WorldWideScience

Sample records for twenty-one sensor packages

  1. New package for CMOS sensors

    Science.gov (United States)

    Diot, Jean-Luc; Loo, Kum Weng; Moscicki, Jean-Pierre; Ng, Hun Shen; Tee, Tong Yan; Teysseyre, Jerome; Yap, Daniel

    2004-02-01

    Cost is the main drawback of existing packages for C-MOS sensors (mainly CLCC family). Alternative packages are thus developed world-wide. And in particular, S.T.Microelectronics has studied a low cost alternative packages based on QFN structure, still with a cavity. Intensive work was done to optimize the over-molding operation forming the cavity onto a metallic lead-frame (metallic lead-frame is a low cost substrate allowing very good mechanical definition of the final package). Material selection (thermo-set resin and glue for glass sealing) was done through standard reliability tests for cavity packages (Moisture Sensitivity Level 3 followed by temperature cycling, humidity storage and high temperature storage). As this package concept is new (without leads protruding the molded cavity), the effect of variation of package dimensions, as well as board lay-out design, are simulated on package life time (during temperature cycling, thermal mismatch between board and package leads to thermal fatigue of solder joints). These simulations are correlated with an experimental temperature cycling test with daisy-chain packages.

  2. Nanocomposite Sensors for Food Packaging

    Science.gov (United States)

    Avella, Maurizio; Errico, Maria Emanuela; Gentile, Gennaro; Volpe, Maria Grazia

    Nowadays nanotechnologies applied to the food packaging sector find always more applications due to a wide range of benefits that they can offer, such as improved barrier properties, improved mechanical performance, antimicrobial properties and so on. Recently many researches are addressed to the set up of new food packaging materials, in which polymer nanocomposites incorporate nanosensors, developing the so-called "smart" packaging. Some examples of nanocomposite sensors specifically realised for the food packaging industry are reported. The second part of this work deals with the preparation and characterisation of two new polymer-based nanocomposite systems that can be used as food packaging materials. Particularly the results concerning the following systems are illustrated: isotactic polypropylene (iPP) filled with CaCO3 nanoparticles and polycaprolactone (PCL) filled with SiO2 nanoparticles.

  3. Advanced Sensor Arrays and Packaging

    Energy Technology Data Exchange (ETDEWEB)

    Ryter, John Wesley [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Romero, Christopher J. [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Ramaiyan, Kannan [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Brosha, Eric L. [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2016-08-11

    Novel sensor packaging elements were designed, fabricated, and tested in order to facilitate the transition of electrochemical mixed-potential sensors toward commercialization. Of the two designs completed, the first is currently undergoing field trials, taking direct measurements within vehicle exhaust streams, while the second is undergoing preliminary laboratory testing. The sensors’ optimal operating conditions, sensitivity to hydrogen, and long-­term baseline stability were also investigated. The sensing capabilities of lanthanum chromite (La0.8Sr0.2CrO3) and indium-­doped tin oxide (ITO) working electrodes were compared, and the ITO devices were selected for pre-­commercial field trials testing at a hydrogen fuel cell vehicle fueling station in California. Previous data from that fueling station were also analyzed, and the causes of anomalous baseline drift were identified.

  4. Fire behavior sensor package remote trigger design

    Science.gov (United States)

    Dan Jimenez; Jason Forthofer; James Reardon; Bret Butler

    2007-01-01

    Fire behavior characteristics (such as temperature, radiant and total heat flux, 2- and 3-dimensional velocities, and air flow) are extremely difficult to measure insitu. Although insitu sensor packages are capable of such measurements in realtime, it is also essential to acquire video documentation as a means of better understanding the fire behavior data recorded by...

  5. Micro packaged MEMS pressure sensor for intracranial pressure measurement

    Science.gov (United States)

    Xiong, Liu; Yan, Yao; Jiahao, Ma; Yanhang, Zhang; Qian, Wang; Zhaohua, Zhang; Tianling, Ren

    2015-06-01

    This paper presents a micro packaged MEMS pressure sensor for intracranial pressure measurement which belongs to BioMEMS. It can be used in lumbar puncture surgery to measure intracranial pressure. Miniaturization is key for lumbar puncture surgery because the sensor must be small enough to allow it be placed in the reagent chamber of the lumbar puncture needle. The size of the sensor is decided by the size of the sensor chip and package. Our sensor chip is based on silicon piezoresistive effect and the size is 400 × 400 μm2. It is much smaller than the reported polymer intracranial pressure sensors such as liquid crystal polymer sensors. In terms of package, the traditional dual in-line package obviously could not match the size need, the minimal size of recently reported MEMS-based intracranial pressure sensors after packaging is 10 × 10 mm2. In this work, we are the first to introduce a quad flat no-lead package as the package form of piezoresistive intracranial pressure sensors, the whole size of the sensor is minimized to only 3 × 3 mm2. Considering the liquid measurement environment, the sensor is gummed and waterproof performance is tested; the sensitivity of the sensor is 0.9 × 10-2 mV/kPa. Project supported by the National Natural Science Foundation of China (Nos. 61025021, 61434001), and the ‘Thousands Talents’ Program for Pioneer Researchers and Its Innovation Team, China.

  6. Packaging Technologies for High Temperature Electronics and Sensors

    Science.gov (United States)

    Chen, Liangyu; Hunter, Gary W.; Neudeck, Philip G.; Beheim, Glenn M.; Spry, David J.; Meredith, Roger D.

    2013-01-01

    This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

  7. Twenty-One: a baseline for multilingual multimedia retrieval

    NARCIS (Netherlands)

    Jong, de Franciska; Hiemstra, Djoerd; Jong, de Franciska; Netter, Klaus

    1998-01-01

    In this paper we will give a short overview of the ideas underpinning the demonstrator developed within the EU-funded project Twenty-One; this system provides for the disclosure of information in a heterogeneous document environment that includes documents of different types and languages. As part o

  8. Twenty-One: a baseline for multilingual multimedia retrieval

    NARCIS (Netherlands)

    Unknown, [Unknown; Hiemstra, Djoerd; de Jong, Franciska M.G.; Netter, Klaus

    1998-01-01

    In this paper we will give a short overview of the ideas underpinning the demonstrator developed within the EU-funded project Twenty-One; this system provides for the disclosure of information in a heterogeneous document environment that includes documents of different types and languages. As part o

  9. A Wireless, Passive Sensor for Quantifying Packaged Food Quality

    Directory of Open Access Journals (Sweden)

    Keat Ghee Ong

    2007-09-01

    Full Text Available This paper describes the fabrication of a wireless, passive sensor based on aninductive-capacitive resonant circuit, and its application for in situ monitoring of thequality of dry, packaged food such as cereals, and fried and baked snacks. The sensor ismade of a planar inductor and capacitor printed on a paper substrate. To monitor foodquality, the sensor is embedded inside the food package by adhering it to the package’sinner wall; its response is remotely detected through a coil connected to a sensor reader. Asfood quality degrades due to increasing humidity inside the package, the paper substrateabsorbs water vapor, changing the capacitor’s capacitance and the sensor’s resonantfrequency. Therefore, the taste quality of the packaged food can be indirectly determined bymeasuring the change in the sensor’s resonant frequency. The novelty of this sensortechnology is its wireless and passive nature, which allows in situ determination of foodquality. In addition, the simple fabrication process and inexpensive sensor material ensure alow sensor cost, thus making this technology economically viable.

  10. Integrated multi-sensor package (IMSP) for unmanned vehicle operations

    Science.gov (United States)

    Crow, Eddie C.; Reichard, Karl; Rogan, Chris; Callen, Jeff; Seifert, Elwood

    2007-10-01

    This paper describes recent efforts to develop integrated multi-sensor payloads for small robotic platforms for improved operator situational awareness and ultimately for greater robot autonomy. The focus is on enhancements to perception through integration of electro-optic, acoustic, and other sensors for navigation and inspection. The goals are to provide easier control and operation of the robot through fusion of multiple sensor outputs, to improve interoperability of the sensor payload package across multiple platforms through the use of open standards and architectures, and to reduce integration costs by embedded sensor data processing and fusion within the sensor payload package. The solutions investigated in this project to be discussed include: improved capture, processing and display of sensor data from multiple, non-commensurate sensors; an extensible architecture to support plug and play of integrated sensor packages; built-in health, power and system status monitoring using embedded diagnostics/prognostics; sensor payload integration into standard product forms for optimized size, weight and power; and the use of the open Joint Architecture for Unmanned Systems (JAUS)/ Society of Automotive Engineers (SAE) AS-4 interoperability standard. This project is in its first of three years. This paper will discuss the applicability of each of the solutions in terms of its projected impact to reducing operational time for the robot and teleoperator.

  11. Demonstration of a prototype hydrogen sensor and electronics package

    Energy Technology Data Exchange (ETDEWEB)

    Wu, Amanda S. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Brosha, Eric [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2016-08-03

    This is a progress report for the demonstration of a prototype hydrogen sensor and electronics package. There are five tasks associated with this, and four have been completed as of August 2016: Station Demonstration and Site Recommendation, Order Sensor Equipment, Build Sensors, and Install Sensors. The final task to be completed is Sensor Demonstration and Data Analysis, and expected completion date is January 26, 2017. This progress report details each of the tasks and goes into detail about what is currently being worked on, along with the budget and planned work for July 27, 2016 to January 26, 2017.

  12. Packaged Capacitive Pressure Sensor System for Aircraft Engine Health Monitoring

    Science.gov (United States)

    Scardelletti, Maximilian C.; Zorman, Christian A.

    2016-01-01

    This paper describes the development of a packaged silicon carbide (SiC) based MEMS pressure sensor system designed specifically for a conventional turbofan engine. The electronic circuit is based on a Clapp-type oscillator that incorporates a 6H-SiC MESFET, a SiCN MEMS capacitive pressure sensor, titanate MIM capacitors, wirewound inductors, and thick film resistors. The pressure sensor serves as the capacitor in the LC tank circuit, thereby linking pressure to the resonant frequency of the oscillator. The oscillator and DC bias circuitry were fabricated on an alumina substrate and secured inside a metal housing. The packaged sensing system reliably operates at 0 to 350 psi and 25 to 540C. The system has a pressure sensitivity of 6.8 x 10E-2 MHzpsi. The packaged system shows negligible difference in frequency response between 25 and 400C. The fully packaged sensor passed standard benchtop acceptance tests and was evaluated on a flight-worthy engine.

  13. Wafer-Level Vacuum Packaging of Smart Sensors.

    Science.gov (United States)

    Hilton, Allan; Temple, Dorota S

    2016-10-31

    The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors-"low cost" for ubiquitous presence, and "smart" for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging technology of smart sensors. We describe the processes needed to create the wafer-scale vacuum microchambers, focusing on approaches that involve metal seals and that are compatible with the thermal budget of complementary metal-oxide semiconductor (CMOS) integrated circuits. We review choices of seal materials and structures that are available to a device designer, and present techniques used for the fabrication of metal seals on device and window wafers. We also analyze the deposition and activation of thin film getters needed to maintain vacuum in the ultra-small chambers, and the wafer-to-wafer bonding processes that form the hermetic seal. We discuss inherent trade-offs and challenges of each seal material set and the corresponding bonding processes. Finally, we identify areas for further research that could help broaden implementations of the wafer-level vacuum packaging technology.

  14. Validation of Underwater Sensor Package Using Feature Based SLAM

    Directory of Open Access Journals (Sweden)

    Christopher Cain

    2016-03-01

    Full Text Available Robotic vehicles working in new, unexplored environments must be able to locate themselves in the environment while constructing a picture of the objects in the environment that could act as obstacles that would prevent the vehicles from completing their desired tasks. In enclosed environments, underwater range sensors based off of acoustics suffer performance issues due to reflections. Additionally, their relatively high cost make them less than ideal for usage on low cost vehicles designed to be used underwater. In this paper we propose a sensor package composed of a downward facing camera, which is used to perform feature tracking based visual odometry, and a custom vision-based two dimensional rangefinder that can be used on low cost underwater unmanned vehicles. In order to examine the performance of this sensor package in a SLAM framework, experimental tests are performed using an unmanned ground vehicle and two feature based SLAM algorithms, the extended Kalman filter based approach and the Rao-Blackwellized, particle filter based approach, to validate the sensor package.

  15. Validation of Underwater Sensor Package Using Feature Based SLAM.

    Science.gov (United States)

    Cain, Christopher; Leonessa, Alexander

    2016-03-17

    Robotic vehicles working in new, unexplored environments must be able to locate themselves in the environment while constructing a picture of the objects in the environment that could act as obstacles that would prevent the vehicles from completing their desired tasks. In enclosed environments, underwater range sensors based off of acoustics suffer performance issues due to reflections. Additionally, their relatively high cost make them less than ideal for usage on low cost vehicles designed to be used underwater. In this paper we propose a sensor package composed of a downward facing camera, which is used to perform feature tracking based visual odometry, and a custom vision-based two dimensional rangefinder that can be used on low cost underwater unmanned vehicles. In order to examine the performance of this sensor package in a SLAM framework, experimental tests are performed using an unmanned ground vehicle and two feature based SLAM algorithms, the extended Kalman filter based approach and the Rao-Blackwellized, particle filter based approach, to validate the sensor package.

  16. Wafer-Level Vacuum Packaging of Smart Sensors

    Directory of Open Access Journals (Sweden)

    Allan Hilton

    2016-10-01

    Full Text Available The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors—“low cost” for ubiquitous presence, and “smart” for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging technology of smart sensors. We describe the processes needed to create the wafer-scale vacuum microchambers, focusing on approaches that involve metal seals and that are compatible with the thermal budget of complementary metal-oxide semiconductor (CMOS integrated circuits. We review choices of seal materials and structures that are available to a device designer, and present techniques used for the fabrication of metal seals on device and window wafers. We also analyze the deposition and activation of thin film getters needed to maintain vacuum in the ultra-small chambers, and the wafer-to-wafer bonding processes that form the hermetic seal. We discuss inherent trade-offs and challenges of each seal material set and the corresponding bonding processes. Finally, we identify areas for further research that could help broaden implementations of the wafer-level vacuum packaging technology.

  17. Ceramic thermal wind sensor based on advanced direct chip attaching package

    Science.gov (United States)

    Lin, Zhou; Ming, Qin; Shengqi, Chen; Bei, Chen

    2014-07-01

    An advanced direct chip attaching packaged two-dimensional ceramic thermal wind sensor is studied. The thermal wind sensor chip is fabricated by metal lift-off processes on the ceramic substrate. An advanced direct chip attaching (DCA) packaging is adopted and this new packaged method simplifies the processes of packaging further. Simulations of the advanced DCA packaged sensor based on computational fluid dynamics (CFD) model show the sensor can detect wind speed and direction effectively. The wind tunnel testing results show the advanced DCA packaged sensor can detect the wind direction from 0° to 360° and wind speed from 0 to 20 m/s with the error less than 0.5 m/s. The nonlinear fitting based least square method in Matlab is used to analyze the performance of the sensor.

  18. Direct media exposure of MEMS multi-sensor systems using a potted-tube packaging concept

    DEFF Research Database (Denmark)

    Hyldgård, Anders; Birkelund, Karen; Janting, Jakob;

    2008-01-01

    A packaging concept for Data Storage Tags is presented. A potted-tube packaging concept, using a polystyrene tube and different epoxies as filling material that allows for direct sensor exposure is investigated. The curing temperature, water uptake and the diffusion coefficient for water in the f......-sensor is described and effectiveness of the packaging is demonstrated with the precise measurement of water conductivity using the packaged multi-sensor. The packaging concept is very promising for high accuracy measurements in harsh environments....

  19. Packaging Technologies for 500C SiC Electronics and Sensors

    Science.gov (United States)

    Chen, Liang-Yu

    2013-01-01

    Various SiC electronics and sensors are currently under development for applications in 500C high temperature environments such as hot sections of aerospace engines and the surface of Venus. In order to conduct long-term test and eventually commercialize these SiC devices, compatible packaging technologies for the SiC electronics and sensors are required. This presentation reviews packaging technologies developed for 500C SiC electronics and sensors to address both component and subsystem level packaging needs for high temperature environments. The packaging system for high temperature SiC electronics includes ceramic chip-level packages, ceramic printed circuit boards (PCBs), and edge-connectors. High temperature durable die-attach and precious metal wire-bonding are used in the chip-level packaging process. A high temperature sensor package is specifically designed to address high temperature micro-fabricated capacitive pressure sensors for high differential pressure environments. This presentation describes development of these electronics and sensor packaging technologies, including some testing results of SiC electronics and capacitive pressure sensors using these packaging technologies.

  20. Low Temperature Characteristics of FBG Temperature Sensors with Small-size Packaging

    Institute of Scientific and Technical Information of China (English)

    GUO Ming-jin; JIANG De-sheng

    2006-01-01

    Two small-size package methods, thin stainless steel tube based package method and plating gold based package method for fiber Bragg grating(FBG) temperature sensors, are designed. The characteristics of the FBG temperature sensors in the environment temperature between 203K and 243K are investigated. The wavelengths of the FBG temperature sensors as a function of the temperature are examined experimentally. The experiment results of the two different small-size package sensors in identical conditions are compared with each other. The transmission spectrum of the sensors is analyzed at the temperature of 273K and 213K. The temperature sensitive factors of the sensors are derived analytically and are verified by experiments. Linear fitting to the wavelength-temperature curve is carried out.

  1. Sensor Fish: an autonomous sensor package for characterizing complex flow fields and fish passage

    Energy Technology Data Exchange (ETDEWEB)

    Deng, Zhiqun; Martinez, Jayson J.; Lu, Jun

    2016-10-04

    Fish passing through dams or other hydraulic structures may be injured or killed despite advances in turbine design, project operations, and other fish bypass systems. The Sensor Fish (SF) device is an autonomous sensor package that characterizes the physical conditions and stressors to which fish are exposed during passage through hydro facilities. It was designed to move passively as a neutrally buoyant object through severe hydraulic environments, while collecting high-resolution sensor data. Since its first generation1, the SF device has been successfully deployed in many fish passage studies and has evolved to be a major tool for characterizing fish passage conditions during fish passage in the Columbia River Basin. To better accelerate hydropower development, the U.S. Department of Energy Water Power Program provided funding to develop a new generation (Gen 2 SF) to incorporate more capabilities and accommodate a wider range of users over a broader range of turbine designs and operating environments. The Gen 2 SF (Figure 1) is approximately the size and density of a yearling salmon smolt and is nearly neutrally buoyant. It contains three-dimensional (3D) rotation sensors, 3D linear acceleration sensors, a pressure sensor, a temperature sensor, a 3D orientation sensor, a radiofrequency (RF) transmitter, and a recovery module2. A low-power microcontroller collects data from the sensors and stores up to 5 min of data on internal flash memory at a sampling frequency of 2048 Hz. The recovery module makes the SF positively buoyant after a pre-programmed period of time, causing it to float to the surface for recovery.

  2. A Reliability Test on PBGA Packaging Through Piezoresistive Stress Sensor

    OpenAIRE

    Liu, C.-H.; Chung, H.; Yang, D.-W.; Tseng, K.-F.; Lwo, B.-J.

    2009-01-01

    ISBN: 978-2-35500-009-6; Plastic packaging is the mainstream on microelectronic packaging technology at present. As the continuous requirements for smaller but higher density products, failure and reliability issues on MEMS/MOEMS packaging because of the hygroscopic swelling mismatch stress become more and more serious. To this end, this paper presented the stress monitoring methodologies as well as the reliability tests on a typical PBGA (Plastic Ball-Grid-Array) packaging due to hygroscopic...

  3. Sensors and packages based on LTCC and thick-film technology for severe conditions

    Indian Academy of Sciences (India)

    C Jacq; Th Maeder; P Ryser

    2009-08-01

    Reliable operation in harsh environments such as high temperatures, high pressures, aggressive media and space, poses special requirements for sensors and packages, which usually cannot be met using polymer-based technologies. Ceramic technologies, especially LTCC (Low-Temperature Cofired Ceramic), offer a reliable platform to build hermetic, highly stable and reliable sensors and packages. This is illustrated in the present work through several such devices. The examples are discussed in terms of performance, reliability, manufacturability and cost issues.

  4. Application of Tube-Packaged FBG Strain Sensor in Vibration Experiment of Submarine Pipeline Model

    Institute of Scientific and Technical Information of China (English)

    2006-01-01

    Optical fiber sensors have received increasing attention in the fields of aeronautic and civil engineering for their superior ability to stand explosion, immunity to electromagnetic interference and high accuracy, especially fit for measurement applications in harsh environment. In this study, a novel FBG (fiber Bragg grating) strain sensor, which is packaged in a 1.2 mm stainless steel tube with epoxy resin, is developed. Experiments are conducted on the universal material testing machine to calibrate its strain transferring characteristics. The sensor has the advantages of small size, high precision and flexible use, and exhibits promising potentials. Five tube-packaged strain FBG sensors have been applied to the vibration experiment of a submarine pipeline model. The strain measured with the FBG sensor agrees well with that measured with the electric resistance strain sensor.

  5. Twenty-One Ways to Use Music in Teaching the Language Arts.

    Science.gov (United States)

    Cardarelli, Aldo F.

    Twenty-one activities that integrate music and the language arts in order to capitalize on children's interests are described in this paper. Topics of the activities are as follows: alphabetical order, pantomime, vocabulary building from words of a favorite song, words that are "the most (whatever)" from songs, mood words, a configuration clue…

  6. An investigation of twenty-one cases of low-frequency noise complaints

    DEFF Research Database (Denmark)

    Pedersen, Christian Sejer; Møller, Henrik; Persson-Waye, Kerstin

    2007-01-01

    Twenty-one cases of low-frequency noise complaints were thoroughly investigated with the aim of answering the question whether it is real physical sound or low-frequency tinnitus that causes the annoyance. Noise recordings were made in the homes of the complainants taking the spatial variation...

  7. Twenty-One: cross-language disclosure and retrieval of multimedia documents on sustainable development

    NARCIS (Netherlands)

    Stal, ter W.G.; Beijert, J.-H.; Bruin, de G.; Gent, van J.; Jong, de F.M.G.; Kraaij, W.; Netter, K.; Smart, G.

    1998-01-01

    The Twenty-One project brings together environmental organisations, technology providers and research institutes from several European countries. The main objective of the project is to make documents on environmental issues—in particular, on the subject of sustainable development—available on CD-RO

  8. Low Cost, Vacuum Packaging of GN&C Sensors Project

    Data.gov (United States)

    National Aeronautics and Space Administration — Micro-electro-mechanical System (MEMS)-based gyroscopes, accelerometers and rate sensors are essential to miniaturizing the guidance, navigation and control...

  9. Low-Power Radio and Image-Sensor Package Project

    Data.gov (United States)

    National Aeronautics and Space Administration — One of the most effective sensor modalities for situational awareness is imagery. While typically high bandwidth and relegated to analog wireless communications,...

  10. Isolated Solid-State Packaging Technology of High-Temperature Pressure Sensor

    Institute of Scientific and Technical Information of China (English)

    张生才; 金鹏; 姚素英; 赵毅强; 曲宏伟

    2003-01-01

    The principle of miniature isolated solid-state encapsulation technology of high-temperature pressure sensor and the structure of packaging are discussed, including static electricity bonding, stainless steel diaphragm selection and rippled design, laser welding, silicon oil infilling, isolation and other techniques used in sensor packaging, which can affect the performance of the sensor. By adopting stainless steel diaphragm and high-temperature silicon oil as isolation materials, not only the encapsulation of the sensor is as small as 15 mm in diameter and under 1 mA drive, its full range output is 72 mV and zero stability is 0.48% F.S/mon, but also the reliability of the sensor is improved and its application is widely broadened.

  11. First-time demonstration of measuring concrete prestress levels with metal packaged fibre optic sensors

    Science.gov (United States)

    Mckeeman, I.; Fusiek, G.; Perry, M.; Johnston, M.; Saafi, M.; Niewczas, P.; Walsh, M.; Khan, S.

    2016-09-01

    In this work we present the first large-scale demonstration of metal packaged fibre Bragg grating sensors developed to monitor prestress levels in prestressed concrete. To validate the technology, strain and temperature sensors were mounted on steel prestressing strands in concrete beams and stressed up to 60% of the ultimate tensile strength of the strand. We discuss the methods and calibration procedures used to fabricate and attach the temperature and strain sensors. The use of induction brazing for packaging the fibre Bragg gratings and welding the sensors to prestressing strands eliminates the use of epoxy, making the technique suitable for high-stress monitoring in an irradiated, harsh industrial environment. Initial results based on the first week of data after stressing the beams show the strain sensors are able to monitor prestress levels in ambient conditions.

  12. Systematic study of packaging designs on the performance of CMOS thermoresistive micro calorimetric flow sensors

    Science.gov (United States)

    Xu, Wei; Pan, Liang; Gao, Bo; Chiu, Yi; Xu, Kun; Lee, Yi-Kuen

    2017-08-01

    We systematically study the effect of two packaging configurations for the CMOS thermoresistive micro calorimetric flow (TMCF) sensors: S-type with the sensor chip protrusion-mounted on the flow channel wall and E-type with the sensor chip flush-mounted on the flow channel wall. Although the experimental results indicated that the sensitivity of the S-type was increased by more than 30%; the corresponding flow range as compared to the E-type was dramatically reduced by 60% from 0-11 m s-1 to 0-4.5 m s-1. Comprehensive 2D CFD simulation and in-house developed 3D numerical simulations based on the gas-kinetic scheme were applied to study the flow separation of these two packaging designs with the major parameters. Indeed, the S-type design with the large protrusion would change the local convective heat transfer of the TMCF sensor and dramatically decrease the sensors’ performance. In addition, parametric CFD simulations of the packaging designs provide inspiration to propose a novel general flow regime map (FRM), i.e. normalized protrusion d * versus reduced chip Reynolds number Re*, where the critical boundary curve for the flow separation of TMCF sensors was determined at different channel aspect ratios. The proposed FRM can be a useful guideline for the packaging design and manufacturing of different micro thermal flow sensors.

  13. System-in Package of Integrated Humidity Sensor Using CMOS-MEMS Technology.

    Science.gov (United States)

    Lee, Sung Pil

    2015-10-01

    Temperature/humidity microchips with micropump were fabricated using a CMOS-MEMS process and combined with ZigBee modules to implement a sensor system in package (SIP) for a ubiquitous sensor network (USN) and/or a wireless communication system. The current of a diode temperature sensor to temperature and a normalized current of FET humidity sensor to relative humidity showed linear characteristics, respectively, and the use of the micropump has enabled a faster response. A wireless reception module using the same protocol as that in transmission systems processed the received data within 10 m and showed temperature and humidity values in the display.

  14. Continuous allosteric regulation of a viral packaging motor by a sensor that detects the density and conformation of packaged DNA.

    Science.gov (United States)

    Berndsen, Zachary T; Keller, Nicholas; Smith, Douglas E

    2015-01-20

    We report evidence for an unconventional type of allosteric regulation of a biomotor. We show that the genome-packaging motor of phage ϕ29 is regulated by a sensor that detects the density and conformation of the DNA packaged inside the viral capsid, and slows the motor by a mechanism distinct from the effect of a direct load force on the motor. Specifically, we show that motor-ATP interactions are regulated by a signal that is propagated allosterically from inside the viral shell to the motor mounted on the outside. This signal continuously regulates the motor speed and pausing in response to changes in either density or conformation of the packaged DNA, and slows the motor before the buildup of large forces resisting DNA confinement. Analysis of motor slipping reveals that the force resisting packaging remains low (<1 pN) until ∼ 70% and then rises sharply to ∼ 23 pN at high filling, which is a several-fold lower value than was previously estimated under the assumption that force alone slows the motor. These findings are consistent with recent studies of the stepping kinetics of the motor. The allosteric regulatory mechanism we report allows double-stranded DNA viruses to achieve rapid, high-density packing of their genomes by limiting the buildup of nonequilibrium load forces on the motor.

  15. Vacuum-packaged piezoelectric vibration energy harvesters: damping contributions and autonomy for a wireless sensor system

    Science.gov (United States)

    Elfrink, R.; Renaud, M.; Kamel, T. M.; de Nooijer, C.; Jambunathan, M.; Goedbloed, M.; Hohlfeld, D.; Matova, S.; Pop, V.; Caballero, L.; van Schaijk, R.

    2010-10-01

    This paper describes the characterization of thin-film MEMS vibration energy harvesters based on aluminum nitride as piezoelectric material. A record output power of 85 µW is measured. The parasitic-damping and the energy-harvesting performances of unpackaged and packaged devices are investigated. Vacuum and atmospheric pressure levels are considered for the packaged devices. When dealing with packaged devices, it is found that vacuum packaging is essential for maximizing the output power. Therefore, a wafer-scale vacuum package process is developed. The energy harvesters are used to power a small prototype (1 cm3 volume) of a wireless autonomous sensor system. The average power consumption of the whole system is less than 10 µW, and it is continuously provided by the vibration energy harvester.

  16. Development of on package indicator sensor for real-time monitoring of meat quality

    Directory of Open Access Journals (Sweden)

    Vivek Shukla

    2015-03-01

    Full Text Available Aim: The aim was to develop an indicator sensor for real-time monitoring of meat quality and to compare the response of indicator sensor with meat quality parameters at ambient temperature. Materials and Methods: Indicator sensor was prepared using bromophenol blue (1% w/v as indicator solution and filter paper as indicator carrier. Indicator sensor was fabricated by coating indicator solution onto carrier by centrifugation. To observe the response of indicator sensor buffalo meat was packed in polystyrene foam trays covered with PVC film and indicator sensor was attached to the inner side of packaging film. The pattern of color change in indicator sensor was monitored and compared with meat quality parameters viz. total volatile basic nitrogen, D-glucose, standard plate count and tyrosine value to correlate ability of indicator sensor for its suitability to predict the meat quality and storage life. Results: The indicator sensor changed its color from yellow to blue starting from margins during the storage period of 24 h at ambient temperature and this correlated well with changes in meat quality parameters. Conclusions: The indicator sensor can be used for real-time monitoring of meat quality as the color of indicator sensor changed from yellow to blue starting from margins when meat deteriorates with advancement of the storage period. Thus by observing the color of indicator sensor quality of meat and shelf life can be predicted.

  17. Micro digital sun sensor: system in a package

    NARCIS (Netherlands)

    Boom, C.W. de; Leijtens, J.A.P.; Duivenbode, L.M.H. van; Heiden, N. van der

    2004-01-01

    A novel micro Digital Sun Sensor (μDSS) is under development in the frame of a micro systems technology (MST) development program (Microned) from the Dutch Ministry of Economic Affairs. Use of available micro system technologies in combination with the implementation of a dedicated solarcell for pow

  18. Sensor packaging design for continuous underfoot load monitoring.

    Science.gov (United States)

    North, Kylee; Kubiak, Erik N; Hitchcock, Robert W

    2012-02-01

    Continuous force measurement can provide valuable insight to the efficacy of limb loading regimes during fracture rehabilitation. Currently there is no load monitoring device that is capable of more than 1 h of continuous recording. To enable continuous underfoot load monitoring a piezoresistive pressure sensor was encapsulated in a non-compressible silicone gel. This basic approach to signal transduction was implemented in three continuous underfoot load sensor designs. Design I constrained the gel in a rigid urethane housing. Design II constrained the gel in a silicone elastomer bladder. Design III utilized a hybrid approach by constraining the gel with a rigid upperplate inside of an elastomeric bladder. All three designs were subjected to bench and human testing. Design I outperformed the other two designs showing high linearity (correlation coefficient of 1), low static drift (<1%) and low dynamic drift (<3%) and captured the largest percentage of weight during human testing (35%). The sensor was designed, tested and shown to be durable and accurate for a 2 week window of time. This sensor has the low cost and high performance required for large scale clinical tests to correlate limb loading and fracture healing rates.

  19. Micro digital sun sensor: system in a package

    NARCIS (Netherlands)

    Boom, C.W. de; Leijtens, J.A.P.; Duivenbode, L.M.H. van; Heiden, N. van der

    2004-01-01

    A novel micro Digital Sun Sensor (μDSS) is under development in the frame of a micro systems technology (MST) development program (Microned) from the Dutch Ministry of Economic Affairs. Use of available micro system technologies in combination with the implementation of a dedicated solarcell for pow

  20. Micro digital sun sensor: system in a package

    NARCIS (Netherlands)

    Boom, C.W. de; Leijtens, J.A.P.; Duivenbode, L.M.H. van; Heiden, N. van der

    2004-01-01

    A novel micro Digital Sun Sensor (μDSS) is under development in the frame of a micro systems technology (MST) development program (Microned) from the Dutch Ministry of Economic Affairs. Use of available micro system technologies in combination with the implementation of a dedicated solarcell for

  1. Low temperature co-fired ceramic packaging of CMOS capacitive sensor chip towards cell viability monitoring

    Directory of Open Access Journals (Sweden)

    Niina Halonen

    2016-11-01

    Full Text Available Cell viability monitoring is an important part of biosafety evaluation for the detection of toxic effects on cells caused by nanomaterials, preferably by label-free, noninvasive, fast, and cost effective methods. These requirements can be met by monitoring cell viability with a capacitance-sensing integrated circuit (IC microchip. The capacitance provides a measurement of the surface attachment of adherent cells as an indication of their health status. However, the moist, warm, and corrosive biological environment requires reliable packaging of the sensor chip. In this work, a second generation of low temperature co-fired ceramic (LTCC technology was combined with flip-chip bonding to provide a durable package compatible with cell culture. The LTCC-packaged sensor chip was integrated with a printed circuit board, data acquisition device, and measurement-controlling software. The packaged sensor chip functioned well in the presence of cell medium and cells, with output voltages depending on the medium above the capacitors. Moreover, the manufacturing of microfluidic channels in the LTCC package was demonstrated.

  2. Demonstration of a Prototype Hydrogen Sensor and Electronics Package - Progress Report 2

    Energy Technology Data Exchange (ETDEWEB)

    Wu, Amanda S. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Brosha, Eric [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2016-06-14

    This is the second progress report on the demonstration of a prototype hydrogen sensor and electronics package. It goes into detail about the five tasks, four of which are already completed as of August 2016, with the final to be completed by January 26, 2017. Then the budget is detailed along with the planned work for May 27, 2016 to July 27, 2016.

  3. Design and synthesis of a packaging polymer enhancing the sensitivity of fiber grating pressure sensor

    Institute of Scientific and Technical Information of China (English)

    Qingzhen Wen; Jinhua Zhu; Shenguang Gong; Junbin Huang; Hongcan Gu; Peizhong Zhao

    2008-01-01

    A packaging polymer (PP-1) that can enhance the sensitivity of fiber Bragg grating (FBG) pressure sensor was designed and synthe-sized from hydroxyl terminated polypropylene oxide oligomers, toluene diisocyanate (TDI), 1,4-butandiol as chain extender, catalyzer,foam agent and foam stabilizer. The testing results show that the Young's modulus, Poisson's ratio of the packaging polymer are 9.0×106N m-2 and 0.49, respectively. The static pressure sensitivity of fiber optical Bragg gratings packaged by PP-1 was discussed.The theoretical pressure sensitivity of FBG packaged with the polymer cylinder is -1.73×10-3 Mpa-1, which is 896 times of that of the bare FBG (-1.93×10-6MPa-1). And its measured pressure sensitivity is -1.10×10-3 Mpa-1, which is 558 times of that of the bare FBG.

  4. Advanced parametrical modelling of 24 GHz radar sensor IC packaging components

    Science.gov (United States)

    Kazemzadeh, R.; John, W.; Wellmann, J.; Bala, U. B.; Thiede, A.

    2011-08-01

    This paper deals with the development of an advanced parametrical modelling concept for packaging components of a 24 GHz radar sensor IC used in automotive driver assistance systems. For fast and efficient design of packages for system-in-package modules (SiP), a simplified model for the description of parasitic electromagnetic effects within the package is desirable, as 3-D field computation becomes inefficient due to the high density of conductive elements of the various signal paths in the package. By using lumped element models for the characterization of the conductive components, a fast indication of the design's signal-quality can be gained, but so far does not offer enough flexibility to cover the whole range of geometric arrangements of signal paths in a contemporary package. This work pursues to meet the challenge of developing a flexible and fast package modelling concept by defining parametric lumped-element models for all basic signal path components, e.g. bond wires, vias, strip lines, bumps and balls.

  5. Performance of a Polymer-Based Sensor Package at Extreme Temperature

    Science.gov (United States)

    Lahokallio, Sanna; Hoikkanen, Maija; Marttila, Tuomas; Vuorinen, Jyrki; Kiilunen, Janne; Frisk, Laura

    2016-02-01

    There is an increasing need for inexpensive packaging structures for demanding industrial electronics applications. This paper studies the usability of a polymer-based sensor package at very high temperatures. Resistance-based temperature sensors were attached with polymer-based electrically conductive adhesives (ECAs) onto flexible polyimide (PI) printed circuit boards (PCB). The materials used in the structure were not specifically designed for high temperature use. However, they were all commercial materials, easily available and typically reliable under normal use conditions of consumer electronics. The samples were aged at 240°C and electrically monitored during the test. Electrically, the sensor samples were observed to fail after 100 h of aging. However, material characterisation revealed that the materials started to degrade much earlier. The adhesive layer in the PI PCB and the ECA materials started to degrade after just 30 h of aging at 240°C, and mechanically the materials were observed to become brittle, making them prone to cracking and delamination. The results showed that such a polymer package is usable at 240°C for relatively short exposure times, but under longer exposure times the mechanical reliability of the package deteriorates and this needs to be taken into account.

  6. Feasibility Study on Packaged FBG Sensors for Debonding Monitoring of Composite Wind Turbine Blade

    Energy Technology Data Exchange (ETDEWEB)

    Kwon, Il Bum; Choi, Ki Sun; Kim, Geun Jin; Kim, Dong Jin; Huh, Yong Hak; Yoon, Dong Jin [Korea Research Institute of Standards and Science, Daejeon (Korea, Republic of)

    2011-08-15

    Smart sensors embedable in composite wind turbine blades have been required to be researched for monitoring the health status of large wind turbine blades during real-time operation. In this research, the feasibility of packaged FBG sensor probes was studied through the experiments of composite blade trailing edge specimens in order to detect cracking and debonding damages. The instants of cracking and debonding generated in the shear web were confirmed by rapid changes of the wavelength shifts from the bare FBG sensor probes. Packaged FBG sensor probes were proposed to remove the fragile property of bare FBG sensor probes attached on composite wind blade specimens. Strain and temperature sensitivity of fabricated probes installed on the skin of blade specimen were almost equal to those of a bare FBG sensor. Strain sensitivity was measured to be /pm in a strain range from to 0 to 600 , and the calculated temperature sensitivity was to be 48 pm/ in the heating test up to 80 degree.

  7. Development of a self-packaged 2D MEMS thermal wind sensor for low power applications

    Science.gov (United States)

    Zhu, Yan-qing; Chen, Bei; Qin, Ming; Huang, Jian-qiu; Huang, Qing-an

    2015-08-01

    This article describes the design, fabrication, and testing of a self-packaged 2D thermal wind sensor. The sensor consists of four heaters and nine thermistors. A central thermistor senses the average heater temperature, whereas the other eight, which are distributed symmetrically around the heaters, measure the temperature differences between the upstream and downstream surface of the sensor. The sensor was realized on one side of a silicon-in-glass (SIG) substrate. Vertical silicon vias in the substrate ensure good thermal contact between the sensor and the airflow and the glass effectively isolates the heaters from the thermistors. The substrate was fabricated by using a glass reflow process, after which the sensor was realized by a lift-off process. The sensor’s geometry was investigated with the help of simulations. These show that narrow heaters, moderate heater spacing, and thin substrates all improve the sensor’s sensitivity. Finally, the sensor was tested and calibrated in a wind tunnel by using a linear interpolation algorithm. At a constant heating power of 24.5 mW, measurement results show that the sensor can detect airflow speeds of up to 25 m s-1, with an accuracy of 0.1 m s-1 at low speeds and 0.5 m s-1 at high speeds. Airflow direction can be determined in a range of 360° with an accuracy of ±6°.

  8. Packaged FBG sensors for real-time stress monitoring on deep-water riser

    Science.gov (United States)

    Xu, Jian; Yang, Dexing; Jiang, Yajun; Wang, Meirong; Zhai, Huailun; Bai, Yang

    2014-11-01

    The safety of under-water risers in drilling platform is of great significance. A packaged fiber Bragg grating (FBG) sensor for real-time stress monitoring is designed for the applications on oil drilling risers under 3000 meters deep water. A copper tube which is the main component of the sensor has a small hole along its axes and a groove at its each end. The bare FBG is passed through the small hole and fixed to its ends by epoxy resin. Then the copper tube is packaged by filling the groove with structural adhesive. In order to avoid that the outer water-pressure is applied on the epoxy resin through the structural adhesive, a gap between the two types of glues is left. The relationships between the stress of the riser and the tension, pressure, temperature of the single sensor are discussed, respectively. The measured tension sensitivity is 136.75 pm/KN while the minimum R-square value is 0.99997. The experimental results also show that there is a good linear response between water-pressure and the Bragg wavelength from 0 to 30MPa, and the sensor can even survive under the pressure more than 30MPa. In addition, the Bragg wavelength shifts linearly with the increasing temperature from 0 to 40°C. So, the pressure and temperature can be easily compensated if another sensor without tension is used.

  9. Demonstration of a Packaged Capacitive Pressure Sensor System Suitable for Jet Turbofan Engine Health Monitoring

    Science.gov (United States)

    Scardelletti, Maximilian C.; Jordan, Jennifer L.; Meredith, Roger D.; Harsh, Kevin; Pilant, Evan; Usrey, Michael W.; Beheim, Glenn M.; Hunter, Gary W.; Zorman, Christian A.

    2016-01-01

    In this paper, the development and characterization of a packaged pressure sensor system suitable for jet engine health monitoring is demonstrated. The sensing system operates from 97 to 117 MHz over a pressure range from 0 to 350 psi and a temperature range from 25 to 500 deg. The sensing system consists of a Clapp-type oscillator that is fabricated on an alumina substrate and is comprised of a Cree SiC MESFET, MIM capacitors, a wire-wound inductor, chip resistors and a SiCN capacitive pressure sensor. The pressure sensor is located in the LC tank circuit of the oscillator so that a change in pressure causes a change in capacitance, thus changing the resonant frequency of the sensing system. The chip resistors, wire-wound inductors and MIM capacitors have all been characterized at temperature and operational frequency, and perform with less than 5% variance in electrical performance. The measured capacitive pressure sensing system agrees very well with simulated results. The packaged pressure sensing system is specifically designed to measure the pressure on a jet turbofan engine. The packaged system can be installed by way of borescope plug adaptor fitted to a borescope port exposed to the gas path of a turbofan engine.

  10. Twenty-one years of child advocacy: an editorial retrospective of the Teuscher years.

    Science.gov (United States)

    Kohn, D W

    1990-01-01

    On the eleventh anniversary of his Editorship of JDC, Dr. George Teuscher took stock of the state of the Journal, noting progress made and challenges ahead, writing that, "A good journal cannot ride on its reputation... Constant effort to improve, resourcefulness, and prolific reading and study are required of the editor of a prestigious journal." He has written extensively on the importance of writing and effective communication in the face of an information explosion, stating that, "The journal is still the best means of presenting new information to the professions." Writing a note of encouragement to the editor of a new dental journal, he observed, "Of course the dental and medical literature can boast of some great editors, who earned their reputations because they were able to apply intelligence, writing ability, knowledge of the scientific method, and imagination to a new undertaking." After twenty-one years, it is safe to say that Dr. Teuscher is such an Editor; he has filled our minds with knowledge and our hearts with wisdom; he has reminded us of the best that is in us; he has helped us to feel the anguish of the afflicted and oppressed; he has brought knowledge and skill to help the infirm: and he has taught us to stand in awe before the mystery of being.

  11. Light-Weight Sensor Package for Precision 3d Measurement with Micro Uavs E.G. Power-Line Monitoring

    Science.gov (United States)

    Kuhnert, K.-D.; Kuhnert, L.

    2013-08-01

    The paper describes a new sensor package for micro or mini UAVs and one application that has been successfully implemented with this sensor package. It is intended for 3D measurement of landscape or large outdoor structures for mapping or monitoring purposes. The package can be composed modularly into several configurations. It may contain a laser-scanner, camera, IMU, GPS and other sensors as required by the application. Also different products of the same sensor type have been integrated. Always it contains its own computing infrastructure and may be used for intelligent navigation, too. It can be operated in cooperation with different drones but also completely independent of the type of drone it is attached to. To show the usability of the system, an application in monitoring high-voltage power lines that has been successfully realised with the package is described in detail.

  12. Package analysis of 3D-printed piezoresistive strain gauge sensors

    Science.gov (United States)

    Das, Sumit Kumar; Baptist, Joshua R.; Sahasrabuddhe, Ritvij; Lee, Woo H.; Popa, Dan O.

    2016-05-01

    Poly(3,4-ethyle- nedioxythiophene)-poly(styrenesulfonate) or PEDOT:PSS is a flexible polymer which exhibits piezo-resistive properties when subjected to structural deformation. PEDOT:PSS has a high conductivity and thermal stability which makes it an ideal candidate for use as a pressure sensor. Applications of this technology includes whole body robot skin that can increase the safety and physical collaboration of robots in close proximity to humans. In this paper, we present a finite element model of strain gauge touch sensors which have been 3D-printed onto Kapton and silicone substrates using Electro-Hydro-Dynamic ink-jetting. Simulations of the piezoresistive and structural model for the entire packaged sensor was carried out using COMSOLR , and compared with experimental results for validation. The model will be useful in designing future robot skin with predictable performances.

  13. Malignant ovarian tumors complicating pregnancy:a clinicopathological study of twenty-one cases

    Institute of Scientific and Technical Information of China (English)

    Zhao Xue-ying; Huang Hui-fang; Lian Li-juan

    2004-01-01

    Objective: To study the clinicopathological characters of malignant ovarian tumors during pregnancy. The rationale for appropriate management was discussed.Methods: Twenty-one cases of malignant ovarian tumors complicating pregnancy treated between 1985 and 2002 were reviewed retrospectively. In reference with the reports from the current literatures, the rationale of the treatment for the best outcome of both mother and child was discussed.Results:In the patients reviewed, 9 were found with malignant germ cell tumors of the ovary, 6 with low malignant potential tumors, 4 with invasive epithelial tumors, and 2 with sex cord-stromal tumors. Sixteen (76.2 %) of the patients diagnosed in stage I, and all had achieved complete response to the treatment. Three of the four patients in advanced stage died, of which two were invasive epithelial cancers and one stage Ⅳ endodermal sinus tumor. All patients had surgery, and fourteen of them got conservative surgery. All sixteen patients accepted for chemotherapy took adjuvant chemotherapies after abortions or deliveries. Fourteen healthy live births were recorded in this group and there were no documented birth defects, but one died of respiratory distress syndrome.Conclusion: The managements of malignant ovarian cancers during pregnancy differed in different histological types. In ovarian borderline tumors and malignant germ cell tumors including stage Ⅰ, Ⅱ, and Ⅲ, surgery can be conservative. For advanced epithelial cancers, aggressive surgery should be instituted. Chemotherapy could be considered for the malignant germ cell tumor during the second and third trimester. Ovarian borderline tumors should not take chemotherapy.Epithelial cancer should be given combination platinum-based chemotherapy. Hysterectomy during pregnancy is rarely indicated unless it contributes significantly to tumor debulking, and pregnancy often could be allowed to continue until near-term.

  14. Soft-rubber-packaged Pb(Zr,Ti)O3 MEMS touch sensors for human–machine interface applications

    Science.gov (United States)

    Takeshita, Toshihiro; Kobayashi, Takeshi; Takei, Ryohei; Itoh, Toshihiro; Takamatsu, Seiichi

    2017-04-01

    We proposed and developed soft-rubber-packaged Pb(Zr,Ti)O3 (PZT) microelectromechanical systems (MEMS) force sensors as human–machine interface sensors of human touch and input. To achieve small and highly sensitive sensors with low-power-consumption, a small PZT MEMS cantilever was used as the sensing element, and it was covered with soft rubber, poly(dimethylsiloxane) (PDMS), to prevent the cracking of the brittle PZT film when touching the sensor. The PDMS packaging does not affect the ferroelectric characteristics of the sensing PZT film, because the hysteresis and impedance changes of the PZT are less than 5%. The sensor dimensions are 5 × 5 × 1.1 mm3. The sensor generated charges without requiring voltage supply. The sensor generated an electric charge of 7.8 pC under an applied force of 1 N. The sensitivity was adjusted by changing the hardness of the soft rubber package: hard rubber provides high sensitivity, but the sensor is easily cracks. Hence, a sensor with a durometer hardness A of 35.6 was found to be optimal as a human–machine interface sensors of human touch of approximately 5–7 N because it has a linear sensitivity at force smaller than 5 N and the bending is small at forces larger than 5 N, which leads to a highly durable sensor. The sensor with a durometer hardness A of 35.6 did not break or crack until the applied force reached 40 N. By packaging brittle PZT MEMS cantilevers with soft rubber, small-force sensors can be constructed, leading to small, low-energy-consumption human–machine interface sensors.

  15. Thermal Hysteresis of MEMS Packaged Capacitive Pressure Sensor (CPS) Based 3C-SiC

    Science.gov (United States)

    Marsi, N.; Majlis, B. Y.; Mohd-Yasin, F.; Hamzah, A. A.; Mohd Rus, A. Z.

    2016-11-01

    Presented herein are the effects of thermal hysteresis analyses of the MEMS packaged capacitive pressure sensor (CPS). The MEMS CPS was employed on Si-on-3C-SiC wafer that was performed using the hot wall low-pressure chemical vapour deposition (LPCVD) reactors at the Queensland Micro and Nanotechnology Center (QMNC), Griffith University and fabricated using the bulk-micromachining process. The MEMS CPS was operated at an extreme temperature up to 500°C and high external pressure at 5.0 MPa. The thermal hysteresis phenomenon that causes the deflection, strain and stress on the 3C-SiC diaphragm spontaneously influence the MEMS CPS performances. The differences of temperature, hysteresis, and repeatability test were presented to demonstrate the functionality of the MEMS packaged CPS. As expected, the output hysteresis has a low hysteresis (less than 0.05%) which has the hardness greater than the traditional silicon. By utilizing this low hysteresis, it was revealed that the MEMS packaged CPS has high repeatability and stability of the sensor.

  16. Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

    Science.gov (United States)

    Chen, Liang-Yu; Neudeck, Philip G.; Behelm, Glenn M.; Spry, David J.; Meredith, Roger D.; Hunter, Gary W.

    2015-01-01

    This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

  17. A self-packaged two-dimensional thermal wind sensor based on thermopiles for low cost applications

    Science.gov (United States)

    Zhu, Y.-Q.; Chen, B.; Gu, F.; Qin, M.; Huang, Q.-A.

    2014-07-01

    In this paper, the design, fabrication and characterization of a low cost micro-machined two-dimensional (2D) wind sensor using thermopiles fabricated on ceramic substrate as sensing elements are presented for the first time. In the sensor, the nickel heaters and four nickel (Ni)/aluminum (Al) thermopiles were directly fabricated on the front surface of the ceramic plate while the back side, as the sensing surface, was exposed to the wind. The whole process is simple and only needs three masks. The sensor substrate is used directly as a packaging board for sensing wind with no need of an extra packaging plate, which is called a self-package. This method reduces the deviation caused by the chip packaging process and has a low manufacturing cost. In order to improve the performance of the wind sensor, modeling and simulation were also performed. Based on the simulation results, the effects of chip size, heater length and heating power on the sensitivity and measurement range of the thermal wind sensor was investigated. The sensor was tested in a wind tunnel in constant power (CP) mode. Measurement results show that the thermal wind sensor can measure wind speeds up to 30 m s-1 and wind direction in a full range of 360°. The proposed sensor can be used for low cost applications with a certain accuracy.

  18. A software package for evaluating the performance of a star sensor operation

    Science.gov (United States)

    Sarpotdar, Mayuresh; Mathew, Joice; Sreejith, A. G.; K., Nirmal; Ambily, S.; Prakash, Ajin; Safonova, Margarita; Murthy, Jayant

    2017-01-01

    We have developed a low-cost off-the-shelf component star sensor (StarSense) for use in minisatellites and CubeSats to determine the attitude of a satellite in orbit. StarSense is an imaging camera with a limiting magnitude of 6.5, which extracts information from star patterns it records in the images. The star sensor implements a centroiding algorithm to find centroids of the stars in the image, a Geometric Voting algorithm for star pattern identification, and a QUEST algorithm for attitude quaternion calculation. Here, we describe the software package to evaluate the performance of these algorithms as a star sensor single operating system. We simulate the ideal case where sky background and instrument errors are omitted, and a more realistic case where noise and camera parameters are added to the simulated images. We evaluate such performance parameters of the algorithms as attitude accuracy, calculation time, required memory, star catalog size, sky coverage, etc., and estimate the errors introduced by each algorithm. This software package is written for use in MATLAB. The testing is parametrized for different hardware parameters, such as the focal length of the imaging setup, the field of view (FOV) of the camera, angle measurement accuracy, distortion effects, etc., and therefore, can be applied to evaluate the performance of such algorithms in any star sensor. For its hardware implementation on our StarSense, we are currently porting the codes in form of functions written in C. This is done keeping in view its easy implementation on any star sensor electronics hardware.

  19. A software package for evaluating the performance of a star sensor operation

    Science.gov (United States)

    Sarpotdar, Mayuresh; Mathew, Joice; Sreejith, A. G.; Nirmal, K.; Ambily, S.; Prakash, Ajin; Safonova, Margarita; Murthy, Jayant

    2017-02-01

    We have developed a low-cost off-the-shelf component star sensor ( StarSense) for use in minisatellites and CubeSats to determine the attitude of a satellite in orbit. StarSense is an imaging camera with a limiting magnitude of 6.5, which extracts information from star patterns it records in the images. The star sensor implements a centroiding algorithm to find centroids of the stars in the image, a Geometric Voting algorithm for star pattern identification, and a QUEST algorithm for attitude quaternion calculation. Here, we describe the software package to evaluate the performance of these algorithms as a star sensor single operating system. We simulate the ideal case where sky background and instrument errors are omitted, and a more realistic case where noise and camera parameters are added to the simulated images. We evaluate such performance parameters of the algorithms as attitude accuracy, calculation time, required memory, star catalog size, sky coverage, etc., and estimate the errors introduced by each algorithm. This software package is written for use in MATLAB. The testing is parametrized for different hardware parameters, such as the focal length of the imaging setup, the field of view (FOV) of the camera, angle measurement accuracy, distortion effects, etc., and therefore, can be applied to evaluate the performance of such algorithms in any star sensor. For its hardware implementation on our StarSense, we are currently porting the codes in form of functions written in C. This is done keeping in view its easy implementation on any star sensor electronics hardware.

  20. Development of tube-packaged FBG strain sensor and application in the vibration experiment of submarine pipeline model

    Science.gov (United States)

    Ren, Liang; Li, Hong-Nan; Sun, Li; Li, Dong-Sheng

    2005-05-01

    Optical fiber sensors have received increasing attention in the fields of aeronautic and civil engineering for their superior ability of explosion proof, immunity to electromagnetic interference and high accuracy, especially fitting for measurement applications in harsh environment. In this paper, a novel FBG (fiber Bragg grating) strain sensor, which was packaged in a 1.2mm stainless steel tube by epoxy resin, was developed. Experiments were conducted on the universal material testing machine to calibrate its strain transferring characteristics. The sensor has the advantages of small size, high precision and flexible use, and demonstrates promising potentials. Ten of tube-packaged strain FBG sensors were applied in the vibration experiment of submarine pipeline model. The strain measured by FBG sensor agrees well with the electric resistance strain sensor.

  1. Metal-packaged fibre Bragg grating strain sensors for surface-mounting onto spalled concrete wind turbine foundations

    Science.gov (United States)

    Perry, M.; Fusiek, G.; McKeeman, I.; Niewczas, P.; Saafi, M.

    2015-09-01

    In this work, we demonstrate preliminary results for a hermetically sealed, metal-packaged fibre Bragg grating strain sensor for monitoring existing concrete wind turbine foundations. As the sensor is bolted to the sub-surface of the concrete, it is suitable for mounting onto uneven, wet and degraded surfaces, which may be found in buried foundations. The sensor was able to provide reliable measurements of concrete beam strain during cyclic three- and four- point bend tests. The strain sensitivity of the prototype sensor is currently 10 % of that of commercial, epoxied fibre strain sensors.

  2. Fabrication and characterization of metal-packaged fiber Bragg grating sensor by one-step ultrasonic welding

    Science.gov (United States)

    Zhang, Yumin; Zhu, Lianqing; Luo, Fei; Dong, Mingli; Ding, Xiangdong; He, Wei

    2016-06-01

    A metallic packaging technique of fiber Bragg grating (FBG) sensors is developed for measurement of strain and temperature, and it can be simply achieved via one-step ultrasonic welding. The average strain transfer rate of the metal-packaged sensor is theoretically evaluated by a proposed model aiming at surface-bonded metallic packaging FBG. According to analytical results, the metallic packaging shows higher average strain transfer rate compared with traditional adhesive packaging under the same packaging conditions. Strain tests are performed on an elaborate uniform strength beam for both tensile and compressive strains; strain sensitivities of approximately 1.16 and 1.30 pm/μɛ are obtained for the tensile and compressive situations, respectively. Temperature rising and cooling tests are also executed from 50°C to 200°C, and the sensitivity of temperature is 36.59 pm/°C. All the measurements of strain and temperature exhibit good linearity and stability. These results demonstrate that the metal-packaged sensors can be successfully fabricated by one-step welding technique and provide great promise for long-term and high-precision structural health monitoring.

  3. A packaged, low-cost, robust optical fiber strain sensor based on small cladding fiber sandwiched within periodic polymer grating.

    Science.gov (United States)

    Chiang, Chia-Chin; Li, Chein-Hsing

    2014-06-02

    In the present study, a novel packaged long-period fiber grating (PLPFG) strain sensor is first presented. The MEMS process was utilized to fabricate the packaged optical fiber strain sensor. The sensor structure consisted of etched optical fiber sandwiched between two layers of thick photoresist SU-8 3050 and then packaged with poly (dimethylsiloxane) (PDMS) polymer material to construct the PLPFG strain sensor. The PDMS packaging material was used to prevent the glue effect, wherein glue flows into the LPFG structure and reduces coupling strength, in the surface bonding process. Because the fiber grating was packaged with PDMS material, it was effectively protected and made robust. The resonance attenuation dip of PLPFG grows when it is loading. This study explored the size effect of the grating period and fiber diameter of PLPFG via tensile testing. The experimental results found that the best strain sensitivity of the PLPFG strain sensor was -0.0342 dB/με, and that an R2 value of 0.963 was reached.

  4. Conformal Thin Film Packaging for SiC Sensor Circuits in Harsh Environments

    Science.gov (United States)

    Scardelletti, Maximilian C.; Karnick, David A.; Ponchak, George E.; Zorman, Christian A.

    2011-01-01

    In this investigation sputtered silicon carbide annealed at 300 C for one hour is used as a conformal thin film package. A RF magnetron sputterer was used to deposit 500 nm silicon carbide films on gold metal structures on alumina wafers. To determine the reliability and resistance to immersion in harsh environments, samples were submerged in gold etchant for 24 hours, in BOE for 24 hours, and in an O2 plasma etch for one hour. The adhesion strength of the thin film was measured by a pull test before and after the chemical immersion, which indicated that the film has an adhesion strength better than 10(exp 8) N/m2; this is similar to the adhesion of the gold layer to the alumina wafer. MIM capacitors are used to determine the dielectric constant, which is dependent on the SiC anneal temperature. Finally, to demonstrate that the SiC, conformal, thin film may be used to package RF circuits and sensors, an LC resonator circuit was fabricated and tested with and without the conformal SiC thin film packaging. The results indicate that the SiC coating adds no appreciable degradation to the circuits RF performance. Index Terms Sputter, silicon carbide, MIM capacitors, LC resonators, gold etchants, BOE, O2 plasma

  5. Observations of Gas Emissions from Cascade Range Volcanoes (USA) using a Portable Real-Time Sensor Package and Evacuated Flasks

    Science.gov (United States)

    Kelly, P. J.; Werner, C. A.; Evans, W.; Ingebritsen, S.; Tucker, D.

    2012-12-01

    Degassing from most Cascade Range Volcanoes, USA, is characterized by low-temperature hydrothermal emissions. It is important to monitor these emissions as part of a comprehensive monitoring strategy yet access is often difficult and most features are sampled by the USGS only once per year at best. In an effort to increase the sampling frequency of major gas species and in preparation for building permanent, autonomous units, we built a portable sensor package capable of measuring H2O, CO2, SO2, and H2S in volcanic gas plumes. Here we compare results from the portable sensor package with gas analyses from direct samples obtained using a titanium tube and evacuated glass flasks collected at the same time. The sensor package is housed in a small, rugged case, weighs 5 kg, and includes sensors for measuring H2O (0-16 parts per thousand), CO2 (0-5000 ppmv), SO2 (0-100 ppm), and H2S (0-20 ppm) gases. Additional temperature and pressure sensors, a micro air pump, datalogger, and an internal battery are also incorporated. H2O and CO2 are measured using an infrared spectrometer (Licor 840) and sulfur-containing gases are measured using electrochemical sensors equipped with filters to mitigate cross-sensitivities. Data are collected at a 1 Hz sampling rate and can be recorded and displayed in real-time using a netbook computer or can be saved to the onboard datalogger. The data display includes timeseries of H2O, CO2, SO2, and H2S mixing ratios, the four-component bulk composition of the plume, and automated calculation of gas ratios commonly used in volcanic gas monitoring, such as H2O/CO2, CO2/SO2, and CO2/H2S . In the Cascade Range, the sensor package has been tested at Mt. Baker, Mt. St. Helens, Mt. Hood, and in Lassen Volcanic National Park. In each case, the instrument was placed 5 to 30 meters from the fumarole or fumarole field and emissions were sampled for 5 to 30 minutes. No SO2 was detected at any location. At Mt. Hood the sensor package yielded average CO2/H2S

  6. The GPS Analysis Package for Exploration and Understanding of Geodetic Sensor Web Time Series Data

    Science.gov (United States)

    Granat, R. A.; Moghaddam, B.; Donnellan, A.

    2012-12-01

    We introduce the GPS Analysis Package (GAP), a Matlab toolbox for GPS data exploration and understanding. The toolbox is designed to support scientists and engineers studying the motion of the solid Earth both in an academic environment and in the course of NASA missions such as UAVSAR and future InSAR satellite missions. It includes an ensemble of low-level routines to perform basic signal processing operations, such as removal of secular motion, de-noising, and removal of seasonal signals. It also includes a suite of more sophisticated statistical pattern recognition techniques, including hidden Markov models and Bayes nets, to detect changes, identify transient signals, understand regional motion, and uncover relationships between geographically removed nodes in the GPS network. Finally, it provides an assortment of methods for estimating missing observations in the network. We provide usage examples of the package applied to particular scenarios, including the 2010 El Mayor-Cucapah earthquake, the 2011 Tohoku-Oki earthquake, and ongoing slow slip events in the Cascadia region. We also demonstrate the utility of the package within a web portal and web services environment by showcasing its use in the QuakeSim web portal. The QuakeSim portal allows easy access to GPS data sources provided by multiple institutions as well as a map and plotting interface to quickly assess analysis results. Finally, we show the extensibility of the package to other problem domains and sensor network data sources, demonstrating the analysis tools as applied to seismic network data, autonomous robotic navigation, and fault detection in engineering data streams from the International Space Station.

  7. A software package for evaluating the performance of a star sensor operation

    CERN Document Server

    Sarpotdar, Mayuresh; Sreejith, A G; Nirmal, K; Ambily, S; Prakash, Ajin; Safonova, Margarita; Murthy, Jayant

    2016-01-01

    We have developed a low-cost off-the-shelf component star sensor (StarSense) for use in minisatellites and CubeSats to determine the attitude of a satellite in orbit. StarSense is an imaging camera with a limiting magnitude of 6.5, which extracts information from star patterns it records in the images. The star sensor implements a centroiding algorithm to find centroids of the stars in the image, a Geometric Voting algorithm for star pattern identification, and a QUEST algorithm for attitude quaternion calculation. Here, we describe the software package to evaluate the performance of these algorithms as a star sensor single operating system. We simulate the ideal case where sky background and instrument errors are omitted, and a more realistic case where noise and camera parameters are added to the simulated images. We evaluate such performance parameters of the algorithms as attitude accuracy, calculation time, required memory, star catalog size, sky coverage, etc., and estimate the errors introduced by each...

  8. The corrosion rate of copper in a bentonite test package measured with electric resistance sensors

    Energy Technology Data Exchange (ETDEWEB)

    Rosborg, Bo [Division of Surface and Corrosion Science, KTH, Stockholm (Sweden); Kosec, Tadeja; Kranjc, Andrej; Kuhar, Viljem; Legat, Andraz [Slovenian National Building and Civil Engineering Institute, Ljubljana (Slovenia)

    2012-12-15

    LOT1 test parcel A2 was exposed for six years in the Aespoe Hard Rock Laboratory, which offers a realistic environment for the conditions that will prevail in a deep repository for high-level radioactive waste disposal in Sweden. The test parcel contained copper electrodes for real-time corrosion monitoring in bentonite ring 36, where the temperature was 24 deg C, and copper coupons in bentonite rings 22 and 30, where the temperature was higher. After retrieval of the test parcel in January 2006, a bentonite test package consisting of bentonite rings 35 - 37 was placed in a container and sealed with a thick layer of paraffin. Later the same year new copper electrodes were installed in the test package. In January 2007 electric resistance (ER) sensors of pure copper with a thickness of 35 {mu}m were also installed in the test package mainly to facilitate the interpretation of the results from the real-time corrosion monitoring with electrochemical techniques. The ER measurements have shown that the corrosion rate of pure copper exposed in an oxic bentonite/ saline groundwater environment at room temperate decreases slowly with time to low but measurable values. The corrosion rates estimated from the regularly performed EIS measurements replicate the ER data. Thus, for this oxic environment in which copper acquires corrosion potentials of the order of 200 mV (SHE) or higher, electrochemical measurements provide believable data. Comparing the recorded ER data with an estimate of the average corrosion rate based on comparing cross-sections from exposed and protected sensor elements, it is obvious that the former overestimates the actual corrosion rate, which is understandable. It seems as if electrochemical measurements can provide a better estimate of the corrosion rate; however, this is quite dependent on the use of proper measuring frequencies and evaluation methods. In this respect ER measurements are more reliable. It has been shown that real-time corrosion

  9. Chapter Twenty One

    African Journals Online (AJOL)

    User

    In this paper I approach art through some literary expositions of Uche Okeke. ... as universal truth emerged from conceptions of producers of knowledge is well taken. ... one may pander to Abercrombie's view that “different groups can generate ...

  10. Fully Roll-to-Roll Gravure Printable Wireless (13.56 MHz) Sensor-Signage Tags for Smart Packaging

    Science.gov (United States)

    Kang, Hwiwon; Park, Hyejin; Park, Yongsu; Jung, Minhoon; Kim, Byung Chul; Wallace, Gordon; Cho, Gyoujin

    2014-06-01

    Integration of sensing capabilities with an interactive signage through wireless communication is enabling the development of smart packaging wherein wireless (13.56 MHz) power transmission is used to interlock the smart packaging with a wireless (13.56 MHz) reader or a smart phone. Assembly of the necessary componentry for smart packaging on plastic or paper foils is limited by the manufacturing costs involved with Si based technologies. Here, the issue of manufacturing cost for smart packaging has been obviated by materials that allow R2R (roll-to-roll) gravure in combination with R2R coating processes to be employed. R2R gravure was used to print the wireless power transmission device, called rectenna (antenna, diode and capacitor), and humidity sensor on poly(ethylene terephtalate) (PET) films while electrochromic signage units were fabricated by R2R coating. The signage units were laminated with the R2R gravure printed rectenna and sensor to complete the prototype smart packaging.

  11. Pseudodementia in a twenty-one-year-old with bipolar disorder and vitamin B12 and folate deficiency.

    Science.gov (United States)

    Reid, S D

    2000-12-01

    A twenty-one-year-old female known to suffer from bipolar type I disorder developed features of a pseudodementia. Following prompt initial response to treatment with antidepressants, there was an early recurrence of cognitive impairment. Blood investigations confirmed a macrocytic anaemia and vitamin B12 and folate deficiencies. There was dramatic resolution of cognitive impairment after vitamin replacement. This suggested the occurrence of a reversible nutritional dementia and reinforced the need to rule out secondary organic causes of psychiatric symptoms even in patients previously diagnosed with a primary psychiatric disorder.

  12. Glass fiber-reinforced polymer packaged fiber Bragg grating sensors for low-speed weigh-in-motion measurements

    Science.gov (United States)

    Al-Tarawneh, Mu'ath; Huang, Ying

    2016-08-01

    The weight of rolling trucks on roads is one of the critical factors for the management of road networks due to the continuous increase in truck weight. Weigh-in-motion (WIM) sensors have been widely used for weight enforcement. A three-dimensional glass fiber-reinforced polymer packaged fiber Bragg grating sensor (3-D GFRP-FBG) is introduced for in-pavement WIM measurement at low vehicle passing speed. A sensitivity study shows that the developed sensor is very sensitive to the sensor installation depth and the longitudinal and transverse locations of the wheel loading position. The developed 3-D GFRP-FBG sensor is applicable for most practical pavements with a panel length larger than 6 ft, and it also shows a very good long-term durability. For the three components in 3-D of the developed sensor, the longitudinal component has the highest sensitivity for WIM measurements, followed by the transverse and vertical components. Field testing validated the sensitivity and repeatability of the developed 3-D GFRP-FBG sensor. The developed sensor provides the transportation agency one alternative solution for WIM measurement, which could significantly improve the measurement efficiency and long-term durability.

  13. Packaging Effects on RadFET Sensors for High Energy Physics Experiments

    CERN Document Server

    Mekki, J; Glaser, M; Guatelli, S; Moll, M; Pia, M G; Ravotti, F

    2009-01-01

    RadFETs in customized chip carrier packages are installed in the LHC Experiments as radiation monitors. The package influence on the dose measurement in the complex LHC radiation environment is evaluated using Geant4 simulations and experimental data.

  14. Re-emergent human adenovirus genome type 7d caused an acute respiratory disease outbreak in Southern China after a twenty-one year absence.

    Science.gov (United States)

    Zhao, Suhui; Wan, Chengsong; Ke, Changwen; Seto, Jason; Dehghan, Shoaleh; Zou, Lirong; Zhou, Jie; Cheng, Zetao; Jing, Shuping; Zeng, Zhiwei; Zhang, Jing; Wan, Xuan; Wu, Xianbo; Zhao, Wei; Zhu, Li; Seto, Donald; Zhang, Qiwei

    2014-12-08

    Human adenoviruses (HAdVs) are highly contagious pathogens causing acute respiratory disease (ARD), among other illnesses. Of the ARD genotypes, HAdV-7 presents with more severe morbidity and higher mortality than the others. We report the isolation and identification of a genome type HAdV-7d (DG01_2011) from a recent outbreak in Southern China. Genome sequencing, phylogenetic analysis, and restriction endonuclease analysis (REA) comparisons with past pathogens indicate HAdV-7d has re-emerged in Southern China after an absence of twenty-one years. Recombination analysis reveals this genome differs from the 1950s-era prototype and vaccine strains by a lateral gene transfer, substituting the coding region for the L1 52/55 kDa DNA packaging protein from HAdV-16. DG01_2011 descends from both a strain circulating in Southwestern China (2010) and a strain from Shaanxi causing a fatality and outbreak (Northwestern China; 2009). Due to the higher morbidity and mortality rates associated with HAdV-7, the surveillance, identification, and characterization of these strains in population-dense China by REA and/or whole genome sequencing are strongly indicated. With these accurate identifications of specific HAdV types and an epidemiological database of regional HAdV pathogens, along with the HAdV genome stability noted across time and space, the development, availability, and deployment of appropriate vaccines are needed.

  15. Intelligent Packaging Systems: Sensors and Nanosensors to Monitor Food Quality and Safety

    Directory of Open Access Journals (Sweden)

    Guillermo Fuertes

    2016-01-01

    Full Text Available The application of nanotechnology in different areas of food packaging is an emerging field that will grow rapidly in the coming years. Advances in food safety have yielded promising results leading to the development of intelligent packaging (IP. By these containers, it is possible to monitor and provide information of the condition of food, packaging, or the environment. This article describes the role of the different concepts of intelligent packaging. It is possible that this new technology could reach enhancing food safety, improving pathogen detection time, and controlling the quality of food and packaging throughout the supply chain.

  16. Twenty-One Genome Sequences from Pseudomonas Species and 19 Genome Sequences from Diverse Bacteria Isolated from the Rhizosphere and Endosphere of Populus deltoides

    Energy Technology Data Exchange (ETDEWEB)

    Brown, Steven D [ORNL; Utturkar, Sagar M [ORNL; Klingeman, Dawn Marie [ORNL; Johnson, Courtney M [ORNL; Martin, Stanton [ORNL; Land, Miriam L [ORNL; Lu, Tse-Yuan [ORNL; Schadt, Christopher Warren [ORNL; Doktycz, Mitchel John [ORNL; Pelletier, Dale A [ORNL

    2012-01-01

    To aid in the investigation of the Populus deltoides microbiome we generated draft genome sequences for twenty one Pseudomonas and twenty one other diverse bacteria isolated from Populus deltoides roots. Genome sequences for isolates similar to Acidovorax, Bradyrhizobium, Brevibacillus, Burkholderia, Caulobacter, Chryseobacterium, Flavobacterium, Herbaspirillum, Novosphingobium, Pantoea, Phyllobacterium, Polaromonas, Rhizobium, Sphingobium and Variovorax were generated.

  17. A novel fibre Bragg grating sensor packaging design for ultra-high temperature sensing in harsh environments

    Science.gov (United States)

    Azhari, Amir; Liang, Richard; Toyserkani, Ehsan

    2014-07-01

    The aim of this article is to introduce a novel packaging of conventional Corning SMF-28™ single-mode fibre Bragg grating sensors for ultra-high temperature sensing. The package is in a cylindrical shape made of yttria-stabilized zirconia tubes. The fibre optic sensor is epoxied to one end inside the tube to be protected from high external temperatures and also harsh environments. Highly-oriented pyrolytic graphite tube with an exceptional anisotropic thermal conductivity with higher conductivity in transverse than radial direction is positioned around the fibre to protect it from high temperatures. Air cooling system is also provided from the other end to dissipate the transferred heat from inside the tube. The shift in the Bragg wavelength is influenced by the thermal expansion of the package and internal temperature variations, which translates into thermal expansion of the fibre. The modelling and experimental results revealed that the Bragg wavelength shift increases to 1.4 pm °C-1 at higher temperatures with linear behaviour at temperatures above 600 °C. The finite element modelling and the experimental results are also in good proximity indicating the similar trend for the shift in the Bragg wavelength.

  18. Twenty-One New Light Curves of OGLE-TR-56b: New System Parameters and Limits on Timing Variations

    CERN Document Server

    Adams, E R; Elliot, J L; Seager, S; Osip, D J; Holman, M J; Winn, J N; Hoyer, S; Rojo, P

    2011-01-01

    Although OGLE-TR-56b was the second transiting exoplanet discovered, only one light curve, observed in 2006, has been published besides the discovery data. We present twenty-one light curves of nineteen different transits observed between July 2003 and July 2009 with the Magellan Telescopes and Gemini South. The combined analysis of the new light curves confirms a slightly inflated planetary radius relative to model predictions, with R_p = 1.378 +/- 0.090 R_J. However, the values found for the transit duration, semimajor axis, and inclination values differ significantly from the previous result, likely due to systematic errors. The new semimajor axis and inclination, a = 0.01942 +/- 0.00015 AU and i = 73.72 +/- 0.18 degrees, are smaller than previously reported, while the total duration, T_14 = 7931 +/- 38 s, is 18 minutes longer. The transit midtimes have errors from 23 s to several minutes, and no evidence is seen for transit midtime or duration variations. Similarly, no change is seen in the orbital period...

  19. An Assessment of the Influence of the Industry Distribution Chain on the Oxygen Levels in Commercial Modified Atmosphere Packaged Cheddar Cheese Using Non-Destructive Oxygen Sensor Technology

    Directory of Open Access Journals (Sweden)

    Karen A.M. O’ Callaghan

    2016-06-01

    Full Text Available The establishment and control of oxygen levels in packs of oxygen-sensitive food products such as cheese is imperative in order to maintain product quality over a determined shelf life. Oxygen sensors quantify oxygen concentrations within packaging using a reversible optical measurement process, and this non-destructive nature ensures the entire supply chain can be monitored and can assist in pinpointing negative issues pertaining to product packaging. This study was carried out in a commercial cheese packaging plant and involved the insertion of 768 sensors into 384 flow-wrapped cheese packs (two sensors per pack that were flushed with 100% carbon dioxide prior to sealing. The cheese blocks were randomly assigned to two different storage groups to assess the effects of package quality, packaging process efficiency, and handling and distribution on package containment. Results demonstrated that oxygen levels increased in both experimental groups examined over the 30-day assessment period. The group subjected to a simulated industrial distribution route and handling procedures of commercial retailed cheese exhibited the highest level of oxygen detected on every day examined and experienced the highest rate of package failure. The study concluded that fluctuating storage conditions, product movement associated with distribution activities, and the possible presence of cheese-derived contaminants such as calcium lactate crystals were chief contributors to package failure.

  20. An Assessment of the Influence of the Industry Distribution Chain on the Oxygen Levels in Commercial Modified Atmosphere Packaged Cheddar Cheese Using Non-Destructive Oxygen Sensor Technology.

    Science.gov (United States)

    O' Callaghan, Karen A M; Papkovsky, Dmitri B; Kerry, Joseph P

    2016-06-20

    The establishment and control of oxygen levels in packs of oxygen-sensitive food products such as cheese is imperative in order to maintain product quality over a determined shelf life. Oxygen sensors quantify oxygen concentrations within packaging using a reversible optical measurement process, and this non-destructive nature ensures the entire supply chain can be monitored and can assist in pinpointing negative issues pertaining to product packaging. This study was carried out in a commercial cheese packaging plant and involved the insertion of 768 sensors into 384 flow-wrapped cheese packs (two sensors per pack) that were flushed with 100% carbon dioxide prior to sealing. The cheese blocks were randomly assigned to two different storage groups to assess the effects of package quality, packaging process efficiency, and handling and distribution on package containment. Results demonstrated that oxygen levels increased in both experimental groups examined over the 30-day assessment period. The group subjected to a simulated industrial distribution route and handling procedures of commercial retailed cheese exhibited the highest level of oxygen detected on every day examined and experienced the highest rate of package failure. The study concluded that fluctuating storage conditions, product movement associated with distribution activities, and the possible presence of cheese-derived contaminants such as calcium lactate crystals were chief contributors to package failure.

  1. Development of a wireless air pollution sensor package for aerial-sampling of emissions

    Science.gov (United States)

    A new sensor system for mobile and aerial emission sampling was developed for open area pollutant sources, such as prescribed forest burns. The sensor system, termed “Kolibri”, consists of multiple low-cost air quality sensors measuring CO2, CO, samplers for particulate matter wi...

  2. Packaging Effects on Fiber Bragg Grating Sensor Performance%光纤光珊的封装效果对其性能的影响

    Institute of Scientific and Technical Information of China (English)

    郝建忠; 高桥志郎; 蔡朝晖; 吴俊宏; 杨秀峰; 陈智浩; 吕超

    2006-01-01

    In this paper, the effects of packaging material and structure of fiber Bragg grating sensor performance are investigated. The effects of thermal expansion coefficient of different embedding materials on the temperature sensitivities of the FBG sensors are studied both theoretically and experimentally with good agreement, which provides a means for selection of FBG packaging material to achieve desiredtemperature sensitivity. We also demonstrate a 4-point bending structured FBG lateral force sensor that measures up to 242N force with well-preserved reflection spectrum, whereas for 3-point bending structure, multiple-peaks start to occur when applied force reaches 72N.

  3. Serotonin transporter 5-HTTLPR polymorphism and response to citalopram in terminally ill cancer patients: report of twenty-one cases.

    Science.gov (United States)

    Capozzo, Maria Anna; Schillani, Giulia; Aguglia, Eugenio; De Vanna, Maurizio; Grassi, Luigi; Conte, Maria Anna; Giraldi, Tullio

    2009-01-01

    The aim of this study was to examine the effects of the SSRI antidepressant drug citalopram on anxiety, depression and mental adjustment to cancer in terminally ill cancer patients, considering also the 5-HTTLPR genetic polymorphism. A group of twenty-one consecutive patients admitted to the hospice of the Casa di Cura Pineta del Carso (Trieste, Italy) with different types of advanced cancer, who were clinically judged to require treatment with an antidepressive drug, was treated with citalopram for two weeks. The response was determined and related to 5-HTTLPR. Citalopram significantly reduced the scores on the depression and anxiety subscales of the Hospital Anxiety and Depression Scale (HADS). When the effects of citalopram were analyzed in relation to the 5-HTTLPR polymorphism, the HADS depression score was significantly decreased only in patients with the "l/l" allelic variant of the serotonin transporter conferring high functional activity, while the score of the Mini-MAC fatalism scale was significantly increased in patients carrying at least one "s" allele. These preliminary findings seem to indicate that two weeks of treatment with citalopram are effective in reducing depressive symptoms in terminally ill cancer patients. Moreover, the effects of citalopram on fatalism as a strategy of mental adaptation to cancer, and on depressive symptoms depend on the allelic variants of the 5-HTTLPR genotype of the patients. These results seem to encourage the examination of a larger patient sample and of different treatment schedules, as well as a more thorough characterization of fatalism as a coping strategy in cancer patients.

  4. Applications of nanotechnology in food packaging and food safety: barrier materials, antimicrobials and sensors.

    Science.gov (United States)

    Duncan, Timothy V

    2011-11-01

    In this article, several applications of nanomaterials in food packaging and food safety are reviewed, including: polymer/clay nanocomposites as high barrier packaging materials, silver nanoparticles as potent antimicrobial agents, and nanosensors and nanomaterial-based assays for the detection of food-relevant analytes (gasses, small organic molecules and food-borne pathogens). In addition to covering the technical aspects of these topics, the current commercial status and understanding of health implications of these technologies are also discussed. These applications were chosen because they do not involve direct addition of nanoparticles to consumed foods, and thus are more likely to be marketed to the public in the short term.

  5. Self-assembled micro-structured sensors for food safety in paper based food packaging

    Energy Technology Data Exchange (ETDEWEB)

    Hakovirta, M., E-mail: marko.hakovirta@storaenso.com; Aksoy, B.; Hakovirta, J.

    2015-08-01

    Natural self-assembled microstructured particles (diatomaceous earth) were used to develop a gas sensor paper with detection mechanism based on visible and distinct color changes of the sensor paper when exposed to volatile basic nitrogen compounds. The coating formulation for paper was prepared by applying diatomites, polyvinyl alcohol (PVOH), and pH sensitive dyes on acidic paper substrate. The surface coating was designed to allow a maximum gas flow through the diatomite sensors. The produced sensor paper was tested for sensitivity using different ammonia concentrations and we observed a sensitivity lower limit at 63 ppm. As a comparison, the results show comparable sensitivity levels to carbon nanotube based sensor technologies reported in literature. - Highlights: • Novel sensor paper was developed using micro-structured diatomaceous earth and pH sensitive dye. • The functionality is based on pH sensitive dye to indicate spoilage of meat or fish by color change. • Diatomaceous earth was successfully immobilized to the polyvinyl alcohol coating. • The coating was engineered to maximize the exposure of the diatom morphology. • The sensor paper achieved very high sensitivities for ammonia gas detection.

  6. Vacuum-packaged piezoelectric vibration energy harvesters: Damping contributions and autonomy for a wireless sensor system

    NARCIS (Netherlands)

    Elfrink, R.; Renaud, M.; Kamel, T.M.; Nooijer, C. de; Jambunathan, M.; Goedbloed, M.; Hohlfeld, D.; Matova, S.; Pop, V.; Caballero, L.; Schaijk, R. van

    2010-01-01

    This paper describes the characterization of thin-film MEMS vibration energy harvesters based on aluminum nitride as piezoelectric material. A record output power of 85 μW is measured. The parasitic-damping and the energy-harvesting performances of unpackaged and packaged devices are investigated. V

  7. Simulations on the prediction of cod (Gadus morhua) freshness from an intelligent packaging sensor concept

    NARCIS (Netherlands)

    Heising, J.K.; Boekel, van M.A.J.S.; Dekker, M.

    2015-01-01

    A non-destructive method that monitors changes in the freshness status of packed cod fillets has potential for the development of an intelligent packaging concept. The method is based on monitoring volatile compounds that dissolve and dissociate in the sensing aqueous phase. A mathematical model was

  8. High-Q Wafer Level Package Based on Modified Tri-Layer Anodic Bonding and High Performance Getter and Its Evaluation for Micro Resonant Pressure Sensor

    National Research Council Canada - National Science Library

    Liying Wang; Xiaohui Du; Lingyun Wang; Zhanhao Xu; Chenying Zhang; Dandan Gu

    2017-01-01

    In order to achieve and maintain a high quality factor (high-Q) for the micro resonant pressure sensor, this paper presents a new wafer level package by adopting cross-layer anodic bonding technique of the glass/silicon/silica (GSS...

  9. Investigation of low-temperature cofired ceramics packages for high-temperature SAW sensors

    OpenAIRE

    Bardong, Jochen; Binder, Alfred; Toskov, Sasa; Miskovic, Goran; Radosavljevic, Goran

    2016-01-01

    Surface acoustic wave (SAW) temperature sensor devices have been developed for operating temperatures up to and above 1000 °C. A challenging task to make these devices available on the market is to develop an appropriate housing concept. A concept based on low-temperature cofired ceramics (LTCC) has been investigated and tested under elevated temperatures up to 600 °C. The devices showed promising results up to 450 °C. Thorough analysis of the possible failure mechanisms was do...

  10. Simulation and analysis of effects of Young's modulus of isolation material on natural frequencies of the sensor package and displacement of the chip

    Institute of Scientific and Technical Information of China (English)

    YIN Jing-hua; LV Guang-jun; LIU Xiao-wei; LEI Qing-quan

    2005-01-01

    For the first time an anti-shock packaging model of an acoustic-vibration sensor system has been designed by using the shocking isolation principle. The finite element analysis has been applied for design and simulation of the model. The effects of Young's modulus of anti-shock rubber on naturally occurring frequencies of the combination of rubber and an acoustic sensor chip were analyzed. The displacement of the acoustic sensor chip is loaded with force. The results of static analysis and harmonic analysis show that while increasing Young's modulus of anti-chock rubber, the first five natural frequencies of the package body also increases. Yet the displacement of the acoustic sensor chip around the resonant frequency decreases. The results of static and transient analysis show that the displacement of the acoustic sensor chip decreases with the increase of Young's modulus of anti-chock rubber being loaded with either transient force or static force at the bottom of the combination of rubber and acoustic sensor chip.

  11. Advanced Sensor and Packaging Technologies for Intelligent Adaptive Engine Controls (Preprint)

    Science.gov (United States)

    2013-05-01

    turbofan testing, both in the P3 position, as well as over 550 hours of OEM burner rig testing and 200 hours of DOE burner rig testing. The sensors are...and adhesion  Multilayer with via/window  600°C  100hr, multicycle  Reliable electrical continuity and adhesion  Die‐attach  cements   1000°C  >20hr...continuity,  Reliable mechanical attachment  Potting  cements    1000°C  >20hr, multicycle  No degradation of performance  Potting  cements    600°C  100hr

  12. Sensor Package Data and H2 and CH4 concentrations in Pre- and Post-Drilling Water Samples: IODP Expedition 357

    Science.gov (United States)

    Lilley, M. D.; Lang, S. Q.; Fruh-Green, G. L.; Orcutt, B.

    2016-12-01

    The sea-floor rock drills utilized on Expedition 357 were equipped with water sampling capability as well as with a CTD/water sensor package that allowed real time monitoring of temperature, dissolved oxygen, methane, pH, and oxidation-reduction potential (ORP). We typically collected near-bottom water samples at each drill site with the ship's CTD/rosette system and post-drilling samples with the automated sampling system mounted on each drill. The water samplers were flushed with a Seabird pump. Through the use of the sensor package, we usually monitored temperature, pH, ORP, and methane concentration during drilling. The sensor data exhibited considerable downhole variability. Temperature was variable (typically by a few tenths of a degree but up to 1°C at some sites) but difficult to interpret due to the potential for heating by the drill. The pH value normally increased downhole and significant downhole CH4 peaks were common at most sites. ORP minima were very common and were associated with at least two causal mechanisms: a) associated with specific horizons during continuous drilling of a specific core; b) caused by the shutting off of flushing water, which reduced the dilution of formation fluid as core barrels were changed. Here, we compare and contrast the sensor data and gas concentrations from several drill sites.

  13. Simple and Low-Cost On-Package Sticker Sensor based on Litmus Paper for Real-Time Monitoring of Beef Freshness

    Directory of Open Access Journals (Sweden)

    Bambang Kuswandi

    2015-12-01

    Full Text Available A simple sticker sensor has been constructed using litmus paper and tests have been conducted to detect the freshness of beef samples. The results show that the sticker sensor can be used to determine the degree of beef freshness, since the color change of the litmus paper and the quality degradation of the beef during storage time had a similar trend, where the decay of the beef could be detected clearly (when the red litmus paper changed to blue. The sticker sensor reacted accurately to the beef’s freshness in terms of pH change due to beef deterioration from pH 5.61 to 6.24 and from pH 5.67 to 6.02 as shown by its color change in real time at room and chiller temperature respectively. Thus, the sticker sensor can be used as an effective tool for monitoring the microbial quality of packaged fresh meat that correlates with the increased pH of the beef, where the total viable count (TVC of 5 x 106 cfu/g or 6.698 log cfu/g correlates with a pH of 6.24. These levels were reached at 10 hrs and 7 days at room and chiller temperature respectively. This study provides a foundation for developing a simple sensor for beef freshness.

  14. Cardiac abnormalities in the acquired immunodeficiency syndrome. A prospective study with a clinical-pathological correlation in twenty-one adult patients

    Directory of Open Access Journals (Sweden)

    Herdy Gesmar Volga Haddad

    1999-01-01

    Full Text Available OBJECTIVE - To evaluate the cardiac abnormalities and their evolution during the course of the acquired immunodeficiency syndrome, as well as to correlate clinical and pathological data. METHODS - Twenty-one patients, admitted to the hospital with the diagnosis of acquired immunodeficiency syndrome, were prospectively studied and followed until their death. Age ranged from 19 to 42 years (17 males. ECG and echocardiogram were also obtained every six months. After death, macro- and microscopic examinations were also performed. RESULTS - The most frequent causes of referral to the hospital were: diarrhea or repeated pneumonias, tuberculosis, toxoplasmosis or Kaposi sarcoma. The most frequent findings were acute or chronic pericarditis (42% and dilated cardiomyopathy (19%. Four patients died of cardiac problems: infective endocarditis, pericarditis with pericardial effusion, bacterial myocarditis and infection by Toxoplasma gondii. CONCLUSION - Severe cardiac abnormalities were the cause of death in some patients. In the majority of the patients, a good correlation existed between clinical and anatomical-pathological data. Cardiac evaluation was important to detect early manifestations and treat them accordingly, even in asymptomatic patients.

  15. Liquid-Phase Packaging of a Glucose Oxidase Solution with Parylene Direct Encapsulation and an Ultraviolet Curing Adhesive Cover for Glucose Sensors

    Directory of Open Access Journals (Sweden)

    Seiichi Takamatsu

    2010-06-01

    Full Text Available We have developed a package for disposable glucose sensor chips using Parylene encapsulation of a glucose oxidase solution in the liquid phase and a cover structure made of an ultraviolet (UV curable adhesive. Parylene was directly deposited onto a small volume (1 μL of glucose oxidase solution through chemical vapor deposition. The cover and reaction chamber were constructed on Parylene film using a UV-curable adhesive and photolithography. The package was processed at room temperature to avoid denaturation of the glucose oxidase. The glucose oxidase solution was encapsulated and unsealed. Glucose sensing was demonstrated using standard amperometric detection at glucose concentrations between 0.1 and 100 mM, which covers the glucose concentration range of diabetic patients. Our proposed Parylene encapsulation and UV-adhesive cover form a liquid phase glucose-oxidase package that has the advantages of room temperature processing and direct liquid encapsulation of a small volume solution without use of conventional solidifying chemicals.

  16. Final Design and Integration of Micro-Chip Inductive Edge Sensors for the Seven Segment Demonstrator. Testing of Integrated Edge Sensors in Test Packages

    Science.gov (United States)

    Karpinsky, John

    1997-01-01

    The contractor attended the critical design review and evaluated the presentations of other team members and presented data on the inductive edge sensor. The prototype micro-chip inductive edge sensor was evaluated, and devices were found to have a number of characteristics which made them unsuitable for installation on the seven segment demonstrator. The amplifier bandwidth was too low, the output drive current was too small, and there is an interaction between the digital circuitry and the amplifier that causes the amplifier to stop functioning. Therefore, the inductive edge sensors were not installed on the seven segment demonstrator. The contractor has participated in instruction, problem analysis, and provided technical assistance to NASA and its contractors for the development of 8 hexagonal mirror faceplates with electronics and edge sensors.

  17. Portal protein functions akin to a DNA-sensor that couples genome-packaging to icosahedral capsid maturation

    Energy Technology Data Exchange (ETDEWEB)

    Lokareddy, Ravi K.; Sankhala, Rajeshwer S.; Roy, Ankoor; Afonine, Pavel V.; Motwani, Tina; Teschke, Carolyn M.; Parent, Kristin N.; Cingolani, Gino (Rutgers); (LBNL); (Connecticut); (TJU); (MSU)

    2017-01-30

    Tailed bacteriophages and herpesviruses assemble infectious particles via an empty precursor capsid (or ‘procapsid’) built by multiple copies of coat and scaffolding protein and by one dodecameric portal protein. Genome packaging triggers rearrangement of the coat protein and release of scaffolding protein, resulting in dramatic procapsid lattice expansion. Here, we provide structural evidence that the portal protein of the bacteriophage P22 exists in two distinct dodecameric conformations: an asymmetric assembly in the procapsid (PC-portal) that is competent for high affinity binding to the large terminase packaging protein, and a symmetric ring in the mature virion (MV-portal) that has negligible affinity for the packaging motor. Modelling studies indicate the structure of PC-portal is incompatible with DNA coaxially spooled around the portal vertex, suggesting that newly packaged DNA triggers the switch from PC- to MV-conformation. Thus, we propose the signal for termination of ‘Headful Packaging’ is a DNA-dependent symmetrization of portal protein.

  18. An Improved Metal-Packaged Strain Sensor Based on A Regenerated Fiber Bragg Grating in Hydrogen-Loaded Boron–Germanium Co-Doped Photosensitive Fiber for High-Temperature Applications

    Directory of Open Access Journals (Sweden)

    Yun Tu

    2017-02-01

    Full Text Available Local strain measurements are considered as an effective method for structural health monitoring of high-temperature components, which require accurate, reliable and durable sensors. To develop strain sensors that can be used in higher temperature environments, an improved metal-packaged strain sensor based on a regenerated fiber Bragg grating (RFBG fabricated in hydrogen (H2-loaded boron–germanium (B–Ge co-doped photosensitive fiber is developed using the process of combining magnetron sputtering and electroplating, addressing the limitation of mechanical strength degradation of silica optical fibers after annealing at a high temperature for regeneration. The regeneration characteristics of the RFBGs and the strain characteristics of the sensor are evaluated. Numerical simulation of the sensor is conducted using a three-dimensional finite element model. Anomalous decay behavior of two regeneration regimes is observed for the FBGs written in H2-loaded B–Ge co-doped fiber. The strain sensor exhibits good linearity, stability and repeatability when exposed to constant high temperatures of up to 540 °C. A satisfactory agreement is obtained between the experimental and numerical results in strain sensitivity. The results demonstrate that the improved metal-packaged strain sensors based on RFBGs in H2-loaded B–Ge co-doped fiber provide great potential for high-temperature applications by addressing the issues of mechanical integrity and packaging.

  19. An Improved Metal-Packaged Strain Sensor Based on A Regenerated Fiber Bragg Grating in Hydrogen-Loaded Boron–Germanium Co-Doped Photosensitive Fiber for High-Temperature Applications

    Science.gov (United States)

    Tu, Yun; Ye, Lin; Zhou, Shao-Ping; Tu, Shan-Tung

    2017-01-01

    Local strain measurements are considered as an effective method for structural health monitoring of high-temperature components, which require accurate, reliable and durable sensors. To develop strain sensors that can be used in higher temperature environments, an improved metal-packaged strain sensor based on a regenerated fiber Bragg grating (RFBG) fabricated in hydrogen (H2)-loaded boron–germanium (B–Ge) co-doped photosensitive fiber is developed using the process of combining magnetron sputtering and electroplating, addressing the limitation of mechanical strength degradation of silica optical fibers after annealing at a high temperature for regeneration. The regeneration characteristics of the RFBGs and the strain characteristics of the sensor are evaluated. Numerical simulation of the sensor is conducted using a three-dimensional finite element model. Anomalous decay behavior of two regeneration regimes is observed for the FBGs written in H2-loaded B–Ge co-doped fiber. The strain sensor exhibits good linearity, stability and repeatability when exposed to constant high temperatures of up to 540 °C. A satisfactory agreement is obtained between the experimental and numerical results in strain sensitivity. The results demonstrate that the improved metal-packaged strain sensors based on RFBGs in H2-loaded B–Ge co-doped fiber provide great potential for high-temperature applications by addressing the issues of mechanical integrity and packaging. PMID:28241465

  20. The importance of a taste. A comparative study on wild food plant consumption in twenty-one local communities in Italy.

    Science.gov (United States)

    Ghirardini, Maria Pia; Carli, Marco; del Vecchio, Nicola; Rovati, Ariele; Cova, Ottavia; Valigi, Francesco; Agnetti, Gaia; Macconi, Martina; Adamo, Daniela; Traina, Mario; Laudini, Francesco; Marcheselli, Ilaria; Caruso, Nicolò; Gedda, Tiziano; Donati, Fabio; Marzadro, Alessandro; Russi, Paola; Spaggiari, Caterina; Bianco, Marcella; Binda, Riccardo; Barattieri, Elisa; Tognacci, Alice; Girardo, Martina; Vaschetti, Luca; Caprino, Piero; Sesti, Erika; Andreozzi, Giorgia; Coletto, Erika; Belzer, Gabriele; Pieroni, Andrea

    2007-05-04

    A comparative food ethnobotanical study was carried out in twenty-one local communities in Italy, fourteen of which were located in Northern Italy, one in Central Italy, one in Sardinia, and four in Southern Italy. 549 informants were asked to name and describe food uses of wild botanicals they currently gather and consume. Data showed that gathering, processing and consuming wild food plants are still important activities in all the selected areas. A few botanicals were quoted and cited in multiple areas, demonstrating that there are ethnobotanical contact points among the various Italian regions (Asparagus acutifolius, Reichardia picroides, Cichorium intybus, Foeniculum vulgare, Sambucus nigra, Silene vulgaris, Taraxacum officinale, Urtica dioica, Sonchus and Valerianella spp.). One taxon (Borago officinalis) in particular was found to be among the most quoted taxa in both the Southern and the Northern Italian sites. However, when we took into account data regarding the fifteen most quoted taxa in each site and compared and statistically analysed these, we observed that there were a few differences in the gathering and consumption of wild food plants between Northern and Southern Italy. In the North, Rosaceae species prevailed, whereas in the South, taxa belonging to the Asteraceae, Brassicaceae, and Liliaceae s.l. families were most frequently cited. We proposed the hypothesis that these differences may be due to the likelihood that in Southern Italy the erosion of TK on wild vegetables is taking place more slowly, and also to the likelihood that Southern Italians' have a higher appreciation of wild vegetables that have a strong and bitter taste. A correspondence analysis confirmed that the differences in the frequencies of quotation of wild plants within the Northern and the Southern Italian sites could be ascribed only partially to ethnic/cultural issues. An additional factor could be recent socio-economic shifts, which may be having a continued effort on

  1. The importance of a taste. A comparative study on wild food plant consumption in twenty-one local communities in Italy

    Directory of Open Access Journals (Sweden)

    Binda Riccardo

    2007-05-01

    Full Text Available Abstract A comparative food ethnobotanical study was carried out in twenty-one local communities in Italy, fourteen of which were located in Northern Italy, one in Central Italy, one in Sardinia, and four in Southern Italy. 549 informants were asked to name and describe food uses of wild botanicals they currently gather and consume. Data showed that gathering, processing and consuming wild food plants are still important activities in all the selected areas. A few botanicals were quoted and cited in multiple areas, demonstrating that there are ethnobotanical contact points among the various Italian regions (Asparagus acutifolius, Reichardia picroides, Cichorium intybus, Foeniculum vulgare, Sambucus nigra, Silene vulgaris, Taraxacum officinale, Urtica dioica, Sonchus and Valerianella spp.. One taxon (Borago officinalis in particular was found to be among the most quoted taxa in both the Southern and the Northern Italian sites. However, when we took into account data regarding the fifteen most quoted taxa in each site and compared and statistically analysed these, we observed that there were a few differences in the gathering and consumption of wild food plants between Northern and Southern Italy. In the North, Rosaceae species prevailed, whereas in the South, taxa belonging to the Asteraceae, Brassicaceae, and Liliaceae s.l. families were most frequently cited. We proposed the hypothesis that these differences may be due to the likelihood that in Southern Italy the erosion of TK on wild vegetables is taking place more slowly, and also to the likelihood that Southern Italians' have a higher appreciation of wild vegetables that have a strong and bitter taste. A correspondence analysis confirmed that the differences in the frequencies of quotation of wild plants within the Northern and the Southern Italian sites could be ascribed only partially to ethnic/cultural issues. An additional factor could be recent socio-economic shifts, which may be having

  2. Epigenetic Silencing of Eyes Absent 4 Gene by Acute Myeloid Leukemia 1-Eight-twenty-one Oncoprotein Contributes to Leukemogenesis in t(8;21) Acute Myeloid Leukemia

    Science.gov (United States)

    Huang, Sai; Jiang, Meng-Meng; Chen, Guo-Feng; Qian, Kun; Gao, Hong-Hao; Guan, Wei; Shi, Jin-Long; Liu, An-Qi; Liu, Jing; Wang, Bian-Hong; Li, Yong-Hui; Yu, Li

    2016-01-01

    Background: The acute myeloid leukemia 1 (AML1)-eight-twenty-one (ETO) fusion protein generated by the t(8;21)(q22;q22) translocation is considered to display a crucial role in leukemogenesis in AML. By focusing on the anti-leukemia effects of eyes absent 4 (EYA4) gene on AML cells, we investigated the biologic and molecular mechanism associated with AML1-ETO expressed in t(8;21) AML. Methods: Qualitative polymerase chain reaction (PCR), quantitative reverse transcription PCR (RT-PCR), and Western blotting analysis were used to observe the mRNA and protein expression levels of EYA4 in cell lines. Different plasmids (including mutant plasmids) of dual luciferase reporter vector were built to study the binding status of AML1-ETO to the promoter region of EYA4. Chromatin immunoprecipitation assay was used to study the epigenetic silencing mechanism of EYA4. Bisulfite sequencing was applied to detect the methylation status in EYA4 promoter region. The influence of EYA4 gene in the cell proliferation, apoptosis, and cell clone-forming ability was detected by the technique of Cell Counting Kit-8, flow cytometry, and clonogenic assay. Results: EYA4 gene was hypermethylated in AML1-ETO+ patients and its expression was down-regulated by 6-fold in Kasumi-1 and SKNO-1 cells, compared to HL-60 and SKNO-1-siA/E cells, respectively. We demonstrated that AML1-ETO triggered the epigenetic silencing of EYA4 gene by binding at AML1-binding sites and recruiting histone deacetylase 1 and DNA methyltransferases. Enhanced EYA4 expression levels inhibited cellular proliferation and suppressed cell colony formation in AML1-ETO+ cell lines. We also found EYA4 transfection increased apoptosis of Kasumi-1 and SKNO-1 cells by 1.6-fold and 1.4-fold compared to negative control, respectively. Conclusions: Our study identified EYA4 gene as targets for AML1-ETO and indicated it as a novel tumor suppressor gene. In addition, we provided evidence that EYA4 gene might be a novel therapeutic target

  3. Epigenetic Silencing of Eyes Absent 4 Gene by Acute Myeloid Leukemia 1-Eight-twenty-one Oncoprotein Contributes to Leukemogenesis in t(8;21) Acute Myeloid Leukemia

    Institute of Scientific and Technical Information of China (English)

    Sai Huang; Meng-Meng Jiang; Guo-Feng Chen; Kun Qian; Hong-Hao Gao; Wei Guan; Jin-Long Shi

    2016-01-01

    Background:The acute myeloid leukemia 1 (AML 1)-eight-twenty-one (ETO) fusion protein generated by the t(8;21)(q22;q22) translocation is considered to display a crucial role in leukemogenesis in AML.By focusing on the anti-leukemia effects of eyes absent 4 (EYA4) gene on AML cells,we investigated the biologic and molecular mechanism associated with AML1-ETO expressed in t(8;21) AML.Methods:Qualitative polymerase chain reaction (PCR),quantitative reverse transcription PCR (RT-PCR),and Western blotting analysis were used to observe the mRNA and protein expression levels of EYA4 in cell lines.Different plasmids (including mutant plasmids) of dual luciferase reporter vector were built to study the binding status of AML1-ETO to the promoter region of EYA4.Chromatin immunoprecipitation assay was used to study the epigenetic silencing mechanism of EYA4.Bisulfite sequencing was applied to detect the methylation status in EYA4 promoter region.The influence of EYA4 gene in the cell proliferation,apoptosis,and cell clone-forming ability was detected by the technique of Cell Counting Kit-8,flow cytometry,and clonogenic assay.Results:EYA4 gene was hypermethylated in AML1-ETO+ patients and its expression was down-regulated by 6-fold in Kasumi-1 and SKNO-1 cells,compared to HL-60 and SKNO-1-siA/E cells,respectively.We demonstrated that AML1-ETO triggered the epigenetic silencing of EYA4 gene by binding at AML1-binding sites and recruiting histone deacetylase 1 and DNA methyltransferases.Enhanced EYA4 expression levels inhibited cellular proliferation and suppressed cell colony formation in AML1-ETO+ cell lines.We also found EYA4 transfection increased apoptosis ofKasumi-1 and SKNO-1 cells by 1.6-fold and 1.4-fold compared to negative control,respectively.Conclusions:Our study identified EYA4 gene as targets for AML1-ETO and indicated it as a novel tumor suppressor gene.In addition,we provided evidence that EYA4 gene might be a novel therapeutic target and a potential candidate

  4. Sensors

    Energy Technology Data Exchange (ETDEWEB)

    Jensen, H. [PBI-Dansensor A/S (Denmark); Toft Soerensen, O. [Risoe National Lab., Materials Research Dept. (Denmark)

    1999-10-01

    A new type of ceramic oxygen sensors based on semiconducting oxides was developed in this project. The advantage of these sensors compared to standard ZrO{sub 2} sensors is that they do not require a reference gas and that they can be produced in small sizes. The sensor design and the techniques developed for production of these sensors are judged suitable by the participating industry for a niche production of a new generation of oxygen sensors. Materials research on new oxygen ion conducting conductors both for applications in oxygen sensors and in fuel was also performed in this project and finally a new process was developed for fabrication of ceramic tubes by dip-coating. (EHS)

  5. Sensors

    CERN Document Server

    Pigorsch, Enrico

    1997-01-01

    This is the 5th edition of the Metra Martech Directory "EUROPEAN CENTRES OF EXPERTISE - SENSORS." The entries represent a survey of European sensors development. The new edition contains 425 detailed profiles of companies and research institutions in 22 countries. This is reflected in the diversity of sensors development programmes described, from sensors for physical parameters to biosensors and intelligent sensor systems. We do not claim that all European organisations developing sensors are included, but this is a good cross section from an invited list of participants. If you see gaps or omissions, or would like your organisation to be included, please send details. The data base invites the formation of effective joint ventures by identifying and providing access to specific areas in which organisations offer collaboration. This issue is recognised to be of great importance and most entrants include details of collaboration offered and sought. We hope the directory on Sensors will help you to find the ri...

  6. Packaging fluency

    DEFF Research Database (Denmark)

    Mocanu, Ana; Chrysochou, Polymeros; Bogomolova, Svetlana

    2011-01-01

    Research on packaging stresses the need for packaging design to read easily, presuming fast and accurate processing of product-related information. In this paper we define this property of packaging as “packaging fluency”. Based on the existing marketing and cognitive psychology literature...... on packaging design and processing fluency, our aim is to define and conceptualise packaging fluency. We stress the important role of packaging fluency since it is anticipated that a fluent package would influence the evaluative judgments for a product. We conclude this paper by setting the research agenda...

  7. High-Q Wafer Level Package Based on Modified Tri-Layer Anodic Bonding and High Performance Getter and Its Evaluation for Micro Resonant Pressure Sensor.

    Science.gov (United States)

    Wang, Liying; Du, Xiaohui; Wang, Lingyun; Xu, Zhanhao; Zhang, Chenying; Gu, Dandan

    2017-03-16

    In order to achieve and maintain a high quality factor (high-Q) for the micro resonant pressure sensor, this paper presents a new wafer level package by adopting cross-layer anodic bonding technique of the glass/silicon/silica (GSS) stackable structure and integrated Ti getter. A double-layer structure similar to a silicon-on-insulator (SOI) wafer is formed after the resonant layer and the pressure-sensitive layer are bonded by silicon direct bonding (SDB). In order to form good bonding quality between the pressure-sensitive layer and the glass cap layer, the cross-layer anodic bonding technique is proposed for vacuum package by sputtering Aluminum (Al) on the combination wafer of the pressure-sensitive layer and the resonant layer to achieve electrical interconnection. The model and the bonding effect of this technique are discussed. In addition, in order to enhance the performance of titanium (Ti) getter, the prepared and activation parameters of Ti getter under different sputtering conditions are optimized and discussed. Based on the optimized results, the Ti getter (thickness of 300 nm to 500 nm) is also deposited on the inside of the glass groove by magnetron sputtering to maintain stable quality factor (Q). The Q test of the built testing system shows that the number of resonators with a Q value of more than 10,000 accounts for more than 73% of the total. With an interval of 1.5 years, the Q value of the samples remains almost constant. It proves the proposed cross-layer anodic bonding and getter technique can realize high-Q resonant structure for long-term stable operation.

  8. High-Q Wafer Level Package Based on Modified Tri-Layer Anodic Bonding and High Performance Getter and Its Evaluation for Micro Resonant Pressure Sensor

    Directory of Open Access Journals (Sweden)

    Liying Wang

    2017-03-01

    Full Text Available In order to achieve and maintain a high quality factor (high-Q for the micro resonant pressure sensor, this paper presents a new wafer level package by adopting cross-layer anodic bonding technique of the glass/silicon/silica (GSS stackable structure and integrated Ti getter. A double-layer structure similar to a silicon-on-insulator (SOI wafer is formed after the resonant layer and the pressure-sensitive layer are bonded by silicon direct bonding (SDB. In order to form good bonding quality between the pressure-sensitive layer and the glass cap layer, the cross-layer anodic bonding technique is proposed for vacuum package by sputtering Aluminum (Al on the combination wafer of the pressure-sensitive layer and the resonant layer to achieve electrical interconnection. The model and the bonding effect of this technique are discussed. In addition, in order to enhance the performance of titanium (Ti getter, the prepared and activation parameters of Ti getter under different sputtering conditions are optimized and discussed. Based on the optimized results, the Ti getter (thickness of 300 nm to 500 nm is also deposited on the inside of the glass groove by magnetron sputtering to maintain stable quality factor (Q. The Q test of the built testing system shows that the number of resonators with a Q value of more than 10,000 accounts for more than 73% of the total. With an interval of 1.5 years, the Q value of the samples remains almost constant. It proves the proposed cross-layer anodic bonding and getter technique can realize high-Q resonant structure for long-term stable operation.

  9. Packaging fluency

    DEFF Research Database (Denmark)

    Mocanu, Ana; Chrysochou, Polymeros; Bogomolova, Svetlana

    2011-01-01

    Research on packaging stresses the need for packaging design to read easily, presuming fast and accurate processing of product-related information. In this paper we define this property of packaging as “packaging fluency”. Based on the existing marketing and cognitive psychology literature on pac...

  10. Microelectronic packaging

    CERN Document Server

    Datta, M; Schultze, J Walter

    2004-01-01

    Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impac

  11. Packaged bulk micromachined triglyceride biosensor

    Science.gov (United States)

    Mohanasundaram, S. V.; Mercy, S.; Harikrishna, P. V.; Rani, Kailash; Bhattacharya, Enakshi; Chadha, Anju

    2010-02-01

    Estimation of triglyceride concentration is important for the health and food industries. Use of solid state biosensors like Electrolyte Insulator Semiconductor Capacitors (EISCAP) ensures ease in operation with good accuracy and sensitivity when compared to conventional sensors. In this paper we report on packaging of miniaturized EISCAP sensors on silicon. The packaging involves glass to silicon bonding using adhesive. Since this kind of packaging is done at room temperature, it cannot damage the thin dielectric layers on the silicon wafer unlike the high temperature anodic bonding technique and can be used for sensors with immobilized enzyme without denaturing the enzyme. The packaging also involves a teflon capping arrangement which helps in easy handling of the bio-analyte solutions. The capping solves two problems. Firstly, it helps in the immobilization process where it ensures the enzyme immobilization happens only on one pit and secondly it helps with easy transport of the bio-analyte into the sensor pit for measurements.

  12. Electro-Microfluidic Packaging

    Science.gov (United States)

    Benavides, G. L.; Galambos, P. C.

    2002-06-01

    There are many examples of electro-microfluidic products that require cost effective packaging solutions. Industry has responded to a demand for products such as drop ejectors, chemical sensors, and biological sensors. Drop ejectors have consumer applications such as ink jet printing and scientific applications such as patterning self-assembled monolayers or ejecting picoliters of expensive analytes/reagents for chemical analysis. Drop ejectors can be used to perform chemical analysis, combinatorial chemistry, drug manufacture, drug discovery, drug delivery, and DNA sequencing. Chemical and biological micro-sensors can sniff the ambient environment for traces of dangerous materials such as explosives, toxins, or pathogens. Other biological sensors can be used to improve world health by providing timely diagnostics and applying corrective measures to the human body. Electro-microfluidic packaging can easily represent over fifty percent of the product cost and, as with Integrated Circuits (IC), the industry should evolve to standard packaging solutions. Standard packaging schemes will minimize cost and bring products to market sooner.

  13. MEMS packaging

    CERN Document Server

    Hsu , Tai-Ran

    2004-01-01

    MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing.The Institution of Engineering and Technology is

  14. 光纤光栅传感器的无胶化封装及蠕变规律研究%Research on creep law of packaging machine without glue of optical fiber grating sensor

    Institute of Scientific and Technical Information of China (English)

    钟阳; 尚冉冉

    2015-01-01

    为了进一步提高光纤光栅传感器在沥青混凝土路面结构监测应用的长期有效性,以沥青混凝土作为封装材料,在封装过程中以缠绕固定代替高分子粘结剂,使得传感器无胶化,并对光纤光栅传感器蠕变规律进行试验研究,得出光纤光栅传感器蠕变随时间变化规律,提出了避免蠕变现象对监测结果不利影响的建议。%In order to further improve the long-term effectiveness of optical fiber grating sensor in asphalt concrete structure monitoring applica-tion,taking the asphalt concrete as the packaging materials,in the encapsulation process by winding fixing instead of polymer binder,made the sensor without glue,and made test research on the creep law of optical fiber grating sensor,gained the law of optical fiber grating sensor changed with time,put forward the suggestion to avoid the creep had adverse influence to monitoring results.

  15. 奥沙利铂联合卡培他滨治疗晚期胃癌的21例临床探讨%Combination of oxaliplatin and capecitabine in treatment of twenty-one advanced gastric cancer

    Institute of Scientific and Technical Information of China (English)

    徐满珍; 李小兵

    2013-01-01

    Objective: To observe the efficacy and side efferts of oxalipatin plus capecitabine for the treatment of ad-vanced gastric cancer Methods: Twenty-one cases of patients . Oxaliplatin was given at a dose of 130mg/m2 by intravenous injection at day 1; Cape citabine was orally given at a dose of 2500 mg/m2, twice a day for two weeks. Twenty-one days was one cycle.Results: Among 21 patients , the response rate (CR+PR) was 57.1% with 2CR, 10PR, 3SD,6PD. MST was 9 months, mttp was 7 months. The major side effects were hand-foot syn-drome in 7(33.3%), newel toxity 12(57.1%), diarrhea 14 .conclusion: oxaplatin cornbined with capecitabine is a good chernother-appy with high clinical remission rate and could signiticartly improve life quality .And side effects could be tolerable.%目的观察奥沙利铂联合卡培他滨治疗晚期胃癌的疗效和安全性。方法21例晚期胃癌患者,静脉滴注奥沙利铂130mg/m2,d1;卡培他滨2500 mg/m2,分早晚2次口服,d1-14,21天为1周期。结果21例患者中,CR 2例,PR10例,SD3例,PD6例,近期有效率(CR+PR)为57.1%,中位生存期9个月,中位疾病进展时间为7个月。不良反应为手足综合征、神经毒性,多为Ⅰ-Ⅱ度。结论奥沙利铂联合卡培他滨化疗方案,缓解率高,能提高生活质量,毒副反应小,患者易耐受。

  16. High performance microsystem packaging: A perspective

    Energy Technology Data Exchange (ETDEWEB)

    Romig, A.D. Jr.; Dressendorfer, P.V.; Palmer, D.W.

    1997-10-01

    The second silicon revolution will be based on intelligent, integrated microsystems where multiple technologies (such as analog, digital, memory, sensor, micro-electro-mechanical, and communication devices) are integrated onto a single chip or within a multichip module. A necessary element for such systems is cost-effective, high-performance packaging. This paper examines many of the issues associated with the packaging of integrated microsystems, with an emphasis on the areas of packaging design, manufacturability, and reliability.

  17. Package Hermeticity Testing with Thermal Transient Measurements

    CERN Document Server

    Vass-Varnai, Andras

    2008-01-01

    The rapid incursion of new technologies such as MEMS and smart sensor device manufacturing requires new tailor-made packaging designs. In many applications these devices are exposed to humid environments. Since the penetration of moisture into the package may result in internal corrosion or shift of the operating parameters, the reliability testing of hermetically sealed packages has become a crucial question in the semiconductor industry.

  18. Direitos sociais na constituição cidadã: um balanço de 21 anos Social rights in the citizen Constitution: a balance of twenty-one years of existence

    Directory of Open Access Journals (Sweden)

    Carlindo Rodrigues de Oliveira

    2011-03-01

    Full Text Available O presente trabalho faz um balanço dos direitos sociais previstos na Constituição de 1988, destacando seus avanços e limitações ao longo destes últimos 21 anos. Começando pelos direitos dos trabalhadores e, em seguida, pelos dispositivos relativos à Seguridade Social, o trabalho busca compreender as motivações do legislador constituinte e o histórico de constantes disputas no interior da sociedade, em torno da regulamentação, manutenção e aprimoramento desses direitos ao longo dos anos.This paper is an attempt to make a balance of the social rights forseen in the Brazilian 1988 Constitution, stressing its advances and limitations during the last twenty one years. Beginning with the labour rights and following with the Social Security articles, it is an effort to understand both the motivations of the legislators and the historic of permanent disputes within the Brazilian society around the regulation, maintenance and improvement of these rights along the years.

  19. Portobello Packaging

    National Research Council Canada - National Science Library

    Thomas Grose

    2010-01-01

    ...-based foams. Bayer earned dual degrees in mechanical engineering and product design in 2007 and, with classmate Gavin Mclntyre, started the company Ecovative Design to market his creation. EcoCradle, the company's organic packaging material, was named one of the top inventions of 2009 by Popular Science. Its insulation material, Greensulate, got a ...

  20. 用于器件级真空封装的MEMS加速度传感器的设计与制作%Design and fabrication of MEMS acceleration sensor for device-level vacuum packaging

    Institute of Scientific and Technical Information of China (English)

    蔡梅妮; 林友玲; 车录锋; 苏荣涛; 周晓峰; 黎晓林

    2012-01-01

    设计了一种可用于器件级真空封装的三明治电容式MEMS加速度传感器.该传感器被设计为四层硅结构,其中上下两层为固定电极,中间两层为硅-硅直接键合的双面梁-质量块结构的可动电极.利用自停止腐蚀工艺在中间质量块键合层上腐蚀出2个深入腔内的V型抽气槽,使得MEMS器件在后续的封装中能够实现内部真空.为防止V型抽气槽在划片中被水或硅渣堵塞,采用双面划片工艺.划片后,器件的总尺寸为6.8mm ×5.6mm ×1.72 mm,其中,敏感质量块尺寸为3.2mm×3.2mm ×0.86mm,检测电容间隙2.1 μm.对器件级真空封装后的MEMS加速度传感器进行了初步测试,结果表明:制作的传感器的谐振频率为861 Hz,品质因数Q为76,灵敏度为1.53 V/gn,C-V特性正常,氦气细漏<1×10-9 atm-cm3/s,粗漏无气泡.%A sandwich type of capacitive MEMS acceleration sensor used for device-level vacuum packaging is designed. The sensor is made of four-layer silicon wafers bonded together while the top and bottom wafers are the fixed electrodes and the cantilever-mass structure is made on the middle two wafers. Two grooves are etched in the middle mass block bonding layer by self-stopped etching process and used to remove air from cavity within the acceleration sensor, creating vacuum environment in subsequent packaging. A double-sided dicing process is developed to protect V-shaped grooves from water or silicon scrap. The total size of the sensor is 6.8 mm ×5.6 mm × 1. 72 mm and the size of mass is 3.2 mm ×3. 2 mm ×0. 86 mm. The interval of detecting capacitor is 2.1 μm. The performance of the device-level vacuum packaged sensor is tested. The C-V plot is normal and the sensitivity is about 1.53 V/gn. The resonant frequency is 861 Hz and quality factor Q is 76. The fine leakage of He is lower than 1 ×10-9 atm-cm3/s and has no bubbles during gross leakage test.

  1. Seafood Packaging

    Science.gov (United States)

    1996-01-01

    NASA's Technology Transfer Office at Stennis Space Center worked with a New Orleans seafood packaging company to develop a container to improve the shipping longevity of seafood, primarily frozen and fresh fish, while preserving the taste. A NASA engineer developed metalized heat resistant polybags with thermal foam liners using an enhanced version of the metalized mylar commonly known as 'space blanket material,' which was produced during the Apollo era.

  2. Challenges in the Packaging of MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Malshe, A.P.; Singh, S.B.; Eaton, W.P.; O' Neal, C.; Brown, W.D.; Miller, W.M.

    1999-03-26

    The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications. Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and few publications have been completed on the packaging of these devices. This is despite the fact that packaging is a very large percentage of the total cost of MEMS devices. The main difference between IC packaging and MEMS packaging is that MEMS packaging is almost always application specific and greatly affected by its environment and packaging techniques such as die handling, die attach processes, and lid sealing. Many of these aspects are directly related to the materials used in the packaging processes. MEMS devices that are functional in wafer form can be rendered inoperable after packaging. MEMS dies must be handled only from the chip sides so features on the top surface are not damaged. This eliminates most current die pick-and-place fixtures. Die attach materials are key to MEMS packaging. Using hard die attach solders can create high stresses in the MEMS devices, which can affect their operation greatly. Low-stress epoxies can be high-outgassing, which can also affect device performance. Also, a low modulus die attach can allow the die to move during ultrasonic wirebonding resulting to low wirebond strength. Another source of residual stress is the lid sealing process. Most MEMS based sensors and devices require a hermetically sealed package. This can be done by parallel seam welding the package lid, but at the cost of further induced stress on the die. Another issue of MEMS packaging is the media compatibility of the packaged device. MEMS unlike ICS often interface with their environment, which could be high pressure or corrosive. The main conclusion we can draw about MEMS packaging is that the package affects the performance and reliability of the MEMS devices. There is a

  3. Challenges in the Packaging of MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Malshe, A.P.; Singh, S.B.; Eaton, W.P.; O' Neal, C.; Brown, W.D.; Miller, W.M.

    1999-03-26

    The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications. Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and few publications have been completed on the packaging of these devices. This is despite the fact that packaging is a very large percentage of the total cost of MEMS devices. The main difference between IC packaging and MEMS packaging is that MEMS packaging is almost always application specific and greatly affected by its environment and packaging techniques such as die handling, die attach processes, and lid sealing. Many of these aspects are directly related to the materials used in the packaging processes. MEMS devices that are functional in wafer form can be rendered inoperable after packaging. MEMS dies must be handled only from the chip sides so features on the top surface are not damaged. This eliminates most current die pick-and-place fixtures. Die attach materials are key to MEMS packaging. Using hard die attach solders can create high stresses in the MEMS devices, which can affect their operation greatly. Low-stress epoxies can be high-outgassing, which can also affect device performance. Also, a low modulus die attach can allow the die to move during ultrasonic wirebonding resulting to low wirebond strength. Another source of residual stress is the lid sealing process. Most MEMS based sensors and devices require a hermetically sealed package. This can be done by parallel seam welding the package lid, but at the cost of further induced stress on the die. Another issue of MEMS packaging is the media compatibility of the packaged device. MEMS unlike ICS often interface with their environment, which could be high pressure or corrosive. The main conclusion we can draw about MEMS packaging is that the package affects the performance and reliability of the MEMS devices. There is a

  4. Communication with your packaging: possibilities for intelligent functions and identification methods in packaging

    NARCIS (Netherlands)

    Schilthuizen, S.F.

    1999-01-01

    Intelligent functions in packaging can have all kinds of forms. This paper focuses on methods of identifying a packaging and other important tasks which can be performed after identification: tracing, tracking, monitoring and sensing of conditions. The recent developments in ID-technology and sensor

  5. Report of seminal vesiculoscopy performed on twenty- one patients with intractable hematospermia%精囊镜治疗21例顽固性血精的疗效分析

    Institute of Scientific and Technical Information of China (English)

    李碧君; 王在盛; 叶亲永; 黎鼎荣; 车斯策; 钟世强; 王剑敏

    2015-01-01

    Objective To explore clinical application of seminal vesiculoscopy on patients with intractable hematospermia that do not respond to conservative treatments. Methods From October 2011 to February 2013, twenty- one patients with intractable hematospermia underwent seminal vesiculoscopy in the Second Affriliated Hospital of Guangdong Medical College. Before admission to hospital, all these patients have suffered hematospermia over half a year and received both western medicine and traditional medications as well as physical treatments. However the patients′ symptoms of hematospermia still reoccurred over and again. After admission to hospital, B-mode ultrasound and CT scans were conducted on the patients to rule out the possibility of prostate tumor. Examination of seminal vesiculoscopy with Wolf 7.5 F rigid ureteroscope was further performed. After surgical operations, the patients received intravenous infusion of antibiotics and wore indwelling catheters. Results All surgical operations were successfully performed on the above twenty-one patients. Among the patients, 4 patients needed to have their seminal colliculuses cut open through resectoscope to have their ejaculatory ducts exposed. The surgical operations lasted for 20 to 43 minutes(25 minutes average). After undergoing surgical operations, one of the patients experienced fever but did not develop any complications such as epididymitis, urethral trauma, anorectal injury, or retrograde ejaculation etc; sixteen patients′ hematospermia is completely cured within three months after receiving treatments with seminal vesiculoscopy; three patients′ hematospermia disappeared after undergoing surgical operations and having auxiliary treatments of traditional Chinese medicines and antibiotics; two patients still have reoccurring hematospermia. Conclusions Seminal vesiculoscopy is an effective approach on diagnosis and therapies in patients suffering hematospermia for long periods. It can be used to confirm the

  6. ATLAS software packaging

    CERN Document Server

    Rybkin, G

    2012-01-01

    Software packaging is indispensable part of build and prerequisite for deployment processes. Full ATLAS software stack consists of TDAQ, HLT, and Offline software. These software groups depend on some 80 external software packages. We present tools, package PackDist, developed and used to package all this software except for TDAQ project. PackDist is based on and driven by CMT, ATLAS software configuration and build tool, and consists of shell and Python scripts. The packaging unit used is CMT project. Each CMT project is packaged as several packages - platform dependent (one per platform available), source code excluding header files, other platform independent files, documentation, and debug information packages (the last two being built optionally). Packaging can be done recursively to package all the dependencies. The whole set of packages for one software release, distribution kit, also includes configuration packages and contains some 120 packages for one platform. Also packaged are physics analysis pro...

  7. Challenges in the Packaging of MEMS

    Energy Technology Data Exchange (ETDEWEB)

    BROWN, WILLIAM D.; EATON, WILLIAM P.; MALSHE, AJAY P.; MILLER, WILLIAM M.; O' NEAL, CHAD; SINGH, SUSHILA B.

    1999-09-24

    Microelectromechanical Systems (MEMS) packaging is much different from conventional integrated circuit (IC) packaging. Many MEMS devices must interface to the environment in order to perform their intended function, and the package must be able to facilitate access with the environment while protecting the device. The package must also not interfere with or impede the operation of the MEMS device. The die attachment material should be low stress, and low outgassing, while also minimizing stress relaxation overtime which can lead to scale factor shifts in sensor devices. The fabrication processes used in creating the devices must be compatible with each other, and not result in damage to the devices. Many devices are application specific requiring custom packages that are not commercially available. Devices may also need media compatible packages that can protect the devices from harsh environments in which the MEMS device may operate. Techniques are being developed to handle, process, and package the devices such that high yields of functional packaged parts will result. Currently, many of the processing steps are potentially harmful to MEMS devices and negatively affect yield. It is the objective of this paper to review and discuss packaging challenges that exist for MEMS systems and to expose these issues to new audiences from the integrated circuit packaging community.

  8. Packaging Technology for SiC High Temperature Electronics

    Science.gov (United States)

    Chen, Liang-Yu; Neudeck, Philip G.; Spry, David J.; Meredith, Roger D.; Nakley, Leah M.; Beheim, Glenn M.; Hunter, Gary W.

    2017-01-01

    High-temperature environment operable sensors and electronics are required for long-term exploration of Venus and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500 C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors in relevant environments. This talk will discuss a ceramic packaging system developed for high temperature electronics, and related testing results of SiC integrated circuits at 500 C facilitated by this high temperature packaging system, including the most recent progress.

  9. High Temperature Pt/Alumina Co-Fired System for 500 C Electronic Packaging Applications

    Science.gov (United States)

    Chen, Liang-Yu; Neudeck, Philip G.; Spry, David J.; Beheim, Glenn M.; Hunter, Gary W.

    2015-01-01

    Gold thick-film metallization and 96 alumina substrate based prototype packaging system developed for 500C SiC electronics and sensors is briefly reviewed, the needs of improvement are discussed. A high temperature co-fired alumina material system based packaging system composed of 32-pin chip-level package and printed circuit board is discussed for packaging 500C SiC electronics and sensors.

  10. Extreme temperature packaging: challenges and opportunities

    Science.gov (United States)

    Johnson, R. Wayne

    2016-05-01

    Consumer electronics account for the majority of electronics manufactured today. Given the temperature limits of humans, consumer electronics are typically rated for operation from -40°C to +85°C. Military applications extend the range to -65°C to +125°C while underhood automotive electronics may see +150°C. With the proliferation of the Internet of Things (IoT), the goal of instrumenting (sensing, computation, transmission) to improve safety and performance in high temperature environments such as geothermal wells, nuclear reactors, combustion chambers, industrial processes, etc. requires sensors, electronics and packaging compatible with these environments. Advances in wide bandgap semiconductors (SiC and GaN) allow the fabrication of high temperature compatible sensors and electronics. Integration and packaging of these devices is required for implementation into actual applications. The basic elements of packaging are die attach, electrical interconnection and the package or housing. Consumer electronics typically use conductive adhesives or low melting point solders for die attach, wire bonds or low melting solder for electrical interconnection and epoxy for the package. These materials melt or decompose in high temperature environments. This paper examines materials and processes for high temperature packaging including liquid transient phase and sintered nanoparticle die attach, high melting point wires for wire bonding and metal and ceramic packages. The limitations of currently available solutions will also be discussed.

  11. HEAT Sensor: Harsh Environment Adaptable Thermionic Sensor

    Energy Technology Data Exchange (ETDEWEB)

    Limb, Scott J. [Palo Alto Research Center, Palo Alto, CA (United States)

    2016-05-31

    This document is the final report for the “HARSH ENVIRONMENT ADAPTABLE THERMIONIC SENSOR” project under NETL’s Crosscutting contract DE-FE0013062. This report addresses sensors that can be made with thermionic thin films along with the required high temperature hermetic packaging process. These sensors can be placed in harsh high temperature environments and potentially be wireless and self-powered.

  12. Intelligent packaging for monitoring food quality: a case study on fresh fish

    OpenAIRE

    Heising, J.K.

    2014-01-01

    Background Foods are prone to quality degradation in the whole supply chain, but the possibilities for monitoring the quality of foods inside the package are limited. When sensors of quality indicators are included into the package of a food, the package can become an intelligent packaging that is able to communicate information about the packed food. An intelligent packaging could be used to monitor quality attributes of the food and translate this into a message about the quality of the pac...

  13. Structural health monitoring with fiber optic sensors

    Institute of Scientific and Technical Information of China (English)

    F.ANSARI

    2009-01-01

    Optical fiber sensors have been successfully implemented in aeronautics, mechanical systems, and medical applications. Civil structures pose further challenges in monitoring mainly due to their large dimensions, diversity and heterogeneity of materials involved, and hostile construction environment. This article provides a summary of basic principles pertaining to practical health monitoring of civil engineering structures with optical fiber sensors. The issues discussed include basic sensor principles, strain transfer mechanism, sensor packaging, sensor placement in construction environment, and reliability and survivability of the sensors.

  14. Integrated microsystems packaging approach with LCP

    Science.gov (United States)

    Jaynes, Paul; Shacklette, Lawrence W.

    2006-05-01

    Within the government communication market there is an increasing push to further miniaturize systems with the use of chip-scale packages, flip-chip bonding, and other advances over traditional packaging techniques. Harris' approach to miniaturization includes these traditional packaging advances, but goes beyond this level of miniaturization by combining the functional and structural elements of a system, thus creating a Multi-Functional Structural Circuit (MFSC). An emerging high-frequency, near hermetic, thermoplastic electronic substrate material, Liquid Crystal Polymer (LCP), is the material that will enable the combination of the electronic circuit and the physical structure of the system. The first embodiment of this vision for Harris is the development of a battlefield acoustic sensor module. This paper will introduce LCP and its advantages for MFSC, present an example of the work that Harris has performed, and speak to LCP MFSCs' potential benefits to miniature communications modules and sensor platforms.

  15. Comprehensive Warpage Analysis of Stacked Die MEMS Package in Accelerometer Application

    Institute of Scientific and Technical Information of China (English)

    2006-01-01

    Packaging of MEMS ( micro-electro-mechanical system ) devices poses more challenges than conventional IC packaging, since the performance of the MEMS devices is highly dependent on packaging processes. A Land Grid Array (LGA) package is introduced for MEMS technology based linear multi-axis accelerometers. Finite element modeling is conducted to simulate the warpage behavior of the LGA packages. A method to correlate the package warpage to matrix block warpage has been developed. Warpage for both package and sensor substrate are obtained. Warpage predicted by simulation correlates very well with experimental measurements. Based on this validated method, detailed design analysis with different package geometrical variations are carried out to optimize the package design. With the optimized package structure,the packaging effect on accelerometer signal performance is well controlled.

  16. CH Packaging Operations Manual

    Energy Technology Data Exchange (ETDEWEB)

    Washington TRU Solutions LLC

    2005-06-13

    This procedure provides instructions for assembling the CH Packaging Drum payload assembly, Standard Waste Box (SWB) assembly, Abnormal Operations and ICV and OCV Preshipment Leakage Rate Tests on the packaging seals, using a nondestructive Helium (He) Leak Test.

  17. Dual Use Packaging Project

    Data.gov (United States)

    National Aeronautics and Space Administration — NASA seeks down-weighted packaging compatible with microwave preparation and perhaps high hydrostatic pressure processing. New packaging must satisfy NASA's 3-year...

  18. Merganser Download Package

    Data.gov (United States)

    U.S. Environmental Protection Agency — This data download package contains an Esri 10.0 MXD, file geodatabase and copy of this FGDC metadata record. The data in this package are used in support of the...

  19. Comparative Packaging Study

    Science.gov (United States)

    Perchonok, Michele; Antonini, David

    2008-01-01

    This viewgraph presentation describes a comparative packaging study for use on long duration space missions. The topics include: 1) Purpose; 2) Deliverables; 3) Food Sample Selection; 4) Experimental Design Matrix; 5) Permeation Rate Comparison; and 6) Packaging Material Information.

  20. Materials for advanced packaging

    CERN Document Server

    Wong, CP

    2008-01-01

    Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

  1. Packaging Printing Today

    OpenAIRE

    Bolanča, Stanislav; Majnarić, Igor; Golubović, Kristijan

    2015-01-01

    Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid print...

  2. ATLAS software packaging

    Science.gov (United States)

    Rybkin, Grigory

    2012-12-01

    Software packaging is indispensable part of build and prerequisite for deployment processes. Full ATLAS software stack consists of TDAQ, HLT, and Offline software. These software groups depend on some 80 external software packages. We present tools, package PackDist, developed and used to package all this software except for TDAQ project. PackDist is based on and driven by CMT, ATLAS software configuration and build tool, and consists of shell and Python scripts. The packaging unit used is CMT project. Each CMT project is packaged as several packages—platform dependent (one per platform available), source code excluding header files, other platform independent files, documentation, and debug information packages (the last two being built optionally). Packaging can be done recursively to package all the dependencies. The whole set of packages for one software release, distribution kit, also includes configuration packages and contains some 120 packages for one platform. Also packaged are physics analysis projects (currently 6) used by particular physics groups on top of the full release. The tools provide an installation test for the full distribution kit. Packaging is done in two formats for use with the Pacman and RPM package managers. The tools are functional on the platforms supported by ATLAS—GNU/Linux and Mac OS X. The packaged software is used for software deployment on all ATLAS computing resources from the detector and trigger computing farms, collaboration laboratories computing centres, grid sites, to physicist laptops, and CERN VMFS and covers the use cases of running all applications as well as of software development.

  3. Central heating: package boilers

    Energy Technology Data Exchange (ETDEWEB)

    Farahan, E.

    1977-05-01

    Performance and cost data for electrical and fossil-fired package boilers currently available from manufacturers are provided. Performance characteristics investigated include: unit efficiency, rated capacity, and average expected lifetime of units. Costs are tabulated for equipment and installation of various package boilers. The information supplied in this report will simplify the process of selecting package boilers required for industrial, commercial, and residential applications.

  4. Encapsulation for smart textile electronics - humidity and temperature sensor.

    Science.gov (United States)

    Larsson, Andreas; Tran, Thanh-Nam; Aasmundtveit, Knut E; Seeberg, Trine M

    2015-01-01

    A combined humidity and temperature sensor was packaged by vacuum casting onto three different types of textiles; cotton, nylon and a waterproof fabric. This was done in order to integrate the sensor in a jacket in a soft and reliable way without changing the sensor performance. A membrane was custom made and integrated into the device to protect the sensor from the environment. The packaged sensors performance was characterized in a climate chamber were the relative humidity and temperature ranged from 25 % to 95 % and -10 °C to 75 °C respectively. The packaged sensors showed insignificant to limited performance degradation.

  5. Intelligent packaging for monitoring food quality: a case study on fresh fish

    NARCIS (Netherlands)

    Heising, J.K.

    2014-01-01

    Background Foods are prone to quality degradation in the whole supply chain, but the possibilities for monitoring the quality of foods inside the package are limited. When sensors of quality indicators are included into the package of a food, the package can become an intell

  6. Intelligent packaging for monitoring food quality: a case study on fresh fish

    NARCIS (Netherlands)

    Heising, J.K.

    2014-01-01

    Background Foods are prone to quality degradation in the whole supply chain, but the possibilities for monitoring the quality of foods inside the package are limited. When sensors of quality indicators are included into the package of a food, the package can become an

  7. Benign monomelic amyotrophy: a study of twenty-one cases.

    Science.gov (United States)

    De Freitas, M R; Nascimento, O J

    2000-09-01

    A consecutive series of 21 patients with single limb atrophy (monomelic amyotrophy) is reported. Sixteen had lower limb atrophy and five had upper limb involvement. The median age of the onset was 20 years. Characteristic features were sporadic occurrence, wasting confined to one limb, insidious onset with slow progression, stabilizing in 1 to 4 years, and absence of pyramidal signs. All the patients with upper limb involvement were male, however in our cases with lower limb amyotrophy there were no male preponderance. We observed wasting of the entire length of the lower limbs in six patients. There were nine cases with amyotrophy restricted to the leg and one with amyotrophy only in the thigh. In the upper limb in four cases the involvement was distal and in one patient the atrophy was proximal. The electromyographic features were suggestive of anterior horn disease not only in the affected limb but also, in some cases, in clinically uninvolved limb. Cervical or lumbar MRI was normal. MRI of the lower limb disclosed increased signal intensity in the gastrocnemius and soleus muscles in one patient suggesting denervation.

  8. Benign monomelic amyotrophy: a study of twenty-one cases

    OpenAIRE

    Marcos R. G.de Freitas; Nascimento, Osvaldo J.M.

    2000-01-01

    A consecutive series of 21 patients with single limb atrophy (monomelic amyotrophy) is reported. Sixteen had lower limb atrophy and five had upper limb involvement. The median age of the onset was 20 years. Characteristic features were sporadic occurrence, wasting confined to one limb, insidious onset with slow progression, stabilizing in 1 to 4 years, and absence of pyramidal signs. All the patients with upper limb involvement were male, however in our cases with lower limb amyotrophy there ...

  9. TWENTY-ONE-YEAR EXTENSION PROJECT PERFORMANCE "LET'S BREASTFEEDING, MOMMY?"

    Directory of Open Access Journals (Sweden)

    Marizete Argolo Teixeira

    2017-05-01

    Full Text Available Research aiming to describe the actions that were developed by the Extension Project "Let's breastfeed, Mom?" During the 21 years of its performance in Jequié / Bahia and identify the difficulties, facilities and progress of the project. This is a descriptive, quantitative-qualitative study. The data were collected in the archived project documents, analyzed through descriptive statistics and content analysis. The results showed that 8,923 registered postpartum women with educational activities and 1,313 domiciliary visits were carried out, as the main actions carried out by the project. The difficulties were: lack of consumer / permanent materials and human resources; As facilities: responsibility and commitment of the members of the project, as well as the support of the transportation service of the institution. The advances were the elaboration of the research project, with insertion of research fellows, creation of the webpage and the logo. It is necessary to reflect on the difficulties and propose measures to remedy them and thus continue to contribute to the promotion, protection and support of breastfeeding in the Municipality, contributing to the reduction of infant morbidity and mortality

  10. Active Packaging Coatings

    Directory of Open Access Journals (Sweden)

    Luis J. Bastarrachea

    2015-11-01

    Full Text Available Active food packaging involves the packaging of foods with materials that provide an enhanced functionality, such as antimicrobial, antioxidant or biocatalytic functions. This can be achieved through the incorporation of active compounds into the matrix of the commonly used packaging materials, or by the application of coatings with the corresponding functionality through surface modification. The latter option offers the advantage of preserving the packaging materials’ bulk properties nearly intact. Herein, different coating technologies like embedding for controlled release, immobilization, layer-by-layer deposition, and photografting are explained and their potential application for active food packaging is explored and discussed.

  11. Edible packaging materials.

    Science.gov (United States)

    Janjarasskul, Theeranun; Krochta, John M

    2010-01-01

    Research groups and the food and pharmaceutical industries recognize edible packaging as a useful alternative or addition to conventional packaging to reduce waste and to create novel applications for improving product stability, quality, safety, variety, and convenience for consumers. Recent studies have explored the ability of biopolymer-based food packaging materials to carry and control-release active compounds. As diverse edible packaging materials derived from various by-products or waste from food industry are being developed, the dry thermoplastic process is advancing rapidly as a feasible commercial edible packaging manufacturing process. The employment of nanocomposite concepts to edible packaging materials promises to improve barrier and mechanical properties and facilitate effective incorporation of bioactive ingredients and other designed functions. In addition to the need for a more fundamental understanding to enable design to desired specifications, edible packaging has to overcome challenges such as regulatory requirements, consumer acceptance, and scaling-up research concepts to commercial applications.

  12. Gain Enhanced LTCC System-on-Package for UMRR Applications

    KAUST Repository

    Shamim, Atif

    2014-10-14

    An apparatus, system, and method for Gain Enhanced LTCC System-on-Package radar sensor. The sensor includes a substrate and an integrated circuit coupled to the substrate, where the integrated circuit is configured to transmit and receive radio frequency (RF) signals. An antenna may be coupled to the integrated circuit and a lens may be coupled to the antenna. The lens may be configured to enhance the gain of the sensor.

  13. Airborne Sensor Thermal Management Solution

    Energy Technology Data Exchange (ETDEWEB)

    Ng, K. K. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

    2015-06-03

    The customer wants to outfit aircraft (de Havilland Twin Otter) with optical sensors. In previous product generations the sensor line-of-sight direction was fixed – the sensor’s direction relied on the orientation of the aircraft. The next generation sensor will be packaged in a rotatable turret so that the line-of-sight is reasonably independent of the aircraft’s orientation. This turret will be mounted on a boom protruding from the side of the aircraft. The customer wants to outfit aircraft (de Havilland Twin Otter) with optical sensors. In previous product generations the sensor line-of-sight direction was fixed – the sensor’s direction relied on the orientation of the aircraft. The next generation sensor will be packaged in a rotatable turret so that the line-of-sight is reasonably independent of the aircraft’s orientation. This turret will be mounted on a boom protruding from the side of the aircraft.

  14. Packaging for Sustainability

    CERN Document Server

    Lewis, Helen; Fitzpatrick, Leanne

    2012-01-01

    The packaging industry is under pressure from regulators, customers and other stakeholders to improve packaging’s sustainability by reducing its environmental and societal impacts. This is a considerable challenge because of the complex interactions between products and their packaging, and the many roles that packaging plays in the supply chain. Packaging for Sustainability is a concise and readable handbook for practitioners who are trying to implement sustainability strategies for packaging. Industry case studies are used throughout the book to illustrate possible applications and scenarios. Packaging for Sustainability draws on the expertise of researchers and industry practitioners to provide information on business benefits, environmental issues and priorities, environmental evaluation tools, design for environment, marketing strategies, and challenges for the future.

  15. MEMS Direct Chip Attach Packaging Methodologies and Apparatuses for Harsh Environments

    Science.gov (United States)

    Okojie, Robert S. (Inventor)

    2009-01-01

    Methods of bulk manufacturing high temperature sensor subassembly packages are disclosed and claimed. Sensors are sandwiched between a top cover and a bottom cover so as to enable the peripheries of the top covers, sensors and bottom covers to be sealed and bound securely together are disclosed and claimed. Sensors are placed on the bottom covers leaving the periphery of the bottom cover exposed. Likewise, top covers are placed on the sensors leaving the periphery of the sensor exposed. Individual sensor sub-assemblies are inserted into final packaging elements which are also disclosed and claimed. Methods of directly attaching wires or pins to contact pads on the sensors are disclosed and claimed. Sensors, such as pressure sensors and accelerometers, and headers made out of silicon carbide and aluminum nitride are disclosed and claimed. Reference cavities are formed in some embodiments disclosed and claimed herein where top covers are not employed.

  16. MEMS Packaging - Current Issues and Approaches

    Energy Technology Data Exchange (ETDEWEB)

    DRESSENDORFER,PAUL V.; PETERSON,DAVID W.; REBER,CATHLEEN ANN

    2000-01-19

    The assembly and packaging of MEMS (Microelectromechanical Systems) devices raise a number of issues over and above those normally associated with the assembly of standard microelectronic circuits. MEMS components include a variety of sensors, microengines, optical components, and other devices. They often have exposed mechanical structures which during assembly require particulate control, space in the package, non-contact handling procedures, low-stress die attach, precision die placement, unique process schedules, hermetic sealing in controlled environments (including vacuum), and other special constraints. These constraints force changes in the techniques used to separate die on a wafer, in the types of packages which can be used in the assembly processes and materials, and in the sealing environment and process. This paper discusses a number of these issues and provides information on approaches being taken or proposed to address them.

  17. Conceptual exploration package for data fusion

    Science.gov (United States)

    Jousselme, Anne-Laure; Grenier, Dominic; Bosse, Eloi

    2000-04-01

    In this paper, we present a software package designed to explore data fusion area applied to different contexts. This tool, called CEPfuse (Conceptual Exploration Package for Data Fusion) provides a good support to become familiar with all concepts and vocabulary linked to data fusion. Developed with Matlab 5.2, it's also a good tool to test, compare and analyze algorithms. Although the core of this package is evidential reasoning and identity information fusion, it has been conceived to develop all the interesting part of the Multi-Sensor Data Fusion system. Actually, because we concentrate our research work on identity information fusion, the principal included algorithms are Dempster- Shafer rules of combination, Shafer-Logan algorithms for hierarchical structures, and several decision rules.

  18. NOVEL "CATHODE-ON-MEMBRANE" VME PRESSURE SENSOR

    Institute of Scientific and Technical Information of China (English)

    Xia Shanhong; Tao Xinxin; Su Jie; Chen Shaofeng

    2001-01-01

    This article proposes a novel "cathode-on-membrane" vacuum microelectronic (VME)pressure sensor. Compared with conventional VME pressure sensors, the package process of the new structured sensor is easier to control, and therefore it enable greater potential of nass production and high productivity. The properties of the new sensor have been theoretically investigated by computer simulations; the practical structure has been designed and fabricated; and the package technique has been studied.

  19. Biodegradable micromechanical sensors

    DEFF Research Database (Denmark)

    Keller, Stephan Sylvest; Greve, Anders; Schmid, Silvan

    The development of biopolymers for food packaging, medical engineering or drug delivery is a growing field of research [1]. At the same time, the interest in methods for detailed analysis of biopolymers is increasing. Micromechanical sensors are versatile tools for the characterization of mechani......The development of biopolymers for food packaging, medical engineering or drug delivery is a growing field of research [1]. At the same time, the interest in methods for detailed analysis of biopolymers is increasing. Micromechanical sensors are versatile tools for the characterization...... of biopolymers to microfabrication is challenging, as these polymers are affected by common processes such as photolithography or wet etching. Here, we present two methods for fabrication of biodegradable micromechanical sensors. First, we fabricated bulk biopolymer microcantilevers using nanoimprint lithography...

  20. Miniature sensor suitable for electronic nose applications

    DEFF Research Database (Denmark)

    Pinnaduwage, L. A.; Gehl, A. C.; Allman, S. L.;

    2007-01-01

    A major research effort has been devoted over the years for the development of chemical sensors for the detection of chemical and explosive vapors. However, the deployment of such chemical sensors will require the use of multiple sensors probably tens of sensors in a sensor package to achieve sel...... microcantilevers. The sensor can detect parts-per-trillion concentrations of DMMP within 10 s exposure times. The small size of the sensor makes it ideally suited for electronic nose applications. © 2007 American Institute of Physics....

  1. Grooming. Learning Activity Package.

    Science.gov (United States)

    Stark, Pamela

    This learning activity package on grooming for health workers is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These topics are…

  2. Packaging issues: avoiding delamination.

    Science.gov (United States)

    Hall, R

    2005-10-01

    Manufacturers can minimise delamination occurrence by applying the appropriate packaging design and process features. The end user can minimise the impact of fibre tear and reduce subsequent delamination by careful package opening. The occasional inconvenient delamination is a small price to pay for the high level of sterility assurance that comes with the use of Tyvek.

  3. WASTE PACKAGE TRANSPORTER DESIGN

    Energy Technology Data Exchange (ETDEWEB)

    D.C. Weddle; R. Novotny; J. Cron

    1998-09-23

    The purpose of this Design Analysis is to develop preliminary design of the waste package transporter used for waste package (WP) transport and related functions in the subsurface repository. This analysis refines the conceptual design that was started in Phase I of the Viability Assessment. This analysis supports the development of a reliable emplacement concept and a retrieval concept for license application design. The scope of this analysis includes the following activities: (1) Assess features of the transporter design and evaluate alternative design solutions for mechanical components. (2) Develop mechanical equipment details for the transporter. (3) Prepare a preliminary structural evaluation for the transporter. (4) Identify and recommend the equipment design for waste package transport and related functions. (5) Investigate transport equipment interface tolerances. This analysis supports the development of the waste package transporter for the transport, emplacement, and retrieval of packaged radioactive waste forms in the subsurface repository. Once the waste containers are closed and accepted, the packaged radioactive waste forms are termed waste packages (WP). This terminology was finalized as this analysis neared completion; therefore, the term disposal container is used in several references (i.e., the System Description Document (SDD)) (Ref. 5.6). In this analysis and the applicable reference documents, the term ''disposal container'' is synonymous with ''waste package''.

  4. CYPROS - Cybernetic Program Packages

    Directory of Open Access Journals (Sweden)

    Arne Tyssø

    1980-10-01

    Full Text Available CYPROS is an interactive program system consisting of a number of special purpose packages for simulation, identification, parameter estimation and control system design. The programming language is standard FORTRAN IV and the system is implemented on a medium size computer system (Nord-10. The system is interactive and program control is obtained by the use of numeric terminals. Output is rapidly examined by extensive use of video colour graphics. The subroutines included in the packages are designed and documented according to standardization rules given by the SCL (Scandinavian Control Library organization. This simplifies the exchange of subroutines throughout the SCL system. Also, this makes the packages attractive for implementation by industrial users. In the simulation package, different integration methods are available and it can be easily used for off-line, as well as real time, simulation problems. The identification package consists of programs for single-input/single-output and multivariablc problems. Both transfer function models and state space models can be handled. Optimal test signals can be designed. The control package consists of programs based on multivariable time domain and frequency domain methods for analysis and design. In addition, there is a package for matrix and time series manipulation. CYPROS has been applied successfully to industrial problems of various kinds, and parts of the system have already been implemented on different computers in industry. This paper will, in some detail, describe the use and the contents of the packages and some examples of application will be discussed.

  5. User friendly packaging

    DEFF Research Database (Denmark)

    Geert Jensen, Birgitte

    2010-01-01

    Most consumers have experienced occasional problems with opening packaging. Tomato sauce from the tinned mackerel splattered all over the kitchen counter, the unrelenting pickle jar lid, and the package of sliced ham that cannot be opened without a knife or a pair of scissors. The research project...

  6. Advanced flip chip packaging

    CERN Document Server

    Lai, Yi-Shao; Wong, CP

    2013-01-01

    Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.

  7. Smart packaging for the monitoring of fish freshness

    Science.gov (United States)

    Pacquit, Alexis; Lau, King Tong; Diamond, Dermot

    2005-06-01

    The development of chromo-reactive sensor spots for real time monitoring of fish freshness is described. The on-package sensor spots incorporating an immobilized pH sensitive dye, respond through visible colour change to basic volatile spoilage compounds collectively known as Total Volatile Basic Nitrogen (TVB-N). Trials on fresh fish filets have verified that the sensor can be employed for real time monitoring of fish spoilage. The sensor response can be interrogated with a simple, inexpensive reflectance colorimeter that we have developed based on two LEDs and a photodetector.

  8. Packaging Concerns/Techniques for Large Devices

    Science.gov (United States)

    Sampson, Michael J.

    2009-01-01

    This slide presentation reviews packaging challenges and options for electronic parts. The presentation includes information about non-hermetic packages, space challenges for packaging and complex package variations.

  9. PROSPECTS OF POLYMER PACKAGING MATERIALS

    Directory of Open Access Journals (Sweden)

    V. A. Sedykh

    2012-01-01

    Full Text Available The main types of materials used in the manufacture of packaging. Analyzed trends in further development of packaging materials. Shows how to improve the quality of plastic packaging materials in today's market.

  10. Consumer response to packaging design

    NARCIS (Netherlands)

    Steenis, Nigel D.; Herpen, van Erica; Lans, van der Ivo A.; Ligthart, Tom N.; Trijp, van Hans C.M.

    2017-01-01

    Building on theories of cue utilization, this paper investigates whether and how packaging sustainability influences consumer perceptions, inferences and attitudes towards packaged products. A framework is tested in an empirical study among 249 students using soup products varying in packaging

  11. Packaging Printing Today

    Directory of Open Access Journals (Sweden)

    Stanislav Bolanča

    2015-12-01

    Full Text Available Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. The possibilities of particular printing techniques for optimal production of the determined packaging were studied in the paper. The problem was viewed from the technological and economical aspect. The possible printing quality and the time necessary for the printing realization were taken as key parameters. An important segment of the production and the way of life is alocation value and it had also found its place in this paper. The events in the field of packaging printing in the whole world were analyzed. The trends of technique developments and the printing technology for packaging printing in near future were also discussed.

  12. Quality assessment of packaged foods by optical oxygen sensing

    Science.gov (United States)

    Papkovsky, Dmitri B.; O'Mahony, Fiach C.; Kerry, Joe P.; Ogurtsov, Vladimir I.

    2005-11-01

    A phase-fluorometric oxygen sensor system has been developed, which allows non-destructive measurement of residual oxygen levels in sealed containers such as packaged foods. It operates with disposable solid-state sensors incorporated in each pack, and a portable detector which interrogates with the sensors through a (semi)transparent packaging material. The system has been optimized for packaging applications and validated in small and medium scale trials with different types of food, including MAP hams, cheese, convenience foods, smoked fish, bakery. It has demonstrated high efficiency in monitoring package integrity, oxygen profiles in packs, performance of packaging process and many other research and quality control tasks, allowing control of 100% of packs. The low-cost batch-calibrated sensors have demonstrated reliability, safety, stability including direct contact with food, high efficiency in the low oxygen range. Another system, which also employs the fluorescence-based oxygen sensing approach, provides rapid assessment of microbial contamination (total viable counts) in complex samples such as food homogenates, industrial waste, environmental samples, etc. It uses soluble oxygen-sensitive probes, standard microtitter plates and fluorescence measurements on conventional plate reader to monitor growth of aerobic bacteria in small test samples (e.g. food homogenates) via their oxygen respiration. The assay provides high sample through put, miniaturization, speed, and can serve as alternative to the established methods such as agar plate colony counts and turbidimetry.

  13. Hermeticity of electronic packages

    CERN Document Server

    Greenhouse, Hal; Romenesco, Bruce

    2011-01-01

    This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the packageùespecially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to so

  14. Optoelectronic packaging: A review

    Energy Technology Data Exchange (ETDEWEB)

    Carson, R.F.

    1993-09-01

    Optoelectronics and photonics hold great potential for high data-rate communication and computing. Wide using in computing applications was limited first by device technologies and now suffers due to the need for high-precision, mass-produced packaging. The use of phontons as a medium of communication and control implies a unique set of packaging constraints that was not present in traditional telecommunications applications. The state-of-the-art in optoelectronic packaging is now driven by microelectric techniques that have potential for low cost and high volume manufacturing.

  15. Hermeticity of electronic packages

    CERN Document Server

    Greenhouse, Hal

    2000-01-01

    This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the package-especially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to so

  16. Dual Use Packaging Project

    Data.gov (United States)

    National Aeronautics and Space Administration — NASA calculation that over a kg of packaging waste are generated per day for a 6 member crew. This represents over 1.5 metric tons of waste during a Mars mission....

  17. Materials for advanced packaging

    CERN Document Server

    Wong, CP

    2017-01-01

    This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D package architectures, novel bonding and joining techniques, wire bonding, wafer thinning techniques, organic substrates, and novel approaches to make electrical interconnects between integrated circuit and substrates. Various chapters also address advances in several key packaging materials, including: Lead-free solders Flip chip underfills Epoxy molding compounds Conductive adhesives Die attach adhesives/films Thermal interface materials (TIMS) Materials for fabricating embedded passives including capacitors, inductors, and resistors Materials and processing aspects on wafer-level chip scale package (CSP) and MicroElectroMechanical system (MEMS) Contributors also review new and emerging technologies such as Light ...

  18. FLEXIBLE FOOD PACKAGING LABORATORY

    Data.gov (United States)

    Federal Laboratory Consortium — This laboratory contains equipment to fabricate and test prototype packages of many types and sizes (e.g., bags, pouches, trays, cartons, etc.). This equipment can...

  19. London 2012 packaging guidelines

    OpenAIRE

    2013-01-01

    These guidelines are intended to provide supplemental advice to suppliers and licensees regarding the provisions of the LOCOG Sustainable Sourcing Code that relate to packaging design and materials selection.

  20. Lush Cosmetics packaging

    OpenAIRE

    Hudson, Frazer

    2014-01-01

    Frazer Hudson – Lush Cosmetics Packaging Commissioned by Suzie Hackney for Lush Cosmetics via illustration Agency - Debut Art - February 2014 I was approached in February 2014 via my London based Illustration agency Debut Art to create packaging illustration designs for the high street retailer and International cosmetics brand ‘Lush’. The illustrations would be used on an octagonal gift box set and be positioned amongst other bespoke gift box set designs within Lush Cosme...

  1. Galeri Matrix Generation Package

    Energy Technology Data Exchange (ETDEWEB)

    2006-09-01

    The Galeri package defines a collection of serial and distributed linear algebra objects to be used for software verification and validation. Galeri is used in several of the examples of the Amesos, IFPACK and ML packages, and in the Trilinos tutorial, Didasko. Galeri can be used for the generation of linear system with known propeties and data distribution for convergence analysis of interative solvers of Krylov type and domain decomposition and multigrid preconditioners.

  2. Use of Optical Oxygen Sensors in Non-Destructively Determining the Levels of Oxygen Present in Combined Vacuum and Modified Atmosphere Packaged Pre-Cooked Convenience-Style Foods and the Use of Ethanol Emitters to Extend Product Shelf-Life

    Directory of Open Access Journals (Sweden)

    Andreas W. Hempel

    2013-11-01

    Full Text Available O2 sensors were used to non-destructively monitor O2 levels in commercially packed pre-cooked, convenience modified atmosphere packaging (MAP foods. A substantial level of O2 (>15% was present in packs resulting in a shorter than expected shelf-life, where the primary spoilage mechanism was found to be mould. Various combinations of vacuum (0–0.6 MPa and gas flush (0.02–0.03 MPa (30% CO2/70% N2 settings were assessed as treatments that result in the desired shelf-life (28 days. This was achieved using the combined treatment of vacuum 0.35 MPa and gas flush 0.02 MPa which resulted in a reduction of 6%–9% O2 in all three samples (battered sausages (BS, bacon slices (BA, and meat and potato pies (PP. Reduced O2 levels reflect the microbial quality of products, which has been successfully reduced. Duplicate samples of all product packs were produced using ethanol emitters (EE to see if shelf-life could be further extended. Results showed a further improvement in shelf-life to 35 days. Sensory analysis showed that ethanol flavour and aroma was not perceived by panellists in two of the three products assessed. This study demonstrates how smart packaging technologies, both intelligent and active, can be used to assist in the modification of conventional packaging systems in order to enhance product quality and safety and through the extension of product shelf-life.

  3. RH Packaging Program Guidance

    Energy Technology Data Exchange (ETDEWEB)

    Washington TRU Solutions LLC

    2008-01-12

    The purpose of this program guidance document is to provide the technical requirements for use, operation, inspection, and maintenance of the RH-TRU 72-B Waste Shipping Package (also known as the "RH-TRU 72-B cask") and directly related components. This document complies with the requirements as specified in the RH-TRU 72-B Safety Analysis Report for Packaging (SARP), and Nuclear Regulatory Commission (NRC) Certificate of Compliance (C of C) 9212. If there is a conflict between this document and the SARP and/or C of C, the C of C shall govern. The C of C states: "...each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application." It further states: "...each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP tasks the Waste Isolation Pilot Plant (WIPP) Management and Operating (M&O) Contractor with assuring the packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) §71.8, "Deliberate Misconduct." Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the U.S. Department of Energy (DOE) Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, "Packaging and Transportation of Radioactive Material," certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21, "Reporting of Defects and Noncompliance," regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a

  4. RH Packaging Program Guidance

    Energy Technology Data Exchange (ETDEWEB)

    Washington TRU Solutions LLC

    2006-11-07

    The purpose of this program guidance document is to provide the technical requirements for use, operation, inspection, and maintenance of the RH-TRU 72-B Waste Shipping Package and directly related components. This document complies with the requirements as specified in the RH-TRU 72-B Safety Analysis Report for Packaging (SARP), and Nuclear Regulatory Commission (NRC) Certificate of Compliance (C of C) 9212. If there is a conflict between this document and the SARP and/or C of C, the C of C shall govern. The C of C states: "...each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application." It further states: "...each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP tasks the Waste Isolation Pilot Plant (WIPP) Management and Operating (M&O) Contractor with assuring the packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with 10 Code of Federal Regulations (CFR) §71.8, "Deliberate Misconduct." Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the U.S. Department of Energy (DOE) Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, "Packaging and Transportation of Radioactive Material," certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21, "Reporting of Defects and Noncompliance," regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to

  5. CH Packaging Program Guidance

    Energy Technology Data Exchange (ETDEWEB)

    None, None

    2009-06-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: "each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application." They further state: "each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M&O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) §71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations are

  6. CH Packaging Program Guidance

    Energy Technology Data Exchange (ETDEWEB)

    None, None

    2008-09-11

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: "each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the pplication." They further state: "each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M&O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) §71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations are

  7. Design of Real-time Communication Adapter for Different Protocol Sensors in Sensor Web

    Directory of Open Access Journals (Sweden)

    Longlong Lu

    2012-09-01

    Full Text Available A real-time communication adapter named SensorAdapter is designed to communicate between different protocols sensors and data service layer in Sensor Web. The adapter is extended and restructured based on SensorBus, an open source project raised by a German company called 52north. By structuring the receiving module and extending the proxies of sensors according to the communication protocols the sensors use, the adapter can receive sensing information detected by different protocols sensors simultaneously. The receiving module identifies a sensor and finds its corresponding proxy in SensorAdapter by sensor ID (SensorID, and then packages the sensing information to XMPP messages and sends them to XMPPServer by invoking the methods in its proxy. At last, an example of SOS is achieved to verify the effect of the adapter.

  8. CH Packaging Program Guidance

    Energy Technology Data Exchange (ETDEWEB)

    None, None

    2007-12-13

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: "each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application." They further state: "each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M&O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) §71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations are

  9. RH Packaging Operations Manual

    Energy Technology Data Exchange (ETDEWEB)

    Washington TRU Solutions LLC

    2003-09-17

    This procedure provides operating instructions for the RH-TRU 72-B Road Cask, Waste Shipping Package. In this document, ''Packaging'' refers to the assembly of components necessary to ensure compliance with the packaging requirements (not loaded with a payload). ''Package'' refers to a Type B packaging that, with its radioactive contents, is designed to retain the integrity of its containment and shielding when subject to the normal conditions of transport and hypothetical accident test conditions set forth in 10 CFR Part 71. Loading of the RH 72-B cask can be done two ways, on the RH cask trailer in the vertical position or by removing the cask from the trailer and loading it in a facility designed for remote-handling (RH). Before loading the 72-B cask, loading procedures and changes to the loading procedures for the 72-B cask must be sent to CBFO at sitedocuments@wipp.ws for approval.

  10. Packaging the MAMA module

    Science.gov (United States)

    Seals, J. Dennis

    1994-10-01

    The MAMA (Mixed Arithmetic, Multiprocessing Array) module is being developed to evaluate new packaging technologies and processing paradigms for advanced military processing systems. The architecture supports a tight mix of signal, data,and I/O processing at GFLOP throughput rates. It is fabricated using only commercial-on-the-sehlf (COTS) chips and will provide a high level of durability. Its attributes are largely the result of two new interconnection and packaging technologies. Chip-in-board packaging is used to reduce local x-y communication delays and solder joints, while significantly improving board-level packaging density. A unique 3-D interconnection technology called a cross-over cell has been developed to reduce board-to-board communication delays, drive power, glue logic, and card-edge pin-outs. These technologies enable true 3-D structures that are form, fit and connector compatible with conventional line-replacable modules. The module's design rational, packaging technology, and basic architecture will be presented in this paper.

  11. Small, Inexpensive Combined NOx Sensor and O2 Sensor

    Energy Technology Data Exchange (ETDEWEB)

    W. N. Lawless; C. F. Clark, Jr.

    2008-09-08

    It has been successfully demonstrated in this program that a zirconia multilayer structure with rhodium-based porous electrodes performs well as an amperometric NOx sensor. The sensitivity of the sensor bodies operating at 650 to 700 C is large, with demonstrated current outputs of 14 mA at 500 ppm NOx from sensors with 30 layers. The sensor bodies are small (4.5 x 4.2 x 3.1 mm), rugged, and inexpensive. It is projected the sensor bodies will cost $5 - $10 in production. This program has built on another successful development program for an oxygen sensor based on the same principles and sponsored by DOE. This oxygen sensor is not sensitive to NOx. A significant technical hurdle has been identified and solved. It was found that the 100% Rh electrodes oxidize rapidly at the preferred operating temperatures of 650 - 700 C, and this oxidation is accompanied by a volume change which delaminates the sensors. The problem was solved by using alloys of Rh and Pt. It was found that a 10%/90% Rh/Pt alloy dropped the oxidation rate of the electrodes by orders of magnitude without degrading the NOx sensitivity of the sensors, allowing long-term stable operation at the preferred operating temperatures. Degradation in the sensor output caused by temperature cycling was identified as a change in resistance at the junction between the sensor body and the external leads attached to the sensor body. The degradation was eliminated by providing strong mechanical anchors for the wire and processing the junctions to obtain good electrical bonds. The NOx sensors also detect oxygen and therefore the fully-packaged sensor needs to be enclosed with an oxygen sensor in a small, heated zirconia chamber exposed to test gas through a diffusion plug which limits the flow of gas from the outside. Oxygen is pumped from the interior of the chamber to lower the oxygen content and the combination of measurements from the NOx and oxygen sensors yields the NOx content of the gas. Two types of

  12. Design,Fabrication and Test of a VME Pressure Sensor

    Institute of Scientific and Technical Information of China (English)

    XIAShanhong; CHENShaofeng; LIUJia

    2003-01-01

    This paper presents the design,fabrication,packaging and measurement results of a vacuum microelectronic(VME)pressure sensor.A new configuration,named "cathode-on-membrane",greatly reduces the difficulties in the packaging process and enables practical VME pressure sensors to be developed.Experimental studies and results demonstrate the characteristics of the sensor output current variation with applied pressure under different working voltages.

  13. EDITORIAL: Humidity sensors Humidity sensors

    Science.gov (United States)

    Regtien, Paul P. L.

    2012-01-01

    All matter is more or less hygroscopic. The moisture content varies with vapour concentration of the surrounding air and, as a consequence, most material properties change with humidity. Mechanical and thermal properties of many materials, such as the tensile strength of adhesives, stiffness of plastics, stoutness of building and packaging materials or the thermal resistivity of isolation materials, all decrease with increasing environmental humidity or cyclic humidity changes. The presence of water vapour may have a detrimental influence on many electrical constructions and systems exposed to humid air, from high-power systems to microcircuits. Water vapour penetrates through coatings, cable insulations and integrated-circuit packages, exerting a fatal influence on the performance of the enclosed systems. For these and many other applications, knowledge of the relationship between moisture content or humidity and material properties or system behaviour is indispensable. This requires hygrometers for process control or test and calibration chambers with high accuracy in the appropriate temperature and humidity range. Humidity measurement methods can roughly be categorized into four groups: water vapour removal (the mass before and after removal is measured); saturation (the air is brought to saturation and the `effort' to reach that state is measured); humidity-dependent parameters (measurement of properties of humid air with a known relation between a specific property and the vapour content, for instance the refractive index, electromagnetic spectrum and acoustic velocity); and absorption (based on the known relation between characteristic properties of non-hydrophobic materials and the amount of absorbed water from the gas to which these materials are exposed). The many basic principles to measure air humidity are described in, for instance, the extensive compilations by Wexler [1] and Sonntag [2]. Absorption-type hygrometers have small dimensions and can be

  14. MMIC packaging with Waffleline

    Science.gov (United States)

    Perry, R. W.; Ellis, T. T.; Schineller, E. R.

    1990-06-01

    The design principle of Waffleline, a patented MMIC packaging technology, is discussed, and several recent applications are described and illustrated with drawings, diagrams, and photographs. Standard Waffleline is a foil-covered waffle-iron-like grid with dielectric-coated signal and power wires running in the channels and foil-removed holes for mounting prepackaged chips or chip carriers. With spacing of 50 mils between center conductors, this material is applicable at frequencies up to 40 GHz; EHF devices require Waffleline with 25-mil spacing. Applications characterized include a subassembly for a man-transportable SHF satellite-communication terminal, a transmitter driver for a high-power TWT, and a 60-GHz receiver front end (including an integrated monolithic microstrip antenna, a low-noise amplifier, a mixer, and an IF amplifier in a 0.25-inch-thick 1.6-inch-diameter package). The high package density and relatively low cost of Waffleline are emphasized.

  15. Packaging Solutions : Delivering customer value through Logistical Packaging: A Case Study at Stora Enso Packaging

    OpenAIRE

    Shan, Kun; Julius, Joezer

    2015-01-01

    AbstractBackground;Despite of the significant role of packaging within logistics and supply chain management, packaging is infrequently studied as focal point in supply chain. Most of the previous logistics research studies tend to explain the integration between packaging and logistics through logistical packaging. In very rare cases, the studies mentioned about customer value. Therefore the major disadvantage of these studies is that, they didn’t consider logistical packaging and customer v...

  16. Determination of packaging induced 3D stress utilizing a piezocoefficient mapping device

    DEFF Research Database (Denmark)

    Richter, Jacob; Hyldgård, A.; Birkelund, Karen;

    2007-01-01

    This paper presents a novel method to determine 3D stress in microsystem packaging. The stress components sigmaxx, sigmayy, sigmazz, and sigmaxy are found in an epoxy package using a piezocoefficient mapping device as stress sensor. We spin the current 360deg in a circular n-type (001) Si...

  17. Mass Transfer Study of Chlorine Dioxide Gas Through Polymeric Packaging Materials

    Science.gov (United States)

    A continuous system for measuring the mass transfer of gaseous chlorine dioxide (ClO2), a strong oxidizing agent and used in food and pharmaceutical packaging, through 10 different types of polymeric packaging material was developed utilizing electrochemical sensor as a detector. Permeability, diff...

  18. SPHINX experimenters information package

    Energy Technology Data Exchange (ETDEWEB)

    Zarick, T.A. [Sandia National Lab., Albuquerque, NM (United States). Radiation Effects Experimentation Dept.

    1996-08-01

    This information package was prepared for both new and experienced users of the SPHINX (Short Pulse High Intensity Nanosecond X-radiator) flash X-Ray facility. It was compiled to help facilitate experiment design and preparation for both the experimenter(s) and the SPHINX operational staff. The major areas covered include: Recording Systems Capabilities,Recording System Cable Plant, Physical Dimensions of SPHINX and the SPHINX Test cell, SPHINX Operating Parameters and Modes, Dose Rate Map, Experiment Safety Approval Form, and a Feedback Questionnaire. This package will be updated as the SPHINX facilities and capabilities are enhanced.

  19. 2 DOF resolution adjustment laser position sensor

    CSIR Research Space (South Africa)

    Shaik, A

    2008-12-01

    Full Text Available A low cost sensor system is envisaged that has 2 distinct routes for resolution enhancement in position detection. The main area for application of the sensor design would be in the food processing and packaging industry where position resolution...

  20. Advanced image processing package for FPGA-based re-programmable miniature electronics

    Science.gov (United States)

    Ovod, Vladimir I.; Baxter, Christopher R.; Massie, Mark A.; McCarley, Paul L.

    2005-05-01

    Nova Sensors produces miniature electronics for a variety of real-time digital video camera systems, including foveal sensors based on Nova's Variable Acuity Superpixel Imager (VASITM) technology. An advanced image-processing package has been designed at Nova Sensors to re-configure the FPGA-based co-processor board for numerous applications including motion detection, optical, background velocimetry and target tracking. Currently, the processing package consists of 14 processing operations that cover a broad range of point- and area-applied algorithms. Flexible FPGA designs of these operations and re-programmability of the processing board allows for easy updates of the VASITM sensors, and for low-cost customization of VASITM sensors taking into account specific customer requirements. This paper describes the image processing algorithms implemented and verified in Xilinx FPGAs and provides the major technical performances with figures illustrating practical applications of the processing package.

  1. The Swarm Magnetometry Package

    DEFF Research Database (Denmark)

    Merayo, José M.G.; Jørgensen, John Leif; Friis-Christensen, Eigil

    2008-01-01

    The Swarm mission under the ESA's Living Planet Programme is planned for launch in 2010 and consists of a constellation of three satellites at LEO. The prime objective of Swarm is to measure the geomagnetic field with unprecedented accuracy in space and time. The magnetometry package consists...

  2. Waste disposal package

    Science.gov (United States)

    Smith, M.J.

    1985-06-19

    This is a claim for a waste disposal package including an inner or primary canister for containing hazardous and/or radioactive wastes. The primary canister is encapsulated by an outer or secondary barrier formed of a porous ceramic material to control ingress of water to the canister and the release rate of wastes upon breach on the canister. 4 figs.

  3. Metric Education Evaluation Package.

    Science.gov (United States)

    Kansky, Bob; And Others

    This document was developed out of a need for a complete, carefully designed set of evaluation instruments and procedures that might be applied in metric inservice programs across the nation. Components of this package were prepared in such a way as to permit local adaptation to the evaluation of a broad spectrum of metric education activities.…

  4. Geothermal Greenhouse Information Package

    Energy Technology Data Exchange (ETDEWEB)

    Rafferty, K. [P.E.; Boyd, T. [ed.

    1997-01-01

    This package of information is intended to provide a foundation of background information for developers of geothermal greenhouses. The material is divided into seven sections covering such issues as crop culture and prices, operating costs for greenhouses, heating system design, vendors and a list of other sources of information.

  5. Aquaculture Information Package

    Energy Technology Data Exchange (ETDEWEB)

    Boyd, T.; Rafferty, K. [editors

    1998-01-01

    This package of information is intended to provide background to developers of geothermal aquaculture projects. The material is divided into eight sections and includes information on market and price information for typical species, aquaculture water quality issues, typical species culture information, pond heat loss calculations, an aquaculture glossary, regional and university aquaculture offices and state aquaculture permit requirements.

  6. Automatic Differentiation Package

    Energy Technology Data Exchange (ETDEWEB)

    2007-03-01

    Sacado is an automatic differentiation package for C++ codes using operator overloading and C++ templating. Sacado provide forward, reverse, and Taylor polynomial automatic differentiation classes and utilities for incorporating these classes into C++ codes. Users can compute derivatives of computations arising in engineering and scientific applications, including nonlinear equation solving, time integration, sensitivity analysis, stability analysis, optimization and uncertainity quantification.

  7. Polymers in Waveguide Packaging

    Institute of Scientific and Technical Information of China (English)

    Zhiyi Zhang; G. Z.Xiao; Jiaren Liu; C. P. Grover

    2003-01-01

    Polymers were successfully used in the packaging of waveguide-based photonic components in the area of fiber-to-waveguide coupling, waveguide die attachment, strain relief, and waveguide encapsulation. The application results of these polymers were described in this paper.

  8. Adapting MCM-D technology to a piezoresistive accelerometer packaging

    Science.gov (United States)

    Collado, A.; Plaza, J. A.; Cabruja, E.; Esteve, J.

    2003-07-01

    A silicon-on-silicon multichip module for a piezoresistive accelerometer is presented in this paper. This packaging technology, a type of wafer level packaging, offers fully complementary metal-oxide semiconductor compatible silicon substrates, so a pre-amplification stage can be included at substrate level. The electrical contacts and a partial sealing of the sensor mobile structures are performed at the same step using flip-chip technology, so the cost is reduced. As accelerometers are stress-sensitive devices, great care must be taken in the fabrication process and materials. Thus, test structures have been included to study the packaging effects. In this paper we report on the compatibility of accelerometer and wafer level packaging technologies.

  9. Monitoring the quality of perishable foods: opportunities for intelligent packaging.

    Science.gov (United States)

    Heising, Jenneke K; Dekker, Matthijs; Bartels, Paul V; Van Boekel, M A J S Tiny

    2014-01-01

    This review paper discusses opportunities for intelligent packaging for monitoring directly or indirectly quality attributes of perishable packaged foods. The possible roles of intelligent packaging as a tool in supply chain management are discussed as well as the barriers to implement this kind of technology in commercial applications. Cases on pasteurized milk and fresh cod fillets illustrate the application of different intelligent packaging concepts to monitor and estimate quality attributes. Conditions influencing quality (e.g., temperature-time) can be monitored to predict the quality of perishable products when the initial quality is known and rather constant (e.g., pasteurized milk). Products with a highly variable initial quality (e.g., fresh fish) require sensors monitoring compounds correlated with quality.

  10. Developing a training package.

    Science.gov (United States)

    Minogue, Virginia; Donskoy, Anne-Laure

    2017-06-12

    Purpose The purpose of this paper is to outline the development of a training package for service users and carers with an interest in NHS health and social care research. It demonstrates how the developers used their unique experience and expertise as service users and carers to inform their work. Design/methodology/approach Service users and carers, NHS Research and Development Forum working group members, supported by health professionals, identified a need for research training that was tailored to other service user and carer needs. After reviewing existing provision and drawing on their training and support experience, they developed a training package. Sessions from the training package were piloted, which evaluated positively. In trying to achieve programme accreditation and training roll-out beyond the pilots, the group encountered several challenges. Findings The training package development group formed good working relationships and a co-production model that proved sustainable. However, challenges were difficult to overcome owing to external factors and financial constraints. Practical implications Lessons learnt by the team are useful for other service users and carer groups working with health service professionals. Training for service users and carers should be designed to meet their needs; quality and consistency are also important. The relationships between service user and carer groups, and professionals are important to understanding joint working. Recognising and addressing challenges at the outset can help develop strategies to overcome challenges and ensure project success. Originality/value The training package was developed by service users and carers for other service users and carers. Their unique health research experience underpinned the group's values and training development.

  11. Packaging design criteria for the Hanford Ecorok Packaging

    Energy Technology Data Exchange (ETDEWEB)

    Mercado, M.S.

    1996-01-19

    The Hanford Ecorok Packaging (HEP) will be used to ship contaminated water purification filters from K Basins to the Central Waste Complex. This packaging design criteria documents the design of the HEP, its intended use, and the transportation safety criteria it is required to meet. This information will serve as a basis for the safety analysis report for packaging.

  12. Lakes Ecosystem Services Download Package

    Data.gov (United States)

    U.S. Environmental Protection Agency — This data download package contains Esri 10.0 MXDs, file geodatabases and copy of this FGDC metadata record. The data in this package are used in support of the Lake...

  13. Food packaging history and innovations.

    Science.gov (United States)

    Risch, Sara J

    2009-09-23

    Food packaging has evolved from simply a container to hold food to something today that can play an active role in food quality. Many packages are still simply containers, but they have properties that have been developed to protect the food. These include barriers to oxygen, moisture, and flavors. Active packaging, or that which plays an active role in food quality, includes some microwave packaging as well as packaging that has absorbers built in to remove oxygen from the atmosphere surrounding the product or to provide antimicrobials to the surface of the food. Packaging has allowed access to many foods year-round that otherwise could not be preserved. It is interesting to note that some packages have actually allowed the creation of new categories in the supermarket. Examples include microwave popcorn and fresh-cut produce, which owe their existence to the unique packaging that has been developed.

  14. Alumina Based 500 C Electronic Packaging Systems and Future Development

    Science.gov (United States)

    Chen, Liang-Yu

    2012-01-01

    NASA space and aeronautical missions for probing the inner solar planets as well as for in situ monitoring and control of next-generation aeronautical engines require high-temperature environment operable sensors and electronics. A 96% aluminum oxide and Au thick-film metallization based packaging system including chip-level packages, printed circuit board, and edge-connector is in development for high temperature SiC electronics. An electronic packaging system based on this material system was successfully tested and demonstrated with SiC electronics at 500 C for over 10,000 hours in laboratory conditions previously. In addition to the tests in laboratory environments, this packaging system has more recently been tested with a SiC junction field effect transistor (JFET) on low earth orbit through the NASA Materials on the International Space Station Experiment 7 (MISSE7). A SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE7 suite to International Space Station via a Shuttle mission and tested on the orbit for eighteen months. A summary of results of tests in both laboratory and space environments will be presented. The future development of alumina based high temperature packaging using co-fired material systems for improved performance at high temperature and more feasible mass production will also be discussed.

  15. The Development of MEMS Device Packaging Technology using Proton Beam

    Energy Technology Data Exchange (ETDEWEB)

    Hyun, J. W.; Kim, E. H.; Kim, C. Y.; Lee, D. H.; Sa, S. H. [Dankuk Univ., Seoul (Korea, Republic of)

    2007-04-15

    Microelectromechanical systems (MEMS) are the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology. One of the major issues in MEMS is to obtain a reliable packaging. Since conventional packaging technologies for MEMS require high temperatures and high voltages, packaging failures are frequently involved. In order to realize a reliable packaging, we propose a novel packaging technology for MEMS devices using proton beams; proton beams lose their energies inside the irradiated matter and the maximum energy loss is placed at the Bragg peak. By bonding two materials using the locally deposited heat near the Bragg peak, the packaging damage can be minimized. The energies of the proton beam energies were chosen by the calculation of the stopping and range of ions in matter(SRIM) and the heat analysis was carried out by using the analysis system (ANSYS). For experiments, proton-beam irradiation was performed at room temperature and atmospheric pressure. The energies were 8 {approx} 45 MeV and the currents were 1 {approx} 30 {mu}A. The experimental results show good agreements with the simulation results; melting were found inside the irradiated acrylic block at the corresponding Bragg peaks, and bondings were achieved at the interface between two aluminum plates. We believe that this technique has the potential application in the pyrex-silicon bonding for MEMS packaging.

  16. Ensuring socially responsible packaging design

    DEFF Research Database (Denmark)

    Jensen, Birgitte Geert; Widding, Sofie Hartvig

    "User‐friendly Packaging" aims to create a platform for developing more user‐friendly packaging. One intended outcome of the project is a guideline that industry can use in development efforts. The project also points the way for more extended collaboration between companies and design researchers. How...... can design research help industry in packaging innovation?...

  17. Sustainable Library Development Training Package

    Science.gov (United States)

    Peace Corps, 2012

    2012-01-01

    This Sustainable Library Development Training Package supports Peace Corps' Focus In/Train Up strategy, which was implemented following the 2010 Comprehensive Agency Assessment. Sustainable Library Development is a technical training package in Peace Corps programming within the Education sector. The training package addresses the Volunteer…

  18. RH Packaging Program Guidance

    Energy Technology Data Exchange (ETDEWEB)

    Washington TRU Solutions, LLC

    2003-08-25

    The purpose of this program guidance document is to provide technical requirements for use, operation, inspection, and maintenance of the RH-TRU 72-B Waste Shipping Package and directly related components. This document complies with the requirements as specified in the RH-TRU 72-B Safety Analysis Report for Packaging (SARP), and Nuclear Regulatory Commission (NRC) Certificate of Compliance (C of C) 9212. If there is a conflict between this document and the SARP and/or C of C, the SARP and/or C of C shall govern. The C of C states: ''...each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, ''Operating Procedures,'' of the application.'' It further states: ''...each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, ''Acceptance Tests and Maintenance Program of the Application.'' Chapter 9.0 of the SARP tasks the Waste Isolation Pilot Plant (WIPP) Management and Operating (M&O) contractor with assuring the packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC approved, users need to be familiar with 10 CFR {section} 71.11, ''Deliberate Misconduct.'' Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. This document details the instructions to be followed to operate, maintain, and test the RH-TRU 72-B packaging. This Program Guidance standardizes instructions for all users. Users shall follow these instructions. Following these instructions assures that operations are safe and meet the requirements of the SARP. This document is available on the Internet at: ttp://www.ws/library/t2omi/t2omi.htm. Users are responsible for ensuring they are using the current

  19. Anticounterfeit packaging technologies

    Directory of Open Access Journals (Sweden)

    Ruchir Y Shah

    2010-01-01

    Full Text Available Packaging is the coordinated system that encloses and protects the dosage form. Counterfeit drugs are the major cause of morbidity, mortality, and failure of public interest in the healthcare system. High price and well-known brands make the pharma market most vulnerable, which accounts for top priority cardiovascular, obesity, and antihyperlipidemic drugs and drugs like sildenafil. Packaging includes overt and covert technologies like barcodes, holograms, sealing tapes, and radio frequency identification devices to preserve the integrity of the pharmaceutical product. But till date all the available techniques are synthetic and although provide considerable protection against counterfeiting, have certain limitations which can be overcome by the application of natural approaches and utilization of the principles of nanotechnology.

  20. Anticounterfeit packaging technologies.

    Science.gov (United States)

    Shah, Ruchir Y; Prajapati, Prajesh N; Agrawal, Y K

    2010-10-01

    Packaging is the coordinated system that encloses and protects the dosage form. Counterfeit drugs are the major cause of morbidity, mortality, and failure of public interest in the healthcare system. High price and well-known brands make the pharma market most vulnerable, which accounts for top priority cardiovascular, obesity, and antihyperlipidemic drugs and drugs like sildenafil. Packaging includes overt and covert technologies like barcodes, holograms, sealing tapes, and radio frequency identification devices to preserve the integrity of the pharmaceutical product. But till date all the available techniques are synthetic and although provide considerable protection against counterfeiting, have certain limitations which can be overcome by the application of natural approaches and utilization of the principles of nanotechnology.

  1. Amdahl 470 Chip Package

    CERN Multimedia

    1975-01-01

    In the late 70s the larger IBM computers were water cooled. Amdahl, an IBM competitor, invented an air cooling technology for it's computers. His company worked hard, developing a computer that was faster and less expensive than the IBM System/360 mainframe computer systems. This object contains an actual Amdahl series 470 computer logic chip with an air cooling device mounted on top. The package leads and cooling tower are gold-plated.

  2. Aquaculture information package

    Energy Technology Data Exchange (ETDEWEB)

    Boyd, T.; Rafferty, K.

    1998-08-01

    This package of information is intended to provide background information to developers of geothermal aquaculture projects. The material is divided into eight sections and includes information on market and price information for typical species, aquaculture water quality issues, typical species culture information, pond heat loss calculations, an aquaculture glossary, regional and university aquaculture offices and state aquaculture permit requirements. A bibliography containing 68 references is also included.

  3. The Ettention software package

    Energy Technology Data Exchange (ETDEWEB)

    Dahmen, Tim, E-mail: Tim.Dahmen@dfki.de [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Saarland University, 66123 Saarbrücken (Germany); Marsalek, Lukas [Eyen SE, Na Nivách 1043/16, 141 00 Praha 4 (Czech Republic); Saarland University, 66123 Saarbrücken (Germany); Marniok, Nico [Saarland University, 66123 Saarbrücken (Germany); Turoňová, Beata [Saarland University, 66123 Saarbrücken (Germany); IMPRS-CS, Max-Planck Institute for Informatics, Campus E 1.4, 66123 Saarbrücken (Germany); Bogachev, Sviatoslav [Saarland University, 66123 Saarbrücken (Germany); Trampert, Patrick; Nickels, Stefan [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Slusallek, Philipp [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Saarland University, 66123 Saarbrücken (Germany)

    2016-02-15

    We present a novel software package for the problem “reconstruction from projections” in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. - Highlights: • Novel software package for “reconstruction from projections” in electron microscopy. • Support for high-resolution reconstructions on iterative reconstruction algorithms. • Support for CPU, GPU and Xeon Phi. • Integration in the IMOD software. • Platform for algorithm researchers: object oriented, modular design.

  4. Portable Radiation Package (PRP) Instrument Handbook

    Energy Technology Data Exchange (ETDEWEB)

    Reynolds, R Michael [Remote Measurements and Research Company

    2017-08-03

    The Portable Radiation Package (PRP) was developed to provide basic radiation information in locations such as ships at sea where proper exposure is remote and difficult, the platform is in motion, and azimuth alignment is not fixed. Development of the PRP began at Brookhaven National Laboratory (BNL) in the mid-1990s and versions of it were deployed on ships in the U.S. Department of Energy (DOE) Atmospheric Radiation Measurement (ARM) Climate Research Facility’s Nauru-99 project. The PRP was deployed on ships in support of the National Aeronautics and Space Administration (NASA) Sensor Intercomparison for Marine Biological and Interdisciplinary Ocean Studies (SIMBIOS) program. Over the years the measurements have remained the same while the post-processing data analysis, especially for the FRSR, has evolved. This document describes the next-generation Portable Radiation Package (PRP2) that was developed for the DOE ARM Facility, under contract no. 9F-31462 from Argonne National Laboratory (ANL). The PRP2 has the same scientific principles that were well validated in prior studies, but has upgraded electronic hardware. The PRP2 approach is completely modular, both in hardware and software. Each sensor input is treated as a separate serial stream into the data collection computer. In this way the operator has complete access to each component of the system for purposes of error checking, calibration, and maintenance. The resulting system is more reliable, easier to install in complex situations, and more amenable to upgrade.

  5. Plutonium stabilization and packaging system

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1996-05-01

    This document describes the functional design of the Plutonium Stabilization and Packaging System (Pu SPS). The objective of this system is to stabilize and package plutonium metals and oxides of greater than 50% wt, as well as other selected isotopes, in accordance with the requirements of the DOE standard for safe storage of these materials for 50 years. This system will support completion of stabilization and packaging campaigns of the inventory at a number of affected sites before the year 2002. The package will be standard for all sites and will provide a minimum of two uncontaminated, organics free confinement barriers for the packaged material.

  6. Two-dimensional fibre grating packaging design for simultaneous strain and temperature measurement

    Science.gov (United States)

    Mokhtar, M. R.; Sun, T.; Grattan, K. T. V.

    2010-09-01

    This paper demonstrates a novel two-dimensional sensor packaging design to facilitate the use of fibre grating-based sensors for simultaneous strain and temperature measurement. The width and height of a sensor package were optimized to induce dissimilar responses from two co-located fibre gratings within the sensor head. Through an appropriate calibration of both the strain and temperature coefficients of the individual fibre gratings used, both strain and temperature can be accurately determined and their individual components separated by measuring the shift in their respective Bragg wavelengths. This approach can not only ensure the robustness of the sensor head, but also offer the necessary level of control over the differences between the coefficients, which allows for maximizing the accuracy of the strain and temperature values determined from the sensor itself.

  7. Data Simulation in Machine Olfaction with the R Package Chemosensors

    Science.gov (United States)

    Ziyatdinov, Andrey; Perera-Lluna, Alexandre

    2014-01-01

    In machine olfaction, the design of applications based on gas sensor arrays is highly dependent on the robustness of the signal and data processing algorithms. While the practice of testing the algorithms on public benchmarks is not common in the field, we propose software for performing data simulations in the machine olfaction field by generating parameterized sensor array data. The software is implemented as an R language package chemosensors which is open-access, platform-independent and self-contained. We introduce the concept of a virtual sensor array which can be used as a data generation tool. In this work, we describe the data simulation workflow which basically consists of scenario definition, virtual array parameterization and the generation of sensor array data. We also give examples of the processing of the simulated data as proof of concept for the parameterized sensor array data: the benchmarking of classification algorithms, the evaluation of linear- and non-linear regression algorithms, and the biologically inspired processing of sensor array data. All the results presented were obtained under version 0.7.6 of the chemosensors package whose home page is chemosensors.r-forge.r-project.org. PMID:24586410

  8. Data simulation in machine olfaction with the R package chemosensors.

    Directory of Open Access Journals (Sweden)

    Andrey Ziyatdinov

    Full Text Available In machine olfaction, the design of applications based on gas sensor arrays is highly dependent on the robustness of the signal and data processing algorithms. While the practice of testing the algorithms on public benchmarks is not common in the field, we propose software for performing data simulations in the machine olfaction field by generating parameterized sensor array data. The software is implemented as an R language package chemosensors which is open-access, platform-independent and self-contained. We introduce the concept of a virtual sensor array which can be used as a data generation tool. In this work, we describe the data simulation workflow which basically consists of scenario definition, virtual array parameterization and the generation of sensor array data. We also give examples of the processing of the simulated data as proof of concept for the parameterized sensor array data: the benchmarking of classification algorithms, the evaluation of linear- and non-linear regression algorithms, and the biologically inspired processing of sensor array data. All the results presented were obtained under version 0.7.6 of the chemosensors package whose home page is chemosensors.r-forge.r-project.org.

  9. Data simulation in machine olfaction with the R package chemosensors.

    Science.gov (United States)

    Ziyatdinov, Andrey; Perera-Lluna, Alexandre

    2014-01-01

    In machine olfaction, the design of applications based on gas sensor arrays is highly dependent on the robustness of the signal and data processing algorithms. While the practice of testing the algorithms on public benchmarks is not common in the field, we propose software for performing data simulations in the machine olfaction field by generating parameterized sensor array data. The software is implemented as an R language package chemosensors which is open-access, platform-independent and self-contained. We introduce the concept of a virtual sensor array which can be used as a data generation tool. In this work, we describe the data simulation workflow which basically consists of scenario definition, virtual array parameterization and the generation of sensor array data. We also give examples of the processing of the simulated data as proof of concept for the parameterized sensor array data: the benchmarking of classification algorithms, the evaluation of linear- and non-linear regression algorithms, and the biologically inspired processing of sensor array data. All the results presented were obtained under version 0.7.6 of the chemosensors package whose home page is chemosensors.r-forge.r-project.org.

  10. Realtime 3D stress measurement in curing epoxy packaging

    DEFF Research Database (Denmark)

    Richter, Jacob; Hyldgård, A.; Birkelund, Karen;

    2007-01-01

    This paper presents a novel method to characterize stress in microsystem packaging. A circular p-type piezoresistor is implemented on a (001) silicon chip. We use the circular stress sensor to determine the packaging induced stress in a polystyrene tube filled with epoxy. The epoxy curing process...... is monitored by stress measurements. From the stress measurements we conclude that the epoxy cures in 8 hours at room temperature. We find the difference in in-plane normal stresses to be sigmaxx-sigmayy=6.7 MPa and (sigmaxx+sigmayy-0.4sigmazz)=232 MPa....

  11. Packaging commercial CMOS chips for lab on a chip integration.

    Science.gov (United States)

    Datta-Chaudhuri, Timir; Abshire, Pamela; Smela, Elisabeth

    2014-05-21

    Combining integrated circuitry with microfluidics enables lab-on-a-chip (LOC) devices to perform sensing, freeing them from benchtop equipment. However, this integration is challenging with small chips, as is briefly reviewed with reference to key metrics for package comparison. In this paper we present a simple packaging method for including mm-sized, foundry-fabricated dies containing complementary metal oxide semiconductor (CMOS) circuits within LOCs. The chip is embedded in an epoxy handle wafer to yield a level, large-area surface, allowing subsequent photolithographic post-processing and microfluidic integration. Electrical connection off-chip is provided by thin film metal traces passivated with parylene-C. The parylene is patterned to selectively expose the active sensing area of the chip, allowing direct interaction with a fluidic environment. The method accommodates any die size and automatically levels the die and handle wafer surfaces. Functionality was demonstrated by packaging two different types of CMOS sensor ICs, a bioamplifier chip with an array of surface electrodes connected to internal amplifiers for recording extracellular electrical signals and a capacitance sensor chip for monitoring cell adhesion and viability. Cells were cultured on the surface of both types of chips, and data were acquired using a PC. Long term culture (weeks) showed the packaging materials to be biocompatible. Package lifetime was demonstrated by exposure to fluids over a longer duration (months), and the package was robust enough to allow repeated sterilization and re-use. The ease of fabrication and good performance of this packaging method should allow wide adoption, thereby spurring advances in miniaturized sensing systems.

  12. Packaged stainless steel flowsensor

    NARCIS (Netherlands)

    Leussink, P.J.; Jansen, H.V.; Elwenspoek, M.C.; Elwenspoek, Miko

    2001-01-01

    There are many thermal flowsensors that are realised with MEMS/MST-techniques. All these sensors consisted of one or more heating elements and one or more sensing elements. Thermocouples [2],[3] or resistors [1] were used as sensing elements, and membranes [2] or bridges [1] as sensing structures. M

  13. Packaging - Materials review

    Science.gov (United States)

    Herrmann, Matthias

    2014-06-01

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  14. Packaging - Materials review

    Energy Technology Data Exchange (ETDEWEB)

    Herrmann, Matthias [Hoppecke Advanced Battery Technology GmbH, 08056 Zwickau (Germany)

    2014-06-16

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  15. Components of Adenovirus Genome Packaging

    Science.gov (United States)

    Ahi, Yadvinder S.; Mittal, Suresh K.

    2016-01-01

    Adenoviruses (AdVs) are icosahedral viruses with double-stranded DNA (dsDNA) genomes. Genome packaging in AdV is thought to be similar to that seen in dsDNA containing icosahedral bacteriophages and herpesviruses. Specific recognition of the AdV genome is mediated by a packaging domain located close to the left end of the viral genome and is mediated by the viral packaging machinery. Our understanding of the role of various components of the viral packaging machinery in AdV genome packaging has greatly advanced in recent years. Characterization of empty capsids assembled in the absence of one or more components involved in packaging, identification of the unique vertex, and demonstration of the role of IVa2, the putative packaging ATPase, in genome packaging have provided compelling evidence that AdVs follow a sequential assembly pathway. This review provides a detailed discussion on the functions of the various viral and cellular factors involved in AdV genome packaging. We conclude by briefly discussing the roles of the empty capsids, assembly intermediates, scaffolding proteins, portal vertex and DNA encapsidating enzymes in AdV assembly and packaging. PMID:27721809

  16. Submersible Packaging Techniques

    Science.gov (United States)

    1989-07-01

    Butyraldehyde E,K Aniline Hydrochloride E Butyric Acid V,E Fluid codes are defined in paragraph 40.2.1 and are listed in order of recommended use . 20...Furfuryl Alcohol E Ethyl Chloride E,B,N Gallic Acid V,FE Ethyl Chiorocarbonate V,F Gasoline BV,F Ethyl Chioroformate V,F Glycerine B,E Ethylene Chloride...This document describes packaging techniques that would allow sophisticated electronics to be used and transported reliably underwater. 20. DISTRIBUTION

  17. The PIDCalib package

    CERN Document Server

    Anderlini, Lucio; Jones, Christopher Rob; Malde, Sneha Sirirshkumar; Muller, Dominik; Ogilvy, Stephen; Otalora Goicochea, Juan Martin; Pearce, Alex; Polyakov, Ivan; Qian, Wenbin; Sciascia, Barbara; Vazquez Gomez, Ricardo; Zhang, Yanxi

    2016-01-01

    The PIDCalib package is a tool, widely used within the LHCb Collaboration, which provides access to the calibration samples of electrons, muons, pions, kaons and protons. This note covers both theoretical aspects related to the measurement of the efficiency of particle identification requirements, and more technical issues such as the selection of the calibration samples, the background subtraction procedure, and the storage of the data sets in the new data-processing scheme adopted by the LHCb experiment during the second run of the LHC.

  18. TASC Graphics Software Package.

    Science.gov (United States)

    1982-12-01

    RD-I55 861 TSC GRPHICS SOFTWRE PCKRGE(U) NLYTIC SCIENCES i/I RD 𔄀-t CORP RERDING MA M R TANG DEC 82 TR-1946-6U~~cLss AFG L-TR-gi-1388 Fi9629-89-C...extensions were made to allow TGSP to use color graphics. 2.1 INTERACTIVE TGSP NCAR was designed to be a general plot package for use with many different...plotting devices. It is designed to accept high level commands and generate an intermediate set of commands called metacode and to then use device

  19. Safety Analysis Report for packaging (onsite) steel waste package

    Energy Technology Data Exchange (ETDEWEB)

    BOEHNKE, W.M.

    2000-07-13

    The steel waste package is used primarily for the shipment of remote-handled radioactive waste from the 324 Building to the 200 Area for interim storage. The steel waste package is authorized for shipment of transuranic isotopes. The maximum allowable radioactive material that is authorized is 500,000 Ci. This exceeds the highway route controlled quantity (3,000 A{sub 2}s) and is a type B packaging.

  20. Ambient Sensors

    NARCIS (Netherlands)

    Börner, Dirk; Specht, Marcus

    2014-01-01

    This software sketches comprise two custom-built ambient sensors, i.e. a noise and a movement sensor. Both sensors measure an ambient value and process the values to a color gradient (green > yellow > red). The sensors were built using the Processing 1.5.1 development environment. Available under th

  1. Ambient Sensors

    NARCIS (Netherlands)

    Börner, Dirk; Specht, Marcus

    2014-01-01

    This software sketches comprise two custom-built ambient sensors, i.e. a noise and a movement sensor. Both sensors measure an ambient value and process the values to a color gradient (green > yellow > red). The sensors were built using the Processing 1.5.1 development environment. Available under

  2. The Ettention software package.

    Science.gov (United States)

    Dahmen, Tim; Marsalek, Lukas; Marniok, Nico; Turoňová, Beata; Bogachev, Sviatoslav; Trampert, Patrick; Nickels, Stefan; Slusallek, Philipp

    2016-02-01

    We present a novel software package for the problem "reconstruction from projections" in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. Copyright © 2015 Elsevier B.V. All rights reserved.

  3. CH Packaging Operations Manual

    Energy Technology Data Exchange (ETDEWEB)

    None, None

    2009-05-27

    This document provides the user with instructions for assembling a payload. All the steps in Subsections 1.2, Preparing 55-Gallon Drum Payload Assembly; 1.3, Preparing "Short" 85-Gallon Drum Payload Assembly (TRUPACT-II and HalfPACT); 1.4, Preparing "Tall" 85-Gallon Drum Payload Assembly (HalfPACT only); 1.5, Preparing 100-Gallon Drum Payload Assembly; 1.6, Preparing Shielded Container Payload Assembly; 1.7, Preparing SWB Payload Assembly; and 1.8, Preparing TDOP Payload Assembly, must be completed, but may be performed in any order as long as radiological control steps are not bypassed. Transport trailer operations, package loading and unloading from transport trailers, hoisting and rigging activities such as ACGLF operations, equipment checkout and shutdown, and component inspection activities must be performed, but may be performed in any order and in parallel with other activities as long as radiological control steps are not bypassed. Steps involving OCA/ICV lid removal/installation and payload removal/loading may be performed in parallel if there are multiple operators working on the same packaging. Steps involving removal/installation of OCV/ICV upper and lower main O-rings must be performed in sequence, except as noted.

  4. CH Packaging Operations Manual

    Energy Technology Data Exchange (ETDEWEB)

    None, None

    2008-09-11

    This document provides the user with instructions for assembling a payload. All the steps in Subsections 1.2, Preparing 55-Gallon Drum Payload Assembly; 1.3, Preparing "Short" 85-Gallon Drum Payload Assembly (TRUPACT-II and HalfPACT); 1.4, Preparing "Tall" 85-gallon Drum Payload Assembly (HalfPACT only); 1.5, Preparing 100-Gallon Drum Payload Assembly; 1.6, Preparing SWB Payload Assembly; and 1.7, Preparing TDOP Payload Assembly, must be completed, but may be performed in any order as long as radiological control steps are not bypassed. Transport trailer operations, package loading and unloading from transport trailers, hoisting and rigging activities such as ACGLF operations, equipment checkout and shutdown, and component inspection activities must be performed, but may be performed in any order and in parallel with other activities as long as radiological control steps are not bypassed. Steps involving OCA/ICV lid removal/installation and payload removal/loading may be performed in parallel if there are multiple operators working on the same packaging. Steps involving removal/installation of OCV/ICV upper and lower main O-rings must be performed in sequence.

  5. Signal processor packaging design

    Science.gov (United States)

    McCarley, Paul L.; Phipps, Mickie A.

    1993-10-01

    The Signal Processor Packaging Design (SPPD) program was a technology development effort to demonstrate that a miniaturized, high throughput programmable processor could be fabricated to meet the stringent environment imposed by high speed kinetic energy guided interceptor and missile applications. This successful program culminated with the delivery of two very small processors, each about the size of a large pin grid array package. Rockwell International's Tactical Systems Division in Anaheim, California developed one of the processors, and the other was developed by Texas Instruments' (TI) Defense Systems and Electronics Group (DSEG) of Dallas, Texas. The SPPD program was sponsored by the Guided Interceptor Technology Branch of the Air Force Wright Laboratory's Armament Directorate (WL/MNSI) at Eglin AFB, Florida and funded by SDIO's Interceptor Technology Directorate (SDIO/TNC). These prototype processors were subjected to rigorous tests of their image processing capabilities, and both successfully demonstrated the ability to process 128 X 128 infrared images at a frame rate of over 100 Hz.

  6. IN-PACKAGE CHEMISTRY ABSTRACTION

    Energy Technology Data Exchange (ETDEWEB)

    E. Thomas

    2005-07-14

    This report was developed in accordance with the requirements in ''Technical Work Plan for Postclosure Waste Form Modeling'' (BSC 2005 [DIRS 173246]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as a function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model, which uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model, which is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials, and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed (CDSP) waste packages containing high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor diffusing into the waste package, and (2) seepage water entering the waste package as a liquid from the drift. (1) Vapor-Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H{sub 2}O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Liquid-Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package.

  7. Bioderadable Polymers in Food Packaging

    OpenAIRE

    P.A.Pawar

    2013-01-01

    In recent years, there has been a marked increase in the interest in use of biodegradable materials in packaging. The principal function of packaging is protection and preservation of food from external contamination. This function involves retardation of deterioration, extension of shelf life, and maintenance of quality and safety of packaged food. Biodegradable polymers are the one which fulfill all these functions without causing any threat to the environment. The belief is that biodegrada...

  8. Creating R Packages: A Tutorial

    OpenAIRE

    Leisch, Friedrich

    2008-01-01

    This tutorial gives a practical introduction to creating R packages. We discuss how object oriented programming and S formulas can be used to give R code the usual look and feel, how to start a package from a collection of R functions, and how to test the code once the package has been created. As running example we use functions for standard linear regression analysis which are developed from scratch.

  9. About the ZOOM minimization package

    Energy Technology Data Exchange (ETDEWEB)

    Fischler, M.; Sachs, D.; /Fermilab

    2004-11-01

    A new object-oriented Minimization package is available for distribution in the same manner as CLHEP. This package, designed for use in HEP applications, has all the capabilities of Minuit, but is a re-write from scratch, adhering to modern C++ design principles. A primary goal of this package is extensibility in several directions, so that its capabilities can be kept fresh with as little maintenance effort as possible. This package is distinguished by the priority that was assigned to C++ design issues, and the focus on producing an extensible system that will resist becoming obsolete.

  10. 英夫利西单抗联合甲氨蝶呤短期治疗银屑病关节炎21例临床观察%Combination Therapy of Infliximab with Methotrexate for Twenty-one Cases with Psoriatic Arthritis

    Institute of Scientific and Technical Information of China (English)

    张成强; 董国萍; 房丽华; 任如枫; 刘晓萍; 李瑞; 王洁; 崔潞萍

    2013-01-01

    Objective To explore the efficacy and safety of Infliximab combined with methotrexate in short-term treatment of psoriatic arthritis. Methods Twenty-one patients received with 5mg phleb Infliximab which at 0, 2, 6, 14 week and 7.5-15mg oral MTX once a week. Results The swollen joint counts, tenderness joint counts and the score of PASI significantly reduced. Meanwhile the level of ESR and CRP significantly decreased in all cases(P <0.05). One patient experienced pruritus and flaky erythema at the injection site. It disappeared witnout any treatment. No severe adverse effects occurred in other patients. Conclusion The Infliximab combined with methotrexate is effective and safe in short-term treatment of psoriatic arthritis.%  目的探讨英夫利西单抗(Infliximab,商品名:类克,Remcidae)联合甲氨蝶呤(methotrexate,MTX)短期治疗银屑病关节炎(psoriatic arthritis,PsA)的疗效与安全性。方法对传统治疗方案[非甾体类消炎药(NSAIDs)联合MTX或其他免疫抑制剂(DMARDs)]治疗3个月以上疗效欠佳的21例患者,在0、2、6、14周时给予静脉输注Infliximab(剂量为5mg/kg体重,溶于0.9%的氯化钠注射液250ml,输液时间不少于2h),同时给予MTX 7.5-15mg,1次/周,14周后停用Infliximab,观察患者治疗前后的临床症状、炎性实验室指标的改善情况及药物安全性。结果21例患者关节压痛数、关节肿胀数、银屑病面积和严重度指数(psoriasis area and severity index,PASI)均明显降低,同时血沉(ESR)及C反应蛋白(CRP)亦明显下降,且与治疗前相比差异有统计学意义。1例患者出现注射部位皮肤片状红肿及瘙痒,未予特殊处理后消失,其余患者均未出现明显不良反应。结论Infliximab联合MTX短期治疗银屑病关节炎有效、安全、可行。

  11. Packaging Design Criteria for the Steel Waste Package

    Energy Technology Data Exchange (ETDEWEB)

    BOEHNKE, W.M.

    2000-10-19

    This packaging design criteria provides the criteria for the design, fabrication, safety evaluation, and use of the steel waste package (SWP) to transport remote-handled waste and special-case waste from the 324 facility to Central Waste Complex (CWC) for interim storage.

  12. Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical Systems (MEMS) for Space Applications

    Science.gov (United States)

    Ramesham, Rajeshuni

    2000-01-01

    MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. Standard semiconductor microelectronics packaging needs the integrated circuits (IC) to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the reliable IC packaging technology. Active elements or microstructures in MEMS devices often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it measures to assure the packaging technology of MEMS. MEMS technology has a major application in developing a microspacecraft for space systems provided reliability of MEMS packaging technology is sufficiently addressed. This MEMS technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively. This paper discusses the latest developments in the MEMS technology and challenging technical issues in the packaging of hermetically sealed and non-hermetically sealed

  13. Electronic equipment packaging technology

    CERN Document Server

    Ginsberg, Gerald L

    1992-01-01

    The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron­ ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod­ ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter­ mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pr...

  14. Tritium waste package

    Science.gov (United States)

    Rossmassler, Rich; Ciebiera, Lloyd; Tulipano, Francis J.; Vinson, Sylvester; Walters, R. Thomas

    1995-01-01

    A containment and waste package system for processing and shipping tritium xide waste received from a process gas includes an outer drum and an inner drum containing a disposable molecular sieve bed (DMSB) seated within outer drum. The DMSB includes an inlet diffuser assembly, an outlet diffuser assembly, and a hydrogen catalytic recombiner. The DMSB absorbs tritium oxide from the process gas and converts it to a solid form so that the tritium is contained during shipment to a disposal site. The DMSB is filled with type 4A molecular sieve pellets capable of adsorbing up to 1000 curies of tritium. The recombiner contains a sufficient amount of catalyst to cause any hydrogen add oxygen present in the process gas to recombine to form water vapor, which is then adsorbed onto the DMSB.

  15. Final system instrumentation design package for Decade 80 solar house

    Science.gov (United States)

    1978-01-01

    The final configuration of the Decade 80 solar house to monitor and collect system performance data is presented. A review demonstrated by actual operation that the system and the data acquisition subsystem operated satisfactorily and installation of instrumentation was in accordance with the design. This design package is made up of (1) site and system description, (2) operating and control modes, and (3) instrumentation program (including sensor schematic).

  16. High-Temperature Optical Sensor

    Science.gov (United States)

    Adamovsky, Grigory; Juergens, Jeffrey R.; Varga, Donald J.; Floyd, Bertram M.

    2010-01-01

    A high-temperature optical sensor (see Figure 1) has been developed that can operate at temperatures up to 1,000 C. The sensor development process consists of two parts: packaging of a fiber Bragg grating into a housing that allows a more sturdy thermally stable device, and a technological process to which the device is subjected to in order to meet environmental requirements of several hundred C. This technology uses a newly discovered phenomenon of the formation of thermally stable secondary Bragg gratings in communication-grade fibers at high temperatures to construct robust, optical, high-temperature sensors. Testing and performance evaluation (see Figure 2) of packaged sensors demonstrated operability of the devices at 1,000 C for several hundred hours, and during numerous thermal cycling from 400 to 800 C with different heating rates. The technology significantly extends applicability of optical sensors to high-temperature environments including ground testing of engines, flight propulsion control, thermal protection monitoring of launch vehicles, etc. It may also find applications in such non-aerospace arenas as monitoring of nuclear reactors, furnaces, chemical processes, and other hightemperature environments where other measurement techniques are either unreliable, dangerous, undesirable, or unavailable.

  17. Solar water heater design package

    Science.gov (United States)

    1981-01-01

    Package describes commercial domestic-hot-water heater with roof or rack mounted solar collectors. System is adjustable to pre-existing gas or electric hot-water house units. Design package includes drawings, description of automatic control logic, evaluation measurements, possible design variations, list of materials and installation tools, and trouble-shooting guide and manual.

  18. Oral Hygiene. Learning Activity Package.

    Science.gov (United States)

    Hime, Kirsten

    This learning activity package on oral hygiene is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, a list of definitions, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These topics…

  19. 49 CFR 173.411 - Industrial packagings.

    Science.gov (United States)

    2010-10-01

    ... 49 Transportation 2 2010-10-01 2010-10-01 false Industrial packagings. 173.411 Section 173.411... SHIPMENTS AND PACKAGINGS Class 7 (Radioactive) Materials § 173.411 Industrial packagings. (a) General. Each industrial packaging must comply with the requirements of this section which specifies packaging tests,...

  20. 19 CFR 191.13 - Packaging materials.

    Science.gov (United States)

    2010-04-01

    ... 19 Customs Duties 2 2010-04-01 2010-04-01 false Packaging materials. 191.13 Section 191.13 Customs... (CONTINUED) DRAWBACK General Provisions § 191.13 Packaging materials. (a) Imported packaging material... packaging material when used to package or repackage merchandise or articles exported or destroyed pursuant...

  1. DE-FE0013062 Final report PARC NETL DOE Heat sensor heat sensor harsh environment adaptable thermionic sensor

    Energy Technology Data Exchange (ETDEWEB)

    Limb, Scott J. [Palo Alto Research Center Inc., CA (United States)

    2016-05-31

    This document is the final report for the “HARSH ENVIRONMENT ADAPTABLE THERMIONIC SENSOR” project under NETL’s Crosscutting contract DE-FE0013062. This report addresses sensors that can be made with thermionic thin films along with the required high temperature hermetic packaging process. These sensors can be placed in harsh high temperature environments and potentially be wireless and self-powered.

  2. Expert Robots For Automated Packaging And Processing

    Science.gov (United States)

    Slutzky, G. D.; Hall, E. L.; Shell, R. L.

    1989-02-01

    A variety of problems in automated packaging and processing seem ready for expert robotic solutions. Such problems as automated palletizing, bin-picking, automated stoilw and retrieval, automated kitting of parts for assembly, and automated warehousing are currently being considered. The use of expert robots which consist of specialized computer programs, manipulators and integrated sensors has been demonstrated with robot Chedkers, peg games, etc. Actual solutions for automated palletizing, pit-carb basket loading, etc. have also been developed for industrial applications at our Center. The generic concepts arising from this research will be described, unsolved problems discussed, and some important tools demonstrated. The significance of this work lies in its broad application to a host of generic industrial problems which can improve quality, reduce waste, are eliminate human injuries.

  3. IC chip stress during plastic package molding

    Energy Technology Data Exchange (ETDEWEB)

    Palmer, D.W.; Benson, D.A.; Peterson, D.W.; Sweet, J.N.

    1998-02-01

    Approximately 95% of the world`s integrated chips are packaged using a hot, high pressure transfer molding process. The stress created by the flow of silica powder loaded epoxy can displace the fine bonding wires and can even distort the metalization patterns under the protective chip passivation layer. In this study the authors developed a technique to measure the mechanical stress over the surface of an integrated circuit during the molding process. A CMOS test chip with 25 diffused resistor stress sensors was applied to a commercial lead frame. Both compression and shear stresses were measured at all 25 locations on the surface of the chip every 50 milliseconds during molding. These measurements have a fine time and stress resolution which should allow comparison with computer simulation of the molding process, thus allowing optimization of both the manufacturing process and mold geometry.

  4. 78 FR 13083 - Products Having Laminated Packaging, Laminated Packaging, and Components Thereof; Notice of...

    Science.gov (United States)

    2013-02-26

    ... COMMISSION Products Having Laminated Packaging, Laminated Packaging, and Components Thereof; Notice of... Commission has received a complaint entitled Products Having Laminated ] Packaging, Laminated Packaging, and Components Thereof, DN 2940; the Commission is soliciting comments on any public interest issues raised...

  5. 78 FR 19007 - Certain Products Having Laminated Packaging, Laminated Packaging, and Components Thereof...

    Science.gov (United States)

    2013-03-28

    ... COMMISSION Certain Products Having Laminated Packaging, Laminated Packaging, and Components Thereof... importation of certain products having laminated packaging, laminated packaging, and components thereof by... Investigation: Having considered the complaint, the U.S. International Trade Commission, on March 22,...

  6. A Large Scale Virtual Gas Sensor Array

    Science.gov (United States)

    Ziyatdinov, Andrey; Fernández-Diaz, Eduard; Chaudry, A.; Marco, Santiago; Persaud, Krishna; Perera, Alexandre

    2011-09-01

    This paper depicts a virtual sensor array that allows the user to generate gas sensor synthetic data while controlling a wide variety of the characteristics of the sensor array response: arbitrary number of sensors, support for multi-component gas mixtures and full control of the noise in the system such as sensor drift or sensor aging. The artificial sensor array response is inspired on the response of 17 polymeric sensors for three analytes during 7 month. The main trends in the synthetic gas sensor array, such as sensitivity, diversity, drift and sensor noise, are user controlled. Sensor sensitivity is modeled by an optionally linear or nonlinear method (spline based). The toolbox on data generation is implemented in open source R language for statistical computing and can be freely accessed as an educational resource or benchmarking reference. The software package permits the design of scenarios with a very large number of sensors (over 10000 sensels), which are employed in the test and benchmarking of neuromorphic models in the Bio-ICT European project NEUROCHEM.

  7. Metamaterial Sensors

    Directory of Open Access Journals (Sweden)

    Jing Jing Yang

    2013-01-01

    Full Text Available Metamaterials have attracted a great deal of attention due to their intriguing properties, as well as the large potential applications for designing functional devices. In this paper, we review the current status of metamaterial sensors, with an emphasis on the evanescent wave amplification and the accompanying local field enhancement characteristics. Examples of the sensors are given to illustrate the principle and the performance of the metamaterial sensor. The paper concludes with an optimistic outlook regarding the future of metamaterial sensor.

  8. Problem-based learning packages: considerations for neophyte package writers.

    Science.gov (United States)

    Hengstberger-Sims, C; McMillan, M A

    1993-02-01

    Adopting problem-based learning (PBL) as the major educational approach in the implementation of a nursing curriculum requires the development of numerous learning stimulus packages. When reviewing the experience of the Division of Nursing within the Faculty of Health at the University of Western Sydney, Macarthur in Australia, several considerations for package writers were identified and are discussed. These include needs assessment, integration of the curricula content strands, multi-media learning stimuli, context, role and the incorporation of ongoing client management. The need for nurturance of writers and peer review of the developed packages is also addressed, as is a review of the impact of different learning stimuli.

  9. Performance of Measuring Vibration of MEMS Sensor

    OpenAIRE

    Choe, Jung Seob; Inoue, Eiji; Mitsuoka, Muneshi; Okayasu, Takashi; Hirai, Yasumaru

    2014-01-01

    The purpose of this study is to examine the usefulness of an MEMS sensor for measuring vibration of agricultural vehicle by obtaining serial data of vibration acceleration of agricultural vehicle using an MEMS sensor and translational accelerometer and thereby calculating RMS and PSD for comparison and analysis as a step before construction of measuring system which can identify operating conditions of agricultural packaging machinery at all times. Although there are differences between verti...

  10. Attention Sensor

    NARCIS (Netherlands)

    Börner, Dirk; Kalz, Marco; Specht, Marcus

    2014-01-01

    This software sketch was used in the context of an experiment for the PhD project “Ambient Learning Displays”. The sketch comprises a custom-built attention sensor. The sensor measured (during the experiment) whether a participant looked at and thus attended a public display. The sensor was built us

  11. Attention Sensor

    NARCIS (Netherlands)

    Börner, Dirk; Kalz, Marco; Specht, Marcus

    2014-01-01

    This software sketch was used in the context of an experiment for the PhD project “Ambient Learning Displays”. The sketch comprises a custom-built attention sensor. The sensor measured (during the experiment) whether a participant looked at and thus attended a public display. The sensor was built us

  12. Development in the Active Packaging of Foods

    African Journals Online (AJOL)

    Active packaging is one of the innovative food packaging concepts that has been introduced as a response to the ... mildly preserved convenience foods that ... antimicrobial packaging concepts, .... material needs to have an 02-barrier of.

  13. In-Package Chemistry Abstraction

    Energy Technology Data Exchange (ETDEWEB)

    E. Thomas

    2004-11-09

    This report was developed in accordance with the requirements in ''Technical Work Plan for: Regulatory Integration Modeling and Analysis of the Waste Form and Waste Package'' (BSC 2004 [DIRS 171583]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model that uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model that is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed waste packages that contain both high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor that diffuses into the waste package, and (2) seepage water that enters the waste package from the drift as a liquid. (1) Vapor Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H2O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Water Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package. TSPA-LA uses the vapor influx case for the nominal scenario for simulations where the waste

  14. Laser Welding in Electronic Packaging

    Science.gov (United States)

    2000-01-01

    The laser has proven its worth in numerous high reliability electronic packaging applications ranging from medical to missile electronics. In particular, the pulsed YAG laser is an extremely flexible and versatile too] capable of hermetically sealing microelectronics packages containing sensitive components without damaging them. This paper presents an overview of details that must be considered for successful use of laser welding when addressing electronic package sealing. These include; metallurgical considerations such as alloy and plating selection, weld joint configuration, design of optics, use of protective gases and control of thermal distortions. The primary limitations on use of laser welding electronic for packaging applications are economic ones. The laser itself is a relatively costly device when compared to competing welding equipment. Further, the cost of consumables and repairs can be significant. These facts have relegated laser welding to use only where it presents a distinct quality or reliability advantages over other techniques of electronic package sealing. Because of the unique noncontact and low heat inputs characteristics of laser welding, it is an ideal candidate for sealing electronic packages containing MEMS devices (microelectromechanical systems). This paper addresses how the unique advantages of the pulsed YAG laser can be used to simplify MEMS packaging and deliver a product of improved quality.

  15. Naval Waste Package Design Sensitivity

    Energy Technology Data Exchange (ETDEWEB)

    T. Schmitt

    2006-12-13

    The purpose of this calculation is to determine the sensitivity of the structural response of the Naval waste packages to varying inner cavity dimensions when subjected to a comer drop and tip-over from elevated surface. This calculation will also determine the sensitivity of the structural response of the Naval waste packages to the upper bound of the naval canister masses. The scope of this document is limited to reporting the calculation results in terms of through-wall stress intensities in the outer corrosion barrier. This calculation is intended for use in support of the preliminary design activities for the license application design of the Naval waste package. It examines the effects of small changes between the naval canister and the inner vessel, and in these dimensions, the Naval Long waste package and Naval Short waste package are similar. Therefore, only the Naval Long waste package is used in this calculation and is based on the proposed potential designs presented by the drawings and sketches in References 2.1.10 to 2.1.17 and 2.1.20. All conclusions are valid for both the Naval Long and Naval Short waste packages.

  16. Perfume Packaging, Seduction and Gender

    Directory of Open Access Journals (Sweden)

    Magdalena Petersson McIntyre

    2013-06-01

    Full Text Available This article examines gender and cultural sense-making in relation to perfumes and their packaging. Gendered meanings of seduction, choice, consumption and taste are brought to the fore with the use of go-along interviews with consumers in per-fume stores. Meeting luxury packages in this feminized environment made the interviewed women speak of bottles as objects to fall in love with and they de-scribed packages as the active part in an act of seduction where they were expect-ing packages to persuade them into consumption. The interviewed men on the other hand portrayed themselves as active choice-makers and stressed that they were always in control and not seduced by packaging. However, while their ways of explaining their relationship with packaging on the surface seems to confirm cultural generalizations in relation to gender and seduction, the article argues that letting oneself be seduced is no less active than seducing. Based on a combination of actor network theories and theories of gender performativity the article points to the agency of packaging for constructions of gender and understands the inter-viewees as equally animated by the flows of passion which guide their actions.

  17. Characterization of integrated circuit packaging materials

    CERN Document Server

    Moore, Thomas

    1993-01-01

    Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.

  18. Thin Silicon MEMS Contact-Stress Sensor

    Energy Technology Data Exchange (ETDEWEB)

    Kotovsky, J; Tooker, A; Horsley, D

    2010-03-22

    This thin, MEMS contact-stress (CS) sensor continuously and accurately measures time-varying, solid interface loads in embedded systems over tens of thousands of load cycles. Unlike all other interface load sensors, the CS sensor is extremely thin (< 150 {micro}m), provides accurate, high-speed measurements, and exhibits good stability over time with no loss of calibration with load cycling. The silicon CS sensor, 5 mm{sup 2} and 65 {micro}m thick, has piezoresistive traces doped within a load-sensitive diaphragm. The novel package utilizes several layers of flexible polyimide to mechanically and electrically isolate the sensor from the environment, transmit normal applied loads to the diaphragm, and maintain uniform thickness. The CS sensors have a highly linear output in the load range tested (0-2.4 MPa) with an average accuracy of {+-} 1.5%.

  19. Improving dynamic response of a temperature-only FBG sensor

    Institute of Scientific and Technical Information of China (English)

    LI En-bang; YAO Jian-quan; ZHANG Wei-gang

    2006-01-01

    We report a method for improving temporal response of FBG-based temperature sensors.It has been demonstrated that by filling thermal conductive pastes between a sensing FBG and its package,the temporal response of the FBG-based temperature sensor can be significantly improved while isolating the strain and vibration.

  20. Bioderadable Polymers in Food Packaging

    Directory of Open Access Journals (Sweden)

    P.A.Pawar

    2013-01-01

    Full Text Available In recent years, there has been a marked increase in the interest in use of biodegradable materials in packaging. The principal function of packaging is protection and preservation of food from external contamination. This function involves retardation of deterioration, extension of shelf life, and maintenance of quality and safety of packaged food. Biodegradable polymers are the one which fulfill all these functions without causing any threat to the environment. The belief is that biodegradable polymer materials will reduce the need for synthetic polymer production (thus reducing pollution at a low cost, thereby producing a positive effect both environmentally and economically.

  1. Optical network of silicon micromachined sensors

    Science.gov (United States)

    Wilson, Mark L.; Burns, David W.; Zook, J. David

    1996-03-01

    The Honeywell Technology Center, in collaboration with the University of Wisconsin and the Mobil Corporation, and under funding from this ARPA sponsored program, are developing a new type of `hybrid' micromachined silicon/fiber optic sensor that utilizes the best attributes of each technology. Fiber optics provide a noise free method to read out the sensor without electrical power required at the measurement point. Micromachined silicon sensor techniques provide a method to design many different types of sensors such as temperature, pressure, acceleration, or magnetic field strength and report the sensor data using FDM methods. Our polysilicon resonant microbeam structures have a built in Fabry-Perot interferometer that offers significant advantages over other configurations described in the literature. Because the interferometer is an integral part of the structure, the placement of the fiber becomes non- critical, and packaging issues become considerably simpler. The interferometer spacing are determined by the thin-film fabrication processes and therefore can be extremely well controlled. The main advantage, however, is the integral vacuum cavity that ensures high Q values. Testing results have demonstrated relaxed alignment tolerances in packaging these devices, with an excellent Signal to Noise Ratio. Networks of 16 or more sensors are currently being developed. STORM (Strain Transduction by Optomechanical Resonant Microbeams) sensors can also provide functionality and self calibration information which can be used to improve the overall system reliability. Details of the sensor and network design, as well as test results, are presented.

  2. Microelectronics packaging research directions for aerospace applications

    Science.gov (United States)

    Galbraith, L.

    2003-01-01

    The Roadmap begins with an assessment of needs from the microelectronics for aerospace applications viewpoint. Needs Assessment is divided into materials, packaging components, and radiation characterization of packaging.

  3. Packaging systems for animal origin food

    Directory of Open Access Journals (Sweden)

    2011-03-01

    Full Text Available The main task of food packaging is to protect the product during storage and transport against the action of biological, chemical and mechanical factors. The paper presents packaging systems for food of animal origin. Vacuum and modified atmosphere packagings were characterised together with novel types of packagings, referred to as intelligent packaging and active packaging. The aim of this paper was to present all advantages and disadvantages of packaging used for meat products. Such list enables to choose the optimal type of packaging for given assortment of food and specific conditions of the transport and storing.

  4. Production Method that Leads to TiO2 Nanofibrous Structure Usable in Food Packaging

    Directory of Open Access Journals (Sweden)

    Kovář Radovan

    2016-12-01

    Full Text Available Burned inorganic nanofibers most often occur in the nature in two forms: rutile and anatase. Today, the production of rutile is about to end, while anatase provides more application possibilities. The resulting fiber structure is determined by calcination. It is necessary to find the optimal temperature as well as time, during which the fibers must withstand temperature load. For such method of calcination, it is necessary to create a special design of continuous furnace. Anatase has application in food packaging. Packages containing anatase are used for: food safety, improved packaging for spoilage reduction, sensors for detection of pathogens and spoilage, disinfectants and antimicrobial surfaces.

  5. Testing of tactile sensors for space applications

    Science.gov (United States)

    Kogan, Lisa; Weadon, Timothy L.; Evans, Thomas; DeVallance, David B.; Sabolsky, Edward M.

    2015-03-01

    There is a need to integrate tactile sensing into robotic manipulators performing tasks in space environments, including those used to repair satellites. Integration can be achieved by embedding specialized tactile sensors. Reliable and consistent signal interpretation can be obtained by ensuring that sensors with a suitable sensing mechanism are selected based on operational demands, and that materials used within the sensors do not change structurally under vacuum and expected applied pressures, and between temperatures of -80°C to +120°C. The sensors must be able to withstand space environmental conditions and remain adequately sensitive throughout their operating life. Additionally, it is necessary to integrate the sensors into the target system with minimum disturbance while remaining responsive to applied loads. Previous work has been completed to characterize sensors within the selected temperature and pressure ranges. The current work builds on this investigation by embedding these sensors in different geometries and testing the response measured among varying configurations. Embedding material selection was aided by using a dynamic mechanical analyzer (DMA) to determine stress/strain behavior for adhesives and compliant layers used to keep the sensors in place and distribute stresses evenly. Electromechanical characterization of the embedded sensor packages was conducted by using the DMA in tandem with an inductance-capacitance-resistance (LCR) meter. Methods for embedding the sensor packages were developed with the aid of finite element analysis and physical testing to account for specific geometrical constraints. Embedded sensor prototypes were tested within representative models of potential embedding locations to compare final embedded sensor performance.

  6. Large area LED package

    Science.gov (United States)

    Goullon, L.; Jordan, R.; Braun, T.; Bauer, J.; Becker, F.; Hutter, M.; Schneider-Ramelow, M.; Lang, K.-D.

    2015-03-01

    Solid state lighting using LED-dies is a rapidly growing market. LED-dies with the needed increasing luminous flux per chip area produce a lot of heat. Therefore an appropriate thermal management is required for general lighting with LEDdies. One way to avoid overheating and shorter lifetime is the use of many small LED-dies on a large area heat sink (down to 70 μm edge length), so that heat can spread into a large area while at the same time light also appears on a larger area. The handling with such small LED-dies is very difficult because they are too small to be picked with common equipment. Therefore a new concept called collective transfer bonding using a temporary carrier chip was developed. A further benefit of this new technology is the high precision assembly as well as the plane parallel assembly of the LED-dies which is necessary for wire bonding. It has been shown that hundred functional LED-dies were transferred and soldered at the same time. After the assembly a cost effective established PCB-technology was applied to produce a large-area light source consisting of many small LED-dies and electrically connected on a PCB-substrate. The top contacts of the LED-dies were realized by laminating an adhesive copper sheet followed by LDI structuring as known from PCB-via-technology. This assembly can be completed by adding converting and light forming optical elements. In summary two technologies based on standard SMD and PCB technology have been developed for panel level LED packaging up to 610x 457 mm2 area size.

  7. New Packaging for Amplifier Slabs

    Energy Technology Data Exchange (ETDEWEB)

    Riley, M. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Thorsness, C. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Suratwala, T. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Steele, R. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Rogowski, G. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

    2015-03-18

    The following memo provides a discussion and detailed procedure for a new finished amplifier slab shipping and storage container. The new package is designed to maintain an environment of <5% RH to minimize weathering.

  8. Next-generation PIR security sensors: concept testing and evaluation

    Science.gov (United States)

    Liddiard, Kevin C.

    2009-05-01

    In previous presentations to this SPIE forum a new technology was outlined aimed at replacing pyroelectric sensors with resistance microbolometer MOEMS-based sensors capable of vastly superior performance. The technology can be implemented as either a PCB replacement to current sensors, giving extended detection range and ability to sense slow temperature change, or a 'smart' sensor with further performance enhancements and imaging capability. This paper reports the results of new laboratory and field tests of a laboratory prototype sensor and extrapolates these results to performance of production sensors. In particular, results are presented for NETD, detection range for human targets and detection of simulated electrical faults and developing fires. Previous results were reported for FPA operated without evacuation and using a low cost plastic Fresnel lens. However with wafer level packaging now becoming widely available in MEMS and CMOS foundries, much high performance can be achieved, opening up many additional applications. Performance of new FPAs designed for vacuum packaging is highlighted.

  9. Packaging Review Guide for Reviewing Safety Analysis Reports for Packagings

    Energy Technology Data Exchange (ETDEWEB)

    DiSabatino, A; Biswas, D; DeMicco, M; Fisher, L E; Hafner, R; Haslam, J; Mok, G; Patel, C; Russell, E

    2007-04-12

    This Packaging Review Guide (PRG) provides guidance for Department of Energy (DOE) review and approval of packagings to transport fissile and Type B quantities of radioactive material. It fulfills, in part, the requirements of DOE Order 460.1B for the Headquarters Certifying Official to establish standards and to provide guidance for the preparation of Safety Analysis Reports for Packagings (SARPs). This PRG is intended for use by the Headquarters Certifying Official and his or her review staff, DOE Secretarial offices, operations/field offices, and applicants for DOE packaging approval. This PRG is generally organized at the section level in a format similar to that recommended in Regulatory Guide 7.9 (RG 7.9). One notable exception is the addition of Section 9 (Quality Assurance), which is not included as a separate chapter in RG 7.9. Within each section, this PRG addresses the technical and regulatory bases for the review, the manner in which the review is accomplished, and findings that are generally applicable for a package that meets the approval standards. This Packaging Review Guide (PRG) provides guidance for DOE review and approval of packagings to transport fissile and Type B quantities of radioactive material. It fulfills, in part, the requirements of DOE O 460.1B for the Headquarters Certifying Official to establish standards and to provide guidance for the preparation of Safety Analysis Reports for Packagings (SARPs). This PRG is intended for use by the Headquarters Certifying Official and his review staff, DOE Secretarial offices, operations/field offices, and applicants for DOE packaging approval. The primary objectives of this PRG are to: (1) Summarize the regulatory requirements for package approval; (2) Describe the technical review procedures by which DOE determines that these requirements have been satisfied; (3) Establish and maintain the quality and uniformity of reviews; (4) Define the base from which to evaluate proposed changes in scope

  10. NOVEL GAS SENSORS FOR HIGH-TEMPERATURE FOSSIL FUEL APPLICATIONS

    Energy Technology Data Exchange (ETDEWEB)

    Palitha Jayaweera

    2004-05-01

    SRI is developing ceramic-based microsensors for detection of exhaust gases such as NO, NO{sub 2}, and CO in advanced combustion and gasification systems. The sensors detect the electrochemical activity of the exhaust gas species on catalytic electrodes and are designed to operate at high temperatures, elevated pressures, and corrosive environments typical of large power generation exhausts. Under this research project we are developing sensors for multiple gas detection in a single package along with data acquisition and control software and hardware. The sensor package can be easily integrated into online monitoring systems for active emission control. This report details the research activities performed from October 2003 to April 2004.

  11. Watermarking spot colors in packaging

    Science.gov (United States)

    Reed, Alastair; Filler, TomáÅ.¡; Falkenstern, Kristyn; Bai, Yang

    2015-03-01

    In January 2014, Digimarc announced Digimarc® Barcode for the packaging industry to improve the check-out efficiency and customer experience for retailers. Digimarc Barcode is a machine readable code that carries the same information as a traditional Universal Product Code (UPC) and is introduced by adding a robust digital watermark to the package design. It is imperceptible to the human eye but can be read by a modern barcode scanner at the Point of Sale (POS) station. Compared to a traditional linear barcode, Digimarc Barcode covers the whole package with minimal impact on the graphic design. This significantly improves the Items per Minute (IPM) metric, which retailers use to track the checkout efficiency since it closely relates to their profitability. Increasing IPM by a few percent could lead to potential savings of millions of dollars for retailers, giving them a strong incentive to add the Digimarc Barcode to their packages. Testing performed by Digimarc showed increases in IPM of at least 33% using the Digimarc Barcode, compared to using a traditional barcode. A method of watermarking print ready image data used in the commercial packaging industry is described. A significant proportion of packages are printed using spot colors, therefore spot colors needs to be supported by an embedder for Digimarc Barcode. Digimarc Barcode supports the PANTONE spot color system, which is commonly used in the packaging industry. The Digimarc Barcode embedder allows a user to insert the UPC code in an image while minimizing perceptibility to the Human Visual System (HVS). The Digimarc Barcode is inserted in the printing ink domain, using an Adobe Photoshop plug-in as the last step before printing. Since Photoshop is an industry standard widely used by pre-press shops in the packaging industry, a Digimarc Barcode can be easily inserted and proofed.

  12. Polyhydroxyalkanoates (PHA) Bioplastic Packaging Materials

    Science.gov (United States)

    2010-05-01

    Center CEFPACK - Center for Flexible Packaging CAEFF - Center for Advanced Engineering Films and Fibers T cr - recrystallization temperature...conditions. The tandem line has 1½” primary extruder with a Barr ET screw and a pineapple mixing tip. The gas inject is about 2/3 of the way down the...stretch and shrink film, the equipment at the Center for Flexible Packaging (CEFPACK) and the Center for Advanced Engineering Films and Fibers (CAEFF) at

  13. Software package requirements and procurement

    OpenAIRE

    1996-01-01

    This paper outlines the problems of specifying requirements and deploying these requirements in the procurement of software packages. Despite the fact that software construction de novo is the exception rather than the rule, little or no support for the task of formulating requirements to support assessment and selection among existing software packages has been developed. We analyse the problems arising in this process and review related work. We outline the key components of a programme of ...

  14. Packaging food for radiation processing

    Science.gov (United States)

    Komolprasert, Vanee

    2016-12-01

    Irradiation can play an important role in reducing pathogens that cause food borne illness. Food processors and food safety experts prefer that food be irradiated after packaging to prevent post-irradiation contamination. Food irradiation has been studied for the last century. However, the implementation of irradiation on prepackaged food still faces challenges on how to assess the suitability and safety of these packaging materials used during irradiation. Irradiation is known to induce chemical changes to the food packaging materials resulting in the formation of breakdown products, so called radiolysis products (RP), which may migrate into foods and affect the safety of the irradiated foods. Therefore, the safety of the food packaging material (both polymers and adjuvants) must be determined to ensure safety of irradiated packaged food. Evaluating the safety of food packaging materials presents technical challenges because of the range of possible chemicals generated by ionizing radiation. These challenges and the U.S. regulations on food irradiation are discussed in this article.

  15. Development and Performance Evaluation of Optical Sensors for High Temperature Engine Applications

    Science.gov (United States)

    Adamovsky, G.; Varga, D.; Floyd, B.

    2011-01-01

    This paper discusses fiber optic sensors designed and constructed to withstand extreme temperatures of aircraft engine. The paper describes development and performance evaluation of fiber optic Bragg grating based sensors. It also describes the design and presents test results of packaged sensors subjected to temperatures up to 1000 C for prolonged periods of time.

  16. Sensor Compendium

    CERN Document Server

    Artuso, M; Bolla, G; Bortoletto, D; Caberera, B; Carlstrom, J E; Chang, C L; Cooper, W; Da Via, C; Demarteau, M; Fast, J; Frisch, H; Garcia-Sciveres, M; Golwala, S; Haber, C; Hall, J; Hoppe, E; Irwin, K D; Kagan, H; Kenney, C; Lee, A T; Lynn, D; Orrell, J; Pyle, M; Rusack, R; Sadrozinski, H; Sanchez, M C; Seiden, A; Trischuk, W; Vavra, J; Wetstein, M; Zhu, R-Y

    2013-01-01

    Sensors play a key role in detecting both charged particles and photons for all three frontiers in Particle Physics. The signals from an individual sensor that can be used include ionization deposited, phonons created, or light emitted from excitations of the material. The individual sensors are then typically arrayed for detection of individual particles or groups of particles. Mounting of new, ever higher performance experiments, often depend on advances in sensors in a range of performance characteristics. These performance metrics can include position resolution for passing particles, time resolution on particles impacting the sensor, and overall rate capabilities. In addition the feasible detector area and cost frequently provides a limit to what can be built and therefore is often another area where improvements are important. Finally, radiation tolerance is becoming a requirement in a broad array of devices. We present a status report on a broad category of sensors, including challenges for the future ...

  17. Wind Sensor

    OpenAIRE

    Li, Jiaoyang; Ni, Jiqin

    2014-01-01

    Wind measurement is needed in many practical and scientific research situations. Some specific applications require to precisely measuring both wind direction and wind speed at the same time. Current commercial sensors for wind direction and wind speed measurement usually use ultrasonic technology and the sensors are very expensive (> $1500). In addition, the sensors are large in dimension and cannot measure airflow patterns in high spatial resolution. Therefore new and low cost wind speed an...

  18. Prevention policies addressing packaging and packaging waste: Some emerging trends.

    Science.gov (United States)

    Tencati, Antonio; Pogutz, Stefano; Moda, Beatrice; Brambilla, Matteo; Cacia, Claudia

    2016-10-01

    Packaging waste is a major issue in several countries. Representing in industrialized countries around 30-35% of municipal solid waste yearly generated, this waste stream has steadily grown over the years even if, especially in Europe, specific recycling and recovery targets have been fixed. Therefore, an increasing attention starts to be devoted to prevention measures and interventions. Filling a gap in the current literature, this explorative paper is a first attempt to map the increasingly important phenomenon of prevention policies in the packaging sector. Through a theoretical sampling, 11 countries/states (7 in and 4 outside Europe) have been selected and analyzed by gathering and studying primary and secondary data. Results show evidence of three specific trends in packaging waste prevention policies: fostering the adoption of measures directed at improving packaging design and production through an extensive use of the life cycle assessment; raising the awareness of final consumers by increasing the accountability of firms; promoting collaborative efforts along the packaging supply chains.

  19. Nanotechnology for Food Packaging and Food Quality Assessment.

    Science.gov (United States)

    Rossi, Marco; Passeri, Daniele; Sinibaldi, Alberto; Angjellari, Mariglen; Tamburri, Emanuela; Sorbo, Angela; Carata, Elisabetta; Dini, Luciana

    Nanotechnology has paved the way to innovative food packaging materials and analytical methods to provide the consumers with healthier food and to reduce the ecological footprint of the whole food chain. Combining antimicrobial and antifouling properties, thermal and mechanical protection, oxygen and moisture barrier, as well as to verify the actual quality of food, e.g., sensors to detect spoilage, bacterial growth, and to monitor incorrect storage conditions, or anticounterfeiting devices in food packages may extend the products shelf life and ensure higher quality of foods. Also the ecological footprint of food chain can be reduced by developing new completely recyclable and/or biodegradable packages from natural and eco-friendly resources. The contribution of nanotechnologies to these goals is reviewed in this chapter, together with a description of portable devices ("lab-on-chip," sensors, nanobalances, etc.) which can be used to assess the quality of food and an overview of regulations in force on food contact materials. © 2017 Elsevier Inc. All rights reserved.

  20. Gas Sensor

    KAUST Repository

    Luebke, Ryan

    2015-01-22

    A gas sensor using a metal organic framework material can be fully integrated with related circuitry on a single substrate. In an on-chip application, the gas sensor can result in an area-efficient fully integrated gas sensor solution. In one aspect, a gas sensor can include a first gas sensing region including a first pair of electrodes, and a first gas sensitive material proximate to the first pair of electrodes, wherein the first gas sensitive material includes a first metal organic framework material.

  1. Sensor web

    Science.gov (United States)

    Delin, Kevin A. (Inventor); Jackson, Shannon P. (Inventor)

    2011-01-01

    A Sensor Web formed of a number of different sensor pods. Each of the sensor pods include a clock which is synchronized with a master clock so that all of the sensor pods in the Web have a synchronized clock. The synchronization is carried out by first using a coarse synchronization which takes less power, and subsequently carrying out a fine synchronization to make a fine sync of all the pods on the Web. After the synchronization, the pods ping their neighbors to determine which pods are listening and responded, and then only listen during time slots corresponding to those pods which respond.

  2. 9 CFR 381.144 - Packaging materials.

    Science.gov (United States)

    2010-01-01

    ... 9 Animals and Animal Products 2 2010-01-01 2010-01-01 false Packaging materials. 381.144 Section... Packaging materials. (a) Edible products may not be packaged in a container which is composed in whole or in... to health. All packaging materials must be safe for the intended use within the meaning of section...

  3. 7 CFR 58.626 - Packaging equipment.

    Science.gov (United States)

    2010-01-01

    ... 7 Agriculture 3 2010-01-01 2010-01-01 false Packaging equipment. 58.626 Section 58.626 Agriculture....626 Packaging equipment. Packaging equipment designed to mechanically fill and close single service... Standards for Equipment for Packaging Frozen Desserts and Cottage Cheese. Quality Specifications for...

  4. 21 CFR 820.130 - Device packaging.

    Science.gov (United States)

    2010-04-01

    ... 21 Food and Drugs 8 2010-04-01 2010-04-01 false Device packaging. 820.130 Section 820.130 Food and... QUALITY SYSTEM REGULATION Labeling and Packaging Control § 820.130 Device packaging. Each manufacturer shall ensure that device packaging and shipping containers are designed and constructed to protect...

  5. 40 CFR 157.27 - Unit packaging.

    Science.gov (United States)

    2010-07-01

    ... 40 Protection of Environment 23 2010-07-01 2010-07-01 false Unit packaging. 157.27 Section 157.27 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) PESTICIDE PROGRAMS PACKAGING REQUIREMENTS FOR PESTICIDES AND DEVICES Child-Resistant Packaging § 157.27 Unit packaging. Pesticide...

  6. Thin Silicon MEMS Contact-Stress Sensor

    Energy Technology Data Exchange (ETDEWEB)

    Kotovsky, J; Tooker, A; Horsley, D A

    2009-12-07

    This work offers the first, thin, MEMS contact-stress (CS) sensor capable of accurate in situ measruement of time-varying, contact-stress between two solid interfaces (e.g. in vivo cartilage contact-stress and body armor dynamic loading). This CS sensor is a silicon-based device with a load sensitive diaphragm. The diaphragm is doped to create piezoresistors arranged in a full Wheatstone bridge. The sensor is similar in performance to established silicon pressure sensors, but it is reliably produced to a thickness of 65 {micro}m. Unlike commercial devices or other research efforts, this CS sensor, including packaging, is extremely thin (< 150 {micro}m fully packaged) so that it can be unobtrusively placed between contacting structures. It is built from elastic, well-characterized materials, providing accurate and high-speed (50+ kHz) measurements over a potential embedded lifetime of decades. This work explored sensor designs for an interface load range of 0-2 MPa; however, the CS sensor has a flexible design architecture to measure a wide variety of interface load ranges.

  7. Green Packaging Management of Logistics Enterprises

    Science.gov (United States)

    Zhang, Guirong; Zhao, Zongjian

    From the connotation of green logistics management, we discuss the principles of green packaging, and from the two levels of government and enterprises, we put forward a specific management strategy. The management of green packaging can be directly and indirectly promoted by laws, regulations, taxation, institutional and other measures. The government can also promote new investment to the development of green packaging materials, and establish specialized institutions to identify new packaging materials, standardization of packaging must also be accomplished through the power of the government. Business units of large scale through the packaging and container-based to reduce the use of packaging materials, develop and use green packaging materials and easy recycling packaging materials for proper packaging.

  8. Advanced organics for electronic substrates and packages

    CERN Document Server

    Fletcher, Andrew E

    1992-01-01

    Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection, and yet pre

  9. DNA Packaging in Bacteriophage: Is Twist Important?

    OpenAIRE

    Spakowitz, Andrew James; Wang, Zhen-Gang

    2005-01-01

    We study the packaging of DNA into a bacteriophage capsid using computer simulation, specifically focusing on the potential impact of twist on the final packaged conformation. We perform two dynamic simulations of packaging a polymer chain into a spherical confinement: one where the chain end is rotated as it is fed, and one where the chain is fed without end rotation. The final packaged conformation exhibits distinct differences in these two cases: the packaged conformation from feeding with...

  10. Semiconductor packaging materials interaction and reliability

    CERN Document Server

    Chen, Andrea

    2012-01-01

    In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing--package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how

  11. The paradox of packaging optimization – a characterization of packaging source reduction in the Netherlands

    NARCIS (Netherlands)

    van Sluisveld, M.A.E.; Worrell, E.

    2013-01-01

    The European Council Directive 94/62/EC for Packaging and Packaging Waste requires that Member States implement packaging waste prevention measures. However, consumption and subsequently packaging waste figures are still growing annually. It suggests that policies to accomplish packaging waste preve

  12. The reduction of packaging waste

    Energy Technology Data Exchange (ETDEWEB)

    Raney, E.A.; Hogan, J.J.; McCollom, M.L.; Meyer, R.J.

    1994-04-01

    Nationwide, packaging waste comprises approximately one-third of the waste disposed in sanitary landfills. the US Department of Energy (DOE) generated close to 90,000 metric tons of sanitary waste. With roughly one-third of that being packaging waste, approximately 30,000 metric tons are generated per year. The purpose of the Reduction of Packaging Waste project was to investigate opportunities to reduce this packaging waste through source reduction and recycling. The project was divided into three areas: procurement, onsite packaging and distribution, and recycling. Waste minimization opportunities were identified and investigated within each area, several of which were chosen for further study and small-scale testing at the Hanford Site. Test results, were compiled into five ``how-to`` recipes for implementation at other sites. The subject of the recipes are as follows: (1) Vendor Participation Program; (2) Reusable Containers System; (3) Shrink-wrap System -- Plastic and Corrugated Cardboard Waste Reduction; (4) Cardboard Recycling ; and (5) Wood Recycling.

  13. Package power stations for export

    Energy Technology Data Exchange (ETDEWEB)

    1985-01-01

    The cheap and efficient generation of power is an essential requirement for the success and prosperity of any community and is especially important to third world countries. It is therefore logical that the more technologically advanced nations should seek to produce power stations for the developing countries. Power plant can now be designed into a packaged form that may be readily exported and commissioned. This valuable and interesting collection of papers were originally presented at a seminar organised by the Power Industries Division of the Institution of Mechanical Engineers. Topics considered include the developing world market for packaged power stations using indigenous fuels; multi-fuel systems for power generation; packaging, modularisation, and containerisation of equipment for power boilers for export; compact coal-fired industrial plant; rural woodburning power stations; biomass gasification based power generation technology and potential; gas fed reciprocating engine development; packaged heavy duty gas turbines for power generation; and criteria for assessing the appropriateness of package power technologies in developing countries.

  14. Reference waste package environment report

    Energy Technology Data Exchange (ETDEWEB)

    Glassley, W.E.

    1986-10-01

    One of three candidate repository sites for high-level radioactive waste packages is located at Yucca Mountain, Nevada, in rhyolitic tuff 700 to 1400 ft above the static water table. Calculations indicate that the package environment will experience a maximum temperature of {similar_to}230{sup 0}C at 9 years after emplacement. For the next 300 years the rock within 1 m of the waste packages will remain dehydrated. Preliminary results suggest that the waste package radiation field will have very little effect on the mechanical properties of the rock. Radiolysis products will have a negligible effect on the rock even after rehydration. Unfractured specimens of repository rock show no change in hydrologic characteristics during repeated dehydration-rehydration cycles. Fractured samples with initially high permeabilities show a striking permeability decrease during dehydration-rehydration cycling, which may be due to fracture healing via deposition of silica. Rock-water interaction studies demonstrate low and benign levels of anions and most cations. The development of sorptive secondary phases such as zeolites and clays suggests that anticipated rock-water interaction may produce beneficial changes in the package environment.

  15. Chemical sensors

    Science.gov (United States)

    Lowell, J.R. Jr.; Edlund, D.J.; Friesen, D.T.; Rayfield, G.W.

    1991-07-02

    Sensors responsive to small changes in the concentration of chemical species are disclosed. The sensors comprise a mechanochemically responsive polymeric film capable of expansion or contraction in response to a change in its chemical environment. They are operatively coupled to a transducer capable of directly converting the expansion or contraction to a measurable electrical response. 9 figures.

  16. Numerical and experimental characterizations of low frequency MEMS AE sensors

    Science.gov (United States)

    Saboonchi, Hossain; Ozevin, Didem

    2013-04-01

    In this paper, new MEMS Acoustic Emission (AE) sensors are introduced. The transduction principle of the sensors is capacitance due to gap change. The sensors are numerically modeled using COMSOL Multiphysics software in order to estimate the resonant frequencies and capacitance values, and manufactured using MetalMUMPS process. The process includes thick metal layer (20 μm) made of nickel for freely vibration layer and polysilicon layer as the stationary layer. The metal layer provides a relatively heavy mass so that the spring constant can be designed high for low frequency sensor designs in order to increase the collapse voltage level (proportional to the stiffness), which increases the sensor sensitivity. An insulator layer is deposited between stationary layer and freely vibration layer, which significantly reduces the potential of stiction as a failure mode. As conventional AE sensors made of piezoelectric materials cannot be designed for low frequencies (vacuum packaging. The MEMS sensor responses are compared with similar frequency piezoelectric AE sensors.

  17. Packaging of MEMS/MOEMS and nanodevices: reliability, testing, and characterization aspects

    Science.gov (United States)

    Tekin, Tolga; Ngo, Ha-Duong; Wittler, Olaf; Bouhlal, Bouchaib; Lang, Klaus-Dieter

    2011-02-01

    The last decade witnessed an explosive growth in research and development efforts devoted to MEMS devices and packaging. The successfully developed MEMS devices are, for example inkjet, pressure sensors, silicon microphones, accelerometers, gyroscopes, MOEMS, micro fuel cells and emerging MEMS. For the next decade, MEMS/MOEMS and nanodevice based products will penetrate into IT, telecommunications, automotive, defense, life sciences, medical and implantable applications. Forecasts say the MEMS market to be $14 billion by 2012. The packaging cost of MEMS/MOEMS products in general is about 70 percent. Unlike today's electronics IC packaging, their packaging are custom-built and difficult due to the moving structural elements. In order for the moving elements of a MEMS device to move effectively in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. For some MEMS devices, such as resonators and gyroscopes, vacuum packaging is required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a wafer level packaging. In terms of MEMS/MOEMS and nanodevice packaging, there are still many critical issues need to be addressed due to the increasing integration density supported by 3D heterogeneous integration of multi-physic components/layers consisting of photonics, electronics, rf, plasmonics, and wireless. The infrastructure of MEMS/MOEMS and nanodevices and their packaging is not well established yet. Generic packaging platform technologies are not available. Some of critical issues have been studied intensively in the last years. In this paper we will discuss about processes, reliability, testing and characterization of MEMS/MOEMS and nanodevice packaging.

  18. Single-Crystal Sapphire Optical Fiber Sensor Instrumentation

    Energy Technology Data Exchange (ETDEWEB)

    Pickrell, Gary [Virginia Polytechnic Inst. & State Univ., Blacksburg, VA (United States); Scott, Brian [Virginia Polytechnic Inst. & State Univ., Blacksburg, VA (United States); Wang, Anbo [Virginia Polytechnic Inst. & State Univ., Blacksburg, VA (United States); Yu, Zhihao [Virginia Polytechnic Inst. & State Univ., Blacksburg, VA (United States)

    2013-12-31

    This report summarizes technical progress on the program “Single-Crystal Sapphire Optical Fiber Sensor Instrumentation,” funded by the National Energy Technology Laboratory of the U.S. Department of Energy, and performed by the Center for Photonics Technology of the Bradley Department of Electrical and Computer Engineering at Virginia Tech. This project was completed in three phases, each with a separate focus. Phase I of the program, from October 1999 to April 2002, was devoted to development of sensing schema for use in high temperature, harsh environments. Different sensing designs were proposed and tested in the laboratory. Phase II of the program, from April 2002 to April 2009, focused on bringing the sensor technologies, which had already been successfully demonstrated in the laboratory, to a level where the sensors could be deployed in harsh industrial environments and eventually become commercially viable through a series of field tests. Also, a new sensing scheme was developed and tested with numerous advantages over all previous ones in Phase II. Phase III of the program, September 2009 to December 2013, focused on development of the new sensing scheme for field testing in conjunction with materials engineering of the improved sensor packaging lifetimes. In Phase I, three different sensing principles were studied: sapphire air-gap extrinsic Fabry-Perot sensors; intensity-based polarimetric sensors; and broadband polarimetric sensors. Black body radiation tests and corrosion tests were also performed in this phase. The outcome of the first phase of this program was the selection of broadband polarimetric differential interferometry (BPDI) for further prototype instrumentation development. This approach is based on the measurement of the optical path difference (OPD) between two orthogonally polarized light beams in a single-crystal sapphire disk. At the beginning of Phase II, in June 2004, the BPDI sensor was tested at the Wabash River coal gasifier

  19. Pathogen Sensors

    Directory of Open Access Journals (Sweden)

    Joseph Irudayaraj

    2009-10-01

    Full Text Available The development of sensors for detecting foodborne pathogens has been motivated by the need to produce safe foods and to provide better healthcare. However, in the more recent times, these needs have been expanded to encompass issues relating to biosecurity, detection of plant and soil pathogens, microbial communities, and the environment. The range of technologies that currently flood the sensor market encompass PCR and microarray-based methods, an assortment of optical sensors (including bioluminescence and fluorescence, in addition to biosensor-based approaches that include piezoelectric, potentiometric, amperometric, and conductometric sensors to name a few. More recently, nanosensors have come into limelight, as a more sensitive and portable alternative, with some commercial success. However, key issues affecting the sensor community is the lack of standardization of the testing protocols and portability, among other desirable elements, which include timeliness, cost-effectiveness, user-friendliness, sensitivity and specificity. [...

  20. Smart Sensors

    Science.gov (United States)

    Corsi, C.

    2007-01-01

    The term "Smart Sensors" refers to sensors which contain both sensing and signal processing capabilities with objectives ranging from simple viewing to sophisticated remote sensing, surveillance, search/track, weapon guidance, robotics, perceptronics and intelligence applications. Recently this approach is achieving higher goals by a new and revolutionary sensors concept which introduced inside the sensor some of the basic functions of living eyes, such as dynamic stare, non-uniformity compensation, spatial and temporal filtering. New objectives and requirements are presented for this type of new infrared smart sensor systems. This paper is concerned with the front end of FPA microbolometers processing, namely, the enhancement of target-to-noise ratio by background clutter suppression and the improvement in target detection by "smart" and pattern correlation thresholding.

  1. Nonparametric Econometrics: The np Package

    Directory of Open Access Journals (Sweden)

    Tristen Hayfield

    2008-07-01

    Full Text Available We describe the R np package via a series of applications that may be of interest to applied econometricians. The np package implements a variety of nonparametric and semiparametric kernel-based estimators that are popular among econometricians. There are also procedures for nonparametric tests of significance and consistent model specification tests for parametric mean regression models and parametric quantile regression models, among others. The np package focuses on kernel methods appropriate for the mix of continuous, discrete, and categorical data often found in applied settings. Data-driven methods of bandwidth selection are emphasized throughout, though we caution the user that data-driven bandwidth selection methods can be computationally demanding.

  2. Flexible packaging for PV modules

    Science.gov (United States)

    Dhere, Neelkanth G.

    2008-08-01

    Economic, flexible packages that provide needed level of protection to organic and some other PV cells over >25-years have not yet been developed. However, flexible packaging is essential in niche large-scale applications. Typical configuration used in flexible photovoltaic (PV) module packaging is transparent frontsheet/encapsulant/PV cells/flexible substrate. Besides flexibility of various components, the solder bonds should also be flexible and resistant to fatigue due to cyclic loading. Flexible front sheets should provide optical transparency, mechanical protection, scratch resistance, dielectric isolation, water resistance, UV stability and adhesion to encapsulant. Examples are Tefzel, Tedlar and Silicone. Dirt can get embedded in soft layers such as silicone and obscure light. Water vapor transmittance rate (WVTR) of polymer films used in the food packaging industry as moisture barriers are ~0.05 g/(m2.day) under ambient conditions. In comparison, light emitting diodes employ packaging components that have WVTR of ~10-6 g/(m2.day). WVTR of polymer sheets can be improved by coating them with dense inorganic/organic multilayers. Ethylene vinyl acetate, an amorphous copolymer used predominantly by the PV industry has very high O2 and H2O diffusivity. Quaternary carbon chains (such as acetate) in a polymer lead to cleavage and loss of adhesional strength at relatively low exposures. Reactivity of PV module components increases in presence of O2 and H2O. Adhesional strength degrades due to the breakdown of structure of polymer by reactive, free radicals formed by high-energy radiation. Free radical formation in polymers is reduced when the aromatic rings are attached at regular intervals. This paper will review flexible packaging for PV modules.

  3. GNS-12 Packaging design criteria

    Energy Technology Data Exchange (ETDEWEB)

    Clements, E.P., Westinghouse Hanford

    1996-07-24

    The purpose of this Packaging Design Criteria (PDC) is to provide criteria for the Safety Analysis Report for Packaging (SARP)(Onsite). The SARP provides the evaluation to demonstrate that the onsite transportation safety criteria are met for the transport and storage of the 324 Building vitrified encapsulated material in the GNS-12 cask. In this application, the approved PDC provides a formal set of standards for the payload requirements, and guidance for the current cask transport configuration and a revised storage seal and primary lid modification design.

  4. Flexible packaging of solid-state integrated circuit chips with elastomeric microfluidics

    Science.gov (United States)

    Zhang, Bowei; Dong, Quan; Korman, Can E.; Li, Zhenyu; Zaghloul, Mona E.

    2013-01-01

    A flexible technology is proposed to integrate smart electronics and microfluidics all embedded in an elastomer package. The microfluidic channels are used to deliver both liquid samples and liquid metals to the integrated circuits (ICs). The liquid metals are used to realize electrical interconnects to the IC chip. This avoids the traditional IC packaging challenges, such as wire-bonding and flip-chip bonding, which are not compatible with current microfluidic technologies. As a demonstration we integrated a CMOS magnetic sensor chip and associate microfluidic channels on a polydimethylsiloxane (PDMS) substrate that allows precise delivery of small liquid samples to the sensor. Furthermore, the packaged system is fully functional under bending curvature radius of one centimetre and uniaxial strain of 15%. The flexible integration of solid-state ICs with microfluidics enables compact flexible electronic and lab-on-a-chip systems, which hold great potential for wearable health monitoring, point-of-care diagnostics and environmental sensing among many other applications.

  5. Flexible packaging of solid-state integrated circuit chips with elastomeric microfluidics

    Science.gov (United States)

    Zhang, Bowei; Dong, Quan; Korman, Can E.; Li, Zhenyu; Zaghloul, Mona E.

    2013-01-01

    A flexible technology is proposed to integrate smart electronics and microfluidics all embedded in an elastomer package. The microfluidic channels are used to deliver both liquid samples and liquid metals to the integrated circuits (ICs). The liquid metals are used to realize electrical interconnects to the IC chip. This avoids the traditional IC packaging challenges, such as wire-bonding and flip-chip bonding, which are not compatible with current microfluidic technologies. As a demonstration we integrated a CMOS magnetic sensor chip and associate microfluidic channels on a polydimethylsiloxane (PDMS) substrate that allows precise delivery of small liquid samples to the sensor. Furthermore, the packaged system is fully functional under bending curvature radius of one centimetre and uniaxial strain of 15%. The flexible integration of solid-state ICs with microfluidics enables compact flexible electronic and lab-on-a-chip systems, which hold great potential for wearable health monitoring, point-of-care diagnostics and environmental sensing among many other applications.

  6. Vacuum-Packaging Technology for IRFPAs

    Science.gov (United States)

    Matsumura, Takeshi; Tokuda, Takayuki; Tsutinaga, Akinobu; Kimata, Masafumi; Abe, Hideyuki; Tokashiki, Naotaka

    We developed vacuum-packaging equipment and low-cost vacuum packaging technology for IRFPAs. The equipment is versatile and can process packages with various materials and structures. Getters are activated before vacuum packaging, and we can solder caps/ceramic-packages and caps/windows in a high-vacuum condition using this equipment. We also developed a micro-vacuum gauge to measure pressure in vacuum packages. The micro-vacuum gauge uses the principle of thermal conduction of gases. We use a multi-ceramic package that consists of six packages fabricated on a ceramic sheet, and confirm that the pressure in the processed packages is sufficiently low for high-performance IRFPA.

  7. Color in packaging design : Case: ZheJiang JinSheng packaging Co,Ltd

    OpenAIRE

    Hu, Cuicui

    2010-01-01

    Color occupies an important position in packaging design, with the improvement of living standard, the higher requirement of color design in packaging. The aim of this thesis was to discuss key issues concerning aesthetics of packaging design. Topics will include an overview of the packaging design, the influence factor of packaging design, and introduce the aesthetics from packaging aspect. This thesis will also identify common problems of the production process, and list the phases of ho...

  8. Green Packaging Development. : A way to efficient, effective and more environmental friendly packaging solutions.

    OpenAIRE

    Mian Muhammad, Masoud

    2011-01-01

    Growing pressure on the packaging design to enhance the environmental and logistics performance of a packaging system stresses the packaging designers to search new design strategies that not only fulfill logistics requirements in the supply chain, but also reduce the CO 2emissions during the packaging life cycle. This thesis focuses on the packaging design process and suggests some improvements by considering its logistics performance and CO 2emissions. A Green packaging development model wa...

  9. AMA Conferences 2015. SENSOR 2015. 17th international conference on sensors and measurement technology. IRS{sup 2} 2015. 14th international conference on infrared sensors and systems. Proceedings

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2015-07-01

    This meeting paper contains presentations of two conferences: SENSOR 2015 and IRS{sup 2} (= International conference on InfraRed Sensors and systems). The first part of SENSOR 2015 contains the following chapters: (A) SENSOR PRINCIPLES: A.1: Mechanical sensors; A.2: Optical sensors; A.3: Ultrasonic sensors; A.4: Microacoustic sensors; A.5: Magnetic sensors; A.6: Impedance sensors; A.7: Gas sensors; A.8: Flow sensors; A.9: Dimensional measurement; A.10: Temperature and humidity sensors; A.11: Chemosensors; A.12: Biosensors; A.13: Embedded sensors; A.14: Sensor-actuator systems; (B) SENSOR TECHNOLOGY: B.1: Sensor design; B.2: Numerical simulation of sensors; B.3: Sensor materials; B.4: MEMS technology; B.5: Micro-Nano-Integration; B.6: Packaging; B.7: Materials; B.8: Thin films; B.9: Sensor production; B.10: Sensor reliability; B.11: Calibration and testing; B.12: Optical fibre sensors. (C) SENSOR ELECTRONICS AND COMMUNICATION: C.1: Sensor electronics; C.2: Sensor networks; C.3: Wireless sensors; C.4: Sensor communication; C.5: Energy harvesting; C.6: Measuring systems; C.7: Embedded systems; C.8: Self-monitoring and diagnosis; (D) APPLICATIONS: D.1: Medical measuring technology; D.2: Ambient assisted living; D.3: Process measuring technology; D.4: Automotive; D.5: Sensors in energy technology; D.6: Production technology; D.7: Security technology; D.8: Smart home; D.9: Household technology. The second part with the contributions of the IRS{sup 2} 2015 is structured as follows: (E) INFRARED SENSORS: E.1: Photon detectors; E.2: Thermal detectors; E.3: Cooled detectors; E.4: Uncooled detectors; E.5: Sensor modules; E.6: Sensor packaging. (G) INFRARED SYSTEMS AND APPLICATIONS: G.1: Thermal imaging; G.2: Pyrometry / contactless temperature measurement; G.3: Gas analysis; G.4: Spectroscopy; G.5: Motion control and presence detection; G.6: Security and safety monitoring; G.7: Non-destructive testing; F: INFRARED SYSTEM COMPONENTS: F.1: Infrared optics; F.2: Optical

  10. Automotive sensors

    Science.gov (United States)

    Marek, Jiri; Illing, Matthias

    2003-01-01

    Sensors are an essential component of most electronic systems in the car. They deliver input parameters for comfort features, engine and emission control as well as for the active and passive safety systems. New technologies such as silicon micromachining play an important role for the introduction of these sensors in all vehicle classes. The importance and use of these sensor technologies in today"s automotive applications will be shown in this article. Finally an outlook on important current developments and new functions in the car will be given.

  11. Piezoceramic Sensors

    CERN Document Server

    Sharapov, Valeriy

    2011-01-01

    This book presents the latest and complete information about various types of piezosensors. A sensor is a converter of the measured physical size to an electric signal. Piezoelectric transducers and sensors are based on piezoelectric effects. They have proven to be versatile tools for the measurement of various processes. They are used for quality assurance, process control and for research and development in many different industries. In each area of application specific requirements to the parameters of transducers and sensors are developed. This book presents the fundamentals, technical des

  12. Hanford Site radioactive hazardous materials packaging directory

    Energy Technology Data Exchange (ETDEWEB)

    McCarthy, T.L.

    1995-12-01

    The Hanford Site Radioactive Hazardous Materials Packaging Directory (RHMPD) provides information concerning packagings owned or routinely leased by Westinghouse Hanford Company (WHC) for offsite shipments or onsite transfers of hazardous materials. Specific information is provided for selected packagings including the following: general description; approval documents/specifications (Certificates of Compliance and Safety Analysis Reports for Packaging); technical information (drawing numbers and dimensions); approved contents; areas of operation; and general information. Packaging Operations & Development (PO&D) maintains the RHMPD and may be contacted for additional information or assistance in obtaining referenced documentation or assistance concerning packaging selection, availability, and usage.

  13. Advances in miniature spectrometer and sensor development

    Science.gov (United States)

    Malinen, Jouko; Rissanen, Anna; Saari, Heikki; Karioja, Pentti; Karppinen, Mikko; Aalto, Timo; Tukkiniemi, Kari

    2014-05-01

    Miniaturization and cost reduction of spectrometer and sensor technologies has great potential to open up new applications areas and business opportunities for analytical technology in hand held, mobile and on-line applications. Advances in microfabrication have resulted in high-performance MEMS and MOEMS devices for spectrometer applications. Many other enabling technologies are useful for miniature analytical solutions, such as silicon photonics, nanoimprint lithography (NIL), system-on-chip, system-on-package techniques for integration of electronics and photonics, 3D printing, powerful embedded computing platforms, networked solutions as well as advances in chemometrics modeling. This paper will summarize recent work on spectrometer and sensor miniaturization at VTT Technical Research Centre of Finland. Fabry-Perot interferometer (FPI) tunable filter technology has been developed in two technical versions: Piezoactuated FPIs have been applied in miniature hyperspectral imaging needs in light weight UAV and nanosatellite applications, chemical imaging as well as medical applications. Microfabricated MOEMS FPIs have been developed as cost-effective sensor platforms for visible, NIR and IR applications. Further examples of sensor miniaturization will be discussed, including system-on-package sensor head for mid-IR gas analyzer, roll-to-roll printed Surface Enhanced Raman Scattering (SERS) technology as well as UV imprinted waveguide sensor for formaldehyde detection.

  14. The Macro - Games Course Package.

    Science.gov (United States)

    Heriot-Watt Univ., Edinburgh (Scotland). Esmee Fairbairn Economics Research Centre.

    Part of an Economic Education Series, the course package is designed to teach basic concepts and fundamental principles of macroeconomics and how they can be applied to various world problems. For use with college students, learning is gained through lectures, discussion, simulation games, programmed learning, and text. Time allotment is a 15-week…

  15. Emotional response towards food packaging

    DEFF Research Database (Denmark)

    Liao, Lewis Xinwei; Corsi, Armando M.; Chrysochou, Polymeros

    2015-01-01

    ) and typefaces (simple vs. ornate). A sample of 120 participants was exposed to mock package design concepts of chocolate blocks. The results suggest that images generate an emotional response that can be measured by both self-report and physiological measures, whereas colours and typefaces generate emotional...

  16. Food Nanotechnology - Food Packaging Applications

    Science.gov (United States)

    Astonishing growth in the market for nanofoods is predicted in the future, from the current market of $2.6 billion to $20.4 billion in 2010. The market for nanotechnology in food packaging alone is expected to reach $360 million in 2008. In large part, the impetus for this predicted growth is the ...

  17. Comparison of different LED Packages

    Science.gov (United States)

    Dieker, Henning; Miesner, Christian; Püttjer, Dirk; Bachl, Bernhard

    2007-09-01

    In this paper different technologies for LED packaging are compared, focusing on Chip on Board (COB) and SMD technology. The package technology which is used depends on the LED application. A critical fact in LED technology is the thermal management, especially for high brightness LED applications because the thermal management is important for reliability, lifetime and electrooptical performance of the LED module. To design certain and long life LED applications knowledge of the heat flow from LEDs to the complete application is required. High sophisticated FEM simulations are indispensable for modern development of high power LED applications. We compare simulations of various substrate materials and packaging technologies simulated using FLOTHERM software. Thereby different substrates such as standard FR4, ceramic and metal core printed circuit boards are considered. For the verification of the simulated results and the testing of manufactured modules, advanced measurement tools are required. We show different ways to experimentally characterize the thermal behavior of LED modules. The thermal path is determined by the transient thermal analysis using the MicReD T3Ster analyzer. Afterwards it will be compared to the conventional method using thermocouples. The heat distribution over the module is investigated by an IR-Camera. We demonstrate and compare simulation and measurement results of Chip-on-Board (COB) and Sub-Mounted Devices (SMD) technology. The results reveal that for different applications certain packages are ideal.

  18. Food Nanotechnology: Food Packaging Applications

    Science.gov (United States)

    Astonishing growth in the market for nanofoods is predicted in the future, from the current market of $2.6 billion to $20.4 billion in 2010. The market for nanotechnology in food packaging alone is expected to reach $360 million in 2008. In large part the impetus for this predicted growth is the e...

  19. Magnetic Package data quality overview

    DEFF Research Database (Denmark)

    Qamili, Enkelejda; Ottavianelli, Giuseppe; Olsen, Nils

    The ESA Swarm satellites, launched in November 2013, carry on-board instuments devoted to measure extremely accurate data necessary to improve our understanding of Earth’s magnetic field. The Swarm instrument package is made by two magnetometers (one vector and one scalar), one Electric field Ins...

  20. Improved switch-resistor packaging

    Science.gov (United States)

    Redmerski, R. E.

    1980-01-01

    Packaging approach makes resistors more accessible and easily identified with specific switches. Failures are repaired more quickly because of improved accessibility. Typical board includes one resistor that acts as circuit breaker, and others are positioned so that their values can be easily measured when switch is operated. Approach saves weight by using less wire and saves valuable panel space.

  1. Annual Symposium in Electronics Packaging

    CERN Document Server

    1991-01-01

    Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be cle...

  2. Plastic food packaging and health

    Directory of Open Access Journals (Sweden)

    Raika Durusoy

    2011-02-01

    Full Text Available Plastics have a wide usage in our daily lives. One of their uses is for food packaging and food containers. The aim of this review is to introduce different types of chemicals that can leach from food packaging plastics into foods and cause human exposure and to mention their effects on health. The types of plastics were reviewed under the 13 headings in Turkish Codex Alimentarius and plastics recycling symbols were provided to enable the recognition of the type of plastic when applicable. Chemicals used during the production and that can cause health risks are investigated under the heading of the relevant type of plastic. The most important chemicals from plastic food packaging that can cause toxicity are styrene, 1,3-butadiene, melamine, formaldehyde, acrylamide, di-2-ethylhexyl phthalate, di-2-ethylhexyl adipate, vinyl chloride and bisphenol A. These chemicals have endocrine disrupting, carcinogenic and/or development disrupting effects. These chemicals may leach into foods depending on the chemical properties of the plastic or food, temperature during packaging, processing and storage, exposure to UV and duration of storage. Contact with fatty/oily or acidic foods, heating of the food inside the container, or drinking hot drinks from plastic cups, use of old and scratched plastics and some detergents increase the risk of leaching. The use of plastic containers and packaging for food and beveradges should be avoided whenever possible and when necessary, less harmful types of plastic should be preferred. [TAF Prev Med Bull 2011; 10(1.000: 87-96

  3. SMART PACKAGING FOR FOOD PRESERVATION

    Directory of Open Access Journals (Sweden)

    Raquel Rodríguez-Sauceda

    2014-07-01

    Full Text Available One of the biggest challenges of the food industry is the preservation of its products, that is, to prevent them from being attacked by microorganisms that decompose them hauling economic losses and severe health damage to the consumer. Today, competition in the food industry is very high and any company that does not offer the quality products is doomed to fail. Consumers demand more and the industry still stands offering what is asked: quality, security and safety. The package, in addition to fulfilling its core functions is becoming a means of sophisticated interactions with content and a record of relevant information for both the end consumer and intermediate players in the value chain and concepts are born of active and intelligent packaging. A smart container is defined as a system that monitors the condition of the packaged product, being able to register and provide information about product quality or condition of the container, showing the possible "abnormal" practices that have suffered the product or the container during the entire supply chain, such as transportation or storage. These systems monitor the mechanisms of altered food due to physiological, chemical and biological processes that respond and communicate changes in the status of the product as time-temperature, Oxygen, Carbon dioxide, microbial growth, etc. There are different types of smart packaging such as time-temperature indicators, color indicators, indicators of pathogens and indicators of leaks, to name a few. Through literature review, arguments that demonstrate the usefulness and necessity of the use of smart packaging to preserve the quality and safety of the product it contains, from manufacturing to the time it is used by consumers were found, as these besides communicating or providing information about their state, acting as a marketing tool.

  4. Vibrissa Sensor

    Science.gov (United States)

    2016-09-30

    Docket No. 300119 1 of 11 VIBRISSA SENSOR STATEMENT OF GOVERNMENT INTEREST [0001] The invention described herein may be manufactured and used by...REFERENCE TO OTHER PATENT APPLICATIONS [0002] None. BACKGROUND OF THE INVENTION (1) Field of the Invention [0003] The present invention provides a... measured as strain. [0009] Thus, there is a need for a sensor utilizing a vibrissa that can detect dynamic and high frequency movement of the

  5. Miniaturized Sensors for Monitoring of Atmospheric Trace Gases using Multiple Deployment Platforms Project

    Data.gov (United States)

    National Aeronautics and Space Administration — Daylight Solutions proposes a miniaturized sensor package based on ECqcLTM and QEPAS technology that were independently developed by Daylight Solutions (San Diego,...

  6. Vibration sensors

    Science.gov (United States)

    Gupta, Amita; Singh, Ranvir; Ahmad, Amir; Kumar, Mahesh

    2003-10-01

    Today, vibration sensors with low and medium sensitivities are in great demand. Their applications include robotics, navigation, machine vibration monitoring, isolation of precision equipment & activation of safety systems e.g. airbags in automobiles. Vibration sensors have been developed at SSPL, using silicon micromachining to sense vibrations in a system in the 30 - 200 Hz frequency band. The sensing element in the silicon vibration sensor is a seismic mass suspended by thin silicon hinges mounted on a metallized glass plate forming a parallel plate capacitor. The movement of the seismic mass along the vertical axis is monitored to sense vibrations. This is obtained by measuring the change in capacitance. The movable plate of the parallel plate capacitor is formed by a block connected to a surrounding frame by four cantilever beams located on sides or corners of the seismic mass. This element is fabricated by silicon micromachining. Several sensors in the chip sizes 1.6 cm x 1.6 cm, 1 cm x 1 cm and 0.7 cm x 0.7 cm have been fabricated. Work done on these sensors, techniques used in processing and silicon to glass bonding are presented in the paper. Performance evaluation of these sensors is also discussed.

  7. Using an electronic nose for determining the spoilage of vacuum-packaged beef.

    Science.gov (United States)

    Blixt, Y; Borch, E

    1999-02-02

    The use of an electronic nose in the quantitative determination of the degree of spoilage of vacuum-packaged beef was evaluated. Beef from four different slaughterhouses was sliced, vacuum-packaged and stored at 4 degrees C for 8 weeks. Samples were withdrawn for bacterial (aerobic bacteria, lactic acid bacteria, Brochothrix thermosphacta, Pseudomonas and Enterobacteriaceae) and sensorial analyses and analysis of the volatile compounds during the storage period. A trained panel was used for the sensorial evaluations. The volatile compounds were analysed using an electronic nose containing a sensory array composed of 10 metal oxide semiconductor field-effect transistors, four Tagushi type sensors and one CO2-sensitive sensor. Four of the 15 sensors were excluded due to lack of response or overloading. Partial least-squares regression was used to define the mathematical relationships between the degree of spoilage of vacuum-packaged beef, as determined by the sensory panel, and the signal magnitudes of the sensors of the electronic nose. The mathematical models were validated after 6 months using a new set of samples. The stability of the sensors during this period was examined and it was shown that the sensitivity of five of the 11 sensors used had changed. Using the six remaining sensors, the signal patterns obtained from the meat from the different slaughterhouses did not change over a period of 6 months. It was shown that the degree of spoilage, as calculated using a model based on two Tagushi sensors, correlated well with the degree of spoilage determined by the sensory panel (r2 = 0.94).

  8. Woven electrochemical fabric-based test sensors (WEFTS): a new class of multiplexed electrochemical sensors.

    Science.gov (United States)

    Choudhary, Tripurari; Rajamanickam, G P; Dendukuri, Dhananjaya

    2015-05-07

    We present textile weaving as a new technique for the manufacture of miniature electrochemical sensors with significant advantages over current fabrication techniques. Biocompatible silk yarn is used as the material for fabrication instead of plastics and ceramics used in commercial sensors. Silk yarns are coated with conducting inks and reagents before being handloom-woven as electrodes into patches of fabric to create arrays of sensors, which are then laminated, cut and packaged into individual sensors. Unlike the conventionally used screen-printing, which results in wastage of reagents, yarn coating uses only as much reagent and ink as required. Hydrophilic and hydrophobic yarns are used for patterning so that sample flow is restricted to a small area of the sensor. This simple fluidic control is achieved with readily available materials. We have fabricated and validated individual sensors for glucose and hemoglobin and a multiplexed sensor, which can detect both analytes. Chronoamperometry and differential pulse voltammetry (DPV) were used to detect glucose and hemoglobin, respectively. Industrial quantities of these sensors can be fabricated at distributed locations in the developing world using existing skills and manufacturing facilities. We believe such sensors could find applications in the emerging area of wearable sensors for chemical testing.

  9. Packaging glass with hierarchically nanostructured surface

    KAUST Repository

    He, Jr-Hau

    2017-08-03

    An optical device includes an active region and packaging glass located on top of the active region. A top surface of the packaging glass includes hierarchical nanostructures comprised of honeycombed nanowalls (HNWs) and nanorod (NR) structures extending from the HNWs.

  10. The impact of packaging on product competition

    Directory of Open Access Journals (Sweden)

    Maryam Masoumi

    2012-09-01

    Full Text Available The primary objective of this paper is to detect important factors, which are influencing competitive advantage. The proposed model of this paper uses sampling technique to measure characteristics of society. There are eight independent variables for the proposed study of this paper including packaging endurance, easy distribution, customer promotion through packaging, packaging structure, packaging as silent advertiser, diversity of packaging, clean and healthy packaging and innovation in packaging. The proposed study uses structural equation modeling to either accept or reject all hypotheses associated with the proposed study of this paper. The population of this study includes all managers and experts who are involved in packaging products. We used simple sampling technique and chooses 300 from a population of 450 people who are considered as the population of this survey. Cronbach alpha was determined as 0.732, which is above the minimum acceptable level. The results confirm that all mentioned factors influence competitiveness, effectively.

  11. Automated packaging employing real-time vision

    Science.gov (United States)

    Chang, Wen-Chung; Wu, Chia-Hung

    2016-07-01

    Existing packaging systems rely on human operation to position a box in the packaging device perform do the packaging task. Current facilities are not capable of handling boxes with different sizes in a flexible way. In order to improve the above-mentioned problems, an eye-to-hand visual servo automated packaging approach is proposed in this paper. The system employs two cameras to observe the box and the gripper mounted on the robotic manipulator to precisely control the manipulator to complete the packaging task. The system first employs two-camera vision to determine the box pose. With appropriate task encoding, a closed-loop visual servoing controller is designed to drive a manipulator to accomplish packaging tasks. The proposed approach can be used to complete automated packaging tasks in the case of uncertain location and size of the box. The system has been successfully validated by experimenting with an industrial robotic manipulator for postal box packaging.

  12. MEMS-based thermoelectric infrared sensors: A review

    Science.gov (United States)

    Xu, Dehui; Wang, Yuelin; Xiong, Bin; Li, Tie

    2017-06-01

    In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.

  13. Application of a sensor fusion algorithm for improving grasping stability

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Jae Hyeon; Yoon, Hyun Suck; Moon, Hyung Pil; Choi, Hyouk Ryeol; Koo Ja Choon [Sungkyunkwan University, Suwon (Korea, Republic of)

    2015-07-15

    A robot hand normally employees various sensors that are packaged in small form factor, perform with delicately accurate, and cost mostly very expensive. Grasping operation of the hand relies especially on accuracy of those sensors. Even with a set of advanced sensory systems embedded in a robot hand, securing a stable grasping is still challenging task. The present work makes an attempt to improve force sensor accuracy by applying sensor fusion method. An optimal weight value sensor fusion method formulated with Kalman filters is presented and tested in the work. Using a set of inexpensive sensors, the work achieves a reliable force sensing and applies the enhanced sensor stability to an object pinch grasping.

  14. Introducing Experience Goals into Packaging Design

    OpenAIRE

    Joutsela, Markus; Roto, Virpi; Lloyd, Peter; Bohemia, Erik

    2016-01-01

    Consumer experiences are an increasingly important driving force for commerce, affecting also packaging design. Yet, experience design for packages is rarely studied. Specifically, there is a gap in research regarding the integration of experiential goals, Xgoals, into the packaging design process. Open questions include how to describe Xgoals in design briefs when package design is outsourced, how to deal with changes during the design process, and how to evaluate whether the delivered desig...

  15. Characterization Techniques for a MEMS Electric-Field Sensor in Vacuum

    Science.gov (United States)

    2012-01-01

    characterize their sensor re- sponse without the complexities associated with vacuum packaging . ARL has previously shown that the accuracy of the generated...active research and de- velopment with several design iterations that must be tested, vacuum packaging is a more complicated and expensive process that

  16. High strain FBG sensors for structural fatigue testing of military aircraft

    Science.gov (United States)

    Tejedor, S.; Kopczyk, J.; Nuyens, T.; Davis, C.

    2012-02-01

    This paper reports on a series of tests investigating the performance of Draw Tower Gratings (DTGs) combined with custom-designed broad area packaging and bonding techniques for high-strain sensing applications on Defence platforms. The sensors and packaging were subjected to a series of high-strain static and cyclic loading tests and a summary of these results is presented.

  17. 9 CFR 317.24 - Packaging materials.

    Science.gov (United States)

    2010-01-01

    ... 9 Animals and Animal Products 2 2010-01-01 2010-01-01 false Packaging materials. 317.24 Section... INSPECTION AND CERTIFICATION LABELING, MARKING DEVICES, AND CONTAINERS General § 317.24 Packaging materials... packaging materials must be safe for their intended use within the meaning of section 409 of the Federal...

  18. 27 CFR 6.93 - Combination packaging.

    Science.gov (United States)

    2010-04-01

    ... 27 Alcohol, Tobacco Products and Firearms 1 2010-04-01 2010-04-01 false Combination packaging. 6..., DEPARTMENT OF THE TREASURY LIQUORS âTIED-HOUSEâ Exceptions § 6.93 Combination packaging. The act by an industry member of packaging and distributing distilled spirits, wine, or malt beverages in...

  19. 7 CFR 58.640 - Packaging.

    Science.gov (United States)

    2010-01-01

    ... 7 Agriculture 3 2010-01-01 2010-01-01 false Packaging. 58.640 Section 58.640 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Standards... Procedures § 58.640 Packaging. The packaging of the semifrozen product shall be done by means which will...

  20. 9 CFR 354.72 - Packaging.

    Science.gov (United States)

    2010-01-01

    ... 9 Animals and Animal Products 2 2010-01-01 2010-01-01 false Packaging. 354.72 Section 354.72... CERTIFICATION VOLUNTARY INSPECTION OF RABBITS AND EDIBLE PRODUCTS THEREOF Supervision of Marking and Packaging § 354.72 Packaging. No container which bears or may bear any official identification or any...

  1. EDExpress Packaging Training, 2001-2002.

    Science.gov (United States)

    Office of Student Financial Assistance (ED), Washington, DC.

    Packaging is the process of finding the best combination of aid to meet a student's financial need for college, given limited resources and the institutional constraints that vary from school to school. This guide to packaging under the EDExpress software system outlines three steps to packaging. The first is determining the student's need for…

  2. 49 CFR 130.21 - Packaging requirements.

    Science.gov (United States)

    2010-10-01

    ... 49 Transportation 2 2010-10-01 2010-10-01 false Packaging requirements. 130.21 Section 130.21 Transportation Other Regulations Relating to Transportation PIPELINE AND HAZARDOUS MATERIALS SAFETY... Packaging requirements. Each packaging used for the transportation of oil subject to this part must...

  3. 21 CFR 355.20 - Packaging conditions.

    Science.gov (United States)

    2010-04-01

    ... 21 Food and Drugs 5 2010-04-01 2010-04-01 false Packaging conditions. 355.20 Section 355.20 Food... HUMAN USE ANTICARIES DRUG PRODUCTS FOR OVER-THE-COUNTER HUMAN USE Active Ingredients § 355.20 Packaging... accord with § 355.60. (b) Tight container packaging. To minimize moisture contamination, all...

  4. Packaging of high power semiconductor lasers

    CERN Document Server

    Liu, Xingsheng; Xiong, Lingling; Liu, Hui

    2014-01-01

    This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.

  5. ICT and the paperboard and packaging industry

    Science.gov (United States)

    Peter Ince; Sanna Kallioranta; Richard Vlosky

    2005-01-01

    The purpose of this chapter is to describe the reasons for the development of ICT and e-business systems in the paper and paperboard packaging industry and to discuss future scenarios that may serve to guide forest- sector research in this topical area. The paper and paperboard packaging industry encompasses producers of primary paper and paperboard packaging materials...

  6. Disposability Characteristics of Military Packaging Materials

    Science.gov (United States)

    1974-03-06

    packaging material but repre- sents only a minor segment of all packaging materials. In terms of U. S. tonnage, wood packaging materials account for...motftontttctl Anotywu of Solid Hoof COMactwn. David H. Markt and Jon C. Uabman (of Jonnt Hopkint Univartity), for tha U.S. Dapartmant of Hoatth, Education

  7. 7 CFR 65.130 - Consumer package.

    Science.gov (United States)

    2010-01-01

    ... 7 Agriculture 3 2010-01-01 2010-01-01 false Consumer package. 65.130 Section 65.130 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Standards..., PEANUTS, AND GINSENG General Provisions Definitions § 65.130 Consumer package. Consumer package means...

  8. Development of packaging technologies for microsystems

    Institute of Scientific and Technical Information of China (English)

    JIN Yu-feng; WANG Zhen-feng; WEI Jun

    2003-01-01

    It is well known that packaging plays a very important role in developing microsystems. Packaging accounts for about 60%~80% of cost and function of a microsystem. Package is required to provide mechanical protection, media separation or coupling, signal conditioning, etc.

  9. Consumer perception: attributes considered important in packaging

    Directory of Open Access Journals (Sweden)

    Nara Medianeira Stefano

    2012-08-01

    Full Text Available Packaging has been considered the main vehicle for sales, brand building and product identity, since it is the first contact with the product that the consumer has, it is fundamental when choosing and buying a product. In this sense, the packaging is a silent salesperson, because it is up to the package to attract attention, create interest and desire, show the quality of the product and close the sale within seconds. Packaging has contributed to corporate communication with consumers; it provides product protection, storage and convenience, as products move through the value chain. Thinking about it, the product cannot be planned separately from its packaging, and it should not be defined based only on engineering, marketing, communications or economics. The packaging concept has expanded and gained product status; packaging is able to communicate the same language of convenience wherever it goes. Today, packaging industries are taking advantage of this opportunity to differentiate their products through packaging, finding that it is not enough for the package to be beautiful, unbreakable, or preserve the flavor and freshness of foods. Within this context, the objective of this research is to analyze, from the point of view of consumers, the most important product packaging attributes at the time of purchase. For this purpose, the data obtained in this study was run through the Statistica 8.0 and SPSS 16 (Statistical Package Social Sciences software’s.

  10. 7 CFR 33.6 - Package.

    Science.gov (United States)

    2010-01-01

    ... 7 Agriculture 2 2010-01-01 2010-01-01 false Package. 33.6 Section 33.6 Agriculture Regulations of the Department of Agriculture AGRICULTURAL MARKETING SERVICE (Standards, Inspections, Marketing... ISSUED UNDER AUTHORITY OF THE EXPORT APPLE ACT Definitions § 33.6 Package. Package means any container...

  11. MEMS sensor technology

    Institute of Scientific and Technical Information of China (English)

    Jiang Zhuangde

    2012-01-01

    Since 1992 the author has led research group in Xi'an Jiaotong University to investigate and develop microelectro mechanical systems (MEMS) sensors, including pressure sensor, acceleration sensor, gas sensor, viscosity & density sensor, polymerase chain reaction (PCR) chip and integrated sensor etc. This paper introduces the technologies and research results related to MEMS sensors we achieved in the last 20 years.

  12. DNA packaging by lambda-like bacteriophages: mutations broadening the packaging specificity of terminase, the lambda-packaging enzyme.

    Science.gov (United States)

    Feiss, Michael; Reynolds, Erin; Schrock, Morgan; Sippy, Jean

    2010-01-01

    The DNA-packaging specificities of phages lambda and 21 depend on the specific DNA interactions of the small terminase subunits, which have support helix-turn-recognition helix-wing DNA-binding motifs. lambda-Terminase with the recognition helix of 21 preferentially packages 21 DNA. This chimeric terminase's ability to package lambdaDNA is reduced approximately 20-fold. Phage lambda with the chimeric terminase is unable to form plaques, but pseudorevertants are readily obtained. Some pseudorevertants have trans-acting suppressors that change codons of the recognition helix. Some of these codons appear to remove an unfavorable base-pair contact; others appear to create a novel nonspecific DNA contact. Helper-packaging experiments show that these mutant terminases have lost the ability to discriminate between lambda and 21 during DNA packaging. Two cis-acting suppressors affect cosB, the small subunit's DNA-binding site. Each changes a cosB(lambda)-specific base pair to a cosB(21)-specific base pair. These cosB suppressors cause enhanced DNA packaging by 21-specific terminase and reduce packaging by lambda-terminase. Both the cognate support helix and turn are required for strong packaging discrimination. The wing does not contribute to cosB specificity. Evolution of packaging specificity is discussed, including a model in which lambda- and 21-packaging specificities diverged from a common ancestor phage with broad packaging specificity.

  13. DNA Packaging by λ-Like Bacteriophages: Mutations Broadening the Packaging Specificity of Terminase, the λ-Packaging Enzyme

    Science.gov (United States)

    Feiss, Michael; Reynolds, Erin; Schrock, Morgan; Sippy, Jean

    2010-01-01

    The DNA-packaging specificities of phages λ and 21 depend on the specific DNA interactions of the small terminase subunits, which have support helix-turn-recognition helix-wing DNA-binding motifs. λ-Terminase with the recognition helix of 21 preferentially packages 21 DNA. This chimeric terminase's ability to package λDNA is reduced ∼20-fold. Phage λ with the chimeric terminase is unable to form plaques, but pseudorevertants are readily obtained. Some pseudorevertants have trans-acting suppressors that change codons of the recognition helix. Some of these codons appear to remove an unfavorable base-pair contact; others appear to create a novel nonspecific DNA contact. Helper-packaging experiments show that these mutant terminases have lost the ability to discriminate between λ and 21 during DNA packaging. Two cis-acting suppressors affect cosB, the small subunit's DNA-binding site. Each changes a cosBλ-specific base pair to a cosB21-specific base pair. These cosB suppressors cause enhanced DNA packaging by 21-specific terminase and reduce packaging by λ-terminase. Both the cognate support helix and turn are required for strong packaging discrimination. The wing does not contribute to cosB specificity. Evolution of packaging specificity is discussed, including a model in which λ- and 21-packaging specificities diverged from a common ancestor phage with broad packaging specificity. PMID:19841094

  14. Desensitized Optimal Filtering and Sensor Fusion Toolkit

    Science.gov (United States)

    Karlgaard, Christopher D.

    2015-01-01

    Analytical Mechanics Associates, Inc., has developed a software toolkit that filters and processes navigational data from multiple sensor sources. A key component of the toolkit is a trajectory optimization technique that reduces the sensitivity of Kalman filters with respect to model parameter uncertainties. The sensor fusion toolkit also integrates recent advances in adaptive Kalman and sigma-point filters for non-Gaussian problems with error statistics. This Phase II effort provides new filtering and sensor fusion techniques in a convenient package that can be used as a stand-alone application for ground support and/or onboard use. Its modular architecture enables ready integration with existing tools. A suite of sensor models and noise distribution as well as Monte Carlo analysis capability are included to enable statistical performance evaluations.

  15. Options for reducing food waste by quality-controlled logistics using intelligent packaging along the supply chain.

    Science.gov (United States)

    Heising, Jenneke K; Claassen, G D H; Dekker, Matthijs

    2017-10-01

    Optimising supply chain management can help to reduce food waste. This paper describes how intelligent packaging can be used to reduce food waste when used in supply chain management based on quality-controlled logistics (QCL). Intelligent packaging senses compounds in the package that correlate with the critical quality attribute of a food product. The information on the quality of each individual packaged food item that is provided by the intelligent packaging can be used for QCL. In a conceptual approach it is explained that monitoring food quality by intelligent packaging sensors makes it possible to obtain information about the variation in the quality of foods and to use a dynamic expiration date (IP-DED) on a food package. The conceptual approach is supported by quantitative data from simulations on the effect of using the information of intelligent packaging in supply chain management with the goal to reduce food waste. This simulation shows that by using the information on the quality of products that is provided by intelligent packaging, QCL can substantially reduce food waste. When QCL is combined with dynamic pricing based on the predicted expiry dates, a further waste reduction is envisaged.

  16. Food packaging and radiation sterilization

    Energy Technology Data Exchange (ETDEWEB)

    Kawamura, Yoko [Division of Food Additives, National Institute of Health Sciences, Tokyo (Japan)

    1998-12-31

    Radiation sterilization has several merits that it is a positively effective sterilization method, it can be used to sterilize low heat-resistant containers and high gas barrier films, and there is no possibility of residual chemicals being left in the packages. It has been commercially used in `Bag in a Box` and some food containers. The {gamma} ray and an electron beam are commonly used in radiation sterilization. The {gamma} ray can sterilize large size containers and containers with complex shapes or sealed containers due to its strong transmission capability. However, since the equipment tends to be large and expensive, it is generally used in off production lines. On the other hand, it is possible to install and electron beam system on food production lines since the food can be processed in a short time due to its high beam coefficient and its ease of maintenance, even though an electron beam has limited usage such as sterilizing relatively thin materials and surface sterilization due to the weak transmission. A typical sterilization dose is approximately 10-30 kGy. Direct effects impacting packaging materials, particularly plastics, include scission of polymer links, cross-linkage between polymers, and generating radiolysis products such as hydrogen, methane, aliphatic hydrocarbons, etc. Furthermore, under the existence of oxygen, the oxygen radicals generated by the radiation will oxidize and peroxidize polymer chains and will generate alcohol and carbonyl groups, which shear polymer links, and generate oxygen containing low molecular compounds. As a result, degradation of physical strength such as elongation and seal strength, generating foreign odor, and an increase in global migration values shown in an elution test are sometimes evident. The food packages have different shapes, materials, additives, number of microorganisms and purpose. Therefor the effects of radiation, the optimum dose and so on must be investigated on the individual package. (J.P.N.)

  17. Transportation and packaging resource guide

    Energy Technology Data Exchange (ETDEWEB)

    Arendt, J.W.; Gove, R.M.; Welch, M.J.

    1994-12-01

    The purpose of this resource guide is to provide a convenient reference document of information that may be useful to the U.S. Department of Energy (DOE) and DOE contractor personnel involved in packaging and transportation activities. An attempt has been made to present the terminology of DOE community usage as it currently exists. DOE`s mission is changing with emphasis on environmental cleanup. The terminology or nomenclature that has resulted from this expanded mission is included for the packaging and transportation user for reference purposes. Older terms still in use during the transition have been maintained. The Packaging and Transportation Resource Guide consists of four sections: Sect. 1, Introduction; Sect. 2, Abbreviations and Acronyms; Sect. 3, Definitions; and Sect. 4, References for packaging and transportation of hazardous materials and related activities, and Appendices A and B. Information has been collected from DOE Orders and DOE documents; U.S Department of Transportation (DOT), U.S. Environmental Protection Agency (EPA), and U.S. Nuclear Regulatory Commission (NRC) regulations; and International Atomic Energy Agency (IAEA) standards and other international documents. The definitions included in this guide may not always be a regulatory definition but are the more common DOE usage. In addition, the definitions vary among regulatory agencies. It is, therefore, suggested that if a definition is to be used in a regulatory or a legal compliance issue, the definition should be verified with the appropriate regulation. To assist in locating definitions in the regulations, a listing of all definition sections in the regulations are included in Appendix B. In many instances, the appropriate regulatory reference is indicated in the right-hand margin.

  18. The bacteriophage DNA packaging machine.

    Science.gov (United States)

    Feiss, Michael; Rao, Venigalla B

    2012-01-01

    Large dsDNA bacteriophages and herpesviruses encode a powerful ATP-driven DNA-translocating machine that encapsidates a viral genome into a preformed capsid shell or prohead. The key components of the packaging machine are the packaging enzyme (terminase, motor) and the portal protein that forms the unique DNA entrance vertex of prohead. The terminase complex, comprised of a recognition subunit (small terminase) and an endonuclease/translocase subunit (large terminase), cuts viral genome concatemers. The terminase-viral DNA complex docks on the portal vertex, assembling a motor complex containing five large terminase subunits. The pentameric motor processively translocates DNA until the head shell is full with one viral genome. The motor cuts the DNA again and dissociates from the full head, allowing head-finishing proteins to assemble on the portal, sealing the portal, and constructing a platform for tail attachment. A body of evidence from molecular genetics and biochemical, structural, and biophysical approaches suggests that ATP hydrolysis-driven conformational changes in the packaging motor (large terminase) power DNA motion. Various parts of the motor subunit, such as the ATPase, arginine finger, transmission domain, hinge, and DNA groove, work in concert to translocate about 2 bp of DNA per ATP hydrolyzed. Powerful single-molecule approaches are providing precise delineation of steps during each translocation event in a motor that has a speed as high as a millisecond/step. The phage packaging machine has emerged as an excellent model for understanding the molecular machines, given the mechanistic parallels between terminases, helicases, and numerous motor proteins.

  19. Applications of superconductivity to packaging

    Energy Technology Data Exchange (ETDEWEB)

    Hilbert, C.; Koger, H.; Ghoshal, U.; Gibson, D.A.; Smith, L.

    1989-05-01

    The potential applications of high temperature superconductors to packaging - interconnect technology - are reviewed. The authors caution against naive assumptions such as that it is obvious that superconductors will make computers run faster. On the other hand, they present examples in which the use of superconductors can significantly improve digital systems. These examples, however, involve much more than the simple substitution of superconductors for copper. They argue that imaginative uses of superconductors will eventually have a major impact on digital systems.

  20. Waste Package Design Methodology Report

    Energy Technology Data Exchange (ETDEWEB)

    D.A. Brownson

    2001-09-28

    The objective of this report is to describe the analytical methods and processes used by the Waste Package Design Section to establish the integrity of the various waste package designs, the emplacement pallet, and the drip shield. The scope of this report shall be the methodology used in criticality, risk-informed, shielding, source term, structural, and thermal analyses. The basic features and appropriateness of the methods are illustrated, and the processes are defined whereby input values and assumptions flow through the application of those methods to obtain designs that ensure defense-in-depth as well as satisfy requirements on system performance. Such requirements include those imposed by federal regulation, from both the U.S. Department of Energy (DOE) and U.S. Nuclear Regulatory Commission (NRC), and those imposed by the Yucca Mountain Project to meet repository performance goals. The report is to be used, in part, to describe the waste package design methods and techniques to be used for producing input to the License Application Report.

  1. Active packaging with antifungal activities.

    Science.gov (United States)

    Nguyen Van Long, N; Joly, Catherine; Dantigny, Philippe

    2016-03-01

    There have been many reviews concerned with antimicrobial food packaging, and with the use of antifungal compounds, but none provided an exhaustive picture of the applications of active packaging to control fungal spoilage. Very recently, many studies have been done in these fields, therefore it is timely to review this topic. This article examines the effects of essential oils, preservatives, natural products, chemical fungicides, nanoparticles coated to different films, and chitosan in vitro on the growth of moulds, but also in vivo on the mould free shelf-life of bread, cheese, and fresh fruits and vegetables. A short section is also dedicated to yeasts. All the applications are described from a microbiological point of view, and these were sorted depending on the name of the species. Methods and results obtained are discussed. Essential oils and preservatives were ranked by increased efficacy on mould growth. For all the tested molecules, Penicillium species were shown more sensitive than Aspergillus species. However, comparison between the results was difficult because it appeared that the efficiency of active packaging depended greatly on the environmental factors of food such as water activity, pH, temperature, NaCl concentration, the nature, the size, and the mode of application of the films, in addition to the fact that the amount of released antifungal compounds was not constant with time.

  2. The bacteriophage DNA packaging motor.

    Science.gov (United States)

    Rao, Venigalla B; Feiss, Michael

    2008-01-01

    An ATP-powered DNA translocation machine encapsidates the viral genome in the large dsDNA bacteriophages. The essential components include the empty shell, prohead, and the packaging enzyme, terminase. During translocation, terminase is docked on the prohead's portal protein. The translocation ATPase and the concatemer-cutting endonuclease reside in terminase. Remarkably, terminases, portal proteins, and shells of tailed bacteriophages and herpes viruses show conserved features. These DNA viruses may have descended from a common ancestor. Terminase's ATPase consists of a classic nucleotide binding fold, most closely resembling that of monomeric helicases. Intriguing models have been proposed for the mechanism of dsDNA translocation, invoking ATP hydrolysis-driven conformational changes of portal or terminase powering DNA motion. Single-molecule studies show that the packaging motor is fast and powerful. Recent advances permit experiments that can critically test the packaging models. The viral genome translocation mechanism is of general interest, given the parallels between terminases, helicases, and other motor proteins.

  3. Hazardous Material Packaging and Transportation

    Energy Technology Data Exchange (ETDEWEB)

    Hypes, Philip A. [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2016-02-04

    This is a student training course. Some course objectives are to: recognize and use standard international and US customary units to describe activities and exposure rates associated with radioactive material; determine whether a quantity of a single radionuclide meets the definition of a class 7 (radioactive) material; determine, for a given single radionuclide, the shipping quantity activity limits per 49 Code of Federal Regulations (CFR) 173.435; determine the appropriate radioactive material hazard class proper shipping name for a given material; determine when a single radionuclide meets the DOT definition of a hazardous substance; determine the appropriate packaging required for a given radioactive material; identify the markings to be placed on a package of radioactive material; determine the label(s) to apply to a given radioactive material package; identify the entry requirements for radioactive material labels; determine the proper placement for radioactive material label(s); identify the shipping paper entry requirements for radioactive material; select the appropriate placards for a given radioactive material shipment or vehicle load; and identify allowable transport limits and unacceptable transport conditions for radioactive material.

  4. Intelligent packaging in meat industry: An overview of existing solutions.

    Science.gov (United States)

    Mohebi, Ehsan; Marquez, Leorey

    2015-07-01

    Traditional packaging systems are refused since these systems do not provide any information about the quality of food products to the consumers and manufacturers at any stage of supply chain. The essence of a new technology to monitor the food spoilage from farm to fork is emerged to reduce hazards such as food borne diseases. Moreover, the food quality monitoring systems clarify the main factors in food wastage during supply chain. Intelligent packaging is employed to provide information about the history of food handling and storage to enhance food products quality and meet consumer satisfactions. Meat is one of the most perishable foods which causes sever illnesses in the case of spoilage. Variety of indicators and sensors have been proposed to warn about meat spoilage in meat industry. In this paper an overview of proposed approaches as well as commercial technologies to monitor the quality of meat during storage and transportation is presented. Furthermore, the existing technologies are compared in the sense of advantages and disadvantages in meat packaging applications.

  5. ARPREC: An arbitrary precision computation package

    Energy Technology Data Exchange (ETDEWEB)

    Bailey, David H.; Yozo, Hida; Li, Xiaoye S.; Thompson, Brandon

    2002-09-01

    This paper describes a new software package for performing arithmetic with an arbitrarily high level of numeric precision. It is based on the earlier MPFUN package, enhanced with special IEEE floating-point numerical techniques and several new functions. This package is written in C++ code for high performance and broad portability and includes both C++ and Fortran-90 translation modules, so that conventional C++ and Fortran-90 programs can utilize the package with only very minor changes. This paper includes a survey of some of the interesting applications of this package and its predecessors.

  6. OPIUM : optimal package install/ uninstall manager

    OpenAIRE

    Tucker, Christopher James

    2008-01-01

    Linux distributions often include package management tools such as apt-get in Debian or yum in RedHat. Using information about package dependencies and conflicts, such tools can determine how to install a new package (and its dependencies on a system of already installed packages. Using off-the-shelf SAT solvers, pseudo-boolean solvers, and Integer Linear Programming solvers, we have developed a new package-management tool, called Opium, that improves on current tools in two ways: (1) Opium i...

  7. Examination of SR101 shipping packages

    Energy Technology Data Exchange (ETDEWEB)

    Daugherty, W. L. [Savannah River Site (SRS), Aiken, SC (United States). Savannah River National Lab. (SRNL)

    2015-03-01

    Four SR101 shipping packages were removed from service and provided for disassembly and examination of the internal fiberboard assemblies. These packages were 20 years old, and had experienced varying levels of degradation. Two of the packages were successfully disassembled and fiberboard samples were removed from these packages and tested. Mechanical and thermal property values are generally comparable to or higher than baseline values measured on fiberboard from 9975 packages, which differs primarily in the specified density range. While baseline data for the SR101 material is not available, this comparison with 9975 material suggests that the material properties of the SR101 fiberboard have not significantly degraded.

  8. The Model 9977 Radioactive Material Packaging Primer

    Energy Technology Data Exchange (ETDEWEB)

    Abramczyk, G. [Savannah River Site (SRS), Aiken, SC (United States). Savannah River National Lab. (SRNL)

    2015-10-09

    The Model 9977 Packaging is a single containment drum style radioactive material (RAM) shipping container designed, tested and analyzed to meet the performance requirements of Title 10 the Code of Federal Regulations Part 71. A radioactive material shipping package, in combination with its contents, must perform three functions (please note that the performance criteria specified in the Code of Federal Regulations have alternate limits for normal operations and after accident conditions): Containment, the package must “contain” the radioactive material within it; Shielding, the packaging must limit its users and the public to radiation doses within specified limits; and Subcriticality, the package must maintain its radioactive material as subcritical

  9. Community Energy Systems and the Law of Public Utilities. Volume Twenty-one. Maine

    Energy Technology Data Exchange (ETDEWEB)

    Feurer, D.A.; Weaver, C.L.

    1981-01-01

    A detailed description is given of the laws and programs of the State of Maine governing the regulation of public energy utilities, the siting of energy generating and transmission facilities, the municipal franchising of public energy utilities, and the prescription of rates to be charged by utilities including attendant problems of cost allocations, rate base and operating expense determinations, and rate of return allowances. These laws and programs are analyzed to identify impediments which they may present to the implementation of Integrated Community Energy Systems (ICES). This report is one of fifty-one separate volumes which describe such regulatory programs at the Federal level and in each state as background to the report entitled Community Energy Systems and the Law of Public Utilities - Volume One: An Overview. This report also contains a summary of a strategy described in Volume One - An Overview for overcoming these impediments by working within the existing regulatory framework and by making changes in the regulatory programs to enhance the likelihood of ICES implementation.

  10. A twenty-one year surveillance of adenoviral conjunctivitis in Sapporo, Japan.

    Science.gov (United States)

    Aoki, Koki; Tagawa, Yoshitugu

    2002-01-01

    We have studied the clinicoetiological, serological, and molecular epidemiological features of adenoviral conjunctivitis under the auspices of the nationwide surveillance project in Sapporo, located in northern Japan. We were able to analyze the results of 1,454 cases of adenoviral, herpetic, and chlamydial conjunctivitis. We found that adenonovirus serotypes 8, 19, and 37 caused severe conjunctivitis without systemic symptoms, whereas serotypes Ad3, Ad7, and Ad11 caused mild conjunctivitis with systemic involvement. Ad4 showed a broad range of symptoms, from PCF to EKC. Adenoviral conjunctivitis had seasonal outbreaks in the summer in association with adequate temperature and humidity in Sapporo. Neutralization antibodies against Ad8, Ad19, and Ad37 were detected in fewer than 20% of cases, and so the incidence of epidemics with these serotypes may rise in the coming years. The main genome types of adenovirus in Sapporo were Ad4a, Ad8e, Ad19a, Ad19b, and Ad37p, a, and b.

  11. Acute toxic effects of two lampricides on twenty-one freshwater invertebrates

    Science.gov (United States)

    Rye, Robert P.; King, Everett Louis

    1976-01-01

    We conducted laboratory static bioassays to determine acute toxicity of two lampricides -- a 70% 2-aminoethanol salt of 5,2'dichloro-4'-nitrosalicylanilide (Bayer 73) and a mixture containing 98% 3-trifluoromethyl-4-nitrophenol (TFM) and 2% Bayer 73 (TFM-2B) -- to 21 freshwater invertebrates. LC50 values were determined for 24-h exposure periods at 12.8 C. Organisms relatively sensitive to Bayer 73 were a turbellarian (Dugesia tigrina), aquatic earthworms (Tubifex tubifex and Lumbriculus inconstans), snails (Physa sp.) and (Pleurocera sp.), a clam (Eliptio dilatatus), blackflies (Simulium sp.), leeches (Erpobdellidae), and a daphnid (Daphnia pulex). The invertebrates most sensitive to TFM-2B were turbellarians, aquatic earthworms (Tubifex), snails (Physa), blackflies, leeches, and burrowing mayflies (Hexagenia sp.). Bayer 73 was generally much more toxic to the test organisms than TFM-2B. At lampricidal concentrations, TFM-2B was more highly selective than Bayer 73 against larval sea lampreys (Petromyzon marinus).

  12. Twenty-One Millisecond Pulsars in Terzan 5 Using the Green Bank Telescope

    CERN Document Server

    Ransom, S M; Stairs, I H; Freire, P C C; Camilo, F; Kaspi, V M; Kaplan, D L; Ransom, Scott M.; Hessels, Jason W. T.; Stairs, Ingrid H.; Freire, Paulo C. C.; Camilo, Fernando; Kaspi, Victoria M.; Kaplan, David L.

    2005-01-01

    We have discovered 21 millisecond pulsars (MSPs) in the globular cluster Terzan 5 using the Green Bank Telescope, bringing the total of known MSPs in Terzan 5 to 24. These discoveries confirm fundamental predictions of globular cluster and binary system evolution. Thirteen of the new MSPs are in binaries, of which two show eclipses and two have highly eccentric orbits. The relativistic periastron advance for the two eccentric systems indicates that at least one of these pulsars has a mass >1.68 Msun at 95% confidence. Such large neutron star masses constrain the equation of state of matter at or beyond the nuclear equilibrium density.

  13. Drug-associated acute pancreatitis : twenty-one years of spontaneous reporting in The Netherlands

    NARCIS (Netherlands)

    Eland, I A; van Puijenbroek, E P; Sturkenboom, M J; Wilson, J H; Stricker, B H

    OBJECTIVE: Drugs are considered a rare cause of acute pancreatitis. We conducted a descriptive study to assess which drugs have been associated with acute pancreatitis in spontaneous adverse drug reaction reports in The Netherlands. METHODS: Our study is based on reports of drug-associated acute

  14. Structure Matters: Twenty-One Teaching Strategies to Promote Student Engagement and Cultivate Classroom Equity

    Science.gov (United States)

    Tanner, Kimberly D.

    2013-01-01

    The biology education community focuses a great deal of time and energy on issues of "what" students should be learning in the modern age of biology and then probing the extent to which students are learning these things. There has been increased focus over time on the "how" of teaching, with attention to questioning the…

  15. Drug-associated acute pancreatitis : twenty-one years of spontaneous reporting in The Netherlands

    NARCIS (Netherlands)

    Eland, I A; van Puijenbroek, E P; Sturkenboom, M J; Wilson, J H; Stricker, B H

    1999-01-01

    OBJECTIVE: Drugs are considered a rare cause of acute pancreatitis. We conducted a descriptive study to assess which drugs have been associated with acute pancreatitis in spontaneous adverse drug reaction reports in The Netherlands. METHODS: Our study is based on reports of drug-associated acute pan

  16. Community Energy Systems and the Law of Public Utilities. Volume Twenty-one. Maine

    Energy Technology Data Exchange (ETDEWEB)

    Feurer, D.A.; Weaver, C.L.

    1981-01-01

    A detailed description is given of the laws and programs of the State of Maine governing the regulation of public energy utilities, the siting of energy generating and transmission facilities, the municipal franchising of public energy utilities, and the prescription of rates to be charged by utilities including attendant problems of cost allocations, rate base and operating expense determinations, and rate of return allowances. These laws and programs are analyzed to identify impediments which they may present to the implementation of Integrated Community Energy Systems (ICES). This report is one of fifty-one separate volumes which describe such regulatory programs at the Federal level and in each state as background to the report entitled Community Energy Systems and the Law of Public Utilities - Volume One: An Overview. This report also contains a summary of a strategy described in Volume One - An Overview for overcoming these impediments by working within the existing regulatory framework and by making changes in the regulatory programs to enhance the likelihood of ICES implementation.

  17. A study of twenty-one cases of low-frequency noise complaints

    DEFF Research Database (Denmark)

    Pedersen, Christian Sejer; Møller, Henrik; Persson-Waye, Kerstin

    2008-01-01

    -frequency tinnitus. Noise recordings were made in the homes of the complainants, and the complainants were exposed to these in blind test listening experiments. Furthermore, the low-frequency hearing function of the complainants was investigated, and characteristics of the annoying sound was matched. The results...... showed that some of the complainants are annoyed by a physical sound (20-180 Hz), while others suffer from low-frequency tinnitus (perceived frequency 40-100 Hz). Physical sound at frequencies below 20 Hz (infrasound) is not responsible for the annoyance - or at all audible - in any of the investigated...... cases, and none of the complainants has extraordinary hearing sensitivity at low frequencies. For comparable cases of low-frequency noise complaints in general, it is anticipated that physical sound is responsible in a substantial part of the cases, while lowfrequency tinnitus is responsible in another...

  18. Twenty-one years of mass balance observations along the K-transect, West Greenland

    Directory of Open Access Journals (Sweden)

    R. S. W. van de Wal

    2012-08-01

    Full Text Available A 21-yr record is presented of surface mass balance measurements along the K-transect. The series covers the period 1990–2011. Data are available at eight sites along a transect over an altitude range of 380–1850 m at approximately 67° N in West Greenland. The surface mass balance gradient is on average 3.8 × 10−3 m w.e. m−1, and the mean equilibrium line altitude is 1553 m a.s.l. Only the lower three sites within 10 km of the margin up to an elevation of 700 m experience a significant increasing trend in the ablation over the entire period. Data are available at: doi:10.1594/PANGAEA.779181.

  19. Twenty-one years of mass balance observations along the K-transect, West Greenland

    Directory of Open Access Journals (Sweden)

    R. S. W. van de Wal

    2012-05-01

    Full Text Available A 21-yr record is presented of surface mass balance measurements along the K-transect. The series covers the period 1990–2011. Data are available at 8 sites along a transect over an altitude range of 390–1850 m at approximately 67° N in West Greenland. The surface mass balance gradient is on average 3.8 × 10−3 m w.e. m−1, and the mean equilibrium line altitude is 1553 m a.s.l. Only the lower 3 sites within 10 km of the margin experience a significant increasing trend in the ablation over the entire period. Data are available at: http://doi.pangaea.de/10.1594/PANGAEA.779181.

  20. LECTURES ON ACUPUNCTURE:Part Ⅰ Clinical Acupuncture Lecture Twenty-one MELANCHOLY

    Institute of Scientific and Technical Information of China (English)

    尚秀葵; 付娟; 董红英

    2001-01-01

    Melancholy is a general term for diseases resulting from emotional depressign and stagnation of qi. Disorder of qi-circulation can disturb functional activity of the blood system and result in many pathological changes. In this section, only hysteria is discussed. If you want to treat headache, insomnia, palpitation, seminal emission and globus hystericus, the relative sections in other lectures can be referred to.

  1. Structure Matters: Twenty-One Teaching Strategies to Promote Student Engagement and Cultivate Classroom Equity

    Science.gov (United States)

    Tanner, Kimberly D.

    2013-01-01

    The biology education community focuses a great deal of time and energy on issues of "what" students should be learning in the modern age of biology and then probing the extent to which students are learning these things. There has been increased focus over time on the "how" of teaching, with attention to questioning the…

  2. Progress report for the first twenty-one months of the contract period

    Energy Technology Data Exchange (ETDEWEB)

    1980-01-01

    During the period of July 1, 1978, through March 31, 1980 in-depth research of the legal and institutional obstacles and incentives to the development of small scale hydroelectric power in all of the nineteen northeastern states was performed. Research into economic issues associated with the development of small scale hydroelectric power was undertaken by the project economist. Special research activities have been undertaken with respect to the federal dam safety programs, the National Pollution Discharge Elimination System requirements of the Federal Clean Water Act and the implications of those requirements to small scale hydroelectric power, riparian law on lake and reservoir fluctuation in the State of Maine, and the implications of Title II and IV of the Public Utility Regulatory Policies Act of 1978 to the development of small scale hydroelectric power. The results of these studies are reported. (LCL)

  3. [Incidence of major lower limb amputation in Geneva: twenty-one years of observation].

    Science.gov (United States)

    Carmona, G A; Lacraz, A; Hoffmeyer, P; Assal, M

    2014-10-22

    Between 1990 and 2010 the incidence of major lowerlimb amputations (by definition any level of amputation above the foot) in the canton of Geneva was 10.02 per 100,000 inhabitants/ year. The analysis of various population groups revealed that the presence of diabetes increased the relative risk of amputation by a factor of 20, and age 65 years or older by a factor of 9. During this 21 years period we observed a gradual decline in the incidence of amputation and an increased age at the time of amputation, despite the increasing prevalence of diabetes and an aging population. This was a reflection on the efforts of primary and secon- dary prevention, initiated in the 1980s in which Geneva was a pioneer.

  4. morbid obesity in a twenty one year old beggar: a case report

    African Journals Online (AJOL)

    and China2 recorded the greatest increase in obesity, particularly in ... Native Americans and Mexican. Arnericanss. ... An ulcer on the lower lateral aspect of the right leg measuring ... wound as prescribed and would not adhere to any exercise ...

  5. Oral discoid lupus erythematosus: A study of twenty-one cases

    Directory of Open Access Journals (Sweden)

    Amena M Ranginwala

    2012-01-01

    Full Text Available Aims: This study was undertaken to analyze the histopathological findings of oral discoid lupus erythematosus with conventional light microscopy for early diagnosis of the oral lesions that would aid in prompt treatment. Objectives: To find out the predominant age, sex, site and clinical features of oral discoid lupus erythematosus. To study the histopathological features of oral discoid lupus erythematosus. To study the alterations of basement membrane changes of oral discoid lupus erythematosus. Materials and Methods: Our study consisted 21 cases of diagnosed DLE with oral lesions. A detailed clinical proforma was used for thorough clinical examination and light microscopy was used for histopathological study of the incisional biopsy specimens. Statistical Analysis Used: The lesions were diagnosed on the histopathological criteria given by Gisslen et al. and was statistically analyzed using the Chi square test. Results: In the present study 9.52% patients had only oral lesions, while 90.47% patients had oral lesions along with skin lesions with the most common site of oral involvement being labial mucosa (76.19%, vermillion border (71.42% and buccal mucosa (42.85%. On clinical examination, white spots were present in 28.6%, ulcers in 19% and central erythema in 52.4% lesions. Histopathologically, atrophy was observed in 66.66% cases, acanthosis in 66.66% and acanthosis alternating with atrophy in 33.33% cases along with the basement membrane appearing thin and homogenous in 66.7% and partially destroyed in 81% cases with Periodic Acid Schiff stain. Conclusions: Thus, from this study it was found that a diagnosis of oral discoid lupus erythematosus was based on the combination of clinical and histopathological findings. Thus the dentist may be in an important position to establish the diagnosis with the aid of clinical and histopathological findings before the cutaneous lesions become apparent.

  6. Karyotypic analyses of twenty-one species of molossid bats (Molossidae: Chiroptera)

    Science.gov (United States)

    Warner, J.W.; Patton, J.L.; Gardner, A.L.; Baker, R.J.

    1974-01-01

    Examination of 135 specimens representing 21 species from seven genera of the family Molossidae revealed diploid numbers ranging from 34 to 48. Seventeen species from six genera have diploid numbers of 48. Geographic variation and polymorphism were found only in Eumops glaucinus. Chromosomal variation within the family is presumed to be primarily due to changes in diploid number resulting from Robertsonian translocations.

  7. Acid Rain: A Selective Bibliography. Second Edition. Bibliography Series Twenty-One.

    Science.gov (United States)

    O'Neill, Gertrudis, Comp.

    Acid rain is a term for rain, snow, or other precipitation produced from water vapor in the air reacting with emissions from automobiles, factories, power plants, and other oil and coal burning sources. When these chemical compounds, composed of sulfur oxide and nitrogen oxide, react with water vapor, the result is sulfuric acid and nitric acid.…

  8. Progress report for the first twenty-one months of the contract period

    Energy Technology Data Exchange (ETDEWEB)

    1980-01-01

    During the period of July 1, 1978, through March 31, 1980 in-depth research of the legal and institutional obstacles and incentives to the development of small scale hydroelectric power in all of the nineteen northeastern states was performed. Research into economic issues associated with the development of small scale hydroelectric power was undertaken by the project economist. Special research activities have been undertaken with respect to the federal dam safety programs, the National Pollution Discharge Elimination System requirements of the Federal Clean Water Act and the implications of those requirements to small scale hydroelectric power, riparian law on lake and reservoir fluctuation in the State of Maine, and the implications of Title II and IV of the Public Utility Regulatory Policies Act of 1978 to the development of small scale hydroelectric power. The results of these studies are reported. (LCL)

  9. Cephalometric Assessment of Sagittal Dysplasia: A Review of Twenty-One Methods

    Directory of Open Access Journals (Sweden)

    Vinay Kumar

    2014-01-01

    Full Text Available The anteroposterior discrepancy is usually of utmost concern to patients and parents and hence has received maximum attention in orthodontics. A number of analyses have been proposed over the years with varying degrees of reliability and success in assessing sagittal jaw relationships. It is absolutely essential that a clinician be aware of a range of analyses to be used in different situations. This review provides an insight into the various cephalometric methods used for evaluation of the anteroposterior jaw relationship in chronologic order and their clinical implications in contemporary orthodontics.

  10. Twenty-one Asteroid Lightcurves at Group Observadores de Asteroides (OBAS): Late 2015 to Early 2016

    Science.gov (United States)

    Aznar Macias, Amadeo; Carreno Garcerain, Alfonso; Arce Masego, Enrique; Brines Rodriguez, Pedro; Lozano de Haro, Juan; Fornas Silva, Alvaro; Fornas Silva, Gonzalo; Mas Martinez, Vicente; Rodrigo Chiner, Onofre; Herrero Porta, David

    2016-07-01

    We report on the photometric analysis result of 21 mainbelt asteroids (MBA) done by Observadores de Asteroides (OBAS). This work is part of the Minor Planet Photometric Database task initiated by a group of Spanish amateur astronomers. We have managed to obtain a number of accurate and complete lightcurves as well as additional incomplete lightcurves to help analysis at future oppositions. This is a compilation of lightcurves obtained during last quarter of 2015 and first quarter of 2016.

  11. Perspectives on the Elements of Packaging Design : A Qualitative Study on the Communication of Packaging

    OpenAIRE

    Alervall, Viktoria; Saied, Juan Sdiq

    2013-01-01

    Background: In today’s markets almost all products we buy come packaged. We use packaging to protect, contain and identify products. Furthermore if this is executed in a skillful way consumers often choose products based on packaging. The work of a designer and marketer is therefore extremely valuable when it comes to the design of a package. Problem: How are packages used to communicate marketing information? Purpose: The focus of this thesis is to identify differences and similarities of a ...

  12. The art of packaging: An investigation into the role of color in packaging, marketing, and branding

    OpenAIRE

    Behzad Mohebbi

    2014-01-01

    The purpose of this study is to contribute to the existing research in the field of packaging and marketing and shed more light on the psychology of colors and their effect on packaging and marketing. Nowadays, packaging is proved to be one of the significant factors in the success of promoting product sale. However, there is a perceived gap with respect to the different aspects of packaging, in particular the graphics, design, and color of packaging. The current study provides...

  13. IMS Content Packaging v1.2 public draft specification

    NARCIS (Netherlands)

    Burgos, Daniel; Tattersall, Colin; Vogten, Hubert

    2006-01-01

    The IMS Content Packaging Specification provides the functionality to describe and package learning materials, such as an individual course or a collection of courses, into interoperable, distributable packages. Content Packaging addresses the description, structure, and location of online learning

  14. Study on Manganin High Pressure Array Sensor

    Institute of Scientific and Technical Information of China (English)

    DUAN Jianhua; DU Xiaosong; YANG Bangchao; ZHOU Hongre

    2003-01-01

    A new kind of thin film manganin aray gauge is fabricated by adopting a new sensor fabrication technique. The sensitive materials (manganin thin films) are first deposited by magnetron sputtering on fused silica substrates, and then covered by a layer of SiO2 thin films by electron beam evaporation. Based on impedance match method of "back configuration", the highest pressure measured in Al target is 51.68 Gpa, the highest pressure in SiO2 package is 35.396 Gpa and the piezoresistance coefficient k is 0.026 Gpa-1. The upper limit and measure precision of sensor is improved.

  15. Antimicrobial packaging with natural compunds - a review

    Directory of Open Access Journals (Sweden)

    Renata Dobrucka

    2016-12-01

    Full Text Available Background:  Packaging problems are an integral part of logistics and the implementation of packaging significantly affects the effectiveness of logistics processes, as a factor which increases the safety and the quality of products being transported. Active packaging is an area of technology needed to meet the requirements of the contemporary consumer. Active packaging creates additional opportunities in systems for packing goods, as well as offering a solution in which the packaging, the product and surroundings interact. Furthermore, active packaging allows packaging to interact with food and the environment and play a dynamic role in food preservation. The main role of antimicrobial packaging is to inhibit the growth of microorganisms that reduce the quality of the packaged product. Methods: The application of natural antimicrobial agents appears to be safe for food products. Also, these compounds have potential applications as a natural preservative in the food packaging industry. This study presents some antibacterial agents, namely chitosan, nisin and pectins. Results and conclusion: Natural substances used in active packaging can eliminate the danger of chemical substances migrating to food.

  16. Multi-Parameter Aerosol Scattering Sensor

    Science.gov (United States)

    Greenberg, Paul S.; Fischer, David G.

    2011-01-01

    This work relates to the development of sensors that measure specific aerosol properties. These properties are in the form of integrated moment distributions, i.e., total surface area, total mass, etc., or mathematical combinations of these moment distributions. Specifically, the innovation involves two fundamental features: a computational tool to design and optimize such sensors and the embodiment of these sensors in actual practice. The measurement of aerosol properties is a problem of general interest. Applications include, but are not limited to, environmental monitoring, assessment of human respiratory health, fire detection, emission characterization and control, and pollutant monitoring. The objectives for sensor development include increased accuracy and/or dynamic range, the inclusion in a single sensor of the ability to measure multiple aerosol properties, and developing an overall physical package that is rugged, compact, and low in power consumption, so as to enable deployment in harsh or confined field applications, and as distributed sensor networks. Existing instruments for this purpose include scattering photometers, direct-reading mass instruments, Beta absorption devices, differential mobility analyzers, and gravitational samplers. The family of sensors reported here is predicated on the interaction of light and matter; specifically, the scattering of light from distributions of aerosol particles. The particular arrangement of the sensor, e.g. the wavelength(s) of incident radiation, the number and location of optical detectors, etc., can be derived so as to optimize the sensor response to aerosol properties of practical interest. A key feature of the design is the potential embodiment as an extremely compact, integrated microsensor package. This is of fundamental importance, as it enables numerous previously inaccessible applications. The embodiment of these sensors is inherently low maintenance and high reliability by design. The novel and

  17. Modelling of a DNA packaging motor

    Institute of Scientific and Technical Information of China (English)

    Qian Jun; Xie Ping; Xue Xiao-Guang; Wang Peng-Ye

    2009-01-01

    During the assembly of many viruses, a powerful molecular motor packages the genome into a preassembled capsid. The Bacillus subtilis phage φ29 is an excellent model system to investigate the DNA packaging mechanism because of its highly efficient in vitro DNA packaging activity and the development of a single-molecule packaging assay. Here we make use of structural and biochemical experimental data to build a physical model of DNA packaging by the φ29 DNA packaging motor. Based on the model, various dynamic behaviours such as the packaging rate, pause frequency and slip frequency under different ATP concentrations, ADP concentrations, external loads as well as capsid fillings are studied by using Monte Carlo simulation. Good agreement is obtained between the simulated and available experimental results. Moreover, we make testable predictions that should guide future experiments related to motor function.

  18. Examination of shipping package 9975-02403

    Energy Technology Data Exchange (ETDEWEB)

    Daugherty, W. L. [Savannah River Site (SRS), Aiken, SC (United States). Savannah River National Lab. (SRNL)

    2016-03-01

    SRNL examined shipping package 9975-02403 following storage of nuclear material in K-Area Complex (KAC). As a result of field surveillance activities in KAC, this package was identified to contain several non-conforming and other conditions. Further examination of this package in SRNL confirmed significant moisture and mold in the bottom layers of the lower fiberboard assembly, and identified additional corrosion along the seam weld and on the bottom of the drum. It was recently recommended that checking for corrosion along the bottom edge of the drum be implemented for packages that are removed from storage, as well as high wattage packages remaining in storage. The appearance of such corrosion on 9975-02403 further indicates that such corrosion may provide an indication of significant moisture concentration and related degradation within the package. This condition is more likely to develop in packages with higher internal heat loads.

  19. Theory of the Golden Packaging Design Art

    Institute of Scientific and Technical Information of China (English)

    韩玮

    2012-01-01

      Color as a design language, in the packaging design field with a strong visual impact, is not only the ele-ments of commodity packaging, is the soul of the sales package, has become an important means of advertising goods image one. And the golden packaging and packaging the most popular the most brilliant. Golden art design to use in packing, we must request in the system designer can grasp the basic theory on the basis of the color, pay attention to the market and adapt to the colour is applied law, gift packaging spirituality and attractive charm, so as to create a good packaging, arouse consumers' desire to buy, in order to meet the increasing material and cultural and spiritual needs.

  20. RF and microwave microelectronics packaging II

    CERN Document Server

    Sturdivant, Rick

    2017-01-01

    Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in underst...

  1. EXAMINATION OF SHIPPING PACKAGE 9975-05050

    Energy Technology Data Exchange (ETDEWEB)

    Daugherty, W.

    2014-11-06

    Shipping package 9975-05050 was examined in K-Area following its identification as a high wattage package. Elevated temperature and fiberboard moisture content are key parameters that impact the degradation rate of fiberboard within 9975 packages in a storage environment. The high wattage of this package contributes significantly to component temperatures. After examination in K-Area, the package was provided to SRNL for further examination of the fiberboard assembly. The moisture content of the fiberboard was relatively low (compared to packages examined previously), but the moisture gradient (between fiberboard ID and OD surfaces) was relatively high, as would be expected for the high heat load. The cane fiberboard appeared intact and displayed no apparent change in integrity relative to a new package.

  2. Biobased Packaging - Application in Meat Industry

    Directory of Open Access Journals (Sweden)

    S. Wilfred Ruban

    2009-04-01

    Full Text Available Because of growing problems of waste disposal and because petroleum is a nonrenewable resource with diminishing quantities, renewed interest in packaging research is underway to develop and promote the use of “bio-plastics.” In general, compared to conventional plastics derived from petroleum, bio-based polymers have more diverse stereochemistry and architecture of side chains which enable research scientists a greater number of opportunities to customize the properties of the final packaging material. The primary challenge facing the food (Meat industry in producing bio-plastic packaging, currently, is to match the durability of the packaging with product shelf-life. Notable advances in biopolymer production, consumer demand for more environmentally-friendly packaging, and technologies that allow packaging to do more than just encompass the food are driving new and novel research and developments in the area of packaging for muscle foods. [Vet. World 2009; 2(2.000: 79-82

  3. NOVEL GAS SENSORS FOR HIGH-TEMPERATURE FOSSIL FUEL APPLICATIONS

    Energy Technology Data Exchange (ETDEWEB)

    Palitha Jayaweera

    2004-05-01

    SRI is developing ceramic-based microsensors for detection of exhaust gases such as NO, NO{sub 2}, and CO in advanced combustion and gasification systems. The sensors detect the electrochemical activity of the exhaust gas species on catalytic electrodes and are designed to operate at high temperatures, elevated pressures, and corrosive environments typical of large power generation exhausts. Under this research project we are developing sensors for multiple gas detection in a single package along with data acquisition and control software and hardware. The sensor package can be easily integrated into online monitoring systems for active emission control. This report details the research activities performed from May 2004 to October 2004 including testing of catalytic materials, sensor design and fabrication, and software development.

  4. Roll-to-roll gravure with nanomaterials for printing smart packaging.

    Science.gov (United States)

    Jung, Minhun; Kim, Junseok; Koo, Hyunmo; Lee, Wookyu; Subramanian, Vivek; Cho, Gyoujin

    2014-02-01

    Roll-to-roll (R2R) gravure is considered one of the highest throughput tools for manufacturing inexpensive and flexible ubiquitous IT devices called "smart packaging" in which NFC (near-field communication) transponder, sensors, ADC (analog-to-digital converter), simple processor and signage are all integrated on paper or plastic foils. In this review, we show R2R gravure can be employed to print smart packaging, starting from printing simple electrodes, dielectrics, capacitors, diodes and thin film transistors with appropriate nanomaterial-based inks on plastic foils.

  5. 49 CFR 178.915 - General Large Packaging standards.

    Science.gov (United States)

    2010-10-01

    ... 49 Transportation 2 2010-10-01 2010-10-01 false General Large Packaging standards. 178.915 Section... PACKAGINGS Large Packagings Standards § 178.915 General Large Packaging standards. (a) Each Large Packaging.... Large Packagings intended for solid hazardous materials must be sift-proof and water-resistant. (b)...

  6. Load sensor

    NARCIS (Netherlands)

    Van den Ende, D.; Almeida, P.M.R.; Dingemans, T.J.; Van der Zwaag, S.

    2007-01-01

    The invention relates to a load sensor comprising a polymer matrix and a piezo-ceramic material such as PZT, em not bedded in the polymer matrix, which together form a compos not ite, wherein the polymer matrix is a liquid crystalline resin, and wherein the piezo-ceramic material is a PZT powder for

  7. Gas sensor

    Science.gov (United States)

    Schmid, Andreas K.; Mascaraque, Arantzazu; Santos, Benito; de la Figuera, Juan

    2014-09-09

    A gas sensor is described which incorporates a sensor stack comprising a first film layer of a ferromagnetic material, a spacer layer, and a second film layer of the ferromagnetic material. The first film layer is fabricated so that it exhibits a dependence of its magnetic anisotropy direction on the presence of a gas, That is, the orientation of the easy axis of magnetization will flip from out-of-plane to in-plane when the gas to be detected is present in sufficient concentration. By monitoring the change in resistance of the sensor stack when the orientation of the first layer's magnetization changes, and correlating that change with temperature one can determine both the identity and relative concentration of the detected gas. In one embodiment the stack sensor comprises a top ferromagnetic layer two mono layers thick of cobalt deposited upon a spacer layer of ruthenium, which in turn has a second layer of cobalt disposed on its other side, this second cobalt layer in contact with a programmable heater chip.

  8. A Hierarchical Sensor Network Based on Voronoi Diagram

    Institute of Scientific and Technical Information of China (English)

    SHANG Rui-qiang; ZHAO Jian-li; SUN Qiu-xia; WANG Guang-xing

    2006-01-01

    A hierarchical sensor network is proposed which places the sensing and routing capacity at different layer nodes.It thus simplifies the hardware design and reduces cost. Adopting Voronoi diagram in the partition of backbone network,a mathematical model of data aggregation based on hierarchical architecture is given. Simulation shows that the number of transmission data packages is sharply cut down in the network, thus reducing the needs in the bandwidth and energy resources and is thus well adapted to sensor networks.

  9. Survivability of MEMS Packages at High-G Loads

    Science.gov (United States)

    Pryputniewicz, Ryszard J.

    2014-10-01

    Advances in emerging technology of microelectromechanical systems (MEMS) are one of the most challenging tasks in today's experimental mechanics. More specifically, development of these miniature devices requires sophisticated design, analysis, fabrication, testing, and characterization tools that have multiphysics and multiscale capabilities, especially as MEMS are being developed for use at harsh conditions. In harsh-environment and high-performance (e.g., military) guidance applications inertial sensors must be sensitive to low rates of rotation yet survive the high blast loads associated with the initial launch. In this multi-year study, a set of tuning fork gyroscopes were subjected to a series of increasing g-loads (culminating at approximately 60,000 g's) with measurements of shape made after each test. A custom set of test sample packages (aka articles) were hermetically sealed with glass lids to allow optical inspection of components while preserving the operating environment (i.e., vacuum). Initial test measurements were made upon fabrication of the articles. Optical and interferometric measurements have been made prior to and after each shock g-loading. The shape of the tuning fork gyroscope (TFG) test articles was measured using a phase shifting Michelson interferometer with compensation for package cover glass. Full field shape was determined and traces of pertinent structures were extracted for comparison. Failure of the die was observed in the form of fractures below the chip surface as well as fractures in the glass lid sealing the package. Potential causes of the failure are discussed as well as a recommendation for modified packaging techniques to mitigate future component failures.

  10. The Innovative Approaches to Packaging – Comparison Analysis of Intelligent and Active Packaging Perceptions in Slovakia

    Directory of Open Access Journals (Sweden)

    Loucanova Erika

    2017-06-01

    Full Text Available Packaging has always served a practical function - to hold goods together and protect it when moving toward the customer through distribution channel. Today packaging is also a container for promoting the product and making it easier and safer to use. The sheer importance of packaging functions is still growing and consequently the interest of the company is to access to the packaging more innovative and creative. The paper deals with the innovative approaches to packaging resulting in the creation of packaging with interactive active features in the form of active and intelligent packaging. Using comparative analysis, we monitored the perception of the active packaging functions in comparison to intelligent packaging function among different age categories. We identified the age categories which are most interested in these functions.

  11. Compact portable QEPAS multi-gas sensor

    Science.gov (United States)

    Dong, Lei; Kosterev, Anatoliy A.; Thomazy, David; Tittel, Frank K.

    2011-01-01

    A quartz-enhanced photoacoustic spectroscopy (QEPAS) based multi-gas sensor was developed to quantify concentrations of carbon monoxide (CO), hydrogen cyanide (HCN), hydrogen chloride (HCl), and carbon dioxide (CO2) in ambient air. The sensor consists of a compact package of dimensions 25cm x 25cm x 10cm and was designed to operate at atmospheric pressure. The HCN, CO2, and HCl measurement channels are based on cw, C-band telecommunication-style packaged, fiber-coupled diode lasers, while the CO channel uses a TO can-packaged Sb diode laser as an excitation source. Moreover, the sensor incorporates rechargeable batteries and can operate on batteries for at least 8 hours. It can also operate autonomously or interact with another device (such as a computer) via a RS232 serial port. Trace gas detection limits of 7.74ppm at 4288.29cm-1 for CO, 450ppb at 6539.11 cm-1 for HCN, 1.48ppm at 5739.26 cm-1 for HCl and 97ppm at 6361.25 cm-1 for CO2 for a 1sec average time, were demonstrated.

  12. MMIC Package for Millimeter Wave Frequency

    Science.gov (United States)

    Bharj, Sarjit Singh; Yuan, Steve

    1997-01-01

    Princeton Microwave Technology has successfully demonstrated the transfer of technology for the MMIC package. During this contract the package design was licensed from Hughes Aircraft Company for manufacture within the U.S. A major effort was directed towards characterization of the ceramic material for its dielectric constant and loss tangent properties. After selection of a ceramic tape, the high temperature co-fired ceramic package was manufactured in the U.S. by Microcircuit Packaging of America, Inc. Microwave measurements of the MMIC package were conducted by an intercontinental microwave test fixture. The package demonstrated a typical insertion loss of 0.5 dB per transition up to 32 Ghz and a return loss of better than 15 db. The performance of the package has been demonstrated from 2 to 30 Ghz by assembling three different MMIC amplifiers. Two of the MMIC amplifiers were designed for the 26 Ghz to 30 Ghz operation while the third MMIC was a distributed amplifier from 2 to 26.5 Ghz. The measured gain of the amplifier is consistent with the device data. The package costs are substantially lower than comparable packages available commercially. Typically the price difference is greater than a factor of three. The package cost is well under $5.00 for a quantity of 10,000 pieces.

  13. Surgical packages for laparoscopic surgery

    Directory of Open Access Journals (Sweden)

    Bhattacharya K

    2005-01-01

    Full Text Available ′Packages′ are in fashion today for most surgical procedures in various corporate hospitals and this has included laparoscopic procedures too. A package system enables the hospitals to get cost settlements done more easily. Also, it is more convenient for the patients who are aware upfront of the charges. The principal disadvantages seems to be for the surgeon, who may face displeasure of the patient, hospital or insurance agencies apart from forfeiting his personal charges if (a he is a novice in laparoscopic surgery and takes extra time to complete a procedure, (b unforeseen problems occur during surgery, or (c new pathologies are discovered on exploration.

  14. Natural biopolimers in organic food packaging

    Science.gov (United States)

    Wieczynska, Justyna; Cavoski, Ivana; Chami, Ziad Al; Mondelli, Donato; Di Donato, Paola; Di Terlizzi, Biagio

    2014-05-01

    Concerns on environmental and waste problems caused by use of non-biodegradable and non-renewable based plastic packaging have caused an increase interest in developing biodegradable packaging using renewable natural biopolymers. Recently, different types of biopolymers like starch, cellulose, chitosan, casein, whey protein, collagen, egg white, soybean protein, corn zein, gelatin and wheat gluten have attracted considerable attention as potential food packaging materials. Recyclable or biodegradable packaging material in organic processing standards is preferable where possible but specific principles of packaging are not precisely defined and standards have to be assessed. There is evidence that consumers of organic products have specific expectations not only with respect to quality characteristics of processed food but also in social and environmental aspects of food production. Growing consumer sophistication is leading to a proliferation in food eco-label like carbon footprint. Biopolymers based packaging for organic products can help to create a green industry. Moreover, biopolymers can be appropriate materials for the development of an active surfaces designed to deliver incorporated natural antimicrobials into environment surrounding packaged food. Active packaging is an innovative mode of packaging in which the product and the environment interact to prolong shelf life or enhance safety or sensory properties, while maintaining the quality of the product. The work will discuss the various techniques that have been used for development of an active antimicrobial biodegradable packaging materials focusing on a recent findings in research studies. With the current focus on exploring a new generation of biopolymer-based food packaging materials with possible applications in organic food packaging. Keywords: organic food, active packaging, biopolymers , green technology

  15. Miniaturized, low power FGMOSFET radiation sensor and wireless dosimeter system

    KAUST Repository

    Arsalan, Muhammad

    2013-08-27

    A miniaturized floating gate (FG) MOSFET radiation sensor system is disclosed, The sensor preferably comprises a matched pair of sensor and reference FGMOSFETs wherein the sensor FGMOSFET has a larger area floating gate with an extension over a field oxide layer, for accumulation of charge and increased sensitivity. Elimination of a conventional control gate and injector gate reduces capacitance, and increases sensitivity, and allows for fabrication using standard low cost CMOS technology. A sensor system may be provided with integrated signal processing electronics, for monitoring a change in differential channel current I.sub.D, indicative of radiation dose, and an integrated negative bias generator for automatic pre-charging from a low voltage power source. Optionally, the system may be coupled to a wireless transmitter. A compact wireless sensor System on Package solution is presented, suitable for dosimetry for radiotherapy or other biomedical applications.

  16. Small, Inexpensive Combined NOx and O2 Sensor

    Energy Technology Data Exchange (ETDEWEB)

    W. Lawless; C. Clark

    2008-09-01

    It has been successfully demonstrated in this program that a zirconia multilayer structure with rhodium-based porous electrodes performs well as an amperometric NO{sub x} sensor. The sensitivity of the sensor bodies operating at 650 to 700 C is large, with demonstrated current outputs of 14 mA at 500 ppm NO{sub x} from sensors with 30 layers. The sensor bodies are small (4.5 x 4.2 x 3.1 mm), rugged, and inexpensive. It is projected the sensor bodies will cost $5-$10 in production. This program has built on another successful development program for an oxygen sensor based on the same principles and sponsored by DOE. This oxygen sensor is not sensitive to NO{sub x}. A significant technical hurdle has been identified and solved. It was found that the 100% Rh electrodes oxidize rapidly at the preferred operating temperatures of 650-700 C, and this oxidation is accompanied by a volume change which delaminates the sensors. The problem was solved by using alloys of Rh and Pt. It was found that a 10%/90% Rh/Pt alloy dropped the oxidation rate of the electrodes by orders of magnitude without degrading the NO{sub x} sensitivity of the sensors, allowing long-term stable operation at the preferred operating temperatures. Degradation in the sensor output caused by temperature cycling was identified as a change in resistance at the junction between the sensor body and the external leads attached to the sensor body. The degradation was eliminated by providing strong mechanical anchors for the wire and processing the junctions to obtain good electrical bonds. The NO{sub x} sensors also detect oxygen and therefore the fully-packaged sensor needs to be enclosed with an oxygen sensor in a small, heated zirconia chamber exposed to test gas through a diffusion plug which limits the flow of gas from the outside. Oxygen is pumped from the interior of the chamber to lower the oxygen content and the combination of measurements from the NO{sub x} and oxygen sensors yields the NO{sub x

  17. Pressure sensor

    Science.gov (United States)

    Mee, David K.; Ripley, Edward B.; Nienstedt, Zachary C.; Nienstedt, Alex W.; Howell, Jr., Layton N.

    2015-09-29

    Disclosed is a passive, in-situ pressure sensor. The sensor includes a sensing element having a ferromagnetic metal and a tension inducing mechanism coupled to the ferromagnetic metal. The tension inducing mechanism is operable to change a tensile stress upon the ferromagnetic metal based on a change in pressure in the sensing element. Changes in pressure are detected based on changes in the magnetic switching characteristics of the ferromagnetic metal when subjected to an alternating magnetic field caused by the change in the tensile stress. The sensing element is embeddable in a closed system for detecting pressure changes without the need for any penetrations of the system for power or data acquisition by detecting changes in the magnetic switching characteristics of the ferromagnetic metal caused by the tensile stress.

  18. Semiconductor sensors

    Energy Technology Data Exchange (ETDEWEB)

    Hartmann, Frank, E-mail: frank.hartmann@cern.c [Institut fuer Experimentelle Kernphysik, KIT, Wolfgang-Gaede-Str. 1, Karlsruhe 76131 (Germany)

    2011-02-01

    Semiconductor sensors have been around since the 1950s and today, every high energy physics experiment has one in its repertoire. In Lepton as well as Hadron colliders, silicon vertex and tracking detectors led to the most amazing physics and will continue doing so in the future. This contribution tries to depict the history of these devices exemplarily without being able to honor all important developments and installations. The current understanding of radiation damage mechanisms and recent R and D topics demonstrating the future challenges and possible technical solutions for the SLHC detectors are presented. Consequently semiconductor sensor candidates for an LHC upgrade and a future linear collider are also briefly introduced. The work presented here is a collage of the work of many individual silicon experts spread over several collaborations across the world.

  19. Corrosion sensor

    Science.gov (United States)

    Glass, Robert S.; Clarke, Jr., Willis L.; Ciarlo, Dino R.

    1994-01-01

    A corrosion sensor array incorporating individual elements for measuring various elements and ions, such as chloride, sulfide, copper, hydrogen (pH), etc. and elements for evaluating the instantaneous corrosion properties of structural materials. The exact combination and number of elements measured or monitored would depend upon the environmental conditions and materials used which are subject to corrosive effects. Such a corrosion monitoring system embedded in or mounted on a structure exposed to the environment would serve as an early warning system for the onset of severe corrosion problems for the structure, thus providing a safety factor as well as economic factors. The sensor array is accessed to an electronics/computational system, which provides a means for data collection and analysis.

  20. Can packaging elements elicit consumers’ emotional responses?

    DEFF Research Database (Denmark)

    Liao, Lewis; Corsi, Armando; Lockshin, Larry;

    Emotion has been an important concept in many areas of consumer research such as judgment, decision-making and advertising. Little research has been done on emotion in packaging adopting the physiological measures used in other areas. This paper draws on past studies in advertising that measure....... The results show that packaging can elicit an emotional response via different elements. The paper also raises concerns about the accuracy of using selfreport measures of emotional responses to packaging research....

  1. Food Packaging Permeability Behaviour: A Report

    OpenAIRE

    Valentina Siracusa

    2012-01-01

    The use of polymer materials in food packaging field is one of the largest growing market area. Actually the optimization behaviour of packaging permeability is of crucial importance, in order to extend the food shelf-life and to reach the best engineering solution. Studying the permeability characterization of the different polymer material (homogeneous and heterogeneous polymer system) to the different packaging gases, in different environmental condition, is crucial to understand if the se...

  2. micromap: A Package for Linked Micromaps

    OpenAIRE

    Quinn C. Payton; Michael G. McManus; Weber, Marc H.; Anthony R. Olsen; Thomas M. Kincaid

    2015-01-01

    The R package micromap is used to create linked micromaps, which display statistical summaries associated with areal units, or polygons. Linked micromaps provide a means to simultaneously summarize and display both statistical and geographic distributions by linking statistical summaries to a series of small maps. The package contains functions dependent on the ggplot2 package to produce a row-oriented graph composed of different panels, or columns, of information. These panels at a minimum t...

  3. Material Design and Technology of Cartonboard Packaging

    OpenAIRE

    Marttila, Erno

    2012-01-01

    This thesis explores the different types of cartonboard packages through the whole line of their manufacturing process from choosing the right materials for the board in to final converting processes. Producing efficient, environmentally friendly and most of all right kind of cartonboard package is the core theme in this work. This work is publicly available and can be used as a reference by anyone who needs to learn the basics and some of the more advanced things of cartonboard packaging....

  4. NFR TRIGA package design review report

    Energy Technology Data Exchange (ETDEWEB)

    Clements, M.D.

    1994-08-26

    The purpose of this document is to compile, present and document the formal design review of the NRF TRIGA packaging. The contents of this document include: the briefing meeting presentations, package description, design calculations, package review drawings, meeting minutes, action item lists, review comment records, final resolutions, and released drawings. This design review required more than two meeting to resolve comments. Therefore, there are three meeting minutes and two action item lists.

  5. Microbial control by packaging: a review.

    Science.gov (United States)

    Cutter, Catherine Nettles

    2002-03-01

    Since early man first used a variety of natural containers to store and eat foods, significant developments in food packaging materials have provided the means to suppress microbial growth as well as protect foods from external microbial contamination. Throughout this progression, packaging materials have been developed specifically to prevent the deterioration of foods resulting from exposure to air, moisture, or pH changes associated with the food or the surrounding atmosphere. Both flexible and rigid packaging materials, alone or in combination with other preservation methods, have been developed to offer the necessary barrier, inactivation, and containment properties required for successful food packaging. Examples of flexible packaging used to inactivate microorganisms associated with foods include controlled atmosphere, vacuum, modified atmosphere, active, and edible packaging. Additionally, the combination of rigid packaging materials made from metal, glass, or plastic with heat provides the most effective and widely used method for inactivating microorganisms. As with all food products, it is necessary to integrate a HACCP-based program to assure quality throughout the packaging operation. In addition to packaging improvements, other novel technologies include the development of detectors for oxygen levels, bacterial toxins, and microbial growth, or the integration of time-temperature indicators for detection of improper handling or storage.

  6. Hermeticity testing of MEMS and microelectronic packages

    CERN Document Server

    Costello, Suzanne

    2013-01-01

    Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required.This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book in

  7. New Polymer Materials for Microelectronics Packaging

    Institute of Scientific and Technical Information of China (English)

    2005-01-01

    @@ Researchers at the CAS Institute of Chemistry (ICCAS) have made breakthrough progress in developing the manufacturing technology of advanced polymer materials for microelectronics packaging applications. The advanced integrated circuit (IC) packaging polymer materials, including photoimageable polyimide resins and liquid epoxy underfills, are a key issue for FC-BGA/CSP(flip chip-ball grill array/chip scale packaging) which is the main stream for the next generation of microelectronics devices. With the down-sizing, thinning and high I/O (input/output) of IC chips, microelectronics packaging is now facing a big technology challenge.

  8. Photolithography and Micro-Fabrication/ Packaging Laboratories

    Data.gov (United States)

    Federal Laboratory Consortium — The Photolithography and Micro-Fabrication/Packaging laboratories provide research level semiconductor processing equipment and facilities that do not require a full...

  9. Polymer Composites for Intelligent Food Packaging

    Science.gov (United States)

    He, Jiating; Yap, Ray Chin Chong; Wong, Siew Yee; Li, Xu

    2015-09-01

    Over the last 50 years, remarkable improvements in mechanical and barrier properties of polymer composites have been realized. Their improved properties have been widely studied and employed for food packaging to keep food fresh, clean and suitable for consumption over sufficiently long storage period. In this paper, the current progress of science and technology development of polymer composites for intelligent food packaging will be highlighted. Future directions and perspectives for exploring polymer composites for intelligent food packaging to reveal freshness and quality of food packaged will also be put forward.

  10. Best Practice in Policy Package Design

    DEFF Research Database (Denmark)

    Kessler, Florian; Vesela, Jirina; Vencl, Vaclav

    2010-01-01

    This deliverable focuses on the identification and analysis of best practice examples of policy package design. For this purpose a methodology is developed that allows the systematic analysis of both national and EU policy packages. Eight packages were selected and analysed, highlighting...... the factors which supported the design and implementation process in each case. The results of the analysis show which factors led to these cases to be considered best practice. In addition, factors are identified which are not yet part of the generic policy packaging framework presented in earlier OPTIC...

  11. actuar: An R Package for Actuarial Science

    Directory of Open Access Journals (Sweden)

    Christophe Dutang

    2008-02-01

    Full Text Available actuar is a package providing additional Actuarial Science functionality to the R statistical system. The project was launched in 2005 and the package is available on the Comprehensive R Archive Network since February 2006. The current version of the package contains functions for use in the fields of loss distributions modeling, risk theory (including ruin theory, simulation of compound hierarchical models and credibility theory. This paper presents in detail but with few technical terms the most recent version of the package.

  12. Hermetic Packages For Millimeter-Wave Circuits

    Science.gov (United States)

    Herman, Martin I.; Lee, Karen A.; Lowry, Lynn E.; Carpenter, Alain; Wamhof, Paul

    1994-01-01

    Advanced hermetic packages developed to house electronic circuits operating at frequencies from 1 to 100 gigahertz and beyond. Signals coupled into and out of packages electromagnetically. Provides circuit packages small, lightweight, rugged, and inexpensive in mass production. Packages embedded in planar microstrip and coplanar waveguide circuits, in waveguide-to-planar and planar-to-waveguide circuitry, in waveguide-to-waveguide circuitry, between radiating (antenna) elements, and between planar transmission lines and radiating elements. Other applications in automotive, communication, radar, remote sensing, and biomedical electronic systems foreseen.

  13. Yucca Mountain Waste Package Closure System

    Energy Technology Data Exchange (ETDEWEB)

    shelton-davis; Colleen Shelton-Davis; Greg Housley

    2005-10-01

    The current disposal path for high-level waste is to place the material into secure waste packages that are inserted into a repository. The Idaho National Laboratory has been tasked with the development, design, and demonstration of the waste package closure system for the repository project. The closure system design includes welding three lids and a purge port cap, four methods of nondestructive examination, and evacuation and backfill of the waste package, all performed in a remote environment. A demonstration of the closure system will be performed with a full-scale waste package.

  14. Yucca Mountain Waste Package Closure System

    Energy Technology Data Exchange (ETDEWEB)

    Herschel Smartt; Arthur Watkins; David Pace; Rodney Bitsoi; Eric Larsen; Timothy McJunkin; Charles Tolle

    2006-04-01

    The current disposal path for high-level waste is to place the material into secure waste packages that are inserted into a repository. The Idaho National Laboratory has been tasked with the development, design, and demonstration of the waste package closure system for the repository project. The closure system design includes welding three lids and a purge port cap, four methods of nondestructive examination, and evacuation and backfill of the waste package, all performed in a remote environment. A demonstration of the closure system will be performed with a full-scale waste package.

  15. Simulation and Training Package on Corex Process

    Institute of Scientific and Technical Information of China (English)

    2002-01-01

    A software package has been developed for simulation on the Corex process. The simulation and training package on the process of shaft furnace using Corex off gas were introduced. The package consists of three main modules, namely the numerical simulation, the system modeling and optimization, and the training module, which are integrated with graphical interfaces. In addition, the equipment starting and stopping operation and typical trouble-shooting were also included in the package, whereby a practical environment can be established for training of operation and management stuff.

  16. Raman lasing and Fano lineshapes in a packaged fiber-coupled whispering-gallerymode microresonator

    CERN Document Server

    Zhao, Guangming; Wang, Tao; Xu, Linhua; Long, Gui-lu; Yang, Lan

    2016-01-01

    We report Raman lasing and the optical analog of electromagnetically-induced-transparency (EIT) in a whispering-gallerymode (WGM) microtoroid resonator embedded in a low refractive index polymer matrix together with a tapered fiber coupler. The Raman laser supports both single and multimode operation with low power thresholds. Observations of Fano and EIT-like pheonomena in a packaged microresonator will enable high resolution sensors and can be used in networks where slow light process is needed. These results open the way for portable, robust, and stable WGM microlasers and laserbased sensors for applications in various environments.

  17. Evaluation of the prototype dual-axis wall attitude measurement sensor

    Science.gov (United States)

    Wong, Douglas T.

    1994-01-01

    A prototype dual-axis electrolytic tilt sensor package for angular position measurements was built and evaluated in a laboratory environment. The objective was to investigate the use of this package for making wind tunnel wall attitude measurements for the National Transonic Facility (NTF) at NASA Langley Research Center (LaRC). The instrumentation may replace an existing, more costly, and less rugged servo accelerometer package (angle-of-attack package) currently in use. The dual-axis electrolytic tilt sensor package contains two commercial electrolytic tilt sensors thermally insulated with NTF foam, all housed within a stainless steel package. The package is actively heated and maintained at 160 F using foil heating elements. The laboratory evaluation consisted of a series of tests to characterize the linearity, repeatability, cross-axis interaction, lead wire effect, step response, thermal time constant, and rectification errors. Tests revealed that the total RMS errors for the x-axis sensor is 0.084 degree, and 0.182 degree for the y-axis sensor. The RMS errors are greater than the 0.01 degree specification required for NTF wall attitude measurements. It is therefore not a viable replacement for the angle-of-attack package in the NTF application. However, with some physical modifications, it can be used as an inexpensive 5-degree range dual-axis inclinometer with overall accuracy approaching 0.01 degree under less harsh environments. Also, the data obtained from the tests can be valuable for wind tunnel applications of most types of electrolytic tilt sensors.

  18. Packaging and Embedded Electronics for the Next Generation

    Science.gov (United States)

    Sampson, Michael J.

    2010-01-01

    This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.

  19. Vision Based Navigation Sensors for Spacecraft Rendezvous and Docking

    DEFF Research Database (Denmark)

    Benn, Mathias

    is a technological demonstration mission, where all aspects of space rendezvous and docking to both a cooperative and a non-cooperative target is researched, with the use of novel methods, instruments and technologies. Amongst other equipment, DTU has delivered a vision based sensor package to the Main spacecraft...

  20. PRIDE Surveillance Projects Data Packaging Project Information Package Specification Version 1.1

    Energy Technology Data Exchange (ETDEWEB)

    Kelleher, D. M.; Shipp, R. L.; Mason, J. D.

    2010-08-31

    Information Package Specification version 1.1 describes an XML document format called an information package that can be used to store information in information management systems and other information archives. An information package consists of package information, the context required to understand and use that information, package metadata that describes the information, and XML signatures that protect the information. The information package described in this specification was designed to store Department of Energy (DOE) and National Nuclear Security Administration (NNSA) information and includes the metadata required for that information: a unique package identifier, information marking that conforms to DOE and NNSA requirements, and access control metadata. It is an implementation of the Open Archival Information System (OAIS) Reference Model archival information package tailored to meet NNSA information storage requirements and designed to be used in the computing environments at the Y-12 National Security Complex and at other NNSA sites.

  1. Packaging performance evaluation and performance oriented packaging standards for large packages for poison inhalation hazard materials

    Energy Technology Data Exchange (ETDEWEB)

    Griego, N.R.; Mills, G.S.; McClure, J.D. [and others

    1997-07-01

    The U.S. Department of Transportation Research & Special Programs Administration (DOT-RSPA) has sponsored a project at Sandia National Laboratories to evaluate the protection provided by current packagings used for truck and rail transport of materials that have been classified as Poison Inhalation Hazards (PIH) and to recommend performance standards for these PIH packagings. Hazardous materials span a wide range of toxicity and there are many parameters used to characterize toxicity; for any given hazardous material, data are not available for all of the possible toxicity parameters. Therefore, it was necessary to select a toxicity criterion to characterize all of the PIH compounds (a value of the criterion was derived from other parameters in many cases) and to calculate their dispersion in the event of a release resulting from a transportation accident. Methodologies which account for material toxicity and dispersal characteristics were developed as a major portion of this project and applied to 72 PIH materials. This report presents details of the PIH material toxicity comparisons, calculation of their dispersion, and their classification into five severity categories. 16 refs., 5 figs., 7 tabs.

  2. Thermal flow micro sensors

    OpenAIRE

    Elwenspoek, M.

    1999-01-01

    A review is given on sensors fabricated by silicon micromachining technology using the thermal domain for the measurement of fluid flow. Attention is paid especially to performance and geometry of the sensors. Three basic types of thermal flow sensors are discussed: anemometers, calorimetric flow sensors and time of flight flow sensors. Anemometers may comprise several heaters and temperature sensors and from a geometric point of view are similar sometimes for calorimetric flow sensors. We fi...

  3. Fiber Bragg gratings strain measuring system and a sensor calibration setup based on mechanical nanomotion transducer

    Science.gov (United States)

    Lazarev, Vladimir A.; Leonov, Stanislav O.; Tarabrin, Mikhail K.; Karasik, Valerii E.

    2017-06-01

    Fiber Bragg grating (FBG) strain sensors are powerful tools for structural health monitoring applications. However, FBG sensor fabrication and packaging processes can lead to a non-linear behavior, that affects the accuracy of the strain measurements. Here we present a novel nondestructive calibration technique for FBG strain sensors that use a mechanical nanomotion transducer. A customized calibration setup was designed based on dovetail-type slideways that were mechanized using a stepping motor. The performance of the FBG strain sensor was investigated through analysis of experimental data, and the calibration curves for the FBG strain sensor are presented.

  4. Integration of a Miniaturized Conductivity Sensor into an Animal-Borne Instrument

    Science.gov (United States)

    2015-09-30

    1 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. Integration of a Miniaturized Conductivity Sensor into...Kingdom phone: +44 1334-462677 fax: +44 1334-463443 email: lb284@st-andrews.ac.uk Robin Pascal Sensors Development Group National...borne instruments delivering temperature and/or salinity measurements from remote regions are highly accurate, but sensor and data relay packages

  5. Antimicrobial seafood packaging: a review.

    Science.gov (United States)

    Singh, Suman; Ho Lee, Myung; Park, Lnsik; Shin, Yangjai; Lee, Youn Suk

    2016-06-01

    Microorganisms are the major cause of spoilage in most seafood products; however, only few microbes, called the specific spoilage organisms (SSOs), contribute to the offensive off-flavors associated with seafood spoilage. In food, microbial degradation manifests itself as spoilage, or changes in the sensory properties of a food product, rendering it unsuitable for human consumption. The use of antimicrobial substances can control the general microflora as well as specific microorganisms related to spoilage to provide products with higher safety and better quality. Many antimicrobial compounds have been evaluated in film structures for use in seafood, especially organic acids and their salts, enzymes, bacteriocins; some studies have considered inorganic compounds such as AgSiO2, zinc oxide, silver zeolite, and titanium oxide. The characteristics of some organic antimicrobial packaging systems for seafood and their antimicrobial efficiency in film structures are reviewed in this article.

  6. Irradiated integrated circuits dose-attenuation mapping using optically stimulated phosphors for packaging dosimetry

    Energy Technology Data Exchange (ETDEWEB)

    Dusseau, L.; Polge, G.; Albert, L.; Magnac, Y.; Fesquet, J.; Gasiot, J. [Univ. Montpellier II (France); Bessiere, J.C. [CORAD P.I.T. Pompignane, Montpellier (France)

    1998-12-01

    The feasibility of a dose mapping system using Optically Stimulated Luminescent (OSL) Phosphors is demonstrated. The OSL technique is briefly reviewed as well as its interest for calculation codes calibration. The sensors and the reading apparatus are presented. An example of attenuation dose map obtained for a Dual In Line Plastic Package (DIL) is given and the results compared to calculations with the code EGS4 PRESTA. Results obtained by experiment and simulation are discussed as well as the potentialities of the method.

  7. Nanotechnology: An Untapped Resource for Food Packaging

    Directory of Open Access Journals (Sweden)

    Chetan Sharma

    2017-09-01

    Full Text Available Food commodities are packaged and hygienically transported to protect and preserve them from any un-acceptable alteration in quality, before reaching the end-consumer. Food packaging continues to evolve along-with the innovations in material science and technology, as well as in light of consumer's demand. Presently, the modern consumers of competitive economies demands for food with natural quality, assured safety, minimal processing, extended shelf-life and ready-to-eat concept. Innovative packaging systems, not only ascertains transit preservation and effective distribution, but also facilitates communication at the consumer levels. The technological advances in the domain of food packaging in twenty-first century are mainly chaired by nanotechnology, the science of nano-materials. Nanotechnology manipulates and creates nanometer scale materials, of commercial and scientific relevance. Introduction of nanotechnology in food packaging sector has significantly addressed the food quality, safety and stability concerns. Besides, nanotechnology based packaging intimate's consumers about the real time quality of food product. Additionally, nanotechnology has been explored for controlled release of preservatives/antimicrobials, extending the product shelf life within the package. The promising reports for nanotechnology interventions in food packaging have established this as an independent priority research area. Nanoparticles based food packages offer improved barrier and mechanical properties, along with food preservation and have gained welcoming response from market and end users. In contrary, recent advances and up-liftment in this area have raised various ethical, environmental and safety concerns. Policies and regulation regarding nanoparticles incorporation in food packaging are being reviewed. This review presents the existing knowledge, recent advances, concerns and future applications of nanotechnology in food packaging sector.

  8. The Sandia MEMS passive shock sensor : FY07 maturation activities.

    Energy Technology Data Exchange (ETDEWEB)

    Houston, Jack E.; Blecke, Jill; Mitchell, John Anthony; Wittwer, Jonathan W.; Crowson, Douglas A.; Clemens, Rebecca C.; Walraven, Jeremy Allen; Epp, David S.; Baker, Michael Sean

    2008-08-01

    This report describes activities conducted in FY07 to mature the MEMS passive shock sensor. The first chapter of the report provides motivation and background on activities that are described in detail in later chapters. The second chapter discusses concepts that are important for integrating the MEMS passive shock sensor into a system. Following these two introductory chapters, the report details modeling and design efforts, packaging, failure analysis and testing and validation. At the end of FY07, the MEMS passive shock sensor was at TRL 4.

  9. 49 CFR 173.24a - Additional general requirements for non-bulk packagings and packages.

    Science.gov (United States)

    2010-10-01

    ... subchapter. (b) Non-bulk packaging filling limits. (1) A single or composite non-bulk packaging may be filled... material may remain on the outside of a package after filling. (c) Mixed contents. (1) An outer non-bulk... PIPELINE AND HAZARDOUS MATERIALS SAFETY ADMINISTRATION, DEPARTMENT OF TRANSPORTATION HAZARDOUS...

  10. Healthy package, healthy product? Effects of packaging design as a function of purchase setting

    NARCIS (Netherlands)

    van Rompay, Thomas Johannes Lucas; Deterink, Florien; Fenko, Anna

    2016-01-01

    Inspired by research testifying to the influence of visual packaging appearance and meaning portrayal on food evaluation, here it is argued that effects of packaging design vary depending on purchase context. Realistic packaging variants for a fictitious yoghurt brand varying in health connotation

  11. K Basin sludge packaging design criteria (PDC) and safety analysis report for packaging (SARP) approval plan

    Energy Technology Data Exchange (ETDEWEB)

    Brisbin, S.A.

    1996-03-06

    This document delineates the plan for preparation, review, and approval of the Packaging Design Crieteria for the K Basin Sludge Transportation System and the Associated on-site Safety Analysis Report for Packaging. The transportation system addressed in the subject documents will be used to transport sludge from the K Basins using bulk packaging.

  12. Child-resistant and tamper-resistant packaging: A systematic review to inform tobacco packaging regulation.

    Science.gov (United States)

    Jo, Catherine L; Ambs, Anita; Dresler, Carolyn M; Backinger, Cathy L

    2017-02-01

    We aimed to investigate the effects of special packaging (child-resistant, adult-friendly) and tamper-resistant packaging on health and behavioral outcomes in order to identify research gaps and implications for packaging standards for tobacco products. We searched seven databases for keywords related to special and tamper-resistant packaging, consulted experts, and reviewed citations of potentially relevant studies. 733 unique papers were identified. Two coders independently screened each title and abstract for eligibility. They then reviewed the full text of the remaining papers for a second round of eligibility screening. Included studies investigated a causal relationship between type of packaging or packaging regulation and behavioral or health outcomes and had a study population composed of consumers. Studies were excluded on the basis of publication type, if they were not peer-reviewed, and if they had low external validity. Two reviewers independently coded each paper for study and methodological characteristics and limitations. Discrepancies were discussed and resolved. The review included eight studies: four assessing people's ability to access the contents of different packaging types and four evaluating the impact of packaging requirements on health-related outcomes. Child-resistant packaging was generally more difficult to open than non-child-resistant packaging. Child-resistant packaging requirements have been associated with reductions in child mortality. Child-resistant packaging holds the expectation to reduce tobacco product poisonings among children under six. Published by Elsevier Inc.

  13. 49 CFR 173.40 - General packaging requirements for toxic materials packaged in cylinders.

    Science.gov (United States)

    2010-10-01

    ... concrete or steel, impacting at an orientation most likely to cause damage. “Deformation”means a cylinder... packaged in cylinders. 173.40 Section 173.40 Transportation Other Regulations Relating to Transportation... Transportation § 173.40 General packaging requirements for toxic materials packaged in cylinders. When this...

  14. Modular optimization code package: MOZAIK

    Science.gov (United States)

    Bekar, Kursat B.

    This dissertation addresses the development of a modular optimization code package, MOZAIK, for geometric shape optimization problems in nuclear engineering applications. MOZAIK's first mission, determining the optimal shape of the D2O moderator tank for the current and new beam tube configurations for the Penn State Breazeale Reactor's (PSBR) beam port facility, is used to demonstrate its capabilities and test its performance. MOZAIK was designed as a modular optimization sequence including three primary independent modules: the initializer, the physics and the optimizer, each having a specific task. By using fixed interface blocks among the modules, the code attains its two most important characteristics: generic form and modularity. The benefit of this modular structure is that the contents of the modules can be switched depending on the requirements of accuracy, computational efficiency, or compatibility with the other modules. Oak Ridge National Laboratory's discrete ordinates transport code TORT was selected as the transport solver in the physics module of MOZAIK, and two different optimizers, Min-max and Genetic Algorithms (GA), were implemented in the optimizer module of the code package. A distributed memory parallelism was also applied to MOZAIK via MPI (Message Passing Interface) to execute the physics module concurrently on a number of processors for various states in the same search. Moreover, dynamic scheduling was enabled to enhance load balance among the processors while running MOZAIK's physics module thus improving the parallel speedup and efficiency. In this way, the total computation time consumed by the physics module is reduced by a factor close to M, where M is the number of processors. This capability also encourages the use of MOZAIK for shape optimization problems in nuclear applications because many traditional codes related to radiation transport do not have parallel execution capability. A set of computational models based on the

  15. Software structure for broadband wireless sensor network system

    Science.gov (United States)

    Kwon, Hyeokjun; Oh, Sechang; Yoon, Hargsoon; Varadan, Vijay K.

    2010-04-01

    Zigbee Sensor Network system has been investigating for monitoring and analyzing the data measured from a lot of sensors because the Zigbee Sensor Network has several advantages of low power consumption, compact size, and multi-node connection. However, it has a disadvantage not to be able to monitor the data measured from sensors at the remote area such as other room that is located at other city. This paper describes the software structure to compensate the defect with combining the Zigbee Sensor Network and wireless LAN technology for remote monitoring of measured sensor data. The software structure has both benefits of Zigbee Sensor Network and the advantage of wireless LAN. The software structure has three main software structures. The first software structure consists of the function in order to acquire the data from sensors and the second software structure is to gather the sensor data through wireless Zigbee and to send the data to Monitoring system by using wireless LAN. The second part consists of Linux packages software based on 2440 CPU (Samsung corp.), which has ARM9 core. The Linux packages include bootloader, device drivers, kernel, and applications, and the applications are TCP/IP server program, the program interfacing with Zigbee RF module, and wireless LAN program. The last part of software structure is to receive the sensor data through TCP/IP client program from Wireless Gate Unit and to display graphically measured data by using MATLAB program; the sensor data is measured on 100Hz sampling rate and the measured data has 10bit data resolution. The wireless data transmission rate per each channel is 1.6kbps.

  16. Hydrogen sensor

    Science.gov (United States)

    Duan, Yixiang; Jia, Quanxi; Cao, Wenqing

    2010-11-23

    A hydrogen sensor for detecting/quantitating hydrogen and hydrogen isotopes includes a sampling line and a microplasma generator that excites hydrogen from a gas sample and produces light emission from excited hydrogen. A power supply provides power to the microplasma generator, and a spectrometer generates an emission spectrum from the light emission. A programmable computer is adapted for determining whether or not the gas sample includes hydrogen, and for quantitating the amount of hydrogen and/or hydrogen isotopes are present in the gas sample.

  17. Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

    Science.gov (United States)

    Ramesham, Rajeshuni

    2000-01-01

    Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS

  18. Fiber Bragg grating sensors: a market overview

    Science.gov (United States)

    Méndez, A.

    2007-07-01

    Over the last few years, optical fiber sensors have seen increased acceptance and widespread use. Among the multitude of sensor types, FBG based sensors, more than any other particular sensor type, have become widely known and popular. Given their intrinsic capability to measure a multitude of parameters such as strain, temperature, pressure, chemical and biological agents - and many others - coupled with their flexibility of design to be used as single point or multi-point sensing arrays and their relative low cost, make of FBGs ideal devices to be adopted for a multitude of different sensing applications and implemented in different fields and industries. However, some technical hurdles and market barriers need to be overcome in order for this technology - and fiber sensors in general - to gain more commercial momentum and achieve faster market growth such as the need for industry standards on FBGs and FBG-based sensors, adequate packaging designs, as well as training and education of prospective customers and end-users.

  19. Heavy metals in packaging : a literature survey

    NARCIS (Netherlands)

    van Putten EM; IMG

    2011-01-01

    The use of the heavy metals cadmium, mercury, chromium and lead in packaging is forbidden internationally for some years because these substances are harmful to the environment. In 2002 the Dutch national Inspectorate for the Environment determined the presence of heavy metals in packaging for consu

  20. 40 CFR 262.30 - Packaging.

    Science.gov (United States)

    2010-07-01

    ... under 49 CFR parts 173, 178, and 179. ... 40 Protection of Environment 25 2010-07-01 2010-07-01 false Packaging. 262.30 Section 262.30... APPLICABLE TO GENERATORS OF HAZARDOUS WASTE Pre-Transport Requirements § 262.30 Packaging....

  1. Developing a Package Training System for Industry

    Science.gov (United States)

    Battersby, D. L. N.

    1974-01-01

    The hotel and catering industry is one of Great Britain's largest. A packaged training system has been developed to satisfy the needs of this industry, an ever-growing occupational field with multiple categories. The material provided in each package outlines short pieces of instruction and helps the trainer create appropriate training. (DS)

  2. Fiberboard Humidity Data for 9975 Shipping Packages

    Energy Technology Data Exchange (ETDEWEB)

    Daugherty, W. [Savannah River Site (SRS), Aiken, SC (United States)

    2015-07-31

    The 9975 surveillance program is identifying a technical basis to support extending the storage period of 9975 packages in KAC beyond the currently approved 15 years. A key element of this effort is developing a better understanding of degradation of the fiberboard assembly under storage conditions. This degradation is influenced greatly by the moisture content of the fiberboard, which is not well characterized on an individual package basis. Two efforts have been undertaken to better understand the levels and behavior of moisture within the fiberboard assemblies of the 9975 shipping package. In the first effort, an initial survey of humidity and temperature in the upper air space of 26 packages stored in KAC was made. The data collected within this first effort help to illustrate how the upper air space humidity varies with the local ambient temperature and package heat load. In the second effort, direct measurements of two test packages are providing a correlation between humidity and fiberboard moisture levels within the package, and variations in moisture throughout the fiberboard assembly. This effort has examined packages with cane fiberboard and internal heat levels of 5 and 10W to date. Additional testing is expected to include 15 and 19W heat levels, and then repeat the same four heat levels with softwood fiberboard assemblies. This report documents the data collected to date within these two efforts

  3. Fiberboard humidity data for 9975 shipping packages

    Energy Technology Data Exchange (ETDEWEB)

    Daugherty, W. L. [Savannah River Site (SRS), Aiken, SC (United States). Savannah River National Lab. (SRNL)

    2015-07-31

    The 9975 surveillance program is identifying a technical basis to support extending the storage period of 9975 packages in KAC beyond the currently approved 15 years. A key element of this effort is developing a better understanding of degradation of the fiberboard assembly under storage conditions. This degradation is influenced greatly by the moisture content of the fiberboard, which is not well characterized on an individual package basis.Two efforts have been undertaken to better understand the levels and behavior of moisture within the fiberboard assemblies of the 9975 shipping package. In the first effort, an initial survey of humidity and temperature in the upper air space of 26 packages stored in KAC was made. The data collected within this first effort help to illustrate how the upper air space humidity varies with the local ambient temperature and package heat load. In the second effort, direct measurements of two test packages are providing a correlation between humidity and fiberboard moisture levels within the package, and variations in moisture throughout the fiberboard assembly. This effort has examined packages with cane fiberboard and internal heat levels of 5 and 10W to date. Additional testing is expected to include 15 and 19W heat levels, and then repeat the same four heat levels with softwood fiberboard assemblies. This report documents the data collected to date within these two efforts.

  4. Cigarette package design: opportunities for disease prevention

    Science.gov (United States)

    DiFranza, JR; Clark, DM; Pollay, RW

    2003-01-01

    Objective To learn how cigarette packages are designed and to determine to what extent cigarette packages are designed to target children. Methods A computer search was made of all Internet websites that post tobacco industry documents using the search terms: packaging, package design, package study, box design, logo, trademark and design study. All documents were retrieved electronically and analyzed by the first author for recurrent themes. Data Synthesis Cigarette manufacturers devote a great deal of attention and expense to package design because it is central to their efforts to create brand images. Colors, graphic elements, proportioning, texture, materials and typography are tested and used in various combinations to create the desired product and user images. Designs help to create the perceived product attributes and project a personality image of the user with the intent of fulfilling the psychological needs of the targeted type of smoker. The communication of these images and attributes is conducted through conscious and subliminal processes. Extensive testing is conducted using a variety of qualitative and quantitative research techniques. Conclusion The promotion of tobacco products through appealing imagery cannot be stopped without regulating the package design. The same marketing research techniques used by the tobacco companies can be used to design generic packaging and more effective warning labels targeted at specific consumers.

  5. Long-term value of packaging design

    Institute of Scientific and Technical Information of China (English)

    王中琼

    2014-01-01

    In science and technology more and more developed today, all the things around us are changing with each passing day. Now as the packaging design is a comprehensive discipline, for example, is to give new meaning. How to make its value is permanent? We raise these issues reflects the development trend of packaging design.

  6. Cigarette package design: opportunities for disease prevention

    Directory of Open Access Journals (Sweden)

    Pollay RW

    2003-01-01

    Full Text Available Abstract Objective To learn how cigarette packages are designed and to determine to what extent cigarette packages are designed to target children. Methods A computer search was made of all Internet websites that post tobacco industry documents using the search terms: packaging, package design, package study, box design, logo, trademark and design study. All documents were retrieved electronically and analyzed by the first author for recurrent themes. Data Synthesis Cigarette manufacturers devote a great deal of attention and expense to package design because it is central to their efforts to create brand images. Colors, graphic elements, proportioning, texture, materials and typography are tested and used in various combinations to create the desired product and user images. Designs help to create the perceived product attributes and project a personality image of the user with the intent of fulfilling the psychological needs of the targeted type of smoker. The communication of these images and attributes is conducted through conscious and subliminal processes. Extensive testing is conducted using a variety of qualitative and quantitative research techniques. Conclusion The promotion of tobacco products through appealing imagery cannot be stopped without regulating the package design. The same marketing research techniques used by the tobacco companies can be used to design generic packaging and more effective warning labels targeted at specific consumers.

  7. The power of symbolic packaging cues

    NARCIS (Netherlands)

    van Ooijen, I.; Verlegh, P.; Voorveld, H.; Eisend, M.

    2016-01-01

    Packaging can be considered as an element of communication in the marketplace. By communicating through packaging, marketers are able to appeal to consumers at the most crucial moment in the consumer decision journey: the point of sale. At the point of sale, consumers are able to consider the purcha

  8. Comparison of TAPS Packages for Engineering

    Science.gov (United States)

    Sidhu, S. Manjit

    2008-01-01

    Purpose: This paper aims to present the development of technology-assisted problem solving (TAPS) packages at University Tenaga Nasional (UNITEN). The project is the further work of the development of interactive multimedia based packages targeted for students having problems in understanding the subject of engineering mechanics dynamics.…

  9. A Thermodynamics Course Package in Onenote

    Science.gov (United States)

    Falconer, John L.; Nicodemus, Garret D.; Medlin, J. Will; deGrazia, Janet; McDanel, Katherine P.

    2014-01-01

    A ready-to-use package of active-learning materials for a semester-long chemical engineering thermodynamics course was prepared for instructors, and similar materials are being prepared for a material and energy balance course. The course package includes ConcepTests, explanations of the ConcepTests for instructors, links to screencasts, chapter…

  10. Fiberboard humidity data for 9975 shipping packages

    Energy Technology Data Exchange (ETDEWEB)

    Daugherty, W. L. [Savannah River Site (SRS), Aiken, SC (United States). Savannah River National Lab. (SRNL)

    2015-07-31

    The 9975 surveillance program is identifying a technical basis to support extending the storage period of 9975 packages in KAC beyond the currently approved 15 years. A key element of this effort is developing a better understanding of degradation of the fiberboard assembly under storage conditions. This degradation is influenced greatly by the moisture content of the fiberboard, which is not well characterized on an individual package basis.Two efforts have been undertaken to better understand the levels and behavior of moisture within the fiberboard assemblies of the 9975 shipping package. In the first effort, an initial survey of humidity and temperature in the upper air space of 26 packages stored in KAC was made. The data collected within this first effort help to illustrate how the upper air space humidity varies with the local ambient temperature and package heat load. In the second effort, direct measurements of two test packages are providing a correlation between humidity and fiberboard moisture levels within the package, and variations in moisture throughout the fiberboard assembly. This effort has examined packages with cane fiberboard and internal heat levels of 5 and 10W to date. Additional testing is expected to include 15 and 19W heat levels, and then repeat the same four heat levels with softwood fiberboard assemblies. This report documents the data collected to date within these two efforts.

  11. The Surgical Scrub. Learning Activity Package.

    Science.gov (United States)

    Runge, Lillian

    This learning activity package on the surgical scrub is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, a list of definitions, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These…

  12. Cigarette package design: opportunities for disease prevention

    Science.gov (United States)

    DiFranza, JR; Clark, DM; Pollay, RW

    2003-01-01

    Objective To learn how cigarette packages are designed and to determine to what extent cigarette packages are designed to target children. Methods A computer search was made of all Internet websites that post tobacco industry documents using the search terms: packaging, package design, package study, box design, logo, trademark and design study. All documents were retrieved electronically and analyzed by the first author for recurrent themes. Data Synthesis Cigarette manufacturers devote a great deal of attention and expense to package design because it is central to their efforts to create brand images. Colors, graphic elements, proportioning, texture, materials and typography are tested and used in various combinations to create the desired product and user images. Designs help to create the perceived product attributes and project a personality image of the user with the intent of fulfilling the psychological needs of the targeted type of smoker. The communication of these images and attributes is conducted through conscious and subliminal processes. Extensive testing is conducted using a variety of qualitative and quantitative research techniques. Conclusion The promotion of tobacco products through appealing imagery cannot be stopped without regulating the package design. The same marketing research techniques used by the tobacco companies can be used to design generic packaging and more effective warning labels targeted at specific consumers. PMID:19570250

  13. Performing Remarkable Feats with Presentation Graphics Packages.

    Science.gov (United States)

    Ekhaml, Leticia

    1994-01-01

    Describes easy-to-use, easy-to-learn dedicated graphics packages for developing slide presentations shown directly from computers. A general description of the features of five packages and suggestions for software selection are provided. A sidebar provides graphics tips, such as the use of color, typefaces, and formatting, for developing…

  14. Cigarette package design: opportunities for disease prevention.

    Science.gov (United States)

    Difranza, J R; Clark, D M; Pollay, R W

    2002-06-15

    To learn how cigarette packages are designed and to determine to what extent cigarette packages are designed to target children. A computer search was made of all Internet websites that post tobacco industry documents using the search terms: packaging, package design, package study, box design, logo, trademark and design study. All documents were retrieved electronically and analyzed by the first author for recurrent themes. Cigarette manufacturers devote a great deal of attention and expense to package design because it is central to their efforts to create brand images. Colors, graphic elements, proportioning, texture, materials and typography are tested and used in various combinations to create the desired product and user images. Designs help to create the perceived product attributes and project a personality image of the user with the intent of fulfilling the psychological needs of the targeted type of smoker. The communication of these images and attributes is conducted through conscious and subliminal processes. Extensive testing is conducted using a variety of qualitative and quantitative research techniques. The promotion of tobacco products through appealing imagery cannot be stopped without regulating the package design. The same marketing research techniques used by the tobacco companies can be used to design generic packaging and more effective warning labels targeted at specific consumers.

  15. Package Formats for Preserved Digital Material

    DEFF Research Database (Denmark)

    Zierau, Eld

    2012-01-01

    This paper presents an investigation of the best suitable package formats for long term digital preservation. The choice of a package format for preservation is crucial for future access, thus a thorough analysis of choice is important. The investigation presented here covers setting up requireme...

  16. 7 CFR 29.6030 - Package.

    Science.gov (United States)

    2010-01-01

    ... 7 Agriculture 2 2010-01-01 2010-01-01 false Package. 29.6030 Section 29.6030 Agriculture Regulations of the Department of Agriculture AGRICULTURAL MARKETING SERVICE (Standards, Inspections, Marketing... INSPECTION Standards Definitions § 29.6030 Package. A hogshead, tierce, case, bale, or other...

  17. 7 CFR 29.30 - Package.

    Science.gov (United States)

    2010-01-01

    ... 7 Agriculture 2 2010-01-01 2010-01-01 false Package. 29.30 Section 29.30 Agriculture Regulations of the Department of Agriculture AGRICULTURAL MARKETING SERVICE (Standards, Inspections, Marketing... INSPECTION Regulations Definitions § 29.30 Package. A hogshead, tierce, case, bale, or other...

  18. A Thermodynamics Course Package in Onenote

    Science.gov (United States)

    Falconer, John L.; Nicodemus, Garret D.; Medlin, J. Will; deGrazia, Janet; McDanel, Katherine P.

    2014-01-01

    A ready-to-use package of active-learning materials for a semester-long chemical engineering thermodynamics course was prepared for instructors, and similar materials are being prepared for a material and energy balance course. The course package includes ConcepTests, explanations of the ConcepTests for instructors, links to screencasts, chapter…

  19. An expression analysis package for REDUCE

    NARCIS (Netherlands)

    van Hulzen, J.A.; Hulshof, B.J.A.

    1982-01-01

    An expression analysis package for REDUCE 2 is presented. This package, completely written in Standard LISP, can be considered as an extension of the algebraic mode. It allows to interactively dismantled and/or modify the last output expression as it is desplayed or printed. An interface with the

  20. MGtoolkit: A python package for implementing metagraphs

    Science.gov (United States)

    Ranathunga, D.; Nguyen, H.; Roughan, M.

    In this paper we present MGtoolkit : an open-source Python package for implementing metagraphs - a first of its kind. Metagraphs are commonly used to specify and analyse business and computer-network policies alike. MGtoolkit can help verify such policies and promotes learning and experimentation with metagraphs. The package currently provides purely textual output for visualising metagraphs and their analysis results.