WorldWideScience

Sample records for substrate thermal resistance

  1. Thermal contact resistance of a particle on a substrate

    International Nuclear Information System (INIS)

    Tan, J.; Safa, H.; Bonin, B.

    1996-01-01

    It has been formerly established that field emission in RF cavities is mainly due to contamination by small micron size particles lying on the surface. When applying the RF field, these particles can melt and stick to the surface making it harder to get rid of them. In order to understand the thermal process involved, a crucial physical quantity is needed: the thermal contact resistance between the particle and the substrate. An experimental method is described to measure this quantity, with the use of a scanning electron microscope. By defocusing the beam of the SEM, one can get enough power deposited in one particle to melt it. The power level at which the particle melts gives the thermal contact resistance. Therefore, using the measured value, thermal calculations yield some hints for understanding the violent thermal processes observed in RF fields. (author)

  2. Thermal contact resistance of a particle on a substrate

    International Nuclear Information System (INIS)

    Tan, J.; Safa, H.; Bonin, B.

    1996-01-01

    It has been formerly established that field emission in RF cavities is mainly die to contamination by small micron size particles lying on the surface. When applying the RF field, these particles can melt and stick to the surface making it harder to get rid of them. In order to understand the thermal process involved, a crucial physical quantity is needed: the thermal contact resistance between the particle and the substrate. In the present paper, an experimental method is described to measure this quantity, with the use of a scanning electron microscope. By defocusing the beam of the SEM, one can get enough power deposited in one particle to melt it. The power level at which the particle melts gives the thermal contact resistance. Therefore, using the measured value, thermal calculations yield some hints for understanding the violent thermal processes observed in RF fields. (author)

  3. High-resolution and high-conductive electrode fabrication on a low thermal resistance flexible substrate

    International Nuclear Information System (INIS)

    Kang, Bongchul; Kno, Jinsung; Yang, Minyang

    2011-01-01

    Processes based on the liquid-state pattern transfer, like inkjet printing, have critical limitations including low resolution and low electrical conductivity when fabricating electrodes on low thermal resistance flexible substrates such as polyethylene terephthalate (PET). Those are due to the nonlinear transfer mechanism and the limit of the sintering temperature. Although the laser direct curing (LDC) of metallic inks is an alternative process to improve the resolution, it is also associated with the disadvantages of causing thermal damage to the polymer substrate. This paper suggests the laser induced pattern adhesion transfer method to fabricate electrodes of both high electrical conductivity and high resolution on a PET substrate. First, solid patterns are cost-effectively created by the LDC of the organometallic silver ink on a glass that is optically and thermally stable. The solid patterns sintered on the glass are transferred to the PET substrate by the photo-thermally generated adhesion force of the substrate. Therefore, we achieved electrodes with a minimum line width of 10 µm and a specific resistance of 3.6 μΩcm on the PET substrate. The patterns also showed high mechanical reliability

  4. High-resolution and high-conductive electrode fabrication on a low thermal resistance flexible substrate

    Science.gov (United States)

    Kang, Bongchul; Kno, Jinsung; Yang, Minyang

    2011-07-01

    Processes based on the liquid-state pattern transfer, like inkjet printing, have critical limitations including low resolution and low electrical conductivity when fabricating electrodes on low thermal resistance flexible substrates such as polyethylene terephthalate (PET). Those are due to the nonlinear transfer mechanism and the limit of the sintering temperature. Although the laser direct curing (LDC) of metallic inks is an alternative process to improve the resolution, it is also associated with the disadvantages of causing thermal damage to the polymer substrate. This paper suggests the laser induced pattern adhesion transfer method to fabricate electrodes of both high electrical conductivity and high resolution on a PET substrate. First, solid patterns are cost-effectively created by the LDC of the organometallic silver ink on a glass that is optically and thermally stable. The solid patterns sintered on the glass are transferred to the PET substrate by the photo-thermally generated adhesion force of the substrate. Therefore, we achieved electrodes with a minimum line width of 10 µm and a specific resistance of 3.6 μΩcm on the PET substrate. The patterns also showed high mechanical reliability.

  5. Interface thermal resistance of nanostructured FeCoCu film and Si substrate

    Science.gov (United States)

    Nikolaenko, Yuri M.; Medvedev, Yuri V.; Genenko, Yuri A.; Ghafari, Mohammad; Hahn, Horst

    2006-05-01

    Results of measurement of thermal resistance (RFS ) of film substrate interface of 10 nm (Fe1-x Cox )1-y Cuy film on Si substrate with 50 nm SiO2 sublayer are presented. The estimated magnitude is two orders greater then RFS of epitaxial manganite films on StTiO3 substrate with and without sublayer. The significant increase of RFS is explained by granular structure of film with average size of grain about 10 nm. In this case the additional thermal barier in the film-substrate interface is appeared. It provides the change of regime of phonons propagation from ballistic to diffusion one. The principle possibility of variation of RFS in wide range as a task of nanotechnology is discussed.

  6. Effect of substrate properties and thermal annealing on the resistivity of molybdenum thin films

    International Nuclear Information System (INIS)

    Schmid, U.; Seidel, H.

    2005-01-01

    In this study, the influence of substrate properties (e.g. roughness characteristics and chemical composition) on the electrical resistivity of evaporated molybdenum thin films is investigated as a function of varying parameters, such as film thickness (25-115 nm) and post-deposition annealing with temperatures up to T PDA = 900 deg. C. A thermally oxidized silicon wafer with very low surface roughness was used as one substrate type. In contrast, a low temperature co-fired ceramics substrate with a glass encapsulant printed in thick film technology is the representative for rough surface morphology. The electrical resistivity follows the prediction of the size effect up to T PDA = 600 deg. C independent of substrate nature. On the silicon-based substrate, the thickness-independent portion of the film resistivity ρ g in the 'as deposited' state is about 29 times higher than the corresponding bulk value for a mono-crystalline sample. Thin films of this refractory metal on the SiO 2 /Si substrate exhibit an average grain size of 4.9 nm and a negative temperature coefficient of resistivity (TCR). On the glass/ceramic-based substrate, however, ρ g is half the value as compared to that obtained on the SiO 2 /Si substrate and the TCR is positive

  7. The effect of Al intermediate layer on thermal resistance of EB-PVD yttria-stabilized zirconia coatings on titanium substrate

    Science.gov (United States)

    Panin, Alexey; Panin, Victor; Kazachenok, Marina; Shugurov, Artur; Sinyakova, Elena; Martynov, Sergey; Rusyaev, Andrey; Kasterov, Artur

    2017-12-01

    The yttria-stabilized zirconia coatings sprayed on titanium substrates by the electron beam physical vapor deposition were subjected to thermal annealing in air at 1000°C for 1, 30 and 60 min. The delamination and fracture of the coatings are studied by the scanning electron microscopy and X-ray diffraction. It is shown that a magnetron sputtered Al interlayer between the coating and the substrate considerably improves the thermal resistance of ceramic coatings.

  8. Composite plasma electrolytic oxidation to improve the thermal radiation performance and corrosion resistance on an Al substrate

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Donghyun [Department of Materials Science and Engineering, Pusan National University, Busan 46241 (Korea, Republic of); Sung, Dahye [Department of Materials Science and Engineering, Pusan National University, Busan 46241 (Korea, Republic of); Korea Institute of Industrial Technology (KITECH), Busan 46742 (Korea, Republic of); Lee, Junghoon [Department of Mechanical Engineering, Stevens Institute of Technology, Hoboken, NJ 07030 (United States); Kim, Yonghwan [Korea Institute of Industrial Technology (KITECH), Busan 46742 (Korea, Republic of); Chung, Wonsub, E-mail: wschung1@pusan.ac.kr [Department of Materials Science and Engineering, Pusan National University, Busan 46241 (Korea, Republic of)

    2015-12-01

    Highlights: • Composite plasma electrolytic oxidation was performed using dispersed CuO particles in convectional PEO electrolyte. • Thermal radiation performance and corrosion resistance were examined by FT-IR spectroscopy and electrochemical methods, respectively. • Deposited copper oxide on the surface of the Al substrate was enhanced the corrosion resistance and the emissivity compared with the conventional PEO. - Abstract: A composite plasma electrolytic oxidation (PEO) was performed for enhancing the thermal radiation performance and corrosion resistance on an Al alloy by dispersing cupric oxide (CuO) particles in a conventional PEO electrolyte. Cu-based oxides (CuO and Cu{sub 2}O) formed by composite PEO increased the emissivity of the substrate to 0.892, and made the surface being dark color, similar to a black body, i.e., an ideal radiator. In addition, the corrosion resistance was analyzed using potentio-dynamic polarization and electrochemical impedance spectroscopy tests in 3.5 wt.% NaCl aqueous solution. An optimum condition of 10 ampere per square decimeter (ASD) current density and 30 min processing time produced appropriate surface morphologies and coating thicknesses, as well as dense Cu- and Al-based oxides that constituted the coating layers.

  9. Kapitza thermal resistance studied by high-frequency photothermal radiometry

    International Nuclear Information System (INIS)

    Horny, Nicolas; Chirtoc, Mihai; Hamaoui, Georges; Fleming, Austin; Ban, Heng

    2016-01-01

    Kapitza thermal resistance is determined using high-frequency photothermal radiometry (PTR) extended for modulation up to 10 MHz. Interfaces between 50 nm thick titanium coatings and silicon or stainless steel substrates are studied. In the used configuration, the PTR signal is not sensitive to the thermal conductivity of the film nor to its optical absorption coefficient, thus the Kapitza resistance is directly determined from single thermal parameter fits. Results of thermal resistances show the significant influence of the nature of the substrate, as well as of the presence of free electrons at the interface.

  10. Thermal Shock Resistance of Stabilized Zirconia/Metal Coat on Polymer Matrix Composites by Thermal Spraying Process

    Science.gov (United States)

    Zhu, Ling; Huang, Wenzhi; Cheng, Haifeng; Cao, Xueqiang

    2014-12-01

    Stabilized zirconia/metal coating systems were deposited on the polymer matrix composites by a combined thermal spray process. Effects of the thicknesses of metal layers and ceramic layer on thermal shock resistance of the coating systems were investigated. According to the results of thermal shock lifetime, the coating system consisting of 20 μm Zn and 125 μm 8YSZ exhibited the best thermal shock resistance. Based on microstructure evolution, failure modes and failure mechanism of the coating systems were proposed. The main failure modes were the formation of vertical cracks and delamination in the outlayer of substrate, and the appearance of coating spallation. The residual stress, thermal stress and oxidation of substrate near the substrate/metal layer interface were responsible for coating failure, while the oxidation of substrate near the substrate/coating interface was the dominant one.

  11. Molecular dynamics study of interfacial thermal transport between silicene and substrates.

    Science.gov (United States)

    Zhang, Jingchao; Hong, Yang; Tong, Zhen; Xiao, Zhihuai; Bao, Hua; Yue, Yanan

    2015-10-07

    In this work, the interfacial thermal transport across silicene and various substrates, i.e., crystalline silicon (c-Si), amorphous silicon (a-Si), crystalline silica (c-SiO2) and amorphous silica (a-SiO2) are explored by classical molecular dynamics (MD) simulations. A transient pulsed heating technique is applied in this work to characterize the interfacial thermal resistance in all hybrid systems. It is reported that the interfacial thermal resistances between silicene and all substrates decrease nearly 40% with temperature from 100 K to 400 K, which is due to the enhanced phonon couplings from the anharmonicity effect. Analysis of phonon power spectra of all systems is performed to interpret simulation results. Contradictory to the traditional thought that amorphous structures tend to have poor thermal transport capabilities due to the disordered atomic configurations, it is calculated that amorphous silicon and silica substrates facilitate the interfacial thermal transport compared with their crystalline structures. Besides, the coupling effect from substrates can improve the interface thermal transport up to 43.5% for coupling strengths χ from 1.0 to 2.0. Our results provide fundamental knowledge and rational guidelines for the design and development of the next-generation silicene-based nanoelectronics and thermal interface materials.

  12. High resistivity ZnSe coated substrates for microstrip gas chambers

    International Nuclear Information System (INIS)

    Sudharsanan, R.; Greenwald, A.C.; Vakerlis, G.; Yoganathan, M.; Cho, H.S.; Kadyk, J.; Dubeau, J.; Dixit, M.

    1998-01-01

    Microstrip gas chambers (MSGCs) require substrates with sheet resistance in the range of 10 13 --10 16 ohms/square to eliminate polarization and surface charging effects between the electrodes. Thin films of II-VI semiconductors deposited on glass or plastic substrates are attractive for this application since bulk resistivity of these semiconductors vary in the range 10 9 --10 12 ohm-cm and films with good uniformity can be deposited over large-areas using inexpensive deposition techniques. In this paper, deposition, characterization, and fabrication of MSGCs using ZnSe thin films are reported for the first time. ZnSe thin films were deposited on glass and plastic substrates by thermal evaporation. Sheet resistance of ZnSe varied in the range of 10 15 to 10 16 ohms/square depending on the deposition conditions. A MSGC detector fabricated using a 0.5 microm thick ZnSe layer on glass substrate exhibited best values; gas gain of 25,000 and an energy resolution of about 16.7% FWHM at a gain of 1,080 for a 55 Fe source

  13. Aligned Carbon Nanotube Arrays Bonded to Solid Graphite Substrates: Thermal Analysis for Future Device Cooling Applications

    Directory of Open Access Journals (Sweden)

    Betty T. Quinton

    2018-05-01

    Full Text Available Carbon nanotubes (CNTs are known for high thermal conductivity and have potential use as nano-radiators or heat exchangers. This paper focuses on the thermal performance of carpet-like arrays of vertically aligned CNTs on solid graphite substrates with the idea of investigating their behavior as a function of carpet dimensions and predicting their performance as thermal interface material (TIM for electronic device cooling. Vertically aligned CNTs were grown on highly oriented pyrolytic graphite (HOPG substrate, which creates a robust and durable all-carbon hierarchical structure. The multi-layer thermal analysis approach using Netzsch laser flash analysis system was used to evaluate their performance as a function of carpet height, from which their thermal properties can be determined. It was seen that the thermal resistance of the CNT array varies linearly with CNT carpet height, providing a unique way of decoupling the properties of the CNT carpet from its interface. This data was used to estimate the thermal conductivity of individual multi-walled nanotube strands in this carpet, which was about 35 W/m-K. The influence of CNT carpet parameters (aerial density, diameter, and length on thermal resistance of the CNT carpet and its potential advantages and limitations as an integrated TIM are discussed.

  14. Direct growth of cerium oxide nanorods on diverse substrates for superhydrophobicity and corrosion resistance

    Science.gov (United States)

    Cho, Young Jun; Jang, Hanmin; Lee, Kwan-Soo; Kim, Dong Rip

    2015-06-01

    Superhydrophobic surfaces with anti-corrosion properties have attracted great interest in many industrial fields, particularly to enhance the thermal performance of offshore applications such as heat exchangers, pipelines, power plants, and platform structures. Nanostructures with hydrophobic materials have been widely utilized to realize superhydrophobicity of surfaces, and cerium oxide has been highlighted due to its good corrosion resistive and intrinsically hydrophobic properties. However, few studies of direct growth of cerium oxide nanostructures on diverse substrates have been reported. Herein we report a facile hydrothermal method to directly grow cerium oxide nanorods on diverse substrates, such as aluminum alloy, stainless steel, titanium, and silicon. Diverse substrates with cerium oxide nanorods exhibited superhydrophobicity with no hydrophobic modifiers on their surfaces, and showed good corrosion resistive properties in corrosive medium. We believe our method could pave the way for realization of scalable and sustainable corrosion resistive superhydrophobic surfaces in many industrial fields.

  15. Reduced thermal resistance in AlGaN/GaN multi-mesa-channel high electron mobility transistors

    Energy Technology Data Exchange (ETDEWEB)

    Asubar, Joel T., E-mail: joel@rciqe.hokudai.ac.jp; Yatabe, Zenji; Hashizume, Tamotsu [Research Center for Integrated Quantum Electronics (RCIQE) and Graduate School of Information Science and Technology, Hokkaido University, Sapporo (Japan); Japan Science and Technology Agency (JST), CREST, 102-0075 Tokyo (Japan)

    2014-08-04

    Dramatic reduction of thermal resistance was achieved in AlGaN/GaN Multi-Mesa-Channel (MMC) high electron mobility transistors (HEMTs) on sapphire substrates. Compared with the conventional planar device, the MMC HEMT exhibits much less negative slope of the I{sub D}-V{sub DS} curves at high V{sub DS} regime, indicating less self-heating. Using a method proposed by Menozzi and co-workers, we obtained a thermal resistance of 4.8 K-mm/W at ambient temperature of ∼350 K and power dissipation of ∼9 W/mm. This value compares well to 4.1 K-mm/W, which is the thermal resistance of AlGaN/GaN HEMTs on expensive single crystal diamond substrates and the lowest reported value in literature.

  16. A Method for testing the integrated thermal resistance of thermoelectric modules

    Science.gov (United States)

    Gao, Junling; Du, Qungui; Chen, Min

    2013-11-01

    The integrated thermal resistance (ITR) of thermoelectric modules (TEMs) is an important parameter that represents the thermal-conduction of ceramic substrates, copper conducting strips, and welding material used in the TEM as well as the thermal contact resistances between different materials. In this study, an accurate and practical test method is proposed for the ITR of TEMs according to thermoelectric heat transfer theory and the equivalent characteristics of heat flux through the cold and hot sides of TEMs in an open-circuit situation. By using such measurements and comparisons, it is verified that the measured ITR value in our mode is accurate and reliable. In particular this method accurately predicts the actual operating conditions of TEMs, in which TEMs are under certain mechanical pressure. It effectively solves the problem of thermal resistance extraction from operating TEMs and is of great significance in their analysis and optimization.

  17. Imposed Thermal Fatigue and Post-Thermal-Cycle Wear Resistance of Biomimetic Gray Cast Iron by Laser Treatment

    Science.gov (United States)

    Sui, Qi; Zhou, Hong; Zhang, Deping; Chen, Zhikai; Zhang, Peng

    2017-08-01

    The present study aims to create coupling biomimetic units on gray cast iron substrate by laser surface treatment (LST). LSTs for single-step (LST1) and two-step (LST2) processes, were carried out on gray cast iron in different media (air and water). Their effects on microstructure, thermal fatigue, and post-thermal-cycle wear (PTW) resistance on the specimens were studied. The tests were carried out to examine the influence of crack-resistance behavior as well as the biomimetic surface on its post-thermal-cycle wear behavior and different units, with different laser treatments for comparison. Results showed that LST2 enhanced the PTW behaviors of gray cast iron, which then led to an increase in its crack resistance. Among the treated cast irons, the one treated by LST2 in air showed the lowest residual stress, due to the positive effect of the lower steepness of the thermal gradient. Moreover, the same specimen showed the best PTW performance, due to its superior crack resistance and higher hardness as a result of it.

  18. Thermal Stability of Copper-Aluminum Alloy Thin Films for Barrierless Copper Metallization on Silicon Substrate

    Science.gov (United States)

    Wang, C. P.; Dai, T.; Lu, Y.; Shi, Z.; Ruan, J. J.; Guo, Y. H.; Liu, X. J.

    2017-08-01

    Copper thin films with thickness of about 500 nm doped with different aluminum concentrations have been prepared by magnetron sputtering on Si substrate and their crystal structure, microstructure, and electrical resistivity after annealing at various temperatures (200°C to 600°C) for 1 h or at 400°C for different durations (1 h to 11 h) investigated by grazing-incidence x-ray diffraction (GIXRD) analysis, scanning electron microscopy (SEM), and four-point probe (FPP) measurements. Cu-1.8Al alloy thin film exhibited good thermal stability and low electrical resistivity (˜5.0 μΩ cm) after annealing at 500°C for 1 h or 400°C for 7 h. No copper silicide was observed at the Cu-Al/Si interface by GIXRD analysis or SEM for this sample. This result indicates that doping Cu thin film with small amounts of Al can achieve high thermal stability and low electrical resistivity, suggesting that Cu-1.8Al alloy thin film could be used for barrierless Cu metallization on Si substrate.

  19. Thermal interaction between WC-Co coating and steel substrate in process of HVOF spraying

    International Nuclear Information System (INIS)

    Guilemany, J.M.; Sobolev, V.V.; Nutting, J.; Dong, Z.; Calero, J.A.

    1994-01-01

    The WC-Co powders can be used to produce good adhesive and wear resistant HVOF thermal spray coatings on steel and light alloys substrates. In order to understand the properties of this kind of coating, the phases which are present in the coatings and structure changes during post heat treatments have been investigated. Although the coating properties depend very much on the structure developed in the substrate-coating interfacial region it has not been yet investigated in detail. The present study is devoted to the experimental and theoretical analysis of this interfacial region. The structure characterization has been performed mainly through the use of transmission electron microscopy. To provide a theoretical investigation a realistic prediction model of the process has been developed and on its base the mathematical simulation of the substrate-coating thermal interaction has been undertaken

  20. Deposition of thermal and hot-wire chemical vapor deposition copper thin films on patterned substrates.

    Science.gov (United States)

    Papadimitropoulos, G; Davazoglou, D

    2011-09-01

    In this work we study the hot-wire chemical vapor deposition (HWCVD) of copper films on blanket and patterned substrates at high filament temperatures. A vertical chemical vapor deposition reactor was used in which the chemical reactions were assisted by a tungsten filament heated at 650 degrees C. Hexafluoroacetylacetonate Cu(I) trimethylvinylsilane (CupraSelect) vapors were used, directly injected into the reactor with the aid of a liquid injection system using N2 as carrier gas. Copper thin films grown also by thermal and hot-wire CVD. The substrates used were oxidized silicon wafers on which trenches with dimensions of the order of 500 nm were formed and subsequently covered with LPCVD W. HWCVD copper thin films grown at filament temperature of 650 degrees C showed higher growth rates compared to the thermally ones. They also exhibited higher resistivities than thermal and HWCVD films grown at lower filament temperatures. Thermally grown Cu films have very uniform deposition leading to full coverage of the patterned substrates while the HWCVD films exhibited a tendency to vertical growth, thereby creating gaps and incomplete step coverage.

  1. Thermal Diffusivity Measurement for Thermal Spray Coating Attached to Substrate Using Laser Flash Method

    Science.gov (United States)

    Akoshima, Megumi; Tanaka, Takashi; Endo, Satoshi; Baba, Tetsuya; Harada, Yoshio; Kojima, Yoshitaka; Kawasaki, Akira; Ono, Fumio

    2011-11-01

    Ceramic-based thermal barrier coatings are used as heat and wear shields of gas turbine blades. There is a strong need to evaluate the thermal conductivity of coating for thermal design and use. The thermal conductivity of a bulk material is obtained as the product of thermal diffusivity, specific heat capacity, and density above room temperature in many cases. Thermal diffusivity and thermal conductivity are unique for a given material because they are sensitive to the structure of the material. Therefore, it is important to measure them in each sample. However it is difficult to measure the thermal diffusivity and thermal conductivity of coatings because coatings are attached to substrates. In order to evaluate the thermal diffusivity of a coating attached to the substrate, we have examined the laser flash method with the multilayer model on the basis of the response function method. We carried out laser flash measurements in layered samples composed of a CoNiCrAlY bond coating and a 8YSZ top coating by thermal spraying on a Ni-based superalloy substrate. It was found that the procedure using laser flash method with the multilayer model is useful for the thermal diffusivity evaluation of a coating attached to a substrate.

  2. Assessment of thermal spray coatings for wear and abrasion resistance applications

    Science.gov (United States)

    Karode, Ishaan Nitin

    Thermal spray cermet and metallic coatings are extensively used for wear, abrasion and corrosion control in a variety of industries. The first part of the thesis focuses mainly on testing of sand erosion resistance of thermal spray coatings on carbon composites used in the manufacture of helicopter rotor blades. The test set-up employed is a sand blasting machine and is an effort to duplicate the in-flight conditions especially those encountered in hot arid conditions. The technique adopted follows the Department of Defence test method standard. Carbon Composites have excellent stiffness, strength and low weight/density. The strength to weight ratio is high. Hence, these are used in aerospace applications to a large extent. However, the biggest problem encountered with carbon composites is its low abrasion resistance as its surface is very weak. Hence, thermal spray coatings are used to improve the surface properties of CFRP. Zinc bond coats and WC-Co coatings were tested. However, high amount of thermal stresses were developed between the substrate and the coating due to large differences in the CTE's of the both, leading to high mass losses within two minutes and just 130 grams of sand sprayed on to the coatings with the sand blasting machine built; and hence the coatings with CC as a substrate could not qualify for the application. The second part of the thesis focuses on the assessment of different thermal spray coatings used for manufacture of mechanical seals in pumps and analyze the best coating material for the wear resistance application through detail quantification of material loss by block-on-ring test set-up. A machine based on Block-on-ring test set-up following ASTM G77 (Measurement of Adhesive wear resistance of thermal spray coatings) standards was built to duplicate the pump conditions. Thermally sprayed coated materials were tested in different conditions (Load, time, abrasive). WC-Co had the highest wear resistance (lower volume losses) and

  3. Direct growth of cerium oxide nanorods on diverse substrates for superhydrophobicity and corrosion resistance

    International Nuclear Information System (INIS)

    Cho, Young Jun; Jang, Hanmin; Lee, Kwan-Soo; Kim, Dong Rip

    2015-01-01

    Graphical abstract: - Highlights: • Cerium oxide nanorods were uniformly grown on diverse substrates. • Changes in growth conditions led to morphology evolution of cerium oxide nanostructures. • The grown cerium oxide nanostructures were single or poly crystalline. • Direct growth of cerium oxide nanorods made the diverse substrates superhydrophobic and anti-corrosive without any surface modifiers. - Abstract: Superhydrophobic surfaces with anti-corrosion properties have attracted great interest in many industrial fields, particularly to enhance the thermal performance of offshore applications such as heat exchangers, pipelines, power plants, and platform structures. Nanostructures with hydrophobic materials have been widely utilized to realize superhydrophobicity of surfaces, and cerium oxide has been highlighted due to its good corrosion resistive and intrinsically hydrophobic properties. However, few studies of direct growth of cerium oxide nanostructures on diverse substrates have been reported. Herein we report a facile hydrothermal method to directly grow cerium oxide nanorods on diverse substrates, such as aluminum alloy, stainless steel, titanium, and silicon. Diverse substrates with cerium oxide nanorods exhibited superhydrophobicity with no hydrophobic modifiers on their surfaces, and showed good corrosion resistive properties in corrosive medium. We believe our method could pave the way for realization of scalable and sustainable corrosion resistive superhydrophobic surfaces in many industrial fields

  4. Direct growth of cerium oxide nanorods on diverse substrates for superhydrophobicity and corrosion resistance

    Energy Technology Data Exchange (ETDEWEB)

    Cho, Young Jun; Jang, Hanmin; Lee, Kwan-Soo [School of Mechanical Engineering, Hanyang University, Seoul 133-791 (Korea, Republic of); Kim, Dong Rip, E-mail: dongrip@hanyang.ac.kr [School of Mechanical Engineering, Hanyang University, Seoul 133-791 (Korea, Republic of); Institute of Nano Science and Technology, Hanyang University, Seoul 133-791 (Korea, Republic of)

    2015-06-15

    Graphical abstract: - Highlights: • Cerium oxide nanorods were uniformly grown on diverse substrates. • Changes in growth conditions led to morphology evolution of cerium oxide nanostructures. • The grown cerium oxide nanostructures were single or poly crystalline. • Direct growth of cerium oxide nanorods made the diverse substrates superhydrophobic and anti-corrosive without any surface modifiers. - Abstract: Superhydrophobic surfaces with anti-corrosion properties have attracted great interest in many industrial fields, particularly to enhance the thermal performance of offshore applications such as heat exchangers, pipelines, power plants, and platform structures. Nanostructures with hydrophobic materials have been widely utilized to realize superhydrophobicity of surfaces, and cerium oxide has been highlighted due to its good corrosion resistive and intrinsically hydrophobic properties. However, few studies of direct growth of cerium oxide nanostructures on diverse substrates have been reported. Herein we report a facile hydrothermal method to directly grow cerium oxide nanorods on diverse substrates, such as aluminum alloy, stainless steel, titanium, and silicon. Diverse substrates with cerium oxide nanorods exhibited superhydrophobicity with no hydrophobic modifiers on their surfaces, and showed good corrosion resistive properties in corrosive medium. We believe our method could pave the way for realization of scalable and sustainable corrosion resistive superhydrophobic surfaces in many industrial fields.

  5. HIV-1 protease-substrate coevolution in nelfinavir resistance.

    Science.gov (United States)

    Kolli, Madhavi; Ozen, Ayşegül; Kurt-Yilmaz, Nese; Schiffer, Celia A

    2014-07-01

    Resistance to various human immunodeficiency virus type 1 (HIV-1) protease inhibitors (PIs) challenges the effectiveness of therapies in treating HIV-1-infected individuals and AIDS patients. The virus accumulates mutations within the protease (PR) that render the PIs less potent. Occasionally, Gag sequences also coevolve with mutations at PR cleavage sites contributing to drug resistance. In this study, we investigated the structural basis of coevolution of the p1-p6 cleavage site with the nelfinavir (NFV) resistance D30N/N88D protease mutations by determining crystal structures of wild-type and NFV-resistant HIV-1 protease in complex with p1-p6 substrate peptide variants with L449F and/or S451N. Alterations of residue 30's interaction with the substrate are compensated by the coevolving L449F and S451N cleavage site mutations. This interdependency in the PR-p1-p6 interactions enhances intermolecular contacts and reinforces the overall fit of the substrate within the substrate envelope, likely enabling coevolution to sustain substrate recognition and cleavage in the presence of PR resistance mutations. Resistance to human immunodeficiency virus type 1 (HIV-1) protease inhibitors challenges the effectiveness of therapies in treating HIV-1-infected individuals and AIDS patients. Mutations in HIV-1 protease selected under the pressure of protease inhibitors render the inhibitors less potent. Occasionally, Gag sequences also mutate and coevolve with protease, contributing to maintenance of viral fitness and to drug resistance. In this study, we investigated the structural basis of coevolution at the Gag p1-p6 cleavage site with the nelfinavir (NFV) resistance D30N/N88D protease mutations. Our structural analysis reveals the interdependency of protease-substrate interactions and how coevolution may restore substrate recognition and cleavage in the presence of protease drug resistance mutations. Copyright © 2014, American Society for Microbiology. All Rights Reserved.

  6. Thermal resistance measurement of In{sub 3}SbTe{sub 2} nanowires

    Energy Technology Data Exchange (ETDEWEB)

    Battaglia, J.L.; Saci, A.; De, I. [I2M Laboratory, University of Bordeaux, UMR CNRS 5295, Talence (France); Cecchini, R.; Cecchi, S.; Longo, M. [Laboratorio MDM, IMM-CNR, Unita di Agrate Brianza (Italy); Selmo, S.; Fanciulli, M. [Laboratorio MDM, IMM-CNR, Unita di Agrate Brianza (Italy); Dipartimento di Scienza dei Materiali, University of Milano Bicocca, Milano (Italy)

    2017-05-15

    The thermal resistance along the thickness of In{sub 3}SbTe{sub 2} crystalline nanowires was measured using the scanning thermal microscopy in 3ω mode. The nanowires were grown by metal organic vapor deposition, exploiting the VLS mechanism induced by Au metal-catalyst nanoparticles and harvested on a SiO{sub 2}/Si substrate. Two nanowires with different thickness (13 and 23 nm) were investigated. The thermal resistance of the nanowires was determined using two different approaches; the first one exploits the experimental data, whereas the second one is more sophisticated, since it involves a minimization procedure. Both methods led to comparable values of the thermal resistance along the transverse direction (thickness) of the nanowire. The obtained results were explained starting from the mean free path of phonons calculated in the In{sub 3}SbTe{sub 2} bulk. (copyright 2016 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  7. Development of a platinum resistance thermometer on the silicon substrate for phase change studies

    International Nuclear Information System (INIS)

    Cai, Qingjun; Chen, Ya-Chi; Tsai, Chialun; DeNatale, Jeffrey F

    2012-01-01

    Resistance temperature detectors are commonly used measurement sensors in heat transfer studies. In many resistance temperature detectors, the platinum resistance thermometer (PRT) is chemically stable, has a wide temperature measurement range and possesses high measurement accuracy. In phase change studies of carbon nanotubes, bi-porous structures for microelectronic thermal management, 100 nm thick PRTs are developed on silicon substrates with 10 nm titanium adhesive to achieve precise and interface-free temperature measurements. After an annealing at 375 °C, the PRT samples are calibrated at a temperature range from 20 to 180 °C. Measurement hysteresis of temperature appears in thermal cycles. Electrical resistance tends to become low during all heating periods, which establishes the maximum measurement deviation of 10 °C. Experimental results from two different thin-film PRTs indicate that accurate and repeatable temperature measurements can be achieved by either reducing heating speed or using data in the cooling period. (paper)

  8. Characterization of Co–Cr–Mo alloys after a thermal treatment for high wear resistance

    International Nuclear Information System (INIS)

    Balagna, C.; Spriano, S.; Faga, M.G.

    2012-01-01

    The cobalt–chromium–molybdenum alloys are characterized by a high resistance to wear and corrosion, as well as good mechanical properties, allowing their use in the substitution of hip and knee joints. Five alloys were used as substrates for a coating deposition by a thermal treatment in molten salts, as reported elsewhere, in order to form a tantalum‐rich coating on the sample surface, able to improve the biocompatibility and wear resistance of the materials. However, the temperature (970 °C), reached during this process, is considered critical for the phase transformation of the Co-based alloys. The aim of this work is the evaluation of the temperature effects on the structure, microstructure, mechanical and tribological properties of the considered substrates, after the removal of the coating by polishing. The substrates are characterized through X-ray diffraction (XRD), scanning electron microscopy with energy dispersion spectrometry (SEM-EDS) and profilometry. The mechanical behavior is evaluated by the macro- and micro-hardness and bending tests, whereas the tribological properties are analyzed through a ball on disc test. A comparison between the as-received alloys and thermal treated substrates is reported. The biocompatibility feature is not reported in this work. The substrate crystalline structure changed during the heat treatment, inducing the formation of the hexagonal cobalt phase and the decrement of the cubic one. This crystallographic modification does not seem to influence the tribological behavior of the substrates. On the contrary, it affects the strength and ductility of the substrates. - Highlights: ► Effect of a thermal treatment on different CoCrMo alloys suitable for hip and knee joint substitution. ► The temperature induced an increment in the amount of hexagonal phase and a change in the grain size. ► The increment of the hexagonal phase decreases the hardness of the substrates but not the tribological properties.

  9. Substrate system for spray forming

    Energy Technology Data Exchange (ETDEWEB)

    Chu, Men G. (Export, PA); Chernicoff, William P. (Harrisburg, PA)

    2002-01-01

    A substrate system for receiving a deposit of sprayed metal droplets including a movable outer substrate on which the sprayed metal droplets are deposited. The substrate system also includes an inner substrate disposed adjacent the outer substrate where the sprayed metal droplets are deposited on the outer substrate. The inner substrate includes zones of differing thermal conductivity to resist substrate layer porosity and to resist formation of large grains and coarse constituent particles in a bulk layer of the metal droplets which have accumulated on the outer substrate. A spray forming apparatus and associated method of spray forming a molten metal to form a metal product using the substrate system of the invention is also provided.

  10. Thermal resistance matrix representation of thermal effects and thermal design in multi-finger power heterojunction bipolar transistors

    Institute of Scientific and Technical Information of China (English)

    Jin Dong-Yue; Zhang Wan-Rong; Chen Liang; Fu Qiang; Xiao Ying; Wang Ren-Qing; Zhao Xin

    2011-01-01

    The thermal resistance matrix including self-heating thermal resistance and thermal coupling resistance is presented to describe the thermal effects of multi-finger power heterojunction bipolar transistors. The dependence of thermal resistance matrix on finger spacing is also investigated. It is shown that both self-heating thermal resistance and thermal coupling resistance are lowered by increasing the finger spacing, in which the downward dissipated heat path is widened and the heat flow from adjacent fingers is effectively suppressed. The decrease of self-heating thermal resistance and thermal coupling resistance is helpful for improving the thermal stability of power devices. Furthermore, with the aid of the thermal resistance matrix, a 10-finger power heterojunction bipolar transistor (HBT) with non-uniform finger spacing is designed for high thermal stability. The optimized structure can effectively lower the peak temperature while maintaining a uniformity of the temperature profile at various biases and thus the device effectively may operate at a higher power level.

  11. Thermal and Electrical Characterization of Alumina Substrate for Microelectronic Applications

    International Nuclear Information System (INIS)

    Ahmad, S.; Ibrahim, A.; Alias, R.; Shapee, S. M.; Ambak, Z.; Zakaria, S. Z.; Yahya, M. R.; Mat, A. F. A.

    2010-01-01

    This paper reports the effect of sintering temperature on thermal and electrical properties of alumina material as substrate for microelectronic devices. Alumina materials in the form of green sheet with 1 mm thickness were sintered at 1100 deg. C, 1300 deg. C and 1500 deg. C for about 20 hours using heating and cooling rates of 2 deg. C/min. The densities were measured using densitometer and the microstructures of the samples were analyzed using SEM micrographs. Meanwhile thermal and electrical properties of the samples were measured using flash method and impedance analyzer respectively. It was found that thermal conductivity and thermal diffusivity of the substrate increases as sintering temperature increases. It was found also that the dielectric constant of alumina substrate increases as the sintering temperature increases.

  12. Thermal and Electrical Characterization of Alumina Substrate for Microelectronic Applications

    Science.gov (United States)

    Ahmad, S.; Ibrahim, A.; Alias, R.; Shapee, S. M.; Ambak, Z.; Zakaria, S. Z.; Yahya, M. R.; Mat, A. F. A.

    2010-03-01

    This paper reports the effect of sintering temperature on thermal and electrical properties of alumina material as substrate for microelectronic devices. Alumina materials in the form of green sheet with 1 mm thickness were sintered at 1100° C, 1300° C and 1500° C for about 20 hours using heating and cooling rates of 2° C/min. The densities were measured using densitometer and the microstructures of the samples were analyzed using SEM micrographs. Meanwhile thermal and electrical properties of the samples were measured using flash method and impedance analyzer respectively. It was found that thermal conductivity and thermal diffusivity of the substrate increases as sintering temperature increases. It was found also that the dielectric constant of alumina substrate increases as the sintering temperature increases.

  13. Submerged Arc Stainless Steel Strip Cladding—Effect of Post-Weld Heat Treatment on Thermal Fatigue Resistance

    Science.gov (United States)

    Kuo, I. C.; Chou, C. P.; Tseng, C. F.; Lee, I. K.

    2009-03-01

    Two types of martensitic stainless steel strips, PFB-132 and PFB-131S, were deposited on SS41 carbon steel substrate by a three-pass submerged arc cladding process. The effects of post-weld heat treatment (PWHT) on thermal fatigue resistance and hardness were evaluated by thermal fatigue and hardness testing, respectively. The weld metal microstructure was investigated by utilizing optical microscopy, scanning electron microscopy (SEM) equipped with energy dispersive X-ray spectroscopy (EDS) and transmission electron microscopy (TEM). Results showed that, by increasing the PWHT temperature, hardness decreased but there was a simultaneous improvement in weldment thermal fatigue resistance. During tempering, carbide, such as (Fe, Cr)23C6, precipitated in the weld metals and molybdenum appeared to promote (Fe, Cr, Mo)23C6 formation. The precipitates of (Fe, Cr, Mo)23C6 revealed a face-centered cubic (FCC) structure with fine grains distributed in the microstructure, thereby effectively increasing thermal fatigue resistance. However, by adding nickel, the AC1 temperature decreased, causing a negative effect on thermal fatigue resistance.

  14. The anomalous low temperature resistivity of thermally evaporated α-Mn thin film

    International Nuclear Information System (INIS)

    Ampong, F.K.; Boakye, F.; Nkum, R.K.

    2010-01-01

    Electrical resistivity measurements have been carried out on thermally evaporated α-Mn thin film between 300 and 1.4 K using the van der Pauw four probe technique. The film was grown on a glass substrate held at a temperature of 373 K, in an ambient pressure of 5x10 -6 Torr. The results show a resistance minimum, a notable characteristic of α-Mn but at a (rather high) temperature of 194±1 K. Below the resistivity maximum which corresponds to 70 K, the resistivity drops by only 0.02 μΩm indicating a rather short range magnetic ordering. The low temperature results show a tendency towards saturation of the resistivity as the temperature approaches zero suggesting a Kondo scattering.

  15. The anomalous low temperature resistivity of thermally evaporated alpha-Mn thin film

    Energy Technology Data Exchange (ETDEWEB)

    Ampong, F.K., E-mail: kampxx@yahoo.co [Department of Physics, Kwame Nkrumah University of Science and Technology, Kumasi (Ghana); Boakye, F.; Nkum, R.K. [Department of Physics, Kwame Nkrumah University of Science and Technology, Kumasi (Ghana)

    2010-08-15

    Electrical resistivity measurements have been carried out on thermally evaporated alpha-Mn thin film between 300 and 1.4 K using the van der Pauw four probe technique. The film was grown on a glass substrate held at a temperature of 373 K, in an ambient pressure of 5x10{sup -6} Torr. The results show a resistance minimum, a notable characteristic of alpha-Mn but at a (rather high) temperature of 194+-1 K. Below the resistivity maximum which corresponds to 70 K, the resistivity drops by only 0.02 muOMEGAm indicating a rather short range magnetic ordering. The low temperature results show a tendency towards saturation of the resistivity as the temperature approaches zero suggesting a Kondo scattering.

  16. Review of prediction for thermal contact resistance

    Institute of Scientific and Technical Information of China (English)

    2010-01-01

    Theoretical prediction research on thermal contact resistance is reviewed in this paper. In general, modeling or simulating the thermal contact resistance involves several aspects, including the descriptions of surface topography, the analysis of micro mechanical deformation, and the thermal models. Some key problems are proposed for accurately predicting the thermal resistance of two solid contact surfaces. We provide a perspective on further promising research, which would be beneficial to understanding mechanisms and engineering applications of the thermal contact resistance in heat transport phenomena.

  17. Thermal Effect of Ceramic Substrate on Heat Distribution in Thermoelectric Generators

    DEFF Research Database (Denmark)

    Kolaei, Alireza Rezania; Rosendahl, Lasse

    2012-01-01

    in the heat sink, a parallel microchannel heat sink is applied to a real TEG. The focus of this study is a discussion of the temperature difference variation between the cold/hot sides of the TEG legs versus the variation of the thermal conductivity of the ceramic substrate and the thickness of the substrate...... that the temperature difference is affected remarkably by the pressure drops in the heat sink, the thermal conductivity of the ceramic substrate, and the thickness of the substrate on the hot side....

  18. Thermal stress in flexible interdigital transducers with anisotropic electroactive cellulose substrates

    Science.gov (United States)

    Yoon, Sean J.; Kim, Jung Woong; Kim, Hyun Chan; Kang, Jinmo; Kim, Jaehwan

    2017-12-01

    Thermal stress in flexible interdigital transducers a reliability concern in the development of flexible devices, which may lead to interface delamination, stress voiding and plastic deformation. In this paper, a mathematical model is presented to investigate the effect of material selections on the thermal stress in interdigital transducers. We modified the linear relationships in the composite materials theory with the effect of high curvature, anisotropic substrate and small substrate thickness. We evaluated the thermal stresses of interdigital transducers, fabricated with various electrodes, insulators and substrate materials for the comparison. The results show that, among various insulators, organic polymer developed the highest stress level while oxide showed the lowest stress level. Aluminium shows a higher stress level and curvature as an electrode than gold. As substrate materials, polyimide and electroactive cellulose show similar stress levels except the opposite sign convention to each other. Polyimide shows positive curvatures while electroactive cellulose shows negative curvatures, which is attributed to the stress and thermal expansion state of the metal/insulator composite. The results show that the insulator is found to be responsible for the confinement across the metal lines while the substrate is responsible for the confinement along the metal lines.

  19. Stress in film/substrate system due to diffusion and thermal misfit effects

    International Nuclear Information System (INIS)

    Shao Shanshan; Xuan Fuzhen; Wang Zhengdong; Tu Shantung

    2009-01-01

    The stress in film/substrate systems has been analysed taking into consideration the coupling effects of diffusion and thermal misfit within the framework of Fick's second law. The solution of diffusion-induced stress in a film/substrate system involving the thermal misfit stress feedback is developed. The effects of modulus ratios, diffusivity ratios, thickness ratios of the substrate and the film and the partial molar volume of the diffusing component on the stress distribution in the film/substrate system are then discussed with the help of the finite difference method. Results indicate that the stresses in the film/substrate system vary with diffusion time. Diffusion enhances the magnitudes of film stress when the thermal misfit stress is compressive in the film. Furthermore, the absolute values of stress in the film increase with the increasing modulus ratios of the substrate and film, while they reduce with the increasing partial molar volume of the diffusing component and the diffusivity ratio of the substrate and the film.

  20. SOI MESFETs on high-resistivity, trap-rich substrates

    Science.gov (United States)

    Mehr, Payam; Zhang, Xiong; Lepkowski, William; Li, Chaojiang; Thornton, Trevor J.

    2018-04-01

    The DC and RF characteristics of metal-semiconductor field-effect-transistors (MESFETs) on conventional CMOS silicon-on-insulator (SOI) substrates are compared to nominally identical devices on high-resistivity, trap-rich SOI substrates. While the DC transfer characteristics are statistically identical on either substrate, the maximum available gain at GHz frequencies is enhanced by ∼2 dB when using the trap-rich substrates, with maximum operating frequencies, fmax, that are approximately 5-10% higher. The increased fmax is explained by the reduced substrate conduction at GHz frequencies using a lumped-element, small-signal model.

  1. EVAPORATIVE DROPLETS IN ONE-COMPONENT FLUIDS DRIVEN BY THERMAL GRADIENTS ON SOLID SUBSTRATES

    KAUST Repository

    Xu, Xinpeng; Qian, Tiezheng

    2013-01-01

    A continuum hydrodynamic model is presented for one-component liquid-gas flows on nonisothermal solid substrates. Numerical simulations are carried out for evaporative droplets moving on substrates with thermal gradients. For droplets in one-component fluids on heated/cooled substrates, the free liquid-gas interfaces are nearly isothermal. Consequently, a thermal singularity occurs at the contact line while the Marangoni effect due to interfacial temperature variation is suppressed. Through evaporation/condensation near the contact line, the thermal singularity makes the contact angle increase with the increasing substrate temperature. Due to this effect, droplets will move toward the cold end on substrates with thermal gradients. The droplet migration velocity is found to be proportional to the change of substrate temperature across the droplet. It follows that for two droplets of different sizes on a substrate with temperature gradient, the larger droplet moves faster and will catch up with the smaller droplet ahead. As soon as they touch, they coalesce rapidly into an even larger droplet that will move even faster. © 2013 World Scientific Publishing Company.

  2. EVAPORATIVE DROPLETS IN ONE-COMPONENT FLUIDS DRIVEN BY THERMAL GRADIENTS ON SOLID SUBSTRATES

    KAUST Repository

    Xu, Xinpeng

    2013-03-20

    A continuum hydrodynamic model is presented for one-component liquid-gas flows on nonisothermal solid substrates. Numerical simulations are carried out for evaporative droplets moving on substrates with thermal gradients. For droplets in one-component fluids on heated/cooled substrates, the free liquid-gas interfaces are nearly isothermal. Consequently, a thermal singularity occurs at the contact line while the Marangoni effect due to interfacial temperature variation is suppressed. Through evaporation/condensation near the contact line, the thermal singularity makes the contact angle increase with the increasing substrate temperature. Due to this effect, droplets will move toward the cold end on substrates with thermal gradients. The droplet migration velocity is found to be proportional to the change of substrate temperature across the droplet. It follows that for two droplets of different sizes on a substrate with temperature gradient, the larger droplet moves faster and will catch up with the smaller droplet ahead. As soon as they touch, they coalesce rapidly into an even larger droplet that will move even faster. © 2013 World Scientific Publishing Company.

  3. Thermal singularity and droplet motion in one-component fluids on solid substrates with thermal gradients

    KAUST Repository

    Xu, Xinpeng

    2012-06-26

    Using a continuum model capable of describing the one-component liquid-gas hydrodynamics down to the contact line scale, we carry out numerical simulation and physical analysis for the droplet motion driven by thermal singularity. For liquid droplets in one-component fluids on heated or cooled substrates, the liquid-gas interface is nearly isothermal. Consequently, a thermal singularity occurs at the contact line and the Marangoni effect due to temperature gradient is suppressed. Through evaporation or condensation in the vicinity of the contact line, the thermal singularity makes the contact angle increase with the increasing substrate temperature. This effect on the contact angle can be used to move the droplets on substrates with thermal gradients. Our numerical results for this kind of droplet motion are explained by a simple fluid dynamical model at the droplet length scale. Since the mechanism for droplet motion is based on the change of contact angle, a separation of length scales is exhibited through a comparison between the droplet motion induced by a wettability gradient and that by a thermal gradient. It is shown that the flow field at the droplet length scale is independent of the statics or dynamics at the contact line scale.

  4. Thermal singularity and droplet motion in one-component fluids on solid substrates with thermal gradients

    KAUST Repository

    Xu, Xinpeng; Qian, Tiezheng

    2012-01-01

    Using a continuum model capable of describing the one-component liquid-gas hydrodynamics down to the contact line scale, we carry out numerical simulation and physical analysis for the droplet motion driven by thermal singularity. For liquid droplets in one-component fluids on heated or cooled substrates, the liquid-gas interface is nearly isothermal. Consequently, a thermal singularity occurs at the contact line and the Marangoni effect due to temperature gradient is suppressed. Through evaporation or condensation in the vicinity of the contact line, the thermal singularity makes the contact angle increase with the increasing substrate temperature. This effect on the contact angle can be used to move the droplets on substrates with thermal gradients. Our numerical results for this kind of droplet motion are explained by a simple fluid dynamical model at the droplet length scale. Since the mechanism for droplet motion is based on the change of contact angle, a separation of length scales is exhibited through a comparison between the droplet motion induced by a wettability gradient and that by a thermal gradient. It is shown that the flow field at the droplet length scale is independent of the statics or dynamics at the contact line scale.

  5. Patterning of metallic electrodes on flexible substrates for organic thin-film transistors using a laser thermal printing method

    International Nuclear Information System (INIS)

    Chen, Kun-Tso; Lin, Yu-Hsuan; Ho, Jeng-Rong; Chen, Chih-Kant; Liu, Sung-Ho; Liao, Jin-Long; Cheng, Hua-Chi

    2011-01-01

    We report on a laser thermal printing method for transferring patterned metallic thin films on flexible plastic substrates using a pulsed CO 2 laser. Aluminium and silver line patterns, with micrometre scale resolution on poly(ethylene terephthalate) substrates, are shown. The printed electrodes demonstrate good conductivity and fulfil the properties for bottom-contact organic thin-film transistors. In addition to providing the energy for transferring the film, the absorption of laser light results in a rise in the temperature of the film and the substrate. This also further anneals the film and softens the plastic substrate. Consequently, it is possible to obtain a film with better surface morphology and with its film thickness implanted in part into the plastic surface. This implantation reveals excellent characteristics in adhesion and flexure resistance. Being feasible to various substrates and executable at ambient temperatures renders this approach a potential alternative for patterning metallic electrodes.

  6. Thermally Stable, Piezoelectric and Pyroelectric Polymeric Substrates and Method Relating Thereto

    Science.gov (United States)

    Simpson, Joycelyn O. (Inventor); St.Clair, Terry L. (Inventor)

    1995-01-01

    Production of an electric voltage in response to mechanical excitation (piezoelectricity) or thermal excitation (pyroelectricity) requires a material to have a preferred dipole orientation in its structure. This preferred orientation or polarization occurs naturally in some crystals such as quartz and can be induced into some ceramic and polymeric materials by application of strong electric or mechanical fields. For some materials, a combination of mechanical and electrical orientation is necessary to completely polarize the material. The only commercially available piezoelectric polymer is poly(vinylidene fluoride) (PVF2). However, this polymer has material and process limitations which prohibit its use in numerous device applications where thermal stability is a requirement. By the present invention, thermally stable, piezoelectric and pyroelectric polymeric substrates were prepared from polymers having a softening temperature greater than 1000C. A metal electrode material is deposited onto the polymer substrate and several electrical leads are attached to it. The polymer substrate is heated in a low dielectric medium to enhance molecular mobility of the polymer chains. A voltage is then applied to the polymer substrate inducing polarization. The voltage is then maintained while the polymer substrate is cooled 'freezing in' the molecular orientation. The novelty of the invention resides in the process of preparing the piezoelectric and pyroelectric polymeric substrate. The nonobviousness of the invention is found in heating the polymeric substrate in a low dielectric medium while applying a voltage.

  7. Evaluation of thermal resistance constitution for packaged AlGaN/GaN high electron mobility transistors by structure function method

    International Nuclear Information System (INIS)

    Zhang Guang-Chen; Feng Shi-Wei; Zhou Zhou; Li Jing-Wan; Guo Chun-Sheng

    2011-01-01

    The evaluation of thermal resistance constitution for packaged AlGaN/GaN high electron mobility transistor (HEMT) by structure function method is proposed in this paper. The evaluation is based on the transient heating measurement of the AlGaN/GaN HEMT by pulsed electrical temperature sensitive parameter method. The extracted chip-level and package-level thermal resistances of the packaged multi-finger AlGaN/GaN HEMT with 400-μm SiC substrate are 22.5 K/W and 7.2 K/W respectively, which provides a non-invasive method to evaluate the chip-level thermal resistance of packaged AlGaN/GaN HEMTs. It is also experimentally proved that the extraction of the chip-level thermal resistance by this proposed method is not influenced by package form of the tested device and temperature boundary condition of measurement stage. (condensed matter: electronic structure, electrical, magnetic, and optical properties)

  8. FEM thermal and stress analysis of bonded GaN-on-diamond substrate

    Science.gov (United States)

    Zhai, Wenbo; Zhang, Jingwen; Chen, Xudong; Bu, Renan; Wang, Hongxing; Hou, Xun

    2017-09-01

    A three-dimensional thermal and stress analysis of bonded GaN on diamond substrate is investigated using finite element method. The transition layer thickness, thermal conductivity of transition layer, diamond substrate thickness and the area ratio of diamond and GaN are considered and treated appropriately in the numerical simulation. The maximum channel temperature of GaN is set as a constant value and its corresponding heat power densities under different conditions are calculated to evaluate the influences that the diamond substrate and transition layer have on GaN. The results indicate the existence of transition layer will result in a decrease in the heat power density and the thickness and area of diamond substrate have certain impact on the magnitude of channel temperature and stress distribution. Channel temperature reduces with increasing diamond thickness but with a decreasing trend. The stress is reduced by increasing diamond thickness and the area ratio of diamond and GaN. The study of mechanical and thermal properties of bonded GaN on diamond substrate is useful for optimal designs of efficient heat spreader for GaN HEMT.

  9. Microstructure, Tensile Adhesion Strength and Thermal Shock Resistance of TBCs with Different Flame-Sprayed Bond Coat Materials Onto BMI Polyimide Matrix Composite

    Science.gov (United States)

    Abedi, H. R.; Salehi, M.; Shafyei, A.

    2017-10-01

    In this study, thermal barrier coatings (TBCs) composed of different bond coats (Zn, Al, Cu-8Al and Cu-6Sn) with mullite top coats were flame-sprayed and air-plasma-sprayed, respectively, onto bismaleimide matrix composites. These polyimide matrix composites are of interest to replace PMR-15, due to concerns about the toxicity of the MDA monomer from which PMR-15 is made. The results showed that pores and cracks appeared at the bond coat/substrate interface for the Al-bonded TBC because of its high thermal conductivity and diffusivity resulting in transferring of high heat flux and temperature to the polymeric substrate during top coat deposition. The other TBC systems due to the lower conductivity and diffusivity of bonding layers could decrease the adverse thermal effect on the polymer substrate during top coat deposition and exhibited adhesive bond coat/substrate interfaces. The tensile adhesion test showed that the adhesion strength of the coatings to the substrate is inversely proportional to the level of residual stress in the coatings. However, the adhesion strength of Al bond-coated sample decreased strongly after mullite top coat deposition due to thermal damage at the bond coat/substrate interface. TBC system with the Cu-6Sn bond coat exhibited the best thermal shock resistance, while Al-bonded TBC showed the lowest. It was inferred that thermal mismatch stresses and oxidation of the bond coats were the main factors causing failure in the thermal shock test.

  10. Temperature-dependent thermal conductivity of flexible yttria-stabilized zirconia substrate via 3ω technique

    Energy Technology Data Exchange (ETDEWEB)

    Singh, Shivkant; Yarali, Milad; Mavrokefalos, Anastassios [Department of Mechanical Engineering, University of Houston, Houston, TX (United States); Shervin, Shahab [Materials Science and Engineering Program, University of Houston, Houston, TX (United States); Venkateswaran, Venkat; Olenick, Kathy; Olenick, John A. [ENrG Inc., Buffalo, NY (United States); Ryou, Jae-Hyun [Department of Mechanical Engineering, University of Houston, Houston, TX (United States); Materials Science and Engineering Program, University of Houston, Houston, TX (United States); Texas Center for Superconductivity, University of Houston (TcSUH), Houston, TX (United States)

    2017-10-15

    Thermal management in flexible electronic has proven to be challenging thereby limiting the development of flexible devices with high power densities. To truly enable the technological implementation of such devices, it is imperative to develop highly thermally conducting flexible substrates that are fully compatible with large-scale fabrication. Here, we present the thermal conductivity of state-of-the-art flexible yttria-stabilized zirconia (YSZ) substrates measured using the 3ω technique, which is already commercially manufactured via roll-to-roll technique. We observe that increasing the grain size increases the thermal conductivity of the flexible 3 mol.% YSZ, while the flexibility and transparency of the sample are hardly affected by the grain size enlargement. We exhibit thermal conductivity values of up to 4.16 Wm{sup -1}K {sup -1} that is at least 4 times higher than state-of-the-art polymeric flexible substrates. Phonon-hopping model (PHM) for granular material was used to fit the measured thermal conductivity and accurately define the thermal transport mechanism. Our results show that through grain size optimization, YSZ flexible substrates can be realized as flexible substrates, that pave new avenues for future novel application in flexible electronics through the utilization of both their ceramic structural flexibility and high heat dissipating capability. (copyright 2017 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  11. Analysis of the impact of thermal resistance of the roof on the performance of photovoltaic roof tiles

    Directory of Open Access Journals (Sweden)

    Kurz Dariusz

    2017-01-01

    Full Text Available The paper explores the issues related to the impact of thermal resistance of the roof on the electrical parameters of photovoltaic roof tiles. The methodology of determination of the thermal resistance and thermal transmittance factor was presented in accordance with the applicable legal regulations and standards. A test station was presented for the purpose of measurement of the parameters of photovoltaic roof tiles depending on the structure of the roof substrate. Detailed analysis of selected building components as well as their impact on the design thermal resistance factor and thermal transmittance factor was carried out. Results of our own studies, which indicated a relation between the type of the roof structure and the values of the electricity generated by photovoltaic tiles, were presented. Based on the calculations, it was concluded that the generated outputs in the respective constructions differ by maximum 6%. For cells with the highest temperature, the performance of the PV roof tiles on the respective roof constructions fell within the range between 0.4% and 1.2% (depending on the conducted measurement and amounted to 8.76% (in reference to 9.97% for roof tiles with the lowest temperature.

  12. Fabrication of carbon nanotube thermal interface material on aluminum alloy substrates with low pressure CVD

    Energy Technology Data Exchange (ETDEWEB)

    Gao, Z L; Zhang, K; Yuen, M M F, E-mail: megzl@ust.hk [Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong (Hong Kong)

    2011-07-01

    High quality vertically aligned carbon nanotube (VACNT) arrays have been synthesized on bulk Al alloy (Al6063) substrates with an electron-beam (E-beam) evaporated Fe catalyst using low pressure chemical vapor deposition (LPCVD). The pretreatment process of the catalyst was shown to play a critical role. This was studied comprehensively and optimized to repeatedly grow high quality VACNT arrays within a wide range of thicknesses of catalyst layer (2-11 nm) and acetylene (C{sub 2}H{sub 2}) flow rates (100-300 sccm). The thermal performance of the resulting VACNT arrays was evaluated. The minimum interfacial thermal resistance of the Si/VACNT/Al interfaces achieved so far is only 4 mm{sup 2} K W{sup -1}, and the average value is 14.6 mm{sup 2} K W{sup -1}.

  13. FEM thermal and stress analysis of bonded GaN-on-diamond substrate

    Directory of Open Access Journals (Sweden)

    Wenbo Zhai

    2017-09-01

    Full Text Available A three-dimensional thermal and stress analysis of bonded GaN on diamond substrate is investigated using finite element method. The transition layer thickness, thermal conductivity of transition layer, diamond substrate thickness and the area ratio of diamond and GaN are considered and treated appropriately in the numerical simulation. The maximum channel temperature of GaN is set as a constant value and its corresponding heat power densities under different conditions are calculated to evaluate the influences that the diamond substrate and transition layer have on GaN. The results indicate the existence of transition layer will result in a decrease in the heat power density and the thickness and area of diamond substrate have certain impact on the magnitude of channel temperature and stress distribution. Channel temperature reduces with increasing diamond thickness but with a decreasing trend. The stress is reduced by increasing diamond thickness and the area ratio of diamond and GaN. The study of mechanical and thermal properties of bonded GaN on diamond substrate is useful for optimal designs of efficient heat spreader for GaN HEMT.

  14. Experimental determination of fuel-cladding thermal contact resistance

    International Nuclear Information System (INIS)

    Maglic, K.; Zivotic, Z.

    1968-01-01

    Thermal resistance of the UO 2 fuel - Zr-2 cladding was measure by the same experimental apparatus which was used for measuring the thermal conductivity of ceramic fuel. Thermal resistance was measure for a series of heat flux values and the dependence of thermal resistance on the flux is given within in the range from 0.66 W/cm 2 to 13.3 W/cm 2 . The temperature drop on the contact surface was between 39 deg C and 181.7 deg C, proportional to the increase of the heat flux [sr

  15. Sol–gel derived solar selective coatings on SS 321 substrates for solar thermal applications

    Energy Technology Data Exchange (ETDEWEB)

    Subasri, R., E-mail: subasri@arci.res.in; Soma Raju, K.R.C.; Reddy, D.S.; Hebalkar, Neha Y.; Padmanabham, G.

    2016-01-01

    Sol–gel derived multilayered solar selective coatings were generated on AISI SS 321 substrates using Ag-TiO{sub 2} as the cermet layer, titania and silica as the dielectric layers with high and low refractive indices respectively. The phase compositions of the individual layers were independently confirmed using grazing angle incidence X-ray diffraction, which was corroborated by X-ray photoelectron spectroscopic analysis. Thickness of the layers was measured using variable angle spectroscopic ellipsometry. The solar absorbance was measured over the UV–Vis-NIR wavelength range. Thermal emissivity was determined using FTIR spectroscopic analysis. The durability of the coatings was ascertained using accelerated corrosion testing methods as well as by measuring the optical properties after thermal cycling experiments. The promising nature of hexavalent chrome-free, environmental friendly, multilayered solar selective coating was ascertained with respect to amenability to scale-up. - Highlights: • Sol–gel derived multilayered solar selective coatings developed on SS321 • Solar absorptance and thermal emittance at par with toxic chrome coating • Thermal stability and corrosion resistance of coatings studied • Coating performance found to be promising for large scale applications • Scale-up amenability investigated by coating generation on 1 m tubes.

  16. Sol–gel derived solar selective coatings on SS 321 substrates for solar thermal applications

    International Nuclear Information System (INIS)

    Subasri, R.; Soma Raju, K.R.C.; Reddy, D.S.; Hebalkar, Neha Y.; Padmanabham, G.

    2016-01-01

    Sol–gel derived multilayered solar selective coatings were generated on AISI SS 321 substrates using Ag-TiO_2 as the cermet layer, titania and silica as the dielectric layers with high and low refractive indices respectively. The phase compositions of the individual layers were independently confirmed using grazing angle incidence X-ray diffraction, which was corroborated by X-ray photoelectron spectroscopic analysis. Thickness of the layers was measured using variable angle spectroscopic ellipsometry. The solar absorbance was measured over the UV–Vis-NIR wavelength range. Thermal emissivity was determined using FTIR spectroscopic analysis. The durability of the coatings was ascertained using accelerated corrosion testing methods as well as by measuring the optical properties after thermal cycling experiments. The promising nature of hexavalent chrome-free, environmental friendly, multilayered solar selective coating was ascertained with respect to amenability to scale-up. - Highlights: • Sol–gel derived multilayered solar selective coatings developed on SS321 • Solar absorptance and thermal emittance at par with toxic chrome coating • Thermal stability and corrosion resistance of coatings studied • Coating performance found to be promising for large scale applications • Scale-up amenability investigated by coating generation on 1 m tubes

  17. Tungsten oxide thin films grown by thermal evaporation with high resistance to leaching

    Energy Technology Data Exchange (ETDEWEB)

    Correa, Diogo S. [Universidade Federal de Pelotas (UFPel), RS (Brazil). Centro de Ciencias Quimicas, Farmaceuticas e de Alimentos; Pazinato, Julia C.O.; Freitas, Mauricio A. de; Radtke, Claudio; Garcia, Irene T.S., E-mail: irene@iq.ufrgs.br [Universidade Federal do Rio Grande do Sul (UFRGS), Porto Alegre, RS (Brazil). Instituto de Quimica; Dorneles, Lucio S. [Universidade Federal de Santa Maria (UFSM), RS (Brazil). Centro de Ciencias Naturais e Exatas

    2014-05-15

    Tungsten oxides show different stoichiometries, crystal lattices and morphologies. These characteristics are important mainly when they are used as photocatalysts. In this work tungsten oxide thin films were obtained by thermal evaporation on (100) silicon substrates covered with gold and heated at 350 and 600 °C, with different deposition times. The stoichiometry of the films, morphology, crystal structure and resistance to leaching were characterized through X-ray photoelectron spectroscopy, micro-Raman spectroscopy, scanning and transmission electron microscopy, X-ray diffractometry, Rutherford backscattering spectrometry and O{sup 16} (α,α')O{sup 16} resonant nuclear reaction. Films obtained at higher temperatures show well-defined spherical nanometric structure; they are composed of WO{sub 3.1} and the presence of hydrated tungsten oxide was also observed. The major crystal structure observed is the hexagonal. Thin films obtained through thermal evaporation present resistance to leaching in aqueous media and excellent performance as photocatalysts, evaluated through the degradation of the methyl orange dye. (author)

  18. Natural printed silk substrate circuit fabricated via surface modification using one step thermal transfer and reduction graphene oxide

    Science.gov (United States)

    Cao, Jiliang; Huang, Zhan; Wang, Chaoxia

    2018-05-01

    Graphene conductive silk substrate is a preferred material because of its biocompatibility, flexibility and comfort. A flexible natural printed silk substrate circuit was fabricated by one step transfer of graphene oxide (GO) paste from transfer paper to the surface of silk fabric and reduction of the GO to reduced graphene oxide (RGO) using a simple hot press treatment. The GO paste was obtained through ultrasonic stirring exfoliation under low temperature, and presented excellent printing rheological properties at high concentration. The silk fabric was obtained a surface electric resistance as low as 12.15 KΩ cm-1, in the concentration of GO 50 g L-1 and hot press at 220 °C for 120 s. Though the whiteness and strength decreased with the increasing of hot press temperature and time slowly, the electric conductivity of RGO surface modification silk substrate improved obviously. The surface electric resistance of RGO/silk fabrics increased from 12.15 KΩ cm-1 to 18.05 KΩ cm-1, 28.54 KΩ cm-1 and 32.53 KΩ cm-1 after 10, 20 and 30 washing cycles, respectively. The results showed that the printed silk substrate circuit has excellent washability. This process requires no chemical reductant, and the reduction efficiency and reduction degree of GO is high. This time-effective and environmentally-friendly one step thermal transfer and reduction graphene oxide onto natural silk substrate method can be easily used to production of reduced graphene oxide (RGO) based flexible printed circuit.

  19. Characterization of active CMOS pixel sensors on high resistive substrate

    Energy Technology Data Exchange (ETDEWEB)

    Hirono, Toko; Hemperek, Tomasz; Huegging, Fabian; Krueger, Hans; Rymaszewski, Piotr; Wermes, Norbert [Physikalisches Institut, Universitaet Bonn, Bonn (Germany)

    2016-07-01

    Active CMOS pixel sensors are very attractive as radiation imaging pixel detector because they do not need cost-intensive fine pitch bump bonding. High radiation tolerance and time resolution are required to apply those sensors to upcoming particle physics experiments. To achieve these requirements, the active CMOS pixel sensors were developed on high resistive substrates. Signal charges are collected faster by drift in high resistive substrates than in standard low resistive substrates yielding also a higher radiation tolerance. A prototype of the active CMOS pixel sensor has been fabricated in the LFoundry 150 nm CMOS process on 2 kΩcm substrate. This prototype chip was thinned down to 300 μm and the backside has been processed and can contacted by an aluminum contact. The breakdown voltage is around -115 V, and the depletion width has been measured to be as large as 180 μm at a bias voltage of -110 V. Gain and noise of the readout circuitry agree with the designed values. Performance tests in the lab and test beam have been done before and after irradiation with X-rays and neutrons. In this presentation, the measurement results of the active CMOS prototype sensors are shown.

  20. UV Enhanced Oxygen Response Resistance Ratio of ZnO Prepared by Thermally Oxidized Zn on Sapphire Substrate

    Directory of Open Access Journals (Sweden)

    Cheng-Chang Yu

    2013-01-01

    Full Text Available ZnO thin film was fabricated by thermally oxidized Zn at 600°C for 1 h. A surface containing nanostructured dumbbell and lines was observed by scanning electron microscope (SEM. The ZnO resistor device was formed after the following Ti/Au metallization. The device resistance was characterized at different oxygen pressure environment in the dark and under ultraviolet (UV light illumination coming from the mercury lamp with a short pass filter. The resistance increases with the increase of oxygen pressure. The resistance decreases and response increases with the increase of light intensity. Models considering the barrier height variation caused by the adsorbed oxygen related species were used to explain these results. The UV light illumination technology shows an effective method to enhance the detection response for this ZnO resistor oxygen sensor.

  1. Carbon nanotube thermal interfaces and related applications

    Science.gov (United States)

    Hodson, Stephen L.

    The development of thermal interface materials (TIMs) is necessitated by the temperature drop across interfacing materials arising from macro and microscopic irregularities of their surfaces that constricts heat through small contact regions as well as mismatches in their thermal properties. Similar to other types of TIMs, CNT TIMs alleviate the thermal resistance across the interface by thermally bridging two materials together with cylindrical, high-aspect ratio, and nominally vertical conducting elements. Within the community of TIM engineers, the vision driving the development of CNT TIMs was born from measurements that revealed impressively high thermal conductivities of individual CNTs. This vision was then projected to efforts focused on packing many individual CNTs on a single substrate that efficiently conduct heat in parallel and ultimately through many contact regions at CNT-to-substrate contacts. This thesis encompasses a comprehensive investigation of the viability of carbon nanotube based thermal interface materials (CNT TIMs) to efficiently conduct heat across two contacting materials. The efforts in this work were initially devoted to engaging CNT TIMs with an opposing substrate using two bonding techniques. Using palladium hexadecanethiolate, Pd(SC16H35)2 the CNT ends were bonded to an opposing substrate (one-sided interface) or opposing CNT array (two-sided interface) to enhance contact conductance while maintaining a compliant joint. The palladium weld is particularly attractive for its mechanical stability at high temperatures. The engagement of CNT TIMs with an opposing substrate was also achieved by inserting a solder foil between the CNT TIM and opposing substrate and subsequently raising the temperature of the interface above the eutectic point of the solder foil. This bonding technique creates a strong weld that not only reduces the thermal resistance significantly but also minimizes the change in thermal resistance with an applied

  2. An investigation of heat transfer between a microcantilever and a substrate for improved thermal topography imaging

    International Nuclear Information System (INIS)

    Somnath, Suhas; King, William P

    2014-01-01

    This paper reports the numerical and experimental investigation of heat transfer from a heated microcantilever to a substrate and uses the resulting insights to improve thermal topography imaging. The cantilever sensitivity, defined as change in thermal signal due to changes in the topography height, is relatively constant for feature heights in the range 100–350 nm. Since the cantilever-substrate heat transfer is governed by thermal conduction through the air, the cantilever sensitivity is nearly constant across substrates of varying thermal conductivity. Surface features with lateral size larger than 2.5 μm can induce artifacts in the cantilever signal resulting in measurement errors as large as 28%. These artifacts arise from thermal conduction from the cantilever in the lateral direction, parallel to the surface. We show how these artifacts can be removed by accounting for this lateral conduction and removing it from the thermal signal. This technique reduces the measurement error by as much as 26%, can be applied to arbitrary substrate topographies, and can be scaled to arrays of heated cantilevers. These results could lead to improvements in nanometer-scale thermal measurements including scanning thermal microscopy and tip-based nanofabrication. (paper)

  3. Thermal detection mechanism of SiC based hydrogen resistive gas sensors

    Science.gov (United States)

    Fawcett, Timothy J.; Wolan, John T.; Lloyd Spetz, Anita; Reyes, Meralys; Saddow, Stephen E.

    2006-10-01

    Silicon carbide (SiC) resistive hydrogen gas sensors have been fabricated and tested. Planar NiCr contacts were deposited on a thin 3C-SiC epitaxial film grown on thin Si wafers bonded to polycrystalline SiC substrates. At 673K, up to a 51.75±0.04% change in sensor output current and a change in the device temperature of up to 163.1±0.4K were demonstrated in response to 100% H2 in N2. Changes in device temperature are shown to be driven by the transfer of heat from the device to the gas, giving rise to a thermal detection mechanism.

  4. A liquid aluminum corrosion resistance surface on steel substrate

    International Nuclear Information System (INIS)

    Wang Deqing; Shi Ziyuan; Zou Longjiang

    2003-01-01

    The process of hot dipping pure aluminum on a steel substrate followed by oxidation was studied to form a surface layer of aluminum oxide resistant to the corrosion of aluminum melt. The thickness of the pure aluminum layer on the steel substrate is reduced with the increase in temperature and time in initial aluminizing, and the thickness of the aluminum layer does not increase with time at given temperature when identical temperature and complete wetting occur between liquid aluminum and the substrate surface. The thickness of the Fe-Al intermetallic layer on the steel base is increased with increasing bath temperature and time. Based on the experimental data and the mathematics model developed by the study, a maximum exists in the thickness of the Fe-Al intermetallic at certain dipping temperature. X-ray diffraction (XRD) and energy dispersive X-ray (EDX) analysis reveals that the top portion of the steel substrate is composed of a thin layer of α-Al 2 O 3 , followed by a thinner layer of FeAl 3 , and then a much thicker one of Fe 2 Al 5 on the steel base side. In addition, there is a carbon enrichment zone in diffusion front. The aluminum oxide surface formed on the steel substrate is in perfect condition after corrosion test in liquid aluminum at 750 deg. C for 240 h, showing extremely good resistance to aluminum melt corrosion

  5. Effects of pressure and temperature on thermal contact resistance between different materials

    Directory of Open Access Journals (Sweden)

    Zhao Zhe

    2015-01-01

    Full Text Available To explore whether pressure and temperature can affect thermal contact resistance, we have proposed a new experimental approach for measurement of the thermal contact resistance. Taking the thermal contact resistance between phenolic resin and carbon-carbon composites, cuprum, and aluminum as the examples, the influence of the thermal contact resistance between specimens under pressure is tested by experiment. Two groups of experiments are performed and then an analysis on influencing factors of the thermal contact resistance is presented in this paper. The experimental results reveal that the thermal contact resistance depends not only on the thermal conductivity coefficient of materials, but on the interfacial temperature and pressure. Furthermore, the thermal contact resistance between cuprum and aluminum is more sensitive to pressure and temperature than that between phenolic resin and carbon-carbon composites.

  6. 40 CFR 91.427 - Catalyst thermal stress resistance evaluation.

    Science.gov (United States)

    2010-07-01

    ... 40 Protection of Environment 20 2010-07-01 2010-07-01 false Catalyst thermal stress resistance... Procedures § 91.427 Catalyst thermal stress resistance evaluation. (a)(1) The purpose of the evaluation procedure specified in this section is to determine the effect of thermal stress on catalyst conversion...

  7. 40 CFR 90.427 - Catalyst thermal stress resistance evaluation.

    Science.gov (United States)

    2010-07-01

    ... 40 Protection of Environment 20 2010-07-01 2010-07-01 false Catalyst thermal stress resistance... Gaseous Exhaust Test Procedures § 90.427 Catalyst thermal stress resistance evaluation. (a) The purpose of... catalyst conversion efficiency for Phase 1 engines. The thermal stress is imposed on the test catalyst by...

  8. Evaluation of Erosion Resistance of Advanced Turbine Thermal Barrier Coatings

    Science.gov (United States)

    Zhu, Dongming; Kuczmarski, Maria A.; Miller, Robert A.; Cuy, Michael D.

    2007-01-01

    The erosion resistant turbine thermal barrier coating system is critical to aircraft engine performance and durability. By demonstrating advanced turbine material testing capabilities, we will be able to facilitate the critical turbine coating and subcomponent development and help establish advanced erosion-resistant turbine airfoil thermal barrier coatings design tools. The objective of this work is to determine erosion resistance of advanced thermal barrier coating systems under simulated engine erosion and/or thermal gradient environments, validating advanced turbine airfoil thermal barrier coating systems based on nano-tetragonal phase toughening design approaches.

  9. Investigate the electrical and thermal properties of the low temperature resistant silver nanowire fabricated by two-beam laser technique

    Science.gov (United States)

    He, Gui-Cang; Dong, Xian-Zi; Liu, Jie; Lu, Heng; Zhao, Zhen-Sheng

    2018-05-01

    A two-beam laser fabrication technique is introduced to fabricate the single silver nanowire (AgNW) on polyethylene terephthalate (PET) substrate. The resistivity of the AgNW is (1.31 ± 0.05) × 10-7 Ω·m, which is about 8 times of the bulk silver resistivity (1.65 × 10-8 Ω·m). The AgNW electrical resistance is measured in temperature range of 10-300 K and fitted with the Bloch-Grüneisen formula. The fitting results show that the residue resistance is 153 Ω, the Debye temperature is 210 K and the electron-phonon coupling constant is (5.72 ± 0.24) × 10-8 Ω·m. Due to the surface scattering, the Debye temperature and the electron-phonon coupling constant are lower than those of bulk silver, and the residue resistance is bigger than that of bulk silver. Thermal conductivity of the single AgNW is calculated in the corresponding temperature range, which is the biggest at the temperature approaching the Debye temperature. The AgNW on PET substrate is the low temperature resistance material and is able to be operated stably at such a low temperature of 10 K.

  10. Aqueously Dispersed Silver Nanoparticle-Decorated Boron Nitride Nanosheets for Reusable, Thermal Oxidation-Resistant Surface Enhanced Raman Spectroscopy (SERS) Devices

    Science.gov (United States)

    Lin, Yi; Bunker, Christopher E.; Fernandos, K. A. Shiral; Connell, John W.

    2012-01-01

    The impurity-free aqueous dispersions of boron nitride nanosheets (BNNS) allowed the facile preparation of silver (Ag) nanoparticle-decorated BNNS by chemical reduction of an Ag salt with hydrazine in the presence of BNNS. The resultant Ag-BNNS nanohybrids remained dispersed in water, allowing convenient subsequent solution processing. By using substrate transfer techniques, Ag-BNNS nanohybrid thin film coatings on quartz substrates were prepared and evaluated as reusable surface enhanced Raman spectroscopy (SERS) sensors that were robust against repeated solvent washing. In addition, because of the unique thermal oxidation-resistant properties of the BNNS, the sensor devices may be readily recycled by short-duration high temperature air oxidation to remove residual analyte molecules in repeated runs. The limiting factor associated with the thermal oxidation recycling process was the Ostwald ripening effect of Ag nanostructures.

  11. The structure and thermal properties of plasma-sprayed beryllium for the International Thermonuclear Experimental Reactor (ITER)

    International Nuclear Information System (INIS)

    Castro, R.G.; Bartlett, A.; Elliott, K.E.; Hollis, K.J.

    1996-01-01

    Plasma spraying is being studied for in situ repair of damaged Be and W plasma facing surfaces for ITER, the next generation magnetic fusion energy device, and is also being considered for fabricating Be and W plasma-facing components for the first wall of ITER. Investigators at LANL's Beryllium Atomization and Thermal Spray Facility have concentrated on investigating the structure-property relation between as-deposited microstructures of plasma sprayed Be coatings and resulting thermal properties. In this study, the effect of initial substrate temperature on resulting thermal diffusivity of Be coatings and the thermal diffusivity at the coating/Be substrate interface (interface thermal resistance) was investigated. Results show that initial Be substrate temperatures above 600 C can improve the thermal diffusivity of the Be coatings and minimize any thermal resistance at the interface between the Be coating and Be substrate

  12. Modeling the electrical resistance of gold film conductors on uniaxially stretched elastomeric substrates

    Science.gov (United States)

    Cao, Wenzhe; Görrn, Patrick; Wagner, Sigurd

    2011-05-01

    The electrical resistance of gold film conductors on polydimethyl siloxane substrates at stages of uniaxial stretching is measured and modeled. The surface area of a gold conductor is assumed constant during stretching so that the exposed substrate takes up all strain. Sheet resistances are calculated from frames of scanning electron micrographs by numerically solving for the electrical potentials of all pixels in a frame. These sheet resistances agree sufficiently well with values measured on the same conductors to give credence to the model of a stretchable network of gold links defined by microcracks.

  13. Thermal resistance of Saccharomyces yeast ascospores in beers.

    Science.gov (United States)

    Milani, Elham A; Gardner, Richard C; Silva, Filipa V M

    2015-08-03

    The industrial production of beer ends with a process of thermal pasteurization. Saccharomyces cerevisiae and Saccharomyces pastorianus are yeasts used to produce top and bottom fermenting beers, respectively. In this research, first the sporulation rate of 12 Saccharomyces strains was studied. Then, the thermal resistance of ascospores of three S. cerevisiae strains (DSMZ 1848, DSMZ 70487, Ethanol Red(®)) and one strain of S. pastorianus (ATCC 9080) was determined in 4% (v/v) ethanol lager beer. D60 °C-values of 11.2, 7.5, 4.6, and 6.0 min and z-values of 11.7, 14.3, 12.4, and 12.7 °C were determined for DSMZ 1848, DSMZ 70487, ATCC 9080, and Ethanol Red(®), respectively. Lastly, experiments with 0 and 7% (v/v) beers were carried out to investigate the effect of ethanol content on the thermal resistance of S. cerevisiae (DSMZ 1848). D55 °C-values of 34.2 and 15.3 min were obtained for 0 and 7% beers, respectively, indicating lower thermal resistance in the more alcoholic beer. These results demonstrate similar spore thermal resistance for different Saccharomyces strains and will assist in the design of appropriate thermal pasteurization conditions for preserving beers with different alcohol contents. Copyright © 2015 Elsevier B.V. All rights reserved.

  14. Excimer laser sintering of indium tin oxide nanoparticles for fabricating thin films of variable thickness on flexible substrates

    International Nuclear Information System (INIS)

    Park, Taesoon; Kim, Dongsik

    2015-01-01

    Technology to fabricate electrically-conducting, transparent thin-film patterns on flexible substrates has possible applications in flexible electronics. In this work, a pulsed-laser sintering process applicable to indium tin oxide (ITO) thin-film fabrication on a substrate without thermal damage to the substrate was developed. A nanosecond pulsed laser was used to minimize thermal penetration into the substrate and to control the thickness of the sintered layer. ITO nanoparticles (NPs) of ~ 20 nm diameter were used to lower the process temperature by exploiting their low melting point. ITO thin film patterns were fabricated by first spin coating the NPs onto a surface, then sintering them using a KrF excimer laser. The sintered films were characterized using field emission scanning electron microscopy. The electrical resistivity and transparency of the film were measured by varying the process parameters. A single laser pulse could generate the polycrystalline structure (average grain size ~ 200 nm), reducing the electrical resistivity of the film by a factor of ~ 1000. The sintering process led to a minimum resistivity of 1.1 × 10 −4 Ω·m without losing the transparency of the film. The thickness of the sintered layer could be varied up to 150 nm by adjusting the laser fluence. Because the estimated thermal penetration depth in the ITO film was less than 200 nm, no thermal damage was observed in the substrate. This work suggests that the proposed process, combined with various particle deposition methods, can be an effective tool to form thin-film ITO patterns on flexible substrates. - Highlights: • Excimer laser sintering can fabricate ITO thin films on flexible substrates. • The laser pulse can form a polycrystalline structure without thermal damage. • The laser sintering process can reduce the electrical resistivity substantially. • The thickness of the sintered layer can be varied effectively

  15. Excimer laser sintering of indium tin oxide nanoparticles for fabricating thin films of variable thickness on flexible substrates

    Energy Technology Data Exchange (ETDEWEB)

    Park, Taesoon; Kim, Dongsik, E-mail: dskim87@postech.ac.kr

    2015-03-02

    Technology to fabricate electrically-conducting, transparent thin-film patterns on flexible substrates has possible applications in flexible electronics. In this work, a pulsed-laser sintering process applicable to indium tin oxide (ITO) thin-film fabrication on a substrate without thermal damage to the substrate was developed. A nanosecond pulsed laser was used to minimize thermal penetration into the substrate and to control the thickness of the sintered layer. ITO nanoparticles (NPs) of ~ 20 nm diameter were used to lower the process temperature by exploiting their low melting point. ITO thin film patterns were fabricated by first spin coating the NPs onto a surface, then sintering them using a KrF excimer laser. The sintered films were characterized using field emission scanning electron microscopy. The electrical resistivity and transparency of the film were measured by varying the process parameters. A single laser pulse could generate the polycrystalline structure (average grain size ~ 200 nm), reducing the electrical resistivity of the film by a factor of ~ 1000. The sintering process led to a minimum resistivity of 1.1 × 10{sup −4} Ω·m without losing the transparency of the film. The thickness of the sintered layer could be varied up to 150 nm by adjusting the laser fluence. Because the estimated thermal penetration depth in the ITO film was less than 200 nm, no thermal damage was observed in the substrate. This work suggests that the proposed process, combined with various particle deposition methods, can be an effective tool to form thin-film ITO patterns on flexible substrates. - Highlights: • Excimer laser sintering can fabricate ITO thin films on flexible substrates. • The laser pulse can form a polycrystalline structure without thermal damage. • The laser sintering process can reduce the electrical resistivity substantially. • The thickness of the sintered layer can be varied effectively.

  16. Effect of substrate type, dopant and thermal treatment on ...

    Indian Academy of Sciences (India)

    Effect of substrate type, dopant and thermal treatment on physicochemical properties of TiO2–SnO2 sol–gel films. I STAMBOLOVA. ∗. , V BLASKOV, S VASSILEV†, M SHIPOCHKA and A LOUKANOV‡. Institute of General and Inorganic Chemistry, †Institute of Electrochemistry and Energy Systems, BAS,. Acad. G. Bonchev ...

  17. Thermal Stability of Silver Paste Sintering on Coated Copper and Aluminum Substrates

    Science.gov (United States)

    Pei, Chun; Chen, Chuantong; Suganuma, Katsuaki; Fu, Guicui

    2018-01-01

    The thermal stability of silver (Ag) paste sintering on coated copper (Cu) and aluminum (Al) substrates has been investigated. Instead of conventional zincating or nickel plating, magnetron sputtering was used to achieve coating with titanium (Ti) and Ag. Silicon (Si) chips were bonded to coated Cu and Al substrates using a mixture of submicron Ag flakes and particles under 250°C and 0.4 MPa for 30 min. The joints were then subject to aging testing at 250°C for duration of 200 h, 500 h, and 1000 h. Two types of joints exhibited satisfactory initial shear strength above 45 MPa. However, the shear strength of the joints on Al substrate decreased to 28 MPa after 1000 h of aging, while no shear strength decline was detected for the joints on Cu substrate. Fracture surface analysis revealed that the vulnerable points of the two types of joints were (1) the Ag layer and (2) the interface between the Ti layer and Cu substrate. Based on the results of scanning electron microscopy (SEM), energy-dispersive x-ray spectroscopy (EDS), and simulations, cracks in the Ag layer were identified as the cause of the shear strength degradation in the joints on Al substrate. The interface evolution of the joints on Cu substrate was ascribed to Cu migration and discontinuity points that initialized in the Ti layer. This study reveals that Al exhibited superior thermal stability with sintered Ag paste.

  18. Rapid thermal process by RF heating of nano-graphene layer/silicon substrate structure: Heat explosion theory approach

    Science.gov (United States)

    Sinder, M.; Pelleg, J.; Meerovich, V.; Sokolovsky, V.

    2018-03-01

    RF heating kinetics of a nano-graphene layer/silicon substrate structure is analyzed theoretically as a function of the thickness and sheet resistance of the graphene layer, the dimensions and thermal parameters of the structure, as well as of cooling conditions and of the amplitude and frequency of the applied RF magnetic field. It is shown that two regimes of the heating can be realized. The first one is characterized by heating of the structure up to a finite temperature determined by equilibrium between the dissipated loss power caused by induced eddy-currents and the heat transfer to environment. The second regime corresponds to a fast unlimited temperature increase (heat explosion). The criterions of realization of these regimes are presented in the analytical form. Using the criterions and literature data, it is shown the possibility of the heat explosion regime for a graphene layer/silicon substrate structure at RF heating.

  19. Optimal Substrate Preheating Model for Thermal Spray Deposition of Thermosets onto Polymer Matrix Composites

    Science.gov (United States)

    Ivosevic, M.; Knight, R.; Kalidindi, S. R.; Palmese, G. R.; Tsurikov, A.; Sutter, J. K.

    2003-01-01

    High velocity oxy-fuel (HVOF) sprayed, functionally graded polyimide/WC-Co composite coatings on polymer matrix composites (PMC's) are being investigated for applications in turbine engine technologies. This requires that the polyimide, used as the matrix material, be fully crosslinked during deposition in order to maximize its engineering properties. The rapid heating and cooling nature of the HVOF spray process and the high heat flux through the coating into the substrate typically do not allow sufficient time at temperature for curing of the thermoset. It was hypothesized that external substrate preheating might enhance the deposition behavior and curing reaction during the thermal spraying of polyimide thermosets. A simple analytical process model for the deposition of thermosetting polyimide onto polymer matrix composites by HVOF thermal spray technology has been developed. The model incorporates various heat transfer mechanisms and enables surface temperature profiles of the coating to be simulated, primarily as a function of substrate preheating temperature. Four cases were modeled: (i) no substrate preheating; (ii) substrates electrically preheated from the rear; (iii) substrates preheated by hot air from the front face; and (iv) substrates electrically preheated from the rear and by hot air from the front.

  20. Rapid growth of single-layer graphene on the insulating substrates by thermal CVD

    Energy Technology Data Exchange (ETDEWEB)

    Chen, C.Y. [Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093 (China); Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201 (China); Dai, D.; Chen, G.X.; Yu, J.H. [Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201 (China); Nishimura, K. [Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201 (China); Advanced Nano-processing Engineering Lab, Mechanical Systems Engineering, Kogakuin University (Japan); Lin, C.-T. [Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201 (China); Jiang, N., E-mail: jiangnan@nimte.ac.cn [Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201 (China); Zhan, Z.L., E-mail: zl_zhan@sohu.com [Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093 (China)

    2015-08-15

    Highlights: • A rapid thermal CVD process has been developed to directly grow graphene on the insulating substrates. • The treating time consumed is ≈25% compared to conventional CVD procedure. • Single-layer and few-layer graphene can be formed on quartz and SiO{sub 2}/Si substrates, respectively. • The formation of thinner graphene at the interface is due to the fast precipitation rate of carbon atoms during cooling. - Abstract: The advance of CVD technique to directly grow graphene on the insulating substrates is particularly significant for further device fabrication. As graphene is catalytically grown on metal foils, the degradation of the sample properties is unavoidable during transfer of graphene on the dielectric layer. Moreover, shortening the treatment time as possible, while achieving single-layer growth of graphene, is worthy to be investigated for promoting the efficiency of mass production. Here we performed a rapid heating/cooling process to grow graphene films directly on the insulating substrates by thermal CVD. The treating time consumed is ≈25% compared to conventional CVD procedure. In addition, we found that high-quality, single-layer graphene can be formed on quartz, but on SiO{sub 2}/Si substrate only few-layer graphene can be obtained. The pronounced substrate effect is attributed to the different dewetting behavior of Ni films on the both substrates at 950 °C.

  1. Corrosion resistance of Ni-50Cr HVOF coatings on 310S alloy substrates in a metal dusting atmosphere

    Energy Technology Data Exchange (ETDEWEB)

    Saaedi, J. [Centre for Advanced Coating Technologies, Department of Materials Science and Engineering, University of Toronto, 184 College Street, Toronto, Ontario M5S 3E4 (Canada); Department of Materials and Metallurgical Engineering, Iran University of Science and Technology, Tehran (Iran, Islamic Republic of); Arabi, H.; Mirdamadi, S.; Ghorbani, H. [Department of Materials and Metallurgical Engineering, Iran University of Science and Technology, Tehran (Iran, Islamic Republic of); Coyle, T.W. [Centre for Advanced Coating Technologies, Department of Materials Science and Engineering, University of Toronto, 184 College Street, Toronto, Ontario M5S 3E4 (Canada)

    2011-09-15

    Metal dusting attack has been examined after three 168 h cycles on two Ni-50Cr coatings with different microstructures deposited on 310S alloy substrates by the high velocity oxy-fuel (HVOF) thermal-spray process. Metal dusting in uncoated 310S alloy specimens was found to be still in the initiation stage after 504 h of exposure in the 50H{sub 2}:50CO gas environment at 620 C. Dense Ni-50Cr coatings offered suitable resistance to metal dusting. Metal dusting was observed in the 310S substrates adjacent to pores at the interface between the substrate and a porous Ni-50Cr coating. The porosity present in the as-deposited coatings was shown to introduce a large variability into coating performance. Carbon formed by decomposition of the gaseous species accumulated in the surface pores and resulted in the dislodgement of surface splats due to stresses generated by the volume changes. When the corrosive gas atmosphere was able to penetrate through the interconnected pores and reach the coating-substrate interface, the 310S substrate was carburized, metal dusting attack occurred, and the resulting formation of coke in the pores led to local failure of the coating. (Copyright copyright 2011 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  2. Evaluation of the nanotube intrinsic resistance across the tip-carbon nanotube-metal substrate junction by Atomic Force Microscopy.

    Science.gov (United States)

    Dominiczak, Maguy; Otubo, Larissa; Alamarguy, David; Houzé, Frédéric; Volz, Sebastian; Noël, Sophie; Bai, Jinbo

    2011-04-14

    Using an atomic force microscope (AFM) at a controlled contact force, we report the electrical signal response of multi-walled carbon nanotubes (MWCNTs) disposed on a golden thin film. In this investigation, we highlight first the theoretical calculation of the contact resistance between two types of conductive tips (metal-coated and doped diamond-coated), individual MWCNTs and golden substrate. We also propose a circuit analysis model to schematize the «tip-CNT-substrate» junction by means of a series-parallel resistance network. We estimate the contact resistance R of each contribution of the junction such as Rtip-CNT, RCNT-substrate and Rtip-substrate by using the Sharvin resistance model. Our final objective is thus to deduce the CNT intrinsic radial resistance taking into account the calculated electrical resistance values with the global resistance measured experimentally. An unwished electrochemical phenomenon at the tip apex has also been evidenced by performing measurements at different bias voltages with diamond tips. For negative tip-substrate bias, a systematic degradation in color and contrast of the electrical cartography occurs, consisting of an important and non-reversible increase of the measured resistance. This effect is attributed to the oxidation of some amorphous carbon areas scattered over the diamond layer covering the tip. For a direct polarization, the CNT and substrate surface can in turn be modified by an oxidation mechanism.

  3. Effect of Air Gap Entrapped in Firefighter Protective Clothing on Thermal Resistance and Evaporative Resistance

    Directory of Open Access Journals (Sweden)

    He Hualing

    2018-03-01

    Full Text Available Heat and water vapor transfer behavior of thermal protective clothing is greatly influenced by the air gap entrapped in multilayer fabric system. In this study, a sweating hot plate method was used to investigate the effect of air gap position and size on thermal resistance and evaporative resistance of firefighter clothing under a range of ambient temperature and humidity. Results indicated that the presence of air gap in multilayer fabric system decreased heat and water vapor transfer abilities under normal wear. Moreover, the air gap position slightly influenced the thermal and evaporative performances of the firefighter clothing. In this study, the multilayer fabric system obtained the highest thermal resistance, when the air space was located at position B. Furthermore, the effect of ambient temperature on heat and water vapor transfer properties of the multilayer fabric system was also investigated in the presence of a specific air gap. It was indicated that ambient temperature did not influence the evaporative resistance of thermal protective clothing. A thermographic image was used to test the surface temperature of multilayer fabric system when an air gap was incorporated. These results suggested that a certain air gap entrapped in thermal protective clothing system could affect wear comfort.

  4. Low-Thermal-Resistance Baseplate Mounting

    Science.gov (United States)

    Perreault, W. T.

    1984-01-01

    Low-thermal-resistance mounting achieved by preloading baseplate to slight convexity with screws threaded through beam. As mounting bolts around edge of base-place tightened, baseplate and cold plate contact first in center, with region of intimate contact spreading outward as bolts tightened.

  5. Thermal and Microstructure Characterization of Zn-Al-Si Alloys and Chemical Reaction with Cu Substrate During Spreading

    Science.gov (United States)

    Berent, Katarzyna; Pstruś, Janusz; Gancarz, Tomasz

    2016-08-01

    The problems associated with the corrosion of aluminum connections, the low mechanical properties of Al/Cu connections, and the introduction of EU directives have forced the potential of new materials to be investigated. Alloys based on eutectic Zn-Al are proposed, because they have a higher melting temperature (381 °C), good corrosion resistance, and high mechanical strength. The Zn-Al-Si cast alloys were characterized using differential scanning calorimetry (DSC) measurements, which were performed to determine the melting temperatures of the alloys. Thermal linear expansion and electrical resistivity measurements were performed at temperature ranges of -50 to 250 °C and 25 to 300 °C, respectively. The addition of Si to eutectic Zn-Al alloys not only limits the growth of phases at the interface of liquid solder and Cu substrate but also raises the mechanical properties of the solder. Spreading test on Cu substrate using eutectic Zn-Al alloys with 0.5, 1.0, 3.0, and 5.0 wt.% of Si was studied using the sessile drop method in the presence of QJ201 flux. Spreading tests were performed with contact times of 1, 8, 15, 30, and 60 min, and at temperatures of 475, 500, 525, and 550 °C. After cleaning the flux residue from solidified samples, the spreadability of Zn-Al-Si on Cu was determined. Selected, solidified solder/substrate couples were cross-sectioned, and the interfacial microstructures were studied using scanning electron microscopy and energy dispersive x-ray spectroscopy. The growth of the intermetallic phase layer was studied at the solder/substrate interface, and the activation energy of growth of Cu5Zn8, CuZn4, and CuZn phases were determined.

  6. Solid-Liquid Interface Thermal Resistance Affects the Evaporation Rate of Droplets from a Surface: A Study of Perfluorohexane on Chromium Using Molecular Dynamics and Continuum Theory.

    Science.gov (United States)

    Han, Haoxue; Schlawitschek, Christiane; Katyal, Naman; Stephan, Peter; Gambaryan-Roisman, Tatiana; Leroy, Frédéric; Müller-Plathe, Florian

    2017-05-30

    We study the role of solid-liquid interface thermal resistance (Kapitza resistance) on the evaporation rate of droplets on a heated surface by using a multiscale combination of molecular dynamics (MD) simulations and analytical continuum theory. We parametrize the nonbonded interaction potential between perfluorohexane (C 6 F 14 ) and a face-centered-cubic solid surface to reproduce the experimental wetting behavior of C 6 F 14 on black chromium through the solid-liquid work of adhesion (quantity directly related to the wetting angle). The thermal conductances between C 6 F 14 and (100) and (111) solid substrates are evaluated by a nonequilibrium molecular dynamics approach for a liquid pressure lower than 2 MPa. Finally, we examine the influence of the Kapitza resistance on evaporation of droplets in the vicinity of a three-phase contact line with continuum theory, where the thermal resistance of liquid layer is comparable with the Kapitza resistance. We determine the thermodynamic conditions under which the Kapitza resistance plays an important role in correctly predicting the evaporation heat flux.

  7. Weather resistance of inkjet prints on plastic substrates

    Directory of Open Access Journals (Sweden)

    Rozália Szentgyörgyvölgyi

    2015-06-01

    Full Text Available The development of wide format inkjet printers made the technology available for large area commercials. Outdoor advertising uses a wide range of substrate including paperboard, vinyl, canvas, mesh; the material of the substrate itself has to endure the physical and chemical effects of local weather. Weather elements (humidity, wind, solar irradiation degrade printed products inevitably; plastic products have better resistance against them, than paper based substrates. Service life of the printed product for outdoor application is a key parameter from the customer’s point of view. There are two ways to estimate expected lifetime: on site outdoor testing or laboratory testing. In both cases weathering parameters can be monitored, however laboratory testing devices may produce the desired environmental effects and thus accelerate the aging process. Our research objective was to evaluate the effects of artificial weathering on prints produced by inkjet technology on plastic substrates. We used a large format CMYK inkjet printer (Mutoh Rockhopper II, with Epson DX 4 print heads to print our test chart on two similar substrates (PVC coated tarpaulins with grammages 400 g/m2 and 440 g/m2. Specimen were aged in an Atlas Suntest XLS+ material tester device for equal time intervals. We measured and calculated the gradual changes of the optical properties (optical density, tone value, colour shifts of the test prints.

  8. Molecular Dynamics Studies on Ballistic Thermal Resistance of Graphene Nano-Junctions

    International Nuclear Information System (INIS)

    Yao Wen-Jun; Cao Bing-Yang

    2015-01-01

    Ballistic thermal resistance of graphene nano-junctions is investigated using non-equilibrium molecular dynamics simulation. The simulation system is consisted of two symmetrical trapezoidal or rectangular graphene nano-ribbons (GNRs) and a connecting nanoscale constriction in between. From the simulated temperature profile, a big temperature jump resulted from the constriction is found, which is proportional to the heat current and corresponds to a local ballistic thermal resistance. Fixing the constriction width and the length of GNRs, this ballistic thermal resistance is independent of the width of the GNRs bottom layer, i.e., the convex angle. But interestingly, this thermal resistance has obvious size effect. It is inversely proportional to the constriction width and will disappear with the constriction being wider. Moreover, based on the phonon dynamics theory, a theoretical model of the ballistic thermal resistance in two-dimensional nano-systems is developed, which gives a good explanation on microcosmic level and agrees well with the simulation result quantitatively and qualitatively. (paper)

  9. Optimizing thermal shock resistance of layered refractories

    Energy Technology Data Exchange (ETDEWEB)

    Hein, Jarno; Kuna, Meinhard [Institute of Mechanics and Fluid Dynamics, Technical University Bergakademie Freiberg, Lampadiusstrasse 4, 09599 Freiberg (Germany)

    2012-06-15

    Severe thermal shocks may cause critical thermal stresses and failure in refractories or ceramic materials. To increase the thermal shock resistance, layered material structures are suggested. In order to optimize properties of these alternative structures, thermo-mechanical simulations are required. In this study, a finite difference method (FDM) is used for solving the partial differential equation of heat conduction with spatially varying parameters. The optimization of the strip's thermal shock resistance is exemplarily done on a 10 layered strip subjected to constant temperature jump on the top surface. Each layer can be set with different porous Al{sub 2}O{sub 3} and MgO ceramics, whose material properties are theoretically determined. In this study, an improved optimization method is developed that consists of a combination and sequence of Monte Carlo simulations and evolution strategies to overcome certain disadvantages of both techniques. (Copyright copyright 2012 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  10. Enhanced lateral heat dissipation packaging structure for GaN HEMTs on Si substrate

    International Nuclear Information System (INIS)

    Cheng, Stone; Chou, Po-Chien; Chieng, Wei-Hua; Chang, E.Y.

    2013-01-01

    This work presents a technology for packaging AlGaN/GaN high electron mobility transistors (HEMTs) on a Si substrate. The GaN HEMTs are attached to a V-groove copper base and mounted on a TO-3P leadframe. The various thermal paths from the GaN gate junction to the case are carried out for heat dissipation by spreading to protective coating; transferring through the bond wires; spreading in the lateral device structure through the adhesive layer, and vertical heat spreading of silicon chip bottom. Thermal characterization showed a thermal resistance of 13.72 °C/W from the device to the TO-3P package. Experimental tests of a 30 mm gate-periphery single chip packaged in a 5 × 3 mm V-groove Cu base with a 100 V drain bias showed power dissipation of 22 W. -- Highlights: ► An enhanced packaging structure designed for AlGaN/GaN HEMTs on an Si substrate. ► The V-groove copper base is designed on the device periphery surface heat conduction for enhancing Si substrate thermal dissipation. ► The proposed device shows a lower thermal resistance and upgrade in thermal conductivity capability. ► This work provides useful thermal IR imagery information to aid in designing high efficiency package for GaN HEMTs on Si

  11. Evaluation of the nanotube intrinsic resistance across the tip-carbon nanotube-metal substrate junction by Atomic Force Microscopy

    Directory of Open Access Journals (Sweden)

    Alamarguy David

    2011-01-01

    Full Text Available Abstract Using an atomic force microscope (AFM at a controlled contact force, we report the electrical signal response of multi-walled carbon nanotubes (MWCNTs disposed on a golden thin film. In this investigation, we highlight first the theoretical calculation of the contact resistance between two types of conductive tips (metal-coated and doped diamond-coated, individual MWCNTs and golden substrate. We also propose a circuit analysis model to schematize the «tip-CNT-substrate» junction by means of a series-parallel resistance network. We estimate the contact resistance R of each contribution of the junction such as R tip-CNT, R CNT-substrate and R tip-substrate by using the Sharvin resistance model. Our final objective is thus to deduce the CNT intrinsic radial resistance taking into account the calculated electrical resistance values with the global resistance measured experimentally. An unwished electrochemical phenomenon at the tip apex has also been evidenced by performing measurements at different bias voltages with diamond tips. For negative tip-substrate bias, a systematic degradation in color and contrast of the electrical cartography occurs, consisting of an important and non-reversible increase of the measured resistance. This effect is attributed to the oxidation of some amorphous carbon areas scattered over the diamond layer covering the tip. For a direct polarization, the CNT and substrate surface can in turn be modified by an oxidation mechanism.

  12. Electrical characteristics of SiGe-base bipolar transistors on thin-film SOI substrates

    International Nuclear Information System (INIS)

    Liao, Shu-Hui; Chang, Shu-Tong

    2010-01-01

    This paper, based on two-dimensional simulations, provides a comprehensive analysis of the electrical characteristics of the Silicon germanium (SiGe)-base bipolar transistors on thin-film siliconon-insulator (SOI) substrates. The impact of the buried oxide thickness (T OX ), the emitter width (W E ), and the lateral distance between the edge of the intrinsic base and the reach-through region (L col ) on both the AC and DC device characteristics was analyzed in detail. Regarding the DC characteristics, the simulation results suggest that a thicker T OX gives a larger base-collector breakdown voltage (BV CEO ), whereas reducing the T OX leads to an enhanced maximum electric field at the B-C junction. As for the AC characteristics, cut-off frequency (f T ) increases slightly with increasing buried oxide thickness and finally saturates to a constant value when the buried oxide thickness is about 0.15 μm. The collector-substrate capacitance (C CS ) decreases with increasing buried oxide thickness while the maximum oscillation frequency (f max ) increases with increasing buried oxide thickness. Furthermore, the impact of self-heating effects in the device was analyzed in various areas. The thermal resistance as a function of the buried oxide thickness indicates that the thermal resistance of the SiGe-base bipolar transistor on a SOI substrate is slightly higher than that of a bulk SiGe-base bipolar transistor. The thermal resistance is reduced by ∼37.89% when the emitter width is increased by a factor of 5 for a fixed buried oxide thickness of 0.1 μm. All the results can be used to design and optimize SiGe-base bipolar transistors on SOI substrates with minimum thermal resistance to enhance device performance.

  13. Thermal cycling damage evolution of a thermal barrier coating and the influence of substrate creep, interface roughness and pre-oxidation

    Energy Technology Data Exchange (ETDEWEB)

    Schweda, Mario; Beck, Tilmann; Singheiser, Lorenz [Forschungszentrum Juelich GmbH (DE). Inst. fuer Energie- und Klimaforschung (IEK), Werkstoffstruktur und Eigenschaften (IEK-2)

    2012-01-15

    The influence of roughness profile shape, roughness depth, bond coat creep strength and pre-oxidation on the thermal cycling damage evolution and lifetime of a plasma-sprayed ZrO{sub 2} thermal barrier coating system was investigated. A simplified model system was used where FeCrAlY substrates simulated the bond coat. Substrate creep was varied by using the oxide dispersoid strengthened alloy MA956 and the conventional material Fecralloy. Stochastic 3- and periodic 2-dimensional roughness profiles were produced by sand blasting and high speed turning. Damage evolution is significantly influenced by substrate creep with a trend to higher lifetimes for the fast creeping substrate. Pre-oxidation has no influence. Lifetimes of the periodically profiled samples are up to 100 times lower than these of stochastically profiled samples. In the case of periodically profiled samples, the highest lifetime was reached for the highest roughness depth combined with local undercuttings in the roughness profile. For stochastically profiled samples the influence of roughness depth could not be determined due to the wide lifetime scatter. (orig.)

  14. Correlation of physical properties of ceramic materials with resistance to fracture by thermal shock

    Science.gov (United States)

    Lidman, W G; Bobrowsky, A R

    1949-01-01

    An analysis is made to determine which properties of materials affect their resistance to fracture by thermal stresses.From this analysis, a parameter is evaluated that is correlated with the resistance of ceramic materials to fracture by thermal shock as experimentally determined. This parameter may be used to predict qualitatively the resistance of a material to fracture by thermal shock. Resistance to fracture by thermal shock is shown to be dependent upon the following material properties: thermal conductivity, tensile strength, thermal expansion, and ductility modulus. For qualitative prediction of resistance of materials to fracture by thermal shock, the parameter may be expressed as the product of thermal conductivity and tensile strength divided by the product of linear coefficient of thermal expansion and ductility modulus of the specimen.

  15. Thermal resistance analysis and optimization of photovoltaic-thermoelectric hybrid system

    International Nuclear Information System (INIS)

    Yin, Ershuai; Li, Qiang; Xuan, Yimin

    2017-01-01

    Highlights: • A detailed thermal resistance analysis of the PV-TE hybrid system is proposed. • c-Si PV and p-Si PV cells are proved to be inapplicable for the PV-TE hybrid system. • Some criteria for selecting coupling devices and optimal design are obtained. • A detailed process of designing the practical PV-TE hybrid system is provided. - Abstract: The thermal resistance theory is introduced into the theoretical model of the photovoltaic-thermoelectric (PV-TE) hybrid system. A detailed thermal resistance analysis is proposed to optimize the design of the coupled system in terms of optimal total conversion efficiency. Systems using four types of photovoltaic cells are investigated, including monocrystalline silicon photovoltaic cell, polycrystalline silicon photovoltaic cell, amorphous silicon photovoltaic cell and polymer photovoltaic cell. Three cooling methods, including natural cooling, forced air cooling and water cooling, are compared, which demonstrates a significant superiority of water cooling for the concentrating photovoltaic-thermoelectric hybrid system. Influences of the optical concentrating ratio and velocity of water are studied together and the optimal values are revealed. The impacts of the thermal resistances of the contact surface, TE generator and the upper heat loss thermal resistance on the property of the coupled system are investigated, respectively. The results indicate that amorphous silicon PV cell and polymer PV cell are more appropriate for the concentrating hybrid system. Enlarging the thermal resistance of the thermoelectric generator can significantly increase the performance of the coupled system using amorphous silicon PV cell or polymer PV cell.

  16. Oxidation and thermal shock behavior of thermal barrier coated 18/10CrNi alloy with coating modifications

    Energy Technology Data Exchange (ETDEWEB)

    Guergen, Selim [Vocational School of Transportation, Anadolu University, Eskisehir (Turkmenistan); Diltemiz, Seyid Fehmi [Turkish Air Force1st Air Supply and Maintenance Center Command, Eskisehir (Turkmenistan); Kushan, Melih Cemal [Dept. of Mechanical Engineering, Eskisehir Osmangazi University, Eskisehir (Turkmenistan)

    2017-01-15

    In this study, substrates of 18/10CrNi alloy plates were initially sprayed with a Ni-21Cr-10Al-1Y bond coat and then with an yttria stabilized zirconia top coat by plasma spraying. Subsequently, plasma-sprayed Thermal barrier coatings (TBCs) were treated with two different modification methods, namely, vacuum heat treatment and laser glazing. The effects of modifications on the oxidation and thermal shock behavior of the coatings were evaluated. The effect of coat thickness on the bond strength of the coats was also investigated. Results showed enhancement of the oxidation resistance and thermal shock resistance of TBCs following modifications. Although vacuum heat treatment and laser glazing exhibited comparable results as per oxidation resistance, the former generated the best improvement in the thermal shock resistance of the TBCs. Bond strength also decreased as coat thickness increased.

  17. Toward Improved Lifetimes of Organic Solar Cells under Thermal Stress: Substrate-Dependent Morphological Stability of PCDTBT:PCBM Films and Devices.

    Science.gov (United States)

    Li, Zhe; Ho Chiu, Kar; Shahid Ashraf, Raja; Fearn, Sarah; Dattani, Rajeev; Cheng Wong, Him; Tan, Ching-Hong; Wu, Jiaying; Cabral, João T; Durrant, James R

    2015-10-15

    Morphological stability is a key requirement for outdoor operation of organic solar cells. We demonstrate that morphological stability and lifetime of polymer/fullerene based solar cells under thermal stress depend strongly on the substrate interface on which the active layer is deposited. In particular, we find that the stability of benchmark PCDTBT/PCBM solar cells under modest thermal stress is substantially increased in inverted solar cells employing a ZnO substrate compared to conventional devices employing a PSS substrate. This improved stability is observed to correlate with PCBM nucleation at the 50 nm scale, which is shown to be strongly influenced by different substrate interfaces. Employing this approach, we demonstrate remarkable thermal stability for inverted PCDTBT:PC70BM devices on ZnO substrates, with negligible (humidity exposure as widely reported previously, can also demonstrate enhanced morphological stability. As such we show that the choice of suitable substrate interfaces may be a key factor in achieving prolonged lifetimes for organic solar cells under thermal stress conditions.

  18. Improvement of the Oxidation Resistance of CoNiCrAlY Bond Coats Sprayed by High Velocity Oxygen-Fuel onto Nickel Superalloy Substrate

    Directory of Open Access Journals (Sweden)

    Alessio Fossati

    2010-11-01

    Full Text Available CoNiCrAlY powders with similar granulometry and chemical composition, but different starting reactivity toward oxygen, were sprayed onto superalloy substrates by High Velocity Oxygen-Fuel producing coatings of similar thicknesses. After spraying, samples were maintained at 1,273 K in air for different test periods of up to 5,000 hours. Morphological, microstructural, compositional and electrochemical analyses were performed on the coated samples in order to assess the high temperature oxidation resistance provided by the two different powders. The powder with higher starting reactivity towards oxygen improves the oxidation resistance of the coated samples by producing thinner and more adherent thermally grown oxide layers.

  19. Evaluation of the of thermal shock resistance of a castable containing andalusite aggregates by thermal shock cycles

    International Nuclear Information System (INIS)

    Garcia, G.C.R.; Santos, E.M.B.; Ribeiro, S.; Rodrigues, J.A.

    2011-01-01

    The thermal shock resistance of refractory materials is one of the most important characteristics that determine their performance in many applications, since abrupt and drastic differences in temperature can damage them. Resistance to thermal shock damage can be evaluated based on thermal cycles, i.e., successive heating and cooling cycles followed by an analysis of the drop in Young's modulus occurring in each cycle. The aim of this study was to evaluate the resistance to thermal shock damage in a commercial refractory concrete with andalusite aggregate. Concrete samples that were sintered at 1000 deg C and 1450 deg C for 5 hours to predict and were subjected to 30 thermal shock cycles, soaking in the furnace for 20 minutes at a temperature of 1000 deg C, and subsequent cooling in circulating water at 25 deg C. The results showed a decrease in Young's modulus and rupture around 72% for samples sintered at 1000 ° C, and 82% in sintered at 1450 ° C. The refractory sintered at 1450 deg C would show lower thermal shock resistance than the refractory sintered at 1000 deg C. (author)

  20. Analysis of dual-phase-lag thermal behaviour in layered films with temperature-dependent interface thermal resistance

    International Nuclear Information System (INIS)

    Liu, K-C

    2005-01-01

    This work analyses theoretically the dual-phase-lag thermal behaviour in two-layered thin films with an interface thermal resistance, which is predicted by the radiation boundary condition model. The effect of the interface thermal resistance on the transmission-reflection phenomenon, induced by a pulsed volumetric source adjacent to the exterior surface of one layer, is investigated. Due to the difference between the two layers in the relaxation times, τ q and τ T , and the nonlinearity of the interfacial boundary condition, complexity is introduced and some mathematical difficulties are involved in solving the present problem. A hybrid application of the Laplace transform method and a control-volume formulation are used along with the linearization technique. The results show that the effect of the thermophysical properties on the behaviour of the energy passing across the interface gradually reduces with increasing interface thermal resistance. The lagging thermal behaviour depends on the magnitude of τ T and τ q more than on the ratio of τ T /τ q

  1. Low Thermal Budget Fabrication of III-V Quantum Nanostructures on Si Substrates

    International Nuclear Information System (INIS)

    Bietti, S; Somaschini, C; Sanguinetti, S; Koguchi, N; Isella, G; Chrastina, D; Fedorov, A

    2010-01-01

    We show the possibility to integrate high quality III-V quantum nanostructures tunable in shape and emission energy on Si-Ge Virtual Substrate. Strong photoemission is observed, also at room temperature, from two different kind of GaAs quantum nanostructures fabricated on Silicon substrate. Due to the low thermal budget of the procedure used for the fabrication of the active layer, Droplet Epitaxy is to be considered an excellent candidate for implementation of optoelectronic devices on CMOS circuits.

  2. Adhesion and thermal stability enhancement of IZO films by adding a primer layer on polycarbonate substrate

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Xuan; Zhang, Xiaofeng; Yan, Yue; Zhong, Yanli; Li, Lei; Zhang, Guanli [Beijing Institute of Aeronautical Materials (BIAM), Haidian District, Beijing, 100095 (China)

    2015-04-01

    A silicone-based primer layer was developed to improve the adhesion and thermal stability of amorphous transparent indium zinc oxide (IZO) films on polycarbonate (PC). The IZO films deposited by direct current magnetron sputtering at room temperature on primer-treated and untreated PCs were evaluated ex situ in terms of surface morphology, adhesion, optical, and electrical properties during annealing at 120 C in air. Nano-scratch tests indicated the adhesion of IZO films on primer-treated substrates was superior to that on untreated PCs. This superior adhesion can be attributed to the strong Si-O-Si inorganic bonds abundant in the primer layer and better matches of the primer layer in the terms of thermal expansion to the IZO. Moreover, the electrical resistivity of IZO films prepared on primer-treated PCs remained stable during the annealing treatment, whereas those of IZO films on untreated PCs presented a continuously increasing trend, which was attributed to the decrease in carrier concentration that resulted from oxygen adsorption. (copyright 2015 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  3. Preparation and modification of VO2 thin film on R-sapphire substrate by rapid thermal process

    Science.gov (United States)

    Zhu, Nai-Wei; Hu, Ming; Xia, Xiao-Xu; Wei, Xiao-Ying; Liang, Ji-Ran

    2014-04-01

    The VO2 thin film with high performance of metal-insulator transition (MIT) is prepared on R-sapphire substrate for the first time by magnetron sputtering with rapid thermal process (RTP). The electrical characteristic and THz transmittance of MIT in VO2 film are studied by four-point probe method and THz time domain spectrum (THz-TDS). X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), and search engine marketing (SEM) are employed to analyze the crystalline structure, valence state, surface morphology of the film. Results indicate that the properties of VO2 film which is oxidized from the metal vanadium film in oxygen atmosphere are improved with a follow-up RTP modification in nitrogen atmosphere. The crystallization and components of VO2 film are improved and the film becomes compact and uniform. A better phase transition performance is shown that the resistance changes nearly 3 orders of magnitude with a 2-°C hysteresis width and the THz transmittances are reduced by 64% and 60% in thermal and optical excitation respectively.

  4. Role of thermal resistance on the performance of superconducting radio frequency cavities

    Science.gov (United States)

    Dhakal, Pashupati; Ciovati, Gianluigi; Myneni, Ganapati Rao

    2017-03-01

    Thermal stability is an important parameter for the operation of the superconducting radio frequency (SRF) cavities used in particle accelerators. The rf power dissipated on the inner surface of the cavities is conducted to the helium bath cooling the outer cavity surface and the equilibrium temperature of the inner surface depends on the thermal resistance. In this manuscript, we present the results of direct measurements of thermal resistance on 1.3 GHz single cell SRF cavities made from high purity large-grain and fine-grain niobium as well as their rf performance for different treatments applied to outer cavity surface in order to investigate the role of the Kapitza resistance to the overall thermal resistance and to the SRF cavity performance. The results show no significant impact of the thermal resistance to the SRF cavity performance after chemical polishing, mechanical polishing or anodization of the outer cavity surface. Temperature maps taken during the rf test show nonuniform heating of the surface at medium rf fields. Calculations of Q0(Bp) curves using the thermal feedback model show good agreement with experimental data at 2 and 1.8 K when a pair-braking term is included in the calculation of the Bardeen-Cooper-Schrieffer surface resistance. These results indicate local intrinsic nonlinearities of the surface resistance, rather than purely thermal effects, to be the main cause for the observed field dependence of Q0(Bp) .

  5. Role of thermal resistance on the performance of superconducting radio frequency cavities

    Directory of Open Access Journals (Sweden)

    Pashupati Dhakal

    2017-03-01

    Full Text Available Thermal stability is an important parameter for the operation of the superconducting radio frequency (SRF cavities used in particle accelerators. The rf power dissipated on the inner surface of the cavities is conducted to the helium bath cooling the outer cavity surface and the equilibrium temperature of the inner surface depends on the thermal resistance. In this manuscript, we present the results of direct measurements of thermal resistance on 1.3 GHz single cell SRF cavities made from high purity large-grain and fine-grain niobium as well as their rf performance for different treatments applied to outer cavity surface in order to investigate the role of the Kapitza resistance to the overall thermal resistance and to the SRF cavity performance. The results show no significant impact of the thermal resistance to the SRF cavity performance after chemical polishing, mechanical polishing or anodization of the outer cavity surface. Temperature maps taken during the rf test show nonuniform heating of the surface at medium rf fields. Calculations of Q_{0}(B_{p} curves using the thermal feedback model show good agreement with experimental data at 2 and 1.8 K when a pair-braking term is included in the calculation of the Bardeen-Cooper-Schrieffer surface resistance. These results indicate local intrinsic nonlinearities of the surface resistance, rather than purely thermal effects, to be the main cause for the observed field dependence of Q_{0}(B_{p}.

  6. Effect of thermal acclimation on thermal preference, resistance and locomotor performance of hatchling soft-shelled turtle

    Directory of Open Access Journals (Sweden)

    Mei-Xian WU,Ling-Jun HU, Wei DANG, Hong-Liang LU, Wei-Guo DU

    2013-12-01

    Full Text Available The significant influence of thermal acclimation on physiological and behavioral performance has been documented in many ectothermic animals, but such studies are still limited in turtle species. We acclimated hatchling soft-shelled turtles Pelodiscus sinensis under three thermal conditions (10, 20 and 30 °C for 4 weeks, and then measured selected body temperature (Tsel, critical thermal minimum (CTMin and maximum (CTMax, and locomotor performance at different body temperatures. Thermal acclimation significantly affected thermal preference and resistance of P. sinensis hatchlings. Hatchling turtles acclimated to 10 °C selected relatively lower body temperatures and were less resistant to high temperatures than those acclimated to 20 °C and 30 °C. The turtles’ resistance to low temperatures increased with a decreasing acclimation temperature. The thermal resistance range (i.e. the difference between CTMax and CTMin, TRR was widest in turtles acclimated to 20 °C, and narrowest in those acclimated to 10 °C. The locomotor performance of turtles was affected by both body temperature and acclimation temperature. Hatchling turtles acclimated to relatively higher temperatures swam faster than did those acclimated to lower temperatures. Accordingly, hatchling turtles acclimated to a particular temperature may not enhance the performance at that temperature. Instead, hatchlings acclimated to relatively warm temperatures have a better performance, supporting the “hotter is better” hypothesis [Current Zoology 59 (6 : 718–724, 2013 ].

  7. Thermal Oxidation Resistance of Rare Earth-Containing Composite Elastomer

    Institute of Scientific and Technical Information of China (English)

    邱关明; 张明; 周兰香; 中北里志; 井上真一; 冈本弘

    2001-01-01

    The rare earth-containing composite elastomer was obtained by the reaction of vinyl pyridine-SBR (PSBR) latex with rare earth alkoxides, and its thermal oxidation resistance was studied. After aging test, it is found that its retention rate of mechanical properties is far higher than that of the control sample. The results of thermogravimetric analysis show that its thermal-decomposing temperature rises largely. The analysis of oxidation mechanisms indicates that the main reasons for thermal oxidation resistance are that rare earth elements are of the utility to discontinue autoxidation chain reaction and that the formed complex structure has steric hindrance effect on oxidation.

  8. Design and Construction of a Thermal Contact Resistance and Thermal Conductivity Measurement System

    Science.gov (United States)

    2015-09-01

    thank my Mom, Dad , Allison, Jessica, and father-in-law, Tom, for always being there to listen and encourage me. xxiv THIS PAGE INTENTIONALLY...thermal conductivity is temperature measurement inaccuracies. A probe constructed of a poor thermally conductive material when inserted into a hot...interface- resistance-measurement-using-a-transient-method/ [26] H. Fukushima, L. T. Drzal, B. P. Rook and M. J. Rich , “Thermal conductivity of exfoliated

  9. A metallization and bonding approach for high performance carbon nanotube thermal interface materials

    International Nuclear Information System (INIS)

    Cross, Robert; Graham, Samuel; Cola, Baratunde A; Fisher, Timothy; Xu Xianfan; Gall, Ken

    2010-01-01

    A method has been developed to create vertically aligned carbon nanotube (VACNT) thermal interface materials that can be attached to a variety of metallized surfaces. VACNT films were grown on Si substrates using standard CVD processing followed by metallization using Ti/Au. The coated CNTs were then bonded to metallized substrates at 220 deg. C. By reducing the adhesion of the VACNTs to the growth substrate during synthesis, the CNTs can be completely transferred from the Si growth substrate and used as a die attachment material for electronic components. Thermal resistance measurements using a photoacoustic technique showed thermal resistances as low as 1.7 mm 2 K W -1 for bonded VACNT films 25-30 μm in length and 10 mm 2 K W -1 for CNTs up to 130 μm in length. Tensile testing demonstrated a die attachment strength of 40 N cm -2 at room temperature. Overall, these metallized and bonded VACNT films demonstrate properties which are promising for next-generation thermal interface material applications.

  10. Transient, heat-induced thermal resistance in the small intestine of mouse

    International Nuclear Information System (INIS)

    Hume, S.P.; Marigold, J.C.L.

    1980-01-01

    Heat-induced thermal resistance has been investigated in mouse jejunum by assaying crypt survival 24 h after treatment. Hyperthermia was achieved by immersing an exteriorized loop of intestine in a bath of Krebs-Ringer solution. Two approaches have been used. In the first, thermal survival curves were obtained following single hyperthermal treatments at temperatures in the range 42 to 44 0 C. Transient thermal resistance, inducted by a plateau in the crypt survival curve, developed during heating at temperatures around 42.5 0 C after 60 to 80 min. In the second series of experiments, a priming heat treatment (40.0, 41.0, 41.5, or 42.0 0 C for 60 min) was followed at varying intervals by a test treatment at 43.0 0 C. A transient resistance to the second treatment was induced, the extent and time of development being dependent upon the priming treatment. Crypt survival curves for thermally resistant intestine showed an increase in thermal D 0 and a decrease in n compared with curves from previously unheated intestine

  11. Microstructural Analysis and Transport Properties of Thermally Sprayed Multiple-Layer Ceramic Coatings

    Science.gov (United States)

    Wang, Hsin; Muralidharan, Govindarajan; Leonard, Donovan N.; Haynes, J. Allen; Porter, Wallace D.; England, Roger D.; Hays, Michael; Dwivedi, Gopal; Sampath, Sanjay

    2018-02-01

    Multilayer, graded ceramic/metal coatings were prepared by an air plasma spray method on Ti-6Al-4V, 4140 steel and graphite substrates. The coatings were designed to provide thermal barriers for diesel engine pistons to operate at higher temperatures with improved thermal efficiency and cleaner emissions. A systematic, progressive variation in the mixture of yttria-stabilized zirconia and bondcoat alloys (NiCoCrAlYHfSi) was designed to provide better thermal expansion match with the substrate and to improve thermal shock resistance and cycle life. Heat transfer through the layers was evaluated by a flash diffusivity technique based on a model of one-dimensional heat flow. The aging effect of the as-sprayed coatings was captured during diffusivity measurements, which included one heating and cooling cycle. The hysteresis of thermal diffusivity due to aging was not observed after 100-h annealing at 800 °C. The measurements of coatings on substrate and freestanding coatings allowed the influence of interface resistance to be evaluated. The microstructure of the multilayer coating was examined using scanning electron microscope and electron probe microanalysis.

  12. The corrosion resistance of 140MXC, 530AS and 560AS coatings produced by thermal spraying

    Directory of Open Access Journals (Sweden)

    Edwin Alexis López Covaleda

    2013-01-01

    Full Text Available Three commercial materials were deposited using electric arc thermal spraying: 140MXC (with Fe, W, Cr, Nb, 530AS (AISI 1015 steel and 560AS (AISI 420 steel on AISI 4340 steel. The aim of this paper was to evaluate the best strategy for improving a coating-substrate system’s corrosion resistance, using the following combinations: homogeneous single coatings, bilayers consisting of 530AS or 560AS under 140MXC and 140MXC + 530AS and 140MXC + 560AS coatings deposited simultaneously. The coatings were characterised using optical microscopy, scanning electron microscopy and X-ray diffraction. Corrosion resistance was evaluated through potentiodynamic polarisation and hardness by using the Vickers test. Corrosion resistance depends on the amount of microstructure defects, the deposition strategy and the alloy elements. However, corrosion resistance was similar in single coatings of 140MXC and bilayers, having -630 V corrosion potential and 708 nA corrosion current. The details and corrosion mechanism of the coatings so produced are described in this paper.

  13. Study on the Thermal Resistance of Multi-chip Module High Power LED Packaging Heat Dissipation System

    Directory of Open Access Journals (Sweden)

    Kailin Pan

    2014-10-01

    Full Text Available Thermal resistance is a key technical index which indicates the thermal management of multi-chip module high power LED (MCM-LED packaging heat dissipation system. In this paper, the prototype structure of MCM-LED packaging heat dissipation system is proposed to study the reliable thermal resistance calculation method. In order to analyze the total thermal resistance of the MCM-LED packaging heat dissipation system, three kinds of thermal resistance calculation method including theoretical calculation, experimental testing and finite element simulation are developed respectively. Firstly, based on the thermal resistance network model and the principle of steady state heat transfer, the theoretical value of total thermal resistance is 6.111 K/W through sum of the thermal resistance of every material layer in the major direction of heat flow. Secondly, the thermal resistance experiment is carried out by T3Ster to obtain the experimental result of total thermal resistance, and the value is 6.729 K/W. Thirdly, a three-dimensional finite element model of MCM-LED packaging heat dissipation system is established, and the junction temperature experiment is also performed to calculated the finite element simulated result of total thermal resistance, the value is 6.99 K/W. Finally, by comparing the error of all the three kinds of result, the error of total thermal resistance between the theoretical value and experimental result is 9.2 %, and the error of total thermal resistance between the experimental result and finite element simulation is only about -3.9 %, meanwhile, the main reason of each error is discussed respectively.

  14. Resistive switching via the converse magnetoelectric effect in ferromagnetic multilayers on ferroelectric substrates.

    Science.gov (United States)

    Pertsev, N A; Kohlstedt, H

    2010-11-26

    A voltage-controlled resistive switching is predicted for ferromagnetic multilayers and spin valves mechanically coupled to a ferroelectric substrate. The switching between low- and high-resistance states results from the strain-driven magnetization reorientations by about 90°, which are shown to occur in ferromagnetic layers with a high magnetostriction and weak cubic magnetocrystalline anisotropy. Such reorientations, not requiring external magnetic fields, can be realized experimentally by applying moderate electric field to a thick substrate (bulk or membrane type) made of a relaxor ferroelectric having ultrahigh piezoelectric coefficients. The proposed multiferroic hybrids exhibiting giant magnetoresistance may be employed as electric-write nonvolatile magnetic memory cells with nondestructive readout.

  15. Evaluation of thermal shock resistance of cordierite honeycombs

    Indian Academy of Sciences (India)

    A comparative study on thermal shock resistance (TSR) of extruded cordierite honeycombs is presented. TSR is an important property that predicts the life of these products in thermal environments used for automobile pollution control as catalytic converter or as diesel particulate filter. TSR was experimentally studied by ...

  16. Electrical properties of pressure quenched silicon by thermal spraying

    International Nuclear Information System (INIS)

    Tan, S.Y.; Gambino, R.J.; Sampath, S.; Herman, H.

    2007-01-01

    High velocity thermal spray deposition of polycrystalline silicon film onto single crystal substrates, yields metastable high pressure forms of silicon in nanocrystalline form within the deposit. The phases observed in the deposit include hexagonal diamond-Si, R-8, BC-8 and Si-IX. The peculiar attribute of this transformation is that it occurs only on orientation silicon substrate. The silicon deposits containing the high pressure phases display a substantially higher electrical conductivity. The resistivity profile of the silicon deposit containing shock induced metastable silicon phases identified by X-ray diffraction patterns. The density of the pressure induced polymorphic silicon is higher at deposit/substrate interface. A modified two-layer model is presented to explain the resistivity of the deposit impacted by the pressure induced polymorphic silicon generated by the thermal spraying process. The pressure quenched silicon deposits on the p - silicon substrate, with or without metastable phases, display the barrier potential of about 0.72 eV. The measured hall mobility value of pressure quenched silicon deposits is in the range of polycrystalline silicon. The significance of this work lies in the fact that the versatility of thermal spray may enable applications of these high pressure forms of silicon

  17. Thermal boundary resistance at Si/Ge interfaces by molecular dynamics simulation

    Directory of Open Access Journals (Sweden)

    Tianzhuo Zhan

    2015-04-01

    Full Text Available In this study, we investigated the temperature dependence and size effect of the thermal boundary resistance at Si/Ge interfaces by non-equilibrium molecular dynamics (MD simulations using the direct method with the Stillinger-Weber potential. The simulations were performed at four temperatures for two simulation cells of different sizes. The resulting thermal boundary resistance decreased with increasing temperature. The thermal boundary resistance was smaller for the large cell than for the small cell. Furthermore, the MD-predicted values were lower than the diffusion mismatch model (DMM-predicted values. The phonon density of states (DOS was calculated for all the cases to examine the underlying nature of the temperature dependence and size effect of thermal boundary resistance. We found that the phonon DOS was modified in the interface regions. The phonon DOS better matched between Si and Ge in the interface region than in the bulk region. Furthermore, in interface Si, the population of low-frequency phonons was found to increase with increasing temperature and cell size. We suggest that the increasing population of low-frequency phonons increased the phonon transmission coefficient at the interface, leading to the temperature dependence and size effect on thermal boundary resistance.

  18. DETERMINING THE THERMAL RESISTANCE OF A VENTILATED HINGED FACADE SYSTEM LAYER

    Directory of Open Access Journals (Sweden)

    Gagarin Vladimir Gennad'evich

    2015-03-01

    Full Text Available Enveloping structures with hinged façade systems are nowadays widely used for moisture control of enveloping structures, prevention of overheating of the structures by insolation, saving the constructions from atmospheric moisture and also for correspondence with the raised requirements to thermal protection of the enveloping structures, aimed also at reducing energy consumption. In the winter conditions the influence of air layer on the thermal insulation parameters is usually neglected. In the article the thermal resistance of an air gap and is considered and its effect in the calculation of the heat resistance of a building envelope with hinged facade system is analyzed in the conditions of cold weather. The thermal resistance of the air layer determines how the heat losses decrease.

  19. Performance characterization of metallic substrates coated by HVOF WC–Co

    International Nuclear Information System (INIS)

    Venter, Andrew M.; Oladijo, O. Philip; Luzin, Vladimir; Cornish, Lesley A.; Sacks, Natasha

    2013-01-01

    Integral to the performance of high-velocity oxygen-fuel (HVOF) coatings is the thermo-mechanical interaction associated with the thermal misfit, or differences in thermal expansion coefficients (CTEs), between coating and substrate. This investigation reports results on the microstructures, chemical phase content, coating–substrate misfit residual stress, and wear resistance. For this purpose a systematic characterization of WC–Co sprayed coatings on a number of substrates covering a range of CTE values were pursued for both the as-coated and heat-treated conditions. The neutron diffraction technique in conjunction with sub-millimeter sized gauge volumes enabled depth-resolved studies of the stress in the coatings and substrates by paying special attention to the determination of the stress contribution attributed by the final spray process. In the as-coated condition the stress values in the coatings were compressive for CTEs larger than that of WC–Co and tensile for CTE lower than WC–Co. Wear resistance increased for increased compressive stress and macrohardness. In the heat-treated condition, this trend became enhanced due to increased compressive stress in the coatings. - Highlights: • Four different substrate systems coated with HVOF WC-Co has been investigated. • Each substrate set encompassed the grit-blast surface and as-coated conditions, as well as their heat-treated counterparts. • Microstructural, macrohardness, wear performance and depth-resolved residual stress characterised. • Successful application of neutron strain scanning to investigating the combined systems, coatings and substrates. • Link observed between macrohardness, residual stress and wear performance

  20. Thermal resistance of aluminum gravity heaГІ pipe with threaded capillary structure

    Directory of Open Access Journals (Sweden)

    Nikolaenko Yu. E.

    2017-10-01

    Full Text Available The results of an experimental study of the thermal resistance of an aluminum gravitational heat pipe with isobutane (R600a as a working fluid under conditions of heat removal of natural air convection are presented. Comparison of the thermal resistance of an aluminum gravitational heat pipe with a threaded capillary structure and the thermal resistance of an aluminum thermosyphon of the same size, having a smooth surface of the body in the evaporation zone, is given. It is shown that in the range of values of the input heat flux from 5 to 50 W the thermal resistance of the gravitational heat pipe is substantially lower than the thermal resistance of the thermosiphon. The studies were conducted both without the use of additional radiators in the condensation zone of heat transfer devices, and with the use of one, two and three radiators.

  1. A differential scanning calorimetric study of the effects of metal ions, substrate/product, substrate analogues and chaotropic anions on the thermal denaturation of yeast enolase 1.

    Science.gov (United States)

    Brewer, J M; Wampler, J E

    2001-03-14

    The thermal denaturation of yeast enolase 1 was studied by differential scanning calorimetry (DSC) under conditions of subunit association/dissociation, enzymatic activity or substrate binding without turnover and substrate analogue binding. Subunit association stabilizes the enzyme, that is, the enzyme dissociates before denaturing. The conformational change produced by conformational metal ion binding increases thermal stability by reducing subunit dissociation. 'Substrate' or analogue binding additionally stabilizes the enzyme, irrespective of whether turnover is occurring, perhaps in part by the same mechanism. More strongly bound metal ions also stabilize the enzyme more, which we interpret as consistent with metal ion loss before denaturation, though possibly the denaturation pathway is different in the absence of metal ion. We suggest that some of the stabilization by 'substrate' and analogue binding is owing to the closure of moveable polypeptide loops about the active site, producing a more 'closed' and hence thermostable conformation.

  2. Thermal resistance of indium coated sapphire–copper contacts below 0.1K

    CERN Document Server

    Eisel, T; Koettig, T

    2014-01-01

    High thermal resistances exist at ultra-low temperatures for solid-solid interfaces. This is especially true for pressed metal-sapphire joints, where the heat is transferred by phonons only. For such pressed joints it is difficult to achieve good physical, i.e. thermal contacts due to surface irregularities in the microscopic or larger scale. Applying ductile indium as an intermediate layer reduces the thermal resistance of such contacts. This could be proven by measurements of several researchers. However, the majority of the measurements were performed at temperatures higher than 1 K. Consequently, it is difficult to predict the thermal resistance of pressed metal-sapphire joints at temperatures below 1 K. In this paper the thermal resistances across four different copper-sapphire-copper sandwiches are presented in a temperature range between 30 mK and 100 mK. The investigated sandwiches feature either rough or polished sapphire discs (empty set 20 mm x 1.5 mm) to investigate the phonon scattering at the bo...

  3. Tutorial: Determination of thermal boundary resistance by molecular dynamics simulations

    Science.gov (United States)

    Liang, Zhi; Hu, Ming

    2018-05-01

    Due to the high surface-to-volume ratio of nanostructured components in microelectronics and other advanced devices, the thermal resistance at material interfaces can strongly affect the overall thermal behavior in these devices. Therefore, the thermal boundary resistance, R, must be taken into account in the thermal analysis of nanoscale structures and devices. This article is a tutorial on the determination of R and the analysis of interfacial thermal transport via molecular dynamics (MD) simulations. In addition to reviewing the commonly used equilibrium and non-equilibrium MD models for the determination of R, we also discuss several MD simulation methods which can be used to understand interfacial thermal transport behavior. To illustrate how these MD models work for various interfaces, we will show several examples of MD simulation results on thermal transport across solid-solid, solid-liquid, and solid-gas interfaces. The advantages and drawbacks of a few other MD models such as approach-to-equilibrium MD and first-principles MD are also discussed.

  4. Thermal Conductivity in Soil: Theoretical Approach by 3D Infinite Resistance Grid Model

    Science.gov (United States)

    Changjan, A.; Intaravicha, N.

    2018-05-01

    Thermal conductivity in soil was elementary characteristic of soil that conduct heat, measured in terms of Fourier’s Law for heat conduction and useful application in many fields: such as Utilizing underground cable for transmission and distribution systems, the rate of cooling of the cable depends on the thermal properties of the soil surrounding the cable. In this paper, we investigated thermal conductivity in soil by infinite three dimensions (3D) electrical resistance circuit concept. Infinite resistance grid 3D was the grid of resistors that extends to infinity in all directions. Model of thermal conductivity in soil of this research was generated from this concept: comparison between electrical resistance and thermal resistance in soil. Finally, we investigated the analytical form of thermal conductivity in soil which helpful for engineering and science students that could exhibit education with a principle of physics that applied to real situations.

  5. Fabrication and Corrosion Resistance of Superhydrophobic Hydroxide Zinc Carbonate Film on Aluminum Substrates

    Directory of Open Access Journals (Sweden)

    Jin Liang

    2013-01-01

    Full Text Available Superhydrophobic hydroxide zinc carbonate (HZC films were fabricated on aluminum substrate through a convenient in situ deposition process. Firstly, HZC films with different morphologies were deposited on aluminum substrates through immersing the aluminum substrates perpendicularly into aqueous solution containing zinc nitrate hexahydrate and urea. Secondly, the films were then modified with fluoroalkylsilane (FAS: CH3(CF26(CH23Si(OCH33 molecules by immersing in absolute ethanol solution containing FAS. The morphologies, hydrophobicity, chemical compositions, and bonding states of the films were analyzed by scanning electron microscopy (SEM, water contact angle measurement (CA, Fourier transform infrared spectrometer (FTIR, and X-ray photoelectron spectroscopy (XPS, respectively. It was shown by surface morphological observation that HZC films displayed different microstructures such as microporous structure, rose petal-like structure, block-shaped structure, and pinecone-like structure by altering the deposition condition. A highest water contact angle of 156.2° was obtained after FAS modification. Moreover, the corrosion resistance of the superhydrophobic surface on aluminum substrate was investigated using electrochemical impedance spectroscopy (EIS measurements. The EIS measurements’ results revealed that the superhydrophobic surface considerably improved the corrosion resistance of aluminum.

  6. Temperature rise of the mask-resist assembly during LIGA exposure

    International Nuclear Information System (INIS)

    Ting, Aili

    2004-01-01

    Deep X-ray lithography on PMMA resist is used in the LIGA process. The resist is exposed to synchrotron X-rays through a patterned mask and then is developed in a liquid developer to make high aspect ratio microstructures. The limitations in dimensional accuracies of the LIGA generated microstructure originate from many sources, including synchrotron and X-ray physics, thermal and mechanical properties of mask and resist, and from the kinetics of the developer. This work addresses the thermal analysis and temperature rise of the mask-resist assembly during exposure in air at the Advanced Light Source (ALS) synchrotron. The concern is that dimensional errors generated at the mask and the resist due to thermal expansion will lower the accuracy of the lithography. We have developed a three-dimensional finite-element model of the mask and resist assembly that includes a mask with absorber, a resist with substrate, three metal holders, and a water-cooling block. We employed the LIGA exposure-development software LEX-D to calculate volumetric heat sources generated in the assembly by X-ray absorption and the commercial software ABAQUS to calculate heat transfer including thermal conduction inside the assembly, natural and forced convection, and thermal radiation. at assembly outer and/or inner surfaces. The calculations of assembly maximum temperature. have been compared with temperature measurements conducted at ALS. In some of these experiments, additional cooling of the assembly was produced by forced nitrogen flow ('nitrogen jets') directed at the mask surface. The temperature rise in the silicon mask and the mask holder comes directly from the X-ray absorption, but nitrogen jets carry away a significant portion of heat energy from the mask surface, while natural convection carries away negligibly small amounts energy from the holder. The temperature rise in PMMA resist is mainly from heat conducted from the silicon substrate backward to the resist and from the inner

  7. High temperature resistant cermet and ceramic compositions. [for thermal resistant insulators and refractory coatings

    Science.gov (United States)

    Phillips, W. M. (Inventor)

    1978-01-01

    High temperature oxidation resistance, high hardness and high abrasion and wear resistance are properties of cermet compositions particularly to provide high temperature resistant refractory coatings on metal substrates, for use as electrical insulation seals for thermionic converters. The compositions comprise a sintered body of particles of a high temperature resistant metal or metal alloy, preferably molybdenum or tungsten particles, dispersed in and bonded to a solid solution formed of aluminum oxide and silicon nitride, and particularly a ternary solid solution formed of a mixture of aluminum oxide, silicon nitride and aluminum nitride. Ceramic compositions comprising a sintered solid solution of aluminum oxide, silicon nitride and aluminum nitride are also described.

  8. Preparation and modification of VO2 thin film on R-sapphire substrate by rapid thermal process

    International Nuclear Information System (INIS)

    Zhu Nai-Wei; Hu Ming; Xia Xiao-Xu; Wei Xiao-Ying; Liang Ji-Ran

    2014-01-01

    The VO 2 thin film with high performance of metal–insulator transition (MIT) is prepared on R-sapphire substrate for the first time by magnetron sputtering with rapid thermal process (RTP). The electrical characteristic and THz transmittance of MIT in VO 2 film are studied by four-point probe method and THz time domain spectrum (THz-TDS). X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), and search engine marketing (SEM) are employed to analyze the crystalline structure, valence state, surface morphology of the film. Results indicate that the properties of VO 2 film which is oxidized from the metal vanadium film in oxygen atmosphere are improved with a follow-up RTP modification in nitrogen atmosphere. The crystallization and components of VO 2 film are improved and the film becomes compact and uniform. A better phase transition performance is shown that the resistance changes nearly 3 orders of magnitude with a 2-°C hysteresis width and the THz transmittances are reduced by 64% and 60% in thermal and optical excitation respectively. (interdisciplinary physics and related areas of science and technology)

  9. Large-scale uniform ZnO tetrapods on catalyst free glass substrate by thermal evaporation method

    Energy Technology Data Exchange (ETDEWEB)

    Alsultany, Forat H., E-mail: foratusm@gmail.com [School of Physics, USM, 11800 Penang (Malaysia); Hassan, Z. [Institute of Nano-Optoelectronics Research and Technology Laboratory (INOR), USM, 11800 Penang (Malaysia); Ahmed, Naser M. [School of Physics, USM, 11800 Penang (Malaysia)

    2016-07-15

    Highlights: • Investigate the growth of ZnO-Ts on glass substrate by thermal evaporation method. • Glass substrate without any catalyst or a seed layer. • The morphology was controlled by adjusting the temperature of the material and the substrate. • Glass substrate was placed vertically in the quartz tube. - Abstract: Here, we report for the first time the catalyst-free growth of large-scale uniform shape and size ZnO tetrapods on a glass substrate via thermal evaporation method. Three-dimensional networks of ZnO tetrapods have needle–wire junctions, an average leg length of 2.1–2.6 μm, and a diameter of 35–240 nm. The morphology and structure of ZnO tetrapods were investigated by controlling the preparation temperature of each of the Zn powder and the glass substrate under O{sub 2} and Ar gases. Studies were carried out on ZnO tetrapods using X-ray diffraction, field emission scanning electron microscopy, UV–vis spectrophotometer, and a photoluminescence. The results showed that the sample grow in the hexagonal wurtzite structure with preferentially oriented along (002) direction, good crystallinity and high transmittance. The band gap value is about 3.27 eV. Photoluminescence spectrum exhibits a very sharp peak at 378 nm and a weak broad green emission.

  10. Thermal plasma fabricated lithium niobate-tantalate films on sapphire substrate

    International Nuclear Information System (INIS)

    Kulinich, S.A.; Yoshida, T.; Yamamoto, H.; Terashima, K.

    2003-01-01

    We report the deposition of LiNb 1-x Ta x O 3 (0≤x≤1) films on (001) sapphire substrates in soft vacuum using a radio frequency thermal plasma. The growth rate, crystallinity, c-axis orientation, and surface roughness were examined as functions of substrate temperature, precursor feed rate, and substrate surface condition. The film Nb/Ta ratio was well controlled by using an appropriate uniform mixture of lithium-niobium and lithium-tantalum alkoxide solutions. The epitaxy and crystallinity of the films were much improved when the film growth rate was raised from 20 to 180-380 nm/min, where the films with the (006) rocking curve full width at half maximum values as low as 0.12 deg. -0.2 deg. could be produced. The film roughness could be reduced by using a liquid precursor with higher metal concentrations, achieving the root-mean-square value on the order of 5 nm. The refractive indices of the films are in good correspondence with their composition and crystallinity

  11. Magneto-transport properties of oriented Mn{sub 2}CoAl films sputtered on thermally oxidized Si substrates

    Energy Technology Data Exchange (ETDEWEB)

    Xu, G. Z.; Du, Y.; Zhang, X. M.; Liu, E. K.; Wang, W. H., E-mail: wenhong.wang@iphy.ac.cn; Wu, G. H. [State Key Laboratory for Magnetism, Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing 100190 (China); Zhang, H. G. [College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124 (China)

    2014-06-16

    Spin gapless semiconductors are interesting family of materials by embracing both magnetism and semiconducting due to their unique band structure. Its potential application in future spintronics requires realization in thin film form. In this Letter, we report fabrication and transport properties of spin gapless Mn{sub 2}CoAl films prepared on thermally oxidized Si substrates by magnetron sputtering deposition. The films deposited at 673 K are well oriented to (001) direction and display a uniform-crystalline surface. Magnetotransport measurements on the oriented films reveal a semiconducting-like resistivity, small anomalous Hall conductivity, and linear magnetoresistance representative of the transport signatures of spin gapless semiconductors. The magnetic properties of the films have also been investigated and compared to that of bulk Mn{sub 2}CoAl, showing small discrepancy induced by the composition deviation.

  12. Induced thermal resistance in the mouse ear

    International Nuclear Information System (INIS)

    Law, M.P.; Coultas, P.G.; Field, S.B.

    1979-01-01

    The mouse ear (pinna) was used to investigate the effect of two hyperthermic treatments. Heating was by immersion in hot water at 43.5 0 C. A single treatment of about 50 minutes was required to cause necrosis in 50% of the ears treated. When heat treatment was given in two equal fractions the total heating time had to be increased if the interval between fractions was greater than four hours. By 24 hours a total treatment of about 100 minutes was required, indicating almost complete recovery from the first heating. Priming treatments at 43.5 0 C induced thermal resistance to a second heat treatment at 43.5 0 C. Maximum resistance was observed one day after a 20 minute priming and two days after a 40 minute priming, when the heating time had to be increased to 120 minutes, an increase by a factor of 2.4. Shorter priming treatments induced less resistance, the minimum heating time to produce an effect being two minutes. In all cases the effect decreased during the next four to five days. These results indicate that the reduced response of tissues to fractionated hyperthermia is due both to the repair of sublethal heat damage and induction of thermal resistance. (author)

  13. Improved resistance of chemically-modified nanocellulose against thermally-induced depolymerization.

    Science.gov (United States)

    Agustin, Melissa B; Nakatsubo, Fumiaki; Yano, Hiroyuki

    2017-05-15

    The study demonstrated the improvement in the resistance of nanocellulose against thermally-induced depolymerization by esterification with benzoyl (BNZ) and pivaloyl (PIV). The change in the degree of polymerization (DP) and molecular weight distribution (MWD) after thermal treatment in nitrogen and in air was investigated using viscometry and gel permeation chromatography. BNZ and PIV nanocellulose esters without α-hydrogens gave higher DP and narrower MWD than pure bacterial cellulose; and the acetyl and myristoyl esters, which possess α-hydrogens. Results also showed that when depolymerization is suppressed, thermal discoloration is also reduced. Resistance against depolymerization inhibits the formation of reducing ends which can be active sites for thermal discoloration. Finally, the findings suggest that benzoylation and pivaloylation can be an excellent modification technique to improve the thermal stability of nanocellulose. Copyright © 2017 Elsevier Ltd. All rights reserved.

  14. Roll-to-roll printed resistive WORM memory on a flexible substrate

    Science.gov (United States)

    Leppäniemi, Jaakko; Mattila, Tomi; Kololuoma, Terho; Suhonen, Mika; Alastalo, Ari

    2012-08-01

    The fabrication process and the operation characteristics of a fully roll-to-roll printed resistive write-once-read-many memory on a flexible substrate are presented. The low-voltage (memories from a high resistivity ‘0’ state to a low resistivity ‘1’ state is based on the rapid electrical sintering of bits containing silver nanoparticles. The bit ink is formulated by mixing two commercially available silver nanoparticle inks in order to tune the initial square resistance of the bits and to create a self-organized network of percolating paths. The electrical performance of the memories, including read and write characteristics, is described and the long-term stability of the less stable ‘0’ state is studied in different environmental conditions. The memories can find use in low-cost mass printing applications.

  15. Influence factors of the inter-nanowire thermal contact resistance in the stacked nanowires

    Science.gov (United States)

    Wu, Dongxu; Huang, Congliang; Zhong, Jinxin; Lin, Zizhen

    2018-05-01

    The inter-nanowire thermal contact resistance is important for tuning the thermal conductivity of a nanocomposite for thermoelectric applications. In this paper, the stacked copper nanowires are applied for studying the thermal contact resistance. The stacked copper nanowires are firstly made by the cold-pressing method, and then the nanowire stacks are treated by sintering treatment. With the effect of the volumetric fraction of nanowires in the stack and the influence of the sintering-temperature on the thermal contact resistance discussed, results show that: The thermal conductivity of the 150-nm copper nanowires can be enlarged almost 2 times with the volumetric fraction increased from 32 to 56% because of the enlarged contact-area and contact number of a copper nanowire. When the sintering temperature increases from 293 to 673 K, the thermal conductivity of the stacked 300-nm nanowires could be enlarged almost 2.5 times by the sintering treatment, because of the improved lattice property of the contact zone. In conclusion, application of a high volumetric fraction or/and a sintering-treatment are effectivity to tune the inter-nanowire thermal contact resistance, and thus to tailor the thermal conductivity of a nanowire network or stack.

  16. An Improvement in Thermal Modelling of Automated Tape Placement Process

    International Nuclear Information System (INIS)

    Barasinski, Anaies; Leygue, Adrien; Poitou, Arnaud; Soccard, Eric

    2011-01-01

    The thermoplastic tape placement process offers the possibility of manufacturing large laminated composite parts with all kinds of geometries (double curved i.e.). This process is based on the fusion bonding of a thermoplastic tape on a substrate. It has received a growing interest during last years because of its non autoclave abilities.In order to control and optimize the quality of the manufactured part, we need to predict the temperature field throughout the processing of the laminate. In this work, we focus on a thermal modeling of this process which takes in account the imperfect bonding existing between the different layers of the substrate by introducing thermal contact resistance in the model. This study is leaning on experimental results which inform us that the value of the thermal resistance evolves with temperature and pressure applied on the material.

  17. Electrochemical depositing rGO-Ti-rGO heterogeneous substrates with higher thermal conductivity and heat transfer performance compared to pure Ti.

    Science.gov (United States)

    Wang, Jing; Wang, Huatao; Zhang, Wenying; Yang, Xinyi; Wen, Guangwu; Wang, Yijie; Zhou, Weiwei

    2017-02-17

    Titanium (Ti) and its alloys are widely applied in many high strength, light weight applications, but their thermal conductivity is lower compared to that of other metals, which limits their further applications. In this paper, we demonstrated experimentally that rGO-Ti-rGO heterogeneous substrates with higher thermal conductivity, up to ∼38.8% higher than Ti, could be fabricated by electrochemical depositing rGO on their surface. The rGO layers are grown on the surface of Ti substrates, with appearance of bedclothes on the beds. The thickness of rGO layers is around 300-500 nm and around 600-1000 nm when deposited for 5 cycles and 10 cycles, respectively. According to the cooling experiment results, as-prepared Ti + rGO substrates can present excellent thermal conduction performance, and reduce the chip temperature close to 3.2 °C-13.1 °C lower than Ti alloy substrates with the heat flow density of 0.4-3.6 W cm -2 . Finally, the approach to electro-chemically deposit hundreds of nanometer rGO layers on the surface of Ti substrates can improve their thermal conductivity and heat transfer performance, which may have further application in the increasing thermal conduction of other metal-alloys, ceramics and polymers.

  18. Modulation characteristics of graphene-based thermal emitters

    Science.gov (United States)

    Mahlmeister, Nathan Howard; Lawton, Lorreta Maria; Luxmoore, Isaac John; Nash, Geoffrey Richard

    2016-01-01

    We have investigated the modulation characteristics of the emission from a graphene-based thermal emitter both experimentally and through simulations using finite element method modelling. Measurements were performed on devices containing square multilayer graphene emitting areas, with the devices driven by a pulsed DC drive current over a range of frequencies. Simulations show that the dominant heat path is from the emitter to the underlying substrate, and that the thermal resistance between the graphene and the substrate determines the modulation characteristics. This is confirmed by measurements made on devices in which the emitting area is encapsulated by hexagonal boron nitride.

  19. INVESTIGATION OF THERMAL BEHAVIOR OF MULTILAYERED FIRE RESISTANT STRUCTURE

    Directory of Open Access Journals (Sweden)

    R. GUOBYS

    2016-09-01

    Full Text Available This paper presents experimental and numerical investigations of thermal behavior under real fire conditions of new generation multilayered fire resistant structure (fire door, dimensions H × W × D: 2090 × 980 × 52 mm combining high strength and fire safety. This fire door consists of two steel sheets (thickness 1.5 and 0.7 mm with stone wool ( = 33 kg/m3, k = 0.037 W/mK, E = 5000 N/m2,  = 0.2 insulating layer in between. One surface of the structure was heated in fire furnace for specified period of time of 60 min. Temperature and deformation of opposite surface were measured from outside at selected measuring points during fire resistance test. Results are presented as temperature-time and thermal deformation-time graphs. Experimental results were compared with numerical temperature field simulation results obtained from SolidWorks®Simulation software. Numerical results were found to be in good agreement with experimental data. The percent differences between door temperatures from simulation and fire resistance test don’t exceed 8%. This shows that thermal behaviour of such multilayered structures can be investigated numerically, thus avoiding costly and time-consuming fire resistance tests. It is established that investigated structure should be installed in a way that places thicker steel sheet closer to the potential heat source than thinner one. It is also obtained that stone wool layer of higher density should be used to improve fire resistance of the structure.

  20. Thermal Performance Benchmarking: Annual Report

    Energy Technology Data Exchange (ETDEWEB)

    Feng, Xuhui [National Renewable Energy Laboratory (NREL), Golden, CO (United States). Transportation and Hydrogen Systems Center

    2017-10-19

    In FY16, the thermal performance of the 2014 Honda Accord Hybrid power electronics thermal management systems were benchmarked. Both experiments and numerical simulation were utilized to thoroughly study the thermal resistances and temperature distribution in the power module. Experimental results obtained from the water-ethylene glycol tests provided the junction-to-liquid thermal resistance. The finite element analysis (FEA) and computational fluid dynamics (CFD) models were found to yield a good match with experimental results. Both experimental and modeling results demonstrate that the passive stack is the dominant thermal resistance for both the motor and power electronics systems. The 2014 Accord power electronics systems yield steady-state thermal resistance values around 42- 50 mm to the 2nd power K/W, depending on the flow rates. At a typical flow rate of 10 liters per minute, the thermal resistance of the Accord system was found to be about 44 percent lower than that of the 2012 Nissan LEAF system that was benchmarked in FY15. The main reason for the difference is that the Accord power module used a metalized-ceramic substrate and eliminated the thermal interface material layers. FEA models were developed to study the transient performance of 2012 Nissan LEAF, 2014 Accord, and two other systems that feature conventional power module designs. The simulation results indicate that the 2012 LEAF power module has lowest thermal impedance at a time scale less than one second. This is probably due to moving low thermally conductive materials further away from the heat source and enhancing the heat spreading effect from the copper-molybdenum plate close to the insulated gate bipolar transistors. When approaching steady state, the Honda system shows lower thermal impedance. Measurement results of the thermal resistance of the 2015 BMW i3 power electronic system indicate that the i3 insulated gate bipolar transistor module has significantly lower junction

  1. Roll-to-roll printed resistive WORM memory on a flexible substrate

    International Nuclear Information System (INIS)

    Leppäniemi, Jaakko; Mattila, Tomi; Suhonen, Mika; Alastalo, Ari; Kololuoma, Terho

    2012-01-01

    The fabrication process and the operation characteristics of a fully roll-to-roll printed resistive write-once-read-many memory on a flexible substrate are presented. The low-voltage (<10 V) write operation of the memories from a high resistivity ‘0’ state to a low resistivity ‘1’ state is based on the rapid electrical sintering of bits containing silver nanoparticles. The bit ink is formulated by mixing two commercially available silver nanoparticle inks in order to tune the initial square resistance of the bits and to create a self-organized network of percolating paths. The electrical performance of the memories, including read and write characteristics, is described and the long-term stability of the less stable ‘0’ state is studied in different environmental conditions. The memories can find use in low-cost mass printing applications. (paper)

  2. Final Project Report for "Interfacial Thermal Resistance of Carbon Nanotubes”

    Energy Technology Data Exchange (ETDEWEB)

    Cumings, John [Univ. of Maryland, College Park, MD (United States)

    2016-04-15

    This report describes an ongoing project to comprehensively study the interfacial thermal boundary resistance (Kapitza resistance) of carbon nanotubes. It includes a list of publications, personnel supported, the overall approach, accomplishments and future plans.

  3. Using copper substrate to enhance the thermal conductivity of top-emission organic light-emitting diodes for improving the luminance efficiency and lifetime

    Science.gov (United States)

    Tsai, Yu-Sheng; Wang, Shun-Hsi; Chen, Chuan-Hung; Cheng, Chien-Lung; Liao, Teh-Chao

    2009-12-01

    The influence of heat dissipation on the performances of organic light-emitting diode (OLED) is investigated by measuring junction temperature and by calculating the rate of heat flow. The calculated rate of heat flow reveals that the key factors include the thermal conductivity, the substrate thickness, and the UV glue. Moreover, the use of copper substrate can effectively dissipate the joule heat, which then reduces the temperature gradient. Finally, it is shown that the use of a high thermal conductivity thinner substrate can enhance the thermal conductivity of OLED and the luminance efficiency as well.

  4. Surface-restrained growth of vertically aligned carbon nanotube arrays with excellent thermal transport performance.

    Science.gov (United States)

    Ping, Linquan; Hou, Peng-Xiang; Liu, Chang; Li, Jincheng; Zhao, Yang; Zhang, Feng; Ma, Chaoqun; Tai, Kaiping; Cong, Hongtao; Cheng, Hui-Ming

    2017-06-22

    A vertically aligned carbon nanotube (VACNT) array is a promising candidate for a high-performance thermal interface material in high-power microprocessors due to its excellent thermal transport property. However, its rough and entangled free tips always cause poor interfacial contact, which results in serious contact resistance dominating the total thermal resistance. Here, we employed a thin carbon cover to restrain the disorderly growth of the free tips of a VACNT array. As a result, all the free tips are seamlessly connected by this thin carbon cover and the top surface of the array is smoothed. This unique structure guarantees the participation of all the carbon nanotubes in the array in the heat transport. Consequently the VACNT array grown on a Cu substrate shows a record low thermal resistance of 0.8 mm 2 K W -1 including the two-sided contact resistances, which is 4 times lower than the best result previously reported. Remarkably, the VACNT array can be easily peeled away from the Cu substrate and act as a thermal pad with excellent flexibility, adhesive ability and heat transport capability. As a result the CNT array with a thin carbon cover shows great potential for use as a high-performance flexible thermal interface material.

  5. Dynamics of Preferential Substrate Recognition in HIV-1 Protease: Redefining the Substrate Envelope

    Science.gov (United States)

    Özen, Ayşegül; Haliloğlu, Türkan; Schiffer, Celia A.

    2011-01-01

    HIV-1 protease (PR) permits viral maturation by processing the Gag and Gag-Pro-Pol polyproteins. Though HIV-1 PR inhibitors (PIs) are used in combination antiviral therapy, the emergence of drug resistance has limited their efficacy. The rapid evolution of HIV-1 necessitates the consideration of drug resistance in novel drug-design strategies. Drug-resistant HIV-1 PR variants, while no longer efficiently inhibited, continue to efficiently hydrolyze the natural viral substrates. Though highly diverse in sequence, the HIV-1 PR substrates bind in a conserved three-dimensional shape we defined as the “substrate envelope”. We previously showed that resistance mutations arise where PIs protrude beyond the substrate envelope, as these regions are crucial for drug binding but not for substrate recognition. Here, we extend this model by considering the role of protein dynamics in the interaction of HIV-1 PR with its substrates. Seven molecular dynamics simulations of PR-substrate complexes were performed to estimate the conformational flexibility of substrates in their complexes. Interdependency of the substrate-protease interactions may compensate for the variations in cleavage-site sequences, and explain how a diverse set of sequences can be recognized as substrates by the same enzyme. This diversity may be essential for regulating sequential processing of substrates. We also define a dynamic substrate envelope as a more accurate representation of PR-substrate interactions. This dynamic substrate envelope, described by a probability distribution function, is a powerful tool for drug design efforts targeting ensembles of resistant HIV-1 PR variants with the aim of developing drugs that are less susceptible to resistance. PMID:21762811

  6. DWDM laser arrays fabricated using thermal nanoimprint lithography on Indium Phosphide substrates

    DEFF Research Database (Denmark)

    Smistrup, K.; Nørregaard, J.; Mironov, A.

    2013-01-01

    by including a lambda quarter shift at the center of the grating. The need for phase shifts and multiple wavelengths eliminates some lithography methods such as holography. Typically, these lasers are produced by e-beam lithography (EBL). We present a production method based on thermal nanoimprint lithography...... during the imprint process and the narrow temperature window for imprint and separation (80°C and 55°C) ensures minimal issues with thermal mismatch between the InP substrate and the Si stamp. The imprinted InP wafers were processed in NeoPhotonics standard process line to create working lasers...

  7. Bidirectional negative differential thermal resistance in three-segment Frenkel–Kontorova lattices

    International Nuclear Information System (INIS)

    Ou, Ya-li; Lu, Shi-cai; Hu, Cai-tian; Ai, Bao-quan

    2016-01-01

    By coupling three nonlinear 1D lattice segments, we demonstrate a thermal insulator model, where the system acts like an insulator for large temperature bias and a conductor for very small temperature bias. We numerically investigate the parameter range of the thermal insulator and find that the nonlinear response (the role of on-site potential), the weakly coupling interaction between each segment, and the small system size collectively contribute to the appearance of bidirectional negative differential thermal resistance (BNDTR). The corresponding exhibition of BNDTR can be explained in terms of effective phonon-band shifts. Our results can provide a new perspective for understanding the microscopic mechanism of negative differential thermal resistance and also would be conducive to further developments in designing and fabricating thermal devices and functional materials. (paper)

  8. Thermal conductivity of InAs quantum dot stacks using AlAs strain compensating layers on InP substrate

    International Nuclear Information System (INIS)

    Salman, S.; Folliot, H.; Le Pouliquen, J.; Chevalier, N.; Rohel, T.; Paranthoën, C.; Bertru, N.; Labbé, C.; Letoublon, A.; Le Corre, A.

    2012-01-01

    Highlights: ► The thermal conductivity of InAs on InP (1 1 3)B quantum dots stacks is measured. ► The growth of a close stack of 100 layers of InAs using AlAs strain compensating layers is presented. ► New data on the thermal conductivity of InP n-doped susbtrate are given. - Abstract: The growth and thermal conductivity of InAs quantum dot (QD) stacks embedded in GaInAs matrix with AlAs compensating layers deposited on (1 1 3)B InP substrate are presented. The effect of the strain compensating AlAs layer is demonstrated through Atomic Force Microscopy (AFM) and X-ray diffraction structural analysis. The thermal conductivity (2.7 W/m K at 300 K) measured by the 3ω method reveals to be clearly reduced in comparison with a bulk InGaAs layer (5 W/m K). In addition, the thermal conductivity measurements of S doped InP substrates and the SiN insulating layer used in the 3ω method in the 20–200 °C range are also presented. An empirical law is proposed for the S doped InP substrate, which slightly differs from previously presented results.

  9. High-Temperature Oxidation-Resistant and Low Coefficient of Thermal Expansion NiAl-Base Bond Coat Developed for a Turbine Blade Application

    Science.gov (United States)

    2003-01-01

    Many critical gas turbine engine components are currently made from Ni-base superalloys that are coated with a thermal barrier coating (TBC). The TBC consists of a ZrO2-based top coat and a bond coat that is used to enhance the bonding between the superalloy substrate and the top coat. MCrAlY alloys (CoCrAlY and NiCrAlY) are currently used as bond coats and are chosen for their very good oxidation resistance. TBC life is frequently limited by the oxidation resistance of the bond coat, along with a thermal expansion mismatch between the metallic bond coat and the ceramic top coat. The aim of this investigation at the NASA Glenn Research Center was to develop a new longer life, higher temperature bond coat by improving both the oxidation resistance and the thermal expansion characteristics of the bond coat. Nickel aluminide (NiAl) has excellent high-temperature oxidation resistance and can sustain a protective Al2O3 scale to longer times and higher temperatures in comparison to MCrAlY alloys. Cryomilling of NiAl results in aluminum nitride (AlN) formation that reduces the coefficient of thermal expansion (CTE) of the alloy and enhances creep strength. Thus, additions of cryomilled NiAl-AlN to CoCrAlY were examined as a potential bond coat. In this work, the composite alloy was investigated as a stand-alone substrate to demonstrate its feasibility prior to actual use as a coating. About 85 percent of prealloyed NiAl and 15 percent of standard commercial CoCrAlY alloys were mixed and cryomilled in an attritor with stainless steel balls used as grinding media. The milling was carried out in the presence of liquid nitrogen. The milled powder was consolidated by hot extrusion or by hot isostatic pressing. From the consolidated material, oxidation coupons, four-point bend, CTE, and tensile specimens were machined. The CTE measurements were made between room temperature and 1000 C in an argon atmosphere. It is shown that the CTE of the NiAl-AlN-CoCrAlY composite bond coat

  10. Thermal resistance of buffer layer in a ceramic wall of MHD generation channel

    International Nuclear Information System (INIS)

    Nomura, Osami; Ebata, Yoshihiro; Hijikata, Kenichi.

    1982-01-01

    A wal l model is composed for obtaining the thermal resistance of the buffer layer. A buffer layer of the model is consisted to an adhesive layer and a buffer body. The adhesive layer is made of a copper plate, which is 0.3 mm thick, and adhered to the element by Refractory Method. The adhesive layer is consisted to three layers, i.e., Cu, Cu 2 O and CuO. These three layers seems to give rise to the thermal resistance. The buffer body is made of nickel wires of which radious is 0.4 mm and purity is 99.7%. All of the nickel wires are assembled in one direction which is parallel to a center line of the element, and bundled all together. Occupation ratio of nickel is about 78% in a sectional area of the buffer body. One end of the buffer body is soldered to adhesive layer by silver solder and opposite and is soldered to holder by lead solder. An element of the model is made of magnesia ceramics of which purity is about 99.9% and porosity is about 3%. A holder of the model is made of copper block. Results are as follows: (1) Thermal resistance of the buffer layer is from 1.9 to 2.5K/(W/cm 2 ). (2) Thermal resistance of the adhesive layer is from 0.43 to 0.87K/(W/cm 2 ). (3) Thermal resistance of the buffer body is calculated to about 0.7K/(W/cm 2 ) under the estimation at which the heat flows in the nickel wires only. (4) From above results, thermal resistance of silver soldering layer seems to be same as that of the adhesive layers. The buffer layer needs more value of the thermal resistance in order to apply to the MHD generation channel. Value of the thermal resistance is easily satisfied by changing of material of the buffer body, increase of thickness of the buffer layer and etc. Then this wall appears to be useful to an MHD generation channel wall. (author)

  11. Development of Conformation Independent Computational Models for the Early Recognition of Breast Cancer Resistance Protein Substrates

    Directory of Open Access Journals (Sweden)

    Melisa Edith Gantner

    2013-01-01

    Full Text Available ABC efflux transporters are polyspecific members of the ABC superfamily that, acting as drug and metabolite carriers, provide a biochemical barrier against drug penetration and contribute to detoxification. Their overexpression is linked to multidrug resistance issues in a diversity of diseases. Breast cancer resistance protein (BCRP is the most expressed ABC efflux transporter throughout the intestine and the blood-brain barrier, limiting oral absorption and brain bioavailability of its substrates. Early recognition of BCRP substrates is thus essential to optimize oral drug absorption, design of novel therapeutics for central nervous system conditions, and overcome BCRP-mediated cross-resistance issues. We present the development of an ensemble of ligand-based machine learning algorithms for the early recognition of BCRP substrates, from a database of 262 substrates and nonsubstrates compiled from the literature. Such dataset was rationally partitioned into training and test sets by application of a 2-step clustering procedure. The models were developed through application of linear discriminant analysis to random subsamples of Dragon molecular descriptors. Simple data fusion and statistical comparison of partial areas under the curve of ROC curves were applied to obtain the best 2-model combination, which presented 82% and 74.5% of overall accuracy in the training and test set, respectively.

  12. Substrate effects on the characteristics of (In2O3)1-x (ZnO)x films

    International Nuclear Information System (INIS)

    Park, J. M.; Kim, J. J.; Kim, H. M.; Kim, J. H.; Ryu, S. W.; Park, S. H.; Ahn, J. S.

    2006-01-01

    The electrical and the optical properties of (In 2 O 3 ) 1-x (ZnO) x (IZO) films deposited by the rf magnetron sputtering on plastic substrates, such as polyethylene terephthalate (PET) and poly carbonate (PC), were investigated. The results are compared with those of IZO films deposited on a conventional coring glass (CG) substrate. The average transmittance of the IZO films deposited on plastic substrates is over 80 %, irrespective of the substrate, which is comparable to that of IZO films deposited on CG substrates. IZO films deposited on PC or PET substrates show larger resistivities than those deposited on CG substrates. This may be attributed to the fact that compositions, such as H 2 O or the organic solvent contained in the plastic substrates, are adsorbed into the IZO layer during sputtering. The surface resistance of the IZO films is nearly independent of the substrate and decreases with increasing deposition time. Compared to the IZO films deposited on PET substrates without hard coatings, those deposited on PET substrates with hard coatings show superior electrical stability for thermal environments.

  13. Fire Resistant, Moisture Barrier Membrane

    Science.gov (United States)

    St.Clair, Terry L. (Inventor)

    2000-01-01

    A waterproof and breathable, fire-resistant laminate is provided for use in tents, garments, shoes, and covers, especially in industrial, military and emergency situations. The laminate permits water vapor evaporation while simultaneously preventing liquid water penetration. Further, the laminate is fire-resistant and significantly reduces the danger of toxic compound production when exposed to flame or other high heat source. The laminate may be applied to a variety of substrates and is comprised of a silicone rubber and plurality of fire-resistant, inherently thermally-stable polyimide particles.

  14. Heat-resistant hydrophobic-oleophobic coatings

    OpenAIRE

    Uyanik, Mehmet; Arpac, Ertugrul; Schmidt, Helmut K.; Akarsu, Murat; Sayilkan, Funda; Sayilkan, Hikmet

    2006-01-01

    Thermally and chemically durable hydrophobic oleophobic coatings, containing different ceramic particles such as SiO2, SiC, Al 2O3, which can be alternative instead of Teflon, have been developed and applied on the aluminum substrates by spin-coating method. Polyimides, which are high-thermal resistant heteroaromatic polymers, were synthesized, and fluor oligomers were added to these polymers to obtain hydrophobic-oleophobic properties. After coating, Al surface was subjected to Taber-abrasio...

  15. Mechanical Properties and Thermal Shock Resistance Analysis of BNNT/Si3N4 Composites

    Science.gov (United States)

    Wang, Shouren; Wang, Gaoqi; Wen, Daosheng; Yang, Xuefeng; Yang, Liying; Guo, Peiquan

    2018-04-01

    BNNT/Si3N4 ceramic composites with different weight amount of BNNT fabricated by hot isostatic pressing were introduced. The mechanical properties and thermal shock resistance of the composites were investigated. The results showed that BNNT-added ceramic composites have a finer and more uniform microstructure than that of BNNT-free Si3N4 ceramic because of the retarding effect of BNNT on Si3N4 grain growth. The addition of 1.5 wt.% BNNT results in simultaneous increase in flexural strength, fracture toughness, and thermal shock resistance. The analysis of the results indicates that BNNT brings many thermal transport channels in the microstructure, increasing the efficiency of thermal transport, therefore results in increase of thermal shock resistance. In addition, BNNT improves the residual flexural strength of composites by crack deflection, bridging, branching and pinning, which increase the crack propagation resistance.

  16. Metal-Organic-Inorganic Nanocomposite Thermal Interface Materials with Ultralow Thermal Resistances.

    Science.gov (United States)

    Yegin, Cengiz; Nagabandi, Nirup; Feng, Xuhui; King, Charles; Catalano, Massimo; Oh, Jun Kyun; Talib, Ansam J; Scholar, Ethan A; Verkhoturov, Stanislav V; Cagin, Tahir; Sokolov, Alexei V; Kim, Moon J; Matin, Kaiser; Narumanchi, Sreekant; Akbulut, Mustafa

    2017-03-22

    As electronic devices get smaller and more powerful, energy density of energy storage devices increases continuously, and moving components of machinery operate at higher speeds, the need for better thermal management strategies is becoming increasingly important. The removal of heat dissipated during the operation of electronic, electrochemical, and mechanical devices is facilitated by high-performance thermal interface materials (TIMs) which are utilized to couple devices to heat sinks. Herein, we report a new class of TIMs involving the chemical integration of boron nitride nanosheets (BNNS), soft organic linkers, and a copper matrix-which are prepared by the chemisorption-coupled electrodeposition approach. These hybrid nanocomposites demonstrate bulk thermal conductivities ranging from 211 to 277 W/(m K), which are very high considering their relatively low elastic modulus values on the order of 21.2-28.5 GPa. The synergistic combination of these properties led to the ultralow total thermal resistivity values in the range of 0.38-0.56 mm 2 K/W for a typical bond-line thickness of 30-50 μm, advancing the current state-of-art transformatively. Moreover, its coefficient of thermal expansion (CTE) is 11 ppm/K, forming a mediation zone with a low thermally induced axial stress due to its close proximity to the CTE of most coupling surfaces needing thermal management.

  17. Lanthanum gallate substrates for epitaxial high-temperature superconducting thin films

    Science.gov (United States)

    Sandstrom, R. L.; Giess, E. A.; Gallagher, W. J.; Segmuller, A.; Cooper, E. I.

    1988-11-01

    It is demonstrated that lanthanum gallate (LaGaO3) has considerable potential as an electronic substrate material for high-temperature superconducting films. It provides a good lattice and thermal expansion match to YBa2Cu3O(7-x), can be grown in large crystal sizes, is compatible with high-temperature film processing, and has a reasonably low dielectric constant and low dielectric losses. Epitaxial YBa2Cu3O(7-x) films grown on LaGaO3 single-crystal substrates by three techniques have zero resistance between 87 and 91 K.

  18. The High-Temperature Resistance Properties of Polysiloxane/Al Coatings with Low Infrared Emissivity

    Directory of Open Access Journals (Sweden)

    Jun Zhao

    2018-03-01

    Full Text Available High-temperature-resistant coatings with low infrared emissivity were prepared using polysiloxane resin and flake aluminum as the adhesive and pigment, respectively. The heat resistance mechanisms of the polysiloxane/Al coating were systematically investigated. The composition, surface morphology, infrared reflectance spectra, and thermal expansion dimension (ΔL of the coatings were characterized by X-ray photoelectron spectroscopy (XPS, field emission scanning electron microscopy (FE-SEM, Fourier transform infrared spectroscopy, and thermal mechanical analysis (TMA, respectively. The results show that thermal decomposition of the resin and mismatch of ΔL between the coating and the substrate facilitate the high temperature failure of the coating. A suitable amount of flake aluminum pigments could restrain the thermal decomposition of the resin and could increase the match degree of ΔL between the coating and substrate, leading to an enhanced thermal resistance of the coating. Our results find that a coating with a pigment to binder ratio (P/B ratio of 1.0 could maintain integrity until 600 °C, and the infrared emissivity was as low as 0.27. Hence, a coating with high-temperature resistance and low emissivity was obtained. Such coatings can be used for infrared stealth technology or energy savings in high-temperature equipment.

  19. Investigation of the thermal resistance of timber attic spaces with reflective foil and bulk insulation, heat flow up

    Energy Technology Data Exchange (ETDEWEB)

    Belusko, M.; Bruno, F.; Saman, W. [Institute for Sustainable Systems and Technologies, University of South Australia, Mawson Lakes Boulevard, SA 5095 (Australia)

    2011-01-15

    An experimental investigation was undertaken in which the thermal resistance for the heat flow through a typical timber framed pitched roofing system was measured under outdoor conditions for heat flow up. The measured thermal resistance of low resistance systems such as an uninsulated attic space and a reflective attic space compared well with published data. However, with higher thermal resistance systems containing bulk insulation within the timber frame, the measured result for a typical installation was as low as 50% of the thermal resistance determined considering two dimensional thermal bridging using the parallel path method. This result was attributed to three dimensional heat flow and insulation installation defects, resulting from the design and construction method used. Translating these results to a typical house with a 200 m{sup 2} floor area, the overall thermal resistance of the roof was at least 23% lower than the overall calculated thermal resistance including two dimensional thermal bridging. When a continuous layer of bulk insulation was applied to the roofing system, the measured values were in agreement with calculated resistances representing a more reliable solution. (author)

  20. Thermal oxidation of seeds for the hydrothermal growth of WO3 nanorods on ITO glass substrate

    International Nuclear Information System (INIS)

    Ng, Chai Yan; Abdul Razak, Khairunisak; Lockman, Zainovia

    2015-01-01

    This work reports a simple seed formation method for the hydrothermal growth of tungsten oxide (WO 3 ) nanorods. A WO 3 seed layer was prepared by thermal oxidation, where a W-sputtered substrate was heated and oxidized in a furnace. Oxidation temperatures and periods were varied at 400–550 °C and 5–60 min, respectively, to determine an appropriate seed layer for nanorod growth. Thermal oxidation at 500 °C for 15 min was found to produce a seed layer with sufficient crystallinity and good adhesion to the substrate. These properties prevented the seed from peeling off during the hydrothermal process, thereby allowing nanorod growth on the seed. The nanorod film showed better electrochromic behavior (higher current density of − 1.11 and + 0.65 mA cm −2 ) than compact film (lower current density of − 0.54 and + 0.28 mA cm −2 ). - Highlights: • A simple seed formation method (thermal oxidation) on sputtered W film is reported. • Crystalline seed with good adhesion to substrate is required for nanorod growth. • The appropriate temperature and period for seed formation were 500 °C and 15 min. • WO 3 nanorods exhibited higher electrochromic current density than WO 3 compact film.

  1. Random walks in nanotube composites: Improved algorithms and the role of thermal boundary resistance

    International Nuclear Information System (INIS)

    Duong, Hai M.; Papavassiliou, Dimitrios V.; Lee, Lloyd L.; Mullen, Kieran J.

    2005-01-01

    Random walk simulations of thermal walkers are used to study the effect of interfacial resistance on heat flow in randomly dispersed carbon nanotube composites. The adopted algorithm effectively makes the thermal conductivity of the nanotubes themselves infinite. The probability that a walker colliding with a matrix-nanotube interface reflects back into the matrix phase or crosses into the carbon nanotube phase is determined by the thermal boundary (Kapitza) resistance. The use of 'cold' and 'hot' walkers produces a steady state temperature profile that allows accurate determination of the thermal conductivity. The effects of the carbon nanotube orientation, aspect ratio, volume fraction, and Kapitza resistance on the composite effective conductivity are quantified

  2. Corrosion Resistance Properties of Aluminum Coating Applied by Arc Thermal Metal Spray in SAE J2334 Solution with Exposure Periods

    Directory of Open Access Journals (Sweden)

    Han-Seung Lee

    2016-03-01

    Full Text Available Arc thermal metal spray coating provides excellent corrosion, erosion and wear resistance to steel substrates. This paper incorporates some results of aluminum coating applied by this method on plain carbon steel. Thereafter, coated panels were exposed to an environment known to form stable corrosion products with aluminum. The coated panels were immersed in Society of Automotive Engineers (SAE J2334 for different periods of time. This solution consists of an aqueous solution of NaCl, CaCl2 and NaHCO3. Various electrochemical techniques, i.e., corrosion potential-time, electrochemical impedance spectroscopy (EIS and the potentiodynamic were used to determine the performance of stimulants in improving the properties of the coating. EIS studies revealed the kinetics and mechanism of corrosion and potentiodynamic attributed the formation of a passive film, which stifles the penetration of aggressive ions towards the substrate. The corrosion products that formed on the coating surface, identified using Raman spectroscopy, were Dawsonite (NaAlCO3(OH2 and Al(OH3. These compounds of aluminum are very sparingly soluble in aqueous solution and protect the substrate from pitting and uniform corrosion. The morphology and composition of corrosion products determined by scanning electron microscopy and energy dispersive X-ray analyses indicated that the environment plays a decisive role in improving the corrosion resistance of aluminum coating.

  3. Recycled hydroxyapatite coatings on 316L stainless steel substrates

    International Nuclear Information System (INIS)

    Mendes Filho, Antonio Alves; Pereira, Renato Alves; Araujo, Fernando Gabriel da Silva; Sousa, Camila Mateus de

    2010-01-01

    In this work were evaluated recycled hydroxyapatite coatings on 316L stainless steel substrates by plasma thermal aspersion. The hydroxyapatite used was obtained from bovine bone by the hydrothermal method. The samples of hydroxyapatite powders were divided according to their particle size distribution. The adhesion of the powders coating to the substrate was evaluated by assay scratch. The X-ray diffraction techniques and scanning electron microscopy were also used. The results of scratch resistance were between 46N and 63N. Analysis by scanning electron microscopy and x-ray diffraction showed no cracks coatings, single-phase and with few fused particles. (author)

  4. Design of a Nickel-Based Bond-Coat Alloy for Thermal Barrier Coatings on Copper Substrates

    Directory of Open Access Journals (Sweden)

    Torben Fiedler

    2014-11-01

    Full Text Available To increase the lifetime of rocket combustion chambers, thermal barrier coatings (TBC may be applied on the copper chamber wall. Since standard TBC systems used in gas turbines are not suitable for rocket-engine application and fail at the interface between the substrate and bond coat, a new bond-coat material has to be designed. This bond-coat material has to be chemically compatible to the copper substrate to improve the adhesion and needs a coefficient of thermal expansion close to that of copper to reduce thermal stresses. One approach to achieve this is to modify the standard NiCrAlY alloy used in gas turbines by adding copper. In this work, the influence of copper on the microstructure of NiCrAlY-alloys is investigated with thermodynamical calculations, optical microscopy, SEM, EDX and calorimetry. Adding copper leads to the formation of a significant amount of \\(\\beta\\ and \\(\\alpha\\ Reducing the aluminum and chromium content leads furthermore to a two-phase fcc microstructure.

  5. Effect of Atomic Hydrogen on Preparation of Highly Moisture-Resistive SiNx Films at Low Substrate Temperatures

    Science.gov (United States)

    Heya, Akira; Niki, Toshikazu; Takano, Masahiro; Yonezawa, Yasuto; Minamikawa, Toshiharu; Muroi, Susumu; Minami, Shigehira; Izumi, Akira; Masuda, Atsushi; Umemoto, Hironobu; Matsumura, Hideki

    2004-12-01

    Highly moisture-resistive SiNx films on a Si substrate are obtained at substrate temperatures of 80°C by catalytic chemical vapor deposition (Cat-CVD) using a source gas with H2. Atomic hydrogen effected the selective etching of a weak-bond regions and an increase in atomic density induced by the energy of the surface reaction. It is concluded that Cat-CVD using H2 is a promising candidate for the fabrication of highly moisture-resistive SiNx films at low temperatures.

  6. Thermal, epithermal and thermalized neutron attenuation properties of ilmenite-serpentine heat resistant concrete shield

    International Nuclear Information System (INIS)

    Kany, A.M.I.; El-Gohary, M.I.; Kamal, S.M.

    1994-01-01

    Experimental measurements were carried out to study the attenuation properties of low-energy neutrons transmitted through unheated and preheated barriers of heavy-weight, highly hydrated and heat-resistant concrete shields. The concrete shields under investigation have been prepared from naturally occurring ilmenite and serpentine Egyptian ores. A collimated beam obtained from an Am-Be source was used as a source of neutrons, while the measurements of total thermal, epithermal, and thermalized neutron fluxes were performed using a BF-3 detector, multichannel analyzer and Cd filter. Results show that the ilmenite-serpentine concrete proved to be a better thermal, epithermal and thermalized neutron attenuator than the ordinary concrete especially at a high temperature of concrete exposure. (Author)

  7. Chromium–niobium co-doped vanadium dioxide films: Large temperature coefficient of resistance and practically no thermal hysteresis of the metal–insulator transition

    Directory of Open Access Journals (Sweden)

    Kenichi Miyazaki

    2016-05-01

    Full Text Available We investigated the effects of chromium (Cr and niobium (Nb co-doping on the temperature coefficient of resistance (TCR and the thermal hysteresis of the metal–insulator transition of vanadium dioxide (VO2 films. We determined the TCR and thermal-hysteresis-width diagram of the V1−x−yCrxNbyO2 films by electrical-transport measurements and we found that the doping conditions x ≳ y and x + y ≥ 0.1 are appropriate for simultaneously realizing a large TCR value and an absence of thermal hysteresis in the films. By using these findings, we developed a V0.90Cr0.06Nb0.04O2 film grown on a TiO2-buffered SiO2/Si substrate that showed practically no thermal hysteresis while retaining a large TCR of 11.9%/K. This study has potential applications in the development of VO2-based uncooled bolometers.

  8. Thermal spray deposition and evaluation of low-Z coatings

    International Nuclear Information System (INIS)

    Seals, R.D.; Swindeman, C.J.; White, R.L.

    1996-01-01

    Thermally sprayed low-Z coatings of B 4 C on Al substrates were investigated as candidate materials for first-wall reactor protective surfaces. Comparisons were made to thermally sprayed coatings of B, MgAl 2 O 4 , Al 2 O 3 , and composites. Graded bond layers were applied to mitigate coefficient of thermal expansion mismatch. Microstructures, thermal diffusivity before and after thermal shock loading, steel ball impact resistance, CO 2 pellet cleaning and erosion tolerance, phase content, stoichiometry by Rutherford backscattering spectroscopy, and relative tensile strengths were measured

  9. Erosion resistance and adhesion of composite metal/ceramic coatings produced by plasma spraying

    International Nuclear Information System (INIS)

    Ramm, D.A.J.; Hutchings, I.M.; Clyne, T.W.

    1993-01-01

    Ceramic coatings can exhibit greater erosion resistance than most metallic coatings. Such coatings are conveniently produced by thermal spraying. Unfortunately, thermally sprayed ceramic coatings often exhibit poor adhesion, partly as a consequence of the development of residual stresses during spraying and subsequent cooling. Composite coatings have been studied using aluminium/alumina deposits on steel substrates. The incorporation of ceramics within a ductile matrix has potential for sharply reducing the erosive wear at high erodent impact angles, whilst retaining the good erosion resistance of ceramics at low angles. It is shown that the proportion of metal and ceramic at the free surface can be specified so as to optimise the erosion resistance. Experiments have also been carried out on the resistance of the coatings to debonding during four-point bending of the coated substrate. Progress is being made towards the tailoring of composition profiles in graded coatings so as to optimise the combination of erosion resistance and adhesion. (orig.)

  10. Thermal resistance and conductivity of recycled construction and demolition waste (RCDW concrete blocks

    Directory of Open Access Journals (Sweden)

    Ivan Julio Apolonio Callejas

    Full Text Available Abstract In Brazil, studies to reuse construction and demolition waste are a special issue because a large amount of this material has been delivered to the public landfills and in illegal places. Some researchers have suggested reusing this material in building elements, such as bricks or blocks. It is possible to find a lot of researches in physical/mechanical characterization, while little effort has been made to characterize recycled construction and demolition waste blocks (RCDW for their thermal properties. The aim of this work was to characterize the RCDW thermal resistance and conductivity in order to provide subsidies for a building's thermal performance analysis. The hot-box method was adapted, together with measuring techniques with a heat-flow meter to determine the RCDW thermal properties. The results indicated that the RCDW block overall thermal resistance and thermal conductivity in the solid region was within the intervals of 0.33≤RT≤0.41m2KW-1 and 0.60≤l≤0.78Wm-1K-1, respectively. The lower resistance and conductivity values are justified by the presence of aggregate with a lower density and lower thermal conductivity than the natural aggregate.

  11. Influence of recrystallization on thermal shock resistance of various tungsten grades

    International Nuclear Information System (INIS)

    Uytdenhouwen, I.; Decreton, M.; Hirai, T.; Linke, J.; Pintsuk, G.; Oost, G. van

    2007-01-01

    Thermal shock resistance of various tungsten grades (different manufacturing technologies and heat treatments) was examined under plasma disruption conditions, especially in the cracking regime, i.e. below the melting threshold. The tests have been simulated with the electron beam test facility JUDITH. The comparison of the thermal shock resistance showed that sintered tungsten appeared to be better than the deformed tungsten material and clear degradation after recrystallization was found. Damage processes linked to the mechanical properties of W are discussed

  12. The Kapitza thermal boundary resistance between two solids

    International Nuclear Information System (INIS)

    Andersen, A.C.

    1981-01-01

    In this article, the author develops a model of the Kapitza resistance between two solids in which this resistance is seen to be related to the refraction of thermal phonons at the interface, which is a function of the accoustic properties of the two solids. By calculating a kapitza boundary resistance for the two solids in an ideal case (with ideal temperature, ideal interface, and phonon scattering produced only by the interface) and then producing a summation of the three phonon modes, the angles of incidence, and the phonon frequencies, the author produces an equation which expresses the resistance; this equation is known as the accoustic-mis-match model. By then removing the conditions of ideality and adjusting the equation accordingly, the author finds that the acoustic mismatch model is successful in describing the resistance behavior

  13. Consistent effects of a major QTL for thermal resistance in field-released Drosophila melanogaster

    DEFF Research Database (Denmark)

    Loeschcke, Volker; Kristensen, Torsten Nygård; Norry, Fabian M

    2011-01-01

    Molecular genetic markers can be used to identify quantitative trait loci (QTL) for thermal resistance and this has allowed characterization of a major QTL for knockdown resistance to high temperature in Drosophila melanogaster. The QTL showed trade-off associations with cold resistance under lab...... of field fitness at different environmental temperatures with genotypic variation in a QTL for thermal tolerance. Graphical abstract...

  14. Tailoring the contact thermal resistance at metal-carbon nanotube interface

    Energy Technology Data Exchange (ETDEWEB)

    Firkowska, Izabela; Boden, Andre; Vogt, Anna-Maria; Reich, Stephanie [Department of Physics, Freie Universitaet, Arnimallee 14, 14195 Berlin (Germany)

    2011-11-15

    Copper-decorated carbon nanotubes (CNTs) were synthesized and used as conductive filler to improve the heat transport capabilities of copper matrix. Thermal properties, i.e., thermal diffusivity and thermal conductivity, of copper composite were measured and compared with those containing pristine and functionalized CNTs. Experimental results revealed that composites enriched with nanohybrids where Cu nanoparticles were covalently bonded to CNTs had thermal conductivity four times higher than those containing the same content of pristine CNTs. Evaluation of thermal interface resistance in copper-CNTs composites by means of the flash method. (Copyright copyright 2011 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  15. ITO films with enhanced electrical properties deposited on unheated ZnO-coated polymer substrates

    International Nuclear Information System (INIS)

    Nunes de Carvalho, C.; Lavareda, G.; Fortunato, E.; Alves, H.; Goncalves, A.; Varela, J.; Nascimento, R.; Amaral, A.

    2005-01-01

    Indium tin oxide (ITO) films were deposited by radio frequency (rf)-plasma enhanced reactive thermal evaporation (rf-PERTE) at room temperature on intrinsic ZnO/polymer substrates to enhance their electrical and structural properties. The polymer substrate used is polyethylene terephthalate (PET). The thickness of the ZnO films varied in the range 50-150 nm. The average thickness of the ITO films is of about 170 nm. Results show that ITO deposited on bare PET substrates exhibit: an average visible transmittance of about 85% and an electrical resistivity of 5.6 x 10 -2 Ω cm. ITO on ZnO/PET substrates show the optical quality practically preserved and the resistivity decreased to a minimum value of 1.9x10 -3 Ω cm for ZnO layers 125 nm thick. The electrical properties of ITO on ZnO/PET are largely improved by the increase in carrier mobility

  16. Energy shift and Casimir-Polder force for an atom out of thermal equilibrium near a dielectric substrate

    Science.gov (United States)

    Zhou, Wenting; Yu, Hongwei

    2014-09-01

    We study the energy shift and the Casimir-Polder force of an atom out of thermal equilibrium near the surface of a dielectric substrate. We first generalize, adopting the local source hypothesis, the formalism proposed by Dalibard, Dupont-Roc, and Cohen-Tannoudji [J. Phys. (Paris) 43, 1617 (1982), 10.1051/jphys:0198200430110161700; J. Phys. (Paris) 45, 637 (1984), 10.1051/jphys:01984004504063700], which separates the contributions of thermal fluctuations and radiation reaction to the energy shift and allows a distinct treatment of atoms in the ground and excited states, to the case out of thermal equilibrium, and then we use the generalized formalism to calculate the energy shift and the Casimir-Polder force of an isotropically polarizable neutral atom. We identify the effects of the thermal fluctuations that originate from the substrate and the environment and discuss in detail how the Casimir-Polder force out of thermal equilibrium behaves in three different distance regions in both the low-temperature limit and the high-temperature limit for both the ground-state and excited-state atoms, with special attention devoted to the distinctive features as opposed to thermal equilibrium. In particular, we recover the distinctive behavior of the atom-wall force out of thermal equilibrium at large distances in the low-temperature limit recently found in a different theoretical framework, and furthermore we give a concrete region where this behavior holds.

  17. Effects of striated laser tracks on thermal fatigue resistance of cast iron samples with biomimetic non-smooth surface

    International Nuclear Information System (INIS)

    Tong, Xin; Zhou, Hong; Liu, Min; Dai, Ming-jiang

    2011-01-01

    In order to enhance the thermal fatigue resistance of cast iron materials, the samples with biomimetic non-smooth surface were processed by Neodymium:Yttrium Aluminum Garnet (Nd:YAG) laser. With self-controlled thermal fatigue test method, the thermal fatigue resistance of smooth and non-smooth samples was investigated. The effects of striated laser tracks on thermal fatigue resistance were also studied. The results indicated that biomimetic non-smooth surface was benefit for improving thermal fatigue resistance of cast iron sample. The striated non-smooth units formed by laser tracks which were vertical with thermal cracks had the best propagation resistance. The mechanisms behind these influences were discussed, and some schematic drawings were introduced to describe them.

  18. Microstructure and Wear Resistance of Composite Coating by Laser Cladding Al/TiN on the Ti-6Al-4V Substrate

    Science.gov (United States)

    Zhang, H. X.; Yu, H. J.; Chen, C. Z.

    2015-05-01

    The composite coatings were fabricated by laser cladding Al/TiN pre-placed powders on Ti-6Al-4V substrate for enhancing wear resistance and hardness of the substrate. The composite coatings were analyzed by means of X-ray diffraction (XRD), scanning electron microscope (SEM) and energy dispersive spectrometer (EDS). The sliding wear tests were performed by MM200 wear test machine. The hardness of the coatings was tested by HV-1000 hardness tester. After laser cladding, it was found that there was a good metallurgical bond between the coating and the substrate. The composite coatings were mainly composed of the matrix of β-Ti (Al) and the reinforcements of titanium nitride (TiN), Ti3Al, TiAl and Al3Ti. The hardness and wear resistance of the coatings on four samples were greatly improved, among which sample 4 exhibited the highest hardness and best wear resistance. The hardness of the coating on sample 4 was approximately 2.5 times of the Ti-6Al-4V substrate. And the wear resistance of sample 4 was four times of the substrate.

  19. Sub-picowatt/kelvin resistive thermometry for probing nanoscale thermal transport.

    Science.gov (United States)

    Zheng, Jianlin; Wingert, Matthew C; Dechaumphai, Edward; Chen, Renkun

    2013-11-01

    Advanced instrumentation in thermometry holds the key for experimentally probing fundamental heat transfer physics. However, instrumentation with simultaneously high thermometry resolution and low parasitic heat conduction is still not available today. Here we report a resistive thermometry scheme with ~50 μK temperature resolution and ~0.25 pW/K thermal conductance resolution, which is achieved through schemes using both modulated heating and common mode noise rejection. The suspended devices used herein have been specifically designed to possess short thermal time constants and minimal attenuation effects associated with the modulated heating current. Furthermore, we have systematically characterized the parasitic background heat conductance, which is shown to be significantly reduced using the new device design and can be effectively eliminated using a "canceling" scheme. Our results pave the way for probing fundamental nanoscale thermal transport processes using a general scheme based on resistive thermometry.

  20. Assessing population and environmental effects on thermal resistance in Drosophila melanogaster using ecologically relevant assays

    DEFF Research Database (Denmark)

    Overgaard, Johannes; Hoffmann, Ary A; Kristensen, Torsten Nygård

    2011-01-01

    To make laboratory studies of thermal resistance in ectotherms more ecologically relevant, temperature changes that reflect conditions experienced by individuals in nature should be used. Here we describe an assay that is useful for quantifying multiple measures of thermal resistance of individual...... adult flies. We use this approach to assess upper and lower thermal limits and functional thermal scope for Drosophila melanogaster and also show that the method can be used to (1) detect a previously described latitudinal cline for cold tolerance in D. melanogaster populations collected along the east...... thermal environments have wider thermal limits compared to those from the less variable tropics, at least when flies were reared under constant temperature conditions and (4) demonstrate that different measures of cold resistance are often not strongly correlated. Based on our findings, we suggest...

  1. Comparison of structural properties of thermally evaporated CdTe thin films on different substrates

    International Nuclear Information System (INIS)

    Tariq, G.H.; Anis-ur-Rehman, M.

    2011-01-01

    The direct energy band gap in the range of 1.5 eV and the high absorption coefficient (105 cm/sup -1/) makes Cadmium Telluride (CdTe) a suitable material for fabrication of thin film solar cells. Thin film solar cells based on CdTe (1 cm area) achieved efficiency of 15.6% on a laboratory scale. CdTe thin films were deposited by thermal evaporation technique under vacuum 2 X 10/sup -5/mbar on glass and stainless steel (SS) substrates. During deposition substrates temperature was kept same at 200 deg. C for all samples. The structural properties were determined by the X-ray Diffraction (XRD) patterns. All samples exhibit polycrystalline nature. Dependence of different structural parameters such as lattice parameter, micro strain, and grain size and dislocation density on thickness was studied. Also the influence of the different substrates on these parameters was investigated. The analysis showed that the preferential orientation of films was dependent on the substrate type. (author)

  2. Solvent-resistant organic transistors and thermally stable organic photovoltaics based on cross-linkable conjugated polymers

    KAUST Repository

    Kim, Hyeongjun; Han, A. Reum; Cho, Chulhee; Kang, Hyunbum; Cho, Hanhee; Lee, Mooyeol; Frechet, Jean; Oh, Joonhak; Kim, Bumjoon

    2012-01-01

    organic electronics with air stability, solvent resistance, and thermal stability. Herein, we have developed a simple but powerful approach to achieve solvent-resistant and thermally stable organic electronic devices with a remarkably improved air

  3. Lanthanum gallate substrates for epitaxial high-temperature superconducting thin films

    International Nuclear Information System (INIS)

    Sandstrom, R.L.; Giess, E.A.; Gallagher, W.J.; Segmueller, A.; Cooper, E.I.; Chisholm, M.F.; Gupta, A.; Shinde, S.; Laibowitz, R.B.

    1988-01-01

    We demonstrate that lanthanum gallate (LaGaO 3 ) has considerable potential as an electronic substrate material for high-temperature superconducting films. It provides a good lattice and thermal expansion match to YBa 2 Cu 3 O/sub 7-//sub x/, can be grown in large crystal sizes, is compatible with high-temperature film processing, and has a reasonably low dielectric constant (ε≅25) and low dielectric losses. Epitaxial YBa 2 Cu 3 O/sub 7-//sub x/ films grown on LaGaO 3 single-crystal substrates by three techniques have zero resistance between 87 and 91 K

  4. Development of the variety for resistance against bacterial leaf-blight in rice with thermal neutrons

    International Nuclear Information System (INIS)

    Nakai, Hirokazu

    1990-01-01

    In search for the development of genes for resistance against bacterial leaf-blight in rice, thermal neutrons generated from the Research Reactor at the Kyoto University have been applied to the breeding. In this paper, the developmental outcome is described, and a potential application of thermal neutrons for breeding the variety of resistance against bacterial leaf-blight in rice is reviewed. When thermal neutrons were delivered to the rice, the ratio of absorbed doses by B-10, which is contained in a small quantity in the plant, was found to be larger than expected. This implies characteristic effects of thermal neutrons on the plant. When boric acid was incorporated into the plant before irradiation, the effect of thermal neutrons per irradiation time was considered to become great. The frequency of mutations for resistance was significantly higher by thermal neutron, as compared with that induced by other mutagens, such as gamma radiation, ethylene-imine, ethyl-methane-sulfonate, and nitroso-methyl-urea. Genetic analysis of mutants for resistance revealed recessive genes and polygenes. Finally, the application of thermal neutrons and other radiations would contribute greatly to a resolution of serious pollution problems in global food and environment. (N.K.)

  5. Crystallization and growth of Ni-Si alloy thin films on inert and on silicon substrates

    Science.gov (United States)

    Grimberg, I.; Weiss, B. Z.

    1995-04-01

    The crystallization kinetics and thermal stability of NiSi2±0.2 alloy thin films coevaporated on two different substrates were studied. The substrates were: silicon single crystal [Si(100)] and thermally oxidized silicon single crystal. In situ resistance measurements, transmission electron microscopy, x-ray diffraction, Auger electron spectroscopy, and Rutherford backscattering spectroscopy were used. The postdeposition microstructure consisted of a mixture of amorphous and crystalline phases. The amorphous phase, independent of the composition, crystallizes homogeneously to NiSi2 at temperatures lower than 200 °C. The activation energy, determined in the range of 1.4-2.54 eV, depends on the type of the substrate and on the composition of the alloyed films. The activation energy for the alloys deposited on the inert substrate was found to be lower than for the alloys deposited on silicon single crystal. The lowest activation energy was obtained for nonstoichiometric NiSi2.2, the highest for NiSi2—on both substrates. The crystallization mode depends on the structure of the as-deposited films, especially the density of the existing crystalline nuclei. Substantial differences were observed in the thermal stability of the NiSi2 compound on both substrates. With the alloy films deposited on the Si substrate, only the NiSi2 phase was identified after annealing to temperatures up to 800 °C. In the films deposited on the inert substrate, NiSi and NiSi2 phases were identified when the Ni content in the alloy exceeded 33 at. %. The effects of composition and the type of substrate on the crystallization kinetics and thermal stability are discussed.

  6. Thermal oxidation of seeds for the hydrothermal growth of WO{sub 3} nanorods on ITO glass substrate

    Energy Technology Data Exchange (ETDEWEB)

    Ng, Chai Yan [School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang (Malaysia); Department of Mechanical and Material Engineering, Lee Kong Chian Faculty of Engineering and Science, Universiti Tunku Abdul Rahman, Jalan Sungai Long, Bandar Sungai Long, Cheras, 43000 Kajang, Selangor (Malaysia); Abdul Razak, Khairunisak, E-mail: khairunisak@usm.my [School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang (Malaysia); NanoBiotechnology Research and Innovation (NanoBRI), Institute for Research in Molecular Medicine (INFORMM), Universiti Sains Malaysia, 11800 USM, Penang (Malaysia); Lockman, Zainovia, E-mail: zainovia@usm.my [School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang (Malaysia)

    2015-11-30

    This work reports a simple seed formation method for the hydrothermal growth of tungsten oxide (WO{sub 3}) nanorods. A WO{sub 3} seed layer was prepared by thermal oxidation, where a W-sputtered substrate was heated and oxidized in a furnace. Oxidation temperatures and periods were varied at 400–550 °C and 5–60 min, respectively, to determine an appropriate seed layer for nanorod growth. Thermal oxidation at 500 °C for 15 min was found to produce a seed layer with sufficient crystallinity and good adhesion to the substrate. These properties prevented the seed from peeling off during the hydrothermal process, thereby allowing nanorod growth on the seed. The nanorod film showed better electrochromic behavior (higher current density of − 1.11 and + 0.65 mA cm{sup −2}) than compact film (lower current density of − 0.54 and + 0.28 mA cm{sup −2}). - Highlights: • A simple seed formation method (thermal oxidation) on sputtered W film is reported. • Crystalline seed with good adhesion to substrate is required for nanorod growth. • The appropriate temperature and period for seed formation were 500 °C and 15 min. • WO{sub 3} nanorods exhibited higher electrochromic current density than WO{sub 3} compact film.

  7. Decay and termite resistance, water absorption and swelling of thermally compressed wood panels

    Science.gov (United States)

    Oner Unsal; S. Nami Kartal; Zeki Candan; Rachel A. Arango; Carol A. Clausen; Frederick Green

    2009-01-01

    This study evaluated decay and termite resistance of thermally compressed pine wood panels under pressure at either 5 or 7 MPa and either 120 or 150 °C for 1 h. Wood specimens from the panels were exposed to laboratory decay resistance by using the wood degrading fungi, Gloeophyllum trabeum and Trametes versicolor. The thermal compression process caused increases in...

  8. Thermal and mechanical properties of lead-free SnZn–xNa casting alloys, and interfacial chemistry on Cu substrates during the soldering process

    Energy Technology Data Exchange (ETDEWEB)

    Gancarz, Tomasz, E-mail: tomasz.gancarz@imim.pl [Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Krakow (Poland); Bobrowski, Piotr; Pstruś, Janusz [Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Krakow (Poland); Pawlak, Sylwia [Wroclaw Research Centre EIT+, Wroclaw (Poland)

    2016-09-15

    The microstructural features, thermal properties and mechanical properties of eutectic Sn–Zn alloys with varying Na content (0.1, 0.2, 0.5, 1.0 3.0 and 5.0 at. %) were examined in this study. In the scanning electron microscopy, transmission electron microscopy, and X-ray diffraction analysis data, precipitates of NaSn were observed. The addition of Na to eutectic Sn–Zn alloy improved the mechanical properties and increased electrical resistivity, and reduced the coefficient of thermal expansion; however, the melting point did not change. Wettability tests carried out using Na-doped Sn–15Zn alloys on Cu substrates showed the formation of Cu–Zn phases at the interfaces. Wettability studies were performed using flux ALU33 after 60, 180, 480, 900, 1800 and 3600 s of contact, at temperatures of 230, 250, 280 and 320 °C. The experiments were designed to demonstrate the effect of Na addition on the formation and growth kinetics of Cu{sub 5}Zn{sub 8} and CuZn{sub 4} phases, which were identified using XRDs and EDS. The addition of Na to SnZn causes a reduction in the thickness of the intermetallic compounds layer created at the interface between the liquid solder and the Cu substrate, and an increase in the activation energy of the Cu{sub 5}Zn{sub 8} phase compared to eutectic SnZn. - Highlights: • Precipitates of NaSn was observed and confirmed using TEM and XRD. • Addition Na to eutectic SnZn cussed increased the mechanical properties. • IMCs of Na–Zn and Na–Sn increased electrical resistivity and reduced the CTE. • IMCs layers CuZn{sub 4} and Cu{sub 5}Zn{sub 8} was found at the interface. • Na content changing the character of growth CuZn{sub 4} layer in SnZnNa alloys.

  9. Sustainably Sourced, Thermally Resistant, Radiation Hard Biopolymer

    Science.gov (United States)

    Pugel, Diane

    2011-01-01

    This material represents a breakthrough in the production, manufacturing, and application of thermal protection system (TPS) materials and radiation shielding, as this represents the first effort to develop a non-metallic, non-ceramic, biomaterial-based, sustainable TPS with the capability to also act as radiation shielding. Until now, the standing philosophy for radiation shielding involved carrying the shielding at liftoff or utilizing onboard water sources. This shielding material could be grown onboard and applied as needed prior to different radiation landscapes (commonly seen during missions involving gravitational assists). The material is a bioplastic material. Bioplastics are any combination of a biopolymer and a plasticizer. In this case, the biopolymer is a starch-based material and a commonly accessible plasticizer. Starch molecules are composed of two major polymers: amylase and amylopectin. The biopolymer phenolic compounds are common to the ablative thermal protection system family of materials. With similar constituents come similar chemical ablation processes, with the potential to have comparable, if not better, ablation characteristics. It can also be used as a flame-resistant barrier for commercial applications in buildings, homes, cars, and heater firewall material. The biopolymer is observed to undergo chemical transformations (oxidative and structural degradation) at radiation doses that are 1,000 times the maximum dose of an unmanned mission (10-25 Mrad), indicating that it would be a viable candidate for robust radiation shielding. As a comparison, the total integrated radiation dose for a three-year manned mission to Mars is 0.1 krad, far below the radiation limit at which starch molecules degrade. For electron radiation, the biopolymer starches show minimal deterioration when exposed to energies greater than 180 keV. This flame-resistant, thermal-insulating material is non-hazardous and may be sustainably sourced. It poses no hazardous

  10. The Effect of Thermal Fluctuation on the Receptor-Mediated Adhesion of a Cell Membrane to an Elastic Substrate

    Directory of Open Access Journals (Sweden)

    Bahador Marzban

    2017-04-01

    Full Text Available Mechanics of the bilayer membrane play an important role in many biological and bioengineering problems such as cell–substrate and cell–nanomaterial interactions. In this work, we study the effect of thermal fluctuation and the substrate elasticity on the cell membrane–substrate adhesion. We model the adhesion of a fluctuating membrane on an elastic substrate as a two-step reaction comprised of the out-of-plane membrane fluctuation and the receptor–ligand binding. The equilibrium closed bond ratio as a function of substrate rigidity was computed by developing a coupled Fourier space Brownian dynamics and Monte Carlo method. The simulation results show that there exists a crossover value of the substrate rigidity at which the closed bond ratio is maximal.

  11. Investigation on the effect of thermal resistances on a highly concentrated photovoltaic-thermoelectric hybrid system

    International Nuclear Information System (INIS)

    Zhang, Jin; Xuan, Yimin

    2016-01-01

    Highlights: • The highly concentrated PV-TE hybrid system is studied. • The performances of different cooling systems are analyzed and compared. • Sandwiching a copper plate between the PV and TE can improve the efficiency. • Four thermal design principles of the system are proposed. - Abstract: A thermal analysis of a highly concentrated photovoltaic-thermoelectric (PV-TE) hybrid system is carried out in this paper. Both the output power and the temperature distribution in the hybrid system are calculated by means of a three-dimensional numerical model. Three possible approaches for designing the highly concentrated PV-TE hybrid system are presented by analyzing the thermal resistance of the whole system. First, the sensitivity analysis shows that the thermal resistance between the TE module and the environment has a more great effect on the output power than the thermal resistance between the PV and the TE. The influence of the natural convection and the radiation can be ignored for the highly concentrated PV-TE hybrid system. Second, it is necessary to sandwich a copper plate between the PV and the TE for decreasing the thermal resistance between the PV and the TE. The role of the copper plate is to improve the temperature uniformity. Third, decreasing the area of PV cells can improve the efficiency of the highly concentrated PV-TE hybrid system. It should be pointed out that decreasing the area of PV cells also increases the total thermal resistance, but the raise of the efficiency is caused by the reduction of the heat transfer rate of the system. Therefore, the principle of minimizing the total thermal resistance may not be suitable for optimizing the area of PV cells.

  12. Applications of fibrous substrates containing insolubilized phase change polymers

    Science.gov (United States)

    Vigo, Tyrone L.; Bruno, Joseph S.

    1993-01-01

    Incorporation of polyethylene glycols into fibrous substrates produces several improved functional properties when they are insolubilized by crosslinking with a methylolamide resin or by polyacetal formation by their reaction with glyoxal. The range of molecular weights of polyols that may be insolubilized is broad as are the curing conditions (0.25-10 min at 80-200C). Most representative fiber types and blends (natural and synthetic) and all types of fabric constructions (woven, nonwoven and knit) have been modified by incorporation of the bound polyols. The most novel property is the thermal adaptability of the modified substrates to many climatic conditions. This adaptability is due to the high latent heat of the crosslinked polyols that function as phase change materials, the hydrophilic nature of the crosslinked polymer and its enhanced thermal conductivity. Other enhanced properties imparted to fabrics include flex and flat abrasion, antimicrobial activity, reduced static charge, resistance to oily soils, resiliency, wind resistance and reduced lint loss. Applications commercialized in the U.S. and Japan include sportswear and skiwear. Several examples of electric sets of properties useful for specific end uses are given. In addition, other uses are biomedical horticultural, aerospace, indoor insulation, automotive interiors and components and packaging material.

  13. Applications of fibrous substrates containing insolubilized phase change polymers

    Science.gov (United States)

    Vigo, Tyrone L.; Bruno, Joseph S.

    1993-02-01

    Incorporation of polyethylene glycols into fibrous substrates produces several improved functional properties when they are insolubilized by crosslinking with a methylolamide resin or by polyacetal formation by their reaction with glyoxal. The range of molecular weights of polyols that may be insolubilized is broad as are the curing conditions (0.25-10 min at 80-200C). Most representative fiber types and blends (natural and synthetic) and all types of fabric constructions (woven, nonwoven and knit) have been modified by incorporation of the bound polyols. The most novel property is the thermal adaptability of the modified substrates to many climatic conditions. This adaptability is due to the high latent heat of the crosslinked polyols that function as phase change materials, the hydrophilic nature of the crosslinked polymer and its enhanced thermal conductivity. Other enhanced properties imparted to fabrics include flex and flat abrasion, antimicrobial activity, reduced static charge, resistance to oily soils, resiliency, wind resistance and reduced lint loss. Applications commercialized in the U.S. and Japan include sportswear and skiwear. Several examples of electric sets of properties useful for specific end uses are given. In addition, other uses are biomedical horticultural, aerospace, indoor insulation, automotive interiors and components and packaging material.

  14. Analysis of Printing Substrate, Ink Age and Number of IR Drying Influence on Electrical Resistance of Conductive Inks

    Directory of Open Access Journals (Sweden)

    Josip Jerić

    2015-05-01

    Full Text Available As a result of availability of new technologies, functional printing as a segment has become one of the most interesting directions of research and development in graphic technology. Conductive inks are not a novelty and they already have broad possibilities in production of everyday products. There is still a big market for the broadening of their use, as well as a possibility of further enhancing their properties. This paper analyzes the influence of printing substrate, age of ink and the number of IR drying on the electrical resistance of the conductive inks. In the paper, subject of analysis was the change of electrical resistance in the line that was 9 cm long and 10 typographic points wide. The semi-automated screen-printing machine was used for printing. Three types of printing substrates were used; uncoated, coated and recycled paper. Two types of inks were used; newly opened ink and ink that was out of date for half year. After the printing, prints were dried using the IR dryer. Prints were dried once, and then additional three times. After the first and last drying, multimeter was used to measure electrical resistance of the lines. Analysis of the data shows that the older ink produces prints with higher electrical resistance. There are also notable differences in the electrical resistance based on the printing substrate.

  15. Assessing thermal conductivity of composting reactor with attention on varying thermal resistance between compost and the inner surface.

    Science.gov (United States)

    Wang, Yongjiang; Niu, Wenjuan; Ai, Ping

    2016-12-01

    Dynamic estimation of heat transfer through composting reactor wall was crucial for insulating design and maintaining a sanitary temperature. A model, incorporating conductive, convective and radiative heat transfer mechanisms, was developed in this paper to provide thermal resistance calculations for composting reactor wall. The mechanism of thermal transfer from compost to inner surface of structural layer, as a first step of heat loss, was important for improving insulation performance, which was divided into conduction and convection and discussed specifically in this study. It was found decreasing conductive resistance was responsible for the drop of insulation between compost and reactor wall. Increasing compost porosity or manufacturing a curved surface, decreasing the contact area of compost and the reactor wall, might improve the insulation performance. Upon modeling of heat transfers from compost to ambient environment, the study yielded a condensed and simplified model that could be used to conduct thermal resistance analysis for composting reactor. With theoretical derivations and a case application, the model was applicable for both dynamic estimation and typical composting scenario. Copyright © 2016 Elsevier Ltd. All rights reserved.

  16. Crystal Structure of the Substrate-Binding Domain from Listeria monocytogenes Bile-Resistance Determinant BilE

    Directory of Open Access Journals (Sweden)

    Stephanie J. Ruiz

    2016-12-01

    Full Text Available BilE has been reported as a bile resistance determinant that plays an important role in colonization of the gastrointestinal tract by Listeria monocytogenes, the causative agent of listeriosis. The mechanism(s by which BilE mediates bile resistance are unknown. BilE shares significant sequence similarity with ATP-binding cassette (ABC importers that contribute to virulence and stress responses by importing quaternary ammonium compounds that act as compatible solutes. Assays using related compounds have failed to demonstrate transport mediated by BilE. The putative substrate-binding domain (SBD of BilE was expressed in isolation and the crystal structure solved at 1.5 Å. Although the overall fold is characteristic of SBDs, the binding site varies considerably relative to the well-characterized homologs ProX from Archaeoglobus fulgidus and OpuBC and OpuCC from Bacillus subtilis. This suggests that BilE may bind an as-yet unknown ligand. Elucidation of the natural substrate of BilE could reveal a novel bile resistance mechanism.

  17. The Potential Link between Thermal Resistance and Virulence in Salmonella: A Review

    Directory of Open Access Journals (Sweden)

    Turki M. Dawoud

    2017-06-01

    Full Text Available In some animals, the typical body temperature can be higher than humans, for example, 42°C in poultry and 40°C in rabbits which can be a potential thermal stress challenge for pathogens. Even in animals with lower body temperatures, when infection occurs, the immune system may increase body temperature to reduce the chance of survival for pathogens. However, some pathogens can still easily overcome higher body temperatures and/or rise in body temperatures through expression of stress response mechanisms. Salmonella is the causative agent of one of the most prevalent foodborne illnesses, salmonellosis, and can readily survive over a wide range of temperatures due to the efficient expression of the heat (thermal stress response. Therefore, thermal resistance mechanisms can provide cross protection against other stresses including the non-specific host defenses found within the human body thus increasing pathogenic potential. Understanding the molecular mechanisms associated with thermal responses in Salmonella is crucial in designing and developing more effective or new treatments for reducing and eliminating infection caused by Salmonella that have survived heat stress. In this review, Salmonella thermal resistance is assessed followed by an overview of the thermal stress responses with a focus on gene regulation by sigma factors, heat shock proteins, along with the corresponding thermosensors and their association with virulence expression including a focus on a potential link between heat resistance and potential for infection.

  18. Design and Performance Optimizations of Advanced Erosion-Resistant Low Conductivity Thermal Barrier Coatings for Rotorcraft Engines

    Science.gov (United States)

    Zhu, Dongming; Miller, Robert A.; Kuczmarski, Maria A.

    2012-01-01

    Thermal barrier coatings will be more aggressively designed to protect gas turbine engine hot-section components in order to meet future rotorcraft engine higher fuel efficiency and lower emission goals. For thermal barrier coatings designed for rotorcraft turbine airfoil applications, further improved erosion and impact resistance are crucial for engine performance and durability, because the rotorcraft are often operated in the most severe sand erosive environments. Advanced low thermal conductivity and erosion-resistant thermal barrier coatings are being developed, with the current emphasis being placed on thermal barrier coating toughness improvements using multicomponent alloying and processing optimization approaches. The performance of the advanced thermal barrier coatings has been evaluated in a high temperature erosion burner rig and a laser heat-flux rig to simulate engine erosion and thermal gradient environments. The results have shown that the coating composition and architecture optimizations can effectively improve the erosion and impact resistance of the coating systems, while maintaining low thermal conductivity and cyclic oxidation durability

  19. Cyclic Thermal Stress-Induced Degradation of Cu Metallization on Si3N4 Substrate at -40°C to 300°C

    Science.gov (United States)

    Lang, Fengqun; Yamaguchi, Hiroshi; Nakagawa, Hiroshi; Sato, Hiroshi

    2015-01-01

    The high-temperature reliability of active metal brazed copper (AMC) on Si3N4 ceramic substrates used for fabricating SiC high-temperature power modules was investigated under harsh environments. The AMC substrate underwent isothermal storage at 300°C for up to 3000 h and a thermal cycling test at -40°C to 300°C for up to 3000 cycles. During isothermal storage at 300°C, the AMC substrate exhibited high reliability, characterized by very little deformation of the copper (Cu) layer, low crack growth, and low oxidation rate of the Cu layer. Under thermal cycling conditions at -40°C to 300°C, no detachment of the Cu layer was observed even after the maximum 3000 cycles of the experiment. However, serious deformation of the Cu layer occurred and progressed as the number of thermal cycles increased, thus significantly roughening the surface of the Cu metallized layer. The cyclic thermal stress led to a significant increase in the crack growth and oxidation of the Cu layer. The maximum depth of the copper oxides reached up to 5/6 of the Cu thickness. The deformation of the Cu layer was the main cause of the decrease of the bond strength under thermal cycling conditions. The shear strength of the SiC chips bonded on the AMC substrate with a Au-12 wt.%Ge solder decreased from the original 83 MPa to 14 MPa after 3000 cycles. Therefore, the cyclic thermal stress destroyed the Cu oxides and enhanced the oxidation of the Cu layer.

  20. Study of Thermal Fatigue Resistance of a Composite Coating Made by a Vacuum Fusion Sintering Method

    Institute of Scientific and Technical Information of China (English)

    2003-01-01

    Thermal fatigue behavior of a Ni-base alloy chromium carbide composite coating made by a vacuum fusion sintering method are discussed. Results show that thermal fatigue behavior is associated with cyclic upper temperature and coating thickness. As the thickness of the coating decreases, the thermal fatigue resistance increases. The thermal fatigue resistance cuts down with the thermal cyclic upper temperature rising. The crack growth rate decreases with the increase in cyclic number until crack arrests. Thermal fatigue failure was not found along the interface of the coating/matrix. The tract of thermal fatigue crack cracks along the interfaces of phases.

  1. Effect of electrical pulse treatment on the thermal fatigue resistance of bionic compacted graphite cast iron processed in water

    International Nuclear Information System (INIS)

    Liu, Yan; Zhou, Hong; Su, Hang; Yang, Chunyan; Cheng, Jingyan; Zhang, Peng; Ren, Luquan

    2012-01-01

    Highlights: ► Electrical pulse treatment can reduce cracks on bionic units before thermal fatigue tests. ► Electrical pulse treatment can reduce crack sources during thermal fatigue tests. ► Thermal fatigue resistance of bionic units processed in water is enhanced. ► Thermal fatigue resistance of bionic CGI processed in water is improved. -- Abstract: In order to further enhance the thermal fatigue resistance of bionic compacted graphite cast iron (CGI) which is processed by laser in water, the electrical pulse treatment is applied to improve the thermal fatigue resistance of bionic units. The results show that the electrical pulse treatment causes the supersaturated carbon atoms located in the lattice of austenite to react with the iron atoms to form the Fe 3 C. The microstructures of the bionic units processed in water are refined by the electrical pulse treatment. The cracks on the bionic units are reduced by the electrical pulse treatment before the thermal fatigue tests; and during the tests, the thermal fatigue resistance of bionic units is therefore enhanced by reducing the crack sources. By this way, the thermal fatigue resistance of bionic CGI processed in water is improved.

  2. Thermally assisted peeling of an elastic strip in adhesion with a substrate via molecular bonds

    Science.gov (United States)

    Qian, Jin; Lin, Ji; Xu, Guang-Kui; Lin, Yuan; Gao, Huajian

    A statistical model is proposed to describe the peeling of an elastic strip in adhesion with a flat substrate via an array of non-covalent molecular bonds. Under an imposed tensile peeling force, the interfacial bonds undergo diffusion-type transition in their bonding state, a process governed by a set of probabilistic equations coupled to the stretching, bending and shearing of the elastic strip. Because of the low characteristic energy scale associated with molecular bonding, thermal excitations are found to play an important role in assisting the escape of individual molecular bonds from their bonding energy well, leading to propagation of the peeling front well below the threshold peel-off force predicted by the classical theories. Our study establishes a link between the deformation of the strip and the spatiotemporal evolution of interfacial bonds, and delineates how factors like the peeling force, bending rigidity of the strip and binding energy of bonds influence the resultant peeling velocity and dimensions of the process zone. In terms of the apparent adhesion strength and dissipated energy, the bond-mediated interface is found to resist peeling in a strongly rate-dependent manner.

  3. Stem and stripe rust resistance in wheat induced by gamma rays and thermal neutrons

    International Nuclear Information System (INIS)

    Skorda, E.A.

    1977-01-01

    Attempts were made to produce rust-resistant mutants in wheat cultivars. Seeds of G-38290 and G-58383 (T. aestivum), Methoni and Ilectra (T. durum) varieties were irradiated with different doses of γ-rays (3.5, 5, 8, 11, 15 and 21 krad) and thermal neutrons (1.7, 4, 5.5, 7.5, 10.5 and 12.5x10 12 ) and the M 1 plants were grown under isolation in the field. The objective was mainly to induce stripe, leaf and stem rust resistance in G-38290, Methoni and Ilectra varieties and leaf rust resistance in G-58383. Mutations for rust resistance were detected by using the ''chimera method'' under natural and artificial field epiphytotic conditions in M 2 and successive generations. The mutants detected were tested for resistance to a broad spectrum of available races. Mutants resistant or moderately resistant to stripe and stem rusts but not to leaf rust, were selected from G-38290. From the other three varieties tested no rust-resistant mutants were detected. The frequency of resistant mutants obtained increased with increased γ-ray dose-rate, but not with increased thermal neutron doses. Some mutants proved to be resistant or moderately resistant to both rusts and others to one of them. Twenty of these mutants were evaluated for yield from M 5 to M 8 . Some of them have reached the final stage of regional yield trials and one, induced by thermal neutrons, was released this year. (author)

  4. Thin-Film layers with Interfaces that reduce RF Losses on High-Resistivity Silicon Substrates

    NARCIS (Netherlands)

    Evseev, S. B.; Milosavljevic, S.; Nanver, L. K.

    2017-01-01

    Radio-Frequency (RF) losses on High-Resistivity Silicon (HRS) substrates were studied for several different surface passivation layers comprising thin-films of SiC, SiN and SiO2 In many combinations, losses from conductive surface channels were reduced and increasing the number of interfaces between

  5. Effect of thermal strain on structure and polarization fatigue of CSD-derived PbZr0.53Ti0.47O3/LaNiO3 hetero-structures

    International Nuclear Information System (INIS)

    Wang, G.S.; Remiens, D.; Dogheche, E.; Dong, X.L.

    2007-01-01

    PbZr 0.53 Ti 0.47 O 3 /LaNiO 3 (PZT/LNO) hetero-structures have been successfully deposited on MgO, SrTiO 3 , Al 2 O 3 and Si substrate by chemical solution routes, respectively. The X-ray diffraction measurements show that out-of-plane lattice parameters of PZT increase as increase of thermal expansion coefficient of substrate. Polarization fatigues of Pt/PZT/LNO capacitors are strongly affected by the thermal strain caused by difference of thermal expansion coefficient between PZT and substrate materials. High fatigue resistance of Pt/PZT/LNO can be obtained by using substrate with similar thermal expansion coefficient as PZT. (orig.)

  6. Investigation of thermal and hot-wire chemical vapor deposition copper thin films on TiN substrates using CupraSelect as precursor.

    Science.gov (United States)

    Papadimitropoulos, G; Davazoglou, D

    2011-09-01

    Copper films were deposited on oxidized Si substrates covered with TiN using a novel chemical vapor deposition reactor in which reactions were assisted by a heated tungsten filament (hot-wire CVD, HWCVD). Liquid at room temperature hexafluoroacetylacetonate Cu(I) trimethylvinylsilane (CupraSelect) was directly injected into the reactor with the aid of a direct-liquid injection (DLI) system using N2 as carrier gas. The deposition rates of HWCVD Cu films obtained on TiN covered substrates were found to increase with filament temperature (65 and 170 degrees C were tested). The resistivities of HWCVD Cu films were found to be higher than for thermally grown films due to the possible presence of impurities into the Cu films from the incomplete dissociation of the precursor and W impurities caused by the presence of the filament. For HWCVD films grown at a filament temperature of 170 degrees C, smaller grains are formed than at 65 degrees C as shown from the taken SEM micrographs. XRD diffractograms taken on Cu films deposited on TiN could not reveal the presence of W compounds originating from the filament because the relative peak was masked by the TiN [112] peak.

  7. An investigation of excess noise in transition-edge sensors on a solid silicon substrate

    International Nuclear Information System (INIS)

    Crowder, S.G.; Lindeman, M.A.; Anderson, M.B.; Bandler, S.R.; Bilgri, N.; Bruijn, M.P.; Chervenak, J.; Figueroa-Feliciano, E.; Finkbeiner, F.; Germeau, A.; Hoevers, H.F.C.; Iyomoto, N.; Kelly, R.; Kilbourne, C.A.; Lai, T.; Man, J.; McCammon, D.; Nelms, K.L.; Porter, F.S.; Rocks, L.; Saab, T.; Sadleir, J.; Vidugiris, G.

    2006-01-01

    Transition-edge sensors (TESs) exhibit two major types of excess noise above the expected and unavoidable thermodynamic fluctuation noise (TFN) to the heat sink and Johnson noise. High-resistance TESs such as those made by the Netherlands Institute for Space Research (SRON) show excess noise consistent with internal TFN (ITFN) caused by random energy transport within the TES itself while low resistance TESs show an excess voltage noise of unknown origin seemingly unrelated to temperature fluctuations. Running a high-resistance TES on a high thermal conductivity substrate should suppress ITFN and allow detection of any excess voltage noise. We tested two TESs on a solid silicon substrate fabricated by SRON of a relatively high normal state resistance of ∼200 mΩ. After determining a linear model of the TES response to noise for the devices, we found little excess TFN and little excess voltage noise for bias currents of up to ∼20 μA

  8. Phonon scattering in graphene over substrate steps

    International Nuclear Information System (INIS)

    Sevinçli, H.; Brandbyge, M.

    2014-01-01

    We calculate the effect on phonon transport of substrate-induced bends in graphene. We consider bending induced by an abrupt kink in the substrate, and provide results for different step-heights and substrate interaction strengths. We find that individual substrate steps reduce thermal conductance in the range between 5% and 47%. We also consider the transmission across linear kinks formed by adsorption of atomic hydrogen at the bends and find that individual kinks suppress thermal conduction substantially, especially at high temperatures. Our analysis show that substrate irregularities can be detrimental for thermal conduction even for small step heights.

  9. Orientation of rapid thermally annealed lead zirconate titanate thin films on (111) Pt substrate

    International Nuclear Information System (INIS)

    Brooks, K.G.; Reaney, I.M.; Klissurska, R.; Huang, Y.; Bursill, L.A.; Setter, N.

    1994-01-01

    The nucleation, growth and orientation of lead zirconate titanate thin films prepared from organometallic precursor solutions by spin coating on (111) oriented platinum substrates and crystallized by rapid thermal annealing was investigated. The effects of pyrolysis temperature, post-pyrolysis thermal treatments, excess lead addition, and Nb dopant substitution are reported. The use of post pyrolysis oxygen anneals at temperatures in the regime of 350-450 deg C was found to strongly effect the kinetics of subsequent amorphous-pyrochlore perovskite crystallization by rapid thermal annealing. It has also allowed films of reproducible microstructure and textures (both (100) and (111)) to be prepared by rapid thermal annealing. It is suggested that such anneals and pyrolysis temperature affect the oxygen concentration/average Pb valence in the amorphous films prior to annealing. The changes in Pb valence state then affect the stability of the transient pyrochlore phase and thus the kinetics of perovskite crystallization. Nb dopant was also found to influence the crystallization kinetics. 28 refs., 18 figs

  10. Thermal bubble inkjet printing of water-based graphene oxide and graphene inks on heated substrate

    Science.gov (United States)

    Huang, Simin; Shen, Ruoxi; Qian, Bo; Li, Lingying; Wang, Wenhao; Lin, Guanghui; Zhang, Xiaofei; Li, Peng; Xie, Yonglin

    2018-04-01

    Stable-jetting water-based graphene oxide (GO) and graphene (GR) inks without any surfactant or stabilizer are prepared from an unstable-jetting water-based starting solvent, with many thermal bubble inkjet satellite drops, by simply increasing the material concentration. The concentration-dependent thermal bubble inkjet droplet generation process is studied in detail. To overcome the low concentration properties of water-based thermal bubble inkjet inks, the substrate temperature is tuned below 60 °C to achieve high-quality print lines. Due to the difference in hydrophilicity and hydrophobicity of the 2D materials, the printed GO lines show a different forming mechanism from that of the GR lines. The printed GO lines are reduced by thermal annealing and by ascorbic acid, respectively. The reduced GO lines exhibit electrical conductivity of the same order of magnitude as that of the GR lines.

  11. Substrate analog interaction with MCR-1 offers insight into the rising threat of the plasmid-mediated transferable colistin resistance.

    Science.gov (United States)

    Wei, Pengcheng; Song, Guangji; Shi, Mengyang; Zhou, Yafei; Liu, Yang; Lei, Jun; Chen, Peng; Yin, Lei

    2018-02-01

    Colistin is considered a last-resort antibiotic against most gram-negative bacteria. Recent discoveries of a plasmid-mediated, transferable mobilized colistin-resistance gene ( mcr-1) on all continents have heralded the imminent emergence of pan-drug-resistant superbacteria. The inner-membrane protein MCR-1 can catalyze the transfer of phosphoethanolamine (PEA) to lipid A, resulting in colistin resistance. However, little is known about the mechanism, and few drugs exist to address this issue. We present crystal structures revealing the MCR-1 catalytic domain (cMCR-1) as a monozinc metalloprotein with ethanolamine (ETA) and d-glucose, respectively, thus highlighting 2 possible substrate-binding pockets in the MCR-1-catalyzed PEA transfer reaction. Mutation of the residues involved in ETA and d-glucose binding impairs colistin resistance in recombinant Escherichia coli containing full-length MCR-1. Partial analogs of the substrate are used for cocrystallization with cMCR-1, providing valuable information about the family of PEA transferases. One of the analogs, ETA, causes clear inhibition of polymyxin B resistance, highlighting its potential for drug development. These data demonstrate the crucial role of the PEA- and lipid A-binding pockets and provide novel insights into the structure-based mechanisms, important drug-target hot spots, and a drug template for further drug development to combat the urgent, rising threat of MCR-1-mediated antibiotic resistance.-Wei, P., Song, G., Shi, M., Zhou, Y., Liu, Y., Lei, J., Chen, P., Yin, L. Substrate analog interaction with MCR-1 offers insight into the rising threat of the plasmid-mediated transferable colistin resistance.

  12. Facile and scalable preparation of highly wear-resistance superhydrophobic surface on wood substrates using silica nanoparticles modified by VTES

    Energy Technology Data Exchange (ETDEWEB)

    Jia, Shanshan; Liu, Ming [College of Materials Science and Engineering, Central South University of Forestry and Technology, Changsha 410004 (China); Wu, Yiqiang, E-mail: wuyq0506@126.com [College of Materials Science and Engineering, Central South University of Forestry and Technology, Changsha 410004 (China); Hunan Provincial Collaborative Innovation Center for High-efficiency Utilization of Wood and Bamboo Resources, Central South University of Forestry and Technology, Changsha 410004 (China); Luo, Sha [College of Materials Science and Engineering, Central South University of Forestry and Technology, Changsha 410004 (China); Qing, Yan, E-mail: qingyan0429@163.com [College of Materials Science and Engineering, Central South University of Forestry and Technology, Changsha 410004 (China); Hunan Provincial Collaborative Innovation Center for High-efficiency Utilization of Wood and Bamboo Resources, Central South University of Forestry and Technology, Changsha 410004 (China); Chen, Haibo [College of Materials Science and Engineering, Central South University of Forestry and Technology, Changsha 410004 (China)

    2016-11-15

    Graphical abstract: Highly wear-resistance superhydrophobic surface on wood substrates was fabricated using silica nanoparticles modified by VTES. Display Omitted - Highlights: • Superhydrophobic surface on wood substrates was efficiently fabricated using nanoparticles modified by VTES. • The superhydrophobic surface exhibited a CA of 154° and a SAclose to 0°. • The superhydrophobic surface showed a durable and robust wear-resistance performance. - Abstract: In this study, an efficient, facile method has been developed for fabricating superhydrophobic surfaces on wood substrates using silica nanoparticles modified by VTES. The as-prepared superhydrophobic wood surface had a water contact angle of 154° and water slide angle close to 0°. Simultaneously, this superhydrophobic wood showed highly durable and robust wear resistance when having undergone a long period of sandpaper abrasion or being scratched by a knife. Even under extreme conditions of boiling water, the superhydrophobicity of the as-prepared wood composite was preserved. Characterizations by scanning electron microscopy, energy-dispersive X-ray spectroscopy, and Fourier transform infrared spectroscopy showed that a typical and tough hierarchical micro/nanostructure was created on the wood substrate and vinyltriethoxysilane contributed to preventing the agglomeration of silica nanoparticles and serving as low-surface-free-energy substances. This superhydrophobic wood was easy to fabricate, mechanically resistant and exhibited long-term stability. Therefore, it is considered to be of significant importance in the industrial production of functional wood, especially for outdoor applications.

  13. Nanoscale thermal-mechanical probe determination of 'softening transitions' in thin polymer films

    International Nuclear Information System (INIS)

    Zhou Jing; Berry, Brian; Douglas, Jack F; Karim, Alamgir; Snyder, Chad R; Soles, Christopher

    2008-01-01

    We report a quantitative study of the softening behavior of glassy polystyrene (PS) films at length scales on the order of 100 nm using nano-thermomechanometry (nano-TM), an emerging scanning probe technique in which a highly doped silicon atomic force microscopy (AFM) tip is resistively heated on the surface of a polymer film. The apparent 'softening temperature' T s of the film is found to depend on the logarithm of the square root of the thermal ramping rate R. This relation allows us to estimate a quasi-equilibrium (or zero rate) softening transition temperature T s0 by extrapolation. We observe marked shifts of T s0 with decreasing film thickness, but the nature of these shifts, and even their sign, depend strongly on both the thermal and mechanical properties of the supporting substrate. Finite element simulations suggest that thin PS films on rigid substrates with large thermal conductivities lead to increasing T s0 with decreasing film thickness, whereas softer, less thermally conductive substrates promote reductions in T s0 . Experimental observations on a range of substrates confirm this behavior and indicate a complicated interplay between the thermal and mechanical properties of the thin PS film and the substrate. This study directly points to relevant factors for quantitative measurements of thermophysical properties of materials at the nanoscale using this nano-TM based method.

  14. Free-standing silicon micro machined resistors from (110) substrate

    International Nuclear Information System (INIS)

    Bernardini, R.; Diligenti, A.; Nannini, A.; Piotto, M.

    1998-01-01

    A simple process to obtain silicon planes released from the substrate and provided with large area pads for ohmic contacts is described. Resistors 500 μm long with a 40 μm x 1 μm cross section were obtained. Resistance measurements showed that the current flows in a reduced cross section, probably owing to the presence of a superficial depletion layer. Preliminary magnetoresistance measurements are presented. Reduction of the resistor cross section can be obtained by thermal oxidation

  15. Full densification of inkjet-printed copper conductive tracks on a flexible substrate utilizing a hydrogen plasma sintering

    Energy Technology Data Exchange (ETDEWEB)

    Kwon, Young-Tae [Department of Fusion Chemical Engineering, Hanyang University, Ansan 15588 (Korea, Republic of); Lee, Young-In [Department of Materials Science and Engineering, Seoul National University of Science and Technology, Seoul 01811 (Korea, Republic of); Kim, Seil [Department of Fusion Chemical Engineering, Hanyang University, Ansan 15588 (Korea, Republic of); Lee, Kun-Jae [Department of Energy Engineering, Dankook University, Cheonan 31116 (Korea, Republic of); Choa, Yong-Ho, E-mail: choa15@hanyang.ac.kr [Department of Fusion Chemical Engineering, Hanyang University, Ansan 15588 (Korea, Republic of)

    2017-02-28

    Highlights: • Hydrogen thermally- and plasma- treatments are applied to reduce and sinter the inkjet-printed copper patterns at low temperature. • Plasma sintered Cu patterns have fully densified microstructure with the resistivity of 3.23 μW cm. • Cu conductive track with dense microstructure remains its electrical resistivity after 1 month. • Thermal sintered Cu patterns show a relatively poor microstructure and high resistivity. - Abstract: Low temperature sintering techniques are crucial in developing flexible printed electronics. In this work, we demonstrate a novel hydrogen plasma sintering method that achieves a full reduction and densification of inkjet-printed patterns using a copper complex ion ink. After inkjet printing on polyethylene terephthalate (PET) substrates, both hydrogen plasma and conventional hydrogen thermal treatment were employed to compare the resulting microstructures, electrical properties and anti-oxidation behavior. The plasma treated pattern shows a fully densified microstructure with a resistivity of 3.23 μΩ cm, while the thermally treated pattern shows a relatively poor microstructure and high resistivity. In addition, the hydrogen plasma-treated copper pattern retains its electrical resistivity for one month without any significant decrease. This novel hydrogen plasma sintering technique could be used to produce conductive patterns with excellent electrical properties, allowing for highly reliable flexible printed electronics.

  16. Experimental investigation and characterization of micro resistance welding with an electro-thermal actuator

    International Nuclear Information System (INIS)

    Chang, Chun-Wei; Yeh, Cheng-Chi; Hsu Wensyang

    2009-01-01

    Resistance welding is a common scheme of assembly on the macro scale by pressing together two workpieces with current passing through them to generate joule heating at the contact region due to high contact resistance. However, micro assembly by resistance welding is seldom reported. Here, resistance welding with an electro-thermal microactuator to assemble micro Ni structures is experimentally investigated and characterized. The bent-beam electro-thermal microactuator is designed to provide the necessary displacements and pressing forces. The two-mask metal-based surface micromachining process is adopted to fabricate the micro Ni structures. The calibrated initial contact resistance is shown to decrease with increasing contact pressure. Furthermore, stronger welding strength is achieved at a smaller initial contact resistance, which indicates that a larger clamping force would enhance the welding strength as large as 3.09 MPa (74.4 µN) at a contact resistance of 2.7 Ω here. The input welding energy is also found to be a critical factor. In our tests, when welding energy is below the threshold limit of 0.05 J, the welding trials all fail. For the energy between 0.05 J and 1 J, there is a transition from a lower yield of 33.3% to a higher yield of 58.3%. At high welding energy, between 1 and 10 J, 100% yield is achieved. With the demonstration and characterization of micro resistance welding by the electro-thermal microactuator, the scheme proposed here would be helpful in the automation of micro assembly

  17. Control of biaxial strain in single-layer molybdenite using local thermal expansion of the substrate

    Science.gov (United States)

    Plechinger, Gerd; Castellanos-Gomez, Andres; Buscema, Michele; van der Zant, Herre S. J.; Steele, Gary A.; Kuc, Agnieszka; Heine, Thomas; Schüller, Christian; Korn, Tobias

    2015-03-01

    Single-layer MoS2 is a direct-gap semiconductor whose electronic band structure strongly depends on the strain applied to its crystal lattice. While uniaxial strain can be easily applied in a controlled way, e.g., by bending of a flexible substrate with the atomically thin MoS2 layer on top, experimental realization of biaxial strain is more challenging. Here, we exploit the large mismatch between the thermal expansion coefficients of MoS2 and a silicone-based substrate to apply a controllable biaxial tensile strain by heating the substrate with a focused laser. The effect of this biaxial strain is directly observable in optical spectroscopy as a redshift of the MoS2 photoluminescence. We also demonstrate the potential of this method to engineer more complex strain patterns by employing highly absorptive features on the substrate to achieve non-uniform heat profiles. By comparison of the observed redshift to strain-dependent band structure calculations, we estimate the biaxial strain applied by the silicone-based substrate to be up to 0.2%, corresponding to a band gap modulation of 105 meV per percentage of biaxial tensile strain.

  18. Topography and nanostructural evaluation of chemically and thermally modified titanium substrates.

    Science.gov (United States)

    Salemi, Hoda; Behnamghader, Aliasghar; Afshar, Abdollah

    2016-10-01

    In this research, the effects of chemical and thermal treatment on the morphological and compositional aspects of titanium substrates and so, potentially, on development of biomimetic bone like layers formation during simulated body fluid (SBF) soaking was investigated. The HF, HF/HNO3 and NaOH solutions were used for chemical treatment and some of alkali-treated samples followed a heat treatment at 600°C. The treated samples before and after soaking were subjected to material characterization tests using scanning electron microscopy (SEM), X-ray diffraction (XRD) and atomic force microscopy (AFM). White light interferometry (WLI) was used to determine the roughness parameters such as Ra, Rq, RKu and Rsk. The significance of the obtained data was assessed using ANOVA variance analysis between all samples. It was observed that the reaction at grain boundaries and sodium titanate intermediate layers play a great role in the nucleation of calcium phosphate layers. Based on the obtained results in this work, the calcium phosphate microstructure deposited on titanium substrates was more affected by chemical modification than surface topography.

  19. Theoretical Research on Thermal Shock Resistance of Ultra-High Temperature Ceramics Focusing on the Adjustment of Stress Reduction Factor

    Directory of Open Access Journals (Sweden)

    Daining Fang

    2013-02-01

    Full Text Available The thermal shock resistance of ceramics depends on not only the mechanical and thermal properties of materials, but also the external constraint and thermal condition. So, in order to study the actual situation in its service process, a temperature-dependent thermal shock resistance model for ultra-high temperature ceramics considering the effects of the thermal environment and external constraint was established based on the existing theory. The present work mainly focused on the adjustment of the stress reduction factor according to different thermal shock situations. The influences of external constraint on both critical rupture temperature difference and the second thermal shock resistance parameter in either case of rapid heating or cooling conditions had been studied based on this model. The results show the necessity of adjustment of the stress reduction factor in different thermal shock situations and the limitations of the applicable range of the second thermal shock resistance parameter. Furthermore, the model was validated by the finite element method.

  20. Microstructure and durability of zirconia thermal barrier coatings

    International Nuclear Information System (INIS)

    Suhr, D.S.; Mitchell, T.E.; Keller, R.J.

    1983-01-01

    Various combinations of plasma-sprayed bond coatings and zirconia ceramic coatings on a nickel-based superalloy substrate were tested by static thermal exposure at 1200 0 C and cyclic thermal exposure to 1000 0 C. The bond coats were based on Ni-Cr-Al alloys with additions of rare earth elements and Si. The ceramic coats were various ZrO 2 -Y 2 O 3 compositions, of which the optimum was found to be ZrO 2 -8.9 wt% Y 2 O 3 . Microstructural analysis showed that resistance to cracking during thermal exposure is strongly related to deleterious phase changes

  1. Adipokines and their relation to maternal energy substrate production, insulin resistance and fetal size.

    Science.gov (United States)

    Ahlsson, Fredrik; Diderholm, Barbro; Ewald, Uwe; Jonsson, Björn; Forslund, Anders; Stridsberg, Mats; Gustafsson, Jan

    2013-05-01

    The role of adipokines in the regulation of energy substrate production in non-diabetic pregnant women has not been elucidated. We hypothesize that serum concentrations of adiponectin are related to fetal growth via maternal fat mass, insulin resistance and glucose production, and further, that serum levels of leptin are associated with lipolysis and that this also influences fetal growth. Hence, we investigated the relationship between adipokines, energy substrate production, insulin resistance, body composition and fetal weight in non-diabetic pregnant women in late gestation. Twenty pregnant women with normal glucose tolerance were investigated at 36 weeks of gestation at Uppsala University Hospital. Levels of adipokines were related to rates of glucose production and lipolysis, maternal body composition, insulin resistance, resting energy expenditure and estimated fetal weights. Rates of glucose production and lipolysis were estimated by stable isotope dilution technique. Median (range) rate of glucose production was 805 (653-1337) μmol/min and that of glycerol production, reflecting lipolysis, was 214 (110-576) μmol/min. HOMA insulin resistance averaged 1.5 ± 0.75 and estimated fetal weights ranged between 2670 and 4175 g (-0.2 to 2.7 SDS). Mean concentration of adiponectin was 7.2 ± 2.5mg/L and median level of leptin was 47.1 (9.9-58.0) μg/L. Adiponectin concentrations (7.2 ± 2.5mg/L) correlated inversely with maternal fat mass, insulin resistance, glucose production and fetal weight, r=-0.50, pinsulin resistance, r=0.76, pinsulin resistance as well as endogenous glucose production rates indicate that low levels of adiponectin in obese pregnant women may represent one mechanism behind increased fetal size. Maternal levels of leptin are linked to maternal fat mass and its metabolic consequences, but the data indicate that leptin lacks a regulatory role with regard to maternal lipolysis in late pregnancy. Copyright © 2012 Elsevier Ireland Ltd. All rights

  2. The influence of substrate temperature on properties of APS and VPS W coatings

    Czech Academy of Sciences Publication Activity Database

    Kovářík, O.; Haušild, P.; Siegl, J.; Chráska, Tomáš; Matějíček, Jiří; Pala, Zdeněk; Boulos, M.

    2015-01-01

    Roč. 268, April (2015), s. 7-14 ISSN 0257-8972 R&D Projects: GA ČR(CZ) GAP108/12/1872 Institutional support: RVO:61389021 Keywords : Plasma spray * Substrate temperature * W * Hardness * Coating modulus * Thermal conductivity Subject RIV: JH - Ceramics, Fire-Resistant Materials and Glass Impact factor: 2.139, year: 2015 http://www.sciencedirect.com/science/article/pii/S0257897214006409#

  3. Proliferation resistance assessment of thermal recycle systems

    International Nuclear Information System (INIS)

    1979-02-01

    This paper examines the major proliferation aspects of thermal recycle systems and the extent to which technical or institutional measures could increase the difficulty or detectability of misuse of the system by would-be proliferators. It does this by examining the various activities necessary to acquire weapons-usable material using a series of assessment factors; resources required, time required, detectability. It is concluded that resistance to proliferation could be improved substantially by collecting reprocessing, conversion and fuel fabrication plants under multi national control and instituting new measures to protect fresh MOX fuel. Resistance to theft at sub-national level could be improved by co-location of sensitive facilities high levels of physical protection at plants and during transportation and possibly by adding a radiation barrier to MOX prior to shipment

  4. Effect of layer thickness on the properties of nickel thermal sprayed steel

    Energy Technology Data Exchange (ETDEWEB)

    Nurisna, Zuhri, E-mail: zuhri-nurisna@yahoo.co.id; Triyono,, E-mail: triyonomesin@uns.ac.id; Muhayat, Nurul, E-mail: nurulmuhayat@staff.uns.ac.id; Wijayanta, Agung Tri, E-mail: agungtw@uns.ac.id [Department of Mechanical Engineering, Sebelas Maret University, Jl. Jr. Sutami 36 A, Surakarta (Indonesia)

    2016-03-29

    Thermal arc spray nickel coating is widely used for decorative and functional applications, by improving corrosion resistance, wear resistance, heat resistence or by modifying other properties of the coated materials. There are several properties have been studied. Layer thickness of nickel thermal sprayed steel may be make harder the substrate surface. In this study, the effect of layer thickness of nickel thermal sprayed steel has been investigated. The rectangular substrate specimens were coated by Ni–5 wt.% Al using wire arc spray method. The thickness of coating layers were in range from 0.4 to 1.0 mm. Different thickness of coating layers were conducted to investigate their effect on hardness and morphology. The coating layer was examined by using microvickers and scanning electron microscope with EDX attachment. Generally, the hardness at the interface increased with increasing thickness of coating layers for all specimens due to higher heat input during spraying process. Morphology analysis result that during spraying process aluminum would react with surrounding oxygen and form aluminum oxide at outer surface of splat. Moreover, porosity was formed in coating layers. However, presence porosity is not related to thickness of coating material. The thicker coating layer resulted highesr of hardness and bond strength.

  5. Thermal Barrier Coatings Resistant to Glassy Deposits

    Science.gov (United States)

    Drexler, Julie Marie

    Engineering of alloys has for years allowed aircraft turbine engines to become more efficient and operate at higher temperatures. As advancements in these alloy systems have become more difficult, ceramic thermal barrier coatings (TBCs), often yttria (7 wt %) stabilized zirconia (7YSZ), have been utilized for thermal protection. TBCs have allowed for higher engine operating temperatures and better fuel efficiency but have also created new engineering problems. Specifically, silica based particles such as sand and volcanic ash that enter the engine during operation form glassy deposits on the TBCs. These deposits can cause the current industrial 7YSZ thermal barrier coatings to fail since the glass formed penetrates and chemically interacts with the TBC. When this occurs, coating failure may occur due to a loss of strain tolerance, which can lead to fracture, and phase changes of the TBC material. There have been several approaches used to stop calcium-magnesium aluminio-silcate (CMAS) glasses (molten sand) from destroying the entire TBC, but overall there is still limited knowledge. In this thesis, 7YSZ and new TBC materials will be examined for thermochemical and thermomechanical performance in the presence of molten CMAS and volcanic ash. Two air plasma sprayed TBCs will be shown to be resistant to volcanic ash and CMAS. The first type of coating is a modified 7YSZ coating with 20 mol% Al2O3 and 5 mol% TiO2 in solid solution (YSZ+20Al+5Ti). The second TBC is made of gadolinium zirconate. These novel TBCs impede CMAS and ash penetration by interacting with the molten CMAS or ash and drastically changing the chemistry. The chemically modified CMAS or ash will crystallize into an apatite or anorthite phase, blocking the CMAS or ash from further destroying the coating. A presented mechanism study will show these coatings are effective due to the large amount of solute (Gd, Al) in the zirconia structure, which is the key to creating the crystalline apatite or

  6. Thermal Resistance across Interfaces Comprising Dimensionally Mismatched Carbon Nanotube-Graphene Junctions in 3D Carbon Nanomaterials

    Directory of Open Access Journals (Sweden)

    Jungkyu Park

    2014-01-01

    Full Text Available In the present study, reverse nonequilibrium molecular dynamics is employed to study thermal resistance across interfaces comprising dimensionally mismatched junctions of single layer graphene floors with (6,6 single-walled carbon nanotube (SWCNT pillars in 3D carbon nanomaterials. Results obtained from unit cell analysis indicate the presence of notable interfacial thermal resistance in the out-of-plane direction (along the longitudinal axis of the SWCNTs but negligible resistance in the in-plane direction along the graphene floor. The interfacial thermal resistance in the out-of-plane direction is understood to be due to the change in dimensionality as well as phonon spectra mismatch as the phonons propagate from SWCNTs to the graphene sheet and then back again to the SWCNTs. The thermal conductivity of the unit cells was observed to increase nearly linearly with an increase in cell size, that is, pillar height as well as interpillar distance, and approaches a plateau as the pillar height and the interpillar distance approach the critical lengths for ballistic thermal transport in SWCNT and single layer graphene. The results indicate that the thermal transport characteristics of these SWCNT-graphene hybrid structures can be tuned by controlling the SWCNT-graphene junction characteristics as well as the unit cell dimensions.

  7. Thermal stress resistance of ion implanted sapphire crystals

    International Nuclear Information System (INIS)

    Gurarie, V.N.; Jamieson, D.N.; Szymanski, R.; Orlov, A.V.; Williams, J.S.; Conway, M.

    1999-01-01

    Monocrystals of sapphire have been subjected to ion implantation with 86 keV Si - and 80 keV Cr - ions to doses in the range of 5x10 14 -5x10 16 cm -2 prior to thermal stress testing in a pulsed plasma. Above a certain critical dose ion implantation is shown to modify the near-surface structure of samples by introducing damage, which makes crack nucleation easier under the applied stress. The effect of ion dose on the stress resistance is investigated and the critical doses which produce a noticeable change in the stress resistance are determined. The critical dose for Si ions is shown to be much lower than that for Cr - ions. However, for doses exceeding 2x10 16 cm -2 the stress resistance parameter decreases to approximately the same value for both implants. The size of the implantation-induced crack nucleating centers and the density of the implantation-induced defects are considered to be the major factors determining the stress resistance of sapphire crystals irradiated with Si - and Cr - ions

  8. Resistance of heat resisting steels and alloys to thermal and mechanical low-cycle fatigue

    International Nuclear Information System (INIS)

    Tulyakov, G.A.

    1980-01-01

    Carried out is a comparative evalUation of resistance of different materials to thermocyclic deformation and fracture on the base of the experimental data on thermal and mechanical low-cycle fatigUe. Considered are peculiarities of thermal fatigue resistance depending on strength and ductility of the material. It is shown, that in the range of the cycle small numbers before the fracture preference is given to the high-ductility cyclically strengthening austenitic steels of 18Cr-10Ni type with slight relation of yield strength to the σsub(0.2)/σsub(B) tensile strength Highly alloyed strength chromium-nickel steels, as well as cyclically destrengthening perlitic and ferritic steels with stronger σsub(0.2)/σsub(B) relation as compared with simple austenitic steels turn to be more long-lived in the range of the cycle great numbers berore fracture. Perlitic steels are stated to have the lowest parameter values of the K crack growth intensity under the similar limiting conditions of the experiment, while steels and alloys with austenite structure-higher values of the K parameter

  9. Thermal performance of different planting substrates and irrigation frequencies in extensive tropical rooftop greeneries

    Energy Technology Data Exchange (ETDEWEB)

    Lin, Yi-Jiung [Department of Environmental Engineering and Science, Foo-Yin University, Kaohsiung (China); No. 16, Lane 29, Chen-Sing 7th Street, Niao-Song, Kaohsiung 833 (China); Lin, Hsien-Te [Department of Architecture, National Cheng Kung University, Tainan (China); No. 1, Ta-Hsueh Road, Tainan 701 (China)

    2011-02-15

    The need for the better use of scarce planetary resources has never been more evident than it is today. However, this need is poorly reflected in human housing. In recent years, there has been a growing realization of the importance of constructing human shelters that better conserve energy and water through appropriate insulation and architectural designs. Among the important advancements in these areas is the use of rooftop greeneries for both energy and water conservation. This paper performs an investigation into this topic within the specific climatic context of tropical regions. Long-term experimental results are provided from a four-floor building in Kaohsiung in the southern part of Taiwan. The study involves a fully monitored extensive rooftop greenery and examines four different plant substrates, three different irrigation regimes, and different types of drought-enduring plants to find the most efficient combination of all three in providing maximum heat insulation and water usage efficiency. The attenuation of solar radiation through the vegetation layer is evaluated, as well as the thermal insulation performance of the rooftop greenery structure. Among the substrates, burned sludge has the best thermal reduction percentage of heat amplitude under the roof slab surface (up to 84.4%). Irrigation twice a week has the best thermal reduction percentage of heat amplitude (91.6%). Among the plant types, Sansevieria trifasciata cv. Laurentii Compacta and Rhoeo spathaceo cv. Compacta are found to be suitable for extensive rooftop greeneries because they have the best coverage ratio and are most drought enduring. (author)

  10. Hydrophobicity attainment and wear resistance enhancement on glass substrates by atmospheric plasma-polymerization of mixtures of an aminosilane and a fluorocarbon

    Energy Technology Data Exchange (ETDEWEB)

    Múgica-Vidal, Rodolfo, E-mail: rodolfo.mugica@alum.unirioja.es [Department of Mechanical Engineering, University of La Rioja, c/ Luis de Ulloa 20, 26004, Logroño, La Rioja (Spain); Alba-Elías, Fernando, E-mail: fernando.alba@unirioja.es [Department of Mechanical Engineering, University of La Rioja, c/ Luis de Ulloa 20, 26004, Logroño, La Rioja (Spain); Sainz-García, Elisa, E-mail: elisa.sainzg@unirioja.es [Department of Mechanical Engineering, University of La Rioja, c/ Luis de Ulloa 20, 26004, Logroño, La Rioja (Spain); Pantoja-Ruiz, Mariola, E-mail: mpruiz@ing.uc3m.es [Materials Science and Engineering Department, IAAB, Materials Performance Group, University Carlos III of Madrid, Av. Universidad 30, 28911, Leganés, Madrid (Spain)

    2015-08-30

    Graphical abstract: - Highlights: • APTES and PFH were used to coat glass by non-thermal atmospheric jet plasma. • A mixture of 75% of APTES and 25% PFH produced the best sample of this work. • Hydrophobicity was achieved by changes in surface morphology and chemistry. • Wear resistance was enhanced by the formation of siloxane groups. - Abstract: Mixtures of different proportions of two liquid precursors were subjected to plasma-polymerization by a non-thermal atmospheric jet plasma system in a search for a coating that achieves a hydrophobic character on a glass substrate and enhances its wear resistance. 1-Perfluorohexene (PFH) was chosen as a low-surface-energy precursor to promote a hydrophobic character. Aminopropyltriethoxysilane (APTES) was chosen for its contribution to the improvement of wear resistance by the formation of siloxane bonds. The objective of this work was to determine which of the precursors’ mixtures that were tested provides the coating with the most balanced enhancement of both hydrophobicity and wear resistance, given that coatings deposited with fluorocarbon-based precursors such as PFH are usually low in resistance to wear and coatings deposited with APTES are generally hydrophilic. The coatings obtained were analyzed by Scanning Electron Microscopy (SEM), Atomic Force Microscopy (AFM), Fourier Transform Infra-Red (FTIR) spectroscopy, X-ray Photoelectron Spectroscopy (XPS), static Water Contact Angle (WCA) measurements, tribological ball-on-disc tests and contact profilometry. A relationship between the achievement of a hydrophobic character and the modifications to roughness and surface morphology and the incorporation of fluorocarbon groups in the surface chemistry was observed. Also, it was seen that the wear resistance was influenced by the SiOSi content of the coatings. In turn, the SiOSi content appears to be directly related to the percentage of APTES used in the mixture of precursors. The best conjunction of

  11. Development and Life Prediction of Erosion Resistant Turbine Low Conductivity Thermal Barrier Coatings

    Science.gov (United States)

    Zhu, Dongming; Miller, Robert A.; Kuczmarski, Maria A.

    2010-01-01

    Future rotorcraft propulsion systems are required to operate under highly-loaded conditions and in harsh sand erosion environments, thereby imposing significant material design and durability issues. The incorporation of advanced thermal barrier coatings (TBC) in high pressure turbine systems enables engine designs with higher inlet temperatures, thus improving the engine efficiency, power density and reliability. The impact and erosion resistance of turbine thermal barrier coating systems are crucial to the turbine coating technology application, because a robust turbine blade TBC system is a prerequisite for fully utilizing the potential coating technology benefit in the rotorcraft propulsion. This paper describes the turbine blade TBC development in addressing the coating impact and erosion resistance. Advanced thermal barrier coating systems with improved performance have also been validated in laboratory simulated engine erosion and/or thermal gradient environments. A preliminary life prediction modeling approach to emphasize the turbine blade coating erosion is also presented.

  12. Effect of Layer-Graded Bond Coats on Edge Stress Concentration and Oxidation Behavior of Thermal Barrier Coatings

    Science.gov (United States)

    Zhu, Dongming; Ghosn, Louis J.; Miller, Robert A.

    1998-01-01

    Thermal barrier coating (TBC) durability is closely related to design, processing and microstructure of the coating Z, tn systems. Two important issues that must be considered during the design of a thermal barrier coating are thermal expansion and modulus mismatch between the substrate and the ceramic layer, and substrate oxidation. In many cases, both of these issues may be best addressed through the selection of an appropriate bond coat system. In this study, a low thermal expansion and layer-graded bond coat system, that consists of plasma-sprayed FeCoNiCrAl and FeCrAlY coatings, and a high velocity oxyfuel (HVOF) sprayed FeCrAlY coating, is developed to minimize the thermal stresses and provide oxidation resistance. The thermal expansion and oxidation behavior of the coating system are also characterized, and the strain isolation effect of the bond coat system is analyzed using the finite element method (FEM). Experiments and finite element results show that the layer-graded bond coat system possesses lower interfacial stresses. better strain isolation and excellent oxidation resistance. thus significantly improving the coating performance and durability.

  13. Vitreous carbon mask substrate for X-ray lithography

    Science.gov (United States)

    Aigeldinger, Georg [Livermore, CA; Skala, Dawn M [Fremont, CA; Griffiths, Stewart K [Livermore, CA; Talin, Albert Alec [Livermore, CA; Losey, Matthew W [Livermore, CA; Yang, Chu-Yeu Peter [Dublin, CA

    2009-10-27

    The present invention is directed to the use of vitreous carbon as a substrate material for providing masks for X-ray lithography. The new substrate also enables a small thickness of the mask absorber used to pattern the resist, and this enables improved mask accuracy. An alternative embodiment comprised the use of vitreous carbon as a LIGA substrate wherein the VC wafer blank is etched in a reactive ion plasma after which an X-ray resist is bonded. This surface treatment provides a surface enabling good adhesion of the X-ray photoresist and subsequent nucleation and adhesion of the electrodeposited metal for LIGA mold-making while the VC substrate practically eliminates secondary radiation effects that lead to delamination of the X-ray resist form the substrate, the loss of isolated resist features, and the formation of a resist layer adjacent to the substrate that is insoluble in the developer.

  14. Characterization of Contact and Bulk Thermal Resistance of Laminations for Electric Machines

    Energy Technology Data Exchange (ETDEWEB)

    Cousineau, J. Emily [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Bennion, Kevin [National Renewable Energy Laboratory (NREL), Golden, CO (United States); DeVoto, Doug [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Mihalic, Mark [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Narumanchi, Sreekant [National Renewable Energy Laboratory (NREL), Golden, CO (United States)

    2015-06-30

    The ability to remove heat from an electric machine depends on the passive stack thermal resistances within the machine and the convective cooling performance of the selected cooling technology. This report focuses on the passive thermal design, specifically properties of the stator and rotor lamination stacks. Orthotropic thermal conductivity, specific heat, and density are reported. Four materials commonly used in electric machines were tested, including M19 (29 and 26 gauge), HF10, and Arnon 7 materials.

  15. Microstructural effects associated to CTE mismatch for enhancing the thermal shock resistance of refractories

    International Nuclear Information System (INIS)

    Huger, M; Tessier-Doyen, N; Michaud, P; Chotard, T; Ota, T

    2011-01-01

    This work is devoted to the study of thermomechanical properties of several industrial and model refractory materials in relation with the evolution of their microstructure during thermal treatments. The aim is, in particular, to highlight the role of thermal expansion mismatches existing between phases which can induce damage at local scale. The resulting network of microcracks is well known to improve thermal shock resistance of materials, since it usually involves a significant decrease in elastic properties. Moreover, this network of microcracks can strongly affect the thermal expansion at low temperature and the stress-strain behaviour in tension. Even if these two last aspects are not so much documented in the literature, they certainly also constitute key points for the improvement of the thermal shock resistance of refractory materials. Evolution of damage during thermal cycling has been monitored by a specific ultrasonic device at high temperature. Beyond its influence on Young's modulus, this damage also allows to decrease the thermal expansion and to improve the non-linear character of the stress-strain curves determined in tension. The large increase in strain to rupture, which results from this non-linearity, is of great interest for thermal shock application.

  16. Dynamic thermal characteristics of heat pipe via segmented thermal resistance model for electric vehicle battery cooling

    Science.gov (United States)

    Liu, Feifei; Lan, Fengchong; Chen, Jiqing

    2016-07-01

    Heat pipe cooling for battery thermal management systems (BTMSs) in electric vehicles (EVs) is growing due to its advantages of high cooling efficiency, compact structure and flexible geometry. Considering the transient conduction, phase change and uncertain thermal conditions in a heat pipe, it is challenging to obtain the dynamic thermal characteristics accurately in such complex heat and mass transfer process. In this paper, a ;segmented; thermal resistance model of a heat pipe is proposed based on thermal circuit method. The equivalent conductivities of different segments, viz. the evaporator and condenser of pipe, are used to determine their own thermal parameters and conditions integrated into the thermal model of battery for a complete three-dimensional (3D) computational fluid dynamics (CFD) simulation. The proposed ;segmented; model shows more precise than the ;non-segmented; model by the comparison of simulated and experimental temperature distribution and variation of an ultra-thin micro heat pipe (UMHP) battery pack, and has less calculation error to obtain dynamic thermal behavior for exact thermal design, management and control of heat pipe BTMSs. Using the ;segmented; model, the cooling effect of the UMHP pack with different natural/forced convection and arrangements is predicted, and the results correspond well to the tests.

  17. Basic thermal-mechanical properties and thermal shock, fatigue resistance of swaged + rolled potassium doped tungsten

    Science.gov (United States)

    Zhang, Xiaoxin; Yan, Qingzhi; Lang, Shaoting; Xia, Min; Ge, Changchun

    2014-09-01

    The potassium doped tungsten (W-K) grade was achieved via swaging + rolling process. The swaged + rolled W-K alloy exhibited acceptable thermal conductivity of 159.1 W/m K and ductile-to-brittle transition temperature of about 873 K while inferior mechanical properties attributed to the coarse pores and small deformation degree. Then the thermal shock, fatigue resistance of the W-K grade were characterized by an electron beam facility. Thermal shock tests were conducted at absorbed power densities varied from 0.22 to 1.1 GW/m2 in a step of 0.22 GW/m2. The cracking threshold was in the range of 0.44-0.66 GW/m2. Furthermore, recrystallization occurred in the subsurface of the specimens tested at 0.66-1.1 GW/m2 basing on the analysis of microhardness and microstructure. Thermal fatigue tests were performed at 0.44 GW/m2 up to 1000 cycles and no cracks emerged throughout the tests. Moreover, recrystallization occurred after 1000 cycles.

  18. Ultra-high carrier mobility InSb film by rapid thermal annealing on glass substrate

    Directory of Open Access Journals (Sweden)

    Charith Jayanada Koswaththage

    2016-11-01

    Full Text Available InSb films were deposited on both mica and glass substrates using thermal evaporation and subjected to FA or RTA. Crystallinity, composition and electrical properties were investigated. High Hall electron mobility as high as 25,000 cm2/(Vs was obtained with the capped InSb film by keeping the In:Sb ratio after RTA at 520°C for 30 sec or more without adopting epitaxial growth on glass.

  19. Phonon Transport through Nanoscale Contact in Tip-Based Thermal Analysis of Nanomaterials.

    Science.gov (United States)

    Dulhani, Jay; Lee, Bong Jae

    2017-07-28

    Nanomaterials have been actively employed in various applications for energy and sustainability, such as biosensing, gas sensing, solar thermal energy conversion, passive radiative cooling, etc. Understanding thermal transports inside such nanomaterials is crucial for optimizing their performance for different applications. In order to probe the thermal transport inside nanomaterials or nanostructures, tip-based nanoscale thermometry has often been employed. It has been well known that phonon transport in nanometer scale is fundamentally different from that occurred in macroscale. Therefore, Fourier's law that relies on the diffusion approximation is not ideally suitable for describing the phonon transport occurred in nanostructures and/or through nanoscale contact. In the present study, the gray Boltzmann transport equation (BTE) is numerically solved using finite volume method. Based on the gray BTE, phonon transport through the constriction formed by a probe itself as well as the nanoscale contact between the probe tip and the specimen is investigated. The interaction of a probe and a specimen (i.e., treated as a substrate) is explored qualitatively by analyzing the temperature variation in the tip-substrate configuration. Besides, each contribution of a probe tip, tip-substrate interface, and a substrate to the thermal resistance are analyzed for wide ranges of the constriction ratio of the probe.

  20. Thermal properties and corrosion resistance of organoclay/epoxy resin film

    Science.gov (United States)

    Baiquni, M.; Soegijono, B.

    2018-03-01

    Hybrid materials organoclay/epoxy resin films were prepared by varying organoclay content in epoxy resin as a matrix. The film were investigated by thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), Fourier transform infrared spectroscopy (FT-IR), scanning electron microscopy (SEM), and thermal conductivity. TGA and FT-IR results confirmed that the melting temperature shifted to a lower point. The thermal conductivity and corrosion resistant generally increase with increasing organoclay content. The changes on these properties may due to cross link between organoclay and epoxy.

  1. Effect of air confinement on thermal contact resistance in nanoscale heat transfer

    Science.gov (United States)

    Pratap, Dheeraj; Islam, Rakibul; Al-Alam, Patricia; Randrianalisoa, Jaona; Trannoy, Nathalie

    2018-03-01

    Here, we report a detailed analysis of thermal contact resistance (R c) of nano-size contact formed between a Wollaston wire thermal probe and the used samples (fused silica and titanium) as a function of air pressure (from 1 Pa to 105 Pa). Moreover, we suggest an analytical model using experimental data to extract R c. We found that for both samples, the thermal contact resistance decreases with increasing air pressure. We also showed that R c strongly depends on the thermal conductivity of materials keeping other parameters the same, such as roughness of the probe and samples, as well as the contact force. We provide a physical explanation of the R c trend with pressure and thermal conductivity of the materials: R c is ascribed to the heat transfer through solid-solid (probe-sample) contact and confined air at nanoscale cavities, due to the rough nature of the materials in contact. The contribution of confined air on heat transfer through the probe sample contact is significant at atmospheric pressure but decreases as the pressure decreases. In vacuum, only the solid-solid contact contributes to R c. In addition, theoretical calculations using the well-known acoustic and diffuse mismatch models showed a high thermal conductivity material that exhibits high heat transmission and consequently low R c, supporting our findings.

  2. Transparent resistive switching memory using aluminum oxide on a flexible substrate

    International Nuclear Information System (INIS)

    Yeom, Seung-Won; Kim, Tan-Young; Ha, Hyeon Jun; Ju, Byeong-Kwon; Shin, Sang-Chul; Shim, Jae Won; Lee, Yun-Hi

    2016-01-01

    Resistive switching memory (ReRAM) has attracted much attention in recent times owing to its fast switching, simple structure, and non-volatility. Flexible and transparent electronic devices have also attracted considerable attention. We therefore fabricated an Al 2 O 3 -based ReRAM with transparent indium-zinc-oxide (IZO) electrodes on a flexible substrate. The device transmittance was found to be higher than 80% in the visible region (400–800 nm). Bended states (radius = 10 mm) of the device also did not affect the memory performance because of the flexibility of the two transparent IZO electrodes and the thin Al 2 O 3 layer. The conduction mechanism of the resistive switching of our device was explained by ohmic conduction and a Poole–Frenkel emission model. The conduction mechanism was proved by oxygen vacancies in the Al 2 O 3 layer, as analyzed by x-ray photoelectron spectroscopy analysis. These results encourage the application of ReRAM in flexible and transparent electronic devices. (letter)

  3. Transparent resistive switching memory using aluminum oxide on a flexible substrate

    Science.gov (United States)

    Yeom, Seung-Won; Shin, Sang-Chul; Kim, Tan-Young; Ha, Hyeon Jun; Lee, Yun-Hi; Shim, Jae Won; Ju, Byeong-Kwon

    2016-02-01

    Resistive switching memory (ReRAM) has attracted much attention in recent times owing to its fast switching, simple structure, and non-volatility. Flexible and transparent electronic devices have also attracted considerable attention. We therefore fabricated an Al2O3-based ReRAM with transparent indium-zinc-oxide (IZO) electrodes on a flexible substrate. The device transmittance was found to be higher than 80% in the visible region (400-800 nm). Bended states (radius = 10 mm) of the device also did not affect the memory performance because of the flexibility of the two transparent IZO electrodes and the thin Al2O3 layer. The conduction mechanism of the resistive switching of our device was explained by ohmic conduction and a Poole-Frenkel emission model. The conduction mechanism was proved by oxygen vacancies in the Al2O3 layer, as analyzed by x-ray photoelectron spectroscopy analysis. These results encourage the application of ReRAM in flexible and transparent electronic devices.

  4. Interfacial thermal resistance between high-density polyethylene (HDPE) and sapphire

    International Nuclear Information System (INIS)

    Zheng Kun; Ma Yong-Mei; Wang Fo-Song; Zhu Jie; Tang Da-Wei

    2014-01-01

    To improve the thermal conductivity of polymeric composites, the numerous interfacial thermal resistance (ITR) inside is usually considered as a bottle neck, but the direct measurement of the ITR is hardly reported. In this paper, a sandwich structure which consists of transducer/high density polyethylene (HDPE)/sapphire is prepared to study the interface characteristics. Then, the ITRs between HDPE and sapphire of two samples with different HDPE thickness values are measured by time-domain thermoreflectance (TDTR) method and the results are ∼ 2 × 10 −7 m 2 ·K·W −1 . Furthermore, a model is used to evaluate the importance of ITR for the thermal conductivity of composites. The model's analysis indicates that reducing the ITR is an effective way of improving the thermal conductivity of composites. These results will provide valuable guidance for the design and manufacture of polymer-based thermally conductive materials. (condensed matter: electronic structure, electrical, magnetic, and optical properties)

  5. Electrical resistivity and thermal properties of compatibilized multi-walled carbon nanotube/polypropylene composites

    Directory of Open Access Journals (Sweden)

    A. Szentes

    2012-06-01

    Full Text Available The electrical resistivity and thermal properties of multi-walled carbon nanotube/polypropylene (MWCNT/PP composites have been investigated in the presence of coupling agents applied for improving the compatibility between the nanotubes and the polymer. A novel olefin-maleic-anhydride copolymer and an olefin-maleic-anhydride copolymer based derivative have been used as compatibilizers to achieve better dispersion of MWCNTs in the polymer matrix. The composites have been produced by extrusion followed by injection moulding. They contained different amounts of MWCNTs (0.5, 2, 3 and 5 wt% and coupling agent to enhance the interactions between the carbon nanotubes and the polymer. The electrical resistivity of the composites has been investigated by impedance spectroscopy, whereas their thermal properties have been determined using a thermal analyzer operating on the basis of the periodic thermal perturbation method. Rheological properties, BET-area and adsorption-desorption isotherms have been determined. Dispersion of MWCNTs in the polymer has been studied by scanning electron microscopy (SEM.

  6. A new method for testing thermal shock resistance properties of soapstone – Effects of microstructures and mineralogical variables

    Directory of Open Access Journals (Sweden)

    A. Huhta

    2016-09-01

    Full Text Available Soapstone industry utilizes different types of soapstone mainly as a construction material for fireplaces. In this application soapstone has to meet different temperature requirements in different parts of fireplaces. Mineralogical and structural information is needed for placing an appropriate type of soapstone in an appropriate position in the fireplace construction. This allows employment of higher temperatures resulting in more particulate-free combustion, which makes it possible for soapstone industry to develop more efficient and environmentally friendly fireplaces. Of many soapstone types, which differ from each other in their chemical composition and thermal properties, carbonate soapstone and its microstructural variations were investigated in this study. A new method was developed to measure thermal shock resistant of natural stones. By exposing carbonate soapstone samples of different textural types to rapid temperature changes, it was possible to determine the parameters that affect the capacity of the rock to resist thermal shock. The results indicate that the type of microtexture is an important factor in controlling the thermal shock resistance of carbonate soapstone. The soapstone samples with a high thermal shock resistance show deformation textures, such as crenulation cleavage and S/C mylonite. A strong negative correlation was observed between the thermal shock resistance and length of cleavage domains in foliated rocks. Also a slight elevation in the iron concentration of talc and magnesite was discovered to improve the thermal shock resistance of carbonate soapstone. Attention should especially be paid to the length and planarity of cleavage domains of spaced foliation.

  7. Impact of thermal stress on evolutionary trajectories of pathogen resistance in three-spined stickleback (Gasterosteus aculeatus).

    Science.gov (United States)

    Schade, Franziska M; Shama, Lisa N S; Wegner, K Mathias

    2014-07-26

    Pathogens are a major regulatory force for host populations, especially under stressful conditions. Elevated temperatures may enhance the development of pathogens, increase the number of transmission stages, and can negatively influence host susceptibility depending on host thermal tolerance. As a net result, this can lead to a higher prevalence of epidemics during summer months. These conditions also apply to marine ecosystems, where possible ecological impacts and the population-specific potential for evolutionary responses to changing environments and increasing disease prevalence are, however, less known. Therefore, we investigated the influence of thermal stress on the evolutionary trajectories of disease resistance in three marine populations of three-spined sticklebacks Gasterosteus aculeatus by combining the effects of elevated temperature and infection with a bacterial strain of Vibrio sp. using a common garden experiment. We found that thermal stress had an impact on fish weight and especially on survival after infection after only short periods of thermal acclimation. Environmental stress reduced genetic differentiation (QST) between populations by releasing cryptic within-population variation. While life history traits displayed positive genetic correlations across environments with relatively weak genotype by environment interactions (GxE), environmental stress led to negative genetic correlations across environments in pathogen resistance. This reversal of genetic effects governing resistance is probably attributable to changing environment-dependent virulence mechanisms of the pathogen interacting differently with host genotypes, i.e. GPathogenxGHostxE or (GPathogenxE)x(GHostxE) interactions, rather than to pure host genetic effects, i.e. GHostxE interactions. To cope with climatic changes and the associated increase in pathogen virulence, host species require wide thermal tolerances and pathogen-resistant genotypes. The higher resistance we found

  8. Silver Nanoparticle-Decorated Shape-Memory Polystyrene Sheets as Highly Sensitive Surface-Enhanced Raman Scattering Substrates with a Thermally Inducible Hot Spot Effect.

    Science.gov (United States)

    Mengesha, Zebasil Tassew; Yang, Jyisy

    2016-11-15

    In this study, an active surface-enhanced Raman scattering (SERS) substrate with a thermally inducible hot spot effect for sensitive measurement of Raman-active molecules was successfully fabricated from silver nanoparticle (AgNP)-decorated shape-memory polystyrene (SMP) sheets. To prepare the SERS substrate, SMP sheets were first pretreated with n-octylamine for effective decoration with AgNPs. By varying the formulation and condition of the reduction reaction, AgNP-decorated SMP (Ag@SMP) substrates were successfully prepared with optimized particle gaps to produce inducible hot spot effects on thermal shrink. High-quality SERS spectra were easily obtained with enhancement factors higher than 10 8 by probing with aromatic thiols. Several Ag@SMP substrates produced under different reaction conditions were explored for the creation of inducible hot spot effects. The results indicated that AgNP spacing is crucial for strong hot spot effects. The suitability of Ag@SMP substrates for quantification was also evaluated according to the detection of adenine. Results confirmed that prepared Ag@SMP substrates were highly suitable for quantitative analysis because they yielded an estimated limit of detection as low as 120 pg/cm 2 , a linear range of up to 7 ng/cm 2 , and a regression coefficient (R 2 ) of 0.9959. Ag@SMP substrates were highly reproducible; the average relative standard deviation for all measurements was less than 10%.

  9. Active vacuum brazing of CNT films to metal substrates for superior electron field emission performance

    Science.gov (United States)

    Longtin, Rémi; Sanchez-Valencia, Juan Ramon; Shorubalko, Ivan; Furrer, Roman; Hack, Erwin; Elsener, Hansrudolf; Gröning, Oliver; Greenwood, Paul; Rupesinghe, Nalin; Teo, Kenneth; Leinenbach, Christian; Gröning, Pierangelo

    2015-02-01

    The joining of macroscopic films of vertically aligned multiwalled carbon nanotubes (CNTs) to titanium substrates is demonstrated by active vacuum brazing at 820 °C with a Ag-Cu-Ti alloy and at 880 °C with a Cu-Sn-Ti-Zr alloy. The brazing methodology was elaborated in order to enable the production of highly electrically and thermally conductive CNT/metal substrate contacts. The interfacial electrical resistances of the joints were measured to be as low as 0.35 Ω. The improved interfacial transport properties in the brazed films lead to superior electron field-emission properties when compared to the as-grown films. An emission current of 150 μA was drawn from the brazed nanotubes at an applied electric field of 0.6 V μm-1. The improvement in electron field-emission is mainly attributed to the reduction of the contact resistance between the nanotubes and the substrate. The joints have high re-melting temperatures up to the solidus temperatures of the alloys; far greater than what is achievable with standard solders, thus expanding the application potential of CNT films to high-current and high-power applications where substantial frictional or resistive heating is expected.

  10. Crystallization and electrical resistivity of Cu2O and CuO obtained by thermal oxidation of Cu thin films on SiO2/Si substrates

    International Nuclear Information System (INIS)

    De Los Santos Valladares, L.; Salinas, D. Hurtado; Dominguez, A. Bustamante; Najarro, D. Acosta; Khondaker, S.I.; Mitrelias, T.; Barnes, C.H.W.; Aguiar, J. Albino; Majima, Y.

    2012-01-01

    In this work, we study the crystallization and electrical resistivity of the formed oxides in a Cu/SiO 2 /Si thin film after thermal oxidation by ex-situ annealing at different temperatures up to 1000 °C. Upon increasing the annealing temperature, from the X ray diffractogram the phase evolution Cu → Cu + Cu 2 O → Cu 2 O → Cu 2 O + CuO → CuO was detected. Pure Cu 2 O films are obtained at 200 °C, whereas uniform CuO films without structural surface defects such as terraces, kinks, porosity or cracks are obtained in the temperature range 300–550 °C. In both oxides, crystallization improves with annealing temperature. A resistivity phase diagram, which is obtained from the current–voltage response, is presented here. The resistivity was expected to increase linearly as a function of the annealing temperature due to evolution of oxides. However, anomalous decreases are observed at different temperatures ranges, this may be related to the improvement of the crystallization and crystallite size when the temperature increases. - Highlights: ► The crystallization and electrical resistivity of oxides in a Cu films are studied. ► In annealing Cu films, the phase evolution Cu + Cu 2 O → Cu 2 O → Cu 2 O + CuO → CuO occurs. ► A resistivity phase diagram, obtained from the current–voltage response, is presented. ► Some decreases in the resistivity may be related to the crystallization.

  11. Thermal and substrate color-induced melanization in laboratory reared red-eared sliders (Trachemys scripta elegans).

    Science.gov (United States)

    Rowe, John W; Clark, David L; Mortensen, Rebecca A; Commissaris, Carolyn V; Wittle, Lawrence W; Tucker, John K

    2016-10-01

    Color and pigmentation patterns of the integument can facilitate crypsis, thermoregulation, and social signaling. According to the "thermal melanism hypothesis", cold environmental temperature should increase the quantity of melanin that is deposited in the integument thereby facilitating radiative warming. We studied the influences of water temperature (26°C or 31°C) and substrate color (black or white) on the degree of melanization in the red-eared slider, Trachemys scripta elegans, under laboratory conditions. Turtles reared on a black substrate, or in 26°C water, for 120 days were darker than those reared on a white substrate or in 31°C water. A potential tradeoff between the fitness benefits of crypsis and the benefits of radiative warming through melanism was detected because turtles reared in 26°C water and on a white substrate were darker than those reared on a white substrate and in 31°C water. Low temperatures limited metabolic processes because turtles reared in 26°C water grew more slowly than those reared in 31°C water. However, histological analyses revealed that melanization was a dynamic process in all treatments confirming that the degree of melanization in the cool water treatment was not influenced by the initial and relatively dark hatchling coloration in individuals that grew relatively slowly. Copyright © 2016 Elsevier Ltd. All rights reserved.

  12. Application of Hot-wire Method for Measuring Thermal Conductivity of Fine Ceramics

    Directory of Open Access Journals (Sweden)

    Shangxi WANG

    2016-11-01

    Full Text Available Ceramic substrate is preferred in high density packaging due to its high electrical resistivity and moderate expansion coefficient. The thermal conductivity is a key parameter for packaging substrates. There are two common methods to measure the thermal conductivity, which are the hot-wire method and the laser-flash method. Usually, the thermal conductivities of porcelain is low and meet the measurement range of hot-wire method, and the measured value by hot-wire method has little difference with that by laser-flash method. In recent years, with the requirement of high-powered LED lighting, some kinds of ceramic substrates with good thermal conductivity have been developed and their thermal conductivity always measured by the means of laser flash method, which needs expensive instrument. In this paper, in order to detect the thermal conductivity of fine ceramic with convenience and low cost, the feasibility of replacing the laser flash method with hot wire method to measure thermal conductivity of ceramic composites was studied. The experiment results showed that the thermal conductivity value of fine ceramics measured by the hot-wire method is severely lower than that by the laser-flash method. However, there is a positive relationship between them. It is possible to measure the thermal conductivity of fine ceramic workpiece instantly by hot-wire method via a correction formula.DOI: http://dx.doi.org/10.5755/j01.ms.22.4.12543

  13. Thermal shock resistances of a bonding material of C/C composite and copper

    International Nuclear Information System (INIS)

    Kurumada, Akira; Oku, Tatsuo; Kawamata, Kiyohiro; Motojima, Osamu; Noda, Nobuaki; McEnaney, B.

    1997-01-01

    The purpose of this study is to contribute to the development and the safety design of plasma facing components for fusion reactor devices. We evaluated the thermal shock resistance and the thermal shock fracture toughness of a bonding material which was jointed a carbon-fiber-reinforced carbon composite (C/C composite) to oxygen-free copper. We also examined the microstructures of the bonding layers using a scanning electron microscope before and after thermal shock tests. The bonding material did not fracture during thermal shock tests. However, thermal cracks and delamination cracks were observed in the bonding layers. (author)

  14. Erosion resistance and adhesion of composite metal/ceramic coatings produced by plasma spraying

    OpenAIRE

    Ramm , D.; Hutchings , I.; Clyne , T.

    1993-01-01

    Ceramic coatings can exhibit greater erosion resistance than most metallic coatings. Such coatings are conveniently produced by thermal spraying. Unfortunately, thermally sprayed ceramic coatings often exhibit poor adhesion, partly as a consequence of the development of residual stresses during spraying and subsequent cooling. Composite coatings have been studied using aluminium/alumina deposits on steel substrates. The incorporation of ceramics within a ductile matrix has potential for sharp...

  15. Phonon cross-plane transport and thermal boundary resistance: effect of heat source size and thermal boundary resistance on phonon characteristics

    Science.gov (United States)

    Ali, H.; Yilbas, B. S.

    2016-09-01

    Phonon cross-plane transport across silicon and diamond thin films pair is considered, and thermal boundary resistance across the films pair interface is examined incorporating the cut-off mismatch and diffusive mismatch models. In the cut-off mismatch model, phonon frequency mismatch for each acoustic branch is incorporated across the interface of the silicon and diamond films pair in line with the dispersion relations of both films. The frequency-dependent and transient solution of the Boltzmann transport equation is presented, and the equilibrium phonon intensity ratios at the silicon and diamond film edges are predicted across the interface for each phonon acoustic branch. Temperature disturbance across the edges of the films pair is incorporated to assess the phonon transport characteristics due to cut-off and diffusive mismatch models across the interface. The effect of heat source size, which is allocated at high-temperature (301 K) edge of the silicon film, on the phonon transport characteristics at the films pair interface is also investigated. It is found that cut-off mismatch model predicts higher values of the thermal boundary resistance across the films pair interface as compared to that of the diffusive mismatch model. The ratio of equilibrium phonon intensity due to the cut-off mismatch over the diffusive mismatch models remains >1 at the silicon edge, while it becomes <1 at the diamond edge for all acoustic branches.

  16. ZrO2 coatings on stainless steel by aerosol thermal spraying

    International Nuclear Information System (INIS)

    Di Giampaolo, A.R.; Reveron, H.; Ruiz, H.; Poirier, T.; Lira, J.

    1998-01-01

    Zirconia coatings, with a wide range of thickness (1 to 80 μ) have been obtained by spraying a ZrO 2 sol with an oxyacetylenic flame, on stainless steel substrates. The sol was prepared by mixing Zr-n-propoxide and acetic acid in order to obtain a zirconium oxyacetate precipitate, which was filtrated, washed with 1-propanol, dryed and subjected to an hydrothermal treatment. A new sol-gel based ceramic deposition process , aerosol thermal spraying was developed based on previous thermal spray work. A compressed air spray gun was used to produce a fine aerosol flow which was injected in the flame of the thermal spray torch and deposited on polished and sand blasted substrates. This original technique allows simultaneous spraying, drying and partial sintering of the zirconia nanometric particles. The maximum working temperature necessary to yield a resistant coating is 1000 deg C. This method produced crack-free homogeneous layers of monoclinic ZrO 2 with good adhesion to the substrate and low porosity, as shown by X-ray diffraction and scanning electron microscopy. Oxidation test, carried out by heat treatments in air atmosphere at 800 deg C indicated good protection, mainly for low thickness coatings deposited in polished substrates. This original deposition technique offers several advantages when compared with classical thermal spraying techniques, such as plasma spraying. Copyright (1998) AD-TECH - International Foundation for the Advancement of Technology Ltd

  17. Thermal crosstalk in heated microcantilever arrays

    International Nuclear Information System (INIS)

    Kim, Hoe Joon; Dai, Zhenting; King, William P

    2013-01-01

    We report on a detailed characterization and analysis of thermal crosstalk in a heated microcantilever array. The fabricated heated cantilever array consists of five identical independently controlled heated cantilevers. The temperature of each cantilever can be controlled over a large temperature range, up to 900 °C, by means of an integrated solid-state resistive heater. We analyze thermal crosstalk in steady and transient operating conditions when the heated cantilever array is either in contact with a substrate or freely suspended in air. The thermal conductance between neighboring cantilevers is as high as 0.61 µW °C −1 , resulting in non-negligible temperature increases in neighboring cantilevers, depending upon the operating conditions. By understanding and accounting for thermal crosstalk, it is possible to improve temperature control and temperature measurements with heated microcantilever arrays. (paper)

  18. Surface morphology modelling for the resistivity analysis of low temperature sputtered indium tin oxide thin films on polymer substrates

    International Nuclear Information System (INIS)

    Yin Xuesong; Tang Wu; Weng Xiaolong; Deng Longjiang

    2009-01-01

    Amorphous or weakly crystalline indium tin oxide (ITO) thin film samples have been prepared on polymethylmethacrylate and polyethylene terephthalate substrates by RF-magnetron sputtering at a low substrate temperature. The surface morphological and electrical properties of the ITO layers were measured by atomic force microscopy (AFM) and a standard four-point probe measurement. The effect of surface morphology on the resistivity of ITO thin films was studied, which presented some different variations from crystalline films. Then, a simplified film system model, including the substrate, continuous ITO layer and ITO surface grain, was proposed to deal with these correlations. Based on this thin film model and the AFM images, a quadratic potential was introduced to simulate the characteristics of the ITO surface morphology, and the classical Kronig-Penney model, the semiconductor electrical theory and the modified Neugebauer-Webb model were used to expound the detailed experimental results. The modelling equation was highly in accord with the experimental variations of the resistivity on the characteristics of the surface morphology.

  19. Phase and thickness dependence of thermal diffusivity in a-SiCxNy and a-BCxNy

    International Nuclear Information System (INIS)

    Chattopadhyay, S.; Chen, L.C.; Chien, S.C.; Lin, S.T.; Wu, C.T.; Chen, K.H.

    2002-01-01

    Thermal diffusivity (α) and bonding configuration of amorphous silicon carbon nitride (a-SiC x N y ) and boron carbon nitride (a-BC x N y ) films on silicon substrates were studied. Measurement of α by the traveling wave technique and bonding characterisation through X-ray photoelectron spectroscopy in a-SiC x N y and a-BC x N y films having different carbon concentrations revealed that lower coordinated bonds were detrimental to the thermal diffusivity of these films. Furthermore, α was found to depend on the thickness of these films deposited on silicon. This was attributed to the interface thermal resistance between two thermally different materials, the film and the substrate, although other factors such as film microstructure could also play a role. An empirical relation for the variation of thermal diffusivity with thickness is proposed

  20. Hydro-Thermal Fatigue Resistance Measurements on Polymer Interfaces

    Science.gov (United States)

    Gurumurthy, Charan K.; Kramer, Edward J.; Hui, Chung-Yuen

    1998-03-01

    We have developed a new technique based on a fiber optic displacement sensor for rapid determination of hydro-thermal fatigue crack growth rate per cycle (da/dN) of an epoxy/polyimide interface used in flip chip attach microelectronic assembly. The sample is prepared as a trilayered cantilever beam by capillary flow of the epoxy underfill over a polyimide coated metallic beam. During hydro-thermal cycling the crack growth along the interface (from the free end) changes the displacement of this end of the beam and we measure the free end displacement at the lowest temperature in each hydro-thermal cycle. The change in beam displacement is then converted into crack growth rate (da/dN). da/dN depends on the maximum change in the strain energy release rate of the crack and the phase angle in each cycle. The relation between da/dN and maximum strain energy release rate characterizes the fatigue crack growth resistance of the interface. We have developed and used a simple model anhydride cured and a commercially available PMDA/ODA passivation for this study.

  1. Surface resistance of YBa2Cu3O7 films deposited on LaGaO3 substrates

    International Nuclear Information System (INIS)

    Cooke, D.W.; Gray, E.R.; Houlton, R.J.; Javadi, H.H.S.; Maez, M.A.; Bennett, B.L.; Rusnak, B.; Meyer, E.A.; Arendt, P.N.; Beery, J.G.; Brown, D.R.; Garzon, F.H.; Raistriek, I.D.; Bolmaro, B.; Elliott, N.E.; Rollett, A.D.; Klein, N.; Muller, G.; Orbach, S.; Piel, H.; Josefowicz, J.Y.; Rensch, O.B.; Drabeck, L.; Gruner, G.

    1989-01-01

    Superconducting films of YBa 2 Cu 3 O 7 deposited onto LaGaO 3 substrates were prepared by e-beam and magnetron sputtering techniques. Surface resistance measurements made at 22 GHz, 86 GHz, and 148 GHz show that these films are superior to those deposited by similar techniques onto SrTiO 3 . Typical surface resistance values measured at 22 GHz and 12 K are ∼2 m(cgom) with the lowest value being 0.2 m(cgom), which is only 2 to 4 times higher than Nb. The surface resistance is proportional to the square of the measuring frequency

  2. Full densification of inkjet-printed copper conductive tracks on a flexible substrate utilizing a hydrogen plasma sintering

    Science.gov (United States)

    Kwon, Young-Tae; Lee, Young-In; Kim, Seil; Lee, Kun-Jae; Choa, Yong-Ho

    2017-02-01

    Low temperature sintering techniques are crucial in developing flexible printed electronics. In this work, we demonstrate a novel hydrogen plasma sintering method that achieves a full reduction and densification of inkjet-printed patterns using a copper complex ion ink. After inkjet printing on polyethylene terephthalate (PET) substrates, both hydrogen plasma and conventional hydrogen thermal treatment were employed to compare the resulting microstructures, electrical properties and anti-oxidation behavior. The plasma treated pattern shows a fully densified microstructure with a resistivity of 3.23 μΩ cm, while the thermally treated pattern shows a relatively poor microstructure and high resistivity. In addition, the hydrogen plasma-treated copper pattern retains its electrical resistivity for one month without any significant decrease. This novel hydrogen plasma sintering technique could be used to produce conductive patterns with excellent electrical properties, allowing for highly reliable flexible printed electronics.

  3. Dynamics of ultrathin metal films on amorphous substrates under fast thermal processing

    International Nuclear Information System (INIS)

    Favazza, Christopher; Kalyanaraman, Ramki; Sureshkumar, Radhakrishna

    2007-01-01

    A mathematical model is developed to analyze the growth/decay rate of surface perturbations of an ultrathin metal film on an amorphous substrate (SiO 2 ). The formulation combines the approach of Mullins [W. W. Mullins, J. Appl. Phys. 30, 77 (1959)] for bulk surfaces, in which curvature-driven mass transport and surface deformation can occur by surface/volume diffusion and evaporation-condensation processes, with that of Spencer et al. [B. J. Spencer, P. W. Voorhees, and S. H. Davis, Phys. Rev. Lett. 67, 26 (1991)] to describe solid-state transport in thin films under epitaxial strain. Modifications of the Mullins model to account for thin-film boundary conditions result in qualitatively different dispersion relationships especially in the limit as kh o o is the unperturbed film height. The model is applied to study the relative rate of solid-state mass transport as compared to that of liquid phase dewetting in a thin film subjected to a fast thermal pulse. Specifically, we have recently shown that multiple cycles of nanosecond (ns) pulsed laser melting and resolidification of ultrathin metal films on amorphous substrates can lead to the formation of various types of spatially ordered nanostructures [J. Trice, D. Thomas, C. Favazza, R. Sureshkumar, and R. Kalyanaraman, Phys. Rev. B 75, 235439 (2007)]. The pattern formation has been attributed to the dewetting of the thin film by a hydrodynamic instability. In such experiments the film is in the solid state during a substantial fraction of each thermal cycle. However, results of a linear stability analysis based on the aforementioned model suggest that solid-state mass transport has a negligible effect on morphological changes of the surface. Further, a qualitative analysis of the effect of thermoelastic stress, induced by the rapid temperature changes in the film-substrate bilayer, suggests that stress relaxation does not appreciably contribute to surface deformation. Hence, surface deformation caused by liquid

  4. Formaldehyde-free and thermal resistant microcapsules containing n-octadecane

    International Nuclear Information System (INIS)

    Shan, X.L.; Wang, J.P.; Zhang, X.X.; Wang, X.C.

    2009-01-01

    Microcapsules containing n-octadecane were synthesized using methacrylic acid (MAA), methyl methacrylate (MMA) and 1,4-butylene glycol diacrylate (BDDA) as shell. The surface morphology, thermal physical properties, thermal stabilities and diameter distributions of the microcapsules were investigated using scanning electron microscopy (SEM), differential scanning calorimetry (DSC), thermogravimetric analysis (TG) and particle size distribution analysis, respectively. The experimental results show that, the core material is well encapsulated in the presence of emulsifier-sodium salt of styrene-maleic anhydride co-polymer. The average diameter of the microcapsules is 18 μm. The enthalpy of microencapsulated n-octadecane (MC 18 ) with MAA-MMA co-polymeric shell is 155 J g -1 which corresponds to 70 wt.% core content. The thermal resistant temperature of MC 18 is 238 o C, which is affected by n-octadecane/monomers mass ratios and the content of cross-linking agent-BDDA.

  5. Corrosion resistance of Cu-Al coatings produced by thermal spray

    Directory of Open Access Journals (Sweden)

    Laura Marcela Dimaté Castellanos

    2012-01-01

    Full Text Available Many components in the shipbuilding industry are made of copper-based alloys. These pieces tend to break due to corrosion generated by a marine environment; such components can be salvaged through surface engineering, through deposition of suitable coatings. This paper studied the influence of three surface preparation methods involving phosphor bronze substrates concerning the corrosion resistance of commercial coatings having Al-Cu +11% Fe chemical composition. The surface was prepared using three methods: sand blasting, shot blasting and metal polishing with an abrasive disk (with and without a base layer. The deposited coatings were micro-structurally characterised by x-ray diffraction (XRD, optical microscopy and scanning electron microscopy (SEM. Corrosion resistance was evaluated by electrochemical test electrochemical impedance spectroscopy (EIS. Surfaces prepared by sandblasting showed the best resistance to corrosion, so these systems could be a viable alternative for salvaging certain parts in the marine industry. The corrosion mechanisms for the coatings produced are discussed in this research.

  6. Solvent-resistant organic transistors and thermally stable organic photovoltaics based on cross-linkable conjugated polymers

    KAUST Repository

    Kim, Hyeongjun

    2012-01-10

    Conjugated polymers, in general, are unstable when exposed to air, solvent, or thermal treatment, and these challenges limit their practical applications. Therefore, it is of great importance to develop new materials or methodologies that can enable organic electronics with air stability, solvent resistance, and thermal stability. Herein, we have developed a simple but powerful approach to achieve solvent-resistant and thermally stable organic electronic devices with a remarkably improved air stability, by introducing an azide cross-linkable group into a conjugated polymer. To demonstrate this concept, we have synthesized polythiophene with azide groups attached to end of the alkyl chain (P3HT-azide). Photo-cross-linking of P3HT-azide copolymers dramatically improves the solvent resistance of the active layer without disrupting the molecular ordering and charge transport. This is the first demonstration of solvent-resistant organic transistors. Furthermore, the bulk-heterojunction organic photovoltaics (BHJ OPVs) containing P3HT-azide copolymers show an average efficiency higher than 3.3% after 40 h annealing at an elevated temperature of 150 °C, which represents one of the most thermally stable OPV devices reported to date. This enhanced stability is due to an in situ compatibilizer that forms at the P3HT/PCBM interface and suppresses macrophase separation. Our approach paves a way toward organic electronics with robust and stable operations. © 2011 American Chemical Society.

  7. Effect of thermal contact resistances on fast charging of large format lithium ion batteries

    International Nuclear Information System (INIS)

    Ye, Yonghuang; Saw, Lip Huat; Shi, Yixiang; Somasundaram, Karthik; Tay, Andrew A.O.

    2014-01-01

    Highlights: • The effect of thermal contact resistance on thermal performance of large format lithium ion batteries. • The effect of temperature gradient on electrochemical performance of large format batteries during fast charging. • The thermal performance of lithium ion battery utilizing pulse charging protocol. • Suggestions on battery geometry design optimization to improve thermal performance. - Abstract: A two dimensional electrochemical thermal model is developed on the cross-plane of a laminate stack plate pouch lithium ion battery to study the thermal performance of large format batteries. The effect of thermal contact resistance is taken into consideration, and is found to greatly increase the maximum temperature and temperature gradient of the battery. The resulting large temperature gradient would induce in-cell non-uniformity of charging-discharging current and state of health. Simply increasing the cooling intensity is inadequate to reduce the maximum temperature and narrow down the temperature difference due to the poor cross-plane thermal conductivity. Pulse charging protocol does not help to mitigate the temperature difference on the bias of same total charging time, because of larger time-averaged heat generation rate than constant current charging. Suggestions on battery geometry optimizations for both prismatic/pouch battery and cylindrical battery are proposed to reduce the maximum temperature and mitigate the temperature gradient within the lithium ion battery

  8. Mechanical integrity of thin inorganic coatings on polymer substrates under quasi-static, thermal and fatigue loadings

    International Nuclear Information System (INIS)

    Leterrier, Y.; Mottet, A.; Bouquet, N.; Gillieron, D.; Dumont, P.; Pinyol, A.; Lalande, L.; Waller, J.H.; Manson, J.-A.E.

    2010-01-01

    The interplay between residual stress state, cohesive and adhesive properties of coatings on substrates is reviewed in this article. Attention is paid to thin inorganic coatings on polymers, characterized by a very high hygro-thermo-mechanical contrast between the brittle and stiff coating and the compliant and soft substrate. An approach to determine the intrinsic, thermal and hygroscopic contributions to the coating residual stress is detailed. The critical strain for coating failure, coating toughness and coating/substrate interface shear strength are derived from the analysis of progressive coating cracking under strain. Electro-fragmentation and electro-fatigue tests in situ in a microscope are described. These methods enable reproducing the thermo-mechanical loads present during processing and service life, hence identifying and modeling the critical conditions for failure. Several case studies relevant to food and pharmaceutical packaging, flexible electronics and thin film photovoltaic devices are discussed to illustrate the benefits and limits of the present methods and models.

  9. Response of wetland herbaceous communities to gradients of light and substrate following disturbance by thermal pollution

    Science.gov (United States)

    Dunn, Christopher P.; Scott, Michael L.

    1987-01-01

    The influence of thermal disturbance and site characteristics on distribution of herbs was studied in portions of a 3020 ha wetland in the southeastern USA. Presence-absence of 52 species in 130 0.25 m2 plots was determined from four sites with different disturbance histories and from an undisturbed site. Data from the four disturbed sites were ordinated by detrended correspondence analysis. Differences in species composition among sites (coarse scale) were associated with water depth, light, and substrate type. Within a site (at a fine scale), correlation of environmental variables with ordination scores at a chronically disturbed site was weakly correlated with light (r=0.50). At two sites with episodic disturbance, species composition correlated significantly and positively with substrate and water depth. At a recovering site, vegetation patterns were moderately correlated with water depth (r=−0.52). Species richness was correlated with substrate type along the disturbance gradient. Our results are consistent the intermediate disturbance hypothesis and the subsidy-stress gradient concept.

  10. Anion exchanger and the resistance against thermal haemolysis.

    Science.gov (United States)

    Ivanov, I T; Zheleva, A; Zlatanov, I

    2011-01-01

    4,4'-Diiso-thiocyanato stilbene-2,2'-disulphonic acid (DIDS) is a membrane-impermeable, highly specific covalent inhibitor and powerful thermal stabiliser of the anion exchanger (AE1), the major integral protein of erythrocyte membrane (EM). Suspensions of control and DIDS-treated (15 µM, pH 8.2) human erythrocytes were heated from 20° to 70°C using various but constant heating rates (1-8°C/min). The cellular electrolyte leakage exhibited a sigmoidal response to temperature as detected by conductometry. The critical midpoint temperature of leakage, T(mo), extrapolated to low heating rate (0.5°C/min) was used as a measure for EM thermostability. T(mo) was greater for DIDS-treated erythrocytes, 63.2° ± 0.3°C, than for intact erythrocytes, 60.7° ± 0.2°C. The time, t(1/2), for 50% haemolysis of erythrocytes, exposed to 53°C was used as a measure for the resistance of erythrocytes against thermal haemolysis. The t(1/2) was also greater for DIDS-treated erythrocytes, 63 ± 3 min, than for intact erythrocytes, 38 ± 2 min. The fluorescent label N-(3-pyrenyl)maleimide and EPR spin label 3-maleimido-proxyl, covalently bound to sulphydryl groups of major EM proteins, were used to monitor the changes in molecular motions during transient heating. Both labels reported an intensification of the motional dynamics at the denaturation temperatures of spectrin (50°C) and AE1 (67°C), and, surprisingly, immobilisation of a major EM protein, presumably the AE1, at T(mo). The above results are interpreted in favour of the possible involvement of a predenaturational rearrangement of AE1 copies in the EM thermostability and the resistance against thermal haemolysis.

  11. Impact of the silicon substrate resistivity and growth condition on the deep levels in Ni-Au/AlN/Si MIS Capacitors

    Science.gov (United States)

    Wang, Chong; Simoen, Eddy; Zhao, Ming; Li, Wei

    2017-10-01

    Deep levels formed under different growth conditions of a 200 nm AlN buffer layer on B-doped Czochralski Si(111) substrates with different resistivity were investigated by deep-level transient spectroscopy (DLTS) on metal-insulator-semiconductor capacitors. Growth-temperature-dependent Al diffusion in the Si substrate was derived from the free carrier density obtained by capacitance-voltage measurement on samples grown on p- substrates. The DLTS spectra revealed a high concentration of point and extended defects in the p- and p+ silicon substrates, respectively. This indicated a difference in the electrically active defects in the silicon substrate close to the AlN/Si interface, depending on the B doping concentration.

  12. Design and simulation of thermal residual stresses of coatings on WC-Co cemented carbide cutting tool substrate

    International Nuclear Information System (INIS)

    Li, Anhai; Zhao, Jun; Zang, Jian; Zheng, Wei

    2016-01-01

    Large thermal residual stresses in coatings during the coating deposition process may easily lead to coating delamination of coated carbide tools in machining. In order to reduce the possibility of coating delamination during the tool failure process, a theoretical method was proposed and a numerical method was constructed for the coating design of WC-Co cemented carbide cutting tools. The thermal residual stresses of multi-layered coatings were analytically modeled based on equivalent parameters of coating properties, and the stress distribution of coatings are simulated by Finite element method (FEM). The theoretically calculated results and the FEM simulated results were verified and in good agreement with the experimental test results. The effects of coating thickness, tool substrate, coating type and interlayer were investigated by the proposed geometric and FEM model. Based on the evaluations of matchability of tool substrate and tool coatings, the basic principles of tool coating design were proposed. This provides theoretical basis for the selection and design of coatings of cutting tools in high-speed machining

  13. Crack Driving Forces in a Multilayered Coating System for Ceramic Matrix Composite Substrates

    Science.gov (United States)

    Ghosn, Louis J.; Zhu, Dongming; Miller, Robert A.

    2005-01-01

    The effects of the top coating thickness, modulus and shrinkage strains on the crack driving forces for a baseline multilayer Yttria-Stabilized-Zirconia/Mullite/Si thermal and environment barrier coating (TEBC) system for SiC/SiC ceramic matrix composite substrates are determined for gas turbine applications. The crack driving forces increase with increasing modulus, and a low modulus thermal barrier coating material (below 10 GPa) will have no cracking issues under the thermal gradient condition analyzed. Since top coating sintering increases the crack driving forces with time, highly sintering resistant coatings are desirable to maintain a low tensile modulus and maintain a low crack driving force with time. Finite element results demonstrated that an advanced TEBC system, such as ZrO2/HfO2, which possesses improved sintering resistance and high temperature stability, exhibited excellent durability. A multi-vertical cracked structure with fine columnar spacing is an ideal strain tolerant coating capable of reducing the crack driving forces to an acceptable level even with a high modulus of 50 GPa.

  14. Evaluation of the drain—source voltage effect on AlGaAs/InGaAs PHEMTs thermal resistance by the structure function method

    International Nuclear Information System (INIS)

    Ma Lin; Feng Shiwei; Zhang Yamin; Deng Bing; Yue Yuan

    2014-01-01

    The effect of drain—source voltage on AlGaAs/InGaAs PHEMTs thermal resistance is studied by experimental measuring and simulation. The result shows that AlGaAs/InGaAs PHEMTs thermal resistance presents a downward trend under the same power dissipation when the drain—source voltage (V DS ) is decreased. Moreover, the relatively low V DS and large drain—source current (I DS ) result in a lower thermal resistance. The chip-level and package-level thermal resistance have been extracted by the structure function method. The simulation result indicated that the high electric field occurs at the gate contact where the temperature rise occurs. A relatively low V DS leads to a relatively low electric field, which leads to the decline of the thermal resistance. (semiconductor devices)

  15. Thermally oxidized titania nanotubes enhance the corrosion resistance of Ti6Al4V.

    Science.gov (United States)

    Grotberg, John; Hamlekhan, Azhang; Butt, Arman; Patel, Sweetu; Royhman, Dmitry; Shokuhfar, Tolou; Sukotjo, Cortino; Takoudis, Christos; Mathew, Mathew T

    2016-02-01

    The negative impact of in vivo corrosion of metallic biomedical implants remains a complex problem in the medical field. We aimed to determine the effects of electrochemical anodization (60V, 2h) and thermal oxidation (600°C) on the corrosive behavior of Ti-6Al-4V, with serum proteins, at physiological temperature. Anodization produced a mixture of anatase and amorphous TiO2 nanopores and nanotubes, while the annealing process yielded an anatase/rutile mixture of TiO2 nanopores and nanotubes. The surface area was analyzed by the Brunauer-Emmett-Teller method and was estimated to be 3 orders of magnitude higher than that of polished control samples. Corrosion resistance was evaluated on the parameters of open circuit potential, corrosion potential, corrosion current density, passivation current density, polarization resistance and equivalent circuit modeling. Samples both anodized and thermally oxidized exhibited shifts of open circuit potential and corrosion potential in the noble direction, indicating a more stable nanoporous/nanotube layer, as well as lower corrosion current densities and passivation current densities than the smooth control. They also showed increased polarization resistance and diffusion limited charge transfer within the bulk oxide layer. The treatment groups studied can be ordered from greatest corrosion resistance to least as Anodized+Thermally Oxidized > Anodized > Smooth > Thermally Oxidized for the conditions investigated. This study concludes that anodized surface has a potential to prevent long term implant failure due to corrosion in a complex in-vivo environment. Copyright © 2015 Elsevier B.V. All rights reserved.

  16. Studies on thermal degradation and termite resistant properties of chemically modified wood

    Energy Technology Data Exchange (ETDEWEB)

    Deka, M.; Saikia, C.N. [Council for Scientific and Industrial Research (CSIR), Regional Research Laboratory, Jorhat (India); Baruah, K.K. [Assam Agricultural University, Jorhat (India)

    2002-09-01

    A series of experiments were carried out to examine the resistant capacity of a chemically treated hard wood, Anthocephalus cadamba (Roxb) Miq. to thermal and termite degradation. The treatment with thermosetting resins viz. urea formaldehyde (UF), melamine formaldehyde (MF) and phenol formaldehyde (PF) at 31-33 levels of weight percent gain (WPG) increased the strength property i.e. modulus of rupture (MOR) by 7.50-21.02% and stiffness i.e. modulus of elasticity (MOE) by 9.50-12.18% over the untreated one with no remarkable effect on specific gravity. The treated samples were found resistant to termite attack, while the untreated one was badly damaged by termites on 12 months' exposure to a termite colony. The thermal degradations of untreated and treated wood samples were studied using thermogravimetric (TGA) and differential thermogravimetric (DTG) techniques at heating rates 20 and 30 {sup o}Cmin{sup -1} in temperature range 30-650{sup o}C. The treated wood was found to be thermally more stable than the untreated one. (author)

  17. CMOS pixel sensors on high resistive substrate for high-rate, high-radiation environments

    Energy Technology Data Exchange (ETDEWEB)

    Hirono, Toko, E-mail: thirono@uni-bonn.de [Physikalisches Institute der Universität Bonn, Bonn (Germany); Barbero, Marlon; Breugnon, Patrick; Godiot, Stephanie [CPPM, Aix-Marseille Universite, CNRS/IN2P3, Marseille (France); Gonella, Laura; Hemperek, Tomasz; Hügging, Fabian; Krüger, Hans [Physikalisches Institute der Universität Bonn, Bonn (Germany); Liu, Jian; Pangaud, Patrick [CPPM, Aix-Marseille Universite, CNRS/IN2P3, Marseille (France); Peric, Ivan [IPE, Karlsruher Institut für Technologie, Karlsruhe (Germany); Pohl, David-Leon [Physikalisches Institute der Universität Bonn, Bonn (Germany); Rozanov, Alexandre [CPPM, Aix-Marseille Universite, CNRS/IN2P3, Marseille (France); Rymaszewski, Piotr [Physikalisches Institute der Universität Bonn, Bonn (Germany); Wang, Anqing [CPPM, Aix-Marseille Universite, CNRS/IN2P3, Marseille (France); Wermes, Norbert [Physikalisches Institute der Universität Bonn, Bonn (Germany)

    2016-09-21

    A depleted CMOS active pixel sensor (DMAPS) has been developed on a substrate with high resistivity in a high voltage process. High radiation tolerance and high time resolution can be expected because of the charge collection by drift. A prototype of DMAPS was fabricated in a 150 nm process by LFoundry. Two variants of the pixel layout were tested, and the measured depletion depths of the variants are 166 μm and 80 μm. We report the results obtained with the prototype fabricated in this technology.

  18. High-temperature stability of chemically vapor-deposited tungsten-silicon couples rapid thermal annealed in ammonia and argon

    International Nuclear Information System (INIS)

    Broadbent, E.K.; Morgan, A.E.; Flanner, J.M.; Coulman, B.; Sadana, D.K.; Burrow, B.J.; Ellwanger, R.C.

    1988-01-01

    A rapid thermal anneal (RTA) in an NH 3 ambient has been found to increase the thermal stability of W films chemically vapor deposited (CVD) on Si. W films deposited onto single-crystal Si by low-pressure CVD were rapid thermal annealed at temperatures between 500 and 1100 0 C in NH 3 and Ar ambients. The reactions were studied using Rutherford backscattering spectrometry, x-ray diffraction, Auger electron spectroscopy, transmission electron microscopy, and four-point resistivity probe. High-temperature (≥1000 0 C) RTA in Ar completely converted W into the low resistivity (31 μΩ cm) tetragonal WSi 2 phase. In contrast, after a prior 900 0 C RTA in NH 3 , N inclusion within the W film and at the W/Si interface almost completely suppressed the W-Si reaction. Detailed examination, however, revealed some patches of WSi 2 formed at the interface accompanied by long tunnels extending into the substrate, and some crystalline precipitates in the substrate close to the interface. The associated interfacial contact resistance was only slightly altered by the 900 0 C NH 3 anneal. The NH 3 -treated W film acted as a diffusion barrier in an Al/W/Si contact metallurgy up to at least 550 0 C, at which point some increase in contact resistance was measured

  19. Optical monitoring systems for thermal spray processes: droplets behavior and substrate pre-treatments

    Science.gov (United States)

    Kawaguchi, Y.; Kobayashi, N.; Yamagata, Y.; Miyazaki, F.; Yamasaki, M.; Tanaka, J.; Muraoka, K.

    2017-11-01

    Thermal spray is a technique to form molten droplets using either plasma- or combustion-heating, which impinge upon substrates to form coating layers for various purposes, such as anti-corrosion and anti-wear layers. Although it is an established technique having a history of more than a century, operations of spray guns together with preparing suitable substrate surfaces for obtaining good coating layers still rely on experienced technicians. Because of the necessity of meeting more and more stringent requirements for coating quality and cost from customers, there has been a strong need to try to monitor spray processes, so as to obtain the best possible spray coating layers. The basic requirements for such monitoring systems are *reasonably cheap, *easy operation for laypersons, *easy access to targets to be investigated, and *an in-situ capability. The purpose of the present work is to provide suitable optical monitoring systems for (1) droplets behavior and (2) substrate pre-treatments. For the former (1), the first result was already presented at the 17th laser-aided plasma diagnostics meeting (LAPD17) in 2015 in Sapporo, and the results of its subsequent applications into real spray environments are shown in this article in order to validate the previous proposal. Topic (2) is new in the research program, and the proof-of-principle experiment for the proposed method yielded a favorable result. Based on this positive result, an overall strategy is being planned to fulfill the final objective of the optical monitoring of substrate pre-treatments. Details of these two programs (1) and (2) together with the present status are described.

  20. Transport properties of MnTe films with cracks produced in thermal cycling process

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Liang; Wang, Zhenhua; Zhang, Zhidong [Institute of Metal Research, University of Chinese Academy of Sciences, Chinese Academy of Sciences, Shenyang National Laboratory for Materials Science, Shenyang (China)

    2017-10-15

    As a promising material in antiferromagnetic spintronics, MnTe films manifested complex characteristics according to previous reports. In this work, we investigate in details the temperature dependence of resistivity of MnTe films grown on SiO{sub 2}/Si substrate and focus on the divaricating of cooling and warming resistivity-temperature (R-T) curves. It is found that such a divaricating in resistivity is associated with cracks produced in thermal cycles. By comparing the crystalline character and the morphology before and after the cycles, we verify the appearance of cracks and the release of stress in the films. Based on the temperature dependence of thermal-expansion coefficient of Si and MnTe, the origin of the cracks is the mismatched thermal-expansion coefficient (α). The humps, which only appear in the R-T curve of the first cooling process, are attributed to the produced cracks and/or the unreleased stress. (orig.)

  1. EXAMINATION OF THE OXIDATION PROTECTION OF ZINC COATINGS FORMED ON COPPER ALLOYS AND STEEL SUBSTRATES

    International Nuclear Information System (INIS)

    Papazoglou, M.; Chaliampalias, D.; Vourlias, G.; Pavlidou, E.; Stergioudis, G.; Skolianos, S.

    2010-01-01

    The exposure of metallic components at aggressive high temperature environments, usually limit their usage at similar application because they suffer from severe oxidation attack. Copper alloys are used in a wide range of high-quality indoor and outdoor applications, statue parts, art hardware, high strength and high thermal conductivity applications. On the other hand, steel is commonly used as mechanical part of industrial set outs or in the construction sector due to its high mechanical properties. The aim of the present work is the examination of the oxidation resistance of pack cementation zinc coatings deposited on copper, leaded brass and steel substrates at elevated temperature conditions. Furthermore, an effort made to make a long-term evaluation of the coated samples durability. The oxidation results showed that bare substrates appear to have undergone severe damage comparing with the coated ones. Furthermore, the mass gain of the uncoated samples was higher than this of the zinc covered ones. Particularly zinc coated brass was found to be more resistant to oxidation conditions in which it was exposed as it has the lower mass gain as compared to the bare substrates and zinc coated copper. Zinc coated steel was also proved to be more resistive than the uncoated steel.

  2. Improvement of thermal shock resistance of isotropic graphite by ti-doping

    International Nuclear Information System (INIS)

    Lopez-Galilea, I.; Ordas, N.; Garcia-Rosales, C.; Lindig, S.

    2007-01-01

    Full text of publication follows: Carbon fiber reinforced carbon (CFC) is the present candidate material for the strike point area of the ITER divertor due to its ability to withstand excessive heat loads during ELMs and plasma disruptions. However, chemical erosion of carbon under hydrogen bombardment from the plasma involves serious disadvantages for this application (replacement and safety problems due to tritium co-deposition). In addition, the manufacturing process of present CFC candidate materials is long and complex resulting in high costs, and CFC materials are inherently anisotropic. Doping of carbon with small amounts (several at. %) of titanium has proved to be effective in reducing chemical erosion while maintaining or even improving the mechanical properties. furthermore, TiC as dopant contributes to increase significantly the thermal conductivity and consequently the thermal shock resistance, due to the catalytic effect of this carbide on the graphitization. The aim of this work is to improve substantially the thermal shock resistance of fine-grained isotropic graphite by doping it with small amounts of TiC, reducing at the same time the chemical erosion. By this way Ti-doped graphites could be competitive with present CFC candidate materials for next step fusion devices. To achieve this, a synthetic naphthalene-derived mesophase pitch named AR is used as carbon precursor; this raw material exhibits excellent graphitizability, high chemical purity and consistent quality. Due to the low viscosity at the softening point of AR, resulting in swelling during the carbonization treatment, it is necessary to modify the initial viscosity of AR by an adequate oxidative stabilization treatment. As dopant, TiC powder with 130 nm average particle size is added. The influence of several manufacturing parameters such as oxidative stabilization treatment, carbonization cycle, graphitization temperature and dwell time during graphitization have been investigated in

  3. Improvement of thermal shock resistance of isotropic graphite by ti-doping

    Energy Technology Data Exchange (ETDEWEB)

    Lopez-Galilea, I.; Ordas, N.; Garcia-Rosales, C. [Navarrra Univ., CEPT, San Sebastian (Spain); Lindig, S. [Max-Planck-Institut fuer Plasmaphysik, EURATOM Association, Garching (Germany)

    2007-07-01

    Full text of publication follows: Carbon fiber reinforced carbon (CFC) is the present candidate material for the strike point area of the ITER divertor due to its ability to withstand excessive heat loads during ELMs and plasma disruptions. However, chemical erosion of carbon under hydrogen bombardment from the plasma involves serious disadvantages for this application (replacement and safety problems due to tritium co-deposition). In addition, the manufacturing process of present CFC candidate materials is long and complex resulting in high costs, and CFC materials are inherently anisotropic. Doping of carbon with small amounts (several at. %) of titanium has proved to be effective in reducing chemical erosion while maintaining or even improving the mechanical properties. furthermore, TiC as dopant contributes to increase significantly the thermal conductivity and consequently the thermal shock resistance, due to the catalytic effect of this carbide on the graphitization. The aim of this work is to improve substantially the thermal shock resistance of fine-grained isotropic graphite by doping it with small amounts of TiC, reducing at the same time the chemical erosion. By this way Ti-doped graphites could be competitive with present CFC candidate materials for next step fusion devices. To achieve this, a synthetic naphthalene-derived mesophase pitch named AR is used as carbon precursor; this raw material exhibits excellent graphitizability, high chemical purity and consistent quality. Due to the low viscosity at the softening point of AR, resulting in swelling during the carbonization treatment, it is necessary to modify the initial viscosity of AR by an adequate oxidative stabilization treatment. As dopant, TiC powder with 130 nm average particle size is added. The influence of several manufacturing parameters such as oxidative stabilization treatment, carbonization cycle, graphitization temperature and dwell time during graphitization have been investigated in

  4. Thermal degradation of ohmic contacts on semipolar (11-22) GaN films grown on m-plane (1-100) sapphire substrates

    International Nuclear Information System (INIS)

    Kim, Doo Soo; Kim, Deuk Young; Seo, Yong Gon; Kim, Ji Hoon; Hwang, Sung Min; Baik, Kwang Hyeon

    2012-01-01

    Semipolar (11-22) GaN films were grown on m-plane (1-100) sapphire substrates by using metalorganic chemical vapor deposition. The line widths of the omega rocking curves of the semipolar GaN films were 498 arcsec along the [11-23] GaN direction and 908 arcsec along the [10-10] GaN direction. The properties of the Ti/Al/Ni/Au metal contact were investigated using transmission-line-method patterns oriented in both the [11-23] GaN and the [10-10] GaN directions of semipolar (11-22) GaN. The minimum specific contact resistance of ∼3.6 x 10 -4 Ω·cm -2 was obtained on as-deposited metal contacts. The Ohmic contact properties of semipolar (11-22) GaN became degraded with increasing annealing temperature above 400 .deg. C. The thermal degradation of the metal contacts may be attributed to the surface property of N-polarity on the semipolar (11-22) GaN films. Also, the semipolar (11-22) GaN films did not show clear anisotropic behavior of the electrical properties for different azimuthal angles.

  5. APLIKASI THERMAL PRE-TREATMENT LIMBAH TANAMAN JAGUNG (Zea mays SEBAGAI CO·SUBSTRAT PADA PROSES ANAEROBIK DIGESTI UNTUK PRODUKSI BIOGAS

    Directory of Open Access Journals (Sweden)

    Darwin Darwin

    2016-04-01

    mikroorganisme anaerobik untuk mengkonversi polimer yang berupa selulosa dan hemiselulosa menjadi biogas. Tujuan dari penelitian ini adalah untuk melakukan kajian mengenai penerapan thermal pre-treatment pada limbah tanaman jagung terhadap proses anaerobik digesi yang meliputi efisiensi proses digesi dan produksi biogas yang dihasilkan. Penelitian ini dilakukan dengan menggunakan reaktor tipe batch yang suhunya dipertahankan pada kondisi mesophilic atau di atas rata-rata suhu kamar (33 ± 2 oC. Hasil penelitian diperoleh bahwa thermal pre-treatment yang diberikan pada limbah tanaman jagung mampu mempercepat proses produksi biogas pada 10 hari pertama sehingga dapat mengurangi lag-phase pada proses anaerobik digesi. Limbah tanaman jagung yang diberikan thermal pre-treatment mengalami perlambatan produksi biogas pada hari ke 26 dengan rata-rata total produksi 12.412,5 mL untuk limbah tanaman jagung yang diberikan thermal pre- treatment selama 15 menit, dan 12.310 mL untuk limbah tanaman jagung yang diberikan thermal pre-treatment selama 25 menit, sedangkan limbah tanaman jagung yang tidak diberikan pre-treatment menghasilkan produksi biogas sebesar 12.557 mL pada hari ke 26. Produksi biogas harian tertinggi terjadi pada substrat yang diberikan thermal pre-treatment 25 menit, dengan produksi biogas tertinggi pada hari ke 9 dengan rata-rata produksi sebesar 915 mL. Substrat yang diberikan thermal pre-treatment 15 menit juga memproduksi biogas jauh lebih tinggi (772,5 mL pada hari ke 9 jika dibandingkan dengan substrat tanpa diberikan pre-treatment yang hanya memproduksi biogas sebesar 405 mL. Data hasil penelitian menunjukkan bahwa limbah tanaman jagung yang diberikan thermal pre-treatment memperoleh biogas yield lebih tinggi dari pada yang tidak diberikan pre-treatment dimana 670,39 mL/g volatile solids untuk thermal pre- treatment 15 menit, 690,65 mL/g volatile solids untuk thermal pre-treatment 25 menit dan 456,37 mL/g volatile solids untuk limbah tanaman jagung yang tidak

  6. Improvement of thermal shock resistance of isotropic graphite by Ti-doping

    International Nuclear Information System (INIS)

    Lopez-Galilea, I.; Ordas, N.; Garcia-Rosales, C.; Lindig, S.

    2009-01-01

    Ti-doped isotropic graphite is a promising candidate material for the strike point area of the ITER divertor due to its reduced chemical erosion by hydrogen bombardment and its high thermal shock resistance, mainly due the catalytic effect of TiC on the graphitization leading to an increase of thermal conductivity and to higher mechanical strength. Several manufacturing parameters such as oxidative stabilization treatment, carbonization cycle, graphitization temperature and dwell time during graphitization have been investigated in order to establish a relationship between these parameters and the final properties.

  7. Improvement of thermal shock resistance of isotropic graphite by Ti-doping

    Energy Technology Data Exchange (ETDEWEB)

    Lopez-Galilea, I. [Inmaculada Lopez-Galilea, CEIT and Tecnun (University of Navarra), Po de Manuel Lardizabal, 15 E-20018 San Sebastian (Spain)], E-mail: ilopez@ceit.es; Ordas, N.; Garcia-Rosales, C. [Inmaculada Lopez-Galilea, CEIT and Tecnun (University of Navarra), Po de Manuel Lardizabal, 15 E-20018 San Sebastian (Spain); Lindig, S. [Max-Planck-Institut fuer Plasmaphysik, EURATOM Association, D-85748 Garching (Germany)

    2009-04-30

    Ti-doped isotropic graphite is a promising candidate material for the strike point area of the ITER divertor due to its reduced chemical erosion by hydrogen bombardment and its high thermal shock resistance, mainly due the catalytic effect of TiC on the graphitization leading to an increase of thermal conductivity and to higher mechanical strength. Several manufacturing parameters such as oxidative stabilization treatment, carbonization cycle, graphitization temperature and dwell time during graphitization have been investigated in order to establish a relationship between these parameters and the final properties.

  8. Phonon scattering in graphene over substrate steps

    DEFF Research Database (Denmark)

    Sevincli, Haldun; Brandbyge, Mads

    2014-01-01

    We calculate the effect on phonon transport of substrate-induced bends in graphene. We consider bending induced by an abrupt kink in the substrate, and provide results for different step-heights and substrate interaction strengths. We find that individual substrate steps reduce thermal conductance...

  9. Mechanical quality factor of mirror substrates for VIRGO

    CERN Document Server

    Amico, P; Carbone, L; Gammaitoni, L; Punturo, M; Travasso, F; Vocca, H

    2002-01-01

    Thermal noise in the mirror substrates is expected to be the main limit to the VIRGO sensitivity in the 50-500 Hz frequency range. The mechanical quality of the mirror substrates and the geometry of their suspension are expected to affect the noise level of the detector output. High mechanical Q have been obtained for different large fused silica substrates under VIRGO suspension conditions. Moreover, calcium fluoride substrates are shown to provide a more promising option for the design of future cryogenic, low thermal noise interferometers.

  10. Preliminary investigation of biological resistance, water absorption and swelling of thermally compressed pine wood panels

    Science.gov (United States)

    Oner Unsal; S. Nami Kartal; Zeki Candan; Rachel Arango; Carol A. Clausen; Frederick Green

    2008-01-01

    Wood can be modified by compressive, thermal and chemical treatments. Compression of wood under thermal conditions is resulted in densification of wood. This study evaluated decay and termite resistance of thermally compressed pine wood panels at either 5 or 7 MPa and at either 120 or 150°C for one hour. The process caused increases in density and decreases in...

  11. Chemical resistivity of self-assembled monolayer covalently attached to silicon substrate to hydrofluoric acid and ammonium fluoride

    Science.gov (United States)

    Saito, N.; Youda, S.; Hayashi, K.; Sugimura, H.; Takai, O.

    2003-06-01

    Self-assembled monolayers (SAMs) were prepared on hydrogen-terminated silicon substrates through chemical vapor deposition using 1-hexadecene (HD) as a precursor. The HD-SAMs prepared in an atmosphere under a reduced pressure (≈50 Pa) showed better chemical resistivities to hydrofluoric acid and ammonium fluoride (NH 4F) solutions than that of an organosilane SAM formed on oxide-covered silicon substrates. The surface covered with the HD-SAM was micro-patterned by vacuum ultraviolet photolithography and consequently divided into two areas terminated with HD-SAM or silicon dioxide. This micro-patterned sample was immersed in a 40 vol.% NH 4F aqueous solution. Surface images obtained by an optical microscopy clearly show that the micro-patterns of HD-SAM/silicon dioxide were successfully transferred into the silicon substrate.

  12. Effects of Thermal Resistance on One-Dimensional Thermal Analysis of the Epidermal Flexible Electronic Devices Integrated with Human Skin

    Science.gov (United States)

    Li, He; Cui, Yun

    2017-12-01

    Nowadays, flexible electronic devices are increasingly used in direct contact with human skin to monitor the real-time health of human body. Based on the Fourier heat conduction equation and Pennes bio-heat transfer equation, this paper deduces the analytical solutions of one - dimensional heat transfer for flexible electronic devices integrated with human skin under the condition of a constant power. The influence of contact thermal resistance between devices and skin is considered as well. The corresponding finite element model is established to verify the correctness of analytical solutions. The results show that the finite element analysis agrees well with the analytical solution. With bigger thermal resistance, temperature increase of skin surface will decrease. This result can provide guidance for the design of flexible electronic devices to reduce the negative impact that exceeding temperature leave on human skin.

  13. Thermal behaviour properties and corrosion resistance of organoclay/polyurethane film

    Science.gov (United States)

    Kurniawan, O.; Soegijono, B.

    2018-03-01

    Organoclay/polyurethane film composite was prepared by adding organoclay with different content (1, 3, and 5 wt.%) in polyurethane as a matrix. TGA and DSC showed decomposition temperature shifted to a lower point as organoclay content change. FT-IR spectra showed chemical bonding of organoclay and polyurethane as a matrix, which means that the bonding between filler and matrix occured and the composite was stronger but less bonding occur in composite with 5 wt.% organoclay. The corrosion resistance overall increased with the increasing organoclay content. Composite with 5 wt.% organoclay had more thermal stability and corrosion resistance may probably due to exfoliation of organoclay.

  14. Dynamics of ultrathin metal films on amorphous substrates under fast thermal processing

    Science.gov (United States)

    Favazza, Christopher; Kalyanaraman, Ramki; Sureshkumar, Radhakrishna

    2007-11-01

    A mathematical model is developed to analyze the growth/decay rate of surface perturbations of an ultrathin metal film on an amorphous substrate (SiO2). The formulation combines the approach of Mullins [W. W. Mullins, J. Appl. Phys. 30, 77 (1959)] for bulk surfaces, in which curvature-driven mass transport and surface deformation can occur by surface/volume diffusion and evaporation-condensation processes, with that of Spencer etal . [B. J. Spencer, P. W. Voorhees, and S. H. Davis, Phys. Rev. Lett. 67, 26 (1991)] to describe solid-state transport in thin films under epitaxial strain. Modifications of the Mullins model to account for thin-film boundary conditions result in qualitatively different dispersion relationships especially in the limit as kho≪1, where k is the wavenumber of the perturbation and ho is the unperturbed film height. The model is applied to study the relative rate of solid-state mass transport as compared to that of liquid phase dewetting in a thin film subjected to a fast thermal pulse. Specifically, we have recently shown that multiple cycles of nanosecond (ns) pulsed laser melting and resolidification of ultrathin metal films on amorphous substrates can lead to the formation of various types of spatially ordered nanostructures [J. Trice, D. Thomas, C. Favazza, R. Sureshkumar, and R. Kalyanaraman, Phys. Rev. B 75, 235439 (2007)]. The pattern formation has been attributed to the dewetting of the thin film by a hydrodynamic instability. In such experiments the film is in the solid state during a substantial fraction of each thermal cycle. However, results of a linear stability analysis based on the aforementioned model suggest that solid-state mass transport has a negligible effect on morphological changes of the surface. Further, a qualitative analysis of the effect of thermoelastic stress, induced by the rapid temperature changes in the film-substrate bilayer, suggests that stress relaxation does not appreciably contribute to surface

  15. Corrosion characteristics of several thermal spray cermet-coating/alloy systems

    International Nuclear Information System (INIS)

    Ashary, A.A.; Tucker, R.C. Jr.

    1991-01-01

    The corrosion characteristics of a thermal spray multiphase cermet coating can be quite complex. Factors such as porosity and galvanic effects between different phases in the coating and the substrate, as well as the inherent general and localized corrosion resistance of each phase, can play an important role. The present paper describes the corrosion of several cermet-coating/alloy systems as studied by a potentiodynamic cyclic polarization technique. The corrosion of these coating systems was found to be most often dominated by corrosion of the metallic phases in the coating or of the substrate alloy. (orig.)

  16. The thermal fatigue behaviour of creep-resistant Ni-Cr cast steel

    Directory of Open Access Journals (Sweden)

    B. Piekarski

    2007-12-01

    Full Text Available The study gives a summary of the results of industrial and laboratory investigations regarding an assessment of the thermal fatigue behaviour of creep-resistant austenitic cast steel. The first part of the study was devoted to the problem of textural stresses forming in castings during service, indicating them as a cause of crack formation and propagation. Stresses are forming in carbides and in matrix surrounding these carbides due to considerable differences in the values of the coefficients of thermal expansion of these phases. The second part of the study shows the results of investigations carried out to assess the effect of carbon, chromium and nickel on crack resistance of austenitic cast steel. As a criterion of assessment the amount and propagation rate of cracks forming in the specimens as a result of rapid heating followed by cooling in running water was adopted. Tests were carried out on specimens made from 11 alloys. The chemical composition of these alloys was comprised in a range of the following values: (wt-%: 18-40 %Ni, 17-30 %Cr, 1.2-1.6%Si and 0.05-0.6 %C. The specimens were subjected to 75 cycles of heating to a temperature of 900oC followed by cooling in running water. After every 15 cycles the number of the cracks was counted and their length was measured. The results of the measurements were mathematically processed. It has been proved that the main factor responsible for an increase in the number of cracks is carbon content in the alloy. In general assessment of the results of investigations, the predominant role of carbon and of chromium in the next place in shaping the crack behaviour of creep-resistant austenitic cast steel should be stressed. Attention was also drawn to the effect of high-temperature corrosion as a factor definitely deteriorating the cast steel resistance to thermal fatigue.

  17. High-Performance Molybdenum Coating by Wire–HVOF Thermal Spray Process

    Science.gov (United States)

    Tailor, Satish; Modi, Ankur; Modi, S. C.

    2018-04-01

    Coating deposition on many industrial components with good microstructural, mechanical properties, and better wear resistance is always a challenge for the thermal spray community. A number of thermal spray methods are used to develop such promising coatings for many industrial applications, viz. arc spray, flame spray, plasma, and HVOF. All these processes have their own limitations to achieve porous free, very dense, high-performance wear-resistant coatings. In this work, an attempt has been made to overcome this limitation. Molybdenum coatings were deposited on low-carbon steel substrates using wire-high-velocity oxy-fuel (W-HVOF; WH) thermal spray system (trade name HIJET 9610®). For a comparison, Mo coatings were also fabricated by arc spray, flame spray, plasma spray, and powder-HVOF processes. As-sprayed coatings were analyzed using x-ray diffraction, scanning electron microscopy for phase, and microstructural analysis, respectively. Coating microhardness, surface roughness, and porosity were also measured. Adhesion strength and wear tests were conducted to determine the mechanical and wear properties of the as-sprayed coatings. Results show that the coatings deposited by W-HVOF have better performance in terms of microstructural, mechanical, and wear resistance properties, in comparison with available thermal spray process (flame spray and plasma spray).

  18. Effect of substrate temperature on the optical parameters of thermally evaporated Ge-Se-Te thin films

    Energy Technology Data Exchange (ETDEWEB)

    Sharma, Pankaj, E-mail: pks_phy@yahoo.co.i [Department of Physics, Jaypee University of Information Technology, Waknaghat, Solan, H.P. 173215 India (India); Katyal, S.C. [Department of Physics, Jaypee University of Information Technology, Waknaghat, Solan, H.P. 173215 India (India)

    2009-05-01

    Thin films of Ge{sub 10}Se{sub 90-x}Te{sub x} (x = 0, 10, 20, 30, 40, 50) glassy alloys were deposited at three substrate temperatures (303 K, 363 K and 423 K) using conventional thermal evaporation technique at base pressure of {approx} 10{sup -4} Pa. X-ray diffraction results show that films deposited at 303 K are of amorphous nature while films deposited at 363 K and 423 K are of polycrystalline nature. The optical parameters, refractive index and optical gap have been derived from the transmission spectra (using UV-Vis-NIR spectrophotometer) of the thin films in the spectral region 400-1500 nm. This has been observed that refractive index values remain almost constant while the optical gap is found to decrease considerably with the increase of substrate temperature. The decrease in optical gap is explained on the basis of change in nature of films, from amorphous to polycrystalline state, with the increase of substrate temperature. The optical gap has also been observed to decrease with the increase of Te content.

  19. In-plane thermal conductivity measurements of ZnO-, ZnS-, and YSZ thin-films on glass substrates

    Energy Technology Data Exchange (ETDEWEB)

    Hartung, David; Gather, Florian; Kronenberger, Achim; Kuhl, Florian; Meyer, Bruno K.; Klar, Peter J. [I. Physikalisches Institut, Justus-Liebig-University, Heinrich-Buff-Ring 16, 35392 Giessen (Germany)

    2012-07-01

    In this work we present in-plane thermal conductivity measurements of ZnO-, ZnS-, and YSZ thin-films. Borosilicate glass with a thickness of 50 microns and low thermal conductivity for improving the signal to noise ratio was used as substrate material. The above different films are deposited by rf-sputtering and have a thickness of about 1 micron. Our approach is a steady-state measurement. A wide metal wire on the film is used as a heater and two parallel lying narrow wires at distances of 100 microns and 200 microns from the heater wire, respectively, serve as the temperature sensors. The wire structure design is transfered on to the thin films by photolithography and metal evaporation. Measurements of the in-plane thermal conductivities of the above mentioned materials are presented and compared with corresponding results in the literature.

  20. Experimental study on surface wrinkling of silicon monoxide film on compliant substrate under thermally induced loads

    Science.gov (United States)

    Li, Chuanwei; Kong, Yingxiao; Jiang, Wenchong; Wang, Zhiyong; Li, Linan; Wang, Shibin

    2017-06-01

    The wrinkling of a silicon monoxide thin film on a compliant poly(dimethylsiloxane) (PDMS) substrate structure was experimentally investigated in this study. The self-expansion effect of PDMS during film deposition was utilized to impose a pretensile strain on the structure through a specially made fixture. A laser scanning confocal microscope (LSCM) system with an in situ heating stage was employed for the real-time measurement. The Young’s modulus of the silicon monoxide thin film as well as the PDMS substrate was measured on the basis of the elasticity theory. Moreover, the effects of temperature variations on geometric parameters in the postbuckling state, such as wavelength and amplitude, were analyzed. It was proved that wavelength is relatively immune to thermal loads, while amplitude is much more sensitive.

  1. Measurement of thermal conductance of La0.7Sr0.3MnO3 thin films deposited on SrTiO3 and MgO substrates

    Science.gov (United States)

    Aryan, A.; Guillet, B.; Routoure, J. M.; Fur, C.; Langlois, P.; Méchin, L.

    2015-01-01

    We present measurements of the thermal conductance of thin-film-on-substrate structures that could serve as thin film uncooled bolometers. Studied samples were 75 nm thick epitaxial La0.7Sr0.3MnO3 thin films deposited on SrTiO3 (0 0 1) and MgO (0 0 1) substrates patterned in square geometries of areas ranging from 50 μm × 50 μm to 200 μm × 200 μm. The model allows estimating thermal boundary conductance values at the interface between film and substrate of 0.28 ± 0.08 × 106 W K-1 m-2 for LSMO/STO (0 0 1) and 5.8 ± 3.0 × 106 W K-1 m-2 for LSMO/MgO (0 0 1) from measurements performed in the static regime. Analytical expressions of thermal conductance and thermal capacitance versus modulation frequency are compared to measurements of the elevation temperature due to absorbed incoming optical power. The overall good agreement found between measurements and model finally provides the possibility to calculate the bolometric response of thin film bolometers, thus predicting their frequency response for various geometries.

  2. The thermal fatigue resistance of vermicular cast iron coupling with H13 steel units by cast-in process

    International Nuclear Information System (INIS)

    Wang, Chengtao; Zhou, Hong; Lin, Peng Yu; Sun, Na; Guo, Qingchun; Zhang, Peng; Yu, Jiaxiang; Liu, Yan; Wang, Mingxing; Ren, Luquan

    2010-01-01

    This paper focuses on improving the thermal fatigue resistance on the surface of vermicular cast iron coupling with inserted H13 steel blocks that had different cross sections, by cast-in processing. The microstructure of bionic units was examined by scanning electron microscope. Micro-hardness and thermal fatigue resistance of bionic samples with varied cross sections and spacings were investigated, respectively. Results show that a marked metallurgical bonding zone was produced at interface between the inserted H13 steel block and the parent material - a unique feature of the bionic structure in the vermicular cast iron samples. The micro-hardness of the bionic samples has been significantly improved. Thermal resistance of the samples with the circular cross section was the highest and the bionics sample with spacing of 2 mm spacing had a much longer thermal fatigue life, thus resulting in the improvement for the thermal fatigue life of the bionic samples, due to the efficient preclusion for the generation and propagation of crack at the interface of H13 block and the matrix.

  3. Evaluation of the Internal and Borehole Resistances during Thermal Response Tests and Impact on Ground Heat Exchanger Design

    Directory of Open Access Journals (Sweden)

    Louis Lamarche

    2017-12-01

    Full Text Available The main parameters evaluated with a conventional thermal response test (TRT are the subsurface thermal conductivity surrounding the borehole and the effective borehole thermal resistance, when averaging the inlet and outlet temperature of a ground heat exchanger with the arithmetic mean. This effective resistance depends on two resistances: the 2D borehole resistance (Rb and the 2D internal resistance (Ra which is associated to the short-circuit effect between pipes in the borehole. This paper presents a field method to evaluate these two components separately. Two approaches are proposed. In the first case, the temperature at the bottom of the borehole is measured at the same time as the inlet and outlet temperatures as done in a conventional TRT. In the second case, different flow rates are used during the experiment to infer the internal resistance. Both approaches assumed a predefined temperature profile inside the borehole. The methods were applied to real experimental tests and compared with numerical simulations. Interesting results were found by comparison with theoretical resistances calculated with the multipole method. The motivation for this work is evidenced by analyzing the impact of the internal resistance on a typical geothermal system design. It is shown to be important to know both resistance components to predict the variation of the effective resistance when the flow rate and the height of the boreholes are changed during the design process.

  4. Calculation of inter-plane thermal resistance of few-layer graphene from equilibrium molecular dynamics simulations

    International Nuclear Information System (INIS)

    Ni, Y; Chalopin, Y; Volz, S

    2012-01-01

    Inter-plane thermal resistance in 5-layer graphene is calculated from equilibrium molecular dynamics (EMD) by calculating the autocorrelation function of temperature difference. Our simulated inter-plane resistance for 5-layer graphene is 4.83 × 10 −9 m 2 K/W. This data is in the same order of magnitude with the reported values from NEMD simulations and Debye model calculations, and the possible reasons for the slight differences are discussed in details. The inter-plane resistance is not dependent on temperature, according to the results of the EMD simulation. Phonon density of states (DOSs) were plotted to better understand the mechanism behind the obtained values. These results provide a better insight in the heat transfer across a few layer graphene and yield useful information on the design of graphene based thermal materials.

  5. Influence of crystal field excitations on thermal and electrical resistivity of normal rare-earth metals

    Energy Technology Data Exchange (ETDEWEB)

    Durczewski, K.; Gajek, Z.; Mucha, J. [Institute of Low Temperature and Structure Research, Polish Academy of Sciences, Wroclaw (Poland)

    2014-11-15

    A simple formula describing the influence of the crystalline electric field free-ion excitations on the temperature dependence of the contribution of the s-f scattering to the thermal resistivity of normal rare-earth metals is presented. The corresponding formula for the electrical resistivity is also given and compared to the one being currently used. Theoretical electron-phonon scattering contributions derived in earlier papers and constant impurity scattering contributions are added to the derived s-f contribution formulae in order to fit the total electrical and thermal resistivity represented as functions of the temperature to experimental dependences on the temperature for DyIn{sub 3} and in this way to manifest applicability of the derived formulae to real materials. (copyright 2014 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  6. Influence of crystal field excitations on thermal and electrical resistivity of normal rare-earth metals

    International Nuclear Information System (INIS)

    Durczewski, K.; Gajek, Z.; Mucha, J.

    2014-01-01

    A simple formula describing the influence of the crystalline electric field free-ion excitations on the temperature dependence of the contribution of the s-f scattering to the thermal resistivity of normal rare-earth metals is presented. The corresponding formula for the electrical resistivity is also given and compared to the one being currently used. Theoretical electron-phonon scattering contributions derived in earlier papers and constant impurity scattering contributions are added to the derived s-f contribution formulae in order to fit the total electrical and thermal resistivity represented as functions of the temperature to experimental dependences on the temperature for DyIn 3 and in this way to manifest applicability of the derived formulae to real materials. (copyright 2014 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  7. Improvement in thermal fatigue resistance of cast iron piston; Chutetsu piston no tainetsu hiro sekkei

    Energy Technology Data Exchange (ETDEWEB)

    Amano, K; Uosaki, Y; Takeshige, N [Mazda Motor Corp., Hiroshima (Japan)

    1997-10-01

    Cast iron piston is superior in reduction of diesel engine emission to aluminum piston because of its characteristic of heat insulation. In order to study thermal fatigue characteristics of cast iron, thermal fatigue tests were carried out on two kinds of ferrite ductile cast iron. Differences between cast iron piston and aluminum piston in thermal fatigue resistance have been investigated by using FEM analysis. 5 refs., 14 figs., 1 tab.

  8. Resistance switching induced by electric fields in manganite thin films

    International Nuclear Information System (INIS)

    Villafuerte, M; Juarez, G; Duhalde, S; Golmar, F; Degreef, C L; Heluani, S P

    2007-01-01

    In this work, we investigate the polarity-dependent Electric Pulses Induced Resistive (EPIR) switching phenomenon in thin films driven by electric pulses. Thin films of 0.5 Ca 0.5 MnO 3 (manganite) were deposited by PLD on Si substrate. The transport properties at the interface between the film and metallic electrode are characterized in order to study the resistance switching. Sample thermal treatment and electrical field history are important to be considered for get reproducible EPIR effect. Carriers trapping at the interfaces are considered as a possible explanation of our results

  9. Nanowire surface fastener fabrication on flexible substrate

    Science.gov (United States)

    Toku, Yuhki; Uchida, Keita; Morita, Yasuyuki; Ju, Yang

    2018-07-01

    The market for wearable devices has increased considerably in recent years. In response to this demand, flexible electronic circuit technology has become more important. The conventional bonding technology in electronic assembly depends on high-temperature processes such as reflow soldering, which result in undesired thermal damages and residual stress at a bonding interface. In addition, it exhibits poor compatibility with bendable or stretchable device applications. Therefore, there is an urgent requirement to attach electronic parts on printed circuit boards with good mechanical and electrical properties at room temperature. Nanowire surface fasteners (NSFs) are candidates for resolving these problems. This paper describes the fabrication of an NSF on a flexible substrate, which can be used for room temperature conductive bonding. The template method is used for preparing high-density nanowire arrays. A Cu thin film is layered on the template as the flexible substrate. After etching the template, a Cu NSF is obtained on the Cu film substrate. In addition, the electrical and mechanical properties of the Cu NSF are studied under various fabrication conditions. The Cu NSF exhibits high shear adhesion strength (∼234 N cm‑2) and low contact resistivity (2.2 × 10‑4 Ω cm2).

  10. Wear Resistant Thermal Sprayed Composite Coatings Based on Iron Self-Fluxing Alloy and Recycled Cermet Powders

    Directory of Open Access Journals (Sweden)

    Heikki SARJAS

    2012-03-01

    Full Text Available Thermal spray and WC-Co based coatings are widely used in areas subjected to abrasive wear. Commercial  cermet thermal spray powders for HVOF are relatively expensive. Therefore applying these powders in cost-sensitive areas like mining and agriculture are hindered. Nowadays, the use of cheap iron based self-fluxing alloy powders for thermal spray is limited. The aim of this research was to study properties of composite powders based on self-fluxing alloys and recycled cermets and to examine the properties of thermally sprayed (HVOF coatings from composite powders based on iron self-fluxing alloy and recycled cermet powders (Cr3C2-Ni and WC-Co. To estimate the properties of  recycled cermet powders, the sieving analysis, laser granulometry and morphology were conducted. For deposition of coatings High Velocity Oxy-Fuel spray was used. The structure and composition of powders and coatings were estimated by SEM and XRD methods. Abrasive wear performance of coatings was determined and compared with wear resistance of coatings from commercial powders. The wear resistance of thermal sprayed coatings from self-fluxing alloy and recycled cermet powders at abrasion is comparable with wear resistance of coatings from commercial expensive spray powders and may be an alternative in tribological applications in cost-sensitive areas.DOI: http://dx.doi.org/10.5755/j01.ms.18.1.1338

  11. Validation of the method for determination of the thermal resistance of fouling in shell and tube heat exchangers

    International Nuclear Information System (INIS)

    Markowski, Mariusz; Trafczynski, Marian; Urbaniec, Krzysztof

    2013-01-01

    Highlights: • Heat recovery in a heat exchanger network (HEN). • A novel method for on-line determination of the thermal resistance of fouling is presented. • Details are developed for shell and tube heat exchangers. • The method was validated and sensibility analysis was carried out. • Developed approach allows long-term monitoring of changes in the HEN efficiency. - Abstract: A novel method for on-line determination of the thermal resistance of fouling in shell and tube heat exchangers is presented. It can be applied under the condition that the data on pressure, temperature, mass flowrate and thermophysical properties of both heat-exchanging media are continuously available. The calculation algorithm for use in the novel method is robust and ensures reliable determination of the thermal resistance of fouling even if the operating parameters fluctuate. The method was validated using measurement data retrieved from the operation records of a heat exchanger network connected with a crude distillation unit rated 800 t/h. Sensibility analysis of the method was carried out and the calculated values of the thermal resistance of fouling were critically reviewed considering the results of qualitative evaluation of fouling layers in the exchangers inspected during plant overhaul

  12. Fracture resistance of metal-free composite crowns-effects of fiber reinforcement, thermal cycling, and cementation technique.

    Science.gov (United States)

    Lehmann, Franziska; Eickemeyer, Grit; Rammelsberg, Peter

    2004-09-01

    The improved mechanical properties of contemporary composites have resulted in their extensive use for the restoration of posterior teeth. However, the influence of fiber reinforcement, cementation technique, and physical stress on the fracture resistance of metal-free crowns is unknown. This in vitro study evaluated the effect of fiber reinforcement, physical stress, and cementation methods on the fracture resistance of posterior metal-free Sinfony crowns. Ninety-six extracted human third molars received a standardized tooth preparation: 0.5-mm chamfer preparation and occlusal reduction of 1.3 to 1.5 mm. Sinfony (nonreinforced crowns, n=48) and Sinfony-Vectris (reinforced crowns, n=48) crowns restoring original tooth contour were prepared. Twenty-four specimens of each crown type were cemented, using either glass ionomer cement (GIC) or resin cement. Thirty-two crowns (one third) were stored in humidity for 48 hours. Another third was exposed to 10,000 thermal cycles (TC) between 5 degrees C and 55 degrees C. The remaining third was treated with thermal cycling and mechanical loading (TCML), consisting of 1.2 million axial loads of 50 N. The artificial crowns were then vertically loaded with a steel sphere until failure occurred. Significant differences in fracture resistance (N) between experimental groups were assessed by nonparametric Mann-Whitney U-test (alpha=.05). Fifty percent of the Sinfony and Sinfony-Vectris crowns cemented with glass ionomer cement loosened after thermal cycling. Thermal cycling resulted in a significant reduction in the mean fracture resistance for Sinfony crowns cemented with GIC, from 2037 N to 1282 N (P=.004). Additional fatigue produced no further effects. Fiber reinforcement significantly increased fracture resistance, from 1555 N to 2326 N (P=.001). The minimal fracture resistance was above 600 N for all combinations of material, cement and loading. Fracture resistance of metal-free Sinfony crowns was significantly increased by

  13. Increased interaction with insulin receptor substrate 1, a novel abnormality in insulin resistance and type 2 diabetes

    DEFF Research Database (Denmark)

    Caruso, Michael; Ma, Danjun; Msallaty, Zaher

    2014-01-01

    Insulin receptor substrate 1 (IRS1) is a key mediator of insulin signal transduction. Perturbations involving IRS1 complexes may lead to the development of insulin resistance and type 2 diabetes (T2D). Surprisingly little is known about the proteins that interact with IRS1 in humans under health...... in obesity and T2D in humans, provides new insights into the molecular mechanism of insulin resistance and identifies new targets for T2D drug development....... and disease conditions. We used a proteomic approach to assess IRS1 interaction partners in skeletal muscle from lean healthy control subjects (LCs), obese insulin-resistant nondiabetic control subjects (OCs), and participants with T2D before and after insulin infusion. We identified 113 novel endogenous IRS1...

  14. Laser cladding of copper with molybdenum for wear resistance enhancement in electrical contacts

    International Nuclear Information System (INIS)

    Ng, K.W.; Man, H.C.; Cheng, F.T.; Yue, T.M.

    2007-01-01

    Laser cladding of Mo on Cu has been attempted with the aim of enhancing the wear resistance and hence increasing the service life of electrical contacts made of Cu. In order to overcome the difficulties arising from the large difference in thermal properties and the low mutual solubility between Cu and Mo, Ni was introduced as an intermediate layer between Mo and Cu. The Ni and Mo layers were laser clad one after the other to form a sandwich layer of Mo/Ni/Cu. Excellent bonding between the clad layer and the Cu substrate was ensured by strong metallurgical bonding. The hardness of the surface of the clad layer is seven times higher than that of the Cu substrate. Pin-on-disc wear tests consistently showed that the abrasive wear resistance of the clad layer was also improved by a factor of seven as compared with untreated Cu substrate. The specific electrical contact resistance of the clad surface was about 5.6 x 10 -7 Ω cm 2

  15. Wear Resistant Amorphous and Nanocomposite Coatings

    Energy Technology Data Exchange (ETDEWEB)

    Racek, O

    2008-03-26

    Glass forming materials (critical cooling rate <10{sup 4}K.s{sup -1}) are promising for their high corrosion and wear resistance. During rapid cooling, the materials form an amorphous structure that transforms to nanocrystalline during a process of devitrification. High hardness (HV 1690) can be achieved through a controlled crystallization. Thermal spray process has been used to apply coatings, which preserves the amorphous/nanocomposite structure due to a high cooling rate of the feedstock particles during the impact on a substrate. Wear properties have been studied with respect to process conditions and feedstock material properties. Application specific properties such as sliding wear resistance have been correlated with laboratory tests based on instrumented indentation and scratch tests.

  16. High-temperature stability of chemically vapor-deposited tungsten-silicon couples rapid thermal annealed in ammonia and argon

    Energy Technology Data Exchange (ETDEWEB)

    Broadbent, E.K.; Morgan, A.E.; Flanner, J.M.; Coulman, B.; Sadana, D.K.; Burrow, B.J.; Ellwanger, R.C.

    1988-12-15

    A rapid thermal anneal (RTA) in an NH/sub 3/ ambient has been found to increase the thermal stability of W films chemically vapor deposited (CVD) on Si. W films deposited onto single-crystal Si by low-pressure CVD were rapid thermal annealed at temperatures between 500 and 1100 /sup 0/C in NH/sub 3/ and Ar ambients. The reactions were studied using Rutherford backscattering spectrometry, x-ray diffraction, Auger electron spectroscopy, transmission electron microscopy, and four-point resistivity probe. High-temperature (greater than or equal to1000 /sup 0/C) RTA in Ar completely converted W into the low resistivity (31 ..mu cap omega.. cm) tetragonal WSi/sub 2/ phase. In contrast, after a prior 900 /sup 0/C RTA in NH/sub 3/, N inclusion within the W film and at the W/Si interface almost completely suppressed the W-Si reaction. Detailed examination, however, revealed some patches of WSi/sub 2/ formed at the interface accompanied by long tunnels extending into the substrate, and some crystalline precipitates in the substrate close to the interface. The associated interfacial contact resistance was only slightly altered by the 900 /sup 0/C NH/sub 3/ anneal. The NH/sub 3/-treated W film acted as a diffusion barrier in an Al/W/Si contact metallurgy up to at least 550 /sup 0/C, at which point some increase in contact resistance was measured.

  17. Thermally-treated Pt-coated silicon AFM tips for wear resistance in ferroelectric data storage

    International Nuclear Information System (INIS)

    Bhushan, Bharat; Palacio, Manuel; Kwak, Kwang Joo

    2008-01-01

    In ferroelectric data storage, a conductive atomic force microscopy (AFM) probe with a noble metal coating is placed in contact with a lead zirconate titanate (PZT) film. The understanding and improvement of probe tip wear, particularly at high velocities, is needed for high data rate recording. A commercial Pt-coated silicon AFM probe was thermally treated in order to form platinum silicide at the near-surface. Nanoindentation, nanoscratch and wear experiments were performed to evaluate the mechanical properties and wear performance at high velocities. The thermally treated tip exhibited lower wear than the untreated tip. The tip wear mechanism is adhesive and abrasive wear with some evidence of impact wear. The enhancement in mechanical properties and wear resistance in the thermally treated film is attributed to silicide formation in the near-surface. Auger electron spectroscopy and electrical resistivity measurements confirm the formation of platinum silicide. This study advances the understanding of thin film nanoscale surface interactions

  18. Study of Ag/RGO/ITO sandwich structure for resistive switching behavior deposited on plastic substrate

    Science.gov (United States)

    Vartak, Rajdeep; Rag, Adarsh; De, Shounak; Bhat, Somashekhara

    2018-05-01

    We report here the use of facile and environmentally benign way synthesized reduced graphene oxide (RGO) for low-voltage non-volatile memory device as charge storing element. The RGO solutions have been synthesized using electrochemical exfoliation of battery electrode. The solution processed based RGO solution is suitable for large area and low-cost processing on plastic substrate. Room-temperature current-voltage characterisation has been carried out in Ag/RGO/ITO PET sandwich configuration to study the type of trap distribution. It is observed that in the low-voltage sweep, ohmic current is the main mechanism of current flow and trap filled/assisted conduction is observed at high-sweep voltage region. The Ag/RGO/ITO PET sandwich structure showed bipolar resistive switching behavior. These mechanisms can be analyzed based on oxygen availability and vacancies in the RGO giving rise to continuous least resistive path (conductive) and high resistance path along the structure. An Ag/RGO/ITO arrangement demonstrates long retention time with low operating voltage, low set/reset voltage, good ON/OFF ratio of 103 (switching transition between lower resistance state and higher resistance state and decent switching performance. The RGO memory showed decent results with an almost negligible degradation in switching properties which can be used for low-voltage and low-cost advanced flexible electronics.

  19. Proposed cryogenic Q-factor measurement of mirror substrates

    Energy Technology Data Exchange (ETDEWEB)

    Nietzsche, Sandor; Zimmer, Anja; Vodel, Wolfgang; Thuerk, Matthias; Schmidl, Frank; Seidel, Paul [Institut fuer Festkoerperphysik, Friedrich-Schiller-Universitaet Jena, Helmholtzweg 5, 07743 Jena (Germany)

    2004-03-07

    The thermal noise of optical components (e.g., end mirrors, beam splitters) is one of the limiting factors of the sensitivity of most of the present interferometric gravitational wave detectors, and it will be limiting in the advanced detectors now being designed. This thermal noise occurs mainly in the optical substrates and their mirror coatings. One possible method for minimizing thermal noise is cooling to cryogenic temperatures, maximizing the mechanical Q and maximizing the eigenfrequencies of the substrate. A new cryogenic apparatus for investigations of the temperature dependency of the Q-factor of several substrate materials down to 4.2 K is proposed. Possible methods of mode excitation and ring down measurement are discussed.

  20. Crystallization and electrical resistivity of Cu{sub 2}O and CuO obtained by thermal oxidation of Cu thin films on SiO{sub 2}/Si substrates

    Energy Technology Data Exchange (ETDEWEB)

    De Los Santos Valladares, L., E-mail: ld301@cam.ac.uk [Cavendish Laboratory, University of Cambridge, J.J Thomson Av., Cambridge CB3 0HE (United Kingdom); Materials and Structures Laboratory, Tokyo Institute of Technology, 4259 Nagatsuta-cho, Midori-ku, Yokohama 226-8503 (Japan); Departamento de Fisica, Universidade Federal de Pernambuco, 50670-901, Recife-Pe (Brazil); Salinas, D. Hurtado [Materials and Structures Laboratory, Tokyo Institute of Technology, 4259 Nagatsuta-cho, Midori-ku, Yokohama 226-8503 (Japan); Laboratorio de Ceramicos y Nanomateriales, Facultad de Ciencias Fisicas, Universidad Nacional Mayor de San Marcos, Ap. Postal 14-0149, Lima (Peru); Dominguez, A. Bustamante [Laboratorio de Ceramicos y Nanomateriales, Facultad de Ciencias Fisicas, Universidad Nacional Mayor de San Marcos, Ap. Postal 14-0149, Lima (Peru); Najarro, D. Acosta [Instituto de Fisica, Departamento de Materia Condensada, Universidad Nacional Autonoma de Mexico, Ap. Postal 20-364, CP 01000 (Mexico); Khondaker, S.I. [NanoScience Technology Centre and Department of Physics, University of Central Florida, Orlando, FL 32826 (United States); Mitrelias, T.; Barnes, C.H.W. [Cavendish Laboratory, University of Cambridge, J.J Thomson Av., Cambridge CB3 0HE (United Kingdom); Aguiar, J. Albino [Departamento de Fisica, Universidade Federal de Pernambuco, 50670-901, Recife-Pe (Brazil); Majima, Y. [Materials and Structures Laboratory, Tokyo Institute of Technology, 4259 Nagatsuta-cho, Midori-ku, Yokohama 226-8503 (Japan); CREST, Japan Science and Technology Agency (JST), 4259 Nagatsuta-cho, Midori-ku, Yokohama 226-8503 (Japan)

    2012-08-01

    In this work, we study the crystallization and electrical resistivity of the formed oxides in a Cu/SiO{sub 2}/Si thin film after thermal oxidation by ex-situ annealing at different temperatures up to 1000 Degree-Sign C. Upon increasing the annealing temperature, from the X ray diffractogram the phase evolution Cu {yields} Cu + Cu{sub 2}O {yields} Cu{sub 2}O {yields} Cu{sub 2}O + CuO {yields} CuO was detected. Pure Cu{sub 2}O films are obtained at 200 Degree-Sign C, whereas uniform CuO films without structural surface defects such as terraces, kinks, porosity or cracks are obtained in the temperature range 300-550 Degree-Sign C. In both oxides, crystallization improves with annealing temperature. A resistivity phase diagram, which is obtained from the current-voltage response, is presented here. The resistivity was expected to increase linearly as a function of the annealing temperature due to evolution of oxides. However, anomalous decreases are observed at different temperatures ranges, this may be related to the improvement of the crystallization and crystallite size when the temperature increases. - Highlights: Black-Right-Pointing-Pointer The crystallization and electrical resistivity of oxides in a Cu films are studied. Black-Right-Pointing-Pointer In annealing Cu films, the phase evolution Cu + Cu{sub 2}O {yields} Cu{sub 2}O {yields} Cu{sub 2}O + CuO {yields} CuO occurs. Black-Right-Pointing-Pointer A resistivity phase diagram, obtained from the current-voltage response, is presented. Black-Right-Pointing-Pointer Some decreases in the resistivity may be related to the crystallization.

  1. Thermographic Inspection of Fatigue Crack by Using Contact Thermal Resistance

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Seung Yong; Kim, No Hyu [Korean University of Technology and Education, Cheonan (Korea, Republic of)

    2013-04-15

    Fatigue crack was detected from a temperature change around surface crack using the thermographic technique. Thermal gradient across the crack decreased very much due to thermal resistance of contact surface in the crack. Heat diffusion flow passing through the discontinuity was visualized in temperature by infrared camera to find and locate the crack. A fatigue crack specimen(SM-45C), which was prepared according to KS specification and notched in its center to initiate fatigue crack from the notch tip, was heated by halogen lamp at the end of one side to generate a heat diffusion flow in lateral direction. A abrupt jump in temperature across the fatigue crack was observed in thermographic image, by which the crack could be located and sized from temperature distribution.

  2. Thermographic Inspection of Fatigue Crack by Using Contact Thermal Resistance

    International Nuclear Information System (INIS)

    Yang, Seung Yong; Kim, No Hyu

    2013-01-01

    Fatigue crack was detected from a temperature change around surface crack using the thermographic technique. Thermal gradient across the crack decreased very much due to thermal resistance of contact surface in the crack. Heat diffusion flow passing through the discontinuity was visualized in temperature by infrared camera to find and locate the crack. A fatigue crack specimen(SM-45C), which was prepared according to KS specification and notched in its center to initiate fatigue crack from the notch tip, was heated by halogen lamp at the end of one side to generate a heat diffusion flow in lateral direction. A abrupt jump in temperature across the fatigue crack was observed in thermographic image, by which the crack could be located and sized from temperature distribution.

  3. Thermal conductivity of a graphite bipolar plate (BPP) and its thermal contact resistance with fuel cell gas diffusion layers: Effect of compression, PTFE, micro porous layer (MPL), BPP out-of-flatness and cyclic load

    Science.gov (United States)

    Sadeghifar, Hamidreza; Djilali, Ned; Bahrami, Majid

    2015-01-01

    This paper reports on measurements of thermal conductivity of a graphite bipolar plate (BPP) as a function of temperature and its thermal contact resistance (TCR) with treated and untreated gas diffusion layers (GDLs). The thermal conductivity of the BPP decreases with temperature and its thermal contact resistance with GDLs, which has been overlooked in the literature, is found to be dominant over a relatively wide range of compression. The effects of PTFE loading, micro porous layer (MPL), compression, and BPP out-of-flatness are also investigated experimentally. It is found that high PTFE loadings, MPL and even small BPP out-of-flatness increase the BPP-GDL thermal contact resistance dramatically. The paper also presents the effect of cyclic load on the total resistance of a GDL-BPP assembly, which sheds light on the behavior of these materials under operating conditions in polymer electrolyte membrane fuel cells.

  4. Impact of contact and access resistances in graphene field-effect transistors on quartz substrates for radio frequency applications

    International Nuclear Information System (INIS)

    Ramón, Michael E.; Movva, Hema C. P.; Fahad Chowdhury, Sk.; Parrish, Kristen N.; Rai, Amritesh; Akinwande, Deji; Banerjee, Sanjay K.; Magnuson, Carl W.; Ruoff, Rodney S.

    2014-01-01

    High-frequency performance of graphene field-effect transistors (GFETs) has been limited largely by parasitic resistances, including contact resistance (R C ) and access resistance (R A ). Measurement of short-channel (500 nm) GFETs with short (200 nm) spin-on-doped source/drain access regions reveals negligible change in transit frequency (f T ) after doping, as compared to ∼23% f T improvement for similarly sized undoped GFETs measured at low temperature, underscoring the impact of R C on high-frequency performance. DC measurements of undoped/doped short and long-channel GFETs highlight the increasing impact of R A for larger GFETs. Additionally, parasitic capacitances were minimized by device fabrication using graphene transferred onto low-capacitance quartz substrates

  5. Thermally-driven H interaction with HfO2 films deposited on Ge(100) and Si(100)

    Science.gov (United States)

    Soares, G. V.; Feijó, T. O.; Baumvol, I. J. R.; Aguzzoli, C.; Krug, C.; Radtke, C.

    2014-01-01

    In the present work, we investigated the thermally-driven H incorporation in HfO2 films deposited on Si and Ge substrates. Two regimes for deuterium (D) uptake were identified, attributed to D bonded near the HfO2/substrate interface region (at 300 °C) and through the whole HfO2 layer (400-600 °C). Films deposited on Si presented higher D amounts for all investigated temperatures, as well as, a higher resistance for D desorption. Moreover, HfO2 films underwent structural changes during annealings, influencing D incorporation. The semiconductor substrate plays a key role in this process.

  6. Distribution analysis of thermal effusivity for sub-micrometer YBCO thin films using thermal microscope

    International Nuclear Information System (INIS)

    Yagi, T.; Taketoshi, N.; Kato, H.

    2004-01-01

    Thermal effusivity measurements have been carried out for sub-micrometer YBCO superconducting films using thermal microscope based upon thermoreflectance technique. Two samples were prepared: c-axis aligned YBCO thin films with 800 nm in thickness synthesized on MgO and SrTiO 3 substrates. Measured thermal effusivities perpendicular to the surface, i.e. in parallel with c-axis were determined to be 1770 J/m 2 s 0.5 K on MgO substrate and 1420 J/m 2 s 0.5 K for that on SrTiO 3 substrate, respectively. The scatter of the measurements is estimated to be lower than ±5.2%. These values are consistent with reported values of YBCO single crystal in the direction of c-axis. In addition, 2D profiling image, that is, in-plane distribution of thermal effusivity was well obtained for the YBCO film on MgO substrate by operating this thermal microscope in a scanning mode. Its standard deviation of the in-plane thermal effusivity scattering due to the non-uniformity is evaluated to be ±5.7%

  7. Effect of thermal annealing on resistance switching characteristics of Pt/ZrO2/TiN stacks

    International Nuclear Information System (INIS)

    Kim, Jonggi; Lee, Kyumin; Kim, Yonjae; Na, Heedo; Ko, Dae-Hong; Sohn, Hyunchul; Lee, Sunghoon

    2013-01-01

    In this study, the effect of thermal annealing on both the physical properties and the resistive switching properties of ZrO 2 films deposited by atomic layer deposition (ALD) method were investigated for its potential application to non-volatile memory devices. The ZrO 2 films in the Pt/ZrO 2 /TiN structure exhibited unipolar and bipolar resistance switching behaviors depending on the nature of the bias applied to Pt top electrodes for the electro-forming process. For unipolar switching, the resistance of the high resistance state (HRS) was reduced with increasing annealing temperature, accompanied with the increase of metallic Zr in the annealed ZrO 2 films. In contrast, the HRS resistance in the bipolar switching was increased while the low resistance state (LRS) resistance was decreased with increasing annealing temperature, producing a greater change in resistance. SIMS and EDX showed that the thickness of interfacial TiO x N y layer between the ZrO 2 and the TiN bottom electrode was enlarged with annealing. The enlarged TiO x N y layer was expected to produce the reduction of LRS resistance with the increase of HRS resistance in the bipolar resistance switching. - Highlights: • Effect of thermal annealing on resistive switching of ZrO 2 was investigated. • Both unipolar and bipolar switching were shown in the Pt/ZrO 2 /TiN stack. • TiO x N y interface layer was enlarged with increasing annealing temperature. • TiO x N y interface plays an important role in resistive switching properties

  8. Time-resolved photoluminescence of Ga(NAsP) multiple quantum wells grown on Si substrate: Effects of rapid thermal annealing

    Energy Technology Data Exchange (ETDEWEB)

    Woscholski, R., E-mail: ronja.woscholski@physik.uni-marburg.de; Shakfa, M.K.; Gies, S.; Wiemer, M.; Rahimi-Iman, A.; Zimprich, M.; Reinhard, S.; Jandieri, K.; Baranovskii, S.D.; Heimbrodt, W.; Volz, K.; Stolz, W.; Koch, M.

    2016-08-31

    Time-resolved photoluminescence (TR-PL) spectroscopy has been used to study the impact of rapid thermal annealing (RTA) on the optical properties and carrier dynamics in Ga(NAsP) multiple quantum well heterostructures (MQWHs) grown on silicon substrates. TR-PL measurements reveal an enhancement in the PL efficiency when the RTA temperature is increased up to 925 °C. Then, the PL intensity dramatically decreases with the annealing temperature. This behavior is explained by the variation of the disorder degree in the studied structures. The analysis of the low-temperature emission-energy-dependent PL decay time enables us to characterize the disorder in the Ga(NAsP) MQWHs. The theoretically extracted energy-scales of disorder confirm the experimental observations. - Highlights: • Ga(NAsP) multiple quantum well heterostructures (MQWHs) grown on silicon substrates • Impact of rapid thermal annealing on the optical properties and carrier dynamics • Time resolved photoluminescence spectroscopy was applied. • PL transients became continuously faster with increasing annealing temperature. • Enhancement in the PL efficiency with increasing annealing temperature up to 925 °C.

  9. Time-resolved photoluminescence of Ga(NAsP) multiple quantum wells grown on Si substrate: Effects of rapid thermal annealing

    International Nuclear Information System (INIS)

    Woscholski, R.; Shakfa, M.K.; Gies, S.; Wiemer, M.; Rahimi-Iman, A.; Zimprich, M.; Reinhard, S.; Jandieri, K.; Baranovskii, S.D.; Heimbrodt, W.; Volz, K.; Stolz, W.; Koch, M.

    2016-01-01

    Time-resolved photoluminescence (TR-PL) spectroscopy has been used to study the impact of rapid thermal annealing (RTA) on the optical properties and carrier dynamics in Ga(NAsP) multiple quantum well heterostructures (MQWHs) grown on silicon substrates. TR-PL measurements reveal an enhancement in the PL efficiency when the RTA temperature is increased up to 925 °C. Then, the PL intensity dramatically decreases with the annealing temperature. This behavior is explained by the variation of the disorder degree in the studied structures. The analysis of the low-temperature emission-energy-dependent PL decay time enables us to characterize the disorder in the Ga(NAsP) MQWHs. The theoretically extracted energy-scales of disorder confirm the experimental observations. - Highlights: • Ga(NAsP) multiple quantum well heterostructures (MQWHs) grown on silicon substrates • Impact of rapid thermal annealing on the optical properties and carrier dynamics • Time resolved photoluminescence spectroscopy was applied. • PL transients became continuously faster with increasing annealing temperature. • Enhancement in the PL efficiency with increasing annealing temperature up to 925 °C

  10. Effects of substrate temperature on sprayed ZnO thin films optical and morphological properties in terms of Amlouk-Boubaker opto-thermal expansivity psi{sub AB}

    Energy Technology Data Exchange (ETDEWEB)

    Amlouk, A.; Boubaker, K. [Unite de physique des dispositifs a semi-conducteurs, Faculte des sciences de Tunis, Universite de Tunis El Manar, 2092 Tunis (Tunisia); Amlouk, M., E-mail: mmbb11112000@yahoo.f [Unite de physique des dispositifs a semi-conducteurs, Faculte des sciences de Tunis, Universite de Tunis El Manar, 2092 Tunis (Tunisia)

    2009-08-12

    In this study, ZnO thin films have been grown using spray pyrolysis technique on glass substrates under various substrate temperature (400, 420, 440, 460, 480 and 500 deg. C). The Precursors were Propan-2-ol C{sub 3}H{sub 8}O and zinc acetate zinc Zn(CH{sub 3}CO{sub 2}){sub 2} in acidified medium (acetic acid CH{sub 3}CO{sub 2}H, pH = 5). XRD analyses yielded a strong (0 0 2) X-ray diffraction line for low substrate temperatures (400-420 deg. C). This c-axis preferential orientation was not observed for substrate temperature beyond 440 deg. C. Atomic Force Microscopy (AFM) analyses monitored clusters with variable shapes (pyramidal for high temperatures and rounded concentrated ones for temperatures below 440 deg. C). Finally, the optical measurements were carried out via transmittance T(lambda) and reflectance R(lambda) spectra inside 250-2500 nm domain. Thanks to optical measurements, the conjoint optical and thermal properties were deduced using the Amlouk-Boubaker opto-thermal expansively psi{sub AB}.

  11. Erosion resistance comparison of alternative surface treatments

    Science.gov (United States)

    Česánek, Z.; Schubert, J.; Houdková, Š.

    2017-05-01

    Erosion is a process characterized by the particle separation and the damage of component functional surfaces. Thermal spraying technology HP/HVOF (High Pressure / High Velocity Oxygen Fuel) is commonly used for protection of component surfaces against erosive wear. Alloy as well as cermet based coatings meet the requirements for high erosion resistance. Wear resistance is in many cases the determining property of required component functioning. The application suitability of coating materials is particularly influenced by different hardness. This paper therefore presents an erosion resistance comparison of alloy and cermet based coatings. The coatings were applied on steel substrates and were subjected to the erosive test using the device for evaluation of material erosion resistance working on the principle of centrifugal erodent flow. Abrasive sand Al2O3 with grain size 212-250 μm was selected as an erosive material. For this purpose, the specimens were prepared by thermal spraying technology HP/HVOF using commercially available powders Stellite 6, NiCrBSi, Cr3C2-25%NiCr, Cr3C2-25%CoNiCrAlY, Hastelloy C-276 and experimental coating TiMoCN-29% Ni. Erosion resistance of evaluated coatings was compared with erosive resistance of 1.4923 high alloyed steel without nitridation and in nitrided state and further with surface treatment using technology PVD. According to the evaluation, the resulting erosive resistance depends not only on the selected erodent and surface protection, but also on the erodent impact angle.

  12. A study for the detection of ionizing particles with phototransistors on thick high-resistivity silicon substrates

    International Nuclear Information System (INIS)

    Batignani, G.; Angelini, C.; Bisogni, M.G.; Boscardin, M.; Bettarini, S.; Bondioli, M.; Bosisio, L.; Bucci, F.; Calderini, G.; Carpinelli, M.; Ciacchi, M.; Dalla Betta, G.F.; Dittongo, S.; Forti, F.; Giorgi, M.A.; Gregori, P.; Han, D.J.; Manfredi, P.F.; Manghisoni, M.; Marchiori, G.; Neri, N.; Novelli, M.; Paoloni, E.; Piemonte, C.; Rachevskaia, I.; Rama, M.; Ratti, L.; Re, V.; Rizzo, G.; Ronchin, S.; Rosso, V.; Simi, G.; Speziali, V.; Stefanini, A.; Zorzi, N.

    2004-01-01

    We report on bipolar NPN phototransistors fabricated at ITC-IRST on thick high-resistivity silicon substrates. The phototransistor emitter is composed of a phosphorus n+ implant, the base is a diffused high-energy boron implant, and the collector is the 600-800 μm thick silicon bulk, contacted on the backplane. We have studied the current amplification for two different doping profiles of the emitter, obtaining values of β ranging from 60 to 3000. For various emitter and base configurations, we measured the static device characteristics and extracted the leakage currents and the base resistance, verifying the fundamental relationship between them and the total base capacitances. The use of such phototransistors to detect ionizing particles is exploited and discussed

  13. A study for the detection of ionizing particles with phototransistors on thick high-resistivity silicon substrates

    Energy Technology Data Exchange (ETDEWEB)

    Batignani, G. E-mail: giovanni.batignani@pi.infn.it; Angelini, C.; Bisogni, M.G.; Boscardin, M.; Bettarini, S.; Bondioli, M.; Bosisio, L.; Bucci, F.; Calderini, G.; Carpinelli, M.; Ciacchi, M.; Dalla Betta, G.F.; Dittongo, S.; Forti, F.; Giorgi, M.A.; Gregori, P.; Han, D.J.; Manfredi, P.F.; Manghisoni, M.; Marchiori, G.; Neri, N.; Novelli, M.; Paoloni, E.; Piemonte, C.; Rachevskaia, I.; Rama, M.; Ratti, L.; Re, V.; Rizzo, G.; Ronchin, S.; Rosso, V.; Simi, G.; Speziali, V.; Stefanini, A.; Zorzi, N

    2004-09-01

    We report on bipolar NPN phototransistors fabricated at ITC-IRST on thick high-resistivity silicon substrates. The phototransistor emitter is composed of a phosphorus n+ implant, the base is a diffused high-energy boron implant, and the collector is the 600-800 {mu}m thick silicon bulk, contacted on the backplane. We have studied the current amplification for two different doping profiles of the emitter, obtaining values of {beta} ranging from 60 to 3000. For various emitter and base configurations, we measured the static device characteristics and extracted the leakage currents and the base resistance, verifying the fundamental relationship between them and the total base capacitances. The use of such phototransistors to detect ionizing particles is exploited and discussed.

  14. Phonon impedance matching: minimizing interfacial thermal resistance of thin films

    Science.gov (United States)

    Polanco, Carlos; Zhang, Jingjie; Ghosh, Avik

    2014-03-01

    The challenge to minimize interfacial thermal resistance is to allow a broad band spectrum of phonons, with non-linear dispersion and well defined translational and rotational symmetries, to cross the interface. We explain how to minimize this resistance using a frequency dependent broadening matrix that generalizes the notion of acoustic impedance to the whole phonon spectrum including symmetries. We show how to ``match'' two given materials by joining them with a single atomic layer, with a multilayer material and with a graded superlattice. Atomic layer ``matching'' requires a layer with a mass close to the arithmetic mean (or spring constant close to the harmonic mean) to favor high frequency phonon transmission. For multilayer ``matching,'' we want a material with a broadening close to the geometric mean to maximize transmission peaks. For graded superlattices, a continuous sequence of geometric means translates to an exponentially varying broadening that generates a wide-band antireflection coating for both the coherent and incoherent limits. Our results are supported by ``first principles'' calculations of thermal conductance for GaAs / Gax Al1 - x As / AlAs thin films using the Non-Equilibrium Greens Function formalism coupled with Density Functional Perturbation Theory. NSF-CAREER (QMHP 1028883), NSF-IDR (CBET 1134311), XSEDE.

  15. Thermal shock resistance of thick boron-doped diamond under extreme heat loads

    NARCIS (Netherlands)

    De Temmerman, G.; Dodson, J.; Linke, J.; Lisgo, S.; Pintsuk, G.; Porro, S.; Scarsbrook, G.

    2011-01-01

    Thick free-standing boron-doped diamonds were prepared by microwave plasma assisted chemical vapour deposition. Samples with a final thickness close to 5 mm and with lateral dimensions 25 x 25 mm were produced. The thermal shock resistance of the material was tested by exposure in the JUDITH

  16. Optimization of a waste heat recovery system with thermoelectric generators by three-dimensional thermal resistance analysis

    International Nuclear Information System (INIS)

    Huang, Gia-Yeh; Hsu, Cheng-Ting; Fang, Chun-Jen; Yao, Da-Jeng

    2016-01-01

    Highlights: • The waste heat recovery system is modeled by three-dimensional thermal resistance. • This is a time-saving and efficient method to estimate power generation from TEGs. • Relations between power generation and varied factors can be rapidly revealed. • TEGs positions and uniformity of velocity profile should be considered together. • Power generation is more sensitive to either internal or external flow velocity. - Abstract: Three-dimensional (3D) thermal resistance analysis provides a rapid and simple method to estimate the power generated from a waste heat recovery system with thermoelectric generators (TEGs), and facilitates an optimization of the system. Such a system comprises three parts – a waste heat recovery chamber, TEG modules and a cooling system. A fin-structured duct serves as a waste heat recovery chamber, which is attached to the hot sides of the TEGs; the cold sides of the TEGs are attached to a cooling system. The waste heat recovery chamber harvests energy from exhaust heat that the TEGs convert into electricity. The estimation of generated power is an important part of the system design. Methods of Computational Fluid Dynamics (CFD) assist the analysis and improve the performance with great accuracy but great computational duration. The use of this method saves much time relative to such CFD methods. In 3D thermal resistance analysis, a node of unknown temperature is located at the centroid of each cell into which the system is divided. The relations of unknown temperatures at the cells are based on the energy conservation and the definition of thermal resistance. The temperatures of inlet waste hot gas and ambient fluid are known. With these boundary conditions, the unknown temperatures in the system are solved, enabling estimation of the power generated with TEGs. A 3D model of the system was simulated with FloTHERM; its numerical solution matched the solution of the 3D thermal resistance analysis within 6%. The power

  17. A new aspects for project of subsequent thermal resistance extension at old-timer timbering constructions of wood

    Directory of Open Access Journals (Sweden)

    Zdeňka Havířová

    2006-01-01

    Full Text Available To ensure the reliability of subsequent thermal resistance extension at old-timer timbering constructions of wood for the period of their supposed service life a more profound analysis of construction is necessary from the aspect of a global thermal/technical evaluation. Service life of these buildings is dependent on temperature and moisture conditions in layers of the building cladding where the wood framework is built in. Temperature/moisture conditions or the corresponding equilibrium moisture content (EMC of the construction show considerable effects on the functional reliability of the whole building from the viewpoint of mechanical resistance and stability, energy savings and thermal protection and hygiene, health and environment protection.

  18. Monolithic pixels on moderate resistivity substrate and sparsifying readout architecture

    CERN Document Server

    Giubilato, P; Snoeys, W; Bisello, D; Marchioro, A; Battaglia, M; Demaria, L; Mansuy, S C; Pantano, D; Rousset, J; Mattiazzo, S; Kloukinas, K; Potenza, A; Ikemoto, Y; Rivetti, A; Chalmet, P; Mugnier, H; Silvestrin, L

    2013-01-01

    The LePix projects aim realizing a new generation monolithic pixel detectors with improved performances at lesser cost with respect to both current state of the art monolithic and hybrid pixel sensors. The detector is built in a 90 nm CMOS process on a substrate of moderate resistivity. This allows charge collection by drift while maintaining the other advantages usually offered by MAPS, like having a single piece detector and using a standard CMOS production line. The collection by drift mechanism, coupled to the low capacitance design of the collecting node made possible by the monolithic approach, provides an excellent signal to noise ratio straight at the pixel cell together with a radiation tolerance far superior to conventional un-depleted MAPS. The excellent signal-to-noise performance is demonstrated by the device ability to separate the 6 keV Fe-55 double peak at room temperature. To achieve high granularity (10-20 mu m pitch pixels) over large detector areas maintaining high readout speed, a complet...

  19. Inductive thermal plasma generation applied for the materials coating

    International Nuclear Information System (INIS)

    Pacheco, J.; Pena, R.; Cota, G.; Segovia, A.; Cruz, A.

    1996-01-01

    The coatings by thermal plasma are carried out introducing particles into a plasma system where they are accelerated and melted (total or partially) before striking the substrate to which they adhere and are suddenly cooled down. The nature of consolidation and solidification of the particles allows to have control upon the microstructure of the deposit. This technique is able to deposit any kind of material that is suitable to be merged (metal, alloy, ceramic, glass) upon any type of substrate (metal, graphite, ceramic, wood) with an adjustable thickness ranging from a few microns up to several millimeters. The applications are particularly focused to the coating of materials in order to improve their properties of resistance to corrosion, thermal and mechanical efforts as well as to preserve the properties of the so formed compound. In this work the electromagnetic induction phenomenon in an ionized medium by means of electric conductivity, is described. Emphasis is made on the devices and control systems employed in order to generate the thermal plasma and in carrying out the coatings of surfaces by the projection of particles based on plasma

  20. Radiation induced vapour phase grafting of styrene onto fluorinated substrates

    International Nuclear Information System (INIS)

    Dargaville, T.; Hill, D.; George, G.; Cardona, F.

    2000-01-01

    Full text: Polytetrafluoroethylene (PTFE) is well known for being inert towards heat, solvents and harsh chemicals. However, in contrast, PTFE is extremely sensitive to radiation suffering from a dramatic decrease in mechanical strength even when exposed to low doses. In this study we have used a copolymer of PTFE, poly(tetrafluoroethylene-co-perfluoropropylvinyl ether) (PFA). The effect of the ether comonomer is to render the polymer melt processable, lower the crystallinity and increase the radical yield when compared with PTFE. When grafting styrene to PFA using a radiation initiated process, the resulting polymer has the desirable chemical and thermal resistance of the PFA substrate combined with the functionality of the styrene, however, due to the incidental degradative effect of radiation on the PFA substrate it is important to find conditions where the best graft is achieved without exposing the substrate to extraneous levels of radiation. We have successfully grafted styrene to PFA by simultaneously exposing PFA to styrene vapour and gamma radiation. This process was found to be independent of dose rate at low dose rates suggesting a diffusion controlled mechanism. The penetration of the graft into the PFA substrate was measured by mapping a cross-section using micro-probe Raman spectroscopy

  1. Ion beam modification of thermal stress resistance of MgO single crystals with different crystallographic faces

    International Nuclear Information System (INIS)

    Gurarie, V.N.; Otsuka, P.H.; Williams, J.S.; Conway, M.J.

    2000-01-01

    Ion beam modification of thermal shock stress resistance of MgO single crystals with various crystallographic faces is investigated. The most stable crystal faces in terms of stress and damage resistance are established. Ion implantation is shown to reduce the temperature threshold of fracture for all crystal faces tested. The (111) face is demonstrated to be of highest stability compared to (110) and (100) faces in both implanted and unimplanted crystals. At the same time ion implantation substantially increases the microcrack density for all the faces tested and reduces the degree of fracture damage following thermal shock. The theoretical resistance parameters for various crystal faces are calculated using the continuum mechanics approach. The results are discussed on the basis of fracture mechanics principles and the effect of the implantation-induced lattice damage on crack nucleation

  2. Fabrication of nano-sized metal patterns on flexible polyethylene-terephthalate substrate using bi-layer nanoimprint lithography

    Energy Technology Data Exchange (ETDEWEB)

    Hwang, Seon Yong; Jung, Ho Yong [Department of Materials Science and Engineering, Korea University, Seoul, 136-701 (Korea, Republic of); Jeong, Jun-Ho [Nano-Mechanical Systems Research Center, Korea Institute of Machinery and Materials, Yuseong-gu Daejeon, 305-343 (Korea, Republic of); Lee, Heon, E-mail: heonlee@korea.ac.k [Department of Materials Science and Engineering, Korea University, Seoul, 136-701 (Korea, Republic of)

    2009-05-29

    Polymer films are widely used as a substrate for displays and for solar cells since they are cheap, transparent and flexible, and their material properties are easy to design. Polyethylene-terephthalate (PET) is especially useful for various applications requiring transparency, flexibility and good thermal and chemical resistance. In this study, nano-sized metal patterns were fabricated on flexible PET film by using nanoimprint lithography (NIL). Water-soluble poly-vinyl alcohol (PVA) resin was used as a planarization and sacrificial layer for the lift-off process, as it does not damage the PET films and can easily be etched off by using oxygen plasma. NIL was used to fabricate the nano-sized patterns on the non-planar or flexible substrate. Finally, a nano-sized metal pattern was successfully formed by depositing the metal layer over the imprinted resist patterns and applying the lift-off process, which is economic and environmentally friendly, to the PET films.

  3. Anomalies of the photo-response and thermal boundary resistance of a YBaCuO/YSZ structure

    International Nuclear Information System (INIS)

    Bonch-Osmolovskii, M.M.; Galkina, T.I.; Golovashkin, A.I.; Dovydenko, K.Yu.; Klokov, A.Yu.; Krasnosvobodtsev, S.I.; Oktyabrskii, S.R.; Romanov, E.G.

    1993-01-01

    The photoresponse of a YBaCuO/ZrO 2 bolometric structure was measured under modulated (λ = 630 nm) and pulsed (τ ∼ 7-8 ns; λ = 337 nm) laser excitation. The shape of the measured photoresponse was interpreted by a thermal model; nevertheless, the pulse amplitude for vanishing YBaCuO film resistance was 5-6 times greater than predicted; the thermal boundary resistance R Bd between YBaCuO and YSZ was evaluated ≅ 10 -2 K x cm 2 /Watt, which is considerably larger than estimated theoretically for the similar situation of YBaCuO/MgO. (orig.)

  4. Improved thermal stability and oxidation resistance of Al–Ti–N coating by Si addition

    International Nuclear Information System (INIS)

    Chen, Li; Yang, Bing; Xu, Yuxiang; Pei, Fei; Zhou, Liangcai; Du, Yong

    2014-01-01

    Addition of Si is very effective in upgrading the machining performance and thermal properties of Al–Ti–N coating. Here, we concentrate on the thermal stability and oxidation resistance of Al–Ti–Si–N coating. Alloying with Si favors the growth of wurtzite phase, and thereby causes a drop in hardness from ∼ 34.5 to 28.7 GPa. However, Si-containing coating retards the formation of w-AlN during thermal annealing, and thereby behaves a high hardness value of ∼ 31.3 GPa after annealing at T a = 1100 °C. After 10 h exposure in air at 850 °C, Al–Ti–N coating is fully oxidized. Incorporation of Si significantly improves the oxidation resistance of Al–Ti–N due to the combined effects with the promoted formation of Al-oxide rich top-scale and retarded transformation of anatase (a-) TiO 2 into rutile (r-) TiO 2 , where only ∼ 1.43 μm oxide scale is shown after oxidation at 1100 °C for 15 h. Noticeable is that the worst oxidation resistance of Al–Ti–Si–N coating in the temperature range from 800 to 1100 °C is obtained at 950 °C with oxide scale of ∼ 1.76 μm due to the fast formation of r-TiO 2 . Additionally, a pre-oxidation at 1000 °C has a positive effect on the oxidation resistance of Al–Ti–Si–N coating, which is attributed to the formation of Al-oxide rich top-scale, and thus inhibits the outward diffusion of metal atoms and inward diffusion of O. - Highlights: • Si as a substitutional solid solution and via the formation of a-Si 3 N 4 coexists. • Si addition favors the growth of wurtzite phase and causes a decreased hardness. • Alloying with Si improves the oxidation resistance of AlTiN. • AlTiSiN behaves the worst oxidation resistance at 950 °C from 800 to 1100 °C. • A pre-oxidation at 1000 °C improves the oxidation resistance of AlTiSiN coating

  5. Improved behavior of cooper-amine complexes during thermal annealing for conductive thin film synthesis

    Energy Technology Data Exchange (ETDEWEB)

    Ayag, Kevin Ray; Panama, Gustavo; Paul, Shrabani; Kim, Hong Doo [Dept. of Advanced Materials Engineering for Information and Electronics, Kyung Hee University, Yongin (Korea, Republic of)

    2017-02-15

    Previous studies successfully produced conductive thin films from organo-metallic-compounds-based inks. Some inks like those made from copper salt and amines, however, tend to move during thermal annealing and, thus, affect the conductive pattern on the substrate. In this study, conductive inks were synthesized by forming complexes of copper with amines and/or blended amines. To build-up an organo-metallic framework and preserve the pattern throughout the annealing period, diamine was added to the complex in different proportions. The prepared inks were coated on glass substrate and were annealed on a hot plate at 170°C under the gaseous mixture of formic acid and alcohol for 5 min. The metallic film was observed to retain the original pattern of the ink during and after annealing. Adhesion on the substrate was also improved. Inks with blended amines produced films with lower resistivities. The lowest electrical resistivity recorded was 4.99 μΩ cm, three times that of bulk copper.

  6. Temperature dependant thermal and mechanical properties of a metal-phase change layer interface using the time resolved pump probe technique

    International Nuclear Information System (INIS)

    Schick, V; Battaglia, J-L; Kusiak, A; Rossignol, C; Wiemer, C

    2011-01-01

    Time Resolved Pump Probe (TRPP) technique has been implemented to study the thermal and mechanical properties of Ge 2 Sb 2 Te 5 (GST) film deposited on a silicon substrate. According to the knowledge of the thermal properties of the GST layer, the temperature dependant Thermal Boundary Resistance (TBR) at the metal-GST interface is evaluated. Measuring the acoustic oscillation and more particularly its damping leads to characterize the adhesion at the metal - GST interface. This quantity can be efficiently related to the temperature dependent TBR in the 25 deg. C - 400 deg. C range. The TBR increases with temperature and follows the changes of the crystalline structure of materials. A linear relation between the acoustic reflection coefficient and the logarithm of the thermal boundary resistance is found.

  7. Phononic thermal resistance due to a finite periodic array of nano-scatterers

    Energy Technology Data Exchange (ETDEWEB)

    Trang Nghiêm, T. T.; Chapuis, Pierre-Olivier [Univ. Lyon, CNRS, INSA-Lyon, Université Claude Bernard Lyon 1, CETHIL UMR5008, F-69621 Villeurbanne (France)

    2016-07-28

    The wave property of phonons is employed to explore the thermal transport across a finite periodic array of nano-scatterers such as circular and triangular holes. As thermal phonons are generated in all directions, we study their transmission through a single array for both normal and oblique incidences, using a linear dispersionless time-dependent acoustic frame in a two-dimensional system. Roughness effects can be directly considered within the computations without relying on approximate analytical formulae. Analysis by spatio-temporal Fourier transform allows us to observe the diffraction effects and the conversion of polarization. Frequency-dependent energy transmission coefficients are computed for symmetric and asymmetric objects that are both subject to reciprocity. We demonstrate that the phononic array acts as an efficient thermal barrier by applying the theory of thermal boundary (Kapitza) resistances to arrays of smooth scattering holes in silicon for an exemplifying periodicity of 10 nm in the 5–100 K temperature range. It is observed that the associated thermal conductance has the same temperature dependence as that without phononic filtering.

  8. Metal/dielectric thermal interfacial transport considering cross-interface electron-phonon coupling: Theory, two-temperature molecular dynamics, and thermal circuit

    Science.gov (United States)

    Lu, Zexi; Wang, Yan; Ruan, Xiulin

    2016-02-01

    The standard two-temperature equations for electron-phonon coupled thermal transport across metal/nonmetal interfaces are modified to include the possible coupling between metal electrons with substrate phonons. The previous two-temperature molecular dynamics (TT-MD) approach is then extended to solve these equations numerically at the atomic scale, and the method is demonstrated using Cu/Si interface as an example. A key parameter in TT-MD is the nonlocal coupling distance of metal electrons and nonmetal phonons, and here we use two different approximations. The first is based on Overhauser's "joint-modes" concept, while we use an interfacial reconstruction region as the length scale of joint region rather than the phonon mean-free path as in Overhauser's original model. In this region, the metal electrons can couple to the joint phonon modes. The second approximation is the "phonon wavelength" concept where electrons couple to phonons nonlocally within the range of one phonon wavelength. Compared with the original TT-MD, including the cross-interface electron-phonon coupling can slightly reduce the total thermal boundary resistance. Whether the electron-phonon coupling within the metal block is nonlocal or not does not make an obvious difference in the heat transfer process. Based on the temperature profiles from TT-MD, we construct a new mixed series-parallel thermal circuit. We show that such a thermal circuit is essential for understanding metal/nonmetal interfacial transport, while calculating a single resistance without solving temperature profiles as done in most previous studies is generally incomplete. As a comparison, the simple series circuit that neglects the cross-interface electron-phonon coupling could overestimate the interfacial resistance, while the simple parallel circuit in the original Overhauser's model underestimates the total interfacial resistance.

  9. Effects of deposition and post-annealing conditions on electrical properties and thermal stability of TiAlN films by ion beam sputter deposition

    International Nuclear Information System (INIS)

    Lee, S.-Y.; Wang, S.-C.; Chen, J.-S.; Huang, J.-L.

    2006-01-01

    TiAlN films were deposited by ion beam sputter deposition (IBSD) using a Ti-Al (90/10) alloy target in a nitrogen atmosphere on thermal oxidized Si wafers. Effects of ion beam voltage, substrate temperature (T s ) and post-annealing conditions on electrical properties and oxidation resistance of TiAlN films were studied. According to the experimental results, the proper kinetic energy provided good crystallinity and a dense structure of the films. Because of their better crystallinity and predomination of (200) planes, TiAlN films deposited with 900 V at low T s (50 deg. C) have shown lower resistivity than those at high T s (250 deg. C). They also showed better oxidation resistance. If the beam voltage was too high, it caused some damage to the film surfaces, which caused poor oxidation resistance of films. When sufficient kinetic energy was provided by the beam voltage, the mobility of adatoms was too high due to their extra thermal energy, thus reducing the crystallinity and structure density of the films. A beam voltage of 900 V and a substrate temperature of 50 deg. C were the optimum deposition conditions used in this research. They provided good oxidation resistance and low electrical resistivity for IBSD TiAlN films

  10. Characterization of the heat transfer properties of thermal interface materials

    Science.gov (United States)

    Fullem, Travis Z.

    depleted regions at the interface between the TIM and the substrate. The extent to which depleted regions contribute to the interfacial resistance is examined. The relationship between electrical and thermal resistance of the TIM bondline is considered in the context of comparing the relative contribution of electron and phonon heat conduction and how this correlates to microstructural features.

  11. Impact of contact and access resistances in graphene field-effect transistors on quartz substrates for radio frequency applications

    Energy Technology Data Exchange (ETDEWEB)

    Ramón, Michael E., E-mail: michael.ramon@utexas.edu, E-mail: hemacp@utexas.edu; Movva, Hema C. P., E-mail: michael.ramon@utexas.edu, E-mail: hemacp@utexas.edu; Fahad Chowdhury, Sk.; Parrish, Kristen N.; Rai, Amritesh; Akinwande, Deji; Banerjee, Sanjay K. [Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758 (United States); Magnuson, Carl W.; Ruoff, Rodney S. [Department of Mechanical Engineering and the Materials Science and Engineering Program, The University of Texas at Austin, Austin, Texas 78712 (United States)

    2014-02-17

    High-frequency performance of graphene field-effect transistors (GFETs) has been limited largely by parasitic resistances, including contact resistance (R{sub C}) and access resistance (R{sub A}). Measurement of short-channel (500 nm) GFETs with short (200 nm) spin-on-doped source/drain access regions reveals negligible change in transit frequency (f{sub T}) after doping, as compared to ∼23% f{sub T} improvement for similarly sized undoped GFETs measured at low temperature, underscoring the impact of R{sub C} on high-frequency performance. DC measurements of undoped/doped short and long-channel GFETs highlight the increasing impact of R{sub A} for larger GFETs. Additionally, parasitic capacitances were minimized by device fabrication using graphene transferred onto low-capacitance quartz substrates.

  12. Thermal nucleation of kink-antikink pairs in the presence of impurities: The case of a Remoissenet-Peyrard substrate potential

    International Nuclear Information System (INIS)

    Woulache, R.L.; Yemele, D.; Kofane, T.

    2005-09-01

    Thermal nucleation of kink-antikink pairs in a nonlinear Klein- Gordon (NKG) model with a Remoissenet-Peyrard (RP) substrate potential in the presence of impurities and coupled to an applied field is analyzed in the limits of moderate temperature and strong damping. Using the Kolmogorov method, the average velocity of particles of the lattice is calculated and its dependence on the intensity of impurities is discussed in connection with the deformability parameter or the shape of the RP substrate potential. Numerical values are carried out by making use of parameters of the hydrogen atom adsorbed in the tungsten and ruthenium substrates. We show that, for large values of the applied field, the presence of impurities in the system makes the nucleation process of kink-antikink pairs more favorable in the high-temperature regime while they contribute to make it less favorable in the low-temperature regime. (author)

  13. Thermal transport properties of polycrystalline tin-doped indium oxide films

    International Nuclear Information System (INIS)

    Ashida, Toru; Miyamura, Amica; Oka, Nobuto; Sato, Yasushi; Shigesato, Yuzo; Yagi, Takashi; Taketoshi, Naoyuki; Baba, Tetsuya

    2009-01-01

    Thermal diffusivity of polycrystalline tin-doped indium oxide (ITO) films with a thickness of 200 nm has been characterized quantitatively by subnanosecond laser pulse irradiation and thermoreflectance measurement. ITO films sandwiched by molybdenum (Mo) films were prepared on a fused silica substrate by dc magnetron sputtering using an oxide ceramic ITO target (90 wt %In 2 O 3 and 10 wt %SnO 2 ). The resistivity and carrier density of the ITO films ranged from 2.9x10 -4 to 3.2x10 -3 Ω cm and from 1.9x10 20 to 1.2x10 21 cm -3 , respectively. The thermal diffusivity of the ITO films was (1.5-2.2)x10 -6 m 2 /s, depending on the electrical conductivity. The thermal conductivity carried by free electrons was estimated using the Wiedemann-Franz law. The phonon contribution to the heat transfer in ITO films with various resistivities was found to be almost constant (λ ph =3.95 W/m K), which was about twice that for amorphous indium zinc oxide films

  14. Rising the exploitation of substrates by thermal digestate processing; Steigerung der Substratausnutzung durch thermische Gaerrestbehandlung

    Energy Technology Data Exchange (ETDEWEB)

    Seick, Ingolf; Gebhardt, Sebastian [Hochschule Magdeburg-Stendal (Germany). Fachbereich Wasser- und Kreislaufwirtschaft

    2013-10-01

    The paper introduces a new process for biogas plants to increase the utilization of substrate and to reduce the required feeding. By a thermal treatment of a partial flow of the digestate the gas yield is increased considerably, whereupon a recirculation is carried out into the fermentation process. The digestate taken from the secondary fermenter is separated to a liquid and a solid phase. The solid phase is treated thermally and led back into the main fermenter discontinuously. The discharge of a subset of the untreated digestate shall avoid accumulation of inert fractions. Batch fermentation tests with separated digestate of a typical biogas plant have shown an increase of the VS-specific gas and methane yields, e.g. of approx. 90% after a 10-minute treatment in a lab-scale high pressure autoclave at 170 C and 8 bar. Simulations point out that a long-term use of the process in biogas plants can be possible effectively. (orig.)

  15. Thermal shock resistance behavior of a functionally graded ceramic: Effects of finite cooling rate

    Directory of Open Access Journals (Sweden)

    Zhihe Jin

    2014-01-01

    Full Text Available This work presents a semi-analytical model to explore the effects of cooling rate on the thermal shock resistance behavior of a functionally graded ceramic (FGC plate with a periodic array of edge cracks. The FGC is assumed to be a thermally heterogeneous material with constant elastic modulus and Poisson's ratio. The cooling rate applied at the FGC surface is modeled using a linear ramp function. An integral equation method and a closed form asymptotic temperature solution are employed to compute the thermal stress intensity factor (TSIF. The thermal shock residual strength and critical thermal shock of the FGC plate are obtained using the SIF criterion. Thermal shock simulations for an Al2O3/Si3N4 FGC indicate that a finite cooling rate leads to a significantly higher critical thermal shock than that under the sudden cooling condition. The residual strength, however, is relatively insensitive to the cooling rate.

  16. Characterization and properties of shock and corrosion resistant of titanium based coatings

    International Nuclear Information System (INIS)

    Motoiu, P.; Rosso, M.

    2001-01-01

    Thermal spraying technologies are an effective way to ensure surface protection against destructive effects of wear, corrosion and oxidizing phenomena. These technologies can be applied in majority of industrial sectors in order to improve properties of new parts or for reconditioning worn out parts technology. Ideally, it would be comfortable to have a material able to resist to all type of wear, but the work condition intricacy combined with economic reason have lead to the development of a big number of powder materials that are used in thermal spraying technologies. The titanium powders are suitable for coating layers which have a good behavior in 'metal on metal friction', toughness, shock and corrosion resistance. In particular, titanium layers obtained by plasma spraying are used in different aerospace and non aerospace applications due to the combination of low density, very good mechanical properties and high corrosion resistance. The accomplishment of new titanium thermal layers is effectively used in order to increase the lifetime of different engine parts securing the thermal protection in use, resistance to high corrosion and oxidizing phenomena. This paper deals about the mechanical properties of Ti based coatings applied by plasma spray process on steel substrates, the obtained results show the possibility to apply titanium coatings where special and high performance materials are needed. (author)

  17. Superhydrophobic surface fabricated on iron substrate by black chromium electrodeposition and its corrosion resistance property

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Bo [Qinghai Institute of Salt Lakes, Chinese Academy of Sciences, Xining 810008, Qinghai (China); University of Chinese Academy of Sciences, Beijing 100049 (China); Key Lab of Comprehensive and Highly Efficient Utilization of Salt Lake Resource, Chinese Academy of Science, Xining 810008, Qinghai (China); Feng, Haitao [Qinghai Institute of Salt Lakes, Chinese Academy of Sciences, Xining 810008, Qinghai (China); Key Lab of Comprehensive and Highly Efficient Utilization of Salt Lake Resource, Chinese Academy of Science, Xining 810008, Qinghai (China); Lin, Feng [Qinghai Institute of Salt Lakes, Chinese Academy of Sciences, Xining 810008, Qinghai (China); University of Chinese Academy of Sciences, Beijing 100049 (China); Wang, Yabin [Qinghai Institute of Salt Lakes, Chinese Academy of Sciences, Xining 810008, Qinghai (China); Key Lab of Comprehensive and Highly Efficient Utilization of Salt Lake Resource, Chinese Academy of Science, Xining 810008, Qinghai (China); Wang, Liping [Qinghai Institute of Salt Lakes, Chinese Academy of Sciences, Xining 810008, Qinghai (China); University of Chinese Academy of Sciences, Beijing 100049 (China); Dong, Yaping [Qinghai Institute of Salt Lakes, Chinese Academy of Sciences, Xining 810008, Qinghai (China); Key Lab of Comprehensive and Highly Efficient Utilization of Salt Lake Resource, Chinese Academy of Science, Xining 810008, Qinghai (China); Li, Wu, E-mail: liwu2016@126.com [Qinghai Institute of Salt Lakes, Chinese Academy of Sciences, Xining 810008, Qinghai (China); Key Lab of Comprehensive and Highly Efficient Utilization of Salt Lake Resource, Chinese Academy of Science, Xining 810008, Qinghai (China)

    2016-08-15

    Highlights: • Superhydrophobic surface was fabricated by black chromium electrodeposition and stearic acid modification. • The reaction process is simple, and of low cost, and no special instrument or environment is needed. • The obtained superhydrophobic surface presents good water repellency, and performs well at corrosion resistance. - Abstract: The fabrication of superhydrophobic surface on iron substrate is carried out through 20 min black chromium electrodeposition, followed by immersing in 0.05 M ethanolic stearic acid solution for 12 h. The resultant superhydrophobic complex film is characterized by scanning electron microscope (SEM), disperse Spectrometer (EDS), atomic force microscope (AFM), water contact angle (CA), sliding angle (SA) and X-ray photoelectron spectroscope (XPS), and its corrosion resistance property is measured with cyclic voltammetry (CV), linear polarization and electrochemical impedance spectroscopy (EIS). The results show that the fabricated superhydrophobic film has excellent water repellency (CA, 158.8°; SA, 2.1°) and significantly high corrosion resistance (1.31 × 10{sup 6} Ω cm{sup −2}) and excellent corrosion protection efficiency (99.94%).

  18. Role of fluttering dislocations in the thermal interface resistance between a silicon crystal and plastic solid 4He

    Science.gov (United States)

    Amrit, Jay; Ramiere, Aymeric; Volz, Sebastian

    2018-01-01

    A quantum solid (solid 4He) in contact with a classical solid defines a new class of interfaces. In addition to its quantum nature, solid 4He is indeed a very plastic medium. We examine the thermal interface resistance upon solidification of superfluid 4He in contact with a silicon crystal surface (111) and show that dislocations play a crucial role in the thermal interface transport. The growth of solid 4He and the measurements are conducted at the minimum of the melting curve of helium (0.778 K and ˜25 bar ). The results display a first-order transition in the Kapitza resistance from a value of RK ,L=(80 ±8 ) c m2K /W at a pressure of 24.5 bar to a value of RK ,S=(41.7 ±8 ) c m2K /W after the formation of solid helium at ˜25.2 bar . The drop in RK ,S is only of a factor of ˜2 , although transverse phonon modes in solid 4He now participate in heat transmission at the interface. We provide an explanation for the measured RK ,S by considering the interaction of thermal phonons with vibrating dislocations in solid 4He. We demonstrate that this mechanism, also called fluttering, induces a thermal resistance RF l∝NdT-6 , where T is the temperature and Nd is the density of dislocations. We estimate that for dislocation densities on the order of ˜107c m-2 , RF l predominates over the boundary resistance RK ,S. These fundamental findings shed light on the role of dislocations and provide a quantitative explanation for previous experiments which showed no measurable change in the Kapitza resistance between Cu and superfluid 4He upon solidification of the latter. This demonstrates the possibility of using dislocations as an additional means to tailor thermal resistances at interfaces, formed especially with a plastic material.

  19. Development of a novel non-contact inspection technique to detect micro cracks under the surface of a glass substrate by thermal stress-induced light scattering method

    Science.gov (United States)

    Sakata, Yoshitaro; Terasaki, Nao; Nonaka, Kazuhiro

    2017-05-01

    Fine polishing techniques, such as a chemical mechanical polishing treatment, are important techniques in glass substrate manufacturing. However, these techniques may cause micro cracks under the surface of glass substrates because they used mechanical friction. A stress-induced light scattering method (SILSM), which was combined with light scattering method and mechanical stress effects, was proposed for inspecting surfaces to detect polishing-induced micro cracks. However, in the conventional SILSM, samples need to be loaded with physical contact, and the loading point is invisible in transparent materials. Here, we introduced a novel non-contact SILSM using a heating device. A glass substrate was heated first, and then the light scattering intensity of micro cracks was detected by a cooled charge-couple device camera during the natural cooling process. Results clearly showed during the decreasing surface temperature of a glass substrate, appropriate thermal stress is generated for detecting micro cracks by using the SILSM and light scattering intensity from micro cracks changes. We confirmed that non-contact thermal SILSM (T-SILSM) can detect micro cracks under the surface of transparent materials.

  20. Neutron polarizing Fe-Al supermirror on a Si crystal substrate and its applications for thermal and cold neutrons

    International Nuclear Information System (INIS)

    Syromyatnikov, V.G.; Shchebetov, A.F.; Soroko, Z.N.

    1994-01-01

    Experimental data are presented for an Fe-Al neutron polarizing supermirror on a Si crystal substrate with an antireflecting Cd layer. The polarizing efficiency of this supermirror is P≥qslant0.8 for the range of glancing angles θ/λ=0.25-1.7 /nm and P≥qslant0.95 for θ/λ=0.34-1.7 /nm. Some applications of this supermirror for thermal and cold neutrons are considered. ((orig.))

  1. An Experimental Study on Heat Conduction and Thermal Contact Resistance for the AlN Flake

    Directory of Open Access Journals (Sweden)

    Huann-Ming Chou

    2013-01-01

    Full Text Available The electrical technology has been a fast development over the past decades. Moreover, the tendency of microelements and dense division multiplex is significantly for the electrical industries. Therefore, the high thermal conductible and electrical insulating device will be popular and important. It is well known that AlN still maintains stablility in the high temperature. This is quite attractive for the research and development department. Moreover, the thermal conduct coefficient of AlN is several times larger than the others. Therefore, it has been thought to play an important role for the radiator of heat source in the future. Therefore, this paper is focused on the studies of heat conduction and thermal contact resistance between the AlN flake and the copper specimens. The heating temperatures and the contact pressures were selected as the experimental parameters. According to the experimental results, the materials are soft and the real contact areas between the interfaces significantly increase under higher temperatures. As a result, the thermal contact resistance significantly decreases and the heat transfer rate increases with increasing the heating temperature or the contact pressures.

  2. Facile synthesis, growth mechanism and reversible superhydrophobic and superhydrophilic properties of non-flaking CuO nanowires grown from porous copper substrates

    International Nuclear Information System (INIS)

    Zhang Qiaobao; Xu Daguo; Zhang Kaili; Hung, Tak Fu

    2013-01-01

    Reversible superhydrophobic and superhydrophilic surfaces based on porous substrates covered with CuO nanowires are developed in this study. A facile thermal oxidation method is used to synthesize non-flaking bicrystalline CuO nanowires on porous copper substrates in static air. The effects of thermal oxidation temperature and duration are systemically studied. The growth mechanism of the obtained non-flaking CuO nanowires is presented and the compression stress is believed to be the key driving force. The wettability of the CuO nanowires after chemical modification with trichloro(1H,1H,2H,2H-perfluorooctyl)silane is systemically investigated. The porous substrates covered with CuO nanowires exhibit excellent superhydrophobic performance with almost no water adhesion and no apparent drag resistance, and a maximum static water contact angle of 162 ± 2° is observed. Moreover, a rapid reversibly switchable wettability between superhydrophobic and superhydrophilic states is realized by the alternation of air–plasma treatment and surface fluorination. The porous substrates covered with CuO nanowires will find promising applications in surface and corrosion protection, liquid transportation, oil–water separation, and self-cleaning surfaces. (paper)

  3. Thermal resistance of rotating closed-loop pulsating heat pipes: Effects of working fluids and internal diameters

    Directory of Open Access Journals (Sweden)

    Kammuang-Lue Niti

    2017-01-01

    Full Text Available The objective of this study was to experimentally investigate the effects of working fluids and internal diameters on the thermal resistance of rotating closed-loop pul¬sating heat pipes (RCLPHP. The RCLPHP were made of a copper tube with internal diameters of 1.50 mm and 1.78 mm, bent into the shape of a flower petal, and arranged into a circle with 11 turns. The evaporator section was located at the outer end of the tube bundle. R123, ethanol, and water were filled as the working fluids. The RCLPHP was rotated at centrifugal accelerations 0.5, 1, 3, 5, 10, and 20 times of the gravitational acceleration considered at the connection between the evaporator and the condenser sections. The heat input was varied from 30 W to 50 W, and then to 100 W, 150 W, and 200 W. It can be concluded that when the latent heat of evaporation increases, the pressure difference between the evaporator and the condenser sections decreases, and the thermal resistance increases. Moreover, when the internal diameter increases, the driving force increases and the frictional force proportionally decreases, or the Karman number increases, and the thermal resistance decreases.

  4. A review of methods to evaluate borehole thermal resistances in geothermal heat-pump systems

    Energy Technology Data Exchange (ETDEWEB)

    Lamarche, Louis; Kajl, Stanislaw; Beauchamp, Benoit [Ecole de Technologie Superieure, 1100 Notre-Dame Ouest, Montreal (Canada)

    2010-06-15

    In the design of a ground-source heat pump (GSHP) system, the heat transfer from the fluid to the ground is influenced by the thermal borehole resistance between the fluid and the borehole surface and also by the interference resistance between the two (or four) pipes inside the borehole. Several authors have proposed empirical and theoretical relations to evaluate these resistances as well as methods to evaluate them experimentally. The paper compares the different approaches and proposes good practice to evaluate the resistances. The impact of the different approaches on the design of heat exchanger is also examined. Two-dimensional and fully three-dimensional numerical simulations are used to evaluate the different methods. A new method is also proposed to evaluate the borehole resistances from in situ tests. (author)

  5. Transfer of Graphene Layers Grown on SiC Wafers to Other Substrates and Their Integration into Field Effect Transistors

    Science.gov (United States)

    Unarunotai, Sakulsuk; Murata, Yuya; Chialvo, Cesar; Kim, Hoon-Sik; MacLaren, Scott; Mason, Nadya; Petrov, Ivan; Rogers, John

    2010-03-01

    An approach to produce graphene films by epitaxial growth on silicon carbide substrate is promising, but its current implementation requires the use of SiC as the device substrate. We present a simple method for transferring epitaxial sheets of graphene on SiC to other substrates. The graphene was grown on the (0001) face of 6H-SiC by thermal annealing in a hydrogen atmosphere. Transfer was accomplished using a peeling process with a bilayer film of Gold/polyimide, to yield graphene with square millimeters of coverage on the target substrate. Back gated field-effect transistors fabricated on oxidized silicon substrates with Cr/Au as source-drain electrodes exhibited ambipolar characteristics with hole mobilities of ˜100 cm^2/V-s, and negligible influence of resistance at the contacts. This work was supported by the U.S. DOE, under Award No. DE-FG02-07ER46471, through the Frederick Seitz Materials Research Laboratory at the University of Illinois at Urbana-Champaign.

  6. ITO films deposited by rf-PERTE on unheated polymer substrates--properties dependence on In-Sn alloy composition

    International Nuclear Information System (INIS)

    Nunes de Carvalho, C.; Lavareda, G.; Fortunato, E.; Vilarinho, P.; Amaral, A.

    2004-01-01

    The study of the influence of different tin concentrations in the In-Sn alloy on the properties of indium tin oxide (ITO) thin films deposited by radio frequency (rf) plasma enhanced reactive thermal evaporation (rf-PERTE) onto flexible polymer and window glass substrates at room temperature is presented. The polymer substrate used is polyethylene terephthalate (PET). The tin concentration in the source alloy varied in the range 5-20 wt.%. The average thickness of the ITO films is of about 90 nm. Results show that ITO thin films deposited on PET from the evaporation of a 85%In:15%Sn alloy exhibit the following characteristics: an average visible transmittance of 80% and an electrical resistivity of 1.6x10 -3 Ω cm. On glass the value of the average visible transmittance increases (85%) and the resistivity decreases to 7.6x10 -4 Ω cm. The electrical properties of ITO films on PET are largely affected by the low carrier mobility

  7. MICROSTRUCTURE AND WEAR RESISTANCE OF COMPOSITE COATING BY LASER CLADDING Al/TiN ON THE Ti–6Al–4V SUBSTRATE

    OpenAIRE

    H. X. ZHANG; H. J. YU; C. Z. CHEN

    2015-01-01

    The composite coatings were fabricated by laser cladding Al/TiN pre-placed powders on Ti–6Al–4V substrate for enhancing wear resistance and hardness of the substrate. The composite coatings were analyzed by means of X-ray diffraction (XRD), scanning electron microscope (SEM) and energy dispersive spectrometer (EDS). The sliding wear tests were performed by MM200 wear test machine. The hardness of the coatings was tested by HV-1000 hardness tester. After laser cladding, it was found that there...

  8. The effect of substrate bias voltages on impact resistance of CrAlN coatings deposited by modified ion beam enhanced magnetron sputtering

    Science.gov (United States)

    Chunyan, Yu; Linhai, Tian; Yinghui, Wei; Shebin, Wang; Tianbao, Li; Bingshe, Xu

    2009-01-01

    CrAlN coatings were deposited on silicon and AISI H13 steel substrates using a modified ion beam enhanced magnetron sputtering system. The effect of substrate negative bias voltages on the impact property of the CrAlN coatings was studied. The X-ray diffraction (XRD) data show that all CrAlN coatings were crystallized in the cubic NaCl B1 structure, with the (1 1 1), (2 0 0) (2 2 0) and (2 2 2) diffraction peaks observed. Two-dimensional surface morphologies of CrAlN coatings were investigated by atomic force microscope (AFM). The results show that with increasing substrate bias voltage the coatings became more compact and denser, and the microhardness and fracture toughness of the coatings increased correspondingly. In the dynamic impact resistance tests, the CrAlN coatings displayed better impact resistance with the increase of bias voltage, due to the reduced emergence and propagation of the cracks in coatings with a very dense structure and the increase of hardness and fracture toughness in coatings.

  9. Heat Transfer Characteristics in High Power LED Packaging

    Directory of Open Access Journals (Sweden)

    Chi-Hung Chung

    2014-03-01

    Full Text Available This study uses the T3Ster transient thermal resistance measuring device to investigate the effects to heat transfer performances from different LED crystal grains, packaging methods and heat-sink substrates through the experimental method. The experimental parameters are six different types of LED modules that are made alternatively with the crystal grain structure, the die attach method and the carrying substrate. The crystal grain structure includes the lateral type, flip chip type and vertical type. The die attach method includes silver paste and the eutectic structure. The carrying substrates are aluminum oxide (Alumina and aluminum nitride (AIN ceramic substrates and metal core PCB (MCPCB. The experimental results show that, under the conditions of the same crystal grain and die attach method, the thermal resistance values for the AIN substrate and the Alumina substrate are 2.1K/W and 5.1K/W, respectively and the total thermal resistance values are 7.3K/W and 10.8K/W. Compared to the Alumina substrate, the AIN substrate can effectively lower the total thermal resistance value by 32.4%. This is because the heat transfer coefficient of the AIN substrate is higher than that of the Alumina substrate, thus effectively increasing its thermal conductivity. In addition, under the conditions of the same crystal grain and the same substrate, the packaging methods are using silver paste and the eutectic structure for die attach. Their thermal resistance values are 5.7K/W and 2.7K/W, respectively, with a variance of 3K/W. Comparisons of the crystal grain structure show that the thermal resistance for the flip chip type is lower than that of the traditional lateral type by 0.9K/W. This is because the light emitting layer of the flip chip crystal grain is closer to the heat-sink substrate, shortening the heat dissipation route, and thus lowering the thermal resistance value. For the total thermal resistance, the crystal grain structure has a lesser

  10. Deposition of the low resistive ITO-films by means of reactive magnetron sputtering of the In/Sn target on the cold substrate

    OpenAIRE

    Zhidik, Y. S.; Troyan, P. E.; Baturina, E. V.; Korzhenko, Dmitry Vladimirovich; Yuriev, Yuri Nikolaevich

    2016-01-01

    Detailed information on the deposition technology of the low-resistive ITO-films in oxygen-containing media by magnetron reactive sputtering from the In(90%)/Sn(10%) target on the cold substrate is given. Developed technology allows deposition ITO-films with sheet resistance transparency higher than 90%. Developed technology is notable for high reproducibility of results and is compatible with production technology of semiconductor devices of optoelectronics.

  11. Orbital hybridization, crystal structure and anomalous resistivity of ultrathin CrZrx alloy films on polymeric substrates

    International Nuclear Information System (INIS)

    Evans, Drew; Zuber, Kamil; Merkens, Kerstin; Murphy, Peter

    2012-01-01

    The orbital hybridization and crystal structure are experimentally explored for ultrathin chrome zirconium (CrZr x ) alloy films co-sputtered on precoated polymeric substrates. We determine the level of orbital hybridization and crystal structure using X-ray photoelectron spectroscopy and electron diffraction. Body-centred cubic and Ω-hexagonally close-packed phases are observed to coexist in the sputtered Cr-based films. Experiments reveal the orbital hybridization and crystal structure combine to produce anomalous resistivity for these ultrathin films.

  12. Structure Analysis Of Corrosion Resistant Thermal Sprayed Coatings On Low Alloy Steels

    Science.gov (United States)

    Chaliampalias, D.; Vourlias, G.; Pistofidis, N.; Pavlidou, E.; Stergiou, A.; Stergioudis, G.; Polychroniadis, E. K.

    2007-04-01

    Metallic coatings have been proved to reduce the rate of corrosion of steel in various atmospheres. In this work the structure of Al, Cu-Al and Zn thermal sprayed coatings is examined. The as formed coatings are extremely rough, and they are composed of several phases which increase corrosion resistance as it was determined Salt Spray Chamber tests.

  13. A new gene, developed through mutagenesis with thermal neutrons, for resistance of rice to bacterial leaf blight

    International Nuclear Information System (INIS)

    Nakai, H.; Shimozawa, H.; Saito, M.

    1992-01-01

    Dry seed lots of a rice variety, Harebare, susceptible to bacterial leaf blight (BLB), were treated with thermal neutrons with and without pre-treatment of the seeds by boron-enrichment, gamma-rays and nitroso-methyl-urea (NMU). The selections were made on M 2 -M 3 materials by inoculation of Japanese BLB race III, with the result that several BLB resistant mutants to race III and the other differential races could be obtained. Mutagenic efficiency of thermal neutrons to the seeds without boron-enrichment for induction of BLB resistant mutants was found to be significantly higher than that of the other mutagens. Four mutant lines of all the selected ones were analyzed for genes for BLB resistance through cross tests between the mutants and the original variety. Harebare, indicating that the resistance in the mutants was conditioned by single recessive gene(s). The mutant designated 86M95 was especially noted for its gene conferring complete (or durable) resistance to multiple BLB races. The 86M95 mutant or the gene may be of practical value for breeding of rice for BLB resistance. (author)

  14. 2D resistivity imaging and magnetic survey for characterization of thermal springs: A case study of Gergedi thermal springs in the northwest of Wonji, Main Ethiopian Rift, Ethiopia

    Science.gov (United States)

    Abdulkadir, Yahya Ali; Eritro, Tigistu Haile

    2017-09-01

    Electrical resistivity imaging and magnetic surveys were carried out at Gergedi thermal springs, located in the Main Ethiopian Rift, to characterize the geothermal condition of the area. The area is geologically characterized by alluvial and lacustrine deposits, basaltic lava, ignimbrites, and rhyolites. The prominent structural feature in this part of the Main Ethiopian Rift, the SW -NE trending structures of the Wonji Fault Belt System, crosse over the study area. Three lines of imaging data and numerous magnetic data, encompassing the active thermal springs, were collected. Analysis of the geophysical data shows that the area is covered by low resistivity response regions at shallow depths which resulted from saline moisturized soil subsurface horizon. Relatively medium and high resistivity responses resulting from the weathered basalt, rhyolites, and ignimbrites are also mapped. Qualitative interpretation of the magnetic data shows the presence of structures that could act as pathways for heat and fluids manifesting as springs and also characterize the degree of thermal alteration of the area. Results from the investigations suggest that the Gergedi thermal springs area is controlled by fault systems oriented parallel and sub-parallel to the main tectonic lines of the Main Ethiopian Rift.

  15. In-Situ Testing of the Thermal Diffusivity of Polysilicon Thin Films

    Directory of Open Access Journals (Sweden)

    Yi-Fan Gu

    2016-10-01

    Full Text Available This paper presents an intuitive yet effective in-situ thermal diffusivity testing structure and testing method. The structure consists of two doubly clamped beams with the same width and thickness but different lengths. When the electric current is applied through two terminals of one beam, the beam serves as thermal resistor and the resistance R(t varies as temperature rises. A delicate thermodynamic model considering thermal convection, thermal radiation, and film-to-substrate heat conduction was established for the testing structure. The presented in-situ thermal diffusivity testing structure can be fabricated by various commonly used micro electro mechanical systems (MEMS fabrication methods, i.e., it requires no extra customized processes yet provides electrical input and output interfaces for in-situ testing. Meanwhile, the testing environment and equipment had no stringent restriction, measurements were carried out at normal temperatures and pressures, and the results are relatively accurate.

  16. Comparison of ozone and thermal hydrolysis combined with anaerobic digestion for municipal and pharmaceutical waste sludge with tetracycline resistance genes.

    Science.gov (United States)

    Pei, Jin; Yao, Hong; Wang, Hui; Ren, Jia; Yu, Xiaohua

    2016-08-01

    Biosolids from wastewater treatment plant (WWTP) are environmental reservoirs of antibiotic resistance genes, which attract great concerns on their efficient treatments. Anaerobic digestion (AD) is widely used for sewage sludge treatment but its effectiveness is limited due to the slow hydrolysis. Ozone and thermal hydrolysis pre-treatment were employed to improve AD efficiency and reduce antibiotic-resistant genes in municipal and pharmaceutical waste sludge (MWS and PWS, respectively) in this study. Sludge solubilization achieved 15.75-25.09% and 14.85-33.92% after ozone and thermal hydrolysis, respectively. Both pre-treatments improved cumulative methane production and the enhancements were greater on PWS than MWS. Five tetracycline-resistant genes (tet(A), tet(G), tet(Q), tet(W), tet(X)) and one mobile element (intI1) were qPCR to assess pre-treatments. AD of pre-treated sludge reduced more tet genes than raw sludge for both ozonation and thermal hydrolysis in PWS and MWS. Thermal hydrolysis pre-treatment was more efficient than ozone for reduction after AD. Results of this study help support management options for reducing the spread of antibiotic resistance from biosolids. Copyright © 2016. Published by Elsevier Ltd.

  17. Titanium oxynitrate (TiNxOy) coating for use in thermal solar energy converters

    International Nuclear Information System (INIS)

    Lasorsa, C; Dilalla, N; Perillo, P; Morando, P.J; Versaci, R; Lucio, R

    2008-01-01

    This work deals with the production of titanium oxynitrate (TiN x O y ) coatings on metallic substrates. Because of its high resistance to high temperatures, titanium oxynitrate (TiN xO y) is a good material for the production of thermal solar energy converters. The surfaces should possess such qualities as high absorbance (α) of solar radiation (range 0.3 μm ≤λ≤2 μm) and low thermal emittance (ε) in the range of λ≥ 2 μm. The coatings should retain optical qualities temperatures greater than 300 o C. These coatings were made using the PECVD (Plasma Enhanced Chemical Vapor Deposition) technique in a single layer coating, with a gaseous mixture using titanium isopropoxide with an air contribution of reactive gas. The process is developed in one stage, with the substrate thermalized at 750 o C and without y BIAS potential. The coatings were carried out on AISI 410 stainless steel and AISI M2 steel substrates. This work presents the preliminary results of the coating's chemical composition, structure and optical and mechanical properties. Fourier transform infrared spectroscopy (FTIR) and X-ray photoelectron spectroscopy (XPS/ESCA) and scanning electron microscopy were used in these studies

  18. Measuring the thermal insulation and evaporative resistance of sleeping bags using a supine sweating fabric manikin

    International Nuclear Information System (INIS)

    Wu, Y S; Fan, Jintu

    2009-01-01

    For testing the thermal insulation of sleeping bags, standard test methods and procedures using heated manikins are provided in ASTM F1720-06 and EN 13537:2002. However, with regard to the evaporative resistance of sleeping bags, no instrument or test method has so far been established to give a direct measurement. In this paper, we report on a novel supine sweating fabric manikin system for directly measuring the evaporative resistance of sleeping bags. Eleven sleeping bags were tested using the manikin under the isothermal condition, namely, both the mean skin temperature of the manikin and that of the environment were controlled to be the same at 35 °C, with the wind speed and ambient relative humidity at 0.3 m s −1 and 50%, respectively. The results showed that the novel supine sweating fabric manikin is reproducible and accurate in directly measuring the evaporative resistance of sleeping bags, and the measured evaporative resistance can be combined with thermal insulation to calculate the moisture permeability index of sleeping bags

  19. Evaluation of hydrogen-Induced cracking resistance of the In625 laser coating system on a C-Mn steel substrate

    Directory of Open Access Journals (Sweden)

    Vicente Braz Trindade

    Full Text Available Abstract The corrosion of C-Mn steels in the presence of hydrogen sulfide (H2S represents a significant challenge to oil production and natural gas treatment facilities. The failure mechanism induced by hydrogen-induced cracking (HIC in a Inconel 625 coating / C-Mn steel has not been extensively investigated in the past. In the present work, an API 5CT steel was coated with In625 alloy using laser cladding and the HIC resistance of different regions, such as the coating surface, the substrate and HAZ, were evaluated. SEM observations illustrated that all HIC cracks were formed at the hard HAZ after 96h of exposure. No HIC cracks were observed in the substrate and the In625 coating after the same exposure duration. Pitting was recorded in the substrate caused by non-metallic inclusion dissolving.

  20. Evaluation of the of thermal shock resistance of a castable containing andalusite aggregates by thermal shock cycles; Avaliacao da resistencia ao dano por choque termico por ciclagem de um concreto refratario contendo agregados de andaluzita

    Energy Technology Data Exchange (ETDEWEB)

    Garcia, G.C.R.; Santos, E.M.B.; Ribeiro, S., E-mail: girribeiro@yahoo.com.br [Universidade de Sao Paulo (DEMAR/EEL/USP), Lorena, SP (Brazil). Escola de Engenharia de. Departamento de Engenharia de Materiais; Resende, W.S. [Industrias Brasileiras de Artigos Refratarios (IBAR), Lorena, SP (Brazil); Rodrigues, J.A. [Universidade Federal de Sao Carlos (UFSCar), SP (Brazil)

    2011-07-01

    The thermal shock resistance of refractory materials is one of the most important characteristics that determine their performance in many applications, since abrupt and drastic differences in temperature can damage them. Resistance to thermal shock damage can be evaluated based on thermal cycles, i.e., successive heating and cooling cycles followed by an analysis of the drop in Young's modulus occurring in each cycle. The aim of this study was to evaluate the resistance to thermal shock damage in a commercial refractory concrete with andalusite aggregate. Concrete samples that were sintered at 1000 deg C and 1450 deg C for 5 hours to predict and were subjected to 30 thermal shock cycles, soaking in the furnace for 20 minutes at a temperature of 1000 deg C, and subsequent cooling in circulating water at 25 deg C. The results showed a decrease in Young's modulus and rupture around 72% for samples sintered at 1000 ° C, and 82% in sintered at 1450 ° C. The refractory sintered at 1450 deg C would show lower thermal shock resistance than the refractory sintered at 1000 deg C. (author)

  1. Temperature, Crystalline Phase and Influence of Substrate Properties in Intense Pulsed Light Sintering of Copper Sulfide Nanoparticle Thin Films.

    Science.gov (United States)

    Dexter, Michael; Gao, Zhongwei; Bansal, Shalu; Chang, Chih-Hung; Malhotra, Rajiv

    2018-02-02

    Intense Pulsed Light sintering (IPL) uses pulsed, visible light to sinter nanoparticles (NPs) into films used in functional devices. While IPL of chalcogenide NPs is demonstrated, there is limited work on prediction of crystalline phase of the film and the impact of optical properties of the substrate. Here we characterize and model the evolution of film temperature and crystalline phase during IPL of chalcogenide copper sulfide NP films on glass. Recrystallization of the film to crystalline covellite and digenite phases occurs at 126 °C and 155 °C respectively within 2-7 seconds. Post-IPL films exhibit p-type behavior, lower resistivity (~10 -3 -10 -4  Ω-cm), similar visible transmission and lower near-infrared transmission as compared to the as-deposited film. A thermal model is experimentally validated, and extended by combining it with a thermodynamic approach for crystal phase prediction and via incorporating the influence of film transmittivity and optical properties of the substrate on heating during IPL. The model is used to show the need to a-priori control IPL parameters to concurrently account for both the thermal and optical properties of the film and substrate in order to obtain a desired crystalline phase during IPL of such thin films on paper and polycarbonate substrates.

  2. Semiconductor-Free Nonvolatile Resistive Switching Memory Devices Based on Metal Nanogaps Fabricated on Flexible Substrates via Adhesion Lithography

    KAUST Repository

    Semple, James; Wyatt-Moon, Gwenhivir; Georgiadou, Dimitra G.; McLachlan, Martyn A.; Anthopoulos, Thomas D.

    2017-01-01

    Electronic memory cells are of critical importance in modern-day computing devices, including emerging technology sectors such as large-area printed electronics. One technology that has being receiving significant interest in recent years is resistive switching primarily due to its low dimensionality and nonvolatility. Here, we describe the development of resistive switching memory device arrays based on empty aluminum nanogap electrodes. By employing adhesion lithography, a low-temperature and large-area compatible nanogap fabrication technique, dense arrays of memory devices are demonstrated on both rigid and flexible plastic substrates. As-prepared devices exhibit nonvolatile memory operation with stable endurance, resistance ratios >10⁴ and retention times of several months. An intermittent analysis of the electrode microstructure reveals that controlled resistive switching is due to migration of metal from the electrodes into the nanogap under the application of an external electric field. This alternative form of resistive random access memory is promising for use in emerging sectors such as large-area electronics as well as in electronics for harsh environments, e.g., space, high/low temperature, magnetic influences, radiation, vibration, and pressure.

  3. Semiconductor-Free Nonvolatile Resistive Switching Memory Devices Based on Metal Nanogaps Fabricated on Flexible Substrates via Adhesion Lithography

    KAUST Repository

    Semple, James

    2017-01-02

    Electronic memory cells are of critical importance in modern-day computing devices, including emerging technology sectors such as large-area printed electronics. One technology that has being receiving significant interest in recent years is resistive switching primarily due to its low dimensionality and nonvolatility. Here, we describe the development of resistive switching memory device arrays based on empty aluminum nanogap electrodes. By employing adhesion lithography, a low-temperature and large-area compatible nanogap fabrication technique, dense arrays of memory devices are demonstrated on both rigid and flexible plastic substrates. As-prepared devices exhibit nonvolatile memory operation with stable endurance, resistance ratios >10⁴ and retention times of several months. An intermittent analysis of the electrode microstructure reveals that controlled resistive switching is due to migration of metal from the electrodes into the nanogap under the application of an external electric field. This alternative form of resistive random access memory is promising for use in emerging sectors such as large-area electronics as well as in electronics for harsh environments, e.g., space, high/low temperature, magnetic influences, radiation, vibration, and pressure.

  4. Thermal conductivity and electrical resistivity standard reference materials: tungsten SRM's 730 and 799, from 4 to 30000K. Final report

    International Nuclear Information System (INIS)

    Hust, J.G.; Giarratano, P.J.

    1975-09-01

    A historical review of the development of thermophysical Standard Reference Materials, SRM's, is given and selection criteria of SRM's are listed. Thermal conductivity and electrical resistivity data for arc cast and sintered tungsten are compiled, analyzed, and correlated. Recommended values of thermal conductivity (SRM 730) and electrical resistivity (SRM 799) for these lots of tungsten are presented for the range 4 to 3000 0 K

  5. Effect of Thermal Fields on the Structure of Corrosion-Resistant Steels Under Different Modes of Laser Treatment

    Science.gov (United States)

    Tarasova, T. V.; Gusarov, A. V.; Protasov, K. E.; Filatova, A. A.

    2017-11-01

    The influence of temperature fields on the structure and properties of corrosion-resistant chromium steels under different modes of laser treatment is investigated. A model of heat transfer under laser impact on target is used to plot thermal fields and cycles and cooling rates. It is shown that the model used for computing thermal fields gives tentative geometric sizes of the fusion zones under laser treatment and selective laser fusion. The cooling rate is shown to have decisive influence on the structure of corrosion-resistant steels after laser treatment with surface fusion in devices for pulsed, continuous, and selective laser melting.

  6. Incorrectness of conventional one-dimensional parallel thermal resistance circuit model for two-dimensional circular composite pipes

    International Nuclear Information System (INIS)

    Wong, K.-L.; Hsien, T.-L.; Chen, W.-L.; Yu, S.-J.

    2008-01-01

    This study is to prove that two-dimensional steady state heat transfer problems of composite circular pipes cannot be appropriately solved by the conventional one-dimensional parallel thermal resistance circuits (PTRC) model because its interface temperatures are not unique. Thus, the PTRC model is definitely different from its conventional recognized analogy, parallel electrical resistance circuits (PERC) model, which has unique node electric voltages. Two typical composite circular pipe examples are solved by CFD software, and the numerical results are compared with those obtained by the PTRC model. This shows that the PTRC model generates large error. Thus, this conventional model, introduced in most heat transfer text books, cannot be applied to two-dimensional composite circular pipes. On the contrary, an alternative one-dimensional separately series thermal resistance circuit (SSTRC) model is proposed and applied to a two-dimensional composite circular pipe with isothermal boundaries, and acceptable results are returned

  7. Template-based preparation of free-standing semiconducting polymeric nanorod arrays on conductive substrates.

    Science.gov (United States)

    Haberkorn, Niko; Weber, Stefan A L; Berger, Rüdiger; Theato, Patrick

    2010-06-01

    We describe the synthesis and characterization of a cross-linkable siloxane-derivatized tetraphenylbenzidine (DTMS-TPD), which was used for the fabrication of semiconducting highly ordered nanorod arrays on conductive indium tin oxide or Pt-coated substrates. The stepwise process allow fabricating of macroscopic areas of well-ordered free-standing nanorod arrays, which feature a high resistance against organic solvents, semiconducting properties and a good adhesion to the substrate. Thin films of the TPD derivate with good hole-conducting properties could be prepared by cross-linking and covalently attaching to hydroxylated substrates utilizing an initiator-free thermal curing at 160 degrees C. The nanorod arrays composed of cross-linked DTMS-TPD were fabricated by an anodic aluminum oxide (AAO) template approach. Furthermore, the nanorod arrays were investigated by a recently introduced method allowing to probe local conductivity on fragile structures. It revealed that more than 98% of the nanorods exhibit electrical conductance and consequently feature a good electrical contact to the substrate. The prepared nanorod arrays have the potential to find application in the fabrication of multilayered device architectures for building well-ordered bulk-heterojunction solar cells.

  8. Development of unidirectional C/C composite with high thermal conductivity and its application to plasma facing materials

    International Nuclear Information System (INIS)

    Ioki, Kimihiro; Onozuka, Masanori; Ikeda, Takeshi; Akiba, Masato.

    1994-01-01

    Unidirectional C/C composite named 'MFC-1' with high conductivity was developed, and full-scale armor tiles were fabricated. The thermal conductivity in the direction perpendicular to the plasma-side surface is more than 300-500 W/m·degC, which is higher than those of other C/C composites ever made, even superior to that of pyrolytic carbon. It was shown by high heat load tests done using an electron beam test facility that the unidirectional C/C composite was very resistant against both surface erosion as well as severe thermal shock. The 'MFC-1' was successfully brazed to copper substrate, and its high thermal shock resistance was observed in heat load tests (20 MW/m 2 , 3s, not cooled). A functionally gradient material has been also developed as compliant layer for the MFC-1 bonded to copper. (author)

  9. Thermal and chemical resistance of Lactobacillus casei and Lactobacillus paracasei bacteriophages.

    Science.gov (United States)

    Capra, M L; Quiberoni, A; Reinheimer, J A

    2004-01-01

    The survival of two collection Lactobacillus casei and L. paracasei bacteriophages when subjected to thermal and chemical treatments was investigated. Thermal resistance was evaluated by heating phage suspensions at 63, 72 and 90 degrees C in three different media [Tris-magnesium gelatin (TMG) buffer: 10 mmol l(-1) Tris-Cl, 10 mmol l(-1) MgSO(4) and 0.1% w/v gelatin; Man Rogosa Sharpe (MRS) broth and reconstituted nonfat dry skim milk (RSM)]. A marked heat sensitivity was evident in both phages, as 15 min at 72 degrees C was enough to completely inactivate (6 log(10) reduction) them. No clear influence was demonstrated by the suspension media. The phages also showed similar resistance to biocides. Peracetic acid and sodium hypochlorite (800 ppm) were the most effective ones, destroying the phages within 5 min. Concentrations of 75 and 100% ethanol were not suitable to inactivate phage particles even after 45 min. Isopropanol did not show an effect on phage viability. The data obtained in this work are important to design more effective control procedures in order to inactivate phages in dairy plants and laboratories. This work will contribute to enhance the background knowledge about phages of probiotic bacteria.

  10. Adhesion, resistivity and structural, optical properties of molybdenum on steel sheet coated with barrier layer done by sol–gel for CIGS solar cells

    Energy Technology Data Exchange (ETDEWEB)

    Amouzou, Dodji, E-mail: dodji.amouzou@fundp.ac.be [Research Centre in Physics of Matter and Radiation (PMR), University of Namur (FUNDP), Rue de Bruxelles 61, 5000 Namur (Belgium); Dumont, Jacques [Research Centre in Physics of Matter and Radiation (PMR), University of Namur (FUNDP), Rue de Bruxelles 61, 5000 Namur (Belgium); Fourdrinier, Lionel; Richir, Jean-Baptiste; Maseri, Fabrizio [CRM-Group, Boulevard de Colonster, B 57, 4000 Liège (Belgium); Sporken, Robert [Research Centre in Physics of Matter and Radiation (PMR), University of Namur (FUNDP), Rue de Bruxelles 61, 5000 Namur (Belgium)

    2013-03-01

    Molybdenum films are investigated on stainless steel substrates coated with polysilazane based sol–gel and SiO{sub x} layers for flexible CIGS solar cell applications. Thermal stability of the multilayer has been studied. The thickness of polysilazane films are significantly reduced (17%) after heat treatment suggesting a thermal degradation. Four different microstructures were found for Mo films by varying argon total pressure from 2.6 × 10{sup −1} Pa to 2.6 Pa. It was shown that continuous films, low sheet resistance (0.5 Ω/□) and well facetted grains can be achieved when Mo films are deposited on heated substrates at homologous temperature, T of 0.2. - Highlights: ► Steel sheet is functionalized for Cu[Inx,Ga(1 − x)Se2] solar cells. ► Varying deposition pressure impacts the microstructure of Mo films. ► High thermal stability of the sol gel based barrier layer has been investigated. ► Low sheet resistance and continuous Mo films have been obtained at 550°C. ► Thermal stability of functionalized steel sheets at 550°C has been investigated.

  11. Deposition of the low resistive ITO-films by means of reactive magnetron sputtering of the In/Sn target on the cold substrate

    Science.gov (United States)

    Zhidik, Y. S.; Troyan, P. E.; Baturina, E. V.; Korzhenko, D. V.; Yurjev, Y. N.

    2016-06-01

    Detailed information on the deposition technology of the low-resistive ITO-films in oxygen-containing media by magnetron reactive sputtering from the In(90%)/Sn(10%) target on the cold substrate is given. Developed technology allows deposition ITO-films with sheet resistance 2-3 Ω/□, transparency higher than 90%. Developed technology is notable for high reproducibility of results and is compatible with production technology of semiconductor devices of optoelectronics.

  12. Electrostatic Assembly Preparation of High-Toughness Zirconium Diboride-Based Ceramic Composites with Enhanced Thermal Shock Resistance Performance.

    Science.gov (United States)

    Zhang, Baoxi; Zhang, Xinghong; Hong, Changqing; Qiu, Yunfeng; Zhang, Jia; Han, Jiecai; Hu, PingAn

    2016-05-11

    The central problem of using ceramic as a structural material is its brittleness, which associated with rigid covalent or ionic bonds. Whiskers or fibers of strong ceramics such as silicon carbide (SiC) or silicon nitride (Si3N4) are widely embedded in a ceramic matrix to improve the strength and toughness. The incorporation of these insulating fillers can impede the thermal flow in ceramic matrix, thus decrease its thermal shock resistance that is required in some practical applications. Here we demonstrate that the toughness and thermal shock resistance of zirconium diboride (ZrB2)/SiC composites can be improved simultaneously by introducing graphene into composites via electrostatic assembly and subsequent sintering treatment. The incorporated graphene creates weak interfaces of grain boundaries (GBs) and optimal thermal conductance paths inside composites. In comparison to pristine ZrB2-SiC composites, the toughness of (2.0%) ZrB2-SiC/graphene composites exhibited a 61% increasing (from 4.3 to 6.93 MPa·m(1/2)) after spark plasma sintering (SPS); the retained strength after thermal shock increased as high as 74.8% at 400 °C and 304.4% at 500 °C. Present work presents an important guideline for producing high-toughness ceramic-based composites with enhanced thermal shock properties.

  13. Thermal characterization of intumescent fire retardant paints

    International Nuclear Information System (INIS)

    Calabrese, L; Bozzoli, F; Rainieri, S; Pagliarini, G; Bochicchio, G; Tessadri, B

    2014-01-01

    Intumescent coatings are now the dominant passive fire protection materials used in industrial and commercial buildings. The coatings, which usually are composed of inorganic components contained in a polymer matrix, are inert at low temperatures and at higher temperatures, they expand and degrade to provide a charred layer of low conductivity materials. The charred layer, which acts as thermal barrier, will prevent heat transfer to underlying substrate. The thermal properties of intumescent paints are often unknown and difficult to be estimated since they vary significantly during the expansion process; for this reason the fire resistance validation of a commercial coatings is based on expensive, large-scale methods where each commercial coating-beam configuration has to be tested one by one. Adopting, instead, approaches based on a thermal modelling of the intumescent paint coating could provide an helpful tool to make easier the test procedure and to support the design of fire resistant structures as well. The present investigation is focused on the assessment of a methodology intended to the restoration of the equivalent thermal conductivity of the intumescent layer produced under the action of a cone calorimetric apparatus. The estimation procedure is based on the inverse heat conduction problem approach, where the temperature values measured at some locations inside the layer during the expansion process are used as input known data. The results point out that the equivalent thermal conductivity reached by the intumescent material at the end of the expansion process significantly depends on the temperature while the initial thickness of the paint does not seem to have much effect

  14. Thermal characterization of intumescent fire retardant paints

    Science.gov (United States)

    Calabrese, L.; Bozzoli, F.; Bochicchio, G.; Tessadri, B.; Rainieri, S.; Pagliarini, G.

    2014-11-01

    Intumescent coatings are now the dominant passive fire protection materials used in industrial and commercial buildings. The coatings, which usually are composed of inorganic components contained in a polymer matrix, are inert at low temperatures and at higher temperatures, they expand and degrade to provide a charred layer of low conductivity materials. The charred layer, which acts as thermal barrier, will prevent heat transfer to underlying substrate. The thermal properties of intumescent paints are often unknown and difficult to be estimated since they vary significantly during the expansion process; for this reason the fire resistance validation of a commercial coatings is based on expensive, large-scale methods where each commercial coating-beam configuration has to be tested one by one. Adopting, instead, approaches based on a thermal modelling of the intumescent paint coating could provide an helpful tool to make easier the test procedure and to support the design of fire resistant structures as well. The present investigation is focused on the assessment of a methodology intended to the restoration of the equivalent thermal conductivity of the intumescent layer produced under the action of a cone calorimetric apparatus. The estimation procedure is based on the inverse heat conduction problem approach, where the temperature values measured at some locations inside the layer during the expansion process are used as input known data. The results point out that the equivalent thermal conductivity reached by the intumescent material at the end of the expansion process significantly depends on the temperature while the initial thickness of the paint does not seem to have much effect.

  15. Removal of antibiotics and antibiotic resistance genes from domestic sewage by constructed wetlands: Optimization of wetland substrates and hydraulic loading.

    Science.gov (United States)

    Chen, Jun; Wei, Xiao-Dong; Liu, You-Sheng; Ying, Guang-Guo; Liu, Shuang-Shuang; He, Liang-Ying; Su, Hao-Chang; Hu, Li-Xin; Chen, Fan-Rong; Yang, Yong-Qiang

    2016-09-15

    This study aimed to assess removal potential of antibiotics and antibiotic resistance genes (ARGs) in raw domestic wastewater by various mesocosm-scale horizontal subsurface-flow constructed wetlands (CWs) planted Cyperus alternifolius L. with different design parameters. Twelve CWs with three hydraulic loading rates (HLR 10, 20 and 30cm/day) and four substrates (oyster shell, zeolite, medical stone and ceramic) were set up in order to select the best optimized wetland. The result showed that 7 target antibiotics compounds including erythromycin-H2O, lincomycin, monensin, ofloxacin, sulfamerazine, sulfamethazine and novobiocin were detected, and all selected 18 genes (three sulfonamide resistance genes (sul1, sul2 and sul3), four tetracycline resistance genes (tetG, tetM, tetO and tetX), two macrolide resistance genes (ermB and ermC), three quinolone resistance genes (qnrB, qnrD and qnrS) and four chloramphenicol resistance genes (cmlA, fexA, fexB and floR)) and two integrase genes (int1 and int2) were positively detected in the domestic wastewaters. The aqueous removal rates of the total antibiotics ranged from17.9 to 98.5%, while those for the total ARGs varied between 50.0 and 85.8% by the mesocosm-scale CWs. After considering their aqueous removal rates in combination with their mass removals, the CW with zeolite as the substrate and HLR of 20cm/day was selected as the best choice. Combined chemical and biological analyses indicate that both microbial degradation and physical sorption processes were responsible for the fate of antibiotics and ARGs in the wetlands. The findings from this study suggest constructed wetlands could be a promising technology for the removal of emerging contaminants such as antibiotics and ARGs in domestic wastewater. Copyright © 2015 Elsevier B.V. All rights reserved.

  16. Point mutations in a nucleoside transporter gene from Leishmania donovani confer drug resistance and alter substrate selectivity

    OpenAIRE

    Vasudevan, Gayatri; Ullman, Buddy; Landfear, Scott M.

    2001-01-01

    Leishmania parasites lack a purine biosynthetic pathway and depend on surface nucleoside and nucleobase transporters to provide them with host purines. Leishmania donovani possess two closely related genes that encode high affinity adenosine-pyrimidine nucleoside transporters LdNT1.1 and LdNT1.2 and that transport the toxic adenosine analog tubercidin in addition to the natural substrates. In this study, we have characterized a drug-resistant clonal mutant of L. do...

  17. Low-shrink airfield cement concrete with respect to thermal resistance

    Directory of Open Access Journals (Sweden)

    Linek Małgorzata

    2017-01-01

    Full Text Available The paper presents theoretical background to the occurrence and propagation of imposed thermal load deep inside the structure of airfield pavement. The standard composition of low-shrink cement concrete intended for airfield pavements was presented. The influence of recurring temperature changes on the extent of shrinkage deformations was assessed. The obtained lab test results, combined with observations and analysis of changes of the hardened concrete microstructure, allowed the authors to draw conclusions. It was proven that the suggested concrete mix composition makes it possible to obtain the concrete type of better developed internal microstructure. More micro air voids and reduced distance between the voids were proven, which provides increased frost resistance of concrete. The change of size, structure and quantity of the hydration products in the cement matrix and better developed contact sections resulted in the improvement of the mechanical parameters of hardened concrete. Low-shrink concrete in all analysed cases proved to have increased resistance to the variable environmental conditions. Increased concrete resistance is identified through reduced registered shrinkage deformations and growth of mechanical parameters of concrete. Low-shrink concrete used for airfield structure guarantees extended time of reliable pavement operation.

  18. Heterogeneity in induced thermal resistance of rat tumor cell clones

    International Nuclear Information System (INIS)

    Tomasovic, S.P.; Rosenblatt, P.L.; Heitzman, D.

    1983-01-01

    Four 13762NF rat mammary adenocarcinoma clones were examined for their survival response to heating under conditions that induced transient thermal resistance (thermotolerance). Clones MTC and MTF7 were isolated from the subcutaneous locally growing tumor, whereas clones MTLn2 and MTLn3 were derived from spontaneous lung metastases. There was heterogeneity among these clones in thermotolerance induced by either fractionated 45 0 C or continuous 42 0 C heating, but the order of sensitivity was not necessarily the same. The clones developed thermal resistance at different rates and to different degrees within the same time intervals. There was heterogeneity between clones isolated from within either the primary site or metastatic lesions. However, clones derived from metastatic foci did not intrinsically acquire more or less thermotolerance to fractionated 45 0 C or continuous 42 0 C heating than did clones from the primary tumor. Further, there was no apparent relationship between any phenotypic properties that conferred more or less thermotolerance in vitro and any phenotypic properties that conferred enhanced metastatic success of these same clones by spontaneous (subcutaneous) or experimental (intravenous) routes in vivo. These tumor clones also differ in their karyotype, metastatic potential, cell surface features, sensitivity to x-irradiation and drugs, and ability to repair sublethal radiation damage. These results provide further credence to the concept that inherent heterogeneity within tumors may be as important in therapeutic success as other known modifiers of outcome such as site and treatment heterogeneity

  19. Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate

    Directory of Open Access Journals (Sweden)

    Masaru Ishizuka

    2011-01-01

    Full Text Available In recent years, there is a growing demand to have smaller and lighter electronic circuits which have greater complexity, multifunctionality, and reliability. High-density multichip packaging technology has been used in order to meet these requirements. The higher the density scale is, the larger the power dissipation per unit area becomes. Therefore, in the designing process, it has become very important to carry out the thermal analysis. However, the heat transport model in multichip modules is very complex, and its treatment is tedious and time consuming. This paper describes an application of the thermal network method to the transient thermal analysis of multichip modules and proposes a simple model for the thermal analysis of multichip modules as a preliminary thermal design tool. On the basis of the result of transient thermal analysis, the validity of the thermal network method and the simple thermal analysis model is confirmed.

  20. The inaccuracy of conventional one-dimensional parallel thermal resistance circuit model for two-dimensional composite walls

    International Nuclear Information System (INIS)

    Wong, K.-L.; Hsien, T.-L.; Hsiao, M.-C.; Chen, W.-L.; Lin, K.-C.

    2008-01-01

    This investigation is to show that two-dimensional steady state heat transfer problems of composite walls should not be solved by the conventionally one-dimensional parallel thermal resistance circuits (PTRC) model because the interface temperatures are not unique. Thus PTRC model cannot be used like its conventional recognized analogy, parallel electrical resistance circuits (PERC) model which has the unique node electric voltage. Two typical composite wall examples, solved by CFD software, are used to demonstrate the incorrectness. The numerical results are compared with those obtained by PTRC model, and very large differences are observed between their results. This proves that the application of conventional heat transfer PTRC model to two-dimensional composite walls, introduced in most heat transfer text book, is totally incorrect. An alternative one-dimensional separately series thermal resistance circuit (SSTRC) model is proposed and applied to the two-dimensional composite walls with isothermal boundaries. Results with acceptable accuracy can be obtained by the new model

  1. Infrared photothermal imaging of trace explosives on relevant substrates

    Science.gov (United States)

    Kendziora, Christopher A.; Furstenberg, Robert; Papantonakis, Michael; Nguyen, Viet; Borchert, James; Byers, Jeff; McGill, R. Andrew

    2013-06-01

    We are developing a technique for the stand-off detection of trace explosives on relevant substrate surfaces using photo-thermal infrared (IR) imaging spectroscopy (PT-IRIS). This approach leverages one or more compact IR quantum cascade lasers, tuned to strong absorption bands in the analytes and directed to illuminate an area on a surface of interest. An IR focal plane array is used to image the surface and detect small increases in thermal emission upon laser illumination. The PT-IRIS signal is processed as a hyperspectral image cube comprised of spatial, spectral and temporal dimensions as vectors within a detection algorithm. The ability to detect trace analytes on relevant substrates is critical for stand-off applications, but is complicated by the optical and thermal analyte/substrate interactions. This manuscript describes recent PT-IRIS experimental results and analysis for traces of RDX, TNT, ammonium nitrate (AN) and sucrose on relevant substrates (steel, polyethylene, glass and painted steel panels). We demonstrate that these analytes can be detected on these substrates at relevant surface mass loadings (10 μg/cm2 to 100 μg/cm2) even at the single pixel level.

  2. An improved electrical and thermal model of a microbolometer for electronic circuit simulation

    Science.gov (United States)

    Würfel, D.; Vogt, H.

    2012-09-01

    The need for uncooled infrared focal plane arrays (IRFPA) for imaging systems has increased since the beginning of the nineties. Examples for the application of IRFPAs are thermography, pedestrian detection for automotives, fire fighting, and infrared spectroscopy. It is very important to have a correct electro-optical model for the simulation of the microbolometer during the development of the readout integrated circuit (ROIC) used for IRFPAs. The microbolometer as the sensing element absorbs infrared radiation which leads to a change of its temperature due to a very good thermal insulation. In conjunction with a high temperature coefficient of resistance (TCR) of the sensing material (typical vanadium oxide or amorphous silicon) this temperature change results in a change of the electrical resistance. During readout, electrical power is dissipated in the microbolometer, which increases the temperature continuously. The standard model for the electro-optical simulation of a microbolometer includes the radiation emitted by an observed blackbody, radiation emitted by the substrate, radiation emitted by the microbolometer itself to the surrounding, a heat loss through the legs which connect the microbolometer electrically and mechanically to the substrate, and the electrical power dissipation during readout of the microbolometer (Wood, 1997). The improved model presented in this paper takes a closer look on additional radiation effects in a real IR camera system, for example the radiation emitted by the casing and the lens. The proposed model will consider that some parts of the radiation that is reflected from the casing and the substrate is also absorbed by the microbolometer. Finally, the proposed model will include that some fraction of the radiation is transmitted through the microbolometer at first and then absorbed after the reflection at the surface of the substrate. Compared to the standard model temperature and resistance of the microbolometer can be

  3. Comparison of inkjet-printed silver conductors on different microsystem substrates

    Science.gov (United States)

    Kruger, Jené; Bezuidenhout, Petroné H.; Joubert, Trudi-Heleen

    2016-02-01

    Applications for diagnostic and environmental point-of-need require processes and building blocks to add smart features to disposable biosensors on low-cost substrates. A novel method for producing such biosensors is printing electronics using additive technologies. This work contributes to the toolbox of processes, materials and components for printed electronics manufacturing - as well as rapid prototyping - of circuits. Printing protocols were developed to facilitate successful inkjet printing of nanosilver ink (Harima NPS-JL) onto different microsystem substrates using a functional printer (Dimatix DMP-3281). Photo paper is a standard inkjet substrate, which were compared with glass, polycarbonate (PC), plastic projector transparency foil, and polydimethylsiloxane (PDMS). Comparison attributes include physical and electrical properties. The layout design comprised dogbone elements of 8 mm length, and widths varying between 100 μm and 2 mm. All printed features were thermally cured for 1 hour at 120 °C. The physical characteristics were measured with a laser scanning microscope (Zeiss LSM-5) to determine the width, thickness and surface roughness of the printed features. An LCR meter (GW-Instek 8110) was used to measure the printed structures' electrical characteristics (resistance, capacitance and inductance). A lumped element model and layout design rules were extracted to assist in standardized design procedures. The model incorporates prediction of the bandwidth attainable with these structures. The layer thickness on all substrates is larger than the 1 μm on photo paper, and varies between 1.6 μm (PC) and 7 μm (PDMS). The spreading for PDMS is similar to photo paper, but since for the other substrates it is between 5 (glass) and 10 (PC) times larger than for photo paper, the layout design rules require large spacing, leading to larger area networks. Electrical probing on the PDMS is not consistent and results are inconclusive. For the other substrates

  4. Electrical resistivity and thermal conductivity of liquid aluminum in the two-temperature state

    Science.gov (United States)

    Petrov, Yu V.; Inogamov, N. A.; Mokshin, A. V.; Galimzyanov, B. N.

    2018-01-01

    The electrical resistivity and thermal conductivity of liquid aluminum in the two-temperature state is calculated by using the relaxation time approach and structural factor of ions obtained by molecular dynamics simulation. Resistivity witin the Ziman-Evans approach is also considered to be higher than in the approach with previously calculated conductivity via the relaxation time. Calculations based on the construction of the ion structural factor through the classical molecular dynamics and kinetic equation for electrons are more economical in terms of computing resources and give results close to the Kubo-Greenwood with the quantum molecular dynamics calculations.

  5. The Effect of Novolac and Graphite Polycrystal on the Acetone Penetration and Thermal Resistance of Nanocomposites Based on Nitrile Rubber

    Directory of Open Access Journals (Sweden)

    Rasool Mahboudi

    2015-03-01

    Full Text Available Developments of high diffusive environments in coincidence with emerging fluids with strong ability to destroy polymeric systems have resulted in rapid deformation and destruction of polymeric parts when in contact with such aggressive environments. Therefore, nowadays, there is a great need to develop highly resistant materials towards aggressive chemicals and harsh conditions. In this paper the effect of graphite polycrystal powders and novolac type phenolic resin has been experimentally studied towards acetone diffusion and thermal stability of polyacrylonitrile butadiene rubber/novolac/graphite polycrystal nanocomposites. The results obtained from dynamic mechanical thermal analysis (DMTA and swelling in acetone showed that after 32 h samples reached to 94.2% of final swelling state. By using Avrami equation and swelling experimental data, the functionality of Ln(m/m0 to novolac and graphite polycrystal weight fraction and test duration time were evaluated. This theoretical equation evaluated and predicted the amount of Ln(m/m0 with 5.92% error after 32 h. Increases in graphite polycrystal content were followed by decreases in diffusion of acetone and modulus, before glass transition temperature, and increased thermal stability and thermal resistance of the nanocomposites. Increases in novolac content by 35 wt%, decreased glass transition temperature, thermal stability and thermal resistance of the nanocomposites. In nanocomposite, containing 45 wt% of novolac, dynamic mechanical thermal analysis (DMTA data and scanning electron microscope (SEM images showed phase separation of thermoset and elastomer in the nanocomposite blend.

  6. Thermal strain measurement of EAST W/Cu divertor structure using electric resistance strain gauges

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Xingli [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, 230031 (China); Science Island Branch of Graduate School, University of Science & Technology of China, Hefei, 230031 (China); Wang, Wanjing, E-mail: wjwang@ipp.ac.cn [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, 230031 (China); Wang, Jichao [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, 230031 (China); Wei, Ran; Sun, Zhaoxuan [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, 230031 (China); Science Island Branch of Graduate School, University of Science & Technology of China, Hefei, 230031 (China); Li, Qiang; Xie, Chunyi [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, 230031 (China); Chen, Hong-En; Wang, Kaiqiang; Wu, Lei; Chen, Zhenmao [State Key Lab for Strength and Vibration of Mechanical Structures, Xi’an Jiaotong University (China); Luo, Guang-Nan [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, 230031 (China); Science Island Branch of Graduate School, University of Science & Technology of China, Hefei, 230031 (China); Hefei Center for Physical Science and Technology, Hefei, 230022 (China); Hefei Science Center of Chinese Academy of Sciences, Hefei, 230027 (China)

    2016-12-15

    Highlights: • To understand the service behavior of W/Cu divertor, an electrical resistance strain gauge system had been introduced in a thermal strain measurement experiment. • The measurement system successfully finished the experiment and obtained valued thermal strain data. • Two thermomechanical analyses had also been carried out and compared with the measurement results. • Experiment results corresponded well to simulations and threw a light upon the failure of W/Cu divertor in the previous baking tests. - Abstract: W/Cu divertor has complex structure and faces extreme work environment in EAST Tokamak device. To measure its thermal strain shall be a valued way to understand its service behavior and then optimize its design and manufacturing process. This work presents a preliminary study on measuring thermal strain of EAST W/Cu divertor structure using electric resistance strain gauges. Eight gauges had been used in the experiment and the heating temperature had been set to 230 °C with respect to the work temperature. To realize the measuring experiment, an appropriate fixing method of gauges in divertor narrow spaces had been taken and tested, which could not only withstand high temperature but also had no damage to the divertor sample. The measurement results were that three gauges showed positive strain while other three showed negative strain after having been compensated, which corresponded to tensile stress and compressed stress respectively. Two thermomechanical simulations had also been carried out and used for comparing with the experiment.

  7. Three-dimensional micro assembly of a hinged nickel micro device by magnetic lifting and micro resistance welding

    International Nuclear Information System (INIS)

    Chang, Chun-Wei; Hsu, Wensyang

    2009-01-01

    The three-dimensional micro assembly of hinged nickel micro devices by magnetic lifting and micro resistance welding is proposed here. By an electroplating-based surface machining process, the released nickel structure with the hinge mechanism can be fabricated. Lifting of the released micro structure to different tilted angles is accomplished by controlling the positions of a magnet beneath the device. An in situ electro-thermal actuator is used here to provide the pressing force in micro resistance welding for immobilizing the tilted structure. The proposed technique is shown to immobilize micro devices at controlled angles ranging from 14° to 90° with respect to the substrate. Design parameters such as the electro-thermal actuator and welding beam width are also investigated. It is found that there is a trade-off in beam width design between large contact pressure and low thermal deformation. Different dominated effects from resistivity enhancement and contact area enlargement during the welding process are also observed in the dynamic resistance curves. Finally, a lifted and immobilized electro-thermal bent-beam actuator is shown to displace upward about 27.7 µm with 0.56 W power input to demonstrate the capability of electrical transmission at welded joints by the proposed 3D micro assembly technique

  8. Novel transparent high-performance AgNWs/ZnO electrodes prepared on unconventional substrates with 3D structured surfaces

    Science.gov (United States)

    Lan, Wei; Yang, Zhiwei; Zhang, Yue; Wei, Yupeng; Wang, Pengxiang; Abas, Asim; Tang, Guomei; Zhang, Xuetao; Wang, Junya; Xie, Erqing

    2018-03-01

    With the development of optoelectronic devices with three-dimensional (3D) structured surfaces, transparent electrodes that can be deposited on non-plane substrates have become increasingly important. In this paper, novel transparent silver nanowire (AgNWs)/ZnO film electrodes were uniformly prepared on treated 3D glass and PET substrates with a combination of spin-coating and heat-welding. The AgNWs/ZnO films show a transmittance of ∼88% and a sheet resistance of ∼10 Ω/sq. They are comparable with commercial ITO films. Furthermore, only a small in-plane resistance variation of ∼1 Ω/sq was measured using four-point probe mapping in films with a 10 cm × 10 cm area. These results confirm that these novel film electrodes are very uniform. Both electrical resistance and optical transmittance of the films remain mostly intact after 1000 bending cycles and tape peeling-tests with 10 cycles. The films show high thermal stability for more than one month at 80 °C. The strategy provides a new route for the design and fabrication of optoelectronic devices with 3D structured surfaces.

  9. High thermal shock resistance of the hot rolled and swaged bulk W–ZrC alloys

    Energy Technology Data Exchange (ETDEWEB)

    Xie, Z.M.; Liu, R.; Miao, S.; Yang, X.D. [Key Laboratory of Materials Physics, Institute of Solid State Physics, Hefei Science Center, Chinese Academy of Sciences, Hefei 230031 (China); University of Science and Technology of China, Hefei 230026 (China); Zhang, T., E-mail: zhangtao@issp.ac.cn [Key Laboratory of Materials Physics, Institute of Solid State Physics, Hefei Science Center, Chinese Academy of Sciences, Hefei 230031 (China); University of Science and Technology of China, Hefei 230026 (China); Fang, Q.F.; Wang, X.P. [Key Laboratory of Materials Physics, Institute of Solid State Physics, Hefei Science Center, Chinese Academy of Sciences, Hefei 230031 (China); University of Science and Technology of China, Hefei 230026 (China); Liu, C.S., E-mail: csliu@issp.ac.cn [Key Laboratory of Materials Physics, Institute of Solid State Physics, Hefei Science Center, Chinese Academy of Sciences, Hefei 230031 (China); University of Science and Technology of China, Hefei 230026 (China); Lian, Y.Y. [Southwestern Institute of Physics, Chengdu (China); Liu, X., E-mail: xliu@swip.ac.cn [Southwestern Institute of Physics, Chengdu (China); Luo, G.N. [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei 230031 (China)

    2016-02-15

    The thermal shock (single shot) resistance and mechanical properties of the W–0.5wt% ZrC (WZC) alloys manufactured by ordinary sintering followed by swaging or rolling process were investigated. No cracks or surface melting were detected on the surface of the rolled WZC alloy plates after thermal shock at a power density of 0.66 GW/m{sup 2} for 5 ms, while primary intergranular cracks appear on the surface of the swaged WZC samples after thermal shock at a power density of 0.44 GW/m{sup 2} for 5 ms. Three point bending tests indicate that the rolled WZC alloy has a flexural strength of ∼2.4 GPa and a total strain of 1.8% at room temperature, which are 100% and 260% higher than those of the swaged WZC, respectively. The fracture energy density of the rolled WZC alloy is 3.23 × 10{sup 7} J/m{sup 3}, about 10 times higher than that of the swaged WZC (2.9 × 10{sup 6} J/m{sup 3}). The high thermal shock resistance of the rolled WZC alloys can be ascribed to their extraordinary ductility and plasticity. - Graphical abstract: (Left panel) surface morphology observed by optical microscope after a single pulse for 5 ms with various absorbed power densities at RT on the rolled WZC. (Right panel) curves of flexural stress versus strain at RT (a) and the calculated fracture energy (b) for the swaged WZC and rolled WZC alloys. - Highlights: • No cracks or surface melting were detected on the rolled WZC alloy samples after thermal shock at 0.66 GW/m{sup 2} for 5 ms. • Hot rolled WZC alloy plates exhibit a flexural strength of 2.4 GPa and a strain of 1.8% at RT. • The fracture energy of the rolled WZC alloy is 3.23 × 10{sup 7} J/m{sup 3} at RT, about 10 times higher than that of the swaged WZC. • A detailed analysis of the relationships between the mechanical properties and the thermal shock resistance is given.

  10. Calcium-Magnesium-Aluminosilicate (CMAS) Infiltration and Cyclic Degradations of Thermal and Environmental Barrier Coatings in Thermal Gradients

    Science.gov (United States)

    Zhu, Dongming; Harder, Bryan; Smialek, Jim; Miller, Robert A.

    2014-01-01

    In a continuing effort to develop higher temperature capable turbine thermal barrier and environmental barrier coating systems, Calcium-Magnesium-Aluminosilicate (CMAS) resistance of the advanced coating systems needs to be evaluated and improved. This paper highlights some of NASA past high heat flux testing approaches for turbine thermal and environmental barrier coatings assessments in CMAS environments. One of our current emphases has been focused on the thermal barrier - environmental barrier coating composition and testing developments. The effort has included the CMAS infiltrations in high temperature and high heat flux turbine engine like conditions using advanced laser high heat flux rigs, and subsequently degradation studies in laser heat flux thermal gradient cyclic and isothermal furnace cyclic testing conditions. These heat flux CMAS infiltration and related coating durability testing are essential where appropriate CMAS melting, infiltration and coating-substrate temperature exposure temperature controls can be achieved, thus helping quantify the CMAS-coating interaction and degradation mechanisms. The CMAS work is also playing a critical role in advanced coating developments, by developing laboratory coating durability assessment methodologies in simulated turbine engine conditions and helping establish CMAS test standards in laboratory environments.

  11. Light alloys as substrate material for bipolar plates; Leichtmetall-Legierungen als Substrat fuer Bipolarplatten

    Energy Technology Data Exchange (ETDEWEB)

    Schicke, R. [PSFU GmbH, Wernigerode (Germany)

    2008-07-01

    Light alloys as substrate material for bipolar plates in fuel cells offer a number of advantages compared to stainless steel sheets. First, the specific weight is smaller, costs are lower, but also bulk properties like thermal and electric conductivities are much better than in the case of stainless steel. Regarding graphite polymer composite materials, the electric conductivity of light alloys again is much higher leading to a considerably lower internal resistance of the cells. Metal sheets, in general, are more attractive with respect to building up compact stacks with high power densities since metal sheets can be produced easily down to thicknesses of around 0.1 mm, whereby graphite composite materials most often have a thickness of at least around 2 mm. In addition, the economics of using light alloys as bipolar plate material is advantageous also for small and medium quantities of production (for instance making use of photochemical etching), but also for high volume production where both conventional techniques like stamping and also more advanced processes like hydroforming can be employed. A major challenge is the identification and technological control and improvement of surface modification / coating processes which lead to low ohmic contact resistances and a good corrosion protection under the electrochemical conditions within a fuel cell environment. Different coating technologies and the characteristics of several coatings will be discussed. (orig.)

  12. Thermal analysis of epidermal electronic devices integrated with human skin considering the effects of interfacial thermal resistance

    Science.gov (United States)

    Li, Yuhang; Zhang, Jianpeng; Xing, Yufeng; Song, Jizhou

    2018-05-01

    Epidermal electronic devices (EEDs) have similar mechanical properties as those of human skin such that they can be integrated with human skin for potential applications in monitoring of human vital signs for diagnostic, therapeutic or surgical functions. Thermal management is critical for EEDs in these applications since excessive heating may cause discomfort. Comprehensive analytical studies, finite element analysis and experiments are carried out to study the effects of interfacial thermal resistance between EEDs and human skin on thermal properties of the EED/skin system in this paper. The coupling between the Fourier heat transfer in EEDs and the bio-heat transfer in human skin is accounted in the analytical model based on the transfer matrix method to give accurate predictions on temperatures, which agree well with finite element analysis and experimental measurements. It is shown that the maximum temperature increase of the EED for the case of imperfect bonding between EED and skin is much higher than that of perfect bonding. These results may help the design of EEDs in bi-integrated applications and suggest a valuable route to evaluate the bonding condition between EEDs and biological tissues.

  13. Anisotropic Thermal Diffusivities of Plasma-Sprayed Thermal Barrier Coatings

    Science.gov (United States)

    Akoshima, Megumi; Takahashi, Satoru

    2017-09-01

    Thermal barrier coatings (TBCs) are used to shield the blades of gas turbines from heat and wear. There is a pressing need to evaluate the thermal conductivity of TBCs in the thermal design of advanced gas turbines with high energy efficiency. These TBCs consist of a ceramic-based top coat and a bond coat on a superalloy substrate. Usually, the focus is on the thermal conductivity in the thickness direction of the TBC because heat tends to diffuse from the surface of the top coat to the substrate. However, the in-plane thermal conductivity is also important in the thermal design of gas turbines because the temperature distribution within the turbine cannot be ignored. Accordingly, a method is developed in this study for measuring the in-plane thermal diffusivity of the top coat. Yttria-stabilized zirconia top coats are prepared by thermal spraying under different conditions. The in-plane and cross-plane thermal diffusivities of the top coats are measured by the flash method to investigate the anisotropy of thermal conduction in a TBC. It is found that the in-plane thermal diffusivity is higher than the cross-plane one for each top coat and that the top coats have significantly anisotropic thermal diffusivity. The cross-sectional and in-plane microstructures of the top coats are observed, from which their porosities are evaluated. The thermal diffusivity and its anisotropy are discussed in detail in relation to microstructure and porosity.

  14. Electronic properties of thermally formed thin iron oxide films

    International Nuclear Information System (INIS)

    Wielant, J.; Goossens, V.; Hausbrand, R.; Terryn, H.

    2007-01-01

    The oxide layer, present between an organic coating and the substrate, guarantees adhesion of the coating and plays a determinating role in the delamination rate of the organic coating. The purpose of this study is to compare the resistive and semiconducting properties of thermal oxides formed on steel in two different atmospheres at 250 deg. C: an oxygen rich atmosphere, air, and an oxygen deficient atmosphere, N 2 . In N 2 , a magnetite layer grows while in air a duplex oxide film forms composed by an inner magnetite layer and a thin outer hematite scale. The heat treatment for different amounts of time at high temperature was used as method to sample the thickness variation and change in electronic and semiconducting properties of the thermal oxide layers. Firstly, linear voltammetric measurements were performed to have a first insight in the electrochemical behavior of the thermal oxides in a borate buffer solution. Electrochemical impedance spectroscopy in the same buffer combined with the Mott-Schottky analysis were used to determine the semiconducting properties of the thermal oxides. By spectroscopic ellipsometry (SE) and atomic force microscopy (AFM), respectively, the thickness and roughness of the oxide layers were determined supporting the physical interpretation of the voltammetric and EIS data. These measurements clearly showed that oxide layers with different constitution, oxide resistance, flatband potential and doping concentration can be grown by changing the atmosphere

  15. Thermal and optical properties of sol-gel and SU-8 resists

    Science.gov (United States)

    Suzuki, Toshiyuki; Morikawa, Junko; Hashimoto, Toshimasa; Buividas, Ričardas; Gervinskas, Gediminas; Paipulas, Domas; Malinauskas, Mangirdas; Mizeikis, Vygantas; Juodkazis, Saulius

    2012-03-01

    We report on a combined differential scanning calorimetric (DSC) and Raman scattering study of thermal polymerization of sol-gel organic-inorganic SZ2080 and SU-8 resists. In SZ2080, endothermic peak at 95°C signify drying of the resist and justifies the required pre-bake at around 100°C for 1-2 h for the best performance during femtosecond (fs-)direct laser writing. A strong exothermic peak at 140°C (under 2 K/min heating rate) completes polymerization of the resist. It is revealed that 1wt% of photoinitiators change Raman scattering intensity of SZ2080 and can contribute efficiently to heating and cross-linking of photo-polymers. In the case of SU-8, a 65°C DSC feature related to solvent evaporation was observed. The strongest changes in Raman spectrum occurs at a narrow 895 cm-1 band which is linked to polymerization. Raman scattering taken during DSC revealed spectral changes following the polymerization; an applicability of this method for monitoring photopolymerization induced by ultra-fast laser sources and feasibility of a laser-modulated calorimetry is discussed.

  16. High Thermal Conductivity and High Wear Resistance Tool Steels for cost-effective Hot Stamping Tools

    Science.gov (United States)

    Valls, I.; Hamasaiid, A.; Padré, A.

    2017-09-01

    In hot stamping/press hardening, in addition to its shaping function, the tool controls the cycle time, the quality of the stamped components through determining the cooling rate of the stamped blank, the production costs and the feasibility frontier for stamping a given component. During the stamping, heat is extracted from the stamped blank and transported through the tool to the cooling medium in the cooling lines. Hence, the tools’ thermal properties determine the cooling rate of the blank, the heat transport mechanism, stamping times and temperature distribution. The tool’s surface resistance to adhesive and abrasive wear is also an important cost factor, as it determines the tool durability and maintenance costs. Wear is influenced by many tool material parameters, such as the microstructure, composition, hardness level and distribution of strengthening phases, as well as the tool’s working temperature. A decade ago, Rovalma developed a hot work tool steel for hot stamping that features a thermal conductivity of more than double that of any conventional hot work tool steel. Since that time, many complimentary grades have been developed in order to provide tailored material solutions as a function of the production volume, degree of blank cooling and wear resistance requirements, tool geometries, tool manufacturing method, type and thickness of the blank material, etc. Recently, Rovalma has developed a new generation of high thermal conductivity, high wear resistance tool steel grades that enable the manufacture of cost effective tools for hot stamping to increase process productivity and reduce tool manufacturing costs and lead times. Both of these novel grades feature high wear resistance and high thermal conductivity to enhance tool durability and cut cycle times in the production process of hot stamped components. Furthermore, one of these new grades reduces tool manufacturing costs through low tool material cost and hardening through readily

  17. Effect of thermal aging on corrosion resistance of C-22 alloy in chloride solutions

    International Nuclear Information System (INIS)

    Carranza, Ricardo M.; Rodriguez, Martin A.

    2007-01-01

    Alloy 22 (N06022) belongs to the Ni-Cr-Mo family and it is highly resistant to localized corrosion. The anodic behavior of mill annealed (MA) and thermally aged (10 hours at 760 C degrees) Alloy 22 was studied in chloride solutions with different pH values at 90 C degrees. Thermal aging leads to a microstructure of full grain boundary precipitation of topologically closed packed (TCP) phases. Electrochemical tests included monitoring of open circuit potential, potentiodynamic polarization and electrochemical impedance spectroscopy. Assessment of general and localized (crevice) corrosion was performed. Re passivation potentials were obtained from cyclic potentiodynamic polarization tests. Results indicate that MA and TCP material show similar general corrosion rates and crevice corrosion resistance in the tested environments. MA and TCP specimens suffered general corrosion in an active state when tested in low pH chloride solutions. The grain structure of the alloy was revealed for MA material, while TCP material suffered a preferential attack at grain boundaries. (author)

  18. Cellulose Nanofiber Composite Substrates for Flexible Electronics

    Science.gov (United States)

    Ronald Sabo; Jung-Hun Seo; Zhenqiang Ma

    2012-01-01

    Flexible electronics have a large number of potential applications including malleable displays and wearable computers. The current research into high-speed, flexible electronic substrates employs the use of plastics for the flexible substrate, but these plastics typically have drawbacks, such as high thermal expansion coefficients. Transparent films made from...

  19. Development of unidirectional C/C composite with high thermal conductivity and its application to plasma facing materials

    Energy Technology Data Exchange (ETDEWEB)

    Ioki, Kimihiro (Mitsubishi Atomic Power Industries, Inc., Tokyo (Japan)); Onozuka, Masanori; Ikeda, Takeshi; Akiba, Masato

    1994-03-01

    Unidirectional C/C composite named 'MFC-1' with high conductivity was developed, and full-scale armor tiles were fabricated. The thermal conductivity in the direction perpendicular to the plasma-side surface is more than 300-500 W/m[center dot]degC, which is higher than those of other C/C composites ever made, even superior to that of pyrolytic carbon. It was shown by high heat load tests done using an electron beam test facility that the unidirectional C/C composite was very resistant against both surface erosion as well as severe thermal shock. The 'MFC-1' was successfully brazed to copper substrate, and its high thermal shock resistance was observed in heat load tests (20 MW/m[sup 2], 3s, not cooled). A functionally gradient material has been also developed as compliant layer for the MFC-1 bonded to copper. (author).

  20. Carbon nanotubes for thermal interface materials in microelectronic packaging

    Science.gov (United States)

    Lin, Wei

    As the integration scale of transistors/devices in a chip/system keeps increasing, effective cooling has become more and more important in microelectronics. To address the thermal dissipation issue, one important solution is to develop thermal interface materials with higher performance. Carbon nanotubes, given their high intrinsic thermal and mechanical properties, and their high thermal and chemical stabilities, have received extensive attention from both academia and industry as a candidate for high-performance thermal interface materials. The thesis is devoted to addressing some challenges related to the potential application of carbon nanotubes as thermal interface materials in microelectronics. These challenges include: 1) controlled synthesis of vertically aligned carbon nanotubes on various bulk substrates via chemical vapor deposition and the fundamental understanding involved; 2) development of a scalable annealing process to improve the intrinsic properties of synthesized carbon nanotubes; 3) development of a state-of-art assembling process to effectively implement high-quality vertically aligned carbon nanotubes into a flip-chip assembly; 4) a reliable thermal measurement of intrinsic thermal transport property of vertically aligned carbon nanotube films; 5) improvement of interfacial thermal transport between carbon nanotubes and other materials. The major achievements are summarized. 1. Based on the fundamental understanding of catalytic chemical vapor deposition processes and the growth mechanism of carbon nanotube, fast synthesis of high-quality vertically aligned carbon nanotubes on various bulk substrates (e.g., copper, quartz, silicon, aluminum oxide, etc.) has been successfully achieved. The synthesis of vertically aligned carbon nanotubes on the bulk copper substrate by the thermal chemical vapor deposition process has set a world record. In order to functionalize the synthesized carbon nanotubes while maintaining their good vertical alignment

  1. Scanning thermal microscopy of Bi{sub 2}Te{sub 3} and Yb{sub 0.19}Co{sub 4}Sb{sub 12} thermoelectric films

    Energy Technology Data Exchange (ETDEWEB)

    Zeipl, Radek; Remsa, Jan; Kocourek, Tomas [Institute of Physics ASCR v.v.i., Prague (Czech Republic); Jelinek, Miroslav [Institute of Physics ASCR v.v.i., Prague (Czech Republic); Czech Technical University in Prague, Faculty of Biomedical Engineering, Kladno (Czech Republic); Vanis, Jan [Institute of Physics ASCR v.v.i., Prague (Czech Republic); Institute of Photonics and Electronics ASCR v.v.i., Prague (Czech Republic); Navratil, Jiri [Institute of Macromolecular Chemistry ASCR v.v.i., Prague (Czech Republic)

    2016-04-15

    Thermal conductivity of thermoelectric Bi{sub 2}Te{sub 3} and Yb{sub 0.19}Co{sub 4}Sb{sub 12} thin nanolayers of different thicknesses prepared by pulsed laser deposition on Si (100) substrates was studied by a scanning thermal microscope working in AC current pulse mode. A sensitivity of the approach is demonstrated on the steep Si substrate-layer boundary made by a Ga+ focused ion beam technique. Transport and thermoelectric properties such as in-plane electrical resistivity and the Seebeck coefficient were studied in temperature range from room temperature up to 200 C. The room temperature thermal conductivity of the layers was estimated from thermoelectric figure of merit that was measured by the Harman technique, in which parameters related to electrical conductivity, Seebeck coefficient and thermal conductivity are measured at the same place and at the same time with electrical current flowing through the layer. For Yb{sub 0.19}Co{sub 4}Sb{sub 12} and Bi{sub 2}Te{sub 3} layers, we observed room temperature electrical resistivity of about 7 and 1 mΩcm, the Seebeck coefficient of -112 and -61μVK{sup -1}, thermoelectric figure of merit about 0.04 and 0.13 and we estimated thermal conductivity of about 1.3 and 0.9 WK{sup -1}m{sup -1}, respectively. (orig.)

  2. Improving long term oxidation protection for {gamma}-TiAl substrates

    Energy Technology Data Exchange (ETDEWEB)

    Bobzin, K.; Schlaefer, T.; Bruehl, M.; Linke, T.F. [Thermisches Spritzen, Institut fuer Oberflaechentechnik (IOT), RWTH Aachen University (Germany); Warda, T.

    2011-11-15

    In previous work, a thermal spray multilayer system consisting of Zirconia (ZrO{sub 2}) and MCrAlY top coat showed promising results regarding the oxidation behavior of the Gamma Titanium Aluminides substrates tested, which encouraged further research activities. Diffusion of substrate material was successfully inhibited by a ceramic Zirconia coating. A building up of a dense and stable oxide layer could be achieved by additional application of an MCrAlY top coat, leading to improved oxidation resistance and thus showing feasibility. In this work the main focus for development was put on enhancing adhesion and lowering residual stresses of the coatings in order to allow long term and cyclic testing without delamination taking place. Being a very brittle material, Gamma Titanium Aluminides require special surface treatment to enable roughening which is crucial for a strong mechanical bond between substrate and coating. Alternatives to conventional grit blasting as a standard preparation method were investigated. These were micro-abrasive blasting and blasting at elevated temperature ({approx}300-550 C) to allow a more ductile behavior. The paper will highlight the implications by means of these measures and will also show the present development status of the multilayer system. (Copyright copyright 2011 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  3. Warpage behavior analysis in package processes of embedded copper substrates

    Directory of Open Access Journals (Sweden)

    Hwang Yeong-Maw

    2017-01-01

    Full Text Available With the advance of the semiconductor industry and in response to the demands of ultra-thin products, packaging technology has been continuously developed. Thermal bonding process of copper pillar flip chip packages is a new bonding process in packaging technology, especially for substrates with embedded copper trace. During the packaging process, the substrate usually warps because of the heating process. In this paper, a finite element software ANSYS is used to model the embedded copper trace substrate and simulate the thermal and deformation behaviors of the substrate during the heating package process. A fixed geometric configuration equivalent to the real structure is duplicated to make the simulation of the warpage behavior of the substrate feasible. An empirical formula for predicting the warpage displacements is also established.

  4. Trade-off between thermal tolerance and insecticide resistance in Plutella xylostella.

    Science.gov (United States)

    Zhang, Lin Jie; Wu, Zhao Li; Wang, Kuan Fu; Liu, Qun; Zhuang, Hua Mei; Wu, Gang

    2015-01-01

    Fitness costs associated with resistance to insecticides have been well documented, usually at normal temperature conditions, in many insect species. In this study, using chlorpyrifos-resistant homozygote (RR) and chlorpyrifos-susceptible homozygote (SS) of resistance ace1 allele of Plutella xylostella (DBM), we confirmed firstly that high temperature experience in pupal stage influenced phenotype of wing venation in insecticide-resistant and insecticide-susceptible Plutella xylostella, and SS DBM showed significantly higher thermal tolerance and lower damages of wing veins under heat stress than RR DBM. As compared to SS DBM, RR DBM displayed significantly lower AChE sensitivity to chlorpyrifos, higher basal GSTs activity and P450 production at 25°C, but higher inhibitions on the enzyme activities and P450 production as well as reduced resistance to chlorpyrifos under heat stress. Furthermore, RR DBM displayed significantly higher basal expressions of hsp69s, hsp72s, hsp20,hsp90,Apaf-1, and caspase-7 at 25°C, but lower induced expressions of hsps and higher induced expressions of Apaf-1,caspase-9, and caspase-7 under heat stress. These results suggest that fitness costs of chlorpyrifos resistance in DBM may partly attribute to excess consumption of energy caused by over production of detoxification enzymes and hsps when the proteins are less demanded at conducive environments but reduced expressions when they are highly demanded by the insects to combat environmental stresses, or to excess expressions of apoptotic genes under heat stress, which results in higher apoptosis. The evolutionary and ecological implications of these findings at global warming are discussed.

  5. A new strategy for improvement of the corrosion resistance of a green cerium conversion coating through thermal treatment procedure before and after application of epoxy coating

    Energy Technology Data Exchange (ETDEWEB)

    Mahidashti, Z. [Department of Materials Engineering, Faculty of Engineering, Tarbiat Modares University, P.O. Box: 14115-143, Tehran (Iran, Islamic Republic of); Shahrabi, T., E-mail: tshahrabi34@modares.ac.ir [Department of Materials Engineering, Faculty of Engineering, Tarbiat Modares University, P.O. Box: 14115-143, Tehran (Iran, Islamic Republic of); Ramezanzadeh, B., E-mail: ramezanzadeh-bh@icrc.ac.ir [Department of Surface Coatings and Corrosion, Institute for Color Science and Technology (ICST), P.O. 16765-654, Tehran (Iran, Islamic Republic of)

    2016-12-30

    Highlights: • The Ce conversion coating was post-heated at various conditions. • The corrosion resistance of post-heated Ce films was evaluated. • A crack free and denser Ce film were obtained after post-heating. • The corrosion resistance of Ce film noticeably increased. • Post-heated Ce film resulted better protection performance of epoxy coating. - Abstract: The effect of post-heating of CeCC on its surface morphology and chemistry has been studied by scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and contact angle (CA) measurements. The corrosion protection performance of the coatings was investigated by electrochemical impedance spectroscopy (EIS). The effect of thermal treatment of CeCC on the corrosion protection performance of epoxy coating was investigated by EIS. Results showed that the heat treatment of Ce film noticeably improved its corrosion resistance and adhesion properties compared to that of untreated samples. The CeCC deposited on the steel substrate at room temperature had a highly cracked structure, while the amount of micro-cracks significantly reduced after post-heating procedure. Results obtained from EIS analysis confirmed the effect of post-heating of CeCC on its corrosion protection performance enhancement. The increase of post-heating temperature and time up to 140 °C and 3 h led to better results.

  6. Effect of thickness and cold substrate on transport properties of thermally evaporated CdTe thin films

    International Nuclear Information System (INIS)

    El-Mongy, A.Abd; Hashem, H.M.; Ramadan, A.A.

    2005-01-01

    The correlation between the structural characteristics (stoichiometry and crystallite size) of CdTe films and their electronic transport properties were the aims of the present study to bring attention to the dual importance of grain size and conversion of the semiconductivity type with changing film thickness. Two main parameters were considered: the substrate temperature and film thickness. Transport properties were influenced by grain boundaries as well as by native doping. Optical measurements showed two main direct transitions at energies: E 1 ∼1.55 eV (fundamental gap) and E 2 ∼2.49 eV (due to valence band splitting). Both transitions were found to be thickness dependent with a marked change at a film thickness of about 300 nm. In the case of low substrate temperature, the scaling relation between resistivity and grain size showed a deviation from linear behavior at a size of 20 nm and the transmission coefficient is reduced. Also, the deposition on cold substrate enhanced both dark and photoconductivity for films of thickness ≥300 nm. It is also proved that the carrier transport was affected by the transmission coef-ficient for carriers to pass a single grain boundary as well as the number of grain boundaries per mean free path. (copyright 2005 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim) (orig.)

  7. Effect of thickness and cold substrate on transport properties of thermally evaporated CdTe thin films

    Energy Technology Data Exchange (ETDEWEB)

    El-Mongy, A.Abd; Hashem, H.M.; Ramadan, A.A. [Physics Department, Faculty of Science, Helwan University, Helwan, Cairo (Egypt)

    2005-08-01

    The correlation between the structural characteristics (stoichiometry and crystallite size) of CdTe films and their electronic transport properties were the aims of the present study to bring attention to the dual importance of grain size and conversion of the semiconductivity type with changing film thickness. Two main parameters were considered: the substrate temperature and film thickness. Transport properties were influenced by grain boundaries as well as by native doping. Optical measurements showed two main direct transitions at energies: E{sub 1} {approx}1.55 eV (fundamental gap) and E{sub 2}{approx}2.49 eV (due to valence band splitting). Both transitions were found to be thickness dependent with a marked change at a film thickness of about 300 nm. In the case of low substrate temperature, the scaling relation between resistivity and grain size showed a deviation from linear behavior at a size of 20 nm and the transmission coefficient is reduced. Also, the deposition on cold substrate enhanced both dark and photoconductivity for films of thickness {>=}300 nm. It is also proved that the carrier transport was affected by the transmission coef-ficient for carriers to pass a single grain boundary as well as the number of grain boundaries per mean free path. (copyright 2005 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim) (orig.)

  8. Integrated Thermal Protection Systems and Heat Resistant Structures

    Science.gov (United States)

    Pichon, Thierry; Lacoste, Marc; Glass, David E.

    2006-01-01

    In the early stages of NASA's Exploration Initiative, Snecma Propulsion Solide was funded under the Exploration Systems Research & Technology program to develop integrated thermal protection systems and heat resistant structures for reentry vehicles. Due to changes within NASA's Exploration Initiative, this task was cancelled early. This presentation provides an overview of the work that was accomplished prior to cancellation. The Snecma team chose an Apollo-type capsule as the reference vehicle for the work. They began with the design of a ceramic aft heatshield (CAS) utilizing C/SiC panels as the capsule heatshield, a C/SiC deployable decelerator and several ablators. They additionally developed a health monitoring system, high temperature structures testing, and the insulation characterization. Though the task was pre-maturely cancelled, a significant quantity of work was accomplished.

  9. Bacterial cellulose membrane as flexible substrate for organic light emitting devices

    International Nuclear Information System (INIS)

    Legnani, C.; Vilani, C.; Calil, V.L.; Barud, H.S.; Quirino, W.G.; Achete, C.A.; Ribeiro, S.J.L.; Cremona, M.

    2008-01-01

    Bacterial cellulose (BC) membranes produced by gram-negative, acetic acid bacteria (Gluconacetobacter xylinus), were used as flexible substrates for the fabrication of Organic Light Emitting Diodes (OLED). In order to achieve the necessary conductive properties indium tin oxide (ITO) thin films were deposited onto the membrane at room temperature using radio frequency (r.f.) magnetron sputtering with an r.f. power of 30 W, at pressure of 8 mPa in Ar atmosphere without any subsequent thermal treatment. Visible light transmittance of about 40% was observed. Resistivity, mobility and carrier concentration of deposited ITO films were 4.90 x 10 -4 Ohm cm, 8.08 cm 2 /V-s and - 1.5 x 10 21 cm -3 , respectively, comparable with commercial ITO substrates. In order to demonstrate the feasibility of devices based on BC membranes three OLEDs with different substrates were produced: a reference one with commercial ITO on glass, a second one with a SiO 2 thin film interlayer between the BC membrane and the ITO layer and a third one just with ITO deposited directly on the BC membrane. The observed OLED luminance ratio was: 1; 0.5; 0.25 respectively, with 2400 cd/m 2 as the value for the reference OLED. These preliminary results show clearly that the functionalized biopolymer, biodegradable, biocompatible bacterial cellulose membranes can be successfully used as substrate in flexible organic optoelectronic devices

  10. Kovar Micro Heat Pipe Substrates for Microelectronic Cooling

    Energy Technology Data Exchange (ETDEWEB)

    Benson, David A.; Burchett, Steven N.; Kravitz, Stanley H.; Robino, Charles V.; Schmidt, Carrie; Tigges, Chris P.

    1999-04-01

    We describe the development of a new technology for cooling microelectronics. This report documents the design, fabrication, and prototype testing of micro scale heat pipes embedded in a flat plate substrate or heat spreader. A thermal model tuned to the test results enables us to describe heat transfer in the prototype, as well as evaluate the use of this technology in other applications. The substrate walls are Kovar alloy, which has a coefficient of thermal expansion close to that of microelectronic die. The prototype designs integrating micro heat pipes with Kovar enhance thermal conductivity by more than a factor of two over that of Kovar alone, thus improving the cooling of micro-electronic die.

  11. ESTIMATION OF THERMAL PARAMETERS OF POWER BIPOLAR TRANSISTORS BY THE METHOD OF THERMAL RELAXATION DIFFERENTIAL SPECTROMETRY

    Directory of Open Access Journals (Sweden)

    V. S. Niss

    2015-01-01

    Full Text Available Thermal performance of electronic devices determines the stability and reliability of the equipment. This leads to the need for a detailed thermal analysis of semiconductor devices. The goal of the work is evaluation of thermal parameters of high-power bipolar transistors in plastic packages TO-252 and TO-126 by a method of thermal relaxation differential spectrometry. Thermal constants of device elements and distribution structure of thermal resistance defined as discrete and continuous spectra using previously developed relaxation impedance spectrometer. Continuous spectrum, based on higher-order derivatives of the dynamic thermal impedance, follows the model of Foster, and discrete to model of Cauer. The structure of sample thermal resistance is presented in the form of siх-chain electro-thermal RC model. Analysis of the heat flow spreading in the studied structures is carried out on the basis of the concept of thermal diffusivity. For transistor structures the area and distribution of the heat flow cross-section are determined. On the basis of the measurements the thermal parameters of high-power bipolar transistors is evaluated, in particular, the structure of their thermal resistance. For all of the measured samples is obtained that the thermal resistance of the layer planting crystal makes a defining contribution to the internal thermal resistance of transistors. In the transition layer at the border of semiconductor-solder the thermal resistance increases due to changes in the mechanism of heat transfer. Defects in this area in the form of delamination of solder, voids and cracks lead to additional growth of thermal resistance caused by the reduction of the active square of the transition layer. Method of thermal relaxation differential spectrometry allows effectively control the distribution of heat flow in high-power semiconductor devices, which is important for improving the design, improve the quality of landing crystals of power

  12. Thermal conductivity and electrical resistivity of cadmium arsenide (Cd3As2) in the temperature range 4.2-40K1

    International Nuclear Information System (INIS)

    Bartkowski, K.; Ratalowicz, J.; Zdanowicz, W.

    1986-01-01

    Results on electrical resistivity and thermal conductivity measured in the temperature range 4.2-40 K are presented for single-crystal and polycrystalline samples of Cd 3 As 2 . Hall effect has been studied at temperatures of 4.2, 77, and 300K. The calculated value of the conduction electron concentration was in the range 1.87-1.95 10 24 m -3 . Electrical resistivity of all investigated samples was independent of temperature up to about 10K and increased slowsly at higher temperatures. The thermal conductivity shows a maximum in the region in which the lattice component of thermal conductivity dominates. The strong anistropy of the lattice component determines the anisotropy of the total thermal conductivity. The electronic component of thermal conductivity does not exhibit any anisotropy and shows a maximum at a temperature of about 300 K

  13. Effect of forming-gas annealing on the resistance switching effect of heteroepitaxial Nb:SrTiO{sub 3} film on Si substrate

    Energy Technology Data Exchange (ETDEWEB)

    Xiang, Wenfeng; Hu, Minghao; Liu, Yi [China University of Petroleum, Beijing Key Laboratory of Optical Detection Technology for Oil and Gas, Beijing (China)

    2017-12-15

    The influence of forming-gas annealing (FGA) on the resistance switching effect of epitaxial Nb:SrTiO{sub 3} [Nb-doped strontium titanates (NbSTO)] films on Si substrate has been investigated. The resistance values at low and high resistance states for NbSTO films after FGA are about two orders of magnitude lower than those of the as-deposited sample, which may effectively decrease the power dissipation of devices. Hysteretic I-V characteristic curves show that the stability of FGA sample was improved. The resistance ratio of NbSTO films measured via pulse voltage increased from 1.0-1.2 to 3.2-3.6 after FGA. Moreover, the resistance ratio of the FGA sample gradually increased with increasing number of cycles. These results indicate that FGA improves the resistance switching characteristics of NbSTO films. In addition, the underlying mechanism was discussed. (orig.)

  14. Development of MATLAB Scripts for the Calculation of Thermal Manikin Regional Resistance Values

    Science.gov (United States)

    2016-01-01

    TECHNICAL NOTE NO. TN16-1 DATE January 2016 ADA DEVELOPMENT OF MATLAB ® SCRIPTS FOR THE...USARIEM TECHNICAL NOTE TN16-1 DEVELOPMENT OF MATLAB ® SCRIPTS FOR THE CALCULATION OF THERMAL MANIKIN REGIONAL RESISTANCE VALUES...EXECUTIVE SUMMARY A software tool has been developed via MATLAB ® scripts to reduce the amount of repetitive and time-consuming calculations that are

  15. Improved field emission properties of carbon nanotubes grown on stainless steel substrate and its application in ionization gauge

    Science.gov (United States)

    Li, Detian; Cheng, Yongjun; Wang, Yongjun; Zhang, Huzhong; Dong, Changkun; Li, Da

    2016-03-01

    Vertically aligned carbon nanotube (CNT) arrays were fabricated by chemical vapor deposition (CVD) technique on different substrates. Microstructures and field emission characteristics of the as-grown CNT arrays were investigated systematically, and its application in ionization gauge was also evaluated preliminarily. The results indicate that the as-grown CNT arrays are vertically well-aligned relating to the substrate surfaces, but the CNTs grown on stainless steel substrate are longer and more crystalline than the ones grown on silicon wafer substrate. The field emission behaviors of the as-grown CNT arrays are strongly dependent upon substrate properties. Namely, the CNT array grown on stainless steel substrate has better field emission properties, including lower turn on and threshold fields, better emission stability and repeatability, compared with the one grown on silicon wafer substrate. The superior field emission properties of the CNT array grown on stainless steel substrate are mainly attributed to low contact resistance, high thermal conductivity, good adhesion strength, etc. In addition, the metrological behaviors of ionization gauge with the CNT array grown on stainless steel substrate as an electron source were investigated, and this novel cathode ionization gauge extends the lower limit of linear pressure measurement to 10-8 Pa, which is one order of magnitude lower than the result reported for the same of gauge with CNT cathode.

  16. Electrochemical corrosion behaviour of Mg-Al alloys with thermal spray Al/SiCp composite coatings

    International Nuclear Information System (INIS)

    Pardo, A.; Feliu Jr, S.; Merino, M. C.; Mohedano, M.; Casajus, P.; Arrabal, R.

    2010-01-01

    The corrosion protection of Mg-Al alloys by flame thermal spraying of Al/SiCp composite coatings was evaluated by electrochemical impedance spectroscopy in 3.5 wt.% NaCl solution. The volume fraction of SiC particles (SiCp) varied between 5 and 30%. The as-sprayed Al/SiCp composite coatings revealed a high number of micro-channels, largely in the vicinity of the SiC particles, that facilitated the penetration of the electrolyte and the subsequent galvanic corrosion of the magnesium substrates. The application of a cold-pressing post-treatment reduced the degree of porosity of the coatings and improved the bonding at the coating/substrate and Al/SiC interfaces. This resulted in improved corrosion resistance of the coated specimens. The effectiveness of the coatings slightly decreased with the addition of 5-30 vol.% SiCp compared with the un reinforced thermal spray aluminium coatings. (Author) 31 refs.

  17. Study of thermal stability and degradation of fire resistant candidate polymers for aircraft interiors

    Science.gov (United States)

    Hsu, M. T. S.

    1976-01-01

    The thermochemistry of bismaleimide resins and phenolphthalein polycarbonate was studied. Both materials are fire-resistant polymers and may be suitable for aircraft interiors. The chemical composition of the polymers has been determined by nuclear magnetic resonance and infrared spectroscopy and by elemental analysis. Thermal properties of these polymers have been characterized by thermogravimetric analyses. Qualitative evaluation of the volatile products formed in pyrolysis under oxidative and non-oxidative conditions has been made using infrared spectrometry. The residues after pyrolysis were analyzed by elemental analysis. The thermal stability of composite panel and thermoplastic materials for aircraft interiors was studied by thermogravimetric analyses.

  18. Influence of Thermal Annealing Treatment on Bipolar Switching Properties of Vanadium Oxide Thin-Film Resistance Random-Access Memory Devices

    Science.gov (United States)

    Chen, Kai-Huang; Cheng, Chien-Min; Kao, Ming-Cheng; Chang, Kuan-Chang; Chang, Ting-Chang; Tsai, Tsung-Ming; Wu, Sean; Su, Feng-Yi

    2017-04-01

    The bipolar switching properties and electrical conduction mechanism of vanadium oxide thin-film resistive random-access memory (RRAM) devices obtained using a rapid thermal annealing (RTA) process have been investigated in high-resistive status/low-resistive status (HRS/LRS) and are discussed herein. In addition, the resistance switching properties and quality improvement of the vanadium oxide thin-film RRAM devices were measured by x-ray diffraction (XRD) analysis, x-ray photoelectron spectrometry (XPS), scanning electron microscopy (SEM), atomic force microscopy (AFM), and current-voltage ( I- V) measurements. The activation energy of the hopping conduction mechanism in the devices was investigated based on Arrhenius plots in HRS and LRS. The hopping conduction distance and activation energy barrier were obtained as 12 nm and 45 meV, respectively. The thermal annealing process is recognized as a candidate method for fabrication of thin-film RRAM devices, being compatible with integrated circuit technology for nonvolatile memory devices.

  19. The naphthoquinones, vitamin K3 and its structural analog plumbagin, are substrates of the multidrug resistance-linked ABC drug transporter ABCG2

    Science.gov (United States)

    Shukla, Suneet; Wu, Chung-Pu; Nandigama, Krishnamachary; Ambudkar, Suresh V.

    2008-01-01

    Vitamin K3 (Menadione; 2-methyl-1,4-naphthoquinone) is a structural precursor of vitamins K1 and K2 which are essential for blood clotting. The naturally occurring structural analog of this vitamin, plumbagin (5-hydroxy-menadione), is known to modulate cellular proliferation, apoptosis, carcinogenesis, and radioresistance. We, here, report that both vitamin K3 and plumbagin are substrates of the multidrug resistance-linked ATP binding cassette (ABC) drug transporter, ABCG2. Vitamin K3 and plumbagin specifically inhibited the ABCG2-mediated efflux of mitoxantrone, but did not have any effect on the ABCB1-mediated efflux of rhodamine 123. This inhibition of ABCG2 function was due to their interaction at the substrate-binding site(s). They inhibited the binding of [125I]-Iodoarylazidoprazosin (IAAP), a substrate of ABCG2, to this transporter in a concentration-dependent manner with IC50 values of 7.3 and 22.6 μM, respectively, but had no effect on the binding of this photoaffinity analog to ABCB1. Both compounds stimulated ABCG2-mediated ATP hydrolysis and also inhibited the mitoxantrone-stimulated ATPase activity of this transporter, but did not have any significant effect on the ATPase activity of ABCB1. In a cytotoxicity assay, ABCG2-expressing HEK cells were 2.8- and 2.3-fold resistant to plumbagin and vitamin K3, respectively, compared to the control cells, suggesting that they are substrates of this transporter. Collectively, these data demonstrate for the first time that vitamin K3 is a substrate of the ABCG2 transporter. Thus, ABCG2 may have a role in the regulation of vitamin K3 levels in the body. In addition, vitamin K3 and its structural derivative, plumbagin, could potentially be used to modulate ABCG2 function. PMID:18065489

  20. Circumvention of breast cancer resistance protein (BCRP)-mediated resistance to camptothecins in vitro using non-substrate drugs or the BCRP inhibitor GF120918.

    Science.gov (United States)

    Maliepaard, M; van Gastelen, M A; Tohgo, A; Hausheer, F H; van Waardenburg, R C; de Jong, L A; Pluim, D; Beijnen, J H; Schellens, J H

    2001-04-01

    This study was aimed at characterizing the role of BCRP/MXR/ABCP (BCRP) in resistance of the human ovarian tumor cell lines T8 and MX3 to camptothecins more extensively and investigating whether resistance can be reversed by inhibiting BCRP by GF120918. Camptothecins studied were topotecan, CPT-11, and its active metabolite SN-38, 9-aminocamptothecin, and the novel experimental camptothecins NX211, DX8951f, and BNP1350. Notably, DX8951f and BNP1350 appeared to be very poor substrates for BCRP, with much lower resistance factors observed both in T8 and MX3 cells than observed for the other camptothecins tested. In the presence of a nontoxic dose level of GF120918, the intracellular accumulation of topotecan in the T8 and MX3 cells was completely restored to the intracellular levels observed in the sensitive IGROV1 parental cell line. This resulted in almost complete reversal of drug resistance to topotecan and to most of the other topoisomerase I drugs tested in the T8 cell line and to complete reversal in the MX3 cells. However, coincubation of DX8951f or BNP1350 with GF120918 did not affect the cytotoxicity of either of these drugs significantly. From the combined data, we conclude that the affinities of topoisomerase I drugs for BCRP are, in decreasing order: SN-38 > topotecan > 9-aminocamptothecin approximately CPT-11 > NX211 > DX8951f > BNP1350. Furthermore, GF120918 appears to be a potent reversal agent of BCRP-mediated resistance to camptothecins, with almost complete reversal noted at 100 nM. Potential BCRP-mediated resistance to topoisomerase I inhibitors can also be avoided by using the BCRP-insensitive drugs DX8951f or BNP1350. This observation may have important clinical implications for future development of novel camptothecins.

  1. Heating of polymer substrate by discharge plasma in radiofrequency magnetron sputtering deposition

    International Nuclear Information System (INIS)

    Sirghi, Lucel; Popa, Gheorghe; Hatanaka, Yoshinori

    2006-01-01

    The substrate used for the thin film deposition in a radiofrequency magnetron sputtering deposition system is heated by the deposition plasma. This may change drastically the surface properties of the polymer substrates. Deposition of titanium dioxide thin films on polymethyl methacrylate and polycarbonate substrates resulted in buckling of the substrate surfaces. This effect was evaluated by analysis of atomic force microscopy topography images of the deposited films. The amount of energy received by the substrate surface during the film deposition was determined by a thermal probe. Then, the results of the thermal probe measurements were used to compute the surface temperature of the polymer substrate. The computation revealed that the substrate surface temperature depends on the substrate thickness, discharge power and substrate holder temperature. For the case of the TiO 2 film depositions in the radiofrequency magnetron plasma, the computation indicated substrate surface temperature values under the polymer melting temperature. Therefore, the buckling of polymer substrate surface in the deposition plasma may not be regarded as a temperature driven surface instability, but more as an effect of argon ion bombardment

  2. Wrinkle-Free Single-Crystal Graphene Wafer Grown on Strain-Engineered Substrates.

    Science.gov (United States)

    Deng, Bing; Pang, Zhenqian; Chen, Shulin; Li, Xin; Meng, Caixia; Li, Jiayu; Liu, Mengxi; Wu, Juanxia; Qi, Yue; Dang, Wenhui; Yang, Hao; Zhang, Yanfeng; Zhang, Jin; Kang, Ning; Xu, Hongqi; Fu, Qiang; Qiu, Xiaohui; Gao, Peng; Wei, Yujie; Liu, Zhongfan; Peng, Hailin

    2017-12-26

    Wrinkles are ubiquitous for graphene films grown on various substrates by chemical vapor deposition at high temperature due to the strain induced by thermal mismatch between the graphene and substrates, which greatly degrades the extraordinary properties of graphene. Here we show that the wrinkle formation of graphene grown on Cu substrates is strongly dependent on the crystallographic orientations. Wrinkle-free single-crystal graphene was grown on a wafer-scale twin-boundary-free single-crystal Cu(111) thin film fabricated on sapphire substrate through strain engineering. The wrinkle-free feature of graphene originated from the relatively small thermal expansion of the Cu(111) thin film substrate and the relatively strong interfacial coupling between Cu(111) and graphene, based on the strain analyses as well as molecular dynamics simulations. Moreover, we demonstrated the transfer of an ultraflat graphene film onto target substrates from the reusable single-crystal Cu(111)/sapphire growth substrate. The wrinkle-free graphene shows enhanced electrical mobility compared to graphene with wrinkles.

  3. Abrasion-Resistant Aluminized-Coated Aramid Fabrics for Manufacture of Firefighters’ Protective Clothing

    Science.gov (United States)

    1985-05-01

    and radiacion are also produced at the cathode surface and may profoundly influence the quality of the substrate coating. These include secondary...14,265-378 (1979). Assink, R.A. Abrasion resistant polymer reflectors for solar applications. Solar Energy Mater vol. 3:263-75, (1980). Audet, N.F. Visor... solar reflectors. Solar Energy Mater vol. 3: No.1-2,277-83,(1981). *Gubareff, G.G., J.E. Janssen, and R.H. Torborg. Thermal radiation properties survey

  4. Effect of ion implantation on thermal shock resistance of magnesia and glass

    International Nuclear Information System (INIS)

    Gurarie, V.N.; Williams, J.S.; Watt, A.J.

    1995-01-01

    Monocrystals of magnesia together with glass samples have been subjected to ion implantation prior to thermal shock testing in an impulse plasma of continuously varied intensity. Measurements of the separation between fragments have been used to estimate the surface temperature. Fracture and deformation characteristics of the surface layer are measured in ion implanted and unimplanted samples using optical and scanning electron microscopy. Implantation-induced near-surface damage is analysed by ion channeling using 2 MeV He + ions. Ion implantation is shown to modify the near-surface structure of magnesia samples by introducing damage, which makes crack initiation easier under thermal stresses. The fracture threshold and maximum crack density are shifted towards the lower temperature range. Ion implanted MgO crystals show a ten fold increase in surface crack density. An increased crack density results in a decreased degree of damage characterised by the depth of crack penetration. The thermal stress resistance parameter of glass samples is increased at relatively small doses and decreased at higher doses. The results suggest that crack density and the degree of fracture damage in brittle ceramics operating under thermal shock conditions can be effectively controlled by ion implantation which provides crack initiating defects in the near-surface region. 23 refs., 7 figs

  5. Tribological and wear behavior of yttria stabilized zirconia thermal barrier coatings on mild steel

    International Nuclear Information System (INIS)

    Farooq, M.; Pervez, A.

    2012-01-01

    The perfection of the temperature confrontation of the engine essentials can be obtained by claim of a single ceramic thermal barrier coating (TBC) or several composite layers. Engine elements protected by TBC can work safely in elevated temperature range above 1000 degree C. Continuous endeavor to increase thermal resistance of engine the elements requires, apart from laboratory investigations, also numerical study of the different engine parts. The high temperatures and stress concentrations can act as the local sources of damage initiation and defects propagation in the form of cracks. The current study focuses the development of Yttria stabilized zirconia thermal barrier coating by Thermal spray technique. Mild steel was used as a substrate and the coating was then characterized for tribological analysis followed by the optical analysis of wear tracks and found the TBC behavior more promising then steel. (author)

  6. Magnetogravitational stability of resistive plasma through porous medium with thermal conduction and FLR corrections

    International Nuclear Information System (INIS)

    Vaghela, D.S.; Chhajlani, R.K.

    1989-01-01

    The problem of stability of self gravitating magnetized plasma in porous medium is studied incorporating electrical resistivity, thermal conduction and FLR corrections. Normal mode analysis is applied to derive the dispersion relation. Wave propagation is discussed for parallel and perpendicular directions to the magnetic field. Applying Routh Hurwitz Criterion the stability of the medium is discussed and it is found that Jeans' criterion determines the stability of the medium. Magnetic field, porosity and resistivity of the medium have no effect on Jeans' Criterion in longitudinal direction. For perpendicular direction, in case of resistive medium Jeans' expression remains unaffected by magnetic field but for perfectly conducting medium magnetic field modifies the Jeans' expression to show the stabilizing effect. Thermal conductivity affects the sonic mode by making the process isothermal instead of adiabatic. Porosity of the medium is effective only in case of perpendicular direction to magnetic field for perfectly conducting plasma as it reduces the stabilizing effect of magnetic field. For longitudinal wave propagation, though Finite Larmor Radius (FLR) corrections have no effect on sonic mode but it changes the growth rate for Alfven mode. For transverse wave propagation FLR corrections and porosity affect the Jeans' expression in case of non-viscous medium but viscosity of the medium removes the effect of FLR and porosity on Jeans' condition. (author)

  7. Design and Characterization of High-strength Bond Coats for Improved Thermal Barrier Coating Durability

    Science.gov (United States)

    Jorgensen, David John

    High pressure turbine blades in gas turbine engines rely on thermal barrier coating (TBC) systems for protection from the harsh combustion environment. These coating systems consist of a ceramic topcoat for thermal protection, a thermally grown oxide (TGO) for oxidation passivation, and an intermetallic bond coat to provide compatibility between the substrate and ceramic over-layers while supplying aluminum to sustain Al2O 3 scale growth. As turbine engines are pushed to higher operating temperatures in pursuit of better thermal efficiency, the strength of industry-standard bond coats limits the lifetime of these coating systems. Bond coat creep deformation during thermal cycling leads to a failure mechanism termed rumpling. The interlayer thermal expansion differences, combined with TGO-imposed growth stresses, lead to the development of periodic undulations in the bond coat. The ceramic topcoat has low out-of-plane compliance and thus detaches and spalls from the substrate, resulting in a loss of thermal protection and subsequent degradation of mechanical properties. New creep resistant Ni3Al bond coats were designed with improved high-temperature strength to inhibit this type of premature failure at elevated temperatures. These coatings resist rumpling deformation while maintaining compatibility with the other layers in the system. Characterization methods are developed to quantify rumpling and assess the TGO-bond coat interface toughness of experimental systems. Cyclic oxidation experiments at 1163 °C show that the Ni3Al bond coats do not experience rumpling but have faster oxide growth rates and are quicker to spall TGO than the (Pt,Ni)Al benchmark. However, the Ni 3Al coatings outperformed the benchmark by over threefold in TBC system life due to a higher resistance to rumpling (mechanical degradation) while maintaining adequate oxidation passivation. The Ni3Al coatings eventually grow spinel NiAl2O4 on top of the protective Al2O3 layer, which leads to the

  8. Ion beam modification of thermal stress resistance of MgO single crystals with different crystallographic faces

    International Nuclear Information System (INIS)

    Gurarie, V.N.; Otsuka, P.H.; Jamieson, D.N.; Williams, J.S.; Conway, M.

    1999-01-01

    Ion beam modification of thermal shock stress and damage resistance of MgO single crystals with various crystallographic faces is investigated. The most stable crystal faces in terms of stress and damage resistance are established. Ion implantation is shown to reduce the temperature threshold of fracture for all crystal faces tested. The (111) face is demonstrated to be of highest stability compared to (110) and (100) faces in both implanted and unimplanted crystals. At the same time ion implantation substantially increases the microcrack density for the faces tested and reduces the degree of fracture damage following thermal shock. The microcrack density is found to be highest in the crystals with (110) face in comparison with the (001) and (111) faces. The effect is analysed using fracture mechanics principles and discussed in terms of the implantation-induced lattice damage

  9. Annealing effects on electrical and optical properties of ZnO thin-film samples deposited by radio frequency-magnetron sputtering on GaAs (001) substrates

    International Nuclear Information System (INIS)

    Liu, H. F.; Chua, S. J.; Hu, G. X.; Gong, H.; Xiang, N.

    2007-01-01

    The effects of thermal annealing on Hall-effect measurement and photoluminescence (PL) from undoped n-type ZnO/GaAs thin-film samples have been studied. The evolutions of carrier concentration, electrical resistivity, and PL spectrum at various annealing conditions reveal that the dominant mechanism that affects the electrical and PL properties is dependent on the amount of thermal energy and the ambient pressure applied during the annealing process. At low annealing temperatures, annihilation of native defects is dominant in reducing the carrier concentration and weakening the low-energy tail of the main PL peak, while the GaAs substrate plays only a minor role in carrier compensations. For the higher temperatures, diffusion of Ga atoms from the GaAs substrate into ZnO film leads to a more n-type conduction of the sample. As a result, the PL exhibits a high-energy tail due to the high-level doping

  10. Impact of impurity content on the sintering resistance and phase stability of dysprosia- and yttria-stabilized zirconia thermal barrier coatings

    Czech Academy of Sciences Publication Activity Database

    Curry, N.; Janikowski, W.; Pala, Zdeněk; Vilémová, Monika; Markocsan, N.

    2014-01-01

    Roč. 23, 1-2 (2014), s. 160-169 ISSN 1059-9630. [International Thermal Spray Conference (ITSC2013). Busan, 13.05.2013-15.05.2013] Institutional support: RVO:61389021 Keywords : atmospheric plasma spray (APS) * thermal and phase stability of coatings * thermal barrier coatings (TBCs) * thermal conductivity * zirconia Subject RIV: JH - Ceramics, Fire-Resistant Materials and Glass Impact factor: 1.344, year: 2014 http://link.springer.com/article/10.1007%2Fs11666-013-0014-9/fulltext.html

  11. Evaluations of corrosion resistance of Ni-Cr plated and Zn-plated Fe Substrates Using an Electrolytic Corrosion Test

    International Nuclear Information System (INIS)

    Lee, Jaebong; Kim, Kyungwook; Park, Minwoo; Song, Taejun; Lee, Chaeseung; Lee, Euijong; Kim, Sangyeol

    2013-01-01

    An Eectrolytic Corrosion(EC) test method was evaluated by the comparison with Copper Accelerated Acetic Salt Spray(CASS) and Neutral Salt Spray(SS) tests. Those methods were applied in order to evaluate corrosion resistance of Ni-Cr plated and Zn-plated Fe substrates. The correlations between results obtained by different test methods were investigated. Results showed that the electrochemical method such as the EC test method was superior to the conventional methods such as CASS and SS, in terms of the quantitative accuracy and the test-time span. Furthermore, the EC test method provided the useful means to estimate the initiation of corrosion of each layer by monitoring the rest potentials of the coated layers such as Ni, Cr, and Zn on Fe substrate. With regard to test time spans, the EC test provided the 78 times and 182 times faster results than the CASS test in cases of Fe + 5μm Ni + 0.5 μm Cr and Fe + 20 μm Ni + 0.5 μm Cr respectively, while the EC test was 85 times faster results than the Salt Spray test in the case of Fe + 20 g/m 2 Zn. Therefore, the EC test can be the better method to evaluate the resistance to corrosion of coated layers than the conventional methods such as the SS test and the CASS

  12. Effect of the light spectrum of various substrates for inkjet printed conductive structures sintered with intense pulsed light

    International Nuclear Information System (INIS)

    Weise, Dana; Mitra, Kalyan Yoti; Ueberfuhr, Peter; Baumann, Reinhard R.

    2015-01-01

    In this work, the novel method of intense pulsed light (IPL) sintering of a nanoparticle silver ink is presented. Various patterns are printed with the Inkjet technology on two flexible foils with different light spectra. One is a clear Polyethylenterephthalat [PET] foil and the second is a light brownish Polyimide [PI] foil. The samples are flashed with different parameters regarding to pulse intensity and pulse length. Microscopic images are indicating the impact of the flashing parameters and the different light spectra of the substrates on the sintered structures. Sheet and line resistance are measured and the conductivity is calculated. A high influence of the property of the substrate with respect to light absorption and thermal conductivity on the functionality of printed conductive structures could be presented. With this new method of IPL sintering, highly conductive inkjet printed silver patterns could be manufactured within milliseconds on flexible polymeric foils without damaging the substrate

  13. Facile fabrication of superhydrophobic surface with excellent mechanical abrasion and corrosion resistance on copper substrate by a novel method.

    Science.gov (United States)

    Su, Fenghua; Yao, Kai

    2014-06-11

    A novel method for controllable fabrication of a superhydrophobic surface with a water contact angle of 162 ± 1° and a sliding angle of 3 ± 0.5° on copper substrate is reported in this Research Article. The facile and low-cost fabrication process is composed from the electrodeposition in traditional Watts bath and the heat-treatment in the presence of (heptadecafluoro-1,1,2,2-tetradecyl) triethoxysilane (AC-FAS). The superhydrophobicity of the fabricated surface results from its pine-cone-like hierarchical micro-nanostructure and the assembly of low-surface-energy fluorinated components on it. The superhydrophobic surface exhibits high microhardness and excellent mechanical abrasion resistance because it maintains superhydrophobicity after mechanical abrasion against 800 grit SiC sandpaper for 1.0 m at the applied pressure of 4.80 kPa. Moreover, the superhydrophobic surface has good chemical stability in both acidic and alkaline environments. The potentiodynamic polarization and electrochemical impedance spectroscopy test shows that the as-prepared superhydrophobic surface has excellent corrosion resistance that can provide effective protection for the bare Cu substrate. In addition, the as-prepared superhydrophobic surface has self-cleaning ability. It is believed that the facile and low-cost method offer an effective strategy and promising industrial applications for fabricating superhydrophobic surfaces on various metallic materials.

  14. Chemically-modified graphene sheets as an active layer for eco-friendly metal electroplating on plastic substrates

    International Nuclear Information System (INIS)

    Oh, Joon-Suk; Hwang, Taeseon; Nam, Gi-Yong; Hong, Jung-Pyo; Bae, Ah-Hyun; Son, Sang-Ik; Lee, Geun-Ho; Sung, Hak kyung; Choi, Hyouk Ryeol; Koo, Ja Choon; Nam, Jae-Do

    2012-01-01

    Eco-friendly nickel (Ni) electroplating was carried out on a plastic substrate using chemically modified graphene sheets as an active and conductive layer to initiate electroplating without using conventional pre-treatment or electroless metal-seeding processes. A graphene oxide (GO) solution was self-assembled on a polyethylene terephthalate (PET) film followed by evaporation to give GO layers (thickness around 6.5 μm) on PET (GO/PET) film. Then, the GO/PET film was chemically and thermally reduced to convert the GO layers to reduced graphene oxide (RGO) layers on the PET substrate. The RGO-coated PET (RGO/PET) film showed the sheet resistance of 100 Ω per square. On RGO/PET film, Ni electroplating was conducted under the constant-current condition and the entire surface of the PET film was completely metalized with Ni without any voids.

  15. Ink for Ink-Jet Printing of Electrically Conductive Structures on Flexible Substrates with Low Thermal Resistance

    Science.gov (United States)

    Mościcki, A.; Smolarek-Nowak, A.; Felba, J.; Kinart, A.

    2017-07-01

    The development of new technologies in electronics related to flexible polymeric substrates forces the industry to introduce suitable tools (special type of dispensers) and modern conductive materials for printing electronic circuits. Moreover, due to the wide use of inexpensive polymeric foils (polyethene, PE, or poly(ethylene terephthalate), PET), there is a need to develop materials with the lowest possible processing temperatures. The present paper presents the selection criteria of suitable components and their preparation for obtaining electrically conductive ink with a special nanosilver base. In the case of the discussed solution, all components allow to make circuits in relatively low sintering temperature (even below 130°C). Additionally, the authors show the most significant ink parameters that should be taken into consideration during Research and Development (R&D) works with electrically conductive inks. Moreover, ink stability parameters are discussed and some examples of printed circuits are presented.

  16. Monolithic pixels on moderate resistivity substrate and sparsifying readout architecture

    International Nuclear Information System (INIS)

    Giubilato, P.; Battaglia, M.; Bisello, D.; Caselle, M.; Chalmet, P.; Demaria, L.; Ikemoto, Y.; Kloukinas, K.; Mansuy, S.C.; Mattiazzo, S.; Marchioro, A.; Mugnier, H.; Pantano, D.; Potenza, A.; Rivetti, A.; Rousset, J.; Silvestrin, L.; Snoeys, W.

    2013-01-01

    The LePix projects aim realizing a new generation monolithic pixel detectors with improved performances at lesser cost with respect to both current state of the art monolithic and hybrid pixel sensors. The detector is built in a 90 nm CMOS process on a substrate of moderate resistivity. This allows charge collection by drift while maintaining the other advantages usually offered by MAPS, like having a single piece detector and using a standard CMOS production line. The collection by drift mechanism, coupled to the low capacitance design of the collecting node made possible by the monolithic approach, provides an excellent signal to noise ratio straight at the pixel cell together with a radiation tolerance far superior to conventional un-depleted MAPS. The excellent signal-to-noise performance is demonstrated by the device ability to separate the 6 keV 55 Fe double peak at room temperature. To achieve high granularity (10–20 µm pitch pixels) over large detector areas maintaining high readout speed, a completely new compressing architecture has been devised. This architecture departs from the mainstream hybrid pixel sparsification approach, which uses in-pixel logic to reduce data, by using topological compression to minimize pixel area and power consumption

  17. Characterising thermal resistances and capacitances of GaN high-electron-mobility transistors through dynamic electrothermal measurements

    DEFF Research Database (Denmark)

    Wei, Wei; Mikkelsen, Jan H.; Jensen, Ole Kiel

    2014-01-01

    This study presents a method to characterise thermal resistances and capacitances of GaN high-electron-mobility transistors (HEMTs) through dynamic electrothermal measurements. A measured relation between RF gain and the channel temperature (Tc) is formed and used for indirect measurements...

  18. Calculation of Local Stress and Fatigue Resistance due to Thermal Stratification on Pressurized Surge Line Pipe

    Science.gov (United States)

    Bandriyana, B.; Utaja

    2010-06-01

    Thermal stratification introduces thermal shock effect which results in local stress and fatique problems that must be considered in the design of nuclear power plant components. Local stress and fatique calculation were performed on the Pressurize Surge Line piping system of the Pressurize Water Reactor of the Nuclear Power Plant. Analysis was done on the operating temperature between 177 to 343° C and the operating pressure of 16 MPa (160 Bar). The stagnant and transient condition with two kinds of stratification model has been evaluated by the two dimensional finite elements method using the ANSYS program. Evaluation of fatigue resistance is developed based on the maximum local stress using the ASME standard Code formula. Maximum stress of 427 MPa occurred at the upper side of the top half of hot fluid pipe stratification model in the transient case condition. The evaluation of the fatigue resistance is performed on 500 operating cycles in the life time of 40 years and giving the usage value of 0,64 which met to the design requirement for class 1 of nuclear component. The out surge transient were the most significant case in the localized effects due to thermal stratification.

  19. Thermal Cycling and High-Temperature Corrosion Tests of Rare Earth Silicate Environmental Barrier Coatings

    Science.gov (United States)

    Darthout, Émilien; Gitzhofer, François

    2017-12-01

    Lutetium and yttrium silicates, enriched with an additional secondary zirconia phase, environmental barrier coatings were synthesized by the solution precursor plasma spraying process on silicon carbide substrates. A custom-made oven was designed for thermal cycling and water vapor corrosion testing. The oven can test four specimens simultaneously and allows to evaluate environmental barrier performances under similar corrosion kinetics compared to turbine engines. Coatings structural evolution has been observed by SEM on the polished cross sections, and phase composition has been analyzed by XRD. All coatings have been thermally cycled between 1300 °C and the ambient temperature, without spallation, due to their porosity and the presence of additional secondary phase which increases the thermal cycling resistance. During water vapor exposure at 1200 °C, rare earth disilicates showed a good stability, which is contradictory with the literature, due to impurities—such as Si- and Al-hydroxides—in the water vapor jets. The presence of vertical cracks allowed the water vapor to reach the substrate and then to corrode it. It has been observed that thin vertical cracks induced some spallation after 24 h of corrosion.

  20. Thermal propagation and stability in superconducting films

    International Nuclear Information System (INIS)

    Gray, K.E.; Kampwirth, R.T.; Zasadzinski, J.F.; Ducharme, S.P.

    1983-01-01

    Thermal propagation and stable hot spots (normal domains) are studied in various high Tsub(c) superconducting films (Nb 3 Sn, Nb, NbN and Nb 3 Ge). A new energy balance is shown to give reasonable quantitative agreement of the dependence of the propagation velocity on the length of short normal domains. The steady state (zero velocity) measurements indicate the existence of two distinct situations for films on high thermal conductivity (sapphire) substrates. For low power per unit area the film and substrate have the same temperature, and the thermal properties of the substrate dominate. However, for higher power densities in short hot spots, the coupling is relatively weak and the thermal properties of the film alone are important. Here a connection is made between the critical current stability of superconducting films and a critical hot spot size for thermal propagation. As a result efficient heat removal is shown to dominate the stabilisation of superconducting films. The strong and weak coupling situations also lead to modifications of the models for propagation velocities on sapphire substrates. Self-healing of hot spots and other phenomena in superconducting film are explained. The potential use of the thermal propagation model in applications of superconductors, especially switches is discussed. (author)

  1. Electrical and thermal conductivity of low temperature CVD graphene: the effect of disorder

    International Nuclear Information System (INIS)

    Vlassiouk, Ivan; Datskos, Panos; Smirnov, Sergei; Ivanov, Ilia; Hensley, Dale; Lavrik, Nickolay V; Fulvio, Pasquale F; Dai Sheng; Meyer, Harry; Chi Miaofang

    2011-01-01

    In this paper we present a study of graphene produced by chemical vapor deposition (CVD) under different conditions with the main emphasis on correlating the thermal and electrical properties with the degree of disorder. Graphene grown by CVD on Cu and Ni catalysts demonstrates the increasing extent of disorder at low deposition temperatures as revealed by the Raman peak ratio, I G /I D . We relate this ratio to the characteristic domain size, L a , and investigate the electrical and thermal conductivity of graphene as a function of L a . The electrical resistivity, ρ, measured on graphene samples transferred onto SiO 2 /Si substrates shows linear correlation with L a -1 . The thermal conductivity, K, measured on the same graphene samples suspended on silicon pillars, on the other hand, appears to have a much weaker dependence on L a , close to K ∼ L a 1/3 . It results in an apparent ρ ∼ K 3 correlation between them. Despite the progressively increasing structural disorder in graphene grown at lower temperatures, it shows remarkably high thermal conductivity (10 2 -10 3 W K -1 m -1 ) and low electrical (10 3 -3 x 10 5 Ω) resistivities suitable for various applications.

  2. Specific fluorogenic substrates for neprilysin (neutral endopeptidase, EC 3.4.24.11 which are highly resistant to serine- and metalloproteases

    Directory of Open Access Journals (Sweden)

    M.A.S. Medeiros

    1997-10-01

    Full Text Available Two intramolecularly quenched fluorogenic peptides containing o-aminobenzoyl (Abz and ethylenediamine 2,4-dinitrophenyl (EDDnp groups at amino- and carboxyl-terminal amino acid residues, Abz-DArg-Arg-Leu-EDDnp (Abz-DRRL-EDDnp and Abz-DArg-Arg-Phe-EDDnp (Abz-DRRF-EDDnp, were selectively hydrolyzed by neutral endopeptidase (NEP, enkephalinase, neprilysin, EC 3.4.24.11 at the Arg-Leu and Arg-Phe bonds, respectively. The kinetic parameters for the NEP-catalyzed hydrolysis of Abz-DRRL-EDDnp and Abz-DRRF-EDDnp were Km = 2.8 µM, kcat = 5.3 min-1, kcat/Km = 2 min-1 µM-1 and Km = 5.0 µM, kcat = 7.0 min-1, kcat/Km = 1.4 min-1 µM-1, respectively. The high specificity of these substrates was demonstrated by their resistance to hydrolysis by metalloproteases [thermolysin (EC 3.4.24.2, angiotensin-converting enzyme (ACE; EC 3.4.24.15], serineproteases [trypsin (EC 3.4.21.4, a-chymotrypsin (EC 3.4.21.1] and proteases present in tissue homogenates from kidney, lung, brain and testis. The blocked amino- and carboxyl-terminal amino acids protected these substrates against the action of aminopeptidases, carboxypeptidases and ACE. Furthermore, DR amino acids ensured total protection of Abz-DRRL-EDDnp and Abz-DRRF-EDDnp against the action of thermolysin and trypsin. Leu-EDDnp and Phe-EDDnp were resistant to hydrolysis by a-chymotrypsin. The high specifity of these substrates suggests their use for specific NEP assays in crude enzyme preparations

  3. Flexible Bragg reflection waveguide devices fabricated on a plastic substrate

    Science.gov (United States)

    Kim, Kyung-Jo; Yi, Jeong-Ah; Oh, Min-Cheol; Noh, Young-Ouk; Lee, Hyung-Jong

    2007-09-01

    Bragg reflecting waveguide devices are fabricated on a flexible substrate by using a post lift-off process in order to provide highly uniform grating patterns on a wide range. In this process, the flexible substrate spin-coated on silicon wafer is released after the final fabrication process of chip dicing. The fabricated flexible Bragg reflector shows very sharp transmission spectrum with 3-dB bandwidth of 0.1 nm and 10-dB bandwidth of 0.4 nm, which proves the Bragg reflector has excellent uniformity. To achieve athermal operation of the flexible Bragg reflector, thermal expansion property of the plastic substrate is controlled by the thickness of two polymer materials constructing the plastic substrate. The flexible substrate with 0.7-μm SU-8 layers sandwiching 100-μm NOA61 layer provides an optimized thermal expansion property to compensate the thermo-optic effect of the waveguide made of ZPU polymer. The temperature dependence of the Bragg reflector is decreased to -0.011 nm/°C through the incorporation of the plastic substrate.

  4. Flexible organic light-emitting device based on magnetron sputtered indium-tin-oxide on plastic substrate

    International Nuclear Information System (INIS)

    Wong, F.L.; Fung, M.K.; Tong, S.W.; Lee, C.S.; Lee, S.T.

    2004-01-01

    A radio-frequency sputtering deposition method was applied to prepare indium tin oxide (ITO) on a plastic substrate, polyethylene terephthalate (PET). The correlation of deposition conditions and ITO film properties was systematically investigated and characterized. The optimal ITO films had a transmittance of over 90% in the visible range (400-700 nm) and a resistivity of 5.0x10 -4 Ω-cm. Sequentially α-napthylphenylbiphenyl diamine, tris-(8-hydroxyquinoline) aluminium, and magnesium-silver were thermally deposited on the ITO-coated PET substrate to fabricate flexible organic light-emitting diodes (FOLEDs). The fabricated devices had a maximum current efficiency of ∼4.1 cd/A and a luminance of nearly 4100 cd/m 2 at 100 mA/cm 2 . These values showed that the FOLEDs had comparable performance characteristics with the conventional organic light-emitting diodes made on ITO-coated glasses with the same device configuration

  5. Fabrication and electrical resistivity of Mo-doped VO2 thin films coated on graphite conductive plates by a sol-gel method

    Energy Technology Data Exchange (ETDEWEB)

    Choi, W.; Jung, H.M.; Um, S. [Hanyang Univ., Seoul (Korea, Republic of). School of Mechanical Engineering

    2008-07-01

    Vanadium oxides (VO2) can be used in optical devices, thermochromic smart windows and sensors. This paper reported on a study in which vanadium pentoxide (V2O5) powder was prepared and mixed with Molybdenum Oxides (MoO3) to form Mo-doped and -undoped VO2 thin films by a sol-gel method on graphite conductive substrates. The micro-structure and chemical compositions of the Mo-doped and -undoped VO2 thin films was investigated using X-Ray diffraction and scanning electron microscopy. Changes in electrical resistivity were measured as a function of the stoichiometric compositions between vanadium and molybdenum. In this study. Mo-doped and -undoped VO2 thin films showed the typical metal to insulator transition (MIT), where temperature range could be adjusted by modifying the dopant atomic ratio. The through-plane substrate structure of the Mo-doped layer influences the electrical resistivity of the graphite substrate. As the amount of the molybdenum increases, the electrical resistivity of the graphite conductive substrate decreases in the lower temperature range below the freezing point of water. The experimental results showed that if carefully controlled, thermal dissipation of VO2 thin films can be used as a self-heating source to melt frozen water with the electrical current flowing through the graphite substrate. 3 refs., 3 figs.

  6. The Role of III-V Substrate Roughness and Deoxidation Induced by Digital Etch in Achieving Low Resistance Metal Contacts

    Directory of Open Access Journals (Sweden)

    Florent Ravaux

    2017-06-01

    Full Text Available To achieve low contact resistance between metal and III-V material, transmission-line-model (TLM structures of molybdenum (Mo were fabricated on indium phosphide (InP substrate on the top of an indium gallium arsenide (InGaAs layer grown by molecular beam epitaxy. The contact layer was prepared using a digital etch procedure before metal deposition. The contact resistivity was found to decrease significantly with the cleaning process. High Resolution Transmission & Scanning Electron Microscopy (HRTEM & HRSTEM investigations revealed that the surface roughness of treated samples was increased. Further analysis of the metal-semiconductor interface using Energy Electron Loss Spectroscopy (EELS showed that the amount of oxides (InxOy, GaxOy or AsxOy was significantly decreased for the etched samples. These results suggest that the low contact resistance obtained after digital etching is attributed to the combined effects of the induced surface roughness and oxides removal during the digital etch process.

  7. Expansion-matched passively cooled heatsinks with low thermal resistance for high-power diode laser bars

    Science.gov (United States)

    Leers, Michael; Scholz, Christian; Boucke, Konstantin; Poprawe, Reinhart

    2006-02-01

    The lifetime of high-power diode lasers, which are cooled by standard copper heatsinks, is limited. The reasons are the aging of the indium solder normally employed as well as the mechanical stress caused by the mismatch between the copper heatsink (16 - 17ppm/K) and the GaAs diode laser bars (6 - 7.5 ppm/K). For micro - channel heatsinks corrosion and erosion of the micro channels limit the lifetime additionally. The different thermal behavior and the resulting stress cannot be compensated totally by the solder. Expansion matched heatsink materials like tungsten-copper or aluminum nitride reduce this stress. A further possible solution is a combination of copper and molybdenum layers, but all these materials have a high thermal resistance in common. For high-power electronic or low cost medical applications novel materials like copper/carbon compound, compound diamond or high-conductivity ceramics were developed during recent years. Based on these novel materials, passively cooled heatsinks are designed, and thermal and mechanical simulations are performed to check their properties. The expansion of the heatsink and the induced mechanical stress between laser bar and heatsink are the main tasks for the simulations. A comparison of the simulation with experimental results for different material combinations illustrates the advantages and disadvantages of the different approaches. Together with the boundary conditions the ideal applications for packaging with these materials are defined. The goal of the development of passively-cooled expansion-matched heatsinks has to be a long-term reliability of several 10.000h and a thermal resistance below 1 K/W.

  8. Application of gas-fired infra-red radiator to thermal disinfection of horticultural substrate

    International Nuclear Information System (INIS)

    Wawer, M.; Osiński, A.

    1998-01-01

    The studies were carried out on heating horticultural substrate (moor peat - bark, 1:1 by volume) with a gas-fired infra-red radiator to destroy the pests and pathogens. Minimum distance between radiator and substrate surface was determined considering assumed time of heating. Dynamics of substrate heating was determined depending on its layer thickness and kind of surface under substrate layer; black rubber, ground steel sheet and aluminium foil were used as the surface. Considerable decreasing of infra-red radiation penetrability through the substrate layer above 7 mm thick was found as well as an significant effect of the radiation reflected from the surface under substrate layer on the intensity of its heating. It was also stated that heating horticultural substrates with the gas-fired infra-red radiator enables to rise the temperature of thin substrate layer up to 70 degree of C within relatively short time [pl

  9. The growth of high density network of MOF nano-crystals across macroporous metal substrates - Solvothermal synthesis versus rapid thermal deposition

    Science.gov (United States)

    Maina, James W.; Gonzalo, Cristina Pozo; Merenda, Andrea; Kong, Lingxue; Schütz, Jürg A.; Dumée, Ludovic F.

    2018-01-01

    Fabrication of metal organic framework (MOF) films and membranes across macro-porous metal substrates is extremely challenging, due to the large pore sizes across the substrates, poor wettability, and the lack of sufficient reactive functional groups on the surface, which prevent high density nucleation of MOF crystals. Herein, macroporous stainless steel substrates (pore size 44 × 40 μm) are functionalized with amine functional groups, and the growth of ZIF-8 crystals investigated through both solvothermal synthesis and rapid thermal deposition (RTD), to assess the role of synthesis routes in the resultant membranes microstructure, and subsequently their performance. Although a high density of well interconnected MOF crystals was observed across the modified substrates following both techniques, RTD was found to be a much more efficient route, yielding high quality membranes under 1 h, as opposed to the 24 h required for solvothermal synthesis. The RTD membranes also exhibited high gas permeance, with He permeance of up to 2.954 ± 0.119 × 10-6 mol m-2 s-1 Pa-1, and Knudsen selectivities for He/N2, Ar/N2 and CO2/N2, suggesting the membranes were almost defect free. This work opens up route for efficient fabrication of MOF films and membranes across macro-porous metal supports, with potential application in electrically mediated separation applications.

  10. Thermal conductivity and Kapitza resistance of epoxy resin fiberglass tape at superfluid helium temperature

    Science.gov (United States)

    Baudouy, B.; Polinski, J.

    2009-03-01

    The system of materials composed of fiberglass epoxy resin impregnated tape constitutes in many cases the electrical insulation for "dry"-type superconducting accelerator magnet such as Nb 3Sn magnets. Nb 3Sn magnet technology is still under development in a few programs to reach higher magnetic fields than what NbTi magnets can produce. The European program, Next European Dipole (NED), is one of such programs and it aims to develop and construct a 15 T class Nb 3Sn magnet mainly for upgrading the Large Hardron Collider. Superfluid helium is considered as one possible coolant and since the magnet has been designed with a "dry" insulation, the thermal conductivity and the Kapitza resistance of the electrical insulation are the key properties that must be know for the thermal design of such a magnet. Accordingly, property measurements of the epoxy resin fiberglass tape insulation system developed for the NED project was carried out in superfluid helium. Four sheets with thicknesses varying from 40 to 300 μm have been tested in a steady-state condition. The determined thermal conductivity, k, is [(25.8 ± 2.8) · T - (12.2 ± 4.9)] × 10 -3 W m -1 K -1 and the Kapitza resistance is given by R K = (1462 ± 345) · T(-1.86 ± 0.41) × 10 -6 Km 2 W -1 in the temperature range of 1.55-2.05 K.

  11. Molecular dynamics study on heat transport from single-walled carbon nanotubes to Si substrate

    Energy Technology Data Exchange (ETDEWEB)

    Feng, Ya; Zhu, Jie, E-mail: zhujie@iet.cn; Tang, Da-Wei

    2015-02-06

    In this paper, non-equilibrium molecular dynamics simulations were performed to investigate the heat transport between a vertically aligned single-walled carbon nanotube (SWNT) and Si substrate, to find out the influence of temperature and system sizes, including diameter and length of SWNT and measurements of substrate. Results revealed that high temperature hindered heat transport in SWNT itself but was a beneficial stimulus for heat transport at interface of SWNT and Si. Furthermore, the system sizes strongly affected the peaks in vibrational density of states of Si, which led to interfacial thermal conductance dependent on system sizes. - Highlights: • NEMD is performed to simulate the heat transport from SWNT to Si substrate. • We analyze both interfacial thermal conductance and thermal conductivity of SWNT. • High temperature is a beneficial stimulus for heat transport at the interface. • Interfacial thermal conductance strongly depends on the sizes of SWNT and substrate. • We calculate VDOS of C and Si atoms to analyze phonon couplings between them.

  12. Pristine carbon nanotubes based resistive temperature sensor

    International Nuclear Information System (INIS)

    Alam, Md Bayazeed; Saini, Sudhir Kumar; Sharma, Daya Shankar; Agarwal, Pankaj B.

    2016-01-01

    A good sensor must be highly sensitive, faster in response, of low cost cum easily producible, and highly reliable. Incorporation of nano-dimensional particles/ wires makes conventional sensors more effective in terms of fulfilling the above requirements. For example, Carbon Nanotubes (CNTs) are promising sensing element because of its large aspect ratio, unique electronic and thermal properties. In addition to their use for widely reported chemical sensing, it has also been explored for temperature sensing. This paper presents the fabrication of CNTs based temperature sensor, prepared on silicon substrate using low cost spray coating method, which is reliable and reproducible method to prepare uniform CNTs thin films on any substrate. Besides this, simple and inexpensive method of preparation of dispersion of single walled CNTs (SWNTs) in 1,2 dichlorobenzene by using probe type ultrasonicator for debundling the CNTs for improving sensor response were used. The electrical contacts over the dispersed SWNTs were taken using silver paste electrodes. Fabricated sensors clearly show immediate change in resistance as a response to change in temperature of SWNTs. The measured sensitivity (change in resistance with temperature) of the sensor was found ∼ 0.29%/°C in the 25°C to 60°C temperature range.

  13. Pristine carbon nanotubes based resistive temperature sensor

    Energy Technology Data Exchange (ETDEWEB)

    Alam, Md Bayazeed, E-mail: bayazeed786@gmail.com [CSIR-Central Electronics Engineering Research Institute (CEERI, Pilani, India) (India); Jamia Millia Islamia (New Delhi, India) (India); Saini, Sudhir Kumar, E-mail: sudhirsaini1310@gmail.com [CSIR-Central Electronics Engineering Research Institute (CEERI, Pilani, India) (India); Sharma, Daya Shankar, E-mail: dssharmanit15@gmail.com [CSIR-Central Electronics Engineering Research Institute (CEERI, Pilani, India) (India); Maulana Azad National Institute of Technology (MANIT, Bhopal, India) (India); Agarwal, Pankaj B., E-mail: agarwalbpankj@gmail.com [CSIR-Central Electronics Engineering Research Institute (CEERI, Pilani, India) (India); Academy for Scientific and Innovative Research (AcSIR, Delhi, India) (India)

    2016-04-13

    A good sensor must be highly sensitive, faster in response, of low cost cum easily producible, and highly reliable. Incorporation of nano-dimensional particles/ wires makes conventional sensors more effective in terms of fulfilling the above requirements. For example, Carbon Nanotubes (CNTs) are promising sensing element because of its large aspect ratio, unique electronic and thermal properties. In addition to their use for widely reported chemical sensing, it has also been explored for temperature sensing. This paper presents the fabrication of CNTs based temperature sensor, prepared on silicon substrate using low cost spray coating method, which is reliable and reproducible method to prepare uniform CNTs thin films on any substrate. Besides this, simple and inexpensive method of preparation of dispersion of single walled CNTs (SWNTs) in 1,2 dichlorobenzene by using probe type ultrasonicator for debundling the CNTs for improving sensor response were used. The electrical contacts over the dispersed SWNTs were taken using silver paste electrodes. Fabricated sensors clearly show immediate change in resistance as a response to change in temperature of SWNTs. The measured sensitivity (change in resistance with temperature) of the sensor was found ∼ 0.29%/°C in the 25°C to 60°C temperature range.

  14. On the field dependent surface resistance of niobium on copper cavities

    CERN Document Server

    Junginger, Tobias

    2015-01-01

    The surface resistance Rs of superconducting cavities prepared by sputter coating a thin niobium film on a copper substrate increases significantly stronger with the applied RF field compared to cavities of bulk material. A possible cause is that due to the thermal boundary resistance between the copper substrate and the niobium film Rs is enhanced due to global heating of the inner cavity wall. Introducing helium gas in the cavity and measuring its pressure as a function of applied field allowed to conclude that the inner surface of the cavity is heated up by only 60+/-60 mK when Rs increases with Eacc by 100 nOhm. This is more than one order of magnitude less than what one would expect from global heating. Additionally the effect of cooldown speed and low temperature baking have been investigated in the framework of these experiments. It is shown that for current state of the art niobium on copper cavities there is only a detrimental effect of low temperature baking. A fast cooldown results in a lowered Rs.

  15. Assessment of proliferation resistance of thermal recycle systems

    International Nuclear Information System (INIS)

    1979-02-01

    An assessment is made of the proliferation resistance of thermal recycle systems. The safeguards aspects are not addressed. Three routes to the acquisition of materials for nuclear weapons are addressed namely; a deliberate political decision by a government involving the use of dedicated facilities, a deliberate political decision by government involving abuse of nuclear fuel cycle facilities and theft by a subnational group. The most sensitive parts of the reference fuel cycle and the alternative technical measures are examined to judge their relative sensitivity. This is done by examining the difference forms in which plutonium can exist in the fuel cycle. The role which different institutional arrangements can play is also evaluated. From this comparative assessment it is concluded that, taking into account the qualitative nature of the assessment, the different stages of development of the various fuel cycles, the various realizations possible in respect of the deployment of facilities within individual countries and the evolutionary nature of the technical and institutional improvements foreseeable no fuel cycle can be made completely free from abuse. Furthermore it appears that following progressive introduction of features that will improve proliferation resistance there will not be significant differences between the various fuel cycles when compared at the point in time when they are introduced into widespread use. Provided such features are developed and implemented there is no reason on proliferation grounds to prefer one cycle to another

  16. Degradation Characterization of Thermal Interface Greases

    Energy Technology Data Exchange (ETDEWEB)

    Major, Joshua [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Narumanchi, Sreekant V [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Paret, Paul P [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Blackman, Gregory [DuPont; Wong, Arnold [DuPont; Meth, Jeffery [DuPont

    2018-02-12

    Thermal interface materials (TIMs) are used in power electronics packaging to minimize thermal resistance between the heat generating component and the heat sink. Thermal greases are one such class. The conformability and thin bond line thickness (BLT) of these TIMs can potentially provide low thermal resistance throughout the operation lifetime of a component. However, their performance degrades over time due to pump-out and dry-out during thermal and power cycling. The reliability performance of greases through operational cycling needs to be quantified to develop new materials with superior properties. NREL, in collaboration with DuPont, has performed thermal and reliability characterization of several commercially available thermal greases. Initial bulk and contact thermal resistance of grease samples were measured, and then the thermal degradation that occurred due to pump-out and dry-out during temperature cycling was monitored. The thermal resistances of five different grease materials were evaluated using NREL's steady-state thermal resistance tester based on the ASTM test method D5470. Greases were then applied, utilizing a 2.5 cm x 2.5 cm stencil, between invar and aluminum plates to compare the thermomechanical performance of the materials in a representative test fixture. Scanning Acoustic microscopy, thermal, and compositional analyses were performed periodically during thermal cycling from -40 degrees C to 125 degrees C. Completion of this characterization has allowed for a comprehensive evaluation of thermal greases both for their initial bulk and contact thermal performance, as well as their degradation mechanisms under accelerated thermal cycling conditions.

  17. Applications in the Nuclear Industry for Corrosion-Resistant Amorphous-Metal Thermal-Spray Coatings

    International Nuclear Information System (INIS)

    Farmer, J; Choi, J

    2007-01-01

    Amorphous metal and ceramic thermal spray coatings have been developed that can be used to enhance the corrosion resistance of containers for the transportation, aging and disposal of spent nuclear fuel and high-level radioactive wastes. Fe-based amorphous metal formulations with chromium, molybdenum and tungsten have shown the corrosion resistance believed to be necessary for such applications. Rare earth additions enable very low critical cooling rates to be achieved. The boron content of these materials, and their stability at high neutron doses, enable them to serve as high efficiency neutron absorbers for criticality control. Ceramic coatings may provide even greater corrosion resistance for container applications, though the boron-containing amorphous metals are still favored for criticality control applications. These amorphous metal and ceramic materials have been produced as gas atomized powders and applied as near full density, non-porous coatings with the high-velocity oxy-fuel process. This paper summarizes the performance of these coatings as corrosion-resistant barriers, and as neutron absorbers. Relevant corrosion models are also discussed, as well as a cost model to quantify the economic benefits possible with these new materials

  18. Flow resistance of orifices and spacers of BWR thermal-hydraulic and neutronic coupling loop

    International Nuclear Information System (INIS)

    Iguchi, Tadashi; Asaka, Hideaki; Nakamura, Hideo

    2002-03-01

    Authors are performing THYNC experiments to study thermal-hydraulic instability under neutronic and thermal-hydraulic coupling. In THYNC experiments, the orifices are installed at the exit of the test section and the spacers are installed in the test section, in order to properly simulate in-core thermal-hydraulics in the reactor core. It is necessary to know the flow resistance of the orifices and spacers for the analysis of THYNC experimental results. Consequently, authors measured the flow resistance of orifice and spacer under single-phase and two-phase flows. Using the experimental results, authors investigated the dependency of the flow resistances on the parameters, such as pressure, mass flux, an geometries. Furthermore, authors investigated the applicability of the basic two-phase flow models, for example the separate flow model, to the two-phase flow multiplier. As the result of the investigation on the single-phase flow experiment, it was found (1) that the effects of pressure and mass flux flow resistance are described by a function of Reynolds number, and (2) that flow resistances of the orifice and the spacer are calculated with the previous prediction methods. However, it was necessary to introduce an empirical coefficient, since it was difficult to predict accurately the flow resistance only with the previous prediction method due to the complicated geometry dependency, for example a flow area blockage ratio. On the other hand, according to the investigation on two-phase flow experiment, the followings were found. (1) Relation between the two-phase flow multiplier and the quality is regarded to be linear under pressure of 2MPa - 7MPa. The relation is dependent on pressure and geometry, and is little dependent on mass flux. (2) Relation between the two-phase flow multiplier and void fraction is little dependent on pressure, mass flux, and geometry under pressure of 0.2MPa - 7MPa and void fraction less than 0.6. The relation is less dependent on

  19. Field dependent surface resistance of niobium on copper cavities

    Directory of Open Access Journals (Sweden)

    T. Junginger

    2015-07-01

    Full Text Available The surface resistance R_{S} of superconducting cavities prepared by sputter coating a niobium film on a copper substrate increases significantly stronger with the applied rf field compared to cavities of bulk material. A possible cause is that the thermal boundary resistance between the copper substrate and the niobium film induces heating of the inner cavity wall, resulting in a higher R_{S}. Introducing helium gas in the cavity, and measuring its pressure as a function of applied field allowed to conclude that the inner surface of the cavity is heated up by less than 120 mK when R_{S} increases with E_{acc} by 100  nΩ. This is more than one order of magnitude less than what one would expect from global heating. Additionally, the effects of cooldown speed and low temperature baking have been investigated in the framework of these experiments. It is shown that for the current state of the art niobium on copper cavities there is only a detrimental effect of low temperature baking. A fast cooldown results in a lowered R_{S}.

  20. Ag Nanorods-Oxide Hybrid Array Substrates: Synthesis, Characterization, and Applications in Surface-Enhanced Raman Scattering

    Directory of Open Access Journals (Sweden)

    Lingwei Ma

    2017-08-01

    Full Text Available Over the last few decades, benefitting from the sufficient sensitivity, high specificity, nondestructive, and rapid detection capability of the surface-enhanced Raman scattering (SERS technique, numerous nanostructures have been elaborately designed and successfully synthesized as high-performance SERS substrates, which have been extensively exploited for the identification of chemical and biological analytes. Among these, Ag nanorods coated with thin metal oxide layers (AgNRs-oxide hybrid array substrates featuring many outstanding advantages have been proposed as fascinating SERS substrates, and are of particular research interest. The present review provides a systematic overview towards the representative achievements of AgNRs-oxide hybrid array substrates for SERS applications from diverse perspectives, so as to promote the realization of real-world SERS sensors. First, various fabrication approaches of AgNRs-oxide nanostructures are introduced, which are followed by a discussion on the novel merits of AgNRs-oxide arrays, such as superior SERS sensitivity and reproducibility, high thermal stability, long-term activity in air, corrosion resistivity, and intense chemisorption of target molecules. Next, we present recent advances of AgNRs-oxide substrates in terms of practical applications. Intriguingly, the recyclability, qualitative and quantitative analyses, as well as vapor-phase molecule sensing have been achieved on these nanocomposites. We further discuss the major challenges and prospects of AgNRs-oxide substrates for future SERS developments, aiming to expand the versatility of SERS technique.