WorldWideScience

Sample records for soldering materials design

  1. Solder joint technology materials, properties, and reliability

    CERN Document Server

    Tu, King-Ning

    2007-01-01

    Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

  2. The constitutive response of three solder materials

    International Nuclear Information System (INIS)

    Perez-Bergquist, Alejandro G.; Cao Fang; Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T.

    2012-01-01

    Highlights: ► The full constitutive response of three solder materials. ► Test temperatures from −196 °C to 60 °C and strain rates from 10 −3 to >10 3 s −1 . ► Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (−196 °C to 60 °C) and strain rate (10 −3 to >10 3 s −1 ). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  3. The constitutive response of three solder materials

    Energy Technology Data Exchange (ETDEWEB)

    Perez-Bergquist, Alejandro G., E-mail: alexpb@lanl.gov [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States); Cao Fang [Exxon Mobil Research and Engineering Company, Annadale, NJ 08801 (United States); Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T. [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States)

    2012-05-25

    Highlights: Black-Right-Pointing-Pointer The full constitutive response of three solder materials. Black-Right-Pointing-Pointer Test temperatures from -196 Degree-Sign C to 60 Degree-Sign C and strain rates from 10{sup -3} to >10{sup 3} s{sup -1}. Black-Right-Pointing-Pointer Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (-196 Degree-Sign C to 60 Degree-Sign C) and strain rate (10{sup -3} to >10{sup 3} s{sup -1}). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  4. Microstructure evolution and thermomechanical fatigue of solder materials

    NARCIS (Netherlands)

    Matin, M.A.

    2005-01-01

    The microelectronics industry is confronted with the new challenge to produce joints with lead-free solder materials replacing classical tin-lead solders in devices used in many fields (e.g. consumer electronics, road transport, aviation, space-crafts, telecommunication). In service, solder

  5. Soldering handbook

    CERN Document Server

    Vianco, Paul T

    1999-01-01

    Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

  6. How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

    Science.gov (United States)

    Suhir, E.; Yi, S.; Ghaffarian, R.

    2017-03-01

    It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

  7. Soluble Lead and Bismuth Chalcogenidometallates: Versatile Solders for Thermoelectric Materials

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Hao [Department; Son, Jae Sung [Department; School; Dolzhnikov, Dmitriy S. [Department; Filatov, Alexander S. [Department; Hazarika, Abhijit [Department; Wang, Yuanyuan [Department; Hudson, Margaret H. [Department; Sun, Cheng-Jun [Advanced; Chattopadhyay, Soma [Physical; Talapin, Dmitri V. [Department; Center

    2017-07-27

    Here we report the syntheses of largely unexplored lead and bismuth chalcogenidometallates in the solution phase. Using N2H4 as the solvent, new compounds such as K6Pb3Te6·7N2H4 were obtained. These soluble molecular compounds underwent cation exchange processes using resin chemistry, replacing Na+ or K+ by decomposable N2H5+ or tetraethylammonium cations. They also transformed into stoichiometric lead and bismuth chalcogenide nanomaterials with the addition of metal salts. Such a versatile chemistry led to a variety of composition-matched solders to join lead and bismuth chalcogenides and tune their charge transport properties at the grain boundaries. Solution-processed thin films composed of Bi0.5Sb1.5Te3 microparticles soldered by (N2H5)6Bi0.5Sb1.5Te6 exhibited thermoelectric power factors (~28 μW/cm K2) comparable to those in vacuum-deposited Bi0.5Sb1.5Te3 films. The soldering effect can also be integrated with attractive fabrication techniques for thermoelectric modules, such as screen printing, suggesting the potential of these solders in the rational design of printable and moldable thermoelectrics.

  8. Investigation of moisture uptake into printed circuit board laminate and solder mask materials

    DEFF Research Database (Denmark)

    Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti

    2017-01-01

    with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

  9. Investigation into mechanical properties of joints of heterogeneous materials brazed with high-temperature solders

    International Nuclear Information System (INIS)

    Lomenko, V.I.; Merkushev, V.P.; Borodina, L.M.; Sycheva, T.S.; Tokhtina, O.A.; Frolov, N.N.

    1988-01-01

    Mechanical properties of copper joints with copper, 12Kh18M10T steel and KhD50 composite obtained by vacuum brazing by copper-titanium solder as compared with properties of joints brazed by PSr 72 and PMFOTsr 6-4-0.03 solders in hydrogen are studied. Dependences of joints strength on temperature of contact - reactive vacuum brazing are obtained. Possible applications of joints of dissimilar materials in electrovacuum devices subjected to the effect of dynamic loadings are established

  10. Lead free solder mechanics and reliability

    CERN Document Server

    Pang, John Hock Lye

    2012-01-01

    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

  11. Design of Experiments to Determine Causes of Flex Cable Solder Wicking, Discoloration and Hole Location Defects

    Energy Technology Data Exchange (ETDEWEB)

    Wolfe, Larry

    2009-04-22

    Design of Experiments (DoE) were developed and performed in an effort to discover and resolve the causes of three different manufacturing issues; large panel voids after Hot Air Solder Leveling (HASL), cable hole locations out of tolerance after lamination and delamination/solder wicking around flat flex cable circuit lands after HASL. Results from a first DoE indicated large panel voids could be eliminated by removing the pre-HASL cleaning. It also revealed eliminating the pre-HASL bake would not be detrimental when using a hard press pad lamination stackup. A second DoE indicated a reduction in hard press pad stackup lamination pressure reduced panel stretch in the y axis approximately 70%. A third DoE illustrated increasing the pre-HASL bake temperature could reduce delamination/solder wicking when using a soft press pad lamination stackup.

  12. Interface between Sn-Sb-Cu solder and copper substrate

    Energy Technology Data Exchange (ETDEWEB)

    Sebo, P., E-mail: Pavel.Sebo@savba.sk [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Racianska 75, 831 02 Bratislava 3 (Slovakia); Svec, P. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janickovic, D.; Illekova, E. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine)

    2011-07-15

    Highlights: {yields} New lead-free solder materials based on Sn-Sb-Cu were designed and prepared. {yields} Melting and solidification temperatures of the solders have been determined. {yields} Cu-substrate/solder interaction has been analyzed and quantified. {yields} Phases formed at the solder-substrate interface have been identified. {yields} Composition and soldering atmospheres were correlated with joint strength. - Abstract: Influence of antimony and copper in Sn-Sb-Cu solder on the melting and solidification temperatures and on the microstructure of the interface between the solder and copper substrate after wetting the substrate at 623 K for 1800 s were studied. Microstructure of the interface between the solder and copper substrates in Cu-solder-Cu joints prepared at the same temperature for 1800 s was observed and shear strength of the joints was measured. Influence of the atmosphere - air with the flux and deoxidising N{sub 2} + 10H{sub 2} gas - was taken into account. Thermal stability and microstructure were studied by differential scanning calorimetry (DSC), light microscopy, scanning electron microscopy (SEM) with energy-dispersive spectrometry (EDS) and X-ray diffraction (XRD). Melting and solidification temperatures of the solders were determined. An interfacial transition zone was formed by diffusion reaction between solid copper and liquid solder. At the interface Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} phases arise. Cu{sub 3}Sn is adjacent to the Cu substrate and its thickness decreases with increasing the amount of copper in solder. Scallop Cu{sub 6}Sn{sub 5} phase is formed also inside the solder drop. The solid solution Sn(Sb) and SbSn phase compose the interior of the solder drop. Shear strength of the joints measured by push-off method decreases with increasing Sb concentration. Copper in the solder shows even bigger negative effect on the strength.

  13. Assessment of the effects of the Japanese shift to lead-free solders and its impact on material substitution and environmental emissions by a dynamic material flow analysis

    International Nuclear Information System (INIS)

    Fuse, Masaaki; Tsunemi, Kiyotaka

    2012-01-01

    Lead-free electronics has been extensively studied, whereas their adoption by society and their impact on material substitution and environmental emissions are not well understood. Through a material flow analysis (MFA), this paper explores the life cycle flows for solder-containing metals in Japan, which leads the world in the shift to lead-free solders in electronics. The results indicate that the shift has been progressing rapidly for a decade, and that substitutes for lead in solders, which include silver and copper, are still in the early life cycle stages. The results also show, however, that such substitution slows down during the late life cycle stages owing to long electronic product lifespans. This deceleration of material substitution in the solder life cycle may not only preclude a reduction in lead emissions to air but also accelerate an increase in silver emissions to air and water. As an effective measure against ongoing lead emissions, our scenario analysis suggests an aggressive recycling program for printed circuit boards that utilizes an existing recycling scheme. -- Highlights: ► We model the life cycle flows for solder-containing metals in Japan. ► The Japanese shift to lead-free solders progresses rapidly for a decade. ► Substitution for lead in solders slows down during the late life cycle stages. ► The deceleration of substitution precludes a reduction in lead emissions to air.

  14. Designing Material Materialising Design

    DEFF Research Database (Denmark)

    Nicholas, Paul

    2013-01-01

    Designing Material Materialising Design documents five projects developed at the Centre for Information Technology and Architecture (CITA) at the Royal Danish Academy of Fine Arts, School of Architecture. These projects explore the idea that new designed materials might require new design methods....... Focusing on fibre reinforced composites, this book sustains an exploration into the design and making of elastically tailored architectural structures that rely on the use of computational design to predict sensitive interdependencies between geometry and behaviour. Developing novel concepts...

  15. A novel method for direct solder bump pull testing using lead-free solders

    Science.gov (United States)

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  16. Complications with computer-aided designed/computer-assisted manufactured titanium and soldered gold bars for mandibular implant-overdentures: short-term observations.

    Science.gov (United States)

    Katsoulis, Joannis; Wälchli, Julia; Kobel, Simone; Gholami, Hadi; Mericske-Stern, Regina

    2015-01-01

    Implant-overdentures supported by rigid bars provide stability in the edentulous atrophic mandible. However, fractures of solder joints and matrices, and loosening of screws and matrices were observed with soldered gold bars (G-bars). Computer-aided designed/computer-assisted manufactured (CAD/CAM) titanium bars (Ti-bars) may reduce technical complications due to enhanced material quality. To compare prosthetic-technical maintenance service of mandibular implant-overdentures supported by CAD/CAM Ti-bar and soldered G-bar. Edentulous patients were consecutively admitted for implant-prosthodontic treatment with a maxillary complete denture and a mandibular implant-overdenture connected to a rigid G-bar or Ti-bar. Maintenance service and problems with the implant-retention device complex and the prosthesis were recorded during minimally 3-4 years. Annual peri-implant crestal bone level changes (ΔBIC) were radiographically assessed. Data of 213 edentulous patients (mean age 68 ± 10 years), who had received a total of 477 tapered implants, were available. Ti-bar and G-bar comprised 101 and 112 patients with 231 and 246 implants, respectively. Ti-bar mostly exhibited distal bar extensions (96%) compared to 34% of G-bar (p overdentures supported by soldered gold bars or milled CAD/CAM Ti-bars are a successful treatment modality but require regular maintenance service. These short-term observations support the hypothesis that CAD/CAM Ti-bars reduce technical complications. Fracture location indicated that the titanium thickness around the screw-access hole should be increased. © 2013 Wiley Periodicals, Inc.

  17. The thermodynamic database COST MP0602 for materials for high-temperature lead-free soldering

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Dinsdale, A.; Watson, A.; Vřešťál, J.; Zemanová, Adéla; Brož, P.

    2012-01-01

    Roč. 48, č. 3 (2012), s. 339-346 ISSN 1450-5339 R&D Projects: GA MŠk LD11024 Institutional support: RVO:68081723 Keywords : CALPHAD method * lead-free solders * thermodynamic database Subject RIV: BJ - Thermodynamics Impact factor: 1.435, year: 2012

  18. Soldering of Nanotubes onto Microelectrodes

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing sold...... bonds were consistently found to be mechanically stronger than the carbon nanotubes.......Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...

  19. Soldering of Mg Joints Using Zn-Al Solders

    Science.gov (United States)

    Gancarz, Tomasz; Berent, Katarzyna; Skuza, Wojciech; Janik, Katarzyna

    2018-04-01

    Magnesium has applications in the automotive and aerospace industries that can significantly contribute to greater fuel economy and environmental conservation. The Mg alloys used in the automotive industry could reduce mass by up to 70 pct, providing energy savings. However, alongside the advantages there are limitations and technological barriers to use Mg alloys. One of the advantages concerns phenomena occurring at the interface when joining materials investigated in this study, in regard to the effect of temperature and soldering time for pure Mg joints. Eutectic Zn-Al and Zn-Al alloys with 0.05 (wt pct) Li and 0.2 (wt pct) Na were used in the soldering process. The process was performed for 3, 5, and 8 minutes of contact, at temperatures of 425 °C, 450 °C, 475 °C, and 500 °C. Selected, solidified solder-substrate couples were cross-sectioned, and their interfacial microstructures were investigated by scanning electron microscopy. The experiment was designed to demonstrate the effect of time, temperature, and the addition of Li and Na on the kinetics of the dissolving Mg substrate. The addition of Li and Na to eutectic Zn-Al caused to improve mechanical properties. Higher temperatures led to reduced joint strength, which is caused by increased interfacial reaction.

  20. Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack

    Directory of Open Access Journals (Sweden)

    Shoudong Gu

    2016-06-01

    Full Text Available To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT (Surface Mount Technology production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process. Here, the critical jet ejection velocity is discussed through theoretical analysis. The relations between ejection velocity and needle structure, needle velocity, and nozzle diameter were obtained by FLUENT software. Then, the prototype of the solder paste jetting system was fabricated, and the performance was verified by experiments. The effects of the gap between nozzle and needle, the driving voltage, and the nozzle diameter on the jetting performance and droplet diameter were obtained. Solder paste droplets 0.85 mm in diameter were produced when the gap between the nozzle and needle was adjusted to 10 μm, the driving voltage to 80 V, the nozzle diameter to 0.1 mm, and the variation of the droplet diameter was within ±3%.

  1. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xiao, H., E-mail: xiaohui2013@yahoo.com.cn; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-11-25

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R{sub 0}/R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints.

  2. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    International Nuclear Information System (INIS)

    Xiao, H.; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-01-01

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R 0 /R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints

  3. Solderability study of RABiTS-based YBCO coated conductors

    International Nuclear Information System (INIS)

    Zhang Yifei; Duckworth, Robert C.; Ha, Tam T.; Gouge, Michael J.

    2011-01-01

    Study examines the implication of solder and flux selection in YBCO splice joints. Focus is on commercially available RABiTS-based YBCO coated conductors. Solderability varied with solder and flux for three different stabilizations tested. Resistivity of stabilizer was dominant factor in splice joint resistance. Solder materials affected splice joint resistance when solderability was poor. The solderability of commercially available YBa 2 Cu 3 O 7-x (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

  4. Spontaneous soldering

    International Nuclear Information System (INIS)

    Percacci, R.

    1984-01-01

    It is proposed that the soldering form of general relativity be treated as a dynamical variable. This gives rise to the possibility of treating the linear connection on (n-dimensional) spacetime and an internal O(k)-Yang-Mills field as different components of the same O(N) gauge field (N= n+k). The distinction between gravitational and Yang-Mills interactions is due to a kind of Higgs mechanism driven by the vacuum expectation value of the soldering form. (orig.)

  5. Energy and intensity distributions of 0.279 MeV multiply Compton-scattered photons in soldering material

    International Nuclear Information System (INIS)

    Singh, Manpreet; Singh, Gurvinderjit; Singh, Bhajan; Sandhu, B.S.

    2007-01-01

    An inverse response matrix converts the observed pulse-height distribution of a NaI(Tl) scintillation detector to a photon spectrum. This also results in extraction of intensity distribution of multiply scattered events originating from interactions of 0.279 MeV photons with thick targets of soldering material. The observed pulse-height distributions are a composite of singly and multiply scattered events in addition to bremmstrahlung-and Rayleigh-scattered events. To evaluate the contribution of multiply scattered events, the spectrum of singly scattered events contributing to inelastic Compton peak is reconstructed analytically. The optimum thickness (saturation depth), at which the number of multiply scattered events saturates, has been measured. Monte Carlo calculations also support the present results

  6. Soldering in electronics assembly

    CERN Document Server

    Judd, Mike

    2013-01-01

    Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

  7. SMT soldering handbook

    National Research Council Canada - National Science Library

    Strauss, Rudolf

    1998-01-01

    ... 3.2.1 Constituents, melting behaviour and mechanical properties 3.2.2 Composition of solders for use in electronics 3.2.3 Lead-free solders 3.2.4 Solder impurities The soldered joint 3.3.1 Solde...

  8. Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloy

    DEFF Research Database (Denmark)

    Malik, Safdar Abbas; Le, Thanh Hung; Van Nong, Ngo

    2018-01-01

    and metallic electrodes. In this paper, we investigate the joining of ZnSb to Ni and Ag electrodes using a commercial solder alloy S-Bond 400 and hot-pressing technique. Ti and Cr layers are also introduced as a diffusion barrier and microstructure at the interfaces is observed by scanning electron microscopy....... We found that S-bond 400 solder reacts with Ag and Ni electrodes to form different alloys at the interfaces. Cr layer was found to be broken after joining, resulting in a thicker reaction/diffusion layer at the interface, while Ti layer was preserved....

  9. Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

    International Nuclear Information System (INIS)

    Koo, Jahyun; Lee, Changsoo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck Mo

    2015-01-01

    It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu_3_3Al_1_7, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu_6Sn_5 networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu_6Sn_5 IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu_3_3Al_1_7 IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

  10. Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

    Energy Technology Data Exchange (ETDEWEB)

    Koo, Jahyun; Lee, Changsoo [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of); Hong, Sung Jea [MK Electron Co., Ltd., Yongin Cheoin-gu 316-2 (Korea, Republic of); Kim, Keun-Soo, E-mail: keunsookim@hoseo.edu [Department of Display Engineering, Hoseo University, Asan 336-795 (Korea, Republic of); Lee, Hyuck Mo, E-mail: hmlee@kaist.ac.kr [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of)

    2015-11-25

    It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu{sub 33}Al{sub 17}, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu{sub 6}Sn{sub 5} networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu{sub 6}Sn{sub 5} IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu{sub 33}Al{sub 17} IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

  11. Features of soldering of molybdenum a lols

    International Nuclear Information System (INIS)

    Grishin, V.L.; Rybkin, B.V.; Cherkasov, A.F.

    1980-01-01

    Soldering features of complex-alloy molybdenum alloys were investigated in comparison with alloys based on solid solutions. Soldering features of heterogeneous molybdenum base alloys were investigated using samples of 0.5-1.O mm sheets with the strain of about 95% made of ingots which had been smelted in arc vacuum furnaces. The soldering of samples was carried out in 5x1O -5 mm Hg vacuum using different sources of heating: radiation, electron-ray and contact. It was shown that heat-resisting soldered joints of heterogeneous molybdenum alloys could be produced using zirconium and niobium base solders containing the most effective hardeners of the parent material (titanum, vanadium, tantalum, molybdenum, tungsten). To preserve high mechanical properties of heterogeneous alloys it was expedient to use for welding local heating sources which permitted to decrease considerably temperature- time conditions of the process

  12. Laser assisted soldering: microdroplet accumulation with a microjet device.

    Science.gov (United States)

    Chan, E K; Lu, Q; Bell, B; Motamedi, M; Frederickson, C; Brown, D T; Kovach, I S; Welch, A J

    1998-01-01

    We investigated the feasibility of a microjet to dispense protein solder for laser assisted soldering. Successive micro solder droplets were deposited on rat dermis and bovine intima specimens. Fixed laser exposure was synchronized with the jetting of each droplet. After photocoagulation, each specimen was cut into two halves at the center of solder coagulum. One half was fixed immediately, while the other half was soaked in phosphate-buffered saline for a designated hydration period before fixation (1 hour, 1, 2, and 7 days). After each hydration period, all tissue specimens were prepared for scanning electron microscopy (SEM). Stable solder coagulum was created by successive photocoagulation of microdroplets even after the soldered tissue exposed to 1 week of hydration. This preliminary study suggested that tissue soldering with successive microdroplets is feasible even with fixed laser parameters without active feedback control.

  13. Designing with residual materials

    NARCIS (Netherlands)

    Walhout, W.; Wever, R.; Blom, E.; Addink-Dölle, L.; Tempelman, E.

    2013-01-01

    Many entrepreneurial businesses have attempted to create value based on the residual material streams of third parties. Based on ‘waste’ materials they designed products, around which they built their company. Such activities have the potential to yield sustainable products. Many of such companies

  14. Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints

    International Nuclear Information System (INIS)

    Liu, X.W.; Plumbridge, W.J.

    2003-01-01

    The fatigue of Sn-37 wt.% Pb model solder joints has been investigated under thermomechanical and thermal cycling. Based upon an analysis of displacements during thermomechancial cycling, a model solder joint has been designed to simulate actual joints in electronic packages. The strain-stress relationship, characterised by hysteresis loops, was determined during cycling from 30 to 125 deg. C, and the stress-range monitored throughout. The number of cycles to failure, as defined by the fall in stress range, was correlated to strain range and strain energy. The strain hardening exponent, k, varied with the definition of failure and, when a stress-range drop of 50% was used, it was 0.46. Cracks were produced during pure thermal cycling without external strains applied. These arose due to the local strains caused by thermal expansion mismatches between the solder and Cu 6 Sn 5 intermetallic layer, between the phases of solder, and due to the anisotropy of the materials. The fatigue life under thermomechanical cycling was significantly inferior to that obtained in isothermal mechanical cycling. A factor contributing to this inferiority is the internal damage produced during temperature cycling

  15. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Directory of Open Access Journals (Sweden)

    Liu Mei Lee

    2013-01-01

    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  16. Effect of Preconditioning and Soldering on Failures of Chip Tantalum Capacitors

    Science.gov (United States)

    Teverovsky, Alexander A.

    2014-01-01

    Soldering of molded case tantalum capacitors can result in damage to Ta205 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture content on the probability of post-soldering electrical failures. In this work, that is based on a case history, different groups of similar types of CWR tantalum capacitors from two lots were prepared for soldering by bake, moisture saturation, and longterm storage at room conditions. Results of the testing showed that both factors: initial quality of the lot, and preconditioning affect the probability of failures. Baking before soldering was shown to be effective to prevent failures even in lots susceptible to pop-corning damage. Mechanism of failures is discussed and recommendations for pre-soldering bake are suggested based on analysis of moisture characteristics of materials used in the capacitors' design.

  17. Thermomechanical fatigue life prediction for several solders

    Science.gov (United States)

    Wen, Shengmin

    Since solder connections operate at high homologous temperature, solders are high temperature materials. This feature makes their mechanical behavior and fatigue phenomena unique. Based on experimental findings, a physical damage mechanism is introduced for solders. The mechanism views the damage process as a series of independent local damage events characterized by the failure of individual grains, while the structural damage is the eventual percolation result of such local events. Fine's dislocation energy density concept and Mura's microcrack initiation theory are adopted to derive the fatigue formula for an individual grain. A physical damage metric is introduced to describe the material with damage. A unified creep and plasticity constitutive model is adopted to simulate the mechanical behavior of solders. The model is cast into a continuum damage mechanics framework to simulate material with damage. The model gives good agreement with the experimental results of 96.5Pb-3.5Sn and 96.5Sn-3.5Ag solders under uniaxial strain-controlled cyclic loading. The model is convenient for implementation into commercial computational packages. Also presented is a fatigue theory with its failure criterion for solders based on physical damage mechanism. By introducing grain orientation into the fatigue formula, an m-N curve (m is Schmid factor) at constant loading condition is suggested for fatigue of grains with different orientations. A solder structure is defined as fatigued when the damage metric reaches a critical threshold, since at this threshold the failed grains may form a cluster and percolate through the structure according to percolation theory. Fatigue data of 96.5Pb-3.5Sn solder bulk specimens under various uniaxial tension tests were analyzed. Results show that the theory gives consistent predictions under broad conditions, while inelastic strain theory does not. The theory is anisotropic with no size limitation to its application, which could be suitable for

  18. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    Directory of Open Access Journals (Sweden)

    Mohd Nizam Ab. Rahman

    2014-12-01

    Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

  19. Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

    Directory of Open Access Journals (Sweden)

    Roman Koleňák

    2018-04-01

    Full Text Available The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In, in which the phases of titanium (Ti3In4 and silver (AgIn2 are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg6In5 and (AgCuIn2. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

  20. Materials by design

    International Nuclear Information System (INIS)

    Eberhardt, J.; Hay, P.J.; Carpenter, J.A. Jr.

    1986-01-01

    Major developments in materials characterization instrumentation over the past decade have helped significantly to elucidate complex processes and phenomena connected with the microstructure of materials and interfacial interactions. Equally remarkable advances in theoretical models and computer technology also have been taking place during this period. These latter now permit, for example, in selected cases the computation of material structures and bonding and the prediction of some material properties. Two assessments of the state of the art of instrumental techniques and theoretical methods for the study of material structures and properties have recently been conducted. This paper discusses aspects from these assessments of computational theoretical methods apply to materials

  1. Integration of environmentally compatible soldering technologies for waste minimization

    International Nuclear Information System (INIS)

    Hosking, F.M.

    1992-01-01

    There has been a concentrated effort throughout the international microelectronics industry to phase out chlorofluorocarbon (CFC) materials and alleviate the serious problem of ozone depletion created by the release of CFCS. The development of more environmentally compatible manufacturing technologies is the cornerstone of this effort. Alternative materials and processes for cleaning and soldering have received special attention. Electronic. soldering typically utilizes rosin-based fluxes to promote solder wettability. Flux residues must be removed from the soldered parts when high product reliability is essential. Halogenated or CFC solvents have been the principle chemicals used to clean the residues. With the accelerated push to eliminate CFCs in the US by 1995, CFC-free solvents, aqueous-based cleaning, water soluble or ''no clean'' fluxes, and fluxless soldering technologies are being developed and quickly integrated into manufacturing practice. Sandia's Center for Solder Science and Technology has been ch g a variety of fluxless and alternative soldering technologies for DOE's waste minimization program. The work has focused on controlled atmosphere, laser, and ultrasonic fluxless soldering, protective metallic and organic coatings, and fluxes which have water soluble or low solids-based chemistries. With the increasing concern that Pb will also be banned from electronic soldering, Sandia has been characterizing the wetting, aging, and mechanical properties of Pb-fire solder alloys. The progress of these integrated studies will be discussed. Their impact on environmentally compatible manufacturing will be emphasized. Since there is no universal solution to the various environmental, safety, and health issues which currently face industry, the proposed technologies offer several complementary materials and processing options from which one can choose

  2. Soldering of copper-clad niobium--titanium superconductor composite

    International Nuclear Information System (INIS)

    Moorhead, A.J.; Woodhouse, J.J.; Easton, D.S.

    1977-04-01

    When superconductivity is applied to various electrical devices, the joining of the superconducting material and the performance of the joints are generally crucial to the successful operation of the system. Although many techniques are being considered for joining composite superconductors, soldering is the most common. We determined the wetting and flow behavior of various solder and flux combinations on a copper-clad Nb-Ti composite, developed equipment and techniques for soldering and inspection of lap joints, and determined the shear strength of joints at temperatures down to -269 0 C (4 0 K). We studied 15 solders and 17 commercial and experimental fluxes in the wettability and flow tests. A resistance unit was built for soldering test specimens. A series of samples soldered with 80 Pb-20 Sn, 83 Pb-15 Sn-2 Sb, 97.5 Pb-1.5 Ag-1 Sn, 80 In-15 Pb-5 Ag, or 25 In-37.5 Pb-37.5 Sn (wt percent) was inspected by three nondestructive techniques. Through-transmission ultrasound gave the best correlation with nonbond areas revealed in peel tests. Single-lap shear specimens soldered with 97.5 Pb-1.5 Ag-1 Sn had the highest strength (10.44 ksi, 72 MPa) and total elongation (0.074 in., 1.88 mm) at -269 0 C (4 0 K) of four solders tested

  3. Computational materials design

    International Nuclear Information System (INIS)

    Snyder, R.L.

    1999-01-01

    Full text: Trial and error experimentation is an extremely expensive route to the development of new materials. The coming age of reduced defense funding will dramatically alter the way in which advanced materials have developed. In the absence of large funding we must concentrate on reducing the time and expense that the R and D of a new material consumes. This may be accomplished through the development of computational materials science. Materials are selected today by comparing the technical requirements to the materials databases. When existing materials cannot meet the requirements we explore new systems to develop a new material using experimental databases like the PDF. After proof of concept, the scaling of the new material to manufacture requires evaluating millions of parameter combinations to optimize the performance of the new device. Historically this process takes 10 to 20 years and requires hundreds of millions of dollars. The development of a focused set of computational tools to predict the final properties of new materials will permit the exploration of new materials systems with only a limited amount of materials characterization. However, to bound computational extrapolations, the experimental formulations and characterization will need to be tightly coupled to the computational tasks. The required experimental data must be obtained by dynamic, in-situ, very rapid characterization. Finally, to evaluate the optimization matrix required to manufacture the new material, very rapid in situ analysis techniques will be essential to intelligently monitor and optimize the formation of a desired microstructure. Techniques and examples for the rapid real-time application of XRPD and optical microscopy will be shown. Recent developments in the cross linking of the world's structural and diffraction databases will be presented as the basis for the future Total Pattern Analysis by XRPD. Copyright (1999) Australian X-ray Analytical Association Inc

  4. High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

    DEFF Research Database (Denmark)

    High-temperature solders have been widely used as joining materials to provide stable interconnections that resist a severe thermal environment and also to facilitate the drive for miniaturization. High-lead containing solders have been commonly used as high-temperature solders. The development...... of high-temperature lead-free solders has become an important issue for both the electronics and automobile industries because of the health and environmental concerns associated with lead usage. Unfortunately, limited choices are available as high-temperature lead-free solders. This work outlines...... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

  5. Materials in Participatory Design Processes

    DEFF Research Database (Denmark)

    Hansen, Nicolai Brodersen

    This dissertation presents three years of academic inquiry into the question of what role materials play in interaction design and participatory design processes. The dissertation aims at developing conceptual tools, based on Deweys pragmatism, for understanding how materials aid design reflection....... It has been developed using a research-through-design approach in which the author has conducted practical design work in order to investigate and experiment with using materials to scaffold design inquiry. The results of the PhD work is submitted as seven separate papers, submitted to esteemed journals...... and conferences within the field of interaction design and HCI. The work is motivated both by the growing interest in materials in interaction design and HCI and the interest in design processes and collaboration within those fields. At the core of the dissertation lies an interest in the many different materials...

  6. Designing through Material

    DEFF Research Database (Denmark)

    Kruse Aagaard, Anders

    2014-01-01

    as an opportunity to connect the digital environment with the reality of materials – and use realisation and materialisation to generate architectural developments and findings through an iterative mode of thinking about the dialogue between drawing, materials and fabrication. Consequently the interest and mind...

  7. Assessment of potential solder candidates for high temperature applications

    DEFF Research Database (Denmark)

    pressure to eliminate lead containing materials despite the fact that materials for high Pb containing alloys are currently not affected by any legislations. A tentative assessment was carried out to determine the potential solder candidates for high temperature applications based on the solidification...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

  8. Designing Instructional Materials: Some Guidelines.

    Science.gov (United States)

    Burbank, Lucille; Pett, Dennis

    Guidelines for the design of instructional materials are outlined in this paper. The principles of design are presented in five major categories: (1) general design (structural appeal and personal appeal); (2) instructional design (attention, memory, concept learning, and attitude change); (3) visual design (media considerations, pictures, graphs…

  9. New Materials Design

    National Research Council Canada - National Science Library

    Voth, Gregory

    1999-01-01

    Progress has been made on several projects under the Challenge Project award. In the area of high energy density materials, calculations are under way on Al atoms embedded in clusters of H2 molecule...

  10. Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process

    Science.gov (United States)

    Mallik, S.; Bauer, R.; Hübner, F.; Ekere, N. N.

    2011-01-01

    Solder paste is the most widely used interconnection material in the electronic assembly process for attaching electronic components/devices directly onto the surface of printed circuit boards, using stencil printing process. This paper evaluates the performance of three different commercially available Sn-Ag-Cu solder pastes formulated with different particle size distributions (PSD), metal content and alloy composition. A series of stencil printing tests were carried out using a specially designed stencil of 75 μm thickness and apertures of 300×300 μm2 dimension and 500 μm pitch sizes. Solder paste printing behaviors were found related to attributes such as slumping and surface tension and printing performance was correlated with metal content and PSD. The results of the study should benefit paste manufacturers and SMT assemblers to improve their products and practices.

  11. Characterization of lead-free solders for electronic packaging

    Science.gov (United States)

    Ma, Hongtao

    The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (Th > 0.5T m even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn-Pb solder alloys. In this research, mechanical measurements of isothermal aging effects and the resulting changes in the materials behavior of lead-free solders were performed. A novel specimen preparation procedure was developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process. Using specimens fabricated with the developed procedure, isothermal aging effects and viscoplastic material behavior evolution have been characterized for 95.5Sn-4.0Ag-0.5Cu (SAC405) and 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solders, which are commonly used as the solder ball alloy in lead-free BGAs and other components. Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Up to 40% reduction in tensile strength was observed for water quenched specimens after two months of aging at room temperature. Creep deformation also increased dramatically with increasing aging durations. Microstructural changes during room temperature aging were also observed and recorded for the solder alloys and correlated with the observed mechanical behavior changes. Aging effects at elevated temperatures for up to 6 months were also investigated. Thermal aging caused significant tensile strength loss and deterioration of creep deformation. The thermal aging results also showed that after an initial tensile strength drop, the Sn-Pb eutectic solder reached a relatively stable stage after 200 hours of aging. However, for SAC alloy, both the tensile and

  12. Influence of solder joint length to the mechanical aspect during the thermal stress analysis

    Science.gov (United States)

    Tan, J. S.; Khor, C. Y.; Rahim, Wan Mohd Faizal Wan Abd; Ishak, Muhammad Ikman; Rosli, M. U.; Jamalludin, Mohd Riduan; Zakaria, M. S.; Nawi, M. A. M.; Aziz, M. S. Abdul; Ani, F. Che

    2017-09-01

    Solder joint is an important interconnector in surface mount technology (SMT) assembly process. The real time stress, strain and displacement of the solder joint is difficult to observe and assess the experiment. To tackle these problems, simulation analysis was employed to study the von Mises stress, strain and displacement in the thermal stress analysis by using Finite element based software. In this study, a model of leadless electronic package was considered. The thermal stress analysis was performed to investigate the effect of the solder length to those mechanical aspects. The simulation results revealed that solder length gives significant effect to the maximum von Mises stress to the solder joint. Besides, changes in solder length also influence the displacement of the solder joint in the thermal environment. The increment of the solder length significantly reduces the von Mises stress and strain on the solder joint. Thus, the understanding of the physical parameter for solder joint is important for engineer prior to designing the solder joint of the electronic component.

  13. Optimal Design of Porous Materials

    DEFF Research Database (Denmark)

    Andreassen, Erik

    The focus of this thesis is topology optimization of material microstructures. That is, creating new materials, with attractive properties, by combining classic materials in periodic patterns. First, large-scale topology optimization is used to design complicated three-dimensional materials......, throughout the thesis extra attention is given to obtain structures that can be manufactured. That is also the case in the final part, where a simple multiscale method for the optimization of structural damping is presented. The method can be used to obtain an optimized component with structural details...

  14. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Haiyan [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Peng, Jianke [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Fu, Li, E-mail: fuli@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Wang, Xincheng [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Xie, Yan [School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China)

    2016-04-15

    Graphical abstract: - Highlights: • The wetting angle of lead free solder on Cu was reduced by surface microstructure. • The wetting form of Sn-Ag-Cu solder on Cu was “non-composite surface”. • The experimental results had a sound fit with the theoretical calculation. - Abstract: In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  15. Lead-free solder technology transfer from ASE Americas

    Energy Technology Data Exchange (ETDEWEB)

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

  16. Composite materials design and applications

    CERN Document Server

    Gay, Daniel; Tsai, Stephen W

    2002-01-01

    PART ONE. PRINCIPLES OF CONSTRUCTIONCOMPOSITE MATERIALS, INTEREST AND PROPERTIESWhat is Composite Material Fibers and MatrixWhat can be Made Using Composite Materials?Typical Examples of Interest on the Use of Composite MaterialsExamples on Replacing Conventional Solutions with CompositesPrincipal Physical PropertiesFABRICATION PROCESSESMolding ProcessesOther Forming ProcessesPractical Hints in the Manufacturing ProcessesPLY PROPERTIESIsotropy and AnisotropyCharacteristics of the Reinforcement-Matrix MixtureUnidirectional PlyWoven FabricsMats and Reinforced MatricesMultidimensional FabricsMetal Matrix CompositesTestsSANDWICH STRUCTURES:What is a Sandwich Structure?Simplified FlexureA Few Special AspectsFabrication and Design ProblemsNondestructive Quality ControlCONCEPTION AND DESIGNDesign of a Composite PieceThe LaminateFailure of LaminatesSizing of LaminatesJOINING AND ASSEMBLYRiveting and BoltingBondingInsertsCOMPOSITE MATERIALS AND AEROSPACE CONSTRUCTIONAircraftHelicoptersPropeller Blades for AirplanesTur...

  17. A new method for soldering particle-reinforced aluminum metal matrix composites

    Energy Technology Data Exchange (ETDEWEB)

    Lu, Jinbin; Mu, Yunchao [Zhongyuan University of Technology, Zhengzhou 450007 (China); Luo, Xiangwei [Zhengzhou University, Zhengzhou 450002 (China); Niu, Jitai, E-mail: niujitai@163.com [Zhongyuan University of Technology, Zhengzhou 450007 (China)

    2012-12-01

    Highlights: Black-Right-Pointing-Pointer Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. Black-Right-Pointing-Pointer The nickel plating is required on the surface of the composites before soldering. Black-Right-Pointing-Pointer Low welding temperature is set to avoid overheating of the matrix. Black-Right-Pointing-Pointer Chemical and metallurgical bonding of composites and Kovar is carried out. Black-Right-Pointing-Pointer High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al-SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe-Ni-Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn-Cd-Ag-Cu) with a melting point of about 400 Degree-Sign C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)-Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al-SiC composite.

  18. A new method for soldering particle-reinforced aluminum metal matrix composites

    International Nuclear Information System (INIS)

    Lu, Jinbin; Mu, Yunchao; Luo, Xiangwei; Niu, Jitai

    2012-01-01

    Highlights: ► Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. ► The nickel plating is required on the surface of the composites before soldering. ► Low welding temperature is set to avoid overheating of the matrix. ► Chemical and metallurgical bonding of composites and Kovar is carried out. ► High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al–SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe–Ni–Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn–Cd–Ag–Cu) with a melting point of about 400 °C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)–Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al–SiC composite.

  19. Laser Soldering of Rat Skin Using a Controlled Feedback System

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2009-03-01

    Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

  20. Translating material and design space

    DEFF Research Database (Denmark)

    Tamke, Martin; Ramsgaard Thomsen, Mette; Joseffson, Kristoffer

    2009-01-01

    This paper shares findings from the project DevA (Developable surfaces in Architecture), a research by design based project developed a collaboration between academic and industry partners. The project aims to investigate the use of curved sheet material in architecture using hybridised 3D...

  1. Designed materials: what and how

    Science.gov (United States)

    Mazumder, Jyotirmoy; Dutta, Debasish; Ghosh, Amit K.; Kikuchi, Noboru

    2003-03-01

    Quest for a material to suit the service performance is almost as old as human civilization. So far materials engineers have developed a series of alloys, polymers, ceramics, and composites to serve many of the performance requirements in a modern society. However, challenges appear when one needs to satisfy more than one boundary condition. For example, a component with negative Coefficient of Thermal Expansion (CTE) using a ductile metal was almost impossible until recently. Synthesis of various technologies such as Direct Metal Deposition (DMD) Homogenization Design Method (HDM) and mutli material Computer Aided Design (CAD) was necessary to achieve this goal. Rapid fabrication of three-dimensional shapes of engineering materials such as H13 tool steel and nickel super alloys are now possible using Direct Materials Deposition (DMD) technique as well as similar techniques such as Light Engineered New Shaping (LENS) or Directed Light Fabrication (DLF). However, DMD has closed loop capability that enables better dimension and thermal cycle control. This enables one to deposit different material at different pixels with a given height directly from a CAD drawing. The feedback loop also controls the thermal cycle. H13 tool steel is one of the difficult alloys for deposition due to residual stress accumulation from martensitic transformation. However, it is the material of choice for the die and tool industry. DMD has demonstrated successful fabrication of complicated shapes and dies and tools, even with H13 alloys. This process also offers copper chill blocks and water-cooling channels as the integral part of the tool. On the other hand ZrO2 was co-deposited with nickel super alloys using DMD. Flexibility of the process is enormous and essentially it is an enabling technology to marterialize many a design. Using DMD in conjunction with HDM and multi-material CAD, one can produce components with predetermined performance such as negative co-efficient of expansion, by

  2. Quality Analysis of Welded and Soldered Joints of Cu-Nb Microcomposite Wires

    Directory of Open Access Journals (Sweden)

    Nikolaj VIŠNIAKOV

    2011-03-01

    Full Text Available Quality analysis of welded and soldered joints of Cu-Nb microcomposite wires has been performed. Quality and mechanical characteristics of joints as ultimate tensile stress limit and elongation at break were measured with an universal testing machine and controlled visually using an optical microscope. Two wires joints were soldered with silver and copper solders and put into steel and copper sleeve respectively. Another two wires joints were soldered with silver solder and welded without any reinforcement. Joints soldered with the silver solder and steel sleeve have demonstrated the best mechanical characteristics: ultimate tensile stress limit of 650 MPa and elongation at break of 0.85 %. Joints soldered with the copper sleeve have no advantages comparing with the soldered butt joint. Ultimate tensile stress limit and elongation at break were in 300 MPa - 350 MPa and in 0.35 % - 0.45 % ranges respectively. Two welded joints had ultimate tensile stress limit of 470 MPa and elongation at break of 0.71 %. In all joints the microstructure of Nb filaments was destroyed and mechanical properties have been specified by mechanical strength of copper and sleeve materials only.http://dx.doi.org/10.5755/j01.ms.17.1.242

  3. Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Andersson, D.; Hoo, N.; Pearce, J.; Watson, A.; Dinsdale, A.; Mucklejohn, S.

    2012-01-01

    Roč. 21, č. 5 (2012), s. 629-637 ISSN 1059-9495 Institutional support: RVO:68081723 Keywords : lead-free soldering, * materials for high-temperature LF * new technologies for HT lead-free soldering Subject RIV: BJ - Thermodynamics Impact factor: 0.915, year: 2012

  4. On the problem of soldering refractory metals with silver-containing solders

    International Nuclear Information System (INIS)

    Anikeev, E.F.; Andryushchenko, V.I.; Chepelenko, V.N.; Batov, V.M.

    1981-01-01

    The processes of wetting, spreading and interphase interactions of copper-silver liquid alloys alloyed with Ni and Si, with niobium, tantalum, molybdenum, tungsten, 12Kh18N10T steel and nickel are studied. It has been determined that Ni or Si additions into the copper-silver solder improve the wetting and adhesion. When soldering with the alloy containing Ni additions, the strength of a soldered Joint grows with the increase of soldering duration while soldering with the alloy containing Si additions, the strength decreases. That is why Ni-containing solders are preferable for soldering thick-walled structures, and Si-containing solders - for thin-walled structures [ru

  5. High temperature soldering of graphite

    International Nuclear Information System (INIS)

    Anikin, L.T.; Kravetskij, G.A.; Dergunova, V.S.

    1977-01-01

    The effect is studied of the brazing temperature on the strength of the brazed joint of graphite materials. In one case, iron and nickel are used as solder, and in another, molybdenum. The contact heating of the iron and nickel with the graphite has been studied in the temperature range of 1400-2400 ged C, and molybdenum, 2200-2600 deg C. The quality of the joints has been judged by the tensile strength at temperatures of 2500-2800 deg C and by the microstructure. An investigation into the kinetics of carbon dissolution in molten iron has shown that the failure of the graphite in contact with the iron melt is due to the incorporation of iron atoms in the interbase planes. The strength of a joint formed with the participation of the vapour-gas phase is 2.5 times higher than that of a joint obtained by graphite recrystallization through the carbon-containing metal melt. The critical temperatures are determined of graphite brazing with nickel, iron, and molybdenum interlayers, which sharply increase the strength of the brazed joint as a result of the formation of a vapour-gas phase and deposition of fine-crystal carbon

  6. Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

    Science.gov (United States)

    Lin, Jian; Lei, Yongping; Fu, Hanguang; Guo, Fu

    2018-03-01

    In surface mount technology, the Sn-3.0Ag-0.5Cu solder joint has a shorter impact lifetime than a traditional lead-tin solder joint. In order to improve the impact property of SnAgCu lead-free solder joints and identify the effect of silver content on tensile strength and impact property, impact experiments were conducted at various strain rates on three selected SnAgCu based solder joints. It was found that joint failure mainly occurred in the solder material with large plastic deformation under low strain rate, while joint failure occurred at the brittle intermetallic compound layer without any plastic deformation at a high strain rate. Joint strength increased with the silver content in SnAgCu alloys in static tensile tests, while the impact property of the solder joint decreased with increasing silver content. When the strain rate was low, plastic deformation occurred with failure and the tensile strength of the Sn-3.0Ag-0.5Cu solder joint was higher than that of Sn-0.3Ag-0.7Cu; when the strain rate was high, joint failure mainly occurred at the brittle interface layer and the Sn-0.3Ag-0.7Cu solder joint had a better impact resistance with a thinner intermetallic compound layer.

  7. Virtual Reality for Materials Design Laboratory

    Data.gov (United States)

    Federal Laboratory Consortium — The purpose is to research and develop materials through applied virtual reality to enable interactive "materials-by-design." Extensive theoretical and computational...

  8. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  9. Materials selection in mechanical design

    International Nuclear Information System (INIS)

    Ashby, M.F.; Cebon, D.

    1993-01-01

    A novel materials-selection procedure has been developed and implemented in software. The procedure makes use of Materials Selection Charts: a new way of displaying material property data; and performance indices: combinations of material properties which govern performance. Optimisation methods are employed for simultaneous selection of both material and shape. (orig.)

  10. Materials selection in mechanical design

    OpenAIRE

    Ashby , M.; Cebon , D.

    1993-01-01

    A novel materials-selection procedure has been developed and implemented in software. The procedure makes use of Materials Selection Charts: a new way of displaying material property data; and performance indices: combinations of material properties which govern performance. Optimisation methods are employed for simultaneous selection of both material and shape.

  11. Cybermaterials: materials by design and accelerated insertion of materials

    Science.gov (United States)

    Xiong, Wei; Olson, Gregory B.

    2016-02-01

    Cybermaterials innovation entails an integration of Materials by Design and accelerated insertion of materials (AIM), which transfers studio ideation into industrial manufacturing. By assembling a hierarchical architecture of integrated computational materials design (ICMD) based on materials genomic fundamental databases, the ICMD mechanistic design models accelerate innovation. We here review progress in the development of linkage models of the process-structure-property-performance paradigm, as well as related design accelerating tools. Extending the materials development capability based on phase-level structural control requires more fundamental investment at the level of the Materials Genome, with focus on improving applicable parametric design models and constructing high-quality databases. Future opportunities in materials genomic research serving both Materials by Design and AIM are addressed.

  12. Design and computation of modern engineering materials

    CERN Document Server

    Altenbach, Holm

    2014-01-01

     The idea of this monograph is to present the latest results related to design and computation of engineering materials and structures. The contributions cover the classical fields of mechanical, civil and materials engineering up to biomechanics and advanced materials processing and optimization. The materials and structures covered can be categorized into modern steels and titanium alloys, composite materials, biological and natural materials, material hybrids and modern joining technologies. Analytical modelling, numerical simulation, the application of state-of-the-art design tools and sophisticated experimental techniques are applied to characterize the performance of materials and to design and optimize structures in different fields of engineering applications.

  13. Shape Does Matter : Designing materials in products

    NARCIS (Netherlands)

    Saakes, D.P.

    2010-01-01

    In this thesis I investigate how to support designing the appearance of materials in products, specifically how to search for new materials and to explore the interactions between materials and shape. Central in this thesis is a novel design called Skin 2.0. Skin allows designers in the early

  14. Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

    Science.gov (United States)

    Rolin, T. D.; Hodge, R. E.

    2008-01-01

    An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

  15. Alternate Materials In Design Of Radioactive Material Packages

    International Nuclear Information System (INIS)

    Blanton, P.; Eberl, K.

    2010-01-01

    This paper presents a summary of design and testing of material and composites for use in radioactive material packages. These materials provide thermal protection and provide structural integrity and energy absorption to the package during normal and hypothetical accident condition events as required by Title 10 Part 71 of the Code of Federal Regulations. Testing of packages comprising these materials is summarized.

  16. Handbook of machine soldering SMT and TH

    CERN Document Server

    Woodgate, Ralph W

    1996-01-01

    A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

  17. Designing Biomimetic, Dissipative Material Systems

    Energy Technology Data Exchange (ETDEWEB)

    Balazs, Anna C. [Univ. of Pittsburgh, PA (United States). Chemical Engineering Dept.; Whitesides, George M. [Harvard Univ., Cambridge, MA (United States). Dept. of Chemistry and Chemical Biology; Brinker, C. Jeffrey [Univ. of New Mexico, Albuquerque, NM (United States). Dept. of Chemical and Nuclear Engineering. Dept. of Chemistry. Dept. of Molecular Genetics and Microbiology. Center for Micro-Engineered Materials; Aranson, Igor S. [UChicago, LLC., Argonne, IL (United States); Chaikin, Paul [New York Univ. (NYU), NY (United States). Dept. of Physics; Dogic, Zvonimir [Brandeis Univ., Waltham, MA (United States). Dept. of Physics; Glotzer, Sharon [Univ. of Michigan, Ann Arbor, MI (United States). Dept. of Chemical Engineering. Dept. of Materials Science and Engineering. Dept. of Macromolecular Science and Engineering Physics; Hammer, Daniel [Univ. of Pennsylvania, Philadelphia, PA (United States). School of Engineering and Applied Science; Irvine, Darrell [Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States). Dept. of Materials Science and Engineering and Biological Engineering; Little, Steven R. [Univ. of Pittsburgh, PA (United States). Chemical Engineering Dept.; Olvera de la Cruz, Monica [Northwestern Univ., Evanston, IL (United States). Dept. of Materials Science and Engineering; Parikh, Atul N. [Univ. of California, Davis, CA (United States). Dept. of Biomedical Engineering. Dept. of Chemical Engineering and Materials Science; Stupp, Samuel [Northwestern Univ., Evanston, IL (United States). Dept. of Materials Science and Engineering. Dept. of Chemistry. Dept. of Medicine. Dept. of Biomedical Engineering; Szostak, Jack [Harvard Univ., Cambridge, MA (United States). Dept. of Chemistry and Chemical Biology

    2016-01-21

    Throughout human history, new materials have been the foundation of transformative technologies: from bronze, paper, and ceramics to steel, silicon, and polymers, each material has enabled far-reaching advances. Today, another new class of materials is emerging—one with both the potential to provide radically new functions and to challenge our notion of what constitutes a “material”. These materials would harvest, transduce, or dissipate energy to perform autonomous, dynamic functions that mimic the behaviors of living organisms. Herein, we discuss the challenges and benefits of creating “dissipative” materials that can potentially blur the boundaries between living and non-living matter.

  18. Thermomechanical behavior of tin-rich (lead-free) solders

    Science.gov (United States)

    Sidhu, Rajen Singh

    In order to adequately characterize the behavior of ball-grid-array (BGA) Pb-free solder spheres in electronic devices, the microstructure and thermomechanical behavior need to be studied. Microstructure characterization of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-3.9Ag-0.7Cu alloys was conducted using optical microscopy, scanning electron microscopy, transmission electron microscopy, image analysis, and a novel serial sectioning 3D reconstruction process. Microstructure-based finite-element method (FEM) modeling of deformation in Sn-3.5Ag alloy was conducted, and it will be shown that this technique is more accurate when compared to traditional unit cell models for simulating and understanding material behavior. The effect of cooling rate on microstructure and creep behavior of bulk Sn-rich solders was studied. The creep behavior was evaluated at 25, 95, and 120°C. Faster cooling rates were found to increase the creep strength of the solders due to refinement of the solder microstructure. The creep behavior of Sn-rich single solder spheres reflowed on Cu substrates was studied at 25, 60, 95, and 130°C. Testing was conducted using a microforce testing system, with lap-shear geometry samples. The solder joints displayed two distinct creep behaviors: (a) precipitation-strengthening (Sn-3.5Ag and Sn-3.9Ag-0.7Cu) and (b) power law creep accommodated by grain boundary sliding (GBS) (Sn and Sn-0.7Cu). The relationship between microstructural features (i.e. intermetallic particle size and spacing), stress exponents, threshold stress, and activation energies are discussed. The relationship between small-length scale creep behavior and bulk behavior is also addressed. To better understand the damage evolution in Sn-rich solder joints during thermal fatigue, the local damage will be correlated to the cyclic hysteresis behavior and crystal orientations present in the Sn phase of solder joints. FEM modeling will also be utilized to better understand the macroscopic and local

  19. Free Material Design with Multiple Load Cases

    DEFF Research Database (Denmark)

    Pedersen, Pauli; Pedersen, Niels Leergaard

    2012-01-01

    Multiple load cases and the consideration of strength is a reality that most structural designs are exposed to. Improved possibility to produce specific materials, say by fiber lay-up, put focus on research on free material optimization. A formulation for such design problems together with a prac......Multiple load cases and the consideration of strength is a reality that most structural designs are exposed to. Improved possibility to produce specific materials, say by fiber lay-up, put focus on research on free material optimization. A formulation for such design problems together...... with a practical recursive design procedure is presented and illustrated with examples. The presented finite element analysis involve many elements as well as many load cases. Separating the local amount of material from a description with unit trace for the local anisotropy, gives the free materials formulation...... a more physical interpretation of the material constraint....

  20. Virtual materials design using databases of calculated materials properties

    International Nuclear Information System (INIS)

    Munter, T R; Landis, D D; Abild-Pedersen, F; Jones, G; Wang, S; Bligaard, T

    2009-01-01

    Materials design is most commonly carried out by experimental trial and error techniques. Current trends indicate that the increased complexity of newly developed materials, the exponential growth of the available computational power, and the constantly improving algorithms for solving the electronic structure problem, will continue to increase the relative importance of computational methods in the design of new materials. One possibility for utilizing electronic structure theory in the design of new materials is to create large databases of materials properties, and subsequently screen these for new potential candidates satisfying given design criteria. We utilize a database of more than 81 000 electronic structure calculations. This alloy database is combined with other published materials properties to form the foundation of a virtual materials design framework (VMDF). The VMDF offers a flexible collection of materials databases, filters, analysis tools and visualization methods, which are particularly useful in the design of new functional materials and surface structures. The applicability of the VMDF is illustrated by two examples. One is the determination of the Pareto-optimal set of binary alloy methanation catalysts with respect to catalytic activity and alloy stability; the other is the search for new alloy mercury absorbers.

  1. Thermal decomposition of solder flux activators under simulated wave soldering conditions

    DEFF Research Database (Denmark)

    Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    /methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base...... titration method as a function of temperature, time of exposure and the substrate material used. Findings: The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL...

  2. Spectroscopic investigation of oxidized solder surfaces

    International Nuclear Information System (INIS)

    Song, Jenn-Ming; Chang-Chien, Yu-Chien; Huang, Bo-Chang; Chen, Wei-Ting; Shie, Chi-Rung; Hsu, Chuang-Yao

    2011-01-01

    Highlights: → UV-visible spectroscopy is successfully used to evaluate the degree of discoloring of solders. → The surface oxides of solders can also be identified by UV-visible absorption spectra. → The discoloration of solder surface can be correlated with optical characterization of oxides. → A strategy against discoloring by alloying was also suggested. - Abstract: For further understanding of the discoloration of solder surfaces due to oxidation during the assembly and operation of electronic devices, UV-vis and X-ray photoelectron spectroscopic analyses were applied to evaluate the degree of discoloring and identify the surface oxides. The decrease in reflectance of the oxidized solder surface is related to SnO whose absorption band is located within the visible region. A trace of P can effectively depress the discoloration of solders under both solid and semi-solid states through the suppression of SnO.

  3. Albumin solder covalently bound to a polymer membrane: New approach to improve binding strength in laser tissue soldering in-vitro.

    Science.gov (United States)

    Hiebl, B; Ascher, L; Luetzow, K; Kratz, K; Gruber, C; Mrowietz, C; Nehring, M E; Lendlein, A; Franke, R-P; Jung, F

    2018-01-01

    Laser tissue soldering (LTS) based on indocyanine green (ICG)-mediated heat-denaturation of proteins might be a promising alternative technique for micro-suturing, but up to now the problem of too weak shear strength of the solder welds in comparison to sutures is not solved. Earlier reports gave promising results showing that solder supported by carrier materials can enhance the cohesive strength of the liquid solder. In these studies, the solder was applied to the carriers by dip coating. Higher reliability of the connection between the solder and the carrier material is expected when the solder is bound covalently to the carrier material. In the present study a poly(ether imide) (PEI) membrane served as carrier material and ICG-supplemented albumin as solder substrate. The latter was covalently coupled to the carrier membrane under physiological conditions to prevent structural protein changes. As laser source a diode continuous-wave laser emitting at 808 nm with intensities between 250 mW and 1500 mW was utilized. The albumin functionalized carrier membrane was placed onto the tunica media of explanted pig thoracic aortae forming an overlapping area of approximately 0.5×0.5 cm2. All tests were performed in a dry state to prevent laser light absorption by water. Infrared spectroscopy, spectro-photometrical determination of the secondary and primary amine groups after acid orange II staining, contact angle measurements, and atomic force microscopy proved the successful functionalization of the PEI membrane with albumin. A laser power of 450 mW LTS could generate a membrane-blood vessel connection which was characterized by a shear strength of 0.08±0.002 MPa, corresponding to 15% of the tensile strength of the native blood vessel. Theoretically, an overlapping zone of 4.1 mm around the entire circumference of the blood vessel could have provided shear strength of the PEI membrane-blood vessel compound identical to the tensile strength of the native

  4. OLED microdisplay design and materials

    Science.gov (United States)

    Wacyk, Ihor; Prache, Olivier; Ali, Tariq; Khayrullin, Ilyas; Ghosh, Amalkumar

    2010-04-01

    AMOLED microdisplays from eMagin Corporation are finding growing acceptance within the military display market as a result of their excellent power efficiency, wide operating temperature range, small size and weight, good system flexibility, and ease of use. The latest designs have also demonstrated improved optical performance including better uniformity, contrast, MTF, and color gamut. eMagin's largest format display is currently the SXGA design, which includes features such as a 30-bit wide RGB digital interface, automatic luminance regulation from -45 to +70°C, variable gamma control, and a dynamic range exceeding 50:000 to 1. This paper will highlight the benefits of eMagin's latest microdisplay designs and review the roadmap for next generation devices. The ongoing development of reduced size pixels and larger format displays (up to WUXGA) as well as new OLED device architecture (e.g. high-brightness yellow) will be discussed. Approaches being explored for improved performance in next generation designs such as lowpower serial interfaces, high frame rate operation, and new operational modes for reduction of motion artifacts will also be described. These developments should continue to enhance the appeal of AMOLED microdisplays for a broad spectrum of near-to-the-eye applications such as night vision, simulation and training, situational awareness, augmented reality, medical imaging, and mobile video entertainment and gaming.

  5. Microstructural effects on constitutive and fatigue fracture behavior of TinSilverCopper solder

    Science.gov (United States)

    Tucker, Jonathon P.

    As microelectronic package construction becomes more diverse and complex, the need for accurate, geometry-independent material constitutive and failure models increases. Evaluations of packages based on accelerated environmental tests (such as accelerated thermal cycling or power cycling) only provide package-dependent reliability information. In addition, extrapolations of such test data to life predictions under field conditions are often empirical. Besides geometry, accelerated environmental test data must account for microstructural factors such as alloy composition or isothermal aging condition, resulting in expensive experimental variation. In this work, displacement-controlled, creep, and fatigue lap shear tests are conducted on specially designed SnAgCu test specimens with microstructures representative to those found in commercial microelectronic packages. The data are used to develop constitutive and fatigue fracture material models capable of describing deformation and fracture behavior for the relevant temperature and strain rate ranges. Furthermore, insight is provided into the microstructural variation of solder joints and the subsequent effect on material behavior. These models are appropriate for application to packages of any geometrical construction. The first focus of the thesis is on Pb-mixed SnAgCu solder alloys. During the transition from Pb-containing solders to Pb-free solders, joints composed of a mixture of SnPb and SnAgCu often result from either mixed assemblies or rework. Three alloys of 1, 5 and 20 weight percent Pb were selected so as to represent reasonable ranges of Pb contamination expected from different 63Sn37Pb components mixed with Sn3.0Ag0.5Cu. Displacement-controlled (constant strain rate) and creep tests were performed at temperatures of 25°C, 75°C, and 125°C using a double lap shear test setup that ensures a nearly homogeneous state of plastic strain at the joint interface. Rate-dependent constitutive models for Pb

  6. A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

    Directory of Open Access Journals (Sweden)

    Enrico Mick

    2015-07-01

    Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

  7. Materials Driven Architectural Design and Representation

    DEFF Research Database (Denmark)

    Kruse Aagaard, Anders

    2015-01-01

    This paper aims to outline a framework for a deeper connection between experimentally obtained material knowledge and architectural design. While materials and architecture in the process of realisation are tightly connected, architectural design and representation are often distanced from...... another role in relation to architectural production. It is, in this paper, the intention to point at material research as an active initiator in explorative approaches to architectural design methods and architectural representation. This paper will point at the inclusion of tangible and experimental...... material research in the early phases of architectural design and to that of the architectural set of tools and representation. The paper will through use of existing research and the author’s own material research and practice suggest a way of using a combination of digital drawing, digital fabrication...

  8. Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

    International Nuclear Information System (INIS)

    Mallik, S.; Ekere, N.N.; Durairaj, R.; Marks, A.E.; Seman, A.

    2009-01-01

    Solder paste is the most important strategic bonding material used in the assembly of surface mount components in electronics manufacturing. As the trend towards miniaturisation of electronic products continues, there is an increasing demand for better understanding of the flow and deformation that is, the rheological behaviour of solder paste formulations. Wall slip plays an important role in characterising the flow behaviour of solder paste materials. The problem of wall slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin solvent layer adjacent to the wall, which gives rise to slippage. In rheological measurements, slip effects can generally be avoided by using roughened surfaces for measuring geometries. In this paper, a novel technique is developed to study the effect of wall slip in the rheological measurements of lead-free solder paste. The viscosity and oscillatory data obtained for three different solder paste samples (from measuring geometries of different surface roughness) have been analysed and compared. In viscosity measurements, slip effects were dominant at low shear rates and the use of serrated surfaces was found to be quite effective in minimizing slip effects. Oscillatory measurements were also affected by roughening the surfaces of measuring geometries.

  9. Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

    International Nuclear Information System (INIS)

    Durairaj, R.; Ramesh, S.; Mallik, S.; Seman, A.; Ekere, N.

    2009-01-01

    Lead-free solder paste printing process accounts for majority of the assembly defects in the electronic manufacturing industry. The study investigates rheological behaviour and stencil printing performance of the lead-free solder pastes (Sn/Ag/Cu). Oscillatory stress sweep test was carried out to study the visco-elastic behaviour of the lead-free solder pastes. The visco-elastic behaviour of the paste encompasses solid and liquid characteristic of the paste, which could be used to study the flow behaviour experienced by the pastes during the stencil printing process. From this study, it was found that the solid characteristics (G') is higher than the liquid characteristic (G'') for the pastes material. In addition, the results from the study showed that the solder paste with a large G' = G'' has a higher cohesiveness resulting in poor withdrawal of the paste during the stencil printing process. The phase angles (δ) was used to correlate the quality of the dense suspensions to the formulation of solder paste materials. This study has revealed the value of having a rheological measurement for explaining and characterising solder pastes for stencil printing. As the demand for lead free pastes increases rheological measurements can assist with the formulation or development of new pastes.

  10. Materials design and development of functional materials for industry

    International Nuclear Information System (INIS)

    Asahi, Ryoji; Morikawa, Takeshi; Hazama, Hirofumi; Matsubara, Masato

    2008-01-01

    It is now well recognized that we are witnessing a golden age of innovation with novel materials, with discoveries that are important for both basic science and industry. With the development of theory along with computing power, quantum materials design-the synthesis of materials with the desired properties in a controlled way via materials engineering on the atomic scale-is becoming a major component of materials research. Computational prediction based on first-principles calculations has helped to find an efficient way to develop materials that are much needed for industry, as we have seen in the successful development of visible-light sensitized photocatalysts and thermoelectric materials. Close collaboration between theory and experiment is emphasized as an essential for success

  11. Materials design data for fusion reactors

    International Nuclear Information System (INIS)

    Tavassoli, A.A.F.

    1998-01-01

    Design data needed for fusion reactors are characterized by the diversity of materials and the complexity of loading situations found in these reactors. In addition, advanced fabrication techniques, such as hot isostatic pressing, envisaged for fabrication of single and multilayered in-vessel components, could significantly change the original materials properties for which the current design rules are written. As a result, additional materials properties have had to be generated for fusion reactors and new structural design rules formulated. This paper recalls some of the materials properties data generated for ITER and DEMO, and gives examples of how these are converted into design criteria. In particular, it gives specific examples for the properties of 316LN-IG and modified 9Cr-1Mo steels, and CuCrZr alloy. These include, determination of tension, creep, isochronous, fatigue, and creep-fatigue curves and their analysis and conversion into design limits. (orig.)

  12. Materials design data for fusion reactors

    Energy Technology Data Exchange (ETDEWEB)

    Tavassoli, A.A.F. [CEA Commissariat a l`Energie Atomique, Gif sur Yvette (France). CEREM

    1998-10-01

    Design data needed for fusion reactors are characterized by the diversity of materials and the complexity of loading situations found in these reactors. In addition, advanced fabrication techniques, such as hot isostatic pressing, envisaged for fabrication of single and multilayered in-vessel components, could significantly change the original materials properties for which the current design rules are written. As a result, additional materials properties have had to be generated for fusion reactors and new structural design rules formulated. This paper recalls some of the materials properties data generated for ITER and DEMO, and gives examples of how these are converted into design criteria. In particular, it gives specific examples for the properties of 316LN-IG and modified 9Cr-1Mo steels, and CuCrZr alloy. These include, determination of tension, creep, isochronous, fatigue, and creep-fatigue curves and their analysis and conversion into design limits. (orig.) 19 refs.

  13. Structural and microstructural design in brittle materials

    International Nuclear Information System (INIS)

    Evans, A.G.

    1979-12-01

    Structural design with brittle materials requires that the stress level in the component correspond to a material survival probability that exceeds the minimum survival probability permitted in that application. This can be achieved by developing failure models that fully account for the probability of fracture from defects within the material (including considerations of fracture statistics, fracture mechanics and stress analysis) coupled with non-destructive techniques that determine the size of the large extreme of critical defects. Approaches for obtaining the requisite information are described. The results provide implications for the microstructural design of failure resistant brittle materials by reducing the size of deleterious defects and enhancing the fracture toughness

  14. Design tools and materials in creative work

    DEFF Research Database (Denmark)

    Hansen, Nicolai Brodersen; Dalsgaard, Peter; Halskov, Kim

    2017-01-01

    -oriented perspectives, we wish to examine the potentials and limitations in current uses of design tools and materials, and discuss and explore when and how we can introduce ones. Participation in the workshop requires participants to document and analyse central themes in a case, and the resulting material will serve......This workshop aims to examine and discuss the role and nature of design tools and materials in creative work, and to explore how novel tools can meaningfully combine existing and novel tools to support and augment creative work. By exploring and combining methodological, theoretical, and design...

  15. Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

    Science.gov (United States)

    Amalu, E. H.; Lui, Y. T.; Ekere, N. N.; Bhatti, R. S.; Takyi, G.

    2011-01-01

    The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

  16. Nano-soldering to single atomic layer

    Science.gov (United States)

    Girit, Caglar O [Berkeley, CA; Zettl, Alexander K [Kensington, CA

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  17. Safer Soldering Guidelines and Instructional Resources

    Science.gov (United States)

    Love, Tyler S.; Tomlinson, Joel

    2018-01-01

    Soldering is a useful and necessary process for many classroom, makerspace, Fab Lab, technology and engineering lab, and science lab activities. As described in this article, soldering can pose many safety risks without proper engineering controls, standard operating procedures, and direct instructor supervision. There are many safety hazards…

  18. A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

    Science.gov (United States)

    Wei, Helin; Wang, Kuisheng

    2011-11-01

    Numerous studies of the reliability of solder joints have been performed. Most life prediction models are limited to a deterministic approach. However, manufacturing induces uncertainty in the geometry parameters of solder joints, and the environmental temperature varies widely due to end-user diversity, creating uncertainties in the reliability of solder joints. In this study, a methodology for accounting for variation in the lifetime prediction for lead-free solder joints of ball grid array packages (PBGA) is demonstrated. The key aspects of the solder joint parameters and the cyclic temperature range related to reliability are involved. Probabilistic solutions of the inelastic strain range and thermal fatigue life based on the Engelmaier model are developed to determine the probability of solder joint failure. The results indicate that the standard deviation increases significantly when more random variations are involved. Using the probabilistic method, the influence of each variable on the thermal fatigue life is quantified. This information can be used to optimize product design and process validation acceptance criteria. The probabilistic approach creates the opportunity to identify the root causes of failed samples from product fatigue tests and field returns. The method can be applied to better understand how variation affects parameters of interest in an electronic package design with area array interconnections.

  19. Friction material composites copper-metal-free material design perspective

    CERN Document Server

    Sundarkrishnaa, K L

    2015-01-01

    This book examines material composites used in connection with brake friction, their design and safety. To aid in understanding, the essentials of friction are explained. This second edition was extended to include friction material composites without copper, as they offer an environmentally friendlier option. The second edition is intended to support beginners by offering insights into the essentials of friction material composites, helping them to develop a broader understanding of brake friction materials. Friction materials find wide-ranging applications in household and industrial appliances, brake pads for automotive applications, rail brake friction pads and composition brake blocks. This second edition is an introductory volume to a set of related books, and is based on the author’s experience and expertise with various material manufacturers, brake manufacturers, vehicle manufacturers, researchers and testing labs around the world with which the author has been associated for the past 28 years.

  20. Thermoelectric nanomaterials materials design and applications

    CERN Document Server

    Koumoto, Kunihito

    2014-01-01

    Presently, there is an intense race throughout the world to develop good enough thermoelectric materials which can be used in wide scale applications. This book focuses comprehensively on very recent up-to-date breakthroughs in thermoelectrics utilizing nanomaterials and methods based in nanoscience. Importantly, it provides the readers with methodology and concepts utilizing atomic scale and nanoscale materials design (such as superlattice structuring, atomic network structuring and properties control, electron correlation design, low dimensionality, nanostructuring, etc.). Furthermore, also

  1. Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

    International Nuclear Information System (INIS)

    Chellvarajoo, Srivalli; Abdullah, M.Z.; Samsudin, Z.

    2015-01-01

    Highlights: • Fe 2 NiO 4 nanoparticles added into SAC 305 by mechanical mixing to form nanocomposite solder paste. • Nanoparticles in the composite solder travels with flux to the outermost surface after reflow. • The intermetallics compound reduced with the addition of nanoparticles into solder paste. • The hardness increased with the addition of limited percentage of nanoparticles into SAC 305. - Abstract: This study investigates the effects of the addition of Fe 2 NiO 4 nanoparticles into a SAC-305 lead-free solder paste. Iron, nickel, and oxide nano-elements were mixed with Pb-free solder alloying elements to produce a new form of nanocomposite solder paste, which can be a promising material in electronic packaging. The SAC-305 was mechanically added with 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles. The migration of nanoparticles in the nanocomposite solder paste to the outermost surface was clarified using the copper ‘sandwich’ method, which was performed after the reflow soldering process. Varying amounts of nanoparticles in the SAC-305 affected the IMC thickness and mechanical properties of the nanocomposite solder paste. The IMC thickness was reduced by 29.15%, 42.37%, and 59.00% after adding 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles in the SAC-305, respectively. However, via nanoindentation method, the hardness of the nanocomposite solder was improved by 44.07% and 56.82% after adding 0.5 and 1.5 wt.% of Fe 2 NiO 4 nanoparticles, respectively. If the addition of Fe 2 NiO 4 nanoparticle exceeded 1.5 wt.%, the hardness increased infinitely

  2. Dye-enhanced protein solders and patches in laser-assisted tissue welding.

    Science.gov (United States)

    Small, W; Heredia, N J; Maitland, D J; Da Silva, L B; Matthews, D L

    1997-01-01

    This study examines the use of dye-enhanced protein bonding agents in 805 nm diode laser-assisted tissue welding. A comparison of an albumin liquid solder and collagen solid-matrix patches used to repair arteriotomies in an in vitro porcine model is presented. Extrinsic bonding media in the form of solders and patches have been used to enhance the practice of laser tissue welding. Preferential absorption of the laser wavelength has been achieved by the incorporation of chromophores. Both the solder and the patch included indocyanine green dye (ICG) to absorb the 805 nm continuous-wave diode laser light used to perform the welds. Solder-mediated welds were divided into two groups (high power/short exposure and low power/long exposure), and the patches were divided into three thickness groups ranging from 0.1 to 1.3 mm. The power used to activate the patches was constant, but the exposure time was increased with patch thickness. Burst pressure results indicated that solder-mediated and patched welds yielded similar average burst strengths in most cases, but the patches provided a higher success rate (i.e., more often exceeded 150 mmHg) and were more consistent (i.e., smaller standard deviation) than the solder. The strongest welds were obtained using 1.0-1.3 mm thick patches, while the high power/short exposure solder group was the weakest. Though the solder and patches yielded similar acute weld strengths, the solid-matrix patches facilitated the welding process and provided consistently strong welds. The material properties of the extrinsic agents influenced their performance.

  3. Effect of gamma radiation on micromechanical hardness of lead-free solder joint

    Energy Technology Data Exchange (ETDEWEB)

    Paulus, Wilfred [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Malaysian Nuclear Agency, Bangi, 43000 Kajang, Selangor (Malaysia); Rahman, Irman Abdul; Jalar, Azman; Kamil, Insan; Bakar, Maria Abu [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Yusoff, Wan Yusmawati Wan [Universiti Pertahanan Nasional Malaysia, Kem Sg. Besi, 57000 Kuala Lumpur (Malaysia)

    2015-09-25

    Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the increment of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.

  4. Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    McNally, K.M.; Sorg, B.S.; Welch, A.J.; Dawes, J.M.; Owen, E.R.

    1999-01-01

    Low-strength anastomoses and thermal damage of tissue are major concerns in laser tissue welding techniques where laser energy is used to induce thermal changes in the molecular structure of the tissues being joined, hence allowing them to bond together. Laser tissue soldering, on the other hand, is a bonding technique in which a protein solder is applied to the tissue surfaces to be joined, and laser energy is used to bond the solder to the tissue surfaces. The addition of protein solders to augment tissue repair procedures significantly reduces the problems of low strength and thermal damage associated with laser tissue welding techniques. Investigations were conducted to determine optimal solder and laser parameters for tissue repair in terms of tensile strength, temperature rise and damage and the microscopic nature of the bonds formed. An in vitro study was performed using an 808 nm diode laser in conjunction with indocyanine green (ICG)-doped albumin protein solders to repair bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The efficacy of temperature feedback control in enhancing the soldering process was also investigated. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the repairs. A reduction in dye concentration from 2.5mgml -1 to 0.25mgml -1 was also found to result in an increase in tensile strength. Increasing the laser irradiance and thus surface temperature resulted in an increased severity of histological injury. Thermal denaturation of tissue collagen and necrosis of the intimal layer smooth muscle cells increased laterally and in depth with higher temperatures. The strongest repairs were produced with an irradiance of 6.4Wcm -2 using a solid protein solder composed of 60% BSA and 0.25mgml -1 ICG. Using this combination of laser and solder parameters, surface temperatures were observed to reach 85±5 deg. C with a

  5. DESIGN OF PARTICULATE MATERIAL COMPACTOR ROLLS DIAMETER

    Directory of Open Access Journals (Sweden)

    Peter Peciar

    2017-09-01

    Full Text Available At present, in a period of an industrial expansion great emphasis is placed on the environment. That means aiming for a reduced energy consumption, and also lessening dustiness from very fine powder material. This category also includes particulate material agglomeration processes. Because this process is very energy-intensive, it is necessary to correctly design these devices. The aim of this paper is to focus on a theoretical design of a production compactor with the rolls diameter for an experimental particulate material, based on Johanson’s theory and experimentally measured material properties. The material used for experimental measurements was an NPK-based industrial fertilizer consisting of several components. The results of this paper is the dependence of the ratio of the maximum compression pressure to the initial compression pressure from the rolls diameter of the proposed compactor.

  6. Characterization of the microstructure of tin-silver lead free solder

    Energy Technology Data Exchange (ETDEWEB)

    Hurtony, Tamás, E-mail: hurtony@ett.bme.hu [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary); Szakál, Alex; Almásy, László [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Len, Adél [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Faculty of Engineering and Information Technology, University of Pécs (Hungary); Kugler, Sándor [Department of Theoretical Physics, Budapest University of Technology and Economics (Hungary); Bonyár, Attila; Gordon, Péter [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary)

    2016-07-05

    Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag{sub 3}Sn phases.

  7. The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints.

    Science.gov (United States)

    Fattahi, Farnaz; Hashemi Ardakani, Zahra; Hashemi Ardakani, Maryam

    2015-12-01

    Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint of the bar, and were placed at the considered angles by employing an explicitly designed device. They were divided into 4 groups regarding the gap angle; Group C (control group) with parallel gap on steady distance of 0.2mm, Group 1: 10°, Group 2: 20°, and Group3: 30° gap angles. When soldered, the specimens were all tested for tensile strength using a universal testing machine at a cross-head speed of 0.5 mm/min with a preload of 10N. Kruskal-Wallis H test was used to compare tensile strength among the groups (ptensile strength values obtained from the study groups were respectively 307.84, 391.50, 365.18, and 368.86 MPa. The tensile strength was not statistically different among the four groups in general (p≤ 0.490). Making the gap angular at the solder joints and the subsequent unsteady increase of the gap distance would not change the tensile strength of the joint.

  8. Battery designs with high capacity anode materials and cathode materials

    Energy Technology Data Exchange (ETDEWEB)

    Masarapu, Charan; Anguchamy, Yogesh Kumar; Han, Yongbong; Deng, Haixia; Kumar, Sujeet; Lopez, Herman A.

    2017-10-03

    Improved high energy capacity designs for lithium ion batteries are described that take advantage of the properties of high specific capacity anode active compositions and high specific capacity cathode active compositions. In particular, specific electrode designs provide for achieving very high energy densities. Furthermore, the complex behavior of the active materials is used advantageously in a radical electrode balancing design that significantly reduced wasted electrode capacity in either electrode when cycling under realistic conditions of moderate to high discharge rates and/or over a reduced depth of discharge.

  9. Implications of materials behavior on design codes

    International Nuclear Information System (INIS)

    Roberts, D.I.

    1981-01-01

    In the U.S., the design of Class 1 elevated-temperature components of reactor systems is governed by the rules of ASME Boiler and Pressure Vessel Cases N47 (design) and N48 (construction). The rules of Case N47, in particular, are sophisticated and complex, and a substantial quantity of materials behavior data is needed to design to these rules. Requirements include a detailed knowledge of creep, rupture, creep-fatigue, etc. In addition, many other factors, including such aspects as the influence on service performance of environment, welds, and fabrication-induced cold work, must be considered in the design. This paper reviews the impact of some recent HTGR materials data on design rules and approaches. (Auth.)

  10. Optimal parameters for laser tissue soldering

    Science.gov (United States)

    McNally-Heintzelman, Karen M.; Sorg, Brian S.; Chan, Eric K.; Welch, Ashley J.; Dawes, Judith M.; Owen, Earl R.

    1998-07-01

    Variations in laser irradiance, exposure time, solder composition, chromophore type and concentration have led to inconsistencies in published results of laser-solder repair of tissue. To determine optimal parameters for laser tissue soldering, an in vitro study was performed using an 808-nm diode laser in conjunction with an indocyanine green (ICG)- doped albumin protein solder to weld bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The effects of laser irradiance and exposure time on tensile strength of the weld and temperature rise as well as the effect of hydration on bond stability were investigated. Optimum irradiance and exposure times were identified for each solder type. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the weld. A reduction in dye concentration from 2.5 mg/ml to 0.25 mg/ml was also found to result in an increase in tensile strength. The strongest welds were produced with an irradiance of 6.4 W/cm2 for 50 s using a solid protein solder composed of 60% BSA and 0.25 mg/ml ICG. Steady-state solder surface temperatures were observed to reach 85 plus or minus 5 degrees Celsius with a temperature gradient across the solid protein solder strips of between 15 and 20 degrees Celsius. Finally, tensile strength was observed to decrease significantly (20 to 25%) after the first hour of hydration in phosphate-buffered saline. No appreciable change was observed in the strength of the tissue bonds with further hydration.

  11. Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

    National Research Council Canada - National Science Library

    Reuse, Rolando

    2005-01-01

    .... The thermomechanical cycling in the solder causes numerous reliability challenges, mostly because of the mismatch of the coefficient of thermal expansion between the silicon chip and the substrate...

  12. Rational design of reconfigurable prismatic architected materials

    Science.gov (United States)

    Overvelde, Johannes T. B.; Weaver, James C.; Hoberman, Chuck; Bertoldi, Katia

    2017-01-01

    Advances in fabrication technologies are enabling the production of architected materials with unprecedented properties. Most such materials are characterized by a fixed geometry, but in the design of some materials it is possible to incorporate internal mechanisms capable of reconfiguring their spatial architecture, and in this way to enable tunable functionality. Inspired by the structural diversity and foldability of the prismatic geometries that can be constructed using the snapology origami technique, here we introduce a robust design strategy based on space-filling tessellations of polyhedra to create three-dimensional reconfigurable materials comprising a periodic assembly of rigid plates and elastic hinges. Guided by numerical analysis and physical prototypes, we systematically explore the mobility of the designed structures and identify a wide range of qualitatively different deformations and internal rearrangements. Given that the underlying principles are scale-independent, our strategy can be applied to the design of the next generation of reconfigurable structures and materials, ranging from metre-scale transformable architectures to nanometre-scale tunable photonic systems.

  13. Extending ITER materials design to welded joints

    Energy Technology Data Exchange (ETDEWEB)

    Tavassoli, A.-A.F. [DMN/Dir, CEA/Saclay, Commissariat a l' Energie Atomique, 91191 Gif sur Yvette cedex (France)]. E-mail: tavassoli@cea.fr

    2007-08-01

    This paper extends the ITER materials properties documentation to weld metals and incorporates the needs of Test Blanket Modules for higher temperature materials properties. Since the main structural material selected for ITER is type 316L(N)-IG, the paper is focused on weld metals and joining techniques for this steel. Materials properties data are analysed according to the French design and construction rules for nuclear components (RCC-MR) and design allowables are equally derived using the same rules. Particular attention is paid to the type of weld metal, to the type and position of welding and their influence on the materials properties data and design allowables. The primary goal of this work, starting with 19-12-2 weld metal, is to produce comprehensive materials properties documentations that when combined with codification and inspection documents would satisfy ITER licensing needs. As a result, structural stability and capability of welded joints during manufacturing of ITER components and their subsequent service, including the effects of irradiation and eventual incidental or accidental situations, are also covered.

  14. Molecular designing of nanoparticles and functional materials

    Directory of Open Access Journals (Sweden)

    Ignjatović Nenad L.

    2017-01-01

    Full Text Available The interdisciplinary research team implemented the program titled “Molecular designing of nanoparticles with controlled morphological and physicochemical characteristics and functional materials based on them” (MODENAFUNA, between 2011 and 2016, gaining new knowledge significant to the further improvement of nanomaterials and nanotechnologies. It gathered under its umbrella six main interrelated topics pertaining to the design and control of morphological and physicochemical properties of nanoparticles and functional material based on them using new methods of synthesis and processing: 1 inorganic nanoparticles, 2 cathode materials for lithium-ion batteries, 3 functional ceramics with improved electrical and optical properties, 4 full density nanostructured calcium phosphate and functionally-graded materials, 5 nano-calcium phosphate in bone tissue engineering and 6 biodegradable micro- and nano-particles for the controlled delivery of medicaments. [Project of the Serbian Ministry of Education, Science and Technological Development, Grant no. III45004: Molecular designing of nanoparticles with controlled morphological and physicochemical characteristics and functional materials based on them

  15. Design of POLCA material control systems

    NARCIS (Netherlands)

    Riezebos, J.

    2010-01-01

    POLCA is a material control system designed for make-to-order or engineer-to-order companies. These firms have to cope with a high variety of customised products, and strong pressure to provide short throughput times. POLCA constrains the amount of work in progress on the shop floor in order to

  16. Implications of materials behavior on design codes

    International Nuclear Information System (INIS)

    Roberts, D.I.

    1981-04-01

    In the US, the design of Class 1 elevated-temperature components of reactor systems is governed by the rules of ASME Boiler and Pressure Vessel Cases N47 (design) and N48 (construction). The rules of Case N47, in particular, are sophisticated and complex, and a substantial quantity of materials behavior data is needed to design to these rules. Requirements include a detailed knowledge of creep, rupture, creep-fatigue, etc. In addition, many other factors, including such aspects as the influence on service performance of environment, welds, and fabrication-induced cold work, must be considered in the design. This paper reviews the impact of some recent HTGR materials data on design rules and approaches. In the construction area, for example, recent data regarding the elevated-temperature properties and behavior of cold-formed austenitic materials such as Alloy 800H have resulted in rule changes. Observed creep-fatigue behavior of Alloy 800H and 2-1/4Cr to 1Mo steel is causing active review of the pertinence of linear damage summation approaches

  17. Timber Curtain: Designing with material capabilities

    DEFF Research Database (Denmark)

    Lahmy, Maya; Larsen, Niels Martin

    2015-01-01

    of the generative phase to fabrication of the artefact. Brought together by various conceptual and structural elements the Timber Curtain forms a 4.5 x 2.5 x 0.5 m construct of assembled wood components, digitally crafted through advanced production techniques. Concerned with materiality and processing of the wood......Timber Curtain explores relations between digital precision and material indeterminacy. It is an installation engaging spatially through its presence as a 1:1 architectural component as well as it is exploring novel technologies in the architectural design process from the very beginning...... an associative digital model that could gather and compute in put from material behaviour and out put manufacturing data was scripted. This method enables material capacity to be pushed to the limit of its performance allowing novel sensuous and structural qualities to emerge. The method is developed with use...

  18. Fatigue damage modeling in solder interconnects using a cohesive zone approach

    NARCIS (Netherlands)

    Abdul-Baqi, A.J.J.; Schreurs, P.J.G.; Geers, M.G.D.

    2005-01-01

    The objective of this work is to model the fatigue damage process in a solder bump subjected to cyclic loading conditions. Fatigue damage is simulated using the cohesive zone methodology. Damage is assumed to occur at interfaces modeled through cohesive zones in the material, while the bulk material

  19. Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

    Science.gov (United States)

    Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

    2004-10-01

    It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

  20. The materials challenge for LFR core design

    International Nuclear Information System (INIS)

    Grasso, Giacomo; Agostini, Pietro

    2013-01-01

    LFR share the main issues of all Fast Reactors, while presenting specific issues due to the use of lead as coolant. A number of constraints impairs the design of a LFR core, possibly resulting in a viability domain not exploitable for producing electricity in an efficient (hence economic) way. In particular, the most restrictive issues to be faced pend on the cladding. The selection of proper cladding materials provides the solution for the issues impairing the resistance of the cladding against stresses and irradiation effects. On the other hand, the protection of the cladding requires surface protections like oxide scales (passivation) or adherent layers (coating). Oxide scales seem not sufficient for a stable and effective protection of the base material. The application of adherent layers seems the only promising solution for protecting the cladding against corrosion. For the short term (i.e.: ALFRED), advanced 15/15Ti with coating is the reference solution for the cladding, allowing a core design complying with all the design constraints and goals. The candidate coatings are already being tested under irradiation to proceed towards qualification. In parallel, new base materials and/or coatings are presently under investigation. For the long term (i.e.: ELFR), the availability of such advanced materials/coatings might allow the extension of the viability domain towards higher and broader ranges (temperature, dpa, etc.), extending the fields of applications of LFRs and resulting in higher performances

  1. Material selection for design, manufacturing and application

    International Nuclear Information System (INIS)

    Zaid, A.I.O.

    2011-01-01

    Developing a new engineering material product or changing an existing one requires new design selecting material and choosing appropriate and economical manufacturing processes. These three main factors play a great role on the performance of the product in service. These items are independent and should not be performed in isolation from each other. With the great advancement of technology in the last decade and with the greater number of engineering materials which are now available, together with the increasing pressure to produce more economic and get reliable products an integrated approach which considers design, material selection and the appropriate manufacturing process makes it easier to achieve the optimum product that combines the functional requirements with the reliability at competitive cost. These diverse activities or items are interdependent; therefore should not be considered in isolation from each other, for example, it is not sufficient that design of the product should satisfy the technical, safety and legal requirements, it must also be possible to be manufactured economically and to be sold at a competitive price and easily disposed at the end of its working life cycle. In this paper, the interaction of these items together in order to arrive to the optimum solution for a particular application are given and discussed. (author)

  2. ITER status, design and material objectives

    International Nuclear Information System (INIS)

    Aymar, R.

    2002-01-01

    During the ITER Engineering Design Activities (EDA), completed in July 2001, the Joint Central Team and Home Teams developed a robust design of ITER, summarised in this paper, with parameters which fully meet the required scientific and technological objectives, construction costs and safety requirements, with appropriate margins. The design is backed by R and D to qualify the technology, including materials R and D. Materials for ITER components have been selected largely because of their availability and well-established manufacturing technologies, taking account of the low fluence experienced during neutron irradiation, and the experimental nature of the device. Nevertheless, for specific needs relevant to a future fusion reactor, improved materials, in particular for magnet structures, in-vessel components, and joints between the different materials needed for plasma facing components, have been successfully developed. Now, with the technical readiness to decide on ITER construction, negotiations, supported by coordinated technical activities of an international team and teams from participant countries, are underway on joint construction of ITER with a view to the signature/ratification of an agreement in 2003

  3. Computer aided materials design; Keisanki zairyo sekkei

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1997-03-01

    The questionnaire survey on the computer aided materials design (CAMD), and the survey of current domestic and overseas software concerned were carried out to clarify developmental issues. The current elementary technology of CAMD was also surveyed to study its several problems caused with a progress of material design technology due to drastic diffusion of CAMD. This project aims at establishment of a new demanded software, computer chemistry, focusing attention on functional materials such as catalyst, polymer and non-linear electronic materials. Microscopic simulation technology was mainly surveyed in fiscal 1996. Although some fruitful results have been obtained in the fields of medical and agricultural chemicals, organic compounds, proteins, catalysts and electronic materials, such some problems are pointed out as `CAMD cannot handle an actual size of the target system` and `commercially available software are very expensive.` Reliable tool development as elementary technology, and the verification of its applications are thus required. Meso-dynamics, polymers, surface reaction and integrated technological environment attract users` attention. 27 refs., 16 figs., 2 tabs.

  4. Effect of gap distance on tensile strength of preceramic base metal solder joints.

    Science.gov (United States)

    Fattahi, Farnaz; Motamedi, Milad

    2011-01-01

    In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. Based on ADA/ISO 9693 specifications for tensile test, 40 specimens were fabricated from a Ni-Cr alloy and cut at the midpoint of 3-mm diameter bar and placed at desired positions by a specially designed device. The specimens were divided into four groups of 10 samples according to the desired solder gap distance: Group1: 0.1mm; Group2: 0.25mm; Group3: 0.5mm; and Group4: 0.75mm. After soldering, specimens were tested for tensile strength by a universal testing machine at a cross-head speed of 0.5mm/min with a preload of 10N. The mean tensile strength values of the groups were 162, 307.8, 206.1 and 336.7 MPa, respectively. The group with 0.75-mm gap had the highest and the group with 0.1-mm gap had the lowest tensile strength. Bonferroni test showed that Group1 and Group4 had statistically different values (P=0.023), but the differences between other groups were not sig-nificant at a significance level of 0.05. There was no direct relationship between increasing soldering gap distance and tensile strength of the solder joints.

  5. Fundamentals of lead-free solder interconnect technology from microstructures to reliability

    CERN Document Server

    Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao

    2015-01-01

    This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

  6. Urban public space materials. Maintenance and design?

    Directory of Open Access Journals (Sweden)

    Manuel Iglesias Campos

    2016-10-01

    Full Text Available In this paper, certain aspects related to the conservation of materials commonly used in the design of public spaces are analysed and discussed from a starting point of maintenance definition. The main area of discussion is whether materials selection for pavements and urban furniture, and their placement in the designed space, take into account their maintenance needs. Here the definition of maintenance is the cleaning and repair done by municipal services that is always necessary after construction. From certain examples it can be concluded that, in several cases, the form, the organization and the distribution of the different elements within the public space can cause difficulties for its appropriate conservation, giving rise to alterations and consequently having a negative impact on the durability of this space.

  7. Materials design for electrocatalytic carbon capture

    Directory of Open Access Journals (Sweden)

    Xin Tan

    2016-05-01

    Full Text Available We discuss our philosophy for implementation of the Materials Genome Initiative through an integrated materials design strategy, exemplified here in the context of electrocatalytic capture and separation of CO2 gas. We identify for a group of 1:1 X–N graphene analogue materials that electro-responsive switchable CO2 binding behavior correlates with a change in the preferred binding site from N to the adjacent X atom as negative charge is introduced into the system. A reconsideration of conductive N-doped graphene yields the discovery that the N-dopant is able to induce electrocatalytic binding of multiple CO2 molecules at the adjacent carbon sites.

  8. Computational Chemistry Toolkit for Energetic Materials Design

    Science.gov (United States)

    2006-11-01

    industry are aggressively engaged in efforts to develop multiscale modeling and simulation methodologies to model and analyze complex phenomena across...energetic materials design. It is hoped that this toolkit will evolve into a collection of well-integrated multiscale modeling methodologies...Experimenta Theoreticala This Work 1-5-Diamino-4- methyl- tetrazolium nitrate 8.4 41.7 47.5 1-5-Diamino-4- methyl- tetrazolium azide 138.1 161.6

  9. Computational Materials Program for Alloy Design

    Science.gov (United States)

    Bozzolo, Guillermo

    2005-01-01

    The research program sponsored by this grant, "Computational Materials Program for Alloy Design", covers a period of time of enormous change in the emerging field of computational materials science. The computational materials program started with the development of the BFS method for alloys, a quantum approximate method for atomistic analysis of alloys specifically tailored to effectively deal with the current challenges in the area of atomistic modeling and to support modern experimental programs. During the grant period, the program benefited from steady growth which, as detailed below, far exceeds its original set of goals and objectives. Not surprisingly, by the end of this grant, the methodology and the computational materials program became an established force in the materials communitiy, with substantial impact in several areas. Major achievements during the duration of the grant include the completion of a Level 1 Milestone for the HITEMP program at NASA Glenn, consisting of the planning, development and organization of an international conference held at the Ohio Aerospace Institute in August of 2002, finalizing a period of rapid insertion of the methodology in the research community worlwide. The conference, attended by citizens of 17 countries representing various fields of the research community, resulted in a special issue of the leading journal in the area of applied surface science. Another element of the Level 1 Milestone was the presentation of the first version of the Alloy Design Workbench software package, currently known as "adwTools". This software package constitutes the first PC-based piece of software for atomistic simulations for both solid alloys and surfaces in the market.Dissemination of results and insertion in the materials community worldwide was a primary focus during this period. As a result, the P.I. was responsible for presenting 37 contributed talks, 19 invited talks, and publishing 71 articles in peer-reviewed journals, as

  10. Material constraints on high-speed design

    Science.gov (United States)

    Bucur, Diana; Militaru, Nicolae

    2015-02-01

    Current high-speed circuit designs with signal rates up to 100Gbps and above are implying constraints for dielectric and conductive materials and their dependence of frequency, for component elements and for production processes. The purpose of this paper is to highlight through various simulation results the frequency dependence of specific parameters like insertion and return loss, eye diagrams, group delay that are part of signal integrity analyses type. In low-power environment designs become more complex as the operation frequency increases. The need for new materials with spatial uniformity for dielectric constant is a need for higher data rates circuits. The fiber weave effect (FWE) will be analyzed through the eye diagram results for various dielectric materials in a differential signaling scheme given the fact that the FWE is a phenomenon that affects randomly the performance of the circuit on balanced/differential transmission lines which are typically characterized through the above mentioned approaches. Crosstalk between traces is also of concern due to propagated signals that have tight rise and fall times or due to high density of the boards. Criteria should be considered to achieve maximum performance of the designed system requiring critical electronic properties.

  11. Improvement of the auto wire feeder machine in a de-soldering process

    Directory of Open Access Journals (Sweden)

    Niramon Nonkhukhetkhong

    2016-10-01

    Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

  12. Design of Molecular Materials: Supramolecular Engineering

    Science.gov (United States)

    Simon, Jacques; Bassoul, Pierre

    2001-02-01

    This timely and fascinating book is destined to be recognised as THE book on supramolecular engineering protocols. It covers this sometimes difficult subject in an approachable form, gathering together information from many sources. Supramolecular chemistry, which links organic chemistry to materials science, is one of the fastest growth areas of chemistry research. This book creates a correlation between the structure of single molecules and the physical and chemical properties of the resulting materials. By making systematic changes to the component molecules, the resulting solid can be engineered for optimum performance. There is a clearly written development from synthesis of designer molecules to properties of solids and further on to devices and complex materials systems, providing guidelines for mastering the organisation of these systems. Topics covered include: Systemic chemistry Molecular assemblies Notions of symmetry Supramolecular engineering Principe de Curie Organisation in molecular media Molecular semiconductors Industrial applications of molecular materials This superb book will be invaluable to researchers in the field of supramolecular materials and also to students and teachers of the subject.

  13. Size effects in tin-based lead-free solder joints: Kinetics of bond formation and mechanical characteristics

    Science.gov (United States)

    Abdelhadi, Ousama Mohamed Omer

    Continuous miniaturization of microelectronic interconnects demands smaller joints with comparable microstructural and structural sizes. As the size of joints become smaller, the volume of intermetallics (IMCs) becomes comparable with the joint size. As a result, the kinetics of bond formation changes and the types and thicknesses of IMC phases that form within the constrained region of the bond varies. This dissertation focuses on investigating combination effects of process parameters and size on kinetics of bond formation, resulting microstructure and the mechanical properties of joints that are formed under structurally constrained conditions. An experiment is designed where several process parameters such as time of bonding, temperature, and pressure, and bond thickness as structural chracteristic, are varied at multiple levels. The experiment is then implemented on the process. Scanning electron microscope (SEM) is then utilized to determine the bond thickness, IMC phases and their thicknesses, and morphology of the bonds. Electron backscatter diffraction (EBSD) is used to determine the grain size in different regions, including the bulk solder, and different IMC phases. Physics-based analytical models have been developed for growth kinetics of IMC compounds and are verified using the experimental results. Nanoindentation is used to determine the mechanical behavior of IMC phases in joints in different scales. Four-point bending notched multilayer specimen and four-point bending technique were used to determine fracture toughness of the bonds containing IMCs. Analytical modeling of peeling and shear stresses and fracture toughness in tri-layer four-point bend specimen containing intermetallic layer was developed and was verified and validated using finite element simulation and experimental results. The experiment is used in conjunction with the model to calculate and verify the fracture toughness of Cu6Sn5 IMC materials. As expected two different IMC phases

  14. Efforts to Develop a 300°C Solder

    Energy Technology Data Exchange (ETDEWEB)

    Norann, Randy A [Perma Works LLC

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  15. Bremsstrahlung convertors: materials design and development

    International Nuclear Information System (INIS)

    Allred, R.E.

    1976-03-01

    An improved bremsstrahlung convertor for use at high electron beam energies was developed. The convertor consists of three main components: (1) conversion foil; (2) electron scavenger; and (3) impulse shield. Structural failures of the impulse shield were experimentally determined to be caused by shock wave interactions. Convertor materials and design modifications were aimed at attenuation of the magnitude of the shock and maximization of energy absorption by the convertor materials. Techniques proven successful included the introduction of porosity into electron scavenger and impulse shield materials, the use of a standoff between the conversion foil and the electron scavenger, the insertion of a gap between the scavenger and impulse shield, and the use of advanced composite materials for the impulse shield. These modifications have increased the convertor operating range from 4 cal/gm Au to over 8 cal/gm Au. Kevlar 49 reinforced-resin composites have proven to have the best combination of strength, stiffness, toughness, and x-ray transport properties for use as bremmstrahlung convertor impulse shields

  16. In-vitro Investigations of Skin Closure using Diode Laser and Protein Solder Containing Gold Nanoshells

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2010-12-01

    Full Text Available Introduction: Laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. To overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nanoshells, a new class of nanoparticles consisting of a dielectric core surrounded by a thin metal shell, are used. The aims of this study were to use two different concentrations of gold nanoshells as the exogenous material for skin tissue soldering and also to examine the effects of laser soldering parameters on the properties of the repaired skin. Material and Methods: Two mixtures of albumin solder and different concentrations of gold nanoshells were prepared. A full thickness incision of 2×20 mm2 was made on the surface and after placing 50 μl of the solder mixture on the incision, an 810 nm diode laser was used to irradiate it at different power densities. The changes of tensile strength, σt, due to temperature rise, number of scan (Ns, and scan velocity (Vs were investigated. Results: The results showed that the tensile strength of the repaired skin increased with increasing irradiance for both gold nanoshell concentrations. In addition, at constant laser irradiance (I, the tensile strength of the repaired incision increased with increasing Ns and decreasing Vs. In our case, this corresponded to st = 1610 g/cm2 at I ~ 60 Wcm-2, T ~ 65ºC, Ns = 10 and Vs = 0.2 mms-1. Discussion and Conclusion: Gold nanoshells can be used as an indocyanine green dye (ICG alterative for laser tissue soldering.  Although by increasing the laser power density, the tensile strength of the repaired skin increases, an optimum power density must be considered due to the resulting increase in tissue temperature.

  17. Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction

    Science.gov (United States)

    Takaku, Yoshikazu; Ohnuma, Ikuo; Kainuma, Ryosuke; Yamada, Yasushi; Yagi, Yuji; Nishibe, Yuji; Ishida, Kiyohito

    2006-11-01

    Bismuth and its alloys are candidates for Pb-free high-temperature solders that can be substituted for conventional Pb-rich Pb-Sn solders (melting point (mp) = 573 583 K). However, inferior properties such as brittleness and weak bonding strength should be improved for practical use. To that end, BiCu-X (X=Sb, Sn, and Zn) Pb-free high-temperature solders are proposed. Miscibility gaps in liquid BiCu-X alloys were surveyed using the thermodynamic database ADAMIS (alloy database for micro-solders), and compositions of the BiCu-X solders were designed on the basis of calculation. In-situ composite solders that consist of a Bi-base matrix with fine intermetallic compound (IMC) particles were produced by gas-atomizing and melt-spinning methods. The interfacial reaction between in-situ composite solders and Cu or Ni substrates was investigated. The IMCs at the interface formed a thin, uniform layer, which is an appropriate morphology for a reliable solder joint.

  18. Industrial aspects: materials, designing and quality

    International Nuclear Information System (INIS)

    Blanc, M.

    2008-01-01

    First, this article reviews the evolution of the PWR fuel assembly manufactured by Westinghouse over 30 years and secondly gives a glimpse of the industrial organization of Westinghouse. The progressive changes in the design of the fuel assembly can be illustrated by the materials used: first Inconel then zircaloy-4, zirlo and now the optimized zirlo. The Westinghouse nuclear fuel destined to French pressurized reactors is fabricated in either Sweden (Vasteras) or in Spain (Juzbado). Fuel tubes are produced in Usa (Blairsville) or in Sweden (Sandvik). In the last 5 years Westinghouse has launched important programs for improving industrial processes and final products to reach customer satisfaction. (A.C.)

  19. THE POSSIBILITY OF USING LASER-ULTRASOUND TO MONITOR THE QUALITY SOLDERED CONNECTIONS CHAMBERS OF LIQUID ROCKET ENGINES

    Directory of Open Access Journals (Sweden)

    N. V. Astredinova

    2014-01-01

    Full Text Available During the manufacturing process to the design of modern liquid rocket engines are presented important requirements, such as minimum weight, maximum stiffness and strength of nodes, maximum service life in operation, high reliability and quality of soldered and welded seams. Due to the high quality requirements soldered connections and the specific design of the nozzle, it became necessary in the development and testing of a new non-conventional non-destructive testing method – laser-ultrasound diagnosis. In accordance with regulatory guidelines, quality control soldered connections is allowed to use an acoustic kind of control methods of the reflected light, transmitted light, resonant, free vibration and acoustic emission. Attempts to use traditional methods of non-destructive testing did not lead to positive results. This is due primarily to the size of typical solder joint defects, as well as the structural features of the rocket engine, the data structure is not controllable. In connection with this, a new method that provides quality control soldered connections cameras LRE based on the thermo generation of ultrasound. Methods of ultrasonic flaw detection of photoacoustic effect, in most cases, have a number of advantages over methods that use standard (traditional piezo transducers. In the course of studies have found that the sensitivity of the laser-ultrasonic method and flaw detector UDL-2M can detect lack of adhesion in the solder joints on the upper edges of the nozzle in the sub-header area of the site.

  20. Materials design principles of ancient fish armour

    Science.gov (United States)

    Bruet, Benjamin J. F.; Song, Juha; Boyce, Mary C.; Ortiz, Christine

    2008-09-01

    Knowledge of the structure-property-function relationships of dermal scales of armoured fish could enable pathways to improved bioinspired human body armour, and may provide clues to the evolutionary origins of mineralized tissues. Here, we present a multiscale experimental and computational approach that reveals the materials design principles present within individual ganoid scales from the `living fossil' Polypterus senegalus. This fish belongs to the ancient family Polypteridae, which first appeared 96 million years ago during the Cretaceous period and still retains many of their characteristics. The mechanistic origins of penetration resistance (approximating a biting attack) were investigated and found to include the juxtaposition of multiple distinct reinforcing composite layers that each undergo their own unique deformation mechanisms, a unique spatial functional form of mechanical properties with regions of differing levels of gradation within and between material layers, and layers with an undetectable gradation, load-dependent effective material properties, circumferential surface cracking, orthogonal microcracking in laminated sublayers and geometrically corrugated junctions between layers.

  1. A Hodge dual for soldered bundles

    International Nuclear Information System (INIS)

    Lucas, Tiago Gribl; Pereira, J G

    2009-01-01

    In order to account for all possible contractions allowed by the presence of the solder form, a generalized Hodge dual is defined for the case of soldered bundles. Although for curvature the generalized dual coincides with the usual one, for torsion it gives a completely new dual definition. Starting from the standard form of a gauge Lagrangian for the translation group, the generalized Hodge dual yields precisely the Lagrangian of the teleparallel equivalent of general relativity, and consequently also the Einstein-Hilbert Lagrangian of general relativity

  2. Visual detection of defects in solder joints

    Science.gov (United States)

    Blaignan, V. B.; Bourbakis, Nikolaos G.; Moghaddamzadeh, Ali; Yfantis, Evangelos A.

    1995-03-01

    The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new `frame' for the achievement of better results regarding efficiency, products quality and automated service. In this paper the visual detection and classification of different types of defects on solder joints in PC boards is presented by combining several image processing methods, such as smoothing, segmentation, edge detection, contour extraction and shape analysis. The results of this paper are based on simulated solder defects and a real one.

  3. An Approach for Impression Creep of Lead Free Microelectronic Solders

    Science.gov (United States)

    Anastasio, Onofrio A.

    2002-06-01

    Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

  4. Mechanical and materials engineering of modern structure and component design

    CERN Document Server

    Altenbach, Holm

    2015-01-01

    This book presents the latest findings on mechanical and materials engineering as applied to the design of modern engineering materials and components. The contributions cover the classical fields of mechanical, civil and materials engineering, as well as bioengineering and advanced materials processing and optimization. The materials and structures discussed can be categorized into modern steels, aluminium and titanium alloys, polymers/composite materials, biological and natural materials, material hybrids and modern nano-based materials. Analytical modelling, numerical simulation, state-of-the-art design tools and advanced experimental techniques are applied to characterize the materials’ performance and to design and optimize structures in different fields of engineering applications.

  5. Tools for Material Design and Selection

    Science.gov (United States)

    Wehage, Kristopher

    The present thesis focuses on applications of numerical methods to create tools for material characterization, design and selection. The tools generated in this work incorporate a variety of programming concepts, from digital image analysis, geometry, optimization, and parallel programming to data-mining, databases and web design. The first portion of the thesis focuses on methods for characterizing clustering in bimodal 5083 Aluminum alloys created by cryomilling and powder metallurgy. The bimodal samples analyzed in the present work contain a mixture of a coarse grain phase, with a grain size on the order of several microns, and an ultra-fine grain phase, with a grain size on the order of 200 nm. The mixing of the two phases is not homogeneous and clustering is observed. To investigate clustering in these bimodal materials, various microstructures were created experimentally by conventional cryomilling, Hot Isostatic Pressing (HIP), Extrusion, Dual-Mode Dynamic Forging (DMDF) and a new 'Gradient' cryomilling process. Two techniques for quantitative clustering analysis are presented, formulated and implemented. The first technique, the Area Disorder function, provides a metric of the quality of coarse grain dispersion in an ultra-fine grain matrix and the second technique, the Two-Point Correlation function, provides a metric of long and short range spatial arrangements of the two phases, as well as an indication of the mean feature size in any direction. The two techniques are implemented on digital images created by Scanning Electron Microscopy (SEM) and Electron Backscatter Detection (EBSD) of the microstructures. To investigate structure--property relationships through modeling and simulation, strategies for generating synthetic microstructures are discussed and a computer program that generates randomized microstructures with desired configurations of clustering described by the Area Disorder Function is formulated and presented. In the computer program, two

  6. The Plastic Bakery : A Case of Material Driven Design

    NARCIS (Netherlands)

    Majumdar, P.; Karana, E.; Sonneveld, M.H.; Karana, E.; Giaccardi, E.; Nimkulrat, N.; Niedderer, K.; Camere, S.

    2017-01-01

    A growing number of scholars argue that understanding how people experience materials in products, i.e. Materials Experience, is essential in
    designing meaningful material applications. Material Driven Design (MDD) has been developed as the method to understand these experiential traits
    of

  7. 46 CFR 58.05-1 - Material, design and construction.

    Science.gov (United States)

    2010-10-01

    ... 46 Shipping 2 2010-10-01 2010-10-01 false Material, design and construction. 58.05-1 Section 58.05... AUXILIARY MACHINERY AND RELATED SYSTEMS Main Propulsion Machinery § 58.05-1 Material, design and construction. (a) The material, design, construction, workmanship, and arrangement of main propulsion machinery...

  8. Development of Pb-Free Nanocomposite Solder Alloys

    Directory of Open Access Journals (Sweden)

    Animesh K. Basak

    2018-04-01

    Full Text Available As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs during aging/reflow. Accordingly, this study examines the improvement of properties of SAC alloys by incorporating nanoparticles in it. Two different types of nanoparticles were added in monolithic SAC alloy: (1 Al2O3 or (2 Fe and their effect on microstructure and thermal properties were investigated. Addition of Fe nanoparticles leads to the formation of FeSn2 IMCs alongside Ag3Sn and Cu6Sn5 from monolithic SAC alloy. Addition of Al2O3 nano-particles do not contribute to phase formation, however, remains dispersed along primary β-Sn grain boundaries and act as a grain refiner. As the addition of either Fe or Al2O3 nano-particles do not make any significant effect on thermal behavior, these reinforced nanocomposites are foreseen to provide better mechanical characteristics with respect to conventional monolithic SAC solder alloys.

  9. Processing and Characterization of NiTi Shape Memory Alloy Particle Reinforced Sn-In Solders

    National Research Council Canada - National Science Library

    Chung, Kohn C

    2006-01-01

    .... In previous work, it was proposed that reinforcement of solder by NiTi shape memory alloy particles to form smart composite solder reduces the inelastic strain of the solder and hence, may enhance...

  10. Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints

    Science.gov (United States)

    Huang, Z.; Kumar, P.; Dutta, I.; Sidhu, R.; Renavikar, M.; Mahajan, R.

    2014-01-01

    A fracture mechanism map (FMM) is a powerful tool which correlates the fracture behavior of a material to its microstructural characteristics in an explicit and convenient way. In the FMM for solder joints, an effective thickness of the interfacial intermetallic compound (IMC) layer ( t eff) and the solder yield strength ( σ ys,eff) are used as abscissa and ordinate axes, respectively, as these two predominantly affect the fracture behavior of solder joints. Earlier, a definition of t eff, based on the uniform thickness of IMC ( t u) and the average height of the IMC scallops ( t s), was proposed and shown to aptly explain the fracture behavior of solder joints on Cu. This paper presents a more general definition of t eff that is more widely applicable to a range of metallizations, including Cu and electroless nickel immersion gold (ENIG). Using this new definition of t eff, mode I FMM for SAC387/Cu joints has been updated and its validity was confirmed. A preliminary FMM for SAC387/Cu joints with ENIG metallization is also presented.

  11. Mass of materials: the impact of designers on construction ergonomics.

    Science.gov (United States)

    Smallwood, John

    2012-01-01

    Many construction injuries are musculoskeletal related in the form of sprains and strains arising from the handling of materials, which are specified by designers. The paper presents the results of a study conducted among delegates attending two 'designing for H&S' (DfH&S) seminars using a questionnaire. The salient findings include: the level of knowledge relative to the mass and density of materials is limited; designers generally do not consider the mass and density of materials when designing structures and elements and specifying materials; to a degree designers appreciate that the mass and density of materials impact on construction ergonomics; designers rate their knowledge of the mass and density of materials as limited, and designers appreciate the potential of the consideration of the mass and density of materials to contribute to an improvement in construction ergonomics. Conclusions include: designers lack the requisite knowledge relative to the mass and density of materials; designers are thus precluded from conducting optimum design hazard identification and risk assessments, and tertiary built environment designer education does not enlighten designers relative to construction ergonomics. Recommendations include: tertiary built environment designer education should construction ergonomics; professional associations should raise the level of awareness relative to construction ergonomics, and design practices should include a category 'mass and density of materials' in their practice libraries.

  12. Advanced power plant materials, design and technology

    Energy Technology Data Exchange (ETDEWEB)

    Roddy, D. (ed.) [Newcastle University (United Kingdom). Sir Joseph Swan Institute

    2010-07-01

    The book is a comprehensive reference on the state of the art of gas-fired and coal-fired power plants, their major components and performance improvement options. Selected chapters are: Integrated gasification combined cycle (IGCC) power plant design and technology by Y. Zhu, and H. C. Frey; Improving thermal cycle efficiency in advanced power plants: water and steam chemistry and materials performance by B. Dooley; Advanced carbon dioxide (CO{sub 2}) gas separation membrane development for power plants by A. Basile, F. Gallucci, and P. Morrone; Advanced flue gas cleaning systems for sulphur oxides (SOx), nitrogen oxides (NOx) and mercury emissions control in power plants by S. Miller and B.G. Miller; Advanced flue gas dedusting systems and filters for ash and particulate emissions control in power plants by B.G. Miller; Advanced sensors for combustion monitoring in power plants: towards smart high-density sensor networks by M. Yu and A.K. Gupta; Advanced monitoring and process control technology for coal-fired power plants by Y. Yan; Low-rank coal properties, upgrading and utilisation for improving the fuel flexibility of advanced power plants by T. Dlouhy; Development and integration of underground coal gasification (UCG) for improving the environmental impact of advanced power plants by M. Green; Development and application of carbon dioxide (CO{sub 2}) storage for improving the environmental impact of advanced power plants by B. McPherson; and Advanced technologies for syngas and hydrogen (H{sub 2}) production from fossil-fuel feedstocks in power plants by P. Chiesa.

  13. Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperature

    Energy Technology Data Exchange (ETDEWEB)

    Prabhu, K.N., E-mail: prabhukn_2002@yahoo.co.in [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India); Deshapande, Parashuram; Satyanarayan [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India)

    2012-01-30

    Highlights: Black-Right-Pointing-Pointer Effect of cooling rate on tensile and impact properties of Sn-9Zn alloy was assessed. Black-Right-Pointing-Pointer Both DBTT and UTS of the solder alloy increased with increase in cooling rate. Black-Right-Pointing-Pointer An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile-brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn-9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 Degree-Sign C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the

  14. Effect of cooling rate during solidification of Sn–9Zn lead-free solder alloy on its microstructure, tensile strength and ductile–brittle transition temperature

    International Nuclear Information System (INIS)

    Prabhu, K.N.; Deshapande, Parashuram; Satyanarayan

    2012-01-01

    Highlights: ► Effect of cooling rate on tensile and impact properties of Sn–9Zn alloy was assessed. ► Both DBTT and UTS of the solder alloy increased with increase in cooling rate. ► An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile–brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn–9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 °C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the DBTT.

  15. Appendix to the report from the low-residue soldering task force: Phase 2 results

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J.; Huffman, D.D. [and others

    1995-12-01

    The LRSTF report for Phase I of its evaluation of low-residue soldering was issued in June 1995. This Appendix summarizes the results of follow-on testing performed in Phase II and compares electrical test results for both phases. Deliberate decisions were made by the LRSTF in Phase I to challenge the design guideline limits in MILSTD-275, Printed Wiring for Electronic Equipment The LRSTF considered this approach to produce a ``worst case`` design and provide useful information about the robustness of LR soldering processes. As such, good design practices were sometimes deliberately violated in designing the LRSTF board. This approach created some anomalies for both LR boards and RMA/cleaned controls. Phase II testing verified that problems that affected both RMA/cleaned and LR boards in Phase I were design related.

  16. Characterizing performances of solder paste printing process at flexible manufacturing lines

    International Nuclear Information System (INIS)

    Siew, Jit Ping; Low, Heng Chin; Teoh, Ping Chow

    2015-01-01

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter

  17. Characterizing performances of solder paste printing process at flexible manufacturing lines

    Energy Technology Data Exchange (ETDEWEB)

    Siew, Jit Ping; Low, Heng Chin [University of Science Malaysia, 11800 Minden, Penang (Malaysia); Teoh, Ping Chow [Wawasan Open University, 54 Jalan Sultan Ahmad Shah, 10050 Penang (Malaysia)

    2015-02-03

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter.

  18. Effect of Solder Flux Residues on Corrosion of Electronics

    DEFF Research Database (Denmark)

    Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per

    2009-01-01

    Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA...... testing and use in the field, consequences and recommendations are given. Failures, caused by harsh[1] customer environments, are not covered in this paper....

  19. Mechanical properties of soldered joints of niobium base alloys

    International Nuclear Information System (INIS)

    Grishin, V.L.

    1980-01-01

    Mechanical properties of soldered joints of niobium alloys widely distributed in industry: VN3, VN4, VN5A, VN5AE, VN5AEP etc., 0.6-1.2 mm thick are investigated. It is found out that the usage of zirconium-vanadium, titanium-tantalum solders for welding niobium base alloys permits to obtain soldered joints with satisfactory mechanical properties at elevated temperatures

  20. New ways of integrating material knowledge into the design process

    DEFF Research Database (Denmark)

    Højris, Anders; Nielsen, Louise Møller

    2013-01-01

    – based on technical performance, no longer apply. Accordingly the approach in this paper is to view information and knowledge about materials through the perspective of organizational memory and technology brokering. This paper is build upon two cases from the German based design studio: designaffairs...... libraries and thereby access to information on new material possibilities has also changed the way designers integrate knowledge about materials into the design process. This means that the traditional design process model, where the selection of materials takes place after the design of form and function...... in order to help clients to find the right material among hundreds of samples. Furthermore a number of material libraries have also been developed into online database, which provides detailed information about new material and makes the information accessible from almost everywhere. The access to material...

  1. Material, Structural Design of Armour Units

    DEFF Research Database (Denmark)

    Burcharth, Hans F.

    Stone and concrete are two materials generally used for the construction of rubble mound breakwaters. This paper deals with concrete only.......Stone and concrete are two materials generally used for the construction of rubble mound breakwaters. This paper deals with concrete only....

  2. Evaluation on the characteristics of tin-silver-bismuth solder

    Science.gov (United States)

    Xia, Z.; Shi, Y.; Chen, Z.

    2002-02-01

    Tin-silver-bismuth solder is characterized by its lower melting point, good wetting behavior, and good mechanical property for which it is expected to be a new lead-free solder to replace tin-lead solder. In this article, Sn-3.33Ag-4.83Bi solder was investigated concerning its physical, spreading, and mechanical properties under specific conditions. Cooling curves and DSC results showed that it was close to eutectic composition (m.p. 210° 212 °C). Coefficiency of thermal expansion (CTE) of this solder, between that of PCBs and copper substrates, was beneficial to alleviate the thermal mismatch of the substrates. It was also a good electrical and thermal conductor. Using a rosin-based, mildly activated (RMA) flux, a spreading test indicated that SnAgBi solder paste had good solderability. Meanwhile, the solder had high tensile strength and fracture energy. Its fracture mechanism was a mixture of ductile and brittle fracture morphology. The metallographic and EDAX analyses indicated that it was composed of a tin-based solid solution and some intermetallic compound (IMC) that could strengthen the substrate. However, these large needle-like IMCs would cut the substrate and this resulted in the decreasing of the toughness of the solder.

  3. Design and analysis of novel photocatalytic materials

    Science.gov (United States)

    Boppana, Venkata Bharat Ram

    The development of sustainable sources of energy to decrease our dependence on non-renewable fossil fuels and the reduction of emissions causing global warming are important technological challenges of the 21st century. Production of solar fuels by photocatalysis is one potential route to reduce the impact of those problems. The most widely applied photocatalyst is TiO2 because it is stable, non-toxic and inexpensive. Still, it cannot utilize the solar spectrum efficiently as its band gap is 3.2 eV thus able to absorb only 3% of sun light. This thesis therefore explores multiple avenues towards improving the light absorption capability of semiconductor materials without loss in activity. To achieve this objective, the valence band hybridization method of band gap reduction was utilized. This technique is based on introducing new orbitals at the top of valence band of the semiconductor that can then hybridize with existing orbitals. The hybridization then raises the maximum of the valence band thereby reducing the band gap. This technique has the added advantage of increasing the mobility of oxidizing holes in the now dispersed valence band. In practice, this can be achieved by introducing N 2p or Sn 5s orbitals in the valence band of an oxide. We initially designed novel zinc gallium oxy-nitrides, with the spinel structure and band gaps in the visible region of the solar spectrum, by nitridation of a zinc gallate precursor produced by sol-gel synthesis. These spinel oxy-nitrides have band gaps of 2.5 to 2.7 eV, surface areas of 16 to 36 m 2/g, and nitrogen content less than 1.5%. They are active towards degradation of organic molecules in visible light. Density functional theory calculations show that this band gap reduction in part is associated with hybridization between the dopant N 2p states with Zn 3d orbitals at the top of the valence band. While spinel oxy-nitrides are produced under nitridation at 550°C, at higher temperatures they are consumed to form

  4. The effect of micro alloying on the microstructure evolution of Sn-Ag-Cu lead-free solder

    Science.gov (United States)

    Werden, Jesse

    The microelectronics industry is required to obtain alternative Pb-free soldering materials due to legal, environmental, and technological factors. As a joining material, solder provides an electrical and mechanical support in electronic assemblies and therefore, the properties of the solder are crucial to the durability and reliability of the solder joint and the function of the electronic device. One major concern with new Pb-free alternatives is that the microstructure is prone to microstructural coarsening over time which leads to inconsistent properties over the device's lifetime. Power aging the solder is a common method of stabilizing the microstructure for Pb-based alloys, however, it is unclear if this will be an appropriate solution to the microstructural coarsening of Pb-free solders. The goal of this work is to develop a better understanding of the coarsening process in new solder alloys and to suggest methods of stabilizing the solder microstructure. Microalloying is one potential solution to the microstructural coarsening problem. This experiment consists of a microstructural coarsening study of SAC305 in which each sample has been alloyed with one of three different solutes, directionally solidified at 100microm/s, and then aged at three different temperatures over a total period of 20 days. There are several important conclusions from this experiment. First, the coarsening kinetics of the intermetallics in the ternary eutectic follow the Ostwald ripening model where r3 in proprotional to t for each alloying constituent. Second, the activation energy for coarsening was found to be 68.1+/-10.3 kJ/mol for the SAC305 samples, Zn had the most significant increase in the activation energy increasing it to 88.8+/-34.9 kJ/mol for the SAC+Zn samples, Mn also increased the activation energy to 83.2+/-20.8 kJ/mol for the SAC+Mn samples, and Sb decreased the activation energy to 48.0+/-3.59 kJ/mol for the SAC+Sb samples. Finally, it was found that the

  5. Fluxless flip-chip bonding using a lead-free solder bumping technique

    Science.gov (United States)

    Hansen, K.; Kousar, S.; Pitzl, D.; Arab, S.

    2017-09-01

    With the LHC exceeding the nominal instantaneous luminosity, the current barrel pixel detector (BPIX) of the CMS experiment at CERN will reach its performance limits and undergo significant radiation damage. In order to improve detector performance in high luminosity conditions, the entire BPIX is replaced with an upgraded version containing an additional detection layer. Half of the modules comprising this additional layer are produced at DESY using fluxless and lead-free bumping and bonding techniques. Sequential solder-jetting technique is utilized to wet 40-μm SAC305 solder spheres on the silicon-sensor pads with electroless Ni, Pd and immersion Au (ENEPIG) under-bump metallization (UBM). The bumped sensors are flip-chip assembled with readout chips (ROCs) and then reflowed using a flux-less bonding facility. The challenges for jetting low solder volume have been analyzed and will be presented in this paper. An average speed of 3.4 balls per second is obtained to jet about 67 thousand solder balls on a single chip. On average, 7 modules have been produced per week. The bump-bond quality is evaluated in terms of electrical and mechanical properties. The peak-bump resistance is about 17.5 mΩ. The cross-section study revealed different types of intermetallic compounds (IMC) as a result of interfacial reactions between UBM and solder material. The effect of crystalline phases on the mechanical properties of the joint is discussed. The mean shear strength per bump after the final module reflow is about 16 cN. The results and sources of yield loss of module production are reported. The achieved yield is 95%.

  6. Designing Teaching Materials for Learning Problem Solving in Technology Education

    NARCIS (Netherlands)

    Doornekamp, B.G.

    In the process of designing teaching materials for learning problem solving in technology education, domain-specific design specifications are considered important elements to raise learning outcomes with these materials. Two domain-specific design specifications were drawn up using a four-step

  7. Synthesis and design of silicide intermetallic materials

    Energy Technology Data Exchange (ETDEWEB)

    Petrovic, J.J.; Castro, R.G.; Butt, D.P. [Los Alamos National Lab., NM (United States)] [and others

    1997-04-01

    The overall objective of this program is to develop structural silicide-based materials with optimum combinations of elevated temperature strength/creep resistance, low temperature fracture toughness, and high temperature oxidation and corrosion resistance for applications of importance to the U.S. processing industry. A further objective is to develop silicide-based prototype industrial components. The ultimate aim of the program is to work with industry to transfer the structural silicide materials technology to the private sector in order to promote international competitiveness in the area of advanced high temperature materials and important applications in major energy-intensive U.S. processing industries. The program presently has a number of developing industrial connections, including a CRADA with Schuller International Inc. targeted at the area of MoSi{sub 2}-based high temperature materials and components for fiberglass melting and processing applications. The authors are also developing an interaction with the Institute of Gas Technology (IGT) to develop silicides for high temperature radiant gas burner applications, for the glass and other industries. Current experimental emphasis is on the development and characterization of MoSi{sub 2}-Si{sub 3}N{sub 4} and MoSi{sub 2}-SiC composites, the plasma spraying of MoSi{sub 2}-based materials, and the joining of MoSi{sub 2} materials to metals.

  8. Design and Fabrication of Aerospace-Grade Digital Composite Materials

    Data.gov (United States)

    National Aeronautics and Space Administration — This project aims to advance design rules and fabrication approaches to create aerospace-grade structures from digital composite materials. Digital materials are...

  9. Design for containment of hazardous materials

    International Nuclear Information System (INIS)

    Murray, R.C.; McDonald, J.R.

    1991-03-01

    Department of Energy, (DOE), facilities across the United States, use wind and tornado design and evaluation criteria based on probabilistic performance goals. In addition, other programs such as Advanced Light Water Reactors, New Production Reactors, and Individual Plant Examinations for External Events for commercial nuclear power plants utilize design and evaluation criteria based on probabilistic performance goals. The use of probabilistic performance goals is a departure from design practice for commercial nuclear power plants which have traditionally been designed utilizing a conservative specification of wind and tornado loading combined with deterministic response evaluation methods and permissible behavior limits. Approaches which utilize probabilistic wind and tornado hazard curves for specification of loading and deterministic response evaluation methods and permissible behavior limits are discussed in this paper. Through the use of such design/evaluation approaches, it may be demonstrated that there is high likelihood that probabilistic performance goals can be achieved. 14 refs., 1 fig., 5 tabs

  10. Nanoconstruction by welding individual metallic nanowires together using nanoscale solder

    International Nuclear Information System (INIS)

    Peng, Y; Inkson, B J; Cullis, A G

    2010-01-01

    This work presents a new bottom-up nanowelding technique enabling building blocks to be assembled and welded together into complex 3D nanostructures using nanovolumes of metal solder. The building blocks of gold nanowires, (Co 72 Pt 28 /Pt) n multilayer nanowires, and nanosolder Sn 99 Au 1 alloy nanowires were successfully fabricated by a template technique. Individual metallic nanowires were picked up and assembled together. Conductive nanocircuits were then welded together using similar or dissimilar nanosolder material. At the weld sites, nanoscale volumes of a chosen metal are deposited using nanosolder of a sacrificial nanowire, which ensures that the nanoobjects to be bonded retain their structural integrity. The whole nanowelding process is clean, controllable and reliable, and ensures both mechanically strong and electrically conductive contacts.

  11. Design to Robotic Production for Informed Materialization Processes

    Directory of Open Access Journals (Sweden)

    Sina Mostafavi

    2017-12-01

    Full Text Available Design to Robotic Production (D2RP establishes links between digital design and production in order to achieve informed materialization at an architectural scale. D2RP research is being discussed under the computation, automation and materialization themes, by reference to customizable digital design means, robotic fabrication setups and informed materialization strategies implemented by the Robotic Building group at Hyperbody, TU Delft.

  12. Design concepts for improved thermoelectric materials

    Energy Technology Data Exchange (ETDEWEB)

    Slack, G A

    1997-07-01

    Some new guidelines are given that should be useful in the search for thermoelectric materials that are better than those currently available. In particular, clathrate and cryptoclathrate compounds with filler atoms in their cages offer the ability to substantially lower the lattice thermal conductivity.

  13. Bionic Design, Materials and Performance of Bone Tissue Scaffolds

    Directory of Open Access Journals (Sweden)

    Tong Wu

    2017-10-01

    Full Text Available Design, materials, and performance are important factors in the research of bone tissue scaffolds. This work briefly describes the bone scaffolds and their anatomic structure, as well as their biological and mechanical characteristics. Furthermore, we reviewed the characteristics of metal materials, inorganic materials, organic polymer materials, and composite materials. The importance of the bionic design in preoperative diagnosis models and customized bone scaffolds was also discussed, addressing both the bionic structure design (macro and micro structure and the bionic performance design (mechanical performance and biological performance. Materials and performance are the two main problems in the development of customized bone scaffolds. Bionic design is an effective way to solve these problems, which could improve the clinical application of bone scaffolds, by creating a balance between mechanical performance and biological performance.

  14. Life cycle assessment (LCA of lead-free solders from the environmental protection aspect

    Directory of Open Access Journals (Sweden)

    Mitovski Aleksandra M.

    2009-01-01

    Full Text Available Life-cycle assessment (LCA presents a relatively new approach, which allows comprehensive environmental consequences analysis of a product system over its entire life. This analysis is increasingly being used in the industry, as a tool for investigation of the influence of the product system on the environment, and serves as a protection and prevention tool in ecological management. This method is used to predict possible influences of a certain material to the environment through different development stages of the material. In LCA, the product systems are evaluated on a functionally equivalent basis, which, in this case, was 1000 cubic centimeters of an alloy. Two of the LCA phases, life-cycle inventory (LCA and life-cycle impact assessment (LCIA, are needed to calculate the environmental impacts. Methodology of LCIA applied in this analysis aligns every input and output influence into 16 different categories, divided in two subcategories. The life-cycle assessment reaserch review of the leadfree solders Sn-Cu, SAC (Sn-Ag-Cu, BSA (Bi-Sb-Ag and SABC (Sn-Ag-Bi-Cu respectively, is given in this paper, from the environmental protection aspect starting from production, through application process and finally, reclamation at the end-of-life, i.e. recycling. There are several opportunities for reducing the overall environmental and human health impacts of solder used in electronics manufacturing based on the results of the LCA, such as: using secondary metals reclaimed through post-industrial recycling; power consumption reducing by replacing older, less efficient reflow assembly equipment, or by optimizing the current equipment to perform at the elevated temperatures required for lead-free soldering, etc. The LCA analysis was done comparatively in relation to widely used Sn-Pb solder material. Additionally, the impact factors of material consumption, energy use, water and air reserves, human health and ecotoxicity have been ALSO considered including

  15. Study of silicon chip soldering in high-power transistor housing

    Directory of Open Access Journals (Sweden)

    Vasily S. Anosov

    2017-09-01

    We experimentally assessed the effect of outer housing layer materials and back side chip metallization. For lead-silver soldering of silicon chips, the best housing is that with a nickel outer layer rather than with a gold-plated one, because the resultant thermal resistance is lower and the absence of gold makes the technology cheaper. We obtained a 0.6 K/W thermal resistance for a 24 mm2 chip area.

  16. In-vitro investigations of skin closure using diode laser and protein solder containing gold nano shells

    International Nuclear Information System (INIS)

    Nourbakhsh, M. S.; Etrati Khosroshahi, M.

    2011-01-01

    Laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. To overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nano shells, a new class of nanoparticles consisting of a dielectric core surrounded by a thin metal shell, are used. The aims of this study were to use two different concentrations of gold nano shells as the exogenous material for skin tissue soldering and also to examine the effects of laser soldering parameters on the properties of the repaired skin. Material and Methods: Two mixtures of albumin solder and different concentrations of gold nano shells were prepared. A full thickness incision of 2*20 mm 2 was made on the surface and after placing 50 μ1 of the solder mixture on the incision, an 810 nm diode laser was used to irradiate it at different power densities. The changes of tensile strength, σt, due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. Results: The results showed that the tensile strength of the repaired skin increased with increasing irradiance for both gold nano shell concentrations. In addition, at constant laser irradiance (I), the tensile strength of the repaired incision increased with increasing Ns and decreasing Vs. In our case, this corresponded to σt = 1610 g/cm 2 at I ∼ 60 W cm-2, T ∼ 65 d egree C , Ns = 10 and Vs = 0.2 mms-1. Discussion and Conclusion: Gold nano shells can be used as an indocyanine green dye alterative for laser tissue soldering. Although by increasing the laser power density, the tensile strength of the repaired skin increases, an optimum power density must be considered due to the resulting increase in tissue temperature.

  17. Laser-activated protein solder for peripheral nerve repair

    Science.gov (United States)

    Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

    1995-05-01

    A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

  18. Structural optimization for materially informed design to robotic production processes

    NARCIS (Netherlands)

    Bier, H.H.; Mostafavi, S.

    2015-01-01

    Hyperbody’s materially informed Design-to-Robotic-Production (D2RP) processes for additive and subtractive manufacturing aim to achieve performative porosity in architecture at various scales. An extended series of D2RP experiments aiming to produce prototypes at 1:1 scale wherein design materiality

  19. Computational materials design for energy applications

    Science.gov (United States)

    Ozolins, Vidvuds

    2013-03-01

    General adoption of sustainable energy technologies depends on the discovery and development of new high-performance materials. For instance, waste heat recovery and electricity generation via the solar thermal route require bulk thermoelectrics with a high figure of merit (ZT) and thermal stability at high-temperatures. Energy recovery applications (e.g., regenerative braking) call for the development of rapidly chargeable systems for electrical energy storage, such as electrochemical supercapacitors. Similarly, use of hydrogen as vehicular fuel depends on the ability to store hydrogen at high volumetric and gravimetric densities, as well as on the ability to extract it at ambient temperatures at sufficiently rapid rates. We will discuss how first-principles computational methods based on quantum mechanics and statistical physics can drive the understanding, improvement and prediction of new energy materials. We will cover prediction and experimental verification of new earth-abundant thermoelectrics, transition metal oxides for electrochemical supercapacitors, and kinetics of mass transport in complex metal hydrides. Research has been supported by the US Department of Energy under grant Nos. DE-SC0001342, DE-SC0001054, DE-FG02-07ER46433, and DE-FC36-08GO18136.

  20. Data Science and Optimal Learning for Material Discovery and Design

    Science.gov (United States)

    ; Optimal Learning for Material Discovery & Design Data Science and Optimal Learning for Material inference and optimization methods that can constrain predictions using insights and results from theory directions in the application of information theoretic tools to materials problems related to learning from

  1. Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder

    Science.gov (United States)

    2015-05-05

    under bump metallurgy and solder joint geometry on Sn grain morphology in Pb free solder joints were examined. SnAgCu solder joints were examined for...free solder interconnects”, Sci. Technol. Weld . Join. 13, 732 (2008). [3.25] Terashima, S., Takahama, K., Nozaki, M., and Tanaka, M. Recrystallization

  2. Workshop on materials control and accounting system design

    International Nuclear Information System (INIS)

    Pillay, K.K.S.

    1989-01-01

    The chapter describes the workshop aimed at reinforcing, through participation in the design exercise, the concepts of nuclear materials control and accountability. Topics include: workshop format; key elements of a materials management and accounting (MC and A) system; and MC and A system design including safeguards organization and management, material access areas, key measurement points, nuclear materials measurements, physical inventory, material balance closings, and internal controls. Appended to this chapter is a detailed description of a facility that produces metallic plutonium and the safeguards requirements for this facility

  3. Materiality and Visualization in Hospital Design

    DEFF Research Database (Denmark)

    Harty, Chris; Tryggestad, Kjell

    healthcare systems, single bed rooms are being seen as the preferred alternative to more traditional ward-style accommodation, as it has advantages for privacy and dignity for patients, less disruption to other patients and better control of hospital acquired infections. But fundamentally, single rooms mean...... of different representations and visualizations – economic calculations, drawings, and virtual and physical models. We use these cases to discuss the roles of different sorts of representations and visualizations in design process, in terms of opening up and settling controversies (such as room size), in terms...

  4. Synthesis and Materials Design for Heteroanion Compounds

    Science.gov (United States)

    Machida, K.

    2011-02-01

    Oxynitride phosphors, SrSi2O2N2:Eu2+ were synthesized through a conventional solid state reaction between Sr2SiO4:Eu2+ precursor and Si3N4 by using NH4Cl flux, and their luminescence properties were characterized from a viewpoint of the ionic and covalent bond natures as the "heteroanion compound" containing O2- and N3- anions. The structural framework of host lattice is constructed by covalently bonded layers of SiON3 units, suggesting that the rearrangement of O2- and N3- anions effectively takes place between isolated SiO44-anions of the Sr2SiO4:Eu2+ precursor and SiN4 units of the Si3N4 raw material. Furthermore, the layered structure consisting of (Si2O2N2)n2n- polyanions as tightly connected by Si-N-Si covalent bonds depresses the lattice vibration of Sr(Eu)-O or Si-O bond, so that the temperature quenching effect is lowered to give the intense emission for LED-based illumination lamps.

  5. Synthesis and Materials Design for Heteroanion Compounds

    International Nuclear Information System (INIS)

    Machida, K

    2011-01-01

    Oxynitride phosphors, SrSi 2 O 2 N 2 :Eu 2+ were synthesized through a conventional solid state reaction between Sr 2 SiO 4 :Eu 2+ precursor and Si 3 N 4 by using NH 4 Cl flux, and their luminescence properties were characterized from a viewpoint of the ionic and covalent bond natures as the 'heteroanion compound' containing O 2- and N 3- anions. The structural framework of host lattice is constructed by covalently bonded layers of SiON 3 units, suggesting that the rearrangement of O 2- and N 3- anions effectively takes place between isolated SiO4 4- anions of the Sr 2 SiO 4 :Eu 2+ precursor and SiN 4 units of the Si 3 N 4 raw material. Furthermore, the layered structure consisting of (Si 2 O 2 N 2 )n 2n- polyanions as tightly connected by Si-N-Si covalent bonds depresses the lattice vibration of Sr(Eu)-O or Si-O bond, so that the temperature quenching effect is lowered to give the intense emission for LED-based illumination lamps.

  6. Material mediation and embodied actions in collaborative design process

    Directory of Open Access Journals (Sweden)

    Henna Lahti

    2016-02-01

    Full Text Available Material and embodied practices are an intrinsic part of craft and design education. This article reports a study in which textile teacher-students designed three-dimensional toys based on children’s drawings. Three students in each team worked on the given materials and designed the shape of the toy together. Materials for designing were either: 1 pen and paper, 2 masking tape and thin cardboard, or 3 wire and non-woven interfacing fabric. After the modelling phase, the final toys were created by sewing. Research data consisted of the video recordings of three design sessions representing the various design materials given to the students. By conducting multiple levels of analysis, we examined how the participants used materials and gestures to support their communication. The results highlight the strengths of 3D modelling techniques, particularly through comparison with the drawing technique undertaken by one design team. We found that simple material tools support students’ design process and suggest this could be applied to other design settings.

  7. Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/ Pd/ Au surface finishes

    International Nuclear Information System (INIS)

    NorAkmal, F.; Ourdjini, A.; Azmah Hanim, M.A.; Siti Aisha, I.; Chin, Y.T.

    2007-01-01

    Flip chip technology provides the ultimate in high I/ O-density and count with superior electrical performance for interconnecting electronic components. Therefore, the study of the intermetallic compounds was conducted to investigate the effect of solder bumps sizes on several surface finishes which are copper and Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) which is widely used in electronics packaging as surface finish for flip-chip application nowadays. In this research, field emission scanning electron microscopy (FESEM) analysis was conducted to analyze the morphology and composition of intermetallic compounds (IMCs) formed at the interface between the solder and UBM. The IMCs between the SAC lead-free solder with Cu surface finish after reflow were mainly (Cu, Ni) 6 Sn 5 and Cu 6 Sn 5 . While the main IMCs formed between lead-free solder on ENEPIG surface finish are (Ni, Cu) 3 Sn 4 and Ni 3 Sn 4 . The results from FESEM with energy dispersive x-ray (EDX) have revealed that isothermal aging at 150 degree Celsius has caused the thickening and coarsening of IMCs as well as changing them into more spherical shape. The thickness of the intermetallic compounds in both finishes investigated was found to be higher in solders with smaller bump size. From the experimental results, it also appears that the growth rate of IMCs is higher when soldering on copper compared to ENEPIG finish. Besides that, the results also showed that the thickness of intermetallic compounds was found to be proportional to isothermal aging duration. (author)

  8. Cultivating Design Thinking in Students through Material Inquiry

    Science.gov (United States)

    Renard, Helene

    2014-01-01

    Design thinking is a way of understanding and engaging with the world that has received much attention in academic and business circles in recent years. This article examines a hands-on learning model as a vehicle for developing design thinking capacity in students. An overview of design thinking grounds the discussion of the material-based…

  9. Designing Educative Curriculum Materials: A Theoretically and Empirically Driven Process

    Science.gov (United States)

    Davis, Elizabeth A.; Palincsar, Annemarie Sullivan; Arias, Anna Maria; Bismack, Amber Schultz; Marulis, Loren M.; Iwashyna, Stefanie K.

    2014-01-01

    In this article, the authors argue for a design process in the development of educative curriculum materials that is theoretically and empirically driven. Using a design-based research approach, they describe their design process for incorporating educative features intended to promote teacher learning into existing, high-quality curriculum…

  10. Design of advanced materials for linear and nonlinear dynamics

    DEFF Research Database (Denmark)

    Frandsen, Niels Morten Marslev

    to reveal the fundamental dynamic characteristics and thus the relevant design parameters.The thesis is built around the characterization of two one-dimensional, periodic material systems. The first is a nonlinear mass-spring chain with periodically varying material properties, representing a simple......The primary catalyst of this PhD project has been an ambition to design advanced materials and structural systems including, and possibly even exploiting, nonlinear phenomena such as nonlinear modal interaction leading to energy conversion between modes. An important prerequisite for efficient...... but general model of inhomogeneous structural materials with nonlinear material characteristics. The second material system is an “engineered” material in the sense that a classical structural element, a linear elastic and homogeneous rod, is “enhanced” by applying a mechanism on its surface, amplifying...

  11. Photovoltaic module encapsulation design and materials selection, volume 1

    Science.gov (United States)

    Cuddihy, E.; Carroll, W.; Coulbert, C.; Gupta, A.; Liang, R. H.

    1982-01-01

    Encapsulation material system requirements, material selection criteria, and the status and properties of encapsulation materials and processes available are presented. Technical and economic goals established for photovoltaic modules and encapsulation systems and their status are described. Available encapsulation technology and data are presented to facilitate design and material selection for silicon flat plate photovoltaic modules, using the best materials available and processes optimized for specific power applications and geographic sites. The operational and environmental loads that encapsulation system functional requirements and candidate design concepts and materials that are identified to have the best potential to meet the cost and performance goals for the flat plate solar array project are described. Available data on encapsulant material properties, fabrication processing, and module life and durability characteristics are presented.

  12. Soldering formalism in noncommutative field theory: a brief note

    International Nuclear Information System (INIS)

    Ghosh, Subir

    2004-01-01

    In this Letter, I develop the soldering formalism in a new domain--the noncommutative planar field theories. The soldering mechanism fuses two distinct theories showing opposite or complimentary properties of some symmetry, taking into account the interference effects. The above mentioned symmetry is hidden in the composite (or soldered) theory. In the present work it is shown that a pair of noncommutative Maxwell-Chern-Simons theories, having opposite signs in their respective topological terms, can be consistently soldered to yield the Proca model (Maxwell theory with a mass term) with corrections that are at least quadratic in the noncommutativity parameter. We further argue that this model can be thought of as the noncommutative generalization of the Proca theory of ordinary spacetime. It is well known that abelian noncommutative gauge theory bears a close structural similarity with non-abelian gauge theory. This fact is manifested in a non-trivial way if the present Letter is compared with existing literature, where soldering of non-abelian models are discussed. Thus the present work further establishes the robustness of the soldering programme. The subtle role played by gauge invariance (or the lack of it), in the above soldering process, is revealed in an interesting way

  13. Utilization of Pb-free solders in MEMS packaging

    Science.gov (United States)

    Selvaduray, Guna S.

    2003-01-01

    Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

  14. Fatigue and thermal fatigue of Pb-Sn solder joints

    International Nuclear Information System (INIS)

    Frear, D.; Grivas, D.; McCormack, M.; Tribula, D.; Morris, J.W. Jr.

    1987-01-01

    This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55 0 C and 125 0 C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb

  15. The automated design of materials far from equilibrium

    Science.gov (United States)

    Miskin, Marc Z.

    Automated design is emerging as a powerful concept in materials science. By combining computer algorithms, simulations, and experimental data, new techniques are being developed that start with high level functional requirements and identify the ideal materials that achieve them. This represents a radically different picture of how materials become functional in which technological demand drives material discovery, rather than the other way around. At the frontiers of this field, materials systems previously considered too complicated can start to be controlled and understood. Particularly promising are materials far from equilibrium. Material robustness, high strength, self-healing and memory are properties displayed by several materials systems that are intrinsically out of equilibrium. These and other properties could be revolutionary, provided they can first be controlled. This thesis conceptualizes and implements a framework for designing materials that are far from equilibrium. We show how, even in the absence of a complete physical theory, design from the top down is possible and lends itself to producing physical insight. As a prototype system, we work with granular materials: collections of athermal, macroscopic identical objects, since these materials function both as an essential component of industrial processes as well as a model system for many non-equilibrium states of matter. We show that by placing granular materials in the context of design, benefits emerge simultaneously for fundamental and applied interests. As first steps, we use our framework to design granular aggregates with extreme properties like high stiffness, and softness. We demonstrate control over nonlinear effects by producing exotic aggregates that stiffen under compression. Expanding on our framework, we conceptualize new ways of thinking about material design when automatic discovery is possible. We show how to build rules that link particle shapes to arbitrary granular packing

  16. Inverse design of dielectric materials by topology optimization

    DEFF Research Database (Denmark)

    Otomori, M.; Andkjær, Jacob Anders; Sigmund, Ole

    2012-01-01

    The capabilities and operation of electromagnetic devices can be dramatically enhanced if artificial materials that provide certain prescribed properties can be designed and fabricated. This paper presents a systematic methodology for the design of dielectric materials with prescribed electric...... permittivity. A gradient-based topology optimization method is used to find the distribution of dielectric material for the unit cell of a periodic microstructure composed of one or two dielectric materials. The optimization problem is formulated as a problem to minimize the square of the difference between...

  17. FOREWORD: Computational methodologies for designing materials Computational methodologies for designing materials

    Science.gov (United States)

    Rahman, Talat S.

    2009-02-01

    It would be fair to say that in the past few decades, theory and computer modeling have played a major role in elucidating the microscopic factors that dictate the properties of functional novel materials. Together with advances in experimental techniques, theoretical methods are becoming increasingly capable of predicting properties of materials at different length scales, thereby bringing in sight the long-sought goal of designing material properties according to need. Advances in computer technology and their availability at a reasonable cost around the world have made tit all the more urgent to disseminate what is now known about these modern computational techniques. In this special issue on computational methodologies for materials by design we have tried to solicit articles from authors whose works collectively represent the microcosm of developments in the area. This turned out to be a difficult task for a variety of reasons, not the least of which is space limitation in this special issue. Nevertheless, we gathered twenty articles that represent some of the important directions in which theory and modeling are proceeding in the general effort to capture the ability to produce materials by design. The majority of papers presented here focus on technique developments that are expected to uncover further the fundamental processes responsible for material properties, and for their growth modes and morphological evolutions. As for material properties, some of the articles here address the challenges that continue to emerge from attempts at accurate descriptions of magnetic properties, of electronically excited states, and of sparse matter, all of which demand new looks at density functional theory (DFT). I should hasten to add that much of the success in accurate computational modeling of materials emanates from the remarkable predictive power of DFT, without which we would not be able to place the subject on firm theoretical grounds. As we know and will also

  18. Solder bond requirement for large, built-up, high-performance conductors

    International Nuclear Information System (INIS)

    Willig, R.L.

    1981-01-01

    Some large built-up conductors fabricated for large superconducting magnets are designed to operate above the maximum recovery current. Because the stability of these conductors is sensitive to the quality of the solder bond joining the composite superconductor to the high-conductivity substrate, a minimum bond requirement is necessary. The present analysis finds that the superconductor is unstable and becomes abruptly resistive when there are temperature excursions into the current sharing region of a poorly bonded conductor. This abrupt transition, produces eddy current heating in the vicinity of the superconducting filaments and causes a sharp reduction in the minimum propagating zone (MPZ) energy. This sensitivity of the MPZ energy to the solder bond contact area is used to specify a minimum bond requirement. For the superconducting MHD magnet built for the Component Development Integration Facility (CDIF), the minimum bonded surface area is .68 cm/sup 2//cm which is 44% of the composite perimeter. 5 refs

  19. Control of microstructure in soldered, brazed, welded, plated, cast or vapor deposited manufactured components

    Science.gov (United States)

    Ripley, Edward B.; Hallman, Russell L.

    2015-11-10

    Disclosed are methods and systems for controlling of the microstructures of a soldered, brazed, welded, plated, cast, or vapor deposited manufactured component. The systems typically use relatively weak magnetic fields of either constant or varying flux to affect material properties within a manufactured component, typically without modifying the alloy, or changing the chemical composition of materials or altering the time, temperature, or transformation parameters of a manufacturing process. Such systems and processes may be used with components consisting of only materials that are conventionally characterized as be uninfluenced by magnetic forces.

  20. Manipulation and soldering of carbon nanotubes using atomic force microscope

    International Nuclear Information System (INIS)

    Kashiwase, Yuta; Ikeda, Takayuki; Oya, Takahide; Ogino, Toshio

    2008-01-01

    Manipulation of carbon nanotubes (CNTs) by an atomic force microscope (AFM) and soldering of CNTs using Fe oxide nanoparticles are described. We succeeded to separate a CNT bundle into two CNTs or CNT bundles, to move the separated CNT to a desirable position, and to bind it to another bundle. For the accurate manipulation, load of the AFM cantilever and frequency of the scan were carefully selected. We soldered two CNTs using an Fe oxide nanoparticle prepared from a ferritin molecule. The adhesion forces between the soldered CNTs were examined by an AFM and it was found that the CNTs were bound, though the binding force was not strong

  1. Evaluation of materials and design modifications for aircraft brakes

    Science.gov (United States)

    Ho, T. L.; Kennedy, F. E.; Peterson, M. B.

    1975-01-01

    A test program is described which was carried out to evaluate several proposed design modifications and several high-temperature friction materials for use in aircraft disk brakes. The evaluation program was carried out on a specially built test apparatus utilizing a disk brake and wheel half from a small het aircraft. The apparatus enabled control of brake pressure, velocity, and braking time. Tests were run under both constant and variable velocity conditions and covered a kinetic energy range similar to that encountered in aircraft brake service. The results of the design evaluation program showed that some improvement in brake performance can be realized by making design changes in the components of the brake containing friction material. The materials evaluation showed that two friction materials show potential for use in aircraft disk brakes. One of the materials is a nickel-based sintered composite, while the other is a molybdenum-based material. Both materials show much lower wear rates than conventional copper-based materials and are better able to withstand the high temperatures encountered during braking. Additional materials improvement is necessary since both materials show a significant negative slope of the friction-velocity curve at low velocities.

  2. Materials Process Design Branch. Work Unit Directive (WUD) 54

    National Research Council Canada - National Science Library

    LeClair, Steve

    2002-01-01

    The objectives of the Manufacturing Research WUD 54 are to 1) conduct in-house research to develop advanced materials process design/control technologies to enable more repeatable and affordable manufacturing capabilities and 2...

  3. Performance evaluation of seal coat materials and designs.

    Science.gov (United States)

    2011-01-01

    "This project presents an evaluation of seal coat materials and design method. The primary objectives of this research are 1) to evaluate seal coat performance : from various combinations of aggregates and emulsions in terms of aggregate loss; 2) to ...

  4. Candidate container materials for Yucca Mountain waste package designs

    International Nuclear Information System (INIS)

    McCright, R.D.; Halsey, W.G.; Gdowski, G.E.; Clarke, W.L.

    1991-09-01

    Materials considered as candidates for fabricating nuclear waste containers are reviewed in the context of the Conceptual Design phase of a potential repository located at Yucca Mountain. A selection criteria has been written for evaluation of candidate materials for the next phase -- Advanced Conceptual Design. The selection criteria is based on the conceptual design of a thin-walled container fabricated from a single metal or alloy; the criteria consider the performance requirements on the container and the service environment in which the containers will be emplaced. A long list of candidate materials is evaluated against the criteria, and a short list of materials is proposed for advanced characterization in the next design phase

  5. Using learning materials for design-based interventions

    DEFF Research Database (Denmark)

    Gissel, Stig Toke

    2015-01-01

    This article considers a methodological issue concerning the use of learning materials for interventions in design-based research. When the researcher uses existing or creates new didacticised learning materials for research purposes and tests their applicability in authentic contexts, many...... variables are in play. When using or designing a learning material a lot of choices have to be made and effects are difficult to isolate. The advantage of using learning materials for interventions is that results could have high ecological validity. In the article this methodological issue is exemplified...... through a research project using and developing digital learning materials for developing literacy in the early grades. One of many important choices to be made in elaborating this learning material concerns which texts should be used for supporting students’ literacy development in the lower grades...

  6. Designing with Matter: From Programmable Materials to Processual Things

    Directory of Open Access Journals (Sweden)

    Agustina Andreoletti

    2016-11-01

    Full Text Available This paper explores the potential of active matter, from a practical exploration of the concept to a theoretical discussion based on the material findings. It begins by addressing the ideas of materiality and material performance through the project “Chrysalis Gemini” and then provides an overview of the notion of programmability.To this end, we move to the description and analysis of programming, focusing on its relationship with hardware, software and material. In particular, we address the idea of programmable matter, and we introduce the term processuality. We consider the importance of adaptability, analysing the experience of humans, their interaction with the environment, with artefacts and with material within a design context.In this manner this study seeks to highlight how contextualisation and interconnected processes become relevant as a design argument. This is achieved by presenting the relational potential of processual material and things and their ongoing transformation. 

  7. Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint.

    Science.gov (United States)

    Lee, Sang-Yeob; Lee, Jong-Hyuk

    2010-12-01

    The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

  8. The socio-materiality of designing organizational change

    DEFF Research Database (Denmark)

    Stang Våland, Marianne; Georg, Susse

    2014-01-01

    Purpose – The purpose of this paper is to examine the managerial implications of adopting a design attitude to organizational change. Design/methodology/approach – Based on an ethnographic study of a merger, the paper investigates the intricate interplay between architectural design...... and organizational change in the context of physically relocating an organization to a new office building. Emphasis is given to the socio-materiality of this double design process. Findings – The data suggests that taking a design attitude toward managing organizational change can allow different actors...... to participate in organizational design processes, releasing management from its traditional role as the keeper of the design solution. Research limitations/implications – Although based on a single case, the paper provides insights into the socio-materiality of organizational change that is relevant in other...

  9. DESIGNING ENGLISH LEARNING MATERIALS TO FOSTER CHILDREN‟S CREATIVITY

    Directory of Open Access Journals (Sweden)

    C. Murni Wahyanti

    2017-04-01

    Full Text Available Learning materials form an important part of English teaching-learning processes in Elementary schools. In many cases, teachers and students rely on the learning materials available and the materials dictate teachers‘ strategies. Despite the availability of commercially produced materials, it is considered necessary for teachers to construct or adapt learning materials. Teachers know better about their students‘ ability, needs and interests. In addition, the materials can be more contextual. Good materials should foster children‘s creative thinking since creativity is one of the important skills children need to develop. Features of creativity involve using imagination, generating ideas and questions, experimenting with alternatives, being original and making judgment. This presentation will focus on how to develop learning materials that can foster children‘s creativity. It will discuss about why teachers need to design their own materials, principles for designing effective English learning materials, the concepts and components of creativity and the importance of creativity in language learning. Examples of how to apply features of creativity in the English learning materials for children will be provided.

  10. Implications of material selection on the design of packaging machinery.

    Science.gov (United States)

    Merritt, J P

    2009-01-01

    Material selection has significant implications on the design and cost of horizontal-form-fill-seal packaging machinery. To avoid excessive costs, machine redesigns and project delays, material selection must be reconciled early in the project and revisited throughout the construction of the machine.

  11. Revolutionising catenary design: the use of new materials

    NARCIS (Netherlands)

    Smulders, H.W.M.; Wouters, P.A.A.F.; Minkman, J.A.; Waes, van J.B.M.

    2011-01-01

    Traditionally materials used for catenary support structures are steel, concrete or even wood, in combination with the use of insulators. The development of new materials such as Fibre Reinforced Plastics (FRP) makes a new revolutionary design possible. The use of FRP is expanding rapidly at the

  12. Material and design considerations of FBGA reliability performance

    International Nuclear Information System (INIS)

    Lee, Teck Kheng; Ng, T.C.; Chai, Y.M.

    2004-01-01

    FBGA package reliability is usually assessed through the conventional approaches of die attach and mold compound material optimization. However, with the rapid changes and fast-moving pace of electronic packaging and the introduction of new soldermask and core materials, substrate design has also become a critical factor in determining overall package reliability. The purpose of this paper is to understand the impact design and soldermask material of a rigid substrate on overall package reliability. Three different soldermask patterns with a matrix of different die attach, mold compound, and soldermask materials are assessed using the moisture sensitivity test (MST). Package reliability is also assessed through the use of temperature cycling (T/C) at conditions 'B' and 'C'. For material optimization, three different mold compounds and die attach materials are used. Material adhesion between different die attach materials and soldermask materials are obtained through die shear performed at various temperatures and preset moisture conditions. A study correlating the different packaging material properties and their relative adhesion strengths with overall package reliability in terms of both MST and T/C performance was performed. Soldermask design under the die pads was found to affect package reliability. For example, locating vias at the edge of the die is not desirable because the vias acts as initiation point for delamination and moisture-induced failure. Through die shear testing, soldermask B demonstrated higher adhesion properties compared to soldermask A across several packaging materials and enhanced the overall package reliability in terms of both MST and T/C performance. Both MST JEDEC level 1 and the T/C of 'B' and 'C' at 1000 cycles have been achieved through design and package material optimization

  13. Material and design considerations of FBGA reliability performance

    Energy Technology Data Exchange (ETDEWEB)

    Lee, Teck Kheng; Ng, T.C.; Chai, Y.M

    2004-09-01

    FBGA package reliability is usually assessed through the conventional approaches of die attach and mold compound material optimization. However, with the rapid changes and fast-moving pace of electronic packaging and the introduction of new soldermask and core materials, substrate design has also become a critical factor in determining overall package reliability. The purpose of this paper is to understand the impact design and soldermask material of a rigid substrate on overall package reliability. Three different soldermask patterns with a matrix of different die attach, mold compound, and soldermask materials are assessed using the moisture sensitivity test (MST). Package reliability is also assessed through the use of temperature cycling (T/C) at conditions 'B' and 'C'. For material optimization, three different mold compounds and die attach materials are used. Material adhesion between different die attach materials and soldermask materials are obtained through die shear performed at various temperatures and preset moisture conditions. A study correlating the different packaging material properties and their relative adhesion strengths with overall package reliability in terms of both MST and T/C performance was performed. Soldermask design under the die pads was found to affect package reliability. For example, locating vias at the edge of the die is not desirable because the vias acts as initiation point for delamination and moisture-induced failure. Through die shear testing, soldermask B demonstrated higher adhesion properties compared to soldermask A across several packaging materials and enhanced the overall package reliability in terms of both MST and T/C performance. Both MST JEDEC level 1 and the T/C of 'B' and 'C' at 1000 cycles have been achieved through design and package material optimization.

  14. Advances in wind turbine blade design and materials

    DEFF Research Database (Denmark)

    Wind energy is gaining critical ground in the area of renewable energy, with wind energy being predicted to provide up to 8% of the world’s consumption of electricity by 2021. Advances in wind turbine blade design and materials reviews the design and functionality of wind turbine rotor blades...... as well as the requirements and challenges for composite materials used in both current and future designs of wind turbine blades. Part one outlines the challenges and developments in wind turbine blade design, including aerodynamic and aeroelastic design features, fatigue loads on wind turbine blades......, and characteristics of wind turbine blade airfoils. Part two discusses the fatigue behavior of composite wind turbine blades, including the micromechanical modelling and fatigue life prediction of wind turbine blade composite materials, and the effects of resin and reinforcement variations on the fatigue resistance...

  15. Critical plasma-materials issues for fusion reactor designs

    International Nuclear Information System (INIS)

    Wilson, K.L.; Bauer, W.

    1983-01-01

    Plasma-materials interactions are a dominant driving force in the design of fusion power reactors. This paper presents a summary of plasma-materials interactions research. Emphasis is placed on critical aspects related to reactor design. Particular issues to be addressed are plasma edge characterization, hydrogen recycle, impurity introduction, and coating development. Typical wall fluxes in operating magnetically confined devices are summarized. Recent calculations of tritium inventory and first wall permeation, based on laboratory measurements of hydrogen recycling, are given for various reactor operating scenarios. Impurity introduction/wall erosion mechanisms considered include sputtering, chemical erosion, and evaporation (melting). Finally, the advanced material development for in-vessel components is discussed. (author)

  16. Probabilistic Fatigue Design of Composite Material for Wind Turbine Blades

    DEFF Research Database (Denmark)

    Toft, Henrik Stensgaard; Sørensen, John Dalsgaard

    2011-01-01

    In the present paper a probabilistic design approach to fatigue design of wind turbine blades is presented. The physical uncertainty on the fatigue strength for composite material is estimated using public available fatigue tests. Further, the model uncertainty on Miner rule for damage accumulation...

  17. Materials data base as an interface between fusion reactor designs and materials development

    International Nuclear Information System (INIS)

    Ishino, S.; Iwata, S.

    1983-01-01

    The materials data base is an integrated information system of experimental and/or calculated data of materials being compiled to meet the broad needs for materials data by taking advantage of the data base management systems. In this paper the objective of such computerized data base is described from the viewpoint of materials engineers and fusion system designers. Materials data spread themselves widely from the field that relates fundamental understanding of the behaviors of electrons, atoms, vacancies, dislocations and so on to the performance of components, devices, machines and systems. In our approach this information is described as ''relations'' by a set of tables which comprise related variables, for example, a set of values about essential properties for materials selection. This approach based on the relational model enables relational operations, i.e. SELECTION, PROJECTION, JOIN and so on, to select suitable materials, to set trade-off parameters for system designers and to establish design criteria. Stored data comprise (i) fundamental properties for all elements and potential structural materials, (ii) low cycle fatigue, irradiation creep and swelling data for type 316 stainless steels. These data have been selected and evaluated from critical reviews of existing data base of about 2 mega bytes data, some examples of materials selections and extraction of trade-off parameters are shown as a subject of critical issue concerning how to bridge the large gap between materials developments and system designs. (author)

  18. Development of a soft-soldering system for aluminum

    Science.gov (United States)

    Falke, W. L.; Lee, A. Y.; Neumeier, L. A.

    1983-03-01

    The method employs application of a thin nickel copper alloy coating to the substrate, which enables the tin lead solders to wet readily and spread over the areas to be joined. The aluminum substrate is mechanically or chemically cleaned to facilitate bonding to a minute layer of zinc that is subsequently applied, with an electroless zincate solution. The nickel copper alloy (30 to 70 pct Ni) coating is then applied electrolytically over the zinc, using immersion cell or brush coating techniques. Development of acetate electrolytes has permitted deposition of the proper alloys coatings. The coated areas can then be readily joined with conventional tin lead solders and fluxs. The joints so formed are ductile, strong, and relatively corrosion resistant, and exhibit strengths equivalent to those formed on copper and brass when the same solders and fluxes are used. The method has also been employed to soft solder magnesium alloys.

  19. Development of gold based solder candidates for flip chip assembly

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

  20. Nano-Scale Positioning Design with Piezoelectric Materials

    Directory of Open Access Journals (Sweden)

    Yung Yue Chen

    2017-12-01

    Full Text Available Piezoelectric materials naturally possess high potential to deliver nano-scale positioning resolution; hence, they are adopted in a variety of engineering applications widely. Unfortunately, unacceptable positioning errors always appear because of the natural hysteresis effect of the piezoelectric materials. This natural property must be mitigated in practical applications. For solving this drawback, a nonlinear positioning design is proposed in this article. This nonlinear positioning design of piezoelectric materials is realized by the following four steps: 1. The famous Bouc–Wen model is utilized to present the input and output behaviors of piezoelectric materials; 2. System parameters of the Bouc–Wen model that describe the characteristics of piezoelectric materials are simultaneously identified with the particle swam optimization method; 3. Stability verification for the identified Bouc–Wen model; 4. A nonlinear feedback linearization control design is derived for the nano-scale positioning design of the piezoelectric material, mathematically. One important contribution of this investigation is that the positioning error between the output displacement of the controlled piezoelectric materials and the desired trajectory in nano-scale level can be proven to converge to zero asymptotically, under the effect of the hysteresis.

  1. A design methodology for materials control and accounting information systems

    International Nuclear Information System (INIS)

    Helman, P.; Strittmatter, R.B.

    1987-01-01

    Modern approaches to nuclear materials safeguards have significantly increased the data processing needs of safeguards information systems. Implementing these approaches will require developing efficient, cost-effective designs. Guided by database design research, we are developing a design methodology for distributed materials control and accounting (MCandA) information systems. The methodology considers four design parameters: network topology, allocation of data to nodes, high-level global processing strategy, and local file structures to optimize system performance. Characteristics of system performance that are optimized are response time for an operation, timeliness of data, validity of data, and reliability. The ultimate goal of the research is to develop a comprehensive computerized design tool specifically tailored to the design of MCandA systems

  2. Multi-material topology design of laminates with strength criteria

    DEFF Research Database (Denmark)

    Lund, Erik

    2012-01-01

    The objective of this paper is to present a novel approach for multi-material topology optimization of laminated composite structures where strength constraints are taken into account together with other global structural performance measures. The topology design problem considered contains very...... many design variables, and when strength criteria are included in the problem, a very large number of criteria functions must be considered in the optimization problem to be solved. Thus, block aggregation methods are introduced, such that global strength measures are obtained. These formulations...... are illustrated for multi-material laminated design problems where the maximum failure index is minimized while compliance and mass constraints are taken into account....

  3. Fiber-reinforced composites materials, manufacturing, and design

    CERN Document Server

    Mallick, P K

    2007-01-01

    The newly expanded and revised edition of Fiber-Reinforced Composites: Materials, Manufacturing, and Design presents the most up-to-date resource available on state-of-the-art composite materials. This book is unique in that it not only offers a current analysis of mechanics and properties, but also examines the latest advances in test methods, applications, manufacturing processes, and design aspects involving composites. This third edition presents thorough coverage of newly developed materials including nanocomposites. It also adds more emphasis on underlying theories, practical methods, and problem-solving skills employed in real-world applications of composite materials. Each chapter contains new examples drawn from diverse applications and additional problems to reinforce the practical relevance of key concepts. New in The Third Edition: Contains new sections on material substitution, cost analysis, nano- and natural fibers, fiber architecture, and carbon-carbon composites Provides a new chapter on poly...

  4. Strength of joints brazed with two-phase solders

    International Nuclear Information System (INIS)

    Shnyakin, N.S.; Parfenova, L.V.; Ekatova, A.S.; Prilepskaya, I.V.

    1976-01-01

    Dependence of the structure and strength of soldered joints upon a gap size in case of 1Kh18N10T stainless steel soldering with a double-phase solder of Ni-Zn-Cu system is described. Butt and lap joints have been subjected to soldering with gas-flame and induction heating. The optimum conditions of the solder crystallization are determined with wedge-gap samples. The studies show that the character of distribution of a fusible β-phase in metal depends upon a gap size. With gaps up to 0.1 mm the β-phase enriched with a fusible component (zinc) runs as a continuous thin interlayer in the middle of the seam. As a result of zinc evaporation from the β-phase this interlayer becomes internally oxidized. After the sample is broken an oxidized fracture gives one the impression of a poor fusion in the middle part of the joint. The ultimate strength of butt joints is 15-20 kgf/sq.mm. A value of thermal expansion of 1Kh18N10T steel samples, 1-5 mm thick, has been experimentally determined for butt soldering. The elongation of two halves of the sample is measured by an indicator and proved to be 0.89 mm for a 50x50x2 mm sample at a soldering temperature of 1.100 deg C. The paper presents methods for the calculation of an optimal gap value for butt soldering with a local gas-flame and induction heating

  5. Three-dimensional (3D) visualization of reflow porosity and modeling of deformation in Pb-free solder joints

    International Nuclear Information System (INIS)

    Dudek, M.A.; Hunter, L.; Kranz, S.; Williams, J.J.; Lau, S.H.; Chawla, N.

    2010-01-01

    The volume, size, and dispersion of porosity in solder joints are known to affect mechanical performance and reliability. Most of the techniques used to characterize the three-dimensional (3D) nature of these defects are destructive. With the enhancements in high resolution computed tomography (CT), the detection limits of intrinsic microstructures have been significantly improved. Furthermore, the 3D microstructure of the material can be used in finite element models to understand their effect on microscopic deformation. In this paper we describe a technique utilizing high resolution (< 1 μm) X-ray tomography for the three-dimensional (3D) visualization of pores in Sn-3.9Ag-0.7Cu/Cu joints. The characteristics of reflow porosity, including volume fraction and distribution, were investigated for two reflow profiles. The size and distribution of porosity size were visualized in 3D for four different solder joints. In addition, the 3D virtual microstructure was incorporated into a finite element model to quantify the effect of voids on the lap shear behavior of a solder joint. The presence, size, and location of voids significantly increased the severity of strain localization at the solder/copper interface.

  6. Characteristics of solder joints under fatigue loads using piezomechanical actuation

    Science.gov (United States)

    Shim, Dong-Jin; Spearing, S. Mark

    2003-07-01

    Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezo-ceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

  7. Tensile strength of two soldered alloys (Minalux and Verabond2

    Directory of Open Access Journals (Sweden)

    Mir Mohammad Rezaee S

    2002-07-01

    Full Text Available Recently. Minalux alloy, a base metal free from Be, has been presented on the market while no special soldering has been recommended for it. On the other hand, based on the manufacturer's claim, this alloy is similar to Verabond2. The aim of this study was to investigate the tensile strength of Minalux and Verabond2, soldered by Verasolder. Twelve standard dambble shape samples, with the length of 18 mm and the diameter of 3mm, were prepared from each alloy. Six samples of each alloy were divided into two pieces with carboradom disk. Soldering gap distance was 0.3mm, measured by a special jig and they were soldered by Verasolder alloy. Six other samples, of both Iranian and foreign unsoldered alloys were considered as control group. Then samples were examined under tensile force and their tensile strength was recorded. Two- way variance analysis showed that the tensile strength of Minalux alloy and Verabond2 were not statistically significant (Verasoler 686, Minalux 723, but after soldering, such difference became significant (Minalux 308, Verabond2 432. Verabond2 showed higher tensile strength after soldering.

  8. Features of Pd-Ni-Fe solder system for vacuum brazing of low alloy steels

    International Nuclear Information System (INIS)

    Radzievskij, V.N.; Kurochko, R.S.; Lotsmanov, S.N.; Rymar', V.I.

    1975-01-01

    The brazing solder of the Pd-Ni-Fe alloyed with copper and lithium, in order to decrease the melting point and provide for a better spreading, when soldered in vacuum ensures a uniform strength of soldered joints with the base metal of low-alloyed steels of 34KHNIM-type. The properties of low-alloyed steel joints brazed with the Pd-Ni-Fe-system solder little depend on the changes in the soldering parameters. The soldered joint keeps a homogeneous structure after all the stages of heat treatment (annealing, quenching and tempering)

  9. Materials for construction and civil engineering science, processing, and design

    CERN Document Server

    Margarido, Fernanda

    2015-01-01

    This expansive volume presents the essential topics related to construction materials composition and their practical application in structures and civil installations. The book's diverse slate of expert authors assemble invaluable case examples and performance data on the most important groups of materials used in construction, highlighting aspects such as nomenclature, the properties, the manufacturing processes, the selection criteria, the products/applications, the life cycle and recyclability, and the normalization. Civil Engineering Materials: Science, Processing, and Design is ideal for practicing architects; civil, construction, and structural engineers, and serves as a comprehensive reference for students of these disciplines. This book also: ·       Provides a substantial and detailed overview of traditional materials used in structures and civil infrastructure ·       Discusses properties of natural and synthetic materials in construction and materials' manufacturing processes ·  �...

  10. Perspective: Role of structure prediction in materials discovery and design

    Directory of Open Access Journals (Sweden)

    Richard J. Needs

    2016-05-01

    Full Text Available Materials informatics owes much to bioinformatics and the Materials Genome Initiative has been inspired by the Human Genome Project. But there is more to bioinformatics than genomes, and the same is true for materials informatics. Here we describe the rapidly expanding role of searching for structures of materials using first-principles electronic-structure methods. Structure searching has played an important part in unraveling structures of dense hydrogen and in identifying the record-high-temperature superconducting component in hydrogen sulfide at high pressures. We suggest that first-principles structure searching has already demonstrated its ability to determine structures of a wide range of materials and that it will play a central and increasing part in materials discovery and design.

  11. FY 1998 report on the waste processing/recycling related technology, 'The R and D of lead-free solder standardization'; 1998 nendo haikibutsu shori recycle kanren gijutsu seika hokokusho. Namari free handa kikakuka nado kenkyu kaihatsu

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2000-03-01

    To reduce the environmental pollution caused by lead eluted from the electronic equipment waste, the R and D on lead-free solder were conducted and the results were summarized. As to the basic characteristics, the evaluation test method was studied in terms of the range of melting temperature, mechanical strength, wettability and joint strength, to select a uniform test method. As the lead-free solder, Sn-Ag alloys were mainly used and mixed in a combination of Cu, Bi and In. Changes in characteristics were made clear by adding trace elements such as Ge, Mn and P. Relating to the applied characteristics, in selection of solder materials, materials were selected for which evaluation of the commercialization is proceeded with from a viewpoint of promotion of commercialization. Concerning the experimental evaluation of characteristics of lead-free solder in mounted substrates, it was indicated that basically lead-free solder can be practically used. Further, it was indicated that the Sn-Ag-Cu-Bi system depends not on solder composition but on active force, printing accuracy and flux characteristic of solder paste, that improvement of solder paste has an effect on mounting characteristics. (NEDO)

  12. Lightweight structure design for wind energy by integrating nanostructured materials

    International Nuclear Information System (INIS)

    Li, Ying; Lu, Jian

    2014-01-01

    Highlights: • Integrate high-strength nano-materials into lightweight design. • Lightweight design scheme for wind turbine tower application. • Expand the bending formulae for tapered tubular structures with varying thickness. • We rewrite the Secant Formula for a tapered beam under eccentric compression. - Abstract: Wind power develops very fast nowadays with high expectation. Although at the mean time, the use of taller towers, however, smacks head-on into the issue of transportability. The engineering base and computational tools have to be developed to match machine size and volume. Consequently the research on the light weight structures of tower is carrying out in the main countries which are actively developing wind energy. This paper reports a new design scheme of light weight structure for wind turbine tower. This design scheme is based on the integration of the nanostructured materials produced by the Surface Mechanical Attrition Treatment (SMAT) process. The objective of this study is to accomplish the weight reduction by optimizing the wall thickness of the tapered tubular structure. The basic methods include the identification of the critical zones and the distribution of the high strength materials according to different necessities. The equivalent strength or stiffness design method and the high strength material properties after SMAT process are combined together. Bending and buckling are two main kinds of static loads concerned in consideration. The study results reveal that there is still enough margin for weight reduction in the traditional wind turbine tower design

  13. High-throughput theoretical design of lithium battery materials

    International Nuclear Information System (INIS)

    Ling Shi-Gang; Gao Jian; Xiao Rui-Juan; Chen Li-Quan

    2016-01-01

    The rapid evolution of high-throughput theoretical design schemes to discover new lithium battery materials is reviewed, including high-capacity cathodes, low-strain cathodes, anodes, solid state electrolytes, and electrolyte additives. With the development of efficient theoretical methods and inexpensive computers, high-throughput theoretical calculations have played an increasingly important role in the discovery of new materials. With the help of automatic simulation flow, many types of materials can be screened, optimized and designed from a structural database according to specific search criteria. In advanced cell technology, new materials for next generation lithium batteries are of great significance to achieve performance, and some representative criteria are: higher energy density, better safety, and faster charge/discharge speed. (topical review)

  14. Materials challenges supporting new sodium fast reactor designs

    International Nuclear Information System (INIS)

    Gelineau, O.; Goff, S. Dubiez-le; Dubuisson, Ph.; Dalle, F.; Blat, M.

    2009-01-01

    Sodium Fast Reactor is considered in France as the most mature technology of the different Generation IV systems. In the short-term the designing work is focused on the identification of the potential tracks to improve competitiveness, safety, efficiency and to reduce cost. In that frame the materials have a key role to play. This paper is focused on the new materials envisaged and on the Research and Development program launched in France by Areva NP, CEA and EDF in order to sustain the innovative design options: ferritic steels as candidates for exchangers, steam generators and possibly sodium circuits, optimization of materials and fabrication processes to improve safety and risk management, extension of material databases to take into account the 60 years life duration including irradiation and ageing effect. (author)

  15. Soft computing in design and manufacturing of advanced materials

    Science.gov (United States)

    Cios, Krzysztof J.; Baaklini, George Y; Vary, Alex

    1993-01-01

    The potential of fuzzy sets and neural networks, often referred to as soft computing, for aiding in all aspects of manufacturing of advanced materials like ceramics is addressed. In design and manufacturing of advanced materials, it is desirable to find which of the many processing variables contribute most to the desired properties of the material. There is also interest in real time quality control of parameters that govern material properties during processing stages. The concepts of fuzzy sets and neural networks are briefly introduced and it is shown how they can be used in the design and manufacturing processes. These two computational methods are alternatives to other methods such as the Taguchi method. The two methods are demonstrated by using data collected at NASA Lewis Research Center. Future research directions are also discussed.

  16. Exploring Socio-material Orderings in Ethnography of Architectural Design

    DEFF Research Database (Denmark)

    Lotz, Katrine; Stang Våland, Marianne

    How can the socio-material assemblages involved in contemporary ‘doings of architecture’ be identified and studied? The paper discusses recent transformations within architectural design practice and the extended network of local actors and technologies mobilized in contemporary building...... construction. Interested in examining how the current requirements in the field are – and can be - handled in architectural production, we aim to contribute to the ongoing development of ethnography of Architectural Design (Yaneva 2008, 2009, 2012). In our research, we focus on recent requirements...... in contemporary architectural design. We attempt to follow the actors in detail through their socio-material involvements and ‘architectural inventions’ such as visualized motives of space, materials, atmospheres, buildingparts and -components, and to explore how relations continuously tie and untie as a means...

  17. Design of an intelligent materials data base for the IFR

    International Nuclear Information System (INIS)

    Mikaili, R.; Lambert, J.D.B.; Orth, T.D.

    1992-01-01

    In the development of the integral fast reactor (IFR) concept, there is a consensus that materials considerations are an important part of the reactor design, operation, and maintenance and that materials performance is central to liquid-metal reactor reliability and safety. In the design of the IRF materials data base, artificial intelligence techniques are being used to ensure efficient control of information. Intelligent control will provide for the selection of menus to be displayed, efficient data-base searches, and application-dependent guidance through the data base. The development of the IRF data base has progressed to the point of (a) completing the design of the data-base architecture and tables, (b) installing computer hardware for storing large amounts of data, (c) outlining strategies for data transferal, and (d) identifying ways to validate and secure the integrity of data

  18. Conceptual Design Report for the Irradiated Materials Characterization Laboratory (IMCL)

    Energy Technology Data Exchange (ETDEWEB)

    Stephanie Austad

    2010-06-01

    This document describes the design at a conceptual level for the Irradiated Materials Characterization Laboratory (IMCL) to be located at the Materials and Fuels Complex (MFC) at the Idaho National Laboratory (INL). The IMCL is an 11,000-ft2, Hazard Category-2 nuclear facility that is designed for use as a state of the-art nuclear facility for the purpose of hands-on and remote handling, characterization, and examination of irradiated and nonirradiated nuclear material samples. The IMCL will accommodate a series of future, modular, and reconfigurable instrument enclosures or caves. To provide a bounding design basis envelope for the facility-provided space and infrastructure, an instrument enclosure or cave configuration was developed and is described in some detail. However, the future instrument enclosures may be modular, integral with the instrument, or reconfigurable to enable various characterization environments to be configured as changes in demand occur. They are not provided as part of the facility.

  19. Engaging design materials, formats and Framings in specific, situated co-designing

    DEFF Research Database (Denmark)

    Agger Eriksen, Mette

    Engaging co-designers in specific situations of co- designing often also means engaging tangible working materials. However, it can be challenging, so rather than seeing it as applying design methods, the paper propose applying what I call a micro-material perspective. The practical concept captu......-design situations" clustered in three quite well- known types of co-design situations framed for; Exploring Current Use(r) Practices, Mapping Networks and Co-Designing (Possible) Futures.......Engaging co-designers in specific situations of co- designing often also means engaging tangible working materials. However, it can be challenging, so rather than seeing it as applying design methods, the paper propose applying what I call a micro-material perspective. The practical concept...... captures both paying attention to the physical design materials, the formats of their exploration and the framings of focus when understanding and planning such specific co-design situations. To exemplify applying the perspective, the paper describes and discusses six specific examples of "co...

  20. Design and construction of the Fuels and Materials Examination Facility

    International Nuclear Information System (INIS)

    Burgess, C.A.

    1979-01-01

    Final design is more than 85 percent complete on the Fuels and Materials Examination Facility, the facility for post-irradiation examination of the fuels and materials tests irradiated in the FFTF and for fuel process development, experimental test pin fabrication and supporting storage, assay, and analytical chemistry functions. The overall facility is generally described with specific information given on some of the design features. Construction has been initiated and more than 10% of the construction contracts have been awarded on a fixed price basis

  1. Accelerating the design of biomimetic materials by integrating RNA-seq with proteomics and materials science.

    Science.gov (United States)

    Guerette, Paul A; Hoon, Shawn; Seow, Yiqi; Raida, Manfred; Masic, Admir; Wong, Fong T; Ho, Vincent H B; Kong, Kiat Whye; Demirel, Melik C; Pena-Francesch, Abdon; Amini, Shahrouz; Tay, Gavin Z; Ding, Dawei; Miserez, Ali

    2013-10-01

    Efforts to engineer new materials inspired by biological structures are hampered by the lack of genomic data from many model organisms studied in biomimetic research. Here we show that biomimetic engineering can be accelerated by integrating high-throughput RNA-seq with proteomics and advanced materials characterization. This approach can be applied to a broad range of systems, as we illustrate by investigating diverse high-performance biological materials involved in embryo protection, adhesion and predation. In one example, we rapidly engineer recombinant squid sucker ring teeth proteins into a range of structural and functional materials, including nanopatterned surfaces and photo-cross-linked films that exceed the mechanical properties of most natural and synthetic polymers. Integrating RNA-seq with proteomics and materials science facilitates the molecular characterization of natural materials and the effective translation of their molecular designs into a wide range of bio-inspired materials.

  2. LUTE primary mirror materials and design study report

    Science.gov (United States)

    Ruthven, Greg

    1993-02-01

    The major objective of the Lunar Ultraviolet Telescope Experiment (LUTE) Primary Mirror Materials and Design Study is to investigate the feasibility of the LUTE telescope primary mirror. A systematic approach to accomplish this key goal was taken by first understanding the optical, thermal, and structural requirements and then deriving the critical primary mirror-level requirements for ground testing, launch, and lunar operations. After summarizing the results in those requirements which drove the selection of material and the design for the primary mirror are discussed. Most important of these are the optical design which was assumed to be the MSFC baseline (i.e. 3 mirror optical system), telescope wavefront error (WFE) allocations, the telescope weight budget, and the LUTE operational temperature ranges. Mechanical load levels, reflectance and microroughness issues, and options for the LUTE metering structure were discussed and an outline for the LUTE telescope sub-system design specification was initiated. The primary mirror analysis and results are presented. The six material substrate candidates are discussed and four distinct mirror geometries which are considered are shown. With these materials and configurations together with varying the location of the mirror support points, a total of 42 possible primary mirror designs resulted. The polishability of each substrate candidate was investigated and a usage history of 0.5 meter and larger precision cryogenic mirrors (the operational low end LUTE temperature of 60 K is the reason we feel a survey of cryogenic mirrors is appropriate) that were flown or tested are presented.

  3. Design guides for radioactive-material-handling facilities and equipment

    International Nuclear Information System (INIS)

    Doman, D.R.; Barker, R.E.

    1980-01-01

    Fourteen key areas relating to facilities and equipment for handling radioactive materials involved in examination, reprocessing, fusion fuel handling and remote maintenance have been defined and writing groups established to prepare design guides for each areas. The guides will give guidance applicable to design, construction, operation, maintenance and safety, together with examples and checklists. Each guide will be reviewed by an independent review group. The guides are expected to be compiled and published as a single document

  4. Construction of irradiated material examination facility-basic design

    International Nuclear Information System (INIS)

    Ro, Seung Gy; Kim, Eun Ka; Hong, Gye Won; Herr, Young Hoi; Hong, Kwon Pyo; Lee, Myeong Han; Baik, Sang Youl; Choo, Yong Sun; Baik, Seung Je

    1989-02-01

    The basic design of the hot cell facility which has the main purpose of doing mechanical and physical property tests of irradiated materials, the examination process, and the annexed facility has been made. Also basic and detall designs for the underground excavation work have been performed. The project management and tasks required for the license application have been carried out in due course. The facility is expected to be completed by the end of 1992, if the budgetary support is sufficient. (Author)

  5. Mechanical properties of Bi-In-Zn/ Cu solder joint system

    International Nuclear Information System (INIS)

    Ervina Efzan Mohd Noor; Mohammed Noori Ridha; Ahmad Badri Ismail; Nurulakmal Mohd Sharif; Kuan Yew Cheong; Tadashi Ariga; Zuhailawati Hussain

    2009-01-01

    Full text: In recent years, the pollution of environment from lead (Pb) and Pb-containing compounds in microelectronic devices attracts more and more attentions in academia and industry; the lead-free solder alloys begin to replace the lead-based solders in packaging process of some devices and components. In this works, microstructure and mechanical properties of different reflow temperature (80, 100, 120 and 140 degree Celsius) for solder joints on shear strength of Bi-In-Zn lead free solder with low melting temperature of 60 degree Celsius on Cu solder joint has been investigated. This paper will compared the mechanical properties of the Bi-In-Zn lead-free solder alloys with current lead-free solder, Sn-Ag-Cu solder alloy. The fracture surface analyses have been observed by Optical Microscope and were investigated by Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX) and proved it by X-ray diffraction (XRD). (author)

  6. Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

    Directory of Open Access Journals (Sweden)

    Molnar A.

    2017-06-01

    Full Text Available In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints’ lifetime.

  7. Design and selection of materials for sodium cooled fast reactors

    International Nuclear Information System (INIS)

    Chetal, S.C.

    2011-01-01

    Sodium cooled fast reactors are currently in operation, under construction or under design by a number of countries. The design of sodium cooled fast reactor is covered by French RCC - MR code and ASME code NH. The codes cover rules as regards to materials, design and construction. These codes do not cover the effect of irradiation and environment. Elevated temperature design criteria in nuclear codes are much stringent in comparison to non nuclear codes. Sodium corrosion is not an issue in selection of materials provided oxygen impurity in sodium is controlled for which excellent reactor operating experience is available. Austenitic stainless steels have remained the choice for the permanent structures of primary sodium system. Stabilized austenitic stainless steel are rejected because of poor operating experience and non inclusion in the design codes. Route for improved creep behaviour lies in compositional modifications in 316 class steel. However, the weldability needs to be ensured. For cold leg component is non creep regime, SS 304 class steel is favoured from overall economics. Enhanced fuel burn up can be realized by the use of 9-12%Cr 1%Mo class steel for the wrapper of MOX fuel design, and cladding and wrapper for metal fuel reactors. Minor compositional modifications of 20% cold worked 15Cr-15Ni class austenitic stainless steel will be a strong candidate for the cladding of MOX fuel design in the short term. Long term objective for the cladding will be to develop oxide dispersion strengthened steel. 9%Cr 1%Mo class steel (Gr 91) is an ideal choice for integrated once through sodium heated steam generators. One needs to incorporate operating experience from reactors and thermal power stations, industrial capability and R and D feedback in preparing the technical specifications for procurement of wrought products and welding consumables to ensure reliable operation of the components and systems over the design life. The paper highlights the design approach

  8. European DEMO design strategy and consequences for materials

    Science.gov (United States)

    Federici, G.; Biel, W.; Gilbert, M. R.; Kemp, R.; Taylor, N.; Wenninger, R.

    2017-09-01

    Demonstrating the production of net electricity and operating with a closed fuel-cycle remain unarguably the crucial steps towards the exploitation of fusion power. These are the aims of a demonstration fusion reactor (DEMO) proposed to be built after ITER. This paper briefly describes the DEMO design options that are being considered in Europe for the current conceptual design studies as part of the Roadmap to Fusion Electricity Horizon 2020. These are not intended to represent fixed and exclusive design choices but rather ‘proxies’ of possible plant design options to be used to identify generic design/material issues that need to be resolved in future fusion reactor systems. The materials nuclear design requirements and the effects of radiation damage are briefly analysed with emphasis on a pulsed ‘low extrapolation’ system, which is being used for the initial design integration studies, based as far as possible on mature technologies and reliable regimes of operation (to be extrapolated from the ITER experience), and on the use of materials suitable for the expected level of neutron fluence. The main technical issues arising from the plasma and nuclear loads and the effects of radiation damage particularly on the structural and heat sink materials of the vessel and in-vessel components are critically discussed. The need to establish realistic target performance and a development schedule for near-term electricity production tends to favour more conservative technology choices. The readiness of the technical (physics and technology) assumptions that are being made is expected to be an important factor for the selection of the technical features of the device.

  9. Physical and Model Uncertainty for Fatigue Design of Composite Material

    DEFF Research Database (Denmark)

    Toft, Henrik Stensgaard; Sørensen, John Dalsgaard

    The main aim of the present report is to establish stochastic models for the uncertainties related to fatigue design of composite materials. The uncertainties considered are the physical uncertainty related to the static and fatigue strength and the model uncertainty related to Miners rule...

  10. Road Materials and Pavement Design volume 17(2)

    CSIR Research Space (South Africa)

    De Beer, Morris

    2016-03-01

    Full Text Available Materials and Pavement Design Volume 17, 2016 - Issue 2 Editorial Board Page ebi | Published online: 03 Oct 2016  http://dx.doi.org/10.1080/14680629.2016.1244475 Editors-in-Chief Hervé DI BENEDETTO - University of Lyon/ENTPE, Vaulx-en-Velin, France...

  11. Designing ICT Training Material for Chinese Language Arts Teachers.

    Science.gov (United States)

    Lin, Janet Mei-Chuen; Wu, Cheng-Chih; Chen, Hsiu-Yen

    The purpose of this research is to tailor the design of information and communications technology (ICT) training material to the needs of Chinese language arts teachers such that the training they receive will be conducive to effective integration of ICT into instruction. Eighteen experienced teachers participated in a Delphi-like survey that…

  12. Data-driven design optimization for composite material characterization

    Science.gov (United States)

    John G. Michopoulos; John C. Hermanson; Athanasios Iliopoulos; Samuel G. Lambrakos; Tomonari Furukawa

    2011-06-01

    The main goal of the present paper is to demonstrate the value of design optimization beyond its use for structural shape determination in the realm of the constitutive characterization of anisotropic material systems such as polymer matrix composites with or without damage. The approaches discussed are based on the availability of massive experimental data...

  13. Materializing a responsive interior: designing minimum energy structures

    DEFF Research Database (Denmark)

    Mossé, Aurélie; Kofod, Guggi; Ramsgaard Thomsen, Mette

    2011-01-01

    This paper discusses a series of design-led experiments investigating future possibilities for architectural materialization relying on minimum energy structures as an example of adaptive structure. The structures have been made as laminates of elastic membrane under high tension with flexible...... (Lendlein, Kelch 2002) or light (van Oosten, Bastiaansen et al. 2009). All in all, this approach could form a whole new design paradigm, in which efficient 2D-manufacturing can lead to highly flexible, low weight and adaptable 3D-structures. This is illustrated by the design and manufacture of electro...

  14. Efficient Parameter Searches for Colloidal Materials Design with Digital Alchemy

    Science.gov (United States)

    Dodd, Paul, M.; Geng, Yina; van Anders, Greg; Glotzer, Sharon C.

    Optimal colloidal materials design is challenging, even for high-throughput or genomic approaches, because the design space provided by modern colloid synthesis techniques can easily have dozens of dimensions. In this talk we present the methodology of an inverse approach we term ''digital alchemy'' to perform rapid searches of design-paramenter spaces with up to 188 dimensions that yield thermodynamically optimal colloid parameters for target crystal structures with up to 20 particles in a unit cell. The method relies only on fundamental principles of statistical mechanics and Metropolis Monte Carlo techniques, and yields particle attribute tolerances via analogues of familiar stress-strain relationships.

  15. Chemical wiring and soldering toward all-molecule electronic circuitry.

    Science.gov (United States)

    Okawa, Yuji; Mandal, Swapan K; Hu, Chunping; Tateyama, Yoshitaka; Goedecker, Stefan; Tsukamoto, Shigeru; Hasegawa, Tsuyoshi; Gimzewski, James K; Aono, Masakazu

    2011-06-01

    Key to single-molecule electronics is connecting functional molecules to each other using conductive nanowires. This involves two issues: how to create conductive nanowires at designated positions, and how to ensure chemical bonding between the nanowires and functional molecules. Here, we present a novel method that solves both issues. Relevant functional molecules are placed on a self-assembled monolayer of diacetylene compound. A probe tip of a scanning tunneling microscope is then positioned on the molecular row of the diacetylene compound to which the functional molecule is adsorbed, and a conductive polydiacetylene nanowire is fabricated by initiating chain polymerization by stimulation with the tip. Since the front edge of chain polymerization necessarily has a reactive chemical species, the created polymer nanowire forms chemical bonding with an encountered molecular element. We name this spontaneous reaction "chemical soldering". First-principles theoretical calculations are used to investigate the structures and electronic properties of the connection. We demonstrate that two conductive polymer nanowires are connected to a single phthalocyanine molecule. A resonant tunneling diode formed by this method is discussed. © 2011 American Chemical Society

  16. Designing high-Performance layered thermoelectric materials through orbital engineering

    DEFF Research Database (Denmark)

    Zhang, Jiawei; Song, Lirong; Madsen, Georg K. H.

    2016-01-01

    Thermoelectric technology, which possesses potential application in recycling industrial waste heat as energy, calls for novel high-performance materials. The systematic exploration of novel thermoelectric materials with excellent electronic transport properties is severely hindered by limited...... insight into the underlying bonding orbitals of atomic structures. Here we propose a simple yet successful strategy to discover and design high-performance layered thermoelectric materials through minimizing the crystal field splitting energy of orbitals to realize high orbital degeneracy. The approach...... naturally leads to design maps for optimizing the thermoelectric power factor through forming solid solutions and biaxial strain. Using this approach, we predict a series of potential thermoelectric candidates from layered CaAl2Si2-type Zintl compounds. Several of them contain nontoxic, low-cost and earth...

  17. IBARAKI Materials Design Diffractometer for J-PARC

    International Nuclear Information System (INIS)

    Ishigaki, Toru; Harjo, Stefanus; Yonemura, Masao; Kamiyama, Takashi; Aizawa, Kazuya; Oikawa, Kenichi; Sakuma, Takashi; Morii, Yukio; Arai, Masatoshi; Ebata, Kazuhiro; Takano, Yoshiki; Kasao, Takuro

    2006-01-01

    Ibaraki prefecture, the local government of the area for J-PARC site, has decided to build a versatile powder diffractometer (IBARAKI Materials Design Diffractometer) to promote industrial applications for neutron beams in J-PARC. This diffractometer is designed to be a high throughput one enabling materials scientists to use it like the chemical analytical instruments in their material development processes. It covers in d range 0.18< d(A)<5 with Δd/d=0.16% at the high-resolution scattering detector bank, and covers 5< d(A)<800 with gradually changing resolution. Typical measuring time to obtain a 'Rietveld-quality' data is several minutes for the sample size of laboratory X-ray diffractometer. To promote industrial application, a utilization system for this diffractometer is required. We will establish a support system for both academic and industrial users who are willing to use neutron but have not been familiar with neutron diffraction

  18. The design and modeling of periodic materials with novel properties

    Science.gov (United States)

    Berger, Jonathan Bernard

    Cellular materials are ubiquitous in our world being found in natural and engineered systems as structural materials, sound and energy absorbers, heat insulators and more. Stochastic foams made of polymers, metals and even ceramics find wide use due to their novel properties when compared to monolithic materials. Properties of these so called hybrid materials, those that combine materials or materials and space, are derived from the localization of thermomechanical stresses and strains on the mesoscale as a function of cell topology. The effects of localization can only be generalized in stochastic materials arising from their inherent potential complexity, possessing variations in local chemistry, microstructural inhomogeneity and topological variations. Ordered cellular materials on the other hand, such as lattices and honeycombs, make for much easier study, often requiring analysis of only a single unit-cell. Theoretical bounds predict that hybrid materials have the potential to push design envelopes offering lighter stiffer and stronger materials. Hybrid materials can achieve very low and even negative coefficients of thermal expansion (CTE) while retaining a relatively high stiffness -- properties completely unmatched by monolithic materials. In the first chapter of this thesis a two-dimensional lattice is detailed that possess near maximum stiffness, relative to the tightest theoretical bound, and low, zero and even appreciably negative thermal expansion. Its CTE and stiffness are given in closed form as a function of geometric parameters and the material properties. This result is confirmed with finite elements (FE) and experiment. In the second chapter the compressive stiffness of three-dimensional ordered foams, both closed and open cell, are predicted with FE and the results placed in property space in terms of stiffness and density. A novel structure is identified that effectively achieves theoretical bounds for Young's, shear and bulk modulus

  19. Advanced materials for aqueous supercapacitors in the asymmetric design

    Directory of Open Access Journals (Sweden)

    Muniyandi Rajkumar

    2015-12-01

    Full Text Available Supercapacitors have been recognized as one of the promising energy storage devices in the future energy technology. In this perspective, rapid progress is made in the development of fundamental and applied aspects of supercapacitors. Various techniques have been developed specifically to estimate the specific capacitance. Numerous efforts have been made in the literature to increase the specific capacitance of electrode materials. Recently, researchers pay more attention on designing supercapacitors of asymmetric type with extending cell voltage and dissimilar materials with complementary working potentials. Researchers try to increase the specific energy of asymmetric supercapacitors (ASCs. Conversely, it is still a challenge to find a suitable operation conditions for ASCs in various designs, especially for the one with battery type electrode. In this review, we describe our recent research works and other reports on the preparation of various nanostructured electrode materials and the performances of both symmetric and asymmetric supercapacitors. Finally, we demonstrate effects of charge balance on the capacitive performances of ASCs which consist of one electrode material of the battery type and one capacitive material. We also demonstrate how to evaluate the charge capacities of both positive and negative electrode materials for this ASC application.

  20. Entombment Using Cementitious Materials: Design Considerations and International Experience

    Energy Technology Data Exchange (ETDEWEB)

    Seitz, Roger Ray

    2002-08-01

    Cementitious materials have physical and chemical properties that are well suited for the requirements of radioactive waste management. Namely, the materials have low permeability and durability that is consistent with the time frame required for short-lived radionuclides to decay. Furthermore, cementitious materials can provide a long-term chemical environment that substantially reduces the mobility of some long-lived radionuclides of concern for decommissioning (e.g., C-14, Ni-63, Ni-59). Because of these properties, cementitious materials are common in low-level radioactive waste disposal facilities throughout the world and are an attractive option for entombment of nuclear facilities. This paper describes design considerations for cementitious barriers in the context of performance over time frames of a few hundreds of years (directed toward short-lived radionuclides) and time frames of thousands of years (directed towards longer-lived radionuclides). The emphasis is on providing an overview of concepts for entombment that take advantage of the properties of cementitious materials and experience from the design of low-level radioactive waste disposal facilities. A few examples of the previous use of cementitious materials for entombment of decommissioned nuclear facilities and proposals for the use in future decommissioning of nuclear reactors in a few countries are also included to provide global perspective.

  1. Entombment Using Cementitious Materials: Design Considerations and International Experience

    Energy Technology Data Exchange (ETDEWEB)

    Seitz, R.R.

    2002-05-15

    Cementitious materials have physical and chemical properties that are well suited for the requirements of radioactive waste management. Namely, the materials have low permeability and durability that is consistent with the time frame required for short-lived radionuclides to decay. Furthermore, cementitious materials can provide a long-term chemical environment that substantially reduces the mobility of some long-lived radionuclides of concern for decommissioning (e.g., C-14, Ni-63, Ni-59). Because of these properties, cementitious materials are common in low-level radioactive waste disposal facilities throughout the world and are an attractive option for entombment of nuclear facilities. This paper describes design considerations for cementitious barriers in the context of performance over time frames of a few hundreds of years (directed toward short-lived radionuclides) and time frames of thousands of years (directed towards longer-lived radionuclides). The emphasis is on providing a n overview of concepts for entombment that take advantage of the properties of cementitious materials and experience from the design of low-level radioactive waste disposal facilities. A few examples of the previous use of cementitious materials for entombment of decommissioned nuclear facilities and proposals for the use in future decommissioning of nuclear reactors in a few countries are also included to provide global perspective.

  2. Entombment Using Cementitious Materials: Design Considerations and International Experience

    International Nuclear Information System (INIS)

    Seitz, R.R.

    2002-01-01

    Cementitious materials have physical and chemical properties that are well suited for the requirements of radioactive waste management. Namely, the materials have low permeability and durability that is consistent with the time frame required for short-lived radionuclides to decay. Furthermore, cementitious materials can provide a long-term chemical environment that substantially reduces the mobility of some long-lived radionuclides of concern for decommissioning (e.g., C-14, Ni-63, Ni-59). Because of these properties, cementitious materials are common in low-level radioactive waste disposal facilities throughout the world and are an attractive option for entombment of nuclear facilities. This paper describes design considerations for cementitious barriers in the context of performance over time frames of a few hundreds of years (directed toward short-lived radionuclides) and time frames of thousands of years (directed towards longer-lived radionuclides). The emphasis is on providing a n overview of concepts for entombment that take advantage of the properties of cementitious materials and experience from the design of low-level radioactive waste disposal facilities. A few examples of the previous use of cementitious materials for entombment of decommissioned nuclear facilities and proposals for the use in future decommissioning of nuclear reactors in a few countries are also included to provide global perspective

  3. Designing towards the Unknown: Engaging with Material and Aesthetic Uncertainty

    Directory of Open Access Journals (Sweden)

    Danielle Wilde

    2017-12-01

    Full Text Available New materials with new capabilities demand new ways of approaching design. Destabilising existing methods is crucial to develop new methods. Yet, radical destabilisation—where outcomes remain unknown long enough that new discoveries become possible—is not easy in technology design where complex interdisciplinary teams with time and resource constraints need to deliver concrete outcomes on schedule. The Poetic Kinaesthetic Interface project (PKI engages with this problematic directly. In PKI we use unfolding processes—informed by participatory, speculative and critical design—in emergent actions, to design towards unknown outcomes, using unknown materials. The impossibility of this task is proving as useful as it is disruptive. At its most potent, it is destabilising expectations, aesthetics and processes. Keeping the researchers, collaborators and participants in a state of unknowing, is opening the research potential to far-ranging possibilities. In this article we unpack the motivations driving the PKI project. We present our mixed-methodology, which entangles textile crafts, design interactions and materiality to shape an embodied enquiry. Our research outcomes are procedural and methodological. PKI brings together diverse human, non-human, known and unknown actors to discover where the emergent assemblages might lead. Our approach is re-invigorating—as it demands re-envisioning of—the design process.

  4. Materials design data for reduced activation martensitic steel type EUROFER

    Energy Technology Data Exchange (ETDEWEB)

    Tavassoli, A.-A.F. E-mail: tavassoli@cea.fr; Alamo, A.; Bedel, L.; Forest, L.; Gentzbittel, J.-M.; Rensman, J.-W.; Diegele, E.; Lindau, R.; Schirra, M.; Schmitt, R.; Schneider, H.C.; Petersen, C.; Lancha, A.-M.; Fernandez, P.; Filacchioni, G.; Maday, M.F.; Mergia, K.; Boukos, N.; Baluc,; Spaetig, P.; Alves, E.; Lucon, E

    2004-08-01

    Materials design limits derived so far from the data generated in Europe for the reduced activation ferritic/martensitic (RAFM) steel type Eurofer are presented. These data address the short-term needs of the ITER Test Blanket Modules and a DEMOnstration fusion reactor. Products tested include plates, bars, tubes, TIG and EB welds, as well as powder consolidated blocks and solid-solid HIP joints. Effects of thermal ageing and low dose neutron irradiation are also included. Results are sorted and screened according to design code requirements before being introduced in reference databases. From the physical properties databases, variations of magnetic properties, modulus of elasticity, density, thermal conductivity, thermal diffusivity, specific heat, mean and instantaneous linear coefficients of thermal expansion versus temperature are derived. From the tensile and creep properties databases design allowable stresses are derived. From the instrumented Charpy impact and fracture toughness databases, ductile to brittle transition temperature, toughness and behavior of materials in different fracture modes are evaluated. From the fatigue database, total strain range versus number of cycles to failure curves are plotted and used to derive fatigue design curves. Cyclic curves are also derived and compared with monotonic hardening curves. Finally, irradiated and aged materials data are compared to ensure that the safety margins incorporated in unirradiated design limits are not exceeded.

  5. In situ TEM observation of microcrack nucleation and propagation in pure tin solder

    International Nuclear Information System (INIS)

    Ding Ying; Wang Chunqing; Li, Mingyu; Wang Weiqiang

    2006-01-01

    Microcrack nucleation and propagation behavior in pure tin solder was investigated by using transmission electron microscopy (TEM) through in situ tensile test. Observation results showed that fracture process was completed in this visco-plastic material by connecting discontinuous cracks or voids. Depending on remarkable vacancy diffusion ability, microvoids were nucleated and developed in the dislocation free zone (DFZ) or super thinned area ahead of crack tip under local high stress concentration. The cracks were linked with each other by mutual dislocation emission which expedites the propagation of crack tips effectively

  6. CubeSat Material Limits for Design for Demise

    Science.gov (United States)

    Kelley, R. L.; Jarkey, D. R.

    2014-01-01

    The CubeSat form factor of nano-satellite (a satellite with a mass between one and ten kilograms) has grown in popularity due to their ease of construction and low development and launch costs. In particular, their use as student led payload design projects has increased due to the growing number of launch opportunities. CubeSats are often deployed as secondary or tertiary payloads on most US launch vehicles or they may be deployed from the ISS. The focus of this study will be on CubeSats launched from the ISS. From a space safety standpoint, the development and deployment processes for CubeSats differ significantly from that of most satellites. For large satellites, extensive design reviews and documentation are completed, including assessing requirements associated with re-entry survivability. Typical CubeSat missions selected for ISS deployment have a less rigorous review process that may not evaluate aspects beyond overall design feasibility. CubeSat design teams often do not have the resources to ensure their design is compliant with re-entry risk requirements. A study was conducted to examine methods to easily identify the maximum amount of a given material that can be used in the construction of a CubeSats without posing harm to persons on the ground. The results demonstrate that there is not a general equation or relationship that can be used for all materials; instead a limiting value must be defined for each unique material. In addition, the specific limits found for a number of generic materials that have been previously used as benchmarking materials for re-entry survivability analysis tool comparison will be discussed.

  7. Honeycomb technology materials, design, manufacturing, applications and testing

    CERN Document Server

    Bitzer, Tom

    1997-01-01

    Honeycomb Technology is a guide to honeycomb cores and honeycomb sandwich panels, from the manufacturing methods by which they are produced, to the different types of design, applications for usage and methods of testing the materials. It explains the different types of honeycomb cores available and provides tabulated data of their properties. The author has been involved in the testing and design of honeycomb cores and sandwich panels for nearly 30 years. Honeycomb Technology reflects this by emphasizing a `hands-on' approach and discusses procedures for designing sandwich panels, explaining the necessary equations. Also included is a section on how to design honeycomb energy absorbers and one full chapter discussing honeycomb core and sandwich panel testing. Honeycomb Technology will be of interest to engineers in the aircraft, aerospace and building industries. It will also be of great use to engineering students interested in basic sandwich panel design.

  8. MDTS: automatic complex materials design using Monte Carlo tree search

    Science.gov (United States)

    Dieb, Thaer M.; Ju, Shenghong; Yoshizoe, Kazuki; Hou, Zhufeng; Shiomi, Junichiro; Tsuda, Koji

    2017-12-01

    Complex materials design is often represented as a black-box combinatorial optimization problem. In this paper, we present a novel python library called MDTS (Materials Design using Tree Search). Our algorithm employs a Monte Carlo tree search approach, which has shown exceptional performance in computer Go game. Unlike evolutionary algorithms that require user intervention to set parameters appropriately, MDTS has no tuning parameters and works autonomously in various problems. In comparison to a Bayesian optimization package, our algorithm showed competitive search efficiency and superior scalability. We succeeded in designing large Silicon-Germanium (Si-Ge) alloy structures that Bayesian optimization could not deal with due to excessive computational cost. MDTS is available at https://github.com/tsudalab/MDTS.

  9. The radioactive materials packaging handbook: Design, operations, and maintenance

    International Nuclear Information System (INIS)

    Shappert, L.B.; Bowman, S.M.; Arnold, E.D.

    1998-01-01

    As part of its required activities in 1994, the US Department of Energy (DOE) made over 500,000 shipments. Of these shipments, approximately 4% were hazardous, and of these, slightly over 1% (over 6,400 shipments) were radioactive. Because of DOE's cleanup activities, the total quantities and percentages of radioactive material (RAM) that must be moved from one site to another is expected to increase in the coming years, and these materials are likely to be different than those shipped in the past. Irradiated fuel will certainly be part of the mix as will RAM samples and waste. However, in many cases these materials will be of different shape and size and require a transport packaging having different shielding, thermal, and criticality avoidance characteristics than are currently available. This Handbook provides guidance on the design, testing, certification, and operation of packages for these materials

  10. Study of New Materials Design based on Hadoop

    Directory of Open Access Journals (Sweden)

    Wu Jun

    2016-01-01

    Full Text Available With the rapid development of information technology, the scientific research shows that the data mining and other information technology could be used in the design of new materials. It is explicit that Intelligent Materials research focuses on using physical and chemical principles combined with computer techniques such as Big Data, Cloud computing and Intelligent modeling and simulation to solve chemical problems. In this paper, based on the cluster based outlier algorithm as the main body, this paper discusses the definition New Materials research In the Hadoop cloud platform, and the parallel processing of Map-Reduce model. The performance this model of new material was established by using the method of Map-Reduction provided the basis for the performance optimization.

  11. The radioactive materials packaging handbook: Design, operations, and maintenance

    Energy Technology Data Exchange (ETDEWEB)

    Shappert, L.B.; Bowman, S.M. [Oak Ridge National Lab., TN (United States); Arnold, E.D. [Lockheed Martin Energy Systems, Oak Ridge, TN (United States)] [and others

    1998-08-01

    As part of its required activities in 1994, the US Department of Energy (DOE) made over 500,000 shipments. Of these shipments, approximately 4% were hazardous, and of these, slightly over 1% (over 6,400 shipments) were radioactive. Because of DOE`s cleanup activities, the total quantities and percentages of radioactive material (RAM) that must be moved from one site to another is expected to increase in the coming years, and these materials are likely to be different than those shipped in the past. Irradiated fuel will certainly be part of the mix as will RAM samples and waste. However, in many cases these materials will be of different shape and size and require a transport packaging having different shielding, thermal, and criticality avoidance characteristics than are currently available. This Handbook provides guidance on the design, testing, certification, and operation of packages for these materials.

  12. Commentary: Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    Menovsky, T.; Beek, J.F.; Gemert, M.J.C. van

    1999-01-01

    Full text: Laser tissue welding is the process of using laser energy to join tissues without sutures or with a reduced number of sutures. Recently, diode lasers have been added to the list of fusion lasers (Lewis and Uribe 1993, Reali et al 1993). Typically, for tissue welding, deep penetrating diode lasers emitting at 800-810 nm are used, in combination with a strong absorbing protein solder containing the dye indocyanine green. Indocyanine green has a maximum absorption coefficient at 805 nm and binds preferentially with proteins (Sauda et al 1986). The greatest advantage of diode lasers is their compact size, easy use and low cost. In this issue of Physics in Medicine and Biology (pp 983-1002, 'Photothermal effects of laser tissue soldering'), in an in vitro study, McNally et al investigate the optimal laser settings and welding temperatures in relation to the tensile strength and thermal damage of bovine aorta specimens. An interesting statement in their introduction is that the low strength of laser produced anastomoses can lead to aneurysm formation. The increased chance of aneurysm formation may merely be due to the thermal effect of the laser on the vascular wall, especially on the adventitia and media layers, which become necrotic after thermal injury. Subsequent haemodynamic stress exerted on a damaged vascular wall is a significant contributing factor for aneurysmal initiation. Also interesting is the remark that 'by the application of wavelength-specific chromophores in tissue welding ... the requirement for precise focusing and aiming of the laser beam may be removed'. Though perhaps not yet fully justified, this statement, if true, would facilitate surgical procedures. While the experiments are conducted in a proper manner, the use of bovine aorta specimens, which were stored at -70 deg. C and subsequently thawed for the tissue welding experiments, may not be the most appropriate for studying tissue effects or tensile strength measurements, as the

  13. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

  14. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

  15. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

  16. A Corrosion Investigation of Solder Candidates for High-Temperature Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Ambat, Rajan

    2009-01-01

    The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work...

  17. Study for material analogs of FeSb2: Material design for thermoelectric materials

    Science.gov (United States)

    Kang, Chang-Jong; Kotliar, Gabriel

    2018-03-01

    Using the ab initio evolutionary algorithm (implemented in uspex) and electronic structure calculations we investigate the properties of a new thermoelectric material FeSbAs, which is a material analog of the enigmatic thermoelectric FeSb2. We utilize the density functional theory and the Gutzwiller method to check the energetics. We find that FeSbAs can be made thermodynamically stable above ˜30 GPa. We investigate the electronic structure and thermoelectric properties of FeSbAs based on the density functional theory and compare with those of FeSb2. Above 50 K, FeSbAs has higher Seebeck coefficients than FeSb2. Upon doping, the figure of merit becomes larger for FeSbAs than for FeSb2. Another material analog FeSbP, was also investigated, and found thermodynamically unstable even at very high pressure. Regarding FeSb2 as a member of a family of compounds (FeSb2, FeSbAs, and FeSbP) we elucidate what are the chemical handles that control the gaps in this series. We also investigate solubility (As or P for Sb in FeSb2) we found As to be more soluble. Finally, we study a two-band model for thermoelectric properties and find that the temperature dependent chemical potential and the presence of the ionized impurities are important to explain the extremum in the Seebeck coefficient exhibited in experiments for FeSb2.

  18. Bioinspired Design of Building Materials for Blast and Ballistic Protection

    Directory of Open Access Journals (Sweden)

    Yu-Yan Sun

    2016-01-01

    Full Text Available Nacre in abalone shell exhibits high toughness despite the brittle nature of its major constituent (i.e., aragonite. Its specific structure is a major contributor to the energy absorption capacity of nacre. This paper reviews the mechanisms behind the performance of nacre under shear, uniaxial tension, compression, and bending conditions. The remarkable combination of stiffness and toughness on nacre can motivate the development of bioinspired building materials for impact resistance applications, and the possible toughness designs of cement-based and clay-based composite materials with a layered and staggered structure were discussed.

  19. Bioinspiration from fish for smart material design and function

    International Nuclear Information System (INIS)

    Lauder, G V; Madden, P G A; Tangorra, J L; Anderson, E; Baker, T V

    2011-01-01

    Fish are a potentially rich source of inspiration for the design of smart materials. Fish exemplify the use of flexible materials to generate forces during locomotion, and a hallmark of fish functional design is the use of body and fin deformation to power propulsion and maneuvering. As a result of nearly 500 million years of evolutionary experimentation, fish design has a number of interesting features of note to materials engineers. In this paper we first provide a brief general overview of some key features of the mechanical design of fish, and then focus on two key properties of fish: the bilaminar mechanical design of bony fish fin rays that allows active muscular control of curvature, and the role of body flexibility in propulsion. After describing the anatomy of bony fish fin rays, we provide new data on their mechanical properties. Three-point bending tests and measurement of force inputs to and outputs from the fin rays show that these fin rays are effective displacement transducers. Fin rays in different regions of the fin differ considerably in their material properties, and in the curvature produced by displacement of one of the two fin ray halves. The mean modulus for the proximal (basal) region of the fin rays was 1.34 GPa, but this varied from 0.24 to 3.7 GPa for different fin rays. The distal fin region was less stiff, and moduli for the different fin rays measured varied from 0.11 to 0.67 GPa. These data are similar to those for human tendons (modulus around 0.5 GPa). Analysis of propulsion using flexible foils controlled using a robotic flapping device allows investigation of the effect of altering flexural stiffness on swimming speed. Flexible foils with the leading edge moved in a heave show a distinct peak in propulsive performance, while the addition of pitch input produces a broad plateau where the swimming speed is relatively unaffected by the flexural stiffness. Our understanding of the material design of fish and the control of tissue

  20. Tunable structural color in organisms and photonic materials for design of bioinspired materials

    International Nuclear Information System (INIS)

    Fudouzi, Hiroshi

    2011-01-01

    In this paper, the key topics of tunable structural color in biology and material science are overviewed. Color in biology is considered for selected groups of tropical fish, octopus, squid and beetle. It is caused by nanoplates in iridophores and varies with their spacing, tilting angle and refractive index. These examples may provide valuable hints for the bioinspired design of photonic materials. 1D multilayer films and 3D colloidal crystals with tunable structural color are overviewed from the viewpoint of advanced materials. The tunability of structural color by swelling and strain is demonstrated on an example of opal composites. (topical review)

  1. Tunable structural color in organisms and photonic materials for design of bioinspired materials

    Directory of Open Access Journals (Sweden)

    Hiroshi Fudouzi

    2011-01-01

    Full Text Available In this paper, the key topics of tunable structural color in biology and material science are overviewed. Color in biology is considered for selected groups of tropical fish, octopus, squid and beetle. It is caused by nanoplates in iridophores and varies with their spacing, tilting angle and refractive index. These examples may provide valuable hints for the bioinspired design of photonic materials. 1D multilayer films and 3D colloidal crystals with tunable structural color are overviewed from the viewpoint of advanced materials. The tunability of structural color by swelling and strain is demonstrated on an example of opal composites.

  2. Tunable structural color in organisms and photonic materials for design of bioinspired materials

    Science.gov (United States)

    Fudouzi, Hiroshi

    2011-01-01

    In this paper, the key topics of tunable structural color in biology and material science are overviewed. Color in biology is considered for selected groups of tropical fish, octopus, squid and beetle. It is caused by nanoplates in iridophores and varies with their spacing, tilting angle and refractive index. These examples may provide valuable hints for the bioinspired design of photonic materials. 1D multilayer films and 3D colloidal crystals with tunable structural color are overviewed from the viewpoint of advanced materials. The tunability of structural color by swelling and strain is demonstrated on an example of opal composites. PMID:27877454

  3. Influence of Co and W powders on viscosity of composite solders during soldering of specially shaped diamond-abrasive tools

    Science.gov (United States)

    Sokolov, E. G.; Aref’eva, S. A.; Svistun, L. I.

    2018-03-01

    The influence of Co and W powders on the structure and the viscosity of composite solders Sn-Cu-Co-W used for the manufacture of the specially shaped diamond tools has been studied. The solders were obtained by mixing the metallic powders with an organic binder. The mixtures with and without diamonds were applied to steel rollers and shaped substrates. The sintering was carried out in a vacuum at 820 ° C with time-exposure of 40 minutes. The influence of Co and W powders on the viscosity solders was evaluated on the basis of the study of structures and according to the results of sintering specially shaped diamond tools. It was found that to provide the necessary viscosity and to obtain the uniform diamond-containing layers on the complex shaped surfaces, Sn-Cu-Co-W solder should contain 27–35 vol % of solid phase. This is achieved with a total solder content of 24–32 wt % of cobalt powder and 7 wt % of tungsten powder.

  4. Soldering Technology (6th) Proceedings of Annual Seminar, 17-18 February 1982.

    Science.gov (United States)

    1982-02-01

    aspect oF health and safety during this presentation. We are hoping that the work conducted by Van 2 Der Molen in the USA will clarify this issue. FLUX... Der Molen , PROC. OF 5th ANNUAL SEMINAR SOLDERING TECHNOLOGY, Naval Weapons Centre, China Lake, California, February 1981. 3. Burge, Perks, O’Brien...developed a new and innovative solution, which we believe to be a significant advance in the state of the art. In this new design (Fig.l) a FM DER

  5. Automation of experimental research of waveguide paths induction soldering

    Science.gov (United States)

    Tynchenko, V. S.; Petrenko, V. E.; Kukartsev, V. V.; Tynchenko, V. V.; Antamoshkin, O. A.

    2018-05-01

    The article presents an automated system of experimental studies of the waveguide paths induction soldering process. The system is a part of additional software for a complex of automated control of the technological process of induction soldering of thin-walled waveguide paths from aluminum alloys, expanding its capabilities. The structure of the software product, the general appearance of the controls and the potential application possibilities are presented. The utility of the developed application by approbation in a series of field experiments was considered and justified. The application of the experimental research system makes it possible to improve the process under consideration, providing the possibility of fine-tuning the control regulators, as well as keeping the statistics of the soldering process in a convenient form for analysis.

  6. Optimization of the soldering process by the DMAIC methodology

    Directory of Open Access Journals (Sweden)

    Michał Zasadzień

    2016-06-01

    Full Text Available The chapter presents the use of the DMAIC method for the analysis and improvement of the process of soldering pins in a plug connecting a bundle of wires to the board of a controller; a part of the steering system of a car. The main problem in the soldering process, that is an unsatisfactory share of bad soldered connections between the board and the plug and the instability of that number, was identified by means of a five-phase improvement process. Key points and main causes of the defect were pointed out, and process improvement measures were suggested. Due to the analysis conducted and the correct implementation of improvement measures the share of defective connections has been decreased twofold.

  7. Miniaturization of Micro-Solder Bumps and Effect of IMC on Stress Distribution

    Science.gov (United States)

    Choudhury, Soud Farhan; Ladani, Leila

    2016-07-01

    As the joints become smaller in more advanced packages and devices, intermetallic (IMCs) volume ratio increases, which significantly impacts the overall mechanical behavior of joints. The existence of only a few grains of Sn (Tin) and IMC materials results in anisotropic elastic and plastic behavior which is not detectable using conventional finite element (FE) simulation with average properties for polycrystalline material. In this study, crystal plasticity finite element (CPFE) simulation is used to model the whole joint including copper, Sn solder and Cu6Sn5 IMC material. Experimental lap-shear test results for solder joints from the literature were used to validate the models. A comparative analysis between traditional FE, CPFE and experiments was conducted. The CPFE model was able to correlate the experiments more closely compared to traditional FE analysis because of its ability to capture micro-mechanical anisotropic behavior. Further analysis was conducted to evaluate the effect of IMC thickness on stress distribution in micro-bumps using a systematic numerical experiment with IMC thickness ranging from 0% to 80%. The analysis was conducted on micro-bumps with single crystal Sn and bicrystal Sn. The overall stress distribution and shear deformation changes as the IMC thickness increases. The model with higher IMC thickness shows a stiffer shear response, and provides a higher shear yield strength.

  8. Exascale Co-design for Modeling Materials in Extreme Environments

    Energy Technology Data Exchange (ETDEWEB)

    Germann, Timothy C. [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2014-07-08

    Computational materials science has provided great insight into the response of materials under extreme conditions that are difficult to probe experimentally. For example, shock-induced plasticity and phase transformation processes in single-crystal and nanocrystalline metals have been widely studied via large-scale molecular dynamics simulations, and many of these predictions are beginning to be tested at advanced 4th generation light sources such as the Advanced Photon Source (APS) and Linac Coherent Light Source (LCLS). I will describe our simulation predictions and their recent verification at LCLS, outstanding challenges in modeling the response of materials to extreme mechanical and radiation environments, and our efforts to tackle these as part of the multi-institutional, multi-disciplinary Exascale Co-design Center for Materials in Extreme Environments (ExMatEx). ExMatEx has initiated an early and deep collaboration between domain (computational materials) scientists, applied mathematicians, computer scientists, and hardware architects, in order to establish the relationships between algorithms, software stacks, and architectures needed to enable exascale-ready materials science application codes within the next decade. We anticipate that we will be able to exploit hierarchical, heterogeneous architectures to achieve more realistic large-scale simulations with adaptive physics refinement, and are using tractable application scale-bridging proxy application testbeds to assess new approaches and requirements. Such current scale-bridging strategies accumulate (or recompute) a distributed response database from fine-scale calculations, in a top-down rather than bottom-up multiscale approach.

  9. Design of a materials testing experiment for the INTOR

    International Nuclear Information System (INIS)

    Vogel, M.A.; Opperman, E.K.

    1981-01-01

    The United States, Japan, USSR and the European community are jointly participating in the design of an International Tokamak Reactor called INTOR. In support of the US contribution to the INTOR design, the features of an experiment for bulk neutron irradiation damage studies were developed. It is anticipated that materials testing will be an important part of the programmatic mission of INTOR and consequently the requirements for materials testing in INTOR must be identified early in the reactor design to insure compatibility. The design features of the experiment, called a Channel Test, are given in this paper. The major components of the channel test are the water cooled heat sink (channel module) and the specimen capsule. The temperature within each of the 153 specimen capsules is predetermined by engineering the thermal barrier between the specimen capsule and heat sink. Individual capsules can be independently accessed and are designed to operate at a predetermined temperature within the range of 50 to 700 0 C. The total irradiation volume within a single channel test is 45 liters. Features of the channel test that result in experimental versatility and simplified remote access and handling are discussed

  10. Computational Design of Batteries from Materials to Systems

    Energy Technology Data Exchange (ETDEWEB)

    Smith, Kandler A [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Santhanagopalan, Shriram [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Yang, Chuanbo [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Graf, Peter A [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Usseglio Viretta, Francois L [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Li, Qibo [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Finegan, Donal [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Pesaran, Ahmad A [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Yao, Koffi (Pierre) [Argonne National Laboratory; Abraham, Daniel [Argonne National Laboratory; Dees, Dennis [Argonne National Laboratory; Jansen, Andy [Argonne National Laboratory; Mukherjee, Partha [Texas A& M University; Mistry, Aashutosh [Texas A& M University; Verma, Ankit [Texas A& M University; Lamb, Josh [Sandia National Laboratories; Darcy, Eric [NASA

    2017-09-01

    Computer models are helping to accelerate the design and validation of next generation batteries and provide valuable insights not possible through experimental testing alone. Validated 3-D physics-based models exist for predicting electrochemical performance, thermal and mechanical response of cells and packs under normal and abuse scenarios. The talk describes present efforts to make the models better suited for engineering design, including improving their computation speed, developing faster processes for model parameter identification including under aging, and predicting the performance of a proposed electrode material recipe a priori using microstructure models.

  11. Drinking Water Contamination Due To Lead-based Solder

    Science.gov (United States)

    Garcia, N.; Bartelt, E.; Cuff, K. E.

    2004-12-01

    The presence of lead in drinking water creates many health hazards. Exposure to lead-contaminated water can affect the brain, the central nervous system, blood cells, and kidneys, causing such problems as mental retardation, kidney disease, heart disease, stroke, and death. One way in which lead can contaminate our water supply is through the use of lead solder to join pipes. Lead solder was widely used in the past because of its ease of application as well as its low cost. Lead contamination in residential areas has previously been found to be a particularly serious problem in first-draw samples, of water that has sat stagnant in pipes overnight. To investigate the time-dependence of drinking water lead contamination, we analyzed samples taken hourly of water exposed to lead solder. While our preliminary data was insufficient to show more than a rough correlation between time of exposure and lead concentration over short periods (1-3 hours), we were able to confirm that overnight exposure of water to lead-based solder results in the presence high levels of lead. We also investigated other, external factors that previous research has indicated contribute to increased concentrations of lead. Our analysis of samples of lead-exposed water at various pH and temperatures suggests that these factors can be equally significant in terms of their contribution to elevated lead concentration levels. In particular, water that is slightly corrosive appears to severely impact the solubility of lead. As this type of water is common in much of the Northeast United States, the presence of lead-based solder in residential areas there is especially problematic. Although lead-based solder has been banned since the 1980s, it remains a serious concern, and a practical solution still requires further research.

  12. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan

    2017-08-10

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  13. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan; Zheng, Xiujun; Zhang, Hong; Zhang, Junli; Fu, Jiecai; Zhang, Qiang; Peng, Chaoyi; Bai, Feiming; Zhang, Xixiang; Peng, Yong

    2017-01-01

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  14. Material control system design: Test Bed Nitrate Storage Area (TBNSA)

    International Nuclear Information System (INIS)

    Clark, G.A.; Da Roza, R.A.; Dunn, D.R.; Sacks, I.J.; Harrison, W.; Huebel, J.G.; Ross, W.N.; Salisbury, J.D.; Sanborn, R.H.; Weissenberger, S.

    1978-05-01

    This report provides an example of a hypothetical Special Nuclear Material (SNM) Safeguard Material Control and Accounting (MC and A) System which will be used as a subject for the demonstration of the Lawrence Livermore Laboratory MC and A System Evaluation Methodology in January 1978. This methodology is to become a tool in the NRC evaluation of license applicant submittals for Nuclear Fuel Cycle facilities. The starting point for this test bed design was the Allied-General Nuclear Services--Barnwell Nuclear Fuel Plant Reprocessing plant as described in the Final Safety Analysis Report (FSAR), of August 1975. The test bed design effort was limited to providing an SNM safeguard system for the plutonium nitrate storage area of this facility

  15. Enclosed mechanical seal face design for brittle materials copyright

    International Nuclear Information System (INIS)

    Marsi, J.A.

    1994-01-01

    Metal carbides are widely used as seal face material due to their hardness and wear resistance. Silicon carbide (SiC) has excellent performance as a seal face material, but it is relatively brittle and may break due to accidental overloads outside the boundary of normal operating conditions. In mechanical seals for nuclear primary coolant pumps, the shattered SiC pieces can get into the reactor system and cause serious damage. The conventional method of containing an SiC seal face is to shrink-fit it in a holder, which may lead the seal designer to contend with unwanted seal face deflections. This paper presents a successful, tested design which does not rely on shrink-fits. 5 refs., 9 figs., 4 tabs

  16. High-performance green semiconductor devices: materials, designs, and fabrication

    Science.gov (United States)

    Jung, Yei Hwan; Zhang, Huilong; Gong, Shaoqin; Ma, Zhenqiang

    2017-06-01

    From large industrial computers to non-portable home appliances and finally to light-weight portable gadgets, the rapid evolution of electronics has facilitated our daily pursuits and increased our life comforts. However, these rapid advances have led to a significant decrease in the lifetime of consumer electronics. The serious environmental threat that comes from electronic waste not only involves materials like plastics and heavy metals, but also includes toxic materials like mercury, cadmium, arsenic, and lead, which can leak into the ground and contaminate the water we drink, the food we eat, and the animals that live around us. Furthermore, most electronics are comprised of non-renewable, non-biodegradable, and potentially toxic materials. Difficulties in recycling the increasing amount of electronic waste could eventually lead to permanent environmental pollution. As such, discarded electronics that can naturally degrade over time would reduce recycling challenges and minimize their threat to the environment. This review provides a snapshot of the current developments and challenges of green electronics at the semiconductor device level. It looks at the developments that have been made in an effort to help reduce the accumulation of electronic waste by utilizing unconventional, biodegradable materials as components. While many semiconductors are classified as non-biodegradable, a few biodegradable semiconducting materials exist and are used as electrical components. This review begins with a discussion of biodegradable materials for electronics, followed by designs and processes for the manufacturing of green electronics using different techniques and designs. In the later sections of the review, various examples of biodegradable electrical components, such as sensors, circuits, and batteries, that together can form a functional electronic device, are discussed and new applications using green electronics are reviewed.

  17. 14 CFR 25.613 - Material strength properties and material design values.

    Science.gov (United States)

    2010-01-01

    ... statistical basis. (b) Material design values must be chosen to minimize the probability of structural... following probability: (1) Where applied loads are eventually distributed through a single member within an... probability with 95 percent confidence. (2) For redundant structure, in which the failure of individual...

  18. Safety design of the international fusion materials irradiation facility (IFMIF)

    International Nuclear Information System (INIS)

    Konishi, Satoshi; Yamaki, Daiju; Katsuta, Hiroji; Moeslang, Anton; Jameson, R.A.; Martone, Marcello; Shannon, T.E.

    1997-11-01

    In the Conceptual Design Activity of the IFMIF, major subsystems, as well as the entire facility is carefully designed to satisfy the safety requirements for any possible construction sites. Each subsystem is qualitatively analyzed to identify possible hazards to the workers, public and environments using Failure Mode and Effect Analysis (FMEA). The results are reflected in the design and operation procedure. Shielding of radiation, particularly neutron around the test cell is one of the most important issue in normal operation. Radiation due to beam halo and activation is a hazard for operation personnel in the accelerator system. For the maintenance, remote handling technology is designed to be applied in various facilities of the IFMIF. Lithium loop and target system hold the majority of the radioactive material in the facility. Tritium and beryllium-7 are generated by the nuclear reaction during operation and thus needed to be removed continuously. They are also the potential hazards of airborne source in off-normal events. Minimization of inventory, separation and immobilization, and multiple confinement are considered in the design. Generation of radioactive waste is anticipated to be minor, but waste treatment systems for gas, liquid and solid wastes are designed to minimize the environmental impact. Lithium leak followed by a fire is a major concern, and extensive prevention plan is made in the target design. One of the design option considered is composed of; primary enclosure of the lithium loop, secondary containment filled with positive pressure argon, and an air tight lithium cell made of concrete with a steel lining. This study will report some technical issues considered in the design of IFMIF. It was concluded that the IFMIF can be designed and constructed to meet or exceed current safely standards for workers, public and the environment with existing technology and reasonable construction cost. (J.P.N.)

  19. Chalcogenide Glass Radiation Sensor; Materials Development, Design and Device Testing

    Energy Technology Data Exchange (ETDEWEB)

    Mitkova, Maria; Butt, Darryl; Kozicki, Michael; Barnaby, Hugo

    2013-04-30

    studied the effect of x-rays and γ-rays, on thin film chalcogenide glasses and applied them in conjunction with film incorporating a silver source in a new type of radiation sensor for which we have an US patent application [3]. In this report, we give data about our studies regarding our designed radiation sensor along with the testing and performance at various radiation doses. These studies have been preceded by materials characterization research related to the compositional and structural characteristics of the active materials used in the radiation sensor design. During the work on the project, we collected a large volume of material since every experiment was repeated many times to verify the results. We conducted a comprehensive material research, analysis and discussion with the aim to understand the nature of the occurring effects, design different structures to harness these effects, generated models to aid in the understanding the effects, built different device structures and collected data to quantify device performance. These various aspects of our investigation have been detailed in previous quarterly reports. In this report, we present our main results and emphasize on the results pertaining to the core project goals materials development, sensor design and testing and with an emphasis on classifying the appropriate material and design for the optimal application. The report has three main parts: (i) Presentation of the main data; (ii) Bulleted summary of the most important results; (iii) List of the patent, journal publications, conference proceedings and conferences participation, occurring as a result of working on the project.

  20. Tin-silver and tin-copper alloys for capillarity joining-soft soldering-of copper piping

    International Nuclear Information System (INIS)

    Duran, J.; Amo, J. M.; Duran, C. M.

    2001-01-01

    It is studied the influence of the type of alloy used as filling material on the defects of the soldering joints in copper piping installations, which induce the fluid leak of the systems. The different eutectic temperatures and solidus-liquidus ranges of these alloys, require the setting of the soldering heat input in each case to obtain the suitable capillarity features and alloying temperatures to achieve for the correct formation of the bonding. Most defects in the joints are demonstrated to be generated by bad dossification of thermal inputs, which led depending on the filler alloy used to variations in its fluidity that may produce penetration failures in the bonds or insufficient consistency for the filling of the joints. (Author) 7 refs

  1. New approach to design of ceramic/polymer material compounds

    International Nuclear Information System (INIS)

    Todt, A; Nestler, D; Trautmann, M; Wagner, G

    2016-01-01

    The damage tolerance of carbon fibre-reinforced ceramic-matrix composite materials depends on their porosity and can be rather significant. Complex structures are difficult to produce. The integration of simple geometric structures of ceramic-matrix composite materials in complex polymer-based hybrid structures is a possible approach of realising those structures. These hybrid material compounds, produced in a cost-efficient way, combine the different advantages of the individual components in one hybrid material compound. In addition the individual parts can be designed to fit a specific application and the resulting forces. All these different advantages result in a significant reduction of not only the production costs and the production time, but also opens up new areas of application, such as the large-scale production of wear-resistant and chemically inert, energy dampening components for reactors or in areas of medicine. The low wettability of the ceramic component however is a disadvantage of this approach. During the course of this contribution, different C/C composite materials with a specific porosity were produced, while adjusting the resin/hardening agent-ratio, as well as the processing parameters. After the production, different penetration tests were conducted with a polymer component. The final part of the article is comprised of the microstructural analysis and the explanation of the mechanical relationships. (paper)

  2. TFTR materials issues and problems during design and construction

    International Nuclear Information System (INIS)

    Sabado, M.; Little, R.

    1984-01-01

    TFTR as well as its contemporaries, T15, JT60, and JET, have important contributions to make towards our understanding of plasma conditions in the thermonuclear regime. One of the main objectives of TFTR is to produce fusion power densities approaching those in a fusion reactor, approx.= 1 Wcm -3 at Q approx.= 1-2. TFTR will be the first tokamak to routinely use deuterium tritium, and produce approx.= 10 19 fusion neutrons per pulse. With startup of TFTR on December 24, 1982, the demonstration of physics feasibility of 'breakeven' is close at hand. Since TFTR performance will be reactor relevant, the capability of materials/components to withstand the hostile effects of a plasma environment will be presented. It is intended that designers of future fusion devices benefit from the materials technology developments and applications on TFTR. In an attempt to comply with this mandate, this paper will describe TFTR issues on materials, their developments, selections, problems, and solutions. Special emphasis will be given, in particular, to the impurity control devices in TFTR, namely, the limiter and surface pumping system located inside the vacuum vessel. The plasma will interact with these components and they will be subjected to disruptions, a vacuum of 10 -6 to 10 -8 torr and a nominal temperatures of 0 C. 'Painful' materials development problems encountered will be reviewed, as well as important 'lessons learned'. A briefing on the materials of construction will be given, with some comments on the problems that developed and their solutions. (orig.)

  3. Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

    Energy Technology Data Exchange (ETDEWEB)

    Lucas, J.P.; Guo, F.; McDougall, J.; Bieler, T.R.; Subramanian, K.N.; Park, J.K.

    1999-11-01

    Creep deformation behavior was measured for 60--100 {micro}m thick solder joints. The solder joints investigated consisted of: (1) non-composite solder joints made with eutectic Sn-Ag solder, and (2) composite solder joints with eutectic Sn-Ag solder containing 20 vol.%, 5 {micro}m diameter in-situ Cu{sub 6}Sn{sub 5} intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.

  4. Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xia Yanghua [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)], E-mail: xia_yanghua@hotmail.com; Xie Xiaoming [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)

    2008-04-24

    The reliability of lead-free electronic assemblies under thermal cycling was investigated. Thin small outline package (TSOP) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) were studied. The results show that OSP finish reveals better performance than its ENIG counterparts. The crack originates at the fringe of heel fillet in both cases. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface. When the OSP finishes are employed, many Cu6Sn5 precipitates form inside the bulk solder and have a strengthening effect on the solder joint, resulting in better reliability performance as compared to those with ENIG finishes.

  5. Designing Next Generation Rechargeable Battery Materials from First-Principles

    Science.gov (United States)

    Kim, Soo

    Technology has advanced rapidly, especially in the twenty-first century, influencing our day-to-day life on unprecedented levels. Most such advances in technology are closely linked to, and often driven by, the discovery and design of new materials. It follows that the discovery of new materials can not only improve existing technologies but also lead to revolutionary ones. In particular, there is a growing need to develop new energy materials that are reliable, clean, and affordable for emerging applications such as portable electronics, electric vehicles, and power grid systems. Many researchers have been actively searching for more cost-effective and clean electrode materials for lithium-ion batteries (LIBs) during the last few decades. These new electrode materials are also required to achieve higher electrochemical performance, compared to the already commercialized electrodes. Unfortunately, discovering the next sustainable energy materials based on a traditional 'trial-and-error' method via experiment would be extremely slow and difficult. In the last two decades, computational compilations of battery material properties such as voltage, diffusivity, and phase stability against irreversible phase transformation(s) using first-principles density functional theory (DFT) calculations have helped researchers to understand the underlying mechanism in many oxide materials that are used as LIB electrodes. Here, we have examined the (001) and (111) surface structures of LiMn2O4 (LMO) spinel cathode materials using DFT calculations within the generalized gradient approximation (GGA) + U approach. Our theoretical results explain the observation of a wide spectrum of polyhedral shapes between (001)- and (111)-dominated LMO particles in experiments, which can be described by the narrow range of surface energies and their sensitivity to synthesis conditions. We further show that single-layer graphene coatings help suppress manganese dissolution in LMO by chemically

  6. Soldering and brazing safety guide: A handbook on space practice for those involved in soldering and brazing

    Science.gov (United States)

    This manual provides those involved in welding and brazing with effective safety procedures for use in performance of their jobs. Hazards exist in four types of general soldering and brazing processes: (1) cleaning; (2) application of flux; (3) application of heat and filler metal; and (4) residue cleaning. Most hazards during those operations can be avoided by using care, proper ventilation, protective clothing and equipment. Specific process hazards for various methods of brazing and soldering are treated. Methods to check ventilation are presented as well as a check of personal hygiene and good maintenance practices are stressed. Several emergency first aid treatments are described.

  7. Fiscal 1998 achievement report on regional consortium research and development project. Venture business raising type regional consortium - Small business creation base type (Preparation of monodispersed spherical particles for solder materials for application to high density semiconductor packaging - 2nd year); 1998 nendo komitsudo handotai jisso no tame no tanbunsan kyukei handa ryushi no sakusei ni kansuru kenkyu seika hokokusho (dai 2 nendo)

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2000-03-01

    Fine solder grains have been developed, spherical in shape, uniform in diameter, high in dimensional precision, and high in surface cleanliness, which are necessary for the establishment of next-generation technologies of flip chip bonding and ball grid array which are indispensable for high-density high-reliability packaging of electronic devices such as LSI (large scale integration). Results attained in fiscal 1998 are described. A pulse pressure aided orifice injection method was used. Monodispersed grains are prepared for the Pb-63Sn solder and Sn-3.5Ag lead-free solder. In the case of a 200{mu}m-large orifice, the grain diameter was controlled to fall in the range of 190-210{mu}m and the accuracy was not lower than {+-}6{mu}m. The main goal of this project has been accomplished now that these figures were attained without a sorting process and satisfy the most rigorous conditions currently proposed by the industrial circle involved. The flow of hot liquid out of the orifice and the splitting process of grains were clarified by thermal hydraulic analysis. It was found that grains split and fly not because of instability due to Rayleigh surface waves but because of their liberation from surface tension when equipped with critical kinetic energy. (NEDO)

  8. System design for safe robotic handling of nuclear materials

    International Nuclear Information System (INIS)

    Drotning, W.; Wapman, W.; Fahrenholtz, J.; Kimberly, H.; Kuhlmann, J.

    1996-01-01

    Robotic systems are being developed by the Intelligent Systems and Robotics Center at Sandia National Laboratories to perform automated handling tasks with radioactive nuclear materials. These systems will reduce the occupational radiation exposure to workers by automating operations which are currently performed manually. Because the robotic systems will handle material that is both hazardous and valuable, the safety of the operations is of utmost importance; assurance must be given that personnel will not be harmed and that the materials and environment will be protected. These safety requirements are met by designing safety features into the system using a layered approach. Several levels of mechanical, electrical and software safety prevent unsafe conditions from generating a hazard, and bring the system to a safe state should an unexpected situation arise. The system safety features include the use of industrial robot standards, commercial robot systems, commercial and custom tooling, mechanical safety interlocks, advanced sensor systems, control and configuration checks, and redundant control schemes. The effectiveness of the safety features in satisfying the safety requirements is verified using a Failure Modes and Effects Analysis. This technique can point out areas of weakness in the safety design as well as areas where unnecessary redundancy may reduce the system reliability

  9. Development of integrated platform for computational material design

    Energy Technology Data Exchange (ETDEWEB)

    Kiyoshi, Matsubara; Kumi, Itai; Nobutaka, Nishikawa; Akifumi, Kato [Center for Computational Science and Engineering, Fuji Research Institute Corporation (Japan); Hideaki, Koike [Advance Soft Corporation (Japan)

    2003-07-01

    The goal of our project is to design and develop a problem-solving environment (PSE) that will help computational scientists and engineers develop large complicated application software and simulate complex phenomena by using networking and parallel computing. The integrated platform, which is designed for PSE in the Japanese national project of Frontier Simulation Software for Industrial Science, is defined by supporting the entire range of problem solving activity from program formulation and data setup to numerical simulation, data management, and visualization. A special feature of our integrated platform is based on a new architecture called TASK FLOW. It integrates the computational resources such as hardware and software on the network and supports complex and large-scale simulation. This concept is applied to computational material design and the project 'comprehensive research for modeling, analysis, control, and design of large-scale complex system considering properties of human being'. Moreover this system will provide the best solution for developing large and complicated software and simulating complex and large-scaled phenomena in computational science and engineering. A prototype has already been developed and the validation and verification of an integrated platform will be scheduled by using the prototype in 2003. In the validation and verification, fluid-structure coupling analysis system for designing an industrial machine will be developed on the integrated platform. As other examples of validation and verification, integrated platform for quantum chemistry and bio-mechanical system are planned.

  10. Development of integrated platform for computational material design

    International Nuclear Information System (INIS)

    Kiyoshi, Matsubara; Kumi, Itai; Nobutaka, Nishikawa; Akifumi, Kato; Hideaki, Koike

    2003-01-01

    The goal of our project is to design and develop a problem-solving environment (PSE) that will help computational scientists and engineers develop large complicated application software and simulate complex phenomena by using networking and parallel computing. The integrated platform, which is designed for PSE in the Japanese national project of Frontier Simulation Software for Industrial Science, is defined by supporting the entire range of problem solving activity from program formulation and data setup to numerical simulation, data management, and visualization. A special feature of our integrated platform is based on a new architecture called TASK FLOW. It integrates the computational resources such as hardware and software on the network and supports complex and large-scale simulation. This concept is applied to computational material design and the project 'comprehensive research for modeling, analysis, control, and design of large-scale complex system considering properties of human being'. Moreover this system will provide the best solution for developing large and complicated software and simulating complex and large-scaled phenomena in computational science and engineering. A prototype has already been developed and the validation and verification of an integrated platform will be scheduled by using the prototype in 2003. In the validation and verification, fluid-structure coupling analysis system for designing an industrial machine will be developed on the integrated platform. As other examples of validation and verification, integrated platform for quantum chemistry and bio-mechanical system are planned

  11. Evaluation of aluminum drill-pipe material and design

    Energy Technology Data Exchange (ETDEWEB)

    Placido, Joao C. [PETROBRAS, Rio de Janeiro, RJ (Brazil); Lourenco, Marcelo I.; Netto, Theodoro Antoun [Universidade Federal do Rio de Janeiro (UFRJ), RJ (Brazil). Coordenacao dos Programas de Pos-graduacao de Engenharia (COPPE)

    2008-07-01

    Experimental program and numerical analyses were carried out to investigate the fatigue mechanisms of aluminum drill pipes designed and manufactured in compliance with ISO 15546. The main objective is to improve the fatigue performance of these components by selecting the appropriate aluminum alloy and by enhancing the mechanical design of the threaded steel connector. This paper presents the experimental test program and numerical analyses conducted on a drill-pipe of different materials (Al-Cu-Mg and Al-Zn-Mg system aluminum alloys) and geometry. Material mechanical properties, including S-N curve, were determined through small-scale tests on specimens cut from actual drill pipes. Full-scale experiments were also performed in laboratory. A finite element model of the drill pipe, including the tool-joint region, was developed. The model simulates, through different load steps, the tool-joint hot assembly, and then reproduces the physical experiments numerically in order to obtain the actual stress distribution. Good correlation between full-scale and small-scale fatigue tests was obtained by adjusting the strain/stress levels monitored in the full-scale tests in light of the numerical simulations and performing fatigue life calculations via multiaxial fatigue models. The weak points of the current practice design are highlighted for further development. (author)

  12. Design of facilities for processing pyrophoric radioactive material

    International Nuclear Information System (INIS)

    Bristow, H.A.S.; Hunter, S.D.

    1976-01-01

    The safe processing of large quantities of plutonium-bearing material poses difficult problems the solution of which sometimes involves conflicting requirements. The difficulties are increased when plutonium of a high burnup is used and the position becomes considerably more complicated when the chemical nature of the material being handled is such that it is pyrophoric. This paper describes the design principles and methods used to establish a facility capable of manufacturing large quantities of mixed plutonium/uranium carbide. The facility which included process stages such as milling, granulation, pellet pressing, furnacing and pin filling, was largely a conversion of an existing processing line. The paper treats the major plant hazards individually and indicates the methods used to counter them, outlining the main design principles employed and describing their application to selected items of equipment. Examples of the problems encountered with typical items of equipment are discussed. Some guide-lines are listed which should be of general value to designers and developers working on equipment for processing plutonium-bearing solids. The methods described have been successfully employed to provide a plant for the manufacture of mixed plutonium/uranium carbide on a scale of many hundreds of kilograms with no serious incident.(author)

  13. Horizon shells and BMS-like soldering transformations

    Energy Technology Data Exchange (ETDEWEB)

    Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)

    2016-03-07

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  14. Effects of PCB thickness on adjustable fountain wave soldering

    Indian Academy of Sciences (India)

    hybrid circuit assembly, component lead tinning, and wire tinning. .... The mesh model was built and optimized with 599920 hybrid nodes as shown in figure 9. ... conducted to track the fluid motions of the two phases (i.e., molten solder and air).

  15. High-Pressure Design of Advanced BN-Based Materials

    Directory of Open Access Journals (Sweden)

    Oleksandr O. Kurakevych

    2016-10-01

    Full Text Available The aim of the present review is to highlight the state of the art in high-pressure design of new advanced materials based on boron nitride. Recent experimental achievements on the governing phase transformation, nanostructuring and chemical synthesis in the systems containing boron nitride at high pressures and high temperatures are presented. All these developments allowed discovering new materials, e.g., ultrahard nanocrystalline cubic boron nitride (nano-cBN with hardness comparable to diamond, and superhard boron subnitride B13N2. Thermodynamic and kinetic aspects of high-pressure synthesis are described based on the data obtained by in situ and ex situ methods. Mechanical and thermal properties (hardness, thermoelastic equations of state, etc. are discussed. New synthetic perspectives, combining both soft chemistry and extreme pressure–temperature conditions are considered.

  16. Calculations to support design of a nuclear material tracking system

    International Nuclear Information System (INIS)

    Carter, L.L.; Eggers, R.F.; Williams, T.L.

    1991-01-01

    The Westinghouse Hanford Company is developing a nuclear material tracking system called NTRAK for the US Department of Energy at the Savannah River site. The NTRAK system is designed to determine the position and approximate magnitude of packages of special nuclear material (SNM) moving through a nuclear plant. The NTRAK accomplishes this by using special assemblies of detectors called modules to measure the gamma radiation emitted by the SNM. After measurement, raw data are processed to determine the direction to and position of the gamma-ray source. In order for the NTRAK method of SNM tracking to work, the gamma-ray signal at the detector modules must be at least four standard deviations above background. This paper addresses the use of the Monte Carlo computer code for neutron and photon transport (MCNP) to (a) predict the radiation emitted by plutonium oxide sources and (b) predict the counting rate of NaI detectors measuring those sources

  17. Pelamis WEC - main body structural design and materials selection

    Energy Technology Data Exchange (ETDEWEB)

    Anderson, C.

    2003-07-01

    This report summarises the results of a study evaluating the potential use of rolled steel, glass reinforced plastic, wood-epoxy laminate, and different forms of concrete as primary structural materials for the Pelamis Wave Energy Converter (WEC) as part of a strategy to refine the design by highlighting cost savings for long-term manufacture. Details are given of the drawing up of a load spectrum in order to assess the candidate structures, the choice of glass reinforced plastic, concrete, and steel for further evaluation based on preliminary screening, the assessment of the material requirements for each candidate structure, and cost estimates. The advantages of the use of concrete are discussed and recommendations are presented.

  18. Design and Implementation of Company Tailored Automated Material Handling

    DEFF Research Database (Denmark)

    Langer, Gilad; Bilberg, Arne

    1996-01-01

    This article focuses on the problems of analysing automation of material handling systems in order to develop an efficient automated solution that is specifically tailored to the company. The research has resulted in development of new methods for evaluating factory automation from design...... to implementation. The goals of the research were to analyse and evaluate automation in order to obtain an advantageous combination of human and automated resources. The idea is to asses different solutions in a virtual environment, where experiments and analyses can be performed so that the company can justify...... for their application with computer aided information processing tools. The framework is named the "Automated Material Handling (AMH) Preference GuideLine". The research has been carried out in close co-operation with Danish and European industry, where implementations of automation can be referred to. It is our...

  19. Materials for Hydrogen Storage in Nanocavities: Design criteria

    Energy Technology Data Exchange (ETDEWEB)

    Reguera, E. [Centro de Investigacion en Ciencia Aplicada y Tecnologia Avanzada del IPN, Unidad Legaria, Legaria 694, Col. Irrigacion (Mexico)

    2009-11-15

    The adsorption potential for a given adsorbate depends of both, material surface and adsorbate properties. In this contribution the possible guest-host interactions for H{sub 2} within a cavity or on a surface are discussed considering the molecule physical properties. Five different interactions contribute to the adsorption forces for this molecule: 1) quadrupole moment interaction with the local electric field gradient; 1) electron cloud polarization by a charge center; 3) dispersive forces (van der Waals); 4) quadrupole moment versus quadrupole moment between neighboring H{sub 2} molecules, and, 5) H{sub 2} coordination to a metal center. The relative importance of these five interactions for the hydrogen storage in nanocavities is discussed from experimental evidences in order to extract materials design criteria for molecular hydrogen storage. (author)

  20. Hybrid materials science: a promised land for the integrative design of multifunctional materials.

    Science.gov (United States)

    Nicole, Lionel; Laberty-Robert, Christel; Rozes, Laurence; Sanchez, Clément

    2014-06-21

    For more than 5000 years, organic-inorganic composite materials created by men via skill and serendipity have been part of human culture and customs. The concept of "hybrid organic-inorganic" nanocomposites exploded in the second half of the 20th century with the expansion of the so-called "chimie douce" which led to many collaborations between a large set of chemists, physicists and biologists. Consequently, the scientific melting pot of these very different scientific communities created a new pluridisciplinary school of thought. Today, the tremendous effort of basic research performed in the last twenty years allows tailor-made multifunctional hybrid materials with perfect control over composition, structure and shape. Some of these hybrid materials have already entered the industrial market. Many tailor-made multiscale hybrids are increasingly impacting numerous fields of applications: optics, catalysis, energy, environment, nanomedicine, etc. In the present feature article, we emphasize several fundamental and applied aspects of the hybrid materials field: bioreplication, mesostructured thin films, Lego-like chemistry designed hybrid nanocomposites, and advanced hybrid materials for energy. Finally, a few commercial applications of hybrid materials will be presented.

  1. Hybrid materials science: a promised land for the integrative design of multifunctional materials

    Science.gov (United States)

    Nicole, Lionel; Laberty-Robert, Christel; Rozes, Laurence; Sanchez, Clément

    2014-05-01

    For more than 5000 years, organic-inorganic composite materials created by men via skill and serendipity have been part of human culture and customs. The concept of ``hybrid organic-inorganic'' nanocomposites exploded in the second half of the 20th century with the expansion of the so-called ``chimie douce'' which led to many collaborations between a large set of chemists, physicists and biologists. Consequently, the scientific melting pot of these very different scientific communities created a new pluridisciplinary school of thought. Today, the tremendous effort of basic research performed in the last twenty years allows tailor-made multifunctional hybrid materials with perfect control over composition, structure and shape. Some of these hybrid materials have already entered the industrial market. Many tailor-made multiscale hybrids are increasingly impacting numerous fields of applications: optics, catalysis, energy, environment, nanomedicine, etc. In the present feature article, we emphasize several fundamental and applied aspects of the hybrid materials field: bioreplication, mesostructured thin films, Lego-like chemistry designed hybrid nanocomposites, and advanced hybrid materials for energy. Finally, a few commercial applications of hybrid materials will be presented.

  2. Sustainable hydrogen - A challenge for materials science and equipment design

    International Nuclear Information System (INIS)

    Duta, Anca; Enesca, Alexandru Ioan; Perniu, Dana

    2006-01-01

    Full text: Hydrogen is the ideal fuel, considering its fully non-polluting by-products. Still, in discussions on 'sustainable hydrogen', there must be considered all the steps implied in hydrogen production, storage and use and the overall energy balance represents the real starting point of evaluating the sustainability. So far, hydrogen production is related to rather energy-consuming processes; extended research is devoted to develop high efficiency processes, but the industrial hydrogen production makes use of either large electrical or thermal energy amounts. Hydrogen production via water photolysis represents, consequently a viable alternative although many steps have to be elaborated to reached the industrial scale of these processes. Hydrogen storing represents another problem that affects its application; a safe storage way, in metal hydrides, is still under intensive research all over the world. The group of the Centre of Product Design for Sustainable Development is engaged in research for developing a laboratory photolyser, able to produce hydrogen and to offer an efficient storage alternative. The photolyser is a photo-electrochemical cell, and the efficiency of the photolysis process depends on several factors: - the photo-electrodes: thin films of wide band gap semiconductors with tailored properties; - the aqueous environment, with effect on the electrode materials properties and stability; - the external bias; - the cell design. The paper focuses mainly on the photo-electrode materials that were tested. The influence of the composition, crystalline and defect structure, of the morphology and of the interfaces on the photolysis process are reviewed. The effect of the pH in the aqueous media is discussed along with the stability of the materials and the reversibility of the adsorption/desorption processes. The design criteria that must be fulfilled in developing the photolyser are also discussed. (authors)

  3. Technical Meeting on Liquid Metal Reactor Concepts: Core Design and Structural Materials. Working Material

    International Nuclear Information System (INIS)

    2013-01-01

    The objective of the TM on “Liquid metal reactor concept: core design and structural materials” was to present and discuss innovative liquid metal fast reactor (LMFR) core designs with special focus on the choice, development, testing and qualification of advanced reactor core structural materials. Main results arising from national and international R&D programmes and projects in the field were reviewed, and new activities to be carried out under the IAEA aegis were identified on the basis of the analysis of current research and technology gaps

  4. Road Materials and Pavement Design Volume 17(1)

    CSIR Research Space (South Africa)

    De Beer, Morris

    2016-03-01

    Full Text Available Materials and Pavement Design Volume 17, 2016 - Issue 1 Editorial Board Page ebi | Published online: 03 Oct 2016  http://dx.doi.org/10.1080/14680629.2016.1244475 Editors-in-Chief Hervé DI BENEDETTO - University of Lyon/ENTPE, Vaulx-en-Velin, France... Andrew Charles COLLOP - De Montfort University, Leicester, UK William G. BUTTLAR - University of Missouri, Urbana-Champaign, USA Editor-in-Chief at Large Jorge B. Sousa - Consulpav, Oeiras, Portugal Associate Editors Morris de Beer - CSIR Built...

  5. Design of materials configurations for enhanced phononic and electronic properties

    Science.gov (United States)

    Daraio, Chiara

    The discovery of novel nonlinear dynamic and electronic phenomena is presented for the specific cases of granular materials and carbon nanotubes. This research was conducted for designing and constructing optimized macro-, micro- and nano-scale structural configurations of materials, and for studying their phononic and electronic behavior. Variation of composite arrangements of granular elements with different elastic properties in a linear chain-of-sphere, Y-junction or 3-D configurations led to a variety of novel phononic phenomena and interesting physical properties, which can be potentially useful for security, communications, mechanical and biomedical engineering applications. Mechanical and electronic properties of carbon nanotubes with different atomic arrangements and microstructures were also investigated. Electronic properties of Y-junction configured carbon nanotubes exhibit an exciting transistor switch behavior which is not seen in linear configuration nanotubes. Strongly nonlinear materials were designed and fabricated using novel and innovative concepts. Due to their unique strongly nonlinear and anisotropic nature, novel wave phenomena have been discovered. Specifically, violations of Snell's law were detected and a new mechanism of wave interaction with interfaces between NTPCs (Nonlinear Tunable Phononic Crystals) was established. Polymer-based systems were tested for the first time, and the tunability of the solitary waves speed was demonstrated. New materials with transformed signal propagation speed in the manageable range of 10-100 m/s and signal amplitude typical for audible speech have been developed. The enhancing of the mitigation of solitary and shock waves in 1-D chains were demonstrated and a new protective medium was designed for practical applications. 1-D, 2-D and 3-D strongly nonlinear system have been investigated providing a broad impact on the whole area of strongly nonlinear wave dynamics and creating experimental basis for new

  6. Shield design for the Fusion Materials Irradiation Test facility

    International Nuclear Information System (INIS)

    Carter, L.L.; Mann, F.M.; Morford, R.J.; Wilcox, A.D.; Johnson, D.L.; Huang, S.T.

    1983-03-01

    The shield design for the Fusion Materials Irradiation Test facility is based upon one-, two- and three-dimensional transport calculations with experimental measurements utilized to refine the nuclear data including the neutron cross sections from 20 to 50 MeV and the gamma ray and neutron source terms. The high energy neutrons and deuterons produce activation products from the numerous reactions that are kinematically allowed. The analyses for both beam-on and beam-off (from the activation products) conditions have required extensive nuclear data libraries and the utilization of Monte Carlo, discrete ordinates, point kernel and auxiliary computer codes

  7. Connecting drug delivery reality to smart materials design.

    Science.gov (United States)

    Grainger, David W

    2013-09-15

    Inflated claims to both design and mechanistic novelty in drug delivery and imaging systems, including most nanotechnologies, are not supported by the generally poor translation of these systems to clinical efficacy. The "form begets function" design paradigm is seductive but perhaps over-simplistic in translation to pharmaceutical efficacy. Most innovations show few clinically important distinctions in their therapeutic benefits in relevant preclinical disease and delivery models, despite frequent claims to the contrary. Long-standing challenges in drug delivery issues must enlist more realistic, back-to-basics approaches to address fundamental materials properties in complex biological systems, preclinical test beds, and analytical methods to more reliably determine fundamental pharmaceutical figures of merit, including drug carrier purity and batch-batch variability, agent biodistribution, therapeutic index (safety), and efficacy. Copyright © 2013 Elsevier B.V. All rights reserved.

  8. Aerogel Hybrid Composite Materials: Designs and Testing for Multifunctional Applications

    Science.gov (United States)

    Williams, Martha K.; Fesmire, James E.

    2016-01-01

    This webinar will introduce the broad spectrum of aerogel composites and their diverse performance properties such as reduced heat transfer to energy storage, and expands specifically on the aerogel/fiber laminate systems and testing methodologies. The multi-functional laminate composite system, AeroFiber, and its construction is designed by varying the type of fiber (e.g. polyester, carbon, Kevlar®, Spectra® or Innegral(TradeMark) and combinations thereof), the aerogel panel type and thickness, and overall layup configuration. The combination and design of materials may be customized and tailored to achieve a range of desired properties in the resulting laminate system. Multi-functional properties include structural strength, impact resistance, reduction in heat transfer, increased fire resistance, mechanical energy absorption, and acoustic energy dampening. Applications include aerospace, aircraft, automotive, boating, building and construction, lightweight portable structures, liquefied natural gas, cryogenics, transportation and energy, sporting equipment, and military protective gear industries.

  9. Advanced composite structures. [metal matrix composites - structural design criteria for spacecraft construction materials

    Science.gov (United States)

    1974-01-01

    A monograph is presented which establishes structural design criteria and recommends practices to ensure the design of sound composite structures, including composite-reinforced metal structures. (It does not discuss design criteria for fiber-glass composites and such advanced composite materials as beryllium wire or sapphire whiskers in a matrix material.) Although the criteria were developed for aircraft applications, they are general enough to be applicable to space vehicles and missiles as well. The monograph covers four broad areas: (1) materials, (2) design, (3) fracture control, and (4) design verification. The materials portion deals with such subjects as material system design, material design levels, and material characterization. The design portion includes panel, shell, and joint design, applied loads, internal loads, design factors, reliability, and maintainability. Fracture control includes such items as stress concentrations, service-life philosophy, and the management plan for control of fracture-related aspects of structural design using composite materials. Design verification discusses ways to prove flightworthiness.

  10. Advances in design and modeling of porous materials

    Science.gov (United States)

    Ayral, André; Calas-Etienne, Sylvie; Coasne, Benoit; Deratani, André; Evstratov, Alexis; Galarneau, Anne; Grande, Daniel; Hureau, Matthieu; Jobic, Hervé; Morlay, Catherine; Parmentier, Julien; Prelot, Bénédicte; Rossignol, Sylvie; Simon-Masseron, Angélique; Thibault-Starzyk, Frédéric

    2015-07-01

    This special issue of the European Physical Journal Special Topics is dedicated to selected papers from the symposium "High surface area porous and granular materials" organized in the frame of the conference "Matériaux 2014", held on November 24-28, 2014 in Montpellier, France. Porous materials and granular materials gather a wide variety of heterogeneous, isotropic or anisotropic media made of inorganic, organic or hybrid solid skeletons, with open or closed porosity, and pore sizes ranging from the centimeter scale to the sub-nanometer scale. Their technological and industrial applications cover numerous areas from building and civil engineering to microelectronics, including also metallurgy, chemistry, health, waste water and gas effluent treatment. Many emerging processes related to environmental protection and sustainable development also rely on this class of materials. Their functional properties are related to specific transfer mechanisms (matter, heat, radiation, electrical charge), to pore surface chemistry (exchange, adsorption, heterogeneous catalysis) and to retention inside confined volumes (storage, separation, exchange, controlled release). The development of innovative synthesis, shaping, characterization and modeling approaches enables the design of advanced materials with enhanced functional performance. The papers collected in this special issue offer a good overview of the state-of-the-art and science of these complex media. We would like to thank all the speakers and participants for their contribution to the success of the symposium. We also express our gratitude to the organization committee of "Matériaux 2014". We finally thank the reviewers and the staff of the European Physical Journal Special Topics who made the publication of this special issue possible.

  11. Modeling Materials: Design for Planetary Entry, Electric Aircraft, and Beyond

    Science.gov (United States)

    Thompson, Alexander; Lawson, John W.

    2014-01-01

    NASA missions push the limits of what is possible. The development of high-performance materials must keep pace with the agency's demanding, cutting-edge applications. Researchers at NASA's Ames Research Center are performing multiscale computational modeling to accelerate development times and further the design of next-generation aerospace materials. Multiscale modeling combines several computationally intensive techniques ranging from the atomic level to the macroscale, passing output from one level as input to the next level. These methods are applicable to a wide variety of materials systems. For example: (a) Ultra-high-temperature ceramics for hypersonic aircraft-we utilized the full range of multiscale modeling to characterize thermal protection materials for faster, safer air- and spacecraft, (b) Planetary entry heat shields for space vehicles-we computed thermal and mechanical properties of ablative composites by combining several methods, from atomistic simulations to macroscale computations, (c) Advanced batteries for electric aircraft-we performed large-scale molecular dynamics simulations of advanced electrolytes for ultra-high-energy capacity batteries to enable long-distance electric aircraft service; and (d) Shape-memory alloys for high-efficiency aircraft-we used high-fidelity electronic structure calculations to determine phase diagrams in shape-memory transformations. Advances in high-performance computing have been critical to the development of multiscale materials modeling. We used nearly one million processor hours on NASA's Pleiades supercomputer to characterize electrolytes with a fidelity that would be otherwise impossible. For this and other projects, Pleiades enables us to push the physics and accuracy of our calculations to new levels.

  12. From molecular design and materials construction to organic nanophotonic devices.

    Science.gov (United States)

    Zhang, Chuang; Yan, Yongli; Zhao, Yong Sheng; Yao, Jiannian

    2014-12-16

    CONSPECTUS: Nanophotonics has recently received broad research interest, since it may provide an alternative opportunity to overcome the fundamental limitations in electronic circuits. Diverse optical materials down to the wavelength scale are required to develop nanophotonic devices, including functional components for light emission, transmission, and detection. During the past decade, the chemists have made their own contributions to this interdisciplinary field, especially from the controlled fabrication of nanophotonic molecules and materials. In this context, organic micro- or nanocrystals have been developed as a very promising kind of building block in the construction of novel units for integrated nanophotonics, mainly due to the great versatility in organic molecular structures and their flexibility for the subsequent processing. Following the pioneering works on organic nanolasers and optical waveguides, the organic nanophotonic materials and devices have attracted increasing interest and developed rapidly during the past few years. In this Account, we review our research on the photonic performance of molecular micro- or nanostructures and the latest breakthroughs toward organic nanophotonic devices. Overall, the versatile features of organic materials are highlighted, because they brings tunable optical properties based on molecular design, size-dependent light confinement in low-dimensional structures, and various device geometries for nanophotonic integration. The molecular diversity enables abundant optical transitions in conjugated π-electron systems, and thus brings specific photonic functions into molecular aggregates. The morphology of these micro- or nanostructures can be further controlled based on the weak intermolecular interactions during molecular assembly process, making the aggregates show photon confinement or light guiding properties as nanophotonic materials. By adoption of some active processes in the composite of two or more

  13. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Directory of Open Access Journals (Sweden)

    Yee Mei Leong

    2016-06-01

    Full Text Available Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag content solder SAC105 (Sn-1.0Ag-0.5Cu because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al addition (0.1–0.5 wt.% to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

  14. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Science.gov (United States)

    Leong, Yee Mei; Haseeb, A.S.M.A.

    2016-01-01

    Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

  15. Computational design of surfaces, nanostructures and optoelectronic materials

    Science.gov (United States)

    Choudhary, Kamal

    Properties of engineering materials are generally influenced by defects such as point defects (vacancies, interstitials, substitutional defects), line defects (dislocations), planar defects (grain boundaries, free surfaces/nanostructures, interfaces, stacking faults) and volume defects (voids). Classical physics based molecular dynamics and quantum physics based density functional theory can be useful in designing materials with controlled defect properties. In this thesis, empirical potential based molecular dynamics was used to study the surface modification of polymers due to energetic polyatomic ion, thermodynamics and mechanics of metal-ceramic interfaces and nanostructures, while density functional theory was used to screen substituents in optoelectronic materials. Firstly, polyatomic ion-beams were deposited on polymer surfaces and the resulting chemical modifications of the surface were examined. In particular, S, SC and SH were deposited on amorphous polystyrene (PS), and C2H, CH3, and C3H5 were deposited on amorphous poly (methyl methacrylate) (PMMA) using molecular dynamics simulations with classical reactive empirical many-body (REBO) potentials. The objective of this work was to elucidate the mechanisms by which the polymer surface modification took place. The results of the work could be used in tailoring the incident energy and/or constituents of ion beam for obtaining a particular chemistry inside the polymer surface. Secondly, a new Al-O-N empirical potential was developed within the charge optimized many body (COMB) formalism. This potential was then used to examine the thermodynamic stability of interfaces and mechanical properties of nanostructures composed of aluminum, its oxide and its nitride. The potentials were tested for these materials based on surface energies, defect energies, bulk phase stability, the mechanical properties of the most stable bulk phase, its phonon properties as well as with a genetic algorithm based evolution theory of

  16. New Coating Technique of Ceramic Implants with Different Glass Solder Matrices for Improved Osseointegration-Mechanical Investigations.

    Science.gov (United States)

    Mick, Enrico; Markhoff, Jana; Mitrovic, Aurica; Jonitz, Anika; Bader, Rainer

    2013-09-11

    Ceramics are a very popular material in dental implant technology due to their tribological properties, their biocompatibility and their esthetic appearance. However, their natural surface structure lacks the ability of proper osseointegration, which constitutes a crucial process for the stability and, thus, the functionality of a bone implant. We investigated the application of a glass solder matrix in three configurations-consisting mainly of SiO₂, Al₂O₃, K₂O and Na₂O to TZP-A ceramic specimens. The corresponding adhesive strength and surface roughness of the coatings on ceramic specimens have been analyzed. Thereby, high adhesive strength (70.3 ± 7.9 MPa) was found for the three different coatings. The obtained roughness (R z ) amounted to 18.24 ± 2.48 µm in average, with significant differences between the glass solder configurations. Furthermore, one configuration was also tested after additional etching which did not lead to significant increase of surface roughness (19.37 ± 1.04 µm) or adhesive strength (57.2 ± 5.8 MPa). In conclusion, coating with glass solder matrix seems to be a promising surface modification technique that may enable direct insertion of ceramic implants in dental and orthopaedic surgery.

  17. New Coating Technique of Ceramic Implants with Different Glass Solder Matrices for Improved Osseointegration-Mechanical Investigations

    Directory of Open Access Journals (Sweden)

    Rainer Bader

    2013-09-01

    Full Text Available Ceramics are a very popular material in dental implant technology due to their tribological properties, their biocompatibility and their esthetic appearance. However, their natural surface structure lacks the ability of proper osseointegration, which constitutes a crucial process for the stability and, thus, the functionality of a bone implant. We investigated the application of a glass solder matrix in three configurations—consisting mainly of SiO2, Al2O3, K2O and Na2O to TZP-A ceramic specimens. The corresponding adhesive strength and surface roughness of the coatings on ceramic specimens have been analyzed. Thereby, high adhesive strength (70.3 ± 7.9 MPa was found for the three different coatings. The obtained roughness (Rz amounted to 18.24 ± 2.48 µm in average, with significant differences between the glass solder configurations. Furthermore, one configuration was also tested after additional etching which did not lead to significant increase of surface roughness (19.37 ± 1.04 µm or adhesive strength (57.2 ± 5.8 MPa. In conclusion, coating with glass solder matrix seems to be a promising surface modification technique that may enable direct insertion of ceramic implants in dental and orthopaedic surgery.

  18. Behavior of Sn-0.7Cu-xZn lead free solder on physical properties and micro structure

    Science.gov (United States)

    Siahaan, Erwin

    2017-09-01

    The issues to substitute Tin-Lead Solders is concerning the health and environmental hazards that is caused by lead, and also legislative actions around the world regarding lead toxicity, which has prompted the research community to attempt to replace solder alloys for the traditional Sn-Pb alloys lead which has been used by industrial worker throughout history because it is easily extracted and refined at a relatively low energy cost and also has a range of useful properties. Traditional industry lead has been used in soldering materials for electronic applications because it has low melting point and a soft, malleable nature, when combined with tin at the eutectic composition which causes the alloy to flow easily in the liquid state and solidifies over a very small range of temperature. One of the potential candidate to replace tin-lead solder is Sn-Cu-Zn eutectic alloy as it has a lower melting temperature. Consequently, it is of interest to determine what reactions can occur in ternary systems derived from the Sn-Cu-Zn eutectic. One such system is Sn-0.7Cu-xZn. The specimen was elaborated on physical properties. The chemical content was analyzed by using Shimadzu XRD and melting point was analyzed by using Differential Scanning Calorimeter ( DSC ). The results has shown that the highest addition of Zinc content (15%Zn) will decrease the melting temperatur to 189°C compared to Sn-Pb at 183°C Increasing the amount of Zn on Sn0.7Cu-xZn alloys will decrease Cu3Sn intermetallic coumpound.

  19. Ferroelectric materials for piezoelectric actuators by optimal design

    International Nuclear Information System (INIS)

    Jayachandran, K.P.; Guedes, J.M.; Rodrigues, H.C.

    2011-01-01

    Research highlights: → Microstructure optimization of ferroelectric materials by stochastic optimization. → Polycrystalline ferroelectrics possess better piezo actuation than single crystals. → Randomness of the grain orientations would enhance the overall piezoelectricity. - Abstract: Optimization methods provide a systematic means of designing heterogeneous materials with tailored properties and microstructures focussing on a specific objective. An optimization procedure incorporating a continuum modeling is used in this work to identify the ideal orientation distribution of ferroelectrics (FEs) for application in piezoelectric actuators. Piezoelectric actuation is dictated primarily by the piezoelectric strain coefficients d iμ . Crystallographic orientation is inextricably related to the piezoelectric properties of FEs. This suggests that piezoelectric properties can be tailored by a proper choice of the parameters which control the orientation distribution. Nevertheless, this choice is complicated and it is impossible to analyze all possible combinations of the distribution parameters or the angles themselves. Stochastic optimization combined with a generalized Monte Carlo scheme is used to optimize the objective functions, the effective piezoelectric coefficients d 31 and d 15 . The procedure is applied to heterogeneous, polycrystalline, FE ceramics which are essentially an aggregate of variously oriented grains (crystallites). Global piezoelectric properties are calculated using the homogenization method at each grain configuration chosen by the optimization algorithm. Optimal design variables and microstructure that would generate polycrystalline configurations that multiply the macroscopic piezoelectricity are identified.

  20. Micro-/nanostructured multicomponent molecular materials: design, assembly, and functionality.

    Science.gov (United States)

    Yan, Dongpeng

    2015-03-23

    Molecule-based micro-/nanomaterials have attracted considerable attention because their properties can vary greatly from the corresponding macro-sized bulk systems. Recently, the construction of multicomponent molecular solids based on crystal engineering principles has emerged as a promising alternative way to develop micro-/nanomaterials. Unlike single-component materials, the resulting multicomponent systems offer the advantages of tunable composition, and adjustable molecular arrangement, and intermolecular interactions within their solid states. The study of these materials also supplies insight into how the crystal structure, molecular components, and micro-/nanoscale effects can influence the performance of molecular materials. In this review, we describe recent advances and current directions in the assembly and applications of crystalline multicomponent micro-/nanostructures. Firstly, the design strategies for multicomponent systems based on molecular recognition and crystal engineering principles are introduced. Attention is then focused on the methods of fabrication of low-dimensional multicomponent micro-/nanostructures. Their new applications are also outlined. Finally, we briefly discuss perspectives for the further development of these molecular crystalline micro-/nanomaterials. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  1. Materials and design concepts for space-resilient structures

    Science.gov (United States)

    Naser, Mohannad Z.; Chehab, Alaa I.

    2018-04-01

    Space exploration and terraforming nearby planets have been fascinating concepts for the longest time. Nowadays, that technological advancements with regard to space exploration are thriving, it is only a matter of time before humans can start colonizing nearby moons and planets. This paper presents a state-of-the-art literature review on recent developments of "space-native" construction materials, and highlights evolutionary design concepts for "space-resilient" structures (i.e., colonies and habitats). This paper also details effects of harsh (and unique) space environments on various terrestrial and extraterrestrial construction materials, as well as on space infrastructure and structural systems. The feasibility of exploiting available space resources in terms of "in-situ resource utilization" and "harvesting of elements and compounds", as well as emergence of enabling technologies such as "cultured (lab-grown)" space construction materials are discussed. Towards the end of the present review, number of limitations and challenges facing Lunar and Martian exploration, and venues in-need for urgent research are identified and examined.

  2. Design of multi materials combining crystalline and amorphous metallic alloys

    International Nuclear Information System (INIS)

    Volland, A.; Ragani, J.; Liu, Y.; Gravier, S.; Suéry, M.; Blandin, J.J.

    2012-01-01

    Highlights: ► Elaboration of multi materials associating metallic glasses and conventional crystalline alloys by co-deformation performed at temperatures close to the glass transition temperature of the metallic glasses. ► Elaboration of filamentary metal matrix composites with a core in metallic glass by co extrusion. ► Sandwich structures produced by co-pressing. ► Detection of atomic diffusion from the glass to the crystalline alloys during the processes. ► Good interfaces between the metallic glasses and the crystalline alloys, as confirmed by mechanical characterisation. - Abstract: Multi materials, associating zirconium based bulk metallic glasses and crystalline metallic alloys like magnesium alloys or copper are elaborated by co-deformation processing performed in the supercooled liquid regions (SLR) of the bulk metallic glasses. Two processes are investigated: co-extrusion and co-pressing. In the first case, filamentary composites with various designs can be produced whereas in the second case sandwich structures are obtained. The experimental window (temperature, time) in which processing can be carried out is directly related to the crystallisation resistance of the glass which requires getting information about the crystallisation conditions in the selected metallic glasses. Thermoforming windows are identified for the studied BMGs by thermal analysis and compression tests in their SLR. The mechanical properties of the produced multi materials are investigated thanks to specifically developed mechanical devices and the interfaces between the amorphous and the crystalline alloys are characterised.

  3. Nonlinear machine learning in soft materials engineering and design

    Science.gov (United States)

    Ferguson, Andrew

    The inherently many-body nature of molecular folding and colloidal self-assembly makes it challenging to identify the underlying collective mechanisms and pathways governing system behavior, and has hindered rational design of soft materials with desired structure and function. Fundamentally, there exists a predictive gulf between the architecture and chemistry of individual molecules or colloids and the collective many-body thermodynamics and kinetics. Integrating machine learning techniques with statistical thermodynamics provides a means to bridge this divide and identify emergent folding pathways and self-assembly mechanisms from computer simulations or experimental particle tracking data. We will survey a few of our applications of this framework that illustrate the value of nonlinear machine learning in understanding and engineering soft materials: the non-equilibrium self-assembly of Janus colloids into pinwheels, clusters, and archipelagos; engineering reconfigurable ''digital colloids'' as a novel high-density information storage substrate; probing hierarchically self-assembling onjugated asphaltenes in crude oil; and determining macromolecular folding funnels from measurements of single experimental observables. We close with an outlook on the future of machine learning in soft materials engineering, and share some personal perspectives on working at this disciplinary intersection. We acknowledge support for this work from a National Science Foundation CAREER Award (Grant No. DMR-1350008) and the Donors of the American Chemical Society Petroleum Research Fund (ACS PRF #54240-DNI6).

  4. Materials for Consideration in Standardized Canister Design Activities.

    Energy Technology Data Exchange (ETDEWEB)

    Bryan, Charles R.; Ilgen, Anastasia Gennadyevna; Enos, David George; Teich-McGoldrick, Stephanie; Hardin, Ernest

    2014-10-01

    This document identifies materials and material mitigation processes that might be used in new designs for standardized canisters for storage, transportation, and disposal of spent nuclear fuel. It also addresses potential corrosion issues with existing dual-purpose canisters (DPCs) that could be addressed in new canister designs. The major potential corrosion risk during storage is stress corrosion cracking of the weld regions on the 304 SS/316 SS canister shell due to deliquescence of chloride salts on the surface. Two approaches are proposed to alleviate this potential risk. First, the existing canister materials (304 and 316 SS) could be used, but the welds mitigated to relieve residual stresses and/or sensitization. Alternatively, more corrosion-resistant steels such as super-austenitic or duplex stainless steels, could be used. Experimental testing is needed to verify that these alternatives would successfully reduce the risk of stress corrosion cracking during fuel storage. For disposal in a geologic repository, the canister will be enclosed in a corrosion-resistant or corrosion-allowance overpack that will provide barrier capability and mechanical strength. The canister shell will no longer have a barrier function and its containment integrity can be ignored. The basket and neutron absorbers within the canister have the important role of limiting the possibility of post-closure criticality. The time period for corrosion is much longer in the post-closure period, and one major unanswered question is whether the basket materials will corrode slowly enough to maintain structural integrity for at least 10,000 years. Whereas there is extensive literature on stainless steels, this evaluation recommends testing of 304 and 316 SS, and more corrosion-resistant steels such as super-austenitic, duplex, and super-duplex stainless steels, at repository-relevant physical and chemical conditions. Both general and localized corrosion testing methods would be used to

  5. Effects of soldering methods on tensile strength of a gold-palladium metal ceramic alloy.

    Science.gov (United States)

    Ghadhanfari, Husain A; Khajah, Hasan M; Monaco, Edward A; Kim, Hyeongil

    2014-10-01

    The tensile strength obtained by conventional postceramic application soldering and laser postceramic welding may require more energy than microwave postceramic soldering, which could provide similar tensile strength values. The purpose of the study was to compare the tensile strength obtained by microwave postceramic soldering, conventional postceramic soldering, and laser postceramic welding. A gold-palladium metal ceramic alloy and gold-based solder were used in this study. Twenty-seven wax specimens were cast in gold-palladium noble metal and divided into 4 groups: laser welding with a specific postfiller noble metal, microwave soldering with a postceramic solder, conventional soldering with the same postceramic solder used in the microwave soldering group, and a nonsectioned control group. All the specimens were heat treated to simulate a normal porcelain sintering sequence. An Instron Universal Testing Machine was used to measure the tensile strength for the 4 groups. The means were analyzed statistically with 1-way ANOVA. The surface and fracture sites of the specimens were subjectively evaluated for fracture type and porosities by using a scanning electron microscope. The mean (standard deviation) ultimate tensile strength values were as follows: nonsectioned control 818 ±30 MPa, microwave 516 ±34 MPa, conventional 454 ±37 MPa, and laser weld 191 ±39 MPa. A 1-way ANOVA showed a significant difference in ultimate tensile strength among the groups (F3,23=334.5; Ptensile strength for gold and palladium noble metals than either conventional soldering or laser welding. Conventional soldering resulted in a higher tensile strength than laser welding. Under the experimental conditions described, either microwave or conventional postceramic soldering would appear to satisfy clinical requirements related to tensile strength. Copyright © 2014 Editorial Council for the Journal of Prosthetic Dentistry. Published by Elsevier Inc. All rights reserved.

  6. Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

    Science.gov (United States)

    Haseeb, A. S. M. A.; Arafat, M. M.; Tay, S. L.; Leong, Y. M.

    2017-10-01

    Tin (Sn)-based solders have established themselves as the main alternative to the traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn-based solders continues to be a concern. In order to make Sn-based solders microstructurally more stable and hence more reliable, researchers are showing great interest in investigating the effects of the incorporation of different nanoparticles into them. This paper gives an overview of the influence of metallic nanoparticles on the characteristics of interfacial intermetallic compounds (IMCs) in Sn-based solder joints on copper substrates during reflow and thermal aging. Nanocomposite solders were prepared by mechanically blending nanoparticles of nickel (Ni), cobalt (Co), zinc (Zn), molybdenum (Mo), manganese (Mn) and titanium (Ti) with Sn-3.8Ag-0.7Cu and Sn-3.5Ag solder pastes. The composite solders were then reflowed and their wetting characteristics and interfacial microstructural evolution were investigated. Through the paste mixing route, Ni, Co, Zn and Mo nanoparticles alter the morphology and thickness of the IMCs in beneficial ways for the performance of solder joints. The thickness of Cu3Sn IMC is decreased with the addition of Ni, Co and Zn nanoparticles. The thickness of total IMC layer is decreased with the addition of Zn and Mo nanoparticles in the solder. The metallic nanoparticles can be divided into two groups. Ni, Co, and Zn nanoparticles undergo reactive dissolution during solder reflow, causing in situ alloying and therefore offering an alternative route of alloy additions to solders. Mo nanoparticles remain intact during reflow and impart their influence as discrete particles. Mechanisms of interactions between different types of metallic nanoparticles and solder are discussed.

  7. Harvesting bioenergy with rationally designed complex functional materials

    Science.gov (United States)

    Kuang, Liangju

    A key challenge in renewable energy is to capture, convert and store solar power with earth-abundant materials and environmentally benign technologies. The goal of this thesis is to develop rationally designed complex functional materials for bio-renewable energy applications. On one hand, photoconversion membrane proteins (MPs) are nature's nanoengineering feats for renewable energy management. Harnessing their functions in synthetic systems could help understand, predict, and ultimately control matter and energy at the nanoscale. This is particularly enticing in the post-genome era as recombinant or cell-free expression of many MPs with high yields becomes possible. However, the labile nature of lipid bilayers renders them unsuitable for use in a broad range of engineered systems. A knowledge gap exists about how to design robust synthetic nanomembranes as lipid-bilayer-mimics to support MP functions and how to direct hierarchical MP reconstitution into those membranes to form 2-D or 3-D ordered proteomembrane arrays. Our studies on proteorhodopsin (PR) and bacterial reaction center (BRC), the two light-harvesting MPs, reveal that a charge-interaction-directed reconstitution (CIDR) mechanism induces spontaneous reconstitution of detergent-solubilized MPs into various amphiphilic block copolymer membranes, many of which have far superior stability than lipid bilayers. Our preliminary data also suggest MPs are not enslaved by the biological membranes they derive from; rather, the chemically nonspecific material properties of MP-supporting membranes may act as allosteric regulators. Versatile chemical designs are possible to modulate the conformational energetics of MPs, hence their transport performance in synthetic systems. On the other hand, microalgae are widely regarded as a sustainable feedstock for biofuel production. Microalgae-derived biofuels have not been commercialized yet because current technologies for microalgae dewatering add a huge cost to the

  8. Process design of press hardening with gradient material property influence

    International Nuclear Information System (INIS)

    Neugebauer, R.; Schieck, F.; Rautenstrauch, A.

    2011-01-01

    Press hardening is currently used in the production of automotive structures that require very high strength and controlled deformation during crash tests. Press hardening can achieve significant reductions of sheet thickness at constant strength and is therefore a promising technology for the production of lightweight and energy-efficient automobiles. The manganese-boron steel 22MnB5 have been implemented in sheet press hardening owing to their excellent hot formability, high hardenability, and good temperability even at low cooling rates. However, press-hardened components have shown poor ductility and cracking at relatively small strains. A possible solution to this problem is a selective increase of steel sheet ductility by press hardening process design in areas where the component is required to deform plastically during crash tests. To this end, process designers require information about microstructure and mechanical properties as a function of the wide spectrum of cooling rates and sequences and austenitizing treatment conditions that can be encountered in production environments. In the present work, a Continuous Cooling Transformation (CCT) diagram with corresponding material properties of sheet steel 22MnB5 was determined for a wide spectrum of cooling rates. Heating and cooling programs were conducted in a quenching dilatometer. Motivated by the importance of residual elasticity in crash test performance, this property was measured using a micro-bending test and the results were integrated into the CCT diagrams to complement the hardness testing results. This information is essential for the process design of press hardening of sheet components with gradient material properties.

  9. RF structure design of the China Material Irradiation Facility RFQ

    Science.gov (United States)

    Li, Chenxing; He, Yuan; Xu, Xianbo; Zhang, Zhouli; Wang, Fengfeng; Dou, Weiping; Wang, Zhijun; Wang, Tieshan

    2017-10-01

    The radio frequency structure design of the radio frequency quadrupole (RFQ) for the front end of China Material Irradiation Facility (CMIF), which is an accelerator based neutron irradiation facility for fusion reactor material qualification, has been completed. The RFQ is specified to accelerate 10 mA continuous deuteron beams from the energies of 20 keV/u to 1.5 MeV/u within the vane length of 5250 mm. The working frequency of the RFQ is selected to 162.5 MHz and the inter-vane voltage is set to 65 kV. Four-vane cavity type is selected and the cavity structure is designed drawing on the experience of China Initiative Accelerator Driven System (CIADS) Injector II RFQ. In order to reduce the azimuthal asymmetry of the field caused from errors in fabrication and assembly, a frequency separation between the working mode and its nearest dipole mode is reached to 17.66 MHz by utilizing 20 pairs of π-mode stabilizing loops (PISLs) distributed along the longitudinal direction with equal intervals. For the purpose of tuning, 100 slug tuners were introduced to compensate the errors caused by machining and assembly. In order to obtain a homogeneous electrical field distribution along cavity, vane cutbacks are introduced and output endplate is modified. Multi-physics study of the cavity with radio frequency power and water cooling is performed to obtain the water temperature tuning coefficients. Through comparing to the worldwide CW RFQs, it is indicated that the power density of the designed structure is moderate for operation under continuous wave (CW) mode.

  10. "Intelligent" design of molecular materials: Understanding the concepts of design in supramolecular synthesis of network solids

    Science.gov (United States)

    Moulton, Brian D.

    This work endeavors to delineate modern paradigms for crystal engineering, i.e. the design and supramolecular synthesis of functional molecular materials. Paradigms predicated on an understanding of the geometry of polygons and polyhedra are developed. The primary focus is on structural determination by single crystal X-ray crystallography, structural interpretation using a suite of graphical visualization and molecular modeling software, and on the importance of proper graphical representation in the presentation and explanation of crystal structures. A detailed analysis of a selected series of crystal structures is presented. The reduction of these molecular networks to schematic representations that illustrate their fundamental connectivity facilitates the understanding of otherwise complex supramolecular solids. Circuit symbols and Schlafli notation are used to describe the network topologies, which enables networks of different composition and metrics to be easily compared. This reveals that molecular orientations in the crystals and networks are commensurate with networks that can be derived from spherical close packed lattices. The development of a logical design strategy for a new class of materials based on our understanding of the chemical composition and topology of these networks is described. The synthesis and crystal structure of a series of new materials generated by exploitation of this design strategy is presented, in addition to a detailed analysis of the topology of these materials and their relationship to a 'parent' structure. In summary, this dissertation demonstrates that molecular polygons can self-assemble at their vertexes to produce molecular architectures and crystal structures that are consistent with long established geometric dogma. The design strategy represents a potentially broad ranging approach to the design of nanoporous structures from a wide range of chemical components that are based on molecular shape rather than chemical

  11. Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

    Science.gov (United States)

    Huang, Chien-Sheng; Jang, Guh-Yaw; Duh, Jenq-Gong

    2004-04-01

    Nickel-based under bump metallization (UBM) has been widely used as a diffusion barrier to prevent the rapid reaction between the Cu conductor and Sn-based solders. In this study, joints with and without solder after heat treatments were employed to evaluate the diffusion behavior of Cu in the 63Sn-37Pb/Ni/Cu/Ti/Si3N4/Si multilayer structure. The atomic flux of Cu diffused through Ni was evaluated from the concentration profiles of Cu in solder joints. During reflow, the atomic flux of Cu was on the order of 1015-1016 atoms/cm2s. However, in the assembly without solder, no Cu was detected on the surface of Ni even after ten cycles of reflow. The diffusion behavior of Cu during heat treatments was studied, and the soldering-process-induced Cu diffusion through Ni metallization was characterized. In addition, the effect of Cu content in the solder near the solder/intermetallic compound (IMC) interface on interfacial reactions between the solder and the Ni/Cu UBM was also discussed. It is evident that the (Cu,Ni)6Sn5 IMC might form as the concentration of Cu in the Sn-Cu-Ni alloy exceeds 0.6 wt.%.

  12. Covalent Organic Frameworks: From Materials Design to Biomedical Application

    Directory of Open Access Journals (Sweden)

    Fuli Zhao

    2017-12-01

    Full Text Available Covalent organic frameworks (COFs are newly emerged crystalline porous polymers with well-defined skeletons and nanopores mainly consisted of light-weight elements (H, B, C, N and O linked by dynamic covalent bonds. Compared with conventional materials, COFs possess some unique and attractive features, such as large surface area, pre-designable pore geometry, excellent crystallinity, inherent adaptability and high flexibility in structural and functional design, thus exhibiting great potential for various applications. Especially, their large surface area and tunable porosity and π conjugation with unique photoelectric properties will enable COFs to serve as a promising platform for drug delivery, bioimaging, biosensing and theranostic applications. In this review, we trace the evolution of COFs in terms of linkages and highlight the important issues on synthetic method, structural design, morphological control and functionalization. And then we summarize the recent advances of COFs in the biomedical and pharmaceutical sectors and conclude with a discussion of the challenges and opportunities of COFs for biomedical purposes. Although currently still at its infancy stage, COFs as an innovative source have paved a new way to meet future challenges in human healthcare and disease theranostic.

  13. Materials modelling - a possible design tool for advanced nuclear applications

    International Nuclear Information System (INIS)

    Hoffelner, W.; Samaras, M.; Bako, B.; Iglesias, R.

    2008-01-01

    The design of components for power plants is usually based on codes, standards and design rules or code cases. However, it is very difficult to get the necessary experimental data to prove these lifetime assessment procedures for long-term applications in environments where complex damage interactions (temperature, stress, environment, irradiation) can occur. The rules used are often very simple and do not have a basis which take physical damage into consideration. The linear life fraction rule for creep and fatigue interaction can be taken as a prominent example. Materials modelling based on a multi-scale approach in principle provides a tool to convert microstructural findings into mechanical response and therefore has the capability of providing a set of tools for the improvement of design life assessments. The strength of current multi-scale modelling efforts is the insight they offer as regards experimental phenomena. To obtain an understanding of these phenomena it is import to focus on issues which are important at the various time and length scales of the modelling code. In this presentation the multi-scale path will be demonstrated with a few recent examples which focus on VHTR applications. (authors)

  14. Design-based modeling of magnetically actuated soft diaphragm materials

    Science.gov (United States)

    Jayaneththi, V. R.; Aw, K. C.; McDaid, A. J.

    2018-04-01

    Magnetic polymer composites (MPC) have shown promise for emerging biomedical applications such as lab-on-a-chip and implantable drug delivery. These soft material actuators are capable of fast response, large deformation and wireless actuation. Existing MPC modeling approaches are computationally expensive and unsuitable for rapid design prototyping and real-time control applications. This paper proposes a macro-scale 1-DOF model capable of predicting force and displacement of an MPC diaphragm actuator. Model validation confirmed both blocked force and displacement can be accurately predicted in a variety of working conditions i.e. different magnetic field strengths, static/dynamic fields, and gap distances. The contribution of this work includes a comprehensive experimental investigation of a macro-scale diaphragm actuator; the derivation and validation of a new phenomenological model to describe MPC actuation; and insights into the proposed model’s design-based functionality i.e. scalability and generalizability in terms of magnetic filler concentration and diaphragm diameter. Due to the lumped element modeling approach, the proposed model can also be adapted to alternative actuator configurations, and thus presents a useful tool for design, control and simulation of novel MPC applications.

  15. Electromigration-induced cracks in Cu/Sn3.5Ag/Cu solder reaction couple at room temperature

    International Nuclear Information System (INIS)

    He Hongwen; Xu Guangchen; Guo Fu

    2009-01-01

    Electromigration (EM) behavior of Cu/Sn 3.5 Ag/Cu solder reaction couple was investigated with a high current density of 5 x 10 3 A/cm 2 at room temperature. One dimensional structure, copper wire/solder ball/copper wire SRC was designed and fabricated to dissipate the Joule heating induced by the current flow. In addition, thermomigration effect was excluded due to the symmetrical structure of the SRC. The experimental results indicated that micro-cracks initially appeared near the cathode interface between solder matrix and copper substrate after 474 h current stressing. With current stressing time increased, the cracks propagated and extended along the cathode interface. It should be noted that the continuous Cu 6 Sn 5 intermetallic compounds (IMCs) layer both at the anode and at the cathode remained their sizes. Interestingly, tiny cracks appeared at the root of some long column-type Cu 6 Sn 5 at the cathode interface due to the thermal stress.

  16. Economical surface treatment of die casting dies to prevent soldering in high pressure casting

    International Nuclear Information System (INIS)

    Fraser, D.T.; Jahedi, M.Z.

    2001-01-01

    This paper describes the use of a gas oxidation treatment of H13 tool steel to develop a compact iron oxide layer at the surface of core pins to prevent soldering in high pressure die casting. The performance of oxide layers in the protection of die steel against soldering during high pressure die casting was tested in a specially designed die using removable core pins and Al-11 Si-3 Cu casting alloy. The gas oxidation treatment can be applied at low temperatures and to large areas of the die surface. In addition this process is very cost effective compared to other coating processes such as physical vapour deposition (PVD), or thermo-reactive diffusion (TRD) coatings. This work demonstrated that surface treatment producing pure magnetite (Fe 3 O 4 ) layers are more protective than oxide layers containing a combination of Fe 3 O 4 (magnetite) and Fe 3 O 3 (haematite). The magnetite layer acts as a barrier between the die steel/casting alloy interface and prevents the formation of inter-metallic phases. Optical microscopy and scanning electron microscope were used to determine the thickness of the oxide layer, while X-ray diffraction was performed to determine the oxide phase structure

  17. Effect of nano Co reinforcements on the structure of the Sn-3.0Ag-0.5Cu solder in liquid and after reflow solid states

    Energy Technology Data Exchange (ETDEWEB)

    Yakymovych, Andriy, E-mail: yakymovych@univie.ac.at [Department of Inorganic Chemistry – Functional Materials, University of Vienna, Währinger Str. 42, 1090 Vienna (Austria); Department of Metal Physics, Ivan Franko National University of Lviv, Kyrylo i Mephodiy Str. 8, 79005 Lviv (Ukraine); Mudry, Stepan; Shtablavyi, Ihor [Department of Metal Physics, Ivan Franko National University of Lviv, Kyrylo i Mephodiy Str. 8, 79005 Lviv (Ukraine); Ipser, Herbert [Department of Inorganic Chemistry – Functional Materials, University of Vienna, Währinger Str. 42, 1090 Vienna (Austria)

    2016-09-15

    Sn-Ag-Cu (SAC) alloys are commonly recognized as lead-free solders employed in the electronics industry. However, some disadvantages in mechanical properties and their higher melting temperatures compared to Pb-Sn solders prompt new research relating to reinforcement of existing SAC solders. One of the ways to reinforce these solder materials is the formation of composites with nanoparticles as filler materials. Accordingly, this study presents structural features of nanocomposite (Sn-3.0Ag-0.5Cu){sub 100−x}(nanoCo){sub x} solders with up to 0.8 wt% nano Co. The effect of nano-sized Co particles was investigated by means of differential thermal analysis (DTA), X-ray diffraction (XRD) in both liquid and solid states, and scanning electron microscopy (SEM). The experimental data of DTA are compared with available literature data for bulk Sn-3.0Ag-0.5Cu alloy to check the capability of minor nano-inclusions to decrease the melting temperature of the SAC solder. The combination of structural data in liquid and solid states provides important information about the structural transformations of liquid Sn-3.0Ag-0.5Cu alloys caused by minor Co additions and the phase formation during crystallization. Furthermore, scanning electron microscopy has shown the mutual substitution of Co and Cu atoms in the Cu{sub 6}Sn{sub 5} and CoSn{sub 3} phases, respectively. - Highlights: • Differential thermal analysis of nanocomposite (Sn-3.0Ag-0.5Cu){sub 100−x}(nanoCo){sub x} alloys. • Structural transformations of liquid Sn-3.0Ag-0.5Cu solder by minor Co additions. • Structure data of the solid quaternary (Sn-3.0Ag-0.5Cu){sub 100−x}(Co){sub x} alloys. • Substitution of Co and Cu atoms in the Cu{sub 6}Sn{sub 5} and CoSn{sub 3} phases.

  18. Combining theory and experiment in electrocatalysis: Insights into materials design

    International Nuclear Information System (INIS)

    Seh, Zhi Wei; Kibsgaard, Jakob

    2017-01-01

    Electrocatalysis plays a central role in clean energy conversion, enabling a number of sustainable processes for future technologies. This review discusses design strategies for state-of-the-art heterogeneous electrocatalysts and associated materials for several different electrochemical transformations involving water, hydrogen, and oxygen, using theory as a means to rationalize catalyst performance. By examining the common principles that govern catalysis for different electrochemical reactions, we describe a systematic framework that clarifies trends in catalyzing these reactions, serving as a guide to new catalyst development while highlighting key gaps that need to be addressed. Here, we conclude by extending this framework to emerging clean energy reactions such as hydrogen peroxide production, carbon dioxide reduction, and nitrogen reduction, where the development of improved catalysts could allow for the sustainable production of a broad range of fuels and chemicals.

  19. Emerging Semitransparent Solar Cells: Materials and Device Design.

    Science.gov (United States)

    Tai, Qidong; Yan, Feng

    2017-09-01

    Semitransparent solar cells can provide not only efficient power-generation but also appealing images and show promising applications in building integrated photovoltaics, wearable electronics, photovoltaic vehicles and so forth in the future. Such devices have been successfully realized by incorporating transparent electrodes in new generation low-cost solar cells, including organic solar cells (OSCs), dye-sensitized solar cells (DSCs) and organometal halide perovskite solar cells (PSCs). In this review, the advances in the preparation of semitransparent OSCs, DSCs, and PSCs are summarized, focusing on the top transparent electrode materials and device designs, which are all crucial to the performance of these devices. Techniques for optimizing the efficiency, color and transparency of the devices are addressed in detail. Finally, a summary of the research field and an outlook into the future development in this area are provided. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  20. Designing magnetic composite materials using aqueous magnetic fluids

    CERN Document Server

    Galicia, J A; Cousin, F; Guemghar, D; Menager, C; Cabuil, V

    2003-01-01

    In this paper, we report on how to take advantage of good knowledge of both the chemistry and the stability of an aqueous magnetic colloidal suspension to realize different magnetic composites. The osmotic pressure of the magnetic nanoparticles is set prior to the realization of the composite to a given value specially designed for the purpose for each hybrid material: magnetic particles in polymer networks, particles as probes for studying the structure of clay suspensions and shape modification of giant liposomes. First, we show that the introduction of magnetic particles in polyacrylamide gels enhances their Young modulus and reduces the swelling caused by water. The particles cause both a mechanical and an osmotic effect. The latter is strongly dependent on the ionic strength and is attributed to an attraction between particles and the polymeric matrix. In the second part, we determine the microscopic structure of suspensions of laponite as a function of concentration, by combining SANS and magneto-optica...

  1. Additive manufacturing of metals the technology, materials, design and production

    CERN Document Server

    Yang, Li; Baughman, Brian; Godfrey, Donald; Medina, Francisco; Menon, Mamballykalathil; Wiener, Soeren

    2017-01-01

    This book offers a unique guide to the three-dimensional (3D) printing of metals. It covers various aspects of additive, subtractive, and joining processes used to form three-dimensional parts with applications ranging from prototyping to production. Examining a variety of manufacturing technologies and their ability to produce both prototypes and functional production-quality parts, the individual chapters address metal components and discuss some of the important research challenges associated with the use of these technologies. As well as exploring the latest technologies currently under development, the book features unique sections on electron beam melting technology, material lifting, and the importance this science has in the engineering context. Presenting unique real-life case studies from industry, this book is also the first to offer the perspective of engineers who work in the field of aerospace and transportation systems, and who design components and manufacturing networks. Written by the leadin...

  2. Accelerator conceptual design of the international fusion materials irradiation facility

    Energy Technology Data Exchange (ETDEWEB)

    Sugimoto, M.; Kinsho, M. [Japan Atomic Energy Res. Inst., Tokai, Ibaraki (Japan). Intense Neutron Source Lab.; Jameson, R.A.; Blind, B. [Los Alamos National Lab., NM (United States); Teplyakov, V. [Institute for High Energy Physics, Moscow (Russian Federation); Berwald, D.; Bruhwiler, D.; Peakock, M.; Rathke, J. [Northrop Grumman Corp., Bethpage, NY (United States); Deitinghoff, H.; Klein, H.; Pozimski, Y.; Volk, K. [Johann Wolfgang Goethe Univ., Frankfurt (Germany). Inst. fur Angewandte Phys.; Ferdinand, R.; Lagniel, J.-M. [CEA Saclay LNS, Gif-sur-Yvette (France); Miyahara, A. [Teikyo Univ., Tokyo (Japan); Olivier, M. [CEA DSM, Saclay, Gif-sur-Yvette (France); Piechowiak, E. [Northrop Grumman Corp., Baltimore, MD (United States); Tanabe, Y. [Toshiba Corp., Tsurumi-ku, Yokohama (Japan)

    1998-10-01

    The accelerator system of the international fusion materials irradiation facility (IFMIF) provides the 250-mA, 40-MeV continuous-wave deuteron beam at one of the two lithium target stations. It consists of two identical linear accelerator modules, each of which independently delivers a 125-mA beam to the common footprint of 20 cm x 5 cm at the target surface. The accelerator module consists of an ion injector, a 175 MHz RFQ and eight DTL tanks, and rf power supply system. The requirements for the accelerator system and the design concept are described. The interface issues and operational considerations to attain the proposed availability are also discussed. (orig.) 8 refs.

  3. Accelerator conceptual design of the international fusion materials irradiation facility

    International Nuclear Information System (INIS)

    Sugimoto, M.; Kinsho, M.; Teplyakov, V.; Berwald, D.; Bruhwiler, D.; Peakock, M.; Rathke, J.; Deitinghoff, H.; Klein, H.; Pozimski, Y.; Volk, K.; Miyahara, A.; Olivier, M.; Piechowiak, E.; Tanabe, Y.

    1998-01-01

    The accelerator system of the international fusion materials irradiation facility (IFMIF) provides the 250-mA, 40-MeV continuous-wave deuteron beam at one of the two lithium target stations. It consists of two identical linear accelerator modules, each of which independently delivers a 125-mA beam to the common footprint of 20 cm x 5 cm at the target surface. The accelerator module consists of an ion injector, a 175 MHz RFQ and eight DTL tanks, and rf power supply system. The requirements for the accelerator system and the design concept are described. The interface issues and operational considerations to attain the proposed availability are also discussed. (orig.)

  4. The metallurgical approach on the solder voids behaviour in surface mount devices

    International Nuclear Information System (INIS)

    Mohabattul Zaman Bukhari

    1996-01-01

    Solder voids are believed to cause poor heat dissiption in the Surface Mount devices and reduce the reliability of the devices at higher operating services. There are a lot of factors involved in creating voids such as gas/flux entrapment, wettability, outgasseous, air bubbles in the solder paste, inconsistency of solder coverage and improper metal scheme selection. This study was done to observe the behaviour of the solder voids in term of flux entrapmentt and wettability. It is believed that flux entrapment and wettability are verify this hypothesis. Two types of metal scheme were chosen which are Nickel (Ni) plated and Tin (Sn) plated heatsink. X-ray techniques such as Radiographic Inspection Analysis and EDAX were used to detect the minute solder voids. The solder voids observed on the heatsinks and Copper shims after the reflow process are believed to be a non contact voids that resulted from some portion of the surface not wetting properly

  5. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    Science.gov (United States)

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

    2010-09-15

    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  6. The design, construction and testing of packaging[Radioactive materials

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1976-07-01

    Essentially uniform regulations, based on the IAEA Regulations for the Safe Transport of Radioactive Materials, have been adopted on a world-wide basis with the aim of ensuring safety in the transport of radioactive and fissile substances by road, rail, sea and air. The application of these regulations over a period of almost 20 years has resulted in practically complete safety in the sense that there has been no evidence of death or injury that could be attributed to the special properties of the material even when consignments were involved in serious accidents. In the regulations, reliance is placed, to the greatest extent possible, on the packaging to provide adequate shielding and containment of the contents under both normal transport and accident conditions. The Agency organized an international seminar in 1971 to consider the performance tests that have to be applied to packaging to demonstrate compliance with the regulatory requirements. The general conclusion was that the testing programme specified in the regulations was adequate for the near future, but that further consideration should be given to assessing the risks presented by the increasing volume of transport. The second international seminar, which is the subject of this report, dealt with all aspects of the design, construction and testing of packaging for the transport both of relatively small quantities of radioactive substances, which are being used to an ever increasing extent for medical and research purposes, and of the much larger quantities arising in various stages of the nuclear fuel cycle. The programme covered the general requirements for packaging; risk assessment for the transport of various radioactive and fissile substances, including plutonium; specific features of the design and construction of packaging; quality assurance; damage simulation tests, including calculational methods and scale-model testing; tests for the retention of shielding and containment after damage; and the

  7. Mask Materials and Designs for Extreme Ultra Violet Lithography

    Science.gov (United States)

    Kim, Jung Sik; Ahn, Jinho

    2018-03-01

    Extreme ultra violet lithography (EUVL) is no longer a future technology but is going to be inserted into mass production of semiconductor devices of 7 nm technology node in 2018. EUVL is an extension of optical lithography using extremely short wavelength (13.5 nm). This short wavelength requires major modifications in the optical systems due to the very strong absorption of EUV light by materials. Refractive optics can no longer be used, and reflective optics is the only solution to transfer image from mask to wafer. This is why we need the multilayer (ML) mirror-based mask as well as an oblique incident angle of light. This paper discusses the principal theory on the EUV mask design and its component materials including ML reflector and EUV absorber. Mask shadowing effect (or mask 3D effect) is explained and its technical solutions like phase shift mask is reviewed. Even though not all the technical issues on EUV mask are handled in this review paper, you will be able to understand the principles determining the performance of EUV masks.

  8. Selected topics in special nuclear materials safeguard system design

    International Nuclear Information System (INIS)

    King, L.L.; Thatcher, C.D.; Clarke, J.D.; Rodriguez, M.P.

    1991-01-01

    During the past two decades the improvements in circuit integration have given rise to many new applications in digital processing technology by continuously reducing the unit cost of processing power. Along with this increase in processing power a corresponding decrease in circuit volume has been achieved. Progress has been so swift that new classes of applications become feasible every 2 or 3 years. This is especially true in the application of proven new technology to special nuclear materials (SNM) safeguard systems. Several areas of application were investigated in establishing the performance requirements for the SNM safeguard system. These included the improvements in material control and accountability and surveillance by using multiple sensors to continuously monitor SNM inventory within the selected value(s); establishing a system architecture to provide capabilities needed for present and future performance requirements; and limiting operating manpower exposure to radiation. This paper describes two selected topics in the application of state-of-the-art, well-proven technology to SNM safeguard system design

  9. Mechanical design of mussel byssus: material yield enhances attachment strength

    Science.gov (United States)

    Bell; Gosline

    1996-01-01

    The competitive dominance of mussels in the wave-swept rocky intertidal zone is in part due to their ability to maintain a secure attachment. Mussels are tethered to the substratum by a byssus composed of numerous extracellular, collagenous threads secreted by the foot. Each byssal thread has three serially arranged parts: a corrugated proximal region, a smooth distal region and an adhesive plaque. This study examines the material and structural properties of the byssal threads of three mussel species: Mytilus californianus, M. trossulus, and M. galloprovincialis. Tensile tests in general reveal similar material properties among species: the proximal region has a lower initial modulus, a lower ultimate stress and a higher ultimate strain than the distal region. The distal region also yields at a stress well below its ultimate value. In whole thread tests, the proximal region and adhesive plaque are common sites of structural failure and are closely matched in strength, while the distal region appears to be excessively strong. We propose that the high strength of the distal region is the byproduct of a material designed to yield and extend before structural failure occurs. Experimental and theoretical evidence is presented suggesting that thread yield and extensibility provide two important mechanisms for increasing the overall attachment strength of the mussel: (1) the reorientation of threads towards the direction of applied load, and (2) the 'recruitment' of more threads into tension and the consequent distribution of applied load over a larger cross-sectional area, thereby reducing the stress on each thread. This distal region yield behavior is most striking for M. californianus and may be a key to its success in extreme wave-swept environments.

  10. Electrochemical Behavior of Sn-9Zn- xTi Lead-Free Solders in Neutral 0.5M NaCl Solution

    Science.gov (United States)

    Wang, Zhenghong; Chen, Chuantong; Jiu, Jinting; Nagao, Shijo; Nogi, Masaya; Koga, Hirotaka; Zhang, Hao; Zhang, Gong; Suganuma, Katsuaki

    2018-05-01

    Electrochemical techniques were employed to study the electrochemical corrosion behavior of Sn-9Zn- xTi ( x = 0, 0.05, 0.1, 0.2 wt.%) lead-free solders in neutral 0.5M NaCl solution, aiming to figure out the effect of Ti content on the corrosion properties of Sn-9Zn, providing information for the composition design of Sn-Zn-based lead-free solders from the perspective of corrosion. EIS results reveal that Ti addition was involved in the corrosion product layer and changed electrochemical interface behavior from charge transfer control process to diffusion control process. The trace amount of Ti addition (0.05 wt.%) can refine the microstructure and improve the corrosion resistance of Sn-9Zn solder, evidenced by much lower corrosion current density ( i corr) and much higher total resistance ( R t). Excess Ti addition (over 0.1 wt.%) led to the formation of Ti-containing IMCs, which were confirmed as Sn3Ti2 and Sn5Ti6, deteriorating the corrosion resistance of Sn-9Zn- xTi solders. The main corrosion products were confirmed as Sn3O(OH)2Cl2 mixed with small amount of chlorine/oxide Sn compounds.

  11. Interfacial reaction of Sn-based solder joint in the package system

    Science.gov (United States)

    Gu, Huandi

    In this thesis, I report a study on the effect of the solder size on intermetallic layer formation by comparing the morphology change and growth rate of two different size solder joint aged at a same temperature for different aging time. The layer thickness and microstructure were analyzed using scanning electron microscopy (SEM). Photoshop was used to measure the thickness of intermetallic compound. Two different size of solder joints with composition of Sn-Ag-Cu (305) were used.

  12. Band Gap Optimization Design of Photonic Crystals Material

    Science.gov (United States)

    Yu, Y.; Yu, B.; Gao, X.

    2017-12-01

    The photonic crystal has a fundamental characteristic - photonic band gap, which can prevent light to spread in the crystals. This paper studies the width variation of band gaps of two-dimension square lattice photonic crystals by changing the geometrical shape of the unit cells’ inner medium column. Using the finite element method, we conduct numerical experiments on MATLAB 2012a and COMSOL 3.5. By shortening the radius in vertical axis and rotating the medium column, we design a new unit cell, with a 0.3*3.85e-7 vertical radius and a 15 degree deviation to the horizontal axis. The new cell has a gap 1.51 percent wider than the circle medium structure in TE gap and creates a 0.0124 wide TM gap. Besides, the experiment shows the first TM gap is partially overlapped by the second TE gap in gap pictures. This is helpful to format the absolute photonic band gaps and provides favorable theoretical basis for designing photonic communication material.

  13. Conceptual design report: Nuclear materials storage facility renovation. Part 1, Design concept. Part 2, Project management

    International Nuclear Information System (INIS)

    1995-01-01

    The Nuclear Materials Storage Facility (NMSF) at the Los Alamos National Laboratory (LANL) was a Fiscal Year (FY) 1984 line-item project completed in 1987 that has never been operated because of major design and construction deficiencies. This renovation project, which will correct those deficiencies and allow operation of the facility, is proposed as an FY 97 line item. The mission of the project is to provide centralized intermediate and long-term storage of special nuclear materials (SNM) associated with defined LANL programmatic missions and to establish a centralized SNM shipping and receiving location for Technical Area (TA)-55 at LANL. Based on current projections, existing storage space for SNM at other locations at LANL will be loaded to capacity by approximately 2002. This will adversely affect LANUs ability to meet its mission requirements in the future. The affected missions include LANL's weapons research, development, and testing (WRD ampersand T) program; special materials recovery; stockpile survelliance/evaluation; advanced fuels and heat sources development and production; and safe, secure storage of existing nuclear materials inventories. The problem is further exacerbated by LANL's inability to ship any materials offsite because of the lack of receiver sites for mate rial and regulatory issues. Correction of the current deficiencies and enhancement of the facility will provide centralized storage close to a nuclear materials processing facility. The project will enable long-term, cost-effective storage in a secure environment with reduced radiation exposure to workers, and eliminate potential exposures to the public. This document provides Part I - Design Concept which describes the selected solution, and Part II - Project Management which describes the management system organization, the elements that make up the system, and the control and reporting system

  14. Conceptual design report: Nuclear materials storage facility renovation. Part 1, Design concept. Part 2, Project management

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1995-07-14

    The Nuclear Materials Storage Facility (NMSF) at the Los Alamos National Laboratory (LANL) was a Fiscal Year (FY) 1984 line-item project completed in 1987 that has never been operated because of major design and construction deficiencies. This renovation project, which will correct those deficiencies and allow operation of the facility, is proposed as an FY 97 line item. The mission of the project is to provide centralized intermediate and long-term storage of special nuclear materials (SNM) associated with defined LANL programmatic missions and to establish a centralized SNM shipping and receiving location for Technical Area (TA)-55 at LANL. Based on current projections, existing storage space for SNM at other locations at LANL will be loaded to capacity by approximately 2002. This will adversely affect LANUs ability to meet its mission requirements in the future. The affected missions include LANL`s weapons research, development, and testing (WRD&T) program; special materials recovery; stockpile survelliance/evaluation; advanced fuels and heat sources development and production; and safe, secure storage of existing nuclear materials inventories. The problem is further exacerbated by LANL`s inability to ship any materials offsite because of the lack of receiver sites for mate rial and regulatory issues. Correction of the current deficiencies and enhancement of the facility will provide centralized storage close to a nuclear materials processing facility. The project will enable long-term, cost-effective storage in a secure environment with reduced radiation exposure to workers, and eliminate potential exposures to the public. This document provides Part I - Design Concept which describes the selected solution, and Part II - Project Management which describes the management system organization, the elements that make up the system, and the control and reporting system.

  15. Laser tissue welding mediated with a protein solder

    Science.gov (United States)

    Small, Ward, IV; Heredia, Nicholas J.; Celliers, Peter M.; Da Silva, Luiz B.; Eder, David C.; Glinsky, Michael E.; London, Richard A.; Maitland, Duncan J.; Matthews, Dennis L.; Soltz, Barbara A.

    1996-05-01

    A study of laser tissue welding mediated with an indocyanine green dye-enhanced protein solder was performed. Freshly obtained sections of porcine artery were used for the experiments. Sample arterial wall thickness ranged from two to three millimeters. Incisions approximately four millimeters in length were treated using an 805 nanometer continuous- wave diode laser coupled to a one millimeter diameter fiber. Controlled parameters included the power delivered by the laser, the duration of the welding process, and the concentration of dye in the solder. A two-color infrared detection system was constructed to monitor the surface temperatures achieved at the weld site. Burst pressure measurements were made to quantify the strengths of the welds immediately following completion of the welding procedure.

  16. Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Kita, T; Mukaibo, N; Ando, K; Moriyama, M [Honda R and D Co. Ltd., Tokyo (Japan)

    1997-10-01

    Concerning the tin and lead eutectic solder, we have evaluated the reliability of three factors of intermetallic compound layer, creep and vibration which cause solder degradation. First, the stress factor was extracted from investigating the mechanism of degradation, and the best acceleration test method was fixed. Next, the acceleration test was executed to find the stress dependency and the tendency of solder degradation was modeled numerically. While the environmental stress frequency was obtained and they were put together by using a minor method, which enabled us to predict the life span of solder on the market with precision. 5 refs., 13 figs.

  17. The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder

    Science.gov (United States)

    Mayappan, R.; Salleh, A.; Andas, J.

    2017-09-01

    Solder has been widely used in electronic industry as interconnection for electronic packaging. European Union and Japan have restricted the use of Sn-Pb solder as it contains lead which can harmful to human health and environment. Due to this, many researches have been done in order to find a suitable replacement for the lead solder. Although many lead-free solders are available, the Sn-3.5Ag solder with the addition of graphene seem to be a suitable candidate. In this study, a 0.07 wt% graphene nanosheet was added into the Sn-3.5Ag solder and this composite solder was prepared under powder metallurgy method. The solder was reacted with copper substrate at 250 °C for one minute. For joint strength analysis, two copper strips were soldered together. The solder joint was aged at temperature 100 °C for 500 hours. Scanning Electron Microscope (SEM) was used to observe the interfacial reaction and Instron machine was used to determine the joint strength. Cu6Sn5 intermetallic layer was formed at the interface between the Cu substrate and the solders. Composite solder showed the retardation of the intermetallic growth compared to the plain solder. The thickness value of the intermetallic was used to calculate the growth rate the IMC. The graphene nanosheets added solder has lower growth rate which is 3.86 × 10-15 cm2/s compared to the plain solder 7.15 × 10-15 cm2/s. Shear strength analysis show that the composite solder has higher joint compared to the plain solder.

  18. Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

    Directory of Open Access Journals (Sweden)

    Saliza Azlina O.

    2016-01-01

    Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

  19. Laser beam soldering of micro-optical components

    Science.gov (United States)

    Eberhardt, R.

    2003-05-01

    MOTIVATION Ongoing miniaturisation and higher requirements within optical assemblies and the processing of temperature sensitive components demands for innovative selective joining techniques. So far adhesive bonding has primarily been used to assemble and adjust hybrid micro optical systems. However, the properties of the organic polymers used for the adhesives limit the application of these systems. In fields of telecommunication and lithography, an enhancement of existing joining techniques is necessary to improve properties like humidity resistance, laserstability, UV-stability, thermal cycle reliability and life time reliability. Against this background laser beam soldering of optical components is a reasonable joining technology alternative. Properties like: - time and area restricted energy input - energy input can be controlled by the process temperature - direct and indirect heating of the components is possible - no mechanical contact between joining tool and components give good conditions to meet the requirements on a joining technology for sensitive optical components. Additionally to the laser soldering head, for the assembly of optical components it is necessary to include positioning units to adjust the position of the components with high accuracy before joining. Furthermore, suitable measurement methods to characterize the soldered assemblies (for instance in terms of position tolerances) need to be developed.

  20. Scalable Manufacturing of Solderable and Stretchable Physiologic Sensing Systems.

    Science.gov (United States)

    Kim, Yun-Soung; Lu, Jesse; Shih, Benjamin; Gharibans, Armen; Zou, Zhanan; Matsuno, Kristen; Aguilera, Roman; Han, Yoonjae; Meek, Ann; Xiao, Jianliang; Tolley, Michael T; Coleman, Todd P

    2017-10-01

    Methods for microfabrication of solderable and stretchable sensing systems (S4s) and a scaled production of adhesive-integrated active S4s for health monitoring are presented. S4s' excellent solderability is achieved by the sputter-deposited nickel-vanadium and gold pad metal layers and copper interconnection. The donor substrate, which is modified with "PI islands" to become selectively adhesive for the S4s, allows the heterogeneous devices to be integrated with large-area adhesives for packaging. The feasibility for S4-based health monitoring is demonstrated by developing an S4 integrated with a strain gauge and an onboard optical indication circuit. Owing to S4s' compatibility with the standard printed circuit board assembly processes, a variety of commercially available surface mount chip components, such as the wafer level chip scale packages, chip resistors, and light-emitting diodes, can be reflow-soldered onto S4s without modifications, demonstrating the versatile and modular nature of S4s. Tegaderm-integrated S4 respiration sensors are tested for robustness for cyclic deformation, maximum stretchability, durability, and biocompatibility for multiday wear time. The results of the tests and demonstration of the respiration sensing indicate that the adhesive-integrated S4s can provide end users a way for unobtrusive health monitoring. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  1. Design and evaluation of materials for space reactors

    International Nuclear Information System (INIS)

    Tavassoli, A.A.; Vrillon, B.; Robert, G.

    1990-01-01

    The French programme envisages a 20 kWe reactor, project ERATO, with three technological options. The first option is a sodium cooled reactor, derived from the fast breeder reactor technology, (upper core outlet temperature of 700 0 C). The second option is based on the High Temperature Gas-cooled Reactor technology (outlet temperature range 700 0 C-900 0 C). The third option is the reference solution, lithium cooled and UN fuelled fast spectrum reactor, (outlet temperature as high as 1200 0 C). The choice is essentially dominated by material considerations, and more specifically by the problems related to the compatibility with the cooling medium and to the high temperature creep resistance. For the first system limited work will be needed as the technology used is well experimented and there is a wealth of information on the austenitic stainless steel Type 316L-SPH. For the second system, most of the work has been concentrated on characterization of existing commercial alloys. This has included the preselection and the testing of a number of superalloys irradiated or not. The results obtained from high temperature tensile and creep tests have allowed selection of Haynes 230 as the primary candidate material and have also permitted calculation of allowable design stresses for this alloy. For the very high temperature system the French R and D programme has focused on Mo-Re alloys. The results obtained to this date from microstructural examinations and mechanical tests performed on different alloy compositions have allowed selection of Mo-25%Re for future optimization work. They have also shown the need for evaluation of creep properties at low stresses where microstructural instabilities are likely to occur as a result of long exposure to high temperature

  2. Target design for materials processing very far from equilibrium

    Science.gov (United States)

    Barnard, John J.; Schenkel, Thomas

    2016-10-01

    Local heating and electronic excitations can trigger phase transitions or novel material states that can be stabilized by rapid quenching. An example on the few nanometer scale are phase transitions induced by the passage of swift heavy ions in solids where nitrogen-vacancy color centers form locally in diamonds when ions heat the diamond matrix to warm dense matter conditions at 0.5 eV. We optimize mask geometries for target materials such as silicon and diamond to induce phase transitions by intense ion pulses (e. g. from NDCX-II or from laser-plasma acceleration). The goal is to rapidly heat a solid target volumetrically and to trigger a phase transition or local lattice reconstruction followed by rapid cooling. The stabilized phase can then be studied ex situ. We performed HYDRA simulations that calculate peak temperatures for a series of excitation conditions and cooling rates of crystal targets with micro-structured masks. A simple analytical model, that includes ion heating and radial, diffusive cooling, was developed that agrees closely with the HYDRA simulations. The model gives scaling laws that can guide the design of targets over a wide range of parameters including those for NDCX-II and the proposed BELLA-i. This work was performed under the auspices of the U.S. DOE under contracts DE-AC52-07NA27344 (LLNL), DE-AC02-05CH11231 (LBNL) and was supported by the US DOE Office of Science, Fusion Energy Sciences. LLNL-ABS-697271.

  3. Eutectics as improved pharmaceutical materials: design, properties and characterization.

    Science.gov (United States)

    Cherukuvada, Suryanarayan; Nangia, Ashwini

    2014-01-28

    Eutectics are a long known class of multi-component solids with important and useful applications in daily life. In comparison to other multi-component crystalline solids, such as salts, solid solutions, molecular complexes and cocrystals, eutectics are less studied in terms of molecular structure organization and bonding interactions. Classically, a eutectic is defined based on its low melting point compared to the individual components. In this article, we attempt to define eutectics not just based on thermal methods but from a structural organization view point, and discuss their microstructures and properties as organic materials vis-a-vis solid solutions and cocrystals. The X-ray crystal structure of a cocrystal is different from that of the individual components whereas the unit cell of a solid solution is similar to that of one of the components. Eutectics are closer to the latter species in that their crystalline arrangement is similar to the parent components but they are different with respect to the structural integrity. A solid solution possesses structural homogeneity throughout the structure (single phase) but a eutectic is a heterogeneous ensemble of individual components whose crystal structures are like discontinuous solid solutions (phase separated). Thus, a eutectic may be better defined as a conglomerate of solid solutions. A structural analysis of cocrystals, solid solutions and eutectics has led to an understanding that materials with strong adhesive (hetero) interactions between the unlike components will lead to cocrystals whereas those having stronger cohesive (homo/self) interactions will more often give rise to solid solutions (for similar structures of components) and eutectics (for different structures of components). We demonstrate that the same crystal engineering principles which have been profitably utilized for cocrystal design in the past decade can now be applied to make eutectics as novel composite materials, illustrated by

  4. Designing Neat and Composite Carbon Nanotube Materials by Porosimetric Characterization.

    Science.gov (United States)

    Kobashi, Kazufumi; Yoon, Howon; Ata, Seisuke; Yamada, Takeo; Futaba, Don N; Hata, Kenji

    2017-12-06

    We propose a porosimetry-based method to characterize pores formed by carbon nanotubes (CNTs) in the CNT agglomerates for designing neat CNT-based materials and composites. CNT agglomerates contain pores between individual CNTs and/or CNT bundles (micropore  50 nm). We investigated these pores structured by CNTs with different diameters and number of walls, clarifying the broader size distribution and the larger volume with increased diameters and number of walls. Further, we demonstrated that CNT agglomerate structures with different bulk density were distinguished depending on the pore sizes. Our method also revealed that CNT dispersibility in solvent correlated with the pore sizes of CNT agglomerates. By making use of these knowledge on tailorable pores for CNT agglomerates, we successfully found the correlation between electrical conductivity for CNT rubber composites and pore sizes of CNT agglomerates. Therefore, our method can distinguish diverse CNT agglomerate structures and guide pore sizes of CNT agglomerates to give high electrical conductivity of CNT rubber composites.

  5. Computational Design and Characterization of New Battery Materials

    DEFF Research Database (Denmark)

    Mýrdal, Jón Steinar Garðarsson

    . It is hoped that high energy dense Li-air batteries will be able to replace Li-ion batteries in the future. There are however number of challenge that need to be solved before that can happen. We have studied the growth and decomposition of Li2O2, which is the main discharge product of Li-O2batteries......This thesis is dedicated to the investigation and design of new functional materials for energy storage. The focus of the presented work is on components for the successful Li-ion and the promising Li-air batteries. First principle density function theory calculations are applied to screening...... electrolytes are believed to increase safety in Li based batteries as they would prevent metallic growth in the electrolyte. LiBH4 has a solid superionic conducting HT phase that is stable above 390 K. The HT phase can be stabilized at room temperature with substitution of I into the LiBH4 structure. Here we...

  6. Determination of Te in soldering tin using continuous flowing electrochemical hydride generation atomic fluorescence spectrometry

    International Nuclear Information System (INIS)

    Jiang Xianjuan; Gan Wuer; Han Suping; He Youzhao

    2008-01-01

    An electrochemical hydride generation system was developed for the detection of Te by coupling an electrochemical hydride generator with atomic fluorescence spectrometry. Since TeH 2 is unstable and easily decomposes in solution, a reticular W filament cathode was used in the present system. The TeH 2 generated on the cathode surface was effectively driven out by sweeping gas from the cathode chamber. In addition, a low temperature electrochemical cell (10 deg. C) was applied to reduce the decomposition of TeH 2 in solution. The limit of detection (LOD) was 2.2 ng ml -1 and the relative standard deviation (RSD) was 3.9% for nine consecutive measurements of standard solution. This method was successfully employed for determination of Te in soldering tin material

  7. Design of lightweight multi-material automotive bodies using new material performance indices of thin-walled beams for the material selection with crashworthiness consideration

    International Nuclear Information System (INIS)

    Cui, Xintao; Zhang, Hongwei; Wang, Shuxin; Zhang, Lianhong; Ko, Jeonghan

    2011-01-01

    Currently, automotive bodies are constructed usually using a single material, e.g. steel or aluminum. Compared to single-material automotive bodies, multi-material automotive bodies allow optimal material selection in each structural component for higher product performance and lower cost. This paper presents novel material performance indices and procedures developed to guide systematic material selection for multi-material automotive bodies. These new indices enable to characterize the crashworthiness performance of complex-shaped thin-walled beams in multi-material automotive bodies according to material types. This paper also illustrates the application of these performance indices and procedures by designing a lightweight multi-material automotive body. These procedures will help to design a lightweight and affordable body favored by the automotive industry, thus to reduce fuel consumption and greenhouse gas emissions.

  8. Design of online testing system of material radiation resistance

    International Nuclear Information System (INIS)

    Wan Junsheng; He Shengping; Gao Xinjun

    2014-01-01

    The capability of radiation resistance is important for some material used in some specifically engineering fields. It is the same principal applied in all existing test system that compares the performance parameter after radiation to evaluate material radiation resistance. A kind of new technique on test system of material radiation resistance is put forward in this paper. Experimentation shows that the online test system for material radiation resistance works well and has an extending application outlook. (authors)

  9. Assessment of the biological effects of welding fumes emitted from metal inert gas welding processes of aluminium and zinc-plated materials in humans.

    Science.gov (United States)

    Hartmann, L; Bauer, M; Bertram, J; Gube, M; Lenz, K; Reisgen, U; Schettgen, T; Kraus, T; Brand, P

    2014-03-01

    The aim of this study was to investigate biological effects and potential health risks due to two different metal-inert-gas (MIG) welding fumes (MIG welding of aluminium and MIG soldering of zinc coated steel) in healthy humans. In a threefold cross-over design study 12 male subjects were exposed to three different exposure scenarios. Exposures were performed under controlled conditions in the Aachener Workplace Simulation Laboratory (AWSL). On three different days the subjects were either exposed to filtered ambient air, to welding fumes from MIG welding of aluminium, or to fumes from MIG soldering of zinc coated materials. Exposure was performed for 6 h and the average fume concentration was 2.5 mg m(-3). Before, directly after, 1 day after, and 7 days after exposure spirometric and impulse oscillometric measurements were performed, exhaled breath condensate (EBC) was collected and blood samples were taken and analyzed for inflammatory markers. During MIG welding of aluminium high ozone concentrations (up to 250 μg m(-3)) were observed, whereas ozone was negligible for MIG soldering. For MIG soldering, concentrations of high-sensitivity CRP (hsCRP) and factor VIII were significantly increased but remained mostly within the normal range. The concentration of neutrophils increased in tendency. For MIG welding of aluminium, the lung function showed significant decreases in Peak Expiratory Flow (PEF) and Mean Expiratory Flow at 75% vital capacity (MEF 75) 7 days after exposure. The concentration of ristocetin cofactor was increased. The observed increase of hsCRP during MIG-soldering can be understood as an indicator for asymptomatic systemic inflammation probably due to zinc (zinc concentration 1.5 mg m(-3)). The change in lung function observed after MIG welding of aluminium may be attributed to ozone inhalation, although the late response (7 days after exposure) is surprising. Copyright © 2013 Elsevier GmbH. All rights reserved.

  10. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

  11. Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

    Science.gov (United States)

    Sorg, Brian S.; Welch, Ashley J.

    2001-05-01

    Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

  12. Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

    Science.gov (United States)

    Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S

    2015-08-01

    The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding.

  13. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

    Science.gov (United States)

    Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu

    2017-08-01

    Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

  14. Corrosion Reliability of Lead-free Solder Systems Used in Electronics

    DEFF Research Database (Denmark)

    Li, Feng; Verdingovas, Vadimas; Medgyes, Balint

    2017-01-01

    humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods...

  15. Reliability and microstructure of lead-free solder joints in industrial electronics after accelerated thermal aging

    NARCIS (Netherlands)

    Scaltro, F.; Biglari, M.H.; Kodentsov, A.; Yakovleva, O.; Brom, E.

    2009-01-01

    The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface component/solder together with the formation of fractures. The evolution, the morphology and the elemental

  16. WETTABILITY STUDIES OF LEAD-FREE SOLDERS

    African Journals Online (AJOL)

    2012-03-01

    Mar 1, 2012 ... other industries due to its low cost and unique material properties like low melting point, avail- ability etc. However, the toxicity of lead during industrial production of components and the ... Companies in other countries. (for instance, many in the Japanese electronics in- dustries) began to introduce some ...

  17. Properties and Microstructures of Sn-Bi-X Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Fan Yang

    2016-01-01

    Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

  18. Design, Fabrication, Characterization and Modeling of Integrated Functional Materials

    Science.gov (United States)

    2015-12-01

    activities is expected to lead to new devices/ systems /composite materials useful for the USAMRMC. 15. SUBJECT TERMS Functional materials, integrated...fabrication, nanobiotechnology, multifunctional, dimensional integration, nanocomposites, sensor technology, thermoelectrics, solar cells, photovoltaics ...loop measured in the presence of an AC field, and can be increased by tuning several parameters, such as the nanoparticles’ size , saturation

  19. Computational Design of New Materials for Ammonia Storage

    DEFF Research Database (Denmark)

    Jensen, Peter Bjerre; Quaade, Ulrich

    alkaline-earth mixture, Ba4CaSr3Cl16 wasidentified, and the predicted release was verified experimentally. The two bestfound candidates, Ca4Cu2Y2Cl16 and Sr4Cu2Y2Cl16, are examples of materials,one would not suggest using chemical intuition. This shows that thealgorithm is able to identify new materials...

  20. Design of digital learning material for bioprocess-engineering-education

    NARCIS (Netherlands)

    Schaaf, van der H.

    2007-01-01

    With the advance of computers and the internet, new types of learning material can be developed: web-based digital learning material. Because many complex learning objectives in the food- and bioprocess technology domain are difficult to achieve in a traditional learning environment, a project was

  1. Materials for Nuclear Plants From Safe Design to Residual Life Assessments

    CERN Document Server

    Hoffelner, Wolfgang

    2013-01-01

    The clamor for non-carbon dioxide emitting energy production has directly  impacted on the development of nuclear energy. As new nuclear plants are built, plans and designs are continually being developed to manage the range of challenging requirement and problems that nuclear plants face especially when managing the greatly increased operating temperatures, irradiation doses and extended design life spans. Materials for Nuclear Plants: From Safe Design to Residual Life Assessments  provides a comprehensive treatment of the structural materials for nuclear power plants with emphasis on advanced design concepts.   Materials for Nuclear Plants: From Safe Design to Residual Life Assessments approaches structural materials with a systemic approach. Important components and materials currently in use as well as those which can be considered in future designs are detailed, whilst the damage mechanisms responsible for plant ageing are discussed and explained. Methodologies for materials characterization, material...

  2. Teaching English Using Video Materials: Design and Delivery of a Practical Course

    Science.gov (United States)

    Lopez-Alvarado, Julio

    2017-01-01

    In this paper, a practical course for listening, speaking, reading and writing was designed using authentic video material. The aim of this paper is to offer tools to the TEFL teacher in order to design new course materials using video material. The development procedure is explained in detail, and the underpinning main theories are also…

  3. Material orientation design of planar structures with prescribed anisotropy classes. Study of rhombic systems

    Science.gov (United States)

    Czubacki, Radosław

    2018-01-01

    The paper deals with the minimum compliance problem of 2D structures made of a non-homogeneous elastic material. In the first part of the paper a comparison between solutions of Free Material Design (FMD), Cubic Material Design (CMD) and Isotropic Material Design (IMD) is shown for a simply supported plate in a shape of a deep beam, subjected to a concentrated in-plane force at its upper face. The isoperimetric condition fixes the value of the cost of the design expressed as the integral of the trace of the Hooke tensor. In the second part of the paper the material design approaches are extended to rhombic system in 2D. For the rhombic system the material properties of the structures are set, the design variables being the trajectories of anisotropy directions which in 2D are described by one parameter. In the Orthotropic Orientation Design (OOD) no isoperimetric condition is used.

  4. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    International Nuclear Information System (INIS)

    Li Guangdong; Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu

    2010-01-01

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  5. Physical properties of lead free solders in liquid and solid state

    Energy Technology Data Exchange (ETDEWEB)

    Mhiaoui, Souad

    2007-04-17

    The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

  6. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    Energy Technology Data Exchange (ETDEWEB)

    Li Guangdong, E-mail: liguangdong@emails.bjut.edu.c [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China); Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China)

    2010-02-18

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  7. Transected sciatic nerve repair by diode laser protein soldering.

    Science.gov (United States)

    Fekrazad, Reza; Mortezai, Omid; Pedram, MirSepehr; Kalhori, Katayoun Am; Joharchi, Khojasteh; Mansoori, Korosh; Ebrahimi, Roja; Mashhadiabbas, Fatemeh

    2017-08-01

    Despite advances in microsurgical techniques, repair of peripheral nerve injuries (PNI) is still a major challenge in regenerative medicine. The standard treatment for PNI includes suturing and anasthomosis of the transected nerve. The objective of this study was to compare neurorraphy (nerve repair) using standard suturingto diode laser protein soldering on the functional recovery of transected sciatic nerves. Thirty adult male Fischer-344 Wistar rats were randomly assigned to 3 groups: 1. The control group, no repair, 2. the standard of care suture group, and 3. The laser/protein solder group. For all three groups, the sciatic nerve was transected and the repair was done immediately. For the suture repair group, 10.0 prolene suture was used and for the laser/protein solder group a diode laser (500mW output power) in combination with bovine serum albumen and indocyanine green dye was used. Behavioral assessment by sciatic functional index was done on all rats biweekly. At 12weeks post-surgery, EMG recordings were done on all the rats and the rats were euthanized for histological evaluation of the sciatic nerves. The one-way ANOVA test was used for statistical analysis. The average time required to perform the surgery was significantly shorter for the laser-assisted nerve repair group compared to the suture group. The EMG evaluation revealed no difference between the two groups. Based on the sciatic function index the laser group was significantly better than the suture group after 12weeks (pneurorraphy using standard suturing methods. Copyright © 2017 Elsevier B.V. All rights reserved.

  8. Multi-Material Design Optimization of Composite Structures

    DEFF Research Database (Denmark)

    Hvejsel, Christian Frier

    properties. The modeling encompasses discrete orientationing of orthotropic materials, selection between different distinct materials as well as removal of material representing holes in the structure within a unified parametrization. The direct generalization of two-phase topology optimization to any number...... of a relaxation-based search heuristic that accelerates a Generalized Benders' Decomposition technique for global optimization and enables the solution of medium-scale problems to global optimality. Improvements in the ability to solve larger problems to global optimality are found and potentially further...... improvements may be obtained with this technique in combination with cheaper heuristics....

  9. Rolled-up nanotechnology: 3D photonic materials by design

    International Nuclear Information System (INIS)

    Böttner, Stefan; Jorgensen, Matthew R.; Schmidt, Oliver G.

    2016-01-01

    Rolled-up nanotechnology involves the deposition of strained material layers for subsequent release and relaxation into functional structures with applications spanning several disciplines. Originally developed for use with semiconductor materials, over the last decade the processes involved in rolled-up nanotechnology have been applied across a wide palette of materials resulting in applications (among others) in micro robotics, energy storage, electronics, and photonics. Here we highlight the key advancements and future directions in rolled-up photonics, focusing on the diverse demonstrations of rolled-up three-dimensional microresonators which enable integrated sensing, micro-lasing, and out-of-plane routing of light.

  10. Towards intelligent microstructural design of Nanocomposite Materials. Lightweight, high strength structural/armor materials for service in extreme environments

    International Nuclear Information System (INIS)

    Mara, Nathan Allan; Bronkhorst, Curt Allan; Beyerlein, Irene Jane

    2015-01-01

    The intent of this research effort is to prove the hypothesis that: Through the employment of controlled processing parameters which are based upon integrated advanced material characterization and multi-physics material modeling, bulk nanolayered composites can be designed to contain high densities of preferred interfaces that can serve as supersinks for the defects responsible for premature damage and failure.

  11. Towards intelligent microstructural design of Nanocomposite Materials. Lightweight, high strength structural/armor materials for service in extreme environments

    Energy Technology Data Exchange (ETDEWEB)

    Mara, Nathan Allan [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Bronkhorst, Curt Allan [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Beyerlein, Irene Jane [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2015-12-21

    The intent of this research effort is to prove the hypothesis that: Through the employment of controlled processing parameters which are based upon integrated advanced material characterization and multi-physics material modeling, bulk nanolayered composites can be designed to contain high densities of preferred interfaces that can serve as supersinks for the defects responsible for premature damage and failure.

  12. Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods are useful to predict damage values for solder joint in power electrical components. Based on the proposed methods it is described how to find the damage level for a given temperature loading profile....... The proposed methods are discussed for application in reliability assessment of Wind Turbine’s electrical components considering physical, model and measurement uncertainties. For further research it is proposed to evaluate damage criteria for electrical components due to the operational temperature...

  13. Pressure brazing of ceramics to metals with copper solder

    International Nuclear Information System (INIS)

    Pavlova, M.A.; Metelkin, I.I.

    1986-01-01

    The effect on the quality of joints brazed with copper of different non metallized aluminooxide dielectrics with metals and alloys of a series of technological parameters (temperature, pressure, holding, and medium) in the course of pressure brazing is investigated. It is shown that in case of brazing with kovar and nickel the character of dependences is identical, however in all cases the joints with nickel are more durable. For the ceramics - molybdenum system characterized by weak interaction with copper solder kinetic dependences have no maximum and only under holding of more than 20 min the constant strength of 150-190 MPa is attained

  14. Numerical simulation of CTE mismatch and thermal-structural stresses in the design of interconnects

    Science.gov (United States)

    Peter, Geoffrey John M.

    With the ever-increasing chip complexity, interconnects have to be designed to meet the new challenges. Advances in optical lithography have made chip feature sizes available today at 70 nm dimensions. With advances in Extreme Ultraviolet Lithography, X-ray Lithography, and Ion Projection Lithography it is expected that the line width will further decrease to 20 nm or less. With the decrease in feature size, the number of active devices on the chip increases. With higher levels of circuit integration, the challenge is to dissipate the increased heat flux from the chip surface area. Thermal management considerations include coefficient of thermal expansion (CTE) matching to prevent failure between the chip and the board. This in turn calls for improved system performance and reliability of the electronic structural systems. Experience has shown that in most electronic systems, failures are mostly due to CTE mismatch between the chip, board, and the solder joint (solder interconnect). The resulting high thermal-structural stress and strain due to CTE mismatch produces cracks in the solder joints with eventual failure of the electronic component. In order to reduce the thermal stress between the chip, board, and the solder joint, this dissertation examines the effect of inserting wire bundle (wire interconnect) between the chip and the board. The flexibility of the wires or fibers would reduce the stress at the rigid joints. Numerical simulations of two, and three-dimensional models of the solder and wire interconnects are examined. The numerical simulation is linear in nature and is based on linear isotropic material properties. The effect of different wire material properties is examined. The effect of varying the wire diameter is studied by changing the wire diameter. A major cause of electronic equipment failure is due to fatigue failure caused by thermal cycling, and vibrations. A two-dimensional modal and harmonic analysis was simulated for the wire interconnect

  15. An efficient descriptor model for designing materials for solar cells

    Science.gov (United States)

    Alharbi, Fahhad H.; Rashkeev, Sergey N.; El-Mellouhi, Fedwa; Lüthi, Hans P.; Tabet, Nouar; Kais, Sabre

    2015-11-01

    An efficient descriptor model for fast screening of potential materials for solar cell applications is presented. It works for both excitonic and non-excitonic solar cells materials, and in addition to the energy gap it includes the absorption spectrum (α(E)) of the material. The charge transport properties of the explored materials are modelled using the characteristic diffusion length (Ld) determined for the respective family of compounds. The presented model surpasses the widely used Scharber model developed for bulk heterojunction solar cells. Using published experimental data, we show that the presented model is more accurate in predicting the achievable efficiencies. To model both excitonic and non-excitonic systems, two different sets of parameters are used to account for the different modes of operation. The analysis of the presented descriptor model clearly shows the benefit of including α(E) and Ld in view of improved screening results.

  16. Design, preparation, and application of ordered porous polymer materials

    International Nuclear Information System (INIS)

    Liu, Qingquan; Tang, Zhe; Ou, Baoli; Liu, Lihua; Zhou, Zhihua; Shen, Shaohua; Duan, Yinxiang

    2014-01-01

    Ordered porous polymer (OPP) materials have extensively application prospects in the field of separation and purification, biomembrane, solid supports for sensors catalysts, scaffolds for tissue engineering, photonic band gap materials owing to ordered pore arrays, uniform and tunable pore size, high specific surface area, great adsorption capacity, and light weight. The present paper reviewed the preparation techniques of OPP materials like breath figures, hard template, and soft template. Finally, the applications of OPP materials in the field of separation, sensors, and biomedicine are introduced, respectively. - Highlights: • Breath figures involve polymer casting under moist ambience. • Hard template employs monodisperse colloidal spheres as a template. • Soft template utilizes the etched block in copolymers as template

  17. First Materials Science Research Rack Capabilities and Design Features

    Science.gov (United States)

    Schaefer, D.; King, R.; Cobb, S.; Whitaker, Ann F. (Technical Monitor)

    2001-01-01

    The first Materials Science Research Rack (MSRR-1) will accommodate dual Experiment Modules (EM's) and provide simultaneous on-orbit processing operations capability. The first international Materials Science Experiment Module for the MSRR-1 is an international cooperative research activity between NASA's Marshall Space Flight Center (MSFC) and the European Space Agency's (ESA) European Space Research and Technology Center. (ESTEC). This International Standard Payload Rack (ISPR) will contain the Materials Science Laboratory (MSL) developed by ESA as an Experiment Module. The MSL Experiment Module will accommodate several on-orbit exchangeable experiment-specific Module Inserts. Module Inserts currently planned are a Quench Module Insert, Low Gradient Furnace, Solidification with Quench Furnace, and Diffusion Module Insert. The second Experiment Module for the MSRR-1 configuration is a commercial device supplied by MSFC's Space Products Department (SPD). It includes capabilities for vapor transport processes and liquid metal sintering. This Experiment Module will be replaced on-orbit with other NASA Materials Science EMs.

  18. Shaping of Panel Materials in Light Direction Design

    Directory of Open Access Journals (Sweden)

    Urzędowski A.

    2016-06-01

    Full Text Available The paper presents the methodology of the analysis of the materials used in solar energy conversion, and an elaborated example with simulations of obtained results. Material properties are selected in relation to the need of sunlight illumination applications in civil constructions. This process is presented , starting from the analysis of some aspects of solar radiation, through the calculations of lens curvature and leading to the execution of simulations in different conditions. Graphical presentation of the phenomenon, it can visualize the process of shaping curves. The materials such as glass, polymers, metals, and gases have been discussed. Particular attention was paid to the results of the transmission of materials, their reflection and absorption of solar radiation. Moreover, the research problems of illumination and reflection in multi-layer structures used for civil constructions have been presented.

  19. Design and evaluation of foamed asphalt base materials.

    Science.gov (United States)

    2013-05-01

    Foamed asphalt stabilized base (FASB) combines reclaimed asphalt pavement (RAP), recycled : concrete (RC), and/or graded aggregate base (GAB) with a foamed asphalt binder to produce a : partially stabilized base material. The objectives of this study...

  20. Synthesis and design of intermetallic materials - molybdenum disilicide

    Energy Technology Data Exchange (ETDEWEB)

    Petrovic, J.J.; Castro, R.G.; Butt, D.P. [Los Alamos National Laboratory, NM (United States)] [and others

    1995-05-01

    The objective of this program is to develop structural silicide-based composite materials with optimum combinations of elevated temperature strength/creep resistance, low temperature fracture toughness, and high temperature oxidation resistance for applications of importance to the U.S. processing industry. A further objective is to develop silicide-based prototype industrial components. The ultimate aim of the program is to work with industry to transfer the structural silicide materials technology to the private sector in order to promote international competitiveness in the area of advanced high temperature composite materials and important applications in major energy-intensive U.S. processing industries. The program presently has a number of developing industrial connections, including a CRADA with the advanced materials company Advanced Refractory Technologies Inc. and interactions targeted at developing industrial gas burner and metal and glass melting/processing applications. Current experimental emphasis is on the development and characterization of SiC reinforced-MoSi{sub 2} matrix composites, plasma sprayed MoSi{sub 2}-based materials and microlaminate composites, and MoSi{sub 2} reinforced-Si{sub 3}N{sub 4} matrix composites. We are developing processing methods for MoSi{sub 2{minus}}based materials and microlaminate composites, and MoSi{sub 2} reinforced-Si{sub 3}N{sub 4} matrix composites. We are developing processing methods for MoSi{sub 2{minus}} based materials, such as plasma spraying/spray forming and electrophoretic deposition. We are also pursuing the fabrication of prototype industrial gas burner and injection tube components of these materials, as well as prototype components for glass processing.

  1. Material design and structural color inspired by biomimetic approach

    International Nuclear Information System (INIS)

    Saito, Akira

    2011-01-01

    Generation of structural color is one of the essential functions realized by living organisms, and its industrial reproduction can result in numerous applications. From this viewpoint, the mechanisms, materials, analytical methods and fabrication technologies of the structural color are reviewed in this paper. In particular, the basic principles of natural photonic materials, the ideas developed from these principles, the directions of applications and practical industrial realizations are presented by summarizing the recent research results. (topical review)

  2. AC Calorimetric Design for Dynamic of Biological Materials

    OpenAIRE

    Shigeo Imaizumi

    2006-01-01

    We developed a new AC calorimeter for the measurement of dynamic specific heat capacity in liquids, including aqueous suspensions of biological materials. This method has several advantages. The first is that a high-resolution measurement of heat capacity, inmillidegrees, can be performed as a function of temperature, even with a very small sample. Therefore, AC calorimeter is a powerful tool to study critical behavior a tphase transition in biological materials. The second advantage is that ...

  3. Bioreceptivity evaluation of cementitious materials designed to stimulate biological growth.

    Science.gov (United States)

    Manso, Sandra; De Muynck, Willem; Segura, Ignacio; Aguado, Antonio; Steppe, Kathy; Boon, Nico; De Belie, Nele

    2014-05-15

    Ordinary Portland cement (OPC), the most used binder in construction, presents some disadvantages in terms of pollution (CO2 emissions) and visual impact. For this reason, green roofs and façades have gain considerable attention in the last decade as a way to integrate nature in cities. These systems, however, suffer from high initial and maintenance costs. An alternative strategy to obtain green facades is the direct natural colonisation of the cementitious construction materials constituting the wall, a phenomenon governed by the bioreceptivity of such material. This work aims at assessing the suitability of magnesium phosphate cement (MPC) materials to allow a rapid natural colonisation taking carbonated OPC samples as a reference material. For that, the aggregate size, the w/c ratio and the amount of cement paste of mortars made of both binders were modified. The assessment of the different bioreceptivities was conducted by means of an accelerated algal fouling test. MPC samples exhibited a faster fouling compared to OPC samples, which could be mainly attributed to the lower pH of the MPC binder. In addition to the binder, the fouling rate was governed by the roughness and the porosity of the material. MPC mortar with moderate porosity and roughness appears to be the most feasible material to be used for the development of green concrete walls. Copyright © 2014 Elsevier B.V. All rights reserved.

  4. Mechanical design engineering. NASA/university advanced design program: Lunar Bulk Material Transport Vehicle

    Science.gov (United States)

    Daugherty, Paul; Griner, Stewart; Hendrix, Alan; Makarov, Chris; Martiny, Stephen; Meyhoefer, Douglas Ralph; Platt, Cody Claxton; Sivak, John; Wheeler, Elizabeth Fitch

    1988-01-01

    The design of a Lunar Bulk Material Transport Vehicle (LBMTV) is discussed. Goals set in the project include a payload of 50 cubic feet of lunar soil with a lunar of approximately 800 moon-pounds, a speed of 15 mph, and the ability to handle a grade of 20 percent. Thermal control, an articulated steering mechanism, a dump mechanism, a self-righting mechanism, viable power sources, and a probable control panel are analyzed. The thermal control system involves the use of small strip heaters to heat the housing of electronic equipment in the absence of sufficient solar radiation and multi-layer insulation during periods of intense solar radiation. The entire system uses only 10 W and weighs about 60 pounds, or 10 moon-pounds. The steering mechanism is an articulated steering joint at the center of the vehicle. It utilizes two actuators and yields a turning radius of 10.3 feet. The dump mechanism rotates the bulk material container through an angle of 100 degree using one actuator. The self-righting mechanism consists of two four bar linkages, each of which is powered by the same size actuator as the other linkages. The LBMTV is powered by rechargeable batteries. A running time of at least two hours is attained under a worst case analysis. The weight of the batteries is 100 pounds. A control panel consisting of feedback and control instruments is described. The panel includes all critical information necessary to control the vehicle remotely. The LBMTV is capable of handling many types of cargo. It is able to interface with many types of removable bulk material containers. These containers are made to interface with the three-legged walker, SKITTER. The overall vehicle is about 15 feet in length and has a weight of about 1000 pounds, or 170 lunar pounds.

  5. Rapidly quenched amorphous and microcrystalline solders for atomic power industry

    International Nuclear Information System (INIS)

    Kalin, V.A.; Fedotov, V.T.; Sevryukov, O.N.; Grigor'ev, A.E.; Skuratov, L.A.; Sulaberidze, V.Sh.; Yurchenko, A.D.; Sokolov, V.F.; Rodionov, V.A.

    1996-01-01

    The possibility of using strip amorphous brazing alloys STEMET on Ni, Cu, Ti or Al base to braze various materials (stainless steels - zirconium, ceramics - metal, copper alloys, titanium alloys, cermets, molybdenum, beryllium) is under study. Experimental bench is designed and brazing regimes are developed for various dissimilar materials. Mechanical and corrosion tests of brazed joints show that rapidly quenching STEMET type brazing alloys are promising materials for manufacturing components of irradiating devices [ru

  6. Study of Diffusion Barrier for Solder/ n-Type Bi2Te3 and Bonding Strength for p- and n-Type Thermoelectric Modules

    Science.gov (United States)

    Lin, Wen-Chih; Li, Ying-Sih; Wu, Albert T.

    2018-01-01

    This paper investigates the interfacial reaction between Sn and Sn3Ag0.5Cu (SAC305) solder on n-type Bi2Te3 thermoelectric material. An electroless Ni-P layer successfully suppressed the formation of porous SnTe intermetallic compound at the interface. The formation of the layers between Bi2Te3 and Ni-P indicates that Te is the dominant diffusing species. Shear tests were conducted on both Sn and SAC305 solder on n- and p-type Bi2Te3 with and without a Ni-P barrier layer. Without a Ni-P layer, porous SnTe would result in a more brittle fracture. A comparison of joint strength for n- and p-type thermoelectric modules is evaluated by the shear test. Adding a diffusion barrier increases the mechanical strength by 19.4% in n-type and 74.0% in p-type thermoelectric modules.

  7. Prediction of activities of all components in the lead-free solder systems Bi-In-Sn and Bi-In-Sn-Zn

    International Nuclear Information System (INIS)

    Tao Dongping

    2008-01-01

    The activities of components of the ternary lead-free solder systems Al-Sn-Zn at 973 K, Zn-Cu-Sn at 1023 K and Bi-In-Sn at 1000 and 1050 K have been predicted by a novel molecular interaction volume model-MIVM and the results are in good agreement with experimental data. Then the activities of all components of the Bi-In-Sn at 550 K and the Bi-In-Sn-Zn quaternary system at 700 K have been further predicted and the results are reasonable and reliable. This shows that the model may be a superior alternative for describing interfacial chemical reactions between lead-free solder alloys and common base materials and for the calculation of their phase diagrams because MIVM has certain physical meaning from the viewpoint of statistical thermodynamics and requires only two infinite dilute activity coefficients for each sub-binary system

  8. Graded territories: Towards the design, specification and simulation of materially graded bending active structures

    DEFF Research Database (Denmark)

    Nicholas, Paul; Tamke, Martin; Ramsgaard Thomsen, Mette

    2012-01-01

    these structures, the property of bending is activated and varied through bespoke material means so as to match a desired form. Within the architectural design process, formal control depends upon design approaches for material specification and simulation that consider behavior at the level of the material...... element as well as the structure. We describe an evolving approach to material specification and simulation, and highlight the digital and material considerations that frame the process.......The ability to make materials with bespoke behavior affords new perspectives on incorporating material properties within the design process not available through natural materials. This paper reports the design and assembly of two bending-active, fibre-reinforced composite structures. Within...

  9. Material gap membrane distillation: A new design for water vapor flux enhancement

    KAUST Repository

    Francis, Lijo; Ghaffour, NorEddine; Alsaadi, Ahmad Salem; Amy, Gary L.

    2013-01-01

    A new module design for membrane distillation, namely material gap membrane distillation (MGMD), for seawater desalination has been proposed and successfully tested. It has been observed that employing appropriate materials between the membrane

  10. A tangible design tool for sketching materials in products

    NARCIS (Netherlands)

    Saakes, D.P.; Stappers, P.J.

    2009-01-01

    Industrial designers make sketches and physical models to start and develop ideas and concept designs. Such representations have advantages that they support fast, intuitive, rich, sensory exploration of solutions. Although existing tools and techniques provide adequate support where the shape of

  11. Interrelationship betwen material strength and component design under elevated temperature for FBR

    International Nuclear Information System (INIS)

    Nakagawa, Y.

    Structural design under elevated temperature for fast breeder reactor plant is very troublesome compared to that of for lower temperature. This difficulty can be mainly discussed from two different stand points. One is design and design code, another is material strength. Components in FBR are operated under creep regime and time dependent creep behaviour should be elevated properly. This means the number and combinations of design code and material strength are significantly large and makes these systems very complicated. Material selection is, in no words, not an easy job. This should be done by not only material development but also component design stand point. With valuable experience of construction and research on FBR, a lot of information on component design and material behaviour is available. And it is a time to choose the ''best material'' from the entire stand points of component construction. (author)

  12. Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Silva, Bismarck L., E-mail: bismarck_luiz@yahoo.com.br [Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, 13083-860 Campinas, SP (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil)

    2016-04-15

    Low temperature soldering technology encompasses Sn–Bi based alloys as reference materials for joints since such alloys may be molten at temperatures less than 180 °C. Despite the relatively high strength of these alloys, segregation problems and low ductility are recognized as potential disadvantages. Thus, for low-temperature applications, Bi–Sn eutectic or near-eutectic compositions with or without additions of alloying elements are considered interesting possibilities. In this context, additions of third elements such as Cu and Ag may be an alternative in order to reach sounder solder joints. The length scale of the phases and their proportions are known to be the most important factors affecting the final wear, mechanical and corrosions properties of ternary Sn–Bi–(Cu,Ag) alloys. In spite of this promising outlook, studies emphasizing interrelations of microstructure features and solidification thermal parameters regarding these multicomponent alloys are rare in the literature. In the present investigation Sn–Bi–(Cu,Ag) alloys were directionally solidified (DS) under transient heat flow conditions. A complete characterization is performed including experimental cooling thermal parameters, segregation (XRF), optical and scanning electron microscopies, X-ray diffraction (XRD) and length scale of the microstructural phases. Experimental growth laws relating dendritic spacings to solidification thermal parameters have been proposed with emphasis on the effects of Ag and Cu. The theoretical predictions of the Rappaz-Boettinger model are shown to be slightly above the experimental scatter of secondary dendritic arm spacings for both ternary Sn–Bi–Cu and Sn–Bi–Ag alloys examined. - Highlights: • Dendritic growth prevailed for the ternary Sn–Bi–Cu and Sn–Bi–Ag solder alloys. • Bi precipitates within Sn-rich dendrites were shown to be unevenly distributed. • Morphology and preferential region for the Ag{sub 3}Sn growth depend on Ag

  13. Materials interaction tests to identify base and coating materials for an enhanced in-vessel core catcher design

    Energy Technology Data Exchange (ETDEWEB)

    Rempe, J.L.; Knudson, D.L.; Condie, K.G.; Swank, W.D. [Idaho National Engineering and Environmental Laboratory, Idaho Falls ID (United States); Cheung, F.B. [Pennsylvania State University, Department of Mechanical and Nuclear Engineering, University Park PA (United States); Suh, K.Y. [Seoul National University, Department of Nuclear Engineering, Seoul (Korea, Republic of); Kim, S.B. [Korea Atomic Energy Research Institute, Severe Accident Research Project, Taejon (Korea, Republic of)

    2004-07-01

    An enhanced in-vessel core catcher is being designed and evaluated, it must ensure In-Vessel Retention of core materials that may relocate under severe accident conditions in advanced reactors. To reduce cost and simplify manufacture and installation, this new core catcher design consists of several interlocking sections that are machined to fit together when inserted into the lower head. If needed, the core catcher can be manufactured with holes to accommodate lower head penetrations. Each section of the core catcher consists of two material layers with an option to add a third layer (if deemed necessary): a base material, which has the capability to support and contain the mass of core materials that may relocate during a severe accident; an insulating oxide coating material on top of the base material, which resists interactions with high-temperature core materials; and an optional coating on the bottom side of the base material to prevent any potential oxidation of the base material during the lifetime of the reactor. Initial evaluations suggest that a thermally-sprayed oxide material is the most promising candidate insulator coating for a core catcher. Tests suggest that 2 coatings can provide adequate protection to a stainless steel core catcher: -) a 500 {mu}m thick zirconium dioxide coating over a 100-200 {mu}m Inconel 718 bond coating, and -) a 500 {mu}m thick magnesium zirconate coating.

  14. Surface modifications of dental ceramic implants with different glass solder matrices: in vitro analyses with human primary osteoblasts and epithelial cells.

    Science.gov (United States)

    Markhoff, Jana; Mick, Enrico; Mitrovic, Aurica; Pasold, Juliane; Wegner, Katharina; Bader, Rainer

    2014-01-01

    Ceramic materials show excellent esthetic behavior, along with an absence of hypersensitivity, making them a possible alternative implant material in dental surgery. However, their surface properties enable only limited osseointegration compared to titanium implants. Within this study, a novel surface coating technique for enhanced osseointegration was investigated biologically and mechanically. Specimens of tetragonal zirconia polycrystal (TZP) and aluminum toughened zirconia (ATZ) were modified with glass solder matrices in two configurations which mainly consisted of SiO2, Al2O3, K2O, and Na2O. The influence on human osteoblastic and epithelial cell viability was examined by means of a WST-1 assay as well as live/dead staining. A C1CP-ELISA was carried out to verify procollagen type I production. Uncoated/sandblasted ceramic specimens and sandblasted titanium surfaces were investigated as a reference. Furthermore, mechanical investigations of bilaterally coated pellets were conducted with respect to surface roughness and adhesive strength of the different coatings. These tests could demonstrate a mechanically stable implant coating with glass solder matrices. The coated ceramic specimens show enhanced osteoblastic and partly epithelial viability and matrix production compared to the titanium control. Hence, the new glass solder matrix coating could improve bone cell growth as a prerequisite for enhanced osseointegration of ceramic implants.

  15. Surface Modifications of Dental Ceramic Implants with Different Glass Solder Matrices: In Vitro Analyses with Human Primary Osteoblasts and Epithelial Cells

    Science.gov (United States)

    Mick, Enrico

    2014-01-01

    Ceramic materials show excellent esthetic behavior, along with an absence of hypersensitivity, making them a possible alternative implant material in dental surgery. However, their surface properties enable only limited osseointegration compared to titanium implants. Within this study, a novel surface coating technique for enhanced osseointegration was investigated biologically and mechanically. Specimens of tetragonal zirconia polycrystal (TZP) and aluminum toughened zirconia (ATZ) were modified with glass solder matrices in two configurations which mainly consisted of SiO2, Al2O3, K2O, and Na2O. The influence on human osteoblastic and epithelial cell viability was examined by means of a WST-1 assay as well as live/dead staining. A C1CP-ELISA was carried out to verify procollagen type I production. Uncoated/sandblasted ceramic specimens and sandblasted titanium surfaces were investigated as a reference. Furthermore, mechanical investigations of bilaterally coated pellets were conducted with respect to surface roughness and adhesive strength of the different coatings. These tests could demonstrate a mechanically stable implant coating with glass solder matrices. The coated ceramic specimens show enhanced osteoblastic and partly epithelial viability and matrix production compared to the titanium control. Hence, the new glass solder matrix coating could improve bone cell growth as a prerequisite for enhanced osseointegration of ceramic implants. PMID:25295270

  16. Surface Modifications of Dental Ceramic Implants with Different Glass Solder Matrices: In Vitro Analyses with Human Primary Osteoblasts and Epithelial Cells

    Directory of Open Access Journals (Sweden)

    Jana Markhoff

    2014-01-01

    Full Text Available Ceramic materials show excellent esthetic behavior, along with an absence of hypersensitivity, making them a possible alternative implant material in dental surgery. However, their surface properties enable only limited osseointegration compared to titanium implants. Within this study, a novel surface coating technique for enhanced osseointegration was investigated biologically and mechanically. Specimens of tetragonal zirconia polycrystal (TZP and aluminum toughened zirconia (ATZ were modified with glass solder matrices in two configurations which mainly consisted of SiO2, Al2O3, K2O, and Na2O. The influence on human osteoblastic and epithelial cell viability was examined by means of a WST-1 assay as well as live/dead staining. A C1CP-ELISA was carried out to verify procollagen type I production. Uncoated/sandblasted ceramic specimens and sandblasted titanium surfaces were investigated as a reference. Furthermore, mechanical investigations of bilaterally coated pellets were conducted with respect to surface roughness and adhesive strength of the different coatings. These tests could demonstrate a mechanically stable implant coating with glass solder matrices. The coated ceramic specimens show enhanced osteoblastic and partly epithelial viability and matrix production compared to the titanium control. Hence, the new glass solder matrix coating could improve bone cell growth as a prerequisite for enhanced osseointegration of ceramic implants.

  17. Advanced algorithms for radiographic material discrimination and inspection system design

    Energy Technology Data Exchange (ETDEWEB)

    Gilbert, Andrew J. [Pacific Northwest National Laboratory, Richland, WA 99354 (United States); McDonald, Benjamin S., E-mail: benjamin.mcdonald@pnnl.gov [Pacific Northwest National Laboratory, Richland, WA 99354 (United States); Deinert, Mark R., E-mail: mdeinert@mines.edu [Colorado School of Mines, Golden, CO 80401 (United States)

    2016-10-15

    X-ray and neutron radiography are powerful tools for non-invasively inspecting the interior of objects. However, current methods are limited in their ability to differentiate materials when multiple materials are present, especially within large and complex objects. Past work has demonstrated that the spectral shift that X-ray beams undergo in traversing an object can be used to detect and quantify nuclear materials. The technique uses a spectrally sensitive detector and an inverse algorithm that varies the composition of the object until the X-ray spectrum predicted by X-ray transport matches the one measured. Here we show that this approach can be adapted to multi-mode radiography, with energy integrating detectors, and that the Cramér–Rao lower bound can be used to choose an optimal set of inspection modes a priori. We consider multi-endpoint X-ray radiography alone, or in combination with neutron radiography using deuterium–deuterium (DD) or deuterium–tritium (DT) sources. We show that for an optimal mode choice, the algorithm can improve discrimination between high-Z materials, specifically between tungsten and plutonium, and estimate plutonium mass within a simulated nuclear material storage system to within 1%.

  18. New Materials Design Through Friction Stir Processing Techniques

    International Nuclear Information System (INIS)

    Buffa, G.; Fratini, L.; Shivpuri, R.

    2007-01-01

    Friction Stir Welding (FSW) has reached a large interest in the scientific community and in the last years also in the industrial environment, due to the advantages of such solid state welding process with respect to the classic ones. The complex material flow occurring during the process plays a fundamental role in such solid state welding process, since it determines dramatic changes in the material microstructure of the so called weld nugget, which affects the effectiveness of the joints. What is more, Friction Stir Processing (FSP) is mainly being considered for producing high-strain-rate-superplastic (HSRS) microstructure in commercial aluminum alloys. The aim of the present research is the development of a locally composite material through the Friction Stir Processing (FSP) of two AA7075-T6 blanks and a different material insert. The results of a preliminary experimental campaign, carried out at the varying of the additional material placed at the sheets interface under different conditions, are presented. Micro and macro observation of the such obtained joints permitted to investigate the effects of such process on the overall joint performance

  19. The innovative application studty on eco-packaging design and materials

    Directory of Open Access Journals (Sweden)

    Cui Yong Min

    2016-01-01

    Full Text Available The paper solves the increasingly deteriorate environmental problems by positively exploring how to utilize and develop eco-packaging design reasonably. The paper explores an effective method that combines eco-packaging and environmental protection materials, hoping to define the sustainable development road of packaging design. The paper is centered on the design application of eco-packaging and environmental protection materials, applies and analyzes the method to obtain innovative design requirements and development tendency of eco-packaging design by analyzing status and significance of eco-packaging design, combining with the development and main types of eco-packaging packaging materials, and based on the achievements acquired by eco-packaging and environmental protection materials. Meanwhile, the paper also reveals mutual dependence and mutual promotion of eco-packaging design and eco-packaging materials.

  20. A database to enable discovery and design of piezoelectric materials

    Science.gov (United States)

    de Jong, Maarten; Chen, Wei; Geerlings, Henry; Asta, Mark; Persson, Kristin Aslaug

    2015-01-01

    Piezoelectric materials are used in numerous applications requiring a coupling between electrical fields and mechanical strain. Despite the technological importance of this class of materials, for only a small fraction of all inorganic compounds which display compatible crystallographic symmetry, has piezoelectricity been characterized experimentally or computationally. In this work we employ first-principles calculations based on density functional perturbation theory to compute the piezoelectric tensors for nearly a thousand compounds, thereby increasing the available data for this property by more than an order of magnitude. The results are compared to select experimental data to establish the accuracy of the calculated properties. The details of the calculations are also presented, along with a description of the format of the database developed to make these computational results publicly available. In addition, the ways in which the database can be accessed and applied in materials development efforts are described. PMID:26451252

  1. A database to enable discovery and design of piezoelectric materials.

    Science.gov (United States)

    de Jong, Maarten; Chen, Wei; Geerlings, Henry; Asta, Mark; Persson, Kristin Aslaug

    2015-01-01

    Piezoelectric materials are used in numerous applications requiring a coupling between electrical fields and mechanical strain. Despite the technological importance of this class of materials, for only a small fraction of all inorganic compounds which display compatible crystallographic symmetry, has piezoelectricity been characterized experimentally or computationally. In this work we employ first-principles calculations based on density functional perturbation theory to compute the piezoelectric tensors for nearly a thousand compounds, thereby increasing the available data for this property by more than an order of magnitude. The results are compared to select experimental data to establish the accuracy of the calculated properties. The details of the calculations are also presented, along with a description of the format of the database developed to make these computational results publicly available. In addition, the ways in which the database can be accessed and applied in materials development efforts are described.

  2. Elevated-Temperature Mechanical Properties of Lead-Free Sn-0.7Cu- xSiC Nanocomposite Solders

    Science.gov (United States)

    Mohammadi, A.; Mahmudi, R.

    2018-02-01

    Mechanical properties of Sn-0.7 wt.%Cu lead-free solder alloy reinforced with 0 vol.%, 1 vol.%, 2 vol.%, and 3 vol.% 100-nm SiC particles have been assessed using the shear punch testing technique in the temperature range from 25°C to 125°C. The composite materials were fabricated by the powder metallurgy route by blending, compacting, sintering, and finally extrusion. The 2 vol.% SiC-containing composite showed superior mechanical properties. In all conditions, the shear strength was adversely affected by increasing test temperature, and the 2 vol.% SiC-containing composite showed superior mechanical properties. Depending on the test temperature, the shear yield stress and ultimate shear strength increased, respectively, by 3 MPa to 4 MPa and 4 MPa to 5.5 MPa, in the composite materials. The strength enhancement was mostly attributed to the Orowan particle strengthening mechanism due to the SiC nanoparticles, and to a lesser extent to the coefficient of thermal expansion mismatch between the particles and matrix in the composite solder. A modified shear lag model was used to predict the total strengthening achieved by particle addition, based on the contribution of each of the above mechanisms.

  3. Practical Considerations of Design, Fabrication and Tests for Composite Materials,

    Science.gov (United States)

    1982-09-01

    Harris 2 School of Materials Science University of Bath Claverton Down Bath AB2 7AY UK 1. THE IDEA OF A COMPOSITE The concept is a familiar one even to...A.R. Bunsell " Comportement en torsion des fibres de Kevlar-29 " Colloque nt CNRS No. 319 Comportement plastique des solides anisotropes. 16-19 June...d’hhlicoptares en composites : conception , rdalisation et comportement en operation ". Advances in Composite Materials Vol II Ed. A.R. Bunsell, C. Bathias

  4. A design of inverse Taylor projectiles using material simulation

    International Nuclear Information System (INIS)

    Tonks, Michael; Harstad, Eric; Maudlin, Paul; Trujillo, Carl

    2008-01-01

    The classic Taylor cylinder test, in which a right circular cylinder is projected at a rigid anvil, exploits the inertia of the projectile to access strain rates that are difficult to achieve with more traditional uniaxial testing methods. In this work we present our efforts to design inverse Taylor projectiles, in which a tapered projectile becomes a right circular cylinder after impact, from annealed copper and show that the self-correcting geometry leads to a uniform compressive strain in the radial direction. We design projectiles using finite element simulation and optimization that deform as desired in tests with minor deviations in the deformed geometry due to manufacturing error and uncertainty in the initial velocity. The inverse Taylor projectiles designed in this manner provide a simple means of validating constitutive models. This work is a step towards developing a general method of designing Taylor projectiles that provide stress–strain behavior relevant to particular engineering problems

  5. Excel Computational Design Tool: Multifunctional Structure-Battery Materials

    National Research Council Canada - National Science Library

    Thomas, James

    2003-01-01

    .... SBDT is implemented in Excel spreadsheet form and is capable of analyzing composite designs with several cross-section geometries including circular-annular rectangular-annular, arbitrary-box, and multilayers...

  6. Design, Fabrication, Characterization and Modeling of Integrated Functional Materials

    Science.gov (United States)

    2014-10-01

    The aim of this project is to design a biocompatible package that will deliver the artificial platelets and other hemostatic accelerants (i.e...Encapsulation of magnetic particles within poly(N-isopropylacrylamide) (PNIPAM) via a process known as emulsion polymerization [34,35,38] has...deliver the package ” to the targeted wound site as discussed in the next section. Design of the platelet delivery system This project focusses on

  7. Hybrid microcircuit technology handbook materials, processes, design, testing and production

    CERN Document Server

    Licari, James J

    1998-01-01

    The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will

  8. Impurity Effects in Electroplated-Copper Solder Joints

    Directory of Open Access Journals (Sweden)

    Hsuan Lee

    2018-05-01

    Full Text Available Copper (Cu electroplating is a mature technology, and has been extensively applied in microelectronic industry. With the development of advanced microelectronic packaging, Cu electroplating encounters new challenges for atomic deposition on a non-planar substrate and to deliver good throwing power and uniform deposit properties in a high-aspect-ratio trench. The use of organic additives plays an important role in modulating the atomic deposition to achieve successful metallic coverage and filling, which strongly relies on the adsorptive and chemical interactions among additives on the surface of growing film. However, the adsorptive characteristic of organic additives inevitably results in an incorporation of additive-derived impurities in the electroplated Cu film. The incorporation of high-level impurities originating from the use of polyethylene glycol (PEG and chlorine ions significantly affects the microstructural evolution of the electroplated Cu film, and the electroplated-Cu solder joints, leading to the formation of undesired voids at the joint interface. However, the addition of bis(3-sulfopropyl disulfide (SPS with a critical concentration suppresses the impurity incorporation and the void formation. In this article, relevant studies were reviewed, and the focus was placed on the effects of additive formula and plating parameters on the impurity incorporation in the electroplated Cu film, and the void formation in the solder joints.

  9. A flip chip process based on electroplated solder bumps

    Science.gov (United States)

    Salonen, J.; Salmi, J.

    1994-01-01

    Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin count and packaging density and superior electrical performance. The chips are mounted upside down on the substrate, which can be made of silicon, ceramic, glass or - in some cases - even PCB. The extra processing steps required for chips are the deposition of a suitable thin film metal layer(s) on the standard Al pad and the formation of bumps. Also, the development of new fine line substrate technologies is required to utilize the full potential of the technology. In our bumping process, bump deposition is done by electroplating, which was chosen for its simplicity and economy. Sputter deposited molybdenum and copper are used as thin film layers between the aluminum pads and the solder bumps. A reason for this choice is that the metals can be selectively etched after bumping using the bumps as a mask, thus circumventing the need for a separate mask for etching the thin film metals. The bumps are electroplated from a binary Pb-Sn bath using a thick liquid photoresist. An extensively modified commercial flip chip bonder is used for alignment and bonding. Heat assisted tack bonding is used to attach the chips to the substrate, and final reflow joining is done without flux in a vacuum furnace.

  10. Micro-structural reliability design of brittle materials

    Czech Academy of Sciences Publication Activity Database

    Strnadel, B.; Byczanski, Petr

    2007-01-01

    Roč. 74, č. 11 (2007), s. 1825-1836 ISSN 0013-7944 R&D Projects: GA ČR(CZ) GA106/06/0646 Institutional research plan: CEZ:AV0Z30860518 Keywords : Cleavage strength * Brittle fracture * Fracture toughness Subject RIV: JJ - Other Materials Impact factor: 1.227, year: 2007 www.elsevier.com/locate/engfracmech

  11. Magnetic characterisation of recording materials: design, instrumentation and experimental methods

    NARCIS (Netherlands)

    Samwel, E.O.

    1995-01-01

    The progress being made in the field of magnetic recording is extremely fast. The need to keep this progress going, leads to new types of recording materials which require advanced measurement systems and measurement procedures. Furthermore, the existing measurement methods need to be reviewed as

  12. Computer design of porous active materials at different dimensional scales

    Science.gov (United States)

    Nasedkin, Andrey

    2017-12-01

    The paper presents a mathematical and computer modeling of effective properties of porous piezoelectric materials of three types: with ordinary porosity, with metallized pore surfaces, and with nanoscale porosity structure. The described integrated approach includes the effective moduli method of composite mechanics, simulation of representative volumes, and finite element method.

  13. Designing Competency-Based Materials for the Automotive Mechanics Curriculum

    Science.gov (United States)

    Richardson, Roger L.

    1977-01-01

    Describes the Career Education Center's (Florida State University) development of the "Automotive Mechanics Catalog" (a job inventory noting performance objectives for specific occupational programs), using the Vocational-Technical Education Consortium of States (V-TECS) model. Also describes the development of curriculum materials using…

  14. Material optimization: bridging the gap between conceptual and preliminary design

    Czech Academy of Sciences Publication Activity Database

    Hörnlein, H. R. E. M.; Kočvara, Michal; Werner, R.

    2001-01-01

    Roč. 5, č. 1 (2001), s. 541-554 ISSN 1270-9638 R&D Projects: GA AV ČR IAA1075005 Grant - others:BMBF(DE) 03ZOM3ER Institutional research plan: CEZ:AV0Z1075907 Keywords : topology optimization * material optimization * structural optimization Subject RIV: BA - General Mathematics Impact factor: 0.340, year: 2001

  15. Workshop on Artificial Intelligence Applied to Materials Discovery and Design

    Energy Technology Data Exchange (ETDEWEB)

    None

    2018-03-01

    This workshop report summarizes the presentations, panel discussions, and breakout group discussions that took place at this event. Note that the results presented here are a snapshot of the viewpoints expressed by the experts who attended the workshop and do not necessarily reflect those of the broader materials development community.

  16. Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions

    Science.gov (United States)

    Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

    2015-12-01

    Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

  17. On strength design using free material subjected to multiple load cases

    DEFF Research Database (Denmark)

    Pedersen, Pauli; Pedersen, Niels Leergaard

    2013-01-01

    Multiple load cases and the consideration of strength is a reality that most structural designs are exposed to. Improved possibility to produce specific materials, say by fiber lay-up, put focus on research on free material optimization. A formulation for such design problems together with a prac......Multiple load cases and the consideration of strength is a reality that most structural designs are exposed to. Improved possibility to produce specific materials, say by fiber lay-up, put focus on research on free material optimization. A formulation for such design problems together...... with a practical recursive design procedure is presented and illustrated with examples. The presented finite element analysis involve many elements as well as many load cases. Separating the local amount of material from a description with unit trace for the local anisotropy, gives the free materials formulation...

  18. The innovative application studty on eco-packaging design and materials

    OpenAIRE

    Cui Yong Min; Ren Xin Guang

    2016-01-01

    The paper solves the increasingly deteriorate environmental problems by positively exploring how to utilize and develop eco-packaging design reasonably. The paper explores an effective method that combines eco-packaging and environmental protection materials, hoping to define the sustainable development road of packaging design. The paper is centered on the design application of eco-packaging and environmental protection materials, applies and analyzes the method to obtain innovative design r...

  19. Laser-tissue soldering with biodegradable polymer films in vitro: film surface morphology and hydration effects.

    Science.gov (United States)

    Sorg, B S; Welch, A J

    2001-01-01

    Previous research introduced the concept of using biodegradable polymer film reinforcement of a liquid albumin solder for improvement of the tensile strength of repaired incisions in vitro. In this study, the effect of creating small pores in the PLGA films on the weld breaking strength is studied. Additionally, the effect of hydration on the strength of the reinforced welds is investigated. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with an 806-nm CW diode laser. A poly(DL-lactic-co-glycolic acid) (PLGA) film was used to reinforce the solder (the controls had solder but no reinforcement). Breaking strengths were measured acutely and after hydration in saline for 1 and 2 days. The data were analyzed by ANOVA (P < 0.05) and multiple comparisons of means were performed using the Newman-Keuls test. The creation of pores in the PLGA films qualitatively improved the film flexibility without having an apparent adverse effect on the breaking strength, while the actual technique of applying the film and solder had more of an effect. The acute maximum average breaking strengths of some of the film reinforced specimens (114.7 g-134.4 g) were significantly higher (P < 0.05) than the acute maximum average breaking strength of the unreinforced control specimens (68.3 g). Film reinforced specimens were shown to have a statistically significantly higher breaking strength than unreinforced controls after 1- and 2-day hydration. Reinforcement of liquid albumin solders in laser-assisted incision repair appears to have advantages over conventional methods that do not reinforce the cohesive strength of the solder in terms of acute breaking strength and after immersion in moist environments for short periods of time. Using a film with the solder applied to one surface only may be advantageous over other techniques.

  20. The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

    Energy Technology Data Exchange (ETDEWEB)

    Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: Peter.Svec@savba.sk [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)

    2013-06-01

    The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

  1. Recent progress in supercapacitors: from materials design to system construction.

    Science.gov (United States)

    Wang, Yonggang; Xia, Yongyao

    2013-10-04

    Supercapacitors are currently attracting intensive attention because they can provide energy density by orders of magnitude higher than dielectric capacitors, greater power density, and longer cycling ability than batteries. The main challenge for supercapacitors is to develop them with high energy density that is close to that of a current rechargeable battery, while maintaining their inherent characteristics of high power and long cycling life. Consequently, much research has been devoted to enhance the performance of supercapacitors by either maximizing the specific capacitance and/or increasing the cell voltage. The latest advances in the exploration and development of new supercapacitor systems and related electrode materials are highlighted. Also, the prospects and challenges in practical application are analyzed, aiming to give deep insights into the material science and electrochemical fields. Copyright © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  2. Monolithic silica aerogel - material design on the nano-scale

    DEFF Research Database (Denmark)

    Jensen, Karsten Ingerslev; Schultz, Jørgen Munthe; Kristiansen, Finn Harken

    structure of aerogel could be used for gas filters in the 20 to 100 nm region. - The sound velocity within aerogel is in the range of 100 to 300 m/s, which should be one of lowest for an inorganic material. Due to the low density, low acoustic impedance of aerogel could help boost the efficiency...... of piezoelectric transducers. - Other applications could be; waste encapsulation, spacers for vacuum insulation panels, membranes, etc. Department of Civil Engineering is co-ordinator of a current EU FP5 research project1, which deals with the application of aerogel as transparent insulation materials in windows....... Due to the excellent optical and thermal properties of aerogel, it is possible to develop windows with both high insulation and high transmittance, which is impossible applying the conventional window techniques, i.e. extra layers of glass, low-e coatings and gas fillings. It can be shown...

  3. Design and analysis of doped left-handed materials

    International Nuclear Information System (INIS)

    Zhang Hongxin; Bao Yongfang; Chen Tianming; Lü Yinghua; Wang Haixia

    2008-01-01

    We devise three sorts of doped left-handed materials (DLHMs) by introducing inductors and capacitors into the traditional left-handed material (LHM) as heterogeneous elements. Some new properties are presented through finite-difference time-domain (FDTD) simulations. On the one hand, the resonance in the traditional LHM is weakened and the original pass band is narrowed by introducing inductors. On the other hand, the original pass band of the LHM can be shifted and a new pass band can be generated by introducing capacitors. When capacitors and inductors are introduced simultaneously, the resonance of traditional LHM is somewhat weakened and the number of original pass bands as well as its bandwidth can be changed

  4. Biomimetic Structural Materials: Inspiration from Design and Assembly.

    Science.gov (United States)

    Yaraghi, Nicholas A; Kisailus, David

    2018-04-20

    Nature assembles weak organic and inorganic constituents into sophisticated hierarchical structures, forming structural composites that demonstrate impressive combinations of strength and toughness. Two such composites are the nacre structure forming the inner layer of many mollusk shells, whose brick-and-mortar architecture has been the gold standard for biomimetic composites, and the cuticle forming the arthropod exoskeleton, whose helicoidal fiber-reinforced architecture has only recently attracted interest for structural biomimetics. In this review, we detail recent biomimetic efforts for the fabrication of strong and tough composite materials possessing the brick-and-mortar and helicoidal architectures. Techniques discussed for the fabrication of nacre- and cuticle-mimetic structures include freeze casting, layer-by-layer deposition, spray deposition, magnetically assisted slip casting, fiber-reinforced composite processing, additive manufacturing, and cholesteric self-assembly. Advantages and limitations to these processes are discussed, as well as the future outlook on the biomimetic landscape for structural composite materials.

  5. Biomimetic Structural Materials: Inspiration from Design and Assembly

    Science.gov (United States)

    Yaraghi, Nicholas A.; Kisailus, David

    2018-04-01

    Nature assembles weak organic and inorganic constituents into sophisticated hierarchical structures, forming structural composites that demonstrate impressive combinations of strength and toughness. Two such composites are the nacre structure forming the inner layer of many mollusk shells, whose brick-and-mortar architecture has been the gold standard for biomimetic composites, and the cuticle forming the arthropod exoskeleton, whose helicoidal fiber-reinforced architecture has only recently attracted interest for structural biomimetics. In this review, we detail recent biomimetic efforts for the fabrication of strong and tough composite materials possessing the brick-and-mortar and helicoidal architectures. Techniques discussed for the fabrication of nacre- and cuticle-mimetic structures include freeze casting, layer-by-layer deposition, spray deposition, magnetically assisted slip casting, fiber-reinforced composite processing, additive manufacturing, and cholesteric self-assembly. Advantages and limitations to these processes are discussed, as well as the future outlook on the biomimetic landscape for structural composite materials.

  6. A Design of Innovative Engineering Drawing Teaching Materials

    Science.gov (United States)

    Mujiarto; Djohar, A.; Komaro, M.

    2018-02-01

    Good teaching is influenced by several things such as effective school leaders and skilled teachers who are able to use information communication technology as a medium of learning. The purpose of this research in general is to develop innovative teaching materials in the form of multimedia animation for engineering drawing in the field of technology and engineering at vocational high school. Research method used research and development (research and development / R & D). The results showed that the E-book Multimedia Animation Engineering Drawing (E-MMAED) is easy to possess and contains complete material. Students stated that the use of E-MMAED adds to learning motivation and improves learning outcomes (student competencies). We recommend that teachers apply E-MMAED as a learning medium and create other innovations to improve student competences.

  7. Key issues in body armour: threats, materials and design

    OpenAIRE

    Horsfall, Ian

    2012-01-01

    This chapter will examine the mechanics and materials of body armour in military, police and some security related applications to protect the wearer from penetrative threats. These threats will include battlefield threats such as shell fragments and high velocity bullets, and threats to law enforcement personnel such as handgun bullets and knives. Regardless of whether the threat is a high velocity bullet, or a knife, the essential requirements of body armour are the same; first an interacti...

  8. Tool design and materials for electro sinter forging (ESF)

    DEFF Research Database (Denmark)

    Cannella, Emanuele; Nielsen, Chris Valentin

    ) process, the main requirement is the electrical current passing through the electrical conducting powder. To obtain this, a closed-die setup with electrical insulating properties was used. Furthermore, the alignment between the compacting punch and die needed to be ensured by pre-aligning or alternatively...... by using an alignment system. The present work is focused on the designing phase of a tool for the electro sinter forging of a disc, made from titanium powder. By applying a pre-alignment system, the setup resulted suitable for this application. A tool design for sintering rings is also showed....

  9. Guidelines for control room systems design. Working material. Report

    International Nuclear Information System (INIS)

    1993-01-01

    This report contains comprehensive technical and methodological information and recommendations for the benefit of Member States for advice and assistance in ''NPP control room systems'' design backfitting existing nuclear power plants and design for future stations. The term ''Control Room Systems'' refers to the entire human/machine interface for the nuclear stations - including the main control room, back-ups control room and the emergency control rooms, local panels, technical support centres, operating staff, operating procedures, operating training programs, communications, etc. Refs, figs and tabs

  10. Neutron transport in structural materials and shielding design

    International Nuclear Information System (INIS)

    Salvatores, M.

    1979-01-01

    In this paper recent development in integral Benchmark experiments and their analysis is reviewed. The main problems related to data and method assesment are also briefly reviewed. In particular, the basic data processing and multigroup structure optimization and the effects of the basic data uncertainty evaluation are stressed. The representativity of an integral experiment from the designer point of view is indicated. Moreover a procedure to deduce design oriented bias factors is outlined. Cross section adjustments are indicated as a useful tool to reduce these bias factors and their uncertainties

  11. Designs for the Evaluation of Teacher Training Materials. Report No. 2.

    Science.gov (United States)

    Okey, James R.; Ciesla, Jerome L.

    This paper describes methods to assess the impact on students of a teacher using skills learned in a training program. Three designs for assessing the effects of teacher training materials are presented: time series design, equivalent time-samples design, and posttest-only control group design. Data obtained by classroom teachers while using the…

  12. Photonic band gap materials: design, synthesis, and applications

    International Nuclear Information System (INIS)

    John, S.

    2000-01-01

    Full text: Unlike semiconductors which facilitate the coherent propagation of electrons, photonic band gap (PBG) materials execute their novel functions through the coherent localization of photons. I review and discuss our recent synthesis of a large scale three-dimensional silicon photonic crystal with a complete photonic band gap near 1.5 microns. When a PBG material is doped with impurity atoms which have an electronic transition that lies within the gap, spontaneous emission of light from the atom is inhibited. Inside the gap, the photon forms a bound state to the atom. Outside the gap, radiative dynamics in the colored vacuum is highly non Markovian. I discuss the influence of these memory effects on laser action. When spontaneous emission is absent, the next order radiative effect (resonance dipole dipole interaction between atoms) must be incorporated leading to anomalous nonlinear optical effects which occur at a much lower threshold than in ordinary vacuum. I describe the collective switching of two-level atoms near a photonic band edge, by external laser field, from a passive state to one exhibiting population inversion. This effect is forbidden in ordinary vacuum. However, in the context of a PBG material, this effect may be utilized for an all-optical transistor. Finally, I discuss the prospects for a phase sensitive, single atom quantum memory device, onto which information may be written by an external laser pulse

  13. First Materials Science Research Facility Rack Capabilities and Design Features

    Science.gov (United States)

    Cobb, S.; Higgins, D.; Kitchens, L.; Curreri, Peter (Technical Monitor)

    2002-01-01

    The first Materials Science Research Rack (MSRR-1) is the primary facility for U.S. sponsored materials science research on the International Space Station. MSRR-1 is contained in an International Standard Payload Rack (ISPR) equipped with the Active Rack Isolation System (ARIS) for the best possible microgravity environment. MSRR-1 will accommodate dual Experiment Modules and provide simultaneous on-orbit processing operations capability. The first Experiment Module for the MSRR-1, the Materials Science Laboratory (MSL), is an international cooperative activity between NASA's Marshall Space Flight Center (MSFC) and the European Space Agency's (ESA) European Space Research and Technology Center (ESTEC). The MSL Experiment Module will accommodate several on-orbit exchangeable experiment-specific Module Inserts which provide distinct thermal processing capabilities. Module Inserts currently planned for the MSL are a Quench Module Insert, Low Gradient Furnace, and a Solidification with Quench Furnace. The second Experiment Module for the MSRR-1 configuration is a commercial device supplied by MSFC's Space Products Development (SPD) Group. Transparent furnace assemblies include capabilities for vapor transport processes and annealing of glass fiber preforms. This Experiment Module is replaceable on-orbit. This paper will describe facility capabilities, schedule to flight and research opportunities.

  14. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Directory of Open Access Journals (Sweden)

    Xiuyun Zhou

    2015-10-01

    Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  15. Contamination profile on typical printed circuit board assemblies vs soldering process

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

  16. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

  17. Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

    DEFF Research Database (Denmark)

    Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper

    2009-01-01

    of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling. solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft....... The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers...

  18. Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

    CERN Document Server

    Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B

    2015-01-01

    The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

  19. How to design for transformation of behavior through interactive materiality

    NARCIS (Netherlands)

    Stienstra, J.T.; Bruns, M.; Wensveen, S.A.G.; Kuenen, C.D.

    2012-01-01

    This paper presents a design approach tackling the transformation of behavior through ‘interactive materiality’ from a phenomenological perspective. It builds upon the Interaction Frogger framework that couples action to reaction for intuitive mapping in intelligent product interaction. Through the

  20. Road Materials and Pavement Design, 30 May 2017

    CSIR Research Space (South Africa)

    De Beer, Morris

    2017-01-01

    Full Text Available and Pavement Design Vol. 18, Issue 1 2017 http://www.tandfonline.com/toc/trmp20/18/1?nav=tocList Editorial board EDITORS-IN-CHIEF Hervé Di Benedetto - University of Lyon / ENTPE, Vaulx-en-Velin, France Andrew Charles Collop - De Montfort University...

  1. Designing Cartoon as a Supplementary Material for English Structure Subject

    Science.gov (United States)

    Mina, Nurawati; Putranti, Sulistini Dwi

    2015-01-01

    Cartoon comes from an Italian word "Cartone" meaning a large paper. It is designed not only as the media to describe daily activities, but also to entertain, criticize, provoke, and even to teach people. A lot of studies have been conducted regarding the implementation of cartoon in classroom or outside classroom context. It is proven…

  2. Mapping Chemical Selection Pathways for Designing Multicomponent Alloys: an informatics framework for materials design.

    Science.gov (United States)

    Srinivasan, Srikant; Broderick, Scott R; Zhang, Ruifeng; Mishra, Amrita; Sinnott, Susan B; Saxena, Surendra K; LeBeau, James M; Rajan, Krishna

    2015-12-18

    A data driven methodology is developed for tracking the collective influence of the multiple attributes of alloying elements on both thermodynamic and mechanical properties of metal alloys. Cobalt-based superalloys are used as a template to demonstrate the approach. By mapping the high dimensional nature of the systematics of elemental data embedded in the periodic table into the form of a network graph, one can guide targeted first principles calculations that identify the influence of specific elements on phase stability, crystal structure and elastic properties. This provides a fundamentally new means to rapidly identify new stable alloy chemistries with enhanced high temperature properties. The resulting visualization scheme exhibits the grouping and proximity of elements based on their impact on the properties of intermetallic alloys. Unlike the periodic table however, the distance between neighboring elements uncovers relationships in a complex high dimensional information space that would not have been easily seen otherwise. The predictions of the methodology are found to be consistent with reported experimental and theoretical studies. The informatics based methodology presented in this study can be generalized to a framework for data analysis and knowledge discovery that can be applied to many material systems and recreated for different design objectives.

  3. Joining technologies for the 1990s: Welding, brazing, soldering, mechanical, explosive, solid-state, adhesive

    Science.gov (United States)

    Buckley, John D. (Editor); Stein, Bland A. (Editor)

    1986-01-01

    A compilation of papers presented in a joint NASA, American Society for Metals, The George Washington University, American Welding Society, and Society of Manufacturing Engineers Conference on Welding, Bonding, and Fastening at Langley Research Center, Hampton, VA, on October 23 to 25, 1984 is given. Papers were presented on technology developed in current research programs relevant to welding, bonding, and fastening of structural materials required in fabricating structures and mechanical systems used in the aerospace, hydrospace, and automotive industries. Topics covered in the conference included equipment, hardware and materials used when welding, brazing, and soldering, mechanical fastening, explosive welding, use of unique selected joining techniques, adhesives bonding, and nondestructive evaluation. A concept of the factory of the future was presented, followed by advanced welding techniques, automated equipment for welding, welding in a cryogenic atmosphere, blind fastening, stress corrosion resistant fasteners, fastening equipment, explosive welding of different configurations and materials, solid-state bonding, electron beam welding, new adhesives, effects of cryogenics on adhesives, and new techniques and equipment for adhesive bonding.

  4. Hartree-fock-slater method for materials science the DV-X alpha method for design and characterization of materials

    CERN Document Server

    Adachi, H; Kawai, J

    2006-01-01

    Molecular-orbital calculations for materials design such as alloys, ceramics, and coordination compounds are now possible for experimentalists. Molecuar-orbital calculations for the interpretation of chemical effect of spectra are also possible for experimentalists. The most suitable molecular-orbital calculation method for these purpose is the DV-Xa method, which is robust in such a way that the calculation converges to a result even if the structure of the molecule or solid is impossible in the pressure and temperature ranges on earth. This book specially addresses the methods to design novel materials and to predict the spectralline shape of unknown materials using the DV-Xa molecular-orbital method, but is also useful for those who want to calculate electronic structures of materials using any kind of method.

  5. Sustainable design guidelines to support the Washington State ferries terminal design manual : stormwater and material issues.

    Science.gov (United States)

    2011-08-01

    In an effort to assist the developers of the terminal design manual in potentially addressing : sustainable design issues, the overall goal is to produce Sustainable Design Guidelines that : will specifically address the unique needs and requirements...

  6. Decoupling interrelated parameters for designing high performance thermoelectric materials.

    Science.gov (United States)

    Xiao, Chong; Li, Zhou; Li, Kun; Huang, Pengcheng; Xie, Yi

    2014-04-15

    The world's supply of fossil fuels is quickly being exhausted, and the impact of their overuse is contributing to both climate change and global political unrest. In order to help solve these escalating problems, scientists must find a way to either replace combustion engines or reduce their use. Thermoelectric materials have attracted widespread research interest because of their potential applications as clean and renewable energy sources. They are reliable, lightweight, robust, and environmentally friendly and can reversibly convert between heat and electricity. However, after decades of development, the energy conversion efficiency of thermoelectric devices has been hovering around 10%. This is far below the theoretical predictions, mainly due to the interdependence and coupling between electrical and thermal parameters, which are strongly interrelated through the electronic structure of the materials. Therefore, any strategy that balances or decouples these parameters, in addition to optimizing the materials' intrinsic electronic structure, should be critical to the development of thermoelectric technology. In this Account, we discuss our recently developed strategies to decouple thermoelectric parameters for the synergistic optimization of electrical and thermal transport. We first highlight the phase transition, which is accompanied by an abrupt change of electrical transport, such as with a metal-insulator and semiconductor-superionic conductor transition. This should be a universal and effective strategy to optimize the thermoelectric performance, which takes advantage of modulated electronic structure and critical scattering across phase transitions to decouple the power factor and thermal conductivity. We propose that solid-solution homojunction nanoplates with disordered lattices are promising thermoelectric materials to meet the "phonon glass electron crystal" approach. The formation of a solid solution, coupled with homojunctions, allows for

  7. Efficient technique for computational design of thermoelectric materials

    Science.gov (United States)

    Núñez-Valdez, Maribel; Allahyari, Zahed; Fan, Tao; Oganov, Artem R.

    2018-01-01

    Efficient thermoelectric materials are highly desirable, and the quest for finding them has intensified as they could be promising alternatives to fossil energy sources. Here we present a general first-principles approach to predict, in multicomponent systems, efficient thermoelectric compounds. The method combines a robust evolutionary algorithm, a Pareto multiobjective optimization, density functional theory and a Boltzmann semi-classical calculation of thermoelectric efficiency. To test the performance and reliability of our overall framework, we use the well-known system Bi2Te3-Sb2Te3.

  8. Characterization of the Material Microstructure for Reactive Material Design. 3rd Quarterly Progress Report II/2008

    Science.gov (United States)

    2008-08-05

    metallic) materials, which fragment under certain dynamic loading conditions into small particles, which can chemically react with a suitable ambient ...medium, such as shock heated ambient air or hot detonation products. Such materials could be effectively used to devise new or improved weapons with...test is blue. The impacto conditions of the the center of the the opposite surfa reflection of the w Figure 6.1: Example o specimen. Another aspect

  9. A Tutorial Design Process Applied to an Introductory Materials Engineering Course

    Science.gov (United States)

    Rosenblatt, Rebecca; Heckler, Andrew F.; Flores, Katharine

    2013-01-01

    We apply a "tutorial design process", which has proven to be successful for a number of physics topics, to design curricular materials or "tutorials" aimed at improving student understanding of important concepts in a university-level introductory materials science and engineering course. The process involves the identification…

  10. Design of materials with extreme thermal expansion using a three-phase topology optimization method

    DEFF Research Database (Denmark)

    Sigmund, Ole; Torquato, S.

    1997-01-01

    We show how composites with extremal or unusual thermal expansion coefficients can be designed using a numerical topology optimization method. The composites are composed of two different material phases and void. The optimization method is illustrated by designing materials having maximum therma...

  11. 14 CFR 29.613 - Material strength properties and design values.

    Science.gov (United States)

    2010-01-01

    ... Administrator: (1) MIL—HDBK-5, “Metallic Materials and Elements for Flight Vehicle Structure”. (2) MIL—HDBK-17, “Plastics for Flight Vehicles”. (3) ANC-18, “Design of Wood Aircraft Structures”. (4) MIL—HDBK-23... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false Material strength properties and design...

  12. 14 CFR 27.613 - Material strength properties and design values.

    Science.gov (United States)

    2010-01-01

    ... Administrator: (1) MIL-HDBK-5, “Metallic Materials and Elements for Flight Vehicle Structure”. (2) MIL-HDBK-17, “Plastics for Flight Vehicles”. (3) ANC-18, “Design of Wood Aircraft Structures”. (4) MIL-HDBK-23... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false Material strength properties and design...

  13. Designing Web-Based Educative Curriculum Materials for the Social Studies

    Science.gov (United States)

    Callahan, Cory; Saye, John; Brush, Thomas

    2013-01-01

    This paper reports on a design experiment of web-based curriculum materials explicitly created to help social studies teachers develop their professional teaching knowledge. Web-based social studies curriculum reform efforts, human-centered interface design, and investigations into educative curriculum materials are reviewed, as well as…

  14. Growing grass: a smart material interactive display, design and construction history

    NARCIS (Netherlands)

    Minuto, A.; Nijholt, Antinus

    2012-01-01

    In this paper we will present the design process and development of "Follow the Grass", our smart material interactive pervasive display, with related technical detailed explanation. We will present the design steps and prototypes with instructions for the use of smart materials (NiTiNOL) to create

  15. Creativity and innovations in ELT materials development looking beyond the current design

    CERN Document Server

    Bao, Dat

    2018-01-01

    This book challenges current practices in ELT materials design in order to transform coursebook quality. It proposes ways to improve task design through resources such as drama, poetry, literature and online resources; and it maps out a number of unusual connections between theory and practice in the field of ELT materials development.

  16. Virtual Welded - Joint Design Integrating Advanced Materials and Processing Technology

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Zhishang; Ludewig, Howard W.; Babu, S. Suresh

    2005-06-30

    Virtual Welede-Joint Design, a systematic modeling approach, has been developed in this project to predict the relationship of welding process, microstructure, properties, residual stress, and the ultimate weld fatique strength. This systematic modeling approach was applied in the welding of high strength steel. A special welding wire was developed in this project to introduce compressive residual stress at weld toe. The results from both modeling and experiments demonstrated that more than 10x fatique life improvement can be acheived in high strength steel welds by the combination of compressive residual stress from the special welding wire and the desired weld bead shape from a unique welding process. The results indicate a technology breakthrough in the design of lightweight and high fatique performance welded structures using high strength steels.

  17. Design of responsive materials using topologically interlocked elements

    International Nuclear Information System (INIS)

    Molotnikov, A; Gerbrand, R; Qi, Y; Simon, G P; Estrin, Y

    2015-01-01

    In this work we present a novel approach to designing responsive structures by segmentation of monolithic plates into an assembly of topologically interlocked building blocks. The particular example considered is an assembly of interlocking osteomorphic blocks. The results of this study demonstrate that the constraining force, which is required to hold the blocks together, can be viewed as a design parameter that governs the bending stiffness and the load bearing capacity of the segmented structure. In the case where the constraining forces are provided laterally using an external frame, the maximum load the assembly can sustain and its stiffness increase linearly with the magnitude of the lateral load applied. Furthermore, we show that the segmented plate with integrated shape memory wires employed as tensioning cables can act as a smart structure that changes its flexural stiffness and load bearing capacity in response to external stimuli, such as heat generated by the switching on and off an electric current. (paper)

  18. Materials selection and design of microelectrothermal bimaterial actuators

    OpenAIRE

    Prasanna, S.; Spearing, S.M.

    2007-01-01

    A common form of MEMS actuator is a thermally actuated bimaterial, which is easy to fabricate by surface micromachining and permits out of plane actuation, which is otherwise difficult to achieve. This paper presents an analytical framework for the design of such microelectrothermal bimaterial actuators. Mechanics relationships for a cantilever bimaterial strip subjected to a uniform temperature were applied to obtain expressions for performance metrics for the actuator, i.e., maximum work/vo...

  19. REVIEW KONSEP RESPONSIVE DESIGN DENGAN FRAMEWORK MATERIALIZE PADA WEBSITE

    OpenAIRE

    Cindy Novianty

    2017-01-01

    Responsive web design merupakan sebuah desain website yang dapat menyesuaikan tiap ukuran pada tiap device. Berdasarkan hasil dari beberapa responden menyatakan 62% responden setuju jika beberapa website yang belum mampu menyesuaikan ukuran tampilan web, 54% responden setuju bahwa desain yang responsive mempengaruhi faktor kenyamanan responden, 60% responden setuju bahwa konten utama dan fungsionalitas dari website yang sulit diakses melalui perangkat mobile, 56% responden setuju bahwa tampil...

  20. Materials and Designs for High-Efficacy LED Light Engines

    Energy Technology Data Exchange (ETDEWEB)

    Ibbetson, James [Cree, Inc., Durham, NC (United States); Gresback, Ryan [Cree, Inc., Durham, NC (United States)

    2017-09-28

    Cree, Inc. conducted a narrow-band downconverter (NBD) materials development and implementation program which will lead to warm-white LED light engines with enhanced efficacy via improved spectral efficiency with respect to the human eye response. New red (600-630nm) NBD materials could result in as much as a 20% improvement in warm-white efficacy at high color quality relative to conventional phosphor-based light sources. Key program innovations included: high quantum yield; narrow peak width; minimized component-level losses due to “cross-talk” and light scattering among red and yellow-green downconverters; and improved reliability to reach parity with conventional phosphors. NBD-enabled downconversion efficiency gains relative to conventional phosphors yielded an end-of-project LED light engine efficacy of >160 lm/W at room temperature and 35 A/cm2, with a correlated color temperature (CCT) of ~3500K and >90 CRI (Color Rending Index). NBD-LED light engines exhibited equivalent luminous flux and color point maintenance at >1,000 hrs. of highly accelerated reliability testing as conventional phosphor LEDs. A demonstration luminaire utilizing an NBD-based LED light engine had a steady-state system efficacy of >150 lm/W at ~3500K and >90 CRI, which exceeded the 2014 DOE R&D Plan luminaire milestone for FY17 of >150 lm/W at just 80 CRI.