. Devices have been fabricated, tested, and approved for production. The SVX4 design is a technology migration of the SVX3D design currently in use by CDF. Whereas SVX3D was fabricated in a 0.8 mu m radiation-hard process, SVX4 was fabricated in a standard 0.25 mu m mixed-signal CMOS technology using the "radiation tolerant by design" transistor topologies devised by the RD-49 collaboration. The specific cell layouts include digital cells developed by the ATLAS Pixel group, and full-custom analog blocks. Unlike its predecessors, the new design also includes the necessary features required for generic use by both the CDF and DO experiments at Fermilab. Performance of the IC includes >20 Mrad total dose tolerance, and ~2000 e- rms equivalent input noise charge with 40 pF input capacitance, when sampled at 132 ns period with an 80 ns preamp risetime. At the nominal digitize...

  4. Nanoliter homogenous ultra-high throughput screening microarray for lead discoveries and IC50 profiling.

    Science.gov (United States)

    Ma, Haiching; Horiuchi, Kurumi Y; Wang, Yuan; Kucharewicz, Stefan A; Diamond, Scott L

    2005-04-01

    Microfluidic technologies offer the potential for highly productive and low-cost ultra-high throughput screening and high throughput selectivity profiling. Such technologies need to provide the flexibility of plate-based assays as well as be less expensive to operate. Presented here is a unique microarray system (the Reaction Biology [Malvern, PA] DiscoveryDot), which runs over 6,000 homogeneous reactions per 1" x 3" microarray using chemical libraries or compound dilutions printed in 1-nl volumes. A simple and rapid piezo-activation method delivers from 30 to 300 pl of biochemical targets and detector chemistries to each reaction. The fluorescent signals are detected and analyzed with conventional microarray scanners and software. The DiscoveryDot platform is highly customizable, and reduces consumption of targets and reaction chemistries by >40-fold and the consumption of compounds by >10,000-fold, compared to 384-well plate assay. We demonstrate here that the DiscoveryDot platform is compatible with conventional large-volume well-based reactions, with a Z' factor of >0.6 for many enzymes, such as the caspase family enzymes, matrix metalloproteinase, serine proteases, kinases, and histone deacetylases. The platform is well equipped for 50% inhibitory concentration (IC50) profiling studies of enzyme inhibitors, with up to 10 dilution conditions of each test compound printed in duplicate, and each microarray chip can generate over 300 IC50 measurements against a given target.

  5. In vitro assays for cobblestone area-forming cells, LTC-IC, and CFU-C.

    Science.gov (United States)

    van Os, Ronald P; Dethmers-Ausema, Bertien; de Haan, Gerald

    2008-01-01

    Various assays exist that measure the function of hematopoietic stemcells (HSCs). In this chapter, in vitro assays are described that measure the frequency of progenitors (colony-forming unit in culture; CFU-C), stem cells (long-term culture-initiating cell; LTC-IC), or both (cobblestone area-forming cell assay; CAFC). These assays measure the potential of a test cell population retrospectively, i.e., at the time its activity is evident when the stem cell itself is often not detectable anymore. Although the in vitro LTC-IC and CAFC assays have been shown to correlate with in vivo activity, in vivo transplantation assays, where it can be shown that cells possess the ability to indefinitely repopulate all blood lineages, are the ultimate proof for HSC activity. Nevertheless, these in vitro assays provide an excellent method to screen for stem cell activity of a putative stem cell population or for screening the effect of a certain treatment on HSCs.

  6. Dicty_cDB: FC-IC1643 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC1643 (Link to dictyBase) - - - Contig-U10099-1 FC-IC16... (Link to library) Clone ID FC-IC1643 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link t...o Contig Contig-U10099-1 Original site URL http://dictycdb.biol.tsukuba.ac.jp/CSM/FC-IC/FC-IC...e. 50 0.011 1 CF589304 |CF589304.1 AGENCOURT_15703765 NICHD_XGC_Swb1N Silurana tropic... 32.0 %: mitochondrial 24.0 %: cytoplasmic 4.0 %: cytoskeletal 4.0 %: peroxisomal >> prediction for FC-IC164

  7. A New Estimation Model of IC Interconnect Lifetime Based on Uniform Defect Distribution Model

    Institute of Scientific and Technical Information of China (English)

    ZHAOTianxu; DUANXuchao; HAOYue; MAPeijun

    2004-01-01

    Defect, which exists throughout IC manufacturing process, is one of the important factors affecting IC interconnection lifetime. In this paper, a new failure model of IC interconnection is proposed based on analysis of the awdlable lifetime estimation models of IC interconnect lifetime. Many factors, such as the sizes of the defect, wire width, wire length and so on, are considered in this new model. The simulation results show that defect has a great influence on IC's interconnect lifetime, and the larger the defect size, the greater the influence. The new model can be used in an IC design to estimate electromigration loss related to the IC missing material defect and to some other factors.

  8. Terpenes increase the lipid dynamics in the Leishmania plasma membrane at concentrations similar to their IC50 values.

    Directory of Open Access Journals (Sweden)

    Heverton Silva Camargos

    Full Text Available Although many terpenes have shown antitumor, antibacterial, antifungal, and antiparasitic activity, the mechanism of action is not well established. Electron paramagnetic resonance (EPR spectroscopy of the spin-labeled 5-doxyl stearic acid revealed remarkable fluidity increases in the plasma membrane of terpene-treated Leishmania amazonensis promastigotes. For an antiproliferative activity assay using 5×10(6 parasites/mL, the sesquiterpene nerolidol and the monoterpenes (+-limonene, α-terpineol and 1,8-cineole inhibited the growth of the parasites with IC50 values of 0.008, 0.549, 0.678 and 4.697 mM, respectively. The IC50 values of these terpenes increased as the parasite concentration used in the cytotoxicity assay increased, and this behavior was examined using a theoretical treatment of the experimental data. Cytotoxicity tests with the same parasite concentration as in the EPR experiments revealed a correlation between the IC50 values of the terpenes and the concentrations at which they altered the membrane fluidity. In addition, the terpenes induced small amounts of cell lysis (4-9% at their respective IC50 values. For assays with high cell concentrations (2×10(9 parasites/mL, the incorporation of terpene into the cell membrane was very fast, and the IC50 values observed for 24 h and 5 min-incubation periods were not significantly different. Taken together, these results suggest that terpene cytotoxicity is associated with the attack on the plasma membrane of the parasite. The in vitro cytotoxicity of nerolidol was similar to that of miltefosine, and nerolidol has high hydrophobicity; thus, nerolidol might be used in drug delivery systems, such as lipid nanoparticles to treat leishmaniasis.

  9. Terpenes increase the lipid dynamics in the Leishmania plasma membrane at concentrations similar to their IC50 values.

    Science.gov (United States)

    Camargos, Heverton Silva; Moreira, Rodrigo Alves; Mendanha, Sebastião Antonio; Fernandes, Kelly Souza; Dorta, Miriam Leandro; Alonso, Antonio

    2014-01-01

    Although many terpenes have shown antitumor, antibacterial, antifungal, and antiparasitic activity, the mechanism of action is not well established. Electron paramagnetic resonance (EPR) spectroscopy of the spin-labeled 5-doxyl stearic acid revealed remarkable fluidity increases in the plasma membrane of terpene-treated Leishmania amazonensis promastigotes. For an antiproliferative activity assay using 5×10(6) parasites/mL, the sesquiterpene nerolidol and the monoterpenes (+)-limonene, α-terpineol and 1,8-cineole inhibited the growth of the parasites with IC50 values of 0.008, 0.549, 0.678 and 4.697 mM, respectively. The IC50 values of these terpenes increased as the parasite concentration used in the cytotoxicity assay increased, and this behavior was examined using a theoretical treatment of the experimental data. Cytotoxicity tests with the same parasite concentration as in the EPR experiments revealed a correlation between the IC50 values of the terpenes and the concentrations at which they altered the membrane fluidity. In addition, the terpenes induced small amounts of cell lysis (4-9%) at their respective IC50 values. For assays with high cell concentrations (2×10(9) parasites/mL), the incorporation of terpene into the cell membrane was very fast, and the IC50 values observed for 24 h and 5 min-incubation periods were not significantly different. Taken together, these results suggest that terpene cytotoxicity is associated with the attack on the plasma membrane of the parasite. The in vitro cytotoxicity of nerolidol was similar to that of miltefosine, and nerolidol has high hydrophobicity; thus, nerolidol might be used in drug delivery systems, such as lipid nanoparticles to treat leishmaniasis.

  10. Test

    DEFF Research Database (Denmark)

    Bendixen, Carsten

    2014-01-01

    Bidrag med en kortfattet, introducerende, perspektiverende og begrebsafklarende fremstilling af begrebet test i det pædagogiske univers.......Bidrag med en kortfattet, introducerende, perspektiverende og begrebsafklarende fremstilling af begrebet test i det pædagogiske univers....

  11. Clinical Utility of Fractional exhaled Nitric Oxide (FeNO) as a Biomarker to Predict Severity of Disease and Response to Inhaled Corticosteroid (ICS) in Asthma Patients.

    Science.gov (United States)

    Neelamegan, Revathy; Saka, Vinodkumar; Tamilarasu, Kadhiravan; Rajaram, Manju; Selvarajan, Sandhiya; Chandrasekaran, Adithan

    2016-12-01

    Bronchial asthma is a common chronic inflammatory airway disease diagnosed and is based on symptomatic history and Pulmonary Function Tests (PFT). Fractional exhaled Nitric Oxide (FeNO) is exclusively a non-invasive biomarker of on-going eosinophilic airway inflammation which remains unpredictable only with PFTs. FeNO measurement is recommended in predicting asthma severity and Inhaled Corticosteroid (ICS) response but further research is required to understand its clinical utility and agreement with current recommendations in a specific population. To estimate FeNO levels in Tamilian patients with mild-to-moderate persistent asthma and to correlate with disease severity and ICS response. The study was a prospective cohort with a single group of 102 persistent asthma patients under standard ICS regimen for 8 weeks (follow-up period). PFT and FeNO were measured using portable spirometry and chemiluminescence based exhaled breath analyser, at baseline and during follow-up visits. Based on PFT and FeNO parameters, the study population was sub-grouped with respect to asthma severity (as mild, moderate and moderately severe), FeNO cut-off (> or ppb) and ICS response classification (good vs poor ICS responders). Significant decrease in mean FeNO levels were found in mild, moderate and moderately severe asthmatic groups following ICS treatment (90.15±27.36, 75.74±31.98 and 77.18±32.79 ppb) compared to similar baseline FeNO levels (103.03±34.08, 91.38±37.60 and 97.90±43.84 ppb) in all the above groups. Similarly, significant decrease in mean FeNO levels was found - FeNO>50ppb, good and poor ICS responders groups, in post- ICS treatment (89.63±24.04, 77.90±31.12 and 86.49±32.57 ppb) compared to baseline levels (110.183±1.23, 97.12±42.04 and 99.68±34.71 ppb). The observed baseline FeNO values in all groups as stated above did not show significant difference to differentiate asthma severity or ICS responders groups. The present study results do not support the

  12. The 5-HT3 receptor antagonists ICS 205-930 and GR38032F, putative anxiolytic drugs, differ from diazepam in their pharmacological profile.

    Science.gov (United States)

    Papp, M; Przegalinski, E

    1989-01-01

    The pharmacological profile of the two 5-HT(3) (5-hydroxytryptamine) receptor antagonists, the putative anxiolytics ICS 205-930 and GR38032F was compared with that of diazepam in four standard behavioural tests in rats. All the investigated drugs induced an anxiolytic effect in the passive avoidance test, having reduced the latency to re-enter the chamber previously associated with an inescapable footshock, and increased the time spent in that chamber. On the basis of the lowest effective dose, both ICS 205-930 and GR38032F were about 20 times more potent than diazepam, though the anxiolytic activity of either 5- HT(3) receptor antagonist was confined to a narrow dose range (ICS 205-930: 93.7-187.5 μg/ kg, GR38032F: 125-375 μg/kg), their higher doses having been ineffective. The anxiolytic effect of diazepam, but not of ICS 205-930, was abolished by flumazenil. In contrast to diazepam, neither ICS 205-930 nor GR38032F-both given in doses up to 20 mg/kg-showed any activity in the pentylenetetrazol-induced seizures, open field, and rota-rod tests. These results suggest that the 5-HT(3) receptor antagonists may represent a new class of anxiolytic drugs devoid of anticonvulsant, sedative or muscle-relaxant properties, and that their anxi olytic activity is not mediated by benzodiazepine receptors.

  13. Photoelasticity analysis of thermal stresses in the plastic ICs. Hikari danseiho ni yoru IC package nai oryoku no keisoku

    Energy Technology Data Exchange (ETDEWEB)

    Hasegawa, T.; Shibuya, Y. (Mitsubishi Electric Corp., Tokyo (Japan))

    1992-10-20

    Recent highly integrated semiconductors have tendencies of being finer patterns and larger silicon chip area. Plastic packages excellent in productivity have been proved to be highly reliable in moisture resistance due to improved sealing resin and have become the main part of IC packages. However, in such devices featuring larger chip area and finer circuit pattern as large capacity memories, the problem of internal stress due to sealing resin contraction has been highlighted as a new problem. In this study, a photoelasticity which is a relatively simple method is employed to evaluate stress within sealing resin, and the review on effects of stress on the interior of sealing resin and chip are reported. Further, the effect of a buffer coat formed on the chip to reduce the stress on a silicon chip, and the effect of package shape on the thermal stress has been examined by means of photoelasticity, and the result is also shown. 10 refs., 18 figs., 2 tabs.

  14. 双向应力状态下IC10高温合金的屈服行为研究%Measurement and Analysis of Yield Locus of Superalloy IC10 Under Biaxial Tension

    Institute of Scientific and Technical Information of China (English)

    陈雷; 温卫东; 崔海涛

    2012-01-01

    为了研究Ni3Al基金属间化合物IC10高温合金的屈服行为,对其进行了不同加载路径下的双向拉伸试验.试验采用十字形双向拉伸试验件在Zwick/Roell Z010双向拉伸试验机上进行,得到的最大等效应变为0.02.试验加载方向与材料塑性各向异性主轴重合,采用位移控制方法让两个夹头的加载速率比保持不变,得到不同线性加载路径下的应力-应变曲线.根据单位体积塑性功相等原理获得了IC10合金在双向拉伸应力状态下的屈服轨迹,并与目前常用的几种正交各向异性屈服准则及von Mises屈服准则预测结果进行了对比.结果表明,IC10合金的试验屈服轨迹呈外凸性,以双向等拉线为界的上下部分屈服轨迹不对称,显示出明显的塑性各向异性.各向同性von Mises屈服准则只包含一个材料常数,无法描述IC10合金的塑性各向异性行为;Hill二次式屈服准则在双向等拉应力状态附近低估了材料的屈服强度;Logan&Hosford屈服准则在从双向等拉到横向单拉的应力状态下都低估了材料的屈服强度,与试验结果相差较大.Banabic-Balan屈服准则和Barlat (1989)屈服准则的预测值与试验结果吻合很好,能很好地描述IC10合金在双向应力状态下的屈服行为.%Biaxial tensile tests of directionally solidified superalloy IC10 are carried out using cruciform specimens. The specimens are deformed under linear loading path on a Zwick/Roell 2010 biaxial tensile testing machine. The maximum equivalent strain attained is 0.02. The loading directions remain coaxial with the plastic orthotropy throughout every experiment. Contours of plastic work in the biaxial stress space are successfully determined and compared with the yield loci calculated from several existing yield criteria. It is found that the yield locus of superalloy IC10 is asymmetric about the balanced biaxial tension line, which indicates strong plastic anisotropy of the material

  15. A 9 MHz-2.4 GHz Fully Integrated Transceiver IC for a Microfluidic-CMOS Platform Dedicated to Miniaturized Dielectric Spectroscopy.

    Science.gov (United States)

    Bakhshiani, Mehran; Suster, Michael A; Mohseni, Pedram

    2015-12-01

    This paper presents a fully integrated transceiver IC as part of a self-sustained, microfluidic-CMOS platform for miniaturized dielectric spectroscopy (DS) from MHz to GHz. Fabricated in AMS 0.35 μm 2P/4M RF CMOS, the transmitter (TX) part of the IC generates a single-tone sinusoidal signal with frequency tunability in the range of ~ 9 MHz-2.4 GHz to excite a three-dimensional (3D), parallel-plate, capacitive sensor with a floating electrode and 9 μL microfluidic channel for sample delivery. With a material-under-test (MUT) loaded into the sensor, the receiver (RX) part of the IC employs broadband frequency response analysis (bFRA) methodology to measure the amplitude and phase of the RF excitation signal after transmission through the sensor. A one-time, 6-point sensor calibration algorithm then extracts both the real and imaginary parts of the MUT complex permittivity, ϵr, from IC measurements of the sensor transmission characteristics in the voltage domain. The "sensor + IC" is fully capable of differentiating among de-ionized (DI) water, phosphate-buffered saline (PBS), and alcoholic beverages in tests conducted at four excitation frequencies of ∼ 50 MHz , 500 MHz, 1.5 GHz, and 2.4 GHz generated by the TX. Moreover, permittivity readings of PBS by the sensor interfaced with the IC at six excitation frequencies in the range of ~ 50 MHz-2.4 GHz are in excellent agreement (rms error of 1.7% (real) and 7.2% (imaginary)) with those from bulk-solution reference measurements by commercial benchtop equipment. The total power consumption of the IC is with 1.5 V (analog) and 3.3 V (digital) supplies.

  16. IMMEDIATE CONSTITUENT ANALYSIS (IC analysis DİREKT BİLEŞENLER ANALİZİ

    Directory of Open Access Journals (Sweden)

    Muzaffer MALKOÇ

    2011-06-01

    Full Text Available IC analysis is a method of sentence analysis first explicitly introduced by American linguist Leonard Bloomfield in his book, Language, in 1933, though the underlying principle is common both to the traditional practice of parsing and to many modern systems of grammatical analysis. In IC analysis, a sentence is divided up into major divisions or immediate constituents, and these constituents are in turn divided into further immediate constituents. This process continues until irreducible constituents are reached, i.e., until each constituent consists of only a word or meaningful part of a word. The important tests used to analyze the sentences are deletion, permutation, transformation, and substitution tests.The end result of an IC analysis is often presented in a visual diagrammatic form that reveals the hierarchical immediate constituent structure of a sentence Direkt bileşenler analiz metodu Amerikalı dil bilimci Leonard Bloomfield tarafından 1933 yılında sentaks alanında başlatılmış, daha sonraki yıllarda fonetik ve morfoloji alanlarında da uygulanmıştır. Bu analiz metodunun amacı tümce veya kelime gruplarının parçalanması ve tasnif edilmesi işleminden ibarettir. Tümcelerin parçalanması en küçük dil birimine kadar kademe kademe yapılmalı ve bileşenlerin sınıflandırılmasında ise ana öbeğe veya ana gövdeye daha yakın olan unsurlar ile ikincil öğeler analizin amacına uygun olarak belirtilmelidir. Bu işlemler yapılırken Yok Etme Testi, Yer Değiştirme Testi, Dönüştürme Testi, Yerine Koyma Testi gibi metotlardan faydalanılır. Bu prensipler çerçevesinde yapılan analizin sonuçları hiyerarşik yapıları göstermek için bir grafikle özetlenir

  17. Effect of Fuel Types on Combustion Characteristics and Performance of a Four Stroke IC Engine

    Directory of Open Access Journals (Sweden)

    Mrs. Rana Ali Hussein,

    2014-04-01

    Full Text Available In this study, the effect of Gasoline, Ethanol, Gasohol E10, and Kerosene on the performance and combustion characteristics of a spark ignition (SI engine were investigated. In the experiment, the internal combustion (IC engine includes one cylinder, two valves, and four stroke spark ignition. Performance tests were carried out for specific fuel consumption, brake specific fuel consumption, power developed, corrosion rate, and carbon dioxide (CO2 and carbon monoxide (CO emissions. The measurements were conducted under various engine speeds ranging from 1500 to 4500 rpm. The experimental results showed that the performance of engine was improved with the use of gasoline and gasohol E10 in comparison with the Ethanol and Kerosene. The concentrations of CO2 and CO were presented and compared for all type of fuel examined.

  18. Quantitative Stellar Spectral Classification. IV. Application to the Open Cluster IC 2391

    CERN Document Server

    García, J; Velásquez, R

    2008-01-01

    In this work we perform the first test of a stellar spectral classification method (Stock & Stock 1999) by applying it to early type stars. The sample of stars are the members of the open cluster IC 2391 that have high-resolution spectra available in the UVES Project of Paranal Observatory. We show that, in general, absolute magnitudes $M_V$ and intrinsic colors $(B-V)_0$ can be recovered within the uncertainties stated in the original calibration ($\\sim 0.4$ for the magnitudes and $\\sim 0.03$ for the colors). This accuracy allows us to estimate distances and to infer membership of individual stars to obtain an average distance to the cluster of $156\\pm 24$ pc, which is in good agreement with previous reported determinations. Finally, we identify and discuss the real strengths and limitations of this method and we suggest how it can be improved for future studies.

  19. Nano silica removal from IC wastewater by pre-coagulation and microfiltration.

    Science.gov (United States)

    Huang, C; Jiang, W; Chen, C

    2004-01-01

    Microfiltration (MF) coupled with pretreatment by coagulation was adopted in the treatment of chemical mechanical polishing (CMP) wastewater from IC manufacturing plants, containing high concentrations of silica. Poly-aluminium chloride (PACl) was the coagulant, while the cationic polyacrylamide (PAA) was the flocculant aid. Preliminary tests were performed with the raw CMP wastewater in order to determine the optimal coagulation condition for subsequent microfiltration. Analysis of the particle size distribution shows that nearly all silica particles were enlarged from nano scale to at least 4 microm in diameter after the pre-treatment. The pre-treated wastewater was then filtered through a polytetrafluoroethylene (PTFE) membrane with a pore size 0.5 microm at a constant vacuum pressure. Trace amounts of PAA in addition to the PACl coagulation can effectively increases the permeate flux.

  20. Josephson address control unit IC for a 4-bit microcomputer prototype

    Energy Technology Data Exchange (ETDEWEB)

    Kosaka, S.; Nakagawa, H.; Kawamura, H.; Okada, Y.; Hamazaki, Y.; Aoyagi, M.; Kurosawa, I.; Shoji, A.; Takada, S.

    1989-03-01

    This paper describes a design and operations of a Josephson address control unit IC (CTRU) used for controlling the instruction sequence of an experimental 4-bit Josephson microcomputer prototype system. The CTRU is composed of three sets of 7 to 10-bit wide registers and combinational logic circuits driven by a two-phase mono-polar power supply. 593 4-Junction-Logic (4JL) gates have been used in the circuit and fabricated by using 2.5um NbN/oxide/NbN junction technology with Mo resistors and SiO/sub 2/ insulations. Experimental operations of the circuit have been successfully tested for all the instructions which control the program sequence of the computer system.

  1. A new look at the integrated radio/microwave continuum spectrum of Galactic supernova remnant IC443

    CERN Document Server

    Onic, D; Leahy, D

    2016-01-01

    Recent observations of the microwave sky, by the space telescopes such as WMAP and Planck, have opened a new window into the analysis of continuum emission from supernova remnants (SNRs). In this paper, different emission models that can explain the characteristic shape of presently known integrated radio/microwave continuum spectrum of the Galactic SNR IC 443 are tested and discussed. In particular, the possibility that the slight bump in the integrated continuum of this remnant around 20 -- 70~GHz is genuine and that can be explained by the contribution of additional emission mechanism such as of spinning dust is emphasized. We find that adding a spinning dust component to the emission model improves the fit of the integrated spectrum of this SNR while, at the same time preserves the physically probable parameter values. Finally, models that include the high-frequency synchrotron bending of the IC 443 radio to microwave continuum are favored.

  2. A New Look at the Integrated Radio/Microwave Continuum Spectrum of Galactic Supernova Remnant IC 443

    Science.gov (United States)

    Onić, D.; Urošević, D.; Leahy, D.

    2017-01-01

    Recent observations of the microwave sky, by space telescopes such as the Wilkinson Microwave Anisotropy Probe and Planck, have opened a new window into the analysis of continuum emission from supernova remnants (SNRs). In this paper, different emission models that can explain the characteristic shape of currently known integrated radio/microwave continuum spectrum of the Galactic SNR IC 443 are tested and discussed. In particular, the possibility is emphasized that the slight bump in the integrated continuum of this remnant around 20–70 GHz is genuine and that it can be explained by the contribution of an additional emission mechanism such as spinning dust. We find that adding a spinning dust component to the emission model improves the fit of the integrated spectrum of this SNR while at the same time preserving the physically probable parameter values. Finally, models that include the high-frequency synchrotron bending of the IC 443 radio to microwave continuum are favored.

  3. Bank Vole Prion Protein As an Apparently Universal Substrate for RT-QuIC-Based Detection and Discrimination of Prion Strains.

    Directory of Open Access Journals (Sweden)

    Christina D Orrú

    2015-06-01

    Full Text Available Prions propagate as multiple strains in a wide variety of mammalian species. The detection of all such strains by a single ultrasensitive assay such as Real Time Quaking-induced Conversion (RT-QuIC would facilitate prion disease diagnosis, surveillance and research. Previous studies have shown that bank voles, and transgenic mice expressing bank vole prion protein, are susceptible to most, if not all, types of prions. Here we show that bacterially expressed recombinant bank vole prion protein (residues 23-230 is an effective substrate for the sensitive RT-QuIC detection of all of the different prion types that we have tested so far--a total of 28 from humans, cattle, sheep, cervids and rodents, including several that have previously been undetectable by RT-QuIC or Protein Misfolding Cyclic Amplification. Furthermore, comparison of the relative abilities of different prions to seed positive RT-QuIC reactions with bank vole and not other recombinant prion proteins allowed discrimination of prion strains such as classical and atypical L-type bovine spongiform encephalopathy, classical and atypical Nor98 scrapie in sheep, and sporadic and variant Creutzfeldt-Jakob disease in humans. Comparison of protease-resistant RT-QuIC conversion products also aided strain discrimination and suggested the existence of several distinct classes of prion templates among the many strains tested.

  4. Bank Vole Prion Protein As an Apparently Universal Substrate for RT-QuIC-Based Detection and Discrimination of Prion Strains.

    Science.gov (United States)

    Orrú, Christina D; Groveman, Bradley R; Raymond, Lynne D; Hughson, Andrew G; Nonno, Romolo; Zou, Wenquan; Ghetti, Bernardino; Gambetti, Pierluigi; Caughey, Byron

    2015-06-01

    Prions propagate as multiple strains in a wide variety of mammalian species. The detection of all such strains by a single ultrasensitive assay such as Real Time Quaking-induced Conversion (RT-QuIC) would facilitate prion disease diagnosis, surveillance and research. Previous studies have shown that bank voles, and transgenic mice expressing bank vole prion protein, are susceptible to most, if not all, types of prions. Here we show that bacterially expressed recombinant bank vole prion protein (residues 23-230) is an effective substrate for the sensitive RT-QuIC detection of all of the different prion types that we have tested so far--a total of 28 from humans, cattle, sheep, cervids and rodents, including several that have previously been undetectable by RT-QuIC or Protein Misfolding Cyclic Amplification. Furthermore, comparison of the relative abilities of different prions to seed positive RT-QuIC reactions with bank vole and not other recombinant prion proteins allowed discrimination of prion strains such as classical and atypical L-type bovine spongiform encephalopathy, classical and atypical Nor98 scrapie in sheep, and sporadic and variant Creutzfeldt-Jakob disease in humans. Comparison of protease-resistant RT-QuIC conversion products also aided strain discrimination and suggested the existence of several distinct classes of prion templates among the many strains tested.

  5. UX Ori Variables in the Cluster IC 348

    Science.gov (United States)

    Barsunova, O. Yu.; Grinin, V. P.; Sergeev, S. G.; Semenov, A. O.; Shugarov, S. Yu.

    2015-06-01

    Results are presented from many years of photometric (VRCIC) observations of three variable T Tauri type stars in the cluster IC 348: V712 Per, V719 Per, and V909 Per. All three stars have photometric activity characteristic of UX Ori stars. The activity of V719 Per has increased significantly over the last 10 years: the amplitude of its Algol-like minima has increased by roughly a factor of 4 and has reached three stellar magnitudes in the I band. Periodograms of the light curves do not confirm the periods found previously by other authors on the basis of shorter series of observations. The slope of the color tracks on "color-magnitude" diagrams is used to determine the reddening law for these stars owing to selective absorption by circumstellar dust. Modelling of these parameters by the Mie theory shows that the maximum size amax of the dust particles in the protoplanetary disks of these stars is 1.5-2 times greater than in the interstellar medium. In V712 Per and V909 Per, the bulk of the mass of the dust particles is concentrated near amax, while in V719 Per the average mass of the dust particles is determined by the minimum size of the particles. It should be emphasized that these conclusions rely on an analysis of the optical variability of these stars.

  6. Multiple tidal disruption flares in the active galaxy IC 3599

    CERN Document Server

    Campana, S; Colpi, M; Lodato, G; D'Avanzo, P; Evans, P A; Moretti, A

    2015-01-01

    Tidal disruption events occur when a star passes too close to a massive black hole and it is totally ripped apart by tidal forces. Alternatively, if the star does not get close enough to the black hole to be totally disrupted, a less dramatic event might happen with the star surviving the encounter and loosing only a small fraction of its mass. In this situation if the stellar orbit is bound and highly eccentric, just like some stars in the centre of our own Galaxy, repeated flares should occur. When the star approaches the black hole tidal radius at periastron, matter might be stripped resulting in lower intensity outbursts recurring once every orbital period. We report on Swift observations of a recent bright flare from the galaxy IC 3599 hosting a middle-weight black hole, where a possible tidal disruption event was observed in the early 1990s. By light curve modelling and spectral fitting we can consistently account for the events as the non-disruptive tidal stripping of a star into a highly eccentric orb...

  7. Ices in the Quiescent IC 5146 Dense Cloud

    CERN Document Server

    Chiar, J E; Allamandola, L J; Boogert, A C A; Ennico, K; Greene, T P; Geballe, T R; Keane, J V; Lada, C J; Mason, R E; Roellig, T L; Sandford, S A; Tielens, A G G M; Werner, M W; Whittet, D C B; Decin, L; Eriksson, K

    2011-01-01

    This paper presents spectra in the 2 to 20 micron range of quiescent cloud material located in the IC 5146 cloud complex. The spectra were obtained with NASA's Infrared Telescope Facility (IRTF) SpeX instrument and the Spitzer Space Telescope's Infrared Spectrometer. We use these spectra to investigate dust and ice absorption features in pristine regions of the cloud that are unaltered by embedded stars. We find that the H2O-ice threshold extinction is 4.03+/-0.05 mag. Once foreground extinction is taken into account, however, the threshold drops to 3.2 mag, equivalent to that found for the Taurus dark cloud, generally assumed to be the touchstone quiescent cloud against which all other dense cloud and embedded young stellar object observations are compared. Substructure in the trough of the silicate band for two sources is attributed to CH3OH and NH3 in the ices, present at the ~2% and ~5% levels, respectively, relative to H2O-ice. The correlation of the silicate feature with the E(J-K) color excess is found...

  8. IC 630: Piercing the Veil of the Nuclear Gas

    Science.gov (United States)

    Durré, Mark; Mould, Jeremy; Schartmann, Marc; Ashraf Uddin, Syed; Cotter, Garrett

    2017-04-01

    IC 630 is a nearby early-type galaxy with a mass of 6× {10}10 M ⊙ with an intense burst of recent (6 Myr) star formation (SF). It shows strong nebular emission lines, with radio and X-ray emission, which classifies it as an active galactic nucleus (AGN). With VLT-SINFONI and Gemini North-NIFS adaptive optics observations (plus supplementary ANU 2.3 m WiFeS optical IFU observations), the excitation diagnostics of the nebular emission species show no sign of standard AGN engine excitation; the stellar velocity dispersion also indicates that a supermassive black hole (if one is present) is small ({M}\\bullet =2.25× {10}5 {M}⊙ ). The luminosity at all wavelengths is consistent with SF at a rate of about 1-2 M ⊙ yr-1. We measure gas outflows driven by SF at a rate of 0.18 M ⊙ yr-1 in a face-on truncated cone geometry. We also observe a nuclear cluster or disk and other clusters. Photoionization from young, hot stars is the main excitation mechanism for [Fe ii] and hydrogen, whereas shocks are responsible for the H2 excitation. Our observations are broadly comparable with simulations where a Toomre-unstable, self-gravitating gas disk triggers a burst of SF, peaking after about 30 Myr and possibly cycling with a period of about 200 Myr.

  9. MagIC: Geomagnetic Applications from Earth History to Archeology

    Science.gov (United States)

    Constable, C.; Tauxe, L.; Koppers, A.; Minnett, R.; Jarboe, N.

    2016-12-01

    Major scientific challenges increasingly require an interdisciplinary approach, and highlight the need for open archives, incorporating visualization and analysis tools that are flexible enough to address novel research problems. Increasingly modern standards for publication are (or should be) demanding direct links to data, data citations, and adequate documentation that allow other researchers direct access to the fundamental measurements and analyses producing the results. Carefully documented metadata are essential and data models may need considerable complexity to accommodate re-use of observations originally collected with a different purpose in mind. The Magnetics Information Consortium (MagIC) provides an online home for all kinds of paleo-, archeo-magnetic, rock, and environmental magnetic data, from documentation of fieldwork, through lab protocols, to interpretations in terms of geomagnetic history. Examples of their application to understanding geomagnetic field behavior, archeological dating, and voyages of exploration to discover America will be used to highlight best practices and illustrate unexpected benefits of data archived using best practices with the goal of maintaining high standards for reproducibility.

  10. High frame rate measurements of semiconductor pixel detector readout IC

    Science.gov (United States)

    Szczygiel, R.; Grybos, P.; Maj, P.

    2012-07-01

    We report on high count rate and high frame rate measurements of a prototype IC named FPDR90, designed for readouts of hybrid pixel semiconductor detectors used for X-ray imaging applications. The FPDR90 is constructed in 90 nm CMOS technology and has dimensions of 4 mm×4 mm. Its main part is a matrix of 40×32 pixels with 100 μm×100 μm pixel size. The chip works in the single photon counting mode with two discriminators and two 16-bit ripple counters per pixel. The count rate per pixel depends on the effective CSA feedback resistance and can be set up to 6 Mcps. The FPDR90 can operate in the continuous readout mode, with zero dead time. Due to the architecture of digital blocks in pixel, one can select the number of bits read out from each counter from 1 to 16. Because in the FPDR90 prototype only one data output is available, the frame rate is 9 kfps and 72 kfps for 16 bits and 1 bit readout, respectively (with nominal clock frequency of 200 MHz).

  11. High frame rate measurements of semiconductor pixel detector readout IC

    Energy Technology Data Exchange (ETDEWEB)

    Szczygiel, R., E-mail: robert.szczygiel@agh.edu.pl [AGH University of Science and Technology, Department of Measurement and Instrumentation, Al. Mickiewicza 30, 30-059 Cracow (Poland); Grybos, P.; Maj, P. [AGH University of Science and Technology, Department of Measurement and Instrumentation, Al. Mickiewicza 30, 30-059 Cracow (Poland)

    2012-07-11

    We report on high count rate and high frame rate measurements of a prototype IC named FPDR90, designed for readouts of hybrid pixel semiconductor detectors used for X-ray imaging applications. The FPDR90 is constructed in 90 nm CMOS technology and has dimensions of 4 mm Multiplication-Sign 4 mm. Its main part is a matrix of 40 Multiplication-Sign 32 pixels with 100 {mu}m Multiplication-Sign 100 {mu}m pixel size. The chip works in the single photon counting mode with two discriminators and two 16-bit ripple counters per pixel. The count rate per pixel depends on the effective CSA feedback resistance and can be set up to 6 Mcps. The FPDR90 can operate in the continuous readout mode, with zero dead time. Due to the architecture of digital blocks in pixel, one can select the number of bits read out from each counter from 1 to 16. Because in the FPDR90 prototype only one data output is available, the frame rate is 9 kfps and 72 kfps for 16 bits and 1 bit readout, respectively (with nominal clock frequency of 200 MHz).

  12. Attachment method for stacked integrated circuit (IC) chips

    Energy Technology Data Exchange (ETDEWEB)

    Bernhardt, Anthony F. (Berkeley, CA); Malba, Vincent (Livermore, CA)

    1999-01-01

    An attachment method for stacked integrated circuit (IC) chips. The method involves connecting stacked chips, such as DRAM memory chips, to each other and/or to a circuit board. Pads on the individual chips are rerouted to form pads on the side of the chip, after which the chips are stacked on top of each other whereby desired interconnections to other chips or a circuit board can be accomplished via the side-located pads. The pads on the side of a chip are connected to metal lines on a flexible plastic tape (flex) by anisotropically conductive adhesive (ACA). Metal lines on the flex are likewise connected to other pads on chips and/or to pads on a circuit board. In the case of a stack of DRAM chips, pads to corresponding address lines on the various chips may be connected to the same metal line on the flex to form an address bus. This method has the advantage of reducing the number of connections required to be made to the circuit board due to bussing; the flex can accommodate dimensional variation in the alignment of chips in the stack; bonding of the ACA is accomplished at low temperature and is otherwise simpler and less expensive than solder bonding; chips can be bonded to the ACA all at once if the sides of the chips are substantially coplanar, as in the case for stacks of identical chips, such as DRAM.

  13. Attachment method for stacked integrated circuit (IC) chips

    Energy Technology Data Exchange (ETDEWEB)

    Bernhardt, A.F.; Malba, V.

    1999-08-03

    An attachment method for stacked integrated circuit (IC) chips is disclosed. The method involves connecting stacked chips, such as DRAM memory chips, to each other and/or to a circuit board. Pads on the individual chips are rerouted to form pads on the side of the chip, after which the chips are stacked on top of each other whereby desired interconnections to other chips or a circuit board can be accomplished via the side-located pads. The pads on the side of a chip are connected to metal lines on a flexible plastic tape (flex) by anisotropically conductive adhesive (ACA). Metal lines on the flex are likewise connected to other pads on chips and/or to pads on a circuit board. In the case of a stack of DRAM chips, pads to corresponding address lines on the various chips may be connected to the same metal line on the flex to form an address bus. This method has the advantage of reducing the number of connections required to be made to the circuit board due to bussing; the flex can accommodate dimensional variation in the alignment of chips in the stack; bonding of the ACA is accomplished at low temperature and is otherwise simpler and less expensive than solder bonding; chips can be bonded to the ACA all at once if the sides of the chips are substantially coplanar, as in the case for stacks of identical chips, such as DRAM. 12 figs.

  14. Stellar Populations at the Center of IC 1613

    CERN Document Server

    Cole, A A; Gallagher, J S; Hössel, J G; Mould, J R; Holtzmann, J A; Saha, A; Ballester, G E; Burrows, C J; Clarke, J T; Crisp, D; Griffiths, R E; Grillmair, C J; Hester, J J; Krist, J E; Meadows, V; Scowen, P A; Stapelfeldt, K R; Trauger, J T; Watson, A M; Westphal, J R; Cole, Andrew A.; Tolstoy, Eline; Gallagher, John S.; Hoessel, John G.; Mould, Jeremy R.; Holtzman, Jon A.; Saha, Abhijit; Ballester, Gilda E.; Burrows, Christopher J.; Clarke, John T.; Crisp, David; Griffiths, Richard E.; Grillmair, Carl J.; Hester, Jeff J.; Krist, John E.; Meadows, Vikki; Scowen, Paul A.; Stapelfeldt, Karl R.; Trauger, John T.; Watson, Alan M.; Westphal, James R.

    1999-01-01

    We have observed the center of the Local Group dwarf irregular galaxy IC 1613 with WFPC2 aboard the Hubble Space Telescope in the F439W, F555W, and F814W filters. We find a dominant old stellar population (aged ~7 Gyr), identifiable by the strong red giant branch (RGB) and red clump populations. From the (V-I) color of the RGB, we estimate a mean metallicity of the intermediate-age stellar population [Fe/H] = -1.38 +/- 0.31. We confirm a distance of 715 +/- 40 kpc using the I-magnitude of the RGB tip. The main-sequence luminosity function down to I ~25 provides evidence for a roughly constant SFR of approximately 0.00035 solar masses per year across the WFPC2 field of view (0.22 square kpc) during the past 250-350 Myr. Structure in the blue loop luminosity function implies that the SFR was ~50% higher 400-900 Myr ago than today. The mean heavy element abundance of these young stars is 1/10th solar. The best explanation for a red spur on the main-sequence at I = 24.7 is the blue horizontal branch component of ...

  15. Precessing collimated outflows in the planetary nebula IC 4846

    CERN Document Server

    Miranda, L F; Torrelles, J M; Miranda, Luis F; Guerrero, Martin A; Torrelles, Jose M

    2000-01-01

    We present [N II] and H-alpha images and high resolution long-slit spectra of the planetary nebula IC 4846, which reveal, for the first time, its complex structure and the existence of collimated outflows. The object consists of a moderately elongated shell, two (and probably three) pairs of collimated bipolar outflows at different orientations, and an attached circular shell. One of the collimated pairs is constituted by two curved, extended filaments whose properties indicate a high velocity, bipolar precessing jet. A difference of \\~10 km/s is found between the systemic velocity of the precessing jets and the centroid velocity of the nebula, as recently report for Hu 2-1. We propose that this difference is due to orbital motion of the ejection source in a binary central star. The orbital separation and period estimates for the binary star are less than or equal to 30 AU and 100 yr, respectively. These are similar to those previously estimated for Hu 2-1, linking the central stars of both planetary nebulae ...

  16. Spatially-resolved mid-infrared spectroscopy of IC 5063

    Directory of Open Access Journals (Sweden)

    S. Young

    2007-01-01

    Full Text Available N-band spectroscopy of the radio strong Seyfert 2 active galaxy IC 5063 (z=0.0110 was obtained using Gemini South in conjunc- tion with the Thermal-Region Camera Spec- trograph (T-ReCS; Telesco et al. 1998. T- ReCS uses a Raytheon 320x240 pixel SiAs IBC array, at a plate scale of 0.08900 pixel-1. The observations were conducted on the nights of UT 2005 July 7 and 9 using the standard chop-nod technique to remove the time-variable sky background, telescope ther- mal emission, and the so-called 1/f detector noise. A 0.6700 wide slit was used aligned along the position angle of the radio axis at 305o(Morganti et al. 1998 and close to the extended narrow line emission region (ENLR axis at 303_(Colina et al. 1991. The total on- source integration time was 1212 seconds.

  17. FinFET modeling for IC simulation and design

    CERN Document Server

    Hu, Chenming; Lu, Darsen D

    2015-01-01

    This book is the first to explain FinFET modeling for IC simulation and the industry standard - BSIM-CMG - describing the rush in demand for advancing the technology from planar to 3D architecture, as now enabled by the approved industry standard. The book gives a strong foundation on the physics and operation of FinFET, details aspects of the BSIM-CMG model such as surface potential, charge and current calculations, and includes a dedicated chapter on parameter extraction procedures, providing a step-by-step approach for the efficient extraction of model parameters. With this book you will learn: * Why you should use FinFET* The physics and operation of FinFET* Details of the FinFET standard model (BSIM-CMG)* Parameter extraction in BSIM-CMG* FinFET circuit design and simulation * Authored by the lead inventor and developer of FinFET, and developers of the BSIM-CM standard model, providing an experts' insight into the specifications of the standard* The first book on the industry-standard FinFET model - BSIM...

  18. Identification of Large-Scale Structure Fluctuations in IC Engines using POD-Based Conditional Averaging

    Directory of Open Access Journals (Sweden)

    Buhl Stefan

    2016-01-01

    Full Text Available Cycle-to-Cycle Variations (CCV in IC engines is a well-known phenomenon and the definition and quantification is well-established for global quantities such as the mean pressure. On the other hand, the definition of CCV for local quantities, e.g. the velocity or the mixture distribution, is less straightforward. This paper proposes a new method to identify and calculate cyclic variations of the flow field in IC engines emphasizing the different contributions from large-scale energetic (coherent structures, identified by a combination of Proper Orthogonal Decomposition (POD and conditional averaging, and small-scale fluctuations. Suitable subsets required for the conditional averaging are derived from combinations of the the POD coefficients of the second and third mode. Within each subset, the velocity is averaged and these averages are compared to the ensemble-averaged velocity field, which is based on all cycles. The resulting difference of the subset-average and the global-average is identified as a cyclic fluctuation of the coherent structures. Then, within each subset, remaining fluctuations are obtained from the difference between the instantaneous fields and the corresponding subset average. The proposed methodology is tested for two data sets obtained from scale resolving engine simulations. For the first test case, the numerical database consists of 208 independent samples of a simplified engine geometry. For the second case, 120 cycles for the well-established Transparent Combustion Chamber (TCC benchmark engine are considered. For both applications, the suitability of the method to identify the two contributions to CCV is discussed and the results are directly linked to the observed flow field structures.

  19. Cloning and characterization of human IC53-2, a novel CDK5 activator binding protein

    Institute of Scientific and Technical Information of China (English)

    2003-01-01

    We have identified IC53-2, a human homologue of the rat C53 gene from a human placenta cDNA library (GeneBank Accession No. AF217982). IC53-2 can bind to the CDK5 activator p35 by in vitro association assay. IC53-2 is mapped to human chromosome 17q21.31. The IC53-2 transcript is highly expressed in kidney, liver, skeletal muscle and placenta. It is abundantly expressed in SMMC-7721, C-33A, 3AO, A431and MCF-7 cancer cell lines by RT-PCR assay. Stable transfection of IC53-2 cDNA into the hepatocellularcarcinoma SMMC-7721 cell remarkably stimulates its growth in vitro. The above results indicate thatIC53-2 is a novel human gene, which may be involved in the regulation of cell proliferation.

  20. Modeling and performance evaluation of an electromechanical valve actuator for a camless IC engine

    OpenAIRE

    Eid Mohamed

    2012-01-01

    Valve train control is one of the best strategies for optimizing efficiency and emissions of Internal Combustion (IC) engines. Applications of solenoid valve actuators in (IC) engines can facilitate operations such as variable valve timing and variable valve lifting for improved the engine performance, fuel economy and reduce emission, the electromechanical valve actuator (EMVA) uses solenoid to actuate valve movement independently for the application of (IC) engine. In this work presents the...

  1. Long-acting muscarinic antagonists (LAMA) added to combination long-acting beta2-agonists and inhaled corticosteroids (LABA/ICS) versus LABA/ICS for adults with asthma.

    Science.gov (United States)

    Kew, Kayleigh M; Dahri, Karen

    2016-01-21

    negligible, and evidence for the effect on serious adverse events was inconsistent. There are likely to be small added benefits for tiotropium Respimat 5 µg daily on lung function and asthma control over LABA/ICS alone and fewer non-serious adverse events. The benefit of tiotropium add-on on the frequency of hospital admission is still unknown, despite year-long trials.Ongoing and future trials should clearly describe participants' background medications to help clinicians judge how the findings relate to stepwise care. If studies test LAMAs other than tiotropium Respimat for asthma, they should be at least six months long and use accepted and validated outcomes to allow comparisons of the safety and effectiveness between different preparations.

  2. Transient thermal analysis as measurement method for IC package structural integrity

    Science.gov (United States)

    Hanß, Alexander; Schmid, Maximilian; Liu, E.; Elger, Gordon

    2015-06-01

    Practices of IC package reliability testing are reviewed briefly, and the application of transient thermal analysis is examined in great depth. For the design of light sources based on light emitting diode (LED) efficient and accurate reliability testing is required to realize the potential lifetimes of 105 h. Transient thermal analysis is a standard method to determine the transient thermal impedance of semiconductor devices, e.g. power electronics and LEDs. The temperature of the semiconductor junctions is assessed by time-resolved measurement of their forward voltage (Vf). The thermal path in the IC package is resolved by the transient technique in the time domain. This enables analyzing the structural integrity of the semiconductor package. However, to evaluate thermal resistance, one must also measure the dissipated energy of the device (i.e., the thermal load) and the k-factor. This is time consuming, and measurement errors reduce the accuracy. To overcome these limitations, an innovative approach, the relative thermal resistance method, was developed to reduce the measurement effort, increase accuracy and enable automatic data evaluation. This new way of evaluating data simplifies the thermal transient analysis by eliminating measurement of the k-factor and thermal load, i.e. measurement of the lumen flux for LEDs, by normalizing the transient Vf data. This is especially advantageous for reliability testing where changes in the thermal path, like cracks and delaminations, can be determined without measuring the k-factor and thermal load. Different failure modes can be separated in the time domain. The sensitivity of the method is demonstrated by its application to high-power white InGaN LEDs. For detailed analysis and identification of the failure mode of the LED packages, the transient signals are simulated by time-resolved finite element (FE) simulations. Using the new approach, the transient thermal analysis is enhanced to a powerful tool for reliability

  3. Poly-IC preconditioning protects against cerebral and renal ischemia-reperfusion injury.

    Science.gov (United States)

    Packard, Amy E B; Hedges, Jason C; Bahjat, Frances R; Stevens, Susan L; Conlin, Michael J; Salazar, Andres M; Stenzel-Poore, Mary P

    2012-02-01

    Preconditioning induces ischemic tolerance, which confers robust protection against ischemic damage. We show marked protection with polyinosinic polycytidylic acid (poly-IC) preconditioning in three models of murine ischemia-reperfusion injury. Poly-IC preconditioning induced protection against ischemia modeled in vitro in brain cortical cells and in vivo in models of brain ischemia and renal ischemia. Further, unlike other Toll-like receptor (TLR) ligands, which generally induce significant inflammatory responses, poly-IC elicits only modest systemic inflammation. Results show that poly-IC is a new powerful prophylactic treatment that offers promise as a clinical therapeutic strategy to minimize damage in patient populations at risk of ischemic injury.

  4. Validation of cytochrome P450 time-dependent inhibition assays: a two-time point IC50 shift approach facilitates kinact assay design.

    Science.gov (United States)

    Perloff, E S; Mason, A K; Dehal, S S; Blanchard, A P; Morgan, L; Ho, T; Dandeneau, A; Crocker, R M; Chandler, C M; Boily, N; Crespi, C L; Stresser, D M

    2009-02-01

    1. Recent guidance from the US Food and Drug Administration (USFDA) has advocated testing of time-dependent inhibition of cytochrome P450 (CYP), which can be addressed by performing IC(50) shift as well as K(I)/k(inact) determinations. 2. Direct (IC(50), K(i)) and time-dependent inhibition (IC(50) shift, K(I)/k(inact)) assays were validated in human liver microsomes with liquid chromatography-tandem mass spectrometry (LC/MS/MS) analysis for the following enzyme/substrate/inhibitor combinations: CYP1A2/phenacetin/alpha-naphthoflavone/furafylline, CYP2C8/amodiaquine/montelukast/gemfibrozil-1-O-beta-glucuronide, CYP2C9/diclofenac/sulfaphenazole/tienilic acid, CYP2C19/S-mephenytoin/S-benzylnirvanol/S-fluoxetine, CYP2D6/dextromethorphan/quinidine/paroxetine, and CYP3A4/midazolam/testosterone/ketoconazole/azamulin/verapamil/diltiazem. IC(50) shift assays were performed with two pre-incubation time points (10 and 30 min) to facilitate k(inact) assay design. 3. Data obtained show good agreement with literature values. For rapid acting inhibitors, such as azamulin/CYP3A4 and tienilic acid/CYP2C9, the IC(50) shifts were similar at both time points suggesting a short maximum pre-incubation time with closely spaced time points for the K(I)/k(inact) assay. Slow acting inhibitors (such as verapamil/CYP3A4 or S-fluoxetine/CYP2C19) showed an increase in IC(50) shift between 10 and 30 min suggesting a longer maximum pre-incubation time with wider spacing of time points for K(I)/k(inact). 4. The two-time point IC(50) shift experiment proved to be an excellent method for the selection of appropriate K(I)/k(inact) assay parameters and is suitable for the routine analysis of P450 inhibition by drug candidates.

  5. X-ray and optical spectroscopy of the massive young open cluster IC 1805

    Science.gov (United States)

    Rauw, G.; Nazé, Y.

    2016-10-01

    Context. Very young open clusters are ideal places to study the X-ray properties of a homogeneous population of early-type stars. In this respect, the IC 1805 open cluster is very interesting as it hosts the O4 If+ star HD 15570 thought to be in an evolutionary stage intermediate between a normal O-star and a Wolf-Rayet star. Aims: Such a star could provide a test for theoretical models aiming at explaining the empirical scaling relation between the X-ray and bolometric luminosities of O-type stars. Methods: We have observed IC 1805 with XMM-Newton and further collected optical spectroscopy of some of the O-star members of the cluster. Results: The optical spectra allow us to revisit the orbital solutions of BD+60° 497 and HD 15558, and provide the first evidence of binarity for BD+60° 498. X-ray emission from colliding winds does not appear to play an important role among the O-stars of IC 1805. Notably, the X-ray fluxes do not vary significantly between archival X-ray observations and our XMM-Newton pointing. The very fast rotator BD+60° 513, and to a lesser extent the O4 If+ star HD 15570 appear somewhat underluminous. Whilst the underluminosity of HD 15570 is only marginally significant, its amplitude is found to be compatible with theoretical expectations based on its stellar and wind properties. A number of other X-ray sources are detected in the field, and the brightest objects, many of which are likely low-mass pre-main sequence stars, are analyzed in detail. Based on observations collected with XMM-Newton, an ESA science mission with instruments and contributions directly funded by ESA member states and the USA (NASA), and with the TIGRE telescope (La Luz, Mexico).Table A.1 is only available at the CDS via anonymous ftp to http://cdsarc.u-strasbg.fr (http://130.79.128.5) or via http://cdsarc.u-strasbg.fr/viz-bin/qcat?J/A+A/594/A82

  6. Research on IC Driver Used in Automotive LED Lighting%可用于汽车 LED 照明系统的驱动 IC 研究

    Institute of Scientific and Technical Information of China (English)

    司小平

    2015-01-01

    This paper introduces the specific requirements of high power LED lighting IC uses in vehicles.With classic LED drivers from several famous IC companies as an example,current situation of automotive LED lighting driver is illus-trated.Typical high power automotive LED lighting drivers at home and abroad are compared in aspects of parameters, suitable topology and footprint.Finally,prospects of automotive LED lighting driving IC are outlined.%文中介绍了车用大功率 LED 照明 IC 的具体要求,以几个著名 IC 生产设计公司的经典 LED 驱动器为例说明了汽车 LED 照明驱动芯片现状,从性能参数、适用拓扑、封装形式等方面对目前国内外具有代表性的大功率车用 LED 驱动芯片作了比较和研究,并对车用 LED 照明驱动 IC 进行了展望。

  7. IC ENGINE SUPERCHARGING AND EXHAUST GAS RECIRCULATION USING JET COMPRESSOR

    Directory of Open Access Journals (Sweden)

    Adhimoulame Kalaisselvane

    2010-01-01

    Full Text Available Supercharging is a process which is used to improve the performance of an engine by increasing the specific power output whereas exhaust gas recirculation reduces the NOx produced by engine because of supercharging. In a conventional engine, supercharger functions as a compressor for the forced induction of the charge taking mechanical power from the engine crankshaft. In this study, supercharging is achieved using a jet compressor. In the jet compressor, the exhaust gas is used as the motive stream and the atmospheric air as the propelled stream. When high pressure motive stream from the engine exhaust is expanded in the nozzle, a low pressure is created at the nozzle exit. Due to this low pressure, atmospheric air is sucked into the expansion chamber of the compressor, where it is mixed and pressurized with the motive stream. The pressure of the mixed stream is further increased in the diverging section of the jet compressor. A percentage volume of the pressurized air mixture is then inducted back into the engine as supercharged air and the balance is let out as exhaust. This process not only saves the mechanical power required for supercharging but also dilutes the constituents of the engine exhaust gas thereby reducing the emission and the noise level generated from the engine exhaust. The geometrical design parameters of the jet compressor were obtained by solving the governing equations using the method of constant rate of momentum change. Using the theoretical design parameters of the jet compressor, a computational fluid dinamics analysis using FLUENT software was made to evaluate the performance of the jet compressor for the application of supercharging an IC engine. This evaluation turned out to be an efficient diagnostic tool for determining performance optimization and design of the jet compressor. A jet compressor was also fabricated for the application of supercharging and its performance was studied.

  8. Measurement of the Lick Indices in Early-Type Galaxies: Line-of-Sight Velocity Distribution Corrections for IC 1459

    Directory of Open Access Journals (Sweden)

    Samurović, S.

    2009-12-01

    Full Text Available In this paper we analyse the measurements of the absorption line-strength Lick indices in the early-type galaxy IC 1459. We use thelong-slit spectra of the elliptical galaxy IC 1459 from which its kinematicshad previously been extracted to calculate the Lick indices forthe observed spectral region (Mg$_2$, Fe5270, Fe5335 and H$_beta$. Weapply the usual procedure and correct the indices to the Lick spectralresolution and for the zero velocity dispersion. The procedure applied in thispaper also corrects to non-Gaussian line-of-sight velocity distribution(LOSVD observed in this galaxy, especially in its outer parts. The findingsof Kuntschner (2004 were tested and it is shown that the departures from theGaussian LOSVD may indeed cause erroneous determinations of the Lick indices. The impact of the introduction of non-Gaussian LOSVD differs for differentindices. For the galaxy IC~1459 it is shown that the iron indices areespecially sensitive when the correction due to anistropies is introduced: thecorrections for Fe5270 and Fe5335 are $sim 10$ and $sim 19$ percentlarger, respectively, than the corrections obtained in case of a pure Gaussian. The corrections for Mg$_2$ index are shown to be negligible and thecorrections of the H$_beta$ index due to anisotropies are also small (below$sim 4$ per cent at most.

  9. Measurement of the Lick indices in early-type galaxies: Line-of-sight velocity distribution corrections for IC 1459

    Directory of Open Access Journals (Sweden)

    Samurović Srđan

    2009-01-01

    Full Text Available In this paper we analyze the measurements of the absorption line-strength Lick indices in the early-type galaxy IC 1459. We use the long-slit spectra of the elliptical galaxy IC 1459 from which its kinematics had previously been extracted to calculate the Lick indices for the observed spectral region (Mg2, Fe5270, Fe5335 and Hβ. We apply the usual procedure and correct the indices to the Lick spectral resolution and for the zero velocity dispersion. The procedure applied in this paper also corrects to non-Gaussian line-of-sight velocity distribution (LOSVD observed in this galaxy, especially in its outer parts. The findings of Kuntschner (2004 were tested and it is shown that the departures from the Gaussian LOSVD may indeed cause erroneous determinations of the Lick indices. The impact of the introduction of non-Gaussian LOSVD differs for different indices. For the galaxy IC 1459 it is shown that the iron indices are especially sensitive when the correction due to anistropies is introduced: the corrections for Fe5270 and Fe5335 are ~10 and ~19 percent larger, respectively, than the corrections obtained in case of a pure Gaussian. The corrections for Mg2 index are shown to be negligible and the corrections of the Hβ index due to anisotropies are also small (below ~ 4 per cent at most.

  10. Comparison of fracture toughness (K{sub IC}) and strain energy release rate (G) of selected nuclear graphites

    Energy Technology Data Exchange (ETDEWEB)

    Chi, Se-Hwan, E-mail: shchi@kaeri.re.kr

    2016-08-01

    The fracture behaviors of six nuclear graphite grades for a high-temperature gas-cooled reactor (HTGR), which differed in coke particle size and forming method, were characterized based on the ASTM standard graphite fracture toughness test method (ASTM D 7779-11) at room temperature. The G appeared to show good correlation with the fracture surface roughness and the G-Δa curves appeared to describe the fracture process well from crack initiation to failure. Comparison of the local (K{sub IC}) and gross (G{sub IC}, G-Δa) fracture parameters showed that the resistance to crack initiation and propagation was higher in the extruded or vibration molded medium particle size grades (PCEA, NBG-17, NBG-18: EVM group) than in the iso-molded fine particle size grades (IG-110, IG-430, NBG-25: IMF group). The ASTM may need to provide a guideline for G-Δa curve analysis. The K{sub IC} appeared to increase with specimen thickness (size).

  11. Synthesis and Application of Magnetic Photocatalyst of Ni-Zn Ferrite/TiO2 from IC Lead Frame Scraps

    Directory of Open Access Journals (Sweden)

    Robert Liu

    2015-01-01

    Full Text Available IC lead frame scraps with about 18.01% tin, 34.33% nickel, and 47.66% iron in composition are industrial wastes of IC lead frame production. The amount of thousand tons of frame scraps in Taiwan each year is treated as scrap irons. Ni-Zn ferrites used in high frequent inductors and filters are produced from Ni-Zn ferrite powders by pressing and sintering. The amount of several ten thousand tons of ferrites of Ni1-XZnXFe2O4 in compositions is consumed annually in the whole world. Therefore, these IC lead frame scraps will be used in this research as raw materials to fabricate magnetic ferrite powders and combined subsequently with titanium sulfate and urea to produce magnetic photocatalysts by coprecipitation for effective waste utilization. The prepared Ni-Zn ferrite powder and magnetic photocatalyst (Ni-Zn ferrite/TiO2 were characterized by ICP, XRF, XRD, EDX, SEM, SQUID, and BET. The photocatalytic activity of synthesized magnetic photocatalysts was tested by FBL dye wastewater degradation. TOC and ADMI measurement for degradation studies were carried out, respectively. Langmuir-Hinshelwood kinetic model of the prepared magnetic TiO2 proved available for the treatments. Wastes are transformed to valuable magnetic photocatalysts in this research to solve the separation problem of wastewater and TiO2 photocatalysts by magnetic field.

  12. ENN-ICS - quality assurance and online evaluation of a multilingual learning management system for sleep medicine

    Directory of Open Access Journals (Sweden)

    Knobl, Brigitte

    2006-11-01

    Full Text Available With the development and implementation of a multilingual interactive communication system the e-health project ENN-ICS, funded by the European Union, aims at the improvement of health care in Europe. The field of application is sleep physiology and sleep medicine. ENN-ICS Centre offers direct access to medical information for multiple users, i.e. health authorities, health care professionals, patients and citizen. Using XML technologies the new web based network integrates advanced e-learning and e-publishing methods for the training of healthcare professionals. Editorial and distributive processes are supported by customized central editorial, content management and learning management systems (CMS, LMS. ENN-ICS e-health services are evaluated by selected user groups in North, Middle and Southern Europe using reliable and scientifically accepted validation instruments. The compliance with essential quality requirements and criteria is tested and verified by using adapted online questionnaires based on the DISCERN questionnaire for evaluating patient information, on the HON principles for evaluating health-related websites and on the GMDS catalogue of quality criteria for electronic publications in medicine. The system architecture and its exemplary applications can be used as a model for future e-health services dealing with neurological and other medical topics.

  13. Measuring IC following a semi-qualitative approach: An integrated framework

    Directory of Open Access Journals (Sweden)

    Chiara Verbano

    2013-09-01

    Full Text Available Purpose: Considering the different IC measures adopted in literature, the advantages of adopting semi-qualitative measures, and the lack of an agreed system for IC evaluation, the purpose of the paper is to analyse literature on IC measurement following a semi-qualitative approach, with the final intent to build an IC measurement framework. Design/methodology/approach: A literature review on IC measurement system, following a semi-qualitative approach, has been conducted and analysed, in order to re-organize and synthesize all items used in previous researches. Findings: An integrated framework emerged from this research and it constitutes an IC  measurement system, created gathering and integrating different items previously adopted in literature. Each of these variables has been organized in categories belonging to one of the three main components of IC: human capital, internal structural capital and relational capital. Originality/value: This research provides an integrated tool for IC evaluation, fostering toward a well agreed measurement system that is still lacking in literature. This framework could be interesting  not only for the academic world, which in the last two decades reveals increasing attention to IC, but also for the management of the companies, that with IC measurement can increase awareness of the firm’s value and develop internal auditing system to support the management of these assets. Moreover, it could be a useful instrument for the communication of IC value to the external stakeholders, as customers, suppliers and especially shareholders, and to investors and financial analysts.

  14. Denitrification of nitrate and nitrite by 'Candidatus Accumulibacter phosphatis' clade IC.

    Science.gov (United States)

    Saad, Sondos A; Welles, Laurens; Abbas, Ben; Lopez-Vazquez, Carlos M; van Loosdrecht, Mark C M; Brdjanovic, Damir

    2016-11-15

    Phosphate accumulating organisms (PAO) are assumed to use nitrate as external electron acceptor, allowing an efficient integration of simultaneous nitrogen and phosphate removal with minimal organic carbon (COD) requirements. However, contradicting findings appear in literature regarding the denitrification capacities of PAO due to the lack of clade specific highly enriched PAO cultures. Whereas some studies suggest that only PAO clade I may be capable of using nitrate as external electron acceptor for anoxic P-uptake, other studies indicate that PAO clade II may be responsible for anoxic P-removal. In the present study, a highly enriched PAO clade IC culture (>99% according to FISH) was cultivated in an SBR operated under Anaerobic/Oxic conditions and subsequently exposed to Anaerobic/Anoxic/Oxic conditions using nitrate as electron acceptor. Before and after acclimatization to the presence of nitrate, the aerobic and anoxic (nitrate and nitrite) activities of the PAO I culture were assessed through the execution of batch tests using either acetate or propionate as electron donor. In the presence of nitrate, significant P-uptake by PAO I was not observed before or after acclimatization. Using nitrite as electron acceptor, limited nitrite removal rates were observed before acclimatization with lower rates in the acetate fed reactor without P-uptake and slightly higher in the propionate fed reactor with a marginal anoxic P-uptake. Only after acclimatization to nitrate, simultaneous P and nitrite removal was observed. This study suggests that PAO clade IC is not capable of using nitrate as external electron acceptor for anoxic P-removal. The elucidation of the metabolic capacities for individual PAO clades helps in better understanding and optimization of the relation between microbial ecology and process performance in enhanced biological phosphate removal processes. Copyright © 2016 Elsevier Ltd. All rights reserved.

  15. WIDE-FIELD SURVEY OF EMISSION-LINE STARS IN IC 1396

    Energy Technology Data Exchange (ETDEWEB)

    Nakano, M. [Faculty of Education and Welfare Science, Oita University, Oita 870-1192 (Japan); Sugitani, K. [Graduate School of Natural Sciences, Nagoya City University, Mizuho-ku, Nagoya 467-8501 (Japan); Watanabe, M. [Department of Cosmosciences, Hokkaido University, Sapporo 060-0810 (Japan); Fukuda, N. [Department of Computer Simulation, Okayama University of Science, 1-1 Ridai-cho, Okayama 700-0005 (Japan); Ishihara, D. [Department of Physics, Nagoya University, Furo-cho, Chikusa-ku, Nagoya 464-8602 (Japan); Ueno, M., E-mail: mnakano@oita-u.ac.jp [Institute of Space and Astronautical Science, Japan Aerospace Exploration Agency, 3-1-1 Yoshino-dai, Chuo-ku, Sagamihara 252-5210 (Japan)

    2012-03-15

    We have made an extensive survey of emission-line stars in the IC 1396 H II region to investigate the low-mass population of pre-main-sequence (PMS) stars. A total of 639 H{alpha} emission-line stars were detected in an area of 4.2 deg{sup 2} and their i' photometry was measured. Their spatial distribution exhibits several aggregates near the elephant trunk globule (Rim A) and bright-rimmed clouds at the edge of the H II region (Rim B and SFO 37, 38, 39, 41), and near HD 206267, which is the main exciting star of the H II region. Based on the extinction estimated from the near-infrared color-color diagram, we have selected PMS star candidates associated with IC 1396. The age and mass were derived from the extinction-corrected color-magnitude diagram and theoretical PMS tracks. Most of our PMS candidates have ages of <3 Myr and masses of 0.2-0.6 M{sub Sun }. Although it appears that only a few stars were formed in the last 1 Myr in the east region of the exciting star, the age difference among subregions in our surveyed area is not clear from the statistical test. Our results may suggest that massive stars were born after the continuous formation of low-mass stars for 10 Myr. The birth of the exciting star could be the late stage of slow but contiguous star formation in the natal molecular cloud. It may have triggered the formation of many low-mass stars at the dense inhomogeneity in and around the H II region by a radiation-driven implosion.

  16. Qualitative assessment of IC50 values of inhibitors of the neuronal nicotinic acetylcholine receptor using a single chromatographic experiment and multivariate cluster analysis.

    Science.gov (United States)

    Jozwiak, Krzysztof; Moaddel, Ruin; Yamaguchi, Rika; Ravichandran, Sarangan; Collins, Jack R; Wainer, Irving W

    2005-05-05

    It has been widely demonstrated that affinity chromatography can be used to derive binding affinities, and that these affinities can be correlated to data obtained using standard techniques such as membrane binding, ultrafiltration and equilibrium dialysis. The purpose of this study is to evaluate the use of immobilized nicotinic acetylcholine receptor stationary phase in chromatographic experiments to assess the functional activity of series of noncompetitive inhibitors (NCIs) as reflected in their IC50 values. Chromatographically determined retention values and computer generated molecular descriptors were obtained for 29 compounds and the data were analyzed by cluster analysis. The approach qualitatively ranked the test compounds as efficient NCIs (low IC50 values) or poor NCIs (high IC50 values). The data obtained with the 29 compounds used in this study demonstrate that the experimental approach had been able to place 25 of these compounds in the correct IC(50) clusters. To our knowledge, this is the first relationship established between chromatographic retention and IC50 for membrane-bound receptors. These results suggest that the chromatographic approach may be useful in development of lead drug candidates including the determination of off-target binding.

  17. Prenatal immune challenge in rats: altered responses to dopaminergic and glutamatergic agents, prepulse inhibition of acoustic startle, and reduced route-based learning as a function of maternal body weight gain after prenatal exposure to poly IC.

    Science.gov (United States)

    Vorhees, Charles V; Graham, Devon L; Braun, Amanda A; Schaefer, Tori L; Skelton, Matthew R; Richtand, Neil M; Williams, Michael T

    2012-08-01

    Prenatal maternal immune activation has been used to test the neurodevelopmental hypothesis of schizophrenia. Most of the data are in mouse models; far less is available for rats. We previously showed that maternal weight change in response to the immune activator polyinosinic-polycytidylic acid (Poly IC) in rats differentially affects offspring. Therefore, we treated gravid Harlan Sprague-Dawley rats i.p. on embryonic day 14 with 8 mg/kg of Poly IC or Saline. The Poly IC group was divided into those that lost or gained the least weight, Poly IC (L), versus those that gained the most weight, Poly IC (H), following treatment. The study design controlled for litter size, litter sampling, sex distribution, and test experience. We found no effects of Poly IC on elevated zero maze, open-field activity, object burying, light-dark test, straight channel swimming, Morris water maze spatial acquisition, reversal, or shift navigation or spatial working or reference memory, or conditioned contextual or cued fear or latent inhibition. The Poly IC (H) group showed a significant decrease in the rate of route-based learning when visible cues were unavailable in the Cincinnati water maze and reduced prepulse inhibition of acoustic startle in females, but not males. The Poly IC (L) group exhibited altered responses to acute pharmacological challenges: exaggerated hyperactivity in response to (+)-amphetamine and an attenuated hyperactivity in response to MK-801. This model did not exhibit the cognitive, or latent inhibition deficits reported in Poly IC-treated rats but showed changes in response to drugs acting on neurotransmitter systems implicated in the pathophysiology of schizophrenia (dopaminergic hyperfunction and glutamatergic hypofunction).

  18. An approach for IC engine coolant energy recovery based on low-temperature organic Rankine cycle

    Institute of Scientific and Technical Information of China (English)

    付建勤; 刘敬平; 徐政欣; 邓帮林; 刘琦

    2015-01-01

    To promote the fuel utilization efficiency of IC engine, an approach was proposed for IC engine coolant energy recovery based on low-temperature organic Rankine cycle (ORC). The ORC system uses IC engine coolant as heat source, and it is coupled to the IC engine cooling system. After various kinds of organic working media were compared, R124 was selected as the ORC working medium. According to IC engine operating conditions and coolant energy characteristics, the major parameters of ORC system were preliminary designed. Then, the effects of various parameters on cycle performance and recovery potential of coolant energy were analyzed via cycle process calculation. The results indicate that cycle efficiency is mainly influenced by the working pressure of ORC, while the maximum working pressure is limited by IC engine coolant temperature. At the same working pressure, cycle efficiency is hardly affected by both the mass flow rate and temperature of working medium. When the bottom cycle working pressure arrives at the maximum allowable value of 1.6 MPa, the fuel utilization efficiency of IC engine could be improved by 12.1%. All these demonstrate that this low-temperature ORC is a useful energy-saving technology for IC engine.

  19. EVN observations of the OH megamaser galaxies Mrk 231 and IC 694

    NARCIS (Netherlands)

    Klockner, HR; Baan, WA; Migenes,; Reid, MJ

    2002-01-01

    We present EVN observations of hydroxyl (OH) main-line emission in two megamaser sources Mrk 231 and IC 694. The observations indicate that the broad maser emission lines originate within the nuclear regions. A single 1667 MHz main-line feature is seen at the nucleus of IC 694. In Mrk 231 both

  20. Adopting De Novo Programming Approach on IC Design Service Firms Resources Integration

    Directory of Open Access Journals (Sweden)

    James K. C. Chen

    2014-01-01

    Full Text Available The semiconductor industry has very important position in computer industry, ICT field, and new electronic technology developing. The IC design service is one of key factor of semiconductor industry development. There are more than 365 IC design service firms have been established around Hsinchu Science Park in Taiwan. Building an efficient planning model for IC design service firm resources integrating is very interest issue. This study aims to construct a planning model for IC design service firm implementation resources integration. This study uses the De Novo programming as an approach of criteria alternative to achieve optimal resource allocation on IC design firm. Results show the IC design service firm should conduct open innovation concept and utilizes design outsourcing obtains cost down and enhance IC design service business performance. This plan model of De Novo programming is not only for IC design service firm and also can apply to the other industrial implementation strategic alliance/integrating resource. This plan model is a universal model for the others industries field.

  1. Application of IC Card License for Road Transportation in Commercial Vehicles Supervision and Service

    Directory of Open Access Journals (Sweden)

    Li Weiwei

    2016-01-01

    Full Text Available IC card electronic license for road transport includes the IC card commercial vehicle’s certificate and IC card practitioner’s qualification certificate. In China, the IC card electronic license for road transport is the electronic ID card which must be carried by each commercial vehicles and practitioners. This paper briefly introduces the basic situation, data format and security keys architecture of IC card electronic license for road transportation of China. In order to strengthen the supervision and service of commercial vehicles, this paper puts forward the overall application framework of IC card electronic license for road transport. The application examples of IC card license in the supervision of passenger station, dangerous goods transport management, governance overload and logistics park and port area management are discussed. The practical application results show that the application of IC card electronic license for road transport is an important technical means to improve the supervision ability and service quality of the road transportation industry.

  2. A Solder Based Self Assembly Project in an Introductory IC Fabrication Course

    Science.gov (United States)

    Rao, Madhav; Lusth, John C.; Burkett, Susan L.

    2015-01-01

    Integrated circuit (IC) fabrication principles is an elective course in a senior undergraduate and early graduate student's curriculum. Over the years, the semiconductor industry relies heavily on students with developed expertise in the area of fabrication techniques, learned in an IC fabrication theory and laboratory course. The theory course…

  3. Innovative Teaching of IC Design and Manufacture Using the Superchip Platform

    Science.gov (United States)

    Wilson, P. R.; Wilcock, R.; McNally, I.; Swabey, M.

    2010-01-01

    This paper describes how an intelligent chip architecture has allowed a large cohort of undergraduate (UG) students to be given effective practical insight into integrated circuit (IC) design by designing and manufacturing their own ICs. To achieve this, an efficient chip architecture, the "Superchip," was developed, which allows multiple student…

  4. Dicty_cDB: FC-IC0750 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available AG--- Homology vs CSM-cDNA Score E Sequences producing significant alignments: (bits) Value FC-IC0750 (FC-IC...133 8e-31 own update 2004. 5.10 Homology vs DNA Score E Sequences producing significant alignments: (bits) Value... 1 dna update 2002. 9. 7 Homology vs Protein Score E Sequences producing significant alignments: (bits) Value

  5. 30 CFR 57.22313 - Explosion-protection systems (I-C mines).

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Explosion-protection systems (I-C mines). 57... MINES Safety Standards for Methane in Metal and Nonmetal Mines Equipment § 57.22313 Explosion-protection systems (I-C mines). Pressure-relief systems including vents, or explosion suppression systems, shall...

  6. Data of evolutionary structure change: 1DUIA-1IC6A [Confc[Archive

    Lifescience Database Archive (English)

    Full Text Available 1DUIA-1IC6A 1DUI 1IC6 A A --AKCVSYGVSQIKAPALHS----------QGYTGSNVK...EE HHHHHHHHHHHHHHHHH - HHHHHHHHHH EEE - 0 1DUI... A 1DUIA GTVLA---...0531006 1 1DUI... A 1DUIA NTTTK---LGNSF

  7. 30 CFR 57.22602 - Blasting from the surface (I-C mines).

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Blasting from the surface (I-C mines). 57.22602... Standards for Methane in Metal and Nonmetal Mines Explosives § 57.22602 Blasting from the surface (I-C mines). (a) All blasting shall be initiated from the surface after all persons are out of the mine and...

  8. TTLIC与CMOSIC的兼容性和差异性问题%THE COMPATIBILITY AND DIFFERENCE BETWEEN TTL IC AND CMOS IC

    Institute of Scientific and Technical Information of China (English)

    黄发忠

    2015-01-01

    Along with the rapid development of electronics,communications,computers,internet and other technologies,various functional semiconductor integrated circuits (referred to as IC)ever accelerating progress from small scale,medium -scale,large -scale to very large scale,which are used more and more widely.How to correctly understand and use the IC is an issue we often encounter.Taking the digital IC for ample,this paper discusses the compatibility and difference between TTLIC and CMOS IC from small scale,medium scale,large sale to very large scale,and special attention is paid to the small and medium scale.%伴随着电子、通信、计算机、互联网等技术的飞速发展,各种功能的半导体集成电路(简称 IC)不断地推陈出新,从小规模、中规模、大规模到超大规模,集成电路产品用途越来越广泛。如何正确认识和使用 IC 是大家经常遇到的问题,作者以数字集成电路芯片为例,按照小规模、中规模、大规模到超大规模分类了解,重点探讨中小规模 TTL IC 与 CMOS IC 使用时的兼容性和差异性问题,以便正确区别和选择使用。

  9. Prion seeding activities of mouse scrapie strains with divergent PrPSc protease sensitivities and amyloid plaque content using RT-QuIC and eQuIC.

    Directory of Open Access Journals (Sweden)

    Sarah Vascellari

    Full Text Available Different transmissible spongiform encephalopathy (TSE-associated forms of prion protein (e.g. PrP(Sc can vary markedly in ultrastructure and biochemical characteristics, but each is propagated in the host. PrP(Sc propagation involves conversion from its normal isoform, PrP(C, by a seeded or templated polymerization mechanism. Such a mechanism is also the basis of the RT-QuIC and eQuIC prion assays which use recombinant PrP (rPrP(Sen as a substrate. These ultrasensitive detection assays have been developed for TSE prions of several host species and sample tissues, but not for murine models which are central to TSE pathogenesis research. Here we have adapted RT-QuIC and eQuIC to various murine prions and evaluated how seeding activity depends on glycophosphatidylinositol (GPI anchoring and the abundance of amyloid plaques and protease-resistant PrP(Sc (PrP(Res. Scrapie brain dilutions up to 10(-8 and 10(-13 were detected by RT-QuIC and eQuIC, respectively. Comparisons of scrapie-affected wild-type mice and transgenic mice expressing GPI anchorless PrP showed that, although similar concentrations of seeding activity accumulated in brain, the heavily amyloid-laden anchorless mouse tissue seeded more rapid reactions. Next we compared seeding activities in the brains of mice with similar infectivity titers, but widely divergent PrP(Res levels. For this purpose we compared the 263K and 139A scrapie strains in transgenic mice expressing P101L PrP(C. Although the brains of 263K-affected mice had little immunoblot-detectable PrP(Res, RT-QuIC indicated that seeding activity was comparable to that associated with a high-PrP(Res strain, 139A. Thus, in this comparison, RT-QuIC seeding activity correlated more closely with infectivity than with PrP(Res levels. We also found that eQuIC, which incorporates a PrP(Sc immunoprecipitation step, detected seeding activity in plasma from wild-type and anchorless PrP transgenic mice inoculated with 22L, 79A and/or RML

  10. Titanium-Based Getter Solution for Wafer-Level MEMS Vacuum Packaging

    Science.gov (United States)

    Chidambaram, Vivek; Ling, Xie; Bangtao, Chen

    2013-03-01

    Ultrahigh-vacuum conditions can be achieved by employing porous absorbent materials such as Ti, Zr, Ta, and Yt. Commercial getters are primarily Zr-based, since Zr possesses the best adsorption characteristics. Titanium is not considered as a candidate, since adsorption of gases by Ti is significantly reduced due to oxidation and other contamination. In the present work, it is demonstrated that the adsorption property of Ti can be substantially enhanced and benchmarked against other Zr-based commercial getters by employing a sacrificial layer such as Ni over Ti, and also by using other surface engineering techniques. It has been confirmed that, in addition to the activation temperature, the vacuum level during getter activation also plays a pivotal role in influencing the adsorption characteristics of Ti. It has been determined that the getter life could be significantly improved by the reversible adsorption characteristic of H2 gas, facilitating regeneration cycles.

  11. Integrated Solar Power Converters: Wafer-Level Sub-Module Integrated DC/DC Converter

    Energy Technology Data Exchange (ETDEWEB)

    None

    2012-02-09

    Solar ADEPT Project: CU-Boulder is developing advanced power conversion components that can be integrated into individual solar panels to improve energy yields. The solar energy that is absorbed and collected by a solar panel is converted into useable energy for the grid through an electronic component called an inverter. Many large, conventional solar energy systems use one, central inverter to convert energy. CU-Boulder is integrating smaller, microinverters into individual solar panels to improve the efficiency of energy collection. The University’s microinverters rely on electrical components that direct energy at high speeds and ensure that minimal energy is lost during the conversion process—improving the overall efficiency of the power conversion process. CU-Boulder is designing its power conversion devices for use on any type of solar panel.

  12. Self-adaptive phosphor coating technology for wafer-level scale chip packaging

    Institute of Scientific and Technical Information of China (English)

    Zhou Linsong; Rao Haibo; Wang Wei; Wan Xianlong; Liao Junyuan; Wang Xuemei; Zhou Da

    2013-01-01

    A new self-adaptive phosphor coating technology has been successfully developed,which adopted a slurry method combined with a self-exposure process.A phosphor suspension in the water-soluble photoresist was applied and exposed to LED blue light itself and developed to form a conformal phosphor coating with selfadaptability to the angular distribution of intensity of blue light and better-performing spatial color uniformity.The self-adaptive phosphor coating technology had been successfully adopted in the wafer surface to realize a waferlevel scale phosphor conformal coating.The first-stage experiments show satisfying results and give an adequate demonstration of the flexibility of self-adaptive coating technology on application of WLSCP.

  13. An electret-based energy harvesting device with a wafer-level fabrication process

    DEFF Research Database (Denmark)

    Crovetto, Andrea; Wang, Fei; Hansen, Ole

    2013-01-01

    This paper presents a MEMS energy harvesting device which is able to generate power from two perpendicular ambient vibration directions. A CYTOP polymer is used both as the electret material for electrostatic transduction and as a bonding interface for low-temperature wafer bonding. The device...... is also discussed. With a final chip size of about 1 cm2, a power output of 32.5 nW is successfully harvested with an external load of 17 MΩ, when a harmonic vibration source with an RMS acceleration amplitude of 0.03 g (∼0.3 m s−2) and a resonant frequency of 179 Hz is applied. These results can...

  14. Substrate Crosstalk Suppression Using Wafer-Level Packaging: Metalized Through-Substrate Trench Approach

    NARCIS (Netherlands)

    Sinaga, S.M.

    2010-01-01

    The demand for miniaturization technology has been increasing over the last decades. Consumer electronics end-users often, if not always, go for more functionality and practicality. This is translated into systems that are more complex and yet smaller in size such as smart cellular phones and portab

  15. Wafer-level packaging with compression-controlled seal ring bonding

    Science.gov (United States)

    Farino, Anthony J

    2013-11-05

    A device may be provided in a sealed package by aligning a seal ring provided on a first surface of a first semiconductor wafer in opposing relationship with a seal ring that is provided on a second surface of a second semiconductor wafer and surrounds a portion of the second wafer that contains the device. Forcible movement of the first and second wafer surfaces toward one another compresses the first and second seal rings against one another. A physical barrier against the movement, other than the first and second seal rings, is provided between the first and second wafer surfaces.

  16. Material size effects on crack growth along patterned wafer-level Cu–Cu bonds

    DEFF Research Database (Denmark)

    Tvergaard, Viggo; Niordson, Christian Frithiof; Hutchinson, John W.

    2013-01-01

    The role of micron-scale patterning on the interface toughness of bonded Cu-to-Cu nanometer-scale films is analyzed, motivated by experimental studies of Tadepalli, Turner and Thompson. In the experiments 400nm Cu films were deposited in various patterns on Si wafer substrates and then bonded...... together. Crack growth along the bond interface is here studied numerically using finite element analyses. The experiments have shown that plasticity in the Cu films makes a major contribution to the macroscopic interface toughness. To account for the size dependence of the plastic flow a strain gradient...... plasticity model is applied here for the metal. A cohesive zone model is applied to represent the crack growth along the bond between the two Cu films. This cohesive zone model incorporates the effect of higher order stresses in the continuum, such that the higher order tractions on the crack faces decay...

  17. Hybrid Wafer-Level Packaging for RF-MEMS and Optoelectronic Applications

    NARCIS (Netherlands)

    Tian, J.

    2013-01-01

    The current trend in electronic packaging research is to integrate more functions into one package, reduce electrical path parasitic, and increase the heat conduction in order to make the final packaged system smaller, more reliable, more functional and more complete, while keeping the packaging

  18. Effects of wafer-level packaging on millimetre-wave antennas

    KAUST Repository

    Abutarboush, Hattan

    2011-11-01

    A cost-effective antenna package suitable for mass production mm-wave applications is investigated. Different packaging material that can be possibly used in mm-wave antennas are presented and compared. Moreover, this study investigates different methods of packaging millimetre-wave (60 GHz) MEMS antennas. The paper first introduces the custom needs for optimum operation of the MEMS antenna and then examines the current available enabling technologies for packaging. The sensitivity of the antenna\\'s reflection coefficient, gain and radiation efficiency to the packaging environment is investigated through EM simulations. © 2011 IEEE.

  19. Wafer level reliability monitoring strategy of an advanced multi-process CMOS foundry

    NARCIS (Netherlands)

    Scarpa, Andrea; Tao, Guoqiao; Kuper, F.G.

    2000-01-01

    In an advanced multi-process CMOS foundry it is strategically important to make use of an optimum reliability monitoring strategy, in order to be able to run well controlled processes. Philips Semiconductors Business Unit Foundries wafer fab MOS4YOU has developed an end-of-line ultra-fast

  20. Hybrid Wafer-Level Packaging for RF-MEMS and Optoelectronic Applications

    NARCIS (Netherlands)

    Tian, J.

    2013-01-01

    The current trend in electronic packaging research is to integrate more functions into one package, reduce electrical path parasitic, and increase the heat conduction in order to make the final packaged system smaller, more reliable, more functional and more complete, while keeping the packaging cos