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Sample records for soldering conference papers

  1. Conference Papers

    International Nuclear Information System (INIS)

    2003-01-01

    A total of 18 papers were presented at the 2003 Annual Executive Conference of the Canadian Gas Association held at St. Andrews, NB, from June 25th to June 28th. Titles of the presentations were as follows: (1) 'Positioning natural gas in a transforming world' by Pierre Marcel Desjardins; (2) 'Positioning natural gas in a transforming world' by Jean-Paul Theoret; (3) 'Perceptions of natural gas' by Noel Sampson; (4) 'Energy efficiency as an opportunity for the natural gas industry' by Peter Love; (5) 'Natural gas R and D - NRCan perspective' by Graham R. Campbell; (6) 'Impact of earned media on corporate perceptions in the gas industry' by Michael Coates; (7) 'Moving forward with an initiative for natural gas technology innovation' by Emmanuel Morin; (8) 'Natural gas R and D - No more dodging the issue' by Chuck Szmurlo; (9) 'Meeting the technology needs of the gas industry and the gas consumer' by Stanley S. Borys; (10) 'Market signals' by John Wellard; (11) 'Future sources of Canadian natural gas' by Rick Hyndman; (12) 'The state of supply: Northeast U.S. perspective' by Tom Kiley; (13) 'AGA's priorities and perspectives' by Dick Reiten; (14) 'Global energy issues: Recent development in policy and business' by Gerald Doucet; (15) 'Keeping the distribution cart behind the horse: Why finding more offshore gas is much more important than completing the natural gas grid, including for New Brunswick' by Brian Lee Crowley; (16) 'Environmental opportunities and challenges for the gas industry' by Manfred Klein; (17) 'The potential for natural gas demand destruction' by Timothy Partridge; and (18) 'Pushing the envelope on gas supply' by Roland R. George. In most instances only speaking notes and view graphs are available

  2. Corrosion/96 conference papers

    International Nuclear Information System (INIS)

    Anon.

    1996-01-01

    Topics covered by this conference include: cathodic protection in natural waters; cleaning and repassivation of building HVAC systems; worldwide opportunities in flue gas desulfurization; advancements in materials technology for use in oil and gas service; fossil fuel combustion and conversion; technology of corrosion inhibitors; computers in corrosion control--modeling and information processing; recent experiences and advances of austenitic alloys; managing corrosion with plastics; corrosion measurement technology; corrosion inhibitors for concrete; refining industry; advances in corrosion control for rail and tank trailer equipment; CO 2 corrosion--mechanisms and control; microbiologically influenced corrosion; corrosion in nuclear systems; role of corrosion in boiler failures; effects of water reuse on monitoring and control technology in cooling water applications; methods and mechanisms of scale and deposit control; corrosion detection in petroleum production lines; underground corrosion control; environmental cracking--relating laboratory results and field behavior; corrosion control in reinforced concrete structures; corrosion and its control in aerospace and military hardware; injection and process addition facilities; progress reports on the results of reinspection of deaerators inspected or repaired per RP0590 criteria; near 100% volume solids coating technology and application methods; materials performance in high temperature environments containing halides; impact of toxicity studies on use of corrosion/scale inhibitors; mineral scale deposit control in oilfield related operations; corrosion in gas treating; marine corrosion; cold climate corrosion; corrosion in the pulp and paper industry; gaseous chlorine alternatives in cooling water systems; practical applications of ozone in recirculating cooling water systems; and water reuse in industry. Over 400 papers from this conference have been processed separately for inclusion on the data base

  3. Corrosion/94 conference papers

    International Nuclear Information System (INIS)

    Anon.

    1994-01-01

    The approximately 500 papers from this conference are divided into the following sections: Rail transit systems--stray current corrosion problems and control; Total quality in the coatings industry; Deterioration mechanisms of alloys at high temperatures--prevention and remediation; Research needs and new developments in oxygen scavengers; Computers in corrosion control--knowledge based system; Corrosion and corrosivity sensors; Corrosion and corrosion control of steel reinforced concrete structures; Microbiologically influenced corrosion; Practical applications in mitigating CO 2 corrosion; Mineral scale deposit control in oilfield-related operations; Corrosion of materials in nuclear systems; Testing nonmetallics for life prediction; Refinery industry corrosion; Underground corrosion control; Mechanisms and applications of deposit and scale control additives; Corrosion in power transmission and distribution systems; Corrosion inhibitor testing and field application in oil and gas systems; Decontamination technology; Ozone in cooling water applications, testing, and mechanisms; Corrosion of water and sewage treatment, collection, and distribution systems; Environmental cracking of materials; Metallurgy of oil and gas field equipment; Corrosion measurement technology; Duplex stainless steels in the chemical process industries; Corrosion in the pulp and paper industry; Advances in cooling water treatment; Marine corrosion; Performance of materials in environments applicable to fossil energy systems; Environmental degradation of and methods of protection for military and aerospace materials; Rail equipment corrosion; Cathodic protection in natural waters; Characterization of air pollution control system environments; and Deposit-related problems in industrial boilers. Papers have been processed separately for inclusion on the data base

  4. Corrosion/95 conference papers

    International Nuclear Information System (INIS)

    Anon.

    1995-01-01

    The papers in this conference represent the latest technological advances in corrosion control and prevention. The following subject areas are covered: cathodic protection in natural waters; materials for fossil fuel combustion and conversion systems; modern problems in atmospheric corrosion; innovative ideas for controlling the decaying infrastructure; deposits and their effects on corrosion in industry; volatile high temperature and non aqueous corrosion inhibitors; corrosion of light-weight and precoated metals for automotive application; refining industry corrosion; corrosion in pulp and paper industry; arctic/cold weather corrosion; materials selection for waste incinerators and associated equipment; corrosion measurement technology; environmental cracking of materials; advancing technology in the coating industry; corrosion in gas treating; green inhibition; recent advances in corrosion control of rail equipment; velocity effects and erosion corrosion in oil and gas production; marine corrosion; corrosion of materials in nuclear systems; underground corrosion control; corrosion in potable and industrial water systems in buildings and its impact on environmental compliance; deposit related boiler tube failures; boiler systems monitoring and control; recent developments and experiences in reactive metals; microbiologically influenced corrosion; corrosion and corrosion control for steel reinforced concrete; international symposium on the use of 12 and 13 Cr stainless steels in oil and gas production environments; subsea corrosion /erosion monitoring in production facilities; fiberglass reinforced pipe and tubulars in oilfield service; corrosion control technology in power transmission and distribution; mechanisms and methods of scale and deposit control; closing the loop -- results oriented cooling system monitoring and control; and minimization of aqueous discharge

  5. 1982 Australian coal conference papers

    Energy Technology Data Exchange (ETDEWEB)

    1982-01-01

    This third Australian coal conference included papers discussing the market for coal, finance and investment, use of computers, mining, coal research, coal preparation and waste disposal, marketing and trade, and the transport of coal. All papers have been individually abstracted.

  6. CEM 2009. Conference papers

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2009-07-01

    Papers are presented under the following session headings: emission factors and inventories; certifications and accreditation; PM10/2.5; advanced techniques; and QA/QC. Some of the papers are only the overheads/viewgraphs of the presentation.

  7. 1980 Australian coal conference. Conference papers

    Energy Technology Data Exchange (ETDEWEB)

    1980-01-01

    Papers were presented under the following headings: supply and demand for coal; government policies - coal development; mining finance and taxation; Australian coal mining practices; research and development; infrastructure and transportation; legislation and safe working practices; and industrial relations.

  8. National Physics Conference. Paper Abstracts

    International Nuclear Information System (INIS)

    Marinela Dumitriu, Editorial Coordination.

    1995-01-01

    This book contains the abstracts of the proceedings of the annual Romanian Physics Conference organized by Romanian Physics Society. The conference was held on November 30 to December 2, 1995 in the city of Baia Mare. It was organized in the following nine sections: 1 - Astrophysics, Particle Physics, Nuclear Physics, Molecular and Atomic Physics; 2 - Plasma Physics; 3 - Biophysics; 4 - Technical Physics; 5 - Theoretical Physics; 6 -The Physics of Energy; 7 - The Physics of Environment 8 - Solid State Physics; 9 - Optical and Quantum Electronics. The full texts can be obtained on request from the Romanian Physical Society or directly from authors

  9. The Roles of Conference Papers in IS

    DEFF Research Database (Denmark)

    Lanamäki, Arto; Persson, John Stouby

    2016-01-01

    Information Systems (IS) research has both a journal-oriented publication culture and a rich plethora of conferences. It is unclear why IS researchers even bother with conference publishing given the high focus on journals. Against this backdrop, the purpose of this paper is to increase our...... understanding of conference papers in IS and the role they play for the authoring researchers. We present the first analysis of the papers published during the first six years (2010-2015) in the Scandinavian Conference on Information Systems (SCIS). We conducted interviews with ten SCIS authors. Following...... a framework adopted from Åkerlind [1], we identified how SCIS papers have the roles of fulfilling requirements, establishing oneself, developing personally, enabling change, and other roles. This article contributes to the reflection literature on the IS field by applying a practice lens to understand...

  10. Papers presented at congresses and conferences - 1992

    International Nuclear Information System (INIS)

    1993-12-01

    Empresarios Agrupados (EA) is a leading engineering organization in Spain with significant international experience. EA provides consulting, engineering, procurement, construction management and operation support services for the power industry, power generation and transmission and other engineering areas. These paper are a collection of presentations made on conferences and congresses in 1992

  11. Proceedings of papers. 3. Balkan Metallurgical Conference

    International Nuclear Information System (INIS)

    Mickovski, Jovan

    2003-01-01

    This Conference aims to be a central event in the metallurgy research of Balkan, fulfilling the goals to present the most outstanding relevant developments in modern metallurgy; to inspire high standards of excellence in pure and applied metallurgy research; to attract outstanding scientists to present central lectures on modem metallurgical research, and on the challenges imposed by the needs of society; to inspire the young generation of metallurgists in Balkan and other countries. Following these lines, the 3. Balkan Conference on Metallurgy will provide a unique opportunity for academic and industrial metallurgists from the Balkan countries and wider, to exchange ideas, expertise, and experience on topics related to the theme of the Conference - Balkan Metallurgy in Search for New Ways of Development. The aim of the organizers was to bring together distinguished experts, not only to present their work, but also to discuss the major scientific and technological challenges facing metallurgy in this millennium.The 6 sections of the conference were entitled: Section A: Extractive metallurgy; Section B: Physical metallurgy and materials science - ferrous metals and non ferrous metals; Section C: Management, maintenance control and optimization of metallurgical processes; Section D: New technologies and techniques; Section E: Refractory and powder; Section F: Corrosion and protection of metals. Papers relevant to INIS are indexed separately

  12. Combinatorics Advances : Papers from a Conference

    CERN Document Server

    Mahmoodian, Ebadollah

    1995-01-01

    On March 28~31, 1994 (Farvardin 8~11, 1373 by Iranian calendar), the Twenty­ fifth Annual Iranian Mathematics Conference (AIMC25) was held at Sharif University of Technology in Tehran, Islamic Republic of Iran. Its sponsors in~ eluded the Iranian Mathematical Society, and the Department of Mathematical Sciences at Sharif University of Technology. Among the keynote speakers were Professor Dr. Andreas Dress and Professor Richard K. Guy. Their plenary lec~ tures on combinatorial themes were complemented by invited and contributed lectures in a Combinatorics Session. This book is a collection of refereed papers, submitted primarily by the participants after the conference. The topics covered are diverse, spanning a wide range of combinatorics and al~ lied areas in discrete mathematics. Perhaps the strength and variety of the pa~ pers here serve as the best indications that combinatorics is advancing quickly, and that the Iranian mathematics community contains very active contributors. We hope that you find the p...

  13. Soldering handbook

    CERN Document Server

    Vianco, Paul T

    1999-01-01

    Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

  14. 5. TRIGA owners' conference. Papers and abstracts

    International Nuclear Information System (INIS)

    1977-01-01

    The main topics of the Conference are: research reactor licensing and regulation; standards and public relations programs; operating problems and operating programs of research reactors; security requirements for TRIGA reactors

  15. 4. TRIGA owners' conference. Papers and abstracts

    International Nuclear Information System (INIS)

    1976-01-01

    The Conference covers the following aspects of TRIGA reactors operation: fuel utilization; TRIGA design and startup tests radiation release and unusual occurrences; operating experience; design of experimental facilities and instruments

  16. 3. TRIGA owners' conference. Papers and abstracts

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1974-07-01

    The TRIGA Owners' Conference III was held February 25-27, 1974, in Albuquerque, New Mexico. Seventy representatives were in attendance from 26 TRIGA facilities in the United States, Mexico, Puerto Rico, Indonesia, and from interested government agencies and industrial concerns. The main topics, discussed at the Conference were: TRIGA operating experiences; analytical and experimental methods; limits on effluents release for research reactor; and TRIGA modifications.

  17. 3. TRIGA owners' conference. Papers and abstracts

    International Nuclear Information System (INIS)

    1974-01-01

    The TRIGA Owners' Conference III was held February 25-27, 1974, in Albuquerque, New Mexico. Seventy representatives were in attendance from 26 TRIGA facilities in the United States, Mexico, Puerto Rico, Indonesia, and from interested government agencies and industrial concerns. The main topics, discussed at the Conference were: TRIGA operating experiences; analytical and experimental methods; limits on effluents release for research reactor; and TRIGA modifications

  18. 6. European conference of TRIGA reactor users. Conference papers

    International Nuclear Information System (INIS)

    1980-01-01

    The Sixth European Conference of TRIGA Users was held in September 1980, in Mainz, Germany under the joint sponsorship of INTERATOM and the Institut fur Kernchemie. The main areas of discussions were: Fuel cycle aspects; New reactor developments and improvements; TRIGA applications; Operating and maintenance experiences and Instrumentation

  19. 7. European conference of TRIGA reactor users. Conference papers

    International Nuclear Information System (INIS)

    1982-01-01

    At the Seventh European Conference of TRIGA Users, held in September 1982, in Istanbul, Turkey, the following aspects are discussed: safety aspects of TRIGA reactors; developments and improvements; operating and maintenance experiences; applications; reactor calculations; fuel cycle aspects and research programs

  20. 7. European conference of TRIGA reactor users. Conference papers

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1982-07-01

    At the Seventh European Conference of TRIGA Users, held in September 1982, in Istanbul, Turkey, the following aspects are discussed: safety aspects of TRIGA reactors; developments and improvements; operating and maintenance experiences; applications; reactor calculations; fuel cycle aspects and research programs.

  1. Selected Papers Presented at MODSIM World 2011 Conference and Expo

    Science.gov (United States)

    Pinelli, Thomas E. (Compiler); Bullock, Leanna S. (Compiler)

    2012-01-01

    Selected papers from MODSIM World 2011 Conference & Expo are contained in this NASA Conference Publication (CP). MODSIM World 2011 was held in Virginia Beach, Virginia, October 11-14, 2011. The theme of the 2011 conference & expo was "Overcoming Critical Global Challenges with Modeling & Simulation". The conference program consisted of five technical tracks - Defense, Homeland Security & First Responders; Education; Health & Medicine; The Human Dimension; and Serious Games & Virtual Worlds.

  2. European TRIGA owners' conference. Papers and abstracts

    International Nuclear Information System (INIS)

    1970-01-01

    The conference covers the following topics, concerning TRIGA reactors: Experience in the Operation and Maintenance and utilization of TRIGA reactors; reactor upgrading; irradiation facilities; fuel management; air-concentration measurements; nuclear tests; use of TRIGA in nuclear medicine and biology; reactor design, fuel and performance; failures and other research activities

  3. Papers of the 2005 PSAC spring conference

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2005-07-01

    Workplace safety and personnel management issues facing the petroleum industry were addressed at this conference. As a learning event for petroleum service company personnel, it focused on providing delegates with the most current information and training issues affecting the petroleum service industry. A broad range of topics were presented under the 3 key areas of transportation operations, transportation management and human capital management. Issues pertaining to transportation operations included vehicle monitoring systems; journey management; GPS technology; nutritional health; resolving issues with difficult people; workplace safety; initiatives in back pain; and heavy hauling. Issues pertaining to transportation management included workers rights and responsibilities; ethical choices; and compliance management through automation. Issues pertaining to human capital management included work-life balance; sourcing employees; risk management in hiring practices; employee attitudes; drug use at work; and personnel management. The conference featured 29 presentations of which 3 have been catalogued separately for inclusion in this database. refs., tabs., figs.

  4. Papers of the 2004 PSAC spring conference

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2004-07-01

    This conference provided a forum for industry leaders to discuss current regulatory, legislative and other issues facing the petroleum industry. As a learning event for petroleum service company personnel, it focused on providing delegates with the most current insight, information and training issues affecting the petroleum service industry. The wide range of topics were presented under 3 key areas, transportation operations, transportation management and human capital management. Issues pertaining to transportation operations included: privacy legislation; the impact of fatigue on work performance; workplace injuries; cleaning up spills; road safety; and, occupational competencies. Issues pertaining to transportation management included drug/alcohol testing and managing fleet insurance. Issues pertaining to human capital management included: skills required for effective supervision and leadership; employment rules and standards that apply to business; and engaging employees. The conference featured 12 presentations. refs., tabs., figs.

  5. Managing the exploration process: conference papers

    International Nuclear Information System (INIS)

    1999-01-01

    The conference includes eight articles on the theme of the meeting including: I - creating an environment that fosters exploration and development ideas; II - integrating a global perspective when setting objectives for exploration planning; III - practical issues is setting exploration objectives; IV - portfolio analysis of exploration prospect of ideas; V - the effective presentation of exploration prospects; V I - the future of information management; VII - assessing exploration assets; and V III - environmental and regulatory considerations when planning an exploratory well. Individual articles indexed/abstracted separately include: articles I, II, III, VII, and V III

  6. Papers from the International Conference on Comparative ...

    African Journals Online (AJOL)

    on different specific themes and four poster sessions gener- ally coordinated with each day's themes. The following nine papers are a representative sample of both plenary and review papers presented. Comparative animal physiology and biochemistry are areas of study largely concerned with the ways in which diverse.

  7. Nineteenth International Cosmic Ray Conference papers. General index, volume 10

    International Nuclear Information System (INIS)

    Jones, F.C.

    1986-07-01

    These volumes contain papers submitted for presentation at the 19th International Cosmic Ray Conference held on the campus of the University of California, San Diego, in La Jolla, CA, Aug. 11-23, 1985. The present volume contains a complete author index for volumes 1 through 9 and a list of the names and addresses of all those who attended the conference

  8. Twelfth European TRIGA users conference. Papers and abstracts

    International Nuclear Information System (INIS)

    2008-01-01

    The Twelfth European TRIGA Users Conference was held in Pitesti, Romania, on September 28 - October 1, 1992, under the sponsorship of the Institute for Nuclear Research. The papers which follow in this document are presented in the same order as listed in the Conference Program. All papers which were received for publication (44) have been included. Those papers which were presented but not received for publication are presented in abstract form (3). The European TRIGA9 Owners' Group was fortunate to be hosted by the owners and users of the world's largest TRIGA reactor - the 14-MW Romanian research and test reactor. For too many years it has been impossible to enjoy open interactions with the Romanian researchers. By hosting the 1992 European TRIGA Users' Conference in Romania, the Romanians accomplished a breakthrough in the exchange of TRIGA reactor technology. It was very interesting for the Conference attendees from the West to learn about the large scope of excellent work conducted in Romania, especially at the Institute of Nuclear Research in Pitesti. Similarly, it was fortunate that a large attendance of Romanian researchers from many institutes, universities, and government agencies could attend the Conference and interact with their counterparts from outside Romania. The proceedings of the conference were structured onto the following 6 subject matters: - Opening Session and Introduction; - Session I, Operating and Maintenance Experience (10 papers); - Session II, Reactor Physics And Fuel Utilization (11 papers); - Session III, Instrumentation and Control (5 papers); - Session IV, Irradiation Facilities, Experimental Accessories (8 papers); - Session V, Applications, New Development of TRIGA Concept (6 papers). The document is completed with the abstracts of 3 contributions. A number of 19 experts from Austria, Germany, Italy, United States, Turkey, Morocco, England, Slovenia and Albania, that use TRIGA reactors, and Romania attended the conference. The

  9. Conference papers of POWER-GEN '93: Book 2

    International Nuclear Information System (INIS)

    Anon.

    1993-01-01

    The 6th International Conference and Exhibition for the Power Generating Industries was held November 17--19, 1993 in Dallas, Texas. The conference provided a forum for exchange of state-of-the-art information on power generation. Major topics of discussion include the following: environmental issues and technologies; and Clean Air Act compliance. Individual papers have been processed separately for inclusion in the appropriate data bases

  10. Ethical and Stylistic Implications in Delivering Conference Papers.

    Science.gov (United States)

    Enos, Theresa

    1986-01-01

    Analyzes shortcomings of conference papers intended for the eye rather than the ear. Referring to classical oratory, speech act theory, and cognitive theory, recommends revising papers for oral presentation by using classical disposition; deductive rather than inductive argument; formulaic repetition of words and phrases; non-inverted clause…

  11. Tourism researcher wins Best Paper Award at international conference

    OpenAIRE

    Ho, Sookhan

    2010-01-01

    Nancy McGehee, associate professor of hospitality and tourism management research at the Pamplin College of Business at Virginia Tech, received a 2010 Best Paper Award at the recent ATLAS (Association for Tourism and Leisure Education) International Conference on Sustainable Tourism.

  12. IFLA General Conference, 1986. Bibliographic Control Division. Section: Cataloguing. Papers.

    Science.gov (United States)

    International Federation of Library Associations and Institutions, The Hague (Netherlands).

    Papers on cataloging which were presented at the 1986 International Federation of Library Associations (IFLA) conference include: (1) "Cataloging of Government Documents in the Age of Automation" (Chong Y. Yoon, United States), which discusses the use of MARC (Machine-Readable Cataloging) formats to integrate government documents into…

  13. IFLA General Conference, 1986. Bibliographic Control Division. Section: Bibliography. Papers.

    Science.gov (United States)

    International Federation of Library Associations and Institutions, The Hague (Netherlands).

    Papers on bibliographic control presented at the 1986 International Federation of Library Associations (IFLA) conference include: (1) "Bibliographic Interchange/Coordination in Southeast Asia (Huck Tee Lim, Malaysia); (2) "Project for 'Chinese National Bibliography' and Its Progress" (Huang Jungui, China); (3) "Subject…

  14. Spontaneous soldering

    International Nuclear Information System (INIS)

    Percacci, R.

    1984-01-01

    It is proposed that the soldering form of general relativity be treated as a dynamical variable. This gives rise to the possibility of treating the linear connection on (n-dimensional) spacetime and an internal O(k)-Yang-Mills field as different components of the same O(N) gauge field (N= n+k). The distinction between gravitational and Yang-Mills interactions is due to a kind of Higgs mechanism driven by the vacuum expectation value of the soldering form. (orig.)

  15. International conference on topical issues in nuclear safety. Contributed papers

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2001-07-01

    The objective of the Conference was to foster the exchange of information on topical issues in nuclear safety, with the aim of consolidating an international consensus on the present status of these issues, priorities for future work, and needs for strengthening international cooperation, including the IAEA recommendations for future activities. This book contains concise contributed papers submitted on issues falling within the thematic scope of the Conference: risk informed decision making, influence of external factors on safety, safety of fuel cycle facilities, safety of research reactors, and safety performance indicators.

  16. International conference on topical issues in nuclear safety. Contributed papers

    International Nuclear Information System (INIS)

    2001-01-01

    The objective of the Conference was to foster the exchange of information on topical issues in nuclear safety, with the aim of consolidating an international consensus on the present status of these issues, priorities for future work, and needs for strengthening international cooperation, including the IAEA recommendations for future activities. This book contains concise contributed papers submitted on issues falling within the thematic scope of the Conference: risk informed decision making, influence of external factors on safety, safety of fuel cycle facilities, safety of research reactors, and safety performance indicators

  17. Soldering in electronics assembly

    CERN Document Server

    Judd, Mike

    2013-01-01

    Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

  18. SMT soldering handbook

    National Research Council Canada - National Science Library

    Strauss, Rudolf

    1998-01-01

    ... 3.2.1 Constituents, melting behaviour and mechanical properties 3.2.2 Composition of solders for use in electronics 3.2.3 Lead-free solders 3.2.4 Solder impurities The soldered joint 3.3.1 Solde...

  19. Efforts to Develop a 300°C Solder

    Energy Technology Data Exchange (ETDEWEB)

    Norann, Randy A [Perma Works LLC

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  20. 9. European TRIGA users' conference. Papers and abstracts

    International Nuclear Information System (INIS)

    1986-01-01

    Operation and maintenance experience, new developments and improvements of TRIGA reactors, fuel management, radiation protection, licensing, uses for research and isotope production are discussed at the Conference

  1. 4. European conference of TRIGA users. Papers and abstracts

    International Nuclear Information System (INIS)

    1976-01-01

    The main topics of the Conference are: TRIGA operating experience special experimental and maintenance experience; activation analysis and isotope production; research programs; special instrumentation testing and other TRIGA specific topics

  2. 4. European conference of TRIGA users. Papers and abstracts

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1976-07-01

    The main topics of the Conference are: TRIGA operating experience special experimental and maintenance experience; activation analysis and isotope production; research programs; special instrumentation testing and other TRIGA specific topics.

  3. 5. European conference of TRIGA users. Papers and abstracts

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1978-07-01

    The main conference topics were: Operation and maintenance experience of the TRIGA reactors; Development of new Low Enrichment Fuels (LEU); Dose assessments noble gas releases; Radiation protection and dosimetry measurements; Research reactors programs and experiments; and Application of TRIGA reactors.

  4. 5. European conference of TRIGA users. Papers and abstracts

    International Nuclear Information System (INIS)

    1978-01-01

    The main conference topics were: Operation and maintenance experience of the TRIGA reactors; Development of new Low Enrichment Fuels (LEU); Dose assessments noble gas releases; Radiation protection and dosimetry measurements; Research reactors programs and experiments; and Application of TRIGA reactors

  5. [2. European] TRIGA owners' conference. Papers and abstracts

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1972-07-01

    The Second European TRIGA Owners' Conference was held in Pavia, Italy, September 1972. The meeting was organized by the University of Pavia Applied Nuclear Energy Laboratory (L.E.N.A.). Sixty-two attendees representing 12 TRIGA reactor centers in Europe, South America, and the United States were present at the Conference. The main areas of discussions were: Reactor operation and maintenance experience; Research programs and TRIGA technology development.

  6. [2. European] TRIGA owners' conference. Papers and abstracts

    International Nuclear Information System (INIS)

    1972-01-01

    The Second European TRIGA Owners' Conference was held in Pavia, Italy, September 1972. The meeting was organized by the University of Pavia Applied Nuclear Energy Laboratory (L.E.N.A.). Sixty-two attendees representing 12 TRIGA reactor centers in Europe, South America, and the United States were present at the Conference. The main areas of discussions were: Reactor operation and maintenance experience; Research programs and TRIGA technology development

  7. RE@21 spotlight: most influential papers from the requirements engineering conference

    NARCIS (Netherlands)

    Glinz, Martin; Wieringa, Roelf J.

    Since 2003, an award has been presented annually at the IEEE International Requirements Engineering Conference for the Most Influential Paper presented at the conference 10 years previously. In 2013, we celebrate 21 years of the Requirements Engineering Conference, and we use this as an opportunity

  8. 12. U.S. TRIGA users conference. Papers and abstracts

    International Nuclear Information System (INIS)

    1990-01-01

    The Conference presentations were devoted to the following topics: new developments and improvements, including modifications of TRIGA reactors and equipment; experiments with TRIGA reactors (Neutron Radiography); radiochemistry, radioisotope production and beam irradiations (experiment applications, simulation); reactor physics - fuel utilization; reactor operation and maintenance experience; safety aspects, licensing and radiation protection

  9. 3. European conference of TRIGA users. Papers and abstracts

    International Nuclear Information System (INIS)

    1974-01-01

    The Third European Conference of TRIGA Users was held October 29-31, 1974, in Neuherberg near Munich, Germany under the sponsorship of the Gesellschaft fur Strahlen and Umweltforschung mbH, Physikalischen-Technische Ableilung. The main topics were: experience in reactor operation, maintenance, measurements, fuel management and fuel performance, neutron physical experiments and other research programs

  10. Dine Baa Hane Bi Naaltsoos: Collected Papers from the Seventh through Tenth Navajo Studies Conferences.

    Science.gov (United States)

    Piper, June-el, Ed.

    This document contains 29 papers presented at the 7th-10th Navajo Studies Conferences, 1994-97. The papers are arranged in five sections: "Aesthetics: Rugs, Baskets, and Rock Art"; "Doing Anthropology"; "Health"; "Economics"; and "Contact between Cultures." The papers are: "The First Navajo Studies Conference: Reflections by the Cofounders"…

  11. Papers of a Canadian Institute conference : Managing energy price risk

    International Nuclear Information System (INIS)

    2003-01-01

    During this conference, participants were offered an opportunity to broaden their knowledge on fundamentals and technical risk management. In particular, the presentations addressed topics such as: the assessment and evaluation of risk tolerance and risk management options within an organization; the tightening of risk management procedures and policies; the measurement and monitoring of risk portfolio and value at risk; the efficient trading of structured energy products; and the use of call and put options, collars and straddles, swaps and other energy related derivatives. The participants also benefited from the use of case studies, panels and tutorials conducted by energy buyers, sellers and risk management experts. The conference represented a forum where participants discussed strategies and tactics for pricing, hedging and trading energy risk in deregulated markets. Of the thirteen presentations included in this document, four were included in this database. refs., tabs., figs

  12. 10. European TRIGA users conference. Papers and abstracts

    International Nuclear Information System (INIS)

    1988-01-01

    The Tenth European TRIGA Users Conference was held in Vienna, September 14-16, 1988 under the sponsorship of the Atominstitut. The main areas of discussions were: Reactor operation and maintenance experiences; New developments and improvements of TRIGA components and systems, including instrumentation; Fuel and fuel management; Safety aspects, licensing and radiation protection; Experiments with TRIGA reactors; Radiochemistry, radioisotope production and NAA; and Reactor physics

  13. 10. European TRIGA users conference. Papers and abstracts

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1988-07-01

    The Tenth European TRIGA Users Conference was held in Vienna, September 14-16, 1988 under the sponsorship of the Atominstitut. The main areas of discussions were: Reactor operation and maintenance experiences; New developments and improvements of TRIGA components and systems, including instrumentation; Fuel and fuel management; Safety aspects, licensing and radiation protection; Experiments with TRIGA reactors; Radiochemistry, radioisotope production and NAA; and Reactor physics.

  14. 3. world TRIGA users conference. Papers and abstracts

    International Nuclear Information System (INIS)

    2006-01-01

    The Conference is focused on TRIGA reactors operation and applications. The main topics are: use of the reactor as a research tool; inspection of spent fuel elements; integrity of fuel rods cladding checks; evaluation of corrosion of aluminum-base fuel cladding materials; Pitting behavior of Aluminum alloys; Monte Carlo simulation of TRIGA: reactivity worth, burnup, flux and power; irradiation facilities; thermal hydraulics analyses etc

  15. The constitutive response of three solder materials

    International Nuclear Information System (INIS)

    Perez-Bergquist, Alejandro G.; Cao Fang; Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T.

    2012-01-01

    Highlights: ► The full constitutive response of three solder materials. ► Test temperatures from −196 °C to 60 °C and strain rates from 10 −3 to >10 3 s −1 . ► Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (−196 °C to 60 °C) and strain rate (10 −3 to >10 3 s −1 ). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  16. The constitutive response of three solder materials

    Energy Technology Data Exchange (ETDEWEB)

    Perez-Bergquist, Alejandro G., E-mail: alexpb@lanl.gov [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States); Cao Fang [Exxon Mobil Research and Engineering Company, Annadale, NJ 08801 (United States); Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T. [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States)

    2012-05-25

    Highlights: Black-Right-Pointing-Pointer The full constitutive response of three solder materials. Black-Right-Pointing-Pointer Test temperatures from -196 Degree-Sign C to 60 Degree-Sign C and strain rates from 10{sup -3} to >10{sup 3} s{sup -1}. Black-Right-Pointing-Pointer Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (-196 Degree-Sign C to 60 Degree-Sign C) and strain rate (10{sup -3} to >10{sup 3} s{sup -1}). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  17. Selected Papers and Presentations Presented at MODSIM World 2010 Conference and Expo. Part 1

    Science.gov (United States)

    Pinelli, Thomas E. (Editor)

    2011-01-01

    MODSIM World 2010 was held in Hampton, Virginia, October 13-15, 2010. The theme of the 2010 conference & expo was "21st Century Decision-Making: The Art of Modeling& Simulation". The conference program consisted of seven technical tracks - Defense, Engineering and Science, Health & Medicine, Homeland Security & First Responders, The Human Dimension, K-20 STEM Education, and Serious Games & Virtual Worlds. Selected papers and presentations from MODSIM World 2010 Conference & Expo are contained in this NASA Conference Publication (CP). Section 8.0 of this CP contains papers from MODSIM World 2009 Conference & Expo that were unavailable at the time of publication of NASA/CP-2010-216205 Selected Papers Presented at MODSIM World 2009 Conference and Expo, March 2010.

  18. Selected Papers and Presentations Presented at MODSIM World 2010 Conference Expo. Part 2

    Science.gov (United States)

    Pinelli, Thomas E. (Editor)

    2011-01-01

    MODSIM World 2010 was held in Hampton, Virginia, October 13-15, 2010. The theme of the 2010 conference & expo was "21st Century Decision-Making: The Art of Modeling& Simulation". The conference program consisted of seven technical tracks - Defense, Engineering and Science, Health & Medicine, Homeland Security & First Responders, The Human Dimension, K-20 STEM Education, and Serious Games & Virtual Worlds. Selected papers and presentations from MODSIM World 2010 Conference & Expo are contained in this NASA Conference Publication (CP). Section 8.0 of this CP contains papers from MODSIM World 2009 Conference & Expo that were unavailable at the time of publication of NASA/CP-2010-216205 Selected Papers Presented at MODSIM World 2009 Conference and Expo, March 2010.

  19. Curricula for Health Planning, Policy, and Marketing: Conference Papers 1981-82.

    Science.gov (United States)

    Bergwall, David F., Ed.

    Papers from a 1981 conference on curriculum for health planning, policy, and marketing and from a 1982 conference on curriculum for strategic planning are presented. Responses to the papers and summaries of the proceedings are also presented. Titles and authors are as follows: "A Curriculum in Community Health Planning: An Approach for Today…

  20. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Directory of Open Access Journals (Sweden)

    Liu Mei Lee

    2013-01-01

    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  1. Selected papers from the 2nd IEEEE Nordic Circuits and Systems Conference (NorCAS), 2016

    DEFF Research Database (Denmark)

    Sparsø, Jens

    2018-01-01

    This special issue includes selected papers from the 2nd IEEEE Nordic Circuits and Systems Conference (NorCAS), held in Linköping, Sweden, October 24-25, 2016. The IEEE NorCAS conference is the main circuits and systems event of the Nordic and Baltic countries representing both academia and the e......This special issue includes selected papers from the 2nd IEEEE Nordic Circuits and Systems Conference (NorCAS), held in Linköping, Sweden, October 24-25, 2016. The IEEE NorCAS conference is the main circuits and systems event of the Nordic and Baltic countries representing both academia...

  2. International conference on safety culture in nuclear installations. Contributed papers

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2002-07-01

    Safety culture is that assembly of characteristics and attitudes in organisation and individuals which establishes that as an overriding priority nuclear plant safety issues receives the attention warranted by their significance. This definition of safety culture brings out two major components in its manifestation. The framework within which individuals within the organisation works.The attitude and response of individual towards the safety issues over productivity and economics in the organisational work practices. The industry literature provides a great deal of insight at the artefact and espoused value levels, although as yet it remains somewhat disorganized. There is, however, an overall lack of understanding of the assumption level of safety culture. The IAEA has organised the conference on safety culture for better understanding of the safety culture issues on the international level.

  3. International conference on safety culture in nuclear installations. Contributed papers

    International Nuclear Information System (INIS)

    2002-01-01

    Safety culture is that assembly of characteristics and attitudes in organisation and individuals which establishes that as an overriding priority nuclear plant safety issues receives the attention warranted by their significance. This definition of safety culture brings out two major components in its manifestation. The framework within which individuals within the organisation works.The attitude and response of individual towards the safety issues over productivity and economics in the organisational work practices. The industry literature provides a great deal of insight at the artefact and espoused value levels, although as yet it remains somewhat disorganized. There is, however, an overall lack of understanding of the assumption level of safety culture. The IAEA has organised the conference on safety culture for better understanding of the safety culture issues on the international level

  4. International Telemedicine/Disaster Medicine Conference: Papers and Presentations

    Science.gov (United States)

    1991-01-01

    The first International Telemedicine/Disaster Medicine Conference was held in Dec. 1991. The overall purpose was to convene an international, multidisciplinary gathering of experts to discuss the emerging field of telemedicine and assess its future directions; principally the application of space technology to disaster response and management, but also to clinical medicine, remote health care, public health, and other needs. This collection is intended to acquaint the reader with recent landmark efforts in telemedicine as applied to disaster management and remote health care, the technical requirements of telemedicine systems, the application of telemedicine and telehealth in the U.S. space program, and the social and humanitarian dimensions of this area of medicine.

  5. GSI papers presented at the 3. European particle accelerator conference

    International Nuclear Information System (INIS)

    1992-04-01

    This report contains the articles presented by the GSI at the named conference. These concern an ion source for heavy ion synchrotron injection, a power amplifier, the new heavy ion injector of the UNILAC, the heavy ion synchrotron SIS, beam intensity measurements at the SIS, heavy ion storage rings, the performance and impedances and instability studies at the ESR, longitudinal space-charge effects in cooled bunched beams, the ERS electron cooling device, experiments with synthetic colored noise at the ESR, ion beams for heavy ion fusion research, a reactor driver concept for indirect drive, plasma lenses for heavy-ion beam focusing, synchrotrons for cancer therapy, and future accelerator projects in collaboration with industry. (orig.)

  6. Telecommunications Policy Research Conference. Subsidies in Telephone Pricing Section. Papers.

    Science.gov (United States)

    Telecommunications Policy Research Conference, Inc., Washington, DC.

    Three papers consider the provision of telephone service to rural and/or low income customers. The first paper, "An Analysis of Telephone Penetration" (Alexander Belinfante), analyzes the relationship between telephone penetration (the proportion of households with phone service) and prices, household income, and other factors. This…

  7. Telecommunications Policy Research Conference. International Comparisons I (Europe) Section. Papers.

    Science.gov (United States)

    Telecommunications Policy Research Conference, Inc., Washington, DC.

    Three papers consider telecommunications policy in Great Britain and Germany specifically, and the nations of the European Economic Community generally. The first paper, "German Telecommunications Law and Policies" (Ernst-Joachim Mestamacker) outlines the present structure of telecommunications in West Germany, and discusses deregulation…

  8. Effect of Solder Flux Residues on Corrosion of Electronics

    DEFF Research Database (Denmark)

    Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per

    2009-01-01

    Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA...... testing and use in the field, consequences and recommendations are given. Failures, caused by harsh[1] customer environments, are not covered in this paper....

  9. Review of the presented papers for the sixth international conference on radiation shielding

    International Nuclear Information System (INIS)

    Sasamoto, Nobuo; Yamaji, Akio; Ueki, Kotaro

    1984-01-01

    Detailed review has been carried out on technical papers which were presented to the Sixth International Conference on Radiation Shielding, held in Tokyo, from May 16 to 20, 1983. We took into account 131 papers of which preprints were available during the Conference. The results of the review are described for each paper, including its originality, essential features, conclusions obtained and its applicability to shielding design, etc. Summary for each session are also included. (author)

  10. International conference on issues and trends in radioactive waste management. Contributed papers

    International Nuclear Information System (INIS)

    2002-01-01

    This publication contains 78 contributed papers submitted on issues falling within the thematic scope of the Conference which were accepted by the Conference Programme Committee for consideration at the conference. The papers are grouped into the following chapters: control of discharges, environmental aspects; long-term storage; geological disposal; management of radioactive waste, including sealed sources; management of radioactive waste from past eras; regulatory infrastructure, decision making, stakeholders; retention of information, long-term control, standards; specific studies; and international co-operative efforts. Each of the papers was indexed separately

  11. International conference on issues and trends in radioactive waste management. Contributed papers

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2002-07-01

    This publication contains 78 contributed papers submitted on issues falling within the thematic scope of the Conference which were accepted by the Conference Programme Committee for consideration at the conference. The papers are grouped into the following chapters: control of discharges, environmental aspects; long-term storage; geological disposal; management of radioactive waste, including sealed sources; management of radioactive waste from past eras; regulatory infrastructure, decision making, stakeholders; retention of information, long-term control, standards; specific studies; and international co-operative efforts. Each of the papers was indexed separately.

  12. Telecommunications Policy Research Conference. Capital Recovery Section. Papers.

    Science.gov (United States)

    Telecommunications Policy Research Conference, Inc., Washington, DC.

    Two papers consider the capital recovery difficulties of telephone companies in the current deregulatory environment. The first, "Capital Recovery in the Transition Period" (Gail Garfield Schwartz, New York State Public Service Commission) describes the process determining depreciation in both regulated and deregulated environments, and…

  13. Teacher Retirement Ponzi Schemes. Conference Paper 2009-02

    Science.gov (United States)

    Kotlikoff, Laurence J.

    2009-01-01

    This paper is about the funding status of teachers' retirement pension schemes. Its goal is to relate the accounting for the funding of these pension obligations to the endemic, systematic, and fundamentally fraudulent system of accounting our country uses to assess the financial positions of federal, state, and local government as well as many…

  14. Invited and contributed papers presented at the 22. EPS conference on controlled fusion and plasma physics

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1995-08-01

    In this report one invited and fifteen contributed papers by researchers of the `Centre de Recherche en Physique des Plasmas`, Lausanne, to the 22. EPS Conference on Controlled Fusion and Plasma Physics are assembled. figs., tabs., refs.

  15. A Decade of Chais Conferences: Introduction to the IJELL Special Series of Chais Conference 2015 Best Papers

    Directory of Open Access Journals (Sweden)

    Nitza Geri

    2015-12-01

    This preface presents the mission and activities of the Research Center for Innovation in Learning Technologies at the Open University of Israel. It describes the objectives and themes of the Chais conference 2015, explains the special series synergies with IJELL and the Informing Science Institute, chronicles the topics that have been published in the series, and introduces the papers included in this special selection.

  16. Template for preparation of papers for IEEE sponsored conferences & symposia.

    Science.gov (United States)

    Sacchi, L; Dagliati, A; Tibollo, V; Leporati, P; De Cata, P; Cerra, C; Chiovato, L; Bellazzi, R

    2015-01-01

    To improve the access to medical information is necessary to design and implement integrated informatics techniques aimed to gather data from different and heterogeneous sources. This paper describes the technologies used to integrate data coming from the electronic medical record of the IRCCS Fondazione Maugeri (FSM) hospital of Pavia, Italy, and combines them with administrative, pharmacy drugs purchase coming from the local healthcare agency (ASL) of the Pavia area and environmental open data of the same region. The integration process is focused on data coming from a cohort of one thousand patients diagnosed with Type 2 Diabetes Mellitus (T2DM). Data analysis and temporal data mining techniques have been integrated to enhance the initial dataset allowing the possibility to stratify patients using further information coming from the mined data like behavioral patterns of prescription-related drug purchases and other frequent clinical temporal patterns, through the use of an intuitive dashboard controlled system.

  17. International conference on the safety of radioactive waste management. Contributed papers

    International Nuclear Information System (INIS)

    2000-03-01

    This book contains 104 contributed papers submitted on issues falling within the thematic scope of the Conference. The papers present technical and regulatory approaches and practices on safety in spent nuclear fuel and radioactive waste management including storage, processing and final disposal. Each of the papers was individually indexed and provided with an abstract

  18. International conference on the safety of radioactive waste management. Contributed papers

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2000-03-01

    This book contains 104 contributed papers submitted on issues falling within the thematic scope of the Conference. The papers present technical and regulatory approaches and practices on safety in spent nuclear fuel and radioactive waste management including storage, processing and final disposal. Each of the papers was individually indexed and provided with an abstract.

  19. Online Paper Repositories and the Role of Scholarly Societies: An AERA Conference Report

    Science.gov (United States)

    Educational Researcher, 2010

    2010-01-01

    This article examines issues faced by scholarly societies that are developing and sustaining online paper repositories. It is based on the AERA Conference on Online Paper Repositories, which focused on fundamental issues of policy and procedure important to the operations of online working paper repositories. The report and recommendations address…

  20. Structuring oil and gas joint ventures with aboriginal communities: conference papers conference

    International Nuclear Information System (INIS)

    1999-01-01

    The Insight Conference featured twelve articles on the following topics: 1 - researching and understanding your legal partners; II - an aboriginal game plan - a plan for success; III - legal and management issues relating to aboriginal ventures; IV - tax status of reserve-based aboriginal people and businesses under the Indian Act; v - first nations as exempt bodies under the Income Tax Act; V I - innovative options for structuring oil and gas leases and exploration permits on aboriginal lands; VII - joint venture and partnership arrangements; V III - the impact of taxation on aboriginal ventures; I X - bankruptcy and insolvency issues for on-reserve businesses; X - financing options for oil and gas ventures with first nations; XI - Syncrude's commitment to aboriginal development; and X II - structuring oil and gas ventures with aboriginal communities. Articles abstracted/indexed separately include: I, II, V I (2), V III, X, XI, and X II

  1. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    Directory of Open Access Journals (Sweden)

    Mohd Nizam Ab. Rahman

    2014-12-01

    Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

  2. Space applications of artificial intelligence; 1990 Goddard Conference, Greenbelt, MD, May 1, 2, 1990, Selected Papers

    Science.gov (United States)

    Rash, James L. (Editor)

    1990-01-01

    The papers presented at the 1990 Goddard Conference on Space Applications of Artificial Intelligence are given. The purpose of this annual conference is to provide a forum in which current research and development directed at space applications of artificial intelligence can be presented and discussed. The proceedings fall into the following areas: Planning and Scheduling, Fault Monitoring/Diagnosis, Image Processing and Machine Vision, Robotics/Intelligent Control, Development Methodologies, Information Management, and Knowledge Acquisition.

  3. Mechanical properties of Bi-In-Zn/ Cu solder joint system

    International Nuclear Information System (INIS)

    Ervina Efzan Mohd Noor; Mohammed Noori Ridha; Ahmad Badri Ismail; Nurulakmal Mohd Sharif; Kuan Yew Cheong; Tadashi Ariga; Zuhailawati Hussain

    2009-01-01

    Full text: In recent years, the pollution of environment from lead (Pb) and Pb-containing compounds in microelectronic devices attracts more and more attentions in academia and industry; the lead-free solder alloys begin to replace the lead-based solders in packaging process of some devices and components. In this works, microstructure and mechanical properties of different reflow temperature (80, 100, 120 and 140 degree Celsius) for solder joints on shear strength of Bi-In-Zn lead free solder with low melting temperature of 60 degree Celsius on Cu solder joint has been investigated. This paper will compared the mechanical properties of the Bi-In-Zn lead-free solder alloys with current lead-free solder, Sn-Ag-Cu solder alloy. The fracture surface analyses have been observed by Optical Microscope and were investigated by Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX) and proved it by X-ray diffraction (XRD). (author)

  4. Papers of All-Polish Conference on Nuclear Techniques in Industry, Medicine, Agriculture and Environmental Protection

    International Nuclear Information System (INIS)

    2002-01-01

    These proceedings comprise papers presented at All-Polish Conference on nuclear techniques in industry, medicine, agriculture and environmental protection. Most of the papers are in the field of uses of radiation sources and particle beams in industry, radiation chemistry, nuclear medicine and dosimetry, environmental sciences

  5. Lifelong Literacies. Papers from the 1996 Conference (Manchester, England, United Kingdom, May 1996).

    Science.gov (United States)

    Fitzpatrick, Stella, Ed.; Mace, Jane, Ed.

    This collection of 17 papers, presented at a conference in May 1996, documents some of the current thinking about adult literacy education in Great Britain. The first of the three sections of the papers, "Some Context," contains two analyses of the political and economic realities within which potential participants in adult literacy and…

  6. A Study on How Conference Papers are Extended into Journal Articles in the Fields of Information Management

    Directory of Open Access Journals (Sweden)

    Yu-Hui Lu

    2016-12-01

    Full Text Available In recent years, some scholarly journals have indicated that they accept rewritten or extended version of a conference paper as long as new content are added to the journal article manuscript and that the original conference paper is included in the references. The extended publishing of conference papers now becomes topic worthy of investigation. This study analyzed the extended works of the conference papers from three major conferences in the fields of information management, i.e., Association for Computing Machinery (ACM’s ACM Conference on Electronic Commerce (ACM EC, ACM Conference on Knowledge Discovery and Data Mining (ACM KDD, and ACM International Conference on Information and Knowledge Management (ACM CIKM. Papers from the 2011 meetings were used as the sample to understand to what extent conference papers have been extended into journal articles and other forms and the lag between conference and journal publishing. It also examined the differences between the conference papers and their extended versions (i.e., journal papers by comparing the changes in authorship, references, article length, tables, and figures. It reveals the current practices of extending conference papers for journal publishing in the information management fields and may help us understand the contemporary scholarly publishing behavior. [Article content in Chinese

  7. International conference on the protection of the environment from the effects of ionizing radiation. Contributed papers

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2003-09-01

    An International Conference on the Protection of the Environment from the Effects of Ionizing Radiation, organized by the International Atomic Energy Agency (IAEA) in co-operation with the United Nations Scientific Committee on the Effects of Atomic Radiation (UNSCEAR), the European Commission (EC) and the International Union of Radioecology (IUR), will be held in Stockholm, Sweden, from 6-10 October 2003. This Conference will be hosted by the Government of Sweden through the Swedish Radiation Protection Authority (SSI). This publication contains contributed papers submitted on issues within the scope of the conference, which were accepted following a review by the Conference Programme Committee. The primary objective of this Conference is to foster information exchange, with the aim of promoting the development of a coherent international policy on the protection of the environment from effects attributable to ionizing radiation. This Conference is one in a series of meetings organized by, or held in co-operation with, the IAEA on this subject. It will include a review of recent developments in this area, and consideration of their implications for future work at national and international levels. The topics on which contributed papers were requested are as follows: Existing environmental protection approaches; Development of an international assessment framework; The scientific basis for environmental radiation assessment; Development of management approaches.

  8. Visual detection of defects in solder joints

    Science.gov (United States)

    Blaignan, V. B.; Bourbakis, Nikolaos G.; Moghaddamzadeh, Ali; Yfantis, Evangelos A.

    1995-03-01

    The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new `frame' for the achievement of better results regarding efficiency, products quality and automated service. In this paper the visual detection and classification of different types of defects on solder joints in PC boards is presented by combining several image processing methods, such as smoothing, segmentation, edge detection, contour extraction and shape analysis. The results of this paper are based on simulated solder defects and a real one.

  9. IV international conference on computational methods in marine engineering : selected papers

    CERN Document Server

    Oñate, Eugenio; García-Espinosa, Julio; Kvamsdal, Trond; Bergan, Pål; MARINE 2011

    2013-01-01

    This book contains selected papers from the Fourth International Conference on Computational Methods in Marine Engineering, held at Instituto Superior Técnico, Technical University of Lisbon, Portugal in September 2011.  Nowadays, computational methods are an essential tool of engineering, which includes a major field of interest in marine applications, such as the maritime and offshore industries and engineering challenges related to the marine environment and renewable energies. The 2011 Conference included 8 invited plenary lectures and 86 presentations distributed through 10 thematic sessions that covered many of the most relevant topics of marine engineering today. This book contains 16 selected papers from the Conference that cover “CFD for Offshore Applications”, “Fluid-Structure Interaction”, “Isogeometric Methods for Marine Engineering”, “Marine/Offshore Renewable Energy”, “Maneuvering and Seakeeping”, “Propulsion and Cavitation” and “Ship Hydrodynamics”.  The papers we...

  10. Management of water hyacinth: Final meeting and international conference. Working paper submitted by the Regional Coordinator

    International Nuclear Information System (INIS)

    1981-01-01

    Full text: Final Meeting. This meeting will essentially make a terminal review of the project and register final records of work done on the various aspects, such as: - biology of the plant; - biological control; - biogas; - wastewater treatment; - papers and boards; - integrated systems, etc. We should have at the meeting a complete account of the work done in the project under each of the above headings. For example, under 'biogas' we should prepare one consolidated account of work carried out in all the three participating countries rather than individual country reports. Likewise on 'papers and boards', and the other items. To enable preparation of reports in this form there should naturally be prior consultations and contacts among the concerned investigators by correspondence and, if necessary, personal visits. These reports will then be edited and compiled by the Regional Coordinator in the form of a book or monograph on the Management of Water Hyacinth project as a whole. Contributors to chapters will be cited. International Conference. Independent of the consolidated reports, national coordinators may prepare papers for presentation at the proposed international conference. These papers could be prepared m the usual form and style for publication in international scientific journals. Although several papers could be prepared out of work done by us, we may consider the desirability of limiting the number, in order to give adequate opportunities for the other invited participants to the conference. There would be no bar on publication of these scientific papers after the conference in appropriate journals irrespective of whether a separate volume on proceedings of the conference is brought out or not. India would be happy to host the terminal review meeting to be followed by the conference. The likely period would be last week of January to first week in February, 1983. (author)

  11. Software Technologies - 8th International Joint Conference, ICSOFT 2013 : Revised Selected Papers

    NARCIS (Netherlands)

    Cordeiro, José; van Sinderen, Marten J.

    2014-01-01

    The present book includes extended and revised versions of a set of selected papers from the 8th International Joint Conference on Software Technologies (ICSOFT 2013), which was co-organized by the Reykjavik University (RU) and sponsored by the Institute for Systems and Technologies of Information,

  12. IFLA General Conference, 1986. Collections and Services Division. Section: Acquisitions and Exchange. Papers.

    Science.gov (United States)

    International Federation of Library Associations and Institutions, The Hague (Netherlands).

    Papers on acquisitions and exchange presented at the 1986 International Federation of Library Associations (IFLA) conference include: (1) a condensed English version and the full German text of the presentation, "Document Exchange and the Deutsche Forschungsgemeinschaft (German Research Council)--The Acquisition of Grey and Special Literature…

  13. Papers presented at congresses and conferences - 1992; Ponencias presentadas a congresos y conferencias - 1992

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1993-12-15

    Empresarios Agrupados (EA) is a leading engineering organization in Spain with significant international experience. EA provides consulting, engineering, procurement, construction management and operation support services for the power industry, power generation and transmission and other engineering areas. These paper are a collection of presentations made on conferences and congresses in 1992.

  14. Papers presented at the “International Conference on Fatigue and ...

    Indian Academy of Sciences (India)

    Unknown

    Papers presented at the “International Conference on Fatigue and Fracture of Glasses, Ceramics and Composites”, Materials. Research Society of India, Kolkata, September 1999. FOREWORD. The unique properties of glasses, ceramics and composites such as corrosion resistance, high specific strength, transport ...

  15. Papers presented at the “National Conference on Frontiers in ...

    Indian Academy of Sciences (India)

    Unknown

    The papers appearing in this issue of the Bulletin of Materials Science were presented at the “National Conference on Frontiers in Materials Science and. Technology (FMST 02)” organized by the Materials Science Centre, IIT. Kharagpur, during 22–23 February 2002, as part of the Golden Jubilee. Celebrations of IIT ...

  16. 14. U.S. TRIGA users conference. Final program and summary of papers

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1994-07-01

    The following papers were presented at the Conference: Early Development and Use of the TRIGA Reactor; Results of the MCNP Analysis of 20/20 LEU Fuel for the Oregon State University TRIGA Reactor; Upgradeable 2MW TRIGA Reactor Design for the Morocco Nuclear Energy Center McClellan Nuclear Radiation Center TRIGA Reactor: Four Years of Operations.

  17. IFLA General Conference, 1986. Special Libraries Division. Section: Science and Technology Libraries. Papers.

    Science.gov (United States)

    International Federation of Library Associations and Institutions, The Hague (Netherlands).

    Papers on science and technology libraries which were presented at the 1986 International Federation of Library Associations (IFLA) conference include: (1) "Online Information Service of the Japan Information Center of Science and Technology" (Ryuko Igarashi, Japan); (2) "A View from the Chip--The Influence of Information…

  18. 14. U.S. TRIGA users conference. Final program and summary of papers

    International Nuclear Information System (INIS)

    1994-01-01

    The following papers were presented at the Conference: Early Development and Use of the TRIGA Reactor; Results of the MCNP Analysis of 20/20 LEU Fuel for the Oregon State University TRIGA Reactor; Upgradeable 2MW TRIGA Reactor Design for the Morocco Nuclear Energy Center McClellan Nuclear Radiation Center TRIGA Reactor: Four Years of Operations

  19. The Social Science Teacher. 1972. Collected Conference Papers: Social Science Concepts Classroom Methods.

    Science.gov (United States)

    Noble, Pat, Ed.; And Others

    Papers in this publication are collected from a conference on social science concepts and classroom methods which focused on the theories of Jerome Bruner. The first article, entitled "Jerome Bruner," outlines four of Bruner's themes--structure, readiness, intuition, and interest--which relate to cognitive learning. Three…

  20. IFLA General Conference, 1985. Division on Special Libraries. Section on Science and Technology Libraries. Papers.

    Science.gov (United States)

    International Federation of Library Associations, The Hague (Netherlands).

    Papers on science and technology libraries which were presented at the 1985 International Federation of Library Associations (IFLA) conference include: (1) "UAP (Universal Availability of Publications) and User Training for Categories of Grey Literature" (Dieter Schmidmaier, Mining Academy Freiberg, East Germany); (2) "Resource…

  1. Twenty-ninth ORNL/DOE conference on analytical chemistry in energy technology. Abstracts of papers

    International Nuclear Information System (INIS)

    1986-01-01

    This booklet contains separate abstracts of 55 individual papers presented at this conference. Different sections in the book are titled as follows: laser techniques; resonance ionization spectroscopy; laser applications; new developments in mass spectrometry; analytical chemistry of hazardous waste; and automation and data management

  2. Selected papers from the Fourth Annual q-bio Conference on Cellular Information Processing.

    Science.gov (United States)

    Nemenman, Ilya; Faeder, James R; Hlavacek, William S; Jiang, Yi; Wall, Michael E; Zilman, Anton

    2011-10-01

    This special issue consists of 11 original papers that elaborate on work presented at the Fourth Annual q-bio Conference on Cellular Information Processing, which was held on the campus of St John's College in Santa Fe, New Mexico, USA, 11-14 August 2010. Now in its fourth year, the q-bio conference has changed considerably over time. It is now well established and a major event in systems biology. The 2010 conference saw attendees from all continents (except Antarctica!) sharing novel results and participating in lively discussions at both the oral and poster sessions. The conference was oversubscribed and grew to 27 contributed talks, 16 poster spotlights and 137 contributed posters. We deliberately decreased the number of invited speakers to 21 to leave more space for contributed presentations, and the attendee feedback confirmed that the choice was a success. Although the q-bio conference has grown and matured, it has remained true to the original goal of being an intimate and dynamic event that brings together modeling, theory and quantitative experimentation for the study of cell regulation and information processing. Funded in part by a grant from NIGMS and by DOE funds through the Los Alamos National Laboratory Directed Research and Development program, the conference has continued to exhibit youth and vigor by attracting (and partially supporting) over 100 undergraduate, graduate and postdoctoral researchers. The associated q-bio summer school, which precedes the conference each year, further emphasizes the development of junior scientists and makes q-bio a singular event in its impact on the future of quantitative biology. In addition to an increased international presence, the conference has notably diversified its demographic representation within the USA, including increased participation from the southeastern corner of the country. One big change in the conference this year is our new publication partner, Physical Biology. Although we are very

  3. Preface: Special issue featuring papers from the International Conference on Nonequilibrium Carrier Dynamics in Semiconductors

    Science.gov (United States)

    Reggiani, L.; Bordone, P.; Brunetti, R.

    2004-02-01

    The International Conference on Nonequilibrium Carrier Dynamics in Semiconductors (HCIS-13) celebrates 30 years since it first took place in Modena. Nonequilibrium dynamics of charge carriers, pioneered by the hot-electron concept, is an important issue for understanding electro-optic transport properties in semiconductor materials and structures. In these 30 years several topics have matured, and new ones have emerged thus fertilizing the field with a variety of physical problems and new ideas. The history of the conference is summarized in the opening paper `30 years of HCIS'. The future of the conference seems secure considering the continued lively interest of the participants. The conference addressed eleven major topics which constitute the backbone of the proceedings and are summarized as follows: carrier transport in low dimensional and nanostructure systems, nonequilibrium carriers in superlattices and devices, small devices and related phenomena, carrier dynamics and fluctuations, carrier quantum dynamics, coherent/incoherent carrier dynamics of optical excitations and ultra-fast optical phenomena, nonlinear optical effects, transport in organic matter, semiconductor-based spintronics, coherent dynamics in solid state systems for quantum processing and communication, novel materials and devices. Nanometric space scale and femtosecond time scale represent the ultimate domains of theoretical, experimental and practical interest. Traditional fields such as bulk properties, quantum transport, fluctuations and chaotic phenomena, etc, have received thorough and continuous attention. Emerging fields from previous conferences, such as quantum processing and communication, have been better assessed. New fields, such as spintronics and electron transport in organic matter, have appeared for the first time. One plenary talk, 11 invited talks, 230 submitted abstracts covering all these topics constituted a single-session conference. Following scientific selection

  4. APT related papers presented at the 1997 particle accelerator conference, Vancouver, May 12--16, 1997

    Energy Technology Data Exchange (ETDEWEB)

    Lawrence, G. [comp.

    1997-07-01

    Tritium is essential for the US nuclear weapons to function, but because it is radioactive with a half-life of 12.3 years, the supply must be periodically replenished. Presently, only reactor or accelerator systems can be used to produce tritium. This report is a compilation of 31 papers given at the 1997 Particle Accelerator Conference which dealt with the accelerator production of tritium. The papers are grouped into two categories, invited and contributed.

  5. APT related papers presented at the 1997 particle accelerator conference, Vancouver, May 12--16, 1997

    International Nuclear Information System (INIS)

    Lawrence, G.

    1997-07-01

    Tritium is essential for the US nuclear weapons to function, but because it is radioactive with a half-life of 12.3 years, the supply must be periodically replenished. Presently, only reactor or accelerator systems can be used to produce tritium. This report is a compilation of 31 papers given at the 1997 Particle Accelerator Conference which dealt with the accelerator production of tritium. The papers are grouped into two categories, invited and contributed

  6. Papers of BIOCAP Canada Foundation's 1. national conference : capturing Canada's green advantage

    International Nuclear Information System (INIS)

    2005-02-01

    This conference provided a forum for the exchange of perspectives on energy options and greenhouse gas (GHG) offsets. It showcased emerging knowledge from Canadian biosphere GHG management research. The goal of the conference was to provide new options geared towards utilizing the biosphere, to review current knowledge and identify areas for further research in the provision of policy and industry-relevant solutions. Issues concerning agriculture, forestry and bioenergy were reviewed with reference to long-term cumulative socio-economic advantages. Sustainable development and the economic impacts surrounding current environmental policies were discussed. Carbon management, sequestration and carbon credit programs were reviewed, with reference to economic and implementation challenges. Environmental management challenges and future directions of biomass development, sustainable forest management and new research on bioenergy were presented. Methods of improving efficiency and reducing emissions via the use of biofuels were reviewed. Eighty papers were presented at this conference, 13 of which have been catalogued separately for inclusion in this database

  7. International conference on nuclear knowledge management: Strategies, information management and human resource development. Unedited papers

    International Nuclear Information System (INIS)

    2004-01-01

    The nuclear industry is knowledge based, similar to other highly technical industries, and relies heavily on the accumulation of knowledge. Recent trends such as workforce ageing and declining student enrolment numbers, and the risk of losing accumulated knowledge and experience, have drawn attention to the need for better management of nuclear knowledge. In 2002 the IAEA General Conference adopted a resolution on nuclear knowledge, which was reiterated in 2003; the resolution emphasized the importance of nuclear knowledge and information management and urged both the IAEA and Member States to strengthen their activities and efforts in this regard. Consequently, the International Conference on Nuclear Knowledge Management: Strategies, Information Management and Human Resource Development, which was held on 7-10 September 2004 in Saclay, was organized by the IAEA and the Government of France through the Commissariat a l'energie atomique in cooperation with the European Commission, OECD Nuclear Energy Agency, European Atomic Forum, Japan Atomic Industrial Forum, World Council of Nuclear Workers, World Nuclear University and European Association of Information Services. The conference was attended by 250 experts, scientists and officials from 54 Member States and nine international organizations, giving the conference a very broad representation of the nuclear sector. The objective of the conference was to reach a clear and common understanding of the issues related to nuclear knowledge management for sustaining knowledge and expertise in nuclear science and technology and to define a strategic framework for developing IAEA cross-cutting knowledge management activities. The conference provided a forum for professionals and decision makers in the nuclear sector, comprising industry, government and academia, as well as professionals in the knowledge management and information technology sectors. The unedited papers are presented in this report

  8. Selected papers from the 7th International Conference on Microtechnologies in Medicine and Biology (MMB 2013)

    Science.gov (United States)

    Meng, Ellis; Takayama, Shuichi

    2014-03-01

    In this special section of Journal of Micromechanics and Microengineering are a collection of the best microengineering papers presented at the 7th International Conference on Microtechnologies in Medicine and Biology (MMB 2013) which took place in the seaside town of Marina del Rey, California, USA on 10-12 April, 2013. During the 3-day conference, participants enjoyed talks from 6 invited keynote speakers and 125 flash oral/poster presentations. The MMB conference is a biennial meeting with the primary purpose of fostering interactions between biologists and medical researchers, clinicians, chemists, physicists and engineers to enhance and strengthen the potential microtechnologies that will revolutionize the fields of medicine and biological sciences. The conference possesses a unique format where all poster presenters provide a brief 60 s oral presentation highlighting their research. This format was devised to provide training and exposure for young researchers, especially PhD students and postdocs, in the field and stimulate interdisciplinary exchanges. Therefore, MMB provides an intimate intellectual venue the facilitate discussions and collaborations to advance new research tools and technologies for medicine and biological sciences. The MMB conference series was co-founded by Professor David Beebe (University of Wisconsin—Madison) and Professor André Dittmar (University of Lyon) and was the first international meeting to provide a forum focusing on emerging applications of microtechnologies to unmet needs in medicine and biology. The series was held for the first time in 2000, in Lyon, France and followed by Madison, USA (2002), Oahu Island in Hawaii, USA (2005), Okinawa, Japan (2006), Québec City, Canada (2009), Lucerne, Switzerland (2011), and Marina del Rey, USA (2013). The next conference will be held in Seoul, Korea in 2015. This collection of articles highlights recent progress in microtechnologies with medical and biological applications. We are

  9. Papers of the Canadian Institute conference: Reduction, management and trading of greenhouse gas emissions

    International Nuclear Information System (INIS)

    2003-01-01

    This conference provided an opportunity for experts from various fields to discuss and exchange views and the latest information on a wide range of topics related to the reduction, management and trading of greenhouse gas emissions. The papers dealt with pertinent issues such as: (1) short and long term impacts of the Kyoto Protocol ratification for industries operating in Quebec, necessary changes and required investment, (2) calculation mechanisms for the allocation of permits, audit systems for the reduction and registration of emissions, (3) Canadian and international emission trading market, opportunities and associated risks, (4) preparation of an emission trading contract, (5) the establishment of a greenhouse gas (GHG) emission reduction and management system within companies, and (6) measures implemented by governments to assist industry in meeting emission reduction targets. Of the sixteen papers presented at the conference, 4 have been processed separately for inclusion in this database. refs., tabs., figs

  10. Proceedings of papers. 3. Balkan Metallurgical Conference; Kniga na trudovi. 3-ta Balkanska konferencija na metalurzite

    Energy Technology Data Exchange (ETDEWEB)

    Mickovski, Jovan [Faculty of Technology and Metallurgy, St. ' Cyril and Methodius' University, Skopje (Macedonia, The Former Yugoslav Republic of)

    2003-07-01

    This Conference aims to be a central event in the metallurgy research of Balkan, fulfilling the goals to present the most outstanding relevant developments in modern metallurgy; to inspire high standards of excellence in pure and applied metallurgy research; to attract outstanding scientists to present central lectures on modem metallurgical research, and on the challenges imposed by the needs of society; to inspire the young generation of metallurgists in Balkan and other countries. Following these lines, the 3. Balkan Conference on Metallurgy will provide a unique opportunity for academic and industrial metallurgists from the Balkan countries and wider, to exchange ideas, expertise, and experience on topics related to the theme of the Conference - Balkan Metallurgy in Search for New Ways of Development. The aim of the organizers was to bring together distinguished experts, not only to present their work, but also to discuss the major scientific and technological challenges facing metallurgy in this millennium.The 6 sections of the conference were entitled: Section A: Extractive metallurgy; Section B: Physical metallurgy and materials science - ferrous metals and non ferrous metals; Section C: Management, maintenance control and optimization of metallurgical processes; Section D: New technologies and techniques; Section E: Refractory and powder; Section F: Corrosion and protection of metals. Papers relevant to INIS are indexed separately.

  11. Fatigue and thermal fatigue of Pb-Sn solder joints

    International Nuclear Information System (INIS)

    Frear, D.; Grivas, D.; McCormack, M.; Tribula, D.; Morris, J.W. Jr.

    1987-01-01

    This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55 0 C and 125 0 C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb

  12. Isotopes in environmental studies - Aquatic Forum 2004. Proceedings of an international conference. Unedited papers

    International Nuclear Information System (INIS)

    2006-01-01

    - Collaboration of European Low-Level Underground Laboratories. - GSI Workshop on Groundwater- Seawater Interactions in coastal zones, organized in cooperation with the IAPSO Commission on Groundwater-Seawater Interactions. These proceedings contain papers presented during the conference in oral and poster sessions. Several papers presented orally during the conference have been submitted by the authors for publication in a special issue of the Journal of Environmental Radioactivity book series, published by Elsevier. It is hoped that these publications will contribute to the research in isotopes in environmental studies, which will make the use of isotopes more widespread, and will further stimulate work in this exciting field

  13. International conference on the safety of radioactive waste disposal. Contributed papers

    International Nuclear Information System (INIS)

    2005-01-01

    The objective of the Conference is to foster information exchange on the safety of radioactive waste disposal covering; the choice of appropriate waste disposal options, safety standards, safety cases for presenting safety arguments and demonstrating compliance with standards, safety assessment methodologies and their application, dealing with uncertainty, regulatory review and decision making, the derivation of limits, controls and conditions to be applied to the development and operation of disposal facilities to ensure safety and the communication of safety issues to all interested stakeholders and confidence development. The conference will consider all possible disposal options available, drawing from experience in Member States with near surface and geological disposal facilities and those at intermediate depths and giving consideration to any multilateral approach that may be adopted. Each of the contributed papers is indexed separately

  14. International conference on the safety of radioactive waste disposal. Contributed papers

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2005-07-01

    The objective of the Conference is to foster information exchange on the safety of radioactive waste disposal covering; the choice of appropriate waste disposal options, safety standards, safety cases for presenting safety arguments and demonstrating compliance with standards, safety assessment methodologies and their application, dealing with uncertainty, regulatory review and decision making, the derivation of limits, controls and conditions to be applied to the development and operation of disposal facilities to ensure safety and the communication of safety issues to all interested stakeholders and confidence development. The conference will consider all possible disposal options available, drawing from experience in Member States with near surface and geological disposal facilities and those at intermediate depths and giving consideration to any multilateral approach that may be adopted. Each of the contributed papers is indexed separately.

  15. Conference Paper NFO-7:7th International Conference on Near-Field Optics and Related Technologies

    Energy Technology Data Exchange (ETDEWEB)

    Novotny, Lukas [Univ. of Rochester, NY (United States)

    2004-10-18

    The seventh conference in the NFO conference series, held here in Rochester, provided to be the principal forum for advances in sub-wavelength optics, near-field optical microscopy, local field enhancement, instrumental developments and the ever-increasing range of applications. This conference brought together the diverse scientific communities working on the theory and application of near-field optics (NFO) and related techniques.

  16. The history of NATO TNF policy: The role of studies, analysis and exercises conference proceedings. Volume 2: Papers and presentations

    Energy Technology Data Exchange (ETDEWEB)

    Rinne, R.L.

    1994-02-01

    This conference was organized to study and analyze the role of simulation, analysis, modeling, and exercises in the history of NATO policy. The premise was not that the results of past studies will apply to future policy, but rather that understanding what influenced the decision process -- and how -- would be of value. The structure of the conference was built around discussion panels. The panels were augmented by a series of papers and presentations focusing on particular TNF events, issues, studies, or exercises. The conference proceedings consist of three volumes. Volume 1 contains the conference introduction, agenda, biographical sketches of principal participants, and analytical summary of the presentations and panels. This volume contains a short introduction and the papers and presentations from the conference. Volume 3 contains selected papers by Brig. Gen. Robert C. Richardson III (Ret.). Individual papers in this volume were abstracted and indexed for the database.

  17. International conference on national infrastructures for radiation safety: Towards effective and sustainable systems. Contributed papers

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2003-07-01

    The International Atomic Energy Agency (IAEA), in co-operation with the World Health Organization (WHO), the International Labour Office (ILO), the European Commission (EC), and the OECD Nuclear Energy Agency (NEA), organized the International Conference on National Infrastructures for Radiation Safety: Towards Effective and Sustainable Systems. This book contains contributed papers submitted on pertinent issues, including stakeholder involvement, IAEA Model Projects on Upgrading Radiation Protection Infrastructure, Quality Assurance, education and training, regulatory activities, performance evaluation, source security, and emergency preparedness. The material in this book has not been edited by the IAEA. These contributed papers will be published on a CD ROM as part of the Proceedings of the Conference, along with the invited papers and discussions. The papers are grouped by topical sessions: Stakeholder Involvement in Building and Maintaining National Radiation Safety Infrastructure (National and International); Implementation Experience with The Model Projects (Views From The Countries, Positive and Negative Experiences); Resources and Services (Systematic Approach), Quality Assurance, International Support Of Services; Sustainable Education And Training: Developing Skills (National Systems And Regional Solutions); Needs for Education And Training at The International Level (Including IAEA Programmes Assisting in Establishing Adequate Infrastructures); Authorization, Inspection and Enforcement (Effectiveness and Efficiency Of The Activities Of The Regulatory Bodies), Independence of Regulatory Authorities; Performance Evaluation; Source Security and Emergency Preparedness (Infrastructure Requirements at the International, National And User's Level)

  18. International conference on national infrastructures for radiation safety: Towards effective and sustainable systems. Contributed papers

    International Nuclear Information System (INIS)

    2003-01-01

    The International Atomic Energy Agency (IAEA), in co-operation with the World Health Organization (WHO), the International Labour Office (ILO), the European Commission (EC), and the OECD Nuclear Energy Agency (NEA), organized the International Conference on National Infrastructures for Radiation Safety: Towards Effective and Sustainable Systems. This book contains contributed papers submitted on pertinent issues, including stakeholder involvement, IAEA Model Projects on Upgrading Radiation Protection Infrastructure, Quality Assurance, education and training, regulatory activities, performance evaluation, source security, and emergency preparedness. The material in this book has not been edited by the IAEA. These contributed papers will be published on a CD ROM as part of the Proceedings of the Conference, along with the invited papers and discussions. The papers are grouped by topical sessions: Stakeholder Involvement in Building and Maintaining National Radiation Safety Infrastructure (National and International); Implementation Experience with The Model Projects (Views From The Countries, Positive and Negative Experiences); Resources and Services (Systematic Approach), Quality Assurance, International Support Of Services; Sustainable Education And Training: Developing Skills (National Systems And Regional Solutions); Needs for Education And Training at The International Level (Including IAEA Programmes Assisting in Establishing Adequate Infrastructures); Authorization, Inspection and Enforcement (Effectiveness and Efficiency Of The Activities Of The Regulatory Bodies), Independence of Regulatory Authorities; Performance Evaluation; Source Security and Emergency Preparedness (Infrastructure Requirements at the International, National And User's Level)

  19. MEETING VENUS. A Collection of Papers presented at the Venus Transit Conference Tromsoe 2012

    Science.gov (United States)

    Sterken, Christiaan; Aspaas, Per Pippin

    2013-05-01

    On 2-3 June 2012, the University of Tromsoe hosted a conference about the cultural and scientific history of the transits of Venus. The conference took place in Tromsoe for two very specific reasons. First and foremost, the last transit of Venus of this century lent itself to be observed on the disc of the Midnight Sun in this part of Europe during the night of 5 to 6 June 2012. Second, several Venus transit expeditions in this region were central in the global enterprise of measuring the scale of the solar system in the eighteenth century. The site of the conference was the Nordnorsk Vitensenter (Science Centre of Northern Norway), which is located at the campus of the University of Tromsoe. After the conference, participants were invited to either stay in Tromsoe until the midnight of 5-6 June, or take part in a Venus transit voyage in Finnmark, during which the historical sites Vardoe, Hammerfest, and the North Cape were to be visited. The post-conference program culminated with the participants observing the transit of Venus in or near Tromsoe, Vardoe and even from a plane near Alta. These Proceedings contain a selection of the lectures delivered on 2-3 June 2012, and also a narrative description of the transit viewing from Tromsoe, Vardoe and Alta. The title of the book, Meeting Venus, refers the title of a play by the Hungarian film director, screenwriter and opera director Istvan Szabo (1938-). The autobiographical movie Meeting Venus (1991) directed by him is based on his experience directing Tannhauser at the Paris Opera in 1984. The movie brings the story of an imaginary international opera company that encounters a never ending series of difficulties and pitfalls that symbolise the challenges of any multicultural and international endeavour. As is evident from the many papers presented in this book, Meeting Venus not only contains the epic tales of the transits of the seventeenth, eighteenth and nineteenth centuries, it also covers the conference

  20. Papers of the 1997 CERI international petrochemical conference : transformation, growth and future direction

    International Nuclear Information System (INIS)

    1997-06-01

    A global overview of the current state of the petrochemical industry, a forecast of future developments, and Alberta's place in the petrochemical industry were the principal themes of this conference. Main topics explored included: (1) global opportunities for petrochemical producers, (2) natural gas and feedstock supplies, (3) chemical industry environment, (4) pipeline implications and transportation systems for the petrochemical industry, (5) partnerships, (6) investment cycles, and (7) forces and future directions for the Canadian industry. The Proceedings volume includes complete text of some of the papers, and speaking notes and copies of overhead slides for others, as submitted by individual speakers. refs., tabs., figs

  1. Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

    Science.gov (United States)

    Haseeb, A. S. M. A.; Arafat, M. M.; Tay, S. L.; Leong, Y. M.

    2017-10-01

    Tin (Sn)-based solders have established themselves as the main alternative to the traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn-based solders continues to be a concern. In order to make Sn-based solders microstructurally more stable and hence more reliable, researchers are showing great interest in investigating the effects of the incorporation of different nanoparticles into them. This paper gives an overview of the influence of metallic nanoparticles on the characteristics of interfacial intermetallic compounds (IMCs) in Sn-based solder joints on copper substrates during reflow and thermal aging. Nanocomposite solders were prepared by mechanically blending nanoparticles of nickel (Ni), cobalt (Co), zinc (Zn), molybdenum (Mo), manganese (Mn) and titanium (Ti) with Sn-3.8Ag-0.7Cu and Sn-3.5Ag solder pastes. The composite solders were then reflowed and their wetting characteristics and interfacial microstructural evolution were investigated. Through the paste mixing route, Ni, Co, Zn and Mo nanoparticles alter the morphology and thickness of the IMCs in beneficial ways for the performance of solder joints. The thickness of Cu3Sn IMC is decreased with the addition of Ni, Co and Zn nanoparticles. The thickness of total IMC layer is decreased with the addition of Zn and Mo nanoparticles in the solder. The metallic nanoparticles can be divided into two groups. Ni, Co, and Zn nanoparticles undergo reactive dissolution during solder reflow, causing in situ alloying and therefore offering an alternative route of alloy additions to solders. Mo nanoparticles remain intact during reflow and impart their influence as discrete particles. Mechanisms of interactions between different types of metallic nanoparticles and solder are discussed.

  2. Selected papers from the 11th European Conference on Applied Superconductivity (EUCAS 2013)

    Science.gov (United States)

    Ferdeghini, Carlo; Putti, Marina

    2014-04-01

    The 11th edition of the European Conference on Applied Superconductivity (EUCAS) was held in Genoa (15-19 September 2013) and registered the participation of more than one thousand attendants from over 40 countries. During the conference seven plenary lectures, 23 invited, and 203 oral contributions and 550 posters have been presented, all focused on recent developments in the field of superconductivity applications. This issue of Superconductor Science Technology is a collection of some of the plenary and invited contributions. Moreover, the winners of the EUCAS prizes (the electronics prize dedicated to the memory of Antonio Barone), and the most significant oral contributions selected by the 125 chairs involved in the organization, have been invited to submit their papers. The remaining papers presented at the conference will be published in the Journal Physics Conference Series, edited by S Farinon, G Lamura, A Malagoli and I Pallecchi. The papers have been organized into the four traditional topics of interest of EUCAS, namely materials, wires and tapes, large scale applications, and electronics. The plenary lectures on these four topics have been collected: Potential of iron-based superconductors for practical materials in the future (J Shimoyama), Coated conductors for power applications: materials challenges (J Obradors), Challenges and status of ITER conductor production (A Devred), and the Impact of superconducting devices in imaging in neuroscience (G L Romani). We hope that this issue will let you taste the flavours, hear the sounds and see the colours of this exciting EUCAS edition. The very large participation in EUCAS 2013 has allowed debates on a wide range of topics, starting from the most basic studies on emergent materials up to the new developments in electronics and large scale applications. A round table on HTS Conductors was experimented for the first time gathering material scientists, wire manufacturers and device builders in a stimulating

  3. Soldering of Nanotubes onto Microelectrodes

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing sold...... bonds were consistently found to be mechanically stronger than the carbon nanotubes.......Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...

  4. Do Mendeley reader counts reflect the scholarly impact of conference papers? An investigation of Computer Science and Engineering fields

    Energy Technology Data Exchange (ETDEWEB)

    Aduku, K.J.; Thelwall, M.; Kousha, K.

    2016-07-01

    Counts of Mendeley readers may give useful evidence about the impact of research. Although several studies have indicated that there are significant positive correlations between counts of Mendeley readers and citation counts for journal articles, it is not known how the pattern of association may vary between journal articles and conference papers. To fill this gap, Mendeley readership data and Scopus citation counts were extracted for both journal articles and conference papers published in 2011 in four fields for which conferences are important; Computer Science Applications, Computer Software, Building & Construction Engineering and Industrial & Manufacturing Engineering. Mendeley readership counts were found to correlate moderately with citation counts for both journal articles and conference papers in Computer Science Applications and Computer Software. Nevertheless, the correlations were much lower between Mendeley readers and citation counts for conference papers than for journal articles in Building & Construction Engineering and Industrial & Manufacturing Engineering. Hence, there seems to be disciplinary differences in the usefulness of Mendeley readership counts as impact indicators for conference papers, even between fields for which conferences are important. (Author)

  5. Papers presented at the eleventh topical conference on high-temperature plasma diagnostics

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1996-12-31

    This report contains the following eleven papers presented at the conference: Neutral Beam Diagnostics for Alcator C-Mod; A Study for the Installation of the TEXT HIBP on DIII-D; Time-domain Triple-probe Measurement of Edge Plasma Turbulence on TEXT-U; A Langmuir/Mach Probe Array for Edge Plasma Turbulence and Flow; Determination of Field Line Location and Safety Factor in TEXT-U; Hybrid ECE Imaging Array System for TEXT-U; First Results from the Phase Contrast Imaging System on TEXT-U; A Fast Tokamak Plasma Flux and Electron Density Reconstruction Technique; Time-series Analysis of Nonstationary Plasma Fluctuations Using Wavelet Transforms; Quantitative Modeling of 3-D Camera Views for Tokamak Divertors; and Variable-frequency Complex Demodulation Technique for Extracting Amplitude and Phase Information. Selected papers are indexed separately for inclusion in the Energy Science and Technology Database.

  6. Papers presented at the eleventh topical conference on high-temperature plasma diagnostics

    International Nuclear Information System (INIS)

    1996-01-01

    This report contains the following eleven papers presented at the conference: Neutral Beam Diagnostics for Alcator C-Mod; A Study for the Installation of the TEXT HIBP on DIII-D; Time-domain Triple-probe Measurement of Edge Plasma Turbulence on TEXT-U; A Langmuir/Mach Probe Array for Edge Plasma Turbulence and Flow; Determination of Field Line Location and Safety Factor in TEXT-U; Hybrid ECE Imaging Array System for TEXT-U; First Results from the Phase Contrast Imaging System on TEXT-U; A Fast Tokamak Plasma Flux and Electron Density Reconstruction Technique; Time-series Analysis of Nonstationary Plasma Fluctuations Using Wavelet Transforms; Quantitative Modeling of 3-D Camera Views for Tokamak Divertors; and Variable-frequency Complex Demodulation Technique for Extracting Amplitude and Phase Information. Selected papers are indexed separately for inclusion in the Energy Science and Technology Database

  7. Strength of joints brazed with two-phase solders

    International Nuclear Information System (INIS)

    Shnyakin, N.S.; Parfenova, L.V.; Ekatova, A.S.; Prilepskaya, I.V.

    1976-01-01

    Dependence of the structure and strength of soldered joints upon a gap size in case of 1Kh18N10T stainless steel soldering with a double-phase solder of Ni-Zn-Cu system is described. Butt and lap joints have been subjected to soldering with gas-flame and induction heating. The optimum conditions of the solder crystallization are determined with wedge-gap samples. The studies show that the character of distribution of a fusible β-phase in metal depends upon a gap size. With gaps up to 0.1 mm the β-phase enriched with a fusible component (zinc) runs as a continuous thin interlayer in the middle of the seam. As a result of zinc evaporation from the β-phase this interlayer becomes internally oxidized. After the sample is broken an oxidized fracture gives one the impression of a poor fusion in the middle part of the joint. The ultimate strength of butt joints is 15-20 kgf/sq.mm. A value of thermal expansion of 1Kh18N10T steel samples, 1-5 mm thick, has been experimentally determined for butt soldering. The elongation of two halves of the sample is measured by an indicator and proved to be 0.89 mm for a 50x50x2 mm sample at a soldering temperature of 1.100 deg C. The paper presents methods for the calculation of an optimal gap value for butt soldering with a local gas-flame and induction heating

  8. Stanford Occasional Papers in Linguistics, No. 3. Papers from the Annual California Linguistics Conference (3rd, May 5-6, 1973).

    Science.gov (United States)

    Gee, James Paul, Ed.; And Others

    This volume includes 12 of the 24 papers presented at the Third Annual California Linguistics Conference. Selections are drawn from each of the four sessions, covering semantic and lexical structure, phonology, syntax, and language in context. Each of the papers includes a bibliography, as well as diagrams, charts, and appendixes when necessary.…

  9. Proceedings of the 3rd international conference on heat exchangers, boilers and pressure vessels (HEB-97). Vol.1 (Research Papers)

    International Nuclear Information System (INIS)

    1997-04-01

    This conference was held on 5-6 Apr 1997 in Alexandria. the specialists discussed heat exchangers, boilers and pressure vessels. more than 200 papers were presented in the meetings. it contains of data, figures and tables

  10. Proceedings of the 3rd international conference on heat exchangers, boilers and pressure vessels (HEB-97). Vol.1 (Research Papers)

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1997-04-01

    This conference was held on 5-6 Apr 1997 in Alexandria. the specialists discussed heat exchangers, boilers and pressure vessels. more than 200 papers were presented in the meetings. it contains of data, figures and tables.

  11. 28. conference of the Nuclear Societies in Israel. Program and papers

    International Nuclear Information System (INIS)

    2016-01-01

    The File contains the presentations of the 28 annual conference of the nuclear societies in Israel. The subjects of the Conference are aspects of nuclear energy and nuclear technology, applications of radioisotopes and radiation, radiation measurements, issues in radiation protection and radiation in medicine. During the conference awards will be given for outstanding student works

  12. 27. Conference of the Nuclear Societies in Israel. Program and Papers

    International Nuclear Information System (INIS)

    2014-01-01

    The file contains the presentations of the 27 annual conference of the nuclear societies in Israel. The subjects of the conference are: aspects of nuclear energy and nuclear technology, applications of radioisotopes and radiation, radiation measurements, issues in radiation protection and radiation in medicine, the consequences of the Fukushima accident. During the conference awards will be given for outstanding student works

  13. A Survey of Phenomena in Ionized Gases. Invited Papers. A Collection of Invited Papers Presented at the Eighth International Conference on Phenomena in Ionized Gases

    International Nuclear Information System (INIS)

    1968-01-01

    Invited review papers from the Proceedings of the Eighth Conference on Phenomena in Ionized Gases, which was organized by the Technische Hochschule Wien and the Österreichische Studiengesellschaft für Atomenergie, and held in Vienna, 27 August - 2 September 1967. The IAEA and the International Union of Pure and Applied Physics supported the organizers. Contents: Introductory papers (3 papers); Collision processes (4 papers); Waves and beams in plasmas (6 papers); Surface phenomena (3 papers); Lasers (3 papers); Low pressure discharges (1 paper); Selected topics in plasma physics (2 papers); High pressure discharges (3 papers); Probe techniques and theory (4 papers); Basic data and fundamental plasma processes (4 papers); Summary (1 paper). Each paper is in its original language (20 English, 3 French, 9 Russian and 2 German) and is preceded by an abstract in English, with a second one in the original language if this is not English. (author)

  14. A new method for soldering particle-reinforced aluminum metal matrix composites

    Energy Technology Data Exchange (ETDEWEB)

    Lu, Jinbin; Mu, Yunchao [Zhongyuan University of Technology, Zhengzhou 450007 (China); Luo, Xiangwei [Zhengzhou University, Zhengzhou 450002 (China); Niu, Jitai, E-mail: niujitai@163.com [Zhongyuan University of Technology, Zhengzhou 450007 (China)

    2012-12-01

    Highlights: Black-Right-Pointing-Pointer Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. Black-Right-Pointing-Pointer The nickel plating is required on the surface of the composites before soldering. Black-Right-Pointing-Pointer Low welding temperature is set to avoid overheating of the matrix. Black-Right-Pointing-Pointer Chemical and metallurgical bonding of composites and Kovar is carried out. Black-Right-Pointing-Pointer High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al-SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe-Ni-Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn-Cd-Ag-Cu) with a melting point of about 400 Degree-Sign C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)-Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al-SiC composite.

  15. A new method for soldering particle-reinforced aluminum metal matrix composites

    International Nuclear Information System (INIS)

    Lu, Jinbin; Mu, Yunchao; Luo, Xiangwei; Niu, Jitai

    2012-01-01

    Highlights: ► Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. ► The nickel plating is required on the surface of the composites before soldering. ► Low welding temperature is set to avoid overheating of the matrix. ► Chemical and metallurgical bonding of composites and Kovar is carried out. ► High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al–SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe–Ni–Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn–Cd–Ag–Cu) with a melting point of about 400 °C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)–Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al–SiC composite.

  16. Papers of the 2. annual Canadian Institute conference on interjurisdictional power transactions

    International Nuclear Information System (INIS)

    2002-01-01

    Leaders in the electric power industry from Canada and the United States attended this conference which focused on ways that Ontario's new competitive energy market can maximize its profits through interjurisdictional power transactions with the US northeast and midwest. Topics of discussion included how to target power sales to hotspots in the United States, how to avoid seams issues when wheeling power through jurisdictions, and how to monitor intertie capacity. Other issues were also addressed, including how to manage profits from the financial transmission rights structure, and tracking the latest developments in RTO creation in the United States and its potential impact on interjurisdictional power transactions. A total of 12 papers were presented, of which 4 were indexed separately for inclusion in the database. tabs., figs

  17. Papers presented at the fourteenth international conference on plasma physics and controlled nuclear fusion research

    International Nuclear Information System (INIS)

    1994-01-01

    This report contains the contributions of the CIEMAT's Fusion Unit to the 14th International Conference on Plasma Physics and Controlled Nuclear Fusion Research that was held by the International Atomic Energy Agency in Wurzburg, Germany from 30 September to 7 October 1992. Three papers were presented that summarized the main lines of work done in the Unit during the previous two years: The first one on the theoretical advances in the understanding of the Flexible Heliac TJ-II under construction, the second on the confinement studies performed in the operating TJ-I Tokamak and the third one on the description of the physical properties of the soon to be started TJ-IU Torsatron. (Author) 25 refs

  18. On the problem of soldering refractory metals with silver-containing solders

    International Nuclear Information System (INIS)

    Anikeev, E.F.; Andryushchenko, V.I.; Chepelenko, V.N.; Batov, V.M.

    1981-01-01

    The processes of wetting, spreading and interphase interactions of copper-silver liquid alloys alloyed with Ni and Si, with niobium, tantalum, molybdenum, tungsten, 12Kh18N10T steel and nickel are studied. It has been determined that Ni or Si additions into the copper-silver solder improve the wetting and adhesion. When soldering with the alloy containing Ni additions, the strength of a soldered Joint grows with the increase of soldering duration while soldering with the alloy containing Si additions, the strength decreases. That is why Ni-containing solders are preferable for soldering thick-walled structures, and Si-containing solders - for thin-walled structures [ru

  19. International conference on challenges faced by technical and scientific support organizations in enhancing nuclear safety. Contributed papers and presentations

    International Nuclear Information System (INIS)

    2007-01-01

    conclusions apply equally to TSOs, since their expertise is an integral part of supporting the regulatory decision making process over the entire life cycle of facilities and activities for the continuous improvement of safety. On the basis of the presentations and discussions, the conference developed conclusions as well as recommendations for consideration by TSOs, regulatory authorities, national governments, relevant international and regional organizations, the nuclear industry and other stakeholders. This CD-ROM contains the unedited contributed papers and the presentations that were submitted with some of the invited papers. A record of the conference including a summary, the opening speeches, the invited papers, and the conclusions and summary of the conference by the President are available in the printed STI/PUB-1301

  20. IFLA General Conference, 1986. Pre-Conference Seminar on Automated Systems for Access to Multilingual and Multiscript Library materials: Problems and Solutions. Papers.

    Science.gov (United States)

    International Federation of Library Associations and Institutions, The Hague (Netherlands).

    A seminar which considered problems and solutions regarding automated systems for access to multilingual and multiscript library materials was held as a pre-session before the IFLA general conference in 1986. Papers presented include: (1) "Romanized and Transliterated Databases of Asian Language Materials--History, Problems, and…

  1. TRACE Authored Papers from the First through Ninth Annual Conferences on Rehabilitation Engineering Technology (1977-1986).

    Science.gov (United States)

    Brady, Mary; And Others

    Brief papers authored by staff of the Trace Research and Development Center on Communication, Control, and Computer Access for Handicapped Individuals and presented at the first through ninth annual conferences on rehabilitation engineering technology are presented. Papers have the following titles and authors: "The Data Routing Module:…

  2. Reading Research in the Socialist Countries. Abridged Papers and Minutes of a Conference (Budapest, Hungary, October 15-18, 1974).

    Science.gov (United States)

    Dobrinina, Natalia Y., Ed.; And Others

    These papers on reading research in the socialist countries were delivered at a conference held in Budapest, Hungary, in October of 1974. Included are the text of the introductory address and papers on the following topics: (1) the library and society; (2) the library as it relates to students, teachers, and engineers; (3) the role and…

  3. Student Scientific Conference 2000. Abstracts of papers of students and post-graduate students

    International Nuclear Information System (INIS)

    Ilias, M.

    2000-04-01

    The aim of the Student Scientific Conference was review of works of students and post-graduate students from universities of the Slovak Republic and Czech Republic. The proceedings of the conference contain 43 abstracts of Biological Section, 69 abstracts of Chemical Section, 18 abstracts of Environmental Section, 15 abstracts of Geography and Cartography Section, and 31 abstracts of Geology Section

  4. Editorial: Papers from the 7th International Conference on Dendrochronology - Cultural Diversity, Environmental Variability

    Science.gov (United States)

    Margaret S. Devall; Elaine K. Sutherland

    2008-01-01

    The 7th International Conference on Dendrochronology - Cultural Diversity, Environmental Variability was held in Beijing, China from 11 to 17 June 2006. The conference was organized and hosted by the Institute of Botany, Chinese Academy of Sciences (IB_CAS) in conjunction with the International Union of Forest Research Organizations (IUFRO) Working Group 5.01.07 (Tree-...

  5. Report on international round table conference 'Accidental radiation contamination of food of animal origin'. Vol.II (Working papers)

    International Nuclear Information System (INIS)

    1986-01-01

    The World Association of Veterinary Food Hygienists (WAVFH) held an international round table conference in Stockholm, Sweden, January 26-29, 1987. The topic of the conference was 'Accidental Radiation Contamination of Food of Animal Origin'. The agenda was divided into three major topic areas: 1. Ecological Science; 2. Veterinary Science - Live Animals; and 3. Veterinary Science - Food of Animal Origin. Experts and delegates from member countries presented papers, participated in discussions and workshops and produced a multidisciplinary report covering the topic areas. Two volumes were produced; one a collection of all papers presented, and the other a compilation of the proceedings from each of the topic workshops. In order to rapidly distribute the Association's information to members, papers and other information were collated and disseminated as presented to the conference participants

  6. Report on international round table conference 'Accidental radiation contamination of food of animal origin'. Vol.II (Working papers)

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1986-07-01

    The World Association of Veterinary Food Hygienists (WAVFH) held an international round table conference in Stockholm, Sweden, January 26-29, 1987. The topic of the conference was 'Accidental Radiation Contamination of Food of Animal Origin'. The agenda was divided into three major topic areas: 1. Ecological Science; 2. Veterinary Science - Live Animals; and 3. Veterinary Science - Food of Animal Origin. Experts and delegates from member countries presented papers, participated in discussions and workshops and produced a multidisciplinary report covering the topic areas. Two volumes were produced; one a collection of all papers presented, and the other a compilation of the proceedings from each of the topic workshops. In order to rapidly distribute the Association's information to members, papers and other information were collated and disseminated as presented to the conference participants.

  7. Repigmentation in vitiligo: position paper of the Vitiligo Global Issues Consensus Conference.

    Science.gov (United States)

    Gan, Emily Y; Eleftheriadou, Viktoria; Esmat, Samia; Hamzavi, Iltefat; Passeron, Thierry; Böhm, Markus; Anbar, Tag; Goh, Boon Kee; Lan, Cheng-Che E; Lui, Harvey; Ramam, M; Raboobee, Noufal; Katayama, Ichiro; Suzuki, Tamio; Parsad, Davinder; Seth, Vaneeta; Lim, Henry W; van Geel, Nanja; Mulekar, Sanjeev; Harris, John; Wittal, Richard; Benzekri, Laila; Gauthier, Yvon; Kumarasinghe, Prasad; Thng, Steven T G; Silva de Castro, Caio Cesar; Abdallah, Marwa; Vrijman, Charlotte; Bekkenk, Marcel; Seneschal, Julien; Pandya, Amit G; Ezzedine, Khaled; Picardo, Mauro; Taïeb, Alain

    2017-01-01

    The Vitiligo Global Issues Consensus Conference (VGICC), through an international e-Delphi consensus, concluded that 'repigmentation' and 'maintenance of gained repigmentation' are essential core outcome measures in future vitiligo trials. This VGICC position paper addresses these core topics in two sections and includes an atlas depicting vitiligo repigmentation patterns and color match. The first section delineates mechanisms and characteristics of vitiligo repigmentation, and the second section summarizes the outcomes of international meeting discussions and two e-surveys on vitiligo repigmentation, which had been carried out over 3 yr. Treatment is defined as successful if repigmentation exceeds 80% and at least 80% of the gained repigmentation is maintained for over 6 months. No agreement was found on the best outcome measure for assessing target or global repigmentation, therefore highlighting the limitations of e-surveys in addressing clinical measurements. Until there is a clear consensus, existing tools should be selected according to the specific needs of each study. A workshop will be conducted to address the remaining issues so as to achieve a consensus. © 2017 John Wiley & Sons A/S. Published by John Wiley & Sons Ltd.

  8. Solder joint technology materials, properties, and reliability

    CERN Document Server

    Tu, King-Ning

    2007-01-01

    Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

  9. EPRI-DOE Conference on Environmentally-Enhanced Hydropower Turbines: Technical Papers

    Energy Technology Data Exchange (ETDEWEB)

    Hogan, T. [Alden Research Laboratory, Inc., Holden, MA (United States)

    2011-12-01

    The EPRI-DOE Conference on Environmentally-Enhanced Hydropower Turbines was a component of a larger project. The goal of the overall project was to conduct the final developmental engineering required to advance the commercialization of the Alden turbine. As part of this effort, the conference provided a venue to disseminate information on the status of the Alden turbine technology as well as the status of other advanced turbines and research on environmentally-friendly hydropower turbines. The conference was also a product of a federal Memorandum of Understanding among DOE, USBR, and USACE to share technical information on hydropower. The conference was held in Washington, DC on May 19 and 20, 2011 and welcomed over 100 attendees. The Conference Organizing Committee included the federal agencies with a vested interest in hydropower in the U.S. The Committee collaboratively assembled this conference, including topics from each facet of the environmentally-friendly conventional hydropower research community. The conference was successful in illustrating the readiness of environmentally-enhanced hydropower technologies. Furthermore, the topics presented illustrated the need for additional deployment and field testing of these technologies in an effort to promote the growth of environmentally sustainable hydropower in the U.S. and around the world.

  10. Preface to Special Topic: Selected Papers from the 5th International Conference on Optofluidics

    OpenAIRE

    Fan, Shih-Kang; Yang, Zhenchuan

    2016-01-01

    The 5th International Conference on Optofluidics (Optofluidics 2015) was held in Taipei, Taiwan, July 26–29, 2015. The aim of this conference was to provide a forum to promote scientific exchange and to foster closer networks and collaborative ties between leading international researchers in optics and micro/nanofluidics across various disciplines. The scope of Optofluidics 2015 was deliberately broad and interdisciplinary, encompassing the latest advances and the most innovat...

  11. Student Scientific Conference 2001. Abstracts of papers of students and post-graduate students

    International Nuclear Information System (INIS)

    Stankovicova, H.

    2001-04-01

    The aim of the Student Scientific Conference was to review the works of students and post-graduate students from universities of the Slovak Republic and Czech Republic as well as from Slovak Academy of Sciences and Czech Academy of Sciences. The proceedings of the conference contain 63 abstracts of Biological Section, 16 abstracts of Didactic Section, 39 abstracts of Environmental Section, 15 abstracts of Geography Section, 12 abstracts of Geology Section, and 42 abstracts of Chemical Section

  12. Properties and Microstructures of Sn-Bi-X Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Fan Yang

    2016-01-01

    Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

  13. Short Paper and Poster Proceedings of the 22nd Annual Conference on Computer Animation and Social Agents

    NARCIS (Netherlands)

    Nijholt, Antinus; Egges, A.; van Welbergen, H.; Hondorp, G.H.W.

    2009-01-01

    These are the proceedings containing the short and poster papers of CASA 2009, the twenty second international conference on Computer Animation and Social Agents. CASA 2009 was organized in Amsterdam, the Netherlands from the 17th to the 19th of June 2009. CASA is organized under the auspices of the

  14. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    Directory of Open Access Journals (Sweden)

    Lei Sun

    2015-01-01

    Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

  15. International Conference on Plasma Diagnostics. Slides, papers and posters of Plasma Diagnostics 2010

    International Nuclear Information System (INIS)

    Hartfuss, H.J.; Bonhomme, G.; Grisolia, C.; Hirsch, M.; Klos, Z.; Mazouffre, S.; Musielok, J.; Ratynskaya, S.; Sadowski, M.; Van de Sanden, R.; Sentis, M.; Stroth, U.; Tereshin, V.; Tichy, M.; Unterberg, B.; Weisen, H.; Zoletnik, S.

    2011-01-01

    Plasma diagnostics 2010 is an International Conference on Diagnostic Methods involved in Research and Applications of Plasmas, originating on combining the 5. German-Polish Conference on Plasma Diagnostics for Fusion and Applications and the 7. French-Polish Seminar on Thermal Plasma in Space and Laboratory. The Scientific Committee of 'Plasma 2007' decided to concentrate the attention of future conferences more on the diagnostic development and diagnostic interpretation in the fields of high and low temperature plasmas and plasma applications. It is aimed at involving all European activities in the fields. The Scientific Program will cover the fields from low temperature laboratory to fusion plasmas of various configurations as well as dusty and astrophysical plasmas and industrial plasma applications

  16. International conference on the operational safety performance in nuclear installations. Contributed papers

    International Nuclear Information System (INIS)

    2005-01-01

    In 2001, the IAEA organized an 'International Conference on Topical Issues in Nuclear Safety'. The issues discussed during the conference were: (1) risk- informed decision-making; (2) influence of external factors on safety; (3) safety of fuel cycle facilities; (4) safety of research reactors; and (5) safety performance indicators. Senior nuclear safety decision makers reviewed the issues and formulated recommendations for future actions by national and international organizations. In 2004, the IAEA organized an 'International Conference on Topical Issues in Nuclear Safety' in Beijing China. The issues discussed during the conference were: (1) changing environment - coping with diversity and globalization; (2) operating experience - managing changes effectively; (3) regulatory management systems - adapting to changes in the environment; and (4) long term operations - maintaining safety margins while extending plant lifetimes. The results of this conference confirmed the importance of operators and regulators of nuclear facilities meeting periodically to share experience and opinion on emerging issues and future challenges of the nuclear industry. Substantial progress has been made, and continues to be made by Member States in enhancing the safety of nuclear installations worldwide. At the same time, more attention is being given to other areas of nuclear safety. The safety standards for research reactors are being updated and new standards are planned on the safety of other facilities in the nuclear fuel cycle. The Agency has taken a lead role in this effort and is receiving much support from its Member States to gain international consensus in these areas. The objective of the conference is to foster the exchange of information on operational safety performance and operating experience in nuclear installations, with the aim of consolidating an international consensus on: - the present status of these issues; - emerging issues with international implications

  17. Preface to Special Topic: Selected Papers from the 5th International Conference on Optofluidics.

    Science.gov (United States)

    Fan, Shih-Kang; Yang, Zhenchuan

    2016-01-01

    The 5th International Conference on Optofluidics (Optofluidics 2015) was held in Taipei, Taiwan, July 26-29, 2015. The aim of this conference was to provide a forum to promote scientific exchange and to foster closer networks and collaborative ties between leading international researchers in optics and micro/nanofluidics across various disciplines. The scope of Optofluidics 2015 was deliberately broad and interdisciplinary, encompassing the latest advances and the most innovative developments in micro/nanoscale science and technology. Topics ranged from fundamental research to its applications in chemistry, physics, biology, materials, and medicine.

  18. 10. national conference of Maria Sklodowska-Curie Polish Radiation Research Society. Abstract of papers

    International Nuclear Information System (INIS)

    1995-01-01

    The 10. national conference of M. Sklodowska-Curie Polish Radiation Research Society has given the opportunity to present novel Polish advisement in all fields of radiation research, e.g. radiation chemistry and biology, radiation processing, environmental study, mathematical modeling and simulation as well as different theoretical study. As a whole it may be treated as a review of actual state of art. The scientific progress since 1992 when the 9. national conference place up to now can be easy assessed on the base of presented material

  19. Handbook of machine soldering SMT and TH

    CERN Document Server

    Woodgate, Ralph W

    1996-01-01

    A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

  20. 7. biennial U.S. TRIGA users' conference. Papers and abstracts

    International Nuclear Information System (INIS)

    1980-01-01

    The conference covers the following topics: new developments in the TRIGA system; uses of microprocessors in control and monitoring and measurement of TRIGA performance parameters; safeguards, emergency planning, reactor standards; research facilities, fuel tests and calculations; TRIGA reactor parameters: emergency training

  1. 10. biennial U.S. TRIGA users' conference. Papers and abstracts

    International Nuclear Information System (INIS)

    1986-01-01

    The conference cover the following main topics for TRIGA reactors: reactor instrumentation and measurements of reactor parameters, reactor operation and modifications, design innovation and service works, fast neutron spectrum, fuel examination, neutron flux, heat transfer, accidents analysis, corrosion problems, fuel failures and fuel management, mechanical problems and maintenance

  2. International Conference on the Safety of Radioactive Waste Management. Book of Papers

    International Nuclear Information System (INIS)

    2016-01-01

    The purpose of the conference was to highlight the importance of an integrated long term approach to the management of radioactive waste and spent fuel. The objectives of the conference were: • To foster information exchange between Member States, • To provide inputs that will promote further harmonization of safety in the fields of predisposal management and disposal of radioactive waste, • To highlight progress made in the safety of all types of radioactive waste. The conference served as a forum for discussing past experiences and future challenges. Furthermore, it seeked to identify Member States’ needs in order to assist them — through specific activities under future IAEA programmes in this area — to develop and implement safe solutions for the management of their entire radioactive waste inventory. The conference addressed all aspects of predisposal management and disposal of radioactive waste and spent fuel, including waste arising from accidental situations. The management of radioactive waste and residues from mining activities, as well as the control of discharges from nuclear facilities and activities, were, however, outside of its scope.

  3. 11. biennial U.S. TRIGA users' conference. Papers and abstracts

    International Nuclear Information System (INIS)

    1988-01-01

    The Conference was devoted to different aspects of TRIGA reactors design, operation and applications. The main topics concerned fuel elements, control rod drive system; modelling of corrosion damage and other chemical and material studies; neutron flux measurements and spectrum; irradiation devices; fuel element failures; neutron radiography etc

  4. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

    Science.gov (United States)

    Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

    2015-01-01

    Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. PMID:27877786

  5. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

    International Nuclear Information System (INIS)

    Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

    2015-01-01

    Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. (review)

  6. International conference on lessons learned from the decommissioning of nuclear facilities and the safe termination of nuclear activities. Contributed papers

    International Nuclear Information System (INIS)

    2006-12-01

    The International Atomic Energy Agency (IAEA), in cooperation with the European Commission (EC), Nuclear Energy Agency to the Organisation for Economic Co-operation and Development (OECD/NEA), and the World Nuclear Association (WNA), organized an International Conference on Lessons Learned from the Decommissioning of Nuclear Facilities and the Safe Termination of Nuclear Activities from 11 to 15 December 2006 in Athens, Greece. This Book of Contributed Papers contains technical papers and posters contributed by experts from operating organisations, regulatory bodies, technical support organisations, and other institutions on issues falling within the scope of the Conference. The following main topics were covered: Evolution of national and international policies and criteria for the safe and efficient decommissioning of nuclear facilities and safe termination of nuclear activities; Review of lessons learned from ongoing or completed activities associated with decommissioning; Improvement of safety and efficiency through the use of new and innovative technologies; Practical aspects in the management of material, waste and sites resulting from decommissioning, including the management of waste in the absence of repositories and waste acceptance requirements; Procedures for demonstrating compliance with clearance criteria; Experience from radiological assessments associated with decommissioning; Involvement of the local communities and the impact that decommissioning activities has on them. The presented papers and posters were reviewed and accepted following the guidelines established by the Conference Programme Committee for consideration at the Conference. The material compiled in this Book of Contributed Papers has not undergone rigorous editing by the editorial staff of the IAEA. However, certain modifications were made: a unified format was adopted for all papers; and minor corrections were made in the text where required. Each paper and poster has been indexed

  7. International conference on lessons learned from the decommissioning of nuclear facilities and the safe termination of nuclear activities. Contributed papers

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2006-12-15

    The International Atomic Energy Agency (IAEA), in cooperation with the European Commission (EC), Nuclear Energy Agency to the Organisation for Economic Co-operation and Development (OECD/NEA), and the World Nuclear Association (WNA), organized an International Conference on Lessons Learned from the Decommissioning of Nuclear Facilities and the Safe Termination of Nuclear Activities from 11 to 15 December 2006 in Athens, Greece. This Book of Contributed Papers contains technical papers and posters contributed by experts from operating organisations, regulatory bodies, technical support organisations, and other institutions on issues falling within the scope of the Conference. The following main topics were covered: Evolution of national and international policies and criteria for the safe and efficient decommissioning of nuclear facilities and safe termination of nuclear activities; Review of lessons learned from ongoing or completed activities associated with decommissioning; Improvement of safety and efficiency through the use of new and innovative technologies; Practical aspects in the management of material, waste and sites resulting from decommissioning, including the management of waste in the absence of repositories and waste acceptance requirements; Procedures for demonstrating compliance with clearance criteria; Experience from radiological assessments associated with decommissioning; Involvement of the local communities and the impact that decommissioning activities has on them. The presented papers and posters were reviewed and accepted following the guidelines established by the Conference Programme Committee for consideration at the Conference. The material compiled in this Book of Contributed Papers has not undergone rigorous editing by the editorial staff of the IAEA. However, certain modifications were made: a unified format was adopted for all papers; and minor corrections were made in the text where required. Each paper and poster has been indexed

  8. PREFACE: Selected papers from the Fourth Annual q-bio Conference on Cellular Information Processing Selected papers from the Fourth Annual q-bio Conference on Cellular Information Processing

    Science.gov (United States)

    Nemenman, Ilya; Faeder, James R.; Hlavacek, William S.; Jiang, Yi; Wall, Michael E.; Zilman, Anton

    2011-10-01

    Summary This special issue consists of 11 original papers that elaborate on work presented at the Fourth Annual q-bio Conference on Cellular Information Processing, which was held on the campus of St John's College in Santa Fe, New Mexico, USA, 11-14 August 2010. Now in its fourth year, the q-bio conference has changed considerably over time. It is now well established and a major event in systems biology. The 2010 conference saw attendees from all continents (except Antarctica!) sharing novel results and participating in lively discussions at both the oral and poster sessions. The conference was oversubscribed and grew to 27 contributed talks, 16 poster spotlights and 137 contributed posters. We deliberately decreased the number of invited speakers to 21 to leave more space for contributed presentations, and the attendee feedback confirmed that the choice was a success. Although the q-bio conference has grown and matured, it has remained true to the original goal of being an intimate and dynamic event that brings together modeling, theory and quantitative experimentation for the study of cell regulation and information processing. Funded in part by a grant from NIGMS and by DOE funds through the Los Alamos National Laboratory Directed Research and Development program, the conference has continued to exhibit youth and vigor by attracting (and partially supporting) over 100 undergraduate, graduate and postdoctoral researchers. The associated q-bio summer school, which precedes the conference each year, further emphasizes the development of junior scientists and makes q-bio a singular event in its impact on the future of quantitative biology. In addition to an increased international presence, the conference has notably diversified its demographic representation within the USA, including increased participation from the southeastern corner of the country. One big change in the conference this year is our new publication partner, Physical Biology. Although we are very

  9. Applications of Mathematical Logic in Philosophy and Linguistics, Papers of a Conference

    CERN Document Server

    Malzkom, Wolfgang; Räsch, Thoralf

    2003-01-01

    "Foundations of the Formal Sciences" (FotFS) is a series of interdisciplinary conferences in mathematics, philosophy, computer science and linguistics. The main goal is to reestablish the traditionally strong links between these areas of research that have been lost in the past decades. The second conference in the series had the subtitle "Applications of Mathematical Logic in Philosophy and Linguistics" and brought speakers from all parts of the Formal Sciences together to give a holistic view of how mathematical methods can improve our philosophical and technical understanding of language and scientific discourse, ranging from the theoretical level up to applications in language recognition software. Audience: This volume is of interest to all formal philosophers and theoretical linguists. In addition to that, logicians interested in the applications of their field and logic students in mathematics, computer science, philosophy and linguistics can use the volume to broaden their knowledge of applications of...

  10. Papers of the CAMPUT 2003 educational conference : Markets in Transition : The changing face of regulation

    International Nuclear Information System (INIS)

    2003-01-01

    The North American energy landscape is evolving: markets are in transition and regulatory roles are shifting. Regulators, government policy makers, and industry representatives exchanged information concerning the changes facing regulatory agencies, industry and energy users. The eleven sessions of the conference were entitled: (1) the future of the regulator in a continental energy market, (2) gas markets in transition, (3) electricity markets in transition (including Regional Transmission Organization/Standard Market Design issues), (4) are open access markets the answer? (5) the changing face of regulation, what's up? (6) energy policy updates in British Columbia and Atlantic Canada, (7) Ontario electricity update and deregulation one year later, (8) northern issues, (9) intervener funding, (10) affiliate transactions, regulatory and business issues, and (11) cost of capital update. The conference featured 43 presentations, of which two were indexed separately for inclusion in the database. refs., tabs., figs

  11. Papers of the Public Policy Forum conference : Fueling our future : strategic energy policy opportunities for Canada

    International Nuclear Information System (INIS)

    2004-01-01

    The Public Policy Forum is a unique organization in Canada which promotes excellence in public policy development due to its firm belief that high quality government is fundamental in the competitive global economy. This conference provided a forum to discuss recent developments in the oil markets and energy policies from a public policy perspective. Trends in global energy supply and demand were also reviewed with emphasis on issues such as industry consolidation, regulatory reform and oil pricing. The presentations examined the world energy outlook in terms of fossil fuel consumption, demand growth in developing countries, energy security, and how to reduce greenhouse gases for sustainable development. This conference featured 20 presentations, of which 4 have been catalogued separately for inclusion in this database. refs., tabs., figs

  12. Papers of the CAMPUT 2003 educational conference : Markets in Transition : The changing face of regulation

    International Nuclear Information System (INIS)

    2003-01-01

    The North American energy landscape is evolving: markets are in transition and regulatory roles are shifting. Regulators, government policy makers, and industry representatives exchanged information concerning the changes facing regulatory agencies, industry and energy users. The eleven sessions of the conference were entitled: (1) the future of the regulator in a continental energy market, (2) gas markets in transition, (3) electricity markets in transition (including Regional Transmission Organization/Standard Market Design issues), (4) are open access markets the answer? (5) the changing face of regulation, what's up? (6) energy policy updates in British Columbia and Atlantic Canada, (7) Ontario electricity update and deregulation one year later, (8) northern issues, (9) intervener funding, (10) affiliate transactions, regulatory and business issues, and (11) cost of capital update. The conference featured 43 presentations, of which two were indexed separately for inclusion in the database

  13. Impact of bankruptcy and insolvency on third parties in the petroleum industry: conference papers

    International Nuclear Information System (INIS)

    1999-01-01

    The Insight Conference has seven articles on the following aspects of the conference theme: I - overview of the Bankruptcy and Insolvency Act and Companies' Creditor's Arrangement Act; II- the effects of bankruptcy and insolvency on exploration agreements; III - the effects of bankruptcy on CO and O, unit and pooling agreements; IV - impact of bankruptcy and insolvency on marketing and transportation agreements; V - claims of operators, non-operators and third parties arising from oil and gas operations; V I - buying and selling assets from a bankrupt or insolvent party; and VII - environmental liability for receivers, trustees and others in the petroleum industry. Abstracts/descriptors are included for articles II, V, and VII. separately

  14. Homeland Security Affairs Journal, Supplement - 2012: IEEE 2011 Conference on Technology for Homeland Security: Best Papers

    OpenAIRE

    2012-01-01

    Homeland Security Affairs is the peer-reviewed online journal of the Naval Postgraduate School Center for Homeland Defense and Security (CHDS), providing a forum to propose and debate strategies, policies, and organizational arrangements to strengthen U.S. homeland security. The instructors, participants, alumni, and partners of CHDS represent the leading subject matter experts and practitioners in the field of homeland security. IEEE Supplement 2012. Supplement: IEEE 2011 Conference on Te...

  15. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Directory of Open Access Journals (Sweden)

    Xiuyun Zhou

    2015-10-01

    Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  16. Contamination profile on typical printed circuit board assemblies vs soldering process

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

  17. Papers

    DEFF Research Database (Denmark)

    Thoft-Christensen, Palle

    The chapters in this Volume 7 of a series of PAPERS are based on papers published in the period 2004 - 2008 authored/co-authored by Palle Thoft-Christensen......The chapters in this Volume 7 of a series of PAPERS are based on papers published in the period 2004 - 2008 authored/co-authored by Palle Thoft-Christensen...

  18. REFUEL. The harvest so far. Papers to the 15th European Biomass Conference and Exhibition, May 2007

    International Nuclear Information System (INIS)

    2007-01-01

    The REFUEL project is designed to encourage a greater market penetration of biofuels. To help achieve this goal, we will develop a biofuels road map, consistent with EU biofuel policies and supported by stakeholders involved in the biofuels field. Starting early 2006, the project involves seven renowned partners and will take 24 months to complete. Refuel is financed by the European Commission under the 'Intelligent Energy - Europe' programme. This report contains papers that were presented at the title conference

  19. 2nd International Conference on Mechanical, Manufacturing and Process Plant Engineering

    CERN Document Server

    2017-01-01

    This volume presents selected papers from the 2nd International Conference on Mechanical, Manufacturing and Process Plant Engineering (ICMMPE 2016) which was held from 23rd to 24th November, 2016 in Kuala Lumpur, Malaysia. The proceedings discuss genuine problems of joining technologies that are heart of manufacturing sectors. It discusses the findings of experimental and numerical works from soldering, arc welding to solid state joining technology that faced by current industry. .

  20. Factors Affecting Subsequent Full-text Publication of Papers Presented at the Annual Conference of the Indian Academy of Pediatrics.

    Science.gov (United States)

    Khalil, Sumaira; Mishra, Devendra; Mishra, Ruchi; Gupta, Shalu

    2017-02-15

    To study the factors associated with the subsequent (over next 9 years) full-text publication of papers presented at the 44th National Conference of Indian Academy of Pediatrics (PEDICON), 2007. All papers presented at PEDICON 2007 were searched for subsequent full-text publication over the next 9 years in English-language journals by an internet-based search. The published papers were compared with the conference-abstracts. 74 (16%) of the 450 abstracts presented were subsequently published; 61 (82.4%) in Medline-indexed journals. Majority (50, 67.6%) of the papers was published within the first 36 mo in journals with mean (SD) impact factor of 2.62 (1.63). The factors significantly associated with subsequent publication were papers presented as award papers (Pfull-papers, 55% had a change in title; authors were changed in 65%, and participants' numbers were dissimilar in 8.6%. There is a need to identify the factors responsible for this low rate of subsequent publication, and interventions to improve it both at institutional and researchers' level.

  1. Spectroscopic investigation of oxidized solder surfaces

    International Nuclear Information System (INIS)

    Song, Jenn-Ming; Chang-Chien, Yu-Chien; Huang, Bo-Chang; Chen, Wei-Ting; Shie, Chi-Rung; Hsu, Chuang-Yao

    2011-01-01

    Highlights: → UV-visible spectroscopy is successfully used to evaluate the degree of discoloring of solders. → The surface oxides of solders can also be identified by UV-visible absorption spectra. → The discoloration of solder surface can be correlated with optical characterization of oxides. → A strategy against discoloring by alloying was also suggested. - Abstract: For further understanding of the discoloration of solder surfaces due to oxidation during the assembly and operation of electronic devices, UV-vis and X-ray photoelectron spectroscopic analyses were applied to evaluate the degree of discoloring and identify the surface oxides. The decrease in reflectance of the oxidized solder surface is related to SnO whose absorption band is located within the visible region. A trace of P can effectively depress the discoloration of solders under both solid and semi-solid states through the suppression of SnO.

  2. Soldering of Mg Joints Using Zn-Al Solders

    Science.gov (United States)

    Gancarz, Tomasz; Berent, Katarzyna; Skuza, Wojciech; Janik, Katarzyna

    2018-04-01

    Magnesium has applications in the automotive and aerospace industries that can significantly contribute to greater fuel economy and environmental conservation. The Mg alloys used in the automotive industry could reduce mass by up to 70 pct, providing energy savings. However, alongside the advantages there are limitations and technological barriers to use Mg alloys. One of the advantages concerns phenomena occurring at the interface when joining materials investigated in this study, in regard to the effect of temperature and soldering time for pure Mg joints. Eutectic Zn-Al and Zn-Al alloys with 0.05 (wt pct) Li and 0.2 (wt pct) Na were used in the soldering process. The process was performed for 3, 5, and 8 minutes of contact, at temperatures of 425 °C, 450 °C, 475 °C, and 500 °C. Selected, solidified solder-substrate couples were cross-sectioned, and their interfacial microstructures were investigated by scanning electron microscopy. The experiment was designed to demonstrate the effect of time, temperature, and the addition of Li and Na on the kinetics of the dissolving Mg substrate. The addition of Li and Na to eutectic Zn-Al caused to improve mechanical properties. Higher temperatures led to reduced joint strength, which is caused by increased interfacial reaction.

  3. Papers of a Canadian Institute conference on basin deliverability in the WCSB

    International Nuclear Information System (INIS)

    2003-01-01

    Much of North America depends on the reserves of the Western Canada Sedimentary Basin (WCSB). As the basin reaches maturity, higher drilling levels and higher capital expenditures will be required to meet energy demands. This conference addresses the issue of future production from the WCSB and discusses how increasing decline rates will impact every sector of the natural gas industry. Topics of discussion include transportation assets, price volatility, and the gap between supply and demand. Key questions arising from depleting conventional gas reserves were addressed along with how gas prices will react to supply constraint. The issue of whether unconventional gas can make up for the shortfall in supply was discussed along with strategic decisions regarding the possibility of raising tolls to offset the effects of supply shortage. The impact that Alberta's regulatory environment may have on the economics of production in the WCSB were also discussed. The conference featured 11 presentations, of which 3 have been indexed separately for inclusion in this database. refs., tabs., figs

  4. International conference on isotopic and nuclear analytical techniques for health and environment. Unedited papers

    International Nuclear Information System (INIS)

    2004-01-01

    The IAEA has been supporting nuclear and isotopic analytical techniques as part of its mandate to foster the peaceful uses of nuclear energy for many years. Nuclear analytical laboratories have been installed and upgraded through technical co-operation assistance in many laboratories of Member States. These techniques, including INAA, CRF, PIXE, stable isotopes and radioisotopes, α, β, γ spectrometry, Moessbauer spectrometry, etc., have been applied to a wide range of subjects with varying success. Nuclear analytical techniques, featuring some intrinsic quality control aspects, such as multi-nuclide analysis, frequently serve as 'reference methods' to crosscheck critical results. As nuclear properties of elements are targeted, matrix problems seem to be negligible. In light of its continued commitment and support, the IAEA organized the International Conference on Isotopic and Nuclear Analytical Techniques for Health and Environment. Out of 220 from 61 countries who applied for participation, 155 official participants and five observers from 47 countries were in attendance, with 67 from 32 developing countries and 21 from international organizations, including the World Health Organization. Eleven plenary sessions were held. Also conducted was a panel discussion on Human Capacity Development Needs in the Areas of Analytical Quality Control Services (AQCS), Radiochemistry and Nutrition. The scientific sessions were divided into several topics, which reflect some of the important activities of the IAEA's Department of Nuclear Sciences and Applications (NA): - Isotopic and nuclear techniques (general); - Metrology and quality assurance in nuclear measurements; - Nuclear analytical techniques for environmental monitoring; - Radioecology; - Environmental monitoring; - Radiological safety of food and water; - Methodological aspects of stable isotope techniques in health and environment; - Applications of isotopic techniques in health and environment; - New

  5. POWER-GEN '90 conference papers: Volume 7 (Fossil plant performance availability and improvement) and Volume 8 (Nuclear power issues)

    International Nuclear Information System (INIS)

    Anon.

    1990-01-01

    This is book 4 of papers presented at the Third International Exhibition and Conference for the Power Generation Industries, December 4-6, 1990. This book contains Volume 7, Fossil Plant Performance Availability and Improvement, and Volume 8, Nuclear Power Issues. The topics of the papers include computer applications in plant operations and maintenance, managing aging plants, plant improvements, plant operations and maintenance, the future of nuclear power, achieving cost effective plant operation, managing nuclear plant aging and license renewal, and the factors affecting a decision to build a new nuclear plant

  6. Lead free solder mechanics and reliability

    CERN Document Server

    Pang, John Hock Lye

    2012-01-01

    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

  7. Papers of the 3. annual Canadian Institute conference on interjurisdictional power transactions

    International Nuclear Information System (INIS)

    2003-01-01

    Leaders from the electric power industry in both Canada and the United States presented their views on a wide range of topics dealing with interjurisdictional power transactions. Participants presented ideas on how to prepare for the Federal Energy Regulatory Commission's (FERC) proposed new Standard Market Design. They also addressed the issue of how to overcome congestion for seamless power transactions between Canada and the Northeast. The way in which some companies and regions are preparing themselves for locational marginal pricing were also presented. Other topics included the state of the market power mitigation in Ontario, and increased trade potential within Ontario, Quebec and Atlantic Canada. Updates on the Lake Erie Link project were included along with a discussion on the expected impact it may have on trade capacity between Canada and the United States. The conference featured 18 presentations, of which 7 have been indexed separately for inclusion in this database. refs., tabs., figs

  8. Computational Fluid Dynamics Conference, 8th, Honolulu, HI, June 9-11, 1987, Technical Papers

    International Nuclear Information System (INIS)

    Anon.

    1987-01-01

    The present conference on CFD methods considers upwind schemes for the solution of the Navier-Stokes (N-S) equations, separated flow simulations using the vortex method on a hypercube, a hybrid expert system for complex CFD problems, three-dimensional hypersonic flow simulations with an implicit upwind N-S method, conservation cells for finite volume calculations, three-dimensional mesh generation, and an extended grid-embedding scheme for viscous flows. Attention is also given to unsteady incompressible flow algorithms based on artificial compressibility, difference schemes for the three-dimensional Euler equations, combustor flow computations in general coordinates, a multigrid Euler method for fighter configurations, a prediction method for supersonic/hypersonic inviscid flow, adaptive methods for high Mach number reacting flow, low Mach number compressible flow solutions in constricted ducts, and the evaluation of flow topology for numerical data

  9. 10th World Energy Conference. Division 2. Conservation in energy utilization. [30 papers

    Energy Technology Data Exchange (ETDEWEB)

    1977-07-01

    A separate abstract was prepared for each of the 30 papers and a position paper. All of the abstracts will appear both in Energy Research Abstracts (ERA) and Energy Abstracts for Policy Analysis (EAPA). (MCW)

  10. The Relationships between Human Fatigue and Public Health: A Brief Commentary on Selected Papers from the 9th International Conference on Managing Fatigue in Transportation, Resources and Health

    OpenAIRE

    Charli Sargent; Paul Roberts; Drew Dawson; Sally Ferguson; Lynn Meuleners; Libby Brook; Gregory D. Roach

    2016-01-01

    The 9th International Conference on Managing Fatigue in Transportation, Resources and Health was held in Fremantle, Western Australia in March 2015. The purpose of the conferences in this series is to provide a forum for industry representatives, regulators, and scientists to discuss recent advances in the field of fatigue research. We have produced a Special Issue of the International Journal of Environmental Research and Public Health based on papers from the conference that were focused on...

  11. A review on solder reflow and flux application for flip chip

    Science.gov (United States)

    Suppiah, Sarveshvaran; Ong, Nestor Rubio; Sauli, Zaliman; Sarukunaselan, Karunavani; Alcain, Jesselyn Barro; Visvanathan, Susthitha Menon; Retnasamy, Vithyacharan

    2017-09-01

    This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

  12. Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

    Science.gov (United States)

    Hasnine, M.; Tolla, B.; Vahora, N.

    2018-04-01

    This paper explores the effects of aging on the mechanical behavior, microstructure evolution and IMC formation on different surface finishes of two high temperature solders, Sn-5 wt.% Ag and Sn-5 wt.% Sb. High temperature aging showed significant degradation of Sn-5 wt.% Ag solder hardness (34%) while aging has little effect on Sn-5 wt.% Sb solder. Sn-5 wt.% Ag experienced rapid grain growth as well as the coarsening of particles during aging. Sn-5 wt.% Sb showed a stable microstructure due to solid solution strengthening and the stable nature of SnSb precipitates. The increase of intermetallic compound (IMC) thickness during aging follows a parabolic relationship with time. Regression analysis (time exponent, n) indicated that IMC growth kinetics is controlled by a diffusion mechanism. The results have important implications in the selection of high temperature solders used in high temperature applications.

  13. ASDEX papers at the 13th European conference on controlled fusion and plasma physics

    International Nuclear Information System (INIS)

    1986-05-01

    This report provides 29 ASDEX papers concerning pellet refuelling, confinement, high-beta plasma and MHD-equilibrium, heating by ICR, lower hybrid and current-drive, impurity studies and plasma diagnostics. All of these papers have been indexed separately. (GG)

  14. Building the Capabilities of the Travel, Tourism and Hospitality Workforce. Conference Paper

    Science.gov (United States)

    Ackehurst, Maree; Loveder, Phil

    2015-01-01

    This paper was presented at the Australian Federation of Travel Agents Industry Leaders & Educators Engagement Symposium held in Sydney on February 12, 2015. With industry sustainability becoming a strong concern, even within growth sectors, this paper identifies issues to be considered in ensuring that the education and training system can…

  15. Papers of a Canadian Institute conference on successfully managing counter party credit risk : fundamentals and essentials for the energy industry

    International Nuclear Information System (INIS)

    2003-01-01

    The main focus of this conference is the management of credit risk for major energy trading and marketing companies. The papers deal with pertinent issues such as the development and implementation of corporate credit risk management policy, credit risk exposure reporting systems, and the quality of ratings in the utility sector. Risk management strategies include quantitative and subjective credit factors, credit scoring, risk mitigation, limit-setting methodologies, measurement of liquidity, capital markets access, portfolio management, and the development of policies, procedures and control. Three presentations were indexed separately for inclusion in the database. refs., tabs., figs

  16. Apparent Power, Expanded Definitions, Transient Operating Conditions, Network Reactions, Compensation, Papers Presented at ETG Conference (Energy Technology Society), 1979

    Energy Technology Data Exchange (ETDEWEB)

    1980-01-01

    The Proceedings of the Conference comprises 12 papers dealing with the following themes: the history of apparent power; active and apparent power of periodical currents in single-phase and multiphase systems with periodical voltages of any shape of curve; power values in unsteady state processes; power and harmonic relations in mains-controlled direct frequency converters; power electronic devices for apparent power compensation; electric arc effects on power system: characteristics, measurement methods, compensation; harmonic compensation by means of impedance wave trap filters in rectifiers; compensation of apparent power by filter circuits; apparent power effects on ac railroad power systems; effects of apparent power in low-voltage networks of public power supply.

  17. Papers of a Canadian Institute conference on successfully managing counter party credit risk : fundamentals and essentials for the energy industry

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2003-07-01

    The main focus of this conference is the management of credit risk for major energy trading and marketing companies. The papers deal with pertinent issues such as the development and implementation of corporate credit risk management policy, credit risk exposure reporting systems, and the quality of ratings in the utility sector. Risk management strategies include quantitative and subjective credit factors, credit scoring, risk mitigation, limit-setting methodologies, measurement of liquidity, capital markets access, portfolio management, and the development of policies, procedures and control. Three presentations were indexed separately for inclusion in the database. refs., tabs., figs.

  18. Reactive inspection response of NRC Region III to potential technical deficiencies identified in recent Nuclear Air Cleaning Conference papers

    International Nuclear Information System (INIS)

    Gill, C.F.

    1987-01-01

    In order to effectively meet its responsibility to protect the public health and safety, the Nuclear Regulatory Commission (NRC) nuclear power plant licensing and inspection programs respond to potential technical deficiencies identified by conference and professional society meeting papers when deemed appropriate. The NRC staff's response mechanisms for such technical deficiencies include: generic letters, Bulletins, Information Notices, Standard Review Plan (NUREG-0800) revisions, docketed Final Safety Analysis Report (FSAR) questions, special studies, special (reactive) inspection, and inspection program revisions. This paper describes reactive inspection efforts by Region III in response to potential technical deficiencies identified in recent air cleaning conference papers, including: post-accident effluent sample line deposition losses; failure to implement good engineering practices in the design, construction, and testing of Nuclear Air Treatment Systems (NATS); filter bypass via filter housing drain lines; spinster carbon degradation; use of silicone sealants and other temporary patching material in NATS; filter housing fire protection deluge system problems; lack of charcoal batch traceability; Quality Assurance records problems involving equipment, vendor, filter, and personnel qualifications; inadequate ANSI/ASME N510 acceptance criteria and tests; and failure to adequately demonstrate control room habitability per 10 CFR 50, Appendix A, General Design Criterion-19. Region III inspections indicate that many of these deficiencies appear to be prevalent. Inspection findings and utility responses to the findings are discussed. NRC Region III and Headquarters programmatic reactions to the identified generic problem areas are also discussed

  19. The history of NATO TNF policy: The role of studies, analysis and exercises conference proceedings. Volume 3: Papers by Gen. Robert C. Richardson III (Ret.)

    Energy Technology Data Exchange (ETDEWEB)

    Rinne, R.L. [ed.

    1994-02-01

    This conference was organized to study and analyze the role of simulation, analysis, modeling, and exercises in the history of NATO policy. The premise was not that the results of past studies will apply to future policy, but rather that understanding what influenced the decision process-and how-would be of value. The structure of the conference was built around discussion panels. The panels were augmented by a series of papers and presentations focusing on particular TNF events, issues, studies, or exercises. The conference proceedings consist of three volumes. Volume 1 contains the conference introduction, agenda, biographical sketches of principal participants, and analytical summary of the presentations and discussion panels. Volume 2 contains a short introduction and the papers and presentations from the conference. This volume contains selected papers by Brig. Gen. Robert C. Richardson III (Ret.).

  20. Nano-soldering to single atomic layer

    Science.gov (United States)

    Girit, Caglar O [Berkeley, CA; Zettl, Alexander K [Kensington, CA

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  1. Safer Soldering Guidelines and Instructional Resources

    Science.gov (United States)

    Love, Tyler S.; Tomlinson, Joel

    2018-01-01

    Soldering is a useful and necessary process for many classroom, makerspace, Fab Lab, technology and engineering lab, and science lab activities. As described in this article, soldering can pose many safety risks without proper engineering controls, standard operating procedures, and direct instructor supervision. There are many safety hazards…

  2. Joining technologies for the 1990s: Welding, brazing, soldering, mechanical, explosive, solid-state, adhesive

    Science.gov (United States)

    Buckley, John D. (Editor); Stein, Bland A. (Editor)

    1986-01-01

    A compilation of papers presented in a joint NASA, American Society for Metals, The George Washington University, American Welding Society, and Society of Manufacturing Engineers Conference on Welding, Bonding, and Fastening at Langley Research Center, Hampton, VA, on October 23 to 25, 1984 is given. Papers were presented on technology developed in current research programs relevant to welding, bonding, and fastening of structural materials required in fabricating structures and mechanical systems used in the aerospace, hydrospace, and automotive industries. Topics covered in the conference included equipment, hardware and materials used when welding, brazing, and soldering, mechanical fastening, explosive welding, use of unique selected joining techniques, adhesives bonding, and nondestructive evaluation. A concept of the factory of the future was presented, followed by advanced welding techniques, automated equipment for welding, welding in a cryogenic atmosphere, blind fastening, stress corrosion resistant fasteners, fastening equipment, explosive welding of different configurations and materials, solid-state bonding, electron beam welding, new adhesives, effects of cryogenics on adhesives, and new techniques and equipment for adhesive bonding.

  3. International conference on nuclear security: Global directions for the future. Contributed papers

    International Nuclear Information System (INIS)

    2005-01-01

    This volume includes contributed papers presented during sessions named as follows: Efforts to strengthen the global security framework, Efforts to strengthen nuclear security in Member states, role of the IAEA underpinning the global efforts, and looking forward: sustaining progress

  4. International conference on nuclear security: Global directions for the future. Contributed papers

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2005-07-01

    This volume includes contributed papers presented during sessions named as follows: Efforts to strengthen the global security framework, Efforts to strengthen nuclear security in Member states, role of the IAEA underpinning the global efforts, and looking forward: sustaining progress.

  5. Features of soldering of molybdenum a lols

    International Nuclear Information System (INIS)

    Grishin, V.L.; Rybkin, B.V.; Cherkasov, A.F.

    1980-01-01

    Soldering features of complex-alloy molybdenum alloys were investigated in comparison with alloys based on solid solutions. Soldering features of heterogeneous molybdenum base alloys were investigated using samples of 0.5-1.O mm sheets with the strain of about 95% made of ingots which had been smelted in arc vacuum furnaces. The soldering of samples was carried out in 5x1O -5 mm Hg vacuum using different sources of heating: radiation, electron-ray and contact. It was shown that heat-resisting soldered joints of heterogeneous molybdenum alloys could be produced using zirconium and niobium base solders containing the most effective hardeners of the parent material (titanum, vanadium, tantalum, molybdenum, tungsten). To preserve high mechanical properties of heterogeneous alloys it was expedient to use for welding local heating sources which permitted to decrease considerably temperature- time conditions of the process

  6. 29th Intersociety energy conversion engineering conference: Technical papers. Part 1

    International Nuclear Information System (INIS)

    Anon.

    1994-01-01

    Part 1 of these proceedings contains 96 papers covering the following topics: Aircraft power; Aerospace power systems--Automation; Batteries for aerospace power; Computer modeling of spacecraft systems; Fuel cells for aerospace; Power electronics; Power management and distribution; Space solar power; Space power systems; Solar dynamic ground test demonstrator; Space nuclear systems--Applications; Space nuclear systems--Reactor technology thermionics; Space nuclear systems reactor technology--Thermoelectrics; Space nuclear systems--Bimodal propulsion; Space nuclear systems--Isotopic power; and Space nuclear systems--thermoelectric materials. Most of the papers have been processed separately for inclusion on the data base

  7. Call for Papers. Correctional Education Association 1986 Annual Conference (Cincinnati, Ohio, July 6-9, 1986).

    Science.gov (United States)

    Littlefield, John F., Ed.

    The 13 papers in this volume are: "Behind Bars with CBE--Look What's Happening to Inmate Training" (Beverly A. Stitt, Rita Noel); "Communication Skills: Relevance, Respect, Responsibility and the Process of Change" (Meredith Whaley); "The Educational Needs of Inmates in the Kingston Prison for Women" (Richard Volpe, Colleen Kearney); "The Effects…

  8. Thirty-seventh ORNL/DOE conference on analytical chemistry in energy technology: Abstracts of papers

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1997-12-31

    Abstracts only are given for papers presented during the following topical sessions: Opportunities for collaboration: Industry, academic, national laboratories; Developments in sensor technology; Analysis in containment facilities; Improving the quality of environmental data; Process analysis; Field analysis; Radiological separations; Interactive analytical seminars; Measurements and chemical industry initiatives; and Isotopic measurements and mass spectroscopy.

  9. Legal Limitations on Public Pension Plan Reform. Conference Paper 2009-08

    Science.gov (United States)

    Monahan, Amy B.

    2009-01-01

    There is significant interest in reforming retirement plans for public school employees, particularly in light of current market conditions. This paper presents an overview of the various types of state regulation of public pension plans that affect possibilities for reform. Several states have legal protections that effectively prevent a state…

  10. Teacher Pension Incentives, Retirement Behavior, and Potential for Reform in Arkansas. Conference Paper 2009-10

    Science.gov (United States)

    Costrell, Robert M.; McGee, Josh B.

    2009-01-01

    In this paper, we present an analysis of the Arkansas Teacher Retirement System (ATRS) pension plan and an empirical investigation of the behavioral response to that plan, as well as to a possible reform plan. We begin by describing the plan parameters and discussing the incentives these parameters create. We then estimate the effect of pension…

  11. Papers presented by the SIG at the 13. European conference on controlled fusion and plasma heating

    International Nuclear Information System (INIS)

    1986-05-01

    In this report, papers gathered essentially around lower hybrid wave heating and current drive. Efficiency, saturation, conduction are studied; design studies are made for multijunction grill. Optimization of wave launching and absorption is researched. Lower hybrid current drive which is non-inductive current drive together with ohmic current is studied. At last suppression of sawtooth instabilities by current drive is also presented

  12. IFLA General Conference, 1989. Pre-Session Seminar on Interlending and Document Supply. Papers.

    Science.gov (United States)

    International Federation of Library Associations, The Hague (Netherlands).

    The papers in this compilation address topics relating to interlending and document supply and include the following: (1) "Training in Interlending" (D. E. K. Wijasuriya, Malaysia); (2) "Resource Collections and Document Supply Centre" (Stephney Ferguson, Jamaica); (3) "Organizing for Interlibrary Loan and Document Supply" (Rodrick S. Mabomba);…

  13. Vulnerability of solar energy infrastructure and output to extreme events: Climate change implications (Conference paper)

    OpenAIRE

    Patt, A.; Pfenninger, S.; Lilliestam, J.

    2010-01-01

    This paper explores the potential vulnerability of solar energy systems to future extreme event risks as a consequence of climate change. We describe the three main technologies likely to be used to harness sunlight -- thermal heating, photovoltaic (PV), and concentrating solar power (CSP) -- and identify critical extreme event vulnerabilities for each one. We then compare these vulnerabilities with assessments of future changes in extreme event risk levels. We do not identify any vulnerabili...

  14. Physical Chemistry '98: Fourth International Conference on Fundamental and Applied Aspects of Physical Chemistry - Papers

    International Nuclear Information System (INIS)

    Ribnikar, S.; Anic, S.

    1998-01-01

    The proceedings has following chapters: Plenary lectures; Chemical Thermodynamics; Spectroscopy, Molecular Structures, Physical Chemistry of Plasma; Kinetics, Catalysis, Nonlinear Dynamics; Electrochemistry; Biophysical Chemistry, Photochemistry, Radiation Chemistry; Radiochemistry, Nuclear Chemistry; Solid State Physical Chemistry, Material Science; Macromolecular Physical Chemistry; Environmental Protection; Phase Boundaries; Complex Compounds; General Physical Chemistry. A separated abstract was prepared for each of the 20 papers selected from the three chapters: Biophysical Chemistry, Photochemistry, Radiation Chemistry; Radiochemistry, Nuclear Chemistry. and Environmental Protection. Refs and figs

  15. Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    McNally, K.M.; Sorg, B.S.; Welch, A.J.; Dawes, J.M.; Owen, E.R.

    1999-01-01

    Low-strength anastomoses and thermal damage of tissue are major concerns in laser tissue welding techniques where laser energy is used to induce thermal changes in the molecular structure of the tissues being joined, hence allowing them to bond together. Laser tissue soldering, on the other hand, is a bonding technique in which a protein solder is applied to the tissue surfaces to be joined, and laser energy is used to bond the solder to the tissue surfaces. The addition of protein solders to augment tissue repair procedures significantly reduces the problems of low strength and thermal damage associated with laser tissue welding techniques. Investigations were conducted to determine optimal solder and laser parameters for tissue repair in terms of tensile strength, temperature rise and damage and the microscopic nature of the bonds formed. An in vitro study was performed using an 808 nm diode laser in conjunction with indocyanine green (ICG)-doped albumin protein solders to repair bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The efficacy of temperature feedback control in enhancing the soldering process was also investigated. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the repairs. A reduction in dye concentration from 2.5mgml -1 to 0.25mgml -1 was also found to result in an increase in tensile strength. Increasing the laser irradiance and thus surface temperature resulted in an increased severity of histological injury. Thermal denaturation of tissue collagen and necrosis of the intimal layer smooth muscle cells increased laterally and in depth with higher temperatures. The strongest repairs were produced with an irradiance of 6.4Wcm -2 using a solid protein solder composed of 60% BSA and 0.25mgml -1 ICG. Using this combination of laser and solder parameters, surface temperatures were observed to reach 85±5 deg. C with a

  16. Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

    International Nuclear Information System (INIS)

    Mallik, S.; Ekere, N.N.; Durairaj, R.; Marks, A.E.; Seman, A.

    2009-01-01

    Solder paste is the most important strategic bonding material used in the assembly of surface mount components in electronics manufacturing. As the trend towards miniaturisation of electronic products continues, there is an increasing demand for better understanding of the flow and deformation that is, the rheological behaviour of solder paste formulations. Wall slip plays an important role in characterising the flow behaviour of solder paste materials. The problem of wall slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin solvent layer adjacent to the wall, which gives rise to slippage. In rheological measurements, slip effects can generally be avoided by using roughened surfaces for measuring geometries. In this paper, a novel technique is developed to study the effect of wall slip in the rheological measurements of lead-free solder paste. The viscosity and oscillatory data obtained for three different solder paste samples (from measuring geometries of different surface roughness) have been analysed and compared. In viscosity measurements, slip effects were dominant at low shear rates and the use of serrated surfaces was found to be quite effective in minimizing slip effects. Oscillatory measurements were also affected by roughening the surfaces of measuring geometries.

  17. Comparative shear tests of some low temperature lead-free solder pastes

    Science.gov (United States)

    Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.

    2016-12-01

    The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

  18. Papers presented at the 22. European Physical Society conference on controlled fusion and plasma physics

    International Nuclear Information System (INIS)

    Bengtson, R.D.; Gentle, K.W.; Brower, D.L.

    1995-01-01

    This report is a compilation of the following six papers which cover research conducted at TEXT: (1) Study of plasma edge turbulence via conditional probability density functions; (2) Current density profile measurement and current diffusion experiments on TEXT-Upgrade; (3) Nonlocal transport effects in tokamak electron temperature responses; (4) BES (Beam Emission Spectroscopy) density fluctuations on TEXT-U and comparison with other diagnostics; (5) The SOL in diverted discharges in the Texas Experimental Tokamak (TEXT); and (6) Confinement and related studies in TEXT

  19. Solderability study of RABiTS-based YBCO coated conductors

    International Nuclear Information System (INIS)

    Zhang Yifei; Duckworth, Robert C.; Ha, Tam T.; Gouge, Michael J.

    2011-01-01

    Study examines the implication of solder and flux selection in YBCO splice joints. Focus is on commercially available RABiTS-based YBCO coated conductors. Solderability varied with solder and flux for three different stabilizations tested. Resistivity of stabilizer was dominant factor in splice joint resistance. Solder materials affected splice joint resistance when solderability was poor. The solderability of commercially available YBa 2 Cu 3 O 7-x (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

  20. Papers presented at the Tenth Topical Conference on High-Temperature Plasma Diagnostics

    International Nuclear Information System (INIS)

    1994-01-01

    This report contains papers on the following topics: Effects of limited spatial resolution on fluctuation measurements; vertical viewing of electron-cyclotron radiation in Text-U; measurement of temperature fluctuations from electron-cyclotron emission; a varying cross section magnetic coil diagnostic used in digital feedback control of plasma position in Text-Upgrade; high-sensitivity, high resolution measurements of radiated power on Text-U; wave launching as a diagnostic tool to investigate plasma turbulence; edge parameters from an energy analyzer and particle transport on Text-U; initial results from a charge exchange q-Diagnostic on Text-U; a method for neutral spectra analysis taking ripple-trapped particle losses into account; application of a three sample volume S(k,ω ) estimate to optical measurements of turbulence on Text; initial operation of the 2D Firsis on Text-Upgrade; horizontal-view interferometer on Text-Upgrade; plasma potential measurements on Text-Upgrade with A 2 MeV heavy ion beam; fluctuation measurements using the 2 MeV heavy ion beam probe on Text-U; the time domain triple probe method; a phase contrast imaging system for Text-U; and development of rugged corner cube detectors for the Text-U-Fir interferometer. These papers have been placed on the database elsewhere

  1. Low doses of ionizing radiation: Biological effects and regulatory control. Invited papers and discussions. Proceedings of an international conference

    International Nuclear Information System (INIS)

    1998-01-01

    The levels and biological effects resulting from exposure to ionizing radiation are continuously reviewed by the United Nations Committee on the Effects of Atomic Radiation (UNSCEAR). Since its creation in 1928, the International Commission on Radiological Protection (ICRP) has issued recommendations on protection against ionizing radiation. The UNSCEAR estimates and the ICRP recommendations have served as the basis for national and international safety standards on radiation safety, including those developed by the International Atomic Energy Agency (IAEA) and the World Health Organization (WHO). Concerning health effects of low doses of ionizing radiation, the international standards are based on the plausible assumption that, above the unavoidable background radiation dose, the probability of effects increases linearly with dose, i.e. on a 'linear, no threshold' (LNT) assumption. However, in recent years the biological estimates of health effects of low doses of ionizing radiation and the regulatory approach to the control of low level radiation exposure have been much debated. To foster information exchange on the relevant issues, an International Conference on Low Doses of Ionizing Radiation: Biological Effects and Regulatory Control, jointly sponsored by the IAEA and WHO in co-operation with UNSCEAR, was held from 17-21 November 1997 at Seville, Spain. These Proceedings contain the invited special reports, keynote papers, summaries of discussions, session summaries and addresses presented at the opening and closing of the Conference

  2. Astrodynamics Conference, Williamsburg, VA, August 18-20, 1986, Technical Papers

    International Nuclear Information System (INIS)

    Anon.

    1986-01-01

    Various papers on satellite and planetary mission dynamics are presented. Individual topics discussed include: orbital motion in the frequency domain, the Galileo orbital tour for the 1986 launch opportunity, circulating transportation orbits between earth and Mars, optimum burn scheduling for low-thrust orbital transfers, comparison of nonlinear filters for orbit determination, common period four-satellite continuous global coverage, motion of a drag-free experiment on the Space Station, and engineering improvements, sequencing and orbital determination for Voyager 2 Uranus encounter. Also considered are: approach strategy for rendezvous with Comet Tempel 2, maneuver strategies for Magellan Mission, Jupiter Polar Orbiter Mission concepts, modelling and simulation of Spacecraft Solar Array deployment, sensitivity analysis for lunar trajectories, maximum likelihood estimation for orbit determination, adaptive estimation for an accelerating spacecraft, Slinger in-orbit booster facility, simulation of satellite breakups, missile launch windows of avoiding collisions with satellites, linear-quadratic stationkeeping for the STS Orbiter

  3. Wind Energy Conference, Boulder, Colo., April 9-11, 1980, Technical Papers

    Science.gov (United States)

    1980-03-01

    Papers are presented concerning the technology, and economics of wind energy conversion systems. Specific topics include the aerodynamic analysis of the Darrieus rotor, the numerical calculation of the flow near horizontal-axis wind turbine rotors, the calculation of dynamic wind turbine rotor loads, markets for wind energy systems, an oscillating-wing windmill, wind tunnel tests of wind rotors, wind turbine generator wakes, the application of a multi-speed electrical generator to wind turbines, the feasibility of wind-powered systems for dairy farms, and wind characteristics over uniform and complex terrain. Attention is also given to performance tests of the DOE/NASA MOD-1 2000-kW wind turbine generator, the assessment of utility-related test data, offshore wind energy conversion systems, and the optimization of wind energy utilization economics through load management.

  4. Optimal parameters for laser tissue soldering

    Science.gov (United States)

    McNally-Heintzelman, Karen M.; Sorg, Brian S.; Chan, Eric K.; Welch, Ashley J.; Dawes, Judith M.; Owen, Earl R.

    1998-07-01

    Variations in laser irradiance, exposure time, solder composition, chromophore type and concentration have led to inconsistencies in published results of laser-solder repair of tissue. To determine optimal parameters for laser tissue soldering, an in vitro study was performed using an 808-nm diode laser in conjunction with an indocyanine green (ICG)- doped albumin protein solder to weld bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The effects of laser irradiance and exposure time on tensile strength of the weld and temperature rise as well as the effect of hydration on bond stability were investigated. Optimum irradiance and exposure times were identified for each solder type. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the weld. A reduction in dye concentration from 2.5 mg/ml to 0.25 mg/ml was also found to result in an increase in tensile strength. The strongest welds were produced with an irradiance of 6.4 W/cm2 for 50 s using a solid protein solder composed of 60% BSA and 0.25 mg/ml ICG. Steady-state solder surface temperatures were observed to reach 85 plus or minus 5 degrees Celsius with a temperature gradient across the solid protein solder strips of between 15 and 20 degrees Celsius. Finally, tensile strength was observed to decrease significantly (20 to 25%) after the first hour of hydration in phosphate-buffered saline. No appreciable change was observed in the strength of the tissue bonds with further hydration.

  5. Space Systems Technology Conference, San Diego, CA, June 9-12, 1986, Technical Papers

    International Nuclear Information System (INIS)

    Anon.

    1986-01-01

    Papers are presented on liquid droplet radiator thermal characteristics, battery designs, mobile satellite communications, space-based air traffic surveillance, the Italsat regenerative downlink performance, nondisruptive group delay and amplitude measurement, the Polar Platform of the Space Shuttle, EVA tasks and services, fault diagnosis, and an autonomous power system test bed. Topics discussed include space debris and manned space operations, data transport and command management services for the Space Station, a thermodynamic approach to data processor analysis, anomaly detection and resolution system, the Telemetry, Timing, Command, and Control system, the Space Construction Shuttle Flight experiment, and structural analysis of the Space Shuttle propulsion components. Consideration is given to electrostatic charging and arc discharges on satellite dielectrics, the attitude control system of the IUE, orbital acceleration, spaceborne distributed aperture/coherent array processing, the propulsion module for the Columbus Space Platform, the next-generation STS, trajectory performance evaluation, the Hubble Space Telescope, a linear quadratic tracker for control moment gyro based attitude control of the Space Station, and existing satellite systems and networks

  6. Papers presented by A.E.C.L. to the International Conference of the Canadian Nuclear Association

    International Nuclear Information System (INIS)

    1964-06-01

    The International Conference of the Canadian Nuclear Association was held in Toronto, Ontario, Canada on May 25-27, 1964. There were six papers presented by Atomic Energy of Canada Limited. The titles were: I. Canada - A Nuclear Power Plant Supplier, by J.L. Gray; II. Nuclear Power Development in Canada and Other Countries, by W.B. Lewis; III. The Development and Some Applications of Cobalt-60 Irradiators, by R.F. Errington; IV. The Definition and Achievement of Development Targets for the Canadian Power Reactor Program, by A.J. Mooradian; V. Recent Applications of Tracers in the Physical Sciences in Canada, by R.H. Betts and J.A. Davies; and, VI. Economic Comparison of Oyster Creek, Nine Mile Point and CANDU-type Stations under Canadian Conditions, by G.A. Pon and R.L. Beck.

  7. Papers of the 2. annual Canadian Institute conference on managing natural gas price volatility : effective risk strategies for turbulent times

    International Nuclear Information System (INIS)

    2002-01-01

    The issue of how natural gas price volatility is affecting future energy projects was the focus of this conference. Discussions focused on the dynamics of supply and demand of natural gas in North America and how end-users are responding to price fluctuations. Methods by which storage can be used as an effective risk management tool was also on the agenda. The hedging strategies that work best for leading energy firms were described. It was noted that price volatility can be reduced through improved market transparency. Discussions also focused on credit risk in a volatile price environment. A total of 17 papers were presented of which 3 were indexed separately for inclusion in the database. tabs., figs

  8. Guest Editor's introduction: Selected papers from the 4th USENIX Conference on Object-Oriented Technologies and Systems

    Science.gov (United States)

    Sventek, Joe

    1998-12-01

    Hewlett-Packard Laboratories, 1501 Page Mill Road, Palo Alto, CA 94304, USA Introduction The USENIX Conference on Object-Oriented Technologies and Systems (COOTS) is held annually in the late spring. The conference evolved from a set of C++ workshops that were held under the auspices of USENIX, the first of which met in 1989. Given the growing diverse interest in object-oriented technologies, the C++ focus of the workshop eventually became too narrow, with the result that the scope was widened in 1995 to include object-oriented technologies and systems. COOTS is intended to showcase advanced R&D efforts in object-oriented technologies and software systems. The conference emphasizes experimental research and experience gained by using object-oriented techniques and languages to build complex software systems that meet real-world needs. COOTS solicits papers in the following general areas: application of, and experiences with, object-oriented technologies in particular domains (e.g. financial, medical, telecommunication); the architecture and implementation of distributed object systems (e.g. CORBA, DCOM, RMI); object-oriented programming and specification languages; object-oriented design and analysis. The 4th meeting of COOTS was held 27 - 30 April 1998 at the El Dorado Hotel, Santa Fe, New Mexico, USA. Several tutorials were given. The technical program proper consisted of a single track of six sessions, with three paper presentations per session. A keynote address and a provocative panel session rounded out the technical program. The program committee reviewed 56 papers, selecting the best 18 for presentation in the technical sessions. While we solicit papers across the spectrum of applications of object-oriented technologies, this year there was a predominance of distributed, object-oriented papers. The accepted papers reflected this asymmetry, with 15 papers on distributed objects and 3 papers on object-oriented languages. The papers in this special issue are

  9. Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

    National Research Council Canada - National Science Library

    Reuse, Rolando

    2005-01-01

    .... The thermomechanical cycling in the solder causes numerous reliability challenges, mostly because of the mismatch of the coefficient of thermal expansion between the silicon chip and the substrate...

  10. PETRO-SAFE '94 conference papers: Book 2. Volume 5: Emergency response ampersand spill control; Volume 6: Remediation; Volume 7: Health ampersand safety issues

    International Nuclear Information System (INIS)

    Anon.

    1994-01-01

    The Fifth Annual Environmental, Safety and Health Conference and Exhibition for the oil, gas and petrochemical industries was held January 25--27, 1994 in Houston, Texas. The objective of this conference was to provide a multidisciplinary forum dealing with state-of-the-art environmental and safety issues. This volume focuses on the following: emergency response and spill control; remediation; and health and safety issues. Individual papers have been processed separately for inclusion in the appropriate data bases

  11. WEDC International Conference Paper

    International Development Research Centre (IDRC) Digital Library (Canada)

    Brittany Coff

    2013-03-01

    Mar 1, 2013 ... sanitation technology: Case studies in Nepal and Peru ... framework was applied to evaluate CAWST's training activities in Peru and Nepal. ... Studies at Mount Royal University (MRU) has collaborated to address this research problem. Objectives ... For example, for Kirkpatrick level 1 the interviewees were.

  12. International Scientific Studies Conference (ISS09), Vienna, Austria, 10-12 June 2009. First announcement and call for papers

    International Nuclear Information System (INIS)

    2009-01-01

    The results of the scientific studies carried out will be presented at the International Scientific Studies Conference - the ISS09 Conference - in Vienna, Austria. The Conference will focus on issues related to the capability and readiness of the CTBT's verification regime to detect nuclear explosions worldwide. It will also address how the verification regime has benefited from scientific and technical developments since the Treaty opened for signature in 1996.

  13. Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

    Science.gov (United States)

    Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

    2004-10-01

    It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

  14. Contribution and influence of proceedings papers to citation impact in seven conference and journal-driven sub-fields of energy research 2005-11

    DEFF Research Database (Denmark)

    Ingwersen, Peter; Larsen, Birger; Garcia-Zorita, J. Carlos

    2013-01-01

    and Wave Energy, Geo-thermal, Bio-fuel and Bio-mass energy sub-fields. The analyses cover research and review articles as well as conference proceeding papers excluding meeting abstracts published 2005-09 and cited 2005-11 through Web of Science. Central findings are: The distribution across document types......This paper analyses the following seven sub-fields of Sustainable Energy Research with respect to the influence of conference paper dominance on citation patterns across citing and cited document types, overall sub-field and document type impacts and citedness: Wind Power, Renewable Energy, Solar...

  15. The critical oxide thickness for Pb-free reflow soldering on Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Chung, C. Key [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Assembly Test Global Materials, Intel Microelectronics Asia Ltd, B1, No. 205, Tun-Hwa North Road, 10595 Taipei, Taiwan (China); Chen, Y.J.; Li, C.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Kao, C.R., E-mail: crkao@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China)

    2012-06-01

    Oxidation is an undesirable effect of reflow soldering. Non-wetting occurs when the oxide layer grows above the critical thickness. Characterizing the critical oxide thickness for soldering is challenging due to oxide's nano-scale thickness and irregular topographic surface. In this paper, the critical copper oxide thickness was characterized by Time-of-Flight Secondary Ion Mass Spectrometry, Scanning Electron Microscopy, Energy-Dispersive X-ray spectroscopy, and Transmission Electron Microscopy. Copper substrates were coated with an Organic-Solderable-Preservative (OSP) layer and baked at 150 Degree-Sign C and 85% Relative Humidity for different amounts of time. The onset of the non-wetting phenomenon occurred when the oxide thickness reached 18 {+-} 5 nm. As the oxide grew beyond this critical thickness, the percentage of non-wetting solder joint increased exponentially. The growth of the oxide thickness followed a parabolic rate law. The rate constant of oxidation was 0.6 Multiplication-Sign 10{sup -15} cm{sup 2} min{sup -1}. Oxidation resulted from interdiffusion of copper and oxygen atoms through the OSP and oxide layers. The oxidation mechanism will be presented and discussed. - Highlights: Black-Right-Pointing-Pointer Critical oxide thickness for Pb free solder on Cu substrate is 18 {+-} 5 nm. Black-Right-Pointing-Pointer Above the critical oxide, non-wet solder joint increases exponentially. Black-Right-Pointing-Pointer A maximum 13-nm oxide thickness is suggested for good solder joint. Black-Right-Pointing-Pointer Initial growth of oxide thickness is logarithmic and then parabolic after 12 nm. Black-Right-Pointing-Pointer Thick oxide (360-560 nm) is formed as pores shorten the oxidation path.

  16. Infinity in Logic and Computation: International Conference, ILC 2007, Cape Town, South Africa, November 3-5, 2007: Revised selected papers

    NARCIS (Netherlands)

    Archibald, M.; Brattka, V.; Goranko, V.; Löwe, B.

    2009-01-01

    Edited in collaboration with FoLLI, the Association of Logic, Language and Information, this volume constitutes a selection of papers presented at the Internatonal Conference on Infinity in Logic and Computation, ILC 2007, held in Cape Town, South Africa, in November 2007. The 7 revised papers

  17. Papers of All-Polish Conference on Nuclear Techniques in Industry, Medicine, Agriculture and Environmental Protection; Referaty Krajowej Konferencji Technika Jadrowa w Przemysle, Medycynie, Rolnictwie i Ochronie Srodowiska

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2002-07-01

    These proceedings comprise papers presented at All-Polish Conference on nuclear techniques in industry, medicine, agriculture and environmental protection. Most of the papers are in the field of uses of radiation sources and particle beams in industry, radiation chemistry, nuclear medicine and dosimetry, environmental sciences.

  18. Radiation and society: Comprehending radiation risk. V. 1. A report to the IAEA with collected papers. Proceedings of an international conference

    International Nuclear Information System (INIS)

    1994-01-01

    The report includes 10 papers prepared by the Swedish Risk Academy for the IAEA Conference on Radiation and Society: Comprehending Radiation Risk, held in Paris between 24-28 October 1994. A separate abstract was prepared for each paper. Refs, figs and tabs

  19. Arizona Libraries: Books to Bytes. Contributed Papers Presented at the AzLA Annual Conference (Phoenix, Arizona, November 17-18, 1995).

    Science.gov (United States)

    Hammond, Carol, Ed.

    This document contains three papers presented at the 1995 Arizona Library Association conference. Papers include: (1) "ERLs and URLs: ASU Libraries Database Delivery Through Web Technology" (Dennis Brunning & Philip Konomos), which illustrates how and why the libraries at Arizona State University developed a world wide web server and…

  20. Improvement of the auto wire feeder machine in a de-soldering process

    Directory of Open Access Journals (Sweden)

    Niramon Nonkhukhetkhong

    2016-10-01

    Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

  1. Thermomechanical fatigue life prediction for several solders

    Science.gov (United States)

    Wen, Shengmin

    Since solder connections operate at high homologous temperature, solders are high temperature materials. This feature makes their mechanical behavior and fatigue phenomena unique. Based on experimental findings, a physical damage mechanism is introduced for solders. The mechanism views the damage process as a series of independent local damage events characterized by the failure of individual grains, while the structural damage is the eventual percolation result of such local events. Fine's dislocation energy density concept and Mura's microcrack initiation theory are adopted to derive the fatigue formula for an individual grain. A physical damage metric is introduced to describe the material with damage. A unified creep and plasticity constitutive model is adopted to simulate the mechanical behavior of solders. The model is cast into a continuum damage mechanics framework to simulate material with damage. The model gives good agreement with the experimental results of 96.5Pb-3.5Sn and 96.5Sn-3.5Ag solders under uniaxial strain-controlled cyclic loading. The model is convenient for implementation into commercial computational packages. Also presented is a fatigue theory with its failure criterion for solders based on physical damage mechanism. By introducing grain orientation into the fatigue formula, an m-N curve (m is Schmid factor) at constant loading condition is suggested for fatigue of grains with different orientations. A solder structure is defined as fatigued when the damage metric reaches a critical threshold, since at this threshold the failed grains may form a cluster and percolate through the structure according to percolation theory. Fatigue data of 96.5Pb-3.5Sn solder bulk specimens under various uniaxial tension tests were analyzed. Results show that the theory gives consistent predictions under broad conditions, while inelastic strain theory does not. The theory is anisotropic with no size limitation to its application, which could be suitable for

  2. Selected Papers from the 1982 Conference "New York Writes: Kindergarten through College" (New York, New York, April 3, 1982).

    Science.gov (United States)

    Kwalick, Barry, Ed.; And Others

    Presenting sound instructional strategies and writing theories, these proceedings of a conference held at Marymount Manhattan College address the needs of writing teachers at all educational levels. Following an introduction outlining the conference and the "New York Writes" project, the keynote address discusses the renewed interest in…

  3. Mechanical performances of lead-free solder joint connections with applications in the aerospace domain

    Directory of Open Access Journals (Sweden)

    Georgiana PADURARU

    2016-03-01

    Full Text Available The paper presents some theoretical and experimental aspects regarding the tribological performances of lead-free solder joint connections, with application in the aerospace domain. In order to highlight the mechanical and tribological properties of solder joint in correlation with different pad finishes, there were made some mechanical determinations using a dedicated Share Test System. The theoretical model highlights the link between the experimental results and the influence of gravitational acceleration on the mechanical and functional integrity of the electronic assemblies that works in vibration environment. The paper novelty is provided by the interdisciplinary experiment that offers results that can be used in the mechanical, tribological, electronical and aerospace domains.

  4. A FPGA implementation of solder paste deposit on printed circuit boards errors detector based in a bright and contrast algorithm

    OpenAIRE

    De Luca-Pennacchia, A.; Sánchez-Martínez, M. Á.

    2007-01-01

    Solder paste deposit on printed circuit boards (PCB) is a critical stage. It is known that about 60% of functionality defects in this type of boards are due to poor solder paste printing. These defects can be diminished by means of automatic optical inspection of this printing. Actually, this process is implemented by image processing software with its inherent high computational time cost. In this paper we propose to implement a high parallel degree image comparison algorithm suitable to be ...

  5. The 5th conference of the South Pacific Environmental Radioactivity Association (SPERA). Environmental radioactivity and its application in environmental studies. Conference papers

    International Nuclear Information System (INIS)

    1998-01-01

    SPERA98 focused primarily on applications of environmental radionuclides in environmental studies and problem solving. The conference program included 7 sessions covering topics such as: soil erosion, waste disposal and treatment, atmospheric studies, radioactivity in water, human exposure pathways, sediment and atmospheric studies

  6. The 5th conference of the South Pacific Environmental Radioactivity Association (SPERA). Environmental radioactivity and its application in environmental studies. Conference papers

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1998-07-01

    SPERA98 focused primarily on applications of environmental radionuclides in environmental studies and problem solving. The conference program included 7 sessions covering topics such as: soil erosion, waste disposal and treatment, atmospheric studies, radioactivity in water, human exposure pathways, sediment and atmospheric studies.

  7. Nano-soldering of magnetically aligned three-dimensional nanowire networks

    International Nuclear Information System (INIS)

    Gao Fan; Gu Zhiyong

    2010-01-01

    It is extremely challenging to fabricate 3D integrated nanostructures and hybrid nanoelectronic devices. In this paper, we report a simple and efficient method to simultaneously assemble and solder nanowires into ordered 3D and electrically conductive nanowire networks. Nano-solders such as tin were fabricated onto both ends of multi-segmented nanowires by a template-assisted electrodeposition method. These nanowires were then self-assembled and soldered into large-scale 3D network structures by magnetic field assisted assembly in a liquid medium with a high boiling point. The formation of junctions/interconnects between the nanowires and the scale of the assembly were dependent on the solder reflow temperature and the strength of the magnetic field. The size of the assembled nanowire networks ranged from tens of microns to millimeters. The electrical characteristics of the 3D nanowire networks were measured by regular current-voltage (I-V) measurements using a probe station with micropositioners. Nano-solders, when combined with assembling techniques, can be used to efficiently connect and join nanowires with low contact resistance, which are very well suited for sensor integration as well as nanoelectronic device fabrication.

  8. High temperature soldering of graphite

    International Nuclear Information System (INIS)

    Anikin, L.T.; Kravetskij, G.A.; Dergunova, V.S.

    1977-01-01

    The effect is studied of the brazing temperature on the strength of the brazed joint of graphite materials. In one case, iron and nickel are used as solder, and in another, molybdenum. The contact heating of the iron and nickel with the graphite has been studied in the temperature range of 1400-2400 ged C, and molybdenum, 2200-2600 deg C. The quality of the joints has been judged by the tensile strength at temperatures of 2500-2800 deg C and by the microstructure. An investigation into the kinetics of carbon dissolution in molten iron has shown that the failure of the graphite in contact with the iron melt is due to the incorporation of iron atoms in the interbase planes. The strength of a joint formed with the participation of the vapour-gas phase is 2.5 times higher than that of a joint obtained by graphite recrystallization through the carbon-containing metal melt. The critical temperatures are determined of graphite brazing with nickel, iron, and molybdenum interlayers, which sharply increase the strength of the brazed joint as a result of the formation of a vapour-gas phase and deposition of fine-crystal carbon

  9. Microstructure evolution and thermomechanical fatigue of solder materials

    NARCIS (Netherlands)

    Matin, M.A.

    2005-01-01

    The microelectronics industry is confronted with the new challenge to produce joints with lead-free solder materials replacing classical tin-lead solders in devices used in many fields (e.g. consumer electronics, road transport, aviation, space-crafts, telecommunication). In service, solder

  10. A novel method for direct solder bump pull testing using lead-free solders

    Science.gov (United States)

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  11. Instantaneous fluxless bonding of Au with Pb-Sn solder in ambient atmosphere

    International Nuclear Information System (INIS)

    Lee, T.K.; Zhang, Sam; Wong, C.C.; Tan, A.C.

    2005-01-01

    A fluxless bonding technique has been developed as a method of flip-chip bonding for microelectronic packaging. The fluxless bonding technique can be achieved instantaneously in an ambient environment between metallic stud bumps and predefined molten solder. This paper describes the mechanics of the bonding action and verifies the effectiveness of this bonding method through wetting balance tests and scanning electron microscope and energy dispersive x-ray analysis. This technique has been demonstrated by using a gold stud bump to break the tin oxide layer over molten solder. This allows for a fast, solid liquid interdiffusion between gold (Au) and the fresh molten eutectic lead-tin (Pb-Sn) solder for joint formation during solidification. This bonding method has been successfully tested with 130-μm-pitch flip-chip bond pads on a joint-in-via flex substrate architecture

  12. A Network for Integrated Science and Mathematics Teaching and Learning Conference Plenary Papers. NSF/SSMA Wingspread Conference (Racine, Wisconsin, April 1991). School Science and Mathematics Association Topics for Teachers Series Number 7.

    Science.gov (United States)

    Berlin, Donna F., Ed.

    The integration of mathematics and science is not a new concept. However, during recent years it has been a major focus in education reform. A Wingspread conference promoted discussion regarding the integration of mathematics and science and explored ways to improve science and mathematics education in grades K-12. Papers from the conference…

  13. A review of typical thermal fatigue failure models for solder joints of electronic components

    Science.gov (United States)

    Li, Xiaoyan; Sun, Ruifeng; Wang, Yongdong

    2017-09-01

    For electronic components, cyclic plastic strain makes it easier to accumulate fatigue damage than elastic strain. When the solder joints undertake thermal expansion or cold contraction, different thermal strain of the electronic component and its corresponding substrate is caused by the different coefficient of thermal expansion of the electronic component and its corresponding substrate, leading to the phenomenon of stress concentration. So repeatedly, cracks began to sprout and gradually extend [1]. In this paper, the typical thermal fatigue failure models of solder joints of electronic components are classified and the methods of obtaining the parameters in the model are summarized based on domestic and foreign literature research.

  14. Selected papers from the 7th International Conference on Biomimetics, Artificial Muscles and Nano-bio (BAMN2013)

    Science.gov (United States)

    Shahinpoor, Mohsen; Oh, Ilkwon

    2014-07-01

    The 7th International Congress on Biomimetics, Artificial Muscles and Nano-Bio was held on the magnificent and beautiful Jeju Island in Korea on 26-30 August 2013. In June 2007, the volcanic island and lava tube cave systems were designated as UNESCO World Natural Heritage Sites for their natural beauty and unique geographical values. The aim of the congress was to offer high-level lectures, extensive discussions and communications covering the state-of-the-art on biomimetics, artificial muscles, and nano-bio technologies providing an overview of their potential applications in the industrial, biomedical, scientific and robotic fields. This conference provided a necessary platform for an ongoing dialogue between researchers from different areas (chemistry, physics, biology, medicine, engineering, robotics, etc) within biomimetics, artificial muscle and nano-bio technologies. This special issue of Smart Materials and Structures is devoted to a selected number of research papers that were presented at BAMN2013. Of the 400 or so papers and over 220 posters presented at this international congress, 15 papers were finally received, reviewed and accepted for this special issue, following the regular peer review procedures of the journal. The special issue covers polymeric artificial muscles, electroactive polymers, multifunctional nanocomposites, and their applications. In particular, electromechanical performance and other characteristics of ionic polymer-metal composites (IPMCs) fabricated with various commercially available ion exchange membranes are discussed. Additionally, the control of free-edge interlaminar stresses in composite laminates using piezoelectric actuators is elaborated on. Further, the electrode effects of a cellulose-based electroactive paper energy harvester are described. Next, a flexible tactile-feedback touch screen using transparent ferroelectric polymer film vibrators is discussed. A broad coverage of bio-applications of IPMC transducers is

  15. Evaluation: Processes and Practices. Selected Papers from the Conference for the Evaluation of Instructional Materials (Washington, D.C., April 5-6, 1968).

    Science.gov (United States)

    Swisher, Ginny, Ed.; And Others

    Selected papers from the Conference for the Evaluation of Instructional Materials treat the area of evaluation by describing Richard Dershimer's three-part evaluative schema, the Educational Products Information Exchange approach to evaluating instructional materials, the evaluation procedures in Montgomery county (Maryland), the Consumers Union…

  16. Zagreb Conference on English Contrastive Projects, 7-9 December 1970. Papers and Discussion. Studies 4. The Yugoslav Serbo-Croatian-English Contrastive Project.

    Science.gov (United States)

    Filipovic, Rudolf, Ed.

    The fourth volume in this series contains the papers presented at the Zagreb Conference on English Contrastive Projects. They are: "Recent Center Activities in Contrastive Linguistics," by William Nemser; "The Yugoslav Serbo-Croatian-English Contrastive Project So Far," by Rudolf Filipovic; "The Poznan Polish-English Contrastive Project," by Jacek…

  17. Selected Papers & Abstracts from the Annual International Conference of the Association for Experiential Education (32nd, Norfolk, Virginia, November 4-7, 2004)

    Science.gov (United States)

    Roberts, Nina S., Ed.; Galloway, Shayne, Ed.

    2005-01-01

    In an effort to persist with providing members--and interested others--with the content of workshops from the 32nd Annual Conference held in Norfolk, the Association for Experiential Education (AEE) has decided to develop a hybrid publication that has materialized in two parts. Part I includes 11 papers: (1) Adventure Coaching (Doug Gray); (2)…

  18. Articles Published in Technical Journals, Reports Published, Papers Presented at the Geneva Conference and at Scientific Meetings, and Inventions Disclosed During 1958 by ORNL Staff Members

    Energy Technology Data Exchange (ETDEWEB)

    None

    1958-01-01

    This compilation presents the articles that were published in the open literature or as unclassified ORNL reports, papers presented at the Geneva Conference and at scientific meetings, and inventions disclosed during 1957 by members of the Oak Ridge National Laboratory. Topics include biology, chemistry, general studies, health physics, instrumentation, mathematics, metallurgy and materials, physics, and technology.

  19. International conference on topical issues in nuclear installation safety: Continuous improvement of nuclear safety in a changing world. Book of contributed papers

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2004-07-01

    Papers presented at this conference where devoted to the following NPP safety related topical issues: Changing environments - coping with diversity and globalisation; Operating experience - managing changes effectively; Regulatory management systems - adapting to changes in the environment; Long term operations - maintaining safety margins while extending plant lifetime.

  20. Selected Areas in Cryptography - SAC 2013 : 20th International Conference, Burnaby BC, Canada, August 14-16, 2013 : Revised Selected Papers

    NARCIS (Netherlands)

    Lange, T.; Lauter, K.; Lisonek, P.

    2014-01-01

    This book constitutes the proceedings of the 20th International Conference on Selected Areas in Cryptography, SAC 2013, held in Burnaby, Canada, in August 2013. The 26 papers presented in this volume were carefully reviewed and selected from 98 submissions. They are organized in topical sections

  1. A Legal Odyssey, 2001. Papers [of the] Education Law Association Conference (47th, Albuquerque, New Mexico, November 15-17, 2001). Topic Outlines.

    Science.gov (United States)

    Education Law Association, Dayton, OH.

    This document is a collection of 53 topic outlines and conference papers whose topics cover a multitude of aspects of educational law. Subjects include the impacts of the Individuals with Disabilities Education Act (IDEA) on "normal" students, rights of nontenured teachers, sexual discrimination and harassment, school disciplinary issues,…

  2. Interface between Sn-Sb-Cu solder and copper substrate

    Energy Technology Data Exchange (ETDEWEB)

    Sebo, P., E-mail: Pavel.Sebo@savba.sk [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Racianska 75, 831 02 Bratislava 3 (Slovakia); Svec, P. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janickovic, D.; Illekova, E. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine)

    2011-07-15

    Highlights: {yields} New lead-free solder materials based on Sn-Sb-Cu were designed and prepared. {yields} Melting and solidification temperatures of the solders have been determined. {yields} Cu-substrate/solder interaction has been analyzed and quantified. {yields} Phases formed at the solder-substrate interface have been identified. {yields} Composition and soldering atmospheres were correlated with joint strength. - Abstract: Influence of antimony and copper in Sn-Sb-Cu solder on the melting and solidification temperatures and on the microstructure of the interface between the solder and copper substrate after wetting the substrate at 623 K for 1800 s were studied. Microstructure of the interface between the solder and copper substrates in Cu-solder-Cu joints prepared at the same temperature for 1800 s was observed and shear strength of the joints was measured. Influence of the atmosphere - air with the flux and deoxidising N{sub 2} + 10H{sub 2} gas - was taken into account. Thermal stability and microstructure were studied by differential scanning calorimetry (DSC), light microscopy, scanning electron microscopy (SEM) with energy-dispersive spectrometry (EDS) and X-ray diffraction (XRD). Melting and solidification temperatures of the solders were determined. An interfacial transition zone was formed by diffusion reaction between solid copper and liquid solder. At the interface Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} phases arise. Cu{sub 3}Sn is adjacent to the Cu substrate and its thickness decreases with increasing the amount of copper in solder. Scallop Cu{sub 6}Sn{sub 5} phase is formed also inside the solder drop. The solid solution Sn(Sb) and SbSn phase compose the interior of the solder drop. Shear strength of the joints measured by push-off method decreases with increasing Sb concentration. Copper in the solder shows even bigger negative effect on the strength.

  3. Commentary: Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    Menovsky, T.; Beek, J.F.; Gemert, M.J.C. van

    1999-01-01

    Full text: Laser tissue welding is the process of using laser energy to join tissues without sutures or with a reduced number of sutures. Recently, diode lasers have been added to the list of fusion lasers (Lewis and Uribe 1993, Reali et al 1993). Typically, for tissue welding, deep penetrating diode lasers emitting at 800-810 nm are used, in combination with a strong absorbing protein solder containing the dye indocyanine green. Indocyanine green has a maximum absorption coefficient at 805 nm and binds preferentially with proteins (Sauda et al 1986). The greatest advantage of diode lasers is their compact size, easy use and low cost. In this issue of Physics in Medicine and Biology (pp 983-1002, 'Photothermal effects of laser tissue soldering'), in an in vitro study, McNally et al investigate the optimal laser settings and welding temperatures in relation to the tensile strength and thermal damage of bovine aorta specimens. An interesting statement in their introduction is that the low strength of laser produced anastomoses can lead to aneurysm formation. The increased chance of aneurysm formation may merely be due to the thermal effect of the laser on the vascular wall, especially on the adventitia and media layers, which become necrotic after thermal injury. Subsequent haemodynamic stress exerted on a damaged vascular wall is a significant contributing factor for aneurysmal initiation. Also interesting is the remark that 'by the application of wavelength-specific chromophores in tissue welding ... the requirement for precise focusing and aiming of the laser beam may be removed'. Though perhaps not yet fully justified, this statement, if true, would facilitate surgical procedures. While the experiments are conducted in a proper manner, the use of bovine aorta specimens, which were stored at -70 deg. C and subsequently thawed for the tissue welding experiments, may not be the most appropriate for studying tissue effects or tensile strength measurements, as the

  4. A Hodge dual for soldered bundles

    International Nuclear Information System (INIS)

    Lucas, Tiago Gribl; Pereira, J G

    2009-01-01

    In order to account for all possible contractions allowed by the presence of the solder form, a generalized Hodge dual is defined for the case of soldered bundles. Although for curvature the generalized dual coincides with the usual one, for torsion it gives a completely new dual definition. Starting from the standard form of a gauge Lagrangian for the translation group, the generalized Hodge dual yields precisely the Lagrangian of the teleparallel equivalent of general relativity, and consequently also the Einstein-Hilbert Lagrangian of general relativity

  5. Papers of the EECO 2003 Environment and Energy Conference : preserving the environment and promoting U.S. and Canada trade

    International Nuclear Information System (INIS)

    2003-01-01

    This Environment and Energy Conference is a bi-national cross-border forum on trade and environmental issues pertaining to the Great Lakes Economy in both Canada and the United States. Delegates from business, government and non-government organizations attended the conference to gain insight on how to ensure economic and environmental health of the Great Lakes region in order to contribute to sustainable growth. The presentations addressed environmental issues such as energy security; restructuring; urban transit; threats to clean air; cities; water demands in the Great Lakes ecosystems; new cars and new fuels; and, the need to reduce greenhouse gas emissions. The conference featured 32 presentations, of which 4 were indexed separately for inclusion in this database

  6. POWER-GEN '90 conference papers: Volume 3 (Environmental trends and issues) and Volume 4 (Case histories - Non-utility power generation)

    International Nuclear Information System (INIS)

    Anon.

    1990-01-01

    This is book 2 of a collection of papers presented at the Third International Power Generation Industries Conference on December 4-6, 1990. The book contains Volume 3, Environmental Trends and Issues, and Volume 4, Case Histories - Non-utility Power Generation. The topics of the papers include environmental legislative and regulatory trends, acid rain compliance strategies and technologies, other global environmental concerns, gas fired systems, solid and waste fuels, despatching and wheeling, and strategies for purchasing non-utility power

  7. Papers of a Canadian Institute conference on profiting from new opportunities in Atlantic power : new rules, new players, new challenges

    International Nuclear Information System (INIS)

    2003-01-01

    New opportunities for power generation in Atlantic Canada were presented at this conference with particular reference to the influence that electricity restructuring has had on power markets, energy supplies and trade. Topics of discussion included: the future of electricity deregulation; increasing power transmission and intertie capacity; an energy mix which includes natural gas, hydro, wind and cogeneration; energy policy and regulations of the new power market; and, buyer and seller experience in the new market. The conference featured 12 presentations, of which 6 have been indexed separately for inclusion in this database. refs., tabs., figs

  8. White Paper Report of the 2011 RAD-AID Conference on International Radiology for Developing Countries: Integrating Multidisciplinary Strategies for Imaging Services in the Developing World

    Science.gov (United States)

    Mazal, Jonathan; Lexa, Frank; Starikovsky, Anna; Jimenez, Pablo; Jain, Sanjay; DeStigter, Kristen K.; Nathan, Robert; Krebs, Elizabeth; Noble, Vicki; Marks, William; Hirsh, Richard N.; Short, Brad; Sydnor, Ryan; Timmreck-Jackson, Emily; Lungren, Matthew P.; Maxfield, Charles; Azene, Ezana M.; Garra, Brian S.; Choi, Brian G.; Lewin, Jonathan S.; Mollura, Daniel J.

    2016-01-01

    The 2011 RAD-AID Conference on International Radiology for Developing Countries discussed data, experiences and models pertaining to radiology in the developing world, where widespread shortages of imaging services significantly reduce health care quality and increase health care disparity. This white paper from the 2011 RAD-AID Conference represents consensus advocacy of multidisciplinary strategies to improve planning, accessibility and quality of imaging services in the developing world. Conference presenters and participants discussed numerous solutions to imaging and healthcare disparities including: (1) economic development for radiology service planning, (2) public health mechanisms to address disease and prevention at the population and community levels, (3) comparative clinical models to implement various clinical and workflow strategies adapted to unique developing world community contexts, (4) education to improve training and optimize service quality, and (5) technology innovation to bring new technical capabilities to limited-resource regions. PMID:22748790

  9. Laser assisted soldering: microdroplet accumulation with a microjet device.

    Science.gov (United States)

    Chan, E K; Lu, Q; Bell, B; Motamedi, M; Frederickson, C; Brown, D T; Kovach, I S; Welch, A J

    1998-01-01

    We investigated the feasibility of a microjet to dispense protein solder for laser assisted soldering. Successive micro solder droplets were deposited on rat dermis and bovine intima specimens. Fixed laser exposure was synchronized with the jetting of each droplet. After photocoagulation, each specimen was cut into two halves at the center of solder coagulum. One half was fixed immediately, while the other half was soaked in phosphate-buffered saline for a designated hydration period before fixation (1 hour, 1, 2, and 7 days). After each hydration period, all tissue specimens were prepared for scanning electron microscopy (SEM). Stable solder coagulum was created by successive photocoagulation of microdroplets even after the soldered tissue exposed to 1 week of hydration. This preliminary study suggested that tissue soldering with successive microdroplets is feasible even with fixed laser parameters without active feedback control.

  10. A New Way to A New Life. A Conference on Criminal Rehabilitation. Social Sciences Occasional Paper, Number One.

    Science.gov (United States)

    Fink, Ludwig; And Others

    "Modern Methods of Criminal Rehabilitation" was the subject of a conference held in Chazy, New York. The institution dealt with was the Diagnostic and Treatment Center at Clinton Prison in New York. A movie "A New Way to Prepare for a New Life" presented an overview of the rehabilitation program for multiple offenders. A transcript of the film is…

  11. THE NEW US ADMINISTRATION: PERSPECTIVES FOR RUSSIA. THE PAPERS OF THE INTERNATIONAL “ROUND-TABLE” CONFERENCE

    Directory of Open Access Journals (Sweden)

    П Дуткевич

    2017-12-01

    Full Text Available March 3, 2017 the Department of comparative politics, faculty of Humanities and social sciences held an international “Round-table” conference “The new US administration: perspectives for Russia”, which discussed issues related to the functioning of the new U.S. Administration after the election of Donald Trump.

  12. Sixty Years of Mogollon Archaeeology: Papers From the Ninth Mogollon Conference, Silver City, New Mexico, 1996, by Stephanie M Whittlesey, SRI Press, Tucson, 1999

    Directory of Open Access Journals (Sweden)

    Stephen E. Nash

    2000-11-01

    Full Text Available "The diverse papers that were presented at the 1996 Mogollon Conference reveal the geographic, intellectual, and temporal scope of contemporary Mogollon archaeology, and almost nothing of the historical controversy surrounding the Mogollon culture concept" (Whittlesey 1999:vii. With these words, Stephanie M. Whittlesey makes it clear in the preface that Sixty Years of Mogollon Archaeology: Papers From the Ninth Mogollon Conference, Silver City, New Mexico, 1996 (SRl Press 2000 contains few papers on the history of Mogollon archaeology. It might therefore be more appropri­ately titled "Current Research in Mogollon Archaeology." The volume was apparently named to honor the sixtieth anniversary of Emil Haury's 1936 publication The Mogollon Culture of Southwestern New Mexico, which described the Mogollon for the first time.

  13. Papers of the Canadian Institute's 3. annual conference : oil sands supply and infrastructure : labour supply, upgraders, transportation, pipelines

    International Nuclear Information System (INIS)

    2005-01-01

    The focus of this conference was on the development of the oil sands industry, with specific reference to issues concerning supply and infrastructure. Energy source development and transmission issues were discussed, as well as transportation systems. The impact of increased oil sands development on pipelines was also examined. Various fuel options were discussed, including the use of hydrogen, natural gas and alternate fuels in manufacturing and processing plants. Economic drivers and the creation of new markets were examined, and various export opportunities were reviewed. The environmental impact of increased oil sands activity was discussed, with specific reference to the Boreal regions. Management challenges in the oil sands industry were also discussed along with issues concerning human resources, labour supply, training and education. The conference featured 15 presentations, of which 13 have been catalogued separately for inclusion in this database. refs., tabs., figs

  14. Selected papers on natural and man-made hazards and related questions from the 6th international CODATA conference. [Santa Flavia, Palermo, Italy, May 22-25, 1978

    Energy Technology Data Exchange (ETDEWEB)

    Dreyfus, B. (ed.)

    Eighty-seven papers were presented at this conference, which had the four themes of quality of life and environment, preservation of natural ecosystems, prediction of natural disasters, and prevention of manmade hazards. The present bulletin contains ten papers felt to be representative; these deal with earthquake prediction, pattern recognition as a method of data analysis, long-term environmental hazards, analysis of numerical biological data, operation of a data bank in biomedical science, data importance in relation to Chesapeake Bay pollution, data banks in food and agriculture, the Seveso accident, and industry needs concerning information on materials. Separate abstracts were prepared for three of the papers. (RWR)

  15. The Relationships between Human Fatigue and Public Health: A Brief Commentary on Selected Papers from the 9th International Conference on Managing Fatigue in Transportation, Resources and Health.

    Science.gov (United States)

    Sargent, Charli; Roberts, Paul; Dawson, Drew; Ferguson, Sally; Meuleners, Lynn; Brook, Libby; Roach, Gregory D

    2016-08-24

    The 9th International Conference on Managing Fatigue in Transportation, Resources and Health was held in Fremantle, Western Australia in March 2015. The purpose of the conferences in this series is to provide a forum for industry representatives, regulators, and scientists to discuss recent advances in the field of fatigue research. We have produced a Special Issue of the International Journal of Environmental Research and Public Health based on papers from the conference that were focused on various aspects of public health. First, the Special Issue highlights the fact that working long shifts and/or night shifts can affect not only cognitive functioning, but also physical health. In particular, three papers examined the potential relationships between shiftwork and different aspects of health, including the cardiovascular system, sleep disordered breathing, and eating behaviour. Second, the Special Issue highlights the move away from controlling fatigue through prescriptive hours of service rules and toward the application of risk management principles. In particular, three papers indicated that best-practice fatigue risk management systems should contain multiple redundant layers of defense against fatigue-related errors and accidents.

  16. The Relationships between Human Fatigue and Public Health: A Brief Commentary on Selected Papers from the 9th International Conference on Managing Fatigue in Transportation, Resources and Health

    Directory of Open Access Journals (Sweden)

    Charli Sargent

    2016-08-01

    Full Text Available The 9th International Conference on Managing Fatigue in Transportation, Resources and Health was held in Fremantle, Western Australia in March 2015. The purpose of the conferences in this series is to provide a forum for industry representatives, regulators, and scientists to discuss recent advances in the field of fatigue research. We have produced a Special Issue of the International Journal of Environmental Research and Public Health based on papers from the conference that were focused on various aspects of public health. First, the Special Issue highlights the fact that working long shifts and/or night shifts can affect not only cognitive functioning, but also physical health. In particular, three papers examined the potential relationships between shiftwork and different aspects of health, including the cardiovascular system, sleep disordered breathing, and eating behaviour. Second, the Special Issue highlights the move away from controlling fatigue through prescriptive hours of service rules and toward the application of risk management principles. In particular, three papers indicated that best-practice fatigue risk management systems should contain multiple redundant layers of defense against fatigue-related errors and accidents.

  17. Assessment of the effects of the Japanese shift to lead-free solders and its impact on material substitution and environmental emissions by a dynamic material flow analysis

    International Nuclear Information System (INIS)

    Fuse, Masaaki; Tsunemi, Kiyotaka

    2012-01-01

    Lead-free electronics has been extensively studied, whereas their adoption by society and their impact on material substitution and environmental emissions are not well understood. Through a material flow analysis (MFA), this paper explores the life cycle flows for solder-containing metals in Japan, which leads the world in the shift to lead-free solders in electronics. The results indicate that the shift has been progressing rapidly for a decade, and that substitutes for lead in solders, which include silver and copper, are still in the early life cycle stages. The results also show, however, that such substitution slows down during the late life cycle stages owing to long electronic product lifespans. This deceleration of material substitution in the solder life cycle may not only preclude a reduction in lead emissions to air but also accelerate an increase in silver emissions to air and water. As an effective measure against ongoing lead emissions, our scenario analysis suggests an aggressive recycling program for printed circuit boards that utilizes an existing recycling scheme. -- Highlights: ► We model the life cycle flows for solder-containing metals in Japan. ► The Japanese shift to lead-free solders progresses rapidly for a decade. ► Substitution for lead in solders slows down during the late life cycle stages. ► The deceleration of substitution precludes a reduction in lead emissions to air.

  18. Processing and Characterization of NiTi Shape Memory Alloy Particle Reinforced Sn-In Solders

    National Research Council Canada - National Science Library

    Chung, Kohn C

    2006-01-01

    .... In previous work, it was proposed that reinforcement of solder by NiTi shape memory alloy particles to form smart composite solder reduces the inelastic strain of the solder and hence, may enhance...

  19. Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints

    Science.gov (United States)

    Huang, Z.; Kumar, P.; Dutta, I.; Sidhu, R.; Renavikar, M.; Mahajan, R.

    2014-01-01

    A fracture mechanism map (FMM) is a powerful tool which correlates the fracture behavior of a material to its microstructural characteristics in an explicit and convenient way. In the FMM for solder joints, an effective thickness of the interfacial intermetallic compound (IMC) layer ( t eff) and the solder yield strength ( σ ys,eff) are used as abscissa and ordinate axes, respectively, as these two predominantly affect the fracture behavior of solder joints. Earlier, a definition of t eff, based on the uniform thickness of IMC ( t u) and the average height of the IMC scallops ( t s), was proposed and shown to aptly explain the fracture behavior of solder joints on Cu. This paper presents a more general definition of t eff that is more widely applicable to a range of metallizations, including Cu and electroless nickel immersion gold (ENIG). Using this new definition of t eff, mode I FMM for SAC387/Cu joints has been updated and its validity was confirmed. A preliminary FMM for SAC387/Cu joints with ENIG metallization is also presented.

  20. Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

    Energy Technology Data Exchange (ETDEWEB)

    Hamm, Randy; Peterson, Kenneth A.

    2015-10-01

    This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm X 6.5 mm X 0.1 mm (0.354” x 0.256” x 0.004”), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while maintaining a consistent bondline (minimizing die tilt). Voiding was measured using acoustic imaging and die tilt was measured using two different optical measurement systems. 80Au-20Sn solder reflow was achieved using a batch vacuum solder system with optimized fixturing. Minimizing die tilt proved to be the more difficult of the two product requirements to meet. Process development variables included tooling, weight and solder preform thickness.

  1. Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy

    Directory of Open Access Journals (Sweden)

    Abdoul-Aziz Bogno

    2015-01-01

    Full Text Available The properties and performance of lead-free solder alloys such as fluidity and wettability are defined by the alloy composition and solidification microstructure. Rapid solidification of metallic alloys is known to result in refined microstructures with reduced microsegregation and improved mechanical properties of the final products as compared to normal castings. The rapidly solidified Sn-based solders by melt spinning were shown to be suitable for soldering with low temperature and short soldering duration. In the present study, rapidly solidified Sn–0.7 wt.%Cu droplets generated by impulse atomization (IA were achieved as well as directional solidification under transient conditions at lower cooling rate. This paper reports on a comparative study of the rapidly solidified and the directionally solidified samples. Different but complementary characterization techniques were used to fully analyze the solidification microstructures of the samples obtained under the two cooling regimes. These include X-ray diffractometry (XRD and scanning electron microscopy (SEM. In order to compare the tensile strength and elongation to fracture of the directionally solidified ingot and strip castings with the atomized droplet, compaction and extrusion of the latter were carried out. It was shown that more balanced and superior tensile mechanical properties are available for the hot extruded samples from compacted as-atomized Sn–0.7 wt.%Cu droplets. Further, elongation-to-fracture was 2–3× higher than that obtained for the directionally solidified samples.

  2. Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack

    Directory of Open Access Journals (Sweden)

    Shoudong Gu

    2016-06-01

    Full Text Available To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT (Surface Mount Technology production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process. Here, the critical jet ejection velocity is discussed through theoretical analysis. The relations between ejection velocity and needle structure, needle velocity, and nozzle diameter were obtained by FLUENT software. Then, the prototype of the solder paste jetting system was fabricated, and the performance was verified by experiments. The effects of the gap between nozzle and needle, the driving voltage, and the nozzle diameter on the jetting performance and droplet diameter were obtained. Solder paste droplets 0.85 mm in diameter were produced when the gap between the nozzle and needle was adjusted to 10 μm, the driving voltage to 80 V, the nozzle diameter to 0.1 mm, and the variation of the droplet diameter was within ±3%.

  3. Mechanical properties of soldered joints of niobium base alloys

    International Nuclear Information System (INIS)

    Grishin, V.L.

    1980-01-01

    Mechanical properties of soldered joints of niobium alloys widely distributed in industry: VN3, VN4, VN5A, VN5AE, VN5AEP etc., 0.6-1.2 mm thick are investigated. It is found out that the usage of zirconium-vanadium, titanium-tantalum solders for welding niobium base alloys permits to obtain soldered joints with satisfactory mechanical properties at elevated temperatures

  4. Evaluation on the characteristics of tin-silver-bismuth solder

    Science.gov (United States)

    Xia, Z.; Shi, Y.; Chen, Z.

    2002-02-01

    Tin-silver-bismuth solder is characterized by its lower melting point, good wetting behavior, and good mechanical property for which it is expected to be a new lead-free solder to replace tin-lead solder. In this article, Sn-3.33Ag-4.83Bi solder was investigated concerning its physical, spreading, and mechanical properties under specific conditions. Cooling curves and DSC results showed that it was close to eutectic composition (m.p. 210° 212 °C). Coefficiency of thermal expansion (CTE) of this solder, between that of PCBs and copper substrates, was beneficial to alleviate the thermal mismatch of the substrates. It was also a good electrical and thermal conductor. Using a rosin-based, mildly activated (RMA) flux, a spreading test indicated that SnAgBi solder paste had good solderability. Meanwhile, the solder had high tensile strength and fracture energy. Its fracture mechanism was a mixture of ductile and brittle fracture morphology. The metallographic and EDAX analyses indicated that it was composed of a tin-based solid solution and some intermetallic compound (IMC) that could strengthen the substrate. However, these large needle-like IMCs would cut the substrate and this resulted in the decreasing of the toughness of the solder.

  5. Editorial: Advanced Learning Technologies, Performance Technologies, Open Contents, and Standards - Some Papers from the Best Papers of the Conference ICCE C3 2009

    Directory of Open Access Journals (Sweden)

    Fanny Klett (IEEE Fellow

    2010-09-01

    Full Text Available This special issue deals with several cutting edge research outcomes from recent advancement of learning technologies. Advanced learning technologies are the composition of various related technologies and concepts such as i internet technologies and mobile technologies, ii human and organizational performance/knowledge management, and iii underlying trends toward open technology, open content and open education. This editorial note describes the overview of these topics related to the advanced learning technologies to provide the common framework for the accepted papers in this special issue.

  6. Papers of the Ziff Energy Group's 30. North American gas strategies conference : setting the stage : energy policy to market

    International Nuclear Information System (INIS)

    2005-01-01

    Policies and economic drivers concerning the natural gas industry were the focus of this conference, which was divided into 3 sessions. The first session examined various policy issues and perspectives from government officials in North America. High energy prices and regulations concerning land access were reviewed, as well as supply costs and infrastructure needs. Outlooks for the natural gas industry in Alberta and British Columbia were presented. Issues concerning coalbed methane (CBM) and accessing off-shore natural gas were discussed. Activities in the Yukon were outlined. Land claim settlements were reviewed, and the development of a liquefied natural gas (LNG) infrastructure in Mexico was examined. Issues concerning the role of the natural gas industry in oil sands developments were addressed, as well as pipelines challenges and gas price impacts. Session 2 examined pipeline developments and infrastructure needs. Issues concerning stress corrosion cracking and the increase in Canadian pipelines were reviewed along with rates of return and market needs. Challenges facing natural gas infrastructure in the northeast were outlined and the impacts of LNG and northern supply were evaluated. Session 3 examined the impact of high gas prices. Macroeconomic impacts to the United States economy were discussed, as well as the impact of rising natural gas prices on the industrial sector. Issues concerning contract terms, credit terms, traded volumes and hedging were examined. Advances in temperature forecasting were reviewed. Short term price impacts and fundamental supply and demand issues were reviewed in relation to marketplace needs. Eleven presentations were given at this conference, of which 5 have been catalogued separately for inclusion in this database. tabs., figs

  7. Fluxless flip-chip bonding using a lead-free solder bumping technique

    Science.gov (United States)

    Hansen, K.; Kousar, S.; Pitzl, D.; Arab, S.

    2017-09-01

    With the LHC exceeding the nominal instantaneous luminosity, the current barrel pixel detector (BPIX) of the CMS experiment at CERN will reach its performance limits and undergo significant radiation damage. In order to improve detector performance in high luminosity conditions, the entire BPIX is replaced with an upgraded version containing an additional detection layer. Half of the modules comprising this additional layer are produced at DESY using fluxless and lead-free bumping and bonding techniques. Sequential solder-jetting technique is utilized to wet 40-μm SAC305 solder spheres on the silicon-sensor pads with electroless Ni, Pd and immersion Au (ENEPIG) under-bump metallization (UBM). The bumped sensors are flip-chip assembled with readout chips (ROCs) and then reflowed using a flux-less bonding facility. The challenges for jetting low solder volume have been analyzed and will be presented in this paper. An average speed of 3.4 balls per second is obtained to jet about 67 thousand solder balls on a single chip. On average, 7 modules have been produced per week. The bump-bond quality is evaluated in terms of electrical and mechanical properties. The peak-bump resistance is about 17.5 mΩ. The cross-section study revealed different types of intermetallic compounds (IMC) as a result of interfacial reactions between UBM and solder material. The effect of crystalline phases on the mechanical properties of the joint is discussed. The mean shear strength per bump after the final module reflow is about 16 cN. The results and sources of yield loss of module production are reported. The achieved yield is 95%.

  8. Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

    Science.gov (United States)

    Coyle, Richard J.; Sweatman, Keith; Arfaei, Babak

    2015-09-01

    Thermal fatigue is a major source of failure of solder joints in surface mount electronic components and it is critically important in high reliability applications such as telecommunication, military, and aeronautics. The electronic packaging industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu alloys first established as replacements for eutectic SnPb. This paper discusses the results from Pb-free solder joint reliability programs sponsored by two industry consortia. The characteristic life in accelerated thermal cycling is reported for 12 different Pb-free solder alloys and a SnPb control in 9 different accelerated thermal cycling test profiles in terms of the effects of component type, accelerated thermal cycling profile and dwell time. Microstructural analysis on assembled and failed samples was performed to investigate the effect of initial microstructure and its evolution during accelerated thermal cycling test. A significant finding from the study is that the beneficial effect of Ag on accelerated thermal cycling reliability (measured by characteristic lifetime) diminishes as the severity of the accelerated thermal cycling, defined by greater ΔT, higher peak temperature, and longer dwell time increases. The results also indicate that all the Pb-free solders are more reliable in accelerated thermal cycling than the SnPb alloy they have replaced. Suggestions are made for future work, particularly with respect to the continued evolution of alloy development for emerging application requirements and the value of using advanced analytical methods to provide a better understanding of the effect of microstructure and its evolution on accelerated thermal cycling performance.

  9. White Paper Report of the RAD-AID Conference on International Radiology for Developing Countries: identifying challenges, opportunities, and strategies for imaging services in the developing world.

    Science.gov (United States)

    Mollura, Daniel J; Azene, Ezana M; Starikovsky, Anna; Thelwell, Aduke; Iosifescu, Sarah; Kimble, Cary; Polin, Ann; Garra, Brian S; DeStigter, Kristen K; Short, Brad; Johnson, Benjamin; Welch, Christian; Walker, Ivy; White, David M; Javadi, Mehrbod S; Lungren, Matthew P; Zaheer, Atif; Goldberg, Barry B; Lewin, Jonathan S

    2010-07-01

    The RAD-AID Conference on International Radiology for Developing Countries was an assembly of individuals and organizations interested in improving access to medical imaging services in developing countries where the availability of radiology has been inadequate for both patient care and public health programs. The purpose of the meeting was to discuss data, experiences, and models pertaining to radiology in the developing world and to evaluate potential opportunities for future collaboration. Conference participants included radiologists, technologists, faculty members of academic medical institutions, and leadership of nongovernmental organizations involved in international health care and social entrepreneurship. Four main themes from the conference are presented in this white paper as important factors for the implementation and optimization of radiology in the developing world: (1) ensuring the economic sustainability of radiologic services through financial and administrative training support of health care personnel; (2) designing, testing, and deploying clinical strategies adapted for regions with limited resources; (3) structuring and improving the role of American radiology residents interested in global health service projects; and (4) implementing information technology models to support digital imaging in the developing world. Published by Elsevier Inc.

  10. Title - EFARS - Conference (Uninvited)

    OpenAIRE

    Lohrey, MC; Lawrence, AS

    2016-01-01

    Abstract - EFARS - Conference (Uninvited) "Notes" - EFARS - Conference (Uninvited) In preparation (Publication status) Yes, full paperYes, abstract onlyNo (Peer reviewed?) "Add a comment" - EFARS - Conference - Uninvited

  11. AIAA Applied Aerodynamics Conference, 8th, Portland, OR, Aug. 20-22, 1990, Technical Papers. Parts 1 ampersand 2

    International Nuclear Information System (INIS)

    Anon.

    1990-01-01

    The present conference discusses topics in CFD methods and their validation, vortices and vortical flows, STOL/VSTOL aerodynamics, boundary layer transition and separation, wing airfoil aerodynamics, laminar flow, supersonic and hypersonic aerodynamics, CFD for wing airfoil and nacelle applications, wind tunnel testing, flight testing, missile aerodynamics, unsteady flow, configuration aerodynamics, and multiple body/interference flows. Attention is given to the numerical simulation of vortical flows over close-coupled canard-wing configuration, propulsive lift augmentation by side fences, road-vehicle aerodynamics, a shock-capturing method for multidimensional flow, transition-detection studies in a cryogenic environment, a three-dimensional Euler analysis of ducted propfan flowfields, multiple vortex and shock interaction at subsonic and supersonic speeds, and a Navier-Stokes simulation of waverider flowfields. Also discussed are the induced drag of crescent-shaped wings, the preliminary design aerodynamics of missile inlets, finite wing lift prediction at high angles-of-attack, optimal supersonic/hypersonic bodies, and adaptive grid embedding for the two-dimensional Euler equations

  12. International conference on safe decommissioning for nuclear activities: Assuring the safe termination of practices involving radioactive materials. Contributed papers

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2002-07-01

    Thousands of operations involving the use of radioactive substances will end during the current century. While there is considerable regulatory experience in the 'front end' of the regulatory system for practices, the experience at the back end is more limited as fewer practices have actually been terminated. When a practice is terminated because the facility has reached the end of its useful life, action has to betaken to ensure the safe shutdown of the facility and allow the removal of regulatory controls. There are many issues involved in the safe termination of practices. These include setting criteria for the release of material and sites from regulatory control; determining the suitability of the various options for decommissioning nuclear facilities, managing the waste and material released from control (recycling, reuse or disposal), and the eventual remediation of the site. Some countries have put in place regulatory infrastructures and have developed programmes to manage the associated decommissioning and remediation activities. Other countries are at the stage of assessing what is involved in terminating such practices. The purpose of this Conference is to foster an information exchange on the safe an orderly termination of practices that involve the use of radioactive substances, including both decommissioning and environmental remediation, and to promote improved coherence internationally on strategies and criteria for the safe termination of practices.

  13. II International Conference: Radiation Protection Training. Future Strategies. Ciemat, 17-19 September, 2003. Book of Papers and Proceedings

    International Nuclear Information System (INIS)

    2003-01-01

    Safety in the use of ionising radiation and protection against potential risks due to exposure to radiation sources are not static concepts, rather their evolution runs parallel with an increased knowledge of the technologies and basic concepts employed. Education and training, which are inherently tied to with research, are the means to disseminate the advances made to the scientists and professionals working with ionising radiation. At present, Radiation Protection (RP) training is considered to be the best means to promote a safety culture and to improve the competence of exposed workers. Indeed, progress in both RP teaching and training, which form part of this transfer of technology and specialized knowledge, are fields that are in continuous motion. The first conference on Radiation Protection training was celebrated in Saclay (France) under the slogan Radiation Protection: What are the Future Training needs?. It can be considered as the first such meeting dedicated to the community of professionals, from a wide range of scientific and technological backgrounds, related in some way to Radiation Protection training. (Author)

  14. International conference on safe decommissioning for nuclear activities: Assuring the safe termination of practices involving radioactive materials. Contributed papers

    International Nuclear Information System (INIS)

    2002-01-01

    Thousands of operations involving the use of radioactive substances will end during the current century. While there is considerable regulatory experience in the 'front end' of the regulatory system for practices, the experience at the back end is more limited as fewer practices have actually been terminated. When a practice is terminated because the facility has reached the end of its useful life, action has to betaken to ensure the safe shutdown of the facility and allow the removal of regulatory controls. There are many issues involved in the safe termination of practices. These include setting criteria for the release of material and sites from regulatory control; determining the suitability of the various options for decommissioning nuclear facilities, managing the waste and material released from control (recycling, reuse or disposal), and the eventual remediation of the site. Some countries have put in place regulatory infrastructures and have developed programmes to manage the associated decommissioning and remediation activities. Other countries are at the stage of assessing what is involved in terminating such practices. The purpose of this Conference is to foster an information exchange on the safe an orderly termination of practices that involve the use of radioactive substances, including both decommissioning and environmental remediation, and to promote improved coherence internationally on strategies and criteria for the safe termination of practices

  15. IFLA General Conference, 1987. Division of Management and Technology. Conservation Section. Round Table on Audiovisual Media. Papers.

    Science.gov (United States)

    International Federation of Library Associations, The Hague (Netherlands).

    The eight papers in this collection focus on the preservation of both print and nonprint library materials: (1) "Properties and Problems of Modern Papers" (D. J. Priest, United Kingdom); (2) "On the Origin of Papermaking in the Light of Scientific Research on Recent Archaeological Discoveries" (Jixing Pan, China); (3) "Researches in New…

  16. Nuclear energy: technology, safety, ecology, economy, management. The I All-Russian scientific-practical conference of young nuclear scientists of Siberia. Collection of scientific papers

    International Nuclear Information System (INIS)

    2010-01-01

    Collection of research papers I All-Russian scientific-practical conference of young nuclear scientists in Siberia, held 19-25 September 2010 in Tomsk, is presented. The edition contains material on a wide range of research scientists-economists, professors, graduate students and young scientists, and school children of Tomsk, Seversk, and several other Russian cities on the technology, security, ecology, economics, management in the nuclear power industry. Discussion of the presented research was conducted on sections: 1. Technological support for the nuclear fuel cycle, 2. Nuclear non-proliferation and environmental safety of the nuclear fuel cycle, 3. Energy: Present and Future 4. It all starts with an idea [ru

  17. Proceedings of the papers of the 33rd Coal Science Conference (1996); Dai 33 kai sekitan kagaku kaigi happyo ronbunshu (1996)

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1996-10-28

    This is a proceedings of the papers made public in the 33rd (fiscal 1996) Coal Science Conference held by the Japan Institute of Energy. The number of the papers included is 82. The processes such as coal liquefaction, coal gasification and pyrolysis are largely influenced by reaction of the carbon compound in coal. However, coal, which is different in reaction characteristics depending on its producing area, is a comprehensive compound. Therefore, the trial has been made for clarifying the molecular structure and skeleton. In the sense, the following papers are taken notice of: Suzuki and others` Estimation for origin of coals by biomaker analysis; Sugimoto and others` Change of unit skeletons during the artificial coalification; Hirado and others` Study on the correlation between chemical and mineral composition of coal ashes; Okawa and others` Coal structure construction system with construction knowledge and partial energy evaluation; Kanbayashi and others` Analysis of the relationship between coal properties and liquefaction characteristics by using the coal database.

  18. Microstructure and mechanical properties of Sn-9Zn-xAl2O3 nanoparticles (x=0–1) lead-free solder alloy: First-principles calculation and experimental research

    International Nuclear Information System (INIS)

    Xing, Wen-qing; Yu, Xin-ye; Li, Heng; Ma, Le; Zuo, Wei; Dong, Peng; Wang, Wen-xian; Ding, Min

    2016-01-01

    This paper studies microstructure and mechanical properties of Sn-9Zn-x Al 2 O 3 nanoparticles (x=0–1) lead-free solder alloy. The interface structure, interface energy and electronic properties of Al 2 O 3 /Sn9Zn interface are investigated by first-principle calculation. On the experimental part, in comparison with the plain Sn-9Zn solder, the Al 2 O 3 nanoparticles incorporated into the solder matrix can inhibit the growth of coarse dendrite Sn-Zn eutectic structure and refine grains of the composite solders during the solidification process of the alloys. Moreover, the microhardness and average tensile strength of the solders with addition of Al 2 O 3 nanoparticles increased with the increasing weight percentages of Al 2 O 3 nanoparticles. These improved mechanical properties can be attributed to the microstructure developments and the dispersed Al 2 O 3 nanoparticles.

  19. Laser-activated protein solder for peripheral nerve repair

    Science.gov (United States)

    Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

    1995-05-01

    A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

  20. Soldering of copper-clad niobium--titanium superconductor composite

    International Nuclear Information System (INIS)

    Moorhead, A.J.; Woodhouse, J.J.; Easton, D.S.

    1977-04-01

    When superconductivity is applied to various electrical devices, the joining of the superconducting material and the performance of the joints are generally crucial to the successful operation of the system. Although many techniques are being considered for joining composite superconductors, soldering is the most common. We determined the wetting and flow behavior of various solder and flux combinations on a copper-clad Nb-Ti composite, developed equipment and techniques for soldering and inspection of lap joints, and determined the shear strength of joints at temperatures down to -269 0 C (4 0 K). We studied 15 solders and 17 commercial and experimental fluxes in the wettability and flow tests. A resistance unit was built for soldering test specimens. A series of samples soldered with 80 Pb-20 Sn, 83 Pb-15 Sn-2 Sb, 97.5 Pb-1.5 Ag-1 Sn, 80 In-15 Pb-5 Ag, or 25 In-37.5 Pb-37.5 Sn (wt percent) was inspected by three nondestructive techniques. Through-transmission ultrasound gave the best correlation with nonbond areas revealed in peel tests. Single-lap shear specimens soldered with 97.5 Pb-1.5 Ag-1 Sn had the highest strength (10.44 ksi, 72 MPa) and total elongation (0.074 in., 1.88 mm) at -269 0 C (4 0 K) of four solders tested

  1. Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process

    Science.gov (United States)

    Mallik, S.; Bauer, R.; Hübner, F.; Ekere, N. N.

    2011-01-01

    Solder paste is the most widely used interconnection material in the electronic assembly process for attaching electronic components/devices directly onto the surface of printed circuit boards, using stencil printing process. This paper evaluates the performance of three different commercially available Sn-Ag-Cu solder pastes formulated with different particle size distributions (PSD), metal content and alloy composition. A series of stencil printing tests were carried out using a specially designed stencil of 75 μm thickness and apertures of 300×300 μm2 dimension and 500 μm pitch sizes. Solder paste printing behaviors were found related to attributes such as slumping and surface tension and printing performance was correlated with metal content and PSD. The results of the study should benefit paste manufacturers and SMT assemblers to improve their products and practices.

  2. Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloy

    DEFF Research Database (Denmark)

    Malik, Safdar Abbas; Le, Thanh Hung; Van Nong, Ngo

    2018-01-01

    and metallic electrodes. In this paper, we investigate the joining of ZnSb to Ni and Ag electrodes using a commercial solder alloy S-Bond 400 and hot-pressing technique. Ti and Cr layers are also introduced as a diffusion barrier and microstructure at the interfaces is observed by scanning electron microscopy....... We found that S-bond 400 solder reacts with Ag and Ni electrodes to form different alloys at the interfaces. Cr layer was found to be broken after joining, resulting in a thicker reaction/diffusion layer at the interface, while Ti layer was preserved....

  3. Numerical prediction of mechanical properties of Pb-Sn solder alloys containing antimony, bismuth and or silver ternary trace elements

    Science.gov (United States)

    Gadag, Shiva P.; Patra, Susant

    2000-12-01

    Solder joint interconnects are mechanical means of structural support for bridging the various electronic components and providing electrical contacts and a thermal path for heat dissipation. The functionality of the electronic device often relies on the structural integrity of the solder. The dimensional stability of solder joints is numerically predicted based on their mechanical properties. Algorithms to model the kinetics of dissolution and subsequent growth of intermetallic from the complete knowledge of a single history of time-temperature-reflow profile, by considering equivalent isothermal time intervals, have been developed. The information for dissolution is derived during the heating cycle of reflow and for the growth process from cooling curve of reflow profile. A simple and quick analysis tool to derive tensile stress-strain maps as a function of the reflow temperature of solder and strain rate has been developed by numerical program. The tensile properties are used in modeling thermal strain, thermal fatigue and to predict the overall fatigue life of solder joints. The numerical analysis of the tensile properties as affected by their composition and rate of testing, has been compiled in this paper. A numerical model using constitutive equation has been developed to evaluate the interfacial fatigue crack growth rate. The model can assess the effect of cooling rate, which depends on the level of strain energy release rate. Increasing cooling rate from normalizing to water-quenching, enhanced the fatigue resistance to interfacial crack growth by up to 50% at low strain energy release rate. The increased cooling rates enhanced the fatigue crack growth resistance by surface roughening at the interface of solder joint. This paper highlights salient features of process modeling. Interfacial intermetallic microstructure is affected by cooling rate and thereby affects the mechanical properties.

  4. Integration of environmentally compatible soldering technologies for waste minimization

    International Nuclear Information System (INIS)

    Hosking, F.M.

    1992-01-01

    There has been a concentrated effort throughout the international microelectronics industry to phase out chlorofluorocarbon (CFC) materials and alleviate the serious problem of ozone depletion created by the release of CFCS. The development of more environmentally compatible manufacturing technologies is the cornerstone of this effort. Alternative materials and processes for cleaning and soldering have received special attention. Electronic. soldering typically utilizes rosin-based fluxes to promote solder wettability. Flux residues must be removed from the soldered parts when high product reliability is essential. Halogenated or CFC solvents have been the principle chemicals used to clean the residues. With the accelerated push to eliminate CFCs in the US by 1995, CFC-free solvents, aqueous-based cleaning, water soluble or ''no clean'' fluxes, and fluxless soldering technologies are being developed and quickly integrated into manufacturing practice. Sandia's Center for Solder Science and Technology has been ch g a variety of fluxless and alternative soldering technologies for DOE's waste minimization program. The work has focused on controlled atmosphere, laser, and ultrasonic fluxless soldering, protective metallic and organic coatings, and fluxes which have water soluble or low solids-based chemistries. With the increasing concern that Pb will also be banned from electronic soldering, Sandia has been characterizing the wetting, aging, and mechanical properties of Pb-fire solder alloys. The progress of these integrated studies will be discussed. Their impact on environmentally compatible manufacturing will be emphasized. Since there is no universal solution to the various environmental, safety, and health issues which currently face industry, the proposed technologies offer several complementary materials and processing options from which one can choose

  5. Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder

    Science.gov (United States)

    2015-05-05

    under bump metallurgy and solder joint geometry on Sn grain morphology in Pb free solder joints were examined. SnAgCu solder joints were examined for...free solder interconnects”, Sci. Technol. Weld . Join. 13, 732 (2008). [3.25] Terashima, S., Takahama, K., Nozaki, M., and Tanaka, M. Recrystallization

  6. IFLA General Conference, 1987. Report to the IFLA Council: The Work of the Professional Board and Index to Papers.

    Science.gov (United States)

    International Federation of Library Associations, The Hague (Netherlands).

    The first of two papers in this document is a report describing the work of the International Federation of Library Association's (IFLA) first professional board functioning under the Chicago rule changes of 1985. Topics include changes in the annual meeting structure; changes in the Medium Term Programme 1986-1991 (MTP); coordination with the…

  7. Teacher Pension Incentives and Labor Market Behavior: Evidence from Missouri Administrative Teacher Data. Conference Paper 2009-11

    Science.gov (United States)

    Ni, Shawn; Podgursky, Michael; Ehlert, Mark

    2009-01-01

    Policy discussions about teacher quality and teacher "shortages" often focus on recruitment and retention of young teachers. However, attention has begun to focus on the incentive effects of teacher retirement benefit systems, particularly given their rising costs and the large unfunded liabilities. In this paper we analyze accrual of…

  8. Transatlantic Dialogue: A Research Exchange; Papers from a Joint Conference (Leeds, England, July 11-13, 1988).

    Science.gov (United States)

    Zukas, Miriam, Ed.

    Over 90 papers focus on adult education research. Selected titles include "Karl Marx's Theoretical Contributions to Radical Adult Education" (Allman, Wallis); "Educating Educators" (Armstrong); "Comparative Study of Philosophical Foundations of Adult Education in China and United States" (Bao); "Ethical Value Dilemmas of Professional Adult…

  9. Wavelength Modulation Spectroscopy for Temperature and Species Concentration in the Plume of a Supersonic Nozzle (Conference Paper with Briefing Charts)

    Science.gov (United States)

    2017-07-12

    Paper with Briefing Charts 22 May 2017 - 30 July 2017 Wavelength Modulation Spectroscopy for Temperature and Species Concentration in the Plume of a...environments. Wavelength modulation spectroscopy (WMS) is a laser absorption spectroscopy technique that allows for quantitative, time-resolved...American Institute of Aeronautics and Astronautics 1 Wavelength Modulation Spectroscopy for Temperature and Species Concentration in the

  10. School Processes That Can Drive Scaling-Up of an Innovation, or Contribute to Its Abandonment. Conference Paper

    Science.gov (United States)

    Zacamy, Jenna; Newman, Denis; Lazarev, Valeriy; Lin, Li

    2015-01-01

    This paper reports findings from a multi-year study of the scale-up of Reading Apprenticeship (RA), an approach to improve academic literacy by helping teachers provide the support students need to be successful readers in the content areas. WestEd's Strategic Literacy Initiative (SLI), began developing the program in 1995 and has since reached…

  11. New Developments in the Field of Materials for Electric Power Engineering. Paper presented at the ETG Conference (Energy Technology Society) 1981

    Energy Technology Data Exchange (ETDEWEB)

    1981-01-01

    The Conference Proceedings comprise 21 papers divided into 4 theme groups: insulating materials and insulating systems; structural materials; magnetic materials; conductor and contact materials. Individual papers deal with: the search for a new insulating system for transformers; insulating oils and liquids; an insulating system for electric machines of high heat resistance: progress in insulation of exciter winding in hydroelectic generators and other large synchronous machines; insulating systems for extreme envronmental conditions; behavior of silicon elastomer, organic, and polyethylene insulating materials; development of new magnetic materials, in particular: metallic glasses; amorphous magnetic materials; pressed iron powder parts; modern permanent magnetic materials; development of new contact materials for power switchgear; alternative switchgear technologies; a new cryogenic conductor structured element based on V/sub 2/O/sub 3/ ceramic; choice of material for fuses.

  12. Papers of the Canadian Institute conference on buying power in Ontario : critical starting-gate information evolving strategies to reduce costs and minimize risk

    International Nuclear Information System (INIS)

    2002-01-01

    Industry executives and senior government officials attended this conference to learn what to expect when the electricity market opens in Ontario. Topics of discussion included the new risks as well as hedging strategies to manage volatile electricity prices. Papers presented a status update regarding what services to expect from utilities and marketers in a deregulated market. Several presentations described Alberta's experience with deregulation and presented lessons that Ontario can learn to save time, money and how to best deal with electricity contracts. Methods to control and monitor energy consumption and energy costs internally were also described. A total of 14 papers were presented, of which 4 were indexed separately for inclusion in the database. tabs., figs

  13. EDITORIAL: Adaptive and active materials: Selected papers from the ASME 2010 Conference on Smart Materials, Adaptive Structures and Intelligent Systems (SMASIS 10) (Philadelphia, PA, USA, 28 September-1 October 2010) Adaptive and active materials: Selected papers from the ASME 2010 Conference on Smart Materials, Adaptive Structures and Intelligent Systems (SMASIS 10) (Philadelphia, PA, USA, 28 September-1 October 2010)

    Science.gov (United States)

    Brei, Diann

    2011-09-01

    The third annual meeting of the AMSE/AIAA Smart Materials, Adaptive Structures and Intelligent Systems Conference (SMASIS) took place in the heart of historic Philadelphia's cultural district, and included a pioneer banquet in the National Constitutional Center. The applications emphasis of the 2010 conference was reflected in keynote talks by Dr Alan Taub, vice president of General Motors global research and development, 'Smart materials in the automotive industry'; Dr Charles R Farrar, engineering institute leader at Los Alamos National Laboratory, 'Future directions for structural health monitoring of civil engineering infrastructure'; and Professor Christopher S Lynch of the University of California Los Angeles, 'Ferroelectric materials and their applications'. The SMASIS conference was divided into six technical symposia each of which included basic research, applied technological design and development, and industrial and governmental integrated system and application demonstrations. The six symposia were: SYMP 1 Multifunctional Materials; SYMP 2 Active Materials, Mechanics and Behavior; SYMP 3 Modeling, Simulation and Control; SYMP 4 Enabling Technologies and Integrated System Design; SYMP 5 Structural Health Monitoring/NDE; and SYMP 6 Bio-inspired Smart Materials and Structures. In addition, the conference introduced a new student and young professional development symposium. Authors of papers in the materials areas (symposia 1, 2 and 6) were invited to write a full journal article on their presentation topic for publication in this special issue of Smart Materials and Structures. This set of papers demonstrates the exceptional quality and originality of the conference presentations. We are appreciative of their efforts in producing this collection of highly relevant articles on smart materials.

  14. The Determinants of Transitions in Youth. Papers from the Conference Organized by the ESF Network on Transitions in Youth, CEDEFOP and GRET (Universitat Autonoma de Barcelona) (Barcelona, Spain, September 20-21, 1993). 2nd Edition. CEDEFOP Panorama. Second Edition.

    Science.gov (United States)

    European Centre for the Development of Vocational Training, Berlin (Germany).

    This document consists of the 24 papers delivered at a conference that had five workshops examining various dimensions of the social and occupational transition of young people. The papers are arranged by workshop/session. A summary report precedes the other papers presented during a session. The papers in the session on perspectives on systems,…

  15. PARADIGM: A BIBLIOMETRIC ANALYSIS OF PAPERS PRESENTED AT THE CONFERENCES OF THE POMS FROM 2000 TO 2010

    Directory of Open Access Journals (Sweden)

    João Almeida Santos

    2014-01-01

    Full Text Available This study presents bibliometrics on Paradigm in papers presented at the Production and Operation Management Society (POMS from 2000 to 2010, and establishes the profile of the authors and the theoretical relationships present in those papers’ content. The portal of the Production and Operation Management Society and the abstracts contained in each of the events of the period were used, seeking to highlight the concept of Paradigm and its approaches. As a result, the articles presented at the POMS from 2000 to 2010, at least three out of the four hundred papers had the concept in its title or abstract, besides being within the central arguments of these same items analyzed by this study.

  16. NASA Scientific and Technical Publications: A Catalog of Special Publications, Reference Publications, Conference Publications, and Technical Papers 1987-1990

    Science.gov (United States)

    1991-02-01

    Technical Papers present the results of significant research conducted by NASA scientists and engineers. Presented here are citations for reports from each...CSCL contains photographs of 322 galaxies including the majority of all 03A Shapley-Ames bright galaxies, plus cluster members in the Virgo A...Catalog of Open Clusters and Associated Interstellar Matter Research Council, London, United Kingdom Sponsored by NASA, summarizes observations of 128 open

  17. Characterization of lead-free solders for electronic packaging

    Science.gov (United States)

    Ma, Hongtao

    The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (Th > 0.5T m even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn-Pb solder alloys. In this research, mechanical measurements of isothermal aging effects and the resulting changes in the materials behavior of lead-free solders were performed. A novel specimen preparation procedure was developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process. Using specimens fabricated with the developed procedure, isothermal aging effects and viscoplastic material behavior evolution have been characterized for 95.5Sn-4.0Ag-0.5Cu (SAC405) and 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solders, which are commonly used as the solder ball alloy in lead-free BGAs and other components. Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Up to 40% reduction in tensile strength was observed for water quenched specimens after two months of aging at room temperature. Creep deformation also increased dramatically with increasing aging durations. Microstructural changes during room temperature aging were also observed and recorded for the solder alloys and correlated with the observed mechanical behavior changes. Aging effects at elevated temperatures for up to 6 months were also investigated. Thermal aging caused significant tensile strength loss and deterioration of creep deformation. The thermal aging results also showed that after an initial tensile strength drop, the Sn-Pb eutectic solder reached a relatively stable stage after 200 hours of aging. However, for SAC alloy, both the tensile and

  18. 11th AINSE Plasma Physics Conference 1977, 7th and 8th February, 1977, Lucas Heights, NSW (Australia), 9th February, 1977, University of Sydney. Abstracts of Papers 1-54

    Energy Technology Data Exchange (ETDEWEB)

    Walsh, C. J. [ed.

    1977-02-15

    Abstracts of papers 1-54 scheduled for oral presentation at the 11th AINSE Plasma Physics Conference are included. No introductory or summary information is provided. Each page consists of the title, authors, organization affiliation, and abstract.

  19. Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/ Pd/ Au surface finishes

    International Nuclear Information System (INIS)

    NorAkmal, F.; Ourdjini, A.; Azmah Hanim, M.A.; Siti Aisha, I.; Chin, Y.T.

    2007-01-01

    Flip chip technology provides the ultimate in high I/ O-density and count with superior electrical performance for interconnecting electronic components. Therefore, the study of the intermetallic compounds was conducted to investigate the effect of solder bumps sizes on several surface finishes which are copper and Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) which is widely used in electronics packaging as surface finish for flip-chip application nowadays. In this research, field emission scanning electron microscopy (FESEM) analysis was conducted to analyze the morphology and composition of intermetallic compounds (IMCs) formed at the interface between the solder and UBM. The IMCs between the SAC lead-free solder with Cu surface finish after reflow were mainly (Cu, Ni) 6 Sn 5 and Cu 6 Sn 5 . While the main IMCs formed between lead-free solder on ENEPIG surface finish are (Ni, Cu) 3 Sn 4 and Ni 3 Sn 4 . The results from FESEM with energy dispersive x-ray (EDX) have revealed that isothermal aging at 150 degree Celsius has caused the thickening and coarsening of IMCs as well as changing them into more spherical shape. The thickness of the intermetallic compounds in both finishes investigated was found to be higher in solders with smaller bump size. From the experimental results, it also appears that the growth rate of IMCs is higher when soldering on copper compared to ENEPIG finish. Besides that, the results also showed that the thickness of intermetallic compounds was found to be proportional to isothermal aging duration. (author)

  20. Soldering formalism in noncommutative field theory: a brief note

    International Nuclear Information System (INIS)

    Ghosh, Subir

    2004-01-01

    In this Letter, I develop the soldering formalism in a new domain--the noncommutative planar field theories. The soldering mechanism fuses two distinct theories showing opposite or complimentary properties of some symmetry, taking into account the interference effects. The above mentioned symmetry is hidden in the composite (or soldered) theory. In the present work it is shown that a pair of noncommutative Maxwell-Chern-Simons theories, having opposite signs in their respective topological terms, can be consistently soldered to yield the Proca model (Maxwell theory with a mass term) with corrections that are at least quadratic in the noncommutativity parameter. We further argue that this model can be thought of as the noncommutative generalization of the Proca theory of ordinary spacetime. It is well known that abelian noncommutative gauge theory bears a close structural similarity with non-abelian gauge theory. This fact is manifested in a non-trivial way if the present Letter is compared with existing literature, where soldering of non-abelian models are discussed. Thus the present work further establishes the robustness of the soldering programme. The subtle role played by gauge invariance (or the lack of it), in the above soldering process, is revealed in an interesting way

  1. Utilization of Pb-free solders in MEMS packaging

    Science.gov (United States)

    Selvaduray, Guna S.

    2003-01-01

    Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

  2. Assessment of potential solder candidates for high temperature applications

    DEFF Research Database (Denmark)

    pressure to eliminate lead containing materials despite the fact that materials for high Pb containing alloys are currently not affected by any legislations. A tentative assessment was carried out to determine the potential solder candidates for high temperature applications based on the solidification...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

  3. Manipulation and soldering of carbon nanotubes using atomic force microscope

    International Nuclear Information System (INIS)

    Kashiwase, Yuta; Ikeda, Takayuki; Oya, Takahide; Ogino, Toshio

    2008-01-01

    Manipulation of carbon nanotubes (CNTs) by an atomic force microscope (AFM) and soldering of CNTs using Fe oxide nanoparticles are described. We succeeded to separate a CNT bundle into two CNTs or CNT bundles, to move the separated CNT to a desirable position, and to bind it to another bundle. For the accurate manipulation, load of the AFM cantilever and frequency of the scan were carefully selected. We soldered two CNTs using an Fe oxide nanoparticle prepared from a ferritin molecule. The adhesion forces between the soldered CNTs were examined by an AFM and it was found that the CNTs were bound, though the binding force was not strong

  4. Papers presented at the Fourteenth International conference on Plasma Physics and Controlled Nuclear Fusion Research. Organization International de la Energia Atomica Wuerzberg, Alemania 30 September - 7 October 1992

    International Nuclear Information System (INIS)

    1994-01-01

    This report contains the contributions of the CIEMAT's Fusion Unit to the 14th International Conference on Plasma Physics and Controlled Nuclear Fusion Research that was held by the International Atomic Energy Agency in Wuerzberg, Germany from 30 September to 7 October 1992. Three papers were presented that summarized the, main lines of work done in the Unit during the previous two years: The first one on the theoretical advances in the understanding of the Fexible Heliac TJ-II under construction, the second on the confinement studies performed in the operating TJ-I Tokamak and the third one on the description of the physical properties of the soon to be started TJ-IU Torsatron. (Author) 25 refs

  5. International conference on the strengthening of nuclear safety in Eastern Europe. Keynote papers. Regulatory aspects of NPP safety, status of safety improvements, status of safety analysis report

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1999-06-01

    The Objective of the Conference was to assess the past decade of nuclear safety efforts in countries operating WWER and RBMK nuclear reactors and to address remaining safety issues which require further work. A particular focus of the Conference was on international co-operation and assistance and where such efforts should be focused in the future. All Eastern European countries that operate RBMK or WWER reactors participated in the Conference, and presented papers on three key areas of nuclear safety: Regulatory Aspects of Nuclear Power Plant Safety; Status of Safety Improvements; and Status of Safety Analysis Reports. In addition, representatives from 18 additional countries that provide financial and/or technical assistance and co-operation in the area of WWER and RBMK safety offered the most extensive commentary. Key international (IAEA, World Association of Nuclear Operators, the Nuclear Energy Agency, the G-24 NUSAC, the European Commission, and the EBRD) organizations that provide nuclear safety assistance for WWER and RBMK reactors also made presentations. There is no question that considerable progress on nuclear safety has been made in Eastern Europe. Special mention should be made of successful efforts to strengthen the independence and technical competence of the nuclear regulatory authorities. Efforts should now concentrate on improving the depth and scope of the technical abilities of the regulatory authorities. More attention by governments is needed to ensure that the regulatory authorities have the financial resources and enforcement authority to fully execute their missions. In respect to the operators of the nuclear power plants, they have demonstrated clear progress in operational safety improvements. Significant additional efforts are required to maintain and enhance an effective safety culture. Design safety improvement programmes are in place in all countries. Implementation of these programmes has varied and is particularly affected by

  6. International conference on the strengthening of nuclear safety in Eastern Europe. Keynote papers. Regulatory aspects of NPP safety, status of safety improvements, status of safety analysis report

    International Nuclear Information System (INIS)

    1999-06-01

    The Objective of the Conference was to assess the past decade of nuclear safety efforts in countries operating WWER and RBMK nuclear reactors and to address remaining safety issues which require further work. A particular focus of the Conference was on international co-operation and assistance and where such efforts should be focused in the future. All Eastern European countries that operate RBMK or WWER reactors participated in the Conference, and presented papers on three key areas of nuclear safety: Regulatory Aspects of Nuclear Power Plant Safety; Status of Safety Improvements; and Status of Safety Analysis Reports. In addition, representatives from 18 additional countries that provide financial and/or technical assistance and co-operation in the area of WWER and RBMK safety offered the most extensive commentary. Key international (IAEA, World Association of Nuclear Operators, the Nuclear Energy Agency, the G-24 NUSAC, the European Commission, and the EBRD) organizations that provide nuclear safety assistance for WWER and RBMK reactors also made presentations. There is no question that considerable progress on nuclear safety has been made in Eastern Europe. Special mention should be made of successful efforts to strengthen the independence and technical competence of the nuclear regulatory authorities. Efforts should now concentrate on improving the depth and scope of the technical abilities of the regulatory authorities. More attention by governments is needed to ensure that the regulatory authorities have the financial resources and enforcement authority to fully execute their missions. In respect to the operators of the nuclear power plants, they have demonstrated clear progress in operational safety improvements. Significant additional efforts are required to maintain and enhance an effective safety culture. Design safety improvement programmes are in place in all countries. Implementation of these programmes has varied and is particularly affected by

  7. Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint.

    Science.gov (United States)

    Lee, Sang-Yeob; Lee, Jong-Hyuk

    2010-12-01

    The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

  8. Vision, Invention, Intervention: Celebrating Adult Education. Conference Proceedings. Papers from the Annual Conference of the Standing Conference on University Teaching and Research in the Education of Adults (25th, Winchester, England, United Kingdom, July 11-13, 1995).

    Science.gov (United States)

    Bryant, Ian, Ed.

    The papers in these proceedings include a number of themes such as enduring and progressive social change, good practice and positive outcomes, and strategies of survival, resistance and subversion. They are: "Achievement, Personal Development, and Positive Outcomes" (Viv Anderson); "Raising Standards" (Paul Armstrong);…

  9. Life cycle assessment (LCA of lead-free solders from the environmental protection aspect

    Directory of Open Access Journals (Sweden)

    Mitovski Aleksandra M.

    2009-01-01

    Full Text Available Life-cycle assessment (LCA presents a relatively new approach, which allows comprehensive environmental consequences analysis of a product system over its entire life. This analysis is increasingly being used in the industry, as a tool for investigation of the influence of the product system on the environment, and serves as a protection and prevention tool in ecological management. This method is used to predict possible influences of a certain material to the environment through different development stages of the material. In LCA, the product systems are evaluated on a functionally equivalent basis, which, in this case, was 1000 cubic centimeters of an alloy. Two of the LCA phases, life-cycle inventory (LCA and life-cycle impact assessment (LCIA, are needed to calculate the environmental impacts. Methodology of LCIA applied in this analysis aligns every input and output influence into 16 different categories, divided in two subcategories. The life-cycle assessment reaserch review of the leadfree solders Sn-Cu, SAC (Sn-Ag-Cu, BSA (Bi-Sb-Ag and SABC (Sn-Ag-Bi-Cu respectively, is given in this paper, from the environmental protection aspect starting from production, through application process and finally, reclamation at the end-of-life, i.e. recycling. There are several opportunities for reducing the overall environmental and human health impacts of solder used in electronics manufacturing based on the results of the LCA, such as: using secondary metals reclaimed through post-industrial recycling; power consumption reducing by replacing older, less efficient reflow assembly equipment, or by optimizing the current equipment to perform at the elevated temperatures required for lead-free soldering, etc. The LCA analysis was done comparatively in relation to widely used Sn-Pb solder material. Additionally, the impact factors of material consumption, energy use, water and air reserves, human health and ecotoxicity have been ALSO considered including

  10. Investigation of Sn-Pb solder bumps of prototype photo detectors for the LHCb experiment

    CERN Document Server

    Delsante, M L; Arnau-Izquierdo, G

    2004-01-01

    The Large Hadron Collider (LHC) is now under construction at the European Organization for Nuclear Research (CERN). LHCb is one of the dedicated LHC experiments, allowing high energy proton-proton collisions to be exploited. This paper presents the results of the metallurgic studies carried out on Sn-Pb solder bumps of prototype vacuum photo detectors under development for LHCb, and in particular for the ring imaging Cherenkov-hybrid photo diode (RICH-HPD) project. These detectors encapsulate, in a vacuum tube, an assembly made of two silicon chips bonded together by a matrix of solder bumps. Each bump lies on a suitable system of under-bump metallic layers ensuring mechanical and electrical transition between the chip pad and the solder alloy. During manufacturing of the detector, bump-bonded (BB) assemblies are exposed to severe heat cycles up to 400 degree C inducing, in the present fabrication process, a clear degradation of electrical connectivity. Several investigations such as microstructural observati...

  11. Multi-layer SiC ceramics/Mo joints brazed using high-temperature solders

    International Nuclear Information System (INIS)

    Olesinska, W.; Kesik, J.

    2003-01-01

    The paper presents the results of studies on joining SiC ceramics with molybdenum, with the ceramic surface being activated by titanium, chromium or copper. Titanium or chromium were deposited by the sputtering technique, and copper - by the electro-chemical method. The microstructures of the SiC/Mo joints brazed with the CuMn13Ni3 solder and copper in a nitrogen atmosphere were examined and the results discussed. The joints, in which the ceramic surface was activated in addition with chromium, do not contain mechanical defects caused by the joining process, and the ceramic surface is covered with a continuous layer of the solder. A phase analysis of the interface surface identified an MeSiC phase. The mechanical strength of the joints in which the ceramic surface was modified by the Ti, Cr and Cu layers was markedly greater than that of the joints brazed directly to the uncoated ceramics with the use of active solders. (author)

  12. Development of a soft-soldering system for aluminum

    Science.gov (United States)

    Falke, W. L.; Lee, A. Y.; Neumeier, L. A.

    1983-03-01

    The method employs application of a thin nickel copper alloy coating to the substrate, which enables the tin lead solders to wet readily and spread over the areas to be joined. The aluminum substrate is mechanically or chemically cleaned to facilitate bonding to a minute layer of zinc that is subsequently applied, with an electroless zincate solution. The nickel copper alloy (30 to 70 pct Ni) coating is then applied electrolytically over the zinc, using immersion cell or brush coating techniques. Development of acetate electrolytes has permitted deposition of the proper alloys coatings. The coated areas can then be readily joined with conventional tin lead solders and fluxs. The joints so formed are ductile, strong, and relatively corrosion resistant, and exhibit strengths equivalent to those formed on copper and brass when the same solders and fluxes are used. The method has also been employed to soft solder magnesium alloys.

  13. Development of gold based solder candidates for flip chip assembly

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

  14. Corporate environmental responsibility. Conference papers

    International Nuclear Information System (INIS)

    1992-01-01

    The European and U.S. industrial participants presented their environmental policies and programs. There is a difference of opinion between the European and U.S. industry representatives with regard to disclosure of environmental data. The coalition for Environmentally Responsible Economies (CERES) had played a role in the recent evolution of industry environmental programs, especially as they relate to environmental performance measurement, communication of environmental issues and concerns with shareholders and the public, and issues related to public accountability and disclosure. An overview of accomplishments is given and a common agenda is offered. (DG)

  15. Stochastic singular optics (Conference paper)

    CSIR Research Space (South Africa)

    Roux, FS

    2014-09-01

    Full Text Available The study of optical vortices in stochastic optical fields involves various quantities, including the vortex density and topological charge density, that are defined in terms of local expectation values of distributions of optical vortices...

  16. Characteristics of solder joints under fatigue loads using piezomechanical actuation

    Science.gov (United States)

    Shim, Dong-Jin; Spearing, S. Mark

    2003-07-01

    Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezo-ceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

  17. Laser Soldering of Rat Skin Using a Controlled Feedback System

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2009-03-01

    Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

  18. Tensile strength of two soldered alloys (Minalux and Verabond2

    Directory of Open Access Journals (Sweden)

    Mir Mohammad Rezaee S

    2002-07-01

    Full Text Available Recently. Minalux alloy, a base metal free from Be, has been presented on the market while no special soldering has been recommended for it. On the other hand, based on the manufacturer's claim, this alloy is similar to Verabond2. The aim of this study was to investigate the tensile strength of Minalux and Verabond2, soldered by Verasolder. Twelve standard dambble shape samples, with the length of 18 mm and the diameter of 3mm, were prepared from each alloy. Six samples of each alloy were divided into two pieces with carboradom disk. Soldering gap distance was 0.3mm, measured by a special jig and they were soldered by Verasolder alloy. Six other samples, of both Iranian and foreign unsoldered alloys were considered as control group. Then samples were examined under tensile force and their tensile strength was recorded. Two- way variance analysis showed that the tensile strength of Minalux alloy and Verabond2 were not statistically significant (Verasoler 686, Minalux 723, but after soldering, such difference became significant (Minalux 308, Verabond2 432. Verabond2 showed higher tensile strength after soldering.

  19. Features of Pd-Ni-Fe solder system for vacuum brazing of low alloy steels

    International Nuclear Information System (INIS)

    Radzievskij, V.N.; Kurochko, R.S.; Lotsmanov, S.N.; Rymar', V.I.

    1975-01-01

    The brazing solder of the Pd-Ni-Fe alloyed with copper and lithium, in order to decrease the melting point and provide for a better spreading, when soldered in vacuum ensures a uniform strength of soldered joints with the base metal of low-alloyed steels of 34KHNIM-type. The properties of low-alloyed steel joints brazed with the Pd-Ni-Fe-system solder little depend on the changes in the soldering parameters. The soldered joint keeps a homogeneous structure after all the stages of heat treatment (annealing, quenching and tempering)

  20. Lead-free solder technology transfer from ASE Americas

    Energy Technology Data Exchange (ETDEWEB)

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

  1. Three-dimensional (3D) visualization of reflow porosity and modeling of deformation in Pb-free solder joints

    International Nuclear Information System (INIS)

    Dudek, M.A.; Hunter, L.; Kranz, S.; Williams, J.J.; Lau, S.H.; Chawla, N.

    2010-01-01

    The volume, size, and dispersion of porosity in solder joints are known to affect mechanical performance and reliability. Most of the techniques used to characterize the three-dimensional (3D) nature of these defects are destructive. With the enhancements in high resolution computed tomography (CT), the detection limits of intrinsic microstructures have been significantly improved. Furthermore, the 3D microstructure of the material can be used in finite element models to understand their effect on microscopic deformation. In this paper we describe a technique utilizing high resolution (< 1 μm) X-ray tomography for the three-dimensional (3D) visualization of pores in Sn-3.9Ag-0.7Cu/Cu joints. The characteristics of reflow porosity, including volume fraction and distribution, were investigated for two reflow profiles. The size and distribution of porosity size were visualized in 3D for four different solder joints. In addition, the 3D virtual microstructure was incorporated into a finite element model to quantify the effect of voids on the lap shear behavior of a solder joint. The presence, size, and location of voids significantly increased the severity of strain localization at the solder/copper interface.

  2. Encuentro de Linguistica en el Noroeste (2nd, Hermosillo, Mexico, November 18-20, 1992). Memorias Tomos 1 y 2 (Conference on Linguistics in the Northwest [2nd, Hermosillo, Mexico, November 18-20, 1992]. Papers Volumes 1 and 2).

    Science.gov (United States)

    Sonora Univ. (Mexico), Dept. of Letters and Linguistics.

    Papers in these volumes were presented at a Mexican conference on linguistics. Most papers are in Spanish; the English translations of the titles include the following: "Directions in Contemporary Semantics" (L. Lara); "Regular Accentuation in Spanish" (C. Braithwaite); "Syntactic Order in Sonoran" (D. Brown); "Speech Datives or Interest/Not of…

  3. Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

    Directory of Open Access Journals (Sweden)

    Roman Koleňák

    2018-04-01

    Full Text Available The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In, in which the phases of titanium (Ti3In4 and silver (AgIn2 are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg6In5 and (AgCuIn2. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

  4. Proceedings 2014: Selected Papers from the Eighteenth College-Wide Conference for Students in Languages, Linguistics & Literature (18th, Honolulu, Hawai'i, April 26, 2014)

    Science.gov (United States)

    Leal, Priscila, Ed.; West, Gordon, Ed.

    2015-01-01

    The theme for this year's annual graduate student conference of the College of Languages, Linguistics, and Literature (LLL) was "Your Voice, My Voice: Literature, Language, Culture and Society." Translation and interpretation guided the theme for the conference, with Dr. Marvin Puakea Nogelmeier of the Kawaihuelani Center for Hawaiian…

  5. Proceedings 2015: Selected Papers from the Nineteenth College-Wide Conference for Students in Languages, Linguistics & Literature (19th, Honolulu, Hawai'i, April 18, 2015)

    Science.gov (United States)

    Aguirre, Samuel, Ed.; Plumb, Emily Gazda, Ed.; Martin, Kristyn, Ed.

    2016-01-01

    The theme for this year's annual Graduate Student Conference of the College of Languages, Linguistics and Literature (LLL) was "In a Word," which captured a basic component that runs through the College of LLL since words are essential to the work students do in each of the departments that form the College. The conference opened with a…

  6. Thermal decomposition of solder flux activators under simulated wave soldering conditions

    DEFF Research Database (Denmark)

    Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    /methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base...... titration method as a function of temperature, time of exposure and the substrate material used. Findings: The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL...

  7. Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

    Directory of Open Access Journals (Sweden)

    Molnar A.

    2017-06-01

    Full Text Available In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints’ lifetime.

  8. International Conference on the Safe and Secure Transport of Radioactive Material: The Next Fifty Years of Transport - Creating a Safe, Secure and Sustainable Framework. Papers and Presentations

    International Nuclear Information System (INIS)

    2011-01-01

    The objective of the conference is to encourage application of appropriate levels of safety and security during transport by: Promoting international discussion on the safety and security of radioactive material transport; Identifying and sharing best practices; Identifying issues and problems; Identifying opportunities, such as providing assistance, to support national adoption of comprehensive transport safety and security frameworks; Developing ideas for coordinating and enhancing transport safety and security. Scope of the Conference: Nuclear and other radioactive material in legal regulated transport (not illicit trafficking, smuggling, etc.); All modes of transport; Safety; Security; Domestic and international movements, including transit; Response to accidents and security events; Legislative and regulatory requirements and approaches; Practical issues such as transport logistics; Regional networks; and Information security and the need for transparency. The conference is not intended to cover the technical topics covered in the PATRAM conference (package design and analysis).

  9. EDITORIAL: Adaptive and active materials: Selected papers from the ASME 2011 Conference on Smart Materials, Adaptive Structures and Intelligent Systems (SMASIS 11) (Scottsdale, AZ, USA, 18-21 September 2011) Adaptive and active materials: Selected papers from the ASME 2011 Conference on Smart Materials, Adaptive Structures and Intelligent Systems (SMASIS 11) (Scottsdale, AZ, USA, 18-21 September 2011)

    Science.gov (United States)

    Brei, Diann

    2012-09-01

    The fourth annual meeting of the ASME/AIAA Smart Materials, Adaptive Structures and Intelligent Systems Conference (SMASIS) took place in sunny Scottsdale, Arizona. Each year we strive to grow and offer new experiences. This year we held a special Guest Symposium on Sustainability along with two focused topic tracks on energy harvesting and active composites to encourage cross-fertilization between these important fields and our community. This cross-disciplinary emphasis was reflected in keynote talks by Dr Wayne Brown, President and founder of Dynalloy, Inc., 'Cross-Discipline Sharing'; Dr Brad Allenby, Arizona State University, 'You Want the Future? You can't Handle the Future!'; and Professor Aditi Chattopadhyay, Arizona State University, 'A Multidisciplinary Approach to Structural Health Monitoring and Prognosis'. SMASIS continues to grow our community through both social and technical interchange. The conference location, the exotic Firesky Resort and Spa, exemplified the theme of our Guest Symposium on Sustainability, being the only Green Seal certified resort in Arizona, and highlighting four elements thought to represent all that exist: fire, water, earth and air. Several special events were held around this theme including the night at the oasis reception sponsored by General Motors, sustainability bingo, smart trivia and student networking lunches, and an Arizona pow-wow with a spectacular Indian hoop dance. Our student and young professional development continues to grow strong with best paper and hardware competitions, scavenger student outing and games night. We are very proud that our students and young professionals are always seeking out ways to give back to the community, including organizing outreach to local high school talent. We thank all of our sponsors who made these special events possible. We hope that these social events provided participants with the opportunity to expand their own personal community and broaden their horizons. Our

  10. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

  11. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

  12. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

  13. A Corrosion Investigation of Solder Candidates for High-Temperature Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Ambat, Rajan

    2009-01-01

    The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work...

  14. Damage Model for Reliability Assessment of Solder Joints in Wind Turbines

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    environmental factors. Reliability assessment for such type of products conventionally is performed by classical reliability techniques based on test data. Usually conventional reliability approaches are time and resource consuming activities. Thus in this paper we choose a physics of failure approach to define...... damage model by Miner’s rule. Our attention is focused on crack propagation in solder joints of electrical components due to the temperature loadings. Based on the proposed method it is described how to find the damage level for a given temperature loading profile. The proposed method is discussed...

  15. Influence of Co and W powders on viscosity of composite solders during soldering of specially shaped diamond-abrasive tools

    Science.gov (United States)

    Sokolov, E. G.; Aref’eva, S. A.; Svistun, L. I.

    2018-03-01

    The influence of Co and W powders on the structure and the viscosity of composite solders Sn-Cu-Co-W used for the manufacture of the specially shaped diamond tools has been studied. The solders were obtained by mixing the metallic powders with an organic binder. The mixtures with and without diamonds were applied to steel rollers and shaped substrates. The sintering was carried out in a vacuum at 820 ° C with time-exposure of 40 minutes. The influence of Co and W powders on the viscosity solders was evaluated on the basis of the study of structures and according to the results of sintering specially shaped diamond tools. It was found that to provide the necessary viscosity and to obtain the uniform diamond-containing layers on the complex shaped surfaces, Sn-Cu-Co-W solder should contain 27–35 vol % of solid phase. This is achieved with a total solder content of 24–32 wt % of cobalt powder and 7 wt % of tungsten powder.

  16. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  17. Automation of experimental research of waveguide paths induction soldering

    Science.gov (United States)

    Tynchenko, V. S.; Petrenko, V. E.; Kukartsev, V. V.; Tynchenko, V. V.; Antamoshkin, O. A.

    2018-05-01

    The article presents an automated system of experimental studies of the waveguide paths induction soldering process. The system is a part of additional software for a complex of automated control of the technological process of induction soldering of thin-walled waveguide paths from aluminum alloys, expanding its capabilities. The structure of the software product, the general appearance of the controls and the potential application possibilities are presented. The utility of the developed application by approbation in a series of field experiments was considered and justified. The application of the experimental research system makes it possible to improve the process under consideration, providing the possibility of fine-tuning the control regulators, as well as keeping the statistics of the soldering process in a convenient form for analysis.

  18. Optimization of the soldering process by the DMAIC methodology

    Directory of Open Access Journals (Sweden)

    Michał Zasadzień

    2016-06-01

    Full Text Available The chapter presents the use of the DMAIC method for the analysis and improvement of the process of soldering pins in a plug connecting a bundle of wires to the board of a controller; a part of the steering system of a car. The main problem in the soldering process, that is an unsatisfactory share of bad soldered connections between the board and the plug and the instability of that number, was identified by means of a five-phase improvement process. Key points and main causes of the defect were pointed out, and process improvement measures were suggested. Due to the analysis conducted and the correct implementation of improvement measures the share of defective connections has been decreased twofold.

  19. IFLA General Conference, 1984. Management and Technology Division. Section on Information Technology and Joint Meeting of the Round Table Audiovisual Media, the International Association for Sound Archives, and the International Association for Music Libraries. Papers.

    Science.gov (United States)

    International Federation of Library Associations, The Hague (Netherlands).

    Six papers on information technology, the development of information systems for Third World countries, handling of sound recordings, and library automation were presented at the 1984 IFLA conference. They include: (1) "Handling, Storage and Preservation of Sound Recordings under Tropical and Subtropical Climatic Conditions" (Dietrich…

  20. Organizing by covenant : the organization of transitional labor markets : paper IREC Conference 2004 'Governance issues in shifting industrial and employment relations' Utrecht, The Netherlands, August 26-28, 2004 : session potential and limits of national level socio-economic governance

    NARCIS (Netherlands)

    Korver, T.; Oeij, P.R.A.

    2004-01-01

    From 26-28 August 2004 in Utrecht the Industrial Relations in Europe Conference (IREC) was held on governance issues in shifting industrial and employment relations. As part of the session 'potential and limits of national level socio-economic governance' this paper about the organization of

  1. Language Policy in Canada: Current Issues. A Selection of the Proceedings of the Papers Dealing with Language Policy Issues in Canada at the Conference "Language Policy and Social Problems" (Curacao, Venezuela, December, 1983). Publication B-150.

    Science.gov (United States)

    Cobarrubias, Juan, Ed.

    The papers related to Canadian language policy at an international conference are presented: "Language Policy in Canada: Current Issues" (Juan Cobarrubias); "Multiculturalism and Language Policy in Canada" (Jim Cummins, Harold Troper); "Defining Language Policy in a Nationalistic Milieu and in a Complex Industrialized…

  2. Drinking Water Contamination Due To Lead-based Solder

    Science.gov (United States)

    Garcia, N.; Bartelt, E.; Cuff, K. E.

    2004-12-01

    The presence of lead in drinking water creates many health hazards. Exposure to lead-contaminated water can affect the brain, the central nervous system, blood cells, and kidneys, causing such problems as mental retardation, kidney disease, heart disease, stroke, and death. One way in which lead can contaminate our water supply is through the use of lead solder to join pipes. Lead solder was widely used in the past because of its ease of application as well as its low cost. Lead contamination in residential areas has previously been found to be a particularly serious problem in first-draw samples, of water that has sat stagnant in pipes overnight. To investigate the time-dependence of drinking water lead contamination, we analyzed samples taken hourly of water exposed to lead solder. While our preliminary data was insufficient to show more than a rough correlation between time of exposure and lead concentration over short periods (1-3 hours), we were able to confirm that overnight exposure of water to lead-based solder results in the presence high levels of lead. We also investigated other, external factors that previous research has indicated contribute to increased concentrations of lead. Our analysis of samples of lead-exposed water at various pH and temperatures suggests that these factors can be equally significant in terms of their contribution to elevated lead concentration levels. In particular, water that is slightly corrosive appears to severely impact the solubility of lead. As this type of water is common in much of the Northeast United States, the presence of lead-based solder in residential areas there is especially problematic. Although lead-based solder has been banned since the 1980s, it remains a serious concern, and a practical solution still requires further research.

  3. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan

    2017-08-10

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  4. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan; Zheng, Xiujun; Zhang, Hong; Zhang, Junli; Fu, Jiecai; Zhang, Qiang; Peng, Chaoyi; Bai, Feiming; Zhang, Xixiang; Peng, Yong

    2017-01-01

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  5. Thermomechanical behavior of tin-rich (lead-free) solders

    Science.gov (United States)

    Sidhu, Rajen Singh

    In order to adequately characterize the behavior of ball-grid-array (BGA) Pb-free solder spheres in electronic devices, the microstructure and thermomechanical behavior need to be studied. Microstructure characterization of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-3.9Ag-0.7Cu alloys was conducted using optical microscopy, scanning electron microscopy, transmission electron microscopy, image analysis, and a novel serial sectioning 3D reconstruction process. Microstructure-based finite-element method (FEM) modeling of deformation in Sn-3.5Ag alloy was conducted, and it will be shown that this technique is more accurate when compared to traditional unit cell models for simulating and understanding material behavior. The effect of cooling rate on microstructure and creep behavior of bulk Sn-rich solders was studied. The creep behavior was evaluated at 25, 95, and 120°C. Faster cooling rates were found to increase the creep strength of the solders due to refinement of the solder microstructure. The creep behavior of Sn-rich single solder spheres reflowed on Cu substrates was studied at 25, 60, 95, and 130°C. Testing was conducted using a microforce testing system, with lap-shear geometry samples. The solder joints displayed two distinct creep behaviors: (a) precipitation-strengthening (Sn-3.5Ag and Sn-3.9Ag-0.7Cu) and (b) power law creep accommodated by grain boundary sliding (GBS) (Sn and Sn-0.7Cu). The relationship between microstructural features (i.e. intermetallic particle size and spacing), stress exponents, threshold stress, and activation energies are discussed. The relationship between small-length scale creep behavior and bulk behavior is also addressed. To better understand the damage evolution in Sn-rich solder joints during thermal fatigue, the local damage will be correlated to the cyclic hysteresis behavior and crystal orientations present in the Sn phase of solder joints. FEM modeling will also be utilized to better understand the macroscopic and local

  6. White Paper Report of the 2010 RAD-AID Conference on International Radiology for Developing Countries: Identifying Sustainable Strategies for Imaging Services in the Developing World

    Science.gov (United States)

    Welling, Rodney D.; Azene, Ezana M.; Kalia, Vivek; Pongpirul, Krit; Starikovsky, Anna; Sydnor, Ryan; Lungren, Matthew P.; Johnson, Benjamin; Kimble, Cary; Wiktorek, Sarah; Drum, Tom; Short, Brad; Cooper, Justin; Khouri, Nagi F.; Mayo-Smith, William W.; Mahesh, Mahadevappa; Goldberg, Barry B.; Garra, Brian S.; DeStigter, Kristen K.; Lewin, Jonathan S.; Mollura, Daniel J.

    2015-01-01

    The 2010 RAD-AID Conference on International Radiology for Developing Countries was a multidisciplinary meeting to discuss data, experiences, and models pertaining to radiology in the developing world, where widespread shortages of imaging services reduce health care quality. The theme of this year’s conference was sustainability, with a focus on establishing and maintaining imaging services in resource-limited regions. Conference presenters and participants identified 4 important components of sustainability: (1) sustainable financing models for radiology development, (2) integration of radiology and public health, (3) sustainable clinical models and technology solutions for resource-limited regions, and (4) education and training of both developing and developed world health care personnel. PMID:21807349

  7. Conference summaries

    International Nuclear Information System (INIS)

    1983-01-01

    The papers presented at this conference cover the fields of thermalhydraulics, nuclear plant design and operation, licensing, decontamination, restoration and dismantling of nuclear power facilities, services to the nuclear industry, new applications of nuclear technology, reactor physics and fuel cycles, accelerator-breeders, fusion research and lasers

  8. Papers of the Canadian Institute's 3. annual conference on public relations for the energy industry : best practices for communication in volatile energy markets

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2004-07-01

    In recent years, the energy industry has been subjected to intense public scrutiny and has faced difficult years that have had a damaging effect on its reputation. The industry is now faced with the challenge of rebuilding public confidence and trust. This conference provides some of the tools needed for communications departments to succeed in rebuilding the image of the industry. The topics of discussion ranged from managing public perception, communication challenges regarding high energy prices, joint ventures, and social responsibility regarding environmental impacts. Strategies to prevent crisis situations were also described. The conference featured 13 presentations, of which 5 have been indexed separately for inclusion in this database. refs., tabs., figs.

  9. Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

    Energy Technology Data Exchange (ETDEWEB)

    Lucas, J.P.; Guo, F.; McDougall, J.; Bieler, T.R.; Subramanian, K.N.; Park, J.K.

    1999-11-01

    Creep deformation behavior was measured for 60--100 {micro}m thick solder joints. The solder joints investigated consisted of: (1) non-composite solder joints made with eutectic Sn-Ag solder, and (2) composite solder joints with eutectic Sn-Ag solder containing 20 vol.%, 5 {micro}m diameter in-situ Cu{sub 6}Sn{sub 5} intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.

  10. Influence of solder joint length to the mechanical aspect during the thermal stress analysis

    Science.gov (United States)

    Tan, J. S.; Khor, C. Y.; Rahim, Wan Mohd Faizal Wan Abd; Ishak, Muhammad Ikman; Rosli, M. U.; Jamalludin, Mohd Riduan; Zakaria, M. S.; Nawi, M. A. M.; Aziz, M. S. Abdul; Ani, F. Che

    2017-09-01

    Solder joint is an important interconnector in surface mount technology (SMT) assembly process. The real time stress, strain and displacement of the solder joint is difficult to observe and assess the experiment. To tackle these problems, simulation analysis was employed to study the von Mises stress, strain and displacement in the thermal stress analysis by using Finite element based software. In this study, a model of leadless electronic package was considered. The thermal stress analysis was performed to investigate the effect of the solder length to those mechanical aspects. The simulation results revealed that solder length gives significant effect to the maximum von Mises stress to the solder joint. Besides, changes in solder length also influence the displacement of the solder joint in the thermal environment. The increment of the solder length significantly reduces the von Mises stress and strain on the solder joint. Thus, the understanding of the physical parameter for solder joint is important for engineer prior to designing the solder joint of the electronic component.

  11. High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

    DEFF Research Database (Denmark)

    High-temperature solders have been widely used as joining materials to provide stable interconnections that resist a severe thermal environment and also to facilitate the drive for miniaturization. High-lead containing solders have been commonly used as high-temperature solders. The development...... of high-temperature lead-free solders has become an important issue for both the electronics and automobile industries because of the health and environmental concerns associated with lead usage. Unfortunately, limited choices are available as high-temperature lead-free solders. This work outlines...... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

  12. Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xia Yanghua [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)], E-mail: xia_yanghua@hotmail.com; Xie Xiaoming [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)

    2008-04-24

    The reliability of lead-free electronic assemblies under thermal cycling was investigated. Thin small outline package (TSOP) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) were studied. The results show that OSP finish reveals better performance than its ENIG counterparts. The crack originates at the fringe of heel fillet in both cases. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface. When the OSP finishes are employed, many Cu6Sn5 precipitates form inside the bulk solder and have a strengthening effect on the solder joint, resulting in better reliability performance as compared to those with ENIG finishes.

  13. Soldering and brazing safety guide: A handbook on space practice for those involved in soldering and brazing

    Science.gov (United States)

    This manual provides those involved in welding and brazing with effective safety procedures for use in performance of their jobs. Hazards exist in four types of general soldering and brazing processes: (1) cleaning; (2) application of flux; (3) application of heat and filler metal; and (4) residue cleaning. Most hazards during those operations can be avoided by using care, proper ventilation, protective clothing and equipment. Specific process hazards for various methods of brazing and soldering are treated. Methods to check ventilation are presented as well as a check of personal hygiene and good maintenance practices are stressed. Several emergency first aid treatments are described.

  14. Conference summaries

    International Nuclear Information System (INIS)

    1987-01-01

    This volume contains summaries of 28 papers presented at the 27. conference of the Canadian Nuclear Association. These papers discuss the general situation of the Canadian nuclear industry and the CANDU reactor; dialogue with the public; the International Atomic Energy Agency; and economic goals and operating lessons. It also contains summaries of 70 papers presented at the 8. conference of the Canadian Nuclear Society, which discuss plant life extension; safety and the environment; reactor physics; thermalhydraulics; risk assessment; the CANDU spacer location and repositioning project; CANDU operations; safety research after Chernobyl; fuel channels; and nuclear technology developments. The individual papers are also available in INIS-mf--13673 (CNA), and INIS-mf--12909 (CNS). (L.L.)

  15. Contemporary Elementary and Middle School Physical Education Conference (Georgia State University, Atlanta, Georgia, January 15-17, 1981). Proceedings, Saturday, Activity and Position Paper Sessions.

    Science.gov (United States)

    Jones, Margaret A., Ed.

    At the final session of the January conference on Contemporary Elementary and Middle School Physical Education, 40 discussions and workshops centered on physical fitness, health, safety, and adapting athletics for the disabled child. Other topics covered were creative dance, water activities, lifetime sports, and teacher resource materials and…

  16. Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module

    International Nuclear Information System (INIS)

    Barbagallo, C; Petrone, G; Cammarata, G; Malgioglio, G L

    2017-01-01

    For power devices, the reliability of thermal fatigue induced by thermal cycling has been prioritized as an important concern. The main target of this work is to apply a numerical procedure to assess the fatigue life for lead-free solder joints, that represent, in general, the weakest part of the electronic modules. Starting from a real multi-chip power module, FE-based models were built-up by considering different conditions in model implementation in order to simulate, from one hand, the worst working condition for the module and, from another one, the module standing into a climatic test room performing thermal cycles. Simulations were carried-out both in steady and transient conditions in order to estimate the module thermal maps, the stress-strain distributions, the effective plastic strain distributions and finally to assess the number of cycles to failure of the constitutive solder layers. (paper)

  17. Mendel conference

    CERN Document Server

    2015-01-01

    This book is a collection of selected accepted papers of Mendel conference that has been held in Brno, Czech Republic in June 2015. The book contents three chapters which represent recent advances in soft computing including intelligent image processing and bio-inspired robotics.: Chapter 1: Evolutionary Computing, and Swarm intelligence, Chapter 2: Neural Networks, Self-organization, and Machine Learning, and Chapter3: Intelligent Image Processing, and Bio-inspired Robotics. The Mendel conference was established in 1995, and it carries the name of the scientist and Augustinian priest Gregor J. Mendel who discovered the famous Laws of Heredity. In 2015 we are commemorating 150 years since Mendel's lectures, which he presented in Brno on February and March 1865. The main aim of the conference was to create a periodical possibility for students, academics and researchers to exchange their ideas and novel research methods.  .

  18. Horizon shells and BMS-like soldering transformations

    Energy Technology Data Exchange (ETDEWEB)

    Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)

    2016-03-07

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  19. Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints

    International Nuclear Information System (INIS)

    Liu, X.W.; Plumbridge, W.J.

    2003-01-01

    The fatigue of Sn-37 wt.% Pb model solder joints has been investigated under thermomechanical and thermal cycling. Based upon an analysis of displacements during thermomechancial cycling, a model solder joint has been designed to simulate actual joints in electronic packages. The strain-stress relationship, characterised by hysteresis loops, was determined during cycling from 30 to 125 deg. C, and the stress-range monitored throughout. The number of cycles to failure, as defined by the fall in stress range, was correlated to strain range and strain energy. The strain hardening exponent, k, varied with the definition of failure and, when a stress-range drop of 50% was used, it was 0.46. Cracks were produced during pure thermal cycling without external strains applied. These arose due to the local strains caused by thermal expansion mismatches between the solder and Cu 6 Sn 5 intermetallic layer, between the phases of solder, and due to the anisotropy of the materials. The fatigue life under thermomechanical cycling was significantly inferior to that obtained in isothermal mechanical cycling. A factor contributing to this inferiority is the internal damage produced during temperature cycling

  20. Soluble Lead and Bismuth Chalcogenidometallates: Versatile Solders for Thermoelectric Materials

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Hao [Department; Son, Jae Sung [Department; School; Dolzhnikov, Dmitriy S. [Department; Filatov, Alexander S. [Department; Hazarika, Abhijit [Department; Wang, Yuanyuan [Department; Hudson, Margaret H. [Department; Sun, Cheng-Jun [Advanced; Chattopadhyay, Soma [Physical; Talapin, Dmitri V. [Department; Center

    2017-07-27

    Here we report the syntheses of largely unexplored lead and bismuth chalcogenidometallates in the solution phase. Using N2H4 as the solvent, new compounds such as K6Pb3Te6·7N2H4 were obtained. These soluble molecular compounds underwent cation exchange processes using resin chemistry, replacing Na+ or K+ by decomposable N2H5+ or tetraethylammonium cations. They also transformed into stoichiometric lead and bismuth chalcogenide nanomaterials with the addition of metal salts. Such a versatile chemistry led to a variety of composition-matched solders to join lead and bismuth chalcogenides and tune their charge transport properties at the grain boundaries. Solution-processed thin films composed of Bi0.5Sb1.5Te3 microparticles soldered by (N2H5)6Bi0.5Sb1.5Te6 exhibited thermoelectric power factors (~28 μW/cm K2) comparable to those in vacuum-deposited Bi0.5Sb1.5Te3 films. The soldering effect can also be integrated with attractive fabrication techniques for thermoelectric modules, such as screen printing, suggesting the potential of these solders in the rational design of printable and moldable thermoelectrics.

  1. Effects of PCB thickness on adjustable fountain wave soldering

    Indian Academy of Sciences (India)

    hybrid circuit assembly, component lead tinning, and wire tinning. .... The mesh model was built and optimized with 599920 hybrid nodes as shown in figure 9. ... conducted to track the fluid motions of the two phases (i.e., molten solder and air).

  2. Papers of a Canadian Institute conference : Tapping into new opportunities in oil sands supply and infrastructure : natural gas, diluent, pipelines, cogeneration

    International Nuclear Information System (INIS)

    2003-01-01

    Participants at this conference were provided the opportunity to hear various views of several industry leaders on topics related to oil sands supply and infrastructure. Some of the issues addressed were: the latest project developments and pipeline infrastructure expansion initiatives in the oil sands industry; the growing natural gas supply requirements for oil sands production; how to effectively manage stakeholder issues in the context of rapid growth; an update on the supply and demand balance for diluent; demand for cogeneration and the implications of transmission system congestion; and, market development prospects for heavy crude and the need for additional refinery capacity. The Minister of Alberta Economic Development also made a special presentation. There were fifteen presentations made at the conference, of which nine were indexed separately for inclusion in this database. refs., tabs., figs

  3. Man as a safety element in the operation of a nuclear power plant. IAEA international conference on man-machine interface in the nuclear industry - review paper

    International Nuclear Information System (INIS)

    Ikegame, R.

    1988-01-01

    Nuclear power generation has been steadily developing worldwide and is now playing a very important part in total energy supply. In order to further promote nuclear power generation harmoniously, it is essential to secure the trust of the public by keeping safe and stable operation and to make constant efforts not to repeat such severe accidents as TMI and Chernobyl. These two accidents have caused us to recognize the substantial importance of the Man-Machine interface. With this as a background, the International Conference on the Man-Machine Interface in the Nuclear Industry was held in Tokyo for four days from February 15 th 1988, organized by IAEA and in cooperation with OECD/NEA as well as CEC. I would like to review this conference, for which I was the Vice Chairman of the Japanese Organizing Committee, and to explain my opinion about this issue

  4. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Directory of Open Access Journals (Sweden)

    Yee Mei Leong

    2016-06-01

    Full Text Available Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag content solder SAC105 (Sn-1.0Ag-0.5Cu because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al addition (0.1–0.5 wt.% to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

  5. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Science.gov (United States)

    Leong, Yee Mei; Haseeb, A.S.M.A.

    2016-01-01

    Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

  6. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Haiyan [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Peng, Jianke [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Fu, Li, E-mail: fuli@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Wang, Xincheng [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Xie, Yan [School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China)

    2016-04-15

    Graphical abstract: - Highlights: • The wetting angle of lead free solder on Cu was reduced by surface microstructure. • The wetting form of Sn-Ag-Cu solder on Cu was “non-composite surface”. • The experimental results had a sound fit with the theoretical calculation. - Abstract: In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  7. Effects of soldering methods on tensile strength of a gold-palladium metal ceramic alloy.

    Science.gov (United States)

    Ghadhanfari, Husain A; Khajah, Hasan M; Monaco, Edward A; Kim, Hyeongil

    2014-10-01

    The tensile strength obtained by conventional postceramic application soldering and laser postceramic welding may require more energy than microwave postceramic soldering, which could provide similar tensile strength values. The purpose of the study was to compare the tensile strength obtained by microwave postceramic soldering, conventional postceramic soldering, and laser postceramic welding. A gold-palladium metal ceramic alloy and gold-based solder were used in this study. Twenty-seven wax specimens were cast in gold-palladium noble metal and divided into 4 groups: laser welding with a specific postfiller noble metal, microwave soldering with a postceramic solder, conventional soldering with the same postceramic solder used in the microwave soldering group, and a nonsectioned control group. All the specimens were heat treated to simulate a normal porcelain sintering sequence. An Instron Universal Testing Machine was used to measure the tensile strength for the 4 groups. The means were analyzed statistically with 1-way ANOVA. The surface and fracture sites of the specimens were subjectively evaluated for fracture type and porosities by using a scanning electron microscope. The mean (standard deviation) ultimate tensile strength values were as follows: nonsectioned control 818 ±30 MPa, microwave 516 ±34 MPa, conventional 454 ±37 MPa, and laser weld 191 ±39 MPa. A 1-way ANOVA showed a significant difference in ultimate tensile strength among the groups (F3,23=334.5; Ptensile strength for gold and palladium noble metals than either conventional soldering or laser welding. Conventional soldering resulted in a higher tensile strength than laser welding. Under the experimental conditions described, either microwave or conventional postceramic soldering would appear to satisfy clinical requirements related to tensile strength. Copyright © 2014 Editorial Council for the Journal of Prosthetic Dentistry. Published by Elsevier Inc. All rights reserved.

  8. Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

    Science.gov (United States)

    Huang, Chien-Sheng; Jang, Guh-Yaw; Duh, Jenq-Gong

    2004-04-01

    Nickel-based under bump metallization (UBM) has been widely used as a diffusion barrier to prevent the rapid reaction between the Cu conductor and Sn-based solders. In this study, joints with and without solder after heat treatments were employed to evaluate the diffusion behavior of Cu in the 63Sn-37Pb/Ni/Cu/Ti/Si3N4/Si multilayer structure. The atomic flux of Cu diffused through Ni was evaluated from the concentration profiles of Cu in solder joints. During reflow, the atomic flux of Cu was on the order of 1015-1016 atoms/cm2s. However, in the assembly without solder, no Cu was detected on the surface of Ni even after ten cycles of reflow. The diffusion behavior of Cu during heat treatments was studied, and the soldering-process-induced Cu diffusion through Ni metallization was characterized. In addition, the effect of Cu content in the solder near the solder/intermetallic compound (IMC) interface on interfacial reactions between the solder and the Ni/Cu UBM was also discussed. It is evident that the (Cu,Ni)6Sn5 IMC might form as the concentration of Cu in the Sn-Cu-Ni alloy exceeds 0.6 wt.%.

  9. Conference summaries. Canadian Nuclear Association 29. annual conference; Canadian Nuclear Society 10. annual conference

    International Nuclear Information System (INIS)

    1989-01-01

    Separate abstracts were prepared for 15 papers from the twenty-ninth Annual Conference of the Canadian Nuclear Association. Abstracts were also prepared for the 102 papers from the tenth Annual Conference of the Canadian Nuclear Society

  10. Conference summaries. Canadian Nuclear Association 29. annual conference; Canadian Nuclear Society 10. annual conference

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1990-12-31

    Separate abstracts were prepared for 15 papers from the twenty-ninth Annual Conference of the Canadian Nuclear Association. Abstracts were also prepared for the 102 papers from the tenth Annual Conference of the Canadian Nuclear Society.

  11. Economical surface treatment of die casting dies to prevent soldering in high pressure casting

    International Nuclear Information System (INIS)

    Fraser, D.T.; Jahedi, M.Z.

    2001-01-01

    This paper describes the use of a gas oxidation treatment of H13 tool steel to develop a compact iron oxide layer at the surface of core pins to prevent soldering in high pressure die casting. The performance of oxide layers in the protection of die steel against soldering during high pressure die casting was tested in a specially designed die using removable core pins and Al-11 Si-3 Cu casting alloy. The gas oxidation treatment can be applied at low temperatures and to large areas of the die surface. In addition this process is very cost effective compared to other coating processes such as physical vapour deposition (PVD), or thermo-reactive diffusion (TRD) coatings. This work demonstrated that surface treatment producing pure magnetite (Fe 3 O 4 ) layers are more protective than oxide layers containing a combination of Fe 3 O 4 (magnetite) and Fe 3 O 3 (haematite). The magnetite layer acts as a barrier between the die steel/casting alloy interface and prevents the formation of inter-metallic phases. Optical microscopy and scanning electron microscope were used to determine the thickness of the oxide layer, while X-ray diffraction was performed to determine the oxide phase structure

  12. White paper report from working groups attending the international conference on research and educational opportunities in bio-fuel crop production

    Energy Technology Data Exchange (ETDEWEB)

    Morgan, K.T. [University of Florida, Soil and Water Science Dep., Southwest Florida Res. and Educ. Center, Immokalee, FL 34142 (United States); Gilbert, R.A. [University of Florida, Agronomy Dep., Everglades Res. and Educ. Center, Belle Glade, FL 33430 (United States); Helsel, Z.A. [Rutgers University, Plant Biology and Pathology Dep., New Brunswick, NJ 08901-8520 (United States); Buacum, L. [University of Florida, Hendry County Extension, LaBelle, FL 33935 (United States); Leon, R.; Perret, J. [EARTH University, Apto. 4442-1000, San Jose (Costa Rica)

    2010-12-15

    A conference on current research and educational programs in production of crops for bio-fuel was sponsored and organized by the EARTH University and the University of Florida in November, 2008. The meeting addressed current research on crops for bio-fuel production with discussions of research alternatives for future crop production systems, land use issues, ethics of food vs. fuel production, and carbon sequestration in environmentally sensitive tropical and sub-tropical regions of the Americas. The need and potential for development of graduate and undergraduate curricula and inter-institutional cooperation among educational institutions in the region were also discussed. Delegations from Belize, Brazil, Columbia, Costa Rica, Cuba, Honduras, Panama, The Dominican Republic, and the United States including ministers of Agriculture and Energy attended this meeting. Over a two-day period, four working groups provided a framework to facilitate networking, motivate task oriented creative thinking, and maintain a timely accomplishment of assigned duties in the context of the conference themes. Participants in the conference were assigned to one of four working groups, each following given topics: Agronomy, Environment, Socio-Economics and Education/Extension. It was the consensus of representatives of industry, academic and regulatory community assembled in Costa Rica that significant research, education and socio-economic information is needed to make production of bio-fuel crops sustainable. Agronomic research should include better crop selection based on local conditions, improved production techniques, pest and disease management, and mechanical cultivation and harvesting. Another conclusion was that tailoring of production systems to local soil characteristics and use of bio-fuel by-products to improve nutrient use efficiency and reduction of environmental impact on water quantity and quality is critical to sustainability of bio-fuel crop production. (author)

  13. The metallurgical approach on the solder voids behaviour in surface mount devices

    International Nuclear Information System (INIS)

    Mohabattul Zaman Bukhari

    1996-01-01

    Solder voids are believed to cause poor heat dissiption in the Surface Mount devices and reduce the reliability of the devices at higher operating services. There are a lot of factors involved in creating voids such as gas/flux entrapment, wettability, outgasseous, air bubbles in the solder paste, inconsistency of solder coverage and improper metal scheme selection. This study was done to observe the behaviour of the solder voids in term of flux entrapmentt and wettability. It is believed that flux entrapment and wettability are verify this hypothesis. Two types of metal scheme were chosen which are Nickel (Ni) plated and Tin (Sn) plated heatsink. X-ray techniques such as Radiographic Inspection Analysis and EDAX were used to detect the minute solder voids. The solder voids observed on the heatsinks and Copper shims after the reflow process are believed to be a non contact voids that resulted from some portion of the surface not wetting properly

  14. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    Science.gov (United States)

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

    2010-09-15

    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  15. EDITORIAL Smart materials, multifunctional composites, and morphing structures: selected papers from the 20th International Conference on Adaptive Structures and Technologies (ICAST 2009) Smart materials, multifunctional composites, and morphing structures: selected papers from the 20th International Conference on Adaptive Structures and Technologies (ICAST 2009)

    Science.gov (United States)

    Liao, Wei-Hsin

    2010-12-01

    The 20th International Conference on Adaptive Structures and Technologies (ICAST) was held on 20-22 October 2009 in Hong Kong. This special section of Smart Materials and Structures is derived from the research papers presented at the conference. Of the 106 papers presented at the conference, 11 papers were reviewed and accepted for this special section, following the regular review procedures of the journal. This special section is focused on smart materials, multifunctional composites, and applications on morphing structures. Smart materials. Smart materials are the foundation of adaptive structures and intelligent systems. The development of new materials will lead to significant improvement in various applications. Three articles are focused on the fabrication of new materials and investigation of their behaviors: Barium strontium zirconate titanate ((Ba1-xSrx)(ZrxTi1-x)O3; BSZT, x = 0.25 and 0.75) ceramics with a highly crystalline structure were fabricated using the combustion technique. The microstructure of BSZT powders exhibited an almost-spherical morphology and had a porous agglomerated form. Polyaniline (PANI)/clay nanoparticles with unique core-shell structure were synthesized via Pickering emulsion polymerization. By dispersing PANI/clay nanoparticles in silicone oil, the ER fluid was made. Magnetic field effects were investigated on the deposition rate and surface morphology of chromium nitride coatings deposited by magnetron sputtering for superior hardness, excellent wear and oxidation resistance. The surface morphology of chromium nitride films was also examined by a scanning electron microscope (SEM). Multifunctional composites. Composites are made from two or more constituent materials so they can combine the best properties of different materials. Five papers deal with fabrication, testing, and modeling of various multifunctional composites: A new active structural fiber (ASF) was fabricated by coating a single carbon fiber with a concentric

  16. International conference on the safety and security of radioactive sources: Towards a global system for the continuous control of sources throughout their life cycle. Contributed papers

    International Nuclear Information System (INIS)

    2005-01-01

    The objective of the conference is to promote a wide exchange of information on key issues relating to the safety and security of radioactive sources, including: drawing up an inventory; finding a solution without delay to situations resulting from past activities; preparing for the future by defining a global cooperative approach to the continuous control of radioactive sources during their life cycle. It is expected that the conference will foster a better understanding of the risks posed by these sources from the point of view of radiation safety and the threat associated with some of them in the event of malevolent use, and will help in finding ways of reducing the likelihood of the occurrence of a radiological incident or accident, or of a malevolent act. It is also expected to identify the preparedness and response measures that are necessary and to facilitate a common understanding on the feasibility of creating a sustainable global system for ensuring the safety and security of radioactive sources

  17. Papers of a Canadian Institute conference on generation adequacy in Ontario : essential updates on the state of generation capacity and the latest efforts to solve the supply crunch

    International Nuclear Information System (INIS)

    2004-01-01

    The issue of power generation and supply in Ontario was addressed at this conference which provided critical information on power supply and the Ontario government's plans for easing the power supply crisis. The state of existing generation assets and the feasibility of potential supply additions were also discussed. Specific issues such as pricing regulations, as well as broader issues such as market conditions and current energy policies were assessed. Planning, investment and issues such as demand-side management were discussed. The role of government, directions for the future, and the phasing out of coal power plants were important focal points. Nuclear power, water power and the search for reliable sources of supply were examined, including the possibility of importing hydro electricity. In addition, key objectives such as clean air strategies and the development of a renewable energy strategy were discussed and various options were identified. The conference featured 24 presentations, of which 8 have been catalogued separately for inclusion in this database. refs., tabs., figs

  18. International conference on the safety and security of radioactive sources: Towards a global system for the continuous control of sources throughout their life cycle. Contributed papers

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2005-07-01

    The objective of the conference is to promote a wide exchange of information on key issues relating to the safety and security of radioactive sources, including: drawing up an inventory; finding a solution without delay to situations resulting from past activities; preparing for the future by defining a global cooperative approach to the continuous control of radioactive sources during their life cycle. It is expected that the conference will foster a better understanding of the risks posed by these sources from the point of view of radiation safety and the threat associated with some of them in the event of malevolent use, and will help in finding ways of reducing the likelihood of the occurrence of a radiological incident or accident, or of a malevolent act. It is also expected to identify the preparedness and response measures that are necessary and to facilitate a common understanding on the feasibility of creating a sustainable global system for ensuring the safety and security of radioactive sources.

  19. 3. International Conference on Nuclear Power Plant Life Management (PLiM) for Long Term Operations (LTO). Keynotes, papers, presentations, posters

    International Nuclear Information System (INIS)

    2012-01-01

    The world's fleet of nuclear power plants is, on average, more than 20 years old. Even though the design life of a nuclear power plant is typically 30-40 years, many plants will operate in excess of their design lives, provided that nuclear power plant engineers demonstrate by analysis, equipment and system upgrades, increased vigilance, testing and ageing management that the plant will operate safely. In the operation of nuclear power plants, safety should always be the prime consideration. Plant operators and regulators must always ensure that plant safety is maintained and, where possible, enhanced during its operating lifetime. Nuclear power plant life management (PLiM) has gained increased attention over the past decade, and effective ageing management of systems, structures and components (SSCs) is a key element in PLiM for the safe and reliable long term operation of nuclear power plants. A PLiM programme is an effective tool that allows an operator to safely and cost effectively manage ageing effects in SSCs for long term operation (LTO). A PLiM programme helps facilitate decisions concerning when and how to repair, replace or modify SSCs in an economically optimized way, while assuring that a high level of safety is maintained. The option for extended nuclear power plant operation has been recognized by operators and regulators alike, as evidenced in the number of licence renewal programmes that are being developed by Member States. After the severe accident at the Fukushima Daiichi nuclear power plant, the safe operation of nuclear power plants has become even more important; not only in terms of technical or ageing issues, but also in terms of management system and qualified workforce related issues. Application of an integrated management system and structured workforce planning are needed throughout the plant life in order to ensure effective plant organization and management. The IAEA organized the first and second International Conference on Nuclear

  20. Interfacial reaction of Sn-based solder joint in the package system

    Science.gov (United States)

    Gu, Huandi

    In this thesis, I report a study on the effect of the solder size on intermetallic layer formation by comparing the morphology change and growth rate of two different size solder joint aged at a same temperature for different aging time. The layer thickness and microstructure were analyzed using scanning electron microscopy (SEM). Photoshop was used to measure the thickness of intermetallic compound. Two different size of solder joints with composition of Sn-Ag-Cu (305) were used.

  1. Laser tissue welding mediated with a protein solder

    Science.gov (United States)

    Small, Ward, IV; Heredia, Nicholas J.; Celliers, Peter M.; Da Silva, Luiz B.; Eder, David C.; Glinsky, Michael E.; London, Richard A.; Maitland, Duncan J.; Matthews, Dennis L.; Soltz, Barbara A.

    1996-05-01

    A study of laser tissue welding mediated with an indocyanine green dye-enhanced protein solder was performed. Freshly obtained sections of porcine artery were used for the experiments. Sample arterial wall thickness ranged from two to three millimeters. Incisions approximately four millimeters in length were treated using an 805 nanometer continuous- wave diode laser coupled to a one millimeter diameter fiber. Controlled parameters included the power delivered by the laser, the duration of the welding process, and the concentration of dye in the solder. A two-color infrared detection system was constructed to monitor the surface temperatures achieved at the weld site. Burst pressure measurements were made to quantify the strengths of the welds immediately following completion of the welding procedure.

  2. Quality Analysis of Welded and Soldered Joints of Cu-Nb Microcomposite Wires

    Directory of Open Access Journals (Sweden)

    Nikolaj VIŠNIAKOV

    2011-03-01

    Full Text Available Quality analysis of welded and soldered joints of Cu-Nb microcomposite wires has been performed. Quality and mechanical characteristics of joints as ultimate tensile stress limit and elongation at break were measured with an universal testing machine and controlled visually using an optical microscope. Two wires joints were soldered with silver and copper solders and put into steel and copper sleeve respectively. Another two wires joints were soldered with silver solder and welded without any reinforcement. Joints soldered with the silver solder and steel sleeve have demonstrated the best mechanical characteristics: ultimate tensile stress limit of 650 MPa and elongation at break of 0.85 %. Joints soldered with the copper sleeve have no advantages comparing with the soldered butt joint. Ultimate tensile stress limit and elongation at break were in 300 MPa - 350 MPa and in 0.35 % - 0.45 % ranges respectively. Two welded joints had ultimate tensile stress limit of 470 MPa and elongation at break of 0.71 %. In all joints the microstructure of Nb filaments was destroyed and mechanical properties have been specified by mechanical strength of copper and sleeve materials only.http://dx.doi.org/10.5755/j01.ms.17.1.242

  3. Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Kita, T; Mukaibo, N; Ando, K; Moriyama, M [Honda R and D Co. Ltd., Tokyo (Japan)

    1997-10-01

    Concerning the tin and lead eutectic solder, we have evaluated the reliability of three factors of intermetallic compound layer, creep and vibration which cause solder degradation. First, the stress factor was extracted from investigating the mechanism of degradation, and the best acceleration test method was fixed. Next, the acceleration test was executed to find the stress dependency and the tendency of solder degradation was modeled numerically. While the environmental stress frequency was obtained and they were put together by using a minor method, which enabled us to predict the life span of solder on the market with precision. 5 refs., 13 figs.

  4. The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder

    Science.gov (United States)

    Mayappan, R.; Salleh, A.; Andas, J.

    2017-09-01

    Solder has been widely used in electronic industry as interconnection for electronic packaging. European Union and Japan have restricted the use of Sn-Pb solder as it contains lead which can harmful to human health and environment. Due to this, many researches have been done in order to find a suitable replacement for the lead solder. Although many lead-free solders are available, the Sn-3.5Ag solder with the addition of graphene seem to be a suitable candidate. In this study, a 0.07 wt% graphene nanosheet was added into the Sn-3.5Ag solder and this composite solder was prepared under powder metallurgy method. The solder was reacted with copper substrate at 250 °C for one minute. For joint strength analysis, two copper strips were soldered together. The solder joint was aged at temperature 100 °C for 500 hours. Scanning Electron Microscope (SEM) was used to observe the interfacial reaction and Instron machine was used to determine the joint strength. Cu6Sn5 intermetallic layer was formed at the interface between the Cu substrate and the solders. Composite solder showed the retardation of the intermetallic growth compared to the plain solder. The thickness value of the intermetallic was used to calculate the growth rate the IMC. The graphene nanosheets added solder has lower growth rate which is 3.86 × 10-15 cm2/s compared to the plain solder 7.15 × 10-15 cm2/s. Shear strength analysis show that the composite solder has higher joint compared to the plain solder.

  5. Adaptive and active materials: selected papers from the ASME 2013 Conference on Smart Materials, Adaptive Structures and Intelligent Systems (SMASIS 13) (Snowbird, UT, USA, 16-18 September 2013)

    Science.gov (United States)

    Johnson, Nancy; Naguib, Hani; Turner, Travis; Anderson, Iain; Bassiri-Gharb, Nazanin; Daqaq, Mohammed; Baba Sundaresan, Vishnu; Sarles, Andy

    2014-10-01

    The sixth annual meeting of the ASME Smart Materials, Adaptive Structures and Intelligent Systems Conference (SMASIS) was held in the beautiful mountain encircled Snowbird Resort and Conference Center in Little Cottonwood Canyon near Salt Lake City, Utah. It is the conference's objective to provide an up-to-date overview of research trends in the entire field of smart materials systems in a friendly casual forum conducive to the exchange of ideas and latest results. As each year we strive to grow and offer new experiences, this year we included special focused topic tracks on nanoscale multiferroic materials and origami engineering. The cross-disciplinary emphasis was reflected in keynote speeches by Professor Kaushik Bhattacharya (California Institute of Technology) on 'Cyclic Deformation and the Interplay between Phase Transformation and Plasticity in Shape Memory Alloys', by Professor Alison Flatau (University of Maryland at College Park) on 'Structural Magnetostrictive Alloys: The Other Smart Material', and by Dr Leslie Momoda (Director of the Sensors and Materials Laboratories, HRL Laboratories, LLC, Malibu, CA) on 'Architecturing New Functional Materials: An Industrial Perspective'. SMASIS 2013 was divided into seven symposia which span basic research, applied technological design and development, and industrial and governmental integrated system and application demonstrations. SYMP 1. Development and Characterization of Multifunctional Materials. SYMP 2. Mechanics and Behavior of Active Materials. SYMP 3. Modeling, Simulation and Control of Adaptive Systems. SYMP 4. Integrated System Design and Implementation. SYMP 5. Structural Health Monitoring. SYMP 6. Bioinspired Smart Materials and Systems. SYMP 7. Energy Harvesting. Authors of selected papers in the materials areas (symposia 1, 2, and 6) as well as energy harvesting (symposium 7) were invited to write a full journal article on their presentation topic for publication in this special issue of Smart

  6. Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

    Directory of Open Access Journals (Sweden)

    Saliza Azlina O.

    2016-01-01

    Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

  7. Laser beam soldering of micro-optical components

    Science.gov (United States)

    Eberhardt, R.

    2003-05-01

    MOTIVATION Ongoing miniaturisation and higher requirements within optical assemblies and the processing of temperature sensitive components demands for innovative selective joining techniques. So far adhesive bonding has primarily been used to assemble and adjust hybrid micro optical systems. However, the properties of the organic polymers used for the adhesives limit the application of these systems. In fields of telecommunication and lithography, an enhancement of existing joining techniques is necessary to improve properties like humidity resistance, laserstability, UV-stability, thermal cycle reliability and life time reliability. Against this background laser beam soldering of optical components is a reasonable joining technology alternative. Properties like: - time and area restricted energy input - energy input can be controlled by the process temperature - direct and indirect heating of the components is possible - no mechanical contact between joining tool and components give good conditions to meet the requirements on a joining technology for sensitive optical components. Additionally to the laser soldering head, for the assembly of optical components it is necessary to include positioning units to adjust the position of the components with high accuracy before joining. Furthermore, suitable measurement methods to characterize the soldered assemblies (for instance in terms of position tolerances) need to be developed.

  8. Scalable Manufacturing of Solderable and Stretchable Physiologic Sensing Systems.

    Science.gov (United States)

    Kim, Yun-Soung; Lu, Jesse; Shih, Benjamin; Gharibans, Armen; Zou, Zhanan; Matsuno, Kristen; Aguilera, Roman; Han, Yoonjae; Meek, Ann; Xiao, Jianliang; Tolley, Michael T; Coleman, Todd P

    2017-10-01

    Methods for microfabrication of solderable and stretchable sensing systems (S4s) and a scaled production of adhesive-integrated active S4s for health monitoring are presented. S4s' excellent solderability is achieved by the sputter-deposited nickel-vanadium and gold pad metal layers and copper interconnection. The donor substrate, which is modified with "PI islands" to become selectively adhesive for the S4s, allows the heterogeneous devices to be integrated with large-area adhesives for packaging. The feasibility for S4-based health monitoring is demonstrated by developing an S4 integrated with a strain gauge and an onboard optical indication circuit. Owing to S4s' compatibility with the standard printed circuit board assembly processes, a variety of commercially available surface mount chip components, such as the wafer level chip scale packages, chip resistors, and light-emitting diodes, can be reflow-soldered onto S4s without modifications, demonstrating the versatile and modular nature of S4s. Tegaderm-integrated S4 respiration sensors are tested for robustness for cyclic deformation, maximum stretchability, durability, and biocompatibility for multiday wear time. The results of the tests and demonstration of the respiration sensing indicate that the adhesive-integrated S4s can provide end users a way for unobtrusive health monitoring. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  9. Conference proceedings ISES 2014

    DEFF Research Database (Denmark)

    Christensen, Janne Winther; Peerstrup Ahrendt, Line; Malmkvist, Jens

    The 10th Internatinal Equitation Science Conference is held i Denmark from August 6th - 9th 2014. This book of proceedings contaions abstracts of 35 oral and 57 poster presentations within the conference themes Equine Stress, Learning and Training as well as free papers.......The 10th Internatinal Equitation Science Conference is held i Denmark from August 6th - 9th 2014. This book of proceedings contaions abstracts of 35 oral and 57 poster presentations within the conference themes Equine Stress, Learning and Training as well as free papers....

  10. SIGEF Conference

    CERN Document Server

    Terceño-Gómez, Antonio; Ferrer-Comalat, Joan; Merigó-Lindahl, José; Linares-Mustarós, Salvador

    2015-01-01

    This book is a collection of selected papers presented at the SIGEF conference, held at the Faculty of Economics and Business of the University of Girona (Spain), 06-08 July, 2015. This edition of the conference has been presented with the slogan “Scientific methods for the treatment of uncertainty in social sciences”. There are different ways for dealing with uncertainty in management. The book focuses on soft computing theories and their role in assessing uncertainty in a complex world. It gives a comprehensive overview of quantitative management topics and discusses some of the most recent developments in all the areas of business and management in soft computing including Decision Making, Expert Systems and Forgotten Effects Theory, Forecasting Models, Fuzzy Logic and Fuzzy Sets, Modelling and Simulation Techniques, Neural Networks and Genetic Algorithms and Optimization and Control. The book might be of great interest for anyone working in the area of management and business economics and might be es...

  11. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xiao, H., E-mail: xiaohui2013@yahoo.com.cn; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-11-25

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R{sub 0}/R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints.

  12. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    International Nuclear Information System (INIS)

    Xiao, H.; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-01-01

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R 0 /R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints

  13. Microstructure and mechanical properties of Sn-9Zn-xAl{sub 2}O{sub 3} nanoparticles (x=0–1) lead-free solder alloy: First-principles calculation and experimental research

    Energy Technology Data Exchange (ETDEWEB)

    Xing, Wen-qing; Yu, Xin-ye; Li, Heng; Ma, Le; Zuo, Wei [Taiyuan University of Technology, College of Material Science and Technology, Taiyuan 030024 (China); Dong, Peng; Wang, Wen-xian [Taiyuan University of Technology, College of Material Science and Technology, Taiyuan 030024 (China); Shanxi Key Laboratory of Advanced Magnesium-based Materials, Taiyuan 030024 (China); Key Laboratory of Interface Science and Engineering in Advanced Materials, Ministry of Education, Taiyuan University of Technology, Taiyuan 030024 (China); Ding, Min, E-mail: dingmin@tyut.edu.cn [Taiyuan University of Technology, College of Material Science and Technology, Taiyuan 030024 (China); Shanxi Key Laboratory of Advanced Magnesium-based Materials, Taiyuan 030024 (China); Key Laboratory of Interface Science and Engineering in Advanced Materials, Ministry of Education, Taiyuan University of Technology, Taiyuan 030024 (China)

    2016-12-15

    This paper studies microstructure and mechanical properties of Sn-9Zn-x Al{sub 2}O{sub 3} nanoparticles (x=0–1) lead-free solder alloy. The interface structure, interface energy and electronic properties of Al{sub 2}O{sub 3}/Sn9Zn interface are investigated by first-principle calculation. On the experimental part, in comparison with the plain Sn-9Zn solder, the Al{sub 2}O{sub 3} nanoparticles incorporated into the solder matrix can inhibit the growth of coarse dendrite Sn-Zn eutectic structure and refine grains of the composite solders during the solidification process of the alloys. Moreover, the microhardness and average tensile strength of the solders with addition of Al{sub 2}O{sub 3} nanoparticles increased with the increasing weight percentages of Al{sub 2}O{sub 3} nanoparticles. These improved mechanical properties can be attributed to the microstructure developments and the dispersed Al{sub 2}O{sub 3} nanoparticles.

  14. Papers of the Canadian Institute's 8. annual North American pipelines and storage conference : update on critical infrastructure developments and market dynamics shaping the North American grid

    International Nuclear Information System (INIS)

    2003-01-01

    Leaders and experts from the petroleum and natural gas industry outlined some of the recent changes that have taken place in the North America gas and electricity industry. The relationship between pipeline and storage capacity was discussed with reference to how the connection affects prices at North American storage hubs. The topics of discussion ranged from the challenges associated with declines in capacity and market dynamics, to how gas marketability will be affected by the slowdown in pipeline development in North America. The investment community offered advice on long-run value creation in natural gas. The current state of development of Arctic gas was highlighted along with a review of how growth in liquefied natural gas (LNG) is changing the role of gas infrastructure in North America. It was noted that although markets will work to balance supply and demand, there is a need for new sources of North American supply to meet growing long-term demand. The fall-off in U.S. domestic natural gas supplies combined with low storage levels has created a supply crisis. The conference featured 19 presentations, of which 4 have been indexed separately for inclusion in this database. refs., tabs., figs

  15. Telecommunications Policy Research Conference. The Changing Scope and Structure of Telecommunications and Its Effects on Government and Industrial Organizations Section. Papers.

    Science.gov (United States)

    Telecommunications Policy Research Conference, Inc., Washington, DC.

    This document consist of the abstracts for two papers which considered the impact of information technologies on political and economic systems. The first paper, "The Political Repercussions of Transnational Corporate Information Systems" (Terry Curtis), argued that information technologies are the most recent in a series of…

  16. Teaching Translation and Interpreting 2: Insights, Aims, Visions. [Selection of] Papers from the Second Language International Conference (Elsinore, Denmark, June 4-6, 1993).

    Science.gov (United States)

    Dollerup, Cay, Ed.; Lindegaard, Annette, Ed.

    This selection of papers starts with insights into multi- and plurilingual settings, then proceeds to discussions of aims for practical work with students, and ends with visions of future developments within translation for the mass media and the impact of machine translation. Papers are: "Interpreting at the European Commission";…

  17. Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

    International Nuclear Information System (INIS)

    Sun, Peng; Andersson, Cristina; Wei, Xicheng; Cheng, Zhaonian; Shangguan, Dongkai; Liu, Johan

    2007-01-01

    In this paper, the coupling effect in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi solder joint with sandwich structure by long time reflow soldering was studied. It was found that the interfacial compound at the Cu substrate was binary Cu-Sn compound in Sn-Ag-Bi solder joint and Cu 5 Zn 8 phase in Sn-Zn-Bi solder joint. The thickness of the Cu-Zn compound layer formed at the Cu substrate was greater than or equal to that of Cu-Sn compound layer, although the reflow soldering temperature of Sn-Zn-Bi (240 o C) was lower than that of Sn-Ag-Bi (250 o C). The stable Cu-Zn compound was the absolute preferential phase in the interfacial layer between Sn-Zn-Bi and the Cu substrate. The ternary (Cu, Ni) 6 Sn 5 compound was formed at the Sn-Ag-Bi/Ni(P)-Cu metallization interface, and a complex alloy Sn-Ni-Cu-Zn was formed at the Sn-Zn-Bi/Ni(P)-Cu metallization interface. It was noted that Cu atoms could diffuse from the Cu substrate through the solder matrix to the Ni(P)-Cu metallization within 1 min reflow soldering time for both solder systems, indicating that just 30 s was long enough for Cu to go through 250 μm diffusion length in the Sn-Ag-Bi solder joint at 250 o C. The coupling effect between Ni(P)/Cu metallization and Cu substrate was confirmed as the type of IMCs at Ni(P) layer had been changed from Ni-Sn system to Cu-Sn system apparently by the diffusion effect of Cu atoms. The (Cu, Ni) 6 Sn 5 layer at the Ni(P)/Cu metallization grew significantly and its thickness was even greater than that of the Cu-Sn compound on the opposite side, however the growth of the complex alloy including Sn, Ni, Cu and Zn on the Ni(P)/Cu metallization was suppressed

  18. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

  19. Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

    Science.gov (United States)

    Sorg, Brian S.; Welch, Ashley J.

    2001-05-01

    Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

  20. Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Andersson, D.; Hoo, N.; Pearce, J.; Watson, A.; Dinsdale, A.; Mucklejohn, S.

    2012-01-01

    Roč. 21, č. 5 (2012), s. 629-637 ISSN 1059-9495 Institutional support: RVO:68081723 Keywords : lead-free soldering, * materials for high-temperature LF * new technologies for HT lead-free soldering Subject RIV: BJ - Thermodynamics Impact factor: 0.915, year: 2012

  1. Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

    Science.gov (United States)

    Lin, Jian; Lei, Yongping; Fu, Hanguang; Guo, Fu

    2018-03-01

    In surface mount technology, the Sn-3.0Ag-0.5Cu solder joint has a shorter impact lifetime than a traditional lead-tin solder joint. In order to improve the impact property of SnAgCu lead-free solder joints and identify the effect of silver content on tensile strength and impact property, impact experiments were conducted at various strain rates on three selected SnAgCu based solder joints. It was found that joint failure mainly occurred in the solder material with large plastic deformation under low strain rate, while joint failure occurred at the brittle intermetallic compound layer without any plastic deformation at a high strain rate. Joint strength increased with the silver content in SnAgCu alloys in static tensile tests, while the impact property of the solder joint decreased with increasing silver content. When the strain rate was low, plastic deformation occurred with failure and the tensile strength of the Sn-3.0Ag-0.5Cu solder joint was higher than that of Sn-0.3Ag-0.7Cu; when the strain rate was high, joint failure mainly occurred at the brittle interface layer and the Sn-0.3Ag-0.7Cu solder joint had a better impact resistance with a thinner intermetallic compound layer.

  2. Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

    Science.gov (United States)

    Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S

    2015-08-01

    The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding.

  3. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

    Science.gov (United States)

    Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu

    2017-08-01

    Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

  4. Corrosion Reliability of Lead-free Solder Systems Used in Electronics

    DEFF Research Database (Denmark)

    Li, Feng; Verdingovas, Vadimas; Medgyes, Balint

    2017-01-01

    humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods...

  5. Reliability and microstructure of lead-free solder joints in industrial electronics after accelerated thermal aging

    NARCIS (Netherlands)

    Scaltro, F.; Biglari, M.H.; Kodentsov, A.; Yakovleva, O.; Brom, E.

    2009-01-01

    The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface component/solder together with the formation of fractures. The evolution, the morphology and the elemental

  6. Investigation of moisture uptake into printed circuit board laminate and solder mask materials

    DEFF Research Database (Denmark)

    Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti

    2017-01-01

    with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

  7. Petro-Safe '95: 6. Annual environmental, safety and health conference and exhibition for the oil, gas and petrochemical industries. Book 3: AFV '95 and Production economics '95 conference papers

    International Nuclear Information System (INIS)

    Anon.

    1995-01-01

    Book 3 of the proceedings contains papers from two symposia: Alternative Fueled Vehicles and Production Economics. The Alternative Fueled Vehicles symposium is divided into 3 sections which cover: (1) Hardware and vehicles--school bus fleets and LNG; (2) Fuels and infrastructure--CNG fueling facilities, reformulated gasoline and clean diesel, LNG, future supply trends and domestic energy security, safety issues, and methanol; and (3) Regulatory issues--Clean Cities program, Energy Policy Act and state legislation, Employee Trip Reduction program, and public awareness. The papers in the Production Economics symposium deal with cost-effective methods for marginal field development; economic considerations for offshore platforms and systems; enhanced oil recovery economics; floating production economics; and capital versus operating costs in oil and gas production. Thirty-five papers have been processed separately for inclusion on the data base

  8. Conference summaries

    International Nuclear Information System (INIS)

    Phillips, G.J.

    1985-01-01

    The 113 papers presented at this conference covered the areas of 1) fuel design, development and production; 2) nuclear plant safety; 3) nuclear instrumentation; 4) public and regulatory matters; 5) developments and opportunities in fusion; 6) fuel behaviour under normal operating conditions; 7) nuclear plant design and operations; 8) materials science and technology; 9) nuclear power issues; 10) fusion technology; 11) fuel behaviour under accident conditions; 12) large scale fuel channel replacement programs; 13) thermalhydraulics experimental studies; 14) reactor physics and analysis; 15) applications of accelerators; 16) fission product release and severe fuel damage under accident conditions; 17) thermalhydraulics modeling and assessments; 18) waste management and the environment; and 20) new reactor concepts

  9. Radiation`96. Conference handbook

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1996-12-31

    The conference program includes eight invited lectures which cover a range of contemporary topics in radiation science and technology. In addition, thirty-two oral papers were presented, along with forty-five posters. The conference handbook contains one-page precis or extended abstracts of all presentations, and is a substantial compendium of current radiation research in Australia.

  10. Multiphoton processes: conference proceedings

    International Nuclear Information System (INIS)

    Lambropoulos, P.; Smith, S.J.

    1984-01-01

    The chapters of this volume represent the invited papers delivered at the conference. They are arranged according to thermatic proximity beginning with atoms and continuing with molecules and surfaces. Section headings include multiphoton processes in atoms, field fluctuations and collisions in multiphoton process, and multiphoton processes in molecules and surfaces. Abstracts of individual items from the conference were prepared separately for the data base

  11. Radiation`96. Conference handbook

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1997-12-31

    The conference program includes eight invited lectures which cover a range of contemporary topics in radiation science and technology. In addition, thirty-two oral papers were presented, along with forty-five posters. The conference handbook contains one-page precis or extended abstracts of all presentations, and is a substantial compendium of current radiation research in Australia.

  12. Radiation'96. Conference handbook

    International Nuclear Information System (INIS)

    1996-01-01

    The conference program includes eight invited lectures which cover a range of contemporary topics in radiation science and technology. In addition, thirty-two oral papers were presented, along with forty-five posters. The conference handbook contains one-page precis or extended abstracts of all presentations, and is a substantial compendium of current radiation research in Australia

  13. Computational Intelligence : International Joint Conference

    CERN Document Server

    Rosa, Agostinho; Cadenas, José; Dourado, António; Madani, Kurosh; Filipe, Joaquim

    2016-01-01

    The present book includes a set of selected extended papers from the sixth International Joint Conference on Computational Intelligence (IJCCI 2014), held in Rome, Italy, from 22 to 24 October 2014. The conference was composed by three co-located conferences:  The International Conference on Evolutionary Computation Theory and Applications (ECTA), the International Conference on Fuzzy Computation Theory and Applications (FCTA), and the International Conference on Neural Computation Theory and Applications (NCTA). Recent progresses in scientific developments and applications in these three areas are reported in this book. IJCCI received 210 submissions, from 51 countries, in all continents. After a double blind paper review performed by the Program Committee, 15% were accepted as full papers and thus selected for oral presentation. Additional papers were accepted as short papers and posters. A further selection was made after the Conference, based also on the assessment of presentation quality and audience in...

  14. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    International Nuclear Information System (INIS)

    Li Guangdong; Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu

    2010-01-01

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  15. Physical properties of lead free solders in liquid and solid state

    Energy Technology Data Exchange (ETDEWEB)

    Mhiaoui, Souad

    2007-04-17

    The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

  16. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    Energy Technology Data Exchange (ETDEWEB)

    Li Guangdong, E-mail: liguangdong@emails.bjut.edu.c [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China); Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China)

    2010-02-18

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  17. An Approach for Impression Creep of Lead Free Microelectronic Solders

    Science.gov (United States)

    Anastasio, Onofrio A.

    2002-06-01

    Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

  18. Transected sciatic nerve repair by diode laser protein soldering.

    Science.gov (United States)

    Fekrazad, Reza; Mortezai, Omid; Pedram, MirSepehr; Kalhori, Katayoun Am; Joharchi, Khojasteh; Mansoori, Korosh; Ebrahimi, Roja; Mashhadiabbas, Fatemeh

    2017-08-01

    Despite advances in microsurgical techniques, repair of peripheral nerve injuries (PNI) is still a major challenge in regenerative medicine. The standard treatment for PNI includes suturing and anasthomosis of the transected nerve. The objective of this study was to compare neurorraphy (nerve repair) using standard suturingto diode laser protein soldering on the functional recovery of transected sciatic nerves. Thirty adult male Fischer-344 Wistar rats were randomly assigned to 3 groups: 1. The control group, no repair, 2. the standard of care suture group, and 3. The laser/protein solder group. For all three groups, the sciatic nerve was transected and the repair was done immediately. For the suture repair group, 10.0 prolene suture was used and for the laser/protein solder group a diode laser (500mW output power) in combination with bovine serum albumen and indocyanine green dye was used. Behavioral assessment by sciatic functional index was done on all rats biweekly. At 12weeks post-surgery, EMG recordings were done on all the rats and the rats were euthanized for histological evaluation of the sciatic nerves. The one-way ANOVA test was used for statistical analysis. The average time required to perform the surgery was significantly shorter for the laser-assisted nerve repair group compared to the suture group. The EMG evaluation revealed no difference between the two groups. Based on the sciatic function index the laser group was significantly better than the suture group after 12weeks (pneurorraphy using standard suturing methods. Copyright © 2017 Elsevier B.V. All rights reserved.

  19. A World of Magic: Conference Papers from the Selected Sessions of the AACRAO Annual Meeting (79th, Orlando, FL, April 18-23, 1993).

    Science.gov (United States)

    Russell, Michele, Ed.

    Papers on aspects of college admission, records, and institutional research functions are: "How To Improve Office Morale" (Victor Swenson); "Staff Meetings: How To Save Hours per Month and Develop Your Staff" (LuAnn Harris, Shelley Olsen); "Selling SPEED/ExPRESS" (Laura Patterson, Thomas Scott); "Advisement and…

  20. TECHNOLOGICAL CHANGE AND JOB CHANGE. PAPER PRESENTED AT THE INTERNATIONAL CONFERENCE ON AUTOMATION, FULL EMPLOYMENT, AND A BALANCED ECONOMY (ROME, ITALY, JUNE 27, 1967).

    Science.gov (United States)

    HABER, WILLIAM

    THIS PAPER SKETCHES RECENT TRENDS AND PROBLEMS THAT HAVE EMERGED IN PUBLIC TRAINING EFFORTS IN THE UNITED STATES DURING THE 1960S. IT CITES SHIFTS IN EMPHASIS FROM TRAINING WORKERS FOR EXISTING JOBS TO REFOCUSING ON YOUTH UNEMPLOYMENT AND TO PREPARING THE HARD-CORE UNEMPLOYED FOR WORK, AND FROM CONCERN WITH JOB TRAINING TO JOB CREATION. IT POINTS…

  1. Targeted road safety programmes : a promising approach in road safety. Paper presented at `the second conference on Asian road safety', Beijing, October 28-31, 1996.

    NARCIS (Netherlands)

    Wegman, F.C.M.

    1996-01-01

    This paper gives a broad overview on targeted road safety programmes, mainly based on the activities of a so-called OECD scientific expert group, whose report has been published in 1994 (see C 2845 S (IRRD 864087). Examples of targeted road safety programmes are given in some more detail of Finland,

  2. Exploring the Affordances of the Writing Portal (TWP) as an Online Supplementary Writing Platform (For the Special Issue of GLoCALL 2013 and 2014 Conference Papers)

    Science.gov (United States)

    Lee, Kean Wah; Said, Noraini; Tan, Choon Keong

    2016-01-01

    The writing process has traditionally been seen "as a lonely journey" to typify the lack of support that students experience for writing outside the classroom. This paper examines an attempt of The Writing Portal (TWP), a supplementary online writing platform, to support students' writing needs throughout the five stages of the writing…

  3. Studying global polity in adult education: Lessons learned from comparative and international education. Paper presented at the 57th CIES Conference, New Orleans (USA), 10-15 March

    DEFF Research Database (Denmark)

    Milana, Marcella

    2013-01-01

    The scope of this paper is to outline some theoretical and methodological parameters for investigating the effects of globalization on adult education, by looking at the interactions between inter-states organizations and other political actors in the shaping of ‘global’ adult education policy. M...... could help to further advance a global polity perspective to the study of AE....

  4. Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods are useful to predict damage values for solder joint in power electrical components. Based on the proposed methods it is described how to find the damage level for a given temperature loading profile....... The proposed methods are discussed for application in reliability assessment of Wind Turbine’s electrical components considering physical, model and measurement uncertainties. For further research it is proposed to evaluate damage criteria for electrical components due to the operational temperature...

  5. Pressure brazing of ceramics to metals with copper solder

    International Nuclear Information System (INIS)

    Pavlova, M.A.; Metelkin, I.I.

    1986-01-01

    The effect on the quality of joints brazed with copper of different non metallized aluminooxide dielectrics with metals and alloys of a series of technological parameters (temperature, pressure, holding, and medium) in the course of pressure brazing is investigated. It is shown that in case of brazing with kovar and nickel the character of dependences is identical, however in all cases the joints with nickel are more durable. For the ceramics - molybdenum system characterized by weak interaction with copper solder kinetic dependences have no maximum and only under holding of more than 20 min the constant strength of 150-190 MPa is attained

  6. Adaptive and active materials: selected papers from the ASME 2012 Conference on Smart Materials, Adaptive Structures and Intelligent Systems (SMASIS 12) (Stone Mountain, GA, USA, 19-21 September 2012)

    Science.gov (United States)

    Seelecke, Stefan; Erturk, Alper; Ounaies, Zoubeida; Naguib, Hani; Huber, John; Turner, Travis; Anderson, Iain; Philen, Michael; Baba Sundaresan, Vishnu

    2013-09-01

    belong to the symposium topics. In addition, the conference also featured a special symposium dedicated to DARPA's structural and materials/logic program. The program seeks to enable structural systems to adapt to varying loads and simultaneously exhibit both high stiffness and high damping. Authors of selected papers in the materials areas (symposia 1, 2, and 6) as well as energy harvesting (symposium 7) were invited to write a full journal article on their presentation topic for publication in this special issue of Smart Materials and Structures . This collection of papers demonstrates the exceptional quality and originality of the conference presentations. We are very appreciative of their efforts to produce this collection of highly relevant articles on smart materials.

  7. AINSE's 40th anniversary conference. Conference handbook

    International Nuclear Information System (INIS)

    1998-01-01

    Highlights of 40 years of activity of the Australian Institute of Nuclear Science and Engineering (AINSE) were the main focus of this conference. Topics covered include nuclear physics, plasma physics, radiation chemistry, radiation biology, neutron diffraction, nuclear techniques of analysis and other relevant aspects of nuclear science and technology. The conference handbook contains the summaries of the 78 papers and posters presented and the list of participants

  8. A Guideline for Successful Calibration and Uncertainty Analysis for Soil and Water Assessment: A Review of Papers from the 2016 International SWAT Conference

    Directory of Open Access Journals (Sweden)

    Karim C. Abbaspour

    2017-12-01

    Full Text Available Application of integrated hydrological models to manage a watershed’s water resources are increasingly finding their way into the decision-making processes. The Soil and Water Assessment Tool (SWAT is a multi-process model integrating hydrology, ecology, agriculture, and water quality. SWAT is a continuation of nearly 40 years of modeling efforts conducted by the United States Department of Agriculture (USDA Agricultural Research Service (ARS. A large number of SWAT-related papers have appeared in ISI journals, building a world-wide consensus around the model’s stability and usefulness. The current issue is a collection of the latest research using SWAT as the modeling tool. Most models must undergo calibration/validation and uncertainty analysis. Unfortunately, these sciences are not formal subjects of teaching in most universities and the students are often left to their own resources to calibrate their model. In this paper, we focus on calibration and uncertainty analysis highlighting some serious issues in the calibration of distributed models. A protocol for calibration is also highlighted to guide the users to obtain better modeling results. Finally, a summary of the papers published in this special issue is provided in the Appendix.

  9. Abstracts of contributed papers. Sixth international conference on high-energy physics and nuclear structure, Santa Fe and Los Alamos, NM, June 9--14, 1975

    International Nuclear Information System (INIS)

    Mischke, R.; Hargrove, C.; Hoffman, C.

    1975-08-01

    Abstracts of contributed papers are assembled under the following headings (number denotes the number of abstracts in the section): pi p and pi d interactions (10); π nucleus theory (33); intermediate isobar calculations (8); π-nucleus interactions (25); stopping muons (44); exotic atoms and condensed nuclear states (28); nucleus-nucleus interactions (31); nuclear structure and hypernuclei (7); nucleon-nucleon interactions (24); e- and γ-nucleus interactions (29); weak interactions (17); high energy collisions (13); heavy ions (22); instrumentation (8). (SDF)

  10. Albumin solder covalently bound to a polymer membrane: New approach to improve binding strength in laser tissue soldering in-vitro.

    Science.gov (United States)

    Hiebl, B; Ascher, L; Luetzow, K; Kratz, K; Gruber, C; Mrowietz, C; Nehring, M E; Lendlein, A; Franke, R-P; Jung, F

    2018-01-01

    Laser tissue soldering (LTS) based on indocyanine green (ICG)-mediated heat-denaturation of proteins might be a promising alternative technique for micro-suturing, but up to now the problem of too weak shear strength of the solder welds in comparison to sutures is not solved. Earlier reports gave promising results showing that solder supported by carrier materials can enhance the cohesive strength of the liquid solder. In these studies, the solder was applied to the carriers by dip coating. Higher reliability of the connection between the solder and the carrier material is expected when the solder is bound covalently to the carrier material. In the present study a poly(ether imide) (PEI) membrane served as carrier material and ICG-supplemented albumin as solder substrate. The latter was covalently coupled to the carrier membrane under physiological conditions to prevent structural protein changes. As laser source a diode continuous-wave laser emitting at 808 nm with intensities between 250 mW and 1500 mW was utilized. The albumin functionalized carrier membrane was placed onto the tunica media of explanted pig thoracic aortae forming an overlapping area of approximately 0.5×0.5 cm2. All tests were performed in a dry state to prevent laser light absorption by water. Infrared spectroscopy, spectro-photometrical determination of the secondary and primary amine groups after acid orange II staining, contact angle measurements, and atomic force microscopy proved the successful functionalization of the PEI membrane with albumin. A laser power of 450 mW LTS could generate a membrane-blood vessel connection which was characterized by a shear strength of 0.08±0.002 MPa, corresponding to 15% of the tensile strength of the native blood vessel. Theoretically, an overlapping zone of 4.1 mm around the entire circumference of the blood vessel could have provided shear strength of the PEI membrane-blood vessel compound identical to the tensile strength of the native

  11. Influence of Poly(ethylene glycol) Degradation on Voiding Sporadically Occurring in Solder Joints with Electroplated Cu

    Science.gov (United States)

    Wafula, F.; Yin, L.; Borgesen, P.; Andala, D.; Dimitrov, N.

    2012-07-01

    This paper presents a comprehensive study of the effect of poly(ethylene glycol) (PEG) degradation on the void formation known to take place sporadically at the interface between electroplated Cu and Pb-free solder. Thorough chemical analysis of our plating solution, carried out at different times of the deposition process by matrix-assisted laser desorption ionization time-of-flight mass spectroscopy, reveals a dramatic shift in the peaks to lower mass range with time. Scanning electron microscopy cross-sectional images of solder joints with Cu samples that have been plated at different times in the course of solution aging show a decrease in void formation. A decreasing magnitude of the deposition overpotential also seen during aging suggests that, breaking down to lower-molecular-weight fragments, PEG loses its suppression effect and likely has lower impact on the voiding propensity. This indirect correlation is confirmed further by the use of plating solutions containing PEG with preselected molecular weight. We also report on the effect of the surface area-to-solution volume ratio on PEG degradation studied by comparative experiments performed in a 50-mL bath with a rotating disc electrode and in a larger cell (Hull cell) with volume of 267 mL. The results show that, at fixed charge per unit volume, PEG degrades at a greatly accelerated rate in the Hull cell featuring higher electrode surface-to-solution volume ratio. Analysis of solder joints with accordingly grown Cu layers suggests that the voiding decreases faster with the accelerated rate of PEG degradation.

  12. Development of Pb-Free Nanocomposite Solder Alloys

    Directory of Open Access Journals (Sweden)

    Animesh K. Basak

    2018-04-01

    Full Text Available As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs during aging/reflow. Accordingly, this study examines the improvement of properties of SAC alloys by incorporating nanoparticles in it. Two different types of nanoparticles were added in monolithic SAC alloy: (1 Al2O3 or (2 Fe and their effect on microstructure and thermal properties were investigated. Addition of Fe nanoparticles leads to the formation of FeSn2 IMCs alongside Ag3Sn and Cu6Sn5 from monolithic SAC alloy. Addition of Al2O3 nano-particles do not contribute to phase formation, however, remains dispersed along primary β-Sn grain boundaries and act as a grain refiner. As the addition of either Fe or Al2O3 nano-particles do not make any significant effect on thermal behavior, these reinforced nanocomposites are foreseen to provide better mechanical characteristics with respect to conventional monolithic SAC solder alloys.

  13. Impurity Effects in Electroplated-Copper Solder Joints

    Directory of Open Access Journals (Sweden)

    Hsuan Lee

    2018-05-01

    Full Text Available Copper (Cu electroplating is a mature technology, and has been extensively applied in microelectronic industry. With the development of advanced microelectronic packaging, Cu electroplating encounters new challenges for atomic deposition on a non-planar substrate and to deliver good throwing power and uniform deposit properties in a high-aspect-ratio trench. The use of organic additives plays an important role in modulating the atomic deposition to achieve successful metallic coverage and filling, which strongly relies on the adsorptive and chemical interactions among additives on the surface of growing film. However, the adsorptive characteristic of organic additives inevitably results in an incorporation of additive-derived impurities in the electroplated Cu film. The incorporation of high-level impurities originating from the use of polyethylene glycol (PEG and chlorine ions significantly affects the microstructural evolution of the electroplated Cu film, and the electroplated-Cu solder joints, leading to the formation of undesired voids at the joint interface. However, the addition of bis(3-sulfopropyl disulfide (SPS with a critical concentration suppresses the impurity incorporation and the void formation. In this article, relevant studies were reviewed, and the focus was placed on the effects of additive formula and plating parameters on the impurity incorporation in the electroplated Cu film, and the void formation in the solder joints.

  14. A flip chip process based on electroplated solder bumps

    Science.gov (United States)

    Salonen, J.; Salmi, J.

    1994-01-01

    Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin count and packaging density and superior electrical performance. The chips are mounted upside down on the substrate, which can be made of silicon, ceramic, glass or - in some cases - even PCB. The extra processing steps required for chips are the deposition of a suitable thin film metal layer(s) on the standard Al pad and the formation of bumps. Also, the development of new fine line substrate technologies is required to utilize the full potential of the technology. In our bumping process, bump deposition is done by electroplating, which was chosen for its simplicity and economy. Sputter deposited molybdenum and copper are used as thin film layers between the aluminum pads and the solder bumps. A reason for this choice is that the metals can be selectively etched after bumping using the bumps as a mask, thus circumventing the need for a separate mask for etching the thin film metals. The bumps are electroplated from a binary Pb-Sn bath using a thick liquid photoresist. An extensively modified commercial flip chip bonder is used for alignment and bonding. Heat assisted tack bonding is used to attach the chips to the substrate, and final reflow joining is done without flux in a vacuum furnace.

  15. Photos of the conference

    Directory of Open Access Journals (Sweden)

    Birgitta Åhman

    1984-05-01

    Full Text Available Birgitta  Åhman is the photographer of the series of pictures from the conference, also for the cover photo of the full paper edition showing Kongsvold Mountain Hut and Biological Station.

  16. Computational Intelligence : International Joint Conference

    CERN Document Server

    Dourado, António; Rosa, Agostinho; Filipe, Joaquim; Kacprzyk, Janusz

    2016-01-01

    The present book includes a set of selected extended papers from the fifth International Joint Conference on Computational Intelligence (IJCCI 2013), held in Vilamoura, Algarve, Portugal, from 20 to 22 September 2013. The conference was composed by three co-located conferences:  The International Conference on Evolutionary Computation Theory and Applications (ECTA), the International Conference on Fuzzy Computation Theory and Applications (FCTA), and the International Conference on Neural Computation Theory and Applications (NCTA). Recent progresses in scientific developments and applications in these three areas are reported in this book. IJCCI received 111 submissions, from 30 countries, in all continents. After a double blind paper review performed by the Program Committee, only 24 submissions were accepted as full papers and thus selected for oral presentation, leading to a full paper acceptance ratio of 22%. Additional papers were accepted as short papers and posters. A further selection was made after ...

  17. Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions

    Science.gov (United States)

    Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

    2015-12-01

    Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

  18. Study of Diffusion Barrier for Solder/ n-Type Bi2Te3 and Bonding Strength for p- and n-Type Thermoelectric Modules

    Science.gov (United States)

    Lin, Wen-Chih; Li, Ying-Sih; Wu, Albert T.

    2018-01-01

    This paper investigates the interfacial reaction between Sn and Sn3Ag0.5Cu (SAC305) solder on n-type Bi2Te3 thermoelectric material. An electroless Ni-P layer successfully suppressed the formation of porous SnTe intermetallic compound at the interface. The formation of the layers between Bi2Te3 and Ni-P indicates that Te is the dominant diffusing species. Shear tests were conducted on both Sn and SAC305 solder on n- and p-type Bi2Te3 with and without a Ni-P barrier layer. Without a Ni-P layer, porous SnTe would result in a more brittle fracture. A comparison of joint strength for n- and p-type thermoelectric modules is evaluated by the shear test. Adding a diffusion barrier increases the mechanical strength by 19.4% in n-type and 74.0% in p-type thermoelectric modules.

  19. Laser-tissue soldering with biodegradable polymer films in vitro: film surface morphology and hydration effects.

    Science.gov (United States)

    Sorg, B S; Welch, A J

    2001-01-01

    Previous research introduced the concept of using biodegradable polymer film reinforcement of a liquid albumin solder for improvement of the tensile strength of repaired incisions in vitro. In this study, the effect of creating small pores in the PLGA films on the weld breaking strength is studied. Additionally, the effect of hydration on the strength of the reinforced welds is investigated. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with an 806-nm CW diode laser. A poly(DL-lactic-co-glycolic acid) (PLGA) film was used to reinforce the solder (the controls had solder but no reinforcement). Breaking strengths were measured acutely and after hydration in saline for 1 and 2 days. The data were analyzed by ANOVA (P < 0.05) and multiple comparisons of means were performed using the Newman-Keuls test. The creation of pores in the PLGA films qualitatively improved the film flexibility without having an apparent adverse effect on the breaking strength, while the actual technique of applying the film and solder had more of an effect. The acute maximum average breaking strengths of some of the film reinforced specimens (114.7 g-134.4 g) were significantly higher (P < 0.05) than the acute maximum average breaking strength of the unreinforced control specimens (68.3 g). Film reinforced specimens were shown to have a statistically significantly higher breaking strength than unreinforced controls after 1- and 2-day hydration. Reinforcement of liquid albumin solders in laser-assisted incision repair appears to have advantages over conventional methods that do not reinforce the cohesive strength of the solder in terms of acute breaking strength and after immersion in moist environments for short periods of time. Using a film with the solder applied to one surface only may be advantageous over other techniques.

  20. Industrial radiography on radiographic paper

    International Nuclear Information System (INIS)

    Domanus, J.C.

    1977-11-01

    An investigation was performed to compare the quality of radiographic paper with that of X-ray film, after a review had been made of the rather scarce literature on the subject. The equipment used throughout the investigation is described, and characteristic curves for Agfa-Gevaert and Kodak papers exposed with different intensifying screens in the low and intermediate voltage range are reproduced. The relative speed, contrast and exposure latitude were computed from these curves. The quality of the radiographic image was checked on U/Al blocks and plates, Al and Fe blocks, and fiber-reinforced composites. Exposure charts for Al and Fe were made for various paper and screen combinations. Both the sharpness of the radiographic image as well as the influence of processing on speed and contrast were checked. Examples are given of the practical application of the paper for radiography of castings, weldings, solderings, assemblies, etc. (author)

  1. The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

    Energy Technology Data Exchange (ETDEWEB)

    Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: Peter.Svec@savba.sk [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)

    2013-06-01

    The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

  2. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

  3. Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

    DEFF Research Database (Denmark)

    Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper

    2009-01-01

    of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling. solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft....... The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers...

  4. Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

    CERN Document Server

    Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B

    2015-01-01

    The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

  5. NATO Conference

    CERN Document Server

    Lynn, W

    1975-01-01

    The contents of this volume involve selection, emendation and up-dating of papers presented at the NATO Conference "Mathe­ matical Analysis of Decision problems in Ecology" in Istanbul, Turkey, July 9-13, 1973. It was sponsored by the System Sciences Division of NATO directed by Dr. B. Bayraktar with local arrange­ ments administered by Dr. Ilhami Karayalcin, professor of the Department of Industrial Engineering at the Technical University of Istanbul. It was organized by A. Charnes, University professor across the University of Texas System, and Walter R.Lynn, Di­ rector of the School of Civil and Environmental Engineering at Cornell Unjversity. The objective of the conference was to bring together a group of leading researchers from the major sciences involved in eco­ logical problems and to present the current state of progress in research of a mathematical nature which might assist in the solu­ tion of these problems. Although their presentations are not herein recorded, the key­ note address of Dr....

  6. Conference Proceedings

    International Nuclear Information System (INIS)

    2002-01-01

    This volume contains the unedited proceedings of the Second Annual Conference on Managing Electricity Price Volatility. There were a total of eleven papers presented, dealing with a variety of issues affecting price volatility. Subjects treated included: new power generation development in Alberta; an analysis of electricity supply and demand to predict future price volatility; the effect of government intervention in the Alberta electricity market; risk management in volatile energy markets; an analysis of Alberta's capacity to supply its own internal electric power needs; the impact of increased electricity import and export capacity on price fluctuation in Alberta; improving market liquidity in Alberta; using weather derivatives to offset price risk; the impact of natural gas prices on electricity price volatility; capitalizing on advancements in online trading; and strategies for businesses to keep operating through times of price volatility. In most cases only overhead viewgraphs are available

  7. Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn- xAg-0.7Cu

    Science.gov (United States)

    Lee, Hwa-Teng; Huang, Kuo-Chen

    2016-12-01

    Low-cycle fatigue tests of Sn-Ag-Cu (SAC) Pb-free solder joints under fixed displacement were performed to evaluate the influence of Ag content (0-3 wt.%) and solder-joint geometry (barrel and hourglass types) on solder-joint fatigue behavior and reliability. The solder joints were composed of fine particles of Ag3Sn and Cu6Sn5, which aggregated as an eutectic constituent at grain boundaries of the primary β-Sn phase and formed a dense network structure. A decrease in the Ag content resulted in coarsening of the β-Sn and eutectic phases, which, in turn, decreased the strength of the joint and caused earlier failure. Solder joints in the hourglass form exhibited better fatigue performance with longer life than barrel-type joints. The sharp contact angle formed between the solder and the Cu substrate by the barrel-type joints concentrated stress, which compromised fatigue reliability. The addition of Ag to the solder, however, enhanced fatigue performance because of strengthening caused by Ag3Sn formation. The cracks of the barrel-type SAC solder joints originated mostly at the contact corner and propagated along the interfacial layer between the interfacial intermetallic compound (IMC) and solder matrix. Hourglass-type solder joints, however, demonstrated both crack initiation and propagation in the solder matrix (solder mode). The addition of 1.5-2.0 wt.% Ag to SAC solder appears to enhance the fatigue performance of solder joints while maintaining sufficient strength.

  8. Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

    Science.gov (United States)

    Rolin, T. D.; Hodge, R. E.

    2008-01-01

    An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

  9. Laser welding of vas deferens in rodents: initial experience with fluid solders.

    Science.gov (United States)

    Trickett, R I; Wang, D; Maitz, P; Lanzetta, M; Owen, E R

    1998-01-01

    This study evaluates the use of sutureless laser welding for vasovasostomy. In 14 rodents, the left vas deferens underwent vasovasostomy using an albumin-based solder applied to the adventitia of the vas deferens. The solder contained the dye, indocyanine green, to allow selective absorption and denaturation by a fiber-coupled 800-nm diode laser. The right vas deferens served as a control, receiving conventional layered microsurgical repair. We used a removable 4/0 nylon stent and microclamps to appose the vas deferens during repair, with no need for stay sutures. The mean time to perform laser solder repair (23.5 min) and conventional repair (23.3 min) were not significantly different (P=0.91). However, examination after 8 weeks showed that granuloma formation (G) and patency (P) rates for the conventional suture technique (G, 14%; P, 93%) were significantly better than observed for the laser solder technique (G, 57%; P, 50%).

  10. Effects of rework on adhesion of Pb-In soldered gold thick films

    International Nuclear Information System (INIS)

    Gehman, R.W.; Becka, G.A.; Losure, J.A.

    1982-02-01

    The feasibility of repeatedly reworking Pb-In soldered joints on gold thick films was evaluated. Nailhead adhesion tests on soldered thick films typically resulted in failure within the bulk solder (50 In-50 Pb). Average strengths increased with each rework, and the failure mode changed. An increase in metalization lift-off occurred with successive reworks. An investigation was initiated to determine why these changes occurred. Based on this work, the thick film adhesion to the substrate appeared to be lowered by indium reduction of cadmium oxide and by formation of a weak, brittle intermetallic compound, Au 9 In 4 . It was concluded that two solder reworks could be conducted without significant amounts of metallization lift-off during nailhead testing

  11. Nanoscale Soldering of Positioned Carbon Nanotubes using Highly Conductive Electron Beam Induced Gold Deposition

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    We have developed an in-situ method for controlled positioning of carbon nanotubes followed by highly conductive contacting of the nanotubes, using electron beam assisted deposition of gold. The positioning and soldering process takes place inside an Environmental Scanning Electron Microscope (E...... in a carbon matrix. Nanoscale soldering of multi-walled carbon nanotubes (MWNT) onto microelectrodes was achieved by deposition of a conducting gold line across a contact point between nanotube and electrode. The solderings were found to be mechanically stronger than the carbon nanotubes. We have positioned...... MWNTs to bridge the gap between two electrodes, and formed soldering bonds between the tube and each of the electrodes. All nanotube bridges showed ohmic resistances in the range 10-30 kΩ. We observed no increase in resistance after exposing the MWNT bridge to air for days....

  12. Selecting a Good Conference Location Based on Participants' Interests

    Science.gov (United States)

    Miah, Muhammed

    2011-01-01

    Selecting a good conference location within budget constraints to attract paper authors and participants is a very difficult job for the conference organizers. A conference location is also very important along with other issues such as ranking of the conference. Selecting a bad conference location may reduce the number of paper submissions and…

  13. The creep behavior of In-Ag eutectic solder joints

    International Nuclear Information System (INIS)

    Reynolds, H.L.; Kang, S.H.; Morris, J.W. Jr.; Univ. of California, Berkeley, CA

    1999-01-01

    The addition of 3 wt.% Ag to In results in a eutectic composition with improved mechanical properties while only slightly lowering the melting temperature. Steady-state creep properties of In-Ag eutectic solder joints have been measured using constant load tests at 0, 30, 60, and 90 C. Constitutive equations are derived to describe the creep behavior. The data are well represented by an equation of the form proposed by Dorn: a power-law equation applies to each independent creep mechanism. Two parallel mechanisms were observed for the In-Ag eutectic joints. The high-stress mechanism is a bulk mechanism with a thermal dependence dominated by the thermal dependence of creep in the In-rich matrix. The low-stress mechanism is a grain boundary mechanism. Results of this work are discussed with regard to creep behavior of typical eutectic systems

  14. Nanoconstruction by welding individual metallic nanowires together using nanoscale solder

    International Nuclear Information System (INIS)

    Peng, Y; Inkson, B J; Cullis, A G

    2010-01-01

    This work presents a new bottom-up nanowelding technique enabling building blocks to be assembled and welded together into complex 3D nanostructures using nanovolumes of metal solder. The building blocks of gold nanowires, (Co 72 Pt 28 /Pt) n multilayer nanowires, and nanosolder Sn 99 Au 1 alloy nanowires were successfully fabricated by a template technique. Individual metallic nanowires were picked up and assembled together. Conductive nanocircuits were then welded together using similar or dissimilar nanosolder material. At the weld sites, nanoscale volumes of a chosen metal are deposited using nanosolder of a sacrificial nanowire, which ensures that the nanoobjects to be bonded retain their structural integrity. The whole nanowelding process is clean, controllable and reliable, and ensures both mechanically strong and electrically conductive contacts.

  15. Soldered Contact and Current Risetime Effects on Negative Polarity Wire Array Z-pinches

    International Nuclear Information System (INIS)

    Chalenski, D. A.; Kusse, B. R.; Greenly, J. B.; Blesener, I. C.; McBride, R. D.; Hammer, D. A.; Knapp, P. F.

    2009-01-01

    The Cornell University COBRA pulser is a nominal 1 MA machine, capable of driving up to 32 wire cylindrical Z-pinch arrays. COBRA can operate with variable current risetimes ranging from 100 ns to 200 ns (short and long pulse, respectively). Wires are typically strung with a ''press'' contact to the electrode hardware, where the wire is loosely pulled against the hardware and held there to establish electrical contact. The machine is normally negative, but a bolt-on convolute can be used to modify the current path and effectively produce positive polarity operation at the load.Previous research with single wires on a 1-5 kA pulser has shown that soldering the wire, thereby improving the wire/electrode contact, and operating in positive polarity can improve the energy deposition into the wire and enhance wire core expansion. Negative polarity showed no difference. Previous experiments on the negative polarity, 20 MA, 100 ns Z accelerator have shown that improving the contact improved the x-ray yield.Cornell data were collected on 16-wire Aluminum Z-pinch arrays in negative polarity. Experiments were conducted with both short and long current pulses with soldered and no-soldered wire/electrode contacts. The initiation, ablation, implosion and stagnation phases were compared for these four conditions. Time dependent x-ray signals were measured using diodes and diamond detectors. An inductive voltage monitor was used to infer minimum current radius achieved, as defined by a uniform shell of current moving radially inward, producing a time dependent inductance. Total energy data were collected with a metal-strip bolometer. Self-emission data were collected by an XUV 4-frame camera and an optical streak camera.In negative polarity and with short pulses, soldering appeared to produce a smaller radius pinch and decrease variations in the x-ray pulse shape. The bolometer, laser backlighter, 4-frame and streak cameras showed negligible differences in the initiation ablation

  16. Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications

    Directory of Open Access Journals (Sweden)

    John D. Sørensen

    2011-12-01

    Full Text Available Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components, it is necessary to understand the physics of their failure and be able to develop reliability prediction models. Such a model is proposed in this paper for an IGBT power electronic module. IGBTs are critical components in wind turbine converter systems. These are multilayered devices where layers are soldered to each other and they operate at a thermal-power cycling environment. Temperature loadings affect the reliability of soldered joints by developing cracks and fatigue processes that eventually result in failure. Based on Miner’s rule a linear damage model that incorporates a crack development and propagation processes is discussed. A statistical analysis is performed for appropriate model parameter selection. Based on the proposed model, a layout for component life prediction with crack movement is described in details.

  17. Second international conference on isotopes. Conference proceedings

    Energy Technology Data Exchange (ETDEWEB)

    Hardy, C J [ed.

    1997-10-01

    The Second International Conference on Isotopes (2ICI) was hosted by the Australian Nuclear Association in Sydney, NSW, Australia. The Theme of the Second Conference: Isotopes for Industry, Health and a Better Environment recognizes that isotopes have been used in these fields successfully for many years and offer prospects for increasing use in the future. The worldwide interest in the use of research reactors and accelerators and in applications of stable and radioactive isotopes, isotopic techniques and radiation in industry, agriculture, medicine, environmental studies and research in general, was considered. Other radiation issues including radiation protection and safety were also addressed. International and national overviews and subject reviews invited from leading experts were included to introduce the program of technical sessions. The invited papers were supported by contributions accepted from participants for oral and poster presentation. A Technical Exhibition was held in association with the Conference. This volume contains the full text or extended abstracts of papers number 61- to number 114

  18. Effects of voids on thermal-mechanical reliability of lead-free solder joints

    Directory of Open Access Journals (Sweden)

    Benabou Lahouari

    2014-06-01

    Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

  19. Investigation into mechanical properties of joints of heterogeneous materials brazed with high-temperature solders

    International Nuclear Information System (INIS)

    Lomenko, V.I.; Merkushev, V.P.; Borodina, L.M.; Sycheva, T.S.; Tokhtina, O.A.; Frolov, N.N.

    1988-01-01

    Mechanical properties of copper joints with copper, 12Kh18M10T steel and KhD50 composite obtained by vacuum brazing by copper-titanium solder as compared with properties of joints brazed by PSr 72 and PMFOTsr 6-4-0.03 solders in hydrogen are studied. Dependences of joints strength on temperature of contact - reactive vacuum brazing are obtained. Possible applications of joints of dissimilar materials in electrovacuum devices subjected to the effect of dynamic loadings are established

  20. Dye-enhanced protein solders and patches in laser-assisted tissue welding.

    Science.gov (United States)

    Small, W; Heredia, N J; Maitland, D J; Da Silva, L B; Matthews, D L

    1997-01-01

    This study examines the use of dye-enhanced protein bonding agents in 805 nm diode laser-assisted tissue welding. A comparison of an albumin liquid solder and collagen solid-matrix patches used to repair arteriotomies in an in vitro porcine model is presented. Extrinsic bonding media in the form of solders and patches have been used to enhance the practice of laser tissue welding. Preferential absorption of the laser wavelength has been achieved by the incorporation of chromophores. Both the solder and the patch included indocyanine green dye (ICG) to absorb the 805 nm continuous-wave diode laser light used to perform the welds. Solder-mediated welds were divided into two groups (high power/short exposure and low power/long exposure), and the patches were divided into three thickness groups ranging from 0.1 to 1.3 mm. The power used to activate the patches was constant, but the exposure time was increased with patch thickness. Burst pressure results indicated that solder-mediated and patched welds yielded similar average burst strengths in most cases, but the patches provided a higher success rate (i.e., more often exceeded 150 mmHg) and were more consistent (i.e., smaller standard deviation) than the solder. The strongest welds were obtained using 1.0-1.3 mm thick patches, while the high power/short exposure solder group was the weakest. Though the solder and patches yielded similar acute weld strengths, the solid-matrix patches facilitated the welding process and provided consistently strong welds. The material properties of the extrinsic agents influenced their performance.

  1. Papers from the Conference on Homeland Protection

    Science.gov (United States)

    2000-09-01

    interdependent global players owing allegiance to private shareholders vs . franchised citizens. Whose reality are we discussing here? As to Fidelity’s... entrepreneurship , to even pop culture. However, that supremacy, that leadership for the past 10 years that everyone took for granted—we in the United States, and...Terrorism Vs Individual Liberties,” San Francisco Chronicle, September 22, 1999, p. 22, available at http://ebird.dtic. mil/Sep1999/s19990923threats.htm

  2. Efficient sorting of Bessel beams [Conference paper

    CSIR Research Space (South Africa)

    Mhlanga, T

    2013-02-01

    Full Text Available measured in entanglement and shown an increased spiral bandwidth17. Exploiting these properties of Bessel beams will make them very useful in the field of long-range, broad bandwidth communication systems. However, in order for these fields to be a... success in the area of optical communication, efficient techniques for extracting the information they carry (i.e. their azimuthal mode indices) need to exist. The ‘fork’ diffraction grating can be used to couple light of a particular OAM state into a...

  3. Papers of the annual welding conference

    International Nuclear Information System (INIS)

    1981-01-01

    Interest will be mainly focussed on structural welding in the fields of vehicle, power generating plant, railway bridge, reactor, tank and pipeline construction as well as energy transmission, energy production and space travel. Also under discussion will be such topical subjects as health and safety and the use of welding robots in the automobile industry, both these topics bearing direct relation to one another, at it is the labour-saving and health aspects which take precedence in both areas and to which medical experts are making valuable contributions to an ever increasing extent. (orig./IHOE) [de

  4. Papers: Congresses and Conferences, 2002-2003

    International Nuclear Information System (INIS)

    2004-01-01

    Empresarios Agrupados (EA) is a leading architect-engineering organisation in Spain with significant international experience, providing a complete range of consulting, project management,engineering and design, procurement, construction, management, plant testing, safety assessment, quality assurance, as well as plant operation and maintenance support services to the electric utility industry. Founded in 1971, EA has a permanent multidisciplinary staff of approximately 1000, 65% of whom are university graduates, involved in engineering projects and services in the electric utility sector. Serving the electric utility industry is one of EA's primary objectives as an architect-engineering company. In the field of power generation, EA's work includes the design, construction and operation support of nuclear, fossil-fired and hydroelectric power plants and radioactive waste management facilities, as well as the safety assessment, modernisation, backfitting, re powering and life extension of operating plants and facilities. Services provided by EA in the field of power generation are: . Feasibility studies . Site selection and project development studies . Project management . Engineering and design . Procurement management . Construction management . Plant testing and startup . Plant operation and maintenance . Quality assurance/quality control EA has been the Architect-Engineer of power plant projects totalling more than 21,000 MWe of power generating capacity worldwide

  5. Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States); Burress, R.V. [SEHO (United States)] [and others

    1995-06-01

    The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

  6. Effect of gamma radiation on micromechanical hardness of lead-free solder joint

    Energy Technology Data Exchange (ETDEWEB)

    Paulus, Wilfred [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Malaysian Nuclear Agency, Bangi, 43000 Kajang, Selangor (Malaysia); Rahman, Irman Abdul; Jalar, Azman; Kamil, Insan; Bakar, Maria Abu [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Yusoff, Wan Yusmawati Wan [Universiti Pertahanan Nasional Malaysia, Kem Sg. Besi, 57000 Kuala Lumpur (Malaysia)

    2015-09-25

    Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the increment of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.

  7. Characterization of the microstructure of tin-silver lead free solder

    Energy Technology Data Exchange (ETDEWEB)

    Hurtony, Tamás, E-mail: hurtony@ett.bme.hu [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary); Szakál, Alex; Almásy, László [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Len, Adél [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Faculty of Engineering and Information Technology, University of Pécs (Hungary); Kugler, Sándor [Department of Theoretical Physics, Budapest University of Technology and Economics (Hungary); Bonyár, Attila; Gordon, Péter [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary)

    2016-07-05

    Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag{sub 3}Sn phases.

  8. A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

    Science.gov (United States)

    Wei, Helin; Wang, Kuisheng

    2011-11-01

    Numerous studies of the reliability of solder joints have been performed. Most life prediction models are limited to a deterministic approach. However, manufacturing induces uncertainty in the geometry parameters of solder joints, and the environmental temperature varies widely due to end-user diversity, creating uncertainties in the reliability of solder joints. In this study, a methodology for accounting for variation in the lifetime prediction for lead-free solder joints of ball grid array packages (PBGA) is demonstrated. The key aspects of the solder joint parameters and the cyclic temperature range related to reliability are involved. Probabilistic solutions of the inelastic strain range and thermal fatigue life based on the Engelmaier model are developed to determine the probability of solder joint failure. The results indicate that the standard deviation increases significantly when more random variations are involved. Using the probabilistic method, the influence of each variable on the thermal fatigue life is quantified. This information can be used to optimize product design and process validation acceptance criteria. The probabilistic approach creates the opportunity to identify the root causes of failed samples from product fatigue tests and field returns. The method can be applied to better understand how variation affects parameters of interest in an electronic package design with area array interconnections.

  9. A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

    Directory of Open Access Journals (Sweden)

    Enrico Mick

    2015-07-01

    Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

  10. The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints.

    Science.gov (United States)

    Fattahi, Farnaz; Hashemi Ardakani, Zahra; Hashemi Ardakani, Maryam

    2015-12-01

    Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint of the bar, and were placed at the considered angles by employing an explicitly designed device. They were divided into 4 groups regarding the gap angle; Group C (control group) with parallel gap on steady distance of 0.2mm, Group 1: 10°, Group 2: 20°, and Group3: 30° gap angles. When soldered, the specimens were all tested for tensile strength using a universal testing machine at a cross-head speed of 0.5 mm/min with a preload of 10N. Kruskal-Wallis H test was used to compare tensile strength among the groups (ptensile strength values obtained from the study groups were respectively 307.84, 391.50, 365.18, and 368.86 MPa. The tensile strength was not statistically different among the four groups in general (p≤ 0.490). Making the gap angular at the solder joints and the subsequent unsteady increase of the gap distance would not change the tensile strength of the joint.

  11. Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

    International Nuclear Information System (INIS)

    Durairaj, R.; Ramesh, S.; Mallik, S.; Seman, A.; Ekere, N.

    2009-01-01

    Lead-free solder paste printing process accounts for majority of the assembly defects in the electronic manufacturing industry. The study investigates rheological behaviour and stencil printing performance of the lead-free solder pastes (Sn/Ag/Cu). Oscillatory stress sweep test was carried out to study the visco-elastic behaviour of the lead-free solder pastes. The visco-elastic behaviour of the paste encompasses solid and liquid characteristic of the paste, which could be used to study the flow behaviour experienced by the pastes during the stencil printing process. From this study, it was found that the solid characteristics (G') is higher than the liquid characteristic (G'') for the pastes material. In addition, the results from the study showed that the solder paste with a large G' = G'' has a higher cohesiveness resulting in poor withdrawal of the paste during the stencil printing process. The phase angles (δ) was used to correlate the quality of the dense suspensions to the formulation of solder paste materials. This study has revealed the value of having a rheological measurement for explaining and characterising solder pastes for stencil printing. As the demand for lead free pastes increases rheological measurements can assist with the formulation or development of new pastes.

  12. Study on interfacial reaction between lead-free solders and alternative surface finishes

    International Nuclear Information System (INIS)

    Siti Rabiatul Aisha; Ourdjini, A.; Saliza Osman

    2007-01-01

    This study investigates the interfacial reactions occurring during reflow soldering between Sn-Ag-Cu lead-free solder and two surface finishes: electroless nickel/ immersion gold (ENIG) and immersion silver (IAg). The study focuses on interfacial reactions evolution and growth kinetics of intermetallic compounds (IMC) formed during soldering and isothermal ageing at 150 degree Celsius for up to 2000 hours. Optical and scanning electron microscopy were used to measure IMC thickness and examine the morphology of IMC respectively, whereas the IMC phases were identified by energy dispersive X-ray analysis (EDX). The results showed that the IMC formed on ENIG finish is thinner compared to that formed on IAg finish. For IAg surface finish, Cu 6 Sn 5 IMCs with scallop morphology are formed at the solder/ surface finish interface after reflow while a second IMC, Cu 3 Sn was formed between the copper and Cu 6 Sn 5 IMC after the isothermal ageing treatment. For ENIG surface finish both (Cu,Ni) 6 Sn 5 and (Ni,Cu) 3 Sn 4 are formed after soldering. Isothermal aging of the solder joints formed on ENIG finish was found to have a significant effect on the morphology of the intermetallics by transforming to more spherical and denser morphology in addition to increase i their thickness with increased ageing time. (author)

  13. Investigation on solder joint strength of nickel tin-plated and CRS tabs with PCB

    International Nuclear Information System (INIS)

    Luay Hussain

    2002-01-01

    Failure analysis on easily peels off Nickel and CRS steel tabs from PCB was carried out. Nickel Tin plated tabs, CRS steel tabs and tube were joined to the PCB using reflow/ convection soldering, in an oven. The solder paste composition is Sn36/Pb35/Ag2. Peel test was conducted and it was found that many tabs could be easily peeled off with low force. Porosities which varies from 0.4 mm to < 0.01mm in diameter, developed during soldering process and solidification was noted. It was found, the number, size and position of these porosities inside the solder layer on both parts of the tabs affect the peel strength. Scanning Electron Microscopy study and EDX analysis were carried out. It was found that the low peel strength values were due to the combination of generation and development of porosities during soldering process which act as stress concentrators and the evolution (growth) of eutectic Sn/Pb and Sn/Ni/Cu brittle grainy phase. Large eutectic microstructure with brittle Sn-Ni-Cu grainy phase enhances the failure with low peeling forces. Sample showing no feature of Sn/Ni/Cu grain gave high peeling strength value. Solder reflow, an important process, can result in strength enhancement (if it was controlled for example in a furnace). (Author)

  14. 2nd SUMO Conference

    CERN Document Server

    Weber, Melanie

    2015-01-01

    This contributed volume contains the conference proceedings of the Simulation of Urban Mobility (SUMO) conference 2014, Berlin. The included research papers cover a wide range of topics in traffic planning and simulation, including open data, vehicular communication, e-mobility, urban mobility, multimodal traffic as well as usage approaches. The target audience primarily comprises researchers and experts in the field, but the book may also be beneficial for graduate students.  

  15. Multiphoton processes: conference proceedings

    Energy Technology Data Exchange (ETDEWEB)

    Lambropoulos, P.; Smith, S.J. (eds.)

    1984-01-01

    The chapters of this volume represent the invited papers delivered at the conference. They are arranged according to thermatic proximity beginning with atoms and continuing with molecules and surfaces. Section headings include multiphoton processes in atoms, field fluctuations and collisions in multiphoton process, and multiphoton processes in molecules and surfaces. Abstracts of individual items from the conference were prepared separately for the data base. (GHT)

  16. Citations to Conference Papers Indicate They Are Declining in Importance across All Discipline Areas. A Review of: Lisée, Cynthia, Vincent Larivière and Eric Archambault. ‚Conference Proceedings as a Source of Scientific Information: A Bibliometric Analysis.‛ Journal of the American Society for Information Science and Technology 59.11 (2008: 1776-84.

    Directory of Open Access Journals (Sweden)

    Gaby Haddow

    2009-06-01

    Full Text Available Objective – To compare the impact and ageing of conference proceedings with that of scientific literature in general, as reflected in citation characteristics.Design – Citation analysis.Setting – Thomson’s Science Citation Index, Social Science Citation Index, and Arts and Humanities Citation Index (CD-ROM version.Subjects – Conference proceedings citations.Methods – The Thomson citation indexes were searched to identify all citations to conference proceedings in natural sciences and engineering (NSE and social sciences and humanities (SSH from 1980 to 2005. Keywords in English, Spanish, Italian and German, truncated terms (such as ‘bienn’, single letters (such as P, and numbers were combined to retrieve all possible citations. Additional filters to exclude citations to publications other than proceedings were applied to the P search results, which had accounted for 75% of the total results. The references remaining in the P search set were validated using Google Scholar and WorldCat. Finally, two random samples of 1,000 references were checked manually to determine the extent of false positives and false negatives in the results.Main Results – The study’s findings are presented for NSE and SSH separately, with 1.7% of NSE citations and 2.5% of SSH citations referring to conference proceedings. The total number of citations to proceedings has increased over the period 1980-2005, however, citations to proceedings in NSE and SSH as a proportion of all citations decreased during this time. A small increase in the average number of proceedings citations per paper was found for NSE and SSH. When this increase is compared to the overall increase in references per paper over this period, the share of proceedings citations per paper has decreased. Of all fields in NSE and SSH, only engineering has increased the proportion of proceedings citations, rising from 7% to 10% in the period studied. In 2005, the share of proceedings

  17. Setup Time Reduction On Solder Paste Printing Machine – A Case Study

    Directory of Open Access Journals (Sweden)

    Rajesh Dhake

    2013-06-01

    Full Text Available Lean manufacturing envisages the reduction of the seven deadly wastes referred to as MUDA. Setup time forms a major component of the equipment downtime. It leads to lower machine utilization and restricts the output and product variety. This necessitates the requirement for quick setups. Single Minute Exchange of Die philosophy (a lean manufacturing tool here after referred as “SMED” is one of the important tool which aims at quick setups driving smaller lot sizes, lower production costs, improve productivity in terms of increased output, increased utilization of machine and labor hours, make additional capacity available (often at bottleneck resources, reduce scrap and rework, and increase flexibility[3]. This paper focuses on the application of Single Minute Exchange of Die[1] and Quick Changeover Philosophy[2] for reducing setup time on Solder Past Printing Machine (bottleneck machine in a electronic speedo-cluster manufacturing company. The four step SMED philosophy was adopted to effect reduction in setup time. The initial step was gathering information about the present setup times and its proportion to the total productive time. A detailed video based time study of setup activities was done to classify them into external and internal setup activities in terms of their need (i.e. preparation, replacement or adjustment, time taken and the way these could be reduced, simplified or eliminated. The improvements effected were of three categories viz., mechanical, procedural and organizational. The paper concludes by comparing the present and proposed (implemented methods of setup procedures.

  18. A wireless intraocular pressure monitoring device with a solder-filled microchannel antenna

    International Nuclear Information System (INIS)

    Varel, Çağdaş; Shih, Yi-Chun; Otis, Brian P; Böhringer, Karl F; Shen, Tueng S

    2014-01-01

    This paper presents the prototype of an intraocular pressure sensor as a major step toward building a device that can be permanently implanted during cataract surgery. The implantation will proceed through an incision of 2–3 mm using an injector, during which the complete device must be folded into a cross-section of 2 mm × 1 mm. The device uses radio frequency (RF) for wireless power and data transfer. The prototype includes an antenna, an RF chip and a pressure sensor assembled on a printed circuit board with several circuit components used for testing and calibration. The antenna is fabricated and integrated with the circuit using a fabrication method employing solder-filled microchannels embedded in an elastomer. The monitoring device is powered at 2.716 GHz from a distance of 1–2 cm. The prototype has undergone electrical and mechanical tests for antenna and sensor performance. The flexible antenna can withstand a stress of 33.4 kPa without any electrical disconnection. It did not show a significant increase in electrical resistance after 50 bending cycles with a maximum applied stress of 116 kPa. Transmitted pressure data shows an averaged sensitivity of 16.66 Hz (mm-Hg) –1 . (paper)

  19. Conference summaries

    International Nuclear Information System (INIS)

    1991-01-01

    This volume contains conference summaries for the 31. annual conference of the Canadian Nuclear Association and the 12. annual conference of the Canadian Nuclear Society. Topics of discussion include: reactor physics; thermalhydraulics; industrial irradiation; computer applications; fuel channel analysis; small reactors; severe accidents; fuel behaviour under accident conditions; reactor components, safety related computer software; nuclear fuel management; fuel behaviour and performance; reactor safety; reactor engineering; nuclear waste management; and, uranium mining and processing

  20. INTERCARTO CONFERENCES

    OpenAIRE

    Vladimir Tikunov

    2010-01-01

    The InterCarto conferences are thematically organized to target one of the most pressing problems of modern geography—creation and use of geographical information systems (GISs) as effective tools for achieving sustainable development of territories. Over the years, from 1994 to 2009, 1872 participants from 51 countries and 156 cities, who made 1494 reports, attended the conferences. There were 1508 participants from 49 regions of Russia making 1340 presentations. The conferences hosted 31 di...