WorldWideScience

Sample records for vacuum soldering process

  1. Features of Pd-Ni-Fe solder system for vacuum brazing of low alloy steels

    International Nuclear Information System (INIS)

    Radzievskij, V.N.; Kurochko, R.S.; Lotsmanov, S.N.; Rymar', V.I.

    1975-01-01

    The brazing solder of the Pd-Ni-Fe alloyed with copper and lithium, in order to decrease the melting point and provide for a better spreading, when soldered in vacuum ensures a uniform strength of soldered joints with the base metal of low-alloyed steels of 34KHNIM-type. The properties of low-alloyed steel joints brazed with the Pd-Ni-Fe-system solder little depend on the changes in the soldering parameters. The soldered joint keeps a homogeneous structure after all the stages of heat treatment (annealing, quenching and tempering)

  2. A flip chip process based on electroplated solder bumps

    Science.gov (United States)

    Salonen, J.; Salmi, J.

    1994-01-01

    Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin count and packaging density and superior electrical performance. The chips are mounted upside down on the substrate, which can be made of silicon, ceramic, glass or - in some cases - even PCB. The extra processing steps required for chips are the deposition of a suitable thin film metal layer(s) on the standard Al pad and the formation of bumps. Also, the development of new fine line substrate technologies is required to utilize the full potential of the technology. In our bumping process, bump deposition is done by electroplating, which was chosen for its simplicity and economy. Sputter deposited molybdenum and copper are used as thin film layers between the aluminum pads and the solder bumps. A reason for this choice is that the metals can be selectively etched after bumping using the bumps as a mask, thus circumventing the need for a separate mask for etching the thin film metals. The bumps are electroplated from a binary Pb-Sn bath using a thick liquid photoresist. An extensively modified commercial flip chip bonder is used for alignment and bonding. Heat assisted tack bonding is used to attach the chips to the substrate, and final reflow joining is done without flux in a vacuum furnace.

  3. Soldering handbook

    CERN Document Server

    Vianco, Paul T

    1999-01-01

    Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

  4. Optimization of the soldering process by the DMAIC methodology

    Directory of Open Access Journals (Sweden)

    Michał Zasadzień

    2016-06-01

    Full Text Available The chapter presents the use of the DMAIC method for the analysis and improvement of the process of soldering pins in a plug connecting a bundle of wires to the board of a controller; a part of the steering system of a car. The main problem in the soldering process, that is an unsatisfactory share of bad soldered connections between the board and the plug and the instability of that number, was identified by means of a five-phase improvement process. Key points and main causes of the defect were pointed out, and process improvement measures were suggested. Due to the analysis conducted and the correct implementation of improvement measures the share of defective connections has been decreased twofold.

  5. Soldering in electronics assembly

    CERN Document Server

    Judd, Mike

    2013-01-01

    Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

  6. Features of soldering of molybdenum a lols

    International Nuclear Information System (INIS)

    Grishin, V.L.; Rybkin, B.V.; Cherkasov, A.F.

    1980-01-01

    Soldering features of complex-alloy molybdenum alloys were investigated in comparison with alloys based on solid solutions. Soldering features of heterogeneous molybdenum base alloys were investigated using samples of 0.5-1.O mm sheets with the strain of about 95% made of ingots which had been smelted in arc vacuum furnaces. The soldering of samples was carried out in 5x1O -5 mm Hg vacuum using different sources of heating: radiation, electron-ray and contact. It was shown that heat-resisting soldered joints of heterogeneous molybdenum alloys could be produced using zirconium and niobium base solders containing the most effective hardeners of the parent material (titanum, vanadium, tantalum, molybdenum, tungsten). To preserve high mechanical properties of heterogeneous alloys it was expedient to use for welding local heating sources which permitted to decrease considerably temperature- time conditions of the process

  7. Contamination profile on typical printed circuit board assemblies vs soldering process

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

  8. Spontaneous soldering

    International Nuclear Information System (INIS)

    Percacci, R.

    1984-01-01

    It is proposed that the soldering form of general relativity be treated as a dynamical variable. This gives rise to the possibility of treating the linear connection on (n-dimensional) spacetime and an internal O(k)-Yang-Mills field as different components of the same O(N) gauge field (N= n+k). The distinction between gravitational and Yang-Mills interactions is due to a kind of Higgs mechanism driven by the vacuum expectation value of the soldering form. (orig.)

  9. Improvement of the auto wire feeder machine in a de-soldering process

    Directory of Open Access Journals (Sweden)

    Niramon Nonkhukhetkhong

    2016-10-01

    Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

  10. Characterizing performances of solder paste printing process at flexible manufacturing lines

    International Nuclear Information System (INIS)

    Siew, Jit Ping; Low, Heng Chin; Teoh, Ping Chow

    2015-01-01

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter

  11. Characterizing performances of solder paste printing process at flexible manufacturing lines

    Energy Technology Data Exchange (ETDEWEB)

    Siew, Jit Ping; Low, Heng Chin [University of Science Malaysia, 11800 Minden, Penang (Malaysia); Teoh, Ping Chow [Wawasan Open University, 54 Jalan Sultan Ahmad Shah, 10050 Penang (Malaysia)

    2015-02-03

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter.

  12. Processing and Characterization of NiTi Shape Memory Alloy Particle Reinforced Sn-In Solders

    National Research Council Canada - National Science Library

    Chung, Kohn C

    2006-01-01

    .... In previous work, it was proposed that reinforcement of solder by NiTi shape memory alloy particles to form smart composite solder reduces the inelastic strain of the solder and hence, may enhance...

  13. Use of vacuum in processing of uranium

    International Nuclear Information System (INIS)

    Saify, M.T.; Rai, C.B.; Singh, S.P.; Singh, R.P.

    2003-01-01

    Full text: Natural uranium in the form of metal and alloys with suitable heat treatment are being used as fuel in research and some of the power reactors. The fuel is required to satisfy the purity specification from the criteria of neutron economy, corrosion resistance and fabricability. Uranium and its alloys fall under the category of reactive materials. They readily react with atmospheric air to form oxides. If molten uranium is exposed to atmosphere, it reacts violently with atmospheric gases and moisture, leading to explosion in extreme cases. Hence, protective inert atmosphere or high vacuum is required in processing of the materials especially during the melting and casting operation. Vacuum is preferred for melting and remelting of metals and alloys to remove the gaseous and high volatile impurities, to improve the mechanical properties of the material. Also, under vacuum sound castings are produced for further processing by mechanical working or use in casting forms. The addition of reactive alloying elements in uranium is efficiently carried out under vacuum. The paper highlights vacuum systems deployed and applications of vacuum in various operations involved in the processing of uranium and its alloys

  14. Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

    International Nuclear Information System (INIS)

    Chellvarajoo, Srivalli; Abdullah, M.Z.; Samsudin, Z.

    2015-01-01

    Highlights: • Fe 2 NiO 4 nanoparticles added into SAC 305 by mechanical mixing to form nanocomposite solder paste. • Nanoparticles in the composite solder travels with flux to the outermost surface after reflow. • The intermetallics compound reduced with the addition of nanoparticles into solder paste. • The hardness increased with the addition of limited percentage of nanoparticles into SAC 305. - Abstract: This study investigates the effects of the addition of Fe 2 NiO 4 nanoparticles into a SAC-305 lead-free solder paste. Iron, nickel, and oxide nano-elements were mixed with Pb-free solder alloying elements to produce a new form of nanocomposite solder paste, which can be a promising material in electronic packaging. The SAC-305 was mechanically added with 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles. The migration of nanoparticles in the nanocomposite solder paste to the outermost surface was clarified using the copper ‘sandwich’ method, which was performed after the reflow soldering process. Varying amounts of nanoparticles in the SAC-305 affected the IMC thickness and mechanical properties of the nanocomposite solder paste. The IMC thickness was reduced by 29.15%, 42.37%, and 59.00% after adding 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles in the SAC-305, respectively. However, via nanoindentation method, the hardness of the nanocomposite solder was improved by 44.07% and 56.82% after adding 0.5 and 1.5 wt.% of Fe 2 NiO 4 nanoparticles, respectively. If the addition of Fe 2 NiO 4 nanoparticle exceeded 1.5 wt.%, the hardness increased infinitely

  15. On the problem of soldering refractory metals with silver-containing solders

    International Nuclear Information System (INIS)

    Anikeev, E.F.; Andryushchenko, V.I.; Chepelenko, V.N.; Batov, V.M.

    1981-01-01

    The processes of wetting, spreading and interphase interactions of copper-silver liquid alloys alloyed with Ni and Si, with niobium, tantalum, molybdenum, tungsten, 12Kh18N10T steel and nickel are studied. It has been determined that Ni or Si additions into the copper-silver solder improve the wetting and adhesion. When soldering with the alloy containing Ni additions, the strength of a soldered Joint grows with the increase of soldering duration while soldering with the alloy containing Si additions, the strength decreases. That is why Ni-containing solders are preferable for soldering thick-walled structures, and Si-containing solders - for thin-walled structures [ru

  16. Characterization of lead-free solders for electronic packaging

    Science.gov (United States)

    Ma, Hongtao

    The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (Th > 0.5T m even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn-Pb solder alloys. In this research, mechanical measurements of isothermal aging effects and the resulting changes in the materials behavior of lead-free solders were performed. A novel specimen preparation procedure was developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process. Using specimens fabricated with the developed procedure, isothermal aging effects and viscoplastic material behavior evolution have been characterized for 95.5Sn-4.0Ag-0.5Cu (SAC405) and 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solders, which are commonly used as the solder ball alloy in lead-free BGAs and other components. Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Up to 40% reduction in tensile strength was observed for water quenched specimens after two months of aging at room temperature. Creep deformation also increased dramatically with increasing aging durations. Microstructural changes during room temperature aging were also observed and recorded for the solder alloys and correlated with the observed mechanical behavior changes. Aging effects at elevated temperatures for up to 6 months were also investigated. Thermal aging caused significant tensile strength loss and deterioration of creep deformation. The thermal aging results also showed that after an initial tensile strength drop, the Sn-Pb eutectic solder reached a relatively stable stage after 200 hours of aging. However, for SAC alloy, both the tensile and

  17. Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process

    Science.gov (United States)

    Mallik, S.; Bauer, R.; Hübner, F.; Ekere, N. N.

    2011-01-01

    Solder paste is the most widely used interconnection material in the electronic assembly process for attaching electronic components/devices directly onto the surface of printed circuit boards, using stencil printing process. This paper evaluates the performance of three different commercially available Sn-Ag-Cu solder pastes formulated with different particle size distributions (PSD), metal content and alloy composition. A series of stencil printing tests were carried out using a specially designed stencil of 75 μm thickness and apertures of 300×300 μm2 dimension and 500 μm pitch sizes. Solder paste printing behaviors were found related to attributes such as slumping and surface tension and printing performance was correlated with metal content and PSD. The results of the study should benefit paste manufacturers and SMT assemblers to improve their products and practices.

  18. Processing and characterization of device solder interconnection and module attachment for power electronics modules

    Science.gov (United States)

    Haque, Shatil

    This research is focused on the processing of an innovative three-dimensional packaging architecture for power electronics building blocks with soldered device interconnections and subsequent characterization of the module's critical interfaces. A low-cost approach termed metal posts interconnected parallel plate structure (MPIPPS) was developed for packaging high-performance modules of power electronics building blocks (PEBB). The new concept implemented direct bonding of copper posts, not wire bonding of fine aluminum wires, to interconnect power devices as well as joining the different circuit planes together. We have demonstrated the feasibility of this packaging approach by constructing PEBB modules (consisting of Insulated Gate Bipolar Transistors (IGBTs), diodes, and a few gate driver elements and passive components). In the 1st phase of module fabrication with IGBTs with Si3N 4 passivation, we had successfully fabricated packaged devices and modules using the MPIPPS technique. These modules were tested electrically and thermally, and they operated at pulse-switch and high power stages up to 6kW. However, in the 2nd phase of module fabrication with polyimide passivated devices, we experienced significant yield problems due to metallization difficulties of these devices. The under-bump metallurgy scheme for the development of a solderable interface involved sputtering of Ti-Ni-Cu and Cr-Cu, and an electroless deposition of Zn-Ni-Au metallization. The metallization process produced excellent yield in the case of Si3N4 passivated devices. However, under the same metallization schemes, devices with a polyimide passivation exhibited inconsistent electrical contact resistance. We found that organic contaminants such as hydrocarbons remain in the form of thin monolayers on the surface, even in the case of as-received devices from the manufacturer. Moreover, in the case of polyimide passivated devices, plasma cleaning introduced a few carbon constituents on the

  19. The micro-droplet behavior of a molten lead-free solder in an inkjet printing process

    International Nuclear Information System (INIS)

    Tsai, M H; Chou, H H; Hwang, W S

    2009-01-01

    An experimental investigation on the droplet formation of molten Sn3.0 wt%Ag0.5 wt%Cu alloy by an inkjet printing process was conducted. The printing process used a piezoelectric print head with a nozzle orifice diameter of 50 µm. Micro-droplets of a molten lead-free solder were ejected at 230 °C. The print head was driven by a bipolar pulse 40 V in amplitude. The major variables for this study were two pulse times; t rise /t finalrise and t fall , as well as N 2 back-pressure in the molten solder reservoir. Under various printing conditions, extrusion of the liquid column, contraction of liquid thread and pinch-off of liquid thread at nozzle exit were observed by monitoring the dynamics of the molten solder droplet ejection process. The droplet formation was found to be insensitive to t rise and t finalrise in the range of 250–1000 µs. The behavior of droplet formation was, however, significantly affected by the transfer rate, t fall , in the range of 30–60 µs and t fall of 50 µs yielded the most desirable condition of single droplet formation. The N 2 back-pressure was also found to be critical, where a back pressure between 10 and 21 kPa could give the desirable single-droplet formation condition

  20. process controller for induction vacuum brazing

    International Nuclear Information System (INIS)

    Aldea, A.

    2016-01-01

    A brazing operation involves joining two parts made of different materials, using a filler material that has a melting temperature lower than the base materials used. The temperature of the process must be carefully controlled, sometimes with an accuracy of about 1°C, because overshooting the prescribed temperature results in detrimental metallurgic phenomena and joints of poor quality. The brazing system is composed of an operating cabinet, a mid-frequency generator, a vacuum chamber with an induction coil inside and the parts that have to be brazed. Until now, to operate this system two operators were required: one to continuously read the temperature with an optical pyrometer and another to manually adjust the current in the induction coil according to his intuition and prediction gained only by experience. The improvement that we made to the system involved creating an automatic temperature control unit, using a PID closed loop controller that reads the temperature of the parts and adjusts automatically the current in the coil. Using the PID controller, the brazing engineer can implement a certain temperature slope for the current brazing process. (authors)

  1. Vacuum-bag-only processing of composites

    Science.gov (United States)

    Thomas, Shad

    Ultrasonic imaging in the C-scan mode in conjunction with the amplitude of the reflected signal was used to measure flow rates of an epoxy resin film penetrating through the thickness of single layers of woven carbon fabric. Assemblies, comprised of a single layer of fabric and film, were vacuum-bagged and ultrasonically scanned in a water tank during impregnation at 50°C, 60°C, 70°C, and 80°C. Measured flow rates were plotted versus inverse viscosity to determine the permeability in the thin film, non-saturated system. The results demonstrated that ultrasonic imaging in the C-scan mode is an effective method of measuring z-direction resin flow through a single layer of fabric. The permeability values determined in this work were consistent with permeability values reported in the literature. Capillary flow was not observed at the temperatures and times required for pressurized flow to occur. The flow rate at 65°C was predicted from the linear plot of flow rate versus inverse viscosity. The effects of fabric architecture on through-thickness flow rates during impregnation of an epoxy resin film were measured by ultrasonic imaging. Multilayered laminates comprised of woven carbon fabrics and epoxy films (prepregs) were fabricated by vacuum-bagging. Ultrasonic imaging was performed in a heated water tank (65°C) during impregnation. Impregnation rates showed a strong dependence on fabric architecture, despite similar areal densities. Impregnation rates are directly affected by inter-tow spacing and tow nesting, which depend on fabric architecture, and are indirectly affected by areal densities. A new method of predicting resin infusion rates in prepreg and resin film infusion processes was proposed. The Stokes equation was used to derive an equation to predict the impregnation rate of laminates as a function of fabric architecture. Flow rate data previously measured by ultrasound was analyzed with the new equation and the Kozeny-Carman equation. A fiber

  2. Handbook of machine soldering SMT and TH

    CERN Document Server

    Woodgate, Ralph W

    1996-01-01

    A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

  3. Solderability study of RABiTS-based YBCO coated conductors

    International Nuclear Information System (INIS)

    Zhang Yifei; Duckworth, Robert C.; Ha, Tam T.; Gouge, Michael J.

    2011-01-01

    Study examines the implication of solder and flux selection in YBCO splice joints. Focus is on commercially available RABiTS-based YBCO coated conductors. Solderability varied with solder and flux for three different stabilizations tested. Resistivity of stabilizer was dominant factor in splice joint resistance. Solder materials affected splice joint resistance when solderability was poor. The solderability of commercially available YBa 2 Cu 3 O 7-x (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

  4. Soluble Lead and Bismuth Chalcogenidometallates: Versatile Solders for Thermoelectric Materials

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Hao [Department; Son, Jae Sung [Department; School; Dolzhnikov, Dmitriy S. [Department; Filatov, Alexander S. [Department; Hazarika, Abhijit [Department; Wang, Yuanyuan [Department; Hudson, Margaret H. [Department; Sun, Cheng-Jun [Advanced; Chattopadhyay, Soma [Physical; Talapin, Dmitri V. [Department; Center

    2017-07-27

    Here we report the syntheses of largely unexplored lead and bismuth chalcogenidometallates in the solution phase. Using N2H4 as the solvent, new compounds such as K6Pb3Te6·7N2H4 were obtained. These soluble molecular compounds underwent cation exchange processes using resin chemistry, replacing Na+ or K+ by decomposable N2H5+ or tetraethylammonium cations. They also transformed into stoichiometric lead and bismuth chalcogenide nanomaterials with the addition of metal salts. Such a versatile chemistry led to a variety of composition-matched solders to join lead and bismuth chalcogenides and tune their charge transport properties at the grain boundaries. Solution-processed thin films composed of Bi0.5Sb1.5Te3 microparticles soldered by (N2H5)6Bi0.5Sb1.5Te6 exhibited thermoelectric power factors (~28 μW/cm K2) comparable to those in vacuum-deposited Bi0.5Sb1.5Te3 films. The soldering effect can also be integrated with attractive fabrication techniques for thermoelectric modules, such as screen printing, suggesting the potential of these solders in the rational design of printable and moldable thermoelectrics.

  5. SMT soldering handbook

    National Research Council Canada - National Science Library

    Strauss, Rudolf

    1998-01-01

    ... 3.2.1 Constituents, melting behaviour and mechanical properties 3.2.2 Composition of solders for use in electronics 3.2.3 Lead-free solders 3.2.4 Solder impurities The soldered joint 3.3.1 Solde...

  6. Double Vacuum Bag Process for Resin Matrix Composite Manufacturing

    Science.gov (United States)

    Hou, Tan-Hung (Inventor); Jensen, Brian J. (Inventor)

    2007-01-01

    A double vacuum bag molding assembly with improved void management and laminate net shape control which provides a double vacuum enviromnent for use in fabricating composites from prepregs containing air and/or volatiles such as reactive resin matrix composites or composites from solvent containing prepregs with non-reactive resins matrices. By using two vacuum environments during the curing process, a vacuum can be drawn during a B-stage of a two-step cycle without placing the composite under significant relative pressure. During the final cure stage, a significant pressure can be applied by releasing the vacuum in one of the two environments. Inner and outer bags are useful for creating the two vacuum environments with a perforated tool intermediate the two. The composite is placed intermediate a tool plate and a caul plate in the first environment with the inner bag and tool plate defining the first environment. The second environment is characterized by the outer bag which is placed over the inner bag and the tool plate.

  7. Boiling process modelling peculiarities analysis of the vacuum boiler

    Science.gov (United States)

    Slobodina, E. N.; Mikhailov, A. G.

    2017-06-01

    The analysis of the low and medium powered boiler equipment development was carried out, boiler units possible development directions with the purpose of energy efficiency improvement were identified. Engineering studies for the vacuum boilers applying are represented. Vacuum boiler heat-exchange processes where boiling water is the working body are considered. Heat-exchange intensification method under boiling at the maximum heat- transfer coefficient is examined. As a result of the conducted calculation studies, heat-transfer coefficients variation curves depending on the pressure, calculated through the analytical and numerical methodologies were obtained. The conclusion about the possibility of numerical computing method application through RPI ANSYS CFX for the boiling process description in boiler vacuum volume was given.

  8. Uranium bed oxidation vacuum process system

    International Nuclear Information System (INIS)

    McLeland, H.L.

    1977-01-01

    Deuterium and tritium gases are occluded in uranium powder for release into neutron generator tubes. The uranium powder is contained in stainless steel bottles, termed ''beds.'' If these beds become damaged, the gases must be removed and the uranium oxidized in order not to be flammable before shipment to ERDA disposal grounds. This paper describes the system and methods designed for the controlled degassing and oxidation process. The system utilizes sputter-ion, cryo-sorption and bellows pumps for removing the gases from the heated source bed. Removing the tritium gas is complicated by the shielding effect of helium-3, a byproduct of tritium decay. This effect is minimized by incremental pressure changes, or ''batch'' processing. To prevent runaway exothermic reaction, oxidation of the uranium bed is also done incrementally, or by ''batch'' processing, rather than by continuous flow. The paper discusses in detail the helium-3 shielding effect, leak checks that must be made during processing, bed oxidation, degree of gas depletion, purity of gases sorbed from beds, radioactivity of beds, bed disposal and system renovation

  9. Calculation of period processing solution syrup in vacuum apparatus

    Directory of Open Access Journals (Sweden)

    A. A. Slavyanskii

    2016-01-01

    Full Text Available Important and crucial element in the management of the technological flow of production of sugar product standards is the period of time the enrichment of massecuite, since its neutralization in the process of crystal formation in vacuum apparatus, excess sugar solution. Although currently proposed and implemented in the industry, including as a front-end accompany the process, a number of ways in the real world sugar production in many cases have to resort to the services of an experienced operator. It is obvious that in any case it is necessary to have a surround-dependent glucose solution data on time for the excess sugar solution into the vacuum apparatus. With regard to the period of the enrichment of depleted sucrose solution are entered into this substance excess sucrose solution, it should be noted that this problem is theoretically still insufficiently developed. It is obvious that for practical purposes it is desirable to have a simple and convenient for engineering calculation of sugar processing time dependencies of the specified volume of water from the operating parameters of the process (the required concentration of sucrose, temperature of the solution stirring. The problem is the quantitative analysis of sucrose crystallization in vacuum apparatus, including the timing of enrichment solution to the excess syrup, period of time processing massecuite total this apparatus has been investigated in many works. However, due to its importance to the task of obtaining commercial sugar high standards this issue required further in-depth examination. In the article to support the enrichment process solution sucrose due to neutralize this solvent system in vacuum apparatus, from the standpoint of diffusion theory provides a more reasonable compared to known so far, quantitative analysis of this process. Where as sucrose crystals team are considering a system of balls, uniformly distributed in vacuum apparatus. On the basis of the solution

  10. Safer Soldering Guidelines and Instructional Resources

    Science.gov (United States)

    Love, Tyler S.; Tomlinson, Joel

    2018-01-01

    Soldering is a useful and necessary process for many classroom, makerspace, Fab Lab, technology and engineering lab, and science lab activities. As described in this article, soldering can pose many safety risks without proper engineering controls, standard operating procedures, and direct instructor supervision. There are many safety hazards…

  11. Attribute based selection of thermoplastic resin for vacuum infusion process

    DEFF Research Database (Denmark)

    Prabhakaran, R.T. Durai; Lystrup, Aage; Løgstrup Andersen, Tom

    2011-01-01

    The composite industry looks toward a new material system (resins) based on thermoplastic polymers for the vacuum infusion process, similar to the infusion process using thermosetting polymers. A large number of thermoplastics are available in the market with a variety of properties suitable...... for different engineering applications, and few of those are available in a not yet polymerised form suitable for resin infusion. The proper selection of a new resin system among these thermoplastic polymers is a concern for manufactures in the current scenario and a special mathematical tool would...... be beneficial. In this paper, the authors introduce a new decision making tool for resin selection based on significant attributes. This article provides a broad overview of suitable thermoplastic material systems for vacuum infusion process available in today’s market. An illustrative example—resin selection...

  12. Vacuum evaporator-crystallizer process development for Hanford defense waste

    International Nuclear Information System (INIS)

    Tanaka, K.H.

    1978-04-01

    One of the major programs in the Department of Energy (DOE) waste management operations at Hanford is the volume reduction and solidification of Hanford Defense Residual Liquor (HDRL) wastes. These wastes are neutralized radioactive wastes that have been concentrated and stored in single-shell underground tanks. Two production vacuum evaporator-crystallizers were built and are operating to reduce the liquid volume and solidify these wastes. The process involves evaporating water under vacuum and thus concentrating and crystallizing the salt waste. The high caustic residual liquor is composed primarily of nitrate, nitrite, aluminate, and carbonate salts. Past evaporator-crystallizer operation was limited to crystallizing nitrate, nitrite, and carbonate salts. These salts formed a drainable salt cake that was acceptable for storage in the original single-shell tanks. The need for additional volume reduction and further concentration necessitated this process development work. Further concentration forms aluminate salts which pose unique processing problems. The aluminate salts are very fine crystals, non-drainable, and suitable only for storage in new double-shell tanks where the fluid waste can be continuously monitored. A pilot scale vacuum evaporator-crystallizer system was built and operated by Rockwell Hanford Operations to support flowsheet development for the production evaporator-crystallizers. The process developed was the concentration of residual liquor to form aluminate salts. The pilot plant tests demonstrated that residual liquors with high aluminum concentrations could be concentrated and handled in a vacuum evaporator-crystallizer system. The dense slurry with high solids content and concentrated liquor was successfully pumped in the insulated heated piping system. The most frequent problem encountered in the pilot plant was the failure of mechanical pump seals due to the abrasive slurry

  13. Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process.

    Science.gov (United States)

    Li, Z L; Dong, H J; Song, X G; Zhao, H Y; Tian, H; Liu, J H; Feng, J C; Yan, J C

    2018-04-01

    Homogeneous (Cu, Ni) 6 Sn 5 intermetallic compound (IMC) joints were rapidly formed in asymmetrical Ni/Sn/Cu system by an ultrasound-induced transient liquid phase (TLP) soldering process. In the traditional TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system consisted of major (Cu, Ni) 6 Sn 5 and minor Cu 3 Sn IMCs, and the grain morphology of (Cu, Ni) 6 Sn 5 IMCs subsequently exhibited fine rounded, needlelike and coarse rounded shapes from the Ni side to the Cu side, which was highly in accordance with the Ni concentration gradient across the joints. However, in the ultrasound-induced TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system only consisted of the (Cu, Ni) 6 Sn 5 IMCs which exhibited an uniform grain morphology of rounded shape with a remarkably narrowed Ni concentration gradient. The ultrasound-induced homogeneous intermetallic joints exhibited higher shear strength (61.6 MPa) than the traditional heterogeneous intermetallic joints (49.8 MPa). Copyright © 2017 Elsevier B.V. All rights reserved.

  14. Microstructure characteristics of vacuum glazing brazing joints using laser sealing technique

    Science.gov (United States)

    Liu, Sixing; Yang, Zheng; Zhang, Jianfeng; Zhang, Shanwen; Miao, Hong; Zhang, Yanjun; Zhang, Qi

    2018-05-01

    Two pieces of plate glass were brazed into a composite of glazing with a vacuum chamber using PbO-TiO2-SiO2-RxOy powder filler alloys to develop a new type of vacuum glazing. The brazing process was carried out by laser technology. The interface characteristics of laser brazed joints formed between plate glass and solder were investigated using optical microscope, scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD) techniques. The results show that the inter-diffusion of Pb/Ti/Si/O elements from the sealing solder toward the glass and O/Al/Si elements from the glass toward the solder, resulting in a reaction layer in the brazed joints. The microstructure phases of PbTiO3, AlSiO, SiO2 and PbO in the glass/solder interface were confirmed by XRD analysis. The joining of the sealing solder to the glass was realized by the reaction products like fibrous structures on interface, where the wetting layer can help improve the bonding performance and strength between the sealing solder and the plate glass during the laser brazing process.

  15. Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    McNally, K.M.; Sorg, B.S.; Welch, A.J.; Dawes, J.M.; Owen, E.R.

    1999-01-01

    Low-strength anastomoses and thermal damage of tissue are major concerns in laser tissue welding techniques where laser energy is used to induce thermal changes in the molecular structure of the tissues being joined, hence allowing them to bond together. Laser tissue soldering, on the other hand, is a bonding technique in which a protein solder is applied to the tissue surfaces to be joined, and laser energy is used to bond the solder to the tissue surfaces. The addition of protein solders to augment tissue repair procedures significantly reduces the problems of low strength and thermal damage associated with laser tissue welding techniques. Investigations were conducted to determine optimal solder and laser parameters for tissue repair in terms of tensile strength, temperature rise and damage and the microscopic nature of the bonds formed. An in vitro study was performed using an 808 nm diode laser in conjunction with indocyanine green (ICG)-doped albumin protein solders to repair bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The efficacy of temperature feedback control in enhancing the soldering process was also investigated. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the repairs. A reduction in dye concentration from 2.5mgml -1 to 0.25mgml -1 was also found to result in an increase in tensile strength. Increasing the laser irradiance and thus surface temperature resulted in an increased severity of histological injury. Thermal denaturation of tissue collagen and necrosis of the intimal layer smooth muscle cells increased laterally and in depth with higher temperatures. The strongest repairs were produced with an irradiance of 6.4Wcm -2 using a solid protein solder composed of 60% BSA and 0.25mgml -1 ICG. Using this combination of laser and solder parameters, surface temperatures were observed to reach 85±5 deg. C with a

  16. Analysis of Zinc 65 Contamination after Vacuum Thermal Process

    International Nuclear Information System (INIS)

    Korinko, Paul S.; Tosten, Michael H.

    2013-01-01

    Radioactive contamination with a gamma energy emission consistent with 65 Zn was detected in a glovebox following a vacuum thermal process. The contaminated components were removed from the glovebox and subjected to examination. Selected analytical techniques were used to determine the nature of the precursor material, i.e., oxide or metallic, the relative transferability of the deposit and its nature. The deposit was determined to be borne from natural zinc and was further determined to be deposited as a metallic material from vapor

  17. Parameter Sensitivity of the Microdroplet Vacuum Freezing Process

    Directory of Open Access Journals (Sweden)

    Zhijun Zhang

    2015-01-01

    Full Text Available The vacuum freezing process of microdroplets (1 mm. Pressure and droplet diameter have an effect on cooling and freezing stages, but initial temperature only affects the cooling stage. The thermal conductivity coefficient kl affected the cooling stage, whereas ki affected the freezing stage. Heat capacity Cl affected the cooling stage, but Ci has virtually no effect on all stages. The actual latent heat of freezing ΔH was also affected. Higher density corresponds to lower cooling rate in the cooling stage.

  18. Comparison of Composites Properties Manufactured by Vacuum Process and Autoclave Process

    Directory of Open Access Journals (Sweden)

    MA Rufei

    2017-01-01

    Full Text Available Two kinds of prepregs ZT7G/LT-03A(unidirectional carbon fiber prepreg and ZT7G3198P/LT-03A(plain carbon fabric prepreg were used to manufacture three Bateches of composites by vacuum process and autoclave process respectively. The physical properties of the prepregs and mechanical properties of composite were tested. The performance, fiber volume content and porosity of composites manufactured by vacuum cure and autoclave process show that the physical property retention rates of vacuum cured composites are all over 75%, some even more than 100%. Interlaminar shear strength keeps the lowest retention rate and warp tensile strength keeps the highest retention in unidirectional carbon fiber composites. For fabric composite material, compression strength keeps the lowest and warp tensile strength keeps the highest retention. Vacuum cured composites perform lower fiber volume content and higher porosity, which are the main reasons of the lower performance.

  19. Evaluation of process influences on surface chemistry of epoxy acrylate based solder mask via XPS, ToF-SIMS and contact angle measurement

    Energy Technology Data Exchange (ETDEWEB)

    Hofmeister, Caroline, E-mail: caroline.hofmeister@de.bosch.com [Robert Bosch GmbH, Postfach 30 02 40, 70442 Stuttgart (Germany); Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, Wiener Str. 12, 28359 Bremen (Germany); Maaß, Sebastian [Robert Bosch GmbH, Postfach 30 02 40, 70442 Stuttgart (Germany); Fladung, Thorsten; Mayer, Bernd [Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, Wiener Str. 12, 28359 Bremen (Germany)

    2017-01-01

    Epoxy acrylate based solder mask formulations were conditioned by different printed circuit board (PCB) manufacturing and PCB assembly process stages. Depending on these different influences the chemistry of the solder mask surface was investigated regarding adhesion to possible adhesion partners. The combination of X-ray photoelectron spectrometry (XPS), time-of-flight secondary ion mass spectrometry (ToF-SIMS) and the contact angle method, for surface energy determination, provided a detailed understanding of the surface near region up to the topmost monolayer, which forms the contact zone in which adhesion takes place. The combination of ToF-SIMS and XPS provided molecular information of surface components comprising quantitative information. The influences of all process steps, like UV, chemical and thermal treatment, on the chemical surface composition and appearance were identified. Based on the results a chemical surface model could be created regarding the different adhesion mechanisms. It has been shown that an enrichment of siloxanes at the surface is generated by different mechanisms that were distinguished based on ToF-SIMS. Even though an oxidation process in the surface near region (10 nm) was indicated by XPS, no increase of the surface polar groups and thus no polarity increase could be observed within the first monolayer. A surface model derived from the analysis results shows generation and occupation of free sites at the surface through all stages of the process. An occupation of free sites by siloxanes from additives in the solder mask formulation results in a siloxane dominated topmost monolayer. - Highlights: • A surface model describing the process influences is proposed. • Detailed siloxane reaction analysis was possible with ToF-SIMS. • Photo-chemical, chemical and thermal surface modification occur during PCB manufacturing.

  20. Effect of Solder Flux Residues on Corrosion of Electronics

    DEFF Research Database (Denmark)

    Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per

    2009-01-01

    Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA...... testing and use in the field, consequences and recommendations are given. Failures, caused by harsh[1] customer environments, are not covered in this paper....

  1. Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

    Energy Technology Data Exchange (ETDEWEB)

    Hamm, Randy; Peterson, Kenneth A.

    2015-10-01

    This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm X 6.5 mm X 0.1 mm (0.354” x 0.256” x 0.004”), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while maintaining a consistent bondline (minimizing die tilt). Voiding was measured using acoustic imaging and die tilt was measured using two different optical measurement systems. 80Au-20Sn solder reflow was achieved using a batch vacuum solder system with optimized fixturing. Minimizing die tilt proved to be the more difficult of the two product requirements to meet. Process development variables included tooling, weight and solder preform thickness.

  2. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Directory of Open Access Journals (Sweden)

    Liu Mei Lee

    2013-01-01

    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  3. Investigating steam penetration using thermometric methods in dental handpieces with narrow internal lumens during sterilizing processes with non-vacuum or vacuum processes.

    Science.gov (United States)

    Winter, S; Smith, A; Lappin, D; McDonagh, G; Kirk, B

    2017-12-01

    Dental handpieces are required to be sterilized between patient use. Vacuum steam sterilization processes with fractionated pre/post-vacuum phases or unique cycles for specified medical devices are required for hollow instruments with internal lumens to assure successful air removal. Entrapped air will compromise achievement of required sterilization conditions. Many countries and professional organizations still advocate non-vacuum sterilization processes for these devices. To investigate non-vacuum downward/gravity displacement, type-N steam sterilization of dental handpieces, using thermometric methods to measure time to achieve sterilization temperature at different handpiece locations. Measurements at different positions within air turbines were undertaken with thermocouples and data loggers. Two examples of widely used UK benchtop steam sterilizers were tested: a non-vacuum benchtop sterilizer (Little Sister 3; Eschmann, Lancing, UK) and a vacuum benchtop sterilizer (Lisa; W&H, Bürmoos, Austria). Each sterilizer cycle was completed with three handpieces and each cycle in triplicate. A total of 140 measurements inside dental handpiece lumens were recorded. The non-vacuum process failed (time range: 0-150 s) to reliably achieve sterilization temperatures within the time limit specified by the international standard (15 s equilibration time). The measurement point at the base of the handpiece failed in all test runs (N = 9) to meet the standard. No failures were detected with the vacuum steam sterilization type B process with fractionated pre-vacuum and post-vacuum phases. Non-vacuum downward/gravity displacement, type-N steam sterilization processes are unreliable in achieving sterilization conditions inside dental handpieces, and the base of the handpiece is the site most likely to fail. Copyright © 2017 The Healthcare Infection Society. Published by Elsevier Ltd. All rights reserved.

  4. Cryogenic thermal storage system for discontinuous industrial vacuum processes

    Directory of Open Access Journals (Sweden)

    Scaringella M.

    2012-10-01

    Full Text Available Phase Change Materials are proposed for refrigerating systems in discontinuous industrial vacuum processes where temperatures as low as −140 ÷ −100°C are necessary within time-frames representing 10÷20% of total operating time. An application is proposed for cooling systems used in a Physical Vapour Deposition (PVD apparatus. A prototype has been manufactured which couples a cryopump with a reservoir filled with MethylCycloPentane (MCP-C6H12 and a distribution line where nitrogen in the gaseous state is flowing. Preliminary tests show that temperatures of about −120°C are actually achieved within time windows compatible with PVD applications.

  5. Investigation of Sn-Pb solder bumps of prototype photo detectors for the LHCb experiment

    CERN Document Server

    Delsante, M L; Arnau-Izquierdo, G

    2004-01-01

    The Large Hadron Collider (LHC) is now under construction at the European Organization for Nuclear Research (CERN). LHCb is one of the dedicated LHC experiments, allowing high energy proton-proton collisions to be exploited. This paper presents the results of the metallurgic studies carried out on Sn-Pb solder bumps of prototype vacuum photo detectors under development for LHCb, and in particular for the ring imaging Cherenkov-hybrid photo diode (RICH-HPD) project. These detectors encapsulate, in a vacuum tube, an assembly made of two silicon chips bonded together by a matrix of solder bumps. Each bump lies on a suitable system of under-bump metallic layers ensuring mechanical and electrical transition between the chip pad and the solder alloy. During manufacturing of the detector, bump-bonded (BB) assemblies are exposed to severe heat cycles up to 400 degree C inducing, in the present fabrication process, a clear degradation of electrical connectivity. Several investigations such as microstructural observati...

  6. Soldering of Mg Joints Using Zn-Al Solders

    Science.gov (United States)

    Gancarz, Tomasz; Berent, Katarzyna; Skuza, Wojciech; Janik, Katarzyna

    2018-04-01

    Magnesium has applications in the automotive and aerospace industries that can significantly contribute to greater fuel economy and environmental conservation. The Mg alloys used in the automotive industry could reduce mass by up to 70 pct, providing energy savings. However, alongside the advantages there are limitations and technological barriers to use Mg alloys. One of the advantages concerns phenomena occurring at the interface when joining materials investigated in this study, in regard to the effect of temperature and soldering time for pure Mg joints. Eutectic Zn-Al and Zn-Al alloys with 0.05 (wt pct) Li and 0.2 (wt pct) Na were used in the soldering process. The process was performed for 3, 5, and 8 minutes of contact, at temperatures of 425 °C, 450 °C, 475 °C, and 500 °C. Selected, solidified solder-substrate couples were cross-sectioned, and their interfacial microstructures were investigated by scanning electron microscopy. The experiment was designed to demonstrate the effect of time, temperature, and the addition of Li and Na on the kinetics of the dissolving Mg substrate. The addition of Li and Na to eutectic Zn-Al caused to improve mechanical properties. Higher temperatures led to reduced joint strength, which is caused by increased interfacial reaction.

  7. Vacuum Exhaust Process in Pilot-Scale Vacuum Pressure Swing Adsorption for Coal Mine Ventilation Air Methane Enrichment

    Directory of Open Access Journals (Sweden)

    Xiong Yang

    2018-04-01

    Full Text Available Recovery and treatment of methane from coal mine ventilation air methane (VAM with cost-effective technologies have been an ongoing challenge due to low methane concentrations. In this study, a type of coconut shell-based active carbon was employed to enrich VAM with a three-bed vacuum pressure swing adsorption unit. A new vacuum exhaust step for the VPSA process was introduced. The results show that the vacuum exhaust step can increase the methane concentration of the product without changing adsorption and desorption pressure. Under laboratory conditions, the concentration of product increased from 0.4% to 0.69% as the vacuum exhaust ratio increased from 0 to 3.1 when the feed gas concentration was 0.2%. A 500 m³/h pilot-scale test system for VAM enrichment was built rendering good correlation with the laboratory results in terms of the vacuum exhaust step. By using a two-stage three-bed separation unit, the VAM was enriched from 0.2% to over 1.2%.

  8. A novel method for direct solder bump pull testing using lead-free solders

    Science.gov (United States)

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  9. Continuous fed-batch vacuum fermentation system for glycerol from molasses by the sulfite process

    Energy Technology Data Exchange (ETDEWEB)

    Kalle, G.P.; Naik, S.C.

    1985-01-01

    A continuous fed-batch vacuum fermentation system has been described for the production of glycerol from cane molasses (and juice) by a conventional sulfite process. A glycerol concentration of 80 g/l was achieved with a productivity of 30 g/l/day at a dilution rate of 0.4/day which is twice that from a vacuum batch process (15 g/l/day) or four times that obtained without vacuum (8 g/l/day). 8 references.

  10. Thermomechanical fatigue life prediction for several solders

    Science.gov (United States)

    Wen, Shengmin

    Since solder connections operate at high homologous temperature, solders are high temperature materials. This feature makes their mechanical behavior and fatigue phenomena unique. Based on experimental findings, a physical damage mechanism is introduced for solders. The mechanism views the damage process as a series of independent local damage events characterized by the failure of individual grains, while the structural damage is the eventual percolation result of such local events. Fine's dislocation energy density concept and Mura's microcrack initiation theory are adopted to derive the fatigue formula for an individual grain. A physical damage metric is introduced to describe the material with damage. A unified creep and plasticity constitutive model is adopted to simulate the mechanical behavior of solders. The model is cast into a continuum damage mechanics framework to simulate material with damage. The model gives good agreement with the experimental results of 96.5Pb-3.5Sn and 96.5Sn-3.5Ag solders under uniaxial strain-controlled cyclic loading. The model is convenient for implementation into commercial computational packages. Also presented is a fatigue theory with its failure criterion for solders based on physical damage mechanism. By introducing grain orientation into the fatigue formula, an m-N curve (m is Schmid factor) at constant loading condition is suggested for fatigue of grains with different orientations. A solder structure is defined as fatigued when the damage metric reaches a critical threshold, since at this threshold the failed grains may form a cluster and percolate through the structure according to percolation theory. Fatigue data of 96.5Pb-3.5Sn solder bulk specimens under various uniaxial tension tests were analyzed. Results show that the theory gives consistent predictions under broad conditions, while inelastic strain theory does not. The theory is anisotropic with no size limitation to its application, which could be suitable for

  11. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    Directory of Open Access Journals (Sweden)

    Mohd Nizam Ab. Rahman

    2014-12-01

    Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

  12. Mechanical properties of Bi-In-Zn/ Cu solder joint system

    International Nuclear Information System (INIS)

    Ervina Efzan Mohd Noor; Mohammed Noori Ridha; Ahmad Badri Ismail; Nurulakmal Mohd Sharif; Kuan Yew Cheong; Tadashi Ariga; Zuhailawati Hussain

    2009-01-01

    Full text: In recent years, the pollution of environment from lead (Pb) and Pb-containing compounds in microelectronic devices attracts more and more attentions in academia and industry; the lead-free solder alloys begin to replace the lead-based solders in packaging process of some devices and components. In this works, microstructure and mechanical properties of different reflow temperature (80, 100, 120 and 140 degree Celsius) for solder joints on shear strength of Bi-In-Zn lead free solder with low melting temperature of 60 degree Celsius on Cu solder joint has been investigated. This paper will compared the mechanical properties of the Bi-In-Zn lead-free solder alloys with current lead-free solder, Sn-Ag-Cu solder alloy. The fracture surface analyses have been observed by Optical Microscope and were investigated by Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX) and proved it by X-ray diffraction (XRD). (author)

  13. Investigation into mechanical properties of joints of heterogeneous materials brazed with high-temperature solders

    International Nuclear Information System (INIS)

    Lomenko, V.I.; Merkushev, V.P.; Borodina, L.M.; Sycheva, T.S.; Tokhtina, O.A.; Frolov, N.N.

    1988-01-01

    Mechanical properties of copper joints with copper, 12Kh18M10T steel and KhD50 composite obtained by vacuum brazing by copper-titanium solder as compared with properties of joints brazed by PSr 72 and PMFOTsr 6-4-0.03 solders in hydrogen are studied. Dependences of joints strength on temperature of contact - reactive vacuum brazing are obtained. Possible applications of joints of dissimilar materials in electrovacuum devices subjected to the effect of dynamic loadings are established

  14. Continuous vacuum processing system for quartz crystal resonators

    International Nuclear Information System (INIS)

    Ney, R.J.; Hafner, E.

    1979-01-01

    An ultrahigh vacuum continuous cycle quartz crystal fabrication facility has been developed that assures an essentially contamination-free environment throughout the final manufacturing steps of the crystal unit. The system consists of five essentially tubular vacuum chambers that are interconnected through gate valves. The unplated crystal resonators, mounted in ceramic flatback frames and loaded on carrier trays, enter the vacuum system through an entrance air lock, are UV/ozone cleaned, baked at 300 0 C, plated to frequency, thermocompression sealed, and exit as completed crystal units through an exit air lock, while the bake, plate and seal chambers remain under continuous vacuum permanently. In-line conveyor belts are used, in conjunction with balanced vacuum manipulators, to move the resonator components to the various work stations. Unique high density, highly directional nozzle beam evaporation sources, capable of long term operation without reloading, are used for electroding the resonators simultaneously on both sides. The design goal for the system is a production rate of 200 units per 8 hour day; it is adaptable to automatic operation

  15. Recovery process of wall condition in KSTAR vacuum vessel after temporal machine-vent for repair

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Kwang Pyo, E-mail: kpkim@nfri.er.ke; Hong, Suk-Ho; Lee, Hyunmyung; Song, Jae-in; Jung, Nam-Yong; Lee, Kunsu; Chu, Yong; Kim, Hakkun; Park, Kaprai; Oh, Yeong-Kook

    2015-10-15

    Highlights: • Efforts have been made to obtain vacuum condition that is essential for the plasma experiments. • For example, the vacuum vessel should be vented to repair in-vessel components such as diagnostic shutter, and PFC damaged by high energy plasma. • Here, we present the recovery process of wall condition in KSTAR after temporal machine-vent for repair. • It is found that an acceptable vacuum condition has been achieved only by plasma based wall conditioning techniques such as baking, GDC, and boronization. • This study was that the proper recovering method of the vacuum condition should be developed according to the severity of the accident. - Abstract: Efforts have been made to obtain vacuum condition that is essential for the plasma experiments. Under certain situations, for example, the vacuum vessel should be vented to repair in-vessel components such as diagnostic shutter, exchange of window for diagnostic equipment, and PFC damaged by high energy plasma. For the quick restart of the campaign, a recovery process was established to make the vacuum condition acceptable for the plasma experiment. In this paper, we present the recovery process of wall condition in KSTAR after temporal machine-vent for repair. It is found that an acceptable vacuum condition has been achieved only by plasma based wall conditioning techniques such as baking, GDC, and boronization. This study was that the proper recovering method of the vacuum condition should be developed according to the severity of the accident.

  16. On the fermion pair production in the process of metastable vacuum decay

    International Nuclear Information System (INIS)

    Lavrelashvili, G.V.; Rubakov, V.A.; Tinyakov, P.G.

    1985-01-01

    Production of fermion pairs during the tunneling process leading to the decay of metastable vacuum is considered. The technique based on non-unitary Bogolyubov transformations is developed and formulae for fermionic spectrum are obtained. As an example, the spectrum of fermionic pairs produced during the homogeneous decay of metastable vacuum is evaluated

  17. Dust processing device for inside of vacuum vessel of thermonuclear reactor

    International Nuclear Information System (INIS)

    Okumura, Atsushi; Tsujimura, Seiichi; Takahashi, Kenji; Ueda, Yasutoshi; Kuwata, Masayasu; Onozuka, Masaki.

    1995-01-01

    The device of the present invention can occasionally recover dusts in a vacuum vessel of a thermonuclear reactor. In addition, fine powdery dusts are never scattered to the vacuum vessel. Namely, a processing device main body comprises a locally sealed space in the vacuum vessel. A blow-up device blows up and floats dusts accumulated in the vacuum vessel to the processing device main body. A discharge plate electrically charges the floating dusts by discharge. An electrode collects the charged dusts. Collected dusts are recovered together with a pressurized gas through a dust recovering port to the outside of the processing device. With such a constitution, it is not necessary to release the vacuum vessel to the atmosphere and evacuate after the completion of the collection of the dusts on every time when the dusts are generated as in the prior art. It is no more necessary for an operator to enter into the vacuum vessel and recover the dusts. Since fine powdery dusts are never scattered in the vacuum vessel, no undesired effects are given to exhaustion facilities and instruments of the vacuum vessel. (I.S.)

  18. Dust processing device for inside of vacuum vessel of thermonuclear reactor

    Energy Technology Data Exchange (ETDEWEB)

    Okumura, Atsushi; Tsujimura, Seiichi; Takahashi, Kenji; Ueda, Yasutoshi; Kuwata, Masayasu; Onozuka, Masaki

    1995-05-02

    The device of the present invention can occasionally recover dusts in a vacuum vessel of a thermonuclear reactor. In addition, fine powdery dusts are never scattered to the vacuum vessel. Namely, a processing device main body comprises a locally sealed space in the vacuum vessel. A blow-up device blows up and floats dusts accumulated in the vacuum vessel to the processing device main body. A discharge plate electrically charges the floating dusts by discharge. An electrode collects the charged dusts. Collected dusts are recovered together with a pressurized gas through a dust recovering port to the outside of the processing device. With such a constitution, it is not necessary to release the vacuum vessel to the atmosphere and evacuate after the completion of the collection of the dusts on every time when the dusts are generated as in the prior art. It is no more necessary for an operator to enter into the vacuum vessel and recover the dusts. Since fine powdery dusts are never scattered in the vacuum vessel, no undesired effects are given to exhaustion facilities and instruments of the vacuum vessel. (I.S.).

  19. Impact of vacuum cooking process on the texture degradation of selected apple cultivars.

    Science.gov (United States)

    Bourles, E; Mehinagic, E; Courthaudon, J L; Jourjon, F

    2009-01-01

    Thermal treatments are known to affect the textural properties of fruits and vegetables. This study was conducted to evaluate the influence of vacuum cooking process on the mechanical properties of various apple cultivars. A total of 10 apple cultivars were industrially processed by vacuum pasteurization at 95 degrees C for 25 min. The raw material was characterized by penetrometry, uniaxial double compression, soluble solid content, and titrable acidity. Textural properties of processed apples were analyzed by uniaxial double compression. As expected, for all cultivars, fruit resistance was lower after processing than before. Results showed that texture degradation due to vacuum pasteurization was different from one cultivar to another. Indeed, some cultivars, initially considered as the most resistant ones, such as Braeburn, were less suitable for processing, and became softer than others after thermal treatment. Consequently, it is worth noting that the texture classification of the investigated apple cultivars was changed by the vacuum-cooking process.

  20. Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly

    Energy Technology Data Exchange (ETDEWEB)

    Mostafa Shalaby, Rizk; Kamal, Mustafa [Metal Physics Laboratory, Physics Department, Faculty of Science, Mansoura University, P.O.Box: 35516, Mansoura (Egypt); Ali, Esmail A.M. [Basic Science Department, Faculty of Engineering, University of Science & Technology (Yemen); Gumaan, Mohammed S., E-mail: m.gumaan1@gmail.com [Metal Physics Laboratory, Physics Department, Faculty of Science, Mansoura University, P.O.Box: 35516, Mansoura (Egypt); Basic Science Department, Faculty of Engineering, University of Science & Technology (Yemen)

    2017-04-06

    This paper aims to investigate the reliability of mechanical and creep behavior for the eutectic Sn-Ag and Sn-Ag-Cu Solder joints rapidly solidified after hot compressing (HC) in terms of structural changes and its relationship with thermal behavior, which has been discussed and compared with their properties before HC process by Mustafa et al. (2016) . These solder joints were prepared by melt-spinning technique and tested by HC at 30 MPa pressure and 150 °C for 90 min, their structural, mechanical and thermal properties after HC process have been investigated by X-ray diffraction (XRD), dynamic resonance techniques (DRT) and differential scanning calorimetry (DSC) techniques respectively and compared with these solders before HC. The results revealed that the pressure caused some fractures on the solders morphology surfaces. But some benefits for these solders have been occurred, like eliminating the internal stresses through recrystallization process whose evidence by the particle size increases after they HC, stabilized structure after HC was due to the metastable phases rearrangements, new intermetallic compounds (IMCs) formation, decreasing, melting temperature range (∆T), lattice strains (ƹ) and entropy change (S). These sequential benefits are considered to be the main reasons which lead to decreasing energy loss (Q{sup −1}), creep rate (É›) and thermal stability enhancement. Elastic modulus increment might be due to low elastic lattice distortions after HC, while the stress exponent (n) reduction refers to viscous glide mechanism of deformation after HC instead of climb deformation mechanism before HC.

  1. Method for sequentially processing a multi-level interconnect circuit in a vacuum chamber

    Science.gov (United States)

    Routh, D. E.; Sharma, G. C. (Inventor)

    1984-01-01

    An apparatus is disclosed which includes a vacuum system having a vacuum chamber in which wafers are processed on rotating turntables. The vacuum chamber is provided with an RF sputtering system and a dc magnetron sputtering system. A gas inlet introduces various gases to the vacuum chamber and creates various gas plasma during the sputtering steps. The rotating turntables insure that the respective wafers are present under the sputtering guns for an average amount of time such that consistency in sputtering and deposition is achieved. By continuous and sequential processing of the wafers in a common vacuum chamber without removal, the adverse affects of exposure to atmospheric conditions are eliminated providing higher quality circuit contacts and functional device.

  2. Attribute Based Selection of Thermoplastic Resin for Vacuum Infusion Process: A Decision Making Methodology

    DEFF Research Database (Denmark)

    Raghavalu Thirumalai, Durai Prabhakaran; Lystrup, Aage; Løgstrup Andersen, Tom

    2012-01-01

    The composite industry looks toward a new material system (resins) based on thermoplastic polymers for the vacuum infusion process, similar to the infusion process using thermosetting polymers. A large number of thermoplastics are available in the market with a variety of properties suitable...... be beneficial. In this paper, the authors introduce a new decision making tool for resin selection based on significant attributes. This article provides a broad overview of suitable thermoplastic material systems for vacuum infusion process available in today’s market. An illustrative example—resin selection...... for vacuum infused of a wind turbine blade—is shown to demonstrate the intricacies involved in the proposed methodology for resin selection....

  3. Management of vacuum leak-detection processes, calibration, and standards

    International Nuclear Information System (INIS)

    Wilson, N.G.

    1985-01-01

    Vacuum leak detection requires integrated management action to ensure the successful production of apparatus having required leak tightness. Implementation of properly planned, scheduled, and engineered procedures and test arrangements are an absolute necessity to prevent unexpected, impractical, technically inadequate, or unnecessarily costly incidents in leak-testing operations. The use of standard procedures, leak standards appropriate to the task, and accurate calibration systems or devices is necessary to validate the integrity of any leak-test procedure. In this paper, the need for implementing these practices is discussed using case histories of typical examples of large complex vacuum systems. Aggressive management practices are of primary importance throughout a project's life cycle to ensure the lowest cost; this includes successful leak testing of components. It should be noted that the opinions and conclusions expressed in this paper are those of the author and are not those of the Los Alamos National Laboratory or the Department of Energy

  4. Optimization of frozen wild blueberry vacuum drying process

    Directory of Open Access Journals (Sweden)

    Šumić Zdravko M.

    2015-01-01

    Full Text Available The objective of this research was to optimize the vacuum drying of frozen blueberries in order to preserve health benefits phytochemicals using response surface methodology. The drying was performed in a new design of vacuum dryer equipment. Investigated range of temperature was 46-74°C and of pressure 38-464 mbar. Total solids, total phenolics, vitamin C, anthocyanin content and total color change were used as quality indicators of dried blueberries. Within the experimental range of studied variables, the optimum conditions of 60 °C and 100 mbar were established for vacuum drying of blueberries. Separate validation experiments were conducted at optimum conditions to verify predictions and adequacy of the second-order polynomial models. Under these optimal conditions, the predicted amount of total phenolics was 3.70 mgCAE/100dw, vitamin C 59.79 mg/100gdw, anthocyanin content 2746.33 mg/100gdw, total solids 89.50% and total color change 88.83. [Projekat Ministarstva nauke Republike Srbije, br. TR 31044

  5. Visual detection of defects in solder joints

    Science.gov (United States)

    Blaignan, V. B.; Bourbakis, Nikolaos G.; Moghaddamzadeh, Ali; Yfantis, Evangelos A.

    1995-03-01

    The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new `frame' for the achievement of better results regarding efficiency, products quality and automated service. In this paper the visual detection and classification of different types of defects on solder joints in PC boards is presented by combining several image processing methods, such as smoothing, segmentation, edge detection, contour extraction and shape analysis. The results of this paper are based on simulated solder defects and a real one.

  6. Integration of environmentally compatible soldering technologies for waste minimization

    International Nuclear Information System (INIS)

    Hosking, F.M.

    1992-01-01

    There has been a concentrated effort throughout the international microelectronics industry to phase out chlorofluorocarbon (CFC) materials and alleviate the serious problem of ozone depletion created by the release of CFCS. The development of more environmentally compatible manufacturing technologies is the cornerstone of this effort. Alternative materials and processes for cleaning and soldering have received special attention. Electronic. soldering typically utilizes rosin-based fluxes to promote solder wettability. Flux residues must be removed from the soldered parts when high product reliability is essential. Halogenated or CFC solvents have been the principle chemicals used to clean the residues. With the accelerated push to eliminate CFCs in the US by 1995, CFC-free solvents, aqueous-based cleaning, water soluble or ''no clean'' fluxes, and fluxless soldering technologies are being developed and quickly integrated into manufacturing practice. Sandia's Center for Solder Science and Technology has been ch g a variety of fluxless and alternative soldering technologies for DOE's waste minimization program. The work has focused on controlled atmosphere, laser, and ultrasonic fluxless soldering, protective metallic and organic coatings, and fluxes which have water soluble or low solids-based chemistries. With the increasing concern that Pb will also be banned from electronic soldering, Sandia has been characterizing the wetting, aging, and mechanical properties of Pb-fire solder alloys. The progress of these integrated studies will be discussed. Their impact on environmentally compatible manufacturing will be emphasized. Since there is no universal solution to the various environmental, safety, and health issues which currently face industry, the proposed technologies offer several complementary materials and processing options from which one can choose

  7. Criticality Safety Evaluation Report for the Cold Vacuum Drying (CVD) Facility's Process Water Handling System

    International Nuclear Information System (INIS)

    KESSLER, S.F.

    2000-01-01

    This report addresses the criticality concerns associated with process water handling in the Cold Vacuum Drying Facility. The controls and limitations on equipment design and operations to control potential criticality occurrences are identified

  8. Criticality safety evaluation report for the cold vacuum drying facility's process water handling system

    International Nuclear Information System (INIS)

    NELSON, J.V.

    1999-01-01

    This report addresses the criticality concerns associated with process water handling in the Cold Vacuum Drying Facility. The controls and limitations on equipment design and operations to control potential criticality occurrences are identified

  9. Fluxless Sn-Ag bonding in vacuum using electroplated layers

    International Nuclear Information System (INIS)

    Kim, Jongsung; Lee, Chin C.

    2007-01-01

    A fluxless bonding process in vacuum environment using newly developed electroplated Sn-Ag multilayer structure at eutectic composition is presented. The new bonding process is entirely fluxless, or flux-free. It is performed in vacuum (100 mTorr), in which the oxygen content is reduced by a factor of 7600 comparing to air, to inhibit solder oxidation. In the design, Cr/Au dual layer is employed as the UBM as well as the plating seed layer. This UBM design, seldom used in the electronic industry, is explained in some details. To realize the fluxless possibility, a proper layer design of the solder structure is needed. In this connection, we wish to point out that it is hard to achieve fluxless bonding using Sn-rich alloys because these alloys have numerous Sn atoms on the surface that are easily oxidized. To prevent Sn oxidation, a thin Ag layer is plated immediately over Sn layer. XRD results confirm that this thin Ag layer does act as a barrier to prevent oxidation of the inner Sn layer. The resulting solder joints are void free as examined by a scanning acoustic microscope (SAM). SEM and EDX studies on the cross section of the joint indicate a homogeneous Sn-rich phase. The melting temperature is measured to be between 219 and 226 deg. C. This new fluxless bonding process is valuable in many applications where the use of flux is prohibited

  10. Influence of solder joint length to the mechanical aspect during the thermal stress analysis

    Science.gov (United States)

    Tan, J. S.; Khor, C. Y.; Rahim, Wan Mohd Faizal Wan Abd; Ishak, Muhammad Ikman; Rosli, M. U.; Jamalludin, Mohd Riduan; Zakaria, M. S.; Nawi, M. A. M.; Aziz, M. S. Abdul; Ani, F. Che

    2017-09-01

    Solder joint is an important interconnector in surface mount technology (SMT) assembly process. The real time stress, strain and displacement of the solder joint is difficult to observe and assess the experiment. To tackle these problems, simulation analysis was employed to study the von Mises stress, strain and displacement in the thermal stress analysis by using Finite element based software. In this study, a model of leadless electronic package was considered. The thermal stress analysis was performed to investigate the effect of the solder length to those mechanical aspects. The simulation results revealed that solder length gives significant effect to the maximum von Mises stress to the solder joint. Besides, changes in solder length also influence the displacement of the solder joint in the thermal environment. The increment of the solder length significantly reduces the von Mises stress and strain on the solder joint. Thus, the understanding of the physical parameter for solder joint is important for engineer prior to designing the solder joint of the electronic component.

  11. Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: a knowledge base for fluxless solder bonding applications

    DEFF Research Database (Denmark)

    Kuhmann, Jochen Friedrich; Preuss, A.; Adolphi, B.

    1998-01-01

    : (1) SnPb; (2) InSn; (3) AuSn. The studies of the oxidation kinetics show that the growth of the native oxide, which covers the solder surfaces from the start of all soldering operations is self-limiting. The rate of oxidation on the molten, metallic solder surfaces is significantly reduced...... and reduction kinetics, are applied to flip-chip (FC) bonding experiments in vacuum with and without the injection of H2. Wetting in vacuum is excellent but the self-alignment during flip-chip soldering is restricted. The desired, perfectly self-aligned FC-bonds have been only achieved, using evaporated...

  12. Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

    Directory of Open Access Journals (Sweden)

    Saliza Azlina O.

    2016-01-01

    Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

  13. Modelling of plasma generation and expansion in a vacuum arc: application to the vacuum arc remelting process

    International Nuclear Information System (INIS)

    Chapelle, P.; Bellot, J.P.; Duval, H.; Jardy, A.; Ablitzer, D.

    2002-01-01

    As part of a complete theoretical description of the behaviour of the electric arc in the vacuum arc remelting process, a model has been developed for the column of plasma generated by a single cluster of cathode spots. The model combines a kinetic approach, taking into account the formation of the plasma in the cathodic region, and a hydrodynamic approach, describing the expansion of the plasma in the vacuum between the electrodes. The kinetic model is based on a system of Boltzmann-Vlasov-Poisson equations and uses a particle-type simulation procedure, combining the PIC (particle in cell) and FPM (finite point set method) methods. In the two-dimensional hydrodynamic model, the plasma is assimilated to a mixture of two continuous fluids (the electrons and the ions), each described by a system of coupled transport equations. Finally, a simplified method has been defined for calculating the electric current density and the energy flux density transmitted by the plasma to the anode. The results of the numerical simulation presented are consistent with a certain number of experimental data available in the literature. In particular, the model predicts a percentage of the electric power of the cluster transmitted to the anode (25%) in good agreement with the value indicated in the literature. (author)

  14. Process of treating carbonaceous materials. [400 to 700/sup 0/C, high vacuum

    Energy Technology Data Exchange (ETDEWEB)

    Parker, O J

    1913-11-24

    A process is given of treating carbonaceous materials, characterized by the material being submitted simultaneously to a temperature of 400 to 700/sup 0/C, a pressure between 5.0 mm of mercury under atmospheric and a practically perfect vacuum, and by the volatile material able to condense under the vacuum used being condensed practically under the same pressure for the production of a high proportion of condensable products and a superior fuel.

  15. Soldering formalism in noncommutative field theory: a brief note

    International Nuclear Information System (INIS)

    Ghosh, Subir

    2004-01-01

    In this Letter, I develop the soldering formalism in a new domain--the noncommutative planar field theories. The soldering mechanism fuses two distinct theories showing opposite or complimentary properties of some symmetry, taking into account the interference effects. The above mentioned symmetry is hidden in the composite (or soldered) theory. In the present work it is shown that a pair of noncommutative Maxwell-Chern-Simons theories, having opposite signs in their respective topological terms, can be consistently soldered to yield the Proca model (Maxwell theory with a mass term) with corrections that are at least quadratic in the noncommutativity parameter. We further argue that this model can be thought of as the noncommutative generalization of the Proca theory of ordinary spacetime. It is well known that abelian noncommutative gauge theory bears a close structural similarity with non-abelian gauge theory. This fact is manifested in a non-trivial way if the present Letter is compared with existing literature, where soldering of non-abelian models are discussed. Thus the present work further establishes the robustness of the soldering programme. The subtle role played by gauge invariance (or the lack of it), in the above soldering process, is revealed in an interesting way

  16. Influence of Co and W powders on viscosity of composite solders during soldering of specially shaped diamond-abrasive tools

    Science.gov (United States)

    Sokolov, E. G.; Aref’eva, S. A.; Svistun, L. I.

    2018-03-01

    The influence of Co and W powders on the structure and the viscosity of composite solders Sn-Cu-Co-W used for the manufacture of the specially shaped diamond tools has been studied. The solders were obtained by mixing the metallic powders with an organic binder. The mixtures with and without diamonds were applied to steel rollers and shaped substrates. The sintering was carried out in a vacuum at 820 ° C with time-exposure of 40 minutes. The influence of Co and W powders on the viscosity solders was evaluated on the basis of the study of structures and according to the results of sintering specially shaped diamond tools. It was found that to provide the necessary viscosity and to obtain the uniform diamond-containing layers on the complex shaped surfaces, Sn-Cu-Co-W solder should contain 27–35 vol % of solid phase. This is achieved with a total solder content of 24–32 wt % of cobalt powder and 7 wt % of tungsten powder.

  17. Electroslag welding of rotor steels produced with vacuum-carbon reduction

    International Nuclear Information System (INIS)

    Roshchin, M.B.; Modzhuk, M.D.; Izvekov, B.V.

    1985-01-01

    Metallurgical processes of electroslag welding of rotor steels, melted with vacuum-carbon deoxidation, have been considered. It is established, that during electroslag welding of steels with carbon content 0.20...0.30%, suppression of welding bath boiling and production of dense weld metal with a high impact strength can be ensured at oxygen concentration in soldered on metal not exceeding 0.01% and silicon content 0.06...0.10%

  18. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Haiyan [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Peng, Jianke [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Fu, Li, E-mail: fuli@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Wang, Xincheng [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Xie, Yan [School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China)

    2016-04-15

    Graphical abstract: - Highlights: • The wetting angle of lead free solder on Cu was reduced by surface microstructure. • The wetting form of Sn-Ag-Cu solder on Cu was “non-composite surface”. • The experimental results had a sound fit with the theoretical calculation. - Abstract: In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  19. Soldering of Nanotubes onto Microelectrodes

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing sold...... bonds were consistently found to be mechanically stronger than the carbon nanotubes.......Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...

  20. Investigation of lactose crystallization process during condensed milk cooling using native vacuum-crystallizer

    Directory of Open Access Journals (Sweden)

    E. I. Dobriyan

    2016-01-01

    Full Text Available One of the most general defects of condensed milk with sugar is its consistency heterogeneity – “candying”. The mentioned defect is conditioned by the presence of lactose big crystals in the product. Lactose crystals size up to 10 µm is not organoleptically felt. The bigger crystals impart heterogeneity to the consistency which can be evaluated as “floury”, “sandy”, “crunch on tooth”. Big crystals form crystalline deposit on the can or industrial package bottom in the form of thick layer. Industrial processing of the product with the defective process of crystallization results in the expensive equipment damage of the equipment at the confectionary plant accompanied with heavy losses. One of the factors influencing significantly lactose crystallization is the product cooling rate. Vacuum cooling is the necessary condition for provision of the product consistency homogeneity. For this purpose the vacuum crystallizers of “Vigand” company, Germany, are used. But their production in the last years has been stopped. All-Russian dairy research institute has developed “The references for development of the native vacuum crystallizer” according to which the industrial model has been manufactured. The produced vacuum – crystallizer test on the line for condensed milk with sugar production showed that the product cooling on the native vacuum-crystallizer guarantees production of the finished product with microstructure meeting the requirements of State standard 53436–2009 “Canned Milk. Milk and condensed cream with sugar”. The carried out investigations evidences that the average lactose crystals size in the condensed milk with sugar cooled at the native crystallizer makes up 6,78 µm. The granulometric composition of the product crystalline phase cooled at the newly developed vacuum-crystallizer is completely identical to granulometric composition of the product cooled at “Vigand” vacuum-crystallizer.

  1. Effects of vacuum processing erbium dideuteride/ditritide films deposited on chromium underlays on copper substrates

    International Nuclear Information System (INIS)

    Provo, J.L.

    1978-01-01

    Thin films of erbium dideuteride/ditritide were experimentally produced on chromium underlays deposited on copper substrates. The chromium underlay is required to prevent erbium occluder/copper substrate alloying which inhibits hydriding. Data taken has shown that vacuum processing affects the erbium/chromium/copper interaction. With an in situ process in which underlay/occluder films are vacuum deposited onto copper substrates and hydrided with no air exposure between these steps, data indicates a minimum of 1500A of chromium is required for optimum hydriding. If films are vacuum deposited as above and air-exposed before hydriding, a minimum of 3000A of chromium was shown to be required for equivalent hydriding. Data suggests that the activation step (600 0 C for 1 hour) required for hydriding the film of the second type is responsible for the difference observed. Such underlay thickness parameters are important, with regard to heat transfer considerations in thin hydride targets used for neutron generation

  2. Spent nuclear fuel project cold vacuum drying facility process water conditioning system design description

    International Nuclear Information System (INIS)

    IRWIN, J.J.

    1998-01-01

    This document provides the System Design Description (SDD) for the Cold Vacuum Drying Facility (CVDF) Process Water Conditioning (PWC) System. The SDD was developed in conjunction with HNF-SD-SNF-SAR-002, Safety Analysis Report for the Cold Vacuum Drying Facility, Phase 2, Supporting Installation of Processing Systems (Garvin 1998), the HNF-SD-SNF-DRD-O02, 1998, Cold Vacuum Drying Facility Design Requirements, and the CVDF Design Summary Report. The SDD contains general descriptions of the PWC equipment, the system functions, requirements and interfaces. The SDD provides references for design and fabrication details, operation sequences and maintenance. This SDD has been developed for the SNFP Operations Organization and shall be updated, expanded, and revised in accordance with future design, construction and startup phases of the CVDF until the CVDF final ORR is approved

  3. Survival of resistant starch during the processing of atmospheric and vacuum fried instant noodles

    Directory of Open Access Journals (Sweden)

    Maria Gabriela VERNAZA

    Full Text Available Abstract The objective was to develop instant noodles (IN made by atmospheric and vacuum frying processes, with addition of 10% of three different sources of resistant starch: resistant starch type 2 (RS2, resistant starch type 3 (RS3 and green banana flour (GBF aiming the increasing of the fibre content. The IN obtained by atmospheric frying lost water faster and absorbed more fat. However, for both frying treatments, the RS3 noodles absorbed the least amount of oil. The greatest loss of RS occurred during the cooking stage. RS2 and GBF noodles presented a loss of RS of around 30% during steam cooking, while the RS3 approximately 18%. The frying process decreased RS content of noodles, however, during both frying process, the samples with the highest RS content at all frying times were noodles containing RS3. When comparing products obtained after 90 and 120 s of atmospheric and vacuum frying, respectively, it was observed that, although the frying time in vacuum process was longer, higher RS values were obtained for the three different formulations. The vacuum frying process has advantages due to the lower fat absorption (3% less, lighter colour and a reduced conversion of RS to digestible starch, compared to atmospheric frying.

  4. The metallurgical approach on the solder voids behaviour in surface mount devices

    International Nuclear Information System (INIS)

    Mohabattul Zaman Bukhari

    1996-01-01

    Solder voids are believed to cause poor heat dissiption in the Surface Mount devices and reduce the reliability of the devices at higher operating services. There are a lot of factors involved in creating voids such as gas/flux entrapment, wettability, outgasseous, air bubbles in the solder paste, inconsistency of solder coverage and improper metal scheme selection. This study was done to observe the behaviour of the solder voids in term of flux entrapmentt and wettability. It is believed that flux entrapment and wettability are verify this hypothesis. Two types of metal scheme were chosen which are Nickel (Ni) plated and Tin (Sn) plated heatsink. X-ray techniques such as Radiographic Inspection Analysis and EDAX were used to detect the minute solder voids. The solder voids observed on the heatsinks and Copper shims after the reflow process are believed to be a non contact voids that resulted from some portion of the surface not wetting properly

  5. Environmental Assessment for the vacuum process laboratory (VPL) relocation at the Lawrence Livermore National Laboratory

    International Nuclear Information System (INIS)

    1992-04-01

    This Environmental Assessment (EA) evaluates the potential environmental impacts of relocating a vacuum process laboratory (VPL) from Building 321 to Building 2231 at Lawrence Livermore National Laboratory (LLNL). The VPL provides the latest technology in the field of vacuum deposition of coatings onto various substrates for several weapons-related and energy-related programs at LLNL. Operations within the VPL at LLNL will not be expanded nor reduced by the relocation. No significant environmental impacts are expected as a result of the relocation of the VPL

  6. Characteristics of solder joints under fatigue loads using piezomechanical actuation

    Science.gov (United States)

    Shim, Dong-Jin; Spearing, S. Mark

    2003-07-01

    Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezo-ceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

  7. Vacuum Arc Melting Processes for Biomedical Ni-Ti Shape Memory Alloy

    OpenAIRE

    Tsai De-Chang; Chiang Chen-Hsueh

    2015-01-01

    This study primarily involved using a vacuum arc remelting (VAR) process to prepare a nitinol shape-memory alloy with distinct ratios of alloy components (nitinol: 54.5 wt% to 57 wt%). An advantage of using the VAR process is the adoption of a water-cooled copper crucible, which effectively prevents crucible pollution and impurity infiltration. Optimising the melting production process enables control of the alloy component and facilitates a uniformly mixed compound during subsequent processi...

  8. Definition and means of maintaining the process vacuum liquid detection interlock systems portion of the PFP safety envelope

    International Nuclear Information System (INIS)

    THOMAS, R.J.

    1999-01-01

    The Process Vacuum Liquid Detection interlock systems prevent intrusion of process liquids into the HEPA filters downstream of demisters No.6 and No.7 during Process Vacuum System operation. This prevents liquid intrusion into the filters, which could cause a criticality. The Safety Envelope (SE) includes the equipment, which detects the presence of liquids in the vacuum headers; isolates the filters; shuts down the vacuum pumps; and alarms the condition. This report identifies the equipment in the SE operating, maintenance, and surveillance procedures needed to maintain the SE equipment; and rationale for exclusion of some equipment and testing from the SE

  9. Lead-free solder technology transfer from ASE Americas

    Energy Technology Data Exchange (ETDEWEB)

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

  10. Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

    Science.gov (United States)

    Huang, Chien-Sheng; Jang, Guh-Yaw; Duh, Jenq-Gong

    2004-04-01

    Nickel-based under bump metallization (UBM) has been widely used as a diffusion barrier to prevent the rapid reaction between the Cu conductor and Sn-based solders. In this study, joints with and without solder after heat treatments were employed to evaluate the diffusion behavior of Cu in the 63Sn-37Pb/Ni/Cu/Ti/Si3N4/Si multilayer structure. The atomic flux of Cu diffused through Ni was evaluated from the concentration profiles of Cu in solder joints. During reflow, the atomic flux of Cu was on the order of 1015-1016 atoms/cm2s. However, in the assembly without solder, no Cu was detected on the surface of Ni even after ten cycles of reflow. The diffusion behavior of Cu during heat treatments was studied, and the soldering-process-induced Cu diffusion through Ni metallization was characterized. In addition, the effect of Cu content in the solder near the solder/intermetallic compound (IMC) interface on interfacial reactions between the solder and the Ni/Cu UBM was also discussed. It is evident that the (Cu,Ni)6Sn5 IMC might form as the concentration of Cu in the Sn-Cu-Ni alloy exceeds 0.6 wt.%.

  11. Vacuum mechatronics

    Science.gov (United States)

    Hackwood, Susan; Belinski, Steven E.; Beni, Gerardo

    1989-01-01

    The discipline of vacuum mechatronics is defined as the design and development of vacuum-compatible computer-controlled mechanisms for manipulating, sensing and testing in a vacuum environment. The importance of vacuum mechatronics is growing with an increased application of vacuum in space studies and in manufacturing for material processing, medicine, microelectronics, emission studies, lyophylisation, freeze drying and packaging. The quickly developing field of vacuum mechatronics will also be the driving force for the realization of an advanced era of totally enclosed clean manufacturing cells. High technology manufacturing has increasingly demanding requirements for precision manipulation, in situ process monitoring and contamination-free environments. To remove the contamination problems associated with human workers, the tendency in many manufacturing processes is to move towards total automation. This will become a requirement in the near future for e.g., microelectronics manufacturing. Automation in ultra-clean manufacturing environments is evolving into the concept of self-contained and fully enclosed manufacturing. A Self Contained Automated Robotic Factory (SCARF) is being developed as a flexible research facility for totally enclosed manufacturing. The construction and successful operation of a SCARF will provide a novel, flexible, self-contained, clean, vacuum manufacturing environment. SCARF also requires very high reliability and intelligent control. The trends in vacuum mechatronics and some of the key research issues are reviewed.

  12. Automation of experimental research of waveguide paths induction soldering

    Science.gov (United States)

    Tynchenko, V. S.; Petrenko, V. E.; Kukartsev, V. V.; Tynchenko, V. V.; Antamoshkin, O. A.

    2018-05-01

    The article presents an automated system of experimental studies of the waveguide paths induction soldering process. The system is a part of additional software for a complex of automated control of the technological process of induction soldering of thin-walled waveguide paths from aluminum alloys, expanding its capabilities. The structure of the software product, the general appearance of the controls and the potential application possibilities are presented. The utility of the developed application by approbation in a series of field experiments was considered and justified. The application of the experimental research system makes it possible to improve the process under consideration, providing the possibility of fine-tuning the control regulators, as well as keeping the statistics of the soldering process in a convenient form for analysis.

  13. Using vacuum pyrolysis and mechanical processing for recycling waste printed circuit boards

    International Nuclear Information System (INIS)

    Long Laishou; Sun Shuiyu; Zhong Sheng; Dai Wencan; Liu Jingyong; Song Weifeng

    2010-01-01

    The constant growth in generation of waste printed circuit boards (WPCB) poses a huge disposal problem because they consist of a heterogeneous mixture of organic and metallic chemicals as well as glass fiber. Also the presence of heavy metals, such as Pb and Cd turns this scrap into hazardous waste. Therefore, recycling of WPCB is an important subject not only from the recovery of valuable materials but also from the treatment of waste. The aim of this study was to present a recycling process without negative impact to the environment as an alternative for recycling WPCB. In this work, a process technology containing vacuum pyrolysis and mechanical processing was employed to recycle WPCB. At the first stage of this work, the WPCB was pyrolyzed under vacuum in a self-made batch pilot-scale fixed bed reactor to recycle organic resins contained in the WPCB. By vacuum pyrolysis the organic matter was decomposed to gases and liquids which could be used as fuels or chemical material resources, however, the inorganic WPCB matter was left unaltered as solid residues. At the second stage, the residues obtained at the first stage were investigated to separate and recover the copper through mechanical processing such as crushing, screening, and gravity separation. The copper grade of 99.50% with recovery of 99.86% based on the whole WPCB was obtained. And the glass fiber could be obtained by calcinations in a muffle furnace at 600 deg. C for 10 min. This study had demonstrated the feasibility of vacuum pyrolysis and mechanical processing for recycling WPCB.

  14. Vacuum Arc Melting Processes for Biomedical Ni-Ti Shape Memory Alloy

    Directory of Open Access Journals (Sweden)

    Tsai De-Chang

    2015-01-01

    Full Text Available This study primarily involved using a vacuum arc remelting (VAR process to prepare a nitinol shape-memory alloy with distinct ratios of alloy components (nitinol: 54.5 wt% to 57 wt%. An advantage of using the VAR process is the adoption of a water-cooled copper crucible, which effectively prevents crucible pollution and impurity infiltration. Optimising the melting production process enables control of the alloy component and facilitates a uniformly mixed compound during subsequent processing. This study involved purifying nickel and titanium and examining the characteristics of nitinol alloy after alloy melt, including its microstructure, mechanical properties, phase transition temperature, and chemical components.

  15. Glow discharge processing vs bakeout for aluminum storage ring vacuum chambers

    International Nuclear Information System (INIS)

    Dean, N.R.; Hoyt, E.W.; Palrang, M.T.; Walker, B.G.

    1977-11-01

    Experiments were carried out on laboratory and prototype scale systems in order to establish the feasibility of argon discharge processing the PEP storage ring aluminum vacuum chambers. Electron-induced desorption rates showed significant reductions following bakeout and/or argon glow discharge treatment (>10 19 ions cm -1 ). Data are presented and discussed in relation to advantages and problems associated with: water removal, argon trapping and subsequent release, electron energy dependence, discharge distribution, and surface plasma chemical effects

  16. Diffusion welding. [heat treatment of nickel alloys following single step vacuum welding process

    Science.gov (United States)

    Holko, K. H. (Inventor)

    1974-01-01

    Dispersion-strengthened nickel alloys are sanded on one side and chemically polished. This is followed by a single-step welding process wherein the polished surfaces are forced into intimate contact at 1,400 F for one hour in a vacuum. Diffusion, recrystallization, and grain growth across the original weld interface are obtained during postheating at 2,150 F for two hours in hydrogen.

  17. Processing of radioactive waste solutions in a vacuum evaporator-crystallizer

    International Nuclear Information System (INIS)

    Petrie, J.C.; Donovan, R.I.; Van der Cook, R.E.; Christensen, W.R.

    1975-01-01

    Results of the first 18 months' operation of Hanford's vacuum evaporator-crystallizer are reported. This process reduces the volume of radioactive waste solutions and simultaneously converts the waste to a less mobile salt cake. The evaporator-crystallizer is operating at better than design production rates and has reduced the volume of radioactive wastes by more than 15 million gallons. A process description, plant performance data, mechanical difficulties, and future operating plans are discussed. Also discussed is a computer model of the evaporator-crystallizer process

  18. Investigation of the crystallization process of titanium alloy ingots produced by vacuum arc melting method

    International Nuclear Information System (INIS)

    Tetyukhin, V.V.; Kurapov, V.N.; Trubin, A.N.; Demchenko, M.V.; Lazarev, V.G.; Ponedilko, S.V.; Dubrovina, N.T.; Kurapova, L.A.

    1978-01-01

    The process of crystallization and hardening of the VT3-1 and VT9 titanium alloys ingots during the vacuum-arc remelting (VAR) has been studied. In order to investigate the kinetics of the hole shape changing and the peculiarities of the ingot formation during the VAR, the radiography method has been used. It is established that the VAR of the titanium alloy ingots is basically a continuous process. An intense heating of the liquid bath mirror and the availability of high temperature gradients in the hole are the typical features of the VAR process

  19. Solder joint technology materials, properties, and reliability

    CERN Document Server

    Tu, King-Ning

    2007-01-01

    Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

  20. Leybold vacuum handbook

    CERN Document Server

    Diels, K; Diels, Kurt

    1966-01-01

    Leybold Vacuum Handbook presents a collection of data sets that are essential for numerical calculation of vacuum plants and vacuum processes. The title first covers vacuum physics, which includes gas kinetics, flow phenomena, vacuum gauges, and vapor removal. Next, the selection presents data on vacuum, high vacuum process technology, and gas desorption and gettering. The text also deals with materials, vapor pressure, boiling and melting points, and gas permeability. The book will be of great interest to engineers and technicians that deals with vacuum related technologies.

  1. Criticality safety evaluation report for the Cold Vacuum Drying Facility's process water handling system

    International Nuclear Information System (INIS)

    Roblyer, S.D.

    1998-01-01

    This report addresses the criticality concerns associated with process water handling in the Cold Vacuum Drying Facility (CVDF). The controls and limitations on equipment design and operations to control potential criticality occurrences are identified. The effectiveness of equipment design and operation controls in preventing criticality occurrences during normal and abnormal conditions is evaluated and documented in this report. Spent nuclear fuel (SNF) is removed from existing canisters in both the K East and K West Basins and loaded into a multicanister overpack (MCO) in the K Basin pool. The MCO is housed in a shipping cask surrounded by clean water in the annulus between the exterior of the MCO and the interior of the shipping cask. The fuel consists of spent N Reactor and some single pass reactor fuel. The MCO is transported to the CVDF near the K Basins to remove process water from the MCO interior and from the shipping cask annulus. After the bulk water is removed from the MCO, any remaining free liquid is removed by drawing a vacuum on the MCO's interior. After cold vacuum drying is completed, the MCO is filled with an inert cover gas, the lid is replaced on the shipping cask, and the MCO is transported to the Canister Storage Building. The process water removed from the MCO contains fissionable materials from metallic uranium corrosion. The process water from the MCO is first collected in a geometrically safe process water conditioning receiver tank. The process water in the process water conditioning receiver tank is tested, then filtered, demineralized, and collected in the storage tank. The process water is finally removed from the storage tank and transported from the CVDF by truck

  2. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xiao, H., E-mail: xiaohui2013@yahoo.com.cn; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-11-25

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R{sub 0}/R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints.

  3. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    International Nuclear Information System (INIS)

    Xiao, H.; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-01-01

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R 0 /R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints

  4. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  5. Development of the vacuum drying process for the PWR spent nuclear fuel dry storage

    Energy Technology Data Exchange (ETDEWEB)

    Baeg, Chagn Yeal; Cho, Chun Hyung [Korea Radioactive Waste Agency, Daejeon (Korea, Republic of)

    2016-12-15

    This paper describes the development of a dry operation process for PWR spent nuclear fuel, which is currently stored in the domestic NPP's storage pool, using a dual purpose metal cask. Domestic NNPs have had experience with wet type transportation of PWR spent nuclear fuel between neighboring NPPs since the early 1990s, but no experience with dry type operation. For this reason, we developed a specific operation process and also confirmed the safety of the major cask components and its spent nuclear fuel during the dual purpose metal cask operation process. We also describe the short term operation process that was established to be completed within 21 hours and propose the allowable working time for each step (15 hours for wet process, 3 hours for drain process and 3 hours for vacuum drying process)

  6. Mechanical properties and production quality of hand-layup and vacuum infusion processed hybrid composite materials for GFRP marine structures

    Science.gov (United States)

    Kim, Sang-Young; Shim, Chun Sik; Sturtevant, Caleb; Kim, Dave (Dae-Wook); Song, Ha Cheol

    2014-09-01

    Glass Fiber Reinforced Plastic (GFRP) structures are primarily manufactured using hand lay-up or vacuum infusion techniques, which are cost-effective for the construction of marine vessels. This paper aims to investigate the mechanical properties and failure mechanisms of the hybrid GFRP composites, formed by applying the hand lay-up processed exterior and the vacuum infusion processed interior layups, providing benefits for structural performance and ease of manufacturing. The hybrid GFRP composites contain one, two, and three vacuum infusion processed layer sets with consistent sets of hand lay-up processed layers. Mechanical properties assessed in this study include tensile, compressive and in-plane shear properties. Hybrid composites with three sets of vacuum infusion layers showed the highest tensile mechanical properties while those with two sets had the highest mechanical properties in compression. The batch homogeneity, for the GFRP fabrication processes, is evaluated using the experimentally obtained mechanical properties

  7. Mechanical properties and production quality of hand-layup and vacuum infusion processed hybrid composite materials for GFRP marine structures

    Directory of Open Access Journals (Sweden)

    Kim Sang-Young

    2014-09-01

    Full Text Available Glass Fiber Reinforced Plastic (GFRP structures are primarily manufactured using hand lay-up or vacuum infusion techniques, which are cost-effective for the construction of marine vessels. This paper aims to investigate the mechanical properties and failure mechanisms of the hybrid GFRP composites, formed by applying the hand lay-up processed exterior and the vacuum infusion processed interior layups, providing benefits for structural performance and ease of manufacturing. The hybrid GFRP composites contain one, two, and three vacuum infusion processed layer sets with consistent sets of hand lay-up processed layers. Mechanical properties assessed in this study include tensile, compressive and in-plane shear properties. Hybrid composites with three sets of vacuum infusion layers showed the highest tensile mechanical properties while those with two sets had the highest mechanical properties in compression. The batch homogeneity, for the GFRP fabrication processes, is evaluated using the experimentally obtained mechanical properties

  8. Mechanical properties and production quality of hand-layup and vacuum infusion processed hybrid composite materials for GFRP marine structures

    Directory of Open Access Journals (Sweden)

    Sang-Young Kim

    2014-09-01

    Full Text Available Glass Fiber Reinforced Plastic (GFRP structures are primarily manufactured using hand lay-up or vacuum infusion techniques, which are cost-effective for the construction of marine vessels. This paper aims to investigate the mechanical properties and failure mechanisms of the hybrid GFRP composites, formed by applying the hand lay-up processed exterior and the vacuum infusion processed interior layups, providing benefits for structural performance and ease of manufacturing. The hybrid GFRP composites contain one, two, and three vacuum infusion processed layer sets with consistent sets of hand lay-up processed layers. Mechanical properties assessed in this study include tensile, compressive and in-plane shear properties. Hybrid composites with three sets of vacuum infusion layers showed the highest tensile mechanical properties while those with two sets had the highest mechanical properties in compression. The batch homogeneity, for the GFRP fabrication processes, is evaluated using the experimentally obtained mechanical properties.

  9. Soldering and brazing safety guide: A handbook on space practice for those involved in soldering and brazing

    Science.gov (United States)

    This manual provides those involved in welding and brazing with effective safety procedures for use in performance of their jobs. Hazards exist in four types of general soldering and brazing processes: (1) cleaning; (2) application of flux; (3) application of heat and filler metal; and (4) residue cleaning. Most hazards during those operations can be avoided by using care, proper ventilation, protective clothing and equipment. Specific process hazards for various methods of brazing and soldering are treated. Methods to check ventilation are presented as well as a check of personal hygiene and good maintenance practices are stressed. Several emergency first aid treatments are described.

  10. Short term preservation of hide using vacuum: influence on properties of hide and of processed leather.

    Science.gov (United States)

    Gudro, Ilze; Valeika, Virgilijus; Sirvaitytė, Justa

    2014-01-01

    The objective of this work was to investigate vacuum influence on hide preservation time and how it affects hide structure. It was established that vacuum prolongs the storage time without hide tissue putrefaction up to 21 days when the storage temperature is 4°C. The microorganisms act for all storage times, but the action is weak and has no observable influence on the quality of hide during the time period mentioned. The hide shrinkage temperature decrease is negligible, which shows that breaking of intermolecular bonds does not occur. Optical microscopy, infrared spectroscopy and differential scanning calorimetry also did not show any structural changes which can influence the quality of leather produced from such hide. The qualitative indexes of wet blue processed under laboratory conditions and of leather produced during industrial trials are presented. Indexes such as chromium compounds exhaustion, content of chromium in leather, content of soluble matter in dichloromethane, strength properties, and shrinkage temperature were determined. Properties of the leather produced from vacuumed hide under industrial conditions conformed to the requirements of shoe upper leather.

  11. Effect of Joint Scale and Processing on the Fracture of Sn-3Ag-0.5Cu Solder Joints: Application to Micro-bumps in 3D Packages

    Science.gov (United States)

    Talebanpour, B.; Huang, Z.; Chen, Z.; Dutta, I.

    2016-01-01

    In 3-dimensional (3D) packages, a stack of dies is vertically connected to each other using through-silicon vias and very thin solder micro-bumps. The thinness of the micro-bumps results in joints with a very high volumetric proportion of intermetallic compounds (IMCs), rendering them much more brittle compared to conventional joints. Because of this, the reliability of micro-bumps, and the dependence thereof on the proportion of IMC in the joint, is of substantial concern. In this paper, the growth kinetics of IMCs in thin Sn-3Ag-0.5Cu joints attached to Cu substrates were analyzed, and empirical kinetic laws for the growth of Cu6Sn5 and Cu3Sn in thin joints were obtained. Modified compact mixed mode fracture mechanics samples, with adhesive solder joints between massive Cu substrates, having similar thickness and IMC content as actual micro-bumps, were produced. The effects of IMC proportion and strain rate on fracture toughness and mechanisms were investigated. It was found that the fracture toughness G C decreased with decreasing joint thickness ( h Joint). In addition, the fracture toughness decreased with increasing strain rate. Aging also promoted alternation of the crack path between the two joint-substrate interfaces, possibly proffering a mechanism to enhance fracture toughness.

  12. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

  13. Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

    DEFF Research Database (Denmark)

    Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper

    2009-01-01

    of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling. solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft....... The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers...

  14. Design of parallel intersector weld/cut robot for machining processes in ITER vacuum vessel

    International Nuclear Information System (INIS)

    Wu Huapeng; Handroos, Heikki; Kovanen, Janne; Rouvinen, Asko; Hannukainen, Petri; Saira, Tanja; Jones, Lawrence

    2003-01-01

    This paper presents a new parallel robot Penta-WH, which has five degrees of freedom driven by hydraulic cylinders. The manipulator has a large, singularity-free workspace and high stiffness and it acts as a transport device for welding, machining and inspection end-effectors inside the ITER vacuum vessel. The presented kinematic structure of a parallel robot is particularly suitable for the ITER environment. Analysis of the machining process for ITER, such as the machining methods and forces are given, and the kinematic analyses, such as workspace and force capacity are discussed

  15. Key composition optimization of meat processed protein source by vacuum freeze-drying technology

    Directory of Open Access Journals (Sweden)

    Yan Ma

    2018-05-01

    Full Text Available Vacuum freeze-drying technology is a high technology content, a wide range of knowledge of technology in the field of drying technology is involved, it is also a method of the most complex drying equipment, the largest energy consumption, the highest cost of drying method, but due to the particularity of its dry goods: the freeze-drying food has the advantages of complex water performance is good, cooler and luster of freezing and drying food to maintain good products, less nutrient loss, light weight, easy to carry transportation, easy to long-term preservation, and on the quality is far superior to the obvious advantages of other dried food, making it become the forefront of drying technology research and development. The freeze-drying process of Chinese style ham and western Germany fruit tree tenderloin is studied in this paper, their eutectic point, melting point and collapse temperature, freeze-drying curve and its heat and mass transfer characteristics are got, then the precool temperature and the highest limiting temperature of sublimation interface are determined. The effect of system pressure on freeze-dried rate in freeze-drying process is discussed, and the method of regulating pressure circularly is determined. Keywords: Ham, Tenderloin, Vacuum freeze-dry, Processing, Optimization

  16. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    International Nuclear Information System (INIS)

    Li Guangdong; Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu

    2010-01-01

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  17. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    Energy Technology Data Exchange (ETDEWEB)

    Li Guangdong, E-mail: liguangdong@emails.bjut.edu.c [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China); Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China)

    2010-02-18

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  18. Oxidation and Reduction of Liquid SnPb (60/40) under Ambient and Vacuum Conditions

    DEFF Research Database (Denmark)

    Kuhmann, Jochen Friedrich; Maly, K.; Preuss, A.

    1998-01-01

    One of the most straightforward approaches to fluxless solder bonding is using vacuum conditions to prevent further oxidation and, where needed, to reduce solder oxides by the use of molecular hydrogen (H-2).(1-3) This study On oxidation and reduction of solder oxides on SnPb (60/40) is aimed...... to provide a better understanding for fluxless solder bonding applications under controlled atmospheric conditions; By means of scanning Auger spectroscopy it is shown, that growth of oxide films on metallic SnPb above the eutectic temperature can be significantly reduced by decreasing the O-2 partial...

  19. Thermomechanical behavior of tin-rich (lead-free) solders

    Science.gov (United States)

    Sidhu, Rajen Singh

    In order to adequately characterize the behavior of ball-grid-array (BGA) Pb-free solder spheres in electronic devices, the microstructure and thermomechanical behavior need to be studied. Microstructure characterization of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-3.9Ag-0.7Cu alloys was conducted using optical microscopy, scanning electron microscopy, transmission electron microscopy, image analysis, and a novel serial sectioning 3D reconstruction process. Microstructure-based finite-element method (FEM) modeling of deformation in Sn-3.5Ag alloy was conducted, and it will be shown that this technique is more accurate when compared to traditional unit cell models for simulating and understanding material behavior. The effect of cooling rate on microstructure and creep behavior of bulk Sn-rich solders was studied. The creep behavior was evaluated at 25, 95, and 120°C. Faster cooling rates were found to increase the creep strength of the solders due to refinement of the solder microstructure. The creep behavior of Sn-rich single solder spheres reflowed on Cu substrates was studied at 25, 60, 95, and 130°C. Testing was conducted using a microforce testing system, with lap-shear geometry samples. The solder joints displayed two distinct creep behaviors: (a) precipitation-strengthening (Sn-3.5Ag and Sn-3.9Ag-0.7Cu) and (b) power law creep accommodated by grain boundary sliding (GBS) (Sn and Sn-0.7Cu). The relationship between microstructural features (i.e. intermetallic particle size and spacing), stress exponents, threshold stress, and activation energies are discussed. The relationship between small-length scale creep behavior and bulk behavior is also addressed. To better understand the damage evolution in Sn-rich solder joints during thermal fatigue, the local damage will be correlated to the cyclic hysteresis behavior and crystal orientations present in the Sn phase of solder joints. FEM modeling will also be utilized to better understand the macroscopic and local

  20. An environmentally-friendly vacuum reduction metallurgical process to recover germanium from coal fly ash

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Lingen; Xu, Zhenming, E-mail: zmxu@sjtu.edu.cn

    2016-07-15

    Highlights: • An environmental friendly vacuum reduction metallurgical process is proposed. • Rare and valuable metal germanium from coal fly ash is recycled. • Residues are not a hazardous material and can be further recycled. • A germanium recovery ratio of 94.64% is obtained in pilot scale experiments. - Abstract: The demand for germanium in the field of semiconductor, electronics, and optical devices is growing rapidly; however, the resources of germanium are scarce worldwide. As a secondary material, coal fly ash could be further recycled to retrieve germanium. Up to now, the conventional processes to recover germanium have two problems as follows: on the one hand, it is difficult to be satisfactory for its economic and environmental effect; on the other hand, the recovery ratio of germanium is not all that could be desired. In this paper, an environmentally-friendly vacuum reduction metallurgical process (VRMP) was proposed to recover germanium from coal fly ash. The results of the laboratory scale experiments indicated that the appropriate parameters were 1173 K and 10 Pa with 10 wt% coke addition for 40 min, and recovery ratio germanium was 93.96%. On the basis of above condition, the pilot scale experiments were utilized to assess the actual effect of VRMP for recovery of germanium with parameter of 1473 K, 1–10 Pa and heating time 40 min, the recovery ratio of germanium reached 94.64%. This process considerably enhances germanium recovery, meanwhile, eliminates much of the water usage and residue secondary pollution compared with other conventional processes.

  1. Wafer-level vacuum/hermetic packaging technologies for MEMS

    Science.gov (United States)

    Lee, Sang-Hyun; Mitchell, Jay; Welch, Warren; Lee, Sangwoo; Najafi, Khalil

    2010-02-01

    An overview of wafer-level packaging technologies developed at the University of Michigan is presented. Two sets of packaging technologies are discussed: (i) a low temperature wafer-level packaging processes for vacuum/hermeticity sealing, and (ii) an environmentally resistant packaging (ERP) technology for thermal and mechanical control as well as vacuum packaging. The low temperature wafer-level encapsulation processes are implemented using solder bond rings which are first patterned on a cap wafer and then mated with a device wafer in order to encircle and encapsulate the device at temperatures ranging from 200 to 390 °C. Vacuum levels below 10 mTorr were achieved with yields in an optimized process of better than 90%. Pressures were monitored for more than 4 years yielding important information on reliability and process control. The ERP adopts an environment isolation platform in the packaging substrate. The isolation platform is designed to provide low power oven-control, vibration isolation and shock protection. It involves batch flip-chip assembly of a MEMS device onto the isolation platform wafer. The MEMS device and isolation structure are encapsulated at the wafer-level by another substrate with vertical feedthroughs for vacuum/hermetic sealing and electrical signal connections. This technology was developed for high performance gyroscopes, but can be applied to any type of MEMS device.

  2. Vacuumed gap membrane distillation (vagmed) module, multi-stage vagmed systems, and vagmed processes

    KAUST Repository

    Ghaffour, NorEddine; Alsaadi, Ahmad Salem; Francis, Lijo

    2016-01-01

    Vacuumed gap membrane distillation (VAGMED) modules, and multi-stage VAGMED systems and processes using the modules are provided. In an embodiment, the membrane distillation modules (10) can comprise: a) a condenser (12) including a condensation surface (15); b) a first passageway (13) having an inlet for receiving a first feed stream (14) and an outlet through which the first stream can pass out of the first passageway, the first passageway configured to bring the first feed stream into thermal communication with the condensation surface; c) an evaporator (17) including a permeable evaporation surface allowing condensable gas to pass there through; d) a second passageway (18) having an inlet for receiving a second feed stream (19) and an outlet through which the second feed stream can pass out of the second passageway, the second passageway configured to bring the second feed stream into communication with the permeable evaporation surface; and e) an enclosure (24) providing a vacuum compartment within which the condenser, the evaporator and the first and second passageways of the module are contained.

  3. Evaluation of synergistic effect in vacuum pack, refrigeration and irradiated treatments of minimally processed cassava

    International Nuclear Information System (INIS)

    Pedroso, Bianca Maria

    2005-01-01

    Cassava is cultivated almost all over the world and it is considered one of the most important nutritious sources of calories in the human diet. Cassava is a viable food against starvation in several poor areas of the world because it is an extremely resistant culture and may reach satisfactory economical yield. We utilized vacuum packed industrialized cassava irradiated with 0,1 kGy, 3kGy and 5kGy and stored under refrigeration for 1, 21, 30 and 50 days. Our objective was to analyse the synergistic effect of vacuum packing, irradiation and refrigeration on the preservation of minimally processed cassava. The samples were analyzed for pH, acidity, weight, humidity, texture and color. The irradiation did not affect the chemical characteristics of the cassava. Neither the pH nor the acidity, the most relevant variables to verify deterioration in cassava, presented significant alterations during the period of storage. Comparing the irradiated treatments, the dose of 1kGy and 3kGy affected the physic-chemical characteristics of the cassava the least during the period of storage and refrigeration for 50 days; the doses of 1kGy,3kGy and 5kGy scored the highest rates the sensorial analysis during the period of storage for 21 days. (author)

  4. Vacuumed gap membrane distillation (vagmed) module, multi-stage vagmed systems, and vagmed processes

    KAUST Repository

    Ghaffour, Noreddine

    2016-06-30

    Vacuumed gap membrane distillation (VAGMED) modules, and multi-stage VAGMED systems and processes using the modules are provided. In an embodiment, the membrane distillation modules (10) can comprise: a) a condenser (12) including a condensation surface (15); b) a first passageway (13) having an inlet for receiving a first feed stream (14) and an outlet through which the first stream can pass out of the first passageway, the first passageway configured to bring the first feed stream into thermal communication with the condensation surface; c) an evaporator (17) including a permeable evaporation surface allowing condensable gas to pass there through; d) a second passageway (18) having an inlet for receiving a second feed stream (19) and an outlet through which the second feed stream can pass out of the second passageway, the second passageway configured to bring the second feed stream into communication with the permeable evaporation surface; and e) an enclosure (24) providing a vacuum compartment within which the condenser, the evaporator and the first and second passageways of the module are contained.

  5. Research Regarding the Anticorosiv Protection of Atmospheric and Vacuum Distillation Unit that Process Crude Oil

    Directory of Open Access Journals (Sweden)

    M. Morosanu

    2011-12-01

    Full Text Available Due to high boiling temperature, organic acids are present in the warmer areas of metal equipment from atmospheric and vacuum distillation units and determine, increased corrosion processes in furnace tubes, transfer lines, metal equipment within the distillation columns etc. In order to protect the corrosion of metal equipment from atmospheric and vacuum distillation units, against acids, de authors researched solution which integrates corrosion inhibitors and selecting materials for equipment construction. For this purpose, we tested the inhibitor PET 1441, which has dialchilfosfat in his composition and inhibitor based on phosphate ester. In this case, to the metal surface forms a complex phosphorous that forms of high temperature and high fluid speed. In order to form the passive layer and to achieve a 90% protection, we initially insert a shock dose, and in order to ensure further protection there is used a dose of 20 ppm. The check of anticorrosion protection namely the inhibition efficiency is achieved by testing samples made from steel different.

  6. Improvement of the operational performance of SRF cavities via in situ helium processing and waveguide vacuum processing

    International Nuclear Information System (INIS)

    Reece, C.E.; Drury, M.; Rao, M.G.; Nguyen-Tuong, V.

    1997-01-01

    The useful performance range of the superconducting rf (SRF) cavities in the CEBAF accelerator at Jefferson Lab is frequently limited by electron field emission and derived phenomena. Improvements are required to support future operation of the accelerator at higher than 5 GeV. Twelve operational cryomodules have been successfully processed to higher useful operating gradients via rf-helium processing. Progress against field emission was evidenced by improved high-field Q, reduced x-ray production and greatly reduced incidence of arcing at the cold ceramic window. There was no difficulty reestablishing beamline vacuum following the processing. Cavities previously limited to 4-6 MV/m are now operating stably at 6-9 MV/m. By applying a pulsed-rf processing technique, we have also improved the pressure stability of the thermal transition region of the input waveguide for several cavities

  7. The KALPUREX-process – A new vacuum pumping process for exhaust gases in fusion power plants

    International Nuclear Information System (INIS)

    Giegerich, Thomas; Day, Christian

    2014-01-01

    Highlights: • A new vacuum pumping process for fusion power plants has been developed and is presented in this paper. • This process works continuously and non-cryogenic what leads to a strong reduction of the tritium inventory in the fuel cycle. • This pumping process is based on the use of a liquid metal (mercury) as working fluid and is called KALPUREX process. • The KALPUREX process is the technical realization of the DIR concept using a set of three vacuum pumps (metal foil pump/diffusion pump/liquid ring pump). • This paper discusses the arrangement of the pumps and also the required infrastructure for operation. - Abstract: The Karlsruhe Institute of Technology (KIT) is developing a continuously working and non-cryogenic pumping solution for torus exhaust pumping of a demonstration power plant (DEMO) including Direct Internal Recycling (DIR). This full pumping system consists of three pumps, namely a metal foil pump for gas separation, a linear diffusion pump as primary pump and a liquid ring pump as backing pump. The latter two pumps apply mercury as working fluid due to its perfect tritium compatibility. This asks for a baffle system on both sides of the pumping train to control working fluid vapour and to avoid any mercury propagation in the machine. In this paper, the arrangement of all torus pumps required for a power plant reactor as well as the corresponding infrastructure and its effect on the DEMO machine design is presented and discussed. The full pumping process is called ‘Karlsruhe liquid metal based pumping process for fusion reactor exhaust gases’ (KALPUREX process, patent pending)

  8. The KALPUREX-process – A new vacuum pumping process for exhaust gases in fusion power plants

    Energy Technology Data Exchange (ETDEWEB)

    Giegerich, Thomas, E-mail: thomas.giegerich@kit.edu; Day, Christian

    2014-10-15

    Highlights: • A new vacuum pumping process for fusion power plants has been developed and is presented in this paper. • This process works continuously and non-cryogenic what leads to a strong reduction of the tritium inventory in the fuel cycle. • This pumping process is based on the use of a liquid metal (mercury) as working fluid and is called KALPUREX process. • The KALPUREX process is the technical realization of the DIR concept using a set of three vacuum pumps (metal foil pump/diffusion pump/liquid ring pump). • This paper discusses the arrangement of the pumps and also the required infrastructure for operation. - Abstract: The Karlsruhe Institute of Technology (KIT) is developing a continuously working and non-cryogenic pumping solution for torus exhaust pumping of a demonstration power plant (DEMO) including Direct Internal Recycling (DIR). This full pumping system consists of three pumps, namely a metal foil pump for gas separation, a linear diffusion pump as primary pump and a liquid ring pump as backing pump. The latter two pumps apply mercury as working fluid due to its perfect tritium compatibility. This asks for a baffle system on both sides of the pumping train to control working fluid vapour and to avoid any mercury propagation in the machine. In this paper, the arrangement of all torus pumps required for a power plant reactor as well as the corresponding infrastructure and its effect on the DEMO machine design is presented and discussed. The full pumping process is called ‘Karlsruhe liquid metal based pumping process for fusion reactor exhaust gases’ (KALPUREX process, patent pending)

  9. Acetylene Flow Rate as a Crucial Parameter of Vacuum Carburizing Process of Modern Tool Steels

    Directory of Open Access Journals (Sweden)

    Rokicki P.

    2016-12-01

    Full Text Available Carburizing is one of the most popular and wide used thermo-chemical treatment methods of surface modification of tool steels. It is a process based on carbon diffusive enrichment of the surface material and is applied for elements that are supposed to present higher hardness and wear resistance sustaining core ductility. Typical elements submitted to carburizing process are gears, shafts, pins and bearing elements. In the last years, more and more popular, especially in highly advanced treatment procedures used in the aerospace industry is vacuum carburizing. It is a process based on chemical treatment of the surface in lower pressure, providing much higher uniformity of carburized layer, lower process cost and much lesser negative impact on environment to compare with conventional carburizing methods, as for example gas carburizing in Endo atmosphere. Unfortunately, aerospace industry requires much more detailed description of the phenomena linked to this process method and the literature background shows lack of tests that could confirm fulfilment of all needed requirements and to understand the process itself in much deeper meaning. In the presented paper, authors focused their research on acetylene flow impact on carburized layer characteristic. This is one of the most crucial parameters concerning homogeneity and uniformity of carburized layer properties. That is why, specific process methodology have been planned based on different acetylene flow values, and the surface layer of the steel gears have been investigated in meaning to impact on any possible change in potential properties of the final product.

  10. Spectroscopic investigation of oxidized solder surfaces

    International Nuclear Information System (INIS)

    Song, Jenn-Ming; Chang-Chien, Yu-Chien; Huang, Bo-Chang; Chen, Wei-Ting; Shie, Chi-Rung; Hsu, Chuang-Yao

    2011-01-01

    Highlights: → UV-visible spectroscopy is successfully used to evaluate the degree of discoloring of solders. → The surface oxides of solders can also be identified by UV-visible absorption spectra. → The discoloration of solder surface can be correlated with optical characterization of oxides. → A strategy against discoloring by alloying was also suggested. - Abstract: For further understanding of the discoloration of solder surfaces due to oxidation during the assembly and operation of electronic devices, UV-vis and X-ray photoelectron spectroscopic analyses were applied to evaluate the degree of discoloring and identify the surface oxides. The decrease in reflectance of the oxidized solder surface is related to SnO whose absorption band is located within the visible region. A trace of P can effectively depress the discoloration of solders under both solid and semi-solid states through the suppression of SnO.

  11. The H-Oil process: a worldwide leader in vacuum residue hydro processing

    Energy Technology Data Exchange (ETDEWEB)

    Colyar, J.J.; Wisdom, L.I.; Koskas, A.

    1996-12-31

    The h-Oil process is a catalytic hydrocracking process which is used to convert and upgrade petroleum residua and heavy oils. This paper discusses additional background information on the H-Oil process, some of the key advances made to the process and applications for the Latin America market. 5 refs., 6 tabs.., 2 figs.

  12. Lead free solder mechanics and reliability

    CERN Document Server

    Pang, John Hock Lye

    2012-01-01

    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

  13. Experimental Investigation of Surface Color Changes in Vacuum Evaporation Process for Gold-like Stainless Steel

    Directory of Open Access Journals (Sweden)

    Yang Baojian

    2016-01-01

    Full Text Available In order to reduce the environmental pollution caused by the three wastes during the process of electroplating of gold-like film on stainless steel, in this paper, the "vacuum evaporation and annealing" composite technologies were adopted to evaporate gold-like film in 16 stainless steel 304 substrates, and electronic color cards and color software were also used for analyzing the color and luster of the gold-like film. Experiments shows that the negative pressure, annealing temperature and mass fraction of the double copper alloys have influence on preparation of imitation in assaying the fineness of gold film, the annealing temperature has significant effects on imitation in assaying the fineness of gold film.

  14. Impacts of friction stir processing on irradiation effects in vacuum-plasma-spray coated tungsten

    Energy Technology Data Exchange (ETDEWEB)

    Ozawa, Kazumi, E-mail: ozawa.kazumi@jaea.go.jp [Fusion Research and Development Directorate, Japan Atomic Energy Agency, 2-166 Obuchi-Omotedate, Rokkasho, Aomori 039-3212 (Japan); Tanigawa, Hiroyasu [Fusion Research and Development Directorate, Japan Atomic Energy Agency, 2-166 Obuchi-Omotedate, Rokkasho, Aomori 039-3212 (Japan); Morisada, Yoshiaki; Fujii, Hidetoshi [Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047 (Japan)

    2015-10-15

    In order to examine the impacts of friction stir processing (FSP) on irradiation effects in vacuum-plasma-spray (VPS) coated tungsten (W), nano indentation hardness was evaluated of three kinds of W materials after self-ion-irradiation to 5.0–5.4 dpa at 500 and 800 °C. The VPS-FSP clearly got grains refined and isotropic compared to bulk-W and the as-VPS-W. Nano indentation hardness remains unchanged for the as-VPS-W and VPS-FSP × 2-W irradiated to 5.4 dpa at 500 °C and it decreased from 1 dpa at 800 °C, while typical irradiation induced hardening was observed for the bulk-W irradiated at 500 °C.

  15. Experimental study and process parameters analysis on the vacuum cooling of iceberg lettuce

    International Nuclear Information System (INIS)

    He Suyan; Li Yunfei

    2008-01-01

    The vacuum cooling of iceberg lettuce was described in this paper. Based on the energy and mass balance, a mathematical model was developed to analyze the performance of the vacuum cooler and the evaporation-boiling phenomena during vacuum cooling of iceberg lettuce. The temporal trends of total system pressure, produce temperature such as surface temperature, center temperature, mass-average temperature, the weight loss of iceberg lettuce during vacuum cooling were predicted. Validation experimentation is achieved in the designed vacuum cooler. The experimental data were compared with the simulation results. It was found that the differences of the temperature between the simulation and the experiments were within 1 deg. C. The amount of water evaporated from the iceberg lettuce by simulation was 3.32% during the whole vacuum cooling, while the tested water loss rate was 2.97%, the maximal deviation of weight loss was within 0.59%. The simulation results agreed well with the experimental data

  16. Experimental study and process parameters analysis on the vacuum cooling of iceberg lettuce

    Energy Technology Data Exchange (ETDEWEB)

    He Suyan [School of Mechanical and Electrical Engineering, Qingdao University, Qingdao 266071 (China)], E-mail: hesuyan67829@sina.com; Li Yunfei [Department of Food Science and Engineering, School of Agriculture and Biology, Shanghai Jiao Tong University (China)

    2008-10-15

    The vacuum cooling of iceberg lettuce was described in this paper. Based on the energy and mass balance, a mathematical model was developed to analyze the performance of the vacuum cooler and the evaporation-boiling phenomena during vacuum cooling of iceberg lettuce. The temporal trends of total system pressure, produce temperature such as surface temperature, center temperature, mass-average temperature, the weight loss of iceberg lettuce during vacuum cooling were predicted. Validation experimentation is achieved in the designed vacuum cooler. The experimental data were compared with the simulation results. It was found that the differences of the temperature between the simulation and the experiments were within 1 deg. C. The amount of water evaporated from the iceberg lettuce by simulation was 3.32% during the whole vacuum cooling, while the tested water loss rate was 2.97%, the maximal deviation of weight loss was within 0.59%. The simulation results agreed well with the experimental data.

  17. Design of a HACCP plan for the industrial process of vacuum-packed frozen surimi

    Directory of Open Access Journals (Sweden)

    Catarina Fernandes

    2014-05-01

    Full Text Available The Hazard Analysis and Critical Control Point (HACCP is a system that enables identification, assessment and control of hazards related with production, processing, distribution in order to get safe food. The aim of this study was to design a HACCP plan for implementing in a processing line of vacuum-packed frozen surimi. Surimi is made from fisheries byproducts that may have initial unattractive characteristics and whose industrial processing adds commercial value. Heterogeneous quality of raw products and the high complexity of the industrial flowchart may induce problems in the final sanitary profile of surimi. The methodology was based in the evaluation of the pre-requisite programs, risk evaluation of considered hazards, the application of principles of HACCP and the compliance with European regulations. A HACCP plan is proposed with the scope, the selection of HACCP team, product description and its intended use, the flow diagram of the process, hazard analysis and identification of Critical Control Points (CCP, monitoring system, correction actions and records. The potential hazards identified were: excess of chloride (chemical, remains of fishbone (physical and growth of human-related pathogens after defrosting (biological. The control measures of CCP are referred as control of time-temperature and pH in pre-wash and defrosting stages and visual inspection during depulping process.

  18. [Evaluation of the quality of poultry meat and its processing for vacuum packaging].

    Science.gov (United States)

    Swiderski, F; Russel, S; Waszkiewicz-Robak, B; Cholewińska, E

    1997-01-01

    The aim of study was to evaluate the quality of poultry meat, roasted and smoked chicken and poultry pie packing under low and high vacuum. All investigated products were stored at +4 degrees C and evaluated by microbiological analysis. It was showed that packing under low and high vacuum inhibited development of aerobic microorganisms, proteolytic bacteria, yeasts and moulds. Vacuum-packaged storage of poultry meat and its products stimulated activity of anaerobic, nonsporeforming bacteria. The fast spoilage of fresh poultry meat was observed both under vacuum and conventional storage. The microbiology quality of poultry products depended on technology of production and microbiological quality of raw material.

  19. A review on solder reflow and flux application for flip chip

    Science.gov (United States)

    Suppiah, Sarveshvaran; Ong, Nestor Rubio; Sauli, Zaliman; Sarukunaselan, Karunavani; Alcain, Jesselyn Barro; Visvanathan, Susthitha Menon; Retnasamy, Vithyacharan

    2017-09-01

    This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

  20. Thermal decomposition of solder flux activators under simulated wave soldering conditions

    DEFF Research Database (Denmark)

    Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    /methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base...... titration method as a function of temperature, time of exposure and the substrate material used. Findings: The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL...

  1. Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

    Science.gov (United States)

    Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

    2016-12-01

    To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys ( T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

  2. Fundamentals of a moderate thermocracking-deep deasphalting combined process of Karamay vacuum residue

    Energy Technology Data Exchange (ETDEWEB)

    Zhiming, X; Tonghua, L.; Suogi, Z.; Renan, W. [University of Petroleum, State Key Laboratory of Heavy Oil Processing, Beijing (China); Lailong, L.; Zhen, L. [Karamay Petrochemical Company, Petrochemical Research Institute, Karamay (China)

    2004-07-01

    Thermocracking of heavy oil vacuum residue was carried out to determine the optimum conditions for the thermal cracking of Karamay vacuum residue prior to coke formation. The vacuum residue and the cracked residue after distillation were separated using supercritical fluid extraction and fractionation techniques. Sixteen and thirteen fractions and non-extractable end cuts respectively were separated, and their properties, compositions and average structures determined. Solubility parameters of the end cuts were measured, and those of the fractions calculated. The solubility parameter of the end cut of distilled residue was found to have greatly increased. It was determined that when the difference of the end cut and the extractable fractions amounts to 6.37MPa1/2, in the case of Karamay vacuum residue coke will deposit under thermocracking conditions. Based on the results of a series of solvent deep deasphalting experiments, a scheme for vacuum residue thermocracking and deasphalting of the cracked residue was proposed.

  3. Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock

    Science.gov (United States)

    Han, Jing; Tan, Shihai; Guo, Fu

    2018-01-01

    Ball grid array (BGA) samples were soldered on a printed circuit board with Sn37Pb solder paste to investigate the recrystallization induced by subgrain rotation during thermal shock. The composition of the solder balls was Sn3.0Ag0.5Cu-Sn37Pb, which comprised mixed solder joints. The BGA component was cross-sectioned before thermal shock. The microstructure and grain orientations were obtained by a scanning electron microscope equipped with an electron back-scattered diffraction system. Two mixed solder joints at corners of the BGA component were selected as the subjects. The results showed that recrystallization occurred at the corner of the solder joints after 200 thermal shock cycles. The recrystallized subgrains had various new grain orientations. The newly generated grain orientations were closely related to the initial grain orientations, which indicated that different subgrain rotation behaviors could occur in one mixed solder joint with the same initial grain orientation. When the misorientation angles were very small, the rotation axes were about Sn [100], [010] and [001], as shown by analyzing the misorientation angles and subgrain rotation axes, while the subgrain rotation behavior with large misorientation angles in the solder joints was much more complicated. As Pb was contained in the solder joints and the stress was concentrated on the corner of the mixed solder joints, concaves and cracks were formed. When the adjacent recrystallized subgrains were separated, and the process of the continuous recrystallization was limited.

  4. Nano-soldering to single atomic layer

    Science.gov (United States)

    Girit, Caglar O [Berkeley, CA; Zettl, Alexander K [Kensington, CA

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  5. Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

    International Nuclear Information System (INIS)

    Durairaj, R.; Ramesh, S.; Mallik, S.; Seman, A.; Ekere, N.

    2009-01-01

    Lead-free solder paste printing process accounts for majority of the assembly defects in the electronic manufacturing industry. The study investigates rheological behaviour and stencil printing performance of the lead-free solder pastes (Sn/Ag/Cu). Oscillatory stress sweep test was carried out to study the visco-elastic behaviour of the lead-free solder pastes. The visco-elastic behaviour of the paste encompasses solid and liquid characteristic of the paste, which could be used to study the flow behaviour experienced by the pastes during the stencil printing process. From this study, it was found that the solid characteristics (G') is higher than the liquid characteristic (G'') for the pastes material. In addition, the results from the study showed that the solder paste with a large G' = G'' has a higher cohesiveness resulting in poor withdrawal of the paste during the stencil printing process. The phase angles (δ) was used to correlate the quality of the dense suspensions to the formulation of solder paste materials. This study has revealed the value of having a rheological measurement for explaining and characterising solder pastes for stencil printing. As the demand for lead free pastes increases rheological measurements can assist with the formulation or development of new pastes.

  6. Comparative shear tests of some low temperature lead-free solder pastes

    Science.gov (United States)

    Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.

    2016-12-01

    The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

  7. Investigation on solder joint strength of nickel tin-plated and CRS tabs with PCB

    International Nuclear Information System (INIS)

    Luay Hussain

    2002-01-01

    Failure analysis on easily peels off Nickel and CRS steel tabs from PCB was carried out. Nickel Tin plated tabs, CRS steel tabs and tube were joined to the PCB using reflow/ convection soldering, in an oven. The solder paste composition is Sn36/Pb35/Ag2. Peel test was conducted and it was found that many tabs could be easily peeled off with low force. Porosities which varies from 0.4 mm to < 0.01mm in diameter, developed during soldering process and solidification was noted. It was found, the number, size and position of these porosities inside the solder layer on both parts of the tabs affect the peel strength. Scanning Electron Microscopy study and EDX analysis were carried out. It was found that the low peel strength values were due to the combination of generation and development of porosities during soldering process which act as stress concentrators and the evolution (growth) of eutectic Sn/Pb and Sn/Ni/Cu brittle grainy phase. Large eutectic microstructure with brittle Sn-Ni-Cu grainy phase enhances the failure with low peeling forces. Sample showing no feature of Sn/Ni/Cu grain gave high peeling strength value. Solder reflow, an important process, can result in strength enhancement (if it was controlled for example in a furnace). (Author)

  8. Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

    Science.gov (United States)

    Rolin, T. D.; Hodge, R. E.

    2008-01-01

    An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

  9. Nanoscale Soldering of Positioned Carbon Nanotubes using Highly Conductive Electron Beam Induced Gold Deposition

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    We have developed an in-situ method for controlled positioning of carbon nanotubes followed by highly conductive contacting of the nanotubes, using electron beam assisted deposition of gold. The positioning and soldering process takes place inside an Environmental Scanning Electron Microscope (E...... in a carbon matrix. Nanoscale soldering of multi-walled carbon nanotubes (MWNT) onto microelectrodes was achieved by deposition of a conducting gold line across a contact point between nanotube and electrode. The solderings were found to be mechanically stronger than the carbon nanotubes. We have positioned...... MWNTs to bridge the gap between two electrodes, and formed soldering bonds between the tube and each of the electrodes. All nanotube bridges showed ohmic resistances in the range 10-30 kΩ. We observed no increase in resistance after exposing the MWNT bridge to air for days....

  10. Development of vacuum glazing with advanced thermal properties - Final report

    Energy Technology Data Exchange (ETDEWEB)

    Koebel, M.; Manz, H.

    2009-03-15

    Windows constitute a weak link in the building envelope and hence contribute significantly to the total heating energy demand in buildings. By evacuating the glazing cavity a vacuum glazing is created and heat transfer can be significantly reduced. This project was designed to build knowledge and technology necessary to fabricate vacuum glazing with advanced thermal properties. More specifically, various strategies for improvement of conventional technology were investigated. Of central importance was the development of a novel edge sealing approach which can in theory circumvent the main limitation of conventional glass soldering technology. This approach which is rapid, low temperature, low cost and completely vacuum compatible was filed for patenting in 2008. With regards to thermal insulation performance and glazing deflection, numerical studies were performed demonstrating the importance of nonlinear behavior with glazing size and the results published. A detailed service life prediction model was elaborated which defines a set of parameters necessary to keep the expected pressure increase below a threshold value of 0.1 Pa after 30 years. The model takes into account four possible sources of pressure increase and a getter material which acts as a sink. For the production of 0.5 m by 0.5 m glazing assembly prototypes, a high vacuum chamber was constructed and a first sealing prototype realized therein. The manufacture of improved prototypes and optimization of the anodic bonding edge sealing technology with emphasis on process relevant aspects is the goal of a follow-up project. (authors)

  11. Fabrication of SiCp/Al Alloy Composites by In-situ Vacuum Hot Press Process

    Energy Technology Data Exchange (ETDEWEB)

    Choi, S. W.; Hong, S. K.; Kim, Y. M.; Kang, C. S. [Chonnam National University, Kwangju (Korea); Chang, S. Y. [Hanyang University, Seoul (Korea)

    2001-07-01

    SiCp/pure Al and SiCp/2024Al MMCs were fabricated by in-situ VHP process designed specially just in this study which is composed of the vacuum hot press at range from R.T. to 500 deg.C and the continuous extrusion without canning process at 520 deg.C. It was investigated the effect of SiC particle size, volume fraction and extrusion ratio on the tensile properties and micro structure in all composites. In case of the 10:1 extrusion ratio, but SiCp/pure Al and SiCp/2024Al composites were shown a sound appearance and a good micro structure without crack of SiCp as well as uniform distribution of SiCp. However, in case of the 16:1 extrusion ratio, the number of cracked SiC particles more than increased in a higher volume fraction composite and 2024Al matrix composite compared with pure Al matrix one. The tensile strength of the composites reinforced smaller SiCp was higher than that of the bigger SiCp reinforced in same volume fraction and extrusion ratio. (author) 14 refs., 14 figs.

  12. Key composition optimization of meat processed protein source by vacuum freeze-drying technology.

    Science.gov (United States)

    Ma, Yan; Wu, Xingzhuang; Zhang, Qi; Giovanni, Vigna; Meng, Xianjun

    2018-05-01

    Vacuum freeze-drying technology is a high technology content, a wide range of knowledge of technology in the field of drying technology is involved, it is also a method of the most complex drying equipment, the largest energy consumption, the highest cost of drying method, but due to the particularity of its dry goods: the freeze-drying food has the advantages of complex water performance is good, cooler and luster of freezing and drying food to maintain good products, less nutrient loss, light weight, easy to carry transportation, easy to long-term preservation, and on the quality is far superior to the obvious advantages of other dried food, making it become the forefront of drying technology research and development. The freeze-drying process of Chinese style ham and western Germany fruit tree tenderloin is studied in this paper, their eutectic point, melting point and collapse temperature, freeze-drying curve and its heat and mass transfer characteristics are got, then the precool temperature and the highest limiting temperature of sublimation interface are determined. The effect of system pressure on freeze-dried rate in freeze-drying process is discussed, and the method of regulating pressure circularly is determined.

  13. Processing and Properties of Vacuum Assisted Resin Transfer Molded Phenylethynyl Terminated Imide Composites

    Science.gov (United States)

    Cano, Roberto J.; Ghose, Sayata; Watson, Kent A.; Chunchu, Prasad B.; Jensen, Brian J.; Connell, John W.

    2012-01-01

    Polyimide composites are very attractive for applications that require a high strength to weight ratio and thermal stability. Recent work at NASA Langley Research Center (LaRC) has concentrated on developing new polyimide resin systems that can be processed without the use of an autoclave for advanced aerospace applications. Due to their low melt viscosities and long melt stability, certain phenylethynyl terminated imides (PETI) can be processed into composites using high temperature vacuum assisted resin transfer molding (HT-VARTM). VARTM has shown the potential to reduce the manufacturing cost of composite structures. In the current study, two PETI resins, LARC(Trademark) PETI-330 and LARC(Trademark) PETI-9, were infused into carbon fiber preforms at 260 C and cured at temperatures up to 371 C. Photomicrographs of polished cross sections were taken and void contents, determined by acid digestion, were below 4.5%. Mechanical properties including short block compression (SBC), compression after impact (CAI), and open hole compression (OHC) were determined at room temperature, 177 C, and 288 C. Both PETI-9 and PETI-330 composites demonstrated very good retention of mechanical properties at elevated temperatures. SBC and OHC properties after aging for 1000 hours at temperatures up to 288 C were also determined.

  14. Development and Evaluation of a Novel Integrated Vacuum Carbonate Absorption Process

    Energy Technology Data Exchange (ETDEWEB)

    Lu, Yongqi; Rostam-Abadi, Massoud; Ye, Xinhuai; Zhang, Shihan; Ruhter, David; Khodayari, Arezoo; Rood, Mark

    2012-04-30

    This project was aimed at obtaining process engineering and scale-up data at a laboratory scale to investigate the technical and economic feasibility of a patented post-combustion carbon dioxide (CO{sub 2}) capture process?the Integrated Vacuum Carbonate Absorption Process (IVCAP). Unique features of the IVCAP include its ability to be fully-integrated with the power plant?s steam cycle and potential for combined sulfur dioxide (SO{sub 2}) removal and CO{sub 2} capture. Theoretical and experimental studies of this project were aimed at answering three major technical questions: 1) What additives can effectively reduce the water vapor saturation pressure and energy requirement for water vaporization in the vacuum stripper of the IVCAP? 2) What catalysts can promote CO{sub 2} absorption into the potassium carbonate (PC) solution to achieve an overall absorption rate comparable to monoethanolamine (MEA) and are the catalysts stable at the IVCAP conditions and in the flue gas environment? 3) Are any process modifications needed to combine SO{sub 2} and CO{sub 2} removal in the IVCAP? Lab-scale experiments and thermodynamic and process simulation studies performed to obtain detailed information pertinent to the above three technical questions produced the following results: 1) Two additives were identified that lower the saturation pressure of water vapor over the PC solution by about 20%. 2) The carbonic anhydrase (CA) enzyme was identified as the most effective catalyst for promoting CO{sub 2} absorption. The absorption rate into the CO{sub 2}-lean PC solution promoted with 300 mg/L CA was several times slower than the corresponding 5 M MEA solution, but absorption into the CO{sub 2}-rich PC solution was comparable to the CO{sub 2}-rich MEA solution. The tested CA enzymes demonstrated excellent resistance to major flue gas impurities. A technical-grade CA enzyme was stable at 40{degrees}C (104{degrees}F) over a six-month test period, while its half-life was about two

  15. Calculation of the process of vacuum drying of a metal-concrete container with spent nuclear fuel

    Science.gov (United States)

    Karyakin, Yu. E.; Lavrent'ev, S. A.; Pavlyukevich, N. V.; Pletnev, A. A.; Fedorovich, E. D.

    2012-01-01

    An algorithm and results of calculation of the process of vacuum drying of a metal-concrete container intended for long-term "dry" storage of spent nuclear fuel are presented. A calculated substantiation of the initial amount of moisture in the container is given.

  16. System on chip thermal vacuum sensor based on standard CMOS process

    International Nuclear Information System (INIS)

    Li Jinfeng; Tang Zhenan; Wang Jiaqi

    2009-01-01

    An on-chip microelectromechanical system was fabricated in a 0.5 μm standard CMOS process for gas pressure detection. The sensor was based on a micro-hotplate (MHP) and had been integrated with a rail to rail operational amplifier and an 8-bit successive approximation register (SAR) A/D converter. A tungsten resistor was manufactured on the MHP as the sensing element, and the sacrificial layer of the sensor was made from polysilicon and etched by surface-micromachining technology. The operational amplifier was configured to make the sensor operate in constant current mode. A digital bit stream was provided as the system output. The measurement results demonstrate that the gas pressure sensitive range of the vacuum sensor extends from 1 to 10 5 Pa. In the gas pressure range from 1 to 100 Pa, the sensitivity of the sensor is 0.23 mV/ Pa, the linearity is 4.95%, and the hysteresis is 8.69%. The operational amplifier can drive 200 ω resistors distortionlessly, and the SAR A/D converter achieves a resolution of 7.4 bit with 100 kHz sample rate. The performance of the operational amplifier and the SAR A/D converter meets the requirements of the sensor system.

  17. Quantum processes: probability fluxes, transition probabilities in unit time and vacuum vibrations

    International Nuclear Information System (INIS)

    Oleinik, V.P.; Arepjev, Ju D.

    1989-01-01

    Transition probabilities in unit time and probability fluxes are compared in studying the elementary quantum processes -the decay of a bound state under the action of time-varying and constant electric fields. It is shown that the difference between these quantities may be considerable, and so the use of transition probabilities W instead of probability fluxes Π, in calculating the particle fluxes, may lead to serious errors. The quantity W represents the rate of change with time of the population of the energy levels relating partly to the real states and partly to the virtual ones, and it cannot be directly measured in experiment. The vacuum background is shown to be continuously distorted when a perturbation acts on a system. Because of this the viewpoint of an observer on the physical properties of real particles continuously varies with time. This fact is not taken into consideration in the conventional theory of quantum transitions based on using the notion of probability amplitude. As a result, the probability amplitudes lose their physical meaning. All the physical information on quantum dynamics of a system is contained in the mean values of physical quantities. The existence of considerable differences between the quantities W and Π permits one in principle to make a choice of the correct theory of quantum transitions on the basis of experimental data. (author)

  18. Assessment of vacuum-assisted closure therapy on the wound healing process in cardiac surgery.

    Science.gov (United States)

    Pericleous, Agamemnon; Dimitrakakis, Georgios; Photiades, Renos; von Oppell, Ulrich O

    2016-12-01

    Postoperative deep sternal wound infection (DSWI) is a serious complication in cardiac surgery (1-5% of patients) with high mortality and morbidity rates. Vacuum-assisted closure (VAC) therapy has shown promising results in terms of wound healing process, postoperative hospital length of stay and lower in-hospital costs. The aim of our retrospective study is to report the outcome of patients with DSWI treated with VAC therapy and to assess the effect of contributory risk factors. Data of 52 patients who have been treated with VAC therapy in a single institution (study period: September 2003-March 2012) were collected electronically through PAtient Tracking System PATS and statistically analysed using SPSS version 20. Of the 52 patients (35 M: 17 F), 88·5% (n = 46) were solely treated with VAC therapy and 11·5% (n = 6) had additional plastic surgical intervention. Follow-up was complete (mean 33·8 months) with an overall mortality rate of 26·9% (n = 14) of whom 50% (n = 7) died in hospital. No death was related to VAC complications. Patient outcomes were affected by pre-operative, intra-operative and postoperative risk factors. Logistic EUROscore, postoperative hospital length of stay, advanced age, chronic obstructive pulmonary disease (COPD) and long-term corticosteroid treatment appear to be significant contributing factors in the long-term survival of patients treated with VAC therapy. © 2015 Medicalhelplines.com Inc and John Wiley & Sons Ltd.

  19. Development of a vacuum distillation process for Pu pyro-chemistry spent salts treatment

    International Nuclear Information System (INIS)

    Bourges, G.; Lambertin, D.; Baudrot, C.; Pescayre, L.; Thiebaut, C.

    2004-01-01

    The pyrochemical purification of plutonium has generated spent salts, which are disposed in nuclear facility. To reduce stored quantities, the development of a pyrochemical treatment is in progress. The feed salt, typically composed of various Pu and Am species spread into monovalent or divalent chloride matrix, is first oxidized to convert the actinides into oxides. Then the chlorides are separated from the actinide oxides by vacuum distillation. Temperatures higher than 750 deg C for mono-chloride salts mixture NaCl/KCl and higher than 1100 deg C for divalent CaCl 2 base salts, are required to produce an industrial flow of vaporization. Inactive qualification of the process for NaCl/KCl base salt has been carried with lanthanide surrogates. Then, a pilot equipment, called Distillator has been designed and built for production-scale distillation of NaCl/KCl and CaCl 2 oxidized plutonium salts. Industrial flows of vaporization have been obtained with this pilot equipment: about 4 g/cm 2 /h for NaCl/KCl at 800 - 900 deg C and 1 Pa, and more than 1.5 g/cm 2 /h for CaCl 2 base salts between 1000 - 1200 deg C at 0.1 Pa. The last step will be the integration of the Distillator into a glove box. (authors)

  20. Experimental study and process parameters analysis on the vacuum cooling of iceberg lettuce

    Energy Technology Data Exchange (ETDEWEB)

    He, Su-Yan [School of Mechanical and Electrical Engineering, Qingdao University, Qingdao 266071 (China); Li, Yun-Fei [Department of Food Science and Engineering, School of Agriculture and Biology, Shanghai Jiao Tong University (China)

    2008-10-15

    The vacuum cooling of iceberg lettuce was described in this paper. Based on the energy and mass balance, a mathematical model was developed to analyze the performance of the vacuum cooler and the evaporation-boiling phenomena during vacuum cooling of iceberg lettuce. The temporal trends of total system pressure, produce temperature such as surface temperature, center temperature, mass-average temperature, the weight loss of iceberg lettuce during vacuum cooling were predicted. Validation experimentation is achieved in the designed vacuum cooler. The experimental data were compared with the simulation results. It was found that the differences of the temperature between the simulation and the experiments were within 1{sup o}C. The amount of water evaporated from the iceberg lettuce by simulation was 3.32% during the whole vacuum cooling, while the tested water loss rate was 2.97%, the maximal deviation of weight loss was within 0.59%. The simulation results agreed well with the experimental data. (author)

  1. Demonstration of a batch vacuum thermal desorption process on hazardous and mixed waste

    International Nuclear Information System (INIS)

    Palmer, C.R.; McElwee, M.; Meyers, G.

    1995-01-01

    Many different waste streams have been identified at Department of Energy (DOE) facilities as having both hazardous organic and radioactive contaminants. There is presently only one permitted facility in which to manage these materials, and that facility has only limited capacity to process solid wastes. Over the past two years, Rust has been pilot testing a new thermal desorption process that is very well suited to these wastes, and has begun permitting and design of a unit for commercial operation. This paper presents both historic and recent pilot test data on the treatment of hazardous and mixed waste. Also described is the commercial unit. Rust's patented VAC*TRAX technology takes advantage of high vacuum to reduced operating temperature for the thermal desorption of organic contaminants from waste soils, sludges and other contaminated solids. This allows for economical thermal separation on relatively small sites (30 to 5,000 m 3 of waste). VAC*TRAX employs indirect heating; this, combined with a very low carrier gas flow, results in a vent flow rate of approximately 1 m 3 /min which allows for the use of control devices that would not be practical with conventional thermal technology. The unit is therefore ideally suited to processing mixed waste, since zero radioactive emissions can be maintained. An additional benefit of the technology is that the low operating temperature allows highly effective separation to be performed well below the degradation point for the solid components of a trash type waste stream, which constitutes a large fraction of the present mixed waste inventory

  2. Technical and environmental assessment of the scrap tire vacuum pyrolysis process

    International Nuclear Information System (INIS)

    Roy, C.; Caumia, B. de; Lebrecque, B.; Blanchette, D.; Pakdel, H.; Roy, V.

    1991-01-01

    Tire recycling has become a necessity because of the huge piles of tires which represent a threat to the environment. There is about one worn tire produced per year and per person in the developed countries. The used tires represent a source of energy and valuable chemical products. By thermal decomposition of rubber under reduced pressure, it is possible to recover the useful compounds. A step by step approach has been used, from bench-scale batch systems, to process development and finally pilot plant, to experiment and develop vacuum pyrolysis of used tires. Yields are: 55% oil, 25% carbon black, 9% steel, 5% fiber and 6% gas. The maximum recovery of oil was performed at 415 degree C below 2 kPa abs. The specific gravity of this oil was 0.95, its gross heating value was 43 MJ/kg and total sulfur content about 0.8%. It was rich in limonene, benzol and other petrochemical components. The carbon black favorably compared with the low standard grades and may find an application in low grade rubber goods following further research and development. From an environmental point of view, the quality of the gas emissions was found to be acceptable based on the province of Quebec regulations. The aqueous phase contains toxic substances which will be eliminated after blending and burning it with pyrolysis oils used to heat up the reactor. The heat of pyrolysis for the reactions is low, estimated around 700 kJ/kg. The process has been tested in a 200 kg/h pilot plant, which positively demonstrated the possibility of continuously feeding large chunks of rubber under a vacuo. The process feasibility is promising, with returns on the investment of 31% after three years of operation. 9 refs., 4 figs., 8 tabs

  3. Thermal and mechanical properties of lead-free SnZn–xNa casting alloys, and interfacial chemistry on Cu substrates during the soldering process

    Energy Technology Data Exchange (ETDEWEB)

    Gancarz, Tomasz, E-mail: tomasz.gancarz@imim.pl [Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Krakow (Poland); Bobrowski, Piotr; Pstruś, Janusz [Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Krakow (Poland); Pawlak, Sylwia [Wroclaw Research Centre EIT+, Wroclaw (Poland)

    2016-09-15

    The microstructural features, thermal properties and mechanical properties of eutectic Sn–Zn alloys with varying Na content (0.1, 0.2, 0.5, 1.0 3.0 and 5.0 at. %) were examined in this study. In the scanning electron microscopy, transmission electron microscopy, and X-ray diffraction analysis data, precipitates of NaSn were observed. The addition of Na to eutectic Sn–Zn alloy improved the mechanical properties and increased electrical resistivity, and reduced the coefficient of thermal expansion; however, the melting point did not change. Wettability tests carried out using Na-doped Sn–15Zn alloys on Cu substrates showed the formation of Cu–Zn phases at the interfaces. Wettability studies were performed using flux ALU33 after 60, 180, 480, 900, 1800 and 3600 s of contact, at temperatures of 230, 250, 280 and 320 °C. The experiments were designed to demonstrate the effect of Na addition on the formation and growth kinetics of Cu{sub 5}Zn{sub 8} and CuZn{sub 4} phases, which were identified using XRDs and EDS. The addition of Na to SnZn causes a reduction in the thickness of the intermetallic compounds layer created at the interface between the liquid solder and the Cu substrate, and an increase in the activation energy of the Cu{sub 5}Zn{sub 8} phase compared to eutectic SnZn. - Highlights: • Precipitates of NaSn was observed and confirmed using TEM and XRD. • Addition Na to eutectic SnZn cussed increased the mechanical properties. • IMCs of Na–Zn and Na–Sn increased electrical resistivity and reduced the CTE. • IMCs layers CuZn{sub 4} and Cu{sub 5}Zn{sub 8} was found at the interface. • Na content changing the character of growth CuZn{sub 4} layer in SnZnNa alloys.

  4. Dye-enhanced protein solders and patches in laser-assisted tissue welding.

    Science.gov (United States)

    Small, W; Heredia, N J; Maitland, D J; Da Silva, L B; Matthews, D L

    1997-01-01

    This study examines the use of dye-enhanced protein bonding agents in 805 nm diode laser-assisted tissue welding. A comparison of an albumin liquid solder and collagen solid-matrix patches used to repair arteriotomies in an in vitro porcine model is presented. Extrinsic bonding media in the form of solders and patches have been used to enhance the practice of laser tissue welding. Preferential absorption of the laser wavelength has been achieved by the incorporation of chromophores. Both the solder and the patch included indocyanine green dye (ICG) to absorb the 805 nm continuous-wave diode laser light used to perform the welds. Solder-mediated welds were divided into two groups (high power/short exposure and low power/long exposure), and the patches were divided into three thickness groups ranging from 0.1 to 1.3 mm. The power used to activate the patches was constant, but the exposure time was increased with patch thickness. Burst pressure results indicated that solder-mediated and patched welds yielded similar average burst strengths in most cases, but the patches provided a higher success rate (i.e., more often exceeded 150 mmHg) and were more consistent (i.e., smaller standard deviation) than the solder. The strongest welds were obtained using 1.0-1.3 mm thick patches, while the high power/short exposure solder group was the weakest. Though the solder and patches yielded similar acute weld strengths, the solid-matrix patches facilitated the welding process and provided consistently strong welds. The material properties of the extrinsic agents influenced their performance.

  5. The constitutive response of three solder materials

    International Nuclear Information System (INIS)

    Perez-Bergquist, Alejandro G.; Cao Fang; Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T.

    2012-01-01

    Highlights: ► The full constitutive response of three solder materials. ► Test temperatures from −196 °C to 60 °C and strain rates from 10 −3 to >10 3 s −1 . ► Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (−196 °C to 60 °C) and strain rate (10 −3 to >10 3 s −1 ). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  6. The constitutive response of three solder materials

    Energy Technology Data Exchange (ETDEWEB)

    Perez-Bergquist, Alejandro G., E-mail: alexpb@lanl.gov [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States); Cao Fang [Exxon Mobil Research and Engineering Company, Annadale, NJ 08801 (United States); Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T. [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States)

    2012-05-25

    Highlights: Black-Right-Pointing-Pointer The full constitutive response of three solder materials. Black-Right-Pointing-Pointer Test temperatures from -196 Degree-Sign C to 60 Degree-Sign C and strain rates from 10{sup -3} to >10{sup 3} s{sup -1}. Black-Right-Pointing-Pointer Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (-196 Degree-Sign C to 60 Degree-Sign C) and strain rate (10{sup -3} to >10{sup 3} s{sup -1}). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  7. Characterization of the microstructure of tin-silver lead free solder

    Energy Technology Data Exchange (ETDEWEB)

    Hurtony, Tamás, E-mail: hurtony@ett.bme.hu [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary); Szakál, Alex; Almásy, László [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Len, Adél [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Faculty of Engineering and Information Technology, University of Pécs (Hungary); Kugler, Sándor [Department of Theoretical Physics, Budapest University of Technology and Economics (Hungary); Bonyár, Attila; Gordon, Péter [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary)

    2016-07-05

    Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag{sub 3}Sn phases.

  8. A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

    Science.gov (United States)

    Wei, Helin; Wang, Kuisheng

    2011-11-01

    Numerous studies of the reliability of solder joints have been performed. Most life prediction models are limited to a deterministic approach. However, manufacturing induces uncertainty in the geometry parameters of solder joints, and the environmental temperature varies widely due to end-user diversity, creating uncertainties in the reliability of solder joints. In this study, a methodology for accounting for variation in the lifetime prediction for lead-free solder joints of ball grid array packages (PBGA) is demonstrated. The key aspects of the solder joint parameters and the cyclic temperature range related to reliability are involved. Probabilistic solutions of the inelastic strain range and thermal fatigue life based on the Engelmaier model are developed to determine the probability of solder joint failure. The results indicate that the standard deviation increases significantly when more random variations are involved. Using the probabilistic method, the influence of each variable on the thermal fatigue life is quantified. This information can be used to optimize product design and process validation acceptance criteria. The probabilistic approach creates the opportunity to identify the root causes of failed samples from product fatigue tests and field returns. The method can be applied to better understand how variation affects parameters of interest in an electronic package design with area array interconnections.

  9. The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints.

    Science.gov (United States)

    Fattahi, Farnaz; Hashemi Ardakani, Zahra; Hashemi Ardakani, Maryam

    2015-12-01

    Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint of the bar, and were placed at the considered angles by employing an explicitly designed device. They were divided into 4 groups regarding the gap angle; Group C (control group) with parallel gap on steady distance of 0.2mm, Group 1: 10°, Group 2: 20°, and Group3: 30° gap angles. When soldered, the specimens were all tested for tensile strength using a universal testing machine at a cross-head speed of 0.5 mm/min with a preload of 10N. Kruskal-Wallis H test was used to compare tensile strength among the groups (ptensile strength values obtained from the study groups were respectively 307.84, 391.50, 365.18, and 368.86 MPa. The tensile strength was not statistically different among the four groups in general (p≤ 0.490). Making the gap angular at the solder joints and the subsequent unsteady increase of the gap distance would not change the tensile strength of the joint.

  10. Technological process and optimum design of organic materials vacuum pyrolysis and indium chlorinated separation from waste liquid crystal display panels

    Energy Technology Data Exchange (ETDEWEB)

    Ma, En; Xu, Zhenming, E-mail: zmxu@sjtu.edu.cn

    2013-12-15

    Highlights: • The vacuum pyrolysis–vacuum chlorinated separation system was proposed to recover the waste LCD panel. • The system can recycle the whole waste LCD panels efficiently without negative effects to environment. • The 82.03% of the organic materials was reclaimed. All pyrolysis products can be utilized by a reasonable way. • The separation of indium was optimized by the central composite design (CCD) under response surface methodology (RSM). • The recovery ratio of indium was further increased to 99.97%. -- Abstract: In this study, a technology process including vacuum pyrolysis and vacuum chlorinated separation was proposed to convert waste liquid crystal display (LCD) panels into useful resources using self-design apparatuses. The suitable pyrolysis temperature and pressure are determined as 300 °C and 50 Pa at first. The organic parts of the panels were converted to oil (79.10 wt%) and gas (2.93 wt%). Then the technology of separating indium was optimized by central composite design (CCD) under response surface methodology (RSM). The results indicated the indium recovery ratio was 99.97% when the particle size is less than 0.16 mm, the weight percentage of NH{sub 4}Cl to glass powder is 50 wt% and temperature is 450 °C. The research results show that the organic materials, indium and glass of LCD panel can be recovered during the recovery process efficiently and eco-friendly.

  11. Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States); Burress, R.V. [SEHO (United States)] [and others

    1995-06-01

    The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

  12. Simulation of the heat and mass transfer processes during the vacuum frying of potato chips

    Directory of Open Access Journals (Sweden)

    Ram Yamsaengsung

    2008-01-01

    Full Text Available A fundamental two-dimensional model to predict the heat and mass transfer that occur during the vacuum frying of potato chips was solved using the Finite Element toolbox in MATLAB 6.1. The simulation of the heat transfer process included the convection of heat from the surface to the product, the conduction of heat into the product, and a loss of heat using the heat source term representing evaporation. The mass transfer process was divided into two periods: (1 water loss and (2 oil absorption. The first scenario included a diffusion term and a source term. The source term represented the convection and evaporation of water from the product. For the second period, the diffusion term represented the gradual absorption of oil through capillary diffusion.From the simulation, a good agreement between the experimental data and the predicted values was obtained. From the heat transfer model, the rapid increase in temperature of the product toward the boiling point of water (at the associated pressure followed by its steady increase toward the temperature of the oil was validated. Furthermore, by separating the rate of moisture loss into two parts to represent the constant rate and falling rate period of drying, the model was able to predict an initial period of rapid moisture loss followed by a decreasing rate of moisture loss. The simulation also demonstrated the formation of the crust and the gradual movement of the crust inward. Finally, using two sets of diffusion coefficients that correlated to the two schemes of moisture loss, the model predicted the rapid flux of oil into the product during the constant drying stage, followed by a small amount of oil absorption into its interior once the crust had been established.

  13. Robust Low Cost Liquid Rocket Combustion Chamber by Advanced Vacuum Plasma Process

    Science.gov (United States)

    Holmes, Richard; Elam, Sandra; Ellis, David L.; McKechnie, Timothy; Hickman, Robert; Rose, M. Franklin (Technical Monitor)

    2001-01-01

    Next-generation, regeneratively cooled rocket engines will require materials that can withstand high temperatures while retaining high thermal conductivity. Fabrication techniques must be cost efficient so that engine components can be manufactured within the constraints of shrinking budgets. Three technologies have been combined to produce an advanced liquid rocket engine combustion chamber at NASA-Marshall Space Flight Center (MSFC) using relatively low-cost, vacuum-plasma-spray (VPS) techniques. Copper alloy NARloy-Z was replaced with a new high performance Cu-8Cr-4Nb alloy developed by NASA-Glenn Research Center (GRC), which possesses excellent high-temperature strength, creep resistance, and low cycle fatigue behavior combined with exceptional thermal stability. Functional gradient technology, developed building composite cartridges for space furnaces was incorporated to add oxidation resistant and thermal barrier coatings as an integral part of the hot wall of the liner during the VPS process. NiCrAlY, utilized to produce durable protective coating for the space shuttle high pressure fuel turbopump (BPFTP) turbine blades, was used as the functional gradient material coating (FGM). The FGM not only serves as a protection from oxidation or blanching, the main cause of engine failure, but also serves as a thermal barrier because of its lower thermal conductivity, reducing the temperature of the combustion liner 200 F, from 1000 F to 800 F producing longer life. The objective of this program was to develop and demonstrate the technology to fabricate high-performance, robust, inexpensive combustion chambers for advanced propulsion systems (such as Lockheed-Martin's VentureStar and NASA's Reusable Launch Vehicle, RLV) using the low-cost VPS process. VPS formed combustion chamber test articles have been formed with the FGM hot wall built in and hot fire tested, demonstrating for the first time a coating that will remain intact through the hot firing test, and with

  14. Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

    Science.gov (United States)

    Amalu, E. H.; Lui, Y. T.; Ekere, N. N.; Bhatti, R. S.; Takyi, G.

    2011-01-01

    The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

  15. Optimal parameters for laser tissue soldering

    Science.gov (United States)

    McNally-Heintzelman, Karen M.; Sorg, Brian S.; Chan, Eric K.; Welch, Ashley J.; Dawes, Judith M.; Owen, Earl R.

    1998-07-01

    Variations in laser irradiance, exposure time, solder composition, chromophore type and concentration have led to inconsistencies in published results of laser-solder repair of tissue. To determine optimal parameters for laser tissue soldering, an in vitro study was performed using an 808-nm diode laser in conjunction with an indocyanine green (ICG)- doped albumin protein solder to weld bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The effects of laser irradiance and exposure time on tensile strength of the weld and temperature rise as well as the effect of hydration on bond stability were investigated. Optimum irradiance and exposure times were identified for each solder type. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the weld. A reduction in dye concentration from 2.5 mg/ml to 0.25 mg/ml was also found to result in an increase in tensile strength. The strongest welds were produced with an irradiance of 6.4 W/cm2 for 50 s using a solid protein solder composed of 60% BSA and 0.25 mg/ml ICG. Steady-state solder surface temperatures were observed to reach 85 plus or minus 5 degrees Celsius with a temperature gradient across the solid protein solder strips of between 15 and 20 degrees Celsius. Finally, tensile strength was observed to decrease significantly (20 to 25%) after the first hour of hydration in phosphate-buffered saline. No appreciable change was observed in the strength of the tissue bonds with further hydration.

  16. Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

    National Research Council Canada - National Science Library

    Reuse, Rolando

    2005-01-01

    .... The thermomechanical cycling in the solder causes numerous reliability challenges, mostly because of the mismatch of the coefficient of thermal expansion between the silicon chip and the substrate...

  17. Laser tissue welding mediated with a protein solder

    Science.gov (United States)

    Small, Ward, IV; Heredia, Nicholas J.; Celliers, Peter M.; Da Silva, Luiz B.; Eder, David C.; Glinsky, Michael E.; London, Richard A.; Maitland, Duncan J.; Matthews, Dennis L.; Soltz, Barbara A.

    1996-05-01

    A study of laser tissue welding mediated with an indocyanine green dye-enhanced protein solder was performed. Freshly obtained sections of porcine artery were used for the experiments. Sample arterial wall thickness ranged from two to three millimeters. Incisions approximately four millimeters in length were treated using an 805 nanometer continuous- wave diode laser coupled to a one millimeter diameter fiber. Controlled parameters included the power delivered by the laser, the duration of the welding process, and the concentration of dye in the solder. A two-color infrared detection system was constructed to monitor the surface temperatures achieved at the weld site. Burst pressure measurements were made to quantify the strengths of the welds immediately following completion of the welding procedure.

  18. Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

    DEFF Research Database (Denmark)

    Conseil, Helene; Verdingovas, Vadimas; Jellesen, Morten Stendahl

    2016-01-01

    No-clean flux systems are used today for the soldering of electronic printed circuit board assemblies assuming that all the aggressive substances of the flux will vanish during the soldering process i.e. evaporate, decompose or being enclosed safely in the residues. However this is not true in most...... that the fluxes do not decompose fully within the temperature regime of the soldering process, leaving behind significant level of weak organic acid residues. The residue depending on the type and amount can be can be very aggressive towards the corrosion on the printed circuit board assemblies. The glutaric acid...

  19. Vacuum pyrolysis and hydrometallurgical process for the recovery of valuable metals from spent lithium-ion batteries

    Energy Technology Data Exchange (ETDEWEB)

    Sun, Liang [College of Chemistry and Chemical Engineering, Central South University, Changsha 410083 (China); Key Laboratory of Resources Chemistry of Nonferrous Metals, Central South University, Ministry of Education of the People' s Republic of China (China); Qiu, Keqiang, E-mail: qiuwhs@sohu.com [College of Chemistry and Chemical Engineering, Central South University, Changsha 410083 (China); Key Laboratory of Resources Chemistry of Nonferrous Metals, Central South University, Ministry of Education of the People' s Republic of China (China)

    2011-10-30

    Highlights: {yields} The cathode active materials LiCoO{sub 2} from spent lithium-ion batteries peeled completely from aluminum foils by vacuum pyrolysis and hydrometallurgical process. {yields} The aluminum foils were excellent without damage after vacuum pyrolysis. {yields} The pyrolysis products organic fluorine compounds from organic electrolyte and binder were collected and enriched. {yields} High leaching efficiencies of cobalt and lithium were obtained with H{sub 2}SO{sub 4} and H{sub 2}O{sub 2}. - Abstract: Spent lithium-ion batteries contain lots of strategic resources such as cobalt and lithium together with other hazardous materials, which are considered as an attractive secondary resource and environmental contaminant. In this work, a novel process involving vacuum pyrolysis and hydrometallurgical technique was developed for the combined recovery of cobalt and lithium from spent lithium-ion batteries. The results of vacuum pyrolysis of cathode material showed that the cathode powder composing of LiCoO{sub 2} and CoO peeled completely from aluminum foils under the following experimental conditions: temperature of 600 {sup o}C, vacuum evaporation time of 30 min, and residual gas pressure of 1.0 kPa. Over 99% of cobalt and lithium could be recovered from peeled cobalt lithium oxides with 2 M sulfuric acid leaching solution at 80 {sup o}C and solid/liquid ratio of 50 g L{sup -1} for 60 min. This technology offers an efficient way to recycle valuable materials from spent lithium-ion batteries, and it is feasible to scale up and help to reduce the environmental pollution of spent lithium-ion batteries.

  20. Vacuum pyrolysis and hydrometallurgical process for the recovery of valuable metals from spent lithium-ion batteries

    International Nuclear Information System (INIS)

    Sun, Liang; Qiu, Keqiang

    2011-01-01

    Highlights: → The cathode active materials LiCoO 2 from spent lithium-ion batteries peeled completely from aluminum foils by vacuum pyrolysis and hydrometallurgical process. → The aluminum foils were excellent without damage after vacuum pyrolysis. → The pyrolysis products organic fluorine compounds from organic electrolyte and binder were collected and enriched. → High leaching efficiencies of cobalt and lithium were obtained with H 2 SO 4 and H 2 O 2 . - Abstract: Spent lithium-ion batteries contain lots of strategic resources such as cobalt and lithium together with other hazardous materials, which are considered as an attractive secondary resource and environmental contaminant. In this work, a novel process involving vacuum pyrolysis and hydrometallurgical technique was developed for the combined recovery of cobalt and lithium from spent lithium-ion batteries. The results of vacuum pyrolysis of cathode material showed that the cathode powder composing of LiCoO 2 and CoO peeled completely from aluminum foils under the following experimental conditions: temperature of 600 o C, vacuum evaporation time of 30 min, and residual gas pressure of 1.0 kPa. Over 99% of cobalt and lithium could be recovered from peeled cobalt lithium oxides with 2 M sulfuric acid leaching solution at 80 o C and solid/liquid ratio of 50 g L -1 for 60 min. This technology offers an efficient way to recycle valuable materials from spent lithium-ion batteries, and it is feasible to scale up and help to reduce the environmental pollution of spent lithium-ion batteries.

  1. Non-Vacuum Processed Polymer Composite Antireflection Coating Films for Silicon Solar Cells

    Directory of Open Access Journals (Sweden)

    Abdullah Uzum

    2016-08-01

    Full Text Available A non-vacuum processing method for preparing polymer-based ZrO2/TiO2 multilayer structure antireflection coating (ARC films for crystalline silicon solar cells by spin coating is introduced. Initially, ZrO2, TiO2 and surface deactivated-TiO2 (SD-TiO2 based films were examined separately and the effect of photocatalytic properties of TiO2 film on the reflectivity on silicon surface was investigated. Degradation of the reflectance performance with increasing reflectivity of up to 2% in the ultraviolet region was confirmed. No significant change of the reflectance was observed when utilizing SD-TiO2 and ZrO2 films. Average reflectance (between 300 nm–1100 nm of the silicon surface coated with optimized polymer-based ZrO2 single or ZrO2/SD-TiO2 multilayer composite films was decreased down to 6.5% and 5.5%, respectively. Improvement of photocurrent density (Jsc and conversion efficiency (η of fabricated silicon solar cells owing to the ZrO2/SD-TiO2 multilayer ARC could be confirmed. The photovoltaic properties of Jsc, the open-circuit photo voltage (VOC, the fill factor (FF, and the η were 31.42 mA cm−2, 575 mV, 71.5% and 12.91%. Efficiency of the solar cells was improved by the ZrO2-polymer/SD-TiO2 polymer ARC composite layer by a factor of 0.8% with an increase of Jsc (2.07 mA cm−2 compared to those of fabricated without the ARC.

  2. Laser beam soldering of micro-optical components

    Science.gov (United States)

    Eberhardt, R.

    2003-05-01

    MOTIVATION Ongoing miniaturisation and higher requirements within optical assemblies and the processing of temperature sensitive components demands for innovative selective joining techniques. So far adhesive bonding has primarily been used to assemble and adjust hybrid micro optical systems. However, the properties of the organic polymers used for the adhesives limit the application of these systems. In fields of telecommunication and lithography, an enhancement of existing joining techniques is necessary to improve properties like humidity resistance, laserstability, UV-stability, thermal cycle reliability and life time reliability. Against this background laser beam soldering of optical components is a reasonable joining technology alternative. Properties like: - time and area restricted energy input - energy input can be controlled by the process temperature - direct and indirect heating of the components is possible - no mechanical contact between joining tool and components give good conditions to meet the requirements on a joining technology for sensitive optical components. Additionally to the laser soldering head, for the assembly of optical components it is necessary to include positioning units to adjust the position of the components with high accuracy before joining. Furthermore, suitable measurement methods to characterize the soldered assemblies (for instance in terms of position tolerances) need to be developed.

  3. Rubber friction and force transmission during the shearing process of actively-driven vacuum grippers on rough surfaces

    International Nuclear Information System (INIS)

    Kern, Patrick

    2016-01-01

    Nowadays, vacuum grippers come in many different shapes and sizes. Their stability is guaranteed through specially manufactured metal fittings. These fittings are non-positively and positively connected to the elastic part of the vacuum gripper. The design of the elastic part may vary, though. Elastomer components are used to ensure tightness for the negative pressure in the active cave chamber of the vacuum gripper, as well as for the transfer of shearing forces, which acting parallel to the surface. Some vacuum grippers feature one elastomer for both the sealing function and the transfer of shear forces; other gripper types are equipped with various elastomers for those applications. The vacuum grippers described in this work are equipped with structured rubber friction pads, their tightness being ensured by sealing lips made of a flexible foam rubber. A restraint system consisting of one or several vacuum grippers must be sized prior to its actual practical use. For the transmission of shearing forces, which acting parallel to the surface, it is necessary to take the tribological system, consisting of the suction element's elastomer and the base material, into account since these loads put shearing stress on the vacuum gripper. In practice, however, a standardized value is given for the coefficient of friction μ; i.e. the ratio of transmissible frictional force to the normal force. This does neither include a detailed description of the elastomer used nor of the roughness of the base material. The standardized friction coefficients cannot be applied to the practical design of restraint systems. The present work includes the analysis of the load transmission and the modeling of the friction coefficients μ on rough surfaces during the shearing process of actively-driven vacuum grippers. Based on current theories, the phenomenon of elastomeric friction can be attributed to the two main components of hysteresis and adhesion friction. Both components are presented

  4. Influence of the vacuum resin process, on the ballistic behaviour of lightweight armouring solutions

    Science.gov (United States)

    Lefebvre, M.; Boussu, F.; Coutellier, D.; Vallee, D.

    2012-08-01

    The armour of vehicles against conventional threats is mainly composed with steel or aluminium panels. Efficient heavy solutions exist, but the involved industries require new lightweight structures. Moreover, unconventional threats as IEDs (Improvised Explosive Devices) may cause severe damages on these structural and protective panel solutions. Thus, combination of aluminium or steel plates with textile composite structures used as a backing, leads to the mass reduction and better performance under delamination behaviour against these new threats. This paper is a part of a study dealing with the impact behaviour of three warp interlocks weaving structures under Fragment Simulating Projectile (FSP) impact. During this research, several parameters has being studied as the influence of the yarns insertions [1-4], the degradation of the yarns during the weaving process [5-7], and the influence of the resin rate on the ballistic behaviour. The resin rate inside composite materials is dependant on the final application. In ballistic protection, we need to control the resin rate in order to have a deformable structure in order to absorb the maximum of energy. However, with the warp interlocks weaving structure, the yarns insertions induce empty spaces between the yarns where the resin takes place without being evacuated. The resin rate inside the warp interlocks structures is in the most of cases less than 50%, which lead to have brittle and hard material during the impact. Contrary to interlocks structures, the existing protection based on prepreg structure have a high fibres ratio around 88% of weight. That leads to have the best ballistic properties during the impact and good deformability of the structure. The aim of this paper is to evaluate the influence of the resin rate on the ballistic results of the composites materials. For that, we have chosen two kinds of warp interlocks fabrics which were infused with epoxy resin following two processes. The first is a

  5. Influence of the vacuum resin process, on the ballistic behaviour of lightweight armouring solutions

    Directory of Open Access Journals (Sweden)

    Coutellier D.

    2012-08-01

    processes. The first is a classical vacuum resin infusion; the second used a press in order to reach a resin ratio near to the existing protection. The existing protection is a prepreg structure with a fibre content of 88%. It has been revealed that a resin rate less than 35% inside the warp interlocks composite material leads to have equivalent ballistics performances than existing protection.

  6. Kinematic and dynamic analysis of a serial-link robot for inspection process in EAST vacuum vessel

    International Nuclear Information System (INIS)

    Peng Xuebing; Yuan Jianjun; Zhang Weijun; Yang Yang; Song Yuntao

    2012-01-01

    Highlights: ► A serial-link robot FIVIR is proposed for inspection of EAST PFCs between plasma shots. ► The FIVIR is a function modular design and has specially designed curvilinear mechanism for axes 4–6. ► The D-H coordinate systems, forward and inverse kinematic model can be easily established and solved for the FIVIR. ► The FIVIR can fulfill the required workspace and has a good dynamic performance in the inspection process. - Abstract: The present paper introduces a serial-link robot which is named flexible in-vessel inspection robot (FIVIR) and developed for Experimental Advanced Superconducting Tokamak (EAST). The task of the robot is to carry process tools, such as viewing camera and leakage detector, to inspect the components installed inside of EAST vacuum vessel. The FIVIR can help to understand the physical phenomena which could be happened in the vacuum vessel during plasma operation and could be one part of EAST remote handling system if needed. The FIVIR was designed with the consideration of having easy control and a good mechanics property which drives it resulted in function modular design. The workspace simulation and kinematic analysis are given in this paper. The dynamic behavior of the FIVIR is studied by multi-body system simulation using ADAMS software. The study result shows the FIVIR has ascendant kinematic and dynamic performance and can fulfill the design requirement for inspection process in EAST vacuum vessel.

  7. High performance inkjet printed phosphorescent organic light emitting diodes based on small molecules commonly used in vacuum processes

    Energy Technology Data Exchange (ETDEWEB)

    Jung, Sung-Hoon [Department of Materials Science and Engineering, Seoul National University, Seoul, 151-742 (Korea, Republic of); Kim, Jang-Joo, E-mail: jjkim@snu.ac.kr [Department of Materials Science and Engineering, Seoul National University, Seoul, 151-742 (Korea, Republic of); Kim, Hyong-Jun, E-mail: hkim@kongju.ac.kr [Department of Chemical Engineering, Kongju National University, Cheonan, 330-717 (Korea, Republic of)

    2012-09-30

    High efficiency phosphorescent organic light emitting diodes (OLEDs) are realized by inkjet printing based on small molecules commonly used in vacuum processes in spite of the limitation of the limited solubility. The OLEDs used the inkjet printed 5 wt.% tris(2-phenylpyridine)iridium(III) (Ir(ppy){sub 3}) doped in 4,4 Prime -Bis(carbazol-9-yl)biphenyl (CBP) as the light emitting layer on various small molecule based hole transporting layers, which are widely used in the fabrication of OLEDs by vacuum processes. The OLEDs resulted in the high power and the external quantum efficiencies of 29.9 lm/W and 11.7%, respectively, by inkjet printing the CBP:Ir(ppy){sub 3} on a 40 nm thick 4,4 Prime ,4 Double-Prime -tris(carbazol-9-yl)triphenylamine layer. The performance was very close to a vacuum deposited device with a similar structure. - Highlights: Black-Right-Pointing-Pointer Effective inkjet printed organic light emitting diode (OLED) technique is explored. Black-Right-Pointing-Pointer Solution process on commonly used hole transporting material (HTM) is demonstrated. Black-Right-Pointing-Pointer Triplet energy overlap of HTM and emitting material is the key to the performance. Black-Right-Pointing-Pointer Simple inkjet printed OLED provides the high current efficiency of 40 cd/A.

  8. Kinematic and dynamic analysis of a serial-link robot for inspection process in EAST vacuum vessel

    Energy Technology Data Exchange (ETDEWEB)

    Peng Xuebing, E-mail: pengxb@ipp.ac.cn [Institute of Plasma Physics, Chinese Academy of Sciences, P.O. Box 1126, Shushanhu Road 350, Hefei, Anhui 230031 (China); Yuan Jianjun; Zhang Weijun [Research Institute of Robotics, Mechanical Engineering School, Shanghai Jiao Tong University, No.800, Dong Chuan Road, Min Hang District, Shanghai 200240 (China); Yang Yang; Song Yuntao [Institute of Plasma Physics, Chinese Academy of Sciences, P.O. Box 1126, Shushanhu Road 350, Hefei, Anhui 230031 (China)

    2012-08-15

    Highlights: Black-Right-Pointing-Pointer A serial-link robot FIVIR is proposed for inspection of EAST PFCs between plasma shots. Black-Right-Pointing-Pointer The FIVIR is a function modular design and has specially designed curvilinear mechanism for axes 4-6. Black-Right-Pointing-Pointer The D-H coordinate systems, forward and inverse kinematic model can be easily established and solved for the FIVIR. Black-Right-Pointing-Pointer The FIVIR can fulfill the required workspace and has a good dynamic performance in the inspection process. - Abstract: The present paper introduces a serial-link robot which is named flexible in-vessel inspection robot (FIVIR) and developed for Experimental Advanced Superconducting Tokamak (EAST). The task of the robot is to carry process tools, such as viewing camera and leakage detector, to inspect the components installed inside of EAST vacuum vessel. The FIVIR can help to understand the physical phenomena which could be happened in the vacuum vessel during plasma operation and could be one part of EAST remote handling system if needed. The FIVIR was designed with the consideration of having easy control and a good mechanics property which drives it resulted in function modular design. The workspace simulation and kinematic analysis are given in this paper. The dynamic behavior of the FIVIR is studied by multi-body system simulation using ADAMS software. The study result shows the FIVIR has ascendant kinematic and dynamic performance and can fulfill the design requirement for inspection process in EAST vacuum vessel.

  9. Vacuum mechatronics first international workshop

    Energy Technology Data Exchange (ETDEWEB)

    Belinski, S.E.; Shirazi, M.; Hackwood, S.; Beni, G. (eds.) (California Univ., Santa Barbara, CA (USA))

    1989-01-01

    This report contains papers on the following topics: proposed epitaxial thin film growth in the ultra-vacuum of space; particle monitoring and control in vacuum processing equipment; electrostatic dust collector for use in vacuum systems; materials evaluation of an electrically noisy vacuum slip ring assembly; an overview of lubrication and associated materials for vacuum service; the usage of lubricants in a vacuum environment; guidelines and practical applications for lubrication in vacuum; recent development in leak detector and calibrator designs; the durability of ballscrews for ultrahigh vacuum; vacuum-compatible robot for self-contained manufacturing systems; the design, fabrication, and assembly of an advanced vacuum robotics system for space payload calibration; design criteria for mechanisms used in space; and concepts and requirements for semiconductor multiprocess integration in vacuum. These papers are indexed separately elsewhere.

  10. Scalable Manufacturing of Solderable and Stretchable Physiologic Sensing Systems.

    Science.gov (United States)

    Kim, Yun-Soung; Lu, Jesse; Shih, Benjamin; Gharibans, Armen; Zou, Zhanan; Matsuno, Kristen; Aguilera, Roman; Han, Yoonjae; Meek, Ann; Xiao, Jianliang; Tolley, Michael T; Coleman, Todd P

    2017-10-01

    Methods for microfabrication of solderable and stretchable sensing systems (S4s) and a scaled production of adhesive-integrated active S4s for health monitoring are presented. S4s' excellent solderability is achieved by the sputter-deposited nickel-vanadium and gold pad metal layers and copper interconnection. The donor substrate, which is modified with "PI islands" to become selectively adhesive for the S4s, allows the heterogeneous devices to be integrated with large-area adhesives for packaging. The feasibility for S4-based health monitoring is demonstrated by developing an S4 integrated with a strain gauge and an onboard optical indication circuit. Owing to S4s' compatibility with the standard printed circuit board assembly processes, a variety of commercially available surface mount chip components, such as the wafer level chip scale packages, chip resistors, and light-emitting diodes, can be reflow-soldered onto S4s without modifications, demonstrating the versatile and modular nature of S4s. Tegaderm-integrated S4 respiration sensors are tested for robustness for cyclic deformation, maximum stretchability, durability, and biocompatibility for multiday wear time. The results of the tests and demonstration of the respiration sensing indicate that the adhesive-integrated S4s can provide end users a way for unobtrusive health monitoring. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  11. Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

    Science.gov (United States)

    Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

    2004-10-01

    It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

  12. Energy conversion assessment of vacuum, slow and fast pyrolysis processes for low and high ash paper waste sludge

    International Nuclear Information System (INIS)

    Ridout, Angelo J.; Carrier, Marion; Collard, François-Xavier; Görgens, Johann

    2016-01-01

    Highlights: • Vacuum, slow and fast pyrolysis of low and high ash paper waste sludge (PWS) is compared. • Reactor temperature and pellet size optimised to maximise liquid and solid product yields. • Gross energy recovery from solid and liquid was assessed. • Fast pyrolysis of low and high ash PWS offers higher energy conversions. - Abstract: The performance of vacuum, slow and fast pyrolysis processes to transfer energy from the paper waste sludge (PWS) to liquid and solid products was compared. Paper waste sludges with low and high ash content (8.5 and 46.7 wt.%) were converted under optimised conditions for temperature and pellet size to maximise both product yields and energy content. Comparison of the gross energy conversions, as a combination of the bio-oil/tarry phase and char (EC_s_u_m), revealed that the fast pyrolysis performance was between 18.5% and 20.1% higher for the low ash PWS, and 18.4% and 36.5% higher for high ash PWS, when compared to the slow and vacuum pyrolysis processes respectively. For both PWSs, this finding was mainly attributed to higher production of condensable organic compounds and lower water yields during FP. The low ash PWS chars, fast pyrolysis bio-oils and vacuum pyrolysis tarry phase products had high calorific values (∼18–23 MJ kg"−"1) making them promising for energy applications. Considering the low calorific values of the chars from alternative pyrolysis processes (∼4–7 MJ kg"−"1), the high ash PWS should rather be converted to fast pyrolysis bio-oil to maximise the recovery of usable energy products.

  13. A FPGA implementation of solder paste deposit on printed circuit boards errors detector based in a bright and contrast algorithm

    OpenAIRE

    De Luca-Pennacchia, A.; Sánchez-Martínez, M. Á.

    2007-01-01

    Solder paste deposit on printed circuit boards (PCB) is a critical stage. It is known that about 60% of functionality defects in this type of boards are due to poor solder paste printing. These defects can be diminished by means of automatic optical inspection of this printing. Actually, this process is implemented by image processing software with its inherent high computational time cost. In this paper we propose to implement a high parallel degree image comparison algorithm suitable to be ...

  14. Vacuum-free processed bulk heterojunction solar cells with E-GaIn cathode as an alternative to Al electrode

    International Nuclear Information System (INIS)

    Ongul, Fatih; Yuksel, Sureyya Aydın; Bozar, Sinem; Gunes, Serap; Cakmak, Gulbeden; Guney, Hasan Yuksel; Egbe, Daniel Ayuk Mbi

    2015-01-01

    In this paper, the photovoltaic characteristics of bulk heterojunction solar cells employing an eutectic gallium–indium (EGaIn) alloy as a top metal contact which was coated by a simple and inexpensive brush-painting was investigated. The overall solar cell fabrication procedure was vacuum-free. As references, regular organic bulk heterojunction solar cells employing thermally evaporated Aluminum as a top metal contact were also fabricated. Inserting the ZnO layer between the active layer and the cathode electrodes (Al and EGaIn) improved the photovoltaic performance of the herein investigated devices. The power conversion efficiencies with and without EGaIn top electrodes were rather comparable. Hence, we have shown that the EGaIn, which is liquid at room temperature, can be used as a cathode. It allows an easy and rapid device fabrication that can be implemented through a vacuum free process. (paper)

  15. Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

    Science.gov (United States)

    Hammad, A. E.; El-Taher, A. M.

    2014-11-01

    The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) inside the β-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni)6Sn5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)- and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

  16. All solution roll-to-roll processed polymer solar cells free from indium-tin-oxide and vacuum coating steps

    DEFF Research Database (Denmark)

    Krebs, Frederik C

    2009-01-01

    of a bottom electrode comprising silver nanoparticles on a 130 micron thick polyethyleneternaphthalate (PEN) substrate. Subsequently an electron transporting layer of zinc oxide nanoparticles was applied from solution followed by an active layer of P3HT-PCBM and a hole transporting layer of PEDOT......, 3 and 8 stripes. All five layers in the device were processed from solution in air and no vacuum steps were employed. An additional advantage is that the use of indium-tin-oxide (ITO) is avoided in this process. The devices were tested under simulated sunlight (1000 W m−2, AM1.5G) and gave a typical...

  17. Effect of process parameters on power requirements of vacuum swing adsorption technology for CO2 capture from flue gas

    International Nuclear Information System (INIS)

    Zhang, Jun; Webley, Paul A.; Xiao, Penny

    2008-01-01

    This study focuses on the effects of process and operating parameters - feed gas temperature, evacuation pressure and feed concentration - on the performance of carbon dioxide vacuum swing adsorption (CO 2 VSA) processes for CO 2 capture from gas, especially as it affects power consumption. To obtain reliable data on the VSA process, experimental work was conducted on a purposely built three bed CO 2 VSA pilot plant using commercial 13X zeolite. Both 6 step and 9 step cycles were used to determine the influences of temperature, evacuation pressure and feed concentration on process performance (recovery, purity, power and corresponding capture cost). A simple economic model for CO 2 capture was developed and employed herein. Through experiments and analysis, it is found that the feed gas temperature, evacuation pressure and feed concentration have significant effects on power consumption and CO 2 capture cost. Our data demonstrate that the CO 2 VSA process has good recovery (>70%), purity (>90%) and low power cost (4-10 kW/TPDc) when operating with 40 C feed gas provided relatively deep vacuum is used. Enhanced performance is obtained when higher feed gas concentration is fed to the plant, as expected. Our data indicates large potential for application of CO 2 VSA to CO 2 capture from flue gas. (author)

  18. High temperature soldering of graphite

    International Nuclear Information System (INIS)

    Anikin, L.T.; Kravetskij, G.A.; Dergunova, V.S.

    1977-01-01

    The effect is studied of the brazing temperature on the strength of the brazed joint of graphite materials. In one case, iron and nickel are used as solder, and in another, molybdenum. The contact heating of the iron and nickel with the graphite has been studied in the temperature range of 1400-2400 ged C, and molybdenum, 2200-2600 deg C. The quality of the joints has been judged by the tensile strength at temperatures of 2500-2800 deg C and by the microstructure. An investigation into the kinetics of carbon dissolution in molten iron has shown that the failure of the graphite in contact with the iron melt is due to the incorporation of iron atoms in the interbase planes. The strength of a joint formed with the participation of the vapour-gas phase is 2.5 times higher than that of a joint obtained by graphite recrystallization through the carbon-containing metal melt. The critical temperatures are determined of graphite brazing with nickel, iron, and molybdenum interlayers, which sharply increase the strength of the brazed joint as a result of the formation of a vapour-gas phase and deposition of fine-crystal carbon

  19. Microstructure evolution and thermomechanical fatigue of solder materials

    NARCIS (Netherlands)

    Matin, M.A.

    2005-01-01

    The microelectronics industry is confronted with the new challenge to produce joints with lead-free solder materials replacing classical tin-lead solders in devices used in many fields (e.g. consumer electronics, road transport, aviation, space-crafts, telecommunication). In service, solder

  20. Efforts to Develop a 300°C Solder

    Energy Technology Data Exchange (ETDEWEB)

    Norann, Randy A [Perma Works LLC

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  1. Fundamentals of lead-free solder interconnect technology from microstructures to reliability

    CERN Document Server

    Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao

    2015-01-01

    This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

  2. Effect of temperature and flux concentration on soldering of base metal.

    Science.gov (United States)

    Lee, S Y; Lin, C T; Wang, M H; Tseng, H; Huang, H M; Dong, D R; Pan, L C; Shih, Y H

    2000-12-01

    The present study used the acoustic emission (AE) technique to evaluate interactions among soldering temperature, flux treatment, and the resultant ultimate tensile strength (UTS). Scanning electron microscopy (SEM) was used to examine fracture surfaces of the solder joints. Specimens were cast from removable partial denture alloy and then placed in a jig with a gap distance of 1.0 mm. A high-frequency soldering machine with an optical pyrometer was used for soldering at 1150 degrees C and 1200 degrees C, respectively. The flux concentrations were 67% and 75%. The soldered specimens were subjected to tensile test at a crosshead speed of 0.05 mm/min. During testing, acoustic emissions in the frequency range of 100--1200 kHz were collected, filtered, recorded, and processed by a sensing device. The results were analysed by ANOVA and Tukey LSD test. UTS at different temperatures showed no significant difference according to either mechanical or acoustic results. But in the 1200 degrees C group, the UTSs and AE counts showed significant differences (Pacoustic signals within the elastic deformation zone, while the 67% flux subgroup produced similar signals within the plastic deformation zone, either beyond the 0.2% yield point or before fracture.

  3. Development and control towards a parallel water hydraulic weld/cut robot for machining processes in ITER vacuum vessel

    International Nuclear Information System (INIS)

    Wu Huapeng; Handroos, Heikki; Pessi, Pekka; Kilkki, Juha; Jones, Lawrence

    2005-01-01

    This paper presents a special robot, able to carry out welding and machining processes from inside the ITER vacuum vessel (VV), consisting of a five degree-of-freedom parallel mechanism, mounted on a carriage driven by two electric motors on a rack. The kinematic design of the robot has been optimised for ITER access and a hydraulically actuated pre-prototype built. A hybrid controller is designed for the robot, including position, speed and pressure feedback loops to achieve high accuracy and high dynamic performances. Finally, the experimental tests are given and discussed

  4. Commentary: Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    Menovsky, T.; Beek, J.F.; Gemert, M.J.C. van

    1999-01-01

    Full text: Laser tissue welding is the process of using laser energy to join tissues without sutures or with a reduced number of sutures. Recently, diode lasers have been added to the list of fusion lasers (Lewis and Uribe 1993, Reali et al 1993). Typically, for tissue welding, deep penetrating diode lasers emitting at 800-810 nm are used, in combination with a strong absorbing protein solder containing the dye indocyanine green. Indocyanine green has a maximum absorption coefficient at 805 nm and binds preferentially with proteins (Sauda et al 1986). The greatest advantage of diode lasers is their compact size, easy use and low cost. In this issue of Physics in Medicine and Biology (pp 983-1002, 'Photothermal effects of laser tissue soldering'), in an in vitro study, McNally et al investigate the optimal laser settings and welding temperatures in relation to the tensile strength and thermal damage of bovine aorta specimens. An interesting statement in their introduction is that the low strength of laser produced anastomoses can lead to aneurysm formation. The increased chance of aneurysm formation may merely be due to the thermal effect of the laser on the vascular wall, especially on the adventitia and media layers, which become necrotic after thermal injury. Subsequent haemodynamic stress exerted on a damaged vascular wall is a significant contributing factor for aneurysmal initiation. Also interesting is the remark that 'by the application of wavelength-specific chromophores in tissue welding ... the requirement for precise focusing and aiming of the laser beam may be removed'. Though perhaps not yet fully justified, this statement, if true, would facilitate surgical procedures. While the experiments are conducted in a proper manner, the use of bovine aorta specimens, which were stored at -70 deg. C and subsequently thawed for the tissue welding experiments, may not be the most appropriate for studying tissue effects or tensile strength measurements, as the

  5. Interface between Sn-Sb-Cu solder and copper substrate

    Energy Technology Data Exchange (ETDEWEB)

    Sebo, P., E-mail: Pavel.Sebo@savba.sk [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Racianska 75, 831 02 Bratislava 3 (Slovakia); Svec, P. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janickovic, D.; Illekova, E. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine)

    2011-07-15

    Highlights: {yields} New lead-free solder materials based on Sn-Sb-Cu were designed and prepared. {yields} Melting and solidification temperatures of the solders have been determined. {yields} Cu-substrate/solder interaction has been analyzed and quantified. {yields} Phases formed at the solder-substrate interface have been identified. {yields} Composition and soldering atmospheres were correlated with joint strength. - Abstract: Influence of antimony and copper in Sn-Sb-Cu solder on the melting and solidification temperatures and on the microstructure of the interface between the solder and copper substrate after wetting the substrate at 623 K for 1800 s were studied. Microstructure of the interface between the solder and copper substrates in Cu-solder-Cu joints prepared at the same temperature for 1800 s was observed and shear strength of the joints was measured. Influence of the atmosphere - air with the flux and deoxidising N{sub 2} + 10H{sub 2} gas - was taken into account. Thermal stability and microstructure were studied by differential scanning calorimetry (DSC), light microscopy, scanning electron microscopy (SEM) with energy-dispersive spectrometry (EDS) and X-ray diffraction (XRD). Melting and solidification temperatures of the solders were determined. An interfacial transition zone was formed by diffusion reaction between solid copper and liquid solder. At the interface Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} phases arise. Cu{sub 3}Sn is adjacent to the Cu substrate and its thickness decreases with increasing the amount of copper in solder. Scallop Cu{sub 6}Sn{sub 5} phase is formed also inside the solder drop. The solid solution Sn(Sb) and SbSn phase compose the interior of the solder drop. Shear strength of the joints measured by push-off method decreases with increasing Sb concentration. Copper in the solder shows even bigger negative effect on the strength.

  6. SINGLE IMAGE CAMERA CALIBRATION IN CLOSE RANGE PHOTOGRAMMETRY FOR SOLDER JOINT ANALYSIS

    Directory of Open Access Journals (Sweden)

    D. Heinemann

    2016-06-01

    Full Text Available Printed Circuit Boards (PCB play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.

  7. A Hodge dual for soldered bundles

    International Nuclear Information System (INIS)

    Lucas, Tiago Gribl; Pereira, J G

    2009-01-01

    In order to account for all possible contractions allowed by the presence of the solder form, a generalized Hodge dual is defined for the case of soldered bundles. Although for curvature the generalized dual coincides with the usual one, for torsion it gives a completely new dual definition. Starting from the standard form of a gauge Lagrangian for the translation group, the generalized Hodge dual yields precisely the Lagrangian of the teleparallel equivalent of general relativity, and consequently also the Einstein-Hilbert Lagrangian of general relativity

  8. The study of some physical properties and energy aspects of potatoes drying process by the infrared-vacuum method

    Directory of Open Access Journals (Sweden)

    N Hafezi

    2016-09-01

    Full Text Available Introduction Potato (Solanumtuberosum L. is one of the unique and most potential crops having high productivity, supplementing major food requirement in the world. Drying is generally carried out for two main reasons, one to reduce the water activity which eventually increases the shelf life of food and second to reduce the weight and bulk of food for cheaper transport and storage. The quality evaluation of the dried product was carried out on the basis of response variables such as rehydration ratio, shrinkage percentage, color and the overall acceptability. Drying is the most energy intensive process in food industry. Therefore, new drying techniques and dryers must be designed and studied to minimize the energy cost in drying process. Considering the fact that the highest energy consumption in agriculture is associated with drying operations, different drying methods can be evaluated to determine and compare the energy requirements for drying a particular product. Thermal drying operations are found in almost all industrial sectors and are known, according to various estimates, to consume 10-25% of the national industrial energy in the developed world. Infrared radiation drying has the unique characteristics of energy transfer mechanism. Kantrong et al. (2012 were studied the drying characteristics and quality of shiitake mushroom undergoing microwave-vacuum combined with infrared drying. Motevali et al. (2011 were evaluated energy consumption for drying of mushroom slices using various drying methods including hot air, microwave, vacuum, infrared, microwave-vacuum and hot air-infrared. The objectives of this research were to experimental study of drying kinetics considering quality characteristics including the rehydration and color distribution of potato slices in a vacuum- infrared dryer and also assessment of specific energy consumption and thermal utilization efficiency of potato slices during drying process. Materials and Methods A

  9. VACUUM STEAMING PROCESSES APPLIED TO YARNS, ITS APPLICATION FIELDS AND IMPROVEMENTS

    Directory of Open Access Journals (Sweden)

    Özcan ÖZDEMİR

    2005-02-01

    Full Text Available The new techniques used today focus mainly on increases in production speed. For this reason yarns to be used in high speed machines is required to be of high quality. On the other hand high speed frequently causes the degree of yarn moisture to fall minimum level. This decreases in the degree of yarn moisture have negative effects on yarn strength. Since better moisture level increases the yarn strength, yarn is worked more efficiently in weaving and knitting. However each production step in textile plants causes tension in yarn and fibre. Yarns tend to snarl in order to relax themselves.Tension and snarling may lead to problems in the following proceses, thus decreasing productivity. Therefore, the moisture content of yarns should be increased and their tension should be eleminated. In this article we have studied vacuum steaming widely used to remedy above mentioned yarn problems, its application fields and new improvements in this field.

  10. Using laser-induced breakdown spectroscopy on vacuum alloys-production process for elements concentration analysis

    Science.gov (United States)

    Zhao, Tianzhuo; Fan, Zhongwei; Lian, Fuqiang; Liu, Yang; Lin, Weiran; Mo, Zeqiang; Nie, Shuzhen; Wang, Pu; Xiao, Hong; Li, Xin; Zhong, Qixiu; Zhang, Hongbo

    2017-11-01

    Laser-induced breakdown spectroscopy (LIBS) utilizing an echelle spectrograph-ICCD system is employed for on-line analysis of elements concentration in a vacuum induction melting workshop. Active temperature stabilization of echelle spectrometer is implemented specially for industrial environment applications. The measurement precision is further improved by monitoring laser parameters, such as pulse energy, spatial and temporal profiles, in real time, and post-selecting laser pulses with specific pulse energies. Experimental results show that major components of nickel-based alloys are stable, and can be well detected. By using internal standard method, calibration curves for chromium and aluminum are obtained for quantitative determination, with determination coefficient (relative standard deviation) to be 0.9559 (< 2.2%) and 0.9723 (< 2.8%), respectively.

  11. Effect of drying parameters on physiochemical and sensory properties of fruit powders processed by PGSS-, Vacuum- and Spray-drying.

    Science.gov (United States)

    Feguš, Urban; Žigon, Uroš; Petermann, Marcus; Knez, Željko

    2015-01-01

    Aim of this experimental work was to investigate the possibility of producing fruit powders without employing drying aid and to investigate the effect of drying temperatures on the final powder characteristics. Raw fruit materials (banana puree, strawberry puree and blueberry concentrate) were processed using three different drying techniques each operating at a different temperature conditions: vacuum-drying (-27-17 °C), Spray-drying (130-160 °C) and PGSS-drying (112-152 °C). Moisture content, total colour difference, antioxidant activity and sensory characteristics of the processed fruit powders were analysed. The results obtained from the experimental work indicate that investigated fruit powders without or with minimal addition of maltodextrin can be produced. Additionally, it was observed that an increase in process temperature results in a higher loss of colour, antioxidant activity and intensity of the flavour profile.

  12. Modification of vacuum plasma sprayed tungsten coating on reduced activation ferritic/martensitic steels by friction stir processing

    International Nuclear Information System (INIS)

    Tanigawa, Hiroyasu; Ozawa, Kazumi; Morisada, Yoshiaki; Noh, Sanghoon; Fujii, Hidetoshi

    2015-01-01

    Highlights: • Friction stir processing (FSP) was applied on vacuum plasma spray (VPS) W to improve its low thermal conductivity and weakness due to high porosity. • FSP can achieve significant improvement both in mechanical and thermal properties of VPS-W coating. • It was indicated that the double pass FSP at 600 rpm/50 mm/min/2 ton on VPS-W show the most dense microstructure and hardest mechanical property. • Hardness test over FSPed VPS-W layer revealed that the hardness of W becomes higher than that of bulk W. • The thermal conductivity of double pass FSPed VPS-W was about 80% of bulk W at 200 °C, and it becomes equivalent to that of bulk W over 800 °C. - Abstract: Tungsten (W) is the primary candidate material as a plasma facing material in fusion devices, as for its high melting temperature, good thermal conductivity and low sputtering rate, and vacuum plasma spray (VPS) technique is preferred as it is applicable for large area without brittle interlayer, but the thermal conductivity of W layer is very poor, and easy to detach, mainly caused by its porous structure. W Friction stir processing (FSP) was applied on VPS-W to improve these poor properties, and it was suggested that FSP can contribute to significant improvement in both mechanical and thermal properties of the VPS-W coating.

  13. Definition and means of maintaining the process vacuum liquid detection interlock systems portion of the PFP safety envelope

    International Nuclear Information System (INIS)

    LINTHO, J.E.

    2003-01-01

    The purpose of this document is to record the technical evaluation of the Technical Safety Requirements described in the Plutonium Finishing Plant (PFP) Safety Technical Requirements, HNF-SD-CP-OSR-010/Rev.1, Section 3.1.1, ''Criticality Prevention System.'' This document also defines the Safety Envelope (SE) for the liquid detection interlock system in the Process Vacuum System. The SE is derived FR-om information in the Plutonium Finishing Plant Final Safety Analysis Report (PFP FSAR), HNF-SD-CP-SAR-021, Rev 4, and the Criticality Safety Analysis Report (CSAR) for the 26-inch Hg Vacuum System, WHC-SD-SQA-CSA-20159, Rev 0-A. This document, with its appendices, provides the following: (1) The system functional requirements for determining system operability (Section 3). (2) Evaluations of equipment to determine the safety envelope boundary for the system (Section 4 list of SE boundary drawings). (3) A list of the safety envelope equipment (Appendix B). (4) Functional requirements for the individual safety envelope equipment, including appropriate set points and process parameters (Section 4). (5) A list of the operational and surveillance procedures necessary to operate and maintain the system equipment within the safety envelope (Sections 5 and 6 and Appendix A)

  14. Laser assisted soldering: microdroplet accumulation with a microjet device.

    Science.gov (United States)

    Chan, E K; Lu, Q; Bell, B; Motamedi, M; Frederickson, C; Brown, D T; Kovach, I S; Welch, A J

    1998-01-01

    We investigated the feasibility of a microjet to dispense protein solder for laser assisted soldering. Successive micro solder droplets were deposited on rat dermis and bovine intima specimens. Fixed laser exposure was synchronized with the jetting of each droplet. After photocoagulation, each specimen was cut into two halves at the center of solder coagulum. One half was fixed immediately, while the other half was soaked in phosphate-buffered saline for a designated hydration period before fixation (1 hour, 1, 2, and 7 days). After each hydration period, all tissue specimens were prepared for scanning electron microscopy (SEM). Stable solder coagulum was created by successive photocoagulation of microdroplets even after the soldered tissue exposed to 1 week of hydration. This preliminary study suggested that tissue soldering with successive microdroplets is feasible even with fixed laser parameters without active feedback control.

  15. Optimization of Vacuum Impregnation with Calcium Lactate of Minimally Processed Melon and Shelf-Life Study in Real Storage Conditions.

    Science.gov (United States)

    Tappi, Silvia; Tylewicz, Urszula; Romani, Santina; Siroli, Lorenzo; Patrignani, Francesca; Dalla Rosa, Marco; Rocculi, Pietro

    2016-10-05

    Vacuum impregnation (VI) is a processing operation that permits the impregnation of fruit and vegetable porous tissues with a fast and more homogeneous penetration of active compounds compared to the classical diffusion processes. The objective of this research was to investigate the impact on VI treatment with the addition of calcium lactate on qualitative parameters of minimally processed melon during storage. For this aim, this work was divided in 2 parts. Initially, the optimization of process parameters was carried out in order to choose the optimal VI conditions for improving texture characteristics of minimally processed melon that were then used to impregnate melons for a shelf-life study in real storage conditions. On the basis of a 2 3 factorial design, the effect of Calcium lactate (CaLac) concentration between 0% and 5% and of minimum pressure (P) between 20 and 60 MPa were evaluated on color and texture. Processing parameters corresponding to 5% CaLac concentration and 60 MPa of minimum pressure were chosen for the storage study, during which the modifications of main qualitative parameters were evaluated. Despite of the high variability of the raw material, results showed that VI allowed a better maintenance of texture during storage. Nevertheless, other quality traits were negatively affected by the application of vacuum. Impregnated products showed a darker and more translucent appearance on the account of the alteration of the structural properties. Moreover microbial shelf-life was reduced to 4 d compared to the 7 obtained for control and dipped samples. © 2016 Institute of Food Technologists®.

  16. THE POSSIBILITY OF USING LASER-ULTRASOUND TO MONITOR THE QUALITY SOLDERED CONNECTIONS CHAMBERS OF LIQUID ROCKET ENGINES

    Directory of Open Access Journals (Sweden)

    N. V. Astredinova

    2014-01-01

    Full Text Available During the manufacturing process to the design of modern liquid rocket engines are presented important requirements, such as minimum weight, maximum stiffness and strength of nodes, maximum service life in operation, high reliability and quality of soldered and welded seams. Due to the high quality requirements soldered connections and the specific design of the nozzle, it became necessary in the development and testing of a new non-conventional non-destructive testing method – laser-ultrasound diagnosis. In accordance with regulatory guidelines, quality control soldered connections is allowed to use an acoustic kind of control methods of the reflected light, transmitted light, resonant, free vibration and acoustic emission. Attempts to use traditional methods of non-destructive testing did not lead to positive results. This is due primarily to the size of typical solder joint defects, as well as the structural features of the rocket engine, the data structure is not controllable. In connection with this, a new method that provides quality control soldered connections cameras LRE based on the thermo generation of ultrasound. Methods of ultrasonic flaw detection of photoacoustic effect, in most cases, have a number of advantages over methods that use standard (traditional piezo transducers. In the course of studies have found that the sensitivity of the laser-ultrasonic method and flaw detector UDL-2M can detect lack of adhesion in the solder joints on the upper edges of the nozzle in the sub-header area of the site.

  17. Comparison of implant-abutment interface misfits after casting and soldering procedures.

    Science.gov (United States)

    Neves, Flávio Domingues das; Elias, Gisele Araújo; da Silva-Neto, João Paulo; de Medeiros Dantas, Lucas Costa; da Mota, Adérito Soares; Neto, Alfredo Júlio Fernandes

    2014-04-01

    The aim of this study was to compare vertical and horizontal adjustments of castable abutments after conducting casting and soldering procedures. Twelve external hexagonal implants (3.75 × 10 mm) and their UCLA abutments were divided according their manufacturer and abutment type: PUN (plastic UCLA, Neodent), PUC (plastic UCLA, Conexão), PU3i (plastic UCLA, Biomet 3i), and PUTN (plastic UCLA with Tilite milled base, Neodent). Three infrastructures of a fixed partial implant-supported bridge with 3 elements were produced for each group. The measurements of vertical (VM) and horizontal (HM) misfits were obtained via scanning electron microscopy after completion of casting and soldering. The corresponding values were determined to be biomechanically acceptable to the system, and the results were rated as a percentage. Statistical analysis establishes differences between groups by chi-square after procedures, and McNeman's test was applied to analyze the influence of soldering over casting (α ≤ .05). For the values of VM and HM, respectively, when the casting process was complete, it was observed that 83.25% and 100% (PUTN), 33.3% and 27.75% (PUN), 33.3% and 88.8% (PUC), 33.3% and 94.35% (PU3i) represented acceptable values. After completing the requisite soldering, acceptable values were 50% and 94.35% (PUTN), 16.6% and 77.7% (PUN), 38.55% and 77.7% (PUC), and 27.75% and 94.35% (PU3i). Within the limitations of this study, it can be concluded that the premachined abutments presented more acceptable VM values. The HM values were within acceptable limits before and after the soldering procedure for most groups. Further, the soldering procedure resulted in an increase of VM in all groups.

  18. Overall Quality of Fruits and Vegetables Products Affected by the Drying Processes with the Assistance of Vacuum-Microwaves.

    Science.gov (United States)

    Figiel, Adam; Michalska, Anna

    2016-12-30

    The seasonality of fruits and vegetables makes it impossible to consume and use them throughout the year, thus numerous processing efforts have been made to offer an alternative to their fresh consumption and application. To prolong their availability on the market, drying has received special attention as currently this method is considered one of the most common ways for obtaining food and pharmaceutical products from natural sources. This paper demonstrates the weakness of common drying methods applied for fruits and vegetables and the possible ways to improve the quality using different drying techniques or their combination with an emphasis on the microwave energy. Particular attention has been drawn to the combined drying with the assistance of vacuum-microwaves. The quality of the dried products was ascribed by chemical properties including the content of polyphenols, antioxidant capacity and volatiles as well as physical parameters such as color, shrinkage, porosity and texture. Both these fields of quality classification were considered taking into account sensory attributes and energy aspects in the perspective of possible industrial applications. In conclusion, the most promising way for improving the quality of dried fruit and vegetable products is hybrid drying consisting of osmotic dehydration in concentrated fruit juices followed by heat pump drying and vacuum-microwave finish drying.

  19. Overall Quality of Fruits and Vegetables Products Affected by the Drying Processes with the Assistance of Vacuum-Microwaves

    Directory of Open Access Journals (Sweden)

    Adam Figiel

    2016-12-01

    Full Text Available The seasonality of fruits and vegetables makes it impossible to consume and use them throughout the year, thus numerous processing efforts have been made to offer an alternative to their fresh consumption and application. To prolong their availability on the market, drying has received special attention as currently this method is considered one of the most common ways for obtaining food and pharmaceutical products from natural sources. This paper demonstrates the weakness of common drying methods applied for fruits and vegetables and the possible ways to improve the quality using different drying techniques or their combination with an emphasis on the microwave energy. Particular attention has been drawn to the combined drying with the assistance of vacuum-microwaves. The quality of the dried products was ascribed by chemical properties including the content of polyphenols, antioxidant capacity and volatiles as well as physical parameters such as color, shrinkage, porosity and texture. Both these fields of quality classification were considered taking into account sensory attributes and energy aspects in the perspective of possible industrial applications. In conclusion, the most promising way for improving the quality of dried fruit and vegetable products is hybrid drying consisting of osmotic dehydration in concentrated fruit juices followed by heat pump drying and vacuum-microwave finish drying.

  20. Investigation of the process of vacuum freeze drying of bacterial concentrates for the meat industry with cryogenic freezing

    Directory of Open Access Journals (Sweden)

    V. V. Poymanov

    2016-01-01

    Full Text Available The research results of the nutritional value of the products manufactured are presented in the article. The main directions of bacterial concentrates application in the meat industry were determined. The analysis of starter cultures was given. The range of products manu-factured with bacterial concentrates was analyzed. It was shown that the introduction of innovative technologies will enable dynamic development of both large and small enterprises, which will create prerequisites for the growth of the Russian market of meat products. Economic efficiency of the studied substances treatment methods was proved. The relevance of the development of technology of pro-duction of dry bacterial concentrates with cryogenic freezing was proved. An integrated approach to the development of competitive domestic technologies and equipment for cryofreezing and sublimation dehydration by the use of granulation for the intensification of the internal heat and mass transfer, reducing specific energy consumption through the use of a combined cold supply system was pro-posed. Results of the study of the kinetics of the freezing process with the traditional method and cryofreezing are given in the paper. Rational parameters of the cryofreezing process were proposed. The optimum composition of cryoprotective medium was recommended. The research of the process of bacterial concentrate vacuum sublimation dehydration in the layer and granular form were conducted. The research confirmed that the use of the cryofreezing and granulation can increase the number of viable microorganisms in the bacterial concentrate and reduce the drying time. Rational vacuum sublimation dehydration modes were proposed. Methods of reduc-ing the defects of the processed products and improvement of the efficiency of production facilities were specified. Quality indicators of dried bacterial concentrates were given. The results obtained allow to carry out engineering calculations

  1. Fatigue damage modeling in solder interconnects using a cohesive zone approach

    NARCIS (Netherlands)

    Abdul-Baqi, A.J.J.; Schreurs, P.J.G.; Geers, M.G.D.

    2005-01-01

    The objective of this work is to model the fatigue damage process in a solder bump subjected to cyclic loading conditions. Fatigue damage is simulated using the cohesive zone methodology. Damage is assumed to occur at interfaces modeled through cohesive zones in the material, while the bulk material

  2. Vacuum Technology

    Energy Technology Data Exchange (ETDEWEB)

    Biltoft, P J

    2004-10-15

    The environmental condition called vacuum is created any time the pressure of a gas is reduced compared to atmospheric pressure. On earth we typically create a vacuum by connecting a pump capable of moving gas to a relatively leak free vessel. Through operation of the gas pump the number of gas molecules per unit volume is decreased within the vessel. As soon as one creates a vacuum natural forces (in this case entropy) work to restore equilibrium pressure; the practical effect of this is that gas molecules attempt to enter the evacuated space by any means possible. It is useful to think of vacuum in terms of a gas at a pressure below atmospheric pressure. In even the best vacuum vessels ever created there are approximately 3,500,000 molecules of gas per cubic meter of volume remaining inside the vessel. The lowest pressure environment known is in interstellar space where there are approximately four molecules of gas per cubic meter. Researchers are currently developing vacuum technology components (pumps, gauges, valves, etc.) using micro electro mechanical systems (MEMS) technology. Miniature vacuum components and systems will open the possibility for significant savings in energy cost and will open the doors to advances in electronics, manufacturing and semiconductor fabrication. In conclusion, an understanding of the basic principles of vacuum technology as presented in this summary is essential for the successful execution of all projects that involve vacuum technology. Using the principles described above, a practitioner of vacuum technology can design a vacuum system that will achieve the project requirements.

  3. Vacuum extraction

    DEFF Research Database (Denmark)

    Maagaard, Mathilde; Oestergaard, Jeanett; Johansen, Marianne

    2012-01-01

    Objectives. To develop and validate an Objective Structured Assessment of Technical Skills (OSATS) scale for vacuum extraction. Design. Two-part study design: Primarily, development of a procedure-specific checklist for vacuum extraction. Hereafter, validation of the developed OSATS scale for vac...

  4. Effect of sous vide processing on physicochemical, ultrastructural, microbial and sensory changes in vacuum packaged chicken sausages.

    Science.gov (United States)

    Naveena, B M; Khansole, Panjab S; Shashi Kumar, M; Krishnaiah, N; Kulkarni, Vinayak V; Deepak, S J

    2017-01-01

    The processing of sous vide chicken sausages was optimized under vacuum packaging condition and cooking at 100 ℃ for 30 min (SV30), 60 min (SV60) and 120 min (SV120) and compared with aerobically cooked control at 100 ℃ for 30 min. Sous vide processing of chicken sausages (SV30) produced higher (p emulsion ultra-structure due to SV30 processing relative to control sausages. Sous vide processing of chicken sausages enriched with rosemary diterpene phenols retained the freshness and quality up to 120 days during storage at 4 ± 1 ℃ relative to control sausages that were spoiled on 20th day. Lipid oxidation and microbial growth remained below the spoilage levels for all the SV-processed sausages throughout the storage and addition of rosemary diterpene mixture at 0.02% v/w reduced the microbial growth and improved (p < 0.05) the sensory attributes. Our results demonstrate that sous vide processing minimizes lipid oxidation and microbial growth of chicken sausages with improved product quality and shelf-life at 4 ± 1 ℃. © The Author(s) 2016.

  5. Improved glycerol production from cane molasses by the sulfite process with vacuum or continuous carbon dioxide sparging during fermentation

    Energy Technology Data Exchange (ETDEWEB)

    Kalle, G.P.; Naik, S.C.; Lashkari, B.Z.

    1985-01-01

    The conventional sulfite process for glycerol production from molasses using Saccharomyces cerevisiae var. Hansen was modified to obtain product concentrations of up to 230 g/l and productivity of 15 g/l.d by fermenting under vacuum (80 mm) or with continuous sparging of CO2 (0.4 vvm). Under these conditions the requirement of sulfite for optimum production of glycerol was reduced by two thirds (20 g/l), the ethanol concentration in the medium was kept below 30 g/l and the competence of yeast cells to ferment was conserved throughout the fermentation period for up to 20 days. In addition to the above, the rate of incorporation of sulfite had a significant effect on glucose fermentation and glycerol yields. There was an optimal relationship between glycerol yields and the molar ratio of sulfite to glucose consumed, which for cane molasses was 0.67. This ratio was characteristic of the medium composition.

  6. Application of ion scattering spectrometers for the observation of process of cleaning of surfaces of materials for vacuum vessel

    International Nuclear Information System (INIS)

    Akashi, Ken-ya; Miyahara, Akira; Sagara, Akio.

    1978-01-01

    The impurity gas emitted from the surfaces of vacuum vessels was investigated by using the shadowing effect of the covering atoms. The ion scattering spectrometer used for the experiment consists of an ion source, a test sample, an energy analyzer and an ion detector. The evacuation system comprises a turbomolecular pump, a Ti-sublimation pump and an ion pump. The achieved final gas pressure is 5 x 10 -10 Torr. The ion beam intensity to a sample is 10 micro ampere/cm 2 , and the ion energy is about 1 to 1.5 keV. The quantity of oxygen on the surface of a sample molybdenum was measured in the process of evacuation. The concentration of surface oxygen decreased with the gas pressure of the system. It was found that residual oxygen was observed after the sputter etching with Ar ion impact on the surface. The reason of this residual oxygen was considered. (Kato, T.)

  7. Improving the conductance of ZnO thin film doping with Ti by using a cathodic vacuum arc deposition process

    International Nuclear Information System (INIS)

    Wu, Chun-Sen; Lin, Bor-Tsuen; Jean, Ming-Der

    2011-01-01

    The Ti-doped ZnO films compared to un-doped ZnO films were deposited onto Corning XG glass substrates by using a cathodic vacuum arc deposition process in a mixture of oxygen and argon gases. The structural, electrical and optical properties of un-doped and Ti-doped ZnO films have been investigated. When the Ti target power is about 750 W, the incorporation of titanium atoms into zinc oxide films is obviously effective. Additionally, the resistivity of un-doped ZnO films is high and reduces to a value of 3.48 x 10 -3 Ω-cm when Ti is incorporated. The Ti doped in the ZnO films gave rise to the improvement of the conductivity of the films obviously. The Ti-doped ZnO films have > 85% transmittance in a range of 400-700 nm.

  8. Experimental Researches Tribological Properties of Hard-Alloy Blades With a Vacuum-Plasma Coating in the Chipboards Milling Process

    Directory of Open Access Journals (Sweden)

    Pavel Viktorovič Rudak

    2015-01-01

    Full Text Available While developing effective ion-plasma coatings compositions of woodcutting tools special conditions of its use should be taken into account particularly the force rate acting on the cutting wedge. With the penetration of the blade into the wood material normal pressure and friction appear on the connection surface. For the analysis of the cutting processes the connection surface can be divided into several zones. The cutters with vacuum-plasma coatings based on TiN are characterized by a lower coefficient of friction in comparison to uncoated cutters in real conditions. The developed technique of tribotechnical tool tests of milling woodchip board is of great importance to establish the regularities of chip formation, chips movement and dust in the timber cutting areas as well as wood materials at milling in a wide parameter range of cutting conditions, for the development of methods and devices of chips and dust suppression.

  9. Physico-chemical characterization of products from vacuum oil under delayed coking process by infrared spectroscopy and chemometrics methods

    International Nuclear Information System (INIS)

    Meléndez, L V; Cabanzo, R; Mejía-Ospino, E; Guzmán, A

    2016-01-01

    Eight vacuum residues and their delayed coking liquids products from Colombian crude were study by infrared spectroscopy with attenuated total reflectance (FTIR-ATR) and principal component analysis (PCA). For the samples the structural parameters of aromaticity factor (fa), alifaticity (A2500-3100cm -1 ), aromatic condensation degree (GCA), length of aliphatic chains (LCA) and aliphatic chain length associated with aromatic (LACAR) were determined through the development of a methodology, which includes the previous processing of spectroscopy data, identifying the regions in the IR spectra of greatest variance using PCA and molecules patterns. The parameters were compared with the results obtained from proton magnetic resonance ( 1 H-NMR) and 13 C-NMR. The results showed the influence and correlation of structural parameters with some physicochemical properties such as API gravity, weight percent sulphur (% S) and Conradson carbon content (% CCR) (paper)

  10. Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack

    Directory of Open Access Journals (Sweden)

    Shoudong Gu

    2016-06-01

    Full Text Available To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT (Surface Mount Technology production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process. Here, the critical jet ejection velocity is discussed through theoretical analysis. The relations between ejection velocity and needle structure, needle velocity, and nozzle diameter were obtained by FLUENT software. Then, the prototype of the solder paste jetting system was fabricated, and the performance was verified by experiments. The effects of the gap between nozzle and needle, the driving voltage, and the nozzle diameter on the jetting performance and droplet diameter were obtained. Solder paste droplets 0.85 mm in diameter were produced when the gap between the nozzle and needle was adjusted to 10 μm, the driving voltage to 80 V, the nozzle diameter to 0.1 mm, and the variation of the droplet diameter was within ±3%.

  11. Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

    Directory of Open Access Journals (Sweden)

    Shuye Zhang

    2018-01-01

    Full Text Available Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared with pressure based contact of metal conductor balls. Recently, flex-on-board interconnection has become more and more popular for mobile electronic applications. However, crack formation of the solder joint crack was occurred at low temperature curable acrylic polymer resins after bonding processes. In this study, the mechanism of SnBi58 solder joint crack at low temperature curable acrylic adhesive was investigated. In addition, SnBi58 solder joint cracks can be significantly removed by increasing the storage modulus of adhesives instead of coefficient of thermal expansion. The first approach of reducing the amount of polymer rebound can be achieved by using an ultrasonic bonding method to maintain a bonding pressure on the SnBi58 solder joints cooling to room temperature. The second approach is to increase storage modulus of adhesives by adding silica filler into acrylic polymer resins to prevent the solder joint from cracking. Finally, excellent acrylic based SnBi58 solder joints reliability were obtained after 1000 cycles thermal cycling test.

  12. Mechanical properties of soldered joints of niobium base alloys

    International Nuclear Information System (INIS)

    Grishin, V.L.

    1980-01-01

    Mechanical properties of soldered joints of niobium alloys widely distributed in industry: VN3, VN4, VN5A, VN5AE, VN5AEP etc., 0.6-1.2 mm thick are investigated. It is found out that the usage of zirconium-vanadium, titanium-tantalum solders for welding niobium base alloys permits to obtain soldered joints with satisfactory mechanical properties at elevated temperatures

  13. Evaluation on the characteristics of tin-silver-bismuth solder

    Science.gov (United States)

    Xia, Z.; Shi, Y.; Chen, Z.

    2002-02-01

    Tin-silver-bismuth solder is characterized by its lower melting point, good wetting behavior, and good mechanical property for which it is expected to be a new lead-free solder to replace tin-lead solder. In this article, Sn-3.33Ag-4.83Bi solder was investigated concerning its physical, spreading, and mechanical properties under specific conditions. Cooling curves and DSC results showed that it was close to eutectic composition (m.p. 210° 212 °C). Coefficiency of thermal expansion (CTE) of this solder, between that of PCBs and copper substrates, was beneficial to alleviate the thermal mismatch of the substrates. It was also a good electrical and thermal conductor. Using a rosin-based, mildly activated (RMA) flux, a spreading test indicated that SnAgBi solder paste had good solderability. Meanwhile, the solder had high tensile strength and fracture energy. Its fracture mechanism was a mixture of ductile and brittle fracture morphology. The metallographic and EDAX analyses indicated that it was composed of a tin-based solid solution and some intermetallic compound (IMC) that could strengthen the substrate. However, these large needle-like IMCs would cut the substrate and this resulted in the decreasing of the toughness of the solder.

  14. Cosmic vacuum

    International Nuclear Information System (INIS)

    Chernin, Artur D

    2001-01-01

    Recent observational studies of distant supernovae have suggested the existence of cosmic vacuum whose energy density exceeds the total density of all the other energy components in the Universe. The vacuum produces the field of antigravity that causes the cosmological expansion to accelerate. It is this accelerated expansion that has been discovered in the observations. The discovery of cosmic vacuum radically changes our current understanding of the present state of the Universe. It also poses new challenges to both cosmology and fundamental physics. Why is the density of vacuum what it is? Why do the densities of the cosmic energy components differ in exact value but agree in order of magnitude? On the other hand, the discovery made at large cosmological distances of hundreds and thousands Mpc provides new insights into the dynamics of the nearby Universe, the motions of galaxies in the local volume of 10 - 20 Mpc where the cosmological expansion was originally discovered. (reviews of topical problems)

  15. Cosmic vacuum

    Energy Technology Data Exchange (ETDEWEB)

    Chernin, Artur D [P.K. Shternberg State Astronomical Institute at the M.V. Lomonosov Moscow State University, Moscow (Russian Federation)

    2001-11-30

    Recent observational studies of distant supernovae have suggested the existence of cosmic vacuum whose energy density exceeds the total density of all the other energy components in the Universe. The vacuum produces the field of antigravity that causes the cosmological expansion to accelerate. It is this accelerated expansion that has been discovered in the observations. The discovery of cosmic vacuum radically changes our current understanding of the present state of the Universe. It also poses new challenges to both cosmology and fundamental physics. Why is the density of vacuum what it is? Why do the densities of the cosmic energy components differ in exact value but agree in order of magnitude? On the other hand, the discovery made at large cosmological distances of hundreds and thousands Mpc provides new insights into the dynamics of the nearby Universe, the motions of galaxies in the local volume of 10 - 20 Mpc where the cosmological expansion was originally discovered. (reviews of topical problems)

  16. Solvent refined coal (SRC) process. Flashing of SRC-II slurry in the vacuum column on Process Development Unit P-99. Interim report, February-June 1980

    Energy Technology Data Exchange (ETDEWEB)

    Gray, J. A.; Mathias, S. T.

    1980-10-01

    This report presents the results of 73 tests on the vacuum flash system of Process Development Unit P-99 performed during processing of three different coals; the second batch, fourth shipment (low ash batch) of Powhatan No. 5 Mine (LR-27383), Powhatan No. 6 Mine (LR-27596) and Ireland Mine (LR-27987). The objective of this work was to obtain experimental data for use in confirming and improving the design of the vacuum distillation column for the 6000 ton/day SRC-II Demonstration Plant. The 900/sup 0/F distillate content of the bottoms and the percent of feed flashed overhead were correlated with flash zone operating conditions for each coal, and the observed differences in performance were attributed to differences in the feed compositions. Retrogressive reactions appeared to be occurring in the 900/sup 0/F+ pyridine soluble material leading to an increase in the quantity of pyridine insoluble organic matter. Stream physical properties determined include specific gravity, viscosity and melting point. Elemental, distillation and solvent analyses were used to calculate component material balances. The Technology and Materials Department has used these results in a separate study comparing experimental K-values and vapor/liquid split with CHAMP computer program design predictions.

  17. Simulation of the Vacuum Assisted Resin Transfer Molding (VARTM) process and the development of light-weight composite bridging

    Science.gov (United States)

    Robinson, Marc J.

    A continued desire for increased mobility in the aftermath of natural disasters, or on the battlefield, has lead to the need for improved light-weight bridging solutions. This research investigates the development of a carbon/epoxy composite bridging system to meet the needs for light-weight bridging. The research focuses on two main topics. The first topic is that of processing composite structures and the second is the design and testing of these structures. In recent years the Vacuum Assisted Resin Transfer Molding (VARTM) process has become recognized as a low-cost manufacturing alternative for large Fiber Reinforced Polymer (FRP) composite structures for civil, military, and aerospace applications. The success of the VARTM process (complete wet-out) is very sensitive to the resin injection strategy used and the proper placement of flow distribution materials and inlet and vacuum ports. Predicting the flow front pattern, the time required for infusing a part with resin, and the time required to bleed excess resin at the end of filling, is critical to ensure that the part will become completely impregnated and desired fiber volume fractions achieved prior to the resin gelling (initiation of cure). In order to eliminate costly trial and error experiments to determine the optimal infusion strategy, this research presents a simulation model which considers in-plane flow as well as flow through the thickness of the preform. In addition to resin filling, the current model is able to simulate the bleeding of resin at the end of filling to predict the required bleeding time to reach desired fiber volume fractions for the final part. In addition to processing, the second portion of the dissertation investigates the design and testing of composite bridge deck sections which also serve as short-span bridging for gaps up to 4 m in length. The research focuses on the design of a light-weight core material for bridge decking as well as proof loading of short-span bridge

  18. Stark interaction of identical particles with the vacuum electromagnetic field as quantum Poisson process suppressing collective spontaneous emission

    International Nuclear Information System (INIS)

    Basharov, A. M.

    2011-01-01

    The effective Hamiltonian describing resonant interaction of an ensemble of identical quantum particles with a photon-free vacuum electromagnetic field has been obtained with allowance for terms of second order in the coupling constant (the Stark interaction) by means of the perturbation theory on the basis of the unitary transformation of the system quantum state. It has been shown that in the Markov approximation the effective Hamiltonian terms of first order in the coupling constant are represented by the quantum Wiener process, whereas terms of second order are expressed by the quantum Poisson process. During the course of the investigation, it was established that the Stark interaction played a significant role in the ensemble dynamics, thus influencing the collective spontaneous decay of the ensemble of an appreciably high number of identical particles. Fundamental effects have been discovered, i.e., the excitation conservation in a sufficiently dense ensemble of identical particles and superradiance suppression in the collective decaying process of an excited ensemble with a determined number of particles.

  19. Review of a solution-processed vertical organic transistor as a solid-state vacuum tube

    International Nuclear Information System (INIS)

    Lin, Hung-Cheng; Zan, Hsiao-Wen; Chao, Yu-Chiang; Chang, Ming-Yu; Meng, Hsin-Fei

    2015-01-01

    In this paper, we investigate the key issues in raising the on/off current ratio and increasing the output current. A 1 V operated inverter composed of an enhancement-mode space–charge-limited transistor (SCLT) and a depletion-mode SCLT is demonstrated using the self-assembled monolayer modulation process. With a bulk-conduction mechanism, good bias-stress reliability, and good bending durability are obtained. Finally, key scaling-up processes, including nanoimprinting and blade-coated nanospheres, are demonstrated. (paper)

  20. Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperature

    Energy Technology Data Exchange (ETDEWEB)

    Prabhu, K.N., E-mail: prabhukn_2002@yahoo.co.in [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India); Deshapande, Parashuram; Satyanarayan [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India)

    2012-01-30

    Highlights: Black-Right-Pointing-Pointer Effect of cooling rate on tensile and impact properties of Sn-9Zn alloy was assessed. Black-Right-Pointing-Pointer Both DBTT and UTS of the solder alloy increased with increase in cooling rate. Black-Right-Pointing-Pointer An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile-brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn-9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 Degree-Sign C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the

  1. Effect of cooling rate during solidification of Sn–9Zn lead-free solder alloy on its microstructure, tensile strength and ductile–brittle transition temperature

    International Nuclear Information System (INIS)

    Prabhu, K.N.; Deshapande, Parashuram; Satyanarayan

    2012-01-01

    Highlights: ► Effect of cooling rate on tensile and impact properties of Sn–9Zn alloy was assessed. ► Both DBTT and UTS of the solder alloy increased with increase in cooling rate. ► An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile–brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn–9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 °C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the DBTT.

  2. Separation and Recycling of Spent Carbon Cathode Blocks in the Aluminum Industry by the Vacuum Distillation Process

    Science.gov (United States)

    Yaowu, Wang; Jianping, Peng; Yuezhong, Di

    2018-04-01

    Aluminum is the second most produced metal after iron. China is the top producer of primary aluminum with a production capacity of 41,000 kt and an output in 2016 of 32,000 kt. A large amount of spent carbon cathode block (SCCB) is produced after electrolytic pot failure. SCCB consists of carbon, fluorides, alkali metals, carbides, nitrides, cyanides, and oxides, and is considered to be a hazardous material because it contains significant concentrations of toxic and soluble cyanides and fluorides. There is no economical and efficient process for the treatment of SCCB and is most commonly disposed in landfill. In this study, the vacuum distillation process (VDP) has been used to separate and recycle SCCB. The results show that Na3AlF6, NaF, and sodium metal can be effectively separated from SCCB by VDP, and the distillation ratio is above 80% at a distillation temperature of 1200°C. The carbon content in the distilled SCCB is above 91% and the impurities are mainly CaF2 and Al2O3.

  3. Vacuum ultra-violet damage and damage mitigation for plasma processing of highly porous organosilicate glass dielectrics

    Energy Technology Data Exchange (ETDEWEB)

    Marneffe, J.-F. de, E-mail: marneffe@imec.be; Lukaszewicz, M.; Porter, S. B.; Vajda, F.; Rutigliani, V.; Verdonck, P.; Baklanov, M. R. [IMEC v.z.w., 3001 Leuven (Belgium); Zhang, L.; Heyne, M.; El Otell, Z.; Krishtab, M. [IMEC v.z.w., 3001 Leuven (Belgium); Department of Chemistry, KULeuven, 3001 Leuven (Belgium); Goodyear, A.; Cooke, M. [Oxford Instruments Plasma Technology, BS49 4AP Bristol (United Kingdom)

    2015-10-07

    Porous organosilicate glass thin films, with k-value 2.0, were exposed to 147 nm vacuum ultra-violet (VUV) photons emitted in a Xenon capacitive coupled plasma discharge. Strong methyl bond depletion was observed, concomitant with a significant increase of the bulk dielectric constant. This indicates that, besides reactive radical diffusion, photons emitted during plasma processing do impede dielectric properties and therefore need to be tackled appropriately during patterning and integration. The detrimental effect of VUV irradiation can be partly suppressed by stuffing the low-k porous matrix with proper sacrificial polymers showing high VUV absorption together with good thermal and VUV stability. In addition, the choice of an appropriate hard-mask, showing high VUV absorption, can minimize VUV damage. Particular processing conditions allow to minimize the fluence of photons to the substrate and lead to negligible VUV damage. For patterned structures, in order to reduce VUV damage in the bulk and on feature sidewalls, the combination of both pore stuffing/material densification and absorbing hard-mask is recommended, and/or the use of low VUV-emitting plasma discharge.

  4. Visualization of electrolyte filling process and influence of vacuum during filling for hard case prismatic lithium ion cells by neutron imaging to optimize the production process

    Science.gov (United States)

    Weydanz, W. J.; Reisenweber, H.; Gottschalk, A.; Schulz, M.; Knoche, T.; Reinhart, G.; Masuch, M.; Franke, J.; Gilles, R.

    2018-03-01

    The process of filling electrolyte into lithium ion cells is time consuming and critical to the overall battery quality. However, this process is not well understood. This is partially due to the fact, that it is hard to observe it in situ. A powerful tool for visualization of the process is neutron imaging. The filling and wetting process of the electrode stack can be clearly visualized in situ without destruction of the actual cell. The wetting of certain areas inside the electrode stack can clearly be seen when using this technique. Results showed that wetting of the electrode stack takes place in a mostly isotropic manner from the outside towards a center point of the cell at very similar speed. When the electrolyte reaches the center point, the wetting process can be considered complete. The electrode wetting is a slow but rather steady process for hard case prismatic cells. It starts with a certain speed, which is reduced over the progress of the wetting. Vacuum can assist the process and accelerate it by about a factor of two as was experimentally shown. This gives a considerable time and cost advantage for designing the production process for large-scale battery cell production.

  5. Vacuum metastability with black holes

    Energy Technology Data Exchange (ETDEWEB)

    Burda, Philipp [Centre for Particle Theory, Durham University,South Road, Durham, DH1 3LE (United Kingdom); Gregory, Ruth [Centre for Particle Theory, Durham University,South Road, Durham, DH1 3LE (United Kingdom); Perimeter Institute, 31 Caroline Street North,Waterloo, ON, N2L 2Y5 (Canada); Moss, Ian G. annd [School of Mathematics and Statistics, Newcastle University,Newcastle Upon Tyne, NE1 7RU (United Kingdom)

    2015-08-24

    We consider the possibility that small black holes can act as nucleation seeds for the decay of a metastable vacuum, focussing particularly on the Higgs potential. Using a thin-wall bubble approximation for the nucleation process, which is possible when generic quantum gravity corrections are added to the Higgs potential, we show that primordial black holes can stimulate vacuum decay. We demonstrate that for suitable parameter ranges, the vacuum decay process dominates over the Hawking evaporation process. Finally, we comment on the application of these results to vacuum decay seeded by black holes produced in particle collisions.

  6. Vacuum metastability with black holes

    International Nuclear Information System (INIS)

    Burda, Philipp; Gregory, Ruth; Moss, Ian G. annd

    2015-01-01

    We consider the possibility that small black holes can act as nucleation seeds for the decay of a metastable vacuum, focussing particularly on the Higgs potential. Using a thin-wall bubble approximation for the nucleation process, which is possible when generic quantum gravity corrections are added to the Higgs potential, we show that primordial black holes can stimulate vacuum decay. We demonstrate that for suitable parameter ranges, the vacuum decay process dominates over the Hawking evaporation process. Finally, we comment on the application of these results to vacuum decay seeded by black holes produced in particle collisions.

  7. FY 1998 report on the waste processing/recycling related technology, 'The R and D of lead-free solder standardization'; 1998 nendo haikibutsu shori recycle kanren gijutsu seika hokokusho. Namari free handa kikakuka nado kenkyu kaihatsu

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2000-03-01

    To reduce the environmental pollution caused by lead eluted from the electronic equipment waste, the R and D on lead-free solder were conducted and the results were summarized. As to the basic characteristics, the evaluation test method was studied in terms of the range of melting temperature, mechanical strength, wettability and joint strength, to select a uniform test method. As the lead-free solder, Sn-Ag alloys were mainly used and mixed in a combination of Cu, Bi and In. Changes in characteristics were made clear by adding trace elements such as Ge, Mn and P. Relating to the applied characteristics, in selection of solder materials, materials were selected for which evaluation of the commercialization is proceeded with from a viewpoint of promotion of commercialization. Concerning the experimental evaluation of characteristics of lead-free solder in mounted substrates, it was indicated that basically lead-free solder can be practically used. Further, it was indicated that the Sn-Ag-Cu-Bi system depends not on solder composition but on active force, printing accuracy and flux characteristic of solder paste, that improvement of solder paste has an effect on mounting characteristics. (NEDO)

  8. Vacuum distillation for the separation of LiCl-KCl eutectic salt and cadmium in pyro process

    International Nuclear Information System (INIS)

    Kwon, S. W.; Park, K. M.; Lee, S. J.; Park, S. B.; Woo, M. S.; Kim, K. R.; Kim, J. G.; Ahn, D. H.; Lee, H. S.

    2010-10-01

    Electrorefining is a key step in pyro processing. Electrorefining process is generally composed of two recovery steps- a deposit of uranium onto a solid cathode (electrorefining) and then the recovery of the remaining uranium and Tru (Transuranic) elements simultaneously by a liquid cadmium cathode (electrowinning). In this study, distillation experiments of a LiCl-KCl eutectic salt and cadmium metal were carried out to examine the distillation behaviors for the development of the electrorefining and the electrowinning processes. The experimental set-up was composed of a distillation tower with an evaporator and a condenser, vacuum pump, control unit, and an off gas treatment system. The solid-liquid separation prior to distillation of the LiCl-KCl eutectic salt was proposed and found to be feasible for the reduction of the burden of the distillation process. The LiCl-KCl eutectic salt was successfully distilled after the liquid salt separation. Distillation experiments for cadmium metal were also carried out. The apparent evaporation rates of LiCl-KCl eutectic salt and cadmium increased with an increasing temperature. The evaporation behaviors of cadmium metal and cadmium-cerium alloy were compared. Cadmium in the alloy was successfully distilled and separated from cerium. The evaporation rate of cadmium in the alloy was lower than that of cadmium metal. The low evaporation rate of the alloy was probably caused by the formation of an intermetallic compound and the residual salt during the preparation of the alloy. Therefore, the distillation temperature for the distillation of the liquid cathode should be higher than the distillation of cadmium metal. The measured evaporation rates of the eutectic salt and cadmium were compared with the values calculated by a relation based on the kinetics of gases. The theoretical values of the evaporation rate calculated by the Hertz-Langmuir relation were higher than the experimental values. The deviations were compensated for

  9. Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Lin, C.-T. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China); Hsi, C.-S. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Wang, M.-C. [Faculty of Fragrance and Cosmetics, Kaohsiung Medical University, 100 Shih-Chuan 1st Road, Kaohsiung 807, Taiwan (China)], E-mail: mcwang@kmu.edu.tw; Chang, T.-C.; Liang, M.-K. [Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China)

    2008-07-14

    Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 {+-} 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 {+-} 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 {+-} 0.3 and 1.7 {+-} 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu{sub 5}Zn{sub 8} intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu{sub 6}Sn{sub 5} IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu{sub 6}Sn{sub 5} IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength.

  10. Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

    Science.gov (United States)

    Yoon, Jeong-Won; Noh, Bo-In; Jung, Seung-Boo

    2011-09-01

    Interfacial reactions and joint reliability of Sn-3.0Ag-0.5Cu solder with two different surface finishes, electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG), were evaluated during a reflow process. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn-Ag-Cu/ENIG joint exhibited a higher intermetallic compound (IMC) growth rate and a higher consumption rate of the Ni(P) layer than the Sn-Ag-Cu/ENEPIG joint. The presence of the Pd layer in the ENEPIG suppressed the growth of the interfacial IMC layer and the consumption of the Ni(P) layer, resulting in the superior interfacial stability of the solder joint. The shear test results show that the ENIG joint fractured along the interface, exhibiting indications of brittle failure possibly due to the brittle IMC layer. In contrast, the failure of the ENEPIG joint only went through the bulk solder, supporting the idea that the interface is mechanically reliable. The results from this study confirm that the Sn-Ag-Cu/ENEPIG solder joint is mechanically robust and, thus, the combination is a viable option for a Pb-free package system.

  11. Laser-activated protein solder for peripheral nerve repair

    Science.gov (United States)

    Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

    1995-05-01

    A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

  12. Soldering of copper-clad niobium--titanium superconductor composite

    International Nuclear Information System (INIS)

    Moorhead, A.J.; Woodhouse, J.J.; Easton, D.S.

    1977-04-01

    When superconductivity is applied to various electrical devices, the joining of the superconducting material and the performance of the joints are generally crucial to the successful operation of the system. Although many techniques are being considered for joining composite superconductors, soldering is the most common. We determined the wetting and flow behavior of various solder and flux combinations on a copper-clad Nb-Ti composite, developed equipment and techniques for soldering and inspection of lap joints, and determined the shear strength of joints at temperatures down to -269 0 C (4 0 K). We studied 15 solders and 17 commercial and experimental fluxes in the wettability and flow tests. A resistance unit was built for soldering test specimens. A series of samples soldered with 80 Pb-20 Sn, 83 Pb-15 Sn-2 Sb, 97.5 Pb-1.5 Ag-1 Sn, 80 In-15 Pb-5 Ag, or 25 In-37.5 Pb-37.5 Sn (wt percent) was inspected by three nondestructive techniques. Through-transmission ultrasound gave the best correlation with nonbond areas revealed in peel tests. Single-lap shear specimens soldered with 97.5 Pb-1.5 Ag-1 Sn had the highest strength (10.44 ksi, 72 MPa) and total elongation (0.074 in., 1.88 mm) at -269 0 C (4 0 K) of four solders tested

  13. Knudsen pump produced via silicon deep RIE, thermal oxidation, and anodic bonding processes for on-chip vacuum pumping

    Science.gov (United States)

    Van Toan, Nguyen; Inomata, Naoki; Trung, Nguyen Huu; Ono, Takahito

    2018-05-01

    This work describes the fabrication and evaluation of the Knudsen pump for on-chip vacuum pumping that works based on the principle of a thermal transpiration. Three AFM (atomic force microscope) cantilevers are integrated into small chambers with a size of 5 mm  ×  3 mm  ×  0.4 mm for the pump’s evaluation. Knudsen pump is fabricated using deep RIE (reactive ion etching), wet thermal oxidation and anodic bonding processes. The fabricated device is evaluated by monitoring the quality (Q) factor of the integrated cantilevers. The Q factor of the cantilever is increased from 300 -1150 in cases without and with a temperature difference approximately 25 °C between the top (the hot side at 40 °C) and bottom (the cold side at 15 °C) sides of the fabricated device, respectively. The evacuated chamber pressure of around 10 kPa is estimated from the Q factor of the integrated cantilevers.

  14. Improved glycerol production from cane molasses by the sulfite process with vacuum or continuous carbon dioxide sparging during fermentation

    Energy Technology Data Exchange (ETDEWEB)

    Kalle, G.P.; Naik, S.C.; Lashkari, B.Z.

    1985-01-01

    The conventional sulfite process for glycerol production from molasses using Saccharomyces cerevisiae var. Hansen was modified to obtain product concentrations of up to 230 g/l and productivity of 15 g/l x d by fermenting under vacuum (80 mm) or with continuous sparging of CO/sub 2/ (0.4 vvm). Under these conditions the requirement of sulfite for optimum production of glycerol was reduced by two thirds (20 g/l), the ethanol concentration in the medium was kept below 30 g/l and the competence of yeast cells to ferment was conserved throughout the fermentation period for up to 20 days. In addition to the above, the rate of incorporation of sulfite had a significant effect on glucose fermentation and glycerol yields. There was an optimal relationship between glycerol yields and the molar ratio of sulfite to glucose consumed, which for cane molasses was 0.67. This ratio was characteristic of the medium composition. 10 references, 4 figures, 3 tables.

  15. The effect of micro alloying on the microstructure evolution of Sn-Ag-Cu lead-free solder

    Science.gov (United States)

    Werden, Jesse

    The microelectronics industry is required to obtain alternative Pb-free soldering materials due to legal, environmental, and technological factors. As a joining material, solder provides an electrical and mechanical support in electronic assemblies and therefore, the properties of the solder are crucial to the durability and reliability of the solder joint and the function of the electronic device. One major concern with new Pb-free alternatives is that the microstructure is prone to microstructural coarsening over time which leads to inconsistent properties over the device's lifetime. Power aging the solder is a common method of stabilizing the microstructure for Pb-based alloys, however, it is unclear if this will be an appropriate solution to the microstructural coarsening of Pb-free solders. The goal of this work is to develop a better understanding of the coarsening process in new solder alloys and to suggest methods of stabilizing the solder microstructure. Microalloying is one potential solution to the microstructural coarsening problem. This experiment consists of a microstructural coarsening study of SAC305 in which each sample has been alloyed with one of three different solutes, directionally solidified at 100microm/s, and then aged at three different temperatures over a total period of 20 days. There are several important conclusions from this experiment. First, the coarsening kinetics of the intermetallics in the ternary eutectic follow the Ostwald ripening model where r3 in proprotional to t for each alloying constituent. Second, the activation energy for coarsening was found to be 68.1+/-10.3 kJ/mol for the SAC305 samples, Zn had the most significant increase in the activation energy increasing it to 88.8+/-34.9 kJ/mol for the SAC+Zn samples, Mn also increased the activation energy to 83.2+/-20.8 kJ/mol for the SAC+Mn samples, and Sb decreased the activation energy to 48.0+/-3.59 kJ/mol for the SAC+Sb samples. Finally, it was found that the

  16. Measurement of erosion of stainless steel by molten lead-free solder using micro-focus x-ray CT system

    International Nuclear Information System (INIS)

    Nishikawa, Hiroshi; Takemoto, Tadashi; Kang, Songai

    2009-01-01

    The severe erosion damage, which is caused by a molten lead-free solder, of wave solder equipment made into stainless steel has been encountered in operation. Then, the higher maintenance frequency and reduced life time of wave solder machine component is a serious issue in a manufacturing process. In this study, the evaluation method of erosion of stainless steel by molten lead-free solders was investigated using micro-focus X-ray systems for fluoroscopic and computed tomography (CT). As a result, it was found that the fluoroscopic image could truly reconstruct the cross-shape of the stainless steel sample after immersion test without destruction. In the case of X-ray systems for fluoroscopic and CT used in this study, three-dimensional data can be obtained. Therefore, it was possible to easily check the whole picture of the test sample after immersion test and to decide the maximum erosion depth of test sample. (author)

  17. Brazing process in nuclear fuel element fabrication

    International Nuclear Information System (INIS)

    Katam, K.; Sudarsono

    1982-01-01

    The purpose of the brazing process is to join the spacers and pads of fuel pins, so that the process is meant as a soldering technique and not only as a hardening or reinforcing process such as in common brazing purposes. There are some preliminary processes before executing the brazing process such as: materials preparation, sand blasting, brazing metal coating tack welding the spacers and pads on the fuel cladding. The metal brazing used is beryllium in strip form which will be evaporated in vacuum condition to coat the spacers and pads. The beryllium vapor and dust is very hazardous to the workers, so all the line process of brazing needs specials safety protection and equipment to protect the workers and the processing area. Coating process temperature is 2470 deg C with a vacuum pressure of 10 -5 mmHg. Brazing process temperature process is 1060 deg C with a vacuum pressure of 10 -6 mmHg. The brazing process with beryllium coating probably will give metallurgical structural change in the fuel cladding metal at the locations of spacers and pads. The quality of brazing is highly influenced by and is depending on the chemical composition of the metal and the brazing metal, materials preparations, temperature, vacuum pressure, time of coating and brazing process. The quality control of brazing could be performed with methods of visuality geometry, radiography and metallography. (author)

  18. Nanoconstruction by welding individual metallic nanowires together using nanoscale solder

    International Nuclear Information System (INIS)

    Peng, Y; Inkson, B J; Cullis, A G

    2010-01-01

    This work presents a new bottom-up nanowelding technique enabling building blocks to be assembled and welded together into complex 3D nanostructures using nanovolumes of metal solder. The building blocks of gold nanowires, (Co 72 Pt 28 /Pt) n multilayer nanowires, and nanosolder Sn 99 Au 1 alloy nanowires were successfully fabricated by a template technique. Individual metallic nanowires were picked up and assembled together. Conductive nanocircuits were then welded together using similar or dissimilar nanosolder material. At the weld sites, nanoscale volumes of a chosen metal are deposited using nanosolder of a sacrificial nanowire, which ensures that the nanoobjects to be bonded retain their structural integrity. The whole nanowelding process is clean, controllable and reliable, and ensures both mechanically strong and electrically conductive contacts.

  19. Microstructure and mechanical properties of Sn-9Zn-xAl2O3 nanoparticles (x=0–1) lead-free solder alloy: First-principles calculation and experimental research

    International Nuclear Information System (INIS)

    Xing, Wen-qing; Yu, Xin-ye; Li, Heng; Ma, Le; Zuo, Wei; Dong, Peng; Wang, Wen-xian; Ding, Min

    2016-01-01

    This paper studies microstructure and mechanical properties of Sn-9Zn-x Al 2 O 3 nanoparticles (x=0–1) lead-free solder alloy. The interface structure, interface energy and electronic properties of Al 2 O 3 /Sn9Zn interface are investigated by first-principle calculation. On the experimental part, in comparison with the plain Sn-9Zn solder, the Al 2 O 3 nanoparticles incorporated into the solder matrix can inhibit the growth of coarse dendrite Sn-Zn eutectic structure and refine grains of the composite solders during the solidification process of the alloys. Moreover, the microhardness and average tensile strength of the solders with addition of Al 2 O 3 nanoparticles increased with the increasing weight percentages of Al 2 O 3 nanoparticles. These improved mechanical properties can be attributed to the microstructure developments and the dispersed Al 2 O 3 nanoparticles.

  20. Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder

    Science.gov (United States)

    2015-05-05

    under bump metallurgy and solder joint geometry on Sn grain morphology in Pb free solder joints were examined. SnAgCu solder joints were examined for...free solder interconnects”, Sci. Technol. Weld . Join. 13, 732 (2008). [3.25] Terashima, S., Takahama, K., Nozaki, M., and Tanaka, M. Recrystallization

  1. Vacuum gauges

    International Nuclear Information System (INIS)

    Power, B.D.; Priestland, C.R.D.

    1978-01-01

    This invention relates to vacuum gauges, particularly of the type known as Penning gauges, which are cold cathode ionisation gauges, in which a magnetic field is used to lengthen the electron path and thereby increase the number of ions produced. (author)

  2. Vacuum Die Casting Process and Simulation for Manufacturing 0.8 mm-Thick Aluminum Plate with Four Maze Shapes

    Directory of Open Access Journals (Sweden)

    Chul Kyu Jin

    2015-02-01

    Full Text Available Using vacuum die casting, 0.8 mm-thick plates in complicated shapes are manufactured with the highly castable aluminum alloy Silafont-36 (AlSi9MgMn. The sizes and shapes of the cavities, made of thin plates, feature four different mazes. To investigate formability and mechanical properties by shot condition, a total of six parameters (melt temperatures of 730 °C and 710 °C; plunger speeds of 3.0 m/s and 2.5 m/s; vacuum pressure of 250 mbar and no vacuum are varied in experiments, and corresponding simulations are performed. Simulation results obtained through MAGMA software show similar tendencies to those of the experiments. When the melt pouring temperature is set to 730 °C rather than 710 °C, formability and mechanical properties are superior, and when the plunger speed is set to 3.0 m/s rather than to 2.5 m/s, a fine, even structure is obtained with better mechanical properties. The non-vacuumed sample is half unfilled. The tensile strength and elongation of the sample fabricated under a melt temperature of 730 °C, plunger speed of 3.0 m/s, and vacuum pressure of 250 mbar are 265 MPa and 8.5%, respectively.

  3. Numerical prediction of mechanical properties of Pb-Sn solder alloys containing antimony, bismuth and or silver ternary trace elements

    Science.gov (United States)

    Gadag, Shiva P.; Patra, Susant

    2000-12-01

    Solder joint interconnects are mechanical means of structural support for bridging the various electronic components and providing electrical contacts and a thermal path for heat dissipation. The functionality of the electronic device often relies on the structural integrity of the solder. The dimensional stability of solder joints is numerically predicted based on their mechanical properties. Algorithms to model the kinetics of dissolution and subsequent growth of intermetallic from the complete knowledge of a single history of time-temperature-reflow profile, by considering equivalent isothermal time intervals, have been developed. The information for dissolution is derived during the heating cycle of reflow and for the growth process from cooling curve of reflow profile. A simple and quick analysis tool to derive tensile stress-strain maps as a function of the reflow temperature of solder and strain rate has been developed by numerical program. The tensile properties are used in modeling thermal strain, thermal fatigue and to predict the overall fatigue life of solder joints. The numerical analysis of the tensile properties as affected by their composition and rate of testing, has been compiled in this paper. A numerical model using constitutive equation has been developed to evaluate the interfacial fatigue crack growth rate. The model can assess the effect of cooling rate, which depends on the level of strain energy release rate. Increasing cooling rate from normalizing to water-quenching, enhanced the fatigue resistance to interfacial crack growth by up to 50% at low strain energy release rate. The increased cooling rates enhanced the fatigue crack growth resistance by surface roughening at the interface of solder joint. This paper highlights salient features of process modeling. Interfacial intermetallic microstructure is affected by cooling rate and thereby affects the mechanical properties.

  4. Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/ Pd/ Au surface finishes

    International Nuclear Information System (INIS)

    NorAkmal, F.; Ourdjini, A.; Azmah Hanim, M.A.; Siti Aisha, I.; Chin, Y.T.

    2007-01-01

    Flip chip technology provides the ultimate in high I/ O-density and count with superior electrical performance for interconnecting electronic components. Therefore, the study of the intermetallic compounds was conducted to investigate the effect of solder bumps sizes on several surface finishes which are copper and Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) which is widely used in electronics packaging as surface finish for flip-chip application nowadays. In this research, field emission scanning electron microscopy (FESEM) analysis was conducted to analyze the morphology and composition of intermetallic compounds (IMCs) formed at the interface between the solder and UBM. The IMCs between the SAC lead-free solder with Cu surface finish after reflow were mainly (Cu, Ni) 6 Sn 5 and Cu 6 Sn 5 . While the main IMCs formed between lead-free solder on ENEPIG surface finish are (Ni, Cu) 3 Sn 4 and Ni 3 Sn 4 . The results from FESEM with energy dispersive x-ray (EDX) have revealed that isothermal aging at 150 degree Celsius has caused the thickening and coarsening of IMCs as well as changing them into more spherical shape. The thickness of the intermetallic compounds in both finishes investigated was found to be higher in solders with smaller bump size. From the experimental results, it also appears that the growth rate of IMCs is higher when soldering on copper compared to ENEPIG finish. Besides that, the results also showed that the thickness of intermetallic compounds was found to be proportional to isothermal aging duration. (author)

  5. Vacuum tight sodium resistant compound between ThO2 ceramic and metal

    International Nuclear Information System (INIS)

    Reetz, T.

    A method for evaluating the mechanical tensions for metal/ ceramic joinings was applied to the selection of metal components for a highly vacuum tight, sodium-resistant metal/ThO 2 ceramic solder joining. The metal component selected was the iron--nickel alloy Dilasil which is joined to the ceramic using a nickel-based solder. The wetting of the cearamic could be carried out using the titanium hydride technique or after the formation of a W-cerium layer on the surface of this ceramic. (U.S.)

  6. Utilization of Pb-free solders in MEMS packaging

    Science.gov (United States)

    Selvaduray, Guna S.

    2003-01-01

    Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

  7. Fatigue and thermal fatigue of Pb-Sn solder joints

    International Nuclear Information System (INIS)

    Frear, D.; Grivas, D.; McCormack, M.; Tribula, D.; Morris, J.W. Jr.

    1987-01-01

    This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55 0 C and 125 0 C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb

  8. Development of the control algorithm of processes of intensive hygrothermal impact on capillary and porous materials in the conditions of the vacuum

    Directory of Open Access Journals (Sweden)

    Larina Ludmila

    2017-01-01

    Full Text Available Objective of this research is creation of an algorithm of a control system of the modes of the intensive hygrothermal influence (IGI in the conditions of a vacuum when performing the corresponding operations: moistening; the subsequent, if necessary, cyclic drying from within preparation of top of footwear; damp thermal treatment on universal installation with adjustable parameters of a working environment. For assessment of quality of the intensified hygrothermal impact on preparations of top of footwear the integrated criteria of efficiency of processes were used. Ensuring automatic control of parameters of processes of IGV on preparations of top of footwear in universal vacuum installation will allow to control quality of preparations upon transition from performance of one operation to another according to standard manufacturing techniques of footwear.

  9. Assessment of potential solder candidates for high temperature applications

    DEFF Research Database (Denmark)

    pressure to eliminate lead containing materials despite the fact that materials for high Pb containing alloys are currently not affected by any legislations. A tentative assessment was carried out to determine the potential solder candidates for high temperature applications based on the solidification...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

  10. Manipulation and soldering of carbon nanotubes using atomic force microscope

    International Nuclear Information System (INIS)

    Kashiwase, Yuta; Ikeda, Takayuki; Oya, Takahide; Ogino, Toshio

    2008-01-01

    Manipulation of carbon nanotubes (CNTs) by an atomic force microscope (AFM) and soldering of CNTs using Fe oxide nanoparticles are described. We succeeded to separate a CNT bundle into two CNTs or CNT bundles, to move the separated CNT to a desirable position, and to bind it to another bundle. For the accurate manipulation, load of the AFM cantilever and frequency of the scan were carefully selected. We soldered two CNTs using an Fe oxide nanoparticle prepared from a ferritin molecule. The adhesion forces between the soldered CNTs were examined by an AFM and it was found that the CNTs were bound, though the binding force was not strong

  11. Baryogenesis in false vacuum

    Energy Technology Data Exchange (ETDEWEB)

    Hamada, Yuta [KEK Theory Center, IPNS, KEK, Tsukuba, Ibaraki (Japan); Yamada, Masatoshi [Kanazawa University, Institute for Theoretical Physics, Kanazawa (Japan)

    2017-09-15

    The null result in the LHC may indicate that the standard model is not drastically modified up to very high scales, such as the GUT/string scale. Having this in the mind, we suggest a novel leptogenesis scenario realized in the false vacuum of the Higgs field. If the Higgs field develops a large vacuum expectation value in the early universe, a lepton number violating process is enhanced, which we use for baryogenesis. To demonstrate the scenario, several models are discussed. For example, we show that the observed baryon asymmetry is successfully generated in the standard model with higher-dimensional operators. (orig.)

  12. Effect of surface oxide on the melting behavior of lead-free solder nanowires and nanorods

    International Nuclear Information System (INIS)

    Gao Fan; Rajathurai, Karunaharan; Cui, Qingzhou; Zhou, Guangwen; NkengforAcha, Irene; Gu Zhiyong

    2012-01-01

    Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among various important parameters, melting is the most fundamental property affecting the assembly process. Here we report that the melting behavior of tin and tin/silver nanowires and nanorods can be significantly affected by the surface oxide of nanosolders. By controlling the nanosolder reflow atmosphere using a flux, the surface oxide of the nanowires/nanorods can be effectively removed and complete nanosolder melting can be achieved. The complete melting of the nanosolders leads to the formation of nanoscale to microscale spherical solder balls, followed by Ostwald ripening phenomenon. The contact angle of the microscale solder balls formed on Si substrate was measured by direct electron microscopic imaging. These results provide new insights into micro- and nanoscale phase transition and liquid droplet coalescence from nanowires/nanorods to spheroids, and are relevant to nanoscale assembly and smaller ball grid array formation.

  13. Recovery of Tin and Nitric Acid from Spent Solder Stripping Solutions

    International Nuclear Information System (INIS)

    Ahn, Jae-Woo; Ryu, Seong-Hyung; Kim, Tae-young

    2015-01-01

    Spent solder-stripping solutions containing tin, copper, iron, and lead in nitric acid solution, are by-products of the manufacture of printed-circuit boards. The recovery of these metals and the nitric acid, for re-use has economic and environmental benefits. In the spent solder-stripping solution, a systematic method to determine a suitable process for recovery of valuable metals and nitric acid was developed. Initially, more than 90% of the tin was successfully recovered as high-purity SnO 2 by thermal precipitation at 80 ℃ for 3 hours. About 94% of the nitric acid was regenerated effectively from the spent solutions by diffusion dialysis, after which there remained copper, iron, and lead in solution. Leakage of tin through the anion-exchange membrane was the lowest (0.026%), whereas Pb-leakage was highest (4.26%). The concentration of the regenerated nitric acid was about 5.1 N.

  14. Appendix to the report from the low-residue soldering task force: Phase 2 results

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J.; Huffman, D.D. [and others

    1995-12-01

    The LRSTF report for Phase I of its evaluation of low-residue soldering was issued in June 1995. This Appendix summarizes the results of follow-on testing performed in Phase II and compares electrical test results for both phases. Deliberate decisions were made by the LRSTF in Phase I to challenge the design guideline limits in MILSTD-275, Printed Wiring for Electronic Equipment The LRSTF considered this approach to produce a ``worst case`` design and provide useful information about the robustness of LR soldering processes. As such, good design practices were sometimes deliberately violated in designing the LRSTF board. This approach created some anomalies for both LR boards and RMA/cleaned controls. Phase II testing verified that problems that affected both RMA/cleaned and LR boards in Phase I were design related.

  15. Diode Lasers used in Plastic Welding and Selective Laser Soldering - Applications and Products

    Science.gov (United States)

    Reinl, S.

    Aside from conventional welding methods, laser welding of plastics has established itself as a proven bonding method. The component-conserving and clean process offers numerous advantages and enables welding of sensitive assemblies in automotive, electronic, medical, human care, food packaging and consumer electronics markets. Diode lasers are established since years within plastic welding applications. Also, soft soldering using laser radiation is becoming more and more significant in the field of direct diode laser applications. Fast power controllability combined with a contactless temperature measurement to minimize thermal damage make the diode laser an ideal tool for this application. These advantages come in to full effect when soldering of increasingly small parts in temperature sensitive environments is necessary.

  16. Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint.

    Science.gov (United States)

    Lee, Sang-Yeob; Lee, Jong-Hyuk

    2010-12-01

    The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

  17. Life cycle assessment (LCA of lead-free solders from the environmental protection aspect

    Directory of Open Access Journals (Sweden)

    Mitovski Aleksandra M.

    2009-01-01

    Full Text Available Life-cycle assessment (LCA presents a relatively new approach, which allows comprehensive environmental consequences analysis of a product system over its entire life. This analysis is increasingly being used in the industry, as a tool for investigation of the influence of the product system on the environment, and serves as a protection and prevention tool in ecological management. This method is used to predict possible influences of a certain material to the environment through different development stages of the material. In LCA, the product systems are evaluated on a functionally equivalent basis, which, in this case, was 1000 cubic centimeters of an alloy. Two of the LCA phases, life-cycle inventory (LCA and life-cycle impact assessment (LCIA, are needed to calculate the environmental impacts. Methodology of LCIA applied in this analysis aligns every input and output influence into 16 different categories, divided in two subcategories. The life-cycle assessment reaserch review of the leadfree solders Sn-Cu, SAC (Sn-Ag-Cu, BSA (Bi-Sb-Ag and SABC (Sn-Ag-Bi-Cu respectively, is given in this paper, from the environmental protection aspect starting from production, through application process and finally, reclamation at the end-of-life, i.e. recycling. There are several opportunities for reducing the overall environmental and human health impacts of solder used in electronics manufacturing based on the results of the LCA, such as: using secondary metals reclaimed through post-industrial recycling; power consumption reducing by replacing older, less efficient reflow assembly equipment, or by optimizing the current equipment to perform at the elevated temperatures required for lead-free soldering, etc. The LCA analysis was done comparatively in relation to widely used Sn-Pb solder material. Additionally, the impact factors of material consumption, energy use, water and air reserves, human health and ecotoxicity have been ALSO considered including

  18. Development of a soft-soldering system for aluminum

    Science.gov (United States)

    Falke, W. L.; Lee, A. Y.; Neumeier, L. A.

    1983-03-01

    The method employs application of a thin nickel copper alloy coating to the substrate, which enables the tin lead solders to wet readily and spread over the areas to be joined. The aluminum substrate is mechanically or chemically cleaned to facilitate bonding to a minute layer of zinc that is subsequently applied, with an electroless zincate solution. The nickel copper alloy (30 to 70 pct Ni) coating is then applied electrolytically over the zinc, using immersion cell or brush coating techniques. Development of acetate electrolytes has permitted deposition of the proper alloys coatings. The coated areas can then be readily joined with conventional tin lead solders and fluxs. The joints so formed are ductile, strong, and relatively corrosion resistant, and exhibit strengths equivalent to those formed on copper and brass when the same solders and fluxes are used. The method has also been employed to soft solder magnesium alloys.

  19. Development of gold based solder candidates for flip chip assembly

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

  20. Strength of joints brazed with two-phase solders

    International Nuclear Information System (INIS)

    Shnyakin, N.S.; Parfenova, L.V.; Ekatova, A.S.; Prilepskaya, I.V.

    1976-01-01

    Dependence of the structure and strength of soldered joints upon a gap size in case of 1Kh18N10T stainless steel soldering with a double-phase solder of Ni-Zn-Cu system is described. Butt and lap joints have been subjected to soldering with gas-flame and induction heating. The optimum conditions of the solder crystallization are determined with wedge-gap samples. The studies show that the character of distribution of a fusible β-phase in metal depends upon a gap size. With gaps up to 0.1 mm the β-phase enriched with a fusible component (zinc) runs as a continuous thin interlayer in the middle of the seam. As a result of zinc evaporation from the β-phase this interlayer becomes internally oxidized. After the sample is broken an oxidized fracture gives one the impression of a poor fusion in the middle part of the joint. The ultimate strength of butt joints is 15-20 kgf/sq.mm. A value of thermal expansion of 1Kh18N10T steel samples, 1-5 mm thick, has been experimentally determined for butt soldering. The elongation of two halves of the sample is measured by an indicator and proved to be 0.89 mm for a 50x50x2 mm sample at a soldering temperature of 1.100 deg C. The paper presents methods for the calculation of an optimal gap value for butt soldering with a local gas-flame and induction heating

  1. Laser Soldering of Rat Skin Using a Controlled Feedback System

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2009-03-01

    Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

  2. Tensile strength of two soldered alloys (Minalux and Verabond2

    Directory of Open Access Journals (Sweden)

    Mir Mohammad Rezaee S

    2002-07-01

    Full Text Available Recently. Minalux alloy, a base metal free from Be, has been presented on the market while no special soldering has been recommended for it. On the other hand, based on the manufacturer's claim, this alloy is similar to Verabond2. The aim of this study was to investigate the tensile strength of Minalux and Verabond2, soldered by Verasolder. Twelve standard dambble shape samples, with the length of 18 mm and the diameter of 3mm, were prepared from each alloy. Six samples of each alloy were divided into two pieces with carboradom disk. Soldering gap distance was 0.3mm, measured by a special jig and they were soldered by Verasolder alloy. Six other samples, of both Iranian and foreign unsoldered alloys were considered as control group. Then samples were examined under tensile force and their tensile strength was recorded. Two- way variance analysis showed that the tensile strength of Minalux alloy and Verabond2 were not statistically significant (Verasoler 686, Minalux 723, but after soldering, such difference became significant (Minalux 308, Verabond2 432. Verabond2 showed higher tensile strength after soldering.

  3. Multi-layer SiC ceramics/Mo joints brazed using high-temperature solders

    International Nuclear Information System (INIS)

    Olesinska, W.; Kesik, J.

    2003-01-01

    The paper presents the results of studies on joining SiC ceramics with molybdenum, with the ceramic surface being activated by titanium, chromium or copper. Titanium or chromium were deposited by the sputtering technique, and copper - by the electro-chemical method. The microstructures of the SiC/Mo joints brazed with the CuMn13Ni3 solder and copper in a nitrogen atmosphere were examined and the results discussed. The joints, in which the ceramic surface was activated in addition with chromium, do not contain mechanical defects caused by the joining process, and the ceramic surface is covered with a continuous layer of the solder. A phase analysis of the interface surface identified an MeSiC phase. The mechanical strength of the joints in which the ceramic surface was modified by the Ti, Cr and Cu layers was markedly greater than that of the joints brazed directly to the uncoated ceramics with the use of active solders. (author)

  4. An evaluation of the spring finger solder joints on SA1358-10 and SA2052-4 connector assemblies (MC3617,W87)

    International Nuclear Information System (INIS)

    Kilgo, Alice C.; Vianco, Paul Thomas; Hlava, Paul Frank; Zender, Gary L.

    2006-01-01

    The SA1358-10 and SA2052-4 circular JT Type plug connectors are used on a number of nuclear weapons and Joint Test Assembly (JTA) systems. Prototype units were evaluated for the following specific defects associated with the 95Sn-5Sb (Sn-Sb, wt.%) solder joint used to attach the beryllium-copper (BeCu) spring fingers to the aluminum (Al) connector shell: (1) extended cracking within the fillet; (2) remelting of the solder joint during the follow-on, soldering step that attached the EMR adapter ring to the connector shell (and/or soldering the EMR shell to the adapter ring) that used the lower melting temperature 63Sn-37Pb (Sn-Pb) alloy; and (3) spalling of the Cd (Cr) layer overplating layer from the fillet surface. Several pedigrees of connectors were evaluated, which represented older fielded units as well as those assemblies that were recently constructed at Kansas City Plant. The solder joints were evaluated that were in place on connectors made with the current soldering process as well as an alternative induction soldering process for attaching the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely reflected the different extents to which the connector was mated to its counterpart assembly. In all cases, the spring finger solder joints on the SA1358-10 connectors were remelted as a result of the subsequent EMR adapter ring attachment process. Spalling of the Cd (Cr) overplating layer was also observed for these connectors, which was a consequence of the remelting activity. On the other hand, the SA2052-4 connector did not exhibit evidence of

  5. Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

    Directory of Open Access Journals (Sweden)

    Roman Koleňák

    2018-04-01

    Full Text Available The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In, in which the phases of titanium (Ti3In4 and silver (AgIn2 are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg6In5 and (AgCuIn2. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

  6. The AGS Booster vacuum systems

    International Nuclear Information System (INIS)

    Hseuh, H.C.

    1989-01-01

    The AGS Booster is a synchrotron for the acceleration of both protons and heavy ions. The design pressure of low 10 -11 mbar is required to minimize beam loss of the partially stripped heavy ions. To remove contaminants and to reduce outgassing, the vacuum chambers and the components located in them will be chemically cleaned, vacuum fired, baked then treated with nitric oxide. The vacuum sector will be insitu baked to a minimum of 200 degree C and pumped by the combination of sputter ion pumps and titanium sublimation pumps. This paper describes the design and the processing of this ultra high vacuum system, and the performance of some half-cell vacuum chambers. 9 refs., 7 figs

  7. Interfacial Microstructure and Shear Strength of Brazed Cu-Cr-Zr Alloy Cylinder and Cylindrical Hole by Au Based Solder

    Directory of Open Access Journals (Sweden)

    Zaihua Li

    2017-07-01

    Full Text Available Au-Ge-Ni solder was chosen for brazing of the Cu-Cr-Zr alloy cylinder and a part with a cylindrical hole (sleeve below 550 °C. The Au based solder was first sintered on the surface of the cylinder and then brazed to the inner surface of the sleeve. The effects of the heating process, the temperature and the holding time at the temperature on the microstructure of the sintered layer on the surface of the cylinder, the brazed interfacial microstructure, and the brazed shear strength between the cylinder and the sleeve were investigated by scanning electron microscope, energy dispersive X-ray spectroscopy analysis, and tensile shear tests. By approach of side solder melt feeding and brazing under proper parameters, the voids and micro cracks due to a lack of enough solder melt feeding are greatly lessened and the brazed shear strength of 100 MPa is ensured even with large clearances around 0.01 mm.

  8. Solidification observations and sliding wear behavior of vacuum arc melting processed Ni–Al–TiC composites

    International Nuclear Information System (INIS)

    Karantzalis, A.E.; Lekatou, A.; Tsirka, K.

    2012-01-01

    Monolithic Ni 3 Al and Ni–25 at.%Al intermetallic matrix TiC-reinforced composites were successfully produced by vacuum arc melting. TiC crystals were formed through a dissolution–reprecipitation mechanism and their final morphology is explained by means of a) Jackson's classical nucleation and growth phenomena and b) solidification rate considerations. The TiC presence altered the matrix microconstituents most likely due to specific melt–particle interactions and crystal plane epitaxial matching. TiC particles caused a significant decrease on the specific wear rate of the monolithic Ni 3 Al alloy and the possible wear mechanisms are approached by means of a) surface oxidation, b) crack/flaws formation, c) material detachment and d) debris–counter surfaces interactions. - Highlights: ► Vacuum arc melting (VAM) of Ni-Al based intermetallic matrix composite materials. ► Solidification phenomena examination. ► TiC crystal formation and growth mechanisms. ► Sliding wear examination.

  9. An innovative intermittent-vacuum assisted thermophilic anaerobic digestion process for effective animal manure utilization and treatment.

    Science.gov (United States)

    Zhang, Renchuan; Anderson, Erik; Addy, Min; Deng, Xiangyuan; Kabir, Fayal; Lu, Qian; Ma, Yiwei; Cheng, Yanling; Liu, Yuhuan; Chen, Paul; Ruan, Roger

    2017-11-01

    Intermittent-vacuum stripping (IVS) was developed as a pretreatment for thermophilic anaerobic digestion (TAD) to improve methanogenesis and hydrolysis activity through preventing free ammonia and hydrogen sulfide (H 2 S) inhibition from liquid swine manure (LSM). Over 98% of ammonia and 38% organic nitrogen were removed in 60min from 55°C to 85°C with vacuum pressure (from 100.63±3.79mmHg to 360.91±7.39mmHg) at initial pH 10.0 by IVS. Thermophilic methanogenesis and hydrolysis activity of pretreated LSM increased 52.25% (from 11.56±1.75% to 17.60±0.49%) in 25days and 40% (from 10days to 6days) in bio-methane potential assay. Over 80% H 2 S and total nitrogen were removed by IVS assistance, while around 70% nitrogen was recycled as ammonium sulfate. Therefore, IVS-TAD combination could be an effective strategy to improve TAD efficiency, whose elution is more easily utilized in algae cultivation and/or hydroponic system. Copyright © 2017 Elsevier Ltd. All rights reserved.

  10. Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

    Directory of Open Access Journals (Sweden)

    Molnar A.

    2017-06-01

    Full Text Available In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints’ lifetime.

  11. Control of microstructure in soldered, brazed, welded, plated, cast or vapor deposited manufactured components

    Science.gov (United States)

    Ripley, Edward B.; Hallman, Russell L.

    2015-11-10

    Disclosed are methods and systems for controlling of the microstructures of a soldered, brazed, welded, plated, cast, or vapor deposited manufactured component. The systems typically use relatively weak magnetic fields of either constant or varying flux to affect material properties within a manufactured component, typically without modifying the alloy, or changing the chemical composition of materials or altering the time, temperature, or transformation parameters of a manufacturing process. Such systems and processes may be used with components consisting of only materials that are conventionally characterized as be uninfluenced by magnetic forces.

  12. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

  13. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

  14. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

  15. A Corrosion Investigation of Solder Candidates for High-Temperature Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Ambat, Rajan

    2009-01-01

    The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work...

  16. Particle creation during vacuum decay

    International Nuclear Information System (INIS)

    Rubakov, V.A.

    1984-01-01

    The hamiltonian approach is developed with regard to the problem of particle creation during the tunneling process, leading to the decay of the false vacuum in quantum field theory. It is shown that, to the lowest order in (h/2π), the particle creation is described by the euclidean Schroedinger equation in an external field of a bounce. A technique for solving this equation is developed in an analogy to the Bogoliubov transformation technique, in the theory of particle creation in the presence of classical background fields. The technique is illustrated by two examples, namely, the particle creation during homogeneous vacuum decay and during the tunneling process leading to the materialization of the thin-wall bubble of a new vacuum in the metastable one. The curious phenomenon of intensive particle annihilation during vacuum decay is discussed and explicitly illustrated within the former example. The non-unitary extension of the Bogoliubov u, v transformations is described in the appendix. (orig.)

  17. Processing and characterization of Al–Cu–Li alloy AA2195 undergoing scale up production through the vacuum induction melting technique

    Energy Technology Data Exchange (ETDEWEB)

    Nayan, Niraj, E-mail: metnayan@gmail.com [Materials and Mechanical Entity, Vikram Sarabhai Space Centre, Trivandrum 695022 (India); Murty, S.V.S. Narayana; Jha, Abhay K.; Pant, Bhanu; Sharma, S.C.; George, Koshy M. [Materials and Mechanical Entity, Vikram Sarabhai Space Centre, Trivandrum 695022 (India); Sastry, G.V.S. [Department of Metallurgical Engineering, Institute of Technology, Banaras Hindu University, Varanasi (India)

    2013-08-01

    The inherent properties of lithium, such as high reactivity and toxicity, relatively low density, low melting point, along with its high cost requires a special technological approach to cast Al–Cu–Li alloy AA2195 as compared to the conventional Direct Chill (DC) casting of aluminum alloys. This paper describes the processing requirements for melting and casting of 200 kg of Al–Cu–Li alloy in a Vacuum Induction Melting (VIM) furnace under dynamic inert atmosphere. The as-cast billets have been homogenized to remove microsegregation as well as to avoid incipient melting, and subsequently subjected for secondary metal processing operations viz., forging and rolling. The product in the form of 4 mm thick sheets was subjected to various heat treatments in T8 (Solution Treatment+WQ+CW+Aging) condition. Mechanical properties were evaluated at room temperature and were correlated with microstructures of the sheets processed under different conditions using transmission electron microscopy (TEM)

  18. Processing and characterization of Al–Cu–Li alloy AA2195 undergoing scale up production through the vacuum induction melting technique

    International Nuclear Information System (INIS)

    Nayan, Niraj; Murty, S.V.S. Narayana; Jha, Abhay K.; Pant, Bhanu; Sharma, S.C.; George, Koshy M.; Sastry, G.V.S.

    2013-01-01

    The inherent properties of lithium, such as high reactivity and toxicity, relatively low density, low melting point, along with its high cost requires a special technological approach to cast Al–Cu–Li alloy AA2195 as compared to the conventional Direct Chill (DC) casting of aluminum alloys. This paper describes the processing requirements for melting and casting of 200 kg of Al–Cu–Li alloy in a Vacuum Induction Melting (VIM) furnace under dynamic inert atmosphere. The as-cast billets have been homogenized to remove microsegregation as well as to avoid incipient melting, and subsequently subjected for secondary metal processing operations viz., forging and rolling. The product in the form of 4 mm thick sheets was subjected to various heat treatments in T8 (Solution Treatment+WQ+CW+Aging) condition. Mechanical properties were evaluated at room temperature and were correlated with microstructures of the sheets processed under different conditions using transmission electron microscopy (TEM)

  19. Dry vacuum pumps

    International Nuclear Information System (INIS)

    Sibuet, R

    2008-01-01

    For decades and for ultimate pressure below 1 mbar, oil-sealed Rotary Vane Pumps have been the most popular solution for a wide range of vacuum applications. In the late 80ies, Semiconductor Industry has initiated the development of the first dry roughing pumps. Today SC applications are only using dry pumps and dry pumping packages. Since that time, pumps manufacturers have developed dry vacuum pumps technologies in order to make them attractive for other applications. The trend to replace lubricated pumps by dry pumps is now spreading over many other market segments. For the Semiconductor Industry, it has been quite easy to understand the benefits of dry pumps, in terms of Cost of Ownership, process contamination and up-time. In this paper, Technology of Dry pumps, its application in R and D/industries, merits over conventional pumps and future growth scope will be discussed

  20. Vacuum production; Produccion de vacio

    Energy Technology Data Exchange (ETDEWEB)

    Segovia, J. L. de

    2010-07-01

    Since the advent of ultra high vacuum in 1958 has been a great demand for new as means of production and to meet the process needs to be done: industry heavy, high technology and space research areas, large accelerator systems particles or nuclear fusion. In this paper we explore the modern media production: dry vacuum pumps, turbo pumps, pump status diffusion ion pumps and cryopumps. (Author)

  1. Cold vacuum drying facility design requirements

    International Nuclear Information System (INIS)

    IRWIN, J.J.

    1999-01-01

    This document provides the detailed design requirements for the Spent Nuclear Fuel Project Cold Vacuum Drying Facility. Process, safety, and quality assurance requirements and interfaces are specified

  2. Cold vacuum drying facility design requirements

    Energy Technology Data Exchange (ETDEWEB)

    IRWIN, J.J.

    1999-07-01

    This document provides the detailed design requirements for the Spent Nuclear Fuel Project Cold Vacuum Drying Facility. Process, safety, and quality assurance requirements and interfaces are specified.

  3. Drinking Water Contamination Due To Lead-based Solder

    Science.gov (United States)

    Garcia, N.; Bartelt, E.; Cuff, K. E.

    2004-12-01

    The presence of lead in drinking water creates many health hazards. Exposure to lead-contaminated water can affect the brain, the central nervous system, blood cells, and kidneys, causing such problems as mental retardation, kidney disease, heart disease, stroke, and death. One way in which lead can contaminate our water supply is through the use of lead solder to join pipes. Lead solder was widely used in the past because of its ease of application as well as its low cost. Lead contamination in residential areas has previously been found to be a particularly serious problem in first-draw samples, of water that has sat stagnant in pipes overnight. To investigate the time-dependence of drinking water lead contamination, we analyzed samples taken hourly of water exposed to lead solder. While our preliminary data was insufficient to show more than a rough correlation between time of exposure and lead concentration over short periods (1-3 hours), we were able to confirm that overnight exposure of water to lead-based solder results in the presence high levels of lead. We also investigated other, external factors that previous research has indicated contribute to increased concentrations of lead. Our analysis of samples of lead-exposed water at various pH and temperatures suggests that these factors can be equally significant in terms of their contribution to elevated lead concentration levels. In particular, water that is slightly corrosive appears to severely impact the solubility of lead. As this type of water is common in much of the Northeast United States, the presence of lead-based solder in residential areas there is especially problematic. Although lead-based solder has been banned since the 1980s, it remains a serious concern, and a practical solution still requires further research.

  4. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan

    2017-08-10

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  5. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan; Zheng, Xiujun; Zhang, Hong; Zhang, Junli; Fu, Jiecai; Zhang, Qiang; Peng, Chaoyi; Bai, Feiming; Zhang, Xixiang; Peng, Yong

    2017-01-01

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  6. MEA vacuum system

    International Nuclear Information System (INIS)

    Stroo, R.; Schwebke, H.; Heine, E.

    1984-01-01

    This report describes construction and operation of the MEA vacuum system of NIKHEF (Netherlands). First, the klystron vacuum system, beam transport system, diode pump and a triode pump are described. Next, the isolation valve and the fast valves of the vacuum system are considered. Measuring instruments, vacuum system commands and messages of failures are treated in the last chapter. (G.J.P.)

  7. Vacuum system for ISABELLE

    International Nuclear Information System (INIS)

    Hobson, J.P.

    1975-01-01

    An analysis is presented of the proposed vacuum system for the planned ISABELLE storage rings with respect to acceptability and practicality from the vacuum viewport. A comparison is made between the proposed vacuum system and the vacuum system at the CERN ISR, and some comments on various design and operational parameters are made

  8. Innovative Design of Solar-Powered Desalination (SPD System using Vacuum-Multi Effect Membrane Distillation (V-MEMD Process

    Directory of Open Access Journals (Sweden)

    Chafidz Achmad

    2018-01-01

    Full Text Available This research focused on the development of an innovative design of solar-powered desalination (SPD system which was expected to solve the water and energy problem simultaneously. We have developed a portable and hybrid solar-powered desalination (SPD system for producing potable water from saline water. It is a self-contained and integrated system which combines solar-thermal collector and solar-photovoltaic for its operation, and thus the system can operate to produce water by only using solar energy. Therefore, the system is highly suitable to be implemented in remote arid and coastal areas without infrastructures or connection to the grid (water and power, but blessed with abundant solar irradiation, like in Saudi Arabia. A Memsys Vacuum Multi-Effect Membrane Distillation (V-MEMD unit was used as the core of the SPD system. A heat pump was also integrated into the SPD system for energy recovery and to improve the performance of the system. The system could be considered as sustainable and “green” desalination technology, which will be very useful for the Kingdom of Saudi Arabia. To study the performance of the system, small-scale tests have been carried out at the Engineering College - King Saud University, Saudi Arabia. Based on the experimental results, the system has run successfully by only utilizing solar energy.

  9. 2D particle-in-cell simulation of the entire process of surface flashover on insulator in vacuum

    Science.gov (United States)

    Wang, Hongguang; Zhang, Jianwei; Li, Yongdong; Lin, Shu; Zhong, Pengfeng; Liu, Chunliang

    2018-04-01

    With the introduction of an external circuit model and a gas desorption model, the surface flashover on the plane insulator-vacuum interface perpendicular to parallel electrodes is simulated by a Particle-In-Cell method. It can be seen from simulations that when the secondary electron emission avalanche (SEEA) occurs, the current sharply increases because of the influence of the insulator surface charge on the cathode field emission. With the introduction of the gas desorption model, the current keeps on increasing after SEEA, and then the feedback of the external circuit causes the voltage between the two electrodes to decrease. The cathode emission current decreases, while the anode current keeps growing. With the definition that flashover occurs when the diode voltage drops by more than 20%, we obtained the simulated flashover voltage which agrees with the experimental value with the use of the field enhancement factor β = 145 and the gas molecule desorption coefficient γ=0.25 . From the simulation results, we can also see that the time delay of flashover decreases exponentially with voltage. In addition, from the gas desorption model, the gas density on the insulator surface is found to be proportional to the square of the gas desorption rate and linear with time.

  10. Decomposition studies of no-clean solder flux systems in connection with corrosion reliability of electronics

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Verdingovas, Vadimas

    2013-01-01

    with specific soldering process and parameters, while most important factors are the flux chemistry and its decomposition characteristics. Active parts of the flux residue can cause increased water absorption due to their hygroscopic nature and in solution they will increase leakage current and corrosion...... the contaminated PCBA parts to varying humidity and measuring the resulting leakage current. Results revealed a significant influence of flux chemistry including the amount of WOAs, while aggressiveness of the residue seems to vary with content and type of WOAs, and their nature of decomposition....

  11. In situ TEM observation of microcrack nucleation and propagation in pure tin solder

    International Nuclear Information System (INIS)

    Ding Ying; Wang Chunqing; Li, Mingyu; Wang Weiqiang

    2006-01-01

    Microcrack nucleation and propagation behavior in pure tin solder was investigated by using transmission electron microscopy (TEM) through in situ tensile test. Observation results showed that fracture process was completed in this visco-plastic material by connecting discontinuous cracks or voids. Depending on remarkable vacancy diffusion ability, microvoids were nucleated and developed in the dislocation free zone (DFZ) or super thinned area ahead of crack tip under local high stress concentration. The cracks were linked with each other by mutual dislocation emission which expedites the propagation of crack tips effectively

  12. TORE SUPRA vacuum vessel and shield manufacturing

    International Nuclear Information System (INIS)

    Blateyron, J.; Lepez, R.

    1984-01-01

    TORE SUPRA vacuum vessel and vacuum chamber shield manufacturing in progress at Jeumont-Schneider consists of three main phases: - Detail engineering and manufacturing fixture construction; - Prototype section manufacturing and process preparation; - Construction of the 6 production modules. The welding techniques adopted, call for three special automatic processes: TIG, MIG and PLASMA welding which guarantee mechanical strength, vacuum tightness and absence of distortion. Production of the modules began July 1984. (author)

  13. Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

    Energy Technology Data Exchange (ETDEWEB)

    Lucas, J.P.; Guo, F.; McDougall, J.; Bieler, T.R.; Subramanian, K.N.; Park, J.K.

    1999-11-01

    Creep deformation behavior was measured for 60--100 {micro}m thick solder joints. The solder joints investigated consisted of: (1) non-composite solder joints made with eutectic Sn-Ag solder, and (2) composite solder joints with eutectic Sn-Ag solder containing 20 vol.%, 5 {micro}m diameter in-situ Cu{sub 6}Sn{sub 5} intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.

  14. High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

    DEFF Research Database (Denmark)

    High-temperature solders have been widely used as joining materials to provide stable interconnections that resist a severe thermal environment and also to facilitate the drive for miniaturization. High-lead containing solders have been commonly used as high-temperature solders. The development...... of high-temperature lead-free solders has become an important issue for both the electronics and automobile industries because of the health and environmental concerns associated with lead usage. Unfortunately, limited choices are available as high-temperature lead-free solders. This work outlines...... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

  15. Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xia Yanghua [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)], E-mail: xia_yanghua@hotmail.com; Xie Xiaoming [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)

    2008-04-24

    The reliability of lead-free electronic assemblies under thermal cycling was investigated. Thin small outline package (TSOP) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) were studied. The results show that OSP finish reveals better performance than its ENIG counterparts. The crack originates at the fringe of heel fillet in both cases. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface. When the OSP finishes are employed, many Cu6Sn5 precipitates form inside the bulk solder and have a strengthening effect on the solder joint, resulting in better reliability performance as compared to those with ENIG finishes.

  16. In situ investigation of SnAgCu solder alloy microstructure

    International Nuclear Information System (INIS)

    Pietrikova, Alena; Bednarcik, Jozef; Durisin, Juraj

    2011-01-01

    Research highlights: → In situ X-ray diffraction investigation enabled detailed analysis of the melting and solidification process of the SAC305 alloy. → It was found that the SAC305 solder melts at 230 deg. C. When cooling from 240 deg. C the SAC305 alloy solidifies at the temperature of 214 deg. C. During solidification β-Sn and Cu 6 Sn 5 is also formed. Formation of Ag 3 Sn occurs at 206 deg. C and the remaining amount of alloy crystallizes approximately at 160 deg. C. → Furthermore, observation of the thermal expansion behaviour of the β-Sn tetragonal unit cell revealed linear dependence of the unit cell volume on temperature. The unit cell parameters a and c also increase linearly with the temperature. Despite the fact that the c parameter is substantially smaller than parameter a, it exhibits a significantly higher linear thermal expansion coefficient. Comparison between data obtained during heating and cooling indicates that the thermal expansion coefficient is slightly greater in the case of cooling. - Abstract: In situ X-ray diffraction experiments, using synchrotron radiation, were employed to analyze microstructure evolution of the 96.5Sn3Ag0.5Cu (wt.%)-SAC305 lead-free solder alloy during heating (30-240 deg. C), isothermal dwell (240 deg. C) and cooling (240-30 deg. C). The special emphasis was placed on the study of the melting and solidification processes, explaining formation, distribution and the order of crystallization of the crystal phases (β-Sn, intermetallic compounds) in the solder alloy. Furthermore, thermal expansion behaviour of the main constituent phase β-Sn was analyzed prior to melting and after the consequent solidification.

  17. Development of vacuum brazing furnace

    International Nuclear Information System (INIS)

    Singh, Rajvir; Yedle, Kamlesh; Jain, A.K.

    2005-01-01

    In joining of components where welding process is not possible brazing processes are employed. Value added components, high quality RF systems, UHV components of high energy accelerators, carbide tools etc. are produced using different types of brazing methods. Furnace brazing under vacuum atmosphere is the most popular and well accepted method for production of the above mentioned components and systems. For carrying out vacuum brazing successfully it is essential to have a vacuum brazing furnace with latest features of modern vacuum brazing technology. A vacuum brazing furnace has been developed and installed for carrying out brazing of components of copper, stainless steel and components made of dissimilar metals/materials. The above furnace has been designed to accommodate jobs of 700mm diameter x 2000mm long sizes with job weight of 500kgs up to a maximum temperature of 1250 degC at a vacuum of 5 x 10 -5 Torr. Oil diffusion pumping system with a combination of rotary and mechanical booster pump have been employed for obtaining vacuum. Molybdenum heating elements, radiation shield of molybdenum and Stainless Steel Grade 304 have been used. The above furnace is computer controlled with manual over ride facility. PLC and Pentium PC are integrated together to maneuver steps of operation and safety interlocks of the system. Closed loop water supply provides cooling to the system. The installation of the above system is in final stage of completion and it will be ready for use in next few months time. This paper presents insights of design and fabrication of a modern vacuum brazing furnace and its sub-system. (author)

  18. Vacuum arc behavior and its voltage characteristics in drawing process controlled by composite magnetic fields along axial and transverse directions

    International Nuclear Information System (INIS)

    Wang, Lijun; Deng, Jie; Wang, Haijing; Jia, Shenli; Qin, Kang; Shi, Zongqian

    2015-01-01

    In this research, drawing vacuum arc (VA) experiments were conducted using composite contacts under currents ranging from 5 kA to 20 kA root mean square (rms). The new type of contact comprised an axial magnetic field (AMF) configuration and a transverse magnetic field (TMF) configuration. The TMF plate was in the center, surrounded by the AMF plate. The contact generated both AMFs and TMFs simultaneously. VA appearances and arc voltages were recorded, and the VA was modeled as a conductor for electromagnetic force analysis in ANSYS software. The results showed that the coaxiality of operating mechanisms significantly influenced arc behavior just as the arc was ignited. When arc brightness did not increase after ignition, there was a voltage drop accompanied with diffusion of the VA. As to VA development, when an arc was ignited on an AMF plate, it spread on the plate and rotated. Over time the arc current increased, the constricting arc forms, and the arc column rotated on the TMF plate under the action of Ampere's force. With regard to the influence of a magnetic field on a VA at different stages, in the initial drawing arc stage the TMF was dominant, and the arc started to rotate under the action of Ampere's force. Afterwards, the AMF was dominant, with a steadily burning arc. As for contact melting, in the initial arcing period, a contracted short arc caused severe melting and erosion of the contact plate. When the ignition spot or root was close to the slot of plate, the electromagnetic force pushed the arc toward slot and contact edge, resulting in local erosion of the slot region

  19. A Comparison of the Properties of Carbon Fiber Epoxy Composites Produced by Non-autoclave with Vacuum Bag Only Prepreg and Autoclave Process

    Science.gov (United States)

    Park, Sang Yoon; Choi, Chi Hoon; Choi, Won Jong; Hwang, Seong Soon

    2018-05-01

    The non-autoclave curing technique with vacuum bag only (VBO) prepreg has been conceived as a cost-effective manufacturing method for producing high-quality composite part. This study demonstrated the feasibility of improving composite part's performances and established the effective mitigation strategies for manufacturing induced defects, such as internal voids and surface porosity. The experimental results highlighted the fact that voids and surface porosity were clearly dependent on the resin viscosity state at an intermediate dwell stage of the curing process. Thereafter, the enhancement of resin flow could lead to achieving high quality parts with minimal void content (1.3%) and high fiber fraction (53 vol.%). The mechanical testing showed comparable in-plane shear and compressive strength to conventional autoclave. The microscopic observations also supported the evidence of improved interfacial bonding in terms of excellent fiber wet-out and minimal void content for the optimized cure cycle condition.

  20. Horizon shells and BMS-like soldering transformations

    Energy Technology Data Exchange (ETDEWEB)

    Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)

    2016-03-07

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  1. Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints

    International Nuclear Information System (INIS)

    Liu, X.W.; Plumbridge, W.J.

    2003-01-01

    The fatigue of Sn-37 wt.% Pb model solder joints has been investigated under thermomechanical and thermal cycling. Based upon an analysis of displacements during thermomechancial cycling, a model solder joint has been designed to simulate actual joints in electronic packages. The strain-stress relationship, characterised by hysteresis loops, was determined during cycling from 30 to 125 deg. C, and the stress-range monitored throughout. The number of cycles to failure, as defined by the fall in stress range, was correlated to strain range and strain energy. The strain hardening exponent, k, varied with the definition of failure and, when a stress-range drop of 50% was used, it was 0.46. Cracks were produced during pure thermal cycling without external strains applied. These arose due to the local strains caused by thermal expansion mismatches between the solder and Cu 6 Sn 5 intermetallic layer, between the phases of solder, and due to the anisotropy of the materials. The fatigue life under thermomechanical cycling was significantly inferior to that obtained in isothermal mechanical cycling. A factor contributing to this inferiority is the internal damage produced during temperature cycling

  2. Effects of PCB thickness on adjustable fountain wave soldering

    Indian Academy of Sciences (India)

    hybrid circuit assembly, component lead tinning, and wire tinning. .... The mesh model was built and optimized with 599920 hybrid nodes as shown in figure 9. ... conducted to track the fluid motions of the two phases (i.e., molten solder and air).

  3. A low feed-through 3D vacuum packaging technique with silicon vias for RF MEMS resonators

    Science.gov (United States)

    Zhao, Jicong; Yuan, Quan; Kan, Xiao; Yang, Jinling; Yang, Fuhua

    2017-01-01

    This paper presents a wafer-level three-dimensional (3D) vacuum packaging technique for radio frequency microelectromechanical systems (RF MEMS) resonators. A Sn-rich Au-Sn solder bonding is employed to provide a vacuum encapsulation as well as electrical conductions. Vertical silicon vias are micro-fabricated by glass reflow process. The optimized grounding, via pitch, and all-round shielding effectively reduce feed-through capacitance. Thus the signal-to-background ratios (SBRs) of the transmission signals increase from 17 dB to 20 dB, and the quality factor (Q) values of the packaged resonators go from around 8000 up to more than 9500. The measured average leak rate and shear strength are (2.55  ±  0.9)  ×  10-8 atm-cc s-1 and 42.53  ±  4.19 MPa, respectively. Furthermore, thermal cycling test between  -40 °C and 100 °C and high temperature storage test at 150 °C show that the resonant-frequency drifts are less than  ±7 ppm. In addition, the SBRs and the Q values have no obvious change after the tests. The experimental results demonstrated that the proposed encapsulation technique is well suited for the applications of RF MEMS devices.

  4. Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints

    Science.gov (United States)

    Mukherjee, S.; Chauhan, P.; Osterman, M.; Dasgupta, A.; Pecht, M.

    2016-07-01

    Mechanistic microstructural models have been developed to capture the effect of isothermal aging on time dependent viscoplastic response of Sn3.0Ag0.5Cu (SAC305) solders. SnAgCu (SAC) solders undergo continuous microstructural coarsening during both storage and service because of their high homologous temperature. The microstructures of these low melting point alloys continuously evolve during service. This results in evolution of creep properties of the joint over time, thereby influencing the long term reliability of microelectronic packages. It is well documented that isothermal aging degrades the creep resistance of SAC solder. SAC305 alloy is aged for (24-1000) h at (25-100)°C (~0.6-0.8 × T melt). Cross-sectioning and image processing techniques were used to periodically quantify the effect of isothermal aging on phase coarsening and evolution. The parameters monitored during isothermal aging include size, area fraction, and inter-particle spacing of nanoscale Ag3Sn intermetallic compounds (IMCs) and the volume fraction of micronscale Cu6Sn5 IMCs, as well as the area fraction of pure tin dendrites. Effects of microstructural evolution on secondary creep constitutive response of SAC305 solder joints were then modeled using a mechanistic multiscale creep model. The mechanistic phenomena modeled include: (1) dispersion strengthening by coarsened nanoscale Ag3Sn IMCs in the eutectic phase; and (2) load sharing between pro-eutectic Sn dendrites and the surrounding coarsened eutectic Sn-Ag phase and microscale Cu6Sn5 IMCs. The coarse-grained polycrystalline Sn microstructure in SAC305 solder was not captured in the above model because isothermal aging does not cause any significant change in the initial grain size and orientation of SAC305 solder joints. The above mechanistic model can successfully capture the drop in creep resistance due to the influence of isothermal aging on SAC305 single crystals. Contribution of grain boundary sliding to the creep strain of

  5. Vacuum technology in the chemical industry

    CERN Document Server

    Jorisch, Wolfgang

    2015-01-01

    Based on the very successful German edition and a seminar held by the German Engineers` Association (VDI) on a regular basis for years now, this English edition has been thoroughly updated and revised to reflect the latest developments. It supplies in particular the special aspects of vacuum technology, applied vacuum pump types and vacuum engineering in the chemical, pharmaceutical and process industry application-segments. The text includes chapters dedicated to latest European regulations for operating in hazardous zones with vacuum systems, methods for process pressure control and regulati

  6. Aging effects on the microstructure, surface characteristics and wettability of Cu pretinned with Sn-Pb solders

    Energy Technology Data Exchange (ETDEWEB)

    Linch, Heidi Sue [Univ. of California, Berkeley, CA (United States)

    1993-11-01

    This study investigates effects of aging in air and argon at 170 C on Cu coupons which were pretinned with 75Sn-25Pb, 8Sn-92Pb, and 5Sn-95Pb solders. Coatings were applied using electroplating or hot dipping techniques. The coating thickness was controlled between 3 to 3μm and the specimens were aged for 0 hours, 2 hours, 24 hours and 2 weeks. Wetting balance tests were used to evaluate the wettability of the test specimens. Microstructural development was evaluated using X-ray diffraction, energy dispersive X-ray and Auger spectroscopy, as well as optical and scanning electron microscopy. The wetting behavior of the test specimens is interpreted with respect to observed microstructural changes and as a function of aging time, solder composition, and processing conditions.

  7. The Validation of Vapor Phase Hydrogen Peroxide Microbial Reduction for Planetary Protection and a Proposed Vacuum Process Specification

    Science.gov (United States)

    Chung, Shirley; Barengoltz, Jack; Kern, Roger; Koukol, Robert; Cash, Howard

    2006-01-01

    The Jet Propulsion Laboratory, in conjunction with the NASA Planetary Protection Officer, has selected the vapor phase hydrogen peroxide sterilization process for continued development as a NASA approved sterilization technique for spacecraft subsystems and systems. The goal is to include this technique, with an appropriate specification, in NPR 8020.12C as a low temperature complementary technique to the dry heat sterilization process.To meet microbial reduction requirements for all Mars in-situ life detection and sample return missions, various planetary spacecraft subsystems will have to be exposed to a qualified sterilization process. This process could be the elevated temperature dry heat sterilization process (115 C for 40 hours) which was used to sterilize the Viking lander spacecraft. However, with utilization of such elements as highly sophisticated electronics and sensors in modern spacecraft, this process presents significant materials challenges and is thus an undesirable bioburden reduction method to design engineers. The objective of this work is to introduce vapor hydrogen peroxide (VHP) as an alternative to dry heat microbial reduction to meet planetary protection requirements.The VHP process is widely used by the medical industry to sterilize surgical instruments and biomedical devices, but high doses of VHP may degrade the performance of flight hardware, or compromise material properties. Our goal for this study was to determine the minimum VHP process conditions to achieve microbial reduction levels acceptable for planetary protection.

  8. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Directory of Open Access Journals (Sweden)

    Yee Mei Leong

    2016-06-01

    Full Text Available Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag content solder SAC105 (Sn-1.0Ag-0.5Cu because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al addition (0.1–0.5 wt.% to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

  9. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Science.gov (United States)

    Leong, Yee Mei; Haseeb, A.S.M.A.

    2016-01-01

    Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

  10. Progress in vacuum metal extraction, refining and consolidation

    International Nuclear Information System (INIS)

    Sundaram, C.V.; Mukherjee, T.K.; Sharma, B.P.

    1973-01-01

    The unique achievements in the process metallurgy of rare metals in the past quarter century should largely be attributed to advances in vacuum technology. New standards for high purity, increasing demand for pure metals and alloys for established applications, and steady improvement in sophistication and capacity of vacuum furnaces have provided the stimulus for developing and expanding vacuum metal extraction processes, and also exploring totally new processes. The paper discusses the thermochemistry of vacuum metallurgy, carbothermic and metallothermic reduction reactions, consolidation and refining by vacuum arc melting, electron beam melting and high temperature high vacuum sintering, and ultrapurification, with special reference to the reactive and refractory metals of Group IV to VI. (author)

  11. Meat Processing Plant Microbiome and Contamination Patterns of Cold-Tolerant Bacteria Causing Food Safety and Spoilage Risks in the Manufacture of Vacuum-Packaged Cooked Sausages.

    Science.gov (United States)

    Hultman, Jenni; Rahkila, Riitta; Ali, Javeria; Rousu, Juho; Björkroth, K Johanna

    2015-10-01

    Refrigerated food processing facilities are specific man-made niches likely to harbor cold-tolerant bacteria. To characterize this type of microbiota and study the link between processing plant and product microbiomes, we followed and compared microbiota associated with the raw materials and processing stages of a vacuum-packaged, cooked sausage product affected by a prolonged quality fluctuation with occasional spoilage manifestations during shelf life. A total of 195 samples were subjected to culturing and amplicon sequence analyses. Abundant mesophilic psychrotrophs were detected within the microbiomes throughout the different compartments of the production plant environment. However, each of the main genera of food safety and quality interest, e.g., Leuconostoc, Brochothrix, and Yersinia, had their own characteristic patterns of contamination. Bacteria from the genus Leuconostoc, commonly causing spoilage of cold-stored, modified-atmosphere-packaged foods, were detected in high abundance (up to >98%) in the sausages studied. The same operational taxonomic units (OTUs) were, however, detected in lower abundances in raw meat and emulsion (average relative abundance of 2%±5%), as well as on the processing plant surfaces (food safety concerns related to their resilient existence on surfaces. Copyright © 2015, American Society for Microbiology. All Rights Reserved.

  12. Change in the color of heat-treated, vacuum-packed broccoli stems and florets during storage: effects of process conditions and modeling by an artificial neural network.

    Science.gov (United States)

    Pero, Milad; Askari, Gholamreza; Skåra, Torstein; Skipnes, Dagbjørn; Kiani, Hossein

    2018-02-08

    Vacuum-packed broccoli stems and florets were subjected to heat treatment (60-99 °C) for various time intervals. The activity of peroxidase was measured after processing. Thermally processed samples were then stored at 4 °C for 35 days, and the color of the samples was measured every 7 days. Effects of parameters (heating temperature and duration, storage time) on the color of broccoli were modeled and simulated by an artificial neural network (ANN). Simulations confirmed that stems were predicted to be more prone to changes than florets. More color loss was observed with longer processing or storage combinations. The simulations also confirmed that higher temperatures during heat processing could retard color changes during storage. For stems treated at 80 °C for short durations, color loss was more predominant than both 65 and 99 °C, probably due to the incomplete inactivation of enzymes besides more tissue damage, with increased enzyme access to the substrate. The greenness of both stems and florets during storage can be better preserved at higher temperatures (99 °C) and short times. The simulation results revealed that the ANN method could be used as an effective tool for predicting and analyzing the color values of heat-treated broccoli. © 2018 Society of Chemical Industry. © 2018 Society of Chemical Industry.

  13. Effects of soldering methods on tensile strength of a gold-palladium metal ceramic alloy.

    Science.gov (United States)

    Ghadhanfari, Husain A; Khajah, Hasan M; Monaco, Edward A; Kim, Hyeongil

    2014-10-01

    The tensile strength obtained by conventional postceramic application soldering and laser postceramic welding may require more energy than microwave postceramic soldering, which could provide similar tensile strength values. The purpose of the study was to compare the tensile strength obtained by microwave postceramic soldering, conventional postceramic soldering, and laser postceramic welding. A gold-palladium metal ceramic alloy and gold-based solder were used in this study. Twenty-seven wax specimens were cast in gold-palladium noble metal and divided into 4 groups: laser welding with a specific postfiller noble metal, microwave soldering with a postceramic solder, conventional soldering with the same postceramic solder used in the microwave soldering group, and a nonsectioned control group. All the specimens were heat treated to simulate a normal porcelain sintering sequence. An Instron Universal Testing Machine was used to measure the tensile strength for the 4 groups. The means were analyzed statistically with 1-way ANOVA. The surface and fracture sites of the specimens were subjectively evaluated for fracture type and porosities by using a scanning electron microscope. The mean (standard deviation) ultimate tensile strength values were as follows: nonsectioned control 818 ±30 MPa, microwave 516 ±34 MPa, conventional 454 ±37 MPa, and laser weld 191 ±39 MPa. A 1-way ANOVA showed a significant difference in ultimate tensile strength among the groups (F3,23=334.5; Ptensile strength for gold and palladium noble metals than either conventional soldering or laser welding. Conventional soldering resulted in a higher tensile strength than laser welding. Under the experimental conditions described, either microwave or conventional postceramic soldering would appear to satisfy clinical requirements related to tensile strength. Copyright © 2014 Editorial Council for the Journal of Prosthetic Dentistry. Published by Elsevier Inc. All rights reserved.

  14. Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

    Science.gov (United States)

    Haseeb, A. S. M. A.; Arafat, M. M.; Tay, S. L.; Leong, Y. M.

    2017-10-01

    Tin (Sn)-based solders have established themselves as the main alternative to the traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn-based solders continues to be a concern. In order to make Sn-based solders microstructurally more stable and hence more reliable, researchers are showing great interest in investigating the effects of the incorporation of different nanoparticles into them. This paper gives an overview of the influence of metallic nanoparticles on the characteristics of interfacial intermetallic compounds (IMCs) in Sn-based solder joints on copper substrates during reflow and thermal aging. Nanocomposite solders were prepared by mechanically blending nanoparticles of nickel (Ni), cobalt (Co), zinc (Zn), molybdenum (Mo), manganese (Mn) and titanium (Ti) with Sn-3.8Ag-0.7Cu and Sn-3.5Ag solder pastes. The composite solders were then reflowed and their wetting characteristics and interfacial microstructural evolution were investigated. Through the paste mixing route, Ni, Co, Zn and Mo nanoparticles alter the morphology and thickness of the IMCs in beneficial ways for the performance of solder joints. The thickness of Cu3Sn IMC is decreased with the addition of Ni, Co and Zn nanoparticles. The thickness of total IMC layer is decreased with the addition of Zn and Mo nanoparticles in the solder. The metallic nanoparticles can be divided into two groups. Ni, Co, and Zn nanoparticles undergo reactive dissolution during solder reflow, causing in situ alloying and therefore offering an alternative route of alloy additions to solders. Mo nanoparticles remain intact during reflow and impart their influence as discrete particles. Mechanisms of interactions between different types of metallic nanoparticles and solder are discussed.

  15. Effect of meat ingredients (sodium nitrite and erythorbate) and processing (vacuum storage and packaging atmosphere) on germination and outgrowth of Clostridium perfringens spores in ham during abusive cooling.

    Science.gov (United States)

    Redondo-Solano, Mauricio; Valenzuela-Martinez, Carol; Cassada, David A; Snow, Daniel D; Juneja, Vijay K; Burson, Dennis E; Thippareddi, Harshavardhan

    2013-09-01

    The effect of nitrite and erythorbate on Clostridium perfringens spore germination and outgrowth in ham during abusive cooling (15 h) was evaluated. Ham was formulated with ground pork, NaNO2 (0, 50, 100, 150 or 200 ppm) and sodium erythorbate (0 or 547 ppm). Ten grams of meat (stored at 5 °C for 3 or 24 h after preparation) were transferred to a vacuum bag and inoculated with a three-strain C. perfringens spore cocktail to obtain an inoculum of ca. 2.5 log spores/g. The bags were vacuum-sealed, and the meat was heat treated (75 °C, 20 min) and cooled within 15 h from 54.4 to 7.2 °C. Residual nitrite was determined before and after heat treatment using ion chromatography with colorimetric detection. Cooling of ham (control) stored for 3 and 24 h, resulted in C. perfringens population increases of 1.46 and 4.20 log CFU/g, respectively. For samples that contained low NaNO2 concentrations and were stored for 3 h, C. perfringens populations of 5.22 and 2.83 log CFU/g were observed with or without sodium erythorbate, respectively. Residual nitrite was stable (p > 0.05) for both storage times. Meat processing ingredients (sodium nitrite and sodium erythorbate) and their concentrations, and storage time subsequent to preparation of meat (oxygen content) affect C. perfringens spore germination and outgrowth during abusive cooling of ham. Copyright © 2013 Elsevier Ltd. All rights reserved.

  16. Economical surface treatment of die casting dies to prevent soldering in high pressure casting

    International Nuclear Information System (INIS)

    Fraser, D.T.; Jahedi, M.Z.

    2001-01-01

    This paper describes the use of a gas oxidation treatment of H13 tool steel to develop a compact iron oxide layer at the surface of core pins to prevent soldering in high pressure die casting. The performance of oxide layers in the protection of die steel against soldering during high pressure die casting was tested in a specially designed die using removable core pins and Al-11 Si-3 Cu casting alloy. The gas oxidation treatment can be applied at low temperatures and to large areas of the die surface. In addition this process is very cost effective compared to other coating processes such as physical vapour deposition (PVD), or thermo-reactive diffusion (TRD) coatings. This work demonstrated that surface treatment producing pure magnetite (Fe 3 O 4 ) layers are more protective than oxide layers containing a combination of Fe 3 O 4 (magnetite) and Fe 3 O 3 (haematite). The magnetite layer acts as a barrier between the die steel/casting alloy interface and prevents the formation of inter-metallic phases. Optical microscopy and scanning electron microscope were used to determine the thickness of the oxide layer, while X-ray diffraction was performed to determine the oxide phase structure

  17. Vacuum-assisted delivery

    Science.gov (United States)

    ... medlineplus.gov/ency/patientinstructions/000514.htm Vacuum-assisted delivery To use the sharing features on this page, ... through the birth canal. When is Vacuum-assisted Delivery Needed? Even after your cervix is fully dilated ( ...

  18. Surface quality and microstructure of low-vacuum sintered orthodontic bracket 17-4 PH stainless steel fabricated by MIM process

    Science.gov (United States)

    Suharno, Bambang; Suharno, Lingga Pradinda; Saputro, Hantoro Restucondro; Irawan, Bambang; Prasetyadi, Tjokro; Ferdian, Deni; Supriyadi, Sugeng

    2018-02-01

    Surface roughness and microstructure play important role on orthodontic bracket quality. Therefore, orthodontic brackets need to have smooth surface roughness to reduce the friction and bacterial adhesion. Microstructure of orthodontic brackets also determine the mechanical properties and corrosion resistance. There are two methods to produce orthodontic bracket, investment casting and metal injection molding. The purpose of this study is to observe the surface roughness and microstructure of orthodontic bracket which were made from two different fabrication methods. To produce orthodontic bracket with metal injection molding method, 17-4 PH stainless steel feedstock was injected to the orthodontic bracket mold using injection molding machine. After injection, the binder was eliminated with solvent and thermal debinding. Solvent debinding process was conducted with hexane at 50 °C on magnetic stirrer for 1.5 hours. Thermal debinding process was conducted at 510 °C with 0.5 °C/min heat rate and 120 min holding time. Hereafter, sintering process were performed with vacuum tube furnace at 1360 °C with heat rate 5 °C/min and 90 min holding time in low vacuum atmosphere. To produce orthodontic bracket with investment casting method, the wax was injected into the mold then the wax pattern was arranged into the tree form. The tree form was then dipped into ceramic slurry and allowed to harden, the ceramic slurry has a thickness in the region of 10 mm. The ceramic mold was then heated at a temperature of over than 1100°C to strengthen the ceramic mold and to remove the remaining wax. After that, the molten 17-4 PH stainless steel was poured into the ceramic mold at a temperature of over 1600°C. The natural cooling process was carried out at temperature of 25°C, after which the ceramic mold was broken away. Then, the orthodontic bracket was cut from the tree form. The results show that the orthodontic bracket which were made with investment casting fabrication

  19. Simulation of the Processes of Formation of a Dust Cloud in a Vacuum and in the Absence of Gravitation

    Science.gov (United States)

    Avdeev, A. V.; Boreisho, A. S.; Ivakin, S. V.; Moiseev, A. A.; Savin, A. V.; Sokolov, E. I.; Smirnov, P. G.

    2018-01-01

    This article is devoted to the simulation of the processes of formation of dust clouds in the absence of gravitation, which is necessary for understanding the processes proceeding in dust clusters in outer space, upper planetary atmosphere, and on the surface of space objects, as well as for evaluating the possibilities of creating disperse structures with given properties. The chief aim of the simulation is to determine the general laws of the dynamics of the dust cloud at the initial stage of its formation. With the use of the original approach based on the particle-in-cell method that permits investigating the mechanics of large ensembles of particles on contemporary computational platforms, we consider the mechanics of a dusty medium in the process of its excitation in a closed container due to the vibration of the walls, and then in the process of particle scattering when the container opens in outer space. The main formation mechanisms of a dust formation have been elucidated, and the possibilities of mathematical simulation for predicting spatial and time characteristics of disperse structures have been shown.

  20. Electrochemical Behavior of Sn-9Zn- xTi Lead-Free Solders in Neutral 0.5M NaCl Solution

    Science.gov (United States)

    Wang, Zhenghong; Chen, Chuantong; Jiu, Jinting; Nagao, Shijo; Nogi, Masaya; Koga, Hirotaka; Zhang, Hao; Zhang, Gong; Suganuma, Katsuaki

    2018-05-01

    Electrochemical techniques were employed to study the electrochemical corrosion behavior of Sn-9Zn- xTi ( x = 0, 0.05, 0.1, 0.2 wt.%) lead-free solders in neutral 0.5M NaCl solution, aiming to figure out the effect of Ti content on the corrosion properties of Sn-9Zn, providing information for the composition design of Sn-Zn-based lead-free solders from the perspective of corrosion. EIS results reveal that Ti addition was involved in the corrosion product layer and changed electrochemical interface behavior from charge transfer control process to diffusion control process. The trace amount of Ti addition (0.05 wt.%) can refine the microstructure and improve the corrosion resistance of Sn-9Zn solder, evidenced by much lower corrosion current density ( i corr) and much higher total resistance ( R t). Excess Ti addition (over 0.1 wt.%) led to the formation of Ti-containing IMCs, which were confirmed as Sn3Ti2 and Sn5Ti6, deteriorating the corrosion resistance of Sn-9Zn- xTi solders. The main corrosion products were confirmed as Sn3O(OH)2Cl2 mixed with small amount of chlorine/oxide Sn compounds.

  1. Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

    Directory of Open Access Journals (Sweden)

    Jinhua Mi

    2014-01-01

    Full Text Available Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated. The type-I interval censored lifetime data were collected from a thermal cycling test, which was implemented on microelectronic packaging with lead-free ball grid array (BGA and fine-pitch ball grid array (FBGA interconnection structures. The number of cycles to failure of lead-free solder joints is predicted by using a modified Engelmaier fatigue life model and a type-I censored data processing method. Then, the Pan model is employed to calculate the acceleration factor of this test. A comparison of life predictions between the proposed method and the ones calculated directly by Matlab and Minitab is conducted to demonstrate the practicability and effectiveness of the proposed method. At last, failure analysis and microstructure evolution of lead-free solders are carried out to provide useful guidance for the regular maintenance, replacement of substructure, and subsequent processing of electronic products.

  2. Dynamical effects of QCD vacuum structure

    International Nuclear Information System (INIS)

    Ferreira, Erasmo

    1994-01-01

    The role of the QCD vacuum structure in the determination of the properties of states and processes occurring in the confinement regime of QCD is reviewed. The finite range of the vacuum correlations is discussed, and an analytical form is suggested for the correlation functions. The role of the vacuum quantum numbers in the phenomenology of high-energy scattering is reviewed. The vacuum correlation model of non-perturbative QCD is mentioned as a bridge between the fundamental theory and the description of the experiments. (author). 13 refs., 1 fig

  3. Evacuation of the NET vacuum chamber

    International Nuclear Information System (INIS)

    Muller, R.A.

    1987-01-01

    Parametric calculations of the evacuation process were carried out for the NET-vacuum chamber involving two blanket designs. The results show that with an acceptable vacuum pumping capacity the required start vacuum conditions can be realized within reasonable time. The two blanket concepts do not differ remarkably in their evacuation behaviour. The remaining large pressure differences between the different locations of the vacuum chamber can be reduced if approximately 30% of the total gas flow is extracted from the heads of the blanket replacement ports

  4. Evacuation of the NET vacuum chamber

    International Nuclear Information System (INIS)

    Mueller, R.

    1986-01-01

    Parametric calculations of the evacuation process were carried out for the NET-vacuum chamber involving two blanket designs. The results show that with an acceptable vacuum pumping capacity the required start vacuum conditions can be realized within reasonable time. The two blanket concepts do not differ remarkably in their evacuation behaviour. The remaining large pressure differences between the different locations of the vacuum chamber can be reduced if approximately 30% of the total gas flow is extracted from the heads of the blanket replacement ports. (author)

  5. New Coating Technique of Ceramic Implants with Different Glass Solder Matrices for Improved Osseointegration-Mechanical Investigations.

    Science.gov (United States)

    Mick, Enrico; Markhoff, Jana; Mitrovic, Aurica; Jonitz, Anika; Bader, Rainer

    2013-09-11

    Ceramics are a very popular material in dental implant technology due to their tribological properties, their biocompatibility and their esthetic appearance. However, their natural surface structure lacks the ability of proper osseointegration, which constitutes a crucial process for the stability and, thus, the functionality of a bone implant. We investigated the application of a glass solder matrix in three configurations-consisting mainly of SiO₂, Al₂O₃, K₂O and Na₂O to TZP-A ceramic specimens. The corresponding adhesive strength and surface roughness of the coatings on ceramic specimens have been analyzed. Thereby, high adhesive strength (70.3 ± 7.9 MPa) was found for the three different coatings. The obtained roughness (R z ) amounted to 18.24 ± 2.48 µm in average, with significant differences between the glass solder configurations. Furthermore, one configuration was also tested after additional etching which did not lead to significant increase of surface roughness (19.37 ± 1.04 µm) or adhesive strength (57.2 ± 5.8 MPa). In conclusion, coating with glass solder matrix seems to be a promising surface modification technique that may enable direct insertion of ceramic implants in dental and orthopaedic surgery.

  6. New Coating Technique of Ceramic Implants with Different Glass Solder Matrices for Improved Osseointegration-Mechanical Investigations

    Directory of Open Access Journals (Sweden)

    Rainer Bader

    2013-09-01

    Full Text Available Ceramics are a very popular material in dental implant technology due to their tribological properties, their biocompatibility and their esthetic appearance. However, their natural surface structure lacks the ability of proper osseointegration, which constitutes a crucial process for the stability and, thus, the functionality of a bone implant. We investigated the application of a glass solder matrix in three configurations—consisting mainly of SiO2, Al2O3, K2O and Na2O to TZP-A ceramic specimens. The corresponding adhesive strength and surface roughness of the coatings on ceramic specimens have been analyzed. Thereby, high adhesive strength (70.3 ± 7.9 MPa was found for the three different coatings. The obtained roughness (Rz amounted to 18.24 ± 2.48 µm in average, with significant differences between the glass solder configurations. Furthermore, one configuration was also tested after additional etching which did not lead to significant increase of surface roughness (19.37 ± 1.04 µm or adhesive strength (57.2 ± 5.8 MPa. In conclusion, coating with glass solder matrix seems to be a promising surface modification technique that may enable direct insertion of ceramic implants in dental and orthopaedic surgery.

  7. Studies on Al-Cu-Li-Mg-Ag-Zr alloy processed through vacuum induction melting (VIM) technique

    International Nuclear Information System (INIS)

    Nayan, Niraj; Govind; Nair, K. Suseelan; Mittal, M.C.; Sudhakaran, K.N.

    2007-01-01

    A new technique of lithium addition has been adapted for the processing of Al-Cu-Li-Ag-Mg-Zr alloy, which gives more than 90% recovery of lithium throughout the billet. Processing studies on this alloy include casting, three step homogenization, to avoid incipient melting, and mechanical working particularly forging and rolling. The products in the form of sheets were subjected to various T6 (solution treatment + water quenching + aging) tempers. Mechanical properties were evaluated at room temperature and correlated with microstructure. Characterizations using optical microscope and post-fracture analysis have been carried out using Scanning electron microscope (SEM). Experimental investigation shows highest mechanical properties for the Al-1.3%Li alloy in T6 (500 deg. C/1 h + WQ + 190 deg. C/24 h) condition

  8. Process related contaminations causing climatic reliability issues

    DEFF Research Database (Denmark)

    Jellesen, Morten Stendahl; Dutta, Mondira; Verdingovas, Vadimas

    2012-01-01

    contaminants during the wave and re-flow soldering process; however variation in temperature on the PCBA surface during soldering can result in considerable amounts of active residues being left locally. Typical no-clean flux systems used today consist of weak organic acids (WOA) and active residues left...

  9. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    Science.gov (United States)

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

    2010-09-15

    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  10. Diffusion complex layers of TiC-Ni-Mo type produced on steel during vacuum titanizing process combined with the electrolytic deposition

    International Nuclear Information System (INIS)

    Kasprzycka, E.; Krolikowski, A.

    1999-01-01

    Diffusion carbide layers produced on steel surface by means of vacuum titanizing process have been studied. A new technological process combining a vacuum titanizing with an electrolytic deposition of Ni-Mo alloy has been proposed to increase of corrosion resistance of carbide layers. The effect of preliminary electrolytic deposition of Ni-Mo alloy on the NC10 steel surface on the titanized layer structure and its corrosion resistance has ben investigated. As a result, diffusion complex layers of TiC-Ni-Mo type on NC10 steel surface have been obtained. An X-ray structural analysis of titanized surfaces on NC10 steel precovered with an electrolytic Ni-Mo alloy coating (70%Ni+30%Mo) revealed a presence of titanium carbide TiC, NiTi, MoTi and trace quantity of austenite. The image of the TiC-Ni-Mo complex layer on NC10 steel surface obtained by means of joined SEM+TEM method and diagrams of elements distribution in the layer diffusion zone have been shown. Concentration of depth profiles of Ti, Ni, Mo, Cr and Fe in the layer diffusion zone obtained by means of the joined EDS+TEM method are shown. Concentration depth profiles of Ti, Ni, Mo, Cr and Fe in the layer diffusion zone obtained by means of the X r ay microanalysis and microhardness of the layer are shown. An X-ray structural analysis of titanized surfaces on the NC10 steel, without Ni-Mo alloy layer, revealed only a substantial presence of titanium carbide TiC. For corrosion resistance tests the steel samples with various diffusion layers and without layers were used: (i) the TiC-Ni-Mo titanized complex layers on NC10 steel, (ii) the TiC titanized carbide layers on the NC10 steel, (iii) the NC10 steel without layers. Corrosion measurements of sample under test have been performed in 0.1 M H 2 SO 4 by means of potentiodynamic polarization and electrochemical impedance tests. It has been found that the corrosion resistance of titanized steel samples with the TiC and TiC-Ni-Mo layers is higher than for the steel

  11. Solidification of refractory materials processed in the ultra high vacuum drop tube at the CEREM-Grenoble

    International Nuclear Information System (INIS)

    Vinet, B.; Cini, E.; Tournier, S.; Cortella, L.

    1994-01-01

    Undercooling experiments have been performed on refractory materials by processing in a high drop-tube. Emphasis is put on general aspects of surface and bulk microstructures of solidified droplets, including pure metals (W, Re, Ta, Mo, Nb, Ir, Zr) and alloys (W-Re, Mo-Re, Ta-Zr). It is shown that recrystallization often causes polycrystallinity. Moreover, the microstructure is closely related to undercooling amount prior solidification. The effect of secondary cooling on microstructure can also be studied by quenching the samples in solid tin at the end of free-fall. (authors). 20 refs., 11 figs

  12. Interfacial reaction of Sn-based solder joint in the package system

    Science.gov (United States)

    Gu, Huandi

    In this thesis, I report a study on the effect of the solder size on intermetallic layer formation by comparing the morphology change and growth rate of two different size solder joint aged at a same temperature for different aging time. The layer thickness and microstructure were analyzed using scanning electron microscopy (SEM). Photoshop was used to measure the thickness of intermetallic compound. Two different size of solder joints with composition of Sn-Ag-Cu (305) were used.

  13. A new method for soldering particle-reinforced aluminum metal matrix composites

    Energy Technology Data Exchange (ETDEWEB)

    Lu, Jinbin; Mu, Yunchao [Zhongyuan University of Technology, Zhengzhou 450007 (China); Luo, Xiangwei [Zhengzhou University, Zhengzhou 450002 (China); Niu, Jitai, E-mail: niujitai@163.com [Zhongyuan University of Technology, Zhengzhou 450007 (China)

    2012-12-01

    Highlights: Black-Right-Pointing-Pointer Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. Black-Right-Pointing-Pointer The nickel plating is required on the surface of the composites before soldering. Black-Right-Pointing-Pointer Low welding temperature is set to avoid overheating of the matrix. Black-Right-Pointing-Pointer Chemical and metallurgical bonding of composites and Kovar is carried out. Black-Right-Pointing-Pointer High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al-SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe-Ni-Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn-Cd-Ag-Cu) with a melting point of about 400 Degree-Sign C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)-Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al-SiC composite.

  14. A new method for soldering particle-reinforced aluminum metal matrix composites

    International Nuclear Information System (INIS)

    Lu, Jinbin; Mu, Yunchao; Luo, Xiangwei; Niu, Jitai

    2012-01-01

    Highlights: ► Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. ► The nickel plating is required on the surface of the composites before soldering. ► Low welding temperature is set to avoid overheating of the matrix. ► Chemical and metallurgical bonding of composites and Kovar is carried out. ► High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al–SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe–Ni–Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn–Cd–Ag–Cu) with a melting point of about 400 °C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)–Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al–SiC composite.

  15. Vacuum and ultravacuum physics and technology

    CERN Document Server

    Bello, Igor

    2018-01-01

    Vacuum technology has enormous impact on human life in many aspects and fields, such as metallurgy, material development and production, food and electronic industry, microelectronics, device fabrication, physics, materials science, space science, engineering, chemistry, technology of low temperature, pharmaceutical industry, and biology. All decorative coatings used in jewelries and various daily products—including shiny decorative papers, the surface finish of watches, and light fixtures—are made using vacuum technological processes. Vacuum analytical techniques and vacuum technologies are pillars of the technological processes, material synthesis, deposition, and material analyses—all of which are used in the development of novel materials, increasing the value of industrial products, controlling the technological processes, and ensuring the high product quality. Based on physical models and calculated examples, the book provides a deeper look inside the vacuum physics and technology.

  16. Coefficient of electrical transport vacuum arc for metals and alloys

    International Nuclear Information System (INIS)

    Markov, G.V.; Ehjzner, B.A.

    1998-01-01

    In this article the authors propose formulas for estimation coefficient of electrical transport vacuum arc for metals and alloys. They also represent results of analysis principal physical processes which take place in cathode spot vacuum arc

  17. Indian Vacuum Society: The Indian Vacuum Society

    Science.gov (United States)

    Saha, T. K.

    2008-03-01

    The Indian Vacuum Society (IVS) was established in 1970. It has over 800 members including many from Industry and R & D Institutions spread throughout India. The society has an active chapter at Kolkata. The society was formed with the main aim to promote, encourage and develop the growth of Vacuum Science, Techniques and Applications in India. In order to achieve this aim it has conducted a number of short term courses at graduate and technician levels on vacuum science and technology on topics ranging from low vacuum to ultrahigh vacuum So far it has conducted 39 such courses at different parts of the country and imparted training to more than 1200 persons in the field. Some of these courses were in-plant training courses conducted on the premises of the establishment and designed to take care of the special needs of the establishment. IVS also regularly conducts national and international seminars and symposia on vacuum science and technology with special emphasis on some theme related to applications of vacuum. A large number of delegates from all over India take part in the deliberations of such seminars and symposia and present their work. IVS also arranges technical visits to different industries and research institutes. The society also helped in the UNESCO sponsored post-graduate level courses in vacuum science, technology and applications conducted by Mumbai University. The society has also designed a certificate and diploma course for graduate level students studying vacuum science and technology and has submitted a syllabus to the academic council of the University of Mumbai for their approval, we hope that some colleges affiliated to the university will start this course from the coming academic year. IVS extended its support in standardizing many of the vacuum instruments and played a vital role in helping to set up a Regional Testing Centre along with BARC. As part of the development of vacuum education, the society arranges the participation of

  18. Quality Analysis of Welded and Soldered Joints of Cu-Nb Microcomposite Wires

    Directory of Open Access Journals (Sweden)

    Nikolaj VIŠNIAKOV

    2011-03-01

    Full Text Available Quality analysis of welded and soldered joints of Cu-Nb microcomposite wires has been performed. Quality and mechanical characteristics of joints as ultimate tensile stress limit and elongation at break were measured with an universal testing machine and controlled visually using an optical microscope. Two wires joints were soldered with silver and copper solders and put into steel and copper sleeve respectively. Another two wires joints were soldered with silver solder and welded without any reinforcement. Joints soldered with the silver solder and steel sleeve have demonstrated the best mechanical characteristics: ultimate tensile stress limit of 650 MPa and elongation at break of 0.85 %. Joints soldered with the copper sleeve have no advantages comparing with the soldered butt joint. Ultimate tensile stress limit and elongation at break were in 300 MPa - 350 MPa and in 0.35 % - 0.45 % ranges respectively. Two welded joints had ultimate tensile stress limit of 470 MPa and elongation at break of 0.71 %. In all joints the microstructure of Nb filaments was destroyed and mechanical properties have been specified by mechanical strength of copper and sleeve materials only.http://dx.doi.org/10.5755/j01.ms.17.1.242

  19. Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Kita, T; Mukaibo, N; Ando, K; Moriyama, M [Honda R and D Co. Ltd., Tokyo (Japan)

    1997-10-01

    Concerning the tin and lead eutectic solder, we have evaluated the reliability of three factors of intermetallic compound layer, creep and vibration which cause solder degradation. First, the stress factor was extracted from investigating the mechanism of degradation, and the best acceleration test method was fixed. Next, the acceleration test was executed to find the stress dependency and the tendency of solder degradation was modeled numerically. While the environmental stress frequency was obtained and they were put together by using a minor method, which enabled us to predict the life span of solder on the market with precision. 5 refs., 13 figs.

  20. The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder

    Science.gov (United States)

    Mayappan, R.; Salleh, A.; Andas, J.

    2017-09-01

    Solder has been widely used in electronic industry as interconnection for electronic packaging. European Union and Japan have restricted the use of Sn-Pb solder as it contains lead which can harmful to human health and environment. Due to this, many researches have been done in order to find a suitable replacement for the lead solder. Although many lead-free solders are available, the Sn-3.5Ag solder with the addition of graphene seem to be a suitable candidate. In this study, a 0.07 wt% graphene nanosheet was added into the Sn-3.5Ag solder and this composite solder was prepared under powder metallurgy method. The solder was reacted with copper substrate at 250 °C for one minute. For joint strength analysis, two copper strips were soldered together. The solder joint was aged at temperature 100 °C for 500 hours. Scanning Electron Microscope (SEM) was used to observe the interfacial reaction and Instron machine was used to determine the joint strength. Cu6Sn5 intermetallic layer was formed at the interface between the Cu substrate and the solders. Composite solder showed the retardation of the intermetallic growth compared to the plain solder. The thickness value of the intermetallic was used to calculate the growth rate the IMC. The graphene nanosheets added solder has lower growth rate which is 3.86 × 10-15 cm2/s compared to the plain solder 7.15 × 10-15 cm2/s. Shear strength analysis show that the composite solder has higher joint compared to the plain solder.

  1. Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement

    Energy Technology Data Exchange (ETDEWEB)

    Li, Yi, E-mail: yili64-c@my.cityu.edu.hk [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong); Luo, Kaiming; Lim, Adeline B.Y.; Chen, Zhong [School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798 (Singapore); Wu, Fengshun [School of Materials Science and Engineering, Huazhong University of Science and Technology, 1037 Luoyu Road, Wuhan (China); Chan, Y.C. [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong)

    2016-07-04

    Sn57.6Bi0.4Ag solder has been reinforced successfully through the addition of tungsten (W) nanoparticles at a concentration of 0.5 wt%. With the addition of W nanoparticles, the solder matrix lamellar interphase spacing was reduced by 31.0%. Due to the dispersion of W nanoparticles and the consequently refined microstructure, the mechanical properties of the solder alloy were enhanced, as indicated by a 6.2% improvement in the microhardness. During the reflow of solder on Au/Ni/Cu pads, the entire Au layer dissolved into the molten solder rapidly and a large number of (Au,Ni)(Sn,Bi){sub 4} particles were formed. The fracture path of the as-reflowed joint was within the solder region, showing ductile characteristic, and the shear strength was reinforced by 8.2%, due to the enhanced mechanical properties of the solder. During the subsequent aging process, the Au migrated back towards the interface and a thick layer of interfacial (Au,Ni)(Sn,Bi){sub 4} IMC was formed, leading to the shift of the fracture path to the interfacial IMC region, the transformation to brittle fracture and the deterioration of the strength of the joint, due to Au embrittlement. By adding W nanoparticles, the migration of Au was mitigated and the thickness of the (Au,Ni)(Sn,Bi){sub 4} layer was reduced significantly, which reduced the Au embrittlement-induced deterioration of the strength of the joint. During electromigration, the segregation of the Bi-rich and Sn-rich phases and the accumulation of the (Au,Ni)(Sn,Bi){sub 4} layer at cathode interface were mitigated by the addition of W nanoparticles, which improved the electromigration resistance.

  2. Magnetically induced vacuum decay

    International Nuclear Information System (INIS)

    Xue Shesheng

    2003-01-01

    We study the fermionic vacuum energy of vacua with and without application of an external magnetic field. The energetic difference of two vacua leads to the vacuum decaying and the vacuum energy being released. In the context of quantum field theories, we discuss why and how the vacuum energy can be released by spontaneous photon emission and/or paramagnetically screening the external magnetic field. In addition, we quantitatively compute the vacuum energy released, the paramagnetic screening effect, and the rate and spectrum of spontaneous photon emission. The possibilities of experimentally detecting such an effect of vacuum-energy release and that this effect accounts for the anomalous x-ray pulsar are discussed

  3. Gravitation and vacuum field

    International Nuclear Information System (INIS)

    Tevikyan, R.V.

    1986-01-01

    This paper presents equations that describe particles with spins s = 0, 1/2, 1 completely and which also describe 2s + 2 limiting fields as E → ∞. It is shown that the ordinary Hilbert-Einstein action for the gravitation field must be augmented by the action for the Bose vacuum field. This means that one must introduce in the gravitational equations a cosmological term proportional to the square of the strength of the Bose vacuum field. It is shown that the theory of gravitation describes three realities: matter, field, and vacuum field. A new form of matter--the vacuum field--is introduced into field theory

  4. Microstructure and mechanical properties of Sn-9Zn-xAl{sub 2}O{sub 3} nanoparticles (x=0–1) lead-free solder alloy: First-principles calculation and experimental research

    Energy Technology Data Exchange (ETDEWEB)

    Xing, Wen-qing; Yu, Xin-ye; Li, Heng; Ma, Le; Zuo, Wei [Taiyuan University of Technology, College of Material Science and Technology, Taiyuan 030024 (China); Dong, Peng; Wang, Wen-xian [Taiyuan University of Technology, College of Material Science and Technology, Taiyuan 030024 (China); Shanxi Key Laboratory of Advanced Magnesium-based Materials, Taiyuan 030024 (China); Key Laboratory of Interface Science and Engineering in Advanced Materials, Ministry of Education, Taiyuan University of Technology, Taiyuan 030024 (China); Ding, Min, E-mail: dingmin@tyut.edu.cn [Taiyuan University of Technology, College of Material Science and Technology, Taiyuan 030024 (China); Shanxi Key Laboratory of Advanced Magnesium-based Materials, Taiyuan 030024 (China); Key Laboratory of Interface Science and Engineering in Advanced Materials, Ministry of Education, Taiyuan University of Technology, Taiyuan 030024 (China)

    2016-12-15

    This paper studies microstructure and mechanical properties of Sn-9Zn-x Al{sub 2}O{sub 3} nanoparticles (x=0–1) lead-free solder alloy. The interface structure, interface energy and electronic properties of Al{sub 2}O{sub 3}/Sn9Zn interface are investigated by first-principle calculation. On the experimental part, in comparison with the plain Sn-9Zn solder, the Al{sub 2}O{sub 3} nanoparticles incorporated into the solder matrix can inhibit the growth of coarse dendrite Sn-Zn eutectic structure and refine grains of the composite solders during the solidification process of the alloys. Moreover, the microhardness and average tensile strength of the solders with addition of Al{sub 2}O{sub 3} nanoparticles increased with the increasing weight percentages of Al{sub 2}O{sub 3} nanoparticles. These improved mechanical properties can be attributed to the microstructure developments and the dispersed Al{sub 2}O{sub 3} nanoparticles.

  5. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

  6. Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

    Science.gov (United States)

    Sorg, Brian S.; Welch, Ashley J.

    2001-05-01

    Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

  7. Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Andersson, D.; Hoo, N.; Pearce, J.; Watson, A.; Dinsdale, A.; Mucklejohn, S.

    2012-01-01

    Roč. 21, č. 5 (2012), s. 629-637 ISSN 1059-9495 Institutional support: RVO:68081723 Keywords : lead-free soldering, * materials for high-temperature LF * new technologies for HT lead-free soldering Subject RIV: BJ - Thermodynamics Impact factor: 0.915, year: 2012

  8. Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

    Science.gov (United States)

    Lin, Jian; Lei, Yongping; Fu, Hanguang; Guo, Fu

    2018-03-01

    In surface mount technology, the Sn-3.0Ag-0.5Cu solder joint has a shorter impact lifetime than a traditional lead-tin solder joint. In order to improve the impact property of SnAgCu lead-free solder joints and identify the effect of silver content on tensile strength and impact property, impact experiments were conducted at various strain rates on three selected SnAgCu based solder joints. It was found that joint failure mainly occurred in the solder material with large plastic deformation under low strain rate, while joint failure occurred at the brittle intermetallic compound layer without any plastic deformation at a high strain rate. Joint strength increased with the silver content in SnAgCu alloys in static tensile tests, while the impact property of the solder joint decreased with increasing silver content. When the strain rate was low, plastic deformation occurred with failure and the tensile strength of the Sn-3.0Ag-0.5Cu solder joint was higher than that of Sn-0.3Ag-0.7Cu; when the strain rate was high, joint failure mainly occurred at the brittle interface layer and the Sn-0.3Ag-0.7Cu solder joint had a better impact resistance with a thinner intermetallic compound layer.

  9. Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

    Science.gov (United States)

    Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S

    2015-08-01

    The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding.

  10. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

    Science.gov (United States)

    Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu

    2017-08-01

    Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

  11. Corrosion Reliability of Lead-free Solder Systems Used in Electronics

    DEFF Research Database (Denmark)

    Li, Feng; Verdingovas, Vadimas; Medgyes, Balint

    2017-01-01

    humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods...

  12. Reliability and microstructure of lead-free solder joints in industrial electronics after accelerated thermal aging

    NARCIS (Netherlands)

    Scaltro, F.; Biglari, M.H.; Kodentsov, A.; Yakovleva, O.; Brom, E.

    2009-01-01

    The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface component/solder together with the formation of fractures. The evolution, the morphology and the elemental

  13. Investigation of moisture uptake into printed circuit board laminate and solder mask materials

    DEFF Research Database (Denmark)

    Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti

    2017-01-01

    with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

  14. Cold vacuum drying facility site evaluation report

    International Nuclear Information System (INIS)

    Diebel, J.A.

    1996-01-01

    In order to transport Multi-Canister Overpacks to the Canister Storage Building they must first undergo the Cold Vacuum Drying process. This puts the design, construction and start-up of the Cold Vacuum Drying facility on the critical path of the K Basin fuel removal schedule. This schedule is driven by a Tri-Party Agreement (TPA) milestone requiring all of the spent nuclear fuel to be removed from the K Basins by December, 1999. This site evaluation is an integral part of the Cold Vacuum Drying design process and must be completed expeditiously in order to stay on track for meeting the milestone

  15. Properties and Microstructures of Sn-Bi-X Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Fan Yang

    2016-01-01

    Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

  16. Insulation vacuum and beam vacuum overpressure release

    CERN Document Server

    Parma, V

    2009-01-01

    There is evidence that the incident of 19th September caused a high pressure build-up inside the cryostat insulation vacuum which the existing overpressure devices could not contain. As a result, high longitudinal forces acting on the insulation vacuum barriers developed and broke the floor and the floor fixations of the SSS with vacuum barriers. The consequent large longitudinal displacements of the SSS damaged chains of adjacent dipole cryo-magnets. Estimates of the helium mass flow and the pressure build- up experienced in the incident are presented together with the pressure build-up for an even more hazardous event, the Maximum Credible Incident (MCI). The strategy of limiting the maximum pressure by the installation of addition pressure relieve devices is presented and discussed. Both beam vacuum lines were ruptured during the incident in sector 3-4 giving rise to both mechanical damage and pollution of the system. The sequence, causes and effects of this damage will be briefly reviewed. We will then an...

  17. Physical properties of lead free solders in liquid and solid state

    Energy Technology Data Exchange (ETDEWEB)

    Mhiaoui, Souad

    2007-04-17

    The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

  18. An Approach for Impression Creep of Lead Free Microelectronic Solders

    Science.gov (United States)

    Anastasio, Onofrio A.

    2002-06-01

    Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

  19. Transected sciatic nerve repair by diode laser protein soldering.

    Science.gov (United States)

    Fekrazad, Reza; Mortezai, Omid; Pedram, MirSepehr; Kalhori, Katayoun Am; Joharchi, Khojasteh; Mansoori, Korosh; Ebrahimi, Roja; Mashhadiabbas, Fatemeh

    2017-08-01

    Despite advances in microsurgical techniques, repair of peripheral nerve injuries (PNI) is still a major challenge in regenerative medicine. The standard treatment for PNI includes suturing and anasthomosis of the transected nerve. The objective of this study was to compare neurorraphy (nerve repair) using standard suturingto diode laser protein soldering on the functional recovery of transected sciatic nerves. Thirty adult male Fischer-344 Wistar rats were randomly assigned to 3 groups: 1. The control group, no repair, 2. the standard of care suture group, and 3. The laser/protein solder group. For all three groups, the sciatic nerve was transected and the repair was done immediately. For the suture repair group, 10.0 prolene suture was used and for the laser/protein solder group a diode laser (500mW output power) in combination with bovine serum albumen and indocyanine green dye was used. Behavioral assessment by sciatic functional index was done on all rats biweekly. At 12weeks post-surgery, EMG recordings were done on all the rats and the rats were euthanized for histological evaluation of the sciatic nerves. The one-way ANOVA test was used for statistical analysis. The average time required to perform the surgery was significantly shorter for the laser-assisted nerve repair group compared to the suture group. The EMG evaluation revealed no difference between the two groups. Based on the sciatic function index the laser group was significantly better than the suture group after 12weeks (pneurorraphy using standard suturing methods. Copyright © 2017 Elsevier B.V. All rights reserved.

  20. Size effects in tin-based lead-free solder joints: Kinetics of bond formation and mechanical characteristics

    Science.gov (United States)

    Abdelhadi, Ousama Mohamed Omer

    Continuous miniaturization of microelectronic interconnects demands smaller joints with comparable microstructural and structural sizes. As the size of joints become smaller, the volume of intermetallics (IMCs) becomes comparable with the joint size. As a result, the kinetics of bond formation changes and the types and thicknesses of IMC phases that form within the constrained region of the bond varies. This dissertation focuses on investigating combination effects of process parameters and size on kinetics of bond formation, resulting microstructure and the mechanical properties of joints that are formed under structurally constrained conditions. An experiment is designed where several process parameters such as time of bonding, temperature, and pressure, and bond thickness as structural chracteristic, are varied at multiple levels. The experiment is then implemented on the process. Scanning electron microscope (SEM) is then utilized to determine the bond thickness, IMC phases and their thicknesses, and morphology of the bonds. Electron backscatter diffraction (EBSD) is used to determine the grain size in different regions, including the bulk solder, and different IMC phases. Physics-based analytical models have been developed for growth kinetics of IMC compounds and are verified using the experimental results. Nanoindentation is used to determine the mechanical behavior of IMC phases in joints in different scales. Four-point bending notched multilayer specimen and four-point bending technique were used to determine fracture toughness of the bonds containing IMCs. Analytical modeling of peeling and shear stresses and fracture toughness in tri-layer four-point bend specimen containing intermetallic layer was developed and was verified and validated using finite element simulation and experimental results. The experiment is used in conjunction with the model to calculate and verify the fracture toughness of Cu6Sn5 IMC materials. As expected two different IMC phases

  1. Rubber friction and force transmission during the shearing process of actively-driven vacuum grippers on rough surfaces; Elastomerreibung und Kraftuebertragung beim Abscheren von aktiv betriebenen Vakuumgreifern auf rauen Oberflaechen

    Energy Technology Data Exchange (ETDEWEB)

    Kern, Patrick

    2016-12-21

    Nowadays, vacuum grippers come in many different shapes and sizes. Their stability is guaranteed through specially manufactured metal fittings. These fittings are non-positively and positively connected to the elastic part of the vacuum gripper. The design of the elastic part may vary, though. Elastomer components are used to ensure tightness for the negative pressure in the active cave chamber of the vacuum gripper, as well as for the transfer of shearing forces, which acting parallel to the surface. Some vacuum grippers feature one elastomer for both the sealing function and the transfer of shear forces; other gripper types are equipped with various elastomers for those applications. The vacuum grippers described in this work are equipped with structured rubber friction pads, their tightness being ensured by sealing lips made of a flexible foam rubber. A restraint system consisting of one or several vacuum grippers must be sized prior to its actual practical use. For the transmission of shearing forces, which acting parallel to the surface, it is necessary to take the tribological system, consisting of the suction element's elastomer and the base material, into account since these loads put shearing stress on the vacuum gripper. In practice, however, a standardized value is given for the coefficient of friction μ; i.e. the ratio of transmissible frictional force to the normal force. This does neither include a detailed description of the elastomer used nor of the roughness of the base material. The standardized friction coefficients cannot be applied to the practical design of restraint systems. The present work includes the analysis of the load transmission and the modeling of the friction coefficients μ on rough surfaces during the shearing process of actively-driven vacuum grippers. Based on current theories, the phenomenon of elastomeric friction can be attributed to the two main components of hysteresis and adhesion friction. Both components are

  2. Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods are useful to predict damage values for solder joint in power electrical components. Based on the proposed methods it is described how to find the damage level for a given temperature loading profile....... The proposed methods are discussed for application in reliability assessment of Wind Turbine’s electrical components considering physical, model and measurement uncertainties. For further research it is proposed to evaluate damage criteria for electrical components due to the operational temperature...

  3. Pressure brazing of ceramics to metals with copper solder

    International Nuclear Information System (INIS)

    Pavlova, M.A.; Metelkin, I.I.

    1986-01-01

    The effect on the quality of joints brazed with copper of different non metallized aluminooxide dielectrics with metals and alloys of a series of technological parameters (temperature, pressure, holding, and medium) in the course of pressure brazing is investigated. It is shown that in case of brazing with kovar and nickel the character of dependences is identical, however in all cases the joints with nickel are more durable. For the ceramics - molybdenum system characterized by weak interaction with copper solder kinetic dependences have no maximum and only under holding of more than 20 min the constant strength of 150-190 MPa is attained

  4. PCBs with immersion tin finish - some experiences with lead-free reflow process

    Energy Technology Data Exchange (ETDEWEB)

    Bukat, K.; Koziol, G.; Sitek, J.; Borecki, J.; Hackiewicz, H. [Tele and Radio Research Inst., Warsaw (Poland); Merkle, H.; Schroeder, S. [Ormecon Chemie GmbH and Co. KG, Ammersbek (Germany); Girulska, A.; Gardela, K. [Eldos Sp. z o.o., Wroclaw (Poland)

    2004-07-01

    Substitution of lead-free solders in electronic assemblies requires changes in the conventional SnPb finishes of PCBs. The Craft project ''PRINT'' objectives respond to this challenge. Its main goal is to develop and implement the new technology of high solderability immersion tin for printed circuit boards at small and medium enterprises. The subject of the research was organic based immersion tin coating which would fulfil demands of SMT. In the paper the results of reflow soldering process on PCBs covered by Ormecon registered immersion tin finish with using lead-free solder pastes will be described. Solderability of tin coating as well as wettability of lead-free solder paste will be presented. (orig.)

  5. Random numbers from vacuum fluctuations

    International Nuclear Information System (INIS)

    Shi, Yicheng; Kurtsiefer, Christian; Chng, Brenda

    2016-01-01

    We implement a quantum random number generator based on a balanced homodyne measurement of vacuum fluctuations of the electromagnetic field. The digitized signal is directly processed with a fast randomness extraction scheme based on a linear feedback shift register. The random bit stream is continuously read in a computer at a rate of about 480 Mbit/s and passes an extended test suite for random numbers.

  6. Random numbers from vacuum fluctuations

    Energy Technology Data Exchange (ETDEWEB)

    Shi, Yicheng; Kurtsiefer, Christian, E-mail: christian.kurtsiefer@gmail.com [Department of Physics, National University of Singapore, 2 Science Drive 3, Singapore 117542 (Singapore); Center for Quantum Technologies, National University of Singapore, 3 Science Drive 2, Singapore 117543 (Singapore); Chng, Brenda [Center for Quantum Technologies, National University of Singapore, 3 Science Drive 2, Singapore 117543 (Singapore)

    2016-07-25

    We implement a quantum random number generator based on a balanced homodyne measurement of vacuum fluctuations of the electromagnetic field. The digitized signal is directly processed with a fast randomness extraction scheme based on a linear feedback shift register. The random bit stream is continuously read in a computer at a rate of about 480 Mbit/s and passes an extended test suite for random numbers.

  7. Modern vacuum physics

    CERN Document Server

    Chambers, Austin

    2005-01-01

    Modern Vacuum Physics presents the principles and practices of vacuum science and technology along with a number of applications in research and industrial production. The first half of the book builds a foundation in gases and vapors under rarefied conditions, The second half presents examples of the analysis of representative systems and describes some of the exciting developments in which vacuum plays an important role. The final chapter addresses practical matters, such as materials, components, and leak detection. Throughout the book, the author''s explanations are presented in terms of first principles and basic physics, augmented by illustrative worked examples and numerous figures.

  8. Evaporation under vacuum condition

    International Nuclear Information System (INIS)

    Mizuta, Satoshi; Shibata, Yuki; Yuki, Kazuhisa; Hashizume, Hidetoshi; Toda, Saburo; Takase, Kazuyuki; Akimoto, Hajime

    2000-01-01

    In nuclear fusion reactor design, an event of water coolant ingress into its vacuum vessel is now being considered as one of the most probable accidents. In this report, the evaporation under vacuum condition is evaluated by using the evaporation model we have developed. The results show that shock-wave by the evaporation occurs whose behavior strongly depends on the initial conditions of vacuum. And in the case of lower initial pressure and temperature, the surface temp finally becomes higher than other conditions. (author)

  9. Albumin solder covalently bound to a polymer membrane: New approach to improve binding strength in laser tissue soldering in-vitro.

    Science.gov (United States)

    Hiebl, B; Ascher, L; Luetzow, K; Kratz, K; Gruber, C; Mrowietz, C; Nehring, M E; Lendlein, A; Franke, R-P; Jung, F

    2018-01-01

    Laser tissue soldering (LTS) based on indocyanine green (ICG)-mediated heat-denaturation of proteins might be a promising alternative technique for micro-suturing, but up to now the problem of too weak shear strength of the solder welds in comparison to sutures is not solved. Earlier reports gave promising results showing that solder supported by carrier materials can enhance the cohesive strength of the liquid solder. In these studies, the solder was applied to the carriers by dip coating. Higher reliability of the connection between the solder and the carrier material is expected when the solder is bound covalently to the carrier material. In the present study a poly(ether imide) (PEI) membrane served as carrier material and ICG-supplemented albumin as solder substrate. The latter was covalently coupled to the carrier membrane under physiological conditions to prevent structural protein changes. As laser source a diode continuous-wave laser emitting at 808 nm with intensities between 250 mW and 1500 mW was utilized. The albumin functionalized carrier membrane was placed onto the tunica media of explanted pig thoracic aortae forming an overlapping area of approximately 0.5×0.5 cm2. All tests were performed in a dry state to prevent laser light absorption by water. Infrared spectroscopy, spectro-photometrical determination of the secondary and primary amine groups after acid orange II staining, contact angle measurements, and atomic force microscopy proved the successful functionalization of the PEI membrane with albumin. A laser power of 450 mW LTS could generate a membrane-blood vessel connection which was characterized by a shear strength of 0.08±0.002 MPa, corresponding to 15% of the tensile strength of the native blood vessel. Theoretically, an overlapping zone of 4.1 mm around the entire circumference of the blood vessel could have provided shear strength of the PEI membrane-blood vessel compound identical to the tensile strength of the native

  10. Development of Pb-Free Nanocomposite Solder Alloys

    Directory of Open Access Journals (Sweden)

    Animesh K. Basak

    2018-04-01

    Full Text Available As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs during aging/reflow. Accordingly, this study examines the improvement of properties of SAC alloys by incorporating nanoparticles in it. Two different types of nanoparticles were added in monolithic SAC alloy: (1 Al2O3 or (2 Fe and their effect on microstructure and thermal properties were investigated. Addition of Fe nanoparticles leads to the formation of FeSn2 IMCs alongside Ag3Sn and Cu6Sn5 from monolithic SAC alloy. Addition of Al2O3 nano-particles do not contribute to phase formation, however, remains dispersed along primary β-Sn grain boundaries and act as a grain refiner. As the addition of either Fe or Al2O3 nano-particles do not make any significant effect on thermal behavior, these reinforced nanocomposites are foreseen to provide better mechanical characteristics with respect to conventional monolithic SAC solder alloys.

  11. Impurity Effects in Electroplated-Copper Solder Joints

    Directory of Open Access Journals (Sweden)

    Hsuan Lee

    2018-05-01

    Full Text Available Copper (Cu electroplating is a mature technology, and has been extensively applied in microelectronic industry. With the development of advanced microelectronic packaging, Cu electroplating encounters new challenges for atomic deposition on a non-planar substrate and to deliver good throwing power and uniform deposit properties in a high-aspect-ratio trench. The use of organic additives plays an important role in modulating the atomic deposition to achieve successful metallic coverage and filling, which strongly relies on the adsorptive and chemical interactions among additives on the surface of growing film. However, the adsorptive characteristic of organic additives inevitably results in an incorporation of additive-derived impurities in the electroplated Cu film. The incorporation of high-level impurities originating from the use of polyethylene glycol (PEG and chlorine ions significantly affects the microstructural evolution of the electroplated Cu film, and the electroplated-Cu solder joints, leading to the formation of undesired voids at the joint interface. However, the addition of bis(3-sulfopropyl disulfide (SPS with a critical concentration suppresses the impurity incorporation and the void formation. In this article, relevant studies were reviewed, and the focus was placed on the effects of additive formula and plating parameters on the impurity incorporation in the electroplated Cu film, and the void formation in the solder joints.

  12. Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions

    Science.gov (United States)

    Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

    2015-12-01

    Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

  13. Helical type vacuum container

    International Nuclear Information System (INIS)

    Owada, Kimio.

    1989-01-01

    Helical type vacuum containers in the prior art lack in considerations for thermal expansion stresses to helical coils, and there is a possibility of coil ruptures. The object of the present invention is to avoid the rupture of helical coils wound around the outer surface of a vacuum container against heat expansion if any. That is, bellows or heat expansion absorbing means are disposed to a cross section of a helical type vacuum container. With such a constitution, thermal expansion of helical coils per se due to temperature elevation of the coils during electric supply can be absorbed by expansion of the bellows or absorption of the heat expansion absorbing means. Further, this can be attained by arranging shear pins in the direction perpendicular to the bellows axis so that the bellows are not distorted when the helical coils are wound around the helical type vacuum container. (I.S.)

  14. Vacuum considerations: summary

    International Nuclear Information System (INIS)

    Blechschmidt, D.; Halama, H.J.

    1978-01-01

    A summary is given of the efforts of a vacuum systems study group of the workshop on a Heavy Ion Demonstration Experiment (HIDE) for heavy ion fusion. An inadequate knowledge of cross-sections prevents a more concrete vacuum system design. Experiments leading to trustworthy numbers for charge exchange, stripping and capture cross-sections are badly needed and should start as soon as possible. In linacs, beam loss will be almost directly proportional to the pressure inside the tanks. The tanks should, therefore, be built in such a way that they can be baked-out in situ to improve their vacuum, especially if the cross-sections turn out to be higher than anticipated. Using standard UHV techniques and existing pumps, an even lower pressure can be achieved. The vacuum system design for circular machines will be very difficult, and in some cases, beyond the present state-of-the-art

  15. Handbook of vacuum technology

    CERN Document Server

    2016-01-01

    This comprehensive, standard work has been updated to remain an important resource for all those needing detailed knowledge of the theory and applications of vacuum technology. With many numerical examples and illustrations to visualize the theoretical issues.

  16. Cold Vacuum Drying Facility

    Data.gov (United States)

    Federal Laboratory Consortium — Located near the K-Basins (see K-Basins link) in Hanford's 100 Area is a facility called the Cold Vacuum Drying Facility (CVDF).Between 2000 and 2004, workers at the...

  17. TFTR diagnostic vacuum controller

    International Nuclear Information System (INIS)

    Olsen, D.; Persons, R.

    1981-01-01

    The TFTR diagnostic vacuum controller (DVC) provides in conjunction with the Central Instrumentation Control and Data Acquisition System (CICADA), control and monitoring for the pumps, valves and gauges associated with each individual diagnostic vacuum system. There will be approximately 50 systems on TFTR. Two standard versions of the controller (A and B) wil be provided in order to meet the requirements of two diagnostic manifold arrangements. All pump and valve sequencing, as well as protection features, will be implemented by the controller

  18. Ultra high vacuum technology

    CERN Multimedia

    CERN. Geneva

    2001-01-01

    A short introduction for some basic facts and equations. Subsquently, discussion about: Building blocks of an ultrahigh vacuum system - Various types of pumps required to reach uhv and methods to reduce these effects - Outgassing phenomena induced by the presence of a particle beam and the most common methods to reduce these effects It will be given some practical examples from existing CERN accelerators and discuss the novel features of the future LHC vacuum system.

  19. A Planck Vacuum Cosmology

    Directory of Open Access Journals (Sweden)

    Daywitt W. C.

    2009-04-01

    Full Text Available Both the big-bang and the quasi-steady-state cosmologies originate in some type of Planck state. This paper presents a new cosmological theory based on the Planck- vacuum negative-energy state, a state consisting of a degenerate collection of negative- energy Planck particles. A heuristic look at the Einstein field equation provides a con- vincing argument that such a vacuum state could provide a theoretical explanation for the visible universe.

  20. Laser-tissue soldering with biodegradable polymer films in vitro: film surface morphology and hydration effects.

    Science.gov (United States)

    Sorg, B S; Welch, A J

    2001-01-01

    Previous research introduced the concept of using biodegradable polymer film reinforcement of a liquid albumin solder for improvement of the tensile strength of repaired incisions in vitro. In this study, the effect of creating small pores in the PLGA films on the weld breaking strength is studied. Additionally, the effect of hydration on the strength of the reinforced welds is investigated. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with an 806-nm CW diode laser. A poly(DL-lactic-co-glycolic acid) (PLGA) film was used to reinforce the solder (the controls had solder but no reinforcement). Breaking strengths were measured acutely and after hydration in saline for 1 and 2 days. The data were analyzed by ANOVA (P < 0.05) and multiple comparisons of means were performed using the Newman-Keuls test. The creation of pores in the PLGA films qualitatively improved the film flexibility without having an apparent adverse effect on the breaking strength, while the actual technique of applying the film and solder had more of an effect. The acute maximum average breaking strengths of some of the film reinforced specimens (114.7 g-134.4 g) were significantly higher (P < 0.05) than the acute maximum average breaking strength of the unreinforced control specimens (68.3 g). Film reinforced specimens were shown to have a statistically significantly higher breaking strength than unreinforced controls after 1- and 2-day hydration. Reinforcement of liquid albumin solders in laser-assisted incision repair appears to have advantages over conventional methods that do not reinforce the cohesive strength of the solder in terms of acute breaking strength and after immersion in moist environments for short periods of time. Using a film with the solder applied to one surface only may be advantageous over other techniques.

  1. Multi-scale modeling of elasto-plastic response of SnAgCu lead-free solder alloys at different ageing conditions: Effect of microstructure evolution, particle size effects and interfacial failure

    Energy Technology Data Exchange (ETDEWEB)

    Maleki, Milad; Cugnoni, Joel, E-mail: joel.cugnoni@epfl.ch; Botsis, John

    2016-04-20

    In microelectronics applications, SnAgCu lead-free solder joints play the important role of ensuring both the mechanical and electrical integrity of the components. In such applications, the SnAgCu joints are subjected to elevated homologous temperatures for an extended period of time causing significant microstructural changes and leading to reliability issues. In this study, the link between the change in microstructures and deformation behavior of SnAgCu solder during ageing is explained by developing a hybrid multi-scale microstructure-based modeling approach. Herein, the SnAgCu solder alloy is seen as a three phase metal matrix composite in which Ag{sub 3}Sn and Cu{sub 6}Sn{sub 5} hard intermetallics play the role of reinforcements and Sn the role of a ductile matrix. The hardening of the Sn matrix due to fine intermetallics in the eutectic mixture is modeled by incorporating the mean field effects of geometrically necessary dislocations. Subsequently, a two level homogenization procedure based on micromechanical finite element (FE) models is used to capture the interactions between the different phases. For this purpose, tomographic images of microstructures obtained by Focused Ion Beam (FIB) and synchrotron X-Ray in different ageing conditions are directly used to generate statistically representative volume elements (RVE) using 3D FE models. The constitutive behavior of the solder is determined by sequentially performing two scales of numerical homogenization at the eutectic level and then at the dendrite level. For simplification, the anisotropy of Sn as well as the potential recovery processes have been neglected in the modeling. The observed decrease in the yield strength of solder due to ageing is well captured by the adopted modeling strategy and allows explaining the different ageing mechanisms. Finally, the effects of potential debonding at the intermetallic particle-matrix interface as well as particle fracture on the overall strength of solder are

  2. Vacuum decay in an interacting multiverse

    Science.gov (United States)

    Robles-Pérez, S.; Alonso-Serrano, A.; Bastos, C.; Bertolami, O.

    2016-08-01

    We examine a new multiverse scenario in which the component universes interact. We focus our attention to the process of "true" vacuum nucleation in the false vacuum within one single element of the multiverse. It is shown that the interactions lead to a collective behavior that might lead, under specific conditions, to a pre-inflationary phase and ensued distinguishable imprints in the comic microwave background radiation.

  3. Vacuum decay in an interacting multiverse

    Energy Technology Data Exchange (ETDEWEB)

    Robles-Pérez, S. [Centro de Física “Miguel Catalán”, Instituto de Física Fundamental, Consejo Superior de Investigaciones Científicas, Serrano 121, 28006 Madrid (Spain); Estación Ecológica de Biocosmología, Pedro de Alvarado, 14, 06411 Medellín (Spain); Alonso-Serrano, A. [Centro de Física “Miguel Catalán”, Instituto de Física Fundamental, Consejo Superior de Investigaciones Científicas, Serrano 121, 28006 Madrid (Spain); Estación Ecológica de Biocosmología, Pedro de Alvarado, 14, 06411 Medellín (Spain); School of Mathematics and Statistics, Victoria University of Wellington, PO Box 600, Wellington 6140 (New Zealand); Bastos, C., E-mail: catarina.bastos@tecnico.ulisboa.pt [GoLP, Instituto de Plasmas e Fusão Nuclear, Instituto Superior Técnico, Avenida Rovisco Pais 1, 1049-001 Lisboa (Portugal); Bertolami, O. [Departamento de Física e Astronomia and Centro de Física do Porto, Faculdade de Ciências da Universidade do Porto, Rua do Campo Alegre 687, 4169-007 Porto (Portugal)

    2016-08-10

    We examine a new multiverse scenario in which the component universes interact. We focus our attention to the process of “true” vacuum nucleation in the false vacuum within one single element of the multiverse. It is shown that the interactions lead to a collective behavior that might lead, under specific conditions, to a pre-inflationary phase and ensued distinguishable imprints in the comic microwave background radiation.

  4. Vacuum decay in an interacting multiverse

    Directory of Open Access Journals (Sweden)

    S. Robles-Pérez

    2016-08-01

    Full Text Available We examine a new multiverse scenario in which the component universes interact. We focus our attention to the process of “true” vacuum nucleation in the false vacuum within one single element of the multiverse. It is shown that the interactions lead to a collective behavior that might lead, under specific conditions, to a pre-inflationary phase and ensued distinguishable imprints in the comic microwave background radiation.

  5. Vacuum decay in an interacting multiverse

    International Nuclear Information System (INIS)

    Robles-Pérez, S.; Alonso-Serrano, A.; Bastos, C.; Bertolami, O.

    2016-01-01

    We examine a new multiverse scenario in which the component universes interact. We focus our attention to the process of “true” vacuum nucleation in the false vacuum within one single element of the multiverse. It is shown that the interactions lead to a collective behavior that might lead, under specific conditions, to a pre-inflationary phase and ensued distinguishable imprints in the comic microwave background radiation.

  6. The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

    Energy Technology Data Exchange (ETDEWEB)

    Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: Peter.Svec@savba.sk [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)

    2013-06-01

    The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

  7. Wireless Integrated Microelectronic Vacuum Sensor System

    Science.gov (United States)

    Krug, Eric; Philpot, Brian; Trott, Aaron; Lawrence, Shaun

    2013-01-01

    NASA Stennis Space Center's (SSC's) large rocket engine test facility requires the use of liquid propellants, including the use of cryogenic fluids like liquid hydrogen as fuel, and liquid oxygen as an oxidizer (gases which have been liquefied at very low temperatures). These fluids require special handling, storage, and transfer technology. The biggest problem associated with transferring cryogenic liquids is product loss due to heat transfer. Vacuum jacketed piping is specifically designed to maintain high thermal efficiency so that cryogenic liquids can be transferred with minimal heat transfer. A vacuum jacketed pipe is essentially two pipes in one. There is an inner carrier pipe, in which the cryogenic liquid is actually transferred, and an outer jacket pipe that supports and seals the vacuum insulation, forming the "vacuum jacket." The integrity of the vacuum jacketed transmission lines that transfer the cryogenic fluid from delivery barges to the test stand must be maintained prior to and during engine testing. To monitor the vacuum in these vacuum jacketed transmission lines, vacuum gauge readings are used. At SSC, vacuum gauge measurements are done on a manual rotation basis with two technicians, each using a handheld instrument. Manual collection of vacuum data is labor intensive and uses valuable personnel time. Additionally, there are times when personnel cannot collect the data in a timely fashion (i.e., when a leak is detected, measurements must be taken more often). Additionally, distribution of this data to all interested parties can be cumbersome. To simplify the vacuum-gauge data collection process, automate the data collection, and decrease the labor costs associated with acquiring these measurements, an automated system that monitors the existing gauges was developed by Invocon, Inc. For this project, Invocon developed a Wireless Integrated Microelectronic Vacuum Sensor System (WIMVSS) that provides the ability to gather vacuum

  8. Influence of Poly(ethylene glycol) Degradation on Voiding Sporadically Occurring in Solder Joints with Electroplated Cu

    Science.gov (United States)

    Wafula, F.; Yin, L.; Borgesen, P.; Andala, D.; Dimitrov, N.

    2012-07-01

    This paper presents a comprehensive study of the effect of poly(ethylene glycol) (PEG) degradation on the void formation known to take place sporadically at the interface between electroplated Cu and Pb-free solder. Thorough chemical analysis of our plating solution, carried out at different times of the deposition process by matrix-assisted laser desorption ionization time-of-flight mass spectroscopy, reveals a dramatic shift in the peaks to lower mass range with time. Scanning electron microscopy cross-sectional images of solder joints with Cu samples that have been plated at different times in the course of solution aging show a decrease in void formation. A decreasing magnitude of the deposition overpotential also seen during aging suggests that, breaking down to lower-molecular-weight fragments, PEG loses its suppression effect and likely has lower impact on the voiding propensity. This indirect correlation is confirmed further by the use of plating solutions containing PEG with preselected molecular weight. We also report on the effect of the surface area-to-solution volume ratio on PEG degradation studied by comparative experiments performed in a 50-mL bath with a rotating disc electrode and in a larger cell (Hull cell) with volume of 267 mL. The results show that, at fixed charge per unit volume, PEG degrades at a greatly accelerated rate in the Hull cell featuring higher electrode surface-to-solution volume ratio. Analysis of solder joints with accordingly grown Cu layers suggests that the voiding decreases faster with the accelerated rate of PEG degradation.

  9. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Directory of Open Access Journals (Sweden)

    Xiuyun Zhou

    2015-10-01

    Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  10. Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

    CERN Document Server

    Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B

    2015-01-01

    The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

  11. Role of vacuum in food preservation

    International Nuclear Information System (INIS)

    Bongirwar, D.R.

    1997-01-01

    Considerable progress has been made in the processing of foods using operations viz. drying, evaporation, distillation, concentration, centrifugation, filtration, irradiation, freeze drying, osmotic drying etc. to get ready to eat food, convenience food, pre cooked dried food. Vacuum technology in direct or indirect way has played a vital role in carrying out these food processing operations. The role of vacuum in getting these processes developed and its use in the development of these high quality products with respect to colour, flavour, texture and other attributes has been highlighted along with process details. (author)

  12. Re-circulating linac vacuum system

    International Nuclear Information System (INIS)

    Wells, Russell P.; Corlett, John N.; Zholents, Alexander A.

    2003-01-01

    The vacuum system for a proposed 2.5 GeV, 10ΜA recirculating linac synchrotron light source [1] is readily achievable with conventional vacuum hardware and established fabrication processes. Some of the difficult technical challenges associated with synchrotron light source storage rings are sidestepped by the relatively low beam current and short beam lifetime requirements of a re-circulating linac. This minimal lifetime requirement leads directly to relatively high limits on the background gas pressure through much of the facility. The 10ΜA average beam current produces very little synchrotron radiation induced gas desorption and thus the need for an ante-chamber in the vacuum chamber is eliminated. In the arc bend magnets, and the insertion devices, the vacuum chamber dimensions can be selected to balance the coherent synchrotron radiation and resistive wall wakefield effects, while maintaining the modest limits on the gas pressure and minimal outgassing

  13. Running jobs in the vacuum

    International Nuclear Information System (INIS)

    McNab, A; Stagni, F; Garcia, M Ubeda

    2014-01-01

    We present a model for the operation of computing nodes at a site using Virtual Machines (VMs), in which VMs are created and contextualized for experiments by the site itself. For the experiment, these VMs appear to be produced spontaneously 'in the vacuum' rather having to ask the site to create each one. This model takes advantage of the existing pilot job frameworks adopted by many experiments. In the Vacuum model, the contextualization process starts a job agent within the VM and real jobs are fetched from the central task queue as normal. An implementation of the Vacuum scheme, Vac, is presented in which a VM factory runs on each physical worker node to create and contextualize its set of VMs. With this system, each node's VM factory can decide which experiments' VMs to run, based on site-wide target shares and on a peer-to-peer protocol in which the site's VM factories query each other to discover which VM types they are running. A property of this system is that there is no gate keeper service, head node, or batch system accepting and then directing jobs to particular worker nodes, avoiding several central points of failure. Finally, we describe tests of the Vac system using jobs from the central LHCb task queue, using the same contextualization procedure for VMs developed by LHCb for Clouds.

  14. Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications

    Directory of Open Access Journals (Sweden)

    John D. Sørensen

    2011-12-01

    Full Text Available Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components, it is necessary to understand the physics of their failure and be able to develop reliability prediction models. Such a model is proposed in this paper for an IGBT power electronic module. IGBTs are critical components in wind turbine converter systems. These are multilayered devices where layers are soldered to each other and they operate at a thermal-power cycling environment. Temperature loadings affect the reliability of soldered joints by developing cracks and fatigue processes that eventually result in failure. Based on Miner’s rule a linear damage model that incorporates a crack development and propagation processes is discussed. A statistical analysis is performed for appropriate model parameter selection. Based on the proposed model, a layout for component life prediction with crack movement is described in details.

  15. Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders

    Science.gov (United States)

    Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E.; Handwerker, Carol A.

    2016-12-01

    Particles of Cu x Al y in Sn-Cu-Al solders have previously been shown to nucleate the Cu6Sn5 phase during solidification. In this study, the number and size of Cu6Sn5 nucleation sites were controlled through the particle size refinement of Cu x Al y via rapid solidification processing and controlled cooling in a differential scanning calorimeter. Cooling rates spanning eight orders of magnitude were used to refine the average Cu x Al y and Cu6Sn5 particle sizes down to submicron ranges. The average particle sizes, particle size distributions, and morphologies in the microstructures were analyzed as a function of alloy composition and cooling rate. Deep etching of the samples revealed the three-dimensional microstructures and illuminated the epitaxial and morphological relationships between the Cu x Al y and Cu6Sn5 phases. Transitions in the Cu6Sn5 particle morphologies from faceted rods to nonfaceted, equiaxed particles were observed as a function of both cooling rate and composition. Initial solidification cooling rates within the range of 103 to 104 °C/s were found to be optimal for realizing particle size refinement and maintaining the Cu x Al y /Cu6Sn5 nucleant relationship. In addition, little evidence of the formation or decomposition of the ternary- β phase in the solidified alloys was noted. Solidification pathways omitting the formation of the ternary- β phase agreed well with observed room temperature microstructures.

  16. Vacuum mammotomy under ultrasound guidance

    International Nuclear Information System (INIS)

    Luczynska, E.; Kocurek, A.; Pawlik, T.; Aniol, J.; Herman, K.; Skotnicki, P.

    2007-01-01

    Breast ultrasound is a non-invasive method of breast examination. You can use it also for fine needle biopsy, core needle biopsy, vacuum mammotomy and for placing the '' wire '' before open surgical biopsy. 106 patients (105 women and 1 man) aged 20-71 years (mean age 46.9) were treated in Cancer Institute in Cracow by vacuum mammotomy under ultrasound guidance. The lesions found in ultrasonography were divided into three groups: benign lesions (BI RADS II), ambiguous lesions (BI RADS 0, III and IVa), and suspicious lesions (BI RADS IV B, IV C and V). Then lesions were qualified to vacuum mammotomy. According to USG, fibroadenoma or '' fibroadenoma-like '' lesions were found in 75 women, in 6 women complicated cysts, in 6 women cyst with dense fluid (to differentiate with FA), and in 19 patients undefined lesions. Fibroadenoma was confirmed in histopathology in 74% patients among patients with fibroadenoma or '' fibroadenoma-like '' lesions in ultrasound (in others also benign lesions were found). Among lesions undefined after ultrasound examination (total 27 patients) cancer was confirmed in 6 % (DCIS and IDC). In 6 patients with complicated cysts in ultrasound examination, histopathology confirmed fibroadenoma in 4 women, an intraductal lesion in 1 woman and inflamatory process in 1 woman. Also in 6 women with a dense cyst or fibroadenoma seen in ultrasound, histopathology confirmed fibroadenoma in 3 women and fibrosclerosis in 3 women. Any breast lesions undefined or suspicious after ultrasound examination should be verified. The method of verification or kind of operation of the whole lesion (vacuum mammotomy or '' wire '') depends on many factors, for example: lesion localization; lesion size; BI RADS category. (author)

  17. Vacuum status-display and sector-conditioning programs

    International Nuclear Information System (INIS)

    Skelly, J.; Yen, S.

    1989-01-01

    Two programs have been developed for observation and control of the AGS vacuum system, which include these notable features: they incorporate a graphical user interface, and they are driven by a relational database which describes the vacuum system. The vacuum system comprises some 440 devices organized into 28 vacuum sectors. The Status Display Program invites menu selection of a sector, interrogates the relational database for relevant vacuum devices, acquires live readbacks, and posts a graphical display of their status. The Sector Conditioning Program likewise invites sector selection, produces the same status display, and also implements process control logic on the sector devices to pump the sector down from atmospheric pressure to high vacuum over a period extending for several hours. As additional devices are installed in the vacuum system, the devices are likewise added to the relational database; these programs then automatically include the new devices. 2 refs., 1 fig

  18. Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn- xAg-0.7Cu

    Science.gov (United States)

    Lee, Hwa-Teng; Huang, Kuo-Chen

    2016-12-01

    Low-cycle fatigue tests of Sn-Ag-Cu (SAC) Pb-free solder joints under fixed displacement were performed to evaluate the influence of Ag content (0-3 wt.%) and solder-joint geometry (barrel and hourglass types) on solder-joint fatigue behavior and reliability. The solder joints were composed of fine particles of Ag3Sn and Cu6Sn5, which aggregated as an eutectic constituent at grain boundaries of the primary β-Sn phase and formed a dense network structure. A decrease in the Ag content resulted in coarsening of the β-Sn and eutectic phases, which, in turn, decreased the strength of the joint and caused earlier failure. Solder joints in the hourglass form exhibited better fatigue performance with longer life than barrel-type joints. The sharp contact angle formed between the solder and the Cu substrate by the barrel-type joints concentrated stress, which compromised fatigue reliability. The addition of Ag to the solder, however, enhanced fatigue performance because of strengthening caused by Ag3Sn formation. The cracks of the barrel-type SAC solder joints originated mostly at the contact corner and propagated along the interfacial layer between the interfacial intermetallic compound (IMC) and solder matrix. Hourglass-type solder joints, however, demonstrated both crack initiation and propagation in the solder matrix (solder mode). The addition of 1.5-2.0 wt.% Ag to SAC solder appears to enhance the fatigue performance of solder joints while maintaining sufficient strength.

  19. Laser welding of vas deferens in rodents: initial experience with fluid solders.

    Science.gov (United States)

    Trickett, R I; Wang, D; Maitz, P; Lanzetta, M; Owen, E R

    1998-01-01

    This study evaluates the use of sutureless laser welding for vasovasostomy. In 14 rodents, the left vas deferens underwent vasovasostomy using an albumin-based solder applied to the adventitia of the vas deferens. The solder contained the dye, indocyanine green, to allow selective absorption and denaturation by a fiber-coupled 800-nm diode laser. The right vas deferens served as a control, receiving conventional layered microsurgical repair. We used a removable 4/0 nylon stent and microclamps to appose the vas deferens during repair, with no need for stay sutures. The mean time to perform laser solder repair (23.5 min) and conventional repair (23.3 min) were not significantly different (P=0.91). However, examination after 8 weeks showed that granuloma formation (G) and patency (P) rates for the conventional suture technique (G, 14%; P, 93%) were significantly better than observed for the laser solder technique (G, 57%; P, 50%).

  20. Effects of rework on adhesion of Pb-In soldered gold thick films

    International Nuclear Information System (INIS)

    Gehman, R.W.; Becka, G.A.; Losure, J.A.

    1982-02-01

    The feasibility of repeatedly reworking Pb-In soldered joints on gold thick films was evaluated. Nailhead adhesion tests on soldered thick films typically resulted in failure within the bulk solder (50 In-50 Pb). Average strengths increased with each rework, and the failure mode changed. An increase in metalization lift-off occurred with successive reworks. An investigation was initiated to determine why these changes occurred. Based on this work, the thick film adhesion to the substrate appeared to be lowered by indium reduction of cadmium oxide and by formation of a weak, brittle intermetallic compound, Au 9 In 4 . It was concluded that two solder reworks could be conducted without significant amounts of metallization lift-off during nailhead testing

  1. Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

    Science.gov (United States)

    Hasnine, M.; Tolla, B.; Vahora, N.

    2018-04-01

    This paper explores the effects of aging on the mechanical behavior, microstructure evolution and IMC formation on different surface finishes of two high temperature solders, Sn-5 wt.% Ag and Sn-5 wt.% Sb. High temperature aging showed significant degradation of Sn-5 wt.% Ag solder hardness (34%) while aging has little effect on Sn-5 wt.% Sb solder. Sn-5 wt.% Ag experienced rapid grain growth as well as the coarsening of particles during aging. Sn-5 wt.% Sb showed a stable microstructure due to solid solution strengthening and the stable nature of SnSb precipitates. The increase of intermetallic compound (IMC) thickness during aging follows a parabolic relationship with time. Regression analysis (time exponent, n) indicated that IMC growth kinetics is controlled by a diffusion mechanism. The results have important implications in the selection of high temperature solders used in high temperature applications.

  2. Numerical simulation on vacuum solution heat treatment and gas quenching process of a low rhenium-containing Ni-based single crystal turbine blade

    Directory of Open Access Journals (Sweden)

    Zhe-xin Xu

    2016-11-01

    Full Text Available Numerical heat-transfer and turbulent flow model for an industrial high-pressure gas quenching vacuum furnace was established to simulate the heating, holding and gas fan quenching of a low rhenium-bearing Ni-based single crystal turbine blade. The mesh of simplified furnace model was built using finite volume method and the boundary conditions were set up according to the practical process. Simulation results show that the turbine blade geometry and the mutual shielding among blades have significant influence on the uniformity of the temperature distribution. The temperature distribution at sharp corner, thin wall and corner part is higher than that at thick wall part of blade during heating, and the isotherms show a toroidal line to the center of thick wall. The temperature of sheltered units is lower than that of the remaining part of blade. When there is no shelteration among multiple blades, the temperature distribution for all blades is almost identical. The fluid velocity field, temperature field and cooling curves of the single and multiple turbine blades during gas fan quenching were also simulated. Modeling results indicate that the loading tray, free outlet and the location of turbine blades have important influences on the flow field. The high-speed gas flows out from the nozzle is divided by loading tray, and the free outlet enhanced the two vortex flow at the end of the furnace door. The closer the blade is to the exhaust outlet and the nozzle, the greater the flow velocity is and the more adequate the flow is. The blade geometry has an effect on the cooling for single blade and multiple blades during gas fan quenching, and the effects in double layers differs from that in single layer. For single blade, the cooing rate at thin-walled part is lower than that at thick-walled part, the cooling rate at sharp corner is greater than that at tenon and blade platform, and the temperature at regions close to the internal position is

  3. The creep behavior of In-Ag eutectic solder joints

    International Nuclear Information System (INIS)

    Reynolds, H.L.; Kang, S.H.; Morris, J.W. Jr.; Univ. of California, Berkeley, CA

    1999-01-01

    The addition of 3 wt.% Ag to In results in a eutectic composition with improved mechanical properties while only slightly lowering the melting temperature. Steady-state creep properties of In-Ag eutectic solder joints have been measured using constant load tests at 0, 30, 60, and 90 C. Constitutive equations are derived to describe the creep behavior. The data are well represented by an equation of the form proposed by Dorn: a power-law equation applies to each independent creep mechanism. Two parallel mechanisms were observed for the In-Ag eutectic joints. The high-stress mechanism is a bulk mechanism with a thermal dependence dominated by the thermal dependence of creep in the In-rich matrix. The low-stress mechanism is a grain boundary mechanism. Results of this work are discussed with regard to creep behavior of typical eutectic systems

  4. Soldered Contact and Current Risetime Effects on Negative Polarity Wire Array Z-pinches

    International Nuclear Information System (INIS)

    Chalenski, D. A.; Kusse, B. R.; Greenly, J. B.; Blesener, I. C.; McBride, R. D.; Hammer, D. A.; Knapp, P. F.

    2009-01-01

    The Cornell University COBRA pulser is a nominal 1 MA machine, capable of driving up to 32 wire cylindrical Z-pinch arrays. COBRA can operate with variable current risetimes ranging from 100 ns to 200 ns (short and long pulse, respectively). Wires are typically strung with a ''press'' contact to the electrode hardware, where the wire is loosely pulled against the hardware and held there to establish electrical contact. The machine is normally negative, but a bolt-on convolute can be used to modify the current path and effectively produce positive polarity operation at the load.Previous research with single wires on a 1-5 kA pulser has shown that soldering the wire, thereby improving the wire/electrode contact, and operating in positive polarity can improve the energy deposition into the wire and enhance wire core expansion. Negative polarity showed no difference. Previous experiments on the negative polarity, 20 MA, 100 ns Z accelerator have shown that improving the contact improved the x-ray yield.Cornell data were collected on 16-wire Aluminum Z-pinch arrays in negative polarity. Experiments were conducted with both short and long current pulses with soldered and no-soldered wire/electrode contacts. The initiation, ablation, implosion and stagnation phases were compared for these four conditions. Time dependent x-ray signals were measured using diodes and diamond detectors. An inductive voltage monitor was used to infer minimum current radius achieved, as defined by a uniform shell of current moving radially inward, producing a time dependent inductance. Total energy data were collected with a metal-strip bolometer. Self-emission data were collected by an XUV 4-frame camera and an optical streak camera.In negative polarity and with short pulses, soldering appeared to produce a smaller radius pinch and decrease variations in the x-ray pulse shape. The bolometer, laser backlighter, 4-frame and streak cameras showed negligible differences in the initiation ablation

  5. Analysis of decarburization in RH process of vacuum degasification; Analise da descarburacao do aco no processo rh de desgaseificacao a vacuo

    Energy Technology Data Exchange (ETDEWEB)

    Souza Costa, Sergio L. de; Oliveira Barros, Hudson N. de; Almeida, Claudio X [USIMINAS, Ipatinga, MG (Brazil). Centro de Pesquisas

    1990-12-31

    USIMINAS has made significant progress in the development of technology to produce ultra low carbon steels using the RH vacuum degassing unit in its number 1 BOF Shop. The decarburization rate is controlled by the circulation rate of liquid steel. On substituting conventional legs with oval shaped legs the circulation rate increased from 40 t/min to 80 t/min with a consequent increase in the global decarburization constant from 0.13 min{sup -1} to 0.28 min{sup -1}. With those practice it has been possible to achieve carbon levels as low as 45 ppm in ten minutes. (author). 5 refs., 8 figs., 2 tabs.

  6. Vacuum arc anode phenomena

    International Nuclear Information System (INIS)

    Miller, H.C.

    1976-01-01

    A brief review of anode phenomena in vacuum arcs is presented. Discussed in succession are: the transition of the arc into the anode spot mode; the temperature of the anode before, during and after the anode spot forms; and anode ions. Characteristically the anode spot has a temperature of the order of the atmospheric boiling point of the anode material and is a copious source of vapor and energetic ions. The dominant mechanism controlling the transition of the vacuum arc into the anode spot mode appears to depend upon the electrode geometry, the electrode material, and the current waveform of the particular vacuum arc being considered. Either magnetic constriction in the gap plasma or gross anode melting can trigger the transition; indeed, a combination of the two is a common cause of anode spot formation

  7. Effects of voids on thermal-mechanical reliability of lead-free solder joints

    Directory of Open Access Journals (Sweden)

    Benabou Lahouari

    2014-06-01

    Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

  8. Vacuum Arc Ion Sources

    CERN Document Server

    Brown, I.

    2013-12-16

    The vacuum arc ion source has evolved into a more or less standard laboratory tool for the production of high-current beams of metal ions, and is now used in a number of different embodiments at many laboratories around the world. Applications include primarily ion implantation for material surface modification research, and good performance has been obtained for the injection of high-current beams of heavy-metal ions, in particular uranium, into particle accelerators. As the use of the source has grown, so also have the operational characteristics been improved in a variety of different ways. Here we review the principles, design, and performance of vacuum arc ion sources.

  9. Vacuum fusion of uranium

    International Nuclear Information System (INIS)

    Stohr, J.A.

    1957-01-01

    After having outlined that vacuum fusion and moulding of uranium and of its alloys have some technical and economic benefits (vacuum operations avoid uranium oxidation and result in some purification; precision moulding avoids machining, chip production and chemical reprocessing of these chips; direct production of the desired shape is possible by precision moulding), this report presents the uranium fusion unit (its low pressure enclosure and pumping device, the crucible-mould assembly, and the MF supply device). The author describes the different steps of cast production, and briefly comments the obtained results

  10. Vacuum considerations summary

    International Nuclear Information System (INIS)

    1977-01-01

    The vacuum system for Heavy Ion Fusion machines can be divided according to pressure into 4 parts: (a) Ion Sources; (b) Linear Accelerators; (c) Circular Accelerators, Accumulators and Storage Rings; and (d) Reactors. Since ion sources will need rather conventional pumping arrangements and reactors will operate with greater pressures, depending on their mode of operation, only items b and c will be treated in this report. In particular, the vacuum system design will be suggested for the machines proposed by various scenarios arrived at during the workshop. High mass numbers will be assumed

  11. Handbook of vacuum physics

    CERN Document Server

    1964-01-01

    Handbook of Vacuum Physics, Volume 3: Technology is a handbook of vacuum physics, with emphasis on the properties of miscellaneous materials such as mica, oils, greases, waxes, and rubber. Accurate modern tables of physical constants, properties of materials, laboratory techniques, and properties of commercial pumps, gauges, and leak detectors are presented. This volume is comprised of 12 chapters and begins with a discussion on pump oils, divided into rotary pump oils and vapor pump oils. The next chapter deals with the properties and applications of greases, including outgassing and vapor pr

  12. Vacuum phonon tunneling.

    Science.gov (United States)

    Altfeder, Igor; Voevodin, Andrey A; Roy, Ajit K

    2010-10-15

    Field-induced phonon tunneling, a previously unknown mechanism of interfacial thermal transport, has been revealed by ultrahigh vacuum inelastic scanning tunneling microscopy (STM). Using thermally broadened Fermi-Dirac distribution in the STM tip as in situ atomic-scale thermometer we found that thermal vibrations of the last tip atom are effectively transmitted to sample surface despite few angstroms wide vacuum gap. We show that phonon tunneling is driven by interfacial electric field and thermally vibrating image charges, and its rate is enhanced by surface electron-phonon interaction.

  13. Effect of gamma radiation on micromechanical hardness of lead-free solder joint

    Energy Technology Data Exchange (ETDEWEB)

    Paulus, Wilfred [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Malaysian Nuclear Agency, Bangi, 43000 Kajang, Selangor (Malaysia); Rahman, Irman Abdul; Jalar, Azman; Kamil, Insan; Bakar, Maria Abu [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Yusoff, Wan Yusmawati Wan [Universiti Pertahanan Nasional Malaysia, Kem Sg. Besi, 57000 Kuala Lumpur (Malaysia)

    2015-09-25

    Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the increment of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.

  14. A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

    Directory of Open Access Journals (Sweden)

    Enrico Mick

    2015-07-01

    Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

  15. Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

    International Nuclear Information System (INIS)

    Mallik, S.; Ekere, N.N.; Durairaj, R.; Marks, A.E.; Seman, A.

    2009-01-01

    Solder paste is the most important strategic bonding material used in the assembly of surface mount components in electronics manufacturing. As the trend towards miniaturisation of electronic products continues, there is an increasing demand for better understanding of the flow and deformation that is, the rheological behaviour of solder paste formulations. Wall slip plays an important role in characterising the flow behaviour of solder paste materials. The problem of wall slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin solvent layer adjacent to the wall, which gives rise to slippage. In rheological measurements, slip effects can generally be avoided by using roughened surfaces for measuring geometries. In this paper, a novel technique is developed to study the effect of wall slip in the rheological measurements of lead-free solder paste. The viscosity and oscillatory data obtained for three different solder paste samples (from measuring geometries of different surface roughness) have been analysed and compared. In viscosity measurements, slip effects were dominant at low shear rates and the use of serrated surfaces was found to be quite effective in minimizing slip effects. Oscillatory measurements were also affected by roughening the surfaces of measuring geometries.

  16. Study on interfacial reaction between lead-free solders and alternative surface finishes

    International Nuclear Information System (INIS)

    Siti Rabiatul Aisha; Ourdjini, A.; Saliza Osman

    2007-01-01

    This study investigates the interfacial reactions occurring during reflow soldering between Sn-Ag-Cu lead-free solder and two surface finishes: electroless nickel/ immersion gold (ENIG) and immersion silver (IAg). The study focuses on interfacial reactions evolution and growth kinetics of intermetallic compounds (IMC) formed during soldering and isothermal ageing at 150 degree Celsius for up to 2000 hours. Optical and scanning electron microscopy were used to measure IMC thickness and examine the morphology of IMC respectively, whereas the IMC phases were identified by energy dispersive X-ray analysis (EDX). The results showed that the IMC formed on ENIG finish is thinner compared to that formed on IAg finish. For IAg surface finish, Cu 6 Sn 5 IMCs with scallop morphology are formed at the solder/ surface finish interface after reflow while a second IMC, Cu 3 Sn was formed between the copper and Cu 6 Sn 5 IMC after the isothermal ageing treatment. For ENIG surface finish both (Cu,Ni) 6 Sn 5 and (Ni,Cu) 3 Sn 4 are formed after soldering. Isothermal aging of the solder joints formed on ENIG finish was found to have a significant effect on the morphology of the intermetallics by transforming to more spherical and denser morphology in addition to increase i their thickness with increased ageing time. (author)

  17. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    Directory of Open Access Journals (Sweden)

    Lei Sun

    2015-01-01

    Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

  18. Machine for extrusion under vacuum

    International Nuclear Information System (INIS)

    Gautier, A.

    1958-01-01

    In a study of the behaviour of easily oxidised metals during the extrusion process, it is first necessary to find an effective mean of fighting corrosion, since this, even when barely detectable, has an important influence on the validity of the results recorded. The neatest and also the most efficient of all the methods tried consists in creating a vacuum around the test piece. Working on this principle, and at the same time respecting the conventional rules for extrusion tests (loading the sample after stabilisation at the testing temperature, differential measurements of lengthening, etc.) we found it necessary to construct an original machine. (author) [fr

  19. LEP vacuum chamber, prototype

    CERN Multimedia

    CERN PhotoLab

    1983-01-01

    Final prototype for the LEP vacuum chamber, see 8305170 for more details. Here we see the strips of the NEG pump, providing "distributed pumping". The strips are made from a Zr-Ti-Fe alloy. By passing an electrical current, they were heated to 700 deg C.

  20. Cryogenic vacuum pump design

    International Nuclear Information System (INIS)

    Bartlett, A.J.; Lessard, P.A.

    1984-01-01

    This paper is a review of the problems and tradeoffs involved in cryogenic vacuum pump analysis, design and manufacture. Particular attention is paid to the several issues unique to cryopumps, e.g., radiation loading, adsorption of noncondensible gases, and regeneration. A general algorithm for cryopump design is also proposed. 12 references

  1. ISR vacuum system

    CERN Multimedia

    CERN PhotoLab

    1971-01-01

    Some of the most important components of the vacuum system are shown. At the left, the rectangular box is a sputter-ion pump inside its bake-out oven. The assembly in the centre includes a sector valve, three roughing valves, a turbomolecular pump, a rotary backing pump and auxiliary equipment. At the right, the small elbow houses a Bayard-

  2. ISR vacuum system

    CERN Multimedia

    CERN PhotoLab

    1970-01-01

    A pressure of 5 x 10-11 Torr has been obtained repreatedly in this pilot section of the ISR vacuum system. The pilot section is 45 m long is pumped by 9 sputter-ion pumps pf 350 l/s pumping speed, and is baked out at 200 degrees C before each pump down.

  3. LEP Vacuum Chamber

    CERN Multimedia

    1983-01-01

    This is a cut-out of a LEP vacuum chamber for dipole magnets showing the beam channel and the pumping channel with the getter (NEG) strip and its insulating supports. A water pipe connected to the cooling channel can also be seen at the back.The lead radiation shield lining is also shown. See also 8305563X.

  4. Vacuum distilling vessel

    Energy Technology Data Exchange (ETDEWEB)

    Reik, H

    1928-12-27

    Vacuum distilling vessel for mineral oil and the like, characterized by the ring-form or polyconal stiffeners arranged inside, suitably eccentric to the casing, being held at a distance from the casing by connecting members of such a height that in the resulting space if necessary can be arranged vapor-distributing pipes and a complete removal of the residue is possible.

  5. Scroll vacuum pump

    Energy Technology Data Exchange (ETDEWEB)

    Morishita, Etsuo; Suganami, Takuya; Nishida, Mitsuhiro; Kitora, Yoshihisa; Yamamoto, Sakuei; Fujii, Kosaburo

    1988-02-25

    An effort is made to apply a scroll machine to development of a vacuum pump. In view of mechanical simplification and load patterns, the vacuum pump uses a rotating mechanism to produce paired vortices rotating around each center. Chip seal and atmospheric pressure are utilized for axial gap sealing while a spring and atmospheric pressure for the radial gap sealing. In both gaps, the sealing direction is stationary relative to the environment during rotation, making it much easier to achieve effective sealing as compared to oscillating pumps. Since the compression ratio is high in vacuum pumps, a zero top clearance form is adopted for the central portion of vortices and an gas release valve is installed in the rotating axis. A compact Oldham coupling with a small inertia force is installed behind the vortices to maintain the required phase relations between the vortices. These improvements result in a vacuum of 1 Pa for dry operation and 10/sup -2/ Pa for oil flooded operation of a single-stage scroll machine at 1800 rpm. (5 figs, 1 tab, 4 refs)

  6. On Lovelock vacuum solution

    OpenAIRE

    Dadhich, Naresh

    2010-01-01

    We show that the asymptotic large $r$ limit of all Lovelock vacuum and electrovac solutions with $\\Lambda$ is always the Einstein solution in $d \\geq 2n+1$ dimensions. It is completely free of the order $n$ of the Lovelock polynomial indicating universal asymptotic behaviour.

  7. An evaluation of the lap-shear test for Sn-rich solder/Cu couples: Experiments and simulation

    Science.gov (United States)

    Chawla, N.; Shen, Y.-L.; Deng, X.; Ege, E. S.

    2004-12-01

    The lap-shear technique is commonly used to evaluate the shear, creep, and thermal fatigue behavior of solder joints. We have conducted a parametric experimental and modeling study, on the effect of testing and geometrical parameters on solder/copper joint response in lap-shear. It was shown that the farfield applied strain is quite different from the actual solder strain (measured optically). Subtraction of the deformation of the Cu substrate provides a reasonable approximation of the solder strain in the elastic regime, but not in the plastic regime. Solder joint thickness has a profound effect on joint response. The solder response moves progressively closer to “true” shear response with increasing joint thickness. Numerical modeling using finite-element analyses were performed to rationalize the experimental findings. The same lap-shear configuration was used in the simulation. The input response for solder was based on the experimental tensile test result on bulk specimens. The calculated shear response, using both the commonly adopted far-field measure and the actual shear strain in solder, was found to be consistent with the trends observed in the lap-shear experiments. The geometric features were further explored to provide physical insight into the problem. Deformation of the substrate was found to greatly influence the shear behavior of the solder.

  8. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    OpenAIRE

    Sun, Lei; Zhang, Liang

    2015-01-01

    SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparti...

  9. Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy

    Science.gov (United States)

    Tikale, Sanjay; Prabhu, K. Narayan

    2018-05-01

    The effect of Al2O3 nanoparticles reinforcement on melting behavior, microstructure evolution at the interface and joint shear strength of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder alloy subjected to multiple reflow cycles was investigated. The reinforced SAC305 solder alloy compositions were prepared by adding Al2O3 nanoparticles in different weight fractions (0.05, 0.1, 0.3 and 0.5 wt.%) through mechanical dispersion. Cu/solder/Cu micro-lap-shear solder joint specimens were used to assess the shear strength of the solder joint. Differential scanning calorimetry was used to investigate the melting behavior of SAC305 solder nanocomposites. The solder joint interfacial microstructure was studied using scanning electron microscopy. The results showed that the increase in melting temperature (T L) and melting temperature range of the SAC305 solder alloy by addition of Al2O3 nanoparticles were not significant. In comparison with unreinforced SAC305 solder alloy, the reinforcement of 0.05-0.5 wt.% of Al2O3 nanoparticles improved the solder wettability. The addition of nanoparticles in minor quantity effectively suppressed the Cu6Sn5 IMC growth, improved the solder joint shear strength and ductility under multiple reflow cycles. However, the improvement in solder properties was less pronounced on increasing the nanoparticle content above 0.1 wt.% of the solder alloy.

  10. Design and Implementation of Temperature Controller for a Vacuum Distiller

    OpenAIRE

    Muslim, M. Aziz; N., Goegoes Dwi; F., Ahmad Salmi; R., Akhbar Prachaessardhi

    2014-01-01

    This paper proposed design and implementation of temperature controller for a vacuum distiller. The distiller is aimed to provide distillation process of bioethanol in nearly vacuum condition. Due to varying vacuum pressure, temperature have to be controlled by manipulating AC voltage to heating elements. Two arduino based control strategies have been implemented, PID control and Fuzzy Logic control. Control command from the controller was translated to AC drive using TRIAC based dimmer circu...

  11. Internal motion in high vacuum systems

    Science.gov (United States)

    Frank, J. M.

    Three transfer and positioning mechanisms have been developed for the non-air exposed, multistep processing of components in vacuum chambers. The functions to be performed in all of the systems include ultraviolet/ozone cleaning, vacuum baking, deposition of thin films, and thermocompression sealing of the enclosures. Precise positioning of the components is required during the evaporation and sealing processes. The three methods of transporting and positioning the components were developed to accommodate the design criteria and goals of each individual system. The design philosophy, goals, and operation of the three mechanisms are discussed.

  12. Instantaneous preparation of CuInSe2 films from elemental In, Cu, Se particles precursor films in a non-vacuum process

    International Nuclear Information System (INIS)

    Kaigawa, R.; Uesugi, T.; Yoshida, T.; Merdes, S.; Klenk, R.

    2009-01-01

    CuInSe 2 (CIS) films are successfully prepared by means of non-vacuum, instantaneous, direct synthesis from elemental In, Cu, Se particles precursor films without prior synthesis of CIS nanoparticle precursors and without selenization with H 2 Se or Se vapor. Our precursor films were prepared on metal substrates by spraying the solvent with added elemental In, Cu, and Se particles. Precursor films were instantaneously sintered using a spot welding machine. When the electric power was fixed to 0.6 kVA, elemental In, Cu, or Se peaks were not observed and only peaks of CIS are observed by X-ray diffraction (XRD) on the film sintered for 7/8 s. We can observe XRD peaks indicative of the chalcopyrite-type structure, such as (101), (103) and (211) diffraction peaks. We conclude that the synthesized CIS crystals have chalcopyrite-type structure with high crystallinity

  13. Cold Vacuum Drying (CVD) Facility Vacuum Purge System Chilled Water System Design Description. System 47-4

    International Nuclear Information System (INIS)

    IRWIN, J.J.

    2000-01-01

    This system design description (SDD) addresses the Vacuum Purge System Chilled Water (VPSCHW) system. The discussion that follows is limited to the VPSCHW system and its interfaces with associated systems. The reader's attention is directed to Drawings H-1-82162, Cold Vacuum Drying Facility Process Equipment Skid PandID Vacuum System, and H-1-82224, Cold Vacuum Drying Facility Mechanical Utilities Process Chilled Water PandID. Figure 1-1 shows the location and equipment arrangement for the VPSCHW system. The VPSCHW system provides chilled water to the Vacuum Purge System (VPS). The chilled water provides the ability to condense water from the multi-canister overpack (MCO) outlet gases during the MCO vacuum and purge cycles. By condensing water from the MCO purge gas, the VPS can assist in drying the contents of the MCO

  14. High current vacuum closing switch

    International Nuclear Information System (INIS)

    Dolgachev, G.I.; Maslennikov, D.D.; Romanov, A.S.; Ushakov, A.G.

    2005-01-01

    The paper proposes a powerful pulsed closing vacuum switch for high current commutation consisting of series of the vacuum diodes with near 1 mm gaps having closing time determined by the gaps shortening with the near-electrode plasmas [ru

  15. Vacuum Mechatronics And Insvection For Self-Contained Manufacturing

    Science.gov (United States)

    Belinski, Steve E.; Shirazi, Majid; Seidel, Thomas E.; Hackwood, Susan

    1990-02-01

    The vacuum environment is increasingly being used in manufacturing operations, especially in the semiconductor industry. Shrinking linewidths and feature sizes dictate that cleanliness standards become continually more strict. Studies at the Center for Robotic Systems in Microelectronics (CRSM) indicate that a controlled vacuum enclosure can provide a superior clean environment. In addition, since many microelectronic fabrication steps are already carried out under vacuum, self-contained multichamber processing systems are being developed at a rapid pace. CRSM support of these systems includes the development of a research system, the Self-contained Automated Robotic Factory (SCARF), a vacuum-compatible robot, and investigations of particulate characterization in vacuum and inspection for multichamber systems. Successful development of complex and expensive multichamber systems is, to a great extent, dependent upon the discipline called vacuum mechatronics, which includes the design and development of vacuum-compatible computer-controlled mechanisms for manipulating, sensing and testing in a vacuum environment. Here the constituents of the vacuum mechatronics discipline are defined and reviewed in the context of the importance to self-contained in-vacuum manufacturing.

  16. How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

    Science.gov (United States)

    Suhir, E.; Yi, S.; Ghaffarian, R.

    2017-03-01

    It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

  17. Effect of gap distance on tensile strength of preceramic base metal solder joints.

    Science.gov (United States)

    Fattahi, Farnaz; Motamedi, Milad

    2011-01-01

    In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. Based on ADA/ISO 9693 specifications for tensile test, 40 specimens were fabricated from a Ni-Cr alloy and cut at the midpoint of 3-mm diameter bar and placed at desired positions by a specially designed device. The specimens were divided into four groups of 10 samples according to the desired solder gap distance: Group1: 0.1mm; Group2: 0.25mm; Group3: 0.5mm; and Group4: 0.75mm. After soldering, specimens were tested for tensile strength by a universal testing machine at a cross-head speed of 0.5mm/min with a preload of 10N. The mean tensile strength values of the groups were 162, 307.8, 206.1 and 336.7 MPa, respectively. The group with 0.75-mm gap had the highest and the group with 0.1-mm gap had the lowest tensile strength. Bonferroni test showed that Group1 and Group4 had statistically different values (P=0.023), but the differences between other groups were not sig-nificant at a significance level of 0.05. There was no direct relationship between increasing soldering gap distance and tensile strength of the solder joints.

  18. The critical oxide thickness for Pb-free reflow soldering on Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Chung, C. Key [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Assembly Test Global Materials, Intel Microelectronics Asia Ltd, B1, No. 205, Tun-Hwa North Road, 10595 Taipei, Taiwan (China); Chen, Y.J.; Li, C.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Kao, C.R., E-mail: crkao@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China)

    2012-06-01

    Oxidation is an undesirable effect of reflow soldering. Non-wetting occurs when the oxide layer grows above the critical thickness. Characterizing the critical oxide thickness for soldering is challenging due to oxide's nano-scale thickness and irregular topographic surface. In this paper, the critical copper oxide thickness was characterized by Time-of-Flight Secondary Ion Mass Spectrometry, Scanning Electron Microscopy, Energy-Dispersive X-ray spectroscopy, and Transmission Electron Microscopy. Copper substrates were coated with an Organic-Solderable-Preservative (OSP) layer and baked at 150 Degree-Sign C and 85% Relative Humidity for different amounts of time. The onset of the non-wetting phenomenon occurred when the oxide thickness reached 18 {+-} 5 nm. As the oxide grew beyond this critical thickness, the percentage of non-wetting solder joint increased exponentially. The growth of the oxide thickness followed a parabolic rate law. The rate constant of oxidation was 0.6 Multiplication-Sign 10{sup -15} cm{sup 2} min{sup -1}. Oxidation resulted from interdiffusion of copper and oxygen atoms through the OSP and oxide layers. The oxidation mechanism will be presented and discussed. - Highlights: Black-Right-Pointing-Pointer Critical oxide thickness for Pb free solder on Cu substrate is 18 {+-} 5 nm. Black-Right-Pointing-Pointer Above the critical oxide, non-wet solder joint increases exponentially. Black-Right-Pointing-Pointer A maximum 13-nm oxide thickness is suggested for good solder joint. Black-Right-Pointing-Pointer Initial growth of oxide thickness is logarithmic and then parabolic after 12 nm. Black-Right-Pointing-Pointer Thick oxide (360-560 nm) is formed as pores shorten the oxidation path.

  19. Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

    Science.gov (United States)

    Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

    2018-06-01

    Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

  20. Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

    Science.gov (United States)

    Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

    2018-03-01

    Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

  1. The symmetries of the vacuum

    International Nuclear Information System (INIS)

    Fleming, H.

    1985-01-01

    The vacuum equation of state required by cosmological inflation is taken seriously as a general property of the cosmological vacuum. This correctly restricts the class of theories which admit inflation. A model of such a vacuum is presented that leads naturally to the cosmological principle. (Author) [pt

  2. Corrosion Damage Investigation of Silver-Soldered Stainless Steel Orthodontic Appliances Used in Vivo / Ocena Zniszczeń Korozyjnych Używanych In Vivo Stałych Aparatów Ortodontycznych O Połączeniach Lutowanych Na Bazie Srebra

    Directory of Open Access Journals (Sweden)

    Łępicka M.

    2015-12-01

    Full Text Available Processes of destruction of products used in orthodontic treatment, e.g. fixed orthodontic appliances, microimplants or dental prostheses considerably limit its operational lifetime and comfort and safety of patients. The objective of the research was to evaluate and assess corrosion damage to silver-soldered stainless steel rapid palatal expansion Hyrax devices. Used in vivo for 2 or 6 months, respectively, RPE (rapid palatal expansion devices were analyzed macroscopically and in a scanning electron microscope with an energy X-ray analyzer for signs of corrosion. The evaluated appliances showed discernible differences between the overall condition of the noble solders and the stainless steel elements. The Ag-rich solders were chiefly covered in corrosion pits, whereas stainless steel wires, molar bands and Hyrax screws presented corrosion-free surfaces. What is more, the EDS analysis showed differential element composition of the solders. According to the results, noble materials, such as Ag-rich solders, can corrode in a salivary environment when coupled with stainless steel. The selective leaching processes are observed.

  3. Nonperturbative QED vacuum birefringence

    Energy Technology Data Exchange (ETDEWEB)

    Denisov, V.I.; Dolgaya, E.E.; Sokolov, V.A. [Physics Department, Moscow State University,Moscow, 119991 (Russian Federation)

    2017-05-19

    In this paper we represent nonperturbative calculation for one-loop Quantum Electrodynamics (QED) vacuum birefringence in presence of strong magnetic field. The dispersion relations for electromagnetic wave propagating in strong magnetic field point to retention of vacuum birefringence even in case when the field strength greatly exceeds Sauter-Schwinger limit. This gives a possibility to extend some predictions of perturbative QED such as electromagnetic waves delay in pulsars neighbourhood or wave polarization state changing (tested in PVLAS) to arbitrary magnetic field values. Such expansion is especially important in astrophysics because magnetic fields of some pulsars and magnetars greatly exceed quantum magnetic field limit, so the estimates of perturbative QED effects in this case require clarification.

  4. Compact vacuum insulation embodiments

    Science.gov (United States)

    Benson, D.K.; Potter, T.F.

    1992-04-28

    An ultra-thin compact vacuum insulation panel is comprised of two hard, but bendable metal wall sheets closely spaced apart from each other and welded around the edges to enclose a vacuum chamber. Glass or ceramic spacers hold the wall sheets apart. The spacers can be discrete spherical beads or monolithic sheets of glass or ceramic webs with nodules protruding therefrom to form essentially point' or line' contacts with the metal wall sheets. In the case of monolithic spacers that form line' contacts, two such spacers with the line contacts running perpendicular to each other form effectively point' contacts at the intersections. Corrugations accommodate bending and expansion, tubular insulated pipes and conduits, and preferred applications are also included. 26 figs.

  5. Compact vacuum insulation

    Science.gov (United States)

    Benson, D.K.; Potter, T.F.

    1993-01-05

    An ultra-thin compact vacuum insulation panel is comprised of two hard, but bendable metal wall sheets closely spaced apart from each other and welded around the edges to enclose a vacuum chamber. Glass or ceramic spacers hold the wall sheets apart. The spacers can be discrete spherical beads or monolithic sheets of glass or ceramic webs with nodules protruding therefrom to form essentially point'' or line'' contacts with the metal wall sheets. In the case of monolithic spacers that form line'' contacts, two such spacers with the line contacts running perpendicular to each other form effectively point'' contacts at the intersections. Corrugations accommodate bending and expansion, tubular insulated pipes and conduits, and preferred applications are also included.

  6. Temperature control in vacuum

    International Nuclear Information System (INIS)

    Dearnaley, G.

    1986-01-01

    The patent concerns a method for controlling the temperature of silicon wafers (or samples), during ion beam treatment of the wafers, in a vacuum. The apparatus and method are described for irradiation and temperature control of the samples. The wafers are mounted on a drum which is rotated through the ion beam, and are additionally heated by infra-red lamps to achieve the desired temperature. (U.K.)

  7. Electroweak vacuum geometry

    International Nuclear Information System (INIS)

    Lepora, N.; Kibble, T.

    1999-01-01

    We analyse symmetry breaking in the Weinberg-Salam model paying particular attention to the underlying geometry of the theory. In this context we find two natural metrics upon the vacuum manifold: an isotropic metric associated with the scalar sector, and a squashed metric associated with the gauge sector. Physically, the interplay between these metrics gives rise to many of the non-perturbative features of Weinberg-Salam theory. (author)

  8. Vacuum inhomogeneous cosmological models

    International Nuclear Information System (INIS)

    Hanquin, J.-L.

    1984-01-01

    The author presents some results concerning the vacuum cosmological models which admit a 2-dimensional Abelian group of isometries: classifications of these space-times based on the topological nature of their space-like hypersurfaces and on their time evolution, analysis of the asymptotical behaviours at spatial infinity for hyperbolical models as well as in the neighbourhood of the singularity for the models possessing a time singularity during their evolution. (Auth.)

  9. ELETTRA vacuum system

    International Nuclear Information System (INIS)

    Bernardini, M.; Daclon, F.; Giacuzzo, F.; Miertusova, J.; Pradal, F.; Kersevan, R.

    1993-01-01

    Elettra is a third-generation synchrotron light source which is being built especially for the use of high brilliance radiation from insertion devices and bending magnets. The UHV conditions in a storage ring lead to a longer beam lifetime - one of the most important criterion. The Elettra vacuum system presents some pecularities which cannot be found in any already existing machine. The final version of bending magnet vacuum chamber is presented. After chemical and thermal conditioning the specific outgassing rate of about 1.5e-12 Torr. liters sec -1 cm -2 was obtained. A microprocessor-controlled system has been developed to perform bake-out at the uniform temperature. The etched-foil type heaters are glued to the chamber and Microtherm insulation is used. UHV pumps based on standard triode sputter-ion pumps were modified with ST 707 NEG (Non Evaporable Getter) modules. A special installation enables the resistive activation of getters and significantly increases pumping speed for hydrogen and other residual gases (except methane and argon). All these technological innovations improve vacuum conditions in Elettra storage ring and consequently also the other parameters of the light source

  10. PARAFFIN SEPARATION VACUUM DISTILLATION

    Directory of Open Access Journals (Sweden)

    Zaid A. Abdulrahman

    2013-05-01

    Full Text Available Simulated column performance curves were constructed for existing paraffin separation vacuum distillation column in LAB plant (Arab Detergent Company/Baiji-Iraq. The variables considered in this study are the thermodynamic model option, top vacuum pressure, top and bottom temperatures, feed temperature, feed composition & reflux ratio. Also simulated columns profiles for the temperature, vapor & liquid flow rates composition were constructed. Four different thermodynamic model options (SRK, TSRK, PR, and ESSO were used, affecting the results within 1-25% variation for the most cases.The simulated results show that about 2% to 8 % of paraffin (C10, C11, C12, & C13 present at the bottom stream which may cause a problem in the LAB plant. The major variations were noticed for the top temperature & the  paraffin weight fractions at bottom section with top vacuum pressure. The bottom temperature above 240 oC is not recommended because the total bottom flow rate decreases sharply, where as  the weight fraction of paraffins decrease slightly. The study gives evidence about a successful simulation with CHEMCAD

  11. Vacuum system for LHC

    International Nuclear Information System (INIS)

    Groebner, O.

    1995-01-01

    The Large Hadron Collider (LHC) which is planned at CERN will be housed in the tunnel of the Large Electron Positron collider (LEP) and will store two counter-rotating proton beams with energies of up to 7 TeV in a 27 km accelerator/storage ring with superconducting magnets. The vacuum system for the LHC will be at cryogenic temperatures (between 1.9 and 20 K) and will be exposed to synchrotron radiation emitted by the protons. A stringent limitation on the vacuum is given by the energy deposition in the superconducting coils of the magnets due to nuclear scattering of the protons on residual gas molecules because this may provoke a quench. This effect imposes an upper limit to a local region of increased gas density (e.g. a leak), while considerations of beam lifetime (100 h) will determine more stringent requirements on the average gas density. The proton beam creates ions from the residual gas which may strike the vacuum chamber with sufficient energy to lead to a pressure 'run-away' when the net ion induced desorption yield exceeds a stable limit. These dynamic pressure effects will be limited to an acceptable level by installing a perforated 'beam screen' which shields the cryopumped gas molecules at 1.9 K from synchrotron radiation and which also absorbs the synchrotron radiation power at a higher and, therefore, thermodynamically more efficient temperature. (author)

  12. Anomalous vacuum expectation values

    International Nuclear Information System (INIS)

    Suzuki, H.

    1986-01-01

    The anomalous vacuum expectation value is defined as the expectation value of a quantity that vanishes by means of the field equations. Although this value is expected to vanish in quantum systems, regularization in general produces a finite value of this quantity. Calculation of this anomalous vacuum expectation value can be carried out in the general framework of field theory. The result is derived by subtraction of divergences and by zeta-function regularization. Various anomalies are included in these anomalous vacuum expectation values. This method is useful for deriving not only the conformal, chiral, and gravitational anomalies but also the supercurrent anomaly. The supercurrent anomaly is obtained in the case of N = 1 supersymmetric Yang-Mills theory in four, six, and ten dimensions. The original form of the energy-momentum tensor and the supercurrent have anomalies in their conservation laws. But the modification of these quantities to be equivalent to the original one on-shell causes no anomaly in their conservation laws and gives rise to anomalous traces

  13. Study of physicochemical processes and parameters of regime of diffusion brazing of niobium with titanium, zirconium and vanadium

    International Nuclear Information System (INIS)

    Grishin, V.L.; Lashko, S.V.

    1986-01-01

    Physicochemical processes at diffusion brazing of niobium with titanium, zirconium and vanadium, producing continious series of solid solutions with niobium are studied. Diffusion coefficients, time of isothermal crystallization of soldered welds, as well as the duration of homogenized thermal treatment of soldered welds necessary to provide the given temperature of weld unsoldering

  14. Spent nuclear fuel project cold vacuum drying facility vacuum and purge system design description

    Energy Technology Data Exchange (ETDEWEB)

    IRWIN, J.J.

    1998-11-30

    This document provides the System Design Description (SDD) for the Cold Vacuum Drying Facility (CVDF) Vacuum and Purge System (VPS) . The SDD was developed in conjunction with HNF-SD-SNF-SAR-O02, Safety Analysis Report for the Cold Vacuum Drying Facility, Phase 2, Supporting Installation of Processing Systems (Garvin 1998), The HNF-SD-SNF-DRD-002, 1998, Cold Vacuum Drying Facility Design Requirements, and the CVDF Design Summary Report. The SDD contains general descriptions of the VPS equipment, the system functions, requirements and interfaces. The SDD provides references for design and fabrication details, operation sequences and maintenance. This SDD has been developed for the SNFP Operations Organization and shall be updated, expanded, and revised in accordance with future design, construction and startup phases of the CVDF until the CVDF final ORR is approved.

  15. Spent nuclear fuel project cold vacuum drying facility vacuum and purge system design description

    International Nuclear Information System (INIS)

    IRWIN, J.J.

    1998-01-01

    This document provides the System Design Description (SDD) for the Cold Vacuum Drying Facility (CVDF) Vacuum and Purge System (VPS) . The SDD was developed in conjunction with HNF-SD-SNF-SAR-O02, Safety Analysis Report for the Cold Vacuum Drying Facility, Phase 2, Supporting Installation of Processing Systems (Garvin 1998), The HNF-SD-SNF-DRD-002, 1998, Cold Vacuum Drying Facility Design Requirements, and the CVDF Design Summary Report. The SDD contains general descriptions of the VPS equipment, the system functions, requirements and interfaces. The SDD provides references for design and fabrication details, operation sequences and maintenance. This SDD has been developed for the SNFP Operations Organization and shall be updated, expanded, and revised in accordance with future design, construction and startup phases of the CVDF until the CVDF final ORR is approved

  16. An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates

    International Nuclear Information System (INIS)

    Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark; Vianco, Paul Thomas; Zender, Gary L.; Hlava, Paul Frank; Rejent, Jerome Andrew

    2008-01-01

    The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided the quality metrics for the Sn-Pb solder joints. Pull strengths were measured in both the as-fabricated condition and after exposure to thermal cycling (-55/125 C; 15 min hold times; 20 cycles). Extremely low pull strengths--referred to as the low pull strength phenomenon--were observed intermittently throughout the product build, resulting in added program costs, schedule delays, and a long-term reliability concern for the detector. There was no statistically significant correlation between the low pull strength phenomenon and (1) the LTCC 'sub-floor' lot; (2) grit blasting the LTCC surfaces prior to the post-process steps; (3) the post-process parameters; (4) the conductor pad height (thickness); (5) the dice soldering assembly sequence; or (5) the dice pull test sequence. Formation of an intermetallic compound (IMC)/LTCC interface caused by thick film consumption during either the soldering process or by solid-state IMC formation was not directly responsible for the low-strength phenomenon. Metallographic cross sections of solder joints from dice that exhibited the low pull strength behavior, revealed the presence of a reaction layer resulting from an interaction between Sn from the molten Sn-Pb and the glassy phase at the TKN/LTCC interface. The thick film porosity did not contribute, explicitly, to the occurrence of reaction layer. Rather, the process of printing the very thin conductor pads was too sensitive to minor thixotropic changes to ink, which resulted in

  17. An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates.

    Energy Technology Data Exchange (ETDEWEB)

    Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark; Vianco, Paul Thomas; Zender, Gary L.; Hlava, Paul Frank; Rejent, Jerome Andrew

    2008-09-01

    The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided the quality metrics for the Sn-Pb solder joints. Pull strengths were measured in both the as-fabricated condition and after exposure to thermal cycling (-55/125 C; 15 min hold times; 20 cycles). Extremely low pull strengths--referred to as the low pull strength phenomenon--were observed intermittently throughout the product build, resulting in added program costs, schedule delays, and a long-term reliability concern for the detector. There was no statistically significant correlation between the low pull strength phenomenon and (1) the LTCC 'sub-floor' lot; (2) grit blasting the LTCC surfaces prior to the post-process steps; (3) the post-process parameters; (4) the conductor pad height (thickness); (5) the dice soldering assembly sequence; or (5) the dice pull test sequence. Formation of an intermetallic compound (IMC)/LTCC interface caused by thick film consumption during either the soldering process or by solid-state IMC formation was not directly responsible for the low-strength phenomenon. Metallographic cross sections of solder joints from dice that exhibited the low pull strength behavior, revealed the presence of a reaction layer resulting from an interaction between Sn from the molten Sn-Pb and the glassy phase at the TKN/LTCC interface. The thick film porosity did not contribute, explicitly, to the occurrence of reaction layer. Rather, the process of printing the very thin conductor pads was too sensitive to minor thixotropic changes to ink, which resulted in

  18. Vacuum pumping concepts for ETF

    International Nuclear Information System (INIS)

    Homeyer, W.G.

    1980-09-01

    The Engineering Test Facility (ETF) poses unique vacuum pumping requirements due to its large size and long burn characteristics. These requirements include torus vacuum pumping initially and between burns and pumping of neutralized gas from divertor collector chambers. It was found that the requirements could be met by compound cryopumps in which molecular sieve 5A is used as the cryosorbent. The pumps, ducts, and vacuum valves required are large but fit with other ETF components and do not require major advances in vacuum pumping technology. Several additional design, analytical, and experimental studies were identified as needed to optimize designs and provide better design definition for the ETF vacuum pumping systems

  19. Chemical wiring and soldering toward all-molecule electronic circuitry.

    Science.gov (United States)

    Okawa, Yuji; Mandal, Swapan K; Hu, Chunping; Tateyama, Yoshitaka; Goedecker, Stefan; Tsukamoto, Shigeru; Hasegawa, Tsuyoshi; Gimzewski, James K; Aono, Masakazu

    2011-06-01

    Key to single-molecule electronics is connecting functional molecules to each other using conductive nanowires. This involves two issues: how to create conductive nanowires at designated positions, and how to ensure chemical bonding between the nanowires and functional molecules. Here, we present a novel method that solves both issues. Relevant functional molecules are placed on a self-assembled monolayer of diacetylene compound. A probe tip of a scanning tunneling microscope is then positioned on the molecular row of the diacetylene compound to which the functional molecule is adsorbed, and a conductive polydiacetylene nanowire is fabricated by initiating chain polymerization by stimulation with the tip. Since the front edge of chain polymerization necessarily has a reactive chemical species, the created polymer nanowire forms chemical bonding with an encountered molecular element. We name this spontaneous reaction "chemical soldering". First-principles theoretical calculations are used to investigate the structures and electronic properties of the connection. We demonstrate that two conductive polymer nanowires are connected to a single phthalocyanine molecule. A resonant tunneling diode formed by this method is discussed. © 2011 American Chemical Society

  20. Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits

    Energy Technology Data Exchange (ETDEWEB)

    Huang, Y. T.; Hsu, H. H.; Wu, Albert T., E-mail: atwu@ncu.edu.tw [Department of Chemical and Materials Engineering, National Central University, Jhongli City 320, Taiwan (China)

    2014-01-21

    Because of the miniaturization of electronic devices, the reliability of electromigration has become a major concern when shrinking the solder dimensions in flip-chip joints. Fast reaction between solders and electrodes causes intermetallic compounds (IMCs) to form, which grow rapidly and occupy entire joints when solder volumes decrease. In this study, U-grooves were fabricated on Si chips as test vehicles. An electrode-solder-electrode sandwich structure was fabricated by using lithography and electroplating. Gaps exhibiting well-defined dimensions were filled with Sn3.5Ag solders. The gaps between the copper electrodes in the test sample were limited to less than 15 μm to simulate microbumps. The samples were stressed at various current densities at 100 °C, 125 °C, and 150 °C. The morphological changes of the IMCs were observed, and the dimensions of the IMCs were measured to determine the kinetic growth of IMCs. Therefore, this study focused on the influence of back stress caused by microstructural evolution in microbumps.

  1. Effect of Preconditioning and Soldering on Failures of Chip Tantalum Capacitors

    Science.gov (United States)

    Teverovsky, Alexander A.

    2014-01-01

    Soldering of molded case tantalum capacitors can result in damage to Ta205 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture content on the probability of post-soldering electrical failures. In this work, that is based on a case history, different groups of similar types of CWR tantalum capacitors from two lots were prepared for soldering by bake, moisture saturation, and longterm storage at room conditions. Results of the testing showed that both factors: initial quality of the lot, and preconditioning affect the probability of failures. Baking before soldering was shown to be effective to prevent failures even in lots susceptible to pop-corning damage. Mechanism of failures is discussed and recommendations for pre-soldering bake are suggested based on analysis of moisture characteristics of materials used in the capacitors' design.

  2. In vitro conjunctival incision repair by temperature-controlled laser soldering.

    Science.gov (United States)

    Norman, Galia; Rabi, Yaron; Assia, Ehud; Katzir, Abraham

    2009-01-01

    The common method of closing conjunctival incisions is by suturing, which is associated with several disadvantages. It requires skill to apply and does not always provide a watertight closure, which is required in some operations (e.g., glaucoma filtration). The purpose of the present study was to evaluate laser soldering as an alternative method for closing conjunctival incisions. Conjunctival incisions of 20 ex vivo porcine eyes were laser soldered using a temperature-controlled fiberoptic laser system and an albumin mixed with indocyanine green as a solder. The control group consisted of five repaired incisions by a 10-0 nylon running suture. The leak pressure of the repaired incisions was measured. The mean leak pressure in the laser-soldered group was 132 mm Hg compared to 4 mm Hg in the sutured group. There was no statistically significant difference in both the incision's length and distance from the limbus between the groups, before and after the procedure, indicating that there was no severe thermal damage. These preliminary results clearly demonstrate that laser soldering may be a useful method for achieving an immediate watertight conjunctival wound closure. This procedure is faster and easier to apply than suturing.

  3. Nano-soldering of magnetically aligned three-dimensional nanowire networks

    International Nuclear Information System (INIS)

    Gao Fan; Gu Zhiyong

    2010-01-01

    It is extremely challenging to fabricate 3D integrated nanostructures and hybrid nanoelectronic devices. In this paper, we report a simple and efficient method to simultaneously assemble and solder nanowires into ordered 3D and electrically conductive nanowire networks. Nano-solders such as tin were fabricated onto both ends of multi-segmented nanowires by a template-assisted electrodeposition method. These nanowires were then self-assembled and soldered into large-scale 3D network structures by magnetic field assisted assembly in a liquid medium with a high boiling point. The formation of junctions/interconnects between the nanowires and the scale of the assembly were dependent on the solder reflow temperature and the strength of the magnetic field. The size of the assembled nanowire networks ranged from tens of microns to millimeters. The electrical characteristics of the 3D nanowire networks were measured by regular current-voltage (I-V) measurements using a probe station with micropositioners. Nano-solders, when combined with assembling techniques, can be used to efficiently connect and join nanowires with low contact resistance, which are very well suited for sensor integration as well as nanoelectronic device fabrication.

  4. Manufacturing and Shear Response Characterization of Carbon Nanofiber Modified CFRP Using the Out-of-Autoclave-Vacuum-Bag-Only Cure Process

    Directory of Open Access Journals (Sweden)

    Erin E. McDonald

    2014-01-01

    Full Text Available The interlaminar shear response is studied for carbon nanofiber (CNF modified out-of-autoclave-vacuum-bag-only (OOA-VBO carbon fiber reinforced plastic (CFRP. Commercial OOA-VBO prepregs were coated with a CNF modified epoxy solution and a control epoxy solution without CNF to make CNF modified samples and control samples, respectively. Tensile testingwas used to study the in-plane shear performance of [±45°]4s composite laminates. Significant difference in failure modes between the control and CNF modified CFRPs was identified. The control samples experienced half-plane interlaminar delamination, whereas the CNF modified samples experienced a localized failure in the intralaminar region. Digital image correlation (DIC surface strain results of the control sample showed no further surface strain increase along the delaminated section when the sample was further elongated prior to sample failure. On the other hand, the DIC results of the CNF modified sample showed that the surface strain increased relatively and uniformly across the CFRP as the sample was further elongated until sample failure. The failure mode evidence along with microscope pictures indicated that the CNF modification acted as a beneficial reinforcement inhibiting interlaminar delamination.

  5. Manufacturing and Shear Response Characterization of Carbon Nanofiber Modified CFRP Using the Out-of-Autoclave-Vacuum-Bag-Only Cure Process

    Science.gov (United States)

    McDonald, Erin E.; Wallace, Landon F.; Hickman, Gregory J. S.; Hsiao, Kuang-Ting

    2014-01-01

    The interlaminar shear response is studied for carbon nanofiber (CNF) modified out-of-autoclave-vacuum-bag-only (OOA-VBO) carbon fiber reinforced plastic (CFRP). Commercial OOA-VBO prepregs were coated with a CNF modified epoxy solution and a control epoxy solution without CNF to make CNF modified samples and control samples, respectively. Tensile testingwas used to study the in-plane shear performance of [±45°]4s composite laminates. Significant difference in failure modes between the control and CNF modified CFRPs was identified. The control samples experienced half-plane interlaminar delamination, whereas the CNF modified samples experienced a localized failure in the intralaminar region. Digital image correlation (DIC) surface strain results of the control sample showed no further surface strain increase along the delaminated section when the sample was further elongated prior to sample failure. On the other hand, the DIC results of the CNF modified sample showed that the surface strain increased relatively and uniformly across the CFRP as the sample was further elongated until sample failure. The failure mode evidence along with microscope pictures indicated that the CNF modification acted as a beneficial reinforcement inhibiting interlaminar delamination. PMID:24688435

  6. Manufacturing and shear response characterization of carbon nanofiber modified CFRP using the out-of-autoclave-vacuum-bag-only cure process.

    Science.gov (United States)

    McDonald, Erin E; Wallace, Landon F; Hickman, Gregory J S; Hsiao, Kuang-Ting

    2014-01-01

    The interlaminar shear response is studied for carbon nanofiber (CNF) modified out-of-autoclave-vacuum-bag-only (OOA-VBO) carbon fiber reinforced plastic (CFRP). Commercial OOA-VBO prepregs were coated with a CNF modified epoxy solution and a control epoxy solution without CNF to make CNF modified samples and control samples, respectively. Tensile testing was used to study the in-plane shear performance of [± 45°]4s composite laminates. Significant difference in failure modes between the control and CNF modified CFRPs was identified. The control samples experienced half-plane interlaminar delamination, whereas the CNF modified samples experienced a localized failure in the intralaminar region. Digital image correlation (DIC) surface strain results of the control sample showed no further surface strain increase along the delaminated section when the sample was further elongated prior to sample failure. On the other hand, the DIC results of the CNF modified sample showed that the surface strain increased relatively and uniformly across the CFRP as the sample was further elongated until sample failure. The failure mode evidence along with microscope pictures indicated that the CNF modification acted as a beneficial reinforcement inhibiting interlaminar delamination.

  7. Evaluation of synergistic effect in vacuum pack, refrigeration and irradiated treatments of minimally processed cassava; Avaliacao do efeito sinergistico da embalagem a vacuo, irradiacao e refrigeracao da mandioca minimamente processada

    Energy Technology Data Exchange (ETDEWEB)

    Pedroso, Bianca Maria

    2005-07-01

    Cassava is cultivated almost all over the world and it is considered one of the most important nutritious sources of calories in the human diet. Cassava is a viable food against starvation in several poor areas of the world because it is an extremely resistant culture and may reach satisfactory economical yield. We utilized vacuum packed industrialized cassava irradiated with 0,1 kGy, 3kGy and 5kGy and stored under refrigeration for 1, 21, 30 and 50 days. Our objective was to analyse the synergistic effect of vacuum packing, irradiation and refrigeration on the preservation of minimally processed cassava. The samples were analyzed for pH, acidity, weight, humidity, texture and color. The irradiation did not affect the chemical characteristics of the cassava. Neither the pH nor the acidity, the most relevant variables to verify deterioration in cassava, presented significant alterations during the period of storage. Comparing the irradiated treatments, the dose of 1kGy and 3kGy affected the physic-chemical characteristics of the cassava the least during the period of storage and refrigeration for 50 days; the doses of 1kGy,3kGy and 5kGy scored the highest rates the sensorial analysis during the period of storage for 21 days. (author)

  8. Multiple (Two) Met Bel 601 In Series Ultimate Vacuum Testing

    Energy Technology Data Exchange (ETDEWEB)

    Restivo, M. [Savannah River Site (SRS), Aiken, SC (United States). Savannah River National Lab. (SRNL)

    2016-09-30

    SRNL Environmental and Chemical Process Technology (E&CPT) was requested to perform testing of vacuum pumps per a verbal request from the Customer, SRNL Hydrogen Processing Technology. Tritium Operations is currently having difficulties procuring the Normetex™® Model 15 m3/hr (9 CFM) vacuum pump (formerly Normetex Pompes, now EumecaSARL). One possible solution proposed by Hydrogen Processing Technology personnel is to use two Senior Aerospace Metal Bellows MB-601 vacuum pumps piped with the heads in series, and the pumps in series (Figure 1 below). This memorandum documents the ultimate vacuum testing that was performed to determine if this concept was a viable alternate vacuum pump strategy. This testing dovetails with previous pump evaluations documented in references 1 and 2.

  9. Straw detector: 1 - Vacuum: 0

    CERN Multimedia

    Katarina Anthony

    2012-01-01

    The NA62 straw tracker is using pioneering CERN technology to measure charged particles from very rare kaon decays. For the first time, a large straw tracker with a 4.4 m2 coverage will be placed directly into an experiment’s vacuum tank, allowing physicists to measure the direction and momentum of charged particles with extreme precision. NA62 measurements using this technique will help physicists take a clear look at the kaon decay rate, which might be influenced by particles and processes that are not included in the Standard Model.   Straw ends are glued to an aluminium frame, a crucial step in the assembly of a module. The ends are then visually inspected before a leak test is performed.  “Although straw detectors have been around since the 1980s, what makes the NA62 straw trackers different is that they can work under vacuum,” explains Hans Danielsson from the PH-DT group leading the NA62 straw project. Straw detectors are basically small drift cha...

  10. High-vacuum plasma pump

    International Nuclear Information System (INIS)

    Dorodnov, A.M.; Minajchev, V.E.; Miroshkin, S.I.

    1980-01-01

    The action of an electric-arc high-vacuum pump intended for evacuating the volumes in which the operation processes are followed by a high gas evolution is considered. The operation of the pump is based on the principle of controlling the getter feed according to the gas load and effect of plasma sorbtion pumping. The pump performances are given. The starting pressure is about 5 Pa, the limiting residual pressure is about 5x10 -6 Pa, the pumping out rate of nitrogen in the pressure range 5x10 -5 -5x10 -3 Pa accounts for about 4000 l/s, the power consumption comes to 6 kW. Analyzing the results of the test operation of the pump, it has been concluded that its principal advantages are the high starting pressure, controlled getter feed rate and possibility of pumping out the gases which are usually pumped out with difficulty. The operation reliability of the pump is defined mainly by reliable operation of the ignition system of the vacuum arc [ru

  11. Gases vacuum dedusting and cooling

    Directory of Open Access Journals (Sweden)

    Alexey А. Burov

    2015-03-01

    Full Text Available Represented are the results of operating the ladle degassing vacuum plant (productivity: 120 tons of liquid steel with various dust collectors. The process gases’ cooling and dedusting, obtained in the closed loop buran study, provides opportunity to install a bag filter after that closed loop and its efficient use. Proven is the effectiveness of the cylindrical cyclone replacement with a multichannel (buran dust collector, based on a system of closed-loop (return coupling serially connected curved ducts, where the dusty gas flow rotation axis is vertically positioned. The system of closed-loop serially connected curvilinear channels creates preconditions for the emergence of a negative feedback at the curvilinear gas flow containing transit and circulating flows. These conditions are embodied with circulating flows connecting the in- and outputs of the whole system each channel. The transit flow multiple continuous filtration through the circulating dust layers leads to the formation and accumulation of particles aggregates in the collection chamber. The validity of such a dusty flow control mechanism is confirmed by experimental data obtained in a vacuum chamber. Therefore, replacing one of the two buran’s forevacuum pumps assemblies with the necessary number of curved channels (closed loop is estimated in a promising method.

  12. Rising hopes for vacuum tube collectors

    Energy Technology Data Exchange (ETDEWEB)

    Godolphin, D.

    1982-06-01

    The performance, feasibility and use of vacuum tube solar collectors for domestic hot water (DHW) systems are discussed. An introduction to the design of vacuum tube collectors is presented and comparisons are made with flat plate collectors in terms of effectiveness in DHW applications and cost. The use of vacuum tube collectors is well established for high temperature use such as process heat and absorption cooling applications; there is considerable debate concerning their use in DHW and these arguments are presented. It is pointed out that the accepted standardized comparison test (ASHRAE 93-77) is apparently biased towards the flat plate collectors in direct comparisons of collector efficiencies. Recent developments among manufacturers with regard to vacuum tube collectors and their thinking (pro and con) are discussed in some detail. Breakage and other problems are pointed out although advocates look ahead to lower costs, higher efficiencies, and broader markets (particularly in DHW). It is concluded by some that flat plate collector technology has reached its peak and that vacuum tube collectors will be very prominent in the future. (MJJ)

  13. Instability of the Kaluza-Klein vacuum

    International Nuclear Information System (INIS)

    Witten, E.

    1982-01-01

    It is argued that the ground state of the Kaluza-Klein unified theory is unstable against a process of semiclassical barrier penetration. This is related to the fact that the positive energy conjecture does not hold for the Kaluza-Klein theory; an explicit counter-example is given. The reasoning presented here assumes that in general relativity one should include manifolds of non-vacuum topology. It is argued that the existence of elementary fermions (not present in the original Kaluza-Klein theory) would stabilize the Kaluza-Klein vacuum. (orig.)

  14. Cold Vacuum Drying facility sanitary sewage collection system design description

    International Nuclear Information System (INIS)

    PITKOFF, C.C.

    1999-01-01

    This document describes the Cold Vacuum Drying Facility (CVDF) sanitary sewage collection system. The sanitary sewage collection system provides collection and storage of effluents and raw sewage from the CVDF to support the cold vacuum drying process. This system is comprised of a sanitary sewage holding tank and pipes for collection and transport of effluents to the sanitary sewage holding tank

  15. Hot-rolling metals in vacuum. Information circular

    International Nuclear Information System (INIS)

    Beall, R.A.; Worthington, R.B.; Blickensderfer, R.

    1979-01-01

    The process of hot-rolling metals, alloys, and composites in vacuum is studied. First, a comprehensive review of the literature is presented, including the advantages and disadvantages of using vacuum. Next, details of hot-rolling titanium, chromium, and molybdenum-iron bimetal are given. Finally, the design of new equipment is described

  16. Vacuum Baking To Remove Volatile Materials

    Science.gov (United States)

    Muscari, J. A.

    1985-01-01

    Outgassing reduced in some but not all nonmetallic materials. Eleven polymeric materials tested by determining outgassing species as temperature of conditioned and unconditioned materials raised to 300 degrees C. Conditioning process consisted of vacuum bake for 24 hours at 80 degrees C in addition to usual cure. Baking did not change residual gas percentage of water molecules.

  17. Quantum teleportation of entangled squeezed vacuum states

    Institute of Scientific and Technical Information of China (English)

    蔡新华

    2003-01-01

    An optical scheme for probabilistic teleporting entangled squeezed vacuum states (SVS) is proposed. In this scheme,the teleported state is a bipartite entangled SVS,and the quantum channel is a tripartite entangled SVS.The process of the teleportation is achieved by using a 50/50 symmetric beamsplitter and photon detectors with the help of classical information.

  18. Vacuum instability in a random electric field

    International Nuclear Information System (INIS)

    Krive, I.V.; Pastur, L.A.

    1984-01-01

    The reaction of the vacuum on an intense spatially homogeneous random electric field is investigated. It is shown that a stochastic electric field always causes a breakdown of the boson vacuum, and the number of pairs of particles which are created by the electric field increases exponentially in time. For the choice of potential field in the form of a dichotomic random process we find in explicit form the dependence of the average number of pairs of particles on the time of the action of the source of the stochastic field. For the fermion vacuum the average number of pairs of particles which are created by the field in the lowest order of perturbation theory in the amplitude of the random field is independent of time

  19. Materials for high vacuum technology, an overview

    CERN Document Server

    Sgobba, Stefano

    2007-01-01

    In modern accelerators stringent requirements are placed on materials of vacuum systems. Their physical and mechanical properties, machinability, weldability or brazeability are key parameters. Adequate strength, ductility, magnetic properties at room as well as low temperatures are important factors for vacuum systems of accelerators working at cryogenic temperatures, such as the Large Hadron Collider (LHC) under construction at CERN. In addition, baking or activation of Non-Evaporable Getters (NEG) at high temperatures impose specific choices of material grades of suitable tensile and creep properties in a large temperature range. Today, stainless steels are the dominant materials of vacuum constructions. Their metallurgy is extensively treated. The reasons for specific requirements in terms of metallurgical processes are detailed, in view of obtaining adequate purity, inclusion cleanliness, and fineness of the microstructure. In many cases these requirements are crucial to guarantee the final leak tightnes...

  20. Vacuum induction melting of uranium ingots

    International Nuclear Information System (INIS)

    Hussain, M.M.; Bagchi, S.N.; Singh, S.P.

    1992-01-01

    Massive uranium ingot is produced from green salt (UF 4 ) using calciothermic reduction (CTR) or magnesiothermic reduction (MTR) process. CTR process has been replaced by MTR process at Trombay due to economic considerations. This paper highlights problems associated with the vacuum induction melting of MTR ingots and the remedial measures taken to produce good quality billets. Details of metallographic examination of inclusions in ingots and billets have been incorporated. (author). 3 figs