Advanced Packaging Technology Used in Fabricating a High-Temperature Silicon Carbide Pressure Sensor

Science.gov (United States)

Beheim, Glenn M.

2003-01-01

The development of new aircraft engines requires the measurement of pressures in hot areas such as the combustor and the final stages of the compressor. The needs of the aircraft engine industry are not fully met by commercially available high-temperature pressure sensors, which are fabricated using silicon. Kulite Semiconductor Products and the NASA Glenn Research Center have been working together to develop silicon carbide (SiC) pressure sensors for use at high temperatures. At temperatures above 850 F, silicon begins to lose its nearly ideal elastic properties, so the output of a silicon pressure sensor will drift. SiC, however, maintains its nearly ideal mechanical properties to extremely high temperatures. Given a suitable sensor material, a key to the development of a practical high-temperature pressure sensor is the package. A SiC pressure sensor capable of operating at 930 F was fabricated using a newly developed package. The durability of this sensor was demonstrated in an on-engine test. The SiC pressure sensor uses a SiC diaphragm, which is fabricated using deep reactive ion etching. SiC strain gauges on the surface of the diaphragm sense the pressure difference across the diaphragm. Conventionally, the SiC chip is mounted to the package with the strain gauges outward, which exposes the sensitive metal contacts on the chip to the hostile measurement environment. In the new Kulite leadless package, the SiC chip is flipped over so that the metal contacts are protected from oxidation by a hermetic seal around the perimeter of the chip. In the leadless package, a conductive glass provides the electrical connection between the pins of the package and the chip, which eliminates the fragile gold wires used previously. The durability of the leadless SiC pressure sensor was demonstrated when two 930 F sensors were tested in the combustor of a Pratt & Whitney PW4000 series engine. Since the gas temperatures in these locations reach 1200 to 1300 F, the sensors were

An Universal packaging technique for low-drift implantable pressure sensors.

Science.gov (United States)

Kim, Albert; Powell, Charles R; Ziaie, Babak

2016-04-01

Monitoring bodily pressures provide valuable diagnostic and prognostic information. In particular, long-term measurement through implantable sensors is highly desirable in situations where percutaneous access can be complicated or dangerous (e.g., intracranial pressure in hydrocephalic patients). In spite of decades of progress in the fabrication of miniature solid-state pressure sensors, sensor drift has so far severely limited their application in implantable systems. In this paper, we report on a universal packaging technique for reducing the sensor drift. The described method isolates the pressure sensor from a major source of drift, i.e., contact with the aqueous surrounding environment, by encasing the sensor in a silicone-filled medical-grade polyurethane balloon. In-vitro soak tests for 100 days using commercial micromachined piezoresistive pressure sensors demonstrate a stable operation with the output remaining within 1.8 cmH2O (1.3 mmHg) of a reference pressure transducer. Under similar test conditions, a non-isolated sensor fluctuates between 10 and 20 cmH2O (7.4-14.7 mmHg) of the reference, without ever settling to a stable operation regime. Implantation in Ossabow pigs demonstrate the robustness of the package and its in-vivo efficacy in reducing the baseline drift.

ATTIRE (analytical tools for thermal infrared engineering): A sensor simulation and modeling package

Science.gov (United States)

Jaggi, S.

1993-01-01

The Advanced Sensor Development Laboratory (ASDL) at the Stennis Space Center develops, maintains and calibrates remote sensing instruments for the National Aeronautics & Space Administration (NASA). To perform system design trade-offs, analysis, and establish system parameters, ASDL has developed a software package for analytical simulation of sensor systems. This package called 'Analytical Tools for Thermal InfraRed Engineering' - ATTIRE, simulates the various components of a sensor system. The software allows each subsystem of the sensor to be analyzed independently for its performance. These performance parameters are then integrated to obtain system level information such as Signal-to-Noise Ratio (SNR), Noise Equivalent Radiance (NER), Noise Equivalent Temperature Difference (NETD) etc. This paper describes the uses of the package and the physics that were used to derive the performance parameters.

Packaging of silicon sensors for microfluidic bio-analytical applications

International Nuclear Information System (INIS)

Wimberger-Friedl, Reinhold; Prins, Menno; Megens, Mischa; Dittmer, Wendy; Witz, Christiane de; Nellissen, Ton; Weekamp, Wim; Delft, Jan van; Ansems, Will; Iersel, Ben van

2009-01-01

A new industrial concept is presented for packaging biosensor chips in disposable microfluidic cartridges to enable medical diagnostic applications. The inorganic electronic substrates, such as silicon or glass, are integrated in a polymer package which provides the electrical and fluidic interconnections to the world and provides mechanical strength and protection for out-of-lab use. The demonstrated prototype consists of a molded interconnection device (MID), a silicon-based giant magneto-resistive (GMR) biosensor chip, a flex and a polymer fluidic part with integrated tubing. The various processes are compatible with mass manufacturing and run at a high yield. The devices show a reliable electrical interconnection between the sensor chip and readout electronics during extended wet operation. Sandwich immunoassays were carried out in the cartridges with surface functionalized sensor chips. Biological response curves were determined for different concentrations of parathyroid hormone (PTH) on the packaged biosensor, which demonstrates the functionality and biocompatibility of the devices. The new packaging concept provides a platform for easy further integration of electrical and fluidic functions, as for instance required for integrated molecular diagnostic devices in cost-effective mass manufacturing

Advanced Sensor Arrays and Packaging

Energy Technology Data Exchange (ETDEWEB)

Ryter, John Wesley [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Romero, Christopher J. [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Ramaiyan, Kannan [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Brosha, Eric L. [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

2016-08-11

Novel sensor packaging elements were designed, fabricated, and tested in order to facilitate the transition of electrochemical mixed-potential sensors toward commercialization. Of the two designs completed, the first is currently undergoing field trials, taking direct measurements within vehicle exhaust streams, while the second is undergoing preliminary laboratory testing. The sensors’ optimal operating conditions, sensitivity to hydrogen, and long-­term baseline stability were also investigated. The sensing capabilities of lanthanum chromite (La_0.8Sr_0.2CrO₃) and indium-­doped tin oxide (ITO) working electrodes were compared, and the ITO devices were selected for pre-­commercial field trials testing at a hydrogen fuel cell vehicle fueling station in California. Previous data from that fueling station were also analyzed, and the causes of anomalous baseline drift were identified.

A GENERIC PACKAGING TECHNIQUE USING FLUIDIC ISOLATION FOR LOW-DRIFT IMPLANTABLE PRESSURE SENSORS.

Science.gov (United States)

Kim, A; Powell, C R; Ziaie, B

2015-06-01

This paper reports on a generic packaging method for reducing drift in implantable pressure sensors. The described technique uses fluidic isolation by encasing the pressure sensor in a liquid-filled medical-grade polyurethane balloon; thus, isolating it from surrounding aqueous environment that is the major source of baseline drift. In-vitro tests using commercial micromachined piezoresistive pressure sensors show an average baseline drift of 0.006 cmH 2 O/day (0.13 mmHg/month) for over 100 days of saline soak test, as compared to 0.101 cmH 2 O/day (2.23 mmHg/month) for a non-fluidic-isolated one soaked for 18 days. To our knowledge, this is the lowest reported drift for an implantable pressure sensor.

Fire behavior sensor package remote trigger design

Science.gov (United States)

Dan Jimenez; Jason Forthofer; James Reardon; Bret Butler

2007-01-01

Fire behavior characteristics (such as temperature, radiant and total heat flux, 2- and 3-dimensional velocities, and air flow) are extremely difficult to measure insitu. Although insitu sensor packages are capable of such measurements in realtime, it is also essential to acquire video documentation as a means of better understanding the fire behavior data recorded by...

Low temperature co-fired ceramic packaging of CMOS capacitive sensor chip towards cell viability monitoring.

Science.gov (United States)

Halonen, Niina; Kilpijärvi, Joni; Sobocinski, Maciej; Datta-Chaudhuri, Timir; Hassinen, Antti; Prakash, Someshekar B; Möller, Peter; Abshire, Pamela; Kellokumpu, Sakari; Lloyd Spetz, Anita

2016-01-01

Cell viability monitoring is an important part of biosafety evaluation for the detection of toxic effects on cells caused by nanomaterials, preferably by label-free, noninvasive, fast, and cost effective methods. These requirements can be met by monitoring cell viability with a capacitance-sensing integrated circuit (IC) microchip. The capacitance provides a measurement of the surface attachment of adherent cells as an indication of their health status. However, the moist, warm, and corrosive biological environment requires reliable packaging of the sensor chip. In this work, a second generation of low temperature co-fired ceramic (LTCC) technology was combined with flip-chip bonding to provide a durable package compatible with cell culture. The LTCC-packaged sensor chip was integrated with a printed circuit board, data acquisition device, and measurement-controlling software. The packaged sensor chip functioned well in the presence of cell medium and cells, with output voltages depending on the medium above the capacitors. Moreover, the manufacturing of microfluidic channels in the LTCC package was demonstrated.

Systematic study of packaging designs on the performance of CMOS thermoresistive micro calorimetric flow sensors

International Nuclear Information System (INIS)

Xu, Wei; Gao, Bo; Xu, Kun; Lee, Yi-Kuen; Pan, Liang; Chiu, Yi

2017-01-01

We systematically study the effect of two packaging configurations for the CMOS thermoresistive micro calorimetric flow (TMCF) sensors: S-type with the sensor chip protrusion-mounted on the flow channel wall and E-type with the sensor chip flush-mounted on the flow channel wall. Although the experimental results indicated that the sensitivity of the S-type was increased by more than 30%; the corresponding flow range as compared to the E-type was dramatically reduced by 60% from 0–11 m s −1 to 0–4.5 m s −1 . Comprehensive 2D CFD simulation and in-house developed 3D numerical simulations based on the gas-kinetic scheme were applied to study the flow separation of these two packaging designs with the major parameters. Indeed, the S-type design with the large protrusion would change the local convective heat transfer of the TMCF sensor and dramatically decrease the sensors’ performance. In addition, parametric CFD simulations of the packaging designs provide inspiration to propose a novel general flow regime map (FRM), i.e. normalized protrusion d * versus reduced chip Reynolds number Re * , where the critical boundary curve for the flow separation of TMCF sensors was determined at different channel aspect ratios. The proposed FRM can be a useful guideline for the packaging design and manufacturing of different micro thermal flow sensors. (paper)

First-time demonstration of measuring concrete prestress levels with metal packaged fibre optic sensors

Science.gov (United States)

Mckeeman, I.; Fusiek, G.; Perry, M.; Johnston, M.; Saafi, M.; Niewczas, P.; Walsh, M.; Khan, S.

2016-09-01

In this work we present the first large-scale demonstration of metal packaged fibre Bragg grating sensors developed to monitor prestress levels in prestressed concrete. To validate the technology, strain and temperature sensors were mounted on steel prestressing strands in concrete beams and stressed up to 60% of the ultimate tensile strength of the strand. We discuss the methods and calibration procedures used to fabricate and attach the temperature and strain sensors. The use of induction brazing for packaging the fibre Bragg gratings and welding the sensors to prestressing strands eliminates the use of epoxy, making the technique suitable for high-stress monitoring in an irradiated, harsh industrial environment. Initial results based on the first week of data after stressing the beams show the strain sensors are able to monitor prestress levels in ambient conditions.

Low temperature co-fired ceramic packaging of CMOS capacitive sensor chip towards cell viability monitoring

Directory of Open Access Journals (Sweden)

Niina Halonen

2016-11-01

Full Text Available Cell viability monitoring is an important part of biosafety evaluation for the detection of toxic effects on cells caused by nanomaterials, preferably by label-free, noninvasive, fast, and cost effective methods. These requirements can be met by monitoring cell viability with a capacitance-sensing integrated circuit (IC microchip. The capacitance provides a measurement of the surface attachment of adherent cells as an indication of their health status. However, the moist, warm, and corrosive biological environment requires reliable packaging of the sensor chip. In this work, a second generation of low temperature co-fired ceramic (LTCC technology was combined with flip-chip bonding to provide a durable package compatible with cell culture. The LTCC-packaged sensor chip was integrated with a printed circuit board, data acquisition device, and measurement-controlling software. The packaged sensor chip functioned well in the presence of cell medium and cells, with output voltages depending on the medium above the capacitors. Moreover, the manufacturing of microfluidic channels in the LTCC package was demonstrated.

Packaging of active fiber composites for improved sensor performance

International Nuclear Information System (INIS)

Melnykowycz, M; Barbezat, M; Koller, R; Brunner, A J

2010-01-01

Active fiber composites (AFC) composed of lead zirconate titanate (PZT) fibers embedded in an epoxy matrix and sandwiched between two interdigitated electrodes provide a thin and flexible smart material device which can act as a sensor or actuator. The thin profiles of AFC make them ideal for integration in glass or carbon fiber composite laminates. However, due to the low tensile limit of the PZT fibers, AFC can fail at strains below the tensile limit of many composites. This makes their use as a component in an active laminate design somewhat undesirable. In the current work, tensile testing of smart laminates composed of AFC integrated in glass fiber laminates was conducted to assess the effectiveness of different packaging strategies for improving AFC sensor performance at high strains relative to the tensile limit of the AFC. AFC were encased in carbon fiber, silicon, and pre-stressed carbon fiber to improve the tensile limit of the AFC when integrated in glass fiber laminates. By laminating AFC with pre-stressed carbon fiber, the tensile limit and strain sensor ability of the AFC were significantly improved. Acoustic emission monitoring was used and the results show that PZT fiber breakage was reduced due to the pre-stressed packaging process

A packaged, low-cost, robust optical fiber strain sensor based on small cladding fiber sandwiched within periodic polymer grating.

Science.gov (United States)

Chiang, Chia-Chin; Li, Chein-Hsing

2014-06-02

In the present study, a novel packaged long-period fiber grating (PLPFG) strain sensor is first presented. The MEMS process was utilized to fabricate the packaged optical fiber strain sensor. The sensor structure consisted of etched optical fiber sandwiched between two layers of thick photoresist SU-8 3050 and then packaged with poly (dimethylsiloxane) (PDMS) polymer material to construct the PLPFG strain sensor. The PDMS packaging material was used to prevent the glue effect, wherein glue flows into the LPFG structure and reduces coupling strength, in the surface bonding process. Because the fiber grating was packaged with PDMS material, it was effectively protected and made robust. The resonance attenuation dip of PLPFG grows when it is loading. This study explored the size effect of the grating period and fiber diameter of PLPFG via tensile testing. The experimental results found that the best strain sensitivity of the PLPFG strain sensor was -0.0342 dB/με, and that an R2 value of 0.963 was reached.

Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

Science.gov (United States)

Chen, Liang-Yu; Neudeck, Philip G.; Behelm, Glenn M.; Spry, David J.; Meredith, Roger D.; Hunter, Gary W.

2015-01-01

This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

System-in Package of Integrated Humidity Sensor Using CMOS-MEMS Technology.

Science.gov (United States)

Lee, Sung Pil

2015-10-01

Temperature/humidity microchips with micropump were fabricated using a CMOS-MEMS process and combined with ZigBee modules to implement a sensor system in package (SIP) for a ubiquitous sensor network (USN) and/or a wireless communication system. The current of a diode temperature sensor to temperature and a normalized current of FET humidity sensor to relative humidity showed linear characteristics, respectively, and the use of the micropump has enabled a faster response. A wireless reception module using the same protocol as that in transmission systems processed the received data within 10 m and showed temperature and humidity values in the display.

A needs assessment for DOE's packaging and transportation activities - a look into the twenty-first century

International Nuclear Information System (INIS)

Pope, R.; Turi, G.; Brancato, R.; Blalock, L.; Merrill, O.

1995-01-01

The U.S. Department of Energy (DOE) has performed a department-wide scoping of its packaging and transportation needs and has arrived at a projection of these needs for well into the twenty-first century. The assessment, known as the Transportation Needs Assessment (TNA) was initiated during August 1994 and completed in December 1994. The TNA will allow DOE to better prepare for changes in its transportation requirements in the future. The TNA focused on projected, quantified shipping needs based on forecasts of inventories of materials which will ultimately require transport by the DOE for storage, treatment and/or disposal. In addition, experts provided input on the growing needs throughout DOE resulting from changes in regulations, in DOE's mission, and in the sociopolitical structure of the United States. Through the assessment, DOE's transportation needs have been identified for a time period extending from the present through the first three decades of the twenty-first century. The needs assessment was accomplished in three phases: (1) defining current packaging, shipping, resource utilization, and methods of managing packaging and transportation activities; (2) establishing the inventory of materials which DOE will need to transport on into the next century and scenarios which project when, from where, and to where these materials will need to be transported; and (3) developing requirements and projected changes for DOE to accomplish the necessary transport safely and economically

Conformal Thin Film Packaging for SiC Sensor Circuits in Harsh Environments

Science.gov (United States)

Scardelletti, Maximilian C.; Karnick, David A.; Ponchak, George E.; Zorman, Christian A.

2011-01-01

In this investigation sputtered silicon carbide annealed at 300 C for one hour is used as a conformal thin film package. A RF magnetron sputterer was used to deposit 500 nm silicon carbide films on gold metal structures on alumina wafers. To determine the reliability and resistance to immersion in harsh environments, samples were submerged in gold etchant for 24 hours, in BOE for 24 hours, and in an O2 plasma etch for one hour. The adhesion strength of the thin film was measured by a pull test before and after the chemical immersion, which indicated that the film has an adhesion strength better than 10(exp 8) N/m2; this is similar to the adhesion of the gold layer to the alumina wafer. MIM capacitors are used to determine the dielectric constant, which is dependent on the SiC anneal temperature. Finally, to demonstrate that the SiC, conformal, thin film may be used to package RF circuits and sensors, an LC resonator circuit was fabricated and tested with and without the conformal SiC thin film packaging. The results indicate that the SiC coating adds no appreciable degradation to the circuits RF performance. Index Terms Sputter, silicon carbide, MIM capacitors, LC resonators, gold etchants, BOE, O2 plasma

Development of High Temperature SiC Based Hydrogen/Hydrocarbon Sensors with Bond Pads for Packaging

Science.gov (United States)

Xu, Jennifer C.; Hunter, Gary W.; Chen, Liangyu; Biagi-Labiosa, Azlin M.; Ward, Benjamin J.; Lukco, Dorothy; Gonzalez, Jose M., III; Lampard, Peter S.; Artale, Michael A.; Hampton, Christopher L.

2011-01-01

This paper describes efforts towards the transition of existing high temperature hydrogen and hydrocarbon Schottky diode sensor elements to packaged sensor structures that can be integrated into a testing system. Sensor modifications and the technical challenges involved are discussed. Testing of the sensors at 500 C or above is also presented along with plans for future development.

A novel fibre Bragg grating sensor packaging design for ultra-high temperature sensing in harsh environments

Science.gov (United States)

Azhari, Amir; Liang, Richard; Toyserkani, Ehsan

2014-07-01

The aim of this article is to introduce a novel packaging of conventional Corning SMF-28™ single-mode fibre Bragg grating sensors for ultra-high temperature sensing. The package is in a cylindrical shape made of yttria-stabilized zirconia tubes. The fibre optic sensor is epoxied to one end inside the tube to be protected from high external temperatures and also harsh environments. Highly-oriented pyrolytic graphite tube with an exceptional anisotropic thermal conductivity with higher conductivity in transverse than radial direction is positioned around the fibre to protect it from high temperatures. Air cooling system is also provided from the other end to dissipate the transferred heat from inside the tube. The shift in the Bragg wavelength is influenced by the thermal expansion of the package and internal temperature variations, which translates into thermal expansion of the fibre. The modelling and experimental results revealed that the Bragg wavelength shift increases to 1.4 pm °C-1 at higher temperatures with linear behaviour at temperatures above 600 °C. The finite element modelling and the experimental results are also in good proximity indicating the similar trend for the shift in the Bragg wavelength.

Sensors and packages based on LTCC and thick-film technology for ...

Indian Academy of Sciences (India)

Reliable operation in harsh environments such as high temperatures, high pressures, aggressive media and space, poses special requirements for sensors and packages, which usually cannot be met using polymer-based technologies. Ceramic technologies, especially LTCC (Low-Temperature Cofired Ceramic), offer a ...

Monitoring Volcanoes by Use of Air-Dropped Sensor Packages

Science.gov (United States)

Kedar, Sharon; Rivellini, Tommaso; Webb, Frank; Blaes, Brent; Bracho, Caroline; Lockhart, Andrew; McGee, Ken

2003-01-01

Sensor packages that would be dropped from airplanes have been proposed for pre-eruption monitoring of physical conditions on the flanks of awakening volcanoes. The purpose of such monitoring is to gather data that could contribute to understanding and prediction of the evolution of volcanic systems. Each sensor package, denoted a volcano monitoring system (VMS), would include a housing with a parachute attached at its upper end and a crushable foam impact absorber at its lower end (see figure). The housing would contain survivable low-power instrumentation that would include a Global Positioning System (GPS) receiver, an inclinometer, a seismometer, a barometer, a thermometer, and CO2 and SO2 analyzers. The housing would also contain battery power, control, data-logging, and telecommunication subsystems. The proposal for the development of the VMS calls for the use of commercially available sensor, power, and telecommunication equipment, so that efforts could be focused on integrating all of the equipment into a system that could survive impact and operate thereafter for 30 days, transmitting data on the pre-eruptive state of a target volcano to a monitoring center. In a typical scenario, VMSs would be dropped at strategically chosen locations on the flanks of a volcano once the volcano had been identified as posing a hazard from any of a variety of observations that could include eyewitness reports, scientific observations from positions on the ground, synthetic-aperture-radar scans from aircraft, and/or remote sensing from aboard spacecraft. Once dropped, the VMSs would be operated as a network of in situ sensors that would transmit data to a local monitoring center. This network would provide observations as part of an integrated volcano-hazard assessment strategy that would involve both remote sensing and timely observations from the in situ sensors. A similar strategy that involves the use of portable sensors (but not dropping of sensors from aircraft) is

Fully Roll-to-Roll Gravure Printable Wireless (13.56 MHz) Sensor-Signage Tags for Smart Packaging

Science.gov (United States)

Kang, Hwiwon; Park, Hyejin; Park, Yongsu; Jung, Minhoon; Kim, Byung Chul; Wallace, Gordon; Cho, Gyoujin

2014-06-01

Integration of sensing capabilities with an interactive signage through wireless communication is enabling the development of smart packaging wherein wireless (13.56 MHz) power transmission is used to interlock the smart packaging with a wireless (13.56 MHz) reader or a smart phone. Assembly of the necessary componentry for smart packaging on plastic or paper foils is limited by the manufacturing costs involved with Si based technologies. Here, the issue of manufacturing cost for smart packaging has been obviated by materials that allow R2R (roll-to-roll) gravure in combination with R2R coating processes to be employed. R2R gravure was used to print the wireless power transmission device, called rectenna (antenna, diode and capacitor), and humidity sensor on poly(ethylene terephtalate) (PET) films while electrochromic signage units were fabricated by R2R coating. The signage units were laminated with the R2R gravure printed rectenna and sensor to complete the prototype smart packaging.

Sensor Fish: an autonomous sensor package for characterizing complex flow fields and fish passage

Energy Technology Data Exchange (ETDEWEB)

Deng, Zhiqun; Martinez, Jayson J.; Lu, Jun

2016-10-04

Fish passing through dams or other hydraulic structures may be injured or killed despite advances in turbine design, project operations, and other fish bypass systems. The Sensor Fish (SF) device is an autonomous sensor package that characterizes the physical conditions and stressors to which fish are exposed during passage through hydro facilities. It was designed to move passively as a neutrally buoyant object through severe hydraulic environments, while collecting high-resolution sensor data. Since its first generation1, the SF device has been successfully deployed in many fish passage studies and has evolved to be a major tool for characterizing fish passage conditions during fish passage in the Columbia River Basin. To better accelerate hydropower development, the U.S. Department of Energy Water Power Program provided funding to develop a new generation (Gen 2 SF) to incorporate more capabilities and accommodate a wider range of users over a broader range of turbine designs and operating environments. The Gen 2 SF (Figure 1) is approximately the size and density of a yearling salmon smolt and is nearly neutrally buoyant. It contains three-dimensional (3D) rotation sensors, 3D linear acceleration sensors, a pressure sensor, a temperature sensor, a 3D orientation sensor, a radiofrequency (RF) transmitter, and a recovery module2. A low-power microcontroller collects data from the sensors and stores up to 5 min of data on internal flash memory at a sampling frequency of 2048 Hz. The recovery module makes the SF positively buoyant after a pre-programmed period of time, causing it to float to the surface for recovery.

Construction of a Chemical Sensor/Instrumentation Package Using Fiber Optic and Miniaturization Technology

Science.gov (United States)

Newton, R. L.

1999-01-01

The objective of this research was to construct a chemical sensor/instrumentation package that was smaller in weight and volume than conventional instrumentation. This reduction in weight and volume is needed to assist in further reducing the cost of launching payloads into space. To accomplish this, fiber optic sensors, miniaturized spectrometers, and wireless modems were employed. The system was evaluated using iodine as a calibration analyte.

Twenty-One at TREC-8: using Language Technology for Information Retrieval

NARCIS (Netherlands)

Kraaij, Wessel; Pohlmann, Renée; Hiemstra, Djoerd; Voorhees, E.M; Harman, D.K.

2000-01-01

This paper describes the official runs of the Twenty-One group for TREC-8. The Twenty-One group participated in the Ad-hoc, CLIR, Adaptive Filtering and SDR tracks. The main focus of our experiments is the development and evaluation of retrieval methods that are motivated by natural language

FF. A package to evaluate one-loop Feynman diagrams

International Nuclear Information System (INIS)

Oldenborgh, G.J. van

1990-09-01

A short description and a user's guide of the FF package are given. This package contains routines to evaluate numerically the scalar one-loop integrals occurring in the evaluation in one-loop Feynman diagrams. The algorithms chosen are numerically stable over most parameter space. (author). 5 refs.; 1 tab

Fully Roll-to-Roll Gravure Printable Wireless (13.56 MHz) Sensor-Signage Tags for Smart Packaging

Science.gov (United States)

Kang, Hwiwon; Park, Hyejin; Park, Yongsu; Jung, Minhoon; Kim, Byung Chul; Wallace, Gordon; Cho, Gyoujin

2014-01-01

Integration of sensing capabilities with an interactive signage through wireless communication is enabling the development of smart packaging wherein wireless (13.56 MHz) power transmission is used to interlock the smart packaging with a wireless (13.56 MHz) reader or a smart phone. Assembly of the necessary componentry for smart packaging on plastic or paper foils is limited by the manufacturing costs involved with Si based technologies. Here, the issue of manufacturing cost for smart packaging has been obviated by materials that allow R2R (roll-to-roll) gravure in combination with R2R coating processes to be employed. R2R gravure was used to print the wireless power transmission device, called rectenna (antenna, diode and capacitor), and humidity sensor on poly(ethylene terephtalate) (PET) films while electrochromic signage units were fabricated by R2R coating. The signage units were laminated with the R2R gravure printed rectenna and sensor to complete the prototype smart packaging. PMID:24953037

Twenty-One at TREC-7: ad-hoc and cross-language track

NARCIS (Netherlands)

Hiemstra, Djoerd; Kraaij, Wessel; Voorhees, E.M; Harman, D.K.

1999-01-01

This paper describes the official runs of the Twenty-One group for TREC-7. The Twenty-One group participated in the ad-hoc and the cross-language track and made the following accomplishments: We developed a new weighting algorithm, which outperforms the popular Cornell version of BM25 on the ad-hoc

A software package for evaluating the performance of a star sensor operation

Science.gov (United States)

Sarpotdar, Mayuresh; Mathew, Joice; Sreejith, A. G.; Nirmal, K.; Ambily, S.; Prakash, Ajin; Safonova, Margarita; Murthy, Jayant

2017-02-01

We have developed a low-cost off-the-shelf component star sensor ( StarSense) for use in minisatellites and CubeSats to determine the attitude of a satellite in orbit. StarSense is an imaging camera with a limiting magnitude of 6.5, which extracts information from star patterns it records in the images. The star sensor implements a centroiding algorithm to find centroids of the stars in the image, a Geometric Voting algorithm for star pattern identification, and a QUEST algorithm for attitude quaternion calculation. Here, we describe the software package to evaluate the performance of these algorithms as a star sensor single operating system. We simulate the ideal case where sky background and instrument errors are omitted, and a more realistic case where noise and camera parameters are added to the simulated images. We evaluate such performance parameters of the algorithms as attitude accuracy, calculation time, required memory, star catalog size, sky coverage, etc., and estimate the errors introduced by each algorithm. This software package is written for use in MATLAB. The testing is parametrized for different hardware parameters, such as the focal length of the imaging setup, the field of view (FOV) of the camera, angle measurement accuracy, distortion effects, etc., and therefore, can be applied to evaluate the performance of such algorithms in any star sensor. For its hardware implementation on our StarSense, we are currently porting the codes in form of functions written in C. This is done keeping in view its easy implementation on any star sensor electronics hardware.

Thermal micropressure sensor for pressure monitoring in a minute package

International Nuclear Information System (INIS)

Wang, S. N.; Mizuno, K.; Fujiyoshi, M.; Funabashi, H.; Sakata, J.

2001-01-01

A thermal micropressure sensor suitable for pressure measurements in the range from 7x10 -3 to 1x10 5 Pa has been fabricated by forming a titanium (Ti) thin-film resistor on a floating nondoped silica glass membrane, with the sensing area being as small as 60 μmx60 μm. The sensor performance is raised by: (1) increasing the ratio of gaseous thermal conduction in the total thermal conduction by sensor structure design; (2) compensating the effect of ambient-temperature drift by using a reference resistor located close to the sensing element but directly on the silicon substrate; and (3) utilizing an optimized novel constant-bias Wheatstone bridge circuit. By choosing a proper bias voltage, which can be found by simple calculation, the circuit extracts information on gaseous thermal conduction from the directly measurable total heat loss of the heated sensing element. The sensor was enclosed in a metal package with a capacity of about 0.5 ml by projection welding and was successfully applied to monitoring the pressure in the minute space

Fabrication and characterization of a metal-packaged regenerated fiber Bragg grating strain sensor for structural integrity monitoring of high-temperature components

International Nuclear Information System (INIS)

Tu, Yun; Tu, Shan-Tung

2014-01-01

Assessment of the structural integrity of components operating at high temperatures requires the development of novel sensors to measure strain. A metal-packaged regenerated fiber Bragg grating (RFBG) sensor is developed for measurement of strain using titanium–silver magnetron sputtering and nickel electroplating. The strain response of the sensor mounted onto a flat tensile specimen by spot welding is evaluated by uniaxial tensile tests at constant temperatures ranging from room temperature to 400 °C. Similar tests are performed on a bare RFBG sensor for comparison. The metal-packaged RFBG strain sensor exhibits higher strain sensitivity than that of the bare RFBG sensor, as well as good linearity, stability and repeatability of strain measurements. A three-dimensional finite element model of the sensor is established to predict the strain sensitivity based on the sensing principle of the fiber Bragg grating. Comparisons of the experimental results with the numerical predictions for the strain sensitivity show a satisfactory agreement. These results demonstrate that the metal-packaged RFBG strain sensors can be successfully fabricated by combining magnetron sputtering with electroplating, and provide great promise for structural integrity monitoring of high-temperature components. (paper)

Vacuum-packaged piezoelectric vibration energy harvesters: damping contributions and autonomy for a wireless sensor system

International Nuclear Information System (INIS)

Elfrink, R; Renaud, M; Kamel, T M; De Nooijer, C; Jambunathan, M; Goedbloed, M; Hohlfeld, D; Matova, S; Pop, V; Caballero, L; Van Schaijk, R

2010-01-01

This paper describes the characterization of thin-film MEMS vibration energy harvesters based on aluminum nitride as piezoelectric material. A record output power of 85 µW is measured. The parasitic-damping and the energy-harvesting performances of unpackaged and packaged devices are investigated. Vacuum and atmospheric pressure levels are considered for the packaged devices. When dealing with packaged devices, it is found that vacuum packaging is essential for maximizing the output power. Therefore, a wafer-scale vacuum package process is developed. The energy harvesters are used to power a small prototype (1 cm 3 volume) of a wireless autonomous sensor system. The average power consumption of the whole system is less than 10 µW, and it is continuously provided by the vibration energy harvester

Demonstration of a Packaged Capacitive Pressure Sensor System Suitable for Jet Turbofan Engine Health Monitoring

Science.gov (United States)

Scardelletti, Maximilian C.; Jordan, Jennifer L.; Meredith, Roger D.; Harsh, Kevin; Pilant, Evan; Usrey, Michael W.; Beheim, Glenn M.; Hunter, Gary W.; Zorman, Christian A.

2016-01-01

In this paper, the development and characterization of a packaged pressure sensor system suitable for jet engine health monitoring is demonstrated. The sensing system operates from 97 to 117 MHz over a pressure range from 0 to 350 psi and a temperature range from 25 to 500 deg. The sensing system consists of a Clapp-type oscillator that is fabricated on an alumina substrate and is comprised of a Cree SiC MESFET, MIM capacitors, a wire-wound inductor, chip resistors and a SiCN capacitive pressure sensor. The pressure sensor is located in the LC tank circuit of the oscillator so that a change in pressure causes a change in capacitance, thus changing the resonant frequency of the sensing system. The chip resistors, wire-wound inductors and MIM capacitors have all been characterized at temperature and operational frequency, and perform with less than 5% variance in electrical performance. The measured capacitive pressure sensing system agrees very well with simulated results. The packaged pressure sensing system is specifically designed to measure the pressure on a jet turbofan engine. The packaged system can be installed by way of borescope plug adaptor fitted to a borescope port exposed to the gas path of a turbofan engine.

Demonstration of a Prototype Hydrogen Sensor and Electronics Package - Progress Report 2

Energy Technology Data Exchange (ETDEWEB)

Wu, Amanda S. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Brosha, Eric [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

2016-06-14

This is the second progress report on the demonstration of a prototype hydrogen sensor and electronics package. It goes into detail about the five tasks, four of which are already completed as of August 2016, with the final to be completed by January 26, 2017. Then the budget is detailed along with the planned work for May 27, 2016 to July 27, 2016.

3D packaging of a microfluidic system with sensory applications

Science.gov (United States)

Morrissey, Anthony; Kelly, Gerard; Alderman, John C.

1997-09-01

Among the main benefits of microsystem technology are its contributions to cost reductio, reliability and improved performance. however, the packaging of microsystems, and particularly microsensor, has proven to be one of the biggest limitations to their commercialization and the packaging of silicon sensor devices can be the most costly part of their fabrication. This paper describes the integration of 3D packaging of a microsystem. Central to the operation of the 3D demonstrator is a micromachined silicon membrane pump to supply fluids to a sensing chamber constructed about the active area of a sensor chip. This chip carries ISFET based chemical sensors, pressure sensors and thermal sensors. The electronics required for controlling and regulating the activity of the various sensors ar also available on this chip and as other chips in the 3D assembly. The demonstrator also contains a power supply module with optical fiber interconnections. All of these modules are integrated into a single plastic- encapsulated 3D vertical multichip module. The reliability of such a structure, initially proposed by Val was demonstrated by Barrett et al. An additional module available for inclusion in some of our assemblies is a test chip capable of measuring the packaging-induced stress experienced during and after assembly. The packaging process described produces a module with very high density and utilizes standard off-the-shelf components to minimize costs. As the sensor chip and micropump include micromachined silicon membranes and microvalves, the packaging of such structures has to allow consideration for the minimization of the packaging-induced stresses. With this in mind, low stress techniques, including the use of soft glob-top materials, were employed.

Evaluating the performance of low cost chemical sensors for air pollution research.

Science.gov (United States)

Lewis, Alastair C; Lee, James D; Edwards, Peter M; Shaw, Marvin D; Evans, Mat J; Moller, Sarah J; Smith, Katie R; Buckley, Jack W; Ellis, Matthew; Gillot, Stefan R; White, Andrew

2016-07-18

Low cost pollution sensors have been widely publicized, in principle offering increased information on the distribution of air pollution and a democratization of air quality measurements to amateur users. We report a laboratory study of commonly-used electrochemical sensors and quantify a number of cross-interferences with other atmospheric chemicals, some of which become significant at typical suburban air pollution concentrations. We highlight that artefact signals from co-sampled pollutants such as CO2 can be greater than the electrochemical sensor signal generated by the measurand. We subsequently tested in ambient air, over a period of three weeks, twenty identical commercial sensor packages alongside standard measurements and report on the degree of agreement between references and sensors. We then explore potential experimental approaches to improve sensor performance, enhancing outputs from qualitative to quantitative, focusing on low cost VOC photoionization sensors. Careful signal handling, for example, was seen to improve limits of detection by one order of magnitude. The quantity, magnitude and complexity of analytical interferences that must be characterised to convert a signal into a quantitative observation, with known uncertainties, make standard individual parameter regression inappropriate. We show that one potential solution to this problem is the application of supervised machine learning approaches such as boosted regression trees and Gaussian processes emulation.

Package-X 2.0: A Mathematica package for the analytic calculation of one-loop integrals

Science.gov (United States)

Patel, Hiren H.

2017-09-01

This article summarizes new features and enhancements of the first major update of Package-X. Package-X 2.0 can now generate analytic expressions for arbitrarily high rank dimensionally regulated tensor integrals with up to four distinct propagators, each with arbitrary integer weight, near an arbitrary even number of spacetime dimensions, giving UV divergent, IR divergent, and finite parts at (almost) any real-valued kinematic point. Additionally, it can generate multivariable Taylor series expansions of these integrals around any non-singular kinematic point to arbitrary order. All special functions and abbreviations output by Package-X 2.0 support Mathematica's arbitrary precision evaluation capabilities to deal with issues of numerical stability. Finally, tensor algebraic routines of Package-X have been polished and extended to support open fermion chains both on and off shell. The documentation (equivalent to over 100 printed pages) is accessed through Mathematica's Wolfram Documentation Center and contains information on all Package-X symbols, with over 300 basic usage examples, 3 project-scale tutorials, and instructions on linking to FEYNCALC and LOOPTOOLS. Program files doi:http://dx.doi.org/10.17632/yfkwrd4d5t.1 Licensing provisions: CC by 4.0 Programming language: Mathematica (Wolfram Language) Journal reference of previous version: H. H. Patel, Comput. Phys. Commun 197, 276 (2015) Does the new version supersede the previous version?: Yes Summary of revisions: Extension to four point one-loop integrals with higher powers of denominator factors, separate extraction of UV and IR divergent parts, testing for power IR divergences, construction of Taylor series expansions of one-loop integrals, numerical evaluation with arbitrary precision arithmetic, manipulation of fermion chains, improved tensor algebraic routines, and much expanded documentation. Nature of problem: Analytic calculation of one-loop integrals in relativistic quantum field theory. Solution

A high performance micro-pressure sensor based on a double-ended quartz tuning fork and silicon diaphragm in atmospheric packaging

International Nuclear Information System (INIS)

Cheng, Rongjun; Li, Cun; Zhao, Yulong; Li, Bo; Tian, Bian

2015-01-01

A resonant micro-pressure sensor based on a double-ended quartz tuning fork (DEQTF) and bossed silicon diaphragm in atmospheric packaging is presented. To achieve vacuum-free packaging with a high quality factor, the DEQTF is designed to resonate in an anti-phase vibration mode in a plane that is under the effect of slide-film damping. The feasibility is demonstrated by theoretical analysis and a finite element simulation. The dimensions of the DEQTF and diaphragm are optimized in accordance with the principles of improving sensitivity and minimizing energy dissipation. The sensor chip is fabricated using quartz and silicon micromachining technologies, and simply packaged in a stainless steel shell with standard atmosphere. The experimental setup is established for the calibration, where an additional sensor prototype without a pressure port is introduced as a frequency reference. By detecting the frequency difference of the tested sensor and reference sensor, the influences of environmental factors such as temperature and shocks on measuring accuracy are eliminated effectively. Under the action of a self-excitation circuit, static performance is obtained. The sensitivity of the sensor is 299 kHz kPa −1 in the operating range of 0–10 kPa at room temperature. Testing results shows a nonlinearity of 0.0278%FS, a hysteresis of 0.0207%FS and a repeatability of 0.0375%FS. The results indicate that the proposed sensor has favorable features, which provides a cost-effective and high-performance approach for low pressure measurement. (paper)

Packaged solar water heating technology: twenty years of progress

International Nuclear Information System (INIS)

Morrison, Graham; Wood, Byard

2000-01-01

The world market for packaged solar water heaters is reviewed, and descriptions are given of the different types of solar domestic water heaters (SDWH), design concepts for packaged SDWH, thermosyphon SDWH, evacuated insulation and excavated tube collectors, seasonally biased solar collectors, heat pump water heaters, and photovoltaic water heaters. The consumer market value for SDWHs is explained, and the results of a survey of solar water heating are summarised covering advantages, perceived disadvantages, the relative importance of purchase decision factors, experience with system components, and the most frequent maintenance problems. The durability, reliability, and performance of SDWHs are discussed

Single-Crystal Sapphire Optical Fiber Sensor Instrumentation

Energy Technology Data Exchange (ETDEWEB)

Pickrell, Gary [Virginia Polytechnic Inst. & State Univ., Blacksburg, VA (United States); Scott, Brian [Virginia Polytechnic Inst. & State Univ., Blacksburg, VA (United States); Wang, Anbo [Virginia Polytechnic Inst. & State Univ., Blacksburg, VA (United States); Yu, Zhihao [Virginia Polytechnic Inst. & State Univ., Blacksburg, VA (United States)

2013-12-31

This report summarizes technical progress on the program “Single-Crystal Sapphire Optical Fiber Sensor Instrumentation,” funded by the National Energy Technology Laboratory of the U.S. Department of Energy, and performed by the Center for Photonics Technology of the Bradley Department of Electrical and Computer Engineering at Virginia Tech. This project was completed in three phases, each with a separate focus. Phase I of the program, from October 1999 to April 2002, was devoted to development of sensing schema for use in high temperature, harsh environments. Different sensing designs were proposed and tested in the laboratory. Phase II of the program, from April 2002 to April 2009, focused on bringing the sensor technologies, which had already been successfully demonstrated in the laboratory, to a level where the sensors could be deployed in harsh industrial environments and eventually become commercially viable through a series of field tests. Also, a new sensing scheme was developed and tested with numerous advantages over all previous ones in Phase II. Phase III of the program, September 2009 to December 2013, focused on development of the new sensing scheme for field testing in conjunction with materials engineering of the improved sensor packaging lifetimes. In Phase I, three different sensing principles were studied: sapphire air-gap extrinsic Fabry-Perot sensors; intensity-based polarimetric sensors; and broadband polarimetric sensors. Black body radiation tests and corrosion tests were also performed in this phase. The outcome of the first phase of this program was the selection of broadband polarimetric differential interferometry (BPDI) for further prototype instrumentation development. This approach is based on the measurement of the optical path difference (OPD) between two orthogonally polarized light beams in a single-crystal sapphire disk. At the beginning of Phase II, in June 2004, the BPDI sensor was tested at the Wabash River coal gasifier

An analytical one-dimensional model for predicting waste package performance

International Nuclear Information System (INIS)

Relyea, J.F.; Wood, M.I.

1984-01-01

A method for allocating waste package performance requirements among waste package components with regard to radionuclide isolation has been developed. Modification or change in this approach can be expected as the understanding of radionuclide behavior in the waste package improves. Thus, the performance requirements derived in this document are preliminary and subject to change. However, this kind of analysis is a useful starting point. It has also proved useful for identifying a small group of radionuclides which should be emphasized in a laboratory experimental program designed to characterize the behavior of specific radionuclides in the waste package environment. A simple one-dimensional, two media transport model has been derived and used to calculate radionuclide transport from the waste form-packing material interface of the waste package into the host rock. Cumulative release over 10,000 years, maximum yearly releases and release rates at the packing material-host rock interface were evaluated on a radionuclide-by radionuclide basis. The major parameters controlling radionuclide release were found to be: radionuclide solubility, porosity of the rock, isotopic ratio of the radionuclide and surface area of the waste form-packing material interface. 15 refs., 2 figs., 16 tabs

An investigation of twenty-one cases of low-frequency noise complaints

DEFF Research Database (Denmark)

Pedersen, Christian Sejer; Møller, Henrik; Persson-Waye, Kerstin

2007-01-01

Twenty-one cases of low-frequency noise complaints were thoroughly investigated with the aim of answering the question whether it is real physical sound or low-frequency tinnitus that causes the annoyance. Noise recordings were made in the homes of the complainants taking the spatial variation...

XLOOPS - a package calculating one- and two-loop diagrams

International Nuclear Information System (INIS)

Bruecher, L.

1997-01-01

A program package for calculating massive one- and two-loop diagrams is introduced. It consists of five parts: - a graphical user interface, - routines for generating diagrams from particle input, - procedures for calculating one-loop integrals both analytically and numerically, - routines for massive two-loop integrals, - programs for numerical integration of two-loop diagrams. Here the graphical user interface and the text interface to Maple are presented. (orig.)

An Improved Metal-Packaged Strain Sensor Based on A Regenerated Fiber Bragg Grating in Hydrogen-Loaded Boron–Germanium Co-Doped Photosensitive Fiber for High-Temperature Applications

Directory of Open Access Journals (Sweden)

Yun Tu

2017-02-01

Full Text Available Local strain measurements are considered as an effective method for structural health monitoring of high-temperature components, which require accurate, reliable and durable sensors. To develop strain sensors that can be used in higher temperature environments, an improved metal-packaged strain sensor based on a regenerated fiber Bragg grating (RFBG fabricated in hydrogen (H2-loaded boron–germanium (B–Ge co-doped photosensitive fiber is developed using the process of combining magnetron sputtering and electroplating, addressing the limitation of mechanical strength degradation of silica optical fibers after annealing at a high temperature for regeneration. The regeneration characteristics of the RFBGs and the strain characteristics of the sensor are evaluated. Numerical simulation of the sensor is conducted using a three-dimensional finite element model. Anomalous decay behavior of two regeneration regimes is observed for the FBGs written in H2-loaded B–Ge co-doped fiber. The strain sensor exhibits good linearity, stability and repeatability when exposed to constant high temperatures of up to 540 °C. A satisfactory agreement is obtained between the experimental and numerical results in strain sensitivity. The results demonstrate that the improved metal-packaged strain sensors based on RFBGs in H2-loaded B–Ge co-doped fiber provide great potential for high-temperature applications by addressing the issues of mechanical integrity and packaging.

A membrane film sensor with encapsulated fluorescent dyes towards express freshness monitoring of packaged food.

Science.gov (United States)

Kiryukhin, Maxim V; Lau, Hooi Hong; Goh, Seok Hong; Teh, Cathleen; Korzh, Vladimir; Sadovoy, Anton

2018-05-15

A new Membrane Film Sensor (MFS) has been developed to measure pH of fluids. MFS comprises a polyelectrolyte multilayer film with uniformly distributed compartments (microchambers) where a fluorescent sensing dye is encapsulated. Fabricated film is sealed onto a polyethylene film for a future use. MFS was applied to report changes in golden pomfret fillet upon its storage at 5 °C. MFS pH readings were correlated to bacteriological analysis of fish samples. A hike in pH of fish juices happens after 10 days of storage signaling bacterial spoilage of fish. The design of developed MFS allows easy integration with transparent packaging materials for future development of "SMART" packaging sensing food freshness. Copyright © 2018 Elsevier B.V. All rights reserved.

Twenty-One Ways to Use Music in Teaching the Language Arts.

Science.gov (United States)

Cardarelli, Aldo F.

Twenty-one activities that integrate music and the language arts in order to capitalize on children's interests are described in this paper. Topics of the activities are as follows: alphabetical order, pantomime, vocabulary building from words of a favorite song, words that are "the most (whatever)" from songs, mood words, a configuration clue…

Design, building and test of one prototype and four final position sensor assemblies: Hall effect position sensors

Science.gov (United States)

1976-01-01

This report covers the development of a three channel Hall effect position sensing system for the commutation of a three phase dc torquer motor. The effort consisted of the evaluation, modification and re-packaging of a commercial position sensor and the design of a target configuration unique to this application. The resulting design meets the contract requirements and, furthermore, the test results indicate not only the practicality and versatility of the design, but also that there may be higher limits of resolution and accuracy achievable.

One-port portable SAW sensor system

Science.gov (United States)

Hoa Nguyen, Vu; Peters, Oliver; Schnakenberg, Uwe

2018-01-01

A portable device using the SAW-based impedance sensor type based on one interdigital transducer simultaneously as SAW generator and sensor element (1-port approach) is introduced. As a novelty, the so far required expensive vector network analyzer (VNA) is replaced by a hand-held device to measure the impedance spectrum of the SAW sensor by RF-gain-phase meters. Hence, some of the best features from the conventional oscillator and VNA approaches are combined to develop a low-cost and self-contained measurement system, including signal in- and output ability for real-time measurements. The pivotal aspect of the portable system is the transfer of the sophisticated high frequency approach into a quasi-static one. This enables the use of simple lumped electronics without the need of impedance matching circuits. Proof-of-concept was carried out by measuring conductivities of phosphate-buffered solutions and viscosities of glycerin. Sensitivities for temperature of 0.3%/°C, viscosity of 10.1% (mPa s)-1 and conductivity of 0.5% (S cm)-1 have been determined, respectively, which are competitive results compared to the benchmark approaches.

Advancements in meat packaging.

Science.gov (United States)

McMillin, Kenneth W

2017-10-01

Packaging of meat provides the same or similar benefits for raw chilled and processed meats as other types of food packaging. Although air-permeable packaging is most prevalent for raw chilled red meat, vacuum and modified atmosphere packaging offer longer shelf life. The major advancements in meat packaging have been in the widely used plastic polymers while biobased materials and their integration into composite packaging are receiving much attention for functionality and sustainability. At this time, active and intelligent packaging are not widely used for antioxidant, antimicrobial, and other functions to stabilize and enhance meat properties although many options are being developed and investigated. The advances being made in nanotechnology will be incorporated into food packaging and presumably into meat packaging when appropriate and useful. Intelligent packaging using sensors for transmission of desired information and prompting of subsequent changes in packaging materials, environments or the products to maintain safety and quality are still in developmental stages. Copyright © 2017 Elsevier Ltd. All rights reserved.

Liquid-Phase Packaging of a Glucose Oxidase Solution with Parylene Direct Encapsulation and an Ultraviolet Curing Adhesive Cover for Glucose Sensors

OpenAIRE

Seiichi Takamatsu; Hisanori Takano; Nguyen Binh-Khiem; Tomoyuki Takahata; Eiji Iwase; Kiyoshi Matsumoto; Isao Shimoyama

2010-01-01

We have developed a package for disposable glucose sensor chips using Parylene encapsulation of a glucose oxidase solution in the liquid phase and a cover structure made of an ultraviolet (UV) curable adhesive. Parylene was directly deposited onto a small volume (1 μL) of glucose oxidase solution through chemical vapor deposition. The cover and reaction chamber were constructed on Parylene film using a UV-curable adhesive and photolithography. The package was processed at room temperature to ...

Low-Power Radio and Image-Sensor Package, Phase I

Data.gov (United States)

National Aeronautics and Space Administration — One of the most effective sensor modalities for situational awareness is imagery. While typically high bandwidth and relegated to analog wireless communications,...

Mechanism for and method of biasing magnetic sensor

Science.gov (United States)

Kautz, David R.

2007-12-04

A magnetic sensor package having a biasing mechanism involving a coil-generated, resistor-controlled magnetic field for providing a desired biasing effect. In a preferred illustrated embodiment, the package broadly comprises a substrate; a magnetic sensor element; a biasing mechanism, including a coil and a first resistance element; an amplification mechanism; a filter capacitor element; and an encapsulant. The sensor is positioned within the coil. A current applied to the coil produces a biasing magnetic field. The biasing magnetic field is controlled by selecting a resistance value for the first resistance element which achieves the desired biasing effect. The first resistance element preferably includes a plurality of selectable resistors, the selection of one or more of which sets the resistance value.

Advanced Liquid-Free, Piezoresistive, SOI-Based Pressure Sensors for Measurements in Harsh Environments

Directory of Open Access Journals (Sweden)

Ha-Duong Ngo

2015-08-01

Full Text Available In this paper we present and discuss two innovative liquid-free SOI sensors for pressure measurements in harsh environments. The sensors are capable of measuring pressures at high temperatures. In both concepts media separation is realized using a steel membrane. The two concepts represent two different strategies for packaging of devices for use in harsh environments and at high temperatures. The first one is a “one-sensor-one-packaging_technology” concept. The second one uses a standard flip-chip bonding technique. The first sensor is a “floating-concept”, capable of measuring pressures at temperatures up to 400 °C (constant load with an accuracy of 0.25% Full Scale Output (FSO. A push rod (mounted onto the steel membrane transfers the applied pressure directly to the center-boss membrane of the SOI-chip, which is placed on a ceramic carrier. The chip membrane is realized by Deep Reactive Ion Etching (DRIE or Bosch Process. A novel propertied chip housing employing a sliding sensor chip that is fixed during packaging by mechanical preloading via the push rod is used, thereby avoiding chip movement, and ensuring optimal push rod load transmission. The second sensor can be used up to 350 °C. The SOI chips consists of a beam with an integrated centre-boss with was realized using KOH structuring and DRIE. The SOI chip is not “floating” but bonded by using flip-chip technology. The fabricated SOI sensor chip has a bridge resistance of 3250 Ω. The realized sensor chip has a sensitivity of 18 mV/µm measured using a bridge current of 1 mA.

Advanced Liquid-Free, Piezoresistive, SOI-Based Pressure Sensors for Measurements in Harsh Environments.

Science.gov (United States)

Ngo, Ha-Duong; Mukhopadhyay, Biswaijit; Ehrmann, Oswin; Lang, Klaus-Dieter

2015-08-18

In this paper we present and discuss two innovative liquid-free SOI sensors for pressure measurements in harsh environments. The sensors are capable of measuring pressures at high temperatures. In both concepts media separation is realized using a steel membrane. The two concepts represent two different strategies for packaging of devices for use in harsh environments and at high temperatures. The first one is a "one-sensor-one-packaging_technology" concept. The second one uses a standard flip-chip bonding technique. The first sensor is a "floating-concept", capable of measuring pressures at temperatures up to 400 °C (constant load) with an accuracy of 0.25% Full Scale Output (FSO). A push rod (mounted onto the steel membrane) transfers the applied pressure directly to the center-boss membrane of the SOI-chip, which is placed on a ceramic carrier. The chip membrane is realized by Deep Reactive Ion Etching (DRIE or Bosch Process). A novel propertied chip housing employing a sliding sensor chip that is fixed during packaging by mechanical preloading via the push rod is used, thereby avoiding chip movement, and ensuring optimal push rod load transmission. The second sensor can be used up to 350 °C. The SOI chips consists of a beam with an integrated centre-boss with was realized using KOH structuring and DRIE. The SOI chip is not "floating" but bonded by using flip-chip technology. The fabricated SOI sensor chip has a bridge resistance of 3250 Ω. The realized sensor chip has a sensitivity of 18 mV/µm measured using a bridge current of 1 mA.

500 C Electronic Packaging and Dielectric Materials for High Temperature Applications

Science.gov (United States)

Chen, Liang-yu; Neudeck, Philip G.; Spry, David J.; Beheim, Glenn M.; Hunter, Gary W.

2016-01-01

High-temperature environment operable sensors and electronics are required for exploring the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high temperature electronics, and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by these high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed. High-temperature environment operable sensors and electronics are required for probing the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and eventual applications of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high electronics and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed.

A fully packaged self-powered sensor based on near-field electrospun arrays of poly(vinylidene fluoride nano/micro fibers

Directory of Open Access Journals (Sweden)

Y.-K. Fuh

2018-02-01

Full Text Available Energy harvesting devices based on the triboelectric and piezoelectric principles have been widely developed to scavenge wasteful and tiny mechanical energy into usable electrical energy. In particular, triboelectric energy harvesting generators with relatively simpler structure and piezoelectric fiber-based counterpart with extremely light weight compositions showed a very promising application in the self-powered sensors. In this paper, a novel hybridization of graphenebased piezoelectric generator (GBPG and graphene-PET triboelectric generator (GPTG were simultaneously packaged. The integrated structure, graphene-based hybridized self-powered sensor (GHSPS, was demonstrated to be optically transparent and mechanically robust. For the piezoelectrically harvesting device, an in-situ poling and direct-write near-field electrospinning (NFES Poly(vinylidene fluoride (PVDF piezoelectric fibers were fabricated and integrated with a single layer chemical vapor deposition (CVD grown graphene. On the other hand for GPTG counterpart, two composite layers of a single layer graphene/PET simultaneously served as triboelectrically rubbing layers as well as bottom/top electrode. This GHSPS successfully superimposed both piezoelectric and triboelectric electricity and the synergistically higher output voltage/current/power were measured as ~6 V/280 nA/172 nW in one press-and-release cycle of finger induced motion. The proposed GHSPS showed a promising application in the field of self-powered sensors to be ubiquitously implemented in the future Industry 4.0 scenarios.

Solid electrolyte gas sensors based on cyclic voltammetry with one active electrode

Energy Technology Data Exchange (ETDEWEB)

Jasinski, G; Jasinski, P, E-mail: gregor@biomed.eti.pg.gda.pl [Gdansk University of Technology, Faculty of Electronics, Telecommunication and Informatics, Narutowicza 11/12, 80-233 Gdansk (Poland)

2011-10-29

Solid state gas sensors are cost effective, small, rugged and reliable. Typically electrochemical solid state sensors operate in either potentiometric or amperometric mode. However, a lack of selectivity is sometimes a shortcoming of such sensors. It seems that improvements of selectivity can be obtained in case of the electrocatalytic sensors, which operate in cyclic voltammetry mode. Their working principle is based on acquisition of an electric current, while voltage ramp is applied to the sensor. The current-voltage response depends in a unique way on the type and concentration of ambient gas. Most electrocatalytic sensors have symmetrical structure. They are in a form of pellets with two electrodes placed on their opposite sides. Electrochemical reactions occur simultaneously on both electrodes. In this paper results for sensors with only one active electrode exposed to ambient gas are presented. The other electrode was isolated from ambient gas with dielectric sealing. This sensor construction allows application of advanced measuring procedures, which permit sensor regeneration acceleration. Experiments were conducted on Nasicon sensors. Properties of two sensors, one with one active electrode and second with symmetrical structure, used for the detection of mixtures of NO{sub 2} and synthetic air are compared.

Extreme temperature packaging: challenges and opportunities

Science.gov (United States)

Johnson, R. Wayne

2016-05-01

Consumer electronics account for the majority of electronics manufactured today. Given the temperature limits of humans, consumer electronics are typically rated for operation from -40°C to +85°C. Military applications extend the range to -65°C to +125°C while underhood automotive electronics may see +150°C. With the proliferation of the Internet of Things (IoT), the goal of instrumenting (sensing, computation, transmission) to improve safety and performance in high temperature environments such as geothermal wells, nuclear reactors, combustion chambers, industrial processes, etc. requires sensors, electronics and packaging compatible with these environments. Advances in wide bandgap semiconductors (SiC and GaN) allow the fabrication of high temperature compatible sensors and electronics. Integration and packaging of these devices is required for implementation into actual applications. The basic elements of packaging are die attach, electrical interconnection and the package or housing. Consumer electronics typically use conductive adhesives or low melting point solders for die attach, wire bonds or low melting solder for electrical interconnection and epoxy for the package. These materials melt or decompose in high temperature environments. This paper examines materials and processes for high temperature packaging including liquid transient phase and sintered nanoparticle die attach, high melting point wires for wire bonding and metal and ceramic packages. The limitations of currently available solutions will also be discussed.

Reliability of industrial packaging for microsystems

DEFF Research Database (Denmark)

Reus, Roger De; Christensen, Carsten; Weichel, Steen

1998-01-01

. Protective coatings of amorphous silicon carbide and tantalum oxide are suitable candidates with etch rates below 0.1 Angstrom/h in aqueous solutions with pH II at temperatures up to 140 degrees C. Si-Ta-N films exhibit etch rates around 1 Angstrom/h. Parylene C coatings did not etch but peeled off after......Packaging concepts for silicon-based micromachined sensors exposed to harsh environments are explored. By exposing the sensors directly to the media and applying protection at the wafer level the packaging and assembly will be simplified as compared to conventional methods of fabrication...

Completion of the radioactive materials packaging handbook

International Nuclear Information System (INIS)

Shappert, L.B.

1998-01-01

'The Radioactive Materials Packaging Handbook: Design, Operation and Maintenance', which will serve as a replacement for the 'Cask Designers Guide'(1970), has now been completed and submitted to the Oak Ridge National Laboratory (ORNL) electronics publishing group for layout and printing; it is scheduled to be printed in late spring 1998. The Handbook, written by experts in their particular fields, is a compilation of technical chapters that address the design aspects of a package intended for transporting radioactive material in normal commerce; it was prepared under the direction of M. E. Wangler of the US DOE and is intended to provide a wealth of technical guidance that will give designers a better understanding of the regulatory approval process, preferences of regulators on specific aspects of package design, and the types of analyses that should be considered when designing a package to carry radioactive materials. Even though the Handbook is concerned with both small and large packagings, most of the emphasis is placed on large packagings that are capable of transporting fissile, radioactive sources (e.g. spent fuels). The safety analysis reports for packagings (SARPs) must address the widest range of technical topics in order to meet United States and/or international regulations, all of which are covered in the Handbook. One of the primary goals of the Handbook is to provide information which would guide designers of radioactive materials packages to make decisions that would most likely be acceptable to regulatory agencies during the approval process of the packaging. It was therefore important to find those authors who not only were experts in one or more of the areas that are addressed in a SARP, but who also had been exposed to the regulatory process or had operational experience dealing with a wide variety of package types. Twenty-five such people have contributed their time and talents to the development of this document, mostly on a volunteer basis

The corrosion rate of copper in a bentonite test package measured with electric resistance sensors

Energy Technology Data Exchange (ETDEWEB)

Rosborg, Bo [Division of Surface and Corrosion Science, KTH, Stockholm (Sweden); Kosec, Tadeja; Kranjc, Andrej; Kuhar, Viljem; Legat, Andraz [Slovenian National Building and Civil Engineering Institute, Ljubljana (Slovenia)

2012-12-15

LOT1 test parcel A2 was exposed for six years in the Aespoe Hard Rock Laboratory, which offers a realistic environment for the conditions that will prevail in a deep repository for high-level radioactive waste disposal in Sweden. The test parcel contained copper electrodes for real-time corrosion monitoring in bentonite ring 36, where the temperature was 24 deg C, and copper coupons in bentonite rings 22 and 30, where the temperature was higher. After retrieval of the test parcel in January 2006, a bentonite test package consisting of bentonite rings 35 - 37 was placed in a container and sealed with a thick layer of paraffin. Later the same year new copper electrodes were installed in the test package. In January 2007 electric resistance (ER) sensors of pure copper with a thickness of 35 {mu}m were also installed in the test package mainly to facilitate the interpretation of the results from the real-time corrosion monitoring with electrochemical techniques. The ER measurements have shown that the corrosion rate of pure copper exposed in an oxic bentonite/ saline groundwater environment at room temperate decreases slowly with time to low but measurable values. The corrosion rates estimated from the regularly performed EIS measurements replicate the ER data. Thus, for this oxic environment in which copper acquires corrosion potentials of the order of 200 mV (SHE) or higher, electrochemical measurements provide believable data. Comparing the recorded ER data with an estimate of the average corrosion rate based on comparing cross-sections from exposed and protected sensor elements, it is obvious that the former overestimates the actual corrosion rate, which is understandable. It seems as if electrochemical measurements can provide a better estimate of the corrosion rate; however, this is quite dependent on the use of proper measuring frequencies and evaluation methods. In this respect ER measurements are more reliable. It has been shown that real-time corrosion

The corrosion rate of copper in a bentonite test package measured with electric resistance sensors

International Nuclear Information System (INIS)

Rosborg, Bo; Kosec, Tadeja; Kranjc, Andrej; Kuhar, Viljem; Legat, Andraz

2012-12-01

LOT1 test parcel A2 was exposed for six years in the Aespoe Hard Rock Laboratory, which offers a realistic environment for the conditions that will prevail in a deep repository for high-level radioactive waste disposal in Sweden. The test parcel contained copper electrodes for real-time corrosion monitoring in bentonite ring 36, where the temperature was 24 deg C, and copper coupons in bentonite rings 22 and 30, where the temperature was higher. After retrieval of the test parcel in January 2006, a bentonite test package consisting of bentonite rings 35 - 37 was placed in a container and sealed with a thick layer of paraffin. Later the same year new copper electrodes were installed in the test package. In January 2007 electric resistance (ER) sensors of pure copper with a thickness of 35 μm were also installed in the test package mainly to facilitate the interpretation of the results from the real-time corrosion monitoring with electrochemical techniques. The ER measurements have shown that the corrosion rate of pure copper exposed in an oxic bentonite/ saline groundwater environment at room temperate decreases slowly with time to low but measurable values. The corrosion rates estimated from the regularly performed EIS measurements replicate the ER data. Thus, for this oxic environment in which copper acquires corrosion potentials of the order of 200 mV (SHE) or higher, electrochemical measurements provide believable data. Comparing the recorded ER data with an estimate of the average corrosion rate based on comparing cross-sections from exposed and protected sensor elements, it is obvious that the former overestimates the actual corrosion rate, which is understandable. It seems as if electrochemical measurements can provide a better estimate of the corrosion rate; however, this is quite dependent on the use of proper measuring frequencies and evaluation methods. In this respect ER measurements are more reliable. It has been shown that real-time corrosion

Color sensor and neural processor on one chip

Science.gov (United States)

Fiesler, Emile; Campbell, Shannon R.; Kempem, Lother; Duong, Tuan A.

1998-10-01

Low-cost, compact, and robust color sensor that can operate in real-time under various environmental conditions can benefit many applications, including quality control, chemical sensing, food production, medical diagnostics, energy conservation, monitoring of hazardous waste, and recycling. Unfortunately, existing color sensor are either bulky and expensive or do not provide the required speed and accuracy. In this publication we describe the design of an accurate real-time color classification sensor, together with preprocessing and a subsequent neural network processor integrated on a single complementary metal oxide semiconductor (CMOS) integrated circuit. This one-chip sensor and information processor will be low in cost, robust, and mass-producible using standard commercial CMOS processes. The performance of the chip and the feasibility of its manufacturing is proven through computer simulations based on CMOS hardware parameters. Comparisons with competing methodologies show a significantly higher performance for our device.

AliPDU Package Upgrade

CERN Document Server

"Martin, Michael

2015-01-01

"AliPDU Package" is a set of script, panels, and datapoints designed in WinCC to manage and monitor PDU's. PDU is an essential component in the data center, in order to make data center working properly through the monitoring of power distribution and environmental condition of the data center. In this project "AliPDU Package" is upgraded so it can be used to monitor environmental condition of data center using PDU's and external environmental sensor connected to PDU.

AliPDU Package Upgrade

CERN Document Server

Martin, Michael

2015-01-01

AliPDU Package is a set of script, panels, and datapoints designed in WinCC to manage and monitor PDU's. PDU is an essential component in the data center, in order to make data center working properly through the monitoring of power distribution and environmental condition of the data center. In this project "AliPDU Package" is upgraded so it can be used to monitor environmental condition of data center using PDU's and external environmental sensor connected to PDU.

MEMS packaging: state of the art and future trends

Science.gov (United States)

Bossche, Andre; Cotofana, Carmen V. B.; Mollinger, Jeff R.

1998-07-01

Now that the technology for Integrated sensor and MEMS devices has become sufficiently mature to allow mass production, it is expected that the prices of bare chips will drop dramatically. This means that the package prices will become a limiting factor in market penetration, unless low cost packaging solutions become available. This paper will discuss the developments in packaging technology. Both single-chip and multi-chip packaging solutions will be addressed. It first starts with a discussion on the different requirements that have to be met; both from a device point of view (open access paths to the environment, vacuum cavities, etc.) and from the application point of view (e.g. environmental hostility). Subsequently current technologies are judged on their applicability for MEMS and sensor packaging and a forecast is given for future trends. It is expected that the large majority of sensing devices will be applied in relative friendly environments for which plastic packages would suffice. Therefore, on the short term an important role is foreseen for recently developed plastic packaging techniques such as precision molding and precision dispensing. Just like in standard electronic packaging, complete wafer level packaging methods for sensing devices still have a long way to go before they can compete with the highly optimized and automated plastic packaging processes.

DOE-EM-45 Packaging Operations And Maintenance Course

International Nuclear Information System (INIS)

Watkins, R.; England, J.

2010-01-01

Savannah River National Laboratory - Savannah River Packaging Technology (SRNL-SRPT) delivered the inaugural offering of the Packaging Operations and Maintenance Course for DOE-EM-45's Packaging Certification Program (PCP) at the University of South Carolina Aiken on September 1 and 2, 2009. Twenty-nine students registered, attended, and completed this training. The DOE-EM-45 Packaging Certification Program (PCP) sponsored the presentation of a new training course, Packaging Maintenance and Operations, on September 1-2, 2009 at the University of South Carolina Aiken (USC-Aiken) campus in Aiken, SC. The premier offering of the course was developed and presented by the Savannah River National Laboratory, and attended by twenty-nine students across the DOE, NNSA and private industry. This training informed package users of the requirements associated with handling shipping containers at a facility (user) level and provided a basic overview of the requirements typically outlined in Safety Analysis Report for Packaging (SARP) Chapters 1, 7, and 8. The course taught packaging personnel about the regulatory nature of SARPs to help reduce associated and often costly packaging errors. Some of the topics covered were package contents, loading, unloading, storage, torque requirements, maintaining records, how to handle abnormal conditions, lessons learned, leakage testing (including demonstration), and replacement parts. The target audience for this course was facility operations personnel, facility maintenance personnel, and field quality assurance personnel who are directly involved in the handling of shipping containers. The training also aimed at writers of SARP Chapters 1, 7, and 8, package designers, and anyone else involved in radioactive material packaging and transportation safety. Student feedback and critiques of the training were very positive. SRNL will offer the course again at USC Aiken in September 2010.

Tamper indicating packaging

International Nuclear Information System (INIS)

Baumann, M.J.; Bartberger, J.C.; Welch, T.D.

1994-01-01

Protecting sensitive items from undetected tampering in an unattended environment is crucial to the success of non-proliferation efforts relying on the verification of critical activities. Tamper Indicating Packaging (TIP) technologies are applied to containers, packages, and equipment that require an indication of a tamper attempt. Examples include: the transportation and storage of nuclear material, the operation and shipment of surveillance equipment and monitoring sensors, and the retail storage of medicine and food products. The spectrum of adversarial tampering ranges from attempted concealment of a pin-hole sized penetration to the complete container replacement, which would involve counterfeiting efforts of various degrees. Sandia National Laboratories (SNL) has developed a technology base for advanced TIP materials, sensors, designs, and processes which can be adapted to various future monitoring systems. The purpose of this technology base is to investigate potential new technologies, and to perform basic research of advanced technologies. This paper will describe the theory of TIP technologies and recent investigations of TIP technologies at SNL

Integrated microsystems packaging approach with LCP

Science.gov (United States)

Jaynes, Paul; Shacklette, Lawrence W.

2006-05-01

Within the government communication market there is an increasing push to further miniaturize systems with the use of chip-scale packages, flip-chip bonding, and other advances over traditional packaging techniques. Harris' approach to miniaturization includes these traditional packaging advances, but goes beyond this level of miniaturization by combining the functional and structural elements of a system, thus creating a Multi-Functional Structural Circuit (MFSC). An emerging high-frequency, near hermetic, thermoplastic electronic substrate material, Liquid Crystal Polymer (LCP), is the material that will enable the combination of the electronic circuit and the physical structure of the system. The first embodiment of this vision for Harris is the development of a battlefield acoustic sensor module. This paper will introduce LCP and its advantages for MFSC, present an example of the work that Harris has performed, and speak to LCP MFSCs' potential benefits to miniature communications modules and sensor platforms.

Optical fiber sensors embedded in flexible polymer foils

Science.gov (United States)

van Hoe, Bram; van Steenberge, Geert; Bosman, Erwin; Missinne, Jeroen; Geernaert, Thomas; Berghmans, Francis; Webb, David; van Daele, Peter

2010-04-01

In traditional electrical sensing applications, multiplexing and interconnecting the different sensing elements is a major challenge. Recently, many optical alternatives have been investigated including optical fiber sensors of which the sensing elements consist of fiber Bragg gratings. Different sensing points can be integrated in one optical fiber solving the interconnection problem and avoiding any electromagnetical interference (EMI). Many new sensing applications also require flexible or stretchable sensing foils which can be attached to or wrapped around irregularly shaped objects such as robot fingers and car bumpers or which can even be applied in biomedical applications where a sensor is fixed on a human body. The use of these optical sensors however always implies the use of a light-source, detectors and electronic circuitry to be coupled and integrated with these sensors. The coupling of these fibers with these light sources and detectors is a critical packaging problem and as it is well-known the costs for packaging, especially with optoelectronic components and fiber alignment issues are huge. The end goal of this embedded sensor is to create a flexible optical sensor integrated with (opto)electronic modules and control circuitry. To obtain this flexibility, one can embed the optical sensors and the driving optoelectronics in a stretchable polymer host material. In this article different embedding techniques for optical fiber sensors are described and characterized. Initial tests based on standard manufacturing processes such as molding and laser structuring are reported as well as a more advanced embedding technique based on soft lithography processing.

Note: Split PID control--two sensors can be better than one.

Science.gov (United States)

Znaimer, Leith; Bechhoefer, John

2014-10-01

The traditional proportional-integral-derivative (PID) algorithm for regulation suffers from a tradeoff: placing the sensor near the sample being regulated ensures that its steady-state temperature matches the desired setpoint. However, the propagation delay (lag) between heater and sample can limit the control bandwidth. Moving the sensor closer to the heater reduces the lag and increases the bandwidth but introduces offsets and drifts into the temperature of the sample. Here, we explore the consequences of using two probes-one near the heater, one near the sample-and assigning the integral term to the sample probe and the other terms to the heater probe. The split-PID algorithm can outperform PID control loops based on one sensor.

HEAT Sensor: Harsh Environment Adaptable Thermionic Sensor

Energy Technology Data Exchange (ETDEWEB)

Limb, Scott J. [Palo Alto Research Center, Palo Alto, CA (United States)

2016-05-31

This document is the final report for the “HARSH ENVIRONMENT ADAPTABLE THERMIONIC SENSOR” project under NETL’s Crosscutting contract DE-FE0013062. This report addresses sensors that can be made with thermionic thin films along with the required high temperature hermetic packaging process. These sensors can be placed in harsh high temperature environments and potentially be wireless and self-powered.

A Direct Algorithm Maple Package of One-Dimensional Optimal System for Group Invariant Solutions

Science.gov (United States)

Zhang, Lin; Han, Zhong; Chen, Yong

2018-01-01

To construct the one-dimensional optimal system of finite dimensional Lie algebra automatically, we develop a new Maple package One Optimal System. Meanwhile, we propose a new method to calculate the adjoint transformation matrix and find all the invariants of Lie algebra in spite of Killing form checking possible constraints of each classification. Besides, a new conception called invariance set is raised. Moreover, this Maple package is proved to be more efficiency and precise than before by applying it to some classic examples. Supported by the Global Change Research Program of China under Grant No. 2015CB95390, National Natural Science Foundation of China under Grant Nos. 11675054 and 11435005, and Shanghai Collaborative Innovation Center of Trustworthy Software for Internet of Things under Grant No. ZF1213

Challenges in the Packaging of MEMS

Energy Technology Data Exchange (ETDEWEB)

Malshe, A.P.; Singh, S.B.; Eaton, W.P.; O' Neal, C.; Brown, W.D.; Miller, W.M.

1999-03-26

The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications. Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and few publications have been completed on the packaging of these devices. This is despite the fact that packaging is a very large percentage of the total cost of MEMS devices. The main difference between IC packaging and MEMS packaging is that MEMS packaging is almost always application specific and greatly affected by its environment and packaging techniques such as die handling, die attach processes, and lid sealing. Many of these aspects are directly related to the materials used in the packaging processes. MEMS devices that are functional in wafer form can be rendered inoperable after packaging. MEMS dies must be handled only from the chip sides so features on the top surface are not damaged. This eliminates most current die pick-and-place fixtures. Die attach materials are key to MEMS packaging. Using hard die attach solders can create high stresses in the MEMS devices, which can affect their operation greatly. Low-stress epoxies can be high-outgassing, which can also affect device performance. Also, a low modulus die attach can allow the die to move during ultrasonic wirebonding resulting to low wirebond strength. Another source of residual stress is the lid sealing process. Most MEMS based sensors and devices require a hermetically sealed package. This can be done by parallel seam welding the package lid, but at the cost of further induced stress on the die. Another issue of MEMS packaging is the media compatibility of the packaged device. MEMS unlike ICS often interface with their environment, which could be high pressure or corrosive. The main conclusion we can draw about MEMS packaging is that the package affects the performance and reliability of the MEMS devices. There is a

Liquid-Phase Packaging of a Glucose Oxidase Solution with Parylene Direct Encapsulation and an Ultraviolet Curing Adhesive Cover for Glucose Sensors

Directory of Open Access Journals (Sweden)

Seiichi Takamatsu

2010-06-01

Full Text Available We have developed a package for disposable glucose sensor chips using Parylene encapsulation of a glucose oxidase solution in the liquid phase and a cover structure made of an ultraviolet (UV curable adhesive. Parylene was directly deposited onto a small volume (1 μL of glucose oxidase solution through chemical vapor deposition. The cover and reaction chamber were constructed on Parylene film using a UV-curable adhesive and photolithography. The package was processed at room temperature to avoid denaturation of the glucose oxidase. The glucose oxidase solution was encapsulated and unsealed. Glucose sensing was demonstrated using standard amperometric detection at glucose concentrations between 0.1 and 100 mM, which covers the glucose concentration range of diabetic patients. Our proposed Parylene encapsulation and UV-adhesive cover form a liquid phase glucose-oxidase package that has the advantages of room temperature processing and direct liquid encapsulation of a small volume solution without use of conventional solidifying chemicals.

Robust optical sensors for safety critical automotive applications

Science.gov (United States)

De Locht, Cliff; De Knibber, Sven; Maddalena, Sam

2008-02-01

Optical sensors for the automotive industry need to be robust, high performing and low cost. This paper focuses on the impact of automotive requirements on optical sensor design and packaging. Main strategies to lower optical sensor entry barriers in the automotive market include: Perform sensor calibration and tuning by the sensor manufacturer, sensor test modes on chip to guarantee functional integrity at operation, and package technology is key. As a conclusion, optical sensor applications are growing in automotive. Optical sensor robustness matured to the level of safety critical applications like Electrical Power Assisted Steering (EPAS) and Drive-by-Wire by optical linear arrays based systems and Automated Cruise Control (ACC), Lane Change Assist and Driver Classification/Smart Airbag Deployment by camera imagers based systems.

Monitoring Method and Apparatus Using Asynchronous, One-Way Transmission from Sensor to Base Station

Science.gov (United States)

Jensen, Scott L. (Inventor); Drouant, George J. (Inventor)

2013-01-01

A monitoring system is disclosed, which includes a base station and at least one sensor unit that is separate from the base station. The at least one sensor unit resides in a dormant state until it is awakened by the triggering of a vibration-sensitive switch. Once awakened, the sensor may take a measurement, and then transmit to the base station the measurement. Once data is transmitted from the sensor to the base station, the sensor may return to its dormant state. There may be various sensors for each base station and the various sensors may optionally measure different quantities, such as current, voltage, single-axis and/or three-axis magnetic fields.

Impact of one-dose package dispensing with patient counseling on medication adherence in geriatrics suffering from chronic disorders

Directory of Open Access Journals (Sweden)

Narayana Goruntla

2018-01-01

Full Text Available Introduction: Medication nonadherence in elderly patients could result in a waste of medical expenses in a long-time span as well as deterioration of the patient's medical condition. Aim: The aim of this study is to evaluate the impact of one-dose package dispensing with patient counseling on medication adherence among elderly patients suffering from chronic disorders. Settings and Design: This is prospective, open-labeled, randomized trial carried out at dispensing pharmacy of the secondary care referral hospital, located in resource-limited settings of Anantapur District, Andhra Pradesh, India. Subjects and Methods: A total of 330 (aged ≥60 years patients were randomly assigned to one of three study groups: Group A (n = 110, no change in dosing and packing; Group B (n = 110, one-dose package dispensing; Group C (n = 110, One-dose package dispensing with patient counseling. Medication adherence levels were measured using a pill count and visual analog scale (VAS method at baseline and follow-up (after 1 month. Statistical Analysis: Descriptive statistics were used to represent the sociodemographic, clinical, and medication adherence profile of study participants. One-way ANOVA test is used to assess significant differences between three groups with a P 60 years who are on multiple medications can benefit from one-dose package dispensing and appropriate counseling. This will improve medication adherence hence better outcomes.

Realtime 3D stress measurement in curing epoxy packaging

DEFF Research Database (Denmark)

Richter, Jacob; Hyldgård, A.; Birkelund, Karen

2007-01-01

This paper presents a novel method to characterize stress in microsystem packaging. A circular p-type piezoresistor is implemented on a (001) silicon chip. We use the circular stress sensor to determine the packaging induced stress in a polystyrene tube filled with epoxy. The epoxy curing process...

The TAHMO sensor design challenge: unlocking and empowering local African talent

Science.gov (United States)

Hut, R.; Van De Giesen, N.

2013-12-01

The TAHMO initiative aims to develop and install 20.000 weather stations in sub Saharan Africa. The success of this endeavor greatly depends on using local knowledge, as well as support from local communities. A sensor design competition was held in which participants were asked to design a novel weather sensor. Promotion of the competition was focused on Africa and mainly African student teams responded. The best 15 out of 34 submission were send a 'maker package' containing the tools and materials to physically make their sensors. Winners of the maker packages were asked to upload a video of the process of building their sensors. Using these videos, 9 teams were invited to a final one-week workshop in which all teams worked together to connect all their sensors and automatically upload measurement readings to the internet. This goal was achieved on the last day of the workshop. http://www.youtube.com/watch?v=EOTPMp-13Bs The main results of this competition, the lessons learned and the road ahead for TAHMO will be presented.

Airborne Sensor Thermal Management Solution

Energy Technology Data Exchange (ETDEWEB)

Ng, K. K. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

2015-06-03

The customer wants to outfit aircraft (de Havilland Twin Otter) with optical sensors. In previous product generations the sensor line-of-sight direction was fixed – the sensor’s direction relied on the orientation of the aircraft. The next generation sensor will be packaged in a rotatable turret so that the line-of-sight is reasonably independent of the aircraft’s orientation. This turret will be mounted on a boom protruding from the side of the aircraft. The customer wants to outfit aircraft (de Havilland Twin Otter) with optical sensors. In previous product generations the sensor line-of-sight direction was fixed – the sensor’s direction relied on the orientation of the aircraft. The next generation sensor will be packaged in a rotatable turret so that the line-of-sight is reasonably independent of the aircraft’s orientation. This turret will be mounted on a boom protruding from the side of the aircraft.

One-Dimensional Contact Mode Interdigitated Center of Pressure Sensor (CMIPS)

Science.gov (United States)

Xu, Tian-Bing; Kang, Jinho; Park, Cheol; Harrison, Joycelyn S.; Guerreiro, Nelson M.; Hubbard, James E.

2009-01-01

A one dimensional contact mode interdigitated center of pressure sensor (CMIPS) has been developed. The experimental study demonstrated that the CMIPS has the capability to measure the overall pressure as well as the center of pressure in one dimension, simultaneously. A theoretical model for the CMIPS is established here based on the equivalent circuit of the configuration of the CMIPS as well as the material properties of the sensor. The experimental results match well with theoretical modeling predictions. A system mapped with two or more pieces of the CMIPS can be used to obtain information from the pressure distribution in multi-dimensions.

Portal protein functions akin to a DNA-sensor that couples genome-packaging to icosahedral capsid maturation

Science.gov (United States)

Lokareddy, Ravi K.; Sankhala, Rajeshwer S.; Roy, Ankoor; Afonine, Pavel V.; Motwani, Tina; Teschke, Carolyn M.; Parent, Kristin N.; Cingolani, Gino

2017-01-01

Tailed bacteriophages and herpesviruses assemble infectious particles via an empty precursor capsid (or ‘procapsid') built by multiple copies of coat and scaffolding protein and by one dodecameric portal protein. Genome packaging triggers rearrangement of the coat protein and release of scaffolding protein, resulting in dramatic procapsid lattice expansion. Here, we provide structural evidence that the portal protein of the bacteriophage P22 exists in two distinct dodecameric conformations: an asymmetric assembly in the procapsid (PC-portal) that is competent for high affinity binding to the large terminase packaging protein, and a symmetric ring in the mature virion (MV-portal) that has negligible affinity for the packaging motor. Modelling studies indicate the structure of PC-portal is incompatible with DNA coaxially spooled around the portal vertex, suggesting that newly packaged DNA triggers the switch from PC- to MV-conformation. Thus, we propose the signal for termination of ‘Headful Packaging' is a DNA-dependent symmetrization of portal protein. PMID:28134243

Evaporator Superheat Control With One Temperature Sensor Using Qualitative System Knowledge

DEFF Research Database (Denmark)

Vinther, Kasper; Hillerup Lyhne, Casper; Baasch Sørensen, Erik

2012-01-01

This paper proposes a novel method for superheat control using only a single temperature sensor at the outlet of the evaporator, while eliminating the need for a pressure sensor. An inner loop controls the outlet temperature and an outer control loop provides a reference set point, which is based...... filling of the evaporator, with only one temperature sensor. No a priori model knowledge was used and it is anticipated that the method is applicable on a wide variety of refrigeration systems....

Supporting Learning with Wireless Sensor Data

Directory of Open Access Journals (Sweden)

Arttu Perttula

2013-03-01

Full Text Available In this article, learning is studied in in situ applications that involve sensors. The main questions are how to conceptualize experiential learning involving sensors and what kinds of learning applications using sensors already exist or could be designed. It is claimed that experiential learning, context information and sensor data supports twenty first century learning. The concepts of context, technology-mediated experiences, shared felt experiences and experiential learning theory will be used to describe a framework for sensor-based mobile learning environments. Several scenarios and case examples using sensors and sensor data will be presented, and they will be analyzed using the framework. Finally, the article contributes to the discussion concerning the role of technology-mediated learning experiences and collective sensor data in developing twenty first century learning by characterizing what kinds of skills and competences are supported in learning situations that involve sensors.

Intelligent packaging for monitoring food quality: a case study on fresh fish

NARCIS (Netherlands)

Heising, J.K.

2014-01-01

Background

Foods are prone to quality degradation in the whole supply chain, but the possibilities for monitoring the quality of foods inside the package are limited. When sensors of quality indicators are included into the package of a food, the package can become an

DISPL: a software package for one and two spatially dimensioned kinetics-diffusion problems. [FORTRAN for IBM computers

Energy Technology Data Exchange (ETDEWEB)

Leaf, G K; Minkoff, M; Byrne, G D; Sorensen, D; Bleakney, T; Saltzman, J

1978-11-01

DISPL is a software package for solving some second-order nonlinear systems of partial differential equations including parabolic, elliptic, hyperbolic, and some mixed types such as parabolic--elliptic equations. Fairly general nonlinear boundary conditions are allowed as well as interface conditions for problems in an inhomogeneous media. The spatial domain is one- or two-dimensional with Cartesian, cylindrical, or spherical (in one dimension only) geometry. The numerical method is based on the use of Galerkin's procedure combined with the use of B-splines in order to reduce the system of PDE's to a system of ODE's. The latter system is then solved with a sophisticated ODE software package. Software features include extensive dump/restart facilities, free format input, moderate printed output capability, dynamic storage allocation, and three graphics packages. 17 figures, 9 tables.

Investigation of Anticipatory Postural Adjustments during One-Leg Stance Using Inertial Sensors: Evidence from Subjects with Parkinsonism.

Science.gov (United States)

Bonora, Gianluca; Mancini, Martina; Carpinella, Ilaria; Chiari, Lorenzo; Ferrarin, Maurizio; Nutt, John G; Horak, Fay B

2017-01-01

The One-Leg Stance (OLS) test is a widely adopted tool for the clinical assessment of balance in the elderly and in subjects with neurological disorders. It was previously showed that the ability to control anticipatory postural adjustments (APAs) prior to lifting one leg is significantly impaired by idiopathic Parkinson's disease (iPD). However, it is not known how APAs are affected by other types of parkinsonism, such as frontal gait disorders (FGD). In this study, an instrumented OLS test based on wearable inertial sensors is proposed to investigate both the initial anticipatory phase and the subsequent unipedal balance. The sensitivity and the validity of the test have been evaluated. Twenty-five subjects with iPD presenting freezing of gait (FOG), 33 with iPD without FOG, 13 with FGD, and 32 healthy elderly controls were recruited. All subjects wore three inertial sensors positioned on the posterior trunk (L4-L5), and on the left and right frontal face of the tibias. Participants were asked to lift a foot and stand on a single leg as long as possible with eyes open, as proposed by the mini-BESTest. Temporal parameters and trunk acceleration were extracted from sensors and compared among groups. The results showed that, regarding the anticipatory phase, the peak of mediolateral trunk acceleration was significantly reduced compared to healthy controls ( p   0.74), demonstrating the method's validity. Our findings support the validity of the proposed method for assessing the OLS test and its sensitivity in distinguishing among the tested groups. The instrumented test discriminated between healthy controls and people with parkinsonism and among the three groups with parkinsonism. The objective characterization of the initial anticipatory phase represents an interesting improvement compared to most clinical OLS tests.

GRIP LIGHTNING INSTRUMENT PACKAGE (LIP) V1

Data.gov (United States)

National Aeronautics and Space Administration — The Lightning Instrument Package (LIP) consists of 6 rotating vane type electric field sensors along with a central computer to record and monitor the instruments....

Intelligent Packaging Systems: Sensors and Nanosensors to Monitor Food Quality and Safety

Directory of Open Access Journals (Sweden)

Guillermo Fuertes

2016-01-01

Full Text Available The application of nanotechnology in different areas of food packaging is an emerging field that will grow rapidly in the coming years. Advances in food safety have yielded promising results leading to the development of intelligent packaging (IP. By these containers, it is possible to monitor and provide information of the condition of food, packaging, or the environment. This article describes the role of the different concepts of intelligent packaging. It is possible that this new technology could reach enhancing food safety, improving pathogen detection time, and controlling the quality of food and packaging throughout the supply chain.

AN/FSY-3 Space Fence System – Sensor Site One/Operations Center Integration Status and Sensor Site Two Planned Capability

Science.gov (United States)

Fonder, G. P.; Hack, P. J.; Hughes, M. R.

This paper covers two topics related to Space Fence System development: Sensor Site One / Operations Center construction and integration status including risk reduction integration and test efforts at the Moorestown, NJ Integrated Test Bed (ITB); and the planned capability of Sensor Site Two. The AN/FSY-3 Space Fence System is a ground-based system of S-band radars integrated with an Operations Center designed to greatly enhance the Air Force Space Surveillance network. The radar architecture is based on Digital Beam-forming. This capability permits tremendous user-defined flexibility to customize volume surveillance and track sectors instantaneously without impacting routine surveillance functions. Space Fence provides unprecedented sensitivity, coverage and tracking accuracy, and contributes to key mission threads with the ability to detect, track and catalog small objects in LEO, MEO and GEO. The system is net-centric and will seamlessly integrate into the existing Space Surveillance Network, providing services to external users—such as JSpOC—and coordinating handoffs to other SSN sites. Sensor Site One construction on the Kwajalein Atoll is in progress and nearing completion. The Operations Center in Huntsville, Alabama has been configured and will be integrated with Sensor Site One in the coming months. System hardware, firmware, and software is undergoing integration testing at the Mooretown, NJ ITB and will be deployed at Sensor Site One and the Operations Center. The preliminary design for Sensor Site Two is complete and will provide critical coverage, timeliness, and operational flexibility to the overall system.

Documentation package for the RFID temperature monitoring system (Model 9977 packages at NTS)

International Nuclear Information System (INIS)

Chen, K.; Tsai, H.

2009-01-01

The technical basis for extending the Model 9977 shipping package periodic maintenance beyond the one-year interval to a maximum of five years is based on the performance of the O-ring seals and the environmental conditions. The DOE Packaging Certification Program (PCP) has tasked Argonne National Laboratory to develop a Radio-Frequency Identification (RFID) temperature monitoring system for use by the facility personnel at DAF/NTS. The RFID temperature monitoring system, depicted in the figure below, consists of the Mk-1 RFId tags, a reader, and a control computer mounted on a mobile platform that can operate as a stand-alone system, or it can be connected to the local IT network. As part of the Conditions of Approval of the CoC, the user must complete the prescribed training to become qualified and be certified for operation of the RFID temperature monitoring system. The training course will be administered by Argonne National Laboratory on behalf of the Headquarters Certifying Official. This is a complete documentation package for the RFID temperature monitoring system of the Model 9977 packagings at NTS. The documentation package will be used for training and certification. The table of contents are: Acceptance Testing Procedure of MK-1 RFID Tags for DOE/EM Nuclear Materials Management Applications; Acceptance Testing Result of MK-1 RFID Tags for DOE/EM Nuclear Materials Management Applications; Performance Test of the Single Bolt Seal Sensor for the Model 9977 Packaging; Calibration of Built-in Thermistors in RFID Tags for Nevada Test Site; Results of Calibration of Built-in Thermistors in RFID Tags; Results of Thermal Calibration of Second Batch of MK-I RFID Tags; Procedure for Installing and Removing MK-1 RFID Tag on Model 9977 Drum; User Guide for RFID Reader and Software for Temperature Monitoring of Model 9977 Drums at NTS; Software Quality Assurance Plan (SQAP) for the ARG-US System; Quality Category for the RFID Temperature Monitoring System; The

Nanotechnology for Food Packaging and Food Quality Assessment.

Science.gov (United States)

Rossi, Marco; Passeri, Daniele; Sinibaldi, Alberto; Angjellari, Mariglen; Tamburri, Emanuela; Sorbo, Angela; Carata, Elisabetta; Dini, Luciana

Nanotechnology has paved the way to innovative food packaging materials and analytical methods to provide the consumers with healthier food and to reduce the ecological footprint of the whole food chain. Combining antimicrobial and antifouling properties, thermal and mechanical protection, oxygen and moisture barrier, as well as to verify the actual quality of food, e.g., sensors to detect spoilage, bacterial growth, and to monitor incorrect storage conditions, or anticounterfeiting devices in food packages may extend the products shelf life and ensure higher quality of foods. Also the ecological footprint of food chain can be reduced by developing new completely recyclable and/or biodegradable packages from natural and eco-friendly resources. The contribution of nanotechnologies to these goals is reviewed in this chapter, together with a description of portable devices ("lab-on-chip," sensors, nanobalances, etc.) which can be used to assess the quality of food and an overview of regulations in force on food contact materials. © 2017 Elsevier Inc. All rights reserved.

Cryogenic, Absolute, High Pressure Sensor

Science.gov (United States)

Chapman, John J. (Inventor); Shams. Qamar A. (Inventor); Powers, William T. (Inventor)

2001-01-01

A pressure sensor is provided for cryogenic, high pressure applications. A highly doped silicon piezoresistive pressure sensor is bonded to a silicon substrate in an absolute pressure sensing configuration. The absolute pressure sensor is bonded to an aluminum nitride substrate. Aluminum nitride has appropriate coefficient of thermal expansion for use with highly doped silicon at cryogenic temperatures. A group of sensors, either two sensors on two substrates or four sensors on a single substrate are packaged in a pressure vessel.

Cryogenic High Pressure Sensor Module

Science.gov (United States)

Chapman, John J. (Inventor); Shams, Qamar A. (Inventor); Powers, William T. (Inventor)

1999-01-01

A pressure sensor is provided for cryogenic, high pressure applications. A highly doped silicon piezoresistive pressure sensor is bonded to a silicon substrate in an absolute pressure sensing configuration. The absolute pressure sensor is bonded to an aluminum nitride substrate. Aluminum nitride has appropriate coefficient of thermal expansion for use with highly doped silicon at cryogenic temperatures. A group of sensors, either two sensors on two substrates or four sensors on a single substrate are packaged in a pressure vessel.

Gain Enhanced LTCC System-on-Package for UMRR Applications

KAUST Repository

Shamim, Atif; Ghaffar, Farhan Abdul; Khalid, Muhammad Umair; Salama, Khaled N.

2014-01-01

An apparatus, system, and method for Gain Enhanced LTCC System-on-Package radar sensor. The sensor includes a substrate and an integrated circuit coupled to the substrate, where the integrated circuit is configured to transmit and receive radio frequency (RF) signals. An antenna may be coupled to the integrated circuit and a lens may be coupled to the antenna. The lens may be configured to enhance the gain of the sensor.

Gain Enhanced LTCC System-on-Package for UMRR Applications

KAUST Repository

Shamim, Atif

2014-10-14

An apparatus, system, and method for Gain Enhanced LTCC System-on-Package radar sensor. The sensor includes a substrate and an integrated circuit coupled to the substrate, where the integrated circuit is configured to transmit and receive radio frequency (RF) signals. An antenna may be coupled to the integrated circuit and a lens may be coupled to the antenna. The lens may be configured to enhance the gain of the sensor.

PORTABLE ACOUSTIC MONITORING PACKAGE (PAMP)

Energy Technology Data Exchange (ETDEWEB)

John l. Loth; Gary J. Morris; George M. Palmer; Richard Guiler; Deepak Mehra

2003-07-01

The 1st generation acoustic monitoring package was designed to detect and analyze weak acoustic signals inside natural gas transmission lines. Besides a microphone it housed a three-inch diameter aerodynamic acoustic signal amplifier to maximize sensitivity to leak induced {Delta}p type signals. The theory and test results of this aerodynamic signal amplifier was described in the master's degree thesis of our Research Assistant Deepak Mehra who is about to graduate. To house such a large three-inch diameter sensor required the use of a steel 300-psi rated 4 inch weld neck flange, which itself weighed already 29 pounds. The completed 1st generation Acoustic Monitoring Package weighed almost 100 pounds. This was too cumbersome to mount in the field, on an access port at a pipeline shut-off valve. Therefore a 2nd generation and truly Portable Acoustic Monitor was built. It incorporated a fully self-contained {Delta}p type signal sensor, rated for line pressures up to 1000 psi with a base weight of only 6 pounds. This is the Rosemont Inc. Model 3051CD-Range 0, software driven sensor, which is believed to have industries best total performance. Its most sensitive unit was purchased with a {Delta}p range from 0 to 3 inch water. This resulted in the herein described 2nd generation: Portable Acoustic Monitoring Package (PAMP) for pipelines up to 1000 psi. Its 32-pound total weight includes an 18-volt battery. Together with a 3 pound laptop with its 4-channel data acquisition card, completes the equipment needed for field acoustic monitoring of natural gas transmission pipelines.

Safety Analysis Report - Packages, 9965, 9968, 9972-9975 Packages

International Nuclear Information System (INIS)

Blanton, P.

2000-01-01

This Safety Analysis Report for Packaging (SARP) documents the analysis and testing performed on four type B Packages: the 9972, 9973, 9974, and 9975 packages. Because all four packages have similar designs with very similar performance characteristics, all of them are presented in a single SARP. The performance evaluation presented in this SARP documents the compliance of the 9975 package with the regulatory safety requirements. Evaluations of the 9972, 9973, and 9974 packages support that of the 9975. To avoid confusion arising from the inclusion of four packages in a single document, the text segregates the data for each package in such a way that the reader interested in only one package can progress from Chapter 1 through Chapter 9. The directory at the beginning of each chapter identifies each section that should be read for a given package. Sections marked ''all'' are generic to all packages

Data simulation in machine olfaction with the R package chemosensors.

Directory of Open Access Journals (Sweden)

Andrey Ziyatdinov

Full Text Available In machine olfaction, the design of applications based on gas sensor arrays is highly dependent on the robustness of the signal and data processing algorithms. While the practice of testing the algorithms on public benchmarks is not common in the field, we propose software for performing data simulations in the machine olfaction field by generating parameterized sensor array data. The software is implemented as an R language package chemosensors which is open-access, platform-independent and self-contained. We introduce the concept of a virtual sensor array which can be used as a data generation tool. In this work, we describe the data simulation workflow which basically consists of scenario definition, virtual array parameterization and the generation of sensor array data. We also give examples of the processing of the simulated data as proof of concept for the parameterized sensor array data: the benchmarking of classification algorithms, the evaluation of linear- and non-linear regression algorithms, and the biologically inspired processing of sensor array data. All the results presented were obtained under version 0.7.6 of the chemosensors package whose home page is chemosensors.r-forge.r-project.org.

Portal protein functions akin to a DNA-sensor that couples genome-packaging to icosahedral capsid maturation

Energy Technology Data Exchange (ETDEWEB)

Lokareddy, Ravi K.; Sankhala, Rajeshwer S.; Roy, Ankoor; Afonine, Pavel V.; Motwani, Tina; Teschke, Carolyn M.; Parent, Kristin N.; Cingolani, Gino (Rutgers); (LBNL); (Connecticut); (TJU); (MSU)

2017-01-30

Tailed bacteriophages and herpesviruses assemble infectious particles via an empty precursor capsid (or ‘procapsid’) built by multiple copies of coat and scaffolding protein and by one dodecameric portal protein. Genome packaging triggers rearrangement of the coat protein and release of scaffolding protein, resulting in dramatic procapsid lattice expansion. Here, we provide structural evidence that the portal protein of the bacteriophage P22 exists in two distinct dodecameric conformations: an asymmetric assembly in the procapsid (PC-portal) that is competent for high affinity binding to the large terminase packaging protein, and a symmetric ring in the mature virion (MV-portal) that has negligible affinity for the packaging motor. Modelling studies indicate the structure of PC-portal is incompatible with DNA coaxially spooled around the portal vertex, suggesting that newly packaged DNA triggers the switch from PC- to MV-conformation. Thus, we propose the signal for termination of ‘Headful Packaging’ is a DNA-dependent symmetrization of portal protein.

Twenty-One Genome Sequences from Pseudomonas Species and 19 Genome Sequences from Diverse Bacteria Isolated from the Rhizosphere and Endosphere of Populus deltoides

Energy Technology Data Exchange (ETDEWEB)

Brown, Steven D [ORNL; Utturkar, Sagar M [ORNL; Klingeman, Dawn Marie [ORNL; Johnson, Courtney M [ORNL; Martin, Stanton [ORNL; Land, Miriam L [ORNL; Lu, Tse-Yuan [ORNL; Schadt, Christopher Warren [ORNL; Doktycz, Mitchel John [ORNL; Pelletier, Dale A [ORNL

2012-01-01

To aid in the investigation of the Populus deltoides microbiome we generated draft genome sequences for twenty one Pseudomonas and twenty one other diverse bacteria isolated from Populus deltoides roots. Genome sequences for isolates similar to Acidovorax, Bradyrhizobium, Brevibacillus, Burkholderia, Caulobacter, Chryseobacterium, Flavobacterium, Herbaspirillum, Novosphingobium, Pantoea, Phyllobacterium, Polaromonas, Rhizobium, Sphingobium and Variovorax were generated.

Packaging Effects on RadFET Sensors for High Energy Physics Experiments

CERN Document Server

Mekki, J; Glaser, M; Guatelli, S; Moll, M; Pia, M G; Ravotti, F

2009-01-01

RadFETs in customized chip carrier packages are installed in the LHC Experiments as radiation monitors. The package influence on the dose measurement in the complex LHC radiation environment is evaluated using Geant4 simulations and experimental data.

Multi-Parameter Aerosol Scattering Sensor

Science.gov (United States)

Greenberg, Paul S.; Fischer, David G.

2011-01-01

This work relates to the development of sensors that measure specific aerosol properties. These properties are in the form of integrated moment distributions, i.e., total surface area, total mass, etc., or mathematical combinations of these moment distributions. Specifically, the innovation involves two fundamental features: a computational tool to design and optimize such sensors and the embodiment of these sensors in actual practice. The measurement of aerosol properties is a problem of general interest. Applications include, but are not limited to, environmental monitoring, assessment of human respiratory health, fire detection, emission characterization and control, and pollutant monitoring. The objectives for sensor development include increased accuracy and/or dynamic range, the inclusion in a single sensor of the ability to measure multiple aerosol properties, and developing an overall physical package that is rugged, compact, and low in power consumption, so as to enable deployment in harsh or confined field applications, and as distributed sensor networks. Existing instruments for this purpose include scattering photometers, direct-reading mass instruments, Beta absorption devices, differential mobility analyzers, and gravitational samplers. The family of sensors reported here is predicated on the interaction of light and matter; specifically, the scattering of light from distributions of aerosol particles. The particular arrangement of the sensor, e.g. the wavelength(s) of incident radiation, the number and location of optical detectors, etc., can be derived so as to optimize the sensor response to aerosol properties of practical interest. A key feature of the design is the potential embodiment as an extremely compact, integrated microsensor package. This is of fundamental importance, as it enables numerous previously inaccessible applications. The embodiment of these sensors is inherently low maintenance and high reliability by design. The novel and

Sentinel Wraps: Real-Time Monitoring of Food Contamination by Printing DNAzyme Probes on Food Packaging.

Science.gov (United States)

Yousefi, Hanie; Ali, M Monsur; Su, Hsuan-Ming; Filipe, Carlos D M; Didar, Tohid F

2018-04-24

Here, we report the development of a transparent, durable, and flexible sensing surface that generates a fluorescence signal in the presence of a specific target bacterium. This material can be used in packaging, and it is capable of monitoring microbial contamination in various types of food products in real time without having to remove the sample or the sensor from the package. The sensor was fabricated by covalently attaching picoliter-sized microarrays of an E. coli-specific RNA-cleaving fluorogenic DNAzyme probe (RFD-EC1) to a thin, flexible, and transparent cyclo-olefin polymer (COP) film. Our experimental results demonstrate that the developed (RFD-EC1)-COP surface is specific, stable for at least 14 days under various pH conditions (pH 3-9), and can detect E. coli in meat and apple juice at concentrations as low as 10 3 CFU/mL. Furthermore, we demonstrate that our sensor is capable of detecting bacteria while still attached to the food package, which eliminates the need to manipulate the sample. The developed biosensors are stable for at least the shelf life of perishable packaged food products and provide a packaging solution for real-time monitoring of pathogens. These sensors hold the potential to make a significant contribution to the ongoing efforts to mitigate the negative public-health-related impacts of food-borne illnesses.

Tobacco packaging design for reducing tobacco use.

Science.gov (United States)

McNeill, Ann; Gravely, Shannon; Hitchman, Sara C; Bauld, Linda; Hammond, David; Hartmann-Boyce, Jamie

2017-04-27

different study types. We have summarised findings narratively. Fifty-one studies met our inclusion criteria, involving approximately 800,000 participants. The studies included were diverse, including observational studies, between- and within-participant experimental studies, cohort and cross-sectional studies, and time-series analyses. Few studies assessed behavioural outcomes in youth and non-smokers. Five studies assessed the primary outcomes: one observational study assessed smoking prevalence among 700,000 participants until one year after standardised packaging in Australia; four studies assessed consumption in 9394 participants, including a series of Australian national cross-sectional surveys of 8811 current smokers, in addition to three smaller studies. No studies assessed uptake, cessation, or relapse prevention. Two studies assessed quit attempts. Twenty studies examined other behavioural outcomes and 45 studies examined non-behavioural outcomes (e.g. appeal, perceptions of harm). In line with the challenges inherent in evaluating standardised tobacco packaging, a number of methodological imitations were apparent in the included studies and overall we judged most studies to be at high or unclear risk of bias in at least one domain. The one included study assessing the impact of standardised tobacco packaging on smoking prevalence in Australia found a 3.7% reduction in odds when comparing before to after the packaging change, or a 0.5 percentage point drop in smoking prevalence, when adjusting for confounders. Confidence in this finding is limited, due to the nature of the evidence available, and is therefore rated low by GRADE standards. Findings were mixed amongst the four studies assessing consumption, with some studies finding no difference and some studies finding evidence of a decrease; certainty in this outcome was rated very low by GRADE standards due to the limitations in study design. One national study of Australian adult smoker cohorts (5441

Time-optimum packet scheduling for many-to-one routing in wireless sensor networks

Science.gov (United States)

Song, W.-Z.; Yuan, F.; LaHusen, R.; Shirazi, B.

2007-01-01

This paper studies the wireless sensor networks (WSN) application scenario with periodical traffic from all sensors to a sink. We present a time-optimum and energy-efficient packet scheduling algorithm and its distributed implementation. We first give a general many-to-one packet scheduling algorithm for wireless networks, and then prove that it is time-optimum and costs [image omitted], N(u0)-1) time slots, assuming each node reports one unit of data in each round. Here [image omitted] is the total number of sensors, while [image omitted] denotes the number of sensors in a sink's largest branch subtree. With a few adjustments, we then show that our algorithm also achieves time-optimum scheduling in heterogeneous scenarios, where each sensor reports a heterogeneous amount of data in each round. Then we give a distributed implementation to let each node calculate its duty-cycle locally and maximize efficiency globally. In this packet-scheduling algorithm, each node goes to sleep whenever it is not transceiving, so that the energy waste of idle listening is also mitigated. Finally, simulations are conducted to evaluate network performance using the Qualnet simulator. Among other contributions, our study also identifies the maximum reporting frequency that a deployed sensor network can handle.

Smart Sensors for Launch Vehicles

Science.gov (United States)

Ray, Sabooj; Mathews, Sheeja; Abraham, Sheena; Pradeep, N.; Vinod, P.

2017-12-01

Smart Sensors bring a paradigm shift in the data acquisition mechanism adopted for launch vehicle telemetry system. The sensors integrate signal conditioners, digitizers and communication systems to give digital output from the measurement location. Multiple sensors communicate with a centralized node over a common digital data bus. An in-built microcontroller gives the sensor embedded intelligence to carry out corrective action for sensor inaccuracies. A smart pressure sensor has been realized and flight-proven to increase the reliability as well as simplicity in integration so as to obtain improved data output. Miniaturization is achieved by innovative packaging. This work discusses the construction, working and flight performance of such a sensor.

Deriving 3d point clouds from terrestrial photographs comparison of different sensors and software

DEFF Research Database (Denmark)

Niederheiser, Robert; Mokros, Martin; Lange, Julia

2016-01-01

and its derivatives.We compare five different sensors as well as four different state-of-the-art software packages for a single application, the modelling of a vegetated rock face. The five sensors represent different resolutions, sensor sizes and price segments of the cameras. The software packages used...... are: (1) Agisoft PhotoScan Pro (1.16), (2) Pix4D (2.0.89), (3) a combination of Visual SFM (V0.5.22) and SURE (1.2.0.286), and (4) MicMac (1.0). We took photos of a vegetated rock face from identical positions with all sensors. Then we compared the results of the different software packages regarding...

A packaging solution utilizing adhesive-filled TSVs and flip–chip methods

International Nuclear Information System (INIS)

Benfield, David; Moussa, Walied A; Lou, Edmond

2012-01-01

A compact packaging solution for microelectromechanical systems (MEMS) devices is presented. The 3D-integrated packaging solution was designed for the instrumentation of a spinal screw with a wireless sensor array, but may be adapted for a variety of applications. To achieve the compact package size, an unobtrusive through-silicon via (TSV) design was added to the microfabrication process flow for the MEMS sensor. These TSVs allowed vertical integration of the MEMS devices onto flexible printed circuit boards (FPCBs) using a flip–chip system. Ohmic connections with resistance values below 1 Ω have been achieved for 100 µm TSVs in 300 and 500 µm substrates. This paper describes the design and microfabrication process flow for the TSVs, and provides details on the flip–chip techniques used to electrically and structurally connect the MEMS devices to the FPCBs. (paper)

Multilingual domain modeling in Twenty-One: automatic creation of a bi-directional translation lexicon from a parallel corpus

NARCIS (Netherlands)

Hiemstra, Djoerd

1998-01-01

Within the project Twenty-One, which aims at the effective dissemination of information on ecology and sustainable development, a sytem is developed that supports cross-language information retrieval in any of the four languages Dutch, English, French and German. Knowledge of this application domain

Perinatal occipital lobe injury in children: analysis of twenty-one cases.

Science.gov (United States)

Wang, San-Mei; Yang, Chang-Shuan; Hou, Yu; Ma, Xiu-Wei; Feng, Zhi-Chun; Liao, Yu-Zhen

2012-12-01

This study used magnetic resonance imaging to analyze causes and clinical courses of pediatric occipital lobe injury. Patients undergoing magnetic resonance imaging for suspected bilateral occipital lobe injury at our Neurodevelopmental Department between July 2007 and June 2011 were included. We evaluated magnetic resonance imaging characteristics, clinical courses, electroencephalogram monitoring, and Denver Development Screen Test scores. Twenty-one infants were examined. Of these, 10 had been born preterm. Thirteen patients demonstrated hypoglycemia. Perinatal period hypoglycemia comprised the most common cause (71.4%) of occipital brain injury. Visual abnormalities were evident in 18 patients. Seventeen (80.9%) patients manifested epilepsy. Infantile spasms were observed in 13 cases (76.5%). According to Denver Development Screen Test assessment, 17 patients demonstrated delayed motor development. Motor function and language improved in 10 patients after effective control of their seizures. Hypoglycemia constitutes the most common cause of occipital injury in infants. Visual impairment, startle episodes, infantile spasms, and motor developmental delay comprise the most common complications, whereas language function is usually spared. Copyright © 2012 Elsevier Inc. All rights reserved.

Miniature sensor suitable for electronic nose applications

DEFF Research Database (Denmark)

Pinnaduwage, L. A.; Gehl, A. C.; Allman, S. L.

2007-01-01

A major research effort has been devoted over the years for the development of chemical sensors for the detection of chemical and explosive vapors. However, the deployment of such chemical sensors will require the use of multiple sensors probably tens of sensors in a sensor package to achieve sel...... microcantilevers. The sensor can detect parts-per-trillion concentrations of DMMP within 10 s exposure times. The small size of the sensor makes it ideally suited for electronic nose applications. © 2007 American Institute of Physics....

Nanotechnology: An Untapped Resource for Food Packaging.

Science.gov (United States)

Sharma, Chetan; Dhiman, Romika; Rokana, Namita; Panwar, Harsh

2017-01-01

Food commodities are packaged and hygienically transported to protect and preserve them from any un-acceptable alteration in quality, before reaching the end-consumer. Food packaging continues to evolve along-with the innovations in material science and technology, as well as in light of consumer's demand. Presently, the modern consumers of competitive economies demands for food with natural quality, assured safety, minimal processing, extended shelf-life and ready-to-eat concept. Innovative packaging systems, not only ascertains transit preservation and effective distribution, but also facilitates communication at the consumer levels. The technological advances in the domain of food packaging in twenty-first century are mainly chaired by nanotechnology, the science of nano-materials. Nanotechnology manipulates and creates nanometer scale materials, of commercial and scientific relevance. Introduction of nanotechnology in food packaging sector has significantly addressed the food quality, safety and stability concerns. Besides, nanotechnology based packaging intimate's consumers about the real time quality of food product. Additionally, nanotechnology has been explored for controlled release of preservatives/antimicrobials, extending the product shelf life within the package. The promising reports for nanotechnology interventions in food packaging have established this as an independent priority research area. Nanoparticles based food packages offer improved barrier and mechanical properties, along with food preservation and have gained welcoming response from market and end users. In contrary, recent advances and up-liftment in this area have raised various ethical, environmental and safety concerns. Policies and regulation regarding nanoparticles incorporation in food packaging are being reviewed. This review presents the existing knowledge, recent advances, concerns and future applications of nanotechnology in food packaging sector.

SensorWeb Evolution Using the Earth Observing One (EO-1) Satellite as a Test Platform

Science.gov (United States)

Mandl, Daniel; Frye, Stuart; Cappelaere, Pat; Ly, Vuong; Handy, Matthew; Chien, Steve; Grossman, Robert; Tran, Daniel

2012-01-01

The Earth Observing One (EO-1) satellite was launched in November 2000 as a one year technology demonstration mission for a variety of space technologies. After the first year, in addition to collecting science data from its instruments, the EO-1 mission has been used as a testbed for a variety of technologies which provide various automation capabilities and which have been used as a pathfinder for the creation of SensorWebs. A SensorWeb is the integration of variety of space, airborne and ground sensors into a loosely coupled collaborative sensor system that automatically provides useful data products. Typically, a SensorWeb is comprised of heterogeneous sensors tied together with a messaging architecture and web services. This paper provides an overview of the various technologies that were tested and eventually folded into normal operations. As these technologies were folded in, the nature of operations transformed. The SensorWeb software enables easy connectivity for collaboration with sensors, but the side benefit is that it improved the EO-1 operational efficiency. This paper presents the various phases of EO-1 operation over the past 12 years and also presents operational efficiency gains demonstrated by some metrics.

AMA Conferences 2015. SENSOR 2015. 17th international conference on sensors and measurement technology. IRS2 2015. 14th international conference on infrared sensors and systems. Proceedings

International Nuclear Information System (INIS)

2015-01-01

This meeting paper contains presentations of two conferences: SENSOR 2015 and IRS 2 (= International conference on InfraRed Sensors and systems). The first part of SENSOR 2015 contains the following chapters: (A) SENSOR PRINCIPLES: A.1: Mechanical sensors; A.2: Optical sensors; A.3: Ultrasonic sensors; A.4: Microacoustic sensors; A.5: Magnetic sensors; A.6: Impedance sensors; A.7: Gas sensors; A.8: Flow sensors; A.9: Dimensional measurement; A.10: Temperature and humidity sensors; A.11: Chemosensors; A.12: Biosensors; A.13: Embedded sensors; A.14: Sensor-actuator systems; (B) SENSOR TECHNOLOGY: B.1: Sensor design; B.2: Numerical simulation of sensors; B.3: Sensor materials; B.4: MEMS technology; B.5: Micro-Nano-Integration; B.6: Packaging; B.7: Materials; B.8: Thin films; B.9: Sensor production; B.10: Sensor reliability; B.11: Calibration and testing; B.12: Optical fibre sensors. (C) SENSOR ELECTRONICS AND COMMUNICATION: C.1: Sensor electronics; C.2: Sensor networks; C.3: Wireless sensors; C.4: Sensor communication; C.5: Energy harvesting; C.6: Measuring systems; C.7: Embedded systems; C.8: Self-monitoring and diagnosis; (D) APPLICATIONS: D.1: Medical measuring technology; D.2: Ambient assisted living; D.3: Process measuring technology; D.4: Automotive; D.5: Sensors in energy technology; D.6: Production technology; D.7: Security technology; D.8: Smart home; D.9: Household technology. The second part with the contributions of the IRS 2 2015 is structured as follows: (E) INFRARED SENSORS: E.1: Photon detectors; E.2: Thermal detectors; E.3: Cooled detectors; E.4: Uncooled detectors; E.5: Sensor modules; E.6: Sensor packaging. (G) INFRARED SYSTEMS AND APPLICATIONS: G.1: Thermal imaging; G.2: Pyrometry / contactless temperature measurement; G.3: Gas analysis; G.4: Spectroscopy; G.5: Motion control and presence detection; G.6: Security and safety monitoring; G.7: Non-destructive testing; F: INFRARED SYSTEM COMPONENTS: F.1: Infrared optics; F.2: Optical modulators; F.3

TCSP ER-2 LIGHTNING INSTRUMENT PACKAGE (LIP) V1

Data.gov (United States)

National Aeronautics and Space Administration — The TCSP ER-2 Lightning Instrument Package (LIP) consists of 7 rotating vane type electric field sensors and a two channel conductivity probe along with a central...

Thermal Flow Sensors for Harsh Environments.

Science.gov (United States)

Balakrishnan, Vivekananthan; Phan, Hoang-Phuong; Dinh, Toan; Dao, Dzung Viet; Nguyen, Nam-Trung

2017-09-08

Flow sensing in hostile environments is of increasing interest for applications in the automotive, aerospace, and chemical and resource industries. There are thermal and non-thermal approaches for high-temperature flow measurement. Compared to their non-thermal counterparts, thermal flow sensors have recently attracted a great deal of interest due to the ease of fabrication, lack of moving parts and higher sensitivity. In recent years, various thermal flow sensors have been developed to operate at temperatures above 500 °C. Microelectronic technologies such as silicon-on-insulator (SOI), and complementary metal-oxide semiconductor (CMOS) have been used to make thermal flow sensors. Thermal sensors with various heating and sensing materials such as metals, semiconductors, polymers and ceramics can be selected according to the targeted working temperature. The performance of these thermal flow sensors is evaluated based on parameters such as thermal response time, flow sensitivity. The data from thermal flow sensors reviewed in this paper indicate that the sensing principle is suitable for the operation under harsh environments. Finally, the paper discusses the packaging of the sensor, which is the most important aspect of any high-temperature sensing application. Other than the conventional wire-bonding, various novel packaging techniques have been developed for high-temperature application.

Thermal Flow Sensors for Harsh Environments

Directory of Open Access Journals (Sweden)

Vivekananthan Balakrishnan

2017-09-01

Full Text Available Flow sensing in hostile environments is of increasing interest for applications in the automotive, aerospace, and chemical and resource industries. There are thermal and non-thermal approaches for high-temperature flow measurement. Compared to their non-thermal counterparts, thermal flow sensors have recently attracted a great deal of interest due to the ease of fabrication, lack of moving parts and higher sensitivity. In recent years, various thermal flow sensors have been developed to operate at temperatures above 500 °C. Microelectronic technologies such as silicon-on-insulator (SOI, and complementary metal-oxide semiconductor (CMOS have been used to make thermal flow sensors. Thermal sensors with various heating and sensing materials such as metals, semiconductors, polymers and ceramics can be selected according to the targeted working temperature. The performance of these thermal flow sensors is evaluated based on parameters such as thermal response time, flow sensitivity. The data from thermal flow sensors reviewed in this paper indicate that the sensing principle is suitable for the operation under harsh environments. Finally, the paper discusses the packaging of the sensor, which is the most important aspect of any high-temperature sensing application. Other than the conventional wire-bonding, various novel packaging techniques have been developed for high-temperature application.

Invisible magnetic sensors

Science.gov (United States)

Mach-Batlle, Rosa; Navau, Carles; Sanchez, Alvaro

2018-04-01

Sensing magnetic fields is essential in many applications in biomedicine, transportation, or smart cities. The distortion magnetic sensors create in response to the field they are detecting may hinder their use, for example, in applications requiring dense packaging of sensors or accurately shaped field distributions. For sensing electromagnetic waves, cloaking shells that reduce the scattering of sensors have been introduced. However, the problem of making a magnetic sensor undetectable remains unsolved. Here, we present a general strategy on how to make a sensor magnetically invisible while keeping its ability to sense. The sensor is rendered undetectable by surrounding it with a spherical shell having a tailored magnetic permeability. Our method can be applied to arbitrary shaped magnetic sensors in arbitrary magnetic fields. The invisibility can be made exact when the sensor is spherical and the probed field is uniform. A metasurface composed of superconducting pieces is presented as a practical realization of the ideal invisibility shell.

Packaging Printing Today

OpenAIRE

Stanislav Bolanča; Igor Majnarić; Kristijan Golubović

2015-01-01

Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. T...

Investigation of Anticipatory Postural Adjustments during One-Leg Stance Using Inertial Sensors: Evidence from Subjects with Parkinsonism

Directory of Open Access Journals (Sweden)

Gianluca Bonora

2017-07-01

Full Text Available The One-Leg Stance (OLS test is a widely adopted tool for the clinical assessment of balance in the elderly and in subjects with neurological disorders. It was previously showed that the ability to control anticipatory postural adjustments (APAs prior to lifting one leg is significantly impaired by idiopathic Parkinson’s disease (iPD. However, it is not known how APAs are affected by other types of parkinsonism, such as frontal gait disorders (FGD. In this study, an instrumented OLS test based on wearable inertial sensors is proposed to investigate both the initial anticipatory phase and the subsequent unipedal balance. The sensitivity and the validity of the test have been evaluated. Twenty-five subjects with iPD presenting freezing of gait (FOG, 33 with iPD without FOG, 13 with FGD, and 32 healthy elderly controls were recruited. All subjects wore three inertial sensors positioned on the posterior trunk (L4–L5, and on the left and right frontal face of the tibias. Participants were asked to lift a foot and stand on a single leg as long as possible with eyes open, as proposed by the mini-BESTest. Temporal parameters and trunk acceleration were extracted from sensors and compared among groups. The results showed that, regarding the anticipatory phase, the peak of mediolateral trunk acceleration was significantly reduced compared to healthy controls (p < 0.05 in subjects with iPD with and without FOG, but not in FGD group (p = 0.151. Regarding the balance phase duration, a significant shortening was found in the three parkinsonian groups compared to controls (p < 0.001. Moreover, balance was significantly longer (p < 0.001 in iPD subjects without FOG compared to subjects with FGD and iPD subjects presenting FOG. Strong correlations between balance duration extracted by sensors and clinical mini-BESTest scores were found (ρ > 0.74, demonstrating the method’s validity. Our findings support the validity of the proposed

AMA Conferences 2015. SENSOR 2015. 17th international conference on sensors and measurement technology. IRS{sup 2} 2015. 14th international conference on infrared sensors and systems. Proceedings

Energy Technology Data Exchange (ETDEWEB)

NONE

2015-07-01

This meeting paper contains presentations of two conferences: SENSOR 2015 and IRS{sup 2} (= International conference on InfraRed Sensors and systems). The first part of SENSOR 2015 contains the following chapters: (A) SENSOR PRINCIPLES: A.1: Mechanical sensors; A.2: Optical sensors; A.3: Ultrasonic sensors; A.4: Microacoustic sensors; A.5: Magnetic sensors; A.6: Impedance sensors; A.7: Gas sensors; A.8: Flow sensors; A.9: Dimensional measurement; A.10: Temperature and humidity sensors; A.11: Chemosensors; A.12: Biosensors; A.13: Embedded sensors; A.14: Sensor-actuator systems; (B) SENSOR TECHNOLOGY: B.1: Sensor design; B.2: Numerical simulation of sensors; B.3: Sensor materials; B.4: MEMS technology; B.5: Micro-Nano-Integration; B.6: Packaging; B.7: Materials; B.8: Thin films; B.9: Sensor production; B.10: Sensor reliability; B.11: Calibration and testing; B.12: Optical fibre sensors. (C) SENSOR ELECTRONICS AND COMMUNICATION: C.1: Sensor electronics; C.2: Sensor networks; C.3: Wireless sensors; C.4: Sensor communication; C.5: Energy harvesting; C.6: Measuring systems; C.7: Embedded systems; C.8: Self-monitoring and diagnosis; (D) APPLICATIONS: D.1: Medical measuring technology; D.2: Ambient assisted living; D.3: Process measuring technology; D.4: Automotive; D.5: Sensors in energy technology; D.6: Production technology; D.7: Security technology; D.8: Smart home; D.9: Household technology. The second part with the contributions of the IRS{sup 2} 2015 is structured as follows: (E) INFRARED SENSORS: E.1: Photon detectors; E.2: Thermal detectors; E.3: Cooled detectors; E.4: Uncooled detectors; E.5: Sensor modules; E.6: Sensor packaging. (G) INFRARED SYSTEMS AND APPLICATIONS: G.1: Thermal imaging; G.2: Pyrometry / contactless temperature measurement; G.3: Gas analysis; G.4: Spectroscopy; G.5: Motion control and presence detection; G.6: Security and safety monitoring; G.7: Non-destructive testing; F: INFRARED SYSTEM COMPONENTS: F.1: Infrared optics; F.2: Optical

HPLOT: the graphics interface package for the HBOOK histogramming package

International Nuclear Information System (INIS)

Watkins, H.

1978-01-01

The subroutine package HPLOT described in this report, enables the CERN histogramming package HBOOK to produce high-quality pictures by means of high-resolution devices such as plotters. HPLOT can be implemented on any scientific computing system with a Fortran IV compiler and can be interfaced with any graphics package; spectral routines in addition to the basic ones enable users to embellish their histograms. Examples are also given of the use of HPLOT as a graphics package for plotting simple pictures without histograms. (Auth.)

NOVA integrated alignment/diagnostic sensors

International Nuclear Information System (INIS)

1978-01-01

Under Contract 3772003 to the Lawrence Livermore Laboratory, Aerojet ElectroSystems Company has investigated a number of alignment system design topics for the NOVA and SHIVA upgrade lasers. Prior reports dealt with the Main Beam Alignment System, and with Multipass Amplifier Alignment Concepts. This report, which completes the contract, examines ways in which the Return Beam Diagnostic (RBD) package and Incident Beam Diagnostic (IBD) packages may be reconfigured to a more integrated package. In particular, the report shows that the RBD optics may be directly integrated in the Pointing Focus and Centering (PFC) sensor, and that the IBD optics may use the same basic common configuration as the PFC/RBD package

New recording package for VACM provides sensor flexibility

Science.gov (United States)

Strahle, William J.; Worrilow, S. E.; Fucile, S. E.; Martini, Marinna A.

1994-01-01

For the past three decades, the VACM has been a standard for ocean current measurements. A VACM is a true vector-averaging instrument that computes north and east current vectors and averages temperature continuously over a specified interval. It keeps a running total of rotor counts, and records one-shot samples of compass, vane position and time. Adding peripheral sensors to the data stream was easy. In today's economy, it seems imperative that operational centers concentrate on upgrading present inventory rather than purchasing newer instruments that often fall short of the flexible measurement platforms with high data capacities required by most researchers today. PCMCIA cards are rapidly becoming an industry standard with a wide range of storage capacities. By upgrading the VACM to a PCMCIA storage system with a flexible microprocessor, the VACM should continue to be a viable instrument into the next century

Compact portable QEPAS multi-gas sensor

Science.gov (United States)

Dong, Lei; Kosterev, Anatoliy A.; Thomazy, David; Tittel, Frank K.

2011-01-01

A quartz-enhanced photoacoustic spectroscopy (QEPAS) based multi-gas sensor was developed to quantify concentrations of carbon monoxide (CO), hydrogen cyanide (HCN), hydrogen chloride (HCl), and carbon dioxide (CO2) in ambient air. The sensor consists of a compact package of dimensions 25cm x 25cm x 10cm and was designed to operate at atmospheric pressure. The HCN, CO2, and HCl measurement channels are based on cw, C-band telecommunication-style packaged, fiber-coupled diode lasers, while the CO channel uses a TO can-packaged Sb diode laser as an excitation source. Moreover, the sensor incorporates rechargeable batteries and can operate on batteries for at least 8 hours. It can also operate autonomously or interact with another device (such as a computer) via a RS232 serial port. Trace gas detection limits of 7.74ppm at 4288.29cm-1 for CO, 450ppb at 6539.11 cm-1 for HCN, 1.48ppm at 5739.26 cm-1 for HCl and 97ppm at 6361.25 cm-1 for CO2 for a 1sec average time, were demonstrated.

A silicon-based flexible tactile sensor for ubiquitous robot companion applications

International Nuclear Information System (INIS)

Kim, Kunnyun; Lee, Kang Ryeol; Lee, Dae Sung; Cho, Nam-Kyu; Kim, Won Hyo; Park, Kwang-Bum; Park, Hyo-Derk; Kim, Yong Kook; Park, Yon-Kyu; Kim, Jong-Ho

2006-01-01

We present the fabrication process and characteristics of a 3-axes flexible tactile sensor available for normal and shear mode fabricated using Si micromachining and packaging technologies. The fabrication processes for the 3 axes flexible tactile sensor were classified in the fabrication of sensor chips and their packaging on the flexible PCB. The variation rate of resistance was about 2.1%/N and 0.5%/N in applying normal and shear force, respectively. Because this tactile sensor can measure the variations of resistance of the semiconductor strain gauge for normal and shear force, it can be used to sense touch, pressure, hardness, and slip

Motofit - integrating neutron reflectometry acquisition, reduction and analysis into one, easy to use, package

International Nuclear Information System (INIS)

Nelson, Andrew

2010-01-01

The efficient use of complex neutron scattering instruments is often hindered by the complex nature of their operating software. This complexity exists at each experimental step: data acquisition, reduction and analysis, with each step being as important as the previous. For example, whilst command line interfaces are powerful at automated acquisition they often reduce accessibility by novice users and sometimes reduce the efficiency for advanced users. One solution to this is the development of a graphical user interface which allows the user to operate the instrument by a simple and intuitive 'push button' approach. This approach was taken by the Motofit software package for analysis of multiple contrast reflectometry data. Here we describe the extension of this package to cover the data acquisition and reduction steps for the Platypus time-of-flight neutron reflectometer. Consequently, the complete operation of an instrument is integrated into a single, easy to use, program, leading to efficient instrument usage.

3D printed System-on-Package (SoP) for environmental sensing and localization applications

KAUST Repository

Zhen, Su; Bilal, Rana Muhammad; Shamim, Atif

2017-01-01

This paper presents for the first time an innovative 3D printed SoP sensor node with temperature, pressure and humidity sensing capabilities. It has an integrated wireless readout through a near isotropic (900MHz) GSM antenna-on-package. This sensor

Image Fusion Technologies In Commercial Remote Sensing Packages

OpenAIRE

Al-Wassai, Firouz Abdullah; Kalyankar, N. V.

2013-01-01

Several remote sensing software packages are used to the explicit purpose of analyzing and visualizing remotely sensed data, with the developing of remote sensing sensor technologies from last ten years. Accord-ing to literature, the remote sensing is still the lack of software tools for effective information extraction from remote sensing data. So, this paper provides a state-of-art of multi-sensor image fusion technologies as well as review on the quality evaluation of the single image or f...

Advanced Image Processing Package for FPGA-Based Re-Programmable Miniature Electronics

National Research Council Canada - National Science Library

Ovod, Vladimir I; Baxter, Christopher R; Massie, Mark A; McCarley, Paul L

2005-01-01

.... An advanced image-processing package has been designed at Nova Sensors to re-configure the FPGA-based co-processor board for numerous applications including motion detection, optical background...

Control Technologies for Room Air-conditioner and Packaged Air-conditioner

Science.gov (United States)

Ito, Nobuhisa

Trends of control technologies about air-conditioning machineries, especially room or packaged air conditioners, are presented in this paper. Multiple air conditioning systems for office buildings are mainly described as one application of the refrigeration cycle control technologies including sensors for thermal comfort and heating/ cooling loads are also described as one of the system control technologies. Inverter systems and related technologies for driving variable speed compressors are described in both case of including induction motors and brushless DC motors. Technologies for more accurate control to meet various kind of regulations such as ozone layer destruction, energy saving and global warming, and for eliminating harmonic distortion of power source current, as a typical EMC problem, will be urgently desired.

Numeric modeling of HfO2 neutron flux sensor parameters during sensor burnup in the RBMK-1500 reactor

International Nuclear Information System (INIS)

Jurkevicius, A.; Remeikis, V.

2001-01-01

The isotopic composition of hafnium in the radial neutron flux sensor of the RBMK-1500 reactor, the rates of the neutron absorption on Hf isotopes and the neutron spectrum in the sensor were numerically modeled. The sequence SAS2 (Shielding Analysis Sequence) from the package SCALE 4.3 was used for calculations. It has been obtained that the main neutron absorber 167 Er isotope practically burns up completely at the 18 MW d/kgU burnup depth, and at that time the capture rate of thermal neutrons in erbium decreases ten-fold. The average neutron flux density was calculated 7.6*10 13 neutrons. Cm -2 S -1 in the RBMK-1500 reactor grating, when the nuclear fuel enriched with 235 U by 2.4% and with Er by 0.4% is used in a fuel assembly. When the sensor burnup reaches 28 MW d/kgU, the neutron absorption rate of 178 Hf exceeds the rate of 177 Hf. The overall neutron absorption rate in hafnium decreases 2.53 times due to the sensor burnup to 56 MW d/kgU. The corrective factors ξ d (I) at different integral flux I of the sensors were calculated. The obtained dependence ξ d (I) calculated numerically was compared to the experimental one determined by processing repeated calibration results of Hf sensors in RBMK-1500 reactors, as well as compared to the theoretical one currently used in the Ignalina NPP special mathematical algorithms. (author)

Development of Smart Sensors System Based on Formal Concept Analysis and Ontology Model

Directory of Open Access Journals (Sweden)

Hongsheng Xu

2013-06-01

Full Text Available The smart sensor is the product of the combination of one or more sensitive components, precision analog circuits, digital circuits, microprocessor, communication interface, intelligent software systems and hardware integration in a packaging component. Formal concept analysis is from the given data to automatically extract the classification relationship between the entire hidden concept and concept, formation of concept model. Ontology is a set of relations between concepts of the specific domain and concept, and it can effectively express the general knowledge of specific field. The paper proposes development of smart sensors system based on formal concept analysis and ontology model. Smart sensor is a micro processor, sensor with information detection, information processing, information memory, logical thinking and judging function. The methods can improve the effect of the smart sensors.

Electric Field Guided Assembly of One-Dimensional Nanostructures for High Performance Sensors

Directory of Open Access Journals (Sweden)

Wing Kam Liu

2012-05-01

Full Text Available Various nanowire or nanotube-based devices have been demonstrated to fulfill the anticipated future demands on sensors. To fabricate such devices, electric field-based methods have demonstrated a great potential to integrate one-dimensional nanostructures into various forms. This review paper discusses theoretical and experimental aspects of the working principles, the assembled structures, and the unique functions associated with electric field-based assembly. The challenges and opportunities of the assembly methods are addressed in conjunction with future directions toward high performance sensors.

User friendly packaging

DEFF Research Database (Denmark)

Geert Jensen, Birgitte

2010-01-01

Most consumers have experienced occasional problems with opening packaging. Tomato sauce from the tinned mackerel splattered all over the kitchen counter, the unrelenting pickle jar lid, and the package of sliced ham that cannot be opened without a knife or a pair of scissors. The research project...... “User-friendly Packaging” aims to create a platform for developing more user-friendly packaging. One intended outcome of the project is a guideline that industry can use in development efforts. The project also points the way for more extended collaboration between companies and design researchers. How...... can design research help industry in packaging innovation?...

Viral vectors for gene modification of plants as chem/bio sensors.

Energy Technology Data Exchange (ETDEWEB)

Manginell, Monica; Harper, Jason C.; Arango, Dulce C.; Brozik, Susan Marie; Dolan, Patricia L.

2006-11-01

Chemical or biological sensors that are specific, sensitive, and robust allowing intelligence gathering for verification of nuclear non-proliferation treaty compliance and detouring production of weapons of mass destruction are sorely needed. Although much progress has been made in the area of biosensors, improvements in sensor lifetime, robustness, and device packaging are required before these devices become widely used. Current chemical and biological detection and identification techniques require less-than-covert sample collection followed by transport to a laboratory for analysis. In addition to being expensive and time consuming, results can often be inconclusive due to compromised sample integrity during collection and transport. We report here a demonstration of a plant based sensor technology which utilizes mature and seedling plants as chemical sensors. One can envision genetically modifying native plants at a site of interest that can report the presence of specific toxins or chemicals. In this one year project we used a developed inducible expression system to show the feasibility of plant sensors. The vector was designed as a safe, non-infectious vector which could be used to invade, replicate, and introduce foreign genes into mature host plants that then allow the plant to sense chem/bio agents. The genes introduced through the vector included a reporter gene that encodes for green fluorescent protein (GFP) and a gene that encodes for a mammalian receptor that recognizes a chemical agent. Specifically, GFP was induced by the presence of 17-{beta}-Estradiol (estrogen). Detection of fluorescence indicated the presence of the target chemical agent. Since the sensor is a plant, costly device packaging development or manufacturing of the sensor were not required. Additionally, the biological recognition and reporting elements are maintained in a living, natural environment and therefore do not suffer from lifetime disadvantages typical of most biosensing

The Sensor Irony: How Reliance on Sensor Technology is Limiting Our View of the Battlefield

Science.gov (United States)

2010-05-10

operations; quite the contrary. “History is littered with prophesies of technical and scientific inadequacy, such as Lord Kelvin’s famous retort , ‘Heavier...U.S. Air Force, Factsheets, RQ-4 Global Hawk. designed with the potential to carry a Signals Intelligence (SIGINT) package in lieu of its SAR...discussed in the Predator sensor package , and adds an additional image-intensifying TV camera.4 The Reapers’ GTMI/SAR capability is best represented

Advances in miniature spectrometer and sensor development

Science.gov (United States)

Malinen, Jouko; Rissanen, Anna; Saari, Heikki; Karioja, Pentti; Karppinen, Mikko; Aalto, Timo; Tukkiniemi, Kari

2014-05-01

Miniaturization and cost reduction of spectrometer and sensor technologies has great potential to open up new applications areas and business opportunities for analytical technology in hand held, mobile and on-line applications. Advances in microfabrication have resulted in high-performance MEMS and MOEMS devices for spectrometer applications. Many other enabling technologies are useful for miniature analytical solutions, such as silicon photonics, nanoimprint lithography (NIL), system-on-chip, system-on-package techniques for integration of electronics and photonics, 3D printing, powerful embedded computing platforms, networked solutions as well as advances in chemometrics modeling. This paper will summarize recent work on spectrometer and sensor miniaturization at VTT Technical Research Centre of Finland. Fabry-Perot interferometer (FPI) tunable filter technology has been developed in two technical versions: Piezoactuated FPIs have been applied in miniature hyperspectral imaging needs in light weight UAV and nanosatellite applications, chemical imaging as well as medical applications. Microfabricated MOEMS FPIs have been developed as cost-effective sensor platforms for visible, NIR and IR applications. Further examples of sensor miniaturization will be discussed, including system-on-package sensor head for mid-IR gas analyzer, roll-to-roll printed Surface Enhanced Raman Scattering (SERS) technology as well as UV imprinted waveguide sensor for formaldehyde detection.

Overview of NASA Langley's Piezoelectric Ceramic Packaging Technology and Applications

Science.gov (United States)

Bryant, Robert G.

2007-01-01

Over the past decade, NASA Langley Research Center (LaRC) has developed several actuator packaging concepts designed to enhance the performance of commercial electroactive ceramics. NASA LaRC focused on properly designed actuator and sensor packaging for the following reasons, increased durability, protect the working material from the environment, allow for proper mechanical and electrical contact, afford "ready to use" mechanisms that are scalable, and develop fabrication methodology applicable to any active material of the same physical class. It is more cost effective to enhance or tailor the performance of existing systems, through innovative packaging, than to develop, test and manufacture new materials. This approach led to the development of several solid state actuators that include THUNDER, the Macrofiber Composite or (MFC) and the Radial Field Diaphragm or (RFD). All these actuators are fabricated using standard materials and processes derived from earlier concepts. NASA s fabrication and packaging technology as yielded, piezoelectric actuators and sensors that are easy to implement, reliable, consistent in properties, and of lower cost to manufacture in quantity, than their predecessors (as evidenced by their continued commercial availability.) These piezoelectric actuators have helped foster new research and development in areas involving computational modeling, actuator specific refinements, and engineering system redesign which led to new applications for piezo-based devices that replace traditional systems currently in use.

Hermeticity of electronic packages

CERN Document Server

Greenhouse, Hal; Romenesco, Bruce

2011-01-01

This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the packageùespecially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to so

Hermeticity of electronic packages

CERN Document Server

Greenhouse, Hal

2000-01-01

This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the package-especially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to so

FEM Simulation of Influence of Protective Encapsulation on MEMS Pressure Sensor

DEFF Research Database (Denmark)

Yao, Qingshan; Janting, Jakob; Branebjerg, Jens

2003-01-01

The objective of the work is to evaluate the feasibility of packaging a MEMS silicon pressure sensor by using either a polymer encapsulation or a combination of a polymer encapsulation and a metallic protection Membrane (fig. 1). The potential application of the protected sensor is for harsh...... environments. Several steps of simulation are carried out:1) Comparisons of the sensitivities are made among the non-encapsulated silicon sensor, the polymer encapsulated and polymer with metal encapsulated sensor. This is for evaluating whether the encapsulating materials reduce the pressure sensitivity...... whether the metallic membrane / coating will peel off when applying the maximum pressure, which is 4000 bar leading to high shear stress between the metallic membrane and the polymer encapsulation material.3) Thermal calculations are made to evaluate the influence of the environment on the packaged sensor...

Vibration monitoring for aircraft wing model using fiber Bragg grating array packaged by vacuum-assisted resin transfer molding

Science.gov (United States)

Zhang, Wen; Liu, Xiaolong; He, Wei; Dong, Mingli; Zhu, Lianqing

2017-09-01

For the improvement of monitoring accuracy, a vibration monitoring for aircraft wing model using a fiber Bragg grating (FBG) array packaged by vacuum-assisted resin transfer molding (VARTM) is proposed. The working principle of the vibration monitoring using FBG array has been explained, which can theoretically support the idea of this paper. VARTM has been explained in detail, which is suitable for not only the single FBG sensor but also the FBG array within a relatively large area. The calibration experiment has been performed using the FBG sensor packaged by VARTM. The strain sensitivity of the VARTM package is 1.35 pm/μɛ and the linearity is 0.9999. The vibration monitoring experiment has been carried out using FBG array packaged by VARTM. The measured rate of strain changes across the aluminum test board used to simulate the aircraft wing is 0.69 μɛ/mm and the linearity is 0.9931. The damping ratio is 0.16, which could be further used for system performance evaluation. Experimental results demonstrate that the vibration monitoring using FBG sensors packaged by VARTM can be efficiently used for the structural health monitoring. Given the validation and great performance, this method is quite promising for in-flight monitoring and holds great reference value in other similar engineering structures.

Development of electrochemical sensor for the determination of toxic gases

International Nuclear Information System (INIS)

Ahmed, R.

1997-01-01

Monitoring release of flue and toxic gases and vapours of volatile organic toxic substances into the atmosphere is one of the most important problems in environmental pollution control studies particularly in industrial installations in order to avoid poisoning and other health hazards. In industrial areas continuous monitoring of toxic gases and vapours is required for the safety of workers and for this purpose different types of sensors and available such as thermal sensors mass sensors, biosensors, optical sensors and electrochemical sensors. Among all of these sensors electrochemical sensors are most cost-effective, accurate and very good for continuous monitoring. They can be categorized into potentiometric, conductometric, amperometric and voltammetric sensors. Applications of different types of electrochemical sensors are briefly reviewed. Development of polymer membrane and conducting polymers are most important for fabrication of electrochemical sensors, which can analyse up to twenty two gases and vapours simultaneously. Some of the commercially used electrochemical sensors are described. For the determination of hydrogen sulfide an electrochemical sensor was developed. Teflon based conduction polymer membrane was treated with some electrolytes and then silver metal was deposited on one side of the membrane. Metal part side was exposed to gases and the other side was deposited on one side of the membrane metal part side was exposed to gasses and the other side was connected with two electrodes including reference and counter electrodes, whereas metal part acted as working electrode. This system can also me used for the analysis of their gases like SO/sub 2/ etc; because they react at different potentials with the metal to generate the signals. (author)

Self-Powered, One-Stop, and Multifunctional Implantable Triboelectric Active Sensor for Real-Time Biomedical Monitoring.

Science.gov (United States)

Ma, Ye; Zheng, Qiang; Liu, Yang; Shi, Bojin; Xue, Xiang; Ji, Weiping; Liu, Zhuo; Jin, Yiming; Zou, Yang; An, Zhao; Zhang, Wei; Wang, Xinxin; Jiang, Wen; Xu, Zhiyun; Wang, Zhong Lin; Li, Zhou; Zhang, Hao

2016-10-12

Operation time of implantable electronic devices is largely constrained by the lifetime of batteries, which have to be replaced periodically by surgical procedures once exhausted, causing physical and mental suffering to patients and increasing healthcare costs. Besides the efficient scavenging of the mechanical energy of internal organs, this study proposes a self-powered, flexible, and one-stop implantable triboelectric active sensor (iTEAS) that can provide continuous monitoring of multiple physiological and pathological signs. As demonstrated in human-scale animals, the device can monitor heart rates, reaching an accuracy of ∼99%. Cardiac arrhythmias such as atrial fibrillation and ventricular premature contraction can be detected in real-time. Furthermore, a novel method of monitoring respiratory rates and phases is established by analyzing variations of the output peaks of the iTEAS. Blood pressure can be independently estimated and the velocity of blood flow calculated with the aid of a separate arterial pressure catheter. With the core-shell packaging strategy, monitoring functionality remains excellent during 72 h after closure of the chest. The in vivo biocompatibility of the device is examined after 2 weeks of implantation, proving suitability for practical use. As a multifunctional biomedical monitor that is exempt from needing an external power supply, the proposed iTEAS holds great potential in the future of the healthcare industry.

Type A radioactive liquid sample packaging family

International Nuclear Information System (INIS)

Edwards, W.S.

1995-11-01

Westinghouse Hanford Company (WHC) has developed two packagings that can be used to ship Type A quantities of radioactive liquids. WHC designed these packagings to take advantage of commercially available items where feasible to reduce the overall packaging cost. The Hedgehog packaging can ship up to one liter of Type A radioactive liquid with no shielding and 15 cm of distance between the liquid and the package exterior, or 30 ml of liquid with 3.8 cm of stainless steel shielding and 19 cm of distance between the liquid and the package exterior. The One Liter Shipper can ship up to one liter of Type A radioactive liquid that does not require shielding

CRUQS: A Miniature Fine Sun Sensor for Nanosatellites

Science.gov (United States)

Heatwole, Scott; Snow, Carl; Santos, Luis

2013-01-01

A new miniature fine Sun sensor has been developed that uses a quadrant photodiode and housing to determine the Sun vector. Its size, mass, and power make it especially suited to small satellite applications, especially nanosatellites. Its accuracy is on the order of one arcminute, and it will enable new science in the area of nanosatellites. The motivation for this innovation was the need for high-performance Sun sensors in the nanosatellite category. The design idea comes out of the LISS (Lockheed Intermediate Sun Sensor) used by the sounding rocket program on their solar pointing ACS (Attitude Control System). This system uses photodiodes and a wall between them. The shadow cast by the Sun is used to determine the Sun angle. The new sensor takes this concept and miniaturizes it. A cruciform shaped housing and a surface-mount quadrant photodiode package allow for a two-axis fine Sun sensor to be packaged into a space approx.1.25xl x0.25 in. (approx.3.2x2.5x0.6 cm). The circuitry to read the photodiodes is a simple trans-impedance operational amplifier. This is much less complex than current small Sun sensors for nanosatellites that rely on photo-arrays and processing of images to determine the Sun center. The simplicity of the circuit allows for a low power draw as well. The sensor consists of housing with a cruciform machined in it. The cruciform walls are 0.5-mm thick and the center of the cruciform is situated over the center of the quadrant photodiode sensor. This allows for shadows to be cast on each of the four photodiodes based on the angle of the Sun. A simple operational amplifier circuit is used to read the output of the photodiodes as a voltage. The voltage output of each photodiode is summed based on rows and columns, and then the values of both rows or both columns are differenced and divided by the sum of the voltages for all four photodiodes. The value of both difference over sums for the rows and columns is compared to a table or a polynomial fit

Packaging Printing Today

Directory of Open Access Journals (Sweden)

Stanislav Bolanča

2015-12-01

Full Text Available Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. The possibilities of particular printing techniques for optimal production of the determined packaging were studied in the paper. The problem was viewed from the technological and economical aspect. The possible printing quality and the time necessary for the printing realization were taken as key parameters. An important segment of the production and the way of life is alocation value and it had also found its place in this paper. The events in the field of packaging printing in the whole world were analyzed. The trends of technique developments and the printing technology for packaging printing in near future were also discussed.

New seismic instrumentation packaged for all terrestrial environments (including the quietest observatories!).

Science.gov (United States)

Parker, Tim; Devanney, Peter; Bainbridge, Geoff; Townsend, Bruce

2017-04-01

The march to make every type of seismometer, weak to strong motion, reliable and economically deployable in any terrestrial environment continues with the availability of three new sensors and seismic systems including ones with over 200dB of dynamic range. Until recently there were probably 100 pier type broadband sensors for every observatory type pier, not the types of deployments geoscientists are needing to advance science and monitoring capability. Deeper boreholes are now the recognized quieter environments for best observatory class instruments and these same instruments can now be deployed in direct burial environments which is unprecedented. The experiences of facilities in large deployments of broadband seismometers in continental scale rolling arrays proves the utility of packaging new sensors in corrosion resistant casings and designing in the robustness needed to work reliably in temporary deployments. Integrating digitizers and other sensors decreases deployment complexity, decreases acquisition and deployment costs, increases reliability and utility. We'll discuss the informed evolution of broadband pier instruments into the modern integrated field tools that enable economic densification of monitoring arrays along with supporting new ways to approach geoscience research in a field environment.

Sensors, Volume 1, Fundamentals and General Aspects

Science.gov (United States)

Grandke, Thomas; Ko, Wen H.

1996-12-01

'Sensors' is the first self-contained series to deal with the whole area of sensors. It describes general aspects, technical and physical fundamentals, construction, function, applications and developments of the various types of sensors. This volume deals with the fundamentals and common principles of sensors and covers the wide areas of principles, technologies, signal processing, and applications. Contents include: Sensor Fundamentals, e.g. Sensor Parameters, Modeling, Design and Packaging; Basic Sensor Technologies, e.g. Thin and Thick Films, Integrated Magnetic Sensors, Optical Fibres and Intergrated Optics, Ceramics and Oxides; Sensor Interfaces, e.g. Signal Processing, Multisensor Signal Processing, Smart Sensors, Interface Systems; Sensor Applications, e.g. Automotive: On-board Sensors, Traffic Surveillance and Control, Home Appliances, Environmental Monitoring, etc. This volume is an indispensable reference work and text book for both specialits and newcomers, researchers and developers.

The portal protein plays essential roles at different steps of the SPP1 DNA packaging process

International Nuclear Information System (INIS)

Isidro, Anabela; Henriques, Adriano O.; Tavares, Paulo

2004-01-01

A large number of viruses use a specialized portal for entry of DNA to the viral capsid and for its polarized exit at the beginning of infection. These families of viruses assemble an icosahedral procapsid containing a portal protein oligomer in one of its 12 vertices. The viral ATPase (terminase) interacts with the portal vertex to form a powerful molecular motor that translocates DNA to the procapsid interior against a steep concentration gradient. The portal protein is an essential component of this DNA packaging machine. Characterization of single amino acid substitutions in the portal protein gp6 of bacteriophage SPP1 that block DNA packaging identified sequential steps in the packaging mechanism that require its action. Gp6 is essential at early steps of DNA packaging and for DNA translocation to the capsid interior, it affects the efficiency of DNA packaging, it is a central component of the headful sensor that determines the size of the packaged DNA molecule, and is essential for closure of the portal pore by the head completion proteins to prevent exit of the DNA encapsidated. Functional regions of gp6 necessary at each step are identified within its primary structure. The similarity between the architecture of portal oligomers and between the DNA packaging strategies of viruses using portals strongly suggests that the portal protein plays the same roles in a large number of viruses

A Review of Patents for the Smart Packaging of Meat and Muscle-based Food Products.

Science.gov (United States)

Holman, Benjamin; Kerry, Joseph P; Hopkins, David L

2017-10-31

Meat packaging once acted primarily as an inert barrier to protect its contents against contamination and this function has shifted. Packaging now includes complementary functions that improve product quality, longevity and customer/retail appeal. The devices and methods applied to achieve these functions may be categorised as smart packaging, which includes intelligent packaging, devised to monitor and communicate packaged content status, and active packaging, to provide passive adjustment of in-pack conditions from its interactions with the packaged meat. Smart packaging examples already available from recent patents include antimicrobial and antioxidant packaging coatings and inserts; sensors or indicators that identify spoilage and freshness; functional engineering customisations; improvements to packaging integrity; leak or tamper detectors; and, environmentally sustainable options. Together, these inventions respond to industry and customer demands for meat packaging and are therefore the focus of this review, in which we discuss their applications and limitations in meat packaging. Copyright© Bentham Science Publishers; For any queries, please email at epub@benthamscience.org.

Micro digital sun sensor: system in a package

NARCIS (Netherlands)

Boom, C.W. de; Leijtens, J.A.P.; Duivenbode, L.M.H. van; Heiden, N. van der

2004-01-01

A novel micro Digital Sun Sensor (μDSS) is under development in the frame of a micro systems technology (MST) development program (Microned) from the Dutch Ministry of Economic Affairs. Use of available micro system technologies in combination with the implementation of a dedicated solarcell for

Use of the Earth Observing One (EO-1) Satellite for the Namibia SensorWeb Flood Early Warning Pilot

Science.gov (United States)

Mandl, Daniel; Frye, Stuart; Cappelaere, Pat; Handy, Matthew; Policelli, Fritz; Katjizeu, McCloud; Van Langenhove, Guido; Aube, Guy; Saulnier, Jean-Francois; Sohlberg, Rob;

Incentives Packages and Employees’ Attitudes to Work: A Study Of Selected Government Parastatals In Ogun State, South-West, Nigeria

Directory of Open Access Journals (Sweden)

Hezekiah Olubusayo

2016-01-01

Full Text Available For any organization to compete favourably in the competitive society, employees’ attitudes and commitment towards work goes a long way in determining the employees’ performance and organization productivity. The main objective of this study is to examine the effect of incentives packages on employees’ attitudes towards work. A descriptive research method was adopted for this study using one hundred twenty valid questionnaires which were completed by members of staff of four (4 selected government parastartals in Ogun State, South-West Nigeria using stratified and systematic sampling technique. The data collected were carefully analyzed using percentage supported by standard deviation to represent the raw data in a meaningful manner. The results show that strong relationship exists between incentives packages and employees’ attitudes towards work and the workers are not satisfied with the present incentives packages. The summary of the findings indicates that there is strong correlation between the tested dependent variable and independent construct. However, employers of labour and decision makers should endeavour to review incentives packages at various levels in order to earn employees’ commitment and satisfaction.

Chiral-nematic liquid crystals as one dimensional photonic materials in optical sensors

NARCIS (Netherlands)

Mulder, D.J.; Schenning, A.P.H.J.; Bastiaansen, C.W.M.

2014-01-01

Current developments in the field of thermotropic chiral-nematic liquid crystals as sensors are discussed. These one dimensional photonic materials are based on low molecular weight liquid crystals and chiral-nematic polymeric networks. For both low molecular weight LCs and polymer networks,

Tritium power source for long-lived sensors

Science.gov (United States)

Litz, M. S.; Katsis, D. C.; Russo, J. A.; Carroll, J. J.

2014-06-01

A tritium-based indirect converting photovoltaic (PV) power source has been designed and prototyped as a long-lived (~15 years) power source for sensor networks. Tritium is a biologically benign beta emitter and low-cost isotope acquired from commercial vendors for this purpose. The power source combines tritium encapsulated with a radioluminescent phosphor coupled to a commercial PV cell. The tritium, phosphor, and PV components are packaged inside a BA5590-style military-model enclosure. The package has been approved by the nuclear regulatory commission (NRC) for use by DOD. The power source is designed to produce 100μW electrical power for an unattended radiation sensor (scintillator and avalanche photodiode) that can detect a 20 μCi source of 137Cs at three meters. This beta emitting indirect photon conversion design is presented as step towards the development of practical, logistically acceptable, lowcost long-lived compact power sources for unattended sensor applications in battlefield awareness and environmental detection.

Intelligent sensor and controller framework for the power grid

Science.gov (United States)

Akyol, Bora A.; Haack, Jereme Nathan; Craig, Jr., Philip Allen; Tews, Cody William; Kulkarni, Anand V.; Carpenter, Brandon J.; Maiden, Wendy M.; Ciraci, Selim

2018-03-20

Disclosed below are representative embodiments of methods, apparatus, and systems for monitoring and using data in an electric power grid. For example, one disclosed embodiment comprises a sensor for measuring an electrical characteristic of a power line, electrical generator, or electrical device; a network interface; a processor; and one or more computer-readable storage media storing computer-executable instructions. In this embodiment, the computer-executable instructions include instructions for implementing an authorization and authentication module for validating a software agent received at the network interface; instructions for implementing one or more agent execution environments for executing agent code that is included with the software agent and that causes data from the sensor to be collected; and instructions for implementing an agent packaging and instantiation module for storing the collected data in a data container of the software agent and for transmitting the software agent, along with the stored data, to a next destination.

3D printed System-on-Package (SoP) for environmental sensing and localization applications

KAUST Repository

Zhen, Su

2017-12-22

This paper presents for the first time an innovative 3D printed SoP sensor node with temperature, pressure and humidity sensing capabilities. It has an integrated wireless readout through a near isotropic (900MHz) GSM antenna-on-package. This sensor node is connected to the internet for remote monitoring and has the capability of localization. The paper presents the design of antenna-on-package as well as details of the communication and localization system. Fabrication challenges unique to 3D printing and integration of electronics on 3D printed circuit board are also discussed. Finally, the paper presents measurement results of antenna radiation pattern, return loss, localization accuracy and accuracy of sensing parameters.

The impact of packaging transparency on product attractiveness

Directory of Open Access Journals (Sweden)

Barbara Sabo

2017-12-01

Full Text Available The aim of the study was to investigate the impact of different levels of packaging transparency on the evaluation of attractiveness of a product within the packaging, in relation to whether it is a healthy or unhealthy product. Consumer preferences during buying decision process were also investigated. The study was conducted by two methods. The first one was related to consumer preferences and was based on a choice task, while the other one was related to packaging attractiveness and was based on subjective evaluation expressed through the Likert scale. Eight samples of packaging were used. They differed according to product type (healthy and unhealthy, and the level of transparency (fully transparent packaging, packaging with two windows, packaging with one window and non-transparent packaging. According to the results, consumers tend to ignore non-transparent packaging, regardless the product healthiness. The findings indicate the importance of thoughtful selection of packaging structure and its material in design process and launching the food products on the retail market.

Thermoelectric infrared imaging sensors for automotive applications

Science.gov (United States)

Hirota, Masaki; Nakajima, Yasushi; Saito, Masanori; Satou, Fuminori; Uchiyama, Makoto

2004-07-01

This paper describes three low-cost thermoelectric infrared imaging sensors having a 1,536, 2,304, and 10,800 element thermoelectric focal plane array (FPA) respectively and two experimental automotive application systems. The FPAs are basically fabricated with a conventional IC process and micromachining technologies and have a low cost potential. Among these sensors, the sensor having 2,304 elements provide high responsivity of 5,500 V/W and a very small size with adopting a vacuum-sealed package integrated with a wide-angle ZnS lens. One experimental system incorporated in the Nissan ASV-2 is a blind spot pedestrian warning system that employs four infrared imaging sensors. This system helps alert the driver to the presence of a pedestrian in a blind spot by detecting the infrared radiation emitted from the person"s body. The system can also prevent the vehicle from moving in the direction of the pedestrian. The other is a rearview camera system with an infrared detection function. This system consists of a visible camera and infrared sensors, and it helps alert the driver to the presence of a pedestrian in a rear blind spot. Various issues that will need to be addressed in order to expand the automotive applications of IR imaging sensors in the future are also summarized. This performance is suitable for consumer electronics as well as automotive applications.

IR panoramic alerting sensor concepts and applications

Science.gov (United States)

de Jong, Arie N.; Schwering, Piet B. W.

2003-09-01

During the last decade, protection of military and civilian operational platforms against weapons like guns, grenades, missiles, Unmanned Combat Aerial (and surface) Vehicles (UCAV's) and mines, has been an issue of increased importance due to the improved kill-probability of these threats. The standard countermeasure package of armour, guns, decoys, jammers, camouflage nets and smokes is inadequate when not accompanied by a suitable sensor package, primarily consisting of an alerting device, triggering consecutive steps in the countermeasure-chain. In this process of alert four different detection techniques are considered: pre-alert, giving the directions of possible attack, detection of an action of attack, identification of the threat and finally the precise localization (3-D). The design of the alerting device is greatly depending on the platform, on which it will be used, the associated and affordable cost and the nature of the threat. A number of sensor packages, considered, developed and evaluated at TNO-FEL is presented for simple, medium size and large and expensive platforms. In recent years the requirements for these sensors have become more and more strigent due to the growing number of scenarios. The attack can practically be from any direction, implying the need for a large Field of Regard (FOR), the attack range can vary considerably and the type of threat can be very diverse, implying great flexibility and dynamic range and rapid response of the sensor. Especially the localization at short ranges is a challenging issue. Various configurations including advantages and drawbacks are discussed.

Event-Based Color Segmentation With a High Dynamic Range Sensor

Directory of Open Access Journals (Sweden)

Alexandre Marcireau

2018-04-01

Full Text Available This paper introduces a color asynchronous neuromorphic event-based camera and a methodology to process color output from the device to perform color segmentation and tracking at the native temporal resolution of the sensor (down to one microsecond. Our color vision sensor prototype is a combination of three Asynchronous Time-based Image Sensors, sensitive to absolute color information. We devise a color processing algorithm leveraging this information. It is designed to be computationally cheap, thus showing how low level processing benefits from asynchronous acquisition and high temporal resolution data. The resulting color segmentation and tracking performance is assessed both with an indoor controlled scene and two outdoor uncontrolled scenes. The tracking's mean error to the ground truth for the objects of the outdoor scenes ranges from two to twenty pixels.

Water Sensors

Science.gov (United States)

1992-01-01

Mike Morris, former Associate Director of STAC, formed pHish Doctor, Inc. to develop and sell a pH monitor for home aquariums. The monitor, or pHish Doctor, consists of a sensor strip and color chart that continually measures pH levels in an aquarium. This is important because when the level gets too high, ammonia excreted by fish is highly toxic; at low pH, bacteria that normally break down waste products stop functioning. Sales have run into the tens of thousands of dollars. A NASA Tech Brief Technical Support Package later led to a salt water version of the system and a DoE Small Business Innovation Research (SBIR) grant for development of a sensor for sea buoys. The company, now known as Ocean Optics, Inc., is currently studying the effects of carbon dioxide buildup as well as exploring other commercial applications for the fiber optic sensor.

One- and two-dimensional search of an equation of state using a newly released 2DRoptimize package

Science.gov (United States)

Jamal, M.; Reshak, A. H.

2018-05-01

A new package called 2DRoptimize has been released for performing two-dimensional searches of the equation of state (EOS) for rhombohedral, tetragonal, and hexagonal compounds. The package is compatible and available with the WIEN2k package. The 2DRoptimize package performs a convenient volume and c/a structure optimization. First, the package finds the best value for c/a and the associated energy for each volume. In the second step, it calculates the EoS. The package then finds the equation of the c/a ratio vs. volume to calculate the c/a ratio at the optimized volume. In the last stage, by using the optimized volume and c/a ratio, the 2DRoptimize package calculates a and c lattice constants for tetragonal and hexagonal compounds, as well as the a lattice constant with the α angle for rhombohedral compounds. We tested our new package based on several hexagonal, tetragonal, and rhombohedral structures, and the 2D search results for the EOS showed that this method is more accurate than 1D search. Our results agreed very well with the experimental data and they were better than previous theoretical calculations.

Incentives Packages And Employees’ Attitudes To Work: A Study Of Selected Government Parastatals In Ogun State, South-West, Nigeria

Directory of Open Access Journals (Sweden)

Hezekiah Olubusayo

2014-01-01

Full Text Available For any organization to compete favourably in the competitivesociety, employees’ attitudes and commitment towards work goes a long way indetermining the employees’ performance and organization productivity. The main objective of this study is to examine the effect ofincentives packages on employees’ attitudes towards work. A descriptive researchmethod was adopted for this study using one hundred twenty valid questionnaireswhich were completed by members of staff of four (4 selected governmentparastartals in Ogun State, South-West Nigeria using stratified and systematicsampling technique. The data collected were carefully analyzed using percentagesupported by standard deviation to represent the raw data in a meaningfulmanner. The results show that strong relationship exists between incentives packagesand employees’ attitudes towards work and the workers are not satisfied withthe present incentives packages. The summary of the findings indicates thatthere is strong correlation between the tested dependent variable andindependent construct. However, employers of labour and decision makers shouldendeavour to review incentives packages at various levels in order to earnemployees’ commitment and satisfaction.

Fast risetime one megajoule capacitor bank

International Nuclear Information System (INIS)

Markins, D.; Baker, W.L.; Reinovsky, R.E.; Clark, J.G.

1976-01-01

A 100 kV, 1.1 MJ capacitor bank for plasma research experiments has been constructed for the Air Force Weapons Laboratory. The system consists of twenty, individual, low inductance capacitor modules, each utilizing a four element switch package approximately 2 meters wide. Each module contains twenty-four ''scyllac'' type 1.85 μF capacitors. A 100 kV output pulse is obtained by charging the top half of each module to +50 kV and the bottom half to -50 kV. A pressurized, low inductance multichannel switch package incorporating four separately triggered elements is designed to fit into the parallel plate transmission line system of the capacitor module. The bank is configured in a cross shape with twenty modules spaced uniformly around the perimeter of a parallel plate transmission line. The transmission line is constructed with 32 mil aluminum and insulated with 60 mils of mylar. The bank is designed to feed an easily replaceable central coaxial load. The entire system has been repeatedly fired at 100 kV with a dummy resistive load and has delivered 2.2 x 10 7 amperes of current with a risetime of 1.1 μsec. The total measured system inductance is 2.2 nH. This system represents a significant advance in the development of reliable, fast, high current capacitor banks

Ensuring socially responsible packaging design

DEFF Research Database (Denmark)

Geert Jensen, Birgitte

Most consumers have experienced occasional problems with opening packaging. Tomato sauce from the tinned mackerel splattered all over the kitchen counter, the unrelenting pickle jar lid, and the package of sliced ham that cannot be opened without a knife or a pair of scissors. The research project...... "User‐friendly Packaging" aims to create a platform for developing more user‐friendly packaging. One intended outcome of the project is a guideline that industry can use in development efforts. The project also points the way for more extended collaboration between companies and design researchers. How...... can design research help industry in packaging innovation?...

Miniature fiber Bragg grating sensor interrogator (FBG-Transceiver) system

Science.gov (United States)

Mendoza, Edgar A.; Kempen, Cornelia; Lopatin, Craig

2007-04-01

This paper describes recent progress conducted towards the development of a miniature fiber Bragg grating sensor interrogator (FBG-Transceiver TM) system based on multi-channel integrated optic sensor (InOSense TM) microchip technology. The hybrid InOSense TM microchip technology enables the integration of all of the functionalities, both passive and active, of conventional bench top FBG sensor interrogator systems, packaged in a miniaturized, low power operation, 2-cm x 5-cm package suitable for the long-term structural health monitoring in applications where size, weight, and power are critical for operation. The FBG-Transceiver system uses active optoelectronic components monolithically integrated to the InOSense TM microchip, a microprocessor controlled signal processing electronics board capable of processing the FBG sensors signals related to stress-strain and temperature as well as vibration and acoustics. The FBG-Transceiver TM system represents a new, reliable, highly robust technology that can be used to accurately monitor the status of an array of distributed fiber optic Bragg grating sensors installed in critical infrastructures. Its miniature package, low power operation, and state-of-the-art data communications architecture, all at a very affordable price makes it a very attractive solution for a large number of SHM/NDI applications in aerospace, naval and maritime industry, civil structures like bridges, buildings and dams, the oil and chemical industry, and for homeland security applications. The miniature, cost-efficient FBG-Transceiver TM system is poised to revolutionize the field of structural health monitoring and nondestructive inspection market. The sponsor of this program is NAVAIR under a DOD SBIR contract.

Multiple trigger scintillators were installed: big ones covering the total surface of the sensor and several smaller ones. The former give a trigger for each beam particle. The latter are used to select a part of the sensor surface for efficiency measurements.

CERN Multimedia

Nooren, G.

2004-01-01

Multiple trigger scintillators were installed: big ones covering the total surface of the sensor and several smaller ones. The former give a trigger for each beam particle. The latter are used to select a part of the sensor surface for efficiency measurements.

FSSC 22000 Packaging Implementation: a Plastics Industry Research

OpenAIRE

Cantanhede, Vanessa; Pereira, Karen Signori; Barreto, Daniel Weingart

2018-01-01

Abstract This paper presents the outcomes of an exploratory research carried out in companies, which are located in Brazil. They are FSSC-22000-certified food plastic packaging manufacturers. In order to identify the key aspects of the implementation process and certification, a questionnaire was developed and sent to twenty certified organizations. Out of them, eleven of which participating companies responded in a collaborative way. Based on the data obtained, improving competitiveness and...

Automation and robotics for Space Station in the twenty-first century

Science.gov (United States)

Willshire, K. F.; Pivirotto, D. L.

1986-01-01

Space Station telerobotics will evolve beyond the initial capability into a smarter and more capable system as we enter the twenty-first century. Current technology programs including several proposed ground and flight experiments to enable development of this system are described. Advancements in the areas of machine vision, smart sensors, advanced control architecture, manipulator joint design, end effector design, and artificial intelligence will provide increasingly more autonomous telerobotic systems.

Certification of packagings: compliance with DOT specification 7A packaging requirements

International Nuclear Information System (INIS)

Edling, D.A.

1976-01-01

A study was conducted to determine which of the packagings currently listed in CFR 49 Section 173.395 a.1-5, meet the Specification 7A requirements (CFR 49 Section 173.350). According to DOT HM-111 the present listing of various authorized DOT specifications in Section 173.394 and Section 173.395 (Type A containers) of ICC Tariff No. 27 would be deleted with complete reliance being placed on the use of DOT 7A, Type A general packaging specification. Each user of a Specification 7A package would be required to document and maintain on file for one year a written record of his determination of compliance with the DOT Specification 7A performance requirements. All the specification packagings listed in CFR 49 Section 173.395a.1-5 were tested and shown to meet the Specification 7A criteria; however, in many cases qualifications were placed on their use. Forty-nine specification packagings were tested and shown to meet the DOT Specification 7A performance requirements and since there were several styles of some specific packagings, this amounts to greater than 80 packagings. The extensive testing generally indicated a high degree of containment integrity in the packagings tested and the documentation discussed is a valuable tool for shippers of Type A quantities of radioactive materials

Monitoring nocturnal heart rate with bed sensor.

Science.gov (United States)

Migliorini, M; Kortelainen, J M; Pärkkä, J; Tenhunen, M; Himanen, S L; Bianchi, A M

2014-01-01

This article is part of the Focus Theme of Methods of Information in Medicine on "Biosignal Interpretation: Advanced Methods for Studying Cardiovascular and Respiratory Systems". The aim of this study is to assess the reliability of the estimated Nocturnal Heart Rate (HR), recorded through a bed sensor, compared with the one obtained from standard electrocardiography (ECG). Twenty-eight sleep deprived patients were recorded for one night each through matrix of piezoelectric sensors, integrated into the mattress, through polysomnography (PSG) simultaneously. The two recording methods have been compared in terms of signal quality and differences in heart beat detection. On average, coverage of 92.7% of the total sleep time was obtained for the bed sensor, testifying the good quality of the recordings. The average beat-to-beat error of the inter-beat intervals was 1.06%. These results suggest a good overall signal quality, however, considering fast heart rates (HR > 100 bpm), performances were worse: in fact, the sensitivity in the heart beat detection was 28.4% while the false positive rate was 3.8% which means that a large amount of fast beats were not detected. The accuracy of the measurements made using the bed sensor has less than 10% of failure rate especially in periods with HR lower than 70 bpm. For fast heart beats the uncertainty increases. This can be explained by the change in morphology of the bed sensor signal in correspondence of a higher HR.

Antimicrobial nanomaterials for food packaging applications

Directory of Open Access Journals (Sweden)

Radusin Tanja I.

2016-01-01

Full Text Available Food packaging industry presents one of the fastest growing industries nowadays. New trends in this industry, which include reducing food as well as packaging waste, improved preservation of food and prolonged shelf-life together with substitution of petrochemical sources with renewable ones are leading to development of this industrial area in diverse directions. This multidisciplinary challenge is set up both in front of food and material scientists. Nanotechnology is recently answering to these challenges, with different solutions-from improvements in materials properties to active packaging solutions, or both at the same time. Incorporation of nanoparticles into polymer matrix and preparation of hybrid materials is one of the methods of modification of polymer properties. Nano scaled materials with antimicrobial properties can act as active components when added into polymer, thereby leading to prolonged protective function of pristine food packaging material. This paper presents a review in the field of antimicrobial nanomaterials for food packaging in turn of technology, application and regulatory issues.

Low Cost Environmental Sensors for Spaceflight: NMP Space Environmental Monitor (SEM) Requirements

Science.gov (United States)

Garrett, Henry B.; Buehler, Martin G.; Brinza, D.; Patel, J. U.

2005-01-01

An outstanding problem in spaceflight is the lack of adequate sensors for monitoring the space environment and its effects on engineering systems. By adequate, we mean low cost in terms of mission impact (e.g., low price, low mass/size, low power, low data rate, and low design impact). The New Millennium Program (NMP) is investigating the development of such a low-cost Space Environmental Monitor (SEM) package for inclusion on its technology validation flights. This effort follows from the need by NMP to characterize the space environment during testing so that potential users can extrapolate the test results to end-use conditions. The immediate objective of this effort is to develop a small diagnostic sensor package that could be obtained from commercial sources. Environments being considered are: contamination, atomic oxygen, ionizing radiation, cosmic radiation, EMI, and temperature. This talk describes the requirements and rational for selecting these environments and reviews a preliminary design that includes a micro-controller data logger with data storage and interfaces to the sensors and spacecraft. If successful, such a sensor package could be the basis of a unique, long term program for monitoring the effects of the space environment on spacecraft systems.

One less trip : logging with less tripping, more protection

Energy Technology Data Exchange (ETDEWEB)

Byfield, M.

2005-12-15

New logging technology by Datalog Technology Inc. was described. Logging-while-tripping (LWT) technology uses a slim petrophysical sensor package that is moved to the targeted geological formation through a drill pipe, which reduces the exposure to vibration and shock involved in logging-while-drilling (LWD). The equipment features standard components in a patented configuration and comes in 2 segments: the receiver sub and the sensor package electronics. A receiver sub is inserted into the bottomhole assembly at the end of the drill string. Drilling progresses with the LWT sub in the bottomhole assembly until the borehole approaches the logging depth. The sensor package and electronics are then lowered into the drill string. If the well is horizontal, rig pumps push the package into the drill string until it lands in the LWT sub. Drill pipes are moved across the zone of interest and logs are recorded on downhole memory contained within the LWT package. As the logging operation progresses, a depth recorder at the surface records depth information along with the downhole recorders. When logging is completed, downhole tools are retrieved, and data downloaded from the LWT onboard memory is merged with the surface depth information to generate well logs. Retrieval via the drill string greatly reduces the risk of losing the logging gear, which contains radioactive material. Federal officials now routinely insist on extensive fishing operations to retrieve lost tools. If a well gets a gas kick while logging is in progress, the operator can still pump down mud or close the blowout preventer rams if necessary, and save time in determining where to perforate shallow gas wells. Compensated neutron logs, gamma rays, spectrum gamma rays, and induction have been tested with the LWT system. It was concluded that Petro-Canada has deployed the logs recently and has achieved results that compared satisfactorily with conventional logs. 2 figs.

Portal protein functions akin to a DNA-sensor that couples genome-packaging to icosahedral capsid maturation

OpenAIRE

Lokareddy, Ravi K.; Sankhala, Rajeshwer S.; Roy, Ankoor; Afonine, Pavel V.; Motwani, Tina; Teschke, Carolyn M.; Parent, Kristin N.; Cingolani, Gino

2017-01-01

Tailed bacteriophages and herpesviruses assemble infectious particles via an empty precursor capsid (or ?procapsid') built by multiple copies of coat and scaffolding protein and by one dodecameric portal protein. Genome packaging triggers rearrangement of the coat protein and release of scaffolding protein, resulting in dramatic procapsid lattice expansion. Here, we provide structural evidence that the portal protein of the bacteriophage P22 exists in two distinct dodecameric conformations: a...

A Vision-Based Sensor for Noncontact Structural Displacement Measurement

Science.gov (United States)

Feng, Dongming; Feng, Maria Q.; Ozer, Ekin; Fukuda, Yoshio

2015-01-01

Conventional displacement sensors have limitations in practical applications. This paper develops a vision sensor system for remote measurement of structural displacements. An advanced template matching algorithm, referred to as the upsampled cross correlation, is adopted and further developed into a software package for real-time displacement extraction from video images. By simply adjusting the upsampling factor, better subpixel resolution can be easily achieved to improve the measurement accuracy. The performance of the vision sensor is first evaluated through a laboratory shaking table test of a frame structure, in which the displacements at all the floors are measured by using one camera to track either high-contrast artificial targets or low-contrast natural targets on the structural surface such as bolts and nuts. Satisfactory agreements are observed between the displacements measured by the single camera and those measured by high-performance laser displacement sensors. Then field tests are carried out on a railway bridge and a pedestrian bridge, through which the accuracy of the vision sensor in both time and frequency domains is further confirmed in realistic field environments. Significant advantages of the noncontact vision sensor include its low cost, ease of operation, and flexibility to extract structural displacement at any point from a single measurement. PMID:26184197

Study of robust thin film PT-1000 temperature sensors for cryogenic process control applications

Science.gov (United States)

Ramalingam, R.; Boguhn, D.; Fillinger, H.; Schlachter, S. I.; Süßer, M.

2014-01-01

In some cryogenic process measurement applications, for example, in hydrogen technology and in high temperature superconductor based generators, there is a need of robust temperature sensors. These sensors should be able to measure the large temperature range of 20 - 500 K with reasonable resolution and accuracy. Thin film PT 1000 sensors could be a choice to cover this large temperature range. Twenty one sensors selected from the same production batch were tested for their temperature sensitivity which was then compared with different batch sensors. Furthermore, the sensor's stability was studied by subjecting the sensors to repeated temperature cycles of 78-525 K. Deviations in the resistance were investigated using ice point calibration and water triple point calibration methods. Also the study of directional oriented intense static magnetic field effects up to 8 Oersted (Oe) were conducted to understand its magneto resistance behaviour in the cryogenic temperature range from 77 K - 15 K. This paper reports all investigation results in detail.

"One for all and all for one": consensus-building within communities in rural India on their health microinsurance package

Directory of Open Access Journals (Sweden)

Dror DM

2014-08-01

Full Text Available David M Dror,1,2 Pradeep Panda,1 Christina May,3 Atanu Majumdar,1 Ruth Koren4 1Micro Insurance Academy, New Delhi, India; 2Erasmus University, Rotterdam, the Netherlands; 3University of Cologne, Cologne, Germany; 4Tel Aviv University, Ramat Aviv, Israel Introduction: This study deals with consensus by poor persons in the informal sector in rural India on the benefit-package of their community-based health insurance (CBHI. In this article we describe the process of involving rural poor in benefit-package design and assess the underlying reasons for choices they made and their ability to reach group consensus. Methods: The benefit-package selection process entailed four steps: narrowing down the options by community representatives, plus three Choosing Healthplans All Together (CHAT rounds conducted among female members of self-help groups. We use mixed-methods and four sources of data: baseline study, CHAT exercises, in-depth interviews, and evaluation questionnaires. We define consensus as a community resolution reached by discussion, considering all opinions, and to which everyone agrees. We use the coefficient of unalikeability to express consensus quantitatively (as variability of categorical variables rather than just categorically (as a binomial Yes/No. Findings: The coefficient of unalikeability decreased consistently over consecutive CHAT rounds, reaching zero (ie, 100% consensus in two locations, and confirmed gradual adoption of consensus. Evaluation interviews revealed that the wish to be part of a consensus was dominant in all locations. The in-depth interviews indicated that people enjoyed the participatory deliberations, were satisfied with the selection, and that group decisions reflected a consensus rather than majority. Moreover, evidence suggests that pre-selectors and communities aimed to enhance the likelihood that many households would benefit from CBHI. Conclusion: The voluntary and contributory CBHI relies on an engaging

Fiberoptic Applications in Sensors and Telemetry for the Electric Power Industry

Science.gov (United States)

Werneck, M. M.; Silva, A. V.; Souza, N. C. C.; Miguel, M. A. L.; Beres, C.; Yugue, E. S.; Carvalho, C. C.; Maciel, F. L.; Silva-Neto, J.; Guimarães, C. R. F.; Allil, R. C. S. B.; Baliosian, J. A. G.

2008-10-01

This presentation features the origin and the work of the Photonics and Instrumentation Laboratory (LIF) in instrumentation, fiberoptic sensors and POF technology. LIF started its work in 1986, twenty and two years ago, with only one lecturer and a few students. The first project was the development of the first Brazilian plotter with the purpose, at the time, to substitute expensive imported technology. LIF has today 25 people between students, technicians, scientists, engineers and teachers. We present here several successful projects of fiberoptic sensors using both silica and POF fibers, most of them applied on the field mainly for the electric power industry. Described are: a oil leakage sensor in petroleum hoses, PMMA evanescent sensors, temperature by the ruby fluorescence phenomenon, a current sensor calibrator for 500 kV current transformers, a leakage sensor to measure 500 kV insulators in extra-high voltage transmission line, etc. Many of the sensors presented here have been tested in the field, patented and transferred to the industry. We have also technical collaboration with several industries in Brazil, one of them a spin-off from LIF. Our objective is to become a reference centre in POF technology in Latin America and for this we are intended to keep producing "out of the shelves" POF technology and innovative industry solutions for many areas.

Development and Performance Evaluation of Optical Sensors for High Temperature Engine Applications

Science.gov (United States)

Adamovsky, G.; Varga, D.; Floyd, B.

2011-01-01

This paper discusses fiber optic sensors designed and constructed to withstand extreme temperatures of aircraft engine. The paper describes development and performance evaluation of fiber optic Bragg grating based sensors. It also describes the design and presents test results of packaged sensors subjected to temperatures up to 1000 C for prolonged periods of time.

Self-assembled micro-structured sensors for food safety in paper based food packaging

Energy Technology Data Exchange (ETDEWEB)

Hakovirta, M., E-mail: marko.hakovirta@storaenso.com; Aksoy, B.; Hakovirta, J.

2015-08-01

Natural self-assembled microstructured particles (diatomaceous earth) were used to develop a gas sensor paper with detection mechanism based on visible and distinct color changes of the sensor paper when exposed to volatile basic nitrogen compounds. The coating formulation for paper was prepared by applying diatomites, polyvinyl alcohol (PVOH), and pH sensitive dyes on acidic paper substrate. The surface coating was designed to allow a maximum gas flow through the diatomite sensors. The produced sensor paper was tested for sensitivity using different ammonia concentrations and we observed a sensitivity lower limit at 63 ppm. As a comparison, the results show comparable sensitivity levels to carbon nanotube based sensor technologies reported in literature. - Highlights: • Novel sensor paper was developed using micro-structured diatomaceous earth and pH sensitive dye. • The functionality is based on pH sensitive dye to indicate spoilage of meat or fish by color change. • Diatomaceous earth was successfully immobilized to the polyvinyl alcohol coating. • The coating was engineered to maximize the exposure of the diatom morphology. • The sensor paper achieved very high sensitivities for ammonia gas detection.

Self-assembled micro-structured sensors for food safety in paper based food packaging

International Nuclear Information System (INIS)

Hakovirta, M.; Aksoy, B.; Hakovirta, J.

2015-01-01

Natural self-assembled microstructured particles (diatomaceous earth) were used to develop a gas sensor paper with detection mechanism based on visible and distinct color changes of the sensor paper when exposed to volatile basic nitrogen compounds. The coating formulation for paper was prepared by applying diatomites, polyvinyl alcohol (PVOH), and pH sensitive dyes on acidic paper substrate. The surface coating was designed to allow a maximum gas flow through the diatomite sensors. The produced sensor paper was tested for sensitivity using different ammonia concentrations and we observed a sensitivity lower limit at 63 ppm. As a comparison, the results show comparable sensitivity levels to carbon nanotube based sensor technologies reported in literature. - Highlights: • Novel sensor paper was developed using micro-structured diatomaceous earth and pH sensitive dye. • The functionality is based on pH sensitive dye to indicate spoilage of meat or fish by color change. • Diatomaceous earth was successfully immobilized to the polyvinyl alcohol coating. • The coating was engineered to maximize the exposure of the diatom morphology. • The sensor paper achieved very high sensitivities for ammonia gas detection

An Implantable Intravascular Pressure Sensor for a Ventricular Assist Device

Directory of Open Access Journals (Sweden)

Luigi Brancato

2016-08-01

Full Text Available The aim of this study is to investigate the intravascular application of a micro-electro-mechanical system (MEMS pressure sensor to directly measure the hemodynamic characteristics of a ventricular assist device (VAD. A bio- and hemo-compatible packaging strategy is implemented, based on a ceramic thick film process. A commercial sub-millimeter piezoresistive sensor is attached to an alumina substrate, and a double coating of polydimethylsiloxane (PDMS and parylene-C is applied. The final size of the packaged device is 2.6 mm by 3.6 mm by 1.8 mm. A prototype electronic circuit for conditioning and read-out of the pressure signal is developed, satisfying the VAD-specific requirements of low power consumption (less than 14.5 mW in continuous mode and small form factor. The packaged sensor has been submitted to extensive in vitro tests. The device displayed a temperature-independent sensitivity (12 μ V/V/mmHg and good in vitro stability when exposed to the continuous flow of saline solution (less than 0.05 mmHg/day drift after 50 h. During in vivo validation, the transducer has been successfully used to record the arterial pressure waveform of a female sheep. A small, intravascular sensor to continuously register the blood pressure at the inflow and the outflow of a VAD is developed and successfully validated in vivo.

Automotive sensors: past, present and future

International Nuclear Information System (INIS)

Prosser, S J

2007-01-01

This paper will provide a review of past, present and future automotive sensors. Today's vehicles have become highly complex sophisticated electronic control systems and the majority of innovations have been solely achieved through electronics and the use of advanced sensors. A range of technologies have been used over the past twenty years including silicon microengineering, thick film, capacitive, variable reluctance, optical and radar. The automotive sensor market continues to grow with respect to vehicle production level in recognition of the transition to electronically controlled electrically actuated systems. The environment for these sensors continues to be increasingly challenging with respect to robustness, reliability, quality and cost

Automotive sensors: past, present and future

Science.gov (United States)

Prosser, S. J.

2007-07-01

This paper will provide a review of past, present and future automotive sensors. Today's vehicles have become highly complex sophisticated electronic control systems and the majority of innovations have been solely achieved through electronics and the use of advanced sensors. A range of technologies have been used over the past twenty years including silicon microengineering, thick film, capacitive, variable reluctance, optical and radar. The automotive sensor market continues to grow with respect to vehicle production level in recognition of the transition to electronically controlled electrically actuated systems. The environment for these sensors continues to be increasingly challenging with respect to robustness, reliability, quality and cost.

One Kind of Routing Algorithm Modified in Wireless Sensor Network

Directory of Open Access Journals (Sweden)

Wei Ni Ni

2016-01-01

Full Text Available The wireless sensor networks are the emerging next generation sensor networks, Routing technology is the wireless sensor network communication layer of the core technology. To build reliable paths in wireless sensor networks, we can consider two ways: providing multiple paths utilizing the redundancy to assure the communication reliability or constructing transmission reliability mechanism to assure the reliability of every hop. Braid multipath algorithm and ReInforM routing algorithm are the realizations of these two mechanisms. After the analysis of these two algorithms, this paper proposes a ReInforM routing algorithm based braid multipath routing algorithm.

Center for Advanced Sensors, Year One Funding (FY2005)

Science.gov (United States)

2006-10-30

retrieve data which is stored in a PostGRE database. Each base station executes custom software developed by C. Goodwin that generates OntoSensor...update using PostGRE ODBC drivers and retrieves updated tuples corresponding to raw sensor percepts. The retrieved tuples are then post-processed

Woven electrochemical fabric-based test sensors (WEFTS): a new class of multiplexed electrochemical sensors.

Science.gov (United States)

Choudhary, Tripurari; Rajamanickam, G P; Dendukuri, Dhananjaya

2015-05-07

We present textile weaving as a new technique for the manufacture of miniature electrochemical sensors with significant advantages over current fabrication techniques. Biocompatible silk yarn is used as the material for fabrication instead of plastics and ceramics used in commercial sensors. Silk yarns are coated with conducting inks and reagents before being handloom-woven as electrodes into patches of fabric to create arrays of sensors, which are then laminated, cut and packaged into individual sensors. Unlike the conventionally used screen-printing, which results in wastage of reagents, yarn coating uses only as much reagent and ink as required. Hydrophilic and hydrophobic yarns are used for patterning so that sample flow is restricted to a small area of the sensor. This simple fluidic control is achieved with readily available materials. We have fabricated and validated individual sensors for glucose and hemoglobin and a multiplexed sensor, which can detect both analytes. Chronoamperometry and differential pulse voltammetry (DPV) were used to detect glucose and hemoglobin, respectively. Industrial quantities of these sensors can be fabricated at distributed locations in the developing world using existing skills and manufacturing facilities. We believe such sensors could find applications in the emerging area of wearable sensors for chemical testing.

Components of Adenovirus Genome Packaging

Science.gov (United States)

Ahi, Yadvinder S.; Mittal, Suresh K.

2016-01-01

Adenoviruses (AdVs) are icosahedral viruses with double-stranded DNA (dsDNA) genomes. Genome packaging in AdV is thought to be similar to that seen in dsDNA containing icosahedral bacteriophages and herpesviruses. Specific recognition of the AdV genome is mediated by a packaging domain located close to the left end of the viral genome and is mediated by the viral packaging machinery. Our understanding of the role of various components of the viral packaging machinery in AdV genome packaging has greatly advanced in recent years. Characterization of empty capsids assembled in the absence of one or more components involved in packaging, identification of the unique vertex, and demonstration of the role of IVa2, the putative packaging ATPase, in genome packaging have provided compelling evidence that AdVs follow a sequential assembly pathway. This review provides a detailed discussion on the functions of the various viral and cellular factors involved in AdV genome packaging. We conclude by briefly discussing the roles of the empty capsids, assembly intermediates, scaffolding proteins, portal vertex and DNA encapsidating enzymes in AdV assembly and packaging. PMID:27721809

On-chip photonic particle sensor

Science.gov (United States)

Singh, Robin; Ma, Danhao; Agarwal, Anu; Anthony, Brian

2018-02-01

We propose an on-chip photonic particle sensor design that can perform particle sizing and counting for various environmental applications. The sensor is based on micro photonic ring resonators that are able to detect the presence of the free space particles through the interaction with their evanescent electric field tail. The sensor can characterize a wide range of the particle size ranging from a few nano meters to micron ( 1 micron). The photonic platform offers high sensitivity, compactness, fast response of the device. Further, FDTD simulations are performed to analyze different particle-light interactions. Such a compact and portable platform, packaged with integrated photonic circuit provides a useful sensing modality in space shuttle and environmental applications.

Grooming. Learning Activity Package.

Science.gov (United States)

Stark, Pamela

This learning activity package on grooming for health workers is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These topics are…

Web-based teaching video packages on anatomical education.

Science.gov (United States)

Ozer, Mehmet Asim; Govsa, Figen; Bati, Ayse Hilal

2017-11-01

The aim of this study was to study the effect of web-based teaching video packages on medical students' satisfaction during gross anatomy education. The objective was to test the hypothesis that individual preference, which can be related to learning style, influences individual utilization of the video packages developed specifically for the undergraduate medical curriculum. Web-based teaching video packages consisting of Closed Circuit Audiovisual System and Distance Education of Anatomy were prepared. 54 informative application videos each lasting an average 12 min, competent with learning objectives have been prepared. 300 young adults of the medical school on applied anatomy education were evaluated in terms of their course content, exam performance and perceptions. A survey was conducted to determine the difference between the students who did not use teaching packages with those who used it during or after the lecture. A mean of 150 hits for each student per year was indicated. Academic performance of anatomy has been an increase of 10 points. Positive effects of the video packages on anatomy education have manifested on the survey conducted on students. The survey was compiled under twenty different items including effectiveness, providing education opportunity and affecting learning positively. Additionally, the difference was remarkable that the positive ideas of the second year students on learning were statistically significant from that of the third year students. Web-based video packages are helpful, definitive, easily accessible and affordable which enable students with different pace of learning to reach information simultaneously in equal conditions and increase the learning activity in crowded group lectures in cadaver labs. We conclude that personality/learning preferences of individual students influence their use of video packages in the medical curriculum.

MORTICIA, a statistical analysis software package for determining optical surveillance system effectiveness.

Science.gov (United States)

Ramkilowan, A.; Griffith, D. J.

2017-10-01

Surveillance modelling in terms of the standard Detect, Recognise and Identify (DRI) thresholds remains a key requirement for determining the effectiveness of surveillance sensors. With readily available computational resources it has become feasible to perform statistically representative evaluations of the effectiveness of these sensors. A new capability for performing this Monte-Carlo type analysis is demonstrated in the MORTICIA (Monte- Carlo Optical Rendering for Theatre Investigations of Capability under the Influence of the Atmosphere) software package developed at the Council for Scientific and Industrial Research (CSIR). This first generation, python-based open-source integrated software package, currently in the alpha stage of development aims to provide all the functionality required to perform statistical investigations of the effectiveness of optical surveillance systems in specific or generic deployment theatres. This includes modelling of the mathematical and physical processes that govern amongst other components of a surveillance system; a sensor's detector and optical components, a target and its background as well as the intervening atmospheric influences. In this paper we discuss integral aspects of the bespoke framework that are critical to the longevity of all subsequent modelling efforts. Additionally, some preliminary results are presented.

Packaging of MEMS/MOEMS and nanodevices: reliability, testing, and characterization aspects

Science.gov (United States)

Tekin, Tolga; Ngo, Ha-Duong; Wittler, Olaf; Bouhlal, Bouchaib; Lang, Klaus-Dieter

2011-02-01

The last decade witnessed an explosive growth in research and development efforts devoted to MEMS devices and packaging. The successfully developed MEMS devices are, for example inkjet, pressure sensors, silicon microphones, accelerometers, gyroscopes, MOEMS, micro fuel cells and emerging MEMS. For the next decade, MEMS/MOEMS and nanodevice based products will penetrate into IT, telecommunications, automotive, defense, life sciences, medical and implantable applications. Forecasts say the MEMS market to be $14 billion by 2012. The packaging cost of MEMS/MOEMS products in general is about 70 percent. Unlike today's electronics IC packaging, their packaging are custom-built and difficult due to the moving structural elements. In order for the moving elements of a MEMS device to move effectively in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. For some MEMS devices, such as resonators and gyroscopes, vacuum packaging is required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a wafer level packaging. In terms of MEMS/MOEMS and nanodevice packaging, there are still many critical issues need to be addressed due to the increasing integration density supported by 3D heterogeneous integration of multi-physic components/layers consisting of photonics, electronics, rf, plasmonics, and wireless. The infrastructure of MEMS/MOEMS and nanodevices and their packaging is not well established yet. Generic packaging platform technologies are not available. Some of critical issues have been studied intensively in the last years. In this paper we will discuss about processes, reliability, testing and characterization of MEMS/MOEMS and nanodevice packaging.

AN ADA NAMELIST PACKAGE

Science.gov (United States)

Klumpp, A. R.

1994-01-01

The Ada Namelist Package, developed for the Ada programming language, enables a calling program to read and write FORTRAN-style namelist files. A namelist file consists of any number of assignment statements in any order. Features of the Ada Namelist Package are: the handling of any combination of user-defined types; the ability to read vectors, matrices, and slices of vectors and matrices; the handling of mismatches between variables in the namelist file and those in the programmed list of namelist variables; and the ability to avoid searching the entire input file for each variable. The principle user benefits of this software are the following: the ability to write namelist-readable files, the ability to detect most file errors in the initialization phase, a package organization that reduces the number of instantiated units to a few packages rather than to many subprograms, a reduced number of restrictions, and an increased execution speed. The Ada Namelist reads data from an input file into variables declared within a user program. It then writes data from the user program to an output file, printer, or display. The input file contains a sequence of assignment statements in arbitrary order. The output is in namelist-readable form. There is a one-to-one correspondence between namelist I/O statements executed in the user program and variables read or written. Nevertheless, in the input file, mismatches are allowed between assignment statements in the file and the namelist read procedure statements in the user program. The Ada Namelist Package itself is non-generic. However, it has a group of nested generic packages following the nongeneric opening portion. The opening portion declares a variety of useraccessible constants, variables and subprograms. The subprograms are procedures for initializing namelists for reading, reading and writing strings. The subprograms are also functions for analyzing the content of the current dataset and diagnosing errors. Two nested

The art of packaging: An investigation into the role of color in packaging, marketing, and branding

Directory of Open Access Journals (Sweden)

Behzad Mohebbi

2014-12-01

Full Text Available The purpose of this study is to contribute to the existing research in the field of packaging and marketing and shed more light on the psychology of colors and their effect on packaging and marketing. Nowadays, packaging is proved to be one of the significant factors in the success of promoting product sale. However, there is a perceived gap with respect to the different aspects of packaging, in particular the graphics, design, and color of packaging. The current study provides a comprehensive overview of packaging. It elaborates on different aspects of packaging and summarizes the findings of the most recent research conducted to date probing into packaging from different perspectives. It also discusses the role of color, i.e., the psychology of colors, and graphics in packaging and product sale. It is argued that graphics and color play key roles in promoting product sale and designers and marketers should attach a great deal of importance to color in packaging. The implications for producers, marketers, practitioners, and researchers are discussed in detail and suggestions for future research are provided.

Sensor development at the semiconductor laboratory of the Max-Planck-Society

Science.gov (United States)

Bähr, A.; Lechner, P.; Ninkovic, J.

2017-12-01

For more than twenty years the semiconductor laboratory of the Max-Planck Society (MPG-HLL) is developing high-performing, specialised, scientific silicon sensors including the integration of amplifying electronics on the sensor chip. This paper summarises the actual status of these devices like pnCCDs and DePFET Active Pixel Sensors and their applications.

Low Cost, Vacuum Packaging of GN&C Sensors, Phase I

Data.gov (United States)

National Aeronautics and Space Administration — Micro-electro-mechanical System (MEMS)-based gyroscopes, accelerometers and rate sensors are essential to miniaturizing the guidance, navigation and control...

Hazardous materials package performance regulations

International Nuclear Information System (INIS)

Russell, N.A.; Glass, R.E.; McClure, J.D.; Finley, N.C.

1992-01-01

The hazardous materials (hazmat) packaging development and certification process is currently defined by two different regulatory philosophies, one based on specification packagings and the other based on performance standards. With specification packagings, a packaging is constructed according to an agreed set of design specifications. In contrast, performance standards do not specify the packaging design; they specify performance standards that a packaging design must be able to pass before it can be certified for transport. The packaging can be designed according to individual needs as long as it meets these performance standards. Performance standards have been used nationally and internationally for about 40 years to certify radioactive materials (RAM) packagings. It is reasonable to state that for RAM transport, performance specifications have maintained transport safety. A committee of United Nation's experts recommended the performance standard philosophy as the preferred regulation method for hazmat packaging. Performance standards for hazmat packagings smaller than 118 gallons have been adopted in 49CFR178. Packagings for materials that are classified as toxic-by-inhalation must comply with the performance standards by October 1, 1993, and packagings for all other classes of hazardous materials covered must comply by October 1, 1996. For packages containing bulk (in excess of 188 gallons) quantities of materials that are extremely toxic by inhalation, there currently are no performance requirements. This paper discusses a Hazmat Packaging Performance Evaluation (HPPE) project to look at the subset of bulk packagings that are larger than 2000 gallons. The objectives of this project are the evaluate current hazmat specification packagings and develop supporting documentation for determining performance requirements for packagings in excess of 2000 gallons that transport hazardous materials that have been classified as extremely toxic by inhalation (METBI)

One-chip Integrated Module of MEMS Shock Sensor and Sensing Amplifier LSI using Pseudo-SOC Technology

Science.gov (United States)

Iida, Atsuko; Onozuka, Yutaka; Nishigaki, Michihiko; Yamada, Hiroshi; Funaki, Hideyuki; Itaya, Kazuhiko

We have been developing the pseudo-SOC technology for one-chip module integration of heterogeneous devices that realizes high electrical performance and high density of devices embodying the advantages of both SOC technology and SIP technology. Especially, this technology is available for MEMS-LSI integration. We developed a 0.2mm-thickness one-chip module integrating a MEMS shock sensor and a sensing amplifier LSI by applying this technology. The MEMS shock sensor and the sensing amplifier LSI were connected by high-rigidity epoxy resin optimized the material constants to reduce the stress and the warpage resulting from resin shrinkage due to curing. Then the planar insulating layer and the redistributed conducting layer were formed on it for the global layer. The MEMS shock sensor was preformed to be modularized with a glass cap. Electrical contacts were achieved by bonding of Au bumps on the MEMS fixed electrodes and via holes filled with Ag paste of the glass cap. Functional performance was confirmed by obtaining signal corresponding to the reference signal of the pick-up sensor. Furthermore, stress analysis was performed using the FEM model simulation considering the resin shrinkage.

Principle Findings from Development of a Recirculated Exhaust Gas Intake Sensor (REGIS) Enabling Cost-Effective Fuel Efficiency Improvement

Energy Technology Data Exchange (ETDEWEB)

Schnabel, Claus [Robert Bosch LLC, Farmington Hills, MI (United States)

2016-03-30

Kick-off of the Bosch scope of work for the REGIS project started in October 2012. The primary work-packages included in the Bosch scope of work were the following: overall project management, development of the EGR sensor (design of sensor element, design of protection tube, and design of mounting orientation), development of EGR system control strategy, build-up of prototype sensors, evaluation of system performance with the new sensor and the new control strategy, long-term durability testing, and development of a 2nd generation sensor concept for continued technology development after the REGIS project. The University of Clemson was a partner with Bosch in the REGIS project. The Clemson scope of work for the REGIS project started in June 2013. The primary work-packages included in the Clemson scope of work were the following: development of EGR system control strategy, and evaluation of system performance with the new sensor and new control strategy. This project was split into phase I, phase II and phase III. Phase I work was completed by the end of June 2014 and included the following primary work packages: development of sensor technical requirements, assembly of engine testbench at Clemson, design concept for sensor housing, connector, and mounting orientation, build-up of EGR flow test benches at Bosch, and build-up of first sensor prototypes. Phase II work was completed by the end of June 2015 and included the following primary work pack ages: development of an optimizing function and demonstration of robustness of sensor, system control strategy implementation and initial validation, completion of engine in the loop testing of developed control algorithm, completion of sensor testing including characteristic line, synthetic gas test stand, and pressure dependency characterization, demonstration of benefits of control w/o sensing via simulation, development of 2nd generation sensor concept. Notable technical achievements from phase II were the following

Laboratory sensor design for fiber-optic detection of 85Kr

International Nuclear Information System (INIS)

Geelhood, B.D.; Knopf, M.A.

1994-06-01

The goal of the fiber-optic detection of 85 Kr project is to produce a sensor to detect 85 Kr in real-time from either an airborne or ground-based platform. The 85 Kr gas is a fission product which is released in large quantities during fuel reprocessing and in minor quantities during nuclear reactor operations. Thus an airborne plume of 85 Kr is a radioactive signature of proliferation. Since 85 Kr has a 10.72 year half life, it is difficult for a proliferator to contain the gas for several half lives to avoid releasing the radioactive signature of proliferation. The long half life also results in a plume that can extend several kilometers from the source, which allows initial proliferation monitoring from large distances. The sensor can be used to make stand-alone, real-time measurements of 85 Kr that can be used as direct evidence for proliferation and/or as a screening sensor to determine when to collect air samples for further laboratory analysis. This report provides a summary of the 85 Kr beta sensor design that PNL will use in the laboratory to: (1) demonstrate the measurement technique, (2) establish minimum detection limits, and (3) optimize the sensor design for the final airborne sensor package. The goal of the final airborne sensor package will be to measure 85 Kr at activity levels as low as or as close to ambient background levels as possible with a reasonably sized sensor

Application of a sensor fusion algorithm for improving grasping stability

Energy Technology Data Exchange (ETDEWEB)

Kim, Jae Hyeon; Yoon, Hyun Suck; Moon, Hyung Pil; Choi, Hyouk Ryeol; Koo Ja Choon [Sungkyunkwan University, Suwon (Korea, Republic of)

2015-07-15

A robot hand normally employees various sensors that are packaged in small form factor, perform with delicately accurate, and cost mostly very expensive. Grasping operation of the hand relies especially on accuracy of those sensors. Even with a set of advanced sensory systems embedded in a robot hand, securing a stable grasping is still challenging task. The present work makes an attempt to improve force sensor accuracy by applying sensor fusion method. An optimal weight value sensor fusion method formulated with Kalman filters is presented and tested in the work. Using a set of inexpensive sensors, the work achieves a reliable force sensing and applies the enhanced sensor stability to an object pinch grasping.

Application of a sensor fusion algorithm for improving grasping stability

International Nuclear Information System (INIS)

Kim, Jae Hyeon; Yoon, Hyun Suck; Moon, Hyung Pil; Choi, Hyouk Ryeol; Koo Ja Choon

2015-01-01

A robot hand normally employees various sensors that are packaged in small form factor, perform with delicately accurate, and cost mostly very expensive. Grasping operation of the hand relies especially on accuracy of those sensors. Even with a set of advanced sensory systems embedded in a robot hand, securing a stable grasping is still challenging task. The present work makes an attempt to improve force sensor accuracy by applying sensor fusion method. An optimal weight value sensor fusion method formulated with Kalman filters is presented and tested in the work. Using a set of inexpensive sensors, the work achieves a reliable force sensing and applies the enhanced sensor stability to an object pinch grasping.

Developments in the active packaging of foods

NARCIS (Netherlands)

Vermeiren, L.; Devlieghere, F.; Beest, M. van; Kruijf, N. de; Debevere, J.

1999-01-01

Active packaging is one of the innovative food packaging concepts that has been introduced as a response to the continuous changes in current consumer demands and market trends. Major active packaging techniques are concerned with substances that absorb oxygen, ethylene, moisture, carbon dioxide,

One Hundred Twenty-One Resected Solid Pseudopapillary Tumors of the Pancreas: An 8-Year Single-Institution Experience at Zhongshan Hospital, Shanghai, China.

Science.gov (United States)

Xu, Yadong; Zhao, Guochao; Pu, Ning; Nuerxiati, Abulimiti; Ji, Yuan; Zhang, Lei; Rong, Yefei; Lou, Wenhui; Wang, Dansong; Kuang, Tiantao; Xu, Xuefeng; Wu, Wenchuan

2017-09-01

The aims of this study were to introduce our experience with treating patients with pancreatic solid pseudopapillary tumors (SPTs) and to investigate the clinical risk factors for recurrence of SPTs because no consensus has been established to date. One hundred twenty-one patients underwent surgical resection from January 2008 to December 2015 in our institution. Clinical data were collected from the standardized reports. Of the 121 patients, 93 (76.9%) were women, 28 (23.1%) were men, and the mean age at diagnosis was 33.7 years (range, 11-68 years). Sixty patients were subjected to short-term complications, and 8 patients experienced long-term complications, some of whom may require surgery. The tumor located in the distal pancreas (P = 0.02), and a Ki-67 index value > 1.5 (P = 0.01) indicated malignancy according to the World Health Organization 2000 classification. One hundred three patients responded to follow-up, and 3 cases (2.9%) were subject to liver metastases. Recurrence was more frequently observed in tumors classified as high-grade malignancies according to the World Health Organization 2010 classification (P = 0.013), synchronous metastases (P < 0.001), peripancreatic fat infiltration (P = 0.018), and lymphovascular invasion (P < 0.001). Evaluating the risk of the recurrence of SPTs still requires systematic and multicenter trials in the future, even some pathological features showed statistical differences.

Portable Radiation Package (PRP) Instrument Handbook

Energy Technology Data Exchange (ETDEWEB)

Reynolds, R Michael [Remote Measurements and Research Company, Seattle, WA (United States)

2017-08-03

The Portable Radiation Package (PRP) was developed to provide basic radiation information in locations such as ships at sea where proper exposure is remote and difficult, the platform is in motion, and azimuth alignment is not fixed. Development of the PRP began at Brookhaven National Laboratory (BNL) in the mid-1990s and versions of it were deployed on ships in the U.S. Department of Energy (DOE) Atmospheric Radiation Measurement (ARM) Climate Research Facility’s Nauru-99 project. The PRP was deployed on ships in support of the National Aeronautics and Space Administration (NASA) Sensor Intercomparison for Marine Biological and Interdisciplinary Ocean Studies (SIMBIOS) program. Over the years the measurements have remained the same while the post-processing data analysis, especially for the FRSR, has evolved. This document describes the next-generation Portable Radiation Package (PRP2) that was developed for the DOE ARM Facility, under contract no. 9F-31462 from Argonne National Laboratory (ANL). The PRP2 has the same scientific principles that were well validated in prior studies, but has upgraded electronic hardware. The PRP2 approach is completely modular, both in hardware and software. Each sensor input is treated as a separate serial stream into the data collection computer. In this way the operator has complete access to each component of the system for purposes of error checking, calibration, and maintenance. The resulting system is more reliable, easier to install in complex situations, and more amenable to upgrade.

Calibration of Kinect for Xbox One and Comparison between the Two Generations of Microsoft Sensors

Science.gov (United States)

Pagliari, Diana; Pinto, Livio

2015-01-01

In recent years, the videogame industry has been characterized by a great boost in gesture recognition and motion tracking, following the increasing request of creating immersive game experiences. The Microsoft Kinect sensor allows acquiring RGB, IR and depth images with a high frame rate. Because of the complementary nature of the information provided, it has proved an attractive resource for researchers with very different backgrounds. In summer 2014, Microsoft launched a new generation of Kinect on the market, based on time-of-flight technology. This paper proposes a calibration of Kinect for Xbox One imaging sensors, focusing on the depth camera. The mathematical model that describes the error committed by the sensor as a function of the distance between the sensor itself and the object has been estimated. All the analyses presented here have been conducted for both generations of Kinect, in order to quantify the improvements that characterize every single imaging sensor. Experimental results show that the quality of the delivered model improved applying the proposed calibration procedure, which is applicable to both point clouds and the mesh model created with the Microsoft Fusion Libraries. PMID:26528979

Calibration of Kinect for Xbox One and Comparison between the Two Generations of Microsoft Sensors

Directory of Open Access Journals (Sweden)

Diana Pagliari

2015-10-01

Full Text Available In recent years, the videogame industry has been characterized by a great boost in gesture recognition and motion tracking, following the increasing request of creating immersive game experiences. The Microsoft Kinect sensor allows acquiring RGB, IR and depth images with a high frame rate. Because of the complementary nature of the information provided, it has proved an attractive resource for researchers with very different backgrounds. In summer 2014, Microsoft launched a new generation of Kinect on the market, based on time-of-flight technology. This paper proposes a calibration of Kinect for Xbox One imaging sensors, focusing on the depth camera. The mathematical model that describes the error committed by the sensor as a function of the distance between the sensor itself and the object has been estimated. All the analyses presented here have been conducted for both generations of Kinect, in order to quantify the improvements that characterize every single imaging sensor. Experimental results show that the quality of the delivered model improved applying the proposed calibration procedure, which is applicable to both point clouds and the mesh model created with the Microsoft Fusion Libraries.

Production Method that Leads to TiO2 Nanofibrous Structure Usable in Food Packaging

Directory of Open Access Journals (Sweden)

Kovář Radovan

2016-12-01

Full Text Available Burned inorganic nanofibers most often occur in the nature in two forms: rutile and anatase. Today, the production of rutile is about to end, while anatase provides more application possibilities. The resulting fiber structure is determined by calcination. It is necessary to find the optimal temperature as well as time, during which the fibers must withstand temperature load. For such method of calcination, it is necessary to create a special design of continuous furnace. Anatase has application in food packaging. Packages containing anatase are used for: food safety, improved packaging for spoilage reduction, sensors for detection of pathogens and spoilage, disinfectants and antimicrobial surfaces.

Young people's perceptions of cigarette packaging and plain packaging: an online survey.

Science.gov (United States)

Moodie, Crawford; Ford, Allison; Mackintosh, Anne Marie; Hastings, Gerard

2012-01-01

In the United Kingdom, with most marketing channels prohibited, packaging is one of the few remaining ways that tobacco companies can promote their products. An online survey with young people aged 10-17 years (N = 658) was used to explore why youth choose cigarettes, perceptions of pack color, and perceptions of plain (nonbranded) cigarette packaging. Young people were also shown an image of 3 plain packs, which differed by shape and method of opening, and asked which they liked most and thought others their age would smoke. Price and what significant others smoke were key factors for choosing cigarettes, with packaging also an important influence. More than a third of the sample associated lighter pack color with weak tasting and less harmful cigarettes. Plain packs were rated negatively as were perceptions of plain pack users. One in 3 showed a preference for either a narrow "perfume type" plain pack or a plain "slide" pack that opened from the side, and 1 in 3 also thought that young people would smoke these packs. Packaging appears to both attract young people and mislead them about product strength and relative harm. Innovative pack construction (novel pack shape and method of opening) and the use of color are instrumental in these effects. The findings therefore suggest that any move to plain packaging should not only consider the benefits of removing branding (including color) but also of standardizing pack construction in terms of shape and method of opening.

Advanced organics for electronic substrates and packages

CERN Document Server

Fletcher, Andrew E

1992-01-01

Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection, and yet pre

Investigating the effect of aesthetic aspect of packaging and its dimensions on purchase intention through packaging preference

OpenAIRE

Abolghasem Ebrahimi; Sayed Moslem Alavi; Mehdi Najafi Seyahroodi

2015-01-01

Companies in the era of quality convergence of products are bound to differentiation. As a differentiating tool, Packaging can be a troubleshooter in this field. One of the ways of differentiation is to consider aesthetic aspect of packaging. According to this fact, current survey has studied the impact of aesthetic aspect of packaging on purchase intention of goods through packaging preference. A sample consisted of 384 customers of the big food stores in Shiraz is selected. To test the vali...

Safety Evaluation for Packaging 101-SY Hydrogen Mitigation Mixer Pump package

International Nuclear Information System (INIS)

Carlstrom, R.F.

1994-01-01

This Safety Evaluation for Packaging (SEP) provides analysis and considered necessary to approve a one-time transfer of the 101-SY Hydrogen Mitigation Mixer Pump (HMMP). This SEP will demonstrate that the transfer of the HMMP in a new shipping container will provide an equivalent degree of safety as would be provided by packages meeting US Department of Transportation (DOT)/US Nuclear Regulatory Commission (NRC) requirements. This fulfills onsite, transportation requirements implemented by WHC-CM-2-14

Safety Evaluation for Packaging 101-SY Hydrogen Mitigation Mixer Pump package

Energy Technology Data Exchange (ETDEWEB)

Carlstrom, R.F.

1994-10-05

This Safety Evaluation for Packaging (SEP) provides analysis and considered necessary to approve a one-time transfer of the 101-SY Hydrogen Mitigation Mixer Pump (HMMP). This SEP will demonstrate that the transfer of the HMMP in a new shipping container will provide an equivalent degree of safety as would be provided by packages meeting US Department of Transportation (DOT)/US Nuclear Regulatory Commission (NRC) requirements. This fulfills onsite, transportation requirements implemented by WHC-CM-2-14.

Annual Symposium in Electronics Packaging

CERN Document Server

1991-01-01

Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be cle...

Time temperature indicators as devices intelligent packaging

Directory of Open Access Journals (Sweden)

Adriana Pavelková

2013-01-01

Full Text Available Food packaging is an important part of food production. Temperature is a one of crucial factor which affecting the quality and safety of food products during distribution, transport and storage. The one way of control of food quality and safety is the application of new packaging systems, which also include the intelligent or smart packaging. Intelligent packaging is a packaging system using different indicators for monitoring the conditions of production, but in particular the conditions during transport and storage. Among these indicators include the time-temperature indicators to monitor changes in temperature, which is exposed the product and to inform consumers about the potential risks associated with consumption of these products. Time temperature indicators are devices that show an irreversible change in a physical characteristic, usually color or shape, in response to temperature history. Some are designed to monitor the evolution of temperature with time along the distribution chain and others are designed to be used in the consumer packages.

RECENT TRENDS IN PACKAGING SYSTEMS FOR PHARMACEUTICAL PRODUCTS

Directory of Open Access Journals (Sweden)

Renata Dobrucka

2014-12-01

Full Text Available Background:  In recent years, pharmaceutical packaging market was one of the fastest growing areas of the packaging industry. At the same time the packaging manufacturers put high demands on quality and safety. Methods: Review of innovations in packaging systems for pharmaceutical products was made including newest information of researches and achievements of recent years. Results and conclusion: Observed in recent years the development of pharmaceutical packaging market expanded due to with the huge technological advances that allow introduction of new packaging. Also, in this study presented intelligent packaging in pharmacy and innovation in child-resistance packaging.

Past, current and potential utilisation of active and intelligent packaging systems for meat and muscle-based products: A review.

Science.gov (United States)

Kerry, J P; O'Grady, M N; Hogan, S A

2006-09-01

Interest in the use of active and intelligent packaging systems for meat and meat products has increased in recent years. Active packaging refers to the incorporation of additives into packaging systems with the aim of maintaining or extending meat product quality and shelf-life. Active packaging systems discussed include oxygen scavengers, carbon dioxide scavengers and emitters, moisture control agents and anti-microbial packaging technologies. Intelligent packaging systems are those that monitor the condition of packaged foods to give information regarding the quality of the packaged food during transport and storage. The potential of sensor technologies, indicators (including integrity, freshness and time-temperature (TTI) indicators) and radio frequency identification (RFID) are evaluated for potential use in meat and meat products. Recognition of the benefits of active and intelligent packaging technologies by the food industry, development of economically viable packaging systems and increased consumer acceptance is necessary for commercial realisation of these packaging technologies.

The LCDROOT Analysis Package

International Nuclear Information System (INIS)

Abe, Toshinori

2001-01-01

The North American Linear Collider Detector group has developed simulation and analysis program packages. LCDROOT is one of the packages, and is based on ROOT and the C++ programing language to maximally benefit from object oriented programming techniques. LCDROOT is constantly improved and now has a new topological vertex finder, ZVTOP3. In this proceeding, the features of the LCDROOT simulation are briefly described

A MEMS SOI-based piezoresistive fluid flow sensor

Science.gov (United States)

Tian, B.; Li, H. F.; Yang, H.; Song, D. L.; Bai, X. W.; Zhao, Y. L.

2018-02-01

In this paper, a SOI (silicon-on-insulator)-based piezoresistive fluid flow sensor is presented; the presented flow sensor mainly consists of a nylon sensing head, stainless steel cantilever beam, SOI sensor chip, printed circuit board, half-cylinder gasket, and stainless steel shell. The working principle of the sensor and some detailed contrastive analysis about the sensor structure were introduced since the nylon sensing head and stainless steel cantilever beam have distinct influence on the sensor performance; the structure of nylon sensing head and stainless steel cantilever beam is also discussed. The SOI sensor chip was fabricated using micro-electromechanical systems technologies, such as reactive ion etching and low pressure chemical vapor deposition. The designed fluid sensor was packaged and tested; a calibration installation system was purposely designed for the sensor experiment. The testing results indicated that the output voltage of the sensor is proportional to the square of the fluid flow velocity, which is coincident with the theoretical derivation. The tested sensitivity of the sensor is 3.91 × 10-4 V ms2/kg.

Fiscal 2000 achievement report on the venture business assisting type regional consortium - Core industry creation type. Comprehensive research and development for reducing ABS (MABS) sensor system into small module for enhancing vehicle steering safety; 2000 nendo chiiki consortium kenkyu kaihatsu jigyo seika hokokusho. Koji no sharyo soansei wo jitsugensuru ABS (MABS) sensor system no kogata module ka ni tsuite no sogo kenkyu kaihatsu

Energy Technology Data Exchange (ETDEWEB)

NONE

2001-03-01

The effort aims to develop a sensor system to enable overall VDC (vehicle dynamic control). The goal is to manufacture a small module type sensor system more than 20 times higher than the conventional type in responding speed and accuracy, which will use a novel ABS (anti-lock braking system) capable of direct and real-time measurement of axial forces in the four directions. The prototype module will be a package in which a system-on-a-chip accommodating peripheral circuits is integrated with a sensor. In the effort to develop a novel multi-axial sensing system (MASS) for a smaller ABS, a circuit optimization technology was developed. A dedicated IC (integrated circuit) was developed for a system to process a large volume of signals. In the effort to develop technologies for packaging the novel sensor system and for constructing modules, technologies were developed for integrating sensor components and an IC into one, module junctioning, module installation, simplification of the installation process, and for the manufacturing of modules. Developed in the effort to optimize MASS were technologies involving the selection and evaluation of sensor components and the enhancement of such processes, optimization of the sensor itself, and the improvement of the sensor system for higher efficiency in calculation. Sensor modules were tested aboard vehicles and the compatibility of the system-on-a-chip with the MASS module was confirmed. (NEDO)

Packaging of Sin Goods - Commitment or Exploitation?

DEFF Research Database (Denmark)

Nafziger, Julia

to such self-control problems, and possibly exploit them, by offering different package sizes. In a competitive market, either one or three (small, medium and large) packages are offered. In contrast to common intuition, the large, and not the small package is a commitment device. The latter serves to exploit...

Highly-hermetic feedthrough fiber pigtailed circular TO-can electro-optic sensor for avionics applications

Science.gov (United States)

Lauzon, Jocelyn; Leduc, Lorrain; Bessette, Daniel; Bélanger, Nicolas

2012-06-01

Electro-optic sensors made of lasers or photodetectors assemblies can be associated with a window interface. In order to use these sensors in an avionics application, this interface has to be set on the periphery of the aircraft. This creates constraints on both the position/access of the associated electronics circuit card and the aircraft fuselage. Using an optical fiber to guide the light signal to a sensor being situated inside the aircraft where electronics circuit cards are deployed is an obvious solution that can be readily available. Fiber collimators that adapt to circular TO-can type window sensors do exist. However, they are bulky, add weight to the sensor and necessitate regular maintenance of the optical interface since both the sensor window and the collimator end-face are unprotected against contamination. Such maintenance can be complex since the access to the electronics circuit card, where the sensor is sitting, is usually difficult. This interface alignment can also be affected by vibrations and mechanical shocks, thus impacting sensor performances. As a solution to this problem, we propose a highly-hermetic feedthrough fiber pigtailed circular TO-can package. The optical element to optical fiber interface being set inside the hermetic package, there is no risk of contamination and thus, such a component does not require any maintenance. The footprint of these sensors being identical to their window counterparts, they offer drop-in replacement opportunities. Moreover, we have validated such packaged electro-optic sensors can be made to operate between -55 to 115°C, sustain 250 temperature cycles, 1500G mechanical shocks, 20Grms random vibrations without any performance degradations. Their water content is much smaller than the 0.5% limit set by MIL-STD-883, Method 1018. They have also been verified to offer a fiber pigtail strain relief resistance over 400g. Depending on the electronics elements inside these sensors, they can be made to have a

Pressure-Sensor Assembly Technique

Science.gov (United States)

Pruzan, Daniel A.

2003-01-01

Nielsen Engineering & Research (NEAR) recently developed an ultrathin data acquisition system for use in turbomachinery testing at NASA Glenn Research Center. This system integrates a microelectromechanical- systems- (MEMS-) based absolute pressure sensor [0 to 50 psia (0 to 345 kPa)], temperature sensor, signal-conditioning application-specific integrated circuit (ASIC), microprocessor, and digital memory into a package which is roughly 2.8 in. (7.1 cm) long by 0.75 in. (1.9 cm) wide. Each of these components is flip-chip attached to a thin, flexible circuit board and subsequently ground and polished to achieve a total system thickness of 0.006 in. (0.15 mm). Because this instrument is so thin, it can be quickly adhered to any surface of interest where data can be collected without disrupting the flow being investigated. One issue in the development of the ultrathin data acquisition system was how to attach the MEMS pressure sensor to the circuit board in a manner which allowed the sensor s diaphragm to communicate with the ambient fluid while providing enough support for the chip to survive the grinding and polishing operations. The technique, developed by NEAR and Jabil Technology Services Group (San Jose, CA), is described below. In the approach developed, the sensor is attached to the specially designed circuit board, see Figure 1, using a modified flip-chip technique. The circular diaphragm on the left side of the sensor is used to actively measure the ambient pressure, while the diaphragm on the right is used to compensate for changes in output due to temperature variations. The circuit board is fabricated with an access hole through it so that when the completed system is installed onto a wind tunnel model (chip side down), the active diaphragm is exposed to the environment. After the sensor is flip-chip attached to the circuit board, the die is underfilled to support the chip during the subsequent grinding and polishing operations. To prevent this

Laterally Driven Resonant Pressure Sensor with Etched Silicon Dual Diaphragms and Combined Beams

Directory of Open Access Journals (Sweden)

Xiaohui Du

2016-01-01

Full Text Available A novel structure of the resonant pressure sensor is presented in this paper, which tactfully employs intercoupling between dual pressure-sensing diaphragms and a laterally driven resonant strain gauge. After the resonant pressure sensor principle is introduced, the coupling mechanism of the diaphragms and resonator is analyzed and the frequency equation of the resonator based on the triangle geometry theory is developed for this new coupling structure. The finite element (FE simulation results match the theoretical analysis over the full scale of the device. This pressure sensor was first fabricated by dry/wet etching and thermal silicon bonding, followed by vacuum-packaging using anodic bonding technology. The test maximum error of the fabricated sensor is 0.0310%F.S. (full scale in the range of 30 to 190 kPa, its pressure sensitivity is negative and exceeding 8 Hz/kPa, and its Q-factor reaches 20,000 after wafer vacuum-packaging. A novel resonant pressure sensor with high accuracy is presented in this paper.

A Compact Inductive Position Sensor Made by Inkjet Printing Technology on a Flexible Substrate

Directory of Open Access Journals (Sweden)

Nataša Samardžić

2012-01-01

Full Text Available This paper describes the design, simulation and fabrication of an inductive angular position sensor on a flexible substrate. The sensor is composed of meandering silver coils printed on a flexible substrate (Kapton film using inkjet technology. The flexibility enables that after printing in the plane, the coils could be rolled and put inside each other. By changing the angular position of the internal coil (rotor related to the external one (stator, the mutual inductance is changed and consequently the impedance. It is possible to determine the angular position from the measured real and imaginary part of the impedance, in our case in the frequency range from 1 MHz to 10 MHz. Experimental results were compared with simulation results obtained by in-house developed software tool, and very good agreement has been achieved. Thanks to the simple design and fabrication, smaller package space requirements and weight, the presented sensor represents a cost-effective alternative to the other sensors currently used in series production applications.

Use of Comics to Enhance Students' Learning for the Development of the Twenty-First Century Competencies in the Mathematics Classroom

Science.gov (United States)

Toh, Tin Lam; Cheng, Lu Pien; Ho, Siew Yin; Jiang, Heng; Lim, Kam Ming

2017-01-01

This paper discusses the use of comics in teaching mathematics in the secondary mathematics classroom. We explicate how the use of comics in teaching mathematics can prepare students for the twenty-first century competencies. We developed an alternative teaching package using comics for two lower secondary mathematics topics. This alternative…

ANTIMICROBIALS USED IN ACTIVE PACKAGING FILMS

OpenAIRE

Dıblan, Sevgin; Kaya, Sevim

2017-01-01

Active packaging technology is one of the innovativemethods for preserving of food products, and antimicrobial packaging films is amajor branch and promising application of this technology. In order to controlmicrobial spoilage and also contamination of pathogen onto processed or fresh food,antimicrobial agent(s) is/are incorporated into food packaging structure.Polymer type as a carrier of antimicrobial can be petroleum-based plastic orbiopolymer: because of environmental concerns researcher...

Packaging Review Guide for Reviewing Safety Analysis Reports for Packagings

Energy Technology Data Exchange (ETDEWEB)

DiSabatino, A; Biswas, D; DeMicco, M; Fisher, L E; Hafner, R; Haslam, J; Mok, G; Patel, C; Russell, E

2007-04-12

This Packaging Review Guide (PRG) provides guidance for Department of Energy (DOE) review and approval of packagings to transport fissile and Type B quantities of radioactive material. It fulfills, in part, the requirements of DOE Order 460.1B for the Headquarters Certifying Official to establish standards and to provide guidance for the preparation of Safety Analysis Reports for Packagings (SARPs). This PRG is intended for use by the Headquarters Certifying Official and his or her review staff, DOE Secretarial offices, operations/field offices, and applicants for DOE packaging approval. This PRG is generally organized at the section level in a format similar to that recommended in Regulatory Guide 7.9 (RG 7.9). One notable exception is the addition of Section 9 (Quality Assurance), which is not included as a separate chapter in RG 7.9. Within each section, this PRG addresses the technical and regulatory bases for the review, the manner in which the review is accomplished, and findings that are generally applicable for a package that meets the approval standards. This Packaging Review Guide (PRG) provides guidance for DOE review and approval of packagings to transport fissile and Type B quantities of radioactive material. It fulfills, in part, the requirements of DOE O 460.1B for the Headquarters Certifying Official to establish standards and to provide guidance for the preparation of Safety Analysis Reports for Packagings (SARPs). This PRG is intended for use by the Headquarters Certifying Official and his review staff, DOE Secretarial offices, operations/field offices, and applicants for DOE packaging approval. The primary objectives of this PRG are to: (1) Summarize the regulatory requirements for package approval; (2) Describe the technical review procedures by which DOE determines that these requirements have been satisfied; (3) Establish and maintain the quality and uniformity of reviews; (4) Define the base from which to evaluate proposed changes in scope

Chapter Twenty One

African Journals Online (AJOL)

User

In this paper I approach art through some literary expositions of Uche Okeke. ... importance of Igbo forklore to the creative enterprise, as exemplified by ... mature thinker, I concluded that Uche Okeke was a master artist whose ideas have ...

MEMS optical sensor

DEFF Research Database (Denmark)

2013-01-01

The present invention relates to an all-optical sensor utilizing effective index modulation of a waveguide and detection of a wavelength shift of reflected light and a force sensing system accommodating said optical sensor. One embodiment of the invention relates to a sensor system comprising...... at least one multimode light source, one or more optical sensors comprising a multimode sensor optical waveguide accommodating a distributed Bragg reflector, at least one transmitting optical waveguide for guiding light from said at least one light source to said one or more multimode sensor optical...... waveguides, a detector for measuring light reflected from said Bragg reflector in said one or more multimode sensor optical waveguides, and a data processor adapted for analyzing variations in the Bragg wavelength of at least one higher order mode of the reflected light....

Fiber Bragg grating sensors in harsh environments: considerations and industrial monitoring applications

Science.gov (United States)

Méndez, Alexis

2017-06-01

Over the last few years, fiber optic sensors (FOS) have seen an increased acceptance and widespread use in industrial sensing and in structural monitoring in civil, aerospace, marine, oil & gas, composites and other applications. One of the most prevalent types in use today are fiber Bragg grating (FBG) sensors. Historically, FOS have been an attractive solution because of their EM immunity and suitability for use in harsh environments and rugged applications with extreme temperatures, radiation exposure, EM fields, high voltages, water contact, flammable atmospheres, or other hazards. FBG sensors have demonstrated that can operate reliably in many different harsh environment applications but proper type and fabrication process are needed, along with suitable packaging and installation procedure. In this paper, we review the impact that external factors and environmental conditions play on FBG's performance and reliability, and describe the appropriate sensor types and protection requirements suitable for a variety of harsh environment applications in industrial furnaces, cryogenic coolers, nuclear plants, maritime vessels, oil & gas wells, aerospace crafts, automobiles, and others.

Information-based self-organization of sensor nodes of a sensor network

Science.gov (United States)

Ko, Teresa H [Castro Valley, CA; Berry, Nina M [Tracy, CA

2011-09-20

A sensor node detects a plurality of information-based events. The sensor node determines whether at least one other sensor node is an information neighbor of the sensor node based on at least a portion of the plurality of information-based events. The information neighbor has an overlapping field of view with the sensor node. The sensor node sends at least one communication to the at least one other sensor node that is an information neighbor of the sensor node in response to at least one information-based event of the plurality of information-based events.

Aluminum-thin-film packaged fiber Bragg grating probes for monitoring the maximum tensile strain of composite materials.

Science.gov (United States)

Im, Jooeun; Kim, Mihyun; Choi, Ki-Sun; Hwang, Tae-Kyung; Kwon, Il-Bum

2014-06-10

In this paper, new fiber Bragg grating (FBG) sensor probes are designed to intermittently detect the maximum tensile strain of composite materials, so as to evaluate the structural health status. This probe is fabricated by two thin Al films bonded to an FBG optical fiber and two supporting brackets, which are fixed on the surface of composite materials. The residual strain of the Al packaged FBG sensor probe is induced by the strain of composite materials. This residual strain can indicate the maximum strain of composite materials. Two types of sensor probes are prepared-one is an FBG with 18 μm thick Al films, and the other is an FBG with 36 μm thick Al films-to compare the thickness effect on the detection sensitivity. These sensor probes are bonded on the surfaces of carbon fiber reinforced plastics composite specimens. In order to determine the strain sensitivity between the residual strain of the FBG sensor probe and the maximum strain of the composite specimen, tensile tests are performed by universal testing machine, under the loading-unloading test condition. The strain sensitivities of the probes, which have the Al thicknesses of 18 and 36 μm, are determined as 0.13 and 0.23, respectively.

Speech Adaptation to Kinematic Recording Sensors: Perceptual and Acoustic Findings

Science.gov (United States)

Dromey, Christopher; Hunter, Elise; Nissen, Shawn L.

2018-01-01

Purpose: This study used perceptual and acoustic measures to examine the time course of speech adaptation after the attachment of electromagnetic sensor coils to the tongue, lips, and jaw. Method: Twenty native English speakers read aloud stimulus sentences before the attachment of the sensors, immediately after attachment, and again 5, 10, 15,…

Development directions of packaging made from polymer materials

Directory of Open Access Journals (Sweden)

Jovanović Slobodan

2011-01-01

Full Text Available World packaging market achieves turnover of about $620 billion per year with one third of this amount being associated to packaging made from polymer materials. It is expected that this kind of packaging consumption will hold at least 3% of world packaging market share in the next five years and that it will surpass the consumption of all other materials used in the packaging production. This can be contributed to product quality, low production costs as well as significant investments made in the development of polymer materials, packaging technology and packaging. This paper presents some development directions for packaging made from polymer materials, such as: packaging in the protective atmosphere, the use of active and intelligent packaging, and the use of biopolymers and recycled polymers for packaging production that come into direct contact with the packed product.

Oral Hygiene. Learning Activity Package.

Science.gov (United States)

Hime, Kirsten

This learning activity package on oral hygiene is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, a list of definitions, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These topics…

On Packaging of MEMS. Simulation of Transfer Moulding and Packaging Stress and their Effect on a Family of piezo-resistive Pressure Sensors

OpenAIRE

Krondorfer, Rudolf H.

2004-01-01

Micro Electro Mechanical Systems (MEMS) produced to date include IR detectors, accelerometers, pressure sensors, micro lenses, actuators, chemical sensors, gear drives, RF devices, optical processor chips, micro robots and devices for biomedical analysis. The track for tomorrow has already been set and products like 3D TV, physician on a chip, lab on a chip, micro aircraft and food safety sensors will be developed when the technology matures and the market is ready. Todays MEMS fabricatio...

Estimating actual evapotranspiration from remote sensing imagery using R: the package 'TriangleMethod'.

Science.gov (United States)

Gampe, David; Huber García, Verena; Marzahn, Philip; Ludwig, Ralf

2017-04-01

Actual evaporation (Eta) is an essential variable to assess water availability, drought risk and food security, among others. Measurements of Eta are however limited to a small footprint, hampering a spatially explicit analysis and application and are very often not available at all. To overcome the problem of data scarcity, Eta can be assessed by various remote sensing approaches such as the Triangle Method (Jiang & Islam, 1999). Here, Eta is estimated by using the Normalized Difference Vegetation Index (NDVI) and land surface temperature (LST). In this study, the R-package 'TriangleMethod' was compiled to efficiently perform the calculations of NDVI and processing LST to finally derive Eta from the applied data set. The package contains all necessary calculation steps and allows easy processing of a large data base of remote sensing images. By default, the parameterization for the Landsat TM and ETM+ sensors are implemented, however, the algorithms can be easily extended to additional sensors. The auxiliary variables required to estimate Eta with this method, such as elevation, solar radiation and air temperature at the overpassing time, can be processed as gridded information to allow for a better representation of the study area. The package was successfully applied in various studies in Spain, Palestine, Costa Rica and Canada.

Sensor Placement Optimization using Chama

Energy Technology Data Exchange (ETDEWEB)

Klise, Katherine A. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States). Geotechnology and Engineering Dept.; Nicholson, Bethany L. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States). Discrete Math and Optimization Dept.; Laird, Carl Damon [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States). Discrete Math and Optimization Dept.

2017-10-01

Continuous or regularly scheduled monitoring has the potential to quickly identify changes in the environment. However, even with low - cost sensors, only a limited number of sensors can be deployed. The physical placement of these sensors, along with the sensor technology and operating conditions, can have a large impact on the performance of a monitoring strategy. Chama is an open source Python package which includes mixed - integer, stochastic programming formulations to determine sensor locations and technology that maximize monitoring effectiveness. The methods in Chama are general and can be applied to a wide range of applications. Chama is currently being used to design sensor networks to monitor airborne pollutants and to monitor water quality in water distribution systems. The following documentation includes installation instructions and examples, description of software features, and software license. The software is intended to be used by regulatory agencies, industry, and the research community. It is assumed that the reader is familiar with the Python Programming Language. References are included for addit ional background on software components. Online documentation, hosted at http://chama.readthedocs.io/, will be updated as new features are added. The online version includes API documentation .

Miniaturized robotically deployed sensor systems for in-situ characterization of hazardous waste

International Nuclear Information System (INIS)

Fischer, G.J.

1996-01-01

A series of ''MiniLab'' end effectors are currently being designed for robotic deployment in hazardous areas such as waste storage tanks at Idaho National Engineering Laboratories (INEL) and Oak Ridge National Laboratory (ORNL). These MiniLabs will be the first ever multichannel hazardous waste characterization end effectors deployed in underground high level waste storage tanks. They consist of a suite of chemical, radiological, and physical properties sensors integrated into a compact package mounted on the end of a robotic arm and/or vehicle. Most of the sensors are commercially available thus reducing the overall cost of design and maintenance. Sensor configurations can be customized depending on site/customer needs. This paper will address issues regarding the cost of field sampling verses MiniLab in-situ measurements and a brief background of the Light Duty utility Arm (LDUA) program. Topics receiving in depth attention will include package size parameters/constraints, design specifications, and investigations of currently available sensor technology. Sensors include radiological, gas, chemical, electrolytic, visual, temperature, and ranging. The effects of radiation on the life of the systems/sensors will also be discussed. Signal processing, control, display, and data acquisition methods will be described. The paper will conclude with an examination of possible applications for MiniLabs

The Sandia MEMS passive shock sensor : FY07 maturation activities.

Energy Technology Data Exchange (ETDEWEB)

Houston, Jack E.; Blecke, Jill; Mitchell, John Anthony; Wittwer, Jonathan W.; Crowson, Douglas A.; Clemens, Rebecca C.; Walraven, Jeremy Allen; Epp, David S.; Baker, Michael Sean

2008-08-01

This report describes activities conducted in FY07 to mature the MEMS passive shock sensor. The first chapter of the report provides motivation and background on activities that are described in detail in later chapters. The second chapter discusses concepts that are important for integrating the MEMS passive shock sensor into a system. Following these two introductory chapters, the report details modeling and design efforts, packaging, failure analysis and testing and validation. At the end of FY07, the MEMS passive shock sensor was at TRL 4.

Phononic crystals with one-dimensional defect as sensor materials

Science.gov (United States)

Aly, Arafa H.; Mehaney, Ahmed

2017-09-01

Recently, sensor technology has attracted great attention in many fields due to its importance in many engineering applications. In the present work, we introduce a study using the innovative properties of phononic crystals in enhancing a new type of sensors based on the intensity of transmitted frequencies inside the phononic band gaps. Based on the transfer matrix method and Bloch theory, the expressions of the reflection coefficient and dispersion relation are presented. Firstly, the influences of filling fraction ratio and the angle of incidence on the band gap width are discussed. Secondly, the localization of waves inside band gaps is discussed by enhancing the properties of the defected phononic crystal. Compared to the periodic structure, localization modes involved within the band structure of phononic crystals with one and two defect layers are presented and compared. Trapped localized modes can be detected easily and provide more information about defected structures. Such method could increase the knowledge of manufacturing defects by measuring the intensity of propagated waves in the resonant cavities and waveguides. Moreover, several factors enhance the role of the defect layer on the transmission properties of defected phononic crystals are presented. The acoustic band gap can be used to detect or sense the type of liquids filling the defect layer. The liquids make specific resonant modes through the phononic band gaps that related to the properties of each liquid. The frequency where the maximum resonant modes occur is correlated to material properties and allows to determine several parameters such as the type of an unknown material.

Options for reducing food waste by quality-controlled logistics using intelligent packaging along the supply chain.

Science.gov (United States)

Heising, Jenneke K; Claassen, G D H; Dekker, Matthijs

2017-10-01

Optimising supply chain management can help to reduce food waste. This paper describes how intelligent packaging can be used to reduce food waste when used in supply chain management based on quality-controlled logistics (QCL). Intelligent packaging senses compounds in the package that correlate with the critical quality attribute of a food product. The information on the quality of each individual packaged food item that is provided by the intelligent packaging can be used for QCL. In a conceptual approach it is explained that monitoring food quality by intelligent packaging sensors makes it possible to obtain information about the variation in the quality of foods and to use a dynamic expiration date (IP-DED) on a food package. The conceptual approach is supported by quantitative data from simulations on the effect of using the information of intelligent packaging in supply chain management with the goal to reduce food waste. This simulation shows that by using the information on the quality of products that is provided by intelligent packaging, QCL can substantially reduce food waste. When QCL is combined with dynamic pricing based on the predicted expiry dates, a further waste reduction is envisaged.

Material Efficiency in Dutch Packaging Policy

NARCIS (Netherlands)

Worrell, E.; van Sluisveld, M.A.E.

2013-01-01

Packaging materials are one of the largest contributors to municipal solid waste generation. In this paper, we evaluate the material impacts of packaging policy in The Netherlands, focusing on the role of material efficiency (or waste prevention). Since 1991, five different policies have been

Open architecture of smart sensor suites

Science.gov (United States)

Müller, Wilmuth; Kuwertz, Achim; Grönwall, Christina; Petersson, Henrik; Dekker, Rob; Reinert, Frank; Ditzel, Maarten

2017-10-01

Experiences from recent conflicts show the strong need for smart sensor suites comprising different multi-spectral imaging sensors as core elements as well as additional non-imaging sensors. Smart sensor suites should be part of a smart sensor network - a network of sensors, databases, evaluation stations and user terminals. Its goal is to optimize the use of various information sources for military operations such as situation assessment, intelligence, surveillance, reconnaissance, target recognition and tracking. Such a smart sensor network will enable commanders to achieve higher levels of situational awareness. Within the study at hand, an open system architecture was developed in order to increase the efficiency of sensor suites. The open system architecture for smart sensor suites, based on a system-of-systems approach, enables combining different sensors in multiple physical configurations, such as distributed sensors, co-located sensors combined in a single package, tower-mounted sensors, sensors integrated in a mobile platform, and trigger sensors. The architecture was derived from a set of system requirements and relevant scenarios. Its mode of operation is adaptable to a series of scenarios with respect to relevant objects of interest, activities to be observed, available transmission bandwidth, etc. The presented open architecture is designed in accordance with the NATO Architecture Framework (NAF). The architecture allows smart sensor suites to be part of a surveillance network, linked e.g. to a sensor planning system and a C4ISR center, and to be used in combination with future RPAS (Remotely Piloted Aircraft Systems) for supporting a more flexible dynamic configuration of RPAS payloads.

Detecting Specific Health-Related Events Using an Integrated Sensor System for Vital Sign Monitoring

Directory of Open Access Journals (Sweden)

Mourad Adnane

2009-09-01

Full Text Available In this paper, a new method for the detection of apnea/hypopnea periods in physiological data is presented. The method is based on the intelligent combination of an integrated sensor system for long-time cardiorespiratory signal monitoring and dedicated signal-processing packages. Integrated sensors are a PVDF film and conductive fabric sheets. The signal processing package includes dedicated respiratory cycle (RC and QRS complex detection algorithms and a new method using the respiratory cycle variability (RCV for detecting apnea/hypopnea periods in physiological data. Results show that our method is suitable for online analysis of long time series data.

Surface Crack Detection in Prestressed Concrete Cylinder Pipes Using BOTDA Strain Sensors

Directory of Open Access Journals (Sweden)

Zhigang Xu

2017-01-01

Full Text Available Structural deterioration after a period of service can induce the failure of prestressed concrete cylinder pipes (PCCPs, with microcracks in the coating leading to the corrosion of the prestressed wires. In this paper, we propose the use of Brillouin optical time-domain analysis (BOTDA strain sensors for detecting the onset of microcracking in PCCP coating: the BOTDA strain sensors are mounted on the surface of the PCCP, and distributed strain measurements are employed to assess the cracks in the mortar coating and the structural state of the pipe. To validate the feasibility of the proposed approach, experimental investigations were conducted on a prototype PCCP segment, wherein the inner pressure was gradually increased to 1.6 MPa. Two types of BOTDA strain sensors—the steel wire packaged fiber optic sensor and the polyelastic packaged fiber optic sensor—were employed in the experiments. The experimental distributed measurements agreed well with the finite element computations, evidencing that the investigated strain sensors are sensitive to localized deterioration behaviors such as PCCP microcracking.

Development of a wireless radioactive material sensor network

Energy Technology Data Exchange (ETDEWEB)

Katsis, Dimosthenis, E-mail: katsisdc@ieee.org [US Army Research Laboratory, Athena Energy Corporation, Adelphi, Bowie, MD (United States); Burns, David; Henriquez, Stanley; Howell, Steve; Litz, Marc [US Army Research Laboratory, Athena Energy Corporation, Adelphi, Bowie, MD (United States)

2011-10-01

Our team at the United States Army Research Laboratory (ARL) has designed and developed a low-power, compact, wireless-networked gamma sensor (WGS) array. The WGS system provides high sensitivity gamma photon detection and remote warning for a broad range of radioactive materials. This sensor identifies the presence of a 1 {mu}Ci Cs137 source at a distance of 1.5 m. The networked array of sensors presently operates as a facility and laboratory sensor for the movement of radioactive check sources. Our goal has been to apply this architecture for field security applications by incorporating low-power design with compact packaging. The performance of this radiation measurement network is demonstrated for both detection and location of radioactive material.

One-Port Electronic Detection Strategies for Improving Sensitivity in Piezoelectric Resonant Sensor Measurements

Directory of Open Access Journals (Sweden)

Zhongxu Hu

2016-10-01

Full Text Available This paper describes a one-port mechanical resonance detection scheme utilized on a piezoelectric thin film driven silicon circular diaphragm resonator and discusses the limitations to such an approach in degenerate mode mass detection sensors. The sensor utilizes degenerated vibration modes of a radial symmetrical microstructure thereby providing both a sense and reference mode allowing for minimization of environmental effects on performance. The circular diaphragm resonator was fabricated with thickness of 4.5 µm and diameter of 140 µm. A PZT thin film of 0.75 µm was patterned on the top surface for the purposes of excitation and vibration sensing. The device showed a resonant frequency of 5.8 MHz for the (1, 1 mode. An electronic interface circuit was designed to cancel out the large static and parasitic capacitance allowing for electrical detection of the mechanical vibration thereby enabling the frequency split between the sense and reference mode to be measured accurately. The extracted motional current, proportional to the vibration velocity, was fed back to the drive to effectively increase the Q factor, and therefore device sensitivity, by more than a factor of 8. A software phase-locked loop was implemented to automatically track the resonant frequencies to allow for faster and accurate resonance detection. Results showed that by utilizing the absolute mode frequencies as an indication of sensor temperature, the variation in sensor temperature due to the heating from the drive electronics was accounted for and led to an ultimate measurement sensitivity of 2.3 Hz.

One-Port Electronic Detection Strategies for Improving Sensitivity in Piezoelectric Resonant Sensor Measurements

Science.gov (United States)

Hu, Zhongxu; Hedley, John; Keegan, Neil; Spoors, Julia; Gallacher, Barry; McNeil, Calum

2016-01-01

This paper describes a one-port mechanical resonance detection scheme utilized on a piezoelectric thin film driven silicon circular diaphragm resonator and discusses the limitations to such an approach in degenerate mode mass detection sensors. The sensor utilizes degenerated vibration modes of a radial symmetrical microstructure thereby providing both a sense and reference mode allowing for minimization of environmental effects on performance. The circular diaphragm resonator was fabricated with thickness of 4.5 µm and diameter of 140 µm. A PZT thin film of 0.75 µm was patterned on the top surface for the purposes of excitation and vibration sensing. The device showed a resonant frequency of 5.8 MHz for the (1, 1) mode. An electronic interface circuit was designed to cancel out the large static and parasitic capacitance allowing for electrical detection of the mechanical vibration thereby enabling the frequency split between the sense and reference mode to be measured accurately. The extracted motional current, proportional to the vibration velocity, was fed back to the drive to effectively increase the Q factor, and therefore device sensitivity, by more than a factor of 8. A software phase-locked loop was implemented to automatically track the resonant frequencies to allow for faster and accurate resonance detection. Results showed that by utilizing the absolute mode frequencies as an indication of sensor temperature, the variation in sensor temperature due to the heating from the drive electronics was accounted for and led to an ultimate measurement sensitivity of 2.3 Hz. PMID:27792154

Antimicrobial packaging for fresh-cut fruits

Science.gov (United States)

Fresh-cut fruits are minimally processed produce which are consumed directly at their fresh stage without any further kill step. Microbiological quality and safety are major challenges to fresh-cut fruits. Antimicrobial packaging is one of the innovative food packaging systems that is able to kill o...

Type B Drum packages

International Nuclear Information System (INIS)

Edwards, W.S.

1995-11-01

The Type B Drum package is a container in which a single drum containing Type B quantities of radioactive material will be packaged for shipment. The Type B Drum containers are being developed to fill a void in the packaging and transportation capabilities of the US Department of Energy (DOE), as no double containment packaging for single drums of Type B radioactive material is currently available. Several multiple-drum containers and shielded casks presently exist. However, the size and weight of these containers present multiple operational challenges for single-drum shipments. The Type B Drum containers will offer one unshielded version and, if needed, two shielded versions, and will provide for the option of either single or double containment. The primary users of the Type B Drum container will be any organization with a need to ship single drums of Type B radioactive material. Those users include laboratories, waste retrieval facilities, emergency response teams, and small facilities

Integrated NEMS and optoelectronics for sensor applications.

Energy Technology Data Exchange (ETDEWEB)

Czaplewski, David A.; Serkland, Darwin Keith; Olsson, Roy H., III; Bogart, Gregory R. (Symphony Acoustics, Rio Rancho, NM); Krishnamoorthy, Uma; Warren, Mial E.; Carr, Dustin Wade (Symphony Acoustics, Rio Rancho, NM); Okandan, Murat; Peterson, Kenneth Allen

2008-01-01

This work utilized advanced engineering in several fields to find solutions to the challenges presented by the integration of MEMS/NEMS with optoelectronics to realize a compact sensor system, comprised of a microfabricated sensor, VCSEL, and photodiode. By utilizing microfabrication techniques in the realization of the MEMS/NEMS component, the VCSEL and the photodiode, the system would be small in size and require less power than a macro-sized component. The work focused on two technologies, accelerometers and microphones, leveraged from other LDRD programs. The first technology was the nano-g accelerometer using a nanophotonic motion detection system (67023). This accelerometer had measured sensitivity of approximately 10 nano-g. The Integrated NEMS and optoelectronics LDRD supported the nano-g accelerometer LDRD by providing advanced designs for the accelerometers, packaging, and a detection scheme to encapsulate the accelerometer, furthering the testing capabilities beyond bench-top tests. A fully packaged and tested die was never realized, but significant packaging issues were addressed and many resolved. The second technology supported by this work was the ultrasensitive directional microphone arrays for military operations in urban terrain and future combat systems (93518). This application utilized a diffraction-based sensing technique with different optical component placement and a different detection scheme from the nano-g accelerometer. The Integrated NEMS LDRD supported the microphone array LDRD by providing custom designs, VCSELs, and measurement techniques to accelerometers that were fabricated from the same operational principles as the microphones, but contain proof masses for acceleration transduction. These devices were packaged at the end of the work.

Antimicrobial nanomaterials for food packaging applications

OpenAIRE

Radusin Tanja I.; Ristić Ivan S.; Pilić Branka M.; Novaković Aleksandra R.

2016-01-01

Food packaging industry presents one of the fastest growing industries nowadays. New trends in this industry, which include reducing food as well as packaging waste, improved preservation of food and prolonged shelf-life together with substitution of petrochemical sources with renewable ones are leading to development of this industrial area in diverse directions. This multidisciplinary challenge is set up both in front of food and material scientists. Nanotechnology is recently answering to ...

Continuous liquid level monitoring sensor system using fiber Bragg grating

Science.gov (United States)

Sengupta, Dipankar; Kishore, Putha

2014-01-01

The design and packaging of simple, small, and low cost sensor heads, used for continuous liquid level measurement using uniformly thinned (etched) optical fiber Bragg grating (FBG) are proposed. The sensor system consists of only an FBG and a simple detection system. The sensitivity of sensor is found to be 23 pm/cm of water column pressure. A linear optical fiber edge filter is designed and developed for the conversion of Bragg wavelength shift to its equivalent intensity. The result shows that relative power measured by a photo detector is linearly proportional to the liquid level. The obtained sensitivity of the sensor is nearly -15 mV/cm.

Optical sensor array platform based on polymer electronic devices

Science.gov (United States)

Koetse, Marc M.; Rensing, Peter A.; Sharpe, Ruben B. A.; van Heck, Gert T.; Allard, Bart A. M.; Meulendijks, Nicole N. M. M.; Kruijt, Peter G. M.; Tijdink, Marcel W. W. J.; De Zwart, René M.; Houben, René J.; Enting, Erik; van Veen, Sjaak J. J. F.; Schoo, Herman F. M.

2007-10-01

Monitoring of personal wellbeing and optimizing human performance are areas where sensors have only begun to be used. One of the reasons for this is the specific demands that these application areas put on the underlying technology and system properties. In many cases these sensors will be integrated in clothing, be worn on the skin, or may even be placed inside the body. This implies that flexibility and wearability of the systems is essential for their success. Devices based on polymer semiconductors allow for these demands since they can be fabricated with thin film technology. The use of thin film device technology allows for the fabrication of very thin sensors (e.g. integrated in food product packaging), flexible or bendable sensors in wearables, large area/distributed sensors, and intrinsically low-cost applications in disposable products. With thin film device technology a high level of integration can be achieved with parts that analyze signals, process and store data, and interact over a network. Integration of all these functions will inherently lead to better cost/performance ratios, especially if printing and other standard polymer technology such as high precision moulding is applied for the fabrication. In this paper we present an optical transmission sensor array based on polymer semiconductor devices made by thin film technology. The organic devices, light emitting diodes, photodiodes and selective medium chip, are integrated with classic electronic components. Together they form a versatile sensor platform that allows for the quantitative measurement of 100 channels and communicates wireless with a computer. The emphasis is given to the sensor principle, the design, fabrication technology and integration of the thin film devices.

Destructive testing of transport packaging. Quality assurance applied to transport packaging in the USA

International Nuclear Information System (INIS)

Barker, R.F.

1976-01-01

This paper discusses several aspects of quality assurance as applied to packaging, including such requirements for an adequate quality assurance program as assignment of responsibilities, inspections, and audits. In certain cases, we have determined the margin of safety inherent in specific package designs. Testing of packaging to destruction, by subjecting it to conditions far beyond the present accident criteria, was carried out to establish the levels of impact, puncture, crush, and fire at which present designs would fail. A second area in which the Nuclear Regulatory Commission has applied quality assurance is qualification testing. The standards for testing prototypes require essentially no loss of contents under the specified accident test conditions. Qualifying a design with an acceptable degree of reliability by testing it at the specified stress levels with no measurable effect requires large numbers of samples to be tested. Testing the prototype under conditions well above the criteria is shown to offer one of the most effective means of demonstrating the adequacy of a design. Scenario tests, i.e., staged accidents or full-scale tests in which vehicles with samples of packages on board are crashed under specified conditions, in most cases present singular points on a curve. One-point tests in most cases will disprove a package design if it fails but may not confirm that a design will not fail. At the same time, much information and some public assurances can be obtained from such tests. (author)

Packaging Solutions : Delivering customer value through Logistical Packaging: A Case Study at Stora Enso Packaging

OpenAIRE

Shan, Kun; Julius, Joezer

2015-01-01

AbstractBackground;Despite of the significant role of packaging within logistics and supply chain management, packaging is infrequently studied as focal point in supply chain. Most of the previous logistics research studies tend to explain the integration between packaging and logistics through logistical packaging. In very rare cases, the studies mentioned about customer value. Therefore the major disadvantage of these studies is that, they didn’t consider logistical packaging and customer v...

A High Performance Banknote Recognition System Based on a One-Dimensional Visible Light Line Sensor.

Science.gov (United States)

Park, Young Ho; Kwon, Seung Yong; Pham, Tuyen Danh; Park, Kang Ryoung; Jeong, Dae Sik; Yoon, Sungsoo

2015-06-15

An algorithm for recognizing banknotes is required in many fields, such as banknote-counting machines and automatic teller machines (ATM). Due to the size and cost limitations of banknote-counting machines and ATMs, the banknote image is usually captured by a one-dimensional (line) sensor instead of a conventional two-dimensional (area) sensor. Because the banknote image is captured by the line sensor while it is moved at fast speed through the rollers inside the banknote-counting machine or ATM, misalignment, geometric distortion, and non-uniform illumination of the captured images frequently occur, which degrades the banknote recognition accuracy. To overcome these problems, we propose a new method for recognizing banknotes. The experimental results using two-fold cross-validation for 61,240 United States dollar (USD) images show that the pre-classification error rate is 0%, and the average error rate for the final recognition of the USD banknotes is 0.114%.

A High Performance Banknote Recognition System Based on a One-Dimensional Visible Light Line Sensor

Directory of Open Access Journals (Sweden)

Young Ho Park

2015-06-01

Full Text Available An algorithm for recognizing banknotes is required in many fields, such as banknote-counting machines and automatic teller machines (ATM. Due to the size and cost limitations of banknote-counting machines and ATMs, the banknote image is usually captured by a one-dimensional (line sensor instead of a conventional two-dimensional (area sensor. Because the banknote image is captured by the line sensor while it is moved at fast speed through the rollers inside the banknote-counting machine or ATM, misalignment, geometric distortion, and non-uniform illumination of the captured images frequently occur, which degrades the banknote recognition accuracy. To overcome these problems, we propose a new method for recognizing banknotes. The experimental results using two-fold cross-validation for 61,240 United States dollar (USD images show that the pre-classification error rate is 0%, and the average error rate for the final recognition of the USD banknotes is 0.114%.

Hybrid Wafer-Level Packaging for RF-MEMS and Optoelectronic Applications

NARCIS (Netherlands)

Tian, J.

2013-01-01

The current trend in electronic packaging research is to integrate more functions into one package, reduce electrical path parasitic, and increase the heat conduction in order to make the final packaged system smaller, more reliable, more functional and more complete, while keeping the packaging

Applications of nanotechnology in food packaging and food safety: barrier materials, antimicrobials and sensors.

Science.gov (United States)

Duncan, Timothy V

2011-11-01

In this article, several applications of nanomaterials in food packaging and food safety are reviewed, including: polymer/clay nanocomposites as high barrier packaging materials, silver nanoparticles as potent antimicrobial agents, and nanosensors and nanomaterial-based assays for the detection of food-relevant analytes (gasses, small organic molecules and food-borne pathogens). In addition to covering the technical aspects of these topics, the current commercial status and understanding of health implications of these technologies are also discussed. These applications were chosen because they do not involve direct addition of nanoparticles to consumed foods, and thus are more likely to be marketed to the public in the short term. Published by Elsevier Inc.

Emergency response packaging: A conceptual outline

International Nuclear Information System (INIS)

Luna, R.E.; McClure, J.D.; Bennett, P.C.; Wheeler, T.A.

1991-01-01

The main thrust of this paper has been to put forth the idea of developing a package for the recovery and retrieval of released radioactive material contents from Radioactive Materials (RAM) packaging involved in transport accidents. Prior to the development of such a package, some additional studies might be performed which would confirm the general type of candidate materials which might have to be recovered. This would require a detailed inventory of US packages that have released their contents due to transport accidents. The main issue is one of preparedness which would allow the US Department of Energy to respond to accidents for DOE shipments and to respond nationally for shipments outside the normal jurisdiction of US DOE shipments

Optical fiber taste sensors using potential sensitive dye coatings. Makuden'i kanjusei shikisomaku wo mochiita hikari fiber mikaku sensor

Energy Technology Data Exchange (ETDEWEB)

Yamakawa, S.; Yamaguchi, A. (Toyama National College of Maritime Technology, Toyama (Japan))

1992-12-20

The present paper proposes a new taste recognition system using optical response patterns from multi-channel optical fiber sensors having potential sensitive dye coatings. It was found that the sensors give large changes in optical absorption spectra of the dyes when they are immersed in various taste solutions. Consequently, it was shown that the sensors can be used as a taste sensor. Six dyes, which give large changes in dye absorption, were selected from twenty dyes and used for six-channel optical fiber taste sensors array. The absorption spectra change data were processed by multiple discriminant analysis and neural networks using back-propagation algorithm. From the analytical results, it was demonstrated that salty (NaCl), bitter (quinidine), sweet (sucrose), sour (HCl), and umami (sodium glutamate) substances can be recognized from each other by using the optical taste sensor system. 11 refs., 8 figs., 2 tabs.

Packaging fluency

DEFF Research Database (Denmark)

Mocanu, Ana; Chrysochou, Polymeros; Bogomolova, Svetlana

2011-01-01

Research on packaging stresses the need for packaging design to read easily, presuming fast and accurate processing of product-related information. In this paper we define this property of packaging as “packaging fluency”. Based on the existing marketing and cognitive psychology literature on pac...

Effects of Cyclic Thermal Load on the Signal Characteristics of FBG Sensors Packaged with Epoxy Adhesives

Energy Technology Data Exchange (ETDEWEB)

Kim, Heonyoung; Kang, Donghoon [Korea Railroad Research Institute, Uiwang (Korea, Republic of)

2017-04-15

Fiber optics sensors that have been mainly applied to aerospace areas are now finding applicability in other areas, such as transportation, including railways. Among the sensors, the fiber Bragg grating (FBG) sensors have led to a steep increase due to their properties of absolute measurement and multiplexing capability. Generally, the FBG sensors adhere to structures and sensing modules using adhesives such as an epoxy. However, the measurement errors that occurred when the FBG sensors were used in a long-term application, where they were exposed to environmental thermal load, required calibration. For this reason, the thermal curing of adhesives needs to be investigated to enhance the reliability of the FBG sensor system. This can be done at room temperature through cyclic thermal load tests using four types of specimens. From the test results, it is confirmed that residual compressive strain occurs to the FBG sensors due to an initial cyclic thermal load. In conclusion, signals of the FBG sensors need to be stabilized for applying them to a long-term SHM.

Temperature estimation of induction machines based on wireless sensor networks

Directory of Open Access Journals (Sweden)

Y. Huang

2018-04-01

Full Text Available In this paper, a fourth-order Kalman filter (KF algorithm is implemented in the wireless sensor node to estimate the temperatures of the stator winding, the rotor cage and the stator core in the induction machine. Three separate wireless sensor nodes are used as the data acquisition systems for different input signals. Six Hall sensors are used to acquire the three-phase stator currents and voltages of the induction machine. All of them are processed to root mean square (rms in ampere and volt. A rotary encoder is mounted for the rotor speed and Pt-1000 is used for the temperature of the coolant air. The processed signals in the physical unit are transmitted wirelessly to the host wireless sensor node, where the KF is implemented with fixed-point arithmetic in Contiki OS. Time-division multiple access (TDMA is used to make the wireless transmission more stable. Compared to the floating-point implementation, the fixed-point implementation has the same estimation accuracy at only about one-fifth of the computation time. The temperature estimation system can work under any work condition as long as there are currents through the machine. It can also be rebooted for estimation even when wireless transmission has collapsed or packages are missing.

On node replication attack in wireless sensor networks

International Nuclear Information System (INIS)

Qabulio, M.; Malkani, Y.A.

2015-01-01

WSNs (Wireless Sensor Networks) comprise a large number of small, inexpensive, low power and memory constrained sensing devices (called sensor nodes) that are densely deployed to measure a given physical phenomenon. Since WSNs are commonly deployed in a hostile and unattended environment, it is easy for an adversary to physically capture one or more legitimate sensor nodes, re-program and redeploy them in the network. As a result, the adversary becomes able to deploy several identical copies of physically captured nodes in the network in order to perform illegitimate activities. This type of attack is referred to as Node Replication Attack or Clone Node Attack. By launching node replication attack, an adversary can easily get control on the network which consequently is the biggest threat to confidentiality, integrity and availability of data and services. Thus, detection and prevention of node replication attack in WSNs has become an active area of research and to date more than two dozen schemes have been proposed, which address this issue. In this paper, we present a comprehensive review, classification and comparative analysis of twenty five of these schemes which help to detect and/or prevent node replication attack in WSNs. (author)

On Node Replication Attack in Wireless Sensor Networks

Directory of Open Access Journals (Sweden)

Mumtaz Qabulio

2016-04-01

Full Text Available WSNs (Wireless Sensor Networks comprise a large number of small, inexpensive, low power and memory constrained sensing devices (called sensor nodes that are densely deployed to measure a given physical phenomenon. Since WSNs are commonly deployed in a hostile and unattended environment, it is easy for an adversary to physically capture one or more legitimate sensor nodes, re-program and redeploy them in the network. As a result, the adversary becomes able to deploy several identical copies of physically captured nodes in the network in order to perform illegitimate activities. This type of attack is referred to as Node Replication Attack or Clone Node Attack. By launching node replication attack, an adversary can easily get control on the network which consequently is the biggest threat to confidentiality, integrity and availability of data and services. Thus, detection and prevention of node replication attack in WSNs has become an active area of research and to date more than two dozen schemes have been proposed, which address this issue. In this paper, we present a comprehensive review, classification and comparative analysis of twenty five of these schemes which help to detect and/or prevent node replication attack in WSNs

A fiber optic Doppler sensor and its application in debonding detection for composite structures.

Science.gov (United States)

Li, Fucai; Murayama, Hideaki; Kageyama, Kazuro; Meng, Guang; Ohsawa, Isamu; Shirai, Takehiro

2010-01-01

Debonding is one of the most important damage forms in fiber-reinforced composite structures. This work was devoted to the debonding damage detection of lap splice joints in carbon fiber reinforced plastic (CFRP) structures, which is based on guided ultrasonic wave signals captured by using fiber optic Doppler (FOD) sensor with spiral shape. Interferometers based on two types of laser sources, namely the He-Ne laser and the infrared semiconductor laser, are proposed and compared in this study for the purpose of measuring Doppler frequency shift of the FOD sensor. Locations of the FOD sensors are optimized based on mechanical characteristics of lap splice joint. The FOD sensors are subsequently used to detect the guided ultrasonic waves propagating in the CFRP structures. By taking advantage of signal processing approaches, features of the guided wave signals can be revealed. The results demonstrate that debonding in the lap splice joint results in arrival time delay of the first package in the guided wave signals, which can be the characteristic for debonding damage inspection and damage extent estimation.

Integration of f-MWCNT Sensor and Printed Circuits on Paper Substrate

OpenAIRE

Xie, Li; Feng, Yi; Mantysalo, Matti; Chen, Qiang; Zheng, Li-Rong

2013-01-01

The integration of sensors endows the packages with intelligence and interactivity. This paper is considered the most suitable substrate of smart packages because it is cost-effective, light, flexible, and recyclable. However, common concern exists regarding the reliability of paper-based system against bending and folding. In this paper, inkjet-printing of silver nanoparticles is used to form circuit pattern as well as interconnections for system integration on paper substrate. A humidity se...

Reference waste package environment report

International Nuclear Information System (INIS)

Glassley, W.E.

1986-01-01

One of three candidate repository sites for high-level radioactive waste packages is located at Yucca Mountain, Nevada, in rhyolitic tuff 700 to 1400 ft above the static water table. Calculations indicate that the package environment will experience a maximum temperature of ∼230 0 C at 9 years after emplacement. For the next 300 years the rock within 1 m of the waste packages will remain dehydrated. Preliminary results suggest that the waste package radiation field will have very little effect on the mechanical properties of the rock. Radiolysis products will have a negligible effect on the rock even after rehydration. Unfractured specimens of repository rock show no change in hydrologic characteristics during repeated dehydration-rehydration cycles. Fractured samples with initially high permeabilities show a striking permeability decrease during dehydration-rehydration cycling, which may be due to fracture healing via deposition of silica. Rock-water interaction studies demonstrate low and benign levels of anions and most cations. The development of sorptive secondary phases such as zeolites and clays suggests that anticipated rock-water interaction may produce beneficial changes in the package environment

An open-source wireless sensor stack: from Arduino to SDI-12 to Water One Flow

Science.gov (United States)

Hicks, S.; Damiano, S. G.; Smith, K. M.; Olexy, J.; Horsburgh, J. S.; Mayorga, E.; Aufdenkampe, A. K.

2013-12-01

Implementing a large-scale streaming environmental sensor network has previously been limited by the high cost of the datalogging and data communication infrastructure. The Christina River Basin Critical Zone Observatory (CRB-CZO) is overcoming the obstacles to large near-real-time data collection networks by using Arduino, an open source electronics platform, in combination with XBee ZigBee wireless radio modules. These extremely low-cost and easy-to-use open source electronics are at the heart of the new DIY movement and have provided solutions to countless projects by over half a million users worldwide. However, their use in environmental sensing is in its infancy. At present a primary limitation to widespread deployment of open-source electronics for environmental sensing is the lack of a simple, open-source software stack to manage streaming data from heterogeneous sensor networks. Here we present a functioning prototype software stack that receives sensor data over a self-meshing ZigBee wireless network from over a hundred sensors, stores the data locally and serves it on demand as a CUAHSI Water One Flow (WOF) web service. We highlight a few new, innovative components, including: (1) a versatile open data logger design based the Arduino electronics platform and ZigBee radios; (2) a software library implementing SDI-12 communication protocol between any Arduino platform and SDI12-enabled sensors without the need for additional hardware (https://github.com/StroudCenter/Arduino-SDI-12); and (3) 'midStream', a light-weight set of Python code that receives streaming sensor data, appends it with metadata on the fly by querying a relational database structured on an early version of the Observations Data Model version 2.0 (ODM2), and uses the WOFpy library to serve the data as WaterML via SOAP and REST web services.

Optimization of Emissions Sensor Networks Incorporating Tradeoffs Between Different Sensor Technologies

Science.gov (United States)

Nicholson, B.; Klise, K. A.; Laird, C. D.; Ravikumar, A. P.; Brandt, A. R.

2017-12-01

In order to comply with current and future methane emissions regulations, natural gas producers must develop emissions monitoring strategies for their facilities. In addition, regulators must develop air monitoring strategies over wide areas incorporating multiple facilities. However, in both of these cases, only a limited number of sensors can be deployed. With a wide variety of sensors to choose from in terms of cost, precision, accuracy, spatial coverage, location, orientation, and sampling frequency, it is difficult to design robust monitoring strategies for different scenarios while systematically considering the tradeoffs between different sensor technologies. In addition, the geography, weather, and other site specific conditions can have a large impact on the performance of a sensor network. In this work, we demonstrate methods for calculating optimal sensor networks. Our approach can incorporate tradeoffs between vastly different sensor technologies, optimize over typical wind conditions for a particular area, and consider different objectives such as time to detection or geographic coverage. We do this by pre-computing site specific scenarios and using them as input to a mixed-integer, stochastic programming problem that solves for a sensor network that maximizes the effectiveness of the detection program. Our methods and approach have been incorporated within an open source Python package called Chama with the goal of providing facility operators and regulators with tools for designing more effective and efficient monitoring systems. Sandia National Laboratories is a multi-mission laboratory managed and operated by National Technology and Engineering Solutions of Sandia, LLC., a wholly owned subsidiary of Honeywell International, Inc., for the U.S. Department of Energys National Nuclear Security Administration under contract DE-NA0003525.

Microelectronic packaging

CERN Document Server

Datta, M; Schultze, J Walter

2004-01-01

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impac

Miniaturized, low power FGMOSFET radiation sensor and wireless dosimeter system

KAUST Repository

Arsalan, Muhammad; Shamim, Atif; Tarr, Nicholas Garry; Roy, Langis

2013-01-01

A miniaturized floating gate (FG) MOSFET radiation sensor system is disclosed, The sensor preferably comprises a matched pair of sensor and reference FGMOSFETs wherein the sensor FGMOSFET has a larger area floating gate with an extension over a field oxide layer, for accumulation of charge and increased sensitivity. Elimination of a conventional control gate and injector gate reduces capacitance, and increases sensitivity, and allows for fabrication using standard low cost CMOS technology. A sensor system may be provided with integrated signal processing electronics, for monitoring a change in differential channel current I.sub.D, indicative of radiation dose, and an integrated negative bias generator for automatic pre-charging from a low voltage power source. Optionally, the system may be coupled to a wireless transmitter. A compact wireless sensor System on Package solution is presented, suitable for dosimetry for radiotherapy or other biomedical applications.

Miniaturized, low power FGMOSFET radiation sensor and wireless dosimeter system

KAUST Repository

Arsalan, Muhammad

2013-08-27

A miniaturized floating gate (FG) MOSFET radiation sensor system is disclosed, The sensor preferably comprises a matched pair of sensor and reference FGMOSFETs wherein the sensor FGMOSFET has a larger area floating gate with an extension over a field oxide layer, for accumulation of charge and increased sensitivity. Elimination of a conventional control gate and injector gate reduces capacitance, and increases sensitivity, and allows for fabrication using standard low cost CMOS technology. A sensor system may be provided with integrated signal processing electronics, for monitoring a change in differential channel current I.sub.D, indicative of radiation dose, and an integrated negative bias generator for automatic pre-charging from a low voltage power source. Optionally, the system may be coupled to a wireless transmitter. A compact wireless sensor System on Package solution is presented, suitable for dosimetry for radiotherapy or other biomedical applications.

Method for 3D noncontact measurements of cut trees package area

Science.gov (United States)

Knyaz, Vladimir A.; Vizilter, Yuri V.

2001-02-01

Progress in imaging sensors and computers create the background for numerous 3D imaging application for wide variety of manufacturing activity. Many demands for automated precise measurements are in wood branch of industry. One of them is the accurate volume definition for cut trees carried on the truck. The key point for volume estimation is determination of the front area of the cut tree package. To eliminate slow and inaccurate manual measurements being now in practice the experimental system for automated non-contact wood measurements is developed. The system includes two non-metric CCD video cameras, PC as central processing unit, frame grabbers and original software for image processing and 3D measurements. The proposed method of measurement is based on capturing the stereo pair of front of trees package and performing the image orthotranformation into the front plane. This technique allows to process transformed image for circle shapes recognition and calculating their area. The metric characteristics of the system are provided by special camera calibration procedure. The paper presents the developed method of 3D measurements, describes the hardware used for image acquisition and the software realized the developed algorithms, gives the productivity and precision characteristics of the system.

Sensors and packages based on LTCC and thick-film technology for ...

Indian Academy of Sciences (India)

After deposition, drying removes the solvent in the vehicle, allowing the part to be ... In addition to the standard LTCC dielectric materials, compatible tapes with high electric ... For jet engine eddy current radial position sensors, the severe.

The Packaging Handbook -- A guide to package design

International Nuclear Information System (INIS)

Shappert, L.B.

1995-01-01

The Packaging Handbook is a compilation of 14 technical chapters and five appendices that address the life cycle of a packaging which is intended to transport radioactive material by any transport mode in normal commerce. Although many topics are discussed in depth, this document focuses on the design aspects of a packaging. The Handbook, which is being prepared under the direction of the US Department of Energy, is intended to provide a wealth of technical guidance that will give designers a better understanding of the regulatory approval process, preferences of regulators in specific aspects of packaging design, and the types of analyses that should be seriously considered when developing the packaging design. Even though the Handbook is concerned with all packagings, most of the emphasis is placed on large packagings that are capable of transporting large radioactive sources that are also fissile (e.g., spent fuel). These are the types of packagings that must address the widest range of technical topics in order to meet domestic and international regulations. Most of the chapters in the Handbook have been drafted and submitted to the Oak Ridge National Laboratory for editing; the majority of these have been edited. This report summarizes the contents

An Assessment of Pseudo-Operational Ground-Based Light Detection and Ranging Sensors to Determine the Boundary-Layer Structure in the Coastal Atmosphere

Directory of Open Access Journals (Sweden)

Conor Milroy

2012-01-01

Full Text Available Twenty-one cases of boundary-layer structure were retrieved by three co-located remote sensors, One LIDAR and two ceilometers at the coastal site of Mace Head, Ireland. Data were collected during the ICOS field campaign held at the GAW Atmospheric Station of Mace Head, Ireland, from 8th to 28th of June, 2009. The study is a two-step investigation of the BL structure based on (i the intercomparison of the backscatter profiles from the three laser sensors, namely the Leosphere ALS300 LIDAR, the Vaisala CL31 ceilometer and the Jenoptik CHM15K ceilometer; (ii and the comparison of the backscatter profiles with twenty-three radiosoundings performed during the period from the 8th to the 15th of June, 2009. The sensor-independent Temporal Height-Tracking algorithm was applied to the backscatter profiles as retrieved by each instrument to determine the decoupled structure of the BL over Mace Head. The LIDAR and ceilometers-retrieved BL heights were compared to the radiosoundings temperature profiles. The comparison between the remote and the in-situ data proved the existence of the inherent link between temperature and aerosol backscatter profiles and opened at future studies focusing on the further assessment of LIDAR-ceilometer comparison.

RF sensor for multiphase flow measurement through an oil pipeline

Science.gov (United States)

Wylie, S. R.; Shaw, A.; Al-Shamma'a, A. I.

2006-08-01

We have developed, in conjunction with Solartron ISA, an electromagnetic cavity resonator based sensor for multiphase flow measurement through an oil pipeline. This sensor is non-intrusive and transmits low power (10 mW) radio frequencies (RF) in the range of 100-350 MHz and detects the pipeline contents using resonant peaks captured instantaneously. The multiple resonances from each captured RF spectrum are analysed to determine the phase fractions in the pipeline. An industrial version of the sensor for a 102 mm (4 inch) diameter pipe has been constructed and results from this sensor are compared to those given by simulations performed using the electromagnetic high frequency structure simulator software package HFSS. This paper was presented at the 13th International Conference on Sensors and held in Chatham, Kent, on 6-7 September 2005.

Strategic Leader Competencies for the Twenty-First Century

National Research Council Canada - National Science Library

Becker, Bradley A

2007-01-01

...: interpersonal skills, conceptual skills, and technical skills. From these three primary strategic leadership skills, there is a list of twenty-one competencies that a strategic leader should posses...

Plain packaging: a logical progression for tobacco control in one of the world's ‘darkest markets’

Science.gov (United States)

Scollo, Michelle; Bayly, Megan; Wakefield, Melanie

2015-01-01

The Australian approach to tobacco control has been a comprehensive one, encompassing mass media campaigns, consumer information, taxation policy, access for smokers to smoking cessation advice and pharmaceutical treatments, protection from exposure to tobacco smoke and regulation of promotion. World-first legislation to standardise the packaging of tobacco was a logical next step to further reduce misleadingly reassuring promotion of a product known for the past 50 years to kill a high proportion of its long-term users. Similarly, refreshed, larger pack warnings which started appearing on packs at the end of 2012 were a logical progression of efforts to ensure that consumers are better informed about the health risks associated with smoking. Regardless of the immediate effects of legislation, further progress will continue to require a comprehensive approach to maintain momentum and ensure that government efforts on one front are not undermined by more vigorous efforts and greater investment by tobacco companies elsewhere. PMID:28407604

Investigating the use of multi-point coupling for single-sensor bearing estimation in one direction

Science.gov (United States)

Woolard, Americo G.; Phoenix, Austin A.; Tarazaga, Pablo A.

2018-04-01

Bearing estimation of radially propagating symmetric waves in solid structures typically requires a minimum of two sensors. As a test specimen, this research investigates the use of multi-point coupling to provide directional inference using a single-sensor. By this provision, the number of sensors required for localization can be reduced. A finite-element model of a beam is constructed with a symmetrically placed bipod that has asymmetric joint-stiffness properties. Impulse loading is applied at different points along the beam, and measurements are taken from the apex of the bipod. A technique is developed to determine the direction-of-arrival of the propagating wave. The accuracy when using the bipod with the developed technique is compared against results gathered without the bipod and measuring from an asymmetric location along the beam. The results show 92% accuracy when the bipod is used, compared to 75% when measuring without the bipod from an asymmetric location. A geometry investigation finds the best accuracy results when one leg of the bipod has a low stiffness and a large diameter relative to the other leg.

Packaging and transportation of radioactively contaminated lead

International Nuclear Information System (INIS)

Gleason, Eugene; Holden, Gerard

2007-01-01

Under the management of the Nuclear Decommissioning Authority (NDA) the government of the United Kingdom has launched an ambitious program to remediate the nation's nuclear waste legacy. Over a twenty-five year period NDA plans to decommission several first generation nuclear power plants and other radioactive facilities. The use innovative, safe 'fit for purpose' technologies will be a major part of this complex program. This paper will present a case study of a recently completed project undertaken in support of the nuclear decommissioning activities at the Sellafield site in the United Kingdom. The focus is on an innovative application of new packaging technology developed for the safe transportation of radioactively contaminated lead objects. Several companies collaborated on the project and contributed to its safe and successful conclusion. These companies include British Nuclear Group, Gravatom Engineering, W. F. Bowker Transport, Atlantic Container Lines, MHF Logistical Solutions and Energy Solutions. New containers and a new innovative inter-modal packaging system to transport the radioactive lead were developed and demonstrated during the project. The project also demonstrated the potential contribution of international nuclear recycling activities as a safe, economic and feasible technical option for nuclear decommissioning in the United Kingdom. (authors)

Returnable packaging for non-specific building materials

NARCIS (Netherlands)

Gassel, van F.J.M.

1998-01-01

A certain amount of construction waste comes from disposable packaging and this waste is ecologically damaging, one solution would be to reduce the disposable by using returnable packaging for non-specific construction products. To find out if this solution is feasible a study has been carried out

A field-deployable, aircraft-mounted sensor for the environmental survey of radionuclides

International Nuclear Information System (INIS)

Lepel, E.A.; Geelhood, B.D.; Hensley, W.K.; Quam, W.M.

1998-01-01

The Environmental Radionuclide Sensor System (ERSS) 3 is an extremely sensitive sensor, which has been cooperatively developed by Pacific Northwest National Laboratory (PNNL) and Special Technologies Laboratory (STL) for environmental surveys of radionuclides. The ERSS sensors fit in an airborne pod and include twenty High-Purity Germanium (HPGe) detectors for the high-resolution measurement of gamma-ray emitting radionuclides, twenty-four 3 He detectors for possible neutron measurements, and two video cameras for visual correlation. These aerial HPGe sensors provide much better gamma-ray energy resolution than can be obtained with NaI(Tl) detectors. The associated electronics fit into three racks. The system can be powered by the 28 V DC electrical supply of typical aircraft or 120 V AC. The data acquisition hardware is controlled by customized software and a real-time display is provided. Each gamma-ray event is time stamped and stored for later analysis. This paper will present the physical design, discuss the software used to control the system, and provide some examples of its use. (author)

Modeling, design, packing and experimental analysis of liquid-phase shear-horizontal surface acoustic wave sensors

Science.gov (United States)

Pollard, Thomas B

Recent advances in microbiology, computational capabilities, and microelectromechanical-system fabrication techniques permit modeling, design, and fabrication of low-cost, miniature, sensitive and selective liquid-phase sensors and lab-on-a-chip systems. Such devices are expected to replace expensive, time-consuming, and bulky laboratory-based testing equipment. Potential applications for devices include: fluid characterization for material science and industry; chemical analysis in medicine and pharmacology; study of biological processes; food analysis; chemical kinetics analysis; and environmental monitoring. When combined with liquid-phase packaging, sensors based on surface-acoustic-wave (SAW) technology are considered strong candidates. For this reason such devices are focused on in this work; emphasis placed on device modeling and packaging for liquid-phase operation. Regarding modeling, topics considered include mode excitation efficiency of transducers; mode sensitivity based on guiding structure materials/geometries; and use of new piezoelectric materials. On packaging, topics considered include package interfacing with SAW devices, and minimization of packaging effects on device performance. In this work novel numerical models are theoretically developed and implemented to study propagation and transduction characteristics of sensor designs using wave/constitutive equations, Green's functions, and boundary/finite element methods. Using developed simulation tools that consider finite-thickness of all device electrodes, transduction efficiency for SAW transducers with neighboring uniform or periodic guiding electrodes is reported for the first time. Results indicate finite electrode thickness strongly affects efficiency. Using dense electrodes, efficiency is shown to approach 92% and 100% for uniform and periodic electrode guiding, respectively; yielding improved sensor detection limits. A numerical sensitivity analysis is presented targeting viscosity

Active photonic sensor communication cable for field application of optical data and power transmission

Science.gov (United States)

Suthau, Eike; Rieske, Ralf; Zerna, Thomas

2014-10-01

Omitting electrically conducting wires for sensor communication and power supply promises protection for sensor systems and monitored structures against lightning or high voltages, prevention of explosion hazards, and reduction of susceptibility to tampering. The ability to photonically power remote systems opens up the full range of electrical sensors. Power-over-fiber is an attractive option in electromagnetically sensitive environments, particularly for longterm, maintenance-free applications. It can deliver uninterrupted power sufficient for elaborate sensors, data processing or even actuators alongside continuous high speed data communication for remote sensor application. This paper proposes an active photonic sensor communication system, which combines the advantages of optical data links in terms of immunity to electromagnetic interference (EMI), high bandwidth, hardiness against tampering or eavesdropping, and low cable weight with the robustness one has come to expect from industrial or military electrical connectors. An application specific integrated circuit (ASIC) is presented that implements a closed-loop regulation of the sensor power supply to guarantee continuous, reliable data communications while maintaining a highly efficient, adaptive sensor supply scheme. It is demonstrated that the resulting novel photonic sensor communication cable can handle sensors and actuators differing orders of magnitude with respect to power consumption. The miniaturization of the electro-optical converters and driving electronics is as important to the presented development as the energy efficiency of the detached, optically powered sensor node. For this reason, a novel photonic packaging technology based on wafer-level assembly of the laser power converters by means of passive alignment will be disclosed in this paper.

Surface engineering of one-dimensional tin oxide nanostructures for chemical sensors

International Nuclear Information System (INIS)

Ma, Yuanyuan; Qu, Yongquan; Zhou, Wei

2013-01-01

Nanostructured materials are promising candidates for chemical sensors due to their fascinating physicochemical properties. Among various candidates, tin oxide (SnO 2 ) has been widely explored in gas sensing elements due to its excellent chemical stability, low cost, ease of fabrication and remarkable reproducibility. We are presenting an overview on recent investigations on 1-dimensional (1D) SnO 2 nanostructures for chemical sensing. In particular, we focus on the performance of devices based on surface engineered SnO 2 nanostructures, and on aspects of morphology, size, and functionality. The synthesis and sensing mechanism of highly selective, sensitive and stable 1D nanostructures for use in chemical sensing are discussed first. This is followed by a discussion of the relationship between the surface properties of the SnO 2 layer and the sensor performance from a thermodynamic point of view. Then, the opportunities and recent progress of chemical sensors fabricated from 1D SnO 2 heterogeneous nanostructures are discussed. Finally, we summarize current challenges in terms of improving the performance of chemical (gas) sensors using such nanostructures and suggest potential applications. (author)

A Kinetic Model for Predicting the Relative Humidity in Modified Atmosphere Packaging and Its Application in Lentinula edodes Packages

Directory of Open Access Journals (Sweden)

Li-xin Lu

2013-01-01

Full Text Available Adjusting and controlling the relative humidity (RH inside package is crucial for ensuring the quality of modified atmosphere packaging (MAP of fresh produce. In this paper, an improved kinetic model for predicting the RH in MAP was developed. The model was based on heat exchange and gases mass transport phenomena across the package, gases heat convection inside the package, and mass and heat balances accounting for the respiration and transpiration behavior of fresh produce. Then the model was applied to predict the RH in MAP of fresh Lentinula edodes (one kind of Chinese mushroom. The model equations were solved numerically using Adams-Moulton method to predict the RH in model packages. In general, the model predictions agreed well with the experimental data, except that the model predictions were slightly high in the initial period. The effect of the initial gas composition on the RH in packages was notable. In MAP of lower oxygen and higher carbon dioxide concentrations, the ascending rate of the RH was reduced, and the RH inside packages was saturated slowly during storage. The influence of the initial gas composition on the temperature inside package was not much notable.

Resonant Magnetic Field Sensors Based On MEMS Technology

Directory of Open Access Journals (Sweden)

Elías Manjarrez

2009-09-01

Full Text Available Microelectromechanical systems (MEMS technology allows the integration of magnetic field sensors with electronic components, which presents important advantages such as small size, light weight, minimum power consumption, low cost, better sensitivity and high resolution. We present a discussion and review of resonant magnetic field sensors based on MEMS technology. In practice, these sensors exploit the Lorentz force in order to detect external magnetic fields through the displacement of resonant structures, which are measured with optical, capacitive, and piezoresistive sensing techniques. From these, the optical sensing presents immunity to electromagnetic interference (EMI and reduces the read-out electronic complexity. Moreover, piezoresistive sensing requires an easy fabrication process as well as a standard packaging. A description of the operation mechanisms, advantages and drawbacks of each sensor is considered. MEMS magnetic field sensors are a potential alternative for numerous applications, including the automotive industry, military, medical, telecommunications, oceanographic, spatial, and environment science. In addition, future markets will need the development of several sensors on a single chip for measuring different parameters such as the magnetic field, pressure, temperature and acceleration.

Resonant Magnetic Field Sensors Based On MEMS Technology

Science.gov (United States)

Herrera-May, Agustín L.; Aguilera-Cortés, Luz A.; García-Ramírez, Pedro J.; Manjarrez, Elías

2009-01-01

Microelectromechanical systems (MEMS) technology allows the integration of magnetic field sensors with electronic components, which presents important advantages such as small size, light weight, minimum power consumption, low cost, better sensitivity and high resolution. We present a discussion and review of resonant magnetic field sensors based on MEMS technology. In practice, these sensors exploit the Lorentz force in order to detect external magnetic fields through the displacement of resonant structures, which are measured with optical, capacitive, and piezoresistive sensing techniques. From these, the optical sensing presents immunity to electromagnetic interference (EMI) and reduces the read-out electronic complexity. Moreover, piezoresistive sensing requires an easy fabrication process as well as a standard packaging. A description of the operation mechanisms, advantages and drawbacks of each sensor is considered. MEMS magnetic field sensors are a potential alternative for numerous applications, including the automotive industry, military, medical, telecommunications, oceanographic, spatial, and environment science. In addition, future markets will need the development of several sensors on a single chip for measuring different parameters such as the magnetic field, pressure, temperature and acceleration. PMID:22408480

The analytical calibration model of temperature effects on a silicon piezoresistive pressure sensor

Directory of Open Access Journals (Sweden)

Meng Nie

2017-03-01

Full Text Available Presently, piezoresistive pressure sensors are highly demanded for using in various microelectronic devices. The electrical behavior of these pressure sensor is mainly dependent on the temperature gradient. In this paper, various factors,which includes effect of temperature, doping concentration on the pressure sensitive resistance, package stress, and temperature on the Young’s modulus etc., are responsible for the temperature drift of the pressure sensor are analyzed. Based on the above analysis, an analytical calibration model of the output voltage of the sensor is proposed and the experimental data is validated through a suitable model.

DERIVING 3D POINT CLOUDS FROM TERRESTRIAL PHOTOGRAPHS - COMPARISON OF DIFFERENT SENSORS AND SOFTWARE

Directory of Open Access Journals (Sweden)

R. Niederheiser

2016-06-01

Full Text Available Terrestrial photogrammetry nowadays offers a reasonably cheap, intuitive and effective approach to 3D-modelling. However, the important choice, which sensor and which software to use is not straight forward and needs consideration as the choice will have effects on the resulting 3D point cloud and its derivatives. We compare five different sensors as well as four different state-of-the-art software packages for a single application, the modelling of a vegetated rock face. The five sensors represent different resolutions, sensor sizes and price segments of the cameras. The software packages used are: (1 Agisoft PhotoScan Pro (1.16, (2 Pix4D (2.0.89, (3 a combination of Visual SFM (V0.5.22 and SURE (1.2.0.286, and (4 MicMac (1.0. We took photos of a vegetated rock face from identical positions with all sensors. Then we compared the results of the different software packages regarding the ease of the workflow, visual appeal, similarity and quality of the point cloud. While PhotoScan and Pix4D offer the user-friendliest workflows, they are also “black-box” programmes giving only little insight into their processing. Unsatisfying results may only be changed by modifying settings within a module. The combined workflow of Visual SFM, SURE and CloudCompare is just as simple but requires more user interaction. MicMac turned out to be the most challenging software as it is less user-friendly. However, MicMac offers the most possibilities to influence the processing workflow. The resulting point-clouds of PhotoScan and MicMac are the most appealing.

Electronic equipment packaging technology

CERN Document Server

Ginsberg, Gerald L

1992-01-01

The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron­ ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod­ ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter­ mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pr...

Flexible piezotronic strain sensor.

Science.gov (United States)

Zhou, Jun; Gu, Yudong; Fei, Peng; Mai, Wenjie; Gao, Yifan; Yang, Rusen; Bao, Gang; Wang, Zhong Lin

2008-09-01

Strain sensors based on individual ZnO piezoelectric fine-wires (PFWs; nanowires, microwires) have been fabricated by a simple, reliable, and cost-effective technique. The electromechanical sensor device consists of a single electrically connected PFW that is placed on the outer surface of a flexible polystyrene (PS) substrate and bonded at its two ends. The entire device is fully packaged by a polydimethylsiloxane (PDMS) thin layer. The PFW has Schottky contacts at its two ends but with distinctly different barrier heights. The I- V characteristic is highly sensitive to strain mainly due to the change in Schottky barrier height (SBH), which scales linear with strain. The change in SBH is suggested owing to the strain induced band structure change and piezoelectric effect. The experimental data can be well-described by the thermionic emission-diffusion model. A gauge factor of as high as 1250 has been demonstrated, which is 25% higher than the best gauge factor demonstrated for carbon nanotubes. The strain sensor developed here has applications in strain and stress measurements in cell biology, biomedical sciences, MEMS devices, structure monitoring, and more.

CompareTests-R package

Science.gov (United States)

CompareTests is an R package to estimate agreement and diagnostic accuracy statistics for two diagnostic tests when one is conducted on only a subsample of specimens. A standard test is observed on all specimens.

Extension of ship accident analysis to multiple-package shipments

International Nuclear Information System (INIS)

Mills, G.S.; Neuhauser, K.S.

1997-11-01

Severe ship accidents and the probability of radioactive material release from spent reactor fuel casks were investigated previously. Other forms of RAM, e.g., plutonium oxide powder, may be shipped in large numbers of packagings rather than in one to a few casks. These smaller, more numerous packagings are typically placed in ISO containers for ease of handling, and several ISO containers may be placed in one of several holds of a cargo ship. In such cases, the size of a radioactive release resulting from a severe collision with another ship is determined not by the likelihood of compromising a single, robust package but by the probability that a certain fraction of 10's or 100's of individual packagings is compromised. The previous analysis involved a statistical estimation of the frequency of accidents which would result in damage to a cask located in one of seven cargo holds in a collision with another ship. The results were obtained in the form of probabilities (frequencies) of accidents of increasing severity and of release fractions for each level of severity. This paper describes an extension of the same general method in which the multiple packages are assumed to be compacted by an intruding ship's bow until there is no free space in the hold. At such a point, the remaining energy of the colliding ship is assumed to be dissipated by progressively crushing the RAM packagings and the probability of a particular fraction of package failures is estimated by adaptation of the statistical method used previously. The parameters of a common, well characterized packaging, the 6M with 2R inner containment vessel, were employed as an illustrative example of this analysis method. However, the method is readily applicable to other packagings for which crush strengths have been measured or can be estimated with satisfactory confidence

Extension of ship accident analysis to multiple-package shipments

International Nuclear Information System (INIS)

Mills, G.S.; Neuhauser, K.S.

1998-01-01

Severe ship accidents and the probability of radioactive material release from spent reactor fuel casks were investigated previously (Spring, 1995). Other forms of RAM, e.g., plutonium oxide powder, may be shipped in large numbers of packagings rather than in one to a few casks. These smaller, more numerous packagings are typically placed in ISO containers for ease of handling, and several ISO containers may be placed in one of several holds of a cargo ship. In such cases, the size of a radioactive release resulting from a severe collision with another ship is determined not by the likelihood of compromising a single, robust package but by the probability that a certain fraction of 10's or 100's of individual packagings is compromised. The previous analysis (Spring, 1995) involved a statistical estimation of the frequency of accidents which would result in damage to a cask located in one of seven cargo holds in a collision with another ship. The results were obtained in the form of probabilities (frequencies) of accidents of increasing severity and of release fractions for each level of severity. This paper describes an extension of the same general method in which the multiple packages are assumed to be compacted by an intruding ship's bow until there is no free space in the hold. At such a point, the remaining energy of the colliding ship is assumed to be dissipated by progressively crushing the RAM packagings and the probability of a particular fraction of package failures is estimated by adaptation of the statistical method used previously. The parameters of a common, well-characterized packaging, the 6M with 2R inner containment vessel, were employed as an illustrative example of this analysis method. However, the method is readily applicable to other packagings for which crush strengths have been measured or can be estimated with satisfactory confidence. (authors)

Fielding of the on-axis diagnostic package at Z

International Nuclear Information System (INIS)

Hurst, M.J.; Nash, T.J.; Derzon, M.; Kellogg, J.W.; Torres, J.; McGurn, J.; Seaman, J.; Jobe, D.; Lazier, S.E.

1998-06-01

The authors have developed a comprehensive diagnostic package for observing z-pinch radiation along the pinch axis on the Z accelerator. The instrumentation, which was fielded on the axial package, are x-ray diagnostics requiring direct lines of sight to the target. The diagnostics require vacuum access to the center of the accelerator. The environment is a hostile one, where one must deal with an intense, energetic photon flux (>100 keV), EMP, debris (e.g. bullets or shrapnel), and mechanical shock in order for the diagnostics to survive. In addition, practical constraints require the package be refurbished and utilized on a once a day shot schedule. In spite of this harsh environment, the authors have successfully fielded the diagnostic package with a high survivability of the data and the instruments. In this paper, they describe the environment and issues related to the re-entrant diagnostic package's implementation and maintenance

A Fast Humidity Sensor Based on Li+-Doped SnO2 One-Dimensional Porous Nanofibers

Directory of Open Access Journals (Sweden)

Min Yin

2017-05-01

Full Text Available One-dimensional SnO2- and Li+-doped SnO2 porous nanofibers were easily fabricated via electrospinning and a subsequent calcination procedure for ultrafast humidity sensing. Different Li dopant concentrations were introduced to investigate the dopant’s role in sensing performance. The response properties were studied under different relative humidity levels by both statistic and dynamic tests. The best response was obtained with respect to the optimal doping of Li+ into SnO2 porous nanofibers with a maximum 15 times higher response than that of pristine SnO2 porous nanofibers, at a relative humidity level of 85%. Most importantly, the ultrafast response and recovery time within 1 s was also obtained with the 1.0 wt % doping of Li+ into SnO2 porous nanofibers at 5 V and at room temperature, benefiting from the co-contributions of Li-doping and the one-dimensional porous structure. This work provides an effective method of developing ultrafast sensors for practical applications—especially fast breathing sensors.

Networked sensors for the combat forces

Science.gov (United States)

Klager, Gene

2004-11-01

Real-time and detailed information is critical to the success of ground combat forces. Current manned reconnaissance, surveillance, and target acquisition (RSTA) capabilities are not sufficient to cover battlefield intelligence gaps, provide Beyond-Line-of-Sight (BLOS) targeting, and the ambush avoidance information necessary for combat forces operating in hostile situations, complex terrain, and conducting military operations in urban terrain. This paper describes a current US Army program developing advanced networked unmanned/unattended sensor systems to survey these gaps and provide the Commander with real-time, pertinent information. Networked Sensors for the Combat Forces plans to develop and demonstrate a new generation of low cost distributed unmanned sensor systems organic to the RSTA Element. Networked unmanned sensors will provide remote monitoring of gaps, will increase a unit"s area of coverage, and will provide the commander organic assets to complete his Battlefield Situational Awareness (BSA) picture for direct and indirect fire weapons, early warning, and threat avoidance. Current efforts include developing sensor packages for unmanned ground vehicles, small unmanned aerial vehicles, and unattended ground sensors using advanced sensor technologies. These sensors will be integrated with robust networked communications and Battle Command tools for mission planning, intelligence "reachback", and sensor data management. The network architecture design is based on a model that identifies a three-part modular design: 1) standardized sensor message protocols, 2) Sensor Data Management, and 3) Service Oriented Architecture. This simple model provides maximum flexibility for data exchange, information management and distribution. Products include: Sensor suites optimized for unmanned platforms, stationary and mobile versions of the Sensor Data Management Center, Battle Command planning tools, networked communications, and sensor management software. Details

Documentation pckage for the RFID temperature monitoring system (Of Model 9977 packages at NTS).

Energy Technology Data Exchange (ETDEWEB)

Chen, K.; Tsai, H.; Decision and Information Sciences

2009-02-20

The technical basis for extending the Model 9977 shipping package periodic maintenance beyond the one-year interval to a maximum of five years is based on the performance of the O-ring seals and the environmental conditions. The DOE Packaging Certification Program (PCP) has tasked Argonne National Laboratory to develop a Radio-Frequency Identification (RFID) temperature monitoring system for use by the facility personnel at DAF/NTS. The RFID temperature monitoring system, depicted in the figure below, consists of the Mk-1 RFId tags, a reader, and a control computer mounted on a mobile platform that can operate as a stand-alone system, or it can be connected to the local IT network. As part of the Conditions of Approval of the CoC, the user must complete the prescribed training to become qualified and be certified for operation of the RFID temperature monitoring system. The training course will be administered by Argonne National Laboratory on behalf of the Headquarters Certifying Official. This is a complete documentation package for the RFID temperature monitoring system of the Model 9977 packagings at NTS. The documentation package will be used for training and certification. The table of contents are: Acceptance Testing Procedure of MK-1 RFID Tags for DOE/EM Nuclear Materials Management Applications; Acceptance Testing Result of MK-1 RFID Tags for DOE/EM Nuclear Materials Management Applications; Performance Test of the Single Bolt Seal Sensor for the Model 9977 Packaging; Calibration of Built-in Thermistors in RFID Tags for Nevada Test Site; Results of Calibration of Built-in Thermistors in RFID Tags; Results of Thermal Calibration of Second Batch of MK-I RFID Tags; Procedure for Installing and Removing MK-1 RFID Tag on Model 9977 Drum; User Guide for RFID Reader and Software for Temperature Monitoring of Model 9977 Drums at NTS; Software Quality Assurance Plan (SQAP) for the ARG-US System; Quality Category for the RFID Temperature Monitoring System; The

Method of forming a package for MEMS-based fuel cell

Science.gov (United States)

Morse, Jeffrey D; Jankowski, Alan F

2013-05-21

A MEMS-based fuel cell package and method thereof is disclosed. The fuel cell package comprises seven layers: (1) a sub-package fuel reservoir interface layer, (2) an anode manifold support layer, (3) a fuel/anode manifold and resistive heater layer, (4) a Thick Film Microporous Flow Host Structure layer containing a fuel cell, (5) an air manifold layer, (6) a cathode manifold support structure layer, and (7) a cap. Fuel cell packages with more than one fuel cell are formed by positioning stacks of these layers in series and/or parallel. The fuel cell package materials such as a molded plastic or a ceramic green tape material can be patterned, aligned and stacked to form three dimensional microfluidic channels that provide electrical feedthroughs from various layers which are bonded together and mechanically support a MEMS-based miniature fuel cell. The package incorporates resistive heating elements to control the temperature of the fuel cell stack. The package is fired to form a bond between the layers and one or more microporous flow host structures containing fuel cells are inserted within the Thick Film Microporous Flow Host Structure layer of the package.

Development of polymer packaging for power cable

Directory of Open Access Journals (Sweden)

S. Sremac

2014-10-01

Full Text Available This paper discusses the issues of product design and the procedure of developing polymer packaging as one of the most important engineering tasks. For the purpose of packing power cables a polymer packaging has been designed in the form of drum. Packaging and many other consumer products are largely produced using polymeric materials due to many positive features. High Density Polyethylene is the type of polyethylene proposed for packaging purposes due to its low degree of branching and strong intermolecular forces. Transport and storage processes were automated based on the radio-frequency identification technology. The proposed system is flexible in terms of its possibility of accepting and processing different types of cables and other products.

High precision silicon piezo resistive SMART pressure sensor

International Nuclear Information System (INIS)

Brown, Rod

2005-01-01

Instruments for test and calibration require a pressure sensor that is precise and stable. Market forces also dictate a move away from single measurand test equipment and, certainly in the case of pressure, away from single range equipment. A pressure 'module' is required which excels in pressure measurement but is interchangble with sensors for other measurands. A communications interface for such a sensor has been specified. Instrument Digital Output Sensor (IDOS) that permits this interchanagability and allows the sensor to be inside or outside the measuring instrument. This paper covers the design and specification of a silicon diaphragm piezo resistive SMART sensor using this interface. A brief history of instrument sensors will be given to establish the background to this development. Design choices of the silicon doping, bridge energisation method, temperature sensing, signal conversion, data processing, compensation method, communications interface will be discussed. The physical format of the 'in-instrument' version will be shown and then extended to the packaging design for the external version. Test results will show the accuracy achieved exceeds the target of 0.01%FS over a range of temperatures

High precision silicon piezo resistive SMART pressure sensor

Science.gov (United States)

Brown, Rod

2005-01-01

Instruments for test and calibration require a pressure sensor that is precise and stable. Market forces also dictate a move away from single measurand test equipment and, certainly in the case of pressure, away from single range equipment. A pressure `module' is required which excels in pressure measurement but is interchangble with sensors for other measurands. A communications interface for such a sensor has been specified. Instrument Digital Output Sensor (IDOS) that permits this interchanagability and allows the sensor to be inside or outside the measuring instrument. This paper covers the design and specification of a silicon diaphragm piezo resistive SMART sensor using this interface. A brief history of instrument sensors will be given to establish the background to this development. Design choices of the silicon doping, bridge energisation method, temperature sensing, signal conversion, data processing, compensation method, communications interface will be discussed. The physical format of the `in-instrument' version will be shown and then extended to the packaging design for the external version. Test results will show the accuracy achieved exceeds the target of 0.01%FS over a range of temperatures.

THE SOFTWARE PACKAGE FOR DATA STREAM SCRAMBLING

Directory of Open Access Journals (Sweden)

P. A. Kadiev

2016-01-01

Full Text Available Abstract. It is proposed a software package for multivariate stepwise transformation of the text flow in order to increase resistance to protect against unauthorized access, and a package to restore the converted text. The basis of the proposals: the formation of nxn-array from the elements of a data flow, preliminary transposition of the array elements to form an array, each row and each column of which includes one and one only element from each row and each column of the source array, following reading on the options selected by the user.Package for direct conversion includes: a module for forming an array from the input flow; transposition module of array elements according to the scheme of Latin squares; reading module of rows or columns of the array to one of the following algorithms: sequential reading; reading of rows or columns with even indices and then odd ones;reading the row or column with odd indices, and then the even; reading at random route, which is generated by the program; reading at the route determined by the user.Package for restoring of the original message by the inverse transform comprises: a channel array forming module from the data flow; recovery module from the channel array - the array of Latin square type; the original array module; the original message restoring module. 

ACEMAN (II): a PDP-11 software package for acoustic emission analysis

International Nuclear Information System (INIS)

Tobias, A.

1976-01-01

A powerful, but easy-to-use, software package (ACEMAN) for acoustic emission analysis has been developed at Berkeley Nuclear Laboratories. The system is based on a PDP-11 minicomputer with 24 K of memory, an RK05 DISK Drive and a Tektronix 4010 Graphics terminal. The operation of the system is described in detail in terms of the functions performed in response to the various command mnemonics. The ACEMAN software package offers many useful facilities not found on other acoustic emission monitoring systems. Its main features, many of which are unique, are summarised. The ACEMAN system automatically handles arrays of up to 12 sensors in real-time operation during which data are acquired, analysed, stored on the computer disk for future analysis and displayed on the terminal if required. (author)

\\title{Development of Radiation Damage Models for Irradiated Silicon Sensors Using TCAD Tools}

CERN Document Server

Bhardwaj, Ashutosh; Lalwani, Kavita; Ranjan, Kirti; Printz, Martin; Ranjeet, Ranjeet; Eber, Robert; Eichhorn, Thomas; Peltola, Timo Hannu Tapani

2014-01-01

Abstract. During the high luminosity upgrade of the LHC (HL-LHC) the CMS tracking system will face a more intense radiation environment than the present system was designed for. In order to design radiation tolerant silicon sensors for the future CMS tracker upgrade it is fundamental to complement the measurement with device simulation. This will help in both the understanding of the device performance and in the optimization of the design parameters. One of the important ingredients of the device simulation is to develop a radiation damage model incorporating both bulk and surface damage. In this paper we will discuss the development of a radiation damage model by using commercial TCAD packages (Silvaco and Synopsys), which successfully reproduce the recent measurements like leakage current, depletion voltage, interstrip capacitance and interstrip resistance, and provides an insight into the performance of irradiated silicon strip sensors.

MEMS packaging

CERN Document Server

Hsu , Tai-Ran

2004-01-01

MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing.The Institution of Engineering and Technology is

3D inkjet printed disposable environmental monitoring wireless sensor node

KAUST Repository

Farooqui, Muhammad Fahad

2017-10-24

We propose a disposable, miniaturized, moveable, fully integrated 3D inkjet-printed wireless sensor node for large area environmental monitoring applications. As a proof of concept, we show the wireless sensing of temperature, humidity and H2S levels which are important for early warnings of two critical environmental conditions namely forest fires and industrial gas leaks. The temperature sensor has TCR of -0.018/°, the highest of any inkjet-printed sensor and the H2S sensor can detect as low as 3 ppm of gas. These sensors and an antenna have been realized on the walls of a 3D-printed cubic package which encloses the microelectronics developed on a 3D-printed circuit board. Hence, 3D printing and inkjet printing have been combined in order to realize a unique low-cost, fully integrated wireless sensor node. Field tests show that these sensor nodes can wirelessly communicate up to a distance of over 100m. Our proposed sensor node can be a part of internet of things with the aim of providing a better and safe living.

Curved sensors for compact high-resolution wide-field designs: prototype demonstration and optical characterization

Science.gov (United States)

Chambion, Bertrand; Gaschet, Christophe; Behaghel, Thibault; Vandeneynde, Aurélie; Caplet, Stéphane; Gétin, Stéphane; Henry, David; Hugot, Emmanuel; Jahn, Wilfried; Lombardo, Simona; Ferrari, Marc

2018-02-01

Over the recent years, a huge interest has grown for curved electronics, particularly for opto-electronics systems. Curved sensors help the correction of off-axis aberrations, such as Petzval Field Curvature, astigmatism, and bring significant optical and size benefits for imaging systems. In this paper, we first describe advantages of curved sensor and associated packaging process applied on a 1/1.8'' format 1.3Mpx global shutter CMOS sensor (Teledyne EV76C560) into its standard ceramic package with a spherical radius of curvature Rc=65mm and 55mm. The mechanical limits of the die are discussed (Finite Element Modelling and experimental), and electro-optical performances are investigated. Then, based on the monocentric optical architecture, we proposed a new design, compact and with a high resolution, developed specifically for a curved image sensor including optical optimization, tolerances, assembly and optical tests. Finally, a functional prototype is presented through a benchmark approach and compared to an existing standard optical system with same performances and a x2.5 reduction of length. The finality of this work was a functional prototype demonstration on the CEA-LETI during Photonics West 2018 conference. All these experiments and optical results demonstrate the feasibility and high performances of systems with curved sensors.

Packaging design criteria for the Hanford Ecorok Packaging

International Nuclear Information System (INIS)

Mercado, M.S.

1996-01-01

The Hanford Ecorok Packaging (HEP) will be used to ship contaminated water purification filters from K Basins to the Central Waste Complex. This packaging design criteria documents the design of the HEP, its intended use, and the transportation safety criteria it is required to meet. This information will serve as a basis for the safety analysis report for packaging

Recent trends and future of pharmaceutical packaging technology

Directory of Open Access Journals (Sweden)

Nityanand Zadbuke

2013-01-01

Full Text Available The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, pharmaceuticals need reliable and speedy packaging solutions that deliver a combination of product protection, quality, tamper evidence, patient comfort and security needs. Constant innovations in the pharmaceuticals themselves such as, blow fill seal (BFS vials, anti-counterfeit measures, plasma impulse chemical vapor deposition (PICVD coating technology, snap off ampoules, unit dose vials, two-in-one prefilled vial design, prefilled syringes and child-resistant packs have a direct impact on the packaging. The review details several of the recent pharmaceutical packaging trends that are impacting packaging industry, and offers some predictions for the future.

Recent trends and future of pharmaceutical packaging technology.

Science.gov (United States)

Zadbuke, Nityanand; Shahi, Sadhana; Gulecha, Bhushan; Padalkar, Abhay; Thube, Mahesh

2013-04-01

The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, pharmaceuticals need reliable and speedy packaging solutions that deliver a combination of product protection, quality, tamper evidence, patient comfort and security needs. Constant innovations in the pharmaceuticals themselves such as, blow fill seal (BFS) vials, anti-counterfeit measures, plasma impulse chemical vapor deposition (PICVD) coating technology, snap off ampoules, unit dose vials, two-in-one prefilled vial design, prefilled syringes and child-resistant packs have a direct impact on the packaging. The review details several of the recent pharmaceutical packaging trends that are impacting packaging industry, and offers some predictions for the future.

Recent trends and future of pharmaceutical packaging technology

Science.gov (United States)

Zadbuke, Nityanand; Shahi, Sadhana; Gulecha, Bhushan; Padalkar, Abhay; Thube, Mahesh

2013-01-01

The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, pharmaceuticals need reliable and speedy packaging solutions that deliver a combination of product protection, quality, tamper evidence, patient comfort and security needs. Constant innovations in the pharmaceuticals themselves such as, blow fill seal (BFS) vials, anti-counterfeit measures, plasma impulse chemical vapor deposition (PICVD) coating technology, snap off ampoules, unit dose vials, two-in-one prefilled vial design, prefilled syringes and child-resistant packs have a direct impact on the packaging. The review details several of the recent pharmaceutical packaging trends that are impacting packaging industry, and offers some predictions for the future. PMID:23833515

Design basis for resistance to shock and vibration of radioactive material packages greater than one ton in truck transport (draft standard for trial use and comment)

International Nuclear Information System (INIS)

Anon.

1984-01-01

This standard specifies minimum design values for shock and vibration in highway transport, by truck or by tractor-trailer combination, for fuel and irradiation experiments when package weight exceeds one ton. Shock values correspond to normal transport over rough roads and to minor accidents such as backing into a loading dock. Vibration values correspond to normal transport; any large-amplitude vibration resulting from rough road conditions or a minor accident is treated as shock. This standard includes recommended methods of application to the design of packaging and tiedown systems

Metal Oxide Nanostructures in Food Applications: Quality Control and Packaging

Directory of Open Access Journals (Sweden)

Vardan Galstyan

2018-04-01

Full Text Available Metal oxide materials have been applied in different fields due to their excellent functional properties. Metal oxides nanostructuration, preparation with the various morphologies, and their coupling with other structures enhance the unique properties of the materials and open new perspectives for their application in the food industry. Chemical gas sensors that are based on semiconducting metal oxide materials can detect the presence of toxins and volatile organic compounds that are produced in food products due to their spoilage and hazardous processes that may take place during the food aging and transportation. Metal oxide nanomaterials can be used in food processing, packaging, and the preservation industry as well. Moreover, the metal oxide-based nanocomposite structures can provide many advantageous features to the final food packaging material, such as antimicrobial activity, enzyme immobilization, oxygen scavenging, mechanical strength, increasing the stability and the shelf life of food, and securing the food against humidity, temperature, and other physiological factors. In this paper, we review the most recent achievements on the synthesis of metal oxide-based nanostructures and their applications in food quality monitoring and active and intelligent packaging.

High-quality phase-shifted Bragg grating sensor inscribed with only one laser pulse in a polymer optical fiber

DEFF Research Database (Denmark)

Marques, C. A. F.; Pospori, A.; Pereira, L.

2017-01-01

We present the first phase-shifted polymer optical fiber Bragg grating sensor inscribed with only one KrF laser pulse. The phase shift defect was created directly during the grating inscription process by placing a very narrow blocking aperture, in the center of the UV beam. One laser pulse...

Development of $Mathematica$ Package 'StandardPhysicalConstants'

CERN Document Server

Ezhela, Vladimir V

2003-01-01

Here we report on the further development of the 'StandardPhysicalConstants' package which was presented for the first time at the last IMS 2001 conference. We would like to dwell on the following issues: the package structure; current status of the physical constant database; data sourses, current data collection and data structure; the main modules of data management system; the first version of "error propagator"; usage examples of one in calculations for high precision tests of physics theories. The outlook of the future development of the package is also given.

Nanocellulose in green food packaging.

Science.gov (United States)

Vilarinho, Fernanda; Sanches Silva, Ana; Vaz, M Fátima; Farinha, José Paulo

2017-01-26

The development of packaging materials with new functionalities and lower environmental impact is now an urgent need of our society. On one hand, the shelf-life extension of packaged products can be an answer to the exponential increase of worldwide demand for food. On the other hand, uncertainty of crude oil prices and reserves has imposed the necessity to find raw materials to replace oil-derived polymers. Additionally, consumers' awareness toward environmental issues increasingly pushes industries to look with renewed interest to "green" solutions. In response to these issues, numerous polymers have been exploited to develop biodegradable food packaging materials. Although the use of biopolymers has been limited due to their poor mechanical and barrier properties, these can be enhanced by adding reinforcing nanosized components to form nanocomposites. Cellulose is probably the most used and well-known renewable and sustainable raw material. The mechanical properties, reinforcing capabilities, abundance, low density, and biodegradability of nanosized cellulose make it an ideal candidate for polymer nanocomposites processing. Here we review the potential applications of cellulose based nanocomposites in food packaging materials, highlighting the several types of biopolymers with nanocellulose fillers that have been used to form bio-nanocomposite materials. The trends in nanocellulose packaging applications are also addressed.

Hazardous materials package performance regulations

International Nuclear Information System (INIS)

Russell, N.A.; Glass, R.E.; McClure, J.D.; Finley, N.C.

1993-01-01

Two regulatory philosophies, one based on 'specification' packaging standards and the other based on 'performance' packaging standards, currently define the hazmat packaging certification process. A main concern when setting performance standards is determining the appropriate standards necessary to assure adequate public protection. This paper discusses a Hazmat Packaging Performance Evaluation (HPPE) project being conducted at Sandia National Laboratories for the U.S. Department of Transportation Research and Special Programs Administration. In this project, the current bulk packagings (larger than 2000 gallons) for transporting Materials Extremely Toxic By Inhalation (METBI) are being evaluated and performance standards will be recommended. A computer software system, HazCon, has been developed which can calculate the dispersion of dense, neutral, and buoyant gases. HazCon also has a database of thermodynamic and toxicity data for the METBI materials, a user-friendly menu-driven format for creating input data sets for calculating dispersion of the METBI in the event of an accidental release, and a link between the METBI database and the dense gas dispersion code (which requires thermodynamic properties). The primary output of HazCon is a listing of mass concentrations of the released material at distances downwind from the release point. (J.P.N.)

System certification: An alternative to package certification?

International Nuclear Information System (INIS)

Luna, R.E.; Jefferson, R.J.

1992-01-01

One precept of the current radioactive material transportation regulations is that the package is the primary protection for the public. A packaging is chosen to provide containment, shielding, and criticality control suitable to the quantity and characteristics of the radionuclide being transported. Occasionally, radioactive materials requiring transport are not of a mass or size that would allow the materials to be shipped in an appropriate packaging. This is a particular problem for materials that should be shipped in a Type B package, but because such packages are designed and certified for specific contents, the package is usually fairly expensive, available in relatively small numbers, and often requires a fairly long period to achieve certification or amended certification for new contents. Where the shipment to be made is relatively infrequent, there may be economic and time penalties that may hamper shipment or force the shipper into uneconomic or high risk options. However, there is recognition of such situations in the International Atomic Energy Agency (IAEA) regulations under the provisions for Special Arrangement

Mechanisms of human immunodeficiency virus type 2 RNA packaging

DEFF Research Database (Denmark)

Ni, Na; Nikolaitchik, Olga A; Dilley, Kari A

2011-01-01

do not support the cis-packaging hypothesis but instead indicate that trans packaging is the major mechanism of HIV-2 RNA packaging. To further characterize the mechanisms of HIV-2 RNA packaging, we visualized HIV-2 RNA in individual particles by using fluorescent protein-tagged RNA-binding proteins......Human immunodeficiency virus type 2 (HIV-2) has been reported to have a distinct RNA packaging mechanism, referred to as cis packaging, in which Gag proteins package the RNA from which they were translated. We examined the progeny generated from dually infected cell lines that contain two HIV-2...... proviruses, one with a wild-type gag/gag-pol and the other with a mutant gag that cannot express functional Gag/Gag-Pol. Viral titers and RNA analyses revealed that mutant viral RNAs can be packaged at efficiencies comparable to that of viral RNA from which wild-type Gag/Gag-Pol is translated. These results...

Packaging microservices

DEFF Research Database (Denmark)

Montesi, Fabrizio; Thrane, Dan Sebastian

2017-01-01

We describe a first proposal for a new packaging system for microservices based on the Jolie programming language, called the Jolie Package Manager (JPM). Its main features revolve around service interfaces, which make the functionalities that a service provides and depends on explicit. For the f......We describe a first proposal for a new packaging system for microservices based on the Jolie programming language, called the Jolie Package Manager (JPM). Its main features revolve around service interfaces, which make the functionalities that a service provides and depends on explicit...

High quantum efficiency annular backside silicon photodiodes for reflectance pulse oximetry in wearable wireless body sensors

International Nuclear Information System (INIS)

Duun, Sune; Haahr, Rasmus G; Hansen, Ole; Birkelund, Karen; Thomsen, Erik V

2010-01-01

The development of annular photodiodes for use in a reflectance pulse oximetry sensor is presented. Wearable and wireless body sensor systems for long-term monitoring require sensors that minimize power consumption. We have fabricated large area 2D ring-shaped silicon photodiodes optimized for minimizing the optical power needed in reflectance pulse oximetry. To simplify packaging, backside photodiodes are made which are compatible with assembly using surface mounting technology without pre-packaging. Quantum efficiencies up to 95% and area-specific noise equivalent powers down to 30 fW Hz -1/2 cm -1 are achieved. The photodiodes are incorporated into a wireless pulse oximetry sensor system embedded in an adhesive patch presented elsewhere as 'The Electronic Patch'. The annular photodiodes are fabricated using two masked diffusions of first boron and subsequently phosphor. The surface is passivated with a layer of silicon nitride also serving as an optical filter. As the final process, after metallization, a hole in the center of the photodiode is etched using deep reactive ion etch.

Combined Instrumentation Package COMARS+ for the ExoMars Schiaparelli Lander

Science.gov (United States)

Gülhan, Ali; Thiele, Thomas; Siebe, Frank; Kronen, Rolf

2018-02-01

In order to measure aerothermal parameters on the back cover of the ExoMars Schiaparelli lander the instrumentation package COMARS+ was developed by DLR. Consisting of three combined aerothermal sensors, one broadband radiometer sensor and an electronic box the payload provides important data for future missions. The aerothermal sensors called COMARS combine four discrete sensors measuring static pressure, total heat flux, temperature and radiative heat flux at two specific spectral bands. The infrared radiation in a broadband spectral range is measured by the separate broadband radiometer sensor. The electronic box of the payload is used for amplification, conditioning and multiplexing of the sensor signals. The design of the payload was mainly carried out using numerical tools including structural analyses, to simulate the main mechanical loads which occur during launch and stage separation, and thermal analyses to simulate the temperature environment during cruise phase and Mars entry. To validate the design an extensive qualification test campaign was conducted on a set of qualification models. The tests included vibration and shock tests to simulate launch loads and stage separation shocks. Thermal tests under vacuum condition were performed to simulate the thermal environment of the capsule during the different flight phases. Furthermore electromagnetic compatibility tests were conducted to check that the payload is compatible with the electromagnetic environment of the capsule and does not emit electromagnetic energy that could cause electromagnetic interference in other devices. For the sensor heads located on the ExoMars back cover radiation tests were carried out to verify their radiation hardness. Finally the bioburden reduction process was demonstrated on the qualification hardware to show the compliance with the planetary protection requirements. To test the actual heat flux, pressure and infrared radiation measurement under representative conditions

Magnetic Package data quality overview

DEFF Research Database (Denmark)

Qamili, Enkelejda; Ottavianelli, Giuseppe; Olsen, Nils

The ESA Swarm satellites, launched in November 2013, carry on-board instuments devoted to measure extremely accurate data necessary to improve our understanding of Earth’s magnetic field. The Swarm instrument package is made by two magnetometers (one vector and one scalar), one Electric field...... Instrument (EFI), one Accelerometer and one GPS reciever. This presentation aims at providing an extensive overview of the magnetic instrument status, magnetic data availability and quality....

Enhanced polymeric encapsulation for MEMS based multi sensors for fisheries research

DEFF Research Database (Denmark)

Birkelund, Karen; Nørgaard, Lars; Thomsen, Erik Vilain

2011-01-01

light intensity, temperature, pressure and conductivity. For precise and fast measurements a direct exposure of the sensor to the water is desirable. A potted tube encapsulation concept has shown to be promising for accurate and fast measurements in harsh environment, provided a tight sealing......This paper presents the challenges of a packaged MEMS-based multi sensor system that allow for direct exposure of the sensing part to sea water. The system is part of a data storage tag used on fish to provide the researcher with information on fish behaviour and migration. The sensor measures...... compared to low pressure chemical vapor deposited (LPCVD) silicon nitride and untreated silicon dioxide....

Trends in antimicrobial food packaging systems: Emitting sachets and absorbent pads

Science.gov (United States)

Active antimicrobial packaging interacts with packaged food and headspace to reduce, retard, or even inhibit the growth of spoilage and pathogenic microorganisms. Sachets and pads are one of the most successful applications of active food packaging. This review discusses recent developments of antim...

PRIDE Surveillance Projects Data Packaging Project, Information Package Specification Version 1.0

Energy Technology Data Exchange (ETDEWEB)

Kelleher, D.M.; Shipp, R. L.; Mason, J. D.

2009-09-28

This document contains a specification for a standard XML document format called an information package that can be used to store information and the context required to understand and use that information in information management systems and other types of information archives. An information package consists of packaged information, a set of information metadata that describes the packaged information, and an XML signature that protects the packaged information. The information package described in this specification was designed to be used to store Department of Energy (DOE) and National Nuclear Security Administration (NNSA) information and includes the metadata required for that information: a unique package identifier, information marking that conforms to DOE and NNSA requirements, and access control metadata. Information package metadata can also include information search terms, package history, and notes. Packaged information can be text content, binary content, and the contents of files and other containers. A single information package can contain multiple types of information. All content not in a text form compatible with XML must be in a text encoding such as base64. Package information is protected by a digital XML signature that can be used to determine whether the information has changed since it was signed and to identify the source of the information. This specification has been tested but has not been used to create production information packages. The authors expect that gaps and unclear requirements in this specification will be identified as this specification is used to create information packages and as information stored in information packages is used. The authors expect to issue revised versions of this specification as needed to address these issues.

Improvement in Sensitivity of an Inductive Oil Palm Fruit Sensor

Directory of Open Access Journals (Sweden)

Norhisam Misron

2014-02-01

Full Text Available Among palm oil millers, the ripeness of oil palm Fresh Fruit Bunch (FFB is determined through visual inspection. To increase the productivity of the millers, many researchers have proposed with a new detection method to replace the conventional one. The sensitivity of such a sensor plays a crucial role in determining the effectiveness of the method. In our preliminary study a novel oil palm fruit sensor to detect the maturity of oil palm fruit bunches is proposed. The design of the proposed air coil sensor based on an inductive sensor is further investigated to improve its sensitivity. This paper investigates the results pertaining to the effects of the air coil structure of an oil palm fruit sensor, taking consideration of the used copper wire diameter ranging from 0.10 mm to 0.18 mm with 60 turns. The flat-type shape of air coil was used on twenty samples of fruitlets from two categories, namely ripe and unripe. Samples are tested with frequencies ranging from 20 Hz to 120 MHz. The sensitivity of the sensor between air to fruitlet samples increases as the coil diameter increases. As for the sensitivity differences between ripe and unripe samples, the 5 mm air coil length with the 0.12 mm coil diameter provides the highest percentage difference between samples and it is amongst the highest deviation value between samples. The result from this study is important to improve the sensitivity of the inductive oil palm fruit sensor mainly with regards to the design of the air coil structure. The efficiency of the sensor to determine the maturity of the oil palm FFB and the ripening process of the fruitlet could further be enhanced.

In-Package Chemistry Abstraction

Energy Technology Data Exchange (ETDEWEB)

P.S. Domski

2003-07-21

The work associated with the development of this model report was performed in accordance with the requirements established in ''Technical Work Plan for Waste Form Degradation Modeling, Testing, and Analyses in Support of SR and LA'' (BSC 2002a). The in-package chemistry model and in-package chemistry model abstraction are developed to predict the bulk chemistry inside of a failed waste package and to provide simplified expressions of that chemistry. The purpose of this work is to provide the abstraction model to the Performance Assessment Project and the Waste Form Department for development of geochemical models of the waste package interior. The scope of this model report is to describe the development and validation of the in-package chemistry model and in-package chemistry model abstraction. The in-package chemistry model will consider chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) and codisposed high-level waste glass (HLWG) and N Reactor spent fuel (CDNR). The in-package chemistry model includes two sub-models, the first a water vapor condensation (WVC) model, where water enters a waste package as vapor and forms a film on the waste package components with subsequent film reactions with the waste package materials and waste form--this is a no-flow model, the reacted fluids do not exit the waste package via advection. The second sub-model of the in-package chemistry model is the seepage dripping model (SDM), where water, water that may have seeped into the repository from the surrounding rock, enters a failed waste package and reacts with the waste package components and waste form, and then exits the waste package with no accumulation of reacted water in the waste package. Both of the submodels of the in-package chemistry model are film models in contrast to past in-package chemistry models where all of the waste package pore space was filled with water. The

In-Package Chemistry Abstraction

International Nuclear Information System (INIS)

P.S. Domski

2003-01-01

The work associated with the development of this model report was performed in accordance with the requirements established in ''Technical Work Plan for Waste Form Degradation Modeling, Testing, and Analyses in Support of SR and LA'' (BSC 2002a). The in-package chemistry model and in-package chemistry model abstraction are developed to predict the bulk chemistry inside of a failed waste package and to provide simplified expressions of that chemistry. The purpose of this work is to provide the abstraction model to the Performance Assessment Project and the Waste Form Department for development of geochemical models of the waste package interior. The scope of this model report is to describe the development and validation of the in-package chemistry model and in-package chemistry model abstraction. The in-package chemistry model will consider chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) and codisposed high-level waste glass (HLWG) and N Reactor spent fuel (CDNR). The in-package chemistry model includes two sub-models, the first a water vapor condensation (WVC) model, where water enters a waste package as vapor and forms a film on the waste package components with subsequent film reactions with the waste package materials and waste form--this is a no-flow model, the reacted fluids do not exit the waste package via advection. The second sub-model of the in-package chemistry model is the seepage dripping model (SDM), where water, water that may have seeped into the repository from the surrounding rock, enters a failed waste package and reacts with the waste package components and waste form, and then exits the waste package with no accumulation of reacted water in the waste package. Both of the submodels of the in-package chemistry model are film models in contrast to past in-package chemistry models where all of the waste package pore space was filled with water. The current in-package

ANALYSIS OF RIBBONING ON CONICAL YARN PACKAGE WOUND BY OPENEND SPINNING MACHINES

Directory of Open Access Journals (Sweden)

Resul FETTAHOV

2001-03-01

Full Text Available In this paper, Ribboning , one of the common faults in yarn packages, is mathematically analysed. If yarn is repeatly laid on top of or along the same path as the previously wound yarn, this duplication of yarn path on the package creates a defect known as ribboning. The number of turns of package (n per double traverse of yarn guide is calculated in two different way One is calculated the length of a coil on the package and total length of yarn in a double traverse; the other is considered transmission rate between drum and conical yarn package The result of two different approach is similar and the probable diameter of conical yarn package which ribboning is occurred is calculated and used on Schalafhorst-Autocore OE spinning machines.

Color in packaging design : Case: ZheJiang JinSheng packaging Co,Ltd

OpenAIRE

Hu, Cuicui

2010-01-01

Color occupies an important position in packaging design, with the improvement of living standard, the higher requirement of color design in packaging. The aim of this thesis was to discuss key issues concerning aesthetics of packaging design. Topics will include an overview of the packaging design, the influence factor of packaging design, and introduce the aesthetics from packaging aspect. This thesis will also identify common problems of the production process, and list the phases of ho...

Packaging for Sustainability

CERN Document Server

Lewis, Helen; Fitzpatrick, Leanne

2012-01-01

The packaging industry is under pressure from regulators, customers and other stakeholders to improve packaging’s sustainability by reducing its environmental and societal impacts. This is a considerable challenge because of the complex interactions between products and their packaging, and the many roles that packaging plays in the supply chain. Packaging for Sustainability is a concise and readable handbook for practitioners who are trying to implement sustainability strategies for packaging. Industry case studies are used throughout the book to illustrate possible applications and scenarios. Packaging for Sustainability draws on the expertise of researchers and industry practitioners to provide information on business benefits, environmental issues and priorities, environmental evaluation tools, design for environment, marketing strategies, and challenges for the future.

The Twenty Statement Test in Teacher Development

Directory of Open Access Journals (Sweden)

Ahmet Aypay

2011-10-01

Full Text Available The purpose of this study is to describe teacher characteristics using Twenty Statements Test (TST. Study group includes a total of thirty-five individuals, including teachers, guidance and counselors and research assistants. The study used a qualitative approach on teacher identity. TST is one of the qualitative methods that were used to determine individual self-conceptualization. Study group were requested to write twenty statements that describe themselves responding to the question “Who I am?” in a free format. The findings indicated that teachers were overwhelmingly in group c (reflective. No differences were found in terms of gender and profession. Only few significant differences have been found based on marital status. The utility of TST in teacher training and development was discussed.

The Twenty Statement Test in Teacher Development

Directory of Open Access Journals (Sweden)

Ahmet Aypay

2011-04-01

Full Text Available The purpose of this study is to describe teacher characteristics using Twenty Statements Test (TST. Study group includes a total of thirty-five individuals, including teachers, guidance and counselors and research assistants. The study used a qualitative approach on teacher identity. TST is one of the qualitative methods that were used to determine individual self-conceptualization. Study group were requested to write twenty statements that describe themselves responding to the question “Who I am?” in a free format. The findings indicated that teachers were overwhelmingly in group c (reflective. No differences were found in terms of gender and profession. Only few significant differences have been found based on marital status. The utility of TST in teacher training and development was discussed

CDIAC catalog of numeric data packages and computer model packages

International Nuclear Information System (INIS)

Boden, T.A.; Stoss, F.W.

1993-05-01

The Carbon Dioxide Information Analysis Center acquires, quality-assures, and distributes to the scientific community numeric data packages (NDPs) and computer model packages (CMPs) dealing with topics related to atmospheric trace-gas concentrations and global climate change. These packages include data on historic and present atmospheric CO 2 and CH 4 concentrations, historic and present oceanic CO 2 concentrations, historic weather and climate around the world, sea-level rise, storm occurrences, volcanic dust in the atmosphere, sources of atmospheric CO 2 , plants' response to elevated CO 2 levels, sunspot occurrences, and many other indicators of, contributors to, or components of climate change. This catalog describes the packages presently offered by CDIAC, reviews the processes used by CDIAC to assure the quality of the data contained in these packages, notes the media on which each package is available, describes the documentation that accompanies each package, and provides ordering information. Numeric data are available in the printed NDPs and CMPs, in CD-ROM format, and from an anonymous FTP area via Internet. All CDIAC information products are available at no cost

System design package for IBM system one: solar heating and domestic hot water

Science.gov (United States)

1977-01-01

This report is a collation of documents and drawings that describe a prototype solar heating and hot water system using air as the collector fluid and a pebble bed for heat storage. The system was designed for installation into a single family dwelling. The description, performance specification, subsystem drawings, verification plan/procedure, and hazard analysis of the system was packaged for evaluation of the system with information sufficient to assemble a similar system.

lmerTest Package: Tests in Linear Mixed Effects Models

DEFF Research Database (Denmark)

Kuznetsova, Alexandra; Brockhoff, Per B.; Christensen, Rune Haubo Bojesen

2017-01-01

One of the frequent questions by users of the mixed model function lmer of the lme4 package has been: How can I get p values for the F and t tests for objects returned by lmer? The lmerTest package extends the 'lmerMod' class of the lme4 package, by overloading the anova and summary functions...... by providing p values for tests for fixed effects. We have implemented the Satterthwaite's method for approximating degrees of freedom for the t and F tests. We have also implemented the construction of Type I - III ANOVA tables. Furthermore, one may also obtain the summary as well as the anova table using...

TinyOS-based quality of service management in wireless sensor networks

Science.gov (United States)

Peterson, N.; Anusuya-Rangappa, L.; Shirazi, B.A.; Huang, R.; Song, W.-Z.; Miceli, M.; McBride, D.; Hurson, A.; LaHusen, R.

2009-01-01

Previously the cost and extremely limited capabilities of sensors prohibited Quality of Service (QoS) implementations in wireless sensor networks. With advances in technology, sensors are becoming significantly less expensive and the increases in computational and storage capabilities are opening the door for new, sophisticated algorithms to be implemented. Newer sensor network applications require higher data rates with more stringent priority requirements. We introduce a dynamic scheduling algorithm to improve bandwidth for high priority data in sensor networks, called Tiny-DWFQ. Our Tiny-Dynamic Weighted Fair Queuing scheduling algorithm allows for dynamic QoS for prioritized communications by continually adjusting the treatment of communication packages according to their priorities and the current level of network congestion. For performance evaluation, we tested Tiny-DWFQ, Tiny-WFQ (traditional WFQ algorithm implemented in TinyOS), and FIFO queues on an Imote2-based wireless sensor network and report their throughput and packet loss. Our results show that Tiny-DWFQ performs better in all test cases. ?? 2009 IEEE.

Development of a novel colorimetric sensor based on alginate beads for monitoring rainbow trout spoilage.

Science.gov (United States)

Majdinasab, Marjan; Hosseini, Seyed Mohammad Hashem; Sepidname, Marziyeh; Negahdarifar, Manizheh; Li, Peiwu

2018-05-01

Alginate is a non-toxic, renewable, and linear copolymer obtained from the brown algae Laminaria digitata that can be easily shaped into beads. Its good gel forming properties have made it useful for entrapping food and pharmaceutical ingredients. In this study, alginate beads were used in a novel application as a colorimetric sensor in food intelligent packaging. Colorimetric sensor was developed through entrapping red cabbage extract as a pH indicator in alginate beads. The pH indicator beads were used in rainbow trout packaging for monitoring fillets spoilage. Color change of beads during fish storage was measured using the CIELab method. The alginate bead colorimetric sensor is validated by measuring total volatile basic nitrogen (TVB-N) levels and microbial populations in fish samples. Moreover, peroxide value (PV) and thiobarbituric acid reactive substances (TBARS) were evaluated during storage. Results indicated that increasing the bacterial population during storage and production of proteolytic enzymes resulted in protein degradation, accumulation of volatile amine compounds, increase in the pH and finally color change of alginate beads. The values of TVB-N, pH, PV and TBARS increased with time of storage. The results of TVB-N and microbial growth were in accordance with color change of beads and CIELab data. Therefore, the proposed system enjoys a high sensitivity to pH variations and is capable of monitoring the spoilage of fish or other protein-rich products through its wide range of color changes. The alginate beads containing the red cabbage extract can, thus, be used as a low-cost colorimetric sensor for intelligent packaging applications.

Resistive pressure sensors integrated with a Coriolis mass flow sensor

NARCIS (Netherlands)

Alveringh, Dennis; Schut, Thomas; Wiegerink, Remco J.; Sparreboom, Wouter; Lötters, Joost Conrad

2017-01-01

We report on a novel resistive pressure sensor that is completely integrated with a Coriolis mass flow sensor on one chip, without the need for extra fabrication steps or different materials. Two pressure sensors are placed in-line with the Coriolis sensor without requiring any changes to the fluid

Surfactant Sensors in Biotechnology; Part 1 – Electrochemical Sensors

Directory of Open Access Journals (Sweden)

Milan Sak-Bosnar

2004-01-01

Full Text Available An overview on electrochemical surfactant sensors is given with special attention to papers published since 1993. The importance of surfactants in modern biotechnology is stressed out. Electrochemical sensors are usually divided according to the measured physical quantity to potentiometric, amperometric, conductometric and impedimetric surfactant sensors. The last ones are very few. Potentiometric surfactant sensors are the most numerous due to their simplicity and versatility. They can be used either as end-point titration sensors or as direct EMF measurement sensors, in batch or flow-through mode. Some amperometric surfactant sensors are true biosensors that use microorganisms or living cells.

Integration of a Miniaturized Conductivity Sensor into an Animal-Borne Instrument

Science.gov (United States)

2013-09-30

inductive sensors. However, there is a trade -off between size and accuracy. Decreasing size resuls in a decreased accuracy. In addition, by...modified for easy integration into the existing SRDL. The CT package will then be intergrated into the SRDL tested in the lab. After the successful

Ceramic ball grid array package stress analysis

Science.gov (United States)

Badri, S. H. B. S.; Aziz, M. H. A.; Ong, N. R.; Sauli, Z.; Alcain, J. B.; Retnasamy, V.

2017-09-01

The ball grid array (BGA), a form of chip scale package (CSP), was developed as one of the most advanced surface mount devices, which may be assembled by an ordinary surface ball bumps are used instead of plated nickel and gold (Ni/Au) bumps. Assembly and reliability of the BGA's printed circuit board (PCB), which is soldered by conventional surface mount technology is considered in this study. The Ceramic Ball Grid Array (CBGA) is a rectangular ceramic package or square-shaped that will use the solder ball for external electrical connections instead of leads or wire for connections. The solder balls will be arranged in an array or grid at the bottom of the ceramic package body. In this study, ANSYS software is used to investigate the stress on the package for 2 balls and 4 balls of the CBGA package with the various force range of 1-3 Newton applied to the top of the die, top of the substrate and side of the substrate. The highest maximum stress was analyzed and the maximum equivalent stress was observed on the solder ball and the die. From the simulation result, the CBGA package with less solder balls experience higher stress compared to the package with many solder balls. Therefore, less number of solder ball on the CBGA package results higher stress and critically affect the reliability of the solder balls itself, substrate and die which can lead to the solder crack and also die crack.

RNA secondary structures of the bacteriophage phi6 packaging regions.

OpenAIRE

Pirttimaa, M J; Bamford, D H

2000-01-01

Bacteriophage phi6 genome consists of three segments of double-stranded RNA. During maturation, single-stranded copies of these segments are packaged into preformed polymerase complex particles. Only phi6 RNA is packaged, and each particle contains only one copy of each segment. An in vitro packaging and replication assay has been developed for phi6, and the packaging signals (pac sites) have been mapped to the 5' ends of the RNA segments. In this study, we propose secondary structure models ...

Structural constraints in the packaging of bluetongue virus genomic segments

OpenAIRE

Burkhardt, Christiane; Sung, Po-Yu; Celma, Cristina C.; Roy, Polly

2014-01-01

: The mechanism used by bluetongue virus (BTV) to ensure the sorting and packaging of its 10 genomic segments is still poorly understood. In this study, we investigated the packaging constraints for two BTV genomic segments from two different serotypes. Segment 4 (S4) of BTV serotype 9 was mutated sequentially and packaging of mutant ssRNAs was investigated by two newly developed RNA packaging assay systems, one in vivo and the other in vitro. Modelling of the mutated ssRNA followed by bioche...

Design/licensing of on-site package for core component

International Nuclear Information System (INIS)

Ogasawara, K.; Chohzuka, T.; Shimura, T.; Kikuchi, T.; Fujiwara, R.; Karigome, S.; Takani, M.

1993-01-01

For storage of used core components which are produced from reactors, Tohoku EPCO decided to construct a site bunker at Onagawa site. It was also decided to develop and fabricate one packaging to transport core components from the reactor buildings to the site bunker. The packaging will be used within the power station; therefore, it shall comply with 'The Law for the Business of Electric Power' and relevant Notification. The main requirements of the packaging are as follows: 1) The number of contents, such as channel boxes and control rods, shall be as large as possible. 2) The weight and the outer dimensions of the packaging shall be within the limitation of the reactor building and the site bunker. 3) Materials shall be selected from those which have been already applied for existing packagings and utilized without any problems. 4) It shall be considered during design of trunnions that handling equipment, such as lifting beam, can be used for not only this packaging but also for existing spent fuel packagings. The design of the packaging is completed and has been licensed. The packaging is scheduled to be utilized from November, 1993. (J.P.N.)

Waste package performance assessment

International Nuclear Information System (INIS)

Lester, D.H.

1981-01-01

This paper describes work undertaken to assess the life-expectancy and post-failure nuclide release behavior of high-level and waste packages in a geologic repository. The work involved integrating models of individual phenomena (such as heat transfer, corrosion, package deformation, and nuclide transport) and using existing data to make estimates of post-emplacement behavior of waste packages. A package performance assessment code was developed to predict time to package failure in a flooded repository and subsequent transport of nuclides out of the leaking package. The model has been used to evaluate preliminary package designs. The results indicate, that within the limitation of model assumptions and data base, packages lasting a few hundreds of years could be developed. Very long lived packages may be possible but more comprehensive data are needed to confirm this

Edible packaging materials.

Science.gov (United States)

Janjarasskul, Theeranun; Krochta, John M

2010-01-01

Research groups and the food and pharmaceutical industries recognize edible packaging as a useful alternative or addition to conventional packaging to reduce waste and to create novel applications for improving product stability, quality, safety, variety, and convenience for consumers. Recent studies have explored the ability of biopolymer-based food packaging materials to carry and control-release active compounds. As diverse edible packaging materials derived from various by-products or waste from food industry are being developed, the dry thermoplastic process is advancing rapidly as a feasible commercial edible packaging manufacturing process. The employment of nanocomposite concepts to edible packaging materials promises to improve barrier and mechanical properties and facilitate effective incorporation of bioactive ingredients and other designed functions. In addition to the need for a more fundamental understanding to enable design to desired specifications, edible packaging has to overcome challenges such as regulatory requirements, consumer acceptance, and scaling-up research concepts to commercial applications.

CMOS capacitive sensors for lab-on-chip applications a multidisciplinary approach

CERN Document Server

Ghafar-Zadeh, Ebrahim

2010-01-01

The main components of CMOS capacitive biosensors including sensing electrodes, bio-functionalized sensing layer, interface circuitries and microfluidic packaging are verbosely explained in chapters 2-6 after a brief introduction on CMOS based LoCs in Chapter 1. CMOS Capacitive Sensors for Lab-on-Chip Applications is written in a simple pedagogical way. It emphasises practical aspects of fully integrated CMOS biosensors rather than mathematical calculations and theoretical details. By using CMOS Capacitive Sensors for Lab-on-Chip Applications, the reader will have circuit design methodologies,

Digital Radiography of a Drop Tested 9975 Radioactive Materials Packaging

International Nuclear Information System (INIS)

Blanton, P.S.

2001-01-01

This paper discusses the use of radiography as a tool for evaluating damage to radioactive material packaging subjected to regulatory accident conditions. The Code of Federal Regulations, 10 CFR 71, presents the performance based requirements that must be used in the development (design, fabrication and testing) of a radioactive material packaging. The use of various non-destructive examination techniques in the fabrication of packages is common. One such technique is the use of conventional radiography in the examination of welds. Radiography is conventional in the sense that images are caught one at a time on film stock. Most recently, digital radiography has been used to characterize internal damage to a package subjected to the 30-foot hypothetical accident conditions (HAC) drop. Digital radiography allows for real time evaluation of the item being inspected. This paper presents a summary discussion of the digital radiographic technique and an example of radiographic results of a 9975 package following the HAC 30-foot drop

Active Packaging Coatings

Directory of Open Access Journals (Sweden)

Luis J. Bastarrachea

2015-11-01

Full Text Available Active food packaging involves the packaging of foods with materials that provide an enhanced functionality, such as antimicrobial, antioxidant or biocatalytic functions. This can be achieved through the incorporation of active compounds into the matrix of the commonly used packaging materials, or by the application of coatings with the corresponding functionality through surface modification. The latter option offers the advantage of preserving the packaging materials’ bulk properties nearly intact. Herein, different coating technologies like embedding for controlled release, immobilization, layer-by-layer deposition, and photografting are explained and their potential application for active food packaging is explored and discussed.

Strain transfer analysis of optical fiber based sensors embedded in an asphalt pavement structure

International Nuclear Information System (INIS)

Wang, Huaping; Xiang, Ping

2016-01-01

Asphalt pavement is vulnerable to random damage, such as cracking and rutting, which can be proactively identified by distributed optical fiber sensing technology. However, due to the material nature of optical fibers, a bare fiber is apt to be damaged during the construction process of pavements. Thus, a protective layer is needed for this application. Unfortunately, part of the strain of the host material is absorbed by the protective layer when transferring the strain to the sensing fiber. To account for the strain transfer error, in this paper a theoretical analysis of the strain transfer of a three-layered general model has been carried out by introducing Goodman’s hypothesis to describe the interfacial shear stress relationship. The model considers the viscoelastic behavior of the host material and protective layer. The effects of one crack in the host material and the sensing length on strain transfer relationship are been discussed. To validate the effectiveness of the strain transfer analysis, a flexible asphalt-mastic packaged distributed optical fiber sensor was designed and tested in a laboratory environment to monitor the distributed strain and appearance of cracks in an asphalt concrete beam at two different temperatures. The experimental results indicated that the developed strain transfer formula can significantly reduce the strain transfer error, and that the asphalt-mastic packaged optical fiber sensor can successfully monitor the distributed strain and identify local cracks. (paper)

Strain transfer analysis of optical fiber based sensors embedded in an asphalt pavement structure

Science.gov (United States)

Wang, Huaping; Xiang, Ping

2016-07-01

Asphalt pavement is vulnerable to random damage, such as cracking and rutting, which can be proactively identified by distributed optical fiber sensing technology. However, due to the material nature of optical fibers, a bare fiber is apt to be damaged during the construction process of pavements. Thus, a protective layer is needed for this application. Unfortunately, part of the strain of the host material is absorbed by the protective layer when transferring the strain to the sensing fiber. To account for the strain transfer error, in this paper a theoretical analysis of the strain transfer of a three-layered general model has been carried out by introducing Goodman’s hypothesis to describe the interfacial shear stress relationship. The model considers the viscoelastic behavior of the host material and protective layer. The effects of one crack in the host material and the sensing length on strain transfer relationship are been discussed. To validate the effectiveness of the strain transfer analysis, a flexible asphalt-mastic packaged distributed optical fiber sensor was designed and tested in a laboratory environment to monitor the distributed strain and appearance of cracks in an asphalt concrete beam at two different temperatures. The experimental results indicated that the developed strain transfer formula can significantly reduce the strain transfer error, and that the asphalt-mastic packaged optical fiber sensor can successfully monitor the distributed strain and identify local cracks.

Food choice: the battle between package, taste and consumption situation.

Science.gov (United States)

Gutjar, Swetlana; de Graaf, Cees; Palascha, Aikaterini; Jager, Gerry

2014-09-01

The present study compared how intrinsic (sensory) and extrinsic (packaging) product properties influence actual food choice in combination with the concept of product appropriateness in a specific consumption context. Food choice of seven test products was measured in three breakfast sessions within a simulated cafeteria setting with subsequent product consumption. Test products were five breakfast drinks and two dessert products considered as inappropriate for breakfast. One hundred and three participants took part in a blind taste session, after which they chose one out of the seven foods to consume for breakfast. In a second session (familiar package session), the same participants based their choice on the package of the seven foods they tasted in the first session. An additional group of 65 participants took part in a third naïve package session, where they chose just on the basis of package without being previously exposed to the foods. Results showed that food choices in the naïve package session were guided by the package that labelled the products as "breakfast product". Food choices in the blind session were strongly correlated (r = 0.8) with the liking of the products. Food choice in the "familiar package session" lay between the blind and naïve package session. It is concluded that food choice in a simulated cafeteria setting is guided by extrinsic (package) as well as intrinsic (sensory) properties and both can act as a cue for product appropriateness given a specific consumption context. Depending on the salience of either intrinsic or extrinsic properties during the choice moment their impact on choice is stronger. Copyright © 2014 Elsevier Ltd. All rights reserved.

Safety Analysis Report for packaging (onsite) steel waste package

International Nuclear Information System (INIS)

BOEHNKE, W.M.

2000-01-01

The steel waste package is used primarily for the shipment of remote-handled radioactive waste from the 324 Building to the 200 Area for interim storage. The steel waste package is authorized for shipment of transuranic isotopes. The maximum allowable radioactive material that is authorized is 500,000 Ci. This exceeds the highway route controlled quantity (3,000 A 2 s) and is a type B packaging

Learning Activity Package, Algebra.

Science.gov (United States)

Evans, Diane

A set of ten teacher-prepared Learning Activity Packages (LAPs) in beginning algebra and nine in intermediate algebra, these units cover sets, properties of operations, number systems, open expressions, solution sets of equations and inequalities in one and two variables, exponents, factoring and polynomials, relations and functions, radicals,…

Reliability evaluation of fiber optic sensors exposed to cyclic thermal load

Energy Technology Data Exchange (ETDEWEB)

Kim, Heon Young; Kim, Dong Hoon [Advanced Materials Research Team, Korea Railroad Research Institute, Uiwang (Korea, Republic of); Kim, Dae Hyun [Dept. of Mechanical and Automotive Engineering, Seoul National University of Science and Technology, Seoul (Korea, Republic of)

2016-06-15

Fiber Bragg grating (FBG) sensors are currently the most prevalent sensors because of their unique advantages such as ease of multiplexing and capability of performing absolute measurements. They are applied to various structures for structural health monitoring (SHM). The signal characteristics of FBG sensors under thermal loading should be investigated to enhance the reliability of these sensors, because they are exposed to certain cyclic thermal loads due to temperature changes resulting from change of seasons, when they are applied to structures for SHM. In this study, tests on specimens are conducted in a thermal chamber with temperature changes from - to for 300 cycles. For the specimens, two types of base materials and adhesives that are normally used in the manufacture of packaged FBG sensors are selected. From the test results, it is confirmed that the FBG sensors undergo some degree of compressive strain under cyclic thermal load; this can lead to measurement errors. Hence, a pre-calibration is necessary before applying these sensors to structures for long-term SHM.

PRIDE Surveillance Projects Data Packaging Project Information Package Specification Version 1.1

Energy Technology Data Exchange (ETDEWEB)

Kelleher, D. M.; Shipp, R. L.; Mason, J. D.

2010-08-31

Information Package Specification version 1.1 describes an XML document format called an information package that can be used to store information in information management systems and other information archives. An information package consists of package information, the context required to understand and use that information, package metadata that describes the information, and XML signatures that protect the information. The information package described in this specification was designed to store Department of Energy (DOE) and National Nuclear Security Administration (NNSA) information and includes the metadata required for that information: a unique package identifier, information marking that conforms to DOE and NNSA requirements, and access control metadata. It is an implementation of the Open Archival Information System (OAIS) Reference Model archival information package tailored to meet NNSA information storage requirements and designed to be used in the computing environments at the Y-12 National Security Complex and at other NNSA sites.

Evaluating the impacts of packaging policy in The Netherlands

NARCIS (Netherlands)

Rouw, M.; Worrell, E.

2011-01-01

Packaging materials are one of the largest contributors to municipal solid waste production. This paper evaluates the material impacts packaging policy in The Netherlands in the period 1986–2007. Five different voluntary agreements were implemented over this period to reduce the environmental impact

Package

Directory of Open Access Journals (Sweden)

Arsić Zoran

2013-01-01

Full Text Available It is duty of the seller to pack the goods in a manner which assures their safe arrival and enables their handling in transit and at the place of destination. The problem of packing is relevant in two main respects. First of all the buyer is in certain circumstances entitled to refuse acceptance of the goods if they are not properly packed. Second, the package is relevant to calculation of price and freight based on weight. In the case of export trade, the package should conform to the legislation in the country of destination. The impact of package on environment is regulated by environment protection regulation of Republic if Serbia.

Effect of irradiation, packaging and storage on the quality of spices

Energy Technology Data Exchange (ETDEWEB)

Langerak, D I; Stegeman, H

1983-09-29

Spices are contaminated by nature with microorganisms. The processing industry, however, requires 'clean' spices. The most applied technique has been fumigation with ethylene oxide. However, fumigation causes a number of difficulties; viz. the presence of residues and the possible forming of toxic compounds like ethylene chlorohydrine. The latest method is the decontamination by means of ionizing rays. Research on the effect of irradiation and packaging on the different quality aspects of spices proves that an irradiation dose of 3-8 kGy produces the same or better results with regard to decontamination effect as a fumigation treatment does. The applied dose has no adverse effect on the sensoric and chemical properties of the product. With respect to the wholesomeness, the irradiation process can be applied safely. Furthermore, this process offers the possibility to choose an optimal packaging for spices, thus preventing quality deterioration. 22 references, 8 tables.

TWENTIES Project. Wind power for wide-area control of the grid

Energy Technology Data Exchange (ETDEWEB)

Perez, Juan Carlos; Combarros, Clara; Veguillas, Roberto; Hermosa, Mikel Joseba [Iberdrola Renovables, Madrid (Spain); Rubio, David [Iberdrola Ingenieria y Construccion (Spain); Egido, Ignacio [Comillas Univ. (ES). Inst. de Investigacion Tecnologica (IIT)

2011-07-01

Europe faces a great challenge with the 2020 scenario in which the renewable energy installed capacity in Europe should increase from its present value of approximately 80 GW to 230 GW in 2020. The future high penetration levels of wind and other renewable energies in the power system require decision makers and stakeholders of the electrical sector to work together to develop new ancillary services and to make the necessary changes to the grid infrastructure in Europe. This background is in line with the SYSERWIND demonstration lead by Iberdrola Renovables and included in the TWENTIES project, with three more partners taking part in this package: Red Electrica de Espana (REE), IIT and Gamesa Eolica. This paper introduces a first phase of preliminary work to define, install and test a Secondary Frequency Control and a Voltage Management System in a wide area, along a transport line. (orig.)

Distributed Long-Gauge Optical Fiber Sensors Based Self-Sensing FRP Bar for Concrete Structure.

Science.gov (United States)

Tang, Yongsheng; Wu, Zhishen

2016-02-25

Brillouin scattering-based distributed optical fiber (OF) sensing technique presents advantages for concrete structure monitoring. However, the existence of spatial resolution greatly decreases strain measurement accuracy especially around cracks. Meanwhile, the brittle feature of OF also hinders its further application. In this paper, the distributed OF sensor was firstly proposed as long-gauge sensor to improve strain measurement accuracy. Then, a new type of self-sensing fiber reinforced polymer (FRP) bar was developed by embedding the packaged long-gauge OF sensors into FRP bar, followed by experimental studies on strain sensing, temperature sensing and basic mechanical properties. The results confirmed the superior strain sensing properties, namely satisfied accuracy, repeatability and linearity, as well as excellent mechanical performance. At the same time, the temperature sensing property was not influenced by the long-gauge package, making temperature compensation easy. Furthermore, the bonding performance between self-sensing FRP bar and concrete was investigated to study its influence on the sensing. Lastly, the sensing performance was further verified with static experiments of concrete beam reinforced with the proposed self-sensing FRP bar. Therefore, the self-sensing FRP bar has potential applications for long-term structural health monitoring (SHM) as embedded sensors as well as reinforcing materials for concrete structures.

Packaging-radiation disinfestation relationships

International Nuclear Information System (INIS)

Highland, H.A.

1985-01-01

Foods that are susceptible to insect infestation can be irradiated to destroy the infestation; however, the food must be kept essentially insect-free until consumed, or it must be disinfested again, perhaps repeatedly. Insect-resistant packages can be used to prevent reinfestation, but there are certain requirements that must be fulfilled before a package can be made insect resistant. These include the use of insect-light construction and packaging materials that resist boring insects. The relative insect resistance of various packages and packaging materials is discussed, as are behavior traits such as egressive boring that enables insects to escape from packages and the ability of insects to climb on various packaging materials. Some successful and unsuccessful attempts to make various types of packages insect resistant are discussed, as are factors that must be considered in the selection or development of insect-resistant packages for radiation disinfested foods. The latter factors include biological and physical environments, length of storage periods, stresses on packages during shipment, types of storage facilities, governmental regulations, health requirements, and others

Emerging Chitosan-Based Films for Food Packaging Applications.

Science.gov (United States)

Wang, Hongxia; Qian, Jun; Ding, Fuyuan

2018-01-17

Recent years have witnessed great developments in biobased polymer packaging films for the serious environmental problems caused by the petroleum-based nonbiodegradable packaging materials. Chitosan is one of the most abundant biopolymers after cellulose. Chitosan-based materials have been widely applied in various fields for their biological and physical properties of biocompatibility, biodegradability, antimicrobial ability, and easy film forming ability. Different chitosan-based films have been fabricated and applied in the field of food packaging. Most of the review papers related to chitosan-based films are focusing on antibacterial food packaging films. Along with the advances in the nanotechnology and polymer science, numerous strategies, for instance direct casting, coating, dipping, layer-by-layer assembly, and extrusion, have been employed to prepare chitosan-based films with multiple functionalities. The emerging food packaging applications of chitosan-based films as antibacterial films, barrier films, and sensing films have achieved great developments. This article comprehensively reviews recent advances in the preparation and application of engineered chitosan-based films in food packaging fields.

Power Electronic Packaging Design, Assembly Process, Reliability and Modeling

CERN Document Server

Liu, Yong

2012-01-01

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can d...

Packaged die heater

Science.gov (United States)

Spielberger, Richard; Ohme, Bruce Walker; Jensen, Ronald J.

2011-06-21

A heater for heating packaged die for burn-in and heat testing is described. The heater may be a ceramic-type heater with a metal filament. The heater may be incorporated into the integrated circuit package as an additional ceramic layer of the package, or may be an external heater placed in contact with the package to heat the die. Many different types of integrated circuit packages may be accommodated. The method provides increased energy efficiency for heating the die while reducing temperature stresses on testing equipment. The method allows the use of multiple heaters to heat die to different temperatures. Faulty die may be heated to weaken die attach material to facilitate removal of the die. The heater filament or a separate temperature thermistor located in the package may be used to accurately measure die temperature.

Safety Analysis Report for packaging (onsite) steel waste package

Energy Technology Data Exchange (ETDEWEB)

BOEHNKE, W.M.

2000-07-13

The steel waste package is used primarily for the shipment of remote-handled radioactive waste from the 324 Building to the 200 Area for interim storage. The steel waste package is authorized for shipment of transuranic isotopes. The maximum allowable radioactive material that is authorized is 500,000 Ci. This exceeds the highway route controlled quantity (3,000 A{sub 2}s) and is a type B packaging.

Fabrication of strain gauge based sensors for tactile skins

Science.gov (United States)

Baptist, Joshua R.; Zhang, Ruoshi; Wei, Danming; Saadatzi, Mohammad Nasser; Popa, Dan O.

2017-05-01

Fabricating cost effective, reliable and functional sensors for electronic skins has been a challenging undertaking for the last several decades. Application of such skins include haptic interfaces, robotic manipulation, and physical human-robot interaction. Much of our recent work has focused on producing compliant sensors that can be easily formed around objects to sense normal, tension, or shear forces. Our past designs have involved the use of flexible sensors and interconnects fabricated on Kapton substrates, and piezoresistive inks that are 3D printed using Electro Hydro Dynamic (EHD) jetting onto interdigitated electrode (IDE) structures. However, EHD print heads require a specialized nozzle and the application of a high-voltage electric field; for which, tuning process parameters can be difficult based on the choice of inks and substrates. Therefore, in this paper we explore sensor fabrication techniques using a novel wet lift-off photolithographic technique for patterning the base polymer piezoresistive material, specifically Poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate) or PEDOT:PSS. Fabricated sensors are electrically and thermally characterized, and temperaturecompensated designs are proposed and validated. Packaging techniques for sensors in polymer encapsulants are proposed and demonstrated to produce a tactile interface device for a robot.

CMOS-compatible ruggedized high-temperature Lamb wave pressure sensor

International Nuclear Information System (INIS)

Kropelnicki, P; Mu, X J; Randles, A B; Cai, H; Ang, W C; Tsai, J M; Muckensturm, K-M; Vogt, H

2013-01-01

This paper describes the development of a novel ruggedized high-temperature pressure sensor operating in lateral field exited (LFE) Lamb wave mode. The comb-like structure electrodes on top of aluminum nitride (AlN) were used to generate the wave. A membrane was fabricated on SOI wafer with a 10 µm thick device layer. The sensor chip was mounted on a pressure test package and pressure was applied to the backside of the membrane, with a range of 20–100 psi. The temperature coefficient of frequency (TCF) was experimentally measured in the temperature range of −50 °C to 300 °C. By using the modified Butterworth–van Dyke model, coupling coefficients and quality factor were extracted. Temperature-dependent Young's modulus of composite structure was determined using resonance frequency and sensor interdigital transducer (IDT) wavelength which is mainly dominated by an AlN layer. Absolute sensor phase noise was measured at resonance to estimate the sensor pressure and temperature sensitivity. This paper demonstrates an AlN-based pressure sensor which can operate in harsh environment such as oil and gas exploration, automobile and aeronautic applications. (paper)

The Thermal Infrared Sensor onboard NASA's Mars 2020 Mission

Science.gov (United States)

Martinez, G.; Perez-Izquierdo, J.; Sebastian, E.; Ramos, M.; Bravo, A.; Mazo, M.; Rodriguez-Manfredi, J. A.

2017-12-01

NASA's Mars 2020 rover mission is scheduled for launch in July/August 2020 and will address key questions about the potential for life on Mars. The Mars Environmental Dynamics Analyzer (MEDA) is one of the seven instruments onboard the rover [1] and has been designed to assess the environmental conditions across the rover traverse. MEDA will extend the current record of in-situ meteorological measurements at the surface [2] to other locations on Mars. The Thermal InfraRed Sensor (TIRS) [3] is one of the six sensors comprising MEDA. TIRS will use three downward-looking channels to measure (1) the surface skin temperature (with high heritage from the Rover Environmental Monitoring Station onboard the Mars Science Laboratory mission [4]), (2) the upwelling thermal infrared radiation from the surface and (3) the reflected solar radiation at the surface, and two upward-looking channels to measure the (4) downwelling thermal infrared radiation at the surface and (5) the atmospheric temperature. In combination with other MEDA's sensors, TIRS will allow the quantification of the surface energy budget [5] and the determination of key geophysical properties of the terrain such as the albedo and thermal inertia with an unprecedented spatial resolution. Here we present a general description of the TIRS, with focus on its scientific requirements and results from field campaigns showing the performance of the different channels. References:[1] Rodríguez-Manfredi, J. A. et al. (2014), MEDA: An environmental and meteorological package for Mars 2020, LPSC, 45, 2837. [2] Martínez, G.M. et al. (2017), The Modern Near-Surface Martian Climate: A Review of In-situ Meteorological Data from Viking to Curiosity, Space Science Reviews, 1-44. [3] Pérez-Izquierdo, J. et al. (2017), The Thermal Infrared Sensor (TIRS) of the Mars Environmental Dynamics Analyzer (MEDA) Instrument onboard Mars 2020, IEEE. [4] Sebastián, E. et al. (2010), The Rover Environmental Monitoring Station Ground

CEPXS/ONELD: A one-dimensional coupled electron-photon discrete ordinates code package

International Nuclear Information System (INIS)

Lorence, L.J. Jr.; Morel, J.E.

1992-01-01

CEPXS/ONELD is a discrete ordinates transport code package that can model the electron-photon cascade from 100 MeV to 1 keV. The CEPXS code generates fully-coupled multigroup-Legendre cross section data. This data is used by the general-purpose discrete ordinates code, ONELD, which is derived from the Los Alamos ONEDANT and ONBTRAN codes. Version 1.0 of CEPXS/ONELD was released in 1989 and has been primarily used to analyze the effect of radiation environments on electronics. Version 2.0 is under development and will include user-friendly features such as the automatic selection of group structure, spatial mesh structure, and S N order

Service program package for processing and analysis of the data on the state of environment and public health

International Nuclear Information System (INIS)

Vorob'ev, E.I.; Kornelyuk, V.A.; Kuz'menko, A.S.; Reznichenko, V.Yu.; Shestopalov, V.L.

1984-01-01

The problems related to the creation of universal service program packages (SPP) which are intended for processing the data on the state of environment and public health in the regions of large NPP dislocation are discussed. Peculiarities of the SSP, BMD and SENSOR SPPs as well as the ANGARA SPP developed on the base of the BMD and BMDP SPPs are considered. The ANGARA SPP is tested in the course of a large-scale medico-biological experiment, the purpose of which consisted in estimation of changes in the state of health of practically healthy people as bioindicator of slight changes in the environment. As a result of the analysis between 300 factors 45 most informative ones have been selected

Antimicrobial food packaging: potential and pitfalls

Science.gov (United States)

Malhotra, Bhanu; Keshwani, Anu; Kharkwal, Harsha

2015-01-01

Nowadays food preservation, quality maintenance, and safety are major growing concerns of the food industry. It is evident that over time consumers’ demand for natural and safe food products with stringent regulations to prevent food-borne infectious diseases. Antimicrobial packaging which is thought to be a subset of active packaging and controlled release packaging is one such promising technology which effectively impregnates the antimicrobial into the food packaging film material and subsequently delivers it over the stipulated period of time to kill the pathogenic microorganisms affecting food products thereby increasing the shelf life to severe folds. This paper presents a picture of the recent research on antimicrobial agents that are aimed at enhancing and improving food quality and safety by reduction of pathogen growth and extension of shelf life, in a form of a comprehensive review. Examination of the available antimicrobial packaging technologies is also presented along with their significant impact on food safety. This article entails various antimicrobial agents for commercial applications, as well as the difference between the use of antimicrobials under laboratory scale and real time applications. Development of resistance amongst microorganisms is considered as a future implication of antimicrobials with an aim to come up with actual efficacies in extension of shelf life as well as reduction in bacterial growth through the upcoming and promising use of antimicrobials in food packaging for the forthcoming research down the line. PMID:26136740

MEMS-based sensors for post-earthquake damage assessment

Energy Technology Data Exchange (ETDEWEB)

Pozzi, M; Zonta, D; Trapani, D [DIMS, University of Trento, Via Mesiano 77, 38123, Trento (Italy); Athanasopoulos, N; Garetsos, A; Stratakos, Y E [Advanced Microwave Systems Ltd, 2, 25th Martiou Street, 17778 Athens (Greece); Amditis, A J; Bimpas, M [ICCS, National Technical University of Athens, 9 Iroon Polytechniou Street, 15773 Zografou (Greece); Ulieru, D, E-mail: daniele.zonta@unitn.it [SITEX 45 SRL, 114 Ghica Tei Blvd, 72235 Bucharest (Romania)

2011-07-19

The evaluation of seismic damage is today almost exclusively based on visual inspection, as building owners are generally reluctant to install permanent sensing systems, due to their high installation, management and maintenance costs. To overcome this limitation, the EU-funded MEMSCON project aims to produce small size sensing nodes for measurement of strain and acceleration, integrating Micro-Electro-Mechanical Systems (MEMS) based sensors and Radio Frequency Identification (RFID) tags in a single package that will be attached to reinforced concrete buildings and will transmit data using a wireless interface. During the first phase of the project completed so far, sensor prototypes were produced by assembling preexisting components. This paper outlines the device operating principles, production scheme and operation at both unit and network levels. It also reports on validation campaigns conducted in the laboratory to assess system performance. Accelerometer sensors were tested on a reduced scale metal frame mounted on a shaking table, while strain sensors were embedded in both reduced and full-scale reinforced concrete specimens undergoing increasing deformation cycles up to extensive damage and collapse. The performance of the sensors developed for the project and their applicability to long-term seismic monitoring are discussed.

Effects of different packaging techniques on the microbiological and physicochemical properties of coated pumpkin slices

Directory of Open Access Journals (Sweden)

Filiz AKSU

2016-01-01

Full Text Available Abstract In this study the effects of zein film coating along with benzoic acid on the quality of sliced pumpkin samples, which were packaged with different techniques were investigated. The samples were allocated into different groups and were treated with different processes. Following processing, the samples were stored at +4 °C for twenty days. Physicochemical and microbiological analyses were carried out on the samples once every five days during the storage period. According to color analysis, the L* value was observed to have significantly decreased in the processed and packaged samples in comparison with the control group. Besides, a* and b* values increased in all groups. It was determined that zein film alone did not exhibit the expected effectiveness against moisture loss in the samples. According to the results of microbiological analysis, a final decrease at approximately 1.00 log level was determined in total count of mesophilic aerobic bacteria (TMAB in the group which was vacuum packaged in PVDC with zein coating when compared with the initial TMAB. Furthermore, no molding occurred in zein-coated group on the last day of the storage period, while massive mold growth was noted in the group which was packaged without any pretreatment procedure.

Thermal Management of Power Semiconductor Packages - Matching Cooling Technologies with Packaging Technologies (Presentation)

Energy Technology Data Exchange (ETDEWEB)

Bennion, K.; Moreno, G.

2010-04-27

Heat removal for power semiconductor devices is critical for robust operation. Because there are different packaging options, different thermal management technologies, and a range of applications, there is a need for a methodology to match cooling technologies and package configurations to target applications. To meet this need, a methodology was developed to compare the sensitivity of cooling technologies on the overall package thermal performance over a range of power semiconductor packaging configurations. The results provide insight into the trade-offs associated with cooling technologies and package configurations. The approach provides a method for comparing new developments in power semiconductor packages and identifying potential thermal control technologies for the package. The results can help users select the appropriate combination of packaging configuration and cooling technology for the desired application.

ARTIST: advanced radiation-tolerant information and sensor system for teleoperation

International Nuclear Information System (INIS)

Schmidt, D.; Pathe, V.; Ostertag, M.; Dittrich, F.; Dumbreck, A.; Sirat, G.; Katzouraki, M.

1993-01-01

ARTIST integrates a stereoscopic camera and a rangefinder as sensor package into a high-precision pan-and-tilt head and represents the recorded data in a clear and comprehensive way for telemanipulation and control tasks as well as for remote driving. The sensors as well as the pan-and-tilt head are radiation-tolerant so they can be used in nuclear environments. The pan-and-tilt head and work station are completely configured and developed with the emphasis on multisensor integration, real-time video processing and graphical position representation. An efficient man-machine-interface appropriate software is included. (author)

NRF TRIGA packaging

International Nuclear Information System (INIS)

Clements, M.D.

1995-11-01

Training Reactor Isotopes, General Atomics (TRIGA reg-sign) Reactors are in use at four US Department of Energy (DOE) complex facilities and at least 23 university, commercial, or government facilities. The development of the Neutron Radiography Facility (NRF) TRIGA packaging system began in October 1993. The Hanford Site NRF is being shut down and requires an operationally user-friendly transportation and storage packaging system for removal of the TRIGA fuel elements. The NRF TRIGA packaging system is designed to remotely remove the fuel from the reactor and transport the fuel to interim storage (up to 50 years) on the Hanford Site. The packaging system consists of a cask and an overpack. The overpack is used only for transport and is not necessary for storage. Based upon the cask's small size and light weight, small TRIGA reactors will find it versatile for numerous refueling and fuel storage needs. The NRF TRIGA packaging design also provides the basis for developing a certifiable and economical packaging system for other TRIGA reactor facilities. The small size of the NRF TRIGA cask also accommodates placing the cask into a larger certified packaging for offsite transport. The Westinghouse Hanford Company NRF TRIGA packaging, as described herein can serve other DOE sites for their onsite use, and the design can be adapted to serve university reactor facilities, handling a variety of fuel payloads

Recognizing Banknote Fitness with a Visible Light One Dimensional Line Image Sensor

Directory of Open Access Journals (Sweden)

Tuyen Danh Pham

2015-08-01

Full Text Available In general, dirty banknotes that have creases or soiled surfaces should be replaced by new banknotes, whereas clean banknotes should be recirculated. Therefore, the accurate classification of banknote fitness when sorting paper currency is an important and challenging task. Most previous research has focused on sensors that used visible, infrared, and ultraviolet light. Furthermore, there was little previous research on the fitness classification for Indian paper currency. Therefore, we propose a new method for classifying the fitness of Indian banknotes, with a one-dimensional line image sensor that uses only visible light. The fitness of banknotes is usually determined by various factors such as soiling, creases, and tears, etc. although we just consider banknote soiling in our research. This research is novel in the following four ways: first, there has been little research conducted on fitness classification for the Indian Rupee using visible-light images. Second, the classification is conducted based on the features extracted from the regions of interest (ROIs, which contain little texture. Third, 1-level discrete wavelet transformation (DWT is used to extract the features for discriminating between fit and unfit banknotes. Fourth, the optimal DWT features that represent the fitness and unfitness of banknotes are selected based on linear regression analysis with ground-truth data measured by densitometer. In addition, the selected features are used as the inputs to a support vector machine (SVM for the final classification of banknote fitness. Experimental results showed that our method outperforms other methods.

Recognizing Banknote Fitness with a Visible Light One Dimensional Line Image Sensor.

Science.gov (United States)

Pham, Tuyen Danh; Park, Young Ho; Kwon, Seung Yong; Nguyen, Dat Tien; Vokhidov, Husan; Park, Kang Ryoung; Jeong, Dae Sik; Yoon, Sungsoo

2015-08-27

In general, dirty banknotes that have creases or soiled surfaces should be replaced by new banknotes, whereas clean banknotes should be recirculated. Therefore, the accurate classification of banknote fitness when sorting paper currency is an important and challenging task. Most previous research has focused on sensors that used visible, infrared, and ultraviolet light. Furthermore, there was little previous research on the fitness classification for Indian paper currency. Therefore, we propose a new method for classifying the fitness of Indian banknotes, with a one-dimensional line image sensor that uses only visible light. The fitness of banknotes is usually determined by various factors such as soiling, creases, and tears, etc. although we just consider banknote soiling in our research. This research is novel in the following four ways: first, there has been little research conducted on fitness classification for the Indian Rupee using visible-light images. Second, the classification is conducted based on the features extracted from the regions of interest (ROIs), which contain little texture. Third, 1-level discrete wavelet transformation (DWT) is used to extract the features for discriminating between fit and unfit banknotes. Fourth, the optimal DWT features that represent the fitness and unfitness of banknotes are selected based on linear regression analysis with ground-truth data measured by densitometer. In addition, the selected features are used as the inputs to a support vector machine (SVM) for the final classification of banknote fitness. Experimental results showed that our method outperforms other methods.

The Use of a Pressure-Indicating Sensor Film to Provide Feedback upon Hydrogel-Forming Microneedle Array Self-Application In Vivo.

Science.gov (United States)

Vicente-Pérez, Eva M; Quinn, Helen L; McAlister, Emma; O'Neill, Shannon; Hanna, Lezley-Anne; Barry, Johanne G; Donnelly, Ryan F

2016-12-01

To evaluate the combination of a pressure-indicating sensor film with hydrogel-forming microneedle arrays, as a method of feedback to confirm MN insertion in vivo. Pilot in vitro insertion studies were conducted using a Texture Analyser to insert MN arrays, coupled with a pressure-indicating sensor film, at varying forces into excised neonatal porcine skin. In vivo studies involved twenty human volunteers, who self-applied two hydrogel-forming MN arrays, one with a pressure-indicating sensor film incorporated and one without. Optical coherence tomography was employed to measure the resulting penetration depth and colorimetric analysis to investigate the associated colour change of the pressure-indicating sensor film. Microneedle insertion was achieved in vitro at three different forces, demonstrating the colour change of the pressure-indicating sensor film upon application of increasing pressure. When self-applied in vivo, there was no significant difference in the microneedle penetration depth resulting from each type of array, with a mean depth of 237 μm recorded. When the pressure-indicating sensor film was present, a colour change occurred upon each application, providing evidence of insertion. For the first time, this study shows how the incorporation of a simple, low-cost pressure-indicating sensor film can indicate microneedle insertion in vitro and in vivo, providing visual feedback to assure the user of correct application. Such a strategy may enhance usability of a microneedle device and, hence, assist in the future translation of the technology to widespread clinical use.

Type B drum packages

International Nuclear Information System (INIS)

McCoy, J.C.

1994-08-01

The Type B drum packages (TBD) are conceptualized as a family of containers in which a single 208 L or 114 L (55 gal or 30 gal) drum containing Type B quantities of radioactive material (RAM) can be packaged for shipment. The TBD containers are being developed to fill a void in the packaging and transportation capabilities of the U.S. Department of Energy as no container packaging single drums of Type B RAM exists offering double containment. Several multiple-drum containers currently exist, as well as a number of shielded casks, but the size and weight of these containers present many operational challenges for single-drum shipments. As an alternative, the TBD containers will offer up to three shielded versions (light, medium, and heavy) and one unshielded version, each offering single or optional double containment for a single drum. To reduce operational complexity, all versions will share similar design and operational features where possible. The primary users of the TBD containers are envisioned to be any organization desiring to ship single drums of Type B RAM, such as laboratories, waste retrieval activities, emergency response teams, etc. Currently, the TBD conceptual design is being developed with the final design and analysis to be completed in 1995 to 1996. Testing and certification of the unshielded version are planned to be completed in 1996 to 1997 with production to begin in 1997 to 1998