WorldWideScience

Sample records for soldering process monitoring

  1. Soldering handbook

    CERN Document Server

    Vianco, Paul T

    1999-01-01

    Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

  2. Optimization of the soldering process by the DMAIC methodology

    Directory of Open Access Journals (Sweden)

    Michał Zasadzień

    2016-06-01

    Full Text Available The chapter presents the use of the DMAIC method for the analysis and improvement of the process of soldering pins in a plug connecting a bundle of wires to the board of a controller; a part of the steering system of a car. The main problem in the soldering process, that is an unsatisfactory share of bad soldered connections between the board and the plug and the instability of that number, was identified by means of a five-phase improvement process. Key points and main causes of the defect were pointed out, and process improvement measures were suggested. Due to the analysis conducted and the correct implementation of improvement measures the share of defective connections has been decreased twofold.

  3. Soldering in electronics assembly

    CERN Document Server

    Judd, Mike

    2013-01-01

    Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

  4. A flip chip process based on electroplated solder bumps

    Science.gov (United States)

    Salonen, J.; Salmi, J.

    1994-01-01

    Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin count and packaging density and superior electrical performance. The chips are mounted upside down on the substrate, which can be made of silicon, ceramic, glass or - in some cases - even PCB. The extra processing steps required for chips are the deposition of a suitable thin film metal layer(s) on the standard Al pad and the formation of bumps. Also, the development of new fine line substrate technologies is required to utilize the full potential of the technology. In our bumping process, bump deposition is done by electroplating, which was chosen for its simplicity and economy. Sputter deposited molybdenum and copper are used as thin film layers between the aluminum pads and the solder bumps. A reason for this choice is that the metals can be selectively etched after bumping using the bumps as a mask, thus circumventing the need for a separate mask for etching the thin film metals. The bumps are electroplated from a binary Pb-Sn bath using a thick liquid photoresist. An extensively modified commercial flip chip bonder is used for alignment and bonding. Heat assisted tack bonding is used to attach the chips to the substrate, and final reflow joining is done without flux in a vacuum furnace.

  5. Contamination profile on typical printed circuit board assemblies vs soldering process

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

  6. Improvement of the auto wire feeder machine in a de-soldering process

    Directory of Open Access Journals (Sweden)

    Niramon Nonkhukhetkhong

    2016-10-01

    Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

  7. The micro-droplet behavior of a molten lead-free solder in an inkjet printing process

    International Nuclear Information System (INIS)

    Tsai, M H; Chou, H H; Hwang, W S

    2009-01-01

    An experimental investigation on the droplet formation of molten Sn3.0 wt%Ag0.5 wt%Cu alloy by an inkjet printing process was conducted. The printing process used a piezoelectric print head with a nozzle orifice diameter of 50 µm. Micro-droplets of a molten lead-free solder were ejected at 230 °C. The print head was driven by a bipolar pulse 40 V in amplitude. The major variables for this study were two pulse times; t rise /t finalrise and t fall , as well as N 2 back-pressure in the molten solder reservoir. Under various printing conditions, extrusion of the liquid column, contraction of liquid thread and pinch-off of liquid thread at nozzle exit were observed by monitoring the dynamics of the molten solder droplet ejection process. The droplet formation was found to be insensitive to t rise and t finalrise in the range of 250–1000 µs. The behavior of droplet formation was, however, significantly affected by the transfer rate, t fall , in the range of 30–60 µs and t fall of 50 µs yielded the most desirable condition of single droplet formation. The N 2 back-pressure was also found to be critical, where a back pressure between 10 and 21 kPa could give the desirable single-droplet formation condition

  8. Characterizing performances of solder paste printing process at flexible manufacturing lines

    International Nuclear Information System (INIS)

    Siew, Jit Ping; Low, Heng Chin; Teoh, Ping Chow

    2015-01-01

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter

  9. Characterizing performances of solder paste printing process at flexible manufacturing lines

    Energy Technology Data Exchange (ETDEWEB)

    Siew, Jit Ping; Low, Heng Chin [University of Science Malaysia, 11800 Minden, Penang (Malaysia); Teoh, Ping Chow [Wawasan Open University, 54 Jalan Sultan Ahmad Shah, 10050 Penang (Malaysia)

    2015-02-03

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter.

  10. Processing and Characterization of NiTi Shape Memory Alloy Particle Reinforced Sn-In Solders

    National Research Council Canada - National Science Library

    Chung, Kohn C

    2006-01-01

    .... In previous work, it was proposed that reinforcement of solder by NiTi shape memory alloy particles to form smart composite solder reduces the inelastic strain of the solder and hence, may enhance...

  11. Process monitoring

    International Nuclear Information System (INIS)

    Anon.

    1981-01-01

    Many of the measurements and observations made in a nuclear processing facility to monitor processes and product quality can also be used to monitor the location and movements of nuclear materials. In this session information is presented on how to use process monitoring data to enhance nuclear material control and accounting (MC and A). It will be seen that SNM losses can generally be detected with greater sensitivity and timeliness and point of loss localized more closely than by conventional MC and A systems if process monitoring data are applied. The purpose of this session is to enable the participants to: (1) identify process unit operations that could improve control units for monitoring SNM losses; (2) choose key measurement points and formulate a loss indicator for each control unit; and (3) describe how the sensitivities and timeliness of loss detection could be determined for each loss indicator

  12. THE POSSIBILITY OF USING LASER-ULTRASOUND TO MONITOR THE QUALITY SOLDERED CONNECTIONS CHAMBERS OF LIQUID ROCKET ENGINES

    Directory of Open Access Journals (Sweden)

    N. V. Astredinova

    2014-01-01

    Full Text Available During the manufacturing process to the design of modern liquid rocket engines are presented important requirements, such as minimum weight, maximum stiffness and strength of nodes, maximum service life in operation, high reliability and quality of soldered and welded seams. Due to the high quality requirements soldered connections and the specific design of the nozzle, it became necessary in the development and testing of a new non-conventional non-destructive testing method – laser-ultrasound diagnosis. In accordance with regulatory guidelines, quality control soldered connections is allowed to use an acoustic kind of control methods of the reflected light, transmitted light, resonant, free vibration and acoustic emission. Attempts to use traditional methods of non-destructive testing did not lead to positive results. This is due primarily to the size of typical solder joint defects, as well as the structural features of the rocket engine, the data structure is not controllable. In connection with this, a new method that provides quality control soldered connections cameras LRE based on the thermo generation of ultrasound. Methods of ultrasonic flaw detection of photoacoustic effect, in most cases, have a number of advantages over methods that use standard (traditional piezo transducers. In the course of studies have found that the sensitivity of the laser-ultrasonic method and flaw detector UDL-2M can detect lack of adhesion in the solder joints on the upper edges of the nozzle in the sub-header area of the site.

  13. Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

    International Nuclear Information System (INIS)

    Chellvarajoo, Srivalli; Abdullah, M.Z.; Samsudin, Z.

    2015-01-01

    Highlights: • Fe 2 NiO 4 nanoparticles added into SAC 305 by mechanical mixing to form nanocomposite solder paste. • Nanoparticles in the composite solder travels with flux to the outermost surface after reflow. • The intermetallics compound reduced with the addition of nanoparticles into solder paste. • The hardness increased with the addition of limited percentage of nanoparticles into SAC 305. - Abstract: This study investigates the effects of the addition of Fe 2 NiO 4 nanoparticles into a SAC-305 lead-free solder paste. Iron, nickel, and oxide nano-elements were mixed with Pb-free solder alloying elements to produce a new form of nanocomposite solder paste, which can be a promising material in electronic packaging. The SAC-305 was mechanically added with 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles. The migration of nanoparticles in the nanocomposite solder paste to the outermost surface was clarified using the copper ‘sandwich’ method, which was performed after the reflow soldering process. Varying amounts of nanoparticles in the SAC-305 affected the IMC thickness and mechanical properties of the nanocomposite solder paste. The IMC thickness was reduced by 29.15%, 42.37%, and 59.00% after adding 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles in the SAC-305, respectively. However, via nanoindentation method, the hardness of the nanocomposite solder was improved by 44.07% and 56.82% after adding 0.5 and 1.5 wt.% of Fe 2 NiO 4 nanoparticles, respectively. If the addition of Fe 2 NiO 4 nanoparticle exceeded 1.5 wt.%, the hardness increased infinitely

  14. On the problem of soldering refractory metals with silver-containing solders

    International Nuclear Information System (INIS)

    Anikeev, E.F.; Andryushchenko, V.I.; Chepelenko, V.N.; Batov, V.M.

    1981-01-01

    The processes of wetting, spreading and interphase interactions of copper-silver liquid alloys alloyed with Ni and Si, with niobium, tantalum, molybdenum, tungsten, 12Kh18N10T steel and nickel are studied. It has been determined that Ni or Si additions into the copper-silver solder improve the wetting and adhesion. When soldering with the alloy containing Ni additions, the strength of a soldered Joint grows with the increase of soldering duration while soldering with the alloy containing Si additions, the strength decreases. That is why Ni-containing solders are preferable for soldering thick-walled structures, and Si-containing solders - for thin-walled structures [ru

  15. A wireless intraocular pressure monitoring device with a solder-filled microchannel antenna

    International Nuclear Information System (INIS)

    Varel, Çağdaş; Shih, Yi-Chun; Otis, Brian P; Böhringer, Karl F; Shen, Tueng S

    2014-01-01

    This paper presents the prototype of an intraocular pressure sensor as a major step toward building a device that can be permanently implanted during cataract surgery. The implantation will proceed through an incision of 2–3 mm using an injector, during which the complete device must be folded into a cross-section of 2 mm × 1 mm. The device uses radio frequency (RF) for wireless power and data transfer. The prototype includes an antenna, an RF chip and a pressure sensor assembled on a printed circuit board with several circuit components used for testing and calibration. The antenna is fabricated and integrated with the circuit using a fabrication method employing solder-filled microchannels embedded in an elastomer. The monitoring device is powered at 2.716 GHz from a distance of 1–2 cm. The prototype has undergone electrical and mechanical tests for antenna and sensor performance. The flexible antenna can withstand a stress of 33.4 kPa without any electrical disconnection. It did not show a significant increase in electrical resistance after 50 bending cycles with a maximum applied stress of 116 kPa. Transmitted pressure data shows an averaged sensitivity of 16.66 Hz (mm-Hg) –1 . (paper)

  16. Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process

    Science.gov (United States)

    Mallik, S.; Bauer, R.; Hübner, F.; Ekere, N. N.

    2011-01-01

    Solder paste is the most widely used interconnection material in the electronic assembly process for attaching electronic components/devices directly onto the surface of printed circuit boards, using stencil printing process. This paper evaluates the performance of three different commercially available Sn-Ag-Cu solder pastes formulated with different particle size distributions (PSD), metal content and alloy composition. A series of stencil printing tests were carried out using a specially designed stencil of 75 μm thickness and apertures of 300×300 μm2 dimension and 500 μm pitch sizes. Solder paste printing behaviors were found related to attributes such as slumping and surface tension and printing performance was correlated with metal content and PSD. The results of the study should benefit paste manufacturers and SMT assemblers to improve their products and practices.

  17. Processing and characterization of device solder interconnection and module attachment for power electronics modules

    Science.gov (United States)

    Haque, Shatil

    This research is focused on the processing of an innovative three-dimensional packaging architecture for power electronics building blocks with soldered device interconnections and subsequent characterization of the module's critical interfaces. A low-cost approach termed metal posts interconnected parallel plate structure (MPIPPS) was developed for packaging high-performance modules of power electronics building blocks (PEBB). The new concept implemented direct bonding of copper posts, not wire bonding of fine aluminum wires, to interconnect power devices as well as joining the different circuit planes together. We have demonstrated the feasibility of this packaging approach by constructing PEBB modules (consisting of Insulated Gate Bipolar Transistors (IGBTs), diodes, and a few gate driver elements and passive components). In the 1st phase of module fabrication with IGBTs with Si3N 4 passivation, we had successfully fabricated packaged devices and modules using the MPIPPS technique. These modules were tested electrically and thermally, and they operated at pulse-switch and high power stages up to 6kW. However, in the 2nd phase of module fabrication with polyimide passivated devices, we experienced significant yield problems due to metallization difficulties of these devices. The under-bump metallurgy scheme for the development of a solderable interface involved sputtering of Ti-Ni-Cu and Cr-Cu, and an electroless deposition of Zn-Ni-Au metallization. The metallization process produced excellent yield in the case of Si3N4 passivated devices. However, under the same metallization schemes, devices with a polyimide passivation exhibited inconsistent electrical contact resistance. We found that organic contaminants such as hydrocarbons remain in the form of thin monolayers on the surface, even in the case of as-received devices from the manufacturer. Moreover, in the case of polyimide passivated devices, plasma cleaning introduced a few carbon constituents on the

  18. Spontaneous soldering

    International Nuclear Information System (INIS)

    Percacci, R.

    1984-01-01

    It is proposed that the soldering form of general relativity be treated as a dynamical variable. This gives rise to the possibility of treating the linear connection on (n-dimensional) spacetime and an internal O(k)-Yang-Mills field as different components of the same O(N) gauge field (N= n+k). The distinction between gravitational and Yang-Mills interactions is due to a kind of Higgs mechanism driven by the vacuum expectation value of the soldering form. (orig.)

  19. Handbook of machine soldering SMT and TH

    CERN Document Server

    Woodgate, Ralph W

    1996-01-01

    A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

  20. Solderability study of RABiTS-based YBCO coated conductors

    International Nuclear Information System (INIS)

    Zhang Yifei; Duckworth, Robert C.; Ha, Tam T.; Gouge, Michael J.

    2011-01-01

    Study examines the implication of solder and flux selection in YBCO splice joints. Focus is on commercially available RABiTS-based YBCO coated conductors. Solderability varied with solder and flux for three different stabilizations tested. Resistivity of stabilizer was dominant factor in splice joint resistance. Solder materials affected splice joint resistance when solderability was poor. The solderability of commercially available YBa 2 Cu 3 O 7-x (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

  1. Efforts to Develop a 300°C Solder

    Energy Technology Data Exchange (ETDEWEB)

    Norann, Randy A [Perma Works LLC

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  2. SMT soldering handbook

    National Research Council Canada - National Science Library

    Strauss, Rudolf

    1998-01-01

    ... 3.2.1 Constituents, melting behaviour and mechanical properties 3.2.2 Composition of solders for use in electronics 3.2.3 Lead-free solders 3.2.4 Solder impurities The soldered joint 3.3.1 Solde...

  3. Safer Soldering Guidelines and Instructional Resources

    Science.gov (United States)

    Love, Tyler S.; Tomlinson, Joel

    2018-01-01

    Soldering is a useful and necessary process for many classroom, makerspace, Fab Lab, technology and engineering lab, and science lab activities. As described in this article, soldering can pose many safety risks without proper engineering controls, standard operating procedures, and direct instructor supervision. There are many safety hazards…

  4. Monitoring of operating processes

    International Nuclear Information System (INIS)

    Barry, R.F.

    1981-01-01

    Apparatus is described for monitoring the processes of a nuclear reactor to detect off-normal operation of any process and for testing the monitoring apparatus. The processes are evaluated by response to their paramters, such as temperature, pressure, etc. The apparatus includes a pair of monitoring paths or signal processing units. Each unit includes facilities for receiving on a time-sharing basis, a status binary word made up of digits each indicating the status of a process, whether normal or off-normal, and test-signal binary words simulating the status binary words. The status words and test words are processed in succession during successive cycles. During each cycle, the two units receive the same status word and the same test word. The test words simulate the status words both when they indicate normal operation and when they indicate off-normal operation. Each signal-processing unit includes a pair of memories. Each memory receives a status word or a test word, as the case may be, and converts the received word into a converted status word or a converted test word. The memories of each monitoring unit operate into a non-coincidence which signals non-coincidence of the converted word out of one memory of a signal-processing unit not identical to the converted word of the other memory of the same unit

  5. Features of soldering of molybdenum a lols

    International Nuclear Information System (INIS)

    Grishin, V.L.; Rybkin, B.V.; Cherkasov, A.F.

    1980-01-01

    Soldering features of complex-alloy molybdenum alloys were investigated in comparison with alloys based on solid solutions. Soldering features of heterogeneous molybdenum base alloys were investigated using samples of 0.5-1.O mm sheets with the strain of about 95% made of ingots which had been smelted in arc vacuum furnaces. The soldering of samples was carried out in 5x1O -5 mm Hg vacuum using different sources of heating: radiation, electron-ray and contact. It was shown that heat-resisting soldered joints of heterogeneous molybdenum alloys could be produced using zirconium and niobium base solders containing the most effective hardeners of the parent material (titanum, vanadium, tantalum, molybdenum, tungsten). To preserve high mechanical properties of heterogeneous alloys it was expedient to use for welding local heating sources which permitted to decrease considerably temperature- time conditions of the process

  6. Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process.

    Science.gov (United States)

    Li, Z L; Dong, H J; Song, X G; Zhao, H Y; Tian, H; Liu, J H; Feng, J C; Yan, J C

    2018-04-01

    Homogeneous (Cu, Ni) 6 Sn 5 intermetallic compound (IMC) joints were rapidly formed in asymmetrical Ni/Sn/Cu system by an ultrasound-induced transient liquid phase (TLP) soldering process. In the traditional TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system consisted of major (Cu, Ni) 6 Sn 5 and minor Cu 3 Sn IMCs, and the grain morphology of (Cu, Ni) 6 Sn 5 IMCs subsequently exhibited fine rounded, needlelike and coarse rounded shapes from the Ni side to the Cu side, which was highly in accordance with the Ni concentration gradient across the joints. However, in the ultrasound-induced TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system only consisted of the (Cu, Ni) 6 Sn 5 IMCs which exhibited an uniform grain morphology of rounded shape with a remarkably narrowed Ni concentration gradient. The ultrasound-induced homogeneous intermetallic joints exhibited higher shear strength (61.6 MPa) than the traditional heterogeneous intermetallic joints (49.8 MPa). Copyright © 2017 Elsevier B.V. All rights reserved.

  7. Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    McNally, K.M.; Sorg, B.S.; Welch, A.J.; Dawes, J.M.; Owen, E.R.

    1999-01-01

    Low-strength anastomoses and thermal damage of tissue are major concerns in laser tissue welding techniques where laser energy is used to induce thermal changes in the molecular structure of the tissues being joined, hence allowing them to bond together. Laser tissue soldering, on the other hand, is a bonding technique in which a protein solder is applied to the tissue surfaces to be joined, and laser energy is used to bond the solder to the tissue surfaces. The addition of protein solders to augment tissue repair procedures significantly reduces the problems of low strength and thermal damage associated with laser tissue welding techniques. Investigations were conducted to determine optimal solder and laser parameters for tissue repair in terms of tensile strength, temperature rise and damage and the microscopic nature of the bonds formed. An in vitro study was performed using an 808 nm diode laser in conjunction with indocyanine green (ICG)-doped albumin protein solders to repair bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The efficacy of temperature feedback control in enhancing the soldering process was also investigated. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the repairs. A reduction in dye concentration from 2.5mgml -1 to 0.25mgml -1 was also found to result in an increase in tensile strength. Increasing the laser irradiance and thus surface temperature resulted in an increased severity of histological injury. Thermal denaturation of tissue collagen and necrosis of the intimal layer smooth muscle cells increased laterally and in depth with higher temperatures. The strongest repairs were produced with an irradiance of 6.4Wcm -2 using a solid protein solder composed of 60% BSA and 0.25mgml -1 ICG. Using this combination of laser and solder parameters, surface temperatures were observed to reach 85±5 deg. C with a

  8. Scalable Manufacturing of Solderable and Stretchable Physiologic Sensing Systems.

    Science.gov (United States)

    Kim, Yun-Soung; Lu, Jesse; Shih, Benjamin; Gharibans, Armen; Zou, Zhanan; Matsuno, Kristen; Aguilera, Roman; Han, Yoonjae; Meek, Ann; Xiao, Jianliang; Tolley, Michael T; Coleman, Todd P

    2017-10-01

    Methods for microfabrication of solderable and stretchable sensing systems (S4s) and a scaled production of adhesive-integrated active S4s for health monitoring are presented. S4s' excellent solderability is achieved by the sputter-deposited nickel-vanadium and gold pad metal layers and copper interconnection. The donor substrate, which is modified with "PI islands" to become selectively adhesive for the S4s, allows the heterogeneous devices to be integrated with large-area adhesives for packaging. The feasibility for S4-based health monitoring is demonstrated by developing an S4 integrated with a strain gauge and an onboard optical indication circuit. Owing to S4s' compatibility with the standard printed circuit board assembly processes, a variety of commercially available surface mount chip components, such as the wafer level chip scale packages, chip resistors, and light-emitting diodes, can be reflow-soldered onto S4s without modifications, demonstrating the versatile and modular nature of S4s. Tegaderm-integrated S4 respiration sensors are tested for robustness for cyclic deformation, maximum stretchability, durability, and biocompatibility for multiday wear time. The results of the tests and demonstration of the respiration sensing indicate that the adhesive-integrated S4s can provide end users a way for unobtrusive health monitoring. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  9. Evaluation of process influences on surface chemistry of epoxy acrylate based solder mask via XPS, ToF-SIMS and contact angle measurement

    Energy Technology Data Exchange (ETDEWEB)

    Hofmeister, Caroline, E-mail: caroline.hofmeister@de.bosch.com [Robert Bosch GmbH, Postfach 30 02 40, 70442 Stuttgart (Germany); Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, Wiener Str. 12, 28359 Bremen (Germany); Maaß, Sebastian [Robert Bosch GmbH, Postfach 30 02 40, 70442 Stuttgart (Germany); Fladung, Thorsten; Mayer, Bernd [Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, Wiener Str. 12, 28359 Bremen (Germany)

    2017-01-01

    Epoxy acrylate based solder mask formulations were conditioned by different printed circuit board (PCB) manufacturing and PCB assembly process stages. Depending on these different influences the chemistry of the solder mask surface was investigated regarding adhesion to possible adhesion partners. The combination of X-ray photoelectron spectrometry (XPS), time-of-flight secondary ion mass spectrometry (ToF-SIMS) and the contact angle method, for surface energy determination, provided a detailed understanding of the surface near region up to the topmost monolayer, which forms the contact zone in which adhesion takes place. The combination of ToF-SIMS and XPS provided molecular information of surface components comprising quantitative information. The influences of all process steps, like UV, chemical and thermal treatment, on the chemical surface composition and appearance were identified. Based on the results a chemical surface model could be created regarding the different adhesion mechanisms. It has been shown that an enrichment of siloxanes at the surface is generated by different mechanisms that were distinguished based on ToF-SIMS. Even though an oxidation process in the surface near region (10 nm) was indicated by XPS, no increase of the surface polar groups and thus no polarity increase could be observed within the first monolayer. A surface model derived from the analysis results shows generation and occupation of free sites at the surface through all stages of the process. An occupation of free sites by siloxanes from additives in the solder mask formulation results in a siloxane dominated topmost monolayer. - Highlights: • A surface model describing the process influences is proposed. • Detailed siloxane reaction analysis was possible with ToF-SIMS. • Photo-chemical, chemical and thermal surface modification occur during PCB manufacturing.

  10. Effect of Solder Flux Residues on Corrosion of Electronics

    DEFF Research Database (Denmark)

    Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per

    2009-01-01

    Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA...... testing and use in the field, consequences and recommendations are given. Failures, caused by harsh[1] customer environments, are not covered in this paper....

  11. Laser tissue welding mediated with a protein solder

    Science.gov (United States)

    Small, Ward, IV; Heredia, Nicholas J.; Celliers, Peter M.; Da Silva, Luiz B.; Eder, David C.; Glinsky, Michael E.; London, Richard A.; Maitland, Duncan J.; Matthews, Dennis L.; Soltz, Barbara A.

    1996-05-01

    A study of laser tissue welding mediated with an indocyanine green dye-enhanced protein solder was performed. Freshly obtained sections of porcine artery were used for the experiments. Sample arterial wall thickness ranged from two to three millimeters. Incisions approximately four millimeters in length were treated using an 805 nanometer continuous- wave diode laser coupled to a one millimeter diameter fiber. Controlled parameters included the power delivered by the laser, the duration of the welding process, and the concentration of dye in the solder. A two-color infrared detection system was constructed to monitor the surface temperatures achieved at the weld site. Burst pressure measurements were made to quantify the strengths of the welds immediately following completion of the welding procedure.

  12. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Directory of Open Access Journals (Sweden)

    Liu Mei Lee

    2013-01-01

    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  13. Cluster processing business level monitor

    International Nuclear Information System (INIS)

    Muniz, Francisco J.

    2017-01-01

    This article describes a Cluster Processing Monitor. Several applications with this functionality can be freely found doing a search in the Google machine. However, those applications may offer more features that are needed on the Processing Monitor being proposed. Therefore, making the monitor output evaluation difficult to be understood by the user, at-a-glance. In addition, such monitors may add unnecessary processing cost to the Cluster. For these reasons, a completely new Cluster Processing Monitor module was designed and implemented. In the CDTN, Clusters are broadly used, mainly, in deterministic methods (CFD) and non-deterministic methods (Monte Carlo). (author)

  14. Cluster processing business level monitor

    Energy Technology Data Exchange (ETDEWEB)

    Muniz, Francisco J., E-mail: muniz@cdtn.br [Centro de Desenvolvimento da Tecnologia Nuclear (CDTN/CNEN-MG), Belo Horizonte, MG (Brazil)

    2017-07-01

    This article describes a Cluster Processing Monitor. Several applications with this functionality can be freely found doing a search in the Google machine. However, those applications may offer more features that are needed on the Processing Monitor being proposed. Therefore, making the monitor output evaluation difficult to be understood by the user, at-a-glance. In addition, such monitors may add unnecessary processing cost to the Cluster. For these reasons, a completely new Cluster Processing Monitor module was designed and implemented. In the CDTN, Clusters are broadly used, mainly, in deterministic methods (CFD) and non-deterministic methods (Monte Carlo). (author)

  15. Soldering of Mg Joints Using Zn-Al Solders

    Science.gov (United States)

    Gancarz, Tomasz; Berent, Katarzyna; Skuza, Wojciech; Janik, Katarzyna

    2018-04-01

    Magnesium has applications in the automotive and aerospace industries that can significantly contribute to greater fuel economy and environmental conservation. The Mg alloys used in the automotive industry could reduce mass by up to 70 pct, providing energy savings. However, alongside the advantages there are limitations and technological barriers to use Mg alloys. One of the advantages concerns phenomena occurring at the interface when joining materials investigated in this study, in regard to the effect of temperature and soldering time for pure Mg joints. Eutectic Zn-Al and Zn-Al alloys with 0.05 (wt pct) Li and 0.2 (wt pct) Na were used in the soldering process. The process was performed for 3, 5, and 8 minutes of contact, at temperatures of 425 °C, 450 °C, 475 °C, and 500 °C. Selected, solidified solder-substrate couples were cross-sectioned, and their interfacial microstructures were investigated by scanning electron microscopy. The experiment was designed to demonstrate the effect of time, temperature, and the addition of Li and Na on the kinetics of the dissolving Mg substrate. The addition of Li and Na to eutectic Zn-Al caused to improve mechanical properties. Higher temperatures led to reduced joint strength, which is caused by increased interfacial reaction.

  16. A novel method for direct solder bump pull testing using lead-free solders

    Science.gov (United States)

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  17. Thermomechanical fatigue life prediction for several solders

    Science.gov (United States)

    Wen, Shengmin

    Since solder connections operate at high homologous temperature, solders are high temperature materials. This feature makes their mechanical behavior and fatigue phenomena unique. Based on experimental findings, a physical damage mechanism is introduced for solders. The mechanism views the damage process as a series of independent local damage events characterized by the failure of individual grains, while the structural damage is the eventual percolation result of such local events. Fine's dislocation energy density concept and Mura's microcrack initiation theory are adopted to derive the fatigue formula for an individual grain. A physical damage metric is introduced to describe the material with damage. A unified creep and plasticity constitutive model is adopted to simulate the mechanical behavior of solders. The model is cast into a continuum damage mechanics framework to simulate material with damage. The model gives good agreement with the experimental results of 96.5Pb-3.5Sn and 96.5Sn-3.5Ag solders under uniaxial strain-controlled cyclic loading. The model is convenient for implementation into commercial computational packages. Also presented is a fatigue theory with its failure criterion for solders based on physical damage mechanism. By introducing grain orientation into the fatigue formula, an m-N curve (m is Schmid factor) at constant loading condition is suggested for fatigue of grains with different orientations. A solder structure is defined as fatigued when the damage metric reaches a critical threshold, since at this threshold the failed grains may form a cluster and percolate through the structure according to percolation theory. Fatigue data of 96.5Pb-3.5Sn solder bulk specimens under various uniaxial tension tests were analyzed. Results show that the theory gives consistent predictions under broad conditions, while inelastic strain theory does not. The theory is anisotropic with no size limitation to its application, which could be suitable for

  18. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    Directory of Open Access Journals (Sweden)

    Mohd Nizam Ab. Rahman

    2014-12-01

    Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

  19. Mechanical properties of Bi-In-Zn/ Cu solder joint system

    International Nuclear Information System (INIS)

    Ervina Efzan Mohd Noor; Mohammed Noori Ridha; Ahmad Badri Ismail; Nurulakmal Mohd Sharif; Kuan Yew Cheong; Tadashi Ariga; Zuhailawati Hussain

    2009-01-01

    Full text: In recent years, the pollution of environment from lead (Pb) and Pb-containing compounds in microelectronic devices attracts more and more attentions in academia and industry; the lead-free solder alloys begin to replace the lead-based solders in packaging process of some devices and components. In this works, microstructure and mechanical properties of different reflow temperature (80, 100, 120 and 140 degree Celsius) for solder joints on shear strength of Bi-In-Zn lead free solder with low melting temperature of 60 degree Celsius on Cu solder joint has been investigated. This paper will compared the mechanical properties of the Bi-In-Zn lead-free solder alloys with current lead-free solder, Sn-Ag-Cu solder alloy. The fracture surface analyses have been observed by Optical Microscope and were investigated by Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX) and proved it by X-ray diffraction (XRD). (author)

  20. Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly

    Energy Technology Data Exchange (ETDEWEB)

    Mostafa Shalaby, Rizk; Kamal, Mustafa [Metal Physics Laboratory, Physics Department, Faculty of Science, Mansoura University, P.O.Box: 35516, Mansoura (Egypt); Ali, Esmail A.M. [Basic Science Department, Faculty of Engineering, University of Science & Technology (Yemen); Gumaan, Mohammed S., E-mail: m.gumaan1@gmail.com [Metal Physics Laboratory, Physics Department, Faculty of Science, Mansoura University, P.O.Box: 35516, Mansoura (Egypt); Basic Science Department, Faculty of Engineering, University of Science & Technology (Yemen)

    2017-04-06

    This paper aims to investigate the reliability of mechanical and creep behavior for the eutectic Sn-Ag and Sn-Ag-Cu Solder joints rapidly solidified after hot compressing (HC) in terms of structural changes and its relationship with thermal behavior, which has been discussed and compared with their properties before HC process by Mustafa et al. (2016) . These solder joints were prepared by melt-spinning technique and tested by HC at 30 MPa pressure and 150 °C for 90 min, their structural, mechanical and thermal properties after HC process have been investigated by X-ray diffraction (XRD), dynamic resonance techniques (DRT) and differential scanning calorimetry (DSC) techniques respectively and compared with these solders before HC. The results revealed that the pressure caused some fractures on the solders morphology surfaces. But some benefits for these solders have been occurred, like eliminating the internal stresses through recrystallization process whose evidence by the particle size increases after they HC, stabilized structure after HC was due to the metastable phases rearrangements, new intermetallic compounds (IMCs) formation, decreasing, melting temperature range (∆T), lattice strains (ƹ) and entropy change (S). These sequential benefits are considered to be the main reasons which lead to decreasing energy loss (Q{sup −1}), creep rate (É›) and thermal stability enhancement. Elastic modulus increment might be due to low elastic lattice distortions after HC, while the stress exponent (n) reduction refers to viscous glide mechanism of deformation after HC instead of climb deformation mechanism before HC.

  1. Visual detection of defects in solder joints

    Science.gov (United States)

    Blaignan, V. B.; Bourbakis, Nikolaos G.; Moghaddamzadeh, Ali; Yfantis, Evangelos A.

    1995-03-01

    The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new `frame' for the achievement of better results regarding efficiency, products quality and automated service. In this paper the visual detection and classification of different types of defects on solder joints in PC boards is presented by combining several image processing methods, such as smoothing, segmentation, edge detection, contour extraction and shape analysis. The results of this paper are based on simulated solder defects and a real one.

  2. Integration of environmentally compatible soldering technologies for waste minimization

    International Nuclear Information System (INIS)

    Hosking, F.M.

    1992-01-01

    There has been a concentrated effort throughout the international microelectronics industry to phase out chlorofluorocarbon (CFC) materials and alleviate the serious problem of ozone depletion created by the release of CFCS. The development of more environmentally compatible manufacturing technologies is the cornerstone of this effort. Alternative materials and processes for cleaning and soldering have received special attention. Electronic. soldering typically utilizes rosin-based fluxes to promote solder wettability. Flux residues must be removed from the soldered parts when high product reliability is essential. Halogenated or CFC solvents have been the principle chemicals used to clean the residues. With the accelerated push to eliminate CFCs in the US by 1995, CFC-free solvents, aqueous-based cleaning, water soluble or ''no clean'' fluxes, and fluxless soldering technologies are being developed and quickly integrated into manufacturing practice. Sandia's Center for Solder Science and Technology has been ch g a variety of fluxless and alternative soldering technologies for DOE's waste minimization program. The work has focused on controlled atmosphere, laser, and ultrasonic fluxless soldering, protective metallic and organic coatings, and fluxes which have water soluble or low solids-based chemistries. With the increasing concern that Pb will also be banned from electronic soldering, Sandia has been characterizing the wetting, aging, and mechanical properties of Pb-fire solder alloys. The progress of these integrated studies will be discussed. Their impact on environmentally compatible manufacturing will be emphasized. Since there is no universal solution to the various environmental, safety, and health issues which currently face industry, the proposed technologies offer several complementary materials and processing options from which one can choose

  3. Environmental and process monitoring technologies

    International Nuclear Information System (INIS)

    Vo-Dinh, Tuan

    1993-01-01

    The objective of this conference was to provide a multidisciplinary forum dealing with state-of-the-art methods and instrumentation for environmental and process monitoring. In the last few years, important advances have been made in improving existing analytical methods and developing new techniques for trace detection of chemicals. These monitoring technologies are a topic of great interest for environmental and industrial control in a wide spectrum of areas. Sensitive detection, selective characterization, and cost-effective analysis are among the most important challenges facing monitoring technologies. This conference integrating interdisciplinary research and development was aimed to present the most recent advances and applications in the important areas of environmental and process monitoring. Separate abstracts have been prepared for 34 papers for inclusion in the appropriate data bases

  4. Influence of solder joint length to the mechanical aspect during the thermal stress analysis

    Science.gov (United States)

    Tan, J. S.; Khor, C. Y.; Rahim, Wan Mohd Faizal Wan Abd; Ishak, Muhammad Ikman; Rosli, M. U.; Jamalludin, Mohd Riduan; Zakaria, M. S.; Nawi, M. A. M.; Aziz, M. S. Abdul; Ani, F. Che

    2017-09-01

    Solder joint is an important interconnector in surface mount technology (SMT) assembly process. The real time stress, strain and displacement of the solder joint is difficult to observe and assess the experiment. To tackle these problems, simulation analysis was employed to study the von Mises stress, strain and displacement in the thermal stress analysis by using Finite element based software. In this study, a model of leadless electronic package was considered. The thermal stress analysis was performed to investigate the effect of the solder length to those mechanical aspects. The simulation results revealed that solder length gives significant effect to the maximum von Mises stress to the solder joint. Besides, changes in solder length also influence the displacement of the solder joint in the thermal environment. The increment of the solder length significantly reduces the von Mises stress and strain on the solder joint. Thus, the understanding of the physical parameter for solder joint is important for engineer prior to designing the solder joint of the electronic component.

  5. Multivariate process monitoring of EAFs

    Energy Technology Data Exchange (ETDEWEB)

    Sandberg, E.; Lennox, B.; Marjanovic, O.; Smith, K.

    2005-06-01

    Improved knowledge of the effect of scrap grades on the electric steelmaking process and optimised scrap loading practices increase the potential for process automation. As part of an ongoing programme, process data from four Scandinavian EAFs have been analysed, using the multivariate process monitoring approach, to develop predictive models for end point conditions such as chemical composition, yield and energy consumption. The models developed generally predict final Cr, Ni and Mo and tramp element contents well, but electrical energy consumption, yield and content of oxidisable and impurity elements (C, Si, Mn, P, S) are at present more difficult to predict. Potential scrap management applications of the prediction models are also presented. (author)

  6. Characterization of lead-free solders for electronic packaging

    Science.gov (United States)

    Ma, Hongtao

    The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (Th > 0.5T m even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn-Pb solder alloys. In this research, mechanical measurements of isothermal aging effects and the resulting changes in the materials behavior of lead-free solders were performed. A novel specimen preparation procedure was developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process. Using specimens fabricated with the developed procedure, isothermal aging effects and viscoplastic material behavior evolution have been characterized for 95.5Sn-4.0Ag-0.5Cu (SAC405) and 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solders, which are commonly used as the solder ball alloy in lead-free BGAs and other components. Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Up to 40% reduction in tensile strength was observed for water quenched specimens after two months of aging at room temperature. Creep deformation also increased dramatically with increasing aging durations. Microstructural changes during room temperature aging were also observed and recorded for the solder alloys and correlated with the observed mechanical behavior changes. Aging effects at elevated temperatures for up to 6 months were also investigated. Thermal aging caused significant tensile strength loss and deterioration of creep deformation. The thermal aging results also showed that after an initial tensile strength drop, the Sn-Pb eutectic solder reached a relatively stable stage after 200 hours of aging. However, for SAC alloy, both the tensile and

  7. Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

    Directory of Open Access Journals (Sweden)

    Saliza Azlina O.

    2016-01-01

    Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

  8. Soldering formalism in noncommutative field theory: a brief note

    International Nuclear Information System (INIS)

    Ghosh, Subir

    2004-01-01

    In this Letter, I develop the soldering formalism in a new domain--the noncommutative planar field theories. The soldering mechanism fuses two distinct theories showing opposite or complimentary properties of some symmetry, taking into account the interference effects. The above mentioned symmetry is hidden in the composite (or soldered) theory. In the present work it is shown that a pair of noncommutative Maxwell-Chern-Simons theories, having opposite signs in their respective topological terms, can be consistently soldered to yield the Proca model (Maxwell theory with a mass term) with corrections that are at least quadratic in the noncommutativity parameter. We further argue that this model can be thought of as the noncommutative generalization of the Proca theory of ordinary spacetime. It is well known that abelian noncommutative gauge theory bears a close structural similarity with non-abelian gauge theory. This fact is manifested in a non-trivial way if the present Letter is compared with existing literature, where soldering of non-abelian models are discussed. Thus the present work further establishes the robustness of the soldering programme. The subtle role played by gauge invariance (or the lack of it), in the above soldering process, is revealed in an interesting way

  9. Monitoring of polymer melt processing

    International Nuclear Information System (INIS)

    Alig, Ingo; Steinhoff, Bernd; Lellinger, Dirk

    2010-01-01

    The paper reviews the state-of-the-art of in-line and on-line monitoring during polymer melt processing by compounding, extrusion and injection moulding. Different spectroscopic and scattering techniques as well as conductivity and viscosity measurements are reviewed and compared concerning their potential for different process applications. In addition to information on chemical composition and state of the process, the in situ detection of morphology, which is of specific interest for multiphase polymer systems such as polymer composites and polymer blends, is described in detail. For these systems, the product properties strongly depend on the phase or filler morphology created during processing. Examples for optical (UV/vis, NIR) and ultrasonic attenuation spectra recorded during extrusion are given, which were found to be sensitive to the chemical composition as well as to size and degree of dispersion of micro or nanofillers in the polymer matrix. By small-angle light scattering experiments, process-induced structures were detected in blends of incompatible polymers during compounding. Using conductivity measurements during extrusion, the influence of processing conditions on the electrical conductivity of polymer melts with conductive fillers (carbon black or carbon nanotubes) was monitored. (topical review)

  10. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Haiyan [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Peng, Jianke [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Fu, Li, E-mail: fuli@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Wang, Xincheng [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Xie, Yan [School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China)

    2016-04-15

    Graphical abstract: - Highlights: • The wetting angle of lead free solder on Cu was reduced by surface microstructure. • The wetting form of Sn-Ag-Cu solder on Cu was “non-composite surface”. • The experimental results had a sound fit with the theoretical calculation. - Abstract: In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  11. Soldering of Nanotubes onto Microelectrodes

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing sold...... bonds were consistently found to be mechanically stronger than the carbon nanotubes.......Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...

  12. The metallurgical approach on the solder voids behaviour in surface mount devices

    International Nuclear Information System (INIS)

    Mohabattul Zaman Bukhari

    1996-01-01

    Solder voids are believed to cause poor heat dissiption in the Surface Mount devices and reduce the reliability of the devices at higher operating services. There are a lot of factors involved in creating voids such as gas/flux entrapment, wettability, outgasseous, air bubbles in the solder paste, inconsistency of solder coverage and improper metal scheme selection. This study was done to observe the behaviour of the solder voids in term of flux entrapmentt and wettability. It is believed that flux entrapment and wettability are verify this hypothesis. Two types of metal scheme were chosen which are Nickel (Ni) plated and Tin (Sn) plated heatsink. X-ray techniques such as Radiographic Inspection Analysis and EDAX were used to detect the minute solder voids. The solder voids observed on the heatsinks and Copper shims after the reflow process are believed to be a non contact voids that resulted from some portion of the surface not wetting properly

  13. Characteristics of solder joints under fatigue loads using piezomechanical actuation

    Science.gov (United States)

    Shim, Dong-Jin; Spearing, S. Mark

    2003-07-01

    Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezo-ceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

  14. Lead-free solder technology transfer from ASE Americas

    Energy Technology Data Exchange (ETDEWEB)

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

  15. Portal monitoring technology control process

    International Nuclear Information System (INIS)

    York, R.L.

    1998-01-01

    Portal monitors are an important part of the material protection, control, and accounting (MPC and A) programs in Russia and the US. Although portal monitors are only a part of an integrated MPC and A system, they are an effective means of controlling the unauthorized movement of special nuclear material (SNM). Russian technical experts have gained experience in the use of SNM portal monitors from US experts ad this has allowed them to use the monitors more effectively. Several Russian institutes and companies are designing and manufacturing SNM portal monitors in Russia. Interactions between Russian and US experts have resulted in improvements to the instruments. SNM portal monitor technology has been effectively transferred from the US to Russia and should be a permanent part of the Russian MPC and A Program. Progress in the implementation of the monitors and improvements to how they are used are discussed

  16. Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

    Science.gov (United States)

    Huang, Chien-Sheng; Jang, Guh-Yaw; Duh, Jenq-Gong

    2004-04-01

    Nickel-based under bump metallization (UBM) has been widely used as a diffusion barrier to prevent the rapid reaction between the Cu conductor and Sn-based solders. In this study, joints with and without solder after heat treatments were employed to evaluate the diffusion behavior of Cu in the 63Sn-37Pb/Ni/Cu/Ti/Si3N4/Si multilayer structure. The atomic flux of Cu diffused through Ni was evaluated from the concentration profiles of Cu in solder joints. During reflow, the atomic flux of Cu was on the order of 1015-1016 atoms/cm2s. However, in the assembly without solder, no Cu was detected on the surface of Ni even after ten cycles of reflow. The diffusion behavior of Cu during heat treatments was studied, and the soldering-process-induced Cu diffusion through Ni metallization was characterized. In addition, the effect of Cu content in the solder near the solder/intermetallic compound (IMC) interface on interfacial reactions between the solder and the Ni/Cu UBM was also discussed. It is evident that the (Cu,Ni)6Sn5 IMC might form as the concentration of Cu in the Sn-Cu-Ni alloy exceeds 0.6 wt.%.

  17. Automation of experimental research of waveguide paths induction soldering

    Science.gov (United States)

    Tynchenko, V. S.; Petrenko, V. E.; Kukartsev, V. V.; Tynchenko, V. V.; Antamoshkin, O. A.

    2018-05-01

    The article presents an automated system of experimental studies of the waveguide paths induction soldering process. The system is a part of additional software for a complex of automated control of the technological process of induction soldering of thin-walled waveguide paths from aluminum alloys, expanding its capabilities. The structure of the software product, the general appearance of the controls and the potential application possibilities are presented. The utility of the developed application by approbation in a series of field experiments was considered and justified. The application of the experimental research system makes it possible to improve the process under consideration, providing the possibility of fine-tuning the control regulators, as well as keeping the statistics of the soldering process in a convenient form for analysis.

  18. Commentary: Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    Menovsky, T.; Beek, J.F.; Gemert, M.J.C. van

    1999-01-01

    Full text: Laser tissue welding is the process of using laser energy to join tissues without sutures or with a reduced number of sutures. Recently, diode lasers have been added to the list of fusion lasers (Lewis and Uribe 1993, Reali et al 1993). Typically, for tissue welding, deep penetrating diode lasers emitting at 800-810 nm are used, in combination with a strong absorbing protein solder containing the dye indocyanine green. Indocyanine green has a maximum absorption coefficient at 805 nm and binds preferentially with proteins (Sauda et al 1986). The greatest advantage of diode lasers is their compact size, easy use and low cost. In this issue of Physics in Medicine and Biology (pp 983-1002, 'Photothermal effects of laser tissue soldering'), in an in vitro study, McNally et al investigate the optimal laser settings and welding temperatures in relation to the tensile strength and thermal damage of bovine aorta specimens. An interesting statement in their introduction is that the low strength of laser produced anastomoses can lead to aneurysm formation. The increased chance of aneurysm formation may merely be due to the thermal effect of the laser on the vascular wall, especially on the adventitia and media layers, which become necrotic after thermal injury. Subsequent haemodynamic stress exerted on a damaged vascular wall is a significant contributing factor for aneurysmal initiation. Also interesting is the remark that 'by the application of wavelength-specific chromophores in tissue welding ... the requirement for precise focusing and aiming of the laser beam may be removed'. Though perhaps not yet fully justified, this statement, if true, would facilitate surgical procedures. While the experiments are conducted in a proper manner, the use of bovine aorta specimens, which were stored at -70 deg. C and subsequently thawed for the tissue welding experiments, may not be the most appropriate for studying tissue effects or tensile strength measurements, as the

  19. Engineering Process Monitoring for Control Room Operation

    OpenAIRE

    Bätz, M

    2001-01-01

    A major challenge in process operation is to reduce costs and increase system efficiency whereas the complexity of automated process engineering, control and monitoring systems increases continuously. To cope with this challenge the design, implementation and operation of process monitoring systems for control room operation have to be treated as an ensemble. This is only possible if the engineering of the monitoring information is focused on the production objective and is lead in close coll...

  20. Solder joint technology materials, properties, and reliability

    CERN Document Server

    Tu, King-Ning

    2007-01-01

    Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

  1. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xiao, H., E-mail: xiaohui2013@yahoo.com.cn; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-11-25

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R{sub 0}/R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints.

  2. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    International Nuclear Information System (INIS)

    Xiao, H.; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-01-01

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R 0 /R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints

  3. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  4. Soldering and brazing safety guide: A handbook on space practice for those involved in soldering and brazing

    Science.gov (United States)

    This manual provides those involved in welding and brazing with effective safety procedures for use in performance of their jobs. Hazards exist in four types of general soldering and brazing processes: (1) cleaning; (2) application of flux; (3) application of heat and filler metal; and (4) residue cleaning. Most hazards during those operations can be avoided by using care, proper ventilation, protective clothing and equipment. Specific process hazards for various methods of brazing and soldering are treated. Methods to check ventilation are presented as well as a check of personal hygiene and good maintenance practices are stressed. Several emergency first aid treatments are described.

  5. Integrated Monitoring System of Production Processes

    Directory of Open Access Journals (Sweden)

    Oborski Przemysław

    2016-12-01

    Full Text Available Integrated monitoring system for discrete manufacturing processes is presented in the paper. The multilayer hardware and software reference model was developed. Original research are an answer for industry needs of the integration of information flow in production process. Reference model corresponds with proposed data model based on multilayer data tree allowing to describe orders, products, processes and save monitoring data. Elaborated models were implemented in the integrated monitoring system demonstrator developed in the project. It was built on the base of multiagent technology to assure high flexibility and openness on applying intelligent algorithms for data processing. Currently on the base of achieved experience an application integrated monitoring system for real production system is developed. In the article the main problems of monitoring integration are presented, including specificity of discrete production, data processing and future application of Cyber-Physical-Systems. Development of manufacturing systems is based more and more on taking an advantage of applying intelligent solutions into machine and production process control and monitoring. Connection of technical systems, machine tools and manufacturing processes monitoring with advanced information processing seems to be one of the most important areas of near future development. It will play important role in efficient operation and competitiveness of the whole production system. It is also important area of applying in the future Cyber-Physical-Systems that can radically improve functionally of monitoring systems and reduce the cost of its implementation.

  6. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Directory of Open Access Journals (Sweden)

    Xiuyun Zhou

    2015-10-01

    Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  7. Effect of Joint Scale and Processing on the Fracture of Sn-3Ag-0.5Cu Solder Joints: Application to Micro-bumps in 3D Packages

    Science.gov (United States)

    Talebanpour, B.; Huang, Z.; Chen, Z.; Dutta, I.

    2016-01-01

    In 3-dimensional (3D) packages, a stack of dies is vertically connected to each other using through-silicon vias and very thin solder micro-bumps. The thinness of the micro-bumps results in joints with a very high volumetric proportion of intermetallic compounds (IMCs), rendering them much more brittle compared to conventional joints. Because of this, the reliability of micro-bumps, and the dependence thereof on the proportion of IMC in the joint, is of substantial concern. In this paper, the growth kinetics of IMCs in thin Sn-3Ag-0.5Cu joints attached to Cu substrates were analyzed, and empirical kinetic laws for the growth of Cu6Sn5 and Cu3Sn in thin joints were obtained. Modified compact mixed mode fracture mechanics samples, with adhesive solder joints between massive Cu substrates, having similar thickness and IMC content as actual micro-bumps, were produced. The effects of IMC proportion and strain rate on fracture toughness and mechanisms were investigated. It was found that the fracture toughness G C decreased with decreasing joint thickness ( h Joint). In addition, the fracture toughness decreased with increasing strain rate. Aging also promoted alternation of the crack path between the two joint-substrate interfaces, possibly proffering a mechanism to enhance fracture toughness.

  8. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

  9. Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

    DEFF Research Database (Denmark)

    Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper

    2009-01-01

    of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling. solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft....... The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers...

  10. Process monitoring by display devices

    International Nuclear Information System (INIS)

    Eggerdinger, C.; Schattner, R.

    1984-01-01

    The use of extensive automation, regulating, protection and limiting devices and the application of ergonomic principles (e.g. the increased use of mimic diagrams) has led to plant being capable of continued operation. German nuclear power stations are in top position worldwide as regards safety and availability. However, there is already a requirement to overcome the unmanageable state due to the large number and miniaturization of elements by renewed efforts. An attempt at this made with conventional technology is represented by a mimic board, which was provided in a powerstation just being set to work. Such mimic boards give the opportunity of monitoring the most important parameters at a glance but there are limits to their use due to the large space required. The use of VDU screens represents a possibility of solving this problem. (orig./DG) [de

  11. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    International Nuclear Information System (INIS)

    Li Guangdong; Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu

    2010-01-01

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  12. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    Energy Technology Data Exchange (ETDEWEB)

    Li Guangdong, E-mail: liguangdong@emails.bjut.edu.c [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China); Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China)

    2010-02-18

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  13. Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints

    International Nuclear Information System (INIS)

    Liu, X.W.; Plumbridge, W.J.

    2003-01-01

    The fatigue of Sn-37 wt.% Pb model solder joints has been investigated under thermomechanical and thermal cycling. Based upon an analysis of displacements during thermomechancial cycling, a model solder joint has been designed to simulate actual joints in electronic packages. The strain-stress relationship, characterised by hysteresis loops, was determined during cycling from 30 to 125 deg. C, and the stress-range monitored throughout. The number of cycles to failure, as defined by the fall in stress range, was correlated to strain range and strain energy. The strain hardening exponent, k, varied with the definition of failure and, when a stress-range drop of 50% was used, it was 0.46. Cracks were produced during pure thermal cycling without external strains applied. These arose due to the local strains caused by thermal expansion mismatches between the solder and Cu 6 Sn 5 intermetallic layer, between the phases of solder, and due to the anisotropy of the materials. The fatigue life under thermomechanical cycling was significantly inferior to that obtained in isothermal mechanical cycling. A factor contributing to this inferiority is the internal damage produced during temperature cycling

  14. Engineering Process Monitoring for Control Room Operation

    CERN Document Server

    Bätz, M

    2001-01-01

    A major challenge in process operation is to reduce costs and increase system efficiency whereas the complexity of automated process engineering, control and monitoring systems increases continuously. To cope with this challenge the design, implementation and operation of process monitoring systems for control room operation have to be treated as an ensemble. This is only possible if the engineering of the monitoring information is focused on the production objective and is lead in close collaboration of control room teams, exploitation personnel and process specialists. In this paper some principles for the engineering of monitoring information for control room operation are developed at the example of the exploitation of a particle accelerator at the European Laboratory for Nuclear Research (CERN).

  15. Thermomechanical behavior of tin-rich (lead-free) solders

    Science.gov (United States)

    Sidhu, Rajen Singh

    In order to adequately characterize the behavior of ball-grid-array (BGA) Pb-free solder spheres in electronic devices, the microstructure and thermomechanical behavior need to be studied. Microstructure characterization of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-3.9Ag-0.7Cu alloys was conducted using optical microscopy, scanning electron microscopy, transmission electron microscopy, image analysis, and a novel serial sectioning 3D reconstruction process. Microstructure-based finite-element method (FEM) modeling of deformation in Sn-3.5Ag alloy was conducted, and it will be shown that this technique is more accurate when compared to traditional unit cell models for simulating and understanding material behavior. The effect of cooling rate on microstructure and creep behavior of bulk Sn-rich solders was studied. The creep behavior was evaluated at 25, 95, and 120°C. Faster cooling rates were found to increase the creep strength of the solders due to refinement of the solder microstructure. The creep behavior of Sn-rich single solder spheres reflowed on Cu substrates was studied at 25, 60, 95, and 130°C. Testing was conducted using a microforce testing system, with lap-shear geometry samples. The solder joints displayed two distinct creep behaviors: (a) precipitation-strengthening (Sn-3.5Ag and Sn-3.9Ag-0.7Cu) and (b) power law creep accommodated by grain boundary sliding (GBS) (Sn and Sn-0.7Cu). The relationship between microstructural features (i.e. intermetallic particle size and spacing), stress exponents, threshold stress, and activation energies are discussed. The relationship between small-length scale creep behavior and bulk behavior is also addressed. To better understand the damage evolution in Sn-rich solder joints during thermal fatigue, the local damage will be correlated to the cyclic hysteresis behavior and crystal orientations present in the Sn phase of solder joints. FEM modeling will also be utilized to better understand the macroscopic and local

  16. Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints

    Science.gov (United States)

    Mukherjee, S.; Chauhan, P.; Osterman, M.; Dasgupta, A.; Pecht, M.

    2016-07-01

    Mechanistic microstructural models have been developed to capture the effect of isothermal aging on time dependent viscoplastic response of Sn3.0Ag0.5Cu (SAC305) solders. SnAgCu (SAC) solders undergo continuous microstructural coarsening during both storage and service because of their high homologous temperature. The microstructures of these low melting point alloys continuously evolve during service. This results in evolution of creep properties of the joint over time, thereby influencing the long term reliability of microelectronic packages. It is well documented that isothermal aging degrades the creep resistance of SAC solder. SAC305 alloy is aged for (24-1000) h at (25-100)°C (~0.6-0.8 × T melt). Cross-sectioning and image processing techniques were used to periodically quantify the effect of isothermal aging on phase coarsening and evolution. The parameters monitored during isothermal aging include size, area fraction, and inter-particle spacing of nanoscale Ag3Sn intermetallic compounds (IMCs) and the volume fraction of micronscale Cu6Sn5 IMCs, as well as the area fraction of pure tin dendrites. Effects of microstructural evolution on secondary creep constitutive response of SAC305 solder joints were then modeled using a mechanistic multiscale creep model. The mechanistic phenomena modeled include: (1) dispersion strengthening by coarsened nanoscale Ag3Sn IMCs in the eutectic phase; and (2) load sharing between pro-eutectic Sn dendrites and the surrounding coarsened eutectic Sn-Ag phase and microscale Cu6Sn5 IMCs. The coarse-grained polycrystalline Sn microstructure in SAC305 solder was not captured in the above model because isothermal aging does not cause any significant change in the initial grain size and orientation of SAC305 solder joints. The above mechanistic model can successfully capture the drop in creep resistance due to the influence of isothermal aging on SAC305 single crystals. Contribution of grain boundary sliding to the creep strain of

  17. Automatically processed alpha-track radon monitor

    International Nuclear Information System (INIS)

    Langner, G.H. Jr.

    1993-01-01

    An automatically processed alpha-track radon monitor is provided which includes a housing having an aperture allowing radon entry, and a filter that excludes the entry of radon daughters into the housing. A flexible track registration material is located within the housing that records alpha-particle emissions from the decay of radon and radon daughters inside the housing. The flexible track registration material is capable of being spliced such that the registration material from a plurality of monitors can be spliced into a single strip to facilitate automatic processing of the registration material from the plurality of monitors. A process for the automatic counting of radon registered by a radon monitor is also provided

  18. Soluble Lead and Bismuth Chalcogenidometallates: Versatile Solders for Thermoelectric Materials

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Hao [Department; Son, Jae Sung [Department; School; Dolzhnikov, Dmitriy S. [Department; Filatov, Alexander S. [Department; Hazarika, Abhijit [Department; Wang, Yuanyuan [Department; Hudson, Margaret H. [Department; Sun, Cheng-Jun [Advanced; Chattopadhyay, Soma [Physical; Talapin, Dmitri V. [Department; Center

    2017-07-27

    Here we report the syntheses of largely unexplored lead and bismuth chalcogenidometallates in the solution phase. Using N2H4 as the solvent, new compounds such as K6Pb3Te6·7N2H4 were obtained. These soluble molecular compounds underwent cation exchange processes using resin chemistry, replacing Na+ or K+ by decomposable N2H5+ or tetraethylammonium cations. They also transformed into stoichiometric lead and bismuth chalcogenide nanomaterials with the addition of metal salts. Such a versatile chemistry led to a variety of composition-matched solders to join lead and bismuth chalcogenides and tune their charge transport properties at the grain boundaries. Solution-processed thin films composed of Bi0.5Sb1.5Te3 microparticles soldered by (N2H5)6Bi0.5Sb1.5Te6 exhibited thermoelectric power factors (~28 μW/cm K2) comparable to those in vacuum-deposited Bi0.5Sb1.5Te3 films. The soldering effect can also be integrated with attractive fabrication techniques for thermoelectric modules, such as screen printing, suggesting the potential of these solders in the rational design of printable and moldable thermoelectrics.

  19. Experimental demonstration of microscopic process monitoring

    International Nuclear Information System (INIS)

    Hurt, R.D.; Hurrell, S.J.; Wachter, J.W.; Hebble, T.L.; Crawford, A.B.

    1982-01-01

    Microscopic process monitoring (MPM) is a material control strategy designed to use standard process control data to provide expanded safeguards protection of nuclear fuel cycle facilities. The MPM methodology identifies process events by recognizing significant patterns of changes in on-line measurements. The goals of MPM are to detect diversions of nuclear material and to provide information on process status useful to other facility safeguards operations

  20. Spectroscopic investigation of oxidized solder surfaces

    International Nuclear Information System (INIS)

    Song, Jenn-Ming; Chang-Chien, Yu-Chien; Huang, Bo-Chang; Chen, Wei-Ting; Shie, Chi-Rung; Hsu, Chuang-Yao

    2011-01-01

    Highlights: → UV-visible spectroscopy is successfully used to evaluate the degree of discoloring of solders. → The surface oxides of solders can also be identified by UV-visible absorption spectra. → The discoloration of solder surface can be correlated with optical characterization of oxides. → A strategy against discoloring by alloying was also suggested. - Abstract: For further understanding of the discoloration of solder surfaces due to oxidation during the assembly and operation of electronic devices, UV-vis and X-ray photoelectron spectroscopic analyses were applied to evaluate the degree of discoloring and identify the surface oxides. The decrease in reflectance of the oxidized solder surface is related to SnO whose absorption band is located within the visible region. A trace of P can effectively depress the discoloration of solders under both solid and semi-solid states through the suppression of SnO.

  1. Advanced monitoring with complex stream processing

    CERN Multimedia

    CERN. Geneva

    2015-01-01

    Making sense of metrics and logs for service monitoring can be a complicated task. Valuable information is normally scattered across several streams of monitoring data, requiring aggregation, correlation and time-based analysis to promptly detect problems and failures. This presentations shows a solution which is used to support the advanced monitoring of the messaging services provided by the IT Department. It uses Esper, an open-source software product for Complex Event Processing (CEP), that analyses series of events for deriving conclusions from them.

  2. Lead free solder mechanics and reliability

    CERN Document Server

    Pang, John Hock Lye

    2012-01-01

    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

  3. FY-2010 Process Monitoring Technology Final Report

    Energy Technology Data Exchange (ETDEWEB)

    Orton, Christopher R.; Bryan, Samuel A.; Casella, Amanda J.; Hines, Wes; Levitskaia, Tatiana G.; henkell, J.; Schwantes, Jon M.; Jordan, Elizabeth A.; Lines, Amanda M.; Fraga, Carlos G.; Peterson, James M.; Verdugo, Dawn E.; Christensen, Ronald N.; Peper, Shane M.

    2011-01-01

    During FY 2010, work under the Spectroscopy-Based Process Monitoring task included ordering and receiving four fluid flow meters and four flow visible-near infrared spectrometer cells to be instrumented within the centrifugal contactor system at Pacific Northwest National Laboratory (PNNL). Initial demonstrations of real-time spectroscopic measurements on cold-stream simulants were conducted using plutonium (Pu)/uranium (U) (PUREX) solvent extraction process conditions. The specific test case examined the extraction of neodymium nitrate (Nd(NO3)3) from an aqueous nitric acid (HNO3) feed into a tri-n-butyl phosphate (TBP)/ n-dodecane solvent. Demonstration testing of this system included diverting a sample from the aqueous feed meanwhile monitoring the process in every phase using the on-line spectroscopic process monitoring system. The purpose of this demonstration was to test whether spectroscopic monitoring is capable of determining the mass balance of metal nitrate species involved in a cross-current solvent extraction scheme while also diverting a sample from the system. The diversion scenario involved diverting a portion of the feed from a counter-current extraction system while a continuous extraction experiment was underway. A successful test would demonstrate the ability of the process monitoring system to detect and quantify the diversion of material from the system during a real-time continuous solvent extraction experiment. The system was designed to mimic a PUREX-type extraction process with a bank of four centrifugal contactors. The aqueous feed contained Nd(NO3)3 in HNO3, and the organic phase was composed of TBP/n-dodecane. The amount of sample observed to be diverted by on-line spectroscopic process monitoring was measured to be 3 mmol (3 x 10-3 mol) Nd3+. This value was in excellent agreement with the 2.9 mmol Nd3+ value based on the known mass of sample taken (i.e., diverted) directly from the system feed solution.

  4. Soldered Contact and Current Risetime Effects on Negative Polarity Wire Array Z-pinches

    International Nuclear Information System (INIS)

    Chalenski, D. A.; Kusse, B. R.; Greenly, J. B.; Blesener, I. C.; McBride, R. D.; Hammer, D. A.; Knapp, P. F.

    2009-01-01

    The Cornell University COBRA pulser is a nominal 1 MA machine, capable of driving up to 32 wire cylindrical Z-pinch arrays. COBRA can operate with variable current risetimes ranging from 100 ns to 200 ns (short and long pulse, respectively). Wires are typically strung with a ''press'' contact to the electrode hardware, where the wire is loosely pulled against the hardware and held there to establish electrical contact. The machine is normally negative, but a bolt-on convolute can be used to modify the current path and effectively produce positive polarity operation at the load.Previous research with single wires on a 1-5 kA pulser has shown that soldering the wire, thereby improving the wire/electrode contact, and operating in positive polarity can improve the energy deposition into the wire and enhance wire core expansion. Negative polarity showed no difference. Previous experiments on the negative polarity, 20 MA, 100 ns Z accelerator have shown that improving the contact improved the x-ray yield.Cornell data were collected on 16-wire Aluminum Z-pinch arrays in negative polarity. Experiments were conducted with both short and long current pulses with soldered and no-soldered wire/electrode contacts. The initiation, ablation, implosion and stagnation phases were compared for these four conditions. Time dependent x-ray signals were measured using diodes and diamond detectors. An inductive voltage monitor was used to infer minimum current radius achieved, as defined by a uniform shell of current moving radially inward, producing a time dependent inductance. Total energy data were collected with a metal-strip bolometer. Self-emission data were collected by an XUV 4-frame camera and an optical streak camera.In negative polarity and with short pulses, soldering appeared to produce a smaller radius pinch and decrease variations in the x-ray pulse shape. The bolometer, laser backlighter, 4-frame and streak cameras showed negligible differences in the initiation ablation

  5. On-line process control monitoring system

    International Nuclear Information System (INIS)

    O'Rourke, P.E.; Van Hare, D.R.; Prather, W.S.

    1992-01-01

    This patent describes apparatus for monitoring at a plurality of locations within a system the concentration of at least one chemical substance involved in a chemical process. It comprises plurality of process cells; first means for carrying the light; second means for carrying the light; means for producing a spectrum from the light received by the second carrying means; multiplexing means for selecting one process cell of the plurality of process cells at a time so that the producing means can produce a process spectrum from the one cell of the process cells; a reference cell for producing a reference spectrum for comparison to the process spectrum; a standard cell for producing a standard spectrum for comparison to the process spectrum; and means for comparing the reference spectrum, the standard spectrum and the process spectrum and determining the concentration of the chemical substance in the process cell

  6. A review on solder reflow and flux application for flip chip

    Science.gov (United States)

    Suppiah, Sarveshvaran; Ong, Nestor Rubio; Sauli, Zaliman; Sarukunaselan, Karunavani; Alcain, Jesselyn Barro; Visvanathan, Susthitha Menon; Retnasamy, Vithyacharan

    2017-09-01

    This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

  7. Thermal decomposition of solder flux activators under simulated wave soldering conditions

    DEFF Research Database (Denmark)

    Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    /methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base...... titration method as a function of temperature, time of exposure and the substrate material used. Findings: The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL...

  8. Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

    Science.gov (United States)

    Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

    2016-12-01

    To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys ( T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

  9. Monitoring and controlling the biogas process

    Energy Technology Data Exchange (ETDEWEB)

    Ahring, B K; Angelidaki, I [The Technical Univ. of Denmark, Dept. of Environmental Science and Engineering, Lyngby (Denmark)

    1997-08-01

    Many modern large-scale biogas plants have been constructed recently, increasing the demand for proper monitoring and control of these large reactor systems. For monitoring the biogas process, an easy to measure and reliable indicator is required, which reflects the metabolic state and the activity of the bacterial populations in the reactor. In this paper, we discuss existing indicators as well as indicators under development which can potentially be used to monitor the state of the biogas process in a reactor. Furthermore, data are presented from two large scale thermophilic biogas plants, subjected to temperature changes and where the concentration of volatile fatty acids was monitored. The results clearly demonstrated that significant changes in the concentration of the individual VFA occurred although the biogas production was not significantly changed. Especially the concentrations of butyrate, isobutyrate and isovalerate showed significant changes. Future improvements of process control could therefore be based on monitoring of the concentration of specific VFA`s together with information about the bacterial populations in the reactor. The last information could be supplied by the use of modern molecular techniques. (au) 51 refs.

  10. Robust processing of mining subsidence monitoring data

    Energy Technology Data Exchange (ETDEWEB)

    Mingzhong, Wang; Guogang, Huang [Pingdingshan Mining Bureau (China); Yunjia, Wang; Guogangli, [China Univ. of Mining and Technology, Xuzhou (China)

    1997-12-31

    Since China began to do research on mining subsidence in 1950s, more than one thousand lines have been observed. Yet, monitoring data sometimes contain quite a lot of outliers because of the limit of observation and geological mining conditions. In China, nowdays, the method of processing mining subsidence monitoring data is based on the principle of the least square method. It is possible to produce lower accuracy, less reliability, or even errors. For reason given above, the authors, according to Chinese actual situation, have done some research work on the robust processing of mining subsidence monitoring data in respect of how to get prediction parameters. The authors have derived related formulas, designed some computational programmes, done a great quantity of actual calculation and simulation, and achieved good results. (orig.)

  11. Robust processing of mining subsidence monitoring data

    Energy Technology Data Exchange (ETDEWEB)

    Wang Mingzhong; Huang Guogang [Pingdingshan Mining Bureau (China); Wang Yunjia; Guogangli [China Univ. of Mining and Technology, Xuzhou (China)

    1996-12-31

    Since China began to do research on mining subsidence in 1950s, more than one thousand lines have been observed. Yet, monitoring data sometimes contain quite a lot of outliers because of the limit of observation and geological mining conditions. In China, nowdays, the method of processing mining subsidence monitoring data is based on the principle of the least square method. It is possible to produce lower accuracy, less reliability, or even errors. For reason given above, the authors, according to Chinese actual situation, have done some research work on the robust processing of mining subsidence monitoring data in respect of how to get prediction parameters. The authors have derived related formulas, designed some computational programmes, done a great quantity of actual calculation and simulation, and achieved good results. (orig.)

  12. Effect of gamma radiation on micromechanical hardness of lead-free solder joint

    Energy Technology Data Exchange (ETDEWEB)

    Paulus, Wilfred [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Malaysian Nuclear Agency, Bangi, 43000 Kajang, Selangor (Malaysia); Rahman, Irman Abdul; Jalar, Azman; Kamil, Insan; Bakar, Maria Abu [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Yusoff, Wan Yusmawati Wan [Universiti Pertahanan Nasional Malaysia, Kem Sg. Besi, 57000 Kuala Lumpur (Malaysia)

    2015-09-25

    Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the increment of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.

  13. Monitoring of batch processes using spectroscopy

    NARCIS (Netherlands)

    Gurden, S. P.; Westerhuis, J. A.; Smilde, A. K.

    2002-01-01

    There is an increasing need for new techniques for the understanding, monitoring and the control of batch processes. Spectroscopy is now becoming established as a means of obtaining real-time, high-quality chemical information at frequent time intervals and across a wide range of industrial

  14. Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock

    Science.gov (United States)

    Han, Jing; Tan, Shihai; Guo, Fu

    2018-01-01

    Ball grid array (BGA) samples were soldered on a printed circuit board with Sn37Pb solder paste to investigate the recrystallization induced by subgrain rotation during thermal shock. The composition of the solder balls was Sn3.0Ag0.5Cu-Sn37Pb, which comprised mixed solder joints. The BGA component was cross-sectioned before thermal shock. The microstructure and grain orientations were obtained by a scanning electron microscope equipped with an electron back-scattered diffraction system. Two mixed solder joints at corners of the BGA component were selected as the subjects. The results showed that recrystallization occurred at the corner of the solder joints after 200 thermal shock cycles. The recrystallized subgrains had various new grain orientations. The newly generated grain orientations were closely related to the initial grain orientations, which indicated that different subgrain rotation behaviors could occur in one mixed solder joint with the same initial grain orientation. When the misorientation angles were very small, the rotation axes were about Sn [100], [010] and [001], as shown by analyzing the misorientation angles and subgrain rotation axes, while the subgrain rotation behavior with large misorientation angles in the solder joints was much more complicated. As Pb was contained in the solder joints and the stress was concentrated on the corner of the mixed solder joints, concaves and cracks were formed. When the adjacent recrystallized subgrains were separated, and the process of the continuous recrystallization was limited.

  15. Nano-soldering to single atomic layer

    Science.gov (United States)

    Girit, Caglar O [Berkeley, CA; Zettl, Alexander K [Kensington, CA

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  16. Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

    International Nuclear Information System (INIS)

    Durairaj, R.; Ramesh, S.; Mallik, S.; Seman, A.; Ekere, N.

    2009-01-01

    Lead-free solder paste printing process accounts for majority of the assembly defects in the electronic manufacturing industry. The study investigates rheological behaviour and stencil printing performance of the lead-free solder pastes (Sn/Ag/Cu). Oscillatory stress sweep test was carried out to study the visco-elastic behaviour of the lead-free solder pastes. The visco-elastic behaviour of the paste encompasses solid and liquid characteristic of the paste, which could be used to study the flow behaviour experienced by the pastes during the stencil printing process. From this study, it was found that the solid characteristics (G') is higher than the liquid characteristic (G'') for the pastes material. In addition, the results from the study showed that the solder paste with a large G' = G'' has a higher cohesiveness resulting in poor withdrawal of the paste during the stencil printing process. The phase angles (δ) was used to correlate the quality of the dense suspensions to the formulation of solder paste materials. This study has revealed the value of having a rheological measurement for explaining and characterising solder pastes for stencil printing. As the demand for lead free pastes increases rheological measurements can assist with the formulation or development of new pastes.

  17. Comparative shear tests of some low temperature lead-free solder pastes

    Science.gov (United States)

    Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.

    2016-12-01

    The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

  18. Investigation on solder joint strength of nickel tin-plated and CRS tabs with PCB

    International Nuclear Information System (INIS)

    Luay Hussain

    2002-01-01

    Failure analysis on easily peels off Nickel and CRS steel tabs from PCB was carried out. Nickel Tin plated tabs, CRS steel tabs and tube were joined to the PCB using reflow/ convection soldering, in an oven. The solder paste composition is Sn36/Pb35/Ag2. Peel test was conducted and it was found that many tabs could be easily peeled off with low force. Porosities which varies from 0.4 mm to < 0.01mm in diameter, developed during soldering process and solidification was noted. It was found, the number, size and position of these porosities inside the solder layer on both parts of the tabs affect the peel strength. Scanning Electron Microscopy study and EDX analysis were carried out. It was found that the low peel strength values were due to the combination of generation and development of porosities during soldering process which act as stress concentrators and the evolution (growth) of eutectic Sn/Pb and Sn/Ni/Cu brittle grainy phase. Large eutectic microstructure with brittle Sn-Ni-Cu grainy phase enhances the failure with low peeling forces. Sample showing no feature of Sn/Ni/Cu grain gave high peeling strength value. Solder reflow, an important process, can result in strength enhancement (if it was controlled for example in a furnace). (Author)

  19. Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

    Science.gov (United States)

    Rolin, T. D.; Hodge, R. E.

    2008-01-01

    An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

  20. Nanoscale Soldering of Positioned Carbon Nanotubes using Highly Conductive Electron Beam Induced Gold Deposition

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    We have developed an in-situ method for controlled positioning of carbon nanotubes followed by highly conductive contacting of the nanotubes, using electron beam assisted deposition of gold. The positioning and soldering process takes place inside an Environmental Scanning Electron Microscope (E...... in a carbon matrix. Nanoscale soldering of multi-walled carbon nanotubes (MWNT) onto microelectrodes was achieved by deposition of a conducting gold line across a contact point between nanotube and electrode. The solderings were found to be mechanically stronger than the carbon nanotubes. We have positioned...... MWNTs to bridge the gap between two electrodes, and formed soldering bonds between the tube and each of the electrodes. All nanotube bridges showed ohmic resistances in the range 10-30 kΩ. We observed no increase in resistance after exposing the MWNT bridge to air for days....

  1. Verifiable process monitoring through enhanced data authentication

    International Nuclear Information System (INIS)

    Goncalves, Joao G.M.; Schwalbach, Peter; Schoeneman, Barry Dale; Ross, Troy D.; Baldwin, George Thomas

    2010-01-01

    To ensure the peaceful intent for production and processing of nuclear fuel, verifiable process monitoring of the fuel production cycle is required. As part of a U.S. Department of Energy (DOE)-EURATOM collaboration in the field of international nuclear safeguards, the DOE Sandia National Laboratories (SNL), the European Commission Joint Research Centre (JRC) and Directorate General-Energy (DG-ENER) developed and demonstrated a new concept in process monitoring, enabling the use of operator process information by branching a second, authenticated data stream to the Safeguards inspectorate. This information would be complementary to independent safeguards data, improving the understanding of the plant's operation. The concept is called the Enhanced Data Authentication System (EDAS). EDAS transparently captures, authenticates, and encrypts communication data that is transmitted between operator control computers and connected analytical equipment utilized in nuclear processes controls. The intent is to capture information as close to the sensor point as possible to assure the highest possible confidence in the branched data. Data must be collected transparently by the EDAS: Operator processes should not be altered or disrupted by the insertion of the EDAS as a monitoring system for safeguards. EDAS employs public key authentication providing 'jointly verifiable' data and private key encryption for confidentiality. Timestamps and data source are also added to the collected data for analysis. The core of the system hardware is in a security enclosure with both active and passive tamper indication. Further, the system has the ability to monitor seals or other security devices in close proximity. This paper will discuss the EDAS concept, recent technical developments, intended application philosophy and the planned future progression of this system.

  2. Safety monitoring in process and control

    International Nuclear Information System (INIS)

    Esparza, V. Jr.; Sebo, D.E.

    1984-01-01

    Safety Functions provide a method of ensuring the safe operation of any large-scale processing plant. Successful implementation of safety functions requires continuous monitoring of safety function values and trends. Because the volume of information handled by a plant operator occassionally can become overwhelming, attention may be diverted from the primary concern of maintaining plant safety. With this in mind EG and G, Idaho developed various methods and techniques for use in a computerized Safety Function Monitoring System and tested the application of these techniques using a simulated nuclear power plant, the Loss-of-Fluid Test Facility (LOFT) at the Idaho National Engineering Laboratory (INEL). This paper presents the methods used in the development of a Safety Function Monitoring System

  3. Process monitoring using optical ultrasonic wave detection

    International Nuclear Information System (INIS)

    Telschow, K.L.; Walter, J.B.; Garcia, G.V.; Kunerth, D.C.

    1989-01-01

    Optical ultrasonic wave detection techniques are being developed for process monitoring. An important limitation on optical techniques is that the material surface, in materials processing applications, is usually not a specular reflector and in many cases is totally diffusely reflecting. This severely degrades the light collected by the detection optics, greatly reducing the intensity and randomly scattering the phase of the reflected light. A confocal Fabry-Perot interferometer, which is sensitive to the Doppler frequency shift resulting from the surface motion and not to the phase of the collected light, is well suited to detecting ultrasonic waves in diffusely reflecting materials. This paper describes the application of this detector to the real-time monitoring of the sintering of ceramic materials. 8 refs., 5 figs

  4. Geophysical methods for monitoring soil stabilization processes

    Science.gov (United States)

    Saneiyan, Sina; Ntarlagiannis, Dimitrios; Werkema, D. Dale; Ustra, Andréa

    2018-01-01

    Soil stabilization involves methods used to turn unconsolidated and unstable soil into a stiffer, consolidated medium that could support engineered structures, alter permeability, change subsurface flow, or immobilize contamination through mineral precipitation. Among the variety of available methods carbonate precipitation is a very promising one, especially when it is being induced through common soil borne microbes (MICP - microbial induced carbonate precipitation). Such microbial mediated precipitation has the added benefit of not harming the environment as other methods can be environmentally detrimental. Carbonate precipitation, typically in the form of calcite, is a naturally occurring process that can be manipulated to deliver the expected soil strengthening results or permeability changes. This study investigates the ability of spectral induced polarization and shear-wave velocity for monitoring calcite driven soil strengthening processes. The results support the use of these geophysical methods as soil strengthening characterization and long term monitoring tools, which is a requirement for viable soil stabilization projects. Both tested methods are sensitive to calcite precipitation, with SIP offering additional information related to long term stability of precipitated carbonate. Carbonate precipitation has been confirmed with direct methods, such as direct sampling and scanning electron microscopy (SEM). This study advances our understanding of soil strengthening processes and permeability alterations, and is a crucial step for the use of geophysical methods as monitoring tools in microbial induced soil alterations through carbonate precipitation.

  5. Thermal and mechanical properties of lead-free SnZn–xNa casting alloys, and interfacial chemistry on Cu substrates during the soldering process

    Energy Technology Data Exchange (ETDEWEB)

    Gancarz, Tomasz, E-mail: tomasz.gancarz@imim.pl [Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Krakow (Poland); Bobrowski, Piotr; Pstruś, Janusz [Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Krakow (Poland); Pawlak, Sylwia [Wroclaw Research Centre EIT+, Wroclaw (Poland)

    2016-09-15

    The microstructural features, thermal properties and mechanical properties of eutectic Sn–Zn alloys with varying Na content (0.1, 0.2, 0.5, 1.0 3.0 and 5.0 at. %) were examined in this study. In the scanning electron microscopy, transmission electron microscopy, and X-ray diffraction analysis data, precipitates of NaSn were observed. The addition of Na to eutectic Sn–Zn alloy improved the mechanical properties and increased electrical resistivity, and reduced the coefficient of thermal expansion; however, the melting point did not change. Wettability tests carried out using Na-doped Sn–15Zn alloys on Cu substrates showed the formation of Cu–Zn phases at the interfaces. Wettability studies were performed using flux ALU33 after 60, 180, 480, 900, 1800 and 3600 s of contact, at temperatures of 230, 250, 280 and 320 °C. The experiments were designed to demonstrate the effect of Na addition on the formation and growth kinetics of Cu{sub 5}Zn{sub 8} and CuZn{sub 4} phases, which were identified using XRDs and EDS. The addition of Na to SnZn causes a reduction in the thickness of the intermetallic compounds layer created at the interface between the liquid solder and the Cu substrate, and an increase in the activation energy of the Cu{sub 5}Zn{sub 8} phase compared to eutectic SnZn. - Highlights: • Precipitates of NaSn was observed and confirmed using TEM and XRD. • Addition Na to eutectic SnZn cussed increased the mechanical properties. • IMCs of Na–Zn and Na–Sn increased electrical resistivity and reduced the CTE. • IMCs layers CuZn{sub 4} and Cu{sub 5}Zn{sub 8} was found at the interface. • Na content changing the character of growth CuZn{sub 4} layer in SnZnNa alloys.

  6. Dye-enhanced protein solders and patches in laser-assisted tissue welding.

    Science.gov (United States)

    Small, W; Heredia, N J; Maitland, D J; Da Silva, L B; Matthews, D L

    1997-01-01

    This study examines the use of dye-enhanced protein bonding agents in 805 nm diode laser-assisted tissue welding. A comparison of an albumin liquid solder and collagen solid-matrix patches used to repair arteriotomies in an in vitro porcine model is presented. Extrinsic bonding media in the form of solders and patches have been used to enhance the practice of laser tissue welding. Preferential absorption of the laser wavelength has been achieved by the incorporation of chromophores. Both the solder and the patch included indocyanine green dye (ICG) to absorb the 805 nm continuous-wave diode laser light used to perform the welds. Solder-mediated welds were divided into two groups (high power/short exposure and low power/long exposure), and the patches were divided into three thickness groups ranging from 0.1 to 1.3 mm. The power used to activate the patches was constant, but the exposure time was increased with patch thickness. Burst pressure results indicated that solder-mediated and patched welds yielded similar average burst strengths in most cases, but the patches provided a higher success rate (i.e., more often exceeded 150 mmHg) and were more consistent (i.e., smaller standard deviation) than the solder. The strongest welds were obtained using 1.0-1.3 mm thick patches, while the high power/short exposure solder group was the weakest. Though the solder and patches yielded similar acute weld strengths, the solid-matrix patches facilitated the welding process and provided consistently strong welds. The material properties of the extrinsic agents influenced their performance.

  7. The constitutive response of three solder materials

    International Nuclear Information System (INIS)

    Perez-Bergquist, Alejandro G.; Cao Fang; Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T.

    2012-01-01

    Highlights: ► The full constitutive response of three solder materials. ► Test temperatures from −196 °C to 60 °C and strain rates from 10 −3 to >10 3 s −1 . ► Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (−196 °C to 60 °C) and strain rate (10 −3 to >10 3 s −1 ). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  8. The constitutive response of three solder materials

    Energy Technology Data Exchange (ETDEWEB)

    Perez-Bergquist, Alejandro G., E-mail: alexpb@lanl.gov [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States); Cao Fang [Exxon Mobil Research and Engineering Company, Annadale, NJ 08801 (United States); Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T. [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States)

    2012-05-25

    Highlights: Black-Right-Pointing-Pointer The full constitutive response of three solder materials. Black-Right-Pointing-Pointer Test temperatures from -196 Degree-Sign C to 60 Degree-Sign C and strain rates from 10{sup -3} to >10{sup 3} s{sup -1}. Black-Right-Pointing-Pointer Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (-196 Degree-Sign C to 60 Degree-Sign C) and strain rate (10{sup -3} to >10{sup 3} s{sup -1}). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  9. Characterization of the microstructure of tin-silver lead free solder

    Energy Technology Data Exchange (ETDEWEB)

    Hurtony, Tamás, E-mail: hurtony@ett.bme.hu [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary); Szakál, Alex; Almásy, László [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Len, Adél [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Faculty of Engineering and Information Technology, University of Pécs (Hungary); Kugler, Sándor [Department of Theoretical Physics, Budapest University of Technology and Economics (Hungary); Bonyár, Attila; Gordon, Péter [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary)

    2016-07-05

    Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag{sub 3}Sn phases.

  10. A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

    Science.gov (United States)

    Wei, Helin; Wang, Kuisheng

    2011-11-01

    Numerous studies of the reliability of solder joints have been performed. Most life prediction models are limited to a deterministic approach. However, manufacturing induces uncertainty in the geometry parameters of solder joints, and the environmental temperature varies widely due to end-user diversity, creating uncertainties in the reliability of solder joints. In this study, a methodology for accounting for variation in the lifetime prediction for lead-free solder joints of ball grid array packages (PBGA) is demonstrated. The key aspects of the solder joint parameters and the cyclic temperature range related to reliability are involved. Probabilistic solutions of the inelastic strain range and thermal fatigue life based on the Engelmaier model are developed to determine the probability of solder joint failure. The results indicate that the standard deviation increases significantly when more random variations are involved. Using the probabilistic method, the influence of each variable on the thermal fatigue life is quantified. This information can be used to optimize product design and process validation acceptance criteria. The probabilistic approach creates the opportunity to identify the root causes of failed samples from product fatigue tests and field returns. The method can be applied to better understand how variation affects parameters of interest in an electronic package design with area array interconnections.

  11. The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints.

    Science.gov (United States)

    Fattahi, Farnaz; Hashemi Ardakani, Zahra; Hashemi Ardakani, Maryam

    2015-12-01

    Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint of the bar, and were placed at the considered angles by employing an explicitly designed device. They were divided into 4 groups regarding the gap angle; Group C (control group) with parallel gap on steady distance of 0.2mm, Group 1: 10°, Group 2: 20°, and Group3: 30° gap angles. When soldered, the specimens were all tested for tensile strength using a universal testing machine at a cross-head speed of 0.5 mm/min with a preload of 10N. Kruskal-Wallis H test was used to compare tensile strength among the groups (ptensile strength values obtained from the study groups were respectively 307.84, 391.50, 365.18, and 368.86 MPa. The tensile strength was not statistically different among the four groups in general (p≤ 0.490). Making the gap angular at the solder joints and the subsequent unsteady increase of the gap distance would not change the tensile strength of the joint.

  12. Process instrument monitoring for SNM solution surveillance

    International Nuclear Information System (INIS)

    Armatys, C.M.; Johnson, C.E.; Wagner, E.P.

    1983-02-01

    A process monitoring computer system at the Idaho Chemical Processing Plant (ICPP) is being used to evaluate nuclear fuel reprocessing plant data for Safeguards surveillance capabilities. The computer system was installed to collect data from the existing plant instruments and to evaluate what safeguards assurances can be provided to complement conventional accountability and physical protection measures. Movements of solutions containing special nuclear material (SNM) can be observed, activities associated with accountancy measurements (mixing, sampling, and bulk measurement) can be confirmed, and long-term storage of SNM solutions can be monitored to ensure containment. Special precautions must be taken, both in system design and operation to ensure adequate coverage of essential measured parameters and interpretation of process data, which can be comprised by instrument malfunctions or failures, unreliable data collection, or process activities that deviate from readily identified procedures. Experience at ICPP and prior evaluations at the Tokai reprocessing plant show that the use of process data can provide assurances that accountability measurement procedures are followed and SNM solutions are properly contained and can help confirm that SNM controls are in effect within a facility

  13. Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States); Burress, R.V. [SEHO (United States)] [and others

    1995-06-01

    The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

  14. Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

    Science.gov (United States)

    Amalu, E. H.; Lui, Y. T.; Ekere, N. N.; Bhatti, R. S.; Takyi, G.

    2011-01-01

    The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

  15. Optimal parameters for laser tissue soldering

    Science.gov (United States)

    McNally-Heintzelman, Karen M.; Sorg, Brian S.; Chan, Eric K.; Welch, Ashley J.; Dawes, Judith M.; Owen, Earl R.

    1998-07-01

    Variations in laser irradiance, exposure time, solder composition, chromophore type and concentration have led to inconsistencies in published results of laser-solder repair of tissue. To determine optimal parameters for laser tissue soldering, an in vitro study was performed using an 808-nm diode laser in conjunction with an indocyanine green (ICG)- doped albumin protein solder to weld bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The effects of laser irradiance and exposure time on tensile strength of the weld and temperature rise as well as the effect of hydration on bond stability were investigated. Optimum irradiance and exposure times were identified for each solder type. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the weld. A reduction in dye concentration from 2.5 mg/ml to 0.25 mg/ml was also found to result in an increase in tensile strength. The strongest welds were produced with an irradiance of 6.4 W/cm2 for 50 s using a solid protein solder composed of 60% BSA and 0.25 mg/ml ICG. Steady-state solder surface temperatures were observed to reach 85 plus or minus 5 degrees Celsius with a temperature gradient across the solid protein solder strips of between 15 and 20 degrees Celsius. Finally, tensile strength was observed to decrease significantly (20 to 25%) after the first hour of hydration in phosphate-buffered saline. No appreciable change was observed in the strength of the tissue bonds with further hydration.

  16. Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

    National Research Council Canada - National Science Library

    Reuse, Rolando

    2005-01-01

    .... The thermomechanical cycling in the solder causes numerous reliability challenges, mostly because of the mismatch of the coefficient of thermal expansion between the silicon chip and the substrate...

  17. Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

    DEFF Research Database (Denmark)

    Conseil, Helene; Verdingovas, Vadimas; Jellesen, Morten Stendahl

    2016-01-01

    No-clean flux systems are used today for the soldering of electronic printed circuit board assemblies assuming that all the aggressive substances of the flux will vanish during the soldering process i.e. evaporate, decompose or being enclosed safely in the residues. However this is not true in most...... that the fluxes do not decompose fully within the temperature regime of the soldering process, leaving behind significant level of weak organic acid residues. The residue depending on the type and amount can be can be very aggressive towards the corrosion on the printed circuit board assemblies. The glutaric acid...

  18. A simple condition monitoring model for a direct monitoring process

    NARCIS (Netherlands)

    Christer, A.H.; Wang, Wenbin

    1995-01-01

    This paper addresses the problem of condition monitoring of a component which has available a measure of condition called wear. Wear accumulates over time and monitoring inspections are performed at chosen times to monitor and measure the cumulative wear. If past measurements of wear are available

  19. Laser beam soldering of micro-optical components

    Science.gov (United States)

    Eberhardt, R.

    2003-05-01

    MOTIVATION Ongoing miniaturisation and higher requirements within optical assemblies and the processing of temperature sensitive components demands for innovative selective joining techniques. So far adhesive bonding has primarily been used to assemble and adjust hybrid micro optical systems. However, the properties of the organic polymers used for the adhesives limit the application of these systems. In fields of telecommunication and lithography, an enhancement of existing joining techniques is necessary to improve properties like humidity resistance, laserstability, UV-stability, thermal cycle reliability and life time reliability. Against this background laser beam soldering of optical components is a reasonable joining technology alternative. Properties like: - time and area restricted energy input - energy input can be controlled by the process temperature - direct and indirect heating of the components is possible - no mechanical contact between joining tool and components give good conditions to meet the requirements on a joining technology for sensitive optical components. Additionally to the laser soldering head, for the assembly of optical components it is necessary to include positioning units to adjust the position of the components with high accuracy before joining. Furthermore, suitable measurement methods to characterize the soldered assemblies (for instance in terms of position tolerances) need to be developed.

  20. Infrasonic Stethoscope for Monitoring Physiological Processes

    Science.gov (United States)

    Shams, Qamar A. (Inventor); Zuckerwar, Allan J. (Inventor); Dimarcantonio, Albert L. (Inventor)

    2018-01-01

    An infrasonic stethoscope for monitoring physiological processes of a patient includes a microphone capable of detecting acoustic signals in the audible frequency bandwidth and in the infrasonic bandwidth (0.03 to 1000 Hertz), a body coupler attached to the body at a first opening in the microphone, a flexible tube attached to the body at a second opening in the microphone, and an earpiece attached to the flexible tube. The body coupler is capable of engagement with a patient to transmit sounds from the person, to the microphone and then to the earpiece.

  1. Miniature multichannel analyzer for process monitoring

    International Nuclear Information System (INIS)

    Halbig, J.K.; Klosterbuer, S.F.; Russo, P.A.; Sprinkle, J.K. Jr.; Stephens, M.M.; Wiig, L.G.; Ianakiev, K.D.

    1993-01-01

    A new, 4,000-channel analyzer has been developed for gamma-ray spectroscopy applications. A design philosophy of hardware and software building blocks has been combined with design goals of simplicity, compactness, portability, and reliability. The result is a miniature, modular multichannel analyzer (MMMCA), which offers solution to a variety of nondestructive assay (NDA) needs in many areas of general application, independent of computer platform or operating system. Detector-signal analog electronics, the bias supply, and batteries are included in the virtually pocket-size, low-power MMMCA unit. The MMMCA features digital setup and control, automated data reduction, and automated quality assurance. Areas of current NDA applications include on-line continuous (process) monitoring, process material holdup measurements, and field inspections

  2. Fluorescence monitoring of ultrasound degradation processes

    International Nuclear Information System (INIS)

    Hassoon, Salah; Bulatov, Valery; Yasman, Yakov; Schechter, Israel

    2004-01-01

    Ultrasound-based water treatment is often applied for degradation of stable organic pollutants, such as polycyclic aromatic hydrocarbons and halogenated compounds. Monitoring the degradation process, during the application of ultrasound radiation, is of considerable economical interest. In this work, the possibility of performing on-line spectral analysis during sonication was examined and it was found that direct absorption or fluorescence readings are misleading. Optical monitoring is strongly affected by the absorption and scattering of light by cavitation micro-bubbles and ultrasound induced particulates. A model was developed to account for these effects and to allow for on-line fluorescence analysis. The model takes into account the absorption and scattering coefficients of the micro-bubbles and particulates, as well as their time dependent concentration. The model parameters are found from independent measurements where the pollutants are added to already sonicated pure water. Then, the model is tested for predicting the actual fluorescence behavior during the sonication process. It has been shown that the model allows for recovery of the true degradation data, as obtained by off-line HPLC measurements

  3. Information processing for aerospace structural health monitoring

    Science.gov (United States)

    Lichtenwalner, Peter F.; White, Edward V.; Baumann, Erwin W.

    1998-06-01

    Structural health monitoring (SHM) technology provides a means to significantly reduce life cycle of aerospace vehicles by eliminating unnecessary inspections, minimizing inspection complexity, and providing accurate diagnostics and prognostics to support vehicle life extension. In order to accomplish this, a comprehensive SHM system will need to acquire data from a wide variety of diverse sensors including strain gages, accelerometers, acoustic emission sensors, crack growth gages, corrosion sensors, and piezoelectric transducers. Significant amounts of computer processing will then be required to convert this raw sensor data into meaningful information which indicates both the diagnostics of the current structural integrity as well as the prognostics necessary for planning and managing the future health of the structure in a cost effective manner. This paper provides a description of the key types of information processing technologies required in an effective SHM system. These include artificial intelligence techniques such as neural networks, expert systems, and fuzzy logic for nonlinear modeling, pattern recognition, and complex decision making; signal processing techniques such as Fourier and wavelet transforms for spectral analysis and feature extraction; statistical algorithms for optimal detection, estimation, prediction, and fusion; and a wide variety of other algorithms for data analysis and visualization. The intent of this paper is to provide an overview of the role of information processing for SHM, discuss various technologies which can contribute to accomplishing this role, and present some example applications of information processing for SHM implemented at the Boeing Company.

  4. Measuring oxidation processes: Atomic oxygen flux monitor

    International Nuclear Information System (INIS)

    Anon.

    1991-01-01

    Of the existing 95 high-energy accelerators in the world, the Stanford Linear Collider (SLC) at the Stanford Linear Accelerator Center (SLAC) is the only one of the linear-collider type, where electrons and positrons are smashed together at energies of 50 GeV using linear beams instead of beam rings for achieving interactions. Use of a collider eliminates energy losses in the form of x-rays due to the curved trajectory of the rings, a phenomena known as bremsstrauhlung. Because these losses are eliminated, higher interaction energies are reached. Consequently the SLC produced the first Z particle in quantities large enough to allow measurement of its physical properties with some accuracy. SLAC intends to probe still deeper into the structure of matter by next polarizing the electrons in the beam. The surface of the source for these polarized particles, typically gallium arsenide, must be kept clean of contaminants. One method for accomplishing this task requires the oxidation of the surface, from which the oxidized contaminants are later boiled off. The technique requires careful measurement of the oxidation process. SLAC researchers have developed a technique for measuring the atomic oxygen flux in this process. The method uses a silver film on a quartz-crystal, deposition-rate monitor. Measuring the initial oxidation rate of the silver, which is proportional to the atomic oxygen flux, determines a lower limit on that flux in the range of 10 13 to 10 17 atoms per square centimeter per second. Furthermore, the deposition is reversible by exposing the sensor to atomic hydrogen. This technique has wider applications to processes in solid-state and surface physics as well as surface chemistry. In semiconductor manufacturing where a precise thickness of oxide must be deposited, this technique could be used to monitor the critical flux of atomic oxygen in the process

  5. The monitoring and control of TRUEX processes

    International Nuclear Information System (INIS)

    Regalbuto, M.C.; Misra, B.; Chamberlain, D.B.; Leonard, R.A.; Vandegrift, G.F.

    1992-04-01

    The Generic TRUEX Model (GTM) was used to design a flowsheet for the TRUEX solvent extraction process that would be used to determine its instrumentation and control requirements. Sensitivity analyses of the key process variables, namely, the aqueous and organic flow rates, feed compositions, and the number of contactor stages, were carried out to assess their impact on the operation of the TRUEX process. Results of these analyses provide a basis for the selection of an instrument and control system and the eventual implementation of a control algorithm. Volume Two of this report is an evaluation of the instruments available for measuring many of the physical parameters. Equations that model the dynamic behavior of the TRUEX process have been generated. These equations can be used to describe the transient or dynamic behavior of the process for a given flowsheet in accordance with the TRUEX model. Further work will be done with the dynamic model to determine how and how quickly the system responds to various perturbations. The use of perturbation analysis early in the design stage will lead to a robust flowsheet, namely, one that will meet all process goals and allow for wide control bounds. The process time delay, that is, the speed with which the system reaches a new steady state, is an important parameter in monitoring and controlling a process. In the future, instrument selection and point-of-variable measurement, now done using the steady-state results reported here, will be reviewed and modified as necessary based on this dynamic method of analysis

  6. Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

    Science.gov (United States)

    Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

    2004-10-01

    It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

  7. A FPGA implementation of solder paste deposit on printed circuit boards errors detector based in a bright and contrast algorithm

    OpenAIRE

    De Luca-Pennacchia, A.; Sánchez-Martínez, M. Á.

    2007-01-01

    Solder paste deposit on printed circuit boards (PCB) is a critical stage. It is known that about 60% of functionality defects in this type of boards are due to poor solder paste printing. These defects can be diminished by means of automatic optical inspection of this printing. Actually, this process is implemented by image processing software with its inherent high computational time cost. In this paper we propose to implement a high parallel degree image comparison algorithm suitable to be ...

  8. Statistical process control for electron beam monitoring.

    Science.gov (United States)

    López-Tarjuelo, Juan; Luquero-Llopis, Naika; García-Mollá, Rafael; Quirós-Higueras, Juan David; Bouché-Babiloni, Ana; Juan-Senabre, Xavier Jordi; de Marco-Blancas, Noelia; Ferrer-Albiach, Carlos; Santos-Serra, Agustín

    2015-07-01

    To assess the electron beam monitoring statistical process control (SPC) in linear accelerator (linac) daily quality control. We present a long-term record of our measurements and evaluate which SPC-led conditions are feasible for maintaining control. We retrieved our linac beam calibration, symmetry, and flatness daily records for all electron beam energies from January 2008 to December 2013, and retrospectively studied how SPC could have been applied and which of its features could be used in the future. A set of adjustment interventions designed to maintain these parameters under control was also simulated. All phase I data was under control. The dose plots were characterized by rising trends followed by steep drops caused by our attempts to re-center the linac beam calibration. Where flatness and symmetry trends were detected they were less-well defined. The process capability ratios ranged from 1.6 to 9.3 at a 2% specification level. Simulated interventions ranged from 2% to 34% of the total number of measurement sessions. We also noted that if prospective SPC had been applied it would have met quality control specifications. SPC can be used to assess the inherent variability of our electron beam monitoring system. It can also indicate whether a process is capable of maintaining electron parameters under control with respect to established specifications by using a daily checking device, but this is not practical unless a method to establish direct feedback from the device to the linac can be devised. Copyright © 2015 Associazione Italiana di Fisica Medica. Published by Elsevier Ltd. All rights reserved.

  9. Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

    Science.gov (United States)

    Hammad, A. E.; El-Taher, A. M.

    2014-11-01

    The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) inside the β-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni)6Sn5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)- and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

  10. Method of noncontacting ultrasonic process monitoring

    Science.gov (United States)

    Garcia, Gabriel V.; Walter, John B.; Telschow, Kenneth L.

    1992-01-01

    A method of monitoring a material during processing comprising the steps of (a) shining a detection light on the surface of a material; (b) generating ultrasonic waves at the surface of the material to cause a change in frequency of the detection light; (c) detecting a change in the frequency of the detection light at the surface of the material; (d) detecting said ultrasonic waves at the surface point of detection of the material; (e) measuring a change in the time elapsed from generating the ultrasonic waves at the surface of the material and return to the surface point of detection of the material, to determine the transit time; and (f) comparing the transit time to predetermined values to determine properties such as, density and the elastic quality of the material.

  11. Process monitoring for reprocessing plant safeguards: a summary review

    International Nuclear Information System (INIS)

    Kerr, H.T.; Ehinger, M.H.; Wachter, J.W.; Hebble, T.L.

    1986-10-01

    Process monitoring is a term typically associated with a detailed look at plant operating data to determine plant status. Process monitoring has been generally associated with operational control of plant processes. Recently, process monitoring has been given new attention for a possible role in international safeguards. International Safeguards Project Office (ISPO) Task C.59 has the goal to identify specific roles for process monitoring in international safeguards. As the preliminary effort associated with this task, a review of previous efforts in process monitoring for safeguards was conducted. Previous efforts mentioned concepts and a few specific applications. None were comprehensive in addressing all aspects of a process monitoring application for safeguards. This report summarizes the basic elements that must be developed in a comprehensive process monitoring application for safeguards. It then summarizes the significant efforts that have been documented in the literature with respect to the basic elements that were addressed

  12. MIR-ATR sensor for process monitoring

    International Nuclear Information System (INIS)

    Geörg, Daniel; Schalk, Robert; Beuermann, Thomas; Methner, Frank-Jürgen

    2015-01-01

    A mid-infrared attenuated total reflectance (MIR-ATR) sensor has been developed for chemical reaction monitoring. The optical setup of the compact and low-priced sensor consists of an IR emitter as light source, a zinc selenide (ZnSe) ATR prism as boundary to the process, and four thermopile detectors, each equipped with an optical bandpass filter. The practical applicability was tested during esterification of ethanol and formic acid to ethyl formate and water as a model reaction with subsequent distillation. For reference analysis, a Fourier transform mid-infrared (FT-MIR) spectrometer with diamond ATR module was applied. On-line measurements using the MIR-ATR sensor and the FT-MIR spectrometer were performed in a bypass loop. The sensor was calibrated by multiple linear regression in order to link the measured absorbance in the four optical channels to the analyte concentrations. The analytical potential of the MIR-ATR sensor was demonstrated by simultaneous real-time monitoring of all four chemical substances involved in the esterification and distillation process. The temporal courses of the sensor signals are in accordance with the concentration values achieved by the commercial FT-MIR spectrometer. The standard error of prediction for ethanol, formic acid, ethyl formate, and water were 0.38 mol L   −  1 , 0.48 mol L   −  1 , 0.38 mol L   −  1 , and 1.12 mol L   −  1 , respectively. A procedure based on MIR spectra is presented to simulate the response characteristics of the sensor if the transmission ranges of the filters are varied. Using this tool analyte specific bandpass filters for a particular chemical reaction can be identified. By exchanging the optical filters, the sensor can be adapted to a wide range of processes in the chemical, pharmaceutical, and beverage industries. (paper)

  13. High temperature soldering of graphite

    International Nuclear Information System (INIS)

    Anikin, L.T.; Kravetskij, G.A.; Dergunova, V.S.

    1977-01-01

    The effect is studied of the brazing temperature on the strength of the brazed joint of graphite materials. In one case, iron and nickel are used as solder, and in another, molybdenum. The contact heating of the iron and nickel with the graphite has been studied in the temperature range of 1400-2400 ged C, and molybdenum, 2200-2600 deg C. The quality of the joints has been judged by the tensile strength at temperatures of 2500-2800 deg C and by the microstructure. An investigation into the kinetics of carbon dissolution in molten iron has shown that the failure of the graphite in contact with the iron melt is due to the incorporation of iron atoms in the interbase planes. The strength of a joint formed with the participation of the vapour-gas phase is 2.5 times higher than that of a joint obtained by graphite recrystallization through the carbon-containing metal melt. The critical temperatures are determined of graphite brazing with nickel, iron, and molybdenum interlayers, which sharply increase the strength of the brazed joint as a result of the formation of a vapour-gas phase and deposition of fine-crystal carbon

  14. Microstructure evolution and thermomechanical fatigue of solder materials

    NARCIS (Netherlands)

    Matin, M.A.

    2005-01-01

    The microelectronics industry is confronted with the new challenge to produce joints with lead-free solder materials replacing classical tin-lead solders in devices used in many fields (e.g. consumer electronics, road transport, aviation, space-crafts, telecommunication). In service, solder

  15. Fundamentals of lead-free solder interconnect technology from microstructures to reliability

    CERN Document Server

    Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao

    2015-01-01

    This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

  16. Effect of temperature and flux concentration on soldering of base metal.

    Science.gov (United States)

    Lee, S Y; Lin, C T; Wang, M H; Tseng, H; Huang, H M; Dong, D R; Pan, L C; Shih, Y H

    2000-12-01

    The present study used the acoustic emission (AE) technique to evaluate interactions among soldering temperature, flux treatment, and the resultant ultimate tensile strength (UTS). Scanning electron microscopy (SEM) was used to examine fracture surfaces of the solder joints. Specimens were cast from removable partial denture alloy and then placed in a jig with a gap distance of 1.0 mm. A high-frequency soldering machine with an optical pyrometer was used for soldering at 1150 degrees C and 1200 degrees C, respectively. The flux concentrations were 67% and 75%. The soldered specimens were subjected to tensile test at a crosshead speed of 0.05 mm/min. During testing, acoustic emissions in the frequency range of 100--1200 kHz were collected, filtered, recorded, and processed by a sensing device. The results were analysed by ANOVA and Tukey LSD test. UTS at different temperatures showed no significant difference according to either mechanical or acoustic results. But in the 1200 degrees C group, the UTSs and AE counts showed significant differences (Pacoustic signals within the elastic deformation zone, while the 67% flux subgroup produced similar signals within the plastic deformation zone, either beyond the 0.2% yield point or before fracture.

  17. Safeguards inventory and process monitoring regulatory comparison

    Energy Technology Data Exchange (ETDEWEB)

    Cavaluzzi, Jack M. [Texas A & M Univ., College Station, TX (United States); Gibbs, Philip W. [Brookhaven National Lab. (BNL), Upton, NY (United States)

    2013-06-27

    Detecting the theft or diversion of the relatively small amount of fissile material needed to make a nuclear weapon given the normal operating capacity of many of today’s running nuclear production facilities is a difficult task. As throughput increases, the ability of the Material Control and Accountability (MC&A) Program to detect the material loss decreases because the statistical measurement uncertainty also increases. The challenge faced is the ability of current accounting, measurement, and material control programs to detect small yet significant losses under some regulatory approaches can decrease to the point where it is extremely low if not practically non-existent at normal operating capacities. Adding concern to this topic is that there are variations among regulatory bodies as far as what is considered a Significant Quantity (SQ). Some research suggests that thresholds should be lower than those found in any current regulation which if adopted would make meeting detection goals even more difficult. This paper reviews and compares the current regulatory requirements for the MA elements related to physical inventory, uncertainty of the Inventory Difference (ID), and Process Monitoring (PM) in the United States Department of Energy (DOE) and Nuclear Regulatory Commission (NRC), Rosatom of the Russian Federation and the Chinese Atomic Energy Agency (CAEA) of China. The comparison looks at how the regulatory requirements for the implementation of various MA elements perform across a range of operating capacities in example facilities.

  18. The integration of process monitoring for safeguards

    International Nuclear Information System (INIS)

    Cipiti, Benjamin B.; Zinaman, Owen R.

    2010-01-01

    The Separations and Safeguards Performance Model is a reprocessing plant model that has been developed for safeguards analyses of future plant designs. The model has been modified to integrate bulk process monitoring data with traditional plutonium inventory balances to evaluate potential advanced safeguards systems. Taking advantage of the wealth of operator data such as flow rates and mass balances of bulk material, the timeliness of detection of material loss was shown to improve considerably. Four diversion cases were tested including both abrupt and protracted diversions at early and late times in the run. The first three cases indicated alarms before half of a significant quantity of material was removed. The buildup of error over time prevented detection in the case of a protracted diversion late in the run. Some issues related to the alarm conditions and bias correction will need to be addressed in future work. This work both demonstrates the use of the model for performing diversion scenario analyses and for testing advanced safeguards system designs.

  19. Interface between Sn-Sb-Cu solder and copper substrate

    Energy Technology Data Exchange (ETDEWEB)

    Sebo, P., E-mail: Pavel.Sebo@savba.sk [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Racianska 75, 831 02 Bratislava 3 (Slovakia); Svec, P. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janickovic, D.; Illekova, E. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine)

    2011-07-15

    Highlights: {yields} New lead-free solder materials based on Sn-Sb-Cu were designed and prepared. {yields} Melting and solidification temperatures of the solders have been determined. {yields} Cu-substrate/solder interaction has been analyzed and quantified. {yields} Phases formed at the solder-substrate interface have been identified. {yields} Composition and soldering atmospheres were correlated with joint strength. - Abstract: Influence of antimony and copper in Sn-Sb-Cu solder on the melting and solidification temperatures and on the microstructure of the interface between the solder and copper substrate after wetting the substrate at 623 K for 1800 s were studied. Microstructure of the interface between the solder and copper substrates in Cu-solder-Cu joints prepared at the same temperature for 1800 s was observed and shear strength of the joints was measured. Influence of the atmosphere - air with the flux and deoxidising N{sub 2} + 10H{sub 2} gas - was taken into account. Thermal stability and microstructure were studied by differential scanning calorimetry (DSC), light microscopy, scanning electron microscopy (SEM) with energy-dispersive spectrometry (EDS) and X-ray diffraction (XRD). Melting and solidification temperatures of the solders were determined. An interfacial transition zone was formed by diffusion reaction between solid copper and liquid solder. At the interface Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} phases arise. Cu{sub 3}Sn is adjacent to the Cu substrate and its thickness decreases with increasing the amount of copper in solder. Scallop Cu{sub 6}Sn{sub 5} phase is formed also inside the solder drop. The solid solution Sn(Sb) and SbSn phase compose the interior of the solder drop. Shear strength of the joints measured by push-off method decreases with increasing Sb concentration. Copper in the solder shows even bigger negative effect on the strength.

  20. SINGLE IMAGE CAMERA CALIBRATION IN CLOSE RANGE PHOTOGRAMMETRY FOR SOLDER JOINT ANALYSIS

    Directory of Open Access Journals (Sweden)

    D. Heinemann

    2016-06-01

    Full Text Available Printed Circuit Boards (PCB play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.

  1. A Hodge dual for soldered bundles

    International Nuclear Information System (INIS)

    Lucas, Tiago Gribl; Pereira, J G

    2009-01-01

    In order to account for all possible contractions allowed by the presence of the solder form, a generalized Hodge dual is defined for the case of soldered bundles. Although for curvature the generalized dual coincides with the usual one, for torsion it gives a completely new dual definition. Starting from the standard form of a gauge Lagrangian for the translation group, the generalized Hodge dual yields precisely the Lagrangian of the teleparallel equivalent of general relativity, and consequently also the Einstein-Hilbert Lagrangian of general relativity

  2. Laser assisted soldering: microdroplet accumulation with a microjet device.

    Science.gov (United States)

    Chan, E K; Lu, Q; Bell, B; Motamedi, M; Frederickson, C; Brown, D T; Kovach, I S; Welch, A J

    1998-01-01

    We investigated the feasibility of a microjet to dispense protein solder for laser assisted soldering. Successive micro solder droplets were deposited on rat dermis and bovine intima specimens. Fixed laser exposure was synchronized with the jetting of each droplet. After photocoagulation, each specimen was cut into two halves at the center of solder coagulum. One half was fixed immediately, while the other half was soaked in phosphate-buffered saline for a designated hydration period before fixation (1 hour, 1, 2, and 7 days). After each hydration period, all tissue specimens were prepared for scanning electron microscopy (SEM). Stable solder coagulum was created by successive photocoagulation of microdroplets even after the soldered tissue exposed to 1 week of hydration. This preliminary study suggested that tissue soldering with successive microdroplets is feasible even with fixed laser parameters without active feedback control.

  3. Statistical data processing with automatic system for environmental radiation monitoring

    International Nuclear Information System (INIS)

    Zarkh, V.G.; Ostroglyadov, S.V.

    1986-01-01

    Practice of statistical data processing for radiation monitoring is exemplified, and some results obtained are presented. Experience in practical application of mathematical statistics methods for radiation monitoring data processing allowed to develop a concrete algorithm of statistical processing realized in M-6000 minicomputer. The suggested algorithm by its content is divided into 3 parts: parametrical data processing and hypotheses test, pair and multiple correlation analysis. Statistical processing programms are in a dialogue operation. The above algorithm was used to process observed data over radioactive waste disposal control region. Results of surface waters monitoring processing are presented

  4. Current status of process monitoring for IAEA safeguards

    International Nuclear Information System (INIS)

    Koroyasu, M.

    1987-06-01

    Based on literature survey, this report tries to answer some of the following questions on process monitoring for safeguards purposes of future large scale reprocessing plants: what is process monitoring, what are the basic elements of process monitoring, what kinds of process monitoring are there, what are the basic problems of process monitoring, what is the relationship between process monitoring and near-real-time materials accountancy, what are actual results of process monitoring tests and what should be studied in future. A brief description of Advanced Safeguards Approaches proposed by the four states (France, U.K., Japan and U.S.A.), the approach proposed by the U.S.A., the description of the process monitoring, the main part of the report published as a result of one of the U.S. Support Programmes for IAEA Safeguards and an article on process monitoring presented at an IAEA Symposium held in November 1986 are given in the annexes. 24 refs, 20 figs, tabs

  5. Comparison of implant-abutment interface misfits after casting and soldering procedures.

    Science.gov (United States)

    Neves, Flávio Domingues das; Elias, Gisele Araújo; da Silva-Neto, João Paulo; de Medeiros Dantas, Lucas Costa; da Mota, Adérito Soares; Neto, Alfredo Júlio Fernandes

    2014-04-01

    The aim of this study was to compare vertical and horizontal adjustments of castable abutments after conducting casting and soldering procedures. Twelve external hexagonal implants (3.75 × 10 mm) and their UCLA abutments were divided according their manufacturer and abutment type: PUN (plastic UCLA, Neodent), PUC (plastic UCLA, Conexão), PU3i (plastic UCLA, Biomet 3i), and PUTN (plastic UCLA with Tilite milled base, Neodent). Three infrastructures of a fixed partial implant-supported bridge with 3 elements were produced for each group. The measurements of vertical (VM) and horizontal (HM) misfits were obtained via scanning electron microscopy after completion of casting and soldering. The corresponding values were determined to be biomechanically acceptable to the system, and the results were rated as a percentage. Statistical analysis establishes differences between groups by chi-square after procedures, and McNeman's test was applied to analyze the influence of soldering over casting (α ≤ .05). For the values of VM and HM, respectively, when the casting process was complete, it was observed that 83.25% and 100% (PUTN), 33.3% and 27.75% (PUN), 33.3% and 88.8% (PUC), 33.3% and 94.35% (PU3i) represented acceptable values. After completing the requisite soldering, acceptable values were 50% and 94.35% (PUTN), 16.6% and 77.7% (PUN), 38.55% and 77.7% (PUC), and 27.75% and 94.35% (PU3i). Within the limitations of this study, it can be concluded that the premachined abutments presented more acceptable VM values. The HM values were within acceptable limits before and after the soldering procedure for most groups. Further, the soldering procedure resulted in an increase of VM in all groups.

  6. Radiation Monitoring System in Advanced Spent Fuel Conditioning Process Facility

    Energy Technology Data Exchange (ETDEWEB)

    You, Gil Sung; Kook, D. H.; Choung, W. M.; Ku, J. H.; Cho, I. J.; You, G. S.; Kwon, K. C.; Lee, W. K.; Lee, E. P

    2006-09-15

    The Advanced spent fuel Conditioning Process is under development for effective management of spent fuel by converting UO{sub 2} into U-metal. For demonstration of this process, {alpha}-{gamma} type new hot cell was built in the IMEF basement . To secure against radiation hazard, this facility needs radiation monitoring system which will observe the entire operating area before the hot cell and service area at back of it. This system consists of 7 parts; Area Monitor for {gamma}-ray, Room Air Monitor for particulate and iodine in both area, Hot cell Monitor for hot cell inside high radiation and rear door interlock, Duct Monitor for particulate of outlet ventilation, Iodine Monitor for iodine of outlet duct, CCTV for watching workers and material movement, Server for management of whole monitoring system. After installation and test of this, radiation monitoring system will be expected to assist the successful ACP demonstration.

  7. Radiation Monitoring System in Advanced Spent Fuel Conditioning Process Facility

    International Nuclear Information System (INIS)

    You, Gil Sung; Kook, D. H.; Choung, W. M.; Ku, J. H.; Cho, I. J.; You, G. S.; Kwon, K. C.; Lee, W. K.; Lee, E. P.

    2006-09-01

    The Advanced spent fuel Conditioning Process is under development for effective management of spent fuel by converting UO 2 into U-metal. For demonstration of this process, α-γ type new hot cell was built in the IMEF basement . To secure against radiation hazard, this facility needs radiation monitoring system which will observe the entire operating area before the hot cell and service area at back of it. This system consists of 7 parts; Area Monitor for γ-ray, Room Air Monitor for particulate and iodine in both area, Hot cell Monitor for hot cell inside high radiation and rear door interlock, Duct Monitor for particulate of outlet ventilation, Iodine Monitor for iodine of outlet duct, CCTV for watching workers and material movement, Server for management of whole monitoring system. After installation and test of this, radiation monitoring system will be expected to assist the successful ACP demonstration

  8. Recent progress in online ultrasonic process monitoring

    Science.gov (United States)

    Wen, Szu-Sheng L.; Chen, Tzu-Fang; Ramos-Franca, Demartonne; Nguyen, Ky T.; Jen, Cheng-Kuei; Ihara, Ikuo; Derdouri, A.; Garcia-Rejon, Andres

    1998-03-01

    On-line ultrasonic monitoring of polymer co-extrusion and gas-assisted injection molding are presented. During the co- extrusion of high density polyethylene and Santoprene ultrasonic sensors consisting of piezoelectric transducers and clad ultrasonic buffer rods are used to detect the interface between these two polymers and the stability of the extrusion. The same ultrasonic sensor also measures the surface temperature of the extruded polymer. The results indicate that temperature measurements using ultrasound have a faster response time than those obtained by conventional thermocouple. In gas-assisted injection molding the polymer and gas flow front positions are monitored simultaneously. This information may be used to control the plunger movement.

  9. Monitoring Industrial Food Processes Using Spectroscopy & Chemometrics

    DEFF Research Database (Denmark)

    Pedersen, Dorthe Kjær; Engelsen, Søren Balling

    2001-01-01

    In the last decade rapid spectroscopic measurements have revolutionized quality control in practically all areas of primary food and feed production. Near-infrared spectroscopy (NIR & NIT) has been implemented for monitoring the quality of millions of samples of cereals, milk and meat with unprec......In the last decade rapid spectroscopic measurements have revolutionized quality control in practically all areas of primary food and feed production. Near-infrared spectroscopy (NIR & NIT) has been implemented for monitoring the quality of millions of samples of cereals, milk and meat...

  10. Fatigue damage modeling in solder interconnects using a cohesive zone approach

    NARCIS (Netherlands)

    Abdul-Baqi, A.J.J.; Schreurs, P.J.G.; Geers, M.G.D.

    2005-01-01

    The objective of this work is to model the fatigue damage process in a solder bump subjected to cyclic loading conditions. Fatigue damage is simulated using the cohesive zone methodology. Damage is assumed to occur at interfaces modeled through cohesive zones in the material, while the bulk material

  11. Mobile Monitoring Data Processing and Analysis Strategies

    Science.gov (United States)

    The development of portable, high-time resolution instruments for measuring the concentrations of a variety of air pollutants has made it possible to collect data while in motion. This strategy, known as mobile monitoring, involves mounting air sensors on variety of different pla...

  12. Mobile Monitoring Data Processing & Analysis Strategies

    Science.gov (United States)

    The development of portable, high-time resolution instruments for measuring the concentrations of a variety of air pollutants has made it possible to collect data while in motion. This strategy, known as mobile monitoring, involves mounting air sensors on variety of different pla...

  13. Process monitoring of fibre reinforced composites using optical fibre sensors

    Energy Technology Data Exchange (ETDEWEB)

    Fernando, G.F.; Degamber, B.

    2006-04-15

    The deployment of optical fibre based sensor systems for process monitoring of advanced fibre reinforced organic matrix composites is reviewed. The focus is on thermosetting resins and the various optical and spectroscopy-based techniques that can be used to monitor the processing of these materials. Following brief consideration of the manufacturing methods commonly used in the production of thermoset based composites, a discussion is presented on sensor systems that can be used to facilitate real-time chemical process monitoring. Although the focus is on thermosets, the techniques described can be adapted for chemical monitoring of organic species in general. (author)

  14. Smart membranes for monitoring membrane based desalination processes

    KAUST Repository

    Laleg-Kirati, Taous-Meriem; Karam, Ayman M.

    2017-01-01

    Various examples are related to smart membranes for monitoring membrane based process such as, e.g., membrane distillation processes. In one example, a membrane, includes a porous surface and a plurality of sensors (e.g., temperature, flow and

  15. LIKELIHOOD ESTIMATION OF PARAMETERS USING SIMULTANEOUSLY MONITORED PROCESSES

    DEFF Research Database (Denmark)

    Friis-Hansen, Peter; Ditlevsen, Ove Dalager

    2004-01-01

    The topic is maximum likelihood inference from several simultaneously monitored response processes of a structure to obtain knowledge about the parameters of other not monitored but important response processes when the structure is subject to some Gaussian load field in space and time. The consi....... The considered example is a ship sailing with a given speed through a Gaussian wave field....

  16. Diagnostic monitor for carbon fiber processing

    Science.gov (United States)

    Paulauskas, Felix L.; Bigelow, Timothy S.; Meek, Thomas T.

    2002-01-01

    A method for monitoring characteristics of materials includes placing a material in an application zone, measuring a change in at least one property value of the application zone caused by placing the material in the application zone and relating changes in the property value of the application zone caused by the material to at least one characteristic of the material An apparatus for monitoring characteristics of a material includes a measuring device for measuring a property value resulting from applying a frequency signal to the application zone after placing a material in the application zone and a processor for relating changes in the property value caused by placement of the material in the application zone to at least one desired characteristic of the material. The application zone is preferably a resonant cavity.

  17. Processing Approaches for DAS-Enabled Continuous Seismic Monitoring

    Science.gov (United States)

    Dou, S.; Wood, T.; Freifeld, B. M.; Robertson, M.; McDonald, S.; Pevzner, R.; Lindsey, N.; Gelvin, A.; Saari, S.; Morales, A.; Ekblaw, I.; Wagner, A. M.; Ulrich, C.; Daley, T. M.; Ajo Franklin, J. B.

    2017-12-01

    Distributed Acoustic Sensing (DAS) is creating a "field as laboratory" capability for seismic monitoring of subsurface changes. By providing unprecedented spatial and temporal sampling at a relatively low cost, DAS enables field-scale seismic monitoring to have durations and temporal resolutions that are comparable to those of laboratory experiments. Here we report on seismic processing approaches developed during data analyses of three case studies all using DAS-enabled seismic monitoring with applications ranging from shallow permafrost to deep reservoirs: (1) 10-hour downhole monitoring of cement curing at Otway, Australia; (2) 2-month surface monitoring of controlled permafrost thaw at Fairbanks, Alaska; (3) multi-month downhole and surface monitoring of carbon sequestration at Decatur, Illinois. We emphasize the data management and processing components relevant to DAS-based seismic monitoring, which include scalable approaches to data management, pre-processing, denoising, filtering, and wavefield decomposition. DAS has dramatically increased the data volume to the extent that terabyte-per-day data loads are now typical, straining conventional approaches to data storage and processing. To achieve more efficient use of disk space and network bandwidth, we explore improved file structures and data compression schemes. Because noise floor of DAS measurements is higher than that of conventional sensors, optimal processing workflow involving advanced denoising, deconvolution (of the source signatures), and stacking approaches are being established to maximize signal content of DAS data. The resulting workflow of data management and processing could accelerate the broader adaption of DAS for continuous monitoring of critical processes.

  18. Study on Laser Welding Process Monitoring Method

    OpenAIRE

    Knag , Heeshin

    2017-01-01

    International audience; In this paper, a study of quality monitoring technology for the laser welding was conducted. The laser welding and the industrial robotic systems were used with robot-based laser welding systems. The laser system used in this study was 1.6 kW fiber laser, while the robot system was Industrial robot (pay-load : 130 kg). The robot-based laser welding system was equipped with a laser scanner system for remote laser welding. The welding joints of steel plate and steel plat...

  19. Study on Laser Welding Process Monitoring Method

    OpenAIRE

    Heeshin Knag

    2016-01-01

    In this paper, a study of quality monitoring technology for the laser welding was conducted. The laser welding and the industrial robotic systems were used with robot-based laser welding systems. The laser system used in this study was 1.6 kW fiber laser, while the robot system was Industrial robot (pay-load : 130 kg). The robot-based laser welding system was equipped with a laser scanner system for remote laser welding. The welding joints of steel plate and steel plate coated with zinc were ...

  20. Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack

    Directory of Open Access Journals (Sweden)

    Shoudong Gu

    2016-06-01

    Full Text Available To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT (Surface Mount Technology production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process. Here, the critical jet ejection velocity is discussed through theoretical analysis. The relations between ejection velocity and needle structure, needle velocity, and nozzle diameter were obtained by FLUENT software. Then, the prototype of the solder paste jetting system was fabricated, and the performance was verified by experiments. The effects of the gap between nozzle and needle, the driving voltage, and the nozzle diameter on the jetting performance and droplet diameter were obtained. Solder paste droplets 0.85 mm in diameter were produced when the gap between the nozzle and needle was adjusted to 10 μm, the driving voltage to 80 V, the nozzle diameter to 0.1 mm, and the variation of the droplet diameter was within ±3%.

  1. Processing of the WLCG monitoring data using NoSQL

    Science.gov (United States)

    Andreeva, J.; Beche, A.; Belov, S.; Dzhunov, I.; Kadochnikov, I.; Karavakis, E.; Saiz, P.; Schovancova, J.; Tuckett, D.

    2014-06-01

    The Worldwide LHC Computing Grid (WLCG) today includes more than 150 computing centres where more than 2 million jobs are being executed daily and petabytes of data are transferred between sites. Monitoring the computing activities of the LHC experiments, over such a huge heterogeneous infrastructure, is extremely demanding in terms of computation, performance and reliability. Furthermore, the generated monitoring flow is constantly increasing, which represents another challenge for the monitoring systems. While existing solutions are traditionally based on Oracle for data storage and processing, recent developments evaluate NoSQL for processing large-scale monitoring datasets. NoSQL databases are getting increasingly popular for processing datasets at the terabyte and petabyte scale using commodity hardware. In this contribution, the integration of NoSQL data processing in the Experiment Dashboard framework is described along with first experiences of using this technology for monitoring the LHC computing activities.

  2. Processing of the WLCG monitoring data using NoSQL

    International Nuclear Information System (INIS)

    Andreeva, J; Beche, A; Karavakis, E; Saiz, P; Tuckett, D; Belov, S; Kadochnikov, I; Schovancova, J; Dzhunov, I

    2014-01-01

    The Worldwide LHC Computing Grid (WLCG) today includes more than 150 computing centres where more than 2 million jobs are being executed daily and petabytes of data are transferred between sites. Monitoring the computing activities of the LHC experiments, over such a huge heterogeneous infrastructure, is extremely demanding in terms of computation, performance and reliability. Furthermore, the generated monitoring flow is constantly increasing, which represents another challenge for the monitoring systems. While existing solutions are traditionally based on Oracle for data storage and processing, recent developments evaluate NoSQL for processing large-scale monitoring datasets. NoSQL databases are getting increasingly popular for processing datasets at the terabyte and petabyte scale using commodity hardware. In this contribution, the integration of NoSQL data processing in the Experiment Dashboard framework is described along with first experiences of using this technology for monitoring the LHC computing activities.

  3. 10 CFR 74.53 - Process monitoring.

    Science.gov (United States)

    2010-01-01

    ... estimated measurement standard deviation greater than five percent that is either input or output material... differences greater than three times the estimated standard deviation of the process difference estimator and...; and (4) SSNM involved in research and development operations that process less than five formula...

  4. Monitoring Assertion-Based Business Processes

    NARCIS (Netherlands)

    Aiello, Marco; Lazovik, Alexander

    2006-01-01

    Business processes that span organizational borders describe the interaction between multiple parties working towards a common objective. They also express business rules that govern the behavior of the process and account for expressing changes reflecting new business objectives and new market

  5. Use of process monitoring data to enhance material accounting

    International Nuclear Information System (INIS)

    Brouns, R.J.; Smith, B.W.

    1980-01-01

    A study was conducted for the Nuclear Regulatory Commission as part of a continuing program to estimate the effectiveness of using process monitoring data to enhance special nuclear material accounting in nuclear facilities. Two licensed fuel fabrication facilities with internal scrap recovery processes were examined. The loss detection sensitivity, timeliness, and localization capabilities of the process monitoring technique were evaluated for single and multiple (trickle) losses. 4 refs

  6. Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

    Directory of Open Access Journals (Sweden)

    Shuye Zhang

    2018-01-01

    Full Text Available Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared with pressure based contact of metal conductor balls. Recently, flex-on-board interconnection has become more and more popular for mobile electronic applications. However, crack formation of the solder joint crack was occurred at low temperature curable acrylic polymer resins after bonding processes. In this study, the mechanism of SnBi58 solder joint crack at low temperature curable acrylic adhesive was investigated. In addition, SnBi58 solder joint cracks can be significantly removed by increasing the storage modulus of adhesives instead of coefficient of thermal expansion. The first approach of reducing the amount of polymer rebound can be achieved by using an ultrasonic bonding method to maintain a bonding pressure on the SnBi58 solder joints cooling to room temperature. The second approach is to increase storage modulus of adhesives by adding silica filler into acrylic polymer resins to prevent the solder joint from cracking. Finally, excellent acrylic based SnBi58 solder joints reliability were obtained after 1000 cycles thermal cycling test.

  7. Monitoring activities of satellite data processing services in real-time with SDDS Live Monitor

    Science.gov (United States)

    Duc Nguyen, Minh

    2017-10-01

    This work describes Live Monitor, the monitoring subsystem of SDDS - an automated system for space experiment data processing, storage, and distribution created at SINP MSU. Live Monitor allows operators and developers of satellite data centers to identify errors occurred in data processing quickly and to prevent further consequences caused by the errors. All activities of the whole data processing cycle are illustrated via a web interface in real-time. Notification messages are delivered to responsible people via emails and Telegram messenger service. The flexible monitoring mechanism implemented in Live Monitor allows us to dynamically change and control events being shown on the web interface on our demands. Physicists, whose space weather analysis models are functioning upon satellite data provided by SDDS, can use the developed RESTful API to monitor their own events and deliver customized notification messages by their needs.

  8. Monitoring activities of satellite data processing services in real-time with SDDS Live Monitor

    Directory of Open Access Journals (Sweden)

    Duc Nguyen Minh

    2017-01-01

    Full Text Available This work describes Live Monitor, the monitoring subsystem of SDDS – an automated system for space experiment data processing, storage, and distribution created at SINP MSU. Live Monitor allows operators and developers of satellite data centers to identify errors occurred in data processing quickly and to prevent further consequences caused by the errors. All activities of the whole data processing cycle are illustrated via a web interface in real-time. Notification messages are delivered to responsible people via emails and Telegram messenger service. The flexible monitoring mechanism implemented in Live Monitor allows us to dynamically change and control events being shown on the web interface on our demands. Physicists, whose space weather analysis models are functioning upon satellite data provided by SDDS, can use the developed RESTful API to monitor their own events and deliver customized notification messages by their needs.

  9. Mechanical properties of soldered joints of niobium base alloys

    International Nuclear Information System (INIS)

    Grishin, V.L.

    1980-01-01

    Mechanical properties of soldered joints of niobium alloys widely distributed in industry: VN3, VN4, VN5A, VN5AE, VN5AEP etc., 0.6-1.2 mm thick are investigated. It is found out that the usage of zirconium-vanadium, titanium-tantalum solders for welding niobium base alloys permits to obtain soldered joints with satisfactory mechanical properties at elevated temperatures

  10. Prompt Gamma Ray Spectroscopy for process monitoring

    International Nuclear Information System (INIS)

    Zoller, W.H.; Holmes, J.L.

    1991-01-01

    Prompt Gamma Ray Spectroscopy (PGRS) is a very powerful analytical technique able to measure many metallic, contamination problem elements. The technique involves measurement of gamma rays that are emitted by nuclei upon capturing a neutron. This method is sensitive not only to the target element but also to the particular isotope of that element. PGRS is capable of measuring dissolved metal ions in a flowing system. In the field, isotopic neutron sources are used to produce the desired neutron flux ( 252 Cf can produce neutron flux of the order of 10 8 neutrons/cm 2 --sec.). Due to high penetrating power of gamma radiation, high efficiency gamma ray detectors can be placed in an appropriate geometry to maximize sensitivity, providing real-time monitoring with low detection level capabilities

  11. In-situ acoustic signature monitoring in additive manufacturing processes

    Science.gov (United States)

    Koester, Lucas W.; Taheri, Hossein; Bigelow, Timothy A.; Bond, Leonard J.; Faierson, Eric J.

    2018-04-01

    Additive manufacturing is a rapidly maturing process for the production of complex metallic, ceramic, polymeric, and composite components. The processes used are numerous, and with the complex geometries involved this can make quality control and standardization of the process and inspection difficult. Acoustic emission measurements have been used previously to monitor a number of processes including machining and welding. The authors have identified acoustic signature measurement as a potential means of monitoring metal additive manufacturing processes using process noise characteristics and those discrete acoustic emission events characteristic of defect growth, including cracks and delamination. Results of acoustic monitoring for a metal additive manufacturing process (directed energy deposition) are reported. The work investigated correlations between acoustic emissions and process noise with variations in machine state and deposition parameters, and provided proof of concept data that such correlations do exist.

  12. Tool path strategy and cutting process monitoring in intelligent machining

    Science.gov (United States)

    Chen, Ming; Wang, Chengdong; An, Qinglong; Ming, Weiwei

    2018-06-01

    Intelligent machining is a current focus in advanced manufacturing technology, and is characterized by high accuracy and efficiency. A central technology of intelligent machining—the cutting process online monitoring and optimization—is urgently needed for mass production. In this research, the cutting process online monitoring and optimization in jet engine impeller machining, cranio-maxillofacial surgery, and hydraulic servo valve deburring are introduced as examples of intelligent machining. Results show that intelligent tool path optimization and cutting process online monitoring are efficient techniques for improving the efficiency, quality, and reliability of machining.

  13. Evaluation on the characteristics of tin-silver-bismuth solder

    Science.gov (United States)

    Xia, Z.; Shi, Y.; Chen, Z.

    2002-02-01

    Tin-silver-bismuth solder is characterized by its lower melting point, good wetting behavior, and good mechanical property for which it is expected to be a new lead-free solder to replace tin-lead solder. In this article, Sn-3.33Ag-4.83Bi solder was investigated concerning its physical, spreading, and mechanical properties under specific conditions. Cooling curves and DSC results showed that it was close to eutectic composition (m.p. 210° 212 °C). Coefficiency of thermal expansion (CTE) of this solder, between that of PCBs and copper substrates, was beneficial to alleviate the thermal mismatch of the substrates. It was also a good electrical and thermal conductor. Using a rosin-based, mildly activated (RMA) flux, a spreading test indicated that SnAgBi solder paste had good solderability. Meanwhile, the solder had high tensile strength and fracture energy. Its fracture mechanism was a mixture of ductile and brittle fracture morphology. The metallographic and EDAX analyses indicated that it was composed of a tin-based solid solution and some intermetallic compound (IMC) that could strengthen the substrate. However, these large needle-like IMCs would cut the substrate and this resulted in the decreasing of the toughness of the solder.

  14. Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

    Energy Technology Data Exchange (ETDEWEB)

    Hamm, Randy; Peterson, Kenneth A.

    2015-10-01

    This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm X 6.5 mm X 0.1 mm (0.354” x 0.256” x 0.004”), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while maintaining a consistent bondline (minimizing die tilt). Voiding was measured using acoustic imaging and die tilt was measured using two different optical measurement systems. 80Au-20Sn solder reflow was achieved using a batch vacuum solder system with optimized fixturing. Minimizing die tilt proved to be the more difficult of the two product requirements to meet. Process development variables included tooling, weight and solder preform thickness.

  15. Signal Processing Methods Monitor Cranial Pressure

    Science.gov (United States)

    2010-01-01

    Dr. Norden Huang, of Goddard Space Flight Center, invented a set of algorithms (called the Hilbert-Huang Transform, or HHT) for analyzing nonlinear and nonstationary signals that developed into a user-friendly signal processing technology for analyzing time-varying processes. At an auction managed by Ocean Tomo Federal Services LLC, licenses of 10 U.S. patents and 1 domestic patent application related to HHT were sold to DynaDx Corporation, of Mountain View, California. DynaDx is now using the licensed NASA technology for medical diagnosis and prediction of brain blood flow-related problems, such as stroke, dementia, and traumatic brain injury.

  16. APACS: Monitoring and diagnosis of complex processes

    International Nuclear Information System (INIS)

    Kramer, B.M.; Mylopoulos, J.; Cheng Wang

    1994-01-01

    This paper describes APACS - a new framework for a system that detects, predicts and identifies faults in industrial processes. The APACS frameworks provides a structure in which a heterogeneous set of programs can share a common view of the problem and a common model of the domain. (author). 17 refs, 2 figs

  17. Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperature

    Energy Technology Data Exchange (ETDEWEB)

    Prabhu, K.N., E-mail: prabhukn_2002@yahoo.co.in [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India); Deshapande, Parashuram; Satyanarayan [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India)

    2012-01-30

    Highlights: Black-Right-Pointing-Pointer Effect of cooling rate on tensile and impact properties of Sn-9Zn alloy was assessed. Black-Right-Pointing-Pointer Both DBTT and UTS of the solder alloy increased with increase in cooling rate. Black-Right-Pointing-Pointer An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile-brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn-9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 Degree-Sign C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the

  18. Effect of cooling rate during solidification of Sn–9Zn lead-free solder alloy on its microstructure, tensile strength and ductile–brittle transition temperature

    International Nuclear Information System (INIS)

    Prabhu, K.N.; Deshapande, Parashuram; Satyanarayan

    2012-01-01

    Highlights: ► Effect of cooling rate on tensile and impact properties of Sn–9Zn alloy was assessed. ► Both DBTT and UTS of the solder alloy increased with increase in cooling rate. ► An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile–brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn–9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 °C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the DBTT.

  19. Adaptive Soa Stack-Based Business Process Monitoring Platform

    Directory of Open Access Journals (Sweden)

    Przemysław Dadel

    2014-01-01

    Full Text Available Executable business processes that formally describe company activities are well placed in the SOA environment as they allow for declarative organization of high-level system logic.However, for both technical and non-technical users, to fully benet from that element of abstractionappropriate business process monitoring systems are required and existing solutions remain unsatisfactory.The paper discusses the problem of business process monitoring in the context of the service orientation paradigm in order to propose an architectural solution and provide implementation of a system for business process monitoring that alleviates the shortcomings of the existing solutions.Various platforms are investigated to obtain a broader view of the monitoring problem and to gather functional and non-functional requirements. These requirements constitute input forthe further analysis and the system design. The monitoring software is then implemented and evaluated according to the specied criteria.An extensible business process monitoring system was designed and built on top of OSGiMM - a dynamic, event-driven, congurable communications layer that provides real-time monitoring capabilities for various types of resources. The system was tested against the stated functional requirements and its implementation provides a starting point for the further work.It is concluded that providing a uniform business process monitoring solution that satises a wide range of users and business process platform vendors is a dicult endeavor. It is furthermore reasoned that only an extensible, open-source, monitoring platform built on top of a scalablecommunication core has a chance to address all the stated and future requirements.

  20. Ultrasonic flow measurements for irrigation process monitoring

    Science.gov (United States)

    Ziani, Elmostafa; Bennouna, Mustapha; Boissier, Raymond

    2004-02-01

    This paper presents the state of the art of the general principle of liquid flow measurements by ultrasonic method, and problems of flow measurements. We present an ultrasonic flowmeter designed according to smart sensors concept, for the measurement of irrigation water flowing through pipelines or open channels, using the ultrasonic transit time approach. The new flowmeter works on the principle of measuring time delay differences between sound pulses transmitted upstream and downstream in the flowing liquid. The speed of sound in the flowing medium is eliminated as a variable because the flowrate calculations are based on the reciprocals of the transmission times. The transit time difference is digitally measured by means of a suitable, microprocessor controlled logic. This type of ultrasonic flowmeter will be widely used in industry and water management, it is well studied in this work, followed by some experimental results. For pressurized channels, we use one pair of ultrasonic transducer arranged in proper positions and directions of the pipe, in this case, to determine the liquid velocity, a real time on-line analysis taking account the geometries of the hydraulic system, is applied to the obtained ultrasonic data. In the open channels, we use a single or two pairs of ultrasonic emitter-receiver according to the desired performances. Finally, the goals of this work consist in integrating the smart sensor into irrigation systems monitoring in order to evaluate potential advantages and demonstrate their performance, on the other hand, to understand and use ultrasonic approach for determining flow characteristics and improving flow measurements by reducing errors caused by disturbances of the flow profiles.

  1. Process monitoring in modern safeguards applications

    International Nuclear Information System (INIS)

    Ehinger, M.H.

    1989-01-01

    From the safeguards standpoint, regulatory requirements are finally moving into the modern world of communication and information processing. Gone are the days when the accountant with the green eye shade and arm bands made judgments on the material balance a month after the balance was closed. The most recent Nuclear Regulatory Commission (NRC) regulations and U.S. Department of Energy (DOE) orders have very strict standards for timeliness and sensitivity to loss or removal of material. The latest regulations recognize that plant operators have a lot of information on and control over the location and movement of material within their facilities. This information goes beyond that traditionally reported under accountability requirements. These new regulations allow facility operators to take credit for many of the more informal process controls

  2. Design of MPU based process monitoring instrument

    International Nuclear Information System (INIS)

    Ahmed, Z.; Qamar, R.; Majid, B.

    1995-03-01

    A display sub-system (DSS) for a process variable like flow is designed around Intel 8088 microprocessor. It displays the current value of a process variable but average and accumulated value display is manually selectable. The display consists of 6 units of seven segment display and accuracy up to 2 nd place of decimal is achieved. The engineering units are indicated by the LEDs. The control software is developed in assembler and burnt in a EPROM. The maximum value of the display is 9999.99 K. liter and that of time is 99 days 23 hours and 59 minutes. Sampling period is 1 second. Data acquisition is done using Polling technique. (author)

  3. Metrology Sampling Strategies for Process Monitoring Applications

    KAUST Repository

    Vincent, Tyrone L.

    2011-11-01

    Shrinking process windows in very large scale integration semiconductor manufacturing have already necessitated the development of control systems capable of addressing sub-lot-level variation. Within-wafer control is the next milestone in the evolution of advanced process control from lot-based and wafer-based control. In order to adequately comprehend and control within-wafer spatial variation, inline measurements must be performed at multiple locations across the wafer. At the same time, economic pressures prompt a reduction in metrology, for both capital and cycle-time reasons. This paper explores the use of modeling and minimum-variance prediction as a method to select the sites for measurement on each wafer. The models are developed using the standard statistical tools of principle component analysis and canonical correlation analysis. The proposed selection method is validated using real manufacturing data, and results indicate that it is possible to significantly reduce the number of measurements with little loss in the information obtained for the process control systems. © 2011 IEEE.

  4. PLS-based memory control scheme for enhanced process monitoring

    KAUST Repository

    Harrou, Fouzi; Sun, Ying

    2017-01-01

    Fault detection is important for safe operation of various modern engineering systems. Partial least square (PLS) has been widely used in monitoring highly correlated process variables. Conventional PLS-based methods, nevertheless, often fail

  5. sampling plans for monitoring quality control process at a plastic

    African Journals Online (AJOL)

    Dr Obe

    AT A PLASTIC MANUFACTURING FIRM IN NIGERIA: A CASE STUDY. By. E.A. Onyeagoro ... manufacture similar products, so that each company ... monitoring of production to maintain process ... concept of designing quality into product, with.

  6. Portable spectrometer monitors inert gas shield in welding process

    Science.gov (United States)

    Grove, E. L.

    1967-01-01

    Portable spectrometer using photosensitive readouts, monitors the amount of oxygen and hydrogen in the inert gas shield of a tungsten-inert gas welding process. A fiber optic bundle transmits the light from the welding arc to the spectrometer.

  7. Conflict Monitoring in Dual Process Theories of Thinking

    Science.gov (United States)

    De Neys, Wim; Glumicic, Tamara

    2008-01-01

    Popular dual process theories have characterized human thinking as an interplay between an intuitive-heuristic and demanding-analytic reasoning process. Although monitoring the output of the two systems for conflict is crucial to avoid decision making errors there are some widely different views on the efficiency of the process. Kahneman…

  8. Access Control for Monitoring System-Spanning Business Processes

    NARCIS (Netherlands)

    Bassil, S.; Reichert, M.U.; Bobrik, R.; Bauer, Th.

    2007-01-01

    Integrated process support is highly desirable in environ- ments where data related to a particular (business) process are scattered over distributed and heterogeneous information systems (IS). A process monitoring component is a much-needed module in order to provide an integrated view on all these

  9. A Log Mining Approach for Process Monitoring in SCADA

    NARCIS (Netherlands)

    Hadziosmanovic, D.; Bolzoni, D.; Hartel, Pieter H.

    2012-01-01

    SCADA (Supervisory Control and Data Acquisition) systems are used for controlling and monitoring industrial processes. We propose a methodology to systematically identify potential process-related threats in SCADA. Process-related threats take place when an attacker gains user access rights and

  10. A Log Mining Approach for Process Monitoring in SCADA

    NARCIS (Netherlands)

    Hadziosmanovic, D.; Bolzoni, D.; Hartel, Pieter H.

    2010-01-01

    SCADA (Supervisory Control and Data Acquisition) systems are used for controlling and monitoring industrial processes. We propose a methodology to systematically identify potential process-related threats in SCADA. Process-related threats take place when an attacker gains user access rights and

  11. Methods of Complex Data Processing from Technical Means of Monitoring

    Directory of Open Access Journals (Sweden)

    Serhii Tymchuk

    2017-03-01

    Full Text Available The problem of processing the information from different types of monitoring equipment was examined. The use of generalized methods of information processing, based on the techniques of clustering combined territorial information sources for monitoring and the use of framing model of knowledge base for identification of monitoring objects was proposed as a possible solution of the problem. Clustering methods were formed on the basis of Lance-Williams hierarchical agglomerative procedure using the Ward metrics. Frame model of knowledge base was built using the tools of object-oriented modeling.

  12. FY 1998 report on the waste processing/recycling related technology, 'The R and D of lead-free solder standardization'; 1998 nendo haikibutsu shori recycle kanren gijutsu seika hokokusho. Namari free handa kikakuka nado kenkyu kaihatsu

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2000-03-01

    To reduce the environmental pollution caused by lead eluted from the electronic equipment waste, the R and D on lead-free solder were conducted and the results were summarized. As to the basic characteristics, the evaluation test method was studied in terms of the range of melting temperature, mechanical strength, wettability and joint strength, to select a uniform test method. As the lead-free solder, Sn-Ag alloys were mainly used and mixed in a combination of Cu, Bi and In. Changes in characteristics were made clear by adding trace elements such as Ge, Mn and P. Relating to the applied characteristics, in selection of solder materials, materials were selected for which evaluation of the commercialization is proceeded with from a viewpoint of promotion of commercialization. Concerning the experimental evaluation of characteristics of lead-free solder in mounted substrates, it was indicated that basically lead-free solder can be practically used. Further, it was indicated that the Sn-Ag-Cu-Bi system depends not on solder composition but on active force, printing accuracy and flux characteristic of solder paste, that improvement of solder paste has an effect on mounting characteristics. (NEDO)

  13. PLS-based memory control scheme for enhanced process monitoring

    KAUST Repository

    Harrou, Fouzi

    2017-01-20

    Fault detection is important for safe operation of various modern engineering systems. Partial least square (PLS) has been widely used in monitoring highly correlated process variables. Conventional PLS-based methods, nevertheless, often fail to detect incipient faults. In this paper, we develop new PLS-based monitoring chart, combining PLS with multivariate memory control chart, the multivariate exponentially weighted moving average (MEWMA) monitoring chart. The MEWMA are sensitive to incipient faults in the process mean, which significantly improves the performance of PLS methods and widen their applicability in practice. Using simulated distillation column data, we demonstrate that the proposed PLS-based MEWMA control chart is more effective in detecting incipient fault in the mean of the multivariate process variables, and outperform the conventional PLS-based monitoring charts.

  14. Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Lin, C.-T. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China); Hsi, C.-S. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Wang, M.-C. [Faculty of Fragrance and Cosmetics, Kaohsiung Medical University, 100 Shih-Chuan 1st Road, Kaohsiung 807, Taiwan (China)], E-mail: mcwang@kmu.edu.tw; Chang, T.-C.; Liang, M.-K. [Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China)

    2008-07-14

    Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 {+-} 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 {+-} 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 {+-} 0.3 and 1.7 {+-} 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu{sub 5}Zn{sub 8} intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu{sub 6}Sn{sub 5} IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu{sub 6}Sn{sub 5} IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength.

  15. Smart membranes for monitoring membrane based desalination processes

    KAUST Repository

    Laleg-Kirati, Taous-Meriem

    2017-10-12

    Various examples are related to smart membranes for monitoring membrane based process such as, e.g., membrane distillation processes. In one example, a membrane, includes a porous surface and a plurality of sensors (e.g., temperature, flow and/or impedance sensors) mounted on the porous surface. In another example, a membrane distillation (MD) process includes the membrane. Processing circuitry can be configured to monitor outputs of the plurality of sensors. The monitored outputs can be used to determine membrane degradation, membrane fouling, or to provide an indication of membrane replacement or cleaning. The sensors can also provide temperatures or temperature differentials across the porous surface, which can be used to improve modeling or control the MD process.

  16. Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

    Science.gov (United States)

    Yoon, Jeong-Won; Noh, Bo-In; Jung, Seung-Boo

    2011-09-01

    Interfacial reactions and joint reliability of Sn-3.0Ag-0.5Cu solder with two different surface finishes, electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG), were evaluated during a reflow process. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn-Ag-Cu/ENIG joint exhibited a higher intermetallic compound (IMC) growth rate and a higher consumption rate of the Ni(P) layer than the Sn-Ag-Cu/ENEPIG joint. The presence of the Pd layer in the ENEPIG suppressed the growth of the interfacial IMC layer and the consumption of the Ni(P) layer, resulting in the superior interfacial stability of the solder joint. The shear test results show that the ENIG joint fractured along the interface, exhibiting indications of brittle failure possibly due to the brittle IMC layer. In contrast, the failure of the ENEPIG joint only went through the bulk solder, supporting the idea that the interface is mechanically reliable. The results from this study confirm that the Sn-Ag-Cu/ENEPIG solder joint is mechanically robust and, thus, the combination is a viable option for a Pb-free package system.

  17. Laser-activated protein solder for peripheral nerve repair

    Science.gov (United States)

    Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

    1995-05-01

    A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

  18. Soldering of copper-clad niobium--titanium superconductor composite

    International Nuclear Information System (INIS)

    Moorhead, A.J.; Woodhouse, J.J.; Easton, D.S.

    1977-04-01

    When superconductivity is applied to various electrical devices, the joining of the superconducting material and the performance of the joints are generally crucial to the successful operation of the system. Although many techniques are being considered for joining composite superconductors, soldering is the most common. We determined the wetting and flow behavior of various solder and flux combinations on a copper-clad Nb-Ti composite, developed equipment and techniques for soldering and inspection of lap joints, and determined the shear strength of joints at temperatures down to -269 0 C (4 0 K). We studied 15 solders and 17 commercial and experimental fluxes in the wettability and flow tests. A resistance unit was built for soldering test specimens. A series of samples soldered with 80 Pb-20 Sn, 83 Pb-15 Sn-2 Sb, 97.5 Pb-1.5 Ag-1 Sn, 80 In-15 Pb-5 Ag, or 25 In-37.5 Pb-37.5 Sn (wt percent) was inspected by three nondestructive techniques. Through-transmission ultrasound gave the best correlation with nonbond areas revealed in peel tests. Single-lap shear specimens soldered with 97.5 Pb-1.5 Ag-1 Sn had the highest strength (10.44 ksi, 72 MPa) and total elongation (0.074 in., 1.88 mm) at -269 0 C (4 0 K) of four solders tested

  19. The effect of micro alloying on the microstructure evolution of Sn-Ag-Cu lead-free solder

    Science.gov (United States)

    Werden, Jesse

    The microelectronics industry is required to obtain alternative Pb-free soldering materials due to legal, environmental, and technological factors. As a joining material, solder provides an electrical and mechanical support in electronic assemblies and therefore, the properties of the solder are crucial to the durability and reliability of the solder joint and the function of the electronic device. One major concern with new Pb-free alternatives is that the microstructure is prone to microstructural coarsening over time which leads to inconsistent properties over the device's lifetime. Power aging the solder is a common method of stabilizing the microstructure for Pb-based alloys, however, it is unclear if this will be an appropriate solution to the microstructural coarsening of Pb-free solders. The goal of this work is to develop a better understanding of the coarsening process in new solder alloys and to suggest methods of stabilizing the solder microstructure. Microalloying is one potential solution to the microstructural coarsening problem. This experiment consists of a microstructural coarsening study of SAC305 in which each sample has been alloyed with one of three different solutes, directionally solidified at 100microm/s, and then aged at three different temperatures over a total period of 20 days. There are several important conclusions from this experiment. First, the coarsening kinetics of the intermetallics in the ternary eutectic follow the Ostwald ripening model where r3 in proprotional to t for each alloying constituent. Second, the activation energy for coarsening was found to be 68.1+/-10.3 kJ/mol for the SAC305 samples, Zn had the most significant increase in the activation energy increasing it to 88.8+/-34.9 kJ/mol for the SAC+Zn samples, Mn also increased the activation energy to 83.2+/-20.8 kJ/mol for the SAC+Mn samples, and Sb decreased the activation energy to 48.0+/-3.59 kJ/mol for the SAC+Sb samples. Finally, it was found that the

  20. Measurement of erosion of stainless steel by molten lead-free solder using micro-focus x-ray CT system

    International Nuclear Information System (INIS)

    Nishikawa, Hiroshi; Takemoto, Tadashi; Kang, Songai

    2009-01-01

    The severe erosion damage, which is caused by a molten lead-free solder, of wave solder equipment made into stainless steel has been encountered in operation. Then, the higher maintenance frequency and reduced life time of wave solder machine component is a serious issue in a manufacturing process. In this study, the evaluation method of erosion of stainless steel by molten lead-free solders was investigated using micro-focus X-ray systems for fluoroscopic and computed tomography (CT). As a result, it was found that the fluoroscopic image could truly reconstruct the cross-shape of the stainless steel sample after immersion test without destruction. In the case of X-ray systems for fluoroscopic and CT used in this study, three-dimensional data can be obtained. Therefore, it was possible to easily check the whole picture of the test sample after immersion test and to decide the maximum erosion depth of test sample. (author)

  1. Groundwater monitoring plan for the 300 Area process trenches

    Energy Technology Data Exchange (ETDEWEB)

    Lindberg, J.W.; Chou, C.J.; Johnson, V.G.

    1995-05-23

    This document describes the groundwater monitoring program for the Hanford Site 300 Area Process Trenches (300 APT). The 300 APT are a Resource Conservation and Recovery Act of 1976 (RCRA) regulated unit. The 300 APT are included in the Dangerous Waste Portion of the Resource Conservation and Recovery Act Permit for the Treatment, Storage, and Disposal of Dangerous Waste, Permit No. WA890008967, and are subject to final-status requirements for groundwater monitoring. This document describes a compliance monitoring program for groundwater in the uppermost aquifer system at the 300 APT. This plan describes the 300 APT monitoring network, constituent list, sampling schedule, statistical methods, and sampling and analysis protocols that will be employed for the 300 APT. This plan will be used to meet groundwater monitoring requirements from the time the 300 APT becomes part of the Permit and through the postclosure care period until certification of final closure.

  2. Predictive business process monitoring with LSTM neural networks

    NARCIS (Netherlands)

    Tax, N.; Verenich, I.; La Rosa, M.; Dumas, M.; Pohl, Klaus; Dubois, Eric

    2017-01-01

    Predictive business process monitoring methods exploit logs of completed cases of a process in order to make predictions about running cases thereof. Existing methods in this space are tailor-made for specific prediction tasks. Moreover, their relative accuracy is highly sensitive to the dataset at

  3. Nanoconstruction by welding individual metallic nanowires together using nanoscale solder

    International Nuclear Information System (INIS)

    Peng, Y; Inkson, B J; Cullis, A G

    2010-01-01

    This work presents a new bottom-up nanowelding technique enabling building blocks to be assembled and welded together into complex 3D nanostructures using nanovolumes of metal solder. The building blocks of gold nanowires, (Co 72 Pt 28 /Pt) n multilayer nanowires, and nanosolder Sn 99 Au 1 alloy nanowires were successfully fabricated by a template technique. Individual metallic nanowires were picked up and assembled together. Conductive nanocircuits were then welded together using similar or dissimilar nanosolder material. At the weld sites, nanoscale volumes of a chosen metal are deposited using nanosolder of a sacrificial nanowire, which ensures that the nanoobjects to be bonded retain their structural integrity. The whole nanowelding process is clean, controllable and reliable, and ensures both mechanically strong and electrically conductive contacts.

  4. Microstructure and mechanical properties of Sn-9Zn-xAl2O3 nanoparticles (x=0–1) lead-free solder alloy: First-principles calculation and experimental research

    International Nuclear Information System (INIS)

    Xing, Wen-qing; Yu, Xin-ye; Li, Heng; Ma, Le; Zuo, Wei; Dong, Peng; Wang, Wen-xian; Ding, Min

    2016-01-01

    This paper studies microstructure and mechanical properties of Sn-9Zn-x Al 2 O 3 nanoparticles (x=0–1) lead-free solder alloy. The interface structure, interface energy and electronic properties of Al 2 O 3 /Sn9Zn interface are investigated by first-principle calculation. On the experimental part, in comparison with the plain Sn-9Zn solder, the Al 2 O 3 nanoparticles incorporated into the solder matrix can inhibit the growth of coarse dendrite Sn-Zn eutectic structure and refine grains of the composite solders during the solidification process of the alloys. Moreover, the microhardness and average tensile strength of the solders with addition of Al 2 O 3 nanoparticles increased with the increasing weight percentages of Al 2 O 3 nanoparticles. These improved mechanical properties can be attributed to the microstructure developments and the dispersed Al 2 O 3 nanoparticles.

  5. Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder

    Science.gov (United States)

    2015-05-05

    under bump metallurgy and solder joint geometry on Sn grain morphology in Pb free solder joints were examined. SnAgCu solder joints were examined for...free solder interconnects”, Sci. Technol. Weld . Join. 13, 732 (2008). [3.25] Terashima, S., Takahama, K., Nozaki, M., and Tanaka, M. Recrystallization

  6. Assessment of Process Monitoring Techniques for Pyro processing Safeguards

    Energy Technology Data Exchange (ETDEWEB)

    Jung, Y. E.; Kim, C. M.; Yim, M. S. [KAIST, Daejeon (Korea, Republic of)

    2016-05-15

    PM technologies can be used to inspect normal/off-normal operation with various data obtained from facility operations in real time to meet safeguards objectives. To support the use of PM technologies for the purpose of pyroprocessing safeguards, this study aims at identifying technologies that could be useful for PM purposes and evaluating their applicability to a pyroprocessing facility. This paper describes the development of the assessment criteria to evaluate the practicality of candidate technologies for PM based on a variety of requirements and considerations. By using the developed assessment criteria, application of technologies in the oxide reduction process was assessed as a test case example. Research is necessary to validate the criteria according to the needs of each unit process, perhaps based on expert elicitation and/or international collaboration with other expert organization(s). These advanced assessment criteria will serve a useful guideline for selecting appropriate candidate PM technologies for pyroprocessing safeguards. Based on the results of using these evaluation criteria, the optimum technologies can be successfully selected for use at a large scale pyroprocessing facility.

  7. A new tritium process monitor based on scintillating fibres

    International Nuclear Information System (INIS)

    Pacenti, P.; Edwards, R.A.H.; Monte, A. de; Campi, F.

    1998-01-01

    The main requirements for tritium monitoring in processes related with fusion fuel cycle are low tritium memory, fast response and accuracy, in decreasing order of importance. At present, in-line tritium monitoring in such tritium processing is done mostly using ionization chambers, which suffer a number of drawbacks: output and sensitivity depends on total gas pressure, composition and flow, etc., and have problems such as tritium memory and generally of saturation effect at high tritium concentrations. Solid scintillators can only work well with tritium if they offer a large surface area, because tritium is absorbed within the first microns of material. The present design uses entirely inorganic scintillator and construction materials, chosen to minimize tritium memory. The described on line and real time tritium detector presents some advantages in comparison with well established flow-through tritium process monitors, such as ionization chambers and thermal conductivity detectors. (authors)

  8. Numerical prediction of mechanical properties of Pb-Sn solder alloys containing antimony, bismuth and or silver ternary trace elements

    Science.gov (United States)

    Gadag, Shiva P.; Patra, Susant

    2000-12-01

    Solder joint interconnects are mechanical means of structural support for bridging the various electronic components and providing electrical contacts and a thermal path for heat dissipation. The functionality of the electronic device often relies on the structural integrity of the solder. The dimensional stability of solder joints is numerically predicted based on their mechanical properties. Algorithms to model the kinetics of dissolution and subsequent growth of intermetallic from the complete knowledge of a single history of time-temperature-reflow profile, by considering equivalent isothermal time intervals, have been developed. The information for dissolution is derived during the heating cycle of reflow and for the growth process from cooling curve of reflow profile. A simple and quick analysis tool to derive tensile stress-strain maps as a function of the reflow temperature of solder and strain rate has been developed by numerical program. The tensile properties are used in modeling thermal strain, thermal fatigue and to predict the overall fatigue life of solder joints. The numerical analysis of the tensile properties as affected by their composition and rate of testing, has been compiled in this paper. A numerical model using constitutive equation has been developed to evaluate the interfacial fatigue crack growth rate. The model can assess the effect of cooling rate, which depends on the level of strain energy release rate. Increasing cooling rate from normalizing to water-quenching, enhanced the fatigue resistance to interfacial crack growth by up to 50% at low strain energy release rate. The increased cooling rates enhanced the fatigue crack growth resistance by surface roughening at the interface of solder joint. This paper highlights salient features of process modeling. Interfacial intermetallic microstructure is affected by cooling rate and thereby affects the mechanical properties.

  9. Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/ Pd/ Au surface finishes

    International Nuclear Information System (INIS)

    NorAkmal, F.; Ourdjini, A.; Azmah Hanim, M.A.; Siti Aisha, I.; Chin, Y.T.

    2007-01-01

    Flip chip technology provides the ultimate in high I/ O-density and count with superior electrical performance for interconnecting electronic components. Therefore, the study of the intermetallic compounds was conducted to investigate the effect of solder bumps sizes on several surface finishes which are copper and Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) which is widely used in electronics packaging as surface finish for flip-chip application nowadays. In this research, field emission scanning electron microscopy (FESEM) analysis was conducted to analyze the morphology and composition of intermetallic compounds (IMCs) formed at the interface between the solder and UBM. The IMCs between the SAC lead-free solder with Cu surface finish after reflow were mainly (Cu, Ni) 6 Sn 5 and Cu 6 Sn 5 . While the main IMCs formed between lead-free solder on ENEPIG surface finish are (Ni, Cu) 3 Sn 4 and Ni 3 Sn 4 . The results from FESEM with energy dispersive x-ray (EDX) have revealed that isothermal aging at 150 degree Celsius has caused the thickening and coarsening of IMCs as well as changing them into more spherical shape. The thickness of the intermetallic compounds in both finishes investigated was found to be higher in solders with smaller bump size. From the experimental results, it also appears that the growth rate of IMCs is higher when soldering on copper compared to ENEPIG finish. Besides that, the results also showed that the thickness of intermetallic compounds was found to be proportional to isothermal aging duration. (author)

  10. Process monitoring using a Quality and Technical Surveillance Program

    International Nuclear Information System (INIS)

    Rafferty, C.A.

    1995-01-01

    The purpose of process monitoring using a Quality and Technical Surveillance Program was to help ensure manufactured clad vents sets fully met technical and quality requirements established by the manufacturer and the customer, and that line and program management were immediately alerted if any aspect of the manufacturing activities drifted out of acceptable limits. The Quality and Technical Surveillance Program provided a planned, scheduled approach to monitor key processes and documentation illuminated potential problem areas early enough to permit timely corrective actions to reverse negative trends that, if left uncorrected, could have resulted in deficient hardware. Significant schedule and cost impacts were eliminated

  11. Structural health monitoring an advanced signal processing perspective

    CERN Document Server

    Chen, Xuefeng; Mukhopadhyay, Subhas

    2017-01-01

    This book highlights the latest advances and trends in advanced signal processing (such as wavelet theory, time-frequency analysis, empirical mode decomposition, compressive sensing and sparse representation, and stochastic resonance) for structural health monitoring (SHM). Its primary focus is on the utilization of advanced signal processing techniques to help monitor the health status of critical structures and machines encountered in our daily lives: wind turbines, gas turbines, machine tools, etc. As such, it offers a key reference guide for researchers, graduate students, and industry professionals who work in the field of SHM.

  12. FT-NIR: A Tool for Process Monitoring and More.

    Science.gov (United States)

    Martoccia, Domenico; Lutz, Holger; Cohen, Yvan; Jerphagnon, Thomas; Jenelten, Urban

    2018-03-30

    With ever-increasing pressure to optimize product quality, to reduce cost and to safely increase production output from existing assets, all combined with regular changes in terms of feedstock and operational targets, process monitoring with traditional instruments reaches its limits. One promising answer to these challenges is in-line, real time process analysis with spectroscopic instruments, and above all Fourier-Transform Near Infrared spectroscopy (FT-NIR). Its potential to afford decreased batch cycle times, higher yields, reduced rework and minimized batch variance is presented and application examples in the field of fine chemicals are given. We demonstrate that FT-NIR can be an efficient tool for improved process monitoring and optimization, effective process design and advanced process control.

  13. Utilization of Pb-free solders in MEMS packaging

    Science.gov (United States)

    Selvaduray, Guna S.

    2003-01-01

    Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

  14. Fatigue and thermal fatigue of Pb-Sn solder joints

    International Nuclear Information System (INIS)

    Frear, D.; Grivas, D.; McCormack, M.; Tribula, D.; Morris, J.W. Jr.

    1987-01-01

    This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55 0 C and 125 0 C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb

  15. Process control monitoring systems, industrial plants, and process control monitoring methods

    Science.gov (United States)

    Skorpik, James R [Kennewick, WA; Gosselin, Stephen R [Richland, WA; Harris, Joe C [Kennewick, WA

    2010-09-07

    A system comprises a valve; a plurality of RFID sensor assemblies coupled to the valve to monitor a plurality of parameters associated with the valve; a control tag configured to wirelessly communicate with the respective tags that are coupled to the valve, the control tag being further configured to communicate with an RF reader; and an RF reader configured to selectively communicate with the control tag, the reader including an RF receiver. Other systems and methods are also provided.

  16. Development of Spectrophotometric Process Monitors for Aqueous Reprocessing Facilities

    International Nuclear Information System (INIS)

    Smith, N.; Krebs, J.; Hebden, A.

    2015-01-01

    The safeguards envelope of an aqueous reprocessing plant can be extended beyond traditional measures to include surveillance of the process chemistry itself. By observing the concentration of accountable species in solution directly, a measure of real time accountancy can be applied. Of equal importance, select information on the process chemistry can be determined that will allow the operator and inspectors to verify that the process is operating as intended. One of the process monitors that can be incorporated is molecular spectroscopy, such as UV-Visible absorption spectroscopy. Argonne National Laboratory has developed a process monitoring system that can be tailored to meet the specific chemistry requirements of a variety of processes. The Argonne Spectroscopic Process monitoring system (ASP) is composed of commercial-off-the-shelf (COTS) spectroscopic hardware, custom manufactured sample handling components (to meet end user requirements) and the custom Plutonium and Uranium Measurement and Acquisition System (PUMAS) software. Two versions of the system have been deployed at the Savannah River Site's H-Canyon facility, tailored for high and low concentration streams. (author)

  17. Modern integrated environmental monitoring and processing systems for nuclear facilities

    International Nuclear Information System (INIS)

    Oprea, I.

    2000-01-01

    The continuous activity to survey and monitor releases and the current radiation levels in the vicinity of a nuclear object is essential for person and environment protection. Considering the vast amount of information and data needed to keep an updated overview of a situation both during the daily surveillance work and during accident situations, the need for an efficient monitoring and processing system is evident. The rapid development, both in computer technology and in telecommunications, the evolution of fast and accurate computer codes enabling the on-line calculations improve the quality of decision-making in complex situations and assure a high efficiency. The monitoring and processing systems are used both for environmental protection and for controlling nuclear power plant emergency and post-accident situations. Such a system can offer information to the radiation management systems in order to assess the consequences of nuclear accidents and to establish a basis for right decisions in civil defense. The integrated environmental monitoring systems have as main task to record, collect, process and transmit the radiation levels and weather data, incorporating a number of stationary or mobile radiation monitoring equipment, weather parameter measuring station, an information processing center and the communication network, all running under a real-time operating system.They provide the automatic data collection on-line and off-line, remote diagnostic, advanced presentation techniques, including a graphically oriented executive support, which has the ability to respond to an emergency by geographical representation of the hazard zones on the map. The systems are based on local intelligent measuring and transmission units, simultaneous processing and data presentation using a real-time operating system for personal computers and geographical information system (GIS). All information can be managed directly from the map by multilevel data retrieving and

  18. Condition Monitoring of a Process Filter Applying Wireless Vibration Analysis

    Directory of Open Access Journals (Sweden)

    Pekka KOSKELA

    2011-05-01

    Full Text Available This paper presents a novel wireless vibration-based method for monitoring the degree of feed filter clogging. In process industry, these filters are applied to prevent impurities entering the process. During operation, the filters gradually become clogged, decreasing the feed flow and, in the worst case, preventing it. The cleaning of the filter should therefore be carried out predictively in order to avoid equipment damage and unnecessary process downtime. The degree of clogging is estimated by first calculating the time domain indices from low frequency accelerometer samples and then taking the median of the processed values. Nine different statistical quantities are compared based on the estimation accuracy and criteria for operating in resource-constrained environments with particular focus on energy efficiency. The initial results show that the method is able to detect the degree of clogging, and the approach may be applicable to filter clogging monitoring.

  19. Facility Effluent Monitoring Plan for the 325 Radiochemical Processing Laboratory

    International Nuclear Information System (INIS)

    Shields, K.D.; Ballinger, M.Y.

    1999-03-01

    This Facility Effluent Monitoring Plan (FEMP) has been prepared for the 325 Building Radiochemical Processing Laboratory (RPL) at the Pacific Northwest National Laboratory (PNNL) to meet the requirements in DOE Order 5400.1, ''General Environmental Protection Programs.'' This FEMP has been prepared for the RPL primarily because it has a ''major'' (potential to emit >0.1 mrem/yr) emission point for radionuclide air emissions according to the annual National Emission Standards for Hazardous Air Pollutants (NESHAP) assessment performed. This section summarizes the airborne and liquid effluents and the inventory based NESHAP assessment for the facility. The complete monitoring plan includes characterization of effluent streams, monitoring/sampling design criteria, a description of the monitoring systems and sample analysis, and quality assurance requirements. The RPL at PNNL houses radiochemistry research, radioanalytical service, radiochemical process development, and hazardous and radioactive mixed waste treatment activities. The laboratories and specialized facilities enable work ranging from that with nonradioactive materials to work with picogram to kilogram quantities of fissionable materials and up to megacurie quantities of other radionuclides. The special facilities within the building include two shielded hot-cell areas that provide for process development or analytical chemistry work with highly radioactive materials and a waste treatment facility for processing hazardous, mixed radioactive, low-level radioactive, and transuranic wastes generated by PNNL activities

  20. Monitoring sodium in commercially processed foods from stores and restaurants

    Science.gov (United States)

    Most of the sodium we eat comes from commercially processed foods from stores and restaurants. Sodium reduction in these foods is a key component of several recent public health efforts. Agricultural Research Service (ARS) of USDA, CDC and FDA have launched a collaborative program to monitor sodium ...

  1. Acoustic monitoring of a fluidized bed coating process

    DEFF Research Database (Denmark)

    Naelapaa, Kaisa; Veski, Peep; Pedersen, Joan G.

    2007-01-01

      The aim of the study was to investigate the potential of acoustic monitoring of a production scale fluidized bed coating process. The correlation between sensor signals and the estimated amount of film applied and percentage release, respectively, were investigated in coating potassium chloride...

  2. Facility Effluent Monitoring Plan for the 325 Radiochemical Processing Laboratory

    Energy Technology Data Exchange (ETDEWEB)

    Shields, K.D.; Ballinger, M.Y.

    1999-04-02

    This Facility Effluent Monitoring Plan (FEMP) has been prepared for the 325 Building Radiochemical Processing Laboratory (RPL) at the Pacific Northwest National Laboratory (PNNL) to meet the requirements in DOE Order 5400.1, ''General Environmental Protection Programs.'' This FEMP has been prepared for the RPL primarily because it has a ''major'' (potential to emit >0.1 mrem/yr) emission point for radionuclide air emissions according to the annual National Emission Standards for Hazardous Air Pollutants (NESHAP) assessment performed. This section summarizes the airborne and liquid effluents and the inventory based NESHAP assessment for the facility. The complete monitoring plan includes characterization of effluent streams, monitoring/sampling design criteria, a description of the monitoring systems and sample analysis, and quality assurance requirements. The RPL at PNNL houses radiochemistry research, radioanalytical service, radiochemical process development, and hazardous and radioactive mixed waste treatment activities. The laboratories and specialized facilities enable work ranging from that with nonradioactive materials to work with picogram to kilogram quantities of fissionable materials and up to megacurie quantities of other radionuclides. The special facilities within the building include two shielded hot-cell areas that provide for process development or analytical chemistry work with highly radioactive materials and a waste treatment facility for processing hazardous, mixed radioactive, low-level radioactive, and transuranic wastes generated by PNNL activities.

  3. Waste monitoring of the uranium ore processing activities in Romania

    International Nuclear Information System (INIS)

    Nica, L.

    2002-01-01

    The uranium ore processing activities at the Feldioara site produce a range of liquid and solid waste that are monitored. Liquids are treated through decantation, pH correction and uranium precipitation before their release into the environment. The solid waste is gathered into ore specific area and are covered regularly with clay materials. (author)

  4. Memory-type control charts for monitoring the process dispersion

    NARCIS (Netherlands)

    Abbas, N.; Riaz, M.; Does, R.J.M.M.

    2014-01-01

    Control charts have been broadly used for monitoring the process mean and dispersion. Cumulative sum (CUSUM) and exponentially weighted moving average (EWMA) control charts are memory control charts as they utilize the past information in setting up the control structure. This makes CUSUM and

  5. Forest Service National Visitor Use Monitoring Process: Research Method Documentation

    Science.gov (United States)

    Donald B.K. English; Susan M. Kocis; Stanley J. Zarnoch; J. Ross Arnold

    2002-01-01

    In response to the need for improved information on recreational use of National Forest System lands, the authors have developed a nationwide, systematic monitoring process. This report documents the methods they used in estimating recreational use on an annual basis. The basic unit of measure is exiting volume of visitors from a recreation site on a given day. Sites...

  6. Assessment of potential solder candidates for high temperature applications

    DEFF Research Database (Denmark)

    pressure to eliminate lead containing materials despite the fact that materials for high Pb containing alloys are currently not affected by any legislations. A tentative assessment was carried out to determine the potential solder candidates for high temperature applications based on the solidification...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

  7. Manipulation and soldering of carbon nanotubes using atomic force microscope

    International Nuclear Information System (INIS)

    Kashiwase, Yuta; Ikeda, Takayuki; Oya, Takahide; Ogino, Toshio

    2008-01-01

    Manipulation of carbon nanotubes (CNTs) by an atomic force microscope (AFM) and soldering of CNTs using Fe oxide nanoparticles are described. We succeeded to separate a CNT bundle into two CNTs or CNT bundles, to move the separated CNT to a desirable position, and to bind it to another bundle. For the accurate manipulation, load of the AFM cantilever and frequency of the scan were carefully selected. We soldered two CNTs using an Fe oxide nanoparticle prepared from a ferritin molecule. The adhesion forces between the soldered CNTs were examined by an AFM and it was found that the CNTs were bound, though the binding force was not strong

  8. Generation and monitoring of a discrete stable random process

    CERN Document Server

    Hopcraft, K I; Matthews, J O

    2002-01-01

    A discrete stochastic process with stationary power law distribution is obtained from a death-multiple immigration population model. Emigrations from the population form a random series of events which are monitored by a counting process with finite-dynamic range and response time. It is shown that the power law behaviour of the population is manifested in the intermittent behaviour of the series of events. (letter to the editor)

  9. RESEARCH OF PROCESS OF FINANCIAL MONITORING ORGANIZING IN BANKS

    Directory of Open Access Journals (Sweden)

    Viktoriia Kovalenko

    2017-03-01

    Full Text Available The article aims to study methods and tools for financial monitoring by banks. It is proved that one of the main global financial problems in recent years is increasing number of cases of banks participating in the money laundering. It causes banks huge losses, undermines the credibility of honest depositors, in addition, circulation of funds like these hurts the national economy. The article is to develop recommendations to improve the effectiveness of financial monitoring in banks. It is proved that the current model of the national financial monitoring system includes the following elements: the purpose of macroeconomic and microeconomic levels; principles; function; facilities; subjects; types of financial monitoring; methods of implementation and regulatory prevue regulation. It is proved that the major problems related to the financial monitoring of banks are the following: lack of legislatively established quality requirements of customer information; persons engaged in legalization of illegal incomes are highly qualified, which greatly facilitates them through the bank of suspicious transactions; the process of settlement bank failure in the conduct of questionable transactions. Keywords: financial monitoring, suspicious transactions, bank, money laundering, financing of terrorism.

  10. Advances in statistical monitoring of complex multivariate processes with applications in industrial process control

    CERN Document Server

    Kruger, Uwe

    2012-01-01

    The development and application of multivariate statistical techniques in process monitoring has gained substantial interest over the past two decades in academia and industry alike.  Initially developed for monitoring and fault diagnosis in complex systems, such techniques have been refined and applied in various engineering areas, for example mechanical and manufacturing, chemical, electrical and electronic, and power engineering.  The recipe for the tremendous interest in multivariate statistical techniques lies in its simplicity and adaptability for developing monitoring applica

  11. Acoustic monitoring of rotating machine by advanced signal processing technology

    International Nuclear Information System (INIS)

    Kanemoto, Shigeru

    2010-01-01

    The acoustic data remotely measured by hand held type microphones are investigated for monitoring and diagnosing the rotational machine integrity in nuclear power plants. The plant operator's patrol monitoring is one of the important activities for condition monitoring. However, remotely measured sound has some difficulties to be considered for precise diagnosis or quantitative judgment of rotating machine anomaly, since the measurement sensitivity is different in each measurement, and also, the sensitivity deteriorates in comparison with an attached type sensor. Hence, in the present study, several advanced signal processing methods are examined and compared in order to find optimum anomaly monitoring technology from the viewpoints of both sensitivity and robustness of performance. The dimension of pre-processed signal feature patterns are reduced into two-dimensional space for the visualization by using the standard principal component analysis (PCA) or the kernel based PCA. Then, the normal state is classified by using probabilistic neural network (PNN) or support vector data description (SVDD). By using the mockup test facility of rotating machine, it is shown that the appropriate combination of the above algorithms gives sensitive and robust anomaly monitoring performance. (author)

  12. Effect of surface oxide on the melting behavior of lead-free solder nanowires and nanorods

    International Nuclear Information System (INIS)

    Gao Fan; Rajathurai, Karunaharan; Cui, Qingzhou; Zhou, Guangwen; NkengforAcha, Irene; Gu Zhiyong

    2012-01-01

    Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among various important parameters, melting is the most fundamental property affecting the assembly process. Here we report that the melting behavior of tin and tin/silver nanowires and nanorods can be significantly affected by the surface oxide of nanosolders. By controlling the nanosolder reflow atmosphere using a flux, the surface oxide of the nanowires/nanorods can be effectively removed and complete nanosolder melting can be achieved. The complete melting of the nanosolders leads to the formation of nanoscale to microscale spherical solder balls, followed by Ostwald ripening phenomenon. The contact angle of the microscale solder balls formed on Si substrate was measured by direct electron microscopic imaging. These results provide new insights into micro- and nanoscale phase transition and liquid droplet coalescence from nanowires/nanorods to spheroids, and are relevant to nanoscale assembly and smaller ball grid array formation.

  13. Recovery of Tin and Nitric Acid from Spent Solder Stripping Solutions

    International Nuclear Information System (INIS)

    Ahn, Jae-Woo; Ryu, Seong-Hyung; Kim, Tae-young

    2015-01-01

    Spent solder-stripping solutions containing tin, copper, iron, and lead in nitric acid solution, are by-products of the manufacture of printed-circuit boards. The recovery of these metals and the nitric acid, for re-use has economic and environmental benefits. In the spent solder-stripping solution, a systematic method to determine a suitable process for recovery of valuable metals and nitric acid was developed. Initially, more than 90% of the tin was successfully recovered as high-purity SnO 2 by thermal precipitation at 80 ℃ for 3 hours. About 94% of the nitric acid was regenerated effectively from the spent solutions by diffusion dialysis, after which there remained copper, iron, and lead in solution. Leakage of tin through the anion-exchange membrane was the lowest (0.026%), whereas Pb-leakage was highest (4.26%). The concentration of the regenerated nitric acid was about 5.1 N.

  14. Appendix to the report from the low-residue soldering task force: Phase 2 results

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J.; Huffman, D.D. [and others

    1995-12-01

    The LRSTF report for Phase I of its evaluation of low-residue soldering was issued in June 1995. This Appendix summarizes the results of follow-on testing performed in Phase II and compares electrical test results for both phases. Deliberate decisions were made by the LRSTF in Phase I to challenge the design guideline limits in MILSTD-275, Printed Wiring for Electronic Equipment The LRSTF considered this approach to produce a ``worst case`` design and provide useful information about the robustness of LR soldering processes. As such, good design practices were sometimes deliberately violated in designing the LRSTF board. This approach created some anomalies for both LR boards and RMA/cleaned controls. Phase II testing verified that problems that affected both RMA/cleaned and LR boards in Phase I were design related.

  15. Diode Lasers used in Plastic Welding and Selective Laser Soldering - Applications and Products

    Science.gov (United States)

    Reinl, S.

    Aside from conventional welding methods, laser welding of plastics has established itself as a proven bonding method. The component-conserving and clean process offers numerous advantages and enables welding of sensitive assemblies in automotive, electronic, medical, human care, food packaging and consumer electronics markets. Diode lasers are established since years within plastic welding applications. Also, soft soldering using laser radiation is becoming more and more significant in the field of direct diode laser applications. Fast power controllability combined with a contactless temperature measurement to minimize thermal damage make the diode laser an ideal tool for this application. These advantages come in to full effect when soldering of increasingly small parts in temperature sensitive environments is necessary.

  16. Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint.

    Science.gov (United States)

    Lee, Sang-Yeob; Lee, Jong-Hyuk

    2010-12-01

    The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

  17. System Health Monitoring Using a Novel Method: Security Unified Process

    Directory of Open Access Journals (Sweden)

    Alireza Shameli-Sendi

    2012-01-01

    and change management, and project management. The dynamic dimension, or phases, contains inception, analysis and design, construction, and monitoring. Risk assessment is a major part of the ISMS process. In SUP, we present a risk assessment model, which uses a fuzzy expert system to assess risks in organization. Since, the classification of assets is an important aspect of risk management and ensures that effective protection occurs, a Security Cube is proposed to identify organization assets as an asset classification model. The proposed model leads us to have an offline system health monitoring tool that is really a critical need in any organization.

  18. Multi-Isotope Process (MIP) Monitor: A Near-Real-Time Monitor For Reprocessing Facilities

    International Nuclear Information System (INIS)

    Schwantes, Jon M.; Douglas, Matthew; Orton, Christopher R.; Fraga, Carlos G.; Christensen, Richard

    2008-01-01

    The threat of protracted diversion of Pu from commercial reprocessing operations is perhaps the greatest concern to national and international agencies tasked with safeguarding these facilities. While it is generally understood that a method for direct monitoring of process on-line and in near-real time (NRT) would be the best defense against protracted diversion scenarios, an effective method with these qualities has yet to be developed. Here, we attempt to bridge this gap by proposing an on-line NRT process monitoring method that should be sensitive to minor alterations in process conditions and compatible with small, easily deployable, detection systems. This Approach is known as the Multi-Isotope Process (MIP) Monitor and involves the determination and recognition of the contaminant pattern within a process stream for a suite of indicator (radioactive) elements present in the spent fuel as a function of process variables. Utilization of a suite of radio-elements, including ones with multiple oxidation states, decreases the likelihood that attempts to divert Pu by altering the ReDox environment within the process would go undetected. In addition, by identifying gamma-emitting indicator isotopes, this Approach might eliminate the need for bulky neutron detection systems, relying instead on small, portable, high-resolution gamma detectors easily deployable throughout the facility

  19. Heterogeneous recurrence monitoring and control of nonlinear stochastic processes

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Hui, E-mail: huiyang@usf.edu; Chen, Yun [Complex Systems Monitoring, Modeling and Analysis Laboratory, University of South Florida, Tampa, Florida 33620 (United States)

    2014-03-15

    Recurrence is one of the most common phenomena in natural and engineering systems. Process monitoring of dynamic transitions in nonlinear and nonstationary systems is more concerned with aperiodic recurrences and recurrence variations. However, little has been done to investigate the heterogeneous recurrence variations and link with the objectives of process monitoring and anomaly detection. Notably, nonlinear recurrence methodologies are based on homogeneous recurrences, which treat all recurrence states in the same way as black dots, and non-recurrence is white in recurrence plots. Heterogeneous recurrences are more concerned about the variations of recurrence states in terms of state properties (e.g., values and relative locations) and the evolving dynamics (e.g., sequential state transitions). This paper presents a novel approach of heterogeneous recurrence analysis that utilizes a new fractal representation to delineate heterogeneous recurrence states in multiple scales, including the recurrences of both single states and multi-state sequences. Further, we developed a new set of heterogeneous recurrence quantifiers that are extracted from fractal representation in the transformed space. To that end, we integrated multivariate statistical control charts with heterogeneous recurrence analysis to simultaneously monitor two or more related quantifiers. Experimental results on nonlinear stochastic processes show that the proposed approach not only captures heterogeneous recurrence patterns in the fractal representation but also effectively monitors the changes in the dynamics of a complex system.

  20. Life cycle assessment (LCA of lead-free solders from the environmental protection aspect

    Directory of Open Access Journals (Sweden)

    Mitovski Aleksandra M.

    2009-01-01

    Full Text Available Life-cycle assessment (LCA presents a relatively new approach, which allows comprehensive environmental consequences analysis of a product system over its entire life. This analysis is increasingly being used in the industry, as a tool for investigation of the influence of the product system on the environment, and serves as a protection and prevention tool in ecological management. This method is used to predict possible influences of a certain material to the environment through different development stages of the material. In LCA, the product systems are evaluated on a functionally equivalent basis, which, in this case, was 1000 cubic centimeters of an alloy. Two of the LCA phases, life-cycle inventory (LCA and life-cycle impact assessment (LCIA, are needed to calculate the environmental impacts. Methodology of LCIA applied in this analysis aligns every input and output influence into 16 different categories, divided in two subcategories. The life-cycle assessment reaserch review of the leadfree solders Sn-Cu, SAC (Sn-Ag-Cu, BSA (Bi-Sb-Ag and SABC (Sn-Ag-Bi-Cu respectively, is given in this paper, from the environmental protection aspect starting from production, through application process and finally, reclamation at the end-of-life, i.e. recycling. There are several opportunities for reducing the overall environmental and human health impacts of solder used in electronics manufacturing based on the results of the LCA, such as: using secondary metals reclaimed through post-industrial recycling; power consumption reducing by replacing older, less efficient reflow assembly equipment, or by optimizing the current equipment to perform at the elevated temperatures required for lead-free soldering, etc. The LCA analysis was done comparatively in relation to widely used Sn-Pb solder material. Additionally, the impact factors of material consumption, energy use, water and air reserves, human health and ecotoxicity have been ALSO considered including

  1. Identification of process dynamics. Stability monitoring in BWR type reactors

    International Nuclear Information System (INIS)

    Abrahamsson, P.; Hallgren, P.

    1991-06-01

    Identification of process dynamics is used for stability monitoring in nuclear reactors (Boiling Water Reactor). This report treats the problem of estimating a damping factor and a resonance frequency from the neutron flux as measured in the reactor. A new parametric online method for identification is derived and presented, and is shown to meet the requirements of stability monitoring. The technique for estimating the process parameters is based on a recursive lattice filter algorithm. The problem of time varying parameters and offset, as well as offline experiments and signal processing are treated. All parts are implemented in a realtime program, using the language C. In comparison with earlier identifications, the new way of estimating the damping factor is shown to work well. Estimates of both the damping factor and the resonance frequency show a stable and reliable behavior. Future development and improvements are also indicated. (au)

  2. FY09 PROGRESS: MULTI-ISOTOPE PROCESS (MIP) MONITOR

    International Nuclear Information System (INIS)

    Schwantes, Jon M.; Orton, Christopher R.; Fraga, Carlos G.; Christensen, Richard; Laspe, Amy R.; Ward, Rebecca M.

    2009-01-01

    Model and experimental estimates of the Multi-Isotope Process Monitor performance for determining burnup after dissolution and acid concentration during solvent extraction steps during reprocessing of spent nuclear fuel are presented. Modern industrial reprocessing techniques, including the PUREX and UREX+ family of separations technologies, are based on solvent extraction between organic and aqueous phases. In these bi-phase systems, product (actinide) and contaminant (fission and activation products) elements are preferentially driven (thermodynamically) to opposite phases, with small amounts of each remaining in the other phase. The distribution of each element, between the organic and aqueous phases, is determined by major process variables such as acid concentration, organic ligand concentration, reduction potential, and temperature. Hence, for consistent performance of the separation process, the distribution of each element between the organic and aqueous phases should be relatively constant. During 'normal' operations the pattern of elements distributing into the product and waste streams at each segment of the facility should be reproducible, resulting in a statistically significant signature of the nominal process conditions. Under 'abnormal' conditions, such as those expected under some protracted diversion scenarios, patterns of elements within the various streams would be expected to change measurably. The MIP monitoring approach utilizes changes in the concentrations of gamma-emitting elements as evidence of changes to the process chemistry. It exploits a suite of gamma emitting isotopes to track multiple chemical species and behaviors simultaneously, thus encompassing a large array of elements that are affected by chemical and physical changes. In-process surveillance by the MIP monitor is accomplished by coupling the gamma spectrometry of the streams with multivariate techniques, such as Principal Component Analysis (PCA). PCA is a chemometrics tool

  3. Processing and monitoring liquid, radioactive effluents from the Wiederaufarbeitungsanlage Karlsruhe

    International Nuclear Information System (INIS)

    Hoehlein, G.; Huppert, K.L.; Winter, M.

    1977-01-01

    The Wiederaufarbeitungsanlage Karlsruhe (WAK) serves as a demonstration plant for the processing of highly-irradiated uranous oxide. The high active waste concentrates find interim storage at the WAK until they are solidified at a later stage. In contrast to this, the slightly- and the medium-active liquid wastes are transported to the decontamination facility of the Nuclear Research Centre Karlsruhe, where they are immediately processed. These liquid wastes contain about 1 per thousand of the activity inventary of the fuel elements processed. Monitoring of the radioactive waste water of the WAK is carried out by the Nuclear Research Centre's department radiation protection and safety. (orig.) [de

  4. System for monitoring an industrial or biological process

    Science.gov (United States)

    Gross, Kenneth C.; Wegerich, Stephan W.; Vilim, Rick B.; White, Andrew M.

    1998-01-01

    A method and apparatus for monitoring and responding to conditions of an industrial process. Industrial process signals, such as repetitive manufacturing, testing and operational machine signals, are generated by a system. Sensor signals characteristic of the process are generated over a time length and compared to reference signals over the time length. The industrial signals are adjusted over the time length relative to the reference signals, the phase shift of the industrial signals is optimized to the reference signals and the resulting signals output for analysis by systems such as SPRT.

  5. Signal and image processing for monitoring and testing at EDF

    International Nuclear Information System (INIS)

    Georgel, B.; Garreau, D.

    1992-04-01

    The quality of monitoring and non destructive testing devices in plants and utilities today greatly depends on the efficient processing of signal and image data. In this context, signal or image processing techniques, such as adaptive filtering or detection or 3D reconstruction, are required whenever manufacturing nonconformances or faulty operation have to be recognized and identified. This paper reviews the issues of industrial image and signal processing, by briefly considering the relevant studies and projects under way at EDF. (authors). 1 fig., 11 refs

  6. OpenLMD, multimodal monitoring and control of LMD processing

    Science.gov (United States)

    Rodríguez-Araújo, Jorge; García-Díaz, Antón

    2017-02-01

    This paper presents OpenLMD, a novel open-source solution for on-line multimodal monitoring of Laser Metal Deposition (LMD). The solution is also applicable to a wider range of laser-based applications that require on-line control (e.g. laser welding). OpenLMD is a middleware that enables the orchestration and virtualization of a LMD robot cell, using several open-source frameworks (e.g. ROS, OpenCV, PCL). The solution also allows reconfiguration by easy integration of multiple sensors and processing equipment. As a result, OpenLMD delivers significant advantages over existing monitoring and control approaches, such as improved scalability, and multimodal monitoring and data sharing capabilities.

  7. Studies and research concerning BNFP: process monitoring and process surveillance demonstration program

    Energy Technology Data Exchange (ETDEWEB)

    Kight, H R

    1979-11-01

    Computerized methods of monitoring process functions and alarming off-standard conditions were implemented and demonstrated during the FY 1979 Uranium Run. In addition, prototype applications of instruments for the purpose of tamper indication and surveillance were tested.

  8. Development of a soft-soldering system for aluminum

    Science.gov (United States)

    Falke, W. L.; Lee, A. Y.; Neumeier, L. A.

    1983-03-01

    The method employs application of a thin nickel copper alloy coating to the substrate, which enables the tin lead solders to wet readily and spread over the areas to be joined. The aluminum substrate is mechanically or chemically cleaned to facilitate bonding to a minute layer of zinc that is subsequently applied, with an electroless zincate solution. The nickel copper alloy (30 to 70 pct Ni) coating is then applied electrolytically over the zinc, using immersion cell or brush coating techniques. Development of acetate electrolytes has permitted deposition of the proper alloys coatings. The coated areas can then be readily joined with conventional tin lead solders and fluxs. The joints so formed are ductile, strong, and relatively corrosion resistant, and exhibit strengths equivalent to those formed on copper and brass when the same solders and fluxes are used. The method has also been employed to soft solder magnesium alloys.

  9. Development of gold based solder candidates for flip chip assembly

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

  10. Photoacoustic monitoring of inhomogeneous curing processes in polystyrene emulsions

    International Nuclear Information System (INIS)

    Vargas-Luna, M.; Gutierrez-Juarez, G.; Rodriguez-Vizcaino, J.M.; Varela-Nsjera, J.B.; Rodriguez-Palencia, J.M.; Bernal-Alvarado, J.; Sosa, M.; Alvarado-Gil, J.J.

    2002-01-01

    The time evolution of the inhomogeneous curing process of polystyrene emulsions is studied using a variant of the conventional photoacoustic (PA) technique. The thermal effusivity, as a function of time, is determined in order to monitor the sintering process of a styrene emulsion in different steps of the manufacturing procedure. PA measurements of thermal effusivity show a sigmoidal growth as a function of time during the curing process. The parameterization of these curves permits the determination of the characteristic curing time and velocity of the process. A decreasing of the curing time and an increasing curing velocity for the final steps of the manufacturing process are observed. The feasibility of our approach and its potentiality for the characterization of other curing process are discussed. (author)

  11. Monitoring in the nearshore: A process for making reasoned decisions

    Science.gov (United States)

    Bodkin, James L.; Dean, T.A.

    2003-01-01

    Over the past several years, a conceptual framework for the GEM nearshore monitoring program has been developed through a series of workshops. However, details of the proposed monitoring program, e.g. what to sample, where to sample, when to sample and at how many sites, have yet to be determined. In FY 03 we were funded under Project 03687 to outline a process whereby specific alternatives to monitoring are developed and presented to the EVOS Trustee Council for consideration. As part of this process, two key elements are required before reasoned decisions can be made. These are: 1) a comprehensive historical perspective of locations and types of past studies conducted in the nearshore marine communities within Gulf of Alaska, and 2) estimates of costs for each element of a proposed monitoring program. We have developed a GIS database that details available information from past studies of selected nearshore habitats and species in the Gulf of Alaska and provide a visual means of selecting sites based (in part) on the locations for which historical data of interest are available. We also provide cost estimates for specific monitoring plan alternatives and outline several alternative plans that can be accomplished within reasonable budgetary constraints. The products that we will provide are: 1) A GIS database and maps showing the location and types of information available from the nearshore in the Gulf of Alaska; 2) A list of several specific monitoring alternatives that can be conducted within reasonable budgetary constraints; and 3) Cost estimates for proposed tasks to be conducted as part of the nearshore program. Because data compilation and management will not be completed until late in FY03 we are requesting support for close-out of this project in FY 04.

  12. Real-time monitoring of clinical processes using complex event processing and transition systems.

    Science.gov (United States)

    Meinecke, Sebastian

    2014-01-01

    Dependencies between tasks in clinical processes are often complex and error-prone. Our aim is to describe a new approach for the automatic derivation of clinical events identified via the behaviour of IT systems using Complex Event Processing. Furthermore we map these events on transition systems to monitor crucial clinical processes in real-time for preventing and detecting erroneous situations.

  13. Process monitoring for intelligent manufacturing processes - Methodology and application to Robot Assisted Polishing

    DEFF Research Database (Denmark)

    Pilny, Lukas

    Process monitoring provides important information on the product, process and manufacturing system during part manufacturing. Such information can be used for process optimization and detection of undesired processing conditions to initiate timely actions for avoidance of defects, thereby improving...... quality assurance. This thesis is aimed at a systematic development of process monitoring solutions, constituting a key element of intelligent manufacturing systems towards zero defect manufacturing. A methodological approach of general applicability is presented in this concern.The approach consists...... of six consecutive steps for identification of product Vital Quality Characteristics (VQCs) and Key Process Variables (KPVs), selection and characterization of sensors, optimization of sensors placement, validation of the monitoring solutions, definition of the reference manufacturing performance...

  14. Quantitative monitoring of the fluorination process by neutron counting

    International Nuclear Information System (INIS)

    Russo, P.A.; Appert, Q.D.; Biddle, R.S.; Kelley, T.A.; Martinez, M.M.; West, M.H.

    1993-01-01

    Plutonium metal is produced by reducing PuF 4 prepared from PuO 2 by fluorination. Both fluorination and reduction are batch processes at the Los Alamos Plutonium Facility. The conversion of plutonium oxide to fluoride greatly increases the neutron yield, a result of the high cross section for alpha-neutron (α,n) reactions on fluorine targets compared to the (more than 100 times) smaller α,n yield on oxygen targets. Because of the increase, total neutron counting can be used to monitor the conversion process. This monitoring ability can lead to an improved metal product, reduced scrap for recycle, waste reduction, minimized reagent usage, and reduce personnel radiation exposures. A new stirred-bed fluorination process has been developed simultaneously with a recent evaluation of an automated neutron-counting instrument for quantitative process monitoring. Neutrons are counted with polyethylene-moderated 3 He-gas proportional counters. Results include a calibration of the real-time neutron-count-rate indicator for the extent of fluorination using reference values obtained from destructive analysis of samples from the blended fluoroinated batch

  15. Sodium monitoring in commercially processed and restaurant foods.

    Science.gov (United States)

    Ahuja, Jaspreet K C; Pehrsson, Pamela R; Haytowitz, David B; Wasswa-Kintu, Shirley; Nickle, Melissa; Showell, Bethany; Thomas, Robin; Roseland, Janet; Williams, Juhi; Khan, Mona; Nguyen, Quynhanh; Hoy, Kathy; Martin, Carrie; Rhodes, Donna; Moshfegh, Alanna; Gillespie, Cathleen; Gunn, Janelle; Merritt, Robert; Cogswell, Mary

    2015-03-01

    Most sodium in the US diet comes from commercially processed and restaurant foods. Sodium reduction in these foods is key to several recent public health efforts. The objective was to provide an overview of a program led by the USDA, in partnership with other government agencies, to monitor sodium contents in commercially processed and restaurant foods in the United States. We also present comparisons of nutrients generated under the program to older data. We track ∼125 commercially processed and restaurant food items ("sentinel foods") annually using information from food manufacturers and periodically by nationwide sampling and laboratory analyses. In addition, we monitor >1100 other commercially processed and restaurant food items, termed "priority-2 foods" (P2Fs) biennially by using information from food manufacturers. These foods serve as indicators for assessing changes in the sodium content of commercially processed and restaurant foods in the United States. We sampled all sentinel foods nationwide and reviewed all P2Fs in 2010-2013 to determine baseline sodium concentrations. We updated sodium values for 73 sentinel foods and 551 P2Fs in the USDA's National Nutrient Database for Standard Reference (releases 23-26). Sodium values changed by at least 10% for 43 of the sentinel foods, which, for 31 foods, including commonly consumed foods such as bread, tomato catsup, and potato chips, the newer sodium values were lower. Changes in the concentrations of related nutrients (total and saturated fat, total sugar, potassium, or dietary fiber) that were recommended by the 2010 Dietary Guidelines for Americans for reduced or increased consumption accompanied sodium reduction. The results of sodium reduction efforts, based on resampling of the sentinel foods or re-review of P2Fs, will become available beginning in 2015. This monitoring program tracks sodium reduction efforts, improves food composition databases, and strengthens national nutrition monitoring. © 2015

  16. Strength of joints brazed with two-phase solders

    International Nuclear Information System (INIS)

    Shnyakin, N.S.; Parfenova, L.V.; Ekatova, A.S.; Prilepskaya, I.V.

    1976-01-01

    Dependence of the structure and strength of soldered joints upon a gap size in case of 1Kh18N10T stainless steel soldering with a double-phase solder of Ni-Zn-Cu system is described. Butt and lap joints have been subjected to soldering with gas-flame and induction heating. The optimum conditions of the solder crystallization are determined with wedge-gap samples. The studies show that the character of distribution of a fusible β-phase in metal depends upon a gap size. With gaps up to 0.1 mm the β-phase enriched with a fusible component (zinc) runs as a continuous thin interlayer in the middle of the seam. As a result of zinc evaporation from the β-phase this interlayer becomes internally oxidized. After the sample is broken an oxidized fracture gives one the impression of a poor fusion in the middle part of the joint. The ultimate strength of butt joints is 15-20 kgf/sq.mm. A value of thermal expansion of 1Kh18N10T steel samples, 1-5 mm thick, has been experimentally determined for butt soldering. The elongation of two halves of the sample is measured by an indicator and proved to be 0.89 mm for a 50x50x2 mm sample at a soldering temperature of 1.100 deg C. The paper presents methods for the calculation of an optimal gap value for butt soldering with a local gas-flame and induction heating

  17. Method and apparatus for monitoring plasma processing operations

    Science.gov (United States)

    Smith, Jr., Michael Lane; Ward, Pamela Denise Peardon; Stevenson, Joel O'Don

    2002-01-01

    The invention generally relates to various aspects of a plasma process, and more specifically the monitoring of such plasma processes. One aspect relates in at least some manner to calibrating or initializing a plasma monitoring assembly. This type of calibration may be used to address wavelength shifts, intensity shifts, or both associated with optical emissions data obtained on a plasma process. A calibration light may be directed at a window through which optical emissions data is being obtained to determine the effect, if any, that the inner surface of the window is having on the optical emissions data being obtained therethrough, the operation of the optical emissions data gathering device, or both. Another aspect relates in at least some manner to various types of evaluations which may be undertaken of a plasma process which was run, and more typically one which is currently being run, within the processing chamber. Plasma health evaluations and process identification through optical emissions analysis are included in this aspect. Yet another aspect associated with the present invention relates in at least some manner to the endpoint of a plasma process (e.g., plasma recipe, plasma clean, conditioning wafer operation) or discrete/discernible portion thereof (e.g., a plasma step of a multiple step plasma recipe). Another aspect associated with the present invention relates to how one or more of the above-noted aspects may be implemented into a semiconductor fabrication facility, such as the distribution of wafers to a wafer production system. A final aspect of the present invention relates to a network a plurality of plasma monitoring systems, including with remote capabilities (i.e., outside of the clean room).

  18. Laser Soldering of Rat Skin Using a Controlled Feedback System

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2009-03-01

    Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

  19. Tensile strength of two soldered alloys (Minalux and Verabond2

    Directory of Open Access Journals (Sweden)

    Mir Mohammad Rezaee S

    2002-07-01

    Full Text Available Recently. Minalux alloy, a base metal free from Be, has been presented on the market while no special soldering has been recommended for it. On the other hand, based on the manufacturer's claim, this alloy is similar to Verabond2. The aim of this study was to investigate the tensile strength of Minalux and Verabond2, soldered by Verasolder. Twelve standard dambble shape samples, with the length of 18 mm and the diameter of 3mm, were prepared from each alloy. Six samples of each alloy were divided into two pieces with carboradom disk. Soldering gap distance was 0.3mm, measured by a special jig and they were soldered by Verasolder alloy. Six other samples, of both Iranian and foreign unsoldered alloys were considered as control group. Then samples were examined under tensile force and their tensile strength was recorded. Two- way variance analysis showed that the tensile strength of Minalux alloy and Verabond2 were not statistically significant (Verasoler 686, Minalux 723, but after soldering, such difference became significant (Minalux 308, Verabond2 432. Verabond2 showed higher tensile strength after soldering.

  20. Investigation of Sn-Pb solder bumps of prototype photo detectors for the LHCb experiment

    CERN Document Server

    Delsante, M L; Arnau-Izquierdo, G

    2004-01-01

    The Large Hadron Collider (LHC) is now under construction at the European Organization for Nuclear Research (CERN). LHCb is one of the dedicated LHC experiments, allowing high energy proton-proton collisions to be exploited. This paper presents the results of the metallurgic studies carried out on Sn-Pb solder bumps of prototype vacuum photo detectors under development for LHCb, and in particular for the ring imaging Cherenkov-hybrid photo diode (RICH-HPD) project. These detectors encapsulate, in a vacuum tube, an assembly made of two silicon chips bonded together by a matrix of solder bumps. Each bump lies on a suitable system of under-bump metallic layers ensuring mechanical and electrical transition between the chip pad and the solder alloy. During manufacturing of the detector, bump-bonded (BB) assemblies are exposed to severe heat cycles up to 400 degree C inducing, in the present fabrication process, a clear degradation of electrical connectivity. Several investigations such as microstructural observati...

  1. Multi-layer SiC ceramics/Mo joints brazed using high-temperature solders

    International Nuclear Information System (INIS)

    Olesinska, W.; Kesik, J.

    2003-01-01

    The paper presents the results of studies on joining SiC ceramics with molybdenum, with the ceramic surface being activated by titanium, chromium or copper. Titanium or chromium were deposited by the sputtering technique, and copper - by the electro-chemical method. The microstructures of the SiC/Mo joints brazed with the CuMn13Ni3 solder and copper in a nitrogen atmosphere were examined and the results discussed. The joints, in which the ceramic surface was activated in addition with chromium, do not contain mechanical defects caused by the joining process, and the ceramic surface is covered with a continuous layer of the solder. A phase analysis of the interface surface identified an MeSiC phase. The mechanical strength of the joints in which the ceramic surface was modified by the Ti, Cr and Cu layers was markedly greater than that of the joints brazed directly to the uncoated ceramics with the use of active solders. (author)

  2. Process monitoring using a quality and technical surveillance program

    International Nuclear Information System (INIS)

    Rafferty, C.A.

    1995-01-01

    The purpose of process monitoring using a quality and technical surveillance program was to help ensure that manufactured clad went sets fully met technical and quality requirements established by the manufacturer and the customer and that line and program management were immediately alerted if any aspect of the manufacturing activities drifted out of acceptable limits. The quality and technical surveillance program provided a planned, scheduled approach to monitor key processes and documentation and certification systems to prevent noncompliances or any manufacturing discrepancies. These surveillances illuminated potential problem areas early enough to permit timely corrective actions to reverse negative trends that, if left uncorrected, could have resulted in deficient hardware. Significant schedule and cost impacts were eliminated. copyright 1995 American Institute of Physics

  3. Monitoring tablet surface roughness during the film coating process

    DEFF Research Database (Denmark)

    Seitavuopio, Paulus; Heinämäki, Jyrki; Rantanen, Jukka

    2006-01-01

    The purpose of this study was to evaluate the change of surface roughness and the development of the film during the film coating process using laser profilometer roughness measurements, SEM imaging, and energy dispersive X-ray (EDX) analysis. Surface roughness and texture changes developing during...... the process of film coating tablets were studied by noncontact laser profilometry and scanning electron microscopy (SEM). An EDX analysis was used to monitor the magnesium stearate and titanium dioxide of the tablets. The tablet cores were film coated with aqueous hydroxypropyl methylcellulose, and the film...... coating was performed using an instrumented pilot-scale side-vented drum coater. The SEM images of the film-coated tablets showed that within the first 30 minutes, the surface of the tablet cores was completely covered with a thin film. The magnesium signal that was monitored by SEM-EDX disappeared after...

  4. Neural network training by Kalman filtering in process system monitoring

    International Nuclear Information System (INIS)

    Ciftcioglu, Oe.

    1996-03-01

    Kalman filtering approach for neural network training is described. Its extended form is used as an adaptive filter in a nonlinear environment of the form a feedforward neural network. Kalman filtering approach generally provides fast training as well as avoiding excessive learning which results in enhanced generalization capability. The network is used in a process monitoring application where the inputs are measurement signals. Since the measurement errors are also modelled in Kalman filter the approach yields accurate training with the implication of accurate neural network model representing the input and output relationships in the application. As the process of concern is a dynamic system, the input source of information to neural network is time dependent so that the training algorithm presents an adaptive form for real-time operation for the monitoring task. (orig.)

  5. Signal processing methods for in-situ creep specimen monitoring

    Science.gov (United States)

    Guers, Manton J.; Tittmann, Bernhard R.

    2018-04-01

    Previous work investigated using guided waves for monitoring creep deformation during accelerated life testing. The basic objective was to relate observed changes in the time-of-flight to changes in the environmental temperature and specimen gage length. The work presented in this paper investigated several signal processing strategies for possible application in the in-situ monitoring system. Signal processing methods for both group velocity (wave-packet envelope) and phase velocity (peak tracking) time-of-flight were considered. Although the Analytic Envelope found via the Hilbert transform is commonly applied for group velocity measurements, erratic behavior in the indicated time-of-flight was observed when this technique was applied to the in-situ data. The peak tracking strategies tested had generally linear trends, and tracking local minima in the raw waveform ultimately showed the most consistent results.

  6. Features of Pd-Ni-Fe solder system for vacuum brazing of low alloy steels

    International Nuclear Information System (INIS)

    Radzievskij, V.N.; Kurochko, R.S.; Lotsmanov, S.N.; Rymar', V.I.

    1975-01-01

    The brazing solder of the Pd-Ni-Fe alloyed with copper and lithium, in order to decrease the melting point and provide for a better spreading, when soldered in vacuum ensures a uniform strength of soldered joints with the base metal of low-alloyed steels of 34KHNIM-type. The properties of low-alloyed steel joints brazed with the Pd-Ni-Fe-system solder little depend on the changes in the soldering parameters. The soldered joint keeps a homogeneous structure after all the stages of heat treatment (annealing, quenching and tempering)

  7. System and process for pulsed multiple reaction monitoring

    Science.gov (United States)

    Belov, Mikhail E

    2013-05-17

    A new pulsed multiple reaction monitoring process and system are disclosed that uses a pulsed ion injection mode for use in conjunction with triple-quadrupole instruments. The pulsed injection mode approach reduces background ion noise at the detector, increases amplitude of the ion signal, and includes a unity duty cycle that provides a significant sensitivity increase for reliable quantitation of proteins/peptides present at attomole levels in highly complex biological mixtures.

  8. Real-Time Monitoring of Psychotherapeutic Processes: Concept and Compliance

    Directory of Open Access Journals (Sweden)

    Guenter Karl Schiepek

    2016-05-01

    Full Text Available AbstractObjective. The feasibility of a high-frequency real-time monitoring approach to psychotherapy is outlined and tested for patients’ compliance to evaluate its integration to everyday practice. Criteria concern the ecological momentary assessment, the assessment of therapy-related cognitions and emotions, equidistant time sampling, real-time nonlinear time series analysis, continuous participative process control by client and therapist, and the application of idiographic (person-specific surveys. Methods. The process-outcome monitoring is technically realized by an internet-based device for data collection and data analysis, the Synergetic Navigation System. Its feasibility is documented by a compliance study on 151 clients treated in an inpatient and a day-treatment clinic. Results. We found high compliance rates (mean: 78.3%, median: 89.4% amongst the respondents, independent of the severity of symptoms or the degree of impairment. Compared to other diagnoses, the compliance rate was lower in the group diagnosed with personality disorders. Conclusion. The results support the feasibility of high-frequency monitoring in routine psychotherapy settings. Daily collection of psychological surveys allows for assessment of highly resolved, equidistant time series data which gives insight into the nonlinear qualities of therapeutic change processes (e.g., pattern transitions, critical instabilities.

  9. Real-Time Monitoring of Psychotherapeutic Processes: Concept and Compliance

    Science.gov (United States)

    Schiepek, Günter; Aichhorn, Wolfgang; Gruber, Martin; Strunk, Guido; Bachler, Egon; Aas, Benjamin

    2016-01-01

    Objective: The feasibility of a high-frequency real-time monitoring approach to psychotherapy is outlined and tested for patients' compliance to evaluate its integration to everyday practice. Criteria concern the ecological momentary assessment, the assessment of therapy-related cognitions and emotions, equidistant time sampling, real-time nonlinear time series analysis, continuous participative process control by client and therapist, and the application of idiographic (person-specific) surveys. Methods: The process-outcome monitoring is technically realized by an internet-based device for data collection and data analysis, the Synergetic Navigation System. Its feasibility is documented by a compliance study on 151 clients treated in an inpatient and a day-treatment clinic. Results: We found high compliance rates (mean: 78.3%, median: 89.4%) amongst the respondents, independent of the severity of symptoms or the degree of impairment. Compared to other diagnoses, the compliance rate was lower in the group diagnosed with personality disorders. Conclusion: The results support the feasibility of high-frequency monitoring in routine psychotherapy settings. Daily collection of psychological surveys allows for the assessment of highly resolved, equidistant time series data which gives insight into the nonlinear qualities of therapeutic change processes (e.g., pattern transitions, critical instabilities). PMID:27199837

  10. An evaluation of the spring finger solder joints on SA1358-10 and SA2052-4 connector assemblies (MC3617,W87)

    International Nuclear Information System (INIS)

    Kilgo, Alice C.; Vianco, Paul Thomas; Hlava, Paul Frank; Zender, Gary L.

    2006-01-01

    The SA1358-10 and SA2052-4 circular JT Type plug connectors are used on a number of nuclear weapons and Joint Test Assembly (JTA) systems. Prototype units were evaluated for the following specific defects associated with the 95Sn-5Sb (Sn-Sb, wt.%) solder joint used to attach the beryllium-copper (BeCu) spring fingers to the aluminum (Al) connector shell: (1) extended cracking within the fillet; (2) remelting of the solder joint during the follow-on, soldering step that attached the EMR adapter ring to the connector shell (and/or soldering the EMR shell to the adapter ring) that used the lower melting temperature 63Sn-37Pb (Sn-Pb) alloy; and (3) spalling of the Cd (Cr) layer overplating layer from the fillet surface. Several pedigrees of connectors were evaluated, which represented older fielded units as well as those assemblies that were recently constructed at Kansas City Plant. The solder joints were evaluated that were in place on connectors made with the current soldering process as well as an alternative induction soldering process for attaching the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely reflected the different extents to which the connector was mated to its counterpart assembly. In all cases, the spring finger solder joints on the SA1358-10 connectors were remelted as a result of the subsequent EMR adapter ring attachment process. Spalling of the Cd (Cr) overplating layer was also observed for these connectors, which was a consequence of the remelting activity. On the other hand, the SA2052-4 connector did not exhibit evidence of

  11. Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

    Directory of Open Access Journals (Sweden)

    Roman Koleňák

    2018-04-01

    Full Text Available The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In, in which the phases of titanium (Ti3In4 and silver (AgIn2 are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg6In5 and (AgCuIn2. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

  12. Mechanistic Fermentation Models for Process Design, Monitoring, and Control

    DEFF Research Database (Denmark)

    Mears, Lisa; Stocks, Stuart M.; Albæk, Mads Orla

    2017-01-01

    Mechanistic models require a significant investment of time and resources, but their application to multiple stages of fermentation process development and operation can make this investment highly valuable. This Opinion article discusses how an established fermentation model may be adapted...... for application to different stages of fermentation process development: planning, process design, monitoring, and control. Although a longer development time is required for such modeling methods in comparison to purely data-based model techniques, the wide range of applications makes them a highly valuable tool...... for fermentation research and development. In addition, in a research environment, where collaboration is important, developing mechanistic models provides a platform for knowledge sharing and consolidation of existing process understanding....

  13. Interfacial Microstructure and Shear Strength of Brazed Cu-Cr-Zr Alloy Cylinder and Cylindrical Hole by Au Based Solder

    Directory of Open Access Journals (Sweden)

    Zaihua Li

    2017-07-01

    Full Text Available Au-Ge-Ni solder was chosen for brazing of the Cu-Cr-Zr alloy cylinder and a part with a cylindrical hole (sleeve below 550 °C. The Au based solder was first sintered on the surface of the cylinder and then brazed to the inner surface of the sleeve. The effects of the heating process, the temperature and the holding time at the temperature on the microstructure of the sintered layer on the surface of the cylinder, the brazed interfacial microstructure, and the brazed shear strength between the cylinder and the sleeve were investigated by scanning electron microscope, energy dispersive X-ray spectroscopy analysis, and tensile shear tests. By approach of side solder melt feeding and brazing under proper parameters, the voids and micro cracks due to a lack of enough solder melt feeding are greatly lessened and the brazed shear strength of 100 MPa is ensured even with large clearances around 0.01 mm.

  14. Monitoring the Diagnostic Process on an Inpatient Neurology Service.

    Science.gov (United States)

    Dhand, Amar; Bucelli, Robert; Varadhachary, Arun; Tsiaklides, Michael; de Bruin, Gabriela; Dhaliwal, Gurpreet

    2017-07-01

    The Institute of Medicine report Improving Diagnosis in Health Care called for tools to monitor physicians' diagnostic process. We addressed this need by developing a tool for clinicians to record and analyze their diagnostic process. The tool was a secure web application in which clinicians used a structured grading system to assess the relative impact of clinical, laboratory, and neuroimaging data for every new diagnosis. Four neurohospitalists used the tool for 6.5 months on a general neurology ward service at a single tertiary-level teaching hospital. Process measures of tool use included number of diagnoses entered, time spent on each data entry, and concordance of diagnoses compared to the medical record. We also aggregated the data across clinicians to examine the average process scores across common inpatient disorders. The 4 clinicians entered 254 new diagnoses that took approximately 3 minutes per patient. In 50 randomly chosen cases, the neurohospitalists' diagnoses entered into the tool agreed with 92% of diagnoses in the medical record, which was better than the agreement between billing code and medical record diagnoses (74%). The diagnostic process varied across disease categories, showing a spectrum of clinical-dominant (eg, headache), laboratory-dominant (eg, encephalitis), and neuroimaging-dominant (eg, stroke) disorders. This study demonstrated the feasibility of a clinician-driven diagnostic process monitoring system, along with preliminary characterization of the process for common disorders. The tracking of diagnostic process has the potential to promote reflection on clinical practice, deconstruct neurologists' clinical decision-making, and improve health-care safety.

  15. Expert system and process optimization techniques for real-time monitoring and control of plasma processes

    Science.gov (United States)

    Cheng, Jie; Qian, Zhaogang; Irani, Keki B.; Etemad, Hossein; Elta, Michael E.

    1991-03-01

    To meet the ever-increasing demand of the rapidly-growing semiconductor manufacturing industry it is critical to have a comprehensive methodology integrating techniques for process optimization real-time monitoring and adaptive process control. To this end we have accomplished an integrated knowledge-based approach combining latest expert system technology machine learning method and traditional statistical process control (SPC) techniques. This knowledge-based approach is advantageous in that it makes it possible for the task of process optimization and adaptive control to be performed consistently and predictably. Furthermore this approach can be used to construct high-level and qualitative description of processes and thus make the process behavior easy to monitor predict and control. Two software packages RIST (Rule Induction and Statistical Testing) and KARSM (Knowledge Acquisition from Response Surface Methodology) have been developed and incorporated with two commercially available packages G2 (real-time expert system) and ULTRAMAX (a tool for sequential process optimization).

  16. A systematic framework for design of process monitoring and control (PAT) systems for crystallization processes

    DEFF Research Database (Denmark)

    Abdul Samad, Noor Asma Fazli Bin; Sin, Gürkan; Gernaey, Krist

    2013-01-01

    A generic computer-aided framework for systematic design of a process monitoring and control system for crystallization processes has been developed to study various aspects of crystallization operations.The systematic design framework contains a generic crystallizer modelling toolbox, a tool for...

  17. SCALABLE TIME SERIES CHANGE DETECTION FOR BIOMASS MONITORING USING GAUSSIAN PROCESS

    Data.gov (United States)

    National Aeronautics and Space Administration — SCALABLE TIME SERIES CHANGE DETECTION FOR BIOMASS MONITORING USING GAUSSIAN PROCESS VARUN CHANDOLA AND RANGA RAJU VATSAVAI Abstract. Biomass monitoring,...

  18. Amalgamation of Anomaly-Detection Indices for Enhanced Process Monitoring

    KAUST Repository

    Harrou, Fouzi

    2016-01-29

    Accurate and effective anomaly detection and diagnosis of modern industrial systems are crucial for ensuring reliability and safety and for maintaining desired product quality. Anomaly detection based on principal component analysis (PCA) has been studied intensively and largely applied to multivariate processes with highly cross-correlated process variables; howver conventional PCA-based methods often fail to detect small or moderate anomalies. In this paper, the proposed approach integrates two popular process-monitoring detection tools, the conventional PCA-based monitoring indices Hotelling’s T2 and Q and the exponentially weighted moving average (EWMA). We develop two EWMA tools based on the Q and T2 statistics, T2-EWMA and Q-EWMA, to detect anomalies in the process mean. The performances of the proposed methods were compared with that of conventional PCA-based anomaly-detection methods by applying each method to two examples: a synthetic data set and experimental data collected from a flow heating system. The results clearly show the benefits and effectiveness of the proposed methods over conventional PCA-based methods.

  19. Improvements in data processing from a doorway monitor

    International Nuclear Information System (INIS)

    Dumesnil, P.; Greco, J.L.

    1985-05-01

    New processing techniques for the data coming from a doorway monitor have been studied. The principles taken into account are as follows: 1) use of a first order recursive filter, 2) integration of the signal with respect to time, 3) parabolic smoothing, 4) use of statistical tests. These methods are tested by means of a SIRIUS I (VICTOR SI) computer in order to select the best one for a given use. The numeric values used for these calculations are synthetized by the same computer. This procedure allows to avoid the drawbacks inherent to the use of a nuclear radiation detector: changes in the mean background value, innaccuracy of the reproductivity of the measuring geometry, variations in analogic electronic circuits. All these methods allow to increase the efficiency of a doorway monitor with reference to that obtained by the usual method of alarm threshold. The recursive filter method which can be optimized in terms of crossing speed seems to be the most promising [fr

  20. ICPP [Idaho Chemical Processing Plant] environmental monitoring report, CY-1988

    International Nuclear Information System (INIS)

    Krivanek, K.R.

    1989-08-01

    Summarized in this report are the data collected through Environmental Monitoring programs conducted at the Idaho Chemical Processing Plant (ICPP) by the Environmental Engineering (EE) Section of the Nuclear and Industrial Safety (N and IS) Department. The ICPP is responsible for complying with all applicable Federal, State, Local and DOE Rules, Regulations and Orders. Radiological effluent and emissions are regulated by the DOE. The Environmental Protection Agency (EPA) regulates all nonradiological waste resulting from the ICPP operations including all airborne, liquid, and solid waste. The EE subsection completed a Quality Assurance (QA) Plan for Environmental Monitoring activities during the third quarter of 1986. QA activities have resulted in the ICPP's implementation of the Environmental Protection Agency rules and guidelines pertaining to the collection, analyses, and reporting of environmentally related samples. Where no approved methods for analyses existed for radionuclides, currently used methods were submitted for the EPA approval. 33 figs., 14 tabs

  1. Monitoring non-thermal plasma processes for nanoparticle synthesis

    Science.gov (United States)

    Mangolini, Lorenzo

    2017-09-01

    Process characterization tools have played a crucial role in the investigation of dusty plasmas. The presence of dust in certain non-thermal plasma processes was first detected by laser light scattering measurements. Techniques like laser induced particle explosive evaporation and ion mass spectrometry have provided the experimental evidence necessary for the development of the theory of particle nucleation in silane-containing non-thermal plasmas. This review provides first a summary of these early efforts, and then discusses recent investigations using in situ characterization techniques to understand the interaction between nanoparticles and plasmas. The advancement of such monitoring techniques is necessary to fully develop the potential of non-thermal plasmas as unique materials synthesis and processing platforms. At the same time, the strong coupling between materials and plasma properties suggest that it is also necessary to advance techniques for the measurement of plasma properties while in presence of dust. Recent progress in this area will be discussed.

  2. Monitoring of anaerobic digestion processes: A review perspective

    DEFF Research Database (Denmark)

    Madsen, Michael; Holm-Nielsen, Jens Bo; Esbensen, Kim

    2011-01-01

    to a new level of reliability and effectiveness. It is shown, how proper involvement of process sampling understanding, Theory of Sampling (TOS), constitutes a critical success factor. We survey the more recent trends within the field of AD monitoring and the powerful PAT/TOS/chemometrics application...... processes, sanitation of industrial organic waste, and benefits from degassing of manure are a few of the most important applications. Especially, renewable energy production, integrated biorefining concepts, and advanced waste handling are delineated as the major market players for AD that likely...... will expand rapidly in the near future. The complex, biologically mediated AD events are far from being understood in detail however. Despite decade-long serious academic and industrial research efforts, only a few general rules have been formulated with respect to assessing the state of the process from...

  3. Monitoring of drilling process with the application of acoustic signal

    Directory of Open Access Journals (Sweden)

    Labaš Milan

    2000-09-01

    Full Text Available Monitoring of rock disintegration process at drilling, scanning of input quantities: thrust F, revolution n and the course of some output quantities: the drilling rate v and the power input P are needed for the control of this process. We can calculate the specific volume work of rock disintegration w and ϕ - quotient of drilling rate v and the specific volume work of disintegration w from the presented quantities.Works on an expertimental stand showed that the correlation relationships between the input and output quantities can be found by scanning the accompanying sound of the drilling proces.Research of the rock disintegration with small-diameter diamond drill tools and different rock types is done at the Institute of Geotechnics. The aim of this research is the possibility of monitoring and controlling the rock disintegration process with the application of acoustic signal. The acoustic vibrations accompanying the drilling process are recorded by a microphone placed in a defined position in the acoustic space. The drilling device (drilling stand, the drilling tool and the rock are the source of sound. Two basic sound states exist in the drilling stand research : the noise at no-load running and the noise at the rotary drilling of rock. Suitable quantities for optimizing the rock disintegration process are searched by the study of the acoustic signal. The dominant frequencies that characterize the disintegration process for the given rock and tool are searched by the analysis of the acoustic signal. The analysis of dominant frequencies indicates the possibility of determining an optimal regime for the maximal drilling rate. Extreme of the specific disintegration energy is determinated by the dispersion of the dominant frequency.The scanned acoustic signal is processed by the Fourier transformation. The Fourier transformation facilitates the distribution of the general non-harmonic periodic process into harmonic components. The harmonic

  4. Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

    Directory of Open Access Journals (Sweden)

    Molnar A.

    2017-06-01

    Full Text Available In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints’ lifetime.

  5. Conflict monitoring in dual process theories of thinking.

    Science.gov (United States)

    De Neys, Wim; Glumicic, Tamara

    2008-03-01

    Popular dual process theories have characterized human thinking as an interplay between an intuitive-heuristic and demanding-analytic reasoning process. Although monitoring the output of the two systems for conflict is crucial to avoid decision making errors there are some widely different views on the efficiency of the process. Kahneman [Kahneman, D. (2002). Maps of bounded rationality: A perspective on intuitive judgement and choice. Nobel Prize Lecture. Retrieved January 11, 2006, from: http://nobelprize.org/nobel_prizes/economics/laureates/2002/kahnemann-lecture.pdf] and Evans [Evans, J. St. B. T. (1984). Heuristic and analytic processing in reasoning. British Journal of Psychology, 75, 451-468], for example, claim that the monitoring of the heuristic system is typically quite lax whereas others such as Sloman [Sloman, S. A. (1996). The empirical case for two systems of reasoning. Psychological Bulletin, 119, 3-22] and Epstein [Epstein, S. (1994). Integration of the cognitive and psychodynamic unconscious. American Psychologists, 49, 709-724] claim it is flawless and people typically experience a struggle between what they "know" and "feel" in case of a conflict. The present study contrasted these views. Participants solved classic base rate neglect problems while thinking aloud. In these problems a stereotypical description cues a response that conflicts with the response based on the analytic base rate information. Verbal protocols showed no direct evidence for an explicitly experienced conflict. As Kahneman and Evans predicted, participants hardly ever mentioned the base rates and seemed to base their judgment exclusively on heuristic reasoning. However, more implicit measures of conflict detection such as participants' retrieval of the base rate information in an unannounced recall test, decision making latencies, and the tendency to review the base rates indicated that the base rates had been thoroughly processed. On control problems where base rates and

  6. Monitoring and control of fine abrasive finishing processes

    DEFF Research Database (Denmark)

    Lazarev, Ruslan

    In engineering, surfaces with specified functional properties are of high demand in various applications. Desired surface finish can be obtained using several methods. Abrasive finishing is one of the most important processes in the manufacturing of mould and dies tools. It is a principal method ...... was segmented using discretization methods. The applied methodology was proposed for implementation as an on-line system and is considered to be a part of the next generation of STRECON NanoRAP machine....... to remove unwanted material, obtain desired geometry, surface quality and surface functional properties. The automation and computerization of finishing processes involves utilisation of robots, specialized machines with several degrees of freedom, sensors and data acquisition systems. The focus...... of this work was to investigate foundations for process monitoring and control methods in application to semi-automated polishing machine based on the industrial robot. The monitoring system was built on NI data acquisition system with two sensors, acoustic emission sensor and accelerometer. Acquired sensory...

  7. Long Term Monitoring of Microbial Induced Soil Strengthening Processes

    Science.gov (United States)

    Saneiyan, S.; Ntarlagiannis, D.; Werkema, D. D., Jr.; Colwell, F. S.; Ohan, J.

    2016-12-01

    Soil strengthening/stabilization processes are used to address some of soil quality issues. Microbial induced calcite precipitation (MICP) is a promising soil stabilization process that could offer long term solution by overcoming problems of commonly used methods (e.g. injecting cement slurry). MICP can be applied in larger spatial scales, allowing the enhanced soils to be maintained in an economic sustainable and environmental friendly way. Methods are sought for the long term monitoring of MICP enhanced soils. The spectral induced polarization (SIP) method is one promising method due to sensitivity on such processes and the ability for long term, even autonomous, operation as well as cost effectiveness. Previous laboratory tests showed the sensitivity of the SIP method on soil strengthening as a result of abiotic calcite precipitation. We extended this work to biotic calcite precipitation through MICP. Early results suggest that the MICP formed calcite is denser and could provide improved strengthening capabilities. Our results are supported by geophysical (SIP and shear-wave velocity), geo-chemical and microbiological monitoring. Destructive analysis and visualization (scanning electron imaging - SEM) is expected to provide conclusive evidence on the MICP long term effectiveness.

  8. Unsupervised process monitoring and fault diagnosis with machine learning methods

    CERN Document Server

    Aldrich, Chris

    2013-01-01

    This unique text/reference describes in detail the latest advances in unsupervised process monitoring and fault diagnosis with machine learning methods. Abundant case studies throughout the text demonstrate the efficacy of each method in real-world settings. The broad coverage examines such cutting-edge topics as the use of information theory to enhance unsupervised learning in tree-based methods, the extension of kernel methods to multiple kernel learning for feature extraction from data, and the incremental training of multilayer perceptrons to construct deep architectures for enhanced data

  9. Minicomputer controlled test system for process control and monitoring systems

    International Nuclear Information System (INIS)

    Worster, L.D.

    A minicomputer controlled test system for testing process control and monitoring systems is described. This system, in service for over one year, has demonstrated that computerized control of such testing has a real potential for expanding the scope of the testing, improving accuracy of testing, and significantly reducing the time required to do the testing. The test system is built around a 16-bit minicomputer with 12K of memory. The system programming language is BASIC with the addition of assembly level routines for communication with the peripheral devices. The peripheral devices include a 100 channel scanner, analog-to-digital converter, visual display, and strip printer. (auth)

  10. Online monitoring and control of the biogas process

    Energy Technology Data Exchange (ETDEWEB)

    Boe, K.

    2006-07-01

    The demand for online monitoring and control of biogas process is increasing, since better monitoring and control system can improve process stability and enhance process performance for better economy of the biogas plants. A number of parameters in both the liquid and the gas phase have been suggested as process indicators. These include gas production, pH, alkalinity, volatile fatty acids (VFA) and hydrogen. Of these, VFA is the most widely recognised as a direct, relevant measure of stability. The individual, rather than collective VFA concentrations are recognised as providing significantly more information for diagnosis. However, classic on-line measurement is based on filtration, which suffers from fouling, especially in particulate or slurry wastes. In this project, a new online VFA monitoring system has been developed using gas-phase VFA extraction to avoid sample filtration. The liquid sample is pumped into a sampling chamber, acidified, added with salt and heated to extract VFA into the gas phase before analysis by GC-FID. This allows easy application to manure. Sample and analysis time of the system varies from 25-40 min. depending on the washing duration. The sampling frequency is fast enough for the dynamic of a manure digester, which is in the range of several hours. This system has been validated over more than 6 months and had shown good agreement with offline VFA measurement. Response from this sensor was compared with other process parameters such as biogas production, pH and dissolved hydrogen during overload situations in a laboratory-scale digester, to investigate the suitability of each measure as a process indicator. VFA was most reliable for indicating process imbalance, and propionate was most persistent. However, when coupling the online VFA monitoring with a simple control for automatic controlling propionate level in a digester, it was found that propionate decreased so slow that the biogas production fluctuated. Therefore, it is more

  11. Triple Bioluminescence Imaging for In Vivo Monitoring of Cellular Processes

    Directory of Open Access Journals (Sweden)

    Casey A Maguire

    2013-01-01

    Full Text Available Bioluminescence imaging (BLI has shown to be crucial for monitoring in vivo biological processes. So far, only dual bioluminescence imaging using firefly (Fluc and Renilla or Gaussia (Gluc luciferase has been achieved due to the lack of availability of other efficiently expressed luciferases using different substrates. Here, we characterized a codon-optimized luciferase from Vargula hilgendorfii (Vluc as a reporter for mammalian gene expression. We showed that Vluc can be multiplexed with Gluc and Fluc for sequential imaging of three distinct cellular phenomena in the same biological system using vargulin, coelenterazine, and D-luciferin substrates, respectively. We applied this triple imaging system to monitor the effect of soluble tumor necrosis factor-related apoptosis-inducing ligand (sTRAIL delivered using an adeno-associated viral vector (AAV on brain tumors in mice. Vluc imaging showed efficient sTRAIL gene delivery to the brain, while Fluc imaging revealed a robust antiglioma therapy. Further, nuclear factor-κB (NF-κB activation in response to sTRAIL binding to glioma cells death receptors was monitored by Gluc imaging. This work is the first demonstration of trimodal in vivo bioluminescence imaging and will have a broad applicability in many different fields including immunology, oncology, virology, and neuroscience.

  12. The european primary care monitor: structure, process and outcome indicators

    Directory of Open Access Journals (Sweden)

    Wilson Andrew

    2010-10-01

    Full Text Available Abstract Background Scientific research has provided evidence on benefits of well developed primary care systems. The relevance of some of this research for the European situation is limited. There is currently a lack of up to date comprehensive and comparable information on variation in development of primary care, and a lack of knowledge of structures and strategies conducive to strengthening primary care in Europe. The EC funded project Primary Health Care Activity Monitor for Europe (PHAMEU aims to fill this gap by developing a Primary Care Monitoring System (PC Monitor for application in 31 European countries. This article describes the development of the indicators of the PC Monitor, which will make it possible to create an alternative model for holistic analyses of primary care. Methods A systematic review of the primary care literature published between 2003 and July 2008 was carried out. This resulted in an overview of: (1 the dimensions of primary care and their relevance to outcomes at (primary health system level; (2 essential features per dimension; (3 applied indicators to measure the features of primary care dimensions. The indicators were evaluated by the project team against criteria of relevance, precision, flexibility, and discriminating power. The resulting indicator set was evaluated on its suitability for Europe-wide comparison of primary care systems by a panel of primary care experts from various European countries (representing a variety of primary care systems. Results The developed PC Monitor approaches primary care in Europe as a multidimensional concept. It describes the key dimensions of primary care systems at three levels: structure, process, and outcome level. On structure level, it includes indicators for governance, economic conditions, and workforce development. On process level, indicators describe access, comprehensiveness, continuity, and coordination of primary care services. On outcome level, indicators

  13. Control of microstructure in soldered, brazed, welded, plated, cast or vapor deposited manufactured components

    Science.gov (United States)

    Ripley, Edward B.; Hallman, Russell L.

    2015-11-10

    Disclosed are methods and systems for controlling of the microstructures of a soldered, brazed, welded, plated, cast, or vapor deposited manufactured component. The systems typically use relatively weak magnetic fields of either constant or varying flux to affect material properties within a manufactured component, typically without modifying the alloy, or changing the chemical composition of materials or altering the time, temperature, or transformation parameters of a manufacturing process. Such systems and processes may be used with components consisting of only materials that are conventionally characterized as be uninfluenced by magnetic forces.

  14. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

  15. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

  16. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

  17. A Corrosion Investigation of Solder Candidates for High-Temperature Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Ambat, Rajan

    2009-01-01

    The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work...

  18. Thermographic process monitoring in powderbed based additive manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Krauss, Harald, E-mail: harald.krauss@iwb.tum.de; Zaeh, Michael F. [AMLab, iwb Application Center Augsburg, Technische Universität München (Germany); Zeugner, Thomas [Augsburg University (Germany)

    2015-03-31

    Selective Laser Melting is utilized to build metallic parts directly from CAD-Data by solidification of thin powder layers through application of a fast scanning laser beam. In this study layerwise monitoring of the temperature distribution is used to gather information about the process stability and the resulting part quality. The heat distribution varies with different kinds of parameters including scan vector length, laser power, layer thickness and inter-part distance in the job layout which in turn influence the resulting part quality. By integration of an off-axis mounted uncooled thermal detector the solidification as well as the layer deposition are monitored and evaluated. Errors in the generation of new powder layers usually result in a locally varying layer thickness that may cause poor part quality. For effect quantification, the locally applied layer thickness is determined by evaluating the heat-up of the newly deposited powder. During the solidification process space and time-resolved data is used to characterize the zone of elevated temperatures and to derive locally varying heat dissipation properties. Potential quality indicators are evaluated and correlated to the resulting part quality: Thermal diffusivity is derived from a simplified heat dissipation model and evaluated for every pixel and cool-down phase of a layer. This allows the quantification of expected material homogeneity properties. Maximum temperature and time above certain temperatures are measured in order to detect hot spots or delamination issues that may cause a process breakdown. Furthermore, a method for quantification of sputter activity is presented. Since high sputter activity indicates unstable melt dynamics this can be used to identify parameter drifts, improper atmospheric conditions or material binding errors. The resulting surface structure after solidification complicates temperature determination on the one hand but enables the detection of potential surface defects

  19. Monitoring of Soil Remediation Process in the Metal Mining Area

    Science.gov (United States)

    Kim, Kyoung-Woong; Ko, Myoung-Soo; Han, Hyeop-jo; Lee, Sang-Ho; Na, So-Young

    2016-04-01

    Stabilization using proper additives is an effective soil remediation technique to reduce As mobility in soil. Several researches have reported that Fe-containing materials such as amorphous Fe-oxides, goethite and hematite were effective in As immobilization and therefore acid mine drainage sludge (AMDS) may be potential material for As immobilization. The AMDS is the by-product from electrochemical treatment of acid mine drainage and mainly contains Fe-oxide. The Chungyang area in Korea is located in the vicinity of the huge abandoned Au-Ag Gubong mine which was closed in the 1970s. Large amounts of mine tailings have been remained without proper treatment and the mobilization of mine tailings can be manly occurred during the summer heavy rainfall season. Soil contamination from this mobilization may become an urgent issue because it can cause the contamination of groundwater and crop plants in sequence. In order to reduce the mobilization of the mine tailings, the pilot scale study of in-situ stabilization using AMDS was applied after the batch and column experiments in the lab. For the monitoring of stabilization process, we used to determine the As concentration in crop plants grown on the field site but it is not easily applicable because of time and cost. Therefore, we may need simple monitoring technique to measure the mobility or leachability which can be comparable with As concentration in crop plants. We compared several extraction methods to suggest the representative single extraction method for the monitoring of soil stabilization efficiency. Several selected extraction methods were examined and Mehlich 3 extraction method using the mixture of NH4F, EDTA, NH4NO3, CH3COOH and HNO3 was selected as the best predictor of the leachability or mobility of As in the soil remediation process.

  20. Signal Processing Device (SPD) for networked radiation monitoring system

    International Nuclear Information System (INIS)

    Dharmapurikar, A.; Bhattacharya, S.; Mukhopadhyay, P.K.; Sawhney, A.; Patil, R.K.

    2010-01-01

    A networked radiation and parameter monitoring system with three tier architecture is being developed. Signal Processing Device (SPD) is a second level sub-system node in the network. SPD is an embedded system which has multiple input channels and output communication interfaces. It acquires and processes data from first level parametric sensor devices, and sends to third level devices in response to request commands received from host. It also performs scheduled diagnostic operations and passes on the information to host. It supports inputs in the form of differential digital signals and analog voltage signals. SPD communicates with higher level devices over RS232/RS422/USB channels. The system has been designed with main requirements of minimal power consumption and harsh environment in radioactive plants. This paper discusses the hardware and software design details of SPD. (author)

  1. Contributions to ultrasound monitoring of the process of milk curdling.

    Science.gov (United States)

    Jiménez, Antonio; Rufo, Montaña; Paniagua, Jesús M; Crespo, Abel T; Guerrero, M Patricia; Riballo, M José

    2017-04-01

    Ultrasound evaluation permits the state of milk being curdled to be determined quickly and cheaply, thus satisfying the demands faced by today's dairy product producers. This paper describes the non-invasive ultrasonic method of in situ monitoring the changing physical properties of milk during the renneting process. The basic objectives of the study were, on the one hand, to confirm the usefulness of conventional non-destructive ultrasonic testing (time-of-flight and attenuation of the ultrasound waves) in monitoring the process in the case of ewe's milk, and, on the other, to include other ultrasound parameters which have not previously been considered in studies on this topic, in particular, parameters provided by the Fast Fourier Transform technique. The experimental study was carried out in a dairy industry environment on four 52-l samples of raw milk in which were immersed 500kHz ultrasound transducers. Other physicochemical parameters of the raw milk (pH, dry matter, protein, Gerber fat test, and lactose) were measured, as also were the pH and temperature of the curdled samples simultaneously with the ultrasound tests. Another contribution of this study is the linear correlation analysis of the aforementioned ultrasound parameters and the physicochemical properties of the curdled milk. Copyright © 2017 Elsevier B.V. All rights reserved.

  2. Induced polarization for characterizing and monitoring soil stabilization processes

    Science.gov (United States)

    Saneiyan, S.; Ntarlagiannis, D.; Werkema, D. D., Jr.

    2017-12-01

    Soil stabilization is critical in addressing engineering problems related to building foundation support, road construction and soil erosion among others. To increase soil strength, the stiffness of the soil is enhanced through injection/precipitation of a chemical agents or minerals. Methods such as cement injection and microbial induced carbonate precipitation (MICP) are commonly applied. Verification of a successful soil stabilization project is often challenging as treatment areas are spatially extensive and invasive sampling is expensive, time consuming and limited to sporadic points at discrete times. The geophysical method, complex conductivity (CC), is sensitive to mineral surface properties, hence a promising method to monitor soil stabilization projects. Previous laboratory work has established the sensitivity of CC on MICP processes. We performed a MICP soil stabilization projects and collected CC data for the duration of the treatment (15 days). Subsurface images show small, but very clear changes, in the area of MICP treatment; the changes observed fully agree with the bio-geochemical monitoring, and previous laboratory experiments. Our results strongly suggest that CC is sensitive to field MICP treatments. Finally, our results show that good quality data alone are not adequate for the correct interpretation of field CC data, at least when the signals are low. Informed data processing routines and the inverse modeling parameters are required to produce optimal results.

  3. Process Diagnostics and Monitoring Using the Multipole Resonance Probe (MRP)

    Science.gov (United States)

    Harhausen, J.; Awakowicz, P.; Brinkmann, R. P.; Foest, R.; Lapke, M.; Musch, T.; Mussenbrock, T.; Oberrath, J.; Ohl, A.; Rolfes, I.; Schulz, Ch.; Storch, R.; Styrnoll, T.

    2011-10-01

    In this contribution we present the application of the MRP in an industrial plasma ion assisted deposition (PIAD) chamber (Leybold optics SYRUS-pro). The MRP is a novel plasma diagnostic which is suitable for an industrial environment - which means that the proposed method is robust, calibration free, and economical, and can be used for ideal and reactive plasmas alike. In order to employ the MRP as process diagnostics we mounted the probe on a manipulator to obtain spatially resolved information on the electron density and temperature. As monitoring tool the MRP is installed at a fixed position. Even during the deposition process it provides stable measurement results while other diagnostic methods, e.g. the Langmuir probe, may suffer from dielectric coatings. In this contribution we present the application of the MRP in an industrial plasma ion assisted deposition (PIAD) chamber (Leybold optics SYRUS-pro). The MRP is a novel plasma diagnostic which is suitable for an industrial environment - which means that the proposed method is robust, calibration free, and economical, and can be used for ideal and reactive plasmas alike. In order to employ the MRP as process diagnostics we mounted the probe on a manipulator to obtain spatially resolved information on the electron density and temperature. As monitoring tool the MRP is installed at a fixed position. Even during the deposition process it provides stable measurement results while other diagnostic methods, e.g. the Langmuir probe, may suffer from dielectric coatings. Funded by the German Ministry for Education and Research (BMBF, Fkz. 13N10462).

  4. Influence of Co and W powders on viscosity of composite solders during soldering of specially shaped diamond-abrasive tools

    Science.gov (United States)

    Sokolov, E. G.; Aref’eva, S. A.; Svistun, L. I.

    2018-03-01

    The influence of Co and W powders on the structure and the viscosity of composite solders Sn-Cu-Co-W used for the manufacture of the specially shaped diamond tools has been studied. The solders were obtained by mixing the metallic powders with an organic binder. The mixtures with and without diamonds were applied to steel rollers and shaped substrates. The sintering was carried out in a vacuum at 820 ° C with time-exposure of 40 minutes. The influence of Co and W powders on the viscosity solders was evaluated on the basis of the study of structures and according to the results of sintering specially shaped diamond tools. It was found that to provide the necessary viscosity and to obtain the uniform diamond-containing layers on the complex shaped surfaces, Sn-Cu-Co-W solder should contain 27–35 vol % of solid phase. This is achieved with a total solder content of 24–32 wt % of cobalt powder and 7 wt % of tungsten powder.

  5. Biowaste home composting: experimental process monitoring and quality control.

    Science.gov (United States)

    Tatàno, Fabio; Pagliaro, Giacomo; Di Giovanni, Paolo; Floriani, Enrico; Mangani, Filippo

    2015-04-01

    Because home composting is a prevention option in managing biowaste at local levels, the objective of the present study was to contribute to the knowledge of the process evolution and compost quality that can be expected and obtained, respectively, in this decentralized option. In this study, organized as the research portion of a provincial project on home composting in the territory of Pesaro-Urbino (Central Italy), four experimental composters were first initiated and temporally monitored. Second, two small sub-sets of selected provincial composters (directly operated by households involved in the project) underwent quality control on their compost products at two different temporal steps. The monitored experimental composters showed overall decreasing profiles versus composting time for moisture, organic carbon, and C/N, as well as overall increasing profiles for electrical conductivity and total nitrogen, which represented qualitative indications of progress in the process. Comparative evaluations of the monitored experimental composters also suggested some interactions in home composting, i.e., high C/N ratios limiting organic matter decomposition rates and final humification levels; high moisture contents restricting the internal temperature regime; nearly horizontal phosphorus and potassium evolutions contributing to limit the rates of increase in electrical conductivity; and prolonged biowaste additions contributing to limit the rate of decrease in moisture. The measures of parametric data variability in the two sub-sets of controlled provincial composters showed decreased variability in moisture, organic carbon, and C/N from the seventh to fifteenth month of home composting, as well as increased variability in electrical conductivity, total nitrogen, and humification rate, which could be considered compatible with the respective nature of decreasing and increasing parameters during composting. The modeled parametric kinetics in the monitored experimental

  6. Process monitoring of additive manufacturing by using optical tomography

    Energy Technology Data Exchange (ETDEWEB)

    Zenzinger, Guenter, E-mail: guenter.zenzinger@mtu.de, E-mail: alexander.ladewig@mtu.de; Bamberg, Joachim, E-mail: guenter.zenzinger@mtu.de, E-mail: alexander.ladewig@mtu.de; Ladewig, Alexander, E-mail: guenter.zenzinger@mtu.de, E-mail: alexander.ladewig@mtu.de; Hess, Thomas, E-mail: guenter.zenzinger@mtu.de, E-mail: alexander.ladewig@mtu.de; Henkel, Benjamin, E-mail: guenter.zenzinger@mtu.de, E-mail: alexander.ladewig@mtu.de; Satzger, Wilhelm, E-mail: guenter.zenzinger@mtu.de, E-mail: alexander.ladewig@mtu.de [MTU Aero Engines AG, Dachauerstrasse 665, 80995 Munich (Germany)

    2015-03-31

    Parts fabricated by means of additive manufacturing are usually of complex shape and owing to the fabrication procedure by using selective laser melting (SLM), potential defects and inaccuracies are often very small in lateral size. Therefore, an adequate quality inspection of such parts is rather challenging, while non-destructive-techniques (NDT) are difficult to realize, but considerable efforts are necessary in order to ensure the quality of SLM-parts especially used for aerospace components. Thus, MTU Aero Engines is currently focusing on the development of an Online Process Control system which monitors and documents the complete welding process during the SLM fabrication procedure. A high-resolution camera system is used to obtain images, from which tomographic data for a 3dim analysis of SLM-parts are processed. From the analysis, structural irregularities and structural disorder resulting from any possible erroneous melting process become visible and may be allocated anywhere within the 3dim structure. Results of our optical tomography (OT) method as obtained on real defects are presented.

  7. Statistical process control charts for monitoring military injuries.

    Science.gov (United States)

    Schuh, Anna; Canham-Chervak, Michelle; Jones, Bruce H

    2017-12-01

    An essential aspect of an injury prevention process is surveillance, which quantifies and documents injury rates in populations of interest and enables monitoring of injury frequencies, rates and trends. To drive progress towards injury reduction goals, additional tools are needed. Statistical process control charts, a methodology that has not been previously applied to Army injury monitoring, capitalise on existing medical surveillance data to provide information to leadership about injury trends necessary for prevention planning and evaluation. Statistical process control Shewhart u-charts were created for 49 US Army installations using quarterly injury medical encounter rates, 2007-2015, for active duty soldiers obtained from the Defense Medical Surveillance System. Injuries were defined according to established military injury surveillance recommendations. Charts display control limits three standard deviations (SDs) above and below an installation-specific historical average rate determined using 28 data points, 2007-2013. Charts are available in Army strategic management dashboards. From 2007 to 2015, Army injury rates ranged from 1254 to 1494 unique injuries per 1000 person-years. Installation injury rates ranged from 610 to 2312 injuries per 1000 person-years. Control charts identified four installations with injury rates exceeding the upper control limits at least once during 2014-2015, rates at three installations exceeded the lower control limit at least once and 42 installations had rates that fluctuated around the historical mean. Control charts can be used to drive progress towards injury reduction goals by indicating statistically significant increases and decreases in injury rates. Future applications to military subpopulations, other health outcome metrics and chart enhancements are suggested. Published by the BMJ Publishing Group Limited. For permission to use (where not already granted under a licence) please go to http://www.bmj.com/company/products-services/rights-and-licensing/.

  8. Drinking Water Contamination Due To Lead-based Solder

    Science.gov (United States)

    Garcia, N.; Bartelt, E.; Cuff, K. E.

    2004-12-01

    The presence of lead in drinking water creates many health hazards. Exposure to lead-contaminated water can affect the brain, the central nervous system, blood cells, and kidneys, causing such problems as mental retardation, kidney disease, heart disease, stroke, and death. One way in which lead can contaminate our water supply is through the use of lead solder to join pipes. Lead solder was widely used in the past because of its ease of application as well as its low cost. Lead contamination in residential areas has previously been found to be a particularly serious problem in first-draw samples, of water that has sat stagnant in pipes overnight. To investigate the time-dependence of drinking water lead contamination, we analyzed samples taken hourly of water exposed to lead solder. While our preliminary data was insufficient to show more than a rough correlation between time of exposure and lead concentration over short periods (1-3 hours), we were able to confirm that overnight exposure of water to lead-based solder results in the presence high levels of lead. We also investigated other, external factors that previous research has indicated contribute to increased concentrations of lead. Our analysis of samples of lead-exposed water at various pH and temperatures suggests that these factors can be equally significant in terms of their contribution to elevated lead concentration levels. In particular, water that is slightly corrosive appears to severely impact the solubility of lead. As this type of water is common in much of the Northeast United States, the presence of lead-based solder in residential areas there is especially problematic. Although lead-based solder has been banned since the 1980s, it remains a serious concern, and a practical solution still requires further research.

  9. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan

    2017-08-10

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  10. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan; Zheng, Xiujun; Zhang, Hong; Zhang, Junli; Fu, Jiecai; Zhang, Qiang; Peng, Chaoyi; Bai, Feiming; Zhang, Xixiang; Peng, Yong

    2017-01-01

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  11. Spectral induced polarization for monitoring electrokinetic remediation processes

    Science.gov (United States)

    Masi, Matteo; Losito, Gabriella

    2015-12-01

    Electrokinetic remediation is an emerging technology for extracting heavy metals from contaminated soils and sediments. This method uses a direct or alternating electric field to induce the transport of contaminants toward the electrodes. The electric field also produces pH variations, sorption/desorption and precipitation/dissolution of species in the porous medium during remediation. Since heavy metal mobility is pH-dependent, the accurate control of pH inside the material is required in order to enhance the removal efficiency. The common approach for monitoring the remediation process both in laboratory and in the field is the chemical analysis of samples collected from discrete locations. The purpose of this study is the evaluation of Spectral Induced Polarization as an alternative method for monitoring geochemical changes in the contaminated mass during remediation. The advantage of this technique applied to field-scale is to offer higher resolution mapping of the remediation site and lower cost compared to the conventional sampling procedure. We carried out laboratory-scale electrokinetic remediation experiments on fine-grained marine sediments contaminated by heavy metal and we made Spectral Induced Polarization measurements before and after each treatment. Measurements were done in the frequency range 10- 3-103 Hz. By the deconvolution of the spectra using the Debye Decomposition method we obtained the mean relaxation time and total chargeability. The main finding of this work is that a linear relationship exists between the local total chargeability and pH, with good agreement. The observed behaviour of chargeability is interpreted as a direct consequence of the alteration of the zeta potential of the sediment particles due to pH changes. Such relationship has a significant value for the interpretation of induced polarization data, allowing the use of this technique for monitoring electrokinetic remediation at field-scale.

  12. Radioanalytical Chemistry for Automated Nuclear Waste Process Monitoring

    International Nuclear Information System (INIS)

    Egorov, Oleg B.; Grate, Jay W.; DeVol, Timothy A.

    2004-01-01

    provide the basis for designing effective instrumentation for radioanalytical process monitoring. Research Progress and Implications

  13. Radioanalytical Chemistry for Automated Nuclear Waste Process Monitoring

    International Nuclear Information System (INIS)

    Egorov, Oleg B.; Grate, Jay W.; DeVol, Timothy A.

    2003-01-01

    This research program is directed toward rapid, sensitive, and selective determination of beta and alpha-emitting radionuclides such as 99Tc, 90Sr, and trans-uranium (TRU) elements in low activity waste (LAW) processing streams. The overall technical approach is based on automated radiochemical measurement principles. Nuclear waste process streams are particularly challenging for rapid analytical methods due to the complex, high- ionic-strength, caustic brine sample matrix, the presence of interfering radionuclides, and the variable and uncertain speciation of the radionuclides of interest. As a result, matrix modification, speciation control, and separation chemistries are required for use in automated process analyzers. Significant knowledge gaps exist relative to the design of chemistries for such analyzers so that radionuclides can be quantitatively and rapidly separated and analyzed in solutions derived from low-activity waste processing operations. This research is addressing these knowledge gaps in the area of separation science, nuclear detection, and analytical chemistry and instrumentation. The outcome of these investigations will be the knowledge necessary to choose appropriate chemistries for sample matrix modification and analyte speciation control and chemistries for rapid and selective separation and preconcentration of target radionuclides from complex sample matrices. In addition, new approaches for quantification of alpha emitters in solution using solid state diode detectors, as well as improved instrumentation and signal processing techniques for use with solid-state and scintillation detectors, will be developed. New knowledge of the performance of separation materials, matrix modification and speciation control chemistries, instrument configurations, and quantitative analytical approaches will provide the basis for designing effective instrumentation for radioanalytical process monitoring. Specific analytical targets include 99 Tc, 90Sr and

  14. Hold-up monitoring system for plutonium process tanks

    International Nuclear Information System (INIS)

    Zhu Rongbao; Jin Huimin; Tan Yajun

    1994-01-01

    The development of hold-up monitoring system for plutonium process tanks and a calculation method for α activities deposited in containers and inner walls of pipe are described. The hardware of monitoring system consists of a portable HPGe detector, a φ50 mm x 60 mm NaI(Tl) detector, γ-ray tungsten collimators, ORTEC92X Spectrum Master and an AST-286 computer. The software of system includes Maestro Tm for Window3 and a PHOUP1 hold-up application software for user. The Monte-Carlo simulation calculation supported by MCNP software is performed for the probability calculation of all the unscattering γ-rays reaching to the detection positions from the source terms deposited in the complicated tanks. A measurement mean value for different positions is used to minimize the effect of heterogeneous distribution of source term. The sensitivity is better than 3.7 x 10 6 Bq/kg (steel) for a plutonium simulation source on a 3-8 mm thick steel plate surrounded by 0.8 x 10 -10 C/kg·s γ field from long-life fission products

  15. Monitoring of Lactic Fermentation Process by Ultrasonic Technique

    Science.gov (United States)

    Alouache, B.; Touat, A.; Boutkedjirt, T.; Bennamane, A.

    The non-destructive control by using ultrasound techniques has become of great importance in food industry. In this work, Ultrasound has been used for quality control and monitoring the fermentation stages of yogurt, which is a highly consumed product. On the contrary to the physico-chemical methods, where the measurement instruments are directly introduced in the sample, ultrasound techniques have the advantage of being non-destructive and contactless, thus reducing the risk of contamination. Results obtained in this study by using ultrasound seem to be in good agreement with those obtained by physico-chemical methods such as acidity measurement by using a PH-meter instrument. This lets us to conclude that ultrasound method may be an alternative for a healthy control of yoghurt fermentation process.

  16. Opportunities for Process Monitoring Techniques at Delayed Access Facilities

    Energy Technology Data Exchange (ETDEWEB)

    Curtis, Michael M.; Gitau, Ernest TN; Johnson, Shirley J.; Schanfein, Mark; Toomey, Christopher

    2013-09-20

    Except for specific cases where the International Atomic Energy Agency (IAEA) maintains a continuous presence at a facility (such as the Japanese Rokkasho Reprocessing Plant), there is always a period of time or delay between the moment a State is notified or aware of an upcoming inspection, and the time the inspector actually enters the material balance area or facility. Termed by the authors as “delayed access,” this period of time between inspection notice and inspector entrance to a facility poses a concern. Delayed access also has the potential to reduce the effectiveness of measures applied as part of the Safeguards Approach for a facility (such as short-notice inspections). This report investigates the feasibility of using process monitoring to address safeguards challenges posed by delayed access at a subset of facility types.

  17. Monitoring Biological Modes in a Bioreactor Process by Computer Simulation

    Directory of Open Access Journals (Sweden)

    Samia Semcheddine

    2015-12-01

    Full Text Available This paper deals with the general framework of fermentation system modeling and monitoring, focusing on the fermentation of Escherichia coli. Our main objective is to develop an algorithm for the online detection of acetate production during the culture of recombinant proteins. The analysis the fermentation process shows that it behaves like a hybrid dynamic system with commutation (since it can be represented by 5 nonlinear models. We present a strategy of fault detection based on residual generation for detecting the different actual biological modes. The residual generation is based on nonlinear analytical redundancy relations. The simulation results show that the several modes that are occulted during the bacteria cultivation can be detected by residuals using a nonlinear dynamic model and a reduced instrumentation.

  18. Monitoring temperatures in coal conversion and combustion processes via ultrasound

    Science.gov (United States)

    Gopalsami, N.; Raptis, A. C.; Mulcahey, T. P.

    1980-02-01

    The state of the art of instrumentation for monitoring temperatures in coal conversion and combustion systems is examined. The instrumentation types studied include thermocouples, radiation pyrometers, and acoustical thermometers. The capabilities and limitations of each type are reviewed. A feasibility study of the ultrasonic thermometry is described. A mathematical model of a pulse-echo ultrasonic temperature measurement system is developed using linear system theory. The mathematical model lends itself to the adaptation of generalized correlation techniques for the estimation of propagation delays. Computer simulations are made to test the efficacy of the signal processing techniques for noise-free as well as noisy signals. Based on the theoretical study, acoustic techniques to measure temperature in reactors and combustors are feasible.

  19. Decomposition studies of no-clean solder flux systems in connection with corrosion reliability of electronics

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Verdingovas, Vadimas

    2013-01-01

    with specific soldering process and parameters, while most important factors are the flux chemistry and its decomposition characteristics. Active parts of the flux residue can cause increased water absorption due to their hygroscopic nature and in solution they will increase leakage current and corrosion...... the contaminated PCBA parts to varying humidity and measuring the resulting leakage current. Results revealed a significant influence of flux chemistry including the amount of WOAs, while aggressiveness of the residue seems to vary with content and type of WOAs, and their nature of decomposition....

  20. In situ TEM observation of microcrack nucleation and propagation in pure tin solder

    International Nuclear Information System (INIS)

    Ding Ying; Wang Chunqing; Li, Mingyu; Wang Weiqiang

    2006-01-01

    Microcrack nucleation and propagation behavior in pure tin solder was investigated by using transmission electron microscopy (TEM) through in situ tensile test. Observation results showed that fracture process was completed in this visco-plastic material by connecting discontinuous cracks or voids. Depending on remarkable vacancy diffusion ability, microvoids were nucleated and developed in the dislocation free zone (DFZ) or super thinned area ahead of crack tip under local high stress concentration. The cracks were linked with each other by mutual dislocation emission which expedites the propagation of crack tips effectively

  1. Odour in composting processes at pilot scale: monitoring and biofiltration.

    Science.gov (United States)

    Gutiérrez, M C; Serrano, A; Martín, M A; Chica, A F

    2014-08-01

    Although odour emissions associated with the composting process, especially during the hydrolytic stage, are widely known, their impact on surrounding areas is not easily quantifiable, For this reason, odour emissions during the first stage ofcomposting were evaluated by dynamic olfactometry at pilot scale in order to obtain results which can be extrapolated to industrial facilities. The composting was carried out in a commercial dynamic respirometer equipped with two biofilters at pilot scale filled with prunings (Populus) and mature compost obtained from the organic fraction of municipal solid waste. Given that the highest odour emissions occur in the first stage of the composting process, this stage was carried out in a closed system to better control the odour emissions, whose maximum value was estimated to be 2.78 ouF S-1 during the experiments. Odour concentration, the dynamic respiration index and temperature showed the same evolution during composting, thus indicating that odour could be a key variable in the monitoring process. Other variables such as total organic carbon (CTOC) and pH were also found to be significant in this study due to their influence over odour emissions. The efficiency of the biofilters (empty bed residence time of 86 s) was determined by quantifying the odour emissions at the inlet and outlet of both biofilters. The moisture content in the biofilters was found to be an important variable for improving odour removal efficiency, while the minimum moisture percentage to obtain successful results was found to be 55% (odour removal efficiency of 95%).

  2. Cost Effective Process Monitoring using UV-VIS-NIR Spectroscopy

    International Nuclear Information System (INIS)

    Cipiti, B.; McDaniel, M.; Bryan, S.; Pratt, S.

    2015-01-01

    UV-VIS-NIR Spectroscopy is a simple and inexpensive measurement technology which has been proposed for process monitoring applications at reprocessing plants. The purpose of this work was to examine if spectroscopy could replace more costly analytical measurements to reduce the safeguards burden to the operator or inspector. Recognizing that the higher measurement uncertainty of spectroscopy makes it unsuited for the accountability tanks, the approach instead was to focus on replacing mass spectrometry for random samples that are taken in a plant. The Interim Inventory Verification and Short Inventory Verification (IIV/SIV) at the Rokkasho Reprocessing Plant utilize random sampling of internal process vessels and laboratory measurement using Isotope Dilution Mass Spectrometry (IDMS) to account for plutonium on a timely basis. These measurements are time-consuming, and the low uncertainty may not always be required. For this work, modelling was used to examine if spectroscopy could be used without adversely affecting the safeguards of the plant. The Separation and Safeguards Performance Model (SSPM), developed at Sandia National Laboratories, was utilized to examine the replacement of IDMS measurements with spectroscopy. Modeling results showed that complete replacement of IDMS with spectroscopy lowered the detection probability for diversion by an unacceptable amount. However, partial replacement (only for samples from vessels with low plutonium content) did not adversely affect the detection probability. This partial replacement covers roughly half of the twenty or so sampling points used for the IIV/SIVA cost-benefit analysis was completed to determine the cost savings that this approach can provide based on lower equipment costs, maintenance, and reduction of analysts' time. This work envisions working with the existing sampling system and performing the spectroscopic measurements in the analytical laboratory, but future work could examine incorporating

  3. A New Digital Signal Processing Method for Spectrum Interference Monitoring

    Science.gov (United States)

    Angrisani, L.; Capriglione, D.; Ferrigno, L.; Miele, G.

    2011-01-01

    Frequency spectrum is a limited shared resource, nowadays interested by an ever growing number of different applications. Generally, the companies providing such services pay to the governments the right of using a limited portion of the spectrum, consequently they would be assured that the licensed radio spectrum resource is not interested by significant external interferences. At the same time, they have to guarantee that their devices make an efficient use of the spectrum and meet the electromagnetic compatibility regulations. Therefore the competent authorities are called to control the access to the spectrum adopting suitable management and monitoring policies, as well as the manufacturers have to periodically verify the correct working of their apparatuses. Several measurement solutions are present on the market. They generally refer to real-time spectrum analyzers and measurement receivers. Both of them are characterized by good metrological accuracies but show costs, dimensions and weights that make no possible a use "on the field". The paper presents a first step in realizing a digital signal processing based measurement instrument able to suitably accomplish for the above mentioned needs. In particular the attention has been given to the DSP based measurement section of the instrument. To these aims an innovative measurement method for spectrum monitoring and management is proposed in this paper. It performs an efficient sequential analysis based on a sample by sample digital processing. Three main issues are in particular pursued: (i) measurement performance comparable to that exhibited by other methods proposed in literature; (ii) fast measurement time, (iii) easy implementation on cost-effective measurement hardware.

  4. Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

    Energy Technology Data Exchange (ETDEWEB)

    Lucas, J.P.; Guo, F.; McDougall, J.; Bieler, T.R.; Subramanian, K.N.; Park, J.K.

    1999-11-01

    Creep deformation behavior was measured for 60--100 {micro}m thick solder joints. The solder joints investigated consisted of: (1) non-composite solder joints made with eutectic Sn-Ag solder, and (2) composite solder joints with eutectic Sn-Ag solder containing 20 vol.%, 5 {micro}m diameter in-situ Cu{sub 6}Sn{sub 5} intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.

  5. FLAME MONITORING IN POWER STATION BOILERS USING IMAGE PROCESSING

    Directory of Open Access Journals (Sweden)

    K. Sujatha

    2012-05-01

    Full Text Available Combustion quality in power station boilers plays an important role in minimizing the flue gas emissions. In the present work various intelligent schemes to infer the flue gas emissions by monitoring the flame colour at the furnace of the boiler are proposed here. Flame image monitoring involves capturing the flame video over a period of time with the measurement of various parameters like Carbon dioxide (CO2, excess oxygen (O2, Nitrogen dioxide (NOx, Sulphur dioxide (SOx and Carbon monoxide (CO emissions plus the flame temperature at the core of the fire ball, air/fuel ratio and the combustion quality. Higher the quality of combustion less will be the flue gases at the exhaust. The flame video was captured using an infrared camera. The flame video is then split up into the frames for further analysis. The video splitter is used for progressive extraction of the flame images from the video. The images of the flame are then pre-processed to reduce noise. The conventional classification and clustering techniques include the Euclidean distance classifier (L2 norm classifier. The intelligent classifier includes the Radial Basis Function Network (RBF, Back Propagation Algorithm (BPA and parallel architecture with RBF and BPA (PRBFBPA. The results of the validation are supported with the above mentioned performance measures whose values are in the optimal range. The values of the temperatures, combustion quality, SOx, NOx, CO, CO2 concentrations, air and fuel supplied corresponding to the images were obtained thereby indicating the necessary control action taken to increase or decrease the air supply so as to ensure complete combustion. In this work, by continuously monitoring the flame images, combustion quality was inferred (complete/partial/incomplete combustion and the air/fuel ratio can be automatically varied. Moreover in the existing set-up, measurements like NOx, CO and CO2 are inferred from the samples that are collected periodically or by

  6. Molecular Probes: An Innovative Technology for Monitoring Membrane Processes

    Science.gov (United States)

    Santoro, Sergio

    The ultimate objective of this study is to use molecular probes as an innovative and alternative technology contributing to the advance of membrane science by monitoring membrane processes in-situ, on-line and at sub-micron scale. An optical sensor for oxygen sensing was developed by the immobilization of tris (1,10-phenanthroline) ruthenium (II) (Ru(phen)3) in a dense polymeric membrane made of polystyrene (PS) or Poly(3-hydroxybutyrate-co-3-hydroxyvalerate) (PHBV). The emission of the probe was quenched by both the temperature and by the oxygen. Moreover, the oxygen sensitivity was affected by the oxygen permeability of the membrane. The evaluation of the oxygen concentration is prone to errors since the emission of a single probe depends on several parameters (i.e. optical path, source intensity). The correction of these artefacts was obtained by the immobilization of a second luminescent molecule non-sensitive to the oxygen, Coumarin. The potential of the luminescent ratiometric sensor for the non-invasive monitoring of oxygen in food packaging using polymeric films with different oxygen permeability was evaluated. Emphasis was given to the efficiency of the optical sensor for the on-line, in-situ and non invasive monitoring of the oxygen by comparing the experimental data with a model which takes into account the oxygen permeability of the packaging materials evaluated independently. A nano-thermometer based on silica nano-particles doped with Ru(phen)3 was developed. A systematic study shows how it is possible to control the properties of the nano-particles as well as their temperature sensitivity. The nano-thermometer was immobilized on a membrane surface by dip-coating providing information about the temperature on the membrane surface. Hydrophobic porous membrane made of Poly(vinylidene fluoride) was prepared via electrospinning and employed in a direct contact membrane distillation process. Using a designed membrane module and a membrane doped with Ru

  7. Information Security Monitoring Process Research in Russian Federation Banking System Organization

    Directory of Open Access Journals (Sweden)

    Anton Sergeevich Zaytsev

    2013-09-01

    Full Text Available In this article the author considers documents and scientific articles that should be used to configure monitoring and information security incident management process in an organization of banking system of Russia. Also key principles of monitoring configuration were marked up and a technique of monitoring configuration was proposed. Principles of monitoring system configuration were defined and a set of documents used to legitimate monitoring and information incident management process was considered.

  8. High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

    DEFF Research Database (Denmark)

    High-temperature solders have been widely used as joining materials to provide stable interconnections that resist a severe thermal environment and also to facilitate the drive for miniaturization. High-lead containing solders have been commonly used as high-temperature solders. The development...... of high-temperature lead-free solders has become an important issue for both the electronics and automobile industries because of the health and environmental concerns associated with lead usage. Unfortunately, limited choices are available as high-temperature lead-free solders. This work outlines...... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

  9. Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xia Yanghua [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)], E-mail: xia_yanghua@hotmail.com; Xie Xiaoming [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)

    2008-04-24

    The reliability of lead-free electronic assemblies under thermal cycling was investigated. Thin small outline package (TSOP) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) were studied. The results show that OSP finish reveals better performance than its ENIG counterparts. The crack originates at the fringe of heel fillet in both cases. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface. When the OSP finishes are employed, many Cu6Sn5 precipitates form inside the bulk solder and have a strengthening effect on the solder joint, resulting in better reliability performance as compared to those with ENIG finishes.

  10. In situ investigation of SnAgCu solder alloy microstructure

    International Nuclear Information System (INIS)

    Pietrikova, Alena; Bednarcik, Jozef; Durisin, Juraj

    2011-01-01

    Research highlights: → In situ X-ray diffraction investigation enabled detailed analysis of the melting and solidification process of the SAC305 alloy. → It was found that the SAC305 solder melts at 230 deg. C. When cooling from 240 deg. C the SAC305 alloy solidifies at the temperature of 214 deg. C. During solidification β-Sn and Cu 6 Sn 5 is also formed. Formation of Ag 3 Sn occurs at 206 deg. C and the remaining amount of alloy crystallizes approximately at 160 deg. C. → Furthermore, observation of the thermal expansion behaviour of the β-Sn tetragonal unit cell revealed linear dependence of the unit cell volume on temperature. The unit cell parameters a and c also increase linearly with the temperature. Despite the fact that the c parameter is substantially smaller than parameter a, it exhibits a significantly higher linear thermal expansion coefficient. Comparison between data obtained during heating and cooling indicates that the thermal expansion coefficient is slightly greater in the case of cooling. - Abstract: In situ X-ray diffraction experiments, using synchrotron radiation, were employed to analyze microstructure evolution of the 96.5Sn3Ag0.5Cu (wt.%)-SAC305 lead-free solder alloy during heating (30-240 deg. C), isothermal dwell (240 deg. C) and cooling (240-30 deg. C). The special emphasis was placed on the study of the melting and solidification processes, explaining formation, distribution and the order of crystallization of the crystal phases (β-Sn, intermetallic compounds) in the solder alloy. Furthermore, thermal expansion behaviour of the main constituent phase β-Sn was analyzed prior to melting and after the consequent solidification.

  11. [Monitoring method of extraction process for Schisandrae Chinensis Fructus based on near infrared spectroscopy and multivariate statistical process control].

    Science.gov (United States)

    Xu, Min; Zhang, Lei; Yue, Hong-Shui; Pang, Hong-Wei; Ye, Zheng-Liang; Ding, Li

    2017-10-01

    To establish an on-line monitoring method for extraction process of Schisandrae Chinensis Fructus, the formula medicinal material of Yiqi Fumai lyophilized injection by combining near infrared spectroscopy with multi-variable data analysis technology. The multivariate statistical process control (MSPC) model was established based on 5 normal batches in production and 2 test batches were monitored by PC scores, DModX and Hotelling T2 control charts. The results showed that MSPC model had a good monitoring ability for the extraction process. The application of the MSPC model to actual production process could effectively achieve on-line monitoring for extraction process of Schisandrae Chinensis Fructus, and can reflect the change of material properties in the production process in real time. This established process monitoring method could provide reference for the application of process analysis technology in the process quality control of traditional Chinese medicine injections. Copyright© by the Chinese Pharmaceutical Association.

  12. A Scalable Gaussian Process Analysis Algorithm for Biomass Monitoring

    Energy Technology Data Exchange (ETDEWEB)

    Chandola, Varun [ORNL; Vatsavai, Raju [ORNL

    2011-01-01

    Biomass monitoring is vital for studying the carbon cycle of earth's ecosystem and has several significant implications, especially in the context of understanding climate change and its impacts. Recently, several change detection methods have been proposed to identify land cover changes in temporal profiles (time series) of vegetation collected using remote sensing instruments, but do not satisfy one or both of the two requirements of the biomass monitoring problem, i.e., {\\em operating in online mode} and {\\em handling periodic time series}. In this paper, we adapt Gaussian process regression to detect changes in such time series in an online fashion. While Gaussian process (GP) have been widely used as a kernel based learning method for regression and classification, their applicability to massive spatio-temporal data sets, such as remote sensing data, has been limited owing to the high computational costs involved. We focus on addressing the scalability issues associated with the proposed GP based change detection algorithm. This paper makes several significant contributions. First, we propose a GP based online time series change detection algorithm and demonstrate its effectiveness in detecting different types of changes in {\\em Normalized Difference Vegetation Index} (NDVI) data obtained from a study area in Iowa, USA. Second, we propose an efficient Toeplitz matrix based solution which significantly improves the computational complexity and memory requirements of the proposed GP based method. Specifically, the proposed solution can analyze a time series of length $t$ in $O(t^2)$ time while maintaining a $O(t)$ memory footprint, compared to the $O(t^3)$ time and $O(t^2)$ memory requirement of standard matrix manipulation based methods. Third, we describe a parallel version of the proposed solution which can be used to simultaneously analyze a large number of time series. We study three different parallel implementations: using threads, MPI, and a

  13. Advanced modelling, monitoring, and process control of bioconversion systems

    Science.gov (United States)

    Schmitt, Elliott C.

    Production of fuels and chemicals from lignocellulosic biomass is an increasingly important area of research and industrialization throughout the world. In order to be competitive with fossil-based fuels and chemicals, maintaining cost-effectiveness is critical. Advanced process control (APC) and optimization methods could significantly reduce operating costs in the biorefining industry. Two reasons APC has previously proven challenging to implement for bioprocesses include: lack of suitable online sensor technology of key system components, and strongly nonlinear first principal models required to predict bioconversion behavior. To overcome these challenges batch fermentations with the acetogen Moorella thermoacetica were monitored with Raman spectroscopy for the conversion of real lignocellulosic hydrolysates and a kinetic model for the conversion of synthetic sugars was developed. Raman spectroscopy was shown to be effective in monitoring the fermentation of sugarcane bagasse and sugarcane straw hydrolysate, where univariate models predicted acetate concentrations with a root mean square error of prediction (RMSEP) of 1.9 and 1.0 g L-1 for bagasse and straw, respectively. Multivariate partial least squares (PLS) models were employed to predict acetate, xylose, glucose, and total sugar concentrations for both hydrolysate fermentations. The PLS models were more robust than univariate models, and yielded a percent error of approximately 5% for both sugarcane bagasse and sugarcane straw. In addition, a screening technique was discussed for improving Raman spectra of hydrolysate samples prior to collecting fermentation data. Furthermore, a mechanistic model was developed to predict batch fermentation of synthetic glucose, xylose, and a mixture of the two sugars to acetate. The models accurately described the bioconversion process with an RMSEP of approximately 1 g L-1 for each model and provided insights into how kinetic parameters changed during dual substrate

  14. Attitudes of Austrian Psychotherapists Towards Process and Outcome Monitoring.

    Science.gov (United States)

    Kaiser, Tim; Schmutzhart, Lisa; Laireiter, Anton-Rupert

    2018-03-08

    While monitoring systems in psychotherapy have become more common, little is known about the attitudes that mental health practitioners have towards these systems. In an online survey among 111 Austrian psychotherapists and trainees, attitudes towards therapy monitoring were measured. A well-validated questionnaire measuring attitudes towards outcome monitoring, the Outcome Measurement Questionnaire, was used. Clinicians' theoretical orientations as well as previous knowledge and experience with monitoring systems were associated with positive attitudes towards monitoring. Possible factors that may have led to these findings, like the views of different theoretical orientations or obstacles in Austrian public health care, are discussed.

  15. Horizon shells and BMS-like soldering transformations

    Energy Technology Data Exchange (ETDEWEB)

    Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)

    2016-03-07

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  16. Effects of PCB thickness on adjustable fountain wave soldering

    Indian Academy of Sciences (India)

    hybrid circuit assembly, component lead tinning, and wire tinning. .... The mesh model was built and optimized with 599920 hybrid nodes as shown in figure 9. ... conducted to track the fluid motions of the two phases (i.e., molten solder and air).

  17. Aging effects on the microstructure, surface characteristics and wettability of Cu pretinned with Sn-Pb solders

    Energy Technology Data Exchange (ETDEWEB)

    Linch, Heidi Sue [Univ. of California, Berkeley, CA (United States)

    1993-11-01

    This study investigates effects of aging in air and argon at 170 C on Cu coupons which were pretinned with 75Sn-25Pb, 8Sn-92Pb, and 5Sn-95Pb solders. Coatings were applied using electroplating or hot dipping techniques. The coating thickness was controlled between 3 to 3μm and the specimens were aged for 0 hours, 2 hours, 24 hours and 2 weeks. Wetting balance tests were used to evaluate the wettability of the test specimens. Microstructural development was evaluated using X-ray diffraction, energy dispersive X-ray and Auger spectroscopy, as well as optical and scanning electron microscopy. The wetting behavior of the test specimens is interpreted with respect to observed microstructural changes and as a function of aging time, solder composition, and processing conditions.

  18. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Directory of Open Access Journals (Sweden)

    Yee Mei Leong

    2016-06-01

    Full Text Available Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag content solder SAC105 (Sn-1.0Ag-0.5Cu because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al addition (0.1–0.5 wt.% to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

  19. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Science.gov (United States)

    Leong, Yee Mei; Haseeb, A.S.M.A.

    2016-01-01

    Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

  20. Modeling Wireless Sensor Networks for Monitoring in Biological Processes

    DEFF Research Database (Denmark)

    Nadimi, Esmaeil

    parameters, as the use of wired sensors is impractical. In this thesis, a ZigBee based wireless sensor network was employed and only a part of the herd was monitored, as monitoring each individual animal in a large herd under practical conditions is inefficient. Investigations to show that the monitored...... (MMAE) approach to the data resulted in the highest classification success rate, due to the use of precise forth-order mathematical models which relate the feed offer to the pitch angle of the neck. This thesis shows that wireless sensor networks can be successfully employed to monitor the behavior...

  1. Process, product, and waste-stream monitoring with fiber optics

    International Nuclear Information System (INIS)

    Milanovich, F.P.; Hirschfeld, T.

    1983-07-01

    Fiber optic technology, motivated by communications and defense applications, has advanced significantly the past ten years. In particular, advances have been made in visible radiation transmission efficiency with concurrent reductions in fiber size, weight, and cost. Researchers at the Lawrence Livermore National Laboratory (LLNL) coupled these advances in fiber optic technology with analytical fluorescence analysis to establish a new technology - remote fiber fluorimetry (RFF). Laser-based RFF offers the potential to measure and monitor from one central and remote laboratory, on-line, and in near real time, trace (ppM) to substantial (g/L) concentrations of selected chemical species in typical process, product, and waste streams. The fluorimeter consists of a fluorescence or Raman spectrometer; unique coupling optics that separates input excitation (laser) radiation from return (fluorescence) radiation; a fiber optic cable; and an optrode - a terminal that interfaces the fiber to the measurement point, which is designed to respond quantitatively to a particular chemical species. At LLNL, research is underway into optrodes that measure pressure, temperature, and pH and those that detect and quantify various actinides, sulfates, inorganic chloride, hydrogen sulfide, aldehydes, and alcohols

  2. Contributions to process monitoring by laser-induced breakdown spectroscopy

    Science.gov (United States)

    Rusak, David Alexander

    1998-12-01

    When a pulsed laser of sufficient energy and pulse duration is brought to a focus, multi-photon ionization creates free electrons in the focal volume. These electrons are accelerated in a process known as inverse Bremsstrahlung and cause collisional ionization of species in the focal volume. More charge carriers are produced and the process continues for the duration of the laser pulse. The manifestation of this process is a visible spark or plasma which typically lasts for tens of microseconds. This laser-induced plasma can serve as a source in an atomic emission experiment. Because the composition of the plasma is determined in large part by the environment in which it forms, elements in the laser target can be determined spectroscopically. The goal of a laser-induced breakdown spectroscopy (LIBS) experiment is to establish a relationship between the concentration of an element of interest in the target and the intensity of light emitted from the laser-induced plasma at a wavelength characteristic of that element. Because LIBS requires only optical access to the sample and can perform elemental determinations in solids, liquids, or gases with little sample preparation, there is interest in using it as an on-line technique for process monitoring in a number of industrial applications. However, before the technique becomes useful in industrial applications, many issues regarding instrumentation and data analysis need to be addressed in the lab. The first two chapters of this dissertation provide, respectively, the basics of the atomic emission experiment and a background of laser-induced breakdown spectroscopy. The next two chapters examine the effect of target water content on the laser-induced plasma and the use of LIBS for analysis of aqueous samples. Chapter 5 describes construction of a fiber optic LIBS probe and its use to study temporal electron number density evolution in plasmas formed on different metals. Chapter 6 is a study of excitation, vibrational

  3. Effects of soldering methods on tensile strength of a gold-palladium metal ceramic alloy.

    Science.gov (United States)

    Ghadhanfari, Husain A; Khajah, Hasan M; Monaco, Edward A; Kim, Hyeongil

    2014-10-01

    The tensile strength obtained by conventional postceramic application soldering and laser postceramic welding may require more energy than microwave postceramic soldering, which could provide similar tensile strength values. The purpose of the study was to compare the tensile strength obtained by microwave postceramic soldering, conventional postceramic soldering, and laser postceramic welding. A gold-palladium metal ceramic alloy and gold-based solder were used in this study. Twenty-seven wax specimens were cast in gold-palladium noble metal and divided into 4 groups: laser welding with a specific postfiller noble metal, microwave soldering with a postceramic solder, conventional soldering with the same postceramic solder used in the microwave soldering group, and a nonsectioned control group. All the specimens were heat treated to simulate a normal porcelain sintering sequence. An Instron Universal Testing Machine was used to measure the tensile strength for the 4 groups. The means were analyzed statistically with 1-way ANOVA. The surface and fracture sites of the specimens were subjectively evaluated for fracture type and porosities by using a scanning electron microscope. The mean (standard deviation) ultimate tensile strength values were as follows: nonsectioned control 818 ±30 MPa, microwave 516 ±34 MPa, conventional 454 ±37 MPa, and laser weld 191 ±39 MPa. A 1-way ANOVA showed a significant difference in ultimate tensile strength among the groups (F3,23=334.5; Ptensile strength for gold and palladium noble metals than either conventional soldering or laser welding. Conventional soldering resulted in a higher tensile strength than laser welding. Under the experimental conditions described, either microwave or conventional postceramic soldering would appear to satisfy clinical requirements related to tensile strength. Copyright © 2014 Editorial Council for the Journal of Prosthetic Dentistry. Published by Elsevier Inc. All rights reserved.

  4. Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

    Science.gov (United States)

    Haseeb, A. S. M. A.; Arafat, M. M.; Tay, S. L.; Leong, Y. M.

    2017-10-01

    Tin (Sn)-based solders have established themselves as the main alternative to the traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn-based solders continues to be a concern. In order to make Sn-based solders microstructurally more stable and hence more reliable, researchers are showing great interest in investigating the effects of the incorporation of different nanoparticles into them. This paper gives an overview of the influence of metallic nanoparticles on the characteristics of interfacial intermetallic compounds (IMCs) in Sn-based solder joints on copper substrates during reflow and thermal aging. Nanocomposite solders were prepared by mechanically blending nanoparticles of nickel (Ni), cobalt (Co), zinc (Zn), molybdenum (Mo), manganese (Mn) and titanium (Ti) with Sn-3.8Ag-0.7Cu and Sn-3.5Ag solder pastes. The composite solders were then reflowed and their wetting characteristics and interfacial microstructural evolution were investigated. Through the paste mixing route, Ni, Co, Zn and Mo nanoparticles alter the morphology and thickness of the IMCs in beneficial ways for the performance of solder joints. The thickness of Cu3Sn IMC is decreased with the addition of Ni, Co and Zn nanoparticles. The thickness of total IMC layer is decreased with the addition of Zn and Mo nanoparticles in the solder. The metallic nanoparticles can be divided into two groups. Ni, Co, and Zn nanoparticles undergo reactive dissolution during solder reflow, causing in situ alloying and therefore offering an alternative route of alloy additions to solders. Mo nanoparticles remain intact during reflow and impart their influence as discrete particles. Mechanisms of interactions between different types of metallic nanoparticles and solder are discussed.

  5. Economical surface treatment of die casting dies to prevent soldering in high pressure casting

    International Nuclear Information System (INIS)

    Fraser, D.T.; Jahedi, M.Z.

    2001-01-01

    This paper describes the use of a gas oxidation treatment of H13 tool steel to develop a compact iron oxide layer at the surface of core pins to prevent soldering in high pressure die casting. The performance of oxide layers in the protection of die steel against soldering during high pressure die casting was tested in a specially designed die using removable core pins and Al-11 Si-3 Cu casting alloy. The gas oxidation treatment can be applied at low temperatures and to large areas of the die surface. In addition this process is very cost effective compared to other coating processes such as physical vapour deposition (PVD), or thermo-reactive diffusion (TRD) coatings. This work demonstrated that surface treatment producing pure magnetite (Fe 3 O 4 ) layers are more protective than oxide layers containing a combination of Fe 3 O 4 (magnetite) and Fe 3 O 3 (haematite). The magnetite layer acts as a barrier between the die steel/casting alloy interface and prevents the formation of inter-metallic phases. Optical microscopy and scanning electron microscope were used to determine the thickness of the oxide layer, while X-ray diffraction was performed to determine the oxide phase structure

  6. THEORETICAL AND PRACTICAL ASPECTS OF MONITORING OF REGION’S SOCIO-ECONOMIC DEVELOPMENT PROCESSES:

    Directory of Open Access Journals (Sweden)

    Valentyna Yakubiv

    2017-03-01

    Full Text Available The article defines the nature of socio-economic development processes monitoring in a region on the basis of systematization of scientific works on economics. The terms of monitoring introduction into the processes of socio-economic development of a region are defined. The difference between monitoring and standard statistic technology is explained. The fact that socio-economic processes monitoring is primarily directed at collection, examination and preparation of information for making and analyzing of economic decisions at different management levels is proved. The indicators by the direction “renewable energy and energy efficiency”, which are evaluated in the process of monitoring, are outlined. Major tasks of monitoring are defined and principles of its information basis forming are determined. Key words: decentralization, information basis, renewable energy, monitoring, region, development, socio-economic processes.

  7. Fissile material holdup monitoring in the PREPP [Process Experimental Pilot Plant] process

    International Nuclear Information System (INIS)

    Becker, G.K.; Pawelko, R.J.

    1989-01-01

    The Process Experimental Pilot Plant (PREPP) is an incineration system designed to thermally process mixed transuranic (TRU) waste and TRU contaminated low-level waste. The TRU isotopic composition is that of weapons grade plutonium (Pu) which necessitates that criticality prevention measures by incorporated into the plant design and operation. Criticality safety in the PREPP process is assured through the utilization of mass and moderation control in conjunction with favorable vessel geometries. The subject of this paper concerns the Pu mass holdup instrumentation system which is an integral part of the inprocess mass control strategy. Plant vessels and components requiring real-time mass holdup measurements were selected based on their evaluated potential for achieving physically credible Pu mass loadings and associated parameters which could lead to a criticality event. If the parameters requisite to a criticality occurrence could not physically be achieved under credible plant conditions, the particular location only required periodic portable holdup monitoring. Based on these analyses five real-time holdup monitoring locations were identified for criticality assurance purposes. An additional real-time instrument is part of the system but serves primarily in the capacity of providing operational support data. 1 fig

  8. Electrochemical Behavior of Sn-9Zn- xTi Lead-Free Solders in Neutral 0.5M NaCl Solution

    Science.gov (United States)

    Wang, Zhenghong; Chen, Chuantong; Jiu, Jinting; Nagao, Shijo; Nogi, Masaya; Koga, Hirotaka; Zhang, Hao; Zhang, Gong; Suganuma, Katsuaki

    2018-05-01

    Electrochemical techniques were employed to study the electrochemical corrosion behavior of Sn-9Zn- xTi ( x = 0, 0.05, 0.1, 0.2 wt.%) lead-free solders in neutral 0.5M NaCl solution, aiming to figure out the effect of Ti content on the corrosion properties of Sn-9Zn, providing information for the composition design of Sn-Zn-based lead-free solders from the perspective of corrosion. EIS results reveal that Ti addition was involved in the corrosion product layer and changed electrochemical interface behavior from charge transfer control process to diffusion control process. The trace amount of Ti addition (0.05 wt.%) can refine the microstructure and improve the corrosion resistance of Sn-9Zn solder, evidenced by much lower corrosion current density ( i corr) and much higher total resistance ( R t). Excess Ti addition (over 0.1 wt.%) led to the formation of Ti-containing IMCs, which were confirmed as Sn3Ti2 and Sn5Ti6, deteriorating the corrosion resistance of Sn-9Zn- xTi solders. The main corrosion products were confirmed as Sn3O(OH)2Cl2 mixed with small amount of chlorine/oxide Sn compounds.

  9. Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

    Directory of Open Access Journals (Sweden)

    Jinhua Mi

    2014-01-01

    Full Text Available Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated. The type-I interval censored lifetime data were collected from a thermal cycling test, which was implemented on microelectronic packaging with lead-free ball grid array (BGA and fine-pitch ball grid array (FBGA interconnection structures. The number of cycles to failure of lead-free solder joints is predicted by using a modified Engelmaier fatigue life model and a type-I censored data processing method. Then, the Pan model is employed to calculate the acceleration factor of this test. A comparison of life predictions between the proposed method and the ones calculated directly by Matlab and Minitab is conducted to demonstrate the practicability and effectiveness of the proposed method. At last, failure analysis and microstructure evolution of lead-free solders are carried out to provide useful guidance for the regular maintenance, replacement of substructure, and subsequent processing of electronic products.

  10. New Coating Technique of Ceramic Implants with Different Glass Solder Matrices for Improved Osseointegration-Mechanical Investigations.

    Science.gov (United States)

    Mick, Enrico; Markhoff, Jana; Mitrovic, Aurica; Jonitz, Anika; Bader, Rainer

    2013-09-11

    Ceramics are a very popular material in dental implant technology due to their tribological properties, their biocompatibility and their esthetic appearance. However, their natural surface structure lacks the ability of proper osseointegration, which constitutes a crucial process for the stability and, thus, the functionality of a bone implant. We investigated the application of a glass solder matrix in three configurations-consisting mainly of SiO₂, Al₂O₃, K₂O and Na₂O to TZP-A ceramic specimens. The corresponding adhesive strength and surface roughness of the coatings on ceramic specimens have been analyzed. Thereby, high adhesive strength (70.3 ± 7.9 MPa) was found for the three different coatings. The obtained roughness (R z ) amounted to 18.24 ± 2.48 µm in average, with significant differences between the glass solder configurations. Furthermore, one configuration was also tested after additional etching which did not lead to significant increase of surface roughness (19.37 ± 1.04 µm) or adhesive strength (57.2 ± 5.8 MPa). In conclusion, coating with glass solder matrix seems to be a promising surface modification technique that may enable direct insertion of ceramic implants in dental and orthopaedic surgery.

  11. New Coating Technique of Ceramic Implants with Different Glass Solder Matrices for Improved Osseointegration-Mechanical Investigations

    Directory of Open Access Journals (Sweden)

    Rainer Bader

    2013-09-01

    Full Text Available Ceramics are a very popular material in dental implant technology due to their tribological properties, their biocompatibility and their esthetic appearance. However, their natural surface structure lacks the ability of proper osseointegration, which constitutes a crucial process for the stability and, thus, the functionality of a bone implant. We investigated the application of a glass solder matrix in three configurations—consisting mainly of SiO2, Al2O3, K2O and Na2O to TZP-A ceramic specimens. The corresponding adhesive strength and surface roughness of the coatings on ceramic specimens have been analyzed. Thereby, high adhesive strength (70.3 ± 7.9 MPa was found for the three different coatings. The obtained roughness (Rz amounted to 18.24 ± 2.48 µm in average, with significant differences between the glass solder configurations. Furthermore, one configuration was also tested after additional etching which did not lead to significant increase of surface roughness (19.37 ± 1.04 µm or adhesive strength (57.2 ± 5.8 MPa. In conclusion, coating with glass solder matrix seems to be a promising surface modification technique that may enable direct insertion of ceramic implants in dental and orthopaedic surgery.

  12. Process related contaminations causing climatic reliability issues

    DEFF Research Database (Denmark)

    Jellesen, Morten Stendahl; Dutta, Mondira; Verdingovas, Vadimas

    2012-01-01

    contaminants during the wave and re-flow soldering process; however variation in temperature on the PCBA surface during soldering can result in considerable amounts of active residues being left locally. Typical no-clean flux systems used today consist of weak organic acids (WOA) and active residues left...

  13. Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

    DEFF Research Database (Denmark)

    Sopousek, J.; Palcut, Marián; Hodúlová, Erika

    2010-01-01

    The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching...... to room temperature. The samples were analyzed by scanning electron microscopy/energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry...

  14. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    Science.gov (United States)

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

    2010-09-15

    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  15. A KPI-based process monitoring and fault detection framework for large-scale processes.

    Science.gov (United States)

    Zhang, Kai; Shardt, Yuri A W; Chen, Zhiwen; Yang, Xu; Ding, Steven X; Peng, Kaixiang

    2017-05-01

    Large-scale processes, consisting of multiple interconnected subprocesses, are commonly encountered in industrial systems, whose performance needs to be determined. A common approach to this problem is to use a key performance indicator (KPI)-based approach. However, the different KPI-based approaches are not developed with a coherent and consistent framework. Thus, this paper proposes a framework for KPI-based process monitoring and fault detection (PM-FD) for large-scale industrial processes, which considers the static and dynamic relationships between process and KPI variables. For the static case, a least squares-based approach is developed that provides an explicit link with least-squares regression, which gives better performance than partial least squares. For the dynamic case, using the kernel representation of each subprocess, an instrument variable is used to reduce the dynamic case to the static case. This framework is applied to the TE benchmark process and the hot strip mill rolling process. The results show that the proposed method can detect faults better than previous methods. Copyright © 2017 ISA. Published by Elsevier Ltd. All rights reserved.

  16. Signal processing for solar array monitoring, fault detection, and optimization

    CERN Document Server

    Braun, Henry; Spanias, Andreas

    2012-01-01

    Although the solar energy industry has experienced rapid growth recently, high-level management of photovoltaic (PV) arrays has remained an open problem. As sensing and monitoring technology continues to improve, there is an opportunity to deploy sensors in PV arrays in order to improve their management. In this book, we examine the potential role of sensing and monitoring technology in a PV context, focusing on the areas of fault detection, topology optimization, and performance evaluation/data visualization. First, several types of commonly occurring PV array faults are considered and detection algorithms are described. Next, the potential for dynamic optimization of an array's topology is discussed, with a focus on mitigation of fault conditions and optimization of power output under non-fault conditions. Finally, monitoring system design considerations such as type and accuracy of measurements, sampling rate, and communication protocols are considered. It is our hope that the benefits of monitoring presen...

  17. Process monitoring with optical fibers and harsh environment sensors

    International Nuclear Information System (INIS)

    Marcus, M.A.; Wang, A.

    1999-01-01

    This volume contains 35 papers presented at the symposium. Some of the topics covered are: sensors for the energy industry; sensors for materials evaluation and structural monitoring; sensors for engine industry; and other harsh environments sensors

  18. Process control and monitoring system: Thermal Power Plant Gacko

    International Nuclear Information System (INIS)

    Jeremovic, Dragan; Skoko, Maksim; Gjokanovic, Zdravko

    2004-01-01

    DCS Ovation system, manufactured by Westinghouse, USA, is described in this paper. Emphasize on concept of realization and basic characteristic in Thermal Power Plant Gacko is given in this paper. The most important, noticed by now, comparative effects and performances of new monitoring and control system according to classical monitoring and control system of 300 MW units Thermal Power Plant Gacko in Gacko, are given in the conclusion. (Author)

  19. Bed occupancy monitoring: data processing and clinician user interface design.

    Science.gov (United States)

    Pouliot, Melanie; Joshi, Vilas; Goubran, Rafik; Knoefel, Frank

    2012-01-01

    Unobtrusive and continuous monitoring of patients, especially at their place of residence, is becoming a significant part of the healthcare model. A variety of sensors are being used to monitor different patient conditions. Bed occupancy monitoring provides clinicians a quantitative measure of bed entry/exit patterns and may provide information relating to sleep quality. This paper presents a bed occupancy monitoring system using a bed pressure mat sensor. A clinical trial was performed involving 8 patients to collect bed occupancy data. The trial period for each patient ranged from 5-10 weeks. This data was analyzed using a participatory design methodology incorporating clinician feedback to obtain bed occupancy parameters. The parameters extracted include the number of bed exits per night, the bed exit weekly average (including minimum and maximum), the time of day of a particular exit, and the amount of uninterrupted bed occupancy per night. The design of a clinical user interface plays a significant role in the acceptance of such patient monitoring systems by clinicians. The clinician user interface proposed in this paper was designed to be intuitive, easy to navigate and not cause information overload. An iterative design methodology was used for the interface design. The interface design is extendible to incorporate data from multiple sensors. This allows the interface to be part of a comprehensive remote patient monitoring system.

  20. Interfacial reaction of Sn-based solder joint in the package system

    Science.gov (United States)

    Gu, Huandi

    In this thesis, I report a study on the effect of the solder size on intermetallic layer formation by comparing the morphology change and growth rate of two different size solder joint aged at a same temperature for different aging time. The layer thickness and microstructure were analyzed using scanning electron microscopy (SEM). Photoshop was used to measure the thickness of intermetallic compound. Two different size of solder joints with composition of Sn-Ag-Cu (305) were used.

  1. A new method for soldering particle-reinforced aluminum metal matrix composites

    Energy Technology Data Exchange (ETDEWEB)

    Lu, Jinbin; Mu, Yunchao [Zhongyuan University of Technology, Zhengzhou 450007 (China); Luo, Xiangwei [Zhengzhou University, Zhengzhou 450002 (China); Niu, Jitai, E-mail: niujitai@163.com [Zhongyuan University of Technology, Zhengzhou 450007 (China)

    2012-12-01

    Highlights: Black-Right-Pointing-Pointer Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. Black-Right-Pointing-Pointer The nickel plating is required on the surface of the composites before soldering. Black-Right-Pointing-Pointer Low welding temperature is set to avoid overheating of the matrix. Black-Right-Pointing-Pointer Chemical and metallurgical bonding of composites and Kovar is carried out. Black-Right-Pointing-Pointer High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al-SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe-Ni-Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn-Cd-Ag-Cu) with a melting point of about 400 Degree-Sign C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)-Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al-SiC composite.

  2. A new method for soldering particle-reinforced aluminum metal matrix composites

    International Nuclear Information System (INIS)

    Lu, Jinbin; Mu, Yunchao; Luo, Xiangwei; Niu, Jitai

    2012-01-01

    Highlights: ► Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. ► The nickel plating is required on the surface of the composites before soldering. ► Low welding temperature is set to avoid overheating of the matrix. ► Chemical and metallurgical bonding of composites and Kovar is carried out. ► High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al–SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe–Ni–Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn–Cd–Ag–Cu) with a melting point of about 400 °C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)–Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al–SiC composite.

  3. Bioelectrochemical systems serve anaerobic digestion process for process monitoring and biogas upgrading

    DEFF Research Database (Denmark)

    Jin, Xiangdan

    Bioelectrochemical systems (BES), which employ microbes as catalysts to convert chemical energy stored in organic matter into sustainable electricity and high-value chemicals, is an emerging and promising technology. BES have broad applications including wastewater treatment, chemical production......, resource recovery and waste remediation. Recently, new concepts of been proposed. The purpose of this work was to optimize the AD process using BES in two aspects: developing a new volatile fatty acid (VFA) monitoring system which can be used as the AD process indicator, and for improving biogas quality...... and small external resistance were advantageous for current signal amplification. Two linear relationships between current outputs and VFA concentrations were observed. The response time was approx. 5 h and the detection range was 1 to 200 mM. The selectivity of the biosensor was demonstrated since organic...

  4. Quality Analysis of Welded and Soldered Joints of Cu-Nb Microcomposite Wires

    Directory of Open Access Journals (Sweden)

    Nikolaj VIŠNIAKOV

    2011-03-01

    Full Text Available Quality analysis of welded and soldered joints of Cu-Nb microcomposite wires has been performed. Quality and mechanical characteristics of joints as ultimate tensile stress limit and elongation at break were measured with an universal testing machine and controlled visually using an optical microscope. Two wires joints were soldered with silver and copper solders and put into steel and copper sleeve respectively. Another two wires joints were soldered with silver solder and welded without any reinforcement. Joints soldered with the silver solder and steel sleeve have demonstrated the best mechanical characteristics: ultimate tensile stress limit of 650 MPa and elongation at break of 0.85 %. Joints soldered with the copper sleeve have no advantages comparing with the soldered butt joint. Ultimate tensile stress limit and elongation at break were in 300 MPa - 350 MPa and in 0.35 % - 0.45 % ranges respectively. Two welded joints had ultimate tensile stress limit of 470 MPa and elongation at break of 0.71 %. In all joints the microstructure of Nb filaments was destroyed and mechanical properties have been specified by mechanical strength of copper and sleeve materials only.http://dx.doi.org/10.5755/j01.ms.17.1.242

  5. Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Kita, T; Mukaibo, N; Ando, K; Moriyama, M [Honda R and D Co. Ltd., Tokyo (Japan)

    1997-10-01

    Concerning the tin and lead eutectic solder, we have evaluated the reliability of three factors of intermetallic compound layer, creep and vibration which cause solder degradation. First, the stress factor was extracted from investigating the mechanism of degradation, and the best acceleration test method was fixed. Next, the acceleration test was executed to find the stress dependency and the tendency of solder degradation was modeled numerically. While the environmental stress frequency was obtained and they were put together by using a minor method, which enabled us to predict the life span of solder on the market with precision. 5 refs., 13 figs.

  6. Detection and Processing Techniques of FECG Signal for Fetal Monitoring

    Directory of Open Access Journals (Sweden)

    Hasan MA

    2009-03-01

    Full Text Available Abstract Fetal electrocardiogram (FECG signal contains potentially precise information that could assist clinicians in making more appropriate and timely decisions during labor. The ultimate reason for the interest in FECG signal analysis is in clinical diagnosis and biomedical applications. The extraction and detection of the FECG signal from composite abdominal signals with powerful and advance methodologies are becoming very important requirements in fetal monitoring. The purpose of this review paper is to illustrate the various methodologies and developed algorithms on FECG signal detection and analysis to provide efficient and effective ways of understanding the FECG signal and its nature for fetal monitoring. A comparative study has been carried out to show the performance and accuracy of various methods of FECG signal analysis for fetal monitoring. Finally, this paper further focused some of the hardware implementations using electrical signals for monitoring the fetal heart rate. This paper opens up a passage for researchers, physicians, and end users to advocate an excellent understanding of FECG signal and its analysis procedures for fetal heart rate monitoring system.

  7. The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder

    Science.gov (United States)

    Mayappan, R.; Salleh, A.; Andas, J.

    2017-09-01

    Solder has been widely used in electronic industry as interconnection for electronic packaging. European Union and Japan have restricted the use of Sn-Pb solder as it contains lead which can harmful to human health and environment. Due to this, many researches have been done in order to find a suitable replacement for the lead solder. Although many lead-free solders are available, the Sn-3.5Ag solder with the addition of graphene seem to be a suitable candidate. In this study, a 0.07 wt% graphene nanosheet was added into the Sn-3.5Ag solder and this composite solder was prepared under powder metallurgy method. The solder was reacted with copper substrate at 250 °C for one minute. For joint strength analysis, two copper strips were soldered together. The solder joint was aged at temperature 100 °C for 500 hours. Scanning Electron Microscope (SEM) was used to observe the interfacial reaction and Instron machine was used to determine the joint strength. Cu6Sn5 intermetallic layer was formed at the interface between the Cu substrate and the solders. Composite solder showed the retardation of the intermetallic growth compared to the plain solder. The thickness value of the intermetallic was used to calculate the growth rate the IMC. The graphene nanosheets added solder has lower growth rate which is 3.86 × 10-15 cm2/s compared to the plain solder 7.15 × 10-15 cm2/s. Shear strength analysis show that the composite solder has higher joint compared to the plain solder.

  8. Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement

    Energy Technology Data Exchange (ETDEWEB)

    Li, Yi, E-mail: yili64-c@my.cityu.edu.hk [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong); Luo, Kaiming; Lim, Adeline B.Y.; Chen, Zhong [School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798 (Singapore); Wu, Fengshun [School of Materials Science and Engineering, Huazhong University of Science and Technology, 1037 Luoyu Road, Wuhan (China); Chan, Y.C. [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong)

    2016-07-04

    Sn57.6Bi0.4Ag solder has been reinforced successfully through the addition of tungsten (W) nanoparticles at a concentration of 0.5 wt%. With the addition of W nanoparticles, the solder matrix lamellar interphase spacing was reduced by 31.0%. Due to the dispersion of W nanoparticles and the consequently refined microstructure, the mechanical properties of the solder alloy were enhanced, as indicated by a 6.2% improvement in the microhardness. During the reflow of solder on Au/Ni/Cu pads, the entire Au layer dissolved into the molten solder rapidly and a large number of (Au,Ni)(Sn,Bi){sub 4} particles were formed. The fracture path of the as-reflowed joint was within the solder region, showing ductile characteristic, and the shear strength was reinforced by 8.2%, due to the enhanced mechanical properties of the solder. During the subsequent aging process, the Au migrated back towards the interface and a thick layer of interfacial (Au,Ni)(Sn,Bi){sub 4} IMC was formed, leading to the shift of the fracture path to the interfacial IMC region, the transformation to brittle fracture and the deterioration of the strength of the joint, due to Au embrittlement. By adding W nanoparticles, the migration of Au was mitigated and the thickness of the (Au,Ni)(Sn,Bi){sub 4} layer was reduced significantly, which reduced the Au embrittlement-induced deterioration of the strength of the joint. During electromigration, the segregation of the Bi-rich and Sn-rich phases and the accumulation of the (Au,Ni)(Sn,Bi){sub 4} layer at cathode interface were mitigated by the addition of W nanoparticles, which improved the electromigration resistance.

  9. Optimized cross-organizational business process monitoring : design and enactment

    NARCIS (Netherlands)

    Comuzzi, M.; Vanderfeesten, I.T.P.; Wang, T.

    2013-01-01

    Organizations can implement the agility required to survive in the rapidly evolving business landscape by focusing on their core business and engaging in collaborations with other partners. This entails the need for organizations to monitor the behavior of the partners with which they collaborate.

  10. Marine pollution monitoring and coastal processes off Andhra Coast

    Digital Repository Service at National Institute of Oceanography (India)

    Sadhuram, Y.

    plants are some of them. ESSAR group is going to invest Rs.1000 crores to set up industries in this belt. In view of the above, regular monitoring of pollution concentration in the harbour and coastal waters is being done by NIO, RC, Visakhapatnam under...

  11. Processing methods for operation test data of radioactive aerosols monitor based on accumulation techniques

    International Nuclear Information System (INIS)

    Fu Cuiming; Xi Pingping; Ma Yinghao; Tan Linglong; Shen Fu

    2011-01-01

    This article introduces a radioactive aerosol continuous monitor based on accumulation sampling and measuring and three methods for processing the operation data. The monitoring results are processed by the 3 methods which are applied both under the conditions of natural background and at workplaces of a nuclear facility. How the monitoring results are assessed and how to calculate the detection limit when using the 3 different methods are explained. Moreover, the advantages and disadvantages of the 3 methods are discussed. (authors)

  12. Use of information system data of jet crushing acoustic monitoring for the process management

    Directory of Open Access Journals (Sweden)

    T.M. Bulanaya

    2012-12-01

    Full Text Available The graphic interpretation of amplitude and frequency of acoustic signals of loose material jet grinding process are resulted. Criteria of process management is determined on the basis of the acoustic monitoring data of jet mill acting.

  13. Advanced process monitoring and feedback control to enhance cell culture process production and robustness.

    Science.gov (United States)

    Zhang, An; Tsang, Valerie Liu; Moore, Brandon; Shen, Vivian; Huang, Yao-Ming; Kshirsagar, Rashmi; Ryll, Thomas

    2015-12-01

    It is a common practice in biotherapeutic manufacturing to define a fixed-volume feed strategy for nutrient feeds, based on historical cell demand. However, once the feed volumes are defined, they are inflexible to batch-to-batch variations in cell growth and physiology and can lead to inconsistent productivity and product quality. In an effort to control critical quality attributes and to apply process analytical technology (PAT), a fully automated cell culture feedback control system has been explored in three different applications. The first study illustrates that frequent monitoring and automatically controlling the complex feed based on a surrogate (glutamate) level improved protein production. More importantly, the resulting feed strategy was translated into a manufacturing-friendly manual feed strategy without impact on product quality. The second study demonstrates the improved process robustness of an automated feed strategy based on online bio-capacitance measurements for cell growth. In the third study, glucose and lactate concentrations were measured online and were used to automatically control the glucose feed, which in turn changed lactate metabolism. These studies suggest that the auto-feedback control system has the potential to significantly increase productivity and improve robustness in manufacturing, with the goal of ensuring process performance and product quality consistency. © 2015 Wiley Periodicals, Inc.

  14. Real-time risk monitoring in business processes : a sensor-based approach

    NARCIS (Netherlands)

    Conforti, R.; La Rosa, M.; Fortino, G.; Hofstede, ter A.H.M.; Recker, J.; Adams, M.

    2013-01-01

    This article proposes an approach for real-time monitoring of risks in executable business process models. The approach considers risks in all phases of the business process management lifecycle, from process design, where risks are defined on top of process models, through to process diagnosis,

  15. Online monitoring of food processes using subsurface laser scattering

    DEFF Research Database (Denmark)

    Carstensen, Jens Michael; Møller, Flemming

    Online monitoring of physical parameters during food production is not a trivial task, but promising results can often be obtained with Subsurface Laser Scattering (SLS). The first SLS instruments are on the market today, and studies are needed to asses the potential of the technology. SLS can mo...... of the SLS technology is explained, and results from yoghurt fermentation and foaming of a dairy dessert product is presented....

  16. The consideration and practice of data processing of WBS-II portal β monitor

    International Nuclear Information System (INIS)

    Du Xiangyang; Dong Qiangmin; Zhang Yong; Han Shuping; Wang Xiaodong; Fan Liya; Rao Xianming

    2001-01-01

    The main aspects of background and human body measurement data processing of WBS-II Portal β Monitor were discussed. The theory analysis of setting high and low background-warning threshold in data processing was done. The relative reference values were partly provided to the local executives. The measurement 'blind zone' and the whole warning function of data processing were discussed. And the structure, the process of monitoring and the microcomputer's hard wares of WBS-II Portal β Monitor were simply introduced

  17. Elektronische monitoring van luchtwassers op veehouderijbedrijven = Automated process monitoring and data logging of air scrubbers at animal houses

    NARCIS (Netherlands)

    Melse, R.W.; Franssen, J.C.T.J.

    2010-01-01

    At 6 animal houses air scrubbers equipped with an automated process monitoring and data logging system were tested. The measured values were successfully stored but the measured values, especially the pH and EC of the recirculation water, appeared not to be correct at all times.

  18. Microstructure and mechanical properties of Sn-9Zn-xAl{sub 2}O{sub 3} nanoparticles (x=0–1) lead-free solder alloy: First-principles calculation and experimental research

    Energy Technology Data Exchange (ETDEWEB)

    Xing, Wen-qing; Yu, Xin-ye; Li, Heng; Ma, Le; Zuo, Wei [Taiyuan University of Technology, College of Material Science and Technology, Taiyuan 030024 (China); Dong, Peng; Wang, Wen-xian [Taiyuan University of Technology, College of Material Science and Technology, Taiyuan 030024 (China); Shanxi Key Laboratory of Advanced Magnesium-based Materials, Taiyuan 030024 (China); Key Laboratory of Interface Science and Engineering in Advanced Materials, Ministry of Education, Taiyuan University of Technology, Taiyuan 030024 (China); Ding, Min, E-mail: dingmin@tyut.edu.cn [Taiyuan University of Technology, College of Material Science and Technology, Taiyuan 030024 (China); Shanxi Key Laboratory of Advanced Magnesium-based Materials, Taiyuan 030024 (China); Key Laboratory of Interface Science and Engineering in Advanced Materials, Ministry of Education, Taiyuan University of Technology, Taiyuan 030024 (China)

    2016-12-15

    This paper studies microstructure and mechanical properties of Sn-9Zn-x Al{sub 2}O{sub 3} nanoparticles (x=0–1) lead-free solder alloy. The interface structure, interface energy and electronic properties of Al{sub 2}O{sub 3}/Sn9Zn interface are investigated by first-principle calculation. On the experimental part, in comparison with the plain Sn-9Zn solder, the Al{sub 2}O{sub 3} nanoparticles incorporated into the solder matrix can inhibit the growth of coarse dendrite Sn-Zn eutectic structure and refine grains of the composite solders during the solidification process of the alloys. Moreover, the microhardness and average tensile strength of the solders with addition of Al{sub 2}O{sub 3} nanoparticles increased with the increasing weight percentages of Al{sub 2}O{sub 3} nanoparticles. These improved mechanical properties can be attributed to the microstructure developments and the dispersed Al{sub 2}O{sub 3} nanoparticles.

  19. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

  20. Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

    Science.gov (United States)

    Sorg, Brian S.; Welch, Ashley J.

    2001-05-01

    Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

  1. Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Andersson, D.; Hoo, N.; Pearce, J.; Watson, A.; Dinsdale, A.; Mucklejohn, S.

    2012-01-01

    Roč. 21, č. 5 (2012), s. 629-637 ISSN 1059-9495 Institutional support: RVO:68081723 Keywords : lead-free soldering, * materials for high-temperature LF * new technologies for HT lead-free soldering Subject RIV: BJ - Thermodynamics Impact factor: 0.915, year: 2012

  2. Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

    Science.gov (United States)

    Lin, Jian; Lei, Yongping; Fu, Hanguang; Guo, Fu

    2018-03-01

    In surface mount technology, the Sn-3.0Ag-0.5Cu solder joint has a shorter impact lifetime than a traditional lead-tin solder joint. In order to improve the impact property of SnAgCu lead-free solder joints and identify the effect of silver content on tensile strength and impact property, impact experiments were conducted at various strain rates on three selected SnAgCu based solder joints. It was found that joint failure mainly occurred in the solder material with large plastic deformation under low strain rate, while joint failure occurred at the brittle intermetallic compound layer without any plastic deformation at a high strain rate. Joint strength increased with the silver content in SnAgCu alloys in static tensile tests, while the impact property of the solder joint decreased with increasing silver content. When the strain rate was low, plastic deformation occurred with failure and the tensile strength of the Sn-3.0Ag-0.5Cu solder joint was higher than that of Sn-0.3Ag-0.7Cu; when the strain rate was high, joint failure mainly occurred at the brittle interface layer and the Sn-0.3Ag-0.7Cu solder joint had a better impact resistance with a thinner intermetallic compound layer.

  3. Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

    Science.gov (United States)

    Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S

    2015-08-01

    The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding.

  4. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

    Science.gov (United States)

    Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu

    2017-08-01

    Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

  5. Corrosion Reliability of Lead-free Solder Systems Used in Electronics

    DEFF Research Database (Denmark)

    Li, Feng; Verdingovas, Vadimas; Medgyes, Balint

    2017-01-01

    humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods...

  6. Reliability and microstructure of lead-free solder joints in industrial electronics after accelerated thermal aging

    NARCIS (Netherlands)

    Scaltro, F.; Biglari, M.H.; Kodentsov, A.; Yakovleva, O.; Brom, E.

    2009-01-01

    The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface component/solder together with the formation of fractures. The evolution, the morphology and the elemental

  7. Investigation of moisture uptake into printed circuit board laminate and solder mask materials

    DEFF Research Database (Denmark)

    Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti

    2017-01-01

    with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

  8. A guide to processing bat acoustic data for the North American Bat Monitoring Program (NABat)

    Science.gov (United States)

    Reichert, Brian; Lausen, Cori; Loeb, Susan; Weller, Ted; Allen, Ryan; Britzke, Eric; Hohoff, Tara; Siemers, Jeremy; Burkholder, Braden; Herzog, Carl; Verant, Michelle

    2018-06-14

    The North American Bat Monitoring Program (NABat) aims to improve the state of conservation science for all species of bats shared by the United States, Canada, and Mexico. To accomplish this goal, NABat offers guidance and standardized protocols for acoustic monitoring of bats. In this document, “A Guide to Processing Bat Acoustic Data for the North American Bat Monitoring Program (NABat),” we provide general recommendations and specific workflows for the process of identifying bat species from acoustic files recorded using the NABat stationary point and mobile transect acoustic monitoring protocols.

  9. Laser weld process monitoring and control using chromatic filtering of thermal radiation from a weld pool

    International Nuclear Information System (INIS)

    Kim, Cheol Jung; Kim, Min Suk; Baik, Sung Hoon; Chung, Chin Man

    2000-06-01

    The application of high power Nd: YAG lasers for precision welding in industry has been growing quite fast these days in diverse areas such as the automobile, the electronics and the aerospace industries. These diverse applications also require the new developments for the precise control and the reliable process monitoring. Due to the hostile environment in laser welding, a remote monitoring is required. The present development relates in general to weld process monitoring techniques, and more particularly to improved methods and apparatus for real-time monitoring of thermal radiation of a weld pool to monitor a size variation and a focus shift of the weld pool for weld process control, utilizing the chromatic aberration of focusing lens or lenses. The monitoring technique of the size variation and the focus shift of a weld pool is developed by using the chromatic filtering of the thermal radiation from a weld pool. The monitoring of weld pool size variation can also be used to monitor the weld depth in a laser welding. Furthermore, the monitoring of the size variation of a weld pool is independent of the focus shift of a weld pool and the monitoring of the focus shift of a weld pool is independent of the size variation of a weld pool

  10. Laser weld process monitoring and control using chromatic filtering of thermal radiation from a weld pool

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Cheol Jung; Kim, Min Suk; Baik, Sung Hoon; Chung, Chin Man

    2000-06-01

    The application of high power Nd: YAG lasers for precision welding in industry has been growing quite fast these days in diverse areas such as the automobile, the electronics and the aerospace industries. These diverse applications also require the new developments for the precise control and the reliable process monitoring. Due to the hostile environment in laser welding, a remote monitoring is required. The present development relates in general to weld process monitoring techniques, and more particularly to improved methods and apparatus for real-time monitoring of thermal radiation of a weld pool to monitor a size variation and a focus shift of the weld pool for weld process control, utilizing the chromatic aberration of focusing lens or lenses. The monitoring technique of the size variation and the focus shift of a weld pool is developed by using the chromatic filtering of the thermal radiation from a weld pool. The monitoring of weld pool size variation can also be used to monitor the weld depth in a laser welding. Furthermore, the monitoring of the size variation of a weld pool is independent of the focus shift of a weld pool and the monitoring of the focus shift of a weld pool is independent of the size variation of a weld pool.

  11. A software tool for design of process monitoring and analysis systems

    DEFF Research Database (Denmark)

    Singh, Ravendra; Gernaey, Krist; Gani, Rafiqul

    2009-01-01

    A well designed process monitoring and analysis system is necessary to consistently achieve any predefined end product quality. Systematic computer aided methods and tools provide the means to design the necessary process monitoring and analysis systems and/or to validate any existing monitoring...... and analysis system. A software to achieve this has been developed. Two developed supporting tools for the design, a knowledge base (consisting of the process knowledge as well as the knowledge on measurement methods & tools) and a model library (consisting of the process operational models) have been extended...... rigorously and integrated with the user interface, which made the software more generic and applicable to a wide range of problems. The software for the design of a process monitoring and analysis system is presented and illustrated with a tablet manufacturing process example....

  12. Imaging for monitoring downstream processing of fermentation broths

    DEFF Research Database (Denmark)

    Moiseyenko, Rayisa; Baum, Andreas; Jørgensen, Thomas Martini

    In relation to downstream processing of a fermentation broth coagulation/flocculation is a typical pretreatment method for separating undesirable particles/impurities from the wanted product. In the coagulation process the negatively charged impurities are destabilized by adding of a clarifying...

  13. Associating Assertions with Business Processes and Monitoring their Execution

    NARCIS (Netherlands)

    Lazovik, Alexander; Aiello, Marco; Papazoglou, Mike

    2004-01-01

    Business processes that span organizational borders describe the interaction between multiple parties working towards a common objective. They also express business rules that govern the behavior of the process and account for expressing changes reflecting new business objectives and new market

  14. Digital processing method for monitoring the radioactivity of stack releases

    International Nuclear Information System (INIS)

    Vialettes, H.; Leblanc, P.; Perotin, J.P.; Lazou, J.P.

    1978-01-01

    The digital processing method proposed is adapted for data supplied by a fixed-filter detector normally used for analogue processing (integrator system). On the basis of the raw data (pulses) from the detector, the technique makes it possible to determine the rate of activity released whereas analogue processing gives only the released activity. Furthermore, the method can be used to develop alarm systems on the basis of a possible exposure rate at the point of fall-out, and by including in the program a coefficient which allows for atmospheric diffusion conditions at any given time one can improve the accuracy of the results. In order to test the digital processing method and demonstrate its advantages over analogue processing, various atmospheric contamination situations were simulated in a glove-box and analysed simultaneously, using both systems, from the pulses transmitted by the same sampling and fixed-filter detection unit. The experimental results confirm the advantages foreseen in the theoretical research. (author)

  15. Harvesting Social Signals to Inform Peace Processes Implementation and Monitoring.

    Science.gov (United States)

    Nigam, Aastha; Dambanemuya, Henry K; Joshi, Madhav; Chawla, Nitesh V

    2017-12-01

    Peace processes are complex, protracted, and contentious involving significant bargaining and compromising among various societal and political stakeholders. In civil war terminations, it is pertinent to measure the pulse of the nation to ensure that the peace process is responsive to citizens' concerns. Social media yields tremendous power as a tool for dialogue, debate, organization, and mobilization, thereby adding more complexity to the peace process. Using Colombia's final peace agreement and national referendum as a case study, we investigate the influence of two important indicators: intergroup polarization and public sentiment toward the peace process. We present a detailed linguistic analysis to detect intergroup polarization and a predictive model that leverages Tweet structure, content, and user-based features to predict public sentiment toward the Colombian peace process. We demonstrate that had proaccord stakeholders leveraged public opinion from social media, the outcome of the Colombian referendum could have been different.

  16. Properties and Microstructures of Sn-Bi-X Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Fan Yang

    2016-01-01

    Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

  17. Infinite-Dimensional Observer for Process Monitoring in Managed Pressure Drilling

    OpenAIRE

    Hasan, Agus Ismail

    2015-01-01

    Utilizing flow rate and pressure data in and out of the mud circulation loop provides a driller with real-time trends for the early detection of well-control problems that impact the drilling efficiency. This paper presents state estimation for infinite-dimensional systems used in the process monitoring of oil well drilling. The objective is to monitor the key process variables associated with process safety by designing a model-based nonlinear observer that directly utilizes the available in...

  18. Acoustic emission-based in-process monitoring of surface generation in robot-assisted polishing

    DEFF Research Database (Denmark)

    Pilny, Lukas; Bissacco, Giuliano; De Chiffre, Leonardo

    2016-01-01

    The applicability of acoustic emission (AE) measurements for in-process monitoring of surface generation in the robot-assisted polishing (RAP) was investigated. Surface roughness measurements require interruption of the process, proper surface cleaning and measurements that sometimes necessitate...... automatic detection of optimal process endpoint allow intelligent process control, creating fundamental elements in development of robust fully automated RAP process for its widespread industrial application....... removal of the part from the machine tool. In this study, stabilisation of surface roughness during polishing rotational symmetric surfaces by the RAP process was monitored by AE measurements. An AE sensor was placed on a polishing arm in direct contact with a bonded abrasive polishing tool...

  19. Evaluating Acoustic Emission Signals as an in situ process monitoring technique for Selective Laser Melting (SLM)

    Energy Technology Data Exchange (ETDEWEB)

    Fisher, Karl A. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Candy, Jim V. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Guss, Gabe [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Mathews, M. J. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

    2016-10-14

    In situ real-time monitoring of the Selective Laser Melting (SLM) process has significant implications for the AM community. The ability to adjust the SLM process parameters during a build (in real-time) can save time, money and eliminate expensive material waste. Having a feedback loop in the process would allow the system to potentially ‘fix’ problem regions before a next powder layer is added. In this study we have investigated acoustic emission (AE) phenomena generated during the SLM process, and evaluated the results in terms of a single process parameter, of an in situ process monitoring technique.

  20. A high-sensitive and quantitative in-line monitoring method for transplutonium elements separation processes

    International Nuclear Information System (INIS)

    Zhu Rongbao; Wang Shiju; Xu Yingpu; Zhang Zengrui

    1986-04-01

    A high-sensitive monitoring device and a quantitative analys technigue for transplutonium elements separation processes are described. X-ray and low energy γ-ray are measured by means of a scintillation monitor with two NaI(Tl) thin crystals. The α spectra of the fluents of ion-exchange column is measured by means of Si(Au) surface barrier in-line monitor. The construction of the monitors, auxiliary electronics, investigation result for the α spectra character of thick source and the calibration method were described. The determination results for extracting process of 243 Am and 244 Cm by ion-exchange chromatography were given. The sensitivity of total adding amount for 243 Am using the 4π scintillation monitor is better than 0.1 μCi. The precision of 243 Am and 244 Cm concentration determination using Si(Au) monitor is +- 5%. The precision of the two metals contents in containers is about +- 10%

  1. Reverse inference of memory retrieval processes underlying metacognitive monitoring of learning using multivariate pattern analysis.

    Science.gov (United States)

    Stiers, Peter; Falbo, Luciana; Goulas, Alexandros; van Gog, Tamara; de Bruin, Anique

    2016-05-15

    Monitoring of learning is only accurate at some time after learning. It is thought that immediate monitoring is based on working memory, whereas later monitoring requires re-activation of stored items, yielding accurate judgements. Such interpretations are difficult to test because they require reverse inference, which presupposes specificity of brain activity for the hidden cognitive processes. We investigated whether multivariate pattern classification can provide this specificity. We used a word recall task to create single trial examples of immediate and long term retrieval and trained a learning algorithm to discriminate them. Next, participants performed a similar task involving monitoring instead of recall. The recall-trained classifier recognized the retrieval patterns underlying immediate and long term monitoring and classified delayed monitoring examples as long-term retrieval. This result demonstrates the feasibility of decoding cognitive processes, instead of their content. Copyright © 2016 Elsevier Inc. All rights reserved.

  2. Radioanalytical Chemistry for Automated Nuclear Waste Process Monitoring

    International Nuclear Information System (INIS)

    Jay W. Grate; Timothy A. DeVol

    2006-01-01

    The objectives of our research were to develop the first automated radiochemical process analyzer including sample pretreatment methodology, and to initiate work on new detection approaches, especially using modified diode detectors

  3. In-Process Monitoring of Additive Manufacturing, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — The key innovation in this project is the implementation of an Imaging Fourier Transform Spectrometer (IFTS) for in situ metal additive manufacturing process...

  4. Physical properties of lead free solders in liquid and solid state

    Energy Technology Data Exchange (ETDEWEB)

    Mhiaoui, Souad

    2007-04-17

    The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

  5. [Near infrared spectroscopy based process trajectory technology and its application in monitoring and controlling of traditional Chinese medicine manufacturing process].

    Science.gov (United States)

    Li, Wen-Long; Qu, Hai-Bin

    2016-10-01

    In this paper, the principle of NIRS (near infrared spectroscopy)-based process trajectory technology was introduced.The main steps of the technique include:① in-line collection of the processes spectra of different technics; ② unfolding of the 3-D process spectra;③ determination of the process trajectories and their normal limits;④ monitoring of the new batches with the established MSPC (multivariate statistical process control) models.Applications of the technology in the chemical and biological medicines were reviewed briefly. By a comprehensive introduction of our feasibility research on the monitoring of traditional Chinese medicine technical process using NIRS-based multivariate process trajectories, several important problems of the practical applications which need urgent solutions are proposed, and also the application prospect of the NIRS-based process trajectory technology is fully discussed and put forward in the end. Copyright© by the Chinese Pharmaceutical Association.

  6. Vision-aided Monitoring and Control of Thermal Spray, Spray Forming, and Welding Processes

    Science.gov (United States)

    Agapakis, John E.; Bolstad, Jon

    1993-01-01

    Vision is one of the most powerful forms of non-contact sensing for monitoring and control of manufacturing processes. However, processes involving an arc plasma or flame such as welding or thermal spraying pose particularly challenging problems to conventional vision sensing and processing techniques. The arc or plasma is not typically limited to a single spectral region and thus cannot be easily filtered out optically. This paper presents an innovative vision sensing system that uses intense stroboscopic illumination to overpower the arc light and produce a video image that is free of arc light or glare and dedicated image processing and analysis schemes that can enhance the video images or extract features of interest and produce quantitative process measures which can be used for process monitoring and control. Results of two SBIR programs sponsored by NASA and DOE and focusing on the application of this innovative vision sensing and processing technology to thermal spraying and welding process monitoring and control are discussed.

  7. An Approach for Impression Creep of Lead Free Microelectronic Solders

    Science.gov (United States)

    Anastasio, Onofrio A.

    2002-06-01

    Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

  8. Transected sciatic nerve repair by diode laser protein soldering.

    Science.gov (United States)

    Fekrazad, Reza; Mortezai, Omid; Pedram, MirSepehr; Kalhori, Katayoun Am; Joharchi, Khojasteh; Mansoori, Korosh; Ebrahimi, Roja; Mashhadiabbas, Fatemeh

    2017-08-01

    Despite advances in microsurgical techniques, repair of peripheral nerve injuries (PNI) is still a major challenge in regenerative medicine. The standard treatment for PNI includes suturing and anasthomosis of the transected nerve. The objective of this study was to compare neurorraphy (nerve repair) using standard suturingto diode laser protein soldering on the functional recovery of transected sciatic nerves. Thirty adult male Fischer-344 Wistar rats were randomly assigned to 3 groups: 1. The control group, no repair, 2. the standard of care suture group, and 3. The laser/protein solder group. For all three groups, the sciatic nerve was transected and the repair was done immediately. For the suture repair group, 10.0 prolene suture was used and for the laser/protein solder group a diode laser (500mW output power) in combination with bovine serum albumen and indocyanine green dye was used. Behavioral assessment by sciatic functional index was done on all rats biweekly. At 12weeks post-surgery, EMG recordings were done on all the rats and the rats were euthanized for histological evaluation of the sciatic nerves. The one-way ANOVA test was used for statistical analysis. The average time required to perform the surgery was significantly shorter for the laser-assisted nerve repair group compared to the suture group. The EMG evaluation revealed no difference between the two groups. Based on the sciatic function index the laser group was significantly better than the suture group after 12weeks (pneurorraphy using standard suturing methods. Copyright © 2017 Elsevier B.V. All rights reserved.

  9. Size effects in tin-based lead-free solder joints: Kinetics of bond formation and mechanical characteristics

    Science.gov (United States)

    Abdelhadi, Ousama Mohamed Omer

    Continuous miniaturization of microelectronic interconnects demands smaller joints with comparable microstructural and structural sizes. As the size of joints become smaller, the volume of intermetallics (IMCs) becomes comparable with the joint size. As a result, the kinetics of bond formation changes and the types and thicknesses of IMC phases that form within the constrained region of the bond varies. This dissertation focuses on investigating combination effects of process parameters and size on kinetics of bond formation, resulting microstructure and the mechanical properties of joints that are formed under structurally constrained conditions. An experiment is designed where several process parameters such as time of bonding, temperature, and pressure, and bond thickness as structural chracteristic, are varied at multiple levels. The experiment is then implemented on the process. Scanning electron microscope (SEM) is then utilized to determine the bond thickness, IMC phases and their thicknesses, and morphology of the bonds. Electron backscatter diffraction (EBSD) is used to determine the grain size in different regions, including the bulk solder, and different IMC phases. Physics-based analytical models have been developed for growth kinetics of IMC compounds and are verified using the experimental results. Nanoindentation is used to determine the mechanical behavior of IMC phases in joints in different scales. Four-point bending notched multilayer specimen and four-point bending technique were used to determine fracture toughness of the bonds containing IMCs. Analytical modeling of peeling and shear stresses and fracture toughness in tri-layer four-point bend specimen containing intermetallic layer was developed and was verified and validated using finite element simulation and experimental results. The experiment is used in conjunction with the model to calculate and verify the fracture toughness of Cu6Sn5 IMC materials. As expected two different IMC phases

  10. Portable and fixed monitoring units for tank calibrations and monitoring of process liquids

    International Nuclear Information System (INIS)

    Landat, D.A.; Hunt, B.A.

    1999-01-01

    The development work stems from safeguards support activities carried out at the JRC Ispra, Italy to the inspectorate agencies. A range of measurement equipment covering the needs of the inspector have been designed, developed and tested in both the laboratory and in nuclear facilities. The instruments comprise four units: (1) a portable pressure measurement device, (2) a volume long term monitoring device, (3) an unattended volume measurement system and (4) a level measurement unit. Utilization of the equipment has proven to give independent measurement checks and confirmation of operator's instrumentation and declarations, ensuring continuity of knowledge. (J.P.N.)

  11. Comparison of multivariate and univariate statistical process control and monitoring methods

    International Nuclear Information System (INIS)

    Leger, R.P.; Garland, WM.J.; Macgregor, J.F.

    1996-01-01

    Work in recent years has lead to the development of multivariate process monitoring schemes which use Principal Component Analysis (PCA). This research compares the performance of a univariate scheme and a multivariate PCA scheme used for monitoring a simple process with 11 measured variables. The multivariate PCA scheme was able to adequately represent the process using two principal components. This resulted in a PCA monitoring scheme which used two charts as opposed to 11 charts for the univariate scheme and therefore had distinct advantages in terms of both data representation, presentation, and fault diagnosis capabilities. (author)

  12. Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods are useful to predict damage values for solder joint in power electrical components. Based on the proposed methods it is described how to find the damage level for a given temperature loading profile....... The proposed methods are discussed for application in reliability assessment of Wind Turbine’s electrical components considering physical, model and measurement uncertainties. For further research it is proposed to evaluate damage criteria for electrical components due to the operational temperature...

  13. Pressure brazing of ceramics to metals with copper solder

    International Nuclear Information System (INIS)

    Pavlova, M.A.; Metelkin, I.I.

    1986-01-01

    The effect on the quality of joints brazed with copper of different non metallized aluminooxide dielectrics with metals and alloys of a series of technological parameters (temperature, pressure, holding, and medium) in the course of pressure brazing is investigated. It is shown that in case of brazing with kovar and nickel the character of dependences is identical, however in all cases the joints with nickel are more durable. For the ceramics - molybdenum system characterized by weak interaction with copper solder kinetic dependences have no maximum and only under holding of more than 20 min the constant strength of 150-190 MPa is attained

  14. Improved monitoring procedure for Iodine -131 in radiochemical process laboratory

    International Nuclear Information System (INIS)

    Singh, Pratap; Yadav, R.K.B.; Anilkumar, S.; Gopalakrishnan, R.K.; Chakraborty, S.

    2016-01-01

    Radiation Hazard Control Unit at Isotope wing provides radiological safety support and advises for safe processing and production of radiopharmaceuticals. Tellurium Oxide (TeO 2 ), irradiated in a nuclear reactor, is processed in a process laboratory for separating 131 I using dry distillation technique. The workplace environment is being assessed for airborne radioactivity using installed Static Air Samplers (SASs). SASs contains two filter media (glass fibre and charcoal impregnated paper) to collect airborne 131 I radioactivity and laboratory air sampled at 50 litres per minutes (lpm). Personal Air Sampler (PAS) consists of three types of filters viz. a glass fibre, charcoal impregnated paper and cartridges containing activated charcoal granules. Three combinations were studied at a sampling rate of 5 lpm

  15. Monitoring of wine aging process by electrospray ionization mass spectrometry

    Directory of Open Access Journals (Sweden)

    Alexandra Christine Helena Frankland Sawaya

    2011-09-01

    Full Text Available The characterization of wine samples by direct insertion electrospray ionization mass spectrometry (ESI-MS, without pre-treatment or chromatographic separation, in a process denominated fingerprinting, has been applied to several samples of wine produced with grapes of the Pinot noir, Merlot and Cabernet Sauvignon varieties from the state o Rio Grande do Sul, in Brazil. The ESI-MS fingerprints of the samples detected changes which occurred during the aging process in the three grape varieties. Principal Component Analysis (PCA of the negative ion mode fingerprints was used to group the samples, pinpoint the main changes in their composition, and indicate marker ions for each group of samples.

  16. PCBs with immersion tin finish - some experiences with lead-free reflow process

    Energy Technology Data Exchange (ETDEWEB)

    Bukat, K.; Koziol, G.; Sitek, J.; Borecki, J.; Hackiewicz, H. [Tele and Radio Research Inst., Warsaw (Poland); Merkle, H.; Schroeder, S. [Ormecon Chemie GmbH and Co. KG, Ammersbek (Germany); Girulska, A.; Gardela, K. [Eldos Sp. z o.o., Wroclaw (Poland)

    2004-07-01

    Substitution of lead-free solders in electronic assemblies requires changes in the conventional SnPb finishes of PCBs. The Craft project ''PRINT'' objectives respond to this challenge. Its main goal is to develop and implement the new technology of high solderability immersion tin for printed circuit boards at small and medium enterprises. The subject of the research was organic based immersion tin coating which would fulfil demands of SMT. In the paper the results of reflow soldering process on PCBs covered by Ormecon registered immersion tin finish with using lead-free solder pastes will be described. Solderability of tin coating as well as wettability of lead-free solder paste will be presented. (orig.)

  17. Optimized Enhanced Bioremediation Through 4D Geophysical Monitoring and Autonomous Data Collection, Processing and Analysis

    Science.gov (United States)

    2014-09-01

    ER-200717) Optimized Enhanced Bioremediation Through 4D Geophysical Monitoring and Autonomous Data Collection, Processing and Analysis...N/A 3. DATES COVERED - 4. TITLE AND SUBTITLE Optimized Enhanced Bioremediation Through 4D Geophysical Monitoring and Autonomous Data...8 2.1.2 The Geophysical Signatures of Bioremediation ......................................... 8 2.2 PRIOR

  18. Rapid monitoring of autolysis process of proteases by capillary electrophoresis.

    Science.gov (United States)

    Chen, Xiu-Lan; Shun, Cai-Yun; Zhang, Yu-Zhong; Gao, Pei-Ji

    2003-10-01

    A protease, MCP-01, produced by a deep-sea psychrotrophic strain of Pseudoaltermonas sp. SM9913 was purified and its autolysis reaction at 20 degrees C-50 degrees C was monitored by capillary electrophoresis. Capillary electrophoresis provides a rapid assay because the degree and state of autolysis of protease MCP-01 could be observed within 6 min. The autolysis rate increased as the temperature rose in the tested range. After 30 min incubation at 30 degrees C, 77% of MCP-01 autolyzed into peptides. However, its activity for the hydrolysis of casein was reduced by only 4%. The rate of loss of activity of MCP-01 was thus slower than that of autolysis of MCP-01 at 30 degrees C. Similar results were obtained when MCP-01 was incubated at 20 degrees C, 40 degrees C and 50 degrees C. Large peptides produced by autolysis of MCP-01 therefore still have catalytic activity. When these large peptides autolyzed further into smaller peptides, the enzyme conformation that retained its catalytic activity was destroyed and activity was lost.

  19. Fiber optic interferometry for industrial process monitoring and control applications

    Science.gov (United States)

    Marcus, Michael A.

    2002-02-01

    Over the past few years we have been developing applications for a high-resolution (sub-micron accuracy) fiber optic coupled dual Michelson interferometer-based instrument. It is being utilized in a variety of applications including monitoring liquid layer thickness uniformity on coating hoppers, film base thickness uniformity measurement, digital camera focus assessment, optical cell path length assessment and imager and wafer surface profile mapping. The instrument includes both coherent and non-coherent light sources, custom application dependent optical probes and sample interfaces, a Michelson interferometer, custom electronics, a Pentium-based PC with data acquisition cards and LabWindows CVI or LabView based application specific software. This paper describes the development evolution of this instrument platform and applications highlighting robust instrument design, hardware, software, and user interfaces development. The talk concludes with a discussion of a new high-speed instrument configuration, which can be utilized for high speed surface profiling and as an on-line web thickness gauge.

  20. Process Mediation, Execution Monitoring and Recovery for Semantic Web Services

    Czech Academy of Sciences Publication Activity Database

    Sycara, K.; Vaculín, Roman

    2008-01-01

    Roč. 31, č. 3 (2008), s. 14-18 ISSN N R&D Projects: GA ČR(CZ) GD201/05/H014; GA MŠk ME08095 Institutional research plan: CEZ:AV0Z10300504 Keywords : process mediation of semantic web services * semantic web services * OWL-S Subject RIV: IN - Informatics, Computer Science

  1. Monitoring Poisson time series using multi-process models

    DEFF Research Database (Denmark)

    Engebjerg, Malene Dahl Skov; Lundbye-Christensen, Søren; Kjær, Birgitte B.

    aspects of health resource management may also be addressed. In this paper we center on the detection of outbreaks of infectious diseases. This is achieved by a multi-process Poisson state space model taking autocorrelation and overdispersion into account, which has been applied to a data set concerning...

  2. Sampling Plans for Monitoring Quality Control Process at a Plastic ...

    African Journals Online (AJOL)

    This paper explores the problem of high quality cost at a medium –sized firm manufacturing various types and sizes of plastic container, using a real life data. In pursuance of their quality objectives, the company established a policy that dictates and expensive and time-consuming post-manufacturing process. While the ...

  3. Improved binomial charts for monitoring high-quality processes

    NARCIS (Netherlands)

    Albers, Willem/Wim

    2009-01-01

    For processes concerning attribute data with (very) small failure rate p, often negative binomial control charts are used. The decision whether to stop or continue is made each time r failures have occurred, for some r≥1. Finding the optimal r for detecting a given increase of p first requires

  4. Negative Binomial charts for monitoring high-quality processes

    NARCIS (Netherlands)

    Albers, Willem/Wim

    Good control charts for high quality processes are often based on the number of successes between failures. Geometric charts are simplest in this respect, but slow in recognizing moderately increased failure rates p. Improvement can be achieved by waiting until r > 1 failures have occurred, i.e. by

  5. 3D cutting tool-wear monitoring in the process

    Energy Technology Data Exchange (ETDEWEB)

    Cerce, Luka; Pusavec, Franci; Kopac Janez [University of Ljubljana, Askerceva (Slovenia)

    2015-09-15

    The tool-wear of cutting tools has a very strong impact on the product quality as well as efficiency of the machining processes. Therefore, it in-the process characterization is crucial. This paper presents an innovative and reliable direct measuring procedure for measuring spatial cutting tool-wear with usage of laser profile sensor. The technique provides possibility for determination of 3D wear profiles, as advantage to currently used 2D techniques. The influence of the orientation of measurement head on the accuracy and the amount of captured reliable data was examined and the optimal setup of the measuring system was defined. Further, a special clamping system was designed to mount the measurement device on the machine tool turret. To test the measurement system, tool-life experiment was performed. Additionally, a new tool-life criterion was developed, including spatial characteristics of the tool-wear. The results showed that novel tool-wear and tool-life diagnostic represent objective and robust estimator of the machining process. Additionally, such automation of tool-wear diagnostics on machine tool provides higher productivity and quality of the machining process.

  6. Patterns to Enable Mass-Customized Business Process Monitoring

    NARCIS (Netherlands)

    Jochem Vonk; dr Marco Comuzzi; dr. Samuil Angelov

    2012-01-01

    Mass-customization challenges the one-size-fits-all assumption of mass production, allowing customers to specify the options that best fit their requirements when choosing a product or a service. In business process management, to achieve mass-customization, providers offer to their customers the

  7. Patterns to enable mass-customized business process monitoring

    NARCIS (Netherlands)

    Comuzzi, M.; Angelov, S.A.; Vonk, J.; Ralyté, J,; Franch, X.; Brinkkemper, S.; Wrycza, S.

    2012-01-01

    Mass-customization challenges the one-size-fits-all assumption of mass production, allowing customers to specify the options that best fit their requirements when choosing a product or a service. In business process management, to achieve mass-customization, providers offer to their customers the

  8. Dynamic monitoring of landscape patterns and ecological processes

    Indian Academy of Sciences (India)

    Landscape patterns and ecological processes have been in long-term research focus in the field of landscape ecology, but how to measure their quantitative relations is still open. This work chooses the Hulunbeier grassland as the study area where ecosystem shows high vulnerability, frequent evolvement of landscape ...

  9. Control of Process Operations and Monitoring of Product Qualities through Generic Model-based Framework in Crystallization Processes

    DEFF Research Database (Denmark)

    Abdul Samad, Noor Asma Fazli Bin

    A generic and systematic model-based framework for the design of a process monitoring and control system to achieve the desired crystal size distribution (CSD) and crystal shape for a wide range of crystallization processes has been developed. This framework combines a generic multi-dimensional m...

  10. Investigations on Temperature Fields during Laser Beam Melting by Means of Process Monitoring and Multiscale Process Modelling

    Directory of Open Access Journals (Sweden)

    J. Schilp

    2014-07-01

    Full Text Available Process monitoring and modelling can contribute to fostering the industrial relevance of additive manufacturing. Process related temperature gradients and thermal inhomogeneities cause residual stresses, and distortions and influence the microstructure. Variations in wall thickness can cause heat accumulations. These occur predominantly in filigree part areas and can be detected by utilizing off-axis thermographic monitoring during the manufacturing process. In addition, numerical simulation models on the scale of whole parts can enable an analysis of temperature fields upstream to the build process. In a microscale domain, modelling of several exposed single hatches allows temperature investigations at a high spatial and temporal resolution. Within this paper, FEM-based micro- and macroscale modelling approaches as well as an experimental setup for thermographic monitoring are introduced. By discussing and comparing experimental data with simulation results in terms of temperature distributions both the potential of numerical approaches and the complexity of determining suitable computation time efficient process models are demonstrated. This paper contributes to the vision of adjusting the transient temperature field during manufacturing in order to improve the resulting part's quality by simulation based process design upstream to the build process and the inline process monitoring.

  11. A new method for wafer quality monitoring using semiconductor process big data

    Science.gov (United States)

    Sohn, Younghoon; Lee, Hyun; Yang, Yusin; Jun, Chungsam

    2017-03-01

    In this paper we proposed a new semiconductor quality monitoring methodology - Process Sensor Log Analysis (PSLA) - using process sensor data for the detection of wafer defectivity and quality monitoring. We developed exclusive key parameter selection algorithm and user friendly system which is able to handle large amount of big data very effectively. Several production wafers were selected and analyzed based on the risk analysis of process driven defects, for example alignment quality of process layers. Thickness of spin-coated material can be measured using PSLA without conventional metrology process. In addition, chip yield impact was verified by matching key parameter changes with electrical die sort (EDS) fail maps at the end of the production step. From this work, we were able to determine that process robustness and product yields could be improved by monitoring the key factors in the process big data.

  12. In situ process monitoring in selective laser sintering using optical coherence tomography

    Science.gov (United States)

    Gardner, Michael R.; Lewis, Adam; Park, Jongwan; McElroy, Austin B.; Estrada, Arnold D.; Fish, Scott; Beaman, Joseph J.; Milner, Thomas E.

    2018-04-01

    Selective laser sintering (SLS) is an efficient process in additive manufacturing that enables rapid part production from computer-based designs. However, SLS is limited by its notable lack of in situ process monitoring when compared with other manufacturing processes. We report the incorporation of optical coherence tomography (OCT) into an SLS system in detail and demonstrate access to surface and subsurface features. Video frame rate cross-sectional imaging reveals areas of sintering uniformity and areas of excessive heat error with high temporal resolution. We propose a set of image processing techniques for SLS process monitoring with OCT and report the limitations and obstacles for further OCT integration with SLS systems.

  13. A qualitative diagnosis method for a continuous process monitor system

    International Nuclear Information System (INIS)

    Lucas, B.; Evrard, J.M.; Lorre, J.P.

    1993-01-01

    SEXTANT, an expert system for the analysis of transients, was built initially to study physical transients in nuclear reactors. It combines several knowledge bases concerning measurements, models and qualitative behavior of the plant with a generate-and-test mechanism and a set of numerical models of the physical process. The integration of an improved diagnosis method using a mixed model in SEXTANT in order to take into account the existence and the reliability of only a few number of sensors, the knowledge on failure and the possibility of non anticipated failures, is presented. This diagnosis method is based on two complementary qualitative models of the process and a methodology to build these models from a system description. 8 figs., 17 refs

  14. High temperature corrosion control and monitoring for processing acidic crudes

    Energy Technology Data Exchange (ETDEWEB)

    Cross, C. [Betz/GE Water and Process Technologies, Woodlands, TX (United States)

    2009-07-01

    The challenge of processing heavy crudes and bitumen in a reliable and economical way was discussed. Many refiners use a conservative approach regarding the rate at which they use discounted crudes or depend upon capital-intensive upgrades to equipment. New strategies based on data-driven decisions are needed in order to obtain the greatest benefit from heavy feedstock. The feasibility of successfully processing more challenging feed can be estimated more accurately by better understanding the interactions between a particular feed and a particular crude unit. This presentation reviewed newly developed techniques that refiners can use to determine the feeds corrosion potential and the probability for this potential to manifest itself in a given crude unit. tabs., figs.

  15. The Structure of Processing Resource Demands in Monitoring Automatic Systems.

    Science.gov (United States)

    1981-01-01

    Attempts at modelling the human failure detection process have continually focused on normative predictions of optimal operator behavior ( Smallwood ...Broadbent’s filter model (Broadbent, 1957), to Treisman’s attenuation model (Treisman, 1964), to Norman’s late selection model ( Norman , 1968), tife concept...survey and a model. Acta Psychologica, 1967, 27, 84-92. Moray, N. Mental workload: Its theory and measurement. New York: Plenum Press, 1979. Li 42 Norman

  16. Monitoring the Water Quality in the Recycling Process

    International Nuclear Information System (INIS)

    Antonyová, A; Antony, P; Soewito, B

    2015-01-01

    Specific water contamination requires the recycling process prior to its discharge into the public sewerage network. Electro-flotation technology was used for cleaning of waste water contaminated with the disperse colorants. Dispersion colorants were used to decorate the boxes, made of corrugated board, in the company for the production of packaging. The objective of this paper is to present a method of optimization to determine the length of the time interval for electro-flotation process. Interval should be set so as to achieve the degree of cleaning the water that is the maximum possible in the process of electro-flotation. The measurement of the light passing through the measuring the translucent tube determines the actual degree of the water purity. The measurement is carried out by means of a photodiode in different wavelengths. The measured values in the measuring tube are compared with the nominal value, which corresponds to pure distilled water. Optimization the time interval to clean the water using electro-flotation was determined for yellow color. The optimum interval for the water contaminated with the yellow color was set to 1800s. (paper)

  17. Development and validation of a novel monitoring system for batch flocculant solids settling process

    DEFF Research Database (Denmark)

    Valverde Pérez, Borja; Zhang, Xueqian; Penkarski-Rodon, Elena

    2017-01-01

    system able to monitor batch settling tests by tracking the sludge blanket height and solid concentration along the column in the range of 1 to 8 g L-1. The system could be efficiently applied to monitor the batch settling tests of several full scale treatment plants run under different operational......Secondary sedimentation is the main hydraulic bottleneck of effective pollution control WWTP under wetweather flow conditions. Therefore, online monitoring tools are required for control and optimization of the settling process under dynamic conditions. In this work we propose a novel monitoring...

  18. Albumin solder covalently bound to a polymer membrane: New approach to improve binding strength in laser tissue soldering in-vitro.

    Science.gov (United States)

    Hiebl, B; Ascher, L; Luetzow, K; Kratz, K; Gruber, C; Mrowietz, C; Nehring, M E; Lendlein, A; Franke, R-P; Jung, F

    2018-01-01

    Laser tissue soldering (LTS) based on indocyanine green (ICG)-mediated heat-denaturation of proteins might be a promising alternative technique for micro-suturing, but up to now the problem of too weak shear strength of the solder welds in comparison to sutures is not solved. Earlier reports gave promising results showing that solder supported by carrier materials can enhance the cohesive strength of the liquid solder. In these studies, the solder was applied to the carriers by dip coating. Higher reliability of the connection between the solder and the carrier material is expected when the solder is bound covalently to the carrier material. In the present study a poly(ether imide) (PEI) membrane served as carrier material and ICG-supplemented albumin as solder substrate. The latter was covalently coupled to the carrier membrane under physiological conditions to prevent structural protein changes. As laser source a diode continuous-wave laser emitting at 808 nm with intensities between 250 mW and 1500 mW was utilized. The albumin functionalized carrier membrane was placed onto the tunica media of explanted pig thoracic aortae forming an overlapping area of approximately 0.5×0.5 cm2. All tests were performed in a dry state to prevent laser light absorption by water. Infrared spectroscopy, spectro-photometrical determination of the secondary and primary amine groups after acid orange II staining, contact angle measurements, and atomic force microscopy proved the successful functionalization of the PEI membrane with albumin. A laser power of 450 mW LTS could generate a membrane-blood vessel connection which was characterized by a shear strength of 0.08±0.002 MPa, corresponding to 15% of the tensile strength of the native blood vessel. Theoretically, an overlapping zone of 4.1 mm around the entire circumference of the blood vessel could have provided shear strength of the PEI membrane-blood vessel compound identical to the tensile strength of the native

  19. High frequency monitoring revels new insights into baseflow DOM processing

    Science.gov (United States)

    Khamis, K.; Bradley, C.; Blaen, P.; Krause, S.; Hannah, D. M.

    2017-12-01

    Dissolved organic matter (DOM) is important for myriad biogeochemical processes in river ecosystems. Currently, however, we have limited knowledge of DOM dynamics under low flow conditions as most previous studies have focused largely on storm event dynamics. Field deployable fluorescence technology offers new opportunities to explore diurnal DOM dynamics at finer time-steps and for longer periods than previously possible, thus providing new insights into in-stream DOM processing. In this study, we collected hourly fluorescence data (Spring - Fall) and a suite of hydro-climatological variables from two contrasting UK headwater watersheds: the urban Bourn Brook, Birmingham (52° 26' N, 1° 55' W) and agricultural Mill Haft, Shropshire (52° 48' N, 2° 14' W). We hypothesised that diurnal dynamics in humic-like fluorescence (Peak C; Ex. 365 nm / Em. 490 nm) would be driven by photo-oxidation processes; while tryptophan-like fluorescence (Peak T; Ex. 285 nm / Em. 345 nm) would respond to diurnal biomass production cycles. Wavelet analysis identified significant diurnal variations in Peak C for both the Bourn Brook and Mill Haft, with the strongest signal in early summer. While the amplitude was broadly similar between sites, peak timing and consistency differed, the Bourn Brook displayed peaks in the early morning (04:00 ± 2.2 h) and Mill Haft in early evening (19:00 ± 6.6 h). Cross wavelet analysis identified strong coherence with SW radiation for the urban stream but stronger relationships with discharge for the agricultural system. Hence, results from the Bourn Brook support our hypothesis regarding Peak C photo-oxidation processes but for Mill Haft, discharge (DOM dilution) appeared to be the key control. Contrary to our hypothesis, no strong diurnal pattern was identified for Peak T for either system. From this, we infer that the low levels of Peak T produced were rapidly taken up by bacteria and/or that productivity in these systems was low. Future work on in

  20. Monitoring coal conversion processes by IR-spectroscopy

    Energy Technology Data Exchange (ETDEWEB)

    Hobert, H.; Kempe, J.; Stephanowitz, H. (Friedrich-Schiller-Universitaet, Jena (German Democratic Republic))

    1990-01-01

    Explains application of infrared spectroscopy combined with multivariate data analysis by an on-line computer system for assessing coal quality and suitability of brown coal for conversion processes. Coal samples were pelletized under addition of KBr and analyzed using an IRF 180 Fourier transform spectrometer in the spectral range of 400 to 2,000 cm{sup -1}. Components of spectra are presented; the oil yield from coal hydrogenation is calculated by regression analysis. Covariance spectra of carbon, organic hydrogen and sulfur are shown. It is concluded that the field of application for the method includes industrial coal liquefaction, gasification as well as briquetting and coking. 8 refs.

  1. Monitoring of global geodynamic processes using satellite observations

    Directory of Open Access Journals (Sweden)

    S.K. Tatevian

    2014-06-01

    One of the active tectonic zones of Egypt located in Aswan, is characterized by regional basement rock uplift and regional faulting. In 1997, the African Regional Geodynamic Network was developed around the northern part of Lake Nasser, consists of 11 points, on both sides of the Lake. Its main goal is to study the geodynamical behavior around the northern part of the lake. The collected data were processed using the Bernese software version 5.0. From the velocity results, including also the African plate motion, it can be noticed that all stations of this network are moved to the northeast direction and it is typically the direction of the African plate motion.

  2. Facility effluent monitoring plan for the Waste Receiving and Processing Facility Module 1

    International Nuclear Information System (INIS)

    Lewis, C.J.

    1995-10-01

    A facility effluent monitoring plan is required by the US Department of Energy in Order 5400.1 for any operations that involve hazardous materials and radioactive substances that could impact employee or public safety or the environment. This document is prepared using the specific guidelines identified in A Guide for Preparing Hanford Site Facility Effluent Monitoring Plans, WHC-EP-0438. This facility effluent monitoring plan assesses effluent monitoring systems and evaluates whether they are adequate to ensure the public health and safety as specified in applicable federal state, and local requirements. This facility effluent monitoring plan shall ensure lonq-range integrity of the effluent monitoring systems by requiring an update whenever a new process or operation introduces new hazardous materials or significant radioactive materials. This document must be reviewed annually even if there are no operational changes, and it must be updated as a minimum every three years

  3. Development of Pb-Free Nanocomposite Solder Alloys

    Directory of Open Access Journals (Sweden)

    Animesh K. Basak

    2018-04-01

    Full Text Available As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs during aging/reflow. Accordingly, this study examines the improvement of properties of SAC alloys by incorporating nanoparticles in it. Two different types of nanoparticles were added in monolithic SAC alloy: (1 Al2O3 or (2 Fe and their effect on microstructure and thermal properties were investigated. Addition of Fe nanoparticles leads to the formation of FeSn2 IMCs alongside Ag3Sn and Cu6Sn5 from monolithic SAC alloy. Addition of Al2O3 nano-particles do not contribute to phase formation, however, remains dispersed along primary β-Sn grain boundaries and act as a grain refiner. As the addition of either Fe or Al2O3 nano-particles do not make any significant effect on thermal behavior, these reinforced nanocomposites are foreseen to provide better mechanical characteristics with respect to conventional monolithic SAC solder alloys.

  4. Impurity Effects in Electroplated-Copper Solder Joints

    Directory of Open Access Journals (Sweden)

    Hsuan Lee

    2018-05-01

    Full Text Available Copper (Cu electroplating is a mature technology, and has been extensively applied in microelectronic industry. With the development of advanced microelectronic packaging, Cu electroplating encounters new challenges for atomic deposition on a non-planar substrate and to deliver good throwing power and uniform deposit properties in a high-aspect-ratio trench. The use of organic additives plays an important role in modulating the atomic deposition to achieve successful metallic coverage and filling, which strongly relies on the adsorptive and chemical interactions among additives on the surface of growing film. However, the adsorptive characteristic of organic additives inevitably results in an incorporation of additive-derived impurities in the electroplated Cu film. The incorporation of high-level impurities originating from the use of polyethylene glycol (PEG and chlorine ions significantly affects the microstructural evolution of the electroplated Cu film, and the electroplated-Cu solder joints, leading to the formation of undesired voids at the joint interface. However, the addition of bis(3-sulfopropyl disulfide (SPS with a critical concentration suppresses the impurity incorporation and the void formation. In this article, relevant studies were reviewed, and the focus was placed on the effects of additive formula and plating parameters on the impurity incorporation in the electroplated Cu film, and the void formation in the solder joints.

  5. Wear monitoring of protective nitride coatings using image processing

    DEFF Research Database (Denmark)

    Rasmussen, Inge Lise; Guibert, M.; Belin, M.

    2010-01-01

    -meter with up to 105 19 repetitive cycles, eventually leaving the embedded TiN signal layer uncovered at the bottom the wear scar. 20 The worn surface was characterized by subsequent image processing. A color detection of the wear scar with 21 the exposed TiN layer by a simple optical imaging system showed......A double-layer model system, consisting of a thin layer of tribological titanium aluminum nitride (TiAlN) on 17 top of titanium nitride (TiN), was deposited on polished 100Cr6 steel substrates. The TiAlN top-coatings 18 were exposed to abrasive wear by a reciprocating wear process in a linear tribo...... a significant increase up to a factor of 2 of 22 the relative color values from the TiAlN top layers to the embedded TiN signal layers. This behavior agrees 23 well with the results of reflectance detection experiment with a red laser optical system on the same system. 24 Thus we have demonstrated that image...

  6. Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions

    Science.gov (United States)

    Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

    2015-12-01

    Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

  7. Compliance monitoring in business processes: Functionalities, application, and tool-support.

    Science.gov (United States)

    Ly, Linh Thao; Maggi, Fabrizio Maria; Montali, Marco; Rinderle-Ma, Stefanie; van der Aalst, Wil M P

    2015-12-01

    In recent years, monitoring the compliance of business processes with relevant regulations, constraints, and rules during runtime has evolved as major concern in literature and practice. Monitoring not only refers to continuously observing possible compliance violations, but also includes the ability to provide fine-grained feedback and to predict possible compliance violations in the future. The body of literature on business process compliance is large and approaches specifically addressing process monitoring are hard to identify. Moreover, proper means for the systematic comparison of these approaches are missing. Hence, it is unclear which approaches are suitable for particular scenarios. The goal of this paper is to define a framework for Compliance Monitoring Functionalities (CMF) that enables the systematic comparison of existing and new approaches for monitoring compliance rules over business processes during runtime. To define the scope of the framework, at first, related areas are identified and discussed. The CMFs are harvested based on a systematic literature review and five selected case studies. The appropriateness of the selection of CMFs is demonstrated in two ways: (a) a systematic comparison with pattern-based compliance approaches and (b) a classification of existing compliance monitoring approaches using the CMFs. Moreover, the application of the CMFs is showcased using three existing tools that are applied to two realistic data sets. Overall, the CMF framework provides powerful means to position existing and future compliance monitoring approaches.

  8. Optimization of signal processing algorithm for digital beam position monitor

    International Nuclear Information System (INIS)

    Lai Longwei; Yi Xing; Leng Yongbin; Yan Yingbing; Chen Zhichu

    2013-01-01

    Based on turn-by-turn (TBT) signal processing, the paper emphasizes on the optimization of system timing and implementation of digital automatic gain control, slow application (SA) modules. Beam position including TBT, fast application (FA) and SA data can be acquired. On-line evaluation on Shanghai Synchrotron Radiation Facility (SSRF) shows that the processor is able to get the multi-rate position data which contain true beam movements. When the storage ring is 174 mA and 500 bunches filled, the resolutions of TBT data, FA data and SA data achieve 0.84, 0.44 and 0.23 μm respectively. The above results prove that the design could meet the performance requirements. (authors)

  9. Laser-tissue soldering with biodegradable polymer films in vitro: film surface morphology and hydration effects.

    Science.gov (United States)

    Sorg, B S; Welch, A J

    2001-01-01

    Previous research introduced the concept of using biodegradable polymer film reinforcement of a liquid albumin solder for improvement of the tensile strength of repaired incisions in vitro. In this study, the effect of creating small pores in the PLGA films on the weld breaking strength is studied. Additionally, the effect of hydration on the strength of the reinforced welds is investigated. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with an 806-nm CW diode laser. A poly(DL-lactic-co-glycolic acid) (PLGA) film was used to reinforce the solder (the controls had solder but no reinforcement). Breaking strengths were measured acutely and after hydration in saline for 1 and 2 days. The data were analyzed by ANOVA (P < 0.05) and multiple comparisons of means were performed using the Newman-Keuls test. The creation of pores in the PLGA films qualitatively improved the film flexibility without having an apparent adverse effect on the breaking strength, while the actual technique of applying the film and solder had more of an effect. The acute maximum average breaking strengths of some of the film reinforced specimens (114.7 g-134.4 g) were significantly higher (P < 0.05) than the acute maximum average breaking strength of the unreinforced control specimens (68.3 g). Film reinforced specimens were shown to have a statistically significantly higher breaking strength than unreinforced controls after 1- and 2-day hydration. Reinforcement of liquid albumin solders in laser-assisted incision repair appears to have advantages over conventional methods that do not reinforce the cohesive strength of the solder in terms of acute breaking strength and after immersion in moist environments for short periods of time. Using a film with the solder applied to one surface only may be advantageous over other techniques.

  10. The use of safeguards data for process monitoring in the Advanced Test Line for Actinide Separations

    International Nuclear Information System (INIS)

    Barnes, J.W.; Yarbro, S.L.

    1987-01-01

    Los Alamos is constructing an integrated process monitoring/materials control and accounting (PM/MC and A) system in the Advanced Testing Line for Actinide Separations (ATLAS) at the Los Alamos Plutonium Facility. The ATLAS will test and demonstrate new methods for aqueous processing of plutonium. The ATLAS will also develop, test, and demonstrate the concepts for integrated process monitoring/materials control and accounting. We describe how this integrated PM/MC and A system will function and provide benefits to both process research and materials accounting personnel

  11. Multi-scale modeling of elasto-plastic response of SnAgCu lead-free solder alloys at different ageing conditions: Effect of microstructure evolution, particle size effects and interfacial failure

    Energy Technology Data Exchange (ETDEWEB)

    Maleki, Milad; Cugnoni, Joel, E-mail: joel.cugnoni@epfl.ch; Botsis, John

    2016-04-20

    In microelectronics applications, SnAgCu lead-free solder joints play the important role of ensuring both the mechanical and electrical integrity of the components. In such applications, the SnAgCu joints are subjected to elevated homologous temperatures for an extended period of time causing significant microstructural changes and leading to reliability issues. In this study, the link between the change in microstructures and deformation behavior of SnAgCu solder during ageing is explained by developing a hybrid multi-scale microstructure-based modeling approach. Herein, the SnAgCu solder alloy is seen as a three phase metal matrix composite in which Ag{sub 3}Sn and Cu{sub 6}Sn{sub 5} hard intermetallics play the role of reinforcements and Sn the role of a ductile matrix. The hardening of the Sn matrix due to fine intermetallics in the eutectic mixture is modeled by incorporating the mean field effects of geometrically necessary dislocations. Subsequently, a two level homogenization procedure based on micromechanical finite element (FE) models is used to capture the interactions between the different phases. For this purpose, tomographic images of microstructures obtained by Focused Ion Beam (FIB) and synchrotron X-Ray in different ageing conditions are directly used to generate statistically representative volume elements (RVE) using 3D FE models. The constitutive behavior of the solder is determined by sequentially performing two scales of numerical homogenization at the eutectic level and then at the dendrite level. For simplification, the anisotropy of Sn as well as the potential recovery processes have been neglected in the modeling. The observed decrease in the yield strength of solder due to ageing is well captured by the adopted modeling strategy and allows explaining the different ageing mechanisms. Finally, the effects of potential debonding at the intermetallic particle-matrix interface as well as particle fracture on the overall strength of solder are

  12. The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

    Energy Technology Data Exchange (ETDEWEB)

    Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: Peter.Svec@savba.sk [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)

    2013-06-01

    The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

  13. Monitoring and control of amygdala neurofeedback involves distributed information processing in the human brain.

    Science.gov (United States)

    Paret, Christian; Zähringer, Jenny; Ruf, Matthias; Gerchen, Martin Fungisai; Mall, Stephanie; Hendler, Talma; Schmahl, Christian; Ende, Gabriele

    2018-03-30

    Brain-computer interfaces provide conscious access to neural activity by means of brain-derived feedback ("neurofeedback"). An individual's abilities to monitor and control feedback are two necessary processes for effective neurofeedback therapy, yet their underlying functional neuroanatomy is still being debated. In this study, healthy subjects received visual feedback from their amygdala response to negative pictures. Activation and functional connectivity were analyzed to disentangle the role of brain regions in different processes. Feedback monitoring was mapped to the thalamus, ventromedial prefrontal cortex (vmPFC), ventral striatum (VS), and rostral PFC. The VS responded to feedback corresponding to instructions while rPFC activity differentiated between conditions and predicted amygdala regulation. Control involved the lateral PFC, anterior cingulate, and insula. Monitoring and control activity overlapped in the VS and thalamus. Extending current neural models of neurofeedback, this study introduces monitoring and control of feedback as anatomically dissociated processes, and suggests their important role in voluntary neuromodulation. © 2018 Wiley Periodicals, Inc.

  14. Exploitation of process knowledge for the monitoring and closed loop control of fermentation processes; Erschliessen von Prozesswissen fuer das Monitoring und die Regelung von Fermentationsprozessen

    Energy Technology Data Exchange (ETDEWEB)

    Grote, Bianca; Hitzmann, Bernd [Hohenheim Univ., Stuttgart (Germany). FG Prozessanalytik und Getreidetechnologie; John, Jinu Mulamoottil

    2011-07-01

    The significance of process knowledge for the monitoring and closed loop control of biotechnical processes is demonstrated. An important problem of the development of chemometric models is the expense of calibration measurements required to calculate values of process variables from unselective measurements. To reduce this expense a method was developed which uses a dynamic process model instead of measurements. As an example the chemometric modeling will be discussed of a baker's yeast cultivation measuring fluorescence spectra and estimating biomass, glucose, and ethanol concentrations. We demonstrate the exploitation of process knowledge during an Escherichia colifermentation for the closed loop control of glucose concentration by using an extended Kalman filter. Here the effective dead time and the measurement noise will be compensated by this method. The glucose set point is 0.05g/L. The yield of the process exceeds by far that of batch fermentations. (orig.)

  15. Influence of Poly(ethylene glycol) Degradation on Voiding Sporadically Occurring in Solder Joints with Electroplated Cu

    Science.gov (United States)

    Wafula, F.; Yin, L.; Borgesen, P.; Andala, D.; Dimitrov, N.

    2012-07-01

    This paper presents a comprehensive study of the effect of poly(ethylene glycol) (PEG) degradation on the void formation known to take place sporadically at the interface between electroplated Cu and Pb-free solder. Thorough chemical analysis of our plating solution, carried out at different times of the deposition process by matrix-assisted laser desorption ionization time-of-flight mass spectroscopy, reveals a dramatic shift in the peaks to lower mass range with time. Scanning electron microscopy cross-sectional images of solder joints with Cu samples that have been plated at different times in the course of solution aging show a decrease in void formation. A decreasing magnitude of the deposition overpotential also seen during aging suggests that, breaking down to lower-molecular-weight fragments, PEG loses its suppression effect and likely has lower impact on the voiding propensity. This indirect correlation is confirmed further by the use of plating solutions containing PEG with preselected molecular weight. We also report on the effect of the surface area-to-solution volume ratio on PEG degradation studied by comparative experiments performed in a 50-mL bath with a rotating disc electrode and in a larger cell (Hull cell) with volume of 267 mL. The results show that, at fixed charge per unit volume, PEG degrades at a greatly accelerated rate in the Hull cell featuring higher electrode surface-to-solution volume ratio. Analysis of solder joints with accordingly grown Cu layers suggests that the voiding decreases faster with the accelerated rate of PEG degradation.

  16. Cryogenic loss monitors with FPGA TDC signal processing

    Energy Technology Data Exchange (ETDEWEB)

    Warner, A.; Wu, J.; /Fermilab

    2011-09-01

    Radiation hard helium gas ionization chambers capable of operating in vacuum at temperatures ranging from 5K to 350K have been designed, fabricated and tested and will be used inside the cryostats at Fermilab's Superconducting Radiofrequency beam test facility. The chamber vessels are made of stainless steel and all materials used including seals are known to be radiation hard and suitable for operation at 5K. The chambers are designed to measure radiation up to 30 kRad/hr with sensitivity of approximately 1.9 pA/(Rad/hr). The signal current is measured with a recycling integrator current-to-frequency converter to achieve a required measurement capability for low current and a wide dynamic range. A novel scheme of using an FPGA-based time-to-digital converter (TDC) to measure time intervals between pulses output from the recycling integrator is employed to ensure a fast beam loss response along with a current measurement resolution better than 10-bit. This paper will describe the results obtained and highlight the processing techniques used.

  17. Monitoring dynamic electrochemical processes with in situ ptychography

    Science.gov (United States)

    Kourousias, George; Bozzini, Benedetto; Jones, Michael W. M.; Van Riessen, Grant A.; Dal Zilio, Simone; Billè, Fulvio; Kiskinova, Maya; Gianoncelli, Alessandra

    2018-03-01

    The present work reports novel soft X-ray Fresnel CDI ptychography results, demonstrating the potential of this method for dynamic in situ studies. Specifically, in situ ptychography experiments explored the electrochemical fabrication of Co-doped Mn-oxide/polypyrrole nanocomposites for sustainable and cost-effective fuel-cell air-electrodes. Oxygen-reduction catalysts based on Mn-oxides exhibit relatively high activity, but poor durability: doping with Co has been shown to improve both reduction rate and stability. In this study, we examine the chemical state distribution of the catalytically crucial Co dopant to elucidate details of the Co dopant incorporation into the Mn/polymer matrix. The measurements were performed using a custom-made three-electrode thin-layer microcell, developed at the TwinMic beamline of Elettra Synchrotron during a series of experiments that were continued at the SXRI beamline of the Australian Synchrotron. Our time-resolved ptychography-based investigation was carried out in situ after two representative growth steps, controlled by electrochemical bias. In addition to the observation of morphological changes, we retrieved the spectroscopic information, provided by multiple ptychographic energy scans across Co L3-edge, shedding light on the doping mechanism and demonstrating a general approach for the molecular-level investigation complex multimaterial electrodeposition processes.

  18. Monitoring processes and measuring the effectiveness of the management system

    International Nuclear Information System (INIS)

    Bailescu, A.; Costea, D.

    2009-01-01

    This document presents the way which the 8th principle of the quality management system 'Process approach' is applied, the principle that is identified and used by international standard ISO 9000. In order to understand the evolution of the management system requirements, as used today in different activities namely, industry, services, and nuclear activities, the authors present an evolution of the quality concept and its traceability to different standards, applicable in time. There are described the requirements of ISO 9001 standard, that represents the most widely spread model for modern organization management and the IAEA concerns related to integration of the above standard requirements into the most recent safety IAEA standard 'The Management System for facilities and activities'. The IAEA Safety Standard GS-R-3 describes a management model considering both the evolution of the quality requirements into the modern management and the recovery of the experience gained by nuclear activities. The authors pleads for applying of the 8th principle as a means and a model, easy to use to ensure the achievement of management objectives. (authors)

  19. On the hazard rate process for imperfectly monitored multi-unit systems

    International Nuclear Information System (INIS)

    Barros, A.; Berenguer, C.; Grall, A.

    2005-01-01

    The aim of this paper is to present a stochastic model to characterize the failure distribution of multi-unit systems when the current units state is imperfectly monitored. The definition of the hazard rate process existing with perfect monitoring is extended to the realistic case where the units failure time are not always detected (non-detection events). The so defined observed hazard rate process gives a better representation of the system behavior than the classical failure rate calculated without any information on the units state and than the hazard rate process based on perfect monitoring information. The quality of this representation is, however, conditioned by the monotony property of the process. This problem is mainly discussed and illustrated on a practical example (two parallel units). The results obtained motivate the use of the observed hazard rate process to characterize the stochastic behavior of the multi-unit systems and to optimize for example preventive maintenance policies

  20. On the hazard rate process for imperfectly monitored multi-unit systems

    Energy Technology Data Exchange (ETDEWEB)

    Barros, A. [Institut des Sciences et Techonologies de l' Information de Troyes (ISTIT-CNRS), Equipe de Modelisation et Surete des Systemes, Universite de Technologie de Troyes (UTT), 12, rue Marie Curie, BP2060, 10010 Troyes cedex (France)]. E-mail: anne.barros@utt.fr; Berenguer, C. [Institut des Sciences et Techonologies de l' Information de Troyes (ISTIT-CNRS), Equipe de Modelisation et Surete des Systemes, Universite de Technologie de Troyes (UTT), 12, rue Marie Curie, BP2060, 10010 Troyes cedex (France); Grall, A. [Institut des Sciences et Techonologies de l' Information de Troyes (ISTIT-CNRS), Equipe de Modelisation et Surete des Systemes, Universite de Technologie de Troyes (UTT), 12, rue Marie Curie, BP2060, 10010 Troyes cedex (France)

    2005-12-01

    The aim of this paper is to present a stochastic model to characterize the failure distribution of multi-unit systems when the current units state is imperfectly monitored. The definition of the hazard rate process existing with perfect monitoring is extended to the realistic case where the units failure time are not always detected (non-detection events). The so defined observed hazard rate process gives a better representation of the system behavior than the classical failure rate calculated without any information on the units state and than the hazard rate process based on perfect monitoring information. The quality of this representation is, however, conditioned by the monotony property of the process. This problem is mainly discussed and illustrated on a practical example (two parallel units). The results obtained motivate the use of the observed hazard rate process to characterize the stochastic behavior of the multi-unit systems and to optimize for example preventive maintenance policies.

  1. Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

    CERN Document Server

    Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B

    2015-01-01

    The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

  2. 'Virtual' monitoring in LabVIEW 8 and process simulation of the cryogenic pilot plant

    International Nuclear Information System (INIS)

    Moraru, Carmen Maria; Stefan, Iuliana; Balteanu, Ovidiu; Bucur, Ciprian; Stefan, Liviu; Bornea, Anisia; Stefanescu, Ioan

    2007-01-01

    Full text: The implementation of the new software and hardware's technologies for tritium processing nuclear plants, and especially those with an experimental character or of new technology developments shows a coefficient of complexity due to issues raised by the use of the performing instrumentation and equipment into a unitary monitoring system of the nuclear technological process of tritium removal. Keeping the system's flexibility is a demand of the nuclear experimental plants for which the change of configuration, process and parameters is something usual. The big amount of data that needs to be processed, stored and accessed for real time simulation and optimization demands the achievement of the virtual technologic platform where the data acquiring, control and analysis systems of the technological process can be integrated with a developed technological monitoring system. Thus, integrated computing and monitoring systems needed for the supervising of the technological process will be carried out, and continued with the optimization of the system, by choosing new and performing methods corresponding to the technological processes within the tritium removal processing nuclear plants. The developing software applications is carried out by means of the program packages dedicated to industrial processes and they will include acquisition and monitoring sub-modules, named 'virtual' as well as the storage sub-module of the process data later required for the software of optimization and simulation of the technological process for tritium removal. The system plays an important role in the environment protection and sustainable development through new technologies, that is - the reduction of and fight against industrial accidents in the case of tritium processing nuclear plants. Research for monitoring optimization of nuclear processes is also a major driving force for economic and social development. (authors)

  3. VA Construction: Improved Processes Needed to Monitor Contract Modifications, Develop Schedules, and Estimate Costs

    Science.gov (United States)

    2017-03-01

    the Handbook.36 VA headquarters officials told us that regional CFM offices monitor change- order - processing time frames for projects in their...visited collected different types of data on change orders. Because VA lacks the data on the change order processing timeframes required by the Handbook...goals of processing change orders in a timelier manner, especially given our previous findings that change- order - processing time frames caused

  4. Monitoring of the threshing process quality by using advanced vibro-acoustic indicators

    OpenAIRE

    Fiorati, Stefano

    2011-01-01

    This PhD thesis concerns the vibro-acoustic monitoring of the threshing process in an axial flow harvesting machine. This research is a step towards the development of online control systems finalized to maximize the process efficiency and the product quality. By using different signal processing tools it is possible to analyse the link between sound/vibration and material distribution in the threshing unit. In more details, the threshing process is mainly given by two principa...

  5. Facility Effluent Monitoring Plan for the Waste Receiving and Processing (WRAP) Facility

    Energy Technology Data Exchange (ETDEWEB)

    DAVIS, W.E.

    2000-03-08

    A facility effluent monitoring plan is required by the U.S. Department of Energy in Order 5400.1 for any operations that involve hazardous materials and radioactive substances that could impact employee public safety, or the environment. This facility effluent monitoring plan assesses effluent monitoring systems and evaluates whether these systems are adequate to ensure the public health and safety as specified in applicable federal, state, and local requirements. This facility effluent monitoring plan ensures long-range integrity of the effluent monitoring systems by requiring an update whenever a new process or operation introduces new hazardous materials or significant radioactive materials. This document must be reviewed annually even if there are no operational changes, and must be updated, as a minimum, every 3 years.

  6. Facility Effluent Monitoring Plan for the Waste Receiving and Processing (WRAP) Facility

    International Nuclear Information System (INIS)

    DAVIS, W.E.

    2000-01-01

    A facility effluent monitoring plan is required by the U.S. Department of Energy in Order 5400.1 for any operations that involve hazardous materials and radioactive substances that could impact employee public safety, or the environment. This facility effluent monitoring plan assesses effluent monitoring systems and evaluates whether these systems are adequate to ensure the public health and safety as specified in applicable federal, state, and local requirements. This facility effluent monitoring plan ensures long-range integrity of the effluent monitoring systems by requiring an update whenever a new process or operation introduces new hazardous materials or significant radioactive materials. This document must be reviewed annually even if there are no operational changes, and must be updated, as a minimum, every 3 years

  7. Process Monitoring and Fault Diagnosis for Shell Rolling Production of Seamless Tube

    Directory of Open Access Journals (Sweden)

    Dong Xiao

    2015-01-01

    Full Text Available Continuous rolling production process of seamless tube has many characteristics, including multiperiod and strong nonlinearity, and quickly changing dynamic characteristics. It is difficult to build its mechanism model. In this paper we divide production data into several subperiods by K-means clustering algorithm combined with production process; then we establish a continuous rolling production monitoring and fault diagnosis model based on multistage MPCA method. Simulation experiments show that the rolling production process monitoring and fault diagnosis model based on multistage MPCA method is effective, and it has a good real-time performance, high reliability, and precision.

  8. An ontological knowledge based system for selection of process monitoring and analysis tools

    DEFF Research Database (Denmark)

    Singh, Ravendra; Gernaey, Krist; Gani, Rafiqul

    2010-01-01

    monitoring and analysis tools for a wide range of operations has made their selection a difficult, time consuming and challenging task. Therefore, an efficient and systematic knowledge base coupled with an inference system is necessary to support the optimal selection of process monitoring and analysis tools......, satisfying the process and user constraints. A knowledge base consisting of the process knowledge as well as knowledge on measurement methods and tools has been developed. An ontology has been designed for knowledge representation and management. The developed knowledge base has a dual feature. On the one...... procedures has been developed to retrieve the data/information stored in the knowledge base....

  9. Comparison Of Several Metrology Techniques For In-line Process Monitoring Of Porous SiOCH

    International Nuclear Information System (INIS)

    Fossati, D.; Imbert, G.; Beitia, C.; Yu, L.; Plantier, L.; Volpi, F.; Royer, J.-C.

    2007-01-01

    As porous SiOCH is a widely used inter-metal dielectric for 65 nm nodes and below, the control of its elaboration process by in-line monitoring is necessary to guarantee successful integration of the material. In this paper, the sensitivities of several non-destructive metrology techniques towards the film elaboration process drifts are investigated. It appears that the two steps of the process should be monitored separately and that corona charge method is the most sensitive technique of the review for this application

  10. EXPERT-ANALITICAL MONITORING OF LEARNING PROCESS QUALITY IN HIGH SCHOOL

    Directory of Open Access Journals (Sweden)

    T. M. Korotun

    2010-10-01

    Full Text Available The technological model is proposed for monitoring process of learning process quality in high school compliant with current European and home standards. The mathematical methods are elaborated for diverse activities as to learning process objects quality determination unified support. They self-consistently combine: automatic expert evaluation with Bayesian net and Value tree models; Delphi technique enhancement; best practices for education quality assessment. Quality estimates’ consistency index is introduced for their choice and acceptability analysis. Its permanent increasing over monitoring stages is guaranteed. The tools for these stages’ automatic support are described.

  11. Use of process monitoring data for the enhancement of nuclear material control and accounting

    International Nuclear Information System (INIS)

    Miles, J.C.; Glancy, J.E.; Donelson, S.E.

    1979-09-01

    Two licensed fuel fabrication facilities, one processing low-enriched and the other high-enriched uranium, were examined in this study. Safeguards effectiveness of the current material accounting system at each licensee was quantitatively assessed using an evaluation methodology. Two generations of alternate material control systems using portions of the facilities' process monitoring data were developed and similarly evaluated for each facility

  12. A Successful Replication of the River Visitor Inventory and Monitoring Process for Capacity Management

    Science.gov (United States)

    Kenneth Chilman; James Vogel; Greg Brown; John H. Burde

    2004-01-01

    This paper has 3 purposes: to discuss 1. case study research and its utility for recreation management decisionmaking, 2. the recreation visitor inventory and monitoring process developed from case study research, and 3. a successful replication of the process in a large-scale, multi-year application. Although case study research is discussed in research textbooks as...

  13. Development of a multisensory arm for process monitoring in Robot Assisted Polishing

    DEFF Research Database (Denmark)

    Pilny, Lukas; Dalla Costa, Giuseppe; Bissacco, Giuliano

    2015-01-01

    A multisensory polishing arm with integrated three component force sensor, a miniature acoustic emission (AE) sensor and an accelerometer was developed for process monitoring in Robot Assisted Polishing (RAP) process. The arm design was optimized for integration of a force and an AE sensor. The f...

  14. An Application of X-ray Fluorescence as Process Analytical Technology (PAT) to Monitor Particle Coating Processes.

    Science.gov (United States)

    Nakano, Yoshio; Katakuse, Yoshimitsu; Azechi, Yasutaka

    2018-03-30

    An attempt to apply X-ray Fluorescence (XRF) analysis to evaluate small particle coating process as a Process Analytical Technologies (PAT) was made. The XRF analysis was used to monitor coating level in small particle coating process with at-line manner. The small particle coating process usually consists of multiple coating processes. This study was conducted by a simple coating particles prepared by first coating of a model compound (DL-methionine) and second coating by talc on spherical microcrystalline cellulose cores. The particles with two layered coating are enough to demonstrate the small particle coating process. From the result by the small particle coating process, it was found that the XRF signal played different roles, resulting that XRF signals by first coating (layering) and second coating (mask coating) could demonstrate the extent with different mechanisms for the coating process. Furthermore, the particle coating of the different particle size has also been investigated to evaluate size effect of these coating processes. From these results, it was concluded that the XRF could be used as a PAT in monitoring particle coating processes and become powerful tool in pharmaceutical manufacturing.

  15. Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications

    Directory of Open Access Journals (Sweden)

    John D. Sørensen

    2011-12-01

    Full Text Available Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components, it is necessary to understand the physics of their failure and be able to develop reliability prediction models. Such a model is proposed in this paper for an IGBT power electronic module. IGBTs are critical components in wind turbine converter systems. These are multilayered devices where layers are soldered to each other and they operate at a thermal-power cycling environment. Temperature loadings affect the reliability of soldered joints by developing cracks and fatigue processes that eventually result in failure. Based on Miner’s rule a linear damage model that incorporates a crack development and propagation processes is discussed. A statistical analysis is performed for appropriate model parameter selection. Based on the proposed model, a layout for component life prediction with crack movement is described in details.

  16. Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders

    Science.gov (United States)

    Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E.; Handwerker, Carol A.

    2016-12-01

    Particles of Cu x Al y in Sn-Cu-Al solders have previously been shown to nucleate the Cu6Sn5 phase during solidification. In this study, the number and size of Cu6Sn5 nucleation sites were controlled through the particle size refinement of Cu x Al y via rapid solidification processing and controlled cooling in a differential scanning calorimeter. Cooling rates spanning eight orders of magnitude were used to refine the average Cu x Al y and Cu6Sn5 particle sizes down to submicron ranges. The average particle sizes, particle size distributions, and morphologies in the microstructures were analyzed as a function of alloy composition and cooling rate. Deep etching of the samples revealed the three-dimensional microstructures and illuminated the epitaxial and morphological relationships between the Cu x Al y and Cu6Sn5 phases. Transitions in the Cu6Sn5 particle morphologies from faceted rods to nonfaceted, equiaxed particles were observed as a function of both cooling rate and composition. Initial solidification cooling rates within the range of 103 to 104 °C/s were found to be optimal for realizing particle size refinement and maintaining the Cu x Al y /Cu6Sn5 nucleant relationship. In addition, little evidence of the formation or decomposition of the ternary- β phase in the solidified alloys was noted. Solidification pathways omitting the formation of the ternary- β phase agreed well with observed room temperature microstructures.

  17. Preliminary tests of an infrared process monitor for polyethylene encapsulation of radioactive waste

    International Nuclear Information System (INIS)

    Wright, S.L.; Jones, R.W.; McClelland, J.F.; Kalb, P.D.

    1996-01-01

    Polyethylene encapsulation is a process that is being investigated for the solidification of radioactive nitrate salts at Brookhaven National Laboratory and Rocky Flats Plant. In the encapsulation process, radioactive-salt waste is mixed with polyethylene pellets, heated, and extruded as a molten stream. Upon cooling, the mixture solidifies to a monolithic waste form with excellent properties for long-term waste storage. This paper describes a novel method to monitor the composition of the salt/polymer stream as it exits the extruder. The monitor is based on a technique known as transient infrared spectroscopy (TIRS). The TIRS monitor is able to capture the real-time mid-infrared spectrum of the processed waste stream as it exits the extruder. The wealth of chemical information contained in a mid-infrared spectrum makes this technique very appealing for on-line monitoring and process control. Data from the monitor can be used to guide processing, minimize waste volume, and certify the composition of the final waste form

  18. In-situ electrical analysis in view of monitoring the processing of thermoplastics

    Science.gov (United States)

    Gonnet, J. M.; Guillet, J.; Ainser, A.; Boiteux, G.; Fulchiron, R.; Seytre, Gerard

    1999-12-01

    In the last recent years, electrical techniques like microdielectrometry have presented an attracting and increasing interest for continuous monitoring, in a nondestructive way, of the advancement of the reaction of thermoset resins under cure. We think that the use of electrical analysis for in situ monitoring of chemical reactions can be extended to get information on thermoplastic and the physical phenomena such sa crystallization or study of residence time distribution in processing machines such as extruders.

  19. On-line Cutting Tool Condition Monitoring in Machining Processes Using Artificial Intelligence

    OpenAIRE

    Vallejo, Antonio J.; Morales-Menéndez, Rub&#;n; Alique, J.R.

    2008-01-01

    This chapter presented new ideas for monitoring and diagnosis of the cutting tool condition with two different algorithms for pattern recognition: HMM, and ANN. The monitoring and diagnosis system was implemented for peripheral milling process in HSM, where several Aluminium alloys and cutting tools were used. The flank wear (VB) was selected as the criterion to evaluate the tool's life and four cutting tool conditions were defined to be recognized: New, half new, half worn, and worn conditio...

  20. Information processing requirements for on-board monitoring of automatic landing

    Science.gov (United States)

    Sorensen, J. A.; Karmarkar, J. S.

    1977-01-01

    A systematic procedure is presented for determining the information processing requirements for on-board monitoring of automatic landing systems. The monitoring system detects landing anomalies through use of appropriate statistical tests. The time-to-correct aircraft perturbations is determined from covariance analyses using a sequence of suitable aircraft/autoland/pilot models. The covariance results are used to establish landing safety and a fault recovery operating envelope via an event outcome tree. This procedure is demonstrated with examples using the NASA Terminal Configured Vehicle (B-737 aircraft). The procedure can also be used to define decision height, assess monitoring implementation requirements, and evaluate alternate autoland configurations.

  1. Image processing of integrated video image obtained with a charged-particle imaging video monitor system

    International Nuclear Information System (INIS)

    Iida, Takao; Nakajima, Takehiro

    1988-01-01

    A new type of charged-particle imaging video monitor system was constructed for video imaging of the distributions of alpha-emitting and low-energy beta-emitting nuclides. The system can display not only the scintillation image due to radiation on the video monitor but also the integrated video image becoming gradually clearer on another video monitor. The distortion of the image is about 5% and the spatial resolution is about 2 line pairs (lp)mm -1 . The integrated image is transferred to a personal computer and image processing is performed qualitatively and quantitatively. (author)

  2. Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn- xAg-0.7Cu

    Science.gov (United States)

    Lee, Hwa-Teng; Huang, Kuo-Chen

    2016-12-01

    Low-cycle fatigue tests of Sn-Ag-Cu (SAC) Pb-free solder joints under fixed displacement were performed to evaluate the influence of Ag content (0-3 wt.%) and solder-joint geometry (barrel and hourglass types) on solder-joint fatigue behavior and reliability. The solder joints were composed of fine particles of Ag3Sn and Cu6Sn5, which aggregated as an eutectic constituent at grain boundaries of the primary β-Sn phase and formed a dense network structure. A decrease in the Ag content resulted in coarsening of the β-Sn and eutectic phases, which, in turn, decreased the strength of the joint and caused earlier failure. Solder joints in the hourglass form exhibited better fatigue performance with longer life than barrel-type joints. The sharp contact angle formed between the solder and the Cu substrate by the barrel-type joints concentrated stress, which compromised fatigue reliability. The addition of Ag to the solder, however, enhanced fatigue performance because of strengthening caused by Ag3Sn formation. The cracks of the barrel-type SAC solder joints originated mostly at the contact corner and propagated along the interfacial layer between the interfacial intermetallic compound (IMC) and solder matrix. Hourglass-type solder joints, however, demonstrated both crack initiation and propagation in the solder matrix (solder mode). The addition of 1.5-2.0 wt.% Ag to SAC solder appears to enhance the fatigue performance of solder joints while maintaining sufficient strength.

  3. Laser welding of vas deferens in rodents: initial experience with fluid solders.

    Science.gov (United States)

    Trickett, R I; Wang, D; Maitz, P; Lanzetta, M; Owen, E R

    1998-01-01

    This study evaluates the use of sutureless laser welding for vasovasostomy. In 14 rodents, the left vas deferens underwent vasovasostomy using an albumin-based solder applied to the adventitia of the vas deferens. The solder contained the dye, indocyanine green, to allow selective absorption and denaturation by a fiber-coupled 800-nm diode laser. The right vas deferens served as a control, receiving conventional layered microsurgical repair. We used a removable 4/0 nylon stent and microclamps to appose the vas deferens during repair, with no need for stay sutures. The mean time to perform laser solder repair (23.5 min) and conventional repair (23.3 min) were not significantly different (P=0.91). However, examination after 8 weeks showed that granuloma formation (G) and patency (P) rates for the conventional suture technique (G, 14%; P, 93%) were significantly better than observed for the laser solder technique (G, 57%; P, 50%).

  4. Effects of rework on adhesion of Pb-In soldered gold thick films

    International Nuclear Information System (INIS)

    Gehman, R.W.; Becka, G.A.; Losure, J.A.

    1982-02-01

    The feasibility of repeatedly reworking Pb-In soldered joints on gold thick films was evaluated. Nailhead adhesion tests on soldered thick films typically resulted in failure within the bulk solder (50 In-50 Pb). Average strengths increased with each rework, and the failure mode changed. An increase in metalization lift-off occurred with successive reworks. An investigation was initiated to determine why these changes occurred. Based on this work, the thick film adhesion to the substrate appeared to be lowered by indium reduction of cadmium oxide and by formation of a weak, brittle intermetallic compound, Au 9 In 4 . It was concluded that two solder reworks could be conducted without significant amounts of metallization lift-off during nailhead testing

  5. Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

    Science.gov (United States)

    Hasnine, M.; Tolla, B.; Vahora, N.

    2018-04-01

    This paper explores the effects of aging on the mechanical behavior, microstructure evolution and IMC formation on different surface finishes of two high temperature solders, Sn-5 wt.% Ag and Sn-5 wt.% Sb. High temperature aging showed significant degradation of Sn-5 wt.% Ag solder hardness (34%) while aging has little effect on Sn-5 wt.% Sb solder. Sn-5 wt.% Ag experienced rapid grain growth as well as the coarsening of particles during aging. Sn-5 wt.% Sb showed a stable microstructure due to solid solution strengthening and the stable nature of SnSb precipitates. The increase of intermetallic compound (IMC) thickness during aging follows a parabolic relationship with time. Regression analysis (time exponent, n) indicated that IMC growth kinetics is controlled by a diffusion mechanism. The results have important implications in the selection of high temperature solders used in high temperature applications.

  6. A framework to monitor activities of satellite data processing in real-time

    Science.gov (United States)

    Nguyen, M. D.; Kryukov, A. P.

    2018-01-01

    Space Monitoring Data Center (SMDC) of SINP MSU is one of the several centers in the world that collects data on the radiational conditions in near-Earth orbit from various Russian (Lomonosov, Electro-L1, Electro-L2, Meteor-M1, Meteor-M2, etc.) and foreign (GOES 13, GOES 15, ACE, SDO, etc.) satellites. The primary purposes of SMDC are: aggregating heterogeneous data from different sources; providing a unified interface for data retrieval, visualization, analysis, as well as development and testing new space weather models; and controlling the correctness and completeness of data. Space weather models rely on data provided by SMDC to produce forecasts. Therefore, monitoring the whole data processing cycle is crucial for further success in the modeling of physical processes in near-Earth orbit based on the collected data. To solve the problem described above, we have developed a framework called Live Monitor at SMDC. Live Monitor allows watching all stages and program components involved in each data processing cycle. All activities of each stage are logged by Live Monitor and shown in real-time on a web interface. When an error occurs, a notification message will be sent to satellite operators via email and the Telegram messenger service so that they could take measures in time. The Live Monitor’s API can be used to create a customized monitoring service with minimum coding.

  7. Current State and Development of Land Degradation Processes Based on Soil Monitoring in Slovakia

    Directory of Open Access Journals (Sweden)

    Kobza Jozef

    2017-08-01

    Full Text Available Current state and development of land degradation processes based on soil monitoring system in Slovakia is evaluated in this contribution. Soil monitoring system in Slovakia is consistently running since 1993 year in 5-years repetitions. Soil monitoring network in Slovakia is constructed using ecological principle, taking into account all main soil types and subtypes, soil organic matter, climatic regions, emission regions, polluted and non-polluted regions as well as various land use. The result of soil monitoring network is 318 sites on agricultural land in Slovakia. Soil properties are evaluated according to the main threats to soil relating to European Commission recommendation for European soil monitoring performance as follows: soil erosion and compaction, soil acidification, decline in soil organic matter and soil contamination. The most significant change has been determined in physical degradation of soils. The physical degradation was especially manifested in compacted and the eroded soils. It was determined that about 39% of agricultural land is potentially affected by soil erosion in Slovakia. In addition, slight decline in soil organic matter indicates the serious facts on evaluation and extension of soil degradation processes during the last period in Slovakia. Soil contamination is without significant change for the time being. It means the soils contaminated before soil monitoring process this unfavourable state lasts also at present.

  8. The creep behavior of In-Ag eutectic solder joints

    International Nuclear Information System (INIS)

    Reynolds, H.L.; Kang, S.H.; Morris, J.W. Jr.; Univ. of California, Berkeley, CA

    1999-01-01

    The addition of 3 wt.% Ag to In results in a eutectic composition with improved mechanical properties while only slightly lowering the melting temperature. Steady-state creep properties of In-Ag eutectic solder joints have been measured using constant load tests at 0, 30, 60, and 90 C. Constitutive equations are derived to describe the creep behavior. The data are well represented by an equation of the form proposed by Dorn: a power-law equation applies to each independent creep mechanism. Two parallel mechanisms were observed for the In-Ag eutectic joints. The high-stress mechanism is a bulk mechanism with a thermal dependence dominated by the thermal dependence of creep in the In-rich matrix. The low-stress mechanism is a grain boundary mechanism. Results of this work are discussed with regard to creep behavior of typical eutectic systems

  9. Process modeling and control applied to real-time monitoring of distillation processes by near-infrared spectroscopy.

    Science.gov (United States)

    de Oliveira, Rodrigo R; Pedroza, Ricardo H P; Sousa, A O; Lima, Kássio M G; de Juan, Anna

    2017-09-08

    A distillation device that acquires continuous and synchronized measurements of temperature, percentage of distilled fraction and NIR spectra has been designed for real-time monitoring of distillation processes. As a process model, synthetic commercial gasoline batches produced in Brazil, which contain mixtures of pure gasoline blended with ethanol have been analyzed. The information provided by this device, i.e., distillation curves and NIR spectra, has served as initial information for the proposal of new strategies of process modeling and multivariate statistical process control (MSPC). Process modeling based on PCA batch analysis provided global distillation trajectories, whereas multiset MCR-ALS analysis is proposed to obtain a component-wise characterization of the distillation evolution and distilled fractions. Distillation curves, NIR spectra or compressed NIR information under the form of PCA scores and MCR-ALS concentration profiles were tested as the seed information to build MSPC models. New on-line PCA-based MSPC approaches, some inspired on local rank exploratory methods for process analysis, are proposed and work as follows: a) MSPC based on individual process observation models, where multiple local PCA models are built considering the sole information in each observation point; b) Fixed Size Moving Window - MSPC, in which local PCA models are built considering a moving window of the current and few past observation points; and c) Evolving MSPC, where local PCA models are built with an increasing window of observations covering all points since the beginning of the process until the current observation. Performance of different approaches has been assessed in terms of sensitivity to fault detection and number of false alarms. The outcome of this work will be of general use to define strategies for on-line process monitoring and control and, in a more specific way, to improve quality control of petroleum derived fuels and other substances submitted

  10. Revised ground-water monitoring compliance plan for the 300 area process trenches

    Energy Technology Data Exchange (ETDEWEB)

    Schalla, R.; Aaberg, R.L.; Bates, D.J.; Carlile, J.V.M.; Freshley, M.D.; Liikala, T.L.; Mitchell, P.J.; Olsen, K.B.; Rieger, J.T.

    1988-09-01

    This document contains ground-water monitoring plans for process-water disposal trenches located on the Hanford Site. These trenches, designated the 300 Area Process Trenches, have been used since 1973 for disposal of water that contains small quantities of both chemicals and radionuclides. The ground-water monitoring plans contained herein represent revision and expansion of an effort initiated in June 1985. At that time, a facility-specific monitoring program was implemented at the 300 Area Process Trenches as part of a regulatory compliance effort for hazardous chemicals being conducted on the Hanford Site. This monitoring program was based on the ground-water monitoring requirements for interim-status facilities, which are those facilities that do not yet have final permits, but are authorized to continue interim operations while engaged in the permitting process. The applicable monitoring requirements are described in the Resource Conservation and Recovery Act (RCRA), 40 CFR 265.90 of the federal regulations, and in WAC 173-303-400 of Washington State's regulations (Washington State Department of Ecology 1986). The program implemented for the process trenches was designed to be an alternate program, which is required instead of the standard detection program when a facility is known or suspected to have contaminated the ground water in the uppermost aquifer. The plans for the program, contained in a document prepared by the US Department of Energy (USDOE) in 1985, called for monthly sampling of 14 of the 37 existing monitoring wells at the 300 Area plus the installation and sampling of 2 new wells. 27 refs., 25 figs., 15 tabs.

  11. Research progress of laser welding process dynamic monitoring technology based on plasma characteristics signal

    Directory of Open Access Journals (Sweden)

    Teng WANG

    2017-02-01

    Full Text Available During the high-power laser welding process, plasmas are induced by the evaporation of metal under laser radiation, which can affect the coupling of laser energy and the workpiece, and ultimately impact on the reliability of laser welding quality and process directly. The research of laser-induced plasma is a focus in high-power deep penetration welding field, which provides a promising research area for realizing the automation of welding process quality inspection. In recent years, the research of laser welding process dynamic monitoring technology based on plasma characteristics is mainly in two aspects, namely the research of plasma signal detection and the research of laser welding process modeling. The laser-induced plasma in the laser welding is introduced, and the related research of laser welding process dynamic monitoring technology based on plasma characteristics at home and abroad is analyzed. The current problems in the field are summarized, and the future development trend is put forward.

  12. Monitoring and modelling of a continuous from-powder-to-tablet process line

    DEFF Research Database (Denmark)

    Mortier, Séverine T.F.C.; Nopens, Ingmar; De Beer, Thomas

    2014-01-01

    -time adjustment of critical input variables to ensure that the process stays within the Design Space. Mechanistic models are very useful for this purpose as, once validated, several tools can be applied to gain further process knowledge, for example uncertainty and sensitivity analysis. In addition, several......The intention to shift from batch to continuous production processes within the pharmaceutical industry enhances the need to monitor and control the process in-line and real-time to continuously guarantee the end-product quality. Mass and energy balances have been successfully applied to a drying...... process which is part of a continuous from-powder-to-tablet manufacturing line to calculate the residual moisture content of granules leaving the drying unit on the basis of continuously generated data from univariate sensors. Next to monitoring, the application of continuous processes demands also real...

  13. Effects of voids on thermal-mechanical reliability of lead-free solder joints

    Directory of Open Access Journals (Sweden)

    Benabou Lahouari

    2014-06-01

    Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

  14. Investigation into mechanical properties of joints of heterogeneous materials brazed with high-temperature solders

    International Nuclear Information System (INIS)

    Lomenko, V.I.; Merkushev, V.P.; Borodina, L.M.; Sycheva, T.S.; Tokhtina, O.A.; Frolov, N.N.

    1988-01-01

    Mechanical properties of copper joints with copper, 12Kh18M10T steel and KhD50 composite obtained by vacuum brazing by copper-titanium solder as compared with properties of joints brazed by PSr 72 and PMFOTsr 6-4-0.03 solders in hydrogen are studied. Dependences of joints strength on temperature of contact - reactive vacuum brazing are obtained. Possible applications of joints of dissimilar materials in electrovacuum devices subjected to the effect of dynamic loadings are established

  15. Panorama Image Processing for Condition Monitoring with Thermography in Power Plant

    Energy Technology Data Exchange (ETDEWEB)

    Jeon, Byoung Joon; Kim, Tae Hwan; Kim, Soon Geol; Mo, Yoon Syub [UNETWARE, Seoul (Korea, Republic of); Kim, Won Tae [Kongju National University, Gongju (Korea, Republic of)

    2010-04-15

    In this paper, imaging processing study obtained from CCD image and thermography image was performed in order to treat easily thermographic data without any risks of personnel who conduct the condition monitoring for the abnormal or failure status occurrable in industrial power plants. This imaging processing is also applicable to the predictive maintenance. For confirming the broad monitoring, a methodology producting single image from the panorama technique was developed no matter how many cameras are employed, including fusion method for discrete configuration for the target. As results, image fusion from quick realtime processing was obtained and it was possible to save time to track the location monitoring in matching the images between CCTV and thermography

  16. Panorama Image Processing for Condition Monitoring with Thermography in Power Plant

    International Nuclear Information System (INIS)

    Jeon, Byoung Joon; Kim, Tae Hwan; Kim, Soon Geol; Mo, Yoon Syub; Kim, Won Tae

    2010-01-01

    In this paper, imaging processing study obtained from CCD image and thermography image was performed in order to treat easily thermographic data without any risks of personnel who conduct the condition monitoring for the abnormal or failure status occurrable in industrial power plants. This imaging processing is also applicable to the predictive maintenance. For confirming the broad monitoring, a methodology producting single image from the panorama technique was developed no matter how many cameras are employed, including fusion method for discrete configuration for the target. As results, image fusion from quick realtime processing was obtained and it was possible to save time to track the location monitoring in matching the images between CCTV and thermography

  17. On-Line Monitoring of Fermentation Processes by Near Infrared and Fluorescence Spectroscopy

    DEFF Research Database (Denmark)

    Svendsen, Carina

    Monitoring and control of fermentation processes is important to ensure high product yield, product quality and product consistency. More knowledge on on-line analytical techniques such as near infrared and fluorescence spectroscopy is desired in the fermentation industry to increase the efficiency...... of on-line monitoring systems. The primary aim of this thesis is to elucidate and explore the dynamics in fermentation processes by spectroscopy. Though a number of successful on-line lab-scale monitoring systems have been reported, it seems that several challenges are still met, which limits the number...... of full-scale systems implemented in industrial fermentation processes. This thesis seeks to achieve a better understanding of the techniques near infrared and fluorescence spectroscopy and thereby to solve some of the challenges that are encountered. The thesis shows the advantages of applying real...

  18. Cider fermentation process monitoring by Vis-NIR sensor system and chemometrics.

    Science.gov (United States)

    Villar, Alberto; Vadillo, Julen; Santos, Jose I; Gorritxategi, Eneko; Mabe, Jon; Arnaiz, Aitor; Fernández, Luis A

    2017-04-15

    Optimization of a multivariate calibration process has been undertaken for a Visible-Near Infrared (400-1100nm) sensor system, applied in the monitoring of the fermentation process of the cider produced in the Basque Country (Spain). The main parameters that were monitored included alcoholic proof, l-lactic acid content, glucose+fructose and acetic acid content. The multivariate calibration was carried out using a combination of different variable selection techniques and the most suitable pre-processing strategies were selected based on the spectra characteristics obtained by the sensor system. The variable selection techniques studied in this work include Martens Uncertainty test, interval Partial Least Square Regression (iPLS) and Genetic Algorithm (GA). This procedure arises from the need to improve the calibration models prediction ability for cider monitoring. Copyright © 2016 Elsevier Ltd. All rights reserved.

  19. The Multi-Isotope Process (MIP) Monitor Project: FY13 Final Report

    Energy Technology Data Exchange (ETDEWEB)

    Meier, David E. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Coble, Jamie B. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Jordan, David V. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Mcdonald, Luther W. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Forrester, Joel B. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Schwantes, Jon M. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Unlu, Kenan [Pennsylvania State Univ., University Park, PA (United States); Landsberger, Sheldon [Univ. of Texas, Austin, TX (United States); Bender, Sarah [Pennsylvania State Univ., University Park, PA (United States); Dayman, Kenneth J. [Univ. of Texas, Austin, TX (United States); Reilly, Dallas D. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States)

    2013-09-01

    The Multi-Isotope Process (MIP) Monitor provides an efficient approach to monitoring the process conditions in reprocessing facilities in support of the goal of “… (minimization of) the risks of nuclear proliferation and terrorism.” The MIP Monitor measures the distribution of the radioactive isotopes in product and waste streams of a nuclear reprocessing facility. These isotopes are monitored online by gamma spectrometry and compared, in near-real-time, to spectral patterns representing “normal” process conditions using multivariate analysis and pattern recognition algorithms. The combination of multivariate analysis and gamma spectroscopy allows us to detect small changes in the gamma spectrum, which may indicate changes in process conditions. By targeting multiple gamma-emitting indicator isotopes, the MIP Monitor approach is compatible with the use of small, portable, relatively high-resolution gamma detectors that may be easily deployed throughout an existing facility. The automated multivariate analysis can provide a level of data obscurity, giving a built-in information barrier to protect sensitive or proprietary operational data. Proof-of-concept simulations and experiments have been performed in previous years to demonstrate the validity of this tool in a laboratory setting for systems representing aqueous reprocessing facilities. However, pyroprocessing is emerging as an alternative to aqueous reprocessing techniques.

  20. A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

    Directory of Open Access Journals (Sweden)

    Enrico Mick

    2015-07-01

    Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.