WorldWideScience

Sample records for tunnelling bipolar transistor

  1. Tunneling, Current Gain, and Transconductance in Silicon-Germanium Heterojunction Bipolar Transistors Operating at Millikelvin Temperatures

    Science.gov (United States)

    Davidović, D.; Ying, H.; Dark, J.; Wier, B. R.; Ge, L.; Lourenco, N. E.; Omprakash, A. P.; Mourigal, M.; Cressler, J. D.

    2017-08-01

    Quantum-transport measurements in advanced silicon-germanium heterojunction bipolar transistors (SiGe HBTs) are presented and analyzed, including tunneling spectroscopy of discrete impurity levels localized within the transistor and the dependence on an applied magnetic field. The collector current at millikelvin temperatures is well accounted for by ideal electron tunneling throughout the entire base. The amplification principle at millikelvin temperatures is fundamentally quantum mechanical in nature: an increase in base voltage, requiring a moderate base current, creates an equal and opposite decrease in the tunneling barrier seen by the electrons in the emitter, thereby increasing the collector current significantly more than the base current, producing current gain. Highly scaled SiGe HBTs operate predictably at millikelvin temperatures, thus opening the possibility of viable SiGe millikelvin circuitry.

  2. Atomic-Monolayer Two-Dimensional Lateral Quasi-Heterojunction Bipolar Transistors with Resonant Tunneling Phenomenon

    KAUST Repository

    Lin, Che-Yu

    2017-10-04

    High-frequency operation with ultra-thin, lightweight and extremely flexible semiconducting electronics are highly desirable for the development of mobile devices, wearable electronic systems and defense technologies. In this work, the first experimental observation of quasi-heterojunction bipolar transistors utilizing a monolayer of the lateral WSe2-MoS2 junctions as the conducting p-n channel is demonstrated. Both lateral n-p-n and p-n-p heterojunction bipolar transistors are fabricated to exhibit the output characteristics and current gain. A maximum common-emitter current gain of around 3 is obtained in our prototype two-dimensional quasi-heterojunction bipolar transistors. Interestingly, we also observe the negative differential resistance in the electrical characteristics. A potential mechanism is that the negative differential resistance is induced by resonant tunneling phenomenon due to the formation of quantum well under applying high bias voltages. Our results open the door to two-dimensional materials for high-frequency, high-speed, high-density and flexible electronics.

  3. Tunneling Current of Electron in Armchair Graphene Nanoribbon Bipolar Transistor Model Using Transfer Matrix Method

    Science.gov (United States)

    Fahmi, A. K.; Hasanah, L.; Rusdiana, D.; Aminudin, A.; Suhendi, E.

    2017-03-01

    The tunneling current of n-p-n bipolar junction transistor AGNR-based is modeled with semi-numerical method. The exponential solution from Schrödinger equation is used and solved analytically. The potential profile of n-p-n BJT divided into several segments in the numerical method. Then, the solved analytical result is used in the numerical method to compute the electron transmittance. Transfer Matrix Method (TMM) is the numerical method used to compute the electron transmittance. From the calculated transmittance the tunneling current can be computed by using Landauer formula with aid of Gauss-Legendre Quadrature (GLQ). Next, the tunneling current is computed with several change of variables which are base-emitter voltage (VBE), base-collector voltage (VBC), temperature and the AGNR’s width. The computed tunneling current shows that the larger value of applied voltage for both VBE and VBC results in larger value of tunneling current. At the lower temperature, the current is larger. The computed tunneling current shows that at wider width of AGNR, the current is also larger. This is due to the decreased band-gap energy (Eg) because of the wider width of AGNR.

  4. Magnetic bipolar transistor

    OpenAIRE

    Fabian, Jaroslav; Zutic, Igor; Sarma, S. Das

    2003-01-01

    A magnetic bipolar transistor is a bipolar junction transistor with one or more magnetic regions, and/or with an externally injected nonequilibrium (source) spin. It is shown that electrical spin injection through the transistor is possible in the forward active regime. It is predicted that the current amplification of the transistor can be tuned by spin.

  5. Ion bipolar junction transistors.

    Science.gov (United States)

    Tybrandt, Klas; Larsson, Karin C; Richter-Dahlfors, Agneta; Berggren, Magnus

    2010-06-01

    Dynamic control of chemical microenvironments is essential for continued development in numerous fields of life sciences. Such control could be achieved with active chemical circuits for delivery of ions and biomolecules. As the basis for such circuitry, we report a solid-state ion bipolar junction transistor (IBJT) based on conducting polymers and thin films of anion- and cation-selective membranes. The IBJT is the ionic analogue to the conventional semiconductor BJT and is manufactured using standard microfabrication techniques. Transistor characteristics along with a model describing the principle of operation, in which an anionic base current amplifies a cationic collector current, are presented. By employing the IBJT as a bioelectronic circuit element for delivery of the neurotransmitter acetylcholine, its efficacy in modulating neuronal cell signaling is demonstrated.

  6. Nanofluidic diode and bipolar transistor.

    Science.gov (United States)

    Daiguji, Hirofumi; Oka, Yukiko; Shirono, Katsuhiro

    2005-11-01

    Theoretical modeling of ionic distribution and transport in a nanochannel containing a surface charge on its wall, 30 nm high and 5 microm long, suggests that ionic current can be controlled by locally modifying the surface charge density through a gate electrode, even if the electrical double layers are not overlapped. When the surface charge densities at the right and left halves of a channel are the same absolute value but of different signs, this could form the basis of a nanofluidic diode. When the surface charge density at the middle part of a channel is modified, this could form the basis of a nanofluidic bipolar transistor.

  7. Tunneling field effect transistor technology

    CERN Document Server

    Chan, Mansun

    2016-01-01

    This book provides a single-source reference to the state-of-the art in tunneling field effect transistors (TFETs). Readers will learn the TFETs physics from advanced atomistic simulations, the TFETs fabrication process and the important roles that TFETs will play in enabling integrated circuit designs for power efficiency. · Provides comprehensive reference to tunneling field effect transistors (TFETs); · Covers all aspects of TFETs, from device process to modeling and applications; · Enables design of power-efficient integrated circuits, with low power consumption TFETs.

  8. Bipolar transistor in VESTIC technology: prototype

    Science.gov (United States)

    Mierzwiński, Piotr; Kuźmicz, Wiesław; Domański, Krzysztof; Tomaszewski, Daniel; Głuszko, Grzegorz

    2016-12-01

    VESTIC technology is an alternative for traditional CMOS technology. This paper presents first measurement data of prototypes of VES-BJT: bipolar transistors in VESTIC technology. The VES-BJT is a bipolar transistor on the SOI substrate with symmetric lateral structure and both emitter and collector made of polysilicon. The results indicate that VES-BJT can be a device with useful characteristics. Therefore, VESTIC technology has the potential to become a new BiCMOS-type technology with some unique properties.

  9. Voltage regulator for battery power source. [using a bipolar transistor

    Science.gov (United States)

    Black, J. M. (Inventor)

    1979-01-01

    A bipolar transistor in series with the battery as the control element also in series with a zener diode and a resistor is used to maintain a predetermined voltage until the battery voltage decays to very nearly the predetermined voltage. A field effect transistor between the base of the bipolar transistor and a junction between the zener diode and resistor regulates base current of the bipolar transistor, thereby regulating the conductivity of the bipolar transistor for control of the output voltage.

  10. Magnetoamplification in a bipolar magnetic junction transistor.

    Science.gov (United States)

    Rangaraju, N; Peters, J A; Wessels, B W

    2010-09-10

    We have demonstrated the first bipolar magnetic junction transistor using a dilute magnetic semiconductor. For an InMnAs p-n-p transistor magnetoamplification is observed at room temperature. The observed magnetoamplification is attributed to the magnetoresistance of the magnetic semiconductor InMnAs heterojunction. The magnetic field dependence of the transistor characteristics confirm that the magnetoamplification results from the junction magnetoresistance. To describe the experimentally observed transistor characteristics, we propose a modified Ebers-Moll model that includes a series magnetoresistance attributed to spin-selective conduction. The capability of magnetic field control of the amplification in an all-semiconductor transistor at room temperature potentially enables the creation of new computer logic architecture where the spin of the carriers is utilized.

  11. Radiation Damage In Advanced Bipolar Transistors

    Science.gov (United States)

    Zoutendyk, John A.; Goben, Charles A.; Berndt, Dale F.

    1989-01-01

    Report describes measurements of common-emitter current gains (hFE) of advanced bipolar silicon transistors before, during, and after irradiation with 275-MeV bromine ions, 2.5-MeV electrons, and conductivity rays from cobalt-60 atoms.

  12. Bipolar-FET combinational power transistors for power conversion applications

    Science.gov (United States)

    Chen, D. Y.; Chin, S. A.

    1984-01-01

    Four bipolar-FET (field-effect transistor) combinational transistor configurations are compared from the application point of view. The configurations included are FET-Darlington (cascade), emitter-open switch (cascode), parallel configuration, and FET-gated bipolar transistors (FGT).

  13. Polyphosphonium-based ion bipolar junction transistors.

    Science.gov (United States)

    Gabrielsson, Erik O; Tybrandt, Klas; Berggren, Magnus

    2014-11-01

    Advancements in the field of electronics during the past few decades have inspired the use of transistors in a diversity of research fields, including biology and medicine. However, signals in living organisms are not only carried by electrons but also through fluxes of ions and biomolecules. Thus, in order to implement the transistor functionality to control biological signals, devices that can modulate currents of ions and biomolecules, i.e., ionic transistors and diodes, are needed. One successful approach for modulation of ionic currents is to use oppositely charged ion-selective membranes to form so called ion bipolar junction transistors (IBJTs). Unfortunately, overall IBJT device performance has been hindered due to the typical low mobility of ions, large geometries of the ion bipolar junction materials, and the possibility of electric field enhanced (EFE) water dissociation in the junction. Here, we introduce a novel polyphosphonium-based anion-selective material into npn-type IBJTs. The new material does not show EFE water dissociation and therefore allows for a reduction of junction length down to 2 μm, which significantly improves the switching performance of the ion transistor to 2 s. The presented improvement in speed as well the simplified design will be useful for future development of advanced iontronic circuits employing IBJTs, for example, addressable drug-delivery devices.

  14. Total Dose Effects in Conventional Bipolar Transistors

    Science.gov (United States)

    Johnston, A. H.; Swift, G. W.; Rax, B. G.

    1994-01-01

    This paper examines various factors in bipolar device construction and design, and discusses their impact on radiation hardness. The intent of the paper is to improve understanding of the underlying mechanisms for practical devices without special test structures, and to provide (1) guidance in ways to select transistor designs that are more resistant to radiation damage, and (2) methods to estimate the maximum amount of damage that might be expected from a basic transistor design. The latter factor is extremely important in assessing the risk that future lots of devices will be substantially below design limits, which are usually based on test data for older devices.

  15. Organic tunnel field effect transistors

    KAUST Repository

    Tietze, Max Lutz

    2017-06-29

    Various examples are provided for organic tunnel field effect transistors (OTFET), and methods thereof. In one example, an OTFET includes a first intrinsic layer (i-layer) of organic semiconductor material disposed over a gate insulating layer; source (or drain) contact stacks disposed on portions of the first i-layer; a second i-layer of organic semiconductor material disposed on the first i-layer surrounding the source (or drain) contact stacks; an n-doped organic semiconductor layer disposed on the second i-layer; and a drain (or source) contact layer disposed on the n-doped organic semiconductor layer. The source (or drain) contact stacks can include a p-doped injection layer, a source (or drain) contact layer, and a contact insulating layer. In another example, a method includes disposing a first i-layer over a gate insulating layer; forming source or drain contact stacks; and disposing a second i-layer, an n-doped organic semiconductor layer, and a drain or source contact.

  16. Dose Rate Effects in Linear Bipolar Transistors

    Science.gov (United States)

    Johnston, Allan; Swimm, Randall; Harris, R. D.; Thorbourn, Dennis

    2011-01-01

    Dose rate effects are examined in linear bipolar transistors at high and low dose rates. At high dose rates, approximately 50% of the damage anneals at room temperature, even though these devices exhibit enhanced damage at low dose rate. The unexpected recovery of a significant fraction of the damage after tests at high dose rate requires changes in existing test standards. Tests at low temperature with a one-second radiation pulse width show that damage continues to increase for more than 3000 seconds afterward, consistent with predictions of the CTRW model for oxides with a thickness of 700 nm.

  17. Dielectric Engineered Tunnel Field-Effect Transistor

    OpenAIRE

    Ilatikhameneh, Hesameddin; Ameen, Tarek A.; Klimeck, Gerhard; Appenzeller, Joerg; Rahman, Rajib

    2015-01-01

    The dielectric engineered tunnel field-effect transistor (DE-TFET) as a high performance steep transistor is proposed. In this device, a combination of high-k and low-k dielectrics results in a high electric field at the tunnel junction. As a result a record ON-current of about 1000 uA/um and a subthreshold swing (SS) below 20mV/dec are predicted for WTe2 DE-TFET. The proposed TFET works based on a homojunction channel and electrically doped contacts both of which are immune to interface stat...

  18. Precursor Parameter Identification for Insulated Gate Bipolar Transistor (IGBT) Prognostics

    Data.gov (United States)

    National Aeronautics and Space Administration — Precursor parameters have been identified to enable development of a prognostic approach for insulated gate bipolar transistors (IGBT). The IGBT were subjected to...

  19. Review of Heterojunctin Bipolar Transistor Structure, Applications, and Reliability

    Science.gov (United States)

    Lee, C.; Kayali, S.

    1993-01-01

    Heterojunction Bipolar Transistors (HBTs) are increasingly employed in high frequency, high linerity, and high efficiency applications. As the utilization of these devices becomes more widespread, their operation will be viewed with more scrutiny.

  20. Planar graphene tunnel field-effect transistor

    OpenAIRE

    Katkov, V. L.; Osipov, V. A.

    2013-01-01

    We propose a concept for a graphene tunnel field-effect transistor. The main idea is based on the use of two graphene electrodes with zigzag termination divided by a narrow gap under the influence of the common gate. Our analysis shows that such device will have a pronounced switching effect at low gate voltage and high on/off current ratio at room temperature.

  1. Npn double heterostructure bipolar transistor with ingaasn base region

    Science.gov (United States)

    Chang, Ping-Chih; Baca, Albert G.; Li, Nein-Yi; Hou, Hong Q.; Ashby, Carol I. H.

    2004-07-20

    An NPN double heterostructure bipolar transistor (DHBT) is disclosed with a base region comprising a layer of p-type-doped indium gallium arsenide nitride (InGaAsN) sandwiched between n-type-doped collector and emitter regions. The use of InGaAsN for the base region lowers the transistor turn-on voltage, V.sub.on, thereby reducing power dissipation within the device. The NPN transistor, which has applications for forming low-power electronic circuitry, is formed on a gallium arsenide (GaAs) substrate and can be fabricated at commercial GaAs foundries. Methods for fabricating the NPN transistor are also disclosed.

  2. Advanced insulated gate bipolar transistor gate drive

    Science.gov (United States)

    Short, James Evans [Monongahela, PA; West, Shawn Michael [West Mifflin, PA; Fabean, Robert J [Donora, PA

    2009-08-04

    A gate drive for an insulated gate bipolar transistor (IGBT) includes a control and protection module coupled to a collector terminal of the IGBT, an optical communications module coupled to the control and protection module, a power supply module coupled to the control and protection module and an output power stage module with inputs coupled to the power supply module and the control and protection module, and outputs coupled to a gate terminal and an emitter terminal of the IGBT. The optical communications module is configured to send control signals to the control and protection module. The power supply module is configured to distribute inputted power to the control and protection module. The control and protection module outputs on/off, soft turn-off and/or soft turn-on signals to the output power stage module, which, in turn, supplies a current based on the signal(s) from the control and protection module for charging or discharging an input capacitance of the IGBT.

  3. Two-dimensional bipolar junction transistors

    Science.gov (United States)

    Gharekhanlou, Behnaz; Khorasani, Sina; Sarvari, Reza

    2014-03-01

    Recent development in fabrication technology of planar two-dimensional (2D) materials has introduced the possibility of numerous novel applications. Our recent analysis has revealed that by definition of p-n junctions through appropriate patterned doping of 2D semiconductors, ideal exponential I-V characteristics may be expected. However, the theory of 2D junctions turns out to be very different to that of standard bulk junctions. Based on this theory of 2D diodes, we construct for the first time a model to describe 2D bipolar junction transistors (2D-BJTs). We derive the small-signal equivalent model, and estimate the performance of a 2D-BJT device based on graphone as the example material. A current gain of about 138 and maximum threshold frequency of 77 GHz, together with a power-delay product of only 4 fJ per 1 μm lateral width is expected at an operating voltage of 5 V. In addition, we derive the necessary formulae and a new approximate solution for the continuity equation in the 2D configuration, which have been verified against numerical solutions.

  4. Heterojunction bipolar transistor technology for data acquisition and communication

    Science.gov (United States)

    Wang, C.; Chang, M.; Beccue, S.; Nubling, R.; Zampardi, P.; Sheng, N.; Pierson, R.

    1992-01-01

    Heterojunction Bipolar Transistor (HBT) technology has emerged as one of the most promising technologies for ultrahigh-speed integrated circuits. HBT circuits for digital and analog applications, data conversion, and power amplification have been realized, with speed performance well above 20 GHz. At Rockwell, a baseline AlGaAs/GaAs HBT technology has been established in a manufacturing facility. This paper describes the HBT technology, transistor characteristics, and HBT circuits for data acquisition and communication.

  5. One bipolar transistor selector - One resistive random access memory device for cross bar memory array

    Directory of Open Access Journals (Sweden)

    R. Aluguri

    2017-09-01

    Full Text Available A bipolar transistor selector was connected in series with a resistive switching memory device to study its memory characteristics for its application in cross bar array memory. The metal oxide based p-n-p bipolar transistor selector indicated good selectivity of about 104 with high retention and long endurance showing its usefulness in cross bar RRAM devices. Zener tunneling is found to be the main conduction phenomena for obtaining high selectivity. 1BT-1R device demonstrated good memory characteristics with non-linearity of 2 orders, selectivity of about 2 orders and long retention characteristics of more than 105 sec. One bit-line pull-up scheme shows that a 650 kb cross bar array made with this 1BT1R devices works well with more than 10 % read margin proving its ability in future memory technology application.

  6. One bipolar transistor selector - One resistive random access memory device for cross bar memory array

    Science.gov (United States)

    Aluguri, R.; Kumar, D.; Simanjuntak, F. M.; Tseng, T.-Y.

    2017-09-01

    A bipolar transistor selector was connected in series with a resistive switching memory device to study its memory characteristics for its application in cross bar array memory. The metal oxide based p-n-p bipolar transistor selector indicated good selectivity of about 104 with high retention and long endurance showing its usefulness in cross bar RRAM devices. Zener tunneling is found to be the main conduction phenomena for obtaining high selectivity. 1BT-1R device demonstrated good memory characteristics with non-linearity of 2 orders, selectivity of about 2 orders and long retention characteristics of more than 105 sec. One bit-line pull-up scheme shows that a 650 kb cross bar array made with this 1BT1R devices works well with more than 10 % read margin proving its ability in future memory technology application.

  7. Toward complementary ionic circuits: the npn ion bipolar junction transistor.

    Science.gov (United States)

    Tybrandt, Klas; Gabrielsson, Erik O; Berggren, Magnus

    2011-07-06

    Many biomolecules are charged and may therefore be transported with ionic currents. As a step toward addressable ionic delivery circuits, we report on the development of a npn ion bipolar junction transistor (npn-IBJT) as an active control element of anionic currents in general, and specifically, demonstrate actively modulated delivery of the neurotransmitter glutamic acid. The functional materials of this transistor are ion exchange layers and conjugated polymers. The npn-IBJT shows stable transistor characteristics over extensive time of operation and ion current switch times below 10 s. Our results promise complementary chemical circuits similar to the electronic equivalence, which has proven invaluable in conventional electronic applications.

  8. A gallium phosphide high-temperature bipolar junction transistor

    Science.gov (United States)

    Zipperian, T. E.; Dawson, L. R.; Chaffin, R. J.

    1981-01-01

    Preliminary results are reported on the development of a high temperature (350 C) gallium phosphide bipolar junction transistor (BJT) for geothermal and other energy applications. This four-layer p(+)n(-)pp(+) structure was formed by liquid phase epitaxy using a supercooling technique to insure uniform nucleation of the thin layers. Magnesium was used as the p-type dopant to avoid excessive out-diffusion into the lightly doped base. By appropriate choice of electrodes, the device may also be driven as an n-channel junction field-effect transistor. The initial design suffers from a series resistance problem which limits the transistor's usefulness at high temperatures.

  9. Bipolar Transistors Can Detect Charge in Electrostatic Experiments

    Science.gov (United States)

    Dvorak, L.

    2012-01-01

    A simple charge indicator with bipolar transistors is described that can be used in various electrostatic experiments. Its behaviour enables us to elucidate links between 'static electricity' and electric currents. In addition it allows us to relate the sign of static charges to the sign of the terminals of an ordinary battery. (Contains 7 figures…

  10. Experiments with Charge Indicator Based on Bipolar Transistors

    Science.gov (United States)

    Dvorak, Leos; Planinsic, Gorazd

    2012-01-01

    A simple charge indicator with bipolar transistors described recently enables us to perform a number of experiments suitable for high-school physics. Several such experiments are presented and discussed in this paper as well as some features of the indicator important for its use in schools, namely its sensitivity and robustness, i.e. the…

  11. Modeling of the bipolar transistor under different pulse ionizing radiations

    Science.gov (United States)

    Antonova, A. M.; Skorobogatov, P. K.

    2017-01-01

    This paper describes a 2D model of the bipolar transistor 2T312 under gamma, X-ray and laser pulse ionizing radiations. Both the Finite Element Discretization and Semiconductor module of Comsol 5.1 are used. There is an analysis of energy deposition in this device under different radiations and the results of transient ionizing current response for some different conditions.

  12. Modeling of charge transport in ion bipolar junction transistors.

    Science.gov (United States)

    Volkov, Anton V; Tybrandt, Klas; Berggren, Magnus; Zozoulenko, Igor V

    2014-06-17

    Spatiotemporal control of the complex chemical microenvironment is of great importance to many fields within life science. One way to facilitate such control is to construct delivery circuits, comprising arrays of dispensing outlets, for ions and charged biomolecules based on ionic transistors. This allows for addressability of ionic signals, which opens up for spatiotemporally controlled delivery in a highly complex manner. One class of ionic transistors, the ion bipolar junction transistors (IBJTs), is especially attractive for these applications because these transistors are functional at physiological conditions and have been employed to modulate the delivery of neurotransmitters to regulate signaling in neuronal cells. Further, the first integrated complementary ionic circuits were recently developed on the basis of these ionic transistors. However, a detailed understanding of the device physics of these transistors is still lacking and hampers further development of components and circuits. Here, we report on the modeling of IBJTs using Poisson's and Nernst-Planck equations and the finite element method. A two-dimensional model of the device is employed that successfully reproduces the main characteristics of the measurement data. On the basis of the detailed concentration and potential profiles provided by the model, the different modes of operation of the transistor are analyzed as well as the transitions between the different modes. The model correctly predicts the measured threshold voltage, which is explained in terms of membrane potentials. All in all, the results provide the basis for a detailed understanding of IBJT operation. This new knowledge is employed to discuss potential improvements of ion bipolar junction transistors in terms of miniaturization and device parameters.

  13. Nanowire Tunnel Field Effect Transistors: Prospects and Pitfalls

    OpenAIRE

    Sylvia, Somaia Sarwat

    2014-01-01

    The tunnel field effect transistor (TFET) has the potential to operate at lower voltages and lower power than the field effect transistor (FET). The TFET can circumvent the fundamental thermal limit of the inverse subthreshold slope (S) by exploiting interband tunneling of non-equilibrium "cold" carriers. The conduction mechanism in the TFET is governed by band-to-band tunneling which limits the drive current. TFETs built with III-V materials like InAs and InSb can produce enough tunneling cu...

  14. Asymmetric tunable tunneling magnetoresistance in single-electron transistors

    CERN Document Server

    Pirmann, M; Schön, G

    2000-01-01

    We show that the tunneling magnetoresistance (TMR) of a ferromagnetic single-electron transistor in the sequential tunneling regime shows asymmetric Coulomb blockade oscillations as a function of gate voltage if the individual junction-TMRs differ. The relative amplitude of these oscillations grows significantly if the bias voltage is increased, becoming as large as 30% when the bias voltage is comparable to the charging energy of the single-electron transistor. This might be useful for potential applications requiring a tunable TMR.

  15. Vertical bipolar charge plasma transistor with buried metal layer.

    Science.gov (United States)

    Nadda, Kanika; Kumar, M Jagadesh

    2015-01-19

    A self-aligned vertical Bipolar Charge Plasma Transistor (V-BCPT) with a buried metal layer between undoped silicon and buried oxide of the silicon-on-insulator substrate, is reported in this paper. Using two-dimensional device simulation, the electrical performance of the proposed device is evaluated in detail. Our simulation results demonstrate that the V-BCPT not only has very high current gain but also exhibits high BVCEO · f(T) product making it highly suitable for mixed signal high speed circuits. The proposed device structure is also suitable for realizing doping-less bipolar charge plasma transistor using compound semiconductors such as GaAs, SiC with low thermal budgets. The device is also immune to non-ideal current crowding effects cropping up at high current densities.

  16. InP Heterojunction Bipolar Transistor Amplifiers to 255 GHz

    Science.gov (United States)

    Radisic, Vesna; Sawdai, Donald; Scott, Dennis; Deal, William; Dang, Linh; Li, Danny; Cavus, Abdullah; To, Richard; Lai, Richard

    2009-01-01

    Two single-stage InP heterojunction bipolar transistor (HBT) amplifiers operate at 184 and 255 GHz, using Northrop Grumman Corporation s InP HBT MMIC (monolithic microwave integrated circuit) technology. At the time of this reporting, these are reported to be the highest HBT amplifiers ever created. The purpose of the amplifier design is to evaluate the technology capability for high-frequency designs and verify the model for future development work.

  17. Doping To Reduce Base Resistances Of Bipolar Transistors

    Science.gov (United States)

    Lin, True-Lon

    1991-01-01

    Modified doping profile proposed to reduce base resistance of bipolar transistors. A p/p+ base-doping profile reduces base resistance without reducing current gain. Proposed low/high base-doping profile realized by such low-temperature deposition techniques as molecular-beam epitaxy, ultra-high-vacuum chemical-vapor deposition, and limited-reaction epitaxy. Produces desired doping profiles without excessive diffusion of dopant.

  18. Probing spin-polarized tunneling at high bias and temperature with a magnetic tunnel transistor

    NARCIS (Netherlands)

    Park, B.G.; Banerjee, T.; Min, B.C.; Sanderink, Johannes G.M.; Lodder, J.C.; Jansen, R.

    2005-01-01

    The magnetic tunnel transistor (MTT) is a three terminal hybrid device that consists of a tunnel emitter, a ferromagnetic (FM) base, and a semiconductor collector. In the MTT with a FM emitter and a single FM base, spin-polarized hot electrons are injected into the base by tunneling. After

  19. Implantation-Free 4H-SiC Bipolar Junction Transistors with Double Base Epi-layers

    Science.gov (United States)

    2007-05-14

    junction transistor ( BJT ) which is completely free of ion implantation and hence is free of the implantation- induced crystal damages and high-temperature...Index Terms—Silicon carbide, bipolar junction transistors ( BJTs ), power transistors ...Std Z39-18 I. INTRODUCTION 4H-SiC bipolar junction transistor ( BJT ) is an important switching device for high power and high temperature

  20. ReS2-based interlayer tunnel field effect transistor

    Science.gov (United States)

    Mohammed, Omar B.; Movva, Hema C. P.; Prasad, Nitin; Valsaraj, Amithraj; Kang, Sangwoo; Corbet, Chris M.; Taniguchi, Takashi; Watanabe, Kenji; Register, Leonard F.; Tutuc, Emanuel; Banerjee, Sanjay K.

    2017-12-01

    In this study, we report the fabrication and characterization of a vertical resonant interlayer tunneling field-effect transistor created using exfoliated, few-layer rhenium disulfide (ReS2) flakes as the electrodes and hexagonal boron nitride as the tunnel barrier. Due to the Γ-point conduction band minimum, the ReS2 based system offers the possibility of resonant interlayer tunneling and associated low-voltage negative differential resistance (NDR) without rotational alignment of the electrode crystal orientations. Substantial NDR is observed, which appears consistent with in-plane crystal momentum conserving tunneling, although considerably broadened by scattering consistent within low mobility ReS2 flakes.

  1. Single-event burnout of power bipolar junction transistors

    International Nuclear Information System (INIS)

    Titus, J.L.; Johnson, G.H.; Schrimpf, R.D.; Galloway, K.F.

    1991-01-01

    Experimental evidence of single-event burnout of power bipolar junctions transistors (BJTs) is reported for the first time. Several commercial power BJTs were characterized in a simulated cosmic ray environment using mono-energetic ions at the tandem Van de Graaff accelerator facility at Brookhaven National Laboratory. Most of the device types exposed to this simulated environment exhibited burnout behavior. In this paper the experimental technique, data, and results are presented, while a qualitative model is used to help explain those results and trends observed in this experiment

  2. Theoretical values of various parameters in the Gummel-Poon model of a bipolar junction transistor

    Science.gov (United States)

    Benumof, R.; Zoutendyk, J.

    1986-01-01

    Various parameters in the Gummel-Poon model of a bipolar junction transistor are expressed in terms of the basic structure of a transistor. A consistent theoretical approach is used which facilitates an understanding of the foundations and limitations of the derived formulas. The results enable one to predict how changes in the geometry and composition of a transistor would affect performance.

  3. STRUCTURAL AND TECHNOLOGICAL PARAMETERS AFFECTING THE BIPOLAR STATIC INDUCTION TRANSISTOR (BSIT RESISTANCE

    Directory of Open Access Journals (Sweden)

    T. A. Ismailov

    2016-01-01

    Full Text Available Aim. The aim of the study is to determine the impact of structural and technological parameters on the resistance of the bipolar static induction transistor.Methods. The paper provides a comparative analysis of the advantages of bipolar static induction transistor compared to the bipolar power transistors, MOSFETs and insulated-gate bipolar transistor (IGBT. Considered are structural and technological parameters that influence the resistance of BSIT-transistor.Result. As a result of experimental study on silicon substrates were formed test prototypes of BSIT transistor structure, are presented calculation and experimental works. Obtained are the resistance dependencies of the transistor cell on the thickness of the epitaxial film; the resistance dependencies of BSIT transistor cell on the effective gate length for different values of the impurity concentration in the epitaxial film; dependencies resistance of the transistor cell on the gate length at different values of the epitaxial film thickness; the resistance dependencies of BSIT transistor cell on the distance between the mask for the p-region and the gate; dependencies on the multiplication the cell resistance by its area on the gate length.Conclusion. When increasing the gate length (Lk and the mask length for the p-region (lp + in the transistor structure, the resistance decreases and the dependence of multiplication of the cell resistance by its area Q on the gate length has this case the minimum.

  4. The effects of gamma irradiation on neutron displacement sensitivity of lateral PNP bipolar transistors

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Chenhui, E-mail: wangchenhui@nint.ac.cn; Chen, Wei; Liu, Yan; Jin, Xiaoming; Yang, Shanchao; Qi, Chao

    2016-09-21

    The effects of gamma irradiation on neutron displacement sensitivity of four types of lateral PNP bipolar transistors (LPNPs) with different neutral base widths, emitter widths and the doping concentrations of the epitaxial base region are studied. The physical mechanisms of the effects are explored by defect analysis using deep level transient spectroscopy (DLTS) techniques and numerical simulations of recombination process in the base region of the lateral PNP bipolar transistors, and are verified by the experiments on gate-controlled lateral PNP bipolar transistors (GCLPNPs) manufactured in the identical commercial bipolar process with different gate bias voltage. The results indicate that gamma irradiation increases neutron displacement damage sensitivity of lateral PNP bipolar transistors and the mechanism of this phenomenon is that positive charge induced by gamma irradiation enhances the recombination process in the defects induced by neutrons in the base region, leading to larger recombination component of base current and greater gain degradation.

  5. Bipolar junction transistor models for circuit simulation of cosmic-ray-induced soft errors

    Science.gov (United States)

    Benumof, R.; Zoutendyk, J.

    1984-01-01

    This paper examines bipolar junction transistor models suitable for calculating the effects of large excursions of some of the variables determining the operation of a transistor. Both the Ebers-Moll and Gummel-Poon models are studied, and the junction and diffusion capacitances are evaluated on the basis of the latter model. The most interesting result of this analysis is that a bipolar junction transistor when struck by a cosmic particle may cause a single event upset in an electronic circuit if the transistor is operated at a low forward base-emitter bias.

  6. Low-frequency noise in single electron tunneling transistor

    DEFF Research Database (Denmark)

    Tavkhelidze, A.N.; Mygind, Jesper

    1998-01-01

    The noise in current biased aluminium single electron tunneling (SET) transistors has been investigated in the frequency range of 5 mHz shielding including resistive coaxial lines, that prevents spurious electromagnetic radiation and especially high energy......, we find the same input charge noise, typically QN = 5 × 10–4 e/Hz1/2 at 10 Hz, with and without the HF shielding. At lower frequencies, the noise is due to charge trapping, and the voltage noise pattern superimposed on the V(Vg) curve (voltage across transistor versus gate voltage) strongly depends...

  7. Heterojunction Bipolar Transistor Power Amplifiers for Long-Range X-band Communications Project

    Data.gov (United States)

    National Aeronautics and Space Administration — In this SBIR Phase I project, Vega Wave Systems, Inc. will develop and demonstrate a novel InGaP-GaAs heterojunction bipolar transistor power amplifier for...

  8. Simulation of Heating of an Oil-Cooled Insulated Gate Bipolar Transistors Converter Model

    National Research Council Canada - National Science Library

    Ovrebo, Gregory

    2004-01-01

    I used SolidWorks a three-dimensional modeling software, and FloWorks, a fluid dynamics analysis tool, to simulate oil flow and heat transfer in a heat sink structure attached to three insulated gate bipolar transistors...

  9. Silicon Nanomembrane Bipolar Junction Transistors for Microwave Frequency Applications

    Science.gov (United States)

    Bavier, John; Ballarotto, Vince; Cumings, John

    2014-03-01

    Silicon nanomembranes (SiNMs) are a promising material for flexible semiconductor devices due to their high carrier mobility and compatibility with standard CMOS processing. Previous studies have reported SiNM field-effect transistors with operating frequencies as high as 12 GHz. In order to expand the utility of SiNM devices, a method for the fabrication of monocrystalline microwave frequency silicon bipolar junction transistors (BJTs) will be presented. High-temperature processing of SiNM BJT devices is performed on a Silicon-on-Insulator (SOI) wafer. Using angled ion implantation, conformal chemical vapor deposition and anisotropic reactive ion etching, a poly-silicon sidewall spacer is formed. This spacer defines a base region approximately 200nm wide without the use of electron beam lithography. Devices are then released using selective wet etching in HF and transferred to alternate flexible substrates. Microwave frequency data will be presented, and the effects of the transfer process on device performance will be discussed.

  10. Neutron effects on the electrical and switching characteristics of NPN bipolar power transistors

    Science.gov (United States)

    Frasca, Albert J.; Schwarze, Gene E.

    1988-01-01

    The use of nuclear reactors to generate electrical power for future space missions will require the electrical components used in the power conditioning, control, and transmission subsystem to operate in the associated radiation environments. An initial assessment of neutron irradiation on the electrical and switching characteristics of commercial high power NPN bipolar transistors was investigated. The results clearly show the detrimental effects caused by neutron irradiation on the electrical and switching characteristics of the NPN bipolar power transistor.

  11. Phonon-assisted Zener tunneling in a cylindrical nanowire transistor

    Science.gov (United States)

    Carrillo-Nuñez, H.; Magnus, Wim; Vandenberghe, William G.; Sorée, Bart; Peeters, François M.

    2013-05-01

    The tunneling current has been computed for a cylindrical nanowire tunneling field-effect transistor (TFET) with an all-round gate that covers the source region. Being the underlying mechanism, band-to-band tunneling, mediated by electron-phonon interaction, is pronouncedly affected by carrier confinement in the radial direction and, therefore, involves the self-consistent solution of the Schrödinger and Poisson equations. The latter has been accomplished by exploiting a non-linear variational principle within the framework of the modified local density approximation taking into account the nonparabolicity of both the valence band and conduction band in relatively thick wires. Moreover, while the effective-mass approximation might still provide a reasonable description of the conduction band in relatively thick wires, we have found that the nonparabolicity of the valence band needs to be included. As a major conclusion, it is observed that confinement effects in nanowire tunneling field-effect transistors have a stronger impact on the onset voltage of the tunneling current in comparison with planar TFETs. On the other hand, the value of the onset voltage is found to be overestimated when the valence band nonparabolicity is ignored.

  12. Electrical coupling of single cardiac rat myocytes to field-effect and bipolar transistors.

    Science.gov (United States)

    Kind, Thomas; Issing, Matthias; Arnold, Rüdiger; Müller, Bernt

    2002-12-01

    A novel bipolar transistor for extracellular recording the electrical activity of biological cells is presented, and the electrical behavior compared with the field-effect transistor (FET). Electrical coupling is examined between single cells separated from the heart of adults rats (cardiac myocytes) and both types of transistors. To initiate a local extracellular voltage, the cells are periodically stimulated by a patch pipette in voltage clamp and current clamp mode. The local extracellular voltage is measured by the planar integrated electronic sensors: the bipolar and the FET. The small signal transistor currents correspond to the local extracellular voltage. The two types of sensor transistors used here were developed and manufactured in the laboratory of our institute. The manufacturing process and the interfaces between myocytes and transistors are described. The recordings are interpreted by way of simulation based on the point-contact model and the single cardiac myocyte model.

  13. Complementary vertical bipolar transistor process using high-energy ion implantation

    NARCIS (Netherlands)

    Ragay, F.W.; Ragay, F.W.; Aarnink, Antonius A.I.; Wallinga, Hans

    1991-01-01

    High-energy ion implantation is used as a key processing step in the formation of a complementary bipolar process with both transistor types being vertical. Both n-p-n and p -n-p transistors are made vertically with a deep implanted collector region. Combinations of epitaxial and buried layers are

  14. Nanowire Tunnel Field Effect Transistors: Prospects and Pitfalls

    Science.gov (United States)

    Sylvia, Somaia Sarwat

    The tunnel field effect transistor (TFET) has the potential to operate at lower voltages and lower power than the field effect transistor (FET). The TFET can circumvent the fundamental thermal limit of the inverse subthreshold slope (S) by exploiting interband tunneling of non-equilibrium "cold" carriers. The conduction mechanism in the TFET is governed by band-to-band tunneling which limits the drive current. TFETs built with III-V materials like InAs and InSb can produce enough tunneling current because of their small direct bandgap. Our simulation results show that although they require highly degenerate source doping to support the high electric fields in the tunnel region, the devices achieve minimum inverse subthreshold slopes of 30 mV/dec. In subthreshold, these devices experience both regimes of voltage-controlled tunneling and cold-carrier injection. Numerical results based on a discretized 8-band k.p model are compared to analytical WKB theory. For both regular FETs and TFETs, direct channel tunneling dominates the leakage current when the physical gate length is reduced to 5 nm. Therefore, a survey of materials is performed to determine their ability to suppress the direct tunnel current through a 5 nm barrier. The tunneling effective mass gives the best indication of the relative size of the tunnel currents. Si gives the lowest overall tunnel current for both the conduction and valence band and, therefore, it is the optimum choice for suppressing tunnel current at the 5 nm scale. Our numerical simulation shows that the finite number, random placement, and discrete nature of the dopants in the source of an InAs nanowire (NW) TFET affect both the mean value and the variance of the drive current and the inverse subthreshold slope. The discrete doping model gives an average drive current and an inverse subthreshold slope that are less than those predicted from the homogeneous doping model. The doping density required to achieve a target drive current is

  15. Controlled ion-beam transformation of silicon bipolar microwave power transistor's characteristics

    International Nuclear Information System (INIS)

    Solodukha, V.A.; Snitovskij, Yu.P.

    2015-01-01

    In this article, a method for changing the silicon bipolar microwave power transistor's characteristics in a direct and deliberate manner by modifying the chemical composition at the molybdenum - silicon boundary, the electro-physical properties of molybdenum - silicon contacts, and the electrophysical characteristics of transistor structure areas by the phosphorus ions irradiation of generated ohmic molybdenum - silicon contacts to the transistor emitters is proposed for the first time. The possibilities of this method are investigated and confirmed experimentally. (authors)

  16. Base profile design for high-performance operation of bipolar transistors at liquid-nitrogen temperature

    International Nuclear Information System (INIS)

    Stork, J.M.C.; Harame, D.L.; Meyerson, B.S.; Nguyen, T.N.

    1989-01-01

    The base profile requirements of Si bipolar junction transistors (BJT's) high-performance operation at liquid-nitrogen temperature are examined. Measurements of thin epitaxial-base polysilicon-emitter n-p-n transistors with increasing base doping show the effects of bandgap narrowing, mobility changes, and carrier freezeout. At room temperature the collector current at low injection is proportional to the integrated base charge, independent of the impurity distribution. At temperatures below 150 Κ, however, minority injection is dominated by the peak base doping because of the greater effectiveness of bandgap narrowing. When the peak doping in the base approaches 10 19 cm -3 , the bandgap difference between emitter and base is sufficiently small that the current gain no longer monotonically decreases with lower temperature but instead shows a maximum as low as 180 Κ. The device design window appears limited at the low-current end by increased base-emitter leakage due to tunneling and by resistance control at the high-current end. Using the measured dc characteristics, circuit delay calculations are made to estimate the performance of an ECL ring oscillator at room and liquid-nitrogen temperatures. It is shown that if the base doping can be raised to 10 19 cm -3 while keeping the base thickness constant, the minimum delay at liquid nitrogen can approach the delay of optimized devices at room temperature

  17. Microwave-induced co-tunneling in single electron tunneling transistors

    DEFF Research Database (Denmark)

    Ejrnaes, M.; Savolainen, M.; Manscher, M.

    2002-01-01

    on rubber bellows. Cross-talk was minimized by using individual coaxial lines between the sample and the room temperature electronics: The co-tunneling experiments were performed at zero DC bias current by measuring the voltage response to a very small amplitude 2 Hz current modulation with the gate voltage......The influence of microwaves on the co-tunneling in single electron tunneling transistors has been investigated as function of frequency and power in the temperature range from 150 to 500 mK. All 20 low frequency connections and the RF line were filtered, and the whole cryostat was suspended...

  18. Radiation induced deep level defects in bipolar junction transistors under various bias conditions

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Chaoming; Yang, Jianqun [School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001 (China); Li, Xingji, E-mail: lxj0218@hit.edu.cn [School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001 (China); Ma, Guoliang [School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001 (China); Xiao, Liyi [Department of Astronautics, Harbin Institute of Technology, Harbin 150001 (China); Bollmann, Joachim [Institute of Electronics and Sensor Materials, TU Bergakademie Freiberg, 71691 (Germany)

    2015-12-15

    Bipolar junction transistor (BJT) is sensitive to ionization and displacement radiation effects in space. In this paper, 35 MeV Si ions were used as irradiation source to research the radiation damage on NPN and PNP bipolar transistors. The changing of electrical parameters of transistors was in situ measured with increasing irradiation fluence of 35 MeV Si ions. Using deep level transient spectroscopy (DLTS), defects in the bipolar junction transistors under various bias conditions are measured after irradiation. Based on the in situ electrical measurement and DLTS spectra, it is clearly that the bias conditions can affect the concentration of deep level defects, and the radiation damage induced by heavy ions.

  19. Radiation induced deep level defects in bipolar junction transistors under various bias conditions

    Science.gov (United States)

    Liu, Chaoming; Yang, Jianqun; Li, Xingji; Ma, Guoliang; Xiao, Liyi; Bollmann, Joachim

    2015-12-01

    Bipolar junction transistor (BJT) is sensitive to ionization and displacement radiation effects in space. In this paper, 35 MeV Si ions were used as irradiation source to research the radiation damage on NPN and PNP bipolar transistors. The changing of electrical parameters of transistors was in situ measured with increasing irradiation fluence of 35 MeV Si ions. Using deep level transient spectroscopy (DLTS), defects in the bipolar junction transistors under various bias conditions are measured after irradiation. Based on the in situ electrical measurement and DLTS spectra, it is clearly that the bias conditions can affect the concentration of deep level defects, and the radiation damage induced by heavy ions.

  20. Hetero-gate-dielectric double gate junctionless transistor (HGJLT) with reduced band-to-band tunnelling effects in subthreshold regime

    Science.gov (United States)

    Ghosh, Bahniman; Mondal, Partha; Akram, M. W.; Bal, Punyasloka; Salimath, Akshay Kumar

    2014-06-01

    We propose a hetero-gate-dielectric double gate junctionless transistor (HGJLT), taking high-k gate insulator at source side and low-k gate insulator at drain side, which reduces the effects of band-to-band tunnelling (BTBT) in the sub-threshold region. A junctionless transistor (JLT) is turned off by the depletion of carriers in the highly doped thin channel (device layer) which results in a significant band overlap between the valence band of the channel region and the conduction band of the drain region, due to off-state drain bias, that triggers electrons to tunnel from the valence band of the channel region to the conduction band of the drain region leaving behind holes in the channel. These effects of band-to-band tunnelling increase the sub-threshold leakage current, and the accumulation of holes in the channel forms a parasitic bipolar junction transistor (n-p-n BJT for channel JLT) in the lateral direction by the source (emitter), channel (base) and drain (collector) regions in JLT structure in off-state. The proposed HGJLT reduces the subthreshold leakage current and suppresses the parasitic BJT action in off-state by reducing the band-to-band tunnelling probability.

  1. Comparison between Field Effect Transistors and Bipolar Junction Transistors as Transducers in Electrochemical Sensors

    Science.gov (United States)

    Zafar, Sufi; Lu, Minhua; Jagtiani, Ashish

    2017-01-01

    Field effect transistors (FET) have been widely used as transducers in electrochemical sensors for over 40 years. In this report, a FET transducer is compared with the recently proposed bipolar junction transistor (BJT) transducer. Measurements are performed on two chloride electrochemical sensors that are identical in all details except for the transducer device type. Comparative measurements show that the transducer choice significantly impacts the electrochemical sensor characteristics. Signal to noise ratio is 20 to 2 times greater for the BJT sensor. Sensitivity is also enhanced: BJT sensing signal changes by 10 times per pCl, whereas the FET signal changes by 8 or less times. Also, sensor calibration curves are impacted by the transducer choice. Unlike a FET sensor, the calibration curve of the BJT sensor is independent of applied voltages. Hence, a BJT sensor can make quantitative sensing measurements with minimal calibration requirements, an important characteristic for mobile sensing applications. As a demonstration for mobile applications, these BJT sensors are further investigated by measuring chloride levels in artificial human sweat for potential cystic fibrosis diagnostic use. In summary, the BJT device is demonstrated to be a superior transducer in comparison to a FET in an electrochemical sensor.

  2. Silicon Germanium Heterojunction Bipolar Transistor for Digital Application

    Directory of Open Access Journals (Sweden)

    Engelin Shintadewi Julian

    2012-09-01

    Full Text Available Bipolar transistor performances can be characterized by figures of merit such as cutoff frequency, maximum frequency of oscillation and ECL gate delay. We studied the required figures of merit for digital application and the effects of lateral and vertical scaling to the figures of merit of SiGe HBT. With lateral scaling, the width of emitter finger is scaled down from 0.25 to 0.12 ?m while with the vertical scaling, the base width is scaled down to reduce the base delay. We also observed the effects of Ge profile and Ge fraction to the devices performances. Bipole3 5.3.1G is used to help us in the study. We found that high frequency cutoff and maximum frequency of oscillation as well as low ECL gate delay are all important for digital applications. Scaling down the emitter finger width enhanced the maximum frequency of oscillation and reduced ECL gate delay significantly while scaling down the base width increased the cutoff frequency and current gain.

  3. Wide bandgap collector III-V double heterojunction bipolar transistors

    International Nuclear Information System (INIS)

    Flitcroft, R.M.

    2000-10-01

    This thesis is devoted to the study and development of Heterojunction Bipolar Transistors (HBTs) designed for high voltage operation. The work concentrates on the use of wide bandgap III-V semiconductor materials as the collector material and their associated properties influencing breakdown, such as impact ionisation coefficients. The work deals with issues related to incorporating a wide bandgap collector into double heterojunction structures such as conduction band discontinuities at the base-collector junction and results are presented which detail, a number of methods designed to eliminate the effects of such discontinuities. In particular the use of AlGaAs as the base material has been successful in eliminating the conduction band spike at this interface. A method of electrically injecting electrons into the collector has been employed to investigate impact ionisation in GaAs, GaInP and AlInP which has used the intrinsic gain of the devices to extract impact ionisation coefficients over a range of electric fields beyond the scope of conventional optical injection techniques. This data has enabled the study of ''dead space'' effects in HBT collectors and have been used to develop an analytical model of impact ionisation which has been incorporated into an existing Ebers-Moll HBT simulator. This simulator has been shown to accurately reproduce current-voltage characteristics in both the devices used in this work and for external clients. (author)

  4. Theoretical study of phosphorene tunneling field effect transistors

    Energy Technology Data Exchange (ETDEWEB)

    Chang, Jiwon; Hobbs, Chris [SEMATECH, 257 Fuller Rd #2200, Albany, New York 12203 (United States)

    2015-02-23

    In this work, device performances of tunneling field effect transistors (TFETs) based on phosphorene are explored via self-consistent atomistic quantum transport simulations. Phosphorene is an ultra-thin two-dimensional (2-D) material with a direct band gap suitable for TFETs applications. Our simulation shows that phosphorene TFETs exhibit subthreshold slope below 60 mV/dec and a wide range of on-current depending on the transport direction due to highly anisotropic band structures of phosphorene. By benchmarking with monolayer MoTe{sub 2} TFETs, we predict that phosphorene TFETs oriented in the small effective mass direction can yield much larger on-current at the same on-current/off-current ratio than monolayer MoTe{sub 2} TFETs. It is also observed that a gate underlap structure is required for scaling down phosphorene TFETs in the small effective mass direction to suppress the source-to-drain direct tunneling leakage current.

  5. Low frequency noise in tunneling field effect transistors

    Science.gov (United States)

    Bu, S. T.; Huang, D. M.; Jiao, G. F.; Yu, H. Y.; Li, Ming-Fu

    2017-11-01

    An analytical model is developed for the fluctuation of the electrostatic potential induced by a charged trap in the gate oxide in tunneling field effect transistor (TFET). The model is applied to get the fluctuation of the drain current induced by an interface trap in TFET. A low frequency noise model based on the current transportation through the tunneling and the channel is proposed. The dependency of the normalized power spectra SId/Id2 on the frequency f and the gate bias Vg for TFET is obtained. The noise spectra in TFET are found to be very different from those of conventional MOSFETs, and have the superposition of Lorentzian and 1/f lineshapes with the former associated with tunneling and the later with channel transportation. The potential and current models are compared with TCAD simulation. The calculated IdVg and the noise spectra are also compared with our experimental observations. The results show that the normalized spectra of the current noise due to the tunneling are more significantly affected by Vg than that due to the transportation through the channel. The results also show that the noise from the channel is dominated by the mobility fluctuation rather than the carrier number fluctuation.

  6. Electrical characterization of commercial NPN bipolar junction transistors under neutron and gamma irradiation

    Directory of Open Access Journals (Sweden)

    OO Myo Min

    2014-01-01

    Full Text Available Electronics components such as bipolar junction transistors, diodes, etc. which are used in deep space mission are required to be tolerant to extensive exposure to energetic neutrons and ionizing radiation. This paper examines neutron radiation with pneumatic transfer system of TRIGA Mark-II reactor at the Malaysian Nuclear Agency. The effects of the gamma radiation from Co-60 on silicon NPN bipolar junction transistors is also be examined. Analyses on irradiated transistors were performed in terms of the electrical characteristics such as current gain, collector current and base current. Experimental results showed that the current gain on the devices degraded significantly after neutron and gamma radiations. Neutron radiation can cause displacement damage in the bulk layer of the transistor structure and gamma radiation can induce ionizing damage in the oxide layer of emitter-base depletion layer. The current gain degradation is believed to be governed by the increasing recombination current in the base-emitter depletion region.

  7. Validation of Nonlinear Bipolar Transistor Model by Small-Signal Measurements

    DEFF Research Database (Denmark)

    Vidkjær, Jens; Porra, V.; Zhu, J.

    1992-01-01

    A new method for the validity analysis of nonlinear transistor models is presented based on DC-and small-signal S-parameter measurements and realistic consideration of the measurement and de-embedding errors and singularities of the small-signal equivalent circuit. As an example, some analysis...... results for an extended Gummel Poon model are presented in the case of a UHF bipolar power transistor....

  8. A metal/insulator tunnel transistor with 16 nm channel length

    OpenAIRE

    Sasajima, Ryouta; Fujimaru, Kouji; Matsumura, Hideki

    1999-01-01

    A nanometer transistor, metal/insulator tunnel transistor (MITT), which consists of only metal and insulator is experimentally studied. In the MITT, the Fowler-Nordheim tunneling currents through an insulator in lateral metal/insulator/metal structure are controlled by changing a voltage at a gate electrode upon the middle insulator, due to variation of tunnel-barrier thickness at the insulator. It is demonstrated that the MITT with 16 nm channel length fabricated by conventional photolithogr...

  9. CONDENSED MATTER: ELECTRONIC STRUCTURE, ELECTRICAL, MAGNETIC, AND OPTICAL PROPERTIES: Thermal analytic model of current gain for bipolar junction transistor-bipolar static induction transistor compound device

    Science.gov (United States)

    Zhang, You-Run; Zhang, Bo; Li, Ze-Hong; Lai, Chang-Jin; Li, Zhao-Ji

    2009-02-01

    This paper proposes a thermal analytical model of current gain for bipolar junction transistor-bipolar static induction transistor (BJT-BSIT) compound device in the low current operation. It also proposes a best thermal compensating factor to the compound device that indicates the relationship between the thermal variation rate of current gain and device structure. This is important for the design of compound device to be optimized. Finally, the analytical model is found to be in good agreement with numerical simulation and experimental results. The test results demonstrate that thermal variation rate of current gain is below 10% in 25 °C-85°C and 20% in -55°C-25°C.

  10. Fabrication and characterization of semiconducting nanowires for tunnel field transistors

    Science.gov (United States)

    Vallett, Aaron Lee

    The scaling of traditional metal-oxide-semiconductor field-effect transistors (MOSFETs) is hitting a limit, not due to difficulties in fabricating short gate lengths, but rather to an ongoing power crisis. As channel lengths have been reduced power densities of integrated circuits have risen dramatically. While supply voltage scaling would alleviate many power concerns, the MOSFET structure fundamentally limits the amount that voltages can be reduced. Because MOSFET operation is governed by thermal emission of carriers over a potential barrier, the subthreshold swing from the off to on current is limited to a minimum of 60 mV/decade of current. Therefore, reductions in the supply voltage will degrade the on/off current ratio. The tunnel field-effect transistor (TFET) has emerged as a potential solution to these problems. Current is controlled by band-to-band tunneling through a barrier that is modulated by the gate, and subthreshold swings below 60 mV/dec. can be achieved. While TFET simulations are quite promising, subthreshold swings below 60 mV/dec. at technically relevant on-currents have yet to be demonstrated experimentally. Nanowire geometries and III-V semiconductor channel materials are predicted to improve TFET performance by increasing gate control and tunneling current. In this dissertation the fabrication of TFETs from semiconducting nanowires will be investigated. First, axially doped silicon (Si) nanowire in situ p-n junctions will be studied. By controlling the nanowire growth, separate p and n-type segments can be formed to create a rectifying junction. While as-grown nanowire junctions do not have the abruptness necessary to facilitate band-to-band tunneling, thermally oxidized nanowires are shown to have a p-n-n+ profile with an abrupt n-n+ junction. By gating the nanowires an abrupt electrostatically-doped p +- n+ junction can be formed that permits reverse-biased tunneling. These p-n-n+ nanowires will be integrated into a top-gated lateral TFET

  11. Silicon on insulator bipolar junction transistors for flexible microwave applications

    Science.gov (United States)

    Bavier, John McGoldrick

    Microwave frequency flexible electronic devices require a high quality semiconducting material and a set of fabrication techniques that are compatible with device integration onto flexible polymer substrates. Over the past ten years, monocrystalline silicon nanomembranes (SiNMs) have been studied as a flexible semiconducting material that is compatible with industrial Si processing. Fabricated from commercial silicon on insulator (SOI) wafers, SiNMs can be transferred to flexible substrates using a variety of techniques. Due to their high carrier mobilities, SiNMs are a promising candidate for flexible microwave frequency devices. This dissertation presents fabrication techniques for flexible SiNM devices in general, as well as the progress made towards the development of a microwave frequency SiNM bipolar junction transistor (BJT). In order to overcome previous limitations associated with adhesion, novel methods for transfer printing of metal films and SiNMs are presented. These techniques enable transfer printing of a range of metal films and improve the alignment of small transfer printed SiNM devices. Work towards the development of a microwave frequency BJT on SOI for SiNM devices is also described. Utilizing a self-aligned polysilicon sidewall spacer technique, a BJT with an ultra-narrow base region is fabricated and tested. Two regimes of operation are identified and characterized under DC conditions. At low base currents, devices exhibited forward current gain as high as betaF = 900. At higher base current values, a transconductance of 59 mS was observed. Microwave scattering parameters were obtained for the BJTs under both biasing conditions and compared to unbiased measurements. Microwave frequency gain was not observed. Instead, bias-dependent non-reciprocal behavior was observed and examined. Limitations associated with the microwave impedance-matched electrode configuration are presented. High current densities in the narrow electrodes cause localized

  12. 4H-SiC Power Bipolar Junction Transistor with a Very Low Specific On-resistance of 2.9 mOmega.cm2

    Science.gov (United States)

    2006-04-12

    specific on-resistance (Rsp,on) of power 4H-SiC bipolar junction transistors ( BJT ). A 4H-SiC BJT based on a 12 um drift-layer shows a record low...reported for high power 4H-SiC BJTs . Index Terms—Silicon carbide, bipolar junction transistors ( BJTs ), power transistors ...bipolar junction transistor ( BJT ) is an important switching device for high power and high temperature applications, which is an intrinsically

  13. Bipolar transistor with lateral emitter and collector and method of production

    NARCIS (Netherlands)

    Hueting, Raymond Josephus Engelbart; van den Oever, Leon C.M.

    2016-01-01

    A bipolar transistor includes a substrate of semiconductor material, a high-mobility layer in the substrate, and a donor layer adjacent to the high-mobility layer. An emitter terminal forms an emitter contact on the donor layer, and a collector terminal forms a collector contact on the donor layer.

  14. Using Animation to Improve the Students' Academic Achievement on Bipolar Junction Transistor

    Science.gov (United States)

    Zoabi, W.; Sabag, N.; Gero, A.

    2012-01-01

    Teaching abstract subjects to students studying towards a degree in electronics practical engineering (a degree between a technician and an engineer) requires didactic tools that enable understanding of issues without using advanced mathematics and physics. One basic issue is the BJT (Bipolar Junction Transistor) that requires preliminary…

  15. Modeling of the collector epilayer of a bipolar transistor in the MEXTRAM model

    NARCIS (Netherlands)

    de Graaff, H.C.; de Graaff, H.C.; Kloosterman, W.J.

    1995-01-01

    A new model description for the behaviour of epitaxial collectors in bipolar transistors is given. This is part of MEXTRAM, a compact model for circuit simulation, and it gives the voltage drop and stored minority carrier charge in the collector epilayer as a function of the bias conditions. It

  16. Tunnel field-effect transistor with two gated intrinsic regions

    Directory of Open Access Journals (Sweden)

    Y. Zhang

    2014-07-01

    Full Text Available In this paper, we propose and validate (using simulations a novel design of silicon tunnel field-effect transistor (TFET, based on a reverse-biased p+-p-n-n+ structure. 2D device simulation results show that our devices have significant improvements of switching performance compared with more conventional devices based on p-i-n structure. With independent gate voltages applied to two gated intrinsic regions, band-to-band tunneling (BTBT could take place at the p-n junction, and no abrupt degenerate doping profile is required. We developed single-side-gate (SSG structure and double-side-gate (DSG structure. SSG devices with HfO2 gate dielectric have a point subthreshold swing of 9.58 mV/decade, while DSG devices with polysilicon gate electrode material and HfO2 gate dielectric have a point subthreshold swing of 16.39 mV/decade. These DSG devices have ON-current of 0.255 μA/μm, while that is lower for SSG devices. Having two nano-scale independent gates will be quite challenging to realize with good uniformity across the wafer and the improved behavior of our TFET makes it a promising steep-slope switch candidate for further investigations.

  17. Lateral PNP bipolar transistor with aiding field diffusions

    Science.gov (United States)

    Gallagher, R. C.; Mc Cann, D. H.

    1969-01-01

    Fabrication technique produces field aided lateral PNP transistors compatible with micropower switching circuits. The sub-collector diffusion is performed with phosphorus as the dopant and the epitaxy is grown using the higher temperature silicon tetrachloride process.

  18. Transferred substrate heterojunction bipolar transistors for submillimeter wave applications

    Science.gov (United States)

    Fung, A.; Samoska, L.; Siegel, P.; Rodwell, M.; Urteaga, M.; Paidi, V.

    2003-01-01

    We present ongoing work towards the development of submillimeter wave transistors with goals of realizing advanced high frequency amplifiers, voltage controlled oscillators, active multipliers, and traditional high-speed digital circuits.

  19. Investigation of the Novel Attributes of a Dual Material Gate Nanoscale Tunnel Field Effect Transistor

    OpenAIRE

    Saurabh, Sneh; Kumar, M. Jagadesh

    2011-01-01

    In this paper, we propose the application of a Dual Material Gate (DMG) in a Tunnel Field Effect Transistor (TFET) to simultaneously optimize the on-current, the off-current and the threshold voltage, and also improve the average subthreshold slope, the nature of the output characteristics and the immunity against the DIBL effects. We demonstrate that if appropriate work-functions are chosen for the gate materials on the source side and the drain side, the tunnel field effect transistor shows...

  20. Low-frequency noise behavior of polysilicon emitter bipolar junction transistors: a review

    Science.gov (United States)

    Deen, M. Jamal; Pascal, Fabien

    2003-05-01

    For many analog integrated circuit applications, the polysilicon emitter bipolar junction transistor (PE-BJT) is still the preferred choice because of its higher operational frequency and lower noise performance characteristics compared to MOS transistors of similar active areas and at similar biasing currents. In this paper, we begin by motivating the reader with reasons why bipolar transistors are still of great interest for analog integrated circuits. This motivation includes a comparison between BJT and the MOSFET using a simple small-signal equivalent circuit to derive important parameters that can be used to compare these two technologies. An extensive review of the popular theories used to explain low frequency noise results is presented. However, in almost all instances, these theories have not been fully tested. The effects of different processing technologies and conditions on the noise performance of PE-BJTs is reviewed and a summary of some of the key technological steps and device parameters and their effects on noise is discussed. The effects of temperature and emitter geometries scaling is reviewed. It is shown that dispersion of the low frequency noise in ultra-small geometries is a serious issue since the rate of increase of the noise dispersion is faster than the noise itself as the emitter geometry is scaled to smaller values. Finally, some ideas for future research on PE-BJTs, some of which are also applicable to SiGe heteorjunction bipolar transistors and MOSFETs, are presented after the conclusions.

  1. DEVELOPMENT OF CONTROLLED RECTIFIERS BASED ON THE BIPOLAR WITH STATIC INDUCTION TRANSISTORS (BSIT

    Directory of Open Access Journals (Sweden)

    F. I. Bukashev

    2016-01-01

    Full Text Available Aim. The aim of this study is to develop one of the most perspective semiconductor device suitable for creation and improvement of controlled rectifiers, bipolar static induction transistor.Methods. Considered are the structural and schematic circuit controlled rectifier based on bipolar static induction transistor (BSIT, and the criterion of effectiveness controlled rectifiers - equivalent to the voltage drop.Results. Presented are the study results of controlled rectifier layout on BSIT KT698I. It sets the layout operation at an input voltage of 2.0 V at a frequency up to 750 kHz. The efficiency of the studied layouts at moderate current densities as high as 90 % .Offered is optimization of technological route microelectronic controlled rectifier manufacturing including BSIT and integrated bipolar elements of the scheme management.Conclusion. It is proved that the most efficient use of the bipolar static induction transistor occurs at the low voltage controlled rectifiers 350-400 kHz, at frequencies in conjunction with a low-voltage control circuit.It is proved that the increase of the functional characteristics of the converters is connected to the expansion of the input voltage and output current ranges

  2. The free electron gas primary thermometer using an ordinary bipolar junction transistor approaches ppm accuracy

    Science.gov (United States)

    Mimila-Arroyo, J.

    2017-06-01

    In this paper, it is demonstrated that the free electron gas primary thermometer based on a bipolar junction transistor is able to provide the temperature with an accuracy of a few parts per million. Its simple functioning principle exploits the behavior of the collector current when properly biased to extract the temperature. Using general purpose silicon transistors at the water triple point (273.16 K) and gallium melting point (302.9146), an accuracy of a few parts per million has been reached, constituting the simplest and the easiest to operate primary thermometer, that might be considered even for the redefinition of Kelvin.

  3. Correspondence between Andreev reflection and Klein tunneling in bipolar graphene

    Science.gov (United States)

    Beenakker, C. W. J.; Akhmerov, A. R.; Recher, P.; Tworzydło, J.

    2008-02-01

    The Andreev reflection at a superconductor and the Klein tunneling through an n-p junction in graphene are two processes that couple electrons to holes—the former through the superconducting pair potential Δ and the latter through the electrostatic potential U . We derive that the energy spectra in the two systems are identical at low energies ɛ≪Δ and for an antisymmetric potential profile U(-x,y)=-U(x,y) . This correspondence implies that bipolar junctions in graphene may have zero density of states at the Fermi level and carry a current in equilibrium, analogous to the superconducting Josephson junctions. It also implies that nonelectronic systems with the same band structure as graphene, such as honeycomb-lattice photonic crystals, can exhibit pseudosuperconducting behavior.

  4. Employment Of IGBT-Transistors For Bipolar Impulsed Micro-Arc Oxidation

    Directory of Open Access Journals (Sweden)

    Krainyukov Alexander

    2015-09-01

    Full Text Available The paper is devoted to the use of insulated gate bipolar transistors (IGBT for the micro-arc oxidation (MAO process. The technical requirements to the current switches of power supplies for the pulsed bipolar MAO technology have been developed. The research installation for investigating the IGBT commutation processes during the pulse anode-cathode oxidation has been constructed. The experiments have been performed with its help in order to estimate the possibility of using half-bridge IGBT-modules with different drivers. The research results of the commutation processes investigation for different IGBT half- bridge modules are presented.

  5. Controlled tunnel-coupled ferromagnetic electrodes for spin injection in organic single-crystal transistors

    NARCIS (Netherlands)

    Naber, W.J.M.; Craciun, M.F.; Lemmens, J.H.J.; Arkenbout, A.H.; Palstra, T.T.M.; Morpurgo, A.F.; van der Wiel, Wilfred Gerard

    2010-01-01

    We report on single-crystal rubrene field-effect transistors (FETs) with ferromagnetic Co electrodes, tunnel-coupled to the conduction channel via an Al2O3 tunnel barrier. Magnetic and electronic characterization shows that the Al2O3 film not only protects the Co from undesired oxidation, but also

  6. Controlled tunnel-coupled ferromagnetic electrodes for spin injection in organic single-crystal transistors

    NARCIS (Netherlands)

    Naber, W. J. M.; Craciun, M. F.; Lemmens, J. H. J.; Arkenbout, A. H.; Palstra, T. T. M.; Morpurgo, A. F.; van der Wiel, W. G.

    We report on single-crystal rubrene. eld-effect transistors (FETs) with ferromagnetic Co electrodes, tunnel-coupled to the conduction channel via an Al(2)O(3) tunnel barrier. Magnetic and electronic characterization shows that the Al(2)O(3) film not only protects the Co from undesired oxidation, but

  7. Unified planar process for fabricating heterojunction bipolar transistors and buried-heterostructure lasers utilizing impurity-induced disordering

    Energy Technology Data Exchange (ETDEWEB)

    Thornton, R.L.; Mosby, W.J.; Chung, H.F.

    1988-12-26

    We describe results on a novel geometry of heterojunction bipolar transistor that has been realized by impurity-induced disordering. This structure is fabricated by a method that is compatible with techniques for the fabrication of low threshold current buried-heterostructure lasers. We have demonstrated this compatibility by fabricating a hybrid laser/transistor structure that operates as a laser with a threshold current of 6 mA at room temperature, and as a transistor with a current gain of 5.

  8. The Role of the Silicon Germanium (SiGe) Heterojunction Bipolar Transistor (HBT) in Mobile Technology Platforms

    Science.gov (United States)

    2011-09-01

    1. Comparison of transistor cutoff frequency for a Si BJT and SiGe HBT over time (1...the characteristics of a SiGe HBT, and compares how SiGe fares in the worlds of the GaAs HBT and the Si bipolar junction transistors ( BJT ). 2...supremacy of the Si BJT or field effect transistor (FET) in most applications. These properties include (1) growth of comparably large Si wafers with

  9. Bipolar Junction Transistors in Two-Dimensional WSe2 with Large Current and Photocurrent Gains.

    Science.gov (United States)

    Agnihotri, Pratik; Dhakras, Prathamesh; Lee, Ji Ung

    2016-07-13

    In the development of semiconductor devices, the bipolar junction transistor (BJT) features prominently as being the first solid state transistor that helped to usher in the digital revolution. For any new semiconductor, therefore, the fabrication and characterization of the BJT are important for both technological importance and historical significance. Here, we demonstrate a BJT device in exfoliated TMD semiconductor WSe2. We use buried gates to electrostatically create doped regions with back-to-back p-n junctions. We demonstrate two central characteristics of a bipolar device: current gain when operated as a BJT and a photocurrent gain when operated as a phototransistor. We demonstrate a current gain of 1000 and photocurrent gain of 40 and describe features that enhance these properties due to the doping technique that we employ.

  10. Thermal Simulation of Switching Pulses in an Insulated Gate Bipolar Transistor (IGBT) Power Module

    Science.gov (United States)

    2015-02-01

    prepared with SolidWorks computer-aided design software. The module has 8 silicon IGBTs mounted on copper (Cu) lands bonded onto a dielectric circuit...aluminum nitride ARL US Army Research Laboratory Cu copper IGBT insulated gate bipolar transistor ms millisecond 3D 3-dimensional W watt...RDRL CIO LL TECHL LIB 1 GOVT PRNTG OFC (PDF) ATTN A MALHOTRA 5 US ARMY RSRCH LAB (PDF) ATTN RDRL SED C W TIPTON ATTN RDRL SED P D

  11. Experimental DC extraction of the thermal resistance of bipolar transistors taking into account the Early effect

    Science.gov (United States)

    d'Alessandro, Vincenzo

    2017-01-01

    This paper presents three methods to experimentally extract the thermal resistance of bipolar transistors taking into account the Early effect. The approaches are improved variants of recently-proposed techniques relying on common-base DC measurements. The accuracy is numerically verified by making use of a compact model calibrated on I-V characteristics of state-of-the-art SOG BJTs and SiGe:C HBTs.

  12. Verification of the Simultaneous Local Extraction Method of Base and Thermal Resistance of Bipolar Transistors

    OpenAIRE

    Robert Setekera; Luuk Tiemeijer; Ramses van der Toorn

    2014-01-01

    In this paper an extensive verification of the extraction method (published earlier) that consistently accounts for self-heating and Early effect to accurately extract both base and thermal resistance of bipolar junction transistors is presented. The method verification is demonstrated on advanced RF SiGe HBTs were the extracted results for the thermal resistance are compared with those from another published method that ignores the effect of Early effect on internal base...

  13. Atomic-Monolayer MoS2 Band-to-Band Tunneling Field-Effect Transistor

    KAUST Repository

    Lan, Yann Wen

    2016-09-05

    The experimental observation of band-to-band tunneling in novel tunneling field-effect transistors utilizing a monolayer of MoS2 as the conducting channel is demonstrated. Our results indicate that the strong gate-coupling efficiency enabled by two-dimensional materials, such as monolayer MoS2, results in the direct manifestation of a band-to-band tunneling current and an ambipolar transport.

  14. Low-threshold amplitude discriminator circuit with tunnel diode and two transistors in differential connection

    International Nuclear Information System (INIS)

    Ryba, J.; Volny, J.

    1973-01-01

    The connection is designed of a low-threshold amplitude discriminator and a tunnel diode with two transistors in differential connection. The discriminator is by its simple connection, its low consumption and high temperature stability suitable especially for portable radiation detectors. The tunnel diode is connected by one pole to a collector clamp and by the other to the supply voltage. A suitable resistor is connected in parallel with the tunnel diode to meet demands for higher sensitivity. (Z.S.)

  15. Experimental Analysis of Proton-Induced Displacement and Ionization Damage Using Gate-Controlled Lateral PNP Bipolar Transistors

    Science.gov (United States)

    Ball, D. R.; Schrimpf, R. D.; Barnaby, H. J.

    2006-01-01

    The electrical characteristics of proton-irradiated bipolar transistors are affected by ionization damage to the insulating oxide and displacement damage to the semiconductor bulk. While both types of damage degrade the transistor, it is important to understand the mechanisms individually and to be able to analyze them separately. In this paper, a method for analyzing the effects of ionization and displacement damage using gate-controlled lateral PNP bipolar junction transistors is described. This technique allows the effects of oxide charge, surface recombination velocity, and bulk traps to be measured independently.

  16. Tuning the tunneling probability by mechanical stress in Schottky barrier based reconfigurable nanowire transistors

    Science.gov (United States)

    Baldauf, Tim; Heinzig, André; Trommer, Jens; Mikolajick, Thomas; Weber, Walter Michael

    2017-02-01

    Mechanical stress is an established and important tool of the semiconductor industry to improve the performance of modern transistors. It is well understood for the enhancement of carrier mobility but rather unexplored for the control of the tunneling probability for injection dominated research devices based on tunneling phenomena, such as tunnel FETs, resonant tunnel FETs and reconfigurable Schottky FETs. In this work, the effect of stress on the tunneling probability and overall transistor characteristics is studied by three-dimensional device simulations in the example of reconfigurable silicon nanowire Schottky barrier transistors using two independently gated Schottky junctions. To this end, four different stress sources are investigated. The effects of mechanical stress on the average effective tunneling mass and on the multi-valley band structure applying the deformation potential theory are being considered. The transfer characteristics of strained transistors in n- and p-configuration and corresponding charge carrier tunneling are analyzed with respect to the current ratio between electron and hole conduction. For the implementation of these devices into complementary circuits, the mandatory current ratio of unity can be achieved by appropriate mechanical stress either by nanowire oxidation or the application of a stressed top layer.

  17. Bipolar single-wall carbon nanotube field-effect transistor

    OpenAIRE

    Babic, Bakir; Iqbal, Mahdi; Schonenberger, Christian

    2002-01-01

    We use a simultaneous flow of ethylene and hydrogen gases to grow single wall carbon nanotubes by chemical vapor deposition. Strong coupling to the gate is inferred from transport measurements for both metallic and semiconducting tubes. At low-temperatures, our samples act as single-electron transistors where the transport mechanism is mainly governed by Coulomb blockade. The measurements reveal very rich quantized energy level spectra spanning from valence to conduction band. The Coulomb dia...

  18. GaAs vapor-grown bipolar transistors.

    Science.gov (United States)

    Nuese, C. J.; Gannon, J. J.; Dean, R. H.; Gossenberger, H. F.; Enstrom, R. E.

    1972-01-01

    Discussion of an approach for the fabrication of high-temperature GaAs transistors which is centered on the preparation of n-p-n three-layered structures entirely by a vapor-phase growth technique, as described by Tietjen and Amick (1966). The low growth temperature of approximately 750 C is thought to reduce contamination during crystal growth and to contribute to the reasonably high minority-carrier lifetimes obtained for the vapor-grown p-n junctions. The fact that impurity concentrations and layer thicknesses can be precisely controlled for epitaxial layers as thin as 1 micrometer is an important feature of this growth technique.

  19. Simulation of nanowire tunneling transistors: From the Wentzel-Kramers-Brillouin approximation to full-band phonon-assisted tunneling

    Science.gov (United States)

    Luisier, Mathieu; Klimeck, Gerhard

    2010-04-01

    Nanowire band-to-band tunneling field-effect transistors (TFETs) are simulated using the Wentzel-Kramers-Brillouin (WKB) approximation and an atomistic, full-band quantum transport solver including direct and phonon-assisted tunneling (PAT). It is found that the WKB approximation properly works if one single imaginary path connecting the valence band (VB) and the conduction band (CB) dominates the tunneling process as in direct band gap semiconductors. However, PAT is essential in Si and Ge nanowire TFETs where multiple, tightly-coupled, imaginary paths exist between the VB and the CB.

  20. Optical driven electromechanical transistor based on tunneling effect.

    Science.gov (United States)

    Jin, Leisheng; Li, Lijie

    2015-04-15

    A new electromechanical transistor based on an optical driven vibrational ring structure has been postulated. In the device, optical power excites the ring structure to vibrate, which acts as the shuttle transporting electrons from one electrode to the other forming the transistor. The electrical current of the transistor is adjusted by the optical power. Coupled opto-electro-mechanical simulation has been performed. It is shown from the dynamic analysis that the stable working range of the transistor is much wider than that of the optical wave inside the cavity, i.e., the optical resonance enters nonperiodic states while the mechanical vibration of the ring is still periodic.

  1. Two Dimensional Modeling of III-V Heterojunction Gate All Around Tunnel Field Effect Transistor

    OpenAIRE

    Manjula Vijh; R.S. Gupta; Sujata Pandey

    2017-01-01

    Tunnel Field Effect Transistor is one of the extensively researched semiconductor devices, which has captured attention over the conventional Metal Oxide Semiconductor Field Effect Transistor. This device, due to its varied advantages, is considered in applications where devices are scaled down to deep sub-micron level. Like MOSFETs, many geometries of TFETs have been studied and analyzed in the past few years. This work, presents a two dimensional analytical model for a III-V Heterojunction ...

  2. Effect of edge vacancies on performance of planar graphene tunnel field-effect transistor

    OpenAIRE

    Glebov, A. A.; Katkov, V. L.; Osipov, V. A.

    2017-01-01

    The influence of edge vacancies on the working ability of the planar graphene tunnel field-effect transistor (TFET) is studied at various concentrations and distributions (normal, uniform, periodic) of defects. All calculations are performed by using the Green's function method and the tight-binding approximation. It is shown that the transistor performance depends critically on two important factors associated with the defects: the destruction of the edge-localized electronic states and the ...

  3. High Current Density InAsSb/GaSb Tunnel Field Effect Transistors

    OpenAIRE

    Dey, Anil; Borg, Mattias; Ganjipour, Bahram; Ek, Martin; Dick Thelander, Kimberly; Lind, Erik; Nilsson, Peter; Thelander, Claes; Wernersson, Lars-Erik

    2012-01-01

    Steep-slope devices, such as tunnel field-effect transistors (TFETs), have recently gained interest due to their potential for low power operation at room temperature. The devices are based on inter-band tunneling which could limit the on-current since the charge carriers must tunnel through a barrier to traverse the device. The InAs/GaSb heterostructure forms a broken type II band alignment which enables inter-band tunneling without a barrier, allowing high on-currents. We ha...

  4. Silicon Tunneling Field Effect Transistors with a Hemicylindrical Nanowire Channel for Ultra-Low Power Application

    Science.gov (United States)

    Park, Byung-Gook; Sun, Min-Chul; Kim, Sang Wan

    In order to decrease the threshold voltage while maintaining the OFF current low, reduction of the subthreshold swing is essential in field effect transistors (FETs). To reduce the subthreshold swing below 60 mV/decade, inter-band tunneling can be used for injection of carriers and the device that utilizes such a mechanism is tunneling field effect transistor (TFET). Silicon(Si) TFETs, which are favored due to their compatibility with currently dominant complementary metal-oxide-semiconductor (CMOS) technology, suffer from low ON current because of the relatively large bandgap of Si. The ON current of Si TFETs can be increased by field and area enhancement in a cylindrical nanowire channel. Numerical analysis has confirmed that the cylindrical channel structure shows significantly higher tunneling rate and wider tunneling area than the double gate structure. Si TFETs with a hemicylindrical nanowire channel are fabricated and characterized, and the effectiveness of nanowire channel approach is demonstrated.

  5. Band-to-Band Tunneling Transistors: Scalability and Circuit Performance

    Science.gov (United States)

    2013-05-01

    55* MEDICI ...3.2.1 Tunneling Theory 3.3 Simulation Methods 3.3.1 MEDICI 3.3.2 Sentaurus Local Tunneling 3.3.3 Sentaurus Nonlocal Tunneling 3.4 Sentaurus...tunneling current. 3.3.1 MEDICI MEDICI is a one and two-dimensional simulator created by Synopsys, Inc. [18]. It contains a band-to-band

  6. Ferroelectric-Driven Performance Enhancement of Graphene Field-Effect Transistors Based on Vertical Tunneling Heterostructures.

    Science.gov (United States)

    Yuan, Shuoguo; Yang, Zhibin; Xie, Chao; Yan, Feng; Dai, Jiyan; Lau, Shu Ping; Chan, Helen L W; Hao, Jianhua

    2016-12-01

    A vertical graphene heterostructure field-effect transistor (VGHFET) using an ultrathin ferroelectric film as a tunnel barrier is developed. The heterostructure is capable of providing new degrees of tunability and functionality via coupling between the ferroelectricity and the tunnel current of the VGHFET, which results in a high-performance device. The results pave the way for developing novel atomic-scale 2D heterostructures and devices. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  7. Ionizing radiation effects on conduction and low frequency noise in bipolar transistors

    International Nuclear Information System (INIS)

    Blasquez, G.; Roux-Nogatchewsky, M.

    1980-01-01

    Gate controlled NPN bipolar transistors were irradiated with doses ranging between 10 and 10 4 Gy X rays supplied by a generator functioning at 150 kV. An increase of great amplitude of the base current and of the low frequency noise were observed for both depleted and inverted base surface conditions. It has been shown that these increases were due to the enhancement of the total surface recombination velocity, of the positive charge within the oxide and also of the density of noise traps. Positive correlations were observed between these three surface parameters. These results have been attributed to the ionization of silica by X rays. The transistors partially recovered by means of thermal treatments. It has been suggested that it does not exist specific hardening methods to minimize the noise sensitivity to irradiation [fr

  8. Anomalous dose rate effects in gamma irradiated SiGe heterojunction bipolar transistors

    International Nuclear Information System (INIS)

    Banerjee, G.; Niu, G.; Cressler, J.D.; Clark, S.D.; Palmer, M.J.; Ahlgren, D.C.

    1999-01-01

    Low dose rate (LDR) cobalt-60 (0.1 rad(Si)/s) gamma irradiated Silicon Germanium (SiGe) Heterojunction Bipolar Transistors (HBTs) were studied. Comparisons were made with devices irradiated with 300 rad(Si)/s gamma radiation to verify if LDR radiation is a serious radiation hardness assurance (RHA) issue. Almost no LDR degradation was observed in this technology up to 50 krad(Si). The assumption of the presence of two competing mechanisms is justified by experimental results. At low total dose (le20 krad), an anomalous base current decrease was observed which is attributed to self-annealing of deep-level traps to shallower levels. An increase in base current at larger total doses is attributed to radiation induced generation-recombination (G/R) center generation. Experiments on gate-assisted lateral PNP transistors and 2D numerical simulations using MEDICI were used to confirm these assertions

  9. Performance enhancement of a heterojunction bipolar transistor (HBT) by two-step passivation

    International Nuclear Information System (INIS)

    Fu, S.-I.; Lai, P.-H.; Tsai, Y.-Y.; Hung, C.-W.; Yen, C.-H.; Cheng, S.-Y.; Liu, W.-C.

    2006-01-01

    An interesting two-step passivation (with ledge structure and sulphide based chemical treatment) on base surface, for the first time, is demonstrated to study the temperature-dependent DC characteristics and noise performance of an InGaP/GaAs heterojunction bipolar transistor (HBT). Improved transistor behaviors on maximum current gain β max , offset voltage ΔV CE , and emitter size effect are obtained by using the two-step passivation. Moreover, the device with the two-step passivation exhibits relatively temperature-independent and improved thermal stable performances as the temperature is increased. Therefore, the two-step passivationed device can be used for high-temperature and low-power electronics applications

  10. Gamma Irradiation Performance Tests of the Bipolar Junction Transistor (BJT) for Medical Dosimetry Purposes

    Energy Technology Data Exchange (ETDEWEB)

    Nazififard, Mohammad; Suh, Kune Y. [PHILOSOPHIA, Inc., Seoul (Korea, Republic of); Faghihi, Reyhaneh [Kashan Univ. of Medical Science, Kashan (Iran, Islamic Republic of); Norov, Enkhbat [POSTECH, Pohang (Korea, Republic of)

    2014-05-15

    Two basic radiation damage mechanisms may affect semiconductor devices which are Displacement damage and Ionization damage. In displacement damage mechanism, the incident radiation displaces silicon atoms from their lattice sites. The resulting defects alter the electronic characteristics of the crystal. In ionization damage mechanism, the absorbed energy by electronic ionization in insulating layers liberates charge carriers, which diffuse or drift to other locations where they are trapped, leading to unintended concentrations of charge and, as a consequence, parasitic fields. Both mechanisms are important in detectors, transistors and integrated circuits. Hardly a system is immune to either one phenomenon and most are sensitive to both. This paper investigates the behavior of Bipolar Junction Transistors (BJTs), exposed to radiation in order to establish their applicability in a radiation environment.

  11. Electrical determination of the bandgap energies of the emitter and base regions of bipolar junction transistors

    Science.gov (United States)

    Mimila-Arroyo, J.

    2016-10-01

    A pure electrical method is presented to extract emitter and base bandgaps of a bipolar junction transistor (BJT) at the locations where the minority carrier injection takes place. It is based on the simultaneous measurement of the collector and base currents as a function of the emitter-base forward bias (Gummer plot) and the corresponding current gain. From the obtained saturation currents as a function of temperature, we extract the bandgap energies. The accuracy of the method is demonstrated for InGaP-GaAs, Si, and Ge commercial devices. For InGaP-GaAs transistors, the results can be understood if the emitter-base heterojunction is not an abrupt but a gradual one. The presented method is a reliable tool that can aid in the development of new compound semiconductor based BJTs whose bandgap energies are highly sensitive to their composition.

  12. Origin of 1/f PM and AM noise in bipolar junction transistor amplifiers.

    Science.gov (United States)

    Walls, F L; Ferre-Pikal, E S; Jefferts, S R

    1997-01-01

    In this paper we report the results of extensive research on phase modulation (PM) and amplitude modulation (AM) noise in linear bipolar junction transistor (BJT) amplifiers. BJT amplifiers exhibit 1/f PM and AM noise about a carrier signal that is much larger than the amplifiers thermal noise at those frequencies in the absence of the carrier signal. Our work shows that the 1/f PM noise of a BJT based amplifier is accompanied by 1/f AM noise which can be higher, lower, or nearly equal, depending on the circuit implementation. The 1/f AM and PM noise in BJTs is primarily the result of 1/f fluctuations in transistor current, transistor capacitance, circuit supply voltages, circuit impedances, and circuit configuration. We discuss the theory and present experimental data in reference to common emitter amplifiers, but the analysis can be applied to other configurations as well. This study provides the functional dependence of 1/f AM and PM noise on transistor parameters, circuit parameters, and signal frequency, thereby laying the groundwork for a comprehensive theory of 1/f AM and PM noise in BJT amplifiers. We show that in many cases the 1/f PM and AM noise can be reduced below the thermal noise of the amplifier.

  13. T-shaped emitter metal heterojunction bipolar transistors for submillimeter wave applications

    Science.gov (United States)

    Fung, Andy; Samoska, Lorene; Velebir, Jim; Siege, Peter; Rodwell, Mark; Paidi, Vamsi; Griffth, Zach; Urteaga, Miguel; Malik, Roger

    2004-01-01

    We report on the development of submillimeter wave transistors at JPL. The goal of the effort is to produce advance-reliable high frequency and high power amplifiers, voltage controlled oscillators, active multipliers, and high-speed mixed-signal circuits for space borne applications. The technology in development to achieve this is based on the Indium Phosphide (InP) Heterojunction Bipolar Transistor (HBT). The HBT is well suited for high speed, high power and uniform (across wafer) performance, due to the ability to tailor the material structure that electrons traverse through by well-controlled epitaxial growth methods. InP with its compatible lattice matched alloys such as indium gallium arsenide (InGaAs) and indium aluminium arsenide (InAlAs) provides for high electron velocities and high voltage breakdown capabilities. The epitaxial methods for this material system are fairly mature, however the implementation of high performance and reliable transistors are still under development by many laboratories. Our most recently fabricated, second generation mesa HBTs at JPL have extrapolated current gain cutoff frequency (FJ of 142GHz and power gain cutoff frequency (Fm,) of approximately 160GHz. This represents a 13% and 33% improvement of Ft and F, respectively, compared to the first generation mesa HBTs [l]. Analysis based on the University of California, Santa Barbara (UCSB) device model, RF device characteristics can be significantly improved by reducing base contact resistance and base metal contact width. We will describe our effort towards increasing transistor performance and yield.

  14. Improved Model for Increased Surface Recombination Current in Irradiated Bipolar Junction Transistors

    Science.gov (United States)

    Barnaby, H. J.; Vermeire, B.; Campola, M. J.

    2015-08-01

    Current gain degradation in irradiated bipolar junction transistors is primarily due to excess base current caused by enhanced carrier recombination in the emitter-base space-charge region (SCR). Radiation-induced traps at the interface between silicon and the bipolar base oxide facilitate the recombination process primarily above the sensitive emitter-base junction. This leads to an increase in surface recombination current in the SCR, which is a non-ideal component of the BJT's base current characteristic under active bias conditions. In this paper, we derive a precise analytical model for surface recombination current that captures bias dependencies typically omitted from traditional models. This improved model is validated by comparisons to these traditional approaches.

  15. ESTIMATION OF THERMAL PARAMETERS OF POWER BIPOLAR TRANSISTORS BY THE METHOD OF THERMAL RELAXATION DIFFERENTIAL SPECTROMETRY

    Directory of Open Access Journals (Sweden)

    V. S. Niss

    2015-01-01

    Full Text Available Thermal performance of electronic devices determines the stability and reliability of the equipment. This leads to the need for a detailed thermal analysis of semiconductor devices. The goal of the work is evaluation of thermal parameters of high-power bipolar transistors in plastic packages TO-252 and TO-126 by a method of thermal relaxation differential spectrometry. Thermal constants of device elements and distribution structure of thermal resistance defined as discrete and continuous spectra using previously developed relaxation impedance spectrometer. Continuous spectrum, based on higher-order derivatives of the dynamic thermal impedance, follows the model of Foster, and discrete to model of Cauer. The structure of sample thermal resistance is presented in the form of siх-chain electro-thermal RC model. Analysis of the heat flow spreading in the studied structures is carried out on the basis of the concept of thermal diffusivity. For transistor structures the area and distribution of the heat flow cross-section are determined. On the basis of the measurements the thermal parameters of high-power bipolar transistors is evaluated, in particular, the structure of their thermal resistance. For all of the measured samples is obtained that the thermal resistance of the layer planting crystal makes a defining contribution to the internal thermal resistance of transistors. In the transition layer at the border of semiconductor-solder the thermal resistance increases due to changes in the mechanism of heat transfer. Defects in this area in the form of delamination of solder, voids and cracks lead to additional growth of thermal resistance caused by the reduction of the active square of the transition layer. Method of thermal relaxation differential spectrometry allows effectively control the distribution of heat flow in high-power semiconductor devices, which is important for improving the design, improve the quality of landing crystals of power

  16. Evaluation of Enhanced Low Dose Rate Sensitivity in Discrete Bipolar Junction Transistors

    Science.gov (United States)

    Chen, Dakai; Ladbury Raymond; LaBel, Kenneth; Topper, Alyson; Ladbury, Raymond; Triggs, Brian; Kazmakites, Tony

    2012-01-01

    We evaluate the low dose rate sensitivity in several families of discrete bipolar transistors across device parameter, quality assurance level, and irradiation bias configuration. The 2N2222 showed the most significant low dose rate sensitivity, with low dose rate enhancement factor of 3.91 after 100 krad(Si). The 2N2907 also showed critical degradation levels. The devices irradiated at 10 mrad(Si)/s exceeded specifications after 40 and 50 krad(Si) for the 2N2222 and 2N2907 devices, respectively.

  17. Development of 8-inch Key Processes for Insulated-Gate Bipolar Transistor

    Directory of Open Access Journals (Sweden)

    Guoyou Liu

    2015-09-01

    Full Text Available Based on the construction of the 8-inch fabrication line, advanced process technology of 8-inch wafer, as well as the fourth-generation high-voltage double-diffused metal-oxide semiconductor (DMOS+ insulated-gate bipolar transistor (IGBT technology and the fifth-generation trench gate IGBT technology, have been developed, realizing a great-leap forward technological development for the manufacturing of high-voltage IGBT from 6-inch to 8-inch. The 1600 A/1.7 kV and 1500 A/3.3 kV IGBT modules have been successfully fabricated, qualified, and applied in rail transportation traction system.

  18. Terahertz emission from collapsing field domains during switching of a gallium arsenide bipolar transistor.

    Science.gov (United States)

    Vainshtein, Sergey; Kostamovaara, Juha; Yuferev, Valentin; Knap, Wojciech; Fatimy, Abdel; Diakonova, Nina

    2007-10-26

    Broadband pulsed THz emission with peak power in the sub-mW range has been observed experimentally during avalanche switching in a gallium arsenide bipolar junction transistor at room temperature, while significantly higher total generated power is predicted in simulations. The emission is attributed to very fast oscillations in the conductivity current across the switching channels, which appear as a result of temporal evolution of the field domains generated in highly dense electron-hole plasma. This plasma is formed in turn by powerful impact ionization in multiple field domains of ultrahigh amplitude.

  19. Total dose and dose rate models for bipolar transistors in circuit simulation.

    Energy Technology Data Exchange (ETDEWEB)

    Campbell, Phillip Montgomery; Wix, Steven D.

    2013-05-01

    The objective of this work is to develop a model for total dose effects in bipolar junction transistors for use in circuit simulation. The components of the model are an electrical model of device performance that includes the effects of trapped charge on device behavior, and a model that calculates the trapped charge densities in a specific device structure as a function of radiation dose and dose rate. Simulations based on this model are found to agree well with measurements on a number of devices for which data are available.

  20. Laser Pulse Tests of Bipolar Junction Transistors (BJTs) for SET Analysis

    Science.gov (United States)

    Daniel, C.; Plettner, C.; Poivey, C.; Schuttauf, A.; Tonicello, F.; Triggianese, M.

    2014-08-01

    In order to study the Single Event Transient (SET) sensitivity of discrete bipolar junction transistors, laser tests conducted at EADS Innovation Works in Sureness are presented and discussed. A number of different BJT samples have been tested in different operating conditions. The tests demonstrate that: discrete BJTs are indeed sensitive to collected charge; the most sensitive region is the collector/base junctions and that the different internal structure gives different SET shapes. We present measurements, simulation and comparison for SET modeled in PSPICE and tested with a laser.

  1. Bias dependence of synergistic radiation effects induced by electrons and protons on silicon bipolar junction transistors

    Science.gov (United States)

    Liu, Chaoming; Li, Xingji; Yang, Jianqun; Ma, Guoliang; Xiao, Liyi

    2015-06-01

    Bias dependence on synergistic radiation effects caused by 110 keV electrons and 170 keV protons on the current gain of 3DG130 NPN bipolar junction transistors (BJTs) is studied in this paper. Experimental results indicate that the influence induced by 170 keV protons is always enhancement effect during the sequential irradiation. However, the influence induced by 110 keV electrons on the BJT under various bias cases is different during the sequential irradiation. The transition fluence of 110 keV electrons is dependent on the bias case on the emitter-base junction of BJT.

  2. Optimization of base-to-emitter spacer thickness to maximize the frequency response of bipolar transistors

    Science.gov (United States)

    Lee, Wai-Kit; Chan, Alain C. K.; Chan, Mansun

    2005-04-01

    The impacts of base-to-emitter spacer thickness on the unity gain frequency ( fT), base resistance ( rB), base collector capacitance ( CBC) and maximum oscillation frequency ( fmax) of a bipolar junction transistor (BJT) are studied. Using the extracted Y-parameters from a simulated device with structural parameters calibrated to an actual process, the resulting fT and fmax with different spacer thickness is reported. A tradeoff between peak fT and fmax is observed and the process window to obtain high fT and fmax is proposed.

  3. Separation of ionization and displacement damage using gate-controlled lateral PNP bipolar transistors

    Science.gov (United States)

    Ball, D. R.; Schrimpf, R. D.; Barnaby, H. J.

    2002-12-01

    Proton irradiation produces both ionization and displacement damage in semiconductor devices. In this paper, a technique for separating the effects of these two types of damage using a lateral PNP bipolar transistor with a gate contact over the active base region is described. By biasing the gate appropriately, the effects of ionization-induced damage are minimized and the effects of displacement damage can be measured independently. Experiments and simulations are used to validate this approach and provide insight into proton-induced BJT degradation.

  4. Bipolar redox behaviour, field-effect mobility and transistor switching of the low-molecular azo glass AZOPD.

    Science.gov (United States)

    Arlt, Michael; Scheffler, Ayna; Suske, Irina; Eschner, Michael; Saragi, Tobat P I; Salbeck, Josef; Fuhrmann-Lieker, Thomas

    2010-11-07

    We present electrochemical and spectroelectrochemical data for the bipolar azo compound N,N'-diphenyl-N,N'-bis[4-(phenylazo)phenyl]-4,4'diaminobiphenyl (AZOPD) demonstrating reversible bipolar redox behaviour with a bandgap of 2.1 eV. The reduced species formed upon two-electron transfer can be described as bis(radical anion) as was confirmed by comparison with a reference compound with only one azo chromophore. Hole and electron transport behaviour in amorphous films was demonstrated by the fabrication of organic field-effect transistors using gold and magnesium contacts, respectively. The transistors are sensitive to light due to E-Z photoisomerization.

  5. Experimental examination of tunneling paths in SiGe/Si gate-normal tunneling field-effect transistors

    Science.gov (United States)

    Glass, S.; von den Driesch, N.; Strangio, S.; Schulte-Braucks, C.; Rieger, T.; Narimani, K.; Buca, D.; Mantl, S.; Zhao, Q. T.

    2017-12-01

    The benefits of a gate-normal tunneling architecture in enhancing the on-current and average subthreshold swing of tunneling field-effect transistors were scrutinized in experiment through careful physical analysis of a Si0.50Ge0.50/Si heterostructure. In accordance with theoretical predictions, it is confirmed that the on-current is governed by line tunneling scaling with the source-gate overlap area of our devices. Our analysis identifies the early onset of parasitic diagonal tunneling paths as most detrimental for a low average subthreshold swing. By counter doping the channel, this onset can be shifted favorably, permitting low average subthreshold swings down to 87 mV/dec over four decades of drain current and high on-off current ratios exceeding 106.

  6. Band-to-band tunneling distance analysis in the heterogate electron–hole bilayer tunnel field-effect transistor

    Energy Technology Data Exchange (ETDEWEB)

    Padilla, J. L., E-mail: jose.padilladelatorre@epfl.ch [Nanoelectronic Devices Laboratory, École Polytechnique Fédérale de Lausanne, Lausanne CH-1015 (Switzerland); Departamento de Electrónica y Tecnología de los Computadores, Universidad de Granada, Avda. Fuentenueva s/n, 18071 Granada (Spain); Palomares, A. [Departamento de Matemática Aplicada, Universidad de Granada, Avda. Fuentenueva s/n, 18071 Granada (Spain); Alper, C.; Ionescu, A. M. [Nanoelectronic Devices Laboratory, École Polytechnique Fédérale de Lausanne, Lausanne CH-1015 (Switzerland); Gámiz, F. [Departamento de Electrónica y Tecnología de los Computadores, Universidad de Granada, Avda. Fuentenueva s/n, 18071 Granada (Spain)

    2016-01-28

    In this work, we analyze the behavior of the band-to-band tunneling distance between electron and hole subbands resulting from field-induced quantum confinement in the heterogate electron–hole bilayer tunnel field-effect transistor. We show that, analogously to the explicit formula for the tunneling distance that can be easily obtained in the semiclassical framework where the conduction and valence band edges are allowed states, an equivalent analytical expression can be derived in the presence of field-induced quantum confinement for describing the dependence of the tunneling distance on the body thickness and material properties of the channel. This explicit expression accounting for quantum confinement holds valid provided that the potential wells for electrons and holes at the top and bottom of the channel can be approximated by triangular profiles. Analytical predictions are compared to simulation results showing very accurate agreement.

  7. An analytic model for gate-all-around silicon nanowire tunneling field effect transistors

    Science.gov (United States)

    Liu, Ying; He, Jin; Chan, Mansun; Du, Cai-Xia; Ye, Yun; Zhao, Wei; Wu, Wen; Deng, Wan-Ling; Wang, Wen-Ping

    2014-09-01

    An analytical model of gate-all-around (GAA) silicon nanowire tunneling field effect transistors (NW-TFETs) is developted based on the surface potential solutions in the channel direction and considering the band to band tunneling (BTBT) efficiency. The three-dimensional Poisson equation is solved to obtain the surface potential distributions in the partition regions along the channel direction for the NW-TFET, and a tunneling current model using Kane's expression is developed. The validity of the developed model is shown by the good agreement between the model predictions and the TCAD simulation results.

  8. InAs/Si Hetero-Junction Nanotube Tunnel Transistors

    OpenAIRE

    Hanna, Amir N.; Fahad, Hossain M.; Hussain, Muhammad M.

    2015-01-01

    Hetero-structure tunnel junctions in non-planar gate-all-around nanowire (GAA NW) tunnel FETs (TFETs) have shown significant enhancement in ?ON? state tunnel current over their all-silicon counterpart. Here we show the unique concept of nanotube TFET in a hetero-structure configuration that is capable of much higher drive current as opposed to that of GAA NW TFETs.Through the use of inner/outer core-shell gates, a single III-V hetero-structured nanotube TFET leverages physically larger tunnel...

  9. A subthermionic tunnel field-effect transistor with an atomically thin channel.

    Science.gov (United States)

    Sarkar, Deblina; Xie, Xuejun; Liu, Wei; Cao, Wei; Kang, Jiahao; Gong, Yongji; Kraemer, Stephan; Ajayan, Pulickel M; Banerjee, Kaustav

    2015-10-01

    The fast growth of information technology has been sustained by continuous scaling down of the silicon-based metal-oxide field-effect transistor. However, such technology faces two major challenges to further scaling. First, the device electrostatics (the ability of the transistor's gate electrode to control its channel potential) are degraded when the channel length is decreased, using conventional bulk materials such as silicon as the channel. Recently, two-dimensional semiconducting materials have emerged as promising candidates to replace silicon, as they can maintain excellent device electrostatics even at much reduced channel lengths. The second, more severe, challenge is that the supply voltage can no longer be scaled down by the same factor as the transistor dimensions because of the fundamental thermionic limitation of the steepness of turn-on characteristics, or subthreshold swing. To enable scaling to continue without a power penalty, a different transistor mechanism is required to obtain subthermionic subthreshold swing, such as band-to-band tunnelling. Here we demonstrate band-to-band tunnel field-effect transistors (tunnel-FETs), based on a two-dimensional semiconductor, that exhibit steep turn-on; subthreshold swing is a minimum of 3.9 millivolts per decade and an average of 31.1 millivolts per decade for four decades of drain current at room temperature. By using highly doped germanium as the source and atomically thin molybdenum disulfide as the channel, a vertical heterostructure is built with excellent electrostatics, a strain-free heterointerface, a low tunnelling barrier, and a large tunnelling area. Our atomically thin and layered semiconducting-channel tunnel-FET (ATLAS-TFET) is the only planar architecture tunnel-FET to achieve subthermionic subthreshold swing over four decades of drain current, as recommended in ref. 17, and is also the only tunnel-FET (in any architecture) to achieve this at a low power-supply voltage of 0.1 volts. Our

  10. Producing of pover GaAs structures of bipolar and field-effect transistor by CVD-method

    Directory of Open Access Journals (Sweden)

    Voronin V. A.

    2010-03-01

    Full Text Available Investigation results in technology of doping Sn and Bi of perfect GaAs structures preparation by the lowe-temperature isothermal chloride epitaxy method are presented. A complex problem has been solved to obtain planar layers of the n+–n–n0–p type bipolar transistors and planar layers of the i–n0–n–n+ type Schottky field-effect transistors. Heterogenetty in the thickness less than 3% and doping level less than 5% has been achieved. This allowed to get the discrete Schottky field-effect transistors with improved operation characteristics.

  11. Fabrication and high temperature characteristics of ion-implanted GaAs bipolar transistors and ring-oscillators

    Science.gov (United States)

    Doerbeck, F. H.; Yuan, H. T.; Mclevige, W. V.

    1981-01-01

    Ion implantation techniques that permit the reproducible fabrication of bipolar GaAs integrated circuits are studied. A 15 stage ring oscillator and discrete transistor were characterized between 25 and 400 C. The current gain of the transistor was found to increase slightly with temperature. The diode leakage currents increase with an activation energy of approximately 1 eV and dominate the transistor leakage current 1 sub CEO above 200 C. Present devices fail catastrophically at about 400 C because of Au-metallization.

  12. Urea biosensor based on an extended-base bipolar junction transistor.

    Science.gov (United States)

    Sun, Tai-Ping; Shieh, Hsiu-Li; Liu, Chun-Lin; Chen, Chung-Yuan

    2014-01-01

    In this study, a urea biosensor was prepared by the immobilization of urease onto the sensitive membrane of an extended-base bipolar junction transistor. The pH variation was used to detect the concentration of urea. The SnO2/ITO glass, fabricated by sputtering SnO2 on the conductive ITO glass, was used as a pH-sensitive membrane, which was connected with a commercial bipolar junction transistor device. The gels, fabricated by the poly vinyl alcohol with pendent styrylpyridinium groups, were used to immobilize the urease. This readout circuit, fabricated in a 0.35-um CMOS 2P4M process, operated at 3.3V supply voltage. This circuit occupied an area of 1.0 mm × 0.9 mm. The dynamic range of the urea biosensor was from 1.4 to 64 mg/dl at the 10 mM phosphate buffer solution and the sensitivity of this range was about 65.8 mV/pUrea. The effect of urea biosensors with different pH values was considered, and the characteristics of urea biosensors based on EBBJT were described.

  13. Physical processes of current gain in InAs bipolar junction transistors

    Science.gov (United States)

    Wu, X.; Averett, K. L.; Maimon, S.; Koch, M. W.; Wicks, G. W.

    2004-01-01

    InAs bipolar junction transistors (BJTs), grown by molecular beam epitaxy, are reported with common emitter current gains ( β's) as large as 400. The factors affecting the common emitter current gain have been studied by estimating the magnitudes of the base transport factor ( αT) and emitter injection efficiency ( γ). This has been accomplished by studying a sequence of InAs BJTs with varying emitter doping densities, NE. Minority carrier diffusion length in the base ( LB), αT, and γ have been extracted from measured electrical characteristics. The results of the study of these InAs BJTs are as follows: L B≈0.4 μm, αT≈98% and γ ranges from 92% to nearly 100% depending on NE. This knowledge of the magnitudes of the injection efficiencies suggests when it would be useful to move from the simple BJT structure to the more advanced heterojunction bipolar transistor (HBT) structure. Lower γ BJTs would be improved, however high- γ BJTs would benefit little, by the use of the widegap emitters of HBTs. The method developed here to estimate γ, αT and LB is not specific to InAs BJTs, but should be useful for study of BJTs and HBTs in any material system.

  14. Trivalued Memory Circuit Using Metal-Oxide-Semiconductor Field-Effect Transistor Bipolar-Junction-Transistor Negative-Differential-Resistance Circuits Fabricated by Standard SiGe Process

    Science.gov (United States)

    Gan, Kwang-Jow; Tsai, Cher-Shiung; Liang, Dong-Shong; Wen, Chun-Ming; Chen, Yaw-Hwang

    2006-09-01

    A trivalued memory circuit based on two cascoded metal-oxide-semiconductor field-effect transistor bipolar-junction-transistor negative-differential-resistance (MOS-BJT-NDR) devices is investigated. The MOS-BJT-NDR device is made of MOS and BJT devices, but it can show the NDR current-voltage characteristic by suitably arranging the MOS parameters. We demonstrate a trivalued memory circuit using the two-peak MOS-BJT-NDR circuit as the driver and a resistor as the load. The MOS-BJT-NDR devices and memory circuits are fabricated by the standard 0.35 μm SiGe process.

  15. InAs/Si Hetero-Junction Nanotube Tunnel Transistors

    KAUST Repository

    Hanna, Amir

    2015-04-29

    Hetero-structure tunnel junctions in non-planar gate-all-around nanowire (GAA NW) tunnel FETs (TFETs) have shown significant enhancement in ‘ON’ state tunnel current over their all-silicon counterpart. Here we show the unique concept of nanotube TFET in a hetero-structure configuration that is capable of much higher drive current as opposed to that of GAA NW TFETs.Through the use of inner/outer core-shell gates, a single III-V hetero-structured nanotube TFET leverages physically larger tunneling area while achieving higher driver current (ION) and saving real estates by eliminating arraying requirement. Numerical simulations has shown that a 10 nm thin nanotube TFET with a 100 nm core gate has a 5×normalized output current compared to a 10 nm diameter GAA NW TFET.

  16. Interlayer tunnel field-effect transistor (ITFET): physics, fabrication and applications

    Science.gov (United States)

    Kang, Sangwoo; Mou, Xuehao; Fallahazad, Babak; Prasad, Nitin; Wu, Xian; Valsaraj, Amithraj; Movva, Hema C. P.; Kim, Kyounghwan; Tutuc, Emanuel; Register, Leonard F.; Banerjee, Sanjay K.

    2017-09-01

    The scaling challenges of complementary metal oxide semiconductors (CMOS) are increasing with the pace of scaling showing marked signs of slowing down. This slowing has brought about a widespread search for an alternative beyond-CMOS device concept. While the charge tunneling phenomenon has been known for almost a century, and tunneling based transistors have been studied in the past few decades, its possibilities are being re-examined with the emergence of a new class of two-dimensional (2D) materials. By stacking varying 2D materials together, with two electrode layers sandwiching a tunnel dielectric layer, it could be possible to make vertical tunnel transistors without the limitations that have plagued such devices implemented within other material systems. When the two electrode layers are of the same material, under certain conditions, one can achieve resonant tunneling between the two layers, manifesting as negative differential resistance (NDR) in the interlayer current-voltage characteristics. We call this type of device an interlayer tunnel FET (ITFET). We review the basic operation principles of this device, experimental and theoretical studies, and benchmark simulation results for several digital logic gates based on a compact model that we developed. The results are placed in the context of work going on in other groups.

  17. Tunable SnSe2/WSe2Heterostructure Tunneling Field Effect Transistor.

    Science.gov (United States)

    Yan, Xiao; Liu, Chunsen; Li, Chao; Bao, Wenzhong; Ding, Shijin; Zhang, David Wei; Zhou, Peng

    2017-09-01

    The burgeoning 2D semiconductors can maintain excellent device electrostatics with an ultranarrow channel length and can realize tunneling by electrostatic gating to avoid deprivation of band-edge sharpness resulting from chemical doping, which make them perfect candidates for tunneling field effect transistors. Here this study presents SnSe 2 /WSe 2 van der Waals heterostructures with SnSe 2 as the p-layer and WSe 2 as the n-layer. The energy band alignment changes from a staggered gap band offset (type-II) to a broken gap (type-III) when changing the negative back-gate voltage to positive, resulting in the device operating as a rectifier diode (rectification ratio ~10 4 ) or an n-type tunneling field effect transistor, respectively. A steep average subthreshold swing of 80 mV dec -1 for exceeding two decades of drain current with a minimum of 37 mV dec -1 at room temperature is observed, and an evident trend toward negative differential resistance is also accomplished for the tunneling field effect transistor due to the high gate efficiency of 0.36 for single gate devices. The I ON /I OFF ratio of the transfer characteristics is >10 6 , accompanying a high ON current >10 -5 A. This work presents original phenomena of multilayer 2D van der Waals heterostructures which can be applied to low-power consumption devices. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  18. Unipolar and bipolar operation of InAs/InSb nanowire heterostructure field-effect transistors

    Science.gov (United States)

    Nilsson, Henrik A.; Caroff, Philippe; Lind, Erik; Pistol, Mats-Erik; Thelander, Claes; Wernersson, Lars-Erik

    2011-09-01

    We present temperature dependent electrical measurements on n-type InAs/InSb nanowire heterostructure field-effect transistors. The barrier height of the heterostructure junction is determined to be 220 meV, indicating a broken bandgap alignment. A clear asymmetry is observed when applying a bias to either the InAs or the InSb side of the junction. Impact ionization and band-to-band tunneling is more pronounced when the large voltage drop occurs in the narrow bandgap InSb segment. For small negative gate-voltages, the InSb segment can be tuned toward p-type conduction, which induces a strong band-to-band tunneling across the heterostructucture junction.

  19. Technique for electronic measurement of semi-reduction layer using bipolar transistor of junction; Tecnica de medicao eletronica da camada semiredutora utilizando transistor bipolar de juncao

    Energy Technology Data Exchange (ETDEWEB)

    Santos, Luiz A.P.; Barros, Fabio R.; Santos, Marcus A.P., E-mail: lasantos@cnen.gov.br [Centro Regional de Ciencias Nucleares do Nordeste (CRCN-NE/CNEN-PE), Recife, PE (Brazil); Monte, David S.; Santos, Jose A.P., E-mail: dsmonte@scients.com.br [SCIENTS, Recife, PE (Brazil)

    2014-07-01

    Recommendations of the International Commission on Radiological Protection (ICRP), the World Health Organization (WHO) and also of the International Atomic Energy Agency (IAEA) suggest equipment for X-rays diagnosis are checked for conformance to their parameters, such as Layer Semi-Reduction (CSR). The importance of verification of diagnostic radiology in parameters is because of have records that forces patients undergoing radiation doses in some clinics, up to 300% the reference values suggested by international agencies which doses are considered unnecessary, and even harmful, either because of physical or variable greatness of being out of control nominal specification, or the fact of having to repeat the radiographs. In this context, the purpose of this study was an innovative methodology that is the use of bipolar transistor junction (TBJ) to measure the aluminum CSR in diagnostic X-ray equipment beams. Although the TBJ be a device invented in the last century, only in recent years have explored their potential as X-ray sensor applied to diagnosis. The study indicates that the tested device can operating the detection of X-rays is properly polarized with electrical signals that can detect interference of the interaction of X-ray photons with the PN junction formed by the base and emitter terminals. The result of the developed technique was compared to CSR measurements obtained with detection systems standards and it was found that the BJT provides values for aluminum CSR relative errors less than 5%.

  20. Study of an Insulated Gate Bipolar Transistor (IGBT) and its connection in series. Application at a chopper 1500V-5A-10kHz

    International Nuclear Information System (INIS)

    Gros, P.

    1993-01-01

    In the frame of the tokamak ITER (International Thermonuclear Experimental Reactor) we have studied, for neutral particle injection, a converter with at least two static interrupters by Mosfet transistor, bipolar transistor or Insulated Gate Bipolar Transistor (IGBT). After a comparison between these three types of transistors, by the simulating software MICROCAP, a serial of tests has shown the advantages of the IGBT. A command, associated with two IGBT of equivalent characteristics, has given a simple and efficacious solution. The performances are: (1) between two blockages: 50 ns without overvoltage, (2) between two cut-off: 60 ns. 40 figs; 30 refs; 10 annexes

  1. Steep Turn On/Off Green Tunnel Transistors

    Science.gov (United States)

    2010-12-17

    electric field is used. The TCAD device simulator MEDICI implements the local tunneling model of Eq. (2.20) and has option on choice of electric field...3.4, which is an Id-Vg simulation of a generic TFET (identical to Figure 3.1) with germanium band gap. The MEDICI device simulation tool with band-to...Figure 3.1 in silicon is simulated (using MEDICI device simulator) with the local band-to-band tunnel model with average electric field using calibrated

  2. Si/Ge hetero-structure nanotube tunnel field effect transistor

    Science.gov (United States)

    Hanna, A. N.; Hussain, M. M.

    2015-01-01

    We discuss the physics of conventional channel material (silicon/germanium hetero-structure) based transistor topology mainly core/shell (inner/outer) gated nanotube vs. gate-all-around nanowire architecture for tunnel field effect transistor application. We show that nanotube topology can result in higher performance through higher normalized current when compared to nanowire architecture at Vdd = 1 V due to the availability of larger tunneling cross section and lower Shockley-Reed-Hall recombination. Both architectures are able to achieve sub 60 mV/dec performance for more than five orders of magnitude of drain current. This enables the nanotube configuration achieving performance same as the nanowire architecture even when Vdd is scaled down to 0.5 V.

  3. High-performance molybdenum disulfide field-effect transistors with spin tunnel contacts.

    Science.gov (United States)

    Dankert, André; Langouche, Lennart; Kamalakar, Mutta Venkata; Dash, Saroj Prasad

    2014-01-28

    Molybdenum disulfide has recently emerged as a promising two-dimensional semiconducting material for nanoelectronic, optoelectronic, and spintronic applications. Here, we investigate the field-effect transistor behavior of MoS2 with ferromagnetic contacts to explore its potential for spintronics. In such devices, we elucidate that the presence of a large Schottky barrier resistance at the MoS2/ferromagnet interface is a major obstacle for the electrical spin injection and detection. We circumvent this problem by a reduction in the Schottky barrier height with the introduction of a thin TiO2 tunnel barrier between the ferromagnet and MoS2. This results in an enhancement of the transistor on-state current by 2 orders of magnitude and an increment in the field-effect mobility by a factor of 6. Our magnetoresistance calculation reveals that such integration of ferromagnetic tunnel contacts opens up the possibilities for MoS2-based spintronic devices.

  4. Si/Ge hetero-structure nanotube tunnel field effect transistor

    KAUST Repository

    Hanna, A. N.

    2015-01-07

    We discuss the physics of conventional channel material (silicon/germanium hetero-structure) based transistor topology mainly core/shell (inner/outer) gated nanotube vs. gate-all-around nanowire architecture for tunnel field effect transistor application. We show that nanotube topology can result in higher performance through higher normalized current when compared to nanowire architecture at Vdd-=-1-V due to the availability of larger tunneling cross section and lower Shockley-Reed-Hall recombination. Both architectures are able to achieve sub 60-mV/dec performance for more than five orders of magnitude of drain current. This enables the nanotube configuration achieving performance same as the nanowire architecture even when Vdd is scaled down to 0.5-V.

  5. High-Current GaSb/InAs(Sb) Nanowire Tunnel Field-Effect Transistors

    OpenAIRE

    Dey, Anil; Borg, Mattias; Ganjipour, Bahram; Ek, Martin; Dick Thelander, Kimberly; Lind, Erik; Thelander, Claes; Wernersson, Lars-Erik

    2013-01-01

    We present electrical characterization of GaSb/InAs(Sb) nanowire tunnel field-effect transistors. The broken band alignment of the GaSb/InAs(Sb) heterostructure is exploited to allow for interband tunneling without a barrier, leading to high ON-current levels. We report a maximum drive current of 310 μA/μm at Vds = 0.5 V. Devices with scaled gate oxides display transconductances up to gm = 250 mS/mm at Vds = 300 mV, which are normalized to the nanowire circumference at the axial heterojunction...

  6. Design of the optimum insulator gate bipolar transistor using response surface method with cluster analysis

    CERN Document Server

    Wang, Chi Ling; Huang Sy Ruen; Yeh Chao Yu

    2004-01-01

    In this paper, a statistical methodology that can be used for the optimization of the Insulator Gate Bipolar Transistor (IGBT) devices is proposed. This is achieved by integrating the response surface method (RSM) with cluster analysis, weighted composite method and genetic algorithm (GA). The device characteristic of IGBT was simulated based upon the fabrication simulator, ATHENA, and the device simulator, ATLAS. This methodology, yielded another way to investigate the IGBT device and to make a decision in the tradeoff between the breakdown voltage and the on-resistance. In this methodology, we also show how to use cluster analysis to determine the dominant factors that are not visible in the screening of all experiments. 20 Refs.

  7. Contribution to the study of fluctuations in transistors (bipolar and junction field effect types)

    International Nuclear Information System (INIS)

    Borel, J.

    1970-01-01

    A brief review of the basic theory of fluctuations in semiconductors is given: shot, thermal low frequency noise. A measuring set has been built to draw noise spectrums (current or voltage). Noise parameters of bipolar transistors are given, mainly noise voltage. Noise current, noise factor and correlation between noise sources are also calculated. Measurements of noise parameters fit well with theory for various devices made in different technologies: alloyed, mesa, planar. Then we give results of the calculation of noise parameters in a FET starting from a simplified model of the device. Low frequency noise is taken into account. Measurements of the parameters and of the spectrum agree fairly well with the theory. Studies of low frequency noise versus temperature give the density and energy of traps located in the space charge layers and an idea of the impurity encountered in these space charge layers [fr

  8. Microwave characterization and modeling of GaAs/AlGaAs heterojunction bipolar transistors

    Science.gov (United States)

    Simons, Rainee N.; Romanofsky, Robert R.

    1987-01-01

    The characterization and modeling of a microwave GaAs/AlGaAs heterojunction Bipolar Transistor (HBT) are discussed. The de-embedded scattering parameters are used to derive a small signal lumped element equivalent circuit model using EEsof's Touchstone software package. Each element in the equivalent circuit model is shown to have its origin within the device. The model shows good agreement between the measured and modeled scattering parameters over a wide range of bias currents. Further, the MAG (maximum available power gain) and the h sub 21 (current gain) calculated from the measured data and those predicted by the model are also in good agreement. Consequently, the model should also be capable of predicting the f sub max and the f sub T of other HBTs.

  9. Analysis of long-term ionizing radiation effects in bipolar transistors

    Science.gov (United States)

    Stanley, A. G.; Martin, K. E.

    1978-01-01

    The ionizing radiation effects of electrons on bipolar transistors have been analyzed using the data base from the Voyager project. The data were subjected to statistical analysis, leading to a quantitative characterization of the product and to data on confidence limits which will be useful for circuit design purposes. These newly-developed methods may form the basis for a radiation hardness assurance system. In addition, an attempt was made to identify the causes of the large variations in the sensitivity observed on different product lines. This included a limited construction analysis and a determination of significant design and processes variables, as well as suggested remedies for improving the tolerance of the devices to radiation.

  10. Characterization of insulated-gate bipolar transistor temperature on insulating, heat-spreading polycrystalline diamond substrate

    Science.gov (United States)

    Umezawa, Hitoshi; Shikata, Shin-ichi; Kato, Yukako; Mokuno, Yoshiaki; Seki, Akinori; Suzuki, Hiroshi; Bessho, Takeshi

    2017-01-01

    Polycrystalline diamond films have been utilized as direct bonding aluminum (DBA) substrates to improve cooling efficiency. A diamond film with a high quality factor was characterized by Raman spectroscopy and showed a high thermal conductivity of more than 1800 W m-1 K-1 and a low leakage current, even at an applied bias of 3 kV, because of the suppression of electrical conduction through the grain boundaries. The operating temperatures of Insulated-gate bipolar transistors (IGBTs) on diamond DBAs were 20-28% lower than those on AlN DBAs. The thermal resistivity of the diamond DBA module was 0.32 °C/W. The uniformity of the temperature distribution on a diamond DBA was excellent.

  11. Analysis of the dynamic avalanche of punch through insulated gate bipolar transistor (PT-IGBT)

    Science.gov (United States)

    Lefranc, P.; Planson, D.; Morel, H.; Bergogne, D.

    2009-09-01

    In the paper proposed here, we are studying the dynamic avalanche from experimental results first, dynamic avalanche is identified on a punch through insulated gate bipolar transistor (PT-IGBT) module 1200 V-300 A from Mitsubishi. Secondly, the phenomenon is analysed thanks to simple solid state devices equations. Numerical simulations are used to confirm experimental results. Simulation results allows us locating the active area of the dynamic avalanche during turn-off under over-current conditions. A PT-IGBT cell is described with MEDICI™, a finite element simulator. A mixed-mode simulation is performed thanks to MEDICI™ and SPICE™. The circuit simulated here is a buck topology with an inductive load. Finally, a thermal analysis is performed to estimate temperature increase due to dynamic avalanche.

  12. A New Switching Impulse Generator Based on Transformer Boosting and Insulated Gate Bipolar Transistor Trigger Control

    Directory of Open Access Journals (Sweden)

    Ming Ren

    2016-08-01

    Full Text Available To make the switching impulse (SI generator more compact, portable and feasible in field tests, a new approach based on transformer boosting was developed. To address problems such as triggering synchronization and electromagnetic interference involved with the traditional spark gap, an insulated gate bipolar transistor (IGBT module with drive circuit was employed as the impulse trigger. An optimization design for the component parameters of the primary winding side of the transformer was realized by numerical calculation and error correction. Experiment showed that the waveform parameters of SI and oscillating switching impulse (OSI voltages generated by the new generator were consistent with the numerical calculation and the error correction. The generator was finally built on a removable high voltage transformer with small size. Thus the volume of the generator is significantly reduced. Experiments showed that the waveform parameters of SI and OSI voltages generated by the new generator were basically consistent with the numerical calculation and the error correction.

  13. Dissipative tunneling and orthogonality catastrophe in molecular transistors

    DEFF Research Database (Denmark)

    Braig, S.; Flensberg, Karsten

    2004-01-01

    Transport through molecular devices with weak tunnel coupling to the leads but with strong coupling to a single vibrational mode is considered in the case where the vibration is damped by coupling to the environment. In particular, we investigate what influence the electrostatic coupling of the c...

  14. Resonant tunnelling and negative differential conductance in graphene transistors

    Science.gov (United States)

    Britnell, L.; Gorbachev, R. V.; Geim, A. K.; Ponomarenko, L. A.; Mishchenko, A.; Greenaway, M. T.; Fromhold, T. M.; Novoselov, K. S.; Eaves, L.

    2013-04-01

    The chemical stability of graphene and other free-standing two-dimensional crystals means that they can be stacked in different combinations to produce a new class of functional materials, designed for specific device applications. Here we report resonant tunnelling of Dirac fermions through a boron nitride barrier, a few atomic layers thick, sandwiched between two graphene electrodes. The resonance occurs when the electronic spectra of the two electrodes are aligned. The resulting negative differential conductance in the device characteristics persists up to room temperature and is gate voltage-tuneable due to graphene’s unique Dirac-like spectrum. Although conventional resonant tunnelling devices comprising a quantum well sandwiched between two tunnel barriers are tens of nanometres thick, the tunnelling carriers in our devices cross only a few atomic layers, offering the prospect of ultra-fast transit times. This feature, combined with the multi-valued form of the device characteristics, has potential for applications in high-frequency and logic devices.

  15. Band-to-band tunneling in Γ valley for Ge source lateral tunnel field effect transistor: Thickness scaling

    Science.gov (United States)

    Jain, Prateek; Rastogi, Priyank; Yadav, Chandan; Agarwal, Amit; Chauhan, Yogesh Singh

    2017-07-01

    The direct and indirect valleys in Germanium (Ge) are separated by a very small offset, which opens up the prospect of direct tunneling in the Γ valley of an extended Ge source tunnel field effect transistor (TFET). We explore the impact of thickness scaling of extended Ge source lateral TFET on the band to band tunneling (BTBT) current. The Ge source is extended inside the gate by 2 nm to confine the tunneling in Ge only. We observe that as the thickness is scaled, the band alignment at the Si/Ge heterojunction changes significantly, which results in an increase in Ge to Si BTBT current. Based on density functional calculations, we first obtain the band structure parameters (bandgap, effective masses, etc.) for the Ge and Si slabs of varying thickness, and these are then used to obtain the thickness dependent Kane's BTBT tunneling parameters. We find that electrostatics improves as the thickness is reduced in the ultra-thin Ge film ( ≤ 10 nm). The ON current degrades as we scale down in thickness; however, the subthreshold slope ( S S AVG ) improves remarkably with thickness scaling due to subsurface BTBT. We predict that 8 nm thin devices offer the best option for optimized ON current and S S AVG .

  16. Effect of the interface recombination current fluctuations on 1/f noise of gated lateral bipolar transistors

    Science.gov (United States)

    Romas, Gregory G., Jr.; Ul Hoque, Md Mazhar; Celik-Butler, Zeynep

    2003-05-01

    A gated lateral bipolar transistor is a bulk lateral BJT in parallel with a MOSFET at the surface. The base current components such as surface recombination and space charge recombination currents are two of the dominant noise sources in the lateral BJT. If the gate is biased such that the MOSFET is in the off-state by accumulating carriers underneath the oxide in the base surface, the noise contribution by these two base current (Ib) components can be better understood. The carrier accumulation in the base surface can be modulated with different gate bias, which in turn will affect the fluctuation of the surface recombination current component. In this paper, noise power spectral density of gated lateral PNP transistors, fabricated in Texas Instruments Standard Bipolar Process, has been discussed. The base current noise power spectral density (SIb) was extracted from the cross-correlation noise spectrum measured between the base and the collector circuits for different gate biasing conditions. Based on the frequency exponent dependence of the noise power spectral density, it was found that the noise in the low frequency range is in the form of 1/f noise. SIb was found to be the dominant noise source for these devices as the coherence between the base and collector power spectral density was very close to 1. SIb was extracted for a base current range of 8 nA to 1microA for a gate bias range of 0V to 40V. The SPICE noise model parameters, AF and KF were also determined for each case from the dependence of SIb on Ib. The noise was measured on devices with different base width values.

  17. Incident particle range dependence of radiation damage in a power bipolar junction transistor

    Science.gov (United States)

    Liu, Chao-Ming; Li, Xing-Ji; Geng, Hong-Bin; Rui, Er-Ming; Guo, Li-Xin; Yang, Jian-Qun

    2012-10-01

    The characteristic degradations in silicon NPN bipolar junction transistors (BJTs) of type 3DD155 are examined under the irradiations of 25-MeV carbon (C), 40-MeV silicon (Si), and 40-MeV chlorine (Cl) ions respectively. Different electrical parameters are measured in-situ during the exposure of heavy ions. The experimental data shows that the changes in the reciprocal of the gain variation (Δ(1/β)) of 3DD155 transistors irradiated respectively by 25-MeV C, 40-MeV Si, and 40-MeV Cl ions each present a nonlinear behaviour at a low fluence and a linear response at a high fluence. The Δ(1/β) of 3DD155 BJT irradiated by 25-MeV C ions is greatest at a given fluence, a little smaller when the device is irradiated by 40-MeV Si ions, and smallest in the case of the 40-MeV Cl ions irradiation. The measured and calculated results clearly show that the range of heavy ions in the base region of BJT affects the level of radiation damage.

  18. Annealing effects and DLTS study on NPN silicon bipolar junction transistors irradiated by heavy ions

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Chaoming; Li, Xingji, E-mail: lxj0218@hit.edu.cn; Yang, Jianqun; Rui, Erming

    2014-01-21

    Isochronal anneal sequences have been carried out on 3DG112 silicon NPN bipolar junction transistors (BJTs) irradiated with 20 MeV bromine (Br) heavy ions. The Gummel curve is utilized to characterize the annealing behavior of defects in both the emitter-base depletion region and the neutral base. We find that the base current (I{sub B}) decreases with the increasing annealing temperature, while the collector current (I{sub C}) remains invariable. The current gain varies slightly, when the annealing temperature (T{sub A}) is lower than 400 K, while varies rapidly at T{sub A}<450 K, and the current gain of the 3DG112 BJT annealing at 700 K almost restore to that of the pre-radiation transistor. Deep level transient spectroscopy (DLTS) data is used to assign the relative magnitude of each of the important defects. Based on the in situ electrical measurement and DLTS spectra, it is clear that the V{sub 2}(−/0)+V-P traps are the main contribution to the degradation of current gain after the 20 MeV Br ions irradiation. The V{sub 2}(−/0)+V-P peak has many of the characteristics expected for the current gain degradation.

  19. Annealing effects and DLTS study on NPN silicon bipolar junction transistors irradiated by heavy ions

    Science.gov (United States)

    Liu, Chaoming; Li, Xingji; Yang, Jianqun; Rui, Erming

    2014-01-01

    Isochronal anneal sequences have been carried out on 3DG112 silicon NPN bipolar junction transistors (BJTs) irradiated with 20 MeV bromine (Br) heavy ions. The Gummel curve is utilized to characterize the annealing behavior of defects in both the emitter-base depletion region and the neutral base. We find that the base current (IB) decreases with the increasing annealing temperature, while the collector current (IC) remains invariable. The current gain varies slightly, when the annealing temperature (TA) is lower than 400 K, while varies rapidly at TABJT annealing at 700 K almost restore to that of the pre-radiation transistor. Deep level transient spectroscopy (DLTS) data is used to assign the relative magnitude of each of the important defects. Based on the in situ electrical measurement and DLTS spectra, it is clear that the V2(-/0)+V-P traps are the main contribution to the degradation of current gain after the 20 MeV Br ions irradiation. The V2(-/0)+V-P peak has many of the characteristics expected for the current gain degradation.

  20. Bilayer insulator tunnel barriers for graphene-based vertical hot-electron transistors.

    Science.gov (United States)

    Vaziri, S; Belete, M; Dentoni Litta, E; Smith, A D; Lupina, G; Lemme, M C; Östling, M

    2015-08-14

    Vertical graphene-based device concepts that rely on quantum mechanical tunneling are intensely being discussed in the literature for applications in electronics and optoelectronics. In this work, the carrier transport mechanisms in semiconductor-insulator-graphene (SIG) capacitors are investigated with respect to their suitability as electron emitters in vertical graphene base transistors (GBTs). Several dielectric materials as tunnel barriers are compared, including dielectric double layers. Using bilayer dielectrics, we experimentally demonstrate significant improvements in the electron injection current by promoting Fowler-Nordheim tunneling (FNT) and step tunneling (ST) while suppressing defect mediated carrier transport. High injected tunneling current densities approaching 10(3) A cm(-2) (limited by series resistance), and excellent current-voltage nonlinearity and asymmetry are achieved using a 1 nm thick high quality dielectric, thulium silicate (TmSiO), as the first insulator layer, and titanium dioxide (TiO2) as a high electron affinity second layer insulator. We also confirm the feasibility and effectiveness of our approach in a full GBT structure which shows dramatic improvement in the collector on-state current density with respect to the previously reported GBTs. The device design and the fabrication scheme have been selected with future CMOS process compatibility in mind. This work proposes a bilayer tunnel barrier approach as a promising candidate to be used in high performance vertical graphene-based tunneling devices.

  1. Investigation of silicide-induced-dopant-activation for steep tunnel junction in tunnel field effect transistor (TFET)

    Science.gov (United States)

    Kim, Sihyun; Kwon, Dae Woong; Park, Euyhwan; Lee, Junil; Lee, Roongbin; Lee, Jong-Ho; Park, Byung-Gook

    2018-02-01

    Numerous researches for making steep tunnel junction within tunnel field-effect transistor (TFET) have been conducted. One of the ways to make an abrupt junction is source/drain silicidation, which uses the phenomenon often called silicide-induced-dopant-segregation. It is revealed that the silicide process not only helps dopants to pile up adjacent to the metal-silicon alloy, also induces the dopant activation, thereby making it possible to avoid additional high temperature process. In this report, the availability of dopant activation induced by metal silicide process was thoroughly investigated by diode measurement and device simulation. Metal-silicon (MS) diodes having p+ and n+ silicon formed on the p- substrate exhibit the characteristics of ohmic and pn diodes respectively, for both the samples with and without high temperature annealing. The device simulation for TFETs with dopant-segregated source was also conducted, which verified enhanced DC performance.

  2. Long-Term Reliability of High Speed SiGe/Si Heterojunction Bipolar Transistors

    Science.gov (United States)

    Ponchak, George E. (Technical Monitor); Bhattacharya, Pallab

    2003-01-01

    Accelerated lifetime tests were performed on double-mesa structure Si/Si0.7Ge0.3/Si npn heterojunction bipolar transistors, grown by molecular beam epitaxy, in the temperature range of 175C-275C. Both single- and multiple finger transistors were tested. The single-finger transistors (with 5x20 micron sq m emitter area) have DC current gains approximately 40-50 and f(sub T) and f(sub MAX) of up to 22 GHz and 25 GHz, respectively. The multiple finger transistors (1.4 micron finger width, 9 emitter fingers with total emitter area of 403 micron sq m) have similar DC current gain but f(sub T) of 50 GHz. It is found that a gradual degradation in these devices is caused by the recombination enhanced impurity diffusion (REID) of boron atoms from the p-type base region and the associated formation of parasitic energy barriers to electron transport from the emitter to collector layers. This REID has been quantitatively modeled and explained, to the first order of approximation, and the agreement with the measured data is good. The mean time to failure (MTTF) of the devices at room temperature is estimated from the extrapolation of the Arrhenius plots of device lifetime versus reciprocal temperature. The results of the reliability tests offer valuable feedback for SiGe heterostructure design in order to improve the long-term reliability of the devices and circuits made with them. Hot electron induced degradation of the base-emitter junction was also observed during the accelerated lifetime testing. In order to improve the HBT reliability endangered by the hot electrons, deuterium sintered techniques have been proposed. The preliminary results from this study show that a deuterium-sintered HBT is, indeed, more resistant to hot-electron induced base-emitter junction degradation. SiGe/Si based amplifier circuits were also subjected to lifetime testing and we extrapolate MTTF is approximately 1.1_10(exp 6) hours at 125iC junction temperature from the circuit lifetime data.

  3. Contact Metallization and Packaging Technology Development for SiC Bipolar Junction Transistors, PiN Diodes, and Schottky Diodes Designed for Long-Term Operations at 350degreeC

    Science.gov (United States)

    2006-05-01

    for high temperature contacts. A Bipolar Junction Transistor ( BJT ) in 4H-SiC can operate at higher temperatures (300oC) because its operation does not...AFRL-PR-WP-TR-2006-2181 CONTACT METALLIZATION AND PACKAGING TECHNOLOGY DEVELOPMENT FOR SiC BIPOLAR JUNCTION TRANSISTORS , PiN DIODES, AND...SUBTITLE CONTACT METALLIZATION AND PACKAGING TECHNOLOGY DEVELOPMENT FOR SiC BIPOLAR JUNCTION TRANSISTORS , PiN DIODES, AND SCHOTTKY DIODES DESIGNED

  4. Three-terminal heterojunction bipolar transistor solar cell for high-efficiency photovoltaic conversion.

    Science.gov (United States)

    Martí, A; Luque, A

    2015-04-22

    Here we propose, for the first time, a solar cell characterized by a semiconductor transistor structure (n/p/n or p/n/p) where the base-emitter junction is made of a high-bandgap semiconductor and the collector is made of a low-bandgap semiconductor. We calculate its detailed-balance efficiency limit and prove that it is the same one than that of a double-junction solar cell. The practical importance of this result relies on the simplicity of the structure that reduces the number of layers that are required to match the limiting efficiency of dual-junction solar cells without using tunnel junctions. The device naturally emerges as a three-terminal solar cell and can also be used as building block of multijunction solar cells with an increased number of junctions.

  5. Three-terminal heterojunction bipolar transistor solar cell for high-efficiency photovoltaic conversion

    Science.gov (United States)

    Martí, A.; Luque, A.

    2015-04-01

    Here we propose, for the first time, a solar cell characterized by a semiconductor transistor structure (n/p/n or p/n/p) where the base-emitter junction is made of a high-bandgap semiconductor and the collector is made of a low-bandgap semiconductor. We calculate its detailed-balance efficiency limit and prove that it is the same one than that of a double-junction solar cell. The practical importance of this result relies on the simplicity of the structure that reduces the number of layers that are required to match the limiting efficiency of dual-junction solar cells without using tunnel junctions. The device naturally emerges as a three-terminal solar cell and can also be used as building block of multijunction solar cells with an increased number of junctions.

  6. Effect of temperature on the performance of a bipolar transistor carrier-injected optical waveguide modulator/switch.

    Science.gov (United States)

    Okada, Y

    1991-05-15

    The effect of ambient temperature on the performance of a GaAs/AlGaAs heterojunction bipolar transistor waveguide structure carrier-injected optical intensity modulator/switch is discussed. An increase in the temperature increases the achievable optical modulation ratio at the expense of increased absorption loss, and vice versa. Analysis also shows that for practical use a tolerable temperature change should be no more than approximately 10 degrees C.

  7. Resonant tunnelling features in a suspended silicon nanowire single-hole transistor

    Energy Technology Data Exchange (ETDEWEB)

    Llobet, Jordi; Pérez-Murano, Francesc, E-mail: francesc.perez@csic.es, E-mail: z.durrani@imperial.ac.uk [Institut de Microelectrònica de Barcelona (IMB-CNM CSIC), Campus UAB, E-08193 Bellaterra, Catalonia (Spain); Krali, Emiljana; Wang, Chen; Jones, Mervyn E.; Durrani, Zahid A. K., E-mail: francesc.perez@csic.es, E-mail: z.durrani@imperial.ac.uk [Department of Electrical and Electronic Engineering, Imperial College London, South Kensington, London SW7 2AZ (United Kingdom); Arbiol, Jordi [Institució Catalana de Recerca i Estudis Avançats (ICREA) and Institut Català de Nanociència i Nanotecnologia (ICN2), Campus UAB, 08193 Bellaterra, Catalonia (Spain); CELLS-ALBA Synchrotron Light Facility, 08290 Cerdanyola, Catalonia (Spain)

    2015-11-30

    Suspended silicon nanowires have significant potential for a broad spectrum of device applications. A suspended p-type Si nanowire incorporating Si nanocrystal quantum dots has been used to form a single-hole transistor. Transistor fabrication uses a novel and rapid process, based on focused gallium ion beam exposure and anisotropic wet etching, generating <10 nm nanocrystals inside suspended Si nanowires. Electrical characteristics at 10 K show Coulomb diamonds with charging energy ∼27 meV, associated with a single dominant nanocrystal. Resonant tunnelling features with energy spacing ∼10 meV are observed, parallel to both diamond edges. These may be associated either with excited states or hole–acoustic phonon interactions, in the nanocrystal. In the latter case, the energy spacing corresponds well with reported Raman spectroscopy results and phonon spectra calculations.

  8. Tunnel field-effect transistor using InAs nanowire/Si heterojunction

    Science.gov (United States)

    Tomioka, Katsuhiro; Fukui, Takashi

    2011-02-01

    We report on fabrication of tunnel field-effect transistor with III-V nanowire (NW)/Si heterojunction and surrounding-gate structure. The device fabricated by selective-area growth of an n+-InAs/undoped-InAs axial NW on a p+-Si(111) substrate showed switching behavior with an average subthreshold slope (SS) of 104 mV/dec under reverse bias condition. The switching behavior appeared under small supply voltage (Vds=50 mV). Transmission electron microscopy revealed misfit dislocation formed at the interface degraded the SS and ON-state current. Coherent growth without misfit dislocations would promise realization of steep-slope transistor with a SS of <60 mV/dec.

  9. Discrete random distribution of source dopants in nanowire tunnel transistors (TFETs)

    Science.gov (United States)

    Sylvia, Somaia; Abul Khayer, M.; Alam, Khairul; Park, Hong-Hyun; Klimeck, Gerhard; Lake, Roger

    2013-03-01

    InAs and InSb nanowire (NW) tunnel field effect transistors (TFETs) require highly degenerate source doping to support the high electric fields in the tunnel region. For a target on-current of 1 μA , the doping requirement may be as high as 1 . 5 ×1020cm-3 in a NW with diameter as low as 4 nm. The small size of these devices demand that the dopants near tunneling region be treated discretely. Therefore, the effects resulting from the random distribution of dopant atoms in the source of a TFET are studied for 30 test devices. Comparing with the transfer characteristics of the same device simulated with a continuum doping model, our results show (1) a spread of I - V toward the positive gate voltage axis, (2) the same average threshold voltage, (3) an average 62% reduction in the on current, and (4) a slight degradation of the subthreshold slope. Random fluctuations in both the number and placement of dopants will be discussed. Also, as the channel length is scaled down, direct tunneling through the channel starts limiting the device performance. Therefore, a comparison of materials is also performed, showing their ability to block direct tunneling for sub-10 nm channel FETs and TFETs. This work was supported in part by the Center on Functional Engineered Nano Architectonics and the Materials, Structures and Devices Focus Center, under the Focus Center Research Program, and by the National Science Foundation under Grant OCI-0749140

  10. Dual metal gate tunneling field effect transistors based on MOSFETs: A 2-D analytical approach

    Science.gov (United States)

    Ramezani, Zeinab; Orouji, Ali A.

    2018-01-01

    A novel 2-D analytical drain current model of novel Dual Metal Gate Tunnel Field Effect Transistors Based on MOSFETs (DMG-TFET) is presented in this paper. The proposed Tunneling FET is extracted from a MOSFET structure by employing an additional electrode in the source region with an appropriate work function to induce holes in the N+ source region and hence makes it as a P+ source region. The electric field is derived which is utilized to extract the expression of the drain current by analytically integrating the band to band tunneling generation rate in the tunneling region based on the potential profile by solving the Poisson's equation. Through this model, the effects of the thin film thickness and gate voltage on the potential, the electric field, and the effects of the thin film thickness on the tunneling current can be studied. To validate our present model we use SILVACO ATLAS device simulator and the analytical results have been compared with it and found a good agreement.

  11. An Evaluation of Bipolar Junction Transistors as Dosimeter for Megavoltage Electron Beams

    Energy Technology Data Exchange (ETDEWEB)

    Passos, Renan Garcia de; Vidal da Silva, Rogerio Matias; Silva, Malana Marcelina Almeida; Souza, Divanizia do Nascimento [Departamento de Fisica, Universidade Federal de Sergipe, Av. Marechal Rondon, sn, Sao Cristovao, SE, 49100-000 (Brazil); Pereira dos Santos, Luiz Antonio [Comissao Nacional de Energia Nuclear, CNEN/CRCN-NE, Av. Prof. Luiz Freire, 1, Recife, PE, 50740-540 (Brazil)

    2015-07-01

    Dosimetry is an extremely important field in medical applications of radiation and nowadays, electron beam is a good option for superficial tumor radiotherapy. Normally, the applied dose to the patient both in diagnostic and therapy must be monitored to prevent injuries and ensure the success of the treatment, therefore, we should always look for improving of the dosimetric methods. Accordingly, the aim of this work is about the use of a bipolar junction transistor (BJT) for electron beam dosimetry. After previous studies, such an electronic device can work as a dosimeter when submitted to ionizing radiation of photon beam. Actually, a typical BJT consists of two PN semiconductor junctions resulting in the NPN structure device, for while, and each semiconductor is named as collector (C), base (B) and emitter (E), respectively. Although the transistor effect, which corresponds to the current amplification, be accurately described by the quantum physics, one can utilize a simple concept from the circuit theory: the base current IB (input signal) is amplified by a factor of β resulting in the collector current IC (output signal) at least one hundred times greater the IB. In fact, the BJT is commonly used as a current amplifier with gain β=I{sub C}/I{sub B}, therefore, it was noticed that this parameter is altered when the device is exposed to ionizing radiation. The current gain alteration can be explained by the trap creation and the positive charges build up, beside the degradation of the lattice structure. Then, variations of the gain of irradiated transistors may justify their use as a dosimeter. Actually, the methodology is based on the measurements of the I{sub C} variations whereas I{sub B} is maintained constant. BC846 BJT type was used for dose monitoring from passive-mode measurements: evaluation of its electrical characteristic before and after irradiation procedure. Thus, IC readings were plotted as a function of the applied dose in 6 MeV electron beam

  12. Sidewall gated double well quasi-one-dimensional resonant tunneling transistors

    Science.gov (United States)

    Kolagunta, V. R.; Janes, D. B.; Melloch, M. R.; Youtsey, C.

    1997-12-01

    We present gating characteristics of submicron vertical resonant tunneling transistors in double quantum well heterostructures. Current-voltage characteristics at room temperature and 77 K for devices with minimum feature widths of 0.9 and 0.7 μm are presented and discussed. The evolution of the I-V characteristics with increasing negative gate biases is related to the change in the lateral confinement, with a transition from a large area 2D to a quasi-1D. Even gating of multiple wells and lateral confinement effects observable at 77 K make these devices ideally suited for applications in multi-valued logic systems and low-dimensional structures.

  13. Understanding the failure mechanisms of microwave bipolar transistors caused by electrostatic discharge

    Science.gov (United States)

    Jin, Liu; Yongguang, Chen; Zhiliang, Tan; Jie, Yang; Xijun, Zhang; Zhenxing, Wang

    2011-10-01

    Electrostatic discharge (ESD) phenomena involve both electrical and thermal effects, and a direct electrostatic discharge to an electronic device is one of the most severe threats to component reliability. Therefore, the electrical and thermal stability of multifinger microwave bipolar transistors (BJTs) under ESD conditions has been investigated theoretically and experimentally. 100 samples have been tested for multiple pulses until a failure occurred. Meanwhile, the distributions of electric field, current density and lattice temperature have also been analyzed by use of the two-dimensional device simulation tool Medici. There is a good agreement between the simulated results and failure analysis. In the case of a thermal couple, the avalanche current distribution in the fingers is in general spatially unstable and results in the formation of current crowding effects and crystal defects. The experimental results indicate that a collector-base junction is more sensitive to ESD than an emitter-base junction based on the special device structure. When the ESD level increased to 1.3 kV, the collector-base junction has been burnt out first. The analysis has also demonstrated that ESD failures occur generally by upsetting the breakdown voltage of the dielectric or overheating of the aluminum-silicon eutectic. In addition, fatigue phenomena are observed during ESD testing, with devices that still function after repeated low-intensity ESDs but whose performances have been severely degraded.

  14. Improved performance of bipolar charge plasma transistor by reducing the horizontal electric field

    Science.gov (United States)

    Bramhane, Lokesh Kumar; Singh, Jawar

    2017-04-01

    In this paper, we have proposed a modified lateral bipolar charge plasma transistor (BCPT). The appropriate work function engineering is used to induce the electron-hole concentrations under different regions. The reduced work function difference and absence of oxide layer (tox) in the proposed lateral BCPT reduce the horizontal electric field (EX) at the emitter. Also, reduced work function difference at base metal contact decreases the electric field at base-emitter and base-collector junctions. 2-D TCAD simulations of the proposed device reveal that there are evenly spaced output characteristic curves, improved cut-off frequency and breakdown voltage. The reduction in horizontal electric field about one-fourth compared to the conventional lateral BCPT results in realistic current gain (β) and reduced on-set voltage makes proposed device suitable for low power applications. The proposed device exhibits improved cut-off frequency (fT = 7.5 GHz) compared to the lateral BCPT (3.7 GHz) and improved current gain (37.67) and same cut-off frequency (= 7.5 GHz) compared to the conventional BJT (β = 26.5 &fT = 7.5 GHz).

  15. GaAsP/InGaP heterojunction bipolar transistors grown by MOCVD

    Science.gov (United States)

    Heidelberger, Christopher; Fitzgerald, Eugene A.

    2017-01-01

    Heterojunction bipolar transistors with GaAsxP1-x bases and collectors and InyGa1-yP emitters were grown on GaAs substrates via metalorganic chemical vapor deposition, fabricated using conventional techniques, and electrically tested. Four different GaAsxP1-x compositions were used, ranging from x = 0.825 to x = 1 (GaAs), while the InyGa1-yP composition was adjusted to remain lattice-matched to the GaAsP. DC gain close to or exceeding 100 is measured for 60 μm diameter devices of all compositions. Physical mechanisms governing base current and therefore current gain are investigated. The collector current is determined not to be affected by the barrier caused by the conduction band offset between the InGaP emitter and GaAsP base. While the collector current for the GaAs/InGaP devices is well-predicted by diffusion of electrons across the quasi-neutral base, the collector current of the GaAsP/InGaP devices exceeds this estimate by an order of magnitude. This results in higher transconductance for GaAsP/InGaP than would be estimated from known material properties.

  16. Radiation damage and defects in NPN bipolar junction transistors irradiated by silicon ions with various energies

    Science.gov (United States)

    Liu, Chaoming; Zhang, Xiaodong; Yang, Jianqun; Li, Xingji; Ma, Guoliang

    2017-10-01

    The characteristic of incident particle is an important factor to evaluate the correlation of radiation damage. It is useful to investigate the influence of incident particle with various energies on radiation effects of BJTs. Radiation effects in bipolar junction transistors are examined under the irradiation with 10, 24 and 40 MeV Si ions in this paper. Based on the electrical performance degradation, it is shown that the change in the reciprocal of current gain is dominated by the ionizing damage during the heavy ion irradiations at low fluence, leading to a non-linear behavior. While at a higher fluence, displacement damage is the domain effect to show a linear curve. Deep level transient spectroscopy (DLTS) is used to analyze the characteristic of the deep level defects induced by irradiations. DLTS results show that for the BJTs under various Si ions irradiations, the types of deep level defects induced by Si ions are similar, while the concentration of the defects is different at the same displacement dose.

  17. Bipolar-power-transistor-based limiter for high frequency ultrasound imaging systems.

    Science.gov (United States)

    Choi, Hojong; Yang, Hao-Chung; Shung, K Kirk

    2014-03-01

    High performance limiters are described in this paper for applications in high frequency ultrasound imaging systems. Limiters protect the ultrasound receiver from the high voltage (HV) spikes produced by the transmitter. We present a new bipolar power transistor (BPT) configuration and compare its design and performance to a diode limiter used in traditional ultrasound research and one commercially available limiter. Limiter performance depends greatly on the insertion loss (IL), total harmonic distortion (THD) and response time (RT), each of which will be evaluated in all the limiters. The results indicated that, compared with commercial limiter, BPT-based limiter had less IL (-7.7 dB), THD (-74.6 dB) and lower RT (43 ns) at 100 MHz. To evaluate the capability of these limiters, they were connected to a 100 MHz single element transducer and a two-way pulse-echo test was performed. It was found that the -6 dB bandwidth and sensitivity of the transducer using BPT-based limiter were better than those of the commercial limiter by 22% and 140%, respectively. Compared to the commercial limiter, BPT-based limiter is shown to be capable of minimizing signal attenuation, RT and THD at high frequencies and is thus suited for high frequency ultrasound applications. Copyright © 2013 Elsevier B.V. All rights reserved.

  18. Heat removal from bipolar transistor by loop heat pipe with nickel and copper porous structures.

    Science.gov (United States)

    Nemec, Patrik; Smitka, Martin; Malcho, Milan

    2014-01-01

    Loop heat pipes (LHPs) are used in many branches of industry, mainly for cooling of electrical elements and systems. The loop heat pipe is a vapour-liquid phase-change device that transfers heat from evaporator to condenser. One of the most important parts of the LHP is the porous wick structure. The wick structure provides capillary force to circulate the working fluid. To achieve good thermal performance of LHP, capillary wicks with high permeability and porosity and fine pore radius are expected. The aim of this work was to develop porous structures from copper and nickel powder with different grain sizes. For experiment copper powder with grain size of 50 and 100 μm and nickel powder with grain size of 10 and 25 μm were used. Analysis of these porous structures and LHP design are described in the paper. And the measurements' influences of porous structures in LHP on heat removal from the insulated gate bipolar transistor (IGBT) have been made.

  19. Junction-to-Case Thermal Resistance of a Silicon Carbide Bipolar Junction Transistor Measured

    Science.gov (United States)

    Niedra, Janis M.

    2006-01-01

    Junction temperature of a prototype SiC-based bipolar junction transistor (BJT) was estimated by using the base-emitter voltage (V(sub BE)) characteristic for thermometry. The V(sub BE) was measured as a function of the base current (I(sub B)) at selected temperatures (T), all at a fixed collector current (I(sub C)) and under very low duty cycle pulse conditions. Under such conditions, the average temperature of the chip was taken to be the same as that of the temperature-controlled case. At increased duty cycle such as to substantially heat the chip, but same I(sub C) pulse height, the chip temperature was identified by matching the V(sub BE) to the thermometry curves. From the measured average power, the chip-to-case thermal resistance could be estimated, giving a reasonable value. A tentative explanation for an observed bunching with increasing temperature of the calibration curves may relate to an increasing dopant atom ionization. A first-cut analysis, however, does not support this.

  20. Heat Removal from Bipolar Transistor by Loop Heat Pipe with Nickel and Copper Porous Structures

    Directory of Open Access Journals (Sweden)

    Patrik Nemec

    2014-01-01

    Full Text Available Loop heat pipes (LHPs are used in many branches of industry, mainly for cooling of electrical elements and systems. The loop heat pipe is a vapour-liquid phase-change device that transfers heat from evaporator to condenser. One of the most important parts of the LHP is the porous wick structure. The wick structure provides capillary force to circulate the working fluid. To achieve good thermal performance of LHP, capillary wicks with high permeability and porosity and fine pore radius are expected. The aim of this work was to develop porous structures from copper and nickel powder with different grain sizes. For experiment copper powder with grain size of 50 and 100 μm and nickel powder with grain size of 10 and 25 μm were used. Analysis of these porous structures and LHP design are described in the paper. And the measurements’ influences of porous structures in LHP on heat removal from the insulated gate bipolar transistor (IGBT have been made.

  1. Understanding the failure mechanisms of microwave bipolar transistors caused by electrostatic discharge

    International Nuclear Information System (INIS)

    Liu Jin; Chen Yongguang; Tan Zhiliang; Yang Jie; Zhang Xijun; Wang Zhenxing

    2011-01-01

    Electrostatic discharge (ESD) phenomena involve both electrical and thermal effects, and a direct electrostatic discharge to an electronic device is one of the most severe threats to component reliability. Therefore, the electrical and thermal stability of multifinger microwave bipolar transistors (BJTs) under ESD conditions has been investigated theoretically and experimentally. 100 samples have been tested for multiple pulses until a failure occurred. Meanwhile, the distributions of electric field, current density and lattice temperature have also been analyzed by use of the two-dimensional device simulation tool Medici. There is a good agreement between the simulated results and failure analysis. In the case of a thermal couple, the avalanche current distribution in the fingers is in general spatially unstable and results in the formation of current crowding effects and crystal defects. The experimental results indicate that a collector-base junction is more sensitive to ESD than an emitter-base junction based on the special device structure. When the ESD level increased to 1.3 kV, the collector-base junction has been burnt out first. The analysis has also demonstrated that ESD failures occur generally by upsetting the breakdown voltage of the dielectric or overheating of the aluminum-silicon eutectic. In addition, fatigue phenomena are observed during ESD testing, with devices that still function after repeated low-intensity ESDs but whose performances have been severely degraded. (semiconductor devices)

  2. A novel high breakdown voltage lateral bipolar transistor on SOI with multizone doping and multistep oxide

    International Nuclear Information System (INIS)

    Loan, Sajad A; Qureshi, S; Kumar Iyer, S S

    2009-01-01

    A novel high breakdown voltage lateral bipolar junction transistor (LBJT) on silicon-on- insulator (SOI) is proposed. The novelty of the device is the use of the combination of multistep-doped drift region and multistep buried oxide. The steps in doping and in oxide thickness have been used as a replacement for much complex linearly varying drift doping and linearly varying oxide thickness. The LBJT structure incorporating the combination of multistep doping and multistep oxide is analyzed for electrical characteristics using a two-dimensional numerical simulator MEDICI. Numerical simulation has demonstrated that the breakdown voltage of the proposed device with a two-zone step doped (TZSD) drift region is >150% higher than the conventional device. It has been observed that increasing the number of doping zones to 3 from 2 results in a >40% rise in breakdown voltage. The proposed device gives high breakdown voltage even at high doping concentration in the collector drift region. This reduces the on-resistance of the device and thus improves its speed. The dependence of breakdown voltage on various device parameters has been extensively studied to achieve optimum device performance. A process flow for the device fabrication is also being proposed

  3. Effect of bias condition on heavy ion radiation in bipolar junction transistors

    Science.gov (United States)

    Liu, Chao-Ming; Li, Xing-Ji; Geng, Hong-Bin; Yang, De-Zhuang; He, Shi-Yu

    2012-08-01

    The characteristic degradations in a silicon NPN bipolar junction transistor (BJT) of 3DG142 type are examined under irradiation with 40-MeV chlorine (Cl) ions under forward, grounded, and reverse bias conditions, respectively. Different electrical parameters are in-situ measured during the exposure under each bias condition. From the experimental data, a larger variation of base current (IB) is observed after irradiation at a given value of base-emitter voltage (VBE), while the collector current is slightly affected by irradiation at a given VBE. The gain degradation is affected mostly by the behaviour of the base current. From the experimental data, the variation of current gain in the case of forward bias is much smaller than that in the other conditions. Moreover, for 3DG142 BJT, the current gain degradation in the case of reverse bias is more severe than that in the grounded case at low fluence, while at high fluence, the gain degradation in the reverse bias case becomes smaller than that in the grounded case.

  4. Bipolar junction transistor as a detector for measuring in diagnostic X-ray beams

    Energy Technology Data Exchange (ETDEWEB)

    Cavalcanti, Francisco A.; Monte, David S.; Alves, Aline N.; Barros, Fabio R.; Santos, Marcus A.P.; Santos, Luiz A.P., E-mail: franciscoacavalcanti@gmail.com, E-mail: lasantos@cnen.gov.br [Centro Regional de Ciencias Nucleares do Nordeste (CRCN-NE/CNEN-PE), Recife, PE (Brazil)

    2013-07-01

    Photodiode and phototransistor are the most frequently used devices for measuring ionizing radiation in medical applications. The cited devices have the operating principle well known, however the bipolar junction transistor (BJT) is not a typical device used as a detector for measuring some physical quantities for diagnostic radiation. In fact, a photodiode, for example, has an area about 10 mm square and a BJT has an area which can be more than 10 thousands times smaller. The purpose of this paper is to bring a new technique to estimate some physical quantities or parameters in diagnostic radiation; for example, peak kilovoltage (kVp), deep dose measurements. The methodology for each type of evaluation depends on the energy range of the radiation and the physical quantity or parameter to be measured. Actually, some characteristics of the incident radiation under the device can be correlated with the readout signal, which is a function of the electrical currents in the electrodes of the BJT: Collector, Base and Emitter. Samples of BJT are classified and submitted to diagnostic X-ray beams. The results show that the BJT could be a new semiconductor sensor type for measuring either the ionizing radiation dose or some characteristics of diagnostic X-ray beams. (author)

  5. Tunnel field-effect transistors based on InP-GaAs heterostructure nanowires.

    Science.gov (United States)

    Ganjipour, Bahram; Wallentin, Jesper; Borgström, Magnus T; Samuelson, Lars; Thelander, Claes

    2012-04-24

    We present tunneling field-effect transistors fabricated from InP-GaAs heterostructure nanowires with an n-i-p doping profile, where the intrinsic InP region is modulated by a top gate. The devices show an inverse subthreshold slope down to 50 mV/dec averaged over two decades with an on/off current ratio of approximately 10(7) for a gate voltage swing (V(GS)) of 1 V and an on-current of 2.2 μA/μm. Low-temperature measurements suggest a mechanism of trap-assisted tunneling, possibly explained by a narrow band gap segment of InGaAsP.

  6. ON current enhancement of nanowire Schottky barrier tunnel field effect transistors

    Science.gov (United States)

    Takei, Kohei; Hashimoto, Shuichiro; Sun, Jing; Zhang, Xu; Asada, Shuhei; Xu, Taiyu; Matsukawa, Takashi; Masahara, Meishoku; Watanabe, Takanobu

    2016-04-01

    Silicon nanowire Schottky barrier tunnel field effect transistors (NW-SBTFETs) are promising structures for high performance devices. In this study, we fabricated NW-SBTFETs to investigate the effect of nanowire structure on the device characteristics. The NW-SBTFETs were operated with a backgate bias, and the experimental results demonstrate that the ON current density is enhanced by narrowing the width of the nanowire. We confirmed using the Fowler-Nordheim plot that the drain current in the ON state mainly comprises the quantum tunneling component through the Schottky barrier. Comparison with a technology computer aided design (TCAD) simulation revealed that the enhancement is attributed to the electric field concentration at the corners of cross-section of the NW. The study findings suggest an effective approach to securing the ON current by Schottky barrier width modulation.

  7. Auger generation as an intrinsic limit to tunneling field-effect transistor performance

    Energy Technology Data Exchange (ETDEWEB)

    Teherani, James T., E-mail: j.teherani@columbia.edu [Department of Electrical Engineering, Columbia University, New York, New York 10027 (United States); Agarwal, Sapan [Sandia National Laboratories, Albuquerque, New Mexico 87123 (United States); Chern, Winston; Antoniadis, Dimitri A. [Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139 (United States); Solomon, Paul M. [IBM T.J. Watson Research Center, Yorktown Heights, New York 10598 (United States); Yablonovitch, Eli [Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720 (United States)

    2016-08-28

    Many in the microelectronics field view tunneling field-effect transistors (TFETs) as society's best hope for achieving a >10× power reduction for electronic devices; however, despite a decade of considerable worldwide research, experimental TFET results have significantly underperformed simulations and conventional MOSFETs. To explain the discrepancy between TFET experiments and simulations, we investigate the parasitic leakage current due to Auger generation, an intrinsic mechanism that cannot be mitigated with improved material quality or better device processing. We expose the intrinsic link between the Auger and band-to-band tunneling rates, highlighting the difficulty of increasing one without the other. From this link, we show that Auger generation imposes a fundamental limit on ultimate TFET performance.

  8. Design of double gate vertical tunnel field effect transistor using HDB and its performance estimation

    Science.gov (United States)

    Seema; Chauhan, Sudakar Singh

    2018-05-01

    In this paper, we demonstrate the double gate vertical tunnel field-effect transistor using homo/hetero dielectric buried oxide (HDB) to obtain the optimized device characteristics. In this concern, the existence of double gate, HDB and electrode work-function engineering enhances DC performance and Analog/RF performance. The use of electrostatic doping helps to achieve higher on-current owing to occurrence of higher tunneling generation rate of charge carriers at the source/epitaxial interface. Further, lightly doped drain region and high- k dielectric below channel and drain region are responsible to suppress the ambipolar current. Simulated results clarifies that proposed device have achieved the tremendous performance in terms of driving current capability, steeper subthreshold slope (SS), drain induced barrier lowering (DIBL), hot carrier effects (HCEs) and high frequency parameters for better device reliability.

  9. A computational study of vertical tunneling transistors based on graphene-WS2 heterostructure

    Science.gov (United States)

    Horri, A.; Faez, R.; Pourfath, M.; Darvish, G.

    2017-06-01

    In this paper, for the first time, we present a computational study on electrical characteristics of field effect tunneling transistors based on a vertical graphene-WS2 heterostructure and vertical graphene nanoribbon (GNR)-WS2 heterostructure (VTGNRFET). Our model uses the nonequilibrium Green's function formalism along with an atomistic tight binding (TB) method. The TB parameters are extracted by fitting the bandstructure to first principles results. We show that, due to the advantage of switching between tunneling and thermionic transport regimes, an improvement can be achieved in the electrical characteristics of the device. We find that the increase of the number of WS2 layers enhances the on/off conductance ratio but degrades the intrinsic gate-delay time. The results indicate that the on/off conductance ratio of VTGNRFET increases with decreasing the GNR width.

  10. Impact of momentum mismatch on 2D van der Waals tunnel field-effect transistors

    Science.gov (United States)

    Cao, Jiang; Logoteta, Demetrio; Pala, Marco G.; Cresti, Alessandro

    2018-02-01

    We numerically investigate electron quantum transport in 2D van der Waals tunnel field-effect-transistors in the presence of lateral momentum mismatch induced by lattice mismatch or rotational misalignment between the two-dimensional layers. We show that a small momentum mismatch induces a threshold voltage shift without altering the subthreshold swing. On the contrary, a large momentum mismatch produces significant potential variations and ON-current reduction. Short-range scattering, such as that due to phonons or system edges, enables momentum variations, thus enhancing interlayer tunneling. The coupling of electrons with acoustic phonons is shown to increase the ON current without affecting the subthreshold swing. In the case of optical phonons, the ON-current increase is accompanied by a subthreshold swing degradation due to the inelastic nature of the scattering.

  11. Nanoscale III-V on Si-based junctionless tunnel transistor for EHF band applications

    Science.gov (United States)

    Goswami, Yogesh; Asthana, Pranav; Ghosh, Bahniman

    2017-06-01

    A single gate III-V junctionless tunnel field effect transistor (SG-JLTFET) has been reported which shows excellent dc characteristics at low power supply operation. This device has a thin uniformly n-type doped channel of GaSb i.e. gallium antimonide which is grown epitaxially over silicon substrate. The DC performance parameters such as {I}{ON}, {I}{ON}/{I}{OFF}, average and point subthreshold slope as well as device parameters for analog applications viz. transconductance {g}{{m}}, transconductance generation efficiency {g}{{m}}/{I}{{D}}, various capacitances and the unity gain frequency {f}{{T}} are studied using a device simulator. Along with examining its endurance to short channel effects, the performances are also compared with a Silicon Dual Gate Junctionless Tunnel FET (DG-JLTFET). The DC and small signal analog performance reflects that GaSb SG-JLTFET has immense purview for extreme high-frequency and low-power applications.

  12. Optical pulse generation in a transistor laser via intra-cavity photon-assisted tunneling and excess base carrier redistribution

    Energy Technology Data Exchange (ETDEWEB)

    Feng, M.; Iverson, E. W.; Wang, C. Y.; Holonyak, N. [Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, 208 N. Wright St., Urbana, Illinois 61801 (United States)

    2015-11-02

    For a direct-gap semiconductor (e.g., a p-n junction), photon-assisted tunneling is known to exhibit a high nonlinear absorption. In a transistor laser, as discussed here, the coherent photons generated at the quantum well interact with the collector junction field and “assist” electron tunneling from base to collector, thus resulting in the nonlinear modulation of the laser and the realization of optical pulse generation. 1 and 2 GHz optical pulses are demonstrated in the transistor laser using collector voltage control.

  13. Impact of source height on the characteristic of U-shaped channel tunnel field-effect transistor

    Science.gov (United States)

    Yang, Zhaonian; Zhang, Yue; Yang, Yuan; Yu, Ningmei

    2017-11-01

    Tunnel field-effect transistor (TFET) is very attractive in replacing a MOSFET, particularly for low-power nanoelectronic circuits. The U-shaped channel TFET (U-TFET) was proposed to improve the drain-source current with a reduced footprint. In this work, the impact of the source height (HS) on the characteristic of the U-shaped channel tunnel field-effect transistor (U-TFET) is investigated by using TCAD simulation. It is found that with a fixed gate height (HG) the drain-source current has a negative correlation with HS. This is because when the gate region is deeper than the source region, the electric field near the corner of the tunneling junction can be enhanced and the tunneling rate is increased. When HS becomes very thin, the drain-source current is limited by the source region volume. The U-TFET with an n+ pocket is also studied and the same trend is observed.

  14. Temperature sensitivity analysis of polarity controlled electrostatically doped tunnel field-effect transistor

    Science.gov (United States)

    Nigam, Kaushal; Pandey, Sunil; Kondekar, P. N.; Sharma, Dheeraj

    2016-09-01

    The conventional tunnel field-effect transistors (TFETs) have shown potential to scale down in sub-22 nm regime due to its lower sub-threshold slope and robustness against short-channel effects (SCEs), however, sensitivity towards temperature variation is a major concern. Therefore, for the first time, we investigate temperature sensitivity analysis of a polarity controlled electrostatically doped tunnel field-effect transistor (ED-TFET). Different performance metrics and analog/RF figure-of-merits were considered and compared for both devices, and simulations were performed using Silvaco ATLAS device tool. We found that the variation in ON-state current in ED-TFET is almost temperature independent due to electrostatically doped mechanism, while, it increases in conventional TFET at higher temperature. Above room temperature, the variation in ION, IOFF, and SS sensitivity in ED-TFET are only 0.11%/K, 2.21%/K, and 0.63%/K, while, in conventional TFET the variations are 0.43%/K, 2.99%/K, and 0.71%/K, respectively. However, below room temperature, the variation in ED-TFET ION is 0.195%/K compared to 0.27%/K of conventional TFET. Moreover, it is analysed that the incomplete ionization effect in conventional TFET severely affects the drive current and the threshold voltage, while, ED-TFET remains unaffected. Hence, the proposed ED-TFET is less sensitive towards temperature variation and can be used for cryogenics as well as for high temperature applications.

  15. Ultra-High Voltage 4H-SiC Bi-Directional Insulated Gate Bipolar Transistors

    Science.gov (United States)

    Chowdhury, Sauvik

    4H- Silicon Carbide (4H-SiC) is an attractive material for power semiconductor devices due to its large bandgap, high critical electric field and high thermal conductivity compared to Silicon (Si). For ultra-high voltage applications (BV > 10 kV), 4H-SiC Insulated Gate Bipolar Transistors (IGBTs) are favored over unipolar transistors due to lower conduction losses. With improvements in SiC materials and processing technology, promising results have been demonstrated in the area of conventional unidirectional 4H-SiC IGBTs, with breakdown voltage ratings up to 27 kV. This research presents the experimental demonstration of the world's first high voltage bi-directional power transistors in 4H-SiC. Traditionally, four (two IGBTs and two diodes) or two (two reverse blocking IGBTs) semiconductor devices are necessary to yield a bidirectional switch. With a monolithically integrated bidirectional switch as presented here, the number of semiconductor devices is reduced to only one, which results in increased reliability and reduced cost of the overall system. Additionally, by using the unique dual gate operation of BD-IGBTs, switching losses can be reduced to a small fraction of that in conventional IGBTs, resulting in increased efficiency. First, the performance limits of SiC IGBTs are calculated by using analytical methods. The performance benefits of SiC IGBTs over SiC unipolar devices and Si IGBTs are quantified. Numerical simulations are used to optimize the unit cell and edge termination structures for a 15 kV SiC BD-IGBT. The effect of different device parameters on BD-IGBT static and switching performance are quantified. Second, the process technology necessary for the fabrication of high voltage SiC BD-IGBTs is optimized. The effect of different process steps on parameters such as breakdown voltage, carrier lifetime, gate oxide reliability, SiO2-SiC interface charge density is quantified. A carrier lifetime enhancement process has been optimized for lightly doped

  16. Combining axial and radial nanowire heterostructures: radial Esaki diodes and tunnel field-effect transistors.

    Science.gov (United States)

    Dey, Anil W; Svensson, Johannes; Ek, Martin; Lind, Erik; Thelander, Claes; Wernersson, Lars-Erik

    2013-01-01

    The ever-growing demand on high-performance electronics has generated transistors with very impressive figures of merit (Radosavljevic et al., IEEE Int. Devices Meeting 2009, 1-4 and Cho et al., IEEE Int. Devices Meeting 2011, 15.1.1-15.1.4). The continued scaling of the supply voltage of field-effect transistors, such as tunnel field-effect transistors (TFETs), requires the implementation of advanced transistor architectures including FinFETs and nanowire devices. Moreover, integration of novel materials with high electron mobilities, such as III-V semiconductors and graphene, are also being considered to further enhance the device properties (del Alamo, Nature 2011, 479, 317-323, and Liao et al., Nature 2010, 467, 305-308). In nanowire devices, boosting the drive current at a fixed supply voltage or maintaining a constant drive current at a reduced supply voltage may be achieved by increasing the cross-sectional area of a device, however at the cost of deteriorated electrostatics. A gate-all-around nanowire device architecture is the most favorable electrostatic configuration to suppress short channel effects; however, the arrangement of arrays of parallel vertical nanowires to address the drive current predicament will require additional chip area. The use of a core-shell nanowire with a radial heterojunction in a transistor architecture provides an attractive means to address the drive current issue without compromising neither chip area nor device electrostatics. In addition to design advantages of a radial transistor architecture, we in this work illustrate the benefit in terms of drive current per unit chip area and compare the experimental data for axial GaSb/InAs Esaki diodes and TFETs to their radial counterparts and normalize the electrical data to the largest cross-sectional area of the nanowire, i.e. the occupied chip area, assuming a vertical device geometry. Our data on lateral devices show that radial Esaki diodes deliver almost 7 times higher peak

  17. Influence of the flux density on the radiation damage of bipolar silicon transistors by protons and electrons

    International Nuclear Information System (INIS)

    Bannikov, Y.; Gorin, B.; Kozhevnikov, V.; Mikhnovich, V.; Gusev, L.

    1981-01-01

    It was found experimentally that the radiation damage of bipolar n-p-n transistors increased by a factor of 8--12 when the proton flux density was reduced from 4.07 x 10 10 to 2.5 x 10 7 cm -2 sec -1 . In the case of p-n-p transistors the effect was opposite: there was a reduction in the radiation damage by a factor of 2--3 when the dose rate was lowered between the same limits. A similar effect was observed for electrons but at dose rates three orders of magnitude greater. The results were attributed to the dependences of the radiation defect-forming reactions on the charge state of defects which was influenced by the formation of disordered regions in the case of proton irradiation

  18. Effect of parasitic series resistances and spurious currents on the extracted temperature of a bipolar junction transistor.

    Science.gov (United States)

    Mimila-Arroyo, J

    2013-12-01

    Verster's proposition to directly extract the temperature of a bipolar junction transistor using its collector current is widely used. However, the resulting temperature is low accurate even when calibrated. Here, it is demonstrated that the misuse of the emitter current instead of the collector one, because of the presence of spurious currents other than the injection-diffusion one and transistor parasitic series resistances both contribute to the observed inaccuracy. Particularly parasitic series resistances increase the inaccuracy and introduce a strong dependence of the extracted temperature on the collector currents used to extract the temperature; the higher those resistances the higher the inaccuracy. A proposition is made to reduce the effect of those resistances on the inaccuracy of this thermometric element, which allows obtaining a more accurate value on a wider range of the collector probe currents.

  19. A Logarithmic Response Complementary Metal Oxide Semiconductor Image Sensor with Parasitic P-N-P Bipolar Junction Transistor

    Science.gov (United States)

    Lai, Cheng‑Hsiao; Lai, Liang‑Wei; Chiang, Wen‑Jen; King, Ya‑Chin

    2006-04-01

    Logarithmic-response complementary metal oxide semiconductor (CMOS) active pixel sensors provide a desirable attribute of wide dynamic range even with low supply voltages. In this paper, a log-mode pixel with employing parasitic P-N-P bipolar junction transistor (BJT) to amplify photo-current is investigated and optimized. A new log-mode cell with a calibration transistor is proposed to increase the output voltage swing as well as to reduce the fixed pattern noise. The measurement results demonstrate that, the output voltage swing of this new cell is enhanced by 4× and fixed pattern noise (FPN) of a pixel array can be reduced by 10× comparing to that of a conventional log-mode CMOS active pixel sensor.

  20. Characteristics of Novel InGaAsN Double Heterojunction Bipolar Transistors

    Energy Technology Data Exchange (ETDEWEB)

    LI,N.Y.; CHANG,PING-CHIH; BACA,ALBERT G.; LAROCHE,J.R.; REN,F.; ARMOUR,E.; SHARPS,P.R.; HOU,H.Q.

    2000-08-01

    The authors demonstrate, for the first time, both functional Pnp AlGaAs/InGaAsN/GaAs (Pnp InGaAsN) and Npn InGaP/InGaAsN/GaAs (Npn InGaAsN) double heterojunction bipolar transistors (DHBTs) using a 1.2 eV In{sub 0.03}Ga{sub 0.97}As{sub 0.99}N{sub 0.01} as the base layer for low-power electronic applications. The Pnp InGaAsN DHBT has a peak current gain ({beta}) of 25 and a low turn-on voltage (V{sub ON}) of 0.79 V. This low V{sub ON} is {approximately} 0.25 V lower than in a comparable Pnp AlGAAs/GaAs HBT. For the Npn InGaAsN DHBT, it has a low V{sub ON} of 0.81 V, which is 0.13 V lower than in an InGaP/GaAs HBT. A peak {beta} of 7 with nearly ideal I-V characteristics has been demonstrated. Since GaAs is used as the collector of both Npn and Pnp InGaAsN DHBTs, the emitter-collector breakdown voltage (BV{sub CEO}) are 10 and 12 V, respectively, consistent with the BV{sub CEO} of Npn InGaP/GaAs and Pnp AlGaAs/GaAs HBTs of comparable collector thickness and doping level. All these results demonstrate the potential of InGaAsN DHBTs as an alternative for application in low-power electronics.

  1. Copper-Based OHMIC Contracts for the Si/SiGe Heterojunction Bipolar Transistor Structure

    Science.gov (United States)

    Das, Kalyan; Hall, Harvey

    1999-01-01

    Silicon based heterojunction bipolar transistors (HBT) with SiGe base are potentially important devices for high-speed and high-frequency microelectronics. These devices are particularly attractive as they can be fabricated using standard Si processing technology. However, in order to realize the full potential of devices fabricated in this material system, it is essential to be able to form low resistance ohmic contacts using low thermal budget process steps and have full compatibility with VLSI/ULSI processing. Therefore, a study was conducted in order to better understand the contact formation and to develop optimized low resistance contacts to layers with doping densities corresponding to the p-type SiGe base and n-type Si emitter regions of the HBTS. These as-grown doped layers were implanted with BF(sub 2) up to 1 X 10(exp 16)/CM(exp 2) and As up to 5 x 10(exp 15)/CM2, both at 30 keV for the p-type SiGe base and n-type Si emitter layers, respectively, in order to produce a low sheet resistance surface layer. Standard transfer length method (TLM) contact pads on both p and n type layers were deposited using an e-beam evaporated trilayer structure of Ti/CufTi/Al (25)A/1500A/250A/1000A). The TLM pads were delineated by a photoresist lift-off procedure. These contacts in the as-deposited state were ohmic, with specific contact resistances for the highest implant doses of the order of 10(exp -7) ohm-CM2 and lower.

  2. Switching Characteristics of a 4H-SiC Based Bipolar Junction Transistor to 200 C

    Science.gov (United States)

    Niedra, Janis M.

    2006-01-01

    Static curves and resistive load switching characteristics of a 600 V, 4 A rated, SiC-based NPN bipolar power transistor (BJT) were observed at selected temperatures from room to 200 C. All testing was done in a pulse mode at low duty cycle (approx.0.1 percent). Turn-on was driven by an adjustable base current pulse and turn-off was accelerated by a negative base voltage pulse of 7 V. These base drive signals were implemented by 850 V, gated power pulsers, having rise-times of roughly 10 ns, or less. Base charge sweep-out with a 7 V negative pulse did not produce the large reverse base current pulse seen in a comparably rated Si-based BJT. This may be due to a very low charge storage time. The decay of the collector current was more linear than its exponential-like rise. Switching observations were done at base drive currents (I(sub B)) up to 400 mA and collector currents (I(sub C)) up to 4 A, using a 100 Omega non-inductive load. At I(sub B) = 400 mA and I(sub C) = 4 A, turn-on times typically varied from 80 to 94 ns, over temperatures from 23 to 200 C. As expected, lowering the base drive greatly extended the turn-on time. Similarly, decreasing the load current to I(sub C) = 1 A with I(sub B) = 400 mA produced turn-on times as short as 34 ns. Over the 23 to 200 C range, with I(sub B) = 400 mA and I(sub C) = 4 A, turn-off times were in the range of 72 to 84 ns with the 7 V sweep-out.

  3. The mixed-mode reliability stress of silicon-germanium heterojunction bipolar transistors

    Science.gov (United States)

    Zhu, Chendong

    The objective of the dissertation is to combine the recent Mixed-Mode reliability stress studies in silicon-germanium (SiGe) heterojunction bipolar transistors (HBTs). The thesis starts with a review of SiGe HBT fundamentals, development trends, and the conventional reliability stress paths used in industry, following which the new stress path, Mixed-Mode stress, is introduced. Chapter 2 is devoted to an in-depth discussion of damage mechanisms that includes the impact ionization effect and the self-heating effect. Chapter 3 goes onto the impact ionization effect using two-dimensional calibrated MEDICI simulations. Chapter 4 assesses the reliability of SiGe HBTs in extreme temperature environments by way of comprehensive experiments and MEDICI simulations. A comparison of the device lifetimes for reverse-EB stress and mixed-mode stress indicates different damage mechanisms govern these phenomena. The thesis concludes with a summary of the project and suggestions for future research in chapter 5. This dissertation covers the following topics: (1) Introduces a new mixed-mode stress technique: time cumulative stress (Chapter II, also published in [23] and [24]). (2) Identifies impact ionization effects in the stress damage (Chapter II, also published in [23] and [24]). (3) Investigates for the first time mixed-mode damage using TCAD simulations at both room temperature and cryogenic temperatures (Chapter III and IV, also published in [23][24][62]). (4) Analyzes for the first time impact of self-heating on mixed-mode stress response, and identifies a temperature triggered damage threshold (Chapter II, will be published in [25]). (5) Explains the geometrical scaling issues in mixed-mode stress and explores mixed-mode stress reliability scaling trends (Chapter II, will be published in [25]). (6) Assesses for the first time SiGe HBT reliability at cryogenic temperatures (Chapter VI, also published in [62]).

  4. A comparative study on electrical characteristics of 1-kV pnp and npn SiC bipolar junction transistors

    Science.gov (United States)

    Okuda, Takafumi; Kimoto, Tsunenobu; Suda, Jun

    2018-04-01

    We investigate the electrical characteristics of 1-kV pnp SiC bipolar junction transistors (BJTs) and compare them with those of npn SiC BJTs. The base resistance, current gain, and blocking capability are characterized. It is found that the base resistance of pnp SiC BJTs is two orders of magnitude lower than that of npn SiC BJTs. However, the obtained current gains are low below unity in pnp SiC BJTs, whereas npn SiC BJTs exhibit a current gain of 14 without surface passivation. The reason for the poor current gain of pnp SiC BJTs is discussed.

  5. Impact ionization in the base of a hot-electron AlSb/InAs bipolar transistor

    Science.gov (United States)

    Vengurlekar, Arvind S.; Capasso, Federico; Chiu, T. Heng

    1990-01-01

    The operation of a new AlSb/InAs heterojunction bipolar transistor is studied. The electrons are injected into a p-InAs base across the AlSb/InAs heterojunction. The conduction-band discontinuity at this heterojunction is sufficiently large so that energy of the electrons injected into InAs exceeds the threshold for generating electron-hole pairs by impact ionization. The observed incremental common base current at zero collector-base bias decreases and becomes negative as the emitter current is increased, thus providing direct evidence for impact ionization entirely by band-edge discontinuities.

  6. On the choice of a head element for low-noise bipolar transistor amplifier

    International Nuclear Information System (INIS)

    Krasnokutskij, R.N.; Kurchaninov, L.L.; Fedyakin, N.N.; Shuvalov, R.S.

    1988-01-01

    The measurement results of equivalent noise charge (ENC) for KT382 transistor depending on detector capacity, formation duration and collector current are given. It is shown that the measurement results for this transistor in good agreement with calculations according to the noise model, time-consuming ENC measurements can be replaced by preliminary transistor rejection according to the distributed base resistance, current gain and simple calculations. In applications in the field of nuclear electronics the KT382 transistor enables to attain the same noise parameters as NE578, NE021 transistors (Japan) and it can be recommended for using as a head element of amplifiers

  7. Magneto-transport properties of magnetic tunnelling transistors at low and room temperatures

    International Nuclear Information System (INIS)

    Quang, H D; Huu, C X; Oh, S K; Dang, V S; Sinh, N H; Yu, S C

    2006-01-01

    Si(100)/CoFe/AlO x /CoFe/FeMn/Cu/Ta magnetic tunnelling transistors (MTTs) with differing base thicknesses (W) were investigated. The magneto-transport properties of the MTTs were measured at 77 K and room temperature (RT). We obtained magneto-current ratios of 48.3% and 55.9% for emitter-base bias voltages of 1.45 and 2.0 V, respectively, at 77 K. The transfer ratios are 2.83 x 10 -5 and 1.52 x 10 -4 , respectively, corresponding to bias voltages of 1.45 and 2.0 V. Moreover, the highest tunnel magneto-resistance (TMR) ratios turned out to be 12% and 20% for a base thickness of 30 A at RT and 77 K, respectively. These properties raise not only some fundamental questions regarding the phenomenon of spin-independent tunnelling at low and room temperatures, but also show some promising aspect for magneto-electronic applications. In addition, we attempted to elucidate the reason behind the outstanding TMR effect at low and room temperatures. Finally, the origin of the decrease in the mean free path asymmetry (λ↑/λ↓) was clarified by using x-ray photoelectron spectroscopy profile analysis of the elements existing in the interface between Si and the CoFe base (Co, Fe, Al, Si, O)

  8. Subthreshold-swing-adjustable tunneling-field-effect-transistor-based random-access memory for nonvolatile operation

    Science.gov (United States)

    Huh, In; Cheon, Woo Young; Choi, Woo Young

    2016-04-01

    A subthreshold-swing-adjustable tunneling-field-effect-transistor-based random-access memory (SAT RAM) has been proposed and fabricated for low-power nonvolatile memory applications. The proposed SAT RAM cell demonstrates adjustable subthreshold swing (SS) depending on stored information: small SS in the erase state ("1" state) and large SS in the program state ("0" state). Thus, SAT RAM cells can achieve low read voltage (Vread) with a large memory window in addition to the effective suppression of ambipolar behavior. These unique features of the SAT RAM are originated from the locally stored charge, which modulates the tunneling barrier width (Wtun) of the source-to-channel tunneling junction.

  9. Ferroelectric gate tunnel field-effect transistors with low-power steep turn-on

    Directory of Open Access Journals (Sweden)

    M. H. Lee

    2014-10-01

    Full Text Available Using a ferroelectric PbZrTiO3 gate stack, the range of the steep subthreshold swing in tunnel field-effect transistors was extended by 3.5 orders of magnitude demonstrating an improvement in the swing (by approximately double the slope. The drain conductance (gd shows only 16% enhancement with large V DS (∼−1.5V indicates internal voltage amplification with ferroelectric negative capacitance effect beneficial to small lateral drain-source bias voltages (−0.1 V. The concept of coupling the ferroelectric polarization is proposed. The power consumption is also discussed in low-power applications of steep subthreshold slope devices.

  10. On the role of disorder on graphene and graphene nanoribbon-based vertical tunneling transistors

    International Nuclear Information System (INIS)

    Ghobadi, Nayereh; Pourfath, Mahdi

    2014-01-01

    In this work, the characteristics of vertical tunneling field-effect transistors based on graphene (VTGFET) and graphene nanoribbon heterostructure (VTGNRFET) in the presence of disorder are theoretically investigated. An statistical analysis based on an atomistic tight-binding model for the electronic bandstructure along with the non-equilibrium Green's function formalism are employed. We study the dependence of the averaged density of states, transmission probability, on- and off-state conductances, on/off conductance ratio, and transfer characteristics on the substrate induced potential fluctuations and vacancies. In addition, the variabilities of the device characteristics due to the presence of disorder are evaluated. It can be inferred from the results that while introducing vacancies cause a relatively modest suppression of the transmission probability, potential fluctuations lead to the significant increase of transmission probability and conductance of the device. Moreover, the results show that the transport properties of VTGFET are more robust against disorder compared to VTGNRFET

  11. InAs/GaSb heterostructure nanowires for tunnel field-effect transistors.

    Science.gov (United States)

    Borg, B Mattias; Dick, Kimberly A; Ganjipour, Bahram; Pistol, Mats-Erik; Wernersson, Lars-Erik; Thelander, Claes

    2010-10-13

    InAs/GaSb nanowire heterostructures with thin GaInAs inserts were grown by MOVPE and characterized by electrical measurements and transmission electron microscopy. Down-scaling of the insert thickness was limited because of an observed sensitivity of GaSb nanowire growth to the presence of In. By employing growth interrupts in between the InAs and GaInAs growth steps it was possible to reach an insert thickness down to 25 nm. Two-terminal devices show a diode behavior, where temperature-dependent measurements indicate a heterostructure barrier height of 0.5 eV, which is identified as the valence band offset between the InAs and GaSb. Three-terminal transistor structures with a top-gate positioned at the heterointerface show clear indications of band-to-band tunnelling.

  12. Two-zone SiGe base heterojunction bipolar charge plasma transistor for next generation analog and RF applications

    Science.gov (United States)

    Bramhane, Lokesh Kumar; Singh, Jawar

    2017-01-01

    For next generation terahertz applications, heterojunction bipolar transistor (HBT) with reduced dimensions and charge plasma (CP) can be a potential candidate due to simplified and inexpensive process. In this paper, a symmetric lateral two-zone SiGe base heterojunction bipolar charge plasma transistor (HBCPT) with an extruded (extended) base is proposed and its performance at circuit level is studied. The linearly graded electric field in the proposed HBCPT provides improved self gain (β) and cut-off frequency (fT). Two-dimensional (2-D) TCAD and small-signal model based simulations of the proposed HBCPT demonstrates high self gain β 35-172.93 and fT of 1-4 THz for different device parameters. Moreover, fT of 1104.9 GHz and β of 35 can be achieved by decreasing Nb up to 8.2 ×1017cm-3 . Although, fT of 2 THz and 4 THz can also be achieved by reducing the base resistance up to 10 Ω and increasing the emitter/collector length up to 63 nm, respectively. The small-signal analysis of common-emitter amplifier based on the proposed HBCPT demonstrate high voltage gain of 50.11 as compared to conventional HBT (18.1).

  13. Analysis of the dynamic avalanche of carrier stored trench bipolar transistor (CSTBT) during clamped inductive turn-off transient

    Science.gov (United States)

    Xue, Peng; Fu, Guicui

    2017-03-01

    The dynamic avalanche has a huge impact on the switching robustness of carrier stored trench bipolar transistor (CSTBT). The purpose of this work is to investigate the CSTBT's dynamic avalanche mechanism during clamped inductive turn-off transient. At first, with a Mitsubishi 600 V/150 A CSTBT and a Infineon 600 V/200 A field stop insulated gate bipolar transistor (FS-IGBT) utilized, the clamped inductive turn-off characteristics are obtained by double pulse test. The unclamped inductive switching (UIS) test is also utilized to identify the CSTBT's clamping voltage under dynamic avalanche condition. After the test data analysis, it is found that the CSTBT's dynamic avalanche is abnormal and can be triggered under much looser condition than the conventional buffer layer IGBT. The comparison between the FS-IGBT and CSTBT's experimental results implies that the CSTBT's abnormal dynamic avalanche phenomenon may be induced by the carrier storage (CS) layer. Based on the semiconductor physics, the electric field distribution and dynamic avalanche generation in the depletion region are analyzed. The analysis confirms that the CS layer is the root cause of the CSTBT's abnormal dynamic avalanche mechanism. Moreover, the CSTBT's negative gate capacitance effect is also investigated to clarify the underlying mechanism of the gate voltage bump observed in the test. In the end, the mixed-mode numerical simulation is utilized to reproduce the CSTBT's dynamic avalanche behavior. The simulation results validate the proposed dynamic avalanche mechanisms.

  14. Effect of thin emitter set-back layer on GaAs delta-doped emitter bipolar junction transistor

    Science.gov (United States)

    Lew, K. L.; Yoon, S. F.

    2005-05-01

    GaAs delta-doped emitter bipolar junction transistors (δ-BJT) with different emitter set-back layer thicknesses of 10to50nm were fabricated to study the emitter set-back layer thickness effect on device dc performance. We found that the current gain decreases following decrease in the emitter set-back layer thickness. A detailed analysis was performed to explain this phenomenon, which is believed to be caused by reduction of the effective barrier height in the δ-BJT. This is due to change in the electric-field distribution in the delta-doped structure caused by the built-in potential of the base-emitter (B-E ) junction. Considering the recombination and barrier height reduction effects, the thickness of the emitter set-back layer should be designed according to the B-E junction depletion width with a tolerance of ±5nm. The dc performance of a δ-BJT designed based on this criteria is compared to that of a Al0.25Ga0.75As /GaAs heterojunction bipolar transistor (HBT). Both devices employed base doping of 2×1019cm-3 and base-to-emitter doping ratio of 40. Large emitter area (AE≈1.6×10-5cm-2) and small emitter area (AE≈1.35×10-6cm-2) device current gains of 40 and 20, respectively, were obtained in both types of transistors passivated by (NH4)2S treatment. The measured current gain of the GaAs δ-BJT is the highest reported for a homojunction device with such high base-to-emitter doping ratio normally used in HBT devices.

  15. Low Gate Voltage Operated Multi-emitter-dot H+ Ion-Sensitive Gated Lateral Bipolar Junction Transistor

    Science.gov (United States)

    Yuan, Heng; Zhang, Ji-Xing; Zhang, Chen; Zhang, Ning; Xu, Li-Xia; Ding, Ming; Patrick, J. Clarke

    2015-02-01

    A low gate voltage operated multi-emitter-dot gated lateral bipolar junction transistor (BJT) ion sensor is proposed. The proposed device is composed of an arrayed gated lateral BJT, which is driven in the metal-oxide-semiconductor field-effect transistor (MOSFET)-BJT hybrid operation mode. Further, it has multiple emitter dots linked to each other in parallel to improve ionic sensitivity. Using hydrogen ionic solutions as reference solutions, we conduct experiments in which we compare the sensitivity and threshold voltage of the multi-emitter-dot gated lateral BJT with that of the single-emitter-dot gated lateral BJT. The multi-emitter-dot gated lateral BJT not only shows increased sensitivity but, more importantly, the proposed device can be operated under very low gate voltage, whereas the conventional ion-sensitive field-effect transistors cannot. This special characteristic is significant for low power devices and for function devices in which the provision of a gate voltage is difficult.

  16. Core-shell homojunction silicon vertical nanowire tunneling field-effect transistors

    Science.gov (United States)

    Yoon, Jun-Sik; Kim, Kihyun; Baek, Chang-Ki

    2017-01-01

    We propose three-terminal core-shell (CS) silicon vertical nanowire tunneling field-effect transistors (TFETs), which can be fabricated by conventional CMOS technology. CS TFETs show lower subthreshold swing (SS) and higher on-state current than conventional TFETs through their high surface-to-volume ratio, which increases carrier-tunneling region with no additional device area. The on-state current can be enhanced by increasing the nanowire height, decreasing equivalent oxide thickness (EOT) or creating a nanowire array. The off-state current is also manageable for power saving through selective epitaxial growth at the top-side nanowire region. CS TFETs with an EOT of 0.8 nm and an aspect ratio of 20 for the core nanowire region provide the largest drain current ranges with point SS values below 60 mV/dec and superior on/off current ratio under all operation voltages of 0.5, 0.7, and 1.0 V. These devices are promising for low-power applications at low fabrication cost and high device density. PMID:28112273

  17. Core-shell homojunction silicon vertical nanowire tunneling field-effect transistors

    Science.gov (United States)

    Yoon, Jun-Sik; Kim, Kihyun; Baek, Chang-Ki

    2017-01-01

    We propose three-terminal core-shell (CS) silicon vertical nanowire tunneling field-effect transistors (TFETs), which can be fabricated by conventional CMOS technology. CS TFETs show lower subthreshold swing (SS) and higher on-state current than conventional TFETs through their high surface-to-volume ratio, which increases carrier-tunneling region with no additional device area. The on-state current can be enhanced by increasing the nanowire height, decreasing equivalent oxide thickness (EOT) or creating a nanowire array. The off-state current is also manageable for power saving through selective epitaxial growth at the top-side nanowire region. CS TFETs with an EOT of 0.8 nm and an aspect ratio of 20 for the core nanowire region provide the largest drain current ranges with point SS values below 60 mV/dec and superior on/off current ratio under all operation voltages of 0.5, 0.7, and 1.0 V. These devices are promising for low-power applications at low fabrication cost and high device density.

  18. Representation of type I heterostructure junctionless tunnel field effect transistor for high-performance logic application

    Science.gov (United States)

    Molaei Imen Abadi, Rouzbeh; Sedigh Ziabari, Seyed Ali

    2016-06-01

    In this paper, a gate-all-around junctionless tunnel field effect transistor (JLTFET) based on heterostructure of compound and group III-V semiconductors is introduced and simulated. In order to blend the high tunneling efficiency of narrow band gap material JLTFETs and the high electron mobility of III-V JLTFETs, a type I heterostructure junctionless TFET adopting Ge-AlxGa1- xAs-Ge system has been optimized by numerical simulation in terms of aluminum (Al) composition. To improve device performance, we considered a nanowire structure, and it was illustrated that high-performance logic technology can be achieved by the proposed device. The optimal Al composition founded to be around 20 % ( x = 0.2). The numerical simulation results demonstrate that the proposed device has low leakage current I OFF of ~1.9 × 10-17, I ON of 4 µA/µm, I ON/ I OFF current ratio of 1.7 × 1011 and subthreshold swing SS of 12.6 mV/decade at the 40 nm gate length and temperature of 300 K.

  19. Abrupt current switching in graphene bilayer tunnel transistors enabled by van Hove singularities

    Science.gov (United States)

    Alymov, Georgy; Vyurkov, Vladimir; Ryzhii, Victor; Svintsov, Dmitry

    2016-01-01

    In a continuous search for the energy-efficient electronic switches, a great attention is focused on tunnel field-effect transistors (TFETs) demonstrating an abrupt dependence of the source-drain current on the gate voltage. Among all TFETs, those based on one-dimensional (1D) semiconductors exhibit the steepest current switching due to the singular density of states near the band edges, though the current in 1D structures is pretty low. In this paper, we propose a TFET based on 2D graphene bilayer which demonstrates a record steep subthreshold slope enabled by van Hove singularities in the density of states near the edges of conduction and valence bands. Our simulations show the accessibility of 3.5 × 104 ON/OFF current ratio with 150 mV gate voltage swing, and a maximum subthreshold slope of (20 μV/dec)−1 just above the threshold. The high ON-state current of 0.8 mA/μm is enabled by a narrow (~0.3 eV) extrinsic band gap, while the smallness of the leakage current is due to an all-electrical doping of the source and drain contacts which suppresses the band tailing and trap-assisted tunneling. PMID:27098051

  20. High performance tunnel field-effect transistor by gate and source engineering.

    Science.gov (United States)

    Huang, Ru; Huang, Qianqian; Chen, Shaowen; Wu, Chunlei; Wang, Jiaxin; An, Xia; Wang, Yangyuan

    2014-12-19

    As one of the most promising candidates for future nanoelectronic devices, tunnel field-effect transistors (TFET) can overcome the subthreshold slope (SS) limitation of MOSFET, whereas high ON-current, low OFF-current and steep switching can hardly be obtained at the same time for experimental TFETs. In this paper, we developed a new nanodevice technology based on TFET concepts. By designing the gate configuration and introducing the optimized Schottky junction, a multi-finger-gate TFET with a dopant-segregated Schottky source (mFSB-TFET) is proposed and experimentally demonstrated. A steeper SS can be achieved in the fabricated mFSB-TFET on the bulk Si substrate benefiting from the coupled quantum band-to-band tunneling (BTBT) mechanism, as well as a high I(ON)/I(OFF) ratio (∼ 10(7)) at V(DS) = 0.2 V without an area penalty. By compatible SOI CMOS technology, the fabricated Si mFSB-TFET device was further optimized with a high ION/IOFF ratio of ∼ 10(8) and a steeper SS of over 5.5 decades of current. A minimum SS of below 60 mV dec(-1) was experimentally obtained, indicating its dominant quantum BTBT mechanism for switching.

  1. Improvement of Current Gain in Triple Ion Implanted 4H-SiC Bipolar Junction Transistor with Etched Extrinsic Base Regions

    Science.gov (United States)

    Tajima, Taku; Nakamura, Tadashi; Satoh, Masataka; Nakamura, Tohru

    We demonstrate triple ion implanted 4H-SiC bipolar junction transistor (BJT). By etching the extrinsic base regions using inductively coupled plasma dry etching, the characteristics of triple ion implanted 4H-SiC BJT were significantly improved. Maximum common emitter current gain was improved from 1.7 to 7.5.

  2. A Steep-Slope Transistor Combining Phase-Change and Band-to-Band-Tunneling to Achieve a sub-Unity Body Factor

    OpenAIRE

    W. A. Vitale; E. A. Casu; A. Biswas; T. Rosca; C. Alper

    2017-01-01

    Steep-slope transistors allow to scale down the supply voltage and the energy per computed bit of information as compared to conventional field-effect transistors (FETs), due to their sub-60 mV/decade subthreshold swing at room temperature. Currently pursued approaches to achieve such a subthermionic subthreshold swing consist in alternative carrier injection mechanisms, like quantum mechanical band-to-band tunneling (BTBT) in Tunnel FETs or abrupt phase-change in metal-insulator transition (...

  3. Insights into operation of planar tri-gate tunnel field effect transistor for dynamic memory application

    Science.gov (United States)

    Navlakha, Nupur; Kranti, Abhinav

    2017-07-01

    Insights into device physics and operation through the control of energy barriers are presented for a planar tri-gate Tunnel Field Effect Transistor (TFET) based dynamic memory. The architecture consists of a double gate (G1) at the source side and a single gate (G2) at the drain end of the silicon film. Dual gates (G1) effectively enhance the tunneling based read mechanism through the enhanced coupling and improved electrostatic control over the channel. The single gate (G2) controls the holes in the potential barrier induced through the proper selection of bias and workfunction. The results indicate that the planar tri-gate achieves optimum performance evaluated in terms of two composite metrics (M1 and M2), namely, product of (i) Sense Margin (SM) and Retention Time (RT) i.e., M1 = SM × RT and (ii) Sense Margin and Current Ratio (CR) i.e., M2 = SM × CR. The regulation of barriers created by the gates (G1 and G2) through the optimal use of device parameters leads to better performance metrics, with significant improvement at scaled lengths as compared to other tunneling based dynamic memory architectures. The investigation shows that lengths of G1, G2 and lateral spacing can be scaled down to 25 nm, 50 nm, and 30 nm, respectively, while achieving reasonable values for (M1, M2). The work demonstrates a systematic approach to showcase the advancement in TFET based Dynamic Random Access Memory (DRAM) through the use of planar tri-gate topology at a lower bias value. The concept, design, and operation of planar tri-gate architecture provide valuable viewpoints for TFET based DRAM.

  4. Gate voltage dependent characteristics of p-n diodes and bipolar transistors based on multiwall CN(x)/carbon nanotube intramolecular junctions.

    Science.gov (United States)

    Zhang, W J; Zhang, Q F; Chai, Y; Shen, X; Wu, J L

    2007-10-03

    The electrical transport characteristics of multiwall CN(x)/carbon nanotube intramolecular junctions were studied. The junctions could be used as diodes. We found that the rectification resulted from p-n junctions, not from metal-semiconductor junctions. The gate effect was very weak when the diodes were reverse biased. At forward bias, however, some of the p-n diodes could be n-type transistors. Experimental results supported the opinion that the gate voltage dependent property is derived from the Schottky barrier between the CN(x) part and the electrode. Using p-n diodes, a bipolar transistor with nanoscale components was built, whose behavior was very similar to that of a conventional planar bipolar transistor.

  5. Influence of layout design and on-wafer heatspreaders on the thermal behavior of fully-isolated bipolar transistors: Part I - Static analysis

    Science.gov (United States)

    Russo, Salvatore; Spina, Luigi La; d'Alessandro, Vincenzo; Rinaldi, Niccolò; Nanver, Lis K.

    2010-08-01

    The impact of layout parameters on the steady-state thermal behavior of bipolar junction transistors (BJTs) with full dielectric isolation is extensively analyzed by accurate DC measurements and 3-D numerical simulations. The influence of the aspect ratio of the emitter stripe, as well as the consequences of device scaling, are investigated from a thermal viewpoint. Furthermore, the beneficial effect of implementing aluminum nitride (AlN) thin-film heatspreaders is examined. It is shown that the silicon area surrounding the heat source, as well as the distance to high-thermal-conductivity regions, can have a significant impact on the thermal behavior. A recently proposed scaling rule for the thermal resistance - fully compatible with advanced transistor models - is successfully applied to a series of test BJT structures provided that a simple parameter optimization is carried out. Based on this, some generally applicable guidelines are given to effectively downscale fully-isolated bipolar transistors without significantly worsening the thermal issues.

  6. Fabrication of metallic single electron transistors featuring plasma enhanced atomic layer deposition of tunnel barriers

    Science.gov (United States)

    Karbasian, Golnaz

    The continuing increase of the device density in integrated circuits (ICs) gives rise to the high level of power that is dissipated per unit area and consequently a high temperature in the circuits. Since temperature affects the performance and reliability of the circuits, minimization of the energy consumption in logic devices is now the center of attention. According to the International Technology Roadmaps for Semiconductors (ITRS), single electron transistors (SETs) hold the promise of achieving the lowest power of any known logic device, as low as 1x10-18 J per switching event. Moreover, SETs are the most sensitive electrometers to date, and are capable of detecting a fraction of an electron charge. Despite their low power consumption and high sensitivity for charge detection, room temperature operation of these devices is quite challenging mainly due to lithographical constraints in fabricating structures with the required dimensions of less than 10 nm. Silicon based SETs have been reported to operate at room temperature. However, they all suffer from significant variation in batch-to-batch performance, low fabrication yield, and temperature-dependent tunnel barrier height. In this project, we explored the fabrication of SETs featuring metal-insulator-metal (MIM) tunnel junctions. While Si-based SETs suffer from undesirable effect of dopants that result in irregularities in the device behavior, in metal-based SETs the device components (tunnel barrier, island, and the leads) are well-defined. Therefore, metal SETs are potentially more predictable in behavior, making them easier to incorporate into circuits, and easier to check against theoretical models. Here, the proposed fabrication method takes advantage of unique properties of chemical mechanical polishing (CMP) and plasma enhanced atomic layer deposition (PEALD). Chemical mechanical polishing provides a path for tuning the dimensions of the tunnel junctions, surpassing the limits imposed by electron beam

  7. The effects of changing the electrodes temperature on the tunnel magnetoresistance in the ferromagnetic single electron transistor

    Science.gov (United States)

    Ahmadi, N.; Pourali, N.; Kavaz, E.

    2018-01-01

    Ferromagnetic single electron transistor with electrodes having different temperatures is investigated and the effects of changing electrodes temperature on TMR of system are studied. A modified orthodox theory is used to study the system and to calculate the electron tunneling transition rate. The results show that the temperature of electrodes can be an effective tool to control and tune the tunnel magnetoresistance of FM-SET. Also, the effects of parameters such as resistance ratio of junctions, magnetic polarization and spin relaxation time on the behaviour of the system are studied.

  8. Strong room-temperature negative transconductance in an axial Si/Ge hetero-nanowire tunneling field-effect transistor

    Science.gov (United States)

    Zhang, Peng; Le, Son T.; Hou, Xiaoxiao; Zaslavsky, A.; Perea, Daniel E.; Dayeh, Shadi A.; Picraux, S. T.

    2014-08-01

    We report on room-temperature negative transconductance (NTC) in axial Si/Ge hetero-nanowire tunneling field-effect transistors. The NTC produces a current peak-to-valley ratio >45, a high value for a Si-based device. We characterize the NTC over a range of gate VG and drain VD voltages, finding that NTC persists down to VD = -50 mV. The physical mechanism responsible for the NTC is the VG-induced depletion in the p-Ge section that eventually reduces the maximum electric field that triggers the tunneling ID, as confirmed via three-dimensional (3D) technology computer-aided design simulations.

  9. Tunneling spectroscopy of a germanium quantum dot in single-hole transistors with self-aligned electrodes

    International Nuclear Information System (INIS)

    Chen, G-L; Kuo, David M T; Lai, W-T; Li, P-W

    2007-01-01

    We have fabricated a Ge quantum dot (QD) (∼10 nm) single-hole transistor with self-aligned electrodes using thermal oxidation of a SiGe-on-insulator nanowire based on FinFET technology. This fabricated device exhibits clear Coulomb blockade oscillations with large peak-to-valley ratio (PVCR) of 250-750 and negative differential conductance with PVCR of ∼12 at room temperature. This reveals that the gate-induced tunneling barrier lowering is effectively suppressed due to the self-aligned electrode structure. The magnitude of tunneling current spectra also reveals the coupling strengths between the energy levels of the Ge QD and electrodes

  10. Estimation and Compensation of Process Induced Variations in Nanoscale Tunnel Field Effect Transistors (TFETs) for Improved Reliability

    OpenAIRE

    Saurabh, Sneh; Kumar, M. Jagadesh

    2010-01-01

    Tunnel Field Effect Transistors (TFET) have extremely low leakage current, exhibit excellent subthreshold swing and are less susceptible to short channel effects. However, TFETs do face certain special challenges, particularly with respect to the process induced variations in (i) the channel length and (ii) the thickness of the silicon thin-film and the gate oxide. This paper, for the first time, studies the impact of the above process variations on the electrical characteristics of a Double ...

  11. Improved methods of forming monolithic integrated circuits having complementary bipolar transistors

    Science.gov (United States)

    Bohannon, R. O., Jr.; Cashion, W. F.; Stehlin, R. A.

    1971-01-01

    Two new processes form complementary transistors in monolithic semiconductor circuits, require fewer steps /infusions/ than previous methods, and eliminate such problems as nonuniform h sub FE distribution, low yield, and large device formation.

  12. The Aluminum-Free P-n-P InGaAsN Double Heterojunction Bipolar Transistors

    Energy Technology Data Exchange (ETDEWEB)

    CHANG,PING-CHIH; LI,N.Y.; BACA,ALBERT G.; MONIER,C.; LAROCHE,J.R.; HOU,H.Q.; REN,F.; PEARTON,S.J.

    2000-08-01

    The authors have demonstrated an aluminum-free P-n-P GaAs/InGaAsN/GaAs double heterojunction bipolar transistor (DHBT). The device has a low turn-on voltage (V{sub ON}) that is 0.27 V lower than in a comparable P-n-p AlGaAs/GaAs HBT. The device shows near-ideal D. C. characteristics with a current gain ({beta}) greater than 45. The high-speed performance of the device are comparable to a similar P-n-p AlGaAs/GaAs HBT, with f{sub T} and f{sub MAX} values of 12 GHz and 10 GHz, respectively. This device is very suitable for low-power complementary HBT circuit applications, while the aluminum-free emitter structure eliminates issues typically associated with AlGaAs.

  13. EMP injection damage effects of a bipolar transistor and its relationship between the injecting voltage and energy

    International Nuclear Information System (INIS)

    Xi Xiaowen; Chai Changchun; Ren Xingrong; Yang Yintang; Zhang Bing; Hong Xiao

    2010-01-01

    The response of a bipolar transistor (BJT) under a square-wave electromagnetic pulse (EMP) with different injecting voltages is investigated. Adopting the curve fitting method, the relationship between the burnout time, the damage energy and the injecting voltage is obtained. Research shows that the damage energy is not a constant value, but changes with the injecting voltage level. By use of the device simulator Medici, the internal behavior of the burned device is analyzed. Simulation results indicate that the variation of the damage energy with injecting voltage is caused by the distribution change of hot spot position under different injection levels. Therefore, the traditional way to evaluate the trade-off between the burnout time and the injecting voltage is not comprehensive due to the variation of the damage energy. (semiconductor devices)

  14. SEMICONDUCTOR DEVICES: EMP injection damage effects of a bipolar transistor and its relationship between the injecting voltage and energy

    Science.gov (United States)

    Xiaowen, Xi; Changchun, Chai; Xingrong, Ren; Yintang, Yang; Bing, Zhang; Xiao, Hong

    2010-04-01

    The response of a bipolar transistor (BJT) under a square-wave electromagnetic pulse (EMP) with different injecting voltages is investigated. Adopting the curve fitting method, the relationship between the burnout time, the damage energy and the injecting voltage is obtained. Research shows that the damage energy is not a constant value, but changes with the injecting voltage level. By use of the device simulator Medici, the internal behavior of the burned device is analyzed. Simulation results indicate that the variation of the damage energy with injecting voltage is caused by the distribution change of hot spot position under different injection levels. Therefore, the traditional way to evaluate the trade-off between the burnout time and the injecting voltage is not comprehensive due to the variation of the damage energy.

  15. EMP injection damage effects of a bipolar transistor and its relationship between the injecting voltage and energy

    Energy Technology Data Exchange (ETDEWEB)

    Xi Xiaowen; Chai Changchun; Ren Xingrong; Yang Yintang; Zhang Bing; Hong Xiao, E-mail: xixiaowen523103@163.co [Key Laboratory of Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi' an 710071 (China)

    2010-04-15

    The response of a bipolar transistor (BJT) under a square-wave electromagnetic pulse (EMP) with different injecting voltages is investigated. Adopting the curve fitting method, the relationship between the burnout time, the damage energy and the injecting voltage is obtained. Research shows that the damage energy is not a constant value, but changes with the injecting voltage level. By use of the device simulator Medici, the internal behavior of the burned device is analyzed. Simulation results indicate that the variation of the damage energy with injecting voltage is caused by the distribution change of hot spot position under different injection levels. Therefore, the traditional way to evaluate the trade-off between the burnout time and the injecting voltage is not comprehensive due to the variation of the damage energy. (semiconductor devices)

  16. Influence of the external component on the damage of the bipolar transistor induced by the electromagnetic pulse

    Energy Technology Data Exchange (ETDEWEB)

    Xi Xiaowen; Chai Changchun; Ren Xingrong; Yang Yintang; Ma Zhenyang; Wang Jing, E-mail: xixiaowen523103@163.co [Key Laboratory of Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi' an 710071 (China)

    2010-07-15

    A study on the influence of the external resistor and the external voltage source during the injection of the electromagnetic pulse (EMP) into the bipolar transistor (BJT) is carried out. Research shows that the increase of the external resistor R{sub b} at base makes the burnout time of the device decrease slightly, the increase of the external voltage source V{sub be} at base can aid the damage of the device when the magnitude of the injecting voltage is relatively low and has little influence when the magnitude is sufficiently high causing the device appearing the PIN structure damage, and the increase of the external resistor R{sub e} can remarkably reduce the voltage drops added to the device and improve the durability of the device. In the final analysis, the effect of the external circuit component on the BJT damage is the influence on the condition which makes the device appear current-mode second breakdown.

  17. Influence of the external component on the damage of the bipolar transistor induced by the electromagnetic pulse

    Science.gov (United States)

    Xiaowen, Xi; Changchun, Chai; Xingrong, Ren; Yintang, Yang; Zhenyang, Ma; Jing, Wang

    2010-07-01

    A study on the influence of the external resistor and the external voltage source during the injection of the electromagnetic pulse (EMP) into the bipolar transistor (BJT) is carried out. Research shows that the increase of the external resistor Rb at base makes the burnout time of the device decrease slightly, the increase of the external voltage source Vbe at base can aid the damage of the device when the magnitude of the injecting voltage is relatively low and has little influence when the magnitude is sufficiently high causing the device appearing the PIN structure damage, and the increase of the external resistor Re can remarkably reduce the voltage drops added to the device and improve the durability of the device. In the final analysis, the effect of the external circuit component on the BJT damage is the influence on the condition which makes the device appear current-mode second breakdown.

  18. 2D device-level simulation study of strained-Si pnp heterojunction bipolar transistors on virtual substrates

    Science.gov (United States)

    Jankovic, N. D.; O'Neill, A.

    2004-02-01

    A novel strained-Si pnp heterojunction bipolar transistor (HBT) design, suitable for virtual substrate technology, is proposed that is inherently free from the detrimental valence band barrier effects usually encountered in conventional SiGe pnp HBTs on silicon. It takes advantage of the heterojunction formed between a strained-Si layer and a relaxed SiGe buffer (virtual substrate), whose associated valence band offset appears favorable for minority hole transport at the base/collector junction. From two-dimensional (2D) numerical simulation, it is found that the newly proposed strained-Si pnp HBT substantially outperforms the equivalent BJT on a silicon substrate in terms of DC and high-frequency characteristics. A threefold increase in maximum current gain β, a fourfold improvement in peak ft and a 2.5 times increase in peak fmax are predicted for strained-Si pnp HBTs on a 50% Ge virtual substrate in comparison with identical conventional silicon pnp BJTs.

  19. Simultaneous integration of MOS and bipolar transistors. Application to a fast complex memory

    International Nuclear Information System (INIS)

    Mackowiak, E.; Montier, M.

    1975-01-01

    A technology allowing for a simultaneous integration of two devices T MOS and T BIP (bipolar T) is presented. The technological results obtained and an application in the field of fast complex memories are given [fr

  20. A review of selected topics in physics based modeling for tunnel field-effect transistors

    Science.gov (United States)

    Esseni, David; Pala, Marco; Palestri, Pierpaolo; Alper, Cem; Rollo, Tommaso

    2017-08-01

    The research field on tunnel-FETs (TFETs) has been rapidly developing in the last ten years, driven by the quest for a new electronic switch operating at a supply voltage well below 1 V and thus delivering substantial improvements in the energy efficiency of integrated circuits. This paper reviews several aspects related to physics based modeling in TFETs, and shows how the description of these transistors implies a remarkable innovation and poses new challenges compared to conventional MOSFETs. A hierarchy of numerical models exist for TFETs covering a wide range of predictive capabilities and computational complexities. We start by reviewing seminal contributions on direct and indirect band-to-band tunneling (BTBT) modeling in semiconductors, from which most TCAD models have been actually derived. Then we move to the features and limitations of TCAD models themselves and to the discussion of what we define non-self-consistent quantum models, where BTBT is computed with rigorous quantum-mechanical models starting from frozen potential profiles and closed-boundary Schrödinger equation problems. We will then address models that solve the open-boundary Schrödinger equation problem, based either on the non-equilibrium Green’s function NEGF or on the quantum-transmitting-boundary formalism, and show how the computational burden of these models may vary in a wide range depending on the Hamiltonian employed in the calculations. A specific section is devoted to TFETs based on 2D crystals and van der Waals hetero-structures. The main goal of this paper is to provide the reader with an introduction to the most important physics based models for TFETs, and with a possible guidance to the wide and rapidly developing literature in this exciting research field.

  1. Tunnel-field-effect-transistor based gas-sensor: Introducing gas detection with a quantum-mechanical transducer

    Science.gov (United States)

    Sarkar, Deblina; Gossner, Harald; Hansch, Walter; Banerjee, Kaustav

    2013-01-01

    A gas-sensor based on tunnel-field-effect-transistor (TFET) is proposed that leverages the unique current injection mechanism in the form of quantum-mechanical band-to-band tunneling to achieve substantially improved performance compared to conventional metal-oxide-semiconductor field-effect-transistors (MOSFETs) for detection of gas species under ambient conditions. While nonlocal phonon-assisted tunneling model is used for detailed device simulations, in order to provide better physical insights, analytical formula for sensitivity is derived for both metal as well as organic conducting polymer based sensing elements. Analytical derivations are also presented for capturing the effects of temperature on sensor performance. Combining the developed analytical and numerical models, intricate properties of the sensor such as gate bias dependence of sensitivity, relationship between the required work-function modulation and subthreshold swing, counter-intuitive increase in threshold voltage for MOSFETs and reduction in tunneling probability for TFETs with temperature are explained. It is shown that TFET gas-sensors can not only lead to more than 10 000× increase in sensitivity but also provide design flexibility and immunity against screening of work-function modulation through non-specific gases as well as ensure stable operation under temperature variations.

  2. MOSFET-BJT hybrid mode of the gated lateral bipolar junction transistor for C-reactive protein detection.

    Science.gov (United States)

    Yuan, Heng; Kwon, Hyurk-Choon; Yeom, Se-Hyuk; Kwon, Dae-Hyuk; Kang, Shin-Won

    2011-10-15

    In this study, we propose a novel biosensor based on a gated lateral bipolar junction transistor (BJT) for biomaterial detection. The gated lateral BJT can function as both a BJT and a metal-oxide-semiconductor field-effect transistor (MOSFET) with both the emitter and source, and the collector and drain, coupled. C-reactive protein (CRP), which is an important disease marker in clinical examinations, can be detected using the proposed device. In the MOSFET-BJT hybrid mode, the sensitivity, selectivity, and reproducibility of the gated lateral BJT for biosensors were evaluated in this study. According to the results, in the MOSFET-BJT hybrid mode, the gated lateral BJT shows good selectivity and reproducibility. Changes in the emitter (source) current of the device for CRP antigen detection were approximately 0.65, 0.72, and 0.80 μA/decade at base currents of -50, -30, and -10 μA, respectively. The proposed device has significant application in the detection of certain biomaterials that require a dilution process using a common biosensor, such as a MOSFET-based biosensor. Copyright © 2011 Elsevier B.V. All rights reserved.

  3. Annealing effects and DLTS study on PNP silicon bipolar junction transistors irradiated by 20 MeV Br ions

    Science.gov (United States)

    Liu, Chaoming; Li, Xingji; Yang, Jianqun; Bollmann, Joachim

    2014-01-01

    Isochronal anneal sequences have been carried out on 3CG130 silicon PNP bipolar junction transistors (BJTs) irradiated with 20 MeV bromine (Br) heavy ions. The Gummel curve was utilized to characterize the annealing behavior of defects in both the emitter-base depletion region and the neutral base. The results show that the base current (IB) decreases with the increasing annealing temperature, while the collector current (IC) keeps invariably. The current gain varies slightly, when the annealing temperature (TA) is lower than 500 K, while varies rapidly at TA>550 K, and the current gain of the 3CG130 BJT annealing at 700 K almost restore to that of the pre-radiation transistor. The deep level transient spectroscopy (DLTS) data was used to assign the relative magnitude of each of the important defects. Based on the in situ electrical measurement and DLTS spectra, it is clear that the V2(+/0) trap is the main contribution to the degradation of current gain after the 20 MeV Br ions irradiation. The V2(+/0) peak has many characteristics expected for the current gain degradation.

  4. Annealing effects and DLTS study on PNP silicon bipolar junction transistors irradiated by 20 MeV Br ions

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Chaoming [School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001 (China); Li, Xingji, E-mail: lxj0218@hit.edu.cn [School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001 (China); Yang, Jianqun [School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001 (China); Bollmann, Joachim [Institute of Electronics and Sensor Materials, TU Bergakademie, Freiberg 71691 (Germany)

    2014-01-21

    Isochronal anneal sequences have been carried out on 3CG130 silicon PNP bipolar junction transistors (BJTs) irradiated with 20 MeV bromine (Br) heavy ions. The Gummel curve was utilized to characterize the annealing behavior of defects in both the emitter-base depletion region and the neutral base. The results show that the base current (I{sub B}) decreases with the increasing annealing temperature, while the collector current (I{sub C}) keeps invariably. The current gain varies slightly, when the annealing temperature (T{sub A}) is lower than 500 K, while varies rapidly at T{sub A}>550 K, and the current gain of the 3CG130 BJT annealing at 700 K almost restore to that of the pre-radiation transistor. The deep level transient spectroscopy (DLTS) data was used to assign the relative magnitude of each of the important defects. Based on the in situ electrical measurement and DLTS spectra, it is clear that the V{sub 2}(+/0) trap is the main contribution to the degradation of current gain after the 20 MeV Br ions irradiation. The V{sub 2}(+/0) peak has many characteristics expected for the current gain degradation.

  5. Few-layer Phosphorene: An Ideal 2D Material For Tunnel Transistors

    Science.gov (United States)

    Ameen, Tarek A.; Ilatikhameneh, Hesameddin; Klimeck, Gerhard; Rahman, Rajib

    2016-01-01

    2D transition metal dichalcogenides (TMDs) have attracted a lot of attention recently for energy-efficient tunneling-field-effect transistor (TFET) applications due to their excellent gate control resulting from their atomically thin dimensions. However, most TMDs have bandgaps (Eg) and effective masses (m*) outside the optimum range needed for high performance. It is shown here that the newly discovered 2D material, few-layer phosphorene, has several properties ideally suited for TFET applications: 1) direct Eg in the optimum range ~1.0–0.4 eV, 2) light transport m* (0.15 m0), 3) anisotropic m* which increases the density of states near the band edges, and 4) a high mobility. These properties combine to provide phosphorene TFET outstanding ION ~ 1 mA/um, ON/OFF ratio ~ 106 for a 15 nm channel and 0.5 V supply voltage, thereby significantly outperforming the best TMD-TFETs and CMOS in many aspects such as ON/OFF current ratio and energy-delay products. Furthermore, phosphorene TFETS can scale down to 6 nm channel length and 0.2 V supply voltage within acceptable range in deterioration of the performance metrics. Full-band atomistic quantum transport simulations establish phosphorene TFETs as serious candidates for energy-efficient and scalable replacements of MOSFETs. PMID:27345020

  6. Multiple silicon nanowire complementary tunnel transistors for ultralow-power flexible logic applications

    Science.gov (United States)

    Lee, M.; Jeon, Y.; Jung, J.-C.; Koo, S.-M.; Kim, S.

    2012-06-01

    Based on experimental and simulation studies to gain insight into the suppression of ambipolar conduction in two distinct tunnel field-effect transistor (TFET) devices (that is, an asymmetric source-drain doping or a properly designed gate underlap), here we report on the fabrication and electrical/mechanical characterization of a flexible complementary TFET (c-TFET) inverter on a plastic substrate using multiple silicon nanowires (SiNWs) as the channel material. The static voltage transfer characteristic of the SiNW c-TFET inverter exhibits a full output voltage swing between 0 V and Vdd with a high voltage gain of ˜29 and a sharp transition of 0.28 V at Vdd = 3 V. A leakage power consumption of the SiNW c-TFET inverter in the standby state is as low as 17.1 pW for Vdd = 3 V. Moreover, its mechanical bendability indicates that it has good fatigue properties, providing an important step towards the realization of ultralow-power flexible logic circuits.

  7. Impact of device engineering on analog/RF performances of tunnel field effect transistors

    Science.gov (United States)

    Vijayvargiya, V.; Reniwal, B. S.; Singh, P.; Vishvakarma, S. K.

    2017-06-01

    The tunnel field effect transistor (TFET) and its analog/RF performance is being aggressively studied at device architecture level for low power SoC design. Therefore, in this paper we have investigated the influence of the gate-drain underlap (UL) and different dielectric materials for the spacer and gate oxide on DG-TFET (double gate TFET) and its analog/RF performance for low power applications. Here, it is found that the drive current behavior in DG-TFET with a UL feature while implementing dielectric material for the spacer is different in comparison to that of DG-FET. Further, hetero gate dielectric-based DG-TFET (HGDG-TFET) is more resistive against drain-induced barrier lowering (DIBL) as compared to DG-TFET with high-k (HK) gate dielectric. Along with that, as compared to DG-FET, this paper also analyses the attributes of UL and dielectric material on analog/RF performance of DG-TFET in terms of transconductance (gm ), transconductance generation factor (TGF), capacitance, intrinsic resistance (Rdcr), cut-off frequency (F T), and maximum oscillation frequency (F max). The LK spacer-based HGDG-TFET with a gate-drain UL has the potential to improve the RF performance of device.

  8. Few-layer Phosphorene: An Ideal 2D Material For Tunnel Transistors.

    Science.gov (United States)

    Ameen, Tarek A; Ilatikhameneh, Hesameddin; Klimeck, Gerhard; Rahman, Rajib

    2016-06-27

    2D transition metal dichalcogenides (TMDs) have attracted a lot of attention recently for energy-efficient tunneling-field-effect transistor (TFET) applications due to their excellent gate control resulting from their atomically thin dimensions. However, most TMDs have bandgaps (Eg) and effective masses (m(*)) outside the optimum range needed for high performance. It is shown here that the newly discovered 2D material, few-layer phosphorene, has several properties ideally suited for TFET applications: 1) direct Eg in the optimum range ~1.0-0.4 eV, 2) light transport m(*) (0.15 m0), 3) anisotropic m(*) which increases the density of states near the band edges, and 4) a high mobility. These properties combine to provide phosphorene TFET outstanding ION ~ 1 mA/um, ON/OFF ratio ~ 10(6) for a 15 nm channel and 0.5 V supply voltage, thereby significantly outperforming the best TMD-TFETs and CMOS in many aspects such as ON/OFF current ratio and energy-delay products. Furthermore, phosphorene TFETS can scale down to 6 nm channel length and 0.2 V supply voltage within acceptable range in deterioration of the performance metrics. Full-band atomistic quantum transport simulations establish phosphorene TFETs as serious candidates for energy-efficient and scalable replacements of MOSFETs.

  9. Impact of edge states on device performance of phosphorene heterojunction tunneling field effect transistors.

    Science.gov (United States)

    Liu, Fei; Wang, Jian; Guo, Hong

    2016-10-27

    Black phosphorus (BP) tunneling field effect transistors (TFETs) using heterojunctions (Hes) are investigated by atomistic quantum transport simulations. It is observed that edge states have a great impact on the transport characteristics of BP He-TFETs, which results in the potential pinning effect and deterioration of gate control. However, the on-state current can be effectively enhanced by using hydrogen to saturate the edge dangling bonds in BP He-TFETs, by which means edge states are quenched. By extending layered BP with a smaller band gap to the channel region and modulating the BP thickness, the device performance of BP He-TFETs can be further optimized and can fulfil the requirements of the international technology road-map for semiconductors (ITRS) 2013 for low power applications. In 15 nm 3L-1L and 4L-1L BP He-TFETs along the armchair direction the on-state currents are over two times larger than the current required by ITRS 2013 and can reach above 10 3 μA μm -1 with the fixed off-state current of 10 pA μm -1 . It is also found that the ambipolar effect can be effectively suppressed in BP He-TFETs.

  10. Extreme Temperature Performance of Automotive-Grade Small Signal Bipolar Junction Transistors

    Science.gov (United States)

    Boomer, Kristen; Damron, Benny; Gray, Josh; Hammoud, Ahmad

    2018-01-01

    Electronics designed for space exploration missions must display efficient and reliable operation under extreme temperature conditions. For example, lunar outposts, Mars rovers and landers, James Webb Space Telescope, Europa orbiter, and deep space probes represent examples of missions where extreme temperatures and thermal cycling are encountered. Switching transistors, small signal as well as power level devices, are widely used in electronic controllers, data instrumentation, and power management and distribution systems. Little is known, however, about their performance in extreme temperature environments beyond their specified operating range; in particular under cryogenic conditions. This report summarizes preliminary results obtained on the evaluation of commercial-off-the-shelf (COTS) automotive-grade NPN small signal transistors over a wide temperature range and thermal cycling. The investigations were carried out to establish a baseline on functionality of these transistors and to determine suitability for use outside their recommended temperature limits.

  11. Electrical transport properties of black phosphorus based field-effect transistor with Au/Co/MgO tunneling contacts

    Science.gov (United States)

    Liang, Shiheng; Yang, Huaiwen; Djeffal, Abdelhak; Tao, Bingshan; Mc-Murtry, Stefan; Mangin, Stéphane; Lu, Yuan

    2017-10-01

    Black phosphorus (BP) has recently emerged as a promising two-dimensional direct bandgap semiconducting material. Here, we report the fabrication and the electrical transport measurements of the black phosphorus based field-effect transistor with the Au/Co/MgO as drain and source tunneling contacts. By modulating the back-gate voltage, the multilayer black phosphorus channel exhibits ambipolar characteristics (both n-type and p-type) and the conduction behavior can be switched from hole dominated to electron dominated transport region. In the hole dominated region, we have measured a minimum of Schottky barrier height of 37 meV for Au/Co/MgO contact on BP. Moreover, the transistor ON/OFF (Ion/Ioff) ratio is obtained as large as 107 at 20 K and 105 at 300 K. A systematic study of the temperature and the back-gate voltage dependent conduction properties has been performed to understand the modulation of band structure and the ambipolar behavior. The demonstration of high ON/OFF ratio and low Schottky barrier height by using Au/Co/MgO tunneling contacts reveals a promising potential for spintronics applications with multilayer black phosphorus field-effect transistor.

  12. The effect of fluorine in low thermal budget polysilicon emitters for SiGe heterojunction bipolar transistors

    International Nuclear Information System (INIS)

    Schiz, F.J.W.

    1999-03-01

    This thesis investigates the behaviour of fluorine in two types of polysilicon emitter. In the first type the emitter is deposited at 610 deg. C as polycrystalline silicon (p-Si). In the second type the emitter is deposited at 560 deg. C as amorphous silicon (α-Si). The amorphous silicon 1 then regrows to polysilicon during subsequent high temperature anneals. Remarkably different behaviour of fluorine is seen in as-deposited α-Si and as-deposited p-Si emitter bipolar transistors. In the most extreme case, fluorine-implanted as-deposited p-Si devices show a base current increase by a factor of 1.5 and equivalent α-Si devices a base current decrease by a factor of 10.0 compared to unimplanted devices. Cross-section TEM observations are made to study the structure of the polysilicon/silicon interface and SIMS measurements to study the distribution of the fluorine in the polysilicon. The TEM results correlate well with the electrical results and show that fluorine accelerates interfacial oxide breakup. Furthermore, they show that for a given thermal budget, more interfacial oxide breakup and thus more epitaxial regrowth is obtained for transistors with p-Si polysilicon emitters. This results in a lower emitter resistance, for example as low as 12Ωμm 2 for as-deposited p-Si devices. The base current suppression for as-deposited α-Si devices is explained by fluorine passivation of trapping states at the interface. Analysis of the fluorine SIMS profiles suggests that they do not resemble normal diffusion profiles, but are due to fluorine trapped at defects. It is shown that a reciprocal relationship exists between the fluorine dose in the bulk polysilicon layer and the fluorine dose at the interface. In as-deposited α-Si devices, there is more fluorine trapped at defects in the bulk polysilicon layer, so less is available to diffuse to the interface. As a result there is less interfacial oxide breakup and more passivation in the as-deposited α-Si devices. These

  13. Nondestructive characterization of RBSOA of high-power bipolar transistors. [Reverse-bias safe operating area

    Science.gov (United States)

    Jovanovic, M. M.; Lee, F. C.; Chen, D. Y.

    1986-01-01

    Reverse-bias safe operating area (RBSOA) of high-power Darlington transistors is characterized using a 120 A/1000 V nondestructive reverse-bias second breakdown tester designed and fabricated at Virginia Polytechnic Institute and State University. Elaborate RBSOA characteristics are generated with different forward/reverse base drives and collector current levels. The effects of elevated case temperature and second-base drive on RBSOA of four-terminal Darlington devices are also discussed.

  14. Probability density of tunneled carrier states near heterojunctions calculated numerically by the scattering method.

    Energy Technology Data Exchange (ETDEWEB)

    Wampler, William R. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Myers, Samuel M. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Modine, Normand A. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

    2017-09-01

    The energy-dependent probability density of tunneled carrier states for arbitrarily specified longitudinal potential-energy profiles in planar bipolar devices is numerically computed using the scattering method. Results agree accurately with a previous treatment based on solution of the localized eigenvalue problem, where computation times are much greater. These developments enable quantitative treatment of tunneling-assisted recombination in irradiated heterojunction bipolar transistors, where band offsets may enhance the tunneling effect by orders of magnitude. The calculations also reveal the density of non-tunneled carrier states in spatially varying potentials, and thereby test the common approximation of uniform- bulk values for such densities.

  15. The effect of density-of-state tails on band-to-band tunneling: Theory and application to tunnel field effect transistors

    Science.gov (United States)

    Sant, S.; Schenk, A.

    2017-10-01

    It is demonstrated how band tail states in the semiconductor influence the performance of a Tunnel Field Effect Transistor (TFET). As a consequence of the smoothened density of states (DOS) around the band edges, the energetic overlap of conduction and valence band states occurs gradually at the onset of band-to-band tunneling (BTBT), thus degrading the sub-threshold swing (SS) of the TFET. The effect of the band tail states on the current-voltage characteristics is modelled quantum-mechanically based on the idea of zero-phonon trap-assisted tunneling between band and tail states. The latter are assumed to arise from a 3-dimensional pseudo-delta potential proposed by Vinogradov [1]. This model potential allows the derivation of analytical expressions for the generation rate covering the whole range from very strong to very weak localization of the tail states. Comparison with direct BTBT in the one-band effective mass approximation reveals the essential features of tail-to-band tunneling. Furthermore, an analytical solution for the problem of tunneling from continuum states of the disturbed DOS to states in the opposite band is found, and the differences to direct BTBT are worked out. Based on the analytical expressions, a semi-classical model is implemented in a commercial device simulator which involves numerical integration along the tunnel paths. The impact of the tail states on the device performance is analyzed for a nanowire Gate-All-Around TFET. The simulations show that tail states notably impact the transfer characteristics of a TFET. It is found that exponentially decaying band tails result in a stronger degradation of the SS than tail states with a Gaussian decay of their density. The developed model allows more realistic simulations of TFETs including their non-idealities.

  16. Improved compact model for double-gate tunnel field-effect transistors by the rigorous consideration of gate fringing field

    Science.gov (United States)

    Kim, Sangwan; Choi, Woo Young

    2017-08-01

    In this work, the accuracy of a compact current-voltage (I-V) model for double-gate n-channel tunnel field-effect transistors (TFETs) is improve by considering outer and inner gate fringing field effects. The refined model is benchmarked against technology computer-aided design (TCAD) device simulations and compared against a previously published compact model. The normalized root-mean-square error for current in the linear region of operation (i.e., for 0.05 V drain voltage) is reduced from ˜593 to ˜5%.

  17. Comments on determination of bandgap narrowing from activation plots. [for bipolar transistors

    Science.gov (United States)

    Park, J.-S.; Neugroschel, A.; Lindholm, F. A.

    1986-01-01

    A determination is made of the temperature-dependence of emitter saturation current in bipolar devices which allows the derivation of a value for bandgap narrowing that is in better agreement with other determinations than previous results based on ohmic contact measurements of temperature dependence. The new values were obtained by varying the surface recombination velocity at the emitter surface. This improves accuracy by varying the minority carrier surface recombination velocity at the emitter contacts of otherwise indistinguishable emitters.

  18. Superconducting transistor

    International Nuclear Information System (INIS)

    Gray, K.E.

    1978-01-01

    A three film superconducting tunneling device, analogous to a semiconductor transistor, is presented, including a theoretical description and experimental results showing a current gain of four. Much larger current gains are shown to be feasible. Such a development is particularly interesting because of its novelty and the striking analogies with the semiconductor junction transistor

  19. Three-terminal heterojunction bipolar transistor solar cell for high-efficiency photovoltaic conversion

    OpenAIRE

    Martí Vega, Antonio; Luque López, Antonio

    2015-01-01

    Here we propose, for the first time, a solar cell characterized by a semiconductor transistor structure (n/p/n or p/n/p) where the base?emitter junction is made of a high-bandgap semiconductor and the collector is made of a low-bandgap semiconductor. We calculate its detailed-balance efficiency limit and prove that it is the same one than that of a double-junction solar cell. The practical importance of this result relies on the simplicity of the structure that reduces the number of layers th...

  20. A 65-kV insulated gate bipolar transistor switch applied in damped AC voltages partial discharge detection system.

    Science.gov (United States)

    Jiang, J; Ma, G M; Luo, D P; Li, C R; Li, Q M; Wang, W

    2014-02-01

    Damped AC voltages detection system (DAC) is a productive way to detect the faults in power cables. To solve the problems of large volume, complicated structure and electromagnetic interference in existing switches, this paper developed a compact solid state switch based on electromagnetic trigger, which is suitable for DAC test system. Synchronous electromagnetic trigger of 32 Insulated Gate Bipolar Transistors (IGBTs) in series was realized by the topological structure of single line based on pulse width modulation control technology. In this way, external extension was easily achieved. Electromagnetic trigger and resistor-capacitor-diode snubber circuit were optimized to reduce the switch turn-on time and circular layout. Epoxy encapsulating was chosen to enhance the level of partial discharge initial voltage (PDIV). The combination of synchronous trigger and power supply is proposed to reduce the switch volume. Moreover, we have overcome the drawback of the electromagnetic interference and improved the detection sensitivity of DAC by using capacitor storage energy to maintain IGBT gate driving voltage. The experimental results demonstrated that the solid-state switch, with compact size, whose turn-on time was less than 400 ns and PDIV was more than 65 kV, was able to meet the actual demands of 35 kV DAC test system.

  1. Improvement of Switching Speed of a 600-V Nonpunch-Through Insulated Gate Bipolar Transistor Using Fast Neutron Irradiation

    Directory of Open Access Journals (Sweden)

    Ha Ni Baek

    2017-02-01

    Full Text Available Fast neutron irradiation was used to improve the switching speed of a 600-V nonpunch-through insulated gate bipolar transistor. Fast neutron irradiation was carried out at 30-MeV energy in doses of 1 × 108 n/cm2, 1 × 109 n/cm2, 1 × 1010 n/cm2, and 1 × 1011 n/cm2. Electrical characteristics such as current–voltage, forward on-state voltage drop, and switching speed of the device were analyzed and compared with those prior to irradiation. The on-state voltage drop of the initial devices prior to irradiation was 2.08 V, which increased to 2.10 V, 2.20 V, 2.3 V, and 2.4 V, respectively, depending on the irradiation dose. This effect arises because of the lattice defects generated by the fast neutrons. In particular, the turnoff delay time was reduced to 92 nanoseconds, 45% of that prior to irradiation, which means there is a substantial improvement in the switching speed of the device.

  2. A Fast-Acting Diagnostic Algorithm of Insulated Gate Bipolar Transistor Open Circuit Faults for Power Inverters in Electric Vehicles

    Directory of Open Access Journals (Sweden)

    Lei Yu

    2017-04-01

    Full Text Available To improve the diagnostic detection speed in electric vehicles, a novel diagnostic algorithm of insulated gate bipolar transistor (IGBT open circuit faults for power inverters is proposed in this paper. The average of the difference between the actual three-phase current and referential three-phase current values over one electrical period is used as the diagnostic variable. The normalization method based on the amplitude of the d-q axis referential current is applied to the diagnostic variables to improve the response speed of diagnosis, and to avoid the noise and the delay caused by signal acquisition. In the parameter discretization process, the variable parameter moving average method (VPMAM is adopted to solve the variation of the average value over a period with the speed of the motor; hence, the diagnostic reliability of the system is improved. This algorithm is robust, independent of load variations, and has a high resistivity against false alarms. Since only the three-phase current of the motor is utilized for calculations in the time domain, a fast diagnostic detection speed can be achieved, which is significantly essential for real-time control in electric vehicles. The effectiveness of the proposed algorithm is verified by both simulation and experimental results.

  3. Silicon-on-Insulator Lateral-Insulated-Gate-Bipolar-Transistor with Built-in Self-anti-ESD Diode

    Directory of Open Access Journals (Sweden)

    Xiaojun Cheng

    2014-05-01

    Full Text Available Power SOI (Silicon-On-Insulator devices have an inherent sandwich structure of MOS (Metal-Oxide-Semiconductor gate which is very easy to suffer ESD (Electro-Static Discharge overstress. To solve this reliability problem, studies on design and modification of a built-in self-anti-ESD diode for a preliminarily optimized high voltage SOI LIGBT (Lateral-Insulated-Gate-Bipolar-Transistor were carried out on the Silvaco TCAD (Technology-Computer-Aided-Design platform. According to the constrains of the technological process, the new introduction of the N+ doped region into P-well region that form the built-in self-anti-ESD diode should be done together with the doping of source under the same mask. The modifications were done by adjusting the vertical impurity profile in P-well into retrograde distribution and designing a cathode plate with a proper length to cover the forward depletion terminal and make sure that the thickness of the cathode plate is the same as that of the gate plate. The simulation results indicate that the modified device structure is compatible with the original one in process and design, the breakdown voltage margin of the former was expanded properly, and both the transient cathode voltages are clamped low enough very quickly. Therefore, the design and optimization results of the modified device structure of the built-in self-anti-ESD diode for the given SOI LIGBT meet the given requirements.

  4. Non-ideal effect in 4H-SiC bipolar junction transistor with double Gaussian-doped base

    Science.gov (United States)

    Yuan, Lei; Zhang, Yu-Ming; Song, Qing-Wen; Tang, Xiao-Yan; Zhang, Yi-Men

    2015-06-01

    The non-ideal effect of 4H-SiC bipolar junction transistor (BJT) with a double Gaussian-doped base is characterized and simulated in this paper. By adding a specific interface model between SiC and SiO2, the simulation results are in good agreement with the experiment data. An obvious early effect is found from the output characteristic. As the temperature rises, the early voltage increases, while the current gain gradually decreases, which is totally different from the scenario of silicon BJT. With the same effective Gummel number in the base region, the double Gaussian-doped base structure can realize higher current gain than the single base BJT due to the built-in electric field, whereas the early effect will be more salient. Besides, the emitter current crowding effect is also analyzed. Due to the low sheet resistance in the first highly-doped base epilayer, the 4H-BJT with a double base has more uniform emitter current density across the base-emitter junction, leading to better thermal stability. Project supported by the National Natural Science Foundation of China (Grant Nos. 60876061 and 61234006), the Natural Science Foundation of Shaanxi Province, China (Grant No. 2013JQ8012), and the Doctoral Fund of the Ministry of Education of China (Grant Nos. 20130203120017 and 20110203110010).

  5. A novel 4H-SiC lateral bipolar junction transistor structure with high voltage and high current gain

    Science.gov (United States)

    Deng, Yong-Hui; Xie, Gang; Wang, Tao; Sheng, Kuang

    2013-09-01

    In this paper, a novel structure of a 4H-SiC lateral bipolar junction transistor (LBJT) with a base field plate and double RESURF in the drift region is presented. Collector-base junction depletion extension in the base region is restricted by the base field plate. Thin base as well as low base doping of the LBJT therefore can be achieved under the condition of avalanche breakdown. Simulation results show that thin base of 0.32 μm and base doping of 3 × 1017 cm-3 are obtained, and corresponding current gain is as high as 247 with avalanche breakdown voltage of 3309 V when the drift region length is 30 μm. Besides, an investigation of a 4H-SiC vertical BJT (VBJT) with comparable breakdown voltage (3357 V) shows that the minimum base width of 0.25 μm and base doping as high as 8 × 1017 cm-3 contribute to a maximum current gain of only 128.

  6. Simulation of energy and fluence dependence of heavy ion induced displacement damage factor in bipolar junction transistor

    Science.gov (United States)

    Kulkarni, S. R.; Ravindra, M.; Joshi, G. R.; Damle, R.

    2004-05-01

    This article presents the theoretical calculation of the variation of displacement damage factors as a function of energy and rad equivalent fluence in bipolar junction transistor for various particulate radiation viz ., He, Si, Cl, Ti, Ni, Br, Ag, I, and Au. The calculation is based on the experimental data on gamma-ray induced gain degradation in a commercial space borne BJT (2N3019). The method involves the calculation of gamma-ray dose (rad(Si)) equivalent of effective particle fluence. The linear energy transfer (LET) in silicon for different particle radiation obtained from TRIM calculation has been used for the conversion of gamma-dose into fluence of various particles. The estimation predicts a smooth increase in the displacement damage factor as the mass of the ion increases. Further, the displacement damage factor reaches a maximum at the same value of energy, which corresponds to maximum LET for all heavy ions. The maximum value of damage factor marginally decreases with increasing ion fluence for an ion of given energy. The results are compared with the data available in the literature for proton, deuteron, and helium induced displacement damage.

  7. Improving band-to-band tunneling in a tunneling carbon nanotube field effect transistor by multi-level development of impurities in the drain region

    Science.gov (United States)

    Naderi, Ali; Ghodrati, Maryam

    2017-12-01

    In this paper, in order to improve the performance of a tunneling carbon nanotube field effect transistor (T-CNTFET) a new structure is proposed using multi-level impurity distribution along the drain region. The new T-CNTFET structure consists of six parts in the drain with stepwise doping distribution. The impurities on the drain side are n -type and the length of each region is 5nm. Electronic features of the proposed structure are simulated by the solution of Poisson and Schrödinger equations and the self-consistent method using Non-equilibrium Green's Function (NEGF). Simulation results show that the proposed structure reduces the band curvature near the drain-channel connection and widens the tunneling barrier. As a result, band-to-band tunneling and the OFF current are reduced and the ON/OFF current ratio increases in comparison with the conventional structure. In summary, by improving the subthreshold swing parameters, delay time, power delay product ( PDP and cut-off frequency compared to the conventional structure, the proposed structure can be considered as a proper candidate for digital applications with high speed and low power dissipation.

  8. Theoretical investigation of GaAsBi/GaAsN tunneling field-effect transistors with type-II staggered tunneling junction

    Science.gov (United States)

    Wang, Yibo; Liu, Yan; Han, Genquan; Wang, Hongjuan; Zhang, Chunfu; Zhang, Jincheng; Hao, Yue

    2017-06-01

    We investigate GaAsBi/GaAsN system for the design of type-II staggered hetero tunneling field-effect transistor (hetero-TFET). Strain-symmetrized GaAsBi/GaAsN with effective lattice match to GaAs exhibits a type-II band lineup, and the effective bandgap EG,eff at interface is significantly reduced with the incorporation of Bi and N elements. The band-to-band tunneling (BTBT) rate and drive current of GaAsBi/GaAsN hetero-TFETs are boosted due to the utilizing of the type-II staggered tunneling junction with the reduced EG,eff. Numerical simulation shows that the drive current and subthreshold swing (SS) characteristics of GaAsBi/GaAsN hetero-TFETs are remarkably improved by increasing Bi and N compositions. The dilute content GaAs0.85Bi0.15/GaAs0.92N0.08 staggered hetero-nTFET achieves 7.8 and 550 times higher ION compared to InAs and In0.53Ga0.47As homo-TFETs, respectively, at the supply voltage of 0.3 V. GaAsBi/GaAsN heterostructure is a potential candidate for high performance TFET.

  9. Characterization of a power bipolar transistor as high-dose dosimeter for 1.9-2.2 MeV electron beams

    Energy Technology Data Exchange (ETDEWEB)

    Fuochi, P.G., E-mail: fuochi@isof.cnr.i [ISOF-CNR Institute, Via P. Gobetti 101, I-40129, Bologna (Italy); Lavalle, M.; Corda, U. [ISOF-CNR Institute, Via P. Gobetti 101, I-40129, Bologna (Italy); Kuntz, F.; Plumeri, S. [Aerial, Parc d' Innovation Rue Laurent Fries F-67400 Illkirch (France); Gombia, E. [IMEM-CNR Institute, Viale delle Scienze 37 A, Loc. Fontanini, 43010 Parma (Italy)

    2010-04-15

    Results of the characterization studies on a power bipolar transistor investigated as a possible radiation dosimeter under laboratory condition using electron beams of energies from 2.2 to 8.6 MeV and gamma rays from a {sup 60}Co source and tested in industrial irradiation plants having high-activity {sup 60}Co gamma-source and high-energy, high-power electron beam have previously been reported. The present paper describes recent studies performed on this type of bipolar transistor irradiated with 1.9 and 2.2 MeV electron beams in the dose range 5-50 kGy. Dose response, post-irradiation heat treatment and stability, effects of temperature during irradiation in the range from -104 to +22 deg. C, dependence on temperature during reading in the range 20-50 deg. C, and the difference in response of the transistors irradiated from the plastic side and the copper side are reported. DLTS measurements performed on the irradiated devices to identify the recombination centres introduced by radiation and their dependence on dose and energy of the electron beam are also reported.

  10. Comment on ''Giant magnetocurrent exceeding 3400% in magnetic tunnel transistors with spin-valve base layers'' [Appl. Phys. Lett. 83, 951

    NARCIS (Netherlands)

    Jansen, R.; van 't Erve, O.M.J.; Postma, F.M.; Lodder, J.C.

    2004-01-01

    In a recent letter,1 it was reported that a magnetic tunnel transistor ~MTT! with a spin-valve base can exhibit high magnetocurrent ~MC! as well as output collector current in the microampere regime. While the presented experimental results are sound and unambiguous, the comparison with the

  11. Optimization of L-shaped tunneling field-effect transistor for ambipolar current suppression and Analog/RF performance enhancement

    Science.gov (United States)

    Li, Cong; Zhao, Xiaolong; Zhuang, Yiqi; Yan, Zhirui; Guo, Jiaming; Han, Ru

    2018-03-01

    L-shaped tunneling field-effect transistor (LTFET) has larger tunnel area than planar TFET, which leads to enhanced on-current ION . However, LTFET suffers from severe ambipolar behavior, which needs to be further optimized for low power and high-frequency applications. In this paper, both hetero-gate-dielectric (HGD) and lightly doped drain (LDD) structures are introduced into LTFET for suppression of ambipolarity and improvement of analog/RF performance of LTFET. Current-voltage characteristics, the variation of energy band diagrams, distribution of band-to-band tunneling (BTBT) generation and distribution of electric field are analyzed for our proposed HGD-LDD-LTFET. In addition, the effect of LDD on the ambipolar behavior of LTFET is investigated, the length and doping concentration of LDD is also optimized for better suppression of ambipolar current. Finally, analog/RF performance of HGD-LDD-LTFET are studied in terms of gate-source capacitance, gate-drain capacitance, cut-off frequency, and gain bandwidth production. TCAD simulation results show that HGD-LDD-LTFET not only drastically suppresses ambipolar current but also improves analog/RF performance compared with conventional LTFET.

  12. Investigation on the corner effect of L-shaped tunneling field-effect transistors and their fabrication method.

    Science.gov (United States)

    Kim, Sang Wan; Choi, Woo Young; Sun, Min-Chul; Park, Byung-Gook

    2013-09-01

    In this work, electrical characteristics of L-shaped tunneling field-effect transistors (TFETs) have been studied and optimized by a commercial device simulator: Synopsys Sentaurus. Unlike our previous study performed by using Silvaco Atlas, there exists a kink phenomenon in a transfer curve which degrades the subthreshold swing (SS) and on-current (lon) of TFETs. According to simulation results, the kink results from abrupt source doping. Rounding the source junction edge with gradual doping profile is helpful to alleviate it. Based on those results, a novel fabrication flow has been proposed to suppress the kink effect induced by source corners. It is predicted that the performance of L-shaped TFETs is improved in terms of SS and Ion under the optimized process condition. Furthremore, the effect of high-k gate dielectric and narrow band gap material on device performance has been examined. Using 2-nm-thick HfO2 for gate dielectric and Si0.7Ge0.3 for intrinsic tunneling region, gate controllability to the channel and tunneling probability have been enhanced. As a result, its threshold voltage (Vth), SS and Ion have been improved by 0.13 V, 16 mV/dec, and 3.62 microA/microm, respectively.

  13. Band-to-Band Tunnel Transistor Design and Modeling for Low Power Applications

    Science.gov (United States)

    2012-05-10

    MEDICI . We start off with the form of Kane’s tunneling model [2.5] where only one effective mass of the carrier is considered. It is expanded to...calculated for silicon and germanium then put into MEDICI for more exact silicon and germanium tunneling simulations. The dependence of the tunneling rate...simulator MEDICI has the form of Kane’s tunneling model. [2.11] = . × . / × − . × / (2.11) The parameters A.BTBT, B.BTBT

  14. DC parameter extraction of equivalent circuit model in InGaAsSb heterojunction bipolar transistors including non-ideal effects in the base region

    Science.gov (United States)

    Chang, Yang-Hua; Cheng, Zong-Tai

    2011-07-01

    This paper presents the DC parameter extraction of the equivalent circuit model in an InP-InGaAsSb double heterojunction bipolar transistor (HBT). The non-ideal collector current is modeled by a non-ideal doping distribution in the base region. Then several consequent non-ideal effects, which have always been neglected in typical HBTs, are studied using Medici device simulator. Moreover, the associated DC parameters of VBIC model are extracted accordingly. The equivalent circuit model is in good agreement with the measured data in I C- V CE characteristics.

  15. Two-dimensional analysis of the interface state effect on current gain for a 4H-SiC bipolar junction transistor

    Science.gov (United States)

    Zhang, You-Run; Zhang, Bo; Li, Zhao-Ji; Deng, Xiao-Chuan

    2010-06-01

    This paper studies two-dimensional analysis of the surface state effect on current gain for a 4H-SiC bipolar junction transistor (BJT). Simulation results indicate the mechanism of current gain degradation, which is surface Fermi level pinning leading to a strong downward bending of the energy bands to form the channel of surface electron recombination current. The experimental results are well-matched with the simulation, which is modeled by exponential distributions of the interface state density replacing the single interface state trap. Furthermore, the simulation reveals that the oxide quality of the base emitter junction interface is very important for 4H-SiC BJT performance.

  16. Si tunneling transistors with high on-currents and slopes of 50 mV/dec using segregation doped NiSi2 tunnel junctions

    Science.gov (United States)

    Knoll, L.; Schmidt, M.; Zhao, Q. T.; Trellenkamp, S.; Schäfer, A.; Bourdelle, K. K.; Mantl, S.

    2013-06-01

    Planar and nanowire (NW) tunneling field effect transistors (TFETs) have been fabricated on ultra thin strained and unstrained SOI with shallow doped nickel disilicide (NiSi2) source and drain (S/D) contacts. We developed a novel, self-aligned process to form the p-i-n TFETs which greatly simplifies their fabrication by tilted dopant implantation using the high-k/metal gate as a shadow mask and dopant segregation. Two methods of dopant segregation are compared: dopant segregation based on the "snow-plough" effect of dopants during silicidation and implantation into the silicide (IIS) followed by thermal outdiffusion. High drive currents of up to 60 μA/μm of planar p-TFETs were achieved indicating good silicide/silicon tunneling junctions. The non-linear temperature dependence of the inverse subthreshold slope S indicates characteristic TFET behavior. Strained Si NW array n-TFETs with omega shaped HfO2/TiN gates show high drive currents of 7 μA/μm @ 1 V Vdd and steep inverse subthreshold slopes with minimum values of <50 mV/dec due to the smaller band gap of strained Si and optimized electrostatics.

  17. Reduction of ambipolar characteristics of vertical channel tunneling field-effect transistor by using dielectric sidewall

    International Nuclear Information System (INIS)

    Park, Chun Woong; Cho, Il Hwan; Choi, Woo Young; Lee, Jong-Ho

    2013-01-01

    Ambipolar characteristics of tunneling FETs have been improved by introducing a novel structure which contains dielectric sidewall in the gate region. In the ambipolar operation mode, gate field effect on intrinsic-drain junction region can be reduced with dielectric sidewall. As a result, ambipolar state tunneling probability is decreased at the intrinsic-drain junction. Since the sidewall region is located near the drain region, tunneling probability of source-intrinsic region is not affected by dielectric sidewall. This asymmetric characteristics means only ambipolar current of tunneling FETs can be prohibited by dielectric sidewall. Reduction of ambipolar characteristic of proposed structure has been evaluated with dimension and location of dielectric sidewall. Quantitative analysis of ambipolar characteristics is also investigated with tunneling. (paper)

  18. Full-zone spectral envelope function formalism for the optimization of line and point tunnel field-effect transistors

    Energy Technology Data Exchange (ETDEWEB)

    Verreck, Devin, E-mail: devin.verreck@imec.be; Groeseneken, Guido [imec, Kapeldreef 75, 3001 Leuven (Belgium); Department of Electrical Engineering, KU Leuven, 3001 Leuven (Belgium); Verhulst, Anne S.; Mocuta, Anda; Collaert, Nadine; Thean, Aaron [imec, Kapeldreef 75, 3001 Leuven (Belgium); Van de Put, Maarten; Magnus, Wim [imec, Kapeldreef 75, 3001 Leuven (Belgium); Department of Physics, Universiteit Antwerpen, 2020 Antwerpen (Belgium); Sorée, Bart [imec, Kapeldreef 75, 3001 Leuven (Belgium); Department of Physics, Universiteit Antwerpen, 2020 Antwerpen (Belgium); Department of Electrical Engineering, KU Leuven, 3001 Leuven (Belgium)

    2015-10-07

    Efficient quantum mechanical simulation of tunnel field-effect transistors (TFETs) is indispensable to allow for an optimal configuration identification. We therefore present a full-zone 15-band quantum mechanical solver based on the envelope function formalism and employing a spectral method to reduce computational complexity and handle spurious solutions. We demonstrate the versatility of the solver by simulating a 40 nm wide In{sub 0.53}Ga{sub 0.47}As lineTFET and comparing it to p-n-i-n configurations with various pocket and body thicknesses. We find that the lineTFET performance is not degraded compared to semi-classical simulations. Furthermore, we show that a suitably optimized p-n-i-n TFET can obtain similar performance to the lineTFET.

  19. Tunnel field-effect transistor charge-trapping memory with steep subthreshold slope and large memory window

    Science.gov (United States)

    Kino, Hisashi; Fukushima, Takafumi; Tanaka, Tetsu

    2018-04-01

    Charge-trapping memory requires the increase of bit density per cell and a larger memory window for lower-power operation. A tunnel field-effect transistor (TFET) can achieve to increase the bit density per cell owing to its steep subthreshold slope. In addition, a TFET structure has an asymmetric structure, which is promising for achieving a larger memory window. A TFET with the N-type gate shows a higher electric field between the P-type source and the N-type gate edge than the conventional FET structure. This high electric field enables large amounts of charges to be injected into the charge storage layer. In this study, we fabricated silicon-oxide-nitride-oxide-semiconductor (SONOS) memory devices with the TFET structure and observed a steep subthreshold slope and a larger memory window.

  20. Perspective analysis of tri gate germanium tunneling field-effect transistor with dopant segregation region at source/drain

    Science.gov (United States)

    Liu, Liang-kui; Shi, Cheng; Zhang, Yi-bo; Sun, Lei

    2017-04-01

    A tri gate Ge-based tunneling field-effect transistor (TFET) has been numerically studied with technology computer aided design (TCAD) tools. Dopant segregated Schottky source/drain is applied to the device structure design (DS-TFET). The characteristics of the DS-TFET are compared and analyzed comprehensively. It is found that the performance of n-channel tri gate DS-TFET with a positive bias is insensitive to the dopant concentration and barrier height at n-type drain, and that the dopant concentration and barrier height at a p-type source considerably affect the device performance. The domination of electron current in the entire BTBT current of this device accounts for this phenomenon and the tri-gate DS-TFET is proved to have a higher performance than its dual-gate counterpart.

  1. Effect of tunneling layers on the performances of floating-gate based organic thin-film transistor nonvolatile memories

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Wei, E-mail: wwei99@jlu.edu.cn; Han, Jinhua; Ying, Jun; Xiang, Lanyi; Xie, Wenfa [State Key Laboratory on Integrated Optoelectronics, College of Electronic Science and Engineering, Jilin University, 2699 Qianjin Street, Changchun 130012 (China)

    2014-09-22

    Two types of floating-gate based organic thin-film transistor nonvolatile memories (FG-OTFT-NVMs) were demonstrated, with poly(methyl methacrylate co glycidyl methacrylate) (P(MMA-GMA)) and tetratetracontane (TTC) as the tunneling layer, respectively. Their device performances were measured and compared. In the memory with a P(MMA-GMA) tunneling layer, typical unipolar hole transport was obtained with a relatively small mobility of 0.16 cm{sup 2}/V s. The unidirectional shift of turn-on voltage (V{sub on}) due to only holes trapped/detrapped in/from the floating gate resulted in a small memory window of 12.5 V at programming/erasing voltages (V{sub P}/V{sub E}) of ±100 V and a nonzero reading voltage. Benefited from the well-ordered molecule orientation and the trap-free surface of TTC layer, a considerably high hole mobility of 1.7 cm{sup 2}/V s and a visible feature of electrons accumulated in channel and trapped in floating-gate were achieved in the memory with a TTC tunneling layer. High hole mobility resulted in a high on current and a large memory on/off ratio of 600 at the V{sub P}/V{sub E} of ±100 V. Both holes and electrons were injected into floating-gate and overwritten each other, which resulted in a bidirectional V{sub on} shift. As a result, an enlarged memory window of 28.6 V at the V{sub P}/V{sub E} of ±100 V and a zero reading voltage were achieved. Based on our results, a strategy is proposed to optimize FG-OTFT-NVMs by choosing a right tunneling layer to improve the majority carrier mobility and realize ambipolar carriers injecting and trapping in the floating-gate.

  2. Effect of tunneling layers on the performances of floating-gate based organic thin-film transistor nonvolatile memories

    International Nuclear Information System (INIS)

    Wang, Wei; Han, Jinhua; Ying, Jun; Xiang, Lanyi; Xie, Wenfa

    2014-01-01

    Two types of floating-gate based organic thin-film transistor nonvolatile memories (FG-OTFT-NVMs) were demonstrated, with poly(methyl methacrylate co glycidyl methacrylate) (P(MMA-GMA)) and tetratetracontane (TTC) as the tunneling layer, respectively. Their device performances were measured and compared. In the memory with a P(MMA-GMA) tunneling layer, typical unipolar hole transport was obtained with a relatively small mobility of 0.16 cm 2 /V s. The unidirectional shift of turn-on voltage (V on ) due to only holes trapped/detrapped in/from the floating gate resulted in a small memory window of 12.5 V at programming/erasing voltages (V P /V E ) of ±100 V and a nonzero reading voltage. Benefited from the well-ordered molecule orientation and the trap-free surface of TTC layer, a considerably high hole mobility of 1.7 cm 2 /V s and a visible feature of electrons accumulated in channel and trapped in floating-gate were achieved in the memory with a TTC tunneling layer. High hole mobility resulted in a high on current and a large memory on/off ratio of 600 at the V P /V E of ±100 V. Both holes and electrons were injected into floating-gate and overwritten each other, which resulted in a bidirectional V on shift. As a result, an enlarged memory window of 28.6 V at the V P /V E of ±100 V and a zero reading voltage were achieved. Based on our results, a strategy is proposed to optimize FG-OTFT-NVMs by choosing a right tunneling layer to improve the majority carrier mobility and realize ambipolar carriers injecting and trapping in the floating-gate.

  3. Effect of tunneling layers on the performances of floating-gate based organic thin-film transistor nonvolatile memories

    Science.gov (United States)

    Wang, Wei; Han, Jinhua; Ying, Jun; Xiang, Lanyi; Xie, Wenfa

    2014-09-01

    Two types of floating-gate based organic thin-film transistor nonvolatile memories (FG-OTFT-NVMs) were demonstrated, with poly(methyl methacrylate co glycidyl methacrylate) (P(MMA-GMA)) and tetratetracontane (TTC) as the tunneling layer, respectively. Their device performances were measured and compared. In the memory with a P(MMA-GMA) tunneling layer, typical unipolar hole transport was obtained with a relatively small mobility of 0.16 cm2/V s. The unidirectional shift of turn-on voltage (Von) due to only holes trapped/detrapped in/from the floating gate resulted in a small memory window of 12.5 V at programming/erasing voltages (VP/VE) of ±100 V and a nonzero reading voltage. Benefited from the well-ordered molecule orientation and the trap-free surface of TTC layer, a considerably high hole mobility of 1.7 cm2/V s and a visible feature of electrons accumulated in channel and trapped in floating-gate were achieved in the memory with a TTC tunneling layer. High hole mobility resulted in a high on current and a large memory on/off ratio of 600 at the VP/VE of ±100 V. Both holes and electrons were injected into floating-gate and overwritten each other, which resulted in a bidirectional Von shift. As a result, an enlarged memory window of 28.6 V at the VP/VE of ±100 V and a zero reading voltage were achieved. Based on our results, a strategy is proposed to optimize FG-OTFT-NVMs by choosing a right tunneling layer to improve the majority carrier mobility and realize ambipolar carriers injecting and trapping in the floating-gate.

  4. Computational study of heterojunction graphene nanoribbon tunneling transistors with p-d orbital tight-binding method

    Science.gov (United States)

    Kim, SungGeun; Luisier, Mathieu; Boykin, Timothy B.; Klimeck, Gerhard

    2014-06-01

    The graphene nanoribbon (GNR) tunneling field effect transistor (TFET) has been a promising candidate for a future low power logic device due to its sub-60 mV/dec subthreshold characteristic and its superior gate control on the channel electrons due to its one-dimensional nature. Even though many theoretical studies have been carried out, it is not clear that GNR TFETs would outperform conventional silicon metal oxide semiconductor field effect transistors (MOSFETs). With rigorous atomistic simulations using the p/d orbital tight-binding model, this study focuses on the optimization of GNR TFETs by tuning the doping density and the size of GNRs. It is found that the optimized GNR TFET can operate at a half of the supply voltage of silicon nanowire MOSFETs in the ballistic limit. However, a study on the effects of edge roughness on the performance of the optimized GNR TFET structure reveals that experimentally feasible edge roughness can deteriorates the on-current performance if the off-current is normalized with the low power requirement specified in the international technology roadmap for semiconductors.

  5. On the drain bias dependence of long-channel silicon-on-insulator-based tunnel field-effect transistors

    Science.gov (United States)

    Fukuda, Koichi; Mori, Takahiro; Asai, Hidehiro; Hattori, Junichi; Mizubayashi, Wataru; Morita, Yukinori; Fuketa, Hiroshi; Migita, Shinji; Ota, Hiroyuki; Masahara, Meishoku; Endo, Kazuhiko; Matsukawa, Takashi

    2017-04-01

    The drain bias dependence of tunnel field-effect transistors (TFETs) is examined on the basis of the measured characteristics and device simulation to understand the electrical behavior of TFETs. Our analyses focus on the long-channel silicon-on-insulator (SOI)-based TFETs as a good basis for further studies of short-channel effects, scaling issues, and more complicated device structures, such as multigate or nanowire TFETs. By device simulation, it is revealed that the drain bias dependence of the transfer characteristics of the measured TFETs is governed by two physical mechanisms: the density of states (DOS) occupancy factor, which depends on drain-to-source bias voltage, and channel electrostatic potential, which is limited by the drain bias through strong carrier accumulation. These mechanisms differ from the drain-induced barrier lowering (DIBL) of metal-oxide-semiconductor field-effect-transistors (MOSFETs), and cause a significant impact even in long-channel SOIs. Finally, the obtained insights are successfully implemented in a TFET compact model.

  6. Modeling and performance analysis of GaN nanowire field-effect transistors and band-to-band tunneling field-effect transistors

    Science.gov (United States)

    Khayer, M. Abul; Lake, Roger K.

    2010-11-01

    The real and imaginary bandstructures of deeply scaled GaN nanowire (NW) field-effect transistors (FETs) are calculated with an eight-band k ṡp model. Analysis of the transport properties of both GaN NW FETs and NW band-to-band tunneling FETs (TFETs) is presented. Deeply scaled n-type GaN NW FETs operate in the classical capacitance limit (CCL) in stead of operating in the quantum capacitance limit. This is a result of the high electron effective mass and high density of states. We discuss how the CCL operation of these devices affect the device performance. For the GaN NW FETs, within a source Fermi level of 0.2 eV, the current density varies from 5 to 8.5 A/mm. For the GaN TFETs, we present analysis on the effect of NW diameter on the on-currents, the off-currents, and the required electric fields. We show that a drive current of ˜0.05 A/mm can be achieved for the GaN NW TFETs. These devices show potential for high-speed and high-power applications.

  7. Current increment of tunnel field-effect transistor using InGaAs nanowire/Si heterojunction by scaling of channel length

    OpenAIRE

    Tomioka, Katsuhiro; Fukui, Takashi

    2014-01-01

    We report on a fabrication of tunnel field-effect transistors using InGaAs nanowire/Si heterojunctions and the characterization of scaling of channel lengths. The devices consisted of single InGaAs nanowires with a diameter of 30 nm grown on p-type Si(111) substrates. The switch demonstrated steep subthreshold-slope (30 mV/decade) at drain-source voltage (V-DS) of 0.10 V. Also, pinch-off behavior appeared at moderately low VDS, below 0.10 V. Reducing the channel length of the transistors atta...

  8. Temas de Física para Ingeniería: El transistor de unión

    OpenAIRE

    Beléndez Vázquez, Augusto; Pastor Antón, Carlos; Martín García, Agapito

    1990-01-01

    El transistor de unión bipolar. Tensiones y corrientes en el transistor. El transistor como amplificador. El transistor como conmutador. Transistores unipolares o de efecto de campo. El tiristor. Microelectrónica y circuitos integrados.

  9. Flexible semi-around gate silicon nanowire tunnel transistors with a sub-kT/q switch

    Science.gov (United States)

    Lee, Myeongwon; Jeon, Youngin; Kim, Minsuk; Kim, Sangsig

    2015-06-01

    Tunnel field-effect transistors (TFETs) with a subthreshold swing (SS) tunneling. In silicon (Si) channel materials, however, it still remains a challenge to obtain SS smaller than 60 mV/dec. In this study, we experimentally demonstrate the sub-60 mV/dec operation of a flexible semi-around gate TFET on a plastic substrate using Si nanowires (SiNWs) as the channel material. With the combined advantages of selectively thinned SiNW channels (width ˜ 15 nm and height ˜ 40 nm) and high-κ (Al2O3 ˜ 7 nm) gate dielectric, in conjunction with an abrupt degenerate source junction, the device with a channel length of ˜500 nm exhibits a minimal SS of ˜42 mV/dec at room temperature. Moreover, mechanical bendability of the device indicates that it has stable and good fatigue properties, providing an important step towards the realization of steep-slope switches for low-power and energy-efficient flexible electronics.

  10. Effects of band-tails on the subthreshold characteristics of nanowire band-to-band tunneling transistors

    Science.gov (United States)

    Khayer, M. Abul; Lake, Roger K.

    2011-10-01

    High source doping is required to support the high electric fields necessary to provide sufficient drive currents in interband tunnel field effect transistors (TFETs). High doping is associated with band-tails in the density of states that decay exponentially into the bandgap with decay constants that can be comparable to the room temperature thermal energy kBT. This compromises the core operational principal of a TFET of a hard energy cut-off to the injected channel carrier distribution provided by the source valence band edge. If the band-tails are limited to the source region, they have minimal effect for short channels ≤10 nm, since the leakage current is dominated by direct, coherent tunneling through the channel. For longer 20 nm channels, source band-tails can double the inverse subthreshold slope but still leave it below the ideal 60 mV/decade value with on-off current ratios greater than 106 using a supply voltage of 0.4 V. Band-tails both in the source and channel are more detrimental for both 10 and 20 nm channels. On-off current ratios are reduced to ≥103 and ≥104 for the 10 nm and 20 nm channel devices, respectively.

  11. Quantum confinement modulation on the performance of nanometer thin body GaSb/InAs tunnel field-effect transistors

    Science.gov (United States)

    Wang, Zhi; Wang, Liwei; En, Yunfei; Jiang, Xiang-Wei

    2017-06-01

    In this paper, we have presented an atomistic quantum simulation study to investigate the device performances of GaSb/InAs heterojunction tunnel field-effect transistors (TFETs) with nanometer body thicknesses. It is revealed that the thin junction induced quantum confinement effect results in a heterojunction type transition from type-III to type-II as the junction thickness reduces, which can be used as an effective modulation of the TFET device performance. It is found that as the channel thickness decreases, both the ON current and OFF current of the device decrease significantly due to the quantum confinement induced effective band gap enlargement. In addition, the OFF current of the heterojunction GaSb/InAs TFET is always larger than that of the homojunction InAs TFET, which is possibly caused by the GaSb/InAs interfacial state assisted tunneling. It is also revealed that the subthreshold swing of the heterojunction TFET does not change much as the channel thickness is reduced.

  12. GaAsSb/InGaAs heterojunction tunnel field-effect transistors with a heterogeneous channel

    Science.gov (United States)

    Lin, Chun-Wei; Chen, Hung-Ru; Yu, Yu-Tzu; Hsin, Yue-Ming

    2018-03-01

    This study presents a new structure to improve off-state current and ambipolar conduction in GaAsSb/InGaAs heterojunction tunnel field-effect transistors (HTFET). A GaAsSb/InGaAs heterogeneous channel was proposed to form p-GaAsSb/i-InGaAs junction at the source side and i-GaAsSb/n-InGaAs junction at the drain side. In the off-state bias condition, the band offsets of GaAsSb/InGaAs in the channel can prevent electrons tunneling to the drain side to reduce the leakage current and ambipolar conduction. Through simulation, heterogeneous channel HTFETs demonstrate that the off-state current can be reduced by four orders of magnitude and still demonstrate a high on-state current compared with GaAsSb/InGaAs HTFETs. As a result, the proposed heterogeneous channel HTFET exhibits suppressed ambipolar conduction even when the drain doping is as high as 1 × 1019 cm‑3.

  13. Normal metal tunnel junction-based superconducting quantum interference proximity transistor: the N-SQUIPT

    OpenAIRE

    D'Ambrosio, S.; Meissner, M.; Blanc, C.; Ronzani, A.; Giazotto, F.

    2015-01-01

    We report the fabrication and characterization of an alternative design for a superconducting quantum interference proximity transistor (SQUIPT) based on a normal metal (N) probe. The absence of direct Josephson coupling between the proximized metal nanowire and the N probe allows us to observe the full modulation of the wire density of states around zero voltage and current \\textit{via} the application of an external magnetic field. This results into a drastic suppression of power dissipatio...

  14. Current gain in sub-10 nm base GaN tunneling hot electron transistors with AlN emitter barrier

    International Nuclear Information System (INIS)

    Yang, Zhichao; Zhang, Yuewei; Nath, Digbijoy N.; Rajan, Siddharth; Khurgin, Jacob B.

    2015-01-01

    We report on Gallium Nitride-based tunneling hot electron transistor amplifier with common-emitter current gain greater than 1. Small signal current gain up to 5 and dc current gain of 1.3 were attained in common-emitter configuration with collector current density in excess of 50 kA/cm 2 . The use of a combination of 1 nm GaN/3 nm AlN layers as an emitter tunneling barrier was found to improve the energy collimation of the injected electrons. These results represent demonstration of unipolar vertical transistors in the III-nitride system that can potentially lead to higher frequency and power microwave devices

  15. A Steep-Slope Transistor Combining Phase-Change and Band-to-Band-Tunneling to Achieve a sub-Unity Body Factor.

    Science.gov (United States)

    Vitale, Wolfgang A; Casu, Emanuele A; Biswas, Arnab; Rosca, Teodor; Alper, Cem; Krammer, Anna; Luong, Gia V; Zhao, Qing-T; Mantl, Siegfried; Schüler, Andreas; Ionescu, A M

    2017-03-23

    Steep-slope transistors allow to scale down the supply voltage and the energy per computed bit of information as compared to conventional field-effect transistors (FETs), due to their sub-60 mV/decade subthreshold swing at room temperature. Currently pursued approaches to achieve such a subthermionic subthreshold swing consist in alternative carrier injection mechanisms, like quantum mechanical band-to-band tunneling (BTBT) in Tunnel FETs or abrupt phase-change in metal-insulator transition (MIT) devices. The strengths of the BTBT and MIT have been combined in a hybrid device architecture called phase-change tunnel FET (PC-TFET), in which the abrupt MIT in vanadium dioxide (VO 2 ) lowers the subthreshold swing of strained-silicon nanowire TFETs. In this work, we demonstrate that the principle underlying the low swing in the PC-TFET relates to a sub-unity body factor achieved by an internal differential gate voltage amplification. We study the effect of temperature on the switching ratio and the swing of the PC-TFET, reporting values as low as 4.0 mV/decade at 25 °C, 7.8 mV/decade at 45 °C. We discuss how the unique characteristics of the PC-TFET open new perspectives, beyond FETs and other steep-slope transistors, for low power electronics, analog circuits and neuromorphic computing.

  16. Tunneling-assisted transport of carriers through heterojunctions.

    Energy Technology Data Exchange (ETDEWEB)

    Wampler, William R. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Myers, Samuel M. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Modine, Normand A. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

    2017-10-01

    The formulation of carrier transport through heterojunctions by tunneling and thermionic emission is derived from first principles. The treatment of tunneling is discussed at three levels of approximation: numerical solution of the one-band envelope equation for an arbitrarily specified potential profile; the WKB approximation for an arbitrary potential; and, an analytic formulation assuming constant internal field. The effects of spatially varying carrier chemical potentials over tunneling distances are included. Illustrative computational results are presented. The described approach is used in exploratory physics models of irradiated heterojunction bipolar transistors within Sandia's QASPR program.

  17. A high performance Ge/Si0.5Ge0.5/Si heterojunction dual sources tunneling transistor with a U-shaped channel

    Science.gov (United States)

    Li, Wei; Liu, Hongxia; Wang, Shulong; Wang, Qianqiong; Chen, Shupeng

    2017-06-01

    In this paper, a new Ge/Si0.5Ge0.5/Si heterojunction dual sources tunneling transistor with a U-shaped channel (Ge_DUTFET) is proposed and investigated by Silvaco-Atlas simulation. The line tunneling perpendicular to channel and point tunneling parallel to channel simultaneously occur on both sides of the gate. The Ge is chosen as the source region material to increase the line tunneling current. The designed heterojunction between the Ge source and Si channel decreases the point tunneling barrier width to enhance the point tunneling current. And this heterojunction can also promote the Ge_DUTFET to occur point tunneling at the small gate voltage, which makes it obtain the smaller turn-on voltage. Furthermore, the Si0.5Ge0.5 buffer layer is also helpful for the enhancement of performance. The simulation results reveal that Ge_DUTFET has the better performance compared with the Si_DUTFET. The on-state current and average subthreshold swing of Ge_DUTFET are 1.11 × 10-5A/μm and 35.1mV/dec respectively. The max cut-off frequency (fT) and gain bandwidth product (GBW) are 26.6 GHz and 16.6 GHz respectively. The fT and GBW of the Ge_DUTFET are respectively increased by ∼27.4% and ∼84.3% compared with the Si_DUTFET.

  18. In-plane tunnelling field-effect transistor integrated on Silicon.

    Science.gov (United States)

    Fina, Ignasi; Apachitei, Geanina; Preziosi, Daniele; Deniz, Hakan; Kriegner, Dominik; Marti, Xavier; Alexe, Marin

    2015-09-25

    Silicon has persevered as the primary substrate of microelectronics during last decades. During last years, it has been gradually embracing the integration of ferroelectricity and ferromagnetism. The successful incorporation of these two functionalities to silicon has delivered the desired non-volatility via charge-effects and giant magneto-resistance. On the other hand, there has been a numerous demonstrations of the so-called magnetoelectric effect (coupling between ferroelectric and ferromagnetic order) using nearly-perfect heterostructures. However, the scrutiny of the ingredients that lead to magnetoelectric coupling, namely magnetic moment and a conducting channel, does not necessarily require structural perfection. In this work, we circumvent the stringent requirements for epilayers while preserving the magnetoelectric functionality in a silicon-integrated device. Additionally, we have identified an in-plane tunnelling mechanism which responds to a vertical electric field. This genuine electroresistance effect is distinct from known resistive-switching or tunnel electro resistance.

  19. Normal metal tunnel junction-based superconducting quantum interference proximity transistor

    Energy Technology Data Exchange (ETDEWEB)

    D' Ambrosio, Sophie, E-mail: sophie.dambrosio@nano.cnr.it; Meissner, Martin; Blanc, Christophe; Ronzani, Alberto; Giazotto, Francesco, E-mail: francesco.giazotto@sns.it [NEST, Istituto Nanoscienze-CNR and Scuola Normale Superiore, I-56127 Pisa (Italy)

    2015-09-14

    We report the fabrication and characterization of an alternative design for a superconducting quantum interference proximity transistor (SQUIPT) based on a normal metal (N) probe. The absence of direct Josephson coupling between the proximized metal nanowire and the N probe allows us to observe the full modulation of the wire density of states around zero voltage and current via the application of an external magnetic field. This results into a drastic suppression of power dissipation which can be as low as a few ∼10{sup −17} W. In this context, the interferometer allows an improvement of up to four orders of magnitude with respect to earlier SQUIPT designs and makes it ideal for extra-low power cryogenic applications. In addition, the N-SQUIPT has been recently predicted to be the enabling candidate for the implementation of coherent caloritronic devices based on proximity effect.

  20. Normal metal tunnel junction-based superconducting quantum interference proximity transistor

    Science.gov (United States)

    D'Ambrosio, Sophie; Meissner, Martin; Blanc, Christophe; Ronzani, Alberto; Giazotto, Francesco

    2015-09-01

    We report the fabrication and characterization of an alternative design for a superconducting quantum interference proximity transistor (SQUIPT) based on a normal metal (N) probe. The absence of direct Josephson coupling between the proximized metal nanowire and the N probe allows us to observe the full modulation of the wire density of states around zero voltage and current via the application of an external magnetic field. This results into a drastic suppression of power dissipation which can be as low as a few ˜10-17 W. In this context, the interferometer allows an improvement of up to four orders of magnitude with respect to earlier SQUIPT designs and makes it ideal for extra-low power cryogenic applications. In addition, the N-SQUIPT has been recently predicted to be the enabling candidate for the implementation of coherent caloritronic devices based on proximity effect.

  1. Individual Defects in InAs/InGaAsSb/GaSb Nanowire Tunnel Field-Effect Transistors Operating below 60 mV/decade.

    Science.gov (United States)

    Memisevic, Elvedin; Hellenbrand, Markus; Lind, Erik; Persson, Axel R; Sant, Saurabh; Schenk, Andreas; Svensson, Johannes; Wallenberg, Reine; Wernersson, Lars-Erik

    2017-07-12

    Tunneling field-effect transistors (TunnelFET), a leading steep-slope transistor candidate, is still plagued by defect response, and there is a large discrepancy between measured and simulated device performance. In this work, highly scaled InAs/In x Ga 1-x As y Sb 1-y /GaSb vertical nanowire TunnelFET with ability to operate well below 60 mV/decade at technically relevant currents are fabricated and characterized. The structure, composition, and strain is characterized using transmission electron microscopy with emphasis on the heterojunction. Using Technology Computer Aided Design (TCAD) simulations and Random Telegraph Signal (RTS) noise measurements, effects of different type of defects are studied. The study reveals that the bulk defects have the largest impact on the performance of these devices, although for these highly scaled devices interaction with even few oxide defects can have large impact on the performance. Understanding the contribution by individual defects, as outlined in this letter, is essential to verify the fundamental physics of device operation, and thus imperative for taking the III-V TunnelFETs to the next level.

  2. Tunnel field-effect transistors with germanium/strained-silicon hetero-junctions for low power applications

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Minsoo, E-mail: minsoo@mosfet.t.u-tokyo.ac.jp; Kim, Younghyun; Yokoyama, Masafumi; Nakane, Ryosho; Kim, SangHyeon; Takenaka, Mitsuru; Takagi, Shinichi

    2014-04-30

    We have studied a simple structure n-channel tunnel field-effect transistor with a pure-Ge/strained-Si hetero-junction. The device operation was demonstrated for the devices fabricated by combining epitaxially-grown Ge on strained-silicon-on-insulator substrates. Atomic-layer-deposition-Al{sub 2}O{sub 3}-based gate stacks were formed with electron cyclotron resonance plasma post oxidation to ensure the high quality metal–oxide–semiconductor interface between the high-k insulator and Ge. While the gate leakage current and drain current saturation are well controlled, relatively higher minimum subthreshold swing of 125 mV/dec and lower I{sub ON}/I{sub OFF} ratio of 10{sup 3}–10{sup 4} were obtained. It is expected that these device characteristics can be improved by further process optimization. - Highlights: • Layer by layer growth of Ge • Uniform interface between Ge and the insulator • Gate leakage current and drain current saturation seem to be well controlled. • The output characteristics show good saturation.

  3. Tunnel field-effect transistors with germanium/strained-silicon hetero-junctions for low power applications

    International Nuclear Information System (INIS)

    Kim, Minsoo; Kim, Younghyun; Yokoyama, Masafumi; Nakane, Ryosho; Kim, SangHyeon; Takenaka, Mitsuru; Takagi, Shinichi

    2014-01-01

    We have studied a simple structure n-channel tunnel field-effect transistor with a pure-Ge/strained-Si hetero-junction. The device operation was demonstrated for the devices fabricated by combining epitaxially-grown Ge on strained-silicon-on-insulator substrates. Atomic-layer-deposition-Al 2 O 3 -based gate stacks were formed with electron cyclotron resonance plasma post oxidation to ensure the high quality metal–oxide–semiconductor interface between the high-k insulator and Ge. While the gate leakage current and drain current saturation are well controlled, relatively higher minimum subthreshold swing of 125 mV/dec and lower I ON /I OFF ratio of 10 3 –10 4 were obtained. It is expected that these device characteristics can be improved by further process optimization. - Highlights: • Layer by layer growth of Ge • Uniform interface between Ge and the insulator • Gate leakage current and drain current saturation seem to be well controlled. • The output characteristics show good saturation

  4. Assessment of pseudo-bilayer structures in the heterogate germanium electron-hole bilayer tunnel field-effect transistor

    Energy Technology Data Exchange (ETDEWEB)

    Padilla, J. L., E-mail: jose.padilladelatorre@epfl.ch; Alper, C.; Ionescu, A. M. [Nanoelectronic Devices Laboratory, École Polytechnique Fédérale de Lausanne, Lausanne CH-1015 (Switzerland); Medina-Bailón, C.; Gámiz, F. [Departamento de Electrónica y Tecnología de los Computadores, Universidad de Granada, Avda. Fuentenueva s/n, 18071 Granada (Spain)

    2015-06-29

    We investigate the effect of pseudo-bilayer configurations at low operating voltages (≤0.5 V) in the heterogate germanium electron-hole bilayer tunnel field-effect transistor (HG-EHBTFET) compared to the traditional bilayer structures of EHBTFETs arising from semiclassical simulations where the inversion layers for electrons and holes featured very symmetric profiles with similar concentration levels at the ON-state. Pseudo-bilayer layouts are attained by inducing a certain asymmetry between the top and the bottom gates so that even though the hole inversion layer is formed at the bottom of the channel, the top gate voltage remains below the required value to trigger the formation of the inversion layer for electrons. Resulting benefits from this setup are improved electrostatic control on the channel, enhanced gate-to-gate efficiency, and higher I{sub ON} levels. Furthermore, pseudo-bilayer configurations alleviate the difficulties derived from confining very high opposite carrier concentrations in very thin structures.

  5. Self-Boosted Tunnel Field-Effect Transistor Using Nitride Charge Trapping Layer for Low Supply Voltage Operation.

    Science.gov (United States)

    Kim, Hyungjin; Kwon, Dae Woong; Kwon, Min-Woo; Park, Jungjin; Park, Byung-Gook

    2016-05-01

    Tunneling field-effect transistors (TFETs) have been studied as a candidate for low-power device due to the remarkable subthreshold characteristics. However, digital circuits composed of TFET have significantly large propagation delay compared with the conventional MOSFET circuits because of small current drivability and large gate-to-drain capacitance. In this work, the electrical characteristics of the self-boosted TFETs with nitride charge trapping layer have been studied using TCAD simulations. Trapped charges in the nitride layer improve subthreshold characteristics and on-current (I(ON)) of both nTFET and pTFET during gate bias sweep. In addition, the benefits of the self-boosted TFET devices to low supply voltage system application are investigated. Energy consumption and propagation delay of both conventional and self-boosted TFET inverters are compared by the mixed-mode circuit simulation study. Energy consumption is almost same but the propagation delay of the self-boosted TFET inverter is reduced especially for ultra-low voltage operation where system delay is increased dramatically.

  6. Single electron transistors with hydrogen treatment of ALD SiO2 in nanoscale metal-insulator-metal tunnel junctions

    Science.gov (United States)

    Karbasian, Golnaz; McConnell, Michael S.; Orlov, Alexei O.; Nazarov, Alexei N.; Snider, Gregory L.

    2017-05-01

    Over the past five years, fabrication of metal-insulator-metal (MIM) single electron transistors (SET) featuring atomic layer deposition (ALD) of ultrathin tunnel barrier dielectrics (SiO2, Al2O3) has been reported. However, the performance of fabricated devices was significantly compromised by the presence of native metal oxide and problems associated with the nucleation of ALD dielectrics on metal substrates. To overcome the difficulty of dielectric ALD nucleation on metal substrates, we recently developed a fabrication technique in which the native metal oxide naturally forming in the presence of the ALD oxidant precursor is first used to promote the nucleation of ALD dielectrics, and then is chemically reduced by forming gas anneal (FGA) at temperatures near 400 °C. However, despite the elimination of native oxide, low temperature characterization of the devices fabricated using FGA reveals excess ‘switching’ noise of a very large magnitude resulting from charged defects within the junctions. It has been previously reported that remote hydrogen plasma (RHP) treatment of SiO2 thin films effectively eradicates fabrication defects. This work reports a comparative study of Ni-based MIM SET treated with FGA and/or RHP. We show that, using a combination of FGA and RHP treatments, it is possible to obtain MIM junctions free of switching noise and without a detectable contribution of native oxide.

  7. In(0.52)Al(0.48)/In(0.53)Ga(0.47)As heterojunction bipolar transistor on GaAs by molecular beam epitaxy

    Science.gov (United States)

    Won, T.; Agarwala, S.; Morkoc, H.

    1988-12-01

    The successful operation of In(0.52)Al(0.48)As/In(0.53)Ga(0.47)As NpN double heterojunction bipolar transistors grown on GaAs substrates is reported. A 10-period AlAs/In(0.52)Al(0.48)As (20 A/20 A) strained-layer superlattice was repeated twice with intervening undoped In(0.52)Al(0.48)As layers to suppress the propagation of threading dislocations to the surface. The typical common emitter gain in 50 x 50 micron-squared emitter area devices was 50, with a maximum of 63, at a collector current density of 2000 A/sq cm.

  8. Three-dimensional simulation of fabrication process-dependent effects on single event effects of SiGe heterojunction bipolar transistor

    International Nuclear Information System (INIS)

    Zhang Jin-Xin; Guo Bao-Long; Wu Xian-Xiang; He Chao-Hui; Li Pei; Guo Hong-Xia

    2017-01-01

    The fabrication process dependent effects on single event effects (SEEs) are investigated in a commercial silicon–germanium heterojunction bipolar transistor (SiGe HBT) using three-dimensional (3D) TCAD simulations. The influences of device structure and doping concentration on SEEs are discussed via analysis of current transient and charge collection induced by ions strike. The results show that the SEEs representation of current transient is different from representation of the charge collection for the same process parameters. To be specific, the area of C/S junction is the key parameter that affects charge collection of SEE. Both current transient and charge collection are dependent on the doping of collector and substrate. The base doping slightly influences transient currents of base, emitter, and collector terminals. However, the SEEs of SiGe HBT are hardly affected by the doping of epitaxial base and the content of Ge. (paper)

  9. The high temperature DC characteristics of a high voltage lateral insulated-gate bipolar transistors with NPN anode in junction isolation technology

    Science.gov (United States)

    Tsai, Ying-Chieh; Gong, Jeng; Chan, Wing-Chor; Wu, Shyi-Yuan; Lien, Chenhsin

    2017-06-01

    The high temperature DC characteristics of a high-voltage bulk Si lateral insulated-gate bipolar transistor in junction isolation (JI-LIGBT) technology is studied intensively in this paper. The current density distribution in the off-state at different temperatures of three types of device structure is compared. By using the Quasi-vertical DMOSFET (QVDMOS or multi-channel, MC) structure, the electron injection from the channel into the n-drift region is significantly enhanced, and the current density is improved. In addition, by extending the p-top layer to the NPN anode not only improves the breakdown voltage but also reduces the substrate current as well as ensures high temperature stability.

  10. Enhanced Miller plateau characteristics of a 4H-SiC insulated-gate bipolar transistor in the presence of interface traps

    Science.gov (United States)

    Navarro, Dondee; Tone, Akihiro; Kikuchihara, Hideyuki; Morikawa, Yoji; Miura-Mattausch, Mitiko

    2017-04-01

    Miller plateau characteristics of a 4H-SiC insulated-gate bipolar transistor (IGBT) is investigated during a gate voltage turn-on under the presence of interface carrier traps at the MOSFET gate oxide. The plateau, which is observed in the device gate-emitter voltage, increased with respect to both height and length. The plateau height is mainly determined by the density increase of trap states, which also causes slow charging of the gate capacitance in the overlap region that results in a longer plateau length. The shallow trap states contribute mainly to the plateau increase. It is observed that the switching loss at turn-on can increase by more than 60% due mainly to the carrier traps at the shallow trap states.

  11. Study About High Influence Doping to Base Resistance and Bandgap Narrowing at Si/Si1-xGex/Si Heterojunction Bipolar Transistor

    Directory of Open Access Journals (Sweden)

    Achmad Fadhol

    2010-10-01

    Full Text Available Heterojunction is a link formed bedween two semiconductor materials and differend bandgap which has thinness under 50nm and grow the mixture of plate SiGe as bases. The link is an abrupt link or graded one. In this research learnt formulation of doping concentration influence to basis resistance and bandgap narrowing through Si/Si1-xGex/Si Heterojunction Bipolar Transistor with abrupt emitter-basis link, besides taking care to mobility and basis wide to basis resistance, it is also influence of mole fraction to bandgap power. From the result shows that doping concentration addition of NB=5.1018 cm-3 to NB=5.1020 cm-3 in basis can decrease resistance basis value about 3.6%, increase bandgap narrowing about 0.126, and increase collector current density for about 1.36 times to Ge 24%.

  12. Effects of base doping and carrier lifetime on differential current gain and temperature coefficient of 4H-SiC power bipolar junction transistors

    Science.gov (United States)

    Niu, X.; Fardi, H.

    2012-04-01

    4H-SiC NPN bipolar junction transistor (BJT) is studied systematically by performing two-dimensional numerical simulations. Several design issues are discussed. Depending on the doping concentration of the base and the carrier lifetimes, both positive and negative temperature coefficients in the common emitter current gain could exist in 4H-SiC NPN BJTs with aluminium-doped base. The temperature coefficients of the current gain at different base doping concentrations and different carrier lifetimes have been determined. A high base doping concentration can reduce the requirement for the carrier lifetime in order to obtain negative temperature coefficient in current gain. Device simulations are performed to evaluate the carrier lifetimes by fitting the measured output IC -VCE curves. An excellent fitting is obtained and the base electron lifetime and the emitter hole lifetime are extracted to be about 22 and 5.7 ns, respectively.

  13. Improved performance of nanoscale junctionless tunnel field-effect transistor based on gate engineering approach

    Science.gov (United States)

    Molaei Imen Abadi, Rouzbeh; Sedigh Ziabari, Seyed Ali

    2016-11-01

    In this paper, a first qualitative study on the performance characteristics of dual-work function gate junctionless TFET (DWG-JLTFET) on the basis of energy band profile modulation is investigated. A dual-work function gate technique is used in a JLTFET in order to create a downward band bending on the source side similar to PNPN structure. Compared with the single-work function gate junctionless TFET (SWG-JLTFET), the numerical simulation results demonstrated that the DWG-JLTFET simultaneously optimizes the ON-state current, the OFF-state leakage current, and the threshold voltage and also improves average subthreshold slope. It is illustrated that if appropriate work functions are selected for the gate materials on the source side and the drain side, the JLTFET exhibits a considerably improved performance. Furthermore, the optimization design of the tunnel gate length ( L Tun) for the proposed DWG-JLTFET is studied. All the simulations are done in Silvaco TCAD for a channel length of 20 nm using the nonlocal band-to-band tunneling (BTBT) model.

  14. Performance enhancement in uniaxially tensile stressed GeSn n-channel fin tunneling field-effect transistor: Impact of stress direction

    Science.gov (United States)

    Wang, Hongjuan; Han, Genquan; Jiang, Xiangwei; Liu, Yan; Zhang, Chunfu; Zhang, Jincheng; Hao, Yue

    2017-04-01

    In this work, the boosting effect on the performance of GeSn n-channel fin tunneling FET (nFinTFET) enabled by uniaxial tensile stress is investigated theoretically. As the fin rotates within the (001) plane, the uniaxial tensile stress is always along its direction. The electrical characteristics of tensile-stressed GeSn nFinTFETs with point and line tunneling modes are computed utilizing the technology computer aided design (TCAD) simulator in which the dynamic nonlocal band-to-band tunneling (BTBT) algorithm is employed. In comparison with the relaxed devices, tensile-stressed GeSn nFinTFETs achieve a substantial enhancement in band-to-band tunneling generation rate (G BTBT) and on-state current I ON owing to the reduced bandgap E G induced by the tensile stress. Performance improvement of GeSn nFinTFETs induced by tensile stress demonstrates a strong dependence on channel direction and tunneling modes. Under the same magnitude of stress, line-nFinTFETs obtain a more pronounced I ON enhancement over the transistors with point tunneling mode.

  15. High power gain switched laser diodes using a novel compact picosecond switch based on a GaAs bipolar junction transistor structure for pumping

    Science.gov (United States)

    Vainshtein, Sergey; Kostamovaara, Juha

    2006-04-01

    A number of up-to-date applications, including advanced optical radars with high single-shot resolution, precise 3 D imaging, laser tomography, time imaging spectroscopy, etc., require low-cost, compact, reliable sources enabling the generation of high-power (1-100 W) single optical pulses in the picosecond range. The well-known technique of using the gain-switching operation mode of laser diodes to generate single picosecond pulses in the mW range fails to generate high-power single picosecond pulses because of a lack of high-current switches operating in the picosecond range. We report here on the achieving of optical pulses of 45W / 70ps, or alternatively 5W / 40ps, with gain-switched commercial quantum well (QW) laser diodes having emitting areas of 250 × 200 μm and 75 × 2 μm, respectively. This was made possible by the use of a novel high-current avalanche switch based on a GaAs bipolar junction transistor (BJT) structure with a switching time (transistor structure.) A simulation code developed earlier but modified and carefully verified here allowed detailed comparison of the experimental and simulated laser responses and the transient spectrum.

  16. Vertical field effect tunneling transistor based on graphene-ultrathin Si nanomembrane heterostructures

    International Nuclear Information System (INIS)

    Das, Tanmoy; Jang, Houk; Bok Lee, Jae; Chu, Hyunwoo; Dae Kim, Seong; Ahn, Jong-Hyun

    2015-01-01

    Graphene-based heterostructured vertical transistors have attracted a great deal of research interest. Herein we propose a Si-based technology platform for creating graphene/ultrathin semiconductor/metal (GSM) junctions, which can be applied to large-scale and low-power electronics compatible with a variety of substrates. We fabricated graphene/Si nanomembrane (NM)/metal vertical heterostructures by using a dry transfer technique to transfer Si NMs onto chemical vapor deposition-grown graphene layers. The resulting van der Waals interfaces between graphene and p-Si NMs exhibited nearly ideal Schottky barrier behavior. Due to the low density of states of graphene, the graphene/Si NM Schottky barrier height can be modulated by modulating the band profile in the channel region, yielding well-defined current modulation. We obtained a maximum current on/off ratio (I on /I off ) of up to ∼10 3 , with a current density of 10 2 A cm −2 . We also observed significant dependence of Schottky barrier height Δφ b on the thickness of the Si NMs. We confirmed that the transport in these devices is dominated by the effects of the graphene/Si NM Schottky barrier. (paper)

  17. Investigation of analog/RF performance of staggered heterojunctions based nanowire tunneling field-effect transistors

    Science.gov (United States)

    Chakraborty, Avik; Sarkar, Angsuman

    2015-04-01

    In this paper, the analog/RF performance of an III-V semiconductor based staggered hetero-tunnel-junction (HETJ) n-type nanowire (NW) tunneling FET (n-TFET) is investigated, for the first time. The device performance figure-of-merits governing the analog/RF performance such as transconductance (gm), transconductance-to-drive current ratio (gm/IDS), output resistance (Rout), intrinsic gain and unity-gain cutoff frequency (fT) have been studied. The analog/RF performance parameters is compared between HETJ NW TFET and a homojunction (HJ) NW n-type TFET of similar dimensions. In addition to enhanced ION and subthreshold swing, a significant improvement in the analog/RF performance parameters obtained by the HETJ n-TFET over HJ counterpart for use in analog/mixed signal System-on-Chip (SoC) applications is reported. Moreover, the analog/RF performance parameters of a III-V based staggered HETJ NW TFET is also compared with a heterojunction (HETJ) NW n-type MOSFET having same material as HETJ n-TFET and equal dimension in order to provide a systematic comparison between HETJ-TFET and HETJ-MOSFET for use in analog/mixed-signal applications. The results reveal that HETJ n-TFET provides higher Rout and hence, a higher intrinsic gain, an improved gm/IDS ratio, and reasonable fT at lower values of gate-overdrive voltage as compared to the HETJ NW n-MOSFET.

  18. Impact of Layer Alignment on the Behavior of MoS2-ZrS2 Tunnel Field-Effect Transistors: An Ab Initio Study

    Science.gov (United States)

    Lu, Anh Khoa Augustin; Houssa, Michel; Luisier, Mathieu; Pourtois, Geoffrey

    2017-09-01

    Tunnel field-effect transistors based on van der Waals heterostructures are emerging device concepts for low-power applications, auguring sub -60 mV /dec subthreshold swing values. In these devices, the channel is built from a stack of several different two-dimensional materials whose nature allows tailoring the band alignments and enables a good electrostatic control of the device. In this work, we propose a theoretical study of the variability of the performances of a MoS2-ZrS2 tunnel field-effect transistor induced by fluctuations of the relative position or the orientation of the layers. Our results indicate that although a steep subthreshold slope (20 mV /dec ) is achievable, fluctuations in the relative orientation of the ZrS2 layer with respect to the MoS2 one lead to a significant variability in the tunneling current by about one decade. This arises from changes in the orbital overlap between the layers and from the modulation of the transport direction.

  19. Current increment of tunnel field-effect transistor using InGaAs nanowire/Si heterojunction by scaling of channel length

    Science.gov (United States)

    Tomioka, Katsuhiro; Fukui, Takashi

    2014-02-01

    We report on a fabrication of tunnel field-effect transistors using InGaAs nanowire/Si heterojunctions and the characterization of scaling of channel lengths. The devices consisted of single InGaAs nanowires with a diameter of 30 nm grown on p-type Si(111) substrates. The switch demonstrated steep subthreshold-slope (30 mV/decade) at drain-source voltage (VDS) of 0.10 V. Also, pinch-off behavior appeared at moderately low VDS, below 0.10 V. Reducing the channel length of the transistors attained a steep subthreshold slope (<60 mV/decade) and enhanced the drain current, which was 100 higher than that of the longer channels.

  20. On the Bipolar DC Flow Field-Effect-Transistor for Multifunctional Sample Handing in Microfluidics: A Theoretical Analysis under the Debye–Huckel Limit

    Directory of Open Access Journals (Sweden)

    Weiyu Liu

    2018-02-01

    Full Text Available We present herein a novel method of bipolar field-effect control on DC electroosmosis (DCEO from a physical point of view, in the context of an intelligent and robust operation tool for stratified laminar streams in microscale systems. In this unique design of the DC flow field-effect-transistor (DC-FFET, a pair of face-to-face external gate terminals are imposed with opposite gate-voltage polarities. Diffuse-charge dynamics induces heteropolar Debye screening charge within the diffuse double layer adjacent to the face-to-face oppositely-polarized gates, respectively. A background electric field is applied across the source-drain terminal and forces the face-to-face counterionic charge of reversed polarities into induced-charge electroosmotic (ICEO vortex flow in the lateral direction. The chaotic turbulence of the transverse ICEO whirlpool interacts actively with the conventional plug flow of DCEO, giving rise to twisted streamlines for simultaneous DCEO pumping and ICEO mixing of fluid samples along the channel length direction. A mathematical model in thin-layer approximation and the low-voltage limit is subsequently established to test the feasibility of the bipolar DC-FFET configuration in electrokinetic manipulation of fluids at the micrometer dimension. According to our simulation analysis, an integrated device design with two sets of side-by-side, but upside-down gate electrode pair exhibits outstanding performance in electroconvective pumping and mixing even without any externally-applied pressure difference. Moreover, a paradigm of a microdevice for fully electrokinetics-driven analyte treatment is established with an array of reversed bipolar gate-terminal pairs arranged on top of the dielectric membrane along the channel length direction, from which we can obtain almost a perfect liquid mixture by using a smaller magnitude of gate voltages for causing less detrimental effects at a small Dukhin number. Sustained by theoretical

  1. Diode, transistor & fet circuits manual

    CERN Document Server

    Marston, R M

    2013-01-01

    Diode, Transistor and FET Circuits Manual is a handbook of circuits based on discrete semiconductor components such as diodes, transistors, and FETS. The book also includes diagrams and practical circuits. The book describes basic and special diode characteristics, heat wave-rectifier circuits, transformers, filter capacitors, and rectifier ratings. The text also presents practical applications of associated devices, for example, zeners, varicaps, photodiodes, or LEDs, as well as it describes bipolar transistor characteristics. The transistor can be used in three basic amplifier configuration

  2. High current gain silicon-based spin transistor

    CERN Document Server

    Dennis, C L; Ensell, G J; Gregg, J F; Thompson, S M

    2003-01-01

    A silicon-based spin transistor of novel operating principle has been demonstrated in which the current gain at room temperature is 1.4 (n-type) and 0.97 (p-type). This high current gain was obtained from a hybrid metal/semiconductor analogue to the bipolar junction transistor which functions by tunnel-injecting carriers from a ferromagnetic emitter into a diffusion driven silicon base and then tunnel-collecting them via a ferromagnetic collector. The switching of the magnetic state of the collector ferromagnet controls the collector efficiency and the current gain. Furthermore, the magnetocurrent, which is determined to be 98% (140%) for p-type (n-type) in -110 Oe, is attributable to the spin-polarized base diffusion current.

  3. Capacitorless one-transistor dynamic random-access memory based on asymmetric double-gate Ge/GaAs-heterojunction tunneling field-effect transistor with n-doped boosting layer and drain-underlap structure

    Science.gov (United States)

    Yoon, Young Jun; Seo, Jae Hwa; Kang, In Man

    2018-04-01

    In this work, we present a capacitorless one-transistor dynamic random-access memory (1T-DRAM) based on an asymmetric double-gate Ge/GaAs-heterojunction tunneling field-effect transistor (TFET) for DRAM applications. The n-doped boosting layer and gate2 drain-underlap structure is employed in the device to obtain an excellent 1T-DRAM performance. The n-doped layer inserted between the source and channel regions improves the sensing margin because of a high rate of increase in the band-to-band tunneling (BTBT) probability. Furthermore, because the gate2 drain-underlap structure reduces the recombination rate that occurs between the gate2 and drain regions, a device with a gate2 drain-underlap length (L G2_D-underlap) of 10 nm exhibited a longer retention performance. As a result, by applying the n-doped layer and gate2 drain-underlap structure, the proposed device exhibited not only a high sensing margin of 1.11 µA/µm but also a long retention time of greater than 100 ms at a temperature of 358 K (85 °C).

  4. Tensile-strained nanoscale Ge/In0.16Ga0.84As heterostructure for tunnel field-effect transistor.

    Science.gov (United States)

    Zhu, Yan; Maurya, Deepam; Priya, Shashank; Hudait, Mantu K

    2014-04-09

    Tensile strained Ge/In0.16Ga0.84As heterostructure was grown in situ by molecular beam epitaxy using two separated growth chambers for Ge and III-V materials. Controlled growth conditions led to the presence of 0.75% in-plane tensile strain within Ge layer. High-resolution transmission electron microscopy confirmed pseudomorphic Ge with high crystalline quality and a sharp Ge/In0.16Ga0.84As heterointerface. Atomic force microscopy revealed a uniform two-dimensional cross-hatch surface morphology with a root-mean-square roughness of 1.26 nm. X-ray photoelectron spectroscopy demonstrated reduced tunneling-barrier-height compared with Ge/GaAs heterostructure. The superior structural properties suggest tensile strained Ge/In0.16Ga0.84As heterostructure would be a promising candidate for high-performance and energy-efficient tunnel field-effect transistor applications.

  5. Contribution to the study of fluctuations in transistors (bipolar and junction field effect types); Contribution a l'etude des fluctuations dans les transistors (bipolaires et a effet champ a jonctions)

    Energy Technology Data Exchange (ETDEWEB)

    Borel, J. [Commissariat a l' Energie Atomique, Grenoble (France). Centre d' Etudes Nucleaires

    1970-07-01

    A brief review of the basic theory of fluctuations in semiconductors is given: shot, thermal low frequency noise. A measuring set has been built to draw noise spectrums (current or voltage). Noise parameters of bipolar transistors are given, mainly noise voltage. Noise current, noise factor and correlation between noise sources are also calculated. Measurements of noise parameters fit well with theory for various devices made in different technologies: alloyed, mesa, planar. Then we give results of the calculation of noise parameters in a FET starting from a simplified model of the device. Low frequency noise is taken into account. Measurements of the parameters and of the spectrum agree fairly well with the theory. Studies of low frequency noise versus temperature give the density and energy of traps located in the space charge layers and an idea of the impurity encountered in these space charge layers. [French] On rappelle les notions de base de la theorie des fluctuations dans les semiconducteurs: bruit de grenaille, bruit thermique, bruit basse frequence. Un appareillage mis au point pour tracer un spectre de bruit est decrit. On presente ensuite le calcul des parametres de bruit d'un transistor bipolaire en insistant plus particulierement sur la tension de bruit ramenee a l'entree de l'element. Le courant de bruit, le facteur de bruit et la correlation entre les sources de bruit sont calcules. La mesure des parametres de bruit est faite sur divers elements realises dans diverses technologies: alliee, mesa et plane. Les mesures confirment tres bien la theorie. On presente ensuite le calcul des parametres de bruit d'un transistor a effet de champ en definissant un schema equivalent simple de l'element. Le calcul theorique des fluctuations basse frequence est aussi fait. La mesure du spectre de bruit confirme tres bien les calculs theoriques. L'etude du bruit basse frequence en fonction de la temperature permet de remonter a la

  6. Estudio teórico y práctico del régimen de avalancha en los transistores bipolares

    Directory of Open Access Journals (Sweden)

    Yunior Ávila Vázquez

    2011-09-01

    Full Text Available Normal 0 21 false false false MicrosoftInternetExplorer4 /* Style Definitions */ table.MsoNormalTable {mso-style-name:"Tabla normal"; mso-tstyle-rowband-size:0; mso-tstyle-colband-size:0; mso-style-noshow:yes; mso-style-parent:""; mso-padding-alt:0cm 5.4pt 0cm 5.4pt; mso-para-margin:0cm; mso-para-margin-bottom:.0001pt; mso-pagination:widow-orphan; font-size:10.0pt; font-family:"Times New Roman"; mso-ansi-language:#0400; mso-fareast-language:#0400; mso-bidi-language:#0400;} Se realiza un estudio teórico de la zona de ruptura por avalancha de los Transistores Bipolares y la caracterización de los mismos en dichas condiciones extremas de trabajo, para obtener los datos necesarios y de esta manera un criterio de selección, que permitan utilizarlos en un generador de pulsos, basado en la topología del banco de Marx y lograr un funcionamiento adecuado de este, aunque estos transistores no estén diseñados para trabajar en avalancha. Normal 0 21 false false false MicrosoftInternetExplorer4 /* Style Definitions */ table.MsoNormalTable {mso-style-name:"Tabla normal"; mso-tstyle-rowband-size:0; mso-tstyle-colband-size:0; mso-style-noshow:yes; mso-style-parent:""; mso-padding-alt:0cm 5.4pt 0cm 5.4pt; mso-para-margin:0cm; mso-para-margin-bottom:.0001pt; mso-pagination:widow-orphan; font-size:10.0pt; font-family:"Times New Roman"; mso-ansi-language:#0400; mso-fareast-language:#0400; mso-bidi-language:#0400;}

  7. A silicon doped hafnium oxide ferroelectric p–n–p–n SOI tunneling field–effect transistor with steep subthreshold slope and high switching state current ratio

    Directory of Open Access Journals (Sweden)

    Saeid Marjani

    2016-09-01

    Full Text Available In this paper, a silicon–on–insulator (SOI p–n–p–n tunneling field–effect transistor (TFET with a silicon doped hafnium oxide (Si:HfO2 ferroelectric gate stack is proposed and investigated via 2D device simulation with a calibrated nonlocal band–to–band tunneling model. Utilization of Si:HfO2 instead of conventional perovskite ferroelectrics such as lead zirconium titanate (PbZrTiO3 and strontium bismuth tantalate (SrBi2Ta2O9 provides compatibility to the CMOS process as well as improved device scalability. By using Si:HfO2 ferroelectric gate stack, the applied gate voltage is effectively amplified that causes increased electric field at the tunneling junction and reduced tunneling barrier width. Compared with the conventional p–n–p–n SOI TFET, the on–state current and switching state current ratio are appreciably increased; and the average subthreshold slope (SS is effectively reduced. The simulation results of Si:HfO2 ferroelectric p–n–p–n SOI TFET show significant improvement in transconductance (∼9.8X enhancement at high overdrive voltage and average subthreshold slope (∼35% enhancement over nine decades of drain current at room temperature, indicating that this device is a promising candidate to strengthen the performance of p–n–p–n and conventional TFET for a switching performance.

  8. Analog/RF performance of L- and U-shaped channel tunneling field-effect transistors and their application as digital inverters

    Science.gov (United States)

    Wang, Qianqiong; Wang, Shulong; Liu, Hongxia; Li, Wei; Chen, Shupeng

    2017-06-01

    The inverter performance comparisons of L- and U-shaped channel tunneling field-effect transistors (LTFET and UTFET) are investigated by using Sentaurus TCAD tool. The RF figures of merit for these two TFETs are analyzed in terms of transconductance (g m), output conductance (g ds), gate capacitance (C gg), gate-to-source capacitance (C gs), gate-to-drain capacitance (C gd), unit-gain cut-off frequency (f T), the maximum frequency of oscillation (f MAX) and gain bandwidth product (GBW). The simulation results reveal that LTFET and UTFET have the similar DC characteristic due to the identical tunneling process. And the better RF performance LTFET provides due to it has the much smaller C gd than UTFET. Meanwhile, this work uses mixed device-circuit simulations to predict the performance of inverter circuit implemented with LTFET and UTFET for the first time. And the calculated results demonstrate LTFET is more optimization for inverter circuit design in the novel generation transistors. And all the simulation results in this paper can be used as a reference to choose the characteristic parameters of novel TFETs for inverter applications.

  9. Amorphous silicon germanium carbide photo sensitive bipolar junction transistor with a base-contact and a continuous tunable high current gain

    Energy Technology Data Exchange (ETDEWEB)

    Bablich, A., E-mail: andreas.bablich@uni-siegen.de [Department of Electrical and Computer Engineering, Institute for Microsystem Technologies, University of Siegen, Hoelderlinstrasse 3, 57076 Siegen (Germany); Merfort, C., E-mail: merfort@imt.e-technik.uni-siegen.de [Department of Electrical and Computer Engineering, Institute for Microsystem Technologies, University of Siegen, Hoelderlinstrasse 3, 57076 Siegen (Germany); Eliasz, J., E-mail: jacek.eliasz@student.uni-siegen.de [Department of Electrical and Computer Engineering, Institute for Microsystem Technologies, University of Siegen, Hoelderlinstrasse 3, 57076 Siegen (Germany); Schäfer-Eberwein, H., E-mail: heiko.schaefer@uni-siegen.de [Department of Electrical and Computer Engineering, Institute of High Frequency and Quantum Electronics, University of Siegen, Hoelderlinstrasse 3, 57076 Siegen (Germany); Haring-Bolivar, P., E-mail: peter.haring@uni-siegen.de [Department of Electrical and Computer Engineering, Institute of High Frequency and Quantum Electronics, University of Siegen, Hoelderlinstrasse 3, 57076 Siegen (Germany); Boehm, M., E-mail: markus.boehm@uni-siegen.de [Department of Electrical and Computer Engineering, Institute for Microsystem Technologies, University of Siegen, Hoelderlinstrasse 3, 57076 Siegen (Germany)

    2014-05-02

    In this paper, the design, fabrication and characterization of an amorphous silicon germanium carbide (a-SiGeC:H) photo sensitive bipolar junction transistor (PS-BJT) with three terminals are presented. Whereas the current gain of similar transistor devices presented in the past (Wu et al., 1984; Hwang et al., 1993; Nascetti and Caputo, 2002; Chang et al., 1985a,b; Wu et al, 1985; Hong et al., 1990) can only be controlled with photo induced charge generation, the n–i–δp–i–n structure developed features a contacted base to provide the opportunity to adjust the current gain optically and electrically, too. Electron microscope-, current-/voltage- and spectral measurements were performed to study the PS-BJT behavior and calculate the electrical and optical current gain. The spectral response maximum of the base–collector diode has a value of 170 mA/W applying a base–collector voltage of − 1 V and is located at 620 nm. The base–emitter diode reaches a sensitivity of 25.7 mA/W at 530 nm with a base-emitter voltage of − 3 V. The good a-Si:H transport properties are validated in a μτ-product of 4.6 × 10{sup −6} cm{sup 2} V s, which is sufficient to reach a continuous base- and photo-tunable current gain of up to − 126 at a base current of I{sub B} = + 10 nA and a collector–emitter voltage of V{sub CE} = − 3 V. The transistor obtains a maximum collector current of − 65.5 μA (V{sub CE} = − 3 V) and + 56.2 μA (V{sub CE} = + 3 V) at 10,000 lx 5300 K white-light illumination. At 3300 lx, the electrical current gain reaches a value of + 100 (V{sub CE} = + 2 V) at I{sub B} = 10 nA. With a negative base current of I{sub B} = − 10 nA the electrical gain can be adjusted between 87 (V{sub CE} = + 2 V) and − 106 (V{sub CE} = -3 V), respectively. When no base charge is applied, the transistor is “off” for V{sub CE} > − 3 V. Reducing the base current increases the electrical current gain. Operating with a voltage V{sub CE} of just ± 2 V

  10. Vertical Hole Transport and Carrier Localization in InAs /InAs1 -xSbx Type-II Superlattice Heterojunction Bipolar Transistors

    Science.gov (United States)

    Olson, B. V.; Klem, J. F.; Kadlec, E. A.; Kim, J. K.; Goldflam, M. D.; Hawkins, S. D.; Tauke-Pedretti, A.; Coon, W. T.; Fortune, T. R.; Shaner, E. A.; Flatté, M. E.

    2017-02-01

    Heterojunction bipolar transistors are used to measure vertical hole transport in narrow-band-gap InAs /InAs1 -xSbx type-II superlattices (T2SLs). Vertical hole mobilities (μh) are reported and found to decrease rapidly from 360 cm2/V s at 120 K to approximately 2 cm2/V s at 30 K, providing evidence that holes are confined to localized states near the T2SL valence-miniband edge at low temperatures. Four distinct transport regimes are identified: (1) pure miniband transport, (2) miniband transport degraded by temporary capture of holes in localized states, (3) hopping transport between localized states in a mobility edge, and (4) hopping transport through defect states near the T2SL valence-miniband edge. Region (2) is found to have a thermal activation energy of ɛ2=36 meV corresponding to the energy range of a mobility edge. Region (3) is found to have a thermal activation energy of ɛ3=16 meV corresponding to the hopping transport activation energy. This description of vertical hole transport is analogous to electronic transport observed in disordered amorphous semiconductors displaying Anderson localization. For the T2SL, we postulate that localized states are created by disorder in the group-V alloy of the InAs1 -xSbx hole well causing fluctuations in the T2SL valence-band energy.

  11. Standard Test Method for Use of 2N2222A Silicon Bipolar Transistors as Neutron Spectrum Sensors and Displacement Damage Monitors

    CERN Document Server

    American Society for Testing and Materials. Philadelphia

    2010-01-01

    1.1 This test method covers the use of 2N2222A silicon bipolar transistors as dosimetry sensors in the determination of neutron energy spectra, and as silicon 1-MeV(Si) equivalent displacement damage fluence monitors. 1.2 The neutron displacement damage is especially valuable as a neutron spectrum sensor in the range 0.1 to 2.0 MeV when fission foils are not available. It has been applied in the fluence range between 2 × 10 12 n/cm2 and 1 × 1014 n/cm2 and should be useful up to 1015 n/cm2. This test method details the steps for the acquisition and use of silicon 1-MeV equivalent fluence information (in a manner similar to the use of activation foil data) for the determination of neutron spectra. 1.3 In addition, this sensor can provide important confirmation of neutron spectra determined with other sensors, and yields a direct measurement of the silicon 1-MeV fluence by the transfer technique. 1.4 The values stated in SI units are to be regarded as standard. No other units of measurement are included in ...

  12. Spin-dependent quasiparticle transport in aluminum single-electron transistors.

    Science.gov (United States)

    Ferguson, A J; Andresen, S E; Brenner, R; Clark, R G

    2006-08-25

    We investigate the effect of Zeeman splitting on quasiparticle transport in normal-superconducting-normal (NSN) aluminum single-electron transistors (SETs). In the above-gap transport, the interplay of Coulomb blockade and Zeeman splitting leads to spin-dependence of the sequential tunneling. This creates regimes where either one or both spin species can tunnel onto or off the island. At lower biases, spin-dependence of the single quasiparticle state is studied, and operation of the device as a bipolar spin filter is suggested.

  13. A Resonant Tunneling Nanowire Field Effect Transistor with Physical Contractions: A Negative Differential Resistance Device for Low Power Very Large Scale Integration Applications

    Science.gov (United States)

    Molaei Imen Abadi, Rouzbeh; Saremi, Mehdi

    2018-02-01

    In this paper, the influence of ultra-scaled physical symmetrical contraction on electrical characteristics of ultra-thin silicon-on-insulator nanowires with circular gate-all-around structure is investigated by using a 3D Atlas numerical quantum simulator based on non-equilibrium green's function formalism. It is demonstrated that local cross-section variation in a nanowire transistor results in the establishment of tunnel energy barriers at the source-channel and drain-channel junctions which change device physics and cause a transmission from a quantum wire (1-D) to a floating quantum dot nanowire (0-D) introducing a resonant tunneling nanowire FET (RT-NWFET) as an interesting concept of nanoscale MOSFETs. The barriers construct resonance energy levels in the channel region of nanowires because of the longitudinal confinement in three directions causing some fluctuation in I D- V GS characteristic. In addition, these barriers remarkably improve the subthreshold swing and minimize the ON/OFF-current ratio degradation at a low operation voltage of 0.5 V. As a result, RT-NWFETs are intrinsically preserved from drain-source tunneling and are an interesting candidate for developing the roadmap below 10 nm.

  14. Comparison of the leading-edge timing walk in pulsed TOF laser range finding with avalanche bipolar junction transistor (BJT) and metal-oxide-semiconductor (MOS) switch based laser diode drivers.

    Science.gov (United States)

    Hintikka, Mikko; Hallman, Lauri; Kostamovaara, Juha

    2017-12-01

    Timing walk error in pulsed time-of-flight based laser range finding was studied using two different types of laser diode drivers. The study compares avalanche bipolar junction transistor (BJT) and metal-oxide-semiconductor field-effect transistor switch based laser pulse drivers, both producing 1.35 ns current pulse length (full width at half maximum), and investigates how the slowly rising part of the current pulse of the avalanche BJT based driver affects the leading edge timing walk. The walk error was measured to be very similar with both drivers within an input signal dynamic range of 1:10 000 (receiver bandwidth of 700 MHz) but increased rapidly with the avalanche BJT based driver at higher values of dynamic range. The slowly rising part does not exist in the current pulse produced by the metal-oxide-semiconductor (MOS) based laser driver, and thus the MOS based driver can be utilized in a wider dynamic range.

  15. Device simulation of GeSn/GeSiSn pocket n-type tunnel field-effect transistor for analog and RF applications

    Science.gov (United States)

    Wang, Suyuan; Zheng, Jun; Xue, Chunlai; Li, Chuanbo; Zuo, Yuhua; Cheng, Buwen; Wang, Qiming

    2017-11-01

    We present the device simulations of analog and radio frequency (RF) performances of four double-gate pocket n-type tunneling field-effect transistors (NTFETs). The direct current (DC), analog and RF performances of the Ge-homo, GeSn-homo, GeSn/Ge and GeSn/GeSiSn NTFETs, are compared. The GeSn NTFETs greatly improve the on-state current (ION) and average subthreshold slope (SS), when compared with the Ge NTFET. Moreover, the GeSn/GeSiSn NTFET has the largest intrinsic gain (Av), and exhibits a suppressed ambipolar behavior, improved cut-off frequency (fT), and gain bandwidth product (GBW), according to the analyzed analog and RF figures of merit (FOM). Therefore, it can be concluded that the GeSn/GeSiSn NTFET has great potential as a promising candidate for the realization of future generation low-power analog/RF applications.

  16. Transistors and tunnel diodes enabled by large-scale MoS2 nanosheets grown on GaN

    Science.gov (United States)

    San Yip, Pak; Zou, Xinbo; Cho, Wai Ching; Wu, Kam Lam; Lau, Kei May

    2017-07-01

    We report growth, fabrication, and device results of MoS2-based transistors and diodes implemented on a single 2D/3D material platform. The 2D/3D platform consists of a large-area MoS2 thin film grown on SiO2/p-GaN substrates. Atomic force microscopy, scanning electron microscopy, and Raman spectroscopy were used to characterize the thickness and quality of the as-grown MoS2 film, showing that the large-area MoS2 nanosheet has a smooth surface morphology constituted by small grains. Starting from the same material, both top-gated MoS2 field effect transistors and MoS2/SiO2/p-GaN heterojunction diodes were fabricated. The transistors exhibited a high on/off ratio of 105, a subthreshold swing of 74 mV dec-1, field effect mobility of 0.17 cm2 V-1 s-1, and distinctive current saturation characteristics. For the heterojunction diodes, current-rectifying characteristics were demonstrated with on-state current density of 29 A cm-2 and a current blocking property up to -25 V without breakdown. The reported transistors and diodes enabled by the same 2D/3D material stack present promising building blocks for constructing future nanoscale electronics.

  17. Fabrication and electrical characterization of homo- and hetero-structure Si/SiGe nanowire Tunnel Field Effect Transistor grown by vapor-liquid-solid mechanism

    Science.gov (United States)

    Brouzet, V.; Salem, B.; Periwal, P.; Alcotte, R.; Chouchane, F.; Bassani, F.; Baron, T.; Ghibaudo, G.

    2016-04-01

    We demonstrate the fabrication and electrical characterization of Ω -gate Tunnel Field Effect Transistors (TFET) based on p-Si/i-Si/n+Si0.7Ge0.3 heterostructure nanowires grown by Chemical Vapor Deposition (CVD) using the vapor-liquid-solid (VLS) mechanism. The electrical performances of the p-Si/i-Si/n+Si0.7Ge0.3 heterostructure TFET device are presented and compared to Si and Si0.7Ge0.3 homostructure nanowire TFETs. We observe an improvement of the electrical performances of TFET with p-Si/i-Si/n+Si0.7Ge0.3 heterostructure nanowire (HT NW). The optimized devices present an Ion current of about 245 nA at VDS = -0.5 V and VGS = -3 V with a subthreshold swing around 135 mV/dec. Finally, we show that the electrical results are in good agreement with numerical simulation using Kane's Band-to-Band Tunneling model.

  18. Broad Beam and Ion Microprobe Studies of Single-Event Upsets in High Speed 0.18micron Silicon Germanium Heterojunction Bipolar Transistors and Circuits

    Science.gov (United States)

    Reed, Robert A.; Marshall, Paul W.; Pickel, Jim; Carts, Martin A.; Irwin, TIm; Niu, Guofu; Cressler, John; Krithivasan, Ramkumar; Fritz, Karl; Riggs, Pam

    2003-01-01

    SiGe based technology is widely recognized for its tremendous potential to impact the high speed microelectronic industry, and therefore the space industry, by monolithic incorporation of low power complementary logic with extremely high speed SiGe Heterojunction Bipolar Transistor (HBT) logic. A variety of studies have examined the ionizing dose, displacement damage and single event characteristics, and are reported. Accessibility to SiGe through an increasing number of manufacturers adds to the importance of understanding its intrinsic radiation characteristics, and in particular the single event effect (SEE) characteristics of the high bandwidth HBT based circuits. IBM is now manufacturing in its 3rd generation of their commercial SiGe processes, and access is currently available to the first two generations (known as and 6HP) through the MOSIS shared mask services with anticipated future release of the latest (7HP) process. The 5 HP process is described and is characterized by a emitter spacing of 0.5 micron and a cutoff frequency ff of 50 GHz, whereas the fully scaled 7HP HBT employs a 0.18 micron emitter and has an fT of 120 GHz. Previous investigations have the examined SEE response of 5 HP HBT circuits through both circuit testing and modeling. Charge collection modeling studies in the 5 H P process have also been conducted, but to date no measurements have been reported of charge collection in any SiGe HBT structures. Nor have circuit models for charge collection been developed in any version other than the 5 HP HBT structure. Our investigation reports the first indications of both charge collection and circuit response in IBM s 7HP-based SiGe process. We compare broad beam heavy ion SEU test results in a fully function Pseudo-Random Number (PRN) sequence generator up to frequencies of 12 Gbps versus effective LET, and also report proton test results in the same circuit. In addition, we examine the charge collection characteristics of individual 7HP HBT

  19. Features of carrier tunneling between the silicon valence band and metal in devices based on the Al/high-K oxide/SiO{sub 2}/Si structure

    Energy Technology Data Exchange (ETDEWEB)

    Vexler, M. I., E-mail: shulekin@mail.ioffe.ru; Grekhov, I. V. [Russian Academy of Sciences, Ioffe Physical–Technical Institute (Russian Federation)

    2016-05-15

    The features of electron tunneling from or into the silicon valence band in a metal–insulator–semiconductor system with the HfO{sub 2}(ZrO{sub 2})/SiO{sub 2} double-layer insulator are theoretically analyzed for different modes. It is demonstrated that the valence-band current plays a less important role in structures with HfO{sub 2}(ZrO{sub 2})/SiO{sub 2} than in structures containing only silicon dioxide. In the case of a very wide-gap high-K oxide ZrO{sub 2}, nonmonotonic behavior related to tunneling through the upper barrier is predicted for the valence-band–metal current component. The use of an insulator stack can offer certain advantages for some devices, including diodes, bipolar tunnel-emitter transistors, and resonant-tunneling diodes, along with the traditional use of high-K insulators in a field-effect transistor.

  20. A predictive analytic model for high-performance tunneling field-effect transistors approaching non-equilibrium Green's function simulations

    International Nuclear Information System (INIS)

    Salazar, Ramon B.; Appenzeller, Joerg; Ilatikhameneh, Hesameddin; Rahman, Rajib; Klimeck, Gerhard

    2015-01-01

    A new compact modeling approach is presented which describes the full current-voltage (I-V) characteristic of high-performance (aggressively scaled-down) tunneling field-effect-transistors (TFETs) based on homojunction direct-bandgap semiconductors. The model is based on an analytic description of two key features, which capture the main physical phenomena related to TFETs: (1) the potential profile from source to channel and (2) the elliptic curvature of the complex bands in the bandgap region. It is proposed to use 1D Poisson's equations in the source and the channel to describe the potential profile in homojunction TFETs. This allows to quantify the impact of source/drain doping on device performance, an aspect usually ignored in TFET modeling but highly relevant in ultra-scaled devices. The compact model is validated by comparison with state-of-the-art quantum transport simulations using a 3D full band atomistic approach based on non-equilibrium Green's functions. It is shown that the model reproduces with good accuracy the data obtained from the simulations in all regions of operation: the on/off states and the n/p branches of conduction. This approach allows calculation of energy-dependent band-to-band tunneling currents in TFETs, a feature that allows gaining deep insights into the underlying device physics. The simplicity and accuracy of the approach provide a powerful tool to explore in a quantitatively manner how a wide variety of parameters (material-, size-, and/or geometry-dependent) impact the TFET performance under any bias conditions. The proposed model presents thus a practical complement to computationally expensive simulations such as the 3D NEGF approach

  1. Integrated ZnO Nano-Electron-Emitter with Self-Modulated Parasitic Tunneling Field Effect Transistor at the Surface of the p-Si/ZnO Junction

    Science.gov (United States)

    Cao, Tao; Luo, Laitang; Huang, Yifeng; Ye, Bing; She, Juncong; Deng, Shaozhi; Chen, Jun; Xu, Ningsheng

    2016-01-01

    The development of high performance nano-electron-emitter arrays with well reliability still proves challenging. Here, we report a featured integrated nano-electron-emitter. The vertically aligned nano-emitter consists of two segments. The top segment is an intrinsically lightly n-type doped ZnO nano-tip, while the bottom segment is a heavily p-type doped Si nano-pillar (denoted as p-Si/ZnO nano-emitter). The anode voltage not only extracted the electron emission from the emitter apex but also induced the inter-band electron tunneling at the surface of the p-Si/ZnO nano-junction. The designed p-Si/ZnO emitter is equivalent to a ZnO nano-tip individually ballasted by a p-Si/ZnO diode and a parasitic tunneling field effect transistor (TFET) at the surface of the p-Si/ZnO junction. The parasitic TFET provides a channel for the supply of emitting electron, while the p-Si/ZnO diode is benefit for impeding the current overloading and prevent the emitters from a catastrophic breakdown. Well repeatable and stable field emission current were obtained from the p-Si/ZnO nano-emitters. High performance nano-emitters was developed using diamond-like-carbon coated p-Si/ZnO tip array (500 × 500), i.e., 178 μA (4.48 mA/cm2) at 75.7 MV/m. PMID:27654068

  2. Improvement in the performance of graphene nanoribbon p-i-n tunneling field effect transistors by applying lightly doped profile on drain region

    Science.gov (United States)

    Naderi, Ali

    2017-12-01

    In this paper, an efficient structure with lightly doped drain region is proposed for p-i-n graphene nanoribbon field effect transistors (LD-PIN-GNRFET). Self-consistent solution of Poisson and Schrödinger equation within Nonequilibrium Green’s function (NEGF) formalism has been employed to simulate the quantum transport of the devices. In proposed structure, source region is doped by constant doping density, channel is an intrinsic GNR, and drain region contains two parts with lightly and heavily doped doping distributions. The important challenge in tunneling devices is obtaining higher current ratio. Our simulations demonstrate that LD-PIN-GNRFET is a steep slope device which not only reduces the leakage current and current ratio but also enhances delay, power delay product, and cutoff frequency in comparison with conventional PIN GNRFETs with uniform distribution of impurity and with linear doping profile in drain region. Also, the device is able to operate in higher drain-source voltages due to the effectively reduced electric field at drain side. Briefly, the proposed structure can be considered as a more reliable device for low standby-power logic applications operating at higher voltages and upper cutoff frequencies.

  3. Germanene nanoribbon tunneling field effect transistor (GeNR-TFET) with a 10 nm channel length: analog performance, doping and temperature effects

    International Nuclear Information System (INIS)

    Bayani, Amir Hossein; Vali, Mehran; Dideban, Daryoosh; Moezi, Negin

    2016-01-01

    In this paper, a scheme of the germanene nanoribbon tunneling field effect transistor (GeNR-TFET) is proposed. The characteristics and analog performance of the device were theoretically investigated by exploiting the electrical properties of a germanene nanoribbon and applying the doping concentration in the source and drain regions at 300 K and 4 K temperatures. The device parameters were obtained using a non-equilibrium Green’s function (NEGF) method within the tight binding (TB) Hamiltonian. The TB Hamiltonian was extracted from the density functional theory (DFT) through the Wannier function. We find that by increasing the doping concentration the I on current increases which leads to an improvement of the I on /I off ratio to 10 5 . Moreover, decreasing the temperature from 300 K to 4 K causes the I off to become ten times smaller. We find that the device output characteristic displays a negative differential conductance with a good peak-to-valley ratio which is improved by increasing the doping concentration. The analog performance of the device is also investigated in the subthreshold regime of operation by varying the doping concentration. It is observed that by increasing the device doping concentration, the analog figures of merit can be improved. (paper)

  4. Investigation of Impact of the Gate Circuitry on IGBT Transistor Dynamic Parameters

    Directory of Open Access Journals (Sweden)

    Vytautas Bleizgys

    2011-03-01

    Full Text Available The impact of Insulated Gate Bipolar Transistor driver circuit parameters on the rise and fall time of the collector current and voltage collector-emitter was investigated. The influence of transistor driver circuit parameters on heating of Insulated Gate Bipolar Transistors was investigated as well.Article in Lithuanian

  5. A Scalable Mextram Model for Advanced Bipolar Circuit Design

    NARCIS (Netherlands)

    Wu, H.C.

    2007-01-01

    In this thesis, a referenced based scaling approach and its parameter extraction for the bipolar transistor model Mextram is proposed. It is mainly based on the physical properties of the Mextram parameters, which scale with the junction temperature and geometry of the bipolar transistor. The

  6. The Optimization of Spacer Engineering for Capacitor-Less DRAM Based on the Dual-Gate Tunneling Transistor.

    Science.gov (United States)

    Li, Wei; Liu, Hongxia; Wang, Shulong; Chen, Shupeng; Wang, Qianqiong

    2018-03-05

    The DRAM based on the dual-gate tunneling FET (DGTFET) has the advantages of capacitor-less structure and high retention time. In this paper, the optimization of spacer engineering for DGTFET DRAM is systematically investigated by Silvaco-Atlas tool to further improve its performance, including the reduction of reading "0" current and extension of retention time. The simulation results show that spacers at the source and drain sides should apply the low-k and high-k dielectrics, respectively, which can enhance the reading "1" current and reduce reading "0" current. Applying this optimized spacer engineering, the DGTFET DRAM obtains the optimum performance-extremely low reading "0" current (10 -14 A/μm) and large retention time (10s), which decreases its static power consumption and dynamic refresh rate. And the low reading "0" current also enhances its current ratio (10 7 ) of reading "1" to reading "0". Furthermore, the analysis about scalability reveals its inherent shortcoming, which offers the further investigation direction for DGTFET DRAM.

  7. The Optimization of Spacer Engineering for Capacitor-Less DRAM Based on the Dual-Gate Tunneling Transistor

    Science.gov (United States)

    Li, Wei; Liu, Hongxia; Wang, Shulong; Chen, Shupeng; Wang, Qianqiong

    2018-03-01

    The DRAM based on the dual-gate tunneling FET (DGTFET) has the advantages of capacitor-less structure and high retention time. In this paper, the optimization of spacer engineering for DGTFET DRAM is systematically investigated by Silvaco-Atlas tool to further improve its performance, including the reduction of reading "0" current and extension of retention time. The simulation results show that spacers at the source and drain sides should apply the low-k and high-k dielectrics, respectively, which can enhance the reading "1" current and reduce reading "0" current. Applying this optimized spacer engineering, the DGTFET DRAM obtains the optimum performance-extremely low reading "0" current (10-14A/μm) and large retention time (10s), which decreases its static power consumption and dynamic refresh rate. And the low reading "0" current also enhances its current ratio (107) of reading "1" to reading "0". Furthermore, the analysis about scalability reveals its inherent shortcoming, which offers the further investigation direction for DGTFET DRAM.

  8. Effects of HfO2/Al2O3 gate stacks on electrical performance of planar In x Ga1- x As tunneling field-effect transistors

    Science.gov (United States)

    Ahn, Dae-Hwan; Yoon, Sang-Hee; Takenaka, Mitsuru; Takagi, Shinichi

    2017-08-01

    We study the impact of gate stacks on the electrical characteristics of Zn-diffused source In x Ga1- x As tunneling field-effect transistors (TFETs) with Al2O3 or HfO2/Al2O3 gate insulators. Ta and W gate electrodes are compared in terms of the interface trap density (D it) of InGaAs MOS interfaces. It is found that D it is lower at the W/HfO2/Al2O3 InGaAs MOS interface than at the Ta/HfO2/Al2O3 interface. The In0.53Ga0.47As TFET with a W/HfO2 (2.7 nm)/Al2O3 (0.3 nm) gate stack of 1.4-nm-thick capacitance equivalent thickness (CET) has a steep minimum subthreshold swing (SS) of 57 mV/dec, which is attributed to the thin CET and low D it. Also, the In0.53Ga0.47As (2.6 nm)/In0.67Ga0.33As (3.2 nm)/In0.53Ga0.47As (96.5 nm) quantum-well (QW) TFET supplemented with this 1.4-nm-thick CET gate stack exhibits a steeper minimum SS of 54 mV/dec and a higher on-current (I on) than those of the In0.53Ga0.47As TFET.

  9. A detailed coupled-mode-space non-equilibrium Green's function simulation study of source-to-drain tunnelling in gate-all-around Si nanowire metal oxide semiconductor field effect transistors

    Science.gov (United States)

    Seoane, N.; Martinez, A.

    2013-09-01

    In this paper we present a 3D quantum transport simulation study of source-to-drain tunnelling in gate-all-around Si nanowire transistors by using the non-equilibrium Green's function approach. The impact of the channel length, device cross-section, and drain and gate applied biases on the source-to-drain tunnelling is examined in detail. The overall effect of tunnelling on the ID-VG characteristics is also investigated. Tunnelling in devices with channel lengths of 10 nm or less substantially enhances the off-current. This enhancement is more important at high drain biases and at larger cross-sections where the sub-threshold slope is substantially degraded. A less common effect is the increase in the on-current due to the tunnelling which contributes as much as 30% of the total on-current. This effect is almost independent of the cross-section, and it depends weakly on the studied channel lengths.

  10. Programmable automated transistor test system

    International Nuclear Information System (INIS)

    Truong, L.V.; Sundberg, G.R.

    1986-01-01

    The paper describes a programmable automated transistor test system (PATTS) and its utilization to evaluate bipolar transistors and Darlingtons, and such MOSFET and special types as can be accommodated with the PATTS base-drive. An application of a pulsed power technique at low duty cycles in a non-destructive test is used to examine the dynamic switching characteristic curves of power transistors. Data collection, manipulation, storage, and output are operator interactive but are guided and controlled by the system software. In addition a library of test data is established on disks, tapes, and hard copies for future reference

  11. N p n bipolar-junction-transistor detector with integrated p n p biasing transistor—feasibility study, design and first experimental results

    Science.gov (United States)

    Verzellesi, Giovanni; Bergamini, Davide; Dalla Betta, Gian-Franco; Piemonte, Claudio; Boscardin, Maurizio; Bosisio, Luciano; Bettarini, Stefano; Batignani, Giovanni

    2006-02-01

    We propose a novel n-p-n BJT radiation detector on high-resistivity silicon with integrated p-n-p transistor providing the quiescent base current of the detector. The dc operational limits of the proposed detector are analysed by means of numerical device simulations, pointing out that, by properly distancing the base of the p-n-p transistor from the emitter of the n-p-n detector, the latch-up of the parasitic thyristor embedded within the detector-plus-biasing-transistor structure takes place at relatively high current levels, where detector operation should anyway be avoided in order to prevent the associated current-gain loss. Numerical simulations provides insight about the bias dependence of charge-collection waveforms, indicating that minimization of the collecting time requires the detector quiescent current to be adjusted at the highest value still allowing high-injection effects to be avoided. A small-signal equivalent circuit of the proposed structure is also derived, allowing the impact of p-n-p biasing transistor and load resistance on the charge-collecting time constant to be evaluated. First experimental results show that fabricated structures are immune from the latch-up of the parasitic thyristor throughout their high-current-gain operating region and feature a minimum charge-collecting time constant of 35 µs, as tested by pulsed laser illumination.

  12. Quantum Thermal Transistor.

    Science.gov (United States)

    Joulain, Karl; Drevillon, Jérémie; Ezzahri, Younès; Ordonez-Miranda, Jose

    2016-05-20

    We demonstrate that a thermal transistor can be made up with a quantum system of three interacting subsystems, coupled to a thermal reservoir each. This thermal transistor is analogous to an electronic bipolar one with the ability to control the thermal currents at the collector and at the emitter with the imposed thermal current at the base. This is achieved by determining the heat fluxes by means of the strong-coupling formalism. For the case of three interacting spins, in which one of them is coupled to the other two, that are not directly coupled, it is shown that high amplification can be obtained in a wide range of energy parameters and temperatures. The proposed quantum transistor could, in principle, be used to develop devices such as a thermal modulator and a thermal amplifier in nanosystems.

  13. 2D Vertical Heterostructures for Novel Tunneling Device Applications

    Science.gov (United States)

    2017-03-01

    tunneling has been explored for the symmetric field - effect transistor (symFET) [1, 2], while opposite-band tunneling has been explored for...the interlayer tunnel field - effect transistor (ITFET) [3, 4] and the Esaki diode [5]. Figure 1. (a) Schematic of the heterostructure, with the... Tunneling Field Effect Transistor ," Journal of Applied Physics, vol. 115, p. 074508, 2014. [4] M. O. Li, D. Esseni, J. J. Nahas, D.

  14. Effects of impurity and composition profiles on electrical characteristics of GaAsSb/InGaAs hetero-junction vertical tunnel field effect transistors

    Science.gov (United States)

    Gotow, Takahiro; Mitsuhara, Manabu; Hoshi, Takuya; Sugiyama, Hiroki; Takenaka, Mitsuru; Takagi, Shinichi

    2017-11-01

    We fabricated and characterized GaAs0.51Sb0.49/In0.53Ga0.47As hetero-junction vertical tunnel field effect transistors (TFETs) on InP substrates in order to examine the effects of the structural characteristics of GaAsSb/InGaAs hetero-structures on the electrical properties of the TFETs. The operation of the fabricated GaAs0.51Sb0.49/In0.53Ga0.47As TFET was confirmed with the ION/IOFF ratio of ˜102 over VG swing of 1.25 V at 297 K. This ION/IOFF ratio was improved up to ˜104 at 20 K, thanks to the suppression of the leakage current in the source junction. The secondary ion mass spectrometry analyses for the present hetero-structures have revealed that the concentration of the p-type dopant (Be) atoms, doped in the GaAsSb source regions, decreases in the InGaAs channel regions at an inverse slope of ˜11 nm/dec. Also, the scanning transmission electron microscope-energy dispersive X-ray spectroscopy has shown that group III and V compositions change abruptly in a region within 10 nm from the interface between the Be-doped GaAsSb source and the undoped InGaAs channel. We performed the 2-dimensional device simulation based on the device structure and the experimentally obtained composition and impurity profiles, and we found that the composition profile had little effect on the S.S. values. The device simulation also revealed that both the optimization of the concentration and the profile of the p-type doping of GaAsSb, and thinning of the effective oxide thickness (EOT) of the gate stacks could effectively improve the inherent S.S. values of the present GaAs0.51Sb0.49/In0.53Ga0.47As hetero-junction vertical TFETs. When 1.0 nm EOT and NA = 1 × 1020 cm-3 are used under the present impurity abruptness, S.S. < 40 mV/dec. can be achieved for the vertical GaAsSb/InGaAs TFETs, which is promising for an ultralow power switching device.

  15. Junctionless Cooper pair transistor

    Energy Technology Data Exchange (ETDEWEB)

    Arutyunov, K. Yu., E-mail: konstantin.yu.arutyunov@jyu.fi [National Research University Higher School of Economics , Moscow Institute of Electronics and Mathematics, 101000 Moscow (Russian Federation); P.L. Kapitza Institute for Physical Problems RAS , Moscow 119334 (Russian Federation); Lehtinen, J.S. [VTT Technical Research Centre of Finland Ltd., Centre for Metrology MIKES, P.O. Box 1000, FI-02044 VTT (Finland)

    2017-02-15

    Highlights: • Junctionless Cooper pair box. • Quantum phase slips. • Coulomb blockade and gate modulation of the Coulomb gap. - Abstract: Quantum phase slip (QPS) is the topological singularity of the complex order parameter of a quasi-one-dimensional superconductor: momentary zeroing of the modulus and simultaneous 'slip' of the phase by ±2π. The QPS event(s) are the dynamic equivalent of tunneling through a conventional Josephson junction containing static in space and time weak link(s). Here we demonstrate the operation of a superconducting single electron transistor (Cooper pair transistor) without any tunnel junctions. Instead a pair of thin superconducting titanium wires in QPS regime was used. The current–voltage characteristics demonstrate the clear Coulomb blockade with magnitude of the Coulomb gap modulated by the gate potential. The Coulomb blockade disappears above the critical temperature, and at low temperatures can be suppressed by strong magnetic field.

  16. Composition and doping control for metal-organic chemical vapor deposition of InP-based double heterojunction bipolar transistor with hybrid base structure consisting of GaAsSb contact and InGaAsSb graded layers

    Science.gov (United States)

    Hoshi, Takuya; Kashio, Norihide; Sugiyama, Hiroki; Yokoyama, Haruki; Kurishima, Kenji; Ida, Minoru; Matsuzaki, Hideaki

    2017-07-01

    We report on a method for composition and doping control for metalorganic chemical vapor deposition of a double heterojunction bipolar transistor (DHBT) with a hybrid base structure consisting of a compositionally graded InGaAsSb for boosting an average electron velocity and a heavily doped thin GaAsSb for lowering the base contact resistivity. The GaAsSb contact layer can be formed by simply turning off the supply of In precursor tetramethylindium (TMIn) after the growth of the composition and doping graded InGaAsSb base. Consequently, the solid composition and hole concentration of hybrid base can be properly controlled by just modulating the supply of only TMIn and carbon tetrabromide. Secondary ion mass spectroscopy for the DHBT wafer reveals that the contents of In, Ga, and C inside the base are actually modulated from the collector side to the emitter side as expected. Transmission-line-model measurements were performed for the compositionally graded-InGaAsSb/GaAsSb hybrid base. The contact resistivity is estimated to be 5.3 Ω µm2, which is lower than half the value of a compositionally graded InGaAsSb base without the GaAsSb contact layer. The results indicate that the compositionally-graded-InGaAsSb/GaAsSb-contact hybrid base structure grown by this simple method is very advantageous for obtaining DHBTs with a very high maximum oscillation frequency.

  17. The Smallest Transistor-Based Nonautonomous Chaotic Circuit

    DEFF Research Database (Denmark)

    Lindberg, Erik; Murali, K.; Tamasevicius, Arunas

    2005-01-01

    A nonautonomous chaotic circuit based on one transistor, two capacitors, and two resistors is described. The mechanism behind the chaotic performance is based on “disturbance of integration.” The forward part and the reverse part of the bipolar transistor are “fighting” about the charging...

  18. On the 50th Anniversary of the Transistor

    DEFF Research Database (Denmark)

    Stassen, Flemming

    1997-01-01

    This paper celebrates the 50th anniversary of the invention of the bipolar transistor in 1947. Combined with the inventions of integration and planar technology, the invention of the transistor marks the beginning of a period of unprecedented growth, the industrialization of electronics....

  19. Application of the Johnson criteria to graphene transistors

    International Nuclear Information System (INIS)

    Kelly, M J

    2013-01-01

    For 60 years, the Johnson criteria have guided the development of materials and the materials choices for field-effect and bipolar transistor technology. Intrinsic graphene is a semi-metal, precluding transistor applications, but only under lateral bias is a gap opened and transistor action possible. This first application of the Johnson criteria to biased graphene suggests that this material will struggle to ever achieve competitive commercial applications. (fast track communication)

  20. Study of fully-depleted Ge double-gate n-type Tunneling Field-Effect Transistors for improvement in on-state current and sub-threshold swing

    Science.gov (United States)

    Liu, Xiangyu; Hu, Huiyong; Wang, Meng; Zhang, Heming; Cui, Shimin; Shu, Bin; Wang, Bin

    2018-01-01

    In this paper, a fully-depleted (FD) Ge double-gate (DG) n-type Tunneling Field-Effect Transistors (TFET) structure is studied in detail by two-dimensional numerical simulation. The simulation results indicated that the on-state current Ion and on-off ratio of the FD Ge DG-TFET increases about 1 order of magnitude comparing with the Conventional Ge DG-TFET, and Ion=3.95×10-5 A/μm and the below 60 mV/decade subthreshold swing S=26.4 mV/decade are achieved with the length of gate LD=20 nm, the workfuntion of metal gate Φm=0.2 eV and the doping concentration of n+-type-channel ND=1×1018 cm-3. Moreover, the impacts of Φm, ND and LD are investigated. The simulation results indicated that the off-state current Ioff includes the tunneling current at the middle of channel IB the gated-induced drain leakage (GIDL) current IGIDL. With optimized Φm and ND, Ioff is reduced about 2 orders of magnitude to 2.5×10-13 A/μm with LD increasing from 40 nm to 100 nm, and on-off ratio is increased to 1.58×107.

  1. Unijunction transistors

    International Nuclear Information System (INIS)

    1981-01-01

    The electrical characteristics of unijunction transistors can be modified by irradiation with electron beams in excess of 400 KeV and at a dose rate of 10 13 to 10 16 e/cm 2 . Examples are given of the effect of exposing the emitter-base junctions of transistors to such lattice defect causing radiation for a time sufficient to change the valley current of the transistor. (U.K.)

  2. Characterization of ionizing radiation effects in MOS structures by study of bipolar operation

    International Nuclear Information System (INIS)

    Bakhtiar, H.; Picard, C.; Brisset, C.; Bakhtiar, H.; Hoffmann, A.; Charles, J.P.

    1999-01-01

    This work presents an original method to characterize radiation effects of micronic transistors. The characterization includes a study of the transistor substrate-drain junction and current gain variation of the bipolar transistor (drain-substrate-source as emitter-base-collector) for different gate voltages. (authors)

  3. Magnetic Vortex Based Transistor Operations

    Science.gov (United States)

    Kumar, D.; Barman, S.; Barman, A.

    2014-01-01

    Transistors constitute the backbone of modern day electronics. Since their advent, researchers have been seeking ways to make smaller and more efficient transistors. Here, we demonstrate a sustained amplification of magnetic vortex core gyration in coupled two and three vortices by controlling their relative core polarities. This amplification is mediated by a cascade of antivortex solitons travelling through the dynamic stray field. We further demonstrated that the amplification can be controlled by switching the polarity of the middle vortex in a three vortex sequence and the gain can be controlled by the input signal amplitude. An attempt to show fan–out operation yielded gain for one of the symmetrically placed branches which can be reversed by switching the core polarity of all the vortices in the network. The above observations promote the magnetic vortices as suitable candidates to work as stable bipolar junction transistors (BJT). PMID:24531235

  4. Magnetic Vortex Based Transistor Operations

    Science.gov (United States)

    Kumar, D.; Barman, S.; Barman, A.

    2014-02-01

    Transistors constitute the backbone of modern day electronics. Since their advent, researchers have been seeking ways to make smaller and more efficient transistors. Here, we demonstrate a sustained amplification of magnetic vortex core gyration in coupled two and three vortices by controlling their relative core polarities. This amplification is mediated by a cascade of antivortex solitons travelling through the dynamic stray field. We further demonstrated that the amplification can be controlled by switching the polarity of the middle vortex in a three vortex sequence and the gain can be controlled by the input signal amplitude. An attempt to show fan-out operation yielded gain for one of the symmetrically placed branches which can be reversed by switching the core polarity of all the vortices in the network. The above observations promote the magnetic vortices as suitable candidates to work as stable bipolar junction transistors (BJT).

  5. Two-dimensional analytical model for hetero-junction double-gate tunnel field-effect transistor with a stacked gate-oxide structure

    Science.gov (United States)

    Xu, Hui Fang; Gui Guan, Bang

    2017-05-01

    A two-dimensional analytical model for hetero-junction double-gate tunnel FETs (DG TFETs) with a stacked gate-oxide structure is proposed in this paper. The effects of both the channel mobile charges and source/drain depletion regions on the channel potential profile are considered for the higher accuracy of the proposed model. Poisson’s equation is solved using the superposition principle and Fourier series solution to model the channel potential. The band-to-band tunneling generation rate is expressed as a function of the channel electric field derived from the channel potential and then integrated analytically to derive the drain current of the hetero-junction DG TFETs with a stacked gate-oxide structure using the shortest tunneling path. The effects of device parameters on the channel potential, drain current, and transconductance are investigated. Very good agreements are observed between the model calculations and the simulated results.

  6. Bipolar Disorder

    Science.gov (United States)

    Bipolar disorder is a serious mental illness. People who have it go through unusual mood changes. They go ... The down feeling is depression. The causes of bipolar disorder aren't always clear. It runs in families. ...

  7. Specifics of Pulsed Arc Welding Power Supply Performance Based On A Transistor Switch

    OpenAIRE

    Krampit, Nataliya Yurievna; Kust, Tatiana Sergeevna; Krampit, Maksim Andreevich

    2016-01-01

    Specifics of designing a pulsed arc welding power supply device are presented in the paper. Electronic components for managing large current was analyzed. Strengths and shortcomings of power supply circuits based on thyristor, bipolar transistor and MOSFET are outlined. As a base unit for pulsed arc welding was chosen MOSFET transistor, which is easy to manage. Measures to protect a transistor are given. As for the transistor control device is a microcontroller Arduino which has a low cost an...

  8. Modelling and characterisation of transistors | Akande | Global ...

    African Journals Online (AJOL)

    Models and characterisation of active devices that control the flow of energy operating within and outside the active region of the operating domain are presented. Specifically, the incremental charge carrier and Ebers Moll models of the bipolar junction transistor are presented and the parameters of electrical behaviour of ...

  9. A transistor based on 2D material and silicon junction

    Science.gov (United States)

    Kim, Sanghoek; Lee, Seunghyun

    2017-07-01

    A new type of graphene-silicon junction transistor based on bipolar charge-carrier injection was designed and investigated. In contrast to many recent studies on graphene field-effect transistor (FET), this device is a new type of bipolar junction transistor (BJT). The transistor fully utilizes the Fermi level tunability of graphene under bias to increase the minority-carrier injection efficiency of the base-emitter junction in the BJT. Single-layer graphene was used to form the emitter and the collector, and a p-type silicon was used as the base. The output of this transistor was compared with a metal-silicon junction transistor ( i.e. surface-barrier transistor) to understand the difference between a graphene-silicon junction and metal-silicon Schottky junction. A significantly higher current gain was observed in the graphene-silicon junction transistor as the base current was increased. The graphene-semiconductor heterojunction transistor offers several unique advantages, such as an extremely thin device profile, a low-temperature (transistor current gain ( β) of 33.7 and a common-emitter amplifier voltage gain of 24.9 were achieved.

  10. The Complete Semiconductor Transistor and Its Incomplete Forms

    Science.gov (United States)

    Binbin, Jie; Chih-Tang, Sah

    2009-06-01

    This paper describes the definition of the complete transistor. For semiconductor devices, the complete transistor is always bipolar, namely, its electrical characteristics contain both electron and hole currents controlled by their spatial charge distributions. Partially complete or incomplete transistors, via coined names or/and designed physical geometries, included the 1949 Shockley p/n junction transistor (later called Bipolar Junction Transistor, BJT), the 1952 Shockley unipolar 'field-effect' transistor (FET, later called the p/n Junction Gate FET or JGFET), as well as the field-effect transistors introduced by later investigators. Similarities between the surface-channel MOS-gate FET (MOSFET) and the volume-channel BJT are illustrated. The bipolar currents, identified by us in a recent nanometer FET with 2-MOS-gates on thin and nearly pure silicon base, led us to the recognition of the physical makeup and electrical current and charge compositions of a complete transistor and its extension to other three or more terminal signal processing devices, and also the importance of the terminal contacts.

  11. Junctionless nanowire TFET with built-in N-P-N bipolar action: Physics and operational principle

    Science.gov (United States)

    Rahimian, Morteza; Fathipour, Morteza

    2016-12-01

    In this paper, we present a novel junctionless nanowire tunneling FET (JN-TFET) in which the source region is divided into an n+ as well as a p+ type region. We will show that this structure can provide a built-in n-p-n bipolar junction transistor (BJT) action in the on state of the device. In this regime, tunneling of electrons from the source valence band into the channel conduction band enhances the hole concentration in the p+ source region. Also, the potential in this region is increased, which drives a built-in BJT transistor by forward biasing the base-emitter junction. Thus, the BJT current adds up to the normal tunneling current in the JN-TFET. Owing to the sharp switching of the JN-TFET and the high BJT current gain, the overall performance of the device, herein called "BJN-TFET," is improved. On-state currents as high as 2.17 × 10-6 A/μm and subthreshold swings as low as ˜50 mV/dec at VDS = 1 V are achieved.

  12. Effect of graded InGaN drain region and 'In' fraction in InGaN channel on performances of InGaN tunnel field-effect transistor

    Science.gov (United States)

    Duan, Xiaoling; Zhang, Jincheng; Wang, Shulong; Quan, Rudai; Hao, Yue

    2017-12-01

    An InGaN-based graded drain region tunnel field-effect transistor (GD-TFET) is proposed to suppress the ambipolar behavior. The simulation results with the trade-off between on-state current (Ion) and ambipolar current (Iambipolar) show decreased Iambipolar (1.9 × 10-14 A/μm) in comparison with that of conventional TFETs (2.0 × 10-8 A/μm). Furthermore, GD-TFET with high 'In' fraction InxGa1-xN source-side channel (SC- GD-TFET) is explored and exhibits 5.3 times Ion improvement and 60% average subthreshold swing (SSavg) reduction in comparison with GD-TFET by adjusting 'In' fraction in the InxGa1-xN source-side channel. The improvement is attributed to the confinement of BTBT in the source-side channel by the heterojunction. And then, the optimum value for source-side channel length (Lsc) is researched by DC performances results, which shows it falls into the range between Lsc = 10 nm and 20 nm.

  13. Long-term reliable physically unclonable function based on oxide tunnel barrier breakdown on two-transistors two-magnetic-tunnel-junctions cell-based embedded spin transfer torque magnetoresistive random access memory

    Science.gov (United States)

    Takaya, Satoshi; Tanamoto, Tetsufumi; Noguchi, Hiroki; Ikegami, Kazutaka; Abe, Keiko; Fujita, Shinobu

    2017-04-01

    Among the diverse applications of spintronics, security for internet-of-things (IoT) devices is one of the most important. A physically unclonable function (PUF) with a spin device (spin transfer torque magnetoresistive random access memory, STT-MRAM) is presented. Oxide tunnel barrier breakdown is used to realize long-term stability for PUFs. A secure PUF has been confirmed by evaluating the Hamming distance of a 32-bit STT-MRAM-PUF fabricated using 65 nm CMOS technology.

  14. Resonant tunneling of electrons in quantum wires

    International Nuclear Information System (INIS)

    Krive, I.V.; Shekhter, R.I.; Jonson, M.; Krive, I.V.

    2010-01-01

    We considered resonant electron tunneling in various nanostructures including single wall carbon nanotubes, molecular transistors and quantum wires formed in two-dimensional electron gas. The review starts with a textbook description of resonant tunneling of noninteracting electrons through a double-barrier structure. The effects of electron-electron interaction in sequential and resonant electron tunneling are studied by using Luttinger liquid model of electron transport in quantum wires. The experimental aspects of the problem (fabrication of quantum wires and transport measurements) are also considered. The influence of vibrational and electromechanical effects on resonant electron tunneling in molecular transistors is discussed.

  15. Transistor effects and in situ STM of redox molecules at room temperature

    DEFF Research Database (Denmark)

    Albrecht, Tim; Guckian, A; Vos, JG

    2005-01-01

    Inorganic transition metal complexes were identified as potential candidates for transistor-like behavior in an electrochemical scanning tunnelling microscope (STM) configuration at room temperature. The theoretical background has been established based on condensed matter charge transfer theory...... resolution reveal detailed information on their surface structure and scanning tunnelling spectroscopy experiments have shown clear evidence of transistor-like behavior...

  16. Constructing Diodes and Transistors for Ultracold Atoms

    Science.gov (United States)

    Pepino, Ronald; Cooper, John; Anderson, Dana; Holland, Murray

    2008-05-01

    The ultracold atom-optical analogy to electronic systems is presented, along with the master equation formalism that is applied to this novel physical context of system-reservoir interactions. The proposed formalism lends itself quite readily to not only the study of atomtronic systems, but also transport properties of ultracold atoms in optical lattices. We demonstrate how these systems can be configured so that they emulate the behavior of the electronic diode, field effect transistor (FET), and bipolar junction transistor (BJT). The behavior of simple logic gates: namely, the AND and OR gates are follow as direct consequences of the atomtronic BJTs.

  17. Modelling ionising radiation induced defect generation in bipolar oxides with gated diodes

    International Nuclear Information System (INIS)

    Barnaby, H.J.; Cirba, C.; Schrimpf, R.D.; Kosier, St.; Fouillat, P.; Montagner, X.

    1999-01-01

    Radiation-induced oxide defects that degrade electrical characteristics of bipolar junction transistor (BJTs) can be measured with the use of gated diodes. The buildup of defects and their effect on device radiation response are modeled with computer simulation. (authors)

  18. Simulation of a Novel Bipolar-FET Type-S, Negative Resistance Circuit

    Directory of Open Access Journals (Sweden)

    Umesh Kumar

    2003-01-01

    Full Text Available A new circuit which uses FET and bipolar transistor is given. It exhibits Type-S differential negative resistance and a theoretical explanation is appended along with PSPICE simulation.

  19. Fast turn-on of an NMOS ESD protection transistor: measurements and simulations

    NARCIS (Netherlands)

    Luchies, J.R.M.; Luchies, J.R.M.; de Kort, C.G.M.; Verweij, J.F.; Verweij, J.F.

    1995-01-01

    The transient turn-on of the parasitic bipolar transistor of an NMOS transistor was studied. The voltages appearing at internal nodes of protection and functional circuit after application of 350 ps rise-time pulses have been measured using electro-optic sampling. For very fast transients the

  20. Formation of MOS-transistors with isolation of active elements by oxiden porous silicon

    Directory of Open Access Journals (Sweden)

    Novosyadlyi S. P.

    2009-06-01

    Full Text Available The superthin functional layers of MOS-transistors require qualitative isolation of active elements. The new method of formation of epitaksial structures for technology «silicon - on-isolator» is offered on the basis of porous silicon. It will allow to form three kinds of transistorsbipolar, SМОS, DМОS.

  1. Bipolar disorder

    Science.gov (United States)

    ... of pleasure in activities once enjoyed Loss of self-esteem Thoughts of death or suicide Trouble getting to ... other. This is called rapid cycling. Exams and Tests To diagnose bipolar disorder, the provider may do ...

  2. Bipolar disorder

    Directory of Open Access Journals (Sweden)

    F Colin

    2013-08-01

    Full Text Available Bipolar disorder (BD presents in different phases over time and is oftencomplicated by comorbid conditions such as substance-use disordersand anxiety disorders. Treatment usually involves pharmacotherapywith combinations of different classes of medications and frequentmedication revisions.

  3. Giant electron-hole transport asymmetry in ultra-short quantum transistors

    Science.gov (United States)

    McRae, A. C.; Tayari, V.; Porter, J. M.; Champagne, A. R.

    2017-05-01

    Making use of bipolar transport in single-wall carbon nanotube quantum transistors would permit a single device to operate as both a quantum dot and a ballistic conductor or as two quantum dots with different charging energies. Here we report ultra-clean 10 to 100 nm scale suspended nanotube transistors with a large electron-hole transport asymmetry. The devices consist of naked nanotube channels contacted with sections of tube under annealed gold. The annealed gold acts as an n-doping top gate, allowing coherent quantum transport, and can create nanometre-sharp barriers. These tunnel barriers define a single quantum dot whose charging energies to add an electron or a hole are vastly different (e-h charging energy asymmetry). We parameterize the e-h transport asymmetry by the ratio of the hole and electron charging energies ηe-h. This asymmetry is maximized for short channels and small band gap tubes. In a small band gap device, we demonstrate the fabrication of a dual functionality quantum device acting as a quantum dot for holes and a much longer quantum bus for electrons. In a 14 nm-long channel, ηe-h reaches up to 2.6 for a device with a band gap of 270 meV. The charging energies in this device exceed 100 meV.

  4. Single Electron Tunneling

    International Nuclear Information System (INIS)

    Ruggiero, Steven T.

    2005-01-01

    Financial support for this project has led to advances in the science of single-electron phenomena. Our group reported the first observation of the so-called ''Coulomb Staircase'', which was produced by tunneling into ultra-small metal particles. This work showed well-defined tunneling voltage steps of width e/C and height e/RC, demonstrating tunneling quantized on the single-electron level. This work was published in a now well-cited Physical Review Letter. Single-electron physics is now a major sub-field of condensed-matter physics, and fundamental work in the area continues to be conducted by tunneling in ultra-small metal particles. In addition, there are now single-electron transistors that add a controlling gate to modulate the charge on ultra-small photolithographically defined capacitive elements. Single-electron transistors are now at the heart of at least one experimental quantum-computer element, and single-electron transistor pumps may soon be used to define fundamental quantities such as the farad (capacitance) and the ampere (current). Novel computer technology based on single-electron quantum dots is also being developed. In related work, our group played the leading role in the explanation of experimental results observed during the initial phases of tunneling experiments with the high-temperature superconductors. When so-called ''multiple-gap'' tunneling was reported, the phenomenon was correctly identified by our group as single-electron tunneling in small grains in the material. The main focus throughout this project has been to explore single electron phenomena both in traditional tunneling formats of the type metal/insulator/particles/insulator/metal and using scanning tunneling microscopy to probe few-particle systems. This has been done under varying conditions of temperature, applied magnetic field, and with different materials systems. These have included metals, semi-metals, and superconductors. Amongst a number of results, we have

  5. Transistor Small Signal Analysis under Radiation Effects

    International Nuclear Information System (INIS)

    Sharshar, K.A.A.

    2004-01-01

    A Small signal transistor parameters dedicate the operation of bipolar transistor before and after exposed to gamma radiation (1 Mrad up to 5 Mrads) and electron beam(1 MeV, 25 mA) with the same doses as a radiation sources, the electrical parameters of the device are changed. The circuit Model has been discussed.Parameters, such as internal emitter resistance (re), internal base resistance, internal collector resistance (re), emitter base photocurrent (Ippe) and base collector photocurrent (Ippe). These parameters affect on the operation of the device in its applications, which work as an effective element, such as current gain (hFE≡β)degradation it's and effective parameter in the device operation. Also the leakage currents (IcBO) and (IEBO) are most important parameters, Which increased with radiation doses. Theoretical representation of the change in the equivalent circuit for NPN and PNP bipolar transistor were discussed, the input and output parameters of the two types were discussed due to the change in small signal input resistance of the two types. The emitter resistance(re) were changed by the effect of gamma and electron beam irradiation, which makes a change in the role of matching impedances between transistor stages. Also the transistor stability factors S(Ico), S(VBE) and S(β are detected to indicate the transistor operations after exposed to radiation fields. In low doses the gain stability is modified due to recombination of induced charge generated during device fabrication. Also the load resistance values are connected to compensate the effect

  6. Probing momentum distributions in magnetic tunnel junctions via hot-electron decay

    NARCIS (Netherlands)

    Jansen, R.; Banerjee, T.; Park, B.G.; Lodder, J.C.

    2007-01-01

    The tunnel momentum distribution in a (magnetic) tunnel junction is probed by analyzing the decay of the hot electrons in the Co metal anode after tunneling, using a three-terminal transistor structure in which the hot-electron attenuation is sensitive to the tunnel momentum distribution. Solid

  7. High current transistor pulse generator

    Science.gov (United States)

    Nesterov, V.; Cassel, R.

    1991-05-01

    A solid state pulse generator capable of delivering high current trapezoidally shaped pulses into an inductive load has been developed at SLAC. Energy stored in the capacitor bank of the pulse generator is switched to the load through a pair of Darlington transistors. A combination of diodes and Darlington transistors is used to obtain trapezoidal or triangular shaped current pulses into an inductive load and to recover the remaining energy in the same capacitor bank without reversing capacitor voltage. The transistors work in the switch mode, and the power losses are low. The rack mounted pulse generators presently used at SLAC contain a 660 microfarad storage capacitor bank and can deliver 400 amps at 800 volts into inductive loads up to 3 mH. The pulse generators are used in several different power systems, including pulse to pulse bipolar power supplies and in application with current pulses distributed into different inductive loads. The current amplitude and discharge time are controlled by the central computer system through a specially developed multichannel controller. Several years of operation with the pulse generators have proven their consistent performance and reliability.

  8. High current transistor pulse generator

    International Nuclear Information System (INIS)

    Nesterov, V.; Cassel, R.

    1991-05-01

    A solid state pulse generator capable of delivering high current trapezoidally shaped pulses into an inductive load has been developed at SLAC. Energy stored in the capacitor bank of the pulse generator is switched to the load through a pair of Darlington transistors. A combination of diodes and Darlington transistors is used to obtain trapezoidal or triangular shaped current pulses into an inductive load and to recover the remaining energy in the same capacitor bank without reversing capacitor voltage. The transistors work in the switch mode, and the power losses are low. The rack mounted pulse generators presently used at SLAC contain a 660 microfarad storage capacitor bank and can deliver 400 amps at 800 volts into inductive loads up to 3 mH. The pulse generators are used in several different power systems, including pulse to pulse bipolar power supplies and in application with current pulses distributed into different inductive loads. The current amplitude and discharge time are controlled by the central computer system through a specially developed multichannel controller. Several years of operation with the pulse generators have proven their consistent performance and reliability. 8 figs

  9. Test Equipment Specifications Transistor

    OpenAIRE

    Didiek Andiana Ramadan; Drs. Linga Hermanto, MMSI Drs. Linga Hermanto, MMSI

    2005-01-01

    In this paper, we design a test apparatus Transistor Specification. Specification is atype of transistor is a transistor and common emitter current reinforcement value ( βDC ). The system will provide information in the form of an LED display emits greenlight when the tested types of NPN transistor and the second LED emits blue lightwhen the tested types of PNP transistors.To test the value of β, whose value is proportional to the display used by the collectorcurrent Ic.

  10. Topical Workshop on Heterostructure Microelectronics for Information Systems Applications (TWHM-ISA '98) Held in Shonan Village Center, Hayama-machi, Kanagawa, Japan on August 30-September 2, 1998

    National Research Council Canada - National Science Library

    Ishibashi, T

    1998-01-01

    .... The technologies employed are based on heterostructure bipolar transistors, heterostructure field effect transistors and resonant tunneling diodes, and make use of a variety of heterostructure...

  11. High Accuracy Transistor Compact Model Calibrations

    Energy Technology Data Exchange (ETDEWEB)

    Hembree, Charles E. [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States); Mar, Alan [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States); Robertson, Perry J. [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)

    2015-09-01

    Typically, transistors are modeled by the application of calibrated nominal and range models. These models consists of differing parameter values that describe the location and the upper and lower limits of a distribution of some transistor characteristic such as current capacity. Correspond- ingly, when using this approach, high degrees of accuracy of the transistor models are not expected since the set of models is a surrogate for a statistical description of the devices. The use of these types of models describes expected performances considering the extremes of process or transistor deviations. In contrast, circuits that have very stringent accuracy requirements require modeling techniques with higher accuracy. Since these accurate models have low error in transistor descriptions, these models can be used to describe part to part variations as well as an accurate description of a single circuit instance. Thus, models that meet these stipulations also enable the calculation of quantifi- cation of margins with respect to a functional threshold and uncertainties in these margins. Given this need, new model high accuracy calibration techniques for bipolar junction transis- tors have been developed and are described in this report.

  12. Generation of short electrical pulses based on bipolar transistorsny

    Directory of Open Access Journals (Sweden)

    M. Gerding

    2004-01-01

    Full Text Available A system for the generation of short electrical pulses based on the minority carrier charge storage and the step recovery effect of bipolar transistors is presented. Electrical pulses of about 90 ps up to 800 ps duration are generated with a maximum amplitude of approximately 7V at 50Ω. The bipolar transistor is driven into saturation and the base-collector and base-emitter junctions become forward biased. The resulting fast switch-off edge of the transistor’s output signal is the basis for the pulse generation. The fast switching of the transistor occurs as a result of the minority carriers that have been injected and stored across the base-collector junction under forward bias conditions. If the saturated transistor is suddenly reverse biased the pn-junction will appear as a low impedance until the stored charge is depleted. Then the impedance will suddenly increase to its normal high value and the flow of current through the junction will turn to zero, abruptly. A differentiation of the output signal of the transistor results in two short pulses with opposite polarities. The differentiating circuit is implemented by a transmission line network, which mainly acts as a high pass filter. Both the transistor technology (pnp or npn and the phase of the transfer function of the differentating circuit influence the polarity of the output pulses. The pulse duration depends on the transistor parameters as well as on the transfer function of the pulse shaping network. This way of generating short electrical pulses is a new alternative for conventional comb generators based on steprecovery diodes (SRD. Due to the three-terminal structure of the transistor the isolation problem between the input and the output signal of the transistor network is drastically simplified. Furthermore the transistor is an active element in contrast to a SRD, so that its current gain can be used to minimize the power of the driving signal.

  13. Bipolar Disorder (For Teens)

    Science.gov (United States)

    ... Staying Safe Videos for Educators Search English Español Bipolar Disorder KidsHealth / For Teens / Bipolar Disorder What's in this ... Disorder Print en español Trastorno bipolar What Is Bipolar Disorder? Bipolar disorders are one of several medical conditions ...

  14. Neutrality in bipolar structures

    DEFF Research Database (Denmark)

    Montero, Javier; Rodríguez, J. Tinguaro; Franco, Camilo

    2014-01-01

    In this paper, we want to stress that bipolar knowledge representation naturally allows a family of middle states which define as a consequence different kinds of bipolar structures. These bipolar structures are deeply related to the three types of bipolarity introduced by Dubois and Prade, but our...... approach offers a systematic explanation of how such bipolar structures appear and can be identified....

  15. Single-dopant resonance in a single-electron transistor

    OpenAIRE

    Golovach, V. N.; Jehl, X.; Houzet, M.; Pierre, M.; Roche, B.; Sanquer, M.; Glazman, L. I.

    2011-01-01

    Single dopants in semiconductor nanostructures have been studied in great details recently as they are good candidates for quantum bits, provided they are coupled to a detector. Here we report coupling of a single As donor atom to a single-electron transistor (SET) in a silicon nanowire field-effect transistor. Both capacitive and tunnel coupling are achieved, the latter resulting in a dramatic increase of the conductance through the SET, by up to one order of magnitude. The experimental resu...

  16. Radiation tolerance of NPN bipolar technology with 30 GHz Ft

    International Nuclear Information System (INIS)

    Flament, O.; Synold, S.; Pontcharra, J. de; Niel, S.

    1999-01-01

    The ionizing dose and neutron radiation tolerance of Si QSA bipolar technology has been investigated. The transistors exhibit good radiation tolerance up to 100 krad and 5 10 13 n/cm 2 without any special fabrication steps to harden the technology to the studied effects. (authors)

  17. Quantum Transport in Ultra-scaled Junctionless Transistors

    Science.gov (United States)

    Kim, Sunggeun; Luisier, Mathieu; Klimeck, Gerhard

    2012-02-01

    As the dimensions of metal-oxide-semiconductor field-effect transistors have been scaled down to a few nano-meters, short channel effects have started to significantly degrade their performance. The junctionless transistor is an alternative device structure which is expected to reduce short channel effects. However, an extreme device scaling raises another issue, namely, source-to-drain tunneling. Junctionless transistors contain several doping atoms in the channel which can enhance tunneling processes and cause electrons to scatter with them. Through self-consistent quantum transport simulations based on the tight-binding model with elelctron-phonon scattering included, it is found that junctionless nanowire transistors with a gate length of 5 nm do not outperform conventional inversion-mode transistors with the same dimension in terms of their on-state characteristics, mainly due to impurity scattering in the channel. The advantage of the junctionless transistor in the the subthreshold region vanishes due to large tunneling currents through doping impurities.

  18. Vertical Transistors Based on 2D Materials: Status and Prospects

    Directory of Open Access Journals (Sweden)

    Filippo Giannazzo

    2018-01-01

    Full Text Available Two-dimensional (2D materials, such as graphene (Gr, transition metal dichalcogenides (TMDs and hexagonal boron nitride (h-BN, offer interesting opportunities for the implementation of vertical transistors for digital and high-frequency electronics. This paper reviews recent developments in this field, presenting the main vertical device architectures based on 2D/2D or 2D/3D material heterostructures proposed so far. For each of them, the working principles and the targeted application field are discussed. In particular, tunneling field effect transistors (TFETs for beyond-CMOS low power digital applications are presented, including resonant tunneling transistors based on Gr/h-BN/Gr stacks and band-to-band tunneling transistors based on heterojunctions of different semiconductor layered materials. Furthermore, recent experimental work on the implementation of the hot electron transistor (HET with the Gr base is reviewed, due to the predicted potential of this device for ultra-high frequency operation in the THz range. Finally, the material sciences issues and the open challenges for the realization of 2D material-based vertical transistors at a large scale for future industrial applications are discussed.

  19. Fundamentals of nanoscaled field effect transistors

    CERN Document Server

    Chaudhry, Amit

    2013-01-01

    Fundamentals of Nanoscaled Field Effect Transistors gives comprehensive coverage of the fundamental physical principles and theory behind nanoscale transistors. The specific issues that arise for nanoscale MOSFETs, such as quantum mechanical tunneling and inversion layer quantization, are fully explored. The solutions to these issues, such as high-κ technology, strained-Si technology, alternate devices structures and graphene technology are also given. Some case studies regarding the above issues and solution are also given in the book. In summary, this book: Covers the fundamental principles behind nanoelectronics/microelectronics Includes chapters devoted to solutions tackling the quantum mechanical effects occurring at nanoscale Provides some case studies to understand the issue mathematically Fundamentals of Nanoscaled Field Effect Transistors is an ideal book for researchers and undergraduate and graduate students in the field of microelectronics, nanoelectronics, and electronics.

  20. What is Bipolar Disorder?

    Science.gov (United States)

    ... affect friends and family? For More Information Share Bipolar Disorder Download PDF Download ePub Order a free hardcopy ... brochure will give you more information. What is bipolar disorder? Bipolar disorder is a serious brain illness. It ...

  1. Microwave Enhanced Cotunneling in SET Transistors

    DEFF Research Database (Denmark)

    Manscher, Martin; Savolainen, M.; Mygind, Jesper

    2003-01-01

    Cotunneling in single electron tunneling (SET) devices is an error process which may severely limit their electronic and metrologic applications. Here is presented an experimental investigation of the theory for adiabatic enhancement of cotunneling by coherent microwaves. Cotunneling in SET...... transistors has been measured as function of temperature, gate voltage, frequency, and applied microwave power. At low temperatures and applied power levels, including also sequential tunneling, the results can be made consistent with theory using the unknown damping in the microwave line as the only free...

  2. A simple and controlled single electron transistor based on doping modulation in silicon nanowires

    OpenAIRE

    Hofheinz, M.; Jehl, X.; Sanquer, M.; Molas, G.; Vinet, M.; Deleonibus, S.

    2006-01-01

    A simple and highly reproducible single electron transistor (SET) has been fabricated using gated silicon nanowires. The structure is a metal-oxide-semiconductor field-effect transistor made on silicon-on-insulator thin films. The channel of the transistor is the Coulomb island at low temperature. Two silicon nitride spacers deposited on each side of the gate create a modulation of doping along the nanowire that creates tunnel barriers. Such barriers are fixed and controlled, like in metallic...

  3. Characterization of ionizing radiation effects in MOS structures by study of bipolar operation; Caracterisation des effets induits par irradiations ionisantes dans des structures MOS a partir de leur fonctionnement en regime bipolaire

    Energy Technology Data Exchange (ETDEWEB)

    Bakhtiar, H. [Univ. Teknologi Malaysia, Dept. of Physics, Johor (Malaysia); Picard, C.; Brisset, C. [CEA Saclay, Lab. d' Electronique et de Technologie de l' Informatique, LETI, 91 - Gif-sur-Yvette (France); Bakhtiar, H.; Hoffmann, A.; Charles, J.P. [Metz Univ., LICM-CLOES-Supelec, 57 (France)

    1999-07-01

    This work presents an original method to characterize radiation effects of micronic transistors. The characterization includes a study of the transistor substrate-drain junction and current gain variation of the bipolar transistor (drain-substrate-source as emitter-base-collector) for different gate voltages. (author000.

  4. Transtorno bipolar

    Directory of Open Access Journals (Sweden)

    Alda Martin

    1999-01-01

    Full Text Available Os resultados de estudos de famílias sugerem que o transtorno bipolar tenha uma base genética. Essa hipótese foi reforçada em estudos de adoção e de gêmeos. A herança do transtorno bipolar é complexa, envolve vários genes, além de apresentar heterogeneidade e interação entre fatores genéticos e não-genéticos. Achados, que já foram replicados, já implicaram os cromossomos 4, 12, 18 e 21, entre outros, na busca por genes de suscetibilidade. Os resultados mais promissores foram obtidos através de estudos de ligação. Por outro lado, os estudos de associação geraram dados interessantes, mas ainda vagos. Os estudos de populações de pacientes homogêneos e a melhor definição do fenótipo deverão contribuir para avanços futuros. A identificação dos genes relacionados ao transtorno bipolar irá permitir o melhor entendimento e tratamento dessa doença.

  5. Analysis of long-channel nanotube field-effect-transistors (NT FETs)

    Science.gov (United States)

    Toshishige, Yamada; Kwak, Dochan (Technical Monitor)

    2001-01-01

    This viewgraph presentation provides an analysis of long-channel nanotube (NT) field effect transistors (FET) from NASA's Ames Research Center. The structure of such a transistor including the electrode contact, 1D junction, and the planar junction is outlined. Also mentioned are various characteristics of a nanotube tip-equipped scanning tunnel microscope (STM).

  6. Parasitic bipolar amplification in a single event transient and its temperature dependence

    International Nuclear Information System (INIS)

    Liu Zheng; Chen Shu-Ming; Chen Jian-Jun; Qin Jun-Rui; Liu Rong-Rong

    2012-01-01

    Using three-dimensional technology computer-aided design (TCAD) simulation, parasitic bipolar amplification in a single event transient (SET) current of a single transistor and its temperature dependence are studied. We quantify the contributions of different current components in a SET current pulse, and it is found that the proportion of parasitic bipolar amplification in total collected charge is about 30% in both 130-nm and 90-nm technologies. The temperature dependence of parasitic bipolar amplification and the mechanism of the SET pulse are also investigated and quantified. The results show that the proportion of charge induced by parasitic bipolar increases with rising temperature, which illustrates that the parasitic bipolar amplification plays an important role in the charge collection of a single transistor

  7. Spin-Dependent Quasiparticle Transport in Aluminum Single Electron Transistors

    OpenAIRE

    Ferguson, A. J.; Andresen, S. E.; Brenner, R.; Clark, R. G.

    2006-01-01

    We investigate the effect of Zeeman-splitting on quasiparticle transport in normal-superconducting-normal (NSN) aluminum single electron transistors (SETs). In the above-gap transport the interplay of Coulomb blockade and Zeeman-splitting leads to spin-dependence of the sequential tunneling. This creates regimes where either one or both spin species can tunnel onto or off the island. At lower biases, spin-dependence of the single quasiparticle state is studied and operation of the device as a...

  8. Evolution of the MOS transistor - From conception to VLSI

    International Nuclear Information System (INIS)

    Sah, C.T.

    1988-01-01

    Historical developments of the metal-oxide-semiconductor field-effect-transistor (MOSFET) during the last sixty years are reviewed, from the 1928 patent disclosures of the field-effect conductivity modulation concept and the semiconductor triodes structures proposed by Lilienfeld to the 1947 Shockley-originated efforts which led to the laboratory demonstration of the modern silicon MOSFET thirty years later in 1960. A survey is then made of the milestones of the past thirty years leading to the latest submicron silicon logic CMOS (Complementary MOS) and BICMOS (Bipolar-Junction-Transistor CMOS combined) arrays and the three-dimensional and ferroelectric extensions of Dennard's one-transistor dynamic random access memory (DRAM) cell. Status of the submicron lithographic technologies (deep ultra-violet light, X-ray, electron-beam) are summarized. Future trends of memory cell density and logic gate speed are projected. Comparisons of the switching speed of the silicon MOSFET with that of silicon bipolar and GaAs field-effect transistors are reviewed. Use of high-temperature superconducting wires and GaAs-on-Si monolithic semiconductor optical clocks to break the interconnect-wiring delay barrier is discussed. Further needs in basic research and mathematical modeling on the failure mechanisms in submicron silicon transistors at high electric fields (hot electron effects) and in interconnection conductors at high current densities and low as well as high electric fields (electromigration) are indicated

  9. Bipolar disorder: an overview

    African Journals Online (AJOL)

    which is the reason that up to 69% of patients with BD are misdiagnosed.1 Bipolar ... Cyclothymic disorder. • Substance/medication induced bipolar and related disorder. • Bipolar and related disorder due to another medical condition ... patients. Keywords: bipolar disorder, mania, depression, pharmacological management.

  10. Effects of breathing and oblong mode phonons on transport properties in a single-electron transistor.

    Science.gov (United States)

    Nishiguchi, Norihiko; Wybourne, Martin N

    2010-02-17

    We investigate theoretically the transport characteristics of a single-electron transistor affected by the dynamic deformation of the device configuration due to phonons. By considering changes in capacitances and tunnel resistances caused by the breathing and oblong vibrations of the island that forms part of the transistor, we formulate the electron-phonon interaction peculiar to the device and derive its transport properties by means of the master equation. For a single electron transistor with a gold nanoparticle island of radius 1 nm, we demonstrate the contribution to the transport properties that originates from tunneling channels associated with THz phonon emission and absorption.

  11. Gate-Controlled WSe2Transistors Using a Buried Triple-Gate Structure.

    Science.gov (United States)

    Müller, M R; Salazar, R; Fathipour, S; Xu, H; Kallis, K; Künzelmann, U; Seabaugh, A; Appenzeller, J; Knoch, J

    2016-12-01

    In the present paper, we show tungsten diselenide (WSe 2 ) devices that can be tuned to operate as n-type and p-type field-effect transistors (FETs) as well as band-to-band tunnel transistors on the same flake. Source, channel, and drain areas of the WSe 2 flake are adjusted, using buried triple-gate substrates with three independently controllable gates. The device characteristics found in the tunnel transistor configuration are determined by the particular geometry of the buried triple-gate structure, consistent with a simple estimation of the expected off-state behavior.

  12. Tunnel spin polarization versus energy for clean and doped Al2O3 barriers

    NARCIS (Netherlands)

    Park, B.G.; Banerjee, T.; Lodder, J.C.; Jansen, R.

    2007-01-01

    The variation of the tunnel spin-polarization (TSP) with energy is determined using a magnetic tunnel transistor, allowing quantification of the energy dependent TSP separately for both ferromagnet/insulator interfaces and direct correlation with the tunnel magnetoresistance (TMR) measured in the

  13. Tunnel Spin Polarization Versus Energy for Clean and Doped Al2O3 Barriers

    NARCIS (Netherlands)

    Park, B.G.; Banerjee, T.; Lodder, J.C.; Jansen, R.

    2007-01-01

    The variation of the tunnel spin-polarization (TSP) with energy is determined using a magnetic tunnel transistor, allowing quantification of the energy dependent TSP separately for both ferromagnet/insulator interfaces and direct correlation with the tunnel magnetoresistance (TMR) measured in the

  14. Transistor-like behavior of transition metal complexes

    DEFF Research Database (Denmark)

    Albrecht, Tim; Guckian, A; Ulstrup, Jens

    2005-01-01

    scanning tunneling microscope (in situ STM). This configuration resembles a single-molecule transistor, where the reference electrode corresponds to the gate electrode. It operates at room temperature in a condensed matter (here aqueous) environment. Amplification on-off ratios up to 50 are found when...

  15. Synergistic effect of mixed neutron and gamma irradiation in bipolar operational amplifier OP07

    International Nuclear Information System (INIS)

    Yan, Liu; Wei, Chen; Shanchao, Yang; Xiaoming, Jin; Chaohui, He

    2016-01-01

    This paper presents the synergistic effects in bipolar operational amplifier OP07. The radiation effects are studied by neutron beam, gamma ray, and mixed neutron/gamma ray environments. The characterateristics of the synergistic effects are studied through comparison of different experiment results. The results show that the bipolar operational amplifier OP07 exhibited significant synergistic effects in the mixed neutron and gamma irradiation. The bipolar transistor is identified as the most radiation sensitive unit of the operational amplifier. In this paper, a series of simulations are performed on bipolar transistors in different radiation environments. In the theoretical simulation, the geometric model and calculations based on the Medici toolkit are built to study the radiation effects in bipolar components. The effect of mixed neutron and gamma irradiation is simulated based on the understanding of the underlying mechanisms of radiation effects in bipolar transistors. The simulated results agree well with the experimental data. The results of the experiments and simulation indicate that the radiation effects in the bipolar devices subjected to mixed neutron and gamma environments is not a simple combination of total ionizing dose (TID) effects and displacement damage. The data suggests that the TID effect could enhance the displacement damage. The synergistic effect should not be neglected in complex radiation environments.

  16. Synergistic effect of mixed neutron and gamma irradiation in bipolar operational amplifier OP07

    Energy Technology Data Exchange (ETDEWEB)

    Yan, Liu, E-mail: liuyan@nint.ac.cn [State Key Laboratory of Intense Pulsed Irradiation Simulation and Effect, Northwest Institute of Nuclear Technology, P.O.Box 69-10, Xi’an 710024 (China); School of Nuclear Science and Technology, Xi’an Jiaotong University, Xi’an 710049 (China); Wei, Chen; Shanchao, Yang; Xiaoming, Jin [State Key Laboratory of Intense Pulsed Irradiation Simulation and Effect, Northwest Institute of Nuclear Technology, P.O.Box 69-10, Xi’an 710024 (China); Chaohui, He [School of Nuclear Science and Technology, Xi’an Jiaotong University, Xi’an 710049 (China)

    2016-09-21

    This paper presents the synergistic effects in bipolar operational amplifier OP07. The radiation effects are studied by neutron beam, gamma ray, and mixed neutron/gamma ray environments. The characterateristics of the synergistic effects are studied through comparison of different experiment results. The results show that the bipolar operational amplifier OP07 exhibited significant synergistic effects in the mixed neutron and gamma irradiation. The bipolar transistor is identified as the most radiation sensitive unit of the operational amplifier. In this paper, a series of simulations are performed on bipolar transistors in different radiation environments. In the theoretical simulation, the geometric model and calculations based on the Medici toolkit are built to study the radiation effects in bipolar components. The effect of mixed neutron and gamma irradiation is simulated based on the understanding of the underlying mechanisms of radiation effects in bipolar transistors. The simulated results agree well with the experimental data. The results of the experiments and simulation indicate that the radiation effects in the bipolar devices subjected to mixed neutron and gamma environments is not a simple combination of total ionizing dose (TID) effects and displacement damage. The data suggests that the TID effect could enhance the displacement damage. The synergistic effect should not be neglected in complex radiation environments.

  17. Bipolar Items

    Directory of Open Access Journals (Sweden)

    Nishiguchi Sumiyo

    2016-12-01

    Full Text Available This article asserts that the Japanese wide-scope mo ‘even’ in simple sentences are bipolar items (BPIs antilicensed or forbidden by negation and licensed in a non-monotonic (NM environment. BPIs share the features of negative polarity items (NPIs as well as positive polarity items (PPIs. The Dutch ooit ‘ever’, the Serbo-Croatian i-series ‘and/even’, and the Hungarian is-series ‘and/even’ are antilicensed by clausemate negation and licensed by extraclausal negation (van der Wouden, 1997; Progovac, 1994; Szabolcsi, 2002 or non-monotonic negative (and positive, for Serbo-Croatian emotive predicates. Adding an NPI rescues BPIs in uncomfortable clausemate negation.

  18. Nanoscale Vacuum Channel Transistor.

    Science.gov (United States)

    Han, Jin-Woo; Moon, Dong-Il; Meyyappan, M

    2017-04-12

    Vacuum tubes that sparked the electronics era had given way to semiconductor transistors. Despite their faster operation and better immunity to noise and radiation compared to the transistors, the vacuum device technology became extinct due to the high power consumption, integration difficulties, and short lifetime of the vacuum tubes. We combine the best of vacuum tubes and modern silicon nanofabrication technology here. The surround gate nanoscale vacuum channel transistor consists of sharp source and drain electrodes separated by sub-50 nm vacuum channel with a source to gate distance of 10 nm. This transistor performs at a low voltage (3 microamperes). The nanoscale vacuum channel transistor can be a possible alternative to semiconductor transistors beyond Moore's law.

  19. Oxide bipolar electronics: materials, devices and circuits

    Science.gov (United States)

    Grundmann, Marius; Klüpfel, Fabian; Karsthof, Robert; Schlupp, Peter; Schein, Friedrich-Leonhard; Splith, Daniel; Yang, Chang; Bitter, Sofie; von Wenckstern, Holger

    2016-06-01

    We present the history of, and the latest progress in, the field of bipolar oxide thin film devices. As such we consider primarily pn-junctions in which at least one of the materials is a metal oxide semiconductor. A wide range of n-type and p-type oxides has been explored for the formation of such bipolar diodes. Since most oxide semiconductors are unipolar, challenges and opportunities exist with regard to the formation of heterojunction diodes and band lineups. Recently, various approaches have led to devices with high rectification, namely p-type ZnCo2O4 and NiO on n-type ZnO and amorphous zinc-tin-oxide. Subsequent bipolar devices and applications such as photodetectors, solar cells, junction field-effect transistors and integrated circuits like inverters and ring oscillators are discussed. The tremendous progress shows that bipolar oxide electronics has evolved from the exploration of various materials and heterostructures to the demonstration of functioning integrated circuits. Therefore a viable, facile and high performance technology is ready for further exploitation and performance optimization.

  20. Types of Bipolar Disorder

    Science.gov (United States)

    ... many people have bipolar disorder along with another illness such as anxiety disorder, substance abuse, or an eating disorder. People with ... are sometimes misdiagnosed with schizophrenia. Anxiety and ADHD: ... such as bipolar disorder. Risk Factors Scientists are ...

  1. Radiation effect on silicon transistors in mixed neutrons-gamma environment

    Science.gov (United States)

    Assaf, J.; Shweikani, R.; Ghazi, N.

    2014-10-01

    The effects of gamma and neutron irradiations on two different types of transistors, Junction Field Effect Transistor (JFET) and Bipolar Junction Transistor (BJT), were investigated. Irradiation was performed using a Syrian research reactor (RR) (Miniature Neutron Source Reactor (MNSR)) and a gamma source (Co-60 cell). For RR irradiation, MCNP code was used to calculate the absorbed dose received by the transistors. The experimental results showed an overall decrease in the gain factors of the transistors after irradiation, and the JFETs were more resistant to the effects of radiation than BJTs. The effect of RR irradiation was also greater than that of gamma source for the same dose, which could be because neutrons could cause more damage than gamma irradiation.

  2. Specifics of Pulsed Arc Welding Power Supply Performance Based On A Transistor Switch

    Science.gov (United States)

    Krampit, N. Yu; Kust, T. S.; Krampit, M. A.

    2016-08-01

    Specifics of designing a pulsed arc welding power supply device are presented in the paper. Electronic components for managing large current was analyzed. Strengths and shortcomings of power supply circuits based on thyristor, bipolar transistor and MOSFET are outlined. As a base unit for pulsed arc welding was chosen MOSFET transistor, which is easy to manage. Measures to protect a transistor are given. As for the transistor control device is a microcontroller Arduino which has a low cost and adequate performance of the work. Bead transfer principle is to change the voltage on the arc in the formation of beads on the wire end. Microcontroller controls transistor when the arc voltage reaches the threshold voltage. Thus there is a separation and transfer of beads without splashing. Control strategies tested on a real device and presented. The error in the operation of the device is less than 25 us, it can be used controlling drop transfer at high frequencies (up to 1300 Hz).

  3. Cytokines in bipolar disorder

    DEFF Research Database (Denmark)

    Munkholm, Klaus; Vinberg, Maj; Vedel Kessing, Lars

    2012-01-01

    to affective state. METHODS: We conducted a systemtic review of studies measuring endogenous cytokine concentrations in patients with bipolar disorder and a meta-analysis, reporting results according to the PRISMA statement. RESULTS: Thirteen studies were included, comprising 556 bipolar disorder patients......BACKGROUND: Current research and hypothesis regarding the pathophysiology of bipolar disorder suggests the involvement of immune system dysfunction that is possibly related to disease activity. Our objective was to systematically review evidence of cytokine alterations in bipolar disorder according...

  4. Psychotic and Bipolar Disorders: Bipolar Disorder.

    Science.gov (United States)

    Holder, Sarah D

    2017-04-01

    Bipolar disorder is a severe chronic mental illness that affects a large number of individuals. This disorder is separated into two major types, bipolar I disorder, with mania and typically recurrent depression, and bipolar II disorder, with recurrent major depression and hypomania. Patients with bipolar disorder spend the majority of time experiencing depression, and this typically is the presenting symptom. Because outcomes are improved with earlier diagnosis and treatment, physicians should maintain a high index of suspicion for bipolar disorder. The most effective long-term treatments are lithium and valproic acid, although other drugs also are used. In addition to referral to a mental health subspecialist for initiation and management of drug treatment, patients with bipolar disorder should be provided with resources for psychotherapy. Several comorbidities commonly associated with bipolar disorder include other mental disorders, substance use disorders, migraine headaches, chronic pain, stroke, metabolic syndrome, and cardiovascular disease. Family physicians who care for patients with bipolar disorder should focus their efforts on prevention and management of comorbidities. These patients should be assessed continually for risk of suicide because they are at high risk and their suicide attempts tend to be successful. Written permission from the American Academy of Family Physicians is required for reproduction of this material in whole or in part in any form or medium.

  5. Nutrition and Bipolar Depression.

    Science.gov (United States)

    Beyer, John L; Payne, Martha E

    2016-03-01

    As with physical conditions, bipolar disorder is likely to be impacted by diet and nutrition. Patients with bipolar disorder have been noted to have relatively unhealthy diets, which may in part be the reason they also have an elevated risk of metabolic syndrome and obesity. An improvement in the quality of the diet should improve a bipolar patient's overall health risk profile, but it may also improve their psychiatric outcomes. New insights into biological dysfunctions that may be present in bipolar disorder have presented new theoretic frameworks for understanding the relationship between diet and bipolar disorder. Copyright © 2016 Elsevier Inc. All rights reserved.

  6. Development of Gate and Base Drive Using SiC Junction Field Effect Transistors

    Science.gov (United States)

    2008-05-01

    Agarwal, Anant; Richmond, James ; Chow, T. Paul; Geil, Bruce; Jones, Ken A.; Scozzie, Charles. 4 kV, 10 A Bipolar Junction Transistors in 4H-SiC. Proc...PROVING GROUND MD 21005-5001 1 US ARMY TRADOC BATTLE LAB INTEGRATION & TECHL DIRCTRT ATTN ATCD B 10 WHISTLER LANE FT MONROE

  7. Study of radiation (neutrons, γ-rays, and carbon-ions) effects on NPN transistors

    International Nuclear Information System (INIS)

    Croitoru, N.; D'Angelo, P.; Rancoita, P.G.; Rattaggi, M.; Seidman, A.; Croitoru, N.; Seidman, A.

    1999-01-01

    Bipolar npn-transistors, irradiated by neutrons, γ-rays, and ions, showed an I B increase, which resulted in a lower current gain (β F ). The variation of 1/β F was found to be proportional to the expected number of Frenkel pairs/μm, regardless of the radiation type. (authors)

  8. Bipolar Treatment: Are Bipolar I and Bipolar II Treated Differently?

    Science.gov (United States)

    ... management strategies. In addition to medications and other types of treatment, successful management of your bipolar disorder includes living a healthy lifestyle, such as getting enough sleep, eating a healthy diet and being physically active. ...

  9. Single-dopant resonance in a single-electron transistor

    Science.gov (United States)

    Golovach, V. N.; Jehl, X.; Houzet, M.; Pierre, M.; Roche, B.; Sanquer, M.; Glazman, L. I.

    2011-02-01

    Single dopants in semiconductor nanostructures have been studied in great detail recently as they are good candidates for quantum bits, provided they are coupled to a detector. Here we report the coupling of a single As donor atom to a single-electron transistor (SET) in a silicon nanowire field-effect transistor. Both capacitive and tunnel coupling are achieved, the latter resulting in a dramatic increase of the conductance through the SET, by up to one order of magnitude. The experimental results are well explained by the rate-equation theory developed in parallel with the experiment.

  10. Numerical calculation of strain-N+-Ge1- x Sn x /P+-δGe1- x Sn x /N--Ge1- y - z Si y Sn z /P+-Ge1- y - z Si y Sn z heterojunction tunnel field-effect transistor

    Science.gov (United States)

    Wang, Suyuan; Zheng, Jun; Xue, Chunlai; Li, Chuanbo; Zuo, Yuhua; Cheng, Buwen; Wang, Qiming

    2017-05-01

    In this work, we present a theoretical calculation of the insertion of a δ-doping layer in double gate N+-Ge1- x Sn x /N-Ge1- y - z Si y Sn z /P+-Ge1- y - z Si y Sn z heterojunction p-type tunnel field-effect transistors (PTFETs) by semiconductor device simulation. The compositions of Ge1- x Sn x and Ge1- y - z Si y Sn z and the optimization of the δ-layer are analyzed in detail. It is shown that the use of narrow-bandgap Ge1- x Sn x in the source region and large-bandgap Ge1- y - z Si y Sn z in the drain region is favorable for increasing the on-state current (I ON) and suppressing the ambipolar effect. The P+ δ-layer in the Ge1- x Sn x considerably improves the PTFET performance compared with other structures. The best I ON of 69.56 µA/µm and the subthreshold swing (SS) of 22 mV/dec were achieved at a low applied voltage of -0.5 V.

  11. Influence of channel material properties on performance of nanowire transistors

    Science.gov (United States)

    Razavi, Pedram; Fagas, Giorgos; Ferain, Isabelle; Yu, Ran; Das, Samaresh; Colinge, Jean-Pierre

    2012-06-01

    The performance of germanium and silicon inversion-mode and junctionless nanowire field-effect transistors are investigated using three-dimensional quantum mechanical simulations in the ballistic transport regime and within the framework of effective-mass theory for different channel materials and orientations. Our study shows that junctionless nanowire transistors made using n-type Ge or Si nanowires as a channel material are more immune to short-channel effects than conventional inversion-mode nanowire field-effect transistors. As a result, these transistors present smaller subthreshold swing, less drain-induced barrier-lowering, lower source-to-drain tunneling, and higher Ion/Ioff ratio for the same technology node and low standby power technologies. We also show that the short-channel characteristics of Ge and Si junctionless nanowire transistors, unlike the inversion-mode nanowire transistors, are very similar. The results are explained through a detailed analysis on the effect of the channel crystallographic orientation, effective masses, and dielectric constant on electrical characteristics.

  12. Ballistic Phosphorene Transistor

    Science.gov (United States)

    2015-11-19

    satisfactory. W911NF-14-1-0572 -II 66414-EL-II.3 TO:(1) Electronics Division (Qiu, Joe) TITLE: Final Report: Ballistic Phosphorene Transistor (x) Material... Transistor ” as a STIP award for the period 09/1/2014 through 5/31/2015. The ARO program director responsible for the grant is Dr. Joe Qiu. The PI is Prof...UU 19-11-2015 1-Sep-2014 31-May-2015 Approved for Public Release; Distribution Unlimited Final Report: Ballistic Phosphorene Transistor The views

  13. Bipolar soft connected, bipolar soft disconnected and bipolar soft compact spaces

    Directory of Open Access Journals (Sweden)

    Muhammad Shabir

    2017-06-01

    Full Text Available Bipolar soft topological spaces are mathematical expressions to estimate interpretation of data frameworks. Bipolar soft theory considers the core features of data granules. Bipolarity is important to distinguish between positive information which is guaranteed to be possible and negative information which is forbidden or surely false. Connectedness and compactness are the most important fundamental topological properties. These properties highlight the main features of topological spaces and distinguish one topology from another. Taking this into account, we explore the bipolar soft connectedness, bipolar soft disconnectedness and bipolar soft compactness properties for bipolar soft topological spaces. Moreover, we introduce the notion of bipolar soft disjoint sets, bipolar soft separation, and bipolar soft hereditary property and study on bipolar soft connected and disconnected spaces. By giving the detailed picture of bipolar soft connected and disconnected spaces we investigate bipolar soft compact spaces and derive some results related to this concept.

  14. Vertical organic transistors

    Science.gov (United States)

    Lüssem, Björn; Günther, Alrun; Fischer, Axel; Kasemann, Daniel; Leo, Karl

    2015-11-01

    Organic switching devices such as field effect transistors (OFETs) are a key element of future flexible electronic devices. So far, however, a commercial breakthrough has not been achieved because these devices usually lack in switching speed (e.g. for logic applications) and current density (e.g. for display pixel driving). The limited performance is caused by a combination of comparatively low charge carrier mobilities and the large channel length caused by the need for low-cost structuring. Vertical Organic Transistors are a novel technology that has the potential to overcome these limitations of OFETs. Vertical Organic Transistors allow to scale the channel length of organic transistors into the 100 nm regime without cost intensive structuring techniques. Several different approaches have been proposed in literature, which show high output currents, low operation voltages, and comparatively high speed even without sub-μm structuring technologies. In this review, these different approaches are compared and recent progress is highlighted.

  15. Silicon nanowire transistors

    CERN Document Server

    Bindal, Ahmet

    2016-01-01

    This book describes the n and p-channel Silicon Nanowire Transistor (SNT) designs with single and dual-work functions, emphasizing low static and dynamic power consumption. The authors describe a process flow for fabrication and generate SPICE models for building various digital and analog circuits. These include an SRAM, a baseband spread spectrum transmitter, a neuron cell and a Field Programmable Gate Array (FPGA) platform in the digital domain, as well as high bandwidth single-stage and operational amplifiers, RF communication circuits in the analog domain, in order to show this technology’s true potential for the next generation VLSI. Describes Silicon Nanowire (SNW) Transistors, as vertically constructed MOS n and p-channel transistors, with low static and dynamic power consumption and small layout footprint; Targets System-on-Chip (SoC) design, supporting very high transistor count (ULSI), minimal power consumption requiring inexpensive substrates for packaging; Enables fabrication of different types...

  16. Outlook and emerging semiconducting materials for ambipolar transistors.

    Science.gov (United States)

    Bisri, Satria Zulkarnaen; Piliego, Claudia; Gao, Jia; Loi, Maria Antonietta

    2014-02-26

    Ambipolar or bipolar transistors are transistors in which both holes and electrons are mobile inside the conducting channel. This device allows switching among several states: the hole-dominated on-state, the off-state, and the electron-dominated on-state. In the past year, it has attracted great interest in exotic semiconductors, such as organic semiconductors, nanostructured materials, and carbon nanotubes. The ability to utilize both holes and electrons inside one device opens new possibilities for the development of more compact complementary metal-oxide semiconductor (CMOS) circuits, and new kinds of optoelectronic device, namely, ambipolar light-emitting transistors. This progress report highlights the recent progresses in the field of ambipolar transistors, both from the fundamental physics and application viewpoints. Attention is devoted to the challenges that should be faced for the realization of ambipolar transistors with different material systems, beginning with the understanding of the importance of interface modification, which heavily affects injections and trapping of both holes and electrons. The recent development of advanced gating applications, including ionic liquid gating, that open up more possibility to realize ambipolar transport in materials in which one type of charge carrier is highly dominant is highlighted. Between the possible applications of ambipolar field-effect transistors, we focus on ambipolar light-emitting transistors. We put this new device in the framework of its prospective for general lightings, embedded displays, current-driven laser, as well as for photonics-electronics interconnection. © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  17. A semi-floating gate transistor for low-voltage ultrafast memory and sensing operation.

    Science.gov (United States)

    Wang, Peng-Fei; Lin, Xi; Liu, Lei; Sun, Qing-Qing; Zhou, Peng; Liu, Xiao-Yong; Liu, Wei; Gong, Yi; Zhang, David Wei

    2013-08-09

    As the semiconductor devices of integrated circuits approach the physical limitations of scaling, alternative transistor and memory designs are needed to achieve improvements in speed, density, and power consumption. We report on a transistor that uses an embedded tunneling field-effect transistor for charging and discharging the semi-floating gate. This transistor operates at low voltages (≤2.0 volts), with a large threshold voltage window of 3.1 volts, and can achieve ultra-high-speed writing operations (on time scales of ~1 nanosecond). A linear dependence of drain current on light intensity was observed when the transistor was exposed to light, so possible applications include image sensing with high density and performance.

  18. Transistor-based interface circuitry

    Science.gov (United States)

    Taubman, Matthew S [Richland, WA

    2004-02-24

    Among the embodiments of the present invention is an apparatus that includes a transistor, a servo device, and a current source. The servo device is operable to provide a common base mode of operation of the transistor by maintaining an approximately constant voltage level at the transistor base. The current source is operable to provide a bias current to the transistor. A first device provides an input signal to an electrical node positioned between the emitter of the transistor and the current source. A second device receives an output signal from the collector of the transistor.

  19. Modeling of enclosed-gate layout transistors as ESD protection device based on conformal mapping method

    International Nuclear Information System (INIS)

    Zhang Jia; Yang Haigang; Sun Jiabin; Yu Le; Wei Yuanfeng

    2014-01-01

    This paper proposes a novel technique for modeling the electrostatic discharge (ESD) characteristic of the enclosed-gate layout transistors (ELTs). The model consists of an ELT, a parasitic bipolar transistor, and a substrate resistor. The ELT is decomposed into edge and corner transistors by solving the electrostatic field problem through the conformal mapping method, and these transistors are separately modeled by BSIM (Berkeley Short-channel IGFET Model). Fast simulation speed and easy implementation is obtained as the model can be incorporated into standard SPICE simulation. The model parameters are extracted from the critical point of the snapback curve, and simulation results are presented and compared to experimental data for verification. (semiconductor integrated circuits)

  20. Study of improved reverse recovery in power transistor incorporating universal contact

    Science.gov (United States)

    Anand, R. S.; Mazhari, B.; Narain, J.

    2004-05-01

    The improvement in reverse recovery of power NPN bipolar transistor (BJT) through incorporation of "universal contact" in the base is studied in detail. It is shown that use of universal contact allows redistribution of base current in saturation from collector region where recombination lifetime is high to extrinsic base region where effective recombination lifetime is low. The reverse recovery time decreases as collector current density increases but increases as collector breakdown voltage increases. The improvement in reverse recovery is accompanied with an increase in collector-emitter voltage in the ON state. For low voltage transistors and high voltage transistors at low collector current densities, the increase is primarily due to reduction in reverse current gain. For high breakdown voltage transistors, the use of universal contact results in early onset of quasi-saturation effect and results in degradation in ON state voltage at high collector current densities.

  1. Recognition tunneling

    International Nuclear Information System (INIS)

    Lindsay, Stuart; He Jin; Zhang Peiming; Chang Shuai; Huang Shuo; Sankey, Otto; Hapala, Prokop; Jelinek, Pavel

    2010-01-01

    Single molecules in a tunnel junction can now be interrogated reliably using chemically functionalized electrodes. Monitoring stochastic bonding fluctuations between a ligand bound to one electrode and its target bound to a second electrode ('tethered molecule-pair' configuration) gives insight into the nature of the intermolecular bonding at a single molecule-pair level, and defines the requirements for reproducible tunneling data. Simulations show that there is an instability in the tunnel gap at large currents, and this results in a multiplicity of contacts with a corresponding spread in the measured currents. At small currents (i.e. large gaps) the gap is stable, and functionalizing a pair of electrodes with recognition reagents (the 'free-analyte' configuration) can generate a distinct tunneling signal when an analyte molecule is trapped in the gap. This opens up a new interface between chemistry and electronics with immediate implications for rapid sequencing of single DNA molecules. (topical review)

  2. Recognition tunneling

    Energy Technology Data Exchange (ETDEWEB)

    Lindsay, Stuart; He Jin; Zhang Peiming; Chang Shuai; Huang Shuo [Biodesign Institute, Arizona State University, Tempe, AZ 85287 (United States); Sankey, Otto [Department of Physics, Arizona State University, Tempe, AZ 85287 (United States); Hapala, Prokop; Jelinek, Pavel [Institute of Physics, Academy of Sciences of the Czech Republic, Cukrovarnicka 10, 1862 53, Prague (Czech Republic)

    2010-07-02

    Single molecules in a tunnel junction can now be interrogated reliably using chemically functionalized electrodes. Monitoring stochastic bonding fluctuations between a ligand bound to one electrode and its target bound to a second electrode ('tethered molecule-pair' configuration) gives insight into the nature of the intermolecular bonding at a single molecule-pair level, and defines the requirements for reproducible tunneling data. Simulations show that there is an instability in the tunnel gap at large currents, and this results in a multiplicity of contacts with a corresponding spread in the measured currents. At small currents (i.e. large gaps) the gap is stable, and functionalizing a pair of electrodes with recognition reagents (the 'free-analyte' configuration) can generate a distinct tunneling signal when an analyte molecule is trapped in the gap. This opens up a new interface between chemistry and electronics with immediate implications for rapid sequencing of single DNA molecules. (topical review)

  3. Crossed Andreev reflection in a graphene bipolar transistor.

    Science.gov (United States)

    Cayssol, J

    2008-04-11

    We investigate the crossed Andreev reflections between two graphene leads connected by a narrow superconductor. When the leads are, respectively, of the n and p type, we find that electron elastic cotunneling and local Andreev reflection are both eliminated even in the absence of any valley-isospin or spin polarizations. We further predict oscillations of both diagonal and cross conductances as a function of the distance between the graphene-superconductor interfaces.

  4. Heuristic for Learning Common Emitter Amplification with Bipolar Transistors

    Science.gov (United States)

    Staffas, Kjell

    2017-01-01

    Mathematics in engineering education causes many thresholds in the courses because of the demand of abstract conceptualisation. Electronics depend heavily on more or less complex mathematics. Therefore the concepts of analogue electronics are hard to learn since a great deal of students struggle with the calculations and procedures needed. A…

  5. Soft switch-avalanche IGBT convertor. [Insulated Gate Bipolar Transistor

    Science.gov (United States)

    Chen, K.; Stuart, T. A.

    1990-01-01

    A full bridge dc-dc converter using a zero voltage and zero current switching technique is described. This circuit utilizes the characteristics of the IGBT to achieve power and frequency combinations that are much higher than those previously reported for this device. Experimental results are included for a 1.5 kW, 100 kHz converter with 94 percent efficiency.

  6. Development of insulated gate bipolar transistor-based power ...

    Indian Academy of Sciences (India)

    [5] S V Nakhe et al, National Laser Symposium, 81–82 (2001). [6] E G Cook et al, 8th IEEE Pulsed Power Conference, June 1991. [7] L Druckmann et al, IEEE Power Modulator Symposium, 213–216 (1992). [8] Hybrid gate drivers and gate drive power supplies, M57962L datasheet from Mitsubishi. Electric Corpn. Pramana ...

  7. Development of insulated gate bipolar transistor-based power ...

    Indian Academy of Sciences (India)

    325 V to 550 V with a maximum current rating of 20 A. The storage capacitor is realized using two capacitor banks C01 and C02. These capacitor banks are reso- nantly charged through the charging inductor Lc, blocking diode Db and primary of the pulse transformer by the DC source to approximately twice its value. Pulse.

  8. Bipolar Disorder - Multiple Languages

    Science.gov (United States)

    ... MP3 Bipolar Disorder (An Introduction) - English MP4 Bipolar Disorder (An Introduction) - español (Spanish) MP4 Healthy Roads Media Characters not displaying correctly on this page? See language display issues . Return to the MedlinePlus Health Information ...

  9. Transistor scaling with novel materials

    OpenAIRE

    Meikei Ieong; Vijay Narayanan; Dinkar Singh; Anna Topol; Victor Chan; Zhibin Ren

    2006-01-01

    Complementary metal-oxide-semiconductor (CMOS) transistor scaling will continue for at least another decade. However, innovation in transistor structures and integration of novel materials are needed to sustain this performance trend. Here we discuss the challenges and opportunities of transistor scaling for the next five to ten years.

  10. Transistor Laser Optical NOR Gate for High Speed Optical Logic Processors

    Science.gov (United States)

    2017-03-20

    time. This has been confirmed experimentally . Recently, we demonstrated a light emitting transistor with base and emitter short as a tilted charge...low laser n assisted 2 increases tions from or IC-VCE2 s. mented by functions L2 will not ne or two ogic 0” is tunneling -Holonyak T...Kenneth Goretta) under Grant FA9550-15-1-0122 for the fundamental study of fast recombination lifetimes and tunneling modulation. This project is

  11. Resonant Tunneling in Gated Vertical One- dimensional Structures

    Science.gov (United States)

    Kolagunta, V. R.; Janes, D. B.; Melloch, M. R.; Webb, K. J.

    1997-03-01

    Vertical sub-micron transistors incorporating resonant tunneling multiple quantum well heterostructures are interesting in applications for both multi-valued logic devices and the study of quantization effects in vertical quasi- one-, zero- dimensional structures. Earlier we have demonstrated room temperature pinch-off of the resonant peak in sub-micron vertical resonant tunneling transistors structures using a self-aligned sidewall gating technique ( V.R. Kolagunta et. al., Applied Physics Lett., 69), 374(1996). In this paper we present the study of gating effects in vertical multiple quantum well resonant tunneling transistors. Multiple well quasi-1-D sidewall gated transistors with mesa dimensions of L_x=0.5-0.9μm and L_y=10-40μm were fabricated. The quantum heterostructure in these devices consists of two non-symmetric (180 ÅÅi-GaAs wells separated from each other and from the top and bottom n^+ GaAs/contacts region using Al_0.3Ga_0.7As tunneling barriers. Room temperature pinch-off of the multiple resonant peaks similar to that reported in the case of single well devices is observed in these devices^1. Current-voltage characteristics at liquid nitrogen temperatures show splitting of the resonant peaks into sub-bands with increasing negative gate bias indicative of quasi- 1-D confinement. Room-temperature and low-temperature current-voltage measurements shall be presented and discussed.

  12. High-performance silicon nanotube tunneling FET for ultralow-power logic applications

    KAUST Repository

    Fahad, Hossain M.

    2013-03-01

    To increase typically low output drive currents from tunnel field-effect transistors (FETs), we show a silicon vertical nanotube (NT) architecture-based FET\\'s effectiveness. Using core (inner) and shell (outer) gate stacks, the silicon NT tunneling FET shows a sub-60 mV/dec subthreshold slope, ultralow off -state leakage current, higher drive current compared with gate-all-around nanowire silicon tunnel FETs. © 1963-2012 IEEE.

  13. Properties of Bipolar Fuzzy Hypergraphs

    OpenAIRE

    Akram, M.; Dudek, W. A.; Sarwar, S.

    2013-01-01

    In this article, we apply the concept of bipolar fuzzy sets to hypergraphs and investigate some properties of bipolar fuzzy hypergraphs. We introduce the notion of $A-$ tempered bipolar fuzzy hypergraphs and present some of their properties. We also present application examples of bipolar fuzzy hypergraphs.

  14. Silicon-germanium nanowire tunnel-FETs with homo- and heterostructure tunnel junctions

    Science.gov (United States)

    Richter, S.; Blaeser, S.; Knoll, L.; Trellenkamp, S.; Fox, A.; Schäfer, A.; Hartmann, J. M.; Zhao, Q. T.; Mantl, S.

    2014-08-01

    Experimental results on tunneling field-effect transistors (TFETs) based on strained SiGe on SOI nanowire arrays are presented. A heterostructure SiGe/Si TFET with a vertical tunnel junction consisting of an in situ doped SiGe source and a Si channel with a minimum inverse subthreshold slope of 90 mV/dec is demonstrated. An increase in tunneling area results in higher on-current. The in situ doped heterojunction TFET shows great improvement compared to a homojunction SiGe on SOI nanowire design with implanted junctions. Temperature dependent measurements and device simulations are performed in order to analyze the tunnel transport mechanism in the devices.

  15. Bipolar Disorder in Children

    Science.gov (United States)

    2014-01-01

    Although bipolar disorder historically was thought to only occur rarely in children and adolescents, there has been a significant increase in children and adolescents who are receiving this diagnosis more recently (Carlson, 2005). Nonetheless, the applicability of the current bipolar disorder diagnostic criteria for children, particularly preschool children, remains unclear, even though much work has been focused on this area. As a result, more work needs to be done to further the understanding of bipolar symptoms in children. It is hoped that this paper can assist psychologists and other health service providers in gleaning a snapshot of the literature in this area so that they can gain an understanding of the diagnostic criteria and other behaviors that may be relevant and be informed about potential approaches for assessment and treatment with children who meet bipolar disorder criteria. First, the history of bipolar symptoms and current diagnostic criteria will be discussed. Next, assessment strategies that may prove helpful for identifying bipolar disorder will be discussed. Then, treatments that may have relevance to children and their families will be discussed. Finally, conclusions regarding work with children who may have a bipolar disorder diagnosis will be offered. PMID:24800202

  16. Bipolar Disorder in Children

    Directory of Open Access Journals (Sweden)

    Kimberly Renk

    2014-01-01

    Full Text Available Although bipolar disorder historically was thought to only occur rarely in children and adolescents, there has been a significant increase in children and adolescents who are receiving this diagnosis more recently (Carlson, 2005. Nonetheless, the applicability of the current bipolar disorder diagnostic criteria for children, particularly preschool children, remains unclear, even though much work has been focused on this area. As a result, more work needs to be done to further the understanding of bipolar symptoms in children. It is hoped that this paper can assist psychologists and other health service providers in gleaning a snapshot of the literature in this area so that they can gain an understanding of the diagnostic criteria and other behaviors that may be relevant and be informed about potential approaches for assessment and treatment with children who meet bipolar disorder criteria. First, the history of bipolar symptoms and current diagnostic criteria will be discussed. Next, assessment strategies that may prove helpful for identifying bipolar disorder will be discussed. Then, treatments that may have relevance to children and their families will be discussed. Finally, conclusions regarding work with children who may have a bipolar disorder diagnosis will be offered.

  17. Universal tunneling behavior in technologically relevant P/N junction diodes

    International Nuclear Information System (INIS)

    Solomon, Paul M.; Jopling, Jason; Frank, David J.; D'Emic, Chris; Dokumaci, O.; Ronsheim, P.; Haensch, W.E.

    2004-01-01

    Band-to-band tunneling was studied in ion-implanted P/N junction diodes with profiles representative of present and future silicon complementary metal-oxide-silicon (CMOS) field effect transistors. Measurements were done over a wide range of temperatures and implant parameters. Profile parameters were derived from analysis of capacitance versus voltage characteristics, and compared to secondary-ion mass spectroscopy analysis. When the tunneling current was plotted against the effective tunneling distance (tunneling distance corrected for band curvature) a quasi-universal exponential reduction of tunneling current versus, tunneling distance was found with an attenuation length of 0.38 nm, corresponding to a tunneling effective mass of 0.29 times the free electron mass (m 0 ), and an extrapolated tunneling current at zero tunnel distance of 5.3x10 7 A/cm 2 at 300 K. These results are directly applicable for predicting drain to substrate currents in CMOS transistors on bulk silicon, and body currents in CMOS transistors in silicon-on-insulator

  18. a Silicon Germanium Graded Junctionless Transistor with Low off Current

    Science.gov (United States)

    Surana, Neelam; Ghosh, Bahniman; Tripathy, Ball Mukund Mani; Salimath, Akshay Kumar

    2013-02-01

    We propose a Ge/Si graded junctionless transistor (JLT) which helps to reduce the band-to-band tunneling current in off-state for highly doped double gate junctionless transistor (DGJLT). In this paper, we show that there is large band-to-band tunneling (BTBT) current in off-state of silicon-channel and germanium-channel DGJLT, which causes increase in the off-state leakage current by several orders. With the help of band-gap engineering, we found that by using Ge/Si graded channel DGJLT off-state band-to-band tunneling current can be reduced. It is also observed that there is large deviation in the off-state leakage current with variation of drain voltage for Si and Ge body DGJLT, which reduces device stability. It is found that in Ge/Si graded DGJLT variation off-state leakage current with drain voltage is controlled. In Si and Ge, DGJLT electrons from the valence band of the channel tunnel to the conduction band of drain leaves holes which causes increased hole concentration in the channel creating parasitic 'BJT'.

  19. Charge collection mechanisms in MOS/SOI transistors irradiated by energetic heavy ions

    International Nuclear Information System (INIS)

    Musseau, O.; Leray, J.L.; Ferlet, V.; Umbert, A.; Coic, Y.M.; Hesto, P.

    1991-01-01

    We have investigated with both experimental and numerical methods (Monte Carlo and drift-diffusion models) various charge collection mechanisms in NMOS/SOI transistors irradiated by single energetic heavy ions. Our physical interpretations of data emphasize the influence of various parasitic structures of the device. Two charge collection mechanisms are detailed: substrate funneling in buried MOS capacitor and latching of the parasitic bipolar transistor. Based on carrier transport and charge collection, the sensitivity of future scaled down CMOS/SOI technologies is finally discussed

  20. Effect of 100MeV oxygen ion irradiation on silicon NPN power transistor

    Science.gov (United States)

    Kumar, M. Vinay; Krishnakumar, K. S.; Dinesh, C. M.; Krishnaveni, S.; Ramani

    2012-06-01

    The radiation response of npn Bipolar junction transistor (BJT) has been examined for 100 MeV O7+ ion. Key electrical properties like Gummel characteristics, dc current gain and capacitance-voltage of 100MeV O7+ ion irradiated transistor were studied before and after irradiation. The device was decapped and the electrical characterizations were performed at room temperature. Base current is observed to be more sensitive than collector current and gain appears to be degraded with ion fluence, also considerable degradation in C-V characteristics is observed and doping concentration is found to be increased along with the increase in ion fluence.

  1. Atomtronics and basic logic: Constructing AND and OR gates from atomtronic transistors

    Science.gov (United States)

    Pepino, Ronald; Cooper, John; Anderson, Dana; Holland, Murray

    2008-05-01

    Our atomtronics research focuses on creating an analogy of electronic devices and circuits with ultracold atoms. Such an analogy arises from the highly tunable band structure of ultracold neutral atoms trapped in optical lattices. In previous work it has been demonstrated that the electronic behavior of a diode, field effect transistor (FET), and bipolar junction transistor (BJT) can all be realized in systems composed of optical lattices connected to reservoirs of neutral, ultracold atoms. We demonstrate that the behavior of simple logic gates namely, the AND and OR gates, can be realized by connecting the BJTs in the traditional electronic manner.

  2. Effect of 100MeV oxygen ion irradiation on silicon NPN power transistor

    Energy Technology Data Exchange (ETDEWEB)

    Kumar, M. Vinay; Krishnakumar, K. S.; Dinesh, C. M.; Krishnaveni, S.; Ramani [Department of studies in Physics, University of Mysore, Mysore (India); Department of Physics, APS College, Bengaluru (India); Department of Physics, DCE, Govt. First Grade College, Mangalore (India); Department of studies in Physics, University of Mysore, Mysore (India); Department of Physics, Bangalore University, Bengaluru (India)

    2012-06-05

    The radiation response of npn Bipolar junction transistor (BJT) has been examined for 100 MeV O{sup 7+} ion. Key electrical properties like Gummel characteristics, dc current gain and capacitance-voltage of 100MeV O{sup 7+} ion irradiated transistor were studied before and after irradiation. The device was decapped and the electrical characterizations were performed at room temperature. Base current is observed to be more sensitive than collector current and gain appears to be degraded with ion fluence, also considerable degradation in C-V characteristics is observed and doping concentration is found to be increased along with the increase in ion fluence.

  3. Spin-torque transistor

    NARCIS (Netherlands)

    Bauer, G.E.W.; Brataas, A.; Tserkovnyak, Y.; Van Wees, B.J.

    2003-01-01

    A magnetoelectronic thin-film transistor is proposed that can display negative differential resistance and gain. The working principle is the modulation of the soure–drain current in a spin valve by the magnetization of a third electrode, which is rotated by the spin-torque created by a control spin

  4. Strain-enhanced tunneling magnetoresistance in MgO magnetic tunnel junctions

    OpenAIRE

    Loong, Li Ming; Qiu, Xuepeng; Neo, Zhi Peng; Deorani, Praveen; Wu, Yang; Bhatia, Charanjit S.; Saeys, Mark; Yang, Hyunsoo

    2014-01-01

    While the effects of lattice mismatch-induced strain, mechanical strain, as well as the intrinsic strain of thin films are sometimes detrimental, resulting in mechanical deformation and failure, strain can also be usefully harnessed for applications such as data storage, transistors, solar cells, and strain gauges, among other things. Here, we demonstrate that quantum transport across magnetic tunnel junctions (MTJs) can be significantly affected by the introduction of controllable mechanical...

  5. Experimental characterization of the dominant multiple nodes charge collection mechanism in metal oxide-semiconductor transistors

    Science.gov (United States)

    Song, Ruiqiang; Chen, Shuming; Chi, Yaqing; Wu, Zhenyu; Liang, Bin; Chen, Jianjun; Xu, Jingyan; Hao, Peipei; Yu, Junting

    2017-06-01

    We propose an experimental method to investigate the dominant multiple node charge collection mechanism. A transistor array-based test structure is used to distinguish charge collection owing to the drift-diffusion and parasitic bipolar amplification effect. Heavy ion experimental results confirm that drift-diffusion dominates multiple node charge collection at low linear energy transfer (LET). However, the parasitic bipolar amplification effect dominates it at high LET. We also propose simple equations to determine the critical LET which may change the dominant multiple node charge collection mechanism. The calculated LET value is consistent with the heavy ion experimental results.

  6. Single- and double-island ferromagnetic single-electron transistors

    International Nuclear Information System (INIS)

    Barnas, J.; Weymann, I.; Wisniewska, J.; Kowalik, M.; Kunert, H.W.

    2006-01-01

    Electronic transport in a ferromagnetic single-electron transistor has been considered theoretically in the sequential tunneling regime. The device consists of two external leads and one or two islands as the central part, connected to the leads by tunneling barriers. External gates are additionally attached to the islands. Generally, the two external electrodes and the islands can be ferromagnetic with arbitrary orientation of the corresponding magnetic moments. We have carried out detailed theoretical analysis of the current-voltage characteristics and spin-valve magnetoresistance in the limit of fast spin relaxation on the islands. Asymmetry in tunneling probabilities of spin-majority and spin-minority electrons leads to interesting features in the transport characteristics, like for instance magnetoresistance oscillations with the bias and gate voltages, negative differential resistance, and others

  7. Genetics of bipolar disorder

    OpenAIRE

    Kerner, Berit

    2014-01-01

    Berit Kerner Semel Institute for Neuroscience and Human Behavior, University of California, Los Angeles, Los Angeles, CA, USA Abstract: Bipolar disorder is a common, complex genetic disorder, but the mode of transmission remains to be discovered. Many researchers assume that common genomic variants carry some risk for manifesting the disease. The research community has celebrated the first genome-wide significant associations between common single nucleotide polymorphisms (SNPs) and bipolar ...

  8. [Antidepressants in bipolar disorder].

    Science.gov (United States)

    Courtet, P; Samalin, L; Olié, E

    2011-12-01

    Whereas mania defines the bipolar disorder, depression is the major challenge of treatment. In general, depressions are more frequent, longer, with a major prognostic impact in terms of disability and suicide. How should we treat a patient with bipolar depression? Antidepressants are the treatment of choice for depression, but not in the bipolar disorder. In this context, we have traditionally accepted that antidepressants are effective but they were inducing a significant risk of destabilization of the bipolar disorder, because of the transitions to mania and rapid cycling. Current data reconsider both the two aspects of this risk-benefit ratio. The effectiveness of antidepressants finally seems very limited, especially after the more recent studies with a robust methodology. Manic switches and rapid cycling may not be increased, particularly with new antidepressants and mood stabilizer combinations. The current literature reminds us that these course's modalities are inherent to the disease, with numerous risk factors, and among them, exposure to antidepressants. Who are the bipolar patients who only get the benefits of antidepressant treatment? Research will tell. They are in any case limited. How to navigate in our treatment strategies ? By choosing first drugs that demonstrated efficacy in bipolar depression. When the situation is more complex, "primum non nocere" should lead to support the prescription of the antidepressant in association with mood stabilizer. Copyright © 2011 L’Encéphale. Published by Elsevier Masson SAS.. All rights reserved.

  9. Impedance of the single-electron transistor at radio-frequencies

    International Nuclear Information System (INIS)

    Ciccarelli, C; Ferguson, A J

    2011-01-01

    We experimentally characterize the impedance of a single-electron transistor (SET) at an excitation frequency comparable to the electron tunnel rate. In contrast to usual radio-frequency-SET operations, the excitation signal is applied to the gate of the device. At zero source-drain bias, the SET displays both resistive (Sisyphus resistance) and reactive (tunnelling capacitance) components to its impedance. We study the bias dependence of the complex impedance, investigating its response as the electron tunnel rate becomes large with respect to the driving frequency. The experimental data are compared with values calculated from a master equation model.

  10. Impedance of the single-electron transistor at radio-frequencies

    Science.gov (United States)

    Ciccarelli, C.; Ferguson, A. J.

    2011-09-01

    We experimentally characterize the impedance of a single-electron transistor (SET) at an excitation frequency comparable to the electron tunnel rate. In contrast to usual radio-frequency-SET operations, the excitation signal is applied to the gate of the device. At zero source-drain bias, the SET displays both resistive (Sisyphus resistance) and reactive (tunnelling capacitance) components to its impedance. We study the bias dependence of the complex impedance, investigating its response as the electron tunnel rate becomes large with respect to the driving frequency. The experimental data are compared with values calculated from a master equation model.

  11. Impedance of the single-electron transistor at radio-frequencies

    Energy Technology Data Exchange (ETDEWEB)

    Ciccarelli, C; Ferguson, A J, E-mail: cc538@cam.ac.uk, E-mail: ajf1006@cam.ac.uk [Cavendish Laboratory, University of Cambridge, J J Thomson Avenue, Cambridge CB3 0HE (United Kingdom)

    2011-09-15

    We experimentally characterize the impedance of a single-electron transistor (SET) at an excitation frequency comparable to the electron tunnel rate. In contrast to usual radio-frequency-SET operations, the excitation signal is applied to the gate of the device. At zero source-drain bias, the SET displays both resistive (Sisyphus resistance) and reactive (tunnelling capacitance) components to its impedance. We study the bias dependence of the complex impedance, investigating its response as the electron tunnel rate becomes large with respect to the driving frequency. The experimental data are compared with values calculated from a master equation model.

  12. Highly functional tunnelling devices integrated in 3D

    DEFF Research Database (Denmark)

    Wernersson, Lars-Erik; Lind, Erik; Lindström, Peter

    2003-01-01

    to adjust the peak voltage of certain peaks in a controlled fashion, which creates a highly functional tunnelling device. These results show the need for a strong interaction between the development of circuit models and processing technology to develop new nano-electronic devices and circuits. Copyright...... circuit in order to optimize the performance of the device. In addition to the tunnelling structure below the grating, these transistors may be integrated in 3D by the introduction of another tunnelling structure directly over the metal grating. In the integrated device structure, the gate acts...... simultaneously on both tunnelling structures and the obtained characteristics are the result of the interplay between the two tunnelling structures and the gate. An equivalent circuit model is developed and we show how this interaction influences the current-voltage characteristics. The gate may be used...

  13. Scalability and reliability issues of Ti/HfOx-based 1T1R bipolar RRAM: Occurrence, mitigation, and solution

    Science.gov (United States)

    Rahaman, Sk. Ziaur; Lee, Heng-Yuan; Chen, Yu-Sheng; Lin, Yu-De; Chen, Pang-Shiu; Chen, Wei-Su; Wang, Pei-Hua

    2017-05-01

    Scalability and reliability issues are the most dominant obstacle for the development of resistive switching memory (RRAM) technology. Owing to the excellent memory performance and process compatibility with current CMOS technology of Ti/HfOx-based filamentary type bipolar RRAM, its scalability and reliability issues have been investigated in this document. Towards this goal, we demonstrate that there exists a clear correlation between the transistor and memory cell, which ultimately limits the scaling in terms of operation current and size of the transistor as well and performance of the Ti/HfOx-based 1T1R bipolar RRAM. Due to the resemblance of switching behaviour between complementary resistive switching, i.e., CRS in a single memory stack, and bipolar resistive switching, the Ti/HfOx-based bipolar RRAM suffers from resistance pinning (RP) issues, whereas the minimum resistance during the 1st RESET operation always impeded below 20 kΩ; this occurs through the interaction between the transistor and memory cell during the FORMING process. However, a sufficiently lower FORMING voltage can mitigate the RP issue occurring in Ti/HfOx-based bipolar RRAM and an alternative Ta buffer layer over HfOx dielectrics is proposed to prevent the activation of self-CRS in the memory cell during the FORMING process.

  14. Simple and controlled single electron transistor based on doping modulation in silicon nanowires

    Science.gov (United States)

    Hofheinz, M.; Jehl, X.; Sanquer, M.; Molas, G.; Vinet, M.; Deleonibus, S.

    2006-10-01

    A simple and highly reproducible single electron transistor (SET) has been fabricated using gated silicon nanowires. The structure is a metal-oxide-semiconductor field-effect transistor made on silicon-on-insulator thin films. The channel of the transistor is the Coulomb island at low temperature. Two silicon nitride spacers deposited on each side of the gate create a modulation of doping along the nanowire that creates tunnel barriers. Such barriers are fixed and controlled, like in metallic SETs. The period of the Coulomb oscillations is set by the gate capacitance of the transistor and therefore controlled by lithography. The source and drain capacitances have also been characterized. This design could be used to build more complex SET devices.

  15. TRANSISTOR HIGH VOLTAGE POWER SUPPLY

    Science.gov (United States)

    Driver, G.E.

    1958-07-15

    High voltage, direct current power supplies are described for use with battery powered nuclear detection equipment. The particular advantages of the power supply described, are increased efficiency and reduced size and welght brought about by the use of transistors in the circuit. An important feature resides tn the employment of a pair of transistors in an alternatefiring oscillator circuit having a coupling transformer and other circuit components which are used for interconnecting the various electrodes of the transistors.

  16. Organic electrochemical transistors

    KAUST Repository

    Rivnay, Jonathan

    2018-01-16

    Organic electrochemical transistors (OECTs) make effective use of ion injection from an electrolyte to modulate the bulk conductivity of an organic semiconductor channel. The coupling between ionic and electronic charges within the entire volume of the channel endows OECTs with high transconductance compared with that of field-effect transistors, but also limits their response time. The synthetic tunability, facile deposition and biocompatibility of organic materials make OECTs particularly suitable for applications in biological interfacing, printed logic circuitry and neuromorphic devices. In this Review, we discuss the physics and the mechanism of operation of OECTs, focusing on their identifying characteristics. We highlight organic materials that are currently being used in OECTs and survey the history of OECT technology. In addition, form factors, fabrication technologies and applications such as bioelectronics, circuits and memory devices are examined. Finally, we take a critical look at the future of OECT research and development.

  17. Mesoscopic photon heat transistor

    DEFF Research Database (Denmark)

    Ojanen, T.; Jauho, Antti-Pekka

    2008-01-01

    We show that the heat transport between two bodies, mediated by electromagnetic fluctuations, can be controlled with an intermediate quantum circuit-leading to the device concept of a mesoscopic photon heat transistor (MPHT). Our theoretical analysis is based on a novel Meir-Wingreen-Landauer-typ......We show that the heat transport between two bodies, mediated by electromagnetic fluctuations, can be controlled with an intermediate quantum circuit-leading to the device concept of a mesoscopic photon heat transistor (MPHT). Our theoretical analysis is based on a novel Meir......-Wingreen-Landauer-type of conductance formula, which gives the photonic heat current through an arbitrary circuit element coupled to two dissipative reservoirs at finite temperatures. As an illustration we present an exact solution for the case when the intermediate circuit can be described as an electromagnetic resonator. We discuss...

  18. Metatronic transistor amplifier

    Science.gov (United States)

    Chettiar, Uday K.; Engheta, Nader

    2015-10-01

    Utilizing the notion of metamaterials, in recent years the concept of a circuit and lumped circuit elements have been extended to the optical domains, providing the paradigm of optical metatronics, i.e., metamaterial-inspired optical nanocircuitry, as a powerful tool for design and study of more complex systems at the nanoscale. In this paper we present a design for a new metatronic element, namely, a metatronic transistor that functions as an amplifier. As shown by our analytical and numerical paper here, this metatronic transistor provides gain as well as isolation between the input and output ports of such two-port device. The cascadability and fan-out aspects of this element are also explored.

  19. Organic electrochemical transistors

    Science.gov (United States)

    Rivnay, Jonathan; Inal, Sahika; Salleo, Alberto; Owens, Róisín M.; Berggren, Magnus; Malliaras, George G.

    2018-02-01

    Organic electrochemical transistors (OECTs) make effective use of ion injection from an electrolyte to modulate the bulk conductivity of an organic semiconductor channel. The coupling between ionic and electronic charges within the entire volume of the channel endows OECTs with high transconductance compared with that of field-effect transistors, but also limits their response time. The synthetic tunability, facile deposition and biocompatibility of organic materials make OECTs particularly suitable for applications in biological interfacing, printed logic circuitry and neuromorphic devices. In this Review, we discuss the physics and the mechanism of operation of OECTs, focusing on their identifying characteristics. We highlight organic materials that are currently being used in OECTs and survey the history of OECT technology. In addition, form factors, fabrication technologies and applications such as bioelectronics, circuits and memory devices are examined. Finally, we take a critical look at the future of OECT research and development.

  20. Polarization induced doped transistor

    Science.gov (United States)

    Xing, Huili; Jena, Debdeep; Nomoto, Kazuki; Song, Bo; Zhu, Mingda; Hu, Zongyang

    2016-06-07

    A nitride-based field effect transistor (FET) comprises a compositionally graded and polarization induced doped p-layer underlying at least one gate contact and a compositionally graded and doped n-channel underlying a source contact. The n-channel is converted from the p-layer to the n-channel by ion implantation, a buffer underlies the doped p-layer and the n-channel, and a drain underlies the buffer.

  1. Depression and Bipolar Support Alliance

    Science.gov (United States)

    Depression and Bipolar Support Alliance Crisis Hotline Information Coping with a Crisis Suicide Prevention Information Psychiatric Hospitalization ... sign-up Education info, training, events Mood Disorders Depression Bipolar Disorder Anxiety Screening Center Co-occurring Illnesses/ ...

  2. Bipolar Affective Disorder and Migraine

    Directory of Open Access Journals (Sweden)

    Birk Engmann

    2012-01-01

    Full Text Available This paper consists of a case history and an overview of the relationship, aetiology, and treatment of comorbid bipolar disorder migraine patients. A MEDLINE literature search was used. Terms for the search were bipolar disorder bipolar depression, mania, migraine, mood stabilizer. Bipolar disorder and migraine cooccur at a relatively high rate. Bipolar II patients seem to have a higher risk of comorbid migraine than bipolar I patients have. The literature on the common roots of migraine and bipolar disorder, including both genetic and neuropathological approaches, is broadly discussed. Moreover, bipolar disorder and migraine are often combined with a variety of other affective disorders, and, furthermore, behavioural factors also play a role in the origin and course of the diseases. Approach to treatment options is also difficult. Several papers point out possible remedies, for example, valproate, topiramate, which acts on both diseases, but no first-choice treatments have been agreed upon yet.

  3. Analog/RF performance of two tunnel FETs with symmetric structures

    Science.gov (United States)

    Chen, Shupeng; Liu, Hongxia; Wang, Shulong; Li, Wei; Wang, Qianqiong

    2017-11-01

    In this paper, the radio frequency and analog performance of two tunnel field-effect transistors with symmetric structures are analyzed. The symmetric U-shape gate tunnel field-effect transistor (SUTFET) and symmetric tunnel field-effect transistor (STFET) are investigated by Silvaco Atlas simulation. The basic electrical properties and the parameters related to frequency and analog characteristics are analyzed. Due to the lower off-state leakage current, the STFET has better power consumption performance. The SUTFET obtains larger operating current (242 μA/μm), transconductance (490 μS/μm), output conductance (494 μS/μm), gain bandwidth product (3.2 GHz) and cut-off frequency (27.7 GHz). The simulation result of these two devices can be used as a guideline for their analog/RF applications.

  4. SPICE Simulation of tunnel FET aiming at 32 kHz crystal-oscillator operation

    OpenAIRE

    Tanamoto, Tetsufumi; Tanaka, Chika; Takaya, Satoshi; Koyama, Masato

    2017-01-01

    We numerically investigate the possibility of using Tunnel field-effect transistor (TFET) in a 32 kHz crystal oscillator circuit to reduce power consumption. A simulation using SPICE (Simulation Program with Integrated Circuit Emphasis) is carried out based on a conventional CMOS transistor model. It is shown that the power consumption of TFET is one-tenth that of conventional low-power CMOS.

  5. Reduction of Power Dissipation in Dynamic BiCMOS Logic Gates by Transistor Reordering

    Directory of Open Access Journals (Sweden)

    S. M. Rezaul Hasan

    2002-01-01

    Full Text Available This paper explores the deterministic transistor reordering in low-voltage dynamic BiCMOS logic gates, for reducing the dynamic power dissipation. The constraints of load driving (discharging capability and NPN turn-on delay for MOSFET reordered structures has been carefully considered. Simulations shows significant reduction in the dynamic power dissipation for the transistor reordered BiCMOS structures. The power-delay product figure-of-merit is found to be significantly enhanced without any associated silicon-area penalty. In order to experimentally verify the reduction in power dissipation, original and reordered structures were fabricated using the MOSIS 2 μm N-well analog CMOS process which has a P-base layer for bipolar NPN option. Measured results shows a 20% reduction in the power dissipation for the transistor reordered structure, which is in close agreement with the simulation.

  6. Depressive and bipolar disorders

    DEFF Research Database (Denmark)

    Kessing, Lars Vedel; Hansen, Hanne Vibe; Demyttenaere, Koen

    2005-01-01

    BACKGROUND: There is increasing evidence that attitudes and beliefs are important in predicting adherence to treatment and medication in depressive and bipolar disorders. However, these attitudes have received little study in patients whose disorders were sufficiently severe to require...... hospitalization. METHOD: The Antidepressant Compliance Questionnaire (ADCQ) was mailed to a large population of patients with depressive or bipolar disorder, representative of patients treated in hospital settings in Denmark. RESULTS: Of the 1005 recipients, 49.9% responded to the letter. A large proportion....... Moreover, their partners agreed on these negative views. Women had a more negative view of the doctor-patient relationship than men, and patients with a depressive disorder had a more negative view of antidepressants than patients with bipolar disorder. The number of psychiatric hospitalizations...

  7. High Gamma Ray Tolerance for 4H-SiC Bipolar Circuits

    Science.gov (United States)

    Suvanam, Sethu Saveda; Kuroki, Shin-Ichiro; Lanni, Luigia; Hadayati, Raheleh; Ohshima, Takeshi; Makino, Takahiro; Hallén, Anders; Zetterling, Carl-Mikael

    2017-02-01

    A high gamma radiation hardness of 4H-SiC circuits is performed. The OR NOR circuits are based on emitter coupled logic (ECL), using integrated bipolar NPN transistors. Gain degradation in individual bipolar junction transistors (BJT) is minimal up to a dose of 38 Mrad (SiO2), but for the dose of 332 Mrad (SiO2) a degradation of 52% is observed. The SiC BJTs show higher radiation hardness than existing Si-technology and high stability under temperature stress. It is proposed that the oxide charge-dominated recombination is the key base current recombination mechanism contributing to gain degradation. An improvement in the gain is seen after annealing at 400 °C for 1800 s due to the possible annealing of some of the oxide defects contributing to the oxide charge.

  8. Strain-enhanced tunneling magnetoresistance in MgO magnetic tunnel junctions.

    Science.gov (United States)

    Loong, Li Ming; Qiu, Xuepeng; Neo, Zhi Peng; Deorani, Praveen; Wu, Yang; Bhatia, Charanjit S; Saeys, Mark; Yang, Hyunsoo

    2014-09-30

    While the effects of lattice mismatch-induced strain, mechanical strain, as well as the intrinsic strain of thin films are sometimes detrimental, resulting in mechanical deformation and failure, strain can also be usefully harnessed for applications such as data storage, transistors, solar cells, and strain gauges, among other things. Here, we demonstrate that quantum transport across magnetic tunnel junctions (MTJs) can be significantly affected by the introduction of controllable mechanical strain, achieving an enhancement factor of ~2 in the experimental tunneling magnetoresistance (TMR) ratio. We further correlate this strain-enhanced TMR with coherent spin tunneling through the MgO barrier. Moreover, the strain-enhanced TMR is analyzed using non-equilibrium Green's function (NEGF) quantum transport calculations. Our results help elucidate the TMR mechanism at the atomic level and can provide a new way to enhance, as well as tune, the quantum properties in nanoscale materials and devices.

  9. Low sub-threshold swing realization with contacts of graphene/h-BN/MoS2 heterostructures in MoS2 transistors

    Science.gov (United States)

    Li, Chao; Yan, Xiao; Bao, Wenzhong; Ding, Shijin; Zhang, David Wei; Zhou, Peng

    2017-11-01

    MoS2 and other atomically thin-layered semiconductors have attracted intensive interest for their unique characteristics and have become promising candidates for short-channel transistor devices. In this work, we demonstrate an MoS2 transistor with a graphene/hBN/MoS2 heterostructure contact so as to achieve a low sub-threshold swing (SS) and expand the scope of the drain current with a low SS. By inserting an h-BN tunneling layer between graphene and MoS2, the carrier transport with a tunneling effect across h-BN makes the transistor exhibit a less than 80 mV/dec sub-threshold swing over 4 orders of magnitude of the drain current at room temperature. Meanwhile, the MoS2 transistor achieves a maximum on/off ratio of ˜107, and the heterostructure contact shows fairly good ohmic characteristics. Furthermore, the thickness of the h-BN tunneling layer in the heterostructure is optimized, which is essential for the tunneling current and the performance of an MoS2 transistor. This study of an MoS2 transistor based on a graphene/h-BN/MoS2 heterostructure contact may pave the way for the development of thin-layered semiconductors in low-power electronic applications.

  10. Atypical transistor-based chaotic oscillators: Design, realization, and diversity

    Science.gov (United States)

    Minati, Ludovico; Frasca, Mattia; OświÈ©cimka, Paweł; Faes, Luca; DroŻdŻ, Stanisław

    2017-07-01

    In this paper, we show that novel autonomous chaotic oscillators based on one or two bipolar junction transistors and a limited number of passive components can be obtained via random search with suitable heuristics. Chaos is a pervasive occurrence in these circuits, particularly after manual adjustment of a variable resistor placed in series with the supply voltage source. Following this approach, 49 unique circuits generating chaotic signals when physically realized were designed, representing the largest collection of circuits of this kind to date. These circuits are atypical as they do not trivially map onto known topologies or variations thereof. They feature diverse spectra and predominantly anti-persistent monofractal dynamics. Notably, we recurrently found a circuit comprising one resistor, one transistor, two inductors, and one capacitor, which generates a range of attractors depending on the parameter values. We also found a circuit yielding an irregular quantized spike-train resembling some aspects of neural discharge and another one generating a double-scroll attractor, which represent the smallest known transistor-based embodiments of these behaviors. Through three representative examples, we additionally show that diffusive coupling of heterogeneous oscillators of this kind may give rise to complex entrainment, such as lag synchronization with directed information transfer and generalized synchronization. The replicability and reproducibility of the experimental findings are good.

  11. Carpal Tunnel Syndrome

    Science.gov (United States)

    ... a passing cramp? It could be carpal tunnel syndrome. The carpal tunnel is a narrow passageway of ... three times more likely to have carpal tunnel syndrome than men. Early diagnosis and treatment are important ...

  12. Low Temperature Characterization of PMOS-type Gate-all-around Silicon nanowire FETs as single-hole-transistors

    Science.gov (United States)

    Hong, B. H.; Hwang, S. W.; Lee, Y. Y.; Son, M. H.; Ahn, D.; Cho, K. H.; Yeo, K. H.; Kim, D.-W.; Jin, G. Y.; Park, D.

    2011-12-01

    We report the single hole tunneling characteristics observed from a PMOS-type gate-all-around silicon nanowire field-effect-transistor with the radius 5 nm and the length 44 nm. The total capacitance of the quantum dot obtained from the measured Coulomb oscillations and Coulomb diamonds matches with the ideal capacitance of the silicon cylinder. It suggests that the observed single hole tunneling is originated from the fabricated structure.

  13. Spin Hall effect transistor

    Czech Academy of Sciences Publication Activity Database

    Wunderlich, Joerg; Park, B.G.; Irvine, A.C.; Zarbo, Liviu; Rozkotová, E.; Němec, P.; Novák, Vít; Sinova, Jairo; Jungwirth, Tomáš

    2010-01-01

    Roč. 330, č. 6012 (2010), s. 1801-1804 ISSN 0036-8075 R&D Projects: GA AV ČR KAN400100652; GA MŠk LC510 EU Projects: European Commission(XE) 215368 - SemiSpinNet Grant - others:AV ČR(CZ) AP0801 Program:Akademická prémie - Praemium Academiae Institutional research plan: CEZ:AV0Z10100521 Keywords : spin Hall effect * spintronics * spin transistor Subject RIV: BM - Solid Matter Physics ; Magnetism Impact factor: 31.364, year: 2010

  14. Schottky bipolar I-MOS: An I-MOS with Schottky electrodes and an open-base BJT configuration for reduced operating voltage

    Science.gov (United States)

    Kannan, N.; Kumar, M. Jagadesh

    2017-04-01

    In this paper, we have proposed a novel impact ionization MOS (I-MOS) structure, called the Schottky bipolar I-MOS, with Schottky source and drain electrodes and utilizing the open-base bipolar junction transistor (BJT) configuration for achieving reduction in the operating voltage of the I-MOS transistor. We report, using 2-D simulations, a low operating voltage (∼1.1 V) and a low subthreshold swing (∼3.6 mV/Decade). For the corresponding p-i-n I-MOS, the operating voltage is ∼5.5 V. The operating voltage of the Schottky bipolar I-MOS is the lowest reported operating voltage for silicon based I-MOS transistors. The nearly 80% reduction in the operating voltage of the Schottky bipolar I-MOS makes it suitable for applications requiring low operating voltages. The Schottky bipolar I-MOS is also expected to have an improved reliability over the p-i-n I-MOS since high energy carriers, induced by impact ionization near the drain, do not have to pass under the gate region in the channel. The use of Schottky contacts instead of heavily doped source and drain regions and the low channel doping level reduces the required thermal budget for device fabrication. The low operating voltage, low subthreshold swing and possibly improved reliability of the Schottky bipolar I-MOS, makes it a potential solution for applications where steep subthreshold slope transistors are being explored as alternative to the conventional MOS transistor.

  15. Direct coupled amplifiers using field effect transistors

    International Nuclear Information System (INIS)

    Fowler, E.P.

    1964-03-01

    The concept of the uni-polar field effect transistor (P.E.T.) was known before the invention of the bi-polar transistor but it is only recently that they have been made commercially. Being produced as yet only in small quantities, their price imposes a restriction on use to circuits where their peculiar properties can be exploited to the full. One such application is described here where the combination of low voltage drift and relatively low input leakage current are necessarily used together. One of the instruments used to control nuclear reactors has a logarithmic response to the mean output current from a polarised ionisation chamber. The logarithmic signal is then differentiated electrically, the result being displayed on a meter calibrated to show the reactor divergence or doubling time. If displayed in doubling time the scale is calibrated reciprocally. Because of the wide range obtained in the logarithmic section and the limited supply voltage, an output of 1 volt per decade change in ionisation current is used. Differentiating this gives a current of 1.5 x 10 -8 A for p.s.D. (20 sec. doubling time) in the differentiating amplifier. To overcome some of the problems of noise due to statistical variations in input current, the circuit design necessitates a resistive path to ground at the amplifier input of 20 M.ohms. A schematic diagram is shown. 1. It is evident that a zero drift of 1% can be caused by a leakage current of 1.5 x 10 -10 A or an offset voltage of 3 mV at the amplifier input. Although the presently used electrometer valve is satisfactory from the point of view of grid current, there have been sudden changes in grid to grid voltage (the valve is a double triode) of up to 10 m.V. It has been found that a pair of F.E.T's. can be used to replace the electrometer valve so long as care is taken in correct balance of the two devices. An investigation has been made into the characteristics of some fourteen devices to see whether those with very

  16. Novel multiple criteria decision making methods based on bipolar neu trosophic sets and bipolar neutrosophic graphs

    OpenAIRE

    Muhammad Akram; Musavarah Sarwar

    2017-01-01

    In this research article, we present certain notions of bipolar neutrosophic graphs. We study the dominating and independent sets of bipolar neutrosophic graphs. We describe novel multiple criteria decision making methods based on bipolar neutrosophic sets and bipolar neutrosophic graphs.

  17. Dissipative tunneling and orthogonality catastrophe in molecular transistors

    DEFF Research Database (Denmark)

    Braig, S.; Flensberg, Karsten

    2004-01-01

    of the charge on the molecule to the vibrational modes of the environment has on the I-V characteristics. We find that, for comparable characteristic length scales of the van der Waals and electrostatic interaction of the molecule with the environmental vibrational modes, the I-V characteristics...... are qualitatively changed from what one would expect from orthogonality catastrophe and develop a steplike discontinuity at the onset of conduction. For the case of very different length scales, we recover dissipation consistent with modeling the electrostatic forces as an external influence on the system comprised...

  18. Double-gate-all-around tunnel field-effect transistor

    Science.gov (United States)

    Zhang, Wen-Hao; Li, Zun-Chao; Guan, Yun-He; Zhang, Ye-Fei

    2017-06-01

    Not Available Project supported by the National Natural Science Foundation of China (Grant Nos. 61176038 and 61474093), the Science and Technology Planning Project of Guangdong Province, China (Grant No. 2015A010103002), and the Technology Development Program of Shanxi Province, China (Grant No. 2016GY075).

  19. Effects of overheating in a single-electron transistor

    DEFF Research Database (Denmark)

    Korotkov, A. N.; Samuelsen, Mogens Rugholm; Vasenko, S. A.

    1994-01-01

    Heating of a single-electron transistor (SET) caused by the current flowing through it is considered. The current and the temperature increase should be calculated self-consistently taking into account various paths of the heat drain. Even if there is no heat drain from the central electrode...... of the SET due to transfer of phonons, the temperature of this electrode remains finite because electron tunneling decreases the temperature difference between the central and outer electrodes. Overheating effects can cause hysteresis in the I-V curve of the SET in the vicinity of the Coulomb blockade...

  20. Discrete bipolar universal integrals

    Czech Academy of Sciences Publication Activity Database

    Greco, S.; Mesiar, Radko; Rindone, F.

    2014-01-01

    Roč. 252, č. 1 (2014), s. 55-65 ISSN 0165-0114 R&D Projects: GA ČR GAP402/11/0378 Institutional support: RVO:67985556 Keywords : bipolar integral * universal integral * Choquet integral Subject RIV: BA - General Mathematics Impact factor: 1.986, year: 2014 http://library.utia.cas.cz/separaty/2014/E/mesiar-0432224.pdf