Sample records for solder mound called

  1. Reaction Between Thin Gold Wires and Pb-Sn-In Solder (37.5%, 37.5%, 25%), Part A: The Radial Reaction Inside The Solder Mounds, Its Linear Reaction Model, Statistical Variation of Reaction Rate, and Induced Structural Changes In The Solder Mounds.

    Siekhaus, W J


    Thermodynamics favors the reaction between indium and gold, since the heat of formation of AuIn{sub 2} is 6 kcal/mole, substantially larger than the heat of formation of any other possible reaction product. Thermodynamic equilibrium between gold and the elements in the solder mound is reached only when ALL gold is converted to AuIn{sub 2}. There are two aspects to this conversion: (A) the reaction WITHIN the solder mound (called here 'radial reaction') and (B) the reaction OUTSIDE the solder mound (called here 'axial reaction') and the transition from (A) to (B). The reaction between thin gold detonator wires and the In/Pb/Sn solder mound in older detonators has been looked at repeatedly. There are, in addition, two studies which look at the reaction between indium and gold in planar geometry. All data are shown in tables I to V. It is the objective of this section dealing with aspect (A), to combine all of these results into a reaction model and to use this reaction model to reliably and conservatively predict the gold-solder reaction rate of soldered gold bridge-wires as a function of storage temperature and time.

  2. Soldering handbook

    Vianco, Paul T


    Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

  3. Wave soldering with Pb-free solders

    Artaki, I.; Finley, D.W.; Jackson, A.M.; Ray, U. [AT and T Bell Labs., Princeton, NJ (United States); Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)


    The manufacturing feasibility and attachment reliability of a series of newly developed lead-free solders were investigated for wave soldering applications. Some of the key assembly aspects addressed included: wettability as a function of board surface finish, flux activation and surface tension of the molten solder, solder joint fillet quality and optimization of soldering thermal profiles. Generally, all new solder formulations exhibited adequate wave soldering performance and can be considered as possible alternatives to eutectic SnPb for wave soldering applications. Further process optimization and flux development is necessary to achieve the defect levels associated with the conventional SnPb process.

  4. Soldering in electronics assembly

    Judd, Mike


    Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

  5. Solder Joint Health Monitoring Testbed

    Delaney, Michael M.; Flynn, James G.; Browder, Mark E.


    A method of monitoring the health of selected solder joints, called SJ-BIST, has been developed by Ridgetop Group Inc. under a Small Business Innovative Research (SBIR) contract. The primary goal of this research program is to test and validate this method in a flight environment using realistically seeded faults in selected solder joints. An additional objective is to gather environmental data for future development of physics-based and data-driven prognostics algorithms. A test board is being designed using a Xilinx FPGA. These boards will be tested both in flight and on the ground using a shaker table and an altitude chamber.

  6. The Bahrain Burial Mound Project

    Laursen, Steffen; Johansen, Kasper Lambert


    the majority of burial mounds have been removed to make way for roads and housing, and in this process about 8000 mounds have been excavated; of these only c. 265 have been published. In 2006 the Bahrain Directorate for Culture & National Heritage and Moesgaard Museum decided on a collaborative project...... focussed on the Bahrain burial mounds. Within the framework of the Burial Mound Project aerial photos from 1959 have been orto-rectified and geo-referenced and so far a GIS-based digital map representing more than 60.000 mounds have been completed. With respect to the thousands of excavated mounds the huge...... process of linking relevant information to the mounds have been initiated in the course of which excavation data of individual monument is being fed into a relational database. Our preliminary study of the digital maps of the mound cemeteries has revealed an abundance of interesting patterns...

  7. Modern carbonate mound systems

    Henriet, J. P.; Dullo, C.


    Carbonate mounds are prominent features throughout the geological record. In many hydrocarbon provinces, they form prime reservoir structures. But recent investigations have increasingly reported occurrences of large mound clusters at the surface of the seabed, or buried at shallow depth on modern ocean margins, and in particular in basins rich in hydrocarbons. Such exciting new observations along the West-European margin are promising for elucidating the setting and environment of modern carbonate mounds, but at the same time they confront us with puzzling or sometimes contradictory observations in the quest for their genesis. Spectacular cold-water coral communities have colonized such mounds, but convincing arguments for recognizing them as prime builders are still lacking. The geological record provides ample evidence of microbial mediation in mound build-up and stabilisation, but as long as mound drilling is lacking, we have no opportunity to verify the role of such processes and identify the key actors in the earliest stage of onset and development of modern mounds. Some evidence from the past record and from present very-high resolution observations in the shallow seabed suggest an initial control by fluid venting, and fluid migration pathways have been imaged or are tentatively reconstructed by modelling in the concerned basins, but the ultimate link in the shallow subsurface seems still to elude a large part of our efforts. Surface sampling and analyses of both corals and surface sediments have largely failed in giving any conclusive evidence of present-day or recent venting in the considered basins. But on the other hand, applying rigourously the interpretational keys derived from e.g. Porcupine Seabight settings off NW Ireland on brand new prospective settings e.g. on the Moroccan margin have resulted in the discovery of totally new mound settings, in the middle of a field of giant, active mud volcanoes. Keys are apparently working, but we still do not

  8. Solderability test system

    Yost, Fred (Cedar Crest, NM); Hosking, Floyd M. (Albuquerque, NM); Jellison, James L. (Albuquerque, NM); Short, Bruce (Beverly, MA); Giversen, Terri (Beverly, MA); Reed, Jimmy R. (Austin, TX)


    A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.

  9. Solderability test system

    Yost, F.; Hosking, F.M.; Jellison, J.L.; Short, B.; Giversen, T.; Reed, J.R.


    A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time. 11 figs.

  10. Reduced oxide soldering activation (ROSA) PWB solderability testing

    Hernandez, C.L.; Hosking, F.M. [Sandia National Labs., Albuquerque, NM (United States). Physical and Joining Metallurgy Dept.; Reed, J. [Texas Instruments, Austin, TX (United States); Tench, D.M.; White, J. [Rockwell Science Center, Thousand Oaks, CA (United States)


    The effect of ROSA pretreatment on the solderability of environmentally stressed PWB test coupons was investigated. The PWB surface finish was an electroplated, reflowed solder. Test results demonstrated the ability to recover plated-through-hole fill of steam aged samples with solder after ROSA processing. ROSA offers an alternative method for restoring the solderability of aged PWB surfaces.

  11. Lead-free solder

    Anderson, Iver E. (Ames, IA); Terpstra, Robert L. (Ames, IA)


    A Sn--Ag--Cu eutectic alloy is modified with one or more low level and low cost alloy additions to enhance high temperature microstructural stability and thermal-mechanical fatigue strength without decreasing solderability. Purposeful fourth or fifth element additions in the collective amount not exceeding about 1 weight % (wt. %) are added to Sn--Ag--Cu eutectic solder alloy based on the ternary eutectic Sn--4.7%Ag--1.7%Cu (wt. %) and are selected from the group consisting essentially of Ni, Fe, and like-acting elements as modifiers of the intermetallic interface between the solder and substrate to improve high temperature solder joint microstructural stability and solder joint thermal-mechanical fatigue strength.

  12. Removing Dross From Molten Solder

    Webb, Winston S.


    Automatic device helps to assure good solder connections. Machine wipes dross away from area on surface of molten solder in pot. Sweeps across surface of molten solder somewhat in manner of windshield wiper. Each cycle of operation triggered by pulse from external robot. Equipment used wherever precise, automated soldering must be done to military specifications.

  13. Mound facility physical characterization

    Tonne, W.R.; Alexander, B.M.; Cage, M.R.; Hase, E.H.; Schmidt, M.J.; Schneider, J.E.; Slusher, W.; Todd, J.E.


    The purpose of this report is to provide a baseline physical characterization of Mound`s facilities as of September 1993. The baseline characterizations are to be used in the development of long-term future use strategy development for the Mound site. This document describes the current missions and alternative future use scenarios for each building. Current mission descriptions cover facility capabilities, physical resources required to support operations, current safety envelope and current status of facilities. Future use scenarios identify potential alternative future uses, facility modifications required for likely use, facility modifications of other uses, changes to safety envelope for the likely use, cleanup criteria for each future use scenario, and disposition of surplus equipment. This Introductory Chapter includes an Executive Summary that contains narrative on the Functional Unit Material Condition, Current Facility Status, Listing of Buildings, Space Plans, Summary of Maintenance Program and Repair Backlog, Environmental Restoration, and Decontamination and Decommissioning Programs. Under Section B, Site Description, is a brief listing of the Site PS Development, as well as Current Utility Sources. Section C contains Site Assumptions. A Maintenance Program Overview, as well as Current Deficiencies, is contained within the Maintenance Program Chapter.

  14. Solder dross removal apparatus

    Webb, Winston S. (Inventor)


    An automatic dross removal apparatus (10) is disclosed for removing dross from the surface of a solder bath (22) in an automated electric component handling system. A rotatable wiper blade (14) is positioned adjacent the solder bath (22) which skims the dross off of the surface prior to the dipping of a robot conveyed component into the bath. An electronic control circuit (34) causes a motor (32) to rotate the wiper arm (14) one full rotational cycle each time a pulse is received from a robot controller (44) as a component approaches the solder bath (22).

  15. Analysis of Rubble Mound Breakwaters

    Mettam, J.D.; Allsop, N.W.H.; Bonafous, P.

    Working Group 12 was set up to consider the analysis of rubble mound breakwaters with a view to achieving a better understanding of safety aspects. The working group decided to develop the practical application of risk analysis in the design of rubble mound breakwaters by using partial coefficien...

  16. Permeability of Rubble Mound Material

    Williams, A.F.; Burcharth, H. F.; Adel, H. den;

    The flow of water through the pores of rubble mound breakwaters has two effects upon breakwater performance. The pore pressures generated within the rubble material will effect the stability of the mound. The flow of water in and out of the pores plays a critical part in the dissipation of wave e...

  17. Low temperature aluminum soldering analysis

    Peterkort, W.G.


    The investigation of low temperature aluminum soldering included the collection of spread factor and dihedral angle data for several solder alloys and a study of flux effects on aluminum. Selected solders were subjected to environmental tests and evaluated on the basis of tensile strength, joint resistance, visual appearance, and metallurgical analysis. A production line method for determining adequate flux removal was developed.

  18. Mound Facility. 1978 annual report



    For Mound Facility, the year 1978 was one of progress marked by enhanced mission assignments and significant milestones. The thirtieth anniversary of the site was celebrated, and Monsanto Research Corporation began a new 5 year contract to operate the Mound Facility. Long-standing production assignments were strengthened, and were were given a new responsibility: to develop and produce all ceramic parts used in Mound-build products. progress toward US energy objectives was bolstered by Mound programs supporting the development of nuclear fusion poser, unlocking previously us attainable fossil fuels, ensuring the safety and security of nuclear material handling operations, and exploring the real promise of energy form the sun. In 1978, we focused our attention on many efforts aimed at a brighter, more secure future.

  19. Rubble Mound Breakwater Failure Modes

    Burcharth, H. F.; Z., Liu


    The RMBFM-Project (Rubble Mound Breakwater Failure Modes) is sponsored by the Directorate General XII of the Commission of the European Communities under the Contract MAS-CT92- 0042, with the objective of contributing to the development of rational methods for the design of rubble mound breakwaters...... modes, plus development of related partial coefficients which make it possible to design according to preselected reliability levels. Due to limited space only the major activities are described....

  20. Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology

    HAN Zong-jie; XUE Song-bai; WANG Jian-xin; ZHANG Xin; ZHANG Liang; YU Sheng-lin; WANG Hui


    Soldering experiments of quad flat package(QFP) devices were carried out by means of diode laser soldering system with Sn-Ag-Cu and Sn-Cu-Ni lead-free solders, and competitive experiments were also carried out not only with Sn-Pb eutectic solders but also with infrared reflow soldering method. The results indicate that under the conditions of laser continuous scanning mode as well as the fixed laser soldering time, an optimal power exists, while the optimal mechanical properties of QFP micro-joints are gained. Mechanical properties of QFP micro-joints soldered with laser soldering system are better than those of QFP micro-joints soldered with IR reflow soldering method. Fracture morphologies of QFP micro-joints soldered with laser soldering system exhibit the characteristic of tough fracture, and homogeneous and fine dimples appear under the optimal laser output power.

  1. Development of a solder bump technique for contacting a three-dimensional multi electrode array

    Frieswijk, T.A.; Frieswijk, T.A.; Bielen, J.A.; Bielen, J.A.; Rutten, Wim; Bergveld, Piet


    The application of a solder bump technique for contacting a three-dimensional multi electrode array is presented. Solder bumping (or C4: Controlled Collapse Chip Connections, also called Flip Chip contacting) is the most suitable contacting technique available for small dimensions and large numbers

  2. Soldering of Nanotubes onto Microelectrodes

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina


    Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...... bonds were consistently found to be mechanically stronger than the carbon nanotubes....

  3. Capillary flow solder wettability test

    Vianco, P.T.; Rejent, J.A.


    A test procedure was developed to assess the capillary flow wettability of solders inside of a confined geometry. The test geometry was comprised of two parallel plates with a controlled gap of constant thickness (0.008 cm, 0.018 cm, 0.025 cm, and 0.038 cm). Capillary flow was assessed by: (1) the meniscus or capillary rise of the solder within the gap, (2) the extent of void formation in the gap, and (3) the time-dependence of the risen solder film. Tests were performed with the lead-free solders.

  4. Impact of diagenesis on carbonate mound formation

    van der Land, C.


    This thesis is devoted to define the parameters influencing cold-water coral growth and therefore carbonate mound development with a focus on the impact of diagenesis on mound sediments. The first part of this thesis (Chapters 2 to 4) discusses the distributionand growth history of carbonate mounds,

  5. Microclimatic conditions of Lasius flavus ant mounds

    Véle, Adam; Holuša, Jaroslav


    Like other organisms, ants require suitable microclimatic conditions for their development. Thus, ant species inhabiting colder climates build nest mounds that rise above the soil surface, presumably to obtain heating from solar radiation. Although some ant species construct mounds of organic materials, which generate substantial heat due to microbial metabolism, Lasius flavus mounds consists mostly of soil, not organic material. The use of artificial shading in the current study demonstrated that L. flavus depends on direct solar radiation to regulate the temperature in its mound-like nests. Temperatures were much lower in shaded mounds than in unshaded mounds and were likely low enough in shaded mounds to reduce ant development and reproduction. In areas where L. flavus and similar ants are undesirable, they might be managed by shading.

  6. Microclimatic conditions of Lasius flavus ant mounds

    Véle, Adam; Holuša, Jaroslav


    Like other organisms, ants require suitable microclimatic conditions for their development. Thus, ant species inhabiting colder climates build nest mounds that rise above the soil surface, presumably to obtain heating from solar radiation. Although some ant species construct mounds of organic materials, which generate substantial heat due to microbial metabolism, Lasius flavus mounds consists mostly of soil, not organic material. The use of artificial shading in the current study demonstrated that L. flavus depends on direct solar radiation to regulate the temperature in its mound-like nests. Temperatures were much lower in shaded mounds than in unshaded mounds and were likely low enough in shaded mounds to reduce ant development and reproduction. In areas where L. flavus and similar ants are undesirable, they might be managed by shading.

  7. Mound Facility publications for 1978



    This document is a compilation of all formal technical publications and oral presentations of Mound Facility in calendar year 1978. It is intended to serve as an aid to personnel in obtaining or referring to specifc publications by giving the proper complete reference for each information item published during the year. Some items may have issue dates or periods of coverage prior to 1978; however, they were formally published during 1978.

  8. Carbonate mound development in contrasting settings on the Irish margin

    van der Land, C.; Eisele, M.; Mienis, F; de Haas, H.; Hebbeln, D.; Reijmer, J.J.G.; van Weering, T.C.E.


    Cold-water coral carbonate mounds, formed by framework building cold-water corals, are found in several mound provinces on the Irish margin. Differences in cold-water coral mound development rates and sediment composition between mounds at the southwest Rockall Trough margin and the Galway Mound in

  9. Carbonate mound development in contrasting settings on the Irish margin

    van der Land, C.; Eisele, M.; Mienis, F; de Haas, H.; Hebbeln, D.; Reijmer, J.J.G.; van Weering, T.C.E.


    Cold-water coral carbonate mounds, formed by framework building cold-water corals, are found in several mound provinces on the Irish margin. Differences in cold-water coral mound development rates and sediment composition between mounds at the southwest Rockall Trough margin and the Galway Mound in

  10. Simulated Mima mounds emerge from small interactions

    Lewis, Chloë Peregrine Hunt


    The Mima-mound-and-vernal-pool topography of California is rich in endemic plant and invertebrate species, but we do not know how this unusual environment is created or maintained. Burrowing rodents have been observed to move soil upwards at annual rates sufficient to maintain the mounds despite erosion, but there is no tested explanation of this behavior. We propose that the mounds are an emergent effect of small-scale (10 cm, 1 day) interactions between topography, hydrology, plant growth, and rodent burrowing. A cellular automata simulation of these processes both generates and maintains mound-pool topography with minimal dependence on initial conditions, and can also describe mound morphogenesis on slopes, where observed mound geometry is distinct from that on level ground.

  11. Carbonate budget of a cold-water coral carbonate mound: Propeller Mound, Porcupine Seabight

    Dorschel, Boris; Hebbeln, Dierk; Rüggeberg, Andres; Dullo, Christian


    High resolution studies from the Propeller Mound, a cold-water coral carbonate mound in the NE Atlantic, show that this mound consists of >50% carbonate justifying the name ‘carbonate mound’. Through the last ~300,000 years approximately one third of the carbonate has been contributed by cold-water corals, namely Lophelia pertusa and Madrepora oculata. This coral bound contribution to the carbonate budget of Propeller Mound is probably accompanied by an unknown portion of sediments buffered from suspension by the corals. However, extended hiatuses in Propeller Mound sequences only allow the calculation of a net carbonate accumulation. Thus, net carbonate accumulation for the last 175 kyr accounts for only <0.3 g/cm2/kyr, which is even less than for the off-mound sediments. These data imply that Propeller Mound faces burial by hemipelagic sediments as has happened to numerous buried carbonate mounds found slightly to the north of the investigated area.

  12. Soldering Formalism Theory and Applications

    Wotzasek, C


    The soldering mechanism is a new technique to work with distinct manifestations of dualities that incorporates interference effects, leading to new physical results that includes quantum contributions. This approach was used to investigate the cases of electromagnetic dualities, and $D\\geq 2$ bosonization. In the former context this technique is applied for the quantum mechanical harmonic oscillator, the scalar field theory in two dimensions and the Maxwell theory in four dimensions. The soldered actions in any dimension leads to a master action which is duality invariant under a much bigger set of symmetries. The effects of coupling to gravity are also elaborated. In the later context, a technique is developed that solders the dual aspects of some symmetry following from the bosonisation of two distinct fermionic models, leading to new results which cannot be otherwise obtained. Exploiting this technique, the two dimensional chiral determinants with opposite chirality are soldered to reproduce either the usu...

  13. Design of Rubble Mound Breakwaters

    Burcharth, H. F.


    Rubble mound breakwaters require availability of often very large quantities of rock materials of various gradings and qualities. Because natural stones are seldom available in sufficient quantities and sizes the materials must in most cases be supplied from quarries. The output from a quarry...... of the rock material are functions of rock type and the degree of weathering. Thus it is important to establish the availability and quality of rock material before completion of a breakwater design for a particular location. If this is not possible then design changes are to be foreseen during...

  14. Design of Rubble Mound Breakwaters

    Burcharth, H. F.


    Rubble mound breakwaters require availability of often very large quantities of rock materials of various gradings and qualities. Because natural stones are seldom available in sufficient quantities and sizes the materials must in most cases be supplied from quarries. The output from a quarry...... the construction stage. Anyway, it is seldom that a fair amount of rocks of mass larger than 10-15 t can be produced, even in good quality quarries. If heavier blocks are needed concrete armour units or vertical structures must be considered....

  15. Carbonate mound development in contrasting settings on the Irish margin

    van der Land, Cees; Eisele, Markus; Mienis, Furu; de Haas, Henk; Hebbeln, Dierk; Reijmer, John J. G.; van Weering, Tjeerd C. E.


    Cold-water coral carbonate mounds, formed by framework building cold-water corals, are found in several mound provinces on the Irish margin. Differences in cold-water coral mound development rates and sediment composition between mounds at the southwest Rockall Trough margin and the Galway Mound in the Porcupine Seabight are investigated. Variations in sediment composition in the two mound provinces are related to the local environmental conditions and sediment sources. Mound accumulation rates are possibly higher at the Galway Mound probably due to a higher influx of hemipelagic fine grained non-carbonate sediments. In both cold-water coral mound areas, mound growth has been continuous for the last ca 11,000 years, before this period several hiatuses and unconformities exist in the mound record. The most recent unconformity can be correlated across multiple mounds and mound provinces at the Irish margin on the basis of apparent age. On the southwest Rockall Trough margin these hiatuses/unconformities are associated with post-depositional aragonite dissolution in, and lithification of, certain intervals, while at Galway Mound no lithification occurs. This study revealed that the influx and types of material transported to cold-water coral mounds may have a direct impact on the carbonate mound accumulation rate and on post-depositional processes. Significantly, the Logachev Mounds on the SW Rockall Trough margin accumulate slower but, because they contain lithified layers, are less susceptible to erosion. This net effect may account for their larger size compared to the Belgica Mounds.

  16. Solder joint technology materials, properties, and reliability

    Tu, King-Ning


    Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

  17. Wetting behavior of alternative solder alloys

    Hosking, F.M.; Vianco, P.T.; Hernandez, C.L.; Rejent, J.A.


    Recent economic and environmental issues have stimulated interest in solder alloys other than the traditional Sn-Pb eutectic or near eutectic composition. Preliminary evaluations suggest that several of these alloys approach the baseline properties (wetting, mechanical, thermal, and electrical) of the Sn-Pb solders. Final alloy acceptance will require major revisions to existing industrial and military soldering specifications. Bulk alloy and solder joint properties are consequently being investigated to validate their producibility and reliability. The work reported in this paper examines the wetting behavior of several of the more promising commercial alloys on copper substrates. Solder wettability was determined by the meniscometer and wetting balance techniques. The wetting results suggest that several of the alternative solders would satisfy pretinning and surface mount soldering applications. Their use on plated through hole technology might be more difficult since the alloys generally did not spread or flow as well as the 60Sn-40Pb solder.

  18. Sulphur Extraction at Bryan Mound

    Kirby, Carolyn L [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Lord, Anna C. Snider [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)


    The Bryan Mound caprock was subjected to extens ive sulphur mining prior to the development of the Strategic Petroleum Reserve. Undoubtedl y, the mining has modified the caprock integrity. Cavern wells at Bryan Mound have been subject to a host of well integr ity concerns with many likely compromised by the cavernous capro ck, surrounding corrosive environment (H 2 SO 4 ), and associated elevated residual temperatures al l of which are a product of the mining activities. The intent of this study was to understand the sulphur mining process and how the mining has affected the stability of the caprock and how the compromised caprock has influenced the integrity of the cavern wells. After an extensiv e search to collect pert inent information through state agencies, literature sear ches, and the Sandia SPR librar y, a better understanding of the caprock can be inferred from the knowledge gaine d. Specifically, the discovery of the original ore reserve map goes a long way towards modeling caprock stability. In addition the gained knowledge of sulphur mining - subs idence, superheated corrosive wa ters, and caprock collapse - helps to better predict the post mi ning effects on wellbore integrity. This page intentionally left blank

  19. COCARDE: new view on old mounds - an international network of carbonate mound research

    Rüggeberg, A.; Foubert, A.; Vertino, A.; van Rooij, D.; Spezzaferri, S.; Henriet, J.-P.; Dullo, W.-C.; Cocarde Science Community


    Carbonate mounds are important contributors of life in different settings, from warm-water to cold-water environments, and throughout geological history. Research on modern cold-water coral carbonate mounds over the last decades made a major contribution to our overall understanding of these particular sedimentary systems. By looking to the modern carbonate mound community with cold-water corals as main framework builders, some fundamental questions could be addressed, until now not yet explored in fossil mound settings. The international network COCARDE ( is a platform for exploring new insights in carbonate mound research of recent and ancient mound systems. The aim of the COCARDE network is to bring together scientific communities, studying Recent carbonate mounds in midslope environments in the present ocean and investigating fossil mounds spanning the whole Phanerozoic time, respectively. Scientific challenges in modern and ancient carbonate mound research got well defined during the ESF Magellan Workshop COCARDE in Fribourg, Switzerland (21.-24.01.2009). The Special Volume Cold-water Carbonate Reservoir systems in Deep Environments - COCARDE (Marine Geology, Vol. 282) was the major outcome of this meeting and highlights the diversity of Recent carbonate mound studies. The following first joint Workshop and Field Seminar held in Oviedo, Spain (16.-20.09.2009) highlighted ongoing research from both Recent and fossil academic groups integrating the message from the industry. The field seminar focused on mounds from the Carboniferous platform of Asturias and Cantabria, already intensively visited by industrial and academic researchers. However, by comparing ancient, mixed carbonate-siliciclastic mound systems of Cantabria with the Recent ones in the Porcupine Seabight, striking similarities in their genesis and processes in mound development asked for an integrated drilling campaign to understand better the 3D internal mound build-up. The

  20. Handbook of machine soldering SMT and TH

    Woodgate, Ralph W


    A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

  1. Environmental changes and growth history of a cold-water carbonate mound (Propeller Mound, Porcupine Seabight)

    Rüggeberg, Andres; Dullo, Christian; Dorschel, Boris; Hebbeln, Dierk


    On- and off-mound sediment cores from Propeller Mound (Hovland Mound province, Porcupine Seabight) were analysed to understand better the evolution of a carbonate mound. The evaluation of benthic foraminiferal assemblages from the off-mound position helps to determine the changes of the environmental controls on Propeller Mound in glacial and interglacial times. Two different assemblages describe the Holocene and Marine Isotope Stage (MIS) 2 and late MIS 3 (˜31 kyr BP). The different assemblages are related to changes in oceanographic conditions, surface productivity and the waxing and waning of the British Irish Ice Sheet (BIIS) during the last glacial stages. The interglacial assemblage is related to a higher supply of organic material and stronger current intensities in water depth of recent coral growth. During the last glaciation the benthic faunas showed high abundances of cassidulinid species, implying cold bottom waters and a reduced availability of organic matter. High sedimentation rates and the domination of Elphidium excavatum point to shelf erosion related to sea-level lowering (˜50 m) and the progradation of the BIIS onto the shelf. A different assemblage described for the on-mound core is dominated by Discanomalina coronata, Gavelinopsis translucens, Planulina ariminensis, Cibicides lobatulus and to a lower degree by Hyrrokkin sarcophaga. These species are only found or show significantly higher relative abundances in on-mound samples and their maximum contribution in the lower part of the record indicates a higher coral growth density on Propeller Mound in an earlier period. They are less abundant during the Holocene, however. This dataset portrays the boundary conditions of the habitable range for the cold-water coral Lophelia pertusa, which dominates the deep-water reefal ecosystem on the upper flanks of Propeller Mound. The growth of this ecosystem occurs during interglacial and interstadial periods, whereas a retreat of corals is documented in

  2. Preliminary Results from IODP Expedition 307, Porcupine Basin Carbonate Mounds

    Williams, T.; Kano, A.; Ferdelman, T.; Henriet, J.; Shipboard Scientific Party, I.


    IODP Expedition 307 (April 26 - May 16, 2005) drilled three sites at Challenger Mound in the Porcupine Seabight, west of Ireland. Deep-water carbonate mounds up to 2 km wide and 200 m high have been found in typical water depths of 500-1000 m along the continental slope of NW Europe from Morocco to Norway. During the last ten years they have been studied using seismics, shallow coring, high resolution bathymetry, and remotely operated vehicles. The partly-buried Challenger Mound is the first to be completely cored to the mound base, with the aim of answering basic questions such as: What is the sedimentology and structure of the mound? What triggered mound initiation? How does the ecosystem interact with sedimentary fluxes to make the mound grow? How are mound growth phases related to glacial-interglacial cycles? What role do microbial communities and geochemical reaction play in the mound? Analytical work is at an early stage, but already shipboard results reveal some of the mound's secrets. The mound body consists of a 155-m-thick sequence of cold-water coral-bearing Pleistocene sediments (floatstone, rudstone, and wackestone), characterized by 10-meter-scale alternation of light gray and dark green intervals. The carbonate-rich and light-colored layers are partially lithified and feature poor coral preservation or even dissolution. The mound base, virtually identical in the on-mound and off-mound holes, is a sharp Pliocene erosional unconformity, separating coral-bearing sediments from a glauconitic and partly sandy siltstone. No evidence was found for a relation between mound development and hydrocarbon seepage. The results from Challenger Mound will help provide a depositional model with which to interpret deep water carbonate mounds in the geological rock record, and we look forward to future drilling of contrasting carbonate mounds.

  3. A cold-water coral carbonate mound on the decline: Propeller Mound, northern Porcupine Seabight

    Dorschel, B.; Hebbeln, D.; Rüggeberg, A.; Dullo, C.


    Radiocarbon and U/Th datings reveal that the top sediment sequence of the Propeller Mound in the Hovland Mound Province is incomplete and characterised by numerous hiatuses. Stable oxygen isotope data obtained on benthic foraminifera indicate that almost only interstadial sediments are preserved, while interglacial and full glacial sediments are missing. The Mediterranean Outflow Water (MOW), assumed to be crucial for the development of the cold-water corals Lophelia pertusa and Madrepora occulata found on Propeller Mound and in its sediments, reaches the Porcupine Seabight in its full strength only during interglacials, while it is absent during glacials. ROV observations show that under present-day conditions the MOW supports coral growth at the top of Propeller Mound, while at the same time it causes substantial erosion on its flanks, where scouring might lead to subsequent slumping. Thus, the hiatuses found in the sediment sequence of Propeller Mound are most likely caused by the strong bottom currents associated with the MOW. Especially during the terminations when the MOW circulation was re-established most of the glacial sediments, deposited under rather smooth conditions, might have been eroded and/or wasted downslope. Such erosion-favourable conditions lasted through the interglacials resulting in the ongoing removal of the interglacial sediments. During the interstadials the interplay between bottom current strength, coral growth and sedimentation resulted in sediment sequences which had a bigger chance to get preserved. Through the last 300 000 years the netto sedimentation on Propeller Mound is by far less compared to the surrounding off-mound sediments. Thus, at least over this time span the mound is shrinking relative to the seafloor around it and if this development continues into the future the Propeller Mound will get buried and follow the fate of the already buried near-by Magellan Mounds.

  4. Lead free solder mechanics and reliability

    Pang, John Hock Lye


    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

  5. Die Soldering in Aluminium Die Casting

    Han, Q.; Kenik, E.A.; Viswanathan, S.


    Two types of tests, dipping tests and dip-coating tests were carried out on small steel cylinders using pure aluminum and 380 alloy to investigate the mechanism of die soldering during aluminum die casting. Optical and scanning electron microscopy were used to study the morphology and composition of the phases formed during soldering. A soldering mechanism is postulated based on experimental observations. A soldering critical temperature is postulated at which iron begins to react with aluminum to form an aluminum-rich liquid phase and solid intermetallic compounds. When the temperature at the die surface is higher than this critical temperature, the aluminum-rich phase is liquid and joins the die with the casting during the subsequent solidification. The paper discusses the mechanism of soldering for the case of pure aluminum and 380 alloy casting in a steel mold, the factors that promote soldering, and the strength of the bond formed when soldering occurs. conditions, an aluminum-rich soldering layer may also form over the intermetallic layer. Although a significant amount of research has been conducted on the nature of these intermetallics, little is known about the conditions under which soldering occurs.

  6. Design and construction of mound breakwaters

    Josep R. Medina


    Full Text Available This paper describes the evolution of design techniques applied to mound breakwaters as well as some key tools, equipment and construction techniques. The influence of the theoretical and laboratory research is analyzed in detail, from the pioneering research by Iribarren eighty years ago to the construction of single-layer armored breakwaters in recent decades. The economic optimization and the new embodied energy and carbon concepts associated to the construction of mound breakwaters are studied. New concepts as well as the invention of new armor units are examined as is their impact based on the observations from small-scale physical experiments and the relevance of the equipment and logistic constraints to explain the evolution of the way mound breakwaters have been designed and built over time.

  7. Study on laser and hot air reflow soldering of PBGA solder ball

    田艳红; 王春青


    Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bump reflowed by laser was superior than the solder bump by hot air, and the microstructure within the solder bump reflowed by laser was much finer. Analysis on interfacial reaction showed that eutectic solder reacted with Au/Ni/Cu pad shortly after the solder was melted. Interface of solder bump reflowed by laser consists of a continuous AuSn4 layer and remnant Au element. Needle-like AuSn4 grew sidewise from interface, and then spread out to the entire interface region. A thin layer of Ni3Sn4 intermetallic compound was found at the interface of solder bump reflowed by hot air, and AuSn4 particles distributed within the whole solder bump randomly. The combination effect of the continuous AuSn4 layer and finer eutectic microstructure contributes to the higher shear strength of solder bump reflowed by laser.



    Mar 1, 2012 ... Based on this, a wettability test using copper grid was conducted on the solder alloys produced. The result shows that wetting time varied from 4 seconds to 5 seconds for the lead-free solders ... at the interfaces [4]. This study ...

  9. Nano-soldering to single atomic layer

    Girit, Caglar O.; Zettl, Alexander K.


    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  10. Toe rock stability for rubble mound breakwaters

    Baart, S.; Ebbens, R.; Nammuni-Krohn, J.; Verhagen, H.J.


    Present design tools, as found in the Rock Manual or Coastal Engineering Manual, for the determination of toe rock size for rubble mound breakwaters are based on test data with a large spread: data is relatively dispersed around the centre and descriptive equations have limited applicability ranges.

  11. Diurnal respiration of a termite mound

    King, Hunter; Ocko, Samuel; Mahadevan, L.


    Many species of fungus-harvesting termites build largely empty, massive mound structures which protrude from the ground above their subterranean nests. It has been long proposed that the function of these mounds is to facilitate exchange of heat, humidity, and respiratory gases; this would give the colony a controlled climate in which to raise fungus and brood. However, the specific mechanism by which the mound achieves ventilation has remained a topic of debate, as direct measurement of internal air flows has remained difficult. By directly measuring these elusive, tiny flows with a custom sensor, we find that the mound architecture of the species Odontotermes obesus takes advantage of daily oscillations in ambient temperature to drive convection and gas transport. This contradicts previous theories, which point to internal metabolic heating and external wind as driving forces. Our result, a novel example of deriving useful work from a fluctuating scalar parameter, should contribute to better understanding insect swarm construction and possible development in passive human architecture, both of which have been spurred by previous research on termites. We acknowledge support from HFSP.

  12. EG and G Mound Applied Technologies

    Sizemore, M.S. [EG and G MAT, Miamisburg, OH (United States)


    This paper reports on the robotics applications offered by EG and G Mound Applied Technologies. The robotics/automations applications discussed include explosive remote disassembly workcell, plasma spraying robot workcell, robotic assembly of ceramic headers, pyrotechnic automation workcell, general automation projects and robotic/vision inventory. This report consists of overheads only.

  13. Low cycle fatigue of lead free solder joints

    Schemmann, Lars; Wedi, Andre; Baither, Dietmar; Schmitz, Guido [Institut fuer Materialphysik, Westf. Wilhelms-Universitaet, Muenster (Germany)


    Presently solders containing lead are banned from consumer electronics. Important alternatives are the Sn-Ag-Cu (SAC) solders and solders containing antimony. This work studies the isothermal low cycle fatigue properties of SAC solders and the SnSb(8) solder. For the experiments, model solder joints were produced and used. They consist of two pure copper plates joined together by a circular disk of solder. Low cycle fatigue experiments were done under displacement control. Furthermore hardness was tested by a micro indenter. In order to find an explanation for the different lifetimes of the solders, several micro structural investigations were performed. For this we used transmission and scanning electron microscopy as well as optical microscopy. The measured data showed a strong relation between lifetime and hardness of the solder alloy. We also found, that the type of solder influences the crack propagation.

  14. Independent technical review of the Mound Plant


    This report documents an Independent Technical Review (ITR) of the facilities, organizations, plans, and activities required to transition particular elements of the Mound Plant from Defense Program (DP) funded operation as appropriate either to community developed reuse or safe deactivation leading to decontamination and decommissioning (D&D). The review was conducted at the request of the Dr. Willis Bixby, Deputy Assistant Secretary, U.S. Department of Energy EM-60, Office of Facility Transition and Management and is a consensus of the nine member ITR Team. Information for the review was drawn from documents provided to the ITR Team by the Miamisburg Area Office (MB) of the DOE, EG&G, the City of Miamisburg, and others; and from presentations, discussions, interviews, and facility inspections at the Mound Plant during the weeks of March 14 and March 28, 1994. During the week of April 25, 1994, the ITR Team met at Los Alamos, New Mexico to develop consensus recommendations. A presentation of the core recommendations was made at the Mound Plant on May 5, 1994. This is an independent assessment of information available to, and used by, the Mound Plant personnel. Repetition of the information is not meant to imply discovery by the ITR Team. Team members, however, acting as independent reviewers, frequently assess the information from a perspective that differs significantly from that of the Mound Plant personnel. The report is based on information obtained and conditions observed during the March 1994 review interval. The ITR process and normal site work often initiate rapid, beneficial changes in understanding and organization immediately following the review. These changes frequently alter conditions observed during the review, but the report does not address changes subsequent to the review interval.

  15. Mound site environmental report for calendar year 1991

    Bauer, L.R. [comp.] [EG and G Mound Applied Technologies, Miamisburg, OH (United States)


    Mound is a government-owned facility operated by EG&G Mound Applied Technologies for the U.S. Department of Energy (DOE). This integrated production, development, and research site performs work in support of DOE`s weapon and energy related programs, with emphasis on explosive, nuclear, and energy technology. The purpose of this report is to inform the public about the impact of Mound`s operations on the population and the environment. This report summarizes data from the Environmental Monitoring Program, through which Mound maintains continuous surveillance of radiological and nonradiological substances released from the facility.

  16. Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders


    controlled fatigue life, likely because of increased void -nucleation via creep-fatigue interactions. Since the solder is largely under plastically deform the solder in order to break the oxide layers and eliminate some minor voids around the NiTi particles. Figure 32... Underfill Constraint Effects during Thermomechanical Cycling of Flip Chip Solder Joints,” Journal of Electronic Materials, Vol. 31, No. 4, 2002

  17. Lead Ingestion Hazard in Hand Soldering Environments.



  18. Modeling the diffusion of solid copper into liquid solder alloys

    Rizvi, M.J. [School of Computing and Mathematical Sciences, University of Greenwich, 30 Park Row, London, SE10 9LS (United Kingdom)], E-mail:; Lu, H.; Bailey, C. [School of Computing and Mathematical Sciences, University of Greenwich, 30 Park Row, London, SE10 9LS (United Kingdom)


    During the soldering process, the copper atoms diffuse into liquid solders. The diffusion process determines integrity and the reworking possibility of a solder joint. In order to capture the diffusion scenarios of solid copper into liquid Sn-Pb and Sn-Cu solders, a computer modeling has been performed for 10 s. An analytical model has also been proposed for calculating the diffusion coefficient of copper into liquid solders. It is found that the diffusion coefficient for Sn-Pb solder is 2.74 x 10{sup -10} m{sup 2}/s and for Sn-Cu solder is 6.44 x 10{sup -9} m{sup 2}/s. The modeling results reveal that the diffusion coefficient is one of the major factors that govern the rate at which solid Cu dissolve in the molten solder. The predicted dissolved amounts of copper into solders have been validated with the help of scanning electron microscopic analysis.

  19. Hydraulic Response of Rubble Mound Breakwaters

    Andersen, Thomas Lykke

    Rubble mound breakwaters have been extensively investigated in the last decades. Nevertheless, there still exists some white spots where only little knowledge and only poor design rules are available. Some of these white spots are due to new types of structures developed in recent years...... experimental test programme with berm breakwaters, has not only resulted in an enormous amount of overtopping data, but also establishment of a design formula to calculate average overtopping discharges. Further, the test programme led to an improved design rule for front side stability of berm breakwaters......, which was not actually identifed as a white spot, but still there was room for big improvements. Rear slope stability and wave re ection has been discussed brie y. The conventional rubble mound breakwater has been investigated for many decades. Anyhow, there is still room for improvements in some areas...

  20. The Magellan mound province in the Porcupine Basin

    Huvenne, V. A. I.; Bailey, W. R.; Shannon, P. M.; Naeth, J.; di Primio, R.; Henriet, J. P.; Horsfield, B.; de Haas, H.; Wheeler, A.; Olu-Le Roy, K.


    The Magellan mound province is one of the three known provinces of carbonate mounds or cold-water coral banks in the Porcupine Seabight, west of Ireland. It has been studied in detail using a large and varied data set: 2D and 3D seismic data, sidescan sonar imagery and video data collected during ROV deployment have been used to describe the mounds in terms of origin, growth processes and burial. The aim of this paper is to present the Magellan mounds and their setting in an integrated, holistic way. More than 1,000 densely spaced and mainly buried mounds have been identified in the area. They all seem to be rooted on one seismic reflection, suggesting a sudden mound start-up. Their size and spatial distribution characteristics are presented, together with the present-day appearance of the few mounds that reach the seabed. The underlying geology has been studied by means of fault analysis and numerical basin modelling in an attempt to identify possible hydrocarbon migration pathways below or in the surroundings of the Magellan mounds. Although conclusive evidence concerning the processes of mound initiation proves to be elusive, the results of both fault analysis and 2D numerical modelling failed to identify, with confidence, any direct pathways for focused hydrocarbon flow to the Magellan province. Diffuse seepage however may have taken place, as drainage area modelling suggests a possible link between mound position and structural features in the Hovland-Magellan area. During mound development and growth, the interplay of currents and sedimentation seems to have been the most important control. Mounds which could not keep pace with the sedimentation rates were buried, and on the few mounds which maintained growth, only a few corals survive at present.

  1. Mathematical models for Isoptera (Insecta mound growth

    MLT. Buschini

    Full Text Available In this research we proposed two mathematical models for Isoptera mound growth derived from the Von Bertalanffy growth curve, one appropriated for Nasutitermes coxipoensis, and a more general formulation. The mean height and the mean diameter of ten small colonies were measured each month for twelve months, from April, 1995 to April, 1996. Through these data, the monthly volumes were calculated for each of them. Then the growth in height and in volume was estimated and the models proposed.

  2. Organic solderability preservation evaluation. Topical report

    Becka, G.A.; McHenry, M.R.; Slanina, J.T.


    An evaluation was conducted to determine the possible replacement of the hot air solder leveling (HASL) process used in the Allied Signal Federal Manufacturing & Technologies (FM&T) Printed Wiring Board Facility with an organic solderability preservative (OSP). The drivers for replacing HASL include (1) Eliminating lead from PWB fabrication processes; (2) Potential legislation restricting use of lead, (3) Less expensive processing utilizing OSP rather than HASL processing; (4) Avoiding solder dross disposal inherent with HASL processing, (5) OSP provides flat, planar surface required for surface mount technology product, and (6) Trend to thinner PWB designs. A reduction in the cost of nonconformance (CONC) due to HASL defects (exposed copper, solderability, dewetting and non-wetting) would be realized with the incorporation of the OSP process. Several supplier HASL replacement candidates were initially evaluated. One supplier chemistry was chosen for potential use in the FM&T PWB and assembly areas.

  3. Soldering Chiralities; 2, Non-Abelian Case

    Wotzasek, C


    We study the non-abelian extension of the soldering process of two chiral WZW models of opposite chiralities, resulting in a (non-chiral) WZW model living in a 2D space-time with non trivial Riemanian curvature.

  4. Shrink-Fit Solderable Inserts Seal Hermetically

    Croucher, William C.


    Shrink-fit stainless-steel insert in aluminum equipment housing allows electrical connectors to be replaced by soldering, without degrading hermeticity of housing or connector. Welding could destroy electrostatic-sensitive components and harm housing and internal cables. Steel insert avoids problems because connector soldered directly to it rather than welded to housing. Seals between flange and housing, and between connector and flange resistant to leaks, even after mechanical overloading and thermal shocking.

  5. Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

    Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi


    It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

  6. Temperature versus time curves for manual and automated soldering processes

    Trent, M.A.


    Temperature-versus-time curves were recorded for various electronic components during pre-tinning, hand soldering, and drag soldering operations to determine the temperature ranges encountered. The component types investigated included a wide range of electronic assemblies. The data collected has been arranged by process and will help engineers to: (1) predetermine the thermal profile to which various components are subjected during the soldering operation; (2) decide--on the basis of component heat sensitivity and the need for thermal relief--where hand soldering would be more feasible than drag soldering; and (3) determine the optimum drag solder control parameters.

  7. Integrated environmentally compatible soldering technologies. Final report

    Hosking, F.M.; Frear, D.R.; Iman, R.L.; Keicher, D.M.; Lopez, E.P.; Peebles, H.C.; Sorensen, N.R.; Vianco, P.T.


    Chemical fluxes are typically used during conventional electronic soldering to enhance solder wettability. Most fluxes contain very reactive, hazardous constituents that require special storage and handling. Corrosive flux residues that remain on soldered parts can severely degrade product reliability. The residues are removed with chlorofluorocarbon (CFC), hydrochlorofluorocarbon (HCFC), or other hazardous solvents that contribute to ozone depletion, release volatile organic compounds into the atmosphere, or add to the solvent waste stream. Alternative materials and processes that offer the potential for the reduction or elimination of cleaning are being developed to address these environmental issues. Timing of the effort is critical, since the targeted chemicals will soon be heavily taxed or banned. DOE`s Office of Environmental Restoration and Waste Management (DOE/EM) has supported Sandia National Laboratories` Environmentally Conscious Manufacturing Integrated Demonstration (ECMID). Part of the ECM program involves the integration of several environmentally compatible soldering technologies for assembling electronics devices. Fluxless or {open_quotes}low-residue/no clean{close_quotes} soldering technologies (conventional and ablative laser processing, controlled atmospheres, ultrasonic tinning, protective coatings, and environmentally compatible fluxes) have been demonstrated at Sandia (SNL/NM), the University of California at Berkeley, and Allied Signal Aerospace-Kansas City Division (AS-KCD). The university demonstrations were directed under the guidance of Sandia staff. Results of the FY93 Soldering ID are presented in this report.

  8. SNL initiatives in electronic fluxless soldering

    Hosking, F. M.; Frear, D. R.; Vianco, P. T.; Keicher, D. M.

    Conventional soldering of electronic components generally requires the application of a chemical flux to promote solder wetting and flow. Chlorofluorocarbons (CFC) and halogenated solvents are normally used to remove the resulting flux residues. While such practice has been routinely accepted throughout the electronics industry, the environmental impact of hazardous solvents on ozone depletion will eventually limit or prevent their use. Solvent substitution or alternative technologies must be developed to meet these goals. Sandia National Laboratories (SNL), Albuquerque has a comprehensive environmentally conscious electronics manufacturing program underway that is funded by the DOE Office of Technology Development. Primary elements of the integrated task are the characterization and development of alternative fluxless soldering technologies that would eliminate circuit board cleaning associated with flux residue removal. Storage and handling of hazardous solvents and mixed solvent-flux waste would be consequently reduced during electronics soldering. This paper will report on the progress of the SNL fluxless soldering initiative. Emphasis is placed on the use of controlled atmospheres, laser heating, and ultrasonic soldering.

  9. PWB solder wettability after simulated storage

    Hernandez, C.L.; Hosking, F.M.


    A new solderability test method has been developed at Sandia National Laboratories that simulates the capillary flow physics of solders on circuit board surfaces. The solderability test geometry was incorporated on a circuit board prototype that was developed for a National Center for Manufacturing Sciences (NCMS) program. The work was conducted under a cooperative research and development agreement between Sandia National Laboratories, NCMS, and several PWB fabricators (AT&T, IBM, Texas Instruments, United Technologies/Hamilton Standard and Hughes Aircraft) to advance PWB interconnect technology. The test was used to investigate the effects of environmental prestressing on the solderability of printed wiring board (PWB) copper finishes. Aging was performed in a controlled chamber representing a typical indoor industrial environment. Solderability testing on as-fabricated and exposed copper samples was performed with the Sn-Pb eutectic solder at four different reflow temperatures (215, 230, 245 and 260{degrees}C). Rosin mildly activated (RMA), low solids (LS), and citric acid-based (CA) fluxes were included in the evaluation. Under baseline conditions, capillary flow was minimal at the lowest temperatures with all fluxes. Wetting increased with temperature at both baseline and prestressing conditions. Poor wetting, however, was observed at all temperatures with the LS flux. Capillary flow is effectively restored with the CA flux.

  10. Environmental control on cold-water carbonate mounds development

    Rüggeberg, A.; Liebetrau, V.; Raddatz, J.; Flögel, S.; Dullo, W.-Chr.; Exp. 307 Scientific Party, Iodp


    Cold-water coral reefs are very abundant along the European continental margin in intermediate water depths and are able to build up large mound structures. These carbonate mounds particularly occur in distinct mound provinces on the Irish and British continental margins. Previous investigations resulted in a better understanding of the cold-water coral ecology and the development of conceptual models to explain carbonate mound build-up. Two different hypotheses were evoked to explain the origin and development of carbonate mounds, external versus internal control (e.g., Freiwald et al. 2004 versus e.g. Hovland 1990). Several short sediment cores have been obtained from Propeller Mound, Northern Porcupine Seabight, indicating that cold-water corals grew during interglacial and warm interstadial periods of the Late Pleistocene controlled by environmental and climatic variability supporting the external control hypothesis (e.g. Dorschel et al. 2005, R

  11. Cartografical And Geodetical Aspects Of The Krakus Mound In Cracow

    Banasik, Piotr


    In this work the fate of the Krakus Mound, the oldest of all existing Krakow's mounds, has been presented. The work was carried out based on selected iconographic, cartographic and geodetic documents. Using as an example old views, panoramas of the city and maps, various functions that the Krakus Mound was fulfilling over its long history were shown. An attempt was made to document the military significance of this mound and the surrounding hills. The particular astro-geodetic importance of the Krakus Mound on the scale of the city and southern Poland region was widely discussed. The Krakus Mound also inscribed itself in the history of the use of GPS technology as well as research on the local determination of the geoid in the area of Krakow.

  12. Use of organic solderability preservatives on solderability retention of copper after accelerated aging

    Hernandez, C.L.; Sorensen, N.R.; Lucero, S.J.


    Organic solderability preservatives (OSP`s) have been used by the electronics industry for some time to maintain the solderability of circuit boards and components. Since solderability affects both manufacturing efficiency and product reliability, there is significant interest in maintaining good solder wettability. There is often a considerable time interval between the initial fabrication of a circuit board or component and its use at the assembly level. Parts are often stored under a variety of conditions, in many cases not well controlled. Solder wettability can deteriorate during storage, especially in harsh environments. This paper describes the ongoing efforts at Sandia National Laboratories to quantify solder watability on bare and aged copper surfaces. Benzotriazole and imidazole were applied to electronic grade copper to retard aging effects on solderability. The coupons were introduced into Sandia`s Facility for Atmospheric Corrosion Testing (FACT) to simulate aging in a typical indoor industrial environment. H{sub 2}S, NO{sub 2} and Cl{sub 2} mixed gas was introduced into the test cell and maintained at 35{degrees}C and 70% relative humidity for test periods of one day to two weeks. The OSP`s generally performed better than bare Cu, although solderability diminished with increasing exposure times.

  13. Corrosion resistance of the soldering joint of post-soldering of palladium-based metal-ceramic alloys.

    Kawada, E; Sakurai, Y; Oda, Y


    To evaluate the corrosion resistance of post soldering of metal-ceramic alloys, four commercially available palladium-system metal-ceramic alloys (Pd-Cu, Pd-Ni, Pd-Ag, and Pd-Sb systems) and two types of solder (12 k gold solder and 16 k gold solder) with different compositions and melting points were used. The corrosion resistance of the soldered joint was evaluated by anodic polarization. The electrochemical characteristics of soldered surface were measured using electrochemical equipment. Declines in corrosion resistance were not detectable with Pd-Cu, Pd-Ag and Pd-Sb types, but break down at low potential occurred with Pd-Ni type.

  14. Temporal Evolution of A Carbonate Mound In The NE Atlantic

    Dorschel, B.; Rüggeberg, A.; Hebbeln, D.; Dullo, C.; Freiwald, A.

    Even though carbonate mounds are quite common structures along the northeast At- lantic margin their history remains largely unknown. Besides the main question, what causes the initial development of these mounds; also their latest evolution in response to changing environmental conditions receives more and more interest. Here, this question has been tackled by new sets of stable isotope data, which provide informa- tion about the growth and accumulation pattern of these mounds for the last 100 ka. The investigated Propeller Mound (52r09'N/12r46'W) is part of the Hovland Mound Province located in the northern Porcupine Seabight. Its base is located in 800 m wa- ter depth and it expands 2 km in N-S direction and 0.7 km in E-W direction. Its top rises up to 150 m above the surrounding seafloor. In September 2000 eight gravity cores have been collected from the Propeller Mound and the surrounding area. Four cores taken from the mound contain cold-water corals and coral fragments in a matrix of silt and clay. The other cores collected from a moat around the mound and from a drift body in the northeast contain mainly sandy silty clays. All off-mound cores are easy to correlate using proxies like Ca ore Fe content. Inter-core correlations with on- mound cores turned out to be difficult. Fragments of the cold-water corals Lophelia pertusa and Madrepora occulata overprint the hemipelagic background signal. Here we use stable isotope data from benthic foraminifers for an inter-core correlation. In combination with 14C ages these data provide information about the evolutionof the mounds in relation to the off-mound area with respect to climate variations during the last 100 ka.

  15. Mound site environmental report for calendar year 1992

    Bauer, L.R.


    The purpose of this report is to inform the public about the impact of Mound operations on the population and the environment. Mound is a government-owned facility operated by EG&G Mound Applied Technologies for the US Department of Energy (DOE). This integrated production, development, and research site performs work in support of DOE`s weapon and energy related programs, with emphasis on explosive, nuclear and energy technologies.

  16. Age-aware solder performance models : level 2 milestone completion.

    Neilsen, Michael K.; Vianco, Paul Thomas; Neidigk, Matthew Aaron; Holm, Elizabeth Ann


    Legislated requirements and industry standards are replacing eutectic lead-tin (Pb-Sn) solders with lead-free (Pb-free) solders in future component designs and in replacements and retrofits. Since Pb-free solders have not yet seen service for long periods, their long-term behavior is poorly characterized. Because understanding the reliability of Pb-free solders is critical to supporting the next generation of circuit board designs, it is imperative that we develop, validate and exercise a solder lifetime model that can capture the thermomechanical response of Pb-free solder joints in stockpile components. To this end, an ASC Level 2 milestone was identified for fiscal year 2010: Milestone 3605: Utilize experimentally validated constitutive model for lead-free solder to simulate aging and reliability of solder joints in stockpile components. This report documents the completion of this milestone, including evidence that the milestone completion criteria were met and a summary of the milestone Program Review.

  17. Computer simulation of solder joint failure

    Burchett, S.N.; Frear, D.R. [Sandia National Lab., Albuquerque, NM (United States); Rashid, M.M. [Univ. of California, Davis, CA (United States)


    The thermomechanical fatigue failure of solder joints is increasingly becoming an important reliability issue for electronic packages. The purpose of this Laboratory Directed Research and Development (LDRD) project was to develop computational tools for simulating the behavior of solder joints under strain and temperature cycling, taking into account the microstructural heterogeneities that exist in as-solidified near eutectic Sn-Pb joints, as well as subsequent microstructural evolution. The authors present two computational constitutive models, a two-phase model and a single-phase model, that were developed to predict the behavior of near eutectic Sn-Pb solder joints under fatigue conditions. Unique metallurgical tests provide the fundamental input for the constitutive relations. The two-phase model mathematically predicts the heterogeneous coarsening behavior of near eutectic Sn-Pb solder. The finite element simulations with this model agree qualitatively with experimental thermomechanical fatigue tests. The simulations show that the presence of an initial heterogeneity in the solder microstructure could significantly degrade the fatigue lifetime. The single-phase model was developed to predict solder joint behavior using materials data for constitutive relation constants that could be determined through straightforward metallurgical experiments. Special thermomechanical fatigue tests were developed to give fundamental materials input to the models, and an in situ SEM thermomechanical fatigue test system was developed to characterize microstructural evolution and the mechanical behavior of solder joints during the test. A shear/torsion test sample was developed to impose strain in two different orientations. Materials constants were derived from these tests. The simulation results from the two-phase model showed good fit to the experimental test results.

  18. Evaluation technology of lead-free solders; Namari free handa zairyo ni okeru hyoka gijutsu

    Yamashita, M.; Shiokawa, K. [Fuji Electric Co. Ltd., Tokyo (Japan); Ueda, A. [Fuji Electric Corporate Research and Development,Ltd., Kanagawa (Japan)


    Solders mainly composed of tin and lead are currently in widespread use in semiconductor devices. However, in view of lead influences on the human body and environmental problems, lead-free solders have been in urgent demand. In this study, aiming to improve the solderability and reliability of a tin-silver solder, one of most promising lead-free solder materials, we have investigated elements to be added. Focusing on typical lead-free tin-silver solders and tin-lead eutectic solders, this paper describes the result of investigations into the mechanical properties solderability, micro structures of the solder materials and gas analysis in soldering. (author)

  19. Hydraulic Response of Rubble Mound Breakwaters

    Andersen, Thomas Lykke

    , which was not actually identifed as a white spot, but still there was room for big improvements. Rear slope stability and wave re ection has been discussed brie y. The conventional rubble mound breakwater has been investigated for many decades. Anyhow, there is still room for improvements in some areas...... experimental test programme with berm breakwaters, has not only resulted in an enormous amount of overtopping data, but also establishment of a design formula to calculate average overtopping discharges. Further, the test programme led to an improved design rule for front side stability of berm breakwaters...

  20. The small mounds of Bayuda region

    Sparavigna, Amelia Carolina


    The Great Bend of the river Nile contains the Bayuda region with its volcanic core. Along the river, a fertile strip of land has attracting human settlement for thousands of years and is then rich of archaeological sites. The distribution of the sites near the Nile can be detected using Google Maps imagery. We can see many area covered by small mounds, probably burial sites. Some of the archaeological places are currently under the water of the Merowe Dam. With the satellite imagery, we have a portrait of the area close the dam before the closing of its gates.

  1. Effect of Solder Flux Residues on Corrosion of Electronics

    Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per


    Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA[...

  2. Efforts to Develop a 300°C Solder

    Norann, Randy A [Perma Works LLC


    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  3. Microstructural evolution of eutectic Au-Sn solder joints

    Song, Ho Geon


    Current trends toward miniaturization and the use of lead(Pb)-free solder in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability.

  4. Microstructural evolution of eutectic Au-Sn solder joints

    Song, Ho Geon [Univ. of California, Berkeley, CA (United States)


    Current trends toward miniaturization and the use of lead(Pb)-free solder in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability.

  5. Testing of printed circuit board solder joints by optical correlation

    Espy, P. N.


    An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.

  6. A terrestrial weathering and wind abrasion analog for mound and moat morphology of Gale crater, Mars

    Chan, Marjorie A.; Netoff, Dennis I.


    A striking feature of Gale crater is the 5.5 km high, central layered mound called Mount Sharp (Aeolis Mons)—the major exploration target for the Mars Science Laboratory rover, Curiosity. Within the 154 km diameter crater, low plains (Aeolis Palous) resemble a moat surrounding Mount Sharp. There is a similar terrestrial analog in the Jurassic Navajo Sandstone of southern Utah, USA, where a distinctive weathering pit 60 m wide by 20 m deep contains a central pillar/mound and moat. Strong regional and local winds are funneled to amplify their velocity and produce a Venturi effect that sculpts the pit via wind abrasion. Although the Navajo pit is orders of magnitude smaller than Gale crater, both show comparable morphologies accompanied by erosional wind features. The terrestrial example shows the impact of weathering and the ability of strong winds and vortices to shape lithified sedimentary rock over long periods of time.

  7. Thermal decomposition of solder flux activators under simulated wave soldering conditions

    Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan


    Purpose:The aim of this work is to investigate the decomposition behaviour of the activator species commonly used in the wave solder no-clean flux systems and to estimate the residue amount left after subjecting the samples to simulated wave soldering conditions. Design/methodology/approach: Chan......Purpose:The aim of this work is to investigate the decomposition behaviour of the activator species commonly used in the wave solder no-clean flux systems and to estimate the residue amount left after subjecting the samples to simulated wave soldering conditions. Design....../methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid......-malic). The decomposition patterns of solder flux activators depend on their chemical nature, time of heat exposure and substrate materials. Evaporation of the residue from the surface of different materials (laminate with solder mask, copper surface or glass surface) was found to be more pronounced for succinic...

  8. A Study of the Interface of Soldered Joints of SnInAgTi Active Solder with Ito Ceramics

    M. Provazník; R. Koleňák


    This paper presents an analysis of the solderability ITO ceramics (In2O3/SnO2). The soft active solder SnInAgeTi was used for the experiments. The solder was activated by power ultrasound in air without flux. An analysis of the interface of the phases between the solder and the ceramic was carried out in order to discover the ultrasonic impacts on the active metal and to identify the mechanism of the joint on the ceramic side.

  9. A novel method for direct solder bump pull testing using lead-free solders

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  10. Stability Of Rubble Mound Breakwaters Using High Density Rock

    Burcharth, H. F.; Beck, J. B.


    The present paper discusses the effect of mass density on stability of rubble mound breakwaters. A short literature review of existing knowledge is give to establish a background for the ongoing research. Furthermore, several model tests are described in which the stability of rubble mound breakw...

  11. Capillary wave formation on excited solder jet and fabrication of lead-free solder ball

    ZHANG Shu-guang; HE Li-jun; ZHU Xue-xin; ZHANG Shao-ming; SHI Li-kai; XU Jun


    A survey of solder ball production processes especially focusing on disturbed molten metal jet breakup process was made. Then the formation of capillary wave on tin melt jet in the way of rapid solidification was studied. A semi-empirical formula, which can be written as λ = Cvib (σ/ρ)1/3f-2/3 to predict the relationship between wavelength of capillary wave and frequency of imposed vibration was obtained. Sn-4.0Ag-0.5Cu lead free solder ball was successfully produced with tight distribution and good sphericity. The excited jet breakup process is promising for cost effectively producing solder ball.

  12. Solder Joint Health Monitoring Testbed System

    Delaney, Michael M.


    The density and pin count for Field Programmable Gate Arrays (FPGAs) has been increasing, and has exceeded current methods of solder joint inspection, making early detection of failures more problematic. These failures are a concern for both flight safety and maintenance in commercial aviation. Ridgetop Group, Inc. has developed a method for detecting solder joint failures in real time. The NASA Dryden Flight Research Center is developing a set of boards to test this method in ground environmental and accelerated testing as well as flight test on a Dryden F-15 or F-18 research aircraft. In addition to detecting intermittent and total solder joint failures, environmental data on the boards, such as temperature and vibration, will be collected and time-correlated to aircraft state data. This paper details the technical approach involved in the detection process, and describes the design process and products to date for Dryden s FPGA failure detection boards.

  13. Pb-Free Soldering Iron Temperature Controller

    Hamane, Hiroto; Wajima, Kenji; Hayashi, Yoichi; Komiyama, Eiichi; Tachibana, Toshiaki; Miyazaki, Kazuyoshi

    Recently, much importance has been attached to the environmental problem. The content of two directives to better control the management of waste electronic equipment was approved. The two directives are the Waste from Electrical and Electronic Equipment (WEEE) and the Restriction of Hazardous Substances (RoHS). These set phase-out dates for the use of lead materials contained in electronic products. Increasingly, attention is focusing on the potential use of Pb-free soldering in electronics manufacturing. It should be noted that many of the current solding irons are not suitable for Pb-free technology, due to the inferior wetting ability of Pb-free alloys compared with SnPb solder pastes. This paper presents a Pb-free soldering iron temperature controller using an embedded micro-processor with a low memory capacity.

  14. Nanocopper Based Solder-Free Electronic Assembly

    Schnabl, K.; Wentlent, L.; Mootoo, K.; Khasawneh, S.; Zinn, A. A.; Beddow, J.; Hauptfleisch, E.; Blass, D.; Borgesen, P.


    CuantumFuse nano copper material has been used to assemble functional LED test boards and a small camera board with a 48 pad CMOS sensor quad-flat no-lead chip and a 10 in flexible electronics demo. Drop-in replacement of solder, by use of stencil printing and standard surface mount technology equipment, has been demonstrated. Applications in space and commercial systems are currently under consideration. The stable copper-nanoparticle paste has been examined and characterized by scanning electron microscopy and high-resolution transmission electron microscopy; this has shown that the joints are nanocrystalline but with substantial porosity. Assessment of reliability is expected to be complicated by this and by the effects of thermal and strain-enhanced coarsening of pores. Strength, creep, and fatigue properties were measured and results are discussed with reference to our understanding of solder reliability to assess the potential of this nano-copper based solder alternative.

  15. Are pre-crater mounds gas-inflated?

    Leibman, Marina; Kizyakov, Alexandr; Khomutov, Artem; Dvornikov, Yury; Babkina, Elena; Arefiev, Stanislav; Khairullin, Rustam


    Gas-emission craters (GEC) on Yamal peninsula, which occupied minds of researches for the last couple of years since first discovered in 2014, appeared to form on the place of specifically shaped mounds. There was a number of hypotheses involving pingo as an origin of these mounds. This arouse an interest in mapping pingo thus marking the areas of GEC formation risk. Our field research allows us to suggest that remote-sensing-based mapping of pingo may result in mix up of mounds of various origin. Thus, we started with classification of the mounds based on remote-sensing, field observations and survey from helicopter. Then we compared indicators of mounds of various classes to the properties of pre-crater mounds to conclude on their origin. Summarizing field experience, there are three main mound types on Yamal. (1) Outliers (remnant hills), separated from the main geomorphic landform by erosion. Often these mounds comprise polygonal blocks, kind of "baydzherakh". Their indicators are asymmetry (short gentle slope towards the main landform, and steep slope often descending into a small pond of thermokarst-nivation origin), often quadrangle or conic shape, and large size. (2) Pingo, appear within the khasyrei (drain lake basin); often are characterized by open cracks resulting from expansion of polygonal network formed when re-freezing of lake talik prior to pingo formation; old pingo may bear traces of collapse on the top, with depression which differs from the GEC by absence of parapet. (3) Frost-heave mounds (excluding pingo) may form on deep active layer, reducing due to moss-peat formation and forming ice lenses from an active layer water, usually they appear in the drainage hollows, valley bottoms, drain-lake basins periphery. These features are smaller than the first two types of mounds. Their tops as a rule are well vegetated. We were unable to find a single or a set of indicators unequivocally defining any specific mound type, thus indicators of pre

  16. Moisture and aging effects of solder wettability of copper surfaces

    Hernandez, C.L.; Sorensen, N.R.; Lucero, S.J.


    Solderability is a critical property of electronic assembly that affects both manufacturing efficiency and product reliability. There is often a considerable time interval between initial fabrication of a circuit board or component and its use at the assembly level. Parts are often stored under a variety of conditions, usually not controlled. Solder wettability can soon deteriorate during storage, especially in extreme environments. This paper describes ongoing efforts at Sandia to quantify solder wettability on bare and aged Cu surfaces. In addition, organic solderability preservatives (OSPs) were applied to the bare Cu to retard solderability loss due to aging. The OSPs generally performed well, although wetting did decrease with exposure time.

  17. Parametric study on the solderability of etched PWB copper

    Hosking, F.M.; Stevenson, J.O.; Hernandez, C.L.


    The rapid advancement of interconnect technology has resulted in a more engineered approach to designing and fabricating printed wiring board (PWB) surface features. Recent research at Sandia National Laboratories has demonstrated the importance of surface roughness on solder flow. This paper describes how chemical etching was used to enhance the solderability of surfaces that were normally difficult to wet. The effects of circuit geometry, etch concentration, and etching time on solder flow are discussed. Surface roughness and solder flow data are presented. The results clearly demonstrate the importance of surface roughness on the solderability of fine PWB surface mount features.

  18. Lead (Pb)-Free Solder Applications



    Legislative and marketing forces both abroad and in the US are causing the electronics industry to consider the use of Pb-free solders in place of traditional Sn-Pb alloys. Previous case studies have demonstrated the satisfactory manufacturability and reliability of several Pb-free compositions for printed circuit board applications. Those data, together with the results of fundamental studies on Pb-free solder materials, have indicated the general feasibility of their use in the broader range of present-day, electrical and electronic components.

  19. Effects of PCB thickness on adjustable fountain wave soldering

    M S Abdul Aziz; M Z Abdullah; C Y Khor; A Jalar; M A Bakar; W Y W Yusoff; F Che Ani; Nobe Yan; M Zhou; C Cheok


    This study investigates the effects of printed circuit board (PCB) thickness on adjustable fountain and conventional wave soldering. The pin-through-hole (PTH) vertical fill is examined with three PCBs of different thicknesses (i.e., 1.6, 3.1, and 6.0 mm) soldered through adjustable fountain and conventional wave soldering at conveyor angles of 0° and 6°. The vertical fill of each PCB is the focus. The PTH solder profile is inspected with a non-destructive X-ray computed tomography scanning machine. The percentages of the PTH vertical fill of both soldering processes are also estimated and compared. The aspect ratio of the PCB is also investigated. Experimental results reveal that adjustable fountain wave soldering yields better vertical fill than conventional wave soldering. The vertical fill level of adjustable fountain wave soldering is 100%, 90%, and 50% for the 1.6, 3.1, and 6.0 mm PCB thickness, respectively. FLUENT simulation is conducted for the vertical fill of the solder profile. Simulation and experimental results show that the PTH solder profiles of the two soldering processes are almost identical. The effect of PCB thickness on PTH voiding is also discussed.

  20. Solder flow over fine line PWB surface finishes

    Hosking, F.M.; Hernandez, C.L.


    The rapid advancement of interconnect technology has stimulated the development of alternative printed wiring board (PWB) surface finishes to enhance the solderability of standard copper and solder-coated surfaces. These new finishes are based on either metallic or organic chemistries. As part of an ongoing solderability study, Sandia National Laboratories has investigated the solder flow behavior of two azole-based organic solderability preservations, immersion Au, immersion Ag, electroless Pd, and electroless Pd/Ni on fine line copper features. The coated substrates were solder tested in the as-fabricated and environmentally-stressed conditions. Samples were processed through an inerted reflow machine. The azole-based coatings generally provided the most effective protection after aging. Thin Pd over Cu yielded the best wetting results of the metallic coatings, with complete dissolution of the Pd overcoat and wetting of the underlying Cu by the flowing solder. Limited wetting was measured on the thicker Pd and Pd over Ni finishes, which were not completely dissolved by the molten solder. The immersion Au and Ag finishes yielded the lowest wetted lengths, respectively. These general differences in solderability were directly attributed to the type of surface finish which the solder came in contact with. The effects of circuit geometry, surface finish, stressing, and solder processing conditions are discussed.

  1. Prototype circuit boards assembled with non-lead bearing solders

    Vianco, P.T.; Rejent, J.A.


    The 91.84Sn-3.33Ag-4.83Bi and 96.5Sn-3.5Ag Pb-free solders were evaluated for surface mount circuit board interconnects. The 63Sn-37Pb solder provided the baseline data. All three solders exhibited suitable manufacturability per a defect analyses of circuit board test vehicles. Thermal cycling had no significant effect on the 91.84Sn-3.33Ag-4.83Bi solder joints. Some degradation in the form of grain boundary sliding was observed in 96.5Sn-3.5Ag and 63Sn-37Pb solder joints. The quality of the solder joint microstructures showed a slight degree of degradation under thermal shock exposure for all of the solders tested. Trends in the solder joint shear strengths could be traced to the presence of Pd in the solder, the source of which was the Pd/Ni finish on the circuit board conductor features. The higher, intrinsic strengths of the Pb-free solders encouraged the failure path to be located in proximity to the solder/substrate interface where Pd combined with Sn to form brittle PdSn{sub 4} particles, resulting in reduced shear strengths.

  2. Capillary flow of solder on chemically roughened PWB surfaces

    Hosking, F.M.; Stevenson, J.O.; Yost, F.G.


    The Center for Solder Science and Technology at Sandia National Laboratories has developed a solderability test for evaluating fundamental solder flow over PWB (printed wiring boards) surface finishes. The work supports a cooperative research and development agreement between Sandia, the National Center for Manufacturing Sciences (NCMS), and several industrial partners. An important facet of the effort involved the ``engineering`` of copper surfaces through mechanical and chemical roughening. The roughened topography enhances solder flow, especially over very fine features. In this paper, we describe how etching with different chemical solutions can affect solder flow on a specially designed ball grid array test vehicle (BGATV). The effects of circuit geometry, solution concentration, and etching time are discussed. Surface roughness and solder flow data are presented to support the roughening premise. Noticeable improvements in solder wettability were observed on uniformly etched surfaces having relatively steep peak-to-valley slopes.

  3. Automatic computer-aided system of simulating solder joint formation

    Zhao, Xiujuan; Wang, Chunqing; Zheng, Guanqun; Wang, Gouzhong; Yang, Shiqin


    One critical aspect in electronic packaging is the fatigue/creep-induced failure in solder interconnections, which is found to be highly dependent on the shape of solder joints. Thus predicting and analyzing the solder joint shape is warranted. In this paper, an automatic computer-aided system is developed to simulate the formation of solder joint and analyze the influence of the different process parameters on the solder joint shape. The developed system is capable of visually designing the process parameters and calculating the solder joint shape automatically without any intervention from the user. The automation achieved will enable fast shape estimation with the variation of process parameters without time consuming experiments, and the simulating system provides the design and manufacturing engineers an efficient software tools to design soldering process in design environment. Moreover, a program developed from the system can serve as the preprocessor for subsequent finite element joint analysis program.

  4. Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering

    Ji, Hongjun; Wang, Qiang; Li, Mingyu


    Solder joint reliability greatly depends on the microstructure of the solder matrix and the morphology of intermetallic compounds (IMCs) in the joints. Addition of strengthening phases such as carbon nanotubes and ceramic particles to solder joints to improve their properties has been widely studied. In this work, ultrasonic vibration (USV) of casting ingots was applied to considerably improve their microstructure and properties, and the resulting influence on fluxless soldering of Cu/Sn-3.0Ag-0.5Cu/Cu joints and their microstructural evolution was investigated. It was demonstrated that USV application during reflow of Sn-based solder had favorable effects on β-Sn grain size refinement as well as the growth and distribution of various IMC phases within the joints. The β-Sn grain size was significantly refined as the ultrasound power was increased, with a reduction of almost 90% from more than 100 μm to below 10 μm. Long and large Cu6Sn5 tubes in the solder matrix of the joints were broken into tiny ones. Needle-shaped Ag3Sn was transformed into flake-shaped. These IMCs were mainly precipitated along β-Sn phase boundaries. High-temperature storage tests indicated that the growth rate of interfacial IMCs in joints formed with USV was slower than in conventional reflow joints. The mechanisms of grain refinement and IMC fragmentation are discussed and related to the ultrasonic effects.

  5. Biotic origin for Mima mounds supported by numerical modeling

    Gabet, Emmanuel J.; Perron, J. Taylor; Johnson, Donald L.


    Mima mounds are ~ 1-m-high hillocks found on every continent except Antarctica. Despite often numbering in the millions within a single field, their origin has been a mystery, with proposed explanations ranging from glacial processes to seismic shaking. One hypothesis proposes that mounds in North America are built by burrowing mammals to provide refuge from seasonally saturated soils. We test this hypothesis with a numerical model, parameterized with measurements of soil transport by gophers from a California mound field, that couples animal behavior with geomorphic processes. The model successfully simulates the development of the mounds as well as key details such as the creation of vernal pools, small intermound basins that provide habitat for endemic species. Furthermore, we demonstrate that the spatial structure of the modeled mound fields is similar to actual mound fields and provides an example of self-organized topographic features. We conclude that, scaled by body mass, Mima mounds are the largest structures built by nonhuman mammals and may provide a rare example of an evolutionary coupling between landforms and the organisms that create them.

  6. Biotic Origin for Mima Mounds Supported by Numerical Model

    Gabet, E. J.; Perron, J.; Johnson, D. L.


    Mima mounds are ~1-m-high hillocks found on every continent except Antarctica. Despite often numbering in the millions within a single field, their origin has been a mystery, with proposed explanations ranging from glacial processes to seismic shaking. One hypothesis proposes that mounds in North America are built by burrowing mammals to provide refuge from seasonally saturated soils. We test this hypothesis with a numerical model, parameterized with measurements of soil transport by gophers from a California mound field, that couples animal behavior with geomorphic processes. The model successfully simulates the development of the mounds, as well as key details such as the creation of vernal pools, small intermound basins that provide habitat for endemic species. Furthermore, we demonstrate that the spatial structure of the modeled mound fields is similar to actual mound fields and provides an example of self-organized topographic features. We conclude that, scaled by body mass, Mima mounds are the largest structures built by non-human mammals, and may provide a rare example of an evolutionary coupling between landforms and the organisms that create them.

  7. Multilead, Vaporization-Cooled Soldering Heat Sink

    Rice, John


    Vaporization-cooled heat sink proposed for use during soldering of multiple electrical leads of packaged electronic devices to circuit boards. Heat sink includes compliant wicks held in grooves on edges of metal fixture. Wicks saturated with water. Prevents excessive increases in temperature at entrances of leads into package.

  8. Soldering and Mass Generation in Four Dimensions

    Banerjee, R; Banerjee, Rabin; Wotzasek, Clovis


    We propose bosonised expressions for the chiral Schwinger models in four dimensions. Then, in complete analogy with the two dimensional case, we show the soldering of two bosonised chiral Schwinger models with opposite chiralities to yield the bosonised Schwinger model in four dimensions. The implications of the Schwinger model or its chiral version, as known for two dimensions, thereby get extended to four dimensions.

  9. Solderability test development. Final report. [Meniscograph tests

    Jarboe, D.M.


    Operating procedures and data reduction techniques applicable to the Meniscograph (General Electric Company, Limited) were developed. Using force-time traces from tests involving various sample materials and configurations, flux types, and test temperatures, the wetting rate and contact angle were obtained through statistical treatment of the data. This information provides a means of directly correlating solderability with the physical phenomenon of wetting.

  10. Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders

    Tomi Laurila


    Full Text Available In this paper we will demonstrate how a thermodynamic-kinetic method can be utilized to rationalize a wide range of interfacial phenomena between Sn-based lead-free solders and Ni metallizations. First, the effect of P on the interfacial reactions, and thus on the reliability, between Sn-based solders and electroless Ni/immersion Au (ENIG metallizations, will be discussed. Next, the effect of small amounts of Cu in Sn-based solders on the intermetallic compound (IMC, which forms first on top of Ni metallization, will be covered. With the help of thermodynamic arguments a so called critical Cu concentration for the formation of (Cu,Ni6Sn5 can be determined as a function of temperature. Then the important phenomenon of redeposition of (Au,NiSn4 layer on top of Ni3Sn4 IMC will be discussed in detail. The reasons leading to this behaviour will be rationalized with the help of thermodynamic information and an explanation of why this phenomenon does not occur when an appropriate amount of Cu is present in the soldering system will be given. Finally, interfacial reaction issues related to low temperature Sn-Zn and Sn-Bi based solders and Ni metallization will be discussed.

  11. Benthic foraminiferal assemblages help to understand carbonate mound evolution

    Rüggeberg, A.; Dorschel, B.; Dullo, C.; Hebbeln, D.; Freiwald, A.


    On- and off-mound sediment cores from Propeller Mound (Porcupine Seabight) were analysed for their benthic foraminiferal assemblages. Benthic foraminifera from the off-mound position show three different assemblages describing the Holocene, Oxygen Isotope Stage (OIS) 2 and late OIS 3. The Holocene assemblage is dominated by Uvigerina mediterranea, Trifarina angulosa, Melonis barleeanum, Hyalinea balthica, Bulimina marginata. These species are related to a higher supply of organic material. The glacial assemblage shows high abundances of Cassidulina teretis, C. reniforme, Globocassidulina subglobosa, and Cibicidoides kullenbergi, implying cold bottom waters and a reduced productivity. The lower part of late OIS 3 is dominated by Elphidium excavatum, which is displaced continuously by very high abundances of C. teretis towards the transition of OIS3/2. E. excavatum, a shallow shelf species generally reported from above 200 m water depth, and high amounts of sediment supplied to the core site points to shelf erosion related to sea level lowering (approx. 50 m). Towards OIS 2 the system returns to normal background sedimentation pattern. We transferred the established off-mound assemblages onto the on-mound core, in which the sediment sequence is incomplete characterised by numerous hiatuses. The Holocene assemblage describes almost the complete core with relative abundances of >20%, interrupted only by three sections with slightly higher amounts of the glacial assemblage, which are not comparable to abundances of >70% of the glacial assemblage found in the off-mound core. These results are in conjunction with stable oxygen isotope data indicating only interstadial values, assuming peak glacial and interglacial sediments to be removed from the mound. Another assemblage described for the on-mound core is dominated by Discanomalina coronata, Gavelinopsis translucens, Planulina ariminensis, Cibicides lobatulus and to a lower degree by Hyrrokkin sarcophaga. These species

  12. Microwave Tissue Soldering for Immediate Wound Closure

    Arndt, G. Dickey; Ngo, Phong H.; Phan, Chau T.; Byerly, Diane; Dusl, John; Sognier, Marguerite A.; Carl, James


    A novel approach for the immediate sealing of traumatic wounds is under development. A portable microwave generator and handheld antenna are used to seal wounds, binding the edges of the wound together using a biodegradable protein sealant or solder. This method could be used for repairing wounds in emergency settings by restoring the wound surface to its original strength within minutes. This technique could also be utilized for surgical purposes involving solid visceral organs (i.e., liver, spleen, and kidney) that currently do not respond well to ordinary surgical procedures. A miniaturized microwave generator and a handheld antenna are used to deliver microwave energy to the protein solder, which is applied to the wound. The antenna can be of several alternative designs optimized for placement either in contact with or in proximity to the protein solder covering the wound. In either case, optimization of the design includes the matching of impedances to maximize the energy delivered to the protein solder and wound at a chosen frequency. For certain applications, an antenna could be designed that would emit power only when it is in direct contact with the wound. The optimum frequency or frequencies for a specific application would depend on the required depth of penetration of the microwave energy. In fact, a computational simulation for each specific application could be performed, which would then match the characteristics of the antenna with the protein solder and tissue to best effect wound closure. An additional area of interest with potential benefit that remains to be validated is whether microwave energy can effectively kill bacteria in and around the wound. Thus, this may be an efficient method for simultaneously sterilizing and closing wounds.

  13. Preparation of solder pads by selective laser scanning

    Wenqing Shi; Yongqiang Yang; Yanlu Huang; Guoqiang Wei; Wei Guo


    We propose a new laser preparation technique to solder Sn-Ag3.5-Cu0.7 on a copper clad laminate (CCL). The experiment is conducted by selective laser heating and melting the thin solder layer and then preprint-ing it on CCL in order to form the matrix with solder pads. Through the analysis of macro morphology of the matrix with solder pads and microstructure of single pads, this technique is proved to be suitable for preparing solder pads and that the solder pads are of good mechanical properties. The results also reveal that high frequency laser pulse is beneficial to the formation of better solder pad, and that the 12-W fiber laser with a beam diameter of 0.030 mm can solder Sn-Ag3.5-Cu0.7 successfully on CCL at 500-kHz pulse frequency. The optimized parameters of laser soldering on CCL are as follows: the laser power is 12 W, the scanning speed is 1.0 mm/s, the beam diameter is 0.030 mm, the lead-free solder is Sn-Ag3.5-Cu0.7, and the laser pulse frequency is 500 kHz.

  14. Biodiversity and ecological composition of macrobenthos on cold-water coral mounds and adjacent off-mound habitat in the bathyal Porcupine Seabight, NE Atlantic

    Henry, Lea-Anne; Roberts, J. Murray


    The cold-water scleractinian corals Lophelia pertusa and Madrepora oculata form mound structures on the continental shelf and slope in the NE Atlantic. This study is the first to compare the taxonomic biodiversity and ecological composition of the macrobenthos between on- and off-mound habitats. Seven box cores from the summits of three mounds and four cores from an adjacent off-mound area in the Belgica Mound Province in the Porcupine Seabight yielded 349 species, including 10 undescribed species. On-mound habitat was three times more speciose, and was richer with higher evenness and significantly greater Shannon's diversity than off-mound. Species composition differed significantly between habitats and the four best discriminating species were Pliobothrus symmetricus (more frequent off-mound), Crisia nov. sp, Aphrocallistes bocagei and Lophelia pertusa (all more frequent on-mound). Filter/suspension feeders were significantly more abundant on-mound, while deposit feeders were significantly more abundant off-mound. Species composition did not significantly differ between mounds, but similarity within replicates decreased from Galway MoundMound. We propose that, despite having greater vertical habitat heterogeneity that supports higher biodiversity, coral mounds have a characteristic "reef fauna" linked to species' biology that contrasts with the higher horizontal habitat heterogeneity conferred by the action of deposit feeders and a varied seabed sedimentary facies off-mound. Standardisation of equipment and restriction of analyses to higher taxonomic levels would facilitate prospective comparative analyses of cold-water coral biodiversity across larger spatio-temporal scales.

  15. Effects of AlN Nanoparticles on the Microstructure, Solderability, and Mechanical Properties of Sn-Ag-Cu Solder

    Jung, Do-Hyun; Sharma, Ashutosh; Lim, Dong-Uk; Yun, Jong-Hyun; Jung, Jae-Pil


    The addition of nanosized AlN particles to Sn-3.0 wt pctAg-0.5 wt pctCu (SAC305) lead-free solder alloy has been investigated. The various weight fractions of AlN (0, 0.03, 0.12, 0.21, 0.60 wt pct) have been dispersed in SAC305 solder matrix by a mechanical mixing and melting route. The influences of AlN nanosized particles on the microstructure, mechanical properties, and solderability ( e.g., spreadability and wettability) have been carried out. The structural and morphological features of the nanocomposite solder were characterized by scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and transmission electron microscope (TEM). The experimental results show that the best combination of solderability and mechanical properties is obtained at 0.21 wt pct AlN in the solder matrix. The reinforced composite solder with 0.21 wt pct AlN nanoparticles shows ≈25 pct improvement in ultimate tensile strength (UTS), and ≈4 pct increase in the spreadability. In addition, the results of microstructural analyses of composite solders indicate that the nanocomposite solder, especially reinforced with 0.21 wt pct of AlN nanoparticles, exhibits better microstructure and improved elongation percentage, compared with the monolithic SAC305 solder.

  16. Audit of Mound Plant`s reduction in force


    Objective of this audit was to determine whether the Mound Plant`s Fiscal Year 1992 reduction in force (RIF) was effectively managed and implemented properly by DOE. DOE established policy to encourage contractors to reduce staffing by voluntary separations without unreasonable separation costs. EG&G Mound`s FY 1992 RIF was accomplished by voluntary separations; however, its implementation unreasonably increased costs because DOE did not have adequate criteria or guidelines for evaluating contractors` RIF proposals, and because EG&G Mound furnished inaccurate cost data to DOE evaluators. The unreasonable costs amounted to at least $21 million. Recommendations are made that DOE develop and implement guidelines to impose limitations on voluntary separation allowances, early retirement incentive payments, and inclusion of crucial employee classifications in voluntary RIFs.

  17. Environmental assessment for commercialization of the Mound Plant


    In November 1993 US DOE decided to phase out operations at the Mound Plant in Miamisburg, Ohio, with the goal of releasing the site for commercial use. The broad concept is to transform the plant into an advanced manufacturing center with the main focus on commercializing products and other technology. DOE proposes to lease portions of the Mound Plant to commercial enterprises. This Environmental Impact statement has a finding of no significant impact in reference to such action.

  18. Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

    Roshanghias, Ali; Khatibi, Golta; Yakymovych, Andriy; Bernardi, Johannes; Ipser, Herbert


    Although considerable research has been dedicated to the synthesis and characterization of lead-free nanoparticle solder alloys, only very little has been reported on the reliability of the respective joints. In fact, the merit of nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature has always been challenged when compared with conventional solder joints, especially in terms of inferior solderability due to the oxide shell commonly present on the nanoparticles, as well as due to compatibility problems with common fluxing agents. Correspondingly, in the current study, Sn-Ag-Cu (SAC) nanoparticle alloys were combined with a proper fluxing vehicle to produce prototype nanosolder pastes. The reliability of the solder joints was successively investigated by means of electron microscopy and mechanical tests. As a result, the optimized condition for employing nanoparticles as a competent nanopaste and a novel procedure for surface treatment of the SAC nanoparticles to diminish the oxide shell prior to soldering are being proposed.

  19. Investigation of Solder Cracking Problems on Printed Circuit Boards

    Berkebile, M. J.


    A Solder Committee designated to investigate a solder cracking phenomena occurring on the SATURN electrical/electronic hardware found the cause to be induced stress in the soldered connections rather than faulty soldering techniques. The design of the printed circuit (PC) board assemblies did not allow for thermal expansion of the boards that occurred during normal operation. The difference between the thermal expansion properties of the boards and component lead materials caused stress and cracking in the soldered connections. The failure mechanism and various PC boards component mounting configurations are examined in this report. Effective rework techniques using flanged tubelets, copper tubelets, and soft copper wiring are detailed. Future design considerations to provide adequate strain relief in mounting configurations are included to ensure successful solder terminations.

  20. Assessment of potential solder candidates for high temperature applications

    Multi-Chip module (MCM) technology is a specialized electronic packaging technology recently gaining momentum due to the miniaturization drive in the microelectronics industry. The step soldering approach is being employed in the MCM technology. This method is used to solder various levels...... of the package with different solders of different melting temperatures. High Pb containing alloys where the lead levels can be above 85% by weight, is one of the solders currently being used in this technology. Responding to market pressure i.e. need for green electronic products there is now an increasing...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

  1. Termite mounds harness diurnal temperature oscillations for ventilation.

    King, Hunter; Ocko, Samuel; Mahadevan, L


    Many species of millimetric fungus-harvesting termites collectively build uninhabited, massive mound structures enclosing a network of broad tunnels that protrude from the ground meters above their subterranean nests. It is widely accepted that the purpose of these mounds is to give the colony a controlled microclimate in which to raise fungus and brood by managing heat, humidity, and respiratory gas exchange. Although different hypotheses such as steady and fluctuating external wind and internal metabolic heating have been proposed for ventilating the mound, the absence of direct in situ measurement of internal air flows has precluded a definitive mechanism for this critical physiological function. By measuring diurnal variations in flow through the surface conduits of the mounds of the species Odontotermes obesus, we show that a simple combination of geometry, heterogeneous thermal mass, and porosity allows the mounds to use diurnal ambient temperature oscillations for ventilation. In particular, the thin outer flutelike conduits heat up rapidly during the day relative to the deeper chimneys, pushing air up the flutes and down the chimney in a closed convection cell, with the converse situation at night. These cyclic flows in the mound flush out CO2 from the nest and ventilate the colony, in an unusual example of deriving useful work from thermal oscillations.

  2. Ireland's deep-water coral carbonate mounds: multidisciplinary research results

    Kozachenko, M.; Wheeler, A.; Beyer, A.; Blamart, D.; Masson, D.; Olu-Le Roy, K.


    Recent international research activity, involving a strong Irish collaboration, has shown that coral reefs are not exclusively associated with warm tropical waters but are also present in the deeper and colder Northeast Atlantic. In the Porcupine Seabight west of Ireland, coral-colonised carbonate mounds (up to 350m high) are present at 600-900m water depth. The corals Lophelia pertusa L. and Madrepora oculata L. contribute to this diverse ecosystem that may also play a significant role in expanding deep-water fisheries. New side-scan sonar, multibeam echosounder, sub-bottom profiler and underwater video imagery supplemented with sedimentological sample material were used to map the seabed in the environs of the Belgica Carbonate Mound province, eastern Porcupine Seabight. The data were integrated in a GIS and provides information on sediment pathways and benthic current patterns within the study area. A facies map of the study area highlights differing sedimentary processes showing evidences for strong northward bottom currents whose interaction has an influence on mounds growth and morphology. This survey revealed mound flanks dominated by sediment waves that give way to coral banks towards the mound summits. A form of coral accumulation was also documented. Detailed analyses of sediment properties from long cores through sediment drifts have generated a high-resolution palaeoclimate record revealing temporal patterns in bottom current strength variations. An accurate assessment of this influence on mound through a comparison with coral growth rates is ongoing.

  3. Anomalous creep in Sn-rich solder joints

    Song, Ho Geon; Morris Jr., John W.; Hua, Fay


    This paper discusses the creep behavior of example Sn-rich solders that have become candidates for use in Pb-free solder joints. The specific solders discussed are Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-0.7Cu and Sn-10In-3.1Ag, used in thin joints between Cu and Ni-Au metallized pads.

  4. Food preferences and mound-building behaviour of the mound-building mice Mus spicilegus

    Hölzl, Michaela; Krištofík, Ján; Darolová, Alžbeta; Hoi, Herbert


    Optimal foraging strategies and food choice are influenced by various factors, e.g. availability, size and caloric content of the food type and predation risk. However, food choice criteria may change when food is not eaten immediately but has to be carried to a storage site for later use. For example, handling time in terms of harvesting and transport time should be optimized, particularly when the risk of predation is high. Thus, it is not clear whether food selected by hoarding animals reflects their food preference due to intrinsic features of the food type, e.g. size, caloric or lipid content, or whether the food type selected is a compromise that also considers the handling time required for harvesting and transport. We investigate this question in relation to food hoarding behaviour in mound-building mice. In autumn, mound-building mice Mus spicilegus collect seeds and other plant material and cover it with soil. Such above-ground storage is quite unusual for rodents. Here, we investigated whether there is a relationship between the seed species preferred as building materials and those preferred for food. We conducted a seed preference test using three most collected weed species for mound building. Controlling factors like food availability or predation risk, mice prefer Setaria spp. as food, although Amaranthus spp. and Chenopodium spp. were preferentially harvested and stored. By including the availability of the three species, our experimental results were confirmed, namely, a clear preference for Setaria spp. Also, handling time and seed size revealed to influence plant choice.



    In order to study the mechanism of vacuum fluxless soldering on the conditions of laser heating, the method of measuring temperature by the thermocouple is used to analyze the spreading and wetting process of boh fluxless SnPb solder in the vacuum surroundings and flux SnPb solder on Cu pad. Solder spreading and wetting affected by the soldering thermal process is also discussed according to the thermodynamics principle. Results show that vacuum fluxless soldering demands higher temperature, and the fall of the solder su rface tension is the important factor achieving fluxless laser soldering.

  6. Solderability preservation through the use of organic inhibitors

    Sorensen, N.R.; Hosking, F.M.


    Organic inhibitors can be used to prevent corrosion of metals and have application in the electronics industry as solderability preservatives. We have developed a model to describe the action of two inhibitors (benzotriazole and imidazole) during the environmental aging and soldering process. The inhibitors bond with the metal surface and form a barrier that prevents or retards oxidation. At soldering temperatures, the metal-organic complex breaks down leaving an oxide-free metal surface that allows excellent wetting by molten solder. The presence of the inhibitor retards the wetting rate relative to clean copper, but provides a vast improvement relative to oxidized copper.

  7. Aging, stressing and solderability of electroplated and electroless copper

    Sorensen, N.R.; Hosking, F.M.


    Organic inhibitors can be used to prevent corrosion of metals have application in the electronics industry as solderability preservatives. We have developed a model to describe the action of two inhibitors (benzotriazole and imidazole) during the environmental aging and soldering process. The inhibitors bond with the metal surface and form a barrier that prevents or retards oxidation. At soldering temperatures, the metal-organic complex breaks down leaving an oxide-free metal surface that allows excellent wetting by the molten solder. The presence of the inhibitor retards the wetting rate relative to clean copper but provides a vast improvement relative to oxidized copper.

  8. High temperature solder alloys for underhood applications: Final report

    Kern, J.A. [Univ. of New Mexico, Albuquerque, NM (United States). Dept. of Mechanical Engineering; Drewien, C.A.; Yost, F.G.; Sackinger, S. [Sandia National Laboratories, Albuquerque, NM (United States); Weiser, M.W. [Johnson-Mathey Electronics Corp., Spokane, WA (United States)


    In this continued study, the microstructural evolution and peel strength as a function of thermal aging were evaluated for four Sn-Ag solders deposited on double layered Ag-Pt metallization. Additionally, activation energies for intermetallic growth over the temperature range of 134 to 190{degrees}C were obtained through thickness measurements of the Ag-Sn intermetallic that formed at the solder-metallization interface. It was found that Bi-containing solders yielded higher activation energies for the intermetallic growth, leading to thicker intermetallic layers at 175 and 190{degrees}C for times of 542 and 20.5 hrs, respectively, than the solders free of Bi. Complete reaction of the solder with the metallization occurred and lower peel strengths were measured on the Bi-containing solders. In all solder systems, a Ag-Sn intermetallic thickness of greater than {approximately}7 {mu}m contributed to lower peel strength values. The Ag-Sn binary eutectic composition and the Ag-Sn-Cu ternary eutectic composition solders yielded lower activation energies for intermetallic formation, less microstructural change with time, and higher peel strengths; these solder systems were resilient to the effects of temperatures up to 175{degrees}C. Accelerated isothermal aging studies provide useful criteria for recommendation of materials systems. The Sn-Ag and Sn-Ag-Cu eutectic compositions should be considered for future service life and reliability studies based upon their performance in this study.

  9. Recent Research Trend in Laser-Soldering Process

    Kim, Hwan Tae; Kil, Sang Cheol [Korea Institute of Science and Technology Information, Seoul (Korea, Republic of); Hwang, Woon Suk [Inha University, Incheon (Korea, Republic of)


    The trend of the microjoining technology by the laser-soldering process has been reviewed. Among the production technologies, joining technology plays an important role in the fabrication of electronic components. This has led to an increasing attention towards the use of modem microjoining technology such as micro-resistance spot joining micro-soldering, micro-friction stir joining and laser-soldering, etc. This review covers the recent technical trends of laser-soldering collected from the COMPENDEX DB analysis of published papers, research subject and research institutes.

  10. Hydrodynamic Conditions Influencing Cold-Water Coral Carbonate Mound Development (Challenger Mound, Porcupine Seabight, NE Atlantic): a Contribution to IODP Exp307

    Thierens, M.; Odonnell, R.; Stuut, J.; Titschack, J.; Dorschel, B.; Wheeler, A. J.


    Cold-water coral carbonate mounds are complex geo-biological systems, originating from the interplay of hydrodynamic, sedimentological and biological factors. As changes in hydrodynamic and sedimentary regime are assumed to be amongst the main controls on mound evolution, reconstruction of the hydrodynamic and palaeoclimatic microenvironment on-mound, compared to the background environmental conditions (as seen off- mound), contributes to the fundamental understanding of these intriguing features and the development of a cold- water coral carbonate mound development model. Challenger Mound, one of the large cold-water coral carbonate mounds along the eastern Porcupine Seabight continental margin (NE Atlantic, SW off Ireland), was successfully drilled during IODP Expedition 307, providing the first complete recovery of a continuous sedimentary sequence through a carbonate mound. High-resolution particle size analysis of the terrigenous sediment component is used as primary proxy for reconstructing the hydrodynamic conditions during mound development. First results indicate repeated shifts in hydrodynamic conditions during sediment deposition on Challenger Mound, from lower-energetic conditions to higher-energetic environments and visa versa, which might reflect environmental variation over interglacial-glacial timescales throughout the whole mound development period. In conjunction with other available data, this dataset provides insight in local current regimes and sediment dynamics, the specific role of cold-water corals in these complex geo-biological systems and the differentiation of different sediment contributors to the coral mound system and its surroundings.

  11. Carbonate mound evolution and coral diagenesis viewed by U-series dating of deep water corals

    Frank, N.; Ricard, E.; Blamart, D.; van der Land, C.; Colin, C.; Foubert, A.; van Rooij, D.; van Weering, T.


    U-series dating of constructional deep sea corals is a powerful tool to reconstruct the evolution of carbonate mound sediments driven by coral growth, sediment trapping and diagenesis. Here we have investigated in great detail the time framework of constructional corals such as L. pertusa and M. oculata on 5 different mounds of the eastern North Atlantic (on Rockall Bank and in Porcupine Seabight) taken at variable depth and location (610 to 880m water depth). Periods favorable for coral growth are the Holocene and prior interglacials such as marine isotope stage 5 and 7, while glacial coral growth seems inhibited or extremely reduced. Coral development is almost continuous throughout the Holocene since mound re-colonization about 10,500 years ago. Mound accumulation rates vary between 20 and 220 cm/kyr determined from the coral age - depth relationship in each core. Those changes are most likely driven by changes between horizontal and vertical mound accumulation, food supply and ocean circulation. In addition, coral dating allowed to identify an important erosional event recorded in core MD01-2455G from Rockall Bank. Here a 1m thick sediment layer containing ancient corals likely from the start of Holocene re-colonization was displaced (collapsed) from further upslope on top of younger corals of ~2500 to 3000 years age. Prior to the initiation of coral growth diagenesis occurred frequently resulting in (1) the construction of so called carbonate hardgrounds and/or (2) the dissolution of the pre-Holocene coral framework. Solely, the deepest selected core in Porcupine Seabight (MD01-2463G at 880m depth) reveals coral re-colonization on an undisturbed ancient reef structure that dates back to 250,000 years. Diagenesis of earlier coral reef generations leading to coral dissolution leads to a loss of magnetic susceptibility and open system behavior of the coral skeletons with respect to U-series dating. While the processes causing such diagenetic layers are barely

  12. From Shell Midden to Midden-Mound: The Geoarchaeology of Mound Key, an Anthropogenic Island in Southwest Florida, USA.

    Victor D Thompson

    Full Text Available Mound Key was once the capital of the Calusa Kingdom, a large Pre-Hispanic polity that controlled much of southern Florida. Mound Key, like other archaeological sites along the southwest Gulf Coast, is a large expanse of shell and other anthropogenic sediments. The challenges that these sites pose are largely due to the size and areal extent of the deposits, some of which begin up to a meter below and exceed nine meters above modern sea levels. Additionally, the complex depositional sequences at these sites present difficulties in determining their chronology. Here, we examine the development of Mound Key as an anthropogenic island through systematic coring of the deposits, excavations, and intensive radiocarbon dating. The resulting data, which include the reversals of radiocarbon dates from cores and dates from mound-top features, lend insight into the temporality of site formation. We use these insights to discuss the nature and scale of human activities that worked to form this large island in the context of its dynamic, environmental setting. We present the case that deposits within Mound Key's central area accumulated through complex processes that represent a diversity of human action including midden accumulation and the redeposition of older sediments as mound fill.

  13. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    Mohd Nizam Ab. Rahman


    Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

  14. Effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder

    XUE Song-bai; YU Sheng-lin; WANG Xu-yan; LIU lin; HU Yong-fang; YAO Li-hua


    Several important properties of the micron-powdered Sn-Ag-Cu-Ce solder, including the spreadability, spreading ratio, wetting time, and melting point, were investigated for verifying the effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder. The solidus and the liquidus of the micron-powdered Sn-Ag-Cu-Ce solder are 193.6℃ and 218.4℃, respectively, about 28℃ and 3℃ lower than the melting point of the block Sn-Ag-Cu solder, which reminds the existence of the surface effect of the micron-powdered solder. By adding Ce into Sn-Ag-Cu alloy, its wetting time on pure copper can be obviously decreased. For the Sn-Ag-Cu-0.03%Ce, the soldering temperature is 250℃, and the wetting time on pure copper is close to 1s, with the soldering temperature approaching to 260℃, the wetting time is dropped to 0.8s, which is close to the wetting time, 0.68s, of Sn-Pb solder at 235℃.

  15. A Study of the Interface of Soldered Joints of SnInAgTi Active Solder with Ito Ceramics

    M. Provazník


    Full Text Available This paper presents an analysis of the solderability ITO ceramics (In2O3/SnO2. The soft active solder SnInAgeTi was used for the experiments. The solder was activated by power ultrasound in air without flux. An analysis of the interface of the phases between the solder and the ceramic was carried out in order to discover the ultrasonic impacts on the active metal and to identify the mechanism of the joint on the ceramic side.

  16. Cold-water coral carbonate mounds as unique palaeo-archives: the Plio-Pleistocene Challenger Mound record (NE Atlantic)

    Thierens, M.; Browning, E.; Pirlet, H.; Loutre, M.-F.; Dorschel, B.; Huvenne, V. A. I.; Titschack, J.; Colin, C.; Foubert, A.; Wheeler, A. J.


    Through the interplay of a stabilising cold-water coral framework and a dynamic sedimentary environment, cold-water coral carbonate mounds create distinctive centres of bio-geological accumulation in often complex (continental margin) settings. The IODP Expedition 307 drilling of the Challenger Mound (eastern Porcupine Seabight; NE Atlantic) not only retrieved the first complete developmental history of a coral carbonate mound, it also exposed a unique, Early-Pleistocene sedimentary sequence of exceptional resolution along the mid-latitudinal NE Atlantic margin. In this study, a comprehensive assessment of the Challenger Mound as an archive of Quaternary palaeo-environmental change and long-term coral carbonate mound development is presented. New and existing environmental proxy records, including clay mineralogy, planktonic foraminifer and calcareous nannofossil biostratigraphy and assemblage counts, planktonic foraminifer oxygen isotopes and siliciclastic particle-size, are thereby discussed within a refined chronostratigraphic and climatic context. Overall, the development of the Challenger Mound shows a strong affinity to the Plio-Pleistocene evolution of the Northern Hemisphere climate system, albeit not being completely in phase with it. The two major oceanographic and climatic transitions of the Plio-Pleistocene - the Late Pliocene/Early Pleistocene intensification of continental ice-sheet development and the mid-Pleistocene transition to the more extremely variable and more extensively glaciated late Quaternary - mark two major thresholds in Challenger Mound development: its Late Pliocene (>2.74 Ma) origin and its Middle-Late Pleistocene to recent decline. Distinct surface-water perturbations (i.e. water-mass/polar front migrations, productivity changes, melt-water pulses) are identified throughout the sequence, which can be linked to the intensity and extent of ice development on the nearby British-Irish Isles since the earliest Pleistocene. Glaciation

  17. HiRISE observations of fractured mounds: Possible Martian pingos

    Dundas, C.M.; Mellon, M.T.; McEwen, A.S.; Lefort, A.; Keszthelyi, L.P.; Thomas, N.


    Early images from the High Resolution Imaging Science Experiment (HiRISE) camera have revealed small fractured mounds in the Martian mid-latitudes. HiRISE resolves fractures on the mound surfaces, indicating uplift, and shows that the mound surface material resembles that of the surrounding landscape. Analysis of Mars Orbiter Camera (MOC) images shows that in Utopia Planitia the mounds lie almost exclusively between 35-45??N. This range coincides with the peak-abundance latitudes of several landforms attributed to ground water or ice, including gullies, and suggests a ground ice-related origin. The best terrestrial analogues for the observed mound morphology are pingos, although some differences are noted. The presence of uncollapsed. pingos would indicate the presence of near-surface ground ice in the Martian mid-latitudes, at depths greater than the ???1 meter sampled by orbital spectrometers. Pingo formation may require near-surface liquid water, which is consistent with a shallow groundwater model for the origin of gullies. Copyright 2008 by the American Geophysical Union.

  18. Surface tension and reactive wetting in solder connections

    Wedi, Andre; Schmitz, Guido [Institut fuer Materialphysik, Westf. Wilhelms-Universitaet, Wilhelm-Klemm-Strasse 10, 48149 Muenster (Germany)


    Wetting is an important pre-requisite of a reliable solder connection. However, it is only an indirect measure for the important specific energy of the reactive interface between solder and base metallization. In order to quantify this energy, we measured wetting angles of solder drops as well as surface tension of SnPb solders under systematic variation of composition and gaseous flux at different reflow temperatures. For the latter, we used the sessile drop method placing a solder drop on a glas substrate. From the two independent data sets, the important energy of the reactive interface is evaluated based on Young's equation. Remarkably, although both, the tension between the solder and flux and the wetting angle, reveal significant dependence on solder composition. So the adhesion energy reveals distinguished plateaus which are related to different reaction products in contact to the solder. TEM analysis and calculations of phase stabilities show that there is no Cu6Sn5 for high lead concentrations. The experiments confirm a model of reactive wetting by Eustathopoulos.

  19. Assessment of potential solder candidates for high temperature applications

    of the package with different solders of different melting temperatures. High Pb containing alloys where the lead levels can be above 85% by weight, is one of the solders currently being used in this technology. Responding to market pressure i.e. need for green electronic products there is now an increasing...

  20. Cost comparison modeling between current solder sphere attachment technology and solder jetting technology

    Davidson, R.N.


    By predicting the total life-cycle cost of owning and operating production equipment, it becomes possible for processors to make accurate and intelligent decisions regarding major capitol equipment investments as well as determining the most cost effective manufacturing processes and environments. Cost of Ownership (COO) is a decision making technique based on inputting the total costs of acquiring, operating and maintaining production equipment. All quantitative economic and production data can be modeled and processed using COO software programs such as the Cost of Ownership Luminator program TWO COOL{trademark}. This report investigated the Cost of Ownership differences between the current state-of-the-art solder ball attachment process and a prototype solder jetting process developed by Sandia National Laboratories. The prototype jetting process is a novel and unique approach to address the anticipated high rate ball grid array (BGA) production requirements currently forecasted for the next decade. The jetting process, which is both economically and environmentally attractive eliminates the solder sphere fabrication step, the solder flux application step as well as the furnace reflow and post cleaning operations.

  1. A Study of Solder Alloy Ductility for Cryogenic Applications

    Lupinacci, A.; Shapiro, A. A.; Suh, J-O.; Minor, A. M.


    For aerospace applications it is important to understand the mechanical performance of components at the extreme temperature conditions seen in service. For solder alloys used in microelectronics, cryogenic temperatures can prove problematic. At low temperatures Sn-based solders undergo a ductile to brittle transition that leads to brittle cracks, which can result in catastrophic failure of electronic components, assemblies and spacecraft payloads. As industrial processes begin to move away from Pb-Sn solder, it is even more critical to characterize the behavior of alternative Sn-based solders. Here we report on initial investigations using a modified Charpy test apparatus to characterize the ductile to brittle transformation temperature of nine different solder systems.

  2. Hybrid microcircuit board assembly with lead-free solders

    Vianco, P.T.; Hernandez, C.L.; Rejent, J.A.


    An assessment was made of the manufacturability of hybrid microcircuit test vehicles assembled using three Pb-free solder compositions 96.5Sn--3.5Ag (wt.%), 91.84Sn--3.33Ag--4.83Bi, and 86.85Sn--3.15Ag--5.0Bi--5.0Au. The test vehicle substrate was 96% alumina; the thick film conductor composition was 76Au--21Pt--3Pd. Excellent registration between the LCCC or chip capacitor packages and the thick film solder pads was observed. Reduced wetting of bare (Au-coated) LCCC castellations was eliminated by hot solder dipping the I/Os prior to assembly of the circuit card. The Pb-free solders were slightly more susceptible to void formation, but not to a degree that would significantly impact joint functionality. Microstructural damage, while noted in the Sn-Pb solder joints, was not observed in the Pb-free interconnects.

  3. Current Status of Lead-Free Soldering and Conductive Adhesives



    Lead-free soldering technology took offin the Japanese market during the year 2000, and as the year 2001-03 ushered in the 21 st century, a large number of products with lead-free soldering were already appearing on store shelves. Elsewhere, EU deliberation on the draft of the WEEE/RoHS directive finalized in February 2003 and be in force in July 2006. The course had been set for adopting lead-free solder for mounting processes of parts as well, bringing the possibility of lead-free solder mounting very close to achievement. This review will provide a view of the current state of technological progress in lead-free soldering, both in Japan and abroad, and will discuss future prospects.

  4. Development of lead-free solders for hybrid microcircuits

    Hosking, F.M.; Vianco, P.T.; Frear, D.R.; Robinson, D.G.


    Extensive work has been conducted by industry to develop lead-free solders for electronics applications. The driving force behind this effort is pressure to ban or tax the use of lead-bearing solders. There has been further interest to reduce the use of hazardous chemical cleaners. Lead-free soldering and low-residue, ``no clean`` assembly processing are being considered as solutions to these environmental issues. Most of the work has been directed toward commercial and military printed wiring board (PWB) technology, although similar problems confront the hybrid microcircuit (HMC) industry, where the development of lead-free HMC solders is generally lagging. Sandia National Laboratories is responsible for designing a variety of critical, high reliability hybrid components for radars. Sandia has consequently initiated a project, as part of its Environmentally Conscious Manufacturing program, to develop low-residue, lead-free soldering for HMCs. This paper discusses the progress of that work.

  5. Louth Crater: Evolution of a layered water ice mound

    Brown, Adrian J; Tornabene, Livio L; Roush, Ted L


    We report on observations made of the ~36km diameter crater, Louth, in the north polar region of Mars (at 70{\\deg}N, 103.2{\\deg}E). High-resolution imagery from the instruments on the Mars Reconnaissance Orbiter (MRO) spacecraft has been used to map a 15km diameter water ice deposit in the center of the crater. The water ice mound has surface features that include roughened ice textures and layering similar to that found in the North Polar Layered Deposits. Features we interpret as sastrugi and sand dunes show consistent wind patterns within Louth over recent time. CRISM spectra of the ice mound were modeled to derive quantitative estimates of water ice and contaminant abundance, and associated ice grain size information. These morphologic and spectral results are used to propose a stratigraphy for this deposit and adjoining sand dunes. Our results suggest the edge of the water ice mound is currently in retreat.

  6. Environmental survey preliminary report, Mound Plant, Miamisburg, Ohio


    This report presents the preliminary findings from the first phase of the Environmental Survey of the United States Department of Energy (DOE) Mound Plant, conducted August 18 through 29, 1986. The objective of the Survey is to identify environmental problems and areas of environmental risk associated with the Mound Plant. The Survey covers all environmental media and all areas of environmental regulation. It is being performed in accordance with the DOE Environmental Survey Manual. The on-site phase of the Survey involves the review of existing site environmental data, observations of the operations carried on at the Mound Plant, and interviews with site personnel. The Survey found no environmental problems at the Mound Plant that represent an immediate threat to human life. The environmental problems identified at the Mound Plant by the Survey confirm that the site is confronted with a number of environmental problems which are by and large a legacy from past practices at a time when environmental problems were less well understood. Theses problems vary in terms of their magnitude and risk, as described in this report. Although the sampling and analysis performed by the Mound Plant Survey will assist in further identifying environmental problems at the site, a complete understanding of the significance of some of the environmental problems identified requires a level of study and characterization that is beyond the scope of the Survey. Actions currently under way or planned at the site, particularly the Phase II activities of the Comprehensive Environmental Analysis and Response Program (CEARP) as developed and implemented by the Albuquerque Operations Office, will contribute toward meeting this requirement. 85 refs., 24 figs., 20 tabs.

  7. Reconstruction of The Paleoenvironment of A Carbonate Mound In The Porcupine Seabight, West Off Ireland

    Rüggeberg, A.; Dorschel, B.; Dullo, W.-Chr.

    The Propeller Mound in the Porcupine Seabight is part of a cluster of high relief carbonate mounds extending along the European continental margin from Norway to southern Ireland. During POSEIDON cruise POS265 in September 2000 this mound was surveyed and several sediment cores with core lengths of up to 5.90 m were retrieved, located on-mound and off-mound positions. Investigations of these cores are concentrated on faunal assemblages of benthic foraminifers, grain size analysis, sortable silt, spectrophotometric data, and stable isotope and TC/TOC measurements. Forming an on-mound - off-mound transect the gravity cores will be compared in terms of temporal changes of the measured data to interpret the palaeoceanographical settings and palaeoproductivity along the Propeller Mound.

  8. Shallow water mud-mounds of the Early Devonian Buchan Group, East Gippsland, Australia

    Tosolini, A.-M. P.; Wallace, M. W.; Gallagher, S. J.


    The Lower Devonian Rocky Camp Member of the Murrindal Limestone, Buchan Group of southeastern Australia consists of a series of carbonate mud-mounds and smaller lagoonal bioherms. The Rocky Camp mound is the best exposed of the mud-mounds and has many characteristics in common with Waulsortian (Carboniferous) mounds. Detailed paleoecological and sedimentological studies indicate that the mound initially accumulated in the photic zone, in contrast to most of the previously recorded mud-mounds. Five facies are present in the mud-mound: a Dasycladacean Wackestone Facies at the base of the mound represents a moderate energy, shallow water bank environment within the photic zone. A Crinioidal Wackestone Facies was deposited in a laterally equivalent foreslope setting. A Poriferan-Crinoidal Mudstone Facies developed in a quiet, deeper water, lee-side mound setting associated with a minor relative sea-level rise. A Stromatoporoid-Coralline Packstone Facies in the upper part of the mound deposited in a high-energy, fair-weather wave base, mound-front environment. The crest of the mound is represented by a Crinoidal-Receptaculitid Packstone Facies indicative of a moderate-energy mound-top environment in the photic zone, sheltered by the mound-front stromatoporoid-coral communities. A mound flank facies is present on the southern side of the mound and this consists of high-energy crinoidal grainstones. Mud-mound deposition was terminated by a transgression that deposited dark gray, fossil-poor marl of the overlying Taravale Formation. The Rocky Camp mound appears to have originated in shallow water photic zone conditions and grew into a high-energy environment, with the mound being eventually colonized by corals and stromatoporoids. The indications of a high-energy environment during later mound growth (growth form of colonial metazoans and grainstones of the flanking facies) suggest that the micrite in the mound was autochthonous and implies the presence of an energy



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  10. Duality Symmetry and Soldering in Different Dimensions

    Banerjee, R


    We develop a systematic method of obtaining duality symmetric actions in different dimensions. This technique is applied for the quantum mechanical harmonic oscillator, the scalar field theory in two dimensions and the Maxwell theory in four dimensions. In all cases there are two such distinct actions. Furthermore, by soldering these distinct actions in any dimension a master action is obtained which is duality invariant under a much bigger set of symmetries than is usually envisaged. The concept of swapping duality is introduced and its implications are discussed. The effects of coupling to gravity are also elaborated. Finally, the extension of the analysis for arbitrary dimensions is indicated.

  11. Electromigration of composite Sn-Ag-Cu solder bumps

    Sharma, Ashutosh; Xu, Di Erick; Chow, Jasper; Mayer, Michael; Sohn, Heung-Rak; Jung, Jae Pil


    This study investigates the electromigration (EM) behavior of lead free Sn-Ag-Cu (SAC) solder alloys that were reinforced with different types of nanoparticles [Copper-coated carbon nanotubes (Cu/CNT), La2O3, Graphene, SiC, and ZrO2]. The composite solders were bumped on a Cu substrate at 220°C, and the resistance of the bumped solders was measured using a four wire setup. Current aging was carried out for 4 hours at a temperature of 160°C, and an increase in resistance was noted during this time. Of all the composite solders that were studied, La2O3 and SiC reinforced SAC solders exhibited the smallest resistances after current aging. However, the rate of change in the resistance at room temperature was lower for the SiC-reinforced SAC solder. The SAC and Graphene reinforced SAC solder bumps completely failed within 15 - 20 min of these tests. The SiC nanoparticles were reported to possibly entrap the SAC atoms better than other nanoparticles with a lower rate of EM. [Figure not available: see fulltext.

  12. Environmentally compatible solder materials for thick film hybrid assemblies

    Hosking, F.M.; Vianco, P.T.; Rejent, J.A.; Hernandez, C.L. [Sandia National Labs., Albuquerque, NM (United States). Materials and Process Sciences Center


    New soldering materials and processes have been developed over the last several years to address a variety of environmental issues. One of the primary efforts by the electronics industry has involved the development of alternative solders to replace the traditional lead-containing alloys. Sandia National Laboratories is developing such alternative solder materials for printed circuit board and hybrid microcircuit (HMC) applications. This paper describes the work associated with low residue, lead-free soldering of thick film HMC`s. The response of the different materials to wetting, aging, and mechanical test conditions was investigated. Hybrid test vehicles were designed and fabricated with a variety of chip capacitors and leadless ceramic chip carriers to conduct thermal, electrical continuity, and mechanical evaluations of prototype joints. Microstructural development along the solder and thick film interface, after isothermal solid state aging over a range of elevated temperatures and times, was quantified using microanalytical techniques. Flux residues on soldered samples were stressed (temperature-humidity aged) to identify potential corrosion problems. Mechanical tests also supported the development of a solder joint lifetime prediction model. Progress of this effort is summarized.

  13. Simulation of thermomechanical fatigue in solder joints

    Fang, H.E.; Porter, V.L.; Fye, R.M.; Holm, E.A. [Sandia National Labs., Albuquerque, NM (United States)


    Thermomechanical fatigue (TMF) is a very complex phenomenon in electronic component systems and has been identified as one prominent degradation mechanism for surface mount solder joints in the stockpile. In order to precisely predict the TMF-related effects on the reliability of electronic components in weapons, a multi-level simulation methodology is being developed at Sandia National Laboratories. This methodology links simulation codes of continuum mechanics (JAS3D), microstructural mechanics (GLAD), and microstructural evolution (PARGRAIN) to treat the disparate length scales that exist between the macroscopic response of the component and the microstructural changes occurring in its constituent materials. JAS3D is used to predict strain/temperature distributions in the component due to environmental variable fluctuations. GLAD identifies damage initiation and accumulation in detail based on the spatial information provided by JAS3D. PARGRAIN simulates the changes of material microstructure, such as the heterogeneous coarsening in Sn-Pb solder, when the component`s service environment varies.

  14. Albumin-genipin solder for laser tissue welding

    Lauto, Antonio; Foster, John; Avolio, Albert; Poole-Warren, Laura


    Background. Laser tissue soldering (LTS) is an alternative technique to suturing for tissue repair. One of the major drawbacks of LTS is the weak tensile strength of the solder welds when compared to sutures. In this study, the possibility was investigated for a low cytotoxic crosslinker, acting on amino groups, to enhance the bond strength of albumin solders. Materials and Methods. Solder strips were welded onto rectangular sections of sheep small intestine by a diode laser. The laser delivered in continuous mode mode a power of 170 +/- 10 mW at λ=808 nm, through a multimode optical fiber (core size = 200 μm) to achieve a dose of 10.8 +/- 0.5 J/mg. The solder thickness and surface area were kept constant throughout the experiment (thickness = 0.15 +/- 1 mm, area = 12 +/- 1.2 mm2). The solder incorporated 62% bovine serum albumin, 0.38% genipin, 0.25% indocyanin green dye (IG) and water. Tissue welding was also performed with a similar solder, which did not incorporate genipin, as a control group. The repaired tissue was tested for tensile strength by a calibrated tensiometer. Results. The tensile strength of the "genipin" solder was twice as high as the strength of the BSA solder (0.21 +/- 0.04 N and 0.11 +/- 0.04 N respectively; p~10-15 unpaired t-test, N=30). Discussion. Addition of a chemical crosslinking agent, such as genipin, significantly increased the tensile strength of adhesive-tissue bonds. A proposed mechanism for this enhanced bond strength is the synergistic action of mechanical adhesion with chemical crosslinking by genipin.

  15. Innovative rubble mound breakwaters for overtopping wave energy conversion

    Vicinanza, Diego; Contestabile, Pasquale; Nørgaard, Jørgen Quvang Harck


    This paper intends contributing to the development of an economically and environmentally sustainable coastal infrastructure, which combines rubble mound breakwaters with Wave Energy Converters (WEC). The energy is produced by collecting wave overtopping in a front reservoir, which is returned to...

  16. Numerical evaluation of stability methods for rubble mound breakwater toes

    Verpoorten, S.P.K.; Ockeloen, W.J.; Verhagen, H.J.


    Since 1977 dedicated studies are made to the stability of rubble mound break-water toes under wave attack. A large number of stability methods is available, but prediction accuracy is low and validity ranges are too small for use in prac-tice. In this research the decoupled model approach is used to

  17. Post Earthquack Slope Stability Analysis of Rubble Mound Breakwater

    Amin Moradi


    Full Text Available Rubble mound breakwaters are structures built mainly of quarried rock. Generally armourstone or artificial concrete armour units are used for the outer armour layer,which should protect the structure againist wave attack. Armour stones and concrete armoure unites in this outer layer are usually placed with care to obtain effective interlocking and consequently better stability .

  18. Transient solutions to groundwater mounding in bounded and unbounded aquifers.

    Korkmaz, Serdar


    In this study, the well-known Hantush solution procedure for groundwater mounding under infinitely long infiltration strips is extended to finite and semi-infinite aquifer cases. Initially, the solution for infinite aquifers is presented and compared to those available in literature and to the numerical results of MODFLOW. For the finite aquifer case, the method of images, which is commonly used in well hydraulics, is used to be able to represent the constant-head boundaries at both sides. It is shown that a finite number of images is enough to obtain the results and sustain the steady state. The effect of parameters on the growth of the mound and on the time required to reach the steady state is investigated. The semi-infinite aquifer case is emphasized because the growth of the mound is not symmetric. As the constant-head boundary limits the growth, the unbounded side grows continuously. For this reason, the groundwater divide shifts toward the unbounded side. An iterative solution procedure is proposed. To perform the necessary computations a code was written in Visual Basic of which the algorithm is presented. The proposed methodology has a wide range of applicability and this is demonstrated using two practical examples. The first one is mounding under a stormwater dispersion trench in an infinite aquifer and the other is infiltration from a flood control channel into a semi-infinite aquifer. Results fit very well with those of MODFLOW.

  19. Oblique wave transmission through rough impermeable rubble mound submerged breawaters

    VanLishout, V.; Verhagen, H.J.; Troch, P.


    There is a growing interest in the application of submerged rubble mound breakwaters as coastal defence structures. As their defensive ability highly depends on the amount of wave energy remaining at their lee side, the accurate prediction of the energy in the lee of such structures is of utmost imp

  20. Oblique wave transmission through rough impermeable rubble mound submerged breakwaters

    Vanlishout, V.; Verhagen, H.J.; Troch, P.


    There is a growing interest in the application of submerged rubble mound breakwaters as coastal defence structures. As their defensive ability highly depends on the amount of wave energy remaining at their lee side, the accurate prediction of the energy in the lee of such structures is of utmost imp

  1. Simulating the rubble mound underlying armour units protecting a breakwater

    Cooper, Antony K


    Full Text Available mounds underlying the armour units. In its most primitive form, we model the rubble as a static structure with flat surfaces and then pack the selected armour units on top. This reduces the complexity, but the porosity of the packing close to the rubble...

  2. Avalanche Statistics of Driven Granular Slides in a Miniature Mound

    Juanico, D E; Batac, R; Monterola, C


    We examine avalanche statistics of rain- and vibration-driven granular slides in miniature soil mounds using experimental and numerical approaches. A crossover from power-law to non power-law avalanche-size statistics is demonstrated as a generic driving rate $\

  3. Mechanical Reliability of Aged Lead-­Free Solders

    Lewin, Susanne


    The usage of lead-­free solder joints in electronic packaging is of greatest concern to the electronic industry due to the health and environmental hazards arising with the use of lead. As a consequence, lead is legally prohibited in the European Union and the industry is aiming to produce lead-free products.            The reliability of solder joints is an important issue as the failure could destroy the whole function of a product. SnAgCu is a commonly used alloy for lead-­free solders. Co...

  4. Solder technology in the manufacturing of electronic products

    Vianco, P.T.


    The electronics industry has relied heavily upon the use of soldering for both package construction and circuit assembly. The solder attachment of devices onto printed circuit boards and ceramic microcircuits has supported the high volume manufacturing processes responsible for low cost, high quality consumer products and military hardware. Defects incurred during the manufacturing process are minimized by the proper selection of solder alloys, substrate materials and process parameters. Prototyping efforts are then used to evaluate the manufacturability of the chosen material systems. Once manufacturing feasibility has been established, service reliability of the final product is evaluated through accelerated testing procedures.

  5. Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

    CHEN Wenxue; XUE Songbai; WANG Hui; WANG Jianxin; HAN Zongjie


    The eutectie Sn-9Zn alloy was doped with Ag (0 wt.%-1 wt.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed at the solder/Cu interface were also examined in this study. The results show that, due to the addition of Ag, the microstructure of the solder changes. When the quan-tity of Ag is lower than 0.3 wt.%, the needle-like Zn-rich phase decreases gradually. However, when the quantity of Ag is 0.5 wt.%-1 wt.%, Ag-Zn intermetallic compounds appear in the solder. In particular, adding 0.3 wt.% Ag improves the wetting behavior due to the better oxi-dation resistance of the Sn-9Zn solder. The addition of an excessive amount of Ag will deteriorate the wetting property because the gluti-nosity and fluidity of Sn-9Zn-(0.5, 1)Ag solder decrease. The results also indicate that the addition of Ag to the Sn-Zn solder leads to the pre-cipitation of ε-AgZn_3 from the liquid solder on preformed interracial intermetallics (Cu_5Zn_8). The peripheral AgZn_3, nodular on the Cu_5Zn_8 IMCs layer, is likely to be generated by a peritectic reaction L+γ-Ag_5Zn8→ε-AgZn_3 and the following crystallization of AgZn_3.

  6. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Liu Mei Lee


    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  7. The West Melilla cold water coral mounds, Eastern Alboran Sea: Morphological characterization and environmental context

    Lo Iacono, Claudio; Gràcia, Eulàlia; Ranero, Cesar R.; Emelianov, Mikhail; Huvenne, Veerle A. I.; Bartolomé, Rafael; Booth-Rea, Guillermo; Prades, Javier; Ambroso, Stefano; Dominguez, Carlos; Grinyó, Jordi; Rubio, Eduardo; Torrent, Josep


    A new mound field, the West Melilla mounds, interpreted as being cold-water coral mounds, has been recently unveiled along the upper slope of the Mediterranean Moroccan continental margin, a few kilometers west of the Cape Tres Forcas. This study is based on the integration of high-resolution geophysical data (swath bathymetry, parametric sub-bottom profiler), CTD casts, Acoustic Doppler Current Profiler (ADCP), ROV video and seafloor sampling, acquired during the TOPOMED GASSIS (2011) and MELCOR (2012) cruises. Up to 103 mounds organized in two main clusters have been recognized in a depth range of 299-590 m, displaying a high density of 5 mounds/km2. Mounds, 1-48 m high above the surrounding seafloor and on average 260 m wide, are actually buried by a 1-12 m thick fine-grained sediment blanket. Seismic data suggest that the West Melilla mounds grew throughout the Early Pleistocene-Holocene, settling on erosive unconformities and mass movement deposits. During the last glacial-interglacial transition, the West Melilla mounds may have suffered a drastic change of the local sedimentary regime during the late Holocene and, unable to stand increasing depositional rates, were progressively buried. At the present day, temperature and salinity values on the West Melilla mounds suggest a plausible oceanographic setting, suitable for live CWCs. Nonetheless, more data is required to groundtruth the West Melilla mounds and better constrain the interplay of sedimentary and oceanographic factors during the evolution of the West Melilla mounds.

  8. Are termite mounds biofilters for methane? - Challenges and new approaches to quantify methane oxidation in termite mounds

    Nauer, Philipp A.; Hutley, Lindsay B.; Bristow, Mila; Arndt, Stefan K.


    Methane emissions from termites contribute around 3% to global methane in the atmosphere, although the total source estimate for termites is the most uncertain among all sources. In tropical regions, the relative source contribution of termites can be far higher due to the high biomass and relative importance of termites in plant decomposition. Past research focused on net emission measurements and their variability, but little is known about underlying processes governing these emissions. In particular, microbial oxidation of methane (MOX) within termite mounds has rarely been investigated. In well-studied ecosystems featuring an oxic matrix above an anoxic methane-producing habitat (e.g. landfills or sediments), the fraction of oxidized methane (fox) can reach up to 90% of gross production. However, conventional mass-balance approaches to apportion production and consumption processes can be challenging to apply in the complex-structured and almost inaccessible environment of a termite mound. In effect, all field-based data on termite-mound MOX is based on one study that measured isotopic shifts in produced and emitted methane. In this study a closed-system isotope fractionation model was applied and estimated fox ranged from 10% to almost 100%. However, it is shown here that by applying an open-system isotope-pool model, the measured isotopic shifts can also be explained by physical transport of methane alone. Different field-based methods to quantify MOX in termite mounds are proposed which do not rely on assumptions of physical gas transport. A simple approach is the use of specific inhibitors for MOX, e.g. difluoromethane (CH2F2), combined with chamber-based flux measurements before and after their application. Data is presented on the suitability of different inhibitors and first results of their application in the field. Alternatively, gas-tracer methods allow the quantification of methane oxidation and reaction kinetics without knowledge of physical gas

  9. High temperature solder alloys for underhood applications. Progress report

    Drewien, C.A.; Yost, F.G.; Sackinger, S. [Sandia National Labs., Albuquerque, NM (United States); Kern, J.; Weiser, M.W. [Univ. of New Mexico (United States). Dept. of Mechanical Engineering


    Under a cooperative research and development agreement with General Motors Corporation, lead-free solder systems including the flux, metallization, and solder are being developed for high temperature, underhood applications. Six tin-rich solders, five silver-rich metallizations, and four fluxes were screened using an experimental matrix whereby every combination was used to make sessile drops via hot plate or Heller oven processing. The contact angle, sessile drop appearance, and in some instances the microstructure was evaluated to determine combinations that would yield contact angles of less than 30{degrees}, well-formed sessile drops, and fine, uniform microstructures. Four solders, one metallization, and one flux were selected and will be used for further aging and mechanical property studies.

  10. IODP Expedition 307 Drills Cold-Water Coral Mound Along the Irish Continental Margin

    Trevor Williams


    Full Text Available Introduction Over the past decade, oceanographic and geophysical surveys along the slope of the Porcupine Seabight off the southwestern continental margin of Ireland have identified upwards of a thousand enigmatic mound-like structures (Figs. 1 and 2. The mounds of the Porcupine Seabight rise from the seafl oor in water depths of 600–900 m and formimpressive conical bodies several kilometers wide and up to 200 m high. Although a few mounds such as Thérèse Mound and Galway Mound are covered by a thriving thicket of coldwater corals, most mound tops and fl anks are covered by dead coral rubble or are entirely buried by sediment (De Mol et al., 2002; Fig. 2, Beyer et al., 2003. Lophelia pertusa (Fig.3 and Madrepora oculata are the most prominent cold-water corals growing without photosynthetic symbionts. The widespread discovery of large and numerous coral-bearing banks and the association of these corals with the mounds have generated signifi cant interest as to the composition, origin and development of these mound structures.Challenger Mound, in the Belgica mound province, has an elongated shape oriented along a north-northeast to south-southwest axis and ispartially buried under Pleistocene drift sediments. In high-resolution seismic profiles the mounds appear to root on an erosion surface (van Rooij et al., 2003. During IODP Expedition307 the Challenger Mound in the Porcupine Seabight was drilled with the goal of unveiling the origin and depositional processes withinthese intriguing sedimentary structures. Challenger Mound, unlike its near neighbors the Thérèse and Galway mounds, has little to no livecoral coverage and, therefore, was chosen as the main target for drilling activities, so that no living ecosystem would be disturbed.

  11. Development of gold based solder candidates for flip chip assembly

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri


    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders for inte......Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

  12. Method of defence of solder surface from oxidization

    Kurmashev Sh. D.


    Full Text Available Compositions are developed for defence of fusion solder from oxidization on the basis of mixture of glycerin, urea and powders of refractory oxides, carbides (Al2O3, TiO2, SIC, graphite. The offered compositions can be used for defence of fusion of solder from oxidization in the process of soludering and tinning of explorers, and also electric conclusions of elements of radio electronic apparatus by the method of immersion in stationary baths.

  13. Critical evaluations of lead-free solder alloys and performance comparisons

    Hitch, T.T.; Palit, K.; Prabhu, A.N. [David Sarnoff Research Center, Princeton, NJ (United States)


    This paper discusses the methodology for solder alloy selection, solder preparation processes, test selection, results, and conclusions. The conclusions from this phase of study were that: (1). Solders containing significant amounts of bismuth exhibit poor fatigue life. (2). The Sn-Ag-Cu alloy was the best solder we studied for use as a replacement for Sn-Pb eutectic. A second phase of the work involved detailed study of the Sn-Ag-Cu system with other additions to determine the optimum lead-free solder compositions in terms of melting point, solderability, and mechanical properties.

  14. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Liu Mei Lee; Ahmad Azmin Mohamad


    This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also disc...

  15. Microsurgical anastomosis of sperm duct by laser tissue soldering

    Wehner, Martin M.; Teutu-Kengne, Alain-Fleury; Brkovic, Drasko; Henning, Thomas; Klee, Doris; Poprawe, Reinhart; Jakse, Gerhard


    Connection of small vessels is usually done by suturing which is very cumbersome. Laser tissue soldering can circumvent that obstacle if a handy procedure can be defined. Our principle approach consists of a bioresorbable hollow stent with an expected degradation time of 3 weeks in combination with laser soldering. The stent is to be fed into the vessel to stabilize both ends and should allow percolation immediately after joining. The stents are made of Poly(D,L-lactid-co-glycolid) and solder is prepared from bovine serum albumin (BSA) doped with Indocyanine green (ICG) as chromophore to increase the absorption of laser light. After insertion, solder is applied onto the outer surface of the vessel and coagulated by laser radiation. The wavelength of 810 nm of a diode laser fits favorably to absorption properties of tissue and solder such that heating up of tissue is limited to prevent from necrosis and wound healing complications. In our study the preparation of stents, the consistency and doping of solder, a beam delivery instrument and the irradiation conditions are worked out. In-vitro tests are carried out on sperm ducts of Sprague-Dowlae (SD) rats. Different irradiation conditions are investigated and a micro-optical system consisting of a lens and a reflecting prism to ensure simultaneous irradiation of front and back side of the vessels tested. Under these conditions, the short-term rupture strength of laser anastomosis revealed as high as those achieved by suturing.

  16. Laser Soldering of Rat Skin Using a Controlled Feedback System

    Mohammad Sadegh Nourbakhsh


    Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

  17. Creep properties of Pb-free solder joints

    Song, H.G.; Morris Jr., J.W.; Hua, F.


    Describes the creep behavior of three Sn-rich solders that have become candidates for use in Pb-free solder joints: Sn-3.5Ag, Sn-3Ag-0.5Cu and Sn-0.7Cu. The three solders show the same general behavior when tested in thin joints between Cu and Ni/Au metallized pads at temperatures between 60 and 130 C. Their steady-state creep rates are separated into two regimes with different stress exponents(n). The low-stress exponents range from {approx}3-6, while the high-stress exponents are anomalously high (7-12). Strikingly, the high-stress exponent has a strong temperature dependence near room temperature, increasing significantly as the temperature drops from 95 to 60 C. The anomalous creep behavior of the solders appears to be due to the dominant Sn constituent. Joints of pure Sn have stress exponents, n, that change with stress and temperature almost exactly like those of the Sn-rich solder joints. Research on creep in bulk samples of pure Sn suggests that the anomalous temperature dependence of the stress exponent may show a change in the dominant mechanism of creep. Whatever its source, it has the consequence that conventional constitutive relations for steady-state creep must be used with caution in treating Sn-rich solder joints, and qualification tests that are intended to verify performance should be carefully designed.

  18. Solderability perservative coatings: Electroless tin vs. organic azoles

    Artaki, I.; Ray, U.; Jackson, A.M.; Gordon, H.M. [AT and T Bell Labs., Princeton, NJ (United States); Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)


    This paper compares the solderability performance and corrosions ion protection effectiveness of electroless tin coatings versus organic azole films after exposure to a series of humidity and thermal (lead-free solders) cycling conditions. The solderability of immersion tin is directly related to the tin oxide growth on the surface and is not affected by the formation of Sn-Cu intermetallic phases as long as the intermetallic phase is protected by a Sn layer. For a nominal tin thickness of 60{mu}inches, the typical thermal excursions associated with assembly are not sufficient to cause the intermetallic phase to consume the entire tin layer. Exposure to humidity at moderate to elevated temperatures promotes heavy tin oxide formation which leads to solderability loss. In contrast, thin azole films are more robust to humidity exposure; however upon heating in the presence of oxygen, they decompose and lead to severe solderability degradation. Evaluations of lead-free solder pastes for surface mount assembly applications indicate that immersion tin significantly improves the spreading of Sn:Ag and Sn:Bi alloys as compared to azole surface finishes.

  19. Soldering in prosthodontics--an overview, part I.

    Byrne, Gerard


    The fit of fixed multiunit dental prostheses (FDP), traditionally termed fixed partial dentures (FPDs), is an ongoing problem. Poorly fitting restorations may hasten mechanical failure, due to abutment caries or screw failure. Soldering and welding play an important role in trying to overcome misfit of fixed multiunit prostheses. The term FPD will be used to denote multiunit fixed dental prostheses in this review. This is the first of a series of articles that review the state of the art and science of soldering and welding in relation to the fit of cemented or screw-retained multiunit prostheses. A comprehensive archive of background information and scientific findings is presented. Texts in dental materials and prosthodontics were reviewed. Scientific data were drawn from the numerous laboratory studies up to and including 2009. The background, theory, terminology, and working principles, along with the applied research, are presented. This first article focuses on soldering principles and dimensional accuracy in soldering. There is some discussion and suggestions for future research and development. Soldering may improve dimensional accuracy or reduce the distortion of multiunit fixed prostheses. Many variables can affect the outcome in soldering technique. Research science has developed some helpful guidelines. Research projects are disconnected and limited in scope. © 2011 by The American College of Prosthodontists.

  20. Soldering of Thin Film-Metallized Glass Substrates

    Hosking, F.M.; Hernandez, C.L.; Glass, S.J.


    The ability to produce reliable electrical and structural interconnections between glass and metals by soldering was investigated. Soldering generally requires premetallization of the glass. As a solderable surface finish over soda-lime-silicate glass, two thin films coatings, Cr-Pd-Au and NiCr-Sn, were evaluated. Solder nettability and joint strengths were determined. Test samples were processed with Sn60-Pb40 solder alloy at a reflow temperature of 210 C. Glass-to-cold rolled steel single lap samples yielded an average shear strength of 12 MPa. Solder fill was good. Control of the Au thickness was critical in minimizing the formation of AuSn{sub 4} intermetallic in the joint, with a resulting joint shear strength of 15 MPa. Similar glass-to-glass specimens with the Cr-Pd-Au finish failed at 16.5 MPa. The NiCr-Sn thin film gave even higher shear strengths of 20-22.5 MPa, with failures primarily in the glass.

  1. Lead-free solder technology transfer from ASE Americas



    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

  2. Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders

    Li, Qin; Ma, Ninshu; Lei, YongPing; Lin, Jian; Fu, HanGuang; Gu, Jian


    Development of lead-free solders with low melting temperature is important for substitution of Pb-based solders to reduce direct risks to human health and the environment. In the present work, Sn-Bi-In solders were studied for different ratios of Bi and Sn to obtain solders with low melting temperature. The microstructure, thermal properties, wettability, mechanical properties, and reliability of joints with Cu have been investigated. The results show that the microstructures of the Sn-Bi-In solders were composed of β-Sn, Bi, and InBi phases. The intermetallic compound (IMC) layer was mainly composed of Cu6Sn5, and its thickness increased slightly as the Bi content was increased. The melting temperature of the solders was around 100°C to 104°C. However, when the Sn content exceeded 50 wt.%, the melting range became larger and the wettability became worse. The tensile strength of the solder alloys and solder joints declined with increasing Bi content. Two fracture modes (IMC layer fracture and solder/IMC mixed fracture) were found in solder joints. The fracture mechanism of solder joints was brittle fracture. In addition, cleavage steps on the fracture surface and coarse grains in the fracture structure were comparatively apparent for higher Bi content, resulting in decreased elongation for both solder alloys and solder joints.

  3. Influences of fine pitch solder joint shape parameters on fatigue life under thermal cycle

    HUANG Chun-yue; WU Zhao-hua; HUANG Hong-yan; ZHOU De-jian


    The solder joint reliability of a 0. 5 mm lead pitch, 240-pin quad flat package(QFP) was studied by nonlinear finite element analysis(FEA). The stress/strain distributions within the solder joints and the maximum plastic strain range of the solder joints were determined. Based on the calculated maximum plastic strain range the thermal fatigue life of the solder joints was calculated using Coffin-Manson equation. The influences of shape parameters including volume of solder joint, pad size and stand-off on the thermal fatigue life of the solder joints were also studied. The results show that the stress and strain distribution in the solder joint are not uniform; the interface between the lead and the solder joint is the high stress and strain region; the maximum stress and stain occur at the topmost point where the solder joint intersects with the inner side of the lead. The solder joint cracks should occur firstly at this point and propagate along the interface between the solder and the lead. The solder joint with the pad size of 1.25 mm× 0.35 mm, the stand-off of 0.02 mm and the solder volume of 0. 026 mm3 has longer fatigue life than that of any others. These optimal parameters have been applied in practice to assemble the 240-pin, 0.5 mm pitch QFP.

  4. Solderability of Sn-9Zn-0.5Ag-1In lead-free solder on Cu substrate

    Chang, T.-C. [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Wang, J.-W. [Department of Environmental and Safety Engineering, Chung Hwa College of Medical Technology, 89 Wen-Hwa 1st Street, Jen-Te, Tainan 71703, Taiwan (China); Wang, M.-C. [Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, 415 Chien-Kung Road, Kaohsiung 80782, Taiwan (China)]. E-mail:; Hon, M.-H. [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Da-Yeh University, 112 Shan Jean Road, Da-tsuen, Chang-hua, Taiwan (China)


    The thermal properties, microstructure corrosion and oxidation resistance of the Sn-9Zn-0.5Ag-1In lead-free solder have been investigated by differential scanning calorimetry, X-ray diffractometry, scanning electron microscopy, energy dispersive spectrometry, potentiostat and thermogravimetry. The Sn-9Zn-0.5Ag-1In solder alloy has a near-eutectic composition, it melts at 187.6 deg. C and the heat of fusion is determined as 71.3 J/g. The Sn-9Zn-0.5Ag-1In solder alloy with a corrosion potential of -1.09 V{sub SCE} and a current density of 9.90 x 10{sup -2} A/cm{sup 2}, shows a better corrosion resistance than that of the Sn-9Zn solder alloy. From the thermogravimetry analysis, the weight gain ratio of the Sn-9Zn solder alloy appears a parabolic relationship at 150 deg. C. The initial oxidation behavior of the Sn-9Zn-0.5Ag and Sn-9Zn-0.5Ag-1In solder alloys also shows a parabolic relationship but the weight gain ratio of them appears a negative linear one after aging at 150 deg. C for 2.5 and 5 h, respectively.

  5. Displacement of Monolithic Rubble-Mound Breakwater Crown-Walls

    Nørgaard, Jørgen Harck; Andersen, Lars Vabbersgaard; Andersen, Thomas Lykke


    studies on caisson breakwaters, but correction terms are suggested in the present paper to obtain almost equal measured and estimated displacements. This is of great practical importance since many existing rubble-mound crown-walls are subjected to increasing wave loads due to rising sea water level from......This paper evaluates the validity of a simple one-dimensional dynamic analysis as well as a Finite-Element model to determine the sliding of a rubble-mound breakwater crown-wall. The evaluation is based on a case example with real wave load time-series and displacements measured from two...... of the accumulated sliding distance of crown-wall superstructures, which is in contrast to findings from previous similar studies on caisson breakwaters. The calculated sliding distance is approximately three times larger than the measured one when using the original one-dimensional model suggested in previous...

  6. Design And Construction Of Mounds For Breakwaters And Coastal Protection

    Burcharth, Hans F.; Barends, F.B.J.; Brebner, A.

    Design and construction of mound breakwaters has during the last 5 to 10 years entered a new era. The major reason for that is the realization of problems encountered as it became necessary to erect port structures on more exposed shores and in deeper waters. As a consequence of that the P.......I.A.N.C . (Permanent International Association of Navigation Congresses) established several "Waves Committees" to deal with wave criteria useful for design as well as with the interact.ion between waves and structure s (21). Other institutes or agencies held special wave seminars or breakwater symposia. Progress...... they were exposed to. The following sections discuss the stability of mound breakwaters, reasons for failure and design principles. A number of major failures are mentioned specifically. In each case an attempt has been made to explore and explain the reason for the failure....

  7. Partial Safety Factors for Rubble Mound Breakwaters

    Sørensen, John Dalsgaard; Burcharth, H. F.; Christiani, E.


    On the basis of the failure modes formulated in the various subtasks calibration of partial safety factors are described in this paper. The partial safety factors can be used to design breakwaters under quite different design conditions, namely probabilities of failure from 0.01 to 0.4, design...... lifetimes from 20 to 100 years and different qualities of wave data. A code of practice where safety is taken into account using partial safety factors is called a level I code. The partial safety factors are calibrated using First Order Reliability Methods (FORM, see Madsen et al. [1]) where...... the reliability is measured by reliability indices. For all significant failure modes limit state functions are formulated and uncertain quantities are modelled by stochastic variables. In section 2 the most important failure modes are mentioned and statistical models for the uncertain parameters are described...

  8. Temporal variability in shell mound formation at Albatross Bay, northern Australia.

    Holdaway, Simon J; Fanning, Patricia C; Petchey, Fiona; Allely, Kasey; Shiner, Justin I; Bailey, Geoffrey


    We report the results of 212 radiocarbon determinations from the archaeological excavation of 70 shell mound deposits in the Wathayn region of Albatross Bay, Australia. This is an intensive study of a closely co-located group of mounds within a geographically restricted area in a wider region where many more shell mounds have been reported. Valves from the bivalve Tegillarca granosa (Linnaeus, 1758) were dated. The dates obtained are used to calculate rates of accumulation for the shell mound deposits. These demonstrate highly variable rates of accumulation both within and between mounds. We assess these results in relation to likely mechanisms of shell deposition and show that rates of deposition are affected by time-dependent processes both during the accumulation of shell deposits and during their subsequent deformation. This complicates the interpretation of the rates at which shell mound deposits appear to have accumulated. At Wathayn, there is little temporal or spatial consistency in the rates at which mounds accumulated. Comparisons between the Wathayn results and those obtained from shell deposits elsewhere, both in the wider Albatross Bay region and worldwide, suggest the need for caution when deriving behavioural inferences from shell mound deposition rates, and the need for more comprehensive sampling of individual mounds and groups of mounds.

  9. Developments of Electromigration of Sn-Ag-Cu Lead-free Interconnect Solder Joints%Sn-Ag-Cu无铅钎料互连焊点的电迁移研究进展

    王玲; 刘晓剑; 万超


      电迁移问题作为影响焊点可靠性的关键问题之一,容易导致焊点出现裂纹、丘凸和空洞等焊接缺陷。其失效机制有电流拥挤效应、焦耳热效应、极化效应和金属间化合物失效等。聚焦Sn-Ag-Cu系无铅钎料焊点的电迁移问题,介绍了这一领域电迁移的失效机制、影响因素和防止措施的研究现状,并展望了今后的研究发展趋势。%As one of the key issues affecting the solder joint reliability, electro-migration problems can cause the failure in the form of solder joints crack, mound convex, voids and other defects. The failure mechanisms include current crowding effect, joule heating, polarization effects, and intermetallic compounds, and so on. Focused on the electromigration problems of Sn-Ag-Cu lead-free solder, comprehensively describe the failure modes, influencing factors and preventing measures of this area and outlook of its future research trends.

  10. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    Chen, Haiyan; Peng, Jianke; Fu, Li; Wang, Xincheng; Xie, Yan


    In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  11. Interaction Kinetics between Sn-Pb Solder Droplet and Au/Ni/Cu Pad

    Fuquan LI; Chunqing WANG; Yanhong TIAN


    The interfacial phenomena of the Sn-Pb solder droplet on Au/Ni/Cu pad are investigated. A continuous AuSn2and needle-like AuSn4 are formed at the interface after the liquid state reaction (soldering). The interfacial reaction between the solder and Au layer continues during solid state aging with AuSn4 breaking off from the interface and felling into the solder. The kinetics of Au layer dissolution and diffusion into the solder during soldering and aging is analyzed to elucidate intermetallic formation mechanism at the solder/Au pad interface.The concentration of Au near the solder/pad interface is identified to increase and reach the solubility limit during the period of liquid state reaction. During solid state reaction, the thickening of Au-Sn compound is mainly controlled by element diffusion.

  12. Development of a new Pb-free solder: Sn-Ag-Cu

    Miller, C.M.


    With the ever increasing awareness of the toxicity of Pb, significant pressure has been put on the electronics industry to get the Pb out of solder. This work pertains to the development and characterization of an alloy which is Pb-free, yet retains the proven positive qualities of current Sn-Pb solders while enhancing the shortcomings of Sn-Pb solder. The solder studied is the Sn-4.7Ag-1.7Cu wt% alloy. By utilizing a variety of experimental techniques the alloy was characterized. The alloy has a melting temperature of 217{degrees}C and exhibits eutectic melting behavior. The solder was examined by subjecting to different annealing schedules and examining the microstructural stability. The effect of cooling rate on the microstructure of the solder was also examined. Overall, this solder alloy shows great promise as a viable alternative to Pb-bearing solders and, as such, an application for a patent has been filed.

  13. A critical review of constitutive models for solders in electronic packaging

    Chen, Gang; Zhao, Xiaochen; Wu, Hao


    .... Because the failure of the whole electronic packaging is often induced by the failure of solders, modeling and simulation of solder joint performance are quite important in ensuring the quality...

  14. Microbial leaching of waste solder for recovery of metal.

    Hocheng, H; Hong, T; Jadhav, U


    This study proposes an environment-friendly bioleaching process for recovery of metals from solders. Tin-copper (Sn-Cu), tin-copper-silver (Sn-Cu-Ag), and tin-lead (Sn-Pb) solders were used in the current study. The culture supernatant of Aspergillus niger removed metals faster than the culture supernatant of Acidithiobacillus ferrooxidans. Also, the metal removal by A. niger culture supernatant is faster for Sn-Cu-Ag solder as compared to other solder types. The effect of various process parameters such as shaking speed, temperature, volume of culture supernatant, and increased solder weight on bioleaching of metals was studied. About 99 (±1.75) % metal dissolution was achieved in 60 h, at 200-rpm shaking speed, 30 °C temperature, and by using 100-ml A. niger culture supernatant. An optimum solder weight for bioleaching was found to be 5 g/l. Addition of sodium hydroxide (NaOH) and sodium chloride (NaCl) in the bioleached solution from Sn-Cu-Ag precipitated tin (85 ± 0.35 %) and silver (80 ± 0.08 %), respectively. Passing of hydrogen sulfide (H2S) gas at pH 8.1 selectively precipitated lead (57.18 ± 0.13 %) from the Sn-Pb bioleached solution. The proposed innovative bioleaching process provides an alternative technology for recycling waste solders to conserve resources and protect environment.

  15. Analysis of solderability test methods: predicition model generation for through-hole components

    Woods, Bobby


    peer-reviewed In order to achieve a reduction in solderability related defects on electronic components and Printed Circuit Board???s (PCB???s) in electronics manufacturing, preventive controls such as ???Dip & Look??? and ???Wetting Balance??? solderability testing need to be fully optimised to screen out all poor soldering components and PCB???s. Components and PCB???s that pass these tests should solder correctly in volume production. This thesis initially investigates the variations...

  16. Alternation of microbial mounds and ooid shoals (Middle Jurasssic, Morocco): Response to paleoenvironmental changes

    Tomás, Sara; Homann, Martin; Mutti, Maria; Amour, Frédéric; Christ, Nicolas; Immenhauser, Adrian; Agar, Susan M.; Kabiri, Lahcen


    The occurrence of neritic microbial carbonates is often related to ecological refuges, where grazers and other competitors are reduced by environmental conditions, or to post-extinction events (e.g. in the Late Devonian, Early Triassic). Here, we present evidence for Middle Jurassic (Bajocian) microbial mounds formed in the normal marine, shallow neritic setting of an inner, ramp system from the High Atlas of Morocco. The microbial mounds are embedded in cross-bedded oolitic facies. Individual mounds show low relief domal geometries (up to 3 m high and 4.5 m across), but occasionally a second generation of mounds exhibits tabular geometries (motivation for the present study. Specifically, Bajocian mounds formed on a firmground substratum during transgressive phases under condensed sedimentation. Furthermore, a transient increase in nutrient supply in the prevailing mesotrophic setting, as suggested by the heterotrophic-dominated biota, may have controlled microbial mound stages.

  17. Sediment dynamics and palaeo-environmental context at key stages in the Challenger cold-water coral mound formation: Clues from sediment deposits at the mound base

    Huvenne, Veerle Ann Ida; Van Rooij, David; De Mol, Ben; Thierens, Mieke; O'Donnell, Rory; Foubert, Anneleen


    IODP Expedition 307, targeting the 160 m high Challenger Mound and its surroundings in the Porcupine Seabight, NE Atlantic, was the first occasion of scientific drilling of a cold-water coral carbonate mound. Such mound structures are found at several locations along the continental margin but are especially numerous off Ireland. All rooted on a common unconformity (RD1) and embedded in drift sediments, the mounds in the Porcupine Seabight remain enigmatic structures, and their initial trigger and formation mechanisms are still not entirely clear. This paper discusses the sedimentary environment during the initial stages of Challenger Mound, and at the start-up of the embedding sediment drift. The results are interpreted within the regional palaeo-environmental context. Based on detailed grain-size analyses and planktonic foraminifera assemblage counts, a 14-m interval overlying the regional base-of-mound unconformity RD1 is characterised at IODP Sites U1317 (on mound), U1316 (off mound), and U1318 (background site). Several sedimentary facies are identified and interpreted in relation to regional current dynamics. Using the foraminifera counts, existing age models for the initial stages of on-mound and off-mound sedimentation are refined. Sedimentation within the initial mound was characterised by a two-mode system, with the observed cyclicities related to glacial/interglacial stages. However, the contrast in environmental conditions between the stages was less extreme than observed in the most recent glacial/interglacial cycles, allowing continuous cold-water coral growth. This sustained presence of coral framework was the key factor for fast mound build-up, baffling sediments at periods of slack currents, and protecting them from renewed erosion during high-current events. The off-mound and background sedimentation consisted mainly of a succession of contourite beds, ranging from sandy contourites in the initial stages to muddy contourites higher up in the

  18. Methylene blue solder re-absorption in microvascular anastomoses

    Birch, Jeremy F.; Hepplewhite, J.; Frier, Malcolm; Bell, Peter R. F.


    Soldered vascular anastomoses have been reported using several chromophores but little is known of the optimal conditions for microvascular anastomosis. There are some indications of the optimal protein contents of a solder, and the effects of methylene blue on anastomotic strength. The effects of varying laser power density in vivo have also been described, showing a high rate of thrombosis with laser power over 22.9Wcm-2. However no evidence exists to describe how long the solder remains at the site of the anastomosis. Oz et al reported that the fibrin used in their study had been almost completely removed by 90 days but without objective evidence of solder removal. In order to address the issue of solder re-absorption from the site of an anastomosis we used radio-labelled albumin (I-125) incorporated into methylene blue based solder. This was investigated in both the situation of the patent and thrombosed anastomosis with anastomoses formed at high and low power. Iodine-125 (half life: 60.2 days) was covalently bonded to porcine albumin and mixed with the solder solution. Radio-iodine has been used over many years to determine protein turnover using either I-125 or I-131. Iodine-125 labelled human albumin is regularly used as a radiopharmaceutical tool for the determination of plasma volume. Radio-iodine has the advantages of not affecting protein metabolism and the label is rapidly excreted after metabolic breakdown. Labelling with chromium (Cr-51) causes protein denaturation and is lost from the protein with time. Labelled albumin has been reported in human studies over a 21-day period, with similar results reported by Matthews. Most significantly McFarlane reported a different rate of catabolism of I-131 and I-125 over a 22-day period. The conclusion from this is that the rate of iodine clearance is a good indicator of protein catabolism. In parallel with the surgery a series of blank standards were prepared with a known mass of solder to correct for isotope

  19. Bug Hill: Excavation of a Multicomponent Midden Mound in the Jackfork Valley, Pushmataha County, Southeast Oklahoma.


    settlements. 15 i. MIDDEN MOUND ARCHAEOLOGY AND BUG HILL Throughout this section, there has been one recurrent theme: the inability to "see" within a...processes can be involved. For instance, sites experiencing recurrent seasonal flooding often have alluvial soils forming a main component of the mound...0 1944 Dental abnormalities as found in the American Indian. American Journal of Orthodontics and Oral Surgery 30(9):474-486. 1959 The Belcher Mound

  20. Nutrient dynamics and plant assemblages of Macrotermes falciger mounds in a savanna ecosystem

    Muvengwi, Justice; Ndagurwa, Hilton G. T.; Nyenda, Tatenda; Mbiba, Monicah


    Termites through mound construction and foraging activities contribute significantly to carbon and nutrient fluxes in nutrient-poor savannas. Despite this recognition, studies on the influence of termite mounds on carbon and nitrogen dynamics in sub-tropical savannas are limited. In this regard, we examined soil nutrient concentrations, organic carbon and nitrogen mineralization in incubation experiments in mounds of Macrotermes falciger and surrounding soils of sub-tropical savanna, northeast Zimbabwe. We also addressed whether termite mounds altered the plant community and if effects were similar across functional groups i.e. grasses, forbs or woody plants. Mound soils had significantly higher silt and clay content, pH and concentrations of calcium (Ca), magnesium (Mg), potassium (K), organic carbon (C), ammonium (NH4+) and nitrate (NO3-) than surrounding soils, with marginal differences in phosphorus (P) and sodium (Na) between mounds and matrix soils. Nutrient enrichment increased by a factor ranging from 1.5 for C, 4.9 for Mg up to 10.3 for Ca. Although C mineralization, nitrification and nitrification fraction were similar between mounds and matrix soils, nitrogen mineralization was elevated on mounds relative to surrounding matrix soils. As a result, termite mounds supported unique plant communities rich and abundant in woody species but less diverse in grasses and forbs than the surrounding savanna matrix in response to mound-induced shifts in soil parameters specifically increased clay content, drainage and water availability, nutrient status and base cation (mainly Ca, Mg and Na) concentration. In conclusion, by altering soil properties such as texture, moisture content and nutrient status, termite mounds can alter the structure and composition of sub-tropical savanna plant communities, and these results are consistent with findings in other savanna systems suggesting that increase in soil clay content, nutrient status and associated changes in the plant

  1. Imported fire ant (Hymenoptera: Formicidae) mound shape characteristics along a north-south gradient.

    Vogt, James T; Wallet, Bradley; Freeland, Thomas B


    The nests of some mound-building ants are thought to serve an important function as passive solar collectors. To test this hypothesis, imported fire ant (Solenopsis invicta Buren, S. richteri Forel, and their hybrid) mound shape characteristics (south facing slope angle and area, mound height, and basal elongation in the plane of the ground) were quantified in 2005 and 2006 at a number of locations from approximately 30 degrees 25' N (Long Beach, MS) to 35 degrees 3' N (Fayetteville, TN). Insolation (w*h/m2), maximum sun angle (sun elevation in degrees above the horizon at noon, dependent on date and latitude), cumulative rainfall (7 and 30 d before sampling), and mean ambient temperature (7 d before sampling) for each site x date combination were used as predictive variables to explain mound shape characteristics. Steepness of south-facing mound slopes was negatively associated with maximum sun angle at higher temperatures, with predicted values falling from approximately 36 degrees at sun angle=40 degrees to 26 degrees at sun angle=70 degrees; at lower temperatures, slope remained relatively constant at 28 degrees. On average, mound height was negatively correlated with maximum sun angle. Rainfall had a net negative effect on mound height, but mound height increased slightly with maximum sun angle when rainfall was high. Mound elongation generally increased with increased mound building activity. Under favorable temperature conditions and average rainfall, imported fire ant mounds were tallest, most eccentric, and had the steepest south facing slopes during periods of low maximum sun angle. Mound shape characteristics are discussed with regard to season and their potential usefulness for remote sensing efforts.

  2. Reliability of lead-free solders in electronic packaging technology

    Choi, Woojin

    The electromigration of flip chip solder bump (eutetic SnPb) has been studied at temperatures of 100, 125 and 150°C and current densities of 1.9 to 2.75 x 104 A/cm2. The under-bump-metallization on the chip side is thin film Al/Ni(V)/Cu and on the board side is thick Cu. By simulation, we found that current crowding occurs at the corner on the chip side where the electrons enter the solder ball. We are able to match this simulation to the real electromigration damage in the sample. The experimental result showed that voids initiated from the position of current crowding and propagated across the interface between UBM and the solder ball. The Cu-Sn intermetallic compounds formed during the reflow is known to adhere well to the thin film UBM, but they detached from the UBM after current stressing. Therefore, the UBM itself becomes part of the reliability problem of the flip chip solder joint under electromigration. Currently there is a renewed interest in Sn whisker growth owing to the introduction of Pb-free solder in electronic manufacturing. The leadframe is electroplated or finished with a layer of Pb-free solder. The solder is typically pure Sn or eutectic SnCu (0.7 atomic % Cu). It is a serious reliability concern in the use of the eutectic SnCu solder as leadframe surface finish due to the growth of long whiskers on it. The origin of the driving force of compressive stress can be mechanical, thermal, and chemical. Among them, the chemical force is the most important contribution to the whisker growth and its origin is due to the reaction between Sn and Cu to form intermetallic compound (IMC) at room temperature. For whisker or hillock growth, the surface cannot be free of oxide and it must be covered with oxide and the oxide must be a protective one so that it removes effectively all the vacancy sources and sinks on the surface. Hence, only those metals, which grow protective oxides such as Al and Sn, are known to have hillock growth or whisker growth. We

  3. A Corrosion Investigation of Solder Candidates for High-Temperature Applications

    Chidambaram, Vivek; Hald, John; Ambat, Rajan;


    The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work, co...

  4. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.


    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  5. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.


    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  6. Photonic flash soldering of thin chips and SMD components on foils for flexible electronics

    Ende, D.A. van den; Hendriks, R.; Cauchois, R.; Kusters, R.H.L.; Cauwe, M.; Groen, W.A.; Brand, J. van den


    Ultrathin bare die chips and small-size surface mount device components were successfully soldered using a novel roll-to-roll compatible soldering technology. A high-power xenon light flash was used to successfully solder the components to copper tracks on polyimide (PI) and polyethylene terephthala

  7. Investigation Of Intermetallic Compounds In Sn-Cu-Ni Lead-Free Solders

    Nagy E.


    Full Text Available Interfacial intermetallic compounds (IMC play an important role in Sn-Cu lead-free soldering. The size and morphology of the intermetallic compounds formed between the lead-free solder and the Cu substrate have a significant effect on the mechanical strength of the solder joint.

  8. Experimental Methods in Reduced-gravity Soldering Research

    Pettegrew, Richard D.; Struk, Peter M.; Watson, John K.; Haylett, Daniel R.


    The National Center for Microgravity Research, NASA Glenn Research Center, and NASA Johnson Space Center are conducting an experimental program to explore the influence of reduced gravity environments on the soldering process. An improved understanding of the effects of the acceleration environment is important to application of soldering during current and future human space missions. Solder joint characteristics that are being considered include solder fillet geometry, porosity, and microstructural features. Both through-hole and surface mounted devices are being investigated. This paper focuses on the experimental methodology employed in this project and the results of macroscopic sample examination. The specific soldering process, sample configurations, materials, and equipment were selected to be consistent with those currently on-orbit. Other apparatus was incorporated to meet requirements imposed by operation onboard NASA's KC-135 research aircraft and instrumentation was provided to monitor both the atmospheric and acceleration environments. The contingent of test operators was selected to include both highly skilled technicians and less skilled individuals to provide a population cross-section that would be representative of the skill mix that might be encountered in space mission crews.

  9. Low-temperature solder for laser tissue welding

    Lauto, Antonio; Stewart, Robert B.; Felsen, D.; Foster, John; Poole-Warren, Laura; Poppas, Dix P.


    In this study, a two layer (TL) solid solder was developed with a fixed thickness to minimize the difference in temperature across the solder (ΔT) and to weld at low temperature. Solder strips comprising two layers (65% albumin, 35% water) were welded onto rectangular sections of dog small intestine by a diode laser (λ = 808 nm). The laser delivered a power of 170 +/- 10 mW through an optical fiber (spot size approximately 1 mm) for 100 seconds. A solder layer incorporated also a dye (carbon black, 0.25%) to absorb the laser radiation. A thermocouple and an infrared thermometer system recorded the temperatures at the tissue interface and at the external solder surface, during welding. The repaired tissue was tested for tensile strength by a calibrated tensiometer. The TL strips were able to minimize ΔT (12 +/- 4°C) and control the temperature at tissue-interface. The strips fused on tissue at 55=70°C for tissue repair, which cause more irreversible thermal damage.


    Sandra Santana Lima


    Full Text Available Epigeous termite mounds are frequently observed in pasture areas, but the processes regulating their population dynamics are poorly known. This study evaluated epigeous termite mounds in cultivated grasslands used as pastures, assessing their spatial distribution by means of geostatistics and evaluating their vitality. The study was conducted in the Cerrado biome in the municipality of Rio Brilhante, Mato Grosso do Sul, Brazil. In two pasture areas (Pasture 1 and Pasture 2, epigeous mounds (nests were georeferenced and analyzed for height, circumference and vitality (inhabited or not. The area occupied by the mounds was calculated and termite specimens were collected for taxonomic identification. The spatial distribution pattern of the mounds was analyzed with geostatistical procedures. In both pasture areas, all epigeous mounds were built by the same species, Cornitermes cumulans. The mean number of mounds per hectare was 68 in Pasture 1 and 127 in Pasture 2, representing 0.4 and 1 % of the entire area, respectively. A large majority of the mounds were active (vitality, 91 % in Pasture 1 and 84 % in Pasture 2. A “pure nugget effect” was observed in the semivariograms of height and nest circumference in both pastures reflecting randomized spatial distribution and confirming that the distribution of termite mounds in pastures had a non-standard distribution.

  11. Creep characterization of solder bumps using nanoindentation

    Du, Yingjie; Liu, Xiao Hu; Fu, Boshen; Shaw, Thomas M.; Lu, Minhua; Wassick, Thomas A.; Bonilla, Griselda; Lu, Hongbing


    Current nanoindentation techniques for the measurement of creep properties are applicable to viscoplastic materials with negligible elastic deformations. A new technique for characterization of creep behavior is needed for situations where the elastic deformation plays a significant role. In this paper, the effect of elastic deformation on the determination of creep parameters using nanoindentation with a self-similar nanoindenter tip is evaluated using finite element analysis (FEA). It is found that the creep exponent measured from nanoindentation without taking into account of the contribution of elastic deformation tends to be higher than the actual value. An effective correction method is developed to consider the elastic deformation in the calculation of creep parameters. FEA shows that this method provides accurate creep exponent. The creep parameters, namely the creep exponent and activation energy, were measured for three types of reflowed solder bumps using the nanoindentation method. The measured parameters were verified using FEA. The results show that the new correction approach allows extraction of creep parameters with precision from nanoindentation data.

  12. Organic matter remains in the Kess Kess mounds of the Hamar Laghadad (Anti Atlas, Morocco): record of microbial biomineralization

    Demasi, Fabio; Barbieri, Roberto; Guido, Adriano; Mastandrea, Adelaide; Cavalazzi, Barbara; Russo, Franco


    Carbonate Mud Mounds are well documented in the geological record, and span from Proterozoic to recent times, in shallow- and deep-water settings. They are a significant expression of the history of Earth's microbial life. The origin of carbonate mud-mounds has long been debated and the discovery of seep- and vent-related ecosystems from different geotectonic settings, associated to authigenic carbonate mounds, allowed the re-interpretation of some mounds as the product of chemosynthetic microbial mediation. We analyzed the carbonate mounds, informally called 'Kess-Kess', cropping out in the Hamar Laghdad Ridge, eastern Anti-Atlas, SE Morocco. These mounds are the most spectacularly exposed carbonate buildups of the world and, due to differential erosion, they show their original shapes and the relationships with associated strata. The origin of these buildups is still under debate and the most consistent hypotheses are related to submarine hydrothermal vents or hydrocarbon seapage in which bacteria and/or archaea plaied a prominent role in the carbonate biomineralization. To investigate the possible remains of prokaryote metabolic activity we studied the micrite precipitation processes through microfacies and biogeochemical analyses. The more indicative micrite texture is stromatolitic with very fine wrinkled lamination organized in antigravitative pattern. High resolution SEM observations suggest the presence of widespread trace of organic phantoms. The geochemical characterization of extracted organic matter was performed through the functional group analyses by FT-IR spectroscopy. The infrared spectra showed bands between 600 and 3000 cm-1. They contain stretching aliphatic bands (νCHali) at 2950, 2925 and 2850 cm-1, and deformation bands of methyl (δCH3; 1365 cm-1) and both methyl and methylene [δ(CH2 + CH3); 1458 cm-1] groups. The spectra also display the band assigned to carbonyl and/or carboxyl groups (νC=O; 1740 cm-1). The νC-O vibration appears

  13. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    Zhang, Xuan


    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  14. Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

    Abdul Aziz, M. S.; Abdullah, M. Z.; Khor, C. Y.


    An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin through-hole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183°C) analysis. In addition, an experiment was conducted to measure the temperature difference (ΔT) between the top and the bottom of the pin. Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress. Filling time exhibited a quadratic relationship to the increment of temperature. The deformation of pin showed a linear correlation to the temperature. The ΔT obtained from the simulation and the experimental method were validated. This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry. PMID:25225638

  15. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Vianco, P.T.


    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  16. Horizon Shells and BMS-like Soldering Transformations

    Blau, Matthias


    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like ...

  17. Development of alternatives to lead-bearing solders

    Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)


    Soldering technology, using tin-lead alloys has had a significant role in the packaging of highly functional, low cost electronic devices. The elimination of lead from all manufactured products, whether through legislation or tax incentives, will impact the electronics community which uses lead-containing solders. In response to these proposed measures, the National Center for Manufacturing Sciences has established a multi-year program involving participants from industry, academia, and the national laboratories with the objective to identify potential replacements for lead-bearing solders. Selection of candidate alloys is based upon the analysis of materials properties, manufacturability, modeling codes for reliability prediction, as well as toxicological properties and resource availability, data developed in the program.

  18. Bosonisation and Duality Symmetry in the Soldering Formalism

    Banerjee, R


    We develop a technique that solders the dual aspects of some symmetry. Using this technique it is possible to combine two theories with such symmetries to yield a new effective theory. Some applications in two and three dimensional bosonisation are discussed. In particular, it is shown that two apparently independent three dimensional massive Thirring models with same coupling but opposite mass signatures, in the long wavelegth limit, combine by the process of bosonisation and soldering to yield an effective massive Maxwell theory. Similar features also hold for quantum electrodynamics in three dimensions. We also provide a systematic derivation of duality symmetric actions and show that the soldering mechanism leads to a master action which is duality invariant under a bigger set of symmetries than is usually envisaged. The concept of duality swapping is introduced and its implications are analysed. The example of electromagnetic duality is discussed in details.

  19. Corrosion Issues in Solder Joint Design and Service



    Corrosion is an important consideration in the design of a solder joint. It must be addressed with respect to the service environment or, as in the case of soldered conduit, as the nature of the medium being transported within piping or tubing. Galvanic-assisted corrosion is of particular concern, given the fact that solder joints are comprised of different metals or alloy compositions that are in contact with one-another. The (thermodynamic) potential for corrosion to take place in a particular environment requires the availability of the galvanic series for those conditions and which includes the metals or alloys in question. However, the corrosion kinetics, which actually determine the rate of material loss under the specified service conditions, are only available through laboratory evaluations or field data that are found in the existing literature or must be obtained by in-house testing.

  20. Materials chemistry. Composition-matched molecular "solders" for semiconductors.

    Dolzhnikov, Dmitriy S; Zhang, Hao; Jang, Jaeyoung; Son, Jae Sung; Panthani, Matthew G; Shibata, Tomohiro; Chattopadhyay, Soma; Talapin, Dmitri V


    We propose a general strategy to synthesize largely unexplored soluble chalcogenidometallates of cadmium, lead, and bismuth. These compounds can be used as "solders" for semiconductors widely used in photovoltaics and thermoelectrics. The addition of solder helped to bond crystal surfaces and link nano- or mesoscale particles together. For example, CdSe nanocrystals with Na2Cd2Se3 solder was used as a soluble precursor for CdSe films with electron mobilities exceeding 300 square centimeters per volt-second. CdTe, PbTe, and Bi2Te3 powders were molded into various shapes in the presence of a small additive of composition-matched chalcogenidometallate or chalcogel, thus opening new design spaces for semiconductor technologies.

  1. Process characterization and control of hand-soldered printed wiring assemblies

    Cheray, D.L.; Mandl, R.G.


    A designed experiment was conducted to characterize the hand soldering process parameters for manufacturing printed wiring assemblies (PWAs). Component tinning was identified as the most important parameter in hand soldering. After tinning, the soldering iron tip temperature of 700{degrees}F and the choice of operators influence solder joint quality more than any other parameters. Cleaning and flux/flux core have little impact on the quality of the solder joint. The need for component cleaning prior to assembly must be evaluated for each component.

  2. The impact of process parameters on gold elimination from soldered connector assemblies



    Minimizing the likelihood of solder joint embrittlement in connectors is realized by reducing or eliminating retained Au plating and/or Au-Sn intermetallic compound formation from the assemblies. Gold removal is performed most effectively by using a double wicking process. When only a single wicking procedure can be used, a higher soldering temperature improves the process of Au removal from the connector surfaces and to a nominal extent, removal of Au-contaminated solder from the joint. A longer soldering time did not appear to offer any appreciable improvement toward removing the Au-contaminated solder from the joint. Because the wicking procedure was a manual process, it was operator dependent.

  3. Plant Mounds as Concentration and Stabilization Agents for Actinide Soil Contaminants in Nevada

    D.S. Shafer; J. Gommes


    Plant mounds or blow-sand mounds are accumulations of soil particles and plant debris around the base of shrubs and are common features in deserts in the southwestern United States. An important factor in their formation is that shrubs create surface roughness that causes wind-suspended particles to be deposited and resist further suspension. Shrub mounds occur in some plant communities on the Nevada Test Site, the Nevada Test and Training Range (NTTR), and Tonopah Test Range (TTR), including areas of surface soil contamination from past nuclear testing. In the 1970s as part of early studies to understand properties of actinides in the environment, the Nevada Applied Ecology Group (NAEG) examined the accumulation of isotopes of Pu, 241Am, and U in plant mounds at safety experiment and storage-transportation test sites of nuclear devices. Although aerial concentrations of these contaminants were highest in the intershrub or desert pavement areas, the concentration in mounds were higher than in equal volumes of intershrub or desert pavement soil. The NAEG studies found the ratio of contaminant concentration of actinides in soil to be greater (1.6 to 2.0) in shrub mounds than in the surrounding areas of desert pavement. At Project 57 on the NTTR, 17 percent of the area was covered in mounds while at Clean Slate III on the TTR, 32 percent of the area was covered in mounds. If equivalent volumes of contaminated soil were compared between mounds and desert pavement areas at these sites, then the former might contain as much as 34 and 62 percent of the contaminant inventory, respectively. Not accounting for radionuclides associated with shrub mounds would cause the inventory of contaminants and potential exposure to be underestimated. In addition, preservation of shrub mounds could be important part of long-term stewardship if these sites are closed by fencing and posting with administrative controls.

  4. Morphology and spatial patterns of Macrotermes mounds in the SE Katanga, D.R. Congo

    Bazirake Mujinya, Basile; Mees, Florias; Erens, Hans; Baert, Geert; Van Ranst, Eric


    The spatial distribution patterns and morphological characteristics of Macrotermes falciger mounds were investigated in the Lubumbashi area, D.R. Congo. Examination of the spatial patterns of M. falciger mounds on high resolution satellite images reveals a mean areal number density of 2.9 ± 0.4 mounds ha-1. The high relative number of inactive mounds in the region, along with their regular distribution pattern, suggests that current termite mound occurrences are largely palaeostructures. Mound positions in the habitat are consistent with intraspecific competition rather than soil and substrate characteristics as controlling factor. Detailed morphological description of five deep termite-mound profiles (~7 m height/depth) shows that carbonate pedofeatures are present in all studied profiles, in contrast to the control soils. They mainly occur in the form of soft powdery masses, nodules and coatings on ped faces, all clearly pedogenic. Carbonate coatings occur mainly between 1 m above the soil surface and 1 m below that level in all mound profiles. Carbonate nodules do show a different distribution pattern at each site. Furthermore, when the studied profiles are considered to represent a toposequence, the stone layer occurs at greater depth in topographically low areas compared to crest and slope positions, which is mainly conditioned by erosion. The clay content of epigeal mounds increases from the summit to the toe slope, which can be largely related to differences in parent material. The Mn-Fe oxide concentrations occurring in all studied termite mound profiles reflect a seasonally high perched water table beneath the mound, which is more pronounced at the lower slope positions.

  5. Famennian mud-mounds in the proximal fore-reef slope, Canning Basin, Western Australia

    Webb, Gregory E.


    Famennian (Late Devonian) carbonate buildups and, in particular, mud-mounds, are poorly known, in general, and few have been documented in detail. Relatively small Famennian mud-mounds occur in proximal fore-reef slope settings in the Canning Basin, Western Australia. The Famennian platform margin facies passes from typical shoaling carbonate facies in the back reef, through massive, calcimicrobial, cement-rich reef-margin facies, to relatively steeply dipping (20-30°), well-bedded fore-reef slope facies containing shelf-derived, winnowed grainy sediments and extremely coarse reef-block debris. Isolated or coalescing mounds occur in the proximal slope, immediately adjacent to and, in some cases, possibly grading into the margin facies. Mounds are elongate perpendicular to the margin and some had synoptic relief greater than 2 m. Mounds are lithologically variable and consist of varying proportions of micrite, multiple generations of marine cement, abundant Rothpletzella, Renalcis, poorly preserved sparry microbial crusts and sporadically distributed laminar stromatoporoids. Surrounding grainy slope facies abut and slope off of mound flanks. Mound facies are very similar to nearby reef-margin facies, with the exceptions that stromatoporoids have not been observed in margin facies and solenoporoid algae, which occur in the margin, have not been observed in the mounds. Stromatolites are conspicuously absent from both facies. Mound facies appear to be more closely related to Frasnian and Famennian calcimicrobe cement-dominated reef-margin facies than to Famennian deep-water stromatolite-sponge-mound facies, such as those that occur elsewhere in the Canning Basin. The observed Canning Famennian reef and mound frameworks were constructed by communities that appear to be very similar to earlier Frasnian communities, despite the Frasnian-Famennian extinction event, and provide good examples of microbial reef framework construction in a high energy setting.

  6. Characteristics and origin of Earth-mounds on the Eastern Snake River Plain, Idaho

    Tullis, J.A.


    Earth-mounds are common features on the Eastern Snake River Plain, Idaho. The mounds are typically round or oval in plan view, <0.5 m in height, and from 8 to 14 m in diameter. They are found on flat and sloped surfaces, and appear less frequently in lowland areas. The mounds have formed on deposits of multiple sedimentary environments. Those studied included alluvial gravel terraces along the Big Lost River (late Pleistocene/early Holocene age), alluvial fan segments on the flanks of the Lost River Range (Bull Lake and Pinedale age equivalents), and loess/slopewash sediments overlying basalt flows. Backhoe trenches were dug to allow characterization of stratigraphy and soil development. Each mound has features unique to the depositional and pedogenic history of the site; however, there are common elements to all mounds that are linked to the history of mound formation. Each mound has a {open_quotes}floor{close_quotes} of a sediment or basement rock of significantly different hydraulic conductivity than the overlying sediment. These paleosurfaces are overlain by finer-grained sediments, typically loess or flood-overbank deposits. Mounds formed in environments where a sufficient thickness of fine-grained sediment held pore water in a system open to the migration to a freezing front. Heaving of the sediment occurred by the growth of ice lenses. Mound formation occurred at the end of the Late Pleistocene or early in the Holocene, and was followed by pedogenesis. Soils in the mounds were subsequently altered by bioturbation, buried by eolian deposition, and eroded by slopewash runoff. These secondary processes played a significant role in maintaining or increasing the mound/intermound relief.

  7. A new active solder for joining electronic components



    Electronic components and micro-sensors utilize ceramic substrates, copper and aluminum interconnect and silicon. The joining of these combinations require pre-metallization such that solders with fluxes can wet such combinations of metals and ceramics. The paper will present a new solder alloy that can bond metals, ceramics and composites. The alloy directly wets and bonds in air without the use flux or premetallized layers. The paper will present typical processing steps and joint microstructures in copper, aluminum, aluminum oxide, aluminum nitride, and silicon joints.

  8. Lead Free Solder Joint Thermal Condition in Semiconductor Packaging

    M. N. Harif


    Full Text Available Problem statement: Solder joints are responsible for both electrical and mechanical connections. Solder does not have adequate ductility to ensure the repeated relative displacements due to the mismatch between expansion coefficients of the chip carrier and the circuit board. Solder material plays a crucial role to provide the necessary electrical and mechanical interconnections in an electronic assembly. Finding a technique to increase the service life of future connections is not the total solution. A method must be developed for predicting the remaining service life of many joints already in use. Approach: The effect of High Temperature Storage (HTS on lead free solder joint material for ball grid array application using pull test method is studied in this study. Some statistical analysis base on the pull test data also discussed. Three samples of different lead free solder joint material were selected in this experiment namely Sn3.8Ag0.7Cu (SAC387, Sn2.3Ag0.08Ni0.01Co (SANC and Sn3.5Ag. After the thermal condition test, all the lead free solder joint material samples were tested using Dage 4000 pull test machine. Each pull test will be 5 units and each unit contains 8 balls. Results: The mean pull strength for high temperature storage is 2847.66, 2628.20 and 2613.79 g for Sn3.5Ag, SANC and SAC387, respectively. Thus, Sn3.5Ag shows a significantly better solder joint performance in terms of joint strength compare to SANC and SAC387. Hence, Intermetallic Compound (IMC thicknesses were measured after cross-sectioning. Sample size for cross-sectioning was 3 units per read point, 2 balls per unit and 3 maximum IMC peaks per ball and the measurement using high power scope of 100x and Image Analyzer software to measure the IMC thickness. For high temperature storage, result show that the mean IMC thicknesses for SAC387, SANC and Sn3.5Ag are 3.9139, 2.3111 and 2.3931 µm. Conclusion/Recommendations: It was found that IMC thickness for SANC and Sn3

  9. Call Forecasting for Inbound Call Center

    Peter Vinje


    Full Text Available In a scenario of inbound call center customer service, the ability to forecast calls is a key element and advantage. By forecasting the correct number of calls a company can predict staffing needs, meet service level requirements, improve customer satisfaction, and benefit from many other optimizations. This project will show how elementary statistics can be used to predict calls for a specific company, forecast the rate at which calls are increasing/decreasing, and determine if the calls may stop at some point.

  10. Sedimentation patterns on a cold-water coral mound off Mauritania

    Eisele, M.; Frank, N.; Wienberg, C.; Titschack, J.; Mienis, F; Beuck, L.; Tisnerat-Laborde, N.; Hebbeln, D.


    An unconformity-bound glacial sequence (135 cm thick) of a coral-bearing sediment core collected from the flank of a cold-water coral mound in the Banda Mound Province off Mauritania was analysed. In order to study the relation between coral framework growth and its filling by hemipelagic sediments,

  11. Plants in Your Ants: Using Ant Mounds to Test Basic Ecological Principles

    Zettler, Jennifer A.; Collier, Alexander; Leidersdorf, Bil; Sanou, Missa Patrick


    Urban students often have limited access to field sites for ecological studies. Ubiquitous ants and their mounds can be used to study and test ecology-based questions. We describe how soil collected from ant mounds can be used to investigate how biotic factors (ants) can affect abiotic factors in the soil that can, in turn, influence plant growth.

  12. Reservoir Potential of Silurian Carbonate Mud Mounds in the Southern Sichuan Basin, Central China

    ZHAO Wenzhi; YANG Xiaoping; Steve KERSHAW; ZHANG Baomin


    Lower Silurian mud mounds of the Shinuilan Formation, located in the southern Sichuan Basin, China, have developed in open shelf settings in deeper water than shallow-water reef-bearing limestones that occur in the region. An integration of the outcrop, drill data and seismic profiles show that contemporaneous faults have controlled the boundary and distribution of the sedimentary facies of Lower Silurian rocks in the southern Sichuan Basin. Mounds appear to have developed in the topographic lows formed by synsedimentary faulting, on the shelf of the Yangtze Platform. Average mound thickness is 20 m, maximum 35 m. Mounds are composed mainly of micrite, possibly microbially bound, and are overlain by shales. Mound tops are preferentially dolomitized, with the Mg2+ source probably from the clay content of the mound-top carbonate. Microfacies analysis and reconstruction of the diagenetic history reveal that the mound tops have higher porosity, and are gas targets; in contrast, mound cores and limbs show pores filled by three generations of calcite cement, and therefore have a low gas potential.

  13. Plants in Your Ants: Using Ant Mounds to Test Basic Ecological Principles

    Zettler, Jennifer A.; Collier, Alexander; Leidersdorf, Bil; Sanou, Missa Patrick


    Urban students often have limited access to field sites for ecological studies. Ubiquitous ants and their mounds can be used to study and test ecology-based questions. We describe how soil collected from ant mounds can be used to investigate how biotic factors (ants) can affect abiotic factors in the soil that can, in turn, influence plant growth.

  14. Formation and Control of Self-Sealing High Permeability Groundwater Mounds in Impermeable Sediment: Implications for SUDS and Sustainable Pressure Mound Management

    David D. J. Antia


    Full Text Available A groundwater mound (or pressure mound is defined as a volume of fluid dominated by viscous flow contained within a sediment volume where the dominant fluid flow is by Knudsen Diffusion. High permeability self-sealing groundwater mounds can be created as part of a sustainable urban drainage scheme (SUDS using infiltration devices. This study considers how they form, and models their expansion and growth as a function of infiltration device recharge. The mounds grow through lateral macropore propagation within a Dupuit envelope. Excess pressure relief is through propagating vertical surge shafts. These surge shafts can, when they intersect the ground surface result, in high volume overland flow. The study considers that the creation of self-sealing groundwater mounds in matrix supported (clayey sediments (intrinsic permeability = 10–8 to 10–30 m3 m–2 s–1 Pa–1 is a low cost, sustainable method which can be used to dispose of large volumes of storm runoff (<20→2,000 m3/24 hr storm/infiltration device and raise groundwater levels. However, the inappropriate location of pressure mounds can result in repeated seepage and ephemeral spring formation associated with substantial volumes of uncontrolled overland flow. The flow rate and flood volume associated with each overland flow event may be substantially larger than the associated recharge to the pressure mound. In some instances, the volume discharged as overland flow in a few hours may exceed the total storm water recharge to the groundwater mound over the previous three weeks. Macropore modeling is used within the context of a pressure mound poro-elastic fluid expulsion model in order to analyze this phenomena and determine (i how this phenomena can be used to extract large volumes of stored filtered storm water (at high flow rates from within a self-sealing high permeability pressure mound and (ii how self-sealing pressure mounds (created using storm water infiltration can be used to

  15. Studies on in situ particulate reinforced tin-silver composite solders relevant to thermomechanical fatigue issues

    Choi, Sunglak


    Global pressure based on environmental and health concerns regarding the use of Pb-bearing solder has forced the electronics industry to develop Pb-free alternative solders. Eutectic Sn-Ag solder has received much attention as a potential Pb-free candidate to replace Sn-Pb solder. Since introduction of surface mount technology, packaging density increased and the electronic devices became smaller. As a result, solders in electronic modules are forced to function as a mechanical connection as well as electrical contact. Solders are also exposed to very harsh service conditions such as automotive under-the-hood and aerospace applications. Solder joints experience thermomechanical fatigue, i.e. interaction of fatigue and creep, during thermal cycling due to temperature fluctuation in service conditions. Microstructural study on thermomechanical fatigue of the actual eutectic Sn-Ag and Sn-4Ag-0.5Cu solder joints was performed to better understand deformation and damage accumulation occurring during service. Incorporation of reinforcements has been pursued to improve the mechanical and particularly thermomechanical behavior of solders, and their service temperature capability. In-situ Sn-Ag composite solders were developed by incorporating Cu 6Sn5, Ni3Sn4, and FeSn2 particulate reinforcements in the eutectic Sn-Ag solder in an effort to enhance thermomechanical fatigue resistance. In-situ composite solders were investigated on the growth of interfacial intermetallic layer between solder and Cu substrate growth and creep properties. Solder joints exhibited significant deformation and damage on free surface and interior regions during thermomechanical fatigue. Cracks initiated on the free surface of the solder joints and propagated toward interior regions near the substrate of the solder joint. Crack grew along Sn grain boundaries by grain boundary sliding. There was significant residual stress within the solder joint causing more damage. Presence of small amount of Cu

  16. On the influence of cold-water coral mound size on flow hydrodynamics, and vice versa

    Cyr, Frédéric; Haren, Hans; Mienis, Furu; Duineveld, Gerard; Bourgault, Daniel


    Using a combination of in situ observations and idealistic 2-D nonhydrostatic numerical simulations, the relation between cold-water coral (CWC) mound size and hydrodynamics is explored for the Rockall Bank area in the North Atlantic Ocean. It is shown that currents generated by topographically trapped tidal waves in this area cause large isopycnal depressions resulting from an internal hydraulic control above CWC mounds. The oxygen concentration distribution is used as a tracer to visualize the flow behavior and the turbulent mixing above the mounds. By comparing two CWC mounds of different sizes and located close to each other, it is shown that the resulting mixing is highly dependent on the size of the mound. The effects of the hydraulic control for mixing, nutrient availability, and ecosystem functioning are also discussed.

  17. High-temperature lead-free solder alternatives

    Nachiappan, Vivek Chidambaram; Hattel, Jesper Henri; Hald, John


    For lead-free solders in the high-temperature regime, unfortunately, a limited number of alloying systems are available. These are Bi based alloys, gold involving alloys and Zn–Al based alloys. Based on these systems, possible candidate alloys were designed to have a melting range between 270°C a...

  18. Thermomechanical fatigue damage evolution in SAC solder joints

    Matin, M. A.; Vellinga, W. P.; D Geers, M. G.


    Thermornechanical fatigue in lab-type Sn-Ag-Cu solder interconnections between two copper plates has been investigated under cyclic thermal loading within a number of temperature ranges. Fatigue mechanisms have been studied using optical and scanning electron microscopy. Among the various fatigue me

  19. Porosity in collapsible Ball Grid Array solder joints

    Gonzalez, C.A. [Univ. of California, Berkeley, CA (United States). Dept. of Materials Science and Mineral Engineering]|[Lawrence Berkeley National Lab., Berkeley, CA (United States). Materials Science Div.


    Ball Grid Array (BGA) technology has taken off in recent years due to the increased need for high interconnect density. Opposite to all the advantages BGA packages offer, porosity in collapsible BGA solder joints is often a major concern in the reliability of such packages. The effect of pores on the strength of collapsible BGA solder-joints was studied by manufacturing samples with different degrees of porosity and testing them under a shear load. It was found that the shear strength of the solder joints decreased in a linear fashion with increasing porosity. Failure occurred by internal necking of the interpore matrix. It was confirmed that entrapment of flux residues leads to porosity by manufacturing fluxless samples in a specially made furnace, and comparing them with samples assembled using flux. Also, contamination of Au electrodeposits (in substrate metallization) was determined to cause significant porosity. It was found that hard-Au (Co hardened Au) electrodeposits produce high degrees of porosity even in the absence of flux. Finally, increasing the time the solder spends in the molten state was proven to successfully decrease porosity.

  20. Fundamentals of wetting and spreading with emphasis on soldering

    Yost, F.G.


    Soldering is often referred to as a mature technology whose fundamentals were established long ago. Yet a multitude of soldering problems persist, not the least of which are related to the wetting and spreading of solder. The Buff-Goodrich approach to thermodynamics of capillarity is utilized in a review of basic wetting principles. These thermodynamics allow a very compact formulation of capillary phenomena which is used to calculate various meniscus shapes and wetting forces. These shapes and forces lend themselves to experimental techniques, such as the sessile drop and the Wilhelmy plate, for measuring useful surface and interfacial energies. The familiar equations of Young, Wilhelmy, and Neumann are all derived with this approach. The force-energy duality of surface energy is discussed and the force method is developed and used to derive the Herring relations for anisotropic surfaces. The importance of contact angle hysteresis which results from surface roughness and chemical inhomogeneity is presented and Young's equation is modified to reflect these ever present effects. Finally, an analysis of wetting with simultaneous metallurigical reaction is given and used to discuss solder wetting phenomena. 60 refs., 13 figs.

  1. Horizon shells and BMS-like soldering transformations

    Blau, Matthias; O'Loughlin, Martin


    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  2. Thermomechanical fatigue damage evolution in SAC solder joints

    Matin, M. A.; Vellinga, W. P.; D Geers, M. G.


    Thermornechanical fatigue in lab-type Sn-Ag-Cu solder interconnections between two copper plates has been investigated under cyclic thermal loading within a number of temperature ranges. Fatigue mechanisms have been studied using optical and scanning electron microscopy. Among the various fatigue me

  3. Printed-Circuit-Board Soldering Training for Group IV Personnel.

    Hooprich, E. A.; Matlock, E. W.

    As part of a larger program to determine which Navy skills can be learned by lower aptitude personnel, and which methods and techniques would be most effective, an experimental course in printed circuit board soldering was given to 186 Group IV students in 13 classes. Two different training approaches--one stressing instructor guidance and the…

  4. Horizon shells and BMS-like soldering transformations

    Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)


    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  5. Recycling of lead solder dross, Generated from PCB manufacturing

    Lucheva, Biserka; Tsonev, Tsonio; Iliev, Peter


    The main purpose of this work is to analyze lead solder dross, a waste product from manufacturing of printed circuit boards by wave soldering, and to develop an effective and environmentally sound technology for its recycling. A methodology for determination of the content and chemical composition of the metal and oxide phases of the dross is developed. Two methods for recycling of lead solder dross were examined—carbothermal reduction and recycling using boron-containing substances. The influence of various factors on the metal yield was studied and the optimal parameters of the recycling process are defined. The comparison between them under the same parameters-temperature and retention time, showed that recycling of dross with a mixture of borax and boric acid in a 1:2 ratio provides higher metal yield (93%). The recycling of this hazardous waste under developed technology gets glassy slag and solder, which after correction of the chemical composition can be used again for production of PCB.

  6. Three-dimensional architecture and development of Danianbryozoan mounds at Limhamn, south-west Sweden, usingground-penetrating radar

    Nielsen, Lars; Schack von Brockdorff, A.; Bjerager, Morten Gustav Erik


    of larger mounds. The outermost beds of the individual mounds are commonly characterized by sub-parallel to parallel reflections which have a circular to slightly oval appearance in map view. The mounds are mainly aggrading and do not show clear signs of pronounced lateral migration during growth, although...

  7. Roles of interfacial reaction on mechanical properties of solder interfaces

    Liu, Pilin

    This study investigated roles of interfacial reaction in fracture and fatigue of solder interconnects. The interfacial reaction phases in the as-reflowed and after aging were examined by cross-sectional transmission electron microscopy (TEM) while interfacial mechanical properties were determined from a flexural peel fracture mechanics technique. Because of their widespread uses in microelectronic packaging, SnPb solder interfaces, and Bi-containing Pb-free solder interfaces were chosen as the subjects of this study. In the interfacial reaction study, we observed a complicated micro structural evolution during solid-state aging of electroless-Ni(P)/SnPb solder interconnects. In as-reflowed condition, the interfacial reaction produced Ni3Sn 4 and P-rich layers. Following overaging, the interfacial microstructure degenerated into a complex multilayer structure consisting of multiple layers of Ni-Sn compounds and transformed Ni-P phases. In SnPb solder interfacial system, fatigue study showed that the overaging of the high P electroless Ni-P/SnPb interconnects resulted in a sharp reduction in the fatigue resistance of the interface in the high crack growth rate regime. Fracture mechanism analysis indicated that the sharp drop in fatigue resistance was triggered by the brittle fracture of the Ni3Sn2 intermetallic phase developed at the overaged interface. The fatigue behavior was strongly dependent on P concentration in electroless Ni. Kirkendall voids were found in the interfacial region after aging, but they did not cause premature fracture of the solder interfaces. In Bi-containing solder interfacial system, we found that Bi segregated to the Cu-intermetallic interface during aging in SnBi/Cu interconnect. This caused serious embrittlement of Sn-Bi/Cu interface. Further aging induced numerous voids along the Cu3Sn/Cu interface. These interfacial voids were different from Kirkendall voids. Their formation was explained on basis of vacancy condensation at the


    Y.H.Tian; C.Q.Wang


    Interactions between 63Sn37Pb solder and PBGA metallization(Au/Ni/Cu)during laser and infrared reflow soldering were studied.During laser refow soldering process,a thin layer of AuSn4 was observed at the interface of the solder bumps,its morphology was strongly dependent on the laser reflow power and heating time.The solder bumps formed by the first laser reflow was refowed again to form the solder joints.The AuSn4 compounds formed in the first laser reflow process dissolved into the bulk solder after the secondary infrared reflow process.The needle-like AuSn4 changed into rodlike,and distributed inside the solder near the solder/pad interface.

  9. Electromigration Behaviors of Cu Reinforced Sn-3.5Ag Composite Solder Joints

    Wang, Yan; Han, Jing; Ma, Limin; Zuo, Yong; Guo, Fu


    The composite approach, by incorporating small amounts of reinforcement particles in the solder matrix, has proven to be one of the effective ways to improve the reliability of solder joints. The effects of Cu addition on electromigration were investigated in this study by incorporating 2% volume fraction Cu particles into Sn-3.5Ag eutectic solder paste by the in situ process. The one-dimensional solder joints, designed to prevent the current crowding effect, were stressed under a constant current density of 104 A/cm2 at room temperature, and the temperature of the sample could reach 105 ± 5°C due to the Joule heating effect. Doping 2 vol.% Cu was found to retard the electromigration phenomenon effectively. After electric current stressing for 528 h, the growth rate of an interfacial intermetallic compound (IMC) layer at the anode decreased 73% in contrast to that of Sn-3.5Ag solder joints, and the IMC layer at the cathode was almost unchanged. The polarization effect of Cu reinforced composite solder joints was also apparently mitigated. In addition, the surface damage of the composite solder joints was relieved by incorporating 2 vol.% Cu particles. Compared to Sn-3.5Ag solder joints, which had protruded Cu6Sn5 and wrinkles of Sn-solder matrix on the surface, the solder joints with Cu addition had a more even surface.

  10. Electromigration Behaviors of Cu Reinforced Sn-3.5Ag Composite Solder Joints

    Wang, Yan; Han, Jing; Ma, Limin; Zuo, Yong; Guo, Fu


    The composite approach, by incorporating small amounts of reinforcement particles in the solder matrix, has proven to be one of the effective ways to improve the reliability of solder joints. The effects of Cu addition on electromigration were investigated in this study by incorporating 2% volume fraction Cu particles into Sn-3.5Ag eutectic solder paste by the in situ process. The one-dimensional solder joints, designed to prevent the current crowding effect, were stressed under a constant current density of 104 A/cm2 at room temperature, and the temperature of the sample could reach 105 ± 5°C due to the Joule heating effect. Doping 2 vol.% Cu was found to retard the electromigration phenomenon effectively. After electric current stressing for 528 h, the growth rate of an interfacial intermetallic compound (IMC) layer at the anode decreased 73% in contrast to that of Sn-3.5Ag solder joints, and the IMC layer at the cathode was almost unchanged. The polarization effect of Cu reinforced composite solder joints was also apparently mitigated. In addition, the surface damage of the composite solder joints was relieved by incorporating 2 vol.% Cu particles. Compared to Sn-3.5Ag solder joints, which had protruded Cu6Sn5 and wrinkles of Sn-solder matrix on the surface, the solder joints with Cu addition had a more even surface.

  11. Thérèse Mound: a case study of coral bank development in the Belgica Mound Province, Porcupine Seabight

    de Mol, Ben; Kozachenko, Max; Wheeler, Andy; Alvares, Hugo; Henriet, Jean-Pierre; Olu-Le Roy, Karine


    High-resolution seismic profiles, swath bathymetry, side-scan sonar data and video imageries are analysed in this detailed study of five carbonate mounds from the Belgica mound province with special emphasis on the well-surveyed Thérèse Mound. The selected mounds are located in the deepest part of the Belgica mound province at water depths of 950 m. Seismic data illustrate that the underlying geology is characterised by drift sedimentation in a general northerly flowing current regime. Sigmoidal sediment bodies create local slope breaks on the most recent local erosional surface, which act as the mound base. No preferential mound substratum is observed, neither is there any indication for deep geological controls on coral bank development. Seismic evidence suggests that the start-up of the coral bank development was shortly after a major erosional event of Late Pliocene Quaternary age. The coral bank geometry has been clearly affected by the local topography of this erosional base and the prevailing current regime. The summits of the coral banks are relatively flat and the flanks are steepest on their upper slopes. Deposition of the encased drift sequence has been influenced by the coral bank topography. Sediment waves are formed besides the coral banks and are the most pronounced bedforms. These seabed structures are probably induced by bottom current up to 1 m/s. Large sediment waves are colonised by living corals and might represent the initial phase of coral bank development. The biological facies distribution of the coral banks illustrate a living coral cap on the summit and upper slope and a decline of living coral populations toward the lower flanks. The data suggest that the development of the coral banks in this area is clearly an interaction between biological growth processes and drift deposition both influenced by the local topography and current regime.

  12. Concordance in mate choice in female mound-building mice.

    Beigneux, Emilie; Féron, Christophe; Gouat, Patrick


    Females must evaluate male quality to perform mate choice. Since females generally base their selection on different male features, individual females may differ in their choice. In this study, we show that concordance between females in mate choice decisions may arise without any experimental maximization of a particular attractive trait. Choice tests were performed in mound-building mice, Mus spicilegus, a monogamous species. Body odours of two male donors were presented to 12 female subjects individually. To determine female choice, the same pair of males was presented three times to a female. Four different pairs of male body odours were used. Male donors, not related to females, were selected at random in our polymorphic breeding stock. Using this two-way choice design, female mice displayed a clear choice and had a similar preference for particular males.

  13. Wave Induced Loading and Stability of Rubble Mound Breakwaters

    Hald, Tue

    conducting model tests very large variability in e.g. the degree of stability is observed. This background motivated the investigations conducted in the present study. The objective was to investigate and clarify which wave parameters are important for the hydraulic stability of the armour layer on typical...... related to the hydraulic stability was discussed. Further, governing parameters influencing the stability were identified and their influence quantified to retrieve the state- of-the-art. Model tests were conducted at SINTEF with scale models of prototype breakwaters and both the wave induced loading......The present state of knowledge when designing coastal structures has improved in the recent years. However the available design methods concerning especially rubble mound structures are characterized by a number of empirical and semi-empirical formulae making model tests inevitable and even when...

  14. The occurrence and development of peat mounds on King George Island (Maritime Antarctic

    Jerzy Fabiszewski


    Full Text Available On King George Island, South Shetlands Islands, a type of peat formation has been discovered which has not previously been reported from the Antarctic. These formations are in shape of mounds up to 7x 15 m in area, with a peat layer of about I m thick. About twenty five cm below the surface there is a layer of permanently frozen peat. The mounds are covered by living mosses (Polytrichum alpinum and Drepanocladus uncinatus, Antarctic hair grass (Deschampsia antarctica and lichens. Erosion fissures occurring on the surface are evidence of contemporary drying and cessation of the mound's growth. The initial phase of the development of the mounds began with a community dominated by Calliergidium austro-stramineum and Deschampsia antarctica, and their further development has been due to peat accumulation formed almost entirely by Calliergidium. The location of the mounds is near a penguin rookery, which clearly conditioned the minerotrophic character of these formations, as compared with the "moss peat banks" formed by Chorisodontium aciphyllum and Polytrichum al-pestre. Moreover, the peat mounds differ from the latter in several ways, e.g. rate of growth and floristic composition. Radiocarbon dating of peat from the base of one mound gave an age of 4090±60 years B.P. This suggests that the age of the tundra on King George Island is about 5000-4000 years.

  15. Environmentally friendly solders 3-4 beyond Pb-based systems

    GAO Yuan; LIU Peng; GUO Fu; XIA Zhidong; LEI Yongping; SHI Yaowu


    Based on environmental considerations, global economic pressures, enacted by legislations in several countries, have warranted the elimination of lead from solders used in electronic applications.Sn3.5Ag, SnAgCu, and Sn0.7Cu have emerged among various lead-free candidates as the most promising solder alloys to be utilized in microelectronic industries.However, with the vast development and miniaturization of modern electronic packaging, new requirements such as superior service capabilities have been posed on lead-free solders.In order to improve the comprehensive property of the solder alloys, two possible approaches were adopted in the current research and new materials developed were patented.One approach was involved with the addition of alloying elements to make new ternary or quaternary solder alloys.Proper addition of rare earth element such as La and Ce have rendered solder alloys with improved mechanical properties, especially creep rupture lives of their joints.Another approach, the composite approach, was developed mainly to improve the service temperature capability of the solder alloys.Composite solders fabricated by mechanically incorporating various reinforcement particles to the solder paste have again exhibited enhanced properties without altering the existing processing characteristics.The recent progress and research efforts carried out on lead-free solder materials in Beijing University of Technology were reported.The effects of rare earth addition on the microstructure, processing properties, and mechanical properties were presented.The behaviors of various Sn-3.5Ag based composite solders were also explicated in terms of the roles of reinforcement particles on intermetallic growth, steady-state creep rate, the onset of tertiary creep, as well as the overall creep deformation in the solder joints.Thermomechanical fatigue (TMF) behavior of the solder alloys and composite solders were investigated with different parameters such as ramp rate

  16. Effects of particle size on the mechanical properties of particle-reinforced Sn-Ag composite solder joint


    Particulate size has significant influenced on the mechanical properties of particle-reinforced composite solder joints. In this current research, Cu or Ni reinforcement particles were mechanically added to the Sn-3.5Ag eutectic solder, and the effects of the particle size on the mechanical properties of particle-reinforced composite solder joint were systematically studied. This investigation touched on how mechanical properties of the solder joints are affected by particles size. A quantitative formula was set up to correlate the mechanical property of the solder joint with particle size in different processing conditions. Besides, the fracture mechanism of the composite solder joint was analyzed.

  17. The Mechanical Behavior of Sn-Ag4 Solder Joints Subjected to Thermal Cycling

    CHENGuohai; MAJusheng


    The method of mount strain gages is used to measure the stress/strain hysteresis loops of the solder joints under thermal cycling. The results show that different solders have different loops; the shape of the loops will change less, and finally become a line along with the thermal cycle increase. The shear module decreases along with the thermal cycling process. But the creep index of the solder joints is not sensitive to the cycling process,which fluctuates between 5 and 7. Because the elements of the solder and matrix materials diffuse during the process, the voids induced in the solder joints expand. The expansion of the voids will lead to the crystal lattice aberrance of solder crystal.

  18. Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows

    Li, Yan; Hatch, Olen; Liu, Pilin; Goyal, Deepak


    Solder joint interconnects in three-dimensional (3D) packages with package stacking configurations typically must undergo multiple reflow cycles during the assembly process. In this work, interfacial open joint failures between the bulk solder and the intermetallic compound (IMC) layer were found in Sn-Ag-Cu (SAC) solder joints connecting a small package to a large package after multiple reflow reliability tests. Systematic progressive 3D x-ray computed tomography experiments were performed on both incoming and assembled parts to reveal the initiation and evolution of the open failures in the same solder joints before and after the reliability tests. Characterization studies, including focused ion beam cross-sections, scanning electron microscopy, and energy-dispersive x-ray spectroscopy, were conducted to determine the correlation between IMC phase transformation and failure initiation in the solder joints. A comprehensive failure mechanism, along with solution paths for the solder joint interfacial failures after multiple reflow cycles, is discussed in detail.

  19. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A


    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  20. Deep sea corals and carbonate mounds of the nw european margin: a biogeochemical perspective

    Kiriakoulakis, K.; White, M.; Bett, B.; Wolff, G. A.


    The deep-sea, scleractinian, reef-forming coral Lophelia pertusa is widespread along the NW European Continental Margin and its presence has been documented since the 19th century. However little is known about its ecology, biochemistry and particularly its relationship with the carbonate mounds it is often associated with. The characterisation of particulate organic matter (POM), which fuels the Lophelia pertusa ecosystems and the sediments on and around the coral/mound sites, may potentially shed light on the biogeochemical processes of the deep water coral (DWC) ecosystems. In this study, POM (20--40 m above bottom) and sediments have been collected from five mound/coral sites along the European Continental Slope (water depth ˜500--1000 m) with distinct oceanographic and sedimentological conditions, (Darwin, Logachev, Pelagia, Hovland and Belgica Mounds located around the Rockall Trough and Porcupine Seabight). Coral densities and mound sizes, shapes and conditions vary significantly from site to site. POM at these sites are significantly different, particularly with respect to the lipid concentrations relative to organic carbon, which are much higher at the Darwin Mounds (N.Rockall Trough; ˜1000m depth) than the rest of the sites (46.63 -- 225.11 mg g-1 and 0.49 -- 14.21 mg g-1 respectively). Polyunsaturated fatty acids (PUFAs), which are used as proxies of labile organic matter are also abundant at the Darwin Mounds, indicating that POM is 'fresh'. Scanning electron microscopy carried out on filtered material from this area confirms this. These mounds are affected by a branch of the poleward slope current, which, in combination with enhanced Ekman downwelling, could transport appreciable amounts of high quality organic matter to the depth that they are found. Lipid (including PUFAs) concentrations at the Pelagia Mounds (SE Rockall Trough; ˜700 m) although lower than at the Darwin Mounds are higher than at the other sites. This location is also influenced by

  1. Stability of Monolithic Rubble Mound Breakwater Crown Walls Subjected to Impulsive Loading

    Nørgaard, Jørgen Harck; Andersen, Lars Vabbersgaard; Andersen, Thomas Lykke


    model tests. The outcome is a more reliable evaluation of the applicability of simple dynamic calculations for the estimation of sliding distances of rubble mound superstructures. This is of great practical importance since many existing rubble mound crown walls are subjected to increasing wave loads......This paper evaluates the validity of a simple onedimensional dynamic analysis as well as a FEM model to determine the sliding of a rubble mound breakwater crown wall. The evaluation is based on a case example with real wave load time series and displacements measured from two-dimensional physical...

  2. Columbia Estuary Ecosystem Restoration Program: Restoration Design Challenges for Topographic Mounds, Channel Outlets, and Reed Canarygrass

    Diefenderfer, Heida L. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Borde, Amy B. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Sinks, Ian A. [Columbia Land Trust, Vancouver, WA (United States); Cullinan, Valerie I. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Zimmerman, Shon A. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States)


    The purpose of this study was to provide science-based information to practitioners and managers of restoration projects in the Columbia Estuary Ecosystem Restoration Program (CEERP) regarding aspects of restoration techniques that currently pose known challenges and uncertainties. The CEERP is a program of the Bonneville Power Administration (BPA) and the U.S. Army Corps of Engineers (Corps), Portland District, in collaboration with the National Marine Fisheries Service and five estuary sponsors implementing restoration. The estuary sponsors are Columbia Land Trust, Columbia River Estuary Study Taskforce, Cowlitz Tribe, Lower Columbia Estuary Partnership, and Washington Department of Fish and Wildlife. The scope of the research conducted during federal fiscal year 2015 included three aspects of hydrologic reconnection that were selected based on available scientific information and feedback from restoration practitioners during project reviews: the design of mounds (also called hummocks, peninsulas, or berms); the control of reed canarygrass (Phalaris arundinaceae); and aspects of channel network design related to habitat connectivity for juvenile salmonids.

  3. Reaction of Liquid Sn-Ag-Cu-Ce Solders with Solid Copper

    Chriaštel'Ová, J.; Rízeková Trnková, L.; Pocisková Dimová, K.; Ožvold, M.


    Small amounts of the rare-earth element Ce were added to the Sn-rich lead-free eutectic solders Sn-3.5Ag-0.7Cu, Sn-0.7Cu, and Sn-3.5Ag to improve their properties. The microstructures of the solders without Ce and with different amounts (0.1 wt.%, 0.2 wt.%, and 0.5 wt.%) of Ce were compared. The microstructure of the solders became finer with increasing Ce content. Deviation from this rule was observed for the Sn-Ag-Cu solder with 0.2 wt.% Ce, and for the Sn-0.7Cu eutectic alloy, which showed the finest microstructure without Ce. The melting temperatures of the solders were not affected. The morphology of intermetallic compounds (IMC) formed at the interface between the liquid solders and a Cu substrate at temperatures about 40°C above the melting point of the solder for dipping times from 2 s to 256 s was studied for the basic solder and for solder with 0.5 wt.% Ce addition. The morphology of the Cu6Sn5 IMC layer developed at the interface between the solders and the substrate exhibited the typical scallop-type shape without significant difference between solders with and without Ce for the shortest dipping time. Addition of Ce decreased the thickness of the Cu6Sn5 IMC layer only at the Cu/Sn-Ag-Cu solder interface for the 2-s dipping. A different morphology of the IMC layer was observed for the 256-s dipping time: The layers were less continuous and exhibited a broken relief. Massive scallops were not observed. For longer dipping times, Cu3Sn IMC layers located near the Cu substrate were also observed.


    Heinemann, D.; S. Knabner; Baumgarten, D.


    Printed Circuit Boards (PCB) play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. ...

  5. Investigation of moisture uptake into printed circuit board laminate and solder mask materials

    Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti


    Presence of moisture in a printed circuit board (PCB) laminate, typically made of glass fibres reinforced epoxy polymer, significantly influences the electrical functionality in various ways and causes problems during soldering process. This paper investigates the water uptake of laminates coated...... with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

  6. High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

    and mechanical properties of these potential candidate alloys with respect to the currently used high-lead content solders is made. Finally, the paper presents the superior characteristics as well as some drawbacks of these proposed high-temperature lead-free solder alternatives....... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

  7. Research Progress in Solderable Black Pad of Electroless Nickel/Immersion Gold

    Liu Haiping; Li Ning; Bi Sifu; Li Deyu


    Electroless nickel/immersion gold (ENIG) technology is widely used as one of the surface final finish for electronics packaging substrate and printed circuit board (PCB), providing a protective, conductive and solderable surface. However, there is a solder joint interfacial brittle fracture (or solderability failure) of using the ENIG coating. The characteristics and the application of ENIG technology were narrated in this paper. The research progress on the solderability failure of ENIG was introduced. The mechanism of "black pad" and the possible measure of eliminating or alleviating the "black pad" were also introduced. The development direction and market prospects of ENIG were prospected.

  8. Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder Alloys

    Hidaka, N.; Watanabe, H.; Yoshiba, M.


    We developed a new lead-free solder alloy, an Sn-Ag-Cu base to which a small amount of Ni and Ge is added, to improve the mechanical properties of solder alloys. We examined creep deformation in bulk and through-hole (TH) form for two lead-free solder alloys, Sn-3.5Ag-0.5Cu-Ni-Ge and Sn-3.0Ag-0.5Cu, at elevated temperatures, finding that the creep rupture life of the Sn-3.5Ag-0.5Cu-Ni-Ge solder alloy was over three times better than that of the Sn-3.0Ag-0.5Cu solder at 398 K. Adding Ni to the solder appears to make microstructural development finer and more uniform. The Ni added to the solder readily combined with Cu to form stable intermetallic compounds of (Cu, Ni)6Sn5 capable of improving the creep behavior of solder alloys. Moreover, microstructural characterization based on transmission electron microscopy analyses observing creep behavior in detail showed that such particles in the Sn-3.5Ag-0.5Cu-Ni-Ge solder alloy prevent dislocation and movement.

  9. Joining of Bi-2212 high- Tc superconductors and metals using indium solders

    Oh, S. Y.; Kim, H. R.; Jeong, Y. H.; Hyun, O. B.; Kim, C. J.


    BSCCO tubes can be used as a base material for switching devices such as superconducting fault current limiters (SFCLs) that prevent an electrical problem from occurring in an electrical power system. To apply an BSCCO bulk tube to a switching device, the superconducting tube has to be joined with a metallic part to by the over current to the metal part when the FCL is quenched. In this study, joining between Cu-Ni alloy and BSCCO was accomplished by soldering using In-Sn and In-Bi solders. Additionally, an Sn-Ag-Cu/In-Bi solder was used for the soldering of a different kind. For a better joining of the BSCCO superconductor with the In-Bi solder, the surface of the BSCCO was pre-coated with Ag by electro-plating. From the experiments, an intermetallic compound (IMC) of AgxIny chain was observed to be mainly formed from In-Sn and In-Bi soldering process. In case of the soldering of a different kind, IMC of AgxIny and CuxSny was also developed. Finally, we confirmed that the properties of soldering were enhanced by Sn-Ag-Cu/In-Bi twice-soldering process.

  10. Joining of Bi-2212 high-T{sub c} superconductors and metals using indium solders

    Oh, S.Y. [Nuclear Nanomaterials Development Laboratory, Korea Atomic Energy Research Institute (KAERI), 150 Dukjin-dong, Yusong-gu, Daejeon 305-353 (Korea, Republic of); Kim, H.R.; Jeong, Y.H.; Hyun, O.B. [Superconductivity and Applications Group, Korea Electric Power Research Institute (KEPRI), Daejeon 305-380 (Korea, Republic of); Kim, C.J. [Nuclear Nanomaterials Development Laboratory, Korea Atomic Energy Research Institute (KAERI), 150 Dukjin-dong, Yusong-gu, Daejeon 305-353 (Korea, Republic of)], E-mail:


    BSCCO tubes can be used as a base material for switching devices such as superconducting fault current limiters (SFCLs) that prevent an electrical problem from occurring in an electrical power system. To apply an BSCCO bulk tube to a switching device, the superconducting tube has to be joined with a metallic part to by the over current to the metal part when the FCL is quenched. In this study, joining between Cu-Ni alloy and BSCCO was accomplished by soldering using In-Sn and In-Bi solders. Additionally, an Sn-Ag-Cu/In-Bi solder was used for the soldering of a different kind. For a better joining of the BSCCO superconductor with the In-Bi solder, the surface of the BSCCO was pre-coated with Ag by electro-plating. From the experiments, an intermetallic compound (IMC) of Ag{sub x}In{sub y} chain was observed to be mainly formed from In-Sn and In-Bi soldering process. In case of the soldering of a different kind, IMC of Ag{sub x}In{sub y} and Cu{sub x}Sn{sub y} was also developed. Finally, we confirmed that the properties of soldering were enhanced by Sn-Ag-Cu/In-Bi twice-soldering process.

  11. An Evaluation of Prototype Circuit Boards Assembled with a Sn-Ag Bi Solder



    An evaluation was performed which examined the aging of surface mount solder joints assembled with 91.84Sn-3.33Ag-4.83Bi solder. Defect analysis of the as-fabricated test vehicles revealed excellent solderability, good package alignment, and a minimum number of voids. Continuous DC electrical monitoring of the solder joints did not reveal opens during as many as 10,000 thermal cycles (0 C, 100 C). The solder joints exhibited no significant degradation through 2500 cycles, based upon an absence of microstructural damage and sustained shear and pull strengths of chip capacitors and J-leaded solder joints, respectively. Thermal cycles of 5000 and 10,000 resulted in some surface cracking of the solder fillets and coatings. In a few cases, deeper cracks were observed in the thinner reaches of several solder fillets. There was no deformation or cracking in the solder located in the gap between the package I/O and the circuit board pad nor in the interior of the fillets, both locations that would raise concerns of joint mechanical integrity. A drop in the chip capacitor shear strength was attributed to crack growth near the top of the fillet.

  12. Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

    Saliza Azlina O.


    Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

  13. The Guaymas Basin hiking guide to hydrothermal mounds, chimneys and microbial mats: complex seafloor expressions of subsurface hydrothermal circulation

    Andreas eTeske


    Full Text Available The hydrothermal mats, mounds and chimneys of the southern Guaymas Basin are the surface expression of complex subsurface hydrothermal circulation patterns. In this overview we document the most frequently visited features of this hydrothermal area with photographs, temperature measurements, and selected geochemical data; many of these distinct habitats await characterization of their microbial communities and activities. Microprofiler deployments on microbial mats and hydrothermal sediments show their steep geochemical and thermal gradients at millimeter-scale vertical resolution. Mapping these hydrothermal features and sampling locations within the southern Guaymas Basin suggest linkages to underlying shallow sills and heatflow gradients. Recognizing the inherent spatial limitations of much current Guaymas Basin sampling calls for a wider survey of the entire spreading region.

  14. Nano Coated Lead Free Solders for Sustainable Electronic Waste Management

    K. Arun Vasantha Geethan

    Full Text Available ABSTRACT Lead has been used in a wide range of applications, but in the past decades it became clear that its high toxicity could cause various problems. Studies indicate that exposure to high concentrations of lead can cause harmful damages to humans. To eliminate the usage of lead in electronic products as an initiative towards electronic waste management (e waste, lead free solders were produced with suitable methods by replacing lead. But lead free solders are not preferred as a substitute of lead because they are poor in their mechanical properties such as tensile strength, shear strength and hardness which are ultimately required for a material to resist failure.Nano-Structured materials and coatings offer the potential for Vital improvements in engineering properties based on improvements in physical and mechanical properties resulting from reducing micro structural features by factors of 100 to 1000 times compared to current engineering materials.

  15. Sedimentary Mounds on Mars: Tracing Present-day Formation Processes into the Past

    Niles, P. B.; Michalski, J.; Edwards, C. S.


    High resolution photography and spectroscopy of the martian surface (MOC, HiRISE) from orbit has revolutionized our view of Mars with one and revealed spectacular views of finely layered sedimentary materials throughout the globe [1]. Some of these sedimentary deposits are 'mound' shaped and lie inside of craters (Fig 1). Crater mound deposits are found throughout the equatorial region, as well as ice-rich deposits found in craters in the north and south polar region [2-4]. Despite their wide geographical extent and varying volatile content, the 'mound' deposits have a large number of geomorphic and structural similarities that suggest they formed via equivalent processes. Thus, modern depositional processes of ice and dust can serve as an invaluable analog for interpreting the genesis of ancient sedimentary mound deposits.

  16. Spatial Vegetation Data for Effigy Mounds National Monument Vegetation Mapping Project

    National Park Service, Department of the Interior — The vegetation spatial database coverage (vegetation map) is a product of the Effigy Mounds National Monument Vegetation Mapping Project, USGS-NPS Vegetation Mapping...

  17. Water fluxes between inter-patches and vegetated mounds in flat semiarid landscapes

    Rossi, María J.; Ares, Jorge O.


    It has been assumed that bare soil (BS) inter-patches in semi arid spotted vegetation behave as sources of water to near vegetated soil (VS) patches. However, little evidence has been gained from direct measurements of overland and infiltration water fluxes between bare soil inter-patches and shrub mounds at a scale compatible with available high resolution imagery and hydrological modeling techniques. The objective of this study is to address the thin scale internal redistribution of water between BS inter-patches and vegetated mounds at relatively flat spotted semiarid landscapes. The relation between plant cover, topography and runoff was inspected with non-parametric association coefficients based on high resolution remotely sensed imagery, ground truth topographic elevation and spatial-explicit field data on potential runoff. Measurements of advective flows at the same spatial scale were carried out at micro-plots of BS and shrub mounds. Water fluxes between BS inter-patch and a shrub mound were simulated under varying typical Patagonian rainfall scenarios with an hydrological model. Results obtained revealed that the soil properties, infiltration and overland flow metrics at the mounds and inter-patches exhibit spatially and dynamic variable hydraulic properties. High micro-topographic roughness and depression storage thickened overland flow depth at VS patches. At BS inter-patches prevailing low slopes and depression storage were found to be important variables attenuating the surface runoff. At both rainfall scenarios simulated, the soil under the shrub mound accumulated more moisture (from direct rain) and reached saturation long before this occurred in BS nearby inter-patch area. Overland flow at the inter-patch was attenuated as it reached the border of the patch, diverging from the latter as it followed the (small) topographic gradient. The overland flow generated inside the vegetated mound was effectively retained at the typical Summer rainfall

  18. Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

    Yakymovych, A.; Plevachuk, Yu.; Švec, P.; Švec, P.; Janičkovič, D.; Šebo, P.; Beronská, N.; Roshanghias, A.; Ipser, H.


    To date, additions of different oxide nanoparticles is one of the most widespread procedures to improve the mechanical properties of metals and metal alloys. This research deals with the effect of minor ceramic nanoparticle additions (SiO2, TiO2 and ZrO2) on the microstructure and mechanical properties of Cu/solder/Cu joints. The reinforced Sn3.0Ag0.5Cu (SAC305) solder alloy with 0.5 wt.% and 1.0 wt.% of ceramic nanoparticles was prepared through mechanically stirring. The microstructure of as-solidified Cu/solder/Cu joints was studied using scanning electron microscopy. The additions of ceramic nanoparticles suppressed the growth of the intermetallic compound layer Cu6Sn5 at the interface solder/Cu and improved the microstructure of the joints. Furthermore, measurements of mechanical properties showed improved shear strength of Cu/composite solder/Cu joints compared to joints with unreinforced solder. This fact related to all investigated ceramic nanoinclusions and should be attributed to the adsorption of nanoparticles on the grain surface during solidification. However, this effect is less pronounced on increasing the nanoinclusion content from 0.5 wt.% to 1.0 wt.% due to agglomeration of nanoparticles. Moreover, a comparison analysis showed that the most beneficial influence was obtained by minor additions of SiO2 nanoparticles into the SAC305 solder alloy.

  19. Archaeological mounds as analogs of engineered covers for waste disposal sites: Literature review and progress report. [Appendix contains bibliography and data on archaeological mounds

    Chatters, J C; Gard, H A


    Closure caps for low-level radioactive waste disposal facilities are typically designed as layered earthen structures, the composition of which is intended to prevent the infiltration of water and the intrusion of the public into waste forms. Federal regulations require that closure caps perform these functions well enough that minimum exposure guidelines will be met for at least 500 years. Short-term experimentation cannot mimic the conditions that will affect closure caps on the scale of centuries, and therefore cannot provide data on the performance of cap designs over long periods of time. Archaeological mounds hundreds to thousands of years old which are closely analogous to closure caps in form, construction details, and intent can be studied to obtain the necessary understanding of design performance. Pacific Northwest Laboratory conducted a review and analysis of archaeological literature on ancient human-made mounds to determine the quality and potential applicability of this information base to assessments of waste facility design performance. A bibliography of over 200 English-language references was assembled on mound structures from the Americas, Europe, and Asia. A sample of these texts was read for data on variables including environmental and geographic setting, condition, design features, construction. Detailed information was obtained on all variables except those relating to physical and hydrological characteristics of the mound matrix, which few texts presented. It is concluded that an extensive amount of literature and data are available on structures closely analogous to closure caps and that this information is a valuable source of data on the long-term performance of mounded structures. Additional study is recommended, including an expanded analysis of design features reported in the literature and field studies of the physical and hydraulic characteristics of different mound designs. 23 refs., 10 figs., 12 tabs.

  20. Buried Cold-Water Coral Mound Provinces and Contourite Drifts Along the Eastern Atlantic Margin: Controls, Interactions and Connectivity

    Van Rooij, D.; Vandorpe, T.; Delivet, S.; Hebbeln, D.; Wienberg, C.; Martins, I.


    The association between cold-water coral mounds and contourite drift deposits has been demonstrated in the Belgica mound province, off Ireland. On that location, IODP expedition 307 was able to drill through the base of a mound, dating mound initiation at 2.65 Ma. However, the Belgica mounds are just one of the many expressions of mound growth. More enigmatic is the buried Magellan mound province, located in the northern part of the Porcupine Basin, featuring over 1000 relatively closely spaced buried mounds, which are all rooted on a common reflector. This indicates a common start-up event, but the true driving forces behind their initial settling, growth and demise are still unknown. The influence of bottom currents cannot be ruled out, since clear obstacle marks are present surrounding the mounds. In 2013, some 3000 km south of the Magellan mounds, a new province of buried mounds was discovered along the Moroccan Atlantic Margin, which may shed new light on the "life" cycle of mounds. Here, we report the preliminary results and propose a first view on the controls, interactions and connectivity between these 2 provinces, assisted by a series of studies of contourite drifts along the Eastern Atlantic Margin. The newly discovered buried mounds can be associated to a vast province of several clusters of seabed mounds. They occur in water depths between 500 and 1000 m, buried under up to 50 m of sediment. With respect to the Magellan mounds, they are smaller, but more importantly, they do not root on one single stratigraphic level. At least 4 different initiation levels were identified. The off-mound reflectors indicate a slight influence of bottom currents, since the mounds are located in a large sediment drift. Moreover, the link between the two buried mound provinces may be found in connecting the evolution of the associated contourite drift systems, respectively in Porcupine Seabight and the Gulf of Cádiz. Intermediate sites on Goban Spur and near Le Danois

  1. Introduction of Partial Coefficients in the Design of Rubble Mound Breakwaters

    Burcharth, H. F.


    After a number of large breakwaters had failed or suffered severe damage, a working group established by PIANC's Permanent Technical Committee ΙΙ produced a report on the stability of rubble mound structures.......After a number of large breakwaters had failed or suffered severe damage, a working group established by PIANC's Permanent Technical Committee ΙΙ produced a report on the stability of rubble mound structures....

  2. Active hydrothermal and non-active massive sulfide mound investigation using a new multiparameter chemical sensor

    Han, C.; Wu, G.; Qin, H.; Wang, Z.


    Investigation of active hydrothermal mound as well as non-active massive sulfide mound are studied recently. However, there is still lack of in-situ detection method for the non-active massive sulfide mound. Even though Transient ElectroMagnetic (TEM) and Electric Self-potential (SP) methods are good, they both are labour, time and money cost work. We proposed a new multiparameter chemical sensor method to study the seafloor active hydrothermal mound as well as non-active massive sulfide mound. This sensor integrates Eh, S2- ions concentration and pH electrochemical electrodes together, and could found chemical change caused by the active hydrothermal vent, even weak chemical abnormalities by non-active massive sulfide hydrothermal mound which MARP and CTD sometimes cannot detect. In 2012, the 1st Leg of the Chinese 26th cruise, the multiparameter chemical sensor was carried out with the deepsea camera system over the Carlsberg Ridge in Indian Ocean by R/V DAYANGYIHAO. It was shown small Eh and S2- ions concentration abnormal around a site at Northwest Indian ridge. This site was also evidenced by the TV grab. In the 2nd Leg of the same cruise in June, this chemical sensor was carried out with TEM and SP survey system. The chemical abnormalities are matched very well with both TEM and SP survey results. The results show that the multiparameter chemical sensor method not only can detect active hydrothermal mound, but also can find the non-active massive sulfide hydrothermal mound.

  3. Introduction of Partial Coefficients in the Design of Rubble Mound Breakwaters

    Burcharth, H. F.


    After a number of large breakwaters had failed or suffered severe damage, a working group established by PIANC's Permanent Technical Committee ΙΙ produced a report on the stability of rubble mound structures.......After a number of large breakwaters had failed or suffered severe damage, a working group established by PIANC's Permanent Technical Committee ΙΙ produced a report on the stability of rubble mound structures....

  4. Numerical Modelling of Solitary Wave Experiments on Rubble Mound Breakwaters

    Guler, H. G.; Arikawa, T.; Baykal, C.; Yalciner, A. C.


    Performance of a rubble mound breakwater protecting Haydarpasa Port, Turkey, has been tested under tsunami attack by physical model tests conducted at Port and Airport Research Institute (Guler et al, 2015). It is aimed to understand dynamic force of the tsunami by conducting solitary wave tests (Arikawa, 2015). In this study, the main objective is to perform numerical modelling of solitary wave tests in order to verify accuracy of the CFD model IHFOAM, developed in OpenFOAM environment (Higuera et al, 2013), by comparing results of the numerical computations with the experimental results. IHFOAM is the numerical modelling tool which is based on VARANS equations with a k-ω SST turbulence model including realistic wave generation, and active wave absorption. Experiments are performed using a Froude scale of 1/30, measuring surface elevation and flow velocity at several locations in the wave channel, and wave pressure around the crown wall of the breakwater. Solitary wave tests with wave heights of H=7.5 cm and H=10 cm are selected which represent the results of the experiments. The first test (H=7.5 cm) is the case that resulted in no damage whereas the second case (H=10 cm) resulted in total damage due to the sliding of the crown wall. After comparison of the preliminary results of numerical simulations with experimental data for both cases, it is observed that solitary wave experiments could be accurately modeled using IHFOAM focusing water surface elevations, flow velocities, and wave pressures on the crown wall of the breakwater (Figure, result of sim. at t=29.6 sec). ACKNOWLEDGEMENTSThe authors acknowledge developers of IHFOAM, further extend their acknowledgements for the partial supports from the research projects MarDiM, ASTARTE, RAPSODI, and TUBITAK 213M534. REFERENCESArikawa (2015) "Consideration of Characteristics of Pressure on Seawall by Solitary Waves Based on Hydraulic Experiments", Jour. of Japan. Soc. of Civ. Eng. Ser. B2 (Coast. Eng.), Vol 71, p I

  5. The Surales, Self-Organized Earth-Mound Landscapes Made by Earthworms in a Seasonal Tropical Wetland.

    Zangerlé, Anne; Renard, Delphine; Iriarte, José; Suarez Jimenez, Luz Elena; Adame Montoya, Kisay Lorena; Juilleret, Jérôme; McKey, Doyle


    The formation, functioning and emergent properties of patterned landscapes have recently drawn increased attention, notably in semi-arid ecosystems. We describe and analyze a set of similarly spectacular landforms in seasonal tropical wetlands. Surales landscapes, comprised of densely packed, regularly spaced mounds, cover large areas of the Orinoco Llanos. Although descriptions of surales date back to the 1940's, their ecology is virtually unknown. From data on soil physical and chemical properties, soil macrofauna, vegetation and aerial imagery, we provide evidence of the spatial extent of surales and how they form and develop. Mounds are largely comprised of earthworm casts. Recognizable, recently produced casts account for up to one-half of total soil mass. Locally, mounds are relatively constant in size, but vary greatly across sites in diameter (0.5-5 m) and height (from 0.3 m to over 2 m). This variation appears to reflect a chronosequence of surales formation and growth. Mound shape (round to labyrinth) varies across elevational gradients. Mounds are initiated when large earthworms feed in shallowly flooded soils, depositing casts that form 'towers' above water level. Using permanent galleries, each earthworm returns repeatedly to the same spot to deposit casts and to respire. Over time, the tower becomes a mound. Because each earthworm has a restricted foraging radius, there is net movement of soil to the mound from the surrounding area. As the mound grows, its basin thus becomes deeper, making initiation of a new mound nearby more difficult. When mounds already initiated are situated close together, the basin between them is filled and mounds coalesce to form larger composite mounds. Over time, this process produces mounds up to 5 m in diameter and 2 m tall. Our results suggest that one earthworm species drives self-organizing processes that produce keystone structures determining ecosystem functioning and development.

  6. Molluskan fauna in two shell mounds in the State of Parana coast, Brazil

    Marcos de Vasconcellos Gernet


    Full Text Available The shell mounds are artificial formations consisting mostly of mollusk shells used in the feeding of the prehistoric peoples which inhabited our coast. These sites are found throughout the Brazilian coast, and hundreds of them were cataloged in the State of Paraná since the 1940s. The fragility of these sites, their importance as evidences of our prehistoric period, and its abrupt disappearance, justify the need for new researches which contribute to contextualize and draw up plans to preserve this heritage. The works related to the molluskan fauna found in the shell mounds are restricted to refer to the most common species and, sometimes, just their popular names. A greater knowledge on these prehistoric inhabitants’ diet allows a better understanding of ancient natural ecosystems. The survey of mollusks was carried out in the shell mounds Guaraguaçu and Boguaçu, in the towns of Pontal do Parana and Guaratuba, respectively, and performed through visual inspection, reading of specialized bibliography and comparison to previous works on the fauna of the shell mounds in the State of Parana coast. Altogether, 29 species were observed in the shell mound Guaraguaçu and 17 species were observed in the shell mound Boguaçu, resulting in a total of 31 species.

  7. Zonation of Microbial Communities by a Hydrothermal Mound in the Atlantis II Deep (the Red Sea)

    Wang, Yong


    In deep-sea geothermal rift zones, the dispersal of hydrothermal fluids of moderately-high temperatures typically forms subseafloor mounds. Major mineral components of the crust covering the mound are barite and metal sulfides. As a result of the continental rifting along the Red Sea, metalliferous sediments accumulate on the seafloor of the Atlantis II Deep. In the present study, a barite crust was identified in a sediment core from the Atlantis II Deep, indicating the formation of a hydrothermal mound at the sampling site. Here, we examined how such a dense barite crust could affect the local environment and the distribution of microbial inhabitants. Our results demonstrate distinctive features of mineral components and microbial communities in the sediment layers separated by the barite crust. Within the mound, archaea accounted for 65% of the community. In contrast, the sediments above the barite boundary were overwhelmed by bacteria. The composition of microbial communities under the mound was similar to that in the sediments of the nearby Discovery Deep and marine cold seeps. This work reveals the zonation of microbial communities after the formation of the hydrothermal mound in the subsurface sediments of the rift basin.

  8. Oil reservoirs in grainstone aprons around Bryozoan Mounds, Upper Harrodsburg Limestone, Mississippian, Illinois Basin

    Jobe, H. [UNOCAL Energy Resources, Sugar Land, TX (United States); Saller, A. [UNOCAL Energy Resources, Brea, CA (United States)


    Several oil pools have been discovered recently in the upper Harrodsburg Limestone (middle Mississippian) of the Illinois basin. A depositional model for bryozoan mound complexes has allowed more successful exploration and development in this play. In the Johnsonville area of Wayne County, Illinois, three lithofacies are dominant in the upper Harrodsburg: (1) bryozoan boundstones, (2) bryozoan grainstones, and (3) fossiliferous wackestones. Bryozoan boundstones occur as discontinuous mounds and have low porosity. Although bryozoan boundstones are not the main reservoir lithofacies, they are important because they influenced the distribution of bryozoan grainstones and existing structure. Bryozoan grainstones have intergranular porosity and are the main reservoir rock. Bryozoan fragments derived from bryozoan boundstone mounds were concentrated in grainstones around the mounds. Fossiliferous wackestones are not porous and form vertical and lateral seals for upper Harrodsburg grainstones. Fossiliferous wackestones were deposited in deeper water adjacent to bryozoan grainstone aprons, and above grainstones and boundstones after the mounds were drowned. Upper Harrodsburg oil reservoirs occur where grainstone aprons are structurally high. The Harrodsburg is a good example of a carbonate mound system where boundstone cores are not porous, but adjacent grainstones are porous. Primary recovery in these upper Harrodsburg reservoirs is improved by strong pressure support from an aquifer in the lower Harrodsburg. Unfortunately, oil production is commonly decreased by water encroaching from that underlying aquifer.

  9. Zonation of Microbial Communities by a Hydrothermal Mound in the Atlantis II Deep (the Red Sea.

    Yong Wang

    Full Text Available In deep-sea geothermal rift zones, the dispersal of hydrothermal fluids of moderately-high temperatures typically forms subseafloor mounds. Major mineral components of the crust covering the mound are barite and metal sulfides. As a result of the continental rifting along the Red Sea, metalliferous sediments accumulate on the seafloor of the Atlantis II Deep. In the present study, a barite crust was identified in a sediment core from the Atlantis II Deep, indicating the formation of a hydrothermal mound at the sampling site. Here, we examined how such a dense barite crust could affect the local environment and the distribution of microbial inhabitants. Our results demonstrate distinctive features of mineral components and microbial communities in the sediment layers separated by the barite crust. Within the mound, archaea accounted for 65% of the community. In contrast, the sediments above the barite boundary were overwhelmed by bacteria. The composition of microbial communities under the mound was similar to that in the sediments of the nearby Discovery Deep and marine cold seeps. This work reveals the zonation of microbial communities after the formation of the hydrothermal mound in the subsurface sediments of the rift basin.

  10. A microstructural analysis of solder joints from the electronic assemblies of dismantled nuclear weapons

    Vianco, P.T.; Rejent, J.A. [Sandia National Labs., Albuquerque, NM (United States). Materials Joining Dept.


    MC1814 Interconnection Boxes from dismantled B57 bombs, and MC2839 firing Sets from retired W70-1 warheads were obtained from the Pantex facility. Printed circuit boards were selected from these components for microstructural analysis of their solder joints. The analysis included a qualitative examination of the solder joints and quantitative assessments of (1) the thickness of the intermetallic compound layer that formed between the solder and circuit board Cu features, and (2) the Pb-rich phase particle distribution within the solder joint microstructure. The MC2839 solder joints had very good workmanship qualities. The intermetallic compound layer stoichiometry was determined to be that of Cu6Sn5. The mean intermetallic compound layer thickness for all solder joints was 0.885 mm. The magnitude of these values did not indicate significant growth over the weapon lifetime. The size distribution of the Pb-rich phase particles for each of the joints were represented by the mean of 9.85 {times} 10{sup {minus}6} mm{sup 2}. Assuming a spherical geometry, the mean particle diameter would be 3.54 mm. The joint-to-joint difference of intermetallic compound layer thickness and Pb-rich particle size distribution was not caused by varying thermal environments, but rather, was a result of natural variations in the joint microstructure that probably existed at the time of manufacture. The microstructural evaluation of the through-hole solder joints form the MC2839 and MC1814 components indicated that the environmental conditions to which these electronic units were exposed in the stockpile, were benign regarding solder joint aging. There was an absence of thermal fatigue damage in MC2839 circuit board, through-hole solder joints. The damage to the eyelet solder joints of the MC1814 more likely represented infant mortality failures at or very near the time of manufacture, resulting from a marginal design status of this type of solder joint design.

  11. The Role of Benthic Currents and Sediment Transport On Deep-water Coral Mound Morphology and Growth: Examples From The Belgica and Moira Mounds, Eastern Porcupine Seabight, NE Atlantic

    Wheeler, A.; Kozachenko, M.; Olu-Le Roy, K.

    Deep-water corals and associated carbonate mound build-ups are extensive along the European continental margin coincident with areas of strong benthic current activity and, often, regions of active sand transport. Although as yet unsubstantiated links to hydrocarbon seepage may play a defining role in the generation of carbonate mounds, the growth of mounds is strongly influenced by benthic current activity. Furthermore, the morphology of mounds, both in terms of their overall shape and surface morpho- logical features, is strongly dictated by the benthic-currents. Giant carbonate mounds, e.g. the Thérèse Mound, Belgica Mound province, eastern Porcupine Seabight, NE Atlantic, show upstream growth (through biological and sed- imentary accretion) with downstream scour and sediment starvation influencing their overall morphology. The surface morphological details of these giant mounds show distinct relationships to sediment waves that have become colonised and stabilised by coral and associated communities. Once colonised, the sandwave surface-morphology is mimic by biological growth with corals preferential growing on wave crests, taking advantage of stronger current and nutrient flux, to form coral banks. Furthermore, erosion of carbonate mounds by strong current activity exposes suitable hard substrates for further coral colonisation. Paradoxically therefore, mound erosion stimulates further coral growth illustrating another benthic-current control on mound growth. The Moira Mounds in the Belgica Mound Province, Porcupine Seabight are small coral-colonised mound features (tens of metres across and a few metres high) that represent an early stage of mound development and much younger then their giant carbonate mound counterparts. These features occur in areas of active sand transport, on rippled sand sheets and the upstream margins of sediment wave fields. Once coral colonies gained a SfootingT in these areas, coral colonies trap sand and build posi- & cedil; 1

  12. Biogeochemistry and geomicrobiology of cold-water coral carbonate mounds - lessons learned from IODP Expedition 307

    Ferdelman, Timothy; Wehrmann, Laura; Mangelsdorf, Kai; Kano, Akihiro; Williams, Trevor; Jean-Pierre, Henriet


    Large mound structures associated with cold-water coral ecosystems commonly occur on the slopes of continental margins, for instance, west of Ireland in the Porcupine Seabight, the Gulf of Cadiz or the Straits of Florida. In the Porcupine Seabight over 1500 mounds of up to 5 km in diameter and 250 m height lie at water depths of 600 to 900 m. The cold-water coral reef ecosystems associated with these structures are considered to be "hotspots" of organic carbon mineralization and microbial systems. To establish a depositional and biogeochemical/diagenetic model for cold-water carbonate mounds, Challenger Mound and adjacent continental slope sites were drilled in May 2005 during IODP Expedition 307. One major objective was to test whether deep sub-surface hydrocarbon flow and enhanced microbial activity within the mound structure was important in producing and stabilizing these sedimentary structures. Drilling results showed that the Challenger mound succession (IODP Site U1317) is 130 to 150 meters thick, and mainly consists of floatstone and rudstone facies formed of fine sediments and cold-water branching corals. Pronounced recurring cycles on the scales of several meters are recognized in carbonate content (up to 70% carbonate) and color reflectance, and are probably associated with Pleistocene glacial-interglacial cycles. A role for methane seepage and subsequent anaerobic oxidation was discounted both as a hard-round substrate for mound initiation and as a principal source of carbonate within the mound succession. A broad sulfate-methane transition (approximately 50 m thick)within the Miocene sediments suggested that the zone of anaerobic oxidation of methane principally occurs below the moundbase. In the mound sediments, interstitial water profiles of sulfate, alkalinity, Mg, and Sr suggested a tight coupling between carbonate diagenesis and low rates of microbial sulfate reduction. Overall organic carbon mineralization within cold-water coral mound appeared

  13. Bryan Mound SPR cavern 113 remedial leach stage 1 analysis.

    Rudeen, David Keith; Weber, Paula D.; Lord, David L.


    The U.S. Strategic Petroleum Reserve implemented the first stage of a leach plan in 2011-2012 to expand storage volume in the existing Bryan Mound 113 cavern from a starting volume of 7.4 million barrels (MMB) to its design volume of 11.2 MMB. The first stage was terminated several months earlier than expected in August, 2012, as the upper section of the leach zone expanded outward more quickly than design. The oil-brine interface was then re-positioned with the intent to resume leaching in the second stage configuration. This report evaluates the as-built configuration of the cavern at the end of the first stage, and recommends changes to the second stage plan in order to accommodate for the variance between the first stage plan and the as-built cavern. SANSMIC leach code simulations are presented and compared with sonar surveys in order to aid in the analysis and offer projections of likely outcomes from the revised plan for the second stage leach.

  14. Earth-mounded concrete bunker PLAP technical approach

    Eng, R.


    Under the US DOE Prototype License Application Project (PLAP), Ebasco Services Incorporated was commissioned to develop a preliminary design of the Earth-Mounded Concrete Bunker (EMCB) concept for low-level radioactive waste (LLW) disposal. The EMCB disposal concept is of great interest because it represents the only engineered LLW disposal technology currently in use in the commercial sector. By definition, the EMCB disposal structure is located partially below grade and partially above grade. The concrete bunker is an engineered structure designed to be structurally stable for the prerequisite time horizon. The basic design parameters of the disposal facility were stipulated by US DOE, a northeast site location, representative waste, 30 year operational life, and a 250,000 ft{sup 3}/year disposal capacity. The design was developed to satisfy only US NRC Part 61 disposal requirements, not individual state requirements that may go beyond Part 61 requirements. The technical safety analysis of the preliminary design was documented according to the format specifications of NUREG-1199, to the extent practicable with quite limited resources.

  15. Photogrammetric analysis of rubble mound breakwaters scale model tests

    João Rodrigues


    Full Text Available The main goal of this paper is to develop a photogrammetric method in order to obtain arobust tool for damage assessment and quantification of rubble-mound armour layers during physicalscale model tests. With the present work, an innovative approach based on a reduced number ofdigital photos is proposed to support the identification of affected areas. This work considers twosimple digital photographs recording the instants before and after the completion of the physicaltest. Mathematical techniques were considered in the development of the procedures, enabling thetracking of image differences between photos. The procedures were developed using an open-sourceapplication, Scilab, nevertheless they are not platform dependent. The procedures developed enablethe location and identity of eroded areas in the breakwater armour layer, as well as the possibilityof quantifying them. This ability is confirmed through the calculation of correlation coefficients ineach step of the search for the more damaged area. It is also possible to make an assessment of themovement of armour layer units.

  16. Earth-mounded concrete bunker PLAP technical approach

    Eng, R.


    Under the US DOE Prototype License Application Project (PLAP), Ebasco Services Incorporated was commissioned to develop a preliminary design of the Earth-Mounded Concrete Bunker (EMCB) concept for low-level radioactive waste (LLW) disposal. The EMCB disposal concept is of great interest because it represents the only engineered LLW disposal technology currently in use in the commercial sector. By definition, the EMCB disposal structure is located partially below grade and partially above grade. The concrete bunker is an engineered structure designed to be structurally stable for the prerequisite time horizon. The basic design parameters of the disposal facility were stipulated by US DOE, a northeast site location, representative waste, 30 year operational life, and a 250,000 ft{sup 3}/year disposal capacity. The design was developed to satisfy only US NRC Part 61 disposal requirements, not individual state requirements that may go beyond Part 61 requirements. The technical safety analysis of the preliminary design was documented according to the format specifications of NUREG-1199, to the extent practicable with quite limited resources.

  17. Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections

    Yu, Hao


    Continuous miniaturization of electronics devices as well as increasing complexity of soldering metallurgy introduce more and more challenges to the reliability of modern electronics products. Although loading condition plays an important role, the reliability of solder interconnections is ultimately controlled by microstructures' responses to loading. It is therefore of great importance to understand and control the microstructural evolutions of solder interconnections under different loadin...

  18. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

    Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu


    Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

  19. Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

    Sorg, Brian S.; Welch, Ashley J.


    Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

  20. Active soft solder deposition by magnetron-sputter-ion-plating (MSIP)-PVD-process

    Lugscheider, E.; Bobzin, K.; Erdle, A


    In different technical areas micro electro mechanical systems (M.E.M.S.), e.g. micro pumps, micro sensors, actuators and micro dosage systems are in use today. The components of these M.E.M.S. consist of various materials, which have to be joined. To join materials like ceramics, plastics or metals to a hybrid M.E.M.S., established joining technologies have to be adjusted. For the assembling and mounting of temperature sensible micro components, a low temperature joining process, e.g. transient liquid phase (TLP) bonding or an active soft soldering process can be performed. In this article the deposition of a low melting active soft solder by magnetron-sputter (MS)-PVD deposition with an active substrate cooling will be presented. The substrate temperatures were set and controlled by an additional cooling unit, which was integrated into the sputtering facility. In the performed experiments a substrate temperature range from -40 to +20 deg. C was investigated. The effects of these different substrate temperatures to the microstructure and the soldering suitability of the solder system were investigated by scanning electron microscopy (SEM), nanoindentation and soldering tests. The chemical composition of the deposited solder systems was examined by glow discharge optical spectroscopy (GDOS)-analysis. As a suitable substrate temperature range for deposition -10 to -20 deg. C was detected. Solder systems deposited in this temperature range showed good solder abilities.

  1. Dural reconstruction by fascia using a temperature-controlled CO2 laser soldering system

    Forer, Boaz; Vasilyev, Tamar; Brosh, Tamar; Kariv, Naam; Gil, Ziv; Fliss, Dan M.; Katzir, Abraham


    Conventional methods for dura repair are normally based on sutures or stitches. These methods have several disadvantages: (1) The dura is often brittle, and the standard procedures are difficult and time consuming. (2) The seal is leaky. (3) The introduction of a foreign body (e.g. sutures) may cause an inflammatory response. In order to overcome these difficulties we used a temperature controlled fiber optic based CO2 laser soldering system. In a set of in vitro experiments we generated a hole of diameter 10 mm in the dura of a pig corpse, covered the hole with a segment of fascia, and soldered the fascia to the edges of the hole, using 47% bovine albumin as a solder. The soldering was carried out spot by spot, and each spot was heated to 65° C for 3-6 seconds. The soldered dura was removed and the burst pressure of the soldered patch was measured. The average value for microscopic muscular side soldering was 194 mm Hg. This is much higher than the maximal physiological pressure of the CSF fluid in the brain, which is 15 mm Hg. In a set of in vivo experiments, fascia patches were soldered on holes in five farm pigs. The long term results of these experiments were very promising. In conclusion, we have developed an advanced technique for dural reconstruction, which will find important clinical applications.

  2. Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

    Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S


    The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding.

  3. Development of lead-free solders for high-temperature applications

    Chidambaram, Vivek

    -temperature applications. Unfortunately, even the substitute technologies that are currently being developed cannot address several critical issues of high-temperature soldering. Therefore, further research and development of high-temperature lead-free soldering is obviously needed. It is hoped that this thesis can serve...... as a valuable source of information to those interested in environmentally conscious electronic packaging....

  4. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.


    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  5. The automated system for technological process of spacecraft's waveguide paths soldering

    Tynchenko, V. S.; Murygin, A. V.; Emilova, O. A.; Bocharov, A. N.; Laptenok, V. D.


    The paper solves the problem of automated process control of space vehicles waveguide paths soldering by means of induction heating. The peculiarities of the induction soldering process are analyzed and necessity of information-control system automation is identified. The developed automated system makes the control of the product heating process, by varying the power supplied to the inductor, on the basis of information about the soldering zone temperature, and stabilizing the temperature in a narrow range above the melting point of the solder but below the melting point of the waveguide. This allows the soldering process automating to improve the quality of the waveguides and eliminate burn-troughs. The article shows a block diagram of a software system consisting of five modules, and describes the main algorithm of its work. Also there is a description of the waveguide paths automated soldering system operation, for explaining the basic functions and limitations of the system. The developed software allows setting of the measurement equipment, setting and changing parameters of the soldering process, as well as view graphs of temperatures recorded by the system. There is shown the results of experimental studies that prove high quality of soldering process control and the system applicability to the tasks of automation.

  6. Mechanical properties of FeCo magnetic particles-based Sn-Ag-Cu solder composites

    Xu, Siyang; Prasitthipayong, Anya; Pickel, Andrea D.; Habib, Ashfaque H.; McHenry, Michael E.


    We demonstrate magnetic nanoparticles (MNPs) in enabling lead-free solder reflow in RF fields and improved mechanical properties that impact solder joint reliability. Here, we report on Sn-Ag-Cu (SAC) alloys. SAC solder-FeCo MNP composites with 0, 1, 2, 3, and 4 wt. % FeCo MNP and the use of AC magnetic fields to achieve localized reflow. Electron microscopy of the as-reflowed samples show a decrease in the volume of Sn dendrite regions as well as smaller and more homogeneously dispersed Ag3Sn intermetallic compounds (IMCs) with increasing MNP concentrations. Mechanical properties of the composites were measured by nanoindentation. In pure solder samples and solder composites with 4 wt. % MNP, hardness values increased from 0.18 GPa to 0.20 GPa and the modulus increased from 39.22 GPa to 71.22 GPa. The stress exponent, reflecting creep resistance, increased from 12.85 of pure solder to 16.47 for solder composites with 4 wt. % MNP. Enhanced mechanical properties as compared with the as-prepared solder joints are explained in terms of grain boundary and dispersion strengthening resulting from the microstructural refinement.

  7. Intermetallic compound layer growth kinetics in non-lead bearing solders

    Vianco, P.T.; Kilgo, A.C.; Grant, R.


    The introduction of alternative, non-lead bearing solders into electronic assemblies requires a thorough investigation of product manufacturability and reliability. Both of these attributes can be impacted by the excessive growth of intermetallic compound (IMC) layers at the solder/substrate interface. An extensive study has documented the stoichiometry and solid state growth kinetics of IMC layers formed between copper and the lead-free solders: 96.5Sn-3.5Ag (wt.%), 95Sn-5Sb, 100Sn, and 58Bi-42Sn. Aging temperatures were 70--205 C for the Sn-based solders and 55--120 C for the Bi-rich solder. Time periods were 1--400 days for all of the alloys. The Sn/Cu, Sn-Ag/Cu, and Sn-Sb/Cu IMC layers exhibited sub-layers of Cu{sub 6}Sn{sub 5} and Cu{sub 3}Sn; the latter composition was present only following prolonged aging times or higher temperatures. The total layer growth exhibited a time exponent of n = 0.5 at low temperatures and a value of n = 0.42 at higher temperatures in each of the solder/Cu systems. Similar growth kinetics were observed with the low temperature 58Bi-42Sn solder; however, a considerably more complex sub-layer structure was observed. The kinetic data will be discussed with respect to predicting IMC layer growth based upon solder composition.

  8. Generation of Tin(II) Oxide Crystals on Lead-Free Solder Joints in Deionized Water

    Chang, Hong; Chen, Hongtao; Li, Mingyu; Wang, Ling; Fu, Yonggao


    The effect of the anode and cathode on the electrochemical corrosion behavior of lead-free Sn-Ag-Cu and Sn-Ag-Cu-Bi solder joints in deionized water was investigated. Corrosion studies indicate that SnO crystals were generated on the surfaces of all lead-free solder joints. The constituents of the lead-free solder alloys, such as Ag, Cu, and Bi, did not affect the corrosion reaction significantly. In contrast to lead-free solders, PbO x was formed on the surface of the traditional 63Sn-37Pb solder joint in deionized water. A cathode, such as Au or Cu, was necessary for the electrochemical corrosion reaction of solders to occur. The corrosion reaction rate decreased with reduction of the cathode area. The formation mechanism of SnO crystals was essentially a galvanic cell reaction. The anodic reaction of Sn in the lead-free solder joints occurred through solvation by water molecules to form hydrated cations. In the cathodic reaction, oxygen dissolved in the deionized water captures electrons and is deoxidized to hydroxyl at the Au or Cu cathode. By diffusion, the anodic reaction product Sn2+ and the cathodic reaction product OH- meet to form Sn(OH)2, some of which can dehydrate to form more stable SnO· xH2O crystals on the surface of the solder joints. In addition, thermodynamic analysis confirms that the Sn corrosion reaction could occur spontaneously.

  9. Indium Corporation Introduces New Pb-Free VOC-Free Wave Solder Flux


    The Indium Corporation of America has introduced WF-7742 Wave Solder Flux specifically designed to meet the process demands of Pb-Free manufacturing. WF-7742 is a VOC-Free material formulated for Pb-Free wave soldering of surface-mount, mixed-technology and through-holeelectronics assemblies.

  10. Assessment of circuit board surface finishes for electronic assembly with lead-free solders

    Ray, U.; Artaki, I.; Finley, D.W.; Wenger, G.M. [Bell Labs., Princeton, NJ (United States). Lucent Technologies; Pan, T.; Blair, H.D.; Nicholson, J.M. [Ford Motor Co., Dearborn, MI (United States); Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)


    The suitability of various metallic printed wiring board surface finishes was assessed for new technology applications that incorporate assembly with Lead-free solders. The manufacture of a lead-free product necessitates elimination of lead (Pb) from the solder, the circuit board as well as the component lead termination. It is critical however for the selected interconnect Pb-free solder and the corresponding printed wiring board (PWB) and component lead finishes to be mutually compatible. Baseline compatibility of select Pb-free solders with Pb containing PWB surface finish and components was assessed. This was followed by examining the compatibility of the commercially available CASTIN{trademark} (SnAgCuSb) Pb-free solder with a series of PWB metallic finishes: Ni/Au, Ni/Pd, and Pd/Cu. The compatibility was assessed with respect to assembly performance, solder joint integrity and long term attachment reliability. Solder joint integrity and mechanical behavior of representative 50 mil pitch 20I/O SOICs was determined before and after thermal stress. Mechanical pull test studies demonstrated that the strength of SnAgCuSb solder interconnections is notably greater than that of SnPb interconnections.

  11. Wettability study of lead free solder paste and its effect towards multiple reflow

    Idris Siti Rabiatull Aisha


    Full Text Available Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder paste. Therefore, this study is used to evaluate the wettability of two different types of no-clean flux onto copper substrate. Besides, its effect towards multiple reflow was also studied. Reflow soldering was conducted for both types of solder paste that contained different type of no-clean flux for up to double reflow. Two different reflow profile was used. The results showed that the Flux A exhibit better soldering performance after first and second reflow soldering. In addition, type of intermetallic compound (IMC found after first reflow remain the same even after second reflow which was Cu-Sn based. This is shows that Flux A manage to control the diffusion process which will finally leads to a better solder joint performance. Nevertheless, mechanical testing should be carried out in order to evaluate the solder joint strength.

  12. A call center primer.

    Durr, W


    Call centers are strategically and tactically important to many industries, including the healthcare industry. Call centers play a key role in acquiring and retaining customers. The ability to deliver high-quality and timely customer service without much expense is the basis for the proliferation and expansion of call centers. Call centers are unique blends of people and technology, where performance indicates combining appropriate technology tools with sound management practices built on key operational data. While the technology is fascinating, the people working in call centers and the skill of the management team ultimately make a difference to their companies.

  13. Science Targets in the Landing Ellipse and Lower Mound at the Gale Crater Field Site

    Anderson, R. B.; Bell, J. F.


    The Mars Science Laboratory (MSL) rover Curiosity will land at the ~155 km diameter Gale Crater (4.6°S 137.2°E) in early August of 2012. The landing ellipse is centered in the northwestern floor of the crater on an alluvial fan composed of material from the crater rim. MSL will sample this material and test the hypothesis that the fan was deposited by flowing liquid water, and then drive south toward the base of the >5km tall central mound of layered rocks. Along this traverse, the smooth, low-thermal-inertia surface of the alluvial fan transitions to a fractured, layered, and spectrally neutral high thermal inertia unit. MSL will be able to assess the interpretation of this unit as cemented alluvial material and determine the cementing agent. Fresh craters in the high thermal inertia unit are important targets for MSL because their ejecta has had less exposure to the harsh radiation environment of the surface which can destroy biomarkers. Continuing south, MSL will descend across a short scarp where the units of the crater floor have eroded to expose the underlying basal unit of the mound. This erosion has formed ridged mesas interpreted to be lithified aeolian bedforms that are part of a widespread "mound-skirting" unit. MSL will test the hypothesis that this unit comprises debris shed from the mound during an early stage of erosion. The heavily fractured basal unit is partially obscured by relatively young mafic dunes, which will provide information about modern aeolian processes on Mars. After analyzing the basal unit and the dunes, MSL will begin climbing the layered rocks of the mound, beginning with a light-toned ridge which shows spectral evidence of hydrated sulfates. Beyond this ridge, the rover will encounter a phyllosilicate-bearing surface exposed in a trough paralleling the ridge. These lower mound layers are the primary targets of the MSL traverse. MSL will test the hypothesis that the lower mound sediments were deposited in a lacustrine setting

  14. Complex of automated equipment and technologies for waveguides soldering using induction heating

    Murygin, A. V.; Tynchenko, V. S.; Laptenok, V. D.; Emilova, O. A.; Bocharov, A. N.


    The article deals with the problem of designing complex automated equipment for soldering waveguides based on induction heating technology. A theoretical analysis of the problem, allowing to form a model of the «inductor-waveguide» system and to carry out studies to determine the form of inducing wire, creating a narrow and concentrated heat zone in the area of the solder joint. Also solves the problem of the choice of the temperature control means, the information from which is used later to generate the effective management of induction soldering process. Designed hardware complex in conjunction with the developed software system is a system of automatic control, allowing to manage the process of induction heating, to prevent overheating and destruction of the soldered products, improve the stability of induction soldering process, to improve the quality of products, thereby reducing time and material costs for the production.

  15. Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective

    Zeng, Kejun; Pierce, Mike; Miyazaki, Hiroshi; Holdford, Becky


    To obtain the desired performance of Pb-free packages in mechanical tests, while the solder composition should be carefully selected, the influence of metals dissolved from the soldering pad or under bump metallization (UBM) should also be taken into account. Dissolved metals such as Cu can alter the intermetallic compound (IMC) formation, not only at the local interface but also on the other side of the joint. The high rate of interfacial cracking of Sn-Ag-Cu solder joints on Ni/Au-plated pads is attributed to the high stiffness of the solder and the dual IMC structure of (Cu,Ni)6Sn5 on Ni3Sn4 at the interface. Approaches to avoid this dual IMC structure at the interface are discussed. A rule for selecting the solder alloy composition and the pad surface materials on both sides of the joints is proposed for ball grid array (BGA) packages.

  16. Tensile properties and thermal shock reliability of Sn-Ag-Cu solder joint with indium addition.

    Yu, A-Mi; Jang, Jae-Won; Lee, Jong-Hyun; Kim, Jun-Ki; Kim, Mok-Soon


    The thermal shock reliability and tensile properties of a newly developed quaternary Sn-1.2Ag-0.5Cu-0.4In (wt%) solder alloy were investigated and compared to those of ternary Sn-Ag-Cu based Pb-free solder alloys. It was revealed that the Sn-1.2Ag-0.5Cu-0.4In solder alloy shows better thermal shock reliability compared to the Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu solder alloys. The quaternary alloy has higher strength than Sn-1.0Ag-0.5Cu alloy, and higher elongation than Sn-3.0Ag-0.5Cu alloy. It was also revealed that the addition of indium promotes the formation of Ag3(Sn, In) phase in the solder joint during reflow process.

  17. Properties and Microstructures of Sn-Bi-X Lead-Free Solders

    Fan Yang


    Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

  18. Carbonate mound reservoirs in the paradox formation: An outcrop analogue along the San Juan River, Southeastern Utah

    Chidsey, T. C. Jr.; Morgan, C.D. [Utah Geological Survey, Salt Lake City, UT (United States); Eby, D.E. [Eby Petrography & Consulting, Inc., Littleton, CO (United States)] [and others


    Carbonate mound reservoirs within the Pennsylvanian (Desmoinesian) Paradox Formation are major producers of oil and gas in the Paradox basin of Utah, Colorado, and Arizona. Outcrops of the Paradox Formation along the San Juan River of southeastern Utah provide small-scale analogues of reservoir heterogeneity, flow barriers and baffles, lithofacies, and geometry. These characteristics can be used in reservoir simulation models for secondary/tertiary recovery of oil from small fields in the basin. Exposures of the Paradox Formation Ismay zone in the Wild Horse Canyon area display lateral facies changes from phylloid algal mounds to off-mound detrital wedges or fans bounded at the top by a flooding surface. The phylloid mounds are composed of bafflestone, skeletal grainstone, packstone, and cementstone. Algal plates, brachiopods, bryozoans, and rugose corals are commonly found in the phylloid mounds. The mound wall is composed of rudstone, lumpstone, and cementstone. The detrital fan consists of transported algal material, grainstone, and mudstone with open-marine fossils. Within the mound complex is an inter-mound trough tentatively interpreted to be a tidal channel. The geometry and composition of the rocks in the trough significantly add to the overall heterogeneity of the mound. Reservoir models are being developed for possible water- and carbon-dioxide floods of small Paradox basin fields to determine the most effective secondary/tertiary recovery method. The models will include lithologic fabrics, flooding surfaces, and inter-mound troughs, based on the mound complex exposed at Wild Horse Canyon. This project may also provide reservoir information for simulation models in small Paleozoic carbonate mound fields in other basins worldwide.

  19. Paleoenvironmental reconstruction of deep-water carbonate mound initiation in the Porcupine Seabight, NE Atlantic

    Raddatz, J.; Rüggeberg, A.; Liebetrau, V.; Margreth, S.; Eisenhauer, A.; Dullo, C.


    The understanding of the paleoenvironment during initiation and early development of deep-water carbonate mounds in the NE Atlantic is still under debate. The Integrated Ocean Drilling Program Expedition 307 sailed in 2005 to the Porcupine Seabight in order to investigate for the first time sediments from the base of a giant carbonate mound (155 m, Challenger Mound). First results indicate initiation and start-up phase of this carbonate mound coincides with the beginning of the Northern Hemisphere Glaciation (NHG) at around 2.7 Ma. Further carbonate mound development seems to be strongly dependent on rapid changes in paleoceanographic and climatic conditions at the Pliocene-Pleistocene boundary, especially characterized and caused by intermediate water masses. To investigate this specific time interval of ~2.7 Ma we use well-developed proxies such as δ18O and δ13C of planktonic (Globigerina bulloides) and a collection of benthic foraminifera (Fontbotia wuellerstorfi, Discanomalina coronata, Lobatula lobatula, Lobatula antartica, and Planulina ariminensis) as well as grain size analysis. Additionally we provide δ88/86Sr paleotemperatures from cold water coral Lophelia pertusa. This multi proxy approach made it possible to determine the paleoenvironmental and paleoecological setting favourable for the initial coral colonization. Stable oxygen and carbon isotope records of the benthic foraminiferal assemblages indicate that Lobatula lobatula provides a reliable isotopic signature for paleoenvironmental reconstructions and that enhanced bottom currents of intermediate water masses of southern origin (Mediterranean, Bay of Biscay) intensified at the start-up of the NHG. During initiation and early mound development, temperatures of these intermediate waters decreased to favourable 9 °C and reconstructed current strength and nutrient concentrations (phosphate and nitrate) stayed in the range of reported tolerance supporting the rapid growth of cold-water corals and

  20. Study on Sn-Zn Solder Used in Cu-Al Soldering%用于铜铝焊接的锡锌焊料研究

    倪广春; 张浩; 韩敏


    Lead-free electronic products led the development of lead-free solder technology. Taking cost factors into account, some copper material has been replaced by aluminum material. When ordinary Sn-Cu and Sn-Ag-Cu solder are used in soldering of Cu-Al, there is the electrochemical corrosion problems. So Sn-Zn solder is used for Cu-Al soldering. However, the joints of Sn-Zn solder are brittle and easy to crack. Focus on problems in Cu-Al soldering joint of electrical and electronic devices, put forward Sn-Zn-X alloy soldering materials, did a large number of experiments, and achieved good results.%电子产品无铅化的推广带动了无铅焊料技术的发展,考虑到成本因素,部分铜材已被铝材取代。普通的锡铜系和锡银铜系焊料在铜铝焊接时,存在电化学腐蚀问题,因此多用锡锌焊料进行焊接。但锡锌焊料的焊点脆,存在易开裂的问题。针对电工电子器件铜铝焊接点存在的问题,提出了Sn一Zn一X多元合金焊接材料,并做了大量实验,取得很好的效果。

  1. Physical properties of lead free solders in liquid and solid state

    Mhiaoui, Souad


    The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

  2. A photographic and acoustic transect across two deep-water seafloor mounds, Mississippi Canyon, northern Gulf of Mexico

    Hart, P.E.; Hutchinson, D.R.; Gardner, J.; Carney, R.S.; Fornari, D.


    In the northern Gulf of Mexico, a series of seafloor mounds lie along the floor of the Mississippi Canyon in Atwater Valley lease blocks 13 and 14. The mounds, one of which was drilled by the Chevron Joint Industry Project on Methane Hydrates in 2005, are interpreted to be vent-related features that may contain significant accumulations of gas hydrate adjacent to gas and fluid migration pathways. The mounds are located ???150 km south of Louisiana at ???1300 m water depth. New side-scan sonar data, multibeam bathymetry, and near-bottom photography along a 4 km northwest-southeast transect crossing two of the mounds (labeled D and F) reveal the mounds' detailed morphology and surficial characteristics. Mound D, ???250 m in diameter and 7-10 m in height, has exposures of authigenic carbonates and appears to result from a seafloor vent of slow-to-moderate flux. Mound F, which is ???400 m in diameter and 10-15 m high, is covered on its southwest flank by extruded mud flows, a characteristic associated with moderate-to-rapid flux. Chemosynthetic communities visible on the bottom photographs are restricted to bacterial mats on both mounds and mussels at Mound D. No indications of surficial gas hydrates are evident on the bottom photographs.

  3. Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

    Kostandyan, Erik; Sørensen, John Dalsgaard


    on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods are useful to predict damage values for solder joint in power electrical components. Based on the proposed methods it is described how to find the damage level for a given temperature loading profile....... The proposed methods are discussed for application in reliability assessment of Wind Turbine’s electrical components considering physical, model and measurement uncertainties. For further research it is proposed to evaluate damage criteria for electrical components due to the operational temperature...

  4. Pb-free Sn-Ag-Cu ternary eutectic solder

    Anderson, I.E.; Yost, F.G.; Smith, J.F.; Miller, C.M.; Terpstra, R.L.


    A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217 C and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid ``mushy`` zone) relative to the eutectic melting temperature (e.g. up to 15 C above the eutectic melting temperature). 5 figs.

  5. Seepage carbonate mounds in Cenozoic sedimentary sequences from the Las Minas Basin, SE Spain

    Pozo, M.; Calvo, J. P.; Scopelliti, G.; González-Acebrón, L.


    A number of carbonate mounds composed of indurate, strongly folded and/or brecciated calcite and dolomite beds occur interstratified in Cenozoic sedimentary sequences from the Las Minas Basin. Part of the fabric of the rock forming the carbonate mounds is composed of laminated to banded dolostone similar to the host rock but showing contrasted lithification. Moreover, the carbonate deposits of the mounds display aggrading neomorphism of dolomite, partial replacement of dolomite by calcite, calcite cementation, and extensive silicification, locally resulting in box-work fabric. Eight main lithofacies were distinguished in the carbonate mound deposits. In some lithofacies, chert is present as both microcrystalline to fibro-radial quartz and opal, the latter occurring mainly as cement whereas the former replace the carbonate and infill voids. Yet one of the carbonate mounds shows distinctive petrography and geochemical features thus suggesting a distinctive growth pattern. The carbon isotope compositions of calcite from the mound samples range from - 11.56 to - 5.15 δ‰ whilst dolomite is depleted in 13C, with values of - 12.38 to 3.02 δ‰. Oxygen isotopic compositions vary from - 9.42 to - 4.64 δ‰ for calcite and between - 6.68 and 8.19 δ‰ for dolomite. Carbonate in the mounds shows significant enrichment in Co, Cr, Ni and Pb content, especially in the strongly deformed (F-2-2 lithofacies) and brecciated carbonate (F-4). The carbonate deposits show depletion in REE and Y in contrast to that determined in lutite. The formation of the carbonate mounds was related to local artesian seepage thermal water flows of moderate to relative high temperatures. Pressure differences between the low permeability host rock and the circulating fluids accounted for dilational fracturing and brecciation of the host sediment packages, which combined with precipitation of new carbonate and silica mineral phases. Locally, some carbonate mounds developed where groundwater

  6. Evaluation of call options



    The European and American call options,for which the prices of their underlying asset follow compound Poisson process,are evaluated by a probability method.Formulas that can be used to evaluate the options are obtained,which include not only the elements of an option:the price of the call option,the exercise price and the expiration date,but also the riskless interest rate,nevertheless exclude the volatility of the underlying asset.In practice,the evaluated results obtained by these formulas can proved references of making strategic decision for an investor who buys the call option and a company who sells the call option.

  7. Distribution and density of Cubitermes Wasmann (Isoptera: Termitidae mounds in the northern Kruger National Park

    V.W. Meyer


    Full Text Available This paper provides fundamental information on distribution and density of the genus Cubitermes, Wasm. quantified for future monitoring. After distribution trends have been established, changes in Cubitermes density over time can be brought into contention with other factors in the Kruger National Park, such as the impact of fire frequency, water distribution, and elephant density on these insects. At least ten 2 ha belt-transects were undertaken in each of the 20 northern landscape zones of the KNP. Termite mounds were recorded and their activity within was determined. Cubitermes accounts for 29.8% of all active termite mounds in the northern KNP, with an average density of 0.33 mounds/ha. Cubitermes favours the Nwambiya Sandveld (zone 32. These termites occur in high density in the Klipkoppies 1 land type (Gorge, but in low densities in the Phalaborwa 10-12, Bulweni 1-3, Letaba 1-7 and Pafuri 3-6 land types. Cubitermes mounds tend to occur in high numbers on the Nzhelele formation (Mn (sandstones; quartzite; basalt. Mounds of this genus in the Far North are highly concentrated on the Gaudam and Moriah soil series of the Hutton form, suggesting that these termites prefer very sandy soils with medium to coarse particles.

  8. Environmental assessment and planning at Mound - environmental monitoring capabilities and personnel profiles



    Through its long experience with radioactive materials, Mound has developed a comprehensive, routine, offsite, environmental surveillance program to safeguard its employees, the physical plant, and the integrity of the surrounding environment from any potential adverse effects of its widely diverse operations. Effluent samples are analyzed for radiological and non-radiological parameters. The environment surrounding Mound Facility is continuously monitored - air, water, foodstuffs, vegetation, soil, and silt samples are analyzed to ensure that radioisotopic concentrations and other possible pollutants are well within the stringent standards adopted by the Department of Energy, the Environmental Protection Agencies (both federal and state), and various regional and local agencies. Moreover, this environmental surveillance program has been designed to ensure that the facility is designed, constructed, managed, operated, and maintained in a manner that continues to meet all federal, state, and local standards for environmental protection. Work in environmental science has been broadened to assess environmental factors associated with various aspects of the National Energy Plan. Both the management and staff at Mound have undertaken a firm commitment to make Mound`s environmental monitoring capabilities available to agencies that have the responsibility for the resolution of important environmental issues.

  9. [Spatial correlation of active mounds locative distribution of Solenopsis invicta Buren polygyne populations].

    Lu, Yong-yue; Li, Ning-dong; Liang, Guang-wen; Zeng, Ling


    By using geostatistic method, this paper studied the spatial distribution patterns of the active mounds of Solenopsis invicta Buren polygyne populations in Wuchuan and Shenzhen, and built up the spherical models of the interval distances and semivariances of the mounds. The semivariograms were described at the two directions of east-west and south-north, which were obviously positively correlated to the interval distances, revealing that the active mounds in locative area were space-dependent. The ranges of the 5 spherical models constructed for 5 sampling plots in Wuchuan were 9.1 m, 7.6 m, 23.5 m, 7.5 m and 14.5 m, respectively, with an average of 12.4 m. The mounds of any two plots in this range were significantly correlated. There was a randomicity in the spatial distribution of active mounds, and the randomicity index (Nugget/Sill) was 0.7034, 0.9247, 0.4398, 1.1196 and 0.4624, respectively. In Shenzhen, the relationships between the interval distances and semivariances were described by 7 spherical models, and the ranges were 14.5 m, 11.2 m, 10.8 m, 17.6 m, 11.3 m, 9.9 m and 12.8 m, respectively, with an average of 12.6 m.

  10. Structure of a carbonate/hydrate mound in the northern Gulf of Mexico

    McGee, T.; Woolsey, J.; Macelloni, L. [Mississippi Univ., Oxford, MI (United States). Center for Marine Resources and Environmental Technology; Lapham, L. [Florida State Univ., Tallahassee, FL (United States); Kleinberg, R. [Schlumberger-Doll Research, Cambridge, MA (United States); Battista, B.; Knapp, C. [South Carolina Univ., Columbia, SC (United States); Caruso, S. [Univ. of Rome La Sapienza, Rome, (Italy). Dept. of Geological Sciences; Goebel, V. [Lookout Geophysical Co., Palisade, CO (United States); Chapman, R. [Victoria Univ., BC (Canada). School of Earth and Ocean Sciences; Gerstoft, P. [California Univ., San Diego, CA (United States). Marine Physical Laboratory


    A one-kilometer-diameter carbonate/hydrate mound located in the south-central portion of Mississippi Canyon block 118 in the Gulf of Mexico was the site of a multi-sensor, multi-discipline sea-floor observatory. In preparation for installing the observatory, several surveys were conducted. The resulting data provided detailed information about the mound's structure. This paper discussed the structure of the carbonate/hydrate mound in the Gulf of Mexico. The paper described the surface morphology of the mound, which was imaged by multi-beam bathymetric sonar from an autonomous underwater vehicle (AUV) 40 metres above the sea floor as well as by cameras at or a few meters above the sea floor deployed from drifting surface vessels or tethered submersibles. Visual observations were also made from manned submersibles. The paper also discussed the collection of gravity and box cores for lithologic and bio-geochemical studies. Gas sampling, venting activity, and seismo-acoustic studies were also presented. The internal structure of the mound was described as well. It was concluded that pore-fluid analyses conducted on the cores revealed that microbial sulfate reduction, anaerobic methane oxidation, and methanogenesis were important processes in the upper sediment as they controlled the diffusive flux of methane into the overlying water column. The activity of microbes was also focused within patches near active vents. 10 refs., 10 figs.

  11. Imaging and Analysis of Void-defects in Solder Joints Formed in Reduced Gravity using High-Resolution Computed Tomography

    Easton, John W.; Struk, Peter M.; Rotella, Anthony


    As a part of efforts to develop an electronics repair capability for long duration space missions, techniques and materials for soldering components on a circuit board in reduced gravity must be developed. This paper presents results from testing solder joint formation in low gravity on a NASA Reduced Gravity Research Aircraft. The results presented include joints formed using eutectic tin-lead solder and one of the following fluxes: (1) a no-clean flux core, (2) a rosin flux core, and (3) a solid solder wire with external liquid no-clean flux. The solder joints are analyzed with a computed tomography (CT) technique which imaged the interior of the entire solder joint. This replaced an earlier technique that required the solder joint to be destructively ground down revealing a single plane which was subsequently analyzed. The CT analysis technique is described and results presented with implications for future testing as well as implications for the overall electronics repair effort discussed.

  12. Anthropogenic relief features in tropical northern Australia: a physical and chemical analysis of the Weipa shell mounds

    Fanning, Patricia; Holdaway, Simon; Allely, Kasey; Larsen, Bernie; Petchey, Fiona


    Large mounded deposits of shell are prominent archaeological features across much of the north Australian tropical coast. Many of the shell mounds are composed almost entirely of the bivalve Anadara granosa (Linnaeus 1758), a food source for Aboriginal people in the past. They are identified in the field by their distinct mounded topographic form and the unique vegetation community growing on them. A relatively long history of inquiry into the nature and significance of the shell mounds has focused primarily on analysing the shell component as clues to Australian Aboriginal coastal economies in the past. This paper presents results of new analyses on the non-shell sediments of mounds located near Weipa in far north Queensland, examining the physical and chemical signatures of depositional and post-depositional processes with a view to obtaining insights into how the mounds formed and for what purposes, and how their morphology, structure and content may have changed since they ceased accumulating. We also consider how such changes might relate to past and present environmental conditions. The mounds we studied are primarily located on topographic high points, such as cliffs, hillslopes and beach ridges, though a proportion are located on estuarine floodplains at low elevations. Terrestrial Laser Scanning (TLS) of a sample of 51 shell mounds demonstrates substantial variation in mound size and shape, and suggests patterning in mound form related to age as well as position on the landscape. However, radiocarbon chronologies demonstrate that the mounds do not conform to a model of linear formation of a shell deposit, suggesting mound histories are variable in both the nature of shell deposition as well as post-depositional processes. Soil physical and chemical analyses indicate that post-depositional diagenetic alteration has strongly influenced the present day composition and form of the shell mounds, in particular the accession of carbon and silica to the mounds by

  13. Callings and Organizational Behavior

    Elangovan, A. R.; Pinder, Craig C.; McLean, Murdith


    Current literature on careers, social identity and meaning in work tends to understate the multiplicity, historical significance, and nuances of the concept of calling(s). In this article, we trace the evolution of the concept from its religious roots into secular realms and develop a typology of interpretations using occupation and religious…

  14. Dimensioning large call centers

    S.C. Borst (Sem); A. Mandelbaum; M.I. Reiman


    textabstractWe develop a framework for asymptotic optimization of a queueing system. The motivation is the staffing problem of call centers with 100's of agents (or more). Such a call center is modeled as an M/M/N queue, where the number of agents~$N$ is large. Within our framework, we determine the

  15. Callings and Organizational Behavior

    Elangovan, A. R.; Pinder, Craig C.; McLean, Murdith


    Current literature on careers, social identity and meaning in work tends to understate the multiplicity, historical significance, and nuances of the concept of calling(s). In this article, we trace the evolution of the concept from its religious roots into secular realms and develop a typology of interpretations using occupation and religious…

  16. Making telephone calls



    @@ 1.常见用语 a.请找某人接电话 Hello!May/Could/Can I speak to…,please? b.问对方是不是某人 Is that…(speaking)? c.问对方是谁 1)Who's speaking(calling)? 2)Who's that(speaking/calling)?

  17. Laser ablative fluxless soldering (LAFS): 60Sn-40Pb solder wettability tests on laser cleaned OFHC copper substrates

    Peebles, H. C.; Keicher, D. M.; Hosking, F. M.; Hlava, P. F.; Creager, N. A.


    OFHC copper substrates, cleaned by laser ablation under argon and helium gas, were tested for solder wettability by 60Sn-40Pb using an area-of-spread method. The wettability of copper surfaces cleaned under both argon and helium gas was found to equal or exceed the wettability obtained on this surface in air using a standard RMA flux. The area of spread on copper substrates cleaned under helium was eight times larger than the area of spread of substrates cleaned under argon. The enhanced spreading observed on the substrates cleaned under helium gas was found to be due to surface roughness. 11 refs., 8 figs., 2 tabs.

  18. Detection of micro solder balls using active thermography and probabilistic neural network

    He, Zhenzhi; Wei, Li; Shao, Minghui; Lu, Xingning


    Micro solder ball/bump has been widely used in electronic packaging. It has been challenging to inspect these structures as the solder balls/bumps are often embedded between the component and substrates, especially in flip-chip packaging. In this paper, a detection method for micro solder ball/bump based on the active thermography and the probabilistic neural network is investigated. A VH680 infrared imager is used to capture the thermal image of the test vehicle, SFA10 packages. The temperature curves are processed using moving average technique to remove the peak noise. And the principal component analysis (PCA) is adopted to reconstruct the thermal images. The missed solder balls can be recognized explicitly in the second principal component image. Probabilistic neural network (PNN) is then established to identify the defective bump intelligently. The hot spots corresponding to the solder balls are segmented from the PCA reconstructed image, and statistic parameters are calculated. To characterize the thermal properties of solder bump quantitatively, three representative features are selected and used as the input vector in PNN clustering. The results show that the actual outputs and the expected outputs are consistent in identification of the missed solder balls, and all the bumps were recognized accurately, which demonstrates the viability of the PNN in effective defect inspection in high-density microelectronic packaging.

  19. Enhanced laser tissue soldering using indocyanine green chromophore and gold nanoshells combination.

    Khosroshahi, Mohammad E; Nourbakhsh, Mohammad S


    Gold nanoshells (GNs) are new materials that have an optical response dictated by the plasmon resonance. The wavelength at which the resonance occurs depends on the core and shell sizes. The purposes of this study were to use the combination of indocyanine green (ICG) and different concentration of gold nanoshells for skin tissue soldering and also to examine the effect of laser soldering parameters on the properties of repaired skin. Two mixtures of albumin solder and different combinations of ICG and gold nanoshells were prepared. A full thickness incision of 2 × 20 mm(2) was made on the surface and after addition of mixtures it was irradiated by an 810 nm diode laser at different power densities. The changes of tensile strength (σ(t)) due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. The results showed at constant laser power density (I), σ(t) of repaired incisions increases by increasing the concentration of gold nanoshells in solder, Ns, and decreasing Vs. It was demonstrated that laser soldering using combination of ICG + GNs could be practical provided the optothermal properties of the tissue are carefully optimized. Also, the tensile strength of soldered skin is higher than skins that soldered with only ICG or GNs. In our case, this corresponds to σ(t) = 1800 g cm(-2) at I ∼ 47 Wcm(-2), T ∼ 85 [ordinal indicator, masculine]C, Ns = 10, and Vs = 0.3 mms(-1).

  20. A microstructural study of creep and thermal fatigue deformation in 60Sn-40Pb solder joints

    Tribula, D.


    Thermal fatigue failures of solder joints in electronic devices often arise from cyclic shear strains imposed by the mismatched thermal expansion coefficients of the materials that bind the joint as temperature changes are encountered. Increased solder joint reliability demands a fundamental understanding of the metallurigical mechanisms that control the fatigue to design accurate accelerated probative tests and new, more fatigue resistant solder alloys. The high temperatures and slow strain rates that pertain to thermal fatigue imply that creep is an important deformation mode in the thermal fatigue cycle. In this work, the creep behaviour of a solder joint is studied to determine the solder's microstructural response to this type of deformation and to relate this to the more complex problem of thermal fatigue. It is shown that creep failures arise from the inherent inhomogeneity and instability of the solder microstructure and suggest that small compositional changes of the binary near-eutectic Pn-Sn alloy may defeat the observed failure mechanisms. This work presents creep and thermal fatigue data for several near-eutectic Pb-Sn solder compositions and concludes that a 58Sn-40Pb-2In and a 58Sn-40Pb-2Cd alloy show significantly enhanced fatigue resistance over that of the simple binary material. 80 refs., 33 figs., 1 tab.

  1. Evaluation of Scattered Wave and Stress Concentration Field in a Damaged Solder Joint

    Dineva, P.; Gross, D.; Rangelov, T.


    Two different, but equally important problems for solder joint reliability are solved. The evaluation of the dynamic stress concentration field in the thin base layer of a damaged solder joint is the first one. It is considered as a rectangular plate with a central macro-crack surrounded with randomly distributed micro-cracks, subjected to uniform time-harmonic tension. The damaged solder joint state is described by the model of Gross and Zhang [1] (International Journal of Solids and Structures29, 1763-1779). The information of the stress concentration field in a damaged solder joint is important to understand the mechanisms in the base components of all electronic packages.The second problem is ultrasonic wave scattering in a solder joint damaged by micro-cracks, considered as a two-dimensional finite multi-layered system. The solution of this problem may aid the creation of the modern non-destructive evaluation method (NDEM) for a high quality control of products in electronic industry.The method of the solution of both boundary-value problems is a direct BIEM (boundary integral equation method). The numerical results obtained for a solder joint with real geometry and physical properties show how the acoustic and stress concentration fields depend on the solder joint damage state. The character of this dependence is discussed.

  2. Innovative Seawalls and Rubble Mound Breakwater Design for Wave Energy Conversion

    Vicinanza, Diego; Contestabile, P.; Ferrante, V.


    research has shown that they can also enhance the protective roll of coastal structures such as rubble mound breakwaters and vertical seawalls. Such WECs can in theory provide sufficient energy to partly cover the needs of small communities and although retrofitting solutions for vertical seawalls have...... been proposed no solution is yet available for rubble mound structures. A following this an overview of previous research efforts is reported here along with an ongoing experimental effort aiming on the development and optimisation of a retrofitting solution for rubble mound breakwaters. It is envisage...... that such a structure will convert wave energy to electricity and in the same time it will reduce run-up and overtopping....

  3. Distribution and physical traits of red wood ant mounds in a managed Rhodope mountains forest.

    Tsikas, Angelos; Karanikola, Paraskevi; Papageorgiou, Aristotelis C


    Red wood ants (RWA) are of great ecological importance for the forest ecosystem. Forestry practices, like clear-cutting, and trampling load, due to tourism, logging, and grazing stock, can greatly affect their colonies, disturbing their microhabitat. RWA in Greek forests have not been investigated so far. We herein report on the distribution and morphological traits of Formica lugubris mounds studied in Elatia forest (Rhodope mountains, Northern Greece), an all-aged managed mixed forest where selective logging practices are performed. Nearby vegetation, slope, canopy cover, shrub density, and distance from the nearest neighboring trees were also recorded. Mound density was shown to be much higher in this Greek forest compared to RWA mounds in other European-managed forests. Furthermore, we recorded a continuous nest establishment, despite forest management disturbances and trampling load. Our study suggests that single-tree selective forestry practices are essential for creating ideal microhabitats for the RWA and, therefore, for maintaining RWA populations.

  4. Wettability Studies of Pb-Free Soldering Materials

    Moser, Z.; Gąsior, W.; Pstruś, J.; Dębski, A.


    For Pb-free soldering materials, two main substitutes are currently being considered, consisting of Sn-Ag and Sn-Ag-Cu eutectics, both with melting points higher than that of the Sn-Pb eutectic. Therefore, both will require higher soldering temperatures for industrial applications. Also, both eutectics have a higher surface tension than the Sn-Pb eutectic, requiring wettability studies on adding Bi, Sb, and In to the eutectics to decrease the melting points and surface tension. The experimental results for the surface tension were compared with thermodynamic modeling by Butler’s method and were used to create the SURDAT database, which also includes densities for pure metals, binary, ternary, quaternary, and quinary alloys. To model the surface tension, excess Gibbs energies of the molten components were taken from the ADAMIS database. For the case of the Ag-Sn system, enthalpies of formation of Ag3Sn from solution calorimetry were used for checking optimized thermodynamic parameters. In the study of Sn-Ag-Cu-Bi-Sb liquid alloys, the range of possible Bi compositions for practical applications has been used to formulate a generalized metric of wettability, which was checked by measurements of the influence of In on the Sn-Ag-Cu system.

  5. Effect of contact metallization on electromigration reliability of Pb-free solder joints

    Ding, Min; Wang, Guotao; Chao, Brook; Ho, Paul S.; Su, Peng; Uehling, Trent


    The effect of underbump metallization (UBM) on electromigration (EM) lifetime and failure mechanism has been investigated for Pb-free solder bumps of 97Sn3Ag composition in the temperature range of 110-155 °C. The EM lifetime of the SnAg Pb-free solders with either Cu or Ni UBM was found to be better than the eutectic SnPb (63Sn37Pb) solders but worse than high-Pb (95Pb5Sn) solders. In the test temperature range, the EM lifetimes were found to be comparable for Cu and Ni UBMs but with different activation energies: 0.64-0.72 eV for Cu UBM and 1.03-1.11 eV for Ni UBM. EM failure was observed only in solder bumps with electron current flow from UBM to the substrate. Failure analysis revealed that EM damage was initiated by the formation of intermetallic compounds (IMC) at the UBM/solder interface which was found to be significantly enhanced by mass transport driven by the electron current. Under EM, the continued growth of IMC with the dissolution of the UBM and the accumulation of Kirkendall voids resulted in the formation of interfacial cracks and eventual EM failure of the solder bump. For Ni UBM, the IMC formation was dominated by the Ni3Sn4 phase while for Cu UBM, a bilayer of Cu3Sn/Cu6Sn5 was found. Void formation at the Cu6Sn5/solder interface was found to be important in controlling the EM lifetime of the Cu UBM solder.

  6. Analysis of cavern stability at the Bryan Mound SPR site.

    Ehgartner, Brian L.; Sobolik, Steven Ronald


    This report presents computational analyses that simulate the structural response of caverns at the Strategic Petroleum Reserve Bryan Mound site. The cavern field comprises 20 caverns. Five caverns (1, 2, 4, and 5; 3 was later plugged and abandoned) were acquired from industry and have unusual shapes and a history dating back to 1946. The other 16 caverns (101-116) were leached according to SPR standards in the mid-1980s and have tall cylindrical shapes. The history of the caverns and their shapes are simulated in a 3-D geomechanics model of the site that predicts deformations, strains, and stresses. Future leaching scenarios due to oil drawdowns using fresh water are also simulated by increasing the volume of the caverns. Cavern pressures are varied in the model to capture operational practices in the field. The results of the finite element model are interpreted to provide information on the current and future status of subsidence, well integrity, and cavern stability. The most significant result in this report is relevant to caverns 1, 2, and 5. The caverns have non-cylindrical shapes and have potential regions where the surrounding salt may be damaged during workover procedures. During a workover the normal cavern operating pressure is lowered to service a well. At this point the wellhead pressures are atmospheric. When the workover is complete, the cavern is repressurized. The resulting elastic stresses are sufficient to cause tension and large deviatoric stresses at several locations. With time, these stresses relax to a compressive state due to salt creep. However, the potential for salt damage and fracturing exists. The analyses predict tensile stresses at locations with sharp-edges in the wall geometry, or in the case of cavern 5, in the neck region between the upper and lower lobes of the cavern. The effects do not appear to be large-scale, however, so the only major impact is the potential for stress-induced salt falls in cavern 5, potentially leading to

  7. Sedimentation patterns on a cold-water coral mound off Mauritania

    Eisele, Markus; Frank, Norbert; Wienberg, Claudia; Titschack, Jürgen; Mienis, Furu; Beuck, Lydia; Tisnerat-Laborde, Nadine; Hebbeln, Dierk


    An unconformity-bound glacial sequence (135 cm thick) of a coral-bearing sediment core collected from the flank of a cold-water coral mound in the Banda Mound Province off Mauritania was analysed. In order to study the relation between coral framework growth and its filling by hemipelagic sediments, U-series dates obtained from the cold-water coral species Lophelia pertusa were compared to 14C dates of planktonic foraminifera of the surrounding matrix sediments. The coral ages, ranging from 45.1 to 32.3 ka BP, exhibit no clear depositional trend, while on the other hand the 14C dates of the matrix sediment provide ages within a much narrower time window of <3000 yrs (34.6-31.8 cal ka BP), corresponding to the latest phase of the coral growth period. In addition, high-resolution computer tomography data revealed a subdivision of the investigated sediment package into three distinct parts, defined by the portion and fragmentation of corals and associated macrofauna as well as in the density of the matrix sediments. Grain size spectra obtained on the matrix sediments show a homogeneous pattern throughout the core sediment package, with minor variations. These features are interpreted as indicators of redeposition. Based on the observed structures and the dating results, the sediments were interpreted as deposits of a mass wasting event, namely a debris flow. During this event, the sediment unit must have been entirely mixed; resulting in averaging of the foraminifera ages from the whole unit and giving randomly distributed coral ages. In this context, for the first time mass wasting is proposed to be a substantial process of mound progradation by exporting material from the mound top to the flanks. Hence, it may not only be an erosional feature but also widening the base of the mound, thus allowing further vertical mound growth.

  8. Mounding of a non-Newtonian jet impinging on a solid substrate.

    Schunk, Peter Randall; Grillet, Anne Mary; Roberts, Scott A.; Baer, Thomas A. (Procter & Gamble, Cincinnati, OH); Rao, Rekha Ranjana


    When a fluid jet impinges on a solid substrate, a variety of behaviors may occur around the impact region. One example is mounding, where the fluid enters the impact region faster than it can flow away, forming a mound of fluid above the main surface. For some operating conditions, this mound can destabilize and buckle, entraining air in the mound. Other behaviors include submerging flow, where the jet impinges into an otherwise steady pool of liquid, entraining a thin air layer as it enters the pool. This impact region is one of very high shear rates and as such, complex fluids behave very differently than do Newtonian fluids. In this work, we attempt to characterize this range of behavior for Newtonian and non-Newtonian fluids using dimensionless parameters. We model the fluid as a modified Bingham-Carreau-Yasuda fluid, which exhibits the full range of pseudoplastic flow properties throughout the impact region. Additionally, we study viscoelastic effects through the use of the Giesekus model. Both 2-D and 3-D numerical simulations are performed using a variety of finite element method techniques for tracking the jet interface, including Arbitrary Lagrangian Eulerian (ALE), diffuse level sets, and a conformal decomposition finite element method (CDFEM). The presence of shear-thinning characteristics drastically reduces unstable mounding behavior, yet can lead to air entrainment through the submerging flow regime. We construct an operating map to understand for what flow parameters mounding and submerging flows will occur, and how the fluid rheology affects these behaviors. This study has many implications in high-speed industrial bottle filling applications.

  9. Can mima-like mounds be Vertisol relics (Far North Region of Cameroon, Chad Basin)?

    Diaz, Nathalie; Dietrich, Fabienne; Cailleau, Guillaume; Sebag, David; Ngounou Ngatcha, Benjamin; Verrecchia, Eric P.


    Non-anthropogenic earth mounds, defined as mima-like mounds in this study, have recently been observed in non-carbonate watersheds along the Sudano-Sahelian belt in the Chad Basin. In the Diamare piedmont (northern Cameroon) they are particularly well developed within stream networks. In less eroded areas, they occur as whaleback, flattened morphologies, or even as buried features. All these shapes are composed of clay-rich sediment associated with high proportions of secondary carbonate nodules and Fesbnd Mn micro-nodules. Their soil structure is prismatic to massive and vertical cracks are observed locally. Grain-size distributions emphasize the clay-rich nature of the sediment, with average clay contents of 32% ± 12.8% (n = 186), which is significantly higher than the clay content in the adjacent sediments in the landscape (mean = 10% ± 4%, n = 21). Moreover, high proportions of smectite characterize the soil, with average contents of 34 ± 7% (n = 25). At the micro-scale, the groundmass has a cross-striated b-fabric, with embedded smooth subangular quartz and feldspar grains of the silt-size fraction. All the characteristics point to altered vertic properties in the clay-rich sediment composing the mima-like mounds. Mima-like mounds are thus interpreted as degraded Vertisols. Compared to present-day Vertisols occurring in the piedmont, mima-like mounds are located upstream. It is thus proposed that the Vertisol areas were more extensive during a former and wetter period than the present-day. Subsequent changing climatic conditions increased erosion, revealing the gilgai micro-relief by preferential erosion in micro-lows rather than in micro-highs. Mima-like mounds of the Chad Basin might thus result from pedogenesis combined with later erosion. These local processes can be inherited from regional climatic variations during the Late Pleistocene-Holocene and likely be related to the African Humid Period.

  10. The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

    Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)


    The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

  11. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe


    In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique. PMID:26473871

  12. Life Prediction of Ball Grid Array Soldered Joints under Thermal Cycling Loading by Fracture Mechanics Method


    Fatigue crack propagation life of ball grid array (BGA) soldered joints during thermal cycling loading was investigated by fracture mechanics approach using finite element analysis. The relationships between the strain energy release rate (G) and crack size (α), thermal cycle numbers (N) can be derived. Based on the relationships, fatigue life of the soldered joints was determined. The results showed that crack propagation life was higher than crack initiation life. Therefore, it appears that it is more appropriate to predict the fatigue life of soldered joints using the fracture mechanics method.

  13. Research on defects inspection of solder balls based on eddy current pulsed thermography.

    Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe


    In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  14. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Xiuyun Zhou


    Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  15. Effect of constraint on crack propagation behavior in BGA soldered joints

    王莉; 王国忠; 方洪渊; 钱乙余


    The effects of stress triaxiality on crack propagation behavior in the BGA soldered joint were analyzed using FEM method. The computation results verified that stress triaxiality factor has an important effect on crack growth behavior. Crack growth rate increased with increasing stress triaxiality at the near-tip region, which is caused by increasing crack lengths or decreasing solder joint heights. Solder joint deformation is subjected to constraint effect provided by its surrounding rigid ceramic substrate, the constraint can be scaled by stress triaxiality near crack tip region. Therefore, it can be concluded that crack growth rate increased when the constraint effect increases.

  16. Observations of microstructural coarsening in micro flip-chip solder joints

    Barney, Monica M.; Morris, J. W.


    Coarsening of solder microstructures dramatically affects fatigue lifetimes. This paper presents a study of microstructural evolution due to thermal cycling and aging of small solder joints. The lead-tin solder joints in this study have a height of 55 5 m and a tin content of 65 70 wt.%, with a degenerate eutectic microstructure. The joint microstructure coarsens more rapidly during aging at 160°C than cycling from 0 160°C. No coarsened bands are observed. The cycling data scales with standard coarsening equations, while the aging data fits to an enhanced trend. The joints experiencing 2.8% strain during cycling fail by 1000 cycles.

  17. Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

    Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B


    The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

  18. A cause of the non-solderability of ceramic capacitor terminations

    Cozzolino, M. J.; Kumar, A.; Ewell, G. J.


    The results of an analysis into the cause of the non-solderability of multiple defective part lots from two capacitor manufacturers are described. This analysis consisted of visual, scanning electron microscopic, surface, and metalographic examinations and analyses. The results indicated that non-solderability results from areas of excess porosity in the termination which are caused by segregation of ink constituents during manufacturing. This segregation can be minimized by proper monitoring and control of process variables; where excess porosity does occur, solderability can be improved by proper precleaning of parts.

  19. Wettability study of lead free solder paste and its effect towards multiple reflow

    Idris Siti Rabiatull Aisha; Zuleikha Siti; Abd Malek Zetty Akhtar


    Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder paste. Therefore, this study is used to evaluate the wettability of two different types of no-clean flux onto copper substrate. Besides, its effect towards multiple reflow was also studied. Reflow soldering was conducted for both types of solde...

  20. 75 FR 27783 - Decision To Evaluate a Petition To Designate a Class of Employees From the Mound Site in...


    ... revision as warranted by the evaluation, is as follows: Facility: Mound site. Location: Miamisburg, Ohio... Doc No: 2010-11875] DEPARTMENT OF HEALTH AND HUMAN SERVICES Decision To Evaluate a Petition To... decision to evaluate a petition to designate a class of employees from the Mound site in Miamisburg, Ohio...

  1. 77 FR 59615 - Decision To Evaluate a Petition To Designate a Class of Employees From the Mound Plant in...


    ... warranted by the evaluation, is as follows: Facility: Mound Plant. Location: Miamisburg, Ohio. Job Titles... HUMAN SERVICES Decision To Evaluate a Petition To Designate a Class of Employees From the Mound Plant in... Services. ACTION: Notice. SUMMARY: NIOSH gives notice as required by 42 CFR 83.12(e) of a decision to...

  2. Cold-water coral mounds on the Pen Duick Escarpment, Gulf of Cadiz: The MiCROSYSTEMS project approach

    Van Rooij, D.; Blamart, D.; De Mol, L.; Mienis, F.; Pirlet, H.; Wehrmann, L. M.; Barbieri, R.; Maignien, L.; Templer, S. P.; de Haas, H.; Hebbeln, D.; Frank, N.; Larmagnat, S.; Stadnitskaia, A.; Stivaletta, N.; van Weering, T.; Zhang, Y.; Hamoumi, N.; Cnudde, V.; Duyck, P.; Henriet, J.-P.; The MiCROSYSTEMS MD 169 Shipboard Party


    Here we present a case study of three cold-water coral mounds in a juvenile growth stage on top of the Pen Duick Escarpment in the Gulf of Cadiz; Alpha, Beta and Gamma mounds. Although cold-water corals are a common feature on the adjacent cliffs, mud volcanoes and open slope, no actual living cold-

  3. Subsurface microbiology and biogeochemistry of a deep, cold-water carbonate mound from the Porcupine Seabight (IODP Expedition 307).

    Webster, Gordon; Blazejak, Anna; Cragg, Barry A; Schippers, Axel; Sass, Henrik; Rinna, Joachim; Tang, Xiaohong; Mathes, Falko; Ferdelman, Timothy G; Fry, John C; Weightman, Andrew J; Parkes, R John


    The Porcupine Seabight Challenger Mound is the first carbonate mound to be drilled (approximately 270 m) and analyzed in detail microbiologically and biogeochemically. Two mound sites and a non-mound Reference site were analyzed with a range of molecular techniques [catalyzed reporter deposition-fluorescence in situ hybridization (CARD-FISH), quantitative PCR (16S rRNA and functional genes, dsrA and mcrA), and 16S rRNA gene PCR-DGGE] to assess prokaryotic diversity, and this was compared with the distribution of total and culturable cell counts, radiotracer activity measurements and geochemistry. There was a significant and active prokaryotic community both within and beneath the carbonate mound. Although total cell numbers at certain depths were lower than the global average for other subseafloor sediments and prokaryotic activities were relatively low (iron and sulfate reduction, acetate oxidation, methanogenesis) they were significantly enhanced compared with the Reference site. In addition, there was some stimulation of prokaryotic activity in the deepest sediments (Miocene, > 10 Ma) including potential for anaerobic oxidation of methane activity below the mound base. Both Bacteria and Archaea were present, with neither dominant, and these were related to sequences commonly found in other subseafloor sediments. With an estimate of some 1600 mounds in the Porcupine Basin alone, carbonate mounds may represent a significant prokaryotic subseafloor habitat.

  4. Functional traits of trees on and off termite mounds : Understanding the origin of biotically-driven heterogeneity in savannas

    van der Plas, F.; Howison, R.; Reinders, J.; Fokkema, W.; Olff, H.


    Questions In African savannas, Macrotermes termites contribute to small-scale heterogeneity by constructing large mounds. Operating as islands of high nutrient and water availability and low fire frequency, these mounds support distinct, diverse communities of trees that have been shown to be highly

  5. Spatial patternd and morphology of termite (macrotermes falciger) mounds in the upper Katanga, D.R. Congo

    Mujinya, B.B.; Adam, M.Y.O.; Mees, F.; Bogaert, J.; Vranken, I.; Erens, H.; Baert, G.; Ngongo, M.; Ranst, van E.


    This study examines the spatial distribution patterns and morphological characteristics of Macrotermes falciger mounds in the peri-urban zone of Lubumbashi, D.R. Congo. Spatial patterns of mounds were assessed using high-resolution satellite images for 24 plots of variable size (3 to 27 ha). Soil mo

  6. Relict nebkhas (pimple mounds) record prolonged late Holocene drought in the forested region of south-central United States

    Seifert, Christopher L.; Cox, Randel Tom; Forman, Steven L.; Foti, Tom L.; Wasklewicz, Thad A.; McColgan, Andrew T.


    The origin and significance of pimple mounds (low, elliptical to circular dune-like features found across much of the south-central United States) have been debated for nearly two centuries. We cored pimple mounds at four sites spanning the Ozark Plateau, Arkansas River Valley, and Gulf of Mexico Coastal Plain and found that these mounds have a regionally consistent textural asymmetry such that there is a significant excess of coarse-grained sediment within their northwest flanks. We interpret this asymmetry as evidence of an eolian depositional origin of these mounds and conclude they are relict nebkhas (coppice dunes) deposited during protracted middle to late Holocene droughts. These four mounds yield optically stimulated luminescence ages between 2400 and 700 yr that correlate with well-documented periods of eolian activity and droughts on the southern Great Plains, including the Medieval Climate Anomaly. We conclude vegetation loss during extended droughts led to local eolian deflation and pimple mound deposition. These mounds reflect landscape response to multi-decadal droughts for the south-central U.S. The spatial extent of pimple mounds across this region further underscores the severity and duration of late Holocene droughts, which were significantly greater than historic droughts.

  7. Cold-water coral mounds on the Pen Duick Escarpment, Gulf of Cadiz: The MiCROSYSTEMS project approach

    Van Rooij, D.; Blamart, D.; De Mol, L.; Mienis, F.; Pirlet, H.; Wehrmann, L. M.; Barbieri, R.; Maignien, L.; Templer, S. P.; de Haas, H.; Hebbeln, D.; Frank, N.; Larmagnat, S.; Stadnitskaia, A.; Stivaletta, N.; van Weering, T.; Zhang, Y.; Hamoumi, N.; Cnudde, V.; Duyck, P.; Henriet, J.-P.; The MiCROSYSTEMS MD 169 Shipboard Party


    Here we present a case study of three cold-water coral mounds in a juvenile growth stage on top of the Pen Duick Escarpment in the Gulf of Cadiz; Alpha, Beta and Gamma mounds. Although cold-water corals are a common feature on the adjacent cliffs, mud volcanoes and open slope, no actual living

  8. On the Origin of the Dragon Image on the Plate from Shilovka Burial Mound

    Liphanov Nicolay А.


    The author of the article analyzes an unique image of two opposed dragons engraved on a bone plate discovered in 1992 at barrow No.1 of Shilovka burial mound located on the right bank of the Volga river in Ulyanovsk Oblast (the excavations were conducted by R.S. Bagautdinov). The burial mound is related to the cattle breeding population of late 7th century. The article considers different hypotheses concerning the origin of these dragon images in the artistic traditions of various regions: Ch...

  9. Development of a Partial Coefficient System for the Design of Rubble Mound Breakwaters

    Burcharth, H. F.

    Subgroup F is the last of the subgroups formed under the PIANC II Working Group 12 on Rubble Mound Structures. The terms of reference of subgroup F are to propose safety guidelines for rubble mound breakwaters including evaluation of the safety levels inherent in conventionally designed existing...... structures. The work of the former subgroups A, B, C. D and E provides the basis for the handling of a number of the central problems related to the development of safety guidelines. The Working Group 12 (WG12) decided prior to the start of subgroup F that the safety guidelines should be based on the partial...

  10. Timing of mounding for bambara groundnut affects crop development and yield in a rainfed tropical environment

    Ouedrago, Mahama; M'bi, Bertin Zagre; Liu, Fulai;


    to the crown of bambara groundnut plants and has been shown to improve seed yield of the crop. However, little information exists if and how the timing of mounding affects the productivity of the crop. To address this, two experiments during two consecutive years in rainfed fields in the Sudan–Sahel agro-ecological...... zone of Burkina Faso were conducted. Yield data confirm the findings from a drier part of Burkina Faso; i.e., mounding of bambara groundnut should not be carried out around the time of flowering. In a semi-arid area, such as Sudan–Sahel agro-ecological zone and with germplasm maturing within 90 days...

  11. Overview of the earth mounded concrete bunker prototype license application project: Objectives and approach

    Conner, J.E. [EG and G Idaho, Inc., Idaho Falls, ID (United States). Idaho National Engineering Lab.


    This paper presents an overview of the objectives and approach taken in developing the Earth-mounded Concrete Bunker Prototype License Application Project. The Prototype License Application Project was initiated by the Department of Energy`s National Low-Level Waste Management Program in early 1987 and completed in November 1988. As part of this project a prototype safety analysis report was developed. The safety analysis report evaluates the licensibility of an earth-mounded concrete bunker for a low-level radioactive waste (LLW) disposal facility located on a hypothetical site in the northeastern United States. The project required approximately five person-years and twenty months to develop.

  12. Overview of the earth mounded concrete bunker prototype license application project: Objectives and approach

    Conner, J.E. [EG and G Idaho, Inc., Idaho Falls, ID (United States). Idaho National Engineering Lab.


    This paper presents an overview of the objectives and approach taken in developing the Earth-mounded Concrete Bunker Prototype License Application Project. The Prototype License Application Project was initiated by the Department of Energy`s National Low-Level Waste Management Program in early 1987 and completed in November 1988. As part of this project a prototype safety analysis report was developed. The safety analysis report evaluates the licensibility of an earth-mounded concrete bunker for a low-level radioactive waste (LLW) disposal facility located on a hypothetical site in the northeastern United States. The project required approximately five person-years and twenty months to develop.

  13. Archaeomagnetic study of ancient slag mounds in Cyprus: continuous paleointensity curves in high resolution

    Shaar, R.; Tauxe, L.; Ben-Yosef, E.; Levy, T. E.; Kassianidou, V.; Lorentzen, B. E.


    One of the main challenges in paleointensity research is obtaining continuous high-resolution records that describe the behavior of the geomagnetic field on short time scales. One difficulty in obtaining such records is the problem of precise dating of suitable samples. Another fundamental difficulty is the assessment of the uncertainty involved in the interpretation of paleointensity experiments. Here we present an archaeomagnetic study of ancient slag mounds, which is designed to minimize these difficulties. We study two archaeological slag mounds in the Troodos foothills of Cyprus; one from the massive Roman mines at Skouriotissa, and another pre Roman near Mitsero Kokkinoyia. The mounds consist of industrial layers of copper slag intermixed with charcoal, which were deposited during times of intense copper smelting activity. The slag mound at Skouriotissa represents one of the largest copper production sites in the ancient world, including a 25 m high section and more than 40 archaeological layers. The mound at Mitsero is ca. 10 m high and contains about 32 layers. Hundreds of slag samples and associated charcoals from both mounds were collected, from which more than 600 slag specimens from more than 150 individual samples were analyzed for paleointensity. In addition,19 charcoals were radiocarbon dated. To minimize the uncertainty in the radiocarbon dating we applied a Bayesian model for each mound, which takes into account the relative stratigraphy of the layers. To reduce the uncertainty involved in the subjective interpretation of the paleointensity experiments (conventionally done by manually selecting temperature bounds in the Arai plot of each specimen) we designed new optimization software. The optimization software uses the assumption that paleointensity estimates from samples that were collected from the same level, should be similar. The optimization algorithm finds the selecting criteria that yields minimum scatter within each level, assigns

  14. Internal structure and depositional environment of Late Carboniferous mounds from the San Emiliano Formation, Cármenes Syncline, Cantabrian Mountains, Northern Spain


    Well-exposed mounds are common in limestone of the Late Carboniferous San Emiliano Formation, Cantabrian Mountains (Northern Spain). They occur as obvious primary topographic features. Careful study of the mound intervals and surrounding strata revealed the internal structures of mounds and the factors controlling their growth. The substrate (2–3 m) of the mounds consists of greyish to reddish, bedded oolitic and oncolithic packstone and grainstone. Crinoids, fragments of the alga Epimastopor...

  15. Physiological and biogeochemical traits of bleaching and recovery in the mounding species of coral Porites lobata: implications for resilience in mounding corals.

    Stephen J Levas

    Full Text Available Mounding corals survive bleaching events in greater numbers than branching corals. However, no study to date has determined the underlying physiological and biogeochemical trait(s that are responsible for mounding coral holobiont resilience to bleaching. Furthermore, the potential of dissolved organic carbon (DOC as a source of fixed carbon to bleached corals has never been determined. Here, Porites lobata corals were experimentally bleached for 23 days and then allowed to recover for 0, 1, 5, and 11 months. At each recovery interval a suite of analyses were performed to assess their recovery (photosynthesis, respiration, chlorophyll a, energy reserves, tissue biomass, calcification, δ(13C of the skeletal, δ(13C, and δ(15N of the animal host and endosymbiont fractions. Furthermore, at 0 months of recovery, the assimilation of photosynthetically acquired and zooplankton-feeding acquired carbon into the animal host, endosymbiont, skeleton, and coral-mediated DOC were measured via (13C-pulse-chase labeling. During the first month of recovery, energy reserves and tissue biomass in bleached corals were maintained despite reductions in chlorophyll a, photosynthesis, and the assimilation of photosynthetically fixed carbon. At the same time, P. lobata corals catabolized carbon acquired from zooplankton and seemed to take up DOC as a source of fixed carbon. All variables that were negatively affected by bleaching recovered within 5 to 11 months. Thus, bleaching resilience in the mounding coral P. lobata is driven by its ability to actively catabolize zooplankton-acquired carbon and seemingly utilize DOC as a significant fixed carbon source, facilitating the maintenance of energy reserves and tissue biomass. With the frequency and intensity of bleaching events expected to increase over the next century, coral diversity on future reefs may favor not only mounding morphologies but species like P. lobata, which have the ability to utilize heterotrophic

  16. A Telephone Call



    At about two o'clock on a cold winter morning, a doctor drove seven miles in answer to a telephone call. On his coming the man who had called him in said, “Doctor, I don't have a sore throat, I don't cough.I have no pain either in the side or in the back, I'm not running a temperature, but still I feel that death is near.”

  17. Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package

    Koo, Ja-Myeong


    Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafter OSP). During bonding, continuous AuIn2, Ni3(Sn,In)4 and Cu6(Sn,In)5 intermetallic compound (IMC) layers were formed at the solder/E-NG, solder/ENIG and solder/OSP interface, respectively. The interfacial reactions between the solder and I-Ag substrate during bonding resulted in the formation of Cu6(Sn,In)5 and Cu(Sn,In)2 IMCs with a minor Ag element. The In-48Sn/I-Ag solder joint showed the best shear properties among the four solder joints after bonding, whereas the solder/ENIG solder joint exhibited the weakest mechanical integrity.

  18. Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization

    Lai, Yi-Shao; Chiu, Ying-Ta; Chen, Jiunn


    The Cu pillar is a thick underbump metallurgy (UBM) structure developed to alleviate current crowding in a flip-chip solder joint under operating conditions. We present in this work an examination of the electromigration reliability and morphologies of Cu pillar flip-chip solder joints formed by joining Ti/Cu/Ni UBM with largely elongated ˜62 μm Cu onto Cu substrate pad metallization using the Sn-3Ag-0.5Cu solder alloy. Three test conditions that controlled average current densities in solder joints and ambient temperatures were considered: 10 kA/cm2 at 150°C, 10 kA/cm2 at 160°C, and 15 kA/cm2 at 125°C. Electromigration reliability of this particular solder joint turns out to be greatly enhanced compared to a conventional solder joint with a thin-film-stack UBM. Cross-sectional examinations of solder joints upon failure indicate that cracks formed in (Cu,Ni)6Sn5 or Cu6Sn5 intermetallic compounds (IMCs) near the cathode side of the solder joint. Moreover, the ~52- μm-thick Sn-Ag-Cu solder after long-term current stressing has turned into a combination of ~80% Cu-Ni-Sn IMC and ~20% Sn-rich phases, which appeared in the form of large aggregates that in general were distributed on the cathode side of the solder joint.

  19. Termite mound emissions of CH4 and CO2 are primarily determined by seasonal changes in termite biomass and behaviour.

    Jamali, Hizbullah; Livesley, Stephen J; Dawes, Tracy Z; Hutley, Lindsay B; Arndt, Stefan K


    Termites are a highly uncertain component in the global source budgets of CH(4) and CO(2). Large seasonal variations in termite mound fluxes of CH(4) and CO(2) have been reported in tropical savannas but the reason for this is largely unknown. This paper investigated the processes that govern these seasonal variations in CH(4) and CO(2) fluxes from the mounds of Microcerotermes nervosus Hill (Termitidae), a common termite species in Australian tropical savannas. Fluxes of CH(4) and CO(2) of termite mounds were 3.5-fold greater in the wet season as compared to the dry season and were a direct function of termite biomass. Termite biomass in mound samples was tenfold greater in the wet season compared to the dry season. When expressed per unit termite biomass, termite fluxes were only 1.2 (CH(4)) and 1.4 (CO(2))-fold greater in the wet season as compared to the dry season and could not explain the large seasonal variations in mound fluxes of CH(4) and CO(2). Seasonal variation in both gas diffusivity through mound walls and CH(4) oxidation by mound material was negligible. These results highlight for the first time that seasonal termite population dynamics are the main driver for the observed seasonal differences in mound fluxes of CH(4) and CO(2). These findings highlight the need to combine measurements of gas fluxes from termite mounds with detailed studies of termite population dynamics to reduce the uncertainty in quantifying seasonal variations in termite mound fluxes of CH(4) and CO(2).

  20. Linking benthic dynamics and cold-water coral occurrences: A high-resolution model study at three carbonate mound provinces in the NE Atlantic

    Mohn, Christian; Rengstorf, Anna; Grehan, Anthony;

    We used the 3-D ocean circulation model with grid refinement ROMS-AGRIF to describe the hydrodynamic conditions at three cold-water coral provinces in the NE Atlantic (Logachev Mounds, Arc Mounds and Belgica Mounds). Modelled fields of currents, temperature and salinity were analysed for observed...

  1. Microbial assemblages on a cold-water coral mound at the SE Rockall Bank (NE Atlantic): interactions with hydrography and topography

    van Bleijswijk, J.D.L.; Whalen, C.; Duineveld, G.C.A.; Lavaleye, M.S.S.; Witte, H.J.; Mienis, F


    This study characterizes the microbial community composition over Haas Mound, one of the most prominent cold-water coral mounds of the Logachev Mound province (Rockall Bank, NE Atlantic). We outline patterns of distribution vertically – from the seafloor to the water column – and laterally – across

  2. Microbial assemblages on a cold-water coral mound at the SE Rockall Bank (NE Atlantic): interactions with hydrography and topography

    van Bleijswijk, J.D.L.; Whalen, C.; Duineveld, G.C.A.; Lavaleye, M.S.S.; Witte, H.J.; Mienis, F


    This study characterizes the microbial community composition over Haas Mound, one of the most prominent cold-water coral mounds of the Logachev Mound province (Rockall Bank, NE Atlantic). We outline patterns of distribution vertically – from the seafloor to the water column – and laterally – across

  3. Abnormal growth of Ag3Sn intermetallic compounds in Sn-Ag lead-free solder

    SHEN Jun; LIU Yongchang; GAO Houxiu


    The abnormal growth of Ag3Sn intermetallic compounds in eutectic Sn-3.5% Ag solder was investigated through high-temperature aging treatment. Microstructural evolutions of this solder before and after the aging treatment were observed by optical microscopy and scanning electron microscopy. Precise differential thermal analysis was made to study the changes in enthalpies of the solder under different conditions. The results reveal that the water-cooled solder is in metastable thermodynamic state due to the high free energy of Ag3Sn nanoparticles, which sporadically distribute in the matrix as second-phase. The second-phase Ag3Sn nanoparticles aggregate rapidly and grow to form bulk intermetallic compounds due to the migration of grain boundary between primary Sn-rich phase and the Ag3Sn nanoparticles during high temperature aging treatment.

  4. Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

    Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper


    Soldering of cast alloys to the dies has been a continuing source of die surface damage in the aluminum die-casting industry. To reduce the repair and maintenance costs, an approach to modeling the damage and predicting the die lifetime is required. The aim of the present study is the estimation...... of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling. solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft....... The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers...

  5. Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints

    Bosco, Nick; Silverman, Timothy J.; Kurtz, Sarah


    FEM simulations of PbSn solder fatigue damage are used to evaluate seven cities that represent a variety of climatic zones. It is shown that the rate of solder fatigue damage is not ranked with the cities' climate designations. For an accurate ranking, the mean maximum daily temperature, daily temperature change and a characteristic of clouding events are all required. A physics-based empirical equation is presented that accurately calculates solder fatigue damage according to these three factors. An FEM comparison of solder damage accumulated through service and thermal cycling demonstrates the number of cycles required for an equivalent exposure. For an equivalent 25-year exposure, the number of thermal cycles (-40 degrees C to 85 degrees C) required ranged from roughly 100 to 630 for the cities examined. It is demonstrated that increasing the maximum cycle temperature may significantly reduce the number of thermal cycles required for an equivalent exposure.

  6. Thermal analysis of selected tin-based lead-free solder alloys

    Palcut, Marián; Sopoušek, J.; Trnková, L.


    The Sn-Ag-Cu alloys have favourable solderability and wetting properties and are, therefore, being considered as potential lead-free solder materials. In the present study, tin-based Sn-Ag-Cu and Sn-Ag-Cu-Bi alloys were studied in detail by a differential scanning calorimetry (DSC) and thermodyna......The Sn-Ag-Cu alloys have favourable solderability and wetting properties and are, therefore, being considered as potential lead-free solder materials. In the present study, tin-based Sn-Ag-Cu and Sn-Ag-Cu-Bi alloys were studied in detail by a differential scanning calorimetry (DSC...... was simulated using the Thermo-Calc software package. This approach enabled us to obtain the enthalpy of cooling for each alloy and to compare its temperature derivative with the experimental DSC curves....

  7. Shear Deformation Behaviors of Sn3.5Ag Lead-free Solder Samples

    Jing Han; Hongtao Chen; Mingyu Li; Chunqing Wang


    In this study,shear tests have been performed on the as-reflowed Sn3.5Ag solder bumps and joints to investigate the deformation behavior of Sn3.5Ag lead-free solder samples.Scanning electron microscopy (SEM) was employed to characterize the microstructures of the samples and orientation imaging microscopy (OIM) with electron backscattered diffraction (EBSD) in SEM was used to obtain crystallographic orientation of grains to provide a detailed characterization of the deformation behavior in Sn3.5Ag solder samples after shear tests.The deformation behavior in solder samples under shear stress was discussed.The experimental results suggest that the dynamic recrystallization could occur under shear stress at room temperature and recrystallized grains should evolve from subgrains by rotation.Compared with that of non-recrystallized and as-reflowed microstructures,the microhardness of the recrystallized microstructure decreased after shear tests.

  8. Joint Strength with Soldering of Al2O3 Ceramics After Ni-P Chemical Plating

    邹贵生; 吴爱萍; 张德库; 孟繁明; 白海林; 张永清; 黎义; 巫世杰; 顾兆旃


    Ni-P alloy was chemically plated on Al2O3 ceramics to produce uniform alloy coatings at temperatures below 70℃. Cu metal was electroplated onto the Ni-P coating to facilitate the soldering and shorten the chemical plating time. Then, the electroplated ceramic specimens were soldered with 60 wt.% Sn-40 wt.% Pb solder in active colophony. The highest shear strength was acquired after the heat treatment at 170℃ for 15 min. The joint fractures mostly propagated along the interface between the ceramics and the Ni-P coating, with some fracture in both the ceramics and the Ni-P coating near the interface and some along the interface between the Cu and Ni-P coatings. The results show that ceramic surface roughness and the chemical plating parameters influence the coating quality, and that suitable heat treatment before the soldering also improves the adhesion between the ceramics and Ni-P coatings, thus strengthening the joints.

  9. Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

    Lee, Tae-Kyu; Liu, Bo; Zhou, Bite; Bieler, Thomas; Liu, Kuo-Chuan


    The impact of a marine environment on Sn-Ag-Cu interconnect reliability is examined using salt spray exposure followed by thermal cycling. Sn-Ag-Cu solder alloy wafer-level packages, with and without pretreatment with 5% NaCl salt spray, were thermally cycled to failure. The prior salt spray reduced the characteristic lifetime of the Sn-Ag-Cu solder joints by over 43%. Although Sn-based materials show strong resistance to corrosion, the nature of localized corroded areas at critical locations in the solder joint caused significant degradation in the Sn-Ag-Cu solder joints. An important link between the corrosion path and Sn grain orientation was observed using orientation imaging microscopy (OIM). A strong correlation between the corrosion path and grain orientation was identified, indicating that the corrosion attack preferentially followed the basal plane of the Sn lattice.

  10. Influence of Asymmetrical Waveform on Low-Cycle Fatigue Life of Micro Solder Joint

    Kanda, Yoshihiko; Kariya, Yoshiharu


    The effects of waveform symmetry on the low-cycle fatigue life of the Sn-3.0Ag-0.5Cu alloy have been investigated, using micro solder joint specimens with approximately the same volume of solder as is used in actual products. Focusing on crack initiation life, fatigue tests on Sn-Ag-Cu micro solder joints using asymmetrical triangular waveforms revealed no significant reduction in fatigue life. A slight reduction in fatigue life at low strain ranges caused by an increase in the fatigue ductility exponent, which is the result of a weakening microstructure due to loads applied at high temperature for long testing time, was observed. This was due to the fact that grain boundary damage, which has been reported in large-size specimens subjected to asymmetrical triangular waveforms, does not occur in Sn-Ag-Cu micro size solder joints with only a small number of crystal grain boundaries.

  11. Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

    Rolin, T. D.; Hodge, R. E.


    An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

  12. Evaluation of Detachable Ga-Based Solder Contacts for Thermoelectric Materials

    Kolb, H.; Sottong, R.; Dasgupta, T.; Mueller, E.; de Boor, J.


    Low electrical and thermal contact resistances are a prerequisite for highly efficient thermoelectric generators. Likewise, certain measurement setups for characterization of thermoelectric materials rely on good-quality contacts between sample and setup. Detachable contacts are an interesting alternative to permanent contacting solutions due to ease of handling and nondestructive disassembly of valuable samples. Therefore, the applicability of gallium-based liquid metal solder as detachable contact material was studied, particularly with regard to compatibility of the solder with state-of-the-art thermoelectric materials CoSb3, Mg2Si, and FeSi2. Tungsten, nickel, chromium, and titanium were tested as protective coatings between the thermoelectric material and liquid metal solder. Electrical measurements showed that some materials form excellent and stable contacts with the solder for a limited temperature range. At higher temperatures, application of a protective layer was found to be necessary for all investigated materials. Tungsten and nickel showed promising results as protective layer.

  13. Nano ZrO2 Particulate-reinforced Lead-Free Solder Composite

    Jun SHEN; Yongchang LIU; Dongjiang WANG; Houxiu GAO


    A lead-free solder composite was prepared by adding ZrO2 nanopowders in eutectic Sn-Ag alloy. Microstructural features and microhardness properties of those solders with different ZrO2 nanopowder fraction were examined. Results indicate that the addition of ZrO2 nanopowders reduced the size ofβ-Sn grains and restrained the formation of bulk Ag3Sn intermetallic compounds (IMCs) due to the adsorption effect of the ZrO2 particles. The Vicker's hardness of the obtained lead-free solder composites fits well with the Hall-Petch relationship. The refinement of β-Sn grains favors to improve the microhardness of composite solders.

  14. Microstructurally based thermomechanical fatigue lifetime model of solder joints for electronic applications

    Frear, D.R.; Rashid, M.M.; Burchett, S.N.


    We present a new methodology for predicting the fatigue life of solder joints for electronics applications. This approach involves integration of experimental and computational techniques. The first stage involves correlating the manufacturing and processing parameters with the starting microstructure of the solder joint. The second stage involves a series of experiments that characterize the evolution of the microstructure during thermal cycling. The third stage consists of a computer modeling and simulation effort that utilizes the starting microstructure and experimental data to produce a reliability prediction of the solder joint. This approach is an improvement over current methodologies because it incorporates the microstructure and properties of the solder directly into the model and allows these properties to evolve as the microstructure changes during fatigue.

  15. Interfacial Reactions and Joint Strengths of Sn- xZn Solders with Immersion Ag UBM

    Jee, Y. K.; Yu, Jin


    The solder joint microstructures of immersion Ag with Sn- xZn ( x = 0 wt.%, 1 wt.%, 5 wt.%, and 9 wt.%) solders were analyzed and correlated with their drop impact reliability. Addition of 1 wt.% Zn to Sn did not change the interface microstructure and was only marginally effective. In comparison, the addition of 5 wt.% or 9 wt.% Zn formed layers of AgZn3/Ag5Zn8 at the solder joint interface, which increased drop reliability significantly. Under extensive aging, Ag-Zn intermetallic compounds (IMCs) transformed into Cu5Zn8 and Ag3Sn, and the drop impact resistance at the solder joints deteriorated up to a point. The beneficial role of Zn on immersion Ag pads was ascribed to the formation of Ag-Zn IMC layers, which were fairly resistant to the drop impact, and to the suppression of the brittle Cu6Sn5 phase at the joint interface.

  16. The early diagenetic and PETROphysical behaviour of recent cold-water CARbonate mounds in Deep Environments (PETROCARDE)

    Foubert, Anneleen; Pirlet, Hans; Thierens, Mieke; de Mol, Ben; Henriet, Jean-Pierre; Swennen, Rudy


    Sub-recent cold-water carbonate mounds localized in deeper slope settings on the Atlantic continental margins cannot be any longer neglected in the study of carbonate systems. They clearly play a major role in the dynamics of mixed siliciclastic-carbonate and/or carbonate-dominated continental slopes. Carbonate accumulation rates of cold-water carbonate mounds are about 4 to 12 % of the carbonate accumulation rates of tropical shallow-water reefs but exceed the carbonate accumulation rates of their slope settings by a factor of 4 to 12 (Titschack et al., 2009). These findings emphasize the importance of these carbonate factories as carbonate niches on the continental margins. The primary environmental architecture of such carbonate bodies is well-characterized. However, despite proven evidences of early diagenesis overprinting the primary environmental record (e.g. aragonite dissolution) (Foubert & Henriet, 2009), the extent of early diagenetic and biogeochemical processes shaping the petrophysical nature of mounds is until now not yet fully understood. Understanding (1) the functioning of a carbonate mound as biogeochemical reactor triggering early diagenetic processes and (2) the impact of early diagenesis on the petrophysical behaviour of a carbonate mound in space and through time are necessary (vital) for the reliable prediction of potential late diagenetic processes. Approaching the fossil carbonate mound record, through a profound study of recent carbonate bodies is innovative and will help to better understand processes observed in the fossil mound world (such as cementation, brecciation, fracturing, etc…). In this study, the 155-m high Challenger mound (Porcupine Seabight, SW of Ireland), drilled during IODP Expedition 307 aboard the R/V Joides Resolution (Foubert & Henriet, 2009), and mounds from the Gulf of Cadiz (Moroccan margin) will be discussed in terms of early diagenetic processes and petrophysical behaviour. Early differential diagenesis

  17. Enhanced nurse call systems.


    This Evaluation focuses on high-end computerized nurse call systems--what we call enhanced systems. These are highly flexible systems that incorporate microprocessor and communications technologies to expand the capabilities of the nurse call function. Enhanced systems, which vary in configuration from one installation to the next, typically consist of a basic system that provides standard nurse call functionality and a combination of additional enhancements that provide the added functionality the facility desires. In this study, we examine the features that distinguish enhanced nurse call systems from nonenhanced systems, focusing on their application and benefit to healthcare facilities. We evaluated seven systems to determine how well they help (1) improve patient care, as well as increase satisfaction with the care provided, and (2) improve caregiver efficiency, as well as increase satisfaction with the work environment. We found that all systems meet these objectives, but not all systems perform equally well for all implementations. Our ratings will help facilities identify those systems that offer the most effective features for their intended use. The study also includes a Technology Management Guide to help readers (1) determine whether they'll benefit from the capabilities offered by enhanced systems and (2) target a system for purchase and equip the system for optimum performance and cost-effective operation.

  18. Assessing call centers’ success:

    Hesham A. Baraka


    This paper introduces a model to evaluate the performance of call centers based on the Delone and McLean Information Systems success model. A number of indicators are identified to track the call center’s performance. Mapping of the proposed indicators to the six dimensions of the D&M model is presented. A Weighted Call Center Performance Index is proposed to assess the call center performance; the index is used to analyze the effect of the identified indicators. Policy-Weighted approach was used to assume the weights with an analysis of different weights for each dimension. The analysis of the different weights cases gave priority to the User satisfaction and net Benefits dimension as the two outcomes from the system. For the input dimensions, higher priority was given to the system quality and the service quality dimension. Call centers decision makers can use the tool to tune the different weights in order to reach the objectives set by the organization. Multiple linear regression analysis was used in order to provide a linear formula for the User Satisfaction dimension and the Net Benefits dimension in order to be able to forecast the values for these two dimensions as function of the other dimensions

  19. Studies of intermetallic growth in Cu-solder systems and wettability at solid-liquid interfaces

    Martin, Raymond W.


    Approved for public release; distribution is unlimited The metallurgical bond formed between tin-lead solder and the copper substrate is characterized by the formation of an intermetallic compound layer. The growth of the intermetallic layer is the result of competing mechanisms, growth of the intermetallic at the intermetallic/copper interface and its dissolution at the intermetallic/liquid solder interface. These were studied by determining the dissolution rates of the copper and the i...

  20. Joint Lead-Free Solder Test Program for High Reliability Military and Space Applications

    Brown, Christina


    Current and future space and defense systems face potential risks from the continued use of tin-lead solder, including: compliance with current environmental regulations, concerns about potential environmental legislation banning lead-containing products, reduced mission readiness, and component obsolescence with lead surface finishes. For example, the United States Environmental Protection Agency (USEPA) has lowered the Toxic Chemical Release reporting threshold for lead to 100 pounds. Overseas, the Waste Electrical and Electronic Equipment (WEEE) and the Restriction on Hazardous Substances (RoHS) Dicctives in Europe and similar mandates in Japan have instilled concern that a legislative body will prohibit the use of lead in aerospace/military electronics soldering. Any potential banning of lead compounds could reduce the supplier base and adversely affect the readiness of missions led by the National Aeronautics and Space Administration (NASA) and the U.S. Department of Defense (DoD). Before considering lead-free electronics for system upgrades or future designs, however, it is important for the DoD and NASA to know whether lead-free solders can meet their systems' requirements. No single lead-free solder is likely to qualify for all defense and space applications. Therefore, it is important to validate alternative solders for discrete applications. As a result of the need for comprehensive test data on the reliability of lead-free solders, a partnership was formed between the DoD, NASA, and several original equipment manufactures (OEMs) to conduct solder-joint reliability (laboratory) testing of three lead-free solder alloys on newly manufactured and reworked circuit cards to generate performance data for high-reliability (IPC Class 3) applications.

  1. Thermomechanical cycling investigation of CU particulate and NITI reinforced lead-free solder

    Horton, W. Scott.


    In todayâ s Flip Chip (FC) and Ball Grid Array (BGA) electronic packages solder joints provide both the electrical as well as the mechanical connections between the silicon chip and the substrate. Due to coefficient of thermal expansion (CTE) differences between the chip and substrate the solder joints undergo thermomechanical stresses and strains as an electronic package is heated and cooled with power on/off cycles. Advances in chip designs result in chips that are larger, run hotter and d...

  2. Effects of voids on thermal-mechanical reliability of lead-free solder joints

    Benabou Lahouari


    Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

  3. Wave Loads on Rubble Mound Breakwater Crown Walls in Long Waves

    Røge, Mads Sønderstrup; Færch Christensen, Nicole; Thomsen, Jonas Bjerg;


    This paper evaluates the formulae by Nørgaard et al. (2013) for predicting wave loads on rubble mound breakwater crown walls on new model tests. The formulae are tested outside their validation area by means of waves with a low wave steepness and low run-up height compared to the armour freeboard...

  4. Paleo-redox fronts and their formation in carbonate mound sediments from the Rockall Trough

    van der Land, C.; Mienis, F.; de Haas, H.; de Stigter, H.C.; Swennen, R.; Reijmer, J.J.G.; van Weering, T.C.E.


    Piston cores from the summits of coral topped carbonate mounds at the south west Rockall Trough margin reveal that the sediments have undergone significant post-depositional modifications affecting the original geochemical signature and mineralogical composition of the sediments. This diagenetic imp

  5. Mesopotamian ceramics from the burial mounds of Bahrain, c.2250–1750 BC

    Laursen, Steffen


    Among the ceramic vessels recovered from the burial mounds of Bahrain, a small percentage represents Mesopotamian imports or local emulations of such. In this paper two overall horizons are distinguished in these Mesopotamian ceramics. These are significant because both coincide with major stages...

  6. Construction, Maintenance and Repair as Elements in Rubble Mound Breakwater Design

    Burcharth, Hans F.; Rietveld, C.F.W.

    Very often rubble mound breakwater designs seem to be a result only of stability considerations corresponding to design wave conditions. Designers tend to put too little emphasis on practical problems related to construction, maintenance and repair. As is discussed in the paper due consideration ...

  7. Experimental Study and Numerical Modeling of Wave Induced Pore Pressure Attenuation Inside a Rubble Mound Breakwater

    Troch, Peter; Rouck, Julien De; Burcharth, Hans Falk


    The main objective of this paper is to study the attenuation of the wave induced pore pressures inside the core of a rubble mound breakwater. The knowledge of the distribution and the attenuation of the pore pressures is important for the design of a stable and safe breakwater. The pore pressure...

  8. Single Wave Overtopping Volumes and their Travel Distance for Rubble Mound Breakwaters

    Andersen, Thomas Lykke; Burcharth, Hans F.; Gironella, F. X.


    In the present paper small and large scale overtopping data for rubble mound structures have been analysed with respect to single wave overtopping volumes and their travel distance. The analysis has led to formulae for estimation of maximum single wave overtopping volumes and their travel distance...

  9. On the Choice of Structure and Layout of Rubble Mound Breakwater Heads

    Maciñeira, Enrique; Burcharth, Hans F.


     The paper discusses the various functional, environmental and structural conditions to consider related to the choice of breakwater head type. Results from hydraulic model tests of rubble mound and caisson head solutions for the new deep water port at Punto Langosteira, La Coruña, Spain, are pre...

  10. Packaging of hard solder 500W QCW diode laser array

    Li, Xiaoning; Wang, Jingwei; Hou, Dong; Nie, Zhiqiang; Liu, Xingsheng


    The package structure critically influences the major characteristics of diode laser, such as thermal behavior, output power, wavelength and smile effect. In this work, a novel micro channel cooler (MCC) for stack array laser with good heat dissipation capability and high reliability is presented. Numerical simulations of thermal management with different MCC structure are conducted and analyzed. Based on this new MCC packaging structure, a series of QCW 500W high power laser arrays with hard solder packaging technology has been fabricated. The performances of the laser arrays are characterized. A narrow spectrum of 3.12 nm and an excellent smile value are obtained. The lifetime of the laser array is more than 1.38×109 shots and still ongoing.

  11. Modeling of thermal processes in waveguide tracts induction soldering

    Murygin, A. V.; Tynchenko, V. S.; Laptenok, V. D.; Emilova, O. A.; Seregin, Yu N.


    The problem solving of the induction heating models development, which describe the heating of the separate structural assembly components of the waveguide path and product generally, is presented in this paper. Proposed mathematical models are based on the thermodynamics equation and on the heat balance law. The system of the heating process mathematical models, such as surge tube and flange heating, and the mathematical model of the energy distribution are presented. During the modeling process with Matlab system by using mathematical models graphs of the tube, flange and coupling heating were obtained. These design charts are confirmed by the results of the experimental study. During the experimental studies pyrometers for temperature control and a video camera for visual control of the process parameters were used. On the basis of obtained models the induction soldering process features analysis is carried out and the need of its automation by the using of the information control systems for thermal management between the connection elements is revealed.

  12. Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

    Iman, R.L.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States); Burress, R.V. [SEHO (United States)] [and others


    The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

  13. Call Center Capacity Planning

    Nielsen, Thomas Bang

    in modern call centers allows for a high level of customization, but also induces complicated operational processes. The size of the industry together with the complex and labor intensive nature of large call centers motivates the research carried out to understand the underlying processes. The customizable...... groups are further analyzed. The design of the overflow policies is optimized using Markov Decision Processes and a gain with regard to service levels is obtained. Also, the fixed threshold policy is investigated and found to be appropriate when one class is given high priority and when it is desired...

  14. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    Lei Sun


    Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

  15. Soldering in a Reduced Gravity Environment (SoRGE)

    Easton, John W.; Struk, Peter M.


    Future long-duration human exploration missions will be challenged by constraints on mass and volume allocations available for spare parts. Addressing this challenge will be critical to the success of these missions. As a result, it is necessary to consider new approaches to spacecraft maintenance and repair that reduce the need for large replacement components. Currently, crew members on the International Space Station (ISS) recover from faults by removing and replacing, using backup systems, or living without the function of Orbital Replacement Units (ORUs). These ORUs are returned to a depot where the root cause of the failure is determined and the ORU is repaired. The crew has some limited repair capability with the Modulation/DeModulation (MDM) ORU, where circuit cards are removed and replace in faulty units. The next step to reducing the size of the items being replaced would be to implement component-level repair. This mode of repair has been implemented by the U.S. Navy in an operational environment and is now part of their standard approach for maintenance. It is appropriate to consider whether this approach can be adapted for future spaceflight operations. To this end, the Soldering in a Reduced Gravity Environment (SoRGE) experiment studied the effect of gravity on the formation of solder joints on electronic circuit boards. This document describes the SoRGE experiment, the analysis methods, and results to date. This document will also contain comments from the crew regarding their experience conducting the SoRGE experiment as well as recommendations for future improvements. Finally, this document will discuss the plans for the SoRGE samples which remain on ISS.

  16. Carbonate mounds from the Gulf of Cadiz in relation to methane seepage: unrelated phenomena or coupling?

    Stadnitskaia, Alina; Baas, Marianne; de Haas, Henk; van Weering, Tjeerd C. E.; Kreulen, Rob R.; Sinninghe Damsté, Jaap S.


    For more than decade, the formation of carbonate mounds, related ecosystem development and organization/functioning of the entire mound habitats are subjects for a growing amount of studies and discussions. Carbonate mounds from the Gulf of Cadiz are of special interest due to their association with active mud volcanoes within the El Arraiche mud volcano field. Such co-occurrence of ecologically contrasting phenomena anticipates complex biogeochemical interactions between a carbonate mound interior and seeping through hydrocarbon-rich fluids. To get closer in understanding of how methane affects a carbonate mound development in the gulf, a combination of inorganic and organic geochemical techniques was applied to two sedimentary cores collected from summits of Alfa and Beta mounds. These mounds were found at the NW slope of the Gimini MV at the Pen Duick Mound Province. We analyzed vertical distribution profiles of sulfate, sulfide, chlorinity, DIC in combination with hydrocarbon gas measurements and lipid biomarker study. To have estimates of Sea Surface Temperature (SST) during the carbonate mound formation, we applied the TEX86 (TetraEther indeX of tetraethers with 86 carbon atoms; Schouten et al., 2002) and the alkenone-based UK37 index (Müller et al., 1998). The pore-water data revealed the presence of brine inflow, which is consistent with the data of Hensen et al., (2007). The behavior of sulfide distribution profiles and δ13C values from dissolved inorganic carbon (DIC) indicated that most of the sulfide and DIC are resulted from the microbial anaerobic oxidation of methane (AOM) processes. In contrast, the analysis of archaeal membrane lipids from distinct clades of AOM-mediating anaerobic methanotrophs showed exceedingly low concentrations of specific biomarkers, which is in contradiction with pore-water and gas chemistry data. Besides, AOM is the main cause for the increase of sedimentary alkalinity that leads to carbonate precipitation. Instead, some

  17. Solder-Filling of a Cicc Cable for the Efda Dipole Magnet

    Bauer, P.; Bruzzone, P.; Cau, F.; Weiss, K.; Portone, A.; Salpietro, E.; Vogel, M.; Vostner, A.


    Several prototype Cable-In-Conduit-Conductors (CICC) for the superconducting EDIPO (Efda DIPOle) revealed a degradation of their critical current (Ic) increasing with each loading cycle. The strong Lorentz-forces during operation in combination with the limited support of the single strands against these forces are thought to be the cause of the permanent degradation of the brittle Nb3Sn superconductor from which the multi-stranded CICC are made. In summer 2006 EFDA started to explore the possibility to remedy the Ic degradation by solder-filling the conductor in order to mechanically stabilize the twisted-strand cable inside the conduit. This solution was not considered as the main one, but as an emergency solution to be applied to the completed magnet, should every other option fail. The solder-filling approach was previously applied with success in some cases. Some issues, however, needed to be clarified before this solution could be proposed for the EDIPO project. The most important among them are the choice of solder material, details of the solder filling process, and the thermo-mechanical implications of a solder-filled, high-field, high-current cable. This work, being reported here, made use not only of simulation but also of experiments, such as the mechanical testing of solder filled cables at cryogenic temperatures.

  18. Preliminary Study on Synthesis of Organolead Halide with Lead Derived from Solder Wire

    Pratiwi, P.; Rahmi, G. N.; Aimon, A. H.; Iskandar, F.; Abdullah, M.; Nuryadin, B. W.


    Organolead halide has attracted great attention for application in perovskite solar cells due to its high power conversion efficiency (PCE) of up to 20.1%. One of the most common perovskite materials is lead based reagent. In this research, we have synthesized organolead halide with lead extracted from solder wire. In the preparation procedure, first PbCl2 and PbI2 are produced by reacting lead from the solder wire with NaCl and KI, which are used as the basic substance for the perovskite material. Then, in order to get perovskite solution, the powders are reacted with methylamine iodide (MAI) in dimethylformamide (DMF) using a solution based method. Further, the spin coating method is used to fabricate perovskite thin film. The XRD peak results agreed with JCPDS Powder Diffraction of PbCl2 and PbI2. Based on FTIR, the transmittance spectra of the organolead mixed halide that was prepared using solder wire lead exhibited absorption peaks identical to organolead mixed halide using commercial lead. The UV-Vis absorbance spectra of the organolead mixed halide from solder wire lead also exhibited the same absorption ability as from commercial lead. Morever, EDS measurement showed that the element composition of the perovskite thin film using lead from solder wire identical to that from commercial lead. This indicates that solder wire lead is suitable enough for organolead halide material synthesis.

  19. Effect of Cu concentration on morphology of Sn-Ag-Cu solders by mechanical alloying

    Kao, Szu-Tsung; Duh, Jenq-Gong


    The mechanical alloying (MA) process is considered an alternative approach to produce solder materials. In this study, the effect of Cu concentration in the ternary Sn-3.5Ag-xCu (x=0.2, 0.7, and 1) solder by MA was investigated. The (Cu,Sn) solid solution was precipitated as the Cu6Sn5 intermetallic compound (IMC), which was distributed nonuniformly through the microstructure. The Cu6Sn5 IMC, which was present in the SnAgCu solder with high Cu composition, causes the as-milled MA particle to fracture to a smaller size. Appreciable distinction on morphology of as-milled MA powders with different Cu content was revealed. When the Cu concentration was low (x=0.2), MA particle aggregated to a spherical ingot with large particle size. For higher Cu concentration (x=0.7 and x=1), the MA particle turned to flakes with smaller particle size. The distinction of the milling mechanism of Sn-3.5Ag-xCu (x=0.2, 0.7, and 1) solder by the MA process was discussed. An effective approach was developed to reduce the particle size of the SnAgCu solder from 1 mm down to 10-100 µm by doping the Cu6Sn5 nanoparticle during the MA process. In addition, the differential scanning calorimetry (DSC) results also ensure the compatibility to apply the solder material for the reflow process.

  20. Development of high strength Sn-Mg solder alloys with reasonable ductility

    Alam, Md Ershadul; Gupta, Manoj


    This study discussed the development of a series of new lead-free Sn-Mg solders by incorporating varying amounts of Mg (0.8, 1.5 and 2.5 wt. %) into pure Sn using disintegrated melt deposition technique followed by room temperature extrusion. All extruded Sn and Sn-Mg solder samples were characterized. Microstructural characterization studies revealed equiaxed grain morphology, minimal porosity and relatively uniform distribution of secondary phase. Better coefficient of thermal expansion was observed for Sn-2.5Mg sample when compared to conventional Sn-37Pb solder. Melting temperature of Sn-1.5Mg was found to be 212°C which is much lower than the conventional Sn-Ag-Cu or Sn-Cu (227°C) solders. Microhardness was increased with increasing amount of Mg in pure Sn. Room temperature tensile test results revealed that newly developed Sn-Mg solders exhibit enhanced strengths (0.2% yield strength and ultimate tensile strength) with comparable (if not better) ductility when compared to other commercially available and widely used Sn-based solder alloys.

  1. Effect of interface microstructure on the mechanical properties of Pb-free hybrid microcircuit solder joints

    Hernandez, C.L.; Vianco, P.T.; Rejent, J.A.


    Although Sn-Pb eutectic alloy is widely used as a joining material in the electronics industry, it has well documented environmental and toxicity issues. Sandia National Laboratories is developing alternative solder materials to replace traditional Pb-containing alloys. The alloys are based on the Sn-Ag, Sn-Ag-Bi and Sn-Ag-Bi-Au systems. Prototype hybrid microcircuit (HMC) test vehicles have been developed to evaluate these Pb-free solders, using Au-Pt-Pd thick film metallization. Populated test vehicles with surface mount devices have been designed and fabricated to evaluate the reliability of surface mount solder joints. The test components consist of a variety of dummy chip capacitors and leadless ceramic chip carriers (LCCC`s). Intermetallic compound (IMC) layer reaction products that form at the solder/substrate interface have been characterized and their respective growth kinetics quantified. Thicker IMC layers pose a potential reliability problem with solder joint integrity. Since the IMC layer is brittle, the likelihood of mechanical failure of a joint in service is increased. The effect of microstructure and the response of these different materials to wetting, aging and mechanical testing was also investigated. Solid-state reaction data for intermetallic formation and mechanical properties of the solder joints are reported.

  2. Mechanical properties of Pb-free solder alloys on thick film hybrid microcircuits

    Hernandez, C.L.; Vianco, P.T.; Rejent, J.A.; Hosking, F.M.


    The technology drivers of the electronics industry continue to be systems miniaturization and reliability, in addition to addressing a variety of important environmental issues. Although the Sn-Pb eutectic alloy is widely used as a joining material in the electronics industry, it has drawn environmental concern due to its Pb content. The solder acts both as an electrical and mechanical connection within the different packaging levels in an electronic device. New Pb-free solders are being developed at Sandia National Laboratories. The alloys are based on the Sn-Ag alloy, having Bi and Au additions. Prototype hybrid microcircuit (HMC) test vehicles have been assembled to evaluate Pb-free solders for Au-Pt-Pd thick film soldering. The test components consist of a variety of dummy chip capacitors and leadless ceramic chip carriers (LCCC`s). The mechanical properties of the joints were evaluated. The reflow profiles and the solid state intermetallic formation reaction will also be presented. Improved solder joint manufacturability and increased fatigue resistance solder alloys are the goals of these materials.

  3. Numerical simulation of soldered joints and reliability analysis of PLCC components with J-shape leads

    Zhang Liang; Xue Songbai; Lu Fangyan; Han Zongjie; Wang Jianxin


    This paper deals with a study on SnPb and lead-free soldered joint reliability of PLCC devices with different lead counts under three kinds of temperature cycle profiles, which is based on non-linear finite element method. By analyzing the stress of soldered joints, it is found that the largest stress is at the area between the soldered joints and the leads, and analysis results indicate that the von Mises stress at the location slightly increases with the increase of lead counts. For PLCC with 84 leads the soldered joints was modeled for three typical loading (273-398 K, 218-398 K and 198-398 K) in order to study the influence of acceleration factors on the reliability of soldered joints. And the estimation of equivalent plastic strain of three different lead-free solder alloys (Sn3.8Ag0.7Cu, Sn3.5Ag and Sn37Pb) was also carried out.

  4. Comparative shear tests of some low temperature lead-free solder pastes

    Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.


    The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

  5. A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

    Enrico Mick


    Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

  6. Giant polygons and mounds in the lowlands of Mars: signatures of an ancient ocean?

    Oehler, Dorothy Z; Allen, Carlton C


    This paper presents the hypothesis that the well-known giant polygons and bright mounds of the martian lowlands may be related to a common process-a process of fluid expulsion that results from burial of fine-grained sediments beneath a body of water. Specifically, we hypothesize that giant polygons and mounds in Chryse and Acidalia Planitiae are analogous to kilometer-scale polygons and mud volcanoes in terrestrial, marine basins and that the co-occurrence of masses of these features in Chryse and Acidalia may be the signature of sedimentary processes in an ancient martian ocean. We base this hypothesis on recent data from both Earth and Mars. On Earth, 3-D seismic data illustrate kilometer-scale polygons that may be analogous to the giant polygons on Mars. The terrestrial polygons form in fine-grained sediments that have been deposited and buried in passive-margin, marine settings. These polygons are thought to result from compaction/dewatering, and they are commonly associated with fluid expulsion features, such as mud volcanoes. On Mars, in Chryse and Acidalia Planitiae, orbital data demonstrate that giant polygons and mounds have overlapping spatial distributions. There, each set of features occurs within a geological setting that is seemingly analogous to that of the terrestrial, kilometer-scale polygons (broad basin of deposition, predicted fine-grained sediments, and lack of significant horizontal stress). Regionally, the martian polygons and mounds both show a correlation to elevation, as if their formation were related to past water levels. Although these observations are based on older data with incomplete coverage, a similar correlation to elevation has been established in one local area studied in detail with newer higher-resolution data. Further mapping with the latest data sets should more clearly elucidate the relationship(s) of the polygons and mounds to elevation over the entire Chryse-Acidalia region and thereby provide more insight into this

  7. Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly

    El-Daly, A.A., E-mail: [Physics Department, Faculty of Science, Zagazig Univ., Zagazig (Egypt); Center of Nanotechnology, Zagazig Univ., Zagazig (Egypt); El-Taher, A.M. [Physics Department, Faculty of Science, Zagazig Univ., Zagazig (Egypt); Center of Nanotechnology, Zagazig Univ., Zagazig (Egypt); Gouda, S. [Physics Department, Faculty of Science, Zagazig Univ., Zagazig (Egypt)


    Highlights: • Small amounts of Bi have been added into Sn–1.5Ag–0.7Cu solder. • Bi reduced the undercooling and eutectic temperature of SAC257 solder. • Bi refined the microstructure and diminishes the nucleation rate of IMCs. • Bi increased the creep resistance and fracture lifetime of the solder. • Overall SAC properties can be improved adding not more than 3 wt.% Bi. - Abstract: Eutectic Sn–Ag–Cu (SAC) solder is one of the candidate alternatives to Sn–Pb-based solder alloys. The coupling effect of both minor alloying Bi addition and reducing the amount of Ag phase have been proposed as an important approach to optimize existing and to develop new SAC solders. Characteristics of new Sn–Ag–Cu–Bi solders were analyzed and compared with those of as-solidified Sn–1.5Ag–0.7Cu (SAC157) alloy. The results of differential scanning calorimetry (DSC) indicate significant reduction of both undercooling, eutectic temperature, solidus and liquidus temperatures with the addition of Bi into SAC(157) solder, although the pasty range remains the same or slightly increased. Moreover, SAC(157) solders containing Bi were found to have a higher creep resistance (126.1 times) than SAC(157) solder at the same stress level and testing temperature. The higher creep resistance was contributed by the solid solution and precipitations strengthen effects of Bi. The precipitation of these Bi atoms or particles can significantly refine the microstructure, blocks the movement of dislocations and increases the creep resistance of Bi-containing solders. The creep life time of plain SAC(157) alloy was extremely enlarged 23.7 times with the addition of 3 wt.% Bi. Constitutive Garofalo model of creep for both SAC(157) and Sn–Ag–Cu–Bi solders was assembled based on the experimental data.



    CERN's anemones will soon be orphans. We are looking for someone willing to look after the aquarium in the main building, for one year. If you are interested, or if you would like more information, please call 73830. (The anemones living in the aquarium thank you in anticipation.)

  9. A call for surveys

    Bernstein, Philip A.; Jensen, Christian S.; Tan, Kian-Lee


    The database field is experiencing an increasing need for survey papers. We call on more researchers to set aside time for this important writing activity. The database field is growing in population, scope of topics covered, and the number of papers published. Each year, thousands of new papers...

  10. A call for surveys

    Bernstein, Philip A.; Jensen, Christian S.; Tan, Kian-Lee


    The database field is experiencing an increasing need for survey papers. We call on more researchers to set aside time for this important writing activity. The database field is growing in population, scope of topics covered, and the number of papers published. Each year, thousands of new papers ...

  11. Sub-kilometre (intra-crater) mounds in Utopia Planitia, Mars: character, occurrence and possible formation hypotheses

    Soare, Richard J.; Conway, Susan J.; Pearce, Geoffrey D.; Costard, François; Séjourné, Antoine


    At the middle latitudes of Utopia Planitia (˜35-45°N; ˜65-101°E) hundreds of small-sized mounds located in sub-kilometre impact craters dot the landscape. Their shape varies from circular to crescentic and their height ranges from ˜10 to 50 m. Often, metre to decametre pitting is observed, as is metres-thick banding or stratification. Mound albedo is relatively high, i.e. ˜0.16. The plain's terrain in the region, previously linked to the latitude-dependent mantle (LDM) of ice-dust, displays pitting and albedo similar to the small intra-crater mounds. Some workers have suggested that the mounds and the plain's terrain share a common ice-dust origin. If so, then scrutinising the mounds could provide analogical insight on the key geological characteristics and spatial distribution of the LDM itself. Other workers have hypothesised that the mounds are eroded sedimentary landforms or periglacial mounds underlain by a perennial ice-core (closed-system pingos). In this article we develop and then discuss each of the three mound-hypotheses in a much more substantial manner than has been done hitherto. Towards this end we use high-resolution images, present a detailed regional-map of mound distribution and establish a regional platform of topographical analysis using MOLA data superposed on a large-scale CTX mosaic. Although the ice-dust hypothesis is consistent with some observations and measurements, we find that a (loess-based) sedimentary hypothesis shows greater plausibility. Of the three hypotheses evaluated, the pingo or periglacial one is the weakest.

  12. Study on Solder Joint Reliability of Plastic Ball Grid Array Component Based on SMT Products Virtual Assembly Technology

    HUANG Chunyue; WU Zhaohua; ZHOU Dejian


    Based on surface mount products virtual assembly technology, the solder joint reliability of plastic ball grid array (PBGA) was studied. Four process parameters, including the upper pad diameter,the stencil thickness, the chip weight on a single solder joint and the lower pad diameter were chose as four control factors. By using an L25(56) orthogonal array the PBGA solder joints which have 25 different process parameters' levels combinations were designed. The numerical models of all the 25 PBGA solder joints were developed and the finite element analysis models were setup. The stress and strain distribution within the PBGA solder joints under thermal cycles were studied by finite element analysis, and the thermal fatigue life of PBGA solder joint was calculated using Coffin-Manson equation. Based on the calculated thermal fatigue life results, the range analysis was performed. The results of study show that that the impact sequence of the four factors from high to low on the fatigue life of PBGA solder joints are the stencil thickness,the upper pad diameter, the lower pad diameter and the chip weight on a single solder joint; the best level combination ofprocess parameters that results in the longest fatigue life is the lower pad diameter of 0.6 mm, the stencil thickness of 0.175 mm, the chip weight on asingle solder joint of 28×10-5 N and the upper pad diameter of 0.5 mm.

  13. Effect of Lanthanum on Driving Force for Cu6Sn5 Growth and Improvement of Solder Joint Reliability


    By means of adding low content of rare earth element La into Sn60-Pb40 solder alloy, the growth of Cu6Sn5 intermetallic compound at the interface of solder joint is hindered, and the thermal fatigue life of solder joint is increased by 2 times. The results of thermodynamic calculation based on diffusion kinetics show that, the driving force for Cu6Sn5 growth is lowered by adding small content of La in Sn60-Pb40 solder alloy. Meanwhile, there is an effective local mole fraction range of La, in which, 0.18% is the limited value and 0.08% is the best value.

  14. Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB

    Kim, Jungsoo; Myung, Woo-Ram; Jung, Seung-Boo


    The mechanical properties of Sn-58Bi epoxy solder were evaluated by low-speed shear testing as functions of aging time and temperature. To determine the effects of epoxy, the interfacial reaction and mechanical properties of both Sn-58Bi and Sn-58Bi epoxy solder were investigated after aging treatment. The chemical composition and growth kinetics of the intermetallic compound (IMC) formed at the interface between Sn-58Bi solder and electroless nickel electroless palladium immersion gold (ENEPIG) surface finish were analyzed. Sn-58Bi solder paste was applied by stencil-printing on flame retardant-4 substrate, then reflowed. Reflowed samples were aged at 85°C, 95°C, 105°C, and 115°C for up to 1000 h. (Ni,Pd)3Sn4 IMC formed between Sn-58Bi solder and ENEPIG surface finish after reflow. Ni3Sn4 and Ni3P IMCs formed at the interface between (Ni,Pd)3Sn4 IMC and ENEPIG surface finish after aging at 115°C for 300 h. The overall IMC growth rate of Sn-58Bi solder joint was higher than that of Sn-58Bi epoxy solder joint during aging. The shear strength of Sn-58Bi epoxy solder was about 2.4 times higher than that of Sn-58Bi solder due to the blocking effect of epoxy, and the shear strength decreased with increasing aging time.

  15. Electrodeposition of lead-free, tin-based alloy solder films

    Han, Chunfen

    The dominant materials used for solders in electronic assemblies over the past 60 years have been Pb-Sn alloys. Increasing pressure from environmental and health authorities has stimulated the development of various Pb-free solders. Two of the most promising replacements are eutectic Sn-Cu and Sn-Ag-Cu alloys that are produced primarily by electrodeposition. During soldering and solid state aging (storage or in service of the electronic assemblies), interactions take place at the solder/substrate metal interface and form intermetallic compounds (IMCs) which are crucial for the reliability of the solder joints. Simple and "green" Sn-citrate and Sn-Cu-citrate solutions have been developed and optimized to electrodeposit eutectic and near eutectic Sn-Cu solder films. Sn-citrate suspensions with Cu particles and Sn-Cu-citrate suspensions with Ag nano-particles have also been developed and optimized to allow for electrochemical composite deposition of eutectic and near eutectic Sn-Cu and Sn-Ag-Cu solder films. Different plating and post-plating conditions, including solution concentration, current density, agitation, additives, and aging, have been investigated by evaluating their effects on plating rate, deposit composition and microstructure. Tri-ammonium citrate is used as the only complexing agent for Sn, Sn-Cu, and Sn-Ag-Cu deposition. Speciation diagram calculations, reduction potential calculations, and polarization studies are conducted to study Sn-citrate solution chemistry and the kinetics of Sn electrodeposition. X-ray photoelectron spectroscopy (XPS) analysis is used to identify the precipitates formed in Sn-citrate solutions at low pH. Current-controlled and potential-controlled electrochemical techniques, nucleation modeling, and surface morphology characterization techniques are applied to study the nucleation and film growth mechanism of Sn and Sn-Cu electrodeposition from Sn-citrate and Sn-Cu-citrate solutions. Reflow and aging tests for deposited Sn

  16. Laser solder repair technique for nerve anastomosis: temperatures required for optimal tensile strength

    McNally-Heintzelman, Karen M.; Dawes, Judith M.; Lauto, Antonio; Parker, Anthony E.; Owen, Earl R.; Piper, James A.


    Laser-assisted repair of nerves is often unsatisfactory and has a high failure rate. Two disadvantages of laser assisted procedures are low initial strength of the resulting anastomosis and thermal damage of tissue by laser heating. Temporary or permanent stay sutures are used and fluid solders have been proposed to increase the strength of the repair. These techniques, however, have their own disadvantages including foreign body reaction and difficulty of application. To address these problems solid protein solder strips have been developed for use in conjunction with a diode laser for nerve anastomosis. The protein helps to supplement the bond, especially in the acute healing phase up to five days post- operative. Indocyanine green dye is added to the protein solder to absorb a laser wavelength (approximately 800 nm) that is poorly absorbed by water and other bodily tissues. This reduces the collateral thermal damage typically associated with other laser techniques. An investigation of the feasibility of the laser-solder repair technique in terms of required laser irradiance, tensile strength of the repair, and solder and tissue temperature is reported here. The tensile strength of repaired nerves rose steadily with laser irradiance reaching a maximum of 105 plus or minus 10 at 12.7 When higher laser irradiances were used the tensile strength of the resulting bonds dropped. Histopathological analysis of the laser- soldered nerves, conducted immediately after surgery, showed the solder to have adhered well to the perineurial membrane, with minimal damage to the inner axons of the nerve. The maximum temperature reached at the solder surface and at the solder/nerve interface, measured using a non-contact fiber optic radiometer and thermocouple respectively, also rose steadily with laser irradiance. At 12.7, the temperatures reached at the surface and at the interface were 85 plus or minus 4 and 68 plus or minus 4 degrees Celsius respectively

  17. Flight calls and orientation

    Larsen, Ole Næsbye; Andersen, Bent Bach; Kropp, Wibke


    flight calls was simulated by sequential computer controlled activation of five loudspeakers placed in a linear array perpendicular to the bird's migration course. The bird responded to this stimulation by changing its migratory course in the direction of that of the ‘flying conspecifics' but after about......  In a pilot experiment a European Robin, Erithacus rubecula, expressing migratory restlessness with a stable orientation, was video filmed in the dark with an infrared camera and its directional migratory activity was recorded. The flight overhead of migrating conspecifics uttering nocturnal...... 30 minutes it drifted back to its original migration course. The results suggest that songbirds migrating alone at night can use the flight calls from conspecifics as additional cues for orientation and that they may compare this information with other cues to decide what course to keep....

  18. Calling Dunbar's Numbers

    MacCarron, Pádraig; Dunbar, Robin


    The social brain hypothesis predicts that humans have an average of about 150 relationships at any given time. Within this 150, there are layers of friends of an ego, where the number of friends in a layer increases as the emotional closeness decreases. Here we analyse a mobile phone dataset, firstly, to ascertain whether layers of friends can be identified based on call frequency. We then apply different clustering algorithms to break the call frequency of egos into clusters and compare the number of alters in each cluster with the layer size predicted by the social brain hypothesis. In this dataset we find strong evidence for the existence of a layered structure. The clustering yields results that match well with previous studies for the innermost and outermost layers, but for layers in between we observe large variability.

  19. Flight calls and orientation

    Larsen, Ole Næsbye; Andersen, Bent Bach; Kropp, Wibke


      In a pilot experiment a European Robin, Erithacus rubecula, expressing migratory restlessness with a stable orientation, was video filmed in the dark with an infrared camera and its directional migratory activity was recorded. The flight overhead of migrating conspecifics uttering nocturnal...... flight calls was simulated by sequential computer controlled activation of five loudspeakers placed in a linear array perpendicular to the bird's migration course. The bird responded to this stimulation by changing its migratory course in the direction of that of the ‘flying conspecifics' but after about...... 30 minutes it drifted back to its original migration course. The results suggest that songbirds migrating alone at night can use the flight calls from conspecifics as additional cues for orientation and that they may compare this information with other cues to decide what course to keep....

  20. Call centres: constructing flexibility

    Arzbächer, Sandra; Holtgrewe, Ursula; Kerst, Christian


    "The development of call centres as a flexible interface between firms and their environments has been seen as exemplary or even symptomatic of flexible capitalism (Sennett 1998). We are going to point out that they do not just stand for organisational change but also for changes of institutions towards deregulation. Employers and managers hoped for gains of flexibility, decreasing labour costs, and market gains by an expanded 24-hour-service. Surveillance and control by flexib...

  1. The CARBONATE project: Mid-latitude Carbonate Systems - Complete Sequences from Cold-Water Coral Carbonate Mounds in the Northeast Atlantic

    Wheeler, A.; Freiwald, A.; Hebbeln, D.; Swennen, R.; van Weering, T.; de Haas, H.; Dorschel, B.


    Up to now the carbonate stored in carbonate mounds has not been considered in any global carbonate budget or linked to any global carbon budget involving greenhouse gases. A major challenge exists to quantify the amount and flux of carbon stored by these newly discovered areas of enhanced carbonate accumulation in intermediate water depth. Furthermore, investigations so far reveal that all mounds possess different growth histories depending on the environmental setting and the involved faunal associations. Unfortunately, existing cores only penetrated the upper few meters of the mounds thus limiting mound research to the very late stage of mound development. Access to the longer sequences preserved in giant carbonate mounds was overcome in May 2005 when the IODP Expedition 307 (Porcupine Mound Drilling) recovered complete sedimentary records from one 155 m high "Challenger Mound" in the Porcupine Seabight west off Ireland. Furthermore, EU-FP projects have revealed late stage history of giant mounds in different settings showing that different mounds respond in different ways to environmental forcing factors with no one mound being typical of all. CARBONATE will drill complete sequences through a number of mounds in differing environmental settings using the portable drill rig MeBo (University of Bremen). By understanding how biogeochemical processes control the development of these carbonate mounds and their response to climate change, we will make an important step in quantifying their role as mid-latitude carbonate sinks. In the end, a better understanding of the processes involved in mound formation and development may also result in new views on fossil analogues many of which are less accessible hydrocarbon reservoirs.

  2. Intermetallic compound formation at Sn-3.0Ag-0.5Cu-1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions

    Wang, Feng-Jiang [Department of Materials Science and Engineering, Shanghai University of Engineering Science, Shanghai 201620 (China)]. E-mail:; Yu, Zhi-Shui [Department of Materials Science and Engineering, Shanghai University of Engineering Science, Shanghai 201620 (China); Qi, Kai [Department of Materials Science and Engineering, Shanghai University of Engineering Science, Shanghai 201620 (China)


    Intermetallic formations of Sn-3.0Ag-0.5Cu solder alloy with additional 1.0 wt% Zn were investigated for Cu-substrate during soldering and isothermal aging. During soldering condition, the Cu{sub 5}Zn{sub 8} compound with granular-type morphology is the interfacial IMC for Sn-3.0Ag-0.5Cu-1.0Zn solder, while the Cu{sub 6}Sn{sub 5} compound with scallop-type morphology is the interfacial IMC for Sn-3.0Ag-0.5Cu solder. During thermal aging, the final interfacial structure for Sn-3.0Ag-0.5Cu-1.0Zn solder is solder/Cu{sub 5}Zn{sub 8}/Cu{sub 6}Sn{sub 5}/Cu{sub 3}Sn/Cu, different from the solder/Cu{sub 6}Sn{sub 5}/Cu{sub 3}Sn/Cu for Sn-3.0Ag-0.5Cu solder. The thickness of Cu-Sn IMC layers increases, while the thickness of Cu{sub 5}Zn{sub 8} compound layer decreases with increasing aging time due to the decomposition of the Cu{sub 5}Zn{sub 8} layer by the diffusion of Cu and Zn atoms into the solder and Cu{sub 6}Sn{sub 5} at higher aging temperature. For Sn-3.0Ag-0.5Cu-1.0Zn solder, at higher aging temperature of 150 or 175 {sup o}C, with the formation of Cu{sub 3}Sn at Cu{sub 6}Sn{sub 5}/Cu, Kirkendall voids can be observed at the interface of Cu{sub 3}Sn/Cu.

  3. Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad

    WANG Jian-xin; XUE Song-bai; FANG Dian-song; JU Jin-long; HAN Zong-jie; YAO Li-hua


    Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow soldering methods respectively. The influence of different heating methods as well as output power of diode-laser on shear force of micro-joints was studied and the relationship between the shear force and microstructures of micro-joints was analyzed.The results indicate that the formation of intermetallic compound Ag3Sn is the key factor to affect the shear force and the fine eutectic network structures of micro-joints as well as the dispersion morphology of fine compound Ag3Sn, in which eutectic network band is responsible for the improvement of the shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder. With the increases of output power of diode-laser, the shear force and the microstructures change obviously. The eutectic network structures of micro-joints soldered with diode-laser soldering method are more homogeneous and the grains of Ag3Sn compounds are finer in the range of near optimal output power than those soldered with IR reflow soldering method, so the shear force is also higher than that using IR reflow soldering method. When the output power value of diode-laser is about 41.0 W, the shear force exhibits the highest value that is 70% higher than that using IR reflow soldering method.

  4. How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

    Suhir, E.; Yi, S.; Ghaffarian, R.


    It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

  5. Effects of Ga Addition on Interfacial Reactions Between Sn-Based Solders and Ni

    Wang, Chao-Hong; Li, Kuan-Ting


    The use of Ga as a micro-alloying element in Sn-based solders can change the microstructure of solder joints to improve the mechanical properties, and even suppress the interfacial intermetallic compound (IMC) growth. This research investigated the effects of Ga addition (0.2-1 wt.%Ga) on the IMC formation and morphological evolution in the Sn-based solder joints with Ni substrate. In the soldering reaction at 250°C and with less than 0.2 wt.%Ga addition, the formed phase was Ni3Sn4. When the Ga addition increased to 0.5 wt.%, it changed to a thin Ni2Ga3 layer of ˜1 μm thick, which stably existed at the interface in the initial 1-h reaction. Subsequently, the whole Ni2Ga3 layer detached from the Ni substrate and drifted into the molten solder. The Ni3Sn4 phase became dominant in the later stage. Notably, the Ga addition significantly reduced the grain size of Ni3Sn4, resulting in the massive spalling of Ni3Sn4 grains. With 1 wt.%Ga addition, the Ni2Ga3 layer remained very thin with no significant growth, and it stably existed at the interface for more than 10 h. In addition, the solid-state reactions were examined at temperatures of 160°C to 200°C. With addition of 0.5 wt.%Ga, the Ni3Sn4 phase dominated the whole reaction. By contrast, with increasing to 1 wt.%Ga, only a thin Ni2Ga3 layer was found even after aging at 160°C for more than 1200 h. The 1 wt.%Ga addition in solder can effectively inhibit the Ni3Sn4 formation in soldering and the long-term aging process.

  6. High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

    Shnawah, Dhafer Abdulameer; Said, Suhana Binti Mohd; Sabri, Mohd Faizul Mohd; Badruddin, Irfan Anjum; Che, Fa Xing


    Sn-Ag-Cu (SAC) alloy is currently recognized as the standard lead-free solder alloy for packaging of interconnects in the electronics industry, and high- Ag-content SAC alloys are the most popular choice. However, this choice has been encumbered by the fragility of the solder joints that has been observed in drop testing as well as the high cost of the Ag itself. Therefore, low-Ag-content SAC alloy was considered as a solution for both issues. However, this approach may compromise the thermal-cycling performance of the solders. Therefore, to enhance the thermal-cycling reliability of low-Ag-content SAC alloys without sacrificing their drop-impact performance, alloying elements such as Mn, Ce, Ti, Bi, In, Sb, Ni, Zn, Al, Fe, and Co were selected as additions to these alloys. However, research reports related to these modified SAC alloys are limited. To address this paucity, the present study reviews the effect of these minor alloying elements on the solder joint reliability of low-Ag-content SAC alloys in terms of thermal cycling and drop impact. Addition of Mn, Ce, Bi, and Ni to low-Ag-content SAC solder effectively improves the thermal-cycling reliability of joints without sacrificing the drop-impact performance. Taking into consideration the improvement in the bulk alloy microstructure and mechanical properties, wetting properties, and growth suppression of the interface intermetallic compound (IMC) layers, addition of Ti, In, Sb, Zn, Al, Fe, and Co to low-Ag-content SAC solder has the potential to improve the thermal-cycling reliability of joints without sacrificing the drop-impact performance. Consequently, further investigations of both thermal-cycling and drop reliability of these modified solder joints must be carried out in future work.


    XUE Songbai; WU Yuxiu; HAN Zongjie; WANG Jianxin


    The finite element method(FEM) is used to analyze the effects of lead widths and pitches on reliability of soldered joints. The optimum Simulation for QFP devices is also researched. The results indicate that when the lead pitches are the same, the maximum equivalent stress of the soldered joints increases with the increasing of lead widths, while the reliability of the soldered joints reduces. When the lead widths are the same, the maximum equivalent stress of the soldered joints doesn't decrease completely with the increasing of lead pitches, a minimum value of the maximum equivalent stress values exists in all the curves. Under this condition the maximum equivalent stress of the soldered joints is relatively the least, the reliability of soldered joints is high and the assembly is excellent. The simulating results indicate the best parameter: The lead width is 0.2 mm and lead pitch is 0.3 mm (the distance between two leads is 0.1 mm), which are benefited for the micromation of QFP devices now. The minimum value of the maximum equivalent stress of soldered joints exists while lead width is 0.25 mm and lead pitch is 0.35 mm (the distance between two leads is 0.1 mm), the devices can serve for a long time and the reliability is the highest, the assembly is excellent. The simulating results also indicate the fact that the lead width is 0.15 mm and lead pitch is 0.2 mm maybe the limit of QFP, which is significant for the high lead count and micromation of assembly.

  8. The critical oxide thickness for Pb-free reflow soldering on Cu substrate

    Chung, C. Key [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Assembly Test Global Materials, Intel Microelectronics Asia Ltd, B1, No. 205, Tun-Hwa North Road, 10595 Taipei, Taiwan (China); Chen, Y.J.; Li, C.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Kao, C.R., E-mail: [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China)


    Oxidation is an undesirable effect of reflow soldering. Non-wetting occurs when the oxide layer grows above the critical thickness. Characterizing the critical oxide thickness for soldering is challenging due to oxide's nano-scale thickness and irregular topographic surface. In this paper, the critical copper oxide thickness was characterized by Time-of-Flight Secondary Ion Mass Spectrometry, Scanning Electron Microscopy, Energy-Dispersive X-ray spectroscopy, and Transmission Electron Microscopy. Copper substrates were coated with an Organic-Solderable-Preservative (OSP) layer and baked at 150 Degree-Sign C and 85% Relative Humidity for different amounts of time. The onset of the non-wetting phenomenon occurred when the oxide thickness reached 18 {+-} 5 nm. As the oxide grew beyond this critical thickness, the percentage of non-wetting solder joint increased exponentially. The growth of the oxide thickness followed a parabolic rate law. The rate constant of oxidation was 0.6 Multiplication-Sign 10{sup -15} cm{sup 2} min{sup -1}. Oxidation resulted from interdiffusion of copper and oxygen atoms through the OSP and oxide layers. The oxidation mechanism will be presented and discussed. - Highlights: Black-Right-Pointing-Pointer Critical oxide thickness for Pb free solder on Cu substrate is 18 {+-} 5 nm. Black-Right-Pointing-Pointer Above the critical oxide, non-wet solder joint increases exponentially. Black-Right-Pointing-Pointer A maximum 13-nm oxide thickness is suggested for good solder joint. Black-Right-Pointing-Pointer Initial growth of oxide thickness is logarithmic and then parabolic after 12 nm. Black-Right-Pointing-Pointer Thick oxide (360-560 nm) is formed as pores shorten the oxidation path.

  9. Effects of Ga Addition on Interfacial Reactions Between Sn-Based Solders and Ni

    Wang, Chao-Hong; Li, Kuan-Ting


    The use of Ga as a micro-alloying element in Sn-based solders can change the microstructure of solder joints to improve the mechanical properties, and even suppress the interfacial intermetallic compound (IMC) growth. This research investigated the effects of Ga addition (0.2-1 wt.%Ga) on the IMC formation and morphological evolution in the Sn-based solder joints with Ni substrate. In the soldering reaction at 250°C and with less than 0.2 wt.%Ga addition, the formed phase was Ni3Sn4. When the Ga addition increased to 0.5 wt.%, it changed to a thin Ni2Ga3 layer of ˜1 μm thick, which stably existed at the interface in the initial 1-h reaction. Subsequently, the whole Ni2Ga3 layer detached from the Ni substrate and drifted into the molten solder. The Ni3Sn4 phase became dominant in the later stage. Notably, the Ga addition significantly reduced the grain size of Ni3Sn4, resulting in the massive spalling of Ni3Sn4 grains. With 1 wt.%Ga addition, the Ni2Ga3 layer remained very thin with no significant growth, and it stably existed at the interface for more than 10 h. In addition, the solid-state reactions were examined at temperatures of 160°C to 200°C. With addition of 0.5 wt.%Ga, the Ni3Sn4 phase dominated the whole reaction. By contrast, with increasing to 1 wt.%Ga, only a thin Ni2Ga3 layer was found even after aging at 160°C for more than 1200 h. The 1 wt.%Ga addition in solder can effectively inhibit the Ni3Sn4 formation in soldering and the long-term aging process.

  10. Mechanical Properties and Microstructure Investigation of Lead Free Solder

    Wang, Qing; Gail, William F.; Johnson, R. Wayne; Strickland, Mark; Blanche, Jim


    While the electronics industry appears to be focusing on Sn-Ag-Cu as the alloy of choice for lead free electronics assembly, ,the exact composition varies by geographic region, supplier and user. Add to that dissolved copper and silver from the printed circuit board traces and surface finish, and there can be significant variation in the final solder joint composition. A systematic study of the mechanical and microstructural properties of Sn-Ag-Cu alloys with Ag varying from 2wt% to 4wt% and Cu varying from 0.5wt% to lSwt%, was undertaken in this research study. Different sample preparation techniques (water quenched, oil quenched and water quenched followed by reflow) were explored and the resulting microstructure compared to that of a typical reflowed lead free chip scale package (CSP) solder joint. Tensile properties (modulus, 0.2% yield strength and the ultimate tensile strength) and creep behavior of selected alloy compositions (Sn-4Ag-1 X u , Sn-4Ag-OSCu, Sn- 2Ag-1 X u , Sn-2Ag-OSCu, Sn-3.5Ag-O.SCu) were determined for three conditions: as- cast; aged for 100 hours at 125OC; and aged for 250 hours at 125OC. There was no significant difference in Young's Modulus as a function of alloy composition. After an initial decrease in modulus after 100 hours at 125"C, there was an insignificant change with further aging. The distribution of 0.2% strain yield stress and ultimate tensile strength as a function of alloy composition was more significant and decreased with aging time and temperature. The microstructures of these alloys were examined using light and scanning electron microscopy (LM and SEM) respectively and SEM based energy dispersive x-ray spectroscopy (EDS). Fracture surface and cross-section analysis were performed on the specimens after creep testing. The creep testing results and the effect of high temperature aging on mechanical properties is presented for the oil quenched samples. In general the microstructure of oil quenched specimen exhibited a

  11. Oxidation kinetics of thin copper films and wetting behaviour of copper and Organic Solderability Preservatives (OSP) with lead-free solder

    Ramirez, Mauricio, E-mail: [Robert Bosch GmbH, Robert-Bosch-Strasse 2, 71701 Schwieberdingen (Germany); Chair for Surface Science and Corrosion, University of Erlangen-Nuremberg, Martensstrasse 7, 91058 Erlangen (Germany); Henneken, Lothar [Robert Bosch GmbH, Robert-Bosch-Strasse 2, 71701 Schwieberdingen (Germany); Virtanen, Sannakaisa [Chair for Surface Science and Corrosion, University of Erlangen-Nuremberg, Martensstrasse 7, 91058 Erlangen (Germany)


    The oxide formation on thin copper films deposited on Si wafer was studied by XPS, SEM and Sequential Electrochemical Reduction Analysis SERA. The surfaces were oxidized in air with a reflow oven as used in electronic assembly at temperatures of 100 deg. C, 155 deg. C, 200 deg. C, 230 deg. C and 260 deg. C. The SERA analyses detected only the formation of Cu{sub 2}O but the XPS analysis done for the calibration of the SERA equipment proved also the presence of a CuO layer smaller than 2 nm above the Cu{sub 2}O oxide. The oxide growth follows a power-law dependence on time within this temperature range and an activation energy of 33.1 kJ/mol was obtained. The wettability of these surfaces was also determined by measuring the contact angle between solder and copper substrate after the soldering process. A correlation between oxide thickness and wetting angle was established. It was found that the wetting is acceptable only when the oxide thickness is smaller than 16 nm. An activation energy of 27 kJ/mol was acquired for the spreading of lead free solder on oxidized copper surfaces. From wetting tests on copper surfaces protected by Organic Solderability Preservatives (OSP), it was possible to calculate the activation energy for the thermal decomposition of these protective layers.

  12. Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

    Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak


    To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys (T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

  13. How Dolphins Call



    <正>与人类一样,海豚能通过声音相互称呼"名字"。A high-pitched"wee-o-wee-o-wee-o-wee"whistle might not soundlike much to you,but it6s exactly how a dolphin might introduce itself.Because sight is limited in the ocean,dolphins create individual"name"calls to communicate their whereabouts to friends and families.But it6snot as simple as just recognizing a voice,

  14. Heed the Calls


    @@ THE bombing of Libya by some of the world's major powers, including France, the United States and Britain brought a new dimension to the protests that have washed over North Africa and the Middle East in the past months.Following the UN Security Council passing the imposition of a no-fly zone over Libyan air-space, a move supported by Nigeria, South Africa and Gabon, air and sea strikes pounded Muammar Gadhafi's strongholds.The AU called for an immediate stop to hostilities on both sides.

  15. Heed the Calls


    THE bombing of Libya by some of the world’s major powers,including France, the United States and Britain brought a new dimension to the protests that have washed over North Africa and the Middle East in the past months.Following the UN Security Council passing the imposition of a no-fly zone over Libyan air-space,a move supported by Nigeria,South Africa and Gabon,air and sea strikes pounded Muammar Gadhafi’s strongholds.The AU called for an immediate stop to hostilities

  16. Emergency Call Reform


    China merges several hotline call services in an effort to streamline the urban emergency system Chances are that if you find yourself in a crisis situation in China, dialing the correct emergency number could be a problem. Not because there isn't one, but quite the opposite. China has four main emergency response numbers-110 summons police help in a life-threatening situation, 119 brings out firefighters, 122 gets police activated to sort out traffic accidents and 120 ensures medical help. Along with th...

  17. Meteoritic Metal Beads from the Havana, Illinois, Hopewell Mounds: A Source in Minnesota and Implications for Trade and Manufacture

    McCoy, T. J.; Marquardt, A. E.; Vicenzi, E. P.; Ash, R. D.; Wasson, J. T.


    Meteoritic metal beads from an Illinois Hopewell burial mound (~350 BCE) are pieces of the Anoka, Minnesota iron, which were worked in Ohio or Michigan and transported to Illinois as a finished product.

  18. Growth and form of the mound in Gale Crater, Mars: Slope-wind enhanced erosion and transport

    Kite, Edwin S


    Gale crater, the landing site of the Curiosity Mars rover, hosts a 5 kilometer high layered mound of uncertain origin which may represent an important archive of the planet's past climate. Although widely considered to be an erosional remnant of a once crater-filling unit, we combine structural measurements and a new model of formation to show how this mound may have grown in place near the center of the crater under the influence of topographic slope-induced winds. This mechanism implicates airfall-dominated deposition with a limited role for lacustrine or fluvial activity in the formation of the Gale mound, and is not favorable for the preservation of organic carbon. Slope-wind enhanced erosion and transport is widely applicable to a range of similar sedimentary mounds found across the Martian surface.

  19. An Island Called Cuba

    Jean Stubbs


    Full Text Available Review of: An Island Called Home: Returning to Jewish Cuba. Ruth Behar, photographs by Humberto Mayol. New Brunswick NJ: Rutgers University Press, 2007. xiii + 297 pp. (Cloth US$ 29.95 Fidel Castro: My Life: A Spoken Autobiography. Fidel Castro & Ignacio Ramonet. New York: Scribner/Simon & Schuster, 2008. vii + 724 pp. (Paper US$ 22.00, e-book US$ 14.99 Cuba: What Everyone Needs to Know. Julia E. Sweig. New York: Oxford University Press, 2009. xiv + 279 pp. (Paper US$ 16.95 [First paragraph] These three ostensibly very different books tell a compelling story of each author’s approach, as much as the subject matter itself. Fidel Castro: My Life: A Spoken Autobiography is based on a series of long interviews granted by the then-president of Cuba, Fidel Castro, to Spanish-Franco journalist Ignacio Ramonet. Cuba: What Everyone Needs to Know, by U.S. political analyst Julia Sweig, is one of a set country series, and, like Ramonet’s, presented in question/answer format. An Island Called Home: Returning to Jewish Cuba, with a narrative by Cuban-American anthropologist Ruth Behar and photographs by Cuban photographer Humberto Mayol, is a retrospective/introspective account of the Jewish presence in Cuba. While from Ramonet and Sweig we learn much about the revolutionary project, Behar and Mayol convey the lived experience of the small Jewish community against that backdrop.

  20. Too close to call

    Kurrild-Klitgaard, Peter


    The note briefly outlines a new model for the explanation of US presidential elections, founded on (a) recent economic growth and (b) a measure of what may be called “’the cost of ruling”. The former is based in changes in real disposable income for the period following a mid-term election, while...... the latter combines factors of incumbency and terms-in-office. The model is applied to data from the US presidential elections 1932-2008 and has considerable explanatory power for the variation in the incumbent party’s candidate’s share of the two-party vote (R2=0.74). The model is controlled against...... a number of other frequent explanations and is found to be quite robust. When augmented with approval ratings for incumbent presidents, the explanatory power increases to 83 pct. and only incorrectly calls one of the last 15 US presidential elections. Applied to the 2012 election as a forecasting model...


    Service Médical


    IN URGENT NEED OF A DOCTOR GENEVA: EMERGENCY SERVICES GENEVA AND VAUD 144 FIRE BRIGADE 118 POLICE 117 CERN FIREMEN 767-44-44 ANTI-POISONS CENTRE Open 24h/24h 01-251-51-51 Patient not fit to be moved, call family doctor, or: GP AT HOME: Open 24h/24h 748-49-50 AMG- Association Of Geneva Doctors: Emergency Doctors at home 07h-23h 322 20 20 Patient fit to be moved: HOPITAL CANTONAL CENTRAL 24 Micheli-du-Crest 372-33-11 ou 382-33-11 EMERGENCIES 382-33-11 ou 372-33-11 CHILDREN'S HOSPITAL 6 rue Willy-Donzé 372-33-11 MATERNITY 32 la Cluse 382-68-16 ou 382-33-11 OPHTHALMOLOGY 22 Alcide Jentzer 382-33-11 ou 372-33-11 MEDICAL CENTRE CORNAVIN 1-3 rue du Jura 345 45 50 HOPITAL DE LA TOUR Meyrin 719-61-11 EMERGENCIES 719-61-11 CHILDREN'S EMERGENCIES 719-61-00 LA TOUR MEDICAL CENTRE 719-74-00 European Emergency Call 112   FRANCE: EMERGENCY SERVICES 15 FIRE BRIGADE 18 POLICE 17 CERN FIREMEN AT HOME 00-41-22-767-44-44 ...

  2. Call for volunteers


    CERN is calling for volunteers from all members of the Laboratory for organizing the two exceptional Open days.CERN is calling for volunteers from all members of the Laboratory’s personnel to help with the organisation of these two exceptional Open Days, for the visits of CERN personnel and their families on the Saturday and above all for the major public Open Day on the Sunday. As for the 50th anniversary in 2004, the success of the Open Days will depend on a large number of volunteers. All those working for CERN as well as retired members of the personnel can contribute to making this event a success. Many guides will be needed at the LHC points, for the activities at the surface and to man the reception and information points. The aim of these major Open Days is to give the local populations the opportunity to discover the fruits of almost 20 years of work carried out at CERN. We are hoping for some 2000 volunteers for the two Open Days, on the Saturday from 9 a.m. to ...

  3. Deep Explosive Volcanism on the Gakkel Ridge and Seismological Constraints on Shallow Recharge at TAG Active Mound


    in the mantle, where rigid tectonic plates move apart and new seafloor material rises to fill the vacant space. The generation of new plate material...focus on shallow seismic activity beneath the hydrothermal mound. The OBS network also detected a large number of local and regional tectonic events...hydrothermal mound with the larger-scale seismicity associated with tectonic extension on the active detachment fault [deMartin et al., 2007]. Thermal

  4. Multi-beam backscatter data to characterize the mound and channel provinces of the Porcupine Seabight - northeast Atlantic margin

    Beyer, A.; Chakraborty, B.; Schenke, H. W.


    Large scale oceanographic explorations are presently continuing around the Porcupine Seabight area, which is located towards the south-west Ireland. This area is an embayment of the north Atlantic continental margins. It's importance due to the dominant hydrocarbon resources are not unknown, and on-going experiments are important due to the involvement of higher order variability (in terms of physical and geological settings) around this area. Multi-beam angular backscatter study to characterize the eastern slope seafloor of the Porcupine Seabight is initiated first time. Backscatter data acquired from twenty-nine locations of the carbonate mounds and associated buried mounds (Belgica province), and channel seafloors like: Kings channel and Gollum channels are analysed in this paper. Processing details of the angular backscatter data was carried out to apply the scattering models to determine seafloor roughness. Employed normalization to the angular backscatter data to obtain shape invariant seafloor indicate distinct grey levels for mound, buried mound, and various channel seafloors (four distinct types of seafloors) within the backscatter dynamic range of 12 dB. The backscatter levels are the highest for the mound areas followed by the buried mounds, channel seafloor, and inter-channel areas. Present study was further substantiated by employing a semi-empirical method to determine the shape aspects of the area backscatter strengths. Estimated three parameters like: predicted 20 degree angular backscatter response, slope and coefficient of variations of the angular backscatter responses are computed to understand general seafloor characteristics of the varying area seafloor. The use of Helmholtz-Kirchhoff's angular backscatter theory which is a functional of the power law are carried out to estimate sea water floor interface roughness parameters. The sediment volume inhomogeneity parameters are also determined by use of curve fitting to the overlaying interface

  5. Tobi sidescan sonar mapping of carbonate mound provinces and channel heads in the Porcupine Seabight, W of Ireland

    Huvenne, V.; van Rooij, D.; Wheeler, A.; de Haas, H.; Henriet, J. P.


    A large-scale sidescan sonar survey, using the 30 kHz TOBI system of the SOC, was carried out in summer 2002 over the carbonate mound provinces of the Porcupine Seabight and Rockall Trough, W of Ireland (EASSS III contract HPRI-CT-1999-00047, survey partly on behalf of the Porcupine Studies Group). The survey in the Porcupine Seabight focused on the Hovland-Magellan province in the north and the Belgica province on the eastern flank of the basin. Furthermore a reconnaissance track was added over the canyon heads of the Gollum Channel System further south in the Seabight. Each area has different characteristics. The Hovland-Magellan province shows a very homogeneous backscatter in the sidescan mosaics, indicating a quiet depositional environment. Mounds appear as sharp features with a strong backscatter and an acoustic shadow. Some Hovland mounds form multiple, ridge-like structures of more than a km in length. The Magellan mounds are nearly all buried, but leave subtle topographic effects at the seafloor. The Belgica mound province is characterised by much less homogeneous backscatter and a steeper seafloor slope. The mounds are placed en echelon along the slope and are bound to the W by a blind channel. Smaller down-slope channels are also found between the mounds. Many small, high-backscatter features, interpreted as incipient ('Moira') mounds have been found in this province. Striations in the blind channel, and higher up on the slope of the Belgica province indicate the influence of high current speeds. Pockmarks have been found just south of the Belgica province. The Gollum Channels are steep-flanked, U- or V-shaped channels of ca. 200 m deep. Their steep walls are cut by gullies and feeder channels, and evidence of slope failures is present. Lineations and high-backscatter patches are found on some of the channel floors.

  6. CO₂ laser welding of corneal cuts with albumin solder using radiometric temperature control.

    Strassmann, Eyal; Livny, Eitan; Loya, Nino; Kariv, Noam; Ravid, Avi; Katzir, Abraham; Gaton, Dan D


    To examine the efficacy and reproducibility of CO₂ laser soldering of corneal cuts using real-time infrared fiber-optic radiometric control of tissue temperature in bovine eyes (in vitro) and to evaluate the duration of this procedure in rabbit eyes (in vivo). In vitro experiment: a 6-mm central perforating cut was induced in 40 fresh bovine eyes and sealed with a CO₂ laser, with or without albumin soldering, following placement of a single approximating nylon suture. A fiber-optic radiometric temperature control system for the CO₂ laser was used. Leaking pressure and histological findings were analyzed and compared between groups. In vivo experiment: following creation of a central perforation, 6 rabbit eyes were treated with a CO₂ laser with albumin solder and 6 rabbit eyes were treated with 10-0 nylon sutures. The amount of time needed for completion of the procedures was compared. In vitro experiment: effective sealing was achieved by CO₂ laser soldering. Mean (± SD) leaking pressure was 109 ± 30 mm Hg in the bovine corneas treated by the laser with albumin solder compared to 51 ± 7 mm Hg in the sutured control eyes (n = 10 each; p laser without albumin solder (48 ± 12 mm Hg) and in the cuts sealed only with albumin without laser welding (6.3 ± 4 mm Hg) than in the cuts treated with laser welding and albumin solder. In vivo experiment: mean surgical time was 140 ± 17 s in the laser-treated rabbits compared to 330 ± 30 s in the sutured controls (n = 6; p laser soldering revealed sealed corneal edges with a small gap bridged by coagulated albumin. The inflammatory reaction was minimal in contrast to the sutured controls. No thermal damage was detected at the wound edges. CO₂ laser soldering combined with the fiber-optic radiometer is an effective, reliable, and rapid tool for the closure of corneal wounds, and holds advantages over conventional suturing in terms of leaking pressure and surgical time. Copyright © 2013 S. Karger AG, Basel.

  7. Mechanical Shock Behavior of Environmentally-Benign Lead-free Solders

    Yazzie, Kyle

    The mechanical behavior of Pb-free solder alloys is important, since they must maintain mechanical integrity under thermomechanical fatigue, creep, and mechanical shock conditions. Mechanical shock, in particular, has become an increasing concern in the electronics industry, since electronic packages can be subjected to mechanical shock by mishandling during manufacture or by accidental dropping. In this study, the mechanical shock behavior of Sn and Sn-Ag-Cu alloys was systematically analyzed over the strain rate range 10-3 -- 30 s-1 in bulk samples, and over 10-3 -- 12 s-1 on the single solder joint level. More importantly, the influences of solder microstructure and intermetallic compounds (IMC) on mechanical shock resistance were quantified. A thorough microstructural characterization of Sn-rich alloys was conducted using synchrotron x-ray computed tomography. The three-dimensional morphology and distribution of contiguous phases and precipitates was analyzed. A multiscale approach was utilized to characterize Sn-rich phases on the microscale with x-ray tomography and focused ion beam tomography to characterize nanoscale precipitates. A high strain rate servohydraulic test system was developed in conjunction with a modified tensile specimen geometry and a high speed camera for quantifying deformation. The effect of microstructure and applied strain rate on the local strain and strain rate distributions were quantified using digital image correlation. Necking behavior was analyzed using a novel mirror fixture, and the triaxial stresses associated with necking were corrected using a self-consistent method to obtain the true stress-true strain constitutive behavior. Fracture mechanisms were quantified as a function of strain rate. Finally, the relationship between solder microstructure and intermetallic compound layer thickness with the mechanical shock resistance of Sn-3.8Ag-0.7Cu solder joints was characterized. It was found that at low strain rates the dynamic

  8. Experimental Study on Friction Coefficient Between Concrete and the Top Surface of Rubble Mound Foundation

    LI Yan-bao; JIANG Xue-lian; GUO Hong-yi


    Experimental studies on the friction coefficient between concrete and the top surface of a rubble mound foundation in China are reviewed. Through comparison of different test results, the development of this research is comprehensively analyzed. An experiment is carried out in the condition similar to prototype. The process curve of friction coefficient with the test block sliding is analyzed and a standard for determination of the friction coefficient is defined. The variation features of the friction coefficient are analyzed on the basis of the present experimental results and other studies in China. It is shown that the friction coefficient between concrete and the top surface of a rubble mound foundation decreases with the increase of the foundation pressure, and the friction coefficient for a very fine leveling bed is smaller than that for a fine leveling bed.

  9. Sources of Sulfate Found in Mounds and Lakes at the Lewis Cliffs Ice Tongue, Transantarctic

    Socki, Richard; Sun, Tao; Harvey, Ralph P.; Bish, David L.; Tonui, Eric; Bao, Huiming; Niles, Paul B.


    Massive but highly localized Na-sulfate mounds (mirabilite, Na2SO4.10H2O) have been found at the terminal moraine of the Lewis Cliffs Ice Tongue (LCIT), Antarctica. (Sigma)34S and (Sigma)18O values of LCIT mirabilite range from +48.8 to +49.3% (CDT), and -16.6 to -17.1% (V-SMOW), respectively, while (Delta)17O average -0.37% (V-SMOW). LCIT mirabilite mounds are isotopically different from other mirabilite mounds found in coastal regions of Antarctica, which have isotope values close to seawater compositions. (Sigma)18O and (Delta)17O values suggest the incorporation of isotopically light glacial water. Data point to initial sulfate formation in an anoxic water body, either as a stratified anoxic deep lake on the surface, a sub-glacial water reservoir, or a sub-glacial lake. Several surface lakes of varying size are also present within this region of the LCIT, and in some cases are adjacent to the mirabilite mounds. O and D isotope compositions of surface lakes confirm they are derived from a mixture of glacial ice and snow that underwent moderate evaporation. (Sigma)18O and (Sigma)D (V-SMOW) values of snow, ice, and lake water range from -64.2 to -29.7%, and -456.0 to -231.7%, respectively. However, the isotope chemistry of these surface lakes is extremely different from the mounds. Dissolved SO4-2 (Sigma)34S and (Sigma)18O values range from +12.0 to +20.0% and -12.8 to -22.2% (the most negative (Sigma)18O of terrestrial sulfate ever reported), respectively, with sulfate (Delta)17O ranging from +0.93 to 2.24%. Ion chromatography data show that lake water is fresh to brackish in origin, with TDS less than 1500 ppm, and sulfate concentration less than 431 ppm. Isotope and chemical data suggest that these lakes are unlikely the source of the mirabilite mounds. We suggest that lake water sulfate is potentially composed of a mixture of atmospheric sulfate and minor components of sulfate of weathering origin, much like the sulfate in the polar plateau soils of the Mc

  10. Cold-water coral growth and mound formation on the Pen Duick Escarpment, Gulf of Cadiz

    Mienis, Furu; de Stigter, Henko C.; de Haas, Henk; Groot, Diane; Frank, Norbert; van Weering, Tjeerd C. E.


    Abundant skeletal remains of cold-water corals in sediments around the Pen Duick Escarpment, southern Gulf of Cadiz, suggest that corals thrived in the area in a relatively recent past. Cold-water coral carbonate mounds with heights of up to 60 m are found at about 550 m water depth on the edge of an elevation delimited by the Pen Duick Escarpment. Coral debris is abundantly present in the sediment on the carbonate mounds as well as on the escarpment, with Lophelia pertusa and Madrepora oculata as most common species. However, living coral is rare, and a mud drape of a few cm to tens of cm thick is usually found covering the coral-bearing sediment. On and off mound sediment cores are presently investigated in detail to determine the timing of the decline of cold-water coral communities on the Pen Duick Escarpment. Planktonic foraminifera oxygen isotope stratigraphy and U/Th datings of coral debris from the on mound core show that the main framework building cold-water corals Lophelia pertusa and Madrepora oculata were present on the mound during glacial periods (Marine Isotope Stage 2, 6 and 8) and the early Holocene, but absent during the late Holocene. During glacial periods a dense framework of cold-water corals existed and sedimentation rates were high. Both on and off mound cores show low magnetic susceptibility values until marine isotope stage 3, after which values are increasing. A large hiatus is found between 36 and 141 kyr. Our finding that cold-water corals on Pen Duick escarpment occurred mostly during glacial times contrasts with that of cold-water corals on the Rockall Trough margins and in the Porcupine Seabight, where they seem to have mainly lived during interglacials. The reason for the late Holocene decline of cold-water corals on Pen Duick escarpment is still a matter of speculation. Observations made with CTD and long-term deployment of benthic landers indicate activity of internal waves in the area with semi-diurnal periodicity, inducing

  11. Methane fluxes from the mound-building termite species of North Australian savannas

    Jamali, H.; Livesely, S. J.; Arndt, S. K.; Dawes-Gromadzki, T.; Cook, G. D.; Hutley, L.


    Termites are estimated to contribute 3-19% to the global methane emissions. These estimates have large uncertainties because of the limited number of field-based studies and species studied, as well as issues of diel and seasonal variation. We measured methane fluxes from four common mound-building termite species (Microcerotermes nervosus, n=26; M. serratus, n=4; Tumulitermes pastinator, n=5; and Amitermes darwini, n=4) in tropical savannas near Darwin in the Northern Territory, Australia. Methane fluxes from replicated termite mounds were measured in the field using manual chambers with fluxes reported on a mound volume basis. Methane flux was measured in both wet and dry seasons and diel variation was investigated by measuring methane flux every 4 hours over a 24 hour period. Mound temperature was measured concurrently with flux to examine this relationship. In addition, five M. nervosus mounds removed from the field and incubated under controlled temperature conditions over a 24 hour period to remove the effect of varying temperature. During the observation campaigns, mean monthly minimum and maximum temperatures for February (wet season) were 24.7 and 30.8°C, respectively, and were 20.1 to 31.4 °C in June (dry season). Annual rainfall in 2008 for Darwin was 1970.1 mm, with a maximum of 670 mm falling in February and no rain in May and June. Methane fluxes were greatest in the wet season for all species, ranging from 265.1±101.1 (T. pastinator) to 2256.6±757.1 (M. serratus) µg CH4-C/m3/h. In the dry season, methane fluxes were at their lowest, ranging from 10.0±5.5 (T. pastinator) to 338.0±165.9 (M. serratus) µg CH4-C/m3/h. On a diel basis, methane fluxes were smallest at the coolest time of the day (~0700 hrs) and greatest at the warmest (~1400 hrs) for all species, and for both wet and dry seasons. Typical diel variation in flux from M. serratus dominated mounds ranged from 902.6±261.9 to 1392.1±408.1 µg CH4-C/m3/h in wet season and 99.6±57.4 to

  12. Island-dynamics model for mound formation: effect of a step-edge barrier.

    Papac, Joe; Margetis, Dionisios; Gibou, Frederic; Ratsch, Christian


    We formulate and implement a generalized island-dynamics model of epitaxial growth based on the level-set technique to include the effect of an additional energy barrier for the attachment and detachment of atoms at step edges. For this purpose, we invoke a mixed, Robin-type, boundary condition for the flux of adsorbed atoms (adatoms) at each step edge. In addition, we provide an analytic expression for the requisite equilibrium adatom concentration at the island boundary. The only inputs are atomistic kinetic rates. We present a numerical scheme for solving the adatom diffusion equation with such a mixed boundary condition. Our simulation results demonstrate that mounds form when the step-edge barrier is included, and that these mounds steepen as the step-edge barrier increases.

  13. Association among active seafloor deformation, mound formation, and gas hydrate growth and accumulation within the seafloor of the Santa Monica Basin, offshore California

    Paull, C.K.; Normark, W.R.; Ussler, W.; Caress, D.W.; Keaten, R.


    Seafloor blister-like mounds, methane migration and gas hydrate formation were investigated through detailed seafloor surveys in Santa Monica Basin, offshore of Los Angeles, California. Two distinct deep-water (??? 800??m water depth) topographic mounds were surveyed using an autonomous underwater vehicle (carrying a multibeam sonar and a chirp sub-bottom profiler) and one of these was explored with the remotely operated vehicle Tiburon. The mounds are > 10??m high and > 100??m wide dome-shaped bathymetric features. These mounds protrude from crests of broad anticlines (~ 20??m high and 1 to 3??km long) formed within latest Quaternary-aged seafloor sediment associated with compression between lateral offsets in regional faults. No allochthonous sediments were observed on the mounds, except slumped material off the steep slopes of the mounds. Continuous streams of methane gas bubbles emanate from the crest of the northeastern mound, and extensive methane-derived authigenic carbonate pavements and chemosynthetic communities mantle the mound surface. The large local vertical displacements needed to produce these mounds suggests a corresponding net mass accumulation has occurred within the immediate subsurface. Formation and accumulation of pure gas hydrate lenses in the subsurface is proposed as a mechanism to blister the seafloor and form these mounds. ?? 2008 Elsevier B.V. All rights reserved.

  14. Fundamentals of lead-free solder interconnect technology from microstructures to reliability

    Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao


    This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

  15. The influence of heat treatment on properties of lead-free solders

    Lýdia Trnková Rízeková


    Full Text Available The article is focused on the analysis of degradation of properties of two eutectic lead-free solders SnCu0.7 and SnAg3.5Cu0.7. The microstructures of the intermetallic compound (IMC layers at the copper substrate - solder interface were examined before and after heat treatment at 150°C for 50, 200, 500 and 1000 hours. The thickness of IMC layers of the Cu6Sn5 phase was growing with the increasing time of annealing and shown the typical scallops. For the heat treatment times of 200 hours and longer, the Cu3Sn IMC layers located near the Cu substrate were also observed. The experiments showed there is a link between the thickness of IMC layers and decrease of the shear strength of solder joints. In general, the joints made of the ternary solder showed higher shear strength before and after heat treatment in comparison to joints from solder SnCu0.7.

  16. Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders

    Kim, Seongjun; Kim, Keun-Soo; Kim, Sun-Sik; Suganuma, Katsuaki


    Interfacial reaction and die attach properties of Zn- xSn ( x = 20 wt.%, 30 wt.%, and 40 wt.%) solders on an aluminum nitride-direct bonded copper substrate were investigated. At the interface with Si die coated with Au/TiN thin layers, the TiN layer did not react with the solder and worked as a good protective layer. At the interface with Cu, CuZn5, and Cu5Zn8 IMC layers were formed, the thicknesses of which can be controlled by joining conditions such as peak temperature and holding time. During multiple reflow treatments at 260°C, the die attach structure was quite stable. The shear strength of the Cu/solder/Cu joint with Zn-Sn solder was about 30 MPa to 34 MPa, which was higher than that of Pb-5Sn solder (26 MPa). The thermal conductivity of Zn-Sn alloys of 100 W/m K to 106 W/m K was sufficiently high and superior to those of Au-20Sn (59 W/m K) and Pb-5Sn (35 W/m K).

  17. Application of robust color composite fringe in flip-chip solder bump 3-D measurement

    Kuo, Chung-Feng Jeffrey; Wu, Han-Cheng


    This study developed a 3-D measurement system based on flip-chip solder bump, used fringes with different modulation intensities in color channels, in order to produce color composite fringe with robustness, and proposed a multi-channel composite phase unwrapping algorithm, which uses fringe modulation weights of different channels to recombine the phase information for better measurement accuracy and stability. The experimental results showed that the average measurement accuracy is 0.43μm and the standard deviation is 1.38 μm. The results thus proved that the proposed 3-D measurement system is effective in measuring a plane with a height of 50 μm. In the flip-chip solder bump measuring experiment, different fringe modulation configurations were tested to overcome the problem of reflective coefficient between the flip-chip base board and the solder bump. The proposed system has a good measurement results and robust stability in the solder bump measurement, and can be used for the measurement of 3-D information for micron flip-chip solder bump application.

  18. Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints

    Kim, Kyoung-Ho; Koike, Junichi; Yoon, Jeong-Won; Yoo, Sehoon


    The wetting behavior, interfacial reactions, and mechanical reliability of Sn-Ag-Cu solder on a plasma-coated printed circuit board (PCB) substrate were evaluated under multiple heat-treatments. Conventional organic solderability preservative (OSP) finished PCBs were used as a reference. The plasma process created a dense and highly cross-linked polymer coating on the Cu substrates. The plasma finished samples had higher wetting forces and shorter zero-cross times than those with OSP surface finish. The OSP sample was degraded after sequential multiple heat treatments and reflow processes, whereas the solderability of the plasma finished sample was retained after multiple heat treatments. After the soldering process, similar microstructures were observed at the interfaces of the two solder joints, where the development of intermetallic compounds was observed. From ball shear tests, it was found that the shear force for the plasma substrate was consistently higher than that for the OSP substrate. Deterioration of the OSP surface finish was observed after multiple heat treatments. Overall, the plasma surface finish was superior to the conventional OSP finish with respect to wettability and joint reliability, indicating that it is a suitable material for the fabrication of complex electronic devices.

  19. Electrical Resistance of the Solder Connections for the Consolidation of the LHC Main Interconnection Splices

    Lutum, R; Scheuerlein, C


    For the consolidation of the LHC 13 kA main interconnection splices, shunts will be soldered onto each of the 10170 splices. The solder alloy selected for this purpose is Sn60Pb40. In this context the electrical resistance of shunt to busbar lap splices has been measured in the temperature range from RT to 20 K. A cryocooler set-up has been adapted such that a test current of 150 A could be injected for accurate resistance measurements in the low nΩ range. To study the influence of the solder bulk resistivity on the overall splice resistance, connections produced with Sn96Ag4 and Sn77.2In20Ag2.8 have been studied as well. The influence of the Sn60Pb40 solder resistance is negligible when measuring the splice resistance in a longitudinal configuration over a length of 6 cm. In a transverse measurement configuration the splice resistance is significantly influenced by the solder. The connections prepared with Sn77.2In20Ag2.8 show significantly higher resistance values, as expected from the relatively high sol...

  20. In situ X-ray observation and simulation of ratcheting-fatigue interactions in solder joints

    Shi, Liting; Mei, Yunhui; Chen, Gang; Chen, Xu


    Reflow voids created by solder oxidation reduce the reliability of lap joints. In situ visualization of reflow voids in Sn-3Ag-0.5Cu (SAC305) lap-shear solder joints under cyclic stressing was realized by X-ray computed tomography (CT), while the ratcheting deformation of the solder joints was monitored by a non-contact displacement detecting system (NDDS). The results revealed that the shape evolution of reflow voids in solder joints, as characterized by the sphericity of the voids, can be divided into three stages: i.e., the initial stage with a sharp drop, a stable stage, and a rapidly declining stage. A new evolution law for describing the progress of sphericity was proposed, and was further introduced into a viscoplastic constitutive model based on the OW-AF nonlinear kinematic hardening rule. The damage-coupled OW-AF model yielded an accurate estimation of the whole-life ratcheting behavior of Sn-3Ag-0.5Cu (SAC305) lap-shear solder joints. [Figure not available: see fulltext.

  1. Improvement of the auto wire feeder machine in a de-soldering process

    Niramon Nonkhukhetkhong


    Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

  2. The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance

    Lee, Tae-Kyu; Zhou, Bite; Bieler, Thomas R.; Tseng, Chien-Fu; Duh, Jeng-Gong


    The mechanical stability of solder joints with Pd added to Sn-Ag-Cu alloy with different aging conditions was investigated in a high- G level shock environment. A test vehicle with three different strain and shock level conditions in one board was used to identify the joint stability and failure modes. The results revealed that Pd provided stability at the package-side interface with an overall shock performance improvement of over 65% compared with the Sn-Ag-Cu alloy without Pd. A dependency on the pad structure was also identified. However, the strengthening mechanism was only observed in the non-solder mask defined (NSMD) pad design, whereas the solder mask defined (SMD) pad design boards showed no improvement in shock performance with Pd-added solders. The effects of Sn grain orientation on shock performance, interconnect stability, and crack propagation path with and without Pd are discussed. The SAC305 + Pd solder joints showed more grain refinements, recrystallization, and especially mechanical twin deformation during the shock test, which provides a partial explanation for the ability of SAC305 + Pd to absorb more shock-induced energy through active deformation compared with SAC305.

  3. Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition

    Kang, Sung K.; Leonard, Donovan; Shih, Da-Yuan; Gignac, Lynne; Henderson, D. W.; Cho, Sungil; Yu, Jin


    The near-ternary eutectic Sn-Ag-Cu alloys have been identified as leading Pb-free solder candidates to replace Pb-bearing solders in microelectronic applications. However, recent investigations on the processing behavior and solder joints reliability assessment have revealed several potential reliability risk factors associated with the alloy system. The formation of large Ag3Sn plates in Sn-Ag-Cu joints, especially when solidified in a relatively slow cooling rate, is one issue of concern. The implications of large Ag3Sn plates on solder joint performance and several methods to control them have been discussed in previous studies. The minor Zn addition was found to be effective in reducing the amount of undercooling required for tin solidification and thereby to suppress the formation of large Ag3Sn plates. The Zn addition also caused the changes in the bulk microstructure as well as the interfacial reaction. In this paper, an in-depth characterization of the interfacial reaction of Zn-added Sn-Ag-Cu solders on Cu and Au/Ni(P) surface finishes is reported. The effects of a Zn addition on modification of the interfacial IMCs and their growth kinetics are also discussed.

  4. Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates

    Leinenbach, C.; Valenza, F.; Giuranno, D.; Elsener, H. R.; Jin, S.; Novakovic, R.


    Au-Ge-based alloys are interesting as novel high-temperature lead-free solders because of their low melting point, good thermal and electrical conductivity, and high corrosion resistance. In the present work, the wetting and soldering behavior of the eutectic Au-28Ge (at.%) alloy on Cu and Ni substrates have been investigated. Good wetting on both substrates with final contact angles of 13° to 14° was observed. In addition, solder joints with bond shear strength of 30 MPa to 35 MPa could be produced under controlled conditions. Cu substrates exhibit pronounced dissolution into the Au-Ge filler metal. On Ni substrates, the NiGe intermetallic compound was formed at the filler/substrate interface, which prevents dissolution of Ni into the solder. Using thin filler metal foils (25 μm), complete consumption of Ge in the reaction at the Ni interface was observed, leading to the formation of an almost pure Au layer in the soldering zone.

  5. Metal ion release from silver soldering and laser welding caused by different types of mouthwash.

    Erdogan, Ayse Tuygun; Nalbantgil, Didem; Ulkur, Feyza; Sahin, Fikrettin


    To compare metal ion release from samples welded with silver soldering and laser welding when immersed into mouthwashes with different ingredients. A total of 72 samples were prepared: 36 laser welded and 36 silver soldered. Four samples were chosen from each subgroup to study the morphologic changes on their surfaces via scanning electron microscopy (SEM). Each group was further divided into four groups where the samples were submerged into mouthwash containing sodium fluoride (NaF), mouthwash containing sodium fluoride + alcohol (NaF + alcohol), mouthwash containing chlorhexidine (CHX), or artificial saliva (AS) for 24 hours and removed thereafter. Subsequently, the metal ion release from the samples was measured with inductively coupled plasma mass spectrometry (ICP-MS). The metal ion release among the solutions and the welding methods were compared. The Kruskal-Wallis and analysis of variance (ANOVA) tests were used for the group comparisons, and post hoc Dunn multiple comparison test was utilized for the two group comparisons. The level of metal ion release from samples of silver soldering was higher than from samples of laser welding. Furthermore, greater amounts of nickel, chrome, and iron were released from silver soldering. With regard to the mouthwash solutions, the lowest amounts of metal ions were released in CHX, and the highest amounts of metal ions were released in NaF + alcohol. SEM images were in accord with these findings. The laser welding should be preferred over silver soldering. CHX can be recommended for patients who have welded appliances for orthodontic reasons.

  6. Macrofauna community inside and outside of the Darwin Mounds SAC, NE Atlantic

    N. Serpetti


    Full Text Available Over the past two decades, growing concerns have been raised regarding the effects of towed fishing gears, such as trawls and dredges, on deep-sea biodiversity and ecosystem functioning. Trawling disturbs the benthic communities both physically and biologically, and can eliminate the most vulnerable organisms and modify habitat structure; chronically disturbed communities are often dominated by opportunistic species. The European Union is under obligation to designate a network of offshore Special Areas of Conservation (SACs and Marine Protected Areas (MPAs by the end of 2012 based on the perceived expectation that these networks will help protect marine biodiversity and that within these areas, faunal abundance and diversity will be higher than the surrounding fished areas.

    The Darwin Mounds, only discovered in 1998, are located in the Rockall Trough, NE Atlantic at a depth of ~ 1000 m. Deep-water trawling regularly took place in the region of the Darwin Mounds; however in 2004 the mounds were designated as the first offshore SAC in UK and the area is now closed to bottom trawling. As part of the HERMIONE programme the influence of human impact on the Oceans was one of the key themes and in June 2011, an investigation of the macrofaunal community structure at comparable sites both inside and outside of the Darwin Mound SAC was undertaken. Macrofaunal communities were found to differ significantly, with the difference mostly driven by changes in the abundance of polychaetes, crustaceans and nematodes whilst no significant differences were seen for the other phyla. Whereas overall macrofaunal abundance was higher outside the SAC compared to within, this pattern varies considerably between phyla. Diversity indices showed no significant differences between protected and unprotected sites. This could indicate that a few years of preservation are not enough time to determine a recovery by the macrofaunal community of cold-water ecosystems

  7. Parameters Influencing Wave Run-Up on a Rubble Mound Breakwater

    Walle, Björn Van de; Rouck, Julien De; Damme, Luc Van


    Full scale wave run-up measurements have been performed on the Zebrugge rubble mound breakwater. Wave run-up also has been investigated on various small scale models of the Zeebrugge breakwater. A significant difference between the results has been noticed. Additional small scale model testing ha...... of the wave run-up step gauge with respect to the armour unit pattern and the water level....

  8. Stable isotope sales: Mound Laboratory customer and shipment summaries, FY 1976 and FY 1976A

    Ruwe, A.H. Jr. (comp.)


    A listing is given of Mound Laboratory's sales of stable isotopes of noble gases, carbon, oxygen, nitrogen, chlorine, and sulfur for fiscal years 1976 and 1976A (the period July 1, 1975 through September 30, 1976). Purchasers are listed alphabetically and are divided into domestic and foreign groups. A cross-reference index by location is included for domestic customers. Cross-reference listings by isotope purchased are included for all customers.

  9. Effects of Erosion from Mounds of Different Termite Genera on Distinct Functional Grassland Types in an African Savannah.

    Gosling, Cleo M; Cromsigt, Joris P G M; Mpanza, Nokukhanya; Olff, Han

    A key aspect of savannah vegetation heterogeneity is mosaics formed by two functional grassland types, bunch grasslands, and grazing lawns. We investigated the role of termites, important ecosystem engineers, in creating high-nutrient patches in the form of grazing lawns. Some of the ways termites can contribute to grazing lawn development is through erosion of soil from aboveground mounds to the surrounding soil surface. This may alter the nutrient status of the surrounding soils. We hypothesize that the importance of this erosion varies with termite genera, depending on feeding strategy and mound type. To test this, we simulated erosion by applying mound soil from three termite genera (Macrotermes, Odontotermes, and Trinervitermes) in both a field experiment and a greenhouse experiment. In the greenhouse experiment, we found soils with the highest macro nutrient levels (formed by Trinervitermes) promoted the quality and biomass of both a lawn (Digitaria longiflora) and a bunch (Sporobolus pyramidalis) grass species. In the field we found that soils with the highest micro nutrient levels (formed by Macrotermes) showed the largest increase in cover of grazing lawn species. By linking the different nutrient availability of the mounds to the development of different grassland states, we conclude that the presence of termite mounds influences grassland mosaics, but that the type of mound plays a crucial role in determining the nature of the effects.

  10. Organic matter quality and supply to deep-water coral/mound systems of the NW European Continental Margin

    Kiriakoulakis, K.; Freiwald, A.; Fisher, E.; Wolff, G. A.


    Comparison of five deep-water coral (DWC)/mound ecosystems along the European Continental Margin shows that suspended particulate organic matter (sPOM), a potential food source, is lipid rich and of high quality. However, there are differences between the sites. The Darwin and Pelagia Mounds (N. Rockall Trough and N. Porcupine Bank, respectively) have higher proportions of labile particulate lipids (including high proportions of polyunsaturated fatty acids) in the benthic boundary layer than Logachev, Hovland and Belgica Mounds (Rockall Bank, S. Porcupine Bank and Porcupine Seabight, respectively). The high quality sPOM could be transported downslope from the euphotic zone. There is some evidence for inter-annual variability at some sites (e.g. Hovland and Logachev Mounds) as large differences in suspended lipid and particulate organic carbon concentrations were observed over the sampling period. Elevated total organic carbon contents of sediments at mound sites, relative to control sites in some cases (particularly Darwin Mounds), probably reflect local hydrodynamic control and the trapping of sPOM by the DWC. Fresh POM can be relatively rapidly transferred to significant depth (up to 8 cm) through bioturbation that is evident at all sites. There is no clear evidence of present day hydrocarbon seepage at any of the sites.

  11. Do epigeal termite mounds increase the diversity of plant habitats in a tropical rain forest in peninsular Malaysia?

    Beaudrot, Lydia; Du, Yanjun; Rahman Kassim, Abdul; Rejmánek, Marcel; Harrison, Rhett D


    The extent to which environmental heterogeneity can account for tree species coexistence in diverse ecosystems, such as tropical rainforests, is hotly debated, although the importance of spatial variability in contributing to species co-existence is well recognized. Termites contribute to the micro-topographical and nutrient spatial heterogeneity of tropical forests. We therefore investigated whether epigeal termite mounds could contribute to the coexistence of plant species within a 50 ha plot at Pasoh Forest Reserve, Malaysia. Overall, stem density was significantly higher on mounds than in their immediate surroundings, but tree species diversity was significantly lower. Canonical correspondence analysis showed that location on or off mounds significantly influenced species distribution when stems were characterized by basal area. Like studies of termite mounds in other ecosystems, our results suggest that epigeal termite mounds provide a specific microhabitat for the enhanced growth and survival of certain species in these species-rich tropical forests. However, the extent to which epigeal termite mounds facilitate species coexistence warrants further investigation.

  12. Effects of Ni-coated Carbon Nanotubes addition on the electromigration of Sn–Ag–Cu solder joints

    Yang, Zhongbao; Zhou, Wei; Wu, Ping, E-mail:


    Highlights: •The electromigration behaviors of the composite solder joints were investigated. •The presence of Ni altered the morphology of the IMC layer after reflow. •Carbon nanotube network was observed in solder matrix. •Current crowding occurred at the carbon nanotube networks. •The electromigration effect of composite solder joint was suppressed effectively. -- Abstract: The electromigration behaviors of line-type Cu/Sn–Ag–Cu/Cu interconnects with and without Ni-Coated multi-walled Carbon Nanotubes addition were investigated in this work. After soldering, the (Cu,Ni){sub 6}Sn{sub 5} intermetallic compounds formed at the solder/Cu interface. The electromigration analysis shows that the presence of Carbon Nanotubes can suppress the atomic diffusion in the solder induced by electromigration effectively. And finite element simulation indicates that the Carbon Nanotube networks can reduce the current density in the solder matrix, which results in the improvement of electromigration resistance of composite solders.

  13. Development of aluminum, manganese, and zinc-doped tin-silver-copper-X solders for electronic assembly

    Boesenberg, Adam James

    The global electronic assembly community is striving for a robust replacement for leaded solders due to increased environmental regulations. A family of Pb-free solder alloys based on Sn-Ag-Cu (SAC) compositions has shown promise; but reliability issues in certain assembly and operating environments have arisen. Elemental (X) additions (Al, Mn, Zn) to SAC3595 were developed recently for better control of heterogeneous nucleation in solder joint solidification. Cu substrate solderability of these SAC+X alloys was investigated at concentrations between 0.01-0.25 wt. % using globule wetting balance tests due to concern about increased oxidation during reflow. Asymmetric four point bend (AFPB) tests were conducted on as-soldered and thermally aged specimens to investigate correlation between decreased shear strength and extended aging time; a common phenomenon seen in solder joints in service. Composition dependence of these X additions also was explored in simplified Cu joints by differential scanning calorimetry (DSC) and joint microstructure analysis to determine the coupling between undercooling and solidification morphology on single and multiple reflow cycles. Interesting observations by methods such as x-ray diffraction (XRD) and nano-indentation of SAC solder joints with aluminum elemental additions led to promising results and provided a possible solution to promoting heterogeneous nucleation and high reliability in these solder alloys.

  14. Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies

    Vianco, P.; Rejent, J. [Sandia National Labs., Albuquerque, NM (United States); Artaki, I.; Ray, U.; Finley, D.; Jackson, A. [AT and T Bell Labs., Princeton, NJ (United States)


    Enhanced performance goals and environmental restrictions have heightened the consideration for use of alternative solders as replacements for the traditional tin-lead (Sn-Pb) eutectic and near-eutectic alloys. However, the implementation of non-Pb bearing surface finishes may lag behind solder alloy development. A study was performed which examined the effect(s) of Pb contamination on the performance of Sn-Ag-Bi and Sn-Ag-Cu-Sb lead-free solders by the controlled addition of 63Sn-37Pb solder at levels of 0.5 {minus} 8.0 wt.%. Thermal analysis and ring-in-plug shear strength studies were conducted on bulk solder properties. Circuit board prototype studies centered on the performance of 20I/O SOIC gull wing joints. Both alloys exhibited declines in their melting temperatures with greater Sn-Pb additions. The ring-in-plug shear strength of the Sn-Ag-Cu-Sb solder increased slightly with Sn-Pb levels while the Sn-Ag-Bi alloy experienced a strength loss. The mechanical behavior of the SOIC (Small Outline Integrated Circuit) Sn-Ag-Bi solder joints reproduced the strength levels were insensitive to 10,106 thermal cycles. The Sn-Ag-Cu-Sb solder showed a slight decrease in the gull wing joint strengths that was sensitive to the Pb content of the surface finish.

  15. Modeling Material Properties of Lead-Free Solder Alloys

    Guo, Zhanli; Saunders, Nigel; Miodownik, Peter; Schillé, Jean-Philippe


    A full set of physical and thermophysical properties for lead-free solder (LFS) alloys have been calculated, including liquidus/solidus temperatures, fraction solid, density, coefficient of thermal expansion, thermal conductivity, Young’s modulus, viscosity, and liquid surface tension, all as a function of composition and temperature (extending into the liquid state). The results have been extensively validated against data available in the literature. A detailed comparison of the properties of two LFS alloys Sn-20In-2.8Ag and Sn-5.5Zn-4.5In-3.5Bi with Sn-37Pb has been made to show the utility and need for calculations that cover a wide range of properties, including the need to consider the effect of nonequilibrium cooling. The modeling of many of these properties follows well-established procedures previously used in JMatPro software for a range of structural alloys. This paper describes an additional procedure for the calculation of the liquid surface tension for multicomponent systems, based on the Butler equation. Future software developments are reviewed, including the addition of mechanical properties, but the present calculations can already make a useful contribution to the selection of appropriate new LFS alloys.

  16. Pre-operational safety appraisal Tritiated Scrap Recovery Facility, Mound facility

    Dauby, J.J.; Flanagan, T.M.; Metcalf, L.W.; Rhinehammer, T.B.


    The purpose of this report is to identify, assess, and document the hazards which are associated with the proposed operation of the Tritiated Scrap Recovery Facility at Mound Facility. A Pre-operational Safety Appraisal is a requirement as stated in Department of Energy Order 5481.1, Safety Analysis and Review System. The operations to be conducted in the new Tritiated Scrap Waste Recovery Facility are not new, but a continuation of a prime mission of Mound`s i.e. recovery of tritium from waste produced throughout the DOE complex. The new facility is a replacement of an existing process started in the early 1960`s and incorporates numerous design changes to enhance personnel and environmental safety. This report also documents the safety of a one time operation involving the recovery of tritium from material obtained by the Department of Energy from the State of Arizona. This project will involve the processing of 240,000 curies of tritium contained in glass ampoules that were to be used in items such as luminous dial watches. These were manufactured by the now defunct American Atomics Corporation, Tucson, Arizona.

  17. Slope Stability Estimation of the Kościuszko Mound in Cracow

    Wrana Bogumił


    Full Text Available In the paper, the slope stability problem of the Kościuszko Mound in Cracow, Poland is considered. The slope stability analysis was performed using Plaxis FEM program. The outer surface of the mound has complex geometry. The slope of the cone is not uniform in all directions, on the surface of the cone are pedestrian paths. Due to its complicated geometry it was impossible to do computing by Plaxis input pre-procesor. The initial element mesh was generated using Autodesk Autocad 3D and next it was updated by Plaxis program. The soil parameters were adopted in accordance with the detailed geological soil testing performed in 2012. Calculating model includes geogrids. The upper part was covered by MacMat geogrid, while the lower part of the Mound was reinforced using Terramesh Matt geogrid. The slope analysis was performed by successives reduction of φ /c parameters. The total multiplayer ΣMsf is used to define the value of the soil strength parameters. The article presents the results of slope stability before and after the rainfall during 33 days of precipitation in flood of 2010.

  18. Antarctic Mirabilite Mounds as Mars Analogs: The Lewis Cliffs Ice Tongue Revisited

    Socki, Richard A.; Sun, Tao; Niles, Paul B.; Harvey, Ralph P.; Bish, David L.; Tonui, Eric


    It has been proposed, based on geomorphic and geochemical arguments, that subsurface water has played an important role in the history of water on the planet Mars [1]. Subsurface water, if present, could provide a protected and long lived environment for potential life. Discovery of gullies [2] and recurring slopes [3] on Mars suggest the potential for subsurface liquid water or brines. Recent attention has also focused on small (Tongue (LCIT) [6] in the Transantarctic Mountains, Antarctica, and are potential terrestrial analogs for mounds observed on the martian surface. The following characteristics distinguish LCIT evaporite mounds from other evaporite mounds found in Antarctic coastal environments and/or the McMurdo Dry Valleys: (1) much greater distance from the open ocean (approx.500 km); (2) higher elevation (approx.2200 meters); and (3) colder average annual temperature (average annual temperature = -30 C for LCIT [7] vs. 20 C at sea level in the McMurdo region [8]. Furthermore, the recent detection of subsurface water ice (inferred as debris-covered glacial ice) by the Mars Reconnaissance Orbiter [9] supports the use of an Antarctic glacial environment, particularly with respect to the mirabilite deposits described in this work, as an ideal terrestrial analog for understanding the geochemistry associated with near-surface martian processes. S and O isotopic compositions.

  19. On the Origin of the Dragon Image on the Plate from Shilovka Burial Mound

    Liphanov Nicolay А.


    Full Text Available The author of the article analyzes an unique image of two opposed dragons engraved on a bone plate discovered in 1992 at barrow No.1 of Shilovka burial mound located on the right bank of the Volga river in Ulyanovsk Oblast (the excavations were conducted by R.S. Bagautdinov. The burial mound is related to the cattle breeding population of late 7th century. The article considers different hypotheses concerning the origin of these dragon images in the artistic traditions of various regions: China (A.V. Komar, D.G. Savinov, B. Totev, Pelevina, Central Asia (V.G. Kotov, V.E. Flyorova, India (N.A. Fonyakova. According to the author, this image has no apparent iconographic parallels in the traditions of these regions. Such analogues are found in the art of the Mediterranean where the ancient images of various mythological creatures exist alongside the image of the sea dragon “ketos” which later became part of the Christian tradition. The appearance of this monster in the images of the first half – middle of the 1st millennium A.D. is practically identical to the dragons from Shilovka burial mound. According to the author, certain impact on the formation of the considered dragon image was made by Iranian art.

  20. Bryan Mound InSAR Analysis U.S. Strategic petroleum Reserve.

    Lord, Anna C. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)


    The U.S. Strategic Petroleum Reserve (SPR) is a stockpile of emergency crude oil to be tapped into if a disruption in the nation's oil supply occurs. The SPR is comprised of four salt dome sites. Subsidence surveys have been conducted either annually or biennially at all four sites over the life of the program. Monitoring of surface behavior is a first line defense to detecting possible subsurface cavern integrity issues. Over the life of the Bryan Mound site, subsidence rates over abandoned Cavern 3 have continuously been the highest at the site. In an effort to try and understand the subsurface dynamics, specifically over Bryan Mound Cavern 3, historic interferometric synthetic aperture radar (InSAR) data was acquired and processed by TRE Altamira. InSAR involves the processing of multiple satellite synthetic aperture radar scenes acquired across the same location of the Earth's surface at different times to map surface deformation. The analysis of the data has the ability to detect millimeters of motion spanning days, months, year and decades, across specific sites. The intent in regards to the Bryan Mound site was (1) to confirm the higher subsidence rates recorded over abandoned Cavern 3 indicated by land survey and (2) understand the regional surface behavior. This report describes the InSAR analysis results, how those results compare to the historical collection of land survey data, and what additional information the data has provided towards understanding the response recorded at the surface.