Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint.

Science.gov (United States)

Lee, Sang-Yeob; Lee, Jong-Hyuk

2010-12-01

The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

Spectroscopic investigation of oxidized solder surfaces

International Nuclear Information System (INIS)

Song, Jenn-Ming; Chang-Chien, Yu-Chien; Huang, Bo-Chang; Chen, Wei-Ting; Shie, Chi-Rung; Hsu, Chuang-Yao

2011-01-01

Highlights: → UV-visible spectroscopy is successfully used to evaluate the degree of discoloring of solders. → The surface oxides of solders can also be identified by UV-visible absorption spectra. → The discoloration of solder surface can be correlated with optical characterization of oxides. → A strategy against discoloring by alloying was also suggested. - Abstract: For further understanding of the discoloration of solder surfaces due to oxidation during the assembly and operation of electronic devices, UV-vis and X-ray photoelectron spectroscopic analyses were applied to evaluate the degree of discoloring and identify the surface oxides. The decrease in reflectance of the oxidized solder surface is related to SnO whose absorption band is located within the visible region. A trace of P can effectively depress the discoloration of solders under both solid and semi-solid states through the suppression of SnO.

Solderability study of RABiTS-based YBCO coated conductors

International Nuclear Information System (INIS)

Zhang Yifei; Duckworth, Robert C.; Ha, Tam T.; Gouge, Michael J.

2011-01-01

Study examines the implication of solder and flux selection in YBCO splice joints. Focus is on commercially available RABiTS-based YBCO coated conductors. Solderability varied with solder and flux for three different stabilizations tested. Resistivity of stabilizer was dominant factor in splice joint resistance. Solder materials affected splice joint resistance when solderability was poor. The solderability of commercially available YBa 2 Cu 3 O 7-x (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

Optimal parameters for laser tissue soldering

Science.gov (United States)

McNally-Heintzelman, Karen M.; Sorg, Brian S.; Chan, Eric K.; Welch, Ashley J.; Dawes, Judith M.; Owen, Earl R.

1998-07-01

Variations in laser irradiance, exposure time, solder composition, chromophore type and concentration have led to inconsistencies in published results of laser-solder repair of tissue. To determine optimal parameters for laser tissue soldering, an in vitro study was performed using an 808-nm diode laser in conjunction with an indocyanine green (ICG)- doped albumin protein solder to weld bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The effects of laser irradiance and exposure time on tensile strength of the weld and temperature rise as well as the effect of hydration on bond stability were investigated. Optimum irradiance and exposure times were identified for each solder type. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the weld. A reduction in dye concentration from 2.5 mg/ml to 0.25 mg/ml was also found to result in an increase in tensile strength. The strongest welds were produced with an irradiance of 6.4 W/cm2 for 50 s using a solid protein solder composed of 60% BSA and 0.25 mg/ml ICG. Steady-state solder surface temperatures were observed to reach 85 plus or minus 5 degrees Celsius with a temperature gradient across the solid protein solder strips of between 15 and 20 degrees Celsius. Finally, tensile strength was observed to decrease significantly (20 to 25%) after the first hour of hydration in phosphate-buffered saline. No appreciable change was observed in the strength of the tissue bonds with further hydration.

Handbook of machine soldering SMT and TH

CERN Document Server

Woodgate, Ralph W

1996-01-01

A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

Photothermal effects of laser tissue soldering

International Nuclear Information System (INIS)

McNally, K.M.; Sorg, B.S.; Welch, A.J.; Dawes, J.M.; Owen, E.R.

1999-01-01

Low-strength anastomoses and thermal damage of tissue are major concerns in laser tissue welding techniques where laser energy is used to induce thermal changes in the molecular structure of the tissues being joined, hence allowing them to bond together. Laser tissue soldering, on the other hand, is a bonding technique in which a protein solder is applied to the tissue surfaces to be joined, and laser energy is used to bond the solder to the tissue surfaces. The addition of protein solders to augment tissue repair procedures significantly reduces the problems of low strength and thermal damage associated with laser tissue welding techniques. Investigations were conducted to determine optimal solder and laser parameters for tissue repair in terms of tensile strength, temperature rise and damage and the microscopic nature of the bonds formed. An in vitro study was performed using an 808 nm diode laser in conjunction with indocyanine green (ICG)-doped albumin protein solders to repair bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The efficacy of temperature feedback control in enhancing the soldering process was also investigated. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the repairs. A reduction in dye concentration from 2.5mgml -1 to 0.25mgml -1 was also found to result in an increase in tensile strength. Increasing the laser irradiance and thus surface temperature resulted in an increased severity of histological injury. Thermal denaturation of tissue collagen and necrosis of the intimal layer smooth muscle cells increased laterally and in depth with higher temperatures. The strongest repairs were produced with an irradiance of 6.4Wcm -2 using a solid protein solder composed of 60% BSA and 0.25mgml -1 ICG. Using this combination of laser and solder parameters, surface temperatures were observed to reach 85±5 deg. C with a

Solar-powered ventilation of African termite mounds.

Science.gov (United States)

Ocko, Samuel A; King, Hunter; Andreen, David; Bardunias, Paul; Turner, J Scott; Soar, Rupert; Mahadevan, L

2017-09-15

How termite mounds function to facilitate climate control is still only partially understood. Recent experimental evidence in the mounds of a single species, the south Asian termite Odontotermes obesus , suggests that the daily oscillations of radiant heating associated with diurnal insolation patterns drive convective flow within them. How general this mechanism is remains unknown. To probe this, we consider the mounds of the African termite Macrotermes michaelseni , which thrives in a very different environment. By directly measuring air velocities and temperatures within the mound, we see that the overall mechanisms and patterns involved are similar to that in the south Asian species. However, there are also some notable differences between the physiology of these mounds associated with the temporal variations in radiant heating patterns and CO 2 dynamics. Because of the difference between direct radiant heating driven by the position of the sun in African conditions, and the more shaded south Asian environments, we see changes in the convective flows in the two types of mounds. Furthermore, we also see that the south Asian mounds show a significant overturning of stratified gases, once a day, while the African mounds have a relatively uniform concentration of CO 2 Overall, our observations show that despite these differences, termite architectures can harness periodic solar heating to drive ventilation inside them in very different environments, functioning as an external lung, with clear implications for human engineering. © 2017. Published by The Company of Biologists Ltd.

Rubble Mound Breakwater Failure Modes

DEFF Research Database (Denmark)

Burcharth, H. F.; Z., Liu

1995-01-01

The RMBFM-Project (Rubble Mound Breakwater Failure Modes) is sponsored by the Directorate General XII of the Commission of the European Communities under the Contract MAS-CT92- 0042, with the objective of contributing to the development of rational methods for the design of rubble mound breakwate...

Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/ Pd/ Au surface finishes

International Nuclear Information System (INIS)

NorAkmal, F.; Ourdjini, A.; Azmah Hanim, M.A.; Siti Aisha, I.; Chin, Y.T.

2007-01-01

Flip chip technology provides the ultimate in high I/ O-density and count with superior electrical performance for interconnecting electronic components. Therefore, the study of the intermetallic compounds was conducted to investigate the effect of solder bumps sizes on several surface finishes which are copper and Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) which is widely used in electronics packaging as surface finish for flip-chip application nowadays. In this research, field emission scanning electron microscopy (FESEM) analysis was conducted to analyze the morphology and composition of intermetallic compounds (IMCs) formed at the interface between the solder and UBM. The IMCs between the SAC lead-free solder with Cu surface finish after reflow were mainly (Cu, Ni) 6 Sn 5 and Cu 6 Sn 5 . While the main IMCs formed between lead-free solder on ENEPIG surface finish are (Ni, Cu) 3 Sn 4 and Ni 3 Sn 4 . The results from FESEM with energy dispersive x-ray (EDX) have revealed that isothermal aging at 150 degree Celsius has caused the thickening and coarsening of IMCs as well as changing them into more spherical shape. The thickness of the intermetallic compounds in both finishes investigated was found to be higher in solders with smaller bump size. From the experimental results, it also appears that the growth rate of IMCs is higher when soldering on copper compared to ENEPIG finish. Besides that, the results also showed that the thickness of intermetallic compounds was found to be proportional to isothermal aging duration. (author)

Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

Directory of Open Access Journals (Sweden)

Roman Koleňák

2018-04-01

Full Text Available The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In, in which the phases of titanium (Ti3In4 and silver (AgIn2 are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg6In5 and (AgCuIn2. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

Analysis of Rubble Mound Breakwaters

DEFF Research Database (Denmark)

Mettam, J.D.; Allsop, N.W.H.; Bonafous, P.

Working Group 12 was set up to consider the analysis of rubble mound breakwaters with a view to achieving a better understanding of safety aspects. The working group decided to develop the practical application of risk analysis in the design of rubble mound breakwaters by using partial coefficien...

Interface between Sn-Sb-Cu solder and copper substrate

Energy Technology Data Exchange (ETDEWEB)

Sebo, P., E-mail: Pavel.Sebo@savba.sk [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Racianska 75, 831 02 Bratislava 3 (Slovakia); Svec, P. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janickovic, D.; Illekova, E. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine)

2011-07-15

Highlights: {yields} New lead-free solder materials based on Sn-Sb-Cu were designed and prepared. {yields} Melting and solidification temperatures of the solders have been determined. {yields} Cu-substrate/solder interaction has been analyzed and quantified. {yields} Phases formed at the solder-substrate interface have been identified. {yields} Composition and soldering atmospheres were correlated with joint strength. - Abstract: Influence of antimony and copper in Sn-Sb-Cu solder on the melting and solidification temperatures and on the microstructure of the interface between the solder and copper substrate after wetting the substrate at 623 K for 1800 s were studied. Microstructure of the interface between the solder and copper substrates in Cu-solder-Cu joints prepared at the same temperature for 1800 s was observed and shear strength of the joints was measured. Influence of the atmosphere - air with the flux and deoxidising N{sub 2} + 10H{sub 2} gas - was taken into account. Thermal stability and microstructure were studied by differential scanning calorimetry (DSC), light microscopy, scanning electron microscopy (SEM) with energy-dispersive spectrometry (EDS) and X-ray diffraction (XRD). Melting and solidification temperatures of the solders were determined. An interfacial transition zone was formed by diffusion reaction between solid copper and liquid solder. At the interface Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} phases arise. Cu{sub 3}Sn is adjacent to the Cu substrate and its thickness decreases with increasing the amount of copper in solder. Scallop Cu{sub 6}Sn{sub 5} phase is formed also inside the solder drop. The solid solution Sn(Sb) and SbSn phase compose the interior of the solder drop. Shear strength of the joints measured by push-off method decreases with increasing Sb concentration. Copper in the solder shows even bigger negative effect on the strength.

Soldering of Mg Joints Using Zn-Al Solders

Science.gov (United States)

Gancarz, Tomasz; Berent, Katarzyna; Skuza, Wojciech; Janik, Katarzyna

2018-04-01

Magnesium has applications in the automotive and aerospace industries that can significantly contribute to greater fuel economy and environmental conservation. The Mg alloys used in the automotive industry could reduce mass by up to 70 pct, providing energy savings. However, alongside the advantages there are limitations and technological barriers to use Mg alloys. One of the advantages concerns phenomena occurring at the interface when joining materials investigated in this study, in regard to the effect of temperature and soldering time for pure Mg joints. Eutectic Zn-Al and Zn-Al alloys with 0.05 (wt pct) Li and 0.2 (wt pct) Na were used in the soldering process. The process was performed for 3, 5, and 8 minutes of contact, at temperatures of 425 °C, 450 °C, 475 °C, and 500 °C. Selected, solidified solder-substrate couples were cross-sectioned, and their interfacial microstructures were investigated by scanning electron microscopy. The experiment was designed to demonstrate the effect of time, temperature, and the addition of Li and Na on the kinetics of the dissolving Mg substrate. The addition of Li and Na to eutectic Zn-Al caused to improve mechanical properties. Higher temperatures led to reduced joint strength, which is caused by increased interfacial reaction.

Formation and Control of Self-Sealing High Permeability Groundwater Mounds in Impermeable Sediment: Implications for SUDS and Sustainable Pressure Mound Management

Directory of Open Access Journals (Sweden)

David D. J. Antia

2009-10-01

Full Text Available A groundwater mound (or pressure mound is defined as a volume of fluid dominated by viscous flow contained within a sediment volume where the dominant fluid flow is by Knudsen Diffusion. High permeability self-sealing groundwater mounds can be created as part of a sustainable urban drainage scheme (SUDS using infiltration devices. This study considers how they form, and models their expansion and growth as a function of infiltration device recharge. The mounds grow through lateral macropore propagation within a Dupuit envelope. Excess pressure relief is through propagating vertical surge shafts. These surge shafts can, when they intersect the ground surface result, in high volume overland flow. The study considers that the creation of self-sealing groundwater mounds in matrix supported (clayey sediments (intrinsic permeability = 10–8 to 10–30 m3 m–2 s–1 Pa–1 is a low cost, sustainable method which can be used to dispose of large volumes of storm runoff (<20→2,000 m3/24 hr storm/infiltration device and raise groundwater levels. However, the inappropriate location of pressure mounds can result in repeated seepage and ephemeral spring formation associated with substantial volumes of uncontrolled overland flow. The flow rate and flood volume associated with each overland flow event may be substantially larger than the associated recharge to the pressure mound. In some instances, the volume discharged as overland flow in a few hours may exceed the total storm water recharge to the groundwater mound over the previous three weeks. Macropore modeling is used within the context of a pressure mound poro-elastic fluid expulsion model in order to analyze this phenomena and determine (i how this phenomena can be used to extract large volumes of stored filtered storm water (at high flow rates from within a self-sealing high permeability pressure mound and (ii how self-sealing pressure mounds (created using storm water infiltration can be used to

Mound site environmental monitoring report for calendar year 1993

International Nuclear Information System (INIS)

1994-08-01

The purpose of this report is to inform the public about the impact of Mound operations on the population and the environment. Mound is a government-owned facility operated by EG ampersand G Mound Applied Technologies for the U.S. Department of Energy (DOE). This integrated production, development, and research site performs work in support of DOE's weapon and energy related programs, with emphasis on explosive, nuclear and energy technologies. The Mound Plant, named after the Miamisburg Indian Mound adjacent to the site, comprises 120 buildings on 124 hectares (306 acres) of land in Miamisburg, Ohio, approximately 16 km (10 mi) southwest of Dayton. The Great Miami River, which flows through the city of Miamisburg, dominates the landscape of the five-county region surrounding Mound. The river valley is highly industrialized. The rest of the region is predominately farm land dotted with light industry and small communities. The climate is moderate. The geologic record preserved in the rocks underlying Mound indicates that the area has been relatively stable since the beginning of the Paleozoic Era more than 500 million years ago. No buildings at Mound are located in a floodplain or in areas considered wetlands. Included in the report are the following: perspective on radiation; radionuclide releases from Mound; Dose limites; doses from Mound Operations; Results of the environmental Monitoring Program; Ground water monitoring program; environmental restoration program; quality assurance for environmental data

An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

Energy Technology Data Exchange (ETDEWEB)

Vianco, P.T.

1998-10-15

A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

Temperature fluctuations inside savanna termite mounds: Do size and plant shade matter?

Science.gov (United States)

Ndlovu, M; Pérez-Rodríguez, A

2018-05-01

Mound building termites are key ecosystem engineers of subtropical savanna regions. Mounds allow termites to maintain suitable conditions for termite reproduction and food cultivation ('fungus gardens'). We studied how the internal mound temperature of Macrotermes natalensis, a dominant mound-building termite of the subtropical savanna of southern Africa, responds to a number of environmental variables. We used general additive mixed models (GAMM) to determine how external temperature, mound size (volume) and the amount of vegetation shade affects mound internal temperature over a 24-h period. Internal mound temperature varied daily following changes of the external temperature, although the range of variation was much smaller. Active termite mounds maintained a higher internal temperature than inactive ones, and mound activity reinforced the positive effect of mound size and moderated the negative effect of vegetation shade on internal temperatures. In turn, external temperature fluctuations equally affected active and inactive mounds. Large mounds maintained near optimal internal temperatures compared to smaller sized mounds. We therefore conclude that termite mound size is a stronger determinant of internal mound temperature stability compared to plant shade cover. Copyright © 2018 Elsevier Ltd. All rights reserved.

Aerodynamics of Ventilation in Termite Mounds

Science.gov (United States)

Bailoor, Shantanu; Yaghoobian, Neda; Turner, Scott; Mittal, Rajat

2017-11-01

Fungus-cultivating termites collectively build massive, complex mounds which are much larger than the size of an individual termite and effectively use natural wind and solar energy, as well as the energy generated by the colony's own metabolic activity to maintain the necessary environmental condition for the colony's survival. We seek to understand the aerodynamics of ventilation and thermoregulation of termite mounds through computational modeling. A simplified model accounting for key mound features, such as soil porosity and internal conduit network, is subjected to external draft conditions. The role of surface flow conditions in the generation of internal flow patterns and the ability of the mound to transport gases and heat from the nursery are examined. The understanding gained from our study could be used to guide sustainable bio-inspired passive HVAC system design, which could help optimize energy utilization in commercial and residential buildings. This research is supported by a seed Grant from the Environment, Energy Sustainability and Health Institute of the Johns Hopkins University.

High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

DEFF Research Database (Denmark)

High-temperature solders have been widely used as joining materials to provide stable interconnections that resist a severe thermal environment and also to facilitate the drive for miniaturization. High-lead containing solders have been commonly used as high-temperature solders. The development...... of high-temperature lead-free solders has become an important issue for both the electronics and automobile industries because of the health and environmental concerns associated with lead usage. Unfortunately, limited choices are available as high-temperature lead-free solders. This work outlines...... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

Laser-activated protein solder for peripheral nerve repair

Science.gov (United States)

Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

1995-05-01

A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

Features of soldering of molybdenum a lols

International Nuclear Information System (INIS)

Grishin, V.L.; Rybkin, B.V.; Cherkasov, A.F.

1980-01-01

Soldering features of complex-alloy molybdenum alloys were investigated in comparison with alloys based on solid solutions. Soldering features of heterogeneous molybdenum base alloys were investigated using samples of 0.5-1.O mm sheets with the strain of about 95% made of ingots which had been smelted in arc vacuum furnaces. The soldering of samples was carried out in 5x1O -5 mm Hg vacuum using different sources of heating: radiation, electron-ray and contact. It was shown that heat-resisting soldered joints of heterogeneous molybdenum alloys could be produced using zirconium and niobium base solders containing the most effective hardeners of the parent material (titanum, vanadium, tantalum, molybdenum, tungsten). To preserve high mechanical properties of heterogeneous alloys it was expedient to use for welding local heating sources which permitted to decrease considerably temperature- time conditions of the process

The constitutive response of three solder materials

International Nuclear Information System (INIS)

Perez-Bergquist, Alejandro G.; Cao Fang; Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T.

2012-01-01

Highlights: ► The full constitutive response of three solder materials. ► Test temperatures from −196 °C to 60 °C and strain rates from 10 −3 to >10 3 s −1 . ► Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (−196 °C to 60 °C) and strain rate (10 −3 to >10 3 s −1 ). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

Microstructure evolution and thermomechanical fatigue of solder materials

NARCIS (Netherlands)

Matin, M.A.

2005-01-01

The microelectronics industry is confronted with the new challenge to produce joints with lead-free solder materials replacing classical tin-lead solders in devices used in many fields (e.g. consumer electronics, road transport, aviation, space-crafts, telecommunication). In service, solder

Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

Science.gov (United States)

Huang, Chien-Sheng; Jang, Guh-Yaw; Duh, Jenq-Gong

2004-04-01

Nickel-based under bump metallization (UBM) has been widely used as a diffusion barrier to prevent the rapid reaction between the Cu conductor and Sn-based solders. In this study, joints with and without solder after heat treatments were employed to evaluate the diffusion behavior of Cu in the 63Sn-37Pb/Ni/Cu/Ti/Si3N4/Si multilayer structure. The atomic flux of Cu diffused through Ni was evaluated from the concentration profiles of Cu in solder joints. During reflow, the atomic flux of Cu was on the order of 1015-1016 atoms/cm2s. However, in the assembly without solder, no Cu was detected on the surface of Ni even after ten cycles of reflow. The diffusion behavior of Cu during heat treatments was studied, and the soldering-process-induced Cu diffusion through Ni metallization was characterized. In addition, the effect of Cu content in the solder near the solder/intermetallic compound (IMC) interface on interfacial reactions between the solder and the Ni/Cu UBM was also discussed. It is evident that the (Cu,Ni)6Sn5 IMC might form as the concentration of Cu in the Sn-Cu-Ni alloy exceeds 0.6 wt.%.

Laser assisted soldering: microdroplet accumulation with a microjet device.

Science.gov (United States)

Chan, E K; Lu, Q; Bell, B; Motamedi, M; Frederickson, C; Brown, D T; Kovach, I S; Welch, A J

1998-01-01

We investigated the feasibility of a microjet to dispense protein solder for laser assisted soldering. Successive micro solder droplets were deposited on rat dermis and bovine intima specimens. Fixed laser exposure was synchronized with the jetting of each droplet. After photocoagulation, each specimen was cut into two halves at the center of solder coagulum. One half was fixed immediately, while the other half was soaked in phosphate-buffered saline for a designated hydration period before fixation (1 hour, 1, 2, and 7 days). After each hydration period, all tissue specimens were prepared for scanning electron microscopy (SEM). Stable solder coagulum was created by successive photocoagulation of microdroplets even after the soldered tissue exposed to 1 week of hydration. This preliminary study suggested that tissue soldering with successive microdroplets is feasible even with fixed laser parameters without active feedback control.

Thermomechanical fatigue life prediction for several solders

Science.gov (United States)

Wen, Shengmin

Since solder connections operate at high homologous temperature, solders are high temperature materials. This feature makes their mechanical behavior and fatigue phenomena unique. Based on experimental findings, a physical damage mechanism is introduced for solders. The mechanism views the damage process as a series of independent local damage events characterized by the failure of individual grains, while the structural damage is the eventual percolation result of such local events. Fine's dislocation energy density concept and Mura's microcrack initiation theory are adopted to derive the fatigue formula for an individual grain. A physical damage metric is introduced to describe the material with damage. A unified creep and plasticity constitutive model is adopted to simulate the mechanical behavior of solders. The model is cast into a continuum damage mechanics framework to simulate material with damage. The model gives good agreement with the experimental results of 96.5Pb-3.5Sn and 96.5Sn-3.5Ag solders under uniaxial strain-controlled cyclic loading. The model is convenient for implementation into commercial computational packages. Also presented is a fatigue theory with its failure criterion for solders based on physical damage mechanism. By introducing grain orientation into the fatigue formula, an m-N curve (m is Schmid factor) at constant loading condition is suggested for fatigue of grains with different orientations. A solder structure is defined as fatigued when the damage metric reaches a critical threshold, since at this threshold the failed grains may form a cluster and percolate through the structure according to percolation theory. Fatigue data of 96.5Pb-3.5Sn solder bulk specimens under various uniaxial tension tests were analyzed. Results show that the theory gives consistent predictions under broad conditions, while inelastic strain theory does not. The theory is anisotropic with no size limitation to its application, which could be suitable for

Soldering of copper-clad niobium--titanium superconductor composite

International Nuclear Information System (INIS)

Moorhead, A.J.; Woodhouse, J.J.; Easton, D.S.

1977-04-01

When superconductivity is applied to various electrical devices, the joining of the superconducting material and the performance of the joints are generally crucial to the successful operation of the system. Although many techniques are being considered for joining composite superconductors, soldering is the most common. We determined the wetting and flow behavior of various solder and flux combinations on a copper-clad Nb-Ti composite, developed equipment and techniques for soldering and inspection of lap joints, and determined the shear strength of joints at temperatures down to -269 0 C (4 0 K). We studied 15 solders and 17 commercial and experimental fluxes in the wettability and flow tests. A resistance unit was built for soldering test specimens. A series of samples soldered with 80 Pb-20 Sn, 83 Pb-15 Sn-2 Sb, 97.5 Pb-1.5 Ag-1 Sn, 80 In-15 Pb-5 Ag, or 25 In-37.5 Pb-37.5 Sn (wt percent) was inspected by three nondestructive techniques. Through-transmission ultrasound gave the best correlation with nonbond areas revealed in peel tests. Single-lap shear specimens soldered with 97.5 Pb-1.5 Ag-1 Sn had the highest strength (10.44 ksi, 72 MPa) and total elongation (0.074 in., 1.88 mm) at -269 0 C (4 0 K) of four solders tested

Evaluation on the characteristics of tin-silver-bismuth solder

Science.gov (United States)

Xia, Z.; Shi, Y.; Chen, Z.

2002-02-01

Tin-silver-bismuth solder is characterized by its lower melting point, good wetting behavior, and good mechanical property for which it is expected to be a new lead-free solder to replace tin-lead solder. In this article, Sn-3.33Ag-4.83Bi solder was investigated concerning its physical, spreading, and mechanical properties under specific conditions. Cooling curves and DSC results showed that it was close to eutectic composition (m.p. 210° 212 °C). Coefficiency of thermal expansion (CTE) of this solder, between that of PCBs and copper substrates, was beneficial to alleviate the thermal mismatch of the substrates. It was also a good electrical and thermal conductor. Using a rosin-based, mildly activated (RMA) flux, a spreading test indicated that SnAgBi solder paste had good solderability. Meanwhile, the solder had high tensile strength and fracture energy. Its fracture mechanism was a mixture of ductile and brittle fracture morphology. The metallographic and EDAX analyses indicated that it was composed of a tin-based solid solution and some intermetallic compound (IMC) that could strengthen the substrate. However, these large needle-like IMCs would cut the substrate and this resulted in the decreasing of the toughness of the solder.

Diurnal respiration of a termite mound

Science.gov (United States)

King, Hunter; Ocko, Samuel; Mahadevan, L.

2014-11-01

Many species of fungus-harvesting termites build largely empty, massive mound structures which protrude from the ground above their subterranean nests. It has been long proposed that the function of these mounds is to facilitate exchange of heat, humidity, and respiratory gases; this would give the colony a controlled climate in which to raise fungus and brood. However, the specific mechanism by which the mound achieves ventilation has remained a topic of debate, as direct measurement of internal air flows has remained difficult. By directly measuring these elusive, tiny flows with a custom sensor, we find that the mound architecture of the species Odontotermes obesus takes advantage of daily oscillations in ambient temperature to drive convection and gas transport. This contradicts previous theories, which point to internal metabolic heating and external wind as driving forces. Our result, a novel example of deriving useful work from a fluctuating scalar parameter, should contribute to better understanding insect swarm construction and possible development in passive human architecture, both of which have been spurred by previous research on termites. We acknowledge support from HFSP.

The constitutive response of three solder materials

Energy Technology Data Exchange (ETDEWEB)

Perez-Bergquist, Alejandro G., E-mail: alexpb@lanl.gov [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States); Cao Fang [Exxon Mobil Research and Engineering Company, Annadale, NJ 08801 (United States); Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T. [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States)

2012-05-25

Highlights: Black-Right-Pointing-Pointer The full constitutive response of three solder materials. Black-Right-Pointing-Pointer Test temperatures from -196 Degree-Sign C to 60 Degree-Sign C and strain rates from 10{sup -3} to >10{sup 3} s{sup -1}. Black-Right-Pointing-Pointer Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (-196 Degree-Sign C to 60 Degree-Sign C) and strain rate (10{sup -3} to >10{sup 3} s{sup -1}). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

Termite Mounds Effects on Soil Properties in the Atlantic Forest Biome

Directory of Open Access Journals (Sweden)

Sandra Santana de Lima

2018-03-01

Full Text Available ABSTRACT Termites have peculiar activities in the soil, inducing significant changes in the soil properties. The objective of this study was to assess physical and chemical properties and soil organic matter to evaluate the effect of termite activity and termite mounds on the soil. Two toposequences were selected and divided in slope thirds (shoulder, backslope, and footslope. In each of these, four termite mounds were selected. Samples were taken from the soils and termite mounds (top, center, and base along with a variety of termites for identification. Analyses were carried out for physical, soil texture, and chemical properties, as well as for particle size and chemical fractioning of organic matter. The species Cornitermes cumulans was found in all mounds. Soil with termite mound presented higher clay content, acidity, and Al3+ content. Phosphorus contents differed considerably between mound material and soil. Sum of bases and cation exchange capacity of the soil were higher in mounds, and differed within the mounds, according to the sampling height. Total organic carbon and particulate carbon content were highest at the mound base. A marked disparity was observed between the contents of humic substances in the mounds and surrounding soil, with humin fraction differences in distinct topographic position. The high nutrient contents detected in the termite mounds confirm the importance of termites in concentrating nutrients.

Mound site environmental report for calendar year 1992

International Nuclear Information System (INIS)

Bauer, L.R.

1993-07-01

The purpose of this report is to inform the public about the impact of Mound operations on the population and the environment. Mound is a government-owned facility operated by EG ampersand G Mound Applied Technologies for the US Department of Energy (DOE). This integrated production, development, and research site performs work in support of DOE's weapon and energy related programs, with emphasis on explosive, nuclear and energy technologies

Characterization of lead-free solders for electronic packaging

Science.gov (United States)

Ma, Hongtao

The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (Th > 0.5T m even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn-Pb solder alloys. In this research, mechanical measurements of isothermal aging effects and the resulting changes in the materials behavior of lead-free solders were performed. A novel specimen preparation procedure was developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process. Using specimens fabricated with the developed procedure, isothermal aging effects and viscoplastic material behavior evolution have been characterized for 95.5Sn-4.0Ag-0.5Cu (SAC405) and 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solders, which are commonly used as the solder ball alloy in lead-free BGAs and other components. Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Up to 40% reduction in tensile strength was observed for water quenched specimens after two months of aging at room temperature. Creep deformation also increased dramatically with increasing aging durations. Microstructural changes during room temperature aging were also observed and recorded for the solder alloys and correlated with the observed mechanical behavior changes. Aging effects at elevated temperatures for up to 6 months were also investigated. Thermal aging caused significant tensile strength loss and deterioration of creep deformation. The thermal aging results also showed that after an initial tensile strength drop, the Sn-Pb eutectic solder reached a relatively stable stage after 200 hours of aging. However, for SAC alloy, both the tensile and

Shallow water mud-mounds of the Early Devonian Buchan Group, East Gippsland, Australia

Science.gov (United States)

Tosolini, A.-M. P.; Wallace, M. W.; Gallagher, S. J.

2012-12-01

The Lower Devonian Rocky Camp Member of the Murrindal Limestone, Buchan Group of southeastern Australia consists of a series of carbonate mud-mounds and smaller lagoonal bioherms. The Rocky Camp mound is the best exposed of the mud-mounds and has many characteristics in common with Waulsortian (Carboniferous) mounds. Detailed paleoecological and sedimentological studies indicate that the mound initially accumulated in the photic zone, in contrast to most of the previously recorded mud-mounds. Five facies are present in the mud-mound: a Dasycladacean Wackestone Facies at the base of the mound represents a moderate energy, shallow water bank environment within the photic zone. A Crinioidal Wackestone Facies was deposited in a laterally equivalent foreslope setting. A Poriferan-Crinoidal Mudstone Facies developed in a quiet, deeper water, lee-side mound setting associated with a minor relative sea-level rise. A Stromatoporoid-Coralline Packstone Facies in the upper part of the mound deposited in a high-energy, fair-weather wave base, mound-front environment. The crest of the mound is represented by a Crinoidal-Receptaculitid Packstone Facies indicative of a moderate-energy mound-top environment in the photic zone, sheltered by the mound-front stromatoporoid-coral communities. A mound flank facies is present on the southern side of the mound and this consists of high-energy crinoidal grainstones. Mud-mound deposition was terminated by a transgression that deposited dark gray, fossil-poor marl of the overlying Taravale Formation. The Rocky Camp mound appears to have originated in shallow water photic zone conditions and grew into a high-energy environment, with the mound being eventually colonized by corals and stromatoporoids. The indications of a high-energy environment during later mound growth (growth form of colonial metazoans and grainstones of the flanking facies) suggest that the micrite in the mound was autochthonous and implies the presence of an energy

Temporal variability in shell mound formation at Albatross Bay, northern Australia.

Directory of Open Access Journals (Sweden)

Simon J Holdaway

Full Text Available We report the results of 212 radiocarbon determinations from the archaeological excavation of 70 shell mound deposits in the Wathayn region of Albatross Bay, Australia. This is an intensive study of a closely co-located group of mounds within a geographically restricted area in a wider region where many more shell mounds have been reported. Valves from the bivalve Tegillarca granosa (Linnaeus, 1758 were dated. The dates obtained are used to calculate rates of accumulation for the shell mound deposits. These demonstrate highly variable rates of accumulation both within and between mounds. We assess these results in relation to likely mechanisms of shell deposition and show that rates of deposition are affected by time-dependent processes both during the accumulation of shell deposits and during their subsequent deformation. This complicates the interpretation of the rates at which shell mound deposits appear to have accumulated. At Wathayn, there is little temporal or spatial consistency in the rates at which mounds accumulated. Comparisons between the Wathayn results and those obtained from shell deposits elsewhere, both in the wider Albatross Bay region and worldwide, suggest the need for caution when deriving behavioural inferences from shell mound deposition rates, and the need for more comprehensive sampling of individual mounds and groups of mounds.

Termite mounds harness diurnal temperature oscillations for ventilation.

Science.gov (United States)

King, Hunter; Ocko, Samuel; Mahadevan, L

2015-09-15

Many species of millimetric fungus-harvesting termites collectively build uninhabited, massive mound structures enclosing a network of broad tunnels that protrude from the ground meters above their subterranean nests. It is widely accepted that the purpose of these mounds is to give the colony a controlled microclimate in which to raise fungus and brood by managing heat, humidity, and respiratory gas exchange. Although different hypotheses such as steady and fluctuating external wind and internal metabolic heating have been proposed for ventilating the mound, the absence of direct in situ measurement of internal air flows has precluded a definitive mechanism for this critical physiological function. By measuring diurnal variations in flow through the surface conduits of the mounds of the species Odontotermes obesus, we show that a simple combination of geometry, heterogeneous thermal mass, and porosity allows the mounds to use diurnal ambient temperature oscillations for ventilation. In particular, the thin outer flutelike conduits heat up rapidly during the day relative to the deeper chimneys, pushing air up the flutes and down the chimney in a closed convection cell, with the converse situation at night. These cyclic flows in the mound flush out CO2 from the nest and ventilate the colony, in an unusual example of deriving useful work from thermal oscillations.

Solder wetting behavior enhancement via laser-textured surface microcosmic topography

Energy Technology Data Exchange (ETDEWEB)

Chen, Haiyan [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Peng, Jianke [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Fu, Li, E-mail: fuli@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Wang, Xincheng [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Xie, Yan [School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China)

2016-04-15

Graphical abstract: - Highlights: • The wetting angle of lead free solder on Cu was reduced by surface microstructure. • The wetting form of Sn-Ag-Cu solder on Cu was “non-composite surface”. • The experimental results had a sound fit with the theoretical calculation. - Abstract: In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

Utilization of Pb-free solders in MEMS packaging

Science.gov (United States)

Selvaduray, Guna S.

2003-01-01

Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

Mechanical properties of Bi-In-Zn/ Cu solder joint system

International Nuclear Information System (INIS)

Ervina Efzan Mohd Noor; Mohammed Noori Ridha; Ahmad Badri Ismail; Nurulakmal Mohd Sharif; Kuan Yew Cheong; Tadashi Ariga; Zuhailawati Hussain

2009-01-01

Full text: In recent years, the pollution of environment from lead (Pb) and Pb-containing compounds in microelectronic devices attracts more and more attentions in academia and industry; the lead-free solder alloys begin to replace the lead-based solders in packaging process of some devices and components. In this works, microstructure and mechanical properties of different reflow temperature (80, 100, 120 and 140 degree Celsius) for solder joints on shear strength of Bi-In-Zn lead free solder with low melting temperature of 60 degree Celsius on Cu solder joint has been investigated. This paper will compared the mechanical properties of the Bi-In-Zn lead-free solder alloys with current lead-free solder, Sn-Ag-Cu solder alloy. The fracture surface analyses have been observed by Optical Microscope and were investigated by Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX) and proved it by X-ray diffraction (XRD). (author)

Mound facility physical characterization

Energy Technology Data Exchange (ETDEWEB)

Tonne, W.R.; Alexander, B.M.; Cage, M.R.; Hase, E.H.; Schmidt, M.J.; Schneider, J.E.; Slusher, W.; Todd, J.E.

1993-12-01

The purpose of this report is to provide a baseline physical characterization of Mound`s facilities as of September 1993. The baseline characterizations are to be used in the development of long-term future use strategy development for the Mound site. This document describes the current missions and alternative future use scenarios for each building. Current mission descriptions cover facility capabilities, physical resources required to support operations, current safety envelope and current status of facilities. Future use scenarios identify potential alternative future uses, facility modifications required for likely use, facility modifications of other uses, changes to safety envelope for the likely use, cleanup criteria for each future use scenario, and disposition of surplus equipment. This Introductory Chapter includes an Executive Summary that contains narrative on the Functional Unit Material Condition, Current Facility Status, Listing of Buildings, Space Plans, Summary of Maintenance Program and Repair Backlog, Environmental Restoration, and Decontamination and Decommissioning Programs. Under Section B, Site Description, is a brief listing of the Site PS Development, as well as Current Utility Sources. Section C contains Site Assumptions. A Maintenance Program Overview, as well as Current Deficiencies, is contained within the Maintenance Program Chapter.

Geophysical Survey of Poverty Point UNESCO World Heritage Site Mound A

Science.gov (United States)

Frazer, W.; Bourke, J. R.; De Smet, T.; Nikulin, A.

2017-12-01

Poverty Point is an UNESCO World Heritage Site located in northern Louisiana, known for its six earthwork ridges and mounds of archeological significance. The largest of these earthworks and most significant feature on the site, Mound A is over 70 feet (21 m) high and 640 feet (200 m) long. To construct this mound, it would have taken about 16 million basket loads of dirt which weight approximately 50 lbs. each (23 kg). The current archeological theory describing the construction of Mound A states it was built in three months at most, with some suggesting construction times as short as a month, but beyond this not much else is known about Mound A or Poverty Point. The pace of Mound A's construction has been used as evidence to support the idea that there was a central leader directing its construction and that the population inhabiting the site was more socio-politically complex than previous hunter-gatherer populations in North America. Evidence of heterogeneity and stratigraphic layering, however, is an indication of a slow mound construction over centuries by a relatively egalitarian hunter-gather society. A greater understanding of the construction style and timeline for the construction of Mound A will lead to a greater understanding to the site, its people their lifestyles. Mound Builders have been known to cap mounds they have built if they were to be built in stages so if Mound A was built in stages it is likely capped with some more dense material than the dirt surrounding it. To better understand the construction history of Mound A we collected photogrammetry, seismic reflection, ground-penetrating radar, frequency-domain electromagnetic-induction, resistivity, and magnetometry data over the mound. The seismic data had a normal moveout correction, it was stacked and migrated. Additionally, with the application of quadcopter-based photogrammetry a three-dimensional digital model of Mound A was developed to display and assist in further understanding and

Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

Directory of Open Access Journals (Sweden)

Molnar A.

2017-06-01

Full Text Available In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints’ lifetime.

Albumin solder covalently bound to a polymer membrane: New approach to improve binding strength in laser tissue soldering in-vitro.

Science.gov (United States)

Hiebl, B; Ascher, L; Luetzow, K; Kratz, K; Gruber, C; Mrowietz, C; Nehring, M E; Lendlein, A; Franke, R-P; Jung, F

2018-01-01

Laser tissue soldering (LTS) based on indocyanine green (ICG)-mediated heat-denaturation of proteins might be a promising alternative technique for micro-suturing, but up to now the problem of too weak shear strength of the solder welds in comparison to sutures is not solved. Earlier reports gave promising results showing that solder supported by carrier materials can enhance the cohesive strength of the liquid solder. In these studies, the solder was applied to the carriers by dip coating. Higher reliability of the connection between the solder and the carrier material is expected when the solder is bound covalently to the carrier material. In the present study a poly(ether imide) (PEI) membrane served as carrier material and ICG-supplemented albumin as solder substrate. The latter was covalently coupled to the carrier membrane under physiological conditions to prevent structural protein changes. As laser source a diode continuous-wave laser emitting at 808 nm with intensities between 250 mW and 1500 mW was utilized. The albumin functionalized carrier membrane was placed onto the tunica media of explanted pig thoracic aortae forming an overlapping area of approximately 0.5×0.5 cm2. All tests were performed in a dry state to prevent laser light absorption by water. Infrared spectroscopy, spectro-photometrical determination of the secondary and primary amine groups after acid orange II staining, contact angle measurements, and atomic force microscopy proved the successful functionalization of the PEI membrane with albumin. A laser power of 450 mW LTS could generate a membrane-blood vessel connection which was characterized by a shear strength of 0.08±0.002 MPa, corresponding to 15% of the tensile strength of the native blood vessel. Theoretically, an overlapping zone of 4.1 mm around the entire circumference of the blood vessel could have provided shear strength of the PEI membrane-blood vessel compound identical to the tensile strength of the native

Integration of environmentally compatible soldering technologies for waste minimization

International Nuclear Information System (INIS)

Hosking, F.M.

1992-01-01

There has been a concentrated effort throughout the international microelectronics industry to phase out chlorofluorocarbon (CFC) materials and alleviate the serious problem of ozone depletion created by the release of CFCS. The development of more environmentally compatible manufacturing technologies is the cornerstone of this effort. Alternative materials and processes for cleaning and soldering have received special attention. Electronic. soldering typically utilizes rosin-based fluxes to promote solder wettability. Flux residues must be removed from the soldered parts when high product reliability is essential. Halogenated or CFC solvents have been the principle chemicals used to clean the residues. With the accelerated push to eliminate CFCs in the US by 1995, CFC-free solvents, aqueous-based cleaning, water soluble or ''no clean'' fluxes, and fluxless soldering technologies are being developed and quickly integrated into manufacturing practice. Sandia's Center for Solder Science and Technology has been ch g a variety of fluxless and alternative soldering technologies for DOE's waste minimization program. The work has focused on controlled atmosphere, laser, and ultrasonic fluxless soldering, protective metallic and organic coatings, and fluxes which have water soluble or low solids-based chemistries. With the increasing concern that Pb will also be banned from electronic soldering, Sandia has been characterizing the wetting, aging, and mechanical properties of Pb-fire solder alloys. The progress of these integrated studies will be discussed. Their impact on environmentally compatible manufacturing will be emphasized. Since there is no universal solution to the various environmental, safety, and health issues which currently face industry, the proposed technologies offer several complementary materials and processing options from which one can choose

Iron microbial communities in Belgian Frasnian carbonate mounds

OpenAIRE

Boulvain, F.; De Ridder, C.; Mamet, B.; Preat, A.; Gillan, D.

2001-01-01

The Belgian Frasnian carbonate mounds occur in three stratigraphic levels in an overall backstepping succession. Petit-Mont and Arche Members form the famous red and grey “marble” exploited for ornamental stone since Roman times. The evolution and distribution of the facies in the mounds is thought to be associated with ecologic evolution and relative sea-level fluctuations. Iron oxides exist in five forms in the Frasnian mounds; four are undoubtedly endobiotic organized structures: (1) micro...

Efforts to Develop a 300°C Solder

Energy Technology Data Exchange (ETDEWEB)

Norann, Randy A [Perma Works LLC

2015-01-25

This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

Strength of joints brazed with two-phase solders

International Nuclear Information System (INIS)

Shnyakin, N.S.; Parfenova, L.V.; Ekatova, A.S.; Prilepskaya, I.V.

1976-01-01

Dependence of the structure and strength of soldered joints upon a gap size in case of 1Kh18N10T stainless steel soldering with a double-phase solder of Ni-Zn-Cu system is described. Butt and lap joints have been subjected to soldering with gas-flame and induction heating. The optimum conditions of the solder crystallization are determined with wedge-gap samples. The studies show that the character of distribution of a fusible β-phase in metal depends upon a gap size. With gaps up to 0.1 mm the β-phase enriched with a fusible component (zinc) runs as a continuous thin interlayer in the middle of the seam. As a result of zinc evaporation from the β-phase this interlayer becomes internally oxidized. After the sample is broken an oxidized fracture gives one the impression of a poor fusion in the middle part of the joint. The ultimate strength of butt joints is 15-20 kgf/sq.mm. A value of thermal expansion of 1Kh18N10T steel samples, 1-5 mm thick, has been experimentally determined for butt soldering. The elongation of two halves of the sample is measured by an indicator and proved to be 0.89 mm for a 50x50x2 mm sample at a soldering temperature of 1.100 deg C. The paper presents methods for the calculation of an optimal gap value for butt soldering with a local gas-flame and induction heating

Safer Soldering Guidelines and Instructional Resources

Science.gov (United States)

Love, Tyler S.; Tomlinson, Joel

2018-01-01

Soldering is a useful and necessary process for many classroom, makerspace, Fab Lab, technology and engineering lab, and science lab activities. As described in this article, soldering can pose many safety risks without proper engineering controls, standard operating procedures, and direct instructor supervision. There are many safety hazards…

Lead-free solder technology transfer from ASE Americas

Energy Technology Data Exchange (ETDEWEB)

FTHENAKIS,V.

1999-10-19

To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

Influence of Co and W powders on viscosity of composite solders during soldering of specially shaped diamond-abrasive tools

Science.gov (United States)

Sokolov, E. G.; Aref’eva, S. A.; Svistun, L. I.

2018-03-01

The influence of Co and W powders on the structure and the viscosity of composite solders Sn-Cu-Co-W used for the manufacture of the specially shaped diamond tools has been studied. The solders were obtained by mixing the metallic powders with an organic binder. The mixtures with and without diamonds were applied to steel rollers and shaped substrates. The sintering was carried out in a vacuum at 820 ° C with time-exposure of 40 minutes. The influence of Co and W powders on the viscosity solders was evaluated on the basis of the study of structures and according to the results of sintering specially shaped diamond tools. It was found that to provide the necessary viscosity and to obtain the uniform diamond-containing layers on the complex shaped surfaces, Sn-Cu-Co-W solder should contain 27–35 vol % of solid phase. This is achieved with a total solder content of 24–32 wt % of cobalt powder and 7 wt % of tungsten powder.

Are termite mounds biofilters for methane? - Challenges and new approaches to quantify methane oxidation in termite mounds

Science.gov (United States)

Nauer, Philipp A.; Hutley, Lindsay B.; Bristow, Mila; Arndt, Stefan K.

2015-04-01

Methane emissions from termites contribute around 3% to global methane in the atmosphere, although the total source estimate for termites is the most uncertain among all sources. In tropical regions, the relative source contribution of termites can be far higher due to the high biomass and relative importance of termites in plant decomposition. Past research focused on net emission measurements and their variability, but little is known about underlying processes governing these emissions. In particular, microbial oxidation of methane (MOX) within termite mounds has rarely been investigated. In well-studied ecosystems featuring an oxic matrix above an anoxic methane-producing habitat (e.g. landfills or sediments), the fraction of oxidized methane (fox) can reach up to 90% of gross production. However, conventional mass-balance approaches to apportion production and consumption processes can be challenging to apply in the complex-structured and almost inaccessible environment of a termite mound. In effect, all field-based data on termite-mound MOX is based on one study that measured isotopic shifts in produced and emitted methane. In this study a closed-system isotope fractionation model was applied and estimated fox ranged from 10% to almost 100%. However, it is shown here that by applying an open-system isotope-pool model, the measured isotopic shifts can also be explained by physical transport of methane alone. Different field-based methods to quantify MOX in termite mounds are proposed which do not rely on assumptions of physical gas transport. A simple approach is the use of specific inhibitors for MOX, e.g. difluoromethane (CH2F2), combined with chamber-based flux measurements before and after their application. Data is presented on the suitability of different inhibitors and first results of their application in the field. Alternatively, gas-tracer methods allow the quantification of methane oxidation and reaction kinetics without knowledge of physical gas

The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

Energy Technology Data Exchange (ETDEWEB)

Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: Peter.Svec@savba.sk [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)

2013-06-01

The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

Facies architecture and diagenesis of Belgian Late Frasnian carbonate mounds

OpenAIRE

Boulvain, Frédéric

2001-01-01

Late Frasnian Petit-Mont Member carbonate mounds occur in the southern pail of the Dinant Synclinorium and in the Philippeville Anticline (SW Belgium). These mounds are 30 to 80 m thick and 100 to 250 m in diameter. They are embedded in shale, nodular shale and argillaceous limestone. Based on facies mapping of 14 buildups and related off-mound sediments, these mounds typically started from below the photic and storm wave base zones and builtup into shallow water environments. Above an argill...

Fatigue and thermal fatigue of Pb-Sn solder joints

International Nuclear Information System (INIS)

Frear, D.; Grivas, D.; McCormack, M.; Tribula, D.; Morris, J.W. Jr.

1987-01-01

This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55 0 C and 125 0 C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb

Simulation of Groundwater Mounding Beneath Hypothetical Stormwater Infiltration Basins

Science.gov (United States)

Carleton, Glen B.

2010-01-01

Groundwater mounding occurs beneath stormwater management structures designed to infiltrate stormwater runoff. Concentrating recharge in a small area can cause groundwater mounding that affects the basements of nearby homes and other structures. Methods for quantitatively predicting the height and extent of groundwater mounding beneath and near stormwater Finite-difference groundwater-flow simulations of infiltration from hypothetical stormwater infiltration structures (which are typically constructed as basins or dry wells) were done for 10-acre and 1-acre developments. Aquifer and stormwater-runoff characteristics in the model were changed to determine which factors are most likely to have the greatest effect on simulating the maximum height and maximum extent of groundwater mounding. Aquifer characteristics that were changed include soil permeability, aquifer thickness, and specific yield. Stormwater-runoff variables that were changed include magnitude of design storm, percentage of impervious area, infiltration-structure depth (maximum depth of standing water), and infiltration-basin shape. Values used for all variables are representative of typical physical conditions and stormwater management designs in New Jersey but do not include all possible values. Results are considered to be a representative, but not all-inclusive, subset of likely results. Maximum heights of simulated groundwater mounds beneath stormwater infiltration structures are the most sensitive to (show the greatest change with changes to) soil permeability. The maximum height of the groundwater mound is higher when values of soil permeability, aquifer thickness, or specific yield are decreased or when basin depth is increased or the basin shape is square (and values of other variables are held constant). Changing soil permeability, aquifer thickness, specific yield, infiltration-structure depth, or infiltration-structure shape does not change the volume of water infiltrated, it changes the

Environmental assessment for Mound Plant decontamination and decommissioning projects, Mound Plant, Miamisburg, Ohio

International Nuclear Information System (INIS)

1995-05-01

The U.S. Department of Energy (DOE) has prepared an Environmental Assessment (EA) for seven decontamination and decommissioning (D ampersand D) projects at the Mound Plant in Miamisburg, Ohio, that have not been previously addressed in the Final Environmental Impact Statement for the Mound Facility (June 1979). Based on the information presented in the EA, the DOE has determined that the proposed action is not a major Federal action significantly affecting the quality of the human environment within the meaning of the National Environmental Policy Act (NEPA) of 1969. Therefore, the preparation of an Environmental Impact Statement (EIS) is not required and the Department is issuing this Finding of No Significant Impact (FONSI)

Nano-soldering to single atomic layer

Science.gov (United States)

Girit, Caglar O [Berkeley, CA; Zettl, Alexander K [Kensington, CA

2011-10-11

A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

Soldering formalism in noncommutative field theory: a brief note

International Nuclear Information System (INIS)

Ghosh, Subir

2004-01-01

In this Letter, I develop the soldering formalism in a new domain--the noncommutative planar field theories. The soldering mechanism fuses two distinct theories showing opposite or complimentary properties of some symmetry, taking into account the interference effects. The above mentioned symmetry is hidden in the composite (or soldered) theory. In the present work it is shown that a pair of noncommutative Maxwell-Chern-Simons theories, having opposite signs in their respective topological terms, can be consistently soldered to yield the Proca model (Maxwell theory with a mass term) with corrections that are at least quadratic in the noncommutativity parameter. We further argue that this model can be thought of as the noncommutative generalization of the Proca theory of ordinary spacetime. It is well known that abelian noncommutative gauge theory bears a close structural similarity with non-abelian gauge theory. This fact is manifested in a non-trivial way if the present Letter is compared with existing literature, where soldering of non-abelian models are discussed. Thus the present work further establishes the robustness of the soldering programme. The subtle role played by gauge invariance (or the lack of it), in the above soldering process, is revealed in an interesting way

A new method for soldering particle-reinforced aluminum metal matrix composites

Energy Technology Data Exchange (ETDEWEB)

Lu, Jinbin; Mu, Yunchao [Zhongyuan University of Technology, Zhengzhou 450007 (China); Luo, Xiangwei [Zhengzhou University, Zhengzhou 450002 (China); Niu, Jitai, E-mail: niujitai@163.com [Zhongyuan University of Technology, Zhengzhou 450007 (China)

2012-12-01

Highlights: Black-Right-Pointing-Pointer Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. Black-Right-Pointing-Pointer The nickel plating is required on the surface of the composites before soldering. Black-Right-Pointing-Pointer Low welding temperature is set to avoid overheating of the matrix. Black-Right-Pointing-Pointer Chemical and metallurgical bonding of composites and Kovar is carried out. Black-Right-Pointing-Pointer High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al-SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe-Ni-Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn-Cd-Ag-Cu) with a melting point of about 400 Degree-Sign C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)-Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al-SiC composite.

A new method for soldering particle-reinforced aluminum metal matrix composites

International Nuclear Information System (INIS)

Lu, Jinbin; Mu, Yunchao; Luo, Xiangwei; Niu, Jitai

2012-01-01

Highlights: ► Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. ► The nickel plating is required on the surface of the composites before soldering. ► Low welding temperature is set to avoid overheating of the matrix. ► Chemical and metallurgical bonding of composites and Kovar is carried out. ► High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al–SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe–Ni–Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn–Cd–Ag–Cu) with a melting point of about 400 °C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)–Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al–SiC composite.

Prey and mound disassembly, manipulation and transport by fire ant collectives

Science.gov (United States)

Dutta, Bahnisikha; Monaenkova, Daria; Goodisman, Michael A.; Goldman, Daniel

Fire ants inhabit subterranean nests covered by a hemispherical mound of soil permeated by narrow ( 1 body length diameter) tunnels. Fire ants can use their mound for long-term food storage [Gayahan &Tschinkel, J. Insect Sci.,2008]. Since mound tunnels are narrow, we expect that in addition to prey manipulation, mound reconfiguration could also be an important aspect of the food storage strategy. Ant colonies collected from wild were allowed to build nests in containers filled with clay soil in the laboratory. These colonies were offered diverse prey embedded with lead markers, including mealworms, crickets and shrimp. Ant-prey-soil interactions on the nest surface were recorded using overhead video and subsurface using x-ray imaging. Individual ants involved in prey storage exhibited three distinct behaviors: prey maneuvering, prey dissection and mound reconfiguration. Small prey (e.g. mealworms) were collectively carried intact into the mound through a tunnel, and then disassembled within the mound. Larger prey (e.g. shrimp) were dismantled into small pieces above the surface and carried to mound tunnels. The bodies of hard medium-sized prey (e.g. crickets) were buried after limb removal and then disassembled and moved into tunnels. Soil reconfiguration occurred in all cases.

Influence of soil pedological properties on termite mound stability

OpenAIRE

Jouquet, Pascal; Guilleux, N.; Caner, L.; Chintakunta, S.; Ameline, M.; Shanbhag, R. R.

2016-01-01

This study investigated the influence of soil properties on the density and shape of epigeous fungus-growing termite nests in a dry deciduous forest in Karnataka, India. In this environment, Odontotermes obesus produces cathedral shaped mounds. Their density, shape (height and volume) and soil physicochemical properties were analyzed in ferralsol and vertisol environments. No significant difference was observed in O. obesus mound density (n = 2.7 mound ha(-1) on average in the vertisol and fe...

IODP Expedition 307 Drills Cold-Water Coral Mound Along the Irish Continental Margin

Directory of Open Access Journals (Sweden)

Trevor Williams

2006-03-01

Full Text Available Introduction Over the past decade, oceanographic and geophysical surveys along the slope of the Porcupine Seabight off the southwestern continental margin of Ireland have identified upwards of a thousand enigmatic mound-like structures (Figs. 1 and 2. The mounds of the Porcupine Seabight rise from the seafl oor in water depths of 600–900 m and formimpressive conical bodies several kilometers wide and up to 200 m high. Although a few mounds such as Thérèse Mound and Galway Mound are covered by a thriving thicket of coldwater corals, most mound tops and fl anks are covered by dead coral rubble or are entirely buried by sediment (De Mol et al., 2002; Fig. 2, Beyer et al., 2003. Lophelia pertusa (Fig.3 and Madrepora oculata are the most prominent cold-water corals growing without photosynthetic symbionts. The widespread discovery of large and numerous coral-bearing banks and the association of these corals with the mounds have generated signifi cant interest as to the composition, origin and development of these mound structures.Challenger Mound, in the Belgica mound province, has an elongated shape oriented along a north-northeast to south-southwest axis and ispartially buried under Pleistocene drift sediments. In high-resolution seismic profiles the mounds appear to root on an erosion surface (van Rooij et al., 2003. During IODP Expedition307 the Challenger Mound in the Porcupine Seabight was drilled with the goal of unveiling the origin and depositional processes withinthese intriguing sedimentary structures. Challenger Mound, unlike its near neighbors the Thérèse and Galway mounds, has little to no livecoral coverage and, therefore, was chosen as the main target for drilling activities, so that no living ecosystem would be disturbed.

Soil Physical and Chemical Properties in Epigeal Termite Mounds in Pastures

Directory of Open Access Journals (Sweden)

Sandra Santana de Lima

2018-03-01

Full Text Available ABSTRACT We characterized soil physical and chemical properties and soil organic matter in epigeal termite mounds in pastures to evaluate the changes promoted by termites in comparison to an adjacent area. We selected seven active epigeal termite mounds in the municipality of Seropédica, state of Rio de Janeiro, Brazil. Soil samples were collected from top, center and base positions of each mound, at 0.50 and 1.50 m distance from the base of the mound. We identified individuals of the genus Embiratermes, Velocitermes, and Orthognathotermes. The humin fraction predominated over the humic and fulvic acid fractions both in mounds and adjacent soil. The amount of organic matter and the mineral fractions (mineral-associated organic carbon - MOC varied among builder species. The studied chemical attributes point to a higher concentration of nutrients in the mounds than in the adjacent soil.

Thermomechanical behavior of tin-rich (lead-free) solders

Science.gov (United States)

Sidhu, Rajen Singh

In order to adequately characterize the behavior of ball-grid-array (BGA) Pb-free solder spheres in electronic devices, the microstructure and thermomechanical behavior need to be studied. Microstructure characterization of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-3.9Ag-0.7Cu alloys was conducted using optical microscopy, scanning electron microscopy, transmission electron microscopy, image analysis, and a novel serial sectioning 3D reconstruction process. Microstructure-based finite-element method (FEM) modeling of deformation in Sn-3.5Ag alloy was conducted, and it will be shown that this technique is more accurate when compared to traditional unit cell models for simulating and understanding material behavior. The effect of cooling rate on microstructure and creep behavior of bulk Sn-rich solders was studied. The creep behavior was evaluated at 25, 95, and 120°C. Faster cooling rates were found to increase the creep strength of the solders due to refinement of the solder microstructure. The creep behavior of Sn-rich single solder spheres reflowed on Cu substrates was studied at 25, 60, 95, and 130°C. Testing was conducted using a microforce testing system, with lap-shear geometry samples. The solder joints displayed two distinct creep behaviors: (a) precipitation-strengthening (Sn-3.5Ag and Sn-3.9Ag-0.7Cu) and (b) power law creep accommodated by grain boundary sliding (GBS) (Sn and Sn-0.7Cu). The relationship between microstructural features (i.e. intermetallic particle size and spacing), stress exponents, threshold stress, and activation energies are discussed. The relationship between small-length scale creep behavior and bulk behavior is also addressed. To better understand the damage evolution in Sn-rich solder joints during thermal fatigue, the local damage will be correlated to the cyclic hysteresis behavior and crystal orientations present in the Sn phase of solder joints. FEM modeling will also be utilized to better understand the macroscopic and local

Environmental survey preliminary report, Mound Plant, Miamisburg, Ohio

Energy Technology Data Exchange (ETDEWEB)

1987-03-01

This report presents the preliminary findings from the first phase of the Environmental Survey of the United States Department of Energy (DOE) Mound Plant, conducted August 18 through 29, 1986. The objective of the Survey is to identify environmental problems and areas of environmental risk associated with the Mound Plant. The Survey covers all environmental media and all areas of environmental regulation. It is being performed in accordance with the DOE Environmental Survey Manual. The on-site phase of the Survey involves the review of existing site environmental data, observations of the operations carried on at the Mound Plant, and interviews with site personnel. The Survey found no environmental problems at the Mound Plant that represent an immediate threat to human life. The environmental problems identified at the Mound Plant by the Survey confirm that the site is confronted with a number of environmental problems which are by and large a legacy from past practices at a time when environmental problems were less well understood. Theses problems vary in terms of their magnitude and risk, as described in this report. Although the sampling and analysis performed by the Mound Plant Survey will assist in further identifying environmental problems at the site, a complete understanding of the significance of some of the environmental problems identified requires a level of study and characterization that is beyond the scope of the Survey. Actions currently under way or planned at the site, particularly the Phase II activities of the Comprehensive Environmental Analysis and Response Program (CEARP) as developed and implemented by the Albuquerque Operations Office, will contribute toward meeting this requirement. 85 refs., 24 figs., 20 tabs.

30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

Science.gov (United States)

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

The Porcupine Bank Canyon coral mounds: oceanographic and topographic steering of deep-water carbonate mound development and associated phosphatic deposition

Science.gov (United States)

Mazzini, A.; Akhmetzhanov, A.; Monteys, X.; Ivanov, M.

2012-06-01

The head of a canyon system extending along the western Porcupine Bank (west of Ireland) and which accommodates a large field of giant carbonate mounds was investigated during two cruises (INSS 2000 and TTR-13). Multibeam and sidescan sonar data (600-1,150 m water depth) suggest that the pre-existing seabed topography acts as a significant factor controlling mound distribution and shape. The mounds are concentrated along the edges of the canyon or are associated with a complex fault system traced around the canyon head, comprising escarpments up to 60 m high and several km long. The sampling for geochemical and petrographic analysis of numerous types of authigenic deposits was guided by sidescan sonar and video recordings. Calcite-cemented biogenic rubble was observed at the top and on the flanks of the carbonate mounds, being associated with both living and dead corals ( Lophelia pertusa, Madrepora oculata and occasional Desmophyllum cristagalli). This can plausibly be explained by dissolution of coral debris facilitated by strong currents along the mound tops and flanks. In turn, the dissolved carbon is recycled and precipitated as interstitial micrite. Calcite, dolomite and phosphatic hardgrounds were identified in samples from the escarpment framing the eastern part of the survey area. The laterally extensive phosphatic hardgrounds represent a novel discovery in the region, supplying hard substrata for the establishment of new coral colonies. Based on existing knowledge of regional oceanographic conditions, complemented with new CTD measurements, it is suggested that water column stratification, enhanced bottom currents, and upwelling facilitate the deposition of organic matter, followed by phosphatisation leading to the formation of phosphate-glauconite deposits. The occurrence of strong bottom currents was confirmed by means of video observations combined with acoustic and sampling data, providing circumstantial evidence of fine- to medium-grained sand

Mechanical properties of soldered joints of niobium base alloys

International Nuclear Information System (INIS)

Grishin, V.L.

1980-01-01

Mechanical properties of soldered joints of niobium alloys widely distributed in industry: VN3, VN4, VN5A, VN5AE, VN5AEP etc., 0.6-1.2 mm thick are investigated. It is found out that the usage of zirconium-vanadium, titanium-tantalum solders for welding niobium base alloys permits to obtain soldered joints with satisfactory mechanical properties at elevated temperatures

Rainfall and soil properties influence termite mound abundance and height: A case study with Odontotermes obesus (Macrotermitinae) mounds in the Indian Western Ghats forests

OpenAIRE

Kabbaj, Meyssoun; Sundararaj, Ramachandran; Jouquet, Pascal

2017-01-01

Several fungus-growing termite species build mounds, or termitaria, that are conspicuous features of African and Asian landscapes. Studies of the genus Macrotermes in Africa have established that their mounds provide an environment buffered against extremes of temperature and humidity, as well as protection from predators, and are correspondingly modified in composition. However, no studies are available in the specific context of the Asian continent where termite mounds are also abundant. He...

Rainfall and soil properties influence termite mound abundance and height : a case study with Odontotermes obesus (Macrotermitinae) mounds in the Indian Western Ghats forests

OpenAIRE

Shanbhag, R. R.; Kabbaj, M.; Sundararaj, R.; Jouquet, Pascal

2017-01-01

Several fungus-growing termite species build mounds, or termitaria, that are conspicuous features of African and Asian landscapes. Studies of the genus Macrotermes in Africa have established that their mounds provide an environment buffered against extremes of temperature and humidity, as well as protection from predators, and are correspondingly modified in composition. However, no studies are available in the specific context of the Asian continent where termite mounds are also abundant. He...

A Corrosion Investigation of Solder Candidates for High-Temperature Applications

DEFF Research Database (Denmark)

Chidambaram, Vivek; Hald, John; Ambat, Rajan

2009-01-01

The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work...

Contact area calculation between elastic solids bounded by mound rough surfaces

NARCIS (Netherlands)

Palasantzas, G

In this work, we investigate the influence of mound roughness on the contact area between elastic bodies. The mound roughness is described by the r.m.s. roughness amplitude w, the average mound separation Lambda, and the system correlation length xi. In general, the real contact area has a complex

Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder

Science.gov (United States)

2015-05-05

under bump metallurgy and solder joint geometry on Sn grain morphology in Pb free solder joints were examined. SnAgCu solder joints were examined for...free solder interconnects”, Sci. Technol. Weld . Join. 13, 732 (2008). [3.25] Terashima, S., Takahama, K., Nozaki, M., and Tanaka, M. Recrystallization

Nutrient dynamics and plant assemblages of Macrotermes falciger mounds in a savanna ecosystem

Science.gov (United States)

Muvengwi, Justice; Ndagurwa, Hilton G. T.; Nyenda, Tatenda; Mbiba, Monicah

2016-10-01

Termites through mound construction and foraging activities contribute significantly to carbon and nutrient fluxes in nutrient-poor savannas. Despite this recognition, studies on the influence of termite mounds on carbon and nitrogen dynamics in sub-tropical savannas are limited. In this regard, we examined soil nutrient concentrations, organic carbon and nitrogen mineralization in incubation experiments in mounds of Macrotermes falciger and surrounding soils of sub-tropical savanna, northeast Zimbabwe. We also addressed whether termite mounds altered the plant community and if effects were similar across functional groups i.e. grasses, forbs or woody plants. Mound soils had significantly higher silt and clay content, pH and concentrations of calcium (Ca), magnesium (Mg), potassium (K), organic carbon (C), ammonium (NH4+) and nitrate (NO3-) than surrounding soils, with marginal differences in phosphorus (P) and sodium (Na) between mounds and matrix soils. Nutrient enrichment increased by a factor ranging from 1.5 for C, 4.9 for Mg up to 10.3 for Ca. Although C mineralization, nitrification and nitrification fraction were similar between mounds and matrix soils, nitrogen mineralization was elevated on mounds relative to surrounding matrix soils. As a result, termite mounds supported unique plant communities rich and abundant in woody species but less diverse in grasses and forbs than the surrounding savanna matrix in response to mound-induced shifts in soil parameters specifically increased clay content, drainage and water availability, nutrient status and base cation (mainly Ca, Mg and Na) concentration. In conclusion, by altering soil properties such as texture, moisture content and nutrient status, termite mounds can alter the structure and composition of sub-tropical savanna plant communities, and these results are consistent with findings in other savanna systems suggesting that increase in soil clay content, nutrient status and associated changes in the plant

Radiocarbon dating of large termite mounds of the miombo woodland of Katanga, DR Congo

Science.gov (United States)

Erens, Hans; Boudin, Mathieu; Mees, Florias; Dumon, Mathijs; Mujinya, Basile; Van Strydonck, Mark; Baert, Geert; Boeckx, Pascal; Van Ranst, Eric

2015-04-01

The miombo woodlands of South Katanga (D.R. Congo) are characterized by a high spatial density of large conic termite mounds built by Macrotermes falciger (3 to 5 ha-1, ~5 m high, ~15 m in diameter). The time it takes for these mounds to attain this size is still largely unknown. In this study, the age of four of these mounds is determined by 14C-dating the acid-insoluble organic carbon fraction of samples taken along the central vertical axis of two active and two abandoned mounds. The age sequence in the active mounds is erratic, but the results for the abandoned mounds show a logical increase of 14C-age with depth. The ages measured at 50 cm above ground level were 2335 - 2119 cal yr BP for the large abandoned mound (630 cm high), and 796 - 684 cal yr BP for the small abandoned mound (320 cm high). Cold-water-extractable organic carbon (CWEOC) measurements combined with spectroscopic analysis revealed that the lower parts of the active mounds may have been contaminated with recent carbon that leached from the active nest. Nonetheless, this method appears to provide reliable age estimates of large, abandoned termite mounds, which are older than previously estimated. Furthermore, historical mound growth rates seem to correspond to past temperature changes, suggesting a relation between past environmental conditions and mound occupancy. Keywords : 14C, water-extractable carbon, low-temperature combustion

Characteristics of solder joints under fatigue loads using piezomechanical actuation

Science.gov (United States)

Shim, Dong-Jin; Spearing, S. Mark

2003-07-01

Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezo-ceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

Effect of Solder Flux Residues on Corrosion of Electronics

DEFF Research Database (Denmark)

Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per

2009-01-01

Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA...... testing and use in the field, consequences and recommendations are given. Failures, caused by harsh[1] customer environments, are not covered in this paper....

Influence of solder joint length to the mechanical aspect during the thermal stress analysis

Science.gov (United States)

Tan, J. S.; Khor, C. Y.; Rahim, Wan Mohd Faizal Wan Abd; Ishak, Muhammad Ikman; Rosli, M. U.; Jamalludin, Mohd Riduan; Zakaria, M. S.; Nawi, M. A. M.; Aziz, M. S. Abdul; Ani, F. Che

2017-09-01

Solder joint is an important interconnector in surface mount technology (SMT) assembly process. The real time stress, strain and displacement of the solder joint is difficult to observe and assess the experiment. To tackle these problems, simulation analysis was employed to study the von Mises stress, strain and displacement in the thermal stress analysis by using Finite element based software. In this study, a model of leadless electronic package was considered. The thermal stress analysis was performed to investigate the effect of the solder length to those mechanical aspects. The simulation results revealed that solder length gives significant effect to the maximum von Mises stress to the solder joint. Besides, changes in solder length also influence the displacement of the solder joint in the thermal environment. The increment of the solder length significantly reduces the von Mises stress and strain on the solder joint. Thus, the understanding of the physical parameter for solder joint is important for engineer prior to designing the solder joint of the electronic component.

Quality Analysis of Welded and Soldered Joints of Cu-Nb Microcomposite Wires

Directory of Open Access Journals (Sweden)

Nikolaj VIŠNIAKOV

2011-03-01

Full Text Available Quality analysis of welded and soldered joints of Cu-Nb microcomposite wires has been performed. Quality and mechanical characteristics of joints as ultimate tensile stress limit and elongation at break were measured with an universal testing machine and controlled visually using an optical microscope. Two wires joints were soldered with silver and copper solders and put into steel and copper sleeve respectively. Another two wires joints were soldered with silver solder and welded without any reinforcement. Joints soldered with the silver solder and steel sleeve have demonstrated the best mechanical characteristics: ultimate tensile stress limit of 650 MPa and elongation at break of 0.85 %. Joints soldered with the copper sleeve have no advantages comparing with the soldered butt joint. Ultimate tensile stress limit and elongation at break were in 300 MPa - 350 MPa and in 0.35 % - 0.45 % ranges respectively. Two welded joints had ultimate tensile stress limit of 470 MPa and elongation at break of 0.71 %. In all joints the microstructure of Nb filaments was destroyed and mechanical properties have been specified by mechanical strength of copper and sleeve materials only.http://dx.doi.org/10.5755/j01.ms.17.1.242

Use of termite mounds in geochemical exploration in North Ethiopia [rapid communication

Science.gov (United States)

Kebede, Fassil

2004-09-01

The geochemistry of the termite mounds was studied in lower Giba River basin, Kolla Tambien district, northern Ethiopia to show that they are useful in searching for metals. Specimens from the termite mounds and parent materials were collected to quantify gold, silver, copper, zinc, cobalt, manganese, iron and nickel. The results of the geochemical analysis of the samples indicated that these metals exist both in the termite mound and the parent material in the surrounding area. Correlation analysis shows that termite mounds and the parent materials are positively correlated for gold ( r = 0.75∗), copper ( r = 0.77∗), silver ( r = 0.56∗) and manganese ( r = 0.72). This positive correlation leads to the conclusion that there is a direct relation between the concentration of metals in termite mound and the parent rocks. Termite mounds can therefore be used as tools in exploring for these metals.

Development of a soft-soldering system for aluminum

Science.gov (United States)

Falke, W. L.; Lee, A. Y.; Neumeier, L. A.

1983-03-01

The method employs application of a thin nickel copper alloy coating to the substrate, which enables the tin lead solders to wet readily and spread over the areas to be joined. The aluminum substrate is mechanically or chemically cleaned to facilitate bonding to a minute layer of zinc that is subsequently applied, with an electroless zincate solution. The nickel copper alloy (30 to 70 pct Ni) coating is then applied electrolytically over the zinc, using immersion cell or brush coating techniques. Development of acetate electrolytes has permitted deposition of the proper alloys coatings. The coated areas can then be readily joined with conventional tin lead solders and fluxs. The joints so formed are ductile, strong, and relatively corrosion resistant, and exhibit strengths equivalent to those formed on copper and brass when the same solders and fluxes are used. The method has also been employed to soft solder magnesium alloys.

Characteristics and origin of Earth-mounds on the Eastern Snake River Plain, Idaho

International Nuclear Information System (INIS)

Tullis, J.A.

1995-09-01

Earth-mounds are common features on the Eastern Snake River Plain, Idaho. The mounds are typically round or oval in plan view, <0.5 m in height, and from 8 to 14 m in diameter. They are found on flat and sloped surfaces, and appear less frequently in lowland areas. The mounds have formed on deposits of multiple sedimentary environments. Those studied included alluvial gravel terraces along the Big Lost River (late Pleistocene/early Holocene age), alluvial fan segments on the flanks of the Lost River Range (Bull Lake and Pinedale age equivalents), and loess/slopewash sediments overlying basalt flows. Backhoe trenches were dug to allow characterization of stratigraphy and soil development. Each mound has features unique to the depositional and pedogenic history of the site; however, there are common elements to all mounds that are linked to the history of mound formation. Each mound has a open-quotes floorclose quotes of a sediment or basement rock of significantly different hydraulic conductivity than the overlying sediment. These paleosurfaces are overlain by finer-grained sediments, typically loess or flood-overbank deposits. Mounds formed in environments where a sufficient thickness of fine-grained sediment held pore water in a system open to the migration to a freezing front. Heaving of the sediment occurred by the growth of ice lenses. Mound formation occurred at the end of the Late Pleistocene or early in the Holocene, and was followed by pedogenesis. Soils in the mounds were subsequently altered by bioturbation, buried by eolian deposition, and eroded by slopewash runoff. These secondary processes played a significant role in maintaining or increasing the mound/intermound relief

Characteristics and origin of Earth-mounds on the Eastern Snake River Plain, Idaho

Energy Technology Data Exchange (ETDEWEB)

Tullis, J.A.

1995-09-01

Earth-mounds are common features on the Eastern Snake River Plain, Idaho. The mounds are typically round or oval in plan view, <0.5 m in height, and from 8 to 14 m in diameter. They are found on flat and sloped surfaces, and appear less frequently in lowland areas. The mounds have formed on deposits of multiple sedimentary environments. Those studied included alluvial gravel terraces along the Big Lost River (late Pleistocene/early Holocene age), alluvial fan segments on the flanks of the Lost River Range (Bull Lake and Pinedale age equivalents), and loess/slopewash sediments overlying basalt flows. Backhoe trenches were dug to allow characterization of stratigraphy and soil development. Each mound has features unique to the depositional and pedogenic history of the site; however, there are common elements to all mounds that are linked to the history of mound formation. Each mound has a {open_quotes}floor{close_quotes} of a sediment or basement rock of significantly different hydraulic conductivity than the overlying sediment. These paleosurfaces are overlain by finer-grained sediments, typically loess or flood-overbank deposits. Mounds formed in environments where a sufficient thickness of fine-grained sediment held pore water in a system open to the migration to a freezing front. Heaving of the sediment occurred by the growth of ice lenses. Mound formation occurred at the end of the Late Pleistocene or early in the Holocene, and was followed by pedogenesis. Soils in the mounds were subsequently altered by bioturbation, buried by eolian deposition, and eroded by slopewash runoff. These secondary processes played a significant role in maintaining or increasing the mound/intermound relief.

Properties and Microstructures of Sn-Bi-X Lead-Free Solders

Directory of Open Access Journals (Sweden)

Fan Yang

2016-01-01

Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

Physical properties of lead free solders in liquid and solid state

Energy Technology Data Exchange (ETDEWEB)

Mhiaoui, Souad

2007-04-17

The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

Directory of Open Access Journals (Sweden)

Liu Mei Lee

2013-01-01

Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

Independent technical review of the Mound Plant

Energy Technology Data Exchange (ETDEWEB)

1994-06-01

This report documents an Independent Technical Review (ITR) of the facilities, organizations, plans, and activities required to transition particular elements of the Mound Plant from Defense Program (DP) funded operation as appropriate either to community developed reuse or safe deactivation leading to decontamination and decommissioning (D&D). The review was conducted at the request of the Dr. Willis Bixby, Deputy Assistant Secretary, U.S. Department of Energy EM-60, Office of Facility Transition and Management and is a consensus of the nine member ITR Team. Information for the review was drawn from documents provided to the ITR Team by the Miamisburg Area Office (MB) of the DOE, EG&G, the City of Miamisburg, and others; and from presentations, discussions, interviews, and facility inspections at the Mound Plant during the weeks of March 14 and March 28, 1994. During the week of April 25, 1994, the ITR Team met at Los Alamos, New Mexico to develop consensus recommendations. A presentation of the core recommendations was made at the Mound Plant on May 5, 1994. This is an independent assessment of information available to, and used by, the Mound Plant personnel. Repetition of the information is not meant to imply discovery by the ITR Team. Team members, however, acting as independent reviewers, frequently assess the information from a perspective that differs significantly from that of the Mound Plant personnel. The report is based on information obtained and conditions observed during the March 1994 review interval. The ITR process and normal site work often initiate rapid, beneficial changes in understanding and organization immediately following the review. These changes frequently alter conditions observed during the review, but the report does not address changes subsequent to the review interval.

Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

Science.gov (United States)

Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu

2017-08-01

Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

National Research Council Canada - National Science Library

Reuse, Rolando

2005-01-01

.... The thermomechanical cycling in the solder causes numerous reliability challenges, mostly because of the mismatch of the coefficient of thermal expansion between the silicon chip and the substrate...

Plant Mounds as Concentration and Stabilization Agents for Actinide Soil Contaminants in Nevada

Energy Technology Data Exchange (ETDEWEB)

D.S. Shafer; J. Gommes

2009-02-03

Plant mounds or blow-sand mounds are accumulations of soil particles and plant debris around the base of shrubs and are common features in deserts in the southwestern United States. An important factor in their formation is that shrubs create surface roughness that causes wind-suspended particles to be deposited and resist further suspension. Shrub mounds occur in some plant communities on the Nevada Test Site, the Nevada Test and Training Range (NTTR), and Tonopah Test Range (TTR), including areas of surface soil contamination from past nuclear testing. In the 1970s as part of early studies to understand properties of actinides in the environment, the Nevada Applied Ecology Group (NAEG) examined the accumulation of isotopes of Pu, 241Am, and U in plant mounds at safety experiment and storage-transportation test sites of nuclear devices. Although aerial concentrations of these contaminants were highest in the intershrub or desert pavement areas, the concentration in mounds were higher than in equal volumes of intershrub or desert pavement soil. The NAEG studies found the ratio of contaminant concentration of actinides in soil to be greater (1.6 to 2.0) in shrub mounds than in the surrounding areas of desert pavement. At Project 57 on the NTTR, 17 percent of the area was covered in mounds while at Clean Slate III on the TTR, 32 percent of the area was covered in mounds. If equivalent volumes of contaminated soil were compared between mounds and desert pavement areas at these sites, then the former might contain as much as 34 and 62 percent of the contaminant inventory, respectively. Not accounting for radionuclides associated with shrub mounds would cause the inventory of contaminants and potential exposure to be underestimated. In addition, preservation of shrub mounds could be important part of long-term stewardship if these sites are closed by fencing and posting with administrative controls.

Tensile strength of two soldered alloys (Minalux and Verabond2

Directory of Open Access Journals (Sweden)

Mir Mohammad Rezaee S

2002-07-01

Full Text Available Recently. Minalux alloy, a base metal free from Be, has been presented on the market while no special soldering has been recommended for it. On the other hand, based on the manufacturer's claim, this alloy is similar to Verabond2. The aim of this study was to investigate the tensile strength of Minalux and Verabond2, soldered by Verasolder. Twelve standard dambble shape samples, with the length of 18 mm and the diameter of 3mm, were prepared from each alloy. Six samples of each alloy were divided into two pieces with carboradom disk. Soldering gap distance was 0.3mm, measured by a special jig and they were soldered by Verasolder alloy. Six other samples, of both Iranian and foreign unsoldered alloys were considered as control group. Then samples were examined under tensile force and their tensile strength was recorded. Two- way variance analysis showed that the tensile strength of Minalux alloy and Verabond2 were not statistically significant (Verasoler 686, Minalux 723, but after soldering, such difference became significant (Minalux 308, Verabond2 432. Verabond2 showed higher tensile strength after soldering.

Food preferences and mound-building behaviour of the mound-building mice Mus spicilegus

Science.gov (United States)

Hölzl, Michaela; Krištofík, Ján; Darolová, Alžbeta; Hoi, Herbert

2011-10-01

Optimal foraging strategies and food choice are influenced by various factors, e.g. availability, size and caloric content of the food type and predation risk. However, food choice criteria may change when food is not eaten immediately but has to be carried to a storage site for later use. For example, handling time in terms of harvesting and transport time should be optimized, particularly when the risk of predation is high. Thus, it is not clear whether food selected by hoarding animals reflects their food preference due to intrinsic features of the food type, e.g. size, caloric or lipid content, or whether the food type selected is a compromise that also considers the handling time required for harvesting and transport. We investigate this question in relation to food hoarding behaviour in mound-building mice. In autumn, mound-building mice Mus spicilegus collect seeds and other plant material and cover it with soil. Such above-ground storage is quite unusual for rodents. Here, we investigated whether there is a relationship between the seed species preferred as building materials and those preferred for food. We conducted a seed preference test using three most collected weed species for mound building. Controlling factors like food availability or predation risk, mice prefer Setaria spp. as food, although Amaranthus spp. and Chenopodium spp. were preferentially harvested and stored. By including the availability of the three species, our experimental results were confirmed, namely, a clear preference for Setaria spp. Also, handling time and seed size revealed to influence plant choice.

Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

Energy Technology Data Exchange (ETDEWEB)

Lucas, J.P.; Guo, F.; McDougall, J.; Bieler, T.R.; Subramanian, K.N.; Park, J.K.

1999-11-01

Creep deformation behavior was measured for 60--100 {micro}m thick solder joints. The solder joints investigated consisted of: (1) non-composite solder joints made with eutectic Sn-Ag solder, and (2) composite solder joints with eutectic Sn-Ag solder containing 20 vol.%, 5 {micro}m diameter in-situ Cu{sub 6}Sn{sub 5} intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.

Morphology and spatial patterns of Macrotermes mounds in the SE Katanga, D.R. Congo

Science.gov (United States)

Bazirake Mujinya, Basile; Mees, Florias; Erens, Hans; Baert, Geert; Van Ranst, Eric

2015-04-01

The spatial distribution patterns and morphological characteristics of Macrotermes falciger mounds were investigated in the Lubumbashi area, D.R. Congo. Examination of the spatial patterns of M. falciger mounds on high resolution satellite images reveals a mean areal number density of 2.9 ± 0.4 mounds ha-1. The high relative number of inactive mounds in the region, along with their regular distribution pattern, suggests that current termite mound occurrences are largely palaeostructures. Mound positions in the habitat are consistent with intraspecific competition rather than soil and substrate characteristics as controlling factor. Detailed morphological description of five deep termite-mound profiles (~7 m height/depth) shows that carbonate pedofeatures are present in all studied profiles, in contrast to the control soils. They mainly occur in the form of soft powdery masses, nodules and coatings on ped faces, all clearly pedogenic. Carbonate coatings occur mainly between 1 m above the soil surface and 1 m below that level in all mound profiles. Carbonate nodules do show a different distribution pattern at each site. Furthermore, when the studied profiles are considered to represent a toposequence, the stone layer occurs at greater depth in topographically low areas compared to crest and slope positions, which is mainly conditioned by erosion. The clay content of epigeal mounds increases from the summit to the toe slope, which can be largely related to differences in parent material. The Mn-Fe oxide concentrations occurring in all studied termite mound profiles reflect a seasonally high perched water table beneath the mound, which is more pronounced at the lower slope positions.

Assessment of potential solder candidates for high temperature applications

DEFF Research Database (Denmark)

pressure to eliminate lead containing materials despite the fact that materials for high Pb containing alloys are currently not affected by any legislations. A tentative assessment was carried out to determine the potential solder candidates for high temperature applications based on the solidification...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

Transition and Closeout of the Former DOE Mound Plant Site: Lessons Learned

International Nuclear Information System (INIS)

Carpenter, C. P.; Marks, M. L.; Smiley, S.L.; Gallaher, D. M.

2006-01-01

The U.S. Department of Energy's (DOE's) Office of Environmental Management (EM) manages the Miamisburg Closure Project (MCP) by cleaning up the Mound site, located in Miamisburg, Ohio, to specific environmental standards, conveying all excess land parcels to the Miamisburg Mound Community Improvement Corporation, and transferring all continuing DOE post-closure responsibilities to the Office of Legacy Management (LM). Presently, the EM cleanup contract of the Mound site with CH2M Hill Mound Inc. is scheduled for completion on March 31, 2006. LM manages the Mound transition efforts and also post-closure responsibilities at other DOE sites via a contract with the S.M. Stoller Corporation. The programmatic transfer from EM to LM is scheduled to take place on October 1, 2006. The transition of the Mound site has required substantial integration and coordination between the EM and LM. Several project management principles have been implemented to help facilitate the transfer of programmatic responsibility. As a result, several lessons learned have been identified to help streamline and improve integration and coordination of the transfer process. Lessons learned from the Mound site transition project are considered a work in progress and have been summarized according to a work breakdown structure for specific functional areas in the transition schedule. The functional areas include program management, environmental, records management, information technology, property management, stakeholder and regulatory relations, procurement, worker pension and benefits, and project closeout. Specific improvements or best practices have been recognized and documented by the Mound transition team. The Mound site is one of three major cleanup sites within the EM organization scheduled for completion in 2006. EM, EM cleanup contractor, LM, and LM post-closure contractor have identified lessons learned during the transition and closure of the Mound site. The transition effort from

Geochemical prospecting for rare earth elements using termite mound materials

Science.gov (United States)

Horiuchi, Yu; Ohno, Tetsuji; Hoshino, Mihoko; Shin, Ki-Cheol; Murakami, Hiroyasu; Tsunematsu, Maiko; Watanabe, Yasushi

2014-12-01

The Blockspruit fluorite prospect, located in North West State of the Republic of South Africa, occurs within an actinolite rock zone that was emplaced into the Kenkelbos-type granite of Proterozoic age. There are a large number of termite mounds in the prospect. For geochemical prospecting for rare earth elements (REEs), in total, 200 samples of termite mound material were collected from actinolite rock and granite zones in the prospect. Geochemical analyses of these termite mound materials were conducted by two methods: portable X-ray fluorescence (XRF) spectrometry and inductively coupled plasma-mass spectrometry (ICP-MS). Comparison of the two methods broadly indicates positive correlations of REEs (La, Ce, Pr, Nd, and Y), in particular Y and La having a strong correlation. As the result of modal abundance analyses, the actinolite rock at surface mainly consists of ferro-actinolite (89.89 wt%) and includes xenotime (0.26 wt%) and monazite (0.21 wt%) grains as REE minerals. Termite mound materials from actinolite rock also contain xenotime (0.27 wt%) and monazite (0.41 wt%) grains. In addition, termite mound materials from the actinolite rock zone have high hematite and Fe silicate contents compared to those from granite zone. These relationships suggest that REE minerals in termite mound materials originate form actinolite rock. Geochemical anomaly maps of Y, La, and Fe concentrations drawn based on the result of the portable XRF analyses show that high concentrations of these elements trend from SW to NE which broadly correspond to occurrences of actinolite body. These results indicate that termite mounds are an effective tool for REE geochemical prospection in the study area for both light REEs and Y, but a more detailed survey is required to establish the distribution of the actinolite rock body.

Layered hydrothermal barite-sulfide mound field, East Diamante Caldera, Mariana volcanic arc

Science.gov (United States)

Hein, James R.; de Ronde, Cornel E. J.; Koski, Randolph A.; Ditchburn, Robert G.; Mizell, Kira; Tamura, Yoshihiko; Stern, Robert J.; Conrad, Tracey; Ishizuka, Osamu; Leybourne, Matthew I.

2014-01-01

East Diamante is a submarine volcano in the southern Mariana arc that is host to a complex caldera ~5 × 10 km (elongated ENE-WSW) that is breached along its northern and southwestern sectors. A large field of barite-sulfide mounds was discovered in June 2009 and revisited in July 2010 with the R/V Natsushima, using the ROV Hyper-Dolphin. The mound field occurs on the northeast flank of a cluster of resurgent dacite domes in the central caldera, near an active black smoker vent field. A 40Ar/39Ar age of 20,000 ± 4000 years was obtained from a dacite sample. The mound field is aligned along a series of fractures and extends for more than 180 m east-west and >120 m north-south. Individual mounds are typically 1 to 3 m tall and 0.5 to 2 m wide, with lengths from about 3 to 8 m. The mounds are dominated by barite + sphalerite layers with the margins of each layer composed of barite with disseminated sulfides. Rare, inactive spires and chimneys sit atop some mounds and also occur as clusters away from the mounds. Iron and Mn oxides are currently forming small (caldera, mineralization resulted from focused flow along small segments of linear fractures rather than from a point source, typical of hydrothermal chimney fields. Based on the mineral assemblage, the maximum fluid temperatures were ~260°C, near the boiling point for the water depths of the mound field (367–406 m). Lateral fluid flow within the mounds precipitated interstitial sphalerite, silica, and Pb minerals within a network of barite with disseminated sulfides; silica was the final phase to precipitate. The current low-temperature precipitation of Fe and Mn oxides and silica may represent rejuvenation of the system.

Nano-soldering of magnetically aligned three-dimensional nanowire networks

International Nuclear Information System (INIS)

Gao Fan; Gu Zhiyong

2010-01-01

It is extremely challenging to fabricate 3D integrated nanostructures and hybrid nanoelectronic devices. In this paper, we report a simple and efficient method to simultaneously assemble and solder nanowires into ordered 3D and electrically conductive nanowire networks. Nano-solders such as tin were fabricated onto both ends of multi-segmented nanowires by a template-assisted electrodeposition method. These nanowires were then self-assembled and soldered into large-scale 3D network structures by magnetic field assisted assembly in a liquid medium with a high boiling point. The formation of junctions/interconnects between the nanowires and the scale of the assembly were dependent on the solder reflow temperature and the strength of the magnetic field. The size of the assembled nanowire networks ranged from tens of microns to millimeters. The electrical characteristics of the 3D nanowire networks were measured by regular current-voltage (I-V) measurements using a probe station with micropositioners. Nano-solders, when combined with assembling techniques, can be used to efficiently connect and join nanowires with low contact resistance, which are very well suited for sensor integration as well as nanoelectronic device fabrication.

Features of Pd-Ni-Fe solder system for vacuum brazing of low alloy steels

International Nuclear Information System (INIS)

Radzievskij, V.N.; Kurochko, R.S.; Lotsmanov, S.N.; Rymar', V.I.

1975-01-01

The brazing solder of the Pd-Ni-Fe alloyed with copper and lithium, in order to decrease the melting point and provide for a better spreading, when soldered in vacuum ensures a uniform strength of soldered joints with the base metal of low-alloyed steels of 34KHNIM-type. The properties of low-alloyed steel joints brazed with the Pd-Ni-Fe-system solder little depend on the changes in the soldering parameters. The soldered joint keeps a homogeneous structure after all the stages of heat treatment (annealing, quenching and tempering)

A Hodge dual for soldered bundles

International Nuclear Information System (INIS)

Lucas, Tiago Gribl; Pereira, J G

2009-01-01

In order to account for all possible contractions allowed by the presence of the solder form, a generalized Hodge dual is defined for the case of soldered bundles. Although for curvature the generalized dual coincides with the usual one, for torsion it gives a completely new dual definition. Starting from the standard form of a gauge Lagrangian for the translation group, the generalized Hodge dual yields precisely the Lagrangian of the teleparallel equivalent of general relativity, and consequently also the Einstein-Hilbert Lagrangian of general relativity

Characterization of the microstructure of tin-silver lead free solder

Energy Technology Data Exchange (ETDEWEB)

Hurtony, Tamás, E-mail: hurtony@ett.bme.hu [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary); Szakál, Alex; Almásy, László [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Len, Adél [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Faculty of Engineering and Information Technology, University of Pécs (Hungary); Kugler, Sándor [Department of Theoretical Physics, Budapest University of Technology and Economics (Hungary); Bonyár, Attila; Gordon, Péter [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary)

2016-07-05

Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag{sub 3}Sn phases.

Beads from Inhumation Rite Burials of Gnezdovo Burial Mound

Directory of Open Access Journals (Sweden)

Dobrova Olga P.

2017-12-01

Full Text Available The beads from 33 inhumation burials at Gnezdovo burial mound are examined in the article. The beads (total 367 were crafted from stretched tube (258, stretched stick (3, winding (45, press molding (2 pcs., welding (2 pcs., and mosaic beads (9 pcs.. The burial mound contains virtually no broken beads, including the settlement's most common yellow glass beads. Besides glass beads, cornelian, crystal, amber and faience beads have been registered among the burial mound material, as well as beads crafted with metal. Apart from beads, grave inventories contained a series of pendants with a bead strung on a wire ring. The considered complexes contain five pendants of this type. Besides Gnezdovo, similar pendants have been discovered in Kiev, Timerev, Pskov and Vladimir barrows. A comparison between bead sets from Gnezdovo and Kiev burial mounds allows to conclude that the general composition and occurrence frequency of beads is identical for these burials. At the same time, beads crafted with rock crystal, cornelian and metal are more frequently discovered in Kiev inhumations.

Dye-enhanced protein solders and patches in laser-assisted tissue welding.

Science.gov (United States)

Small, W; Heredia, N J; Maitland, D J; Da Silva, L B; Matthews, D L

1997-01-01

This study examines the use of dye-enhanced protein bonding agents in 805 nm diode laser-assisted tissue welding. A comparison of an albumin liquid solder and collagen solid-matrix patches used to repair arteriotomies in an in vitro porcine model is presented. Extrinsic bonding media in the form of solders and patches have been used to enhance the practice of laser tissue welding. Preferential absorption of the laser wavelength has been achieved by the incorporation of chromophores. Both the solder and the patch included indocyanine green dye (ICG) to absorb the 805 nm continuous-wave diode laser light used to perform the welds. Solder-mediated welds were divided into two groups (high power/short exposure and low power/long exposure), and the patches were divided into three thickness groups ranging from 0.1 to 1.3 mm. The power used to activate the patches was constant, but the exposure time was increased with patch thickness. Burst pressure results indicated that solder-mediated and patched welds yielded similar average burst strengths in most cases, but the patches provided a higher success rate (i.e., more often exceeded 150 mmHg) and were more consistent (i.e., smaller standard deviation) than the solder. The strongest welds were obtained using 1.0-1.3 mm thick patches, while the high power/short exposure solder group was the weakest. Though the solder and patches yielded similar acute weld strengths, the solid-matrix patches facilitated the welding process and provided consistently strong welds. The material properties of the extrinsic agents influenced their performance.

Drinking Water Contamination Due To Lead-based Solder

Science.gov (United States)

Garcia, N.; Bartelt, E.; Cuff, K. E.

2004-12-01

The presence of lead in drinking water creates many health hazards. Exposure to lead-contaminated water can affect the brain, the central nervous system, blood cells, and kidneys, causing such problems as mental retardation, kidney disease, heart disease, stroke, and death. One way in which lead can contaminate our water supply is through the use of lead solder to join pipes. Lead solder was widely used in the past because of its ease of application as well as its low cost. Lead contamination in residential areas has previously been found to be a particularly serious problem in first-draw samples, of water that has sat stagnant in pipes overnight. To investigate the time-dependence of drinking water lead contamination, we analyzed samples taken hourly of water exposed to lead solder. While our preliminary data was insufficient to show more than a rough correlation between time of exposure and lead concentration over short periods (1-3 hours), we were able to confirm that overnight exposure of water to lead-based solder results in the presence high levels of lead. We also investigated other, external factors that previous research has indicated contribute to increased concentrations of lead. Our analysis of samples of lead-exposed water at various pH and temperatures suggests that these factors can be equally significant in terms of their contribution to elevated lead concentration levels. In particular, water that is slightly corrosive appears to severely impact the solubility of lead. As this type of water is common in much of the Northeast United States, the presence of lead-based solder in residential areas there is especially problematic. Although lead-based solder has been banned since the 1980s, it remains a serious concern, and a practical solution still requires further research.

"Magnetic" termite mound surfaces are oriented to suit wind and shade conditions.

Science.gov (United States)

Jacklyn, Peter M

1992-09-01

The termites Amitermes meridionalis and A. laurensis construct remarkable meridional or "magnetic" mounds in northern Australia. These mounds vary geographically in mean orientation in a manner that suggests such variation is an adaptive response to local environmental conditions. Theoretical modelling of solar irradiance and mound rotation experiments show that maintenance of an eastern face temperature plateau during the dry season is the most likely physical basis for the mound orientation response. Subsequent heat transfer analysis shows that habitat wind speed and shading conditions also affect face temperature gradients such as the rate of eastern face temperature change. It is then demonstrated that the geographic variation in mean mound orientation follows the geographic variation in long-term wind speed and shading conditions across northern Australia such that an eastern face temperature plateau is maintained in all locations.

The Surales, Self-Organized Earth-Mound Landscapes Made by Earthworms in a Seasonal Tropical Wetland.

Directory of Open Access Journals (Sweden)

Anne Zangerlé

Full Text Available The formation, functioning and emergent properties of patterned landscapes have recently drawn increased attention, notably in semi-arid ecosystems. We describe and analyze a set of similarly spectacular landforms in seasonal tropical wetlands. Surales landscapes, comprised of densely packed, regularly spaced mounds, cover large areas of the Orinoco Llanos. Although descriptions of surales date back to the 1940's, their ecology is virtually unknown. From data on soil physical and chemical properties, soil macrofauna, vegetation and aerial imagery, we provide evidence of the spatial extent of surales and how they form and develop. Mounds are largely comprised of earthworm casts. Recognizable, recently produced casts account for up to one-half of total soil mass. Locally, mounds are relatively constant in size, but vary greatly across sites in diameter (0.5-5 m and height (from 0.3 m to over 2 m. This variation appears to reflect a chronosequence of surales formation and growth. Mound shape (round to labyrinth varies across elevational gradients. Mounds are initiated when large earthworms feed in shallowly flooded soils, depositing casts that form 'towers' above water level. Using permanent galleries, each earthworm returns repeatedly to the same spot to deposit casts and to respire. Over time, the tower becomes a mound. Because each earthworm has a restricted foraging radius, there is net movement of soil to the mound from the surrounding area. As the mound grows, its basin thus becomes deeper, making initiation of a new mound nearby more difficult. When mounds already initiated are situated close together, the basin between them is filled and mounds coalesce to form larger composite mounds. Over time, this process produces mounds up to 5 m in diameter and 2 m tall. Our results suggest that one earthworm species drives self-organizing processes that produce keystone structures determining ecosystem functioning and development.

The Surales, Self-Organized Earth-Mound Landscapes Made by Earthworms in a Seasonal Tropical Wetland.

Science.gov (United States)

Zangerlé, Anne; Renard, Delphine; Iriarte, José; Suarez Jimenez, Luz Elena; Adame Montoya, Kisay Lorena; Juilleret, Jérôme; McKey, Doyle

2016-01-01

The formation, functioning and emergent properties of patterned landscapes have recently drawn increased attention, notably in semi-arid ecosystems. We describe and analyze a set of similarly spectacular landforms in seasonal tropical wetlands. Surales landscapes, comprised of densely packed, regularly spaced mounds, cover large areas of the Orinoco Llanos. Although descriptions of surales date back to the 1940's, their ecology is virtually unknown. From data on soil physical and chemical properties, soil macrofauna, vegetation and aerial imagery, we provide evidence of the spatial extent of surales and how they form and develop. Mounds are largely comprised of earthworm casts. Recognizable, recently produced casts account for up to one-half of total soil mass. Locally, mounds are relatively constant in size, but vary greatly across sites in diameter (0.5-5 m) and height (from 0.3 m to over 2 m). This variation appears to reflect a chronosequence of surales formation and growth. Mound shape (round to labyrinth) varies across elevational gradients. Mounds are initiated when large earthworms feed in shallowly flooded soils, depositing casts that form 'towers' above water level. Using permanent galleries, each earthworm returns repeatedly to the same spot to deposit casts and to respire. Over time, the tower becomes a mound. Because each earthworm has a restricted foraging radius, there is net movement of soil to the mound from the surrounding area. As the mound grows, its basin thus becomes deeper, making initiation of a new mound nearby more difficult. When mounds already initiated are situated close together, the basin between them is filled and mounds coalesce to form larger composite mounds. Over time, this process produces mounds up to 5 m in diameter and 2 m tall. Our results suggest that one earthworm species drives self-organizing processes that produce keystone structures determining ecosystem functioning and development.

The Surales, Self-Organized Earth-Mound Landscapes Made by Earthworms in a Seasonal Tropical Wetland

Science.gov (United States)

Iriarte, José; Suarez Jimenez, Luz Elena; Adame Montoya, Kisay Lorena; Juilleret, Jérôme; McKey, Doyle

2016-01-01

The formation, functioning and emergent properties of patterned landscapes have recently drawn increased attention, notably in semi-arid ecosystems. We describe and analyze a set of similarly spectacular landforms in seasonal tropical wetlands. Surales landscapes, comprised of densely packed, regularly spaced mounds, cover large areas of the Orinoco Llanos. Although descriptions of surales date back to the 1940’s, their ecology is virtually unknown. From data on soil physical and chemical properties, soil macrofauna, vegetation and aerial imagery, we provide evidence of the spatial extent of surales and how they form and develop. Mounds are largely comprised of earthworm casts. Recognizable, recently produced casts account for up to one-half of total soil mass. Locally, mounds are relatively constant in size, but vary greatly across sites in diameter (0.5–5 m) and height (from 0.3 m to over 2 m). This variation appears to reflect a chronosequence of surales formation and growth. Mound shape (round to labyrinth) varies across elevational gradients. Mounds are initiated when large earthworms feed in shallowly flooded soils, depositing casts that form ‘towers’ above water level. Using permanent galleries, each earthworm returns repeatedly to the same spot to deposit casts and to respire. Over time, the tower becomes a mound. Because each earthworm has a restricted foraging radius, there is net movement of soil to the mound from the surrounding area. As the mound grows, its basin thus becomes deeper, making initiation of a new mound nearby more difficult. When mounds already initiated are situated close together, the basin between them is filled and mounds coalesce to form larger composite mounds. Over time, this process produces mounds up to 5 m in diameter and 2 m tall. Our results suggest that one earthworm species drives self-organizing processes that produce keystone structures determining ecosystem functioning and development. PMID:27168157

Horizon shells and BMS-like soldering transformations

Energy Technology Data Exchange (ETDEWEB)

Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)

2016-03-07

We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

Effects of soldering methods on tensile strength of a gold-palladium metal ceramic alloy.

Science.gov (United States)

Ghadhanfari, Husain A; Khajah, Hasan M; Monaco, Edward A; Kim, Hyeongil

2014-10-01

The tensile strength obtained by conventional postceramic application soldering and laser postceramic welding may require more energy than microwave postceramic soldering, which could provide similar tensile strength values. The purpose of the study was to compare the tensile strength obtained by microwave postceramic soldering, conventional postceramic soldering, and laser postceramic welding. A gold-palladium metal ceramic alloy and gold-based solder were used in this study. Twenty-seven wax specimens were cast in gold-palladium noble metal and divided into 4 groups: laser welding with a specific postfiller noble metal, microwave soldering with a postceramic solder, conventional soldering with the same postceramic solder used in the microwave soldering group, and a nonsectioned control group. All the specimens were heat treated to simulate a normal porcelain sintering sequence. An Instron Universal Testing Machine was used to measure the tensile strength for the 4 groups. The means were analyzed statistically with 1-way ANOVA. The surface and fracture sites of the specimens were subjectively evaluated for fracture type and porosities by using a scanning electron microscope. The mean (standard deviation) ultimate tensile strength values were as follows: nonsectioned control 818 ±30 MPa, microwave 516 ±34 MPa, conventional 454 ±37 MPa, and laser weld 191 ±39 MPa. A 1-way ANOVA showed a significant difference in ultimate tensile strength among the groups (F3,23=334.5; Ptensile strength for gold and palladium noble metals than either conventional soldering or laser welding. Conventional soldering resulted in a higher tensile strength than laser welding. Under the experimental conditions described, either microwave or conventional postceramic soldering would appear to satisfy clinical requirements related to tensile strength. Copyright © 2014 Editorial Council for the Journal of Prosthetic Dentistry. Published by Elsevier Inc. All rights reserved.

Partial Safety Factors for Rubble Mound Breakwaters

DEFF Research Database (Denmark)

Sørensen, John Dalsgaard; Burcharth, H. F.; Christiani, E.

1995-01-01

On the basis of the failure modes formulated in the various subtasks calibration of partial safety factors are described in this paper. The partial safety factors can be used to design breakwaters under quite different design conditions, namely probabilities of failure from 0.01 to 0.4, design...... lifetimes from 20 to 100 years and different qualities of wave data. A code of practice where safety is taken into account using partial safety factors is called a level I code. The partial safety factors are calibrated using First Order Reliability Methods (FORM, see Madsen et al. [1]) where...... in section 3. First Order Reliability Methods are described in section 4, and in section 5 it is shown how partial safety factors can be introduced and calibrated. The format of a code for design and analysis of rubble mound breakwaters is discussed in section 6. The mathematical formulation of the limit...

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

Directory of Open Access Journals (Sweden)

Yee Mei Leong

2016-06-01

Full Text Available Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag content solder SAC105 (Sn-1.0Ag-0.5Cu because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al addition (0.1–0.5 wt.% to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

Science.gov (United States)

Leong, Yee Mei; Haseeb, A.S.M.A.

2016-01-01

Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

International Nuclear Information System (INIS)

Chellvarajoo, Srivalli; Abdullah, M.Z.; Samsudin, Z.

2015-01-01

Highlights: • Fe 2 NiO 4 nanoparticles added into SAC 305 by mechanical mixing to form nanocomposite solder paste. • Nanoparticles in the composite solder travels with flux to the outermost surface after reflow. • The intermetallics compound reduced with the addition of nanoparticles into solder paste. • The hardness increased with the addition of limited percentage of nanoparticles into SAC 305. - Abstract: This study investigates the effects of the addition of Fe 2 NiO 4 nanoparticles into a SAC-305 lead-free solder paste. Iron, nickel, and oxide nano-elements were mixed with Pb-free solder alloying elements to produce a new form of nanocomposite solder paste, which can be a promising material in electronic packaging. The SAC-305 was mechanically added with 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles. The migration of nanoparticles in the nanocomposite solder paste to the outermost surface was clarified using the copper ‘sandwich’ method, which was performed after the reflow soldering process. Varying amounts of nanoparticles in the SAC-305 affected the IMC thickness and mechanical properties of the nanocomposite solder paste. The IMC thickness was reduced by 29.15%, 42.37%, and 59.00% after adding 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles in the SAC-305, respectively. However, via nanoindentation method, the hardness of the nanocomposite solder was improved by 44.07% and 56.82% after adding 0.5 and 1.5 wt.% of Fe 2 NiO 4 nanoparticles, respectively. If the addition of Fe 2 NiO 4 nanoparticle exceeded 1.5 wt.%, the hardness increased infinitely

The metallurgical approach on the solder voids behaviour in surface mount devices

International Nuclear Information System (INIS)

Mohabattul Zaman Bukhari

1996-01-01

Solder voids are believed to cause poor heat dissiption in the Surface Mount devices and reduce the reliability of the devices at higher operating services. There are a lot of factors involved in creating voids such as gas/flux entrapment, wettability, outgasseous, air bubbles in the solder paste, inconsistency of solder coverage and improper metal scheme selection. This study was done to observe the behaviour of the solder voids in term of flux entrapmentt and wettability. It is believed that flux entrapment and wettability are verify this hypothesis. Two types of metal scheme were chosen which are Nickel (Ni) plated and Tin (Sn) plated heatsink. X-ray techniques such as Radiographic Inspection Analysis and EDAX were used to detect the minute solder voids. The solder voids observed on the heatsinks and Copper shims after the reflow process are believed to be a non contact voids that resulted from some portion of the surface not wetting properly

Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

International Nuclear Information System (INIS)

Xiao, H.; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

2013-01-01

Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R 0 /R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints

Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

Energy Technology Data Exchange (ETDEWEB)

Xiao, H., E-mail: xiaohui2013@yahoo.com.cn; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

2013-11-25

Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R{sub 0}/R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints.

Variability of soil properties within large termite mounds in South Katanga, DRC - origins and applications.

Science.gov (United States)

Erens, Hans; Bazirake Mujinya, Basile; Boeckx, Pascal; Baert, Geert; Mees, Florias; Van Ranst, Eric

2014-05-01

The miombo woodlands of South Katanga (D.R. Congo) are characterized by a high spatial density of large conic termite mounds built by Macrotermes falciger (3 to 5 ha-1). With an average height of 5.05 m and diameter of 14.88 m, these are some of the largest biogenic structures in the world. The mound material is known to differ considerably from the surrounding Ferralsols. Specifically, mound material exhibits a finer texture, higher CEC and exchangeable basic cation content, lower organic matter content, and an accumulation of phosphorous, nitrate and secondary carbonates. However, as demonstrated by the present study, these soil properties are far from uniform within the volume of the mound. The termites' nesting and foraging activity, combined with pedogenic processes over extended periods of time, generates a wide range of physical, chemical, and biological conditions in different parts of the mound. Analysis of samples taken along a cross-section of a large active mound allowed generating contour plots, thus visualizing the variability of soil properties within the mound. The central columns of three other mounds were sampled to confirm apparent trends. The contour plots show that the mounds comprise four functional zones: (i) the active nest, found at the top; (ii) an accumulation zone , in more central parts of the mound; (iii) a dense inactive zone, surrounding the accumulation zone and consisting of accumulated erosion products from former active nests; and (iv) the outer mantle, characterized by intense varied biological activity and by a well-developed soil structure. Intermittent leaching plays a key role in explaining these patterns. Using radiocarbon dating, we found that some of these mounds are at least 2000 years old. Their current size and shape is likely the result of successive stages of erosion and rebuilding, in the course of alternating periods of mound abandonment and recolonization. Over time, termite foraging combined with limited leaching

Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

Energy Technology Data Exchange (ETDEWEB)

Iman, R.L.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States); Burress, R.V. [SEHO (United States)] [and others

1995-06-01

The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

Laser Soldering of Rat Skin Using a Controlled Feedback System

Directory of Open Access Journals (Sweden)

Mohammad Sadegh Nourbakhsh

2009-03-01

Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

Environmental assessment for commercialization of the Mound Plant

International Nuclear Information System (INIS)

1994-01-01

In November 1993 US DOE decided to phase out operations at the Mound Plant in Miamisburg, Ohio, with the goal of releasing the site for commercial use. The broad concept is to transform the plant into an advanced manufacturing center with the main focus on commercializing products and other technology. DOE proposes to lease portions of the Mound Plant to commercial enterprises. This Environmental Impact statement has a finding of no significant impact in reference to such action

How Termite Mounds Breath?

Science.gov (United States)

Saxena, Saurabh; Yaghoobian, Neda

2017-11-01

Fungus-cultivating termites of the subfamily Macrotermitinae that are extensively found throughout sub-Saharan Africa and south East Asia are one species of termites that collectively build massive, uninhabited, complex structures. These structures, which are much larger than the size of an individual termite, effectively use natural wind and solar energies and the energy embodied in colony's metabolic activity to maintain the necessary condition for termite survival. These mounds enclose a subterranean nest, where the termite live and cultivate fungus, as well as a complex network of tunnels consisting of a large, vertically oriented central chimney, surface conduits, and lateral connectives that connect the chimney and the surface conduits. In this study, we use computational modeling to explore the combined interaction of geometry, heterogeneous thermal mass, and porosity with the external turbulent wind and solar radiation to investigate the physical principles and fundamental aero-thermodynamics underlying the controlled and stable climate of termite mounds. Exploitation of natural resources of wind and solar energies in these natural systems for the purpose of ventilation will lead to new lessons for improving human habitats conditions.

Methane oxidation by termite mounds estimated by the carbon isotopic composition of methane

Science.gov (United States)

Sugimoto, Atsuko; Inoue, Tetsushi; Kirtibutr, Nit; Abe, Takuya

1998-12-01

Emission rates and carbon isotope ratios of CH4, emitted by workers of termites, and of CH4, emitted from their mounds, were observed in a dry evergreen forest in Thailand to estimate the proportion of CH4 oxidized during emission through the mound. The δ13C of CH4 emitted from a termite mound (-70.9 to -82.4‰) was higher than that of CH4 emitted by workers in the mound (-85.4 to -97. l‰). Using a fractionation factor (a = 0.987) for oxidation of CH4 which was obtained in the incubation experiment, an emission factor defined as (CH4 emitted from a termite mound/CH4 produced by termites) was calculated. The emission factor obtained in each termite mound was nearly zero for Macrotermes (fungus-growing termites), of which the nest has a thick soil wall and subterrannean termites, and 0.17 to 0.47 for Termitinae (small-mound-making termites). Global CH4 emission by termites was estimated on the basis of the CH4 emission rates by workers and termite biomass with the emission factors. The calculated result was 1.5 to 7.4 Tg/y (0.3 to 1.3% of total source), which is considerably smaller than the estimate by the IPCC [1994].

Upper Silurian reef mounds on a shallowing carbonate ramp, Devon Island, Arctic Canada

Energy Technology Data Exchange (ETDEWEB)

Dixon, O A [Ottawa Univ., ON (Canada); Graf, G C [Chevron Canada Resources, Calgary, AB (Canada)

1992-03-01

Near Gascoyne Inlet, the topmost Douro and lowermost Barlow Inlet formations record overall upward shallowing from ramp to shallow shelf conditions. This transitional sequence contains bioherms of various sizes, from small isolated reef mounds 1-2 m across to larger, compound reef mounds over 50 m thick and 60 m across, as well as distictive inter- and pre-reef mound facies. The larger reef mounds show stages intermediate in character between those in sponge-dominated reef mounds of the Douro Formation and in larger stromatoporoid-crinoid dominated reefs in the Barlow Inlet Formation. Three principal reef mounds developed in turn. An initial partly lithified lime mudstone, containing scattered corals and apparently relict sponge-cryptomicrobial fabrics, developed on sheets of oncolitic storm debris in mainly low energy conditions between storm and fairweather wave bases. With gradual shallowing and progressively higher energy conditions above fairweather wave base, a middle facies of coral- and crinoid-rich mudstone developed. An abrupt deepening restored conditions of low energy, and the ensuing upper facies of the reef mounds is more varied, comprising sparsely fossiliferous and locally fenestral lime mudstones, patchy coral bafflestone and bindstone, coarse encrinites and substantially culminating stromatoporoid bindstone. 36 refs., 14 figs., 5 tabs.

Monthly fluctuation of termite caste proportions (Isoptera) within fire ant mounds (hymenoptera: formicidae)

Science.gov (United States)

Thomas G. Shelton; J.T. Vogt; Marla J. Tanley; Arthur G. Appel

2003-01-01

Monthly abundance and caste proportions of subterranean termites (Reticulitennes spp.) inhabiting red imported fire ant (Solenopsis invicta Buren) mounds were recorded during 1999 and 2000 from a relatively undisturbed forest edge in Tuskegee, Alabama. Temperature data were also recorded at these mounds; mean air, soil, and mound temperatures followed a sine model over...

Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions

Science.gov (United States)

Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

2015-12-01

Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

Archaeological mounds as analogs of engineered covers for waste disposal sites: Literature review and progress report. [Appendix contains bibliography and data on archaeological mounds

Energy Technology Data Exchange (ETDEWEB)

Chatters, J C; Gard, H A

1991-09-01

Closure caps for low-level radioactive waste disposal facilities are typically designed as layered earthen structures, the composition of which is intended to prevent the infiltration of water and the intrusion of the public into waste forms. Federal regulations require that closure caps perform these functions well enough that minimum exposure guidelines will be met for at least 500 years. Short-term experimentation cannot mimic the conditions that will affect closure caps on the scale of centuries, and therefore cannot provide data on the performance of cap designs over long periods of time. Archaeological mounds hundreds to thousands of years old which are closely analogous to closure caps in form, construction details, and intent can be studied to obtain the necessary understanding of design performance. Pacific Northwest Laboratory conducted a review and analysis of archaeological literature on ancient human-made mounds to determine the quality and potential applicability of this information base to assessments of waste facility design performance. A bibliography of over 200 English-language references was assembled on mound structures from the Americas, Europe, and Asia. A sample of these texts was read for data on variables including environmental and geographic setting, condition, design features, construction. Detailed information was obtained on all variables except those relating to physical and hydrological characteristics of the mound matrix, which few texts presented. It is concluded that an extensive amount of literature and data are available on structures closely analogous to closure caps and that this information is a valuable source of data on the long-term performance of mounded structures. Additional study is recommended, including an expanded analysis of design features reported in the literature and field studies of the physical and hydraulic characteristics of different mound designs. 23 refs., 10 figs., 12 tabs.

Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

Science.gov (United States)

Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

2010-09-15

As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

Science.gov (United States)

Haseeb, A. S. M. A.; Arafat, M. M.; Tay, S. L.; Leong, Y. M.

2017-10-01

Tin (Sn)-based solders have established themselves as the main alternative to the traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn-based solders continues to be a concern. In order to make Sn-based solders microstructurally more stable and hence more reliable, researchers are showing great interest in investigating the effects of the incorporation of different nanoparticles into them. This paper gives an overview of the influence of metallic nanoparticles on the characteristics of interfacial intermetallic compounds (IMCs) in Sn-based solder joints on copper substrates during reflow and thermal aging. Nanocomposite solders were prepared by mechanically blending nanoparticles of nickel (Ni), cobalt (Co), zinc (Zn), molybdenum (Mo), manganese (Mn) and titanium (Ti) with Sn-3.8Ag-0.7Cu and Sn-3.5Ag solder pastes. The composite solders were then reflowed and their wetting characteristics and interfacial microstructural evolution were investigated. Through the paste mixing route, Ni, Co, Zn and Mo nanoparticles alter the morphology and thickness of the IMCs in beneficial ways for the performance of solder joints. The thickness of Cu3Sn IMC is decreased with the addition of Ni, Co and Zn nanoparticles. The thickness of total IMC layer is decreased with the addition of Zn and Mo nanoparticles in the solder. The metallic nanoparticles can be divided into two groups. Ni, Co, and Zn nanoparticles undergo reactive dissolution during solder reflow, causing in situ alloying and therefore offering an alternative route of alloy additions to solders. Mo nanoparticles remain intact during reflow and impart their influence as discrete particles. Mechanisms of interactions between different types of metallic nanoparticles and solder are discussed.

Fundamentals of lead-free solder interconnect technology from microstructures to reliability

CERN Document Server

Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao

2015-01-01

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

International Nuclear Information System (INIS)

Li Guangdong; Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu

2010-01-01

In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

Energy Technology Data Exchange (ETDEWEB)

Li Guangdong, E-mail: liguangdong@emails.bjut.edu.c [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China); Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China)

2010-02-18

In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

In vitro conjunctival incision repair by temperature-controlled laser soldering.

Science.gov (United States)

Norman, Galia; Rabi, Yaron; Assia, Ehud; Katzir, Abraham

2009-01-01

The common method of closing conjunctival incisions is by suturing, which is associated with several disadvantages. It requires skill to apply and does not always provide a watertight closure, which is required in some operations (e.g., glaucoma filtration). The purpose of the present study was to evaluate laser soldering as an alternative method for closing conjunctival incisions. Conjunctival incisions of 20 ex vivo porcine eyes were laser soldered using a temperature-controlled fiberoptic laser system and an albumin mixed with indocyanine green as a solder. The control group consisted of five repaired incisions by a 10-0 nylon running suture. The leak pressure of the repaired incisions was measured. The mean leak pressure in the laser-soldered group was 132 mm Hg compared to 4 mm Hg in the sutured group. There was no statistically significant difference in both the incision's length and distance from the limbus between the groups, before and after the procedure, indicating that there was no severe thermal damage. These preliminary results clearly demonstrate that laser soldering may be a useful method for achieving an immediate watertight conjunctival wound closure. This procedure is faster and easier to apply than suturing.

Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

International Nuclear Information System (INIS)

Durairaj, R.; Ramesh, S.; Mallik, S.; Seman, A.; Ekere, N.

2009-01-01

Lead-free solder paste printing process accounts for majority of the assembly defects in the electronic manufacturing industry. The study investigates rheological behaviour and stencil printing performance of the lead-free solder pastes (Sn/Ag/Cu). Oscillatory stress sweep test was carried out to study the visco-elastic behaviour of the lead-free solder pastes. The visco-elastic behaviour of the paste encompasses solid and liquid characteristic of the paste, which could be used to study the flow behaviour experienced by the pastes during the stencil printing process. From this study, it was found that the solid characteristics (G') is higher than the liquid characteristic (G'') for the pastes material. In addition, the results from the study showed that the solder paste with a large G' = G'' has a higher cohesiveness resulting in poor withdrawal of the paste during the stencil printing process. The phase angles (δ) was used to correlate the quality of the dense suspensions to the formulation of solder paste materials. This study has revealed the value of having a rheological measurement for explaining and characterising solder pastes for stencil printing. As the demand for lead free pastes increases rheological measurements can assist with the formulation or development of new pastes.

Environmental assessment of coal waste mounds in Japan using remote sensing techniques

Energy Technology Data Exchange (ETDEWEB)

Lewis, A J; Gotoh, K; Aoyama, K; Aoki, S [Louisiana State University, Baton Rouge, LA (United States). Department of Geography and Anthropology

1993-01-01

Focuses on the application of remote sensing techniques to the study of coal waste mounds. The situation at the coal waste mounds in Fukuoka, Japan is cited. Guidelines on film parameters, photographic keys and tasks required to inventory, monitor and manage coal waste mounds in Japan are addressed. Application of photogrammetry, remote sensing, aerial photography and satellite imagery techniques in monitoring spoil banks is reviewed. Applicability of the techniques is discussed. 24 refs.

The relationships between termite mound CH4/CO2 emissions and internal concentration ratios are species specific

Directory of Open Access Journals (Sweden)

H. Jamali

2013-04-01

Full Text Available We investigated the relative importance of CH4 and CO2 fluxes from soil and termite mounds at four different sites in the tropical savannas of northern Australia near Darwin and assessed different methods to indirectly predict CH4 fluxes based on CO2 fluxes and internal gas concentrations. The annual flux from termite mounds and surrounding soil was dominated by CO2 with large variations among sites. On a carbon dioxide equivalent (CO2-e basis, annual CH4 flux estimates from termite mounds were 5- to 46-fold smaller than the concurrent annual CO2 flux estimates. Differences between annual soil CO2 and soil CH4 (CO2-e fluxes were even greater, soil CO2 fluxes being almost three orders of magnitude greater than soil CH4 (CO2-e fluxes at site. The contribution of CH4 and CO2 emissions from termite mounds to the total CH4 and CO2 emissions from termite mounds and soil in CO2-e was less than 1%. There were significant relationships between mound CH4 flux and mound CO2 flux, enabling the prediction of CH4 flux from measured CO2 flux; however, these relationships were clearly termite species specific. We also observed significant relationships between mound flux and gas concentration inside mound, for both CH4 and CO2, and for all termite species, thereby enabling the prediction of flux from measured mound internal gas concentration. However, these relationships were also termite species specific. Using the relationship between mound internal gas concentration and flux from one species to predict mound fluxes from other termite species (as has been done in the past would result in errors of more than 5-fold for mound CH4 flux and 3-fold for mound CO2 flux. This study highlights that CO2 fluxes from termite mounds are generally more than one order of magnitude greater than CH4 fluxes. There are species-specific relationships between CH4 and CO2 fluxes from a mound, and between the inside mound concentration of a gas and the mound flux emission of the

The relationships between termite mound CH4/CO2 emissions and internal concentration ratios are species specific

Science.gov (United States)

Jamali, H.; Livesley, S. J.; Hutley, L. B.; Fest, B.; Arndt, S. K.

2013-04-01

We investigated the relative importance of CH4 and CO2 fluxes from soil and termite mounds at four different sites in the tropical savannas of northern Australia near Darwin and assessed different methods to indirectly predict CH4 fluxes based on CO2 fluxes and internal gas concentrations. The annual flux from termite mounds and surrounding soil was dominated by CO2 with large variations among sites. On a carbon dioxide equivalent (CO2-e) basis, annual CH4 flux estimates from termite mounds were 5- to 46-fold smaller than the concurrent annual CO2 flux estimates. Differences between annual soil CO2 and soil CH4 (CO2-e) fluxes were even greater, soil CO2 fluxes being almost three orders of magnitude greater than soil CH4 (CO2-e) fluxes at site. The contribution of CH4 and CO2 emissions from termite mounds to the total CH4 and CO2 emissions from termite mounds and soil in CO2-e was less than 1%. There were significant relationships between mound CH4 flux and mound CO2 flux, enabling the prediction of CH4 flux from measured CO2 flux; however, these relationships were clearly termite species specific. We also observed significant relationships between mound flux and gas concentration inside mound, for both CH4 and CO2, and for all termite species, thereby enabling the prediction of flux from measured mound internal gas concentration. However, these relationships were also termite species specific. Using the relationship between mound internal gas concentration and flux from one species to predict mound fluxes from other termite species (as has been done in the past) would result in errors of more than 5-fold for mound CH4 flux and 3-fold for mound CO2 flux. This study highlights that CO2 fluxes from termite mounds are generally more than one order of magnitude greater than CH4 fluxes. There are species-specific relationships between CH4 and CO2 fluxes from a mound, and between the inside mound concentration of a gas and the mound flux emission of the same gas, but

Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

Energy Technology Data Exchange (ETDEWEB)

Xia Yanghua [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)], E-mail: xia_yanghua@hotmail.com; Xie Xiaoming [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)

2008-04-24

The reliability of lead-free electronic assemblies under thermal cycling was investigated. Thin small outline package (TSOP) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) were studied. The results show that OSP finish reveals better performance than its ENIG counterparts. The crack originates at the fringe of heel fillet in both cases. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface. When the OSP finishes are employed, many Cu6Sn5 precipitates form inside the bulk solder and have a strengthening effect on the solder joint, resulting in better reliability performance as compared to those with ENIG finishes.

The occurrence and development of peat mounds on King George Island (Maritime Antarctic

Directory of Open Access Journals (Sweden)

Jerzy Fabiszewski

2014-01-01

Full Text Available On King George Island, South Shetlands Islands, a type of peat formation has been discovered which has not previously been reported from the Antarctic. These formations are in shape of mounds up to 7x 15 m in area, with a peat layer of about I m thick. About twenty five cm below the surface there is a layer of permanently frozen peat. The mounds are covered by living mosses (Polytrichum alpinum and Drepanocladus uncinatus, Antarctic hair grass (Deschampsia antarctica and lichens. Erosion fissures occurring on the surface are evidence of contemporary drying and cessation of the mound's growth. The initial phase of the development of the mounds began with a community dominated by Calliergidium austro-stramineum and Deschampsia antarctica, and their further development has been due to peat accumulation formed almost entirely by Calliergidium. The location of the mounds is near a penguin rookery, which clearly conditioned the minerotrophic character of these formations, as compared with the "moss peat banks" formed by Chorisodontium aciphyllum and Polytrichum al-pestre. Moreover, the peat mounds differ from the latter in several ways, e.g. rate of growth and floristic composition. Radiocarbon dating of peat from the base of one mound gave an age of 4090±60 years B.P. This suggests that the age of the tundra on King George Island is about 5000-4000 years.

Corrosion Reliability of Lead-free Solder Systems Used in Electronics

DEFF Research Database (Denmark)

Li, Feng; Verdingovas, Vadimas; Medgyes, Balint

2017-01-01

humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods...

Stability Of Rubble Mound Breakwaters Using High Density Rock

DEFF Research Database (Denmark)

Burcharth, H. F.; Beck, J. B.

2000-01-01

The present paper discusses the effect of mass density on stability of rubble mound breakwaters. A short literature review of existing knowledge is give to establish a background for the ongoing research. Furthermore, several model tests are described in which the stability of rubble mound...... breakwaters with armour stones of different densities are investigated. The results from the model test are discussed with respect to application and further research....

Processing and Characterization of NiTi Shape Memory Alloy Particle Reinforced Sn-In Solders

National Research Council Canada - National Science Library

Chung, Kohn C

2006-01-01

.... In previous work, it was proposed that reinforcement of solder by NiTi shape memory alloy particles to form smart composite solder reduces the inelastic strain of the solder and hence, may enhance...

Interfacial reaction of Sn-based solder joint in the package system

Science.gov (United States)

Gu, Huandi

In this thesis, I report a study on the effect of the solder size on intermetallic layer formation by comparing the morphology change and growth rate of two different size solder joint aged at a same temperature for different aging time. The layer thickness and microstructure were analyzed using scanning electron microscopy (SEM). Photoshop was used to measure the thickness of intermetallic compound. Two different size of solder joints with composition of Sn-Ag-Cu (305) were used.

The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder

Science.gov (United States)

Mayappan, R.; Salleh, A.; Andas, J.

2017-09-01

Solder has been widely used in electronic industry as interconnection for electronic packaging. European Union and Japan have restricted the use of Sn-Pb solder as it contains lead which can harmful to human health and environment. Due to this, many researches have been done in order to find a suitable replacement for the lead solder. Although many lead-free solders are available, the Sn-3.5Ag solder with the addition of graphene seem to be a suitable candidate. In this study, a 0.07 wt% graphene nanosheet was added into the Sn-3.5Ag solder and this composite solder was prepared under powder metallurgy method. The solder was reacted with copper substrate at 250 °C for one minute. For joint strength analysis, two copper strips were soldered together. The solder joint was aged at temperature 100 °C for 500 hours. Scanning Electron Microscope (SEM) was used to observe the interfacial reaction and Instron machine was used to determine the joint strength. Cu6Sn5 intermetallic layer was formed at the interface between the Cu substrate and the solders. Composite solder showed the retardation of the intermetallic growth compared to the plain solder. The thickness value of the intermetallic was used to calculate the growth rate the IMC. The graphene nanosheets added solder has lower growth rate which is 3.86 × 10-15 cm2/s compared to the plain solder 7.15 × 10-15 cm2/s. Shear strength analysis show that the composite solder has higher joint compared to the plain solder.

Effect of Preconditioning and Soldering on Failures of Chip Tantalum Capacitors

Science.gov (United States)

Teverovsky, Alexander A.

2014-01-01

Soldering of molded case tantalum capacitors can result in damage to Ta205 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture content on the probability of post-soldering electrical failures. In this work, that is based on a case history, different groups of similar types of CWR tantalum capacitors from two lots were prepared for soldering by bake, moisture saturation, and longterm storage at room conditions. Results of the testing showed that both factors: initial quality of the lot, and preconditioning affect the probability of failures. Baking before soldering was shown to be effective to prevent failures even in lots susceptible to pop-corning damage. Mechanism of failures is discussed and recommendations for pre-soldering bake are suggested based on analysis of moisture characteristics of materials used in the capacitors' design.

30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

Science.gov (United States)

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

Soldering and brazing safety guide: A handbook on space practice for those involved in soldering and brazing

Science.gov (United States)

This manual provides those involved in welding and brazing with effective safety procedures for use in performance of their jobs. Hazards exist in four types of general soldering and brazing processes: (1) cleaning; (2) application of flux; (3) application of heat and filler metal; and (4) residue cleaning. Most hazards during those operations can be avoided by using care, proper ventilation, protective clothing and equipment. Specific process hazards for various methods of brazing and soldering are treated. Methods to check ventilation are presented as well as a check of personal hygiene and good maintenance practices are stressed. Several emergency first aid treatments are described.

SPATIAL VARIABILITY AND VITALITY OF EPIGEOUS TERMITE MOUNDS IN PASTURES OF MATO GROSSO DO SUL, BRAZIL

Directory of Open Access Journals (Sweden)

Sandra Santana Lima

2015-02-01

Full Text Available Epigeous termite mounds are frequently observed in pasture areas, but the processes regulating their population dynamics are poorly known. This study evaluated epigeous termite mounds in cultivated grasslands used as pastures, assessing their spatial distribution by means of geostatistics and evaluating their vitality. The study was conducted in the Cerrado biome in the municipality of Rio Brilhante, Mato Grosso do Sul, Brazil. In two pasture areas (Pasture 1 and Pasture 2, epigeous mounds (nests were georeferenced and analyzed for height, circumference and vitality (inhabited or not. The area occupied by the mounds was calculated and termite specimens were collected for taxonomic identification. The spatial distribution pattern of the mounds was analyzed with geostatistical procedures. In both pasture areas, all epigeous mounds were built by the same species, Cornitermes cumulans. The mean number of mounds per hectare was 68 in Pasture 1 and 127 in Pasture 2, representing 0.4 and 1 % of the entire area, respectively. A large majority of the mounds were active (vitality, 91 % in Pasture 1 and 84 % in Pasture 2. A “pure nugget effect” was observed in the semivariograms of height and nest circumference in both pastures reflecting randomized spatial distribution and confirming that the distribution of termite mounds in pastures had a non-standard distribution.

Visual detection of defects in solder joints

Science.gov (United States)

Blaignan, V. B.; Bourbakis, Nikolaos G.; Moghaddamzadeh, Ali; Yfantis, Evangelos A.

1995-03-01

The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new `frame' for the achievement of better results regarding efficiency, products quality and automated service. In this paper the visual detection and classification of different types of defects on solder joints in PC boards is presented by combining several image processing methods, such as smoothing, segmentation, edge detection, contour extraction and shape analysis. The results of this paper are based on simulated solder defects and a real one.

Elimination of the Mound-Building Termite, Nasutitermes exitiosus (Isoptera: Termitidae) in South-Eastern Australia Using Bistrifluron Bait.

Science.gov (United States)

Webb, Garry A; Mcclintock, Charles

2015-12-01

Bistrifluron, a benzoylphenylurea compound, was evaluated for efficacy against Nasutitermes exitiosus (Hill), a mound-building species in southern Australia. Bistrifluron bait (trade name Xterm) was delivered as containerized pellets inserted into plastic feeding stations implanted in the sides of mounds-60 g for bistrifluron bait-treated mounds and 120 g of blank bait for untreated mounds. Termites actively tunneled in the gaps between pellets and removed bait from the canisters. All five treated mounds were eventually eliminated, and all five untreated mounds remained active at the end of the trial. Four of the five treated mounds were considered dead and excavated after 26 wk, but there were earlier signs of mound distress-reduced repair of experimental casement damage and reduced activity in bait canisters by 22 wk and reduced internal mound temperature after 11 wk. One treated mound showed activity in the bait station right through until almost the end of the trial (47 wk), but excavation at 49 wk showed no further activity in the mound. The five untreated colonies removed on average 97% of blank bait offered, while the five treated colonies removed on average 39.1% of bait offered. There was a wide variation in temperature profiles of mounds (up to 15°C for both minimum and maximum internal temperatures), from the beginning of the trial and even before the effects of baiting were evident. © The Authors 2015. Published by Oxford University Press on behalf of Entomological Society of America. All rights reserved. For Permissions, please email: journals.permissions@oup.com.

Permanent groundwater storage in basaltic dyke fractures and termite mound viability

Science.gov (United States)

Mège, Daniel; Rango, Tewodros

2010-04-01

Many basaltic dykes of the Ethiopian flood basalt province are observed in the northwestern Ethiopian lowlands. In this area, the termites preferentially build their epigeous mounds on the top of dolerite dykes. The relationship between termite mounds and dykes is investigated from the analysis of their distribution along one of these dykes, of thickness 2-5 m, that we could follow over 2000 m. Termite mounds are periodically spaced (mean distance 63 m, R2 = 0.995), and located exclusively where the topographic relief of the dyke is not more than 2 m above the surrounding area. From these observations and from the geological context, a hydrological circuit model is proposed in which (1) dykes are preferential conduits for groundwater drainage during the rainy season due to pervasive jointing, (2) during the dry season, the portion of the dyke forming a local topographic relief area dries up more quickly than the surroundings, the elevation difference between the dyke summit and the surroundings being a factor restricting termite mound development. For dyke topographic relief >2 m, drying is an obstacle for maintaining the appropriate humidity for the termite colony life. Periodic termite mound spacing is unlikely to be related to dyke or other geological properties. It is more likely related to termite population behaviour, perhaps to clay shortage, which restricts termite population growth by limiting the quantity of building material available for mound extension, and triggers exploration for a new colonization site that will be located along the dyke at a distance from the former colony that may be controlled by the extent of the zone covered by its trail pheromones. This work brings out the importance of dykes in channelling and storing groundwater in semiarid regions, and shows that dykes can store groundwater permanently in such settings even though the dry season is half the year long. It contributes also to shedding light on water supply conditions

A review on solder reflow and flux application for flip chip

Science.gov (United States)

Suppiah, Sarveshvaran; Ong, Nestor Rubio; Sauli, Zaliman; Sarukunaselan, Karunavani; Alcain, Jesselyn Barro; Visvanathan, Susthitha Menon; Retnasamy, Vithyacharan

2017-09-01

This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

Science.gov (United States)

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

Directory of Open Access Journals (Sweden)

Saliza Azlina O.

2016-01-01

Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

Energy Technology Data Exchange (ETDEWEB)

Lin, C.-T. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China); Hsi, C.-S. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Wang, M.-C. [Faculty of Fragrance and Cosmetics, Kaohsiung Medical University, 100 Shih-Chuan 1st Road, Kaohsiung 807, Taiwan (China)], E-mail: mcwang@kmu.edu.tw; Chang, T.-C.; Liang, M.-K. [Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China)

2008-07-14

Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 {+-} 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 {+-} 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 {+-} 0.3 and 1.7 {+-} 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu{sub 5}Zn{sub 8} intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu{sub 6}Sn{sub 5} IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu{sub 6}Sn{sub 5} IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength.

Automation of experimental research of waveguide paths induction soldering

Science.gov (United States)

Tynchenko, V. S.; Petrenko, V. E.; Kukartsev, V. V.; Tynchenko, V. V.; Antamoshkin, O. A.

2018-05-01

The article presents an automated system of experimental studies of the waveguide paths induction soldering process. The system is a part of additional software for a complex of automated control of the technological process of induction soldering of thin-walled waveguide paths from aluminum alloys, expanding its capabilities. The structure of the software product, the general appearance of the controls and the potential application possibilities are presented. The utility of the developed application by approbation in a series of field experiments was considered and justified. The application of the experimental research system makes it possible to improve the process under consideration, providing the possibility of fine-tuning the control regulators, as well as keeping the statistics of the soldering process in a convenient form for analysis.

Optimization of the soldering process by the DMAIC methodology

Directory of Open Access Journals (Sweden)

Michał Zasadzień

2016-06-01

Full Text Available The chapter presents the use of the DMAIC method for the analysis and improvement of the process of soldering pins in a plug connecting a bundle of wires to the board of a controller; a part of the steering system of a car. The main problem in the soldering process, that is an unsatisfactory share of bad soldered connections between the board and the plug and the instability of that number, was identified by means of a five-phase improvement process. Key points and main causes of the defect were pointed out, and process improvement measures were suggested. Due to the analysis conducted and the correct implementation of improvement measures the share of defective connections has been decreased twofold.

Contamination profile on typical printed circuit board assemblies vs soldering process

DEFF Research Database (Denmark)

Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

2014-01-01

Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

Sub-kilometre (intra-crater) mounds in Utopia Planitia, Mars: character, occurrence and possible formation hypotheses

Science.gov (United States)

Soare, Richard J.; Conway, Susan J.; Pearce, Geoffrey D.; Costard, François; Séjourné, Antoine

2013-08-01

At the middle latitudes of Utopia Planitia (˜35-45°N; ˜65-101°E) hundreds of small-sized mounds located in sub-kilometre impact craters dot the landscape. Their shape varies from circular to crescentic and their height ranges from ˜10 to 50 m. Often, metre to decametre pitting is observed, as is metres-thick banding or stratification. Mound albedo is relatively high, i.e. ˜0.16. The plain's terrain in the region, previously linked to the latitude-dependent mantle (LDM) of ice-dust, displays pitting and albedo similar to the small intra-crater mounds. Some workers have suggested that the mounds and the plain's terrain share a common ice-dust origin. If so, then scrutinising the mounds could provide analogical insight on the key geological characteristics and spatial distribution of the LDM itself. Other workers have hypothesised that the mounds are eroded sedimentary landforms or periglacial mounds underlain by a perennial ice-core (closed-system pingos). In this article we develop and then discuss each of the three mound-hypotheses in a much more substantial manner than has been done hitherto. Towards this end we use high-resolution images, present a detailed regional-map of mound distribution and establish a regional platform of topographical analysis using MOLA data superposed on a large-scale CTX mosaic. Although the ice-dust hypothesis is consistent with some observations and measurements, we find that a (loess-based) sedimentary hypothesis shows greater plausibility. Of the three hypotheses evaluated, the pingo or periglacial one is the weakest.

Molluskan fauna in two shell mounds in the State of Parana coast, Brazil

Directory of Open Access Journals (Sweden)

Marcos de Vasconcellos Gernet

2011-09-01

Full Text Available The shell mounds are artificial formations consisting mostly of mollusk shells used in the feeding of the prehistoric peoples which inhabited our coast. These sites are found throughout the Brazilian coast, and hundreds of them were cataloged in the State of Paraná since the 1940s. The fragility of these sites, their importance as evidences of our prehistoric period, and its abrupt disappearance, justify the need for new researches which contribute to contextualize and draw up plans to preserve this heritage. The works related to the molluskan fauna found in the shell mounds are restricted to refer to the most common species and, sometimes, just their popular names. A greater knowledge on these prehistoric inhabitants’ diet allows a better understanding of ancient natural ecosystems. The survey of mollusks was carried out in the shell mounds Guaraguaçu and Boguaçu, in the towns of Pontal do Parana and Guaratuba, respectively, and performed through visual inspection, reading of specialized bibliography and comparison to previous works on the fauna of the shell mounds in the State of Parana coast. Altogether, 29 species were observed in the shell mound Guaraguaçu and 17 species were observed in the shell mound Boguaçu, resulting in a total of 31 species.

Estimating Groundwater Mounding in Sloping Aquifers for Managed Aquifer Recharge.

Science.gov (United States)

Zlotnik, Vitaly A; Kacimov, Anvar; Al-Maktoumi, Ali

2017-11-01

Design of managed aquifer recharge (MAR) for augmentation of groundwater resources often lacks detailed data, and simple diagnostic tools for evaluation of the water table in a broad range of parameters are needed. In many large-scale MAR projects, the effect of a regional aquifer base dip cannot be ignored due to the scale of recharge sources (e.g., wadis, streams, reservoirs). However, Hantush's (1967) solution for a horizontal aquifer base is commonly used. To address sloping aquifers, a new closed-form analytical solution for water table mound accounts for the geometry and orientation of recharge sources at the land surface with respect to the aquifer base dip. The solution, based on the Dupiuit-Forchheimer approximation, Green's function method, and coordinate transformations is convenient for computing. This solution reveals important MAR traits in variance with Hantush's solution: mounding is limited in time and space; elevation of the mound is strongly affected by the dip angle; and the peak of the mound moves over time. These findings have important practical implications for assessment of various MAR scenarios, including waterlogging potential and determining proper rates of recharge. Computations are illustrated for several characteristic MAR settings. © 2017, National Ground Water Association.

Effects of rework on adhesion of Pb-In soldered gold thick films

International Nuclear Information System (INIS)

Gehman, R.W.; Becka, G.A.; Losure, J.A.

1982-02-01

The feasibility of repeatedly reworking Pb-In soldered joints on gold thick films was evaluated. Nailhead adhesion tests on soldered thick films typically resulted in failure within the bulk solder (50 In-50 Pb). Average strengths increased with each rework, and the failure mode changed. An increase in metalization lift-off occurred with successive reworks. An investigation was initiated to determine why these changes occurred. Based on this work, the thick film adhesion to the substrate appeared to be lowered by indium reduction of cadmium oxide and by formation of a weak, brittle intermetallic compound, Au 9 In 4 . It was concluded that two solder reworks could be conducted without significant amounts of metallization lift-off during nailhead testing

The relationship between termite mound CH4/CO2 emissions and internal concentration ratios are species specific

Science.gov (United States)

Jamali, H.; Livesley, S. J.; Hutley, L. B.; Fest, B.; Arndt, S. K.

2012-12-01

1. We investigated the relative importance of CH4 and CO2 fluxes from soil and termite mounds at four different sites in the tropical savannas of Northern Australia near Darwin and assessed different methods to indirectly predict CH4 fluxes based on CO2 fluxes and internal gas concentrations. 2. The annual flux from termite mounds and surrounding soil was dominated by CO2 with large variations among sites. On a CO2-e basis, annual CH4 flux estimates from termite mounds were 5- to 46-fold smaller than the concurrent annual CO2 flux estimates. Differences between annual soil CO2 and soil CH4 (CO2-e) fluxes were even greater, soil CO2 fluxes being almost three orders of magnitude greater than soil CH4 (CO2-e) fluxes at site. 3. There were significant relationships between mound CH4 flux and mound CO2 flux, enabling the prediction of CH4 flux from measured CO2 flux, however, these relationships were clearly termite species specific. 4. We also observed significant relationships between mound flux and gas concentration inside mound, for both CH4 and CO2, and for all termite species, thereby enabling the prediction of flux from measured mound internal gas concentration. However, these relationships were also termite species specific. Using the relationship between mound internal gas concentration and flux from one species to predict mound fluxes from other termite species (as has been done in past) would result in errors of more than 5-fold for CH4 and 3-fold for CO2. 5. This study highlights that CO2 fluxes from termite mounds are generally more than one order of magnitude greater than CH4 fluxes. There are species-specific relationships between CH4 and CO2 fluxes from a~mound, and between the inside mound concentration of a gas and the mound flux emission of the same gas, but these relationships vary greatly among termite species. Consequently, there is no generic relationship that will allow for the prediction of CH4 fluxes from termite mounds of all species.

Greener management practices - ash mound reclamation

Energy Technology Data Exchange (ETDEWEB)

Kapur, S.L.; Shyam, A.K.; Soni, R. [National Thermal Power Corp. Ltd., New Delhi (India)

2002-12-01

The dry ash handling system at Dadri has been pioneered for the first time in India by the National Thermal Power Corporation (NTPC). The system is similar to that at the Drax power station in England. The paper reports the successful experimental trials carried out on vegetation of temporary ash mounds to assess the growth potential of local herbs, shrubs, trees and grasses directly on ash with no soil cover or fertiliser. These were extended to trials directly on the available (completed) mound surfaces. The grass Cynodon dactylon germinated well as did seeds of tree species including the Casurarina and Eucalyptus. It is hoped that efforts at Dadri will ultimately transform the ash into a productive and self sustaining ecosystem, as leaf fall adds additional organic material and the weathering process continues. 6 refs., 6 figs.

Effect of gamma radiation on micromechanical hardness of lead-free solder joint

Energy Technology Data Exchange (ETDEWEB)

Paulus, Wilfred [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Malaysian Nuclear Agency, Bangi, 43000 Kajang, Selangor (Malaysia); Rahman, Irman Abdul; Jalar, Azman; Kamil, Insan; Bakar, Maria Abu [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Yusoff, Wan Yusmawati Wan [Universiti Pertahanan Nasional Malaysia, Kem Sg. Besi, 57000 Kuala Lumpur (Malaysia)

2015-09-25

Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the increment of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.

Stability of Monolithic Rubble Mound Breakwater Crown Walls Subjected to Impulsive Loading

DEFF Research Database (Denmark)

Nørgaard, Jørgen Harck; Andersen, Lars Vabbersgaard; Andersen, Thomas Lykke

2012-01-01

This paper evaluates the validity of a simple onedimensional dynamic analysis as well as a FEM model to determine the sliding of a rubble mound breakwater crown wall. The evaluation is based on a case example with real wave load time series and displacements measured from two-dimensional physical...... model tests. The outcome is a more reliable evaluation of the applicability of simple dynamic calculations for the estimation of sliding distances of rubble mound superstructures. This is of great practical importance since many existing rubble mound crown walls are subjected to increasing wave loads...

Comparative shear tests of some low temperature lead-free solder pastes

Science.gov (United States)

Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.

2016-12-01

The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

Manipulation and soldering of carbon nanotubes using atomic force microscope

International Nuclear Information System (INIS)

Kashiwase, Yuta; Ikeda, Takayuki; Oya, Takahide; Ogino, Toshio

2008-01-01

Manipulation of carbon nanotubes (CNTs) by an atomic force microscope (AFM) and soldering of CNTs using Fe oxide nanoparticles are described. We succeeded to separate a CNT bundle into two CNTs or CNT bundles, to move the separated CNT to a desirable position, and to bind it to another bundle. For the accurate manipulation, load of the AFM cantilever and frequency of the scan were carefully selected. We soldered two CNTs using an Fe oxide nanoparticle prepared from a ferritin molecule. The adhesion forces between the soldered CNTs were examined by an AFM and it was found that the CNTs were bound, though the binding force was not strong

Effect of temperature and flux concentration on soldering of base metal.

Science.gov (United States)

Lee, S Y; Lin, C T; Wang, M H; Tseng, H; Huang, H M; Dong, D R; Pan, L C; Shih, Y H

2000-12-01

The present study used the acoustic emission (AE) technique to evaluate interactions among soldering temperature, flux treatment, and the resultant ultimate tensile strength (UTS). Scanning electron microscopy (SEM) was used to examine fracture surfaces of the solder joints. Specimens were cast from removable partial denture alloy and then placed in a jig with a gap distance of 1.0 mm. A high-frequency soldering machine with an optical pyrometer was used for soldering at 1150 degrees C and 1200 degrees C, respectively. The flux concentrations were 67% and 75%. The soldered specimens were subjected to tensile test at a crosshead speed of 0.05 mm/min. During testing, acoustic emissions in the frequency range of 100--1200 kHz were collected, filtered, recorded, and processed by a sensing device. The results were analysed by ANOVA and Tukey LSD test. UTS at different temperatures showed no significant difference according to either mechanical or acoustic results. But in the 1200 degrees C group, the UTSs and AE counts showed significant differences (Pacoustic signals within the elastic deformation zone, while the 67% flux subgroup produced similar signals within the plastic deformation zone, either beyond the 0.2% yield point or before fracture.

Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn- xAg-0.7Cu

Science.gov (United States)

Lee, Hwa-Teng; Huang, Kuo-Chen

2016-12-01

Low-cycle fatigue tests of Sn-Ag-Cu (SAC) Pb-free solder joints under fixed displacement were performed to evaluate the influence of Ag content (0-3 wt.%) and solder-joint geometry (barrel and hourglass types) on solder-joint fatigue behavior and reliability. The solder joints were composed of fine particles of Ag3Sn and Cu6Sn5, which aggregated as an eutectic constituent at grain boundaries of the primary β-Sn phase and formed a dense network structure. A decrease in the Ag content resulted in coarsening of the β-Sn and eutectic phases, which, in turn, decreased the strength of the joint and caused earlier failure. Solder joints in the hourglass form exhibited better fatigue performance with longer life than barrel-type joints. The sharp contact angle formed between the solder and the Cu substrate by the barrel-type joints concentrated stress, which compromised fatigue reliability. The addition of Ag to the solder, however, enhanced fatigue performance because of strengthening caused by Ag3Sn formation. The cracks of the barrel-type SAC solder joints originated mostly at the contact corner and propagated along the interfacial layer between the interfacial intermetallic compound (IMC) and solder matrix. Hourglass-type solder joints, however, demonstrated both crack initiation and propagation in the solder matrix (solder mode). The addition of 1.5-2.0 wt.% Ag to SAC solder appears to enhance the fatigue performance of solder joints while maintaining sufficient strength.

Indigenous utilization of termite mounds and their sustainability in a rice growing village of the central plain of Laos.

Science.gov (United States)

Miyagawa, Shuichi; Koyama, Yusaku; Kokubo, Mika; Matsushita, Yuichi; Adachi, Yoshinao; Sivilay, Sengdeaune; Kawakubo, Nobumitsu; Oba, Shinya

2011-08-18

The objective of this study was to investigate the indigenous utilization of termite mounds and termites in a rain-fed rice growing village in the central plain of Laos, where rice production is low and varies year-to-year, and to assess the possibility of sustainable termite mound utilization in the future. This research was carried out from 2007 to 2009. The termites were collected from their mounds and surrounding areas and identified. Twenty villagers were interviewed on their use of termites and their mounds in the village. Sixty-three mounds were measured to determine their dimensions in early March, early July and middle to late November, 2009. Eleven species of Termitidae were recorded during the survey period. It was found that the villagers use termite mounds as fertilizer for growing rice, vegetable beds and charcoal kilns. The villagers collected termites for food and as feed for breeding fish. Over the survey period, 81% of the mounds surveyed increased in volume; however, the volume was estimated to decrease by 0.114 m3 mound(-1) year(-1) on average due to several mounds being completely cut out. It was concluded that current mound utilization by villagers is not sustainable. To ensure sustainable termite utilization in the future, studies should be conducted to enhance factors that promote mound restoration by termites. Furthermore, it will be necessary to improve mound conservation methods used by the villagers after changes in the soil mass of mounds in paddy fields and forests has been measured accurately. The socio-economic factors that affect mound utilization should also be studied.

Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

Czech Academy of Sciences Publication Activity Database

Kroupa, Aleš; Andersson, D.; Hoo, N.; Pearce, J.; Watson, A.; Dinsdale, A.; Mucklejohn, S.

2012-01-01

Roč. 21, č. 5 (2012), s. 629-637 ISSN 1059-9495 Institutional support: RVO:68081723 Keywords : lead-free soldering, * materials for high-temperature LF * new technologies for HT lead-free soldering Subject RIV: BJ - Thermodynamics Impact factor: 0.915, year: 2012

Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

Science.gov (United States)

Lin, Jian; Lei, Yongping; Fu, Hanguang; Guo, Fu

2018-03-01

In surface mount technology, the Sn-3.0Ag-0.5Cu solder joint has a shorter impact lifetime than a traditional lead-tin solder joint. In order to improve the impact property of SnAgCu lead-free solder joints and identify the effect of silver content on tensile strength and impact property, impact experiments were conducted at various strain rates on three selected SnAgCu based solder joints. It was found that joint failure mainly occurred in the solder material with large plastic deformation under low strain rate, while joint failure occurred at the brittle intermetallic compound layer without any plastic deformation at a high strain rate. Joint strength increased with the silver content in SnAgCu alloys in static tensile tests, while the impact property of the solder joint decreased with increasing silver content. When the strain rate was low, plastic deformation occurred with failure and the tensile strength of the Sn-3.0Ag-0.5Cu solder joint was higher than that of Sn-0.3Ag-0.7Cu; when the strain rate was high, joint failure mainly occurred at the brittle interface layer and the Sn-0.3Ag-0.7Cu solder joint had a better impact resistance with a thinner intermetallic compound layer.

Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

Science.gov (United States)

Sorg, Brian S.; Welch, Ashley J.

2001-05-01

Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

An evaluation of the lap-shear test for Sn-rich solder/Cu couples: Experiments and simulation

Science.gov (United States)

Chawla, N.; Shen, Y.-L.; Deng, X.; Ege, E. S.

2004-12-01

The lap-shear technique is commonly used to evaluate the shear, creep, and thermal fatigue behavior of solder joints. We have conducted a parametric experimental and modeling study, on the effect of testing and geometrical parameters on solder/copper joint response in lap-shear. It was shown that the farfield applied strain is quite different from the actual solder strain (measured optically). Subtraction of the deformation of the Cu substrate provides a reasonable approximation of the solder strain in the elastic regime, but not in the plastic regime. Solder joint thickness has a profound effect on joint response. The solder response moves progressively closer to “true” shear response with increasing joint thickness. Numerical modeling using finite-element analyses were performed to rationalize the experimental findings. The same lap-shear configuration was used in the simulation. The input response for solder was based on the experimental tensile test result on bulk specimens. The calculated shear response, using both the commonly adopted far-field measure and the actual shear strain in solder, was found to be consistent with the trends observed in the lap-shear experiments. The geometric features were further explored to provide physical insight into the problem. Deformation of the substrate was found to greatly influence the shear behavior of the solder.

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Directory of Open Access Journals (Sweden)

Lei Sun

2015-01-01

Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

Study on interfacial reaction between lead-free solders and alternative surface finishes

International Nuclear Information System (INIS)

Siti Rabiatul Aisha; Ourdjini, A.; Saliza Osman

2007-01-01

This study investigates the interfacial reactions occurring during reflow soldering between Sn-Ag-Cu lead-free solder and two surface finishes: electroless nickel/ immersion gold (ENIG) and immersion silver (IAg). The study focuses on interfacial reactions evolution and growth kinetics of intermetallic compounds (IMC) formed during soldering and isothermal ageing at 150 degree Celsius for up to 2000 hours. Optical and scanning electron microscopy were used to measure IMC thickness and examine the morphology of IMC respectively, whereas the IMC phases were identified by energy dispersive X-ray analysis (EDX). The results showed that the IMC formed on ENIG finish is thinner compared to that formed on IAg finish. For IAg surface finish, Cu 6 Sn 5 IMCs with scallop morphology are formed at the solder/ surface finish interface after reflow while a second IMC, Cu 3 Sn was formed between the copper and Cu 6 Sn 5 IMC after the isothermal ageing treatment. For ENIG surface finish both (Cu,Ni) 6 Sn 5 and (Ni,Cu) 3 Sn 4 are formed after soldering. Isothermal aging of the solder joints formed on ENIG finish was found to have a significant effect on the morphology of the intermetallics by transforming to more spherical and denser morphology in addition to increase i their thickness with increased ageing time. (author)

Indigenous utilization of termite mounds and their sustainability in a rice growing village of the central plain of Laos

Directory of Open Access Journals (Sweden)

Sivilay Sengdeaune

2011-08-01

Full Text Available Abstract Background The objective of this study was to investigate the indigenous utilization of termite mounds and termites in a rain-fed rice growing village in the central plain of Laos, where rice production is low and varies year-to-year, and to assess the possibility of sustainable termite mound utilization in the future. This research was carried out from 2007 to 2009. Methods The termites were collected from their mounds and surrounding areas and identified. Twenty villagers were interviewed on their use of termites and their mounds in the village. Sixty-three mounds were measured to determine their dimensions in early March, early July and middle to late November, 2009. Results Eleven species of Termitidae were recorded during the survey period. It was found that the villagers use termite mounds as fertilizer for growing rice, vegetable beds and charcoal kilns. The villagers collected termites for food and as feed for breeding fish. Over the survey period, 81% of the mounds surveyed increased in volume; however, the volume was estimated to decrease by 0.114 m3 mound-1 year-1 on average due to several mounds being completely cut out. Conclusion It was concluded that current mound utilization by villagers is not sustainable. To ensure sustainable termite utilization in the future, studies should be conducted to enhance factors that promote mound restoration by termites. Furthermore, it will be necessary to improve mound conservation methods used by the villagers after changes in the soil mass of mounds in paddy fields and forests has been measured accurately. The socio-economic factors that affect mound utilization should also be studied.

The critical oxide thickness for Pb-free reflow soldering on Cu substrate

Energy Technology Data Exchange (ETDEWEB)

Chung, C. Key [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Assembly Test Global Materials, Intel Microelectronics Asia Ltd, B1, No. 205, Tun-Hwa North Road, 10595 Taipei, Taiwan (China); Chen, Y.J.; Li, C.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Kao, C.R., E-mail: crkao@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China)

2012-06-01

Oxidation is an undesirable effect of reflow soldering. Non-wetting occurs when the oxide layer grows above the critical thickness. Characterizing the critical oxide thickness for soldering is challenging due to oxide's nano-scale thickness and irregular topographic surface. In this paper, the critical copper oxide thickness was characterized by Time-of-Flight Secondary Ion Mass Spectrometry, Scanning Electron Microscopy, Energy-Dispersive X-ray spectroscopy, and Transmission Electron Microscopy. Copper substrates were coated with an Organic-Solderable-Preservative (OSP) layer and baked at 150 Degree-Sign C and 85% Relative Humidity for different amounts of time. The onset of the non-wetting phenomenon occurred when the oxide thickness reached 18 {+-} 5 nm. As the oxide grew beyond this critical thickness, the percentage of non-wetting solder joint increased exponentially. The growth of the oxide thickness followed a parabolic rate law. The rate constant of oxidation was 0.6 Multiplication-Sign 10{sup -15} cm{sup 2} min{sup -1}. Oxidation resulted from interdiffusion of copper and oxygen atoms through the OSP and oxide layers. The oxidation mechanism will be presented and discussed. - Highlights: Black-Right-Pointing-Pointer Critical oxide thickness for Pb free solder on Cu substrate is 18 {+-} 5 nm. Black-Right-Pointing-Pointer Above the critical oxide, non-wet solder joint increases exponentially. Black-Right-Pointing-Pointer A maximum 13-nm oxide thickness is suggested for good solder joint. Black-Right-Pointing-Pointer Initial growth of oxide thickness is logarithmic and then parabolic after 12 nm. Black-Right-Pointing-Pointer Thick oxide (360-560 nm) is formed as pores shorten the oxidation path.

Effect of gap distance on tensile strength of preceramic base metal solder joints.

Science.gov (United States)

Fattahi, Farnaz; Motamedi, Milad

2011-01-01

In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. Based on ADA/ISO 9693 specifications for tensile test, 40 specimens were fabricated from a Ni-Cr alloy and cut at the midpoint of 3-mm diameter bar and placed at desired positions by a specially designed device. The specimens were divided into four groups of 10 samples according to the desired solder gap distance: Group1: 0.1mm; Group2: 0.25mm; Group3: 0.5mm; and Group4: 0.75mm. After soldering, specimens were tested for tensile strength by a universal testing machine at a cross-head speed of 0.5mm/min with a preload of 10N. The mean tensile strength values of the groups were 162, 307.8, 206.1 and 336.7 MPa, respectively. The group with 0.75-mm gap had the highest and the group with 0.1-mm gap had the lowest tensile strength. Bonferroni test showed that Group1 and Group4 had statistically different values (P=0.023), but the differences between other groups were not sig-nificant at a significance level of 0.05. There was no direct relationship between increasing soldering gap distance and tensile strength of the solder joints.

Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

KAUST Repository

Zhang, Xuan; Zheng, Xiujun; Zhang, Hong; Zhang, Junli; Fu, Jiecai; Zhang, Qiang; Peng, Chaoyi; Bai, Feiming; Zhang, Xixiang; Peng, Yong

2017-01-01

Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

KAUST Repository

Zhang, Xuan

2017-08-10

Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

The hydrology and preservation condition in the flat topped burial mound Klangshøj at Vennebjerg in Vendsyssel

DEFF Research Database (Denmark)

Breuning-Madsen, Henrik; Henriksen, Peter Steen; Kristensen, Jeppe Ågård

2016-01-01

Klangshøj is a flat-topped burial mound similar to the Royal Jelling mounds, although smaller. The myths tell that a well has existed on top of the mound as at Jelling and a spring had flown at the base of the mound. In order to verify the myths and a similar hydrology in Klangshøj as found...... borings, where undecomposed plant remnants, occasionally greenish, were observed. A 14C-dating showed that the mound was built in the Viking Age. The hydrology in Klangshøj is the same as in the Jelling mounds, with a permeable bioturbation zone covering almost impermeable, distinct sod layers. This form...

Active hydrothermal and non-active massive sulfide mound investigation using a new multiparameter chemical sensor

Science.gov (United States)

Han, C.; Wu, G.; Qin, H.; Wang, Z.

2012-12-01

Investigation of active hydrothermal mound as well as non-active massive sulfide mound are studied recently. However, there is still lack of in-situ detection method for the non-active massive sulfide mound. Even though Transient ElectroMagnetic (TEM) and Electric Self-potential (SP) methods are good, they both are labour, time and money cost work. We proposed a new multiparameter chemical sensor method to study the seafloor active hydrothermal mound as well as non-active massive sulfide mound. This sensor integrates Eh, S2- ions concentration and pH electrochemical electrodes together, and could found chemical change caused by the active hydrothermal vent, even weak chemical abnormalities by non-active massive sulfide hydrothermal mound which MARP and CTD sometimes cannot detect. In 2012, the 1st Leg of the Chinese 26th cruise, the multiparameter chemical sensor was carried out with the deepsea camera system over the Carlsberg Ridge in Indian Ocean by R/V DAYANGYIHAO. It was shown small Eh and S2- ions concentration abnormal around a site at Northwest Indian ridge. This site was also evidenced by the TV grab. In the 2nd Leg of the same cruise in June, this chemical sensor was carried out with TEM and SP survey system. The chemical abnormalities are matched very well with both TEM and SP survey results. The results show that the multiparameter chemical sensor method not only can detect active hydrothermal mound, but also can find the non-active massive sulfide hydrothermal mound.

30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

Science.gov (United States)

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

Differences between bacterial communities in the gut of a soil-feeding termite (Cubitermes niokoloensis) and its mounds.

Science.gov (United States)

Fall, Saliou; Hamelin, Jérôme; Ndiaye, Farma; Assigbetse, Komi; Aragno, Michel; Chotte, Jean Luc; Brauman, Alain

2007-08-01

In tropical ecosystems, termite mound soils constitute an important soil compartment covering around 10% of African soils. Previous studies have shown (S. Fall, S. Nazaret, J. L. Chotte, and A. Brauman, Microb. Ecol. 28:191-199, 2004) that the bacterial genetic structure of the mounds of soil-feeding termites (Cubitermes niokoloensis) is different from that of their surrounding soil. The aim of this study was to characterize the specificity of bacterial communities within mounds with respect to the digestive and soil origins of the mound. We have compared the bacterial community structures of a termite mound, termite gut sections, and surrounding soil using PCR-denaturing gradient gel electrophoresis (DGGE) analysis and cloning and sequencing of PCR-amplified 16S rRNA gene fragments. DGGE analysis revealed a drastic difference between the genetic structures of the bacterial communities of the termite gut and the mound. Analysis of 266 clones, including 54 from excised bands, revealed a high level of diversity in each biota investigated. The soil-feeding termite mound was dominated by the Actinobacteria phylum, whereas the Firmicutes and Proteobacteria phyla dominate the gut sections of termites and the surrounding soil, respectively. Phylogenetic analyses revealed a distinct clustering of Actinobacteria phylotypes between the mound and the surrounding soil. The Actinobacteria clones of the termite mound were diverse, distributed among 10 distinct families, and like those in the termite gut environment lightly dominated by the Nocardioidaceae family. Our findings confirmed that the soil-feeding termite mound (C. niokoloensis) represents a specific bacterial habitat in the tropics.

Soldered Contact and Current Risetime Effects on Negative Polarity Wire Array Z-pinches

International Nuclear Information System (INIS)

Chalenski, D. A.; Kusse, B. R.; Greenly, J. B.; Blesener, I. C.; McBride, R. D.; Hammer, D. A.; Knapp, P. F.

2009-01-01

The Cornell University COBRA pulser is a nominal 1 MA machine, capable of driving up to 32 wire cylindrical Z-pinch arrays. COBRA can operate with variable current risetimes ranging from 100 ns to 200 ns (short and long pulse, respectively). Wires are typically strung with a ''press'' contact to the electrode hardware, where the wire is loosely pulled against the hardware and held there to establish electrical contact. The machine is normally negative, but a bolt-on convolute can be used to modify the current path and effectively produce positive polarity operation at the load.Previous research with single wires on a 1-5 kA pulser has shown that soldering the wire, thereby improving the wire/electrode contact, and operating in positive polarity can improve the energy deposition into the wire and enhance wire core expansion. Negative polarity showed no difference. Previous experiments on the negative polarity, 20 MA, 100 ns Z accelerator have shown that improving the contact improved the x-ray yield.Cornell data were collected on 16-wire Aluminum Z-pinch arrays in negative polarity. Experiments were conducted with both short and long current pulses with soldered and no-soldered wire/electrode contacts. The initiation, ablation, implosion and stagnation phases were compared for these four conditions. Time dependent x-ray signals were measured using diodes and diamond detectors. An inductive voltage monitor was used to infer minimum current radius achieved, as defined by a uniform shell of current moving radially inward, producing a time dependent inductance. Total energy data were collected with a metal-strip bolometer. Self-emission data were collected by an XUV 4-frame camera and an optical streak camera.In negative polarity and with short pulses, soldering appeared to produce a smaller radius pinch and decrease variations in the x-ray pulse shape. The bolometer, laser backlighter, 4-frame and streak cameras showed negligible differences in the initiation ablation

Towards the Automatic Detection of Pre-Existing Termite Mounds through UAS and Hyperspectral Imagery.

Science.gov (United States)

Sandino, Juan; Wooler, Adam; Gonzalez, Felipe

2017-09-24

The increased technological developments in Unmanned Aerial Vehicles (UAVs) combined with artificial intelligence and Machine Learning (ML) approaches have opened the possibility of remote sensing of extensive areas of arid lands. In this paper, a novel approach towards the detection of termite mounds with the use of a UAV, hyperspectral imagery, ML and digital image processing is intended. A new pipeline process is proposed to detect termite mounds automatically and to reduce, consequently, detection times. For the classification stage, several ML classification algorithms' outcomes were studied, selecting support vector machines as the best approach for their role in image classification of pre-existing termite mounds. Various test conditions were applied to the proposed algorithm, obtaining an overall accuracy of 68%. Images with satisfactory mound detection proved that the method is "resolution-dependent". These mounds were detected regardless of their rotation and position in the aerial image. However, image distortion reduced the number of detected mounds due to the inclusion of a shape analysis method in the object detection phase, and image resolution is still determinant to obtain accurate results. Hyperspectral imagery demonstrated better capabilities to classify a huge set of materials than implementing traditional segmentation methods on RGB images only.

Ant and termite mound coinhabitants in the wetlands of Santo Antonio da Patrulha, Rio Grande do Sul, Brazil

Directory of Open Access Journals (Sweden)

E. Diehl

Full Text Available This paper reports on ant and termite species inhabiting the mounds (murundus found in three wetland sites in Santo Antonio da Patrulha. Ants and termites were found in 100% of the mounds of two sites and in 20% of those in the third site. Colonies of Camponotus fastigatus were found inhabiting all the mounds, while colonies of Brachymyrmex sp., Linepithema sp., Pheidole sp., and/or Solenopsis sp. were collected in less than 30% of the mounds. In the mounds of the three sites, colonies of Anoplotermes sp. and/or Aparatermes sp. termites were found together with the ant colonies. Another cohabiting termite species, Cortaritermes sp., was found only in the mounds of one site. The results suggest that C. fastigatus is the species building the mounds, with the other species, whether ants or termites, being the inquilines.

Ant and termite mound coinhabitants in the wetlands of Santo Antonio da Patrulha, Rio Grande do Sul, Brazil.

Science.gov (United States)

Diehl, E; Junqueira, L K; Berti-Filho, E

2005-08-01

This paper reports on ant and termite species inhabiting the mounds (murundus) found in three wetland sites in Santo Antonio da Patrulha. Ants and termites were found in 100% of the mounds of two sites and in 20% of those in the third site. Colonies of Camponotus fastigatus were found inhabiting all the mounds, while colonies of Brachymyrmex sp., Linepithema sp., Pheidole sp., and/or Solenopsis sp. were collected in less than 30% of the mounds. In the mounds of the three sites, colonies of Anoplotermes sp. and/or Aparatermes sp. termites were found together with the ant colonies. Another cohabiting termite species, Cortaritermes sp., was found only in the mounds of one site. The results suggest that C. fastigatus is the species building the mounds, with the other species, whether ants or termites, being the inquilines.

Stochastic Design of Rubble Mound Breakwaters

DEFF Research Database (Denmark)

Nielsen, Søren R.K.; Burcharth, Hans F.

The paper presents a level III reliability method from which the armour layer of rubble mound breakwaters can be designed, so that the total costs of construction price and expected maintaince expenses are minimized. Since the physics of the wave-structure interaction are not yet fully understood...

Microstructural evolution and tensile properties of Sn-Ag-Cu mixed with Sn-Pb solder alloys

Energy Technology Data Exchange (ETDEWEB)

Wang Fengjiang [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States); O' Keefe, Matthew [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)], E-mail: mjokeefe@mst.edu; Brinkmeyer, Brandon [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)

2009-05-27

The effect of incorporating eutectic Sn-Pb solder with Sn-3.0Ag-0.5Cu (SAC) Pb-free solder on the microstructure and tensile properties of the mixed alloys was investigated. Alloys containing 100, 75, 50, 25, 20, 15, 10, 5 and 0 wt% SAC, with the balance being Sn-37Pb eutectic solder alloy, were prepared and characterized. Optical and scanning electron microscopy were used to analyze the microstructures while 'mini-tensile' test specimens were fabricated and tested to determine mechanical properties at the mm length scale, more closely matching that of the solder joints. Microstructural analysis indicated that a Pb-rich phase formed and was uniformly distributed at the boundary between the Sn-rich grains or between the Sn-rich and the intermetallic compounds in the solder. Tensile results showed that mixing of the alloys resulted in an increase in both the yield and the ultimate tensile strength compared to the original solders, with the 50% SAC-50% Sn-Pb mixture having the highest measured strength. Initial investigations indicate the formation and distribution of a Pb-rich phase in the mixed solder alloys as the source of the strengthening mechanism.

Three-dimensional architecture and development of Danianbryozoan mounds at Limhamn, south-west Sweden, usingground-penetrating radar

DEFF Research Database (Denmark)

Nielsen, Lars; Schack von Brockdorff, A.; Bjerager, Morten Gustav Erik

2009-01-01

in the Limhamn limestone quarry, south-west Sweden, obtained from combined reflected ground-penetrating radar signals and outcrop analysis provide new information about the architecture and growth development of such mounds. The mounds are composed of bryozoan limestone and dark-grey to black flint bands which...... outline mound geometries. Ground-penetrating radar data sections are collected over a 120 m by 60 m grid of data lines with trace spacing of 0·25 m, providing a depth penetration of 7 to 12 m and a vertical resolution of ca 0·30 m. The ground-penetrating radar images outline the geometry of the internal...... layering of the mounds which, typically, have widths and lengths of 30 to 60 m and heights of 5 to 10 m. Mound architecture and growth show great variability in the ground-penetrating radar images. Small-scale mound structures with a palaeorelief of only a few metres may constitute the basis for growth...

Dynamic environments of fungus-farming termite mounds exert growth-modulating effects on fungal crop parasites.

Science.gov (United States)

Katariya, Lakshya; Ramesh, Priya B; Borges, Renee M

2018-03-01

This study investigated for the first time the impact of the internal mound environment of fungus-growing termites on the growth of fungal crop parasites. Mounds of the termite Odontotermes obesus acted as (i) temperature and relative humidity (RH) 'stabilisers' showing dampened daily variation and (ii) 'extreme environments' exhibiting elevated RH and CO 2 levels, compared to the outside. Yet, internal temperatures exhibited seasonal dynamics as did daily and seasonal CO 2 levels. During in situ experiments under termite-excluded conditions within the mound, the growth of the crop parasite Pseudoxylaria was greater inside than outside the mound, i.e., Pseudoxylaria is 'termitariophilic'. Also, ex situ experiments on parasite isolates differing in growth rates and examined under controlled conditions in the absence of termites revealed a variable effect with fungal growth decreasing only under high CO 2 and low temperature conditions, reflecting the in situ parasite growth fluctuations. In essence, the parasite appears to be adapted to survive in the termite mound. Thus the mound microclimate does not inhibit the parasite but the dynamic environmental conditions of the mound affect its growth to varying extents. These results shed light on the impact of animal-engineered structures on parasite ecology, independent of any direct role of animal engineers. © 2017 Society for Applied Microbiology and John Wiley & Sons Ltd.

Soluble Lead and Bismuth Chalcogenidometallates: Versatile Solders for Thermoelectric Materials

Energy Technology Data Exchange (ETDEWEB)

Zhang, Hao [Department; Son, Jae Sung [Department; School; Dolzhnikov, Dmitriy S. [Department; Filatov, Alexander S. [Department; Hazarika, Abhijit [Department; Wang, Yuanyuan [Department; Hudson, Margaret H. [Department; Sun, Cheng-Jun [Advanced; Chattopadhyay, Soma [Physical; Talapin, Dmitri V. [Department; Center

2017-07-27

Here we report the syntheses of largely unexplored lead and bismuth chalcogenidometallates in the solution phase. Using N2H4 as the solvent, new compounds such as K6Pb3Te6·7N2H4 were obtained. These soluble molecular compounds underwent cation exchange processes using resin chemistry, replacing Na+ or K+ by decomposable N2H5+ or tetraethylammonium cations. They also transformed into stoichiometric lead and bismuth chalcogenide nanomaterials with the addition of metal salts. Such a versatile chemistry led to a variety of composition-matched solders to join lead and bismuth chalcogenides and tune their charge transport properties at the grain boundaries. Solution-processed thin films composed of Bi0.5Sb1.5Te3 microparticles soldered by (N2H5)6Bi0.5Sb1.5Te6 exhibited thermoelectric power factors (~28 μW/cm K2) comparable to those in vacuum-deposited Bi0.5Sb1.5Te3 films. The soldering effect can also be integrated with attractive fabrication techniques for thermoelectric modules, such as screen printing, suggesting the potential of these solders in the rational design of printable and moldable thermoelectrics.

Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints

International Nuclear Information System (INIS)

Liu, X.W.; Plumbridge, W.J.

2003-01-01

The fatigue of Sn-37 wt.% Pb model solder joints has been investigated under thermomechanical and thermal cycling. Based upon an analysis of displacements during thermomechancial cycling, a model solder joint has been designed to simulate actual joints in electronic packages. The strain-stress relationship, characterised by hysteresis loops, was determined during cycling from 30 to 125 deg. C, and the stress-range monitored throughout. The number of cycles to failure, as defined by the fall in stress range, was correlated to strain range and strain energy. The strain hardening exponent, k, varied with the definition of failure and, when a stress-range drop of 50% was used, it was 0.46. Cracks were produced during pure thermal cycling without external strains applied. These arose due to the local strains caused by thermal expansion mismatches between the solder and Cu 6 Sn 5 intermetallic layer, between the phases of solder, and due to the anisotropy of the materials. The fatigue life under thermomechanical cycling was significantly inferior to that obtained in isothermal mechanical cycling. A factor contributing to this inferiority is the internal damage produced during temperature cycling

Bacterial density and community structure associated with aggregate size fractions of soil-feeding termite mounds.

Science.gov (United States)

Fall, S; Nazaret, S; Chotte, J L; Brauman, A

2004-08-01

The building and foraging activities of termites are known to modify soil characteristics such as the heterogeneity. In tropical savannas the impact of the activity of soil-feeding termites ( Cubitermes niokoloensis) has been shown to affect the properties of the soil at the aggregate level by creating new soil microenvironments (aggregate size fractions) [13]. These changes were investigated in greater depth by looking at the microbial density (AODC) and the genetic structure (automated rRNA intergenic spacer analysis: ARISA) of the communities in the different aggregate size fractions (i.e., coarse sand, fine sand, coarse silt, fine silt, and dispersible clays) separated from compartments (internal and external wall) of three Cubitermes niokoloensis mounds. The bacterial density of the mounds was significantly higher (1.5 to 3 times) than that of the surrounding soil. Within the aggregate size fractions, the termite building activity resulted in a significant increase in bacterial density within the coarser fractions (>20 mum). Multivariate analysis of the ARISA profiles revealed that the bacterial genetic structures of unfractionated soil and soil aggregate size fractions of the three mounds was noticeably different from the savanna soil used as a reference. Moreover, the microbial community associated with the different microenvironments in the three termite mounds revealed three distinct clusters formed by the aggregate size fractions of each mound. Except for the 2-20 mum fraction, these results suggest that the mound microbial genetic structure is more dependent upon microbial pool affiliation (the termite mound) than on the soil location (aggregate size fraction). The causes of the specificity of the microbial community structure of termite mound aggregate size fractions are discussed.

Innovative rubble mound breakwaters for overtopping wave energy conversion

DEFF Research Database (Denmark)

Vicinanza, Diego; Contestabile, Pasquale; Nørgaard, Jørgen Quvang Harck

2014-01-01

to the sea through turbines. Wave loadings and average wave overtopping rate at the rear side of the rubble mound breakwater and in the front reservoir are discussed on the basis of physical 2-D model tests carried out at Aalborg University (DK). The experiments have been analyzed and compared with results...... from model tests and wave load design formulae by Nørgaard et al. (2013) for traditional rubble mound crown walls. The existing prediction methods seem unable to predict the hydraulic performances and loadings on the front reservoir and thus new prediction formulae are proposed based on the new...

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

OpenAIRE

Sun, Lei; Zhang, Liang

2015-01-01

SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparti...

Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits

Energy Technology Data Exchange (ETDEWEB)

Huang, Y. T.; Hsu, H. H.; Wu, Albert T., E-mail: atwu@ncu.edu.tw [Department of Chemical and Materials Engineering, National Central University, Jhongli City 320, Taiwan (China)

2014-01-21

Because of the miniaturization of electronic devices, the reliability of electromigration has become a major concern when shrinking the solder dimensions in flip-chip joints. Fast reaction between solders and electrodes causes intermetallic compounds (IMCs) to form, which grow rapidly and occupy entire joints when solder volumes decrease. In this study, U-grooves were fabricated on Si chips as test vehicles. An electrode-solder-electrode sandwich structure was fabricated by using lithography and electroplating. Gaps exhibiting well-defined dimensions were filled with Sn3.5Ag solders. The gaps between the copper electrodes in the test sample were limited to less than 15 μm to simulate microbumps. The samples were stressed at various current densities at 100 °C, 125 °C, and 150 °C. The morphological changes of the IMCs were observed, and the dimensions of the IMCs were measured to determine the kinetic growth of IMCs. Therefore, this study focused on the influence of back stress caused by microstructural evolution in microbumps.

Geochemical characteristics and early diagenesis of recent carbonate mound sediments in the Gulf of Cadiz

Science.gov (United States)

Hamaekers, Helen; Foubert, Anneleen; Wienberg, Claudia; Hebbeln, Dierk; Swennen, Rudy

2010-05-01

Cold-water coral carbonate mounds occur in patches along the continental margin of the North Atlantic Ocean, from northern Norway down to Mauretania. Recent research has been focused on carbonate mounds in the Gulf of Cadiz, especially along the Moroccan margin. The Pen Duick, the Renard and the Vernadsky carbonate mound provinces in the Gulf of Cádiz are only some of the mound provinces which have been the subject of several recent research projects (Foubert et al., 2008; Wienberg et al., 2009). No living scleractinians could be found on top of those carbonate mounds. During cruise 64PE284 of RV Pelagia, gravity cores have been taken through carbonate mounds in the Carbonate Mound Provinces (CMP) SE of Yuma mud volcano and N of Meknes mud volcano. These cores have been analysed by several methods such as Magnetic Susceptibility (MS), X-Ray Fluorescence (XRF), Inductive Coupled Plasma Optical Emission Spectroscopy (ICP-OES) and X-Ray Diffraction (XRD) to determine the geochemical characteristics of carbonate mounds, which can be used to quantify the effects of early diagenetic processes which may have altered the palaeo-environmental characteristics of the carbonate mounds. Dating has been done with 14C and U/Th methods pointing to mound growth phases being restricted to glacial periods. XRF and ICP-OES measurements give both qualitative and quantitative data of the chemical composition of the core. The main elements that have been analysed are Ca, Si, Fe, Sr, Al, K, Mg, Ti. According to the trend they follow, they can be devided in two groups, representative for the two encountered fraction types. These two fraction types (biogenic carbonate-rich fraction and terrigenous silicate-rich fraction) can be coupled to interglacial/glacial palaeo-environmental conditions. XRD measurements give an overview of the mineralogical composition of the cores. Thin sections, analysed by cathodeluminescence and classical optical petrography, and micro-CT scans are used to

Laser welding of vas deferens in rodents: initial experience with fluid solders.

Science.gov (United States)

Trickett, R I; Wang, D; Maitz, P; Lanzetta, M; Owen, E R

1998-01-01

This study evaluates the use of sutureless laser welding for vasovasostomy. In 14 rodents, the left vas deferens underwent vasovasostomy using an albumin-based solder applied to the adventitia of the vas deferens. The solder contained the dye, indocyanine green, to allow selective absorption and denaturation by a fiber-coupled 800-nm diode laser. The right vas deferens served as a control, receiving conventional layered microsurgical repair. We used a removable 4/0 nylon stent and microclamps to appose the vas deferens during repair, with no need for stay sutures. The mean time to perform laser solder repair (23.5 min) and conventional repair (23.3 min) were not significantly different (P=0.91). However, examination after 8 weeks showed that granuloma formation (G) and patency (P) rates for the conventional suture technique (G, 14%; P, 93%) were significantly better than observed for the laser solder technique (G, 57%; P, 50%).

Formation of Burial Mounds of the Sarmatian Time in the Basin of the Esaulovsky Aksai River

Directory of Open Access Journals (Sweden)

Elena A. Korobkova

2017-09-01

Full Text Available The article deals with the features of the formation of the burial mounds in the basin of the Esaulovsky Aksai river in the Sarmatian period. Most of the burial mounds of the region begin to form in the Bronze Age and continue to function throughout the early, middle and early late-Sarmatian periods. Most of the burial mounds were located on the watersheds and above-flood terraces of different levels. All of them are characterized by same principles of planning, barrows in them are stretched in a chain in the natural form of the terrace on which the burial mound was built. The territories developed already in the Bronze Age were chosen for creating mounds in the early Sarmatian period. The main part of them is concentrated on a small section landplot of the middle course of the Esaulovsky Aksai river. During the Middle Sarmatian period, the main part of barrows were also located in the middle course of the Esaulovsky Aksai, but represented 2 plots. One of these plots continues to use large burial mounds of the previous period, and the other one undergoes the creation of small barrow groups consisting usually of two-three barrows containing the richest burials of the region with the “classical” set of Middle Sarmatian features. In the late Sarmatian period, as well as in the previous stages of the Sarmatian culture, the burial mounds of the middle course of the Esaulovsky Aksai continue to be used, which cease to function no later than at the first half of the 3rd century AD. But the territory of actively used burial mounds changes, and the main complexes of that time concentrate in the upper reaches, where new burial mounds are created and continue to function until the end of the Sarmatian era.

Laser beam soldering of micro-optical components

Science.gov (United States)

Eberhardt, R.

2003-05-01

MOTIVATION Ongoing miniaturisation and higher requirements within optical assemblies and the processing of temperature sensitive components demands for innovative selective joining techniques. So far adhesive bonding has primarily been used to assemble and adjust hybrid micro optical systems. However, the properties of the organic polymers used for the adhesives limit the application of these systems. In fields of telecommunication and lithography, an enhancement of existing joining techniques is necessary to improve properties like humidity resistance, laserstability, UV-stability, thermal cycle reliability and life time reliability. Against this background laser beam soldering of optical components is a reasonable joining technology alternative. Properties like: - time and area restricted energy input - energy input can be controlled by the process temperature - direct and indirect heating of the components is possible - no mechanical contact between joining tool and components give good conditions to meet the requirements on a joining technology for sensitive optical components. Additionally to the laser soldering head, for the assembly of optical components it is necessary to include positioning units to adjust the position of the components with high accuracy before joining. Furthermore, suitable measurement methods to characterize the soldered assemblies (for instance in terms of position tolerances) need to be developed.

Comparison of implant-abutment interface misfits after casting and soldering procedures.

Science.gov (United States)

Neves, Flávio Domingues das; Elias, Gisele Araújo; da Silva-Neto, João Paulo; de Medeiros Dantas, Lucas Costa; da Mota, Adérito Soares; Neto, Alfredo Júlio Fernandes

2014-04-01

The aim of this study was to compare vertical and horizontal adjustments of castable abutments after conducting casting and soldering procedures. Twelve external hexagonal implants (3.75 × 10 mm) and their UCLA abutments were divided according their manufacturer and abutment type: PUN (plastic UCLA, Neodent), PUC (plastic UCLA, Conexão), PU3i (plastic UCLA, Biomet 3i), and PUTN (plastic UCLA with Tilite milled base, Neodent). Three infrastructures of a fixed partial implant-supported bridge with 3 elements were produced for each group. The measurements of vertical (VM) and horizontal (HM) misfits were obtained via scanning electron microscopy after completion of casting and soldering. The corresponding values were determined to be biomechanically acceptable to the system, and the results were rated as a percentage. Statistical analysis establishes differences between groups by chi-square after procedures, and McNeman's test was applied to analyze the influence of soldering over casting (α ≤ .05). For the values of VM and HM, respectively, when the casting process was complete, it was observed that 83.25% and 100% (PUTN), 33.3% and 27.75% (PUN), 33.3% and 88.8% (PUC), 33.3% and 94.35% (PU3i) represented acceptable values. After completing the requisite soldering, acceptable values were 50% and 94.35% (PUTN), 16.6% and 77.7% (PUN), 38.55% and 77.7% (PUC), and 27.75% and 94.35% (PU3i). Within the limitations of this study, it can be concluded that the premachined abutments presented more acceptable VM values. The HM values were within acceptable limits before and after the soldering procedure for most groups. Further, the soldering procedure resulted in an increase of VM in all groups.

Characterizing performances of solder paste printing process at flexible manufacturing lines

International Nuclear Information System (INIS)

Siew, Jit Ping; Low, Heng Chin; Teoh, Ping Chow

2015-01-01

Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter

Characterizing performances of solder paste printing process at flexible manufacturing lines

Energy Technology Data Exchange (ETDEWEB)

Siew, Jit Ping; Low, Heng Chin [University of Science Malaysia, 11800 Minden, Penang (Malaysia); Teoh, Ping Chow [Wawasan Open University, 54 Jalan Sultan Ahmad Shah, 10050 Penang (Malaysia)

2015-02-03

Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter.

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Science.gov (United States)

Hammad, A. E.; El-Taher, A. M.

2014-11-01

The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) inside the β-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni)6Sn5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)- and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

Plutonium, americium, and uranium in blow-sand mounds of safety-shot sites at the Nevada Test Site and the Tonopah Test Range

International Nuclear Information System (INIS)

Essington, E.H.; Gilbert, R.O.; Wireman, D.L.; Brady, D.N.; Fowler, E.B.

1977-01-01

Blow-sand mounds or miniature sand dunes and mounds created by burrowing activities of animals were investigated by the Nevada Applied Ecology Group (NAEG) to determine the influence of mounds on plutonium, americium, and uranium distributions and inventories in areas of the Nevada Test Site and Tonopah Test Range. Those radioactive elements were added to the environment as a result of safety experiments of nuclear devices. Two studies were conducted. The first was to estimate the vertical distribution of americium in the blow-sand mounds and in the desert pavement surrounding the mounds. The second was to estimate the amount or concentration of the radioactive materials accumulated in the mound relative to the desert pavement. Five mound types were identified in which plutonium, americium, and uranium concentrations were measured: grass, shrub, complex, animal, and diffuse. The mount top (that portion above the surrounding land surface datum), the mound bottom (that portion below the mound to a depth of 5 cm below the surrounding land surface datum), and soil from the immediate area surrounding the mound were compared separately to determine if the radioactive elements had concentrated in the mounds. Results of the studies indicate that the mounds exhibit higher concentrations of plutonium, americium, and uranium than the immediate surrounding soil. The type of mound does not appear to have influenced the amount of the radioactive material found in the mound except for the animal mounds where the burrowing activities appear to have obliterated distribution patterns

Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

Science.gov (United States)

Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

2016-12-01

To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys ( T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

Mound cyclone incinerator. Volume I. Description and performance

International Nuclear Information System (INIS)

Klingler, L.M.

1981-01-01

The Mound cyclone incinerator was developed to fill a need for a simple, relaible incinerator for volume reduction of dry solid waste contaminated with plutonium-238. Although the basic design of the incinerator is for batch burning of solid combustible waste, the incinerator has also been adapted to volume reduction of other waste forms. Specialized waste feeding equipment enables continuous burning of both solid and liquid waste, including full scintillation vials. Modifications to the incinerator offgas system enable burning of waste contaminated with isotopes other than plutonium-238. This document presents the design and performance characteristics of the Mound Cyclone Incinerator for incineration of both solid and liquid waste. Suggestions are included for adaptation of the incinerator to specialized waste materials

Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

Science.gov (United States)

Rolin, T. D.; Hodge, R. E.

2008-01-01

An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

Science.gov (United States)

Wei, Helin; Wang, Kuisheng

2011-11-01

Numerous studies of the reliability of solder joints have been performed. Most life prediction models are limited to a deterministic approach. However, manufacturing induces uncertainty in the geometry parameters of solder joints, and the environmental temperature varies widely due to end-user diversity, creating uncertainties in the reliability of solder joints. In this study, a methodology for accounting for variation in the lifetime prediction for lead-free solder joints of ball grid array packages (PBGA) is demonstrated. The key aspects of the solder joint parameters and the cyclic temperature range related to reliability are involved. Probabilistic solutions of the inelastic strain range and thermal fatigue life based on the Engelmaier model are developed to determine the probability of solder joint failure. The results indicate that the standard deviation increases significantly when more random variations are involved. Using the probabilistic method, the influence of each variable on the thermal fatigue life is quantified. This information can be used to optimize product design and process validation acceptance criteria. The probabilistic approach creates the opportunity to identify the root causes of failed samples from product fatigue tests and field returns. The method can be applied to better understand how variation affects parameters of interest in an electronic package design with area array interconnections.

Mound Plant Environmental Monitoring Plan

International Nuclear Information System (INIS)

Bauer, L.R.; Tullis, M.S.; Paulick, R.P.; Roush, L.L.

1994-07-01

The purpose of this Environmental Monitoring Plan (EMP) is to describe the environmental monitoring and surveillance programs in place at Mound. The Plan is required by DOE Order 5400.1 (DOE, 1990). The programs described in the EMP are required by the DOE 5400 Order series and by the Environmental Regulatory Guide for Radiological Effluent Monitoring and Environment Surveillance (DOE 1991a), referred to as the Regulatory Guide throughout this Plan

Manipulation/Extraction of Adatom on a Mound: AG(111)

International Nuclear Information System (INIS)

Yildirim, H.

2004-01-01

We present results of an extensive study of the manipulation/extraction of an atom from a small Ag mound on Ag(111) using a Ag tip. Molecular dynamics (MD) and molecular static (MS) simulations were carried out using interaction potentials from the embedded atom method. In order to evaluate the manipulation capabilities of the tip, we first examine in detail the characteristics of the energy landscape in the absence of the tip. We find that the energy barrier for the extraction of the Ag atom, either through lateral (sliding downwards) or through vertical (climbing upwards) diffusion, to be about 0.3 eV. We show that the presence of the tip lowers the energy barrier for both lateral and vertical diffusion. We find that when the tip is above the edge of the mound (at a height of 2.43 A A from the Ag atom) the barrier for diffusion drops to 0.032 eV for lateral and 0.18 eV for vertical manipulation. We discuss the effect of the tip shape and geometry on the energetics, and present a detailed explanation of how the adatom is extracted from a mound in good agreement with experimental observations

How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

Science.gov (United States)

Suhir, E.; Yi, S.; Ghaffarian, R.

2017-03-01

It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

Zonation of Microbial Communities by a Hydrothermal Mound in the Atlantis II Deep (the Red Sea)

KAUST Repository

Wang, Yong

2015-10-20

In deep-sea geothermal rift zones, the dispersal of hydrothermal fluids of moderately-high temperatures typically forms subseafloor mounds. Major mineral components of the crust covering the mound are barite and metal sulfides. As a result of the continental rifting along the Red Sea, metalliferous sediments accumulate on the seafloor of the Atlantis II Deep. In the present study, a barite crust was identified in a sediment core from the Atlantis II Deep, indicating the formation of a hydrothermal mound at the sampling site. Here, we examined how such a dense barite crust could affect the local environment and the distribution of microbial inhabitants. Our results demonstrate distinctive features of mineral components and microbial communities in the sediment layers separated by the barite crust. Within the mound, archaea accounted for 65% of the community. In contrast, the sediments above the barite boundary were overwhelmed by bacteria. The composition of microbial communities under the mound was similar to that in the sediments of the nearby Discovery Deep and marine cold seeps. This work reveals the zonation of microbial communities after the formation of the hydrothermal mound in the subsurface sediments of the rift basin.

Zonation of Microbial Communities by a Hydrothermal Mound in the Atlantis II Deep (the Red Sea.

Directory of Open Access Journals (Sweden)

Yong Wang

Full Text Available In deep-sea geothermal rift zones, the dispersal of hydrothermal fluids of moderately-high temperatures typically forms subseafloor mounds. Major mineral components of the crust covering the mound are barite and metal sulfides. As a result of the continental rifting along the Red Sea, metalliferous sediments accumulate on the seafloor of the Atlantis II Deep. In the present study, a barite crust was identified in a sediment core from the Atlantis II Deep, indicating the formation of a hydrothermal mound at the sampling site. Here, we examined how such a dense barite crust could affect the local environment and the distribution of microbial inhabitants. Our results demonstrate distinctive features of mineral components and microbial communities in the sediment layers separated by the barite crust. Within the mound, archaea accounted for 65% of the community. In contrast, the sediments above the barite boundary were overwhelmed by bacteria. The composition of microbial communities under the mound was similar to that in the sediments of the nearby Discovery Deep and marine cold seeps. This work reveals the zonation of microbial communities after the formation of the hydrothermal mound in the subsurface sediments of the rift basin.

Zonation of Microbial Communities by a Hydrothermal Mound in the Atlantis II Deep (the Red Sea)

KAUST Repository

Wang, Yong; Li, Jiang Tao; He, Li Sheng; Yang, Bo; Gao, Zhao Ming; Cao, Hui Luo; Batang, Zenon B.; Al-Suwailem, Abdulaziz M.; Qian, Pei-Yuan

2015-01-01

In deep-sea geothermal rift zones, the dispersal of hydrothermal fluids of moderately-high temperatures typically forms subseafloor mounds. Major mineral components of the crust covering the mound are barite and metal sulfides. As a result of the continental rifting along the Red Sea, metalliferous sediments accumulate on the seafloor of the Atlantis II Deep. In the present study, a barite crust was identified in a sediment core from the Atlantis II Deep, indicating the formation of a hydrothermal mound at the sampling site. Here, we examined how such a dense barite crust could affect the local environment and the distribution of microbial inhabitants. Our results demonstrate distinctive features of mineral components and microbial communities in the sediment layers separated by the barite crust. Within the mound, archaea accounted for 65% of the community. In contrast, the sediments above the barite boundary were overwhelmed by bacteria. The composition of microbial communities under the mound was similar to that in the sediments of the nearby Discovery Deep and marine cold seeps. This work reveals the zonation of microbial communities after the formation of the hydrothermal mound in the subsurface sediments of the rift basin.

Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction

Science.gov (United States)

Takaku, Yoshikazu; Ohnuma, Ikuo; Kainuma, Ryosuke; Yamada, Yasushi; Yagi, Yuji; Nishibe, Yuji; Ishida, Kiyohito

2006-11-01

Bismuth and its alloys are candidates for Pb-free high-temperature solders that can be substituted for conventional Pb-rich Pb-Sn solders (melting point (mp) = 573 583 K). However, inferior properties such as brittleness and weak bonding strength should be improved for practical use. To that end, BiCu-X (X=Sb, Sn, and Zn) Pb-free high-temperature solders are proposed. Miscibility gaps in liquid BiCu-X alloys were surveyed using the thermodynamic database ADAMIS (alloy database for micro-solders), and compositions of the BiCu-X solders were designed on the basis of calculation. In-situ composite solders that consist of a Bi-base matrix with fine intermetallic compound (IMC) particles were produced by gas-atomizing and melt-spinning methods. The interfacial reaction between in-situ composite solders and Cu or Ni substrates was investigated. The IMCs at the interface formed a thin, uniform layer, which is an appropriate morphology for a reliable solder joint.

Corrosion Behaviour of Sn-based Lead-Free Solders in Acidic Solution

Science.gov (United States)

Nordarina, J.; Mohd, H. Z.; Ahmad, A. M.; Muhammad, F. M. N.

2018-03-01

The corrosion properties of Sn-9(5Al-Zn), Sn-Cu and SAC305 were studied via potentiodynamic polarization method in an acidic solution of 1 M hydrochloric acid (HCl). Sn-9(5Al-Zn) produced different polarization profile compared with Sn-Cu and SAC305. The morphological analysis showed that small, deep grooves shaped of corrosion product formed on top of Sn-9(5Al-Zn) solder while two distinctive structures of closely packed and loosely packed corrosion product formed on top of Sn-Cu and SAC305 solder alloys. Phase analysis revealed the formations of various corrosion products such as SnO and SnO2 mainly dominant on surface of solder alloys after potentiodynamic polarization in 1 M hydrochloric acid (HCl).

Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy

Science.gov (United States)

Tikale, Sanjay; Prabhu, K. Narayan

2018-05-01

The effect of Al2O3 nanoparticles reinforcement on melting behavior, microstructure evolution at the interface and joint shear strength of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder alloy subjected to multiple reflow cycles was investigated. The reinforced SAC305 solder alloy compositions were prepared by adding Al2O3 nanoparticles in different weight fractions (0.05, 0.1, 0.3 and 0.5 wt.%) through mechanical dispersion. Cu/solder/Cu micro-lap-shear solder joint specimens were used to assess the shear strength of the solder joint. Differential scanning calorimetry was used to investigate the melting behavior of SAC305 solder nanocomposites. The solder joint interfacial microstructure was studied using scanning electron microscopy. The results showed that the increase in melting temperature (T L) and melting temperature range of the SAC305 solder alloy by addition of Al2O3 nanoparticles were not significant. In comparison with unreinforced SAC305 solder alloy, the reinforcement of 0.05-0.5 wt.% of Al2O3 nanoparticles improved the solder wettability. The addition of nanoparticles in minor quantity effectively suppressed the Cu6Sn5 IMC growth, improved the solder joint shear strength and ductility under multiple reflow cycles. However, the improvement in solder properties was less pronounced on increasing the nanoparticle content above 0.1 wt.% of the solder alloy.

Parallel evolution of mound-building and grass-feeding in Australian nasute termites.

Science.gov (United States)

Arab, Daej A; Namyatova, Anna; Evans, Theodore A; Cameron, Stephen L; Yeates, David K; Ho, Simon Y W; Lo, Nathan

2017-02-01

Termite mounds built by representatives of the family Termitidae are among the most spectacular constructions in the animal kingdom, reaching 6-8 m in height and housing millions of individuals. Although functional aspects of these structures are well studied, their evolutionary origins remain poorly understood. Australian representatives of the termitid subfamily Nasutitermitinae display a wide variety of nesting habits, making them an ideal group for investigating the evolution of mound building. Because they feed on a variety of substrates, they also provide an opportunity to illuminate the evolution of termite diets. Here, we investigate the evolution of termitid mound building and diet, through a comprehensive molecular phylogenetic analysis of Australian Nasutitermitinae. Molecular dating analysis indicates that the subfamily has colonized Australia on three occasions over the past approximately 20 Myr. Ancestral-state reconstruction showed that mound building arose on multiple occasions and from diverse ancestral nesting habits, including arboreal and wood or soil nesting. Grass feeding appears to have evolved from wood feeding via ancestors that fed on both wood and leaf litter. Our results underscore the adaptability of termites to ancient environmental change, and provide novel examples of parallel evolution of extended phenotypes. © 2017 The Author(s).

Sulphur Extraction at Bryan Mound

Energy Technology Data Exchange (ETDEWEB)

Kirby, Carolyn L [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Lord, Anna C. Snider [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

2015-08-01

The Bryan Mound caprock was subjected to extens ive sulphur mining prior to the development of the Strategic Petroleum Reserve. Undoubtedl y, the mining has modified the caprock integrity. Cavern wells at Bryan Mound have been subject to a host of well integr ity concerns with many likely compromised by the cavernous capro ck, surrounding corrosive environment (H ₂ SO ₄ ), and associated elevated residual temperatures al l of which are a product of the mining activities. The intent of this study was to understand the sulphur mining process and how the mining has affected the stability of the caprock and how the compromised caprock has influenced the integrity of the cavern wells. After an extensiv e search to collect pert inent information through state agencies, literature sear ches, and the Sandia SPR librar y, a better understanding of the caprock can be inferred from the knowledge gaine d. Specifically, the discovery of the original ore reserve map goes a long way towards modeling caprock stability. In addition the gained knowledge of sulphur mining - subs idence, superheated corrosive wa ters, and caprock collapse - helps to better predict the post mi ning effects on wellbore integrity. This page intentionally left blank

Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

International Nuclear Information System (INIS)

Koo, Jahyun; Lee, Changsoo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck Mo

2015-01-01

It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu_3_3Al_1_7, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu_6Sn_5 networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu_6Sn_5 IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu_3_3Al_1_7 IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

Energy Technology Data Exchange (ETDEWEB)

Koo, Jahyun; Lee, Changsoo [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of); Hong, Sung Jea [MK Electron Co., Ltd., Yongin Cheoin-gu 316-2 (Korea, Republic of); Kim, Keun-Soo, E-mail: keunsookim@hoseo.edu [Department of Display Engineering, Hoseo University, Asan 336-795 (Korea, Republic of); Lee, Hyuck Mo, E-mail: hmlee@kaist.ac.kr [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of)

2015-11-25

It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu{sub 33}Al{sub 17}, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu{sub 6}Sn{sub 5} networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu{sub 6}Sn{sub 5} IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu{sub 33}Al{sub 17} IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

Investigation of moisture uptake into printed circuit board laminate and solder mask materials

DEFF Research Database (Denmark)

Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti

2017-01-01

with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

Laser-tissue soldering with biodegradable polymer films in vitro: film surface morphology and hydration effects.

Science.gov (United States)

Sorg, B S; Welch, A J

2001-01-01

Previous research introduced the concept of using biodegradable polymer film reinforcement of a liquid albumin solder for improvement of the tensile strength of repaired incisions in vitro. In this study, the effect of creating small pores in the PLGA films on the weld breaking strength is studied. Additionally, the effect of hydration on the strength of the reinforced welds is investigated. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with an 806-nm CW diode laser. A poly(DL-lactic-co-glycolic acid) (PLGA) film was used to reinforce the solder (the controls had solder but no reinforcement). Breaking strengths were measured acutely and after hydration in saline for 1 and 2 days. The data were analyzed by ANOVA (P < 0.05) and multiple comparisons of means were performed using the Newman-Keuls test. The creation of pores in the PLGA films qualitatively improved the film flexibility without having an apparent adverse effect on the breaking strength, while the actual technique of applying the film and solder had more of an effect. The acute maximum average breaking strengths of some of the film reinforced specimens (114.7 g-134.4 g) were significantly higher (P < 0.05) than the acute maximum average breaking strength of the unreinforced control specimens (68.3 g). Film reinforced specimens were shown to have a statistically significantly higher breaking strength than unreinforced controls after 1- and 2-day hydration. Reinforcement of liquid albumin solders in laser-assisted incision repair appears to have advantages over conventional methods that do not reinforce the cohesive strength of the solder in terms of acute breaking strength and after immersion in moist environments for short periods of time. Using a film with the solder applied to one surface only may be advantageous over other techniques.

Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

Science.gov (United States)

Amalu, E. H.; Lui, Y. T.; Ekere, N. N.; Bhatti, R. S.; Takyi, G.

2011-01-01

The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

Pre-Columbian landscape impact and agriculture in the Monumental Mound region of the Llanos de Moxos, lowland Bolivia

Science.gov (United States)

Whitney, Bronwen S.; Dickau, Ruth; Mayle, Francis E.; Soto, J. Daniel; Iriarte, José

2013-09-01

We present a multiproxy study of land use by a pre-Columbian earth mounds culture in the Bolivian Amazon. The Monumental Mounds Region (MMR) is an archaeological sub-region characterized by hundreds of pre-Columbian habitation mounds associated with a complex network of canals and causeways, and situated in the forest-savanna mosaic of the Llanos de Moxos. Pollen, phytolith, and charcoal analyses were performed on a sediment core from a large lake (14 km2), Laguna San José (14°56.97'S, 64°29.70'W). We found evidence of high levels of anthropogenic burning from AD 400 to AD 1280, corroborating dated occupation layers in two nearby excavated habitation mounds. The charcoal decline pre-dates the arrival of Europeans by at least 100 yr, and challenges the notion that the mounds culture declined because of European colonization. We show that the surrounding savanna soils were sufficiently fertile to support crops, and the presence of maize throughout the record shows that the area was continuously cultivated despite land-use change at the end of the earth mounds culture. We suggest that burning was largely confined to the savannas, rather than forests, and that pre-Columbian deforestation was localized to the vicinity of individual habitation mounds, whereas the inter-mound areas remained largely forested.

Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

International Nuclear Information System (INIS)

Mallik, S.; Ekere, N.N.; Durairaj, R.; Marks, A.E.; Seman, A.

2009-01-01

Solder paste is the most important strategic bonding material used in the assembly of surface mount components in electronics manufacturing. As the trend towards miniaturisation of electronic products continues, there is an increasing demand for better understanding of the flow and deformation that is, the rheological behaviour of solder paste formulations. Wall slip plays an important role in characterising the flow behaviour of solder paste materials. The problem of wall slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin solvent layer adjacent to the wall, which gives rise to slippage. In rheological measurements, slip effects can generally be avoided by using roughened surfaces for measuring geometries. In this paper, a novel technique is developed to study the effect of wall slip in the rheological measurements of lead-free solder paste. The viscosity and oscillatory data obtained for three different solder paste samples (from measuring geometries of different surface roughness) have been analysed and compared. In viscosity measurements, slip effects were dominant at low shear rates and the use of serrated surfaces was found to be quite effective in minimizing slip effects. Oscillatory measurements were also affected by roughening the surfaces of measuring geometries.

Investigation on solder joint strength of nickel tin-plated and CRS tabs with PCB

International Nuclear Information System (INIS)

Luay Hussain

2002-01-01

Failure analysis on easily peels off Nickel and CRS steel tabs from PCB was carried out. Nickel Tin plated tabs, CRS steel tabs and tube were joined to the PCB using reflow/ convection soldering, in an oven. The solder paste composition is Sn36/Pb35/Ag2. Peel test was conducted and it was found that many tabs could be easily peeled off with low force. Porosities which varies from 0.4 mm to < 0.01mm in diameter, developed during soldering process and solidification was noted. It was found, the number, size and position of these porosities inside the solder layer on both parts of the tabs affect the peel strength. Scanning Electron Microscopy study and EDX analysis were carried out. It was found that the low peel strength values were due to the combination of generation and development of porosities during soldering process which act as stress concentrators and the evolution (growth) of eutectic Sn/Pb and Sn/Ni/Cu brittle grainy phase. Large eutectic microstructure with brittle Sn-Ni-Cu grainy phase enhances the failure with low peeling forces. Sample showing no feature of Sn/Ni/Cu grain gave high peeling strength value. Solder reflow, an important process, can result in strength enhancement (if it was controlled for example in a furnace). (Author)

Estimating total 239240Pu in blow-sand mounds of two safety-shot sites

International Nuclear Information System (INIS)

Gilbert, R.O.; Essington, E.H.

1977-01-01

A study for estimating the total amount (inventory) of 239 240 Pu in blow-sand mounds at two safety-shot sites (Area 13-Project 57 on the Nellis Air Force Base and Clean Slate 3 on the Tonopah Test Range in Nevada) is described. The total amount in blow-sand mounds at these two sites is estimated to be 5.8 +- 1.3 (total +- standard error) and 10.6 +- 2.5 curies, respectively. The total 239 240 Pu in mounds plus desert pavement areas, both to a depth of 5 cm below desert pavement level, is estimated to be 39 +- 5.7 curies at the Project 57 site and 36 +- 4.8 curies at Clean Slate 3. These estimates are compared with the somewhat higher estimates of 46 +- 9 and 37 +- 5.4 curies reported that pertain to only the top 5 cm of mounds and desert pavement. The possibility is discussed that these differences are due to sampling variability arising from the skewed nature of plutonium concentrations, particularly near ground zero

Slumping of brine mounds : bounds on behaviour

NARCIS (Netherlands)

Philips, J.R.; Duijn, van C.J.

1996-01-01

Two modifications of the approximate analysis of interface motion during two-fluid density-driven flows of De Josselin de Jong (Proc. Euromech., 143: 75–82, 1981) are applied to the slumping of finite two-dimensional and axisymmetric brine mounds. Both lead to simple similarity solutions. One

Thermal decomposition of solder flux activators under simulated wave soldering conditions

DEFF Research Database (Denmark)

Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan

2017-01-01

/methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base...... titration method as a function of temperature, time of exposure and the substrate material used. Findings: The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL...

Application of 5700.6B, quality assurance, to ES and H programs: Mound's approach and results

International Nuclear Information System (INIS)

Edling, D.A.

1985-01-01

Quality Assurance has always been integral to Mound's production and support operations. Weapons material and other designated material for WR programs are processed and controlled per the requirements of DOE/AL Quality Control Policy QC-1. Mound's non-WR activities, such as siting, design, construction, testing, operation, maintenance, development and production of materials, components, and systems, and acquisition of research and technology data are to be processed and controlled per the requirements of AL Order 5700.6. This paper presents an overview of the entire Quality Assurance Program at Mound and specifically addresses Mound's formal application of Quality Assurance to our comprehensive Environmental, Safety and Health (ES and H) Programs. 4 figures, 1 table

Do Epigeal Termite Mounds Increase the Diversity of Plant Habitats in a Tropical Rain Forest in Peninsular Malaysia?

Science.gov (United States)

Beaudrot, Lydia; Du, Yanjun; Rahman Kassim, Abdul; Rejmánek, Marcel; Harrison, Rhett D.

2011-01-01

The extent to which environmental heterogeneity can account for tree species coexistence in diverse ecosystems, such as tropical rainforests, is hotly debated, although the importance of spatial variability in contributing to species co-existence is well recognized. Termites contribute to the micro-topographical and nutrient spatial heterogeneity of tropical forests. We therefore investigated whether epigeal termite mounds could contribute to the coexistence of plant species within a 50 ha plot at Pasoh Forest Reserve, Malaysia. Overall, stem density was significantly higher on mounds than in their immediate surroundings, but tree species diversity was significantly lower. Canonical correspondence analysis showed that location on or off mounds significantly influenced species distribution when stems were characterized by basal area. Like studies of termite mounds in other ecosystems, our results suggest that epigeal termite mounds provide a specific microhabitat for the enhanced growth and survival of certain species in these species-rich tropical forests. However, the extent to which epigeal termite mounds facilitate species coexistence warrants further investigation. PMID:21625558

Development of high melting point, environmentally friendly solders, using the calphad approach

DEFF Research Database (Denmark)

Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

2008-01-01

An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Vario...... tension have also been considered. Special focus has been given to toxicity related issues since the main ideology of looking for an alternative to high lead containing solders is not related to technical issues but due to environmental concerns.......An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Various...... of promising solder alloy candidates. The ternary combinations that satisfied the primary solidification requirement were scrutinized taking into account the commercial interests i.e. availability, cost-effectiveness, recyclability and toxicity issues. Technical issues like manufacturability and surface...

Design And Construction Of Mounds For Breakwaters And Coastal Protection

DEFF Research Database (Denmark)

Burcharth, Hans F.; Barends, F.B.J.; Brebner, A.

Design and construction of mound breakwaters has during the last 5 to 10 years entered a new era. The major reason for that is the realization of problems encountered as it became necessary to erect port structures on more exposed shores and in deeper waters. As a consequence of that the P.I.A.N....... they were exposed to. The following sections discuss the stability of mound breakwaters, reasons for failure and design principles. A number of major failures are mentioned specifically. In each case an attempt has been made to explore and explain the reason for the failure....

2014 Strategic Petroleum Reserve Bryan Mound Well Integrity Grading Report.

Energy Technology Data Exchange (ETDEWEB)

Roberts, Barry L; Lord, David; Lord, Anna C. Snider; Bettin, Giorgia; Sobolik, Steven R.; Rudeen, David Keith; Eldredge, Lisa L. (FFPO); Wynn, Karen (FFPO); Checkai, Dean (FFPO); Osborne, Gerad (FFPO); Moore, Darryl (FFPO)

2015-04-01

This report summarizes the work performed in the prioritization of cavern access wells for remediation and monitoring at the Bryan Mound Strategic Petroleum Reserve site. The grading included consideration of all 47 wells at the Bryan Mound site, with each well receiving a separate grade for remediation and monitoring. Numerous factors affecting well integrity were incorporated into the grading including casing survey results, cavern pressure history, results from geomechanical simulations, and site geologic factors. The factors and grading framework used here are the same as those used in developing similar well remediation and monitoring priorities at the Big Hill Strategic Petroleum Reserve Site.

Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei

Energy Technology Data Exchange (ETDEWEB)

Kita, T; Mukaibo, N; Ando, K; Moriyama, M [Honda R and D Co. Ltd., Tokyo (Japan)

1997-10-01

Concerning the tin and lead eutectic solder, we have evaluated the reliability of three factors of intermetallic compound layer, creep and vibration which cause solder degradation. First, the stress factor was extracted from investigating the mechanism of degradation, and the best acceleration test method was fixed. Next, the acceleration test was executed to find the stress dependency and the tendency of solder degradation was modeled numerically. While the environmental stress frequency was obtained and they were put together by using a minor method, which enabled us to predict the life span of solder on the market with precision. 5 refs., 13 figs.

Finite Element-Assisted Assessment of the Thermo-cyclic Characteristics of Leads Soldered with SnAgCu(+Bi,In) Alloys

Science.gov (United States)

Lis, Adrian; Nakanishi, Kohei; Matsuda, Tomoki; Sano, Tomokazu; Minagawa, Madoka; Okamoto, Masahide; Hirose, Akio

2017-07-01

Solder joints between leads and printed circuit boards in thin small outline packages were produced with conventional Sn1.0Ag0.7Cu (SAC107) and Sn3.0Ag0.7Cu (SAC305) solders as well as various solder alloys with gradually increasing amounts of Bi (up to 3.0 wt.%) and In (up to 1.0 wt.%) within the SAC107 base solder. The reliability of soldered leads in temperature cycle (TC) tests improved most with solder alloys containing both Bi (1.6 wt.%) and In (0.5 wt.%). Microindentation and electron probe microanalysis mappings revealed that the effect originates from a combination of solution and precipitation strengthening of the initial SAC alloy. The distribution of inelastic strain accumulation (ISA), as a measure for degradation, was determined in the solder joints by finite element calculations. It was shown that defects in the solder proximal to the lead (60-75 μm), which was underpinned by similar cracking characteristics along the lead-solder interface. The ISA was confirmed to be lower in SAC+Bi/In alloys owing to their enhanced elasto-plastic properties. Moreover, the addition of a thin Cu coating on the leads could improve the joint reliability, as suggested by the calculation of the ISA and the acceleration factor.

Shrub mound formation and stability on semi-arid slopes in the Northern Negev Desert of Israel: A field and simulation study

NARCIS (Netherlands)

Buis, E.; Temme, A.J.A.M.; Veldkamp, A.; Boeken, B.; Jongmans, A.G.; Breemen, van N.; Schoorl, J.M.

2010-01-01

In semi-arid areas vegetation is scarce and often dominated by individual shrubs on raised mounds. The processes of formation of these mounds are diverse and still debated. Often, shrub mound formation is directly related to the formation of vegetation patterns, thereby assuming that shrub mound

Comparison of two carbonate mound sequences in the Lower Ordovician El Paso Formation, west Texas and southern New Mexico

Energy Technology Data Exchange (ETDEWEB)

Clemons, R.E.

1985-01-01

The El Paso Formations consists of four members, in ascending order: Hitt Canyon, Jose McKelligon and Padre. Mounds in the McKelligon Member exposed in the southern Franklin Mountains were described by Toomey (1970). Most of these mounds are small but one large one is 5.8 m thick and about 13.7 m long in outcrop. The mound rock is chiefly bioclastic wackestone with minor packstone and boundstone. The varied fauna contains echinoderms, sponges and spicules, gastropods, trilobites, digitate algae, Nuia, Girvanella, Pulchrilamina, Calathium, and minor brachiopods and cephalopods. Intraclastic, bioclastic grainstone fills channels cut in the mounds. Similar, but smaller and less spectacular mounds occur in the McKelligon Member in the Florida, Big Hatchet, and Caballo Mountains, Lone Mountain, Cooke's Range, and elsewhere in southwestern New Mexico. A second type of mound is common in the upper part of the Hitt Canyon Member in the Cooke's Range, Red Hills, Caballo and Big Hatchet Mountains. These mounds also are typically small but one in the Red Hills is 13.7 m thick and about 30 m long in outcrop. The mound complex is about 75-80% SH-C and LLH-C stromatolite boundstone and bioclastic wackestone. The remaining 20-25% is bioclastic packstone and grainstone between the SH-C stromatolites and filling channels cut in the mound complex. The limited fauna contains small fragments of echinoderms, gastropods, trilobites, spicules, and Nuia.

Elimination of Coptotermes lacteus (Froggatt) (Blattodea: Rhinotemitidae) Colonies Using Bistrifluron Bait Applied through In-Ground Bait Stations Surrounding Mounds.

Science.gov (United States)

Webb, Garry

2017-09-12

The efficacy of bistrifluron termite bait was evaluated using in-ground bait stations placed around Coptotermes lacteus mounds in south-eastern Australia during late summer and autumn (late February to late May 2012). Four in-ground bait stations containing timber billets were placed around each of twenty mounds. Once sufficient numbers of in-ground stations were infested by termites, mounds were assigned to one of four groups (one, two, three or four 120 g bait canisters or 120 to 480 g bait in total per mound) and bait canisters installed. One mound, nominally assigned treatment with two canisters ultimately had no termite interception in any of the four in-ground stations and not treated. Eighteen of the remaining 19 colonies were eliminated by 12 weeks after bait placement, irrespective of bait quantity removed (range 43 to 480 g). Measures of colony decline-mound repair capability and internal core temperature-did not accurately reflect the colony decline, as untreated colonies showed a similar pattern of decline in both repair capability and internal mound core temperature. However, during the ensuing spring-summer period, capacity to repair the mound was restored in untreated colonies and the internal core temperature profile was similar to the previous spring-summer period which indicated that these untreated colonies remained healthy.

In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

International Nuclear Information System (INIS)

Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

2008-01-01

The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines

Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock

Science.gov (United States)

Han, Jing; Tan, Shihai; Guo, Fu

2018-01-01

Ball grid array (BGA) samples were soldered on a printed circuit board with Sn37Pb solder paste to investigate the recrystallization induced by subgrain rotation during thermal shock. The composition of the solder balls was Sn3.0Ag0.5Cu-Sn37Pb, which comprised mixed solder joints. The BGA component was cross-sectioned before thermal shock. The microstructure and grain orientations were obtained by a scanning electron microscope equipped with an electron back-scattered diffraction system. Two mixed solder joints at corners of the BGA component were selected as the subjects. The results showed that recrystallization occurred at the corner of the solder joints after 200 thermal shock cycles. The recrystallized subgrains had various new grain orientations. The newly generated grain orientations were closely related to the initial grain orientations, which indicated that different subgrain rotation behaviors could occur in one mixed solder joint with the same initial grain orientation. When the misorientation angles were very small, the rotation axes were about Sn [100], [010] and [001], as shown by analyzing the misorientation angles and subgrain rotation axes, while the subgrain rotation behavior with large misorientation angles in the solder joints was much more complicated. As Pb was contained in the solder joints and the stress was concentrated on the corner of the mixed solder joints, concaves and cracks were formed. When the adjacent recrystallized subgrains were separated, and the process of the continuous recrystallization was limited.

Safe shutdown of Defense Program facilities at the Mound Plant, Miamisburg, Ohio

International Nuclear Information System (INIS)

Anderson, H.F.; Bantz, P.D.; Luthy, D.F.

1996-01-01

The Mound Plant was one of several production sites in the US Department of Energy's Defense Programs (DP) Weapons Complex. As a result of the downsizing of the weapons program, certain operations at Mound are being transferred to other DOE sites and the DP buildings at Mound are being shutdown. The objectives of the program are to reduce the hazardous and financial liabilities to DOE and to foster the reuse of facilities for economic development. The overall program is described. The process began with the categorization of excess DP buildings into three groups depending on their anticipated future use. The draft DOE/EM-60 Acceptance Criteria were used to develop a detailed shutdown checklist as the foundation of the process. The overall program budget, schedule, ad options for disposition of materials and components is presented. Accomplishments in FY94 and FY95 are described. By the end of FY95, all excess energetic materials and components, all excess chemicals (from non-radiation areas) and significant amounts of radioactive materials have been removed from the site. By the end of FY95, 47 of the 72 buildings in the program have been taken through all ten of the draft EM-60 acceptance criteria. Lessons learned, based on experience at Mound to date, are summarized

Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

Energy Technology Data Exchange (ETDEWEB)

Hamm, Randy; Peterson, Kenneth A.

2015-10-01

This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm X 6.5 mm X 0.1 mm (0.354” x 0.256” x 0.004”), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while maintaining a consistent bondline (minimizing die tilt). Voiding was measured using acoustic imaging and die tilt was measured using two different optical measurement systems. 80Au-20Sn solder reflow was achieved using a batch vacuum solder system with optimized fixturing. Minimizing die tilt proved to be the more difficult of the two product requirements to meet. Process development variables included tooling, weight and solder preform thickness.

Improvement of the auto wire feeder machine in a de-soldering process

Directory of Open Access Journals (Sweden)

Niramon Nonkhukhetkhong

2016-10-01

Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints.

Science.gov (United States)

Fattahi, Farnaz; Hashemi Ardakani, Zahra; Hashemi Ardakani, Maryam

2015-12-01

Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint of the bar, and were placed at the considered angles by employing an explicitly designed device. They were divided into 4 groups regarding the gap angle; Group C (control group) with parallel gap on steady distance of 0.2mm, Group 1: 10°, Group 2: 20°, and Group3: 30° gap angles. When soldered, the specimens were all tested for tensile strength using a universal testing machine at a cross-head speed of 0.5 mm/min with a preload of 10N. Kruskal-Wallis H test was used to compare tensile strength among the groups (ptensile strength values obtained from the study groups were respectively 307.84, 391.50, 365.18, and 368.86 MPa. The tensile strength was not statistically different among the four groups in general (p≤ 0.490). Making the gap angular at the solder joints and the subsequent unsteady increase of the gap distance would not change the tensile strength of the joint.

Fluxless flip-chip bonding using a lead-free solder bumping technique

Science.gov (United States)

Hansen, K.; Kousar, S.; Pitzl, D.; Arab, S.

2017-09-01

With the LHC exceeding the nominal instantaneous luminosity, the current barrel pixel detector (BPIX) of the CMS experiment at CERN will reach its performance limits and undergo significant radiation damage. In order to improve detector performance in high luminosity conditions, the entire BPIX is replaced with an upgraded version containing an additional detection layer. Half of the modules comprising this additional layer are produced at DESY using fluxless and lead-free bumping and bonding techniques. Sequential solder-jetting technique is utilized to wet 40-μm SAC305 solder spheres on the silicon-sensor pads with electroless Ni, Pd and immersion Au (ENEPIG) under-bump metallization (UBM). The bumped sensors are flip-chip assembled with readout chips (ROCs) and then reflowed using a flux-less bonding facility. The challenges for jetting low solder volume have been analyzed and will be presented in this paper. An average speed of 3.4 balls per second is obtained to jet about 67 thousand solder balls on a single chip. On average, 7 modules have been produced per week. The bump-bond quality is evaluated in terms of electrical and mechanical properties. The peak-bump resistance is about 17.5 mΩ. The cross-section study revealed different types of intermetallic compounds (IMC) as a result of interfacial reactions between UBM and solder material. The effect of crystalline phases on the mechanical properties of the joint is discussed. The mean shear strength per bump after the final module reflow is about 16 cN. The results and sources of yield loss of module production are reported. The achieved yield is 95%.

Nanoscale Soldering of Positioned Carbon Nanotubes using Highly Conductive Electron Beam Induced Gold Deposition

DEFF Research Database (Denmark)

Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

2003-01-01

We have developed an in-situ method for controlled positioning of carbon nanotubes followed by highly conductive contacting of the nanotubes, using electron beam assisted deposition of gold. The positioning and soldering process takes place inside an Environmental Scanning Electron Microscope (E...... in a carbon matrix. Nanoscale soldering of multi-walled carbon nanotubes (MWNT) onto microelectrodes was achieved by deposition of a conducting gold line across a contact point between nanotube and electrode. The solderings were found to be mechanically stronger than the carbon nanotubes. We have positioned...... MWNTs to bridge the gap between two electrodes, and formed soldering bonds between the tube and each of the electrodes. All nanotube bridges showed ohmic resistances in the range 10-30 kΩ. We observed no increase in resistance after exposing the MWNT bridge to air for days....

In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

Energy Technology Data Exchange (ETDEWEB)

Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

2008-10-31

The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines.

Methane fluxes from the mound-building termite species of North Australian savannas

Science.gov (United States)

Jamali, H.; Livesely, S. J.; Arndt, S. K.; Dawes-Gromadzki, T.; Cook, G. D.; Hutley, L.

2009-04-01

Termites are estimated to contribute 3-19% to the global methane emissions. These estimates have large uncertainties because of the limited number of field-based studies and species studied, as well as issues of diel and seasonal variation. We measured methane fluxes from four common mound-building termite species (Microcerotermes nervosus, n=26; M. serratus, n=4; Tumulitermes pastinator, n=5; and Amitermes darwini, n=4) in tropical savannas near Darwin in the Northern Territory, Australia. Methane fluxes from replicated termite mounds were measured in the field using manual chambers with fluxes reported on a mound volume basis. Methane flux was measured in both wet and dry seasons and diel variation was investigated by measuring methane flux every 4 hours over a 24 hour period. Mound temperature was measured concurrently with flux to examine this relationship. In addition, five M. nervosus mounds removed from the field and incubated under controlled temperature conditions over a 24 hour period to remove the effect of varying temperature. During the observation campaigns, mean monthly minimum and maximum temperatures for February (wet season) were 24.7 and 30.8°C, respectively, and were 20.1 to 31.4 °C in June (dry season). Annual rainfall in 2008 for Darwin was 1970.1 mm, with a maximum of 670 mm falling in February and no rain in May and June. Methane fluxes were greatest in the wet season for all species, ranging from 265.1±101.1 (T. pastinator) to 2256.6±757.1 (M. serratus) µg CH4-C/m3/h. In the dry season, methane fluxes were at their lowest, ranging from 10.0±5.5 (T. pastinator) to 338.0±165.9 (M. serratus) µg CH4-C/m3/h. On a diel basis, methane fluxes were smallest at the coolest time of the day (~0700 hrs) and greatest at the warmest (~1400 hrs) for all species, and for both wet and dry seasons. Typical diel variation in flux from M. serratus dominated mounds ranged from 902.6±261.9 to 1392.1±408.1 µg CH4-C/m3/h in wet season and 99.6±57.4 to

A Preliminary Study on Termite Mound Soil as Agricultural Soil for Crop Production in South West, Nigeria

Directory of Open Access Journals (Sweden)

O. E. Omofunmi

2017-08-01

Full Text Available It is a popular belief of the people in the Southern region of Nigeria that a land infested with termite usually brings prosperity to the land owner regardless of the type of its usage. Therefore, the present study assessed termite mounds soil properties which are important to crop production. Two soil samples were collected and their physical and chemical properties determined in accordance with American Public Health Association (APHA, 2005. Data were analyzed using descriptive statistics. The textural classes showed that the termite mound soil was sand clay loam while the surrounding soil was clay loam. This results revealed that: Termites’ activity induced significant chemical changes in the soil possible due to the materials used in building their nests. There was increase the concentrations of nitrogen, phosphorus, Potassium, calcium and magnesium higher in the termite’s mounds, while the micro-nutrients (zinc, iron and copper except sulphur and manganese lower in the soil infested by termites. There were significant differences (p ≥ 0.05 between termite mound soil and surrounding soil. It showed highly positive correlation between termite mound and surrounding soil (r= 0.92. The concentration of the soil properties around the termite mound are within the range of soil nutrients suitable for arable crop production. Termite mound soil is recommended to be used as an alternative to local farmers who cannot afford to buy expensive inorganic fertilizers.

Elimination of Coptotermes lacteus (Froggatt (Blattodea: Rhinotemitidae Colonies Using Bistrifluron Bait Applied through In-Ground Bait Stations Surrounding Mounds

Directory of Open Access Journals (Sweden)

Garry Webb

2017-09-01

Full Text Available The efficacy of bistrifluron termite bait was evaluated using in-ground bait stations placed around Coptotermes lacteus mounds in south-eastern Australia during late summer and autumn (late February to late May 2012. Four in-ground bait stations containing timber billets were placed around each of twenty mounds. Once sufficient numbers of in-ground stations were infested by termites, mounds were assigned to one of four groups (one, two, three or four 120 g bait canisters or 120 to 480 g bait in total per mound and bait canisters installed. One mound, nominally assigned treatment with two canisters ultimately had no termite interception in any of the four in-ground stations and not treated. Eighteen of the remaining 19 colonies were eliminated by 12 weeks after bait placement, irrespective of bait quantity removed (range 43 to 480 g. Measures of colony decline—mound repair capability and internal core temperature—did not accurately reflect the colony decline, as untreated colonies showed a similar pattern of decline in both repair capability and internal mound core temperature. However, during the ensuing spring–summer period, capacity to repair the mound was restored in untreated colonies and the internal core temperature profile was similar to the previous spring–summer period which indicated that these untreated colonies remained healthy.

Physiological and biogeochemical traits of bleaching and recovery in the mounding species of coral Porites lobata: implications for resilience in mounding corals.

Directory of Open Access Journals (Sweden)

Stephen J Levas

Full Text Available Mounding corals survive bleaching events in greater numbers than branching corals. However, no study to date has determined the underlying physiological and biogeochemical trait(s that are responsible for mounding coral holobiont resilience to bleaching. Furthermore, the potential of dissolved organic carbon (DOC as a source of fixed carbon to bleached corals has never been determined. Here, Porites lobata corals were experimentally bleached for 23 days and then allowed to recover for 0, 1, 5, and 11 months. At each recovery interval a suite of analyses were performed to assess their recovery (photosynthesis, respiration, chlorophyll a, energy reserves, tissue biomass, calcification, δ(13C of the skeletal, δ(13C, and δ(15N of the animal host and endosymbiont fractions. Furthermore, at 0 months of recovery, the assimilation of photosynthetically acquired and zooplankton-feeding acquired carbon into the animal host, endosymbiont, skeleton, and coral-mediated DOC were measured via (13C-pulse-chase labeling. During the first month of recovery, energy reserves and tissue biomass in bleached corals were maintained despite reductions in chlorophyll a, photosynthesis, and the assimilation of photosynthetically fixed carbon. At the same time, P. lobata corals catabolized carbon acquired from zooplankton and seemed to take up DOC as a source of fixed carbon. All variables that were negatively affected by bleaching recovered within 5 to 11 months. Thus, bleaching resilience in the mounding coral P. lobata is driven by its ability to actively catabolize zooplankton-acquired carbon and seemingly utilize DOC as a significant fixed carbon source, facilitating the maintenance of energy reserves and tissue biomass. With the frequency and intensity of bleaching events expected to increase over the next century, coral diversity on future reefs may favor not only mounding morphologies but species like P. lobata, which have the ability to utilize heterotrophic

Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

Directory of Open Access Journals (Sweden)

Xiuyun Zhou

2015-10-01

Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

CERN Document Server

Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B

2015-01-01

The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

Reliability of Pb free solder alloys. Physical and mechanical properties; Pb free handa no shinraisei. Butsuri kikaiteki shinraisei

Energy Technology Data Exchange (ETDEWEB)

Sanji, M; Yoshino, M; Ishikawa, J; Takenaka, O [Denso Corp., Aichi (Japan)

1997-10-01

Properties of 19 different Pb free solders have been evaluated in comparison with Sn-37Pb eutectic solder. Pb free solders without Bi were on the same level as Sn-37Pb in tensile strength and elongation, and those with Bi had higher strength and lower elongation than Sn-37Pb. As the Bi content increased, strength was higher, and elongation was lower. In torsion fatigue tests, fatigue life of Pb free solders without Bi was longer than Sn-37Pb. The relationships of Coffin-Manson rule and Basquin rule with fatigue life was applicable to Pb free solder. Fatigue life of those is inferred from their tensile strength. 7 refs., 13 figs., 1 tab.

Efficiency of fipronil in the control of the mound-building termite, Nasutitermes sp. (Isoptera: Termitidae) in sugarcane

OpenAIRE

Melo Fo, Reinaldo M.; Veiga, Antônio F.S.L.

1998-01-01

The efficiency of fipronil was evaluated in field conditions at different dosages and two formulations, against Nasutitermes sp. (isopteran: Termitidae) in sugarcane (Sccharum sp.). Termite mounds were indentified, measured and drilled until cellulosic chamber to allow insecticide application. Nine treatments were tested with ten replications in a completely randomized design and each termite mound considered as an experimental unit. after 50 days the termite mounds were opened and the mortal...

A methodology for the analysis of damage progression in rubble mound breakwaters

OpenAIRE

Campos Duque, Álvaro

2016-01-01

Nowadays, risk based designs as well as reliable rehabilitation and maintenance strategies are essential when dealing with coastal structures. In this sense, the probability of failure due to instability of the armour layer is one of the main issues in rubble mound breakwaters, and so is improving the knowledge on its deterioration rate. Both stability and damage progression on rubble mound breakwaters have been studied for more than 80 years, using different approaches, under regular/irregul...

Laser tissue welding mediated with a protein solder

Science.gov (United States)

Small, Ward, IV; Heredia, Nicholas J.; Celliers, Peter M.; Da Silva, Luiz B.; Eder, David C.; Glinsky, Michael E.; London, Richard A.; Maitland, Duncan J.; Matthews, Dennis L.; Soltz, Barbara A.

1996-05-01

A study of laser tissue welding mediated with an indocyanine green dye-enhanced protein solder was performed. Freshly obtained sections of porcine artery were used for the experiments. Sample arterial wall thickness ranged from two to three millimeters. Incisions approximately four millimeters in length were treated using an 805 nanometer continuous- wave diode laser coupled to a one millimeter diameter fiber. Controlled parameters included the power delivered by the laser, the duration of the welding process, and the concentration of dye in the solder. A two-color infrared detection system was constructed to monitor the surface temperatures achieved at the weld site. Burst pressure measurements were made to quantify the strengths of the welds immediately following completion of the welding procedure.

Antarctic Mirabilite Mounds as Mars Analogs: The Lewis Cliffs Ice Tongue Revisited

Science.gov (United States)

Socki, Richard A.; Sun, Tao; Niles, Paul B.; Harvey, Ralph P.; Bish, David L.; Tonui, Eric

2012-01-01

It has been proposed, based on geomorphic and geochemical arguments, that subsurface water has played an important role in the history of water on the planet Mars [1]. Subsurface water, if present, could provide a protected and long lived environment for potential life. Discovery of gullies [2] and recurring slopes [3] on Mars suggest the potential for subsurface liquid water or brines. Recent attention has also focused on small (the mid to high latitudes on the surface of Mars which may be caused by eruptions of subsurface fluids [4, 5]. We have identified massive but highly localized Na-sulfate deposits (mirabilite mounds, Na2SO4 .10H2O) that may be derived from subsurface fluids and may provide insight into the processes associated with subsurface fluids on Mars. The mounds are found on the end moraine of the Lewis Cliffs Ice Tongue (LCIT) [6] in the Transantarctic Mountains, Antarctica, and are potential terrestrial analogs for mounds observed on the martian surface. The following characteristics distinguish LCIT evaporite mounds from other evaporite mounds found in Antarctic coastal environments and/or the McMurdo Dry Valleys: (1) much greater distance from the open ocean (approx.500 km); (2) higher elevation (approx.2200 meters); and (3) colder average annual temperature (average annual temperature = -30 C for LCIT [7] vs. 20 C at sea level in the McMurdo region [8]. Furthermore, the recent detection of subsurface water ice (inferred as debris-covered glacial ice) by the Mars Reconnaissance Orbiter [9] supports the use of an Antarctic glacial environment, particularly with respect to the mirabilite deposits described in this work, as an ideal terrestrial analog for understanding the geochemistry associated with near-surface martian processes. S and O isotopic compositions.

Electrical Resistance of Nb$_{3}$Sn/Cu Splices Produced by Electromagnetic Pulse Technology and Soft Soldering

CERN Document Server

Schoerling, D; Scheuerlein, C; Atieh, S; Schaefer, R

2011-01-01

The electrical interconnection of Nb$_{3}$Sn/Cu strands is a key issue for the construction of Nb$_{3}$Sn based damping ring wigglers and insertion devices for third generation light sources. We compare the electrical resistance of Nb$_{3}$Sn/Cu splices manufactured by solid state welding using Electromagnetic Pulse Technology (EMPT) with that of splices produced by soft soldering with two different solders. The resistance of splices produced by soft soldering depends strongly on the resistivity of the solder alloy at the operating temperature. By solid state welding splice resistances below 10 nOhm can be achieved with 1 cm strand overlap length only, which is about 4 times lower than the resistance of Sn96Ag4 soldered splices with the same overlap length. The comparison of experimental results with Finite Element simulations shows that the electrical resistance of EMPT welded splices is determined by the resistance of the stabilizing copper between the superconducting filaments and confirms that welding of ...

Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

Science.gov (United States)

Hasnine, M.; Tolla, B.; Vahora, N.

2018-04-01

This paper explores the effects of aging on the mechanical behavior, microstructure evolution and IMC formation on different surface finishes of two high temperature solders, Sn-5 wt.% Ag and Sn-5 wt.% Sb. High temperature aging showed significant degradation of Sn-5 wt.% Ag solder hardness (34%) while aging has little effect on Sn-5 wt.% Sb solder. Sn-5 wt.% Ag experienced rapid grain growth as well as the coarsening of particles during aging. Sn-5 wt.% Sb showed a stable microstructure due to solid solution strengthening and the stable nature of SnSb precipitates. The increase of intermetallic compound (IMC) thickness during aging follows a parabolic relationship with time. Regression analysis (time exponent, n) indicated that IMC growth kinetics is controlled by a diffusion mechanism. The results have important implications in the selection of high temperature solders used in high temperature applications.

Implementation of linear bias corrections for calorimeters at Mound

International Nuclear Information System (INIS)

Barnett, T.M.

1993-01-01

In the past, Mound has generally made relative bias corrections as part of the calibration of individual calorimeters. The correction made was the same over the entire operating range of the calorimeter, regardless of the magnitude of the range. Recently, an investigation was performed to check the relevancy of using linear bias corrections to calibrate the calorimeters. The bias is obtained by measuring calibrated plutonium and/or electrical heat standards over the operating range of the calorimeter. The bias correction is then calculated using a simple least squares fit (y = mx + b) of the bias in milliwatts over the operating range of the calorimeter in watts. The equation used is B i = B 0 + (B w * W m ), where B i is the bias at any given power in milliwatts, B 0 is the intercept (absolute bias in milliwatts), B w is the slope (relative bias in milliwatts per watt), and W m is the measured power in watts. The results of the study showed a decrease in the random error of bias corrected data for most of the calorimeters which are operated over a large wattage range (greater than an order of magnitude). The linear technique for bias correction has been fully implemented at Mound and has been included in the Technical Manual, ''A Measurement Control Program for Radiometric Calorimeters at Mound'' (MD-21900)

Laser solder welding of articular cartilage: tensile strength and chondrocyte viability.

Science.gov (United States)

Züger, B J; Ott, B; Mainil-Varlet, P; Schaffner, T; Clémence, J F; Weber, H P; Frenz, M

2001-01-01

The surgical treatment of full-thickness cartilage defects in the knee joint remains a therapeutic challenge. Recently, new techniques for articular cartilage transplantation, such as mosaicplasty, have become available for cartilage repair. The long-term success of these techniques, however, depends not only on the chondrocyte viability but also on a lateral integration of the implant. The goal of this study was to evaluate the feasibility of cartilage welding by using albumin solder that was dye-enhanced to allow coagulation with 808-nm laser diode irradiation. Conventional histology of light microscopy was compared with a viability staining to precisely determine the extent of thermal damage after laser welding. Indocyanine green (ICG) enhanced albumin solder (25% albumin, 0.5% HA, 0.1% ICG) was used for articular cartilage welding. For coagulation, the solder was irradiated through the cartilage implant by 808-nm laser light and the tensile strength of the weld was measured. Viability staining revealed a thermal damage of typically 500 m in depth at an irradiance of approximately 10 W/cm(2) for 8 seconds, whereas conventional histologies showed only half of the extent found by the viability test. Heat-bath investigations revealed a threshold temperature of minimum 54 degrees C for thermal damage of chondrocytes. Efficient cartilage bonding was obtained by using bovine albumin solder as adhesive. Maximum tensile strength of more than 10 N/cm(2) was achieved. Viability tests revealed that the thermal damage is much greater (up to twice) than expected after light microscopic characterization. This study shows the feasibility to strongly laser weld cartilage on cartilage by use of a dye-enhanced albumin solder. Possibilities to reduce the range of damage are suggested. Copyright 2001 Wiley-Liss, Inc.

Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

DEFF Research Database (Denmark)

Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

2014-01-01

Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

A Preliminary Study on Elimination of Colonies of the Mound Building Termite Macrotermes gilvus (Hagen Using a Chlorfluazuron Termite Bait in the Philippines

Directory of Open Access Journals (Sweden)

Partho Dhang

2011-11-01

Full Text Available The effectiveness of a chlorfluazuron termite bait in eliminating colonies of the termite species Macrotermes gilvus (Hagen was evaluated under field conditions. Three active termite mounds were chosen for this study, two acted as test mounds and the other as the control. Four In-Ground Stations (IGS were installed around each mound. Interception occurred almost immediately in all the stations, which were subsequently baited. The control mound was fed a bait matrix lacking the active ingredient. Stations were re-baited every 2 weeks for 10–12 weeks until bait consumption ceased in the test mounds. The mounds were left undisturbed for four more weeks before being destructively sampled. The desiccated remains of workers, soldiers, late instars and queen were found upon sampling the treated mounds. A few live termites were located in one treated mound but were darkly pigmented indicating bait consumption. The control mound remained healthy and did not show any visible sign of negative impact. The bait successfully suppressed or eliminated both M. gilvus colonies within 16 weeks from commencement of feeding.

Modelling effects of tree population dynamics, tree throw and pit-mound formation/diffusion on microtopography over time in different forest settings

Science.gov (United States)

Martin, Y. E.; Johnson, E. A.; Gallaway, J.; Chaikina, O.

2011-12-01

Herein we conduct a followup investigation to an earlier research project in which we developed a numerical model of tree population dynamics, tree throw, and sediment transport associated with the formation of pit-mound features for Hawk Creek watershed, Canadian Rockies (Gallaway et al., 2009). We extend this earlier work by exploring the most appropriate transport relations to simulate the diffusion over time of newly-formed pit-pound features due to tree throw. We combine our earlier model with a landscape development model that can incorporate these diffusive transport relations. Using these combined models, changes in hillslope microtopography over time associated with the formation of pit-mound features and their decay will be investigated. The following ideas have motivated this particular study: (i) Rates of pit-mound degradation remain a source of almost complete speculation, as there is almost no long-term information on process rates. Therefore, we will attempt to tackle the issue of pit-mound degradation in a methodical way that can guide future field studies; (ii) The degree of visible pit-mound topography at any point in time on the landscape is a joint function of the rate of formation of new pit-mound features due to tree death/topple and their magnitude vs. the rate of decay of pit-mound features. An example of one interesting observation that arises is the following: it appears that pit-mound topography is often more pronounced in some eastern North American forests vs. field sites along the eastern slopes of the Canadian Rockies. Why is this the case? Our investigation begins by considering whether pit-mound decay might occur by linear or nonlinear diffusion. What differences might arise depending on which diffusive approach is adopted? What is the magnitude of transport rates associated with these possible forms of transport relations? We explore linear and nonlinear diffusion at varying rates and for different sizes of pit-mound pairs using a

Differences between bacterial communities in the gut of a soil-feeding termite (Cubitermes niokoloensis) and its mounds

OpenAIRE

Fall, Saliou; Hamelin, J.; Ndiaye, Farma; Assigbetse, Komi; Aragno, M.; Chotte, Jean-Luc; Brauman, Alain

2007-01-01

In tropical ecosystems, termite mound soils constitute an important soil compartment covering around 10% of African soils. Previous studies have shown (S. Fall, S. Nazaret, J. L. Chotte, and A. Brauman, Microb. Ecol. 28:191-199, 2004) that the bacterial genetic structure of the mounds of soil-feeding termites (Cubitermes niokoloensis) is different from that of their surrounding soil. The aim of this study was to characterize the specificity of bacterial communities within mounds with respect ...

Effects of voids on thermal-mechanical reliability of lead-free solder joints

Directory of Open Access Journals (Sweden)

Benabou Lahouari

2014-06-01

Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

DEFF Research Database (Denmark)

Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper

2009-01-01

of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling. solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft....... The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers...

Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments

International Nuclear Information System (INIS)

Zhang, Liang; Han, Ji-guang; Guo, Yong-huan; He, Cheng-wen

2014-01-01

With the addition of 0.03 wt% rare earth Ce, in our previous works, the properties of SnAgCu solder were enhanced obviously. Based on the Garofalo–Arrhenius creep constitutive model, finite element method was used to simulate the stress–strain response during thermal cycle loading, and combined with the fatigue life prediction models, the fatigue life of SnAgCu/SnAgCuCe solder joints was calculated respectively, which can demonstrate the effect of the rare earth Ce on the fatigue life of SnAgCu solder joints. The results indicated that the maximum stress–strain can be found on the top surface of the corner solder joint, and the warpage of the PCB substrate occurred during thermal cycle loading. The trends obtained from modeling results have a good agreement with the experimental data reported in the literature for WLCSP devices. In addition, the stress–strain of SnAgCuCe solder joints is lower than that of SnAgCu solder joints. The thermal fatigue lives of solder joints calculated based on the creep model and creep strain energy density model show that the fatigue life of SnAgCuCe solder joints is higher than the SnAgCu solder joints. The fatigue life of SnAgCuCe solder joints can be enhanced significantly with the addition of Ce, is 30.2% higher than that of SnAgCu solder joints, which can be attributed to the CeSn 3 particles formed resisting the motion of dislocation; moreover, the refinement of microstructure and the IMC sizes also contribute to the enhancement of fatigue life, which elucidates that SnAgCuCe solder can be utilized in electronic industry with high reliability replacing the SnAgCu solder

Dissolution ad uptake of cadmium from dental gold solder alloy implants

International Nuclear Information System (INIS)

Bergman, B.; Bergman, M.; Soeremark, R.

1977-01-01

Pure metallic cadmium was irradiated by means of thermal neutrons. The irradiated cadmium ( 115 Cd) was placed in bags of gold foil and the bags were implanted subcutaneously in the neck region of mice. Two and 3 d respectively after implantation the mice were killed, the bags removed and the animals subjected to whole-body autoradiography. The autoradiograms revealed an uptake of 115 Cd in liver and kidney. In another experiment specimens of a cadmium-containing dental gold solder alloy, a cadmium-free dental casting gold alloy and soldered assemblies made of these two alloys were implanted subcutaneously in the neck region of mice. The animals were killed after 6 months; cadmium analysis showed significant increases in the cadmium concentration in liver and kidney of those mice which had been given implants of gold solder alloy. The study clearly shows that due to electrochemical corrosion cadmium can be released from implants and accumulated in the kidneys and the liver. (author)

Dissolution and uptake of cadmium from dental gold solder alloy implants

Energy Technology Data Exchange (ETDEWEB)

Bergman, B; Bergman, M; Soeremark, R [Umeaa Univ. (Sweden); Karolinska Institutet, Stockholm (Sweden))

1977-01-01

Pure metallic cadmium was irradiated by means of thermal neutrons. The irradiated cadmium (/sup 115/Cd) was placed in bags of gold foil and the bags were implanted subcutaneously in the neck region of mice. Two and 3 d respectively after implantation the mice were killed, the bags removed and the animals subjected to whole-body autoradiography. The autoradiograms revealed an uptake of /sup 115/Cd in liver and kidney. In another experiment specimens of a cadmium-containing dental gold solder alloy, a cadmium-free dental casting gold alloy and soldered assemblies made of these two alloys were implanted subcutaneously in the neck region of mice. The animals were killed after 6 months; cadmium analysis showed significant increases in the cadmium concentration in liver and kidney of those mice which had been given implants of gold solder alloy. The study clearly shows that due to electrochemical corrosion cadmium can be released from implants and accumulated in the kidneys and the liver.

The Shear Strength and Fracture Behavior of Sn-Ag- xSb Solder Joints with Au/Ni-P/Cu UBM

Science.gov (United States)

Lee, Hwa-Teng; Hu, Shuen-Yuan; Hong, Ting-Fu; Chen, Yin-Fa

2008-06-01

This study investigates the effects of Sb addition on the shear strength and fracture behavior of Sn-Ag-based solders with Au/Ni-P/Cu underbump metallization (UBM) substrates. Sn-3Ag- xSb ternary alloy solder joints were prepared by adding 0 wt.% to 10 wt.% Sb to a Sn-3.5Ag alloy and joining them with Au/Ni-P/Cu UBM substrates. The solder joints were isothermally stored at 150°C for up to 625 h to study their microstructure and interfacial reaction with the UBM. Single-lap shear tests were conducted to evaluate the mechanical properties, thermal resistance, and failure behavior. The results show that UBM effectively suppressed intermetallic compound (IMC) formation and growth during isothermal storage. The Sb addition helped to refine the Ag3Sn compounds, further improving the shear strength and thermal resistance of the solders. The fracture behavior evolved from solder mode toward the mixed mode and finally to the IMC mode with increasing added Sb and isothermal storage time. However, SnSb compounds were found in the solder with 10 wt.% Sb; they may cause mechanical degradation of the solder after long-term isothermal storage.

CO2 temperature-controlled laser soldering of pig trachea incisions in vitro using flexible albumin bands

Science.gov (United States)

Sharvit, Dan; Vasilyev, Tamar; Vasserman, Irena; Simhon, David; Kariv, Naam; DeRowe, Ari; Katzir, Abraham

2005-04-01

Resection of a segment of the trachea is a procedure applied for the removal of cervical tumors invading the trachea, or for the treatment of severe tracheal stenosis. The current method of anastomosis is based on multiple sutures. The main drawbacks of this method are: 1) A long procedure time, 2) An air leakage, and 3) An inflammatory response to the sutures. In this study we evaluated the feasibility and effectiveness of the use of temperature controlled CO2 laser soldering of incisions in pig tracheas in vitro. A transverse incision was made in a separated pig trachea. A flexible albumin band was prepared and was laser soldered with albumin solder to the outer surface of the trachea, covering the incision. The soldered trachea ends were sealed and the burst pressure was measured. In a series of in vitro experiments, the mean burst pressure was found to be 230 mm Hg. These preliminary results demonstrated that laser soldering using a flexible albumin band may be a useful method for sealing an incision in the trachea.

Instantaneous fluxless bonding of Au with Pb-Sn solder in ambient atmosphere

International Nuclear Information System (INIS)

Lee, T.K.; Zhang, Sam; Wong, C.C.; Tan, A.C.

2005-01-01

A fluxless bonding technique has been developed as a method of flip-chip bonding for microelectronic packaging. The fluxless bonding technique can be achieved instantaneously in an ambient environment between metallic stud bumps and predefined molten solder. This paper describes the mechanics of the bonding action and verifies the effectiveness of this bonding method through wetting balance tests and scanning electron microscope and energy dispersive x-ray analysis. This technique has been demonstrated by using a gold stud bump to break the tin oxide layer over molten solder. This allows for a fast, solid liquid interdiffusion between gold (Au) and the fresh molten eutectic lead-tin (Pb-Sn) solder for joint formation during solidification. This bonding method has been successfully tested with 130-μm-pitch flip-chip bond pads on a joint-in-via flex substrate architecture

SINGLE IMAGE CAMERA CALIBRATION IN CLOSE RANGE PHOTOGRAMMETRY FOR SOLDER JOINT ANALYSIS

Directory of Open Access Journals (Sweden)

D. Heinemann

2016-06-01

Full Text Available Printed Circuit Boards (PCB play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.

Diversity And Abundance Of Deep-Water Coral Mounds In The Straits Of Florida: A Result of Adaptability To Local Environments?

Science.gov (United States)

Correa, T. B.; Grasmueck, M.; Eberli, G.; Viggiano, D. A.; Rosenberg, A.; Reed, J. K.

2007-12-01

To improve the understanding of the Florida-Bahamas deep-water coral mound ecosystem, Autonomous Underwater Vehicle (AUV) surveys were conducted on five coral mound fields throughout the Straits of Florida (three sites at the base of slope of Great Bahama Bank (GBB), one in the middle of the Straits (MS) and one at the base of the Miami Terrace (MT)) in water depths of 590 to 860 m. The AUV provides high-resolution bathymetric maps, sub-bottom profiles and oceanographic data. The AUV survey sites were subsequently groundtruthed via sample collection and video transects, using the Johnson Sealink submersible. Contrary to previous surveys, we found a high diversity in coral mound morphology between sites separated by 15 to 80 km. The MT site is characterized by sinusoidal coral mound ridges, while the MS site contains densely clustered small coral mounds. Meanwhile, mounds of the GBB region are better developed, with some individual mounds reaching up to 90 m in height. Benthic coverage of live corals also differs between sites; the GBB sites are characterized by mounds densely covered by large thickets of live corals, while small thickets of mostly dead corals dominate the MT and MS sites. Several environmental factors may explain these differences. For example, bottom current patterns change between sites. The MT and the MS sites have a unidirectional regime (southward or northward flow, respectively), whereas the GBB sites have a tidal current regime. Sedimentation patterns as depicted by sub-bottom profiles also vary between the sites; coral mounds in the GBB area appear to receive higher sediment input, which can significantly enhance mound growth rates as the reef framework baffles and traps mobile sediments. However, coral mounds that cannot keep-up with the sedimentation rate are buried. Therefore, in the high sedimentation areas of GBB, flourishing live coral mounds are limited to elevated positions (i.e. plateaus, ridges crests) where sediment accumulation

A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

Directory of Open Access Journals (Sweden)

Enrico Mick

2015-07-01

Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

Wave Induced Loading and Stability of Rubble Mound Breakwaters

DEFF Research Database (Denmark)

Hald, Tue

conducting model tests very large variability in e.g. the degree of stability is observed. This background motivated the investigations conducted in the present study. The objective was to investigate and clarify which wave parameters are important for the hydraulic stability of the armour layer on typical...... rubble mound breakwaters. Furthermore, it was intended to quantify the influence on the stability of each parameter. Focus was put on the wave induced loading on single armour stones and the relation to the stability. Based on existing literature the state of physical understanding of the processes...... and the stability were investigated. At Aalborg University model tests with an idealized model of a rubble mound breakwater were conducted and formed the basis for a detailed parametric investigation of the wave induced loading. Based on analyses of the experimental data wave-force models were derived containing...

The Effect of Reflow on Wettability of Sn 96.5 Ag 3 Cu 0.5 Solder

Directory of Open Access Journals (Sweden)

Zoltán Weltsch

2012-11-01

Full Text Available Surface conditions on Printed Circuit Board (PCB final finishes have an important impact on the wetting behaviour with lead-free solder. The improvement of wettability in liquid Sn 96.5 Ag 3 Cu 0.5 Solder alloy on PCB substrate was measured with a sessile drop method at 523 K temperature. Wetting properties was determined in normal atmospheric air and inert atmosphere. The wetting angles increasing with the number of reflows both atmosphere. The effect of the atmosphere has a huge importance of the oxidation which manifests itself of the measured wetting angles. One of the most important factors to the wetting properties is the amount of oxygen in the soldering atmosphere. Using the inert atmosphere is crucial to Pb-free solders, particularly after reflows.

Slope Stability Estimation of the Kościuszko Mound in Cracow

Science.gov (United States)

Wrana, Bogumił; Pietrzak, Natalia

2015-06-01

In the paper, the slope stability problem of the Kościuszko Mound in Cracow, Poland is considered. The slope stability analysis was performed using Plaxis FEM program. The outer surface of the mound has complex geometry. The slope of the cone is not uniform in all directions, on the surface of the cone are pedestrian paths. Due to its complicated geometry it was impossible to do computing by Plaxis input pre-procesor. The initial element mesh was generated using Autodesk Autocad 3D and next it was updated by Plaxis program. The soil parameters were adopted in accordance with the detailed geological soil testing performed in 2012. Calculating model includes geogrids. The upper part was covered by MacMat geogrid, while the lower part of the Mound was reinforced using Terramesh Matt geogrid. The slope analysis was performed by successives reduction of φ /c parameters. The total multiplayer ΣMsf is used to define the value of the soil strength parameters. The article presents the results of slope stability before and after the rainfall during 33 days of precipitation in flood of 2010.

Reliability and microstructure of lead-free solder joints in industrial electronics after accelerated thermal aging

NARCIS (Netherlands)

Scaltro, F.; Biglari, M.H.; Kodentsov, A.; Yakovleva, O.; Brom, E.

2009-01-01

The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface component/solder together with the formation of fractures. The evolution, the morphology and the elemental

Optimized design for heavy mound venturi

Directory of Open Access Journals (Sweden)

Xing Futang

2017-01-01

Full Text Available The venturi scrubber is one of the most efficient gas cleaning devices for removal of contaminating particles in industrial flue-gas purification processes. The velocity of the gas entering the scrubber is one of the key factors influencing its dust-removal efficiency. In this study, the shapes of the heavy mound and tube wall are optimized, allowing the girth area to become linearly adjustable. The resulting uniformity of velocity distribution is verified numerically.

Spatial patterns and morphology of termite (Macrotermes falciger) mounds in the upper Katanga, D.R. Congo

NARCIS (Netherlands)

Mujinya, B.B.; Adam, M.Y.O.; Mees, F.; Bogaert, J.; Vranken, I.; Erens, H.; Baert, G.; Ngongo, M.; Ranst, van E.

2014-01-01

This study examines the spatial distribution patterns and morphological characteristics of Macrotermes falciger mounds in the peri-urban zone of Lubumbashi, D.R. Congo. Spatial patterns of mounds were assessed using high-resolution satellite images for 24 plots of variable size (3 to 27 ha). Soil

Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

Science.gov (United States)

Boesenberg, Adam J.; Anderson, Iver E.; Harringa, Joel L.

2012-07-01

Of Pb-free solder choices, an array of solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic ( T eut = 217°C) composition have emerged with potential for broad use, including ball grid array (BGA) joints that cool slowly. This work investigated minor substitutional additions of Al (0.05Al), but the suppression effect faded for >0.20Al. Undercooling suppression did not correlate specifically with blade suppression since it became significant at 0.10Al and increased continuously with greater Al to 0.25Al. Surprisingly, an intermediate range of Al content (0.10 wt.% to 0.20 wt.% Al) promoted formation of significant populations of 2- μm to 5- μm faceted Cu-Al particles, identified as Cu33Al17, that clustered at the top of the solder joint matrix and exhibited extraordinary hardness. Clustering of Cu33Al17 was attributed to its buoyancy, from a lower density than Sn liquid, and its early position in the nucleation sequence within the solder matrix, permitting unrestricted migration to the top interface. Joint microstructures and implications for the full nucleation sequence for these SAC + Al solder joints are discussed, along with possible benefits from the clustered particles for improved thermal cycling resistance.

Au-Ge based Candidate Alloys for High-Temperature Lead-Free Solder Alternatives

DEFF Research Database (Denmark)

Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

2009-01-01

Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure and microhard......Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure...... was primarily strengthened by the refined (Ge) dispersed phase. The distribution of phases played a relatively more crucial role in determining the ductility of the bulk solder alloy. In the present work it was found that among the low melting point metals, the addition of Sb to the Au-Ge eutectic would...

The effect of micro alloying on the microstructure evolution of Sn-Ag-Cu lead-free solder

Science.gov (United States)

Werden, Jesse

The microelectronics industry is required to obtain alternative Pb-free soldering materials due to legal, environmental, and technological factors. As a joining material, solder provides an electrical and mechanical support in electronic assemblies and therefore, the properties of the solder are crucial to the durability and reliability of the solder joint and the function of the electronic device. One major concern with new Pb-free alternatives is that the microstructure is prone to microstructural coarsening over time which leads to inconsistent properties over the device's lifetime. Power aging the solder is a common method of stabilizing the microstructure for Pb-based alloys, however, it is unclear if this will be an appropriate solution to the microstructural coarsening of Pb-free solders. The goal of this work is to develop a better understanding of the coarsening process in new solder alloys and to suggest methods of stabilizing the solder microstructure. Microalloying is one potential solution to the microstructural coarsening problem. This experiment consists of a microstructural coarsening study of SAC305 in which each sample has been alloyed with one of three different solutes, directionally solidified at 100microm/s, and then aged at three different temperatures over a total period of 20 days. There are several important conclusions from this experiment. First, the coarsening kinetics of the intermetallics in the ternary eutectic follow the Ostwald ripening model where r3 in proprotional to t for each alloying constituent. Second, the activation energy for coarsening was found to be 68.1+/-10.3 kJ/mol for the SAC305 samples, Zn had the most significant increase in the activation energy increasing it to 88.8+/-34.9 kJ/mol for the SAC+Zn samples, Mn also increased the activation energy to 83.2+/-20.8 kJ/mol for the SAC+Mn samples, and Sb decreased the activation energy to 48.0+/-3.59 kJ/mol for the SAC+Sb samples. Finally, it was found that the

Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Energy Technology Data Exchange (ETDEWEB)

Hu, Xiaowu, E-mail: xwhmaterials@aliyun.com [School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031 (China); Li, Yulong [School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031 (China); Liu, Yi [School of Materials Science and Engineering, Nanchang University, Nanchang 330031 (China); Min, Zhixian [China Electronics Technology Group Corporation No. 38 Research Institute, Hefei 230088 (China)

2015-03-15

Highlights: • The Sn0.7Cu–xBi solder alloys were directionally solidified. • Both spacing and diameter of fibers decreased with increasing solidification rate. • The UTS and YS first increased with increased solidification rate, then decreased. • The UTS and YS of Sn0.7Cu–xBi first increased with increased Bi content. - Abstract: Bi-containing Sn0.7Cu (SC) eutectic solder alloys were prepared and subjected to directional solidification, through which new types of fiber reinforced eutectic composites were generated. The influences of Bi addition on the microstructures and tensile properties of directionally solidified (DS) Bi-containing eutectic SC lead-free solder alloys have been investigated by using differential scanning calorimetry (DSC), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and a tensile testing machine. The experimental results showed that addition of Bi could effectively reduce both the melting temperature and undercooling of SC solder alloy. The microstructures of DS SC–xBi solder alloys were composed of Sn-rich phase (β) and Cu{sub 6}Sn{sub 5} fiber. No other intermetallic compounds (IMCs) with Bi content were observed in the solder matrix for SC solder alloys with various Bi contents. Both fiber spacing and diameter all decreased gradually with increasing growth rate and/or Bi content. Besides, the regularity of Cu{sub 6}Sn{sub 5} fibers alignment also decreased with increasing growth rate, too. The tensile strengths of the SC–xBi eutectic solder alloys varied parabolically with growth rate (R). When R was 60 μm/s, maximum tensile strengths of 43.8, 55.2 and 56.37 MPa were reached for SC, SC0.7Bi and SC1.3Bi solder alloys. A comparison of tensile strength of SC, SC0.7Bi and SC1.3Bi with the same R indicated that the tensile strength increased with increasing Bi content, which was attributed to the presence of Bi and its role in refining microstructure and solid solution strengthening.

Models of formation and activity of spring mounds in the mechertate-chrita-sidi el hani system, eastern Tunisia: implications for the habitability of Mars.

Science.gov (United States)

Essefi, Elhoucine; Komatsu, Goro; Fairén, Alberto G; Chan, Marjorie A; Yaich, Chokri

2014-08-28

Spring mounds on Earth and on Mars could represent optimal niches of life development. If life ever occurred on Mars, ancient spring deposits would be excellent localities to search for morphological or chemical remnants of an ancient biosphere. In this work, we investigate models of formation and activity of well-exposed spring mounds in the Mechertate-Chrita-Sidi El Hani (MCSH) system, eastern Tunisia. We then use these models to explore possible spring mound formation on Mars. In the MCSH system, the genesis of the spring mounds is a direct consequence of groundwater upwelling, triggered by tectonics and/or hydraulics. As they are oriented preferentially along faults, they can be considered as fault spring mounds, implying a tectonic influence in their formation process. However, the hydraulic pressure generated by the convergence of aquifers towards the surface of the system also allows consideration of an origin as artesian spring mounds. In the case of the MCSH system, our geologic data presented here show that both models are valid, and we propose a combined hydro-tectonic model as the likely formation mechanism of artesian-fault spring mounds. During their evolution from the embryonic (early) to the islet ("island") stages, spring mounds are also shaped by eolian accumulations and induration processes. Similarly, spring mounds have been suggested to be relatively common in certain provinces on the Martian surface, but their mode of formation is still a matter of debate. We propose that the tectonic, hydraulic, and combined hydro-tectonic models describing the spring mounds at MCSH could be relevant as Martian analogs because: (i) the Martian subsurface may be over pressured, potentially expelling mineral-enriched waters as spring mounds on the surface; (ii) the Martian subsurface may be fractured, causing alignment of the spring mounds in preferential orientations; and (iii) indurated eolian sedimentation and erosional remnants are common features on Mars

Models of Formation and Activity of Spring Mounds in the Mechertate-Chrita-Sidi El Hani System, Eastern Tunisia: Implications for the Habitability of Mars

Directory of Open Access Journals (Sweden)

Elhoucine Essefi

2014-08-01

Full Text Available Spring mounds on Earth and on Mars could represent optimal niches of life development. If life ever occurred on Mars, ancient spring deposits would be excellent localities to search for morphological or chemical remnants of an ancient biosphere. In this work, we investigate models of formation and activity of well-exposed spring mounds in the Mechertate-Chrita-Sidi El Hani (MCSH system, eastern Tunisia. We then use these models to explore possible spring mound formation on Mars. In the MCSH system, the genesis of the spring mounds is a direct consequence of groundwater upwelling, triggered by tectonics and/or hydraulics. As they are oriented preferentially along faults, they can be considered as fault spring mounds, implying a tectonic influence in their formation process. However, the hydraulic pressure generated by the convergence of aquifers towards the surface of the system also allows consideration of an origin as artesian spring mounds. In the case of the MCSH system, our geologic data presented here show that both models are valid, and we propose a combined hydro-tectonic model as the likely formation mechanism of artesian-fault spring mounds. During their evolution from the embryonic (early to the islet (“island” stages, spring mounds are also shaped by eolian accumulations and induration processes. Similarly, spring mounds have been suggested to be relatively common in certain provinces on the Martian surface, but their mode of formation is still a matter of debate. We propose that the tectonic, hydraulic, and combined hydro-tectonic models describing the spring mounds at MCSH could be relevant as Martian analogs because: (i the Martian subsurface may be over pressured, potentially expelling mineral-enriched waters as spring mounds on the surface; (ii the Martian subsurface may be fractured, causing alignment of the spring mounds in preferential orientations; and (iii indurated eolian sedimentation and erosional remnants are common

Effects of Erosion from Mounds of Different Termite Genera on Distinct Functional Grassland Types in an African Savannah.

Science.gov (United States)

Gosling, Cleo M; Cromsigt, Joris P G M; Mpanza, Nokukhanya; Olff, Han

A key aspect of savannah vegetation heterogeneity is mosaics formed by two functional grassland types, bunch grasslands, and grazing lawns. We investigated the role of termites, important ecosystem engineers, in creating high-nutrient patches in the form of grazing lawns. Some of the ways termites can contribute to grazing lawn development is through erosion of soil from aboveground mounds to the surrounding soil surface. This may alter the nutrient status of the surrounding soils. We hypothesize that the importance of this erosion varies with termite genera, depending on feeding strategy and mound type. To test this, we simulated erosion by applying mound soil from three termite genera ( Macrotermes , Odontotermes , and Trinervitermes ) in both a field experiment and a greenhouse experiment. In the greenhouse experiment, we found soils with the highest macro nutrient levels (formed by Trinervitermes ) promoted the quality and biomass of both a lawn ( Digitaria longiflora ) and a bunch ( Sporobolus pyramidalis ) grass species. In the field we found that soils with the highest micro nutrient levels (formed by Macrotermes ) showed the largest increase in cover of grazing lawn species. By linking the different nutrient availability of the mounds to the development of different grassland states, we conclude that the presence of termite mounds influences grassland mosaics, but that the type of mound plays a crucial role in determining the nature of the effects.

Laser Soldering and Thermal Cycling Tests of Monolithic Silicon Pixel Chips

CERN Document Server

Strand, Frode Sneve

2015-01-01

An ALPIDE-1 monolithic silicon pixel sensor prototype has been laser soldered to a flex printed circuit using a novel interconnection technique using lasers. This technique is to be optimised to ensure stable, good quality connections between the sensor chips and the FPCs. To test the long-term stability of the connections, as well as study the effects on hit thresholds and noise in the sensor, it was thermally cycled in a climate chamber 1200 times. The soldered connections showed good qualities like even melting and good adhesion on pad/flex surfaces, and the chip remained in working condition for 1080 cycles. After this, a few connections failed, having cracks in the soldering tin, rendering the chip unusable. Threshold and noise characteristics seemed stable, except for the noise levels of sector 2 in the chip, for 1000 cycles in a temperature interval of "10^{\\circ}" and "50^{\\circ}" C. Still, further testing with wider temperature ranges and more cycles is needed to test the limitations of the chi...

The long term sustainability of Mound Springs in South Australia : implications for olympic dam

International Nuclear Information System (INIS)

Mudd, G.M.

1998-01-01

The Mound Springs of South Australia are unique groundwater discharge features of the Great Artesian Basin, a deep regigonal groundwater system that covers over one-fifth of the Australia continent. They are the principal sources of water in the arid and semi-arid inland heart of Australia, and have great ecological, scientific, anthropological and economic significance. Excessive development of the Great Artesian Basin over the past century by European activity has seen an overall decline in the flows from the mound springs, and recent development of the water supply borefields for the WMC Olympic Dam Operations copper-uranium mine in the midst of the most important spring groups has exacerbated this problem. A review of the history of the borefields, an analysis of the impacts on the mound springs, and future recommendations for protection of the springs is presented. (orig.)

Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

International Nuclear Information System (INIS)

Yang, Ming; Ko, Yong-Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Li, Mingyu

2017-01-01

Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

Energy Technology Data Exchange (ETDEWEB)

Yang, Ming [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Ko, Yong-Ho [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Bang, Junghwan [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Kim, Taek-Soo [Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Lee, Chang-Woo, E-mail: cwlee@kitech.re.kr [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Li, Mingyu, E-mail: myli@hit.edu.cn [Shenzhen Key Laboratory of Advanced Materials, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055 (China)

2017-02-15

Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

Scalable Manufacturing of Solderable and Stretchable Physiologic Sensing Systems.

Science.gov (United States)

Kim, Yun-Soung; Lu, Jesse; Shih, Benjamin; Gharibans, Armen; Zou, Zhanan; Matsuno, Kristen; Aguilera, Roman; Han, Yoonjae; Meek, Ann; Xiao, Jianliang; Tolley, Michael T; Coleman, Todd P

2017-10-01

Methods for microfabrication of solderable and stretchable sensing systems (S4s) and a scaled production of adhesive-integrated active S4s for health monitoring are presented. S4s' excellent solderability is achieved by the sputter-deposited nickel-vanadium and gold pad metal layers and copper interconnection. The donor substrate, which is modified with "PI islands" to become selectively adhesive for the S4s, allows the heterogeneous devices to be integrated with large-area adhesives for packaging. The feasibility for S4-based health monitoring is demonstrated by developing an S4 integrated with a strain gauge and an onboard optical indication circuit. Owing to S4s' compatibility with the standard printed circuit board assembly processes, a variety of commercially available surface mount chip components, such as the wafer level chip scale packages, chip resistors, and light-emitting diodes, can be reflow-soldered onto S4s without modifications, demonstrating the versatile and modular nature of S4s. Tegaderm-integrated S4 respiration sensors are tested for robustness for cyclic deformation, maximum stretchability, durability, and biocompatibility for multiday wear time. The results of the tests and demonstration of the respiration sensing indicate that the adhesive-integrated S4s can provide end users a way for unobtrusive health monitoring. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Multi-layer SiC ceramics/Mo joints brazed using high-temperature solders

International Nuclear Information System (INIS)

Olesinska, W.; Kesik, J.

2003-01-01

The paper presents the results of studies on joining SiC ceramics with molybdenum, with the ceramic surface being activated by titanium, chromium or copper. Titanium or chromium were deposited by the sputtering technique, and copper - by the electro-chemical method. The microstructures of the SiC/Mo joints brazed with the CuMn13Ni3 solder and copper in a nitrogen atmosphere were examined and the results discussed. The joints, in which the ceramic surface was activated in addition with chromium, do not contain mechanical defects caused by the joining process, and the ceramic surface is covered with a continuous layer of the solder. A phase analysis of the interface surface identified an MeSiC phase. The mechanical strength of the joints in which the ceramic surface was modified by the Ti, Cr and Cu layers was markedly greater than that of the joints brazed directly to the uncoated ceramics with the use of active solders. (author)

Measuring damage in physical model tests of rubble mounds

NARCIS (Netherlands)

Hofland, B.; Rosa-Santos, Paulo; Taveira-Pinto, Francisco; Lemos, Rute; Mendonça, A.; Juana Fortes, C

2017-01-01

This paper studies novel ways to evaluate armour damage in physical models of coastal structures. High-resolution damage data for reference rubble mound breakwaters obtained under the HYDRALAB+ joint-research project are analysed and discussed. These tests are used to analyse the way to describe

The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

Science.gov (United States)

Jang, Guh-Yaw; Duh, Jenq-Gong

2005-01-01

The eutectic Sn-Ag solder alloy is one of the candidates for the Pb-free solder, and Sn-Pb solder alloys are still widely used in today’s electronic packages. In this tudy, the interfacial reaction in the eutectic Sn-Ag and Sn-Pb solder joints was investigated with an assembly of a solder/Ni/Cu/Ti/Si3N4/Si multilayer structures. In the Sn-3.5Ag solder joints reflowed at 260°C, only the (Ni1-x,Cux)3Sn4 intermetallic compound (IMC) formed at the solder/Ni interface. For the Sn-37Pb solder reflowed at 225°C for one to ten cycles, only the (Ni1-x,Cux)3Sn4 IMC formed between the solder and the Ni/Cu under-bump metallization (UBM). Nevertheless, the (Cu1-y,Niy)6Sn5 IMC was observed in joints reflowed at 245°C after five cycles and at 265°C after three cycles. With the aid of microstructure evolution, quantitative analysis, and elemental distribution between the solder and Ni/Cu UBM, it was revealed that Cu content in the solder near the solder/IMC interface played an important role in the formation of the (Cu1-y,Niy)6Sn5 IMC. In addition, the diffusion behavior of Cu in eutectic Sn-Ag and Sn-Pb solders with the Ni/Cu UBM were probed and discussed. The atomic flux of Cu diffused through Ni was evaluated by detailed quantitative analysis in an electron probe microanalyzer (EPMA). During reflow, the atomic flux of Cu was on the order of 1016-1017 atoms/cm2sec in both the eutectic Sn-Ag and Sn-Pb systems.

Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates

Directory of Open Access Journals (Sweden)

Soares D.

2007-01-01

Full Text Available Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the solder/substrate interaction and the nature of the layers formed at the interface. The solder/substrate reactions, for Sn-Zn and Sn-Cu base solder alloys, were evaluated in what concerns the morphology and chemical composition of the interface layers. The effect of the addition of P, at low levels, on the chemical composition of the layers present at the interface was studied. The phases formed at the interface between the Cu or Ni substrate and a molten lead-free solder at 250ºC, were studied for different stage times and alloy compositions. The melting temperatures, of the studied alloys, were determined by Differential Scanning Calorimetry (DSC. Identification of equilibrium phases formed at the interface layer, and the evaluation of their chemical composition were performed by Scanning Electron Microscopy (SEM/EDS. Different interface characteristics were obtained, namely for the alloys containing Zn. The obtained IML layer thickness was compared, for both types of alloy systems.

Development of Pb-Free Nanocomposite Solder Alloys

Directory of Open Access Journals (Sweden)

Animesh K. Basak

2018-04-01

Full Text Available As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs during aging/reflow. Accordingly, this study examines the improvement of properties of SAC alloys by incorporating nanoparticles in it. Two different types of nanoparticles were added in monolithic SAC alloy: (1 Al2O3 or (2 Fe and their effect on microstructure and thermal properties were investigated. Addition of Fe nanoparticles leads to the formation of FeSn2 IMCs alongside Ag3Sn and Cu6Sn5 from monolithic SAC alloy. Addition of Al2O3 nano-particles do not contribute to phase formation, however, remains dispersed along primary β-Sn grain boundaries and act as a grain refiner. As the addition of either Fe or Al2O3 nano-particles do not make any significant effect on thermal behavior, these reinforced nanocomposites are foreseen to provide better mechanical characteristics with respect to conventional monolithic SAC solder alloys.

A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications

DEFF Research Database (Denmark)

Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

2009-01-01

An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing the equilib......An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing...

Origin and Formation of Giant Mounds in Lake Ladoga (Russia) from High-Resolution Seismic Reflection Data

Science.gov (United States)

Gromig, R.; Lebas, E.; Krastel, S.; Averes, T.; Wagner, B.; Melles, M.; Fedorov, G.

2017-12-01

In the framework of the German-Russian project `PLOT - Paleolimnological Transect' (for an overview of the project see Gromig et al., this meeting), a pilot seismic survey was carried out in Lake Ladoga (Russia) in late summer 2013. In total, 1500 km of seismic reflection profiles have been acquired using a mini-GI gun and a 32-channel seismic streamer. The high-resolution of the seismic data allows us to document in detail the sedimentary processes that occurred in the lake during the preglacial and postglacial history. The seismic stratigraphic architecture of the lake shows, from top to bottom, acoustically well-stratified Holocene muds overlaying rather transparent postglacial varves. These sediment successions are usually bordered by a hard reflector underneath, which may represent coarse-grained sediments or a till. The nature of the material composing the uppermost units have been tied to coring information from core Co1309, which was retrieved during the same survey. Of particular interest, are the single to composite, giant (kilometer-scale) mounds directly overlying the hard reflector. Internal architecture of the mounds reveals a complex formation history, with mound types showing significant structural deformation of different degrees; and other mound types showing a central deformation area, which strongly contrasts with the titled reflections or undisturbed stratification visible at the edges. The deepest seismic unit underlying the mounds is characterized by well-bedded, tilted reflectors in the southeastern part of the lake, while clear synclines are identified in the northwestern part of the lake. An erosional truncation separates the deepest unit from the overlying ones. In the work presented here, we focus on the understanding of the origin and the formation of the giant mounds with respect to the glacial history of Lake Ladoga.

Microstructural effects on constitutive and fatigue fracture behavior of TinSilverCopper solder

Science.gov (United States)

Tucker, Jonathon P.

As microelectronic package construction becomes more diverse and complex, the need for accurate, geometry-independent material constitutive and failure models increases. Evaluations of packages based on accelerated environmental tests (such as accelerated thermal cycling or power cycling) only provide package-dependent reliability information. In addition, extrapolations of such test data to life predictions under field conditions are often empirical. Besides geometry, accelerated environmental test data must account for microstructural factors such as alloy composition or isothermal aging condition, resulting in expensive experimental variation. In this work, displacement-controlled, creep, and fatigue lap shear tests are conducted on specially designed SnAgCu test specimens with microstructures representative to those found in commercial microelectronic packages. The data are used to develop constitutive and fatigue fracture material models capable of describing deformation and fracture behavior for the relevant temperature and strain rate ranges. Furthermore, insight is provided into the microstructural variation of solder joints and the subsequent effect on material behavior. These models are appropriate for application to packages of any geometrical construction. The first focus of the thesis is on Pb-mixed SnAgCu solder alloys. During the transition from Pb-containing solders to Pb-free solders, joints composed of a mixture of SnPb and SnAgCu often result from either mixed assemblies or rework. Three alloys of 1, 5 and 20 weight percent Pb were selected so as to represent reasonable ranges of Pb contamination expected from different 63Sn37Pb components mixed with Sn3.0Ag0.5Cu. Displacement-controlled (constant strain rate) and creep tests were performed at temperatures of 25°C, 75°C, and 125°C using a double lap shear test setup that ensures a nearly homogeneous state of plastic strain at the joint interface. Rate-dependent constitutive models for Pb

Elimination of field colonies of a mound-building termite Globitermes sulphureus (Isoptera: Termitidae) by bistrifluron bait.

Science.gov (United States)

Neoh, Kok-Boon; Jalaludin, Nur Atiqah; Lee, Chow-Yang

2011-04-01

The efficacy of Xterm, which contains 1% bistrifluron, in the form of cellulose bait pellets was evaluated for its efficacy in eradicating field colonies of the mound-building termite Globitermes sulphureus (Haviland) (Isoptera: Termitidae). The termite mounds were dissected at the end of the experiment to determine whether the colonies were eliminated. By approximately 2 mo postbaiting, the body of termite workers appeared marble white, and mites were present on the body. The soldier-worker ratio increased drastically in the colonies, and the wall surface of the mounds started to erode. Colony elimination required at least a 4-mo baiting period. Mound dissection revealed wet carton materials (food store) that were greatly consumed and overgrown by fast-growing fungi. Decaying cadavers were scattered all over the nests. On average, 84.1 +/- 16.4 g of bait matrix (68.9 +/- 13.4%, an equivalent of 841 +/- 164 mg of bistrifluron) was consumed in each colony. Moreover, we found that a mere 143 mg of bistrifluron was sufficient to eliminate a colony of C. sulphureus.

Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack

Directory of Open Access Journals (Sweden)

Shoudong Gu

2016-06-01

Full Text Available To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT (Surface Mount Technology production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process. Here, the critical jet ejection velocity is discussed through theoretical analysis. The relations between ejection velocity and needle structure, needle velocity, and nozzle diameter were obtained by FLUENT software. Then, the prototype of the solder paste jetting system was fabricated, and the performance was verified by experiments. The effects of the gap between nozzle and needle, the driving voltage, and the nozzle diameter on the jetting performance and droplet diameter were obtained. Solder paste droplets 0.85 mm in diameter were produced when the gap between the nozzle and needle was adjusted to 10 μm, the driving voltage to 80 V, the nozzle diameter to 0.1 mm, and the variation of the droplet diameter was within ±3%.

Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

DEFF Research Database (Denmark)

Conseil, Helene; Verdingovas, Vadimas; Jellesen, Morten Stendahl

2016-01-01

No-clean flux systems are used today for the soldering of electronic printed circuit board assemblies assuming that all the aggressive substances of the flux will vanish during the soldering process i.e. evaporate, decompose or being enclosed safely in the residues. However this is not true in most...... that the fluxes do not decompose fully within the temperature regime of the soldering process, leaving behind significant level of weak organic acid residues. The residue depending on the type and amount can be can be very aggressive towards the corrosion on the printed circuit board assemblies. The glutaric acid...

Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

Science.gov (United States)

Yoon, Jeong-Won; Noh, Bo-In; Jung, Seung-Boo

2011-09-01

Interfacial reactions and joint reliability of Sn-3.0Ag-0.5Cu solder with two different surface finishes, electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG), were evaluated during a reflow process. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn-Ag-Cu/ENIG joint exhibited a higher intermetallic compound (IMC) growth rate and a higher consumption rate of the Ni(P) layer than the Sn-Ag-Cu/ENEPIG joint. The presence of the Pd layer in the ENEPIG suppressed the growth of the interfacial IMC layer and the consumption of the Ni(P) layer, resulting in the superior interfacial stability of the solder joint. The shear test results show that the ENIG joint fractured along the interface, exhibiting indications of brittle failure possibly due to the brittle IMC layer. In contrast, the failure of the ENEPIG joint only went through the bulk solder, supporting the idea that the interface is mechanically reliable. The results from this study confirm that the Sn-Ag-Cu/ENEPIG solder joint is mechanically robust and, thus, the combination is a viable option for a Pb-free package system.

Lutz's spontaneous sedimentation technique and the paleoparasitological analysis of sambaqui (shell mound sediments

Directory of Open Access Journals (Sweden)

Morgana Camacho

2013-04-01

Full Text Available Parasite findings in sambaquis (shell mounds are scarce. Although the 121 shell mound samples were previously analysed in our laboratory, we only recently obtained the first positive results. In the sambaqui of Guapi, Rio de Janeiro, Brazil, paleoparasitological analysis was performed on sediment samples collected from various archaeological layers, including the superficial layer as a control. Eggs of Acanthocephala, Ascaridoidea and Heterakoidea were found in the archaeological layers. We applied various techniques and concluded that Lutz's spontaneous sedimentation technique is effective for concentrating parasite eggs in sambaqui soil for microscopic analysis.

Lutz's spontaneous sedimentation technique and the paleoparasitological analysis of sambaqui (shell mound) sediments

Science.gov (United States)

Camacho, Morgana; Pessanha, Thaíla; Leles, Daniela; Dutra, Juliana MF; Silva, Rosângela; de Souza, Sheila Mendonça; Araujo, Adauto

2013-01-01

Parasite findings in sambaquis (shell mounds) are scarce. Although the 121 shell mound samples were previously analysed in our laboratory, we only recently obtained the first positive results. In the sambaqui of Guapi, Rio de Janeiro, Brazil, paleoparasitological analysis was performed on sediment samples collected from various archaeological layers, including the superficial layer as a control. Eggs of Acanthocephala, Ascaridoidea and Heterakoidea were found in the archaeological layers. We applied various techniques and concluded that Lutz's spontaneous sedimentation technique is effective for concentrating parasite eggs in sambaqui soil for microscopic analysis. PMID:23579793

Nutritional and Microbial Parameters of Earthworm Cast, Termite Mound and Surrounding Bulk Soil

OpenAIRE

Kawaguchi, Sadao; Nishi, Shingo

2007-01-01

A comparative analysis of nutritional and microbial parameters was conducted on two types of biogenetic structures of earthworm cast (8.7 cm in height, 7 casts/1m×1m) formed by litter eating Pheretima sp., and mound (64 cm in height, 1.0 mounds/10m×50m) built by fungus growing termite, Macrotermes gilvus, and compared to the surrounding bulk soil as control in the tropical monsoon forest in Cu Chi National Park of Viet Nam. The proportion of the sand in the earthworm cast was higher than in t...

In-vitro Investigations of Skin Closure using Diode Laser and Protein Solder Containing Gold Nanoshells

Directory of Open Access Journals (Sweden)

Mohammad Sadegh Nourbakhsh

2010-12-01

Full Text Available Introduction: Laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. To overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nanoshells, a new class of nanoparticles consisting of a dielectric core surrounded by a thin metal shell, are used. The aims of this study were to use two different concentrations of gold nanoshells as the exogenous material for skin tissue soldering and also to examine the effects of laser soldering parameters on the properties of the repaired skin. Material and Methods: Two mixtures of albumin solder and different concentrations of gold nanoshells were prepared. A full thickness incision of 2×20 mm2 was made on the surface and after placing 50 μl of the solder mixture on the incision, an 810 nm diode laser was used to irradiate it at different power densities. The changes of tensile strength, σt, due to temperature rise, number of scan (Ns, and scan velocity (Vs were investigated. Results: The results showed that the tensile strength of the repaired skin increased with increasing irradiance for both gold nanoshell concentrations. In addition, at constant laser irradiance (I, the tensile strength of the repaired incision increased with increasing Ns and decreasing Vs. In our case, this corresponded to st = 1610 g/cm2 at I ~ 60 Wcm-2, T ~ 65ºC, Ns = 10 and Vs = 0.2 mms-1. Discussion and Conclusion: Gold nanoshells can be used as an indocyanine green dye (ICG alterative for laser tissue soldering.  Although by increasing the laser power density, the tensile strength of the repaired skin increases, an optimum power density must be considered due to the resulting increase in tissue temperature.

Giant polygons and mounds in the lowlands of Mars: signatures of an ancient ocean?

Science.gov (United States)

Oehler, Dorothy Z; Allen, Carlton C

2012-06-01

This paper presents the hypothesis that the well-known giant polygons and bright mounds of the martian lowlands may be related to a common process-a process of fluid expulsion that results from burial of fine-grained sediments beneath a body of water. Specifically, we hypothesize that giant polygons and mounds in Chryse and Acidalia Planitiae are analogous to kilometer-scale polygons and mud volcanoes in terrestrial, marine basins and that the co-occurrence of masses of these features in Chryse and Acidalia may be the signature of sedimentary processes in an ancient martian ocean. We base this hypothesis on recent data from both Earth and Mars. On Earth, 3-D seismic data illustrate kilometer-scale polygons that may be analogous to the giant polygons on Mars. The terrestrial polygons form in fine-grained sediments that have been deposited and buried in passive-margin, marine settings. These polygons are thought to result from compaction/dewatering, and they are commonly associated with fluid expulsion features, such as mud volcanoes. On Mars, in Chryse and Acidalia Planitiae, orbital data demonstrate that giant polygons and mounds have overlapping spatial distributions. There, each set of features occurs within a geological setting that is seemingly analogous to that of the terrestrial, kilometer-scale polygons (broad basin of deposition, predicted fine-grained sediments, and lack of significant horizontal stress). Regionally, the martian polygons and mounds both show a correlation to elevation, as if their formation were related to past water levels. Although these observations are based on older data with incomplete coverage, a similar correlation to elevation has been established in one local area studied in detail with newer higher-resolution data. Further mapping with the latest data sets should more clearly elucidate the relationship(s) of the polygons and mounds to elevation over the entire Chryse-Acidalia region and thereby provide more insight into this

The giant cold-water coral mound as a nested microbial/metazoan system: physical, chemical, biological and geological picture (ESF EuroDiversity MiCROSYSTEMS)

Science.gov (United States)

Henriet, J. P.; Microsystems Team

2009-04-01

The MiCROSYSTEMS project under the ESF EUROCORES EuroDiversity scheme is a holistic and multi-scale approach in studying microbial diversity and functionality in a nested microbial/metazoan system, which thrives in deep waters: the giant cold-water coral mound. Studies on prolific cold-water coral sites have been carried out from the canyons of the Bay of Biscay to the fjords of the Norwegian margin, while the Pen Duick carbonate mound province off Morocco developed into a joint natural lab for studying in particular the impact of biogeochemical and microbial processes on modern sedimentary diagenesis within the reef sediments, in complement to the studies on I0DP Exp. 307 cores (Challenger Mound, off Ireland). Major outcomes of this research can be summarized as follows. • IODP Exp. 307 on Challenger Mound had revealed a significant prokaryotic community both within and beneath the carbonate mound. MiCROSYSTEMS unveils a remarkable degree of compartmentalization in such community from the seawater, the coral skeleton surface and mucus to the reef sediments. The occurrence of such multiple and distinct microbial compartments associated with cold-water coral ecosystems promotes opportunities for microbial diversity in the deep ocean. • New cases of co-habitation of cold-water corals and giant deep-water oysters were discovered in the Bay of Biscay, which add a new facet of macrofaunal diversity to cold-water coral reef systems. • The discovery of giant, ancient coral graveyards on the Moroccan mounds not only fuels the debate about natural versus anthropogenic mass extinction, but these open frameworks simultaneously invite for the study of bio-erosion and early diagenesis, in particular organo-mineralization, and of the possible role and significance of these thick, solid rubble patches in 3D mound-building and consolidation. • The assessment of the carbonate budget of a modern cold-water coral mound (Challenger Mound) reveals that only 33 to 40 wt % of

Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints

Science.gov (United States)

Huang, Z.; Kumar, P.; Dutta, I.; Sidhu, R.; Renavikar, M.; Mahajan, R.

2014-01-01

A fracture mechanism map (FMM) is a powerful tool which correlates the fracture behavior of a material to its microstructural characteristics in an explicit and convenient way. In the FMM for solder joints, an effective thickness of the interfacial intermetallic compound (IMC) layer ( t eff) and the solder yield strength ( σ ys,eff) are used as abscissa and ordinate axes, respectively, as these two predominantly affect the fracture behavior of solder joints. Earlier, a definition of t eff, based on the uniform thickness of IMC ( t u) and the average height of the IMC scallops ( t s), was proposed and shown to aptly explain the fracture behavior of solder joints on Cu. This paper presents a more general definition of t eff that is more widely applicable to a range of metallizations, including Cu and electroless nickel immersion gold (ENIG). Using this new definition of t eff, mode I FMM for SAC387/Cu joints has been updated and its validity was confirmed. A preliminary FMM for SAC387/Cu joints with ENIG metallization is also presented.

THE POSSIBILITY OF USING LASER-ULTRASOUND TO MONITOR THE QUALITY SOLDERED CONNECTIONS CHAMBERS OF LIQUID ROCKET ENGINES

Directory of Open Access Journals (Sweden)

N. V. Astredinova

2014-01-01

Full Text Available During the manufacturing process to the design of modern liquid rocket engines are presented important requirements, such as minimum weight, maximum stiffness and strength of nodes, maximum service life in operation, high reliability and quality of soldered and welded seams. Due to the high quality requirements soldered connections and the specific design of the nozzle, it became necessary in the development and testing of a new non-conventional non-destructive testing method – laser-ultrasound diagnosis. In accordance with regulatory guidelines, quality control soldered connections is allowed to use an acoustic kind of control methods of the reflected light, transmitted light, resonant, free vibration and acoustic emission. Attempts to use traditional methods of non-destructive testing did not lead to positive results. This is due primarily to the size of typical solder joint defects, as well as the structural features of the rocket engine, the data structure is not controllable. In connection with this, a new method that provides quality control soldered connections cameras LRE based on the thermo generation of ultrasound. Methods of ultrasonic flaw detection of photoacoustic effect, in most cases, have a number of advantages over methods that use standard (traditional piezo transducers. In the course of studies have found that the sensitivity of the laser-ultrasonic method and flaw detector UDL-2M can detect lack of adhesion in the solder joints on the upper edges of the nozzle in the sub-header area of the site.

Bryan Mound InSAR Analysis U.S. Strategic petroleum Reserve.

Energy Technology Data Exchange (ETDEWEB)

Lord, Anna C. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

2017-06-01

The U.S. Strategic Petroleum Reserve (SPR) is a stockpile of emergency crude oil to be tapped into if a disruption in the nation's oil supply occurs. The SPR is comprised of four salt dome sites. Subsidence surveys have been conducted either annually or biennially at all four sites over the life of the program. Monitoring of surface behavior is a first line defense to detecting possible subsurface cavern integrity issues. Over the life of the Bryan Mound site, subsidence rates over abandoned Cavern 3 have continuously been the highest at the site. In an effort to try and understand the subsurface dynamics, specifically over Bryan Mound Cavern 3, historic interferometric synthetic aperture radar (InSAR) data was acquired and processed by TRE Altamira. InSAR involves the processing of multiple satellite synthetic aperture radar scenes acquired across the same location of the Earth's surface at different times to map surface deformation. The analysis of the data has the ability to detect millimeters of motion spanning days, months, year and decades, across specific sites. The intent in regards to the Bryan Mound site was (1) to confirm the higher subsidence rates recorded over abandoned Cavern 3 indicated by land survey and (2) understand the regional surface behavior. This report describes the InSAR analysis results, how those results compare to the historical collection of land survey data, and what additional information the data has provided towards understanding the response recorded at the surface.

Hypospadias repair using laser tissue soldering (LTS): preliminary results of a prospective randomized study

Science.gov (United States)

Kirsch, Andrew J.; Cooper, Christopher S.; Canning, Douglas A.; Snyder, Howard M., III; Zderic, Stephen A.

1998-07-01

Purpose: The purpose of this study was to evaluate laser tissue soldering using an 808 nm diode laser and wavelength- matched human albumin solder for urethral surgery in children. Methods: Currently, 30 boys, ages 3 months to 8 years were randomized to standard suturing (n equals 22) or 'sutureless' laser hypospadias repair (n equals 18). Laser soldering was performed with a human albumin solder doped with indocyanine green dye (2.5 mg/ml) using a laser power output of 0.5 W, pulse duration of 0.5 sec, and interval of 0.1 sec. Power density was approximately 16 W/cm2. In the laser group, sutures were used for tissue alignment only. At the time of surgery, neourethral and penile lengths, operative time for urethral repair, and number of sutures/throws were measured. Postoperatively, patients were examined for complications of wound healing, stricture, or fistula formation. Results: Mean age, severity of urethral defect, type of repair, and neourethra length were equivalent between the two groups. Operative time was significantly faster for laser soldering in both simple (1.6 plus or minus 0.21 min, p less than 0.001) and complex (5.4 plus or minus 0.28 min, p less than 0.0001) hypospadias repairs compared to controls (10.6 plus or minus 1.4 min and 27.8 plus or minus 2.9 min, respectively). The mean number of sutures used in the laser group for simple and complex repairs (3.3 plus or minus 0.3 and 8.1 plus or minus 0.64, respectively) were significantly (p less than 0.0001) less than for controls (8.2 plus or minus 0.84 and 20 plus or minus 2.3, respectively). Followup was between 3 months and 14 months. The overall complication rate in the laser group (11%) was lower than the controls (23%). However, statistical significance (p less than 0.05) was achieved only for the subgroup of patients undergoing simple repairs (LTS, 100% success versus suturing, 69% success). Conclusions: These preliminary results indicate that laser tissue soldering for hypospadias repair

Ft-Ir Spectroscopic Analysis of Potsherds Excavated from the First Settlement Layer of Kuriki Mound, Turkey

Science.gov (United States)

Bayazit, Murat; Isik, Iskender; Cereci, Sedat; Issi, Ali; Genc, Elif

The region covering Southeastern Anatolia takes place in upper Mesopotamia, so it has numerous cultural heritages due to its witness to various social movements of different civilizations in ancient times. Kuruki Mound is located on the junction point of Tigris River and Batman Creek, near Oymatas village which is almost 15 km to Batman, Turkey. The mound is dated back to Late Chalcolithic. Archaeological excavations are carried out on two hills named as “Kuriki Mound-1” and “Kuriki Mound-2” in which 4-layer and 2-layer settlements have been revealed, respectively. This region will be left under the water by the reservoir lake of Ilısu Dam when its construction is completed. Thus, characterization of ancient materials such as potsherds, metals and skeleton ruins should be rapidly done. In this study, 12 potsherds excavated from Layer-1 (the first settlement layer after the surface) in Kuriki Mound-2 were investigated by FT-IR spectrometry. Energy dispersive X-ray fluorescence (EDXRF) and X-ray diffraction (XRD) analyses were used as complementary techniques in order to expose chemical and mineralogical/phase contents, respectively. Obtained results showed that the potteries have been produced with calcareous clays and they include moderate amounts of MgO, K2O, Na2O and Fe2O3 in this context. Additionally, high temperature phases have also been detected with XRD analyses in some samples.

Stability of termite mound populations in a variable environment ...

African Journals Online (AJOL)

Of all the climatic variables in the environment of termites in southern Kenya, only rainfall shows marked seasonality and unpredictability. But despite the great variability in rainfall patterns, the populations of termite mounds of various species in three well-separated study areas remained remarkably constant over a period ...

Mathematical Model for Prediction of Flexural Strength of Mound ...

African Journals Online (AJOL)

The mound soil-cement blended proportions were mathematically optimized by using scheffe's approach and the optimization model developed. A computer program predicting the mix proportion for the model was written. The optimal proportion by the program was used prepare beam samples measuring 150mm x 150mm ...

A Preliminary Study on Elimination of Colonies of the Mound Building Termite Macrotermes gilvus (Hagen) Using a Chlorfluazuron Termite Bait in the Philippines

OpenAIRE

Partho Dhang

2011-01-01

The effectiveness of a chlorfluazuron termite bait in eliminating colonies of the termite species Macrotermes gilvus (Hagen) was evaluated under field conditions. Three active termite mounds were chosen for this study, two acted as test mounds and the other as the control. Four In-Ground Stations (IGS) were installed around each mound. Interception occurred almost immediately in all the stations, which were subsequently baited. The control mound was fed a bait matrix lacking the active ingred...

Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

International Nuclear Information System (INIS)

Liu, Chih-Yao; Hon, Min-Hsiung; Wang, Moo-Chin; Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long

2014-01-01

Highlights: • The microstructure of these solder alloys are composed of Sn-rich phase and Ag 3 Sn. • The grain size of Sn–9Zn–1.5Ag–xBi solder alloys increases with rose aging time. • The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloys. • TEM observed that Bi appears as oblong shape fine particles. -- Abstract: The effects of aging time on the mechanical properties of the Sn–9Zn–1.5Ag–xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn–9Zn–1.5Ag–xBi solder alloys is composed of Sn-rich phase and AgZn 3 . No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn–9Zn–1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloy before aging

Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

Energy Technology Data Exchange (ETDEWEB)

Liu, Chih-Yao [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Hon, Min-Hsiung [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, 415 Chien-Kung Road, Kaohsiung 80782, Taiwan (China); Wang, Moo-Chin, E-mail: mcwang@kmu.edu.tw [Department of Fragrance and Cosmetic Science, Kaohsiung Medical University, 100, Shih-Chuan 1st Road, Kaohsiung 80728, Taiwan (China); Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long [Institute of Nanotechnology and Microsystems Engineering, National Cheng Kung University, No. 1, University Road, Tainan 70101, Taiwan (China)

2014-01-05

Highlights: • The microstructure of these solder alloys are composed of Sn-rich phase and Ag{sub 3}Sn. • The grain size of Sn–9Zn–1.5Ag–xBi solder alloys increases with rose aging time. • The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloys. • TEM observed that Bi appears as oblong shape fine particles. -- Abstract: The effects of aging time on the mechanical properties of the Sn–9Zn–1.5Ag–xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn–9Zn–1.5Ag–xBi solder alloys is composed of Sn-rich phase and AgZn{sub 3}. No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn–9Zn–1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloy before aging.

Functional traits of trees on and off termite mounds : Understanding the origin of biotically-driven heterogeneity in savannas

NARCIS (Netherlands)

van der Plas, F.; Howison, R.; Reinders, J.; Fokkema, W.; Olff, H.

Questions In African savannas, Macrotermes termites contribute to small-scale heterogeneity by constructing large mounds. Operating as islands of high nutrient and water availability and low fire frequency, these mounds support distinct, diverse communities of trees that have been shown to be highly

Mapping of Cold-Water Coral Carbonate Mounds Based on Geomorphometric Features: An Object-Based Approach

Directory of Open Access Journals (Sweden)

Markus Diesing

2018-01-01

Full Text Available Cold-water coral reefs are rich, yet fragile ecosystems found in colder oceanic waters. Knowledge of their spatial distribution on continental shelves, slopes, seamounts and ridge systems is vital for marine spatial planning and conservation. Cold-water corals frequently form conspicuous carbonate mounds of varying sizes, which are identifiable from multibeam echosounder bathymetry and derived geomorphometric attributes. However, the often-large number of mounds makes manual interpretation and mapping a tedious process. We present a methodology that combines image segmentation and random forest spatial prediction with the aim to derive maps of carbonate mounds and an associated measure of confidence. We demonstrate our method based on multibeam echosounder data from Iverryggen on the mid-Norwegian shelf. We identified the image-object mean planar curvature as the most important predictor. The presence and absence of carbonate mounds is mapped with high accuracy. Spatially-explicit confidence in the predictions is derived from the predicted probability and whether the predictions are within or outside the modelled range of values and is generally high. We plan to apply the showcased method to other areas of the Norwegian continental shelf and slope where multibeam echosounder data have been collected with the aim to provide crucial information for marine spatial planning.

Accelerated Clean-up of the United States Department of Energy, Mound Nuclear Weapons Facility in Miamisburg, Ohio

International Nuclear Information System (INIS)

Lehew, J.G.; Bradford, J.D.; Cabbil, C.C.

2006-01-01

CH2M HILL is executing a performance-based contract with the United States Department of Energy to accelerate the safe closure of the nuclear facilities at the former Mound plant in Miamisburg, Ohio. The contract started in January 2003 with a target completion date of March 31, 2006. Our accelerated baseline targets completion of the project 2 years ahead of the previous baseline schedule, by spring 2006, and for $200 million less than previous estimates. This unique decommissioning and remediation project is located within the City of Miamisburg proper and is designed for transfer of the property to the Miamisburg Mound Community Improvement Corporation for industrial reuse. The project is being performed with the Miamisburg Mound Community Improvement Corporation and their tenants co-located on the site creating significant logistical, safety and stakeholder challenges. The project is also being performed in conjunction with the United States Department of Energy, United States Environmental Protection Agency, and the Ohio Environmental Protection Agency under the Mound 2000 regulatory cleanup process. The project is currently over 95% complete. To achieve cleanup and closure of the Mound site, CH2M HILL's scope includes: - Demolition of 64 nuclear, radiological and commercial facilities - Preparation for Transfer of 9 facilities (including a Category 2 nuclear facility) to the Miamisburg Mound Community Improvement Corporation for industrial reuse - Removal of all above ground utility structures and components, and preparation for transfer of 9 utility systems to Miamisburg Mound Community Improvement Corporation - Investigation, remediation, closure, and documentation of all known Potential Release Sites contaminated with radiological and chemical contamination (73 identified in original contract) - Storage, characterization, processing, packaging and shipment of all waste and excess nuclear materials - Preparation for Transfer of the 306 acre site to the

The distribution, abundance, and the effects of fire on mound building termites (Trinervitermes and Cubitermes spp., Isoptera: Termitidae) in northern guinea savanna West Africa.

Science.gov (United States)

Benzie, John A H

1986-11-01

Termite mound densities in typical guinea savanna, Detarium, and grassland (boval) habitats in northern guinea savanna were determined by random quadratting of 2-3 sites in each habitat (100, 10x10 m quadrats per habitat). Dominant species in guinea savanna were T. geminatus (46 mounds ha -1 ) and T. oeconomus (21 mounds ha -1 ), in Detarium T. geminatus (59 mounds ha -1 ) and C. curtatus (45 mounds ha -1 ) and in boval C. curtatus (72 mounds ha -1 ) and T. geminatus (22 mounds ha -1 ). Only C. curtatus densities and total densities differed significantly between sites within habitats, but all species differed significantly in abundance between habitats. The composition of each community was related to general environment but no particular environmental variable was shown to be a major determinant of termite distribution. Evidence for the limitation of termite populations was obtained from indirect evidence of competition between colonies in Detarium, and by experimental manipulation of fire regimes in the typical guinea savanna habitat. Harvester termites increased four-five fold over two years in fire-protected plots as a result of increased food supplies. Total termite densities in the fire-protected community equilibrated to the new population density (100 mounds ha -1 ) after only two-three years.

Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

Science.gov (United States)

Coyle, Richard J.; Sweatman, Keith; Arfaei, Babak

2015-09-01

Thermal fatigue is a major source of failure of solder joints in surface mount electronic components and it is critically important in high reliability applications such as telecommunication, military, and aeronautics. The electronic packaging industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu alloys first established as replacements for eutectic SnPb. This paper discusses the results from Pb-free solder joint reliability programs sponsored by two industry consortia. The characteristic life in accelerated thermal cycling is reported for 12 different Pb-free solder alloys and a SnPb control in 9 different accelerated thermal cycling test profiles in terms of the effects of component type, accelerated thermal cycling profile and dwell time. Microstructural analysis on assembled and failed samples was performed to investigate the effect of initial microstructure and its evolution during accelerated thermal cycling test. A significant finding from the study is that the beneficial effect of Ag on accelerated thermal cycling reliability (measured by characteristic lifetime) diminishes as the severity of the accelerated thermal cycling, defined by greater ΔT, higher peak temperature, and longer dwell time increases. The results also indicate that all the Pb-free solders are more reliable in accelerated thermal cycling than the SnPb alloy they have replaced. Suggestions are made for future work, particularly with respect to the continued evolution of alloy development for emerging application requirements and the value of using advanced analytical methods to provide a better understanding of the effect of microstructure and its evolution on accelerated thermal cycling performance.

Effects of PCB thickness on adjustable fountain wave soldering

Indian Academy of Sciences (India)

hybrid circuit assembly, component lead tinning, and wire tinning. .... The mesh model was built and optimized with 599920 hybrid nodes as shown in figure 9. ... conducted to track the fluid motions of the two phases (i.e., molten solder and air).

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

International Nuclear Information System (INIS)

Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

2015-01-01

Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. (review)

Cold-water coral mounds on the Pen Duick Escarpment, Gulf of Cadiz: The MiCROSYSTEMS project approach

NARCIS (Netherlands)

Van Rooij, D.; Blamart, D.; De Mol, L.; Mienis, F.; Pirlet, H.; Wehrmann, L. M.; Barbieri, R.; Maignien, L.; Templer, S. P.; de Haas, H.; Hebbeln, D.; Frank, N.; Larmagnat, S.; Stadnitskaia, A.; Stivaletta, N.; van Weering, T.; Zhang, Y.; Hamoumi, N.; Cnudde, V.; Duyck, P.; Henriet, J.-P.; The MiCROSYSTEMS MD 169 Shipboard Party

2011-01-01

Here we present a case study of three cold-water coral mounds in a juvenile growth stage on top of the Pen Duick Escarpment in the Gulf of Cadiz; Alpha, Beta and Gamma mounds. Although cold-water corals are a common feature on the adjacent cliffs, mud volcanoes and open slope, no actual living

Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: a knowledge base for fluxless solder bonding applications

DEFF Research Database (Denmark)

Kuhmann, Jochen Friedrich; Preuss, A.; Adolphi, B.

1998-01-01

: (1) SnPb; (2) InSn; (3) AuSn. The studies of the oxidation kinetics show that the growth of the native oxide, which covers the solder surfaces from the start of all soldering operations is self-limiting. The rate of oxidation on the molten, metallic solder surfaces is significantly reduced...... and reduction kinetics, are applied to flip-chip (FC) bonding experiments in vacuum with and without the injection of H2. Wetting in vacuum is excellent but the self-alignment during flip-chip soldering is restricted. The desired, perfectly self-aligned FC-bonds have been only achieved, using evaporated...

Ecosystem engineering creates a direct nutritional link between 600-m deep cold-water coral mounds and surface productivity

NARCIS (Netherlands)

Soetaert, K.; Mohn, C.; Rengstorf, A.; Grehan, A.; Van Oevelen, D.

2016-01-01

Cold-water corals (CWCs) form large mounds on the seafloor that are hotspots of biodiversity in the deep sea, but it remains enigmatic how CWCs can thrive in this food-limited environment. Here, we infer from model simulations that the interaction between tidal currents and CWC-formed mounds induces

Post Earthquack Slope Stability Analysis of Rubble Mound Breakwater

OpenAIRE

Amin Moradi; Amir Mahmoudzadeh; Yahya Rahim Safavi

2017-01-01

Rubble mound breakwaters are structures built mainly of quarried rock. Generally armourstone or artificial concrete armour units are used for the outer armour layer,which should protect the structure againist wave attack. Armour stones and concrete armoure unites in this outer layer are usually placed with care to obtain effective interlocking and consequently better stability .

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Science.gov (United States)

Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

2015-01-01

Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. PMID:27877786

Phylogeography of an Australian termite, Amitermes laurensis (Isoptera, Termitidae), with special reference to the variety of mound shapes.

Science.gov (United States)

Ozeki, Masato; Isagi, Yuji; Tsubota, Hiromi; Jacklyn, Peter; Bowman, David M J S

2007-01-01

In northern Australia, the debris-feeding termite Amitermes laurensis builds tall, wedge-shaped mounds in the northern part of Cape York Peninsula and Arnhem Land, where their habitats are seasonally flooded, and small dome shaped mounds in the southeastern part of Cape York Peninsula, where their habitats are well-drained. Phylogeographic analyses were conducted in 238 individuals from 30 populations using the mitochondrial cytochrome oxidase II (COII) gene. DNA sequences of 50 haplotypes were used to construct NJ, MP and ML trees. Phylogenetic trees for 16 Amitermes species showed monophyly of A. laurensis and the variation of A. laurensis mounds did not strongly correspond to the intraspecific phylogeny. It was observed that mounds with the same shape were constructed by phylogenetically different groups under similar environmental conditions and different mounds shapes were built by phylogenetically closely related groups under the different environmental conditions. Thus, phylogenetically close groups of A. laurensis, in different habitats, may adapt to environmental conditions by constructing different mound shapes. We also investigated the phylogeographic structure of A. laurensis. The significant positive correlation between genetic and geographic distances indicated isolation by distance, reflecting restricted dispersal ability of alates. Although the overall genetic structure of A. laurensis showed isolation by distance, we also identified two exceptions: (i) secondary contacts of genetically divergent lineages in southern Cape York Peninsula, and (ii) low genetic differences between geographically separated populations of Cape York Peninsula and Arnhem Land. Therefore, the phylogeography of A. laurensis may reflect continuous gene flow restricted to short distances and past changes of gene flow associated with the fluctuation of environmental conditions accompanying the changing sea levels in the Quaternary.

Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy

Directory of Open Access Journals (Sweden)

Abdoul-Aziz Bogno

2015-01-01

Full Text Available The properties and performance of lead-free solder alloys such as fluidity and wettability are defined by the alloy composition and solidification microstructure. Rapid solidification of metallic alloys is known to result in refined microstructures with reduced microsegregation and improved mechanical properties of the final products as compared to normal castings. The rapidly solidified Sn-based solders by melt spinning were shown to be suitable for soldering with low temperature and short soldering duration. In the present study, rapidly solidified Sn–0.7 wt.%Cu droplets generated by impulse atomization (IA were achieved as well as directional solidification under transient conditions at lower cooling rate. This paper reports on a comparative study of the rapidly solidified and the directionally solidified samples. Different but complementary characterization techniques were used to fully analyze the solidification microstructures of the samples obtained under the two cooling regimes. These include X-ray diffractometry (XRD and scanning electron microscopy (SEM. In order to compare the tensile strength and elongation to fracture of the directionally solidified ingot and strip castings with the atomized droplet, compaction and extrusion of the latter were carried out. It was shown that more balanced and superior tensile mechanical properties are available for the hot extruded samples from compacted as-atomized Sn–0.7 wt.%Cu droplets. Further, elongation-to-fracture was 2–3× higher than that obtained for the directionally solidified samples.

Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

Science.gov (United States)

Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S

2015-08-01

The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding.

Transected sciatic nerve repair by diode laser protein soldering.

Science.gov (United States)

Fekrazad, Reza; Mortezai, Omid; Pedram, MirSepehr; Kalhori, Katayoun Am; Joharchi, Khojasteh; Mansoori, Korosh; Ebrahimi, Roja; Mashhadiabbas, Fatemeh

2017-08-01

Despite advances in microsurgical techniques, repair of peripheral nerve injuries (PNI) is still a major challenge in regenerative medicine. The standard treatment for PNI includes suturing and anasthomosis of the transected nerve. The objective of this study was to compare neurorraphy (nerve repair) using standard suturingto diode laser protein soldering on the functional recovery of transected sciatic nerves. Thirty adult male Fischer-344 Wistar rats were randomly assigned to 3 groups: 1. The control group, no repair, 2. the standard of care suture group, and 3. The laser/protein solder group. For all three groups, the sciatic nerve was transected and the repair was done immediately. For the suture repair group, 10.0 prolene suture was used and for the laser/protein solder group a diode laser (500mW output power) in combination with bovine serum albumen and indocyanine green dye was used. Behavioral assessment by sciatic functional index was done on all rats biweekly. At 12weeks post-surgery, EMG recordings were done on all the rats and the rats were euthanized for histological evaluation of the sciatic nerves. The one-way ANOVA test was used for statistical analysis. The average time required to perform the surgery was significantly shorter for the laser-assisted nerve repair group compared to the suture group. The EMG evaluation revealed no difference between the two groups. Based on the sciatic function index the laser group was significantly better than the suture group after 12weeks (pneurorraphy using standard suturing methods. Copyright © 2017 Elsevier B.V. All rights reserved.

Feasibility of a Mound-designed transportable calorimeter

International Nuclear Information System (INIS)

Duff, M.F.; Fellers, C.L.

1979-01-01

The feasibility of operating a Mound twin resistance bridge calorimeter outside a temperature-controlled water bath was demonstrated. An existing calorimeter was retrofit with two additional jackets through which water was transferred from an external reservoir. Comparison of test results collected before and after the retrofit indicated that the calorimeter performance was not degraded by this modification. Similarly designed calorimeters have potential applications in laboratories where equipment space is limited for inspectors who are required to transport their assay instrumentation

Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

Directory of Open Access Journals (Sweden)

Shuye Zhang

2018-01-01

Full Text Available Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared with pressure based contact of metal conductor balls. Recently, flex-on-board interconnection has become more and more popular for mobile electronic applications. However, crack formation of the solder joint crack was occurred at low temperature curable acrylic polymer resins after bonding processes. In this study, the mechanism of SnBi58 solder joint crack at low temperature curable acrylic adhesive was investigated. In addition, SnBi58 solder joint cracks can be significantly removed by increasing the storage modulus of adhesives instead of coefficient of thermal expansion. The first approach of reducing the amount of polymer rebound can be achieved by using an ultrasonic bonding method to maintain a bonding pressure on the SnBi58 solder joints cooling to room temperature. The second approach is to increase storage modulus of adhesives by adding silica filler into acrylic polymer resins to prevent the solder joint from cracking. Finally, excellent acrylic based SnBi58 solder joints reliability were obtained after 1000 cycles thermal cycling test.

Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds

Energy Technology Data Exchange (ETDEWEB)

Haseeb, A.S.M.A., E-mail: haseeb@um.edu.my; Arafat, M.M., E-mail: arafat_mahmood@yahoo.com; Johan, Mohd Rafie, E-mail: mrafiej@um.edu.my

2012-02-15

This work investigates the effects of molybdenum nanoparticles on the growth of interfacial intermetallic compound between Sn-3.8Ag-0.7Cu solder and copper substrate during multiple reflow. Molybdenum nanoparticles were mixed with Sn-3.8Ag-0.7Cu solder paste by manual mixing. Solder samples were reflowed on a copper substrate in a 250 Degree-Sign C reflow oven up to six times. The molybdenum content of the bulk solder was determined by inductive coupled plasma-optical emission spectrometry. It is found that upon the addition of molybdenum nanoparticles to Sn-3.8Ag-0.7Cu solder, the interfacial intermetallic compound thickness and scallop diameter decreases under all reflow conditions. Molybdenum nanoparticles do not appear to dissolve or react with the solder. They tend to adsorb preferentially at the interface between solder and the intermetallic compound scallops. It is suggested that molybdenum nanoparticles impart their influence on the interfacial intermetallic compound as discrete particles. The intact, discrete nanoparticles, by absorbing preferentially at the interface, hinder the diffusion flux of the substrate and thereby suppress the intermetallic compound growth. - Highlights: Black-Right-Pointing-Pointer Mo nanoparticles do not dissolve or react with the SAC solder during reflow. Black-Right-Pointing-Pointer Addition of Mo nanoparticles results smaller IMC thickness and scallop diameter. Black-Right-Pointing-Pointer Mo nanoparticles influence the interfacial IMC through discrete particle effect.

Hydraulic Response of Rubble Mound Breakwaters

DEFF Research Database (Denmark)

Andersen, Thomas Lykke

, which was not actually identifed as a white spot, but still there was room for big improvements. Rear slope stability and wave re ection has been discussed brie y. The conventional rubble mound breakwater has been investigated for many decades. Anyhow, there is still room for improvements in some areas...... experimental test programme with berm breakwaters, has not only resulted in an enormous amount of overtopping data, but also establishment of a design formula to calculate average overtopping discharges. Further, the test programme led to an improved design rule for front side stability of berm breakwaters...

Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

Science.gov (United States)

Kotadia, H. R.; Panneerselvam, A.; Mokhtari, O.; Green, M. A.; Mannan, S. H.

2012-04-01

The interfacial intermetallic compound (IMC) formation between Cu substrate and Sn-3.8Ag-0.7Cu-X (wt.%) solder alloys has been studied, where X consists of 0-5% Zn or 0-2% Al. The study has focused on the effect of solder volume as well as the Zn or Al concentration. With low solder volume, when the Zn and Al concentrations in the solder are also low, the initial Cu-Zn and Al-Cu IMC layers, which form at the solder/substrate interface, are not stable and spall off, displaced by a Cu6Sn5 IMC layer. As the total Zn or Al content in the system increases by increasing solder volume, stable CuZn or Al2Cu IMCs form on the substrate and are not displaced. Increasing concentration of Zn has a similar effect of stabilizing the Cu-Zn IMC layer and also of forming a stable Cu5Zn8 layer, but increasing Al concentration alone does not prevent spalling of Al2Cu. These results are explained using a combination of thermodynamic- and kinetics-based arguments.

Some recent changes in tritium handling and control at Mound Laboratory

International Nuclear Information System (INIS)

Rhinehammer, T.B.

1976-01-01

Significant reductions in tritium effluents and personnel exposures at Mound Laboratory have been made during the past 5 yr. Yearly effluents are less than 3 percent of former levels and personnel exposures have been reduced by a factor of 300. Several recent changes which have contributed to these reductions include lowered tritium levels in gloveboxes, and the efficiency and capacity of Mound's new effluent removal system. Personnel exposures have been reduced dramatically by changing to precious metal catalytic converters or oxidizers for use with the glovebox gas purification system. Unlike some former systems using hot copper or proprietary reactants for oxygen removal, a catalyst provides very effective removal of both oxygen and tritium. Both oxygen and tritium can be monitored and, if necessary, increments of hydrogen in argon can be added until the oxygen level is brought down to the desired value

An evaluation of the spring finger solder joints on SA1358-10 and SA2052-4 connector assemblies (MC3617,W87)

International Nuclear Information System (INIS)

Kilgo, Alice C.; Vianco, Paul Thomas; Hlava, Paul Frank; Zender, Gary L.

2006-01-01

The SA1358-10 and SA2052-4 circular JT Type plug connectors are used on a number of nuclear weapons and Joint Test Assembly (JTA) systems. Prototype units were evaluated for the following specific defects associated with the 95Sn-5Sb (Sn-Sb, wt.%) solder joint used to attach the beryllium-copper (BeCu) spring fingers to the aluminum (Al) connector shell: (1) extended cracking within the fillet; (2) remelting of the solder joint during the follow-on, soldering step that attached the EMR adapter ring to the connector shell (and/or soldering the EMR shell to the adapter ring) that used the lower melting temperature 63Sn-37Pb (Sn-Pb) alloy; and (3) spalling of the Cd (Cr) layer overplating layer from the fillet surface. Several pedigrees of connectors were evaluated, which represented older fielded units as well as those assemblies that were recently constructed at Kansas City Plant. The solder joints were evaluated that were in place on connectors made with the current soldering process as well as an alternative induction soldering process for attaching the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely reflected the different extents to which the connector was mated to its counterpart assembly. In all cases, the spring finger solder joints on the SA1358-10 connectors were remelted as a result of the subsequent EMR adapter ring attachment process. Spalling of the Cd (Cr) overplating layer was also observed for these connectors, which was a consequence of the remelting activity. On the other hand, the SA2052-4 connector did not exhibit evidence of

Litter-forager termite mounds enhance the ectomycorrhizal symbiosis between Acacia holosericea A. Cunn. Ex G. Don and Scleroderma dictyosporum isolates.

Science.gov (United States)

Duponnois, Robin; Assikbetse, Komi; Ramanankierana, Heriniaina; Kisa, Marija; Thioulouse, Jean; Lepage, Michel

2006-05-01

The hypothesis of the present study was that the termite mounds of Macrotermes subhyalinus (MS) (a litter-forager termite) were inhabited by a specific microflora that could enhance with the ectomycorrhizal fungal development. We tested the effect of this feeding group mound material on (i) the ectomycorrhization symbiosis between Acacia holosericea (an Australian Acacia introduced in the sahelian areas) and two ectomycorrhizal fungal isolates of Scleroderma dictyosporum (IR408 and IR412) in greenhouse conditions, (ii) the functional diversity of soil microflora and (iii) the diversity of fluorescent pseudomonads. The results showed that the termite mound amendment significantly increased the ectomycorrhizal expansion. MS mound amendment and ectomycorrhizal inoculation induced strong modifications of the soil functional microbial diversity by promoting the multiplication of carboxylic acid catabolizing microorganisms. The phylogenetic analysis showed that fluorescent pseudomonads mostly belong to the Pseudomonads monteillii species. One of these, P. monteillii isolate KR9, increased the ectomycorrhizal development between S. dictyosporum IR412 and A. holosericea. The occurrence of MS termite mounds could be involved in the expansion of ectomycorrhizal symbiosis and could be implicated in nutrient flow and local diversity.

Investigation into mechanical properties of joints of heterogeneous materials brazed with high-temperature solders

International Nuclear Information System (INIS)

Lomenko, V.I.; Merkushev, V.P.; Borodina, L.M.; Sycheva, T.S.; Tokhtina, O.A.; Frolov, N.N.

1988-01-01

Mechanical properties of copper joints with copper, 12Kh18M10T steel and KhD50 composite obtained by vacuum brazing by copper-titanium solder as compared with properties of joints brazed by PSr 72 and PMFOTsr 6-4-0.03 solders in hydrogen are studied. Dependences of joints strength on temperature of contact - reactive vacuum brazing are obtained. Possible applications of joints of dissimilar materials in electrovacuum devices subjected to the effect of dynamic loadings are established

Aging treatment characteristics of solder bump joint for high reliability optical module

International Nuclear Information System (INIS)

Kim, Kyung-Seob; Yu, Chung-Hee; Yang, Jun-Mo

2004-01-01

The joint strength and fracture surfaces of Sn-37 mass% Pb and Au stud bumps for photo diode packages after isothermal aging testing were studied experimentally. Al/Au stud bumps and Cu/Sn-37 mass% Pb solders were adopted, and aged for up to 900 h to analyze the effect of intermetallic compound (IMC). The joint strength decreased with aging time. The diffraction patterns of Cu 6 Sn 5 , scallop-shaped IMCs, and planar-shaped Cu 3 Sn were characterized using transmission electron microscopy (TEM). The formation of Kirkendall voids and the growth of IMCs at the solder were found to be a possible mechanism for joint strength reduction

An Approach for Impression Creep of Lead Free Microelectronic Solders

Science.gov (United States)

Anastasio, Onofrio A.

2002-06-01

Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

Electrical characteristics for Sn-Ag-Cu solder bump with Ti/Ni/Cu under-bump metallization after temperature cycling tests

Science.gov (United States)

Shih, T. I.; Lin, Y. C.; Duh, J. G.; Hsu, Tom

2006-10-01

Lead-free solder bumps have been widely used in current flip-chip technology (FCT) due to environmental issues. Solder joints after temperature cycling tests were employed to investigate the interfacial reaction between the Ti/Ni/Cu under-bump metallization and Sn-Ag-Cu solders. The interfacial morphology and quantitative analysis of the intermetallic compounds (IMCs) were obtained by electron probe microanalysis (EPMA) and field emission electron probe microanalysis (FE-EPMA). Various types of IMCs such as (Cu1-x,Agx)6Sn5, (Cu1-y,Agy)3Sn, and (Ag1-z,Cuz)3Sn were observed. In addition to conventional I-V measurements by a special sample preparation technique, a scanning electron microscope (SEM) internal probing system was introduced to evaluate the electrical characteristics in the IMCs after various test conditions. The electrical data would be correlated to microstructural evolution due to the interfacial reaction between the solder and under-bump metallurgy (UBM). This study demonstrated the successful employment of an internal nanoprobing approach, which would help further understanding of the electrical behavior within an IMC layer in the solder/UBM assembly.

Investigation of Sn-Pb solder bumps of prototype photo detectors for the LHCb experiment

CERN Document Server

Delsante, M L; Arnau-Izquierdo, G

2004-01-01

The Large Hadron Collider (LHC) is now under construction at the European Organization for Nuclear Research (CERN). LHCb is one of the dedicated LHC experiments, allowing high energy proton-proton collisions to be exploited. This paper presents the results of the metallurgic studies carried out on Sn-Pb solder bumps of prototype vacuum photo detectors under development for LHCb, and in particular for the ring imaging Cherenkov-hybrid photo diode (RICH-HPD) project. These detectors encapsulate, in a vacuum tube, an assembly made of two silicon chips bonded together by a matrix of solder bumps. Each bump lies on a suitable system of under-bump metallic layers ensuring mechanical and electrical transition between the chip pad and the solder alloy. During manufacturing of the detector, bump-bonded (BB) assemblies are exposed to severe heat cycles up to 400 degree C inducing, in the present fabrication process, a clear degradation of electrical connectivity. Several investigations such as microstructural observati...

Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

Energy Technology Data Exchange (ETDEWEB)

Dias, Marcelino; Costa, Thiago [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Rocha, Otávio [Federal Institute of Education, Science and Technology of Pará — IFPA, 66093-020 Belém, PA (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos — UFSCar, 13565-905 São Carlos, SP (Brazil); Cheung, Noé, E-mail: cheung@fem.unicamp.br [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil)

2015-08-15

Considerable effort is being made to develop lead-free solders for assembling in environmental-conscious electronics, due to the inherent toxicity of Pb. The search for substitute alloys of Pb–Sn solders has increased in order to comply with different soldering purposes. The solder must not only meet the expected levels of electrical performance but may also have appropriate mechanical strength, with the absence of cracks in the solder joints. The Sn–Sb alloy system has a range of compositions that can be potentially included in the class of high temperature solders. This study aims to establish interrelations of solidification thermal parameters, microstructure and mechanical properties of Sn–Sb alloys (2 wt.%Sb and 5.5 wt.%Sb) samples, which were directionally solidified under cooling rates similar to those of reflow procedures in industrial practice. A complete high-cooling rate cellular growth is shown to be associated with the Sn–2.0 wt.%Sb alloy and a reverse dendrite-to-cell transition is observed for the Sn–5.5 wt.%Sb alloy. Strength and ductility of the Sn–2.0 wt.%Sb alloy are shown not to be affected by the cellular spacing. On the other hand, a considerable variation in these properties is associated with the cellular region of the Sn–5.5 wt.%Sb alloy casting. - Graphical abstract: Display Omitted - Highlights: • The microstructure of the Sn–2 wt.%Sb alloy is characterized by high-cooling rates cells. • Reverse dendrite > cell transition occurs for Sn–5.5 wt.%Sb alloy: cells prevail for cooling rates > 1.2 K/s. • Sn–5.5 wt.%Sb alloy: the dendritic region occurs for cooling rates < 0.9 K/s. • Sn–5.5 wt.%Sb alloy: tensile properties are improved with decreasing cellular spacing.

Measurement of erosion of stainless steel by molten lead-free solder using micro-focus x-ray CT system

International Nuclear Information System (INIS)

Nishikawa, Hiroshi; Takemoto, Tadashi; Kang, Songai

2009-01-01

The severe erosion damage, which is caused by a molten lead-free solder, of wave solder equipment made into stainless steel has been encountered in operation. Then, the higher maintenance frequency and reduced life time of wave solder machine component is a serious issue in a manufacturing process. In this study, the evaluation method of erosion of stainless steel by molten lead-free solders was investigated using micro-focus X-ray systems for fluoroscopic and computed tomography (CT). As a result, it was found that the fluoroscopic image could truly reconstruct the cross-shape of the stainless steel sample after immersion test without destruction. In the case of X-ray systems for fluoroscopic and CT used in this study, three-dimensional data can be obtained. Therefore, it was possible to easily check the whole picture of the test sample after immersion test and to decide the maximum erosion depth of test sample. (author)

Grainstones and cementstone mounds: The Trogkofel summit section (Lower Permian, Carnic Alps, Austria).

Science.gov (United States)

Schaffhauser, M.; Sanders, D.; Krainer, K.

2009-04-01

In the Carnic Alps, Austria, an Artinskian succession 400 m thick of shallow-water bioclastic limestones and of mounds composed of ?Archaeolithophyllum, Archaeolithoporella and abundant fibrous cementstone (after former aragonite) records deposition along a "grainstone-dominated" platform margin. The section was taken along the route through the east-facing cliff of Trogkofel. The Trogkofel Limestone (Artinskian pro parte) is excellently exposed and preserved the most complete along this route, but no section has hitherto been logged. The total thickness of the Trogkofel Limestone probably is about 550 meters; the summit section comprises its upper 400 meters. The section consists mainly of shallow-water bioclastic limestones (grainstones, packstones, rudstones) intercalated with cementstone mounds. Both the bioclastic limestones and the mounds typically are thick-bedded to, more commonly, unbedded. Throughout the section, intervals a few tens of meters in thickness dominated by bioclastic limestones change vertically with intervals dominated by cementstone mounds. Up-section, no clear-cut trend with respect to prevalent facies, mean depositional water depth, and energy index is obvious. Furthermore, no lime-muddy, meter-scale peritidal cycles, and no teepee structures and no pisolite levels were identified; thin intervals of fenestral lime mudstones and/or of cryptmicrobially-laminated limestones are very rare. The bioclastic limestones commonly weather out unstratified, or show subhorizontal stratification or, more rarely, low-angle cross-stratification. In the upper 100 meters of section, grainstones to fine-grained rudstones rich in keystone vugs are prevalent. The cementstone mounds comprise intervals up to a few meters in thickness; the biogenic component is characterized by foliose crusts pertaining to ?Archaeolithophyllum hidensis and Archaeolithoporella, overgrown by Tubiphytes and fenestrate bryozoans. The ?Archaeolithophyllum-Archaeolithoporella crusts

In-vitro investigations of skin closure using diode laser and protein solder containing gold nano shells

International Nuclear Information System (INIS)

Nourbakhsh, M. S.; Etrati Khosroshahi, M.

2011-01-01

Laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. To overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nano shells, a new class of nanoparticles consisting of a dielectric core surrounded by a thin metal shell, are used. The aims of this study were to use two different concentrations of gold nano shells as the exogenous material for skin tissue soldering and also to examine the effects of laser soldering parameters on the properties of the repaired skin. Material and Methods: Two mixtures of albumin solder and different concentrations of gold nano shells were prepared. A full thickness incision of 2*20 mm 2 was made on the surface and after placing 50 μ1 of the solder mixture on the incision, an 810 nm diode laser was used to irradiate it at different power densities. The changes of tensile strength, σt, due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. Results: The results showed that the tensile strength of the repaired skin increased with increasing irradiance for both gold nano shell concentrations. In addition, at constant laser irradiance (I), the tensile strength of the repaired incision increased with increasing Ns and decreasing Vs. In our case, this corresponded to σt = 1610 g/cm 2 at I ∼ 60 W cm-2, T ∼ 65 d egree C , Ns = 10 and Vs = 0.2 mms-1. Discussion and Conclusion: Gold nano shells can be used as an indocyanine green dye alterative for laser tissue soldering. Although by increasing the laser power density, the tensile strength of the repaired skin increases, an optimum power density must be considered due to the resulting increase in tissue temperature.

Development of gold based solder candidates for flip chip assembly

DEFF Research Database (Denmark)

Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

2009-01-01

Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

Directory of Open Access Journals (Sweden)

Yulong Li

2018-01-01

Full Text Available In order to accelerate the growth of interfacial intermetallic compound (IMC layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms and 800 ms, were used for the ultrasonic soldering. The isothermal aging was conducted at 150 °C for 0, 120, 240, and 360 h. The evolution of microstructure, the IMC layer growth mechanism during aging, and the shear strength of the joints after aging were systemically investigated. Results showed the following. (i Formation of intermetallic compounds was accelerated by ultrasonic cavitation and streaming effects, the thickness of the interfacial Cu6Sn5 layer increased with aging time, and a thin Cu3Sn layer was identified after aging for 360 h. (ii The growth of the interfacial IMC layer of the ultrasonically soldered Cu/SAC305/Cu joints followed a linear function of the square root of the aging time, revealing a diffusion-controlled mechanism. (iii The tensile shear strength of the joint decreased to a small extent with increasing aging time, owing to the combined effects of IMC grain coarsening and the increase of the interfacial IMC. (iv Finally, although the fracture surfaces and failure locations of the joint soldered with 400 ms and 800 ms vibration times show similar characteristics, they are influenced by the aging time.

Physics of Failure as a Basis for Solder Elements Reliability Assessment in Wind Turbines

DEFF Research Database (Denmark)

Kostandyan, Erik; Sørensen, John Dalsgaard

2012-01-01

description of the reliability. A physics of failure approach is applied. A SnAg solder component used in power electronics is used as an example. Crack propagation in the SnAg solder is modeled and a model to assess the accumulated plastic strain is proposed based on a physics of failure approach. Based...... on the proposed model it is described how to find the accumulated linear damage and reliability levels for a given temperature loading profile. Using structural reliability methods the reliability levels of the electrical components are assessed by introducing scale factors for stresses....

The nest growth of the neotropical mound-building termite, Cornitermes cumulans: a micromorphological analysis.

Science.gov (United States)

Cosarinsky, Marcela I

2011-01-01

The nests of Cornitermes cumulans K. (Isoptera: Termitidae), a very common termite in South American grasslands, display notable morphological transformations during the development of the colony. Young colonies inhabit small subterranean nests that develop into large, conspicuous, epigean mounds, inhabited by very populous colonies. Those macromorphological transformations are accompanied by micromorphological changes occurring gradually in the nest walls. The micromorphological changes during nest development described in the present study expand on previous macromorphological descriptions by explaining the re-organization of the soil components during nest growth. In subterranean nests, walls are composed of piles of lensshaped aggregates of soil material, each one surrounded by a thin organic coating. As the nest grows, mound walls are constructed by disassembling this first lenticular structure and rearranging the materials in a new fabric, where sand grains are loosely distributed among soil microaggregates of organic matter and clay. This is also a temporary construction, because the walls of large nests are composed of a porous mass of sands densely cemented with organic matter and clay in the mound, and a compact mass of the same components in the floor.

Effects of vertical wall and tetrapod weights on wave overtopping in rubble mound breakwaters under irregular wave conditions

Directory of Open Access Journals (Sweden)

Park Sang Kil

2014-12-01

Full Text Available Rubble mound breakwaters protect the coastal line against severe erosion caused by wave action. This study examined the performance of different sizes and properties (i.e. height of vertical wall and tetrapod size of rubble mound breakwaters on reducing the overtopping discharge. The physical model used in this study was derived based on an actual rubble mound in Busan Yacht Harbor. This research attempts to fill the gap in practical knowledge on the combined effect of the armor roughness and vertical wall on wave overtopping in rubble mound breakwaters. The main governing parameters used in this study were the vertical wall height, variation of the tetrapod weights, initial water level elevation, and the volume of overtopping under constant wave properties. The experimental results showed that the roughness factor differed according to the tetrapod size. Furthermore, the overtopping discharge with no vertical wall was similar to that with relatively short vertical walls ( 1 γv = 1. Therefore, the experimental results highlight the importance of the height of the vertical wall in reducing overtopping discharge. Moreover, a large tetrapod size may allow coastal engineers to choose a shorter vertical wall to save cost, while obtaining better performance.

Effects of vertical wall and tetrapod weights on wave overtopping in rubble mound breakwaters under irregular wave conditions

Directory of Open Access Journals (Sweden)

Sang Kil Park

2014-12-01

Full Text Available Rubble mound breakwaters protect the coastal line against severe erosion caused by wave action. This study examined the performance of different sizes and properties (i.e. height of vertical wall and tetrapod size of rubble mound breakwaters on reducing the overtopping discharge. The physical model used in this study was derived based on an actual rubble mound in Busan Yacht Harbor. This research attempts to fill the gap in practical knowledge on the combined effect of the armor roughness and vertical wall on wave overtopping in rubble mound breakwaters. The main governing parameters used in this study were the vertical wall height, variation of the tetrapod weights, initial water level elevation, and the volume of overtopping under constant wave properties. The experimental results showed that the roughness factor differed according to the tetrapod size. Furthermore, the overtopping discharge with no vertical wall was similar to that with relatively short vertical walls (γν = 1. Therefore, the experimental results highlight the importance of the height of the vertical wall in reducing overtopping discharge. Moreover, a large tetrapod size may allow coastal engineers to choose a shorter vertical wall to save cost, while obtaining better performance.

Mound-ACT*DE*CONSM feasibility study. Phase 2: Final report

International Nuclear Information System (INIS)

1994-12-01

A portion of the abandoned Miami-Erie Canal paralleling the Greater Miami River receives the runoff and storm-water discharge from Mound Laboratory. In 1969, a low-level plutonium leak contaminated sediment as far away as 1.5 mi from the Mound site along the old canal system. An estimated one million cubic feet of sediment requires remediation. The technology being evaluated for the remediation of the low-level plutonium-238 contamination of the sediment involves two processes: washing the sediments with ACT*DE*CON SM solution to dissolve the contaminant, followed by extraction of the solution and processing with the MAG*SEP SM process to concentrate the contaminant and allow reuse of the ACT*DE*CON SM solution. The processes are being optimized for pilot-scale and field demonstration. Phase 2 of the project primarily involved identification at the laboratory scale of the optimal ACT*DE*CON SM formulation, identification of the ion-exchanger and MAG*SEP SM particles, verification of the plutonium mobility in the treated soil, and evaluation of other process parameters according to a series of tasks

Evaluation on Dorsey Method in Surface Tension Measurement of Solder Liquids Containing Surfactants

Science.gov (United States)

Zhao, Xingke; Xie, Feiming; Fan, Jinsheng; Liu, Dayong; Huang, Jihua; Chen, Shuhai

2018-06-01

With the purpose of developing a feasible approach for measuring the surface tension of solders containing surfactants, the surface tension of Sn-3Ag-0.5Cu-xP solder alloys, with various drop sizes as well as different phosphorus (P) content, was evaluated using the Dorsey method based on the sessile drop test. The results show that the accuracy of the surface tension calculations depends on both of sessile drop size and the liquid metal composition. With a proper drop size, in the range of 4.5 mm to 5.3 mm in equivalent spherical diameters, the deviation of the surface tension calculation can be limited to 1.43 mN·m-1 and 6.30 mN·m-1 for SnAgCu and SnAgCu-P, respectively. The surface tension of SnAgCu-xP solder alloys decreases quickly to a minimum value when the P content reaches 0.5 wt% and subsequently increases slowly with the P content further increasing. The formation of a P-enriched surface layer and Sn4P3 intermetallic phases is regarded to be responsible for the decreasing and subsequent increasing of surface tension, respectively.

Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperature

Energy Technology Data Exchange (ETDEWEB)

Prabhu, K.N., E-mail: prabhukn_2002@yahoo.co.in [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India); Deshapande, Parashuram; Satyanarayan [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India)

2012-01-30

Highlights: Black-Right-Pointing-Pointer Effect of cooling rate on tensile and impact properties of Sn-9Zn alloy was assessed. Black-Right-Pointing-Pointer Both DBTT and UTS of the solder alloy increased with increase in cooling rate. Black-Right-Pointing-Pointer An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile-brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn-9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 Degree-Sign C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the

Effect of cooling rate during solidification of Sn–9Zn lead-free solder alloy on its microstructure, tensile strength and ductile–brittle transition temperature

International Nuclear Information System (INIS)

Prabhu, K.N.; Deshapande, Parashuram; Satyanarayan

2012-01-01

Highlights: ► Effect of cooling rate on tensile and impact properties of Sn–9Zn alloy was assessed. ► Both DBTT and UTS of the solder alloy increased with increase in cooling rate. ► An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile–brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn–9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 °C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the DBTT.

Design of Experiments to Determine Causes of Flex Cable Solder Wicking, Discoloration and Hole Location Defects

Energy Technology Data Exchange (ETDEWEB)

Wolfe, Larry

2009-04-22

Design of Experiments (DoE) were developed and performed in an effort to discover and resolve the causes of three different manufacturing issues; large panel voids after Hot Air Solder Leveling (HASL), cable hole locations out of tolerance after lamination and delamination/solder wicking around flat flex cable circuit lands after HASL. Results from a first DoE indicated large panel voids could be eliminated by removing the pre-HASL cleaning. It also revealed eliminating the pre-HASL bake would not be detrimental when using a hard press pad lamination stackup. A second DoE indicated a reduction in hard press pad stackup lamination pressure reduced panel stretch in the y axis approximately 70%. A third DoE illustrated increasing the pre-HASL bake temperature could reduce delamination/solder wicking when using a soft press pad lamination stackup.

Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process

Science.gov (United States)

Mallik, S.; Bauer, R.; Hübner, F.; Ekere, N. N.

2011-01-01

Solder paste is the most widely used interconnection material in the electronic assembly process for attaching electronic components/devices directly onto the surface of printed circuit boards, using stencil printing process. This paper evaluates the performance of three different commercially available Sn-Ag-Cu solder pastes formulated with different particle size distributions (PSD), metal content and alloy composition. A series of stencil printing tests were carried out using a specially designed stencil of 75 μm thickness and apertures of 300×300 μm2 dimension and 500 μm pitch sizes. Solder paste printing behaviors were found related to attributes such as slumping and surface tension and printing performance was correlated with metal content and PSD. The results of the study should benefit paste manufacturers and SMT assemblers to improve their products and practices.

Interfacial Microstructure and Shear Strength of Brazed Cu-Cr-Zr Alloy Cylinder and Cylindrical Hole by Au Based Solder

Directory of Open Access Journals (Sweden)

Zaihua Li

2017-07-01

Full Text Available Au-Ge-Ni solder was chosen for brazing of the Cu-Cr-Zr alloy cylinder and a part with a cylindrical hole (sleeve below 550 °C. The Au based solder was first sintered on the surface of the cylinder and then brazed to the inner surface of the sleeve. The effects of the heating process, the temperature and the holding time at the temperature on the microstructure of the sintered layer on the surface of the cylinder, the brazed interfacial microstructure, and the brazed shear strength between the cylinder and the sleeve were investigated by scanning electron microscope, energy dispersive X-ray spectroscopy analysis, and tensile shear tests. By approach of side solder melt feeding and brazing under proper parameters, the voids and micro cracks due to a lack of enough solder melt feeding are greatly lessened and the brazed shear strength of 100 MPa is ensured even with large clearances around 0.01 mm.

Three-dimensional (3D) visualization of reflow porosity and modeling of deformation in Pb-free solder joints

International Nuclear Information System (INIS)

Dudek, M.A.; Hunter, L.; Kranz, S.; Williams, J.J.; Lau, S.H.; Chawla, N.

2010-01-01

The volume, size, and dispersion of porosity in solder joints are known to affect mechanical performance and reliability. Most of the techniques used to characterize the three-dimensional (3D) nature of these defects are destructive. With the enhancements in high resolution computed tomography (CT), the detection limits of intrinsic microstructures have been significantly improved. Furthermore, the 3D microstructure of the material can be used in finite element models to understand their effect on microscopic deformation. In this paper we describe a technique utilizing high resolution (< 1 μm) X-ray tomography for the three-dimensional (3D) visualization of pores in Sn-3.9Ag-0.7Cu/Cu joints. The characteristics of reflow porosity, including volume fraction and distribution, were investigated for two reflow profiles. The size and distribution of porosity size were visualized in 3D for four different solder joints. In addition, the 3D virtual microstructure was incorporated into a finite element model to quantify the effect of voids on the lap shear behavior of a solder joint. The presence, size, and location of voids significantly increased the severity of strain localization at the solder/copper interface.

LBA-ECO ND-04 Termite Mound and Soil Characterization, Amazonas, Brazil: 1999-2001

Data.gov (United States)

National Aeronautics and Space Administration — ABSTRACT: This data set reports the results of a comprehensive study of mound building termites at the Embrapa research station in the Distrito Agropecuario da...

LBA-ECO ND-04 Termite Mound and Soil Characterization, Amazonas, Brazil: 1999-2001

Data.gov (United States)

National Aeronautics and Space Administration — This data set reports the results of a comprehensive study of mound building termites at the Embrapa research station in the Distrito Agropecuario da SUFRAMA,...

The Guaymas Basin hiking guide to hydrothermal mounds, chimneys and microbial mats: complex seafloor expressions of subsurface hydrothermal circulation

Directory of Open Access Journals (Sweden)

Andreas eTeske

2016-02-01

Full Text Available The hydrothermal mats, mounds and chimneys of the southern Guaymas Basin are the surface expression of complex subsurface hydrothermal circulation patterns. In this overview we document the most frequently visited features of this hydrothermal area with photographs, temperature measurements, and selected geochemical data; many of these distinct habitats await characterization of their microbial communities and activities. Microprofiler deployments on microbial mats and hydrothermal sediments show their steep geochemical and thermal gradients at millimeter-scale vertical resolution. Mapping these hydrothermal features and sampling locations within the southern Guaymas Basin suggest linkages to underlying shallow sills and heatflow gradients. Recognizing the inherent spatial limitations of much current Guaymas Basin sampling calls for a wider survey of the entire spreading region.

Impurity Effects in Electroplated-Copper Solder Joints

Directory of Open Access Journals (Sweden)

Hsuan Lee

2018-05-01

Full Text Available Copper (Cu electroplating is a mature technology, and has been extensively applied in microelectronic industry. With the development of advanced microelectronic packaging, Cu electroplating encounters new challenges for atomic deposition on a non-planar substrate and to deliver good throwing power and uniform deposit properties in a high-aspect-ratio trench. The use of organic additives plays an important role in modulating the atomic deposition to achieve successful metallic coverage and filling, which strongly relies on the adsorptive and chemical interactions among additives on the surface of growing film. However, the adsorptive characteristic of organic additives inevitably results in an incorporation of additive-derived impurities in the electroplated Cu film. The incorporation of high-level impurities originating from the use of polyethylene glycol (PEG and chlorine ions significantly affects the microstructural evolution of the electroplated Cu film, and the electroplated-Cu solder joints, leading to the formation of undesired voids at the joint interface. However, the addition of bis(3-sulfopropyl disulfide (SPS with a critical concentration suppresses the impurity incorporation and the void formation. In this article, relevant studies were reviewed, and the focus was placed on the effects of additive formula and plating parameters on the impurity incorporation in the electroplated Cu film, and the void formation in the solder joints.

Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints

Science.gov (United States)

Mukherjee, S.; Chauhan, P.; Osterman, M.; Dasgupta, A.; Pecht, M.

2016-07-01

Mechanistic microstructural models have been developed to capture the effect of isothermal aging on time dependent viscoplastic response of Sn3.0Ag0.5Cu (SAC305) solders. SnAgCu (SAC) solders undergo continuous microstructural coarsening during both storage and service because of their high homologous temperature. The microstructures of these low melting point alloys continuously evolve during service. This results in evolution of creep properties of the joint over time, thereby influencing the long term reliability of microelectronic packages. It is well documented that isothermal aging degrades the creep resistance of SAC solder. SAC305 alloy is aged for (24-1000) h at (25-100)°C (~0.6-0.8 × T melt). Cross-sectioning and image processing techniques were used to periodically quantify the effect of isothermal aging on phase coarsening and evolution. The parameters monitored during isothermal aging include size, area fraction, and inter-particle spacing of nanoscale Ag3Sn intermetallic compounds (IMCs) and the volume fraction of micronscale Cu6Sn5 IMCs, as well as the area fraction of pure tin dendrites. Effects of microstructural evolution on secondary creep constitutive response of SAC305 solder joints were then modeled using a mechanistic multiscale creep model. The mechanistic phenomena modeled include: (1) dispersion strengthening by coarsened nanoscale Ag3Sn IMCs in the eutectic phase; and (2) load sharing between pro-eutectic Sn dendrites and the surrounding coarsened eutectic Sn-Ag phase and microscale Cu6Sn5 IMCs. The coarse-grained polycrystalline Sn microstructure in SAC305 solder was not captured in the above model because isothermal aging does not cause any significant change in the initial grain size and orientation of SAC305 solder joints. The above mechanistic model can successfully capture the drop in creep resistance due to the influence of isothermal aging on SAC305 single crystals. Contribution of grain boundary sliding to the creep strain of

Comparison ecological characteristics of mound-building mouse (mus spicilegus in two natural hotbeds of tularemia at North-West coast of the Black sea

Directory of Open Access Journals (Sweden)

І. T. Rusev

2011-03-01

Full Text Available The analysis of ecology-epizootic monitoring of North-West coast of the Black sea carried out in wintering seasons of 2004, 2005 and 2011 testifies the basic role of the Mound-building mouse (Mus spicilegus Petenyi, 1882 as a carrier of Francisella tularensis. Spatial distribution of the Mound-building mouse strongly dependson a biotope, geographical region and weather conditions of a specific season. Mice nests in the storage mounds are located normally at a depth of 20–40 cm under the food storage chamber. Average number of the mice in storage mounds is 3.08 ± 1.54 in the south of investigated region and 3.88 ± 2.63 – in the NE of the region.

Solder bond requirement for large, built-up, high-performance conductors

International Nuclear Information System (INIS)

Willig, R.L.

1981-01-01

Some large built-up conductors fabricated for large superconducting magnets are designed to operate above the maximum recovery current. Because the stability of these conductors is sensitive to the quality of the solder bond joining the composite superconductor to the high-conductivity substrate, a minimum bond requirement is necessary. The present analysis finds that the superconductor is unstable and becomes abruptly resistive when there are temperature excursions into the current sharing region of a poorly bonded conductor. This abrupt transition, produces eddy current heating in the vicinity of the superconducting filaments and causes a sharp reduction in the minimum propagating zone (MPZ) energy. This sensitivity of the MPZ energy to the solder bond contact area is used to specify a minimum bond requirement. For the superconducting MHD magnet built for the Component Development Integration Facility (CDIF), the minimum bonded surface area is .68 cm/sup 2//cm which is 44% of the composite perimeter. 5 refs

On the Origin of the Dragon Image on the Plate from Shilovka Burial Mound

Directory of Open Access Journals (Sweden)

Liphanov Nicolay А.

2017-07-01

Full Text Available The author of the article analyzes an unique image of two opposed dragons engraved on a bone plate discovered in 1992 at barrow No.1 of Shilovka burial mound located on the right bank of the Volga river in Ulyanovsk Oblast (the excavations were conducted by R.S. Bagautdinov. The burial mound is related to the cattle breeding population of late 7th century. The article considers different hypotheses concerning the origin of these dragon images in the artistic traditions of various regions: China (A.V. Komar, D.G. Savinov, B. Totev, Pelevina, Central Asia (V.G. Kotov, V.E. Flyorova, India (N.A. Fonyakova. According to the author, this image has no apparent iconographic parallels in the traditions of these regions. Such analogues are found in the art of the Mediterranean where the ancient images of various mythological creatures exist alongside the image of the sea dragon “ketos” which later became part of the Christian tradition. The appearance of this monster in the images of the first half – middle of the 1st millennium A.D. is practically identical to the dragons from Shilovka burial mound. According to the author, certain impact on the formation of the considered dragon image was made by Iranian art.

In situ investigation of SnAgCu solder alloy microstructure

International Nuclear Information System (INIS)

Pietrikova, Alena; Bednarcik, Jozef; Durisin, Juraj

2011-01-01

Research highlights: → In situ X-ray diffraction investigation enabled detailed analysis of the melting and solidification process of the SAC305 alloy. → It was found that the SAC305 solder melts at 230 deg. C. When cooling from 240 deg. C the SAC305 alloy solidifies at the temperature of 214 deg. C. During solidification β-Sn and Cu 6 Sn 5 is also formed. Formation of Ag 3 Sn occurs at 206 deg. C and the remaining amount of alloy crystallizes approximately at 160 deg. C. → Furthermore, observation of the thermal expansion behaviour of the β-Sn tetragonal unit cell revealed linear dependence of the unit cell volume on temperature. The unit cell parameters a and c also increase linearly with the temperature. Despite the fact that the c parameter is substantially smaller than parameter a, it exhibits a significantly higher linear thermal expansion coefficient. Comparison between data obtained during heating and cooling indicates that the thermal expansion coefficient is slightly greater in the case of cooling. - Abstract: In situ X-ray diffraction experiments, using synchrotron radiation, were employed to analyze microstructure evolution of the 96.5Sn3Ag0.5Cu (wt.%)-SAC305 lead-free solder alloy during heating (30-240 deg. C), isothermal dwell (240 deg. C) and cooling (240-30 deg. C). The special emphasis was placed on the study of the melting and solidification processes, explaining formation, distribution and the order of crystallization of the crystal phases (β-Sn, intermetallic compounds) in the solder alloy. Furthermore, thermal expansion behaviour of the main constituent phase β-Sn was analyzed prior to melting and after the consequent solidification.

Diode Lasers used in Plastic Welding and Selective Laser Soldering - Applications and Products

Science.gov (United States)

Reinl, S.

Aside from conventional welding methods, laser welding of plastics has established itself as a proven bonding method. The component-conserving and clean process offers numerous advantages and enables welding of sensitive assemblies in automotive, electronic, medical, human care, food packaging and consumer electronics markets. Diode lasers are established since years within plastic welding applications. Also, soft soldering using laser radiation is becoming more and more significant in the field of direct diode laser applications. Fast power controllability combined with a contactless temperature measurement to minimize thermal damage make the diode laser an ideal tool for this application. These advantages come in to full effect when soldering of increasingly small parts in temperature sensitive environments is necessary.

Numerical prediction of mechanical properties of Pb-Sn solder alloys containing antimony, bismuth and or silver ternary trace elements

Science.gov (United States)

Gadag, Shiva P.; Patra, Susant

2000-12-01

Solder joint interconnects are mechanical means of structural support for bridging the various electronic components and providing electrical contacts and a thermal path for heat dissipation. The functionality of the electronic device often relies on the structural integrity of the solder. The dimensional stability of solder joints is numerically predicted based on their mechanical properties. Algorithms to model the kinetics of dissolution and subsequent growth of intermetallic from the complete knowledge of a single history of time-temperature-reflow profile, by considering equivalent isothermal time intervals, have been developed. The information for dissolution is derived during the heating cycle of reflow and for the growth process from cooling curve of reflow profile. A simple and quick analysis tool to derive tensile stress-strain maps as a function of the reflow temperature of solder and strain rate has been developed by numerical program. The tensile properties are used in modeling thermal strain, thermal fatigue and to predict the overall fatigue life of solder joints. The numerical analysis of the tensile properties as affected by their composition and rate of testing, has been compiled in this paper. A numerical model using constitutive equation has been developed to evaluate the interfacial fatigue crack growth rate. The model can assess the effect of cooling rate, which depends on the level of strain energy release rate. Increasing cooling rate from normalizing to water-quenching, enhanced the fatigue resistance to interfacial crack growth by up to 50% at low strain energy release rate. The increased cooling rates enhanced the fatigue crack growth resistance by surface roughening at the interface of solder joint. This paper highlights salient features of process modeling. Interfacial intermetallic microstructure is affected by cooling rate and thereby affects the mechanical properties.

Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows

Science.gov (United States)

Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E.; Handwerker, Carol A.

2016-12-01

Controlling the size, dispersion, and stability of intermetallic compounds in lead-free solder alloys is vital to creating reliable solder joints regardless of how many times the solder joints are melted and resolidified (reflowed) during circuit board assembly. In this article, the coarsening behavior of Cu x Al y and Cu6Sn5 in two Sn-Cu-Al alloys, a Sn-2.59Cu-0.43Al at. pct alloy produced via drip atomization and a Sn-5.39Cu-1.69Al at. pct alloy produced via melt spinning at a 5-m/s wheel speed, was characterized after multiple (1-5) reflow cycles via differential scanning calorimetry between the temperatures of 293 K and 523 K (20 °C and 250 °C). Little-to-no coarsening of the Cu x Al y particles was observed for either composition; however, clustering of Cu x Al y particles was observed. For Cu6Sn5 particle growth, a bimodal size distribution was observed for the drip atomized alloy, with large, faceted growth of Cu6Sn5 observed, while in the melt spun alloy, Cu6Sn5 particles displayed no significant increase in the average particle size, with irregularly shaped, nonfaceted Cu6Sn5 particles observed after reflow, which is consistent with shapes observed in the as-solidified alloys. The link between original alloy composition, reflow undercooling, and subsequent intermetallic coarsening behavior was discussed by using calculated solidification paths. The reflowed microstructures suggested that the heteroepitaxial relationship previously observed between the Cu x Al y and the Cu6Sn5 was maintained for both alloys.

Reinforcement of high-risk anastomoses using laser-activated protein solders: a clinical study

Science.gov (United States)

Libutti, Steven K.; Bessler, Marc; Chabot, J.; Bass, Lawrence S.; Oz, Mehmet C.; Auteri, Joseph S.; Kirsch, Andrew J.; Nowygrod, Roman; Treat, Michael R.

1993-07-01

Anastomotic leakage or breakdown can result in catastrophic complications and significantly increased post-operative morbidity and mortality. Certain anastomoses are subject to a higher incidence of disruption and are therefore termed high risk. In an attempt to decrease the risk of anastomotic leaks, we reinforced sutured anastomoses with a laser activated protein solder in patients undergoing esophagojejunostomies (n equals 2), lung transplantation (n equals 2), and pancreaticojejunostomies (Whipple procedure, n equals 5). The protein solder was composed of 1.0 ml of a 25% human albumin solution, 1.0 ml of sodium hyaluronate, and 0.1 ml of Cardiogreen dye. This composition was applied to the sutured anastomosis and activated with an 860 nm pulsed diode laser. Drains were placed when appropriate and patients were followed for up to 10 months post-operatively and assessed for clinical signs of anastomotic leaks. Results to data demonstrated that there were no immediate complications as a result of the procedure. Operative time was not significantly lengthened. There were no cases of clinically significant leakage from any of the reinforced anastomoses. Laser activated protein solders may help to reduce the incidence of leakage in high risk anastomoses. Large numbers of patients and longer follow-up is needed however, to draw significant conclusions.

Do Mound Disturbance and Bait Placement Affect Bait Removal and Treatment Efficacy in Red Imported Fire ant (Hymenoptera: Formicidae at Different Seasons?

Directory of Open Access Journals (Sweden)

Xing P. Hu

2009-01-01

Full Text Available This study provides empirical evidence that disturbing mound immediately before application, as opposed to label recommendation, did not reduce foraging activity of the red imported fire ant, Solenopsis invicta Buren, except for about 10-min delay in foraging. Despite the delayed foraging, there was no significant difference in the amount of baits foraged between disturbed and undisturbed colonies. Eventually, >96% of the baits were foraged, with the maximum removal occurred by 2 and 3 h, respectively, in summer and spring trial. The fastest and great amount of bait removal 1 h post-treatment occurred to baits placed on mound, followed by 0.18–0.3-m from mound base, and the slowest 1.08–1.2-m from mound base. All treatment gave 100% control 1 mo later, regardless of the season, without colony relocation or new colony invasion in the test plots.

Behaviour and Ecological Impacts of Termites: Fecundity Investigations in Mounds

Directory of Open Access Journals (Sweden)

Wako Sutuma Edessa

2015-03-01

Full Text Available A radical study was conducted on the behaviour and ecological impacts of termites in Haru District of Western Oromia, Ethiopia. It was aimed at investigating the natural behaviour, fecundity in mounds, ecological impacts and recommending possible solutions to termite problems. Four mounds in different sites were vertically dug down to display the profile of the queen, soldiers, workers, number of laid eggs, nymphs and colonies of termites. On an average, termite queens of the study site may lay about 25 eggs per minute, 36, 000 eggs per day and 13, 140, 000 eggs annually. The fourth queen was unearthed to study the structure, size, number of ovaries and fecundity. It was examined that the death of a queen does not affect the colony, because four small queens are formed and one of them becomes the queen of queens and replaced the dead queen promptly. Accordingly, termites are found to be one of the most destructive agents of our ecosystems and their management requests careful and biological control methods. As a result, the negative effect of termites outweighs the positive effect of termites so that minimising the population size is important for human beings.

Mound's decommissioning experience, tooling, and techniques

International Nuclear Information System (INIS)

Combs, A.B.; Davis, W.P.; Elswick, T.C.; Garner, J.M.; Geichman, J.R.

1982-01-01

Monsanto Research Corporation (MRC), which operates Mound for the Department of Energy (DOE), has been decommissioning radioactively contaminated facilities since 1949. We are currently decommissioning three plutonium-238 contaminated facilities (approximately 50,000 ft 2 ) that contained 1100 linear ft of gloveboxes; 900 linear ft of conveyor housing; 2650 linear ft of dual underground liquid waste lines; and associated contaminated piping, services, equipment, structures, and soil. As of June 1982, over 29,000 Ci of plutonium-238 have been removed in waste and scrap residues. As a result of the current and previous decommissioning projects, valuable experience has been gained in tooling and techniques. Special techniques have been developed in planning, exposure control, contamination control, equipment removal, structural decontamination, and waste packaging

Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X (X = Bi, In) solders with Cu substrate

International Nuclear Information System (INIS)

Hodulova, Erika; Palcut, Marian; Lechovic, Emil; Simekova, Beata; Ulrich, Koloman

2011-01-01

Highlights: → In substitutes Sn in intermetallic compounds formed at the Cu-solder interface. → Bi and In decrease the parabolic rate constant of Cu 3 Sn layer growth. → In increases the parabolic rate constant of Cu 6 Sn 5 layer growth. → High In concentrations should be avoided since they may lead to a pre-mature solder joint degradation. - Abstract: The effects of Bi and In additions on intermetallic phase formation in lead-free solder joints of Sn-3.7Ag-0.7Cu; Sn-1.0Ag-0.5Cu-1.0Bi and Sn-1.5Ag-0.7Cu-9.5In (composition given in weight %) with copper substrate are studied. Soldering of copper plate was conducted at 250 deg. C for 5 s. The joints were subsequently aged at temperatures of 130-170 deg. C for 2-16 days in a convection oven. The aged interfaces were analyzed by optical microscopy and energy dispersive X-ray spectroscopy (EDX) microanalysis. Two intermetallic layers are observed at the interface - Cu 3 Sn and Cu 6 Sn 5 . Cu 6 Sn 5 is formed during soldering. Cu 3 Sn is formed during solid state ageing. Bi and In decrease the growth rate of Cu 3 Sn since they appear to inhibit tin diffusion through the grain boundaries. Furthermore, indium was found to produce a new phase - Cu 6 (Sn,In) 5 instead of Cu 6 Sn 5 , with a higher rate constant. The mechanism of the Cu 6 (Sn,In) 5 layer growth is discussed and the conclusions for the optimal solder chemical composition are presented.

Recovery of Tin and Nitric Acid from Spent Solder Stripping Solutions

International Nuclear Information System (INIS)

Ahn, Jae-Woo; Ryu, Seong-Hyung; Kim, Tae-young

2015-01-01

Spent solder-stripping solutions containing tin, copper, iron, and lead in nitric acid solution, are by-products of the manufacture of printed-circuit boards. The recovery of these metals and the nitric acid, for re-use has economic and environmental benefits. In the spent solder-stripping solution, a systematic method to determine a suitable process for recovery of valuable metals and nitric acid was developed. Initially, more than 90% of the tin was successfully recovered as high-purity SnO 2 by thermal precipitation at 80 ℃ for 3 hours. About 94% of the nitric acid was regenerated effectively from the spent solutions by diffusion dialysis, after which there remained copper, iron, and lead in solution. Leakage of tin through the anion-exchange membrane was the lowest (0.026%), whereas Pb-leakage was highest (4.26%). The concentration of the regenerated nitric acid was about 5.1 N.

Electromigration-induced cracks in Cu/Sn3.5Ag/Cu solder reaction couple at room temperature

International Nuclear Information System (INIS)

He Hongwen; Xu Guangchen; Guo Fu

2009-01-01

Electromigration (EM) behavior of Cu/Sn 3.5 Ag/Cu solder reaction couple was investigated with a high current density of 5 x 10 3 A/cm 2 at room temperature. One dimensional structure, copper wire/solder ball/copper wire SRC was designed and fabricated to dissipate the Joule heating induced by the current flow. In addition, thermomigration effect was excluded due to the symmetrical structure of the SRC. The experimental results indicated that micro-cracks initially appeared near the cathode interface between solder matrix and copper substrate after 474 h current stressing. With current stressing time increased, the cracks propagated and extended along the cathode interface. It should be noted that the continuous Cu 6 Sn 5 intermetallic compounds (IMCs) layer both at the anode and at the cathode remained their sizes. Interestingly, tiny cracks appeared at the root of some long column-type Cu 6 Sn 5 at the cathode interface due to the thermal stress.

Liver repair and hemorrhage control by using laser soldering of liquid albumin in a porcine model.

Science.gov (United States)

Wadia, Y; Xie, H; Kajitani, M

2000-01-01

We evaluated laser soldering by using liquid albumin for welding liver injuries. Major liver trauma has a high mortality because of immediate exsanguination and a delayed morbidity from septicemia, peritonitis, biliary fistulae, and delayed secondary hemorrhage. Eight laceration (6 x 2 cm) and eight nonanatomic resection injuries (raw surface, 6 x 2 cm) were repaired. An 805-nm laser was used to weld 50% liquid albumin-indocyanine green solder to the liver surface, reinforcing it with a free autologous omental scaffold. The animals were heparinized and hepatic inflow occlusion was used for vascular control. All 16 soldering repairs were evaluated at 3 hours. All 16 laser mediated liver repairs had minimal blood loss as compared with the suture controls. No dehiscence, hemorrhage, or bile leakage was seen in any of the laser repairs after 3 hours. Laser fusion repair of the liver is a reliable technique to gain hemostasis on the raw surface as well as weld lacerations. Copyright 2000 Wiley-Liss, Inc.

A review of typical thermal fatigue failure models for solder joints of electronic components

Science.gov (United States)

Li, Xiaoyan; Sun, Ruifeng; Wang, Yongdong

2017-09-01

For electronic components, cyclic plastic strain makes it easier to accumulate fatigue damage than elastic strain. When the solder joints undertake thermal expansion or cold contraction, different thermal strain of the electronic component and its corresponding substrate is caused by the different coefficient of thermal expansion of the electronic component and its corresponding substrate, leading to the phenomenon of stress concentration. So repeatedly, cracks began to sprout and gradually extend [1]. In this paper, the typical thermal fatigue failure models of solder joints of electronic components are classified and the methods of obtaining the parameters in the model are summarized based on domestic and foreign literature research.

The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/OSP Cu solder joint

Energy Technology Data Exchange (ETDEWEB)

Fleshman, Collin; Chen, Wei-Yu; Chou, Tzu-Ting [Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan (China); Huang, Jia-Hong [Department of Engineering and System Science, National Tsing Hua University, Hsinchu, Taiwan (China); Duh, Jenq-Gong, E-mail: jgd@mx.nthu.edu.tw [Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan (China)

2017-03-01

In this study, the slow speed shear test in both Sn-3.0Ag-0.5Cu (wt%)/OSP Cu and Sn-3.0Ag-0.5Cu-0.1Ni (wt%)/OSP Cu assembly with the ball heights of 300 μm and the corresponding grain structures were investigated. With the aid of Electron Back Scattering Diffraction (EBSD) analysis, single grain structure was observed in Sn-3.0Ag-0.5Cu/OSP Cu. Besides, Ni was found to control the grain structure in Sn-3.0Ag-0.5Cu-0.1Ni solder balls, showing multiple grains with partially interlaced structure. The grain variation resulted from larger undercooling caused by smaller ball size and Ni-dopant induced tiny intermetallic compounds (IMCs). IMCs serve as heterogeneous nucleation sites for β-tin and thus alter the grain structure of solder balls. The results of shear test reveal that the peak force of solder joints was efficiently enhanced by the addition of Ni. The enhancement of mechanical strength was attributed to the modification of grain structure by the introduction of Ni dopant. It is believed that the smaller grains, tiny intermetallic compounds, and the oriented interlaced area in Ni-doped solder joints became energy barriers for propagation of cracks and dislocations. It is demonstrated that Ni-doped solder joints tend to exhibit better mechanical reliability in advanced electronic packaging. - Highlights: • The grain structure and slow speed shear test performance were investigated. • Doping Ni into solder induce interlaced grain structure. • Interlaced structure can enhance mechanical reliability in BGA packaging.

Focused risk assessment: Mound Plant, Miami-Erie Canal Operable Unit 4

International Nuclear Information System (INIS)

Rogers, D.R.; Dunning, D.F.

1994-01-01

In 1969, an underground waste line at Mound Plant ruptured and released plutonium-238 in a dilute nitric acid solution to the surrounding soils. Most of the acid was neutralized by the native soils. The plutonium, which in a neutral solution is tightly sorbed onto clay particles, remained within the spill area. During remediation, a severe storm eroded some of the contaminated soil. Fine grained plutonium-contaminated clay particles were carried away through the natural drainage courses to the remnants of the Miami-Erie Canal adjacent to Mound Plant, and then into the Great Miami River. This focused risk assessment considers exposure pathways relevant to site conditions, including incidental ingestion of contaminated soils, ingestion of drinking water and fish, and inhalation of resuspended soils and sediments. For each potential exposure pathway, a simplified conceptual model and exposure scenarios have been used to develop conservative estimates of potential radiation dose equivalents and health risks. The conservatism of the dose and risk estimates provides a substantive margin of safety in assuring that the public health is protected

Prospects of Coir Fibre as Reinforcement in Termite Mound Clay Bricks

Directory of Open Access Journals (Sweden)

Akinyemi Banjo A.

2016-09-01

Full Text Available The study is to develop an appropriate environmental friendly building material that would be sourced, obtained locally and used for construction of structures at a low cost by using termite mound soil, reinforced with 0%, 1%, 2%, 3%. and 4% coir fibres. Physical and mechanical tests were conducted on the different composition samples after curing. The particle size distribution showed that clay had the largest percentage with a moisture content of 3.53%, specific gravity of 2.0, liquid limit of 30.5% and plastic limit value of 25.4. The compressive strength test showed a decrease with increase in fibre content from 1% upward, modulus of rupture test showed that increase in fibre content leads to a corresponding increase in rupture while the modulus of elasticity test showed that from 3% to 4% fibre content, a decrease in the elasticity occurred. It can be concluded that low fibre inclusion into compressed termite mound brick is feasible if fibre content do not exceed 2% and thus can be used for both load and non-loading bearing structures.

Geoarchaeological research on Bronze Age settlement mounds in the Kolkheti lowlands at the Black Sea coast of Georgia

Science.gov (United States)

Laermanns, Hannes; Heisterkamp, Arne; Kirkitadze, Giorgi; Elashvili, Mikheil; Verheul, Jan; Kelterbaum, Daniel; Helmut, Brückner

2016-04-01

0.0.1 Situated between the Rivers Enguri in the north and Khobistsqali in the south, more than 20 settlement mounds (local name Dikhagudzuba), identified by field survey and remote sensing techniques, give evidence of a densely populated landscape in the coastal lowlands of eastern Georgia during the Bronze Age. While the existing chronology of these mounds is based on ceramic evidence obtained during a previous archaeological research, only limited information is available on their internal architecture and their palaeoenvironmental context, and the chronology of the different layers is as yet lacking. 0.0.2 Within the framework of a geoarchaeological research project, we carried out eleven vibracores on and in direct vicinity of three of the most prominent mounds, situated close to the villages of Orulu and Ergeta. Based on these sediment cores, our study aims at (i) establishing a chronostratigraphical framework for the settlements based on radiocarbon dating; (ii) reconstructing possible phases and gaps of occupation; and (iii) identifying the environmental conditions during the time of their existence. Geochemical and sedimentological analyses were carried out to decipher element contents (XRF), granulometry, and organic contents (LOI, C/N) of sediment samples, supporting the interpretation of the mounds' stratigraphical evolution and related human occupation. The three investigated settlement mounds are similar in dimension and stratigraphy, and different settlement layers could be identified in each of them. The 14C age estimates indicate that their formation occurred during the second half of the 3rd and the first half of the 2nd millennium BC, thus confirming the archaeological interpretation of their Bronze Age origin. Based on the granulometric and geochemical data, palaeoenvironmental conditions in the vicinity of the settlements were dominated by fluvial processes.

Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloy

DEFF Research Database (Denmark)

Malik, Safdar Abbas; Le, Thanh Hung; Van Nong, Ngo

2018-01-01

and metallic electrodes. In this paper, we investigate the joining of ZnSb to Ni and Ag electrodes using a commercial solder alloy S-Bond 400 and hot-pressing technique. Ti and Cr layers are also introduced as a diffusion barrier and microstructure at the interfaces is observed by scanning electron microscopy....... We found that S-bond 400 solder reacts with Ag and Ni electrodes to form different alloys at the interfaces. Cr layer was found to be broken after joining, resulting in a thicker reaction/diffusion layer at the interface, while Ti layer was preserved....

Stable isotope sales: Mound Laboratory customer and shipment summaries, FY-1975

International Nuclear Information System (INIS)

Eck, C.F.

1976-01-01

A listing is given of Mound Laboratory's sales of stable isotopes of noble gases, carbon, oxygen, nitrogen, and sulfur for Fiscal Year 1975. Purchasers are listed alphabetically and are divided into domestic and foreign groups. A cross reference index by location is included for domestic customers. Cross reference listings by isotope purchased are included for all customers

Stable isotope sales: Mound Facility customer and shipment summaries, FY 1981

International Nuclear Information System (INIS)

Ruwe, A.H. Jr.

1982-01-01

A listing is given of Mound Facility's sales of stable isotopes of noble gases, carbon, oxygen, nitrogen, chlorine, and sulfur for Fiscal Year 1981. Purchasers are listed alphabetically and are divided into domestic and foreign groups. A cross-reference index by location is included for domestic customers. Cross-reference listings by isotope purchased are included for all customers

Stable isotope sales; Mound Facility customer and shipment summaries, FY 1977

International Nuclear Information System (INIS)

Ruwe, A.H. Jr.

1978-01-01

A listing is given of Mound Facility's sales of stable isotopes of noble gases, carbon, oxygen, nitrogen, chlorine, and sulfur for Fiscal Year 1977. Purchasers are listed alphabeticaly and are divided into domestic and foreign groups. A cross-reference index by location is included for domestic customers. Cross-reference listings by isotope purchased are included for all customers

POTENTIAL IMPACT OF BLENDING RESIDUAL SOLIDS FROM TANKS 18/19 MOUNDS WITH TANK 7 OPERATIONS

Energy Technology Data Exchange (ETDEWEB)

Eibling, R; Erich Hansen, E; Bradley Pickenheim, B

2007-03-29

High level waste tanks 18F and 19F have residual mounds of waste which may require removal before the tanks can be closed. Conventional slurry pump technology, previously used for waste removal and tank cleaning, has been incapable of removing theses mounds from tanks 18F and 19F. A mechanical cleaning method has been identified that is potentially capable of removing and transferring the mound material to tank 7F for incorporation in a sludge batch for eventual disposal in high level waste glass by the Defense Waste Processing Facility. The Savannah River National Laboratory has been requested to evaluate whether the material transferred from tanks 18F/19F by the mechanical cleaning technology can later be suspended in Tank 7F by conventional slurry pumps after mixing with high level waste sludge. The proposed mechanical cleaning process for removing the waste mounds from tanks 18 and 19 may utilize a high pressure water jet-eductor that creates a vacuum to mobilize solids. The high pressure jet is also used to transport the suspended solids. The jet-eductor system will be mounted on a mechanical crawler for movement around the bottom of tanks 18 and 19. Based on physical chemical property testing of the jet-eductor system processed IE-95 zeolite and size-reduced IE-95 zeolite, the following conclusions were made: (1) The jet-eductor system processed zeolite has a mean and median particle size (volume basis) of 115.4 and 43.3 microns in water. Preferential settling of these large particles is likely. (2) The jet-eductor system processed zeolite rapidly generates settled solid yield stresses in excess of 11,000 Pascals in caustic supernates and will not be easily retrieved from Tank 7 with the existing slurry pump technology. (3) Settled size-reduced IE-95 zeolite (less than 38 microns) in caustic supernate does not generate yield stresses in excess of 600 Pascals in less than 30 days. (4) Preferential settling of size-reduced zeolite is a function of the amount of

Influence of intermetallic growth on the mechanical properties of Zn–Sn–Cu–Bi/Cu solder joints

Energy Technology Data Exchange (ETDEWEB)

Xing, Fei; Yao, Jia; Liang, Jingwei; Qiu, Xiaoming, E-mail: qiuxm13@163.com

2015-11-15

The formation of intermetallic reaction layers and their influence on shear strength and fractography was investigated between the Zn–Sn–Cu–Bi (ZSCB) and Cu substrate during the liquid state reaction at 450 °C after 10–90 s. Results showed that reliable solder joints could be obtained at 450 °C after 15–30 s of wetting, accompanied by the creation of scallop ε-CuZn{sub 5}, flat γ-Cu{sub 5}Zn{sub 8} and β-CuZn intermetallic layers in ZSCB/Cu interface. However, with excess increase of soldering time, a transient intermetallic ε-CuZn{sub 4} phase was nuclear and grew at ε-CuZn{sub 5}/γ-Cu{sub 5}Zn{sub 8} interface, which apparently deteriorated the shear strength of solder joints from 76.5 MPa to 51.6 MPa. The sensitivity of the fracture proportion was gradually transformed from monotonic ε-CuZn{sub 5} to the mixture of ε-CuZn{sub 4} and ε-CuZn{sub 5} intermetallic cleavage. Furthermore, the growth mechanism of ε-CuZn{sub 4} intermetallic phase at the ZSCB/Cu interface was discussed. - Highlights: • There are four interfacial intermetallic layers formed at the Zn–Sn–Cu–Bi/Cu interface. • The growth mechanism of ε-CuZn{sub 4} intermetallic phase was discussed. • The wetting time of Zn–Sn–Cu–Bi solder in contact with Cu substrate is a key parameter.

Interactions of Cu-substrates with titanium-alloyed Sn-Zn solders

Directory of Open Access Journals (Sweden)

Soares D.

2006-01-01

Full Text Available The interactions of copper substrate with titanium-alloyed Sn-Zn eutectic solders have been studied. Two series of experiments have been performed. The first one consisted in differential thermal analyses of Sn-Zn nearly eutectic alloys containing from 1.3 to 2.2 wt. % Ti. Diffusion couples consisted of Cu-wires and Sn-Zn-Ti liquid solders, produced at 250 and 275 OC have been prepared in the second series,. The contact times were up to 3600 s. The contact zones have been characterized by optical and scanning electron microscope. Two layers have been found along the interfaces solid/liquid. The first and the second layers are identical, respectively, with γ and ε phases of the Cu-Zn system. No changes of the chemical compositions were detected for the tested temperatures and reaction times. Continuous parabolic growth of the total diffusion zone thickness with the time of diffusion is observed. The growth is due mainly to one the formed layers (γ while the thickness of the ε-phase layer, stays almost constant for all tested diffusion times and temperatures.

Circuit reliability boosted by soldering pins of disconnect plugs to sockets

Science.gov (United States)

Pierce, W. B.

1964-01-01

Where disconnect pins must be used for wiring and testing a circuit, improved system reliability is obtained by making a permanent joint between pins and sockets of the disconnect plug. After the circuit has been tested, contact points may be fused through soldering, brazing, or welding.

On the Choice of Structure and Layout of Rubble Mound Breakwater Heads

DEFF Research Database (Denmark)

Maciñeira, Enrique; Burcharth, Hans F.

2006-01-01

 The paper discusses the various functional, environmental and structural conditions to consider related to the choice of breakwater head type. Results from hydraulic model tests of rubble mound and caisson head solutions for the new deep water port at Punto Langosteira, La Coruña, Spain, are pre...

The Influence of Slope and Shelf Contour Currents On The Growth Pattern of A Cold-water Coral Mound Population Along The Margins of The Rockall Trough

Science.gov (United States)

Readman, P. W.; O'Reilly, B. M.; Shannon, P. M.; Jacob, A. W. B.

The importance of bottom currents along the shelf and slope regions of northeast At- lantic basin margins in controlling sediment transport patterns and the development of carbonate mound ecosystems is now well recognised. The detailed structure of one such large carbonate mound population has been resolved along the western margin of the Porupine Bank west of Ireland with deep-tow (TOBI) sidescan. The mounds which comprise the population are circular to elliptical in shape, 50 - 850 m across and up to about 200 m high. Large scale sedimentary bedforms at 800 m water depth are inferred from backscatter zonation produced by strong NE-flowing contour currents. Streamlining effects control the shape of the mounds as they become more elliptical as their size increases. The frequency distribution follows a general power law which is determined by the biological growth rate of the mounds and the rate at which they colonise the substrate. At first bottom currents aid mound growth until they become so large that hydraulic drag forces retard their growth. In the recent past (late Pleistocene to present) if the number of mounds colonising the slope has increased exponentially with time while their growth rate slowed in response to fluid form drag forces, the observed population curve can be recovered. A model for evolution of the population predicts that these increased forces slow biological growth and cause a sharp fall-off in the number of mounds, also in agreement with observation. Correlation with late Pleistocene and Holocene climatic change suggests that the population is either very robust and relatively insensitive to major environmental change along the continental slope such as a change in current regime, or that the factors controlling its develop- ment were stable over large time intervals. This project was undertaken on behalf of the Irish Petroleum Infrastructure Programme.

Columbia Estuary Ecosystem Restoration Program: Restoration Design Challenges for Topographic Mounds, Channel Outlets, and Reed Canarygrass

Energy Technology Data Exchange (ETDEWEB)

Diefenderfer, Heida L. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Borde, Amy B. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Sinks, Ian A. [Columbia Land Trust, Vancouver, WA (United States); Cullinan, Valerie I. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Zimmerman, Shon A. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States)

2016-08-31

The purpose of this study was to provide science-based information to practitioners and managers of restoration projects in the Columbia Estuary Ecosystem Restoration Program (CEERP) regarding aspects of restoration techniques that currently pose known challenges and uncertainties. The CEERP is a program of the Bonneville Power Administration (BPA) and the U.S. Army Corps of Engineers (Corps), Portland District, in collaboration with the National Marine Fisheries Service and five estuary sponsors implementing restoration. The estuary sponsors are Columbia Land Trust, Columbia River Estuary Study Taskforce, Cowlitz Tribe, Lower Columbia Estuary Partnership, and Washington Department of Fish and Wildlife. The scope of the research conducted during federal fiscal year 2015 included three aspects of hydrologic reconnection that were selected based on available scientific information and feedback from restoration practitioners during project reviews: the design of mounds (also called hummocks, peninsulas, or berms); the control of reed canarygrass (Phalaris arundinaceae); and aspects of channel network design related to habitat connectivity for juvenile salmonids.

Electrochemical Behavior of Sn-9Zn- xTi Lead-Free Solders in Neutral 0.5M NaCl Solution

Science.gov (United States)

Wang, Zhenghong; Chen, Chuantong; Jiu, Jinting; Nagao, Shijo; Nogi, Masaya; Koga, Hirotaka; Zhang, Hao; Zhang, Gong; Suganuma, Katsuaki

2018-05-01

Electrochemical techniques were employed to study the electrochemical corrosion behavior of Sn-9Zn- xTi ( x = 0, 0.05, 0.1, 0.2 wt.%) lead-free solders in neutral 0.5M NaCl solution, aiming to figure out the effect of Ti content on the corrosion properties of Sn-9Zn, providing information for the composition design of Sn-Zn-based lead-free solders from the perspective of corrosion. EIS results reveal that Ti addition was involved in the corrosion product layer and changed electrochemical interface behavior from charge transfer control process to diffusion control process. The trace amount of Ti addition (0.05 wt.%) can refine the microstructure and improve the corrosion resistance of Sn-9Zn solder, evidenced by much lower corrosion current density ( i corr) and much higher total resistance ( R t). Excess Ti addition (over 0.1 wt.%) led to the formation of Ti-containing IMCs, which were confirmed as Sn3Ti2 and Sn5Ti6, deteriorating the corrosion resistance of Sn-9Zn- xTi solders. The main corrosion products were confirmed as Sn3O(OH)2Cl2 mixed with small amount of chlorine/oxide Sn compounds.

Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

Directory of Open Access Journals (Sweden)

Jinhua Mi

2014-01-01

Full Text Available Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated. The type-I interval censored lifetime data were collected from a thermal cycling test, which was implemented on microelectronic packaging with lead-free ball grid array (BGA and fine-pitch ball grid array (FBGA interconnection structures. The number of cycles to failure of lead-free solder joints is predicted by using a modified Engelmaier fatigue life model and a type-I censored data processing method. Then, the Pan model is employed to calculate the acceleration factor of this test. A comparison of life predictions between the proposed method and the ones calculated directly by Matlab and Minitab is conducted to demonstrate the practicability and effectiveness of the proposed method. At last, failure analysis and microstructure evolution of lead-free solders are carried out to provide useful guidance for the regular maintenance, replacement of substructure, and subsequent processing of electronic products.

Ecosystem engineering creates a direct nutritional link between 600-m deep cold-water coral mounds and surface productivity

Science.gov (United States)

Soetaert, Karline; Mohn, Christian; Rengstorf, Anna; Grehan, Anthony; van Oevelen, Dick

2016-10-01

Cold-water corals (CWCs) form large mounds on the seafloor that are hotspots of biodiversity in the deep sea, but it remains enigmatic how CWCs can thrive in this food-limited environment. Here, we infer from model simulations that the interaction between tidal currents and CWC-formed mounds induces downwelling events of surface water that brings organic matter to 600-m deep CWCs. This positive feedback between CWC growth on carbonate mounds and enhanced food supply is essential for their sustenance in the deep sea and represents an example of ecosystem engineering of unparalleled magnitude. This ’topographically-enhanced carbon pump’ leaks organic matter that settles at greater depths. The ubiquitous presence of biogenic and geological topographies along ocean margins suggests that carbon sequestration through this pump is of global importance. These results indicate that enhanced stratification and lower surface productivity, both expected consequences of climate change, may negatively impact the energy balance of CWCs.

Landward Distribution of Wave Overtopping for Rubble Mound Breakwaters

DEFF Research Database (Denmark)

Andersen, Thomas Lykke; Burcharth, Hans F.

2006-01-01

Overtopping data from seven model test projects has been analyzed with respect to the landward spatial distribution of the overtopping discharge. In total more than 1000 overtopping tests have been analysed and a formula derived for prediction of the landward distribution of overtopping behind...... rubble mound structures with a super structure. The analysis led to the conclusion that although the overtopping discharge, for identical wave heights, decreases with increasing wave steepness, then the maximum travel distance increases with increasing wave steepness....

Mechanical performances of lead-free solder joint connections with applications in the aerospace domain

Directory of Open Access Journals (Sweden)

Georgiana PADURARU

2016-03-01

Full Text Available The paper presents some theoretical and experimental aspects regarding the tribological performances of lead-free solder joint connections, with application in the aerospace domain. In order to highlight the mechanical and tribological properties of solder joint in correlation with different pad finishes, there were made some mechanical determinations using a dedicated Share Test System. The theoretical model highlights the link between the experimental results and the influence of gravitational acceleration on the mechanical and functional integrity of the electronic assemblies that works in vibration environment. The paper novelty is provided by the interdisciplinary experiment that offers results that can be used in the mechanical, tribological, electronical and aerospace domains.

Fatigue damage modeling in solder interconnects using a cohesive zone approach

NARCIS (Netherlands)

Abdul-Baqi, A.J.J.; Schreurs, P.J.G.; Geers, M.G.D.

2005-01-01

The objective of this work is to model the fatigue damage process in a solder bump subjected to cyclic loading conditions. Fatigue damage is simulated using the cohesive zone methodology. Damage is assumed to occur at interfaces modeled through cohesive zones in the material, while the bulk material

Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package

OpenAIRE

Koo, Ja-Myeong; Jung, Seung-Boo

2007-01-01

Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/5920); International audience; Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafte...

Crystal plasticity finite element analysis of deformation behaviour in SAC305 solder joint

Science.gov (United States)

Darbandi, Payam

Due to the awareness of the potential health hazards associated with the toxicity of lead (Pb), actions have been taken to eliminate or reduce the use of Pb in consumer products. Among those, tin (Sn) solders have been used for the assembly of electronic systems. Anisotropy is of significant importance in all structural metals, but this characteristic is unusually strong in Sn, making Sn based solder joints one of the best examples of the influence of anisotropy. The effect of anisotropy arising from the crystal structure of tin and large grain microstructure on the microstructure and the evolution of constitutive responses of microscale SAC305 solder joints is investigated. Insights into the effects of key microstructural features and dominant plastic deformation mechanisms influencing the measured relative activity of slip systems in SAC305 are obtained from a combination of optical microscopy, orientation imaging microscopy (OIM), slip plane trace analysis and crystal plasticity finite element (CPFE) modeling. Package level SAC305 specimens were subjected to shear deformation in sequential steps and characterized using optical microscopy and OIM to identify the activity of slip systems. X-ray micro Laue diffraction and high energy monochromatic X-ray beam were employed to characterize the joint scale tensile samples to provide necessary information to be able to compare and validate the CPFE model. A CPFE model was developed that can account for relative ease of activating slip systems in SAC305 solder based upon the statistical estimation based on correlation between the critical resolved shear stress and the probability of activating various slip systems. The results from simulations show that the CPFE model developed using the statistical analysis of activity of slip system not only can satisfy the requirements associated with kinematic of plastic deformation in crystal coordinate systems (activity of slip systems) and global coordinate system (shape changes

Life cycle assessment (LCA of lead-free solders from the environmental protection aspect

Directory of Open Access Journals (Sweden)

Mitovski Aleksandra M.

2009-01-01

Full Text Available Life-cycle assessment (LCA presents a relatively new approach, which allows comprehensive environmental consequences analysis of a product system over its entire life. This analysis is increasingly being used in the industry, as a tool for investigation of the influence of the product system on the environment, and serves as a protection and prevention tool in ecological management. This method is used to predict possible influences of a certain material to the environment through different development stages of the material. In LCA, the product systems are evaluated on a functionally equivalent basis, which, in this case, was 1000 cubic centimeters of an alloy. Two of the LCA phases, life-cycle inventory (LCA and life-cycle impact assessment (LCIA, are needed to calculate the environmental impacts. Methodology of LCIA applied in this analysis aligns every input and output influence into 16 different categories, divided in two subcategories. The life-cycle assessment reaserch review of the leadfree solders Sn-Cu, SAC (Sn-Ag-Cu, BSA (Bi-Sb-Ag and SABC (Sn-Ag-Bi-Cu respectively, is given in this paper, from the environmental protection aspect starting from production, through application process and finally, reclamation at the end-of-life, i.e. recycling. There are several opportunities for reducing the overall environmental and human health impacts of solder used in electronics manufacturing based on the results of the LCA, such as: using secondary metals reclaimed through post-industrial recycling; power consumption reducing by replacing older, less efficient reflow assembly equipment, or by optimizing the current equipment to perform at the elevated temperatures required for lead-free soldering, etc. The LCA analysis was done comparatively in relation to widely used Sn-Pb solder material. Additionally, the impact factors of material consumption, energy use, water and air reserves, human health and ecotoxicity have been ALSO considered including

Construction, Maintenance and Repair as Elements in Rubble Mound Breakwater Design

DEFF Research Database (Denmark)

Burcharth, Hans F.; Rietveld, C.F.W.

Very often rubble mound breakwater designs seem to be a result only of stability considerations corresponding to design wave conditions. Designers tend to put too little emphasis on practical problems related to construction, maintenance and repair. As is discussed in the paper due consideration...... of these problems Ieeds to a more economical design in terms of lower total costs during the structural lifetime....

Sutureless liver repair and hemorrhage control using laser-mediated fusion of human albumin as a solder.

Science.gov (United States)

Wadia, Y; Xie, H; Kajitani, M

2001-07-01

Major liver trauma has a high mortality because of immediate exsanguination and a delayed morbidity from septicemia, peritonitis, biliary fistulae, and delayed secondary hemorrhage. We evaluated laser soldering using liquid albumin for welding liver injuries. Fourteen lacerations (6 x 2 cm) and 13 nonanatomic resection injuries (raw surface, 8 x 2 cm) were repaired. An 805-nm laser was used to weld 53% liquid albumin-indocyanine green solder to the liver surface, reinforcing it by welding a free autologous omental scaffold. The animals were heparinized and hepatic inflow occlusion was used for vascular control. For both laceration and resection injuries, 16 soldering repairs were evaluated acutely at 3 hours. Eleven animals were evaluated chronically, two at 2 weeks and nine at 4 weeks. All 27 laser mediated-liver repairs had minimal blood loss compared with the suture controls. No dehiscence, hemorrhage, or bile leakage was seen in any of the laser repairs after 3 hours. All 11 chronic repairs healed without complication. This modality effectively seals the liver surface, joins lacerations with minimal thermal injury, and works independently of the patient's coagulation status.

Long-term baited lander experiments at a cold-water coral community on Galway Mound (Belgica Mound Province, NE Atlantic)

Science.gov (United States)

Lavaleye, Marc; Duineveld, Gerard; Bergman, Magda; van den Beld, Inge

2017-11-01

A long-term lander employing a baited camera system was developed to study temporal variation in the presence of scavenging fish and invertebrates at a cold-water coral community on Galway Mound (Belgica Mound Province, NE Atlantic). The camera system was tested during two successful long-term deployments for periods of 6 and 12 months respectively. The baited system, consisting of two separate video cameras with infrared lights and a bait dispenser with 24 bait positions, recorded more than 15,500 clips of 17 s, regularly spread over both periods. New bait, consisting of sardines in oil, was offered at regular time intervals, and attracted scavengers over the whole period of deployment, and especially the crab Chaceon affinis did still eat from it till the end of the deployments. However, the attractiveness for some scavengers, i.e. amphipods, diminished quite quickly. In addition to invertebrate scavengers, namely C. affinis, two other crab species, amphipods, a shrimp and a starfish, also 7 species of fish were recorded near the bait, of which Lepidion eques was by far the most common. Though there was no concrete evidence for seasonal patterns, the observations showed substantial temporal variation in the abundance of several species, especially the crabs C. affinis and Bathynectes maravigna and the fish Phycis blennoides. It is concluded that long-term deployments of such a baited camera system can produce novel data. For instance such a system could be employed for monitoring impacts of disturbances on the deep-sea floor (e.g. mining), as we infer that mobile scavengers will be among the first organisms to show a visible reaction to any chemically and physically (noise, vibrations) alteration of the environment similar to a mine canary.

Assessment of the effects of the Japanese shift to lead-free solders and its impact on material substitution and environmental emissions by a dynamic material flow analysis

International Nuclear Information System (INIS)

Fuse, Masaaki; Tsunemi, Kiyotaka

2012-01-01

Lead-free electronics has been extensively studied, whereas their adoption by society and their impact on material substitution and environmental emissions are not well understood. Through a material flow analysis (MFA), this paper explores the life cycle flows for solder-containing metals in Japan, which leads the world in the shift to lead-free solders in electronics. The results indicate that the shift has been progressing rapidly for a decade, and that substitutes for lead in solders, which include silver and copper, are still in the early life cycle stages. The results also show, however, that such substitution slows down during the late life cycle stages owing to long electronic product lifespans. This deceleration of material substitution in the solder life cycle may not only preclude a reduction in lead emissions to air but also accelerate an increase in silver emissions to air and water. As an effective measure against ongoing lead emissions, our scenario analysis suggests an aggressive recycling program for printed circuit boards that utilizes an existing recycling scheme. -- Highlights: ► We model the life cycle flows for solder-containing metals in Japan. ► The Japanese shift to lead-free solders progresses rapidly for a decade. ► Substitution for lead in solders slows down during the late life cycle stages. ► The deceleration of substitution precludes a reduction in lead emissions to air.

Struvite for composting of agricultural wastes with termite mound: Utilizing the unutilized.

Science.gov (United States)

Karak, Tanmoy; Sonar, Indira; Nath, Jyoti Rani; Paul, Ranjit Kumar; Das, Sampa; Boruah, Romesh Kumar; Dutta, Amrit Kumar; Das, Kuntal

2015-01-01

Although, compost is the store house of different plant nutrients, there is a concern for low amount of major nutrients especially nitrogen content in prepared compost. The present study deals with preparation of compost by using agricultural wastes with struvite (MgNH4PO4·6H2O) along with termite mound. Among four composting mixtures, 50kg termite mound and 2.5kg struvite with crop residues (stover of ground nut: 361.65kg; soybean: 354.59kg; potato: 357.67kg and mustard: 373.19kg) and cow dung (84.90kg) formed a good quality compost within 70days of composting having nitrogen, phosphorus and potassium as 21.59, 3.98 and 34.6gkg(-1), respectively. Multivariate analysis of variance revealed significant differences among the composts. The four composts formed two (pit 1, pit 2 and pit 3, pit 4) different groups. Two principal components expressed more than 97% of the total variability. Hierarchical cluster analysis resulted two homogeneous groups of composts. Copyright © 2015 Elsevier Ltd. All rights reserved.

Critiques of the seismic hypothesis and the vegetation stabilization hypothesis for the formation of Mima mounds along the western coast of the U.S.

Science.gov (United States)

Gabet, Emmanuel J.; Burnham, Jennifer L. Horwath; Perron, J. Taylor

2016-09-01

A recent paper published in Geomorphology by Gabet et al. (2014) presents the results of a numerical model supporting the hypothesis that burrowing mammals build Mima mounds - small, densely packed hillocks found primarily in the western United States. The model is based on field observations and produces realistic-looking mounds with spatial distributions similar to real moundfields. Alternative explanations have been proposed for these Mima mounds, including formation by seismic shaking and vegetation-controlled erosion and deposition. In this short communication, we present observations from moundfields in the coastal states of the western U.S. that are incompatible with these alternative theories.

Tin-silver and tin-copper alloys for capillarity joining-soft soldering-of copper piping

International Nuclear Information System (INIS)

Duran, J.; Amo, J. M.; Duran, C. M.

2001-01-01

It is studied the influence of the type of alloy used as filling material on the defects of the soldering joints in copper piping installations, which induce the fluid leak of the systems. The different eutectic temperatures and solidus-liquidus ranges of these alloys, require the setting of the soldering heat input in each case to obtain the suitable capillarity features and alloying temperatures to achieve for the correct formation of the bonding. Most defects in the joints are demonstrated to be generated by bad dossification of thermal inputs, which led depending on the filler alloy used to variations in its fluidity that may produce penetration failures in the bonds or insufficient consistency for the filling of the joints. (Author) 7 refs

Composting of cow dung and crop residues using termite mounds as bulking agent.

Science.gov (United States)

Karak, Tanmoy; Sonar, Indira; Paul, Ranjit K; Das, Sampa; Boruah, R K; Dutta, Amrit K; Das, Dilip K

2014-10-01

The present study reports the suitability of termite mounds as a bulking agent for composting with crop residues and cow dung in pit method. Use of 50 kg termite mound with the crop residues (stover of ground nut: 361.65 kg; soybean: 354.59 kg; potato: 357.67 kg and mustard: 373.19 kg) and cow dung (84.90 kg) formed a good quality compost within 70 days of composting having nitrogen, phosphorus and potassium as 20.19, 3.78 and 32.77 g kg(-1) respectively with a bulk density of 0.85 g cm(-3). Other physico-chemical and germination parameters of the compost were within Indian standard, which had been confirmed by the application of multivariate analysis of variance and multivariate contrast analysis. Principal component analysis was applied in order to gain insight into the characteristic variables. Four composting treatments formed two different groups when hierarchical cluster analysis was applied. Copyright © 2014 Elsevier Ltd. All rights reserved.

Markers of Soil Organic Matter Transformation in Permafrost Peat Mounds of Northeastern Europe

Science.gov (United States)